Effect of Bonding Temperature on Interfacial Reaction and Mechanical Properties of Diffusion-Bonded Joint Between Ti-6Al-4V and 304 Stainless Steel Using Nickel as an Intermediate Material

NASA Astrophysics Data System (ADS)

Thirunavukarasu, Gopinath; Kundu, Sukumar; Mishra, Brajendra; Chatterjee, Subrata

2014-04-01

An investigation was carried out on the solid-state diffusion bonding between Ti-6Al-4V (TiA) and 304 stainless steel (SS) using pure nickel (Ni) of 200- μm thickness as an intermediate material prepared in vacuum in the temperature range from 973 K to 1073 K (700 °C to 800 °C) in steps of 298 K (25 °C) using uniaxial compressive pressure of 3 MPa and 60 minutes as bonding time. Scanning electron microscopy images, in backscattered electron mode, had revealed existence of layerwise Ti-Ni-based intermetallics such as either Ni3Ti or both Ni3Ti and NiTi at titanium alloy-nickel (TiA/Ni) interface, whereas nickel-stainless steel (Ni/SS) diffusion zone was free from intermetallic phases for all joints processed. Chemical composition of the reaction layers was determined in atomic percentage by energy dispersive spectroscopy and confirmed by X-ray diffraction study. Room-temperature properties of the bonded joints were characterized using microhardness evaluation and tensile testing. The maximum hardness value of ~800 HV was observed at TiA/Ni interface for the bond processed at 1073 K (800 °C). The hardness value at Ni/SS interface for all the bonds was found to be ~330 HV. Maximum tensile strength of ~206 MPa along with ~2.9 pct ductility was obtained for the joint processed at 1023 K (750 °C). It was observed from the activation study that the diffusion rate at TiA/Ni interface is lesser than that at the Ni/SS interface. From microhardness profile, fractured surfaces and fracture path, it was demonstrated that failure of the joints was initiated and propagated apparently at the TiA/Ni interface near Ni3Ti intermetallic phase.

Diffusion Bonding of Microduplex Stainless Steel and Ti Alloy with and without Interlayer: Interface Microstructure and Strength Properties

NASA Astrophysics Data System (ADS)

Kundu, S.; Sam, S.; Mishra, B.; Chatterjee, S.

2014-01-01

The interface microstructure and strength properties of solid state diffusion bonding of microduplex stainless steel (MDSS) to Ti alloy (TiA) with and without a Ni alloy (NiA) intermediate material were investigated at 1173 K (900 °C) for 0.9 to 5.4 ks in steps of 0.9 ks in vacuum. The effects of bonding time on the microstructure of the bonded joint have been analyzed by light optical microscopy and scanning electron microscopy in the backscattered mode. In the direct bonded joints of MDSS and TiA, the layer-wise σ phase and the λ + FeTi phase mixture were observed at the bond interface when the joint was processed for 2.7 ks and above holding times. However, when NiA was used as an intermediate material, the results indicated that TiNi3, TiNi, and Ti2Ni are formed at the NiA-TiA interface, and the irregular shaped particles of Fe22Mo20Ni45Ti13 have been observed within the TiNi3 intermetallic layer. The stainless steel-NiA interface is free from intermetallics and the layer of austenitic phase was observed at the stainless steel side. A maximum tensile strength of ~520 MPa, shear strength of ~405 MPa, and impact toughness of ~18 J were obtained for the directly bonded joint when processed for 2.7 ks. However, when nickel base alloy was used as an intermediate material in the same materials, the bond tensile and shear strengths increase to ~640 and ~479 MPa, respectively, and the impact toughness to ~21 J when bonding was processed for 4.5 ks. Fracture surface observations in scanning electron microscopy using energy dispersive spectroscopy demonstrate that in MDSS-TiA joints, failure takes place through the FeTi + λ phase when bonding was processed for 2.7 ks; however, failure takes place through σ phase for the diffusion joints processed for 3.6 ks and above processing times. However, in MDSS-NiA-TiA joints, the fracture takes place through NiTi2 layer at the NiA-TiA interface for all bonding times.

Modeling and experimental evaluation of the diffusion bonding of the oxide dispersion strengthened steel PM2000

NASA Astrophysics Data System (ADS)

Sittel, Wiebke; Basuki, Widodo W.; Aktaa, Jarir

2015-10-01

A modeling based optimization process of the solid state diffusion bonding is presented for joining ferritic oxide dispersion strengthened steels PM2000. An optimization study employing varying bonding temperatures and pressures results in almost the same strength and toughness of the bonded compared to the as received material. TEM investigations of diffusion bonded samples show a homogeneous distribution of oxide particles at the bonding seam similar to that in the bulk. Hence, no loss in strength or creep resistance due to oxide particle agglomeration is found, as verified by the mechanical properties observed for the joint.

Transition joints between Zircaloy-2 and stainless steel by diffusion bonding

NASA Astrophysics Data System (ADS)

Bhanumurthy, K.; Krishnan, J.; Kale, G. B.; Banerjee, S.

1994-11-01

The diffusion bonding between Zircaloy-2 and stainless steel (AISI 304L) using niobium, nickel and copper as intermediate layers has been investigated in the temperature range of 750 to 900°C. Bonding was carried out in a vacuum hot press, under compressive loading. Electron probe microanalysis and metallographic analysis showed a good metallurgical compatibility and also indicated the absence of discontunities, micropores and intermetallic compounds at various interfaces. The bond strength of the diffusion bonded assembly was found to be about 400 MPa for the couples bonded at 870°C for 2 h. The dimple structure on the fractured surface is indicative of the ductile mode of failure of the bonded assembly.

Process optimization for diffusion bonding of tungsten with EUROFER97 using a vanadium interlayer

NASA Astrophysics Data System (ADS)

Basuki, Widodo Widjaja; Aktaa, Jarir

2015-04-01

Solid-state diffusion bonding is a selected joining technology to bond divertor components consisting of tungsten and EUROFER97 for application in fusion power plants. Due to the large mismatch in their coefficient of thermal expansions, which leads to serious thermally induced residual stresses after bonding, a thin vanadium plate is introduced as an interlayer. However, the diffusion of carbon originated from EUROFER97 in the vanadium interlayer during the bonding process can form a vanadium carbide layer, which has detrimental influences on the mechanical properties of the joint. For optimal bonding results, the thickness of this layer and the residual stresses has to be decreased sufficiently without a significant reduction of material transport especially at the vanadium/tungsten interface, which can be achieved by varying the diffusion bonding temperature and duration. The investigation results show that at a sufficiently low bonding temperature of 700 °C and a bonding duration of 4 h, the joint reaches a reasonable high ductility and toughness especially at elevated test temperature of 550 °C with elongation to fracture of 20% and mean absorbed Charpy impact energy of 2 J (using miniaturized Charpy impact specimens). The strength of the bonded materials is about 332 MPa at RT and 291 MPa at 550 °C. Furthermore, a low bonding temperature of 700 °C can also help to avoid the grain coarsening and the alteration of the grain structure especially of the EUROFER97 close to the bond interface.

The Structure and Properties of Diffusion Assisted Bonded Joints in 17-4 PH, Type 347, 15-5 PH and Nitronic 40 Stainless Steels

NASA Technical Reports Server (NTRS)

Wigley, D. A.

1981-01-01

Diffusion assisted bonds are formed in 17-4 PH, 15-5 PH, type 347 and Nitronic 40 stainless steels using electrodeposited copper as the bonding agent. The bonds are analyzed by conventional metallographic, electron microprobe analysis, and scanning electron microscopic techniques as well as Charpy V-notch impact tests at temperatures of 77 and 300 K. Results are discussed in terms of a postulated model for the bonding process.

Diffusion Bonding Beryllium to Reduced Activation Ferritic Martensitic Steel: Development of Processes and Techniques

NASA Astrophysics Data System (ADS)

Hunt, Ryan Matthew

Only a few materials are suitable to act as armor layers against the thermal and particle loads produced by magnetically confined fusion. These candidates include beryllium, tungsten, and carbon fiber composites. The armor layers must be joined to the plasma facing components with high strength bonds that can withstand the thermal stresses resulting from differential thermal expansion. While specific joints have been developed for use in ITER (an experimental reactor in France), including beryllium to CuCrZr as well as tungsten to stainless steel interfaces, joints specific to commercially relevant fusion reactors are not as well established. Commercial first wall components will likely be constructed front Reduced Activation Ferritic Martensitic (RAFM) steel, which will need to be coating with one of the three candidate materials. Of the candidates, beryllium is particularly difficult to bond, because it reacts during bonding with most elements to form brittle intermetallic compounds. This brittleness is unacceptable, as it can lead to interface crack propagation and delamination of the armor layer. I have attempted to overcome the brittle behavior of beryllium bonds by developing a diffusion bonding process of beryllium to RAFM steel that achieves a higher degree of ductility. This process utilized two bonding aids to achieve a robust bond: a. copper interlayer to add ductility to the joint, and a titanium interlayer to prevent beryllium from forming unwanted Be-Cu intermetallics. In addition, I conducted a series of numerical simulations to predict the effect of these bonding aids on the residual stress in the interface. Lastly, I fabricated and characterized beryllium to ferritic steel diffusion bonds using various bonding parameters and bonding aids. Through the above research, I developed a process to diffusion bond beryllium to ferritic steel with a 150 M Pa tensile strength and 168 M Pa shear strength. This strength was achieved using a Hot Isostatic Pressing (HIP) process (at a temperature between 700 °C and 750 °C for 2 hours at 103 M Pa) with 10 mu m of titanium and 20 mum of copper deposited between substrates. Without the copper and titanium interlayers, the bond formed an intermetallic that lead to fracture from internal residual stresses. Also, slowing the rate of cooling and adding an intermediate hold temperature during cool-down significantly increased bond strength. These beneficial effects were confirmed by the numerical simulations, which showed reduced residual stress resulting from all bonding techniques. Both metals interlayers, as well as the reduced cooling rate were critical in overcoming the otherwise brittle quality of the beryllium to ferritic steel joint. However, the introduced interlayers are not an ideal solution to the problem. They introduced both Be-Ti and Cu-Ti compounds, which proved to be the eventual failure location in the bond. Further optimization of this joint is necessary, and can potentially be achieved with variation of cooling rates. To make the joint ready for implementation will require larger scale fabrication to verify reliability and to test the joint under operational loads.

The Effects of Borides on the Mechanical Properties of TLPB Repaired Inconel 738 Superalloy

NASA Astrophysics Data System (ADS)

Wei, J.; Ye, Y.; Sun, Z.; Zou, G.; Bai, H.; Wu, A.; Liu, L.

2017-10-01

The transient liquid phase diffusion bonding (TLPB) method was used to repair an artificial crack in Inconel 738, which was notched by a femtosecond laser. Mixed ratios of BNi-1a:DF-4B were investigated at the bonding temperature of 1373 K (1100 °C) for 2 to 36 hours. The effect of borides on the mechanical properties of TLPB repaired joints was studied through analysis of the microstructure, fracture path, and morphology observations. The borides formation, morphology, distribution, and joints strength were studied in detail. The results showed that the diffusion of B can either increase or decrease the joint strength, depending on its distribution and morphology. The amount of large blocky Ni-B compounds in the precipitate zone were reduced with increasing holding time, which resulted in an increase in joint strength. Nevertheless, further increasing the holding time led to a decrease in joint strength because of the formation of continuous acicular borides in the diffusion-affected zone. The fracture modes of TLPB joints were also discussed on the basis of the microstructure and fractography.

Effect of Bonding Time on Interfacial Reaction and Mechanical Properties of Diffusion-Bonded Joint Between Ti-6Al-4V and 304 Stainless Steel Using Nickel as an Intermediate Material

NASA Astrophysics Data System (ADS)

Thirunavukarasu, Gopinath; Kundu, Sukumar; Mishra, Brajendra; Chatterjee, Subrata

2014-04-01

In the current study, solid-state diffusion bonding between Ti-6Al-4V (TiA) and 304 stainless steel (SS) using pure nickel (Ni) of 200- μm thickness as an intermediate material was carried out in vacuum. Uniaxial compressive pressure and temperature were kept at 4 MPa and 1023 K (750 °C), respectively, and the bonding time was varied from 30 to 120 minutes in steps of 15 minutes. Scanning electron microscopy images, in backscattered electron mode, revealed the layerwise Ti-Ni-based intermetallics like either Ni3Ti or both Ni3Ti and NiTi at titanium alloy-nickel (TiA/Ni) interface, whereas nickel-stainless steel (Ni/SS) interface was free from intermetallic phases for all the joints. Chemical composition of the reaction layers was determined by energy dispersive spectroscopy (SEM-EDS) and confirmed by X-ray diffraction study. Maximum tensile strength of ~382 MPa along with ~3.7 pct ductility was observed for the joints processed for 60 minutes. It was found that the extent of diffusion zone at Ni/SS interface was greater than that of TiA/Ni interface. From the microhardness profile, fractured surfaces, and fracture path, it was demonstrated that the failure of the joints was initiated and propagated apparently at TiA/Ni interface near Ni3Ti intermetallic for bonding time less than 90 minutes, and through Ni for bonding time 90 minutes and greater.

Investigation on the diffusion bonding of tungsten and EUROFER97

NASA Astrophysics Data System (ADS)

Basuki, Widodo Widjaja; Aktaa, Jarir

2011-10-01

Due to its advantages, tungsten is selected as armor and structural material for use in future fusion power plants. To apply tungsten as structural material, a joint to EUROFER97 is foreseen in current divertor design for which the diffusion bonding is considered in this work. The joining must have acceptable strength and ductility without significant change in microstructures. So far, numerous diffusion bonding experiments without and with post bonding heat treatment (PBHT) are performed at 1050 °C for various bonding duration. For the bonding processes without PBHT, the bonding seams obtained are defect free and have a very high tensile strength. However they are brittle due to a thin layer of FeW intermetallic phase and metal carbides. For the bonding processes with PBHT, the bonding specimens fail at the bonding seam.

TEM Analysis of Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers

NASA Technical Reports Server (NTRS)

Ozaki, T.; Hasegawa, Y.; Tsuda, H.; Mori, S.; Halbig, M. C.; Asthana, R.; Singh, M.

2017-01-01

SiC fiber-bonded ceramics (SA-Tyrannohex: SA-THX) diffusion-bonded with TiCu metallic interlayers were investigated. Thin samples of the ceramics were prepared with a focused ion beam (FIB) and the interfacial microstructure of the prepared samples was studied by transmission electron microscopy (TEM) and scanning TEM (STEM). In addition to conventional microstructure observation, for detailed analysis of reaction compounds in diffusion-bonded area, we performed STEM-EDS measurements and selected area electron diffraction (SAD) experiments. The TEM and STEM experiments revealed the diffusion-bonded area was composed of only one reaction layer, which was characterized by TiC precipitates in Cu-Si compound matrix. This reaction layer was in good contact with the SA-THX substrates, and it is concluded that the joint structure led to the excellent bonding strength.

Understanding micro-diffusion bonding from the fabrication of B4C/Ni composites

NASA Astrophysics Data System (ADS)

Wang, Miao; Wang, Wen-xian; Chen, Hong-sheng; Li, Yu-li

2018-03-01

A Ni-B4C macroscopic diffusion welding couple and a Ni-15wt%B4C composite fabricated by spark plasma sintering (SPS) were used to understand the micro-scale diffusion bonding between metals and ceramics. In the Ni-B4C macroscopic diffusion welding couple a perfect diffusion welding joint was achieved. In the Ni-15wt%B4C sample, microstructure analyses demonstrated that loose structures occurred around the B4C particles. Energy dispersive X-ray spectroscopy analyses revealed that during the SPS process, the process of diffusion bonding between Ni and B4C particles can be divided into three stages. By employing a nano-indentation test, the room-temperature fracture toughness of the Ni matrix was found to be higher than that of the interface. The micro-diffusion bonding between Ni and B4C particles is quite different from the Ni-B4C reaction couple.

Development of High Temperature Dissimilar Joint Technology for Fission Surface Power Systems

NASA Technical Reports Server (NTRS)

Locci, Ivan E.; Bowman, Cheryl L.; Gabb, Timothy P.

2009-01-01

NASA is developing fission surface power (FSP) system technology as a potential option for use on the surface of the moon or Mars. The goal is to design a robust system that takes full advantage of existing materials data bases. One of the key components of the power conversion system is the hot-side Heat Exchanger (HX). One possible design for this heat exchanger requires a joint of the dissimilar metals 316L stainless steel and Inconel 718, which must sustain extended operation at high temperatures. This study compares two joining techniques, brazing and diffusion bonding, in the context of forming the requisite stainless steel to superalloy joint. The microstructures produced by brazing and diffusion bonding, the effect of brazing cycle on the mechanical tensile properties of the alloys, and the strength of several brazed joints will be discussed.

Experimental Design for Evaluation of Co-extruded Refractory Metal/Nickel Base Superalloy Joints

DOE Office of Scientific and Technical Information (OSTI.GOV)

ME Petrichek

2005-12-16

Prior to the restructuring of the Prometheus Program, the NRPCT was tasked with delivering a nuclear space reactor. Potential NRPCT nuclear space reactor designs for the Prometheus Project required dissimilar materials to be in contact with each other while operating at extreme temperatures under irradiation. As a result of the high reactor core temperatures, refractory metals were the primary candidates for many of the reactor structural and cladding components. They included the tantalum-base alloys ASTAR-811C and Ta-10W, the niobium-base alloy FS-85, and the molybdenum base alloys Moly 41-47.5 Rhenium. The refractory metals were to be joined to candidate nickel basemore » alloys such as Haynes 230, Alloy 617, or Nimonic PE 16 either within the core if the nickel-base alloys were ultimately selected to form the outer core barrel, or at a location exterior to the core if the nickel-base alloys were limited to components exterior to the core. To support the need for dissimilar metal joints in the Prometheus Project, a co-extrusion experiment was proposed. There are several potential methods for the formation of dissimilar metal joints, including explosive bonding, friction stir welding, plasma spray, inertia welding, HIP, and co-extrusion. Most of these joining methods are not viable options because they result in the immediate formation of brittle intermetallics. Upon cooling, intermetallics form in the weld fusion zone between the joined metals. Because brittle intermetallics do not form during the initial bonding process associated with HIP, co-extrusion, and explosive bonding, these three joining procedures are preferred for forming dissimilar metal joints. In reference to a Westinghouse Astronuclear Laboratory report done under a NASA sponsored program, joints that were fabricated between similar materials via explosive bonding had strengths that were directly affected by the width of the diffusion barrier. It was determined that the diffusion zone should not exceed a critical thickness (0.0005 in.). A diffusion barrier that exceeded this thickness would likely fail. The joint fabrication method must therefore mechanically bond the two materials causing little or no interdiffusion upon formation. Co-extrusion fits this description since it forms a mechanical joint between two materials by using heat and pressure. The two materials to be extruded are first assembled and sealed within a co-extrusion billet which is subsequently heated and then extruded through a die. For a production application, once the joint is formed, it is dejacketed to remove the outer canister. The remaining piece consists of two materials bonded together with a thin diffusion barrier. Therefore, the long-term stability of the joint is determined primarily by the kinetics of interdiffusion reaction between the two materials. An experimental design for co-extrusion of refractory metals and nickel-based superalloys was developed to evaluate this joining process and determine the long-term stability of the joints.« less

Rhenium Rocket Manufacturing Technology

NASA Technical Reports Server (NTRS)

1997-01-01

The NASA Lewis Research Center's On-Board Propulsion Branch has a research and technology program to develop high-temperature (2200 C), iridium-coated rhenium rocket chamber materials for radiation-cooled rockets in satellite propulsion systems. Although successful material demonstrations have gained much industry interest, acceptance of the technology has been hindered by a lack of demonstrated joining technologies and a sparse materials property data base. To alleviate these concerns, we fabricated rhenium to C-103 alloy joints by three methods: explosive bonding, diffusion bonding, and brazing. The joints were tested by simulating their incorporation into a structure by welding and by simulating high-temperature operation. Test results show that the shear strength of the joints degrades with welding and elevated temperature operation but that it is adequate for the application. Rhenium is known to form brittle intermetallics with a number of elements, and this phenomena is suspected to cause the strength degradation. Further bonding tests with a tantalum diffusion barrier between the rhenium and C-103 is planned to prevent the formation of brittle intermetallics.

Preparation and Testing of Corrosion and Spallation-Resistant Coatings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hurley, John

2015-11-01

This Energy & Environmental Research Center (EERC) project is designed to determine if plating APMT®, a specific highly oxidation-resistant oxide dispersion-strengthened FeCrAl alloy made by Kanthal, onto nickel-based superalloy turbine parts is a viable method for substantially improving the lifetimes and maximum use temperatures of the parts. The method for joining the APMT plate to the superalloys is called evaporative metal bonding and involves placing a thin foil of zinc between the plate and the superalloy, clamping them together, and heating in an atmosphere-controlled furnace. Upon heating, the zinc melts and dissolves the oxide skins of the alloys at themore » bond line, allowing the two alloys to diffuse into each other. The zinc then diffuses through the alloys and evaporates from their surfaces. During this annual reporting period, the finite element model was completed and used to design clamping jigs to hold the APMT plate to the larger blocks of superalloys during the bonding process. The clamping system was machined from titanium–zirconium–molybdenum and used to bond the APMT plate to the superalloy blocks. The bond between the APMT plate was weak for one of each of the superalloy blocks. We believe that this occurred because enough oxidation had occurred on the surface of the parts as a result of a 1-month time period between sandblasting to prepare the parts and the actual bonding process. The other blocks were, therefore, bonded within 1 day of preparing the parts for bonding, and their joints appear strong. Scanning electron microscopy analyses of representative joints showed that no zinc remained in the alloys after bonding. Also, phases rich in hafnium and tantalum had precipitated near the bond line in the APMT. Iron from the APMT had diffused into the superalloys during bonding, more extensively in the CM247LC than in the Rene 80. Nickel from the superalloys had diffused into the APMT, again more extensively in the joint with the CM247LC than with the Rene 80. One-inch-diameter buttons were machined from each of the bonded blocks and sent to Siemens for standard oxidation, spallation, and corrosion testing, which should be complete in the spring of 2016.« less

Evaluation of Rhenium Joining Methods

NASA Technical Reports Server (NTRS)

Reed, Brian D.; Morren, Sybil H.

1995-01-01

Coupons of rhenium-to-Cl03 flat plate joints, formed by explosive and diffusion bonding, were evaluated in a series of shear tests. Shear testing was conducted on as-received, thermally-cycled (100 cycles, from 21 to 1100 C), and thermally-aged (3 and 6 hrs at 1100 C) joint coupons. Shear tests were also conducted on joint coupons with rhenium and/or Cl03 electron beam welded tabs to simulate the joint's incorporation into a structure. Ultimate shear strength was used as a figure of merit to assess the effects of the thermal treatment and the electron beam welding of tabs on the joint coupons. All of the coupons survived thermal testing intact and without any visible degradation. Two different lots of as-received, explosively-bonded joint coupons had ultimate shear strengths of 281 and 310 MPa and 162 and 223 MPa, respectively. As-received, diffusion-bonded coupons had ultimate shear strengths of 199 and 348 MPa. For the most part, the thermally-treated and rhenium weld tab coupons had shear strengths slightly reduced or within the range of the as-received values. Coupons with Cl03 weld tabs experienced a significant reduction in shear strength. The degradation of strength appeared to be the result of a poor heat sink provided during the electron beam welding. The Cl03 base material could not dissipate heat as effectively as rhenium, leading to the formation of a brittle rhenium-niobium intermetallic.

Liquid phase diffusion bonding of A1070 by using metal formate coated Zn sheet

NASA Astrophysics Data System (ADS)

Ozawa, K.; Koyama, S.; shohji, I.

2017-05-01

Aluminium alloy have high strength and easily recycle due to its low melting point. Therefore, aluminium is widely used in the manufacturing of cars and electronic devices. In recent years, the most common way for bonding aluminium alloy is brazing and friction stir welding. However, brazing requires positional accuracy and results in the formation of voids by the flax residue. Moreover, aluminium is an excellent heat radiating and electricity conducting material; therefore, it is difficult to bond together using other bonding methods. Because of these limitations, liquid phase diffusion bonding is considered to the suitable method for bonding aluminium at low temperature and low bonding pressure. In this study, the effect of metal formate coating processing of zinc surface on the bond strength of the liquid phase diffusion bonded interface of A1070 has been investigated by SEM observation of the interfacial microstructures and fractured surfaces after tensile test. Liquid phase diffusion bonding was carried out under a nitrogen gas atmosphere at a bonding temperature of 673 K and 713 K and a bonding load of 6 MPa (bonding time: 15 min). As a result of the metal formate coating processing, a joint having the ultimate tensile strength of the base aluminium was provided. It is hypothesized that this is because metallic zinc is generated as a result of thermal decomposition of formate in the bonded interface at lower bonding temperatures.

Diffusion Bonding of Silicon Carbide for a Micro-Electro-Mechanical Systems Lean Direct Injector

NASA Technical Reports Server (NTRS)

Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, James D.

2006-01-01

Robust approaches for joining silicon carbide (SiC) to silicon carbide sub-elements have been developed for a micro-electro-mechanical systems lean direct injector (MEMS LDI) application. The objective is to join SiC sub-elements to form a leak-free injector that has complex internal passages for the flow and mixing of fuel and air. Previous bonding technology relied upon silicate glass interlayers that were not uniform or leak free. In a newly developed joining approach, titanium foils and physically vapor deposited titanium coatings were used to form diffusion bonds between SiC materials during hot pressing. Microscopy results show the formation of well adhered diffusion bonds. Initial tests show that the bond strength is much higher than required for the component system. Benefits of the joining technology are fabrication of leak free joints with high temperature and mechanical capability.

Thin-film diffusion brazing of titanium alloys

NASA Technical Reports Server (NTRS)

Mikus, E. B.

1972-01-01

A thin film diffusion brazing technique for joining titanium alloys by use of a Cu intermediate is described. The method has been characterized in terms of static and dynamic mechanical properties on Ti-6Al-4V alloy. These include tensile, fracture toughness, stress corrosion, shear, corrosion fatigue, mechanical fatigue and acoustic fatigue. Most of the properties of titanium joints formed by thin film diffusion brazing are equal or exceed base metal properties. The advantages of thin film diffusion brazing over solid state diffusion bonding and brazing with conventional braze alloys are discussed. The producibility advantages of this process over others provide the potential for producing high efficiency joints in structural components of titanium alloys for the minimum cost.

Joining of Silicon Carbide-Based Ceramics by Reaction Forming Method

NASA Technical Reports Server (NTRS)

Singh, M.; Kiser, J. D.

1997-01-01

Recently, there has been a surge of interest in the development and testing of silicon-based ceramics and composite components for a number of aerospace and ground based systems. The designs often require fabrication of complex shaped parts which can be quite expensive. One attractive way of achieving this goal is to build up complex shapes by joining together geometrically simple shapes. However, the joints should have good mechanical strength and environmental stability comparable to the bulk materials. These joints should also be able to maintain their structural integrity at high temperatures. In addition, the joining technique should be practical, reliable, and affordable. Thus, joining has been recognized as one of the enabling technologies for the successful utilization of silicon carbide based ceramic components in high temperature applications. Overviews of various joining techniques, i.e., mechanical fastening, adhesive bonding, welding, brazing, and soldering have been provided in recent publications. The majority of the techniques used today are based on the joining of monolithic ceramics with metals either by diffusion bonding, metal brazing, brazing with oxides and oxynitrides, or diffusion welding. These techniques need either very high temperatures for processing or hot pressing (high pressures). The joints produced by these techniques have different thermal expansion coefficients than the ceramic materials, which creates a stress concentration in the joint area. The use temperatures for these joints are around 700 C. Ceramic joint interlayers have been developed as a means of obtaining high temperature joints. These joint interlayers have been produced via pre-ceramic polymers, in-situ displacement reactions, and reaction bonding techniques. Joints produced by the pre-ceramic polymer approach exhibit a large amounts of porosity and poor mechanical properties. On the other hand, hot pressing or high pressures are needed for in-situ displacement reactions and reaction bonding techniques. Due to the equipment required, these techniques are impractical for joining large or complex shaped components.

Wafer-level Cu-Sn micro-joints with high mechanical strength and low Sn overflow

NASA Astrophysics Data System (ADS)

Duan, Ani; Luu, Thi-Thuy; Wang, Kaiying; Aasmundtveit, Knut; Hoivik, Nils

2015-09-01

In this paper, we report wafer-level bonding using solid-liquid inter-diffusion (SLID) processes for fabricating micro-joints Cu-Sn at low temperature (270 °C). The evolution of multilayer Cu/Sn to micro-joint alloys has been characterized by optical microscopy and mechanical die-shear testing. The Cu-Sn joints with line width from 80 to 200 μm prove to be reliable packaging materials for bonding vacuum micro-cavities with controllable Sn overflow, as well as high mechanical strength (>70 MPa). A thermodynamic model has been performed to further understand the formation of Cu-Sn intermetallic alloys. There are two important findings for this work: 1) Using a two-step temperature profile may significantly reduce the amount of Sn overflow; 2) for packaging, a bond frame width greater than 80 μm will result in high yield.

Mössbauer characterization of joints of steel pieces in transient liquid phase bonding experiences

NASA Astrophysics Data System (ADS)

di Luozzo, N.; Martínez Stenger, P. F.; Canal, J. P.; Fontana, M. R.; Arcondo, B.

2011-11-01

Joining of seamless, low carbon, steel tubes were performed by means of Transient Liquid Phase Bonding process employing a foil of Fe-Si-B metallic glass as filler material. The influence of the main parameters of the process was evaluated: temperature, holding time, pressure and post weld heat treatment. Powder samples were obtained from the joint of tubes and characterized employing Mössbauer Spectroscopy in transmission geometry. The sampling was performed both in tubes successfully welded and in those which show joint defects. The results obtained are correlated with the obtained microstructure and the diffusion of Si and B during the process.

Diffusion bonding of titanium to 304 stainless steel

NASA Astrophysics Data System (ADS)

Ghosh, M.; Bhanumurthy, K.; Kale, G. B.; Krishnan, J.; Chatterjee, S.

2003-11-01

Diffusion bonding between commercially pure titanium and an austenitic stainless steel (AISI 304) has been carried out in the temperature range of 850-950 °C for 2 h at uniaxial pressure of 3 MPa in vacuum. The microstructure of the diffusion zone has been analysed by optical and scanning electron microscopy (SEM). The interdiffusion of the diffusing species across the interface has been evaluated by electron probe microanalysis (EPMA). The reaction products formed at the interface have been identified by X-ray diffraction technique. It has been observed that the diffusion zone is dominated by the presence of the σ phase close to the stainless steel side and the solid solution of β-Ti (solutes are Fe, Cr and Ni) close to the titanium. The presence of Fe 2Ti and FeTi has been found in the reaction zone. It has been observed that the bond strength (˜222 MPa) is highest for the couple processed at 850 °C and this value decreases with rise in joining temperature. The variation of strength of the transition joints is co-related with the microstructural characteristics of the diffusion zone.

Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion

NASA Astrophysics Data System (ADS)

Kanjilal, Anwesha; Kumar, Praveen

2018-01-01

The effects of mechanical strain on the growth kinetics of interfacial intermetallic compounds (IMCs) sandwiched between Cu substrate and Sn-1.0 wt.%Ag-0.5 wt.%Cu (SAC105) solder have been investigated. Isothermal aging (IA) at 70°C and 125°C, and thermal cycling (TC) as well as thermomechanical cycling (TMC) with shear strain of 12.8% per cycle between -25°C and 125°C were applied to diffusion-bonded solder joints to study the growth behavior of the interfacial IMC layer under various types of thermomechanical excursion (TME). The microstructure of the solder joint tested under each TME was observed at regular intervals. It was observed that the growth rate of the IMC layer was higher in the case of TMC compared with TC or IA. This increased growth rate of the IMC layer in the presence of mechanical strain suggests an additional driving force that enhances the growth kinetics of the IMC. Finite element analysis was performed to gain insight into the effect of TC and TMC on the stress field in the solder joint, especially near the interface between the solder and the substrate. Finally, an analytical model was developed to quantify the effect of strain on the effective diffusivity and express the growth kinetics for all three types of TME using a single expression.

Robust Joining and Integration Technologies for Advanced Metallic, Ceramic, and Composite Systems

NASA Technical Reports Server (NTRS)

Singh, M.; Shpargel, Tarah; Morscher, Gregory N.; Halbig, Michael H.; Asthana, Rajiv

2006-01-01

Robust integration and assembly technologies are critical for the successful implementation of advanced metallic, ceramic, carbon-carbon, and ceramic matrix composite components in a wide variety of aerospace, space exploration, and ground based systems. Typically, the operating temperature of these components varies from few hundred to few thousand Kelvin with different working times (few minutes to years). The wide ranging system performance requirements necessitate the use of different integration technologies which includes adhesive bonding, low temperature soldering, active metal brazing, diffusion bonding, ARCJoinT, and ultra high temperature joining technologies. In this presentation, a number of joining examples and test results will be provided related to the adhesive bonding and active metal brazing of titanium to C/C composites, diffusion bonding of silicon carbide to silicon carbide using titanium interlayer, titanium and hastelloy brazing to silicon carbide matrix composites, and ARCJoinT joining of SiC ceramics and SiC matrix composites. Various issues in the joining of metal-ceramic systems including thermal expansion mismatch and resulting residual stresses generated during joining will be discussed. In addition, joint design and testing issues for a wide variety of joints will be presented.

Summary of Prior Work on Joining of Oxide Dispersion-Strengthened Alloys

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wright, Ian G; Tatlock, Gordon J; Badairy, H.

2009-08-01

There is a range of joining techniques available for use with ODS alloys, but care should be exercised in matching the technique to the final duty requirements of the joint. The goal for joining ODS alloys is a joint with no local disruption of the distribution of the oxide dispersion, and no significant change in the size and orientation of the alloy microstructure. Not surprisingly, the fusion welding processes typically employed with wrought alloys produce the least satisfactory results with ODS alloys, but some versions, such as fusion spot welding, and the laser and electron-beam welding technologies, have demonstrated potentialmore » for producing sound joints. Welds made using solid-state spot welding reportedly have exhibited parent metal properties. Thus, it is possible to employ processes that result in significant disruption of the alloy microstructure, as long as the processing parameters are adjustment to minimize the extent of or influence of the changes in the alloy microstructure. Selection among these joining approaches largely depends on the particular application and component configuration, and an understanding of the relationships among processing, alloy microstructure, and final properties is key. Recent developments have resulted in friction welding evolving to be a prime method for joining ODS sheet products, and variants of brazing/diffusion bonding have shown excellent promise for use with tubes and pipes. The techniques that come closest to the goal defined above involve solid-state diffusion bonding and, in particular, it has been found that secondary recrystallization of joints made by pulsed plasma-assisted diffusion can produce the desired, continuous, large alloy grain structure through the joint. Such joints have exhibited creep rupture failure at >82% of the load needed to fail the monolithic parent alloy at 1000 C.« less

Fabrication and evaluation of enhanced diffusion bonded titanium honeycomb core sandwich panels with titanium aluminide face sheets

NASA Technical Reports Server (NTRS)

Hoffmann, E. K.; Bird, R. K.; Bales, T. T.

1989-01-01

A joining process was developed for fabricating lightweight, high temperature sandwich panels for aerospace applications using Ti-14Al-21Nb face sheets and Ti-3Al-2.5V honeycomb core. The process, termed Enhanced Diffusion Bonding (EDB), relies on the formation of a eutectic liquid through solid-state diffusion at elevated temperatures and isothermal solidification to produce joints in thin-gage titanium and titanium aluminide structural components. A technique employing a maskant on the honeycomb core was developed which permitted electroplating a controlled amount of EDB material only on the edges of the honeycomb core in order to minimize the structural weight and metallurgical interaction effects. Metallurgical analyses were conducted to determine the interaction effects between the EDB materials and the constituents of the sandwich structure following EDB processing. The initial mechanical evaluation was conducted with butt joint specimens tested at temperatures from 1400 - 1700 F. Further mechanical evaluation was conducted with EDB sandwich specimens using flatwise tension tests at temperatures from 70 - 1100 F and edgewise compression tests at ambient temperature.

Dissimilar metals joint evaluation

NASA Technical Reports Server (NTRS)

Wakefield, M. E.; Apodaca, L. E.

1974-01-01

Dissimilar metals tubular joints between 2219-T851 aluminum alloy and 304L stainless steel were fabricated and tested to evaluate bonding processes. Joints were fabricated by four processes: (1) inertia (friction) weldings, where the metals are spun and forced together to create the weld; (2) explosive welding, where the metals are impacted together at high velocity; (3) co-extrusion, where the metals are extruded in contact at high temperature to promote diffusion; and (4) swaging, where residual stresses in the metals after a stretching operation maintain forced contact in mutual shear areas. Fifteen joints of each type were prepared and evaluated in a 6.35 cm (2.50 in.) O.D. size, with 0.32 cm (0.13 in.) wall thickness, and 7.6 cm (3.0 in) total length. The joints were tested to evaluate their ability to withstand pressure cycle, thermal cycle, galvanic corrosion and burst tests. Leakage tests and other non-destructive test techniques were used to evaluate the behavior of the joints, and the microstructure of the bond areas was analyzed.

Transient Liquid-Phase Diffusion Bonding of Aluminum Metal Matrix Composite Using a Mixed Cu-Ni Powder Interlayer

NASA Astrophysics Data System (ADS)

Maity, Joydeep; Pal, Tapan Kumar

2012-07-01

In the present study, the transient liquid-phase diffusion bonding of an aluminum metal matrix composite (6061-15 wt.% SiCp) has been investigated for the first time using a mixed Cu-Ni powder interlayer at 560 °C, 0.2 MPa, for different holding times up to 6 h. The microstructure of the isothermally solidified zone contains equilibrium precipitate CuAl2, metastable precipitate Al9Ni2 in the matrix of α-solid solution along with the reinforcement particles (SiC). On the other hand, the microstructure of the central bond zone consists of equilibrium phases such as NiAl3, Al7Cu4Ni and α-solid solution along with SiC particles (without any segregation) and the presence of microporosities. During shear test, the crack originates from microporosities and propagates along the interphase interfaces resulting in poor bond strength for lower holding times. As the bonding time increases, with continual diffusion, the structural heterogeneity is diminished, and the microporosities are eliminated at the central bond zone. Accordingly, after 6-h holding, the microstructure of the central bond zone mainly consists of NiAl3 without any visible microporosity. This provides a joint efficiency of 84% with failure primarily occurring through decohesion at the SiC particle/matrix interface.

Influence of micro-oxidation on joints of C/C composites and GH3044 for large-size aerospace parts

NASA Astrophysics Data System (ADS)

Shi, Xiaohong; Jin, Xiuxiu; Yan, Ningning; Yang, Li

2017-11-01

To improve the bonding strength of carbon/carbon (C/C) composites and GH3044 nickel-based superalloy, the bonding interlayer with Ti/Ni/Cu/Ni multiple foils were prepared by a two-step technique involving micro-oxidation and partial transient liquid phase (PTLP) process. Interface characteristics and mechanical behavior of joints were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), laser scanning confocal microscope (LSCM) and energy X-ray dispersive spectrometer (EDS). Results show that a porous layer on C/C composites is formed by micro-oxidation for more than 2 min at 1073 K in air, which provides a diffusion path for liquid phase to infiltrate into C/C substrate and generate a wedge interlocking interface. After micro-oxidation for 4 min, the shear strength of joints reaches 32.09 ± 1.98 MPa what is 36.73% higher than that of joints without micro-oxidation (23.47 ± 1.15 MPa). The increase of shear strength remarkably depends on physical interlocking and chemical bonding at porous interface.

[The influences of crystallized compositions in the porcelain on bonding strength of titanium to porcelain].

PubMed

Mo, A; Wang, J; Liao, Y; Cen, Y; Shi, X

2001-12-01

Sufficient porcelain-titanium bond is a vital factor determining the clinical performance of titanium-porcelain restorations. The purpose of this study was to investigate the effects of self-preparation La-porcelain composition on the porcelain-titanium bonding strength and to compare with the Vita Titankeramik. The present study examines 5 different recipes of porcelain by weight%: SiO2, 12%-17%; LaO2, 7%-10%; Al2O3, 9%-14%; B2O3, 23%-31%; CaO, 6%-8%; K2O, 2%-3%; SrO, 2%-4%; Na2O, 1%-3%; SnO2, 8%-10%; ZrO2, 3%-5%; TiO2, 6%-8%. Specimens were tested in push type shear with a universal testing machine. Scanning electron microscopy (SEM) and electron probe microanalyzer (EPMA) were employed to reveal the microstructures and diffusion of elements in the interfacial regions between the porcelain coating and titanium to the bond strength when fired at 800 degrees C. The ratios of crystallized compositions had significant influences on the porcelain-titanium bond strength (P < 0.05). La-porcelain had the highest shear bond strength (37.76 MPa). The shear bond strength of the Vita Titankeramik to titanium was 20.18 MPa. The results of SEM revealed integrity of porcelain-titanium joints in La-porcelain and a greater amount of porosity in the interface of Vita Titankeramik to titanium. EPMA analysis demonstrated the aggregation of Si and Sn in the interfacial regions and their diffusion into the titanium. Chemical compositions of porcelain and ratios of crystallized compositions play the important role in the titanium porcelain bond. La-porcelain had the highest shear bond strength and good porcelain-titanium joints. La-porcelain is a new-style low fusing porcelain/titanium system.

A Finite Element Analysis of Adhesively Bonded Composite Joints Including Geometric Nonlinearity, Nonlinear Viscoelasticity, Moisture Diffusion, and Delayed Failure.

DTIC Science & Technology

1987-12-01

Review of the Literature Adhesive bonding has been in use for many years. Most of the0 early bonds used animal and vegetable glues , and the structural...use of these glues has been confined mostly to timber. The use of synthetic resins in the structural bonding of timber began in early 1930’s...Fiue72. Influence of Moisture Coefficient o Adhewtv N +.n,. "t,-, flour II! . _70 60".,.:’’ .:’ " S:"- _- ._ , ’ ’ ’ "" - r - INt 25 A FINITE ELE ENT

Evolution of Microstructure in Brazed Joints of Austenitic-Martensitic Stainless Steel with Pure Silver Obtained with Ag-27Cu-5Sn Brazing Filler Material

NASA Astrophysics Data System (ADS)

Gangadharan, S.; Sivakumar, D.; Venkateswaran, T.; Kulkarni, Kaustubh

2016-12-01

Brazing of an austenitic-martensitic stainless steel (AMSS) with pure silver was carried out at 1053 K, 1073 K, and 1093 K (780 °C, 800 °C, and 820 °C) with Ag-27Cu-5Sn (wt pct) as brazing filler material (BFM). Wettability of the liquid BFM over base AMSS surface was found to be poor. Application of nickel coating to the steel was observed to enhance the wettability and to enable the formation of a good bond between BFM and the steel. The mechanism responsible for enhanced metallurgical bonding of the BFM with AMSS in the presence of nickel coating was explained based on diffusional interactions and uphill diffusion of iron, chromium and nickel observed in the brazed microstructure. Good diffusion-assisted zone was observed to form on silver side at all three temperatures. Four phases were encountered within the joint including silver solid solution, copper solid solution, Cu3Sn intermetallic and Ni-Fe solid solution. The Cu3Sn intermetallic was present in small amounts in the joints brazed at 1053 K and 1073 K (780 °C and 800 °C). The joint formed at 1093 K (820 °C) exhibited the absence of Cu3Sn, fewer defects and larger diffusion-assisted zone. Hardness of base AMSS was found to reduce during brazing due to austenite reversion and post-brazing sub-zero treatment for 2.5 hours was found suitable to recover the hardness.

Morphology, topography, and hardness of diffusion bonded sialon to AISI 420 at different bonding time

NASA Astrophysics Data System (ADS)

Ibrahim, Nor Nurulhuda Md.; Hussain, Patthi; Awang, Mokhtar

2015-07-01

Sialon and AISI 420 martensitic stainless steel were diffusion bonded in order to study the effect of bonding time on reaction layer's growth. Joining of these materials was conducted at 1200°C under a uniaxial pressure of 17 MPa in a vacuum ranging from 5.0 to 8.0×10-6 Torr with bonding time varied for 0.5, 2, and 3 h. Thicker reaction layer was formed in longer bonded sample since the elements from sialon could diffuse further into the steel. Sialon retained its microstructure but it was affected at the initial contact with the steel to form the new interface layer. Diffusion layer grew toward the steel and it was segregated with the parent steel as a result of the difference in properties between these regions. The segregation formed a stream-like structure and its depth decreased when the bonding time was increased. The microstructure of the steel transformed into large grain size with precipitates. Prolonging the bonding time produced more precipitates in the steel and reduced the steel thickness as well. Interdiffusions of elements occurred between the joined materials and the concentrations were decreasing toward the steel and vice versa. Silicon easily diffused into the steel because it possessed lower ionization potential compared to nitrogen. Formation of silicide and other compounds such as carbides were detected in the interface layer and steel grain boundary, respectively. These compounds were harmful due to silicide brittleness and precipitation of carbides in the grain boundary might cause intergranular corrosion cracking. Sialon retained its hardness but it dropped very low at the interface layer. The absence of crack at the joint in all samples could be contributed from the ductility characteristic of the reaction layer which compensated the residual stress that was formed upon the cooling process.

Accelerated Metastable Solid-liquid Interdiffusion Bonding with High Thermal Stability and Power Handling

NASA Astrophysics Data System (ADS)

Huang, Ting-Chia; Smet, Vanessa; Kawamoto, Satomi; Pulugurtha, Markondeya R.; Tummala, Rao R.

2018-01-01

Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system integration with increasing performance and reliability requirements for off-chip interconnections. Solid-liquid interdiffusion (SLID) bonding resulting in all-intermetallic joints has been proposed to extend the applicability of solders, but faces fundamental and manufacturing challenges hindering its wide adoption. This paper introduces a Cu-Sn SLID interconnection technology, aiming at stabilization of the microstructure in the Cu6Sn5 metastable phase rather than the usual stable Cu3Sn phase. This enables formation of a void-free interface yielding higher mechanical strength than standard SLID bonding, as well as significantly reducing the transition time. The metastable SLID technology retains the benefits of standard SLID with superior I/O pitch scalability, thermal stability and current handling capability, while advancing assembly manufacturability. In the proposed concept, the interfacial reaction is controlled by introducing Ni(P) diffusion barrier layers, designed to effectively isolate the metastable Cu6Sn5 phase preventing any further transformation. Theoretical diffusion and kinetic models were applied to design the Ni-Cu-Sn interconnection stack to achieve the targeted joint composition. A daisy chain test vehicle was used to demonstrate this technology as a first proof of concept. Full transition to Cu6Sn5 was successfully achieved within a minute at 260°C as confirmed by scanning electron microscope (SEM) and x-ray energy dispersive spectroscopy (XEDS) analysis. The joint composition was stable through 10× reflow, with outstanding bond strength averaging 90 MPa. The metastable SLID interconnections also showed excellent electromigration performance, surviving 500 h of current stressing at 105 A/cm2 at 150°C.

Microstructure of Reaction Zone Formed During Diffusion Bonding of TiAl with Ni/Al Multilayer

NASA Astrophysics Data System (ADS)

Simões, Sónia; Viana, Filomena; Koçak, Mustafa; Ramos, A. Sofia; Vieira, M. Teresa; Vieira, Manuel F.

2012-05-01

In this article, the characterization of the interfacial structure of diffusion bonding a TiAl alloy is presented. The joining surfaces were modified by Ni/Al reactive multilayer deposition as an alternative approach to conventional diffusion bonding. TiAl substrates were coated with alternated Ni and Al nanolayers. The nanolayers were deposited by dc magnetron sputtering with 14 nm of period (bilayer thickness). Joining experiments were performed at 900 °C for 30 and 60 min with a pressure of 5 MPa. Cross sections of the joints were prepared for characterization of their interfaces by scanning electron microscopy (SEM), transmission electron microscopy (TEM), scanning transmission electron microscopy (STEM), high resolution TEM (HRTEM), energy dispersive x-ray spectroscopy (EDS), and electron backscatter diffraction (EBSD). Several intermetallic compounds form at the interface, assuring the bonding of the TiAl. The interface can be divided into three distinct zones: zone 1 exhibits elongated nanograins, very small equiaxed grains are observed in zone 2, while zone 3 has larger equiaxed grains. EBSD analysis reveals that zone 1 corresponds to the intermetallic Al2NiTi and AlNiTi, and zones 2 and 3 to NiAl.

The failure analysis and lifetime prediction for the solder joint of the magnetic head

NASA Astrophysics Data System (ADS)

Xiao, Xianghui; Peng, Minfang; Cardoso, Jaime S.; Tang, Rongjun; Zhou, YingLiang

2015-02-01

Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years.

Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

NASA Astrophysics Data System (ADS)

Abdelhadi, Ousama Mohamed Omer

Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases, η-phase (Cu6Sn 5) and epsilon-phase (Cu3Sn), were found in almost all the cases regardless of the process parameters and size levels. The physics-based analytical model was successfully able to capture the governing mechanisms of IMC growth: chemical reaction controlled and diffusion-controlled. Examination of microstructures of solder joints of different sizes revealed the size of the solder joint has no effect on the type of IMCs formed during the process. Joint size, however, affected the thickness of IMC layers significantly. IMC layers formed in the solder joints of smaller sizes were found to be thicker than those in the solder joints of larger sizes. The growth rate constants and activation energies of Cu3Sn IMC layer were also reported and related to joint thickness. In an effort to optimize the EBSD imaging in the multi-layer configuration, an improved specimen preparation technique and optimum software parameters were determined. Nanoindentation results show that size effects play a major role on the mechanical properties of micro-scale solder joints. Smaller joints show higher Young's modulus, hardness, and yield strength and lower work hardening exponents comparing to thicker joints. To obtain the stress concentration factors in a multilayer specimen with IMC layer as bonding material, a four-point bending notched configuration was used. The analytical solutions developed for peeling and shear stresses in notched structure were used to evaluate the stresses at IMC interface layers. Results were in good agreement with the finite-element simulation. The values of interfacial stresses were utilized in obtaining fracture toughness of the IMC material. (Abstract shortened by UMI.)

The Effect of Ti on Microstructural Characteristics and Reaction Mechanism in Bonding of Al-Ceramic Composite

NASA Astrophysics Data System (ADS)

Juan, Li; Kehong, Wang; Deku, Zhang

2016-09-01

The effect of Ti on microstructural characteristics and reaction mechanism in bonding of Al-Ceramic composite was studied. Ti and Al-Ceramic composite were diffusion welded at 550, 600, 700, 800, and 900 °C in a vacuum furnace. The microstructures and compositions of the interface layers were analyzed, and the mechanical properties and fracture morphology of the joints were examined. The results indicated that there was a systematic switch from Ti/Ti7Al5Si12/composite at 600 °C and Ti/TiAl3/Ti7Al5Si12/composite at 700 °C to Ti/Ti7Al5Si12/TiAl3/Ti7Al5Si12/composite at 800 °C and Ti/Ti7Al5Si12/TiAl3/composite at 900 °C. The formation of TiAl3 at 700 and 800 °C depended on Al segregation, which was an uphill diffusion driven by chemical potential. The maximum shear strength was 40.9 MPa, found in the joint welded at 700 °C. Most joints fractured between Ti7Al5Si12 and Al-Ceramic composite. In any case, Ti7Al5Si12 was favorable for Al-Ceramic composite welding, which attached to Al-Ceramic composite, reducing the differences in physiochemical properties between SiC and metal, improving the mechanical properties of the joints and increasing the surface wettability of Al-Ceramic composite.

Advances in joining newer structural materials; Proceedings of the International Conference, Montreal, Canada, July 23-25, 1990

NASA Astrophysics Data System (ADS)

The present conference on advances in joining novel structural materials encompasses such material types as ceramics, plastics and composites, and new metallic materials. Specific issues addressed include the use of conductor electric explosion to join ceramics, the effects of brazing temperature on joint properties of SiC-fiber-reinforced Al-alloy-matrix composites, the in situ structure control of composite materials, and the weldability of polymeric materials that are heterogeneous as to chemical nature from the standpoint of morphology. Also addressed are the joining of the Al-Li alloy 8090, diffusion bonding of a creep-resistant Fe-ODS alloy, the adhesive bonding of zinc-coated steel sheets, welds in thermoplastic composite materials, and hot-melt joints for carbon-fiber-reinforced composites.

Development of a Novel Ni-Fe-Cr-B-Si Interlayer Material for Transient Liquid Phase Bonding of Inconel 718

NASA Astrophysics Data System (ADS)

Tarai, U. K.; Robi, P. S.; Pal, Sukhomay

2018-04-01

A Ni-Cr-Fe-Si-B based interlayer material was developed by mechanical alloying (MA) process in a high-energy planetary ball mill. Equiaxed alloy powders of size 12 µm was obtained after milling for 50 hours. X-ray diffraction analysis of the milled powder revealed that milling of elemental powders initially resulted in microcrystalline alloy powder having face centered cubic structure, which on subsequent milling resulted in nano-crystallice alloy powder with a crystallite size of 3.2 nm. XRD analysis also reveals formation of metastable eutectic alloys resulting in lowering of the melting point of the interlayer material to 1025 °C. IN 718 superalloy samples were joined at 1050°C using the developed interlayer. A homogeneous joint was formed by the newly developed interlayer material. Three different zones were observed at the bond (i) isothermally solidified zone, (ii) diffusion affected zone and (iii) unaffected base metal. In the diffusion-affected zone, boron was present at the grain boundaries of Ni γ matrix in bulky metal borides form. The diffusion of boron from interlayer material into the base material was mechanism of isothermal solidification and bond formation in transient liquid phase bonding of IN 718.

Welding and Joining of Titanium Aluminides

PubMed Central

Cao, Jian; Qi, Junlei; Song, Xiaoguo; Feng, Jicai

2014-01-01

Welding and joining of titanium aluminides is the key to making them more attractive in industrial fields. The purpose of this review is to provide a comprehensive overview of recent progress in welding and joining of titanium aluminides, as well as to introduce current research and application. The possible methods available for titanium aluminides involve brazing, diffusion bonding, fusion welding, friction welding and reactive joining. Of the numerous methods, solid-state diffusion bonding and vacuum brazing have been most heavily investigated for producing reliable joints. The current state of understanding and development of every welding and joining method for titanium aluminides is addressed respectively. The focus is on the fundamental understanding of microstructure characteristics and processing–microstructure–property relationships in the welding and joining of titanium aluminides to themselves and to other materials. PMID:28788113

Thermal fatigue testing of a diffusion-bonded beryllium divertor mock-up under ITER-relevant conditions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Youchison, D.L.; Watson, R.D.; McDonald, J.M.

Thermal response and thermal fatigue tests of four 5-mm-thick beryllium tiles on a Russian Federation International Thermonuclear Experimental Reactor (ITER)-relevant divertor mock-up were completed on the electron beam test system at Sandia National Laboratories. Thermal response tests were performed on the tiles to an absorbed heat flux of 5 MW/m{sup 2} and surface temperatures near 300{degree}C using 1.4 MPa water at 5 m/s flow velocity and an inlet temperature of 8 to 15{degree}C. One tile was exposed to incrementally increasing heat fluxes up to 9.5 MW/m{sup 2} and surface temperatures up to 690{degree}C before debonding at 10MW/m{sup 2}. A secondmore » tile debonded in 25 to 30 cycles at <0.5 MW/m{sup 2}. However, a third tile debonded after 9200 thermal fatigue cycles at 5 MW/m{sup 2}, while another debonded after 6800 cycles. Posttest surface analysis indicated that fatigue failure occurred in the intermetallic layers between the beryllium and copper. No fatigue cracking of the bulk beryllium was observed. It appears that microcracks growing at the diffusion bond produced the observed gradual temperature increases during thermal cycling. These experiments indicate that diffusion-bonded beryllium tiles can survive several thousand thermal cycles under ITER-relevant conditions. However, the reliability of the diffusion-bonded joint remains a serious issue. 17 refs., 25 figs., 6 tabs.« less

Effects of processing conditions and ambient environment on the microstructure and fracture strength of copper/niobium/copper interlayer joints for alumina

DOE Office of Scientific and Technical Information (OSTI.GOV)

Marks, Robert Alan

1999-12-01

Partial transient liquid phase (PTLP) bonding is a technique which can be used to join ceramics with metals and is used to form niobium-based joints for alumina. The principal advantage to PTLP bonding is that it enables refractory joints to be fabricated at temperatures below those typically required by solid state diffusion bonding. A thorough review of the important parameters (chemical compatibility, thermal expansion match, sufficient wettability of the liquid phase on the solid phases) in choosing a joining material for ceramics by the PTLP method is provided. As in conventional PTLP joining, the current study uses thin (=3 μm)more » copper layers sandwiched between the alumina (bulk) and niobium (127 μm). However, unlike the case of copper/nickel/copper obium is limited. Consequently, the copper is not entirely dissolved in the process, resulting in a two phase (copper-rich and niobium-rich phases) microstructure. Different processing conditions (temperature and applied load) result in different morphologies of the copper-rich and niobium-rich phases at the interface. These different microstructures exhibit distinct strength characteristics. Extended annealing of as-processed joints can influence the strengths differently depending on the ambient partial oxygen pressure at the annealing temperature. The focus of this work is to correlate processing conditions, microstructure, and resulting joint strength. Under optimum processing conditions (1400°C, 2.2 MPa), joints with strengths in excess of 200 MPa at 1200°C are fabricated.« less

Diffusion bonding of CMSX-4 to UDIMET 720 using PVD-coated interfaces and HIP

DOE Office of Scientific and Technical Information (OSTI.GOV)

Larker, R.; Ockborn, J.; Selling, B.

There is an increasing interest in development of manufacturing methods for Dual Property BLISKs (BLaded dISKs), consisting of creep resistant airfoils and fatigue resistant disks bonded together by a durable joint. Optimum heat treatments are, however, very different for creep resistant single crystal CMSX-4 and fatigue resistant polycrystalline Udimet 720 selected in this study, but fortunately the first aging treatment for CMSX-4 (1140 C, 2-6h, AC) is similar to the partial solution treatment of U 720 HS2 (1115 C, 4h, OQ). Based on this, diffusion bonding was performed by HIP at 1120 C and 200 MPa argon pressure for 4more » h, followed by cooling to 400 C. Subsequently, a shortened Udimet 720 HS2 two-step aging treatment was adopted by heating to 650 C for 6 h followed by cooling to 400 C, heating to 760 C for 2 h, and finally cooling to R.T. under remaining HIP pressure. Plasma etching followed by thin (80 nm) PVD coating with either nickel or titanium were used to clean and protect the polished surfaces before joining. The selection of coatings was governed by the possibility to reduce oxidized nickel by flushing with hydrogen at 330 C during evacuation of the HIP capsules, and by the large solubility of oxygen in titanium. Hot tensile testing was performed at 750 C on both joined and reference materials subjected to the modified heat treatment. Initially solution treated Udimet 720 and CMSX-4 comprised the reference materials. The testing showed that joints with Ni-PV coatings were almost as strong as Udimet 720 (although with very limited elongation), while the joints with Ti-PVD coatings were weaker.« less

Kinetics of Isothermal Reactive Diffusion Between Solid Cu and Liquid Sn

NASA Astrophysics Data System (ADS)

O, M.; Suzuki, T.; Kajihara, M.

2018-01-01

The Cu/Sn system is one of the most fundamental and important metallic systems for solder joints in electric devices. To realize reliable solder joints, information on reactive diffusion at the solder joint is very important. In the present study, we experimentally investigated the kinetics of the reactive diffusion between solid Cu and liquid Sn using semi-infinite Cu/Sn diffusion couples prepared by an isothermal bonding technique. Isothermal annealing of the diffusion couple was conducted in the temperature range of 533-603 K for various times up to 172.8 ks (48 h). Using annealing, an intermetallic layer composed of Cu6Sn5 with scallop morphology and Cu3Sn with rather uniform thickness is formed at the original Cu/Sn interface in the diffusion couple. The growth of the Cu6Sn5 scallop occurs much more quickly than that of the Cu3Sn layer and thus predominates in the overall growth of the intermetallic layer. This tendency becomes more remarkable at lower annealing temperatures. The total thickness of the intermetallic layer is proportional to a power function of the annealing time, and the exponent of the power function is close to unity at all the annealing temperatures. This means that volume diffusion controls the intermetallic growth and the morphology of the Cu6Sn5/Sn interface influences the rate-controlling process. Adopting a mean value of 0.99 for the exponent, we obtain a value of 26 kJ/mol for the activation enthalpy of the intermetallic growth.

Rhenium Mechanical Properties and Joining Technology

NASA Technical Reports Server (NTRS)

Reed, Brian D.; Biaglow, James A.

1996-01-01

Iridium-coated rhenium (Ir/Re) provides thermal margin for high performance and long life radiation cooled rockets. Two issues that have arisen in the development of flight Ir/Re engines are the sparsity of rhenium (Re) mechanical property data (particularly at high temperatures) required for engineering design, and the inability to directly electron beam weld Re chambers to C103 nozzle skirts. To address these issues, a Re mechanical property database is being established and techniques for creating Re/C103 transition joints are being investigated. This paper discusses the tensile testing results of powder metallurgy Re samples at temperatures from 1370 to 2090 C. Also discussed is the evaluation of Re/C103 transition pieces joined by both, explosive and diffusion bonding. Finally, the evaluation of full size Re transition pieces, joined by inertia welding, as well as explosive and diffusion bonding, is detailed.

Ultrasonic Nondestructive Characterization of Adhesive Bonds

NASA Technical Reports Server (NTRS)

Qu, Jianmin

1999-01-01

Adhesives and adhesive joints are widely used in various industrial applications to reduce weight and costs, and to increase reliability. For example, advances in aerospace technology have been made possible, in part, through the use of lightweight materials and weight-saving structural designs. Joints, in particular, have been and continue to be areas in which weight can be trimmed from an airframe through the use of novel attachment techniques. In order to save weight over traditional riveted designs, to avoid the introduction of stress concentrations associated with rivet holes, and to take full advantage of advanced composite materials, engineers and designers have been specifying an ever-increasing number of adhesively bonded joints for use on airframes. Nondestructive characterization for quality control and remaining life prediction has been a key enabling technology for the effective use of adhesive joints. Conventional linear ultrasonic techniques generally can only detect flaws (delamination, cracks, voids, etc) in the joint assembly. However, more important to structural reliability is the bond strength. Although strength, in principle, cannot be measured nondestructively, a slight change in material nonlinearity may indicate the onset of failure. Furthermore, microstructural variations due to aging or under-curing may also cause changes in the third order elastic constants, which are related to the ultrasonic nonlinear parameter of the polymer adhesive. It is therefore reasonable to anticipate a correlation between changes in the ultrasonic nonlinear acoustic parameter and the remaining bond strength. It has been observed that higher harmonics of the fundamental frequency are generated when an ultrasonic wave passes through a nonlinear material. It seems that such nonlinearity can be effectively used to characterize bond strength. Several theories have been developed to model this nonlinear effect. Based on a microscopic description of the nonlinear interface binding force, a quantitative method was presented. Recently, a comparison between the experimental and simulated results based on a similar theoretical model was presented. A through-transmission setup for water immersion mode-converted shear waves was used to analyze the ultrasonic nonlinear parameter of an adhesive bond. In addition, ultrasonic guided waves have been used to analyze adhesive or diffusion bonded joints. In this paper, the ultrasonic nonlinear parameter is used to characterize the curing state of a polymer/aluminum adhesive joint. Ultrasonic through-transmission tests were conducted on samples cured under various conditions. The magnitude of the second order harmonic was measured and the corresponding ultrasonic nonlinear parameter was evaluated. A fairly good correlation between the curing condition and the nonlinear parameter is observed. The results show that the nonlinear parameter might be used as a good indicator of the cure state for adhesive joints.

High Temperature Joining and Characterization of Joint Properties in Silicon Carbide-Based Composite Materials

NASA Technical Reports Server (NTRS)

Halbig, Michael C.; Singh, Mrityunjay

2015-01-01

Advanced silicon carbide-based ceramics and composites are being developed for a wide variety of high temperature extreme environment applications. Robust high temperature joining and integration technologies are enabling for the fabrication and manufacturing of large and complex shaped components. The development of a new joining approach called SET (Single-step Elevated Temperature) joining will be described along with the overview of previously developed joining approaches including high temperature brazing, ARCJoinT (Affordable, Robust Ceramic Joining Technology), diffusion bonding, and REABOND (Refractory Eutectic Assisted Bonding). Unlike other approaches, SET joining does not have any lower temperature phases and will therefore have a use temperature above 1315C. Optimization of the composition for full conversion to silicon carbide will be discussed. The goal is to find a composition with no remaining carbon or free silicon. Green tape interlayers were developed for joining. Microstructural analysis and preliminary mechanical tests of the joints will be presented.

Coiled Tube Gas Heaters For Nuclear Gas-Brayton Power Conversion

DOE Office of Scientific and Technical Information (OSTI.GOV)

Peterson, Per F.

This project developed an alternative design for heat exchangers for application to heating supercritical carbon dioxide (S-CO 2) or air for power conversion. We have identified an annular coiled tube bundle configuration–where hot sodium enters tubes from multiple vertical inlet manifold pipes, flows in a spiral pattern radially inward and downward, and then exits into an equal number of vertical outlet manifold pipes–as a potentially attractive option. The S-CO 2 gas or air flows radially outward through the tube bundle. Coiled tube gas heaters (CTGHs) are expected to have excellent thermal shock, long-term thermal creep, in-service inspection, and reparability characteristics,more » compared to alternative options. CTGHs have significant commonality with modern nuclear steam generators. Extensive experience exists with the design, manufacture, operation, in-service inspection and maintenance of nuclear steam generators. The U.S. Nuclear Regulatory Commission also has extensive experience with regulatory guidance documented in NUREG 0800. CTGHs leverage this experience and manufacturing capability. The most important difference between steam generators and gas-Brayton cycles such as the S-CO 2 cycle is that the heat exchangers must operate with counter flow with high effectiveness to minimize the pinch-point temperature difference between the hot liquid coolant and the heated gas. S-CO 2-cycle gas heaters also operate at sufficiently elevated temperatures that time dependent creep is important and allowable stresses are relatively low. Designing heat exchangers to operate in this regime requires configurations that minimize stresses and stress concentrations. The cylindrical tubes and cylindrical manifold pipes used in CTGHs are particularly effective geometries. The first major goal of this research project was to develop and experimentally validate a detailed, 3-D multi-phase (gas-solid-liquid) heat transport model for CTGHs, using methods similar to earlier UCB multi-scale models for PCHEs, which will enable optimization of CTGH designs with respect to the number of manifold pipes, S-CO 2 and sodium circulating power, and other design parameters. CTGHs are relatively novel because the tubes loaded in compression as well as the manifold pipes which form the tube sheets. The second major goal of the experimental and modeling effort was to optimize the assembly and heat treatment of the tube-to-tubesheet joints, using a novel tapered joint configuration, and to develop diffusion-bonded joints with high shear strength and creep resistance, as has been done in other applications for tapered plugs. The project would also conduct creep testing of these tubesheet joints in pressurized furnaces under prototypical conditions of stress and temperature, however this was not feasible due to numerous hinderances. Detailed microstructural investigations was conducted on the diffusion bond interface, while the bond strength was evaluated by tensile testing. The mechanical testing quantified the overall strength of the bond and measured the pull out force as well as long term behavior, which complemented the microstructural analysis and gave a complete understanding of the diffusion bond.« less

Diffusion barriers in modified air brazes

DOEpatents

Weil, Kenneth Scott; Hardy, John S; Kim, Jin Yong; Choi, Jung-Pyung

2013-04-23

A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and at a temperature sufficient to form the braze into a bond holding the two or more parts together. The diffusion barrier is an oxidizable metal that forms either a homogeneous component of the braze, a heterogeneous component of the braze, a separate layer bordering the braze, or combinations thereof. The oxidizable metal is selected from the group Al, Mg, Cr, Si, Ni, Co, Mn, Ti, Zr, Hf, Pt, Pd, Au, lanthanides, and combinations thereof.

Diffusion barriers in modified air brazes

DOEpatents

Weil, Kenneth Scott [Richland, WA; Hardy, John S [Richland, WA; Kim, Jin Yong [Richland, WA; Choi, Jung-Pyung [Richland, WA

2010-04-06

A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and at a temperature sufficient to form the braze into a bond holding the two or more parts together. The diffusion barrier is an oxidizable metal that forms either a homogeneous component of the braze, a heterogeneous component of the braze, a separate layer bordering the braze, or combinations thereof. The oxidizable metal is selected from the group Al, Mg, Cr, Si, Ni, Co, Mn, Ti, Zr, Hf, Pt, Pd, Au, lanthanides, and combinations thereof.

Chemical effect on diffusion in intermetallic compounds

NASA Astrophysics Data System (ADS)

Chen, Yi-Ting

With the trend of big data and the Internet of things, we live in a world full of personal electronic devices and small electronic devices. In order to make the devices more powerful, advanced electronic packaging such as wafer level packaging or 3D IC packaging play an important role. Furthermore, ?-bumps, which connect silicon dies together with dimension less than 10 ?m, are crucial parts in advanced packaging. Owing to the dimension of ?-bumps, they transform into intermetallic compound from tin based solder after the liquid state bonding process. Moreover, many new reliability issues will occur in electronic packaging when the bonding materials change; in this case, we no longer have tin based solder joint, instead, we have intermetallic compound ?-bumps. Most of the potential reliability issues in intermetallic compounds are caused by the chemical reactions driven by atomic diffusion in the material; thus, to know the diffusivities of atoms inside a material is significant and can help us to further analyze the reliability issues. However, we are lacking these kinds of data in intermetallic compound because there are some problems if used traditional Darken's analysis. Therefore, we considered Wagner diffusivity in our system to solve the problems and applied the concept of chemical effect on diffusion by taking the advantage that large amount of energy will release when compounds formed. Moreover, by inventing the holes markers made by Focus ion beam (FIB), we can conduct the diffusion experiment and obtain the tracer diffusivities of atoms inside the intermetallic compound. We applied the technique on Ni3Sn4 and Cu3Sn, which are two of the most common materials in electronic packaging, and the tracer diffusivities are measured under several different temperatures; moreover, microstructure of the intermetallic compounds are investigated to ensure the diffusion environment. Additionally, the detail diffusion mechanism was also discussed in aspect of diffusion activation enthalpy and diffusion pre-factor by using lattice structure simulation. Last but not the least, X-ray photoelectron spectroscopy and First principal calculation simulation were used to observe the electron binding energies in the intermetallic compound and illustrate the partial covalent bonding behavior in the intermetallic compounds.

Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

NASA Astrophysics Data System (ADS)

Lee, Byung-Suk; Yoon, Jeong-Won

2018-01-01

Cu-Sn solid-liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu6Sn5 and Cu3Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu3Sn SLID-bonded joint was superior to the conventional solder and the Cu6Sn5 SLID-bonded joints.

49 CFR 234.271 - Insulated rail joints, bond wires, and track connections.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Insulated rail joints, bond wires, and track connections. 234.271 Section 234.271 Transportation Other Regulations Relating to Transportation (Continued... joints, bond wires, and track connections. Insulated rail joints, bond wires, and track connections shall...

49 CFR 234.271 - Insulated rail joints, bond wires, and track connections.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 4 2011-10-01 2011-10-01 false Insulated rail joints, bond wires, and track connections. 234.271 Section 234.271 Transportation Other Regulations Relating to Transportation (Continued... joints, bond wires, and track connections. Insulated rail joints, bond wires, and track connections shall...

Diffusion bonding aeroengine components

NASA Astrophysics Data System (ADS)

Fitzpatrick, G. A.; Broughton, T.

1988-10-01

The use of diffusion bonding processes at Rolls-Royce for the manufacture of titanium-alloy aircraft engine components and structures is described. A liquid-phase diffusion bonding process called activated diffusion bonding has been developed for the manufacture of the hollow titanium wide chord fan blade. In addition, solid-state diffusion bonding is being used in the manufacture of hollow vane/blade airfoil constructions mainly in conjunction with superplastic forming and hot forming techniques.

Study of mechanical joint strength of aluminum alloy 7075-T6 and dual phase steel 980 welded by friction bit joining and weld-bonding under corrosion medium

DOE PAGES

Lim, Yong Chae; Squires, Lile; Pan, Tsung-Yu; ...

2014-12-30

We have employed a unique solid-sate joining process, called friction bit joining (FBJ), to spot weld aluminum alloy (AA) 7075-T6 and dual phase (DP) 980 steel. Static joint strength was studied in the lap shear tension configuration. In addition, weld-bonding (adhesive + FBJ) joints were studied in order to evaluate the ability of adhesive to mitigate the impact of corrosion on joint properties. Accelerated laboratory cyclic corrosion tests were carried out for both FBJ only and weld-bonding joints. Furthermore, the FBJ only joints that emerged from corrosion testing had lap shear failure loads that were significantly lower than freshly preparedmore » joints. However, weld-bonding specimens retained more than 80% of the lap shear failure load of the freshly prepared weld-bonding specimens. Moreover, examination of joint cross sections confirmed that the presence of adhesive in the weld-bonding joints mitigated the effect of the corrosion environment, compared to FBJ only joints.« less

Weld bonding of titanium with polyimide adhesives

NASA Technical Reports Server (NTRS)

Vaughan, R. W.; Sheppard, C. H.; Orell, M. K.

1975-01-01

A conductive adhesive primer and a capillary flow adhesive were developed for weld bonding titanium alloy joints. Both formulations contained ingredients considered to be non-carcinogenic. Lap-shear joint test specimens and stringer-stiffened panels were weld bonded using a capillary flow process to apply the adhesive. Static property information was generated for weld bonded joints over the temperature range of 219K (-65 F) to 561K (550 F). The capillary flow process was demonstrated to produce weld bonded joints of equal strength to the weld through weld bonding process developed previously.

Self-generated Local Heating Induced Nanojoining for Room Temperature Pressureless Flexible Electronic Packaging

PubMed Central

Peng, Peng; Hu, Anming; Gerlich, Adrian P.; Liu, Yangai; Zhou, Y. Norman

2015-01-01

Metallic bonding at an interface is determined by the application of heat and/or pressure. The means by which these are applied are the most critical for joining nanoscale structures. The present study considers the feasibility of room-temperature pressureless joining of copper wires using water-based silver nanowire paste. A novel mechanism of self-generated local heating within the silver nanowire paste and copper substrate system promotes the joining of silver-to-silver and silver-to-copper without any external energy input. The localized heat energy was delivered in-situ to the interfaces to promote atomic diffusion and metallic bond formation with the bulk component temperature stays near room-temperature. This local heating effect has been detected experimentally and confirmed by calculation. The joints formed at room-temperature without pressure achieve a tensile strength of 5.7 MPa and exhibit ultra-low resistivity in the range of 101.3 nOhm·m. The good conductivity of the joint is attributed to the removal of organic compounds in the paste and metallic bonding of silver-to-copper and silver-to-silver. The water-based silver nanowire paste filler material is successfully applied to various flexible substrates for room temperature bonding. The use of chemically generated local heating may become a potential method for energy in-situ delivery at micro/nanoscale. PMID:25788019

Design/Analysis of the JWST ISIM Bonded Joints for Survivability at Cryogenic Temperatures

NASA Technical Reports Server (NTRS)

Bartoszyk, Andrew; Johnston, John; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz; Rodini, Benjamin; Young, Daniel

2005-01-01

Contents include the following: JWST/ISIM introduction. Design and analysis challenges for ISIM bonded joints. JWST/ISIM joint designs. Bonded joint analysis. Finite element modeling. Failure criteria and margin calculation. Analysis/test correlation procedure. Example of test data and analysis.

A Novel Multiscale Design of Interfaces for Polymeric Composites and Bonded Joints using Additive Manufacturing

DTIC Science & Technology

2016-09-13

AFRL-AFOSR-VA-TR-2016-0317 A Novel Multiscale Design of Interfaces for Polymeric Composites and Bonded Joints using Additive Manufacturing Pavana...Composites and Bonded Joints using Additive Manufacturing AWARD NO.: FA9550-15-1-0216 AGENCY NAME: The Air Force Office of Scientific Research (AFOSR), Ar...20 3 Additive Manufacturing for Bonded Composite Joints 21 3.1 Introduction

Fabrication of high aspect grating using bonded substrate for X-ray refraction imaging by Talbot-Lau interferometer

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tada, Takuji; Murakoshi, Dai; Ishii, Hiroyasu

2012-07-31

In order to improve the image quality of X-ray refraction images using a Talbot-Lau interferometer, we have been attempting to fabricate gratings with high aspect ratio. In our attempt, deep grooves of grating structure were channeled on a Si substrate bonded by Au diffusion bonding method, and the grooves were filled with Au where the Au layer used for the bonding Si substrate was acting as a seed layer of Au electroplating. From the results of a visibility measurement and a cross sectional SEM image, it was confirmed that the grooves with a pitch of 5.8 {mu}m and a depthmore » of 100 {mu}m could be successfully filled with Au over a large area of 72 Multiplication-Sign 80 mm{sup 2}. Using this grating, the X-ray refraction images for the cartilage of a knee joint of a livestock pig could be obtained where SPS method was employed for the single-shot image acquisition.« less

Design/Analysis of the JWST ISIM Bonded Joints for Survivability at Cryogenic Temperatures

NASA Technical Reports Server (NTRS)

Bartoszyk, Andrew; Johnston, John; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz; Rodini,Benjamin; Young, Daniel

1990-01-01

A major design and analysis challenge for the JWST ISIM structure is thermal survivability of metal/composite bonded joints below the cryogenic temperature of 30K (-405 F). Current bonded joint concepts include internal invar plug fittings, external saddle titanium/invar fittings and composite gusset/clip joints all bonded to M55J/954-6 and T300/954-6 hybrid composite tubes (75mm square). Analytical experience and design work done on metal/composite bonded joints at temperatures below that of liquid nitrogen are limited and important analysis tools, material properties, and failure criteria for composites at cryogenic temperatures are sparse in the literature. Increasing this challenge is the difficulty in testing for these required tools and properties at cryogenic temperatures. To gain confidence in analyzing and designing the ISIM joints, a comprehensive joint development test program has been planned and is currently running. The test program is designed to produce required analytical tools and develop a composite failure criterion for bonded joint strengths at cryogenic temperatures. Finite element analysis is used to design simple test coupons that simulate anticipated stress states in the flight joints; subsequently the test results are used to correlate the analysis technique for the final design of the bonded joints. In this work, we present an overview of the analysis and test methodology, current results, and working joint designs based on developed techniques and properties.

Fatigue and Impact Strength of Diffusion Bonded Titanium Alloy Joints

DTIC Science & Technology

1989-02-01

likely to be due to the void level being such that the chance of a pore cluster being present at or near the test piece surface was less probable...in sub-surface crack initiation and reduced fatigue strength; it was concluded that small single voids were insignificant but clusters of voids...strength is reduced when clusters of pores are present, and is, in turn, a much more sensitive test than the tensile test. In the current work the

Failure mechanisms in wood joints bonded with urea-formaldehyde adhesives

Treesearch

B.H. River; R.O. Ebewele; G.E. Myers

1994-01-01

Wood joints bonded with urea-formaldehyde (UF) are weakened by cyclic swelling and shrinking. To study the failure mechanisms in UF-bonded joints, specimens were bonded with unmodified, modified (amine), or phenol formaldehyde adhesive and subjected to accelerated aging. Modification of the adhesive properties increased the cleavage fracture toughness and shear...

Design/analysis of the JWST ISIM bonded joints for survivability at cryogenic temperatures

NASA Astrophysics Data System (ADS)

Bartoszyk, Andrew; Johnston, John; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz; Rodini, Benjamin; Young, Daniel

2005-08-01

A major design and analysis challenge for the JWST ISIM structure is thermal survivability of metal/composite adhesively bonded joints at the cryogenic temperature of 30K (-405°F). Current bonded joint concepts include internal invar plug fittings, external saddle titanium/invar fittings and composite gusset/clip joints all bonded to hybrid composite tubes (75mm square) made with M55J/954-6 and T300/954-6 prepregs. Analytical experience and design work done on metal/composite bonded joints at temperatures below that of liquid nitrogen are limited and important analysis tools, material properties, and failure criteria for composites at cryogenic temperatures are sparse in the literature. Increasing this challenge is the difficulty in testing for these required tools and properties at cryogenic temperatures. To gain confidence in analyzing and designing the ISIM joints, a comprehensive joint development test program has been planned and is currently running. The test program is designed to produce required analytical tools and develop a composite failure criterion for bonded joint strengths at cryogenic temperatures. Finite element analysis is used to design simple test coupons that simulate anticipated stress states in the flight joints; subsequently, the test results are used to correlate the analysis technique for the final design of the bonded joints. In this work, we present an overview of the analysis and test methodology, current results, and working joint designs based on developed techniques and properties.

Preparation and testing of corrosion and spallation-resistant coatings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hurley, John P.; Cavalli, Matthew N.

2016-06-30

The goal of this project was to take a recently developed method of bonding oxide dispersion-strengthened (ODS) FeCrAl plating to nickel superalloys closer to commercial use in syngas-fired turbines. The project was designed to better understand and develop the bonding process and to determine if plating APMT®, a specific highly oxidation-resistant ODS FeCrAl alloy made by Kanthal, onto nickel-based superalloy turbine parts is a viable method for substantially improving the lifetimes and maximum use temperatures of the parts. The superalloys investigated for protection were CM247LC and Rene® 80, both alumina scale-forming alloys. The method for bonding the APMT plate tomore » the superalloys is called evaporative metal bonding, which involves placing a thin foil of zinc between the plate and the superalloy, clamping them together, and heating in an atmosphere-controlled furnace. Upon heating, the zinc melts and dissolves the oxide skins of the alloys at the bond line, allowing the two alloys to diffuse into each other. The zinc then diffuses through the alloys and evaporates from their surfaces, creating a bond between the APMT and the superalloy that is stronger than the APMT itself. Testing showed that the diffusivity of zinc in both APMT and CM247LC is quite similar at 700°C but 15 times higher in the APMT at 1214°C. Coefficients of thermal expansion were determined for each of the alloys as a function of temperature. This information was entered into a finite-element model using ANSYS, which was used to design a clamping jig for pressing the APMT to the superalloys at the bonding temperature. Scanning electron microscopy analyses of representative joints showed that no zinc remained in the alloys after bonding Unfortunately, the analyses also showed some small pieces of broken aluminum oxide scale near the bond lines, indicating that its scale was not sufficiently removed during prebonding cleaning. Samples from each of the bonded blocks were sent to Siemens for its standard oxidation, spallation, and corrosion testing, which was scheduled for completion in the spring of 2016. However, because of commercial demands, the tests were not completed by the time of this report except some initial spallation tests at 1150°C. In those tests, several of the APMT plates separated from the CM247LC, likely because of the remaining aluminum oxide scale on the surface of the CM247LC. This implies that surface preparation may need to include machining to remove the oxide scale before bonding rather than just sandblasting. In previous tensile testing at 950°C, the breaks in the tensile samples always occurred in the APMT and not at the joints. Gasifier sampling was completed to determine what types of trace contaminants may occur in cleaned and combusted syngas and that could lead to corrosion or deposition in turbines firing coal syngas. The sampling was done from a pressurized fluidized-bed gasifier and a pressurized entrained-flow gasifier. The particles captured on a filter from syngas were typically 0.2 to 0.5 μm in diameter, whereas those captured from the combusted syngas were slightly larger and more spherical. X-ray photoelectron spectroscopy done at Oak Ridge National Laboratory showed that the particles do not contain any metals and have an atomic composition almost identical to that of the polycarbonate filter. This indicates that the particles are primarily soot-based and not formed from volatilization of metals in the gasifiers.« less

Interfacial Characterization of Dissimilar Joints Between Al/Mg/Al-Trilayered Clad Sheet to High-Strength Low-Alloy Steel

NASA Astrophysics Data System (ADS)

Macwan, A.; Jiang, X. Q.; Chen, D. L.

2015-07-01

Magnesium (Mg) alloys are increasingly used in the automotive and aerospace sectors to reduce vehicle weight. Al/Mg/Al tri-layered clad sheets are deemed as a promising alternative to improve the corrosion resistance and formability of Mg alloys. The structural application of Al/Mg/Al tri-layered clad sheets inevitably involves welding and joining in the multi-material vehicle body manufacturing. This study aimed to characterize the bonding interface microstructure of the Al/Mg/Al-clad sheet to high-strength low-alloy steel with and without Zn coating using ultrasonic spot welding at different levels of welding energy. It was observed that the presence of Zn coating improved the bonding at the interface due to the formation of Al-Zn eutectic structure via enhanced diffusion. At a higher level of welding energy, characteristic flow patterns of Zn into Al-clad layer were observed with an extensive penetration mainly along some high angle grain boundaries. The dissimilar joints without Zn coating made at a high welding energy of 800 J failed partially from the Al/Fe weld interface and partially from the Al/Mg clad interface, while the joints with Zn coating failed from the Al/Mg clad interface due to the presence of brittle Al12Mg17 phase.

49 CFR 236.711 - Bond, rail joint.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Bond, rail joint. 236.711 Section 236.711 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION... Bond, rail joint. A metallic connection attached to adjoining rails to insure electrical conductivity. ...

Development of a Cu-Sn based brazing system with a low brazing and a high remelting temperature

NASA Astrophysics Data System (ADS)

Schmieding, M.; Holländer, U.; Möhwald, K.

2017-03-01

Objective of the project presented is the development of a joining process for hot working steel components at low brazing temperatures leading to a bond with a much higher remelting temperature. This basically is achieved by the use of a Cu-Sn melt spinning foil combined with a pure Cu foil. During brazing, the Sn content of the foil is decreased by diffusion of Sn into the additional Cu resulting in a homogenious joint with a increased remelting temperature of the filler metal. Within this project specimens were brazed and diffusion annealed in a vacuum furnace at 850 °C varying the processing times (0 - 10 h). The samples prepared were studied metallographically and diffusion profiles of Sn were recorded using EDX line scans. The results are discussed in view of further investigations and envisaged applications.

Laser Welding-Brazing of Immiscible AZ31B Mg and Ti-6Al-4V Alloys Using an Electrodeposited Cu Interlayer

NASA Astrophysics Data System (ADS)

Zhang, Zequn; Tan, Caiwang; Wang, Gang; Chen, Bo; Song, Xiaoguo; Zhao, Hongyun; Li, Liqun; Feng, Jicai

2018-03-01

Metallurgical bonding between immiscible system AZ31B magnesium (Mg) and Ti-6Al-4V titanium (Ti) was achieved by adding Cu interlayer using laser welding-brazing process. Effect of the laser power on microstructure evolution and mechanical properties of Mg/Cu-coated Ti joints was studied. Visually acceptable joints were obtained at the range of 1300 to 1500 W. The brazed interface was divided into three parts due to temperature gradient: direct irradiation zone, intermediate zone and seam head zone. Ti3Al phase was produced along the interface at the direct irradiation zone. Ti-Al reaction layer grew slightly with the increase in laser power. A small amount of Ti2(Cu,Al) interfacial compounds formed at the intermediate zone and the ( α-Mg + Mg2Cu) eutectic structure dispersed in the fusion zone instead of gathering when increasing the laser power at this zone. At the seam head zone, Mg-Cu eutectic structure was produced in large quantities under all cases. Joint strength first increased and then decreased with the variation of the laser power. The maximum fracture load of Mg/Cu-coated Ti joint reached 2314 N at the laser power of 1300 W, representing 85.7% joint efficiency when compared with Mg base metal. All specimens fractured at the interface. The feature of fracture surface at the laser power of 1100 W was characterized by overall smooth surface. Obvious tear ridge and Ti3Al particles were observed at the fracture surface with increase in laser power. It suggested atomic diffusion was accelerated with more heat input giving rise to the enhanced interfacial reaction and metallurgical bonding in direct irradiation zone, which determined the mechanical properties of the joint.

Push-off tests and strength evaluation of joints combining shrink fitting with bonding

NASA Astrophysics Data System (ADS)

Yoneno, Masahiro; Sawa, Toshiyuki; Shimotakahara, Ken; Motegi, Yoichi

1997-03-01

Shrink fitted joints have been used in mechanical structures. Recently, joints combining shrink fitting with anaerobic adhesives bonded between the shrink fitted surfaces have been appeared in order to increase the joint strength. In this paper, push-off test was carried out on strength of joints combining shrink fitting with bonding by material testing machine. In addition, the push-off strength of shrink fitting joints without an anaerobic adhesive was also measured. In the experiments, the effects of the shrinking allowance and the outer diameter of the rings on the joint strength are examined. The interface stress distribution in bonded shrink fitted joints subjected to a push-off load is analyzed using axisymmetrical theory of elasticity as a four-body contact problem. Using the interface stress distribution, a method for estimating joint strength is proposed. The experimental results are in a fairly good agreement with the numerical results. It is found that the strength of combination joints is greater than that of shrink fitted joints.

Rapid ultrasound-induced transient-liquid-phase bonding of Al-50Si alloys with Zn interlayer in air for electrical packaging application.

PubMed

Wang, Qian; Chen, Xiaoguang; Zhu, Lin; Yan, Jiuchun; Lai, Zhiwei; Zhao, Pizhi; Bao, Juncheng; Lv, Guicai; You, Chen; Zhou, Xiaoyu; Zhang, Jian; Li, Yuntao

2017-01-01

Al-50Si alloys were joined by rapid ultrasound-induced transient-liquid-phase bonding method using Zn foil as interlayer at 390°C in air, below the melt point of interlayer. The fracture of oxide films along the edge of Si particles led to contact and inter-diffusion between aluminum substrate and Zn interlayer, and liquefied Zn-Al alloys were developed. The width of Zn-Al alloys gradually decreased with increasing the ultrasonic vibration time due to liquid squeezing out and accelerated diffusion. A stage of isothermal solidification existed, and the completion time was significantly shortened. In the liquid metal, the acoustic streaming and ultrasonic cavitations were induced. As the process developed, much more Si particles, which were particulate-reinforced phases of Al-50Si, gradually migrated to the center of soldering seam. The highest average shear strength of joints reached to 94.2MPa, and the fracture mainly occurred at the base metal. Copyright © 2016 Elsevier B.V. All rights reserved.

Adhesive Bonding Characterization of Composite Joints for Cryogenic Usage

NASA Technical Reports Server (NTRS)

Graf, Neil A.; Schieleit, Gregory F.; Biggs, Robert

2000-01-01

The development of polymer composite cryogenic tanks is a critical step in creating the next generation of launch vehicles. Future reusable launch vehicles need to minimize the gross liftoff weight (GLOW). This weight reduction is possible due to the large reduction in weight that composite materials can provide over current aluminum technology. In addition to composite technology, adhesively bonded joints potentially have several benefits over mechanically fastened joints, such as weight savings and cryogenic fluid containment. Adhesively bonded joints may be used in several areas of these cryogenic tanks, such as in lobe-to-lobe joints (in a multi-lobe concept), skirt-to-tank joint, strut-to-tank joint, and for attaching stringers and ring frames. The bonds, and the tanks themselves, must be able to withstand liquid cryogenic fuel temperatures that they contain. However, the use of adhesively bonded composite joints at liquid oxygen and hydrogen temperatures is largely unknown and must be characterized. Lockheed Martin Space Systems Company, Michoud Operations performed coupon-level tests to determine effects of material selection, cure process parameters, substrate surface preparation, and other factors on the strength of these composite joints at cryogenic temperatures. This led to the selection of a material and process that would be suitable for a cryogenic tank. KEY WORDS: Composites, Adhesive Bonding, Cryogenics

Thin-film metallic glass: an effective diffusion barrier for Se-doped AgSbTe2 thermoelectric modules

PubMed Central

Yu, Chia-Chi; Wu, Hsin-jay; Deng, Ping-Yuan; Agne, Matthias T.; Snyder, G. Jeffrey; Chu, Jinn P.

2017-01-01

The thermal stability of joints in thermoelectric (TE) modules, which are degraded during interdiffusion between the TE material and the contacting metal, needs to be addressed in order to utilize TE technology for competitive, sustainable energy applications. Herein, we deposit a 200 nm-thick Zr-based thin-film metallic glass (TFMG), which acts as an effective diffusion barrier layer with low electrical contact resistivity, on a high-zT Se-doped AgSbTe2 substrate. The reaction couples structured with TFMG/TE are annealed at 673 K for 8–360 hours and analyzed by electron microscopy. No observable IMCs (intermetallic compounds) are formed at the TFMG/TE interface, suggesting the effective inhibition of atomic diffusion that may be attributed to the grain-boundary-free structure of TFMG. The minor amount of Se acts as a tracer species, and a homogeneous Se-rich region is found nearing the TFMG/TE interface, which guarantees satisfactory bonding at the joint. The diffusion of Se, which has the smallest atomic volume of all the elements from the TE substrate, is found to follow Fick’s second law. The calculated diffusivity (D) of Se in TFMG falls in the range of D~10−20–10−23(m2/s), which is 106~107 and 1012~1013 times smaller than those of Ni [10−14–10−17(m2/s)] and Cu [10−8–10−11(m2/s)] in Bi2Te3, respectively. PMID:28327655

Analysis of Bonded Joints Between the Facesheet and Flange of Corrugated Composite Panels

NASA Technical Reports Server (NTRS)

Yarrington, Phillip W.; Collier, Craig S.; Bednarcyk, Brett A.

2008-01-01

This paper outlines a method for the stress analysis of bonded composite corrugated panel facesheet to flange joints. The method relies on the existing HyperSizer Joints software, which analyzes the bonded joint, along with a beam analogy model that provides the necessary boundary loading conditions to the joint analysis. The method is capable of predicting the full multiaxial stress and strain fields within the flange to facesheet joint and thus can determine ply-level margins and evaluate delamination. Results comparing the method to NASTRAN finite element model stress fields are provided illustrating the accuracy of the method.

[A study on the bond interface between low-fusing dental porcelain and pure titanium].

PubMed

Mo, A; Cen, Y; Liao, Y; Wang, J; Shi, X

2001-09-01

To evaluate the bond interface between low fusing dental porcelain and pure titanium by observing the topography and detecting the ionic diffusion in the interface area. The low fusing-porcelain La-porcelain produced by the authors or Vita Titankeramik porcelain was fused to the surfaces of pure titanium. The topography of the interface between pure titanium and porcelain, and the structure of experimental materials were observed with SEM. The state of ionic diffusion in the interface area was investigated with EPMA. Excellent permeation and diffusion of La-porcelain were observed on the surfaces of pure titanium. The diffusion of ions of stannum and silicon was discovered in the interface area. The microstructure of La-porcelain to pure titanium bond interface was finer than that of Vita Titankeramik porcelain. Excellent bond can be produced in the interface between La-porcelain and pure titanium. The bonding mechanism may involve mechanical bond and chemical bond. The ionic diffusion of stannum plays an important role in the bonding of porcelain to pure titanium.

Interface bonding of SA508-3 steel under deformation and high temperature diffusion

NASA Astrophysics Data System (ADS)

Xu, Bin; Shao, Chunjuan; Sun, Mingyue

2018-05-01

There are mainly two parameters affecting high temperature interface bonding: deformation and diffusion. To study these two parameters, interface bonding of SA508-3 bainitic steel at 1100°C are simulated by gleeble3500 thermal simulator. The results show that interface of SA508-3 steel can be bonded under deformation and high temperature. For a specimen pressed at 1100°C without further high temperature diffusion, a reduction ratio of 30% can make the interface begun to bond, but the interface is still part of the grain boundary and small grains exist near the interface. When reduction ratio reaches 50%, the interface can be completely bonded and the microstructure near the interface is the same as that of the base material. When deformation is small, long time diffusion can also help the interface bonding. The results show that when the diffusion time is long enough, the interface under small deformation can also be bonded. For a specimen holding for 24h at 1100°C, only 13% reduction ratio is enough for interface bonding.

Ultrasonic guided wave monitoring of composite wing skin-to-spar bonded joints in aerospace structures

NASA Astrophysics Data System (ADS)

Matt, Howard; Bartoli, Ivan; Lanza di Scalea, Francesco

2005-10-01

The monitoring of adhesively bonded joints by ultrasonic guided waves is the general topic of this paper. Specifically, composite-to-composite joints representative of the wing skin-to-spar bonds of unmanned aerial vehicles (UAVs) are examined. This research is the first step towards the development of an on-board structural health monitoring system for UAV wings based on integrated ultrasonic sensors. The study investigates two different lay-ups for the wing skin and two different types of bond defects, namely poorly cured adhesive and disbonded interfaces. The assessment of bond state is based on monitoring the strength of transmission through the joints of selected guided modes. The wave propagation problem is studied numerically by a semi-analytical finite element method that accounts for viscoelastic damping, and experimentally by ultrasonic testing that uses small PZT disks preferably exciting and detecting the single-plate s0 mode. Both the models and the experiments confirm that the ultrasonic energy transmission through the joint is highly dependent on the bond conditions, with defected bonds resulting in increased transmission strength. Large sensitivity to the bond conditions is found at mode coupling points, as a result of the large interlayer energy transfer.

Design and fabrication of realistic adhesively bonded joints

NASA Technical Reports Server (NTRS)

Shyprykevich, P.

1983-01-01

Eighteen bonded joint test specimens representing three different designs of a composite wing chordwise bonded splice were designed and fabricated using current aircraft industry practices. Three types of joints (full wing laminate penetration, two side stepped; midthickness penetration, one side stepped; and partial penetration, scarfed) were analyzed using state of the art elastic joint analysis modified for plastic behavior of the adhesive. The static tensile fail load at room temperature was predicted to be: (1) 1026 kN/m (5860 1b/in) for the two side stepped joint; (2) 925 kN/m (5287 1b/in) for the one side stepped joint; and (3) 1330 kN/m (7600 1b/in) for the scarfed joint. All joints were designed to fail in the adhesive.

Dual resin bonded joints in polyetheretherketone (PEEK) matrix composites

NASA Astrophysics Data System (ADS)

Zelenak, Steve; Radford, Donald W.; Dean, Michael W.

1993-04-01

The paper describes applications of the dual resin (miscible polymer) bonding technique (Smiley, 1989) developed as an alternative to traditional bonding approaches to joining thermoplastic matrix composite subassemblies into structures. In the experiments, the performance of joint geometries, such as those that could be used to assemble large truss structures in space, are investigated using truss joint models consisting of woven carbon fiber/PEEK tubes of about 1 mm wall thickness. Specific process conditions and hand-held hardware used to apply heat and pressure were chosen to simulate a field asembly technique. Results are presented on tube/cruciform double lap shear tests, pinned-pinned tube compression tests, and single lap shear bond tests of joints obtained using the dual resin bonding technique.

Application of Bionic Design to FRP T-Joints

NASA Astrophysics Data System (ADS)

Luo, Guang-Min; Kuo, Chia-Hung

2017-09-01

We applied the concepts of bionics to enhance the mechanical strength of fiberglass reinforced plastic T-joints. The failure modes of the designed arthrosis-like and gum-like joints were determined using three-point bending tests and numerical simulations and compared with those of normal T-joints bonded using structural adhesives. In the simulation, we used cohesive elements to simulate the adhesive interface of the structural adhesive. The experimental and simulation results show that the arthrosis-like joint can effectively delay the failure progress and enhance the bonding strength of T-joints, thus confirming that an appropriate bionic design can effectively control the bonding properties of structural adhesives.

Fabrication and Characterization of Diffusion Bonds for Silicon Carbide

NASA Technical Reports Server (NTRS)

Halbig, Michael; Singh, Mrityunjay; Martin, Richard E.; Cosgriff, Laura M.

2007-01-01

Diffusion bonds of silicon carbide (SiC) were fabricated using several different types of titanium (Ti) based interlayers between the SiC substrates. The interlayers were an alloyed Ti foil, a pure Ti foil, and a physically vapor deposited (PVD) Ti coating. Microscopy was conducted to evaluate the cross-sections of the resulting bonds. Microprobe analysis identified reaction formed phases in the diffusion bonded region. Uniform and well adhered bonds were formed between the SiC substrates. In the case where the alloyed Ti foil or a thick Ti coating (i.e. 20 micron) was used as the interlayer, microcracks and several phases were present in the diffusion bonds. When a thinner interlayer was used (i.e. 10 micron PVD Ti), no microcracks were observed and only two reaction formed phases were present. The two phases were preferred and fully reacted phases that did not introduce thermal stresses or microcracks during the cool-down stage after processing. Diffusion bonded samples were evaluated with the non-destructive evaluation (NDE) methods of pulsed thermography and immersion ultrasonic testing. Joined SiC substrates that were fully bonded and that had simulated bond flaws in the interlayer were also evaluated using immersion ultrasound. Pull testing was conducted on the bonds to determine the tensile strength. To demonstrate the joining approach for a complex multilayered component for a low NOx injector application, the diffusion bonding approach was used to join three 4" diameter SiC discs that contained complex fuel and air flow channels.

Global-Local Finite Element Analysis of Bonded Single-Lap Joints

NASA Technical Reports Server (NTRS)

Kilic, Bahattin; Madenci, Erdogan; Ambur, Damodar R.

2004-01-01

Adhesively bonded lap joints involve dissimilar material junctions and sharp changes in geometry, possibly leading to premature failure. Although the finite element method is well suited to model the bonded lap joints, traditional finite elements are incapable of correctly resolving the stress state at junctions of dissimilar materials because of the unbounded nature of the stresses. In order to facilitate the use of bonded lap joints in future structures, this study presents a finite element technique utilizing a global (special) element coupled with traditional elements. The global element includes the singular behavior at the junction of dissimilar materials with or without traction-free surfaces.

Test and analysis of Celion 3000/PMR-15, graphite/polyimide bonded composite joints: Data report

NASA Technical Reports Server (NTRS)

Cushman, J. B.; Mccleskey, S. F.; Ward, S. H.

1982-01-01

Standard single lap, double lap and symmetric step lap bonded joints of Celion 3000/PMR-15 graphite/polyimide composite were evaluated. Composite to composite and composite to titanium joints were tested at 116 K (-250 F), 294 K (70 F) and 561 K (550 F). Joint parameters evaluated are lap length, adherend thickness, adherend axial stiffness, lamina stacking sequence and adherend tapering. Advanced joint concepts were examined to establish the change in performance of preformed adherends, scalloped adherends and hybrid systems. The material properties of the high temperature adhesive, designated A7F, used for bonding were established. The bonded joint tests resulted in interlaminar shear or peel failures of the composite and there were very few adhesive failures. Average test results agree with expected performance trends for the various test parameters. Results of finite element analyses and of test/analysis correlations are also presented.

Reactive eutectic brazing of nitinol

NASA Astrophysics Data System (ADS)

Low, Ke-Bin

Although NiTiNb alloys are well known as wide-hysteresis shape-memory alloys with important applications as coupling materials, the significance of one aspect of the Ni-Ti-Nb ternary system has not been fully appreciated. Based on the existence of a quasibinary NiTi-Nb eutectic isopleth in this ternary system, a novel braze method has been devised to fabricate metallurgical bonds between functional nitinol (NiTi) sections. When NiTi and pure Nb are brought into contact at temperatures above 1170°C, spontaneous melting occurs, forming a liquid that is extremely reactive and not only wets NiTi surfaces, but also apparently dissolves oxide scales, obviating the need for fluxes and providing for efficient capillary flow into joint crevices. The melting process is diffusion-controlled and rate-limited by the diffusivity of Nb in the liquid. The braze liquid will subsequently solidify into microstructures containing predominantly ordered NiTi and disordered bcc-Nb. Mechanical tests revealed that the braze joints are strong, ductile, and biocompatible. With appropriate post-braze aging, the functional performance of the parent NiTi alloy can be restored. Micro-alloying the Nb fluer metal with Zr or tungsten showed great potential for solution-strengthening of the braze joints. For applications where biocompatibility is not an issue, Nb metal can be substituted by pure vanadium as the braze filler, which is demonstrated to possess tensile strengths that can be potentially superior to the Nb counterparts.

Study of Diffusion Barrier for Solder/ n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules

NASA Astrophysics Data System (ADS)

Lin, Wen-Chih; Li, Ying-Sih; Wu, Albert T.

2018-01-01

This paper investigates the interfacial reaction between Sn and Sn3Ag0.5Cu (SAC305) solder on n-type Bi2Te3 thermoelectric material. An electroless Ni-P layer successfully suppressed the formation of porous SnTe intermetallic compound at the interface. The formation of the layers between Bi2Te3 and Ni-P indicates that Te is the dominant diffusing species. Shear tests were conducted on both Sn and SAC305 solder on n- and p-type Bi2Te3 with and without a Ni-P barrier layer. Without a Ni-P layer, porous SnTe would result in a more brittle fracture. A comparison of joint strength for n- and p-type thermoelectric modules is evaluated by the shear test. Adding a diffusion barrier increases the mechanical strength by 19.4% in n-type and 74.0% in p-type thermoelectric modules.

Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.

PubMed

Wu, Bingzhi; Leng, Xuesong; Xiu, Ziyang; Yan, Jiuchun

2018-06-01

SiC ceramics were successfully soldered with the assistance of ultrasound. Two kinds of filler metals, namely non-eutectic Zn-5Al-3Cu and eutectic Zn-5Al alloys, were used. The effects of ultrasonic action on the microstructure and mechanical properties of the soldered joints were investigated. The results showed that ultrasound could promote the wetting and bonding between the SiC ceramic and filler metals within tens of seconds. For the Zn-5Al-3Cu solder, a fully grain-refined structure in the bond layer was obtained as the ultrasonic action time increased. This may lead to a substantial enhancement in the strength of the soldered joints. For the Zn-5Al solder, the shear strength of the soldered joints was only ∼102 MPa when the ultrasonic action time was shorter, and fractures occurred in the brittle lamellar eutectic phases in the center of the bond layer. With increasing ultrasonic action time, the lamellar eutectic phase in the bond layer of SiC joints could be completely transformed to a fine non-lamellar eutectic structure. Meanwhile, the grains in the bond layer were obviously refined. Those results led to the remarkable enhancement of the shear strength of the joints (∼138 MPa) using the Zn-5Al solder, which had approached that enhancement using the Zn-5Al-3Cu solder. The enhanced mechanical properties of the joints were attributed to the significant refinement of the grains and the change in the eutectic structure in the bond layer. Prolonged enhanced heterogeneous nucleation triggered by ultrasonic cavitation is the predominant refinement mechanism of the bond metals of the SiC joints. Copyright © 2018 Elsevier B.V. All rights reserved.

Lightning Protection and Structural Bonding for the B2 Test Stand

NASA Technical Reports Server (NTRS)

Kinard, Brandon

2015-01-01

With the privatization of the space industry, NASA has entered a new era. To explore deeper parts of the solar system, NASA is developing a new spacecraft, the Space Launch System (SLS), capable of reaching these destinations, such as an asteroid or Mars. However, the test stand that is capable of testing the stage has been unused for many years. In addition to the updating/repair of the stand, more steel is being added to fully support the SLS. With all these modifications, the lightning protection system must be brought up to code to assure the protection of all personnel and assets. Structural bonding is a part of the lightning protection system. The focus of this project was to assure proper structural bonding. To begin, all relevant technical standards and the construction specifications were reviewed. This included both the specifications for the lightning protection and for general construction. The drawings were reviewed as well. From the drawings, bolted structural joints were reviewed to determine whether bonding was necessary. Several bolted joints were determined to need bonding according to the notes in the drawings. This exceeds the industry standards. The bolted joints are an electrically continuous joint. During tests, the stand experiences heavy vibration that may weaken the continuity of the bolted joint. Therefore, the secondary bonding is implemented to ensure that the structural joint has low resistance. If the structural joint has a high resistance because of corrosion, a potential gradient can occur that can cause a side flash. Damage, injury, or death can occur from a side flash so they are to be prevented. A list of the identified structural joints was compiled and sent to the contractor to be bonded. That covers the scope of this project.

Diffusion bonding of IN 718 to VM 350 grade maraging steel

NASA Technical Reports Server (NTRS)

Crosby, S. R.; Biederman, R. R.; Reynolds, C. C.

1972-01-01

Diffusion bonding studies have been conducted on IN 718, VM 350 and the dissimilar alloy couple, IN 718 to maraging steel. The experimental processing parameters critical to obtaining consistently good diffusion bonds between IN 718 and VM 350 were determined. Interrelationships between temperature, pressure and surface preparation were explored for short bending intervals under vacuum conditions. Successful joining was achieved for a range of bonding cycle temperatures, pressures and surface preparations. The strength of the weaker parent material was used as a criterion for a successful tensile test of the heat treated bond. Studies of VM-350/VM-350 couples in the as-bonded condition showed a greater yielding and failure outside the bond region.

Evaluation of tantalum 316 stainless steel transition joints

NASA Technical Reports Server (NTRS)

Stoner, D. R.

1972-01-01

Tubular transition joints providing a metallurgically bonded connection between tantalum and 316 stainless steel pipe sections were comparatively evaluated for durability under thermal cycling conditions approximating the operation of a SNAP-8 mercury boiler. Both coextruded and vacuum brazed transition joints of 50mm (2 inch) diameter were tested by thermal cycling 100 times between 730 C and 120 C(1350 F and 250 F) in a high vacuum environment. The twelve evaluated transition joints survived the full test sequence without developing leaks, although liquid penetrant bond line indications eventually developed in all specimens. The brazed transition joints exhibited the best dimensional stability and bond line durability.

Bonded joint and method. [for reducing peak shear stress in adhesive bonds

NASA Technical Reports Server (NTRS)

Sainsbury-Carter, J. B. (Inventor)

1974-01-01

An improved joint is described for reducing the peak shear stress in adhesive bonds when adhesives are used to bond two materials which are in a lapped relationship and which differ in value of modulus of elasticity. An insert placed between the adhesive and one of the two materials acts to cushion the discontinuity of material stiffness thereby reducing the peak shear stress in the adhesive bond.

Silver flip chip interconnect technology and solid state bonding

NASA Astrophysics Data System (ADS)

Sha, Chu-Hsuan

In this dissertation, fluxless transient liquid phase (TLP) bonding and solid state bonding between thermal expansion mismatch materials have been developed using Ag-In binary systems, pure Au, Ag, and Cu-Ag composite. In contrast to the conventional soldering process, fluxless bonding technique eliminates any corrosion and contamination problems caused by flux. Without flux, it is possible to fabricate high quality joints in large bonding areas where the flux is difficult to clean entirely. High quality joints are crucial to bonding thermal expansion mismatch materials since shear stress develops in the bonded pair. Stress concentration at voids in joints could increases breakage probability. In addition, intermetallic compound (IMC) formation between solder and underbump metallurgy (UBM) is essential for interconnect joint formation in conventional soldering process. However, the interface between IMC and solder is shown to be the weak interface that tends to break first during thermal cycling and drop tests. In our solid state bonding technique, there is no IMC involved in the bonding between Au to Au, Ag and Cu, and Ag and Au. All the reliability issues related to IMC or IMC growth is not our concern. To sum up, ductile bonding media, such as Ag or Au, and proper metallic layered structure are utilized in this research to produce high quality joints. The research starts with developing a low temperature fluxless bonding process using electroplated Ag/In/Ag multilayer structures between Si chip and 304 stainless steel (304SS) substrate. Because the outer thin Ag layer effectively protects inner In layer from oxidation, In layer dissolves Ag layer and joints to Ag layer on the to-be-bonded Si chip when temperature reaches the reflow temperature of 166ºC. Joints consist of mainly Ag-rich Ag-In solid solution and Ag2In. Using this fluxless bonding technique, two 304SS substrates can be bonded together as well. From the high magnification SEM images taken at cross-section, there is no void or gap observed. The new bonding technique presented should be valuable in packaging high power electronic devices for high temperature operations. It should also be useful to bond two 304SS parts together at low bonding temperature of 190ºC. Solid state bonding technique is then introduced to bond semiconductor chips, such as Si, to common substrates, such as Cu or alumina, using pure Ag and Au at a temperature matching the typical reflow temperature used in packaging industries, 260°C. In bonding, we realize the possibilities of solid state bonding of Au to Au, Au to Ag, and Ag to Cu. The idea comes from that Cu, Ag, and Au are located in the same column on periodic table, meaning that they have similar electronic configuration. They therefore have a better chance to share electrons. Also, the crystal lattice of Cu, Ag, and Au is the same, face-centered cubic. In the project, the detailed bonding mechanism is beyond the scope and here we determine the bonding by the experimental result. Ag is chosen as the joint material because of its superior physical properties. It has the highest electrical and thermal conductivities among all metals. It has low yield strength and is relatively ductile. Au is considered as well because its excellent ductility and fatigue resistance. Thus, the Ag or Au joints can deform to accommodate the shear strain caused by CTE mismatch between Si and Cu. Ag and Au have melting temperatures higher than 950°C, so the pure Ag or Au joints are expected to sustain in high operating temperature. The resulting joints do not contain any intermetallic compound. Thus, all reliability issues associated with intermetallic growth in commonly used solder joints do not exist anymore. We finally move to the applications of solid state Ag bonding in flip chip interconnects design. At present, nearly all large-scale integrated circuit (IC) chips are packaged with flip-chip technology. This means that the chip is flipped over and the active (front) side is connected to the package using a large number of tiny solder joints, which provide mechanical support, electrical connection, and heat conduction. For chip-to-package level interconnects, a challenge is the severe mismatch in coefficient of thermal expansion (CTE) between chips and package substrates. The interconnect material thus needs to be compliant to deal with the CTE mismatch. At present, nearly all flip-chip interconnects in electronic industries are made of lead-free Sn-based solders. Soft solders are chosen due to high ductility, low yield strength, relatively low melting temperature, and reasonably good electrical and thermal conductivities. In the never ending scaling down trend, more and more transistors are placed on the same Si chip size. This results in larger pin-out numbers and smaller solder joints. According to International Technology Roadmap for Semiconductors (ITRS), by 2018, the pitch in flip-chip interconnects will become smaller than 70mum for high performance applications. Two problems occur. The first is increase in shear strain. The aspect ratio of flip-chip joints is constrained to 0.7 because it goes through molten phase in the reflow process. Therefore, smaller joints become shorter as well, resulting in larger shear strain arising from CTE mismatch between Si chips and package substrates. The second is increase in stress in the joints. Since intermetallic (IMC) thickness in the joint does not scale down with joint size, ratio of IMC thickness to joint height increases. This further enlarges the shear stress because the IMC does not deform as the soft solder does to accommodate CTE mismatch. In this research, the smallest dimension we achieve for Ag flip chip interconnect joint is 15mum in diameter. The ten advantages of Ag flip chip interconnect technology can be identified as (a) High electrical conductivity, 7.7 times of that of Pb-free solders, (b) High thermal conductivity, 5.2 times of that of Pb-free solders, (c) Completely fluxless, (d) No IMCs; all reliability issues associated with IMC and IMC growth do not exist, (e) Ag is very ductile and can manage CTE mismatch between chips and packages, (f) Ag joints can sustain at very high operation temperature because Ag has high melting temperature of 961°C, (g) No molten phase involved; the bump can better keep its shape and geometry, (h) No molten phase involved; bridging of adjacent bumps is less likely to occur, i. Aspect ratio of bumps can be made greater than 1, (j) The size of the bumps is only limited by the lithographic process. Cu-Ag composite flip chip interconnect joints is developed based on three reasons. The first is lower material cost. The second is to strengthen the columns because the yield strength of Cu is 6 times of that of Ag. The third is to avoid possible Ag migration between Ag electrodes under voltage at temperatures above 250°C. This Cu-Ag composite design presents a solution in the path to the scale down roadmap.

Metallic Thin-Film Bonding and Alloy Generation

NASA Technical Reports Server (NTRS)

Peotter, Brian S. (Inventor); Fryer, Jack Merrill (Inventor); Campbell, Geoff (Inventor); Droppers, Lloyd (Inventor)

2016-01-01

Diffusion bonding a stack of aluminum thin films is particularly challenging due to a stable aluminum oxide coating that rapidly forms on the aluminum thin films when they are exposed to atmosphere and the relatively low meting temperature of aluminum. By plating the individual aluminum thin films with a metal that does not rapidly form a stable oxide coating, the individual aluminum thin films may be readily diffusion bonded together using heat and pressure. The resulting diffusion bonded structure can be an alloy of choice through the use of a carefully selected base and plating metals. The aluminum thin films may also be etched with distinct patterns that form a microfluidic fluid flow path through the stack of aluminum thin films when diffusion bonded together.

Preliminary study on pressure brazing and diffusion welding of Nb-1Zr to Inconel 718

NASA Technical Reports Server (NTRS)

Moore, T. J.

1990-01-01

Future space power systems may include Nb-1Zr/Inconel 718 dissimilar metal joints for operation at 1000 K for 60,000 h. The serviceability of pressure-brazed and diffusion-welded joints was investigated. Ni-based metallic glass foil filler metals were used for brazing. Ni and Fe foils were used as diffusion welding inter-layers. Joint soundness was determined by metallographic examination in the as-brazed and as-welded condition, after aging at 1000 K, and after thermal cycling. Brazed joints thermally cycled in the as-brazed condition and diffusion-welded joints were unsatisfactory because of cracking problems. Brazed joints may meet the service requirements if the joints are aged at 1000 K prior to thermal cycling.

Screening Adhesively Bonded Single-Lap-Joint Testing Results Using Nonlinear Calculation Parameters

DTIC Science & Technology

2012-03-01

versus displacement response for single-lap-joints bonded with damage-tolerant adhe- sives, such the polyurea adhesive plotted in Figure 2, is much...displacement response for a single-lap-joint bonded with a polyurea adhesive. Complex x-y plots are commonly fitted using the Levenberg-Marquardt...expected decrease in maximum strength for the polyurea in compar- ison to the epoxy, which could have been obtained using a traditional analysis approach

Optimized Vertex Method and Hybrid Reliability

NASA Technical Reports Server (NTRS)

Smith, Steven A.; Krishnamurthy, T.; Mason, B. H.

2002-01-01

A method of calculating the fuzzy response of a system is presented. This method, called the Optimized Vertex Method (OVM), is based upon the vertex method but requires considerably fewer function evaluations. The method is demonstrated by calculating the response membership function of strain-energy release rate for a bonded joint with a crack. The possibility of failure of the bonded joint was determined over a range of loads. After completing the possibilistic analysis, the possibilistic (fuzzy) membership functions were transformed to probability density functions and the probability of failure of the bonded joint was calculated. This approach is called a possibility-based hybrid reliability assessment. The possibility and probability of failure are presented and compared to a Monte Carlo Simulation (MCS) of the bonded joint.

Automation Tools for Finite Element Analysis of Adhesively Bonded Joints

NASA Technical Reports Server (NTRS)

Tahmasebi, Farhad; Brodeur, Stephen J. (Technical Monitor)

2002-01-01

This article presents two new automation creation tools that obtain stresses and strains (Shear and peel) in adhesively bonded joints. For a given adhesively bonded joint Finite Element model, in which the adhesive is characterised using springs, these automation tools read the corresponding input and output files, use the spring forces and deformations to obtain the adhesive stresses and strains, sort the stresses and strains in descending order, and generate plot files for 3D visualisation of the stress and strain fields. Grids (nodes) and elements can be numbered in any order that is convenient for the user. Using the automation tools, trade-off studies, which are needed for design of adhesively bonded joints, can be performed very quickly.

Adhesive-bonded scarf and stepped-lap joints

NASA Technical Reports Server (NTRS)

Hart-Smith, L. J.

1973-01-01

Continuum mechanics solutions are derived for the static load-carrying capacity of scarf and stepped-lap adhesive-bonded joints. The analyses account for adhesive plasticity and adherend stiffness imbalance and thermal mismatch. The scarf joint solutions include a simple algebraic formula which serves as a close lower bound, within a small fraction of a per cent of the true answer for most practical geometries and materials. Digital computer programs were developed and, for the stepped-lap joints, the critical adherend and adhesive stresses are computed for each step. The scarf joint solutions exhibit grossly different behavior from that for double-lap joints for long overlaps inasmuch as that the potential bond shear strength continues to increase with indefinitely long overlaps on the scarf joints. The stepped-lap joint solutions exhibit some characteristics of both the scarf and double-lap joints. The stepped-lap computer program handles arbitrary (different) step lengths and thickness and the solutions obtained have clarified potentially weak design details and the remedies. The program has been used effectively to optimize the joint proportions.

Global-Local Finite Element Analysis for Thermo-Mechanical Stresses in Bonded Joints

NASA Technical Reports Server (NTRS)

Shkarayev, S.; Madenci, Erdogan; Camarda, C. J.

1997-01-01

An analysis of adhesively bonded joints using conventional finite elements does not capture the singular behavior of the stress field in regions where two or three dissimilar materials form a junction with or without free edges. However, these regions are characteristic of the bonded joints and are prone to failure initiation. This study presents a method to capture the singular stress field arising from the geometric and material discontinuities in bonded composites. It is achieved by coupling the local (conventional) elements with global (special) elements whose interpolation functions are constructed from the asymptotic solution.

Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols

DTIC Science & Technology

2016-06-01

unlimited. v List of Tables Table 1 Single-lap-joint experimental parameters ..............................................7 Table 2 Survey ...Joints: Experimental and Workflow Protocols by Robert E Jensen, Daniel C DeSchepper, and David P Flanagan Approved for...TR-7696 ● JUNE 2016 US Army Research Laboratory Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental

Progressive Damage Analysis of Bonded Composite Joints

NASA Technical Reports Server (NTRS)

Leone, Frank A., Jr.; Girolamo, Donato; Davila, Carlos G.

2012-01-01

The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented durable redundant joint. Both designs involve honeycomb sandwich structures with carbon/epoxy facesheets joined using adhesively bonded doublers.Progressive damage modeling allows for the prediction of the initiation and evolution of damage within a structure. For structures that include multiple material systems, such as the joint designs under consideration, the number of potential failure mechanisms that must be accounted for drastically increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, intraply matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The bonded joints were modeled using highly parametric, explicitly solved finite element models, with damage modeling implemented via custom user-written subroutines. Each ply was discretely meshed using three-dimensional solid elements. Layers of cohesive elements were included between each ply to account for the possibility of delaminations and were used to model the adhesive layers forming the joint. Good correlation with experimental results was achieved both in terms of load-displacement history and the predicted failure mechanism(s).

Hydrogen bonds and heat diffusion in α-helices: a computational study.

PubMed

Miño, German; Barriga, Raul; Gutierrez, Gonzalo

2014-08-28

Recent evidence has shown a correlation between the heat diffusion pathways and the known allosteric communication pathways in proteins. Allosteric communication in proteins is a central, yet unsolved, problem in biochemistry, and the study and characterization of the structural determinants that mediate energy transfer among different parts of proteins is of major importance. In this work, we characterized the role of hydrogen bonds in diffusivity of thermal energy for two sets of α-helices with different abilities to form hydrogen bonds. These hydrogen bonds can be a constitutive part of the α-helices or can arise from the lateral chains. In our in vacuo simulations, it was observed that α-helices with a higher possibility of forming hydrogen bonds also had higher rates of thermalization. Our simulations also revealed that heat readily flowed through atoms involved in hydrogen bonds. As a general conclusion, according to our simulations, hydrogen bonds fulfilled an important role in heat diffusion in structural patters of proteins.

Mechanical Strength and Failure Characterization of Sn-Ag-Cu Intermetallic Compound Joints at the Microscale

NASA Astrophysics Data System (ADS)

Ladani, Leila; Razmi, Jafar

2012-03-01

Continuous miniaturization of microelectronic devices has led the industry to develop interconnects on the order of a few microns for advanced superhigh-density and three-dimensional integrated circuits (3D ICs). At this scale, interconnects that conventionally consist of solder material will completely transform to intermetallic compounds (IMCs) such as Cu6Sn5. IMCs are brittle, unlike conventional solder materials that are ductile in nature; therefore, IMCs do not experience large amounts of plasticity or creep before failure. IMCs have not been fully characterized, and their mechanical and thermomechanical reliability is questioned. This study presents experimental efforts to characterize such material. Sn-based microbonds are fabricated in a controlled environment to assure complete transformation of the bonds to Cu6Sn5 IMC. Microstructural analysis including scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDS), and x-ray diffraction (XRD) is utilized to determine the IMC material composition and degree of copper diffusion into the bond area. Specimens are fabricated with different bond thicknesses and in different configurations for various tests. Normal strength of the bonds is measured utilizing double cantilever beam and peeling tests. Shear tests are conducted to quantify the shear strength of the material. Four-point bending tests are conducted to measure the fracture toughness and critical energy release rate. Bonds are fabricated in different sizes, and the size effect is investigated. The shear strength, normal strength, critical energy release rate, and effect of bond size on bond strength are reported.

Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

NASA Technical Reports Server (NTRS)

Barclay, D. L.

1980-01-01

Results of an experimental program to develop several types of graphite/polyimide (GR/PI) bonded and bolted joints for lightly loaded flight components for advanced space transportation systems and high speed aircraft are presented. Tasks accomplished include: a literature survey; design of static discriminator specimens; design allowables testing; fabrication of test panels and specimens; small specimen testing; and standard joint testing. Detail designs of static discriminator specimens for each of the four major attachment types are presented. Test results are given for the following: (1) transverse tension of Celion 3000/PMR-15 laminate; (2) net tension of a laminate for both a loaded and unloaded bolt hole; (3) comparative testing of bonded and co-cured doublers along with pull-off tests of single and double bonded angles; (4) single lap shear tests, transverse tension and coefficient of thermal expansion tests of A7F (LARC-13 amide-imide modified) adhesive; and (5) tension tests of standard single lap, double lap, and symmetric step lap bonded joints. Also, included are results of a finite element analysis of a single lap bonded composite joint.

Evaluation of laminated aluminum plate for shuttle applications

NASA Technical Reports Server (NTRS)

Martin, M. J.

1973-01-01

Flaw growth behavior in roll diffusion bonded and adhesive bonded 2219-T87 aluminum alloy was compared to that in monolothic 2219-T87. Based on tests at 40 KSI cyclic stress, for equivalent cyclic life, a .004 interlayer laminate can tolerate a surface flaw twice as wide as in monolithic material, or provide an 8% weight saving by operating at higher stress for the same initial flaw. Roll diffusion bonded material with three structural plies of 2219-T87 and two interlayers of 1100 aluminum was prepared with interlayer thicknesses of .004, .007 and .010 in. Total laminate thickness was .130 in. The .004 interlayer laminate was most effective and gave better results than monolithic material at 40 and 48 ksi. Adhesive bonded specimens were fabricated of three sheets of 2219-T87 aluminum alloy bonded with METLBOND 329 adhesive. Adhesive bonded specimens gave longer lives to failure than diffusion bonded specimens at 40 ksi the diffusion bonded material was superior. Flaws initiated in one ply of the laminate grew to the edges of the specimen in that ply but did not propagate into adjacent plies.

Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

NASA Technical Reports Server (NTRS)

1981-01-01

The development of several types of graphite/polyimide (GR/PI) bonded and bolted joints is reported. The program consists of two concurrent tasks: (1) design and test of specific built up attachments; and (2) evaluation of standard advanced bonded joint concepts. A data base for the design and analysis of advanced composite joints for use at elevated temperatures (561K (550 deg F)) to design concepts for specific joining applications, and the fundamental parameters controlling the static strength characteristics of such joints are evaluated. Data for design and build GR/PI of lightly loaded flight components for advanced space transportation systems and high speed aircraft are presented. Results for compression and interlaminar shear strengths of Celion 6000/PMR-15 laminates are given. Static discriminator test results for type 3 and type 4 bonded and bolted joints and final joint designs for TASK 1.4 scale up fabrication and testing are presented.

Thermal analysis of a diffusion bonded Er3+,Yb3+:glass/Co2+: MgAl2O4 microchip lasers

NASA Astrophysics Data System (ADS)

Belghachem, Nabil; Mlynczak, Jaroslaw; Kopczynski, krzysztof; Mierczyk, Zygmunt; Gawron, Michal

2016-10-01

The analysis of thermal effects in a diffusion bonded Er3+,Yb3+:glass/Co2+:MgAl2O4 microchip laser is presented. The analysis is performed for both wavelengths at 940 nm and at 975 nm as well as for two different sides of pumping, glass side and saturable absorber side. The heat sink effect of Co2+:MgAl2O4, as well as the impact of the thermal expansion and induced stress on the diffusion bonding are emphasised. The best configurations for reducing the temperature peaks, the Von Mises stresses on the diffusion bonding, and the thermal lensing are determined.

Development of Methods for Low Temperature Diffusion Bonding.

DTIC Science & Technology

1987-09-01

Hazlett, T. H., " High Strength Low Temperature Bonding of Beryllium and Other Metals," Welding Journal, 60(11), pp. 301-s to 310-s, 1970. 12. 1986 Annual...34CIPLU’q *flBQ~ P 0.(4 ".Oq’J 4 Low Temperature , Methods for Diffusion Rl ,’..’S olid deveoped ~’~ ~ ’State Bonding, or Diffusion Welding An apparatus lor...low t’empeaur R~u on’ nding of dissimilar metals has been develped.Experiments varying the bonding temperature at constant pressure and time were

Nondestructive Evaluation of Adhesive Bond Quality: State of the Art Review

DTIC Science & Technology

1989-06-01

conducted using a and Harnik (6) developed a quantitative medium-focused, 1/4-inch diameter, 10-MHz method of testing adhesive bonded joints transducer...Couchman." Spectral Analysis Tech- E. Harnik . "The Testing of Adhesive- nique of Ultrasonic NDT of Advanced Bonded Joints by a Very High Resolu

Preparation and Bond Properties of Thermal Barrier Coatings on Mg Alloy with Sprayed Al or Diffused Mg-Al Intermetallic Interlayer

NASA Astrophysics Data System (ADS)

Fan, Xizhi; Wang, Ying; Zou, Binglin; Gu, Lijian; Huang, Wenzhi; Cao, Xueqiang

2014-02-01

Sprayed Al or diffused Mg-Al layer was designed as interlayer between the thermal barrier coatings (TBCs) and Mg alloy substrate. The effects of the interlayer on the bond properties of the coats were investigated. Al layers were prepared by arc spraying and atmospheric plasma spraying (APS), respectively. Mg-Al diffused layer was obtained after the heat treatment of the sprayed sample (Mg alloy with APS Al coat) at 400 °C. The results show that sprayed Al interlayer does not improve the bond stability of TBCs. The failure of the TBCs on Mg alloy with Al interlayer occurs mainly due to the low strength of Al layer. Mg-Al diffused layer improves corrosion resistance of substrate and the bond interface. The TBCs on Mg alloy with Mg-Al diffused interlayer shows better bond stability than the sample of which the TBCs is directly sprayed on Mg alloy substrate by APS.

Acoustic emissions (AE) monitoring of large-scale composite bridge components

NASA Astrophysics Data System (ADS)

Velazquez, E.; Klein, D. J.; Robinson, M. J.; Kosmatka, J. B.

2008-03-01

Acoustic Emissions (AE) has been successfully used with composite structures to both locate and give a measure of damage accumulation. The current experimental study uses AE to monitor large-scale composite modular bridge components. The components consist of a carbon/epoxy beam structure as well as a composite to metallic bonded/bolted joint. The bonded joints consist of double lap aluminum splice plates bonded and bolted to carbon/epoxy laminates representing the tension rail of a beam. The AE system is used to monitor the bridge component during failure loading to assess the failure progression and using time of arrival to give insight into the origins of the failures. Also, a feature in the AE data called Cumulative Acoustic Emission counts (CAE) is used to give an estimate of the severity and rate of damage accumulation. For the bolted/bonded joints, the AE data is used to interpret the source and location of damage that induced failure in the joint. These results are used to investigate the use of bolts in conjunction with the bonded joint. A description of each of the components (beam and joint) is given with AE results. A summary of lessons learned for AE testing of large composite structures as well as insight into failure progression and location is presented.

Progressive Damage Modeling of Durable Bonded Joint Technology

NASA Technical Reports Server (NTRS)

Leone, Frank A.; Davila, Carlos G.; Lin, Shih-Yung; Smeltzer, Stan; Girolamo, Donato; Ghose, Sayata; Guzman, Juan C.; McCarville, Duglas A.

2013-01-01

The development of durable bonded joint technology for assembling composite structures for launch vehicles is being pursued for the U.S. Space Launch System. The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology applicable to a wide range of sandwich structures for a Heavy Lift Launch Vehicle. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented Durable Redundant Joint. Both designs involve a honeycomb sandwich with carbon/epoxy facesheets joined with adhesively bonded doublers. Progressive damage modeling allows for the prediction of the initiation and evolution of damage. For structures that include multiple materials, the number of potential failure mechanisms that must be considered increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The joints were modeled using Abaqus parametric finite element models, in which damage was modeled with user-written subroutines. Each ply was meshed discretely, and layers of cohesive elements were used to account for delaminations and to model the adhesive layers. Good correlation with experimental results was achieved both in terms of load-displacement history and predicted failure mechanisms.

Correlating PMC-MMC Bonded Joint 3D FEA with Test

NASA Technical Reports Server (NTRS)

Jacobson, Mindy; Rodini, Benjamin; Chen, Wayne C.; Flom, Yury A.; Posey, Alan J.

2005-01-01

A viewgraph presentation on the correlation of Polymer Matrix Composites (PMC) and Metal Matrix Composites (MMC) bonded joints using three dimensional finite element analyses with materials tests is shown.

The latent fingerprint in mass transport of polycrystalline materials

NASA Astrophysics Data System (ADS)

Thirunavukarasu, Gopinath; Kundu, Sukumar; Chatterjee, Subrata

2016-02-01

Herein, a systematic investigation was carried out to reach a rational understanding and to provide information concerning the possible causes for a significant influence of pressure variation in the underlying processes of mass transport in polycrystalline materials. The authors focused their research in solid-state diffusion, a part of the subject "Mass Transport in Solids". Theories on diffusion are the subject by itself which exists as a latent fingerprint in every text of higher learning in interdisciplinary science. In this research, authors prepared sandwich samples of titanium alloy and stainless steel using nickel as an intermediate metal. The samples were processed at three different levels of bonding pressure (3, 4 and 5 MPa) while bonding temperature and bonding time was maintained at 750 °C and 1 h, respectively, throughout the experiments. It was observed that the net flux of atomic diffusion of nickel atoms into Ti-alloy at TiA/Ni interface increased by ~63 % with the rise in the bonding pressure from 3 to 4 MPa, but decreased by ~40 % with the rise in the bonding pressure from 4 to 5 MPa. At the same time, the net flux of atomic diffusion of nickel atoms into stainless steel at Ni/SS interface increased by ~19 % with the rise in the bonding pressure from 3 to 4 MPa, but increased by ~17 % with the rise in the bonding pressure from 4 to 5 MPa. Here authors showed that the pressure variations have different effects at the TiA/Ni interface and Ni/SS interface, and tried to explain the explicit mechanisms operating behind them. In general for sandwich samples processed irrespective of bonding pressure chosen, the net flux of Ni-atoms diffused into SS is greater than that of the net flux of Ni-atoms diffused in Ti-alloy matrix by four orders of magnitude. The calculated diffusivity of Ni-atoms into Ti-alloy reaches its highest value of ~5.083 × 10-19 m2/s for the sandwich sample processed using 4-MPa bonding-pressure, whereas the diffusivity of Ni-atoms into SS reaches its peak value of ~1.615 × 10-14 m2/s for the sample bonded using 5-MPa bonding-pressure.

Time- and temperature-dependent failures of a bonded joint

NASA Astrophysics Data System (ADS)

Sihn, Sangwook

This dissertation summarizes my study of time- and temperature-dependent behavior of a tubular lap bonded joint to provide a design methodology for windmill blade structures. The bonded joint is between a cast-iron rod and a GFRP composite pipe. The adhesive material is an epoxy containing chopped glass fibers. We proposed a new fabrication method to make concentric and void-less specimens of the tubular joint with a thick adhesive bondline to stimulate the root bond of a blade. The thick bondline facilitates the joint assembly of actual blades. For a better understanding of the behavior of the bonded joint, we studied viscoelastic behavior of the adhesive materials by measuring creep compliance at several temperatures during loading period. We observed that the creep compliance depends highly on the period of loading and the temperature. We applied time-temperature equivalence to the creep compliance of the adhesive material to obtain time-temperature shift factors. We also performed constant-rate of monotonically increased uniaxial tensile tests to measure static strength of the tubular lap joint at several temperatures and different strain-rates. We observed two failure modes from load-deflection curves and failed specimens. One is the brittle mode, which was caused by weakness of the interfacial strength occurring at low temperature and short period of loading. The other is the ductile mode, which was caused by weakness of the adhesive material at high temperature and long period of loading. Transition from the brittle to the ductile mode appeared as the temperature or the loading period increased. We also performed tests under uniaxial tensile-tensile cyclic loadings to measure fatigue strength of the bonded joint at several temperatures, frequencies and stress ratios. The fatigue data are analyzed statistically by applying the residual strength degradation model to calculate statistical distribution of the fatigue life. Combining the time-temperature equivalence and the residual strength degradation model enables us to estimate the fatigue life of the bonded joint at different load levels, frequencies and temperatures with a certain probability. A numerical example shows how to apply the life estimation method to a structure subjected to a random load history by rainflow cycle counting.

Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.

PubMed

Guo, Weibing; Luan, Tianmin; He, Jingshan; Yan, Jiuchun

2018-01-01

The fine-grained Al alloys prefer to be soldered at as low as temperature to keep their mechanical properties. Solders of Sn-4Zn, Sn-9Zn, and Sn-20Zn alloys were used to solder fine-grained 7034 Al alloy pieces by ultrasonic-assisted soldering below 300°C in air. The joint using Sn-4Zn solder had the highest tensile strength of 201MPa and the fractures occurred in both β-Sn and Sn-Zn eutectic phases. Such joint was much stronger than the 1060 Al joint using Sn-4Zn solder, and its strength had approached the strength of 7034 Al joint using Zn-5Al solder. The strength of the joints using Sn-9Zn and Sn-20Zn solders dropped to∼160MPa due to the appearance of weak interfaces between η-Zn and eutectic phases in the bond layers. All the joints using Sn-Zn solders had very strong interfacial bonding, and alumina interlayers were identified at all the interfaces. Al dissolved in the bond layer reacted with the O rapidly to form alumina interlayers at the interfaces under the ultrasonic action. Zn segregated at the interface and formed strong bonds with both the Al terminated surface of alumina and the bond layer, resulting in strong interfacial bonding between Sn-Zn solders and Al alloys. Copyright © 2017 Elsevier B.V. All rights reserved.

Low temperature joining of ceramic composites

DOEpatents

Barton, Thomas J.; Anderson, Iver E.; Ijadi-Maghsoodi, Sina; Nosrati, Mohammad; Unal, Ozer

1999-01-12

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.

Low temperature joining of ceramic composites

DOEpatents

Barton, Thomas J.; Anderson, Iver E.; Ijadi-Maghsoodi, Sina; Nosrati, Mohammad; Unal, Ozer

1999-07-13

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or ceramic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.

Low temperature joining of ceramic composites

DOEpatents

Barton, Thomas J.; Anderson, Iver E.; Ijadi-Maghsoodi, Sina; Nosrati, Mohammad; Unal, Ozer

2001-04-10

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix.

Low temperature joining of ceramic composites

DOEpatents

Barton, T.J.; Anderson, I.E.; Ijadi-Maghsoodi, S.; Nosrati, M.; Unal, O.

1999-07-13

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or ceramic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 C to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix. 3 figs.

Low temperature joining of ceramic composites

DOEpatents

Barton, T.J.; Anderson, I.E.; Ijadi-Maghsoodi, S.; Nosrati, M.; Unal, O.

1999-01-12

A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or ceramic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials. The bond joint produced is characterized by a composite joint microstructure having relatively soft, compliant aluminum bearing particulate regions dispersed in a ceramic matrix. 3 figs.

An EMAT-based shear horizontal (SH) wave technique for adhesive bond inspection

NASA Astrophysics Data System (ADS)

Arun, K.; Dhayalan, R.; Balasubramaniam, Krishnan; Maxfield, Bruce; Peres, Patrick; Barnoncel, David

2012-05-01

The evaluation of adhesively bonded structures has been a challenge over the several decades that these structures have been used. Applications within the aerospace industry often call for particularly high performance adhesive bonds. Several techniques have been proposed for the detection of disbonds and cohesive weakness but a reliable NDE method for detecting interfacial weakness (also sometimes called a kissing bond) has been elusive. Different techniques, including ultrasonic, thermal imaging and shearographic methods, have been proposed; all have had some degree of success. In particular, ultrasonic methods, including those based upon shear and guided waves, have been explored for the assessment of interfacial bond quality. Since 3-D guided shear horizontal (SH) waves in plates have predominantly shear displacement at the plate surfaces, we conjectured that SH guided waves should be influenced by interfacial conditions when they propagate between adhesively bonded plates of comparable thickness. This paper describes a new technique based on SH guided waves that propagate within and through a lap joint. Through mechanisms we have yet to fully understand, the propagation of an SH wave through a lap joint gives rise to a reverberation signal that is due to one or more reflections of an SH guided wave mode within that lap joint. Based upon a combination of numerical simulations and measurements, this method shows promise for detecting and classifying interfacial bonds. It is also apparent from our measurements that the SH wave modes can discriminate between adhesive and cohesive bond weakness in both Aluminum-Epoxy-Aluminum and Composite-Epoxy-Composite lap joints. All measurements reported here used periodic permanent magnet (PPM) Electro-Magnetic Acoustic Transducers (EMATs) to generate either or both of the two lowest order SH modes in the plates that comprise the lap joint. This exact configuration has been simulated using finite element (FE) models to describe the SH mode generation, propagation and reception. Of particular interest is that one SH guided wave mode (probably SH0) reverberates within the lap joint. Moreover, in both simulations and measurements, features of this so-called reverberation signal appear to be related to interfacial weakness between the plate (substrate) and the epoxy bond. The results of a hybrid numerical (FE) approach based on using COMSOL to calculate the driving forces within an elastic solid and ABAQUS to propagate the resulting elastic disturbances (waves) within the plates and lap joint are compared with measurements of SH wave generation and reception in lap joint specimens having different interfacial and cohesive bonding conditions.

Strength and failure analysis of composite-to-composite adhesive bonds with different surface treatments

NASA Astrophysics Data System (ADS)

Paranjpe, Nikhil; Alamir, Mohammed; Alonayni, Abdullah; Asmatulu, Eylem; Rahman, Muhammad M.; Asmatulu, Ramazan

2018-03-01

Adhesives are widely utilized materials in aviation, automotive, energy, defense, and marine industries. Adhesive joints are gradually supplanting mechanical fasteners because they are lightweight structures, thus making the assembly lighter and easier. They also act as a sealant to prevent a structural joint from galvanic corrosion and leakages. Adhesive bonds provide high joint strength because of the fact that the load is distributed uniformly on the joint surface, while in mechanical joints, the load is concentrated at one point, thus leading to stress at that point and in turn causing joint failures. This research concentrated on the analysis of bond strength and failure loads in adhesive joint of composite-to-composite surfaces. Different durations of plasma along with the detergent cleaning were conducted on the composite surfaces prior to the adhesive applications and curing processes. The joint strength of the composites increased about 34% when the surface was plasma treated for 12 minutes. It is concluded that the combination of different surface preparations, rather than only one type of surface treatment, provides an ideal joint quality for the composites.

Investigation of displacement, strain and stress in single step transversely isotropic elastic bonded joint

NASA Astrophysics Data System (ADS)

Apu, Md. Jakaria; Islam, Md. Shahidul

2016-07-01

Bi-material joint is often used in many advanced materials and structures. Determination of the bonding strength at the interface is very difficult because of the presence of the stress singularity. In this paper, the displacement and stress fields of a transversely isotropic bi-material joint around an interface edge are determined. Autodesk Simulation Mechanical 2015 is used to carry out the numerical computations. Stress and displacement fields demonstrate that the values near the edge of joint where the stress singularity occurs are larger than that at the inner portion. From the numerical results, it is suggested that de-bonding of the interface may occur at the interface edge of the joint due to the higher stress concentration at the free edge.

Failure of dissimilar material bonded joints

NASA Astrophysics Data System (ADS)

Konstantakopoulou, M.; Deligianni, A.; Kotsikos, G.

2016-03-01

Joining of materials in structural design has always been a challenge for engineers. Bolting and riveting has been used for many years, until the emergence of fusion welding which revolutionised construction in areas such as shipbuilding, automotive, infrastructure and consumer goods. Extensive research in the past 50 years has resulted in better understanding of the process and minimised the occurrence of failures associated with fusion welding such as, residual stress cracking, stress corrosion and corrosion fatigue cracking, localised reduction in mechanical properties due to microstructural changes (heat affected zone) etc. Bonding has been a technique that has been proposed as an alternative because it eliminates several of the problems associated with fusion welding. But, despite some applications it has not seen wide use. There is however a renewed interest in adhesively bonded joints, as designers look for ever more efficient structures which inevitably leads to the use and consequently joining of combinations of lightweight materials, often with fundamentally different mechanical and physical properties. This chapter provides a review of adhesively bonded joints and reports on improvements to bonded joint strength through the introduction of carbon nanotubes at the bond interface. Results from various workers in the field are reported as well as the findings of the authors in this area of research. It is obvious that there are several challenges that need to be addressed to further enhance the strength of bonded joints and worldwide research is currently underway to address those shortcomings and build confidence in the implementation of these new techniques.

Monitoring of fatigue damage in composite lap-joints using guided waves and FBG sensors

NASA Astrophysics Data System (ADS)

Karpenko, Oleksii; Khomenko, Anton; Koricho, Ermias; Haq, Mahmoodul; Udpa, Lalita

2016-02-01

Adhesive bonding is being increasingly employed in many applications as it offers possibility of light-weighting and efficient multi-material joining along with reduction in time and cost of manufacturing. However, failure initiation and progression in critical components like joints, specifically in fatigue loading is not well understood, which necessitates reliable NDE and SHM techniques to ensure structural integrity. In this work, concurrent guided wave (GW) and fiber Bragg grating (FBG) sensor measurements were used to monitor fatigue damage in adhesively bonded composite lap-joints. In the present set-up, one FBG sensor was strategically embedded in the adhesive bond-line of a lap-joint, while two other FBGs were bonded on the surface of the adherends. Full spectral responses of FBG sensors were collected and compared at specific intervals of fatigue loading. In parallel, guided waves were actuated and sensed using PZT wafers mounted on the composite adherends. Experimental results demonstrated that time-of-flight (ToF) of the fundamental modes transmitted through the bond-line and spectral response of FBG sensors were sensitive to fatigue loading and damage. Combination of guided wave and FBG measurements provided the desired redundancy and synergy in the data to evaluate the degradation in bond-line properties. Measurements taken in the presence of continuously applied load replicated the in-situ/service conditions. The approach shows promise in understanding the behavior of bonded joints subjected to complex loading.

Adhesive-bonded double-lap joints. [analytical solutions for static load carrying capacity

NASA Technical Reports Server (NTRS)

Hart-Smith, L. J.

1973-01-01

Explicit analytical solutions are derived for the static load carrying capacity of double-lap adhesive-bonded joints. The analyses extend the elastic solution Volkersen and cover adhesive plasticity, adherend stiffness imbalance and thermal mismatch between the adherends. Both elastic-plastic and bi-elastic adhesive representations lead to the explicit result that the influence of the adhesive on the maximum potential bond strength is defined uniquely by the strain energy in shear per unit area of bond. Failures induced by peel stresses at the ends of the joint are examined. This failure mode is particularly important for composite adherends. The explicit solutions are sufficiently simple to be used for design purposes

Thermal Skin fabrication technology

NASA Technical Reports Server (NTRS)

Milam, T. B.

1972-01-01

Advanced fabrication techniques applicable to Thermal Skin structures were investigated, including: (1) chemical machining; (2) braze bonding; (3) diffusion bonding; and (4) electron beam welding. Materials investigated were nickel and nickel alloys. Sample Thermal Skin panels were manufactured using the advanced fabrication techniques studied and were structurally tested. Results of the program included: (1) development of improved chemical machining processes for nickel and several nickel alloys; (2) identification of design geometry limits; (3) identification of diffusion bonding requirements; (4) development of a unique diffusion bonding tool; (5) identification of electron beam welding limits; and (6) identification of structural properties of Thermal Skin material.

Moisture contamination detection in adhesive layer using embedded fibre Bragg grating sensors

NASA Astrophysics Data System (ADS)

Mieloszyk, Magdalena; Soman, Rohan; Bonilla Mora, Veronica; Ostachowicz, Wieslaw

2017-04-01

The paper presents an application of embedded fibre Bragg grating (FBG) sensors for moisture contamination detection in an adhesive layer between composite elements. Due to their high corrosion resistance as well as their small size and weight, FBG sensors are a great tool for Structural Health Monitoring of composite structures. Adhesive bonds are very popular in many industrial sectors (e.g. automotive, aerospace). One of the major problems limiting the use of adhesive joints is their sensitivity to moisture from its surroundings. Even 1% of moisture can negatively affect the adhesive bond layer. The experimental and numerical investigations were performed on two rectangular samples of two glass fibre reinforced composite elements bonded together using an adhesive commonly used in the bonding or repair of aircraft elements. Moisture contamination due to diffusion process changes the volumetric properties of the material induced strain. This strain was measured by FBG sensors embedded in the adhesive layer parallel to the main axis of the sample. The behaviour of the adhesive layer in the analysed sample was also modelled using the finite element commercial code ABAQUS. Numerical and experimental results confirm the utility of FBG sensors for moisture detection in the adhesive layer even when the amount of moisture is around 2% of the sample weight.

Joining of Silicon Carbide: Diffusion Bond Optimization and Characterization

NASA Technical Reports Server (NTRS)

Halbig, Michael C.; Singh, Mrityunjay

2008-01-01

Joining and integration methods are critically needed as enabling technologies for the full utilization of advanced ceramic components in aerospace and aeronautics applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. In the application, several SiC substrates with different hole patterns to form fuel and combustion air channels are bonded to form the injector. Diffusion bonding is a joining approach that offers uniform bonds with high temperature capability, chemical stability, and high strength. Diffusion bonding was investigated with the aid of titanium foils and coatings as the interlayer between SiC substrates to aid bonding. The influence of such variables as interlayer type, interlayer thickness, substrate finish, and processing time were investigated. Optical microscopy, scanning electron microscopy, and electron microprobe analysis were used to characterize the bonds and to identify the reaction formed phases.

Bonded composite to metal scarf joint performance in an aircraft landing gear drag strut. [for Boeing 747 aircraft

NASA Technical Reports Server (NTRS)

Howell, W. E.

1974-01-01

The structural performance of a boron-epoxy reinforced titanium drag strut, which contains a bonded scarf joint and was designed to the criteria of the Boeing 747 transport, was evaluated. An experimental and analytical investigation was conducted. The strut was exposed to two lifetimes of spectrum loading and was statically loaded to the tensile and compressive design ultimate loads. Throughout the test program no evidence of any damage in the drag strut was detected by strain gage measurements, ultrasonic inspection, or visual observation. An analytical study of the bonded joint was made using the NASA structural analysis computer program NASTRAN. A comparison of the strains predicted by the NASTRAN computer program with the experimentally determined values shows excellent agreement. The NASTRAN computer program is a viable tool for studying, in detail, the stresses and strains induced in a bonded joint.

Influence of anatomical, physical, and mechanical properties of diffuse-porous hardwoods on moisture durability of bonded assemblies

Treesearch

Daniel J. Yelle; Ashley M. Stirgus

2016-01-01

Studying wood adhesive bond durability is challenging because wood is highly variable and heterogeneous at all length scales. In this study, three North American diffuse-porous hardwoods (hard maple, soft maple, and basswood) and their adhesively bonded as-semblies were exposed to wet and dry cyclic tests. Then, their den-sity differences were related to bond...

Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

NASA Astrophysics Data System (ADS)

Wu, Yuan-Yun

In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a successful bonding. In this section, we further studied the Ag-In bonding and solid-state bonding for different bonded pairs and flip-chip application. For the silicon (Si) and aluminum (Al) pair, Al has been used as the material for interconnect pads on the ICs. However, its high CTE (23 x 10-6/°C) and non-solderable property limit its applications in electronic products. To overcome these problems, a fluxless Ag-In bonding was developed. Al was deposited Cr/Cu layer on the surface by E-beam evaporator to make it solderable. 15 um of Ag and 8 um of In were sequentially plated on the Al substrates and 15 um of Ag was on Si chips with Cr/Au coating layer. The bonding was performed at 180 °C in 0.1 torr vacuum. The joint consists of Ag/(Ag)/Ag2In/(Ag)/Ag. The joint can achieve a solidus temperature of beyond 600 °C. From shear test results, the shear strengths far exceed the requirement in MIL-STD-883H. Al is not considered as a favorable substrate material because it is not solderable and has a high CTE. The new method presented in this thesis seems to have surmounted these two challenges. Since Ag2In is weak inside the joint in Ag-In system, an annealed process was used to convert the joints into Ag solid solution (Ag) to increase the joint strength and ductility. Two copper (Cu) substrates were bonded at 180 °C without flux. Bonding samples were annealed at 200 °C for 1,000 hours (first design) and at 250 °C for 350 hours (second design), respectively. Scanning electron microscope with energy dispersive X-ray (EDX) analysis results indicate that the joint of the first design is an alloy of mostly (Ag) with micron-size Ag2In and Ag3In regions, and that of second design has converted to a single (Ag) phase. Shear test results show that the breaking forces far exceed the requirement in MIL-STD-883H. The joint solidus temperatures are 600 °C and 800 °C for the first and second designs, respectively. The research results have shown that high-strength and high temperature joints can be manufactured using fluxless low temperature processes with the Ag-In system and are valuable in developing high temperature package. (Abstract shortened by UMI.).

Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

NASA Technical Reports Server (NTRS)

Koumal, D. E.

1979-01-01

The design and evaluation of built-up attachments and bonded joint concepts for use at elevated temperatures is documented. Joint concept screening, verification of GR/PI material, fabrication of design allowables panels, definition of test matrices, and analysis of bonded and bolted joints are among the tasks completed. The results provide data for the design and fabrication of lightly loaded components for advanced space transportation systems and high speed aircraft.

75 FR 79394 - United States v. L.B. Foster Company and Portec Rail Products, Inc.; Proposed Final Judgment and...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-12-20

... Foster and Portec will create a virtual monopoly in the U.S. market for bonded joints. (2) Poly Joints 29... Class 1 railroads, insist that new bonded joints undergo laboratory testing plus several years of in... would have a virtual monopoly in that market. Using a measure called the Herfindahl/Hirschman Index...

Fineblanking, Diffusion Bonding, and Testing of Fluidic Laminates.

DTIC Science & Technology

1980-07-01

AD-AU69 347 TRITEC INC COLUMBIA ND F/$ 13/7 FINEBLANKING, DIFFUSION BONDING, AND TESTING OF FLUIDIC LAMINAT --ETCIU) JUL 80 L K PECAN OAAK21-79-C-0074...amplifier assembly. The effects of die roll and burrs can be minimized by secondary operations *such as abrasive machining , but this adds to the expense...clad material. Experience has shown that a clad thickness of 0.038 + 0.008 mm is required for the semi-solid diffusion bonding process. The composition

Experimental investigation of reinforced bonded joints for composite laminates.

PubMed

Bisagni, Chiara; Furfari, Domenico; Pacchione, Marco

2018-02-01

An experimental study has been carried out to investigate the behaviour of co-bonded carbon fibre reinforced plastics joints with a novel design incorporating a through the thickness local reinforcement. Different specimens were manufactured to investigate static and fatigue behaviour, as well as delamination size after impact and damage tolerance characteristics. The mechanical performances of the specimens with local reinforcement, consisting of the insertion of spiked thin metal sheets between co-bonded laminates, were compared with those ones obtained from specimens with purely co-bonded joints. This novel design demonstrated by tests that damage progression under cycling load results significantly delayed by the reinforcements. A significant number of experimental results were obtained that can be used to define preliminary design guidelines.

Experimental investigation of reinforced bonded joints for composite laminates

PubMed Central

Bisagni, Chiara; Furfari, Domenico; Pacchione, Marco

2017-01-01

An experimental study has been carried out to investigate the behaviour of co-bonded carbon fibre reinforced plastics joints with a novel design incorporating a through the thickness local reinforcement. Different specimens were manufactured to investigate static and fatigue behaviour, as well as delamination size after impact and damage tolerance characteristics. The mechanical performances of the specimens with local reinforcement, consisting of the insertion of spiked thin metal sheets between co-bonded laminates, were compared with those ones obtained from specimens with purely co-bonded joints. This novel design demonstrated by tests that damage progression under cycling load results significantly delayed by the reinforcements. A significant number of experimental results were obtained that can be used to define preliminary design guidelines. PMID:29568127

Characterization of lap joints laser beam welding of thin AA 2024 sheets with Yb:YAG disk-laser

NASA Astrophysics Data System (ADS)

Caiazzo, Fabrizia; Alfieri, Vittorio; Cardaropoli, Francesco; Sergi, Vincenzo

2012-06-01

Lap joints obtained by overlapping two plates are widely diffused in aerospace industry. Nevertheless, because of natural aging, adhesively bonded and riveted aircraft lap joints may be affected by cracks from rivets, voids or corrosion. Friction stir welding has been proposed as a valid alternative, although large heat affected zones are produced both in the top and the bottom plate due to the pin diameter. Interest has therefore been shown in studying laser lap welding as the laser beam has been proved to be competitive since it allows to concentrate the thermal input and increases productivity and quality. Some challenges arise as a consequence of aluminum low absorptance and high thermal conductivity; furthermore, issues are due to metallurgical challenges such as both micro and macro porosity formation and softening in the fused zone. Welding of AA 2024 thin sheets in a lap joint configuration is discussed in this paper: tests are carried out using a recently developed Trumpf TruDisk 2002 Yb:YAG disk-laser with high beam quality which allows to produce beads with low plates distortion and better penetration. The influence of the processing parameters is discussed considering the fused zone extent and the bead shape. The porosity content as well as the morphological features of the beads have been examined.

Composition and method for brazing graphite to graphite

DOEpatents

Taylor, Albert J.; Dykes, Norman L.

1984-01-01

The present invention is directed to a brazing material for joining graphite structures that can be used at temperatures up to about 2800.degree. C. The brazing material formed of a paste-like composition of hafnium carbide and uranium oxide with a thermosetting resin. The uranium oxide is converted to uranium dicarbide during the brazing operation and then the hafnium carbide and uranium dicarbide form a liquid phase at a temperature about 2600.degree. C. with the uranium diffusing and vaporizing from the joint area as the temperature is increased to about 2800.degree. C. so as to provide a brazed joint consisting essentially of hafnium carbide. This brazing temperature for hafnium carbide is considerably less than the eutectic temperature of hafnium carbide of about 3150.degree. C. The brazing composition also incorporates the thermosetting resin so that during the brazing operation the graphite structures may be temporarily bonded together by thermosetting the resin so that machining of the structures to final dimensions may be completed prior to the completion of the brazing operation. The resulting brazed joint is chemically and thermally compatible with the graphite structures joined thereby and also provides a joint of sufficient integrity so as to at least correspond with the strength and other properties of the graphite.

In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints

NASA Astrophysics Data System (ADS)

Yao, Takafumi; Matsuda, Tomoki; Sano, Tomokazu; Morikawa, Chiaki; Ohbuchi, Atsushi; Yashiro, Hisashi; Hirose, Akio

2018-04-01

A bonding method utilizing redox reactions of metallic oxide microparticles achieves metal-to-metal bonding in air, which can be alternative to lead-rich high-melting point solder. However, it is known that the degree of the reduction of metallic oxide microparticles have an influence on the joint strength using this bonding method. In this paper, the reduction behavior of CuO paste and its effect on Cu-to-Cu joints were investigated through simultaneous microstructure-related x-ray diffraction and differential scanning calorimetry measurements. The CuO microparticles in the paste were gradually reduced to submicron Cu2O particles at 210-250°C. Subsequently, Cu nanoparticles were generated instantaneously at 300-315°C. There was a marked difference in the strengths of the joints formed at 300°C and 350°C. Thus, the Cu nanoparticles play a critical role in sintering-based bonding using CuO paste. Furthermore, once the Cu nanoparticles have formed, the joint strength increases with higher bonding temperature (from 350°C to 500°C) and pressure (5-15 MPa), which can exceed the strength of Pb-5Sn solder at higher temperature and pressure.

A reduction of diffusion in PVA Fricke hydrogels

NASA Astrophysics Data System (ADS)

Smith, S. T.; Masters, K. S.; Hosokawa, K.; Blinco, J.; Crowe, S. B.; Kairn, T.; Trapp, J. V.

2015-01-01

A modification to the PVA-FX hydrogel whereby the chelating agent, xylenol orange, was partially bonded to the gelling agent, poly-vinyl alcohol, resulted in an 8% reduction in the post irradiation Fe3+ diffusion, adding approximately 1 hour to the useful timespan between irradiation and readout. This xylenol orange functionalised poly-vinyl alcohol hydrogel had an OD dose sensitivity of 0.014 Gy-1 and a diffusion rate of 0.133 mm2 h-1. As this partial bond yields only incremental improvement, it is proposed that more efficient methods of bonding xylenol orange to poly-vinyl alcohol be investigated to further reduce the diffusion in Fricke gels.

Effects of simulated lightning on composite and metallic joints

NASA Technical Reports Server (NTRS)

Howell, W. E.; Plumer, J. A.

1982-01-01

The effects of simulated lightning strikes and currents on aircraft bonded joints and access/inspection panels were investigated. Both metallic and composite specimens were tested. Tests on metal fuel feed through elbows in graphite/epoxy structures were evaluated. Sparking threshold and residual strength of single lap bonded joints and sparking threshold of access/inspection panels and metal fuel feed through elbows are reported.

Composite Testing

DTIC Science & Technology

2007-01-01

characterising the behaviour and ultimate load capacity of adhesively bonded joints for both composite-to-composite and composite-to-metal hybrid systems...novel hybrid joint details one of which involved perforations in the steel. The second detail employed bonding and bolting. The detail performed well...will be fabricated by four teams (3TEX, Space Micro, Tech Partnership, and Beltran) as part of the STTR Hybrid Joints Test Articles Program. Each

Sintered silver joints via controlled topography of electronic packaging subcomponents

DOEpatents

Wereszczak, Andrew A.

2014-09-02

Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

Communication: Surface-to-bulk diffusion of isolated versus interacting C atoms in Ni(111) and Cu(111) substrates: A first principle investigation.

PubMed

Harpale, Abhilash; Panesi, Marco; Chew, Huck Beng

2015-02-14

Using first principle calculations, we study the surface-to-bulk diffusion of C atoms in Ni(111) and Cu(111) substrates, and compare the barrier energies associated with the diffusion of an isolated C atom versus multiple interacting C atoms. We find that the preferential Ni-C bonding over C-C bonding induces a repulsive interaction between C atoms located at diagonal octahedral voids in Ni substrates. This C-C interaction accelerates C atom diffusion in Ni with a reduced barrier energy of ∼1 eV, compared to ∼1.4-1.6 eV for the diffusion of isolated C atoms. The diffusion barrier energy of isolated C atoms in Cu is lower than in Ni. However, bulk diffusion of interacting C atoms in Cu is not possible due to the preferential C-C bonding over C-Cu bonding, which results in C-C dimer pair formation near the surface. The dramatically different C-C interaction effects within the different substrates explain the contrasting growth mechanisms of graphene on Ni(111) and Cu(111) during chemical vapor deposition.

Hydration dynamics of a lipid membrane: Hydrogen bond networks and lipid-lipid associations

NASA Astrophysics Data System (ADS)

Srivastava, Abhinav; Debnath, Ananya

2018-03-01

Dynamics of hydration layers of a dimyristoylphosphatidylcholine (DMPC) bilayer are investigated using an all atom molecular dynamics simulation. Based upon the geometric criteria, continuously residing interface water molecules which form hydrogen bonds solely among themselves and then concertedly hydrogen bonded to carbonyl, phosphate, and glycerol head groups of DMPC are identified. The interface water hydrogen bonded to lipids shows slower relaxation rates for translational and rotational dynamics compared to that of the bulk water and is found to follow sub-diffusive and non-diffusive behaviors, respectively. The mean square displacements and the reorientational auto-correlation functions are slowest for the interfacial waters hydrogen bonded to the carbonyl oxygen since these are buried deep in the hydrophobic core among all interfacial water studied. The intermittent hydrogen bond auto-correlation functions are calculated, which allows breaking and reformations of the hydrogen bonds. The auto-correlation functions for interfacial hydrogen bonded networks develop humps during a transition from cage-like motion to eventual power law behavior of t-3/2. The asymptotic t-3/2 behavior indicates translational diffusion dictated dynamics during hydrogen bond breaking and formation irrespective of the nature of the chemical confinement. Employing reactive flux correlation analysis, the forward rate constant of hydrogen bond breaking and formation is calculated which is used to obtain Gibbs energy of activation of the hydrogen bond breaking. The relaxation rates of the networks buried in the hydrophobic core are slower than the networks near the lipid-water interface which is again slower than bulk due to the higher Gibbs energy of activation. Since hydrogen bond breakage follows a translational diffusion dictated mechanism, chemically confined hydrogen bond networks need an activation energy to diffuse through water depleted hydrophobic environments. Our calculations reveal that the slow relaxation rates of interfacial waters in the vicinity of lipids are originated from the chemical confinement of concerted hydrogen bond networks. The analysis suggests that the networks in the hydration layer of membranes dynamically facilitate the water mediated lipid-lipid associations which can provide insights on the thermodynamic stability of soft interfaces relevant to biological systems in the future.

Information diffusion, Facebook clusters, and the simplicial model of social aggregation: a computational simulation of simplicial diffusers for community health interventions.

PubMed

Kee, Kerk F; Sparks, Lisa; Struppa, Daniele C; Mannucci, Mirco A; Damiano, Alberto

2016-01-01

By integrating the simplicial model of social aggregation with existing research on opinion leadership and diffusion networks, this article introduces the constructs of simplicial diffusers (mathematically defined as nodes embedded in simplexes; a simplex is a socially bonded cluster) and simplicial diffusing sets (mathematically defined as minimal covers of a simplicial complex; a simplicial complex is a social aggregation in which socially bonded clusters are embedded) to propose a strategic approach for information diffusion of cancer screenings as a health intervention on Facebook for community cancer prevention and control. This approach is novel in its incorporation of interpersonally bonded clusters, culturally distinct subgroups, and different united social entities that coexist within a larger community into a computational simulation to select sets of simplicial diffusers with the highest degree of information diffusion for health intervention dissemination. The unique contributions of the article also include seven propositions and five algorithmic steps for computationally modeling the simplicial model with Facebook data.

Design fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

NASA Technical Reports Server (NTRS)

1979-01-01

Graphite/polyimide (Gr/PI) bolted and bonded joints were investigated. Possible failure modes and the design loads for the four generic joint types are discussed. Preliminary sizing of a type 1 joint, bonded and bolted configuration is described, including assumptions regarding material properties and sizing methodology. A general purpose finite element computer code is described that was formulated to analyze single and double lap joints, with and without tapered adherends, and with user-controlled variable element size arrangements. An initial order of Celion 6000/PMR-15 prepreg was received and characterized.

Composite pipe to metal joint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Leslie, James C.; Leslie, II, James C.; Heard, James

A method for making a metal to composite tube joint including selecting an elongated interior fitting constructed with an exterior barrel, reduced in exterior diameter to form a distally facing annular shoulder and then projecting still further distally to form an interior sleeve having a radially outwardly facing bonding surface. Selecting an elongated metal outer sleeve formed proximally with a collar constructed for receipt over the barrel and increased in interior diameter and projecting distally to form an exterior sleeve having a radially inwardly facing bonding surface cooperating with the first bonding surface to form an annulus receiving an extremitymore » of a composite tube and a bond bonding the extremity of the tube to the bonding surfaces.« less

40 CFR 80.560 - How can a refiner seek temporary relief from the requirements of this subpart in case of extreme...

Code of Federal Regulations, 2010 CFR

2010-07-01

... for NRLM diesel fuel; (2) Bond rating of entity that owns the refinery (in the case of joint ventures, include the bond rating of the joint venture entity and the bond ratings of all partners; in the case of... relief from the requirements of this subpart in case of extreme hardship circumstances? 80.560 Section 80...

Hybrid FSWeld-bonded joint fatigue behaviour

NASA Astrophysics Data System (ADS)

Lertora, Enrico; Mandolfino, Chiara; Gambaro, Carla; Pizzorni, Marco

2018-05-01

Aluminium alloys, widely used in aeronautics, are increasingly involved in the automotive industry due to the good relationship between mechanical strength and specific weight. The lightening of the structures is the first objective, which allows the decreasing in the weight in motion. The use of aluminium alloys has also seen the introduction of the Friction Stir Welding (FSW) technique for the production of structural overlapping joints. FSW allows us to weld overlap joints free from defects, but with the presence of a structural notch further aggravated by the presence of a "hook" defect near the edge of the weld. Furthermore, FSW presents a weld penetration area connected to the tool geometry and penetration. The experimental activity will be focused on the combination of two different joining techniques, which can synergistically improve the final joint resistance. In particular, the welding and bonding process most commonly known as weld-bonding is defined as a hybrid process, as it combines two different junction processes. In this paper we analyse FSWelded AA6082 aluminium alloy overlapped joint with the aim of quantitatively evaluating the improvement provided by the presence of an epoxy adhesive between the plates. After optimising the weld-bonding process, the mechanical behaviour of welded joints will be analysed by static and dynamic tests. The presence of the adhesive should limit the negative effect of the structural notch inevitable in a FSW overlapped joint.

Nonlinear analysis of bonded joints with thermal effects

NASA Technical Reports Server (NTRS)

Humphreys, E. A.; Herakovich, C. T.

1977-01-01

Nonlinear results are presented for adhesive bonded joints. It is shown that adhesive nonlinearities are only significant in the predicted adhesive shear stresses. Adherend nonlinearities and temperature dependent properties are shown to have little effect upon the adhesive stress predictions under mechanical and thermal loadings.

Evaluating of NASA-Langley Research Center explosion seam welding

NASA Technical Reports Server (NTRS)

Otto, H. E.; Wittman, R.

1977-01-01

An explosion bonding technique to meet current fabrication requirements was demonstrated. A test program was conducted on explosion bonded joints, compared to fusion joints in 6061-T6 aluminum. The comparison was made in required fixtures, non-destructive testing, static strength and fatigue strength.

The change in the diffusion of water in normal and degenerative lumbar intervertebral discs following joint mobilization compared to prone lying.

PubMed

Beattie, Paul F; Donley, Jonathan W; Arnot, Cathy F; Miller, Ronald

2009-01-01

Prospective, repeated measures obtained under treatment and control conditions. The purposes of this study were to provide preliminary evidence regarding the immediate change in the diffusion of water in the nuclear region of normal and degenerative lumbar intervertebral discs (IVDs) following a single session of lumbar joint mobilization, and to compare these findings to the immediate change in the diffusion of water following a 10-minute session of prone lying. There is conflicting evidence regarding the effectiveness and efficacy of lumbar joint mobilization. Increased knowledge of the physiologic effects of lumbar joint mobilization can lead to refinement of its clinical application. A total of 24 people (15 males and 9 females), ranging in age from 22 to 58 years, participated in this study. All subjects had a history of activity-limiting low back pain. Diffusion-weighted magnetic resonance images (DW-MRIs) were obtained immediately before and after a 10-minute session of lumbar joint mobilization. At least 1 month later, a second session was performed in which DW-MRIs were obtained immediately before and after a 10-minute session of prone lying. Following lumbar joint mobilization, a significant increase (P = .002) in the mean values for diffusion of water was observed within degenerative IVDs at L5-S1 (22.2% increase; effect size, 0.97). Degenerative IVDs at L1-2 to L4-5 and normal IVDs at L1-2 to L5-S1 did not demonstrate a change in diffusion following joint mobilization. Prone lying was not associated with a change in diffusion for normal or degenerative IVDs. The stimulus provided by lumbar joint mobilization may influence the diffusion of water in degenerative IVDs at L5-S1; however, these are preliminary findings and the relationship of these findings to pain and function needs further investigation.

A Single-Lap Joint Adhesive Bonding Optimization Method Using Gradient and Genetic Algorithms

NASA Technical Reports Server (NTRS)

Smeltzer, Stanley S., III; Finckenor, Jeffrey L.

1999-01-01

A natural process for any engineer, scientist, educator, etc. is to seek the most efficient method for accomplishing a given task. In the case of structural design, an area that has a significant impact on the structural efficiency is joint design. Unless the structure is machined from a solid block of material, the individual components which compose the overall structure must be joined together. The method for joining a structure varies depending on the applied loads, material, assembly and disassembly requirements, service life, environment, etc. Using both metallic and fiber reinforced plastic materials limits the user to two methods or a combination of these methods for joining the components into one structure. The first is mechanical fastening and the second is adhesive bonding. Mechanical fastening is by far the most popular joining technique; however, in terms of structural efficiency, adhesive bonding provides a superior joint since the load is distributed uniformly across the joint. The purpose of this paper is to develop a method for optimizing single-lap joint adhesive bonded structures using both gradient and genetic algorithms and comparing the solution process for each method. The goal of the single-lap joint optimization is to find the most efficient structure that meets the imposed requirements while still remaining as lightweight, economical, and reliable as possible. For the single-lap joint, an optimum joint is determined by minimizing the weight of the overall joint based on constraints from adhesive strengths as well as empirically derived rules. The analytical solution of the sin-le-lap joint is determined using the classical Goland-Reissner technique for case 2 type adhesive joints. Joint weight minimization is achieved using a commercially available routine, Design Optimization Tool (DOT), for the gradient solution while an author developed method is used for the genetic algorithm solution. Results illustrate the critical design variables as a function of adhesive properties and convergences of different joints based on the two optimization methods.

Microstructure characteristics of vacuum glazing brazing joints using laser sealing technique

NASA Astrophysics Data System (ADS)

Liu, Sixing; Yang, Zheng; Zhang, Jianfeng; Zhang, Shanwen; Miao, Hong; Zhang, Yanjun; Zhang, Qi

2018-05-01

Two pieces of plate glass were brazed into a composite of glazing with a vacuum chamber using PbO-TiO2-SiO2-RxOy powder filler alloys to develop a new type of vacuum glazing. The brazing process was carried out by laser technology. The interface characteristics of laser brazed joints formed between plate glass and solder were investigated using optical microscope, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD) techniques. The results show that the inter-diffusion of Pb/Ti/Si/O elements from the sealing solder toward the glass and O/Al/Si elements from the glass toward the solder, resulting in a reaction layer in the brazed joints. The microstructure phases of PbTiO3, AlSiO, SiO2 and PbO in the glass/solder interface were confirmed by XRD analysis. The joining of the sealing solder to the glass was realized by the reaction products like fibrous structures on interface, where the wetting layer can help improve the bonding performance and strength between the sealing solder and the plate glass during the laser brazing process.

Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application

NASA Astrophysics Data System (ADS)

Lee, Jong-Bum; Aw, Jie-Li; Rhee, Min-Woo

2014-09-01

Room-temperature die-attach bonding using ultrasonic energy was evaluated on Cu/In and Cu/Sn-3Ag metal stacks. The In and Sn-3Ag layers have much lower melting temperatures than the base material (Cu) and can be melted through the heat generated during ultrasonic bonding, forming intermetallic compounds (IMCs). Samples were bonded using different ultrasonic powers, bonding times, and forces and subsequently aged at 300°C for 500 h. After aging, die shear testing was performed and the fracture surfaces were inspected by scanning electron microscopy. Results showed that the shear strength of Cu/In joints reached an upper plateau after 100 h of thermal aging and remained stable with aging time, whereas that of the Cu/Sn-3Ag joints decreased with increasing aging time. η-Cu7In4 and (Cu,Au)11In9 IMCs were observed at the Cu/In joint, while Cu3Sn and (Ag,Cu)3Sn IMCs were found at the Cu/Sn-3Ag joint after reliability testing. As Cu-based IMCs have high melting temperatures, they are highly suitable for use in high-temperature electronics, but can be formed at room temperature using an ultrasonic approach.

Influence of Hydrogen Bonding on the Surface Diffusion of Molecular Glasses: Comparison of Three Triazines

DOE PAGES

Chen, Yinshan; Zhu, Men; Laventure, Audrey; ...

2017-06-26

Surface grating decay measurements have been performed on three closely related molecular glasses to study the effect of intermolecular hydrogen bonds on surface diffusion. The three molecules are derivatives of bis(3,5-dimethyl-phenylamino)-1,3,5-triazine and differ only in the functional group R at the 2-position, with R being C 2H 5, OCH 3, and NHCH 3, and referred to as “Et”, “OMe”, and “NHMe”, respectively. Of the three molecules, NHMe forms more extensive intermolecular hydrogen bonds than Et and OMe and was found to have slower surface diffusion. For Et and OMe, surface diffusion is so fast that it replaces viscous flow asmore » the mechanism of surface grating decay as temperature is lowered. In contrast, no such transition was observed for NHMe under the same conditions, indicating significantly slower surface diffusion. This result is consistent with the previous finding that extensive intermolecular hydrogen bonds slow down surface diffusion in molecular glasses and is attributed to the persistence of hydrogen bonds even in the surface environment. Here, this result is also consistent with the lower stability of the vapor-deposited glass of NHMe relative to those of Et and OMe and supports the view that surface mobility controls the stability of vapor-deposited glasses.« less

Shear sensing in bonded composites with cantilever beam microsensors and dual-plane digital image correlation

NASA Astrophysics Data System (ADS)

Baur, Jeffery W.; Slinker, Keith; Kondash, Corey

2017-04-01

Understanding the shear strain, viscoelastic response, and onset of damage within bonded composites is critical to their design, processing, and reliability. This presentation will discuss the multidisciplinary research conducted which led to the conception, development, and demonstration of two methods for measuring the shear within a bonded joint - dualplane digital image correlation (DIC) and a micro-cantilever shear sensor. The dual plane DIC method was developed to measure the strain field on opposing sides of a transparent single-lap joint in order to spatially quantify the joint shear strain. The sensor consists of a single glass fiber cantilever beam with a radially-grown forest of carbon nanotubes (CNTs) within a capillary pore. When the fiber is deflected, the internal radial CNT array is compressed against an electrode within the pore and the corresponding decrease in electrical resistance is correlated with the external loading. When this small, simple, and low-cost sensor was integrated within a composite bonded joint and cycled in tension, the onset of damage prior to joint failure was observed. In a second sample configuration, both the dual plane DIC and the hair sensor detected viscoplastic changes in the strain of the sample in response to continued loading.

Method of making a composite tube to metal joint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Leslie, James C.; Leslie, II, James C.; Heard, James

A method for making a metal to composite tube joint including selecting an elongated interior fitting constructed with an exterior barrel, reduced in exterior diameter to form a distally facing annular shoulder and then projecting still further distally to form an interior sleeve having a radially outwardly facing bonding surface. Selecting an elongated metal outer sleeve formed proximally with a collar constructed for receipt over the barrel and increased in interior diameter and projecting distally to form an exterior sleeve having a radially inwardly facing bonding surface cooperating with the first bonding surface to form an annulus receiving an extremitymore » of a composite tube and a bond bonding the extremity of the tube to the bonding surfaces.« less

The Effect of Limited Diffusion and Wet-Dry Cycling on Reversible Polymerization Reactions: Implications for Prebiotic Synthesis of Nucleic Acids.

PubMed

Higgs, Paul G

2016-06-08

A long-standing problem for the origins of life is that polymerization of many biopolymers, including nucleic acids and peptides, is thermodynamically unfavourable in aqueous solution. If bond making and breaking is reversible, monomers and very short oligomers predominate. Recent experiments have shown that wetting and drying cycles can overcome this problem and drive the formation of longer polymers. In the dry phase, bond formation is favourable, but diffusion is restricted, and bonds only form between monomers that are initially close together. In the wet phase, some of the bonds are hydrolyzed. However, repositioning of the molecules allows new bonds to form in the next dry phase, leading to an increase in mean polymer length. Here, we consider a simple theoretical model that explains the effect of cycling. There is an equilibrium length distribution with a high mean length that could be achieved if diffusion occurred freely in the dry phase. This equilibrium is inaccessible without diffusion. A single dry cycle without diffusion leads to mean lengths much shorter than this. Repeated cycling leads to a significant increase in polymerization relative to a single cycle. In the most favourable case, cycling leads to the same equilibrium length distribution as would be achieved if free diffusion were possible in the dry phase. These results support the RNA World scenario by explaining a potential route to synthesis of long RNAs; however, they also imply that cycling would be beneficial to the synthesis of other kinds of polymers, including peptides, where bond formation involves a condensation reaction.

The Effect of Limited Diffusion and Wet–Dry Cycling on Reversible Polymerization Reactions: Implications for Prebiotic Synthesis of Nucleic Acids

PubMed Central

Higgs, Paul G.

2016-01-01

A long-standing problem for the origins of life is that polymerization of many biopolymers, including nucleic acids and peptides, is thermodynamically unfavourable in aqueous solution. If bond making and breaking is reversible, monomers and very short oligomers predominate. Recent experiments have shown that wetting and drying cycles can overcome this problem and drive the formation of longer polymers. In the dry phase, bond formation is favourable, but diffusion is restricted, and bonds only form between monomers that are initially close together. In the wet phase, some of the bonds are hydrolyzed. However, repositioning of the molecules allows new bonds to form in the next dry phase, leading to an increase in mean polymer length. Here, we consider a simple theoretical model that explains the effect of cycling. There is an equilibrium length distribution with a high mean length that could be achieved if diffusion occurred freely in the dry phase. This equilibrium is inaccessible without diffusion. A single dry cycle without diffusion leads to mean lengths much shorter than this. Repeated cycling leads to a significant increase in polymerization relative to a single cycle. In the most favourable case, cycling leads to the same equilibrium length distribution as would be achieved if free diffusion were possible in the dry phase. These results support the RNA World scenario by explaining a potential route to synthesis of long RNAs; however, they also imply that cycling would be beneficial to the synthesis of other kinds of polymers, including peptides, where bond formation involves a condensation reaction. PMID:27338479

Retort braze bonding of borsic/aluminum composite sheet to titanium

NASA Technical Reports Server (NTRS)

Webb, B. A.; Dolowy, J. F., Jr.

1975-01-01

Braze bonding studies between Borsic/aluminum composite and titanium sheet were conducted to establish acceptable brazing techniques and to assess potential joint efficiencies. Excellent braze joints were produced which exhibited joint strengths exceeding 117 MPa (17,000 psi) and which retained up to 2/3 of this strength at 589 K (600 F). Noticeable composite strength degradation resulting from the required high temperature braze cycle was found to be a problem.

Interplay between translational diffusion and large-amplitude angular jumps of water molecules

NASA Astrophysics Data System (ADS)

Liu, Chao; Zhang, Yangyang; Zhang, Jian; Wang, Jun; Li, Wenfei; Wang, Wei

2018-05-01

Understanding the microscopic mechanism of water molecular translational diffusion is a challenging topic in both physics and chemistry. Here, we report an investigation on the interplay between the translational diffusion and the large-amplitude angular jumps of water molecules in bulk water using molecular dynamics simulations. We found that large-amplitude angular jumps are tightly coupled to the translational diffusions. Particularly, we revealed that concurrent rotational jumps of spatially neighboring water molecules induce inter-basin translational jumps, which contributes to the fast component of the water translational diffusion. Consequently, the translational diffusion shows positional heterogeneity; i.e., the neighbors of the water molecules with inter-basin translational jumps have larger probability to diffuse by inter-basin translational jumps. Our control simulations showed that a model water molecule with moderate hydrogen bond strength can diffuse much faster than a simple Lennard-Jones particle in bulk water due to the capability of disturbing the hydrogen bond network of the surrounding water molecules. Our results added to the understanding of the microscopic picture of the water translational diffusion and demonstrated the unique features of water diffusion arising from their hydrogen bond network structure compared with those of the simple liquids.

Capillary flow weld-bonding

NASA Technical Reports Server (NTRS)

Vaughan, R. W.; Jones, R. J. (Inventor)

1976-01-01

The invention of a weld-bonding technique for titanium plates was described. This involves fastening at least two plates of titanium together using spot-welding and applying a bead of adhesive along the edge of the resistance spot-welded joint which upon heating, flows and fills the separation between the joint components.

Electrical resistance determination of actual contact area of cold welded metal joints

NASA Technical Reports Server (NTRS)

Hordon, M. J.

1970-01-01

Method measures the area of the bonded zone of a compression weld by observing the electrical resistance of the weld zone while the load changes from full compression until the joint ruptures under tension. The ratio of bonding force to maximum tensile load varies considerably.

High-Temperature Active Soldering of SiC Particle-Reinforced Al-MMC Using a Novel ZnAlGaMgTi Filler Metal

NASA Astrophysics Data System (ADS)

Chen, Biqiang; Zhang, Guifeng; Zhang, Linjie; Xu, Tingting

2017-10-01

In order to broaden the application of SiC particle-reinforced aluminum matrix composite in electronics packaging, newly developed ZnAlGaMgTi filler with a low melting point of 418-441 °C was utilized as filler metal for active soldering of aluminum matrix composites (70 vol.%, SiCp/Al-MMCs) for the first time. The effect of loading pressure on joint properties of ZnAlGaMgTi active filler was investigated. The experimental results indicated that novel filler could successfully solder Al-MMCs, and the presence of Mg in the filler enhanced the penetration of Zn, while the forming of Zn-rich barrier layer influenced the active element MPD (melting point depressant) diffusion into parent composite, and the bulk-like (Mg-Si)-rich phase and Ti-containing phase were readily observed at the interface and bond seam. With the increase in loading pressure, the runout phenomenon appeared more significant, and the filler foil thickness and the Zn penetration depth varied pronouncedly. Sound joints with maximum shear strength of 29.6 MPa were produced at 480 °C at 1 MPa, and the crack occurred adjacent to the boundary of SiC particle and then propagated along the interface. A novel model describing the significant mutual diffusion of Al and Zn atoms between the parent material and solder was proposed.

Measurement of damping of graphite epoxy composite materials and structural joints

NASA Technical Reports Server (NTRS)

Crocker, Malcolm J.; Rao, Mohan D.; Raju, P. K.; Yan, Xinche

1989-01-01

The damping capacity of graphite epoxy materials and structural joints was evaluated. The damping ratio of different composite specimens and bonded joints were systematically evaluated under normal atmospheric conditions and in a vacuum environment. Free and forced vibration test methods were employed for measuring the damping ratios. The effect of edge support conditions on the damping value of a composite tube specimen was studied by using a series of experiments performed on the specimen with different edge supports. It was found that simulating a free-free boundary conditions by having no constraints at the ends gives the lowest value of the material damping of the composite. The accuracy of the estimation of the damping ratio value was improved by using a curve-fitting technique on the response data obtained through measurement. The effect of outgassing (moisture desorption) on the damping capacity was determined by measuring the damping ratio of the tube specimen in a vacuum environment before and after outgassing had occurred. The effects of high and low temperatures on the damping was also investigated by using a series of experiments on tube and beam specimens. An analytical model to study the vibrations of a bonded lap joint system was formulated. Numerical results were generated for different overlap ratios of the system. These were compared with experimental results. In order to determine the influence of bonded joints on the material damping capacity, experiments were conducted on bonded lap-jointed and double-butt-jointed specimens. These experimental results were compared with simple beam specimens with no joints.

Study on the Strength of GFRP/Stainless Steel Adhesive Joints Reinforced with Glass Mat

NASA Astrophysics Data System (ADS)

Iwasa, Masaaki

The adhesive strengths of glass fiber reinforced plastics/metal adhesive joints reinforced with glass mat under tensile shear loads and tensile loads were investigated analytically and experimentally. First, the stress singularity parameters of the bonding edges were analyzed by FEM for various types of adhesive joints reinforced with glass mat. The shear stress and normal stress distributions near the bonding edge can be expressed by two stress singularity parameters. Second, tensile shear tests were performed on taper lap joint and taper lap joint reinforced with glass mat and tensile tests were performed on T-type adhesive joint and T-type adhesive joint reinforced with glass mat. The relationships between the loads and the crosshead displacements were measured. We concluded that reinforcing adhesive joints has a greater effect on strength under tensile load than under tensile shear load. The adhesive joints strength reinforced with glass mat can be evaluated by using stress singularity parameters.

Corrosion behaviour of friction-bit-joined and weld-bonded AA7075-T6/galvannealed DP980

DOE PAGES

Lim, Yong Chae; Squires, Lile; Pan, Tsung-Yu; ...

2016-12-22

Joining of aluminium alloys 7075-T6 and galvannealed dual phase 980 steel was achieved by friction bit joining (FBJ) and weld-bonding (FBJ + adhesive) processes. Accelerated laboratory-scale corrosion tests were performed on both FBJ only and weld-bonded specimens to study joint strength under a corrosive environment. Static lap shear tests showed that both FBJ only and weld-bonded cases generally retained more than 80% of the joint strength of non-corroded specimens at the end of corrosion testing. The presence of Zn/Fe coating on the steel substrate resulted in improved corrosion resistance for FBJ specimens, compared to joints produced with bare steel. Finally,more » an optical microscopy was used for cross-sectional analysis of corroded specimens. Some corrosion on the joining bit was observed near the bit head. However, the joining bit was still intact on the steel substrate, indicating that the primary bond was sound.« less

Corrosion behaviour of friction-bit-joined and weld-bonded AA7075-T6/galvannealed DP980

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lim, Yong Chae; Squires, Lile; Pan, Tsung-Yu

Joining of aluminium alloys 7075-T6 and galvannealed dual phase 980 steel was achieved by friction bit joining (FBJ) and weld-bonding (FBJ + adhesive) processes. Accelerated laboratory-scale corrosion tests were performed on both FBJ only and weld-bonded specimens to study joint strength under a corrosive environment. Static lap shear tests showed that both FBJ only and weld-bonded cases generally retained more than 80% of the joint strength of non-corroded specimens at the end of corrosion testing. The presence of Zn/Fe coating on the steel substrate resulted in improved corrosion resistance for FBJ specimens, compared to joints produced with bare steel. Finally,more » an optical microscopy was used for cross-sectional analysis of corroded specimens. Some corrosion on the joining bit was observed near the bit head. However, the joining bit was still intact on the steel substrate, indicating that the primary bond was sound.« less

LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

NASA Astrophysics Data System (ADS)

Tang, Y. K.; Hsu, Y. C.; Lin, E. J.; Hu, Y. J.; Liu, C. Y.

2016-12-01

In this study, light emitting diode (LED) chips were die-bonded on a Ag/Cu substrate by a Sn-BixZn-Sn bonding system. A high die-bonding strength is successfully achieved by using a Sn-BixZn-Sn ternary system. At the bonding interface, there is observed a Bi-segregation phenomenon. This Bi-segregation phenomenon solves the problems of the brittle layer-type Bi at the joint interface. Our shear test results show that the bonding interface with Bi-segregation enhances the shear strength of the LED die-bonding joints. The Bi-0.3Zn and Bi-0.5Zn die-bonding cases have the best shear strength among all die-bonding systems. In addition, we investigate the atomic depth profile of the deposited Bi-xZn layer by evaporating Bi-xZn E-gun alloy sources. The initial Zn content of the deposited Bi-Zn alloy layers are much higher than the average Zn content in the deposited Bi-Zn layers.

On the use of the EMI for the health monitoring of bonded elements

NASA Astrophysics Data System (ADS)

Gulizzi, Vincenzo; Rizzo, Piervincenzo; Milazzo, Alberto

2014-03-01

The low weight, robustness and fatigue resistance of adhesive joints make them suitable for structural joints. A fully developed nondestructive evaluation technique however is needed to monitor and assess the quality of bonded joints. In the present paper the application of the electromechanical impedance (EMI) technique is proposed. In the EMI method a piezoelectric transducer (PZT) is attached to the structure of interest. The high sensitivity and low power consumption make the EMI method feasible for real time structural health monitoring. In this study we investigated the sensitivity of the electromechanical response of a PZT to the curing and the quality of the adhesive used for bonded joints. A PXI unit running under LabView and an auxiliary circuit were employed to measure the electric impedance of a PZT glued to an aluminum plate. The system aimed at monitoring the bond line between an aluminum strip and the plate. The conductive signature of the PZT was measured and analyzed during the curing. The experimental results show that the electromechanical impedance technique is sensitive to the curing time and variations are observed for adhesives of different quality.

Nondestructive Evaluation of Adhesively Bonded Joints

NASA Technical Reports Server (NTRS)

Nayeb-Hashemi, Hamid; Rossettos, J. N.

1997-01-01

The final report consists of 5 published papers in referred journals and a technical letter to the technical monitor. These papers include the following: (1) Comparison of the effects of debonds and voids in adhesive; (2) On the peak shear stresses in adhesive joints with voids; (3) Nondestructive evaluation of adhesively bonded joints by acousto-ultrasonic technique and acoustic emission; (4) Multiaxial fatigue life evaluation of tubular adhesively bonded joints; (5) Theoretical and experimental evaluation of the bond strength under peeling loads. The letter outlines the progress of the research. Also included is preliminary information on the study of nondestructive evaluation of composite materials subjected to localized heat damage. The investigators studied the effects of localized heat on unidirectional fiber glass epoxy composite panels. Specimens of the fiber glass epoxy composites were subjected to 400 C heat for varying lengths of time. The specimens were subjected to nondestructive tests. The specimens were then pulled to their failure and acoustic emission of these specimens were measured. The analysis of the data was continuing as of the writing of the letter, and includes a finite element stress analysis of the problem.

Multi-objective optimization on laser solder jet bonding process in head gimbal assembly using the response surface methodology

NASA Astrophysics Data System (ADS)

Deeying, J.; Asawarungsaengkul, K.; Chutima, P.

2018-01-01

This paper aims to investigate the effect of laser solder jet bonding parameters to the solder joints in Head Gimbal Assembly. Laser solder jet bonding utilizes the fiber laser to melt solder ball in capillary. The molten solder is transferred to two bonding pads by nitrogen gas. The response surface methodology have been used to investigate the effects of laser energy, wait time, nitrogen gas pressure, and focal position on the shear strength of solder joints and the change of pitch static attitude (PSA). The response surface methodology is employed to establish the reliable mathematical relationships between the laser soldering parameters and desired responses. Then, multi-objective optimization is conducted to determine the optimal process parameters that can enhance the joint shear strength and minimize the change of PSA. The validation test confirms that the predicted value has good agreement with the actual value.

Joining of alumina via copper/niobium/copper interlayers

DOE Office of Scientific and Technical Information (OSTI.GOV)

Marks, Robert A.; Chapman, Daniel R.; Danielson, David T.

2000-03-15

Alumina has been joined at 1150 degrees C and 1400 degrees C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (approximately equal 240 plus/minus 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized aluminamore » bonds, bend tests at 800 degrees C-1100 degrees C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Post-bonding anneals at 1000 degrees C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface.« less

Fluxless eutectic bonding of GaAs-on-Si by using Ag/Sn solder

NASA Astrophysics Data System (ADS)

Eo, Sung-Hwa; Kim, Dae-Seon; Jeong, Ho-Jung; Jang, Jae-Hyung

2013-11-01

Fluxless GaAs-on-Si wafer bonding using Ag/Sn solder was investigated to realize uniform and void-free heterogeneous material integration. The effects of the diffusion barrier, Ag/Sn thickness, and Ar plasma treatment were studied to achieve the optimal fluxless bonding process. Pt on a GaAs wafer and Mo on a Si wafer act as diffusion barriers by preventing the flow of Ag/Sn solder into both the wafers. The bonding strength is closely related to the Ag/Sn thickness and Ar plasma treatment. A shear strength test was carried out to investigate the bonding strength. Under identical bonding conditions, the Ag/Sn thickness was optimized to achieve higher bonding strength and to avoid the formation of voids due to thermal stress. An Ar plasma pretreatment process improved the bonding strength because the Ar plasma removed carbon contaminants and metal-oxide bonds from the metal surface.

Roll diffusion bonding of titanium alloy panels

NASA Technical Reports Server (NTRS)

Bennett, J.; De Witt, T. E.; Jones, A. G.; Koeller, F.; Muser, C.

1968-01-01

Roll diffusion bonding technique is used for fabricating T-stiffened panel assemblies from titanium alloy. The single unit fabrication exhibits excellent strength characteristics under tensile and compressive loads. This program is applied to structures in which weight/strength ratio and integral construction are important considerations.

Theoretical and Experimental Evaluation of the Bond Strength Under Peeling Loads

NASA Technical Reports Server (NTRS)

Nayeb-Hashemi, Hamid; Jawad, Oussama Cherkaoui

1997-01-01

Reliable applications of adhesively bonded joints require understanding of the stress distribution along the bond-line and the stresses that are responsible for the joint failure. To properly evaluate factors affecting peel strength, effects of defects such as voids on the stress distribution in the overlap region must be understood. In this work, the peel stress distribution in a single lap joint is derived using a strength of materials approach. The bonded joint is modeled as Euler-Bernoulli beams, bonded together with an adhesive. which is modeled as an elastic foundation which can resist both peel and shear stresses. It is found that for certain adhesive and adherend geometries and properties, a central void with the size up to 50 percent of the overlap length has negligible effect on the peak peel and shear stresses. To verify the solutions obtained from the model, the problem is solved again by using the finite element method and by treating the adherends and the adhesive as elastic materials. It is found that the model used in the analysis not only predicts the correct trend for the peel stress distribution but also gives rather surprisingly close results to that of the finite element analysis. It is also found that both shear and peel stresses can be responsible for the joint performance and when a void is introduced, both of these stresses can contribute to the joint failure as the void size increases. Acoustic emission (AE) activities of aluminum-adhesive-aluminum specimens with different void sizes were monitored. The AE ringdown counts and energy were very sensitive and decreased significantly with the void size. It was observed that the AE events were shifting towards the edge of the overlap where the maximum peeling and shearing stresses were occurring as the void size increased.

Kinetic Monte Carlo Simulations of Oxygen Diffusion in Environmental Barrier Coating Materials

NASA Technical Reports Server (NTRS)

Good, Brian S.

2017-01-01

Ceramic Matrix Composite (CMC) materials are of interest for use in next-generation turbine engine components, offering a number of significant advantages, including reduced weight and high operating temperatures. However, in the hot environment in which such components operate, the presence of water vapor can lead to corrosion and recession, limiting the useful life of the components. Such degradation can be reduced through the use of Environmental Barrier Coatings (EBCs) that limit the amount of oxygen and water vapor reaching the component. Candidate EBC materials include Yttrium and Ytterbium silicates. In this work we present results of kinetic Monte Carlo (kMC) simulations of oxygen diffusion, via the vacancy mechanism, in Yttrium and Ytterbium disilicates, along with a brief discussion of interstitial diffusion. An EBC system typically includes a bond coat located between the EBC and the component surface. Bond coat materials are generally chosen for properties other than low oxygen diffusivity, but low oxygen diffusivity is nevertheless a desirable characteristic, as the bond coat could provide some additional component protection, particularly in the case where cracks in the coating system provide a direct path from the environment to the bond coat interface. We have therefore performed similar kMC simulations of oxygen diffusion in this material.

Numerical and Experimental Characterization of a Composite Secondary Bonded Adhesive Lap Joint Using the Ultrasonics method

NASA Astrophysics Data System (ADS)

Kumar, M. R.; Ghosh, A.; Karuppannan, D.

2018-05-01

The construction of aircraft using advanced composites have become very popular during the past two decades, in which many innovative manufacturing processes, such as cocuring, cobonding, and secondary bonding processes, have been adopted. The secondary bonding process has become less popular than the other two ones because of nonavailability of process database and certification issues. In this article, an attempt is made to classify the quality of bonding using nondestructive ultrasonic inspection methods. Specimens were prepared and tested using the nondestructive ultrasonic Through Transmission (TT), Pulse Echo (PE), and air coupled guided wave techniques. It is concluded that the ultrasonic pulse echo technique is the best one for inspecting composite secondary bonded adhesive joints.

Evaluation of the Transient Liquid Phase (TLP) Bonding Process for Ti3Al-Based Honeycomb Core Sandwich Structure

NASA Technical Reports Server (NTRS)

Bird, R. Keith; Hoffman, Eric K.

1998-01-01

The suitability of using transient liquid phase (TLP) bonding to fabricate honeycomb core sandwich panels with Ti-14Al-21Nb (wt%) titanium aluminide (T3Al) face sheets for high-temperature hypersonic vehicle applications was evaluated. Three titanium alloy honeycomb cores and one Ti3Al alloy honeycomb core were investigated. Edgewise compression (EWC) and flatwise tension (FWT) tests on honeycomb core sandwich specimens and tensile tests of the face sheet material were conducted at temperatures ranging from room temperature to 1500 F. EWC tests indicated that the honeycomb cores and diffusion bonded joints were able to stabilize the face sheets up to and beyond the face sheet compressive yield strength for all temperatures investigated. The specimens with the T3Al honeycomb core produced the highest FWT strengths at temperatures above 1000 F. Tensile tests indicated that TLP processing conditions resulted in decreases in ductility of the Ti-14Al-21Nb face sheets. Microstructural examination showed that the side of the face sheets to which the filler metals had been applied was transformed from equiaxed alpha2 grains to coarse plates of alpha2 with intergranular Beta. Fractographic examination of the tensile specimens showed that this transformed region was dominated by brittle fracture.

Self-Diffusion in Amorphous Silicon by Local Bond Rearrangements

NASA Astrophysics Data System (ADS)

Kirschbaum, J.; Teuber, T.; Donner, A.; Radek, M.; Bougeard, D.; Böttger, R.; Hansen, J. Lundsgaard; Larsen, A. Nylandsted; Posselt, M.; Bracht, H.

2018-06-01

Experiments on self-diffusion in amorphous silicon (Si) were performed at temperatures between 460 to 600 ° C . The amorphous structure was prepared by Si ion implantation of single crystalline Si isotope multilayers epitaxially grown on a silicon-on-insulator wafer. The Si isotope profiles before and after annealing were determined by means of secondary ion mass spectrometry. Isothermal diffusion experiments reveal that structural relaxation does not cause any significant intermixing of the isotope interfaces whereas self-diffusion is significant before the structure recrystallizes. The temperature dependence of self-diffusion is described by an Arrhenius law with an activation enthalpy Q =(2.70 ±0.11 ) eV and preexponential factor D0=(5.5-3.7+11.1)×10-2 cm2 s-1 . Remarkably, Q equals the activation enthalpy of hydrogen diffusion in amorphous Si, the migration of bond defects determining boron diffusion, and the activation enthalpy of solid phase epitaxial recrystallization reported in the literature. This close agreement provides strong evidence that self-diffusion is mediated by local bond rearrangements rather than by the migration of extended defects as suggested by Strauß et al. (Phys. Rev. Lett. 116, 025901 (2016), 10.1103/PhysRevLett.116.025901).

Bond lifetime and diffusion coefficient in colloids with short-range interactions.

PubMed

Ndong Mintsa, E; Germain, Ph; Amokrane, S

2015-03-01

We use molecular dynamics simulations to study the influence of short-range structures in the interaction potential between hard-sphere-like colloidal particles. Starting from model potentials and effective potentials in binary mixtures computed from the Ornstein-Zernike equations, we investigate the influence of the range and strength of a possible tail beyond the usual core repulsion or the presence of repulsive barriers. The diffusion coefficient and mean "bond" lifetimes are used as indicators of the effect of this structure on the dynamics. The existence of correlations between the variations of these quantities with the physical parameters is discussed to assess the interpretation of dynamics slowing down in terms of long-lived bonds. We also discuss the question of a universal behaviour determined by the second virial coefficient B ((2)) and the interplay of attraction and repulsion. While the diffusion coefficient follows the B ((2)) law for purely attractive tails, this is no longer true in the presence of repulsive barriers. Furthermore, the bond lifetime shows a dependence on the physical parameters that differs from that of the diffusion coefficient. This raises the question of the precise role of bonds on the dynamics slowing down in colloidal gels.

The dissimilar brazing of Kovar alloy to SiCp/Al composites using silver-based filler metal foil

NASA Astrophysics Data System (ADS)

Wang, Peng; Xu, Dongxia; Zhai, Yahong; Niu, Jitai

2017-09-01

Aluminum metal matrix composites with high SiC content (60 vol.% SiCp/Al MMCs) were surface metallized with a Ni-P alloy coating, and vacuum brazing between the composites and Kovar alloy were performed using rapidly cooled Ag-22.0Cu-15.9In-10.86Sn-1.84Ti (wt%) foil. The effects of Ni-P alloy coating and brazing parameters on the joint microstructures and properties were researched by SEM, EDS, and single lap shear test, respectively. Results show that Ag-Al intermetallic strips were formed in the 6063Al matrix and filler metal layer because of diffusion, and they were arranged regularly and accumulated gradually as the brazing temperature was increased ( T/°C = 550-600) or the soaking time was prolonged ( t/min = 10-50). However, excessive strips would destroy the uniformity of seams and lead to a reduced bonding strength (at most 70 MPa). Using a Ni-P alloy coating, void free joints without those strips were obtained at 560 °C after 20 min soaking time, and a higher shear strength of 90 MPa was achieved. The appropriate interface reaction ( 2 μm transition layer) that occurred along the Ni-P alloy coating/filler metal/Kovar alloy interfaces resulted in better metallurgical bonding. In this research, the developed Ag-based filler metal was suitable for brazing the dissimilar materials of Ni-P alloy-coated SiCp/Al MMCs and Kovar alloy, and capable welding parameters were also broadened.

Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper

NASA Astrophysics Data System (ADS)

Thirunavukarasu, Gopinath; Kundu, Sukumar; Laha, Tapas; Roy, Deb; Chatterjee, Subrata

2017-11-01

An investigation was carried out to know the extent of influence of bonding-time on the interface structure and mechanical properties of diffusion bonding (DB) of TiA|Cu|SS. DB of Ti6Al4V (TiA) and 304 stainless steel (SS) using pure copper (Cu) of 200-μm thickness were processed in vacuum using 4-MPa bonding-pressure at 1123 K from 15 to 120 min in steps of 15 min. Preparation of DB was not possible when bonding-time was less than 60 min as the bonding at Cu|SS interface was unsuccessful in spite of effective bonding at TiA|Cu interface; however, successful DB were produced when the bonding-time was 60 min and beyond. DB processed for 60 and 75 min (classified as shorter bonding-time interval) showed distinctive characteristics (structural, mechanical, and fractural) as compared to the DB processed for 90, 105, and 120 min (classified as longer bonding-time interval). DB processed for 60 and 75 min exhibited layer-wise Cu-Ti-based intermetallics at TiA|Cu interface, whereas Cu|SS interface was completely free from reaction products. The layer-wise structure of Cu-Ti-based intermetallics were not observed at TiA|Cu interface in the DB processed for longer bonding-time; however, the Cu|SS interface had layer-wise ternary intermetallic compounds (T1, T2, and T3) of Cu-Fe-Ti-based along with σ phase depending upon the bonding-time chosen. Diffusivity of Ti-atoms in Cu-layer (DTi in Cu-layer) was much greater than the diffusivity of Fe-atoms in Cu-layer (DFe in Cu-layer). Ti-atoms reached Cu|SS interface but Fe-atoms were unable to reach TiA|Cu interface. It was observed that DB fractured at Cu|SS interface when processed for shorter bonding-time interval, whereas the DB processed for longer bonding-time interval fractured apparently at the middle of Cu-foil region predominantly due to the existence of brittle Cu-Fe-Ti-based intermetallics.

Experimental analysis of two-layered dissimilar metals by roll bonding

NASA Astrophysics Data System (ADS)

Zhao, Guanghui; Li, Yugui; Li, Juan; Huang, Qingxue; Ma, Lifeng

2018-02-01

Rolling reduction and base layers thickness have important implications for rolling compounding. A two-layered 304 stainless steel/Q345R low alloyed steel was roll bonded. The roll bonding was performed at the three thickness reductions of 25%, 40% and 55% with base layers of various thicknesses (Q345R). The microstructures of the composite were investigated by the ultra-deep microscope (OM) and scanning electron microscope (SEM) and Transmission electron microscope (TEM). Simultaneously, the mechanical properties of the composite were experimentally measured and the tensile fracture surfaces were observed by SEM. The interfaces were successfully bonded without any cracking or voids, which indicated a good fabrication of the 304/Q345R composite. The rolling reduction rate and thinning increase of the substrate contributed to the bonding effects appearance of the roll bonded sheet. The Cr and Ni enriched diffusion layer was formed by the interface elements diffusion. The Cr and Ni diffusion led to the formation of ˜10 μm wide Cr and Ni layers on the carbon steel side.

Non-classical adhesive-bonded joints in practical aerospace construction

NASA Technical Reports Server (NTRS)

Hart-Smith, L. J.

1973-01-01

Solutions are derived for adhesive-bonded joints of non-classical geometries. Particular attention is given to bonded doublers and to selective reinforcement by unidirectional composites. Non-dimensionalized charts are presented for the efficiency limit imposed on the skin as the result of the eccentricity in the load path through the doubler. It is desirable to employ a relativly large doubler to minimize the effective eccentricity in the load path. The transfer stresses associated with selective reinforcement of metal structures by advanced composites are analyzed. Reinforcement of bolt holes in composites by bonded metal doublers is covered quantitatively. Also included is the adhesive joint analysis for shear flow in a multi-cell torque box, in which the bond on one angle becomes more critical sooner than those on the others, thereby restricting the strength to less than the total of each maximum strength when acting alone. Adhesive plasticity and adherend stiffness and thermal imbalances are included. A simple analysis/design technique of solution in terms of upper and lower bounds on an all-plastic adhesive analysis is introduced.

Solid State Joining of Dissimilar Titanium Alloys

NASA Astrophysics Data System (ADS)

Morton, Todd W.

Solid state joining of titanium via friction stir welding and diffusion bonding have emerged as enablers of efficient monolithic structural designs by the eliminations fasteners for the aerospace industry. As design complexity and service demands increase, the need for joints of dissimilar alloys has emerged. Complex thermomechanical conditions in friction stir weld joints and high temperature deformation behavior differences between alloys used in dissimilar joints gives rise to a highly variable flow pattern within a stir zone. Experiments performed welding Ti-6Al-4V to beta21S show that mechanical intermixing of the two alloys is the primary mechanism for the generation of the localized chemistry and microstructure, the magnitude of which can be directly related to pin rotation and travel speed weld parameters. Mechanical mixing of the two alloys is heavily influenced by strain rate softening phenomena, and can be used to manipulate weld nugget structure by switching which alloy is subjected to the advancing side of the pin. Turbulent mixing of a weld nugget and a significant reduction in defects and weld forces are observed when the beta21S is put on the advancing side of the weld where higher strain rates are present. Chemical diffusion driven by the heat of weld parameters is characterized using energy dispersive x-ray spectroscopy (EDS) and is shown to be a secondary process responsible for generating short-range chemical gradients that lead to a gradient of alpha particle structures. Diffusion calculations are inconsistent with an assumption of steady-state diffusion and show that material interfaces in the weld nugget evolve through the break-down of turbulent interface features generated by material flows. A high degree of recrystallization is seen throughout the welds, with unique, hybrid chemistry grains that are generated at material interfaces in the weld nugget that help to unify the crystal structure of dissimilar alloys. The degree of recrystallization is tied to the localized thermal profile in the weld nugget as well as the heating rates of a given set of weld parameters. Slow kinetics of alpha dissolution relative to the heating rate and process times of friction stir welding suggest an alpha-particle assisted super-transus recrystallization process contributes to a refined grain size in weld parameters utilizing high travel speed.

Silver plating ensures reliable diffusion bonding of dissimilar metals

NASA Technical Reports Server (NTRS)

1967-01-01

Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.

Design, Static Analysis And Fabrication Of Composite Joints

NASA Astrophysics Data System (ADS)

Mathiselvan, G.; Gobinath, R.; Yuvaraja, S.; Raja, T.

2017-05-01

The Bonded joints will be having one of the important issues in the composite technology is the repairing of aging in aircraft applications. In these applications and also for joining various composite material parts together, the composite materials fastened together either using adhesives or mechanical fasteners. In this paper, we have carried out design, static analysis of 3-D models and fabrication of the composite joints (bonded, riveted and hybrid). The 3-D model of the composite structure will be fabricated by using the materials such as epoxy resin, glass fibre material and aluminium rivet for preparing the joints. The static analysis was carried out with different joint by using ANSYS software. After fabrication, parametric study was also conducted to compare the performance of the hybrid joint with varying adherent width, adhesive thickness and overlap length. Different joint and its materials tensile test result have compared.

Strengthening of defected beam-column joints using CFRP.

PubMed

Mahmoud, Mohamed H; Afefy, Hamdy M; Kassem, Nesreen M; Fawzy, Tarek M

2014-01-01

This paper presents an experimental study for the structural performance of reinforced concrete (RC) exterior beam-column joints rehabilitated using carbon-fiber-reinforced polymer (CFRP). The present experimental program consists of testing 10 half-scale specimens divided into three groups covering three possible defects in addition to an adequately detailed control specimen. The considered defects include the absence of the transverse reinforcement within the joint core, insufficient bond length for the beam main reinforcement and inadequate spliced implanted column on the joint. Three different strengthening schemes were used to rehabilitate the defected beam-column joints including externally bonded CFRP strips and sheets in addition to near surface mounted (NSM) CFRP strips. The failure criteria including ultimate capacity, mode of failure, initial stiffness, ductility and the developed ultimate strain in the reinforcing steel and CFRP were considered and compared for each group for the control and the CFRP-strengthened specimens. The test results showed that the proposed CFRP strengthening configurations represented the best choice for strengthening the first two defects from the viewpoint of the studied failure criteria. On the other hand, the results of the third group showed that strengthening the joint using NSM strip technique enabled the specimen to outperform the structural performance of the control specimen while strengthening the joints using externally bonded CFRP strips and sheets failed to restore the strengthened joints capacity.

Diffusion bonding between W and EUROFER97 using V interlayer

NASA Astrophysics Data System (ADS)

Basuki, Widodo Widjaja; Aktaa, Jarir

2012-10-01

Diffusion bonding is selected to join W to EUROFER97 for the manufacturing of some components in the fusion technology. A direct bonding does not seem feasible due to the high interfacial residual stress induced by the large mismatch of the coefficient of thermal expansions of both materials to be bonded. To reduce the residual stress, a V plate with a thickness of 1 mm was introduced as an interlayer. The diffusion bonding was conducted at 1050 °C for 1 h. The uniaxial applied compression stress was calculated considering the 5% allowable creep deformation on the EUROFER97's side. Investigations on bonded specimens showed defect free interfaces. Microstructure alterations were detected just at the EUROFER97/V interface. A very hard layer assumed to be a σ phase with a thickness of about 4 μm was found on the EUROFER97's side along the bond interface. A 6 μm carbide layer containing V2C with also a high hardness value was identified on the V interlayer's side. The impact toughness of the bonded specimens was low, however comparable to that of tungsten especially if the specimens were tested at RT. Tensile test at 550 °C showed a relatively high tensile strength of bonded specimens, which achieved about 50% of the tensile strength of EUROFER97.

The Analysis of Adhesively Bonded Advanced Composite Joints Using Joint Finite Elements

NASA Technical Reports Server (NTRS)

Stapleton, Scott E.; Waas, Anthony M.

2012-01-01

The design and sizing of adhesively bonded joints has always been a major bottleneck in the design of composite vehicles. Dense finite element (FE) meshes are required to capture the full behavior of a joint numerically, but these dense meshes are impractical in vehicle-scale models where a course mesh is more desirable to make quick assessments and comparisons of different joint geometries. Analytical models are often helpful in sizing, but difficulties arise in coupling these models with full-vehicle FE models. Therefore, a joint FE was created which can be used within structural FE models to make quick assessments of bonded composite joints. The shape functions of the joint FE were found by solving the governing equations for a structural model for a joint. By analytically determining the shape functions of the joint FE, the complex joint behavior can be captured with very few elements. This joint FE was modified and used to consider adhesives with functionally graded material properties to reduce the peel stress concentrations located near adherend discontinuities. Several practical concerns impede the actual use of such adhesives. These include increased manufacturing complications, alterations to the grading due to adhesive flow during manufacturing, and whether changing the loading conditions significantly impact the effectiveness of the grading. An analytical study is conducted to address these three concerns. Furthermore, proof-of-concept testing is conducted to show the potential advantages of functionally graded adhesives. In this study, grading is achieved by strategically placing glass beads within the adhesive layer at different densities along the joint. Furthermore, the capability to model non-linear adhesive constitutive behavior with large rotations was developed, and progressive failure of the adhesive was modeled by re-meshing the joint as the adhesive fails. Results predicted using the joint FE was compared with experimental results for various joint configurations, including double cantilever beam and single lap joints.

Elasto-Plastic Analysis of Tee Joints Using HOT-SMAC

NASA Technical Reports Server (NTRS)

Arnold, Steve M. (Technical Monitor); Bednarcyk, Brett A.; Yarrington, Phillip W.

2004-01-01

The Higher Order Theory - Structural/Micro Analysis Code (HOT-SMAC) software package is applied to analyze the linearly elastic and elasto-plastic response of adhesively bonded tee joints. Joints of this type are finding an increasing number of applications with the increased use of composite materials within advanced aerospace vehicles, and improved tools for the design and analysis of these joints are needed. The linearly elastic results of the code are validated vs. finite element analysis results from the literature under different loading and boundary conditions, and new results are generated to investigate the inelastic behavior of the tee joint. The comparison with the finite element results indicates that HOT-SMAC is an efficient and accurate alternative to the finite element method and has a great deal of potential as an analysis tool for a wide range of bonded joints.

Comparison of fatigue crack growth of riveted and bonded aircraft lap joints made of Aluminium alloy 2024-T3 substrates - A numerical study

NASA Astrophysics Data System (ADS)

Pitta, S.; Rojas, J. I.; Crespo, D.

2017-05-01

Aircraft lap joints play an important role in minimizing the operational cost of airlines. Hence, airlines pay more attention to these technologies to improve efficiency. Namely, a major time consuming and costly process is maintenance of aircraft between the flights, for instance, to detect early formation of cracks, monitoring crack growth, and fixing the corresponding parts with joints, if necessary. This work is focused on the study of repairs of cracked aluminium alloy (AA) 2024-T3 plates to regain their original strength; particularly, cracked AA 2024-T3 substrate plates repaired with doublers of AA 2024-T3 with two configurations (riveted and with adhesive bonding) are analysed. The fatigue life of the substrate plates with cracks of 1, 2, 5, 10 and 12.7mm is computed using Fracture Analysis 3D (FRANC3D) tool. The stress intensity factors for the repaired AA 2024-T3 plates are computed for different crack lengths and compared using commercial FEA tool ABAQUS. The results for the bonded repairs showed significantly lower stress intensity factors compared with the riveted repairs. This improves the overall fatigue life of the bonded joint.

Effects of different overlap lengths and composite adherend thicknesses on the performance of adhesively-bonded joints under tensile and bending loadings

NASA Astrophysics Data System (ADS)

Kadioglu, F.; Avil, E.; Ercan, M. E.; Aydogan, T.

2018-05-01

Fiber-reinforced polymer composites are being used in an increasingly wide range of products. They are particularly popular in automotive and aerospace sectors because they offer an attractive combination of stiffness, strength and low mass. Adhesively-bonded joints of such materials are preferred by many designers due to their assembling advantages over other traditional mechanical joining systems, such as bolted and riveted joints. In this study, some experimental works have been carried out on adhesively-bonded adherends manufactured from a woven carbon fiber-reinforced polymer matrix composite (Hexply 8552S/A280-5H, produced by Hexcel), by using a film adhesive (AF163-2K produced by 3 M). The bonded specimens were prepared in the Single Lap Joint (SLJ) configuration, and tested in tensile and also in four-point bending loading. In order to assess the joint performance, three different overlap lengths, 15 mm, 25 mm and 40 mm, and two different thicknesses of the composite adherends, 2 mm and 3 mm, were used. The results shown that the parameters are controlled by the loading modes; while the overlap length increases the joint performance significantly in tensile loading, the opposite was the case for those in bending loading, which was affected mainly by the adherend thicknesses. The results were related to the mechanisms of joint failures; while the joints in the tensile failed in the adhesive layer with some exceptions, those in the bending mainly failed in the plies adjacent to the layer. The current study indicates that one of the important factors affecting the joint strength of the adherends manufactured from the laminated composites is the local failure of the plies. It is thought more focused-studies would be needed to lessen such problems, which would be possible via in-depth numerical analysis.

Evaluation of dispersion strengthened nickel-base alloy heat shields for space shuttle application

NASA Technical Reports Server (NTRS)

Johnson, R., Jr.; Killpatrick, D. H.

1973-01-01

The work reported constitutes the first phase of a two-phase program. Vehicle environments having critical effects on the thermal protection system are defined; TD Ni-20Cr material characteristics are reviewed and compared with TD Ni-20Cr produced in previous development efforts; cyclic load, temperature, and pressure effects on TD Ni-20Cr sheet material are investigated; the effects of braze reinforcement in improving the efficiency of spotwelded, diffusion-bonded, or seam-welded joints are evaluated through tests of simple lap-shear joint samples; parametric studies of metallic radiative thermal protection systems are reported; and the design, instrumentation, and testing of full-scale subsize heat shield panels are described. Tests of full-scale subsize panels included simulated meteoroid impact tests; simulated entry flight aerodynamic heating in an arc-heated plasma stream; programmed differential pressure loads and temperatures simulating mission conditions; and acoustic tests simulating sound levels experienced by heat shields during about boost flight. Test results are described, and the performances of two heat shield designs are compared and evaluated.

Viscoelastic study of an adhesively bonded joint

NASA Technical Reports Server (NTRS)

Joseph, P. F.

1983-01-01

The plane strain problem of two dissimilar orthotropic plates bonded with an isotropic, linearly viscoelastic adhesive is considered. Both the shear and the normal stresses in the adhesive are calculated for various geometries and loading conditions. Transverse shear deformations of the adherends are taken into account, and their effect on the solution is shown in the results. All three inplane strains of the adhesive are included. Attention is given to the effect of temperature, both in the adhesive joint problem and to the heat generation in a viscoelastic material under cyclic loading. This separate study is included because heat generation and or spatially varying temperature are at present too difficult to account for in the analytical solution of the bonded joint, but whose effect can not be ignored in design.

Diffusion anisotropy of poor metal solute atoms in hcp-Ti

DOE Office of Scientific and Technical Information (OSTI.GOV)

Scotti, Lucia, E-mail: lxs234@bham.ac.uk; Mottura, Alessandro, E-mail: a.mottura@bham.ac.uk

2015-05-28

Atom migration mechanisms influence a wide range of phenomena: solidification kinetics, phase equilibria, oxidation kinetics, precipitation of phases, and high-temperature deformation. In particular, solute diffusion mechanisms in α-Ti alloys can help explain their excellent high-temperature behaviour. The purpose of this work is to study self- and solute diffusion in hexagonal close-packed (hcp)-Ti, and its anisotropy, from first-principles using the 8-frequency model. The calculated diffusion coefficients show that diffusion energy barriers depend more on bonding characteristics of the solute rather than the size misfit with the host, while the extreme diffusion anisotropy of some solute elements in hcp-Ti is a resultmore » of the bond angle distortion.« less

Quantification of joint inflammation in rheumatoid arthritis by time-resolved diffuse optical spectroscopy and tracer kinetic modeling

NASA Astrophysics Data System (ADS)

Ioussoufovitch, Seva; Morrison, Laura B.; Lee, Ting-Yim; St. Lawrence, Keith; Diop, Mamadou

2015-03-01

Rheumatoid arthritis (RA) is characterized by chronic synovial inflammation, which can cause progressive joint damage and disability. Diffuse optical spectroscopy (DOS) and imaging have the potential to become potent monitoring tools for RA. We devised a method that combined time-resolved DOS and tracer kinetics modeling to rapidly and reliably quantify blood flow in the joint. Preliminary results obtained from two animals show that the technique can detect joint inflammation as early as 5 days after onset.

Introduction to Shaped Charges

DTIC Science & Technology

2007-03-01

Figure 144. Late time collapse of a hemispherical depleted uranium liner. COPPER 430MM(17") LEAD-TIN EUTECTIC Figure 145. Comparison between...46 Figure 91. Setup for diffusion bonding of copper- nickel assemblies, temperature is 982 °C, time is 1–3 hr, argon atmosphere...46 Figure 92. Diffusion-bonded alternately layered copper- nickel

The effect of silicon on the interaction between metallic uranium and aluminum: A 50 year long diffusion experiment

NASA Astrophysics Data System (ADS)

Leenaers, A.; Detavernier, C.; Van den Berghe, S.

2008-11-01

The core of the BR1 research reactor at SCK•CEN, Mol (Belgium) has a graphite matrix loaded with fuel rods consisting of a natural uranium slug in aluminum cladding. The BR1 reactor has been in operation since 1956 and still contains its original fuel rods. After more than 50 years irradiation at low temperature, some of the fuel rods have been examined. Fabrication reports indicate that a so-called AlSi bonding layer and an U(Al,Si) 3 anti-diffusion layer on the natural uranium fuel slug were applied to limit the interaction between the uranium fuel and aluminum cladding. The microstructure of the fuel, bonding and anti-diffusion layer and cladding were analysed using optical microscopy, scanning electron microscopy and electron microprobe analysis. It was found that the AlSi bonding layer does provide a tight bond between fuel and cladding but that it is a thin USi layer that acts as effective anti-diffusion layer and not the intended U(Al,Si) 3 layer.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ranjan, Devesh

Diffusion bonded heat exchangers are the leading candidates for the sCO 2 Brayton cycles in next generation nuclear power plants. Commercially available diffusion bonded heat exchangers utilize set of continuous semi-circular zigzag micro channels to increase the heat transfer area and enhance heat transfer through increased turbulence production. Such heat exchangers can lead to excessive pressure drop as well as flow maldistribution in the case of poorly designed flow distribution headers. The goal of the current project is to fabricate and test potential discontinuous fin patterns for diffusion bonded heat exchangers; which can achieve desired thermal performance at lower pressuremore » drops. Prototypic discontinuous offset rectangular and Airfoil fin surface geometries were chemically etched on to 316 stainless steel plate and sealed against an un-etched flat pate using O-ring seal emulating diffusion bonded heat exchangers. Thermal-hydraulic performance of these prototypic discontinuous fin geometries was experimentally evaluated and compared to the existing data for the continuous zigzag channels. The data generated from this project will serve as the database for future testing and validation of numerical models.« less

Diffusion welding of MA 6000 and a conventional nickel-base superalloy

NASA Technical Reports Server (NTRS)

Moore, T. J.; Glasgow, T. K.

1985-01-01

A feasibility study of diffusion welding the oxide dispersion strengthened (ODS) alloy MA 6000 to itself and to conventional Ni-base superalloy Udimet 700 was conducted. Butt joints between MA 6000 pieces and lap joints between Udimet 700 and the ODS alloy were produced by hot pressing for 1.25 hr at temperatures ranging from 1000 to 1200 C (1832-2192 F) in vacuum. Following pressing, all weldments were heat treated and machined into mechanical property test specimens. While three different combinations of recrystallized and unrecrystallized MA 6000 butt joints were produced, the unrecrystallized to unrecrystallized joint was most successful as determined by mechanical properties and microstructural examination. Failure to weld the recrystallized material probably related to a lack of adequate deformation at the weld interface. While recrystallized MA 6000 could be diffusion welded to Udimet 700 in places, complete welding over the entire lap joint was not achieved, again due to the lack of sufficient deformation at the faying surfaces. Several methods are proposed to promote the intimate contact necessary for diffusion welding MA 6000 to itself and to superalloys.

Novel Method of Aluminum to Copper Bonding by Cold Spray

NASA Astrophysics Data System (ADS)

Fu, Si-Lin; Li, Cheng-Xin; Wei, Ying-Kang; Luo, Xiao-Tao; Yang, Guan-Jun; Li, Chang-Jiu; Li, Jing-Long

2018-04-01

Cold spray bonding (CSB) has been proposed as a new method for joining aluminum and copper. At high speeds, solid Al particles impacted the groove between the two substrates to form a bond between Al and Cu. Compared to traditional welding technologies, CSB does not form distinct intermetallic compounds. Large stainless steel particles were introduced into the spray powders as in situ shot peen particles to create a dense Al deposit and to improve the bond strength of joints. It was discovered that introducing shot peen particles significantly improved the flattening ratio of the deposited Al particles. Increasing the proportion of shot peen particles from 0 to 70 vol.% decreased the porosity of the deposits from 12.4 to 0.2%, while the shear strength of joints significantly increased. The tensile test results of the Al-Cu joints demonstrated that cracks were initiated at the interface between the Al and the deposit. The average tensile strength was 71.4 MPa and could reach 81% of the tensile strength of pure Al.

Influence of the volume-contact area ratio on the growth behavior of the Cu-Sn intermetallic phase

NASA Astrophysics Data System (ADS)

Giddaluri, Venkatakamakshi Supraja

Solder Joints play a very important role in electronic packaging industry by serving as mechanical support and provides integrity to the device. The increasing demand for high performance, environmental and economic feasibility and miniaturization led to the development of high density interconnects. With the reduction in the size/standoff height of the solder reliability issues in the surface mount assemblies and packaging structures under various rigorous environments are becoming significant. One of the most important impact factors that affect the solder joint reliability is the growth rate IMC formed between the solder and substrate with reduction in joint size. IMC formation is required to ensure good bonding and connectivity of the device in packaging. However excess IMC growth rate is detrimental to the device from mechanical aspects due to its brittle nature. Thus there is a need to study effect the IMC growth rate behavior with the solder joint size/standoff height. In this present study, two solder joints of different standoff heights and same composition (pure Sn solder) are used subjected to reflow process at 270°C for 1--7 min to study solid liquid interfacial reaction on joint size and the same experiment is repeated with SAC alloy of composition (96.5% Sn, 3.0% Ag, 0.5% Cu) to investigate the effect of joint size and initial copper concentration on IMC growth rate. The IMC thickness of the Sn 15microm solder joint at 1 min and 7 min is found to be 1.52microm and 2.86microm respectively while that of Sn 150microm solder joint is 1.31microm and 3.16 microm. The thickness is high in low standoff height sample at the early stage of reaction with decrease in IMC growth rate as the time of reflow increases. In case of 25microm SAC alloy solder joint the IMC thickness from 1 and 7 min is found to be 2.1microm and 3.5microm while that of 250microm SAC alloy solder joint its 1.43microm and3.235microm. Similar trend is observed but the IMC thickness is more in SAC alloy compared to Pure Sn due to initial Cu concentration effect. The CGC model is applied for growth kinetics of IMC formation and is in well agreement with the experimental results. It is found that the low standoff height solder joint follow t1/3 law and high standoff height solder joint deviates from the t1/3 due to unsaturation. The pure Sn solder of two different standoff heights is also subjected to isothermal aging tests at 120°C for 0--600 hours to investigate the effect of IMC growth rate on solder joint size in solid state diffusion. It has been found that low solder joint height is having high growth rate compared to high standoff height joint and it is found to obey parabolic law and follow reaction diffusion control mechanism.

Review on failure prediction techniques of composite single lap joint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ab Ghani, A.F., E-mail: ahmadfuad@utem.edu.my; Rivai, Ahmad, E-mail: ahmadrivai@utem.edu.my

2016-03-29

Adhesive bonding is the most appropriate joining method in construction of composite structures. The use of reliable design and prediction technique will produce better performance of bonded joints. Several papers from recent papers and journals have been reviewed and synthesized to understand the current state of the art in this area. It is done by studying the most relevant analytical solutions for composite adherends with start of reviewing the most fundamental ones involving beam/plate theory. It is then extended to review single lap joint non linearity and failure prediction and finally on the failure prediction on composite single lap joint.more » The review also encompasses the finite element modelling part as tool to predict the elastic response of composite single lap joint and failure prediction numerically.« less

Analysis of bonded joints. [shear stress and stress-strain diagrams

NASA Technical Reports Server (NTRS)

Srinivas, S.

1975-01-01

A refined elastic analysis of bonded joints which accounts for transverse shear deformation and transverse normal stress was developed to obtain the stresses and displacements in the adherends and in the bond. The displacements were expanded in terms of polynomials in the thicknesswise coordinate; the coefficients of these polynomials were functions of the axial coordinate. The stress distribution was obtained in terms of these coefficients by using strain-displacement and stress-strain relations. The governing differential equations were obtained by integrating the equations of equilibrium, and were solved. The boundary conditions (interface or support) were satisfied to complete the analysis. Single-lap, flush, and double-lap joints were analyzed, along with the effects of adhesive properties, plate thicknesses, material properties, and plate taper on maximum peel and shear stresses in the bond. The results obtained by using the thin-beam analysis available in the literature were compared with the results obtained by using the refined analysis. In general, thin-beam analysis yielded reasonably accurate results, but in certain cases the errors were high. Numerical investigations showed that the maximum peel and shear stresses in the bond can be reduced by (1) using a combination of flexible and stiff bonds, (2) using stiffer lap plates, and (3) tapering the plates.

G. N. Lewis and the Chemical Bond.

ERIC Educational Resources Information Center

Pauling, Linus

1984-01-01

Discusses the contributions of G. N. Lewis to chemistry, focusing on his formulation of the basic principle of the chemical bond--the idea that the chemical bond consists of a pair of electrons held jointly by two atoms. (JN)

Design studies of Laminar Flow Control (LFC) wing concepts using superplastics forming and diffusion bonding (SPF/DB)

NASA Technical Reports Server (NTRS)

Wilson, V. E.

1980-01-01

Alternate concepts and design approaches were developed for suction panels and techniques were defined for integrating these panel designs into a complete LFC 200R wing. The design concepts and approaches were analyzed to assure that they would meet the strength, stability, and internal volume requirements. Cost and weight comparisions of the concepts were also made. Problems of integrating the concepts into a complete aircraft system were addressed. Methods for making splices both chordwise and spanwise, fuel light joints, and internal duct installations were developed. Manufacturing problems such as slot aligment, tapered slot spacing, production methods, and repair techniques were addressed. An assessment of the program was used to developed recommendations for additional research in the development of SPF/DB for LFC structure.

Surface Modifications in Adhesion and Wetting

NASA Astrophysics Data System (ADS)

Longley, Jonathan

Advances in surface modification are changing the world. Changing surface properties of bulk materials with nanometer scale coatings enables inventions ranging from the familiar non-stick frying pan to advanced composite aircraft. Nanometer or monolayer coatings used to modify a surface affect the macro-scale properties of a system; for example, composite adhesive joints between the fuselage and internal frame of Boeing's 787 Dreamliner play a vital role in the structural stability of the aircraft. This dissertation focuses on a collection of surface modification techniques that are used in the areas of adhesion and wetting. Adhesive joints are rapidly replacing the familiar bolt and rivet assemblies used by the aerospace and automotive industries. This transition is fueled by the incorporation of composite materials into aircraft and high performance road vehicles. Adhesive joints have several advantages over the traditional rivet, including, significant weight reduction and efficient stress transfer between bonded materials. As fuel costs continue to rise, the weight reduction is accelerating this transition. Traditional surface pretreatments designed to improve the adhesion of polymeric materials to metallic surfaces are extremely toxic. Replacement adhesive technologies must be compatible with the environment without sacrificing adhesive performance. Silane-coupling agents have emerged as ideal surface modifications for improving composite joint strength. As these coatings are generally applied as very thin layers (<50 nm), it is challenging to characterize their material properties for correlation to adhesive performance. We circumvent this problem by estimating the elastic modulus of the silane-based coatings using the buckling instability formed between two materials of a large elastic mismatch. The elastic modulus is found to effectively predict the joint strength of an epoxy/aluminum joint that has been reinforced with silane coupling agents. This buckling technique is extended to investigate the effects of chemical composition on the elastic modulus. Finally, the effect of macro-scale roughness on silane-reinforced joints is investigated within the framework of the unresolved problem of how to best characterize rough surfaces. Initially, the fractal dimension is used to characterize grit-blasted and sanded surfaces. It is found that, contrary to what has been suggested in the literature, the fractal dimension is independent of the roughening mechanism. Instead, the use of an anomalous diffusion coefficient is proposed as a more effective way to characterize a rough surface. Surface modification by preparation of surface energy gradients is then investigated. Materials with gradients in surface energy are useful in the areas of microfluidics, heat transfer and protein adsorption, to name a few. Gradients are prepared by vapor deposition of a reactive silane from a filter paper source. The technique gives control over the size and shape of the gradient. This surface modification is then used to induce droplet motion through repeated stretching and compression of a water drop between two gradient surfaces. This inchworm type motion is studied in detail and offers an alternative method to surface vibration for moving drops in microfluidic devices. The final surface modification considered is the application of a thin layer of rubber to a rigid surface. While this technique has many practical uses, such as easy release coatings in marine environments, it is applied herein to enable spontaneous healing between a rubber surface and a glass cover slip. Study of the diffusion controlled healing of a blister can be made by trapping an air filled blister between a glass cover slip and a rubber film. Through this study we find evidence for an interfacial diffusion process. This mechanism of diffusion is likely to be important in many biological systems.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Yinshan; Zhu, Men; Laventure, Audrey

Surface grating decay measurements have been performed on three closely related molecular glasses to study the effect of intermolecular hydrogen bonds on surface diffusion. The three molecules are derivatives of bis(3,5-dimethyl-phenylamino)-1,3,5-triazine and differ only in the functional group R at the 2-position, with R being C 2H 5, OCH 3, and NHCH 3, and referred to as “Et”, “OMe”, and “NHMe”, respectively. Of the three molecules, NHMe forms more extensive intermolecular hydrogen bonds than Et and OMe and was found to have slower surface diffusion. For Et and OMe, surface diffusion is so fast that it replaces viscous flow asmore » the mechanism of surface grating decay as temperature is lowered. In contrast, no such transition was observed for NHMe under the same conditions, indicating significantly slower surface diffusion. This result is consistent with the previous finding that extensive intermolecular hydrogen bonds slow down surface diffusion in molecular glasses and is attributed to the persistence of hydrogen bonds even in the surface environment. Here, this result is also consistent with the lower stability of the vapor-deposited glass of NHMe relative to those of Et and OMe and supports the view that surface mobility controls the stability of vapor-deposited glasses.« less

Bonded ultrasonic transducer and method for making

DOEpatents

Dixon, Raymond D.; Roe, Lawrence H.; Migliori, Albert

1995-01-01

An ultrasonic transducer is formed as a diffusion bonded assembly of piezoelectric crystal, backing material, and, optionally, a ceramic wear surface. The mating surfaces of each component are silver films that are diffusion bonded together under the application of pressure and heat. Each mating surface may also be coated with a reactive metal, such as hafnium, to increase the adhesion of the silver films to the component surfaces. Only thin silver films are deposited, e.g., a thickness of about 0.00635 mm, to form a substantially non-compliant bond between surfaces. The resulting transducer assembly is substantially free of self-resonances over normal operating ranges for taking resonant ultrasound measurements.

Molecular dynamics investigation of dynamical properties of phosphatidylethanolamine lipid bilayers

NASA Astrophysics Data System (ADS)

Pitman, Michael C.; Suits, Frank; Gawrisch, Klaus; Feller, Scott E.

2005-06-01

We describe the dynamic behavior of a 1-stearoyl-2-oleoyl-phosphatidylethanolamine (SOPE) bilayer from a 20ns molecular dynamics simulation. The dynamics of individual molecules are characterized in terms of H2 spin-lattice relaxation rates, nuclear overhauser enhancement spectroscopy (NOESY) cross-relaxation rates, and lateral diffusion coefficients. Additionally, we describe the dynamics of hydrogen bonding through an analysis of hydrogen bond lifetimes and the time evolution of clusters of hydrogen bonded lipids. The simulated trajectory is shown to be consistent with experimental measures of internal, intermolecular, and diffusive motion. Consistent with our analysis of SOPE structure in the companion paper, we see hydrogen bonding dominating the dynamics of the interface region. Comparison of H2 T1 relaxation rates for chain methylene segments in phosphatidylcholine and phosphatidylethanolamine bilayers indicates that slower motion resulting from hydrogen bonding extends at least three carbons into the hydrophobic core. NOESY cross-relaxation rates compare well with experimental values, indicating the observed hydrogen bonding dynamics are realistic. Calculated lateral diffusion rates (4±1×10-8cm2/s) are comparable, though somewhat lower than, those determined by pulsed field gradient NMR methods.

Vacuum brazing of electroless Ni-P alloy-coated SiCp/Al composites using aluminum-based filler metal foil

NASA Astrophysics Data System (ADS)

Wang, Peng; Xu, Dongxia; Niu, Jitai

2016-12-01

Using rapidly cooled (Al-10Si-20Cu-0.05Ce)-1Ti (wt%) foil as filler metal, the research obtained high-performance joints of electroless Ni-P alloy-coated aluminum matrix composites with high SiC particle content (60 vol%, SiCp/Al-MMCs). The effect of brazing process on joint properties and the formation of Al-Ni and Al-Cu-Ni intermetallic compounds were investigated, respectively. Due to the presence of Ni-P alloy coating, the wettability of liquid filler metal on the composites was improved obviously and its contact angle was only 21°. The formation of Al3Ni2 and Al3(CuNi)2 intermetallic compounds indicated that well metallurgical bonding occurred along the 6063Al matrix alloy/Ni-P alloy layer/filler metal foil interfaces by mutual diffusion and dissolution. And the joint shear strength increased with increasing the brazing temperature from 838 to 843 K or prolonging the soaking time from 15 to 35 min, while it decreased a lot because of corrosion occurring in the 6063Al matrix at high brazing temperature of 848 K. Sound joints with maximum shear strength of 112.5 MPa were obtained at 843 K for soaking time of 35 min. In this research, the beneficial effect of surface metallization by Ni-P alloy deposits on improving wettability on SiCp/Al-MMCs was demonstrated, and capable welding parameters were broadened as well.

Active Metal Brazing and Characterization of Brazed Joints in Titanium to Carbon-Carbon Composites

NASA Technical Reports Server (NTRS)

Singh, M.; Shpargel, T. P.; Morscher, G. N.; Asthana, R.

2006-01-01

The Ti-metal/C-C composite joints were formed by reactive brazing with three commercial brazes, namely, Cu-ABA, TiCuNi, and TiCuSiI. The joint microstructures were examined using optical microscopy and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The results of the microstructure analysis indicate solute redistribution across the joint and possible metallurgical bond formation via interdiffusion, which led to good wetting and spreading. A tube-on-plate tensile test was used to evaluate joint strength of Ti-tube/ C-C composite joints. The load-carrying ability was greatest for the Cu-ABA braze joint structures. This system appeared to have the best braze spreading which resulted in a larger braze/C-C composite bonded area compared to the other two braze materials. Also, joint loadcarrying ability was found to be higher for joint structures where the fiber tows in the outer ply of the C-C composite were aligned perpendicular to the tube axis when compared to the case where fiber tows were aligned parallel to the tube axis.

Modeling Progressive Failure of Bonded Joints Using a Single Joint Finite Element

NASA Technical Reports Server (NTRS)

Stapleton, Scott E.; Waas, Anthony M.; Bednarcyk, Brett A.

2010-01-01

Enhanced finite elements are elements with an embedded analytical solution which can capture detailed local fields, enabling more efficient, mesh-independent finite element analysis. In the present study, an enhanced finite element is applied to generate a general framework capable of modeling an array of joint types. The joint field equations are derived using the principle of minimum potential energy, and the resulting solutions for the displacement fields are used to generate shape functions and a stiffness matrix for a single joint finite element. This single finite element thus captures the detailed stress and strain fields within the bonded joint, but it can function within a broader structural finite element model. The costs associated with a fine mesh of the joint can thus be avoided while still obtaining a detailed solution for the joint. Additionally, the capability to model non-linear adhesive constitutive behavior has been included within the method, and progressive failure of the adhesive can be modeled by using a strain-based failure criteria and re-sizing the joint as the adhesive fails. Results of the model compare favorably with experimental and finite element results.

Development of the weldbond process for joining titanium

NASA Technical Reports Server (NTRS)

Fields, D.

1972-01-01

High quality resistance spot welds were produced by welding through epoxy adhesive on titanium alloys. Weldbond joints were consistently stronger than those of either mechanical fasteners, structural adhesive bonds, or mechanical fasteners with adhesive at the joint interface. Weldbond joints and/or spot weld joints showed superior strength at all temperature ranges as compared to other joints tested.

The effect of diffuse basis functions on valence bond structural weights

NASA Astrophysics Data System (ADS)

Galbraith, John Morrison; James, Andrew M.; Nemes, Coleen T.

2014-03-01

Structural weights and bond dissociation energies have been determined for H-F, H-X, and F-X molecules (-X = -OH, -NH2, and -CH3) at the valence bond self-consistent field (VBSCF) and breathing orbital valence bond (BOVB) levels of theory with the aug-cc-pVDZ and 6-31++G(d,p) basis sets. At the BOVB level, the aug-cc-pVDZ basis set yields a counterintuitive ordering of ionic structural weights when the initial heavy atom s-type basis functions are included. For H-F, H-OH, and F-X, the ordering follows chemical intuition when these basis functions are not included. These counterintuitive weights are shown to be a result of the diffuse polarisation function on one VB fragment being spatially located, in part, on the other VB fragment. Except in the case of F-CH3, this problem is corrected with the 6-31++G(d,p) basis set. The initial heavy atom s-type functions are shown to make an important contribution to the VB orbitals and bond dissociation energies and, therefore, should not be excluded. It is recommended to not use diffuse basis sets in valence bond calculations unless absolutely necessary. If diffuse basis sets are needed, the 6-31++G(d,p) basis set should be used with caution and the structural weights checked against VBSCF values which have been shown to follow the expected ordering in all cases.

Viscoelastic analysis of adhesively bonded joints

NASA Technical Reports Server (NTRS)

Delale, F.; Erdogan, F.

1980-01-01

An adhesively bonded lap joint is analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. After formulating the general problem a specific example for two identical adherends bonded through a three parameter viscoelastic solid adhesive is considered. The standard Laplace transform technique is used to solve the problem. The stress distribution in the adhesive layer is calculated for three different external loads, namely, membrane loading, bending, and transverse shear loading. The results indicate that the peak value of the normal stress in the adhesive is not only consistently higher than the corresponding shear stress but also decays slower.

A Biomimetic Structural Health Monitoring Approach Using Carbon Nanotubes

NASA Astrophysics Data System (ADS)

Liu, Yingtao; Rajadas, Abhishek; Chattopadhyay, Aditi

2012-07-01

A self-sensing nanocomposite material has been developed to track the presence of damage in complex composite structures. Multiwalled carbon nanotubes are integrated with polymer matrix to develop a novel bonding material with sensing capabilities. The changes of the piezoresistance in the presence of damage are used to monitor the condition of bonded joints, where the usual bonding material is replaced by the self-sensing nanocomposite. The feasibility of this concept is investigated through experiments conducted on single-lap joints subject to monotonic tensile loading conditions. The results show that the self-sensing nanocomposite is sensitive to crack propagation within the matrix material. An acoustic emission-based sensing technique has been used to validate these results and shows good correlation with damage growth. A digital image correlation system is used to measure the shear strain field in the joint area.

Microstructure and Properties of the Al-27Si/Cu/Al-50Si Joint Brazed by the Partial Transient Liquid Phase Bonding

NASA Astrophysics Data System (ADS)

Sun, Qingzhu; Wang, Haibo; Yang, Cheng

2018-06-01

Al-27Si and Al-50Si were brazed by using a thin Cu interlayer. The metallurgical bonding without obvious defects is achieved, and a wide brazing seam consisting of fine eutectic structures and coarse Si particles is formed in the Al-27Si/Cu/Al-50Si joint. The deposition of Si element in the liquid phases during solidification results in the formation of the larger Si particles and ultra-small Si particles in the brazing seam. The shear strength of the joint reaches 63 MPa.

Microstructure and Properties of the Al-27Si/Cu/Al-50Si Joint Brazed by the Partial Transient Liquid Phase Bonding

NASA Astrophysics Data System (ADS)

Sun, Qingzhu; Wang, Haibo; Yang, Cheng

2018-04-01

Al-27Si and Al-50Si were brazed by using a thin Cu interlayer. The metallurgical bonding without obvious defects is achieved, and a wide brazing seam consisting of fine eutectic structures and coarse Si particles is formed in the Al-27Si/Cu/Al-50Si joint. The deposition of Si element in the liquid phases during solidification results in the formation of the larger Si particles and ultra-small Si particles in the brazing seam. The shear strength of the joint reaches 63 MPa.

Nonlinear Analysis of Bonded Composite Tubular Lap Joints

NASA Technical Reports Server (NTRS)

Oterkus, E.; Madenci, E.; Smeltzer, S. S., III; Ambur, D. R.

2005-01-01

The present study describes a semi-analytical solution method for predicting the geometrically nonlinear response of a bonded composite tubular single-lap joint subjected to general loading conditions. The transverse shear and normal stresses in the adhesive as well as membrane stress resultants and bending moments in the adherends are determined using this method. The method utilizes the principle of virtual work in conjunction with nonlinear thin-shell theory to model the adherends and a cylindrical shear lag model to represent the kinematics of the thin adhesive layer between the adherends. The kinematic boundary conditions are imposed by employing the Lagrange multiplier method. In the solution procedure, the displacement components for the tubular joint are approximated in terms of non-periodic and periodic B-Spline functions in the longitudinal and circumferential directions, respectively. The approach presented herein represents a rapid-solution alternative to the finite element method. The solution method was validated by comparison against a previously considered tubular single-lap joint. The steep variation of both peeling and shearing stresses near the adhesive edges was successfully captured. The applicability of the present method was also demonstrated by considering tubular bonded lap-joints subjected to pure bending and torsion.

Final Report: Superconducting Joints Between (RE)Ba 2Cu 3O 7-x Coated Conductors via Electric Field Assisted Processing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schwartz, Justin

Here we report the results from a project aimed at developing a fully superconducting joint between two REBCO coated conductors using electric field processing (EFP). Due to a reduction in the budget and time period of this contract, we reduced the project scope and focused first on the key scientific issues for forming a strong bond between conductors, and subsequently focused on improving through-the-joint transport. A modified timeline and task list is shown in Table 1, summarizing accomplishments to date. In the first period, we accomplished initial surface characterization as well as rounds of EFP experiments to begin to understandmore » processing parameters which produce well-bonded tapes. In the second phase, we explored the effects of two fundamental EFP parameters, voltage and pressure, and the limitations they place on the process. In the third phase, we achieved superconducting joints and established base characteristics of both the bonding process and the types of tapes best suited to this process. Finally, we investigated some of the parameters related to kinetics which appeared inhibit joint quality and performance.« less

Design/Analysis of Metal/Composite Bonded Joints for Survivability at Cryogenic Temperatures

NASA Technical Reports Server (NTRS)

Bartoszyk, Andrew E.

2004-01-01

A major design and analysis challenge for the JWST ISM structure is the metal/composite bonded joints that will be required to survive down to an operational ultra-low temperature of 30K (-405 F). The initial and current baseline design for the plug-type joint consists of a titanium thin walled fitting (1-3mm thick) bonded to the interior surface of an M555/954-6 composite truss square tube with an axially stiff biased lay-up. Metallic fittings are required at various nodes of the truss structure to accommodate instrument and lift-point bolted interfaces. Analytical experience and design work done on metal/composite bonded joints at temperatures below liquid nitrogen are limited and important analysis tools, material properties, and failure criteria for composites at cryogenic temperatures are virtually nonexistent. Increasing the challenge is the difficulty in testing for these required tools and parameters at 30K. A preliminary finite element analysis shows that failure due to CTE mismatch between the biased composite and titanium or aluminum is likely. Failure is less likely with Invar, however an initial mass estimate of Invar fittings demonstrates that Invar is not an automatic alternative. In order to gain confidence in analyzing and designing the ISM joints, a comprehensive joint development testing program has been planned and is currently running. The test program is designed for the correlation of the analysis methodology, including tuning finite element model parameters, and developing a composite failure criterion for the effect of multi-axial composite stresses on the strength of a bonded joint at 30K. The testing program will also consider stress mitigation using compliant composite layers and potential strength degradation due to multiple thermal cycles. Not only will the finite element analysis be correlated to the test data, but the FEA will be used to guide the design of the test. The first phase of the test program has been completed and the preliminary analysis has been revisited based on the test data In this work, we present an overview of the test plan, results today, and resulting design improvements.

Using Diffusion Bonding in Making Piezoelectric Actuators

NASA Technical Reports Server (NTRS)

Sager, Frank E.

2003-01-01

A technique for the fabrication of piezoelectric actuators that generate acceptably large forces and deflections at relatively low applied voltages involves the stacking and diffusion bonding of multiple thin piezoelectric layers coated with film electrodes. The present technique stands in contrast to an older technique in which the layers are bonded chemically, by use of urethane or epoxy agents. The older chemical-bonding technique entails several disadvantages, including the following: It is difficult to apply the bonding agents to the piezoelectric layers. It is difficult to position the layers accurately and without making mistakes. There is a problem of disposal of hazardous urethane and epoxy wastes. The urethane and epoxy agents are nonpiezoelectric materials. As such, they contribute to the thickness of a piezoelectric laminate without contributing to its performance; conversely, for a given total thickness, the performance of the laminate is below that of a unitary piezoelectric plate of the same thickness. The figure depicts some aspects of the fabrication of a laminated piezoelectric actuator by the present diffusion- bonding technique. First, stock sheets of the piezoelectric material are inspected and tested. Next, the hole pattern shown in the figure is punched into the sheets. Alternatively, if the piezoelectric material is not a polymer, then the holes are punched in thermoplastic films. Then both faces of each punched piezoelectric sheet or thermoplastic film are coated with a silver-ink electrode material by use of a silkscreen printer. The electrode and hole patterns are designed for minimal complexity and minimal waste of material. After a final electrical test, all the coated piezoelectric layers (or piezoelectric layers and coated thermoplastic films) are stacked in an alignment jig, which, in turn, is placed in a curved press for the diffusion-bonding process. In this process, the stack is pressed and heated at a specified curing temperature and pressure for a specified curing time. The pressure, temperature, and time depend on the piezoelectric material selected. At the end of the diffusion-bonding process, the resulting laminated piezoelectric actuator is tested to verify the adequacy of the mechanical output as a function of an applied DC voltage.

Prediction of fracture toughness and durability of adhesively bonded composite joints with undesirable bonding conditions

NASA Astrophysics Data System (ADS)

Musaramthota, Vishal

Advanced composite materials have enabled the conventional aircraft structures to reduce weight, improve fuel efficiency and offer superior mechanical properties. In the past, materials such as aluminum, steel or titanium have been used to manufacture aircraft structures for support of heavy loads. Within the last decade or so, demand for advanced composite materials have been emerging that offer significant advantages over the traditional metallic materials. Of particular interest in the recent years, there has been an upsurge in scientific significance in the usage of adhesively bonded composite joints (ABCJ's). ABCJ's negate the introduction of stress risers that are associated with riveting or other classical techniques. In today's aircraft transportation market, there is a push to increase structural efficiency by promoting adhesive bonding to primary joining of aircraft structures. This research is focused on the issues associated with the durability and related failures in bonded composite joints that continue to be a critical hindrance to the universal acceptance of ABCJ's. Of particular interest are the short term strength, contamination and long term durability of ABCJ's. One of the factors that influence bond performance is contamination and in this study the influence of contamination on composite-adhesive bond quality was investigated through the development of a repeatable and scalable surface contamination procedure. Results showed an increase in the contaminant coverage area decreases the overall bond strength significantly. A direct correlation between the contaminant coverage area and the fracture toughness of the bonded joint was established. Another factor that influences bond performance during an aircraft's service life is its long term strength upon exposure to harsh environmental conditions or when subjected to severe mechanical loading. A test procedure was successfully developed in order to evaluate durability of ABCJ's comprising severe environmental conditioning, fatiguing in ambient air and a combination of both. The bonds produced were durable enough to sustain the tests cases mentioned above when conditioned for 8 weeks and did not experience any loss in strength. Specimens that were aged for 80 weeks showed a degradation of 10% in their fracture toughness when compared to their baseline datasets. The effect of various exposure times needs to be further evaluated to establish the relationship of durability that is associated with the fracture toughness of ABCJ's.

Experimental investigation on frequency shifting of imperfect adhesively bonded pipe joints

NASA Astrophysics Data System (ADS)

Haiyam, F. N.; Hilmy, I.; Sulaeman, E.; Firdaus, T.; Adesta, E. Y. T.

2018-01-01

Inspection tests for any manufactured structure are compulsory in order to detect the existence of damage.It is to ensure the product integrity, reliability and to avoid further catastrophic failure. In this research, modal analysis was utilized to detect structural damage as one of the Non Destructive Testing (NDT) methods. Comparing the vibration signal of a healthy structure with a non-healthy signal was performed. A modal analysis of an adhesively bonded pipe joint was investigated with a healthy joint as a reference. The damage joint was engineered by inserting a nylon fiber, which act as an impurity at adhesive region. The impact test using hammer was utilized in this research. Identification of shifting frequency of a free supported and clamped pipe joint was performed.It was found that shifting frequency occurred to the lower side by 5%.

Toughening of Epoxy Adhesives by Combined Interaction of Carbon Nanotubes and Silsesquioxanes

PubMed Central

Barra, Giuseppina; Vertuccio, Luigi; Vietri, Umberto; Naddeo, Carlo; Guadagno, Liberata

2017-01-01

The extensive use of adhesives in many structural applications in the transport industry and particularly in the aeronautic field is due to numerous advantages of bonded joints. However, still many researchers are working to enhance the mechanical properties and rheological performance of adhesives by using nanoadditives. In this study the effect of the addition of Multi-Wall Carbon Nanotubes (MWCNTs) with Polyhedral Oligomeric Silsesquioxane (POSS) compounds, either Glycidyl Oligomeric Silsesquioxanes (GPOSS) or DodecaPhenyl Oligomeric Silsesquioxanes (DPHPOSS) to Tetraglycidyl Methylene Dianiline (TGMDA) epoxy formulation, was investigated. The formulations contain neither a tougher matrix such as elastomers nor other additives typically used to provide a closer match in the coefficient of thermal expansion in order to discriminate only the effect of the addition of the above-mentioned components. Bonded aluminium single lap joints were made using both untreated and Chromic Acid Anodisation (CAA)-treated aluminium alloy T2024 adherends. The effects of the different chemical functionalities of POSS compounds, as well as the synergistic effect between the MWCNT and POSS combination on adhesion strength, were evaluated by viscosity measurement, tensile tests, Dynamic Mechanical Analysis (DMA), single lap joint shear strength tests, and morphological investigation. The best performance in the Lap Shear Strength (LSS) of the manufactured joints has been found for treated adherends bonded with epoxy adhesive containing MWCNTs and GPOSS. Carbon nanotubes have been found to play a very effective bridging function across the fracture surface of the bonded joints. PMID:28946691

Evaluation of composite adhesive bonds using digital image correlation

NASA Astrophysics Data System (ADS)

Shrestha, Shashi Shekhar

Advanced composite materials are widely used for many structural applications in the aerospace/aircraft industries today. Joining of composite structures using adhesive bonding offers several advantages over traditional fastening methods. However, this technique is not yet employed for fastening the primary structures of aircrafts or space vehicles. There are several reasons for this: There are not any reliable non-destructive evaluation (NDE) methods that can quantify the strength of the bonds, and there are no certifications of quality assurance for inspecting the bond quality. Therefore, there is a significant need for an effective, reliable, easy to use NDE method for the analysis of composite adhesive joints. This research aimed to investigate an adhesively bonded composite-aluminum joints of variable bond strength using digital image correlation (DIC). There are many future possibilities in continuing this research work. As the application of composite materials and adhesive bond are increasing rapidly, the reliability of the composite structures using adhesive bond should quantified. Hence a lot of similar research using various adhesive bonds and materials can be conducted for characterizing the behavior of adhesive bond. The results obtained from this research will set the foundation for the development of ultrasonic DIC as a nondestructive approach for the evaluation of adhesive bond line.

49 CFR 234.233 - Rail joints.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Rail joints. 234.233 Section 234.233 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION... than joint bars and the bonds shall be maintained in such condition to ensure electrical conductivity. ...

Method for producing components with internal architectures, such as micro-channel reactors, via diffusion bonding sheets

DOEpatents

Alman, David E [Corvallis, OR; Wilson, Rick D [Corvallis, OR; Davis, Daniel L [Albany, OR

2011-03-08

This invention relates to a method for producing components with internal architectures, and more particularly, this invention relates to a method for producing structures with microchannels via the use of diffusion bonding of stacked laminates. Specifically, the method involves weakly bonding a stack of laminates forming internal voids and channels with a first generally low uniaxial pressure and first temperature such that bonding at least between the asperites of opposing laminates occurs and pores are isolated in interfacial contact areas, followed by a second generally higher isostatic pressure and second temperature for final bonding. The method thereby allows fabrication of micro-channel devices such as heat exchangers, recuperators, heat-pumps, chemical separators, chemical reactors, fuel processing units, and combustors without limitation on the fin aspect ratio.

Imaging osteoarthritis in the knee joints using x-ray guided diffuse optical tomography

NASA Astrophysics Data System (ADS)

Zhang, Qizhi; Yuan, Zhen; Sobel, Eric S.; Jiang, Huabei

2010-02-01

In our previous studies, near-infrared (NIR) diffuse optical tomography (DOT) had been successfully applied to imaging osteoarthritis (OA) in the finger joints where significant difference in optical properties of the joint tissues was evident between healthy and OA finger joints. Here we report for the first time that large joints such as the knee can also be optically imaged especially when DOT is combined with x-ray tomosynthesis where the 3D image of the bones from x-ray is incorporated into the DOT reconstruction as spatial a priori structural information. This study demonstrates that NIR light can image large joints such as the knee in addition to finger joints, which will drastically broaden the clinical utility of our x-ray guided DOT technique for OA diagnosis.

Structural analysis of Aircraft fuselage splice joint

NASA Astrophysics Data System (ADS)

Udaya Prakash, R.; Kumar, G. Raj; Vijayanandh, R.; Senthil Kumar, M.; Ramganesh, T.

2016-09-01

In Aviation sector, composite materials and its application to each component are one of the prime factors of consideration due to the high strength to weight ratio, design flexibility and non-corrosive so that the composite materials are widely used in the low weight constructions and also it can be treated as a suitable alternative to metals. The objective of this paper is to estimate and compare the suitability of a composite skin joint in an aircraft fuselage with different joints by simulating the displacement, normal stress, vonmises stress and shear stress with the help of numerical solution methods. The reference Z-stringer component of this paper is modeled by CATIA and numerical simulation is carried out by ANSYS has been used for splice joint presents in the aircraft fuselage with three combinations of joints such as riveted joint, bonded joint and hybrid joint. Nowadays the stringers are using to avoid buckling of fuselage skin, it has joined together by rivets and they are connected end to end by splice joint. Design and static analysis of three-dimensional models of joints such as bonded, riveted and hybrid are carried out and results are compared.

Subsidizing Infrastructure Investment with Tax-Preferred Bonds. A Joint CBO/JCT Study

ERIC Educational Resources Information Center

Musick, Nathan

2009-01-01

States and localities issue debt to finance projects undertaken by government and, in some cases, by the private sector (bonds issued by states and localities to finance either government operations or certain private-sector activities are known as municipal bonds). The federal government subsidizes the issuance of municipal bonds by offering tax…

Effects of Arg-Gly-Asp sequence peptide and hyperosmolarity on the permeability of interstitial matrix and fenestrated endothelium in joints.

PubMed

Poli, A; Mason, R M; Levick, J R

2004-09-01

The aims were to assess the contribution of arg-gly-asp (RGD) mediated cell integrin-matrix bonds to interstitial hydraulic resistance and to fenestrated endothelial permeability in joints. Joint fluid is generated by filtration from fenestrated capillaries and drains through a fibronectin-rich synovial intercellular matrix. The role of parenchymal cell-matrix bonding in determining tissue hydraulic resistance is unknown. The knee cavity of anesthetized rabbits was infused with saline or the competitive hexapeptide blocker GRGDTP, with or without added osmotic stress (600 mosm saline). Intra-articular pressure Pj, net trans-synovial drainage rate s, and the permeation of Evans blue-labeled albumin (EVA) from plasma into the joint cavity were measured. GRGDTP increased the hydraulic conductance of the synovial drainage pathway, ds/dPj, by 71% (p =.02, paired t test, n = 6 animals). Synovial plasma EVA clearance (control 7.1 +/- 0.8 microL h-1, mean +/- SEM, n = 15) was unaffected by GRGDTP (7.0 +/- 2.3 microL h(-1), n = 6) or hyperosmolarity (4.9 +/- 1.5 microL h(-1), n = 8) but was increased by GRGDTP and hyperosmolarity together (15.9 +/- 4.8 microL h(-1), n = 5) (p =.01, ANOVA). Changes in dPj/dt evoked by GRGDTP plus hyperosmolarity, but neither alone, demonstrated increased microvascular filtration into the joint cavity (p <.001, ANOVA), as did changes in fluid absorption from the infusion system at fixed Pj. RGD-mediated bonds between the parenchymal cells and interstitial polymers reduce the interstitial hydraulic conductance by 42%. This helps to retain the lubricating fluid inside a joint cavity. RGD-mediated bonds also support the macromolecular barrier function of fenestrated endothelium, but in vivo this is evident only in stressed endothelium (cf. in vitro).

Bonded ultrasonic transducer and method for making

DOEpatents

Dixon, R.D.; Roe, L.H.; Migliori, A.

1995-11-14

An ultrasonic transducer is formed as a diffusion bonded assembly of piezoelectric crystal, backing material, and, optionally, a ceramic wear surface. The mating surfaces of each component are silver films that are diffusion bonded together under the application of pressure and heat. Each mating surface may also be coated with a reactive metal, such as hafnium, to increase the adhesion of the silver films to the component surfaces. Only thin silver films are deposited, e.g., a thickness of about 0.00635 mm, to form a substantially non-compliant bond between surfaces. The resulting transducer assembly is substantially free of self-resonances over normal operating ranges for taking resonant ultrasound measurements. 12 figs.

Effect of a microstructure and surface hydrogen alloying of a VT6 alloy on diffusion welding

NASA Astrophysics Data System (ADS)

Senkevich, K. S.; Skvortsova, S. V.; Kudelina, I. M.; Knyazev, M. I.; Zasypkin, V. V.

2014-01-01

The effect of a structural type (lamellar, fine, gradient) and additional surface alloying with hydrogen on the diffusion bonding of titanium alloy VT6 samples is studied. It is shown that the surface alloying of VT6 alloy parts with hydrogen allows one to decrease the diffusion welding temperature by 50-100°C, to obtain high-quality pore-free bonding, and to remove the "structural" boundary between materials to be welded that usually forms during welding of titanium alloys with a lamellar structure.

A Comparison of Some Difference Schemes for a Parabolic Problem of Zero-Coupon Bond Pricing

NASA Astrophysics Data System (ADS)

Chernogorova, Tatiana; Vulkov, Lubin

2009-11-01

This paper describes a comparison of some numerical methods for solving a convection-diffusion equation subjected by dynamical boundary conditions which arises in the zero-coupon bond pricing. The one-dimensional convection-diffusion equation is solved by using difference schemes with weights including standard difference schemes as the monotone Samarskii's scheme, FTCS and Crank-Nicolson methods. The schemes are free of spurious oscillations and satisfy the positivity and maximum principle as demanded for the financial and diffusive solution. Numerical results are compared with analytical solutions.

Kinetic Monte Carlo Simulations of Diffusion in Environmental Barrier Coating Materials

NASA Technical Reports Server (NTRS)

Good, Brian

2017-01-01

Ceramic Matrix Components (CMC) components for use in turbine engines offer a number of advantages compared with current practice. However, such components are subject to degradation through a variety of mechanisms. In particular, in the hot environment inside a turbine in operation a considerable amount of water vapor is present, and this can lead to corrosion and recession. Environmental Barrier Coating (EBC) systems that limit the amount of oxygen and water reaching the component are required to reduce this degradation and extend component life. A number of silicate-based materials are under consideration for use in such coating systems, including Yttterbium and Yttrium di- and monosilicates. In this work, we present results of kinetic Monte Carlo computer simulations of oxygen diffusion in Yttrium disilicate, and compare with previous work on Yttterbium disilicate. Coatings may also exhibit cracking, and the cracks can provide a direct path for oxygen to reach the component. There is typically a bond coat between the coating and component surface, but the bond coat material is generally chosen for properties other than low oxygen diffusivity. Nevertheless, the degree to which the bond coat can inhibit oxygen diffusion is of interest, as it may form the final defense against oxygen impingement on the component. We have therefore performed similar simulations of oxygen diffusion through HfSiO4, a proposed bond coat material.

Joined ceramic product

DOEpatents

Henager, Jr., Charles W [Kennewick, WA; Brimhall, John L [West Richland, WA

2001-08-21

According to the present invention, a joined product is at least two ceramic parts, specifically bi-element carbide parts with a bond joint therebetween, wherein the bond joint has a metal silicon phase. The bi-element carbide refers to compounds of MC, M.sub.2 C, M.sub.4 C and combinations thereof, where M is a first element and C is carbon. The metal silicon phase may be a metal silicon carbide ternary phase, or a metal silicide.

Delamination failure of multilaminated adhesively bonded joints at low temperatures

NASA Astrophysics Data System (ADS)

Lee, Chi-Seung; Chun, Min-Sung; Kim, Myung-Hyun; Lee, Jae-Myung

2011-08-01

A series of experimental investigations of multilaminated joints adhesively bonded by epoxy/polyurethane (PU) glue were conducted in order to examine the delamination failure characteristics under in-plane shear loading at low temperatures. In order to observe these phenomena, a series of lap-shear tests were carried out at various low temperatures (20 °C, -110 °C and -163 °C) and various adhesion areas (15 mm × 50 mm, 30 mm × 50 mm, 50 mm × 50 mm, 75 mm × 50 mm and 100 mm × 50 mm). The test results were used to investigate the delamination and material characteristics, as well as the material properties, e.g., ultimate shear stress and shear elongation. Furthermore, the dependencies of the characteristics of multilaminated adhesively bonded joints (MABJs) on temperature and adhesion area was analyzed using the stress-strain relationship, and closed form formulas that are functions of the dependent parameters are proposed.

Viscoelastic analysis of adhesively bonded joints

NASA Technical Reports Server (NTRS)

Delale, F.; Erdogan, F.

1981-01-01

In this paper an adhesively bonded lap joint is analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. After formulating the general problem a specific example for two identical adherends bonded through a three parameter viscoelastic solid adhesive is considered. The standard Laplace transform technique is used to solve the problem. The stress distribution in the adhesive layer is calculated for three different external loads namely, membrane loading, bending, and transverse shear loading. The results indicate that the peak value of the normal stress in the adhesive is not only consistently higher than the corresponding shear stress but also decays slower.

Determination of apparent coupling factors for adhesive bonded acrylic plates using SEAL approach

NASA Astrophysics Data System (ADS)

Pankaj, Achuthan. C.; Shivaprasad, M. V.; Murigendrappa, S. M.

2018-04-01

Apparent coupling loss factors (CLF) and velocity responses has been computed for two lap joined adhesive bonded plates using finite element and experimental statistical energy analysis like approach. A finite element model of the plates has been created using ANSYS software. The statistical energy parameters have been computed using the velocity responses obtained from a harmonic forced excitation analysis. Experiments have been carried out for two different cases of adhesive bonded joints and the results have been compared with the apparent coupling factors and velocity responses obtained from finite element analysis. The results obtained from the studies signify the importance of modeling of adhesive bonded joints in computation of the apparent coupling factors and its further use in computation of energies and velocity responses using statistical energy analysis like approach.

Experimental studies of diffusion welding of YBCO to copper using solder layers

NASA Astrophysics Data System (ADS)

Xie, Y.; Ouyang, Z.; Shi, L.; Kuang, Z.; Meng, M.

2017-02-01

The welding technology is of great importance in YBCO application. To make better joints, the diffusion welding of YBCO tape to copper has been carried out in a vacuum environment. In consideration of high welding temperature (above 200°C) could do damage to the material performance, a new kind of diffusion welding method with temperature below 200 °C has been developed recently. A new welding appliance which can offer pressure over 35Kg/mm2 and controlled temperature has been designed and built; several YBCO coated conductors joints soldered with different melting points of tins has been tested. The results showed that the diffusion can perfectly connect YBCO to copper as well as stainless steel and resistance of the joint was low, and the YBCO tape could bear 217°C for at least 15mins.

Nanostructural Characterization of Low Resistance Joints Using Ag Pastes for GdBa2Cu3O7-x Coated Conductors

NASA Astrophysics Data System (ADS)

Kato, Tomohiro; Machi, Takato; Yokoe, Daisaku; Yoshida, Ryuji; Kato, Takeharu; Izumi, Teruo; Hirayama, Tsukasa; Shiohara, Yuh

2017-07-01

GdBa2Cu3O7-x coated conductors were splice jointed by a face-to-face manner using a paste containing nano-sized Ag particles under a pressure of about 50 MPa at 150 °C for 1 hr. The low electrical resistance of 6 nΩ at the joint was attained. Nanostructural characterizations of the starting Ag paste and the jointed region of the coated conductors were carried out using scanning electron microscopy and transmission electron microscopy. The size of the Ag particles in the starting pastes were confirmed to be a few tens of nanometers in diameter. The size of Ag particles became larger during the jointing process. Both the surfaces of the stabilizing Ag layers were partially bonded by the Ag particles. No oxides or other elements were detected in the region of the bonding parts.

Development of the activated diffusion brazing process for fabrication of finned shell to strut turbine blades

NASA Technical Reports Server (NTRS)

Wilbers, L. G.; Berry, T. F.; Kutchera, R. E.; Edmonson, R. E.

1971-01-01

The activated diffusion brazing process was developed for attaching TD-NiCr and U700 finned airfoil shells to matching Rene 80 struts obstructing the finned cooling passageways. Creep forming the finned shells to struts in combination with precise preplacement of brazing alloy resulted in consistently sound joints, free of cooling passageway clogging. Extensive tensile and stress rupture testing of several joint orientation at several temperatures provided a critical assessment of joint integrity of both material combinations. Trial blades of each material combination were fabricated followed by destructive metallographic examination which verified high joint integrity.

Time-temperature effect in adhesively bonded joints

NASA Technical Reports Server (NTRS)

Delale, F.; Erdogan, F.

1981-01-01

The viscoelastic analysis of an adhesively bonded lap joint was reconsidered. The adherends are approximated by essentially Reissner plates and the adhesive is linearly viscoelastic. The hereditary integrals are used to model the adhesive. A linear integral differential equations system for the shear and the tensile stress in the adhesive is applied. The equations have constant coefficients and are solved by using Laplace transforms. It is shown that if the temperature variation in time can be approximated by a piecewise constant function, then the method of Laplace transforms can be used to solve the problem. A numerical example is given for a single lap joint under various loading conditions.

Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu-Cu Thermocompression Bonding Using Stress Engineering

NASA Astrophysics Data System (ADS)

Panigrahi, Asisa Kumar; Ghosh, Tamal; Kumar, C. Hemanth; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

2018-05-01

Diffusion of atoms across the boundary between two bonding layers is the key for achieving excellent thermocompression Wafer on Wafer bonding. In this paper, we demonstrate a novel mechanism to increase the diffusion across the bonding interface and also shows the CMOS in-line process flow compatible Sub 100 °C Cu-Cu bonding which is devoid of Cu surface treatment prior to bonding. The stress in sputtered Cu thin films was engineered by adjusting the Argon in-let pressure in such a way that one film had a compressive stress while the other film had tensile stress. Due to this stress gradient, a nominal pressure (2 kN) and temperature (75 °C) was enough to achieve a good quality thermocompression bonding having a bond strength of 149 MPa and very low specific contact resistance of 1.5 × 10-8 Ω-cm2. These excellent mechanical and electrical properties are resultant of a high quality Cu-Cu bonding having grain growth between the Cu films across the boundary and extended throughout the bonded region as revealed by Cross-sectional Transmission Electron Microscopy. In addition, reliability assessment of Cu-Cu bonding with stress engineering was demonstrated using multiple current stressing and temperature cycling test, suggests excellent reliable bonding without electrical performance degradation.

Laser Indirect Shock Welding of Fine Wire to Metal Sheet.

PubMed

Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

2017-09-12

The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent.

Adhesive Characterization and Progressive Damage Analysis of Bonded Composite Joints

NASA Technical Reports Server (NTRS)

Girolamo, Donato; Davila, Carlos G.; Leone, Frank A.; Lin, Shih-Yung

2014-01-01

The results of an experimental/numerical campaign aimed to develop progressive damage analysis (PDA) tools for predicting the strength of a composite bonded joint under tensile loads are presented. The PDA is based on continuum damage mechanics (CDM) to account for intralaminar damage, and cohesive laws to account for interlaminar and adhesive damage. The adhesive response is characterized using standard fracture specimens and digital image correlation (DIC). The displacement fields measured by DIC are used to calculate the J-integrals, from which the associated cohesive laws of the structural adhesive can be derived. A finite element model of a sandwich conventional splice joint (CSJ) under tensile loads was developed. The simulations indicate that the model is capable of predicting the interactions of damage modes that lead to the failure of the joint.

Joining of ceramics for high performance energy systems. Mid-term progress report, August 1, 1979-March 31, 1980

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smeltzer, C E; Metcalfe, A G

The subject program is primarily an exploratory and demonstration study of the use of silicate glass-based adhesives for bonding silicon-base refractory ceramics (SiC, Si/sub 3/N/sub 4/). The projected application is 1250 to 2050/sup 0/F relaxing joint service in high-performance energy conversion systems. The five program tasks and their current status are as follows. Task 1 - Long-Term Joint Stability. Time-temperature-transformation studies of candidate glass adhesives, out to 2000 hours simulated service exposure, are half complete. Task 2 - Environmental and Service Effects on Joint Reliability. Start up delayed due to late delivery of candidate glass fillers and ceramic specimens. Taskmore » 3 - Viscoelastic Damping of Glass Bonded Ceramics. Promising results obtained over approximately the same range of glass viscosity required for joint relaxation function (10/sup 7.5/ to 10/sup 9.5/ poise). Work is 90% complete. Task 4 - Crack Arrest and Crack Diversion by Joints. No work started due to late arrival of materials. Task 5 - Improved Joining and Fabrication Methods. Significant work has been conducted in the area of refractory pre-glazing and the application and bonding of high-density candidate glass fillers (by both hand-artisan and slip-spray techniques). Work is half complete.« less

A guided-wave system for monitoring the wing skin-to-spar bond in unmanned aerial vehicles

NASA Astrophysics Data System (ADS)

Matt, Howard; Bartoli, Ivan; Lanza di Scalea, Francesco; Marzani, Alessandro; Coccia, Stefano; Oliver, Joseph; Kosmatka, John; Rizzo, Piervincenzo; Restivo, Gaetano

2005-05-01

Unmanned Aerial Vehicles (UAVs) are being increasingly used in military as well as civil applications. A critical part of the structure is the adhesive bond between the wing skin and the supporting spar. If not detected early, bond defects originating during manufacturing or in service flight can lead to inefficient flight performance and eventual global failure. This paper will present results from a bond inspection system based on attached piezoelectric disks probing the skin-to-spar bondline with ultrasonic guided waves in the hundreds of kilohertz range. The test components were CFRP composite panels of two different fiber layups bonded to a CFRP composite tube using epoxy adhesive. Three types of bond conditions were simulated, namely regions of poor cohesive strength, regions with localized disbonds and well bonded regions. The root mean square and variance of the received time-domain signals and their discrete wavelet decompositions were computed for the dominant modes propagating through the various bond regions in two different inspection configurations. Semi-analytical finite element analysis of the bonded multilayer joint was also carried out to identify and predict the sensitivity of the predominant carrier modes to the different bond defects. Emphasis of this research is based upon designing a built-in system for monitoring the structural integrity of bonded joints in UAVs and other aerospace structures.

Characteristics of solder joints under fatigue loads using piezomechanical actuation

NASA Astrophysics Data System (ADS)

Shim, Dong-Jin; Spearing, S. Mark

2003-07-01

Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

Diffusion of aqueous solutions of ionic, zwitterionic, and polar solutes

NASA Astrophysics Data System (ADS)

Teng, Xiaojing; Huang, Qi; Dharmawardhana, Chamila Chathuranga; Ichiye, Toshiko

2018-06-01

The properties of aqueous solutions of ionic, zwitterionic, and polar solutes are of interest to many fields. For instance, one of the many anomalous properties of aqueous solutions is the behavior of water diffusion in different monovalent salt solutions. In addition, solutes can affect the stabilities of macromolecules such as proteins in aqueous solution. Here, the diffusivities of aqueous solutions of sodium chloride, potassium chloride, tri-methylamine oxide (TMAO), urea, and TMAO-urea are examined in molecular dynamics simulations. The decrease in the diffusivity of water with the concentration of simple ions and urea can be described by a simple model in which the water molecules hydrogen bonded to the solutes are considered to diffuse at the same rate as the solutes, while the remainder of the water molecules are considered to be bulk and diffuse at almost the same rate as pure water. On the other hand, the decrease in the diffusivity of water with the concentration of TMAO is apparently affected by a decrease in the diffusion rate of the bulk water molecules in addition to the decrease due to the water molecules hydrogen bonded to TMAO. In other words, TMAO enhances the viscosity of water, while urea barely affects it. Overall, this separation of water molecules into those that are hydrogen bonded to solute and those that are bulk can provide a useful means of understanding the short- and long-range effects of solutes on water.

Joint estimation of phase and phase diffusion for quantum metrology.

PubMed

Vidrighin, Mihai D; Donati, Gaia; Genoni, Marco G; Jin, Xian-Min; Kolthammer, W Steven; Kim, M S; Datta, Animesh; Barbieri, Marco; Walmsley, Ian A

2014-04-14

Phase estimation, at the heart of many quantum metrology and communication schemes, can be strongly affected by noise, whose amplitude may not be known, or might be subject to drift. Here we investigate the joint estimation of a phase shift and the amplitude of phase diffusion at the quantum limit. For several relevant instances, this multiparameter estimation problem can be effectively reshaped as a two-dimensional Hilbert space model, encompassing the description of an interferometer phase probed with relevant quantum states--split single-photons, coherent states or N00N states. For these cases, we obtain a trade-off bound on the statistical variances for the joint estimation of phase and phase diffusion, as well as optimum measurement schemes. We use this bound to quantify the effectiveness of an actual experimental set-up for joint parameter estimation for polarimetry. We conclude by discussing the form of the trade-off relations for more general states and measurements.

Diffusion bonding

DOEpatents

Anderson, Robert C.

1976-06-22

1. A method for joining beryllium to beryllium by diffusion bonding, comprising the steps of coating at least one surface portion of at least two beryllium pieces with nickel, positioning a coated surface portion in a contiguous relationship with an other surface portion, subjecting the contiguously disposed surface portions to an environment having an atmosphere at a pressure lower than ambient pressure, applying a force upon the beryllium pieces for causing the contiguous surface portions to abut against each other, heating the contiguous surface portions to a maximum temperature less than the melting temperature of the beryllium, substantially uniformly decreasing the applied force while increasing the temperature after attaining a temperature substantially above room temperature, and maintaining a portion of the applied force at a temperature corresponding to about maximum temperature for a duration sufficient to effect the diffusion bond between the contiguous surface portions.

The association of sacroiliac joint bridging with other enthesopathies in the human body.

PubMed

Dar, Gali; Peleg, Smadar; Masharawi, Youssef; Steinberg, Nili; Rothschild, Bruce M; Hershkovitz, Israel

2007-05-01

A descriptive study of the association between sacroiliac joint (extra-articular) bridging and other enthesopathies. To examine the relationship between sacroiliac joint bridging with other entheseal reaction sites in the skeleton, and its prognostic value in spinal diseases. Sacroiliac joint bridging is considered a hallmark of spinal diseases (e.g., ankylosing spondylitis). Nevertheless, its association with other enthesopathies has never been quantified and analyzed. A total of 289 human male skeletons with sacroiliac joint bridging and 127 without (of similar demographic structure) were evaluated for the presence of entheseal ossification, cartilaginous calcification, and other axial skeleton joint fusion (a total of 18 anatomic sites). The presence of diffuse idiopathic skeletal hyperostosis and spondyloarthropathy was also recorded. Sacroiliac joint bridging was strongly associated with entheseal reactions in other parts of the body. Of the sacroiliac joint bridging group, 24.91% had diffuse idiopathic skeletal hyperostosis, and 8.05% had spondyloarthropathy. The presence of sacroiliac joint bridging indicates an intensive general entheseal process in the skeleton.

Bond strength evaluation in adhesive joints using NDE and DIC methods

NASA Astrophysics Data System (ADS)

Poudel, Anish

Adhesive bonding of graphite epoxy composite laminates to itself or traditional metal alloys in modern aerospace and aircraft structural applications offers an excellent opportunity to use the most efficient and intelligent combination of materials available thus providing an attractive package for efficient structural designs. However, one of the major issues of adhesive bonding is the occasional formation of interfacial defects such as kissing or weak bonds in the bondline interface. Also, there are shortcomings of existing non-destructive evaluation (NDE) methods to non-destructively detect/characterize these interfacial defects and reliably predicting the bond shear strength. As a result, adhesive bonding technology is still not solely implemented in primary structures of an aircraft. Therefore, there is a greater demand for a novel NDE tool that can meet the existing aerospace requirement for adhesive bondline characterization. This research implemented a novel Acoustography ultrasonic imaging and digital image correlation (DIC) technique to detect and characterize interfacial defects in the bondline and determine bond shear strength in adhesively bonded composite-metal joints. Adhesively bonded Carbon Fiber Reinforced Plastic (CFRP) laminate and 2024-T3 Aluminum single lap shear panels subjected to various implanted kissing/weak bond defects were the primary focus of this study. Kissing/weak bonds were prepared by controlled surface contamination in the composite bonding surface and also by improperly mixing the adhesive constituent. SEM analyses were also conducted to understand the surface morphology of substrates and their interaction with the contaminants. Morphological changes were observed in the microscopic scale and the chemical analysis confirmed the stability of the contaminant at or very close to the interface. In addition, it was also demonstrated that contaminants migrated during the curing of the adhesive from CFRP substrate which caused a decrease of bond shear strength in single lap shear test samples. Through-transmission ultrasonics (TTU) Acoustography at 3.8 MHz showed promising results on the detectability of bondline defects in adhesively bonded CFRP-Al lap shear test samples. A correlation between Acoustography ultrasonic attenuation and average bond shear strength in CFRP-Al lap shear panels demonstrated that differential attenuation increased with the reduction of the bond shear strength. Similarly, optical DIC tests were conducted to identify and quantify kissing bond defects in CFRP-Al single lap shear joints. DIC results demonstrated changes in the normal strain (epsilonyy) contour map of the contaminated specimens at relatively lower load levels (15% ~ 30% of failure loads). Kissing bond regions were characterized by negative strains, and these were attributed to high compressive bending strains and the localized disbonding taking placed at the bondline interface as a result of the load application. It was also observed that contaminated samples suffered from more compressive strains (epsilonyy) compared to the baseline sample along the loading direction and they suffered from less compressive strains (epsilonxx) compared to the baseline sample perpendicular to the loading direction. This demonstrated the adverse effect of the kissing bond on the adhesive joint integrity. This was a very significant finding for the reason that hybrid ultrasonic DIC is being developed as a faster, more efficient, and more reliable NDE technique for determining bond quality and predicting bond shear strength in adhesively bonded structures.

Development of FRP composite structural biomaterials: ultimate strength of the fiber/matrix interfacial bond in in vivo simulated environments.

PubMed

Latour, R A; Black, J

1992-05-01

Fiber reinforced polymer (FRP) composites are being developed as alternatives to metals for structural orthopedic implant applications. FRP composite fracture behavior and environmental interactions are distinctly different from those which occur in metals. These differences must be accounted for in the design and evaluation of implant performance. Fiber/matrix interfacial bond strength in a FRP composite is known to strongly influence fracture behavior. The interfacial bond strength of four candidate fiber/matrix combinations (carbon fiber/polycarbonate, carbon fiber/polysulfone, polyaramid fiber/polycarbonate, polyaramid fiber/polysulfone) were investigated at 37 degrees C in dry and in vivo simulated (saline, exudate) environments. Ultimate bond strength was measured by a single fiber-microdroplet pull-out test. Dry bond strengths were significantly decreased following exposure to either saline or exudate with bond strength loss being approximately equal in both the saline and exudate. Bond strength loss is attributed to the diffusion of water and/or salt ions into the sample and their interaction with interfacial bonding. Because bond degradation is dependent upon diffusion, diffusional equilibrium must be obtained in composite test samples before the full effect of the test environment upon composite mechanical behavior can be determined.

Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kropka, Jamie Michael; Adolf, Douglas Brian; Spangler, Scott Wilmer

The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted formore » by the glass transition temperature, T g, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, T ref, by the same amount as the T g depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive T g depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.« less

Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

DOE PAGES

Kropka, Jamie Michael; Adolf, Douglas Brian; Spangler, Scott Wilmer; ...

2015-08-06

The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted formore » by the glass transition temperature, T g, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, T ref, by the same amount as the T g depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive T g depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.« less

Microstructure and Mechanical Properties of Reaction-Formed Joints in Reaction Bonded Silicon Carbide Ceramics

NASA Technical Reports Server (NTRS)

Singh, M.

1998-01-01

A reaction-bonded silicon carbide (RB-SiC) ceramic material (Carborundum's Cerastar RB-SIC) has been joined using a reaction forming approach. Microstructure and mechanical properties of three types of reaction-formed joints (350 micron, 50-55 micron, and 20-25 micron thick) have been evaluated. Thick (approximately 350 micron) joints consist mainly of silicon with a small amount of silicon carbide. The flexural strength of thick joints is about 44 plus or minus 2 MPa, and fracture always occurs at the joints. The microscopic examination of fracture surfaces of specimens with thick joints tested at room temperature revealed the failure mode to be typically brittle. Thin joints (<50-55 micron) consist of silicon carbide and silicon phases. The room and high temperature flexural strengths of thin (<50-55 micron) reaction-formed joints have been found to be at least equal to that of the bulk Cerastar RB-SIC materials because the flexure bars fracture away from the joint regions. In this case, the fracture origins appear to be inhomogeneities inside the parent material. This was always found to be the case for thin joints tested at temperatures up to 1350C in air. This observation suggests that the strength of Cerastar RB-SIC material containing a thin joint is not limited by the joint strength but by the strength of the bulk (parent) materials.

Mixed-mode cyclic debonding of adhesively bonded composite joints. M.S. Thesis

NASA Technical Reports Server (NTRS)

Rezaizadeh, M. A.; Mall, S.

1985-01-01

A combined experimental-analytical investigation to characterize the cyclic failure mechanism of a simple composite-to-composite bonded joint is conducted. The cracked lap shear (CLS) specimens of graphite/epoxy adherend bonded with EC-3445 adhesive are tested under combined mode 1 and 2 loading. In all specimens tested, fatigue failure occurs in the form of cyclic debonding. The cyclic debond growth rates are measured. The finite element analysis is employed to compute the mode 1, mode 2, and total strain energy release rates (i.e., GI, GII, and GT). A wide range of mixed-mode loading, i.e., GI/GII ranging from 0.03 to 0.38, is obtained. The total strain energy release rate, G sub T, appeared to be the driving parameter for cyclic debonding in the tested composite bonded system.

High Temperature Stability of Dissimilar Metal Joints in Fission Surface Power Systems

NASA Technical Reports Server (NTRS)

Locci, Ivan E.; Nesbitt, James A.; Ritzert, Frank J.; Bowman, Cheryl L.

2007-01-01

Future generations of power systems for spacecraft and lunar surface systems will likely require a strong dependence on nuclear power. The design of a space nuclear power plant involves integrating together major subsystems with varying materia1 requirements. Refractory alloys are repeatedly considered for major structural components in space power reactor designs because refractory alloys retain their strength at higher temperatures than other classes of metals. The relatively higher mass and lower ductility of the refractory alloys make them less attractive for lower temperature subsystems in the power plant such as the power conversion system. The power conversion system would consist more likely of intermediate temperature Ni-based superalloys. One of many unanswered questions about the use of refractory alloys in a space power plant is how to transition from the use of the structural refractory alloy to more traditional structural alloys. Because deleterious phases can form when complex alloys are joined and operated at elevated temperatures, dissimilar material diffusion analyses of refractory alloys and superalloys are needed to inform designers about options of joint temperature and operational lifetime. Combinations of four superalloys and six refractory alloys were bonded and annealed at 1150 K and 1300 K to examine diffusional interactions in this study. Joints formed through hot pressing and hot isostatic pressing were compared. Results on newer alloys compared favorably to historical data. Diffusional stability is promising for some combinations of Mo-Re alloys and superalloys at 1150 K, but it appears that lower joint temperatures would be required for other refractory alloy couples.

TEM Observation of the Ti Interlayer Between SiC Substrates During Diffusion Bonding

NASA Technical Reports Server (NTRS)

Tsuda, Hiroshi; Mori, Shigeo; Halbig, Michael C.; Singh, Mori

2012-01-01

Diffusion bonding was carried out to join SiC to SiC substrates using titanium interlayers. In this study, 10 m and 20 m thick physical vapor deposited (PVD) Ti surface coatings, and 10 and 20 m thick Ti foils were used. Diffusion bonding was performed at 1250 C for PVD Ti coatings and 1200 C for Ti foil. This study investigates the microstructures of the phases formed during diffusion bonding through TEM and selected-area diffraction analysis of a sample prepared with an FIB, which allows samples to be taken from the reacted area. In all samples, Ti3SiC2, Ti5Si3Cx and TiSi2 phases were identified. In addition, TiC and unknown phases also appeared in the samples in which Ti foils were used as interlayers. Furthermore, Ti3SiC2 phases show high concentration and Ti5Si3Cx formed less when samples were processed at a higher temperature and thinner interlayer samples were used. It appears that the formation of microcracks is caused by the presence of intermediate phase Ti5Si3Cx, which has anisotropic thermal expansion, and by the presence of an unidentified Ti-Si-C ternary phase with relatively low Si content.

Laser surface texturing of polypropylene to increase adhesive bonding

NASA Astrophysics Data System (ADS)

Mandolfino, Chiara; Pizzorni, Marco; Lertora, Enrico; Gambaro, Carla

2018-05-01

In this paper, the main parameters of laser surface texturing of polymeric substrates have been studied. The final aim of the texturing is to increase the performance of bonded joints of grey-pigmented polypropylene substrates. The experimental investigation was carried out starting from the identification of the most effective treatment parameters, in order to achieve a good texture without compromising the characteristics of the bulk material. For each of these parameters, three values were individuated and 27 sets of samples were realised. The surface treatment was analysed and related to the mechanical characteristics of the bonded joints performing lap-shear tests. A statistical analysis in order to find the most influential parameter completed the work.

Differential Microscopic Mobility of Components within a Deep Eutectic Solvent

DOE PAGES

Wagle, Durgesh V.; Baker, Gary A.; Mamontov, Eugene

2015-07-13

From macroscopic measurements of deep eutectic solvents such as glyceline (1:2 molar ratio of choline chloride to glycerol), the long-range translational diffusion of the larger cation (choline) is known to be slower compared to that of the smaller hydrogen bond donor (glycerol). However, when the diffusion dynamics are analyzed on the subnanometer length scale, we discover that the displacements associated with the localized diffusive motions are actually larger for choline. This counterintuitive diffusive behavior can be understood as follows. The localized diffusive motions confined in the transient cage of neighbor particles, which precede the cage-breaking long-range diffusion jumps, are moremore » spatially constrained for glycerol than for choline because of the stronger hydrogen bonds the former makes with chloride anions. The implications of differential localized mobility of the constituents should be especially important for applications where deep eutectic solvents are confined on the nanometer length scale and their long-range translational diffusion is strongly inhibited (e.g., within microporous media).« less

Power module packaging with double sided planar interconnection and heat exchangers

DOEpatents

Liang, Zhenxian; Marlino, Laura D.; Ning, Puqi; Wang, Fei

2015-05-26

A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.

James Webb Space Telescope (JWST) Integrated Science Instruments Module (ISIM) Electronics Compartment (IEC) Conformal Shields Composite Bond Structure Qualification Test Method

NASA Technical Reports Server (NTRS)

Yew, Calinda; Stephens, Matt

2015-01-01

The JWST IEC conformal shields are mounted onto a composite frame structure that must undergo qualification testing to satisfy mission assurance requirements. The composite frame segments are bonded together at the joints using epoxy, EA 9394. The development of a test method to verify the integrity of the bonded structure at its operating environment introduces challenges in terms of requirements definition and the attainment of success criteria. Even though protoflight thermal requirements were not achieved, the first attempt in exposing the structure to cryogenic operating conditions in a thermal vacuum environment resulted in approximately 1 bonded joints failure during mechanical pull tests performed at 1.25 times the flight loads. Failure analysis concluded that the failure mode was due to adhesive cracks that formed and propagated along stress concentrated fillets as a result of poor bond squeeze-out control during fabrication. Bond repairs were made and the structures successfully re-tested with an improved LN2 immersion test method to achieve protoflight thermal requirements.

A new active solder for joining electronic components

DOE Office of Scientific and Technical Information (OSTI.GOV)

SMITH,RONALD W.; VIANCO,PAUL T.; HERNANDEZ,CYNTHIA L.

Electronic components and micro-sensors utilize ceramic substrates, copper and aluminum interconnect and silicon. The joining of these combinations require pre-metallization such that solders with fluxes can wet such combinations of metals and ceramics. The paper will present a new solder alloy that can bond metals, ceramics and composites. The alloy directly wets and bonds in air without the use flux or premetallized layers. The paper will present typical processing steps and joint microstructures in copper, aluminum, aluminum oxide, aluminum nitride, and silicon joints.

Development and Characterization of the Bonding and Integration Technologies Needed for Fabricating Silicon Carbide Based Injector Components

NASA Technical Reports Server (NTRS)

Halbig,Michael C.; Singh, Mrityunjay

2008-01-01

Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding technology, titanium interlayers (coatings and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness, and processing time were investigated. Electron microprobe analysis was used to identify the reaction formed phases. In the diffusion bonds, an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner interlayers of pure titanium and/or longer processing times resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Nondestructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

Fatigue life prediction of bonded primary joints

NASA Technical Reports Server (NTRS)

Knauss, J. F.

1979-01-01

The validation of a proposed fatigue life prediction methodology was sought through the use of aluminum butt and scarf joint and graphite/epoxy butt joint specimens in a constant amplitude fatigue environment. The structural properties of the HYSOL 9313 adhesive system were obtained by mechanical test of molded heat adhesive specimens. Aluminum contoured double cantilever beam specimens were used to generate crack velocity versus stress intensity factor data. The specific objectives were: (1) to ascertain the feasibility of predicting fatigue failure of an adhesive in a primary bonded composite structure by incorporating linear elastic crack growth behavior; and (2) to ascertain if acoustic emission and/or compliance measurement techniques can be used to detect flaws.

Two tandem queues with general renewal input. 2: Asymptotic expansions for the diffusion model

DOE Office of Scientific and Technical Information (OSTI.GOV)

Knessl, C.; Tier, C.

1999-10-01

In Part 1 the authors formulated and solved a diffusion model for two tandem queues with exponential servers and general renewal arrivals. They thus obtained the easy traffic diffusion approximation to the steady state joint queue length distribution for this network. Here they study asymptotic and numerical properties of the diffusion approximation. In particular, analytical expressions are obtained for the tail probabilities. Both the joint distribution of the two queues and the marginal distribution of the second queue are considered. They also give numerical illustrations of how this marginal is affected by changes in the arrival and service processes.

Study of diffusion bond development in 6061 aluminum and its relationship to future high density fuels fabrication.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Prokofiev, I.; Wiencek, T.; McGann, D.

1997-10-07

Powder metallurgy dispersions of uranium alloys and silicides in an aluminum matrix have been developed by the RERTR program as a new generation of proliferation-resistant fuels. Testing is done with miniplate-type fuel plates to simulate standard fuel with cladding and matrix in plate-type configurations. In order to seal the dispersion fuel plates, a diffusion bond must exist between the aluminum coverplates surrounding the fuel meat. Four different variations in the standard method for roll-bonding 6061 aluminum were studied. They included mechanical cleaning, addition of a getter material, modifications to the standard chemical etching, and welding methods. Aluminum test pieces weremore » subjected to a bend test after each rolling pass. Results, based on 400 samples, indicate that at least a 70% reduction in thickness is required to produce a diffusion bond using the standard rollbonding method versus a 60% reduction using the Type II method in which the assembly was welded 100% and contained open 9mm holes at frame corners.« less

Investigation of the feasibility of developing low permeability polymeric films

NASA Technical Reports Server (NTRS)

Hoggatt, J. T.

1971-01-01

The feasibility of reducing the gas permeability rate of Mylar and Kapton films without drastically effecting their flexibility characteristics at cryogenic temperatures was considered. This feasibility was established using a concept of diffusion bonding two layers of metallized films together forming a film-metal-film sandwich laminate. The permeability of kapton film to gaseous helium was reduced from a nominal ten = to the minus 9 power cc-mm/sq cm sec. cm Hg to ten to the minus 13 power cc-mm/ sq cm - sec. cm Hg with some values as low as ten to the minus 15 power cc - mm/sq cm m-sec - cm Hg being obtained. Similar reductions occurred in the liquid hydrogen permeability at -252 C. In the course of the program the permeability, flexibility and bond strength of plain, metalized and diffusion bond film were determined at +25 C, -195 C and -252 C. The cryogenic flexibility of Kapton film was reduced slightly due to the metallization process but no additional loss in flexibility resulted from the diffusion bonding process.

Energy efficient engine. Volume 2. Appendix A: Component development and integration program

NASA Technical Reports Server (NTRS)

Moracz, D. J.; Cook, C. R.

1981-01-01

The large size and the requirement for precise lightening cavities in a considerable portion of the titanium fan blades necessitated the development of a new manufacturing method. The approach which was selected for development incorporated several technologies including HIP diffusion bonding of titanium sheet laminates containing removable cores and isothermal forging of the blade form. The technology bases established in HIP/DB for composite blades and in isothermal forging for fan blades were applicable for development of the manufacturing process. The process techniques and parameters for producing and inspecting the cored diffusion bonded titanium laminate blade preform were established. The method was demonstrated with the production of twelve hollow simulated blade shapes for evaluation. Evaluations of the critical experiments conducted to establish procedures to produce hollow structures by a laminate/core/diffusion bonding approach are included. In addition the transfer of this technology to produce a hollow fan blade is discussed.

CFRTP and stainless steel laser joining: Thermal defects analysis and joining parameters optimization

NASA Astrophysics Data System (ADS)

Jiao, Junke; Xu, Zifa; Wang, Qiang; Sheng, Liyuan; Zhang, Wenwu

2018-07-01

Experiments with different joining parameters were carried out on fiber laser welding system to explore the mechanism of CFRTP/stainless steel joining and the influence of the parameters on the joining quality. The thermal defect and the microstructure of the joint was tested by SEM, EDS. The joint strength and the thermal defect zone width was measured by the tensile tester and the laser confocal microscope, respectively. The influence of parameters such as the laser power, the joining speed and the clamper pressure on the stainless steel surface thermal defect and the joint strength was analyzed. The result showed that the thermal defect on the stainless steel surface would change metal's mechanical properties and reduce its service life. A chemical bonding was found between the CFRTP and the stainless steel besides the physical bonding and the mechanical bonding. The highest shear stress was obtained as the laser power, the joining speed and the clamper pressure is 280 W, 4 mm/s and 0.15 MPa, respectively.

Laser properties of Fe2+:ZnSe fabricated by solid-state diffusion bonding

NASA Astrophysics Data System (ADS)

Balabanov, S. S.; Firsov, K. N.; Gavrishchuk, E. M.; Ikonnikov, V. B.; Kazantsev, S. Yu; Kononov, I. G.; Kotereva, T. V.; Savin, D. V.; Timofeeva, N. A.

2018-04-01

The characteristics of an Fe2+:ZnSe laser at room temperature and its active elements with undoped faces were studied. Polycrystalline elements with one or two diffusion-doped internal layers were obtained by the solid-state diffusion bonding technique applied to chemical vapor deposition grown ZnSe plates preliminary doped with Fe2+ ions in the process of hot isostatic pressing. A non-chain electric-discharge HF laser was used to pump the crystals. It was demonstrated that increasing the number of doped layers allows increasing the maximum diameter of the pump radiation spot and the pump energy without the appearance of transversal parasitic oscillation. For the two-layer-doped active element with a diameter of 20 mm an output energy of 480 mJ was achieved with 37% total efficiency with respect to the absorbed energy. The obtained results demonstrate the potential of the developed technology for fabrication of active elements by the solid-state diffusion bonding technique combined with the hot isostatic pressing treatment for efficient IR lasers based on chalcogenides doped with transition metal ions.

First Principles Study for Proton Transport and Diffusion Behavior in Hydrous Hexagonal WO3

NASA Astrophysics Data System (ADS)

Liu, Chi-Ping; Zhou, Fei; Ozolins, Vidvuds; QPAM Team

2013-03-01

Proton transport is of great importance in biological species and energy storage and conversion systems. Previous studies have shown fast proton conduction in liquids and polymers but seldom in inorganic materials. In this work, first principles density functional theory (DFT) reveals that the formation of hydronium and water chains inside the hexagonal channels plays the key roles for the anomalously fast proton transport, by following modified Grotthuss mechanism. Our DFT study shows the detailed microscopic proton diffusion mechanism along the channel in hydrous WO3 with 50% water composition, which is proper for water chain formation. The water chain in the channel serves as a possible diffusion media for hydronium (H3O +) . With the continuous formation and cleavage of hydrogen bonds in the channel, the hydronium diffuses by hydrogen bonds exchange between water molecules. This mechanism is very similar with Grotthuss relay mechanism for proton transport in liquid. The possible proton diffusion were studied for hydronium is either far away from the water chain bond defect or next to H2O defect at the end of water chain. The diffusion barriers for both conditions are around 150 meV to 200 meV, and water defects reorganization in the chain is the rate-limited step for proton diffusion. These small diffusion barriers could explain the fast 1-D proton transport in hydrous WO3 channel. Further studies about fast proton transport in other inorganic materials could be an important topic in not only biochemistry but also clean energy applications like fuel cell applications.

Evaluation of a thin-bonded Portland cement concrete pavement overlay.

DOT National Transportation Integrated Search

1996-01-01

This report discusses the performance of the Virginia Department of Transportation's first modern rehabilitation project involving a thin-bonded portland cement concrete overlay of an existing jointed concrete pavement. The performance of the rigid o...

Superplastic forming and diffusion bonding of rapidly solidified, dispersion strengthened aluminum alloys for elevated temperature structural applications

NASA Technical Reports Server (NTRS)

Ting, E. Y.; Kennedy, J. R.

1989-01-01

Rapidly solidified alloys, based upon the Al-Fe-V-Si system and designed for elevated temperature applications, were evaluated for superplasticity and diffusion bonding behavior. Alloys with 8, 16, 27, and 36 volume percent silicide dispersoids were produced; dispersoid condition was varied by rolling at 300, 400, and 500 C (572, 752, and 932 F). Superplastic behavior was evaluated at strain rates from 1 x 10(exp -6)/s to 8.5/s at elevated temperatures. The results indicate that there was a significant increase in elongation at higher strain rates and at temperatures above 600 C (1112 F). However, the exposure of the alloys to temperatures greater than 600 C (1112 F) resulted in the coarsening of the strengthening dispersoid and the degradation of mechanical properties. Diffusion bonding was possible using low gas pressure at temperatures greater than 600 C (1112 F) which also resulted in degraded properties. The bonding of Al-Fe-V-Si alloys to 7475 aluminum alloy was performed at 516 C (960 F) without significant degradation in microstructure. Bond strengths equal to 90 percent that of the base metal shear strength were achieved. The mechanical properties and microstructural characteristics of the alloys were investigated.

Non-destructive testing techniques based on nonlinear methods for assessment of debonding in single lap joints

NASA Astrophysics Data System (ADS)

Scarselli, G.; Ciampa, F.; Ginzburg, D.; Meo, M.

2015-04-01

Nonlinear ultrasonic non-destructive evaluation (NDE) methods can be used for the identification of defects within adhesive bonds as they rely on the detection of nonlinear elastic features for the evaluation of the bond strength. In this paper the nonlinear content of the structural response of a single lap joint subjected to ultrasonic harmonic excitation is both numerically and experimentally evaluated to identify and characterize the defects within the bonded region. Different metallic samples with the same geometry were experimentally tested in order to characterize the debonding between two plates by using two surface bonded piezoelectric transducers in pitch-catch mode. The dynamic response of the damaged samples acquired by the single receiver sensor showed the presence of higher harmonics (2nd and 3rd) and subharmonics of the fundamental frequencies. These nonlinear elastic phenomena are clearly due to nonlinear effects induced by the poor adhesion between the two plates. A new constitutive model aimed at representing the nonlinear material response generated by the interaction of the ultrasonic waves with the adhesive joint is also presented. Such a model is implemented in an explicit FE software and uses a nonlinear user defined traction-displacement relationship implemented by means of a cohesive material user model interface. The developed model is verified for the different geometrical and material configurations. Good agreement between the experimental and numerical nonlinear response showed that this model can be used as a simple and useful tool for understanding the quality of the adhesive joint.

Durability of polyimide adhesives and their bonded joints for high-temperature applications

NASA Astrophysics Data System (ADS)

Parvatareddy, Hari

The objective of this study was to evaluate and develop an understanding of durability of an adhesive bonded system, for application in a future high speed civil transport (HSCT) aircraft structure. The system under study was comprised of Ti-6Al-4V metal adherends and a thermosetting polyimide adhesive, designated as FM-5, supplied by Cytec Engineered Materials, Inc. An approach based on fracture mechanics was employed to assess Ti-6Al-4V/FM-5 bond durability. Initially, wedge tests were utilized to find a durable surface pretreatment for the titanium adherends. Based on an extensive screening study, chromic acid anodization (CAA) was chosen as the standard pretreatment for this research project. Double cantilever beam specimens (DCB) were then made and aged at 150sp°C, 177sp°C, and 204sp°C in three different environments; ambient atmospheric air (14.7 psia), and reduced air pressures of 2 psia (13.8 KPa) and 0.2 psia (1.38 KPa). Joints were aged for up to 18 months (including several intermediate aging times) in the above environments. The strain energy release rate (G) of the adhesive joints was monitored as a function of exposure time in the different environments. A 40% drop in fracture toughness was noted over the 18 month period, with the greatest degradation observed in samples aged at 204sp°C in ambient atmospheric air pressure. The loss in adhesive bond performance with time was attributable to a combination of physical and chemical aging phenomena in the FM-5 resin, and possible degradation of the metal-adhesive interface(s). Several mechanical and material tests, performed on the bonded joints and neat FM-5 resin specimens, confirmed the above statement. It was also noted that physical aging could be "erased" by thermal rejuvenation, partially restoring the toughness of the FM-5 adhesive material. The FM-5 adhesive material displayed good chemical resistance towards organic solvents and other aircraft fluids such as jet fuel and hydraulic fluid. The results from the FM-5 adhesive and its bonded joints were compared and contrasted with VT Ultem and REGULUSspTM polyimide adhesives. The FM-5 adhesive showed the best performance among the three adhesive systems. The effect of mode-mixity on the fracture toughness of the Ti-6Al-4V/FM-5 adhesive bonded system was also evaluated. DCB tests in conjunction with end-notched flexure (ENF) and mixed-mode flexure (MMF) tests, were used to fracture the bonded joints under pure mode I, pure mode II, and a combination of mode I and II loadings. The results showed that the mode I fracture toughness was twice as large as the mode II toughness. This was a rather surprising find, in sharp contrast to what several researchers have observed in the past. Our current understanding is that the crack path selection during the failure process plays a significant role in explaining this anomalous behavior. Finally, failure envelopes were generated for the titanium/FM-S bonded system, both prior to and following thermal aging. These envelopes could serve as useful tools for engineers designing with Ti-6Al-4V/FM-5 bonds.

Effect of light aging on silicone-resin bond strength in maxillofacial prostheses.

PubMed

Polyzois, Gregory; Pantopoulos, Antonis; Papadopoulos, Triantafillos; Hatamleh, Muhanad

2015-04-01

The aim of this study was to investigate the effect of accelerated light aging on bond strength of a silicone elastomer to three types of denture resin. A total of 60 single lap joint specimens were fabricated with auto-, heat-, and photopolymerized (n = 20) resins. An addition-type silicone elastomer (Episil-E) was bonded to resins treated with the same primer (A330-G). Thirty specimens served as controls and were tested after 24 hours, and the remaining were aged under accelerated exposure to daylight for 546 hours (irradiance 765 W/m(2) ). Lap shear joint tests were performed to evaluate bond strength at 50 mm/min crosshead speed. Two-way ANOVA and Tukey's test were carried out to detect statistical significance (p < 0.05). ANOVA showed that the main effect of light aging was the most important factor determining the shear bond strength. The mean bond strength values ranged from 0.096 to 0.136 MPa. The highest values were recorded for auto- (0.131 MPa) and photopolymerized (0.136 MPa) resins after aging. Accelerated light aging for 546 hours affects the bond strength of an addition-type silicone elastomer to three different denture resins. The bond strength significantly increased after aging for photo- and autopolymerized resins. All the bonds failed adhesively. © 2014 by the American College of Prosthodontists.

Rationale behind the design and comparative evaluation of an all-in-one self-etch model adhesive.

PubMed

Kanehira, Masafumi; Finger, Werner J; Ishihata, Hiroshi; Hoffmann, Marcus; Manabe, Atsufumi; Shimauchi, Hidetoshi; Komatsu, Masashi

2009-06-01

To investigate and compare bonding and dentin sealing efficacy of a marketed all-in-one and an experimental model adhesive with minimum effective amounts of acidic monomer and water. Composition of model adhesive (NAD) in mass%: UDMA (45), 4-META (20), H2O (7.5), and acetone (27.5). For characterization of a reasonable NAD application procedure shear bond strengths (SBS, n=8) were determined on human enamel and dentin. Clearfil S3 Bond (TSB; Kuraray) served as reference. SBSs were evaluated after 10 min, 1 and 7 days, and 1 month, marginal adaptation (n=8) was assessed in cylindrical butt-joint dentin cavities. Diffusive and convective water fluxes through 1mm thick adhesive-coated dentin disks (n=6) were qualitatively and quantitatively analyzed. SBSs proved that application of NAD in one coat with 20s agitated dwell time was > or =20 MPa, enamel SBSs (24h) were 25 MPa, p>0.05. Dentin SBSs for TSB and NAD were not different (p>0.05) at the four stages (means: 18.9, 23.5, 25.4, and 23.6 MPa). Five and seven of the eight bonded restorations with TSB and NAD were gap-free (p>0.05). Dentin disks treated with EDTA from both sides or one side only were highly permeable for liquid, whereas adhesive-coated dentin disks showed no permeability at 0 and 2.5 kPa water pressure. Within the limitations of this study the model adhesive tested represents a promising basic composition for all-in-one adhesives, eliminating common problems encountered with single step adhesives such as phase separation and permeability.

Analytical and Numerical Results for an Adhesively Bonded Joint Subjected to Pure Bending

NASA Technical Reports Server (NTRS)

Smeltzer, Stanley S., III; Lundgren, Eric

2006-01-01

A one-dimensional, semi-analytical methodology that was previously developed for evaluating adhesively bonded joints composed of anisotropic adherends and adhesives that exhibit inelastic material behavior is further verified in the present paper. A summary of the first-order differential equations and applied joint loading used to determine the adhesive response from the methodology are also presented. The method was previously verified against a variety of single-lap joint configurations from the literature that subjected the joints to cases of axial tension and pure bending. Using the same joint configuration and applied bending load presented in a study by Yang, the finite element analysis software ABAQUS was used to further verify the semi-analytical method. Linear static ABAQUS results are presented for two models, one with a coarse and one with a fine element meshing, that were used to verify convergence of the finite element analyses. Close agreement between the finite element results and the semi-analytical methodology were determined for both the shear and normal stress responses of the adhesive bondline. Thus, the semi-analytical methodology was successfully verified using the ABAQUS finite element software and a single-lap joint configuration subjected to pure bending.

Diffusional interaction behavior of NSAIDs in lipid bilayer membrane using molecular dynamics (MD) simulation: Aspirin and Ibuprofen.

PubMed

Sodeifian, Gholamhossein; Razmimanesh, Fariba

2018-05-10

In this research, for the first time, molecular dynamics (MD) method was used to simulate aspirin and ibuprofen at various concentrations and in neutral and charged states. Effects of the concentration (dosage), charge state, and existence of an integral protein in the membrane on the diffusion rate of drug molecules into lipid bilayer membrane were investigated on 11 systems, for which the parameters indicating diffusion rate and those affecting the rate were evaluated. Considering the diffusion rate, a suitable score was assigned to each system, based on which, analysis of variance (ANOVA) was performed. By calculating the effect size of the indicative parameters and total scores, an optimum system with the highest diffusion rate was determined. Consequently, diffusion rate controlling parameters were obtained: the drug-water hydrogen bond in protein-free systems and protein-drug hydrogen bond in the systems containing protein.

Dynamics behavior of lithium in graphite lattice: MD calculation approach

NASA Astrophysics Data System (ADS)

Shimizu, A.; Tachikawa, H.

2000-12-01

In order to investigate the diffusion process of Li atom in graphite, molecular dynamics simulation was achieved on the basis of molecular mechanics 2 (MM2) method using four layers cluster model one of which is composed of C150H30 with terminating hydrogen atoms. According to the simulations at 500 K, Li atom stabilizes initially around the center of mass, gets out of the graphite layers after 3.0 ps through diffusion, which is different from the movement of Li+ ion captured by the dangling bonds of the edge carbon atoms. The diffusion process of Li atom is found to be composed of following four steps in series: (1) vibration around the stabilization point; (2) bulk diffusion; (3) vibration under influence of the dangling bonds of edge carbon atoms; and (4) escape from the graphite layers. The diffusivity for step (3) is smaller than that for step (2).

Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study

NASA Astrophysics Data System (ADS)

Zhou, Wei; Liu, Lijuan; Li, Baoling; Wu, Ping

2009-06-01

Electromigration phenomena in a one-dimensional Cu/SnAg3.0Cu0.5/Cu joint were investigated with current stressing. The special effect of intermetallic compound (IMC) layers on the formation of serious electromigration damage induced by nonuniform current density distribution was discussed based on experimental results. Meanwhile, hillocks were observed both at the anode and near the cathode of the joint, and they were described as the result of diffusion of atoms and compressive stress released along grain boundaries to the relatively free surface. Moreover, the diffusion behavior of Cu at the cathode was analyzed with the electromigration equation, and the stability of Ag atoms in the solder during electromigration was evaluated with a first-principles method.

Stresses in adhesively bonded joints - A closed-form solution

NASA Technical Reports Server (NTRS)

Delale, F.; Erdogan, F.; Aydinoglu, M. N.

1981-01-01

The general plane strain problem of adhesively bonded structures consisting of two different, orthotropic adherends is considered, under the assumption that adherend thicknesses are constant and small in relation to the lateral dimensions of the bonded region, so that they may be treated as plates. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form, with a single lap joint and a stiffened plate under various loading conditions being considered as examples. It is found that the plate theory used in the analysis not only predicts the correct trend for adhesive stresses but gives surprisingly accurate results, the solution being obtained by assuming linear stress-strain relations for the adhesive.

Composition of low-strength solder joints in solar-concentrator-cell arrays

NASA Astrophysics Data System (ADS)

Chamberlain, M. B.; Nordstrom, T. V.

Bond strengths of Cu strips soldered to the backside metallization of solar concentrator cells were found to be unacceptably low. To determine whether contaminants in the cell metallization caused these low strengths, unsoldered cells and soldered cells were characterized by scanning Auger microscopy. The backside metallization consisted of a 5 micrometers Ag conductor layer, a 150 nm Pd diffusion barrier and a 150 nm Ti adhesion layer next to an Al ohmic contact layer on the Si cell. The analysis showed that the Ti layer are partially oxidized during soldering, that Pb from the Pb-5 wt % Sn - 2.5 wt % Ag solder segregated during soldering to the Pd-oxidized Ti interface, and that low strength fractures occurred in this Pb layer at the Pd-oxidized Ti interface. The problem was solved by changing the ambient gas used during soldering from N2 to forming gas (80% N2 + 20% H2).

Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips

PubMed Central

Feng, Shuang-Tao; Mei, Yun-Hui; Chen, Gang; Li, Xin; Lu, Guo-Quan

2016-01-01

Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported necessary for the sintering time of ~1 h. In order to shorten the processing duration time, we developed a rapid way to sinter nanosilver paste for bonding IGBT chips in less than 5 min using pulsed current. In this way, we firstly dried as-printed paste at about 100 °C to get rid of many volatile solvents because they may result in defects or voids during the out-gassing from the paste. Then, the pre-dried paste was further heated by pulse current ranging from 1.2 kA to 2.4 kA for several seconds. The whole procedure was less than 3 min and did not require any gas protection. We could obtain robust sintered joint with shear strength of 30–35 MPa for bonding 1200-V, 25-A IGBT and superior thermal properties. Static and dynamic electrical performance of the as-bonded IGBT assemblies was also characterized to verify the feasibility of this rapid sintering method. The results indicate that the electrical performance is comparable or even partially better than that of commercial IGBT modules. The microstructure evolution of the rapid sintered joints was also studied by scanning electron microscopy (SEM). This work may benefit the wide usage of nanosilver paste for rapid bonding IGBT chips in the future. PMID:28773686

Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips.

PubMed

Feng, Shuang-Tao; Mei, Yun-Hui; Chen, Gang; Li, Xin; Lu, Guo-Quan

2016-07-12

Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported necessary for the sintering time of ~1 h. In order to shorten the processing duration time, we developed a rapid way to sinter nanosilver paste for bonding IGBT chips in less than 5 min using pulsed current. In this way, we firstly dried as-printed paste at about 100 °C to get rid of many volatile solvents because they may result in defects or voids during the out-gassing from the paste. Then, the pre-dried paste was further heated by pulse current ranging from 1.2 kA to 2.4 kA for several seconds. The whole procedure was less than 3 min and did not require any gas protection. We could obtain robust sintered joint with shear strength of 30-35 MPa for bonding 1200-V, 25-A IGBT and superior thermal properties. Static and dynamic electrical performance of the as-bonded IGBT assemblies was also characterized to verify the feasibility of this rapid sintering method. The results indicate that the electrical performance is comparable or even partially better than that of commercial IGBT modules. The microstructure evolution of the rapid sintered joints was also studied by scanning electron microscopy (SEM). This work may benefit the wide usage of nanosilver paste for rapid bonding IGBT chips in the future.

Cohesive Laws and Progressive Damage Analysis of Composite Bonded Joints, a Combined Numerical/Experimental Approach

NASA Technical Reports Server (NTRS)

Girolamo, Donato; Davila, Carlos G.; Leone, Frank A.; Lin, Shih-Yung

2015-01-01

The results of an experimental/numerical campaign aimed to develop progressive damage analysis (PDA) tools for predicting the strength of a composite bonded joint under tensile loads are presented. The PDA is based on continuum damage mechanics (CDM) to account for intralaminar damage, and cohesive laws to account for interlaminar and adhesive damage. The adhesive response is characterized using standard fracture specimens and digital image correlation (DIC). The displacement fields measured by DIC are used to calculate the J-integrals, from which the associated cohesive laws of the structural adhesive can be derived. A finite element model of a sandwich conventional splice joint (CSJ) under tensile loads was developed. The simulations, in agreement with experimental tests, indicate that the model is capable of predicting the interactions of damage modes that lead to the failure of the joint.

Microstructure and mechanical properties of friction stir lap welded Mg/Al joint assisted by stationary shoulder

NASA Astrophysics Data System (ADS)

Ji, Shude; Li, Zhengwei

2017-11-01

Using magnesium alloy as upper sheet, 3 mm-thick AZ31 magnesium alloy and 6061 aluminum alloy were joined using friction stir lap welding assisted by stationary shoulder. The effects of tool rotating speed on cross-sections, microstructure and mechanical properties of Mg/Al lap joints were mainly discussed. Results showed that stationary shoulder contributed to joint formation, by which stir zones (SZ) were characterized by big onion rings after welding. Because of the big forging force exerted by stationary shoulder, the upper region of hook was well bonded. SZ showed much higher hardness because of intermetallic compounds (IMCs). The bonding conditions at the base material (BM)/SZ interface at advancing side and the hook region played important roles on joint lap shear properties. The X-ray diffraction pattern analysis revealed that the main IMCs were Al3Mg2 and Al12Mg17.

Water Molecules and Hydrogen-Bonded Networks in Bacteriorhodopsin—Molecular Dynamics Simulations of the Ground State and the M-Intermediate

PubMed Central

Grudinin, Sergei; Büldt, Georg; Gordeliy, Valentin; Baumgaertner, Artur

2005-01-01

Protein crystallography provides the structure of a protein, averaged over all elementary cells during data collection time. Thus, it has only a limited access to diffusive processes. This article demonstrates how molecular dynamics simulations can elucidate structure-function relationships in bacteriorhodopsin (bR) involving water molecules. The spatial distribution of water molecules and their corresponding hydrogen-bonded networks inside bR in its ground state (G) and late M intermediate conformations were investigated by molecular dynamics simulations. The simulations reveal a much higher average number of internal water molecules per monomer (28 in the G and 36 in the M) than observed in crystal structures (18 and 22, respectively). We found nine water molecules trapped and 19 diffusive inside the G-monomer, and 13 trapped and 23 diffusive inside the M-monomer. The exchange of a set of diffusive internal water molecules follows an exponential decay with a 1/e time in the order of 340 ps for the G state and 460 ps for the M state. The average residence time of a diffusive water molecule inside the protein is ∼95 ps for the G state and 110 ps for the M state. We have used the Grotthuss model to describe the possible proton transport through the hydrogen-bonded networks inside the protein, which is built up in the picosecond-to-nanosecond time domains. Comparing the water distribution and hydrogen-bonded networks of the two different states, we suggest possible pathways for proton hopping and water movement inside bR. PMID:15731388

Complex mammary carcinoma with metastases to lymph nodes, subcutaneous tissue, and multiple joints in a dog.

PubMed

McCourt, Maggie R; Dieterly, Alexandra M; Mackey, Paige E; Lyon, Shane D; Rizzi, Theresa E; Ritchey, Jerry W

2018-05-07

An 8-year-old, intact female, mixed-breed dog presented to the Oklahoma State University Boren Veterinary Medical Teaching Hospital for evaluation of progressive lameness and joint effusion of multiple joints. Physical examination revealed joint effusion of the elbow, hock, and stifle joints bilaterally, enlarged left axillary and right popliteal lymph nodes, a subcutaneous mass over the left elbow, and a subcutaneous mass involving the left second and third mammary glands. Cytologic examination of the mammary mass, enlarged lymph nodes, and joint fluid from most affected joints revealed a monomorphic population of loosely cohesive neoplastic epithelial cells. The patient was humanely euthanized, and subsequent necropsy with histopathologic examination revealed a complex mammary carcinoma with metastases to enlarged lymph nodes, subcutaneous tissue over the left elbow, and the synovium of multiple joints. Immunohistochemical stains were performed and showed diffusely positive pan cytokeratin, CK8/18, and CK19 staining in the neoplastic luminal epithelial cells of the mammary carcinoma, synovium, and lymph nodes, and showed diffusely positive vimentin staining of the myoepithelial cells. Myoepithelial calponin positivity was diffuse in the mammary mass and lymph nodes but minimal in the synovium. Only the mammary mass showed p63 positivity. Metastatic mammary neoplasia is relatively common in dogs; however, metastasis to the synovium has only been reported once previously in the literature. This is the first case utilizing immunohistochemistry for confirmation and characterization of metastases. © 2018 American Society for Veterinary Clinical Pathology.

Wafer scale micromachine assembly method

DOEpatents

Christenson, Todd R.

2001-01-01

A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

Joining of materials using laser heating

DOEpatents

Cockeram, Brian V.; Hicks, Trevor G.; Schmid, Glenn C.

2003-07-01

A method for diffusion bonding ceramic layers such as boron carbide, zirconium carbide, or silicon carbide uses a defocused laser beam to heat and to join ceramics with the use of a thin metal foil insert. The metal foil preferably is rhenium, molybdenum or titanium. The rapid, intense heating of the ceramic/metal/ceramic sandwiches using the defocused laser beam results in diffusive conversion of the refractory metal foil into the ceramic and in turn creates a strong bond therein.

Molecular dynamics simulation of diffusion and electrical conductivity in montmorillonite interlayers

DOE PAGES

Greathouse, Jeffery A.; Cygan, Randall T.; Fredrich, Joanne T.; ...

2016-01-20

In this study, the diffusion of water and ions in the interlayer region of smectite clay minerals represents a direct probe of the type and strength of clay–fluid interactions. Interlayer diffusion also represents an important link between molecular simulation and macroscopic experiments. Here we use molecular dynamics simulation to investigate trends in cation and water diffusion in montmorillonite interlayers, looking specifically at the effects of layer charge, interlayer cation and cation charge (sodium or calcium), water content, and temperature. For Na-montmorillonite, the largest increase in ion and water diffusion coefficients occurs between the one-layer and two-layer hydrates, corresponding to themore » transition from inner-sphere to outer-sphere surface complexes. Calculated activation energies for ion and water diffusion in Na-montmorillonite are similar to each other and to the water hydrogen bond energy, suggesting the breaking of water–water and water–clay hydrogen bonds as a likely mechanism for interlayer diffusion. A comparison of interlayer diffusion with that of bulk electrolyte solutions reveals a clear trend of decreasing diffusion coefficient with increasing electrolyte concentration, and in most cases the interlayer diffusion results are nearly coincident with the corresponding bulk solutions. Trends in electrical conductivities computed from the ion diffusion coefficients are also compared.« less

Rapid-Onset Diffuse Skeletal Fluorosis from Inhalant Abuse: A Case Report.

PubMed

Cohen, Eric; Hsu, Raymond Y; Evangelista, Peter; Aaron, Roy; Rubin, Lee E

A thirty-year-old man presented with severely debilitating left hip pain and stiffness. Radiographs demonstrated diffuse osteosclerosis and heterotopic bone formation with near ankylosis of the left hip. The patient underwent successful joint-preserving surgery to restore hip range of motion. After disclosing a history of inhalant abuse, which was confirmed by elevated serum fluoride levels, he was diagnosed with diffuse skeletal fluorosis. To the best of our knowledge, we present the first reported case of diffuse skeletal fluorosis caused by inhalant abuse of 1,1-difluoroethane. Skeletal fluorosis is uncommon in the United States but is important to consider in the differential diagnosis when a patient presents with otherwise unexplained joint pain and osteosclerosis.

CO2 diffusion in champagne wines: a molecular dynamics study.

PubMed

Perret, Alexandre; Bonhommeau, David A; Liger-Belair, Gérard; Cours, Thibaud; Alijah, Alexander

2014-02-20

Although diffusion is considered as the main physical process responsible for the nucleation and growth of carbon dioxide bubbles in sparkling beverages, the role of each type of molecule in the diffusion process remains unclear. In the present study, we have used the TIP5P and SPC/E water models to perform force field molecular dynamics simulations of CO2 molecules in water and in a water/ethanol mixture respecting Champagne wine proportions. CO2 diffusion coefficients were computed by applying the generalized Fick's law for the determination of multicomponent diffusion coefficients, a law that simplifies to the standard Fick's law in the case of champagnes. The CO2 diffusion coefficients obtained in pure water and water/ethanol mixtures composed of TIP5P water molecules were always found to exceed the coefficients obtained in mixtures composed of SPC/E water molecules, a trend that was attributed to a larger propensity of SPC/E water molecules to form hydrogen bonds. Despite the fact that the SPC/E model is more accurate than the TIP5P model to compute water self-diffusion and CO2 diffusion in pure water, the diffusion coefficients of CO2 molecules in the water/ethanol mixture are in much better agreement with the experimental values of 1.4 - 1.5 × 10(-9) m(2)/s obtained for Champagne wines when the TIP5P model is employed. This difference was deemed to rely on the larger propensity of SPC/E water molecules to maintain the hydrogen-bonded network between water molecules and form new hydrogen bonds with ethanol, although statistical issues cannot be completely excluded. The remarkable agreement between the theoretical CO2 diffusion coefficients obtained within the TIP5P water/ethanol mixture and the experimental data specific to Champagne wines makes us infer that the diffusion coefficient in these emblematic hydroalcoholic sparkling beverages is expected to remain roughly constant whathever their proportions in sugars, glycerol, or peptides.

Interfacial characterization of SLM parts in multi-material processing: Metallurgical diffusion between 316L stainless steel and C18400 copper alloy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Z.H., E-mail: AZHLIU@ntu.edu.sg; Zhang, D.Q., E-mail: ZHANGDQ@ntu.edu.sg; Sing, S.L., E-mail: SING0011@e.ntu.edu.sg

2014-08-15

Multi-material processing in selective laser melting using a novel approach, by the separation of two different materials within a single dispensing coating system was investigated. 316L stainless steel and UNS C18400 Cu alloy multi-material samples were produced using selective laser melting and their interfacial characteristics were analyzed using focused ion beam, scanning electron microscopy, energy dispersive spectroscopy and electron back scattered diffraction techniques. A substantial amount of Fe and Cu element diffusion was observed at the bond interface suggesting good metallurgical bonding. Quantitative evidence of good bonding at the interface was also obtained from the tensile tests where the fracturemore » was initiated at the copper region. Nevertheless, the tensile strength of steel/Cu SLM parts was evaluated to be 310 ± 18 MPa and the variation in microhardness values was found to be gradual along the bonding interface from the steel region (256 ± 7 HV{sub 0.1}) to the copper region (72 ± 3 HV{sub 0.1}). - Highlights: • Multi-material processing was successfully implemented and demonstrated in SLM. • Bi-metallic laminates of steel/Cu were successfully produced with the SLM process. • A substantial amount of Fe and Cu diffusion was observed at the bond interface. • Good metallurgical bonding was obtained at the interface of the steel/Cu laminates. • Highly refined microstructure was obtained due to rapid solidification in SLM.« less

Nondestructive test of regenerative chambers

NASA Technical Reports Server (NTRS)

Malone, G. A.; Stauffis, R.; Wood, R.

1972-01-01

Flat panels simulating internally cooled regenerative thrust chamber walls were fabricated by electroforming, brazing and diffusion bonding to evaluate the feasibility of nondestructive evaluation techniques to detect bonds of various strength integrities. Ultrasonics, holography, and acoustic emission were investigated and found to yield useful and informative data regarding the presence of bond defects in these structures.

Diffusion bonding of Ti-48Ni-2Mn-2Nb (at.%)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Godfrey, S.P.; Strangwood, M.; Threadgill, P.L.

The diffusion bonding behavior of Ti-48at. % Al-2at. % Mn-2at. %Nb has been studied as a function of temperature (in the range 1,200--1,350C), time (15--45 minutes) and starting microstructure (lamellar, duplex and near {gamma}) at constant bonding pressure of 10 MPa. It was found, that under the above conditions, small twin related {gamma} grains, approximately 10-20 {mu}m in size, nucleated at the original interface and grew into the matrix forming a double necklace grain structure. Particles of {alpha}{sub 2} were observed around the interface, the formation of {alpha}{sub 2} particles was believed to be related to oxygen partitioning and stabilizationmore » effects from dissolved oxide films during the bonding process. Evidence for this mechanism was obtained from parallel electron energy loss spectroscopy (PEELS), which identified oxygen partitioning in the (X2) particles. For the fully lamellar structure bonded at 1,250 C for 45 minutes the failure strength of the bond was found to be 250 MPa, approximately 50 MPa lower than the failure strength of the base material.« less

Measurement of longitudinal strain and estimation of peel stress in adhesive-bonded single-lap joint of CFRP adherend using embedded FBG sensor

NASA Astrophysics Data System (ADS)

Ning, X.; Murayama, H.; Kageyama, K.; Uzawa, K.; Wada, D.

2012-04-01

In this research, longitudinal strain and peel stress in adhesive-bonded single-lap joint of carbon fiber reinforced plastics (CFRP) were measured and estimated by embedded fiber Bragg grating (FBG) sensor. Two unidirectional CFRP substrates were bonded by epoxy to form a single-lap configuration. The distributed strain measurement system is used. It is based on optical frequency domain reflectometry (OFDR), which can provide measurement at an arbitrary position along FBG sensors with the high spatial resolution. The longitudinal strain was measured based on Bragg grating effect and the peel stress was estimated based on birefringence effect. Special manufacturing procedure was developed to ensure the embedded location of FBG sensor. A portion of the FBG sensor was embedded into one of CFRP adherends along fiber direction and another portion was kept free for temperature compensation. Photomicrograph of cross-section of specimen was taken to verify the sensor was embedded into proper location after adherend curing. The residual strain was monitored during specimen curing and adhesive joint bonding process. Tensile tests were carried out and longitudinal strain and peel stress of the bondline are measured and estimated by the embedded FBG sensor. A two-dimensional geometrically nonlinear finite element analysis was performed by ANSYS to evaluate the measurement precision.

Surface modification of polyethylene by radiation-induced grafting for adhesive bonding. V. Comparison with other surface treatments. [Gamma radiation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yamakawa, S.; Yamamoto, F.

1980-01-01

Helium gas plasma treatment of low-density polyethylene (LDPE) yields much lower peel strength than oxidative treatment using chromic acid and oxygen gas plasma. The practical adhesion, the bondability retention, and the bond durability of oxidatively treated LDPE sheets, bonded with epoxy adhesives, have been compared with those of partially hydrolyzed LDPE-methyl acrylate surface grafts. The oxidized surfaces easily lose the bondability by light rubbing with tissue paper, solvent extraction, heat aging, and artificial weathering, whereas the grafted surfaces retain the bondability. The bondability loss is due to removal of the oxidized layer, and the bondability retention is due to retentionmore » of the surface homopolymer layer. Conventional antioxidants stabilize the grafted but not the oxidized surfaces against thermal oxidative degradation. The grafted LDPE joints have much higher bond durability in humid environments than those of the oxidized LDPE joints. The dry and wet peel strengths of oxidized LDPE joints are greatly improved by application of primers consisting of a base epoxy resin and organic solvents. An adhesion mechanism involving penetration of epoxy adhesives into the oxidized layers and subsequent reinforcement of the layers by curing of the penetrated epoxy is proposed. 5 figures, 5 tables.« less

In vitro antibacterial activity of adhesive systems on Streptococcus mutans.

PubMed

Paradella, Thaís Cachuté; Koga-Ito, Cristiane Yumi; Jorge, Antonio Olavo Cardoso

2009-04-01

To evaluate the antibacterial activity of three adhesive systems -- Prime & Bond 2.1 (PB), Clearfil SE Bond (CS) and One Up Bond F (OU) -- on Streptococcus mutans in vitro. Adherence and agar disk-diffusion tests were performed. For the adherence testing, 40 human enamel specimens (4 mm2) were sterilized and the adhesive sytems were applied (n = 10). The control group did not receive the application of any adhesive system. Specimens were immersed in brain heart infusion broth (BHI) inoculated with S. mutans standardized suspension (10(6) cells/ml) for 48 h at 37 degrees C and 5% CO2. The number of S. mutans cells adhered to each specimen was evaluated by the plating method on BHI agar. For agar disk-diffusion testing, adhesive disks and disks soaked in distilled water (negative control) or 0.2% chlorexidine (positive control) were incubated with S. mutans for 48 h. The diameters of the zones of bacterial inhibition were measured. Adherence data were transformed in logarithms of base 10 (log10). Data were submitted to Kruskal-Wallis and Student-Neuman-Keuls tests at the 5% level of significance. The results of the adherence test showed that One Up Bond F (OU) and Clearfil SE Bond (CS) did not differ significantly from one another, but allowed significantly less adherence than Prime & Bond 2.1 (PB) and control [mean log10 (standard deviation) values: PB 6.10 (0.19); CS primer 4.55 (0.98); OU 4.65 (0.54); control group 6.34 (0.27)]. The disk-diffusion test showed no significant difference between OU (diameter in mm: 3.02 +/- 0.13) and CS (3.0 +/- 0.12), but both were significantly more effective in inhibiting bacterial growth than PB (1.0 +/- 0.10). The self-etching systems Clearfil SE Bond and One Up Bond F presented a greater inhibitory effect against S. mutans, also in terms of adherence, than did the conventional system, Prime & Bond 2.1.

Solute-solvent complex switching dynamics of chloroform between acetone and dimethylsulfoxide-two-dimensional IR chemical exchange spectroscopy.

PubMed

Kwak, Kyungwon; Rosenfeld, Daniel E; Chung, Jean K; Fayer, Michael D

2008-11-06

Hydrogen bonds formed between C-H and various hydrogen bond acceptors play important roles in the structure of proteins and organic crystals, and the mechanisms of C-H bond cleavage reactions. Chloroform, a C-H hydrogen bond donor, can form weak hydrogen-bonded complexes with acetone and with dimethylsulfoxide (DMSO). When chloroform is dissolved in a mixed solvent consisting of acetone and DMSO, both types of hydrogen-bonded complexes exist. The two complexes, chloroform-acetone and chloroform-DMSO, are in equilibrium, and they rapidly interconvert by chloroform exchanging hydrogen bond acceptors. This fast hydrogen bond acceptor substitution reaction is probed using ultrafast two-dimensional infrared (2D-IR) vibrational echo chemical exchange spectroscopy. Deuterated chloroform is used in the experiments, and the 2D-IR spectrum of the C-D stretching mode is measured. The chemical exchange of the chloroform hydrogen bonding partners is tracked by observing the time-dependent growth of off-diagonal peaks in the 2D-IR spectra. The measured substitution rate is 1/30 ps for an acetone molecule to replace a DMSO molecule in a chloroform-DMSO complex and 1/45 ps for a DMSO molecule to replace an acetone molecule in a chloroform-acetone complex. Free chloroform exists in the mixed solvent, and it acts as a reactive intermediate in the substitution reaction, analogous to a SN1 type reaction. From the measured rates and the equilibrium concentrations of acetone and DMSO, the dissociation rates for the chloroform-DMSO and chloroform-acetone complexes are found to be 1/24 ps and 1/5.5 ps, respectively. The difference between the measured rate for the complete substitution reaction and the rate for complex dissociation corresponds to the diffusion limited rate. The estimated diffusion limited rate agrees well with the result from a Smoluchowski treatment of diffusive reactions.

Elastic constants for superplastically formed/diffusion-bonded corrugated sandwich core

NASA Technical Reports Server (NTRS)

Ko, W. L.

1980-01-01

Formulas and associated graphs for evaluating the effective elastic constants for a superplastically formed/diffusion bonded (SPF/DB) corrugated sandwich core, are presented. A comparison of structural stiffnesses of the sandwich core and a honeycomb core under conditions of equal sandwich core density was made. The stiffness in the thickness direction of the optimum SPF/DB corrugated core (that is, triangular truss core) is lower than that of the honeycomb core, and that the former has higher transverse shear stiffness than the latter.

Bonding Strength Properties of Adhesively-Timber Joint with Thixotropic and Room Temperature Cured Epoxy Based Adhesive Reinforced with Nano- and Micro-particles

NASA Astrophysics Data System (ADS)

Ahmad, Z.; Ansell, M. P.; Smedley, D.

2011-02-01

This research work is concerned with in situ bonded-in timber connection using pultruded rod; where the manufacturing of such joint requires adhesive which can produce thick glue-lines and does not allow any use of pressure and heat. Four types of thixotropic (for ease application) and room temperature cured epoxy based were used namely CB10TSS (regarded as standards adhesive), Nanopox (modification of CB10TSS with addition of nanosilica), Albipox (modification of CB10TSS with addition of liquid rubber) and Timberset (an epoxy-based adhesive with addition of micro-size ceramic particles). The quality of the adhesive bonds was accessed using block shear test in accordance with ASTM D905. The bond strength depends on how good the adhesive wet the timber surface. Therefore the viscosity and contact angle was also measured. The nano- and microfiller additions increased the bond strength significantly. The viscosity correlates well with contact angle measurements where lower viscosities are associated with lower contact angles. However contact angle contradicts with measured strength and wettability.

Energy efficient engine shroudless, hollow fan blade technology report

NASA Technical Reports Server (NTRS)

Michael, C. J.

1981-01-01

The Shroudless, Hollow Fan Blade Technology program was structured to support the design, fabrication, and subsequent evaluation of advanced hollow and shroudless blades for the Energy Efficient Engine fan component. Rockwell International was initially selected to produce hollow airfoil specimens employing the superplastic forming/diffusion bonding (SPF/DB) fabrication technique. Rockwell demonstrated that a titanium hollow structure could be fabricated utilizing SPF/DB manufacturing methods. However, some problems such as sharp internal cavity radii and unsatisfactory secondary bonding of the edge and root details prevented production of the required quantity of fatigue test specimens. Subsequently, TRW was selected to (1) produce hollow airfoil test specimens utilizing a laminate-core/hot isostatic press/diffusion bond approach, and (2) manufacture full-size hollow prototype fan blades utilizing the technology that evolved from the specimen fabrication effort. TRW established elements of blade design and defined laminate-core/hot isostatic press/diffusion bonding fabrication techniques to produce test specimens. This fabrication technology was utilized to produce full size hollow fan blades in which the HIP'ed parts were cambered/twisted/isothermally forged, finish machined, and delivered to Pratt & Whitney Aircraft and NASA for further evaluation.

Bonding thermoplastic polymers

DOEpatents

Wallow, Thomas I [Fremont, CA; Hunter, Marion C [Livermore, CA; Krafcik, Karen Lee [Livermore, CA; Morales, Alfredo M [Livermore, CA; Simmons, Blake A [San Francisco, CA; Domeier, Linda A [Danville, CA

2008-06-24

We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.

Joining of polypropylene/polypropylene and glass fiber reinforced polypropylene composites

NASA Astrophysics Data System (ADS)

Zhang, Jianguang

Joining behavior of polypropylene (PP) to PP and long glass fiber reinforced polypropylene (LFT) to LFT were investigated. Adhesive bonding was used to join PP/PP. Both adhesive bonding and ultrasonic welding were used to join LFT/LFT. Single-lap shear testing and low velocity impact (LVI) testing were used to evaluate the performance of bonded structures. The two-part acrylic adhesive DP8005 was determined to be the best among the three adhesive candidates, which was attributed to its low surface energy. The impact resistance of LFT/LFT joints, normalized with respect to thickness, was higher than that of PP/PP joints because of higher stiffness of LFT/LFT joints. The stress states in the adhesive layer of adhesively bonded structures were analyzed using ANSYS and LS-DYNA to simulate the single-lap shear testing and LVI testing, respectively. The shear and peel stresses peaked at the edges of the adhesive layer. Compared to LFT/LFT joints, higher peel stress occurred in the adhesive layer in the PP/PP joints in tension. Impact response of adhesively bonded structures as evaluated by LS-DYNA showed good agreement with the experimental results. The effect of weld time and weld pressure on the shear strength of ultrasonically welded LFT/LFT was evaluated. With higher weld pressure, less time was required to obtain a complete weld. At longer weld times, lower weld pressure was required. From the 15 weld conditions studied, a weld map was obtained that provides conditions to achieve a complete weld. Nanoindentation was used to evaluate the effect of ultrasonic weld on the modulus and hardness of the PP matrix. Modulus and hardness of the PP matrix were slightly decreased by ultrasonic welding possibly due to the decrease in the molecular weight. The temperature profile in LFT/LFT in the transverse direction during ultrasonic welding was analyzed by two ANSYS-based thermal models: (a) one in which heat generated by interfacial friction was treated as a heat flux and (b) one in which heat was generated in a thin slab at the interface. The weld map obtained from the thin slab model was closer to the one obtained experimentally.

Laser Indirect Shock Welding of Fine Wire to Metal Sheet

PubMed Central

Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

2017-01-01

The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent. PMID:28895900

Brazing process provides high-strength bond between aluminum and stainless steel

NASA Technical Reports Server (NTRS)

Huschke, E. G., Jr.; Nord, D. B.

1966-01-01

Brazing process uses vapor-deposited titanium and an aluminum-zirconium-silicon alloy to prevent formation of brittle intermetallic compounds in stainless steel and aluminum bonding. Joints formed by this process maintain their high strength, corrosion resistance, and hermetic sealing properties.

Subcontract Report: Diffusion Mechanisms and Bond Dynamics in Solid Electrolyte Ion-Conductors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zevgolis, A.; Hall, A.; Alvez, T.

2017-10-03

We employ first-principles molecular dynamics simulations and Maximally Localized Wannier Function (MLWF) analysis to explore how halide substitution and nano-phase microstructures affect diffusivity, through the activation energy barrier - E a and D 0, in the solid electrolyte Li 3InBr 6-xCl x. We find that nano-phase microstructures with x=3 (50-50 Br-Cl) mixed composition have a higher diffusivity compared to x=2 and x=3 solid solutions. There is a positive linear relationship between ln(D 0.) and E a, which suggests that for superionic conductivity optimizing both the activation energy and the D 0 is important. Bond frustration due to mismatch in crystalmore » geometry and ideal coordination number leads to especially high diffusivity through a high D 0 in the x=3 composition.« less

The role of hypothetico-deductive reasoning and physical analogues of molecular interactions in conceptual change

NASA Astrophysics Data System (ADS)

Lawson, Anton E.; Baker, William P.; Didonato, Lisa; Verdi, Michael P.; Johnson, Margaret A.

Two hypotheses about theoretical concept acquisition, application, and change were tested. College biology students classified as intuitive, transitional, or reflective (hypothetico-deductive) reasoners were first taught two theoretical concepts (molecular polarity and bonding) to explain the mixing of dye with water, but not with oil, when all three were shaken in a container. The students were then tested in a context in which they misapplied the concepts in an attempt to explain the gradual spread of blue dye in standing water. Next students were taught another theoretical concept (diffusion), with and without the use of physical analogues. They were retested to see which students acquired the concept of diffusion and which students changed from use of the incorrect polarity and bonding concepts (i.e., the misconceptions) to use of the diffusion concept to correctly explain the dye's gradual spread. As predicted, the experimental/analogy group scored significantly higher than the control group on a posttest question that required the definition of diffusion. Also as predicted, hypothetico-deductive reasoning skill was significantly related to correct application of the diffusion concept and to a change from the misapplication of the polarity and bonding concepts to the correct application of the diffusion concept to explain the gradual spread of the blue dye. Thus, the results support the hypotheses that physical analogues are helpful in theoretical concept acquisition and that hypothetico-deductive reasoning is needed for successful concept application and change. Educational implications are drawn.

Understanding Lithium Solvation and Diffusion through Topological Analysis of First-Principles Molecular Dynamics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bhatia, Harsh; Gyulassy, Attila; Ong, Mitchell

2016-09-27

The performance of lithium-ion batteries is strongly influenced by the ionic conductivity of the electrolyte, which depends on the speed at which Li ions migrate across the cell and relates to their solvation structure. The choice of solvent can greatly impact, both, the solvation and diffusivity of Li ions. In this work, we present our application of the topological techniques to extract and predict such behavior in the data generated by the first-principles molecular dynamics simulation of Li ions in an important organic solvent -ethylene carbonate. More specifically, we use the scalar topology of the electron charge density field tomore » analyze the evolution of the solvation structures. This allows us to derive a parameter-free bond definition for lithium-oxygen bonds, to provide a quantitative measure for bond strength, and to understand the regions of influence of each atom in the simulation. This has provided new insights into how and under what conditions certain bonds may form and break. As a result, we can identify and, more importantly, predict, unstable configurations in solvation structures. This can be very useful in understanding when small changes to the atoms' movements can cause significantly different bond structures to evolve. Ultimately, this promises to allow scientists to explore lithium ion solvation and diffusion more systematically, with the aim of new insights and potentially accelerating the calculations themselves.« less

Solid state diffusion bonded damascus steel and its role within custom knifemaking

NASA Astrophysics Data System (ADS)

Horne, Grace

This thesis describes practice-based research that applied new technology to an ancient process of laminating metals for blades and explored the application of the new possibilities to a craft context. This research built on work by Ferguson on solid-state diffusion bonded Mokume Gane by moving from metal combinations suitable for vessel-making to metal combinations suitable for knife-making. Solid-state diffusion bonding1 is well established within industry. This research applied the industrial process to a craft based setting, and explored the bonding of metals with very dissimilar properties; ferrous and non-ferrous metals, hard and soft, high and low melting points. The materials included in this study were stainless and carbon steel, iron, nickel, vanadium and silver. The characteristics of the carbon steel and silver laminates were explored further by knifemakers, including heat-treating, forging, machining, flex and pattern creation. Analysis of the knifemakers feedback showed that the steel/silver metal was of interest to makers who machined or ground their blades rather than relying on forging.The study used a multi-method approach. The two broad researchquestions were; Is it possible to make a damascus steel using solid-state diffusion bonding that would be impossible using traditional techniques? And would the results be worth the work? Although carried out mainly within a craft setting the investigation is highly metallurgical in subject matter. The methodology was developed to reflect this crossing of subject areas and answer the research questions outlined above. The results are communicated through this thesis and a documentation of an exhibition of the work produced by the researcher and other selected knifemakers.The research produced a coherent composite of steel and pure silver and successfully produced a number of knives using the material.

Pyridine adsorption and diffusion on Pt(111) investigated with density functional theory

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kolsbjerg, Esben L.; Groves, Michael N.; Hammer, Bjørk, E-mail: hammer@phys.au.dk

2016-04-28

The adsorption, diffusion, and dissociation of pyridine, C{sub 5}H{sub 5}N, on Pt(111) are investigated with van der Waals-corrected density functional theory. An elaborate search for local minima in the adsorption potential energy landscape reveals that the intact pyridine adsorbs with the aromatic ring parallel to the surface. Piecewise interconnections of the local minima in the energy landscape reveal that the most favourable diffusion path for pyridine has a barrier of 0.53 eV. In the preferred path, the pyridine remains parallel to the surface while performing small single rotational steps with a carbon-carbon double bond hinged above a single Pt atom.more » The origin of the diffusion pathway is discussed in terms of the C{sub 2}–Pt π-bond being stronger than the corresponding CN–Pt π-bond. The energy barrier and reaction enthalpy for dehydrogenation of adsorbed pyridine into an adsorbed, upright bound α-pyridyl species are calculated to 0.71 eV and 0.18 eV, respectively (both zero-point energy corrected). The calculations are used to rationalize previous experimental observations from the literature for pyridine on Pt(111).« less

Finger jointing green southern yellow pine with a soy-based adhesive

Treesearch

Philip H. Steele; Roland E. Kreibicha; Petrus J. Steynberg; Richard W. Hemingway

1998-01-01

The authors present results of laboratory tests for a soy-based adhesive to bond southern yellow pine using the finger-jointing method. There was some reason to suspect that finger jointing of southern yellow pine (SYP) with the honeymoon system using soy-based adhesive might prove more difficult than for western species. The Wood Handbook classes western species in...

Effects of surface preparation on the long-term durability of adhesively bonded composite joints

NASA Astrophysics Data System (ADS)

Bardis, Jason Dante

The long-term durability of adhesively bonded composite joints is critical to modern aircraft structures, which are increasingly adopting bonding as an alternative option to mechanical fastening. The effects of the surface preparation of the adherends are critical, affecting initial strength, long-term durability, fracture toughness, and failure modes of bonded joints. In this study, several potential factors are evaluated, with focus on the following: (1) Effects of possible chemical contamination from release fabrics, release films, and peel plies during adherend cure. (2) Chemical and mechanical effects of abrasion on the fracture toughness and failure mode. (3) Characterization of paste and film adhesives. There are several standard test methods used to evaluate specimen fracture, but the majority concentrate on bonded metals and interlaminar composite fracture. Testing concentrated on mode I tests; a custom double cantilever beam specimen was devised and utilized, and two forms of a wedge crack test (traveling and static) were also used. Additionally, single lap shear tests were run to contrast the mode I tests. Non-destructive testing included X-ray photography of crack fronts, energy dispersive spectroscopy and X-ray photoelectron spectroscopy surface chemistry analyses, and scanning electron microscope imaging of prepared surfaces. All mode I test methods tended to be in agreement in the ranking of different surface preparation methods. Test results revealed that release agents deposited on adherend surfaces during their cure cycle prevented proper adhesion. While mechanical abrasion did improve their fracture toughness and lower their contamination greatly, the test values did not reach the levels of samples that were not contaminated before bonding, and the interfacial modes of failure did not always change to desirable modes.

Technical and Economical Aspects of Current Thermal Barrier Coating Systems for Gas Turbine Engines by Thermal Spray and EBPVD: A Review

NASA Astrophysics Data System (ADS)

Feuerstein, Albert; Knapp, James; Taylor, Thomas; Ashary, Adil; Bolcavage, Ann; Hitchman, Neil

2008-06-01

The most advanced thermal barrier coating (TBC) systems for aircraft engine and power generation hot section components consist of electron beam physical vapor deposition (EBPVD) applied yttria-stabilized zirconia and platinum modified diffusion aluminide bond coating. Thermally sprayed ceramic and MCrAlY bond coatings, however, are still used extensively for combustors and power generation blades and vanes. This article highlights the key features of plasma spray and HVOF, diffusion aluminizing, and EBPVD coating processes. The coating characteristics of thermally sprayed MCrAlY bond coat as well as low density and dense vertically cracked (DVC) Zircoat TBC are described. Essential features of a typical EBPVD TBC coating system, consisting of a diffusion aluminide and a columnar TBC, are also presented. The major coating cost elements such as material, equipment and processing are explained for the different technologies, with a performance and cost comparison given for selected examples.

Random walks on cubic lattices with bond disorder

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ernst, M.H.; van Velthoven, P.F.J.

1986-12-01

The authors consider diffusive systems with static disorder, such as Lorentz gases, lattice percolation, ants in a labyrinth, termite problems, random resistor networks, etc. In the case of diluted randomness the authors can apply the methods of kinetic theory to obtain systematic expansions of dc and ac transport properties in powers of the impurity concentration c. The method is applied to a hopping model on a d-dimensional cubic lattice having two types of bonds with conductivity sigma and sigma/sub 0/ = 1, with concentrations c and 1-c, respectively. For the square lattice the authors explicitly calculate the diffusion coefficient D(c,sigma)more » as a function of c, to O(c/sup 2/) terms included for different ratios of the bond conductivity sigma. The probability of return at long times is given by P/sub 0/(t) approx. (4..pi..D(c,sigma)t)/sup -d/2/, which is determined by the diffusion coefficient of the disordered system.« less

Joining of Silicon Carbide Through the Diffusion Bonding Approach

NASA Technical Reports Server (NTRS)

Halbig, Michael .; Singh, Mrityunjay

2009-01-01

In order for ceramics to be fully utilized as components for high-temperature and structural applications, joining and integration methods are needed. Such methods will allow for the fabrication the complex shapes and also allow for insertion of the ceramic component into a system that may have different adjacent materials. Monolithic silicon carbide (SiC) is a ceramic material of focus due to its high temperature strength and stability. Titanium foils were used as an interlayer to form diffusion bonds between chemical vapor deposited (CVD) SiC ceramics with the aid of hot pressing. The influence of such variables as interlayer thickness and processing time were investigated to see which conditions contributed to bonds that were well adhered and crack free. Optical microscopy, scanning electron microscopy, and electron microprobe analysis were used to characterize the bonds and to identify the reaction formed phases.

Heat insulating device for low temperature liquefied gas storage tank

DOE Office of Scientific and Technical Information (OSTI.GOV)

Okamoto, T.; Nishimoto, T.; Sawada, K.

1978-05-02

Hitachi Shipbuilding and Engineering Co., Ltd.'s insulation method for spherical LNG containers solves various problems associated with insulating a sphere's three-dimensional curved surface; equalizing the thickness of the insulation, insulating the junctions between insulation blocks, and preventing seawater or LNG from penetrating the insulation barrier in the event of a rupture in the tank and ship's hull. The design incorporates a number of blocks or plates of rigid foam-insulating material bonded to the outer wall; seats for receiving pressing jigs for the bonding operation are secured to the outer wall in the joints between the insulating blocks. The joints aremore » filled with soft synthetic foam (embedding the seats), a moistureproof layer covers the insulating blocks and joints, and a waterproof material covers the moistureproof layer.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rabin, B.H.

This paper reports on a ceramic joining technique that has been developed that utilizes an exothermic combustion reaction to simultaneously synthesize the joint interlayer material and to bond together the ceramic workpieces. The method has been used to join SiC ceramics using Ti-C-Ni powder mixtures that ignite below 1200{degrees} C to form a TiC-Ni joining material. Thin layers of the powder reactants were prepared by tape casting, and joining was accomplished by heating in a hot-press to ignite the combustion reaction. during this process, localized exothermic heating of the joint region resulted in chemical interaction at the interface between themore » TiC-Ni and the SiC ceramic that contributed to bonding. Room-temperature four-point bending strengths of joints produced by this method have exceeded 100 MPa.« less

Strength and Performance Enhancement of Bonded Joints by Spatial Tailoring of Adhesive Compliance via 3D Printing.

PubMed

Kumar, S; Wardle, Brian L; Arif, Muhamad F

2017-01-11

Adhesive bonding continues to emerge as a preferred route for joining materials with broad applications including advanced structures, microelectronics, biomedical systems, and consumer goods. Here, we study the mechanics of deformation and failure of tensile-loaded single-lap joints with a compliance-tailored adhesive. Tailoring of the adhesive compliance redistributes stresses and strains to reduce both shear and peel concentrations at the ends of the adhesive that determine failure of the joint. Utilizing 3D printing, the modulus of the adhesive is spatially varied along the bondlength. Experimental strength testing, including optical strain mapping, reveals that the strain redistribution results in a greater than 100% increase in strength and toughness concomitant with a 50% increase in strain-to-break while maintaining joint stiffness. The tailoring demonstrated here is immediately realizable in a broad array of 3D printing applications, and the level of performance enhancement suggests that compliance tailoring of the adhesive is a generalizable route for achieving superior performance of joints in other applications, such as advanced structural composites.

Consistent Structural Integrity and Efficient Certification with Analysis. Volume 3: Appendices of Verification and Validation Examples, Correlation Factors, and Failure Criteria

DTIC Science & Technology

2005-05-01

TANK WALL.........................74 6 VERIFICATION - BONDED JOINT HOMOGENOUS ISOTROPIC AND ORTHOTROPIC DELALE & ERDOGAN PUBLICATION (SIX EXAMPLES...developed for verification of BondJo 87 6.3.2 Adhesive stress comparisons between BondJo, Ansys solid model FEA and Delale and Erdogan plate theory 88...comparisons for condition 1 91 6.3.6 Adhesive stress comparisons between BondJo, Ansys solid model FEA and Delale and Erdogan plate theory 92 x FIGURE

Adhesive bonding and the use of corrosion resistant primers. [for metal surface preparation

NASA Technical Reports Server (NTRS)

Hockridge, R. R.; Thibault, H. G.

1972-01-01

The use of an anti-corrosive primer has been shown to be essential to assure survival of a bonded structure in a hostile environment, particularly if a stress is to be applied to the adhesively bonded joint during the environmental exposure. For example, the Lockheed L-1011 TriStar assembly, after exhaustive evaluation tests specifies use of chromate filled inhibitive polysulfide sealants, and use of corrosion inhibiting adhesive primers prior to structural bonding with film adhesive.

Reaction layer characterization of the braze joint of silicon nitride to stainless steel

NASA Astrophysics Data System (ADS)

Xu, R.; Indacochea, J. E.

1994-10-01

This investigation studies the role of titanium in the development of the reaction layer in braze joining silicon nitride to stainless steel using titanium-active copper-silver filler metals. This reaction layer formed as a result of titanium diffusing to the filler metal/silicon nitride interface and reacting with the silicon nitride to form the intermetallics, titanium nitride (TiN) and titanium suicide (Ti 5Si3). This reaction layer, as recognized in the literature, allows wetting of the ceramic substrate by the molten filler metal. The reaction layer thickness increases with temperature and time. Its growth rate obeys the parabolic relationship. Activation energies of 220.1 and 210.9 kj/mol were calculated for growth of the reaction layer for the two filler metals used. These values are close to the activation energy of nitrogen in TiN (217.6 kj/mol). Two filler metals were used in this study, Ticusil (68.8 wt% Ag, 26.7 wt% Cu, 4.5 wt% Ti) and CB4 (70.5 wt% Ag, 26.5 wt% Cu, 3.0 wt% Ti). The joints were processed in vacuum at temperatures of 840 to 900 °C at various times. Bonding strength is affected by reaction layer thickness in the absence of Ti-Cu intermetallics in the filler metal matrix.

Review of Graphene as a Solid State Diffusion Barrier.

PubMed

Morrow, Wayne K; Pearton, Stephen J; Ren, Fan

2016-01-06

Conventional thin-film diffusion barriers consist of 3D bulk films with high chemical and thermal stability. The purpose of the barrier material is to prevent intermixing or penetration from the two materials that encase it. Adhesion to both top and bottom materials is critical to the success of the barrier. Here, the effectiveness of a single atomic layer of graphene as a solid-state diffusion barrier for common metal schemes used in microelectronics is reviewed, and specific examples are discussed. Initial studies of electrical contacts to graphene show a distinct separation in behavior between metallic groups that strongly or weakly bond to it. The two basic classes of metal reactions with graphene are either physisorbed metals, which bond weakly with graphene, or chemisorbed metals, which bond strongly to graphene. For graphene diffusion barrier testing on Si substrates, an effective barrier can be achieved through the formation of a carbide layer with metals that are chemisorbed. For physisorbed metals, the barrier failure mechanism is loss of adhesion at the metal–graphene interface. A graphene layer encased between two metal layers, in certain cases, can increase the binding energy of both films with graphene, however, certain combinations of metal films are detrimental to the bonding with graphene. While the prospects for graphene's future as a solid-state diffusion barrier are positive, there are open questions, and areas for future research are discussed. A better understanding of the mechanisms which influence graphene's ability to be an effective diffusion barrier in microelectronic applications is required, and additional experiments are needed on a broader range of metals, as well as common metal stack contact structures used in microelectronic applications. The role of defects in the graphene is also a key area, since they will probably influence the barrier properties. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Nonideality in diffusion of ionic and hydrophobic solutes and pair dynamics in water-acetone mixtures of varying composition.

PubMed

Gupta, Rini; Chandra, Amalendu

2007-07-14

We have performed a series of molecular dynamics simulations of water-acetone mixtures containing either an ionic solute or a neutral hydrophobic solute to study the extent of nonideality in the dynamics of these solutes with variation of composition of the mixtures. The diffusion coefficients of the charged solutes, both cationic and anionic, are found to change nonmonotonically with the composition of the mixtures showing strong nonideality of their dynamics. Also, the extent of nonideality in the diffusion of these charged solutes is found to be similar to the nonideality that is observed for the diffusion and orientational relaxation of water and acetone molecules in these mixtures which show a somewhat similar changes in the solvation characteristics of charged and dipolar solutes with changes of composition of water-acetone mixtures. The diffusion of the hydrophobic solute, however, shows a monotonic increase with increase of acetone concentration showing its different solvation characteristics as compared to the charged and dipolar solutes. The links between the nonideality in diffusion and solvation structures are further confirmed through calculations of the relevant solute-solvent and solvent-solvent radial distribution functions for both ionic and hydrophobic solutes. We have also calculated various pair dynamical properties such as the relaxation of water-water and acetone-water hydrogen bonds and residence dynamics of water molecules in water and acetone hydration shells. The lifetimes of both water-water and acetone-water hydrogen bonds and also the residence times of water molecules are found to increase steadily with increase in acetone concentration. No maximum or minimum was found in the composition dependence of these pair dynamical quantities. The lifetimes of water-water hydrogen bonds are always found to be longer than that of acetone-water hydrogen bonds in these mixtures. The residence times of water molecules are also found to follow a similar trend.

Effects of Sn Layer Orientation on the Evolution of Cu/Sn Interfaces

NASA Astrophysics Data System (ADS)

Sun, Menglong; Zhao, Zhangjian; Hu, Fengtian; Hu, Anmin; Li, Ming; Ling, Huiqin; Hang, Tao

2018-03-01

The effects of Sn layer orientation on the evolution of Cu/Sn joint interfaces were investigated. Three Sn layers possessing (112), (321) and (420) orientations were electroplated on polycrystalline Cu substrates respectively. The orientations of Sn layer preserved during reflowing at 250 °C for 10 s. After aging at 150 °C for different time, the interfacial microstructures were observed from the cross-section and top-view. The alignment between the c-axis of Sn and Cu diffusion direction significantly sped up the Cu diffusion, leading to the thickest intermetallic compound layer formed in (112) joint. Two types of voids, namely, intracrystalline voids and grain islanding caused intercrystalline voids generated at Cu/Cu3Sn interfaces due to the different interdiffusion coefficients of Cu and Sn (112) oriented Sn/Cu joint produced many more voids than (321) joint, and no voids were detected in (420) joint. Therefore, to enhance the reliability of solder joints, using (420) oriented Sn as solder layer could be an efficient way.

The molecular basis of the solution properties of hyaluronan investigated by confocal fluorescence recovery after photobleaching.

PubMed Central

Gribbon, P; Heng, B C; Hardingham, T E

1999-01-01

Hyaluronan (HA) is a highly hydrated polyanion, which is a network-forming and space-filling component in the extracellular matrix of animal tissues. Confocal fluorescence recovery after photobleaching (confocal-FRAP) was used to investigate intramolecular hydrogen bonding and electrostatic interactions in hyaluronan solutions. Self and tracer lateral diffusion coefficients within hyaluronan solutions were measured over a wide range of concentrations (c), with varying electrolyte and at neutral and alkaline pH. The free diffusion coefficient of fluoresceinamine-labeled HA of 500 kDa in PBS was 7.9 x 10(-8) cm(2) s(-1) and of 830 kDa HA was 5.6 x 10(-8) cm(2) s(-1). Reductions in self- and tracer-diffusion with c followed a stretched exponential model. Electrolyte-induced polyanion coil contraction and destiffening resulted in a 2.8-fold increase in self-diffusion between 0 and 100 mM NaCl. Disruption of hydrogen bonds by strong alkali (0.5 M NaOH) resulted in further larger increases in self- and tracer-diffusion coefficients, consistent with a more dynamic and permeable network. Concentrated hyaluronan solution properties were attributed to hydrodynamic and entanglement interactions between domains. There was no evidence of chain-chain associations. At physiological electrolyte concentration and pH, the greatest contribution to the intrinsic stiffness of hyaluronan appeared to be due to hydrogen bonds between adjacent saccharides. PMID:10512840

Solder extrusion pressure bonding process and bonded products produced thereby

DOEpatents

Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

1992-01-01

Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Solder extrusion pressure bonding process and bonded products produced thereby

NASA Astrophysics Data System (ADS)

Beavis, L. C.; Karnowsky, M. M.; Yost, F. G.

1990-04-01

The production of soldered joints are highly reliable and capable of surviving 10,000 thermal cycles between about -40 and 110 C. The process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

AFWAL FY80 Technical Accomplishments Report.

DTIC Science & Technology

1981-12-01

through cooperative effort of the Materials and Certain compositions in the titanium aluminide Propulsion Laboratories. In addition to an extensive system...Bonded Structures Technology Transitioned .................................................. 43 Superplastically Formed and Diffusion Bonded Titanium ...Technology ................................................................................................. 75 First RSR Radial Wafer Blade Engine Test

Joining Forces

ERIC Educational Resources Information Center

Kennedy, Mike

2006-01-01

As education institutions more readily pursue stronger connections with the entire community, joint-use programs allow them to forge those bonds more effectively--providing entire communities with more access to facilities and services, often critically needed in some areas, and more efficient use of tax funds. Through joint-use agreements,…

Mechanical and Functional Properties of Nickel Titanium Adhesively Bonded Joints

NASA Astrophysics Data System (ADS)

Niccoli, F.; Alfano, M.; Bruno, L.; Furgiuele, F.; Maletta, C.

2014-07-01

In this study, adhesive joints made up of commercial NiTi sheets with shape memory capabilities are analyzed. Suitable surface pre-treatments, i.e., degreasing, sandblasting, and chemical etching, are preliminary compared in terms of surface roughness, surface energy, and substrate thinning. Results indicate that chemical etching induces marked substrate thinning without substantial gains in terms of surface roughness and free energy. Therefore, adhesive joints with degreased and sandblasted substrates are prepared and tested under both static and cyclic conditions, and damage development within the adhesive layer is monitored in situ using a CCD camera. Sandblasted specimens have a significantly higher mechanical static strength with respect to degreased ones, although they essentially fail in similar fashion, i.e., formation of microcracks followed by decohesion along the adhesive/substrate interface. In addition, the joints show a good functional response with almost complete shape memory recovery after thermo-mechanical cycling, i.e., a small accumulation of residual deformations occurs. The present results show that adhesive bonding is a viable joining technique for NiTi alloys.

Stochastic mechanics of reciprocal diffusions

NASA Astrophysics Data System (ADS)

Levy, Bernard C.; Krener, Arthur J.

1996-02-01

The dynamics and kinematics of reciprocal diffusions were examined in a previous paper [J. Math. Phys. 34, 1846 (1993)], where it was shown that reciprocal diffusions admit a chain of conservation laws, which close after the first two laws for two disjoint subclasses of reciprocal diffusions, the Markov and quantum diffusions. For the case of quantum diffusions, the conservation laws are equivalent to Schrödinger's equation. The Markov diffusions were employed by Schrödinger [Sitzungsber. Preuss. Akad. Wiss. Phys. Math Kl. 144 (1931); Ann. Inst. H. Poincaré 2, 269 (1932)], Nelson [Dynamical Theories of Brownian Motion (Princeton University, Princeton, NJ, 1967); Quantum Fluctuations (Princeton University, Princeton, NJ, 1985)], and other researchers to develop stochastic formulations of quantum mechanics, called stochastic mechanics. We propose here an alternative version of stochastic mechanics based on quantum diffusions. A procedure is presented for constructing the quantum diffusion associated to a given wave function. It is shown that quantum diffusions satisfy the uncertainty principle, and have a locality property, whereby given two dynamically uncoupled but statistically correlated particles, the marginal statistics of each particle depend only on the local fields to which the particle is subjected. However, like Wigner's joint probability distribution for the position and momentum of a particle, the finite joint probability densities of quantum diffusions may take negative values.

Reflexion measurements for inverse characterization of steel diffusion bond mechanical properties

NASA Astrophysics Data System (ADS)

Le Bourdais, Florian; Cachon, Lionel; Rigal, Emmanuel

2017-02-01

The present work describes a non-destructive testing method aimed at securing high manufacturing quality of the innovative compact heat exchanger developed under the framework of the CEA R&D program dedicated to the Advanced Sodium Technological Reactor for Industrial Demonstration (ASTRID). The heat exchanger assembly procedure currently proposed involves high temperature and high pressure diffusion welding of stainless steel plates. The aim of the non-destructive method presented herein is to characterize the quality of the welds obtained through this assembly process. Based on a low-frequency model developed by Baik and Thompson [1], pulse-echo normal incidence measurements are calibrated according to a specific procedure and allow the determination of the welding interface stiffness using a nonlinear fitting procedure in the frequency domain. Performing the characterization of plates after diffusion welding using this method allows a useful assessment of the material state as a function of the diffusion bonding process.

Influence of Cholesterol on the Dynamics of Hydration in Phospholipid Bilayers.

PubMed

Elola, M Dolores; Rodriguez, Javier

2018-06-07

We investigate the dynamics of interfacial waters in dipalmitoylphosphatidylcholine (DPPC) bilayers upon the addition of cholesterol, by molecular dynamics simulations. Our data reveal that the inclusion of cholesterol modifies the membrane aqueous interfacial dynamics: waters diffuse faster, their rotational decay time is shorter, and the DPPC/water hydrogen bond dynamics relaxes faster than in the pure DPPC membrane. The observed acceleration of the translational water dynamics agrees with recent experimental results, in which, by means of NMR techniques, an increment of the surface water diffusivity is measured upon the addition of cholesterol. A microscopic analysis of the lipid/water hydrogen bond network at the interfacial region suggests that the mechanism underlying the observed water mobility enhancement is given by the rupture of a fraction of interlipid water bridge hydrogen bonds connecting two different DPPC molecules, concomitant to the formation of new lipid/solvent bonds, whose dynamics is faster than that of the former. The consideration of a simple two-state model for the decay of the hydrogen bond correlation function yielded excellent results, obtaining two well-separated characteristic time scales: a slow one (∼250 ps) associated with bonds linking two DPPC molecules, and a fast one (∼15 ps), related to DPPC/solvent bonds.

Microstructure, Tensile Adhesion Strength and Thermal Shock Resistance of TBCs with Different Flame-Sprayed Bond Coat Materials Onto BMI Polyimide Matrix Composite

NASA Astrophysics Data System (ADS)

Abedi, H. R.; Salehi, M.; Shafyei, A.

2017-10-01

In this study, thermal barrier coatings (TBCs) composed of different bond coats (Zn, Al, Cu-8Al and Cu-6Sn) with mullite top coats were flame-sprayed and air-plasma-sprayed, respectively, onto bismaleimide matrix composites. These polyimide matrix composites are of interest to replace PMR-15, due to concerns about the toxicity of the MDA monomer from which PMR-15 is made. The results showed that pores and cracks appeared at the bond coat/substrate interface for the Al-bonded TBC because of its high thermal conductivity and diffusivity resulting in transferring of high heat flux and temperature to the polymeric substrate during top coat deposition. The other TBC systems due to the lower conductivity and diffusivity of bonding layers could decrease the adverse thermal effect on the polymer substrate during top coat deposition and exhibited adhesive bond coat/substrate interfaces. The tensile adhesion test showed that the adhesion strength of the coatings to the substrate is inversely proportional to the level of residual stress in the coatings. However, the adhesion strength of Al bond-coated sample decreased strongly after mullite top coat deposition due to thermal damage at the bond coat/substrate interface. TBC system with the Cu-6Sn bond coat exhibited the best thermal shock resistance, while Al-bonded TBC showed the lowest. It was inferred that thermal mismatch stresses and oxidation of the bond coats were the main factors causing failure in the thermal shock test.

Shearography for Non-destructive Inspection with applications to BAT Mask Tile Adhesive Bonding and Specular Surface Honeycomb Panels

NASA Technical Reports Server (NTRS)

Lysak, Daniel B.

2003-01-01

The applicability of shearography techniques for non-destructive evaluation in two unique application areas is examined. In the first application, shearography is used to evaluate the quality of adhesive bonds holding lead tiles to the B.4T gamma ray mask for the NASA Swift program. Using a vibration excitation, the more poorly bonded tiles are readily identifiable in the shearography image. A quantitative analysis is presented that compares the shearography results with a destructive pull test measuring the force at bond failure. The second application is to evaluate the bonding between the skin and core of a honeycomb structure with a specular (mirror-like) surface. In standard shearography techniques, the object under test must have a diffuse surface to generate the speckle patterns in laser light, which are then sheared. A novel configuration using the specular surface as a mirror to image speckles from a diffuser is presented, opening up the use of shearography to a new class of objects that could not have been examined with the traditional approach. This new technique readily identifies large scale bond failures in the panel, demonstrating the validity of this approach.

Recrystallization characteristics and interfacial oxides on the compression bonding interface

NASA Astrophysics Data System (ADS)

Xie, Bijun; Sun, Mingyue; Xu, Bin; Li, Dianzhong

2018-05-01

Up to now, the mechanism of interface bonding is still not fully understood. This work presents interfacial characteristics of 316LN stainless steel bonding joint after cold compression bonding with subsequent annealing. EBSD analysis shows that fine recrystallization grains preferentially appear near the bonding interface and grow towards both sides of the interface. Transmission electron microscopy reveals that initial cold compression bonding disintegrates the native oxide scales and brings pristine metal from both sides of the interface come into intimate contact, while the broken oxide particles are remained at the original interface. The results indicate that partial bonding can be achieved by cold compression bonding with post-annealing treatment and recrystallization firstly occurs along the bonding interface. However, the interfacial oxides impede the recrystallization grains step over the interface and hinder the complete healing of the bonding interface.

MD simulation study of the diffusion and local structure of n-alkanes in liquid and supercritical methanol at infinite dilution.

PubMed

Feng, Huajie; Gao, Wei; Su, Li; Sun, Zhenfan; Chen, Liuping

2017-06-01

The diffusion coefficients of 14 n-alkanes (ranging from methane to n-tetradecane) in liquid and supercritical methanol at infinite dilution (at a pressure of 10.5 MPa and at temperatures of 299 K and 515 K) were deduced via molecular dynamics simulations. Values for the radial distribution function, coordination number, and number of hydrogen bonds were then calculated to explore the local structure of each fluid. The flexibility of the n-alkane (as characterized by the computed dihedral distribution, end-to-end distance, and radius of gyration) was found to be a major influence and hydrogen bonding to be a minor influence on the local structure. Hydrogen bonding reduces the flexibility of the n-alkane, whereas increasing the temperature enhances its flexibility, with temperature having a greater effect than hydrogen bonding on flexibility. Graphical abstract The flexibility of the alkane is a major influence and the hydrogen bonding is a minor influence on the first solvation shell; the coordination numbers of long-chain n-alkanes in the first solvation shell are rather low.

Readout-segmented multi-shot diffusion-weighted MRI of the knee joint in patients with juvenile idiopathic arthritis.

PubMed

Sauer, Alexander; Li, Mengxia; Holl-Wieden, Annette; Pabst, Thomas; Neubauer, Henning

2017-10-12

Diffusion-weighted MRI has been proposed as a new technique for imaging synovitis without intravenous contrast application. We investigated diagnostic utility of multi-shot readout-segmented diffusion-weighted MRI (multi-shot DWI) for synovial imaging of the knee joint in patients with juvenile idiopathic arthritis (JIA). Thirty-two consecutive patients with confirmed or suspected JIA (21 girls, median age 13 years) underwent routine 1.5 T MRI with contrast-enhanced T1w imaging (contrast-enhanced MRI) and with multi-shot DWI (RESOLVE, b-values 0-50 and 800 s/mm 2 ). Contrast-enhanced MRI, representing the diagnostic standard, and diffusion-weighted images at b = 800 s/mm 2 were separately rated by three independent blinded readers at different levels of expertise for the presence and the degree of synovitis on a modified 5-item Likert scale along with the level of subjective diagnostic confidence. Fourteen (44%) patients had active synovitis and joint effusion, nine (28%) patients showed mild synovial enhancement not qualifying for arthritis and another nine (28%) patients had no synovial signal alterations on contrast-enhanced imaging. Ratings by the 1st reader on contrast-enhanced MRI and on DWI showed substantial agreement (κ = 0.74). Inter-observer-agreement was high for diagnosing, or ruling out, active arthritis of the knee joint on contrast-enhanced MRI and on DWI, showing full agreement between 1st and 2nd reader and disagreement in one case (3%) between 1st and 3rd reader. In contrast, ratings in cases of absent vs. little synovial inflammation were markedly inconsistent on DWI. Diagnostic confidence was lower on DWI, compared to contrast-enhanced imaging. Multi-shot DWI of the knee joint is feasible in routine imaging and reliably diagnoses, or rules out, active arthritis of the knee joint in paediatric patients without the need of gadolinium-based i.v. contrast injection. Possibly due to "T2w shine-through" artifacts, DWI does not reliably differentiate non-inflamed joints from knee joints with mild synovial irritation.

Suppression of interfacial voids formation during silane (SiH4)-based silicon oxide bonding with a thin silicon nitride capping layer

NASA Astrophysics Data System (ADS)

Lee, Kwang Hong; Bao, Shuyu; Wang, Yue; Fitzgerald, Eugene A.; Seng Tan, Chuan

2018-01-01

The material properties and bonding behavior of silane-based silicon oxide layers deposited by plasma-enhanced chemical vapor deposition were investigated. Fourier transform infrared spectroscopy was employed to determine the chemical composition of the silicon oxide films. The incorporation of hydroxyl (-OH) groups and moisture absorption demonstrates a strong correlation with the storage duration for both as-deposited and annealed silicon oxide films. It is observed that moisture absorption is prevalent in the silane-based silicon oxide film due to its porous nature. The incorporation of -OH groups and moisture absorption in the silicon oxide films increase with the storage time (even in clean-room environments) for both as-deposited and annealed silicon oxide films. Due to silanol condensation and silicon oxidation reactions that take place at the bonding interface and in the bulk silicon, hydrogen (a byproduct of these reactions) is released and diffused towards the bonding interface. The trapped hydrogen forms voids over time. Additionally, the absorbed moisture could evaporate during the post-bond annealing of the bonded wafer pair. As a consequence, defects, such as voids, form at the bonding interface. To address the problem, a thin silicon nitride capping film was deposited on the silicon oxide layer before bonding to serve as a diffusion barrier to prevent moisture absorption and incorporation of -OH groups from the ambient. This process results in defect-free bonded wafers.

Reactive Brazing of Carbon-Carbon Composites to Titanium

NASA Technical Reports Server (NTRS)

Shpargel, Tarah; Singh, M.; Morscher, Gregory; Asthana, Rajiv

2004-01-01

The Ti-metal/C-C composite joints were formed by reactive brazing with three commercial brazes, namely, Cu-ABA, TiCuNi, and TiCuSil. The joint microstructures were examined using optical microscopy, and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The results of the microstructure analysis indicate solute redistribution across the joint and possible metallurgical bond formation via interdiffusion, which led to good wetting and spreading.

Active Metal Brazing of Carbon-Carbon Composites to Titanium

NASA Technical Reports Server (NTRS)

Singh, M.; Shpargel, T. P.; Morscher, G.; Asthana, R.

2004-01-01

The Ti-metal/C-C composite joints were formed by reactive brazing with three commercial brazes, namely, Cu-ABA, TiCuNi, and TiCuSil. The joint microstructures were examined using optical microscopy, and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The results of the microstructure analysis indicate solute redistribution across the joint which led to good wetting, spreading, and metallurgical bond formation via interdiffusion.

Creation of an Aeronautical Capstone Design Project Program at Ohio State University

DTIC Science & Technology

2014-12-08

Equation 12 below. As Figure 35 shows, a single adhesively bonded lap joint is considered. The epoxy only sees a load in the axial direction. In...lap joint [1] = = ( ) 12 =stress distribution factor = applied load in the axial direction ...Figure 11. The joints are designed to handle the bending loads of horizontal, vertical and angled deployment and are designed to directly load the carbon

Resistance welding graphite-fiber composites

NASA Technical Reports Server (NTRS)

Lamoureux, R. T.

1980-01-01

High-strength joints are welded in seconds in carbon-reinfored thermoplastic beams. Resistance-welding electrode applies heat and pressure to joint and is spring-loaded to follow softening material to maintain contact; it also holds parts together for cooling and hardening. Both transverse and longitudinal configurations can be welded. Adhesive bonding and encapsulation are more time consuming methods and introduce additional material into joint, while ultrasonic heating can damage graphite fibers in composite.

A Digital Image-Based Discrete Fracture Network Model and Its Numerical Investigation of Direct Shear Tests

NASA Astrophysics Data System (ADS)

Wang, Peitao; Cai, Meifeng; Ren, Fenhua; Li, Changhong; Yang, Tianhong

2017-07-01

This paper develops a numerical approach to determine the mechanical behavior of discrete fractures network (DFN) models based on digital image processing technique and particle flow code (PFC2D). A series of direct shear tests of jointed rocks were numerically performed to study the effect of normal stress, friction coefficient and joint bond strength on the mechanical behavior of joint rock and evaluate the influence of micro-parameters on the shear properties of jointed rocks using the proposed approach. The complete shear stress-displacement curve of the DFN model under direct shear tests was presented to evaluate the failure processes of jointed rock. The results show that the peak and residual strength are sensitive to normal stress. A higher normal stress has a greater effect on the initiation and propagation of cracks. Additionally, an increase in the bond strength ratio results in an increase in the number of both shear and normal cracks. The friction coefficient was also found to have a significant influence on the shear strength and shear cracks. Increasing in the friction coefficient resulted in the decreasing in the initiation of normal cracks. The unique contribution of this paper is the proposed modeling technique to simulate the mechanical behavior of jointed rock mass based on particle mechanics approaches.

Solder extrusion pressure bonding process and bonded products produced thereby

DOEpatents

Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

1992-06-16

Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

Ultrasonically bonded value assembly

NASA Technical Reports Server (NTRS)

Salvinski, R. J. (Inventor)

1975-01-01

A valve apparatus capable of maintaining a fluid-tight seal over a relatively long period of time by releasably bonding a valve member to its seat is described. The valve member is bonded or welded to the seat and then released by the application of the same energy to the bond joint. The valve member is held in place during the bonding by a clamping device. An appropriate force device can activate the opening and closing of the valve member. Various combinations of material for the valve member and valve seat can be utilized to provide an adequate sealing bond. Aluminum oxide, stainless steel, inconel, tungsten carbide as hard materials and copper, aluminum, titanium, silver, and gold as soft materials are suggested.

Method of producing microporous joints in metal bodies

DOEpatents

Danko, Joseph C.

1982-01-01

Tungsten is placed in contact with either molybdenum, tantalum, niobium, vanadium, rhenium, or other metal of atoms having a different diffusion coefficient than tungsten. The metals are heated so that the atoms having the higher diffusion coefficient migrate to the metal having the lower diffusion rate, leaving voids in the higher diffusion coefficient metal. Heating is continued until the voids are interconnected.

The structure of hydrophobic gas diffusion electrodes.

NASA Technical Reports Server (NTRS)

Giner, J.

1972-01-01

The 'flooded agglomerate' model of the Teflon-bonded gas diffusion electrode is discussed. A mathematical treatment of the 'flooded agglomerate' model is given; it can be used to predict the performance of the electrode as a function of measurable physical parameters.

The behavior of bonded doubler splices for composite sandwich panels

NASA Technical Reports Server (NTRS)

Zeller, T. A.; Weisahaar, T. A.

1980-01-01

The results of an investigation into the behavior of adhesively bonded doubler splices of two composite material sandwich panels are presented. The splices are studied from three approaches: analytical; numerical (finite elements); and experimental. Several parameters that characterize the splice are developed to determine their influence upon joint strength. These parameters are: doubler overlap length; core stiffness; laminate bending stiffness; the size of the gap between the spliced sandwich panels; and room and elevated temperatures. Similarities and contrasts between these splices and the physically similar single and double lap joints are discussed. The results of this investigation suggest several possible approaches to improving the strength of the sandwich splices.

Preliminary Investigations of Joining Technologies for Attaching Refractory Metals to Ni-Based Superalloys

NASA Technical Reports Server (NTRS)

Gould, Jerry E.; Ritzert, Frank J.; Loewenthal, William S.

2006-01-01

In this study, a range of joining technologies has been investigated for creating attachments between refractory metal and Ni-based superalloys. Refractory materials of interest include Mo-47%Re, T-111, and Ta-10%W. The Ni-based superalloys include Hastelloy X and MarM 247. During joining with conventional processes, these materials have potential for a range of solidification and intermetallic formation-related defects. For this study, three non-conventional joining technologies were evaluated. These included inertia welding, electro-spark deposition (ESD) welding, and magnetic pulse welding (MPW). The developed inertia welding practice closely paralleled that typically used for the refractory metals alloys. Metallographic investigations showed that forging during inertia welding occurred predominantly on the nickel base alloy side. It was also noted that at least some degree of forging on the refractory metal side of the joint was necessary to achieve consistent bonding. Both refractory metals were readily weldable to the Hastelloy X material. When bonding to the MarM 247, results were inconsistent. This was related to the higher forging temperatures of the MarM 247, and subsequent reduced deformation on that material during welding. ESD trials using a Hastelloy X filler were successful for all material combinations. ESD places down very thin (5- to 10- m) layers per pass, and interactions between the substrates and the fill were limited (at most) to that layer. For the refractory metals, the fill only appeared to wet the surface, with minimal dilution effects. Microstructures of the deposits showed high weld metal integrity with maximum porosity on the order of a few percent. Some limited success was also obtained with MPW. In these trials, only the T-111 tubes were used. Joints were possible for the T-111 tube to the Hastelloy X bar stock, but the stiffness of the tube (resisting collapse) necessitated the use of very high power levels. These power levels resulted in damage to the equipment (concentrator) during welding. It is of note that the joint made showed the typical wavy bond microstructure associated with magnetic pulse/explosion bond joints. Joints were not possible between the T-111 tube and the MarM 247 bar stock. In this case, the MarM 247 shattered before sufficient impact forces could be developed for bonding.

Reactions between palladium and gallium arsenide: Bulk versus thin-film studies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lin, J.; Hsieh, K.; Schulz, K.J.

1988-01-01

Reactions between Pd and GaAs have been studied using bulk-diffusion couples of Pd (approx.0.6 mm thick)/GaAs and thin-film Pd (50 and 160 nm)/GaAs samples. The sequence of phase formation at 600 /sup 0/C between bulk Pd and GaAs was established. Initial formation of the solution phase ..mu.. and the ternary phase T does not represent the stable configuration. The stable configuration is GaAs chemically bondepsilonchemically bondlambdachemically bond..gamma..chemically bond..nu..chemically bondPd and is termed the diffusion path between GaAs and Pd. The sequence of phase formation for the bulk-diffusion couples is similar at 500 /sup 0/C. Phase formation for the thin-film Pd/GaAsmore » specimens was studied at 180, 220, 250, 300, 350, 400, 450, 600, and 1000 /sup 0/C for various annealing times. The sequence of phase formation obtained from the thin-film experiments is rationalized readily from the known ternary phase equilibria of Ga--Pd--As and the results from the bulk-diffusion couples of Pd/GaAs. The thin-film results reported in the literature are likewise rationalized. The diffusion path concept provides a useful guide in understanding the phase formation in Pd--GaAs interface or any other M--GaAs interface. This information is important in designing a uniform, stable contact for the metallization of GaAs.« less

Ga originated kink-and-tail Zn diffusion profiles in InGaAsP and InGaAlAs alloys during MOVPE regrowth

NASA Astrophysics Data System (ADS)

Kitatani, T.; Okamoto, K.; Uchida, K.; Tanaka, S.

2017-12-01

We investigated the diffusion characteristics of Zn in ternary and quaternary alloys of InGaAsP and InGaAlAs, which are important materials in long-wavelength optical communication devices. The measured Zn diffusion profiles of InGaAs, InGaAsP, and InGaAlAs showed kink-and-tail shapes in which Zn concentration fell abruptly at first and then decreased slowly, whereas those of InP and InAlAs showed only abrupt decreases. Thus, only Ga-containing alloys had tail-like profiles. Since this tail was well described by the group-V vacancy related defect model, we deduced that its mechanism is closely related with group-V vacancies in Ga-related bonds such as GaP or GaAs. Furthermore, we demonstrated the possibility that many more group-V vacancies originated from GaP bonds than from GaAs bonds, indicating the difficulty in crystal growth of high quality alloys that have GaP components.

Diffusion Bonding Technology of Tungsten and SiC/SiC Composites for Nuclear Applications

NASA Astrophysics Data System (ADS)

Kishimoto, Hirotatsu; Shibayama, Tamaki; Abe, Takahiro; Shimoda, Kazuya; Kawamura, Satoshi; Kohyama, Akira

2011-10-01

Silicon carbide (SiC) is a candidate for the structural material in the next generation nuclear plants. Use of SiC/SiC composites is expected to increase the operation temperature of system over 1000 °C. For the high temperature system, refractory metals are planned to be used for several components. Tungsten is a candidate of armor on the divertor component in fusion, and is planned to be used for an upper-end plug of SiC/SiC fuel pin in a Gas cooled Fast Reactor (GFR). Joining technique of the SiC/SiC composites and tungsten is an important issue for nuclear systems in future. Nano-Infiltration and Transient Eutectoid (NITE) method is able to provide dense stable and high strength SiC/SiC composites having high resistance against pressure at elevated temperature, a diffusion bonding technique is usable to join the materials. Present research produces a NITE-SiC/SiC composite and tungsten as the similar dimension as a projected cladding tube of fuel pin for GFR using diffusion bonding, and investigated microstructure and mechanical properties.

[Effects of laser welding on bond of porcelain fused cast pure titanium].

PubMed

Zhu, Juan-fang; He, Hui-ming; Gao, Bo; Wang, Zhong-yi

2006-04-01

To investigate the influence of the laser welding on bond of porcelain fused to cast pure titanium. Twenty cast titanium plates were divided into two groups: laser welded group and control group. The low-fusing porcelain was fused to the laser welded cast pure titanium plates at fusion zone. The bond strength of the porcelain to laser welded cast pure titanium was measured by the three-point bending test. The interface of titanium and porcelain was investigated by scanning electron microscopy (SEM) and energy depressive X-ray detector (EDX). The non-welded titanium plates were used as comparison. No significant difference of the bond strength was found between laser-welded samples [(46.85 +/- 0.76) MPa] and the controls [(41.71 +/- 0.55) MPa] (P > 0.05). The SEM displayed the interface presented similar irregularities with a predominance. The titanium diffused to low-fusing porcelain, while silicon and aluminum diffused to titanium basement. Laser welding does not affect low-fusing porcelain fused to pure titanium.

Iodine versus Bromine Functionalization for Bottom-Up Graphene Nanoribbon Growth: Role of Diffusion

DOE PAGES

Bronner, Christopher; Marangoni, Tomas; Rizzo, Daniel J.; ...

2017-08-08

Deterministic bottom-up approaches for synthesizing atomically well-defined graphene nanoribbons (GNRs) largely rely on the surface-catalyzed activation of selected labile bonds in a molecular precursor followed by step-growth polymerization and cyclodehydrogenation. While the majority of successful GNR precursors rely on the homolytic cleavage of thermally labile C–Br bonds, the introduction of weaker C–I bonds provides access to monomers that can be polymerized at significantly lower temperatures, thus helping to increase the flexibility of the GNR synthesis process. Scanning tunneling microscopy imaging of molecular precursors, activated intermediates, and polymers resulting from stepwise thermal annealing of both Br and I substituted precursors formore » chevron GNRs reveals that the polymerization of both precursors proceeds at similar temperatures on Au(111). Finally, this surprising observation is consistent with diffusion-controlled polymerization of the surface-stabilized radical intermediates that emerge from homolytic cleavage of either the C–Br or the C–I bonds.« less

Molecular dynamics of acetamide based ionic deep eutectic solvents

NASA Astrophysics Data System (ADS)

Srinivasan, H.; Dubey, P. S.; Sharma, V. K.; Biswas, R.; Mitra, S.; Mukhopadhyay, R.

2018-04-01

Deep eutectic solvents are multi-component mixtures that have freezing point lower than their individual components. Mixture of acetamide+ lithium nitrate in the molar ratio 78:22 and acetamide+ lithium perchlorate in the molar ratio 81:19 are found to form deep eutectic solvents with melting point lower than the room temperature. It is known that the depression in freezing point is due to the hydrogen bond breaking ability of anions in the system. Quasielastic neutron scattering experiments on these systems were carried out to study the dynamics of acetamide molecules which may be influenced by this hydrogen bond breaking phenomena. The motion of acetamide molecules is modeled using jump diffusion mechanism to demonstrate continuous breaking and reforming hydrogen bonds in the solvent. Using the jump diffusion model, it is inferred that the jump lengths of acetamide molecules are better approximated by a Gaussian distribution. The shorter residence time of acetamide in presence of perchlorate ions suggest that the perchlorate ions have a higher hydrogen bond breaking ability compared to nitrate ions.

Stresses in adhesively bonded joints: A closed form solution. [plate theory

NASA Technical Reports Server (NTRS)

Delale, F.; Erdogan, F.; Aydinoglu, M. N.

1980-01-01

The plane strain of adhesively bonded structures which consist of two different orthotropic adherents is considered. Assuming that the thicknesses of the adherends are constant and are small in relation to the lateral dimensions of the bonded region, the adherends are treated as plates. The transverse shear effects in the adherends and the in-plane normal strain in the adhesive are taken into account. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form. A single lap joint and a stiffened plate under various loading conditions are considered as examples. To verify the basic trend of the solutions obtained from the plate theory a sample problem is solved by using the finite element method and by treating the adherends and the adhesive as elastic continua. The plate theory not only predicts the correct trend for the adhesive stresses but also gives rather surprisingly accurate results.

Evaluation of Joint Performance on High Nitrogen Stainless Steel Which is Expected to Have Higher Allergy Resistance

NASA Astrophysics Data System (ADS)

Nakano, Kouichi

Austenitic stainless steel, which includes nickel for stabilizing austenitic structure, is used for various purposes, for example, for structural material, corrosion-resistant material, biomaterial etc. Nickel is set as one of the rare metals and economizing on nickel as the natural resources is required. On the other hand, nickel is one of the metals that cause metallic allergy frequently. Therefore, high nitrogen stainless steel, where nitrogen stabilizes austenitic structure instead of nickel, has been developed in Japan and some of the foreign countries for the above reason. When high nitrogen stainless steel is fused and bonded, dissolved nitrogen is released to the atmospheric area, and some of the material properties will change. In this study, we bonded high nitrogen stainless steel by stud welding process, which is able to bond at short time, and we evaluate joint performance. We have got some interesting results from the other tests and examinations.

The role of peel stresses in cyclic debonding

NASA Technical Reports Server (NTRS)

Everett, R. A., Jr.

1982-01-01

When an adhesively bonded joint is undergoing cyclic loading, one of the possible damage modes that occurs is called cyclic debonding - progressive separation of the adherends by failure of the adhesive bond under cyclic loading. In most practical structures, both peel and shear stresses exist in the adhesive bonding during cyclic loading. The results of an experimental and analytical study to determine the role of peel stresses on cyclic debonding in a mixed mode specimen are presented. Experimentally, this was done by controlling the forces that create the peel stresses by applying a clamping force to oppose the peel stresses. Cracked lap shear joints were chosen for this study. A finite element analysis was developed to assess the effect of the clamping force on the strain energy release rates due to shear and peel stresses. The results imply that the peel stress is the principal stress causing cyclic debonding.

Fluorescence Correlation Spectroscopy to Study Diffusion of Polymer Chains within Layered Hydrogen-Bonded Polymer Films

NASA Astrophysics Data System (ADS)

Pristinski, Denis; Kharlampieva, Evguenia; Sukhishvili, Svetlana

2002-03-01

Fluorescence Correlation Spectroscopy (FCS) has been used to probe molecular motions within polymer multilayers formed by hydrogen-bonding sequential self-assembly. Polyethylene glycol (PEG) molecules were end-labeled with the fluorescent tags, and self-assembled with polymethacrylic acid (PMAA) using layer-by-layer deposition. We have found that molecules included in the top adsorbed layer have significant mobility at the millisecond time scale, probably due to translational diffusion. However, their dynamics deviate from classical Brownian motion with a single diffusion time. Possible reasons for the deviation are discussed. We found that motions were significantly slowed with increasing depth within the PEG/PMAA multilayer. This phenomena occured in a narrow pH range around 4.0 in which intermolecular interactions were relatively weak.

Diffusion doping in quantum dots: bond strength and diffusivity.

PubMed

Saha, Avijit; Makkar, Mahima; Shetty, Amitha; Gahlot, Kushagra; A R, Pavan; Viswanatha, Ranjani

2017-02-23

Semiconducting materials uniformly doped with optical or magnetic impurities have been useful in a number of potential applications. However, clustering or phase separation during synthesis has made this job challenging. Recently the "inside out" diffusion doping was proposed to be successful in obtaining large sized quantum dots (QDs) uniformly doped with a dilute percentage of dopant atoms. Herein, we demonstrate the use of basic physical chemistry of diffusion to control the size and concentration of the dopants within the QDs for a given transition metal ion. We have studied three parameters; the bond strength of the core molecules and the diffusion coefficient of the diffusing metal ion are found to be important while the ease of cation exchange was not highly influential in the control of size and concentration of the single domain dilute magnetic semiconductor quantum dots (DMSQDs) with diverse dopant ions M 2+ (Fe 2+ , Ni 2+ , Co 2+ , Mn 2+ ). Steady state optical emission spectra reveal that the dopants are incorporated inside the semiconducting CdS and the emission can be tuned during shell growth. We have shown that this method enables control over doping percentage and the QDs show a superior ferromagnetic response at room temperature as compared to previously reported systems.

The Microstructure and Pitting Resistance of Weld Joints of 2205 Duplex Stainless Steel

NASA Astrophysics Data System (ADS)

Wu, Mingfang; Liu, Fei; Pu, Juan; Anderson, Neil E.; Li, Leijun; Liu, Dashuang

2017-11-01

2205 duplex stainless steel (DSS) was welded by submerged arc welding. The effects of both heat input and groove type on the ferrite/austenite ratio and elemental diffusion of weld joints were investigated. The relationships among welding joint preparation, ferrite/austenite ratio, elemental diffusion, and pitting corrosion resistance of weld joints were analyzed. When the Ni content of the weld wire deposit was at minimum 2-4% higher than that of 2205 DSS base metal, the desired ratio of ferrite/austenite and elemental partitioning between the austenite and ferrite phases were obtained. While the pitting sensitivity of weld metal was higher than that of base metal, the self-healing capability of the passive film of weld metal was better than that of the base metal when a single V-type groove was used. Furthermore, the heat input should be carefully controlled since pitting corrosion occurred readily in the coarse-grained heat-affected zone near the fusion line of welded joints.

Welding Wires To Thin Thermocouple Films

NASA Technical Reports Server (NTRS)

Holanda, Raymond; Kim, Walter S.; Danzey, Gerald A.; Pencil, Eric; Wadel, Mary

1993-01-01

Parallel-gap resistance welding yields joints surviving temperatures of about 1,000 degrees C. Much faster than thermocompression bonding. Also exceeds conductive-paste bonding and sputtering thin films through porous flame-sprayed insulation on prewelded lead wires. Introduces no foreign material into thermocouple circuit and does not require careful control of thickness of flame-sprayed material.

Bond Management - Higher Education.

ERIC Educational Resources Information Center

Washington State Legislature, Olympia. Joint Committee on Higher Education.

In this instance, the Joint Committee on Higher Education in Washington State was directed to review capital funding methods at the 4-year institutions of higher education in the state. The major finding of the study, which emerged after an intensive survey of bond practices, was that some means should be found to enhance management effectiveness…

GRC-2008-C-00349

NASA Image and Video Library

2004-02-26

Code R and Code D hosted NESC Principal Engineer Mike Kirsch who is Program Leader for Composite Crew Module (CCM). The purpose of the visit was to review/observe experiments that GRC is performing in support of the CCM program. The test object is the critical Low Impact Docking System/Tunnel interface joint that links the metal docking ring with the polymer composite tunnel element of the crew module pressure vessel. The rectangular specimens simulated the splice joint between the aluminum and the PMC sheets, including a PMC doubler sheet. GRC was selected for these tests due to our expertise in composite testing and our ability to perform 3D fullfield displacement and strain measurements of the complex bond geometry using digital image correlation. The specimens performed above their minimum load requirements and the full field strain measurements showed the strain levels at the critical bond line. This work is part of a joint Code D & R investigation.

Thermal-mechanical fatigue test apparatus for metal matrix composites and joint attachments

NASA Technical Reports Server (NTRS)

Westfall, L. J.; Petrasek, D. W.

1985-01-01

Two thermal-mechanical fatigue (TMF) test facilities were designed and developed, one to test tungsten fiber reinforced metal matrix composite specimens at temperature up to 1430C (2600F) and another to test composite/metal attachment bond joints at temperatures up to 760C (1400 F). The TMF facility designed for testing tungsten fiber reinforced metal matrix composites permits test specimen temperature excursions from room temperature to 1430C (2600F) with controlled heating and loading rates. A strain-measuring device measures the strain in the test section of the specimen during each heating and cooling cycle with superimposed loads. Data is collected and recorded by a computer. The second facility is designed to test composite/metal attachment bond joints and to permit heating to a maximum temperature of 760C (1400F) within 10 min and cooling to 150C (300F) within 3 min. A computer controls specimen temperature and load cycling.

Thermal-mechanical fatigue test apparatus for metal matrix composites and joint attachments

NASA Technical Reports Server (NTRS)

Westfall, Leonard J.; Petrasek, Donald W.

1988-01-01

Two thermal-mechanical fatigue (TMF) test facilities were designed and developed, one to test tungsten fiber reinforced metal matrix composite specimens at temperature up to 1430C (2600F) and another to test composite/metal attachment bond joints at temperatures up to 760F (1400F). The TMF facility designed for testing tungsten fiber reinforced metal matrix composites permits test specimen temperature excursions from room temperature to 1430C (2600F) with controlled heating and loading rates. A strain-measuring device measures the strain in the test section of the specimen during each heating and cooling cycle with superimposed loads. Data is collected and recorded by a computer. The second facility is designed to test composite/metal attachment bond joints and to permit heating to a maximum temperature of 760C (1400F) within 10 min and cooling to 150C (300F) within 3 min. A computer controls specimen temperature and load cycling.

Demonstration of Subscale Cermet Fuel Specimen Fabrication Approach Using Spark Plasma Sintering and Diffusion Bonding

NASA Technical Reports Server (NTRS)

Barnes, Marvin W.; Tucker, Dennis S.; Benensky, Kelsa M.

2018-01-01

Nuclear thermal propulsion (NTP) has the potential to expand the limits of human space exploration by enabling crewed missions to Mars and beyond. The viability of NTP hinges on the development of a robust nuclear fuel material that can perform in the harsh operating environment (> or = 2500K, reactive hydrogen) of a nuclear thermal rocket (NTR) engine. Efforts are ongoing to develop fuel material and to assemble fuel elements that will be stable during the service life of an NTR. Ceramic-metal (cermet) fuels are being actively pursued by NASA Marshall Space Flight Center (MSFC) due to their demonstrated high-temperature stability and hydrogen compatibility. Building on past cermet fuel development research, experiments were conducted to investigate a modern fabrication approach for cermet fuel elements. The experiments used consolidated tungsten (W)-60vol%zirconia (ZrO2) compacts that were formed via spark plasma sintering (SPS). The consolidated compacts were stacked and diffusion bonded to assess the integrity of the bond lines and internal cooling channel cladding. The assessment included hot hydrogen testing of the manufactured surrogate fuel and pure W for 45 minutes at 2500 K in the compact fuel element environmental test (CFEET) system. Performance of bonded W-ZrO2 rods was compared to bonded pure W rods to access bond line integrity and composite stability. Bonded surrogate fuels retained structural integrity throughout testing and incurred minimal mass loss.

Thiolated polymers: evidence for the formation of disulphide bonds with mucus glycoproteins.

PubMed

Leitner, Verena M; Walker, Greg F; Bernkop-Schnürch, Andreas

2003-09-01

Disulphide bonds between thiolated polymers (thiomers) and cysteine-rich subdomains of mucus glycoproteins are supposed to be responsible for the enhanced mucoadhesive properties of thiomers. This study set out to provide evidence for these covalent interactions using poly(acrylic acid)-cysteine conjugates of 2 and 450 kDa (PAA2-Cys, PAA450-Cys) displaying 402.5-776.0 micromol thiol groups per gram polymer. The effect of the disulphide bond breaker cysteine on thiomer-mucin disulphide bonds was monitored by (1) mucoadhesion studies and (2) rheological studies. Furthermore, (3) diffusion studies and (4) gel filtration studies were performed with thiomer-mucus mixtures. The addition of cysteine significantly (P<0.01) reduced the adhesion of thiomer tablets to porcine mucosa and G'/G" values of thiomer-mucin mixtures, whereas unthiolated controls were not influenced. These results indicate the cleavage of disulphide bonds between thiomer and mucus glycoproteins. Diffusion studies demonstrated that a 12.8-fold higher concentration of the thiomer (PAA2-Cys) remains in the mucin gel than the corresponding unmodified polymer. Gel filtration studies showed that PAA2-Cys was able to form disulphide bonds with mucin glycoproteins resulting in an altered elution profile of the mucin/PAA2-Cys mixture in comparison to mucin alone or mucin/PAA2 mixture. According to these results, the study provides evidence for the formation of covalent bonds between thiomer and mucus glycoproteins.

Surface diffusion of CO on silica-supported Ru particles: 13C nuclear magnetic resonance studies

NASA Astrophysics Data System (ADS)

Duncan, T. M.; Thayer, A. M.; Root, T. W.

1990-02-01

Portions of CO adsorbed on Ru particles, selected by the orientation of the C-O bond relative to an external magnetic field, are labeled by inversion of the 13C nuclear magnetic dipole. Changes in the orientation of the CO bond of these labeled molecules are then observed with 13C NMR spectroscopy. The temperature dependence and rate of reorientation are consistent with surface diffusion on Ru particles with small numbers of flat faces. The insensitivity to CO pressure in the range 0.5-100 Torr discounts stimulated desorption by gas-phase CO.

The Chemical Modeling of Electronic Materials and Interconnections

NASA Astrophysics Data System (ADS)

Kivilahti, J. K.

2002-12-01

Thermodynamic and kinetic modeling, together with careful experimental work, is of great help for developing new electronic materials such as lead-free solders, their compatible metallizations and diffusion-barrier layers, as well as joining and bonding processes for advanced electronics manufacturing. When combined, these modeling techniques lead to a rationalization of the trial-and-error methods employed in the electronics industry, limiting experimentation and, thus, reducing significantly time-to-market of new products. This modeling provides useful information on the stabilities of phases (microstructures), driving forces for chemical reactions, and growth rates of reaction products occurring in interconnections or thin-film structures during processing, testing, and in longterm use of electronic devices. This is especially important when manufacturing advanced lead-free electronics where solder joint volumes are decreasing while the number of dissimilar reactive materials is increasing markedly. Therefore, a new concept of local nominal composition was introduced and applied together with the relevant ternary and multicomponent phase diagrams to some solder/conductor systems.

Diffusion bonded boron/aluminum spar-shell fan blade

NASA Technical Reports Server (NTRS)

Carlson, C. E. K.; Cutler, J. L.; Fisher, W. J.; Memmott, J. V. W.

1980-01-01

Design and process development tasks intended to demonstrate composite blade application in large high by-pass ratio turbofan engines are described. Studies on a 3.0 aspect radio space and shell construction fan blade indicate a potential weight savings for a first stage fan rotor of 39% when a hollow titanium spar is employed. An alternate design which featured substantial blade internal volume filled with titanium honeycomb inserts achieved a 14% potential weight savings over the B/M rotor system. This second configuration requires a smaller development effort and entails less risk to translate a design into a successful product. The feasibility of metal joining large subsonic spar and shell fan blades was demonstrated. Initial aluminum alloy screening indicates a distinct preference for AA6061 aluminum alloy for use as a joint material. The simulated airfoil pressings established the necessity of rigid air surfaces when joining materials of different compressive rigidities. The two aluminum alloy matrix choices both were successfully formed into blade shells.

Materials technology for Stirling space power converters

NASA Technical Reports Server (NTRS)

Baggenstoss, William; Mittendorf, Donald

1992-01-01

This program was conducted in support of the NASA LeRC development of the Stirling power converter (SPC) for space power applications. The objectives of this contract were: (1) to perform a technology review and analyses to support the evaluation of materials issues for the SPC; (2) to evaluate liquid metal compatibility issues of the SPC; (3) to evaluate and define a transient liquid phase diffusion bonding (TLPDB) process for the SPC joints to the Udimet 720 heater head; and (4) to evaluate alternative (to the TLPDB) joining techniques. In the technology review, several aspects of the current Stirling design were examined including the power converter assembly process, materials joining, gas bearings, and heat exchangers. The supporting analyses included GLIMPS power converter simulation in support of the materials studies, and system level analysis in support of the technology review. The liquid metal compatibility study evaluated process parameters for use in the Stirling power converter. The alternative joining techniques study looked at the applicability of various joining techniques to the Stirling power converter requirements.

Buckling of a Longitudinally Jointed Curved Composite Panel Arc Segment for Next Generation of Composite Heavy Lift Launch Vehicles: Verification Testing Analysis

NASA Technical Reports Server (NTRS)

Farrokh, Babak; Segal, Kenneth N.; Akkerman, Michael; Glenn, Ronald L.; Rodini, Benjamin T.; Fan, Wei-Ming; Kellas, Sortiris; Pineda, Evan J.

2014-01-01

In this work, an all-bonded out-of-autoclave (OoA) curved longitudinal composite joint concept, intended for use in the next generation of composite heavy lift launch vehicles, was evaluated and verified through finite element (FE) analysis, fabrication, testing, and post-test inspection. The joint was used to connect two curved, segmented, honeycomb sandwich panels representative of a Space Launch System (SLS) fairing design. The overall size of the resultant panel was 1.37 m by 0.74 m (54 in by 29 in), of which the joint comprised a 10.2 cm (4 in) wide longitudinal strip at the center. NASTRAN and ABAQUS were used to perform linear and non-linear analyses of the buckling and strength performance of the jointed panel. Geometric non-uniformities (i.e., surface contour imperfections) were measured and incorporated into the FE model and analysis. In addition, a sensitivity study of the specimens end condition showed that bonding face-sheet doublers to the panel's end, coupled with some stress relief features at corner-edges, can significantly reduce the stress concentrations near the load application points. Ultimately, the jointed panel was subjected to a compressive load. Load application was interrupted at the onset of buckling (at 356 kN 80 kips). A post-test non-destructive evaluation (NDE) showed that, as designed, buckling occurred without introducing any damage into the panel or the joint. The jointed panel was further capable of tolerating an impact damage to the same buckling load with no evidence of damage propagation. The OoA cured all-composite joint shows promise as a low mass factory joint for segmented barrels.

Acoustic emission analysis: A test method for metal joints bonded by adhesives

NASA Technical Reports Server (NTRS)

Brockmann, W.; Fischer, T.

1978-01-01

Acoustic emission analysis is applied to study adhesive joints which had been subjected to mechanical and climatic stresses, taking into account conditions which make results applicable to adhesive joints used in aerospace technology. Specimens consisting of the alloy AlMgSi0.5 were used together with a phenolic resin adhesive, an epoxy resin modified with a polyamide, and an epoxy resin modified with a nitrile. Results show that the acoustic emission analysis provides valuable information concerning the behavior of adhesive joints under load and climatic stresses.

Joint groupwise registration and ADC estimation in the liver using a B-value weighted metric.

PubMed

Sanz-Estébanez, Santiago; Rabanillo-Viloria, Iñaki; Royuela-Del-Val, Javier; Aja-Fernández, Santiago; Alberola-López, Carlos

2018-02-01

The purpose of this work is to develop a groupwise elastic multimodal registration algorithm for robust ADC estimation in the liver on multiple breath hold diffusion weighted images. We introduce a joint formulation to simultaneously solve both the registration and the estimation problems. In order to avoid non-reliable transformations and undesirable noise amplification, we have included appropriate smoothness constraints for both problems. Our metric incorporates the ADC estimation residuals, which are inversely weighted according to the signal content in each diffusion weighted image. Results show that the joint formulation provides a statistically significant improvement in the accuracy of the ADC estimates. Reproducibility has also been measured on real data in terms of the distribution of ADC differences obtained from different b-values subsets. The proposed algorithm is able to effectively deal with both the presence of motion and the geometric distortions, increasing accuracy and reproducibility in diffusion parameters estimation. Copyright © 2017 The Authors. Published by Elsevier Inc. All rights reserved.

Microstructural characteristics of HIP-bonded monolithic nuclear fuels with a diffusion barrier

NASA Astrophysics Data System (ADS)

Jue, Jan-Fong; Keiser, Dennis D.; Breckenridge, Cynthia R.; Moore, Glenn A.; Meyer, Mitchell K.

2014-05-01

Due to the limitation of maximum uranium load achievable by dispersion fuel type, the Global Threat Reduction Initiative is developing an advanced monolithic fuel to convert US high-performance research reactors to low-enriched uranium. Hot-isostatic-press (HIP) bonding was the single process down-selected to bond monolithic U-Mo fuel meat to aluminum alloy cladding. A diffusion barrier was applied to the U-Mo fuel meat by roll-bonding process to prevent extensive interaction between fuel meat and aluminum-alloy cladding. Microstructural characterization was performed on fresh fuel plates fabricated at Idaho National Laboratory. Interfaces between the fuel meat, the cladding, and the diffusion barrier, as well as between the U-10Mo fuel meat and the Al-6061 cladding, were characterized by scanning electron microscopy. Preliminary results indicate that the interfaces contain many different phases while decomposition, second phases, and chemical banding were also observed in the fuel meat. The important attributes of the HIP-bonded monolithic fuel are:

Microstructural Characteristics of HIP-bonded Monolithic Nuclear Fuels with a Diffusion Barrier

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jan-Fong Jue; Dennis D. Keiser, Jr.; Cynthia R. Breckenridge

Due to the limitation of maximum uranium load achievable by dispersion fuel type, the Global Threat Reduction Initiative (GTRI) is developing an advanced monolithic fuel to convert US high performance research reactors to low-enriched uranium. Hot-isostatic-press bonding was the single process down-selected to bond monolithic U-Mo fuel meat to aluminum alloy cladding. A diffusion barrier was applied to the U–Mo fuel meat by roll-bonding process to prevent extensive interaction between fuel meat and aluminum-alloy cladding. Microstructural characterization was performed on fresh fuel plates fabricated at Idaho National Laboratory. Interfaces between fuel meat, cladding, and diffusion barrier, as well as U–10Momore » fuel meat and Al–6061 cladding were characterized by scanning electron microscopy. Preliminary results indicate that the interfaces contain many different phases while decomposition, second phases, and chemical banding were also observed in the fuel meat. The important attributes of the HIP-bonded monolithic fuel are • A typical Zr diffusion barrier of thickness 25 µm • Transverse cross section that exhibits relatively equiaxed grains with an average grain diameter of 10 µm • Chemical banding, in some areas more than 100 µm in length, that is very pronounced in longitudinal (i.e., rolling) direction with Mo concentration varying from 7–13 wt% • Decomposed areas containing plate-shaped low-Mo phase • A typical Zr/cladding interaction layer of thickness 1-2 µm • A visible UZr2 bearing layer of thickness 1-2 µm • Mo-rich precipitates (mainly Mo2Zr, forming a layer in some areas) followed by a Mo-depleted sub-layer between the visible UZr2-bearing layer and the U–Mo matrix • No excessive interaction between cladding and the uncoated fuel edge • Cladding-to-cladding bonding that exhibits no cracks or porosity with second phases high in Mg, Si, and O decorating the bond line. • Some of these attributes might be critical to the irradiation performance of monolithic U-10Mo nuclear fuel. There are several issues or concerns that warrant more detailed study, such as precipitation along cladding-to-cladding bond line, chemical banding, uncovered fuel-zone edge, and interaction layer between U–Mo fuel meat and zirconium. Future post-irradiation examination results will focus, among other things, on identifying in-reactor failure mechanisms and, eventually, directing further fresh fuel characterization efforts.« less

Soldering of Carbon Materials Using Transition Metal Rich Alloys.

PubMed

Burda, Marek; Lekawa-Raus, Agnieszka; Gruszczyk, Andrzej; Koziol, Krzysztof K K

2015-08-25

Joining of carbon materials via soldering has not been possible up to now due to lack of wetting of carbons by metals at standard soldering temperatures. This issue has been a severely restricting factor for many potential electrical/electronic and mechanical applications of nanostructured and conventional carbon materials. Here we demonstrate the formation of alloys that enable soldering of these structures. By addition of several percent (2.5-5%) of transition metal such as chromium or nickel to a standard lead-free soldering tin based alloy we obtained a solder that can be applied using a commercial soldering iron at typical soldering temperatures of approximately 350 °C and at ambient conditions. The use of this solder enables the formation of mechanically strong and electrically conductive joints between carbon materials and, when supported by a simple two-step technique, can successfully bond carbon structures to any metal terminal. It has been shown using optical and scanning electron microscope images as well as X-ray diffraction patterns and energy dispersive X-ray mapping that the successful formation of carbon-solder bonds is possible, first, thanks to the uniform nonreactive dispersion of transition metals in the tin-based matrix. Further, during the soldering process, these free elements diffuse into the carbon-alloy border with no formation of brazing-like carbides, which would damage the surface of the carbon materials.

Cleanliness evaluation of rough surfaces with diffuse IR reflectance

NASA Technical Reports Server (NTRS)

Pearson, L. H.

1995-01-01

Contamination on bonding surfaces has been determined to be a primary cause for degraded bond strength in certain solid rocket motor bondlines. Hydrocarbon and silicone based organic contaminants that are airborne or directly introduced to a surface are a significant source of contamination. Diffuse infrared (IR) reflectance has historically been used as an effective technique for detection of organic contaminants, however, common laboratory methods involving the use of a Fourier transform IR spectrometer (FTIR) are impractical for inspecting the large bonding surface areas found on solid rocket motors. Optical methods involving the use of acousto-optic tunable filters and fixed bandpass optical filters are recommended for increased data acquisition speed. Testing and signal analysis methods are presented which provide for simultaneous measurement of contamination concentration and roughness level on rough metal surfaces contaminated with hydrocarbons.

Bond-selective photoacoustic imaging by converting molecular vibration into acoustic waves

PubMed Central

Hui, Jie; Li, Rui; Phillips, Evan H.; Goergen, Craig J.; Sturek, Michael; Cheng, Ji-Xin

2016-01-01

The quantized vibration of chemical bonds provides a way of detecting specific molecules in a complex tissue environment. Unlike pure optical methods, for which imaging depth is limited to a few hundred micrometers by significant optical scattering, photoacoustic detection of vibrational absorption breaks through the optical diffusion limit by taking advantage of diffused photons and weak acoustic scattering. Key features of this method include both high scalability of imaging depth from a few millimeters to a few centimeters and chemical bond selectivity as a novel contrast mechanism for photoacoustic imaging. Its biomedical applications spans detection of white matter loss and regeneration, assessment of breast tumor margins, and diagnosis of vulnerable atherosclerotic plaques. This review provides an overview of the recent advances made in vibration-based photoacoustic imaging and various biomedical applications enabled by this new technology. PMID:27069873

Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn-3.5Ag-xTi active solders

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Wei-Lin, E-mail: wangwl77@gmail.com; Tsai, Yi-Chia, E-mail: tij@itri.org.tw

2012-06-15

Active solders Sn-3.5Ag-xTi varied from x = 0 to 6 wt.% Ti addition were prepared by vacuum arc re-melting and the resultant phase formation and variation of microstructure with titanium concentration were analyzed using X-ray diffraction, optical microscopy and scanning electron microscopy. The Sn-3.5Ag-xTi active solders are used as metallic filler to join with anodized 6061 Al alloy for potential applications of providing a higher heat conduction path. Their joints and mechanical properties were characterized and evaluated in terms of titanium content. The mechanical property of joints was measured by shear testing. The joint strength was very dependent on themore » titanium content. Solder with a 0.5 wt.% Ti addition can successfully wet and bond to the anodized aluminum oxide layers of Al alloy and posses a shear strength of 16.28 {+-} 0.64 MPa. The maximum bonding strength reached 22.24 {+-} 0.70 MPa at a 3 wt.% Ti addition. Interfacial reaction phase and chemical composition were identified by a transmission electron microscope with energy dispersive spectrometer. Results showed that the Ti element reacts with anodized aluminum oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti phases at the joint interfaces. - Highlights: Black-Right-Pointing-Pointer Active solder joining of anodized Al alloy needs 0.5 wt.% Ti addition for Sn-3.5Ag. Black-Right-Pointing-Pointer The maximum bonding strength occurs at 3 wt.% Ti addition. Black-Right-Pointing-Pointer The Ti reacts with anodized Al oxide to form Al{sub 3}Ti-rich and Al{sub 3}Ti at joint interface.« less

Analytical and experimental study of the vibration of bonded beams with a lap joint

NASA Technical Reports Server (NTRS)

Rao, M. D.; Crocker, M. J.

1990-01-01

A theoretical model to study the flexural vibration of a bonded lap joint system is described in this paper. First, equations of motion at the joint region are derived using a differential element approach. The transverse displacements of the upper and lower beam are considered to be different. The adhesive is assumed to be linearly viscoelastic and the widely used Kelvin-Voight model is used to represent the viscoelastic behavior of the adhesive. The shear force at the interface between the adhesive and the beam is obtained from the simple bending motion equations of the two beams. The resulting equations of motion are combined with the equations of transverse vibration of the beams in the unjointed regions. These are later solved as a boundary value problem to obtain the eigenvalues and eigenvectors of the system. The model can be used to predict the natural frequencies, modal damping ratios, and mode shapes of the system for free vibration. Good agreement between numerical and experimental results was obtained for a system of graphite epoxy beams lap-jointed by an epoxy adhesive.

Parametric Study of Single Bolted Composite Bolted Joint Subjected to Static Tensile Loading

NASA Astrophysics Data System (ADS)

Awadhani, L. V.; Bewoor, Anand, Dr.

2017-08-01

The use of composites is increasing in the engineering applications in order to reduce the weight, building energy efficient systems, designing a suitable material according to the requirements of the application. But at the same time, building a structure is possible only by bonding or bolting or combination of them. There are limitations for the bonding methods and problems with the bolting such as stress concentration near the neighborhood of the bolt hole, tensile or shear failure, delamination etc. Hence the design of a composite bolted structure needs a special attention. This paper focuses on the performance of the composite bolted joint under static tensile loading and the effect of variation in the parameters such as the bolt pitch, plate width, thickness, bolt tightening torque, composite material, coefficient of friction between the bolt and plate etc. A simple spring mass model is used to study the single bolted composite bolted joint. The influencing parameters are identified through the developed model and compared with the results from the literature. The best geometric parameters for the applied load are identified for the composite bolted joints.

Clinical quality is independently associated with favorable bond ratings.

PubMed

Haydar, Ziad; Nicewander, David; Convery, Paul; Black, Michael; Ballard, David

2010-01-01

The relation between clinical quality and bond rating for nonprofit hospitals has been proposed but never fully studied. We analyzed the relation between bond rating, clinical quality measures (The Joint Commission/Centers for Medicare and Medicaid Services [CMS] core measures), and balance sheet and income statement financial measures of 236 hospitals across the United States that are rated by Moody's Investors Service and that reported clinical quality measures to CMS during the study period. We found a statistically significant relation between higher quality measures and more favorable bond ratings. This association remained significant after controlling for traditional financial parameters.

Sodium ion diffusion in Al2O3: a distinct perspective compared with lithium ion diffusion.

PubMed

Jung, Sung Chul; Kim, Hyung-Jin; Choi, Jang Wook; Han, Young-Kyu

2014-11-12

Surface coating of active materials has been one of the most effective strategies to mitigate undesirable side reactions and thereby improve the overall battery performance. In this direction, aluminum oxide (Al2O3) is one of the most widely adopted coating materials due to its easy synthesis and low material cost. Nevertheless, the effect of Al2O3 coating on carrier ion diffusion has been investigated mainly for Li ion batteries, and the corresponding understanding for emerging Na ion batteries is currently missing. Using ab initio molecular dynamics calculations, herein, we first find that, unlike lithiation, sodiation of Al2O3 is thermodynamically unfavorable. Nonetheless, there can still exist a threshold in the Na ion content in Al2O3 before further diffusion into the adjacent active material, delivering a new insight that both thermodynamics and kinetics should be taken into account to describe ionic diffusion in any material media. Furthermore, Na ion diffusivity in NaxAl2O3 turns out to be much higher than Li ion diffusivity in LixAl2O3, a result opposite to the conventional stereotype based on the atomic radius consideration. While hopping between the O-rich trapping sites via an Na-O bond breaking/making process is identified as the main Na ion diffusion mechanism, the weaker Na-O bond strength than the Li-O counterpart turns out to be the origin of the superior diffusivity of Na ions.

Co-Curing of CFRP-Steel Hybrid Joints Using the Vacuum Assisted Resin Infusion Process

NASA Astrophysics Data System (ADS)

Streitferdt, Alexander; Rudolph, Natalie; Taha, Iman

2017-10-01

This study focuses on the one-step co-curing process of carbon fiber reinforced plastics (CFRP) joined with a steel plate to form a hybrid structure. In this process CFRP laminate and bond to the metal are realized simultaneously by resin infusion, such that the same resin serves for both infusion and adhesion. For comparison, the commonly applied two-step process of adhesive bonding is studied. In this case, the CFRP laminate is fabricated in a first stage through resin infusion of Non Crimp Fabric (NCF) and joined to the steel plate in a further step through adhesive bonding. For this purpose, the commercially available epoxy-based Betamate 1620 is applied. CFRP laminates were fabricated using two different resin systems, namely the epoxy (EP)-based RTM6 and a newly developed fast curing polyurethane (PU) resin. Results show comparable mechanical performance of the PU and EP based CFRP laminates. The strength of the bond of the co-cured samples was in the same order as the samples adhesively bonded with the PU resin and the structural adhesive. The assembly adhesive with higher ductility showed a weaker performance compared to the other tests. It could be shown that the surface roughness had the highest impact on the joint performance under the investigated conditions.

Ceramic-to-metal bonding for pressure transducers

NASA Technical Reports Server (NTRS)

Mackenzie, J. D.

1984-01-01

A solid-state diffusion technique involving the placement of a gold foil between INCONEL X-750 and a machinable glass-ceramic "MACOR" was shown to be successful in bonding these two materials. This technique was selected after an exhaustive literature search on ceramic-metal bonding methods. Small expansion mismatch between the Inconel and the MACOR resulted in fracture of the MACOR when the bonded body was subjected to tensile stress of 535 psi. The bonded parts were submitted to a cyclic loading test in an air atmosphere at 1 Hz from 0 to 60 KPa. Failure was observed after 700,000 cycles at 650 C. Ceramic-Inconel bonding was not achieved with this method for boron nitride and silica glass.

Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics

NASA Astrophysics Data System (ADS)

Hong, Won Sik; Oh, Chulmin; Kim, Mi-Song; Lee, Young Woo; Kim, Hui Joong; Hong, Sung Jae; Moon, Jeong Tak

2016-12-01

To suppress the bonding strength degradation of solder joints in automotive electronics, we proposed a mid-temperature quaternary Pb-free Sn-0.5Cu solder alloy with minor Pd, Al, Si and Ge alloying elements. We manufactured powders and solder pastes of Sn-0.5Cu-(0.01,0.03)Al-0.005Si-(0.006-0.007)Ge alloys ( T m = 230°C), and vehicle electronic control units used for a flame-retardant-4 printed circuit board with an organic solderability preservative finish were assembled by a reflow soldering process. To investigate the degradation properties of solder joints used in engine compartments, thermal cycling tests were conducted from -40°C to 125°C (10 min dwell) for 1500 cycles. We also measured the shear strength of the solder joints in various components and observed the microstructural evolution of the solder joints. Based on these results, intermetallic compound (IMC) growth at the solder joints was suppressed by minor Pd, Al and Si additions to the Sn-0.5Cu alloy. After 1500 thermal cycles, IMC layers thicknesses for 100 parts per million (ppm) and 300 ppm Al alloy additions were 6.7 μm and 10 μm, compared to the as-reflowed bonding thicknesses of 6 μm and 7 μm, respectively. Furthermore, shear strength degradation rates for 100 ppm and 300 ppm Al(Si) alloy additions were at least 19.5%-26.2%. The cause of the improvement in thermal cycling reliability was analyzed using the (Al,Cu)-Sn, Si-Sn and Al-Sn phases dispersed around the Cu6Sn5 intermetallic at the solder matrix and bonding interfaces. From these results, we propose the possibility of a mid-temperature Sn-0.5Cu(Pd)-Al(Si)-Ge Pb-free solder for automotive engine compartment electronics.

Bonding Diamond To Metal In Electronic Circuits

NASA Technical Reports Server (NTRS)

Jacquez, Andrew E.

1993-01-01

Improved technique for bonding diamond to metal evolved from older technique of soldering or brazing and more suitable for fabrication of delicate electronic circuits. Involves diffusion bonding, developed to take advantage of electrically insulating, heat-conducting properties of diamond, using small diamond bars as supports for slow-wave transmission-line structures in traveling-wave-tube microwave amplifiers. No fillets or side coats formed because metal bonding strips not melted. Technique also used to mount such devices as transistors and diodes electrically insulated from, but thermally connected to, heat sinks.

Kinetic studies of chemical shrinkage and residual stress formation in thermoset epoxy adhesives under confined curing conditions

NASA Astrophysics Data System (ADS)

Schumann, M.; Geiß, P. L.

2015-05-01

Faultless processing of thermoset polymers in demanding applications requires a profound mastering of the curing kinetics considering both the physico-chemical changes in the transition from the liquid to the solid state and the consolidation of the polymers network in the diffusion controlled curing regime past the gel point. Especially in adhesive joints shrinkage stress occurring at an early state of the curing process under confined conditions is likely to cause defects due to local debonding and thus reduce their strength and durability1. Rheometry is considered the method of choice to investigate the change of elastic and viscous properties in the progress of curing. Drawbacks however relate to experimental challenges in accessing the full range of kinetic parameters of thermoset resins with low initial viscosity from the very beginning of the curing reaction to the post-cure consolidation of the polymer due to the formation of secondary chemical bonds. Therefore the scope of this study was to interrelate rheological data with results from in-situ measurements of the shrinkage stress formation in adhesive joints and with the change of refractive index in the progress of curing. This combination of different methods has shown to be valuable in gaining advanced insight into the kinetics of the curing reaction. The experimental results are based on a multi component thermoset epoxy-amine adhesive.

The covalently bound diazo group as an infrared probe for hydrogen bonding environments.

PubMed

You, Min; Liu, Liyuan; Zhang, Wenkai

2017-07-26

Covalently bound diazo groups are frequently found in biomolecular substrates. The C[double bond, length as m-dash]N[double bond, length as m-dash]N asymmetric stretching vibration (ν as ) of the diazo group has a large extinction coefficient and appears in an uncongested spectral region. To evaluate the solvatochromism of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band for studying biomolecules, we recorded the infrared (IR) spectra of a diazo model compound, 2-diazo-3-oxo-butyric acid ethyl ester, in different solvents. The width of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band was linearly dependent on the Kamlet-Taft solvent parameter, which reflects the polarizability and hydrogen bond accepting ability of the solvent. Therefore, the width of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band could be used to probe these properties for a solvent. We found that the position of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band was linearly correlated with the density of hydrogen bond donor groups in the solvent. We studied the relaxation dynamics and spectral diffusion of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band of a natural amino acid, 6-diazo-5-oxo-l-norleucine, in water using nonlinear IR spectroscopy. The relaxation and spectral diffusion time constants of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band were similar to those of the N[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band. We concluded that the position and width of the C[double bond, length as m-dash]N[double bond, length as m-dash]N ν as band of the diazo group could be used to probe the hydrogen bond donating and accepting ability of a solvent, respectively. These results suggest that the diazo group could be used as a site-specific IR probe for the local hydration environments.

Composite drill pipe

DOEpatents

Leslie, James C [Fountain Valley, CA; Leslie, II, James C.; Heard, James [Huntington Beach, CA; Truong, Liem , Josephson; Marvin, Neubert [Huntington Beach, CA; Hans, [Anaheim, CA

2008-12-02

A composite pipe segment is formed to include tapered in wall thickness ends that are each defined by opposed frustoconical surfaces conformed for self centering receipt and intimate bonding contact within an annular space between corresponding surfaces of a coaxially nested set of metal end pieces. The distal peripheries of the nested end pieces are then welded to each other and the sandwiched and bonded portions are radially pinned. The composite segment may include imbedded conductive leads and the axial end portions of the end pieces are shaped to form a threaded joint with the next pipe assembly that includes a contact ring in one pipe assembly pierced by a pointed contact in the other to connect the corresponding leads across the joint.

Methods for Using Durable Adhesively Bonded Joints for Sandwich Structures

NASA Technical Reports Server (NTRS)

Smeltzer, Stanley S., III (Inventor); Lundgren, Eric C. (Inventor)

2016-01-01

Systems, methods, and apparatus for increasing durability of adhesively bonded joints in a sandwich structure. Such systems, methods, and apparatus includes an first face sheet and an second face sheet as well as an insert structure, the insert structure having a first insert face sheet, a second insert face sheet, and an insert core material. In addition, sandwich core material is arranged between the first face sheet and the second face sheet. A primary bondline may be coupled to the face sheet(s) and the splice. Further, systems, methods, and apparatus of the present disclosure advantageously reduce the load, provide a redundant path, reduce structural fatigue, and/or increase fatigue life.

Systems, Apparatuses, and Methods for Using Durable Adhesively Bonded Joints for Sandwich Structures

NASA Technical Reports Server (NTRS)

Smeltzer, III, Stanley S. (Inventor); Lundgren, Eric C. (Inventor)

2014-01-01

Systems, methods, and apparatus for increasing durability of adhesively bonded joints in a sandwich structure. Such systems, methods, and apparatus includes an first face sheet and an second face sheet as well as an insert structure, the insert structure having a first insert face sheet, a second insert face sheet, and an insert core material. In addition, sandwich core material is arranged between the first face sheet and the second face sheet. A primary bondline may be coupled to the face sheet(s) and the splice. Further, systems, methods, and apparatus of the present disclosure advantageously reduce the load, provide a redundant path, reduce structural fatigue, and/or increase fatigue life.

Cyclic debonding of adhesively bonded composites

NASA Technical Reports Server (NTRS)

Mall, S.; Johnson, W. S.; Everett, R. A., Jr.

1982-01-01

The fatigue behavior of a simple composite to composite bonded joint was analyzed. The cracked lap shear specimen subjected to constant amplitude cyclic loading was studied. Two specimen geometries were tested for each bonded system: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies; and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode (peel) loading and that region was close to the adhesive strap interface.

Influence of interface ply orientation on fatigue damage of adhesively bonded composite joints

NASA Technical Reports Server (NTRS)

Johnson, W. S.; Mall, S.

1985-01-01

An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg nd 45 deg interface plies. Damage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.

Influence of interface ply orientation on fatigue damage of adhesively bonded composite joints

NASA Technical Reports Server (NTRS)

Johnson, W. S.; Mall, S.

1986-01-01

An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg and 45 deg interface plies. Damaage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.

Composite Technology for Exploration

NASA Technical Reports Server (NTRS)

Fikes, John

2017-01-01

The CTE (Composite Technology for Exploration) Project will develop and demonstrate critical composites technologies with a focus on joints that utilize NASA expertise and capabilities. The project will advance composite technologies providing lightweight structures to support future NASA exploration missions. The CTE project will demonstrate weight-saving, performance-enhancing bonded joint technology for Space Launch System (SLS)-scale composite hardware.

Multispectral diffuse optical tomography of finger joints

NASA Astrophysics Data System (ADS)

Lighter, Daniel; Filer, Andrew; Dehghani, Hamid

2017-07-01

Rheumatoid arthritis (RA) is a chronic inflammatory disease characterized by synovial inflammation. The current treatment paradigm for earlier, more aggressive therapy places importance on development of functional imaging modalities, capable of quantifying joint changes at the earliest stages. Diffuse optical tomography (DOT) has shown great promise in this regard, due to its cheap, non-invasive, non-ionizing and high contrast nature. Underlying pathological activity in afflicted joints leads to altered optical properties of the synovial region, with absorption and scattering increasing. Previous studies have used these optical changes as features for classifying diseased joints from healthy. Non-tomographic, single wavelength, continuous wave (CW) measurements of trans-illuminated joints have previously reported achieving this with specificity and sensitivity in the range 80 - 90% [1]. A single wavelength, frequency domain DOT system, combined with machine learning techniques, has been shown to achieve sensitivity and specificity in the range of 93.8 - 100% [2]. A CW system is presented here which collects data at 5 wavelengths, enabling reconstruction of pathophysiological parameters such as oxygenation and total hemoglobin, with the aim of identifying localized hypoxia and angiogenesis associated with inflammation in RA joints. These initial studies focus on establishing levels of variation in recovered parameters from images of healthy controls.

Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

NASA Astrophysics Data System (ADS)

Pun, Kelvin P. L.; Islam, M. N.; Rotanson, Jason; Cheung, Chee-wah; Chan, Alan H. S.

2018-05-01

Low-temperature soldering constitutes a promising solution in interconnect technology with the increasing trend of heat-sensitive materials in integrated circuit packaging. Experimental work was carried out to investigate the effect of electroless Ni/electroless Pd/immersion gold (ENEPIG) layer thicknesses on Sn-Bi-Ag solder joint integrity during extended reflow at peak temperatures as low as 175°C. Optimizations are proposed to obtain reliable solder joints through analysis of interfacial microstructure with the resulting joint integrity under extended reflow time. A thin Ni(P) layer with thin Pd led to diffusion of Cu onto the interface resulting in Ni3Sn4 intermetallic compound (IMC) spalling with the formation of thin interfacial (Ni,Cu)3Sn4 IMCs which enhance the robustness of the solder after extended reflow, while thick Ni(P) with thin Pd resulted in weakened solder joints with reflow time due to thick interfacial Ni3Sn4 IMCs with the entrapped brittle Bi-phase. With a suitable thin Ni(P), the Pd thickness has to be optimized to prevent excessive Ni-P consumption and early Cu outward diffusion to enhance the solder joint during extended reflow. Based on these findings, suitable Ni(P) and Pd thicknesses of ENEPIG are recommended for the formation of robust low-temperature solder joints.

Chemical insight from density functional modeling of molecular adsorption: Tracking the bonding and diffusion of anthracene derivatives on Cu(111) with molecular orbitals

NASA Astrophysics Data System (ADS)

Wyrick, Jonathan; Einstein, T. L.; Bartels, Ludwig

2015-03-01

We present a method of analyzing the results of density functional modeling of molecular adsorption in terms of an analogue of molecular orbitals. This approach permits intuitive chemical insight into the adsorption process. Applied to a set of anthracene derivates (anthracene, 9,10-anthraquinone, 9,10-dithioanthracene, and 9,10-diselenonanthracene), we follow the electronic states of the molecules that are involved in the bonding process and correlate them to both the molecular adsorption geometry and the species' diffusive behavior. We additionally provide computational code to easily repeat this analysis on any system.

Joint reconstruction of PET-MRI by exploiting structural similarity

NASA Astrophysics Data System (ADS)

Ehrhardt, Matthias J.; Thielemans, Kris; Pizarro, Luis; Atkinson, David; Ourselin, Sébastien; Hutton, Brian F.; Arridge, Simon R.

2015-01-01

Recent advances in technology have enabled the combination of positron emission tomography (PET) with magnetic resonance imaging (MRI). These PET-MRI scanners simultaneously acquire functional PET and anatomical or functional MRI data. As function and anatomy are not independent of one another the images to be reconstructed are likely to have shared structures. We aim to exploit this inherent structural similarity by reconstructing from both modalities in a joint reconstruction framework. The structural similarity between two modalities can be modelled in two different ways: edges are more likely to be at similar positions and/or to have similar orientations. We analyse the diffusion process generated by minimizing priors that encapsulate these different models. It turns out that the class of parallel level set priors always corresponds to anisotropic diffusion which is sometimes forward and sometimes backward diffusion. We perform numerical experiments where we jointly reconstruct from blurred Radon data with Poisson noise (PET) and under-sampled Fourier data with Gaussian noise (MRI). Our results show that both modalities benefit from each other in areas of shared edge information. The joint reconstructions have less artefacts and sharper edges compared to separate reconstructions and the ℓ2-error can be reduced in all of the considered cases of under-sampling.

Bonding and Integration Technologies for Silicon Carbide Based Injector Components

NASA Technical Reports Server (NTRS)

Halbig, Michael C.; Singh, Mrityunjay

2008-01-01

Advanced ceramic bonding and integration technologies play a critical role in the fabrication and application of silicon carbide based components for a number of aerospace and ground based applications. One such application is a lean direct injector for a turbine engine to achieve low NOx emissions. Ceramic to ceramic diffusion bonding and ceramic to metal brazing technologies are being developed for this injector application. For the diffusion bonding, titanium interlayers (PVD and foils) were used to aid in the joining of silicon carbide (SiC) substrates. The influence of such variables as surface finish, interlayer thickness (10, 20, and 50 microns), processing time and temperature, and cooling rates were investigated. Microprobe analysis was used to identify the phases in the bonded region. For bonds that were not fully reacted an intermediate phase, Ti5Si3Cx, formed that is thermally incompatible in its thermal expansion and caused thermal stresses and cracking during the processing cool-down. Thinner titanium interlayers and/or longer processing times resulted in stable and compatible phases that did not contribute to microcracking and resulted in an optimized microstructure. Tensile tests on the joined materials resulted in strengths of 13-28 MPa depending on the SiC substrate material. Non-destructive evaluation using ultrasonic immersion showed well formed bonds. For the joining technology of brazing Kovar fuel tubes to silicon carbide, preliminary development of the joining approach has begun. Various technical issues and requirements for the injector application are addressed.

Strength and Mechanics of Bonded Scarf Joints for Repair of Composite Materials

NASA Technical Reports Server (NTRS)

Pipes, R. B.; Adkins, D. W.

1982-01-01

Experimental and analytical investigations of scarf joints indicate that slight bluntness of adherend tips induces adhesive stress concentrations which significantly reduce joint strength, and the stress distribution through the adhesive thickness is non-uniform and has significant stress concentrations at the ends of the joint. The laminate stacking sequence can have important effects on the adhesive stress distribution. A significant improvement in joint strength is possible by increasing overlap at the expense of raising the repair slightly above the original surface. Although a surface grinder was used to make most experimental specimens, a hand held rotary bur can make a surprisingly good scarf. Scarf joints wit doublers on one side, such as might be used for repair, bend under tensile loads and may actually be weaker than joints without doublers.

CVD aluminiding process for producing a modified platinum aluminide bond coat for improved high temperature performance

NASA Technical Reports Server (NTRS)

Nagaraj, Bangalore A. (Inventor); Williams, Jeffrey L. (Inventor)

2003-01-01

A method of depositing by chemical vapor deposition a modified platinum aluminide diffusion coating onto a superalloy substrate comprising the steps of applying a layer of a platinum group metal to the superalloy substrate; passing an externally generated aluminum halide gas through an internal gas generator which is integral with a retort, the internal gas generator generating a modified halide gas; and co-depositing aluminum and modifier onto the superalloy substrate. In one form, the modified halide gas is hafnium chloride and the modifier is hafnium with the modified platinum aluminum bond coat comprising a single phase additive layer of platinum aluminide with at least about 0.5 percent hafnium by weight percent and about 1 to about 15 weight percent of hafnium in the boundary between a diffusion layer and the additive layer. The bond coat produced by this method is also claimed.

Laminar flow control SPF/08 feasibility demonstration

NASA Astrophysics Data System (ADS)

Ecklund, R. C.; Williams, N. R.

1981-10-01

The feasibility of applying superplastic forming/diffusion bonding (SPF/DB) technology to laminar flow control (LFC) system concepts was demonstrated. Procedures were developed to produce smooth, flat titanium panels, using thin -0.016 inch sheets, meeting LFC surface smoothness requirements. Two large panels 28 x 28 inches were fabricated as final demonstration articles. The first was flat on the top and bottom sides demonstrating the capability of the tooling and the forming and diffusion bonding procedures to produce flat, defect free surfaces. The second panel was configurated for LFC porous panel treatment by forming channels with dimpled projections on the top side. The projections were machined away leaving holes extending into the panel. A perforated titanium sheet was adhesively bonded over this surface to complete the LFC demonstration panel. The final surface was considered flat enough to meet LFC requirements for a jet transport aircraft in cruising flight.

Current-Assisted Diffusion Bonding of Extruded Ti-22Al-25Nb Alloy by Spark Plasma Sintering: Interfacial Microstructure and Mechanical Properties

NASA Astrophysics Data System (ADS)

Yang, Jianlei; Wang, Guofeng; Jiao, Xueyan; Gu, Yibin; Liu, Qing; Li, You

2018-05-01

Spark plasma sintering (SPS) technology was used to current-assisted bond extruded Ti-22Al-25Nb alloy. The effects of bonding temperature (920-980 °C) and bonding time (10-30 min) on the microstructure evolution and shear strength of this alloy were investigated systematically. The temperature distribution in the specimen during the current-assisted bonding process was also analyzed by numerical simulation. It is noted that the highest temperature was obtained at the bonding interface. As the bonding temperature and bonding time increased, the voids in the interface shrank increasingly until they vanished. A complete metallurgical bonding interface could be produced at 960 °C/20 min/10 MPa, exhibiting the highest shear strength of 269.3 MPa. In addition, the shear strength of the bonded specimen depended on its interfacial microstructure. With increased bonding temperature, the fracture mode transformed from the intergranular fracture at the bonding interface to the cleavage fracture in the substrate.

Review of methyl methacrylate (MMA)/tributylborane (TBB)-initiated resin adhesive to dentin.

PubMed

Taira, Yohsuke; Imai, Yohji

2014-01-01

This review, focusing mainly on research related to methyl methacrylate/tributylborane (MMA/TBB) resin, presents the early history of dentin bonding and MMA/TBB adhesive resin, followed by characteristics of resin bonding to dentin. Bond strengths of MMA/TBB adhesive resin to different adherends were discussed and compared with other bonding systems. Factors affecting bond strength (such as conditioners, primers, and medicaments used for dental treatment), bonding mechanism, and polymerization characteristics of MMA/TBB resin were also discussed. This review further reveals the unique adhesion features between MMA/TBB resin and dentin: in addition to monomer diffusion into the demineralized dentin surface, graft polymerization of MMA onto dentin collagen and interfacial initiation of polymerization at the resin-dentin interface provide the key bonding mechanisms.

Behind the Mpemba paradox

PubMed Central

Sun, Chang Qing

2015-01-01

Mpemba paradox results from hydrogen-bond anomalous relaxation. Heating stretches the O:H nonbond and shortens the H‒O bond via Coulomb coupling; cooling reverses this process to emit heat at a rate depending on its initial storage. Skin ultra-low mass density raises the thermal diffusivity and favors outward heat flow from the liquid. PMID:27227000

High-resolution x-ray guided three-dimensional diffuse optical tomography of joint tissues in hand osteoarthritis: Morphological and functional assessments

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yuan Zhen; Zhang Qizhi; Sobel, Eric S.

Purpose: The aim of this study was to investigate the potential use of multimodality functional imaging techniques to identify the quantitative optical findings that can be used to distinguish between osteoarthritic and normal finger joints. Methods: Between 2006 and 2009, the distal interphalangeal finger joints from 40 female subjects including 22 patients and 18 healthy controls were examined clinically and scanned by a hybrid imaging system. This system integrated x-ray tomosynthetic setup with a diffuse optical imaging system. Optical absorption and scattering images were recovered based on a regularization-based hybrid reconstruction algorithm. A receiver operating characteristic curve was used tomore » calculate the statistical significance of specific optical features obtained from osteoarthritic and healthy joints groups. Results: The three-dimensional optical and x-ray images captured made it possible to quantify optical properties and joint space width of finger joints. Based on the recovered optical absorption and scattering parameters, the authors observed statistically significant differences between healthy and osteoarthritis finger joints. Conclusions: The statistical results revealed that sensitivity and specificity values up to 92% and 100%, respectively, can be achieved when optical properties of joint tissues were used as classifiers. This suggests that these optical imaging parameters are possible indicators for diagnosing osteoarthritis and monitoring its progression.« less

Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers

NASA Astrophysics Data System (ADS)

Gandhi, D. D.; Singh, A. P.; Lane, M.; Eizenberg, M.; Ramanath, G.

2007-04-01

We demonstrate the use of polyallylamine hydrochloride (PAH)-polystyrene sulfonate (PSS) nanolayers to block Cu transport into silica. Cu/PSS-PAH/SiO2 structures show fourfold enhancement in device failure times during bias thermal annealing at 200 °C at an applied electric field of 2 MV/cm, when compared with structures with pristine Cu-SiO2 interfaces. Although the bonding at both Cu-PSS and PAH-SiO2 interfaces are strong, the interfacial toughness measured by the four-point bend tests is ˜2 Jm-2. Spectroscopic analysis of fracture surfaces reveals that weak electrostatic bonding at the PSS-PAH interface is responsible for the low toughness. Similar behavior is observed for Cu-SiO2 interfaces modified with other polyelectrolyte bilayers that inhibit Cu diffusion. Thus, while strong bonding at Cu-barrier and barrier-dielectric interfaces may be sufficient for blocking copper transport across polyelectrolyte bilayers, strong interlayer molecular bonding is a necessary condition for interface toughening. These findings are of importance for harnessing MNLs for use in future device wiring applications.

Research Status on Bonding Behavior of Prefabricated Concrete Shear Wall

NASA Astrophysics Data System (ADS)

Wang, Donghui; Liu, Xudong; Wang, Sheng; Li, Shanshan

2018-03-01

Prefabricated shear wall structure adapts to the development and requirements of China’s residential industrialization. The key to the prefabricated concrete shear wall structure is the connection between the prefabricated members, where the reliability of the connection of the concrete joint is related to the overall performance and seismic effect of the structure. In this paper, the microstructures of the joint surface and shear properties are analysed, and the formula for calculating the shear strength of the joint is obtained.

Experimental study on joining of AA6063 and AISI 1040 steel

NASA Astrophysics Data System (ADS)

Hynes, N. Rajesh Jesudoss; Raja, S.

2018-05-01

Feasibility of joining of dissimilar metals with different physical, chemical and thermal properties such as AA6063 alloy and AISI 1040 steel is worthwhile study, since it has tremendous applications in all most of all engineering domains. The mechanism of bonding is studied using scanning electron microscopy. Impact strength of AA2024/AISI joints, axial shortening distance, micro hardness distribution and joint strength are determined. Micro hardness profile shows increased hardness value at the joint interface, due to grain refinement.

Evaluation of high temperature structural adhesives for extended service. [supersonic cruise aircraft research

NASA Technical Reports Server (NTRS)

Hill, S. G.

1981-01-01

Eight different Ti-6Al-4V surface treatments were investigated for each of 10 candidate resins. Primers (two for each resin) were studied for appropriate cure and thickness and initial evaluation of bond joints began using various combinations of the adhesive resins and surface treatments. Surface failure areas of bonded titanium coupons were analyzed by electron microscopy and surface chemical analysis techniques. Results of surface characterization and failure analysis are described for lap shear bond joints occurring with adhesive systems consisting of: (1) LARC-13 adhesive, Pasa jell surface treatment; (2) LARC-13 adhesive, 10 volt CAA treatment; (3) PPQ adhesive, 10 volt CAA treatment; and (4) PPQ adhesive, 5 volt CAA treatment. The failure analysis concentrated on the 10,000 hr 505K (450 F) exposed specimens which exhibited adhesive failure. Environmental exposure data being generated on the PPQ-10 volt CAA and the LARC-TPI-10 volt CAA adhesive systems is included.

Durability predictions of adhesively bonded composite structures using accelerated characterization methods

NASA Technical Reports Server (NTRS)

Brinson, H. F.

1985-01-01

The utilization of adhesive bonding for composite structures is briefly assessed. The need for a method to determine damage initiation and propagation for such joints is outlined. Methods currently in use to analyze both adhesive joints and fiber reinforced plastics is mentioned and it is indicated that all methods require the input of the mechanical properties of the polymeric adhesive and composite matrix material. The mechanical properties of polymers are indicated to be viscoelastic and sensitive to environmental effects. A method to analytically characterize environmentally dependent linear and nonlinear viscoelastic properties is given. It is indicated that the methodology can be used to extrapolate short term data to long term design lifetimes. That is, the method can be used for long term durability predictions. Experimental results for near adhesive resins, polymers used as composite matrices and unidirectional composite laminates is given. The data is fitted well with the analytical durability methodology. Finally, suggestions are outlined for the development of an analytical methodology for the durability predictions of adhesively bonded composite structures.

Influence of the bond-slip relationship on the flexural capacity of R.C. joints damaged by corrosion

NASA Astrophysics Data System (ADS)

Imperatore, Stefania

2016-06-01

In moderate and aggressive environmental condition, old reinforced concrete structures are often subjected to corrosive phenomena. Corrosion causes cracking, loss of diameter in reinforcement and variation of the bond behavior between steel and concrete. Then, in presence of cyclic actions like the seismic ones, old R.C. elements vary their ultimate drift, ductility, plastic rotation capacity and energy dissipation with the corrosion level. The problem is of current interest: the issue has been introduced in some paragraph of the Model Code 2010 and a committee is now drafting a new document on assessment strategies on existing concrete structures also damaged by corrosion. In this work, a first step on the analysis of the impact of the corrosion on the seismic behavior of R.C. elements is assessed: by mean FEM analyses, of a poor detailed column/foundation joint is analyzed in a parametric way in order to evaluate the influence of the bond-slip degradation by corrosion on the element flexural capacity.

Process Of Bonding Copper And Tungsten

DOEpatents

Slattery, Kevin T.; Driemeyer, Daniel E.; Davis, John W.

2000-07-18

Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

Annealing of gallium nitride under high-N 2 pressure

NASA Astrophysics Data System (ADS)

Porowski, S.; Jun, J.; Krukowski, S.; Grzegory, I.; Leszczynski, M.; Suski, T.; Teisseyre, H.; Foxon, C. T.; Korakakis, D.

1999-04-01

GaN is the key material for blue and ultraviolet optoelectronics. It is a strongly bonded wurztite structure semiconductor with the direct energy gap 3.5 eV. Due to strong bonding, the diffusion processes require high temperatures, above 1300 K. However at this temperature range at ambient pressure, GaN becomes unstable and dissociates into Ga and N 2. Therefore high pressure of N 2 is required to study the diffusion and other annealing related processes. We studied annealing of bulk GaN nitride single crystals grown under high pressure and also annealing of homo- and heteroepitaxial GaN layers grown by MOCVD technique. Annealing at temperatures above 1300 K influences strongly the structural and optical properties of GaN crystals and layers. At this temperature diffusion of the Mg and Zn acceptors have been observed. In spite of very interesting experimental observations the understanding of microscopic mechanisms of these processes is limited.

Compact cladding-pumped planar waveguide amplifier and fabrication method

DOEpatents

Bayramian, Andy J.; Beach, Raymond J.; Honea, Eric; Murray, James E.; Payne, Stephen A.

2003-10-28

A low-cost, high performance cladding-pumped planar waveguide amplifier and fabrication method, for deployment in metro and access networks. The waveguide amplifier has a compact monolithic slab architecture preferably formed by first sandwich bonding an erbium-doped core glass slab between two cladding glass slabs to form a multi-layer planar construction, and then slicing the construction into multiple unit constructions. Using lithographic techniques, a silver stripe is deposited and formed at a top or bottom surface of each unit construction and over a cross section of the bonds. By heating the unit construction in an oven and applying an electric field, the silver stripe is then ion diffused to increase the refractive indices of the core and cladding regions, with the diffusion region of the core forming a single mode waveguide, and the silver diffusion cladding region forming a second larger waveguide amenable to cladding pumping with broad area diodes.

Between Scylla and Charybdis: Hydrophobic Graphene-Guided Water Diffusion on Hydrophilic Substrates

PubMed Central

Kim, Jin-Soo; Choi, Jin Sik; Lee, Mi Jung; Park, Bae Ho; Bukhvalov, Danil; Son, Young-Woo; Yoon, Duhee; Cheong, Hyeonsik; Yun, Jun-Nyeong; Jung, Yousung; Park, Jeong Young; Salmeron, Miquel

2013-01-01

The structure of water confined in nanometer-sized cavities is important because, at this scale, a large fraction of hydrogen bonds can be perturbed by interaction with the confining walls. Unusual fluidity properties can thus be expected in the narrow pores, leading to new phenomena like the enhanced fluidity reported in carbon nanotubes. Crystalline mica and amorphous silicon dioxide are hydrophilic substrates that strongly adsorb water. Graphene, on the other hand, interacts weakly with water. This presents the question as to what determines the structure and diffusivity of water when intercalated between hydrophilic substrates and hydrophobic graphene. Using atomic force microscopy, we have found that while the hydrophilic substrates determine the structure of water near its surface, graphene guides its diffusion, favouring growth of intercalated water domains along the C-C bond zigzag direction. Molecular dynamics and density functional calculations are provided to help understand the highly anisotropic water stripe patterns observed. PMID:23896759

Application of High-Impact Polystyrene (HIPS) as a Graphene Nanoparticle Reinforced Composite Thermoplastic Adhesive

NASA Astrophysics Data System (ADS)

Stitt, Erik

Adhesive bonding is a more efficient joining method for composites than traditional mechanical fasteners and provides advantages in weight reduction, simplicity, and cost. In addition, the utilization of mechanical fasteners introduces stress concentrations and damage to the fiber-matrix interface. Adhesive bonding with thermoset polymers distributes mechanical loads but also makes disassembly for repair and recycling difficult. The ability to utilize thermoplastic polymers as adhesives offers an approach to address these limitations and can even produce a reversible adhesive joining technology through combining conductive nanoparticles with a thermoplastic polymer. The incorporation of the conductive nanoparticles allows for selective heating of the adhesive via exposure to electromagnetic (EM) radiation and simultaneously can augment the mechanical properties of the adhesive and the adhesive joint. This approach provides a versatile mechanism for efficiently creating and reversing structural adhesive joints across a wide range of materials. In this work, a high-impact polystyrene (HIPS) co-polymer containing butadiene as a toughness modifier is compounded with graphene nano-platelets (GnP) for investigation as a thermoplastic adhesive. The properties of the bulk composite adhesive are tailored by altering the morphology, dispersion, and concentration of GnP. The thermal response of the material to EM radiation in the microwave frequency spectrum was investigated and optimized. Surface treatments of the adhesive films were explored to enhance the viability of this nanoparticle thermoplastic polymer to function as a reversible adhesive. As a result, it has been shown that lap-shear strengths of multi-material joints produced from aforementioned thermoplastic adhesives were comparable to similar thermoset bonded joints.

A review: Application of adhesive bonding on semiconductor interconnection joints

NASA Astrophysics Data System (ADS)

Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Shahimin, Mukhzeer Mohamad; Retnasamy, Vithyacharan

2017-09-01

A comprehensive review on adhesive die bonding is presented in this paper. Adhesive bonding technique involved electrically conductive adhesives that bond by evaporation of a solvent or by curing a bonding agent with three main parameters; heat, pressure, and time. Isotropic conductive adhesive (ICA) and anisotropic conductive adhesive (ACA) are the commonly used adhesive in this technique. In order to achieve and promote a better adhesion of die on the substrate, surface cleaning steps and methods were very crucial. The major challenge faced by this technique is entrapment of the conductive particles between the die and substrate. An adequate amount of conductive particle is needed between the die and substrate in order to avoid increase in contact resistance.

Joining of polymer composite materials

DOE Office of Scientific and Technical Information (OSTI.GOV)

Magness, F.H.

1990-11-01

Under ideal conditions load bearing structures would be designed without joints, thus eliminating a source of added weight, complexity and weakness. In reality the need for accessibility, repair, and inspectability, added to the size limitations imposed by the manufacturing process and transportation/assembly requirements mean that some minimum number of joints will be required in most structures. The designer generally has two methods for joining fiber composite materials, adhesive bonding and mechanical fastening. As the use of thermoplastic materials increases, a third joining technique -- welding -- will become more common. It is the purpose of this document to provide amore » review of the available sources pertinent to the design of joints in fiber composites. The primary emphasis is given to adhesive bonding and mechanical fastening with information coming from documentary sources as old as 1961 and as recent as 1989. A third, shorter section on composite welding is included in order to provide a relatively comprehensive treatment of the subject.« less

Reintroducing electrostatics into macromolecular crystallographic refinement: application to neutron crystallography and DNA hydration.

PubMed

Fenn, Timothy D; Schnieders, Michael J; Mustyakimov, Marat; Wu, Chuanjie; Langan, Paul; Pande, Vijay S; Brunger, Axel T

2011-04-13

Most current crystallographic structure refinements augment the diffraction data with a priori information consisting of bond, angle, dihedral, planarity restraints, and atomic repulsion based on the Pauli exclusion principle. Yet, electrostatics and van der Waals attraction are physical forces that provide additional a priori information. Here, we assess the inclusion of electrostatics for the force field used for all-atom (including hydrogen) joint neutron/X-ray refinement. Two DNA and a protein crystal structure were refined against joint neutron/X-ray diffraction data sets using force fields without electrostatics or with electrostatics. Hydrogen-bond orientation/geometry favors the inclusion of electrostatics. Refinement of Z-DNA with electrostatics leads to a hypothesis for the entropic stabilization of Z-DNA that may partly explain the thermodynamics of converting the B form of DNA to its Z form. Thus, inclusion of electrostatics assists joint neutron/X-ray refinements, especially for placing and orienting hydrogen atoms. Copyright © 2011 Elsevier Ltd. All rights reserved.

Reintroducing Electrostatics into Macromolecular Crystallographic Refinement: Application to Neutron Crystallography and DNA Hydration

PubMed Central

Fenn, Timothy D.; Schnieders, Michael J.; Mustyakimov, Marat; Wu, Chuanjie; Langan, Paul; Pande, Vijay S.; Brunger, Axel T.

2011-01-01

Summary Most current crystallographic structure refinements augment the diffraction data with a priori information consisting of bond, angle, dihedral, planarity restraints and atomic repulsion based on the Pauli exclusion principle. Yet, electrostatics and van der Waals attraction are physical forces that provide additional a priori information. Here we assess the inclusion of electrostatics for the force field used for all-atom (including hydrogen) joint neutron/X-ray refinement. Two DNA and a protein crystal structure were refined against joint neutron/X-ray diffraction data sets using force fields without electrostatics or with electrostatics. Hydrogen bond orientation/geometry favors the inclusion of electrostatics. Refinement of Z-DNA with electrostatics leads to a hypothesis for the entropic stabilization of Z-DNA that may partly explain the thermodynamics of converting the B form of DNA to its Z form. Thus, inclusion of electrostatics assists joint neutron/X-ray refinements, especially for placing and orienting hydrogen atoms. PMID:21481775

Effect of Composite Substrates on the Mechanical Behavior of Brazed Joints in Metal-Composite System

NASA Technical Reports Server (NTRS)

Singh, M.; Morscher, Gregory N.; Shpargel, Tarah; Asthana, Rajiv

2006-01-01

Advanced composite components are being considered for a wide variety of demanding applications in aerospace, space exploration, and ground based systems. A number of these applications require robust integration technologies to join dissimilar materials (metalcomposites) into complex structural components. In this study, three types of composites (C-C, C-SiC, and SiC-SiC) were vacuum brazed to commercially pure Ti using the active metal braze alloy Cusil-ABA (63Ag-35.3Cu-1.75Ti). Composite substrates with as fabricated and polished surfaces were used for brazing. The microstructure and composition of the joint, examined using scanning electron microscopy (SEM) coupled with energy dispersive spectroscopy (EDS), showed sound metallurgical bonding in all systems. The butt strap tensile (BST) test was performed on bonded specimens at room and elevated temperatures. Effect of substrate composition, interlaminar properties, and surface roughness on the mechanical properties and failure behavior of joints will be discussed.

Microstructure and interfacial reactions of soldering magnesium alloy AZ31B

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu Liming, E-mail: liulm@dlut.edu.cn; Wu Zhonghui

2010-01-15

In this paper, economic and innoxious solder alloys with low melting temperature were designed for AZ31B. Their chemical composition and relevant parameters were investigated for a high-performance structure of bonding region. Results of microstructure observation showed that Zn-enriched phases disappeared and {alpha}-Mg existed in the joints in the form of coarse dendrites by increasing the concentration of Mg in the solder alloys. Water cooling with a high cooling rate was adopted in experiments. Experimental research showed that high cooling rate restricted the grains of {alpha}-Mg as the equiaxed dendrites, which was about 1/5 of the coarse dendrite but their numbermore » was more than 40-50 times. Both morphology with typical fracture and the analysis on X-ray diffraction fracture indicated that equiaxed dendrites significantly improved the mechanical property of the joints. Necking phenomenon occurred in the bonding region was in favor of the improvement of joint shear strength.« less

Release Resistant Electrical Interconnections For Mems Devices

DOEpatents

Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.

2005-02-22

A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

Loading Analysis of Composite Wind Turbine Blade for Fatigue Life Prediction of Adhesively Bonded Root Joint

NASA Astrophysics Data System (ADS)

Salimi-Majd, Davood; Azimzadeh, Vahid; Mohammadi, Bijan

2015-06-01

Nowadays wind energy is widely used as a non-polluting cost-effective renewable energy resource. During the lifetime of a composite wind turbine which is about 20 years, the rotor blades are subjected to different cyclic loads such as aerodynamics, centrifugal and gravitational forces. These loading conditions, cause to fatigue failure of the blade at the adhesively bonded root joint, where the highest bending moments will occur and consequently, is the most critical zone of the blade. So it is important to estimate the fatigue life of the root joint. The cohesive zone model is one of the best methods for prediction of initiation and propagation of debonding at the root joint. The advantage of this method is the possibility of modeling the debonding without any requirement to the remeshing. However in order to use this approach, it is necessary to analyze the cyclic loading condition at the root joint. For this purpose after implementing a cohesive interface element in the Ansys finite element software, one blade of a horizontal axis wind turbine with 46 m rotor diameter was modelled in full scale. Then after applying loads on the blade under different condition of the blade in a full rotation, the critical condition of the blade is obtained based on the delamination index and also the load ratio on the root joint in fatigue cycles is calculated. These data are the inputs for fatigue damage growth analysis of the root joint by using CZM approach that will be investigated in future work.

Stainless Steel to Titanium Bimetallic Transitions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kaluzny, J. A.; Grimm, C.; Passarelli, D.

In order to use stainless steel piping in an LCLS-II (Linac Coherent Light Source Upgrade) cryomodule, stainless steel to titanium bimetallic transitions are needed to connect the stainless steel piping to the titanium cavity helium vessel. Explosion bonded stainless steel to titanium transition pieces and bimetallic transition material samples have been tested. A sample transition tube was subjected to tests and x-ray examinations between tests. Samples of the bonded joint material were impact and tensile tested at room temperature as well as liquid helium temperature. The joint has been used successfully in horizontal tests of LCLS-II cavity helium vessels andmore » is planned to be used in LCLS-II cryomodules. Results of material sample and transition tube tests will be presented.« less

Finite Element Modeling of Viscoelastic Behavior and Interface Damage in Adhesively Bonded Joints

DTIC Science & Technology

2012-01-01

eccentricity of the axis of a lap joint gives rise to transverse or peel stresses at the Report Documentation Page Form ApprovedOMB No. 0704-0188...Computers and Structures 29, 1011 (1988). 21 S. Roy and J. N. Reddy, Tire Sci. Technol. 16, 146 (1988). 22 S. Roy and J. N. Reddy, Intl. J. Numer

Effect of adhesive stiffness and thickness on stress distributions in structural finger joints

Treesearch

Leslie H. Groom; Robert J. Leichti

1994-01-01

Environmental, political. and socioeconomic actions over the past several years have resulted in a decreased wood supply at a time when there is an increased demand for forest products. This combination of increased demand and decreased supply has forced more emphasis on engineered wood products, a varied category usually connected with adhesively-bonded end joints, of...

Effect of adhesive stiffness and thickness on stress distributions in structural finger joints

Treesearch

Leslie H. Groom; Robert J. Leichti

1994-01-01

Environmental, political, and socioeconomic actions over the past several years have resulted in a decreased wood supply at a time when there is an increased demand for forest products. This combination of increased demand and decreased supply has forced more emphasis on engineered wood products, a varied category usually connected with adhesively-bonded end joints, of...

High-temperature properties of joint interface of VPS-tungsten coated CFC

NASA Astrophysics Data System (ADS)

Tamura, S.; Liu, X.; Tokunaga, K.; Tsunekawa, Y.; Okumiya, M.; Noda, N.; Yoshida, N.

2004-08-01

Tungsten coated carbon fiber composite (CFC) is a candidate material for the high heat flux components in fusion reactors. In order to investigate the high-temperature properties at the joint interface of coating, heat load experiments by using electron beam were performed on VPS-tungsten coated CX-2002U samples. After the heat load test for 3.6 ks at 1400 °C, tungsten-rhenium multilayer (diffusion barrier for carbon) at the joint interface of coating was observed clearly. But, at the temperatures above 1600 °C, the multilayer was disappeared and a tungsten carbide layer was formed in the VPS-tungsten coating. At the temperatures below 1800 °C, the thickness of this layer logarithmically increased with increasing its loading time. At 2000 °C, the growth of the tungsten carbide layer was proportional to the square root of loading time. These results indicate that the diffusion barrier for carbon is not expected to suppress the carbide formation at the joint interface of the VPS-tungsten coating above 1600 °C.

The Influence of Grain Structure on Intermetallic Compound Layer Growth Rates in Fe-Al Dissimilar Welds

NASA Astrophysics Data System (ADS)

Xu, Lei; Robson, Joseph D.; Wang, Li; Prangnell, Philip B.

2018-02-01

The thickness of the intermetallic compound (IMC) layer that forms when aluminum is welded to steel is critical in determining the properties of the dissimilar joints. The IMC reaction layer typically consists of two phases ( η and θ) and many attempts have been made to determine the apparent activation energy for its growth, an essential parameter in developing any predictive model for layer thickness. However, even with alloys of similar composition, there is no agreement of the correct value of this activation energy. In the present work, the IMC layer growth has been characterized in detail for AA6111 aluminum to DC04 steel couples under isothermal annealing conditions. The samples were initially lightly ultrasonically welded to produce a metallic bond, and the structure and thickness of the layer were then characterized in detail, including tracking the evolution of composition and grain size in the IMC phases. A model developed previously for Al-Mg dissimilar welds was adapted to predict the coupled growth of the two phases in the layer, whilst accounting explicitly for grain boundary and lattice diffusion, and considering the influence of grain growth. It has been shown that the intermetallic layer has a submicron grain size, and grain boundary diffusion as well as grain growth plays a critical role in determining the thickening rate for both phases. The model was used to demonstrate how this explains the wide scatter in the apparent activation energies previously reported. From this, process maps were developed that show the relative importance of each diffusion path to layer growth as a function of temperature and time.

Reversible geminate recombination of hydrogen-bonded water molecule pair

NASA Astrophysics Data System (ADS)

Markovitch, Omer; Agmon, Noam

2008-08-01

The (history independent) autocorrelation function for a hydrogen-bonded water molecule pair, calculated from classical molecular dynamics trajectories of liquid water, exhibits a t-3/2 asymptotic tail. Its whole time dependence agrees quantitatively with the solution for reversible diffusion-influenced geminate recombination derived by Agmon and Weiss [J. Chem. Phys. 91, 6937 (1989)]. Agreement with diffusion theory is independent of the precise definition of the bound state. Given the water self-diffusion constant, this theory enables us to determine the dissociation and bimolecular recombination rate parameters for a water dimer. (The theory is indispensable for obtaining the bimolecular rate coefficient.) Interestingly, the activation energies obtained from the temperature dependence of these rate coefficients are similar, rather than differing by the hydrogen-bond (HB) strength. This suggests that recombination requires displacing another water molecule, which meanwhile occupied the binding site. Because these activation energies are about twice the HB strength, cleavage of two HBs may be required to allow pair separation. The autocorrelation function without the HB angular restriction yields a recombination rate coefficient that is larger than that for rebinding to all four tetrahedral water sites (with angular restrictions), suggesting the additional participation of interstitial sites. Following dissociation, the probability of the pair to be unbound but within the reaction sphere rises more slowly than expected, possibly because binding to the interstitial sites delays pair separation. An extended diffusion model, which includes an additional binding site, can account for this behavior.

Free-radicals and advanced chemistries involved in cell membrane organization influence oxygen diffusion and pathology treatment.

PubMed

Petersen, Richard C

2017-01-01

A breakthrough has been discovered in pathology chemistry related to increasing molecular structure that can interfere with oxygen diffusion through cell membranes. Free radicals can crosslink unsaturated low-viscosity fatty acid oils by chain-growth polymerization into more viscous liquids and even solids. Free radicals are released by mitochondria in response to intermittent hypoxia that can increase membrane molecular organization to reduce fluidity and oxygen diffusion in a possible continuing vicious cycle toward pathological disease. Alternate computational chemistry demonstrates molecular bond dynamics in free energy for cell membrane physiologic movements. Paired electrons in oxygen and nitrogen atoms require that oxygen bonds rotate and nitrogen bonds invert to seek polar nano-environments and hide from nonpolar nano-environments thus creating fluctuating instability at a nonpolar membrane and polar biologic fluid interface. Subsequent mechanomolecular movements provide free energy to increase diffusion by membrane transport of molecules and oxygen into the cell, cell-membrane signaling/recognition/defense in addition to protein movements for enzyme mixing. In other chemistry calcium bonds to membrane phosphates primarily on the outer plasma cell membrane surface to influence the membrane firing threshold for excitability and better seal out water permeation. Because calcium is an excellent metal conductor and membrane phosphate headgroups form a semiconductor at the biologic fluid interface, excess electrons released by mitochondria may have more broad dissipation potential by safe conduction through calcium atomic-sized circuits on the outer membrane surface. Regarding medical conditions, free radicals are known to produce pathology especially in age-related disease in addition to aging. Because cancer cell membranes develop extreme polymorphism that has been extensively followed in research, accentuated easily-visualized free-radical models are developed. In terms of treatment, use of vitamin nutrient supplements purported to be antioxidants that remove free radicals has not proved worthwhile in clinical trials presumably due to errors with early antioxidant measurements based on inaccurate colorimetry tests. However, newer covalent-bond shrinkage tests now provide accurate measurements for free-radical inhibitor hydroquinone and other molecules toward drug therapy.

Free-radicals and advanced chemistries involved in cell membrane organization influence oxygen diffusion and pathology treatment

PubMed Central

Petersen, Richard C

2017-01-01

A breakthrough has been discovered in pathology chemistry related to increasing molecular structure that can interfere with oxygen diffusion through cell membranes. Free radicals can crosslink unsaturated low-viscosity fatty acid oils by chain-growth polymerization into more viscous liquids and even solids. Free radicals are released by mitochondria in response to intermittent hypoxia that can increase membrane molecular organization to reduce fluidity and oxygen diffusion in a possible continuing vicious cycle toward pathological disease. Alternate computational chemistry demonstrates molecular bond dynamics in free energy for cell membrane physiologic movements. Paired electrons in oxygen and nitrogen atoms require that oxygen bonds rotate and nitrogen bonds invert to seek polar nano-environments and hide from nonpolar nano-environments thus creating fluctuating instability at a nonpolar membrane and polar biologic fluid interface. Subsequent mechanomolecular movements provide free energy to increase diffusion by membrane transport of molecules and oxygen into the cell, cell-membrane signaling/recognition/defense in addition to protein movements for enzyme mixing. In other chemistry calcium bonds to membrane phosphates primarily on the outer plasma cell membrane surface to influence the membrane firing threshold for excitability and better seal out water permeation. Because calcium is an excellent metal conductor and membrane phosphate headgroups form a semiconductor at the biologic fluid interface, excess electrons released by mitochondria may have more broad dissipation potential by safe conduction through calcium atomic-sized circuits on the outer membrane surface. Regarding medical conditions, free radicals are known to produce pathology especially in age-related disease in addition to aging. Because cancer cell membranes develop extreme polymorphism that has been extensively followed in research, accentuated easily-visualized free-radical models are developed. In terms of treatment, use of vitamin nutrient supplements purported to be antioxidants that remove free radicals has not proved worthwhile in clinical trials presumably due to errors with early antioxidant measurements based on inaccurate colorimetry tests. However, newer covalent-bond shrinkage tests now provide accurate measurements for free-radical inhibitor hydroquinone and other molecules toward drug therapy. PMID:29202036

Hydrogen bonding and transportation properties of water confined in the single-walled carbon nanotube in the pulse-field

NASA Astrophysics Data System (ADS)

Zhou, Min; Hu, Ying; Liu, Jian-chuan; Cheng, Ke; Jia, Guo-zhu

2017-10-01

In this paper, molecular dynamics simulations were performed to investigate the transportation and hydrogen bonding dynamics of water confined in (6, 6) single-walled carbon nanotube (SWCNT) in the absence and presence of time-dependent pulse-field. The effects of pulse-field range from microwave to ultraviolet frequency on the diffusivity and hydrogen bonding of confined water were analyzed. The significant confinement effect due to the narrow space inside SWCNT was observed.

Water Diffusion through a Titanium Dioxide/Poly(Carbonate Urethane) Nanocomposite for Protecting Cultural Heritage: Interactions and Viscoelastic Behavior

PubMed Central

Abbate, Mario; D’Orazio, Loredana

2017-01-01

Water diffusion through a TiO2/poly (carbonate urethane) nanocomposite designed for the eco-sustainable protection of outdoor cultural heritage stonework was investigated. Water is recognized as a threat to heritage, hence the aim was to gather information on the amount of water uptake, as well as of species of water molecules absorbed within the polymer matrix. Gravimetric and vibrational spectroscopy measurements demonstrated that diffusion behavior of the nanocomposite/water system is Fickian, i.e., diffusivity is independent of concentration. The addition of only 1% of TiO2 nanoparticles strongly betters PU barrier properties and water-repellency requirement is imparted. Defensive action against penetration of water free from, and bonded through, H-bonding association arises from balance among TiO2 hydrophilicity, tortuosity effects and quality of nanoparticle dispersion and interfacial interactions. Further beneficial to antisoiling/antigraffiti action is that water-free fraction was found to be desorbed at a constant rate. In environmental conditions, under which weathering processes are most likely to occur, nanocomposite Tg values remain suitable for heritage treatments. PMID:28902179

A Review of Natural Joint Systems and Numerical Investigation of Bio-Inspired GFRP-to-Steel Joints

PubMed Central

Avgoulas, Evangelos I.; Sutcliffe, Michael P. F.

2016-01-01

There are a great variety of joint types used in nature which can inspire engineering joints. In order to design such biomimetic joints, it is at first important to understand how biological joints work. A comprehensive literature review, considering natural joints from a mechanical point of view, was undertaken. This was used to develop a taxonomy based on the different methods/functions that nature successfully uses to attach dissimilar tissues. One of the key methods that nature uses to join dissimilar materials is a transitional zone of stiffness at the insertion site. This method was used to propose bio-inspired solutions with a transitional zone of stiffness at the joint site for several glass fibre reinforced plastic (GFRP) to steel adhesively bonded joint configurations. The transition zone was used to reduce the material stiffness mismatch of the joint parts. A numerical finite element model was used to identify the optimum variation in material stiffness that minimises potential failure of the joint. The best bio-inspired joints showed a 118% increase of joint strength compared to the standard joints. PMID:28773688

A Review of Natural Joint Systems and Numerical Investigation of Bio-Inspired GFRP-to-Steel Joints.

PubMed

Avgoulas, Evangelos I; Sutcliffe, Michael P F

2016-07-12

There are a great variety of joint types used in nature which can inspire engineering joints. In order to design such biomimetic joints, it is at first important to understand how biological joints work. A comprehensive literature review, considering natural joints from a mechanical point of view, was undertaken. This was used to develop a taxonomy based on the different methods/functions that nature successfully uses to attach dissimilar tissues. One of the key methods that nature uses to join dissimilar materials is a transitional zone of stiffness at the insertion site. This method was used to propose bio-inspired solutions with a transitional zone of stiffness at the joint site for several glass fibre reinforced plastic (GFRP) to steel adhesively bonded joint configurations. The transition zone was used to reduce the material stiffness mismatch of the joint parts. A numerical finite element model was used to identify the optimum variation in material stiffness that minimises potential failure of the joint. The best bio-inspired joints showed a 118% increase of joint strength compared to the standard joints.

Wood Bond Testing

NASA Technical Reports Server (NTRS)

1989-01-01

A joint development program between Hartford Steam Boiler Inspection Technologies and The Weyerhaeuser Company resulted in an internal bond analyzer (IBA), a device which combines ultrasonics with acoustic emission testing techniques. It is actually a spinoff from a spinoff, stemming from a NASA Lewis invented acousto-ultrasonic technique that became a system for testing bond strength of composite materials. Hartford's parent company, Acoustic Emission Technology Corporation (AET) refined and commercialized the technology. The IBA builds on the original system and incorporates on-line process control systems. The IBA determines bond strength by measuring changes in pulsar ultrasonic waves injected into a board. Analysis of the wave determines the average internal bond strength for the panel. Results are displayed immediately. Using the system, a mill operator can adjust resin/wood proportion, reduce setup time and waste, produce internal bonds of a consistent quality and automatically mark deficient products.

Environmental Durability of Adhesively Bonded Joints

DTIC Science & Technology

1997-10-14

REPORT DOCUMENTATION PAGE Form Approved OMB No. 07040188 Public reporting burden for tis collection of information isestimated to average 1 hour per...transmittance and reflectance spectroscopy was performed using Nicolet’s OMNIC software for the set-up, control, and analysis of spectroscopic scans... publications inciudc: JAhIN’. W S. iind Butjkus, L.M., "Considetring E~nvironmental Condjitions ill the Design ()’ Bonded Structures: A Fracture

Ion Transport via Structural Relaxations in Polymerized Ionic Liquids

NASA Astrophysics Data System (ADS)

Ganesan, Venkat; Mogurampelly, Santosh

We study the mechanisms underlying ion transport in poly(1-butyl-3-vinylimidazolium-hexafluorophosphate) polymer electrolytes. We consider polymer electrolytes of varying polymerized ionic liquid to ionic liquid (polyIL:IL) ratios and use atomistic molecular dynamics (MD) simulations to probe the dynamical and structural characteristics of the electrolyte. Our results reveal that anion diffusion along polymer backbone occurs primarily viathe formation and breaking of ion-pairs involving threepolymerized cationic monomers of twodifferent polymer chains. Moreover, we observe that the ionic diffusivities exhibit a direct correlation with the structural relaxation times of the ion-pairs and hydrogen bonds (H-bonds). These results provide new insights into the mechanisms underlying ion transport in polymerized ionic liquid electrolytes.

Extra-thermodynamic study on surface diffusion in reversed-phase liquid chromatography using silica gels bonded with alkyl ligands of different chain lengths

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miyabe, Kanji; Guiochon, Georges A

2005-06-01

Surface diffusion on adsorbents made of silica gels bonded to C{sub 1}, C{sub 4}, C{sub 8}, and C{sub 18} alkyl ligands was studied in reversed-phase liquid chromatography (RPLC) from the viewpoints of two extrathermodynamic relationships: enthalpy-entropy compensation (EEC) and linear free-energy relationship (LFER). First, the values of the surface diffusion coefficient (D{sub s}), normalized by the density of the alkyl ligands, were analyzed with the modified Arrhenius equation, following the four approaches proposed in earlier research. This showed that an actual EEC resulting from substantial physicochemical effects occurs for surface diffusion and suggested a mechanistic similarity of molecular migration bymore » surface diffusion, irrespective of the alkyl chain length. Second, a new model based on EEC was derived to explain the LFER between the logarithms of D{sub s} measured under different RPLC conditions. This showed that the changes of free energy, enthalpy, and entropy of surface diffusion are linearly correlated with the carbon number in the alkyl ligands of the bonded phases and that the contribution of the C{sub 18} ligand to the changes of the thermodynamic parameters corresponds to that of the C{sub 10} ligand. The new LFER model correlates the slope and intercept of the LFER to the compensation temperatures derived from the EEC analyses and to several parameters characterizing the molecular contributions to the changes in enthalpy and entropy. Finally, the new model was used to estimate D{sub s} under various RPLC conditions. The values of D{sub s} that were estimated from only two original experimental D{sub s} data were in agreement with corresponding experimental D{sub s} values, with relative errors of {approx}20%, irrespective of some RPLC conditions.« less

Self-Healing of Unentangled Polymer Networks with Reversible Bonds

PubMed Central

Stukalin, Evgeny B.; Cai, Li-Heng; Kumar, N. Arun; Leibler, Ludwik; Rubinstein, Michael

2013-01-01

Self-healing polymeric materials are systems that after damage can revert to their original state with full or partial recovery of mechanical strength. Using scaling theory we study a simple model of autonomic self-healing of unentangled polymer networks. In this model one of the two end monomers of each polymer chain is fixed in space mimicking dangling chains attachment to a polymer network, while the sticky monomer at the other end of each chain can form pairwise reversible bond with the sticky end of another chain. We study the reaction kinetics of reversible bonds in this simple model and analyze the different stages in the self-repair process. The formation of bridges and the recovery of the material strength across the fractured interface during the healing period occur appreciably faster after shorter waiting time, during which the fractured surfaces are kept apart. We observe the slowest formation of bridges for self-adhesion after bringing into contact two bare surfaces with equilibrium (very low) density of open stickers in comparison with self-healing. The primary role of anomalous diffusion in material self-repair for short waiting times is established, while at long waiting times the recovery of bonds across fractured interface is due to hopping diffusion of stickers between different bonded partners. Acceleration in bridge formation for self-healing compared to self-adhesion is due to excess non-equilibrium concentration of open stickers. Full recovery of reversible bonds across fractured interface (formation of bridges) occurs after appreciably longer time than the equilibration time of the concentration of reversible bonds in the bulk. PMID:24347684

Brazing graphite to graphite

DOEpatents

Peterson, George R.

1976-01-01

Graphite is joined to graphite by employing both fine molybdenum powder as the brazing material and an annealing step that together produce a virtually metal-free joint exhibiting properties similar to those found in the parent graphite. Molybdenum powder is placed between the faying surfaces of two graphite parts and melted to form molybdenum carbide. The joint area is thereafter subjected to an annealing operation which diffuses the carbide away from the joint and into the graphite parts. Graphite dissolved by the dispersed molybdenum carbide precipitates into the joint area, replacing the molybdenum carbide to provide a joint of virtually graphite.

Interfacial Reaction and Shear Strength of SnAgCu/Ni/Bi2Te3-Based TE Materials During Aging

NASA Astrophysics Data System (ADS)

Jing, Hongyang; Li, Yuan; Xu, Lianyong; Han, Yongdian; Lu, Guoquan; Zhang, Hao

2015-12-01

As a diffusion barrier layer, Ni is widely applied in power electronics packaging, especially in thermoelectric devices. This paper presents the variation of Ni diffusion barrier layer during aging and failure mechanisms of thermoelectric device joints. The thermoelectric joint consists of Sn96.5Ag3.0Cu0.5 (SAC305) solder and Bi2Te3-based thermoelectric materials such as Bi0.5Sb1.5Te3 and Bi1.8Sb0.2Se0.15Te2.85 during service. The result shows that with the increasing aging time, Ni layer was constantly consumed by SAC305 and Bi2Te3-based thermoelectric materials simultaneously. The reaction products are (Cu,Ni)6Sn5 and NiTe or Ni(Bi,Te), respectively. Besides, the shear strength of SAC305/Bi0.5Sb1.5Te3 joint or SAC305/Bi1.8Sb0.2Se0.15Te2.85 joint gets gradually decreased and thermoelectric conversion performance gets worse. Meantime, the different failure mechanisms are also compared between SAC305/Bi0.5Sb1.5Te3 couple joints and SAC305/Bi1.8Sb0.2Se0.15Te2.85 couple joints.

Inter-diffusion analysis of joint interface of tungsten-rhenium couple

NASA Astrophysics Data System (ADS)

Hua, Y. F.; Li, Z. X.; Zhang, X.; Du, J. H.; Huang, C. L.; Du, M. H.

2011-09-01

The tungsten-rhenium couple was prepared by using glow plasma physical vapor deposition (PVD) on the isotropic fine grained graphite (IG) substrates. Diffusion anneals of the tungsten-rhenium couple were conducted at the temperature from 1100 °C to 1400 °C to investigate the inter-diffusion behaviors. The results showed that the thickness of the inter-diffusion zone increased with increasing annealing temperature. The relationship between the inter-diffusion coefficient and the annealing temperature accorded with the Arrhenius manner. The value of inter-diffusion activation energies was 189 kJ/mole (1.96 eV). The service time of tungsten-rhenium multilayer diffusion barrier was limited by the inter-diffusion for rhenium and tungsten rather than the diffusion of carbon in rhenium.

Development of Bonded Joint Technology for a Rigidizable-Inflatable Deployable Truss

NASA Technical Reports Server (NTRS)

Smeltzer, Stanley S., III

2006-01-01

Microwave and Synthetic Aperture Radar antenna systems have been developed as instrument systems using truss structures as their primary support and deployment mechanism for over a decade. NASA Langley Research Center has been investigating fabrication, modular assembly, and deployment methods of lightweight rigidizable/inflatable linear truss structures during that time for large spacecraft systems. The primary goal of the research at Langley Research Center is to advance these existing state-of-the-art joining and deployment concepts to achieve prototype system performance in a relevant space environment. During 2005, the development, fabrication, and testing of a 6.7 meter multi-bay, deployable linear truss was conducted at Langley Research Center to demonstrate functional and precision metrics of a rigidizable/inflatable truss structure. The present paper is intended to summarize aspects of bonded joint technology developed for the 6.7 meter deployable linear truss structure while providing a brief overview of the entire truss fabrication, assembly, and deployment methodology. A description of the basic joint design, surface preparation investigations, and experimental joint testing of component joint test articles will be described. Specifically, the performance of two room temperature adhesives were investigated to obtain qualitative data related to tube folding testing and quantitative data related to tensile shear strength testing. It was determined from the testing that a polyurethane-based adhesive best met the rigidizable/inflatable truss project requirements.

Theoretical and experimental studies of water interaction in acetate based ionic liquids.

PubMed

Shi, Wei; Damodaran, Krishnan; Nulwala, Hunaid B; Luebke, David R

2012-12-05

Water interactions in 1-ethyl-3-methylimidazolium acetate ([emim][CH(3)COO]) were studied utilizing classical and ab initio simulation methods. The self-diffusivities for water and the ionic liquid (IL) were studied experimentally using pulse field gradient NMR spectroscopy and correlated with computational results. Water forms hydrogen bonding networks with the ionic liquid, and depending on the concentration of water, there are profound effects on the self-diffusivities of the various species. Both simulation and experiments show that the self-diffusivities for species in the water-[emim][CH(3)COO] system exhibit minima at 40-50 mol% water. Water interaction with the [CH(3)COO](-) anion predominates over the water-water and water-cation interactions at most water concentrations. Simulations further indicate that decreasing water-[CH(3)COO](-) interaction will increase the IL and water self-diffusivities. Self-diffusivities in the water-IL systems are dependent upon the cation in a complex way. Water interactions with [P(4444)][CH(3)COO] are reduced compared to [emim][CH(3)COO]. The [P(4444)](+) cation is bulkier than the [emim](+) cation and has a smaller self-diffusivity, but when water was introduced to [P(4444)] [CH(3)COO], the water-[CH(3)COO](-) hydrogen bonding network in the [P(4444)][CH(3)COO] was much smaller than the one observed in [emim][CH(3)COO].

NDE of Space Shuttle Solid Rocket Motor field joint

NASA Technical Reports Server (NTRS)

Johnston, Patrick H.

1987-01-01

One of the most critical areas for inspection in the Space Shuttle Solid Rocket Motors is the bond between the steel case and rubber insulation in the region of the field joints. The tang-and-clevis geometry of the field joints is sufficiently complex to prohibit the use of resonance-based techniques. One approach we are investigating is to interrogate the steel-insulation bondline in the tang and clevis regions using surface-travelling waves. A low-frequency contact surface wave transmitting array transducer is under development at our laboratory for this purpose. The array is placed in acoustic contact with the steel and surface waves are launched on the inside surface or the clevis leg which propagate along the steel-insulation interface. As these surface waves propagate along the bonded surface, the magnitude of the ultrasonic energy leaking into the steel is monitored on the outer surface of the case. Our working hypothesis is that the magnitude of energy received at the outer surface of the case is dependent upon the integrity of the case-insulation bond, with less attenuation for propagation along a disbond due to imperfect acoustic coupling between the steel and rubber. Measurements on test specimens indicate a linear relationship between received signal amplitude and the length of good bend between the transmitter and receiver, suggesting the validity of this working hypothesis.

In vivo diffusion characteristics following perineural injection of the deep branch of the lateral plantar nerve with mepivacaine or iohexol in horses.

PubMed

Contino, E K; King, M R; Valdés-Martínez, A; McIlwraith, C W

2015-03-01

Hindlimb proximal suspensory desmopathy is a common injury of sport horses but diagnosis can be difficult because diagnostic analgesia of the region lacks specificity. Perineural analgesia of the deep branch of the lateral plantar nerve (DBLPN) has been proposed as a more specific method of isolating pain of the proximal aspect of the suspensory ligament but the technique has not been evaluated in vivo. To determine the extent of diffusion of contrast medium and mepivacaine following DBLPN analgesia using a single-needle injection technique and to determine if there is inadvertent involvement of the tarsal sheath and/or tarsometatarsal (TMT) joint using this technique. In vivo experimental study. Perineural injection of the DBLPN was performed in 16 limbs with 3 ml of either mepivacaine hydrochloride or positive contrast medium. Contrast medium-injected limbs were radiographed 5, 15, and 30 min post injection and diffusion characteristics were described. In mepivacaine-injected limbs, synovial fluid from the TMT joint was obtained 10 and 20 min post injection and mepivacaine concentrations were analysed. At 5, 15 and 30 min post injection, the contrast medium extended, on average, 19.6, 20.6 and 21.0 mm proximal and 38.0, 43.5 and 51.9 mm distal to the injection site, respectively. Three of 8 (37.5%) limbs had evidence of contrast medium in the tarsal sheath. Two of 8 (25%) limbs had mepivacaine concentrations within the TMT joint sufficient to produce analgesia (>300 mg/l) at 10 min post injection. Contrast medium diffused further in a distal direction than in a proximal direction. Analgesia of the DBLPN can result in inadvertent involvement of the tarsal sheath and/or TMT joint. © 2014 EVJ Ltd.

DWI filtering using joint information for DTI and HARDI.

PubMed

Tristán-Vega, Antonio; Aja-Fernández, Santiago

2010-04-01

The filtering of the Diffusion Weighted Images (DWI) prior to the estimation of the diffusion tensor or other fiber Orientation Distribution Functions (ODF) has been proved to be of paramount importance in the recent literature. More precisely, it has been evidenced that the estimation of the diffusion tensor without a previous filtering stage induces errors which cannot be recovered by further regularization of the tensor field. A number of approaches have been intended to overcome this problem, most of them based on the restoration of each DWI gradient image separately. In this paper we propose a methodology to take advantage of the joint information in the DWI volumes, i.e., the sum of the information given by all DWI channels plus the correlations between them. This way, all the gradient images are filtered together exploiting the first and second order information they share. We adapt this methodology to two filters, namely the Linear Minimum Mean Squared Error (LMMSE) and the Unbiased Non-Local Means (UNLM). These new filters are tested over a wide variety of synthetic and real data showing the convenience of the new approach, especially for High Angular Resolution Diffusion Imaging (HARDI). Among the techniques presented, the joint LMMSE is proved a very attractive approach, since it shows an accuracy similar to UNLM (or even better in some situations) with a much lighter computational load. Copyright 2009 Elsevier B.V. All rights reserved.

Field joint environmental protection system vibration/pressurization qualification

NASA Technical Reports Server (NTRS)

Cook, M.

1989-01-01

The procedures used and results obtained from vibration testing the redesigned solid rocket motor (RSRM) field joint environmental protection system (FJEPS), hereafter referred to as the joint protection system (JPS) are documented. The major purposes were to certify that the flight-designed JPS will withstand the dynamic environmental conditions of the redesigned solid rocket booster, and to certify that the cartridge check valve (vent valve) will relieve pressure build-up under the JPS during the initial 120 sec of flight. Also, an evaluation of the extruded cork insulation bonding was performed after the vibration testing.

Probabilistic and Possibilistic Analyses of the Strength of a Bonded Joint

NASA Technical Reports Server (NTRS)

Stroud, W. Jefferson; Krishnamurthy, T.; Smith, Steven A.

2001-01-01

The effects of uncertainties on the strength of a single lap shear joint are explained. Probabilistic and possibilistic methods are used to account for uncertainties. Linear and geometrically nonlinear finite element analyses are used in the studies. To evaluate the strength of the joint, fracture in the adhesive and material strength failure in the strap are considered. The study shows that linear analyses yield conservative predictions for failure loads. The possibilistic approach for treating uncertainties appears to be viable for preliminary design, but with several qualifications.

Investigation of Thermal Interface Materials Using Phase-Sensitive Transient Thermoreflectance Technique: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, X.; King, C.; DeVoto, D.

2014-08-01

With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat conduction model was constructed and theoretical solutions were derived to obtain the relation between phase lag and the thermal/physical properties. This technique enables simultaneous extraction of the contact resistance and bulk thermal conductivity of the TIMs. With the measurements, the bulk thermal conductivity of Dow TC-5022 thermal grease (70 tomore » 75 um bondline thickness) was 3 to 5 W/(m-K) and the contact resistance was 5 to 10 mm2-K/W. For the Btech thermoplastic material (45 to 80 μm bondline thickness), the bulk thermal conductivity was 20 to 50 W/(m-K) and the contact resistance was 2 to 5 mm2-K/W. Measurements were also conducted to quantify the thermal performance of diffusion-bonded interface for power electronics applications. Results with the diffusion-bonded sample showed that the interfacial thermal resistance is more than one order of magnitude lower than those of traditional TIMs, suggesting potential pathways to efficient thermal management.« less

A high level Ab initio study of the anionic hydrogen-bonded complexes FH-CN-, FH-NC-, H2O-CN- and H2O-NC-

NASA Technical Reports Server (NTRS)

Lee, Timothy J.

1989-01-01

HF, H2O, CN- and their hydrogen-bonded complexes were studied using state-of-the-art ab initio quantum mechanical methods. A large Gaussian one particle basis set consisting of triple zeta plus double polarization plus diffuse s and p functions (TZ2P + diffuse) was used. The theoretical methods employed include self consistent field, second order Moller-Plesset perturbation theory, singles and doubles configuration interaction theory and the singles and doubles coupled cluster approach. The FH-CN- and FH-NC- and H2O-CN-, H2O-NC- pairs of complexes are found to be essentially isoenergetic. The first pair of complexes are predicted to be bound by approx. 24 kcal/mole and the latter pair bound by approximately 15 kcal/mole. The ab initio binding energies are in good agreement with the experimental values. The two being shorter than the analogous C-N hydrogen bond. The infrared (IR) spectra of the two pairs of complexes are also very similar, though a severe perturbation of the potential energy surface by proton exchange means that the accurate prediction of the band center of the most intense IR mode requires a high level of electronic structure theory as well as a complete treatment of anharmonic effects. The bonding of anionic hydrogen-bonded complexes is discussed and contrasted with that of neutral hydrogen-bonded complexes.

JWST ISIM Primary Structure and Kinematic Mount Configuration

NASA Technical Reports Server (NTRS)

Bartoszyk, Andrew; Carnahan, Tim; Hendricks, Steve; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz

2004-01-01

In this presentation we will review the evolution of the ISIM primary structure tube topology and kinematic mount configuration to the current baseline concept. We will also show optimization procedures used and challenges resulting from complex joints under launch loads. Two additional key ISIM structure challenges of meeting thermal distortion and stability requirements and metal-composite bonded joint survivability at cryogenic temperatures are covered in other presentations.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sabau, Adrian S; Warren, Charles David; ERDMAN III, DONALD L

Due to its increased use in the automotive and aerospace industries, joining of Carbon Fiber-reinforced Polymer matrix Composites (CFPC) to metals demands enhanced surface preparation and control of surface morphology prior to joining. In this study, surfaces of both composite and aluminum were prepared for joining using a new laser based technique, in which the laser interference power profile was created by splitting the beam and guiding those beams to the sample surface by overlapping each other with defined angles to each other. Results were presented for the overlap shear testing of single-lap joints made with Al 5182 and CFPCmore » specimens whose surfaces prepared by (a) surface abrasion and solvent cleaning; and (b) laser-interference structured surfaces by rastering with a 4 mm laser beam at approximately 3.5 W power. CFPC specimens of T700S carbon fiber, Prepreg T70 epoxy, 4 or 5 ply thick, 0/90o plaques were used. Adhesive DP810 was used to bond Al and CFPC. The bondline was 0.25mm and the bond length was consistent among all joints produced. First, the effect of the laser speed on the joint performance was evaluated by laser-interference structure Al and CFPC surfaces with a beam angle of 3o and laser beam speeds of 3, 5, and 10 mm/s. For this sensitivity study, 3 joint specimens were used per each joint type. Based on the results for minimum, maximum, and mean values for the shear lap strength and maximum load for all the 9 joint types, two joint types were selected for further evaluations. Six additional joint specimens were prepared for these two joint types in order to obtain better statistics and the shear test data was presented for the range, mean, and standard deviation. The results for the single-lap shear tests obtained for six joint specimens, indicate that the shear lap strength, maximum load, and displacement at maximum load for those joints made with laser-interference structured surfaces were increased by approximately 14.8%, 16%, and 100%, respectively over those measured for the baseline joints.« less