High density electrical card connector system

DOEpatents

Haggard, J. Eric; Trotter, Garrett R.

2000-01-01

An electrical circuit board card connection system is disclosed which comprises a wedge-operated locking mechanism disposed along an edge portion of the printed circuit board. An extrusion along the edge of the circuit board mates with an extrusion fixed to the card cage having a plurality of electrical connectors. The connection system allows the connectors to be held away from the circuit board during insertion/extraction and provides a constant mating force once the circuit board is positioned and the wedge inserted. The disclosed connection system is a simple solution to the need for a greater number of electrical signal connections.

Flexible integrated diode-transistor logic (DTL) driving circuits based on printed carbon nanotube thin film transistors with low operation voltage.

PubMed

Liu, Tingting; Zhao, Jianwen; Xu, Weiwei; Dou, Junyan; Zhao, Xinluo; Deng, Wei; Wei, Changting; Xu, Wenya; Guo, Wenrui; Su, Wenming; Jie, Jiansheng; Cui, Zheng

2018-01-03

Fabrication and application of hybrid functional circuits have become a hot research topic in the field of printed electronics. In this study, a novel flexible diode-transistor logic (DTL) driving circuit is proposed, which was fabricated based on a light emitting diode (LED) integrated with printed high-performance single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs). The LED, which is made of AlGaInP on GaAs, is commercial off-the-shelf, which could generate free electrical charges upon white light illumination. Printed top-gate TFTs were made on a PET substrate by inkjet printing high purity semiconducting SWCNTs (sc-SWCNTs) ink as the semiconductor channel materials, together with printed silver ink as the top-gate electrode and printed poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA/ODA) as gate dielectric layer. The LED, which is connected to the gate electrode of the TFT, generated electrical charge when illuminated, resulting in biased gate voltage to control the TFT from "ON" status to "OFF" status. The TFTs with a PMDA/ODA gate dielectric exhibited low operating voltages of ±1 V, a small subthreshold swing of 62-105 mV dec -1 and ON/OFF ratio of 10 6 , which enabled DTL driving circuits to have high ON currents, high dark-to-bright current ratios (up to 10 5 ) and good stability under repeated white light illumination. As an application, the flexible DTL driving circuit was connected to external quantum dot LEDs (QLEDs), demonstrating its ability to drive and to control the QLED.

Natural printed silk substrate circuit fabricated via surface modification using one step thermal transfer and reduction graphene oxide

NASA Astrophysics Data System (ADS)

Cao, Jiliang; Huang, Zhan; Wang, Chaoxia

2018-05-01

Graphene conductive silk substrate is a preferred material because of its biocompatibility, flexibility and comfort. A flexible natural printed silk substrate circuit was fabricated by one step transfer of graphene oxide (GO) paste from transfer paper to the surface of silk fabric and reduction of the GO to reduced graphene oxide (RGO) using a simple hot press treatment. The GO paste was obtained through ultrasonic stirring exfoliation under low temperature, and presented excellent printing rheological properties at high concentration. The silk fabric was obtained a surface electric resistance as low as 12.15 KΩ cm-1, in the concentration of GO 50 g L-1 and hot press at 220 °C for 120 s. Though the whiteness and strength decreased with the increasing of hot press temperature and time slowly, the electric conductivity of RGO surface modification silk substrate improved obviously. The surface electric resistance of RGO/silk fabrics increased from 12.15 KΩ cm-1 to 18.05 KΩ cm-1, 28.54 KΩ cm-1 and 32.53 KΩ cm-1 after 10, 20 and 30 washing cycles, respectively. The results showed that the printed silk substrate circuit has excellent washability. This process requires no chemical reductant, and the reduction efficiency and reduction degree of GO is high. This time-effective and environmentally-friendly one step thermal transfer and reduction graphene oxide onto natural silk substrate method can be easily used to production of reduced graphene oxide (RGO) based flexible printed circuit.

Rapid Laser Printing of Paper-Based Multilayer Circuits.

PubMed

Huang, Gui-Wen; Feng, Qing-Ping; Xiao, Hong-Mei; Li, Na; Fu, Shao-Yun

2016-09-27

Laser printing has been widely used in daily life, and the fabricating process is highly efficient and mask-free. Here we propose a laser printing process for the rapid fabrication of paper-based multilayer circuits. It does not require wetting of the paper, which is more competitive in manufacturing paper-based circuits compared to conventional liquid printing process. In the laser printed circuits, silver nanowires (Ag-NWs) are used as conducting material for their excellent electrical and mechanical properties. By repeating the printing process, multilayer three-dimensional (3D) structured circuits can be obtained, which is quite significant for complex circuit applications. In particular, the performance of the printed circuits can be exactly controlled by varying the process parameters including Ag-NW content and laminating temperature, which offers a great opportunity for rapid prototyping of customized products with designed properties. A paper-based high-frequency radio frequency identification (RFID) label with optimized performance is successfully demonstrated. By adjusting the laminating temperature to 180 °C and the top-layer Ag-NW areal density to 0.3 mg cm(-2), the printed RFID antenna can be conjugately matched with the chip, and a big reading range of ∼12.3 cm with about 2.0 cm over that of the commercial etched Al antenna is achieved. This work provides a promising approach for fast and quality-controlled fabrication of multilayer circuits on common paper and may be enlightening for development of paper-based devices.

Towards Practical Application of Paper based Printed Circuits: Capillarity Effectively Enhances Conductivity of the Thermoplastic Electrically Conductive Adhesives

PubMed Central

Wu, Haoyi; Chiang, Sum Wai; Lin, Wei; Yang, Cheng; Li, Zhuo; Liu, Jingping; Cui, Xiaoya; Kang, Feiyu; Wong, Ching Ping

2014-01-01

Direct printing nanoparticle-based conductive inks onto paper substrates has encountered difficulties e.g. the nanoparticles are prone to penetrate into the pores of the paper and become partially segmented, and the necessary low-temperature-sintering process is harmful to the dimension-stability of paper. Here we prototyped the paper-based circuit substrate in combination with printed thermoplastic electrically conductive adhesives (ECA), which takes the advantage of the capillarity of paper and thus both the conductivity and mechanical robustness of the printed circuitsweredrastically improved without sintering process. For instance, the electrical resistivity of the ECA specimen on a pulp paper (6 × 10−5Ω·cm, with 50 wt% loading of Ag) was only 14% of that on PET film than that on PET film. This improvement has been found directly related to the sizing degree of paper, in agreement with the effective medium approximation simulation results in this work. The thermoplastic nature also enables excellent mechanical strength of the printed ECA to resist repeated folding. Considering the generality of the process and the wide acceptance of ECA technique in the modern electronic packages, this method may find vast applications in e.g. circuit boards, capacitive touch pads, and radio frequency identification antennas, which have been prototyped in the manuscript. PMID:25182052

[Electric short-circuit incident observed with "Upsher" laryngoscopes].

PubMed

Tritsch, L; Vailly, B

2006-01-01

We observed an electrical short-circuit between a fasten screw of the printed circuit and the handle of an Upsher universal laryngoscope (serial number UQ1). The isolating Silicone layer was broken above the screw. This isolation defect was found all over our Upsher laryngoscopes of the UQ1 series. No doubt that if accumulators were used instead of batteries, emitted heat would be in largest amount and perhaps dangerous.

Hybrid stretchable circuits on silicone substrate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Robinson, A., E-mail: adam.1.robinson@nokia.com; Aziz, A., E-mail: a.aziz1@lancaster.ac.uk; Liu, Q.

When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

Highly Conductive Nano-Silver Circuits by Inkjet Printing

NASA Astrophysics Data System (ADS)

Zhu, Dongbin; Wu, Minqiang

2018-06-01

Inkjet technology has become popular in the field of printed electronics due to its superior properties such as simple processes and printable complex patterns. Electrical conductivity of the circuits is one of the key factors in measuring the performance of printed electronics, which requires great material properties and a manufactured process. With excellent conductivity and ductility, silver is an ideal material as the wire connecting components. This review summarizes the progress of conductivity studies on inkjet printed nano-silver lines, including ink composition and nanoparticle morphology, deposition of nano-silver lines with uniform and high aspect ratios, sintering mechanisms and alternative methods of thermal sintering. Finally, the research direction on inkjet printed electronics is proposed.

Assembling surface mounted components on ink-jet printed double sided paper circuit board.

PubMed

Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

2014-03-07

Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits

PubMed Central

Yang, Cheng; Cui, Xiaoya; Zhang, Zhexu; Chiang, Sum Wai; Lin, Wei; Duan, Huan; Li, Jia; Kang, Feiyu; Wong, Ching-Ping

2015-01-01

Fractal metallic dendrites have been drawing more attentions recently, yet they have rarely been explored in electronic printing or packaging applications because of the great challenges in large-scale synthesis and limited understanding in such applications. Here we demonstrate a controllable synthesis of fractal Ag micro-dendrites at the hundred-gram scale. When used as the fillers for isotropically electrically conductive composites (ECCs), the unique three-dimensional fractal geometrical configuration and low-temperature sintering characteristic render the Ag micro dendrites with an ultra-low electrical percolation threshold of 0.97 vol% (8 wt%). The ultra-low percolation threshold and self-limited fusing ability may address some critical challenges in current interconnect technology for microelectronics. For example, only half of the laser-scribe energy is needed to pattern fine circuit lines printed using the present ECCs, showing great potential for wiring ultrathin circuits for high performance flexible electronics. PMID:26333352

Bioextraction of Copper from Printed Circuit Boards: Influence of Initial Concentration of Ferrous Iron

NASA Astrophysics Data System (ADS)

Yamane, Luciana Harue; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

Printed circuit boards are found in all electric and electronic equipment and are particularly problematic to recycle because of the heterogeneous mix of organic material, metals, and fiberglass. Additionally, printed circuit boards can be considered a secondary source of copper and bacterial leaching can be applied to copper recovery. This study investigated the influence of initial concentration of ferrous iron on bacterial leaching to recover copper from printed circuit boards using Acidithiobacillus ferrooxidans-LR. Printed circuit boards from computers were comminuted using a hammer mill. The powder obtained was magnetically separated and the non magnetic material used in this study. A shake flask study was carried out on the non magnetic material using a rotary shaker at 30°C, 170 rpm and different initial concentrations of ferrous iron (gL-1): 6.75; 13.57 and 16.97. Abiotic controls were also run in parallel. The monitored parameters were pH, Eh, ferrous iron concentration and copper extraction (spectroscopy of atomic absorption). The results showed that using initial concentration of ferrous iron of 6.75gL-1 were extracted 99% of copper by bacterial leaching.

Developing and Evaluating a Flexible Wireless Microcoil Array Based Integrated Interface for Epidural Cortical Stimulation.

PubMed

Wang, Xing; Chaudhry, Sharjeel A; Hou, Wensheng; Jia, Xiaofeng

2017-02-05

Stroke leads to serious long-term disability. Electrical epidural cortical stimulation has made significant improvements in stroke rehabilitation therapy. We developed a preliminary wireless implantable passive interface, which consists of a stimulating surface electrode, receiving coil, and single flexible passive demodulated circuit printed by flexible printed circuit (FPC) technique and output pulse voltage stimulus by inductively coupling an external circuit. The wireless implantable board was implanted in cats' unilateral epidural space for electrical stimulation of the primary visual cortex (V1) while the evoked responses were recorded on the contralateral V1 using a needle electrode. The wireless implantable board output stable monophasic voltage stimuli. The amplitude of the monophasic voltage output could be adjusted by controlling the voltage of the transmitter circuit within a range of 5-20 V. In acute experiment, cortico-cortical evoked potential (CCEP) response was recorded on the contralateral V1. The amplitude of N2 in CCEP was modulated by adjusting the stimulation intensity of the wireless interface. These results demonstrated that a wireless interface based on a microcoil array can offer a valuable tool for researchers to explore electrical stimulation in research and the dura mater-electrode interface can effectively transmit electrical stimulation.

Printed stretchable circuit on soft elastic substrate for wearable application

NASA Astrophysics Data System (ADS)

Yuan, Wei; Wu, Xinzhou; Gu, Weibing; Lin, Jian; Cui, Zheng

2018-01-01

In this paper, a flexible and stretchable circuit has been fabricated by the printing method based on Ag NWs/PDMS composite. The randomly oriented Ag NWs were buried in PDMS to form a conductive and stretchable electrode. Stable conductivity was achieved with a large range of tensile strain (0-50%) after the initial stretching/releasing cycle. The stable electrical response is due to the buckling of the Ag NWs/PDMS composite layer. Furthermore, printed stretchable circuits integrated with commercial ICs have been demonstrated for wearable applications. Project supported by the National Program on Key Basic Research Project (No. 2015CB351901), the Strategic Priority Research Program of the Chinese Academy of Sciences (No. XDA09020201), and the National Science Foundation of China (Nos. 51603227, 51603228).

Electric Current Solves Mazes

ERIC Educational Resources Information Center

Ayrinhac, Simon

2014-01-01

We present in this work a demonstration of the maze-solving problem with electricity. Electric current flowing in a maze as a printed circuit produces Joule heating and the right way is instantaneously revealed with infrared thermal imaging. The basic properties of electric current can be discussed in this context, with this challenging question:…

Active alignment/contact verification system

DOEpatents

Greenbaum, William M.

2000-01-01

A system involving an active (i.e. electrical) technique for the verification of: 1) close tolerance mechanical alignment between two component, and 2) electrical contact between mating through an elastomeric interface. For example, the two components may be an alumina carrier and a printed circuit board, two mating parts that are extremely small, high density parts and require alignment within a fraction of a mil, as well as a specified interface point of engagement between the parts. The system comprises pairs of conductive structures defined in the surfaces layers of the alumina carrier and the printed circuit board, for example. The first pair of conductive structures relate to item (1) above and permit alignment verification between mating parts. The second pair of conductive structures relate to item (2) above and permit verification of electrical contact between mating parts.

Silver Ink For Jet Printing

NASA Technical Reports Server (NTRS)

Vest, R. W.; Singaram, Saraswathi

1989-01-01

Metallo-organic ink containing silver (with some bismuth as adhesion agent) applied to printed-circuit boards and pyrolized in air to form electrically conductive patterns. Ink contains no particles of silver, does not have to be mixed during use to maintain homogeneity, and applied to boards by ink-jet printing heads. Consists of silver neodecanoate and bismuth 2-ethylhexanoate dissolved in xylene and/or toluene.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend

NASA Astrophysics Data System (ADS)

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-10-01

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d2‧,3‧-d‧]benzo[1,2-b4,5-b‧]dithiophene (DTBDT-C6) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm2 V-1 s-1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend.

PubMed

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-10-04

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d;2',3'-d']benzo[1,2-b;4,5-b']dithiophene (DTBDT-C 6 ) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm 2  V -1  s -1 at low operation voltage of -5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas.

Unit: Electric Circuits, Inspection Pack, National Trial Print.

ERIC Educational Resources Information Center

Australian Science Education Project, Toorak, Victoria.

As a part of the unit materials in the series produced by the Australian Science Education Project, this teacher edition is primarily composed of a core relating to simple circuits, a test form, and options. Options are given under the headings: Your Invention; "How Long Does a Call Last?"; One, Two, Three Wires; Parallel Circuits; More…

Fully Printed Stretchable Thin-Film Transistors and Integrated Logic Circuits.

PubMed

Cai, Le; Zhang, Suoming; Miao, Jinshui; Yu, Zhibin; Wang, Chuan

2016-12-27

This paper reports intrinsically stretchable thin-film transistors (TFTs) and integrated logic circuits directly printed on elastomeric polydimethylsiloxane (PDMS) substrates. The printed devices utilize carbon nanotubes and a type of hybrid gate dielectric comprising PDMS and barium titanate (BaTiO 3 ) nanoparticles. The BaTiO 3 /PDMS composite simultaneously provides high dielectric constant, superior stretchability, low leakage, as well as good printability and compatibility with the elastomeric substrate. Both TFTs and logic circuits can be stretched beyond 50% strain along either channel length or channel width directions for thousands of cycles while showing no significant degradation in electrical performance. This work may offer an entry into more sophisticated stretchable electronic systems with monolithically integrated sensors, actuators, and displays, fabricated by scalable and low-cost methods for real life applications.

Hazardous Waste Cleanup: General Electric - Auburn Plant in Auburn, New York

EPA Pesticide Factsheets

GE purchased the property at Genesee Street in 1951 and constructed a manufacturing plant that produced a variety of electrical components including radar equipment, printed circuit boards and high voltage semiconductors. In January 1986, Powerex, Inc.,

Surface-Embedded Stretchable Electrodes by Direct Printing and their Uses to Fabricate Ultrathin Vibration Sensors and Circuits for 3D Structures.

PubMed

Song, Jun Hyuk; Kim, Young-Tae; Cho, Sunghwan; Song, Woo-Jin; Moon, Sungmin; Park, Chan-Gyung; Park, Soojin; Myoung, Jae Min; Jeong, Unyong

2017-11-01

Printing is one of the easy and quick ways to make a stretchable wearable electronics. Conventional printing methods deposit conductive materials "on" or "inside" a rubber substrate. The conductors made by such printing methods cannot be used as device electrodes because of the large surface topology, poor stretchability, or weak adhesion between the substrate and the conducting material. Here, a method is presented by which conductive materials are printed in the way of being surface-embedded in the rubber substrate; hence, the conductors can be widely used as device electrodes and circuits. The printing process involves a direct printing of a metal precursor solution in a block-copolymer rubber substrate and chemical reduction of the precursor into metal nanoparticles. The electrical conductivity and sensitivity to the mechanical deformation can be controlled by adjusting the number of printing operations. The fabrication of highly sensitive vibration sensors is thus presented, which can detect weak pulses and sound waves. In addition, this work takes advantage of the viscoelasticity of the composite conductor to fabricate highly conductive stretchable circuits for complicated 3D structures. The printed electrodes are also used to fabricate a stretchable electrochemiluminescence display. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies

PubMed Central

Moschou, Despina; Trantidou, Tatiana; Regoutz, Anna; Carta, Daniela; Morgan, Hywel; Prodromakis, Themistoklis

2015-01-01

Lab-on-Chip is a technology that could potentially revolutionize medical Point-of-Care diagnostics. Considerable research effort is focused towards innovating production technologies that will make commercial upscaling financially viable. Printed circuit board manufacturing techniques offer several prospects in this field. Here, we present a novel approach to manufacturing Printed Circuit Board (PCB)-based Ag/AgCl reference electrodes, an essential component of biosensors. Our prototypes were characterized both structurally and electrically. Scanning Electron Microscopy (SEM) and X-Ray Photoelectron Spectroscopy (XPS) were employed to evaluate the electrode surface characteristics. Electrical characterization was performed to determine stability and pH dependency. Finally, we demonstrate utilization along with PCB pH sensors, as a step towards a fully integrated PCB platform, comparing performance with discrete commercial reference electrodes. PMID:26213940

Printed circuit board impedance matching step for microwave (millimeter wave) devices

DOEpatents

Pao, Hsueh-Yuan; Aguirre, Jerardo; Sargis, Paul

2013-10-01

An impedance matching ground plane step, in conjunction with a quarter wave transformer section, in a printed circuit board provides a broadband microwave matching transition from board connectors or other elements that require thin substrates to thick substrate (>quarter wavelength) broadband microwave (millimeter wave) devices. A method of constructing microwave and other high frequency electrical circuits on a substrate of uniform thickness, where the circuit is formed of a plurality of interconnected elements of different impedances that individually require substrates of different thicknesses, by providing a substrate of uniform thickness that is a composite or multilayered substrate; and forming a pattern of intermediate ground planes or impedance matching steps interconnected by vias located under various parts of the circuit where components of different impedances are located so that each part of the circuit has a ground plane substrate thickness that is optimum while the entire circuit is formed on a substrate of uniform thickness.

Dynamically Movable Exhausting Emc Sealing System

DOEpatents

Barringer, Dennis R.; Seminaro, Edward J.; Toffler, Harold M.

2003-12-09

A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the EMC gasket therebetween. A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the EMC gasket therebetween.

Conductive elastomers by a new latex process

USDA-ARS?s Scientific Manuscript database

Electrically conductive polymers such as polyaniline can be used to in production of light-emitting diodes, printed circuit board components, antistatic materials, etc. Highly filled elastomers, such as those filled with metallic powders, can also conduct electricity. However, limitations due to co...

Evaluation of Cleanliness Test Methods for Spacecraft PCB Assemblies

NASA Astrophysics Data System (ADS)

Tegehall, P.-E.; Dunn, B. D.

2006-10-01

Ionic contamination on printed-circuit-board assemblies may cause current leakage and short-circuits. The present cleanliness requirement in ECSS-Q-70-08, "The manual soldering of high-reliability electrical connections", is that the ionic contamination shall be less than 1.56 fl-glcm2 NaCI equivalents. The relevance of the method used for measurement of the ionic contamination level, resistivity of solvent extract, has been questioned. Alternative methods are ion chromatography and measurement of surface insulation resistance, but these methods also have their drawbacks. These methods are first described and their advantages and drawbacks are discussed. This is followed by an experimental evaluation of the three methods. This was done by soldering test vehicles at four manufacturers of space electronics using their ordinary processes for soldering and cleaning printed board assemblies. The experimental evaluation showed that the ionic contamination added by the four assemblers was very small and well below the acceptance criterion in ECSS-Q-70-80. Ion-chromatography analysis showed that most of the ionic contamination on the cleaned assembled boards originated from the hot-oil fusing of the printed circuit boards. Also, the surface insulation resistance was higher on the assembled boards compared to the bare printed circuit boards. Since strongly activated fluxes are normally used when printed circuit boards are hot-oil fused, it is essential that they are thoroughly cleaned in order to achieve low contamination levels on the final printed-board assemblies.

Hazardous Waste Cleanup: General Electric – Main Plant Site in Schenectady, New York

EPA Pesticide Factsheets

GE purchased the property at Genesee Street in 1951 and constructed a manufacturing plant that produced a variety of electrical components including radar equipment, printed circuit boards and high voltage semiconductors. In January 1986, Powerex, Inc., ac

Morphological Behavior of Printed Silver Electrodes with Protective Self-Assembled Monolayers for Electrochemical Migration.

PubMed

Sekine, Tomohito; Sato, Jun; Takeda, Yasunori; Kumaki, Daisuke; Tokito, Shizuo

2018-05-09

We evaluated the electrochemical behaviors and reliability of printed silver (Ag) electrodes prepared from nanoparticle inks with the use of protective self-assembled monolayers (SAMs) under electronic bias conditions. The printed Ag electrodes were fabricated by inkjet printing on a hydrophobic substrate. The SAMs, which acted as barriers to moisture, were prepared by immersing the substrate in a pentafluorobenzenethiol solution at ambient temperature (25 °C). We investigated the electrochemical migration phenomenon using the water drop method, and the results showed that the formation of dendrites connecting the cathode and the anode, which can affect the electrochemical reliability of an electric device, was suppressed in the presence of the SAMs. The time before short circuit occurred was found to depend on the spacing between the electrodes, i.e., 130 s, when the distance between the electrodes was 200 μm in the presence of an SAM. We demonstrated that Ag electrodes treated using the procedure described in this work suppress the occurrence of electrical short circuits caused by Ag dendrite formation and thus their electrochemical properties are substantially improved.

Printed 2 V-operating organic inverter arrays employing a small-molecule/polymer blend

PubMed Central

Shiwaku, Rei; Takeda, Yasunori; Fukuda, Takashi; Fukuda, Kenjiro; Matsui, Hiroyuki; Kumaki, Daisuke; Tokito, Shizuo

2016-01-01

Printed organic thin-film transistors (OTFTs) are well suited for low-cost electronic applications, such as radio frequency identification (RFID) tags and sensors. Achieving both high carrier mobility and uniform electrical characteristics in printed OTFT devices is essential in these applications. Here, we report on printed high-performance OTFTs and circuits using silver nanoparticle inks for the source/drain electrodes and a blend of dithieno[2,3-d;2′,3′-d′]benzo[1,2-b;4,5-b′]dithiophene (DTBDT-C6) and polystyrene for the organic semiconducting layer. A high saturation region mobility of 1.0 cm2 V−1 s−1 at low operation voltage of −5 V was obtained for relatively short channel lengths of 9 μm. All fifteen of the printed pseudo-CMOS inverter circuits were formed on a common substrate and operated at low operation voltage of 2 V with the total variation in threshold voltage of 0.35 V. Consequently, the printed OTFT devices can be used in more complex integrated circuit applications requiring low manufacturing cost over large areas. PMID:27698493

Performance of the electrical generator cell by the ferrous alloys of printed circuit board scrap and Iron Metal 1020

NASA Astrophysics Data System (ADS)

Sahan, Y.; Sudarsono, S.; Silviana, E.; Chairul; Wisrayetti

2018-04-01

Galvani cell is one of thealternative energy. This cell can be used as an electric resources. In this research, the generator cell was designed and builds to generate the electric. The generator cell consisted of the iron metal 1020 were used as anode, the ferrous alloys of printed circuit board scrapwas then used as chatode, and NaCl solution as an electrolyte. The aim of this research is to estimate the performance of this generator cell by using variation of NaCl concentration (i.e. 1%, 3%, 5%, 7%, and 9%) with the electrodes pair ( 1 and 8 pairs). The performance of the cell was measured with a multi tester equipment and a LED bulb (5-watt 3Volt). The Results shown that the generator cell can produce the electric power of 3.679 Volt maximally by using NaCl 9% and 8 electrode pairs applied for this condition.

Graphene Ink Laminate Structures on Poly(vinylidene difluoride) (PVDF) for Pyroelectric Thermal Energy Harvesting and Waste Heat Recovery.

PubMed

Zabek, Daniel; Seunarine, Kris; Spacie, Chris; Bowen, Chris

2017-03-15

Thermal energy can be effectively converted into electricity using pyroelectrics, which act as small scale power generator and energy harvesters providing nanowatts to milliwatts of electrical power. In this paper, a novel pyroelectric harvester based on free-standing poly(vinylidene difluoride) (PVDF) was manufactured that exploits the high thermal radiation absorbance of a screen printed graphene ink electrode structure to facilitate the conversion of the available thermal radiation energy into electrical energy. The use of interconnected graphene nanoplatelets (GNPs) as an electrode enable high thermal radiation absorbance and high electrical conductivity along with the ease of deposition using a screen print technique. For the asymmetric structure, the pyroelectric open-circuit voltage and closed-circuit current were measured, and the harvested electrical energy was stored in an external capacitor. For the graphene ink/PVDF/aluminum system the closed circuit pyroelectric current improves by 7.5 times, the open circuit voltage by 3.4 times, and the harvested energy by 25 times compared to a standard aluminum/PVDF/aluminum system electrode design, with a peak energy density of 1.13 μJ/cm 3 . For the pyroelectric device employed in this work, a complete manufacturing process and device characterization of these structures are reported along with the thermal conductivity of the graphene ink. The material combination presented here provides a new approach for delivering smart materials and structures, wireless technologies, and Internet of Things (IoT) devices.

GRC-2013-C-02448

NASA Image and Video Library

2009-06-23

Environmental Portrait, Electrical Power Systems Employee, hardware for the High Power 300-Volt Power Processing Unit (PPU). The Printed Circuit Boards (PCBs) are the Discharge Module Inverter and the Pulse Width Modulation (PWM) Controller

[Flexible print circuit technology application in biomedical engineering].

PubMed

Jiang, Lihua; Cao, Yi; Zheng, Xiaolin

2013-06-01

Flexible print circuit (FPC) technology has been widely applied in variety of electric circuits with high precision due to its advantages, such as low-cost, high specific fabrication ability, and good flexibility, etc. Recently, this technology has also been used in biomedical engineering, especially in the development of microfluidic chip and microelectrode array. The high specific fabrication can help making microelectrode and other micro-structure equipment. And good flexibility allows the micro devices based on FPC technique to be easily packaged with other parts. In addition, it also reduces the damage of microelectrodes to the tissue. In this paper, the application of FPC technology in biomedical engineering is introduced. Moreover, the important parameters of FPC technique and the development trend of prosperous applications is also discussed.

Inkjet printing of metal-oxide-based transparent thin-film capacitors

NASA Astrophysics Data System (ADS)

Matavž, A.; Malič, B.; Bobnar, V.

2017-12-01

We report on the inkjet printing of transparent, thin-film capacitors (TTFCs) composed of indium-zinc-oxide electrodes and a tantalum-oxide-based dielectric on glass substrates. The printing parameters were adapted for the sequential deposition of functional layers, resulting in approximately 100-nm-thick transparent capacitors with a uniform thickness. The relatively high electrical resistivity of the electrodes is reflected in the frequency dispersive dielectric behaviour, which is explained in terms of an equivalent circuit. The resistivity of the electrode strongly decreases with the number of printing passes; consequently, any misalignment of the printed layers is detected in the measured response. At low frequency, the TTFCs show a stable intrinsic dielectric response and a high capacitance density of ˜280 nF/cm2. The good dielectric performance as well as the low leakage-current density (8 × 10-7 A/cm2 at 1 MV cm-1) of our capacitors indicates that inkjet printing can be used to produce all-printed, high-quality electrical devices.

Electrical and electronic devices and components: A compilation

NASA Technical Reports Server (NTRS)

1975-01-01

Components and techniques which may be useful in the electronics industry are described. Topics discussed include transducer technology, printed-circuit technology, solid state devices, MOS transistors, Gunn device, microwave antennas, and position indicators.

Wirelessly powered microfluidic dielectrophoresis devices using printable RF circuits.

PubMed

Qiao, Wen; Cho, Gyoujin; Lo, Yu-Hwa

2011-03-21

We report the first microfluidic device integrated with a printed RF circuit so the device can be wirelessly powered by a commercially available RFID reader. For conventional dielectrophoresis devices, electrical wires are needed to connect the electric components on the microchip to external equipment such as power supplies, amplifiers, function generators, etc. Such a procedure is unfamiliar to most clinicians and pathologists who are used to working with a microscope for examination of samples on microscope slides. The wirelessly powered device reported here eliminates the entire need for wire attachments and external instruments so the operators can use the device in essentially the same manner as they do with microscope slides. The integrated circuit can be fabricated on a flexible plastic substrate at very low cost using a roll-to-roll printing method. Electrical power at 13.56 MHz transmitted by a radio-frequency identification (RFID) reader is inductively coupled to the printed RFIC and converted into 10 V DC (direct current) output, which provides sufficient power to drive a microfluidic device to manipulate biological particles such as beads and proteins via the DC dielectrophoresis (DC-DEP) effect. To our best knowledge, this is the first wirelessly powered microfluidic dielectrophoresis device. Although the work is preliminary, the device concept, the architecture, and the core technology are expected to stimulate many efforts in the future and transform the technology to a wide range of clinical and point-of-care applications. This journal is © The Royal Society of Chemistry 2011

3D Printing of Ball Grid Arrays

NASA Astrophysics Data System (ADS)

Sinha, Shayandev; Hines, Daniel; Dasgupta, Abhijit; Das, Siddhartha

Ball grid arrays (BGA) are interconnects between an integrated circuit (IC) and a printed circuit board (PCB), that are used for surface mounting electronic components. Typically, lead free alloys are used to make solder balls which, after a reflow process, establish a mechanical and electrical connection between the IC and the PCB. High temperature processing is required for most of these alloys leading to thermal shock causing damage to ICs. For producing flexible circuits on a polymer substrate, there is a requirement for low temperature processing capabilities (around 150 C) and for reducing strain from mechanical stresses. Additive manufacturing techniques can provide an alternative methodology for fabricating BGAs as a direct replacement for standard solder bumped BGAs. We have developed aerosol jet (AJ) printing methods to fabricate a polymer bumped BGA. As a demonstration of the process developed, a daisy chain test chip was polymer bumped using an AJ printed ultra violet (UV) curable polymer ink that was then coated with an AJ printed silver nanoparticle laden ink as a conducting layer printed over the polymer bump. The structure for the balls were achieved by printing the polymer ink using a specific toolpath coupled with in-situ UV curing of the polymer which provided good control over the shape, resulting in well-formed spherical bumps on the order of 200 um wide by 200 um tall for this initial demonstration. A detailed discussion of the AJ printing method and results from accelerated life-time testing will be presented

A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

DTIC Science & Technology

2014-05-19

their acceptable thermal stability, Polyimides have established as a conventional substrate material for flexible interconnects, which can be...of the silver flake ink for the screen-printed interconnects, the assembled unit fulfills biocompatibility requirements in a limited manner ([29...30]). Even though biocompatibility of substrate [31] is fulfilled, toxicity of the insulating mask [32] and encapsulation need to be considered

Humidity Control in the U.S. Air Force Aircraft Service Shelter

DTIC Science & Technology

1988-06-30

printed circuit board control module , terminal boards, and blowt.r, etc.) are off-the-shelf commercial components. Only the humidifier ho:;Ift, I...indication of the shelter RH. - Circuit Breaker: A 20 amp, three pole breaker is providud fur equipment protection. o Water Storage Tank. A stainless...tapped into the shelter’s existing electrical system at the panelboard, on the load side of the 100 Amp main AC circuit breaker. Power is then

Resistence seam welding thin copper foils

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hollar, D.L. Jr.

1991-02-01

Use of flat flexible circuits in the electronics industry is expanding. The term flexible circuits'' is defined here as copper foil which has been bonded to an insulating film such as Kapton film. The foil is photo processed to produce individual circuit paths similar to printed circuit boards. Another insulating film is laminated over the conductors to complete the flexible circuit. Flexible circuits, like multiwire cables, are susceptible to electromagnetic radiation (EMR) interference. On multiwire cables the interference problem is mitigated by adding a woven wire braid shielding over the conductors. Shielding on flexible circuits is accomplished by enclosing themore » circuits in a copper foil envelope. However, the copper foil must be electrically sealed around the flexcircuit to be effective. Ultimately, a resistance seam welding process and appropriate equipment were developed which would provide the required electrical seal between two layers of 2-oz (0.0028-inch thick) copper foil on a 1.1-inch wide, 30-inch long, 0.040-inch thick flexible circuit. 4 refs., 19 figs.« less

Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method

PubMed Central

Lee, Kyu Byung; Kim, Jong Rok; Park, Goon Cherl; Cho, Hyoung Kyu

2016-01-01

Liquid film thickness measurements under temperature-varying conditions in a two-phase flow are of great importance to refining our understanding of two-phase flows. In order to overcome the limitations of the conventional electrical means of measuring the thickness of a liquid film, this study proposes a three-electrode conductance method, with the device fabricated on a flexible printed circuit board (FPCB). The three-electrode conductance method offers the advantage of applicability under conditions with varying temperatures in principle, while the FPCB has the advantage of usability on curved surfaces and in relatively high-temperature conditions in comparison with sensors based on a printed circuit board (PCB). Two types of prototype sensors were fabricated on an FPCB and the feasibility of both was confirmed in a calibration test conducted at different temperatures. With the calibrated sensor, liquid film thickness measurements were conducted via a falling liquid film flow experiment, and the working performance was tested. PMID:28036000

Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board.

PubMed

Yi, Pan; Xiao, Kui; Dong, Chaofang; Zou, Shiwen; Li, Xiaogang

2018-02-01

The role played by mould in the electrochemical migration (ECM) behaviour of an immersion silver finished printed circuit board (PCB-ImAg) under a direct current (DC) bias was investigated. An interesting phenomenon is found whereby mould, especially Aspergillus niger, can preferentially grow well on PCB-ImAg under electrical bias and then bridge integrated circuits and form a migration path. The cooperation of the mould and DC bias aggravates the ECM process occurring on PCB-ImAg. When the bias voltage is below 15V, ECM almost does not occur for Ag coating. Mechanisms that explain the ECM processes of PCB-ImAg in the presence of mould and DC bias are proposed. Copyright © 2017. Published by Elsevier B.V.

High-performance all-printed amorphous oxide FETs and logics with electronically compatible electrode/ channel interface.

PubMed

Sharma, Bhupendra Kumar; Stoesser, Anna; Mondal, Sandeep Kumar; Garlapati, Suresh K; Fawey, Mohammed H; Chakravadhanula, Venkata Sai Kiran; Kruk, Robert; Hahn, Horst; Dasgupta, Subho

2018-06-12

Oxide semiconductors typically show superior device performance compared to amorphous silicon or organic counterparts, especially, when they are physical vapor deposited. However, it is not easy to reproduce identical device characteristics when the oxide field-effect transistors (FETs) are solution-processed/ printed; the level of complexity further intensifies with the need to print the passive elements as well. Here, we developed a protocol for designing the most electronically compatible electrode/ channel interface based on the judicious material selection. Exploiting this newly developed fabrication schemes, we are now able to demonstrate high-performance all-printed FETs and logic circuits using amorphous indium-gallium-zinc oxide (a-IGZO) semiconductor, indium tin oxide (ITO) as electrodes and composite solid polymer electrolyte as the gate insulator. Interestingly, all-printed FETs demonstrate an optimal electrical performance in terms of threshold voltages and device mobility and may very well be compared with devices fabricated using sputtered ITO electrodes. This observation originates from the selection of electrode/ channel materials from the same transparent semiconductor oxide family, resulting in the formation of In-Sn-Zn-O (ITZO) based diffused a-IGZO/ ITO interface that controls doping density while ensuring high electrical performance. Compressive spectroscopic studies reveal that Sn doping mediated excellent band alignment of IGZO with ITO electrodes is responsible for the excellent device performance observed. All-printed n-MOS based logic circuits have also been demonstrated towards new-generation portable electronics.

Thermal and Electrical Investigation of Conductive Polylactic Acid Based Filaments

NASA Astrophysics Data System (ADS)

Dobre, R. A.; Marcu, A. E.; Drumea, A.; Vlădescu, M.

2018-06-01

Printed electronics gain momentum as the involved technologies become affordable. The ability to shape electrostatic dissipative materials in almost any form is useful. The idea to use a general-purpose 3D printer to manufacture the electrical interconnections for a circuit is very attractive. The advantage of using a 3D printed structure over other technologies are mainly the lower price, less requirements concerning storage and use conditions, and the capability to build thicker traces while maintaining flexibility. The main element allowing this to happen is a printing filament with conductive properties. The paper shows the experiments that were performed to determine the thermal and electrical properties of polylactic acid (PLA) based ESD dissipative filament. Quantitative results regarding the thermal behavior of the DC resistance and the variation of the equivalent parallel impedance model parameters (losses resistance, capacitance, impedance magnitude and phase angle) with frequency are shown.. Using these results, new applications like printed temperature sensors can be imagined.

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

NASA Astrophysics Data System (ADS)

Arrese, J.; Vescio, G.; Xuriguera, E.; Medina-Rodriguez, B.; Cornet, A.; Cirera, A.

2017-03-01

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature (˜150 °C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique.

Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

PubMed

Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

2017-07-05

When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

Low-Cost Manufacturing of Bioresorbable Conductors by Evaporation-Condensation-Mediated Laser Printing and Sintering of Zn Nanoparticles.

PubMed

Shou, Wan; Mahajan, Bikram K; Ludwig, Brandon; Yu, Xiaowei; Staggs, Joshua; Huang, Xian; Pan, Heng

2017-07-01

Currently, bioresorbable electronic devices are predominantly fabricated by complex and expensive vacuum-based integrated circuit (IC) processes. Here, a low-cost manufacturing approach for bioresorbable conductors on bioresorbable polymer substrates by evaporation-condensation-mediated laser printing and sintering of Zn nanoparticle is reported. Laser sintering of Zn nanoparticles has been technically difficult due to the surface oxide on nanoparticles. To circumvent the surface oxide, a novel approach is discovered to print and sinter Zn nanoparticle facilitated by evaporation-condensation in confined domains. The printing process can be performed on low-temperature substrates in ambient environment allowing easy integration on a roll-to-roll platform for economical manufacturing of bioresorbable electronics. The fabricated Zn conductors show excellent electrical conductivity (≈1.124 × 10 6 S m -1 ), mechanical durability, and water dissolvability. Successful demonstration of strain gauges confirms the potential application in various environmentally friendly sensors and circuits. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers.

PubMed

Yamane, Luciana Harue; de Moraes, Viviane Tavares; Espinosa, Denise Crocce Romano; Tenório, Jorge Alberto Soares

2011-12-01

This paper presents a comparison between printed circuit boards from computers and mobile phones. Since printed circuits boards are becoming more complex and smaller, the amount of materials is constantly changing. The main objective of this work was to characterize spent printed circuit boards from computers and mobile phones applying mineral processing technique to separate the metal, ceramic, and polymer fractions. The processing was performed by comminution in a hammer mill, followed by particle size analysis, and by magnetic and electrostatic separation. Aqua regia leaching, loss-on-ignition and chemical analysis (inductively coupled plasma atomic emission spectroscopy - ICP-OES) were carried out to determine the composition of printed circuit boards and the metal rich fraction. The composition of the studied mobile phones printed circuit boards (PCB-MP) was 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers; and of the printed circuit boards from studied personal computers (PCB-PC) was 45 wt.% metals; 27 wt.% polymers and ceramics 28 wt.% ceramics. The chemical analysis showed that copper concentration in printed circuit boards from personal computers was 20 wt.% and in printed circuit boards from mobile phones was 34.5 wt.%. According to the characteristics of each type of printed circuit board, the recovery of precious metals may be the main goal of the recycling process of printed circuit boards from personal computers and the recovery of copper should be the main goal of the recycling process of printed circuit boards from mobile phones. Hence, these printed circuit boards would not be mixed prior treatment. The results of this paper show that copper concentration is increasing in mobile phones and remaining constant in personal computers. Copyright © 2011 Elsevier Ltd. All rights reserved.

Separation of the metallic and non-metallic fraction from printed circuit boards employing green technology.

PubMed

Estrada-Ruiz, R H; Flores-Campos, R; Gámez-Altamirano, H A; Velarde-Sánchez, E J

2016-07-05

The generation of electrical and electronic waste is increasing day by day; recycling is attractive because of the metallic fraction containing these. Nevertheless, conventional techniques are highly polluting. The comminution of the printed circuit boards followed by an inverse flotation process is a clean technique that allows one to separate the metallic fraction from the non-metallic fraction. It was found that particle size and superficial air velocity are the main variables in the separation of the different fractions. In this way an efficient separation is achieved by avoiding the environmental contamination coupled with the possible utilization of the different fractions obtained. Copyright © 2016 Elsevier B.V. All rights reserved.

Ideas in Practice. Nuturing Creativity in a Measurements Course

ERIC Educational Resources Information Center

Neal, James P.

1972-01-01

Describes the conduct of a one-semester laboratory course for electrical engineering sophomores through the use of rack-mounted instruments and printed circuits. Concluded there was greater student and instructor interest and creativity in both lectures and laboratory. (CC)

Zone heated diesel particulate filter electrical connection

DOEpatents

Gonze, Eugene V.; Paratore, Jr., Michael J.

2010-03-30

An electrical connection system for a particulate filter is provided. The system includes: a particulate filter (PF) disposed within an outer shell wherein the PF is segmented into a plurality of heating zones; an outer mat disposed between the particulate filter and the outer shell; an electrical connector coupled to the outer shell of the PF; and a plurality of printed circuit connections that extend along the outer surface of the PF from the electrical connector to the plurality of heating zones.

A family of neuromuscular stimulators with optical transcutaneous control.

PubMed

Jarvis, J C; Salmons, S

1991-01-01

A family of miniature implantable neuromuscular stimulators has been developed using surface-mounted Philips 4000-series integrated circuits. The electronic components are mounted by hand on printed circuits (platinum/gold on alumina) and the electrical connections are made by reflow soldering. The plastic integrated-circuit packages, ceramic resistors and metal interconnections are protected from the body fluids by a coating of biocompatible silicone rubber. This simple technology provides reliable function for at least 4 months under implanted conditions. The circuits have in common a single lithium cell power-supply (3.2 V) and an optical sensor which can be used to detect light flashes through the skin after the device has been implanted. This information channel may be used to switch the output of a device on or off, or to cycle through a series of pre-set programs. The devices are currently finding application in studies which provide an experimental basis for the clinical exploitation of electrically stimulated skeletal muscle in cardiac assistance, sphincter reconstruction or functional electrical stimulation of paralysed limbs.

All-printed magnetically self-healing electrochemical devices

PubMed Central

Bandodkar, Amay J.; López, Cristian S.; Vinu Mohan, Allibai Mohanan; Yin, Lu; Kumar, Rajan; Wang, Joseph

2016-01-01

The present work demonstrates the synthesis and application of permanent magnetic Nd2Fe14B microparticle (NMP)–loaded graphitic inks for realizing rapidly self-healing inexpensive printed electrochemical devices. The incorporation of NMPs into the printable ink imparts impressive self-healing ability to the printed conducting trace, with rapid (~50 ms) recovery of repeated large (3 mm) damages at the same or different locations without any user intervention or external trigger. The permanent and surrounding-insensitive magnetic properties of the NMPs thus result in long-lasting ability to repair extreme levels of damage, independent of ambient conditions. This remarkable self-healing capability has not been reported for existing man-made self-healing systems and offers distinct advantages over common capsule and intrinsically self-healing systems. The printed system has been characterized by leveraging crystallographic, magnetic hysteresis, microscopic imaging, electrical conductivity, and electrochemical techniques. The real-life applicability of the new self-healing concept is demonstrated for the autonomous repair of all-printed batteries, electrochemical sensors, and wearable textile-based electrical circuits, indicating considerable promise for widespread practical applications and long-lasting printed electronic devices. PMID:27847875

Multidisciplinary analysis and design of printed wiring boards

NASA Astrophysics Data System (ADS)

Fulton, Robert E.; Hughes, Joseph L.; Scott, Waymond R., Jr.; Umeagukwu, Charles; Yeh, Chao-Pin

1991-04-01

Modern printed wiring board design depends on electronic prototyping using computer-based simulation and design tools. Existing electrical computer-aided design (ECAD) tools emphasize circuit connectivity with only rudimentary analysis capabilities. This paper describes a prototype integrated PWB design environment denoted Thermal Structural Electromagnetic Testability (TSET) being developed at Georgia Tech in collaboration with companies in the electronics industry. TSET provides design guidance based on enhanced electrical and mechanical CAD capabilities including electromagnetic modeling testability analysis thermal management and solid mechanics analysis. TSET development is based on a strong analytical and theoretical science base and incorporates an integrated information framework and a common database design based on a systematic structured methodology.

Cleaning of printed circuit assemblies with surface-mounted components

NASA Astrophysics Data System (ADS)

Arzigian, J. S.

The need for ever-increasing miniaturization of airborne instrumentation through the use of surface mounted components closely placed on printed circuit boards highlights problems with traditional board cleaning methods. The reliability of assemblies which have been cleaned with vapor degreasing and spray cleaning can be seriously compromised by residual contaminants leading to solder joint failure, board corrosion, and even electrical failure of the mounted parts. In addition, recent government actions to eliminate fully halogenated chlorofluorocarbons (CFC) and chlorinated hydrocarbons from the industrial environment require the development of new cleaning materials and techniques. This paper discusses alternative cleaning materials and techniques and results that can be expected with them. Particular emphasis is placed on problems related to surface-mounted parts. These new techniques may lead to improved circuit reliability and, at the same time, be less expensive and less environmentally hazardous than the traditional systems.

Theoretic model and computer simulation of separating mixture metal particles from waste printed circuit board by electrostatic separator.

PubMed

Li, Jia; Xu, Zhenming; Zhou, Yaohe

2008-05-30

Traditionally, the mixture metals from waste printed circuit board (PCB) were sent to the smelt factory to refine pure copper. Some valuable metals (aluminum, zinc and tin) with low content in PCB were lost during smelt. A new method which used roll-type electrostatic separator (RES) to recovery low content metals in waste PCB was presented in this study. The theoretic model which was established from computing electric field and the analysis of forces on the particles was used to write a program by MATLAB language. The program was design to simulate the process of separating mixture metal particles. Electrical, material and mechanical factors were analyzed to optimize the operating parameters of separator. The experiment results of separating copper and aluminum particles by RES had a good agreement with computer simulation results. The model could be used to simulate separating other metal (tin, zinc, etc.) particles during the process of recycling waste PCBs by RES.

Improving Heat Transfer Performance of Printed Circuit Boards

NASA Technical Reports Server (NTRS)

Schatzel, Donald V.

2009-01-01

This paper will explore the ability of printed circuit boards laminated with a Carbon Core Laminate to transfer heat vs. standard printed circuit boards that use only thick layers of copper. The paper will compare the differences in heat transfer performance of printed circuit boards with and without CCL.

High-yield transfer printing of metal-insulator-metal nanodiodes.

PubMed

Bareiss, Mario; Ante, Frederik; Kälblein, Daniel; Jegert, Gunther; Jirauschek, Christian; Scarpa, Giuseppe; Fabel, Bernhard; Nelson, Edward M; Timp, Gregory; Zschieschang, Ute; Klauk, Hagen; Porod, Wolfgang; Lugli, Paolo

2012-03-27

Nanoscale metal-insulator-metal (MIM) diodes represent important devices in the fields of electronic circuits, detectors, communication, and energy, as their cutoff frequencies may extend into the "gap" between the electronic microwave range and the optical long-wave infrared regime. In this paper, we present a nanotransfer printing method, which allows the efficient and simultaneous fabrication of large-scale arrays of MIM nanodiode stacks, thus offering the possibility of low-cost mass production. In previous work, we have demonstrated the successful transfer and electrical characterization of macroscopic structures. Here, we demonstrate for the first time the fabrication of several millions of nanoscale diodes with a single transfer-printing step using a temperature-enhanced process. The electrical characterization of individual MIM nanodiodes was performed using a conductive atomic force microscope (AFM) setup. Our analysis shows that the tunneling current is the dominant conduction mechanism, and the electrical measurement data agree well with experimental data on previously fabricated microscale diodes and numerical simulations. © 2012 American Chemical Society

Interferometric surface mapping with variable sensitivity.

PubMed

Jaerisch, W; Makosch, G

1978-03-01

In the photolithographic process, presently employed for the production of integrated circuits, sets of correlated masks are used for exposing the photoresist on silicon wafers. Various sets of masks which are printed in different printing tools must be aligned correctly with respect to the structures produced on the wafer in previous process steps. Even when perfect alignment is considered, displacements and distortions of the printed wafer patterns occur. They are caused by imperfections of the printing tools or/and wafer deformations resulting from high temperature processes. Since the electrical properties of the final integrated circuits and therefore the manufacturing yield depend to a great extent on the precision at which such patterns are superimposed, simple and fast overlay measurements and flatness measurements as well are very important in IC-manufacturing. A simple optical interference method for flatness measurements will be described which can be used under manufacturing conditions. This method permits testing of surface height variations by nearly grazing light incidence by absence of a physical reference plane. It can be applied to polished surfaces and rough surfaces as well.

Solar array flight experiment

NASA Technical Reports Server (NTRS)

1986-01-01

Emerging satellite designs require increasing amounts of electrical power to operate spacecraft instruments and to provide environments suitable for human habitation. In the past, electrical power was generated by covering rigid honeycomb panels with solar cells. This technology results in unacceptable weight and volume penalties when large amounts of power are required. To fill the need for large-area, lightweight solar arrays, a fabrication technique in which solar cells are attached to a copper printed circuit laminated to a plastic sheet was developed. The result is a flexible solar array with one-tenth the stowed volume and one-third the weight of comparably sized rigid arrays. An automated welding process developed to attack the cells to the printed circuit guarantees repeatable welds that are more tolerant of severe environments than conventional soldered connections. To demonstrate the flight readiness of this technology, the Solar Array Flight Experiment (SAFE) was developed and flown on the space shuttle Discovery in September 1984. The tests showed the modes and frequencies of the array to be very close to preflight predictions. Structural damping, however, was higher than anticipated. Electrical performance of the active solar panel was also tested. The flight performance and postflight data evaluation are described.

Wideband analytical equivalent circuit for one-dimensional periodic stacked arrays.

PubMed

Molero, Carlos; Rodríguez-Berral, Raúl; Mesa, Francisco; Medina, Francisco; Yakovlev, Alexander B

2016-01-01

A wideband equivalent circuit is proposed for the accurate analysis of scattering from a set of stacked slit gratings illuminated by a plane wave with transverse magnetic or electric polarization that impinges normally or obliquely along one of the principal planes of the structure. The slit gratings are printed on dielectric slabs of arbitrary thickness, including the case of closely spaced gratings that interact by higher-order modes. A Π-circuit topology is obtained for a pair of coupled arrays, with fully analytical expressions for all the circuit elements. This equivalent Π circuit is employed as the basis to derive the equivalent circuit of finite stacks with any given number of gratings. Analytical expressions for the Brillouin diagram and the Bloch impedance are also obtained for infinite periodic stacks.

Fully Printed Flexible and Stretchable Electronics

NASA Astrophysics Data System (ADS)

Zhang, Suoming

Through this thesis proposal, the author has demonstrated series of flexible or stretchable sensors including strain gauge, pressure sensors, display arrays, thin film transistors and photodetectors fabricated by a direct printing process. By adopting the novel serpentine configuration with conventional non-stretchable materials silver nanoparticles, the fully printed stretchable devices are successfully fabricated on elastomeric substrate with the demonstration of stretchable conductors that can maintain the electrical properties under strain and the strain gauge, which could be used to measure the strain in desired locations and also to monitor individual person's finger motion. And by investigating the intrinsic stretchable materials silver nanowires (AgNWs) with the conventional configuration, the fully printed stretchable conductors are achieved on various substrates including Si, glass, Polyimide, Polydimethylsiloxane (PDMS) and Very High Bond (VHB) tape with the illustration of the capacitive pressure sensor and stretchable electroluminescent displays. In addition, intrinsically stretchable thin-film transistors (TFTs) and integrated logic circuits are directly printed on elastomeric PDMS substrates. The printed devices utilize carbon nanotubes and a type of hybrid gate dielectric comprising PDMS and barium titanate (BaTiO3) nanoparticles. The BaTiO3/PDMS composite simultaneously provides high dielectric constant, superior stretchability, low leakage, as well as good printability and compatibility with the elastomeric substrate. Both TFTs and logic circuits can be stretched beyond 50% strain along either channel length or channel width directions for thousands of cycles while showing no significant degradation in electrical performance. Finally, by applying the SWNTs as the channel layer of the thin film transistor, we successfully fabricate the fully printed flexible photodetector which exhibits good electrical characteristics and the transistors exhibit good reliability under bending conditions owing to the ultrathin polyimide substrate as well as the superior mechanical flexibility of the gate dielectric and carbon nanotube network. Furthermore, we have demonstrated that by using two types of SWCNT samples with different optical absorption characteristics, the photoresponse exhibits unique wavelength selectivity, as manifested by the good correlation between the responsive wavelengths of the devices with the absorption peaks of the corresponding carbon nanotubes. All the proposed materials above together with the unique direct printing process may offer an entry into more sophisticated flexible or stretchable electronic systems with monolithically integrated sensors, actuators, and displays for real life applications.

Microfabrication of passive electronic components with printed graphene-oxide deposition

NASA Astrophysics Data System (ADS)

Sinar, Dogan; Knopf, George K.; Nikumb, Suwas

2014-03-01

Flexible electronic circuitry is an emerging technology that will significantly impact the future of healthcare and medicine, food safety inspection, environmental monitoring, and public security. Recent advances in drop-on-demand printing technology and electrically conductive inks have enabled simple electronic circuits to be fabricated on mechanically flexible polymers, paper, and bioresorbable silk. Research has shown that graphene, and its derivative formulations, can be used to create low-cost electrically conductive inks. Graphene is a one atom thick two-dimensional layer composed of carbon atoms arranged in a hexagonal lattice forming a material with very high fracture strength, high Young's Modulus, and low electrical resistance. Non-conductive graphene-oxide (GO) inks can also be synthesized from inexpensive graphite powders. Once deposited on the flexible substrate the electrical conductivity of the printed GO microcircuit traces can be restored through thermal reduction. In this paper, a femtosecond laser with a wavelength of 775nm and pulse width of 120fs is used to transform the non-conductive printed GO film into electrically conductive oxygen reduced graphene-oxide (rGO) passive electronic components by the process of laser assisted thermal reduction. The heat affected zone produced during the process was minimized because of the femtosecond pulsed laser. The degree of conductivity exhibited by the microstructure is directly related to the laser power level and exposure time. Although rGO films have higher resistances than pristine graphene, the ability to inkjet print capacitive elements and modify local resistive properties provides for a new method of fabricating sensor microcircuits on a variety of substrate surfaces.

Electrically operated magnetic switch designed to display reduced leakage inductance

DOEpatents

Cook, Edward G.

1994-01-01

An electrically operated magnetic switch is disclosed herein for use in opening and closing a circuit between two terminals depending upon the voltage across these terminals. The switch so disclosed is comprised of a ferrite core in the shape of a toroid having opposing ends and opposite inner and outer sides and an arrangement of electrically conductive components defining at least one current flow path which makes a number of turns around the core. This arrangement of components includes a first plurality of electrically conducive rigid rods parallel with and located outside the outer side of the core and a second plurality of electrically conductive rigid rods parallel with and located inside the inner side of the core. The arrangement also includes means for electrically connecting these rods together so that the define the current flow path. In one embodiment, this latter means uses rigid cross-tab means. In another, preferred embodiment, printed circuits on rigid dielectric substrates located on opposite ends of the core are utilized to interconnect the rods together.

Inkjet printed large-area flexible circuits: a simple methodology for optimizing the printing quality

NASA Astrophysics Data System (ADS)

Cheng, Tao; Wu, Youwei; Shen, Xiaoqin; Lai, Wenyong; Huang, Wei

2018-01-01

In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjet-printed silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics. Project supported by the National Key Basic Research Program of China (Nos. 2014CB648300, 2017YFB0404501), the National Natural Science Foundation of China (Nos. 21422402, 21674050), the Natural Science Foundation of Jiangsu Province (Nos. BK20140060, BK20130037, BK20140865, BM2012010), the Program for Jiangsu Specially-Appointed Professors (No. RK030STP15001), the Program for New Century Excellent Talents in University (No. NCET-13-0872), the NUPT "1311 Project" and Scientific Foundation (Nos. NY213119, NY213169), the Synergetic Innovation Center for Organic Electronics and Information Displays, the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD), the Leading Talent of Technological Innovation of National Ten-Thousands Talents Program of China, the Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions (No. TJ217038), the Program for Graduate Students Research and Innovation of Jiangsu Province (No. KYZZ16-0253), and the 333 Project of Jiangsu Province (Nos. BRA2017402, BRA2015374).

Printed Electronic Devices in Human Spaceflight

NASA Technical Reports Server (NTRS)

Bacon, John B.

2004-01-01

The space environment requires robust sensing, control, and automation, whether in support of human spaceflight or of robotic exploration. Spaceflight embodies the known extremes of temperature, radiation, shock, vibration, and static loads, and demands high reliability at the lowest possible mass. Because printed electronic circuits fulfill all these requirements, printed circuit technology and the exploration of space have been closely coupled throughout their short histories. In this presentation, we will explore the space (and space launch) environments as drivers of printed circuit design, a brief history of NASA's use of printed electronic circuits, and we will examine future requirements for such circuits in our continued exploration of space.

3D nanostructured inkjet printed graphene via UV-pulsed laser irradiation enables paper-based electronics and electrochemical devices.

PubMed

Das, Suprem R; Nian, Qiong; Cargill, Allison A; Hondred, John A; Ding, Shaowei; Saei, Mojib; Cheng, Gary J; Claussen, Jonathan C

2016-09-21

Emerging research on printed and flexible graphene-based electronics is beginning to show tremendous promise for a wide variety of fields including wearable sensors and thin film transistors. However, post-print annealing/reduction processes that are necessary to increase the electrical conductivity of the printed graphene degrade sensitive substrates (e.g., paper) and are whole substrate processes that are unable to selectively anneal/reduce only the printed graphene-leaving sensitive device components exposed to damaging heat or chemicals. Herein a pulsed laser process is introduced that can selectively irradiate inkjet printed reduced graphene oxide (RGO) and subsequently improve the electrical conductivity (Rsheet∼0.7 kΩ□(-1)) of printed graphene above previously published reports. Furthermore, the laser process is capable of developing 3D petal-like graphene nanostructures from 2D planar printed graphene. These visible morphological changes display favorable electrochemical sensing characteristics-ferricyanide cyclic voltammetry with a redox peak separation (ΔEp) ≈ 0.7 V as well as hydrogen peroxide (H2O2) amperometry with a sensitivity of 3.32 μA mM(-1) and a response time of <5 s. Thus this work paves the way for not only paper-based electronics with graphene circuits, it enables the creation of low-cost and disposable graphene-based electrochemical electrodes for myriad applications including sensors, biosensors, fuel cells, and theranostic devices.

Study of Increasing Lead Times in Major Weapon Systems Acquisition.

DTIC Science & Technology

1982-07-31

Conduit Covers X X X Connectors, Electrical X X X X X Control Systems (Auto- mated, Boiler) X Davit, Boat, Power- Opera.ted X Diodes X X X X A iX...tubes. Other end uses include washers in computer equipment, electrical insulators in motors and generators, and retardation plates in lasers . Supply...relays, electron tubes, printed circuits, and resistors. Platinum is also used in dentistry and for jewelry. Supply, A small amount of platinum (less

Biomedical Implementation of Liquid Metal Ink as Drawable ECG Electrode and Skin Circuit

PubMed Central

Yu, Yang; Zhang, Jie; Liu, Jing

2013-01-01

Background Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG) electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs). Methods Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. Results With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as −0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs) were lit and emitted colorful lights. Conclusions The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and biological circuit manufacturing technique in a large extent. PMID:23472220

Biomedical implementation of liquid metal ink as drawable ECG electrode and skin circuit.

PubMed

Yu, Yang; Zhang, Jie; Liu, Jing

2013-01-01

Conventional ways of making bio-electrodes are generally complicated, expensive and unconformable. Here we describe for the first time the method of applying Ga-based liquid metal ink as drawable electrocardiogram (ECG) electrodes. Such material owns unique merits in both liquid phase conformability and high electrical conductivity, which provides flexible ways for making electrical circuits on skin surface and a prospective substitution of conventional rigid printed circuit boards (PCBs). Fundamental measurements of impedance and polarization voltage of the liquid metal ink were carried out to evaluate its basic electrical properties. Conceptual experiments were performed to draw the alloy as bio-electrodes to acquire ECG signals from both rabbit and human via a wireless module developed on the mobile phone. Further, a typical electrical circuit was drawn in the palm with the ink to demonstrate its potential of implementing more sophisticated skin circuits. With an oxide concentration of 0.34%, the resistivity of the liquid metal ink was measured as 44.1 µΩ·cm with quite low reactance in the form of straight line. Its peak polarization voltage with the physiological saline was detected as -0.73 V. The quality of ECG wave detected from the liquid metal electrodes was found as good as that of conventional electrodes, from both rabbit and human experiments. In addition, the circuit drawn with the liquid metal ink in the palm also runs efficiently. When the loop was switched on, all the light emitting diodes (LEDs) were lit and emitted colorful lights. The liquid metal ink promises unique printable electrical properties as both bio-electrodes and electrical wires. The implemented ECG measurement on biological surface and the successfully run skin circuit demonstrated the conformability and attachment of the liquid metal. The present method is expected to innovate future physiological measurement and biological circuit manufacturing technique in a large extent.

Evaluating waste printed circuit boards recycling: Opportunities and challenges, a mini review.

PubMed

Awasthi, Abhishek Kumar; Zlamparet, Gabriel Ionut; Zeng, Xianlai; Li, Jinhui

2017-04-01

Rapid generation of waste printed circuit boards has become a very serious issue worldwide. Numerous techniques have been developed in the last decade to resolve the pollution from waste printed circuit boards, and also recover valuable metals from the waste printed circuit boards stream on a large-scale. However, these techniques have their own certain specific drawbacks that need to be rectified properly. In this review article, these recycling technologies are evaluated based on a strength, weaknesses, opportunities and threats analysis. Furthermore, it is warranted that, the substantial research is required to improve the current technologies for waste printed circuit boards recycling in the outlook of large-scale applications.

Ergonomics improvements of the visual inspection process in a printed circuit assembly factory.

PubMed

Yeow, Paul H P; Sen, Rabindra Nath

2004-01-01

An ergonomics improvement study was conducted on the visual inspection process of a printed circuit assembly (PCA) factory. The process was studied through subjective assessment and direct observation. Three problems were identified: operators' eye problems, insufficient time for inspection and ineffective visual inspection. These problems caused a huge yearly rejection cost of US 298,240 dollars, poor quality, customer dissatisfaction and poor occupational health and safety. Ergonomics interventions were made to rectify the problems: reduced usage of a magnifying glass, the use of less glaring inspection templates, inspection of only electrically non-tested components and introduction of a visual inspection sequence. The interventions produced savings in rejection cost, reduced operators' eye strain, headaches and watery eyes, lowered the defect percentage at customers' sites and increased the factory's productivity and customer satisfaction.

PCBA depaneling stress minimization study

NASA Astrophysics Data System (ADS)

Darus, M. H. B. M.; Aziz, M. H. B. A.; Ong, N. R.; Alcain, J. B.; Retnasamy, V.

2017-09-01

Printed circuit board (PCB) is board that used to connect the electricity using the conductive pathways. The PCB that consists with electronic components was called as printed circuit board assembly (PCBA). Bending process has been used as one of the depaneling techniques may contribute to mechanical stress and the failure of capacitors and other components to function. As a result, the idea to create holes in particular location was implemented in order to absorb the stress. In this study, finite element analysis is demonstrated by using ANSYS software. Two PCBA design models are considered in order to investigate the effect of the hole and the stress response. The simulation results show that the hole on the PCBA has reduced the stress. For Design model 2, the stress response of the holes located vertically to the PCBA is lower than the holes located horizontally to the PCBA.

Optimizing the operating parameters of corona electrostatic separation for recycling waste scraped printed circuit boards by computer simulation of electric field.

PubMed

Li, Jia; Lu, Hongzhou; Liu, Shushu; Xu, Zhenming

2008-05-01

The printed circuit board (PCB) has a metal content of nearly 28% metal, including an abundance of nonferrous metals such as copper, lead, and tin. The purity of precious metals in PCBs is more than 10 times that of rich-content minerals. Therefore, the recycling of PCBs is an important subject, not only from the viewpoint of waste treatment, but also with respect to the recovery of valuable materials. Compared with traditional process the corona electrostatic separation (CES) had no waste water or gas during the process and it had high productivity with a low-energy cost. In this paper, the roll-type corona electrostatic separator was used to separate metals and nonmetals from scraped waste PCBs. The software MATLAB was used to simulate the distribution of electric field in separating space. It was found that, the variations of parameters of electrodes and applied voltages directly influenced the distribution of electric field. Through the correlation of simulated and experimental results, the good separation results were got under the optimized operating parameter: U=20-30 kV, L=L(1)=L(2)=0.21 m, R(1)=0.114, R(2)=0.019 m, theta(1)=20 degrees and theta(2)=60 degrees .

Industrial Applications of Graphite Fluoride Fibers

NASA Technical Reports Server (NTRS)

Hung, Ching-Cheh; Kucera, Donald

1991-01-01

Based on fluorination technology developed during 1934 to 1959, and the fiber technology developed during the 1970s, a new process was developed to produce graphite fluoride fibers. In the process, pitch based graphitized carbon fibers are at first intercalated and deintercalated several times by bromine and iodine, followed by several cycles of nitrogen heating and fluorination at 350 to 370 C. Electrical, mechanical, and thermal properties of this fiber depend on the fluorination process and the fluorine content of the graphite fluoride product. However, these properties are between those of graphite and those of PTFE (Teflon). Therefore, it is considered to be a semiplastic. The physical properties suggest that this new material may have many new and unexplored applications. For example, it can be a thermally conductive electrical insulator. Its coefficient of thermal expansion (CTE) can be adjusted to match that of silicon, and therefore, it can be a heat sinking printed circuit board which is CTE compatible with silicon. Using these fibers in printed circuit boards may provide improved electrical performance and reliability of the electronics on the board over existing designs. Also, since it releases fluorine at 300 C or higher, it can be used as a material to store fluorine and to conduct fluorination. This application may simplify the fluorination process and reduce the risk of handling fluorine.

Vibration analysis of printed circuit boards: Effect of boundary condition

NASA Astrophysics Data System (ADS)

Prashanth, M. D.

2018-04-01

A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. The modeling and analysis of printed circuit boards is required for accurate prediction of response due to vibration loads. The response of PCB is highly dependent on the mounting configuration of PCB. In addition, anti-vibration mounts or stiffeners are used to reduce the PCB response. Vibration analysis of printed circuit boards is carried out using finite element method. The objective of this paper is to determine the dynamic characteristics of a printed circuit board. Modeling and analysis of PCB shall be carried out to study the effect of boundary conditions on the vibration response. The modeling of stiffeners or ribs shall also be considered in detail. The analysis results shall be validated using vibration tests of PCB.

Reliability Assessment of Critical Electronic Components

DTIC Science & Technology

1992-07-01

Failures FLHP - Full Horse Power FSN - Federal Stock Number I Current IC - Integrated Circuit IPB - Illustrated Parts Breakdown K - Boltzmans Constant L...Classified P - Power PC - Printed Circuit PCB - Printed Circuit Board PGA - Pin Grid Array PPM - Parts Per Million PWB - Printed Wiring Board 0...4-59 4.4.3.2.3 Circuit Brcakers ......................................................... 4-59 4.4.3.2.4 Thermal

An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

PubMed

Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

2016-06-01

The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. © The Author(s) 2016.

Direct Desktop Printed-Circuits-on-Paper Flexible Electronics

PubMed Central

Zheng, Yi; He, Zhizhu; Gao, Yunxia; Liu, Jing

2013-01-01

There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensing machine and designing a brush like porous pinhead for printing alloy and identifying matched substrate materials among different papers, the slightly oxidized alloy ink was demonstrated to be flexibly printed on coated paper, which could compose various functional electronics and the concept of Printed-Circuits-on-Paper was thus presented. Further, RTV silicone rubber was adopted as isolating inks and packaging material to guarantee the functional stability of the circuit, which suggests an approach for printing 3D hybrid electro-mechanical device. The present work paved the way for a low cost and easygoing method in directly printing paper electronics.

Hard and flexible optical printed circuit board

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Hyun Sik; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

2007-02-01

We report on the design and fabrication of hard and flexible optical printed circuit boards (O-PCBs). The objective is to realize generic and application-specific O-PCBs, either in hard form or flexible form, that are compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly, for low-cost and high-volume universal applications. The O-PCBs consist of 2-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate micro/nano-scale photonic devices. The micro/nano-optical functional devices include lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices. For flexible boards, the optical waveguide arrays are fabricated on flexible poly-ethylen terephthalate (PET) substrates by UV embossing. Electrical layer carrying VCSEL and PD array is laminated with the optical layer carrying waveguide arrays. Both hard and flexible electrical lines are replaced with high speed optical interconnection between chips over four waveguide channels up to 10Gbps on each. We discuss uses of hard or flexible O-PCBs for telecommunication systems, computer systems, transportation systems, space/avionic systems, and bio-sensor systems.

Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Noh, H. S.; Kim, K. H.; Song, S. H.

2006-09-01

A collective overview and review is presented on the original work conducted on the theory, design, fabrication, and in-tegration of micro/nano-scale optical wires and photonic devices for applications in a newly-conceived photonic systems called "optical printed circuit board" (O-PCBs) and "VLSI photonic integrated circuits" (VLSI-PIC). These are aimed for compact, high-speed, multi-functional, intelligent, light-weight, low-energy and environmentally friendly, low-cost, and high-volume applications to complement or surpass the capabilities of electrical PCBs (E-PCBs) and/or VLSI electronic integrated circuit (VLSI-IC) systems. These consist of 2-dimensional or 3-dimensional planar arrays of micro/nano-optical wires and circuits to perform the functions of all-optical sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards or substrates. The integrated optical devices include micro/nano-scale waveguides, lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices, made of polymer, silicon and other semiconductor materials. For VLSI photonic integration, photonic crystals and plasmonic structures have been used. Scientific and technological issues concerning the processes of miniaturization, interconnection and integration of these systems as applicable to board-to-board, chip-to-chip, and intra-chip integration, are discussed along with applications for future computers, telecommunications, and sensor-systems. Visions and challenges toward these goals are also discussed.

Printed wiring board system programmer's manual

NASA Technical Reports Server (NTRS)

Brinkerhoff, C. D.

1973-01-01

The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

High-Throughput Printing Process for Flexible Electronics

NASA Astrophysics Data System (ADS)

Hyun, Woo Jin

Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

PERSONAL COMPUTER MONITORS: A SCREENING EVALUATION OF VOLATILE ORGANIC EMISSIONS FROM EXISTING PRINTED CIRCUIT BOARD LAMINATES AND POTENTIAL POLLUTION PREVENTION ALTERNATIVES

EPA Science Inventory

The report gives results of a screening evaluation of volatile organic emissions from printed circuit board laminates and potential pollution prevention alternatives. In the evaluation, printed circuit board laminates, without circuitry, commonly found in personal computer (PC) m...

Aluminum heat sink enables power transistors to be mounted integrally with printed circuit board

NASA Technical Reports Server (NTRS)

Seaward, R. C.

1967-01-01

Power transistor is provided with an integral flat plate aluminum heat sink which mounts directly on a printed circuit board containing associated circuitry. Standoff spacers are used to attach the heat sink to the printed circuit board containing the remainder of the circuitry.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fulkerson, Edward; Lanning, Rodney K.; Telford, Steven

A device includes a u-channel shaped member and a printed circuit board including a plurality of capacitors. Each of the plurality of capacitors has a mounting surface mounted to the printed circuit board and an opposing heat transfer surface thermally coupled to the u-channel shaped member. The device also includes an output cable coupled to the printed circuit board and a return cable coupled to the printed circuit board. The device further includes a control transistor disposed inside the u-channel shaped member and a current sensing resistor disposed inside the u-channel shaped member.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mitra, Kalyan Yoti, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de; Sowade, Enrico, E-mail: kalyan-yoti.mitra@mb.tu-chemnitz.de, E-mail: enrico.sowade@mb.tu-chemnitz.de; Martínez-Domingo, Carme

Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics. In this work, we report on the 1) printing, 2) fabrication yield and 3) characterization of exemplary simple devices e.g. capacitors, organic transistors etc. which are the basic building blocks for logical circuits. For this purpose, printing is performed first with a Proof of concept Inkjet printing system Dimatix Material Printer 2831 (DMP 2831) using 10 pL small print-heads and then with Dimatix Material Printer 3000 (DMP 3000) using 35 pL industrial print-heads (frommore » Fujifilm Dimatix). Printing at DMP 3000 using industrial print-heads (in Sheet-to-sheet) paves the path towards industrialization which can be defined by printing in Roll-to-Roll format using industrial print-heads. This pavement can be termed as 'Bridging Platform'. This transfer to 'Bridging Platform' from 10 pL small print-heads to 35 pL industrial print-heads help the inkjet-printed devices to evolve on the basis of functionality and also in form of up-scaled quantities. The high printed quantities and yield of inkjet-printed devices justify the deposition reliability and potential to print circuits. This reliability is very much desired when it comes to printing of circuits e.g. inverters, ring oscillator and any other planned complex logical circuits which require devices e.g. organic transistors which needs to get connected in different staged levels. Also, the up-scaled inkjet-printed devices are characterized and they reflect a domain under which they can work to their optimal status. This status is much wanted for predicting the real device functionality and integration of them into a planned circuit.« less

Conference Proceedings: Annual Review of Progress in Applied Computational Electromagnetics (ACES󈨢) (10th) Held in Monterey, California on March 21-26, 1994. Volume 2

DTIC Science & Technology

1994-01-01

These enhancements have allowed us to use GEMACS to model very small ( electrical ) features such as 0.1V pins on printed circuit boards without the...34Enhancements and Limitations of the Code NEC for Modeling Electrically Small Antennas," Lawrence Livermore National Laboratory, Report UCID-20970, January... electrical lengths of the coupling paths arc also shown in Figure 6. The "LB" indicates the large box dimensions (1/4.4 scale model ) and "SB" Indicates the

Electrically operated magnetic switch designed to display reduced leakage inductance

DOEpatents

Cook, E.G.

1994-05-10

An electrically operated magnetic switch is disclosed herein for use in opening and closing a circuit between two terminals depending upon the voltage across these terminals. The switch so disclosed is comprised of a ferrite core in the shape of a toroid having opposing ends and opposite inner and outer sides and an arrangement of electrically conductive components defining at least one current flow path which makes a number of turns around the core. This arrangement of components includes a first plurality of electrically conducive rigid rods parallel with and located outside the outer side of the core and a second plurality of electrically conductive rigid rods parallel with and located inside the inner side of the core. The arrangement also includes means for electrically connecting these rods together so that the define the current flow path. In one embodiment, this latter means uses rigid cross-tab means. In another, preferred embodiment, printed circuits on rigid dielectric substrates located on opposite ends of the core are utilized to interconnect the rods together. 10 figures.

Integrated bioleaching of copper metal from waste printed circuit board-a comprehensive review of approaches and challenges.

PubMed

Awasthi, Abhishek Kumar; Zeng, Xianlai; Li, Jinhui

2016-11-01

Waste electrical and electronic equipment (e-waste) is the most rapidly growing waste stream in the world, and the majority of the residues are openly disposed of in developing countries. Waste printed circuit boards (WPCBs) make up the major portion of e-waste, and their informal recycling can cause environmental pollution and health risks. Furthermore, the conventional disposal and recycling techniques-mechanical treatments used to recover valuable metals, including copper-are not sustainable in the long term. Chemical leaching is rapid and efficient but causes secondary pollution. Bioleaching is a promising approach, eco-friendly and economically feasible, but it is slower process. This review considers the recycling potential of microbes and suggests an integrated bioleaching approach for Cu extraction and recovery from WPCBs. The proposed recycling system should be more effective, efficient and both technically and economically feasible.

Waste Printed Circuit Board (PCB) Recycling Techniques.

PubMed

Ning, Chao; Lin, Carol Sze Ki; Hui, David Chi Wai; McKay, Gordon

2017-04-01

With the development of technologies and the change of consumer attitudes, the amount of waste electrical and electronic equipment (WEEE) is increasing annually. As the core part of WEEE, the waste printed circuit board (WPCB) is a dangerous waste but at the same time a rich resource for various kinds of materials. In this work, various WPCB treatment methods as well as WPCB recycling techniques divided into direct treatment (landfill and incineration), primitive recycling technology (pyrometallurgy, hydrometallurgy, biometallurgy and primitive full recovery of NMF-non metallic fraction), and advanced recycling technology (mechanical separation, direct use and modification of NMF) are reviewed and analyzed based on their advantages and disadvantages. Also, the evaluation criteria are discussed including economic, environmental, and gate-to-market ability. This review indicates the future research direction of WPCB recycling should focus on a combination of several techniques or in series recycling to maximize the benefits of process.

PUZZLE - A program for computer-aided design of printed circuit artwork

NASA Technical Reports Server (NTRS)

Harrell, D. A. W.; Zane, R.

1971-01-01

Program assists in solving spacing problems encountered in printed circuit /PC/ design. It is intended to have maximum use for two-sided PC boards carrying integrated circuits, and also aids design of discrete component circuits.

Piezoelectric Response of Ferroelectric Ceramics Under Mechanical Stress

DTIC Science & Technology

2015-09-17

dynamic response, and predict mechanical breakdown of electronic materials, numerous testing techniques such as very high-g machines , drop towers...James C. Hierholzer for building the custom test fixture, Michael D. Craft for his help with static capacitance measurements, Bryan J. Turner, Scott D...ISOLA 370HR Board Specimen Test Set-Up . . . . . . . . . . . . . . . . . . 59 3.3 Printed Circuit Board Electrical Layout

3D Printing of Shape Memory Polymers for Flexible Electronic Devices.

PubMed

Zarek, Matt; Layani, Michael; Cooperstein, Ido; Sachyani, Ela; Cohn, Daniel; Magdassi, Shlomo

2016-06-01

The formation of 3D objects composed of shape memory polymers for flexible electronics is described. Layer-by-layer photopolymerization of methacrylated semicrystalline molten macromonomers by a 3D digital light processing printer enables rapid fabrication of complex objects and imparts shape memory functionality for electrical circuits. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Scalable printed electronics: an organic decoder addressing ferroelectric non-volatile memory.

PubMed

Ng, Tse Nga; Schwartz, David E; Lavery, Leah L; Whiting, Gregory L; Russo, Beverly; Krusor, Brent; Veres, Janos; Bröms, Per; Herlogsson, Lars; Alam, Naveed; Hagel, Olle; Nilsson, Jakob; Karlsson, Christer

2012-01-01

Scalable circuits of organic logic and memory are realized using all-additive printing processes. A 3-bit organic complementary decoder is fabricated and used to read and write non-volatile, rewritable ferroelectric memory. The decoder-memory array is patterned by inkjet and gravure printing on flexible plastics. Simulation models for the organic transistors are developed, enabling circuit designs tolerant of the variations in printed devices. We explain the key design rules in fabrication of complex printed circuits and elucidate the performance requirements of materials and devices for reliable organic digital logic.

Carbon Based Transistors and Nanoelectronic Devices

NASA Astrophysics Data System (ADS)

Rouhi, Nima

Carbon based materials (carbon nanotube and graphene) has been extensively researched during the past decade as one of the promising materials to be used in high performance device technology. In long term it is thought that they may replace digital and/or analog electronic devices, due to their size, near-ballistic transport, and high stability. However, a more realistic point of insertion into market may be the printed nanoelectronic circuits and sensors. These applications include printed circuits for flexible electronics and displays, large-scale bendable electrical contacts, bio-membranes and bio sensors, RFID tags, etc. In order to obtain high performance thin film transistors (as the basic building block of electronic circuits) one should be able to manufacture dense arrays of all semiconducting nanotubes. Besides, graphene synthesize and transfer technology is in its infancy and there is plenty of room to improve the current techniques. To realize the performance of nanotube and graphene films in such systems, we need to economically fabricate large-scale devices based on these materials. Following that the performance control over such devices should also be considered for future design variations for broad range of applications. Here we have first investigated carbon nanotube ink as the base material for our devices. The primary ink used consisted of both metallic and semiconducting nanotubes which resulted in networks suitable for moderate-resistivity electrical connections (such as interconnects) and rfmatching circuits. Next, purified all-semiconducting nanotube ink was used to fabricate waferscale, high performance (high mobility, and high on/off ratio) thin film transistors for printed electronic applications. The parameters affecting device performance were studied in detail to establish a roadmap for the future of purified nanotube ink printed thin film transistors. The trade of between mobility and on/off ratio of such devices was studied and the effect of nanotube network density was explained in detail. On the other hand, graphene transfer technology was explored here as well. Annealing techniques were utilized to deposit clean graphene on arbitrary substrates. Raman spectroscopy and Raman data analysis was used to confirm the clean process. Furthermore, suspended graphene membrane was fabricated using single and multi-layer graphene films. This can make a major impact on graphene based transistors and bio-nano sensors technology.

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2016-01-01

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

Fate of bromine in pyrolysis of printed circuit board wastes.

PubMed

Chien, Y C; Wang, H P; Lin, K S; Huang, Y J; Yang, Y W

2000-02-01

Behavior of Br in pyrolysis of the printed circuit board waste with valuable copper and oil recycling has been studied in the present work. Experimentally, pyrolysis of the printed circuit board waste generated approximately 40.6% of oils, 24.9% of noncondensible gases and 34.5% of solid residues that enriched in copper (90-95%). The cuts of the oils produced from pyrolysis of the printed circuit board waste into weighted boiling fraction were primarily light naphtha and heavy gas oil. Approximately 72.3% of total Br in the printed circuit board waste were found in product gas mainly as HBr and bromobenzene. However, by extended X-ray absorption fine structural (EXAFS) spectroscopy, Cu-O and Cu-(O)-Cu species with bond distance of 1.87 and 2.95 A, respectively, were observed in the solid residues. Essentially, no Cu-Br species was found.

Structural Integration of Silicon Solar Cells and Lithium-ion Batteries Using Printed Electronics

NASA Astrophysics Data System (ADS)

Kang, Jin Sung

Inkjet printing of electrode using copper nanoparticle ink is presented. Electrode was printed on a flexible glass epoxy composite substrate using drop on demand piezoelectric dispenser and was sintered at 200°C in N 2 gas condition. The printed electrodes were made with various widths and thicknesses. Surface morphology of electrode was analyzed using scanning electron microscope (SEM) and atomic force microscope (AFM). Reliable dimensions for printed electronics were found from this study. Single-crystalline silicon solar cells were tested under four-point bending to find the feasibility of directly integrating them onto a carbon fiber/epoxy composite laminate. These solar cells were not able to withstand 0.2% strain. On the other hand, thin-film amorphous silicon solar cells were subjected to flexural fatigue loadings. The current density-voltage curves were analyzed at different cycles, and there was no noticeable degradation on its performance up to 100 cycles. A multifunctional composite laminate which can harvest and store solar energy was fabricated using printed electrodes. The integrated printed circuit board (PCB) was co-cured with a carbon/epoxy composite laminate by the vacuum bag molding process in an autoclave; an amorphous silicon solar cell and a thin-film solid state lithium-ion (Li-ion) battery were adhesively joined and electrically connected to a thin flexible PCB; and then the passive components such as resistors and diodes were electrically connected to the printed circuit board by silver pasting. Since a thin-film solid state Li-ion battery was not able to withstand tensile strain above 0.4%, thin Li-ion polymer batteries were tested under various mechanical loadings and environmental conditions to find the feasibility of using the polymer batteries for our multifunctional purpose. It was found that the Li-ion polymer batteries were stable under pressure and tensile loading without any noticeable degradation on its charge and discharge performances. Also, the active materials did not decompose at 80°C, and the battery was performing well under low temperature of -27°C. Lastly, the batteries were embedded inside a carbon fiber/epoxy composite laminate to characterize their performance under fatigue loading. Finally, an intense pulsed light (IPL) was used to sinter printed silver nanoink patterns. X-ray diffraction (XRD) was used to find grain size of printed silver nanoink patterns. From these analyses it was confirmed that IPL is able to adequately sinter silver nanoink patterns for printed electronics without degradation of the substrates in less than 30 ms.

Scalable printed electronics: an organic decoder addressing ferroelectric non-volatile memory

PubMed Central

Ng, Tse Nga; Schwartz, David E.; Lavery, Leah L.; Whiting, Gregory L.; Russo, Beverly; Krusor, Brent; Veres, Janos; Bröms, Per; Herlogsson, Lars; Alam, Naveed; Hagel, Olle; Nilsson, Jakob; Karlsson, Christer

2012-01-01

Scalable circuits of organic logic and memory are realized using all-additive printing processes. A 3-bit organic complementary decoder is fabricated and used to read and write non-volatile, rewritable ferroelectric memory. The decoder-memory array is patterned by inkjet and gravure printing on flexible plastics. Simulation models for the organic transistors are developed, enabling circuit designs tolerant of the variations in printed devices. We explain the key design rules in fabrication of complex printed circuits and elucidate the performance requirements of materials and devices for reliable organic digital logic. PMID:22900143

A study on Aerosol jet printing technology in LED module manufacturing

NASA Astrophysics Data System (ADS)

Rudorfer, Andreas; Tscherner, Martin; Palfinger, Christian; Reil, Frank; Hartmann, Paul; Seferis, Ioannis E.; Zych, Eugeniusz; Wenzl, Franz P.

2016-09-01

State of the art fabrication of LED modules based on chip-on-board (COB) technology comprises some shortcomings both with respect to the manufacturing process itself but also with regard to potential sources of failures and manufacturing impreciseness. One promising alternative is additive manufacturing, a technology which has gained a lot of attention during the last years due to its materials and cost saving capabilities. Especially direct-write technologies like Aerosol jet printing have demonstrated advantages compared to other technological approaches when printing high precision layers or high precision electronic circuits on substrates which, as an additional advantage, also can be flexible and 3D shaped. Based on test samples and test structures manufactured by Aerosol jet printing technology, in this context we discuss the potentials of additive manufacturing in various aspects of LED module fabrication, ranging from the deposition of the die-attach material, wire bond replacement by printed electrical connects as well as aspects of high-precision phosphor layer deposition for color conversion and white light generation.

Screen printing technology applied to silicon solar cell fabrication

NASA Technical Reports Server (NTRS)

Thornhill, J. W.; Sipperly, W. E.

1980-01-01

The process for producing space qualified solar cells in both the conventional and wraparound configuration using screen printing techniques was investigated. Process modifications were chosen that could be easily automated or mechanized. Work was accomplished to optimize the tradeoffs associated with gridline spacing, gridline definition and junction depth. An extensive search for possible front contact metallization was completed. The back surface field structures along with the screen printed back contacts were optimized to produce open circuit voltages of at least an average of 600 millivolts. After all intended modifications on the process sequence were accomplished, the cells were exhaustively tested. Electrical tests at AMO and 28 C were made before and after boiling water immersion, thermal shock, and storage under conditions of high temperature and high humidity.

Aerosol-jet-printed, 1 volt H-bridge drive circuit on plastic with integrated electrochromic pixel.

PubMed

Ha, Mingjing; Zhang, Wei; Braga, Daniele; Renn, Michael J; Kim, Chris H; Frisbie, C Daniel

2013-12-26

In this report, we demonstrate a printed, flexible, and low-voltage circuit that successfully drives a polymer electrochromic (EC) pixel as large as 4 mm(2) that is printed on the same substrate. All of the key components of the drive circuitry, namely, resistors, capacitors, and transistors, were aerosol-jet-printed onto a plastic foil; metallic electrodes and interconnects were the only components prepatterned on the plastic by conventional photolithography. The large milliampere drive currents necessary to switch a 4 mm(2) EC pixel were controlled by printed electrolyte-gated transistors (EGTs) that incorporate printable ion gels for the gate insulator layers and poly(3-hexylthiophene) for the semiconductor channels. Upon application of a 1 V input pulse, the circuit switches the printed EC pixel ON (red) and OFF (blue) two times in approximately 4 s. The performance of the circuit and the behavior of the individual resistors, capacitors, EGTs, and the EC pixel are analyzed as functions of the printing parameters and operating conditions.

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route havingmore » mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.« less

Laser printing of 3D metallic interconnects

NASA Astrophysics Data System (ADS)

Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

2016-04-01

The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

Thumbnail Sketches: The Chemistry of Printed Circuit Substrates: Some of the Latest Developments.

ERIC Educational Resources Information Center

Freeman, James H.

1984-01-01

Discusses some of the latest developments in the chemistry of printed circuit substrates. Topics considered include soldering, dicy (a catalyst), Kevlar (an aramid polymer fiber), maleimide copolymers, and flexible circuits. (JN)

Packaging system with cleaning channel and method of making the same

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fang, Lu

A packaging structure and method for surface mount integrated circuits reduces electrochemical migration (ECM) problems by including one or more cleaning channels to effectively and efficiently remove flux residue that may otherwise remain lodged in gaps between the surface mount package and the printed circuit board. A cleaning channel may be formed along a bottom surface of the surface mount package (i.e., the surface facing the printed circuit board), or along a portion of a top surface of the printed circuit board. In either case, the inclusion of a cleaning channel enlarges the gap between the bottom surface of themore » surface mount package and the printed circuit board and creates a path for contaminants to be flushed out during a cleaning process.« less

Flexible composite film for printed circuit board

NASA Technical Reports Server (NTRS)

Yabe, K.; Asakura, M.; Tanaka, H.; Soda, A.

1982-01-01

A flexible printed circuit for a printed circuit board in which layers of reaction product composed of a combination of phenoxy resin - polyisocyanate - brominated epoxy resin, and in which the equivalent ratio of those functional groups is hydroxyl group: isocyanate group: epoxy group - 1 : 0.2 to 2 : 0.5 to 3 are laminated on at least one side of saturated polyester film is discussed.

The Anti-RFI Design of Intelligent Electric Energy Meters with UHF RFID

NASA Astrophysics Data System (ADS)

Chen, Xiangqun; Huang, Rui; Shen, Liman; chen, Hao; Xiong, Dezhi; Xiao, Xiangqi; Liu, Mouhai; Xu, Renheng

2018-03-01

In order to solve the existing artificial meter reading watt-hour meter industry is still slow and inventory of common problems, using the uhf radio frequency identification (RFID) technology and intelligent watt-hour meter depth fusion, which has a one-time read multiple tags, identification distance, high transmission rate, high reliability, etc, while retaining the original asset management functions, in order to ensure the uhf RFID and minimum impact on the operation of the intelligent watt-hour meter, proposed to improve the stability of the electric meter system while working at the same time, this paper designs the uhf RFID intelligent watt-hour meter radio frequency interference resistance, put forward to improve intelligent watt-hour meter electromagnetic compatibility design train of thought, and introduced its power and the hardware circuit design of printed circuit board, etc.

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

NASA Technical Reports Server (NTRS)

Peckinpaugh, C. J.

1974-01-01

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

PubMed Central

Ji, Seok Young; Choi, Wonsuk; Jeon, Jin-Woo; Chang, Won Seok

2018-01-01

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations. PMID:29425144

Layered memristive and memcapacitive switches for printable electronics

NASA Astrophysics Data System (ADS)

Bessonov, Alexander A.; Kirikova, Marina N.; Petukhov, Dmitrii I.; Allen, Mark; Ryhänen, Tapani; Bailey, Marc J. A.

2015-02-01

Novel computing technologies that imitate the principles of biological neural systems may offer low power consumption along with distinct cognitive and learning advantages. The development of reliable memristive devices capable of storing multiple states of information has opened up new applications such as neuromorphic circuits and adaptive systems. At the same time, the explosive growth of the printed electronics industry has expedited the search for advanced memory materials suitable for manufacturing flexible devices. Here, we demonstrate that solution-processed MoOx/MoS2 and WOx/WS2 heterostructures sandwiched between two printed silver electrodes exhibit an unprecedentedly large and tunable electrical resistance range from 102 to 108 Ω combined with low programming voltages of 0.1-0.2 V. The bipolar resistive switching, with a concurrent capacitive contribution, is governed by an ultrathin (<3 nm) oxide layer. With strong nonlinearity in switching dynamics, different mechanisms of synaptic plasticity are implemented by applying a sequence of electrical pulses.

High Voltage Power Supply Design Guide for Space

NASA Technical Reports Server (NTRS)

Bever, Renate S.; Ruitberg, Arthur P.; Kellenbenz, Carl W.; Irish, Sandra M.

2006-01-01

This book is written for newcomers to the topic of high voltage (HV) in space and is intended to replace an earlier (1970s) out-of-print document. It discusses the designs, problems, and their solutions for HV, mostly direct current, electric power, or bias supplies that are needed for space scientific instruments and devices, including stepping supplies. Output voltages up to 30kV are considered, but only very low output currents, on the order of microamperes. The book gives a brief review of the basic physics of electrical insulation and breakdown problems, especially in gases. It recites details about embedment and coating of the supplies with polymeric resins. Suggestions on HV circuit parts follow. Corona or partial discharge testing on the HV parts and assemblies is discussed both under AC and DC impressed test voltages. Electric field analysis by computer on an HV device is included in considerable detail. Finally, there are many examples given of HV power supplies, complete with some of the circuit diagrams and color photographs of the layouts.

High Accuracy Investigation of Microwave Absorption in Polymer Electrical Components on Motherboard of Computers

NASA Astrophysics Data System (ADS)

Dašić, P.; Hutanu, C.; Jevremović, V.; Dobra, R.; Risteiu, M.; Ileana, I.

2017-06-01

Electronic operating at high frequencies can have problems with emission of high frequency noise. Once put inside an enclosure, the energy will add in phase at certain frequencies to cause resonances which will hinder the performance of the device. These absorbers are based upon open celled foam impregnated with a carbon coating. It is quite possible that in the near future, microprocessors would be to work on a frequency located in 5 to 10 GHz. In these circumstances it is useful to know how and how much of the electromagnetic field emitted by a microprocessor, it is absorbed by the circuit elements in the immediate vicinity of the microprocessor. The aim of this contribution is to demonstrate throughout high-level experimental analysis how the main electric parameters of polymer materials, which build the printed circuits and the one of electric capacitors and resistors, depend on the frequencies on which they work from the microwave range.

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

EGaIn-Assisted Room-Temperature Sintering of Silver Nanoparticles for Stretchable, Inkjet-Printed, Thin-Film Electronics.

PubMed

Tavakoli, Mahmoud; Malakooti, Mohammad H; Paisana, Hugo; Ohm, Yunsik; Marques, Daniel Green; Alhais Lopes, Pedro; Piedade, Ana P; de Almeida, Anibal T; Majidi, Carmel

2018-05-29

Coating inkjet-printed traces of silver nanoparticle (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity by six-orders of magnitude and significantly improves tolerance to tensile strain. This enhancement is achieved through a room-temperature "sintering" process in which the liquid-phase EGaIn alloy binds the AgNP particles (≈100 nm diameter) to form a continuous conductive trace. Ultrathin and hydrographically transferrable electronics are produced by printing traces with a composition of AgNP-Ga-In on a 5 µm-thick temporary tattoo paper. The printed circuit is flexible enough to remain functional when deformed and can support strains above 80% with modest electromechanical coupling (gauge factor ≈1). These mechanically robust thin-film circuits are well suited for transfer to highly curved and nondevelopable 3D surfaces as well as skin and other soft deformable substrates. In contrast to other stretchable tattoo-like electronics, the low-cost processing steps introduced here eliminate the need for cleanroom fabrication and instead requires only a commercial desktop printer. Most significantly, it enables functionalities like "electronic tattoos" and 3D hydrographic transfer that have not been previously reported with EGaIn or EGaIn-based biphasic electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Note: cryogenic microstripline-on-Kapton microwave interconnects.

PubMed

Harris, A I; Sieth, M; Lau, J M; Church, S E; Samoska, L A; Cleary, K

2012-08-01

Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and crosstalk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss drops. The small cross-sectional area of metal in a printed circuit structure yields overall thermal conductivities similar to stainless steel coaxial cable. Operationally, the main performance tradeoffs are between crosstalk and thermal conductivity. We tested a patterned ground plane to reduce heat flux.

Status of electronic waste recycling techniques: a review.

PubMed

Abdelbasir, Sabah M; Hassan, Saad S M; Kamel, Ayman H; El-Nasr, Rania Seif

2018-05-08

The increasing use of electrical and electronic equipment leads to a huge generation of electronic waste (e-waste). It is the fastest growing waste stream in the world. Almost all electrical and electronic equipment contain printed circuit boards as an essential part. Improper handling of these electronic wastes could bring serious risk to human health and the environment. On the other hand, proper handling of this waste requires a sound management strategy for awareness, collection, recycling, and reuse. Nowadays, the effective recycling of this type of waste has been considered as a main challenge for any society. Printed circuit boards (PCBs), which are the base of many electronic industries, are rich in valuable heavy metals and toxic halogenated organic substances. In this review, the composition of different PCBs and their harmful effects are discussed. Various techniques in common use for recycling the most important metals from the metallic fractions of e-waste are illustrated. The recovery of metals from e-waste material after physical separation through pyrometallurgical, hydrometallurgical, or biohydrometallurgical routes is also discussed, along with alternative uses of non-metallic fraction. The data are explained and compared with the current e-waste management efforts done in Egypt. Future perspectives and challenges facing Egypt for proper e-waste recycling are also discussed.

40 CFR 413.80 - Applicability: Description of the printed circuit board subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Applicability: Description of the printed circuit board subcategory. 413.80 Section 413.80 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Printed...

A long-term static immersion experiment on the leaching behavior of heavy metals from waste printed circuit boards.

PubMed

Zhao, Guo-Hua; Luo, Xing-Zhang; Chen, Gui; Zhao, Yong-Jun

2014-08-01

Printed circuit boards (PCBs) are the main components of electrical and electronic equipment (EEE). Waste PCBs contain several kinds of heavy metals, including Cu, Pb and Zn. We characterize the leaching of heavy metals (Cu, Pb, Zn and Ni) from waste PCBs in a pH range of 3.0 to 5.6 using a novel approach based on batch pH-static leaching experiments in this work. The results indicate that the leaching behavior of Cu, Pb, Zn and Ni is strongly dependent on pH. Leaching behavior also varies with different pH values and leaching times. The maximum concentrations of Cu, Pb, Zn and Ni in leachate from waste PCBs were 335.00, 17.57, 2.40 and 2.33 mg L(-1), respectively. The highest Pb, Ni, and Cu concentrations leached significantly exceeded the European Union waste-acceptance limit values with respect to inert waste landfills. The leaching of metals follows the shrinking core model with surface reaction control.

Soldering mask laser removal from printed circuit boards aiming copper recycling.

PubMed

Raele, Marcus Paulo; De Pretto, Lucas Ramos; Zezell, Denise Maria

2017-10-01

Management of waste of electric and electronic equipment (WEEE) is a key issue for modern societies; furthermore, it contains valuable materials that can be recycled, especially in printed circuit boards (PCB), which have approximately one-third of their weight in copper. In this study we demonstrated the use of laser to strip the covering soldering mask on PCB's, thus exposing the copper underneath so that extraction techniques may take place. Using a Q-Switched Nd:YAG laser operating at 1064nm and 532nm we tested the procedure under different energy conditions. The laser stripping of the soldering mask was achieved with satisfactory results by irradiation with 225mJ at 1064nm. However, when using similar parameters at 532nm the process of the coating ejection was not promoted properly, leading to a faulty detachment. Infrared laser PCB stripping presents itself to be technically viable and environmental friendly, since it uses no chemicals inputs, offering one more option to WEEE treatment and recycling. Copyright © 2017 Elsevier Ltd. All rights reserved.

Flip-flop logic circuit based on fully solution-processed organic thin film transistor devices with reduced variations in electrical performance

NASA Astrophysics Data System (ADS)

Takeda, Yasunori; Yoshimura, Yudai; Adib, Faiz Adi Ezarudin Bin; Kumaki, Daisuke; Fukuda, Kenjiro; Tokito, Shizuo

2015-04-01

Organic reset-set (RS) flip-flop logic circuits based on pseudo-CMOS inverters have been fabricated using full solution processing at a relatively low process temperatures of 150 °C or less. The work function for printed silver electrodes was increased from 4.7 to 5.4 eV through surface modification with a self-assembled monolayer (SAM) material. A bottom-gate, bottom-contact organic thin-film transistor (OTFT) device using a solution-processable small-molecular semiconductor material exhibited field-effect mobility of 0.40 cm2 V-1 s-1 in the saturation region and a threshold voltage (VTH) of -2.4 V in ambient air operation conditions. In order to reduce the variations in mobility and VTH, we designed a circuit with six transistors arranged in parallel, in order to average out their electrical characteristics. As a result, we have succeeded in reducing these variations without changing the absolute values of the mobility and VTH. The fabricated RS flip-flop circuits were functioned well and exhibited short delay times of 3.5 ms at a supply voltage of 20 V.

CMOS Imaging of Pin-Printed Xerogel-Based Luminescent Sensor Microarrays.

PubMed

Yao, Lei; Yung, Ka Yi; Khan, Rifat; Chodavarapu, Vamsy P; Bright, Frank V

2010-12-01

We present the design and implementation of a luminescence-based miniaturized multisensor system using pin-printed xerogel materials which act as host media for chemical recognition elements. We developed a CMOS imager integrated circuit (IC) to image the luminescence response of the xerogel-based sensor array. The imager IC uses a 26 × 20 (520 elements) array of active pixel sensors and each active pixel includes a high-gain phototransistor to convert the detected optical signals into electrical currents. The imager includes a correlated double sampling circuit and pixel address/digital control circuit; the image data is read-out as coded serial signal. The sensor system uses a light-emitting diode (LED) to excite the target analyte responsive luminophores doped within discrete xerogel-based sensor elements. As a prototype, we developed a 4 × 4 (16 elements) array of oxygen (O 2 ) sensors. Each group of 4 sensor elements in the array (arranged in a row) is designed to provide a different and specific sensitivity to the target gaseous O 2 concentration. This property of multiple sensitivities is achieved by using a strategic mix of two oxygen sensitive luminophores ([Ru(dpp) 3 ] 2+ and ([Ru(bpy) 3 ] 2+ ) in each pin-printed xerogel sensor element. The CMOS imager consumes an average power of 8 mW operating at 1 kHz sampling frequency driven at 5 V. The developed prototype system demonstrates a low cost and miniaturized luminescence multisensor system.

High-resolution inkjet printing of all-polymer transistor circuits.

PubMed

Sirringhaus, H; Kawase, T; Friend, R H; Shimoda, T; Inbasekaran, M; Wu, W; Woo, E P

2000-12-15

Direct printing of functional electronic materials may provide a new route to low-cost fabrication of integrated circuits. However, to be useful it must allow continuous manufacturing of all circuit components by successive solution deposition and printing steps in the same environment. We demonstrate direct inkjet printing of complete transistor circuits, including via-hole interconnections based on solution-processed polymer conductors, insulators, and self-organizing semiconductors. We show that the use of substrate surface energy patterning to direct the flow of water-based conducting polymer inkjet droplets enables high-resolution definition of practical channel lengths of 5 micrometers. High mobilities of 0.02 square centimeters per volt second and on-off current switching ratios of 10(5) were achieved.

Low-Dielectric Polyimides

NASA Technical Reports Server (NTRS)

St. Clair, Anne K.; St. Clair, Terry L.; Winfree, William P.; Emerson, Bert R., Jr.

1989-01-01

New process developed to produce aromatic condensation polyimide films and coatings having dielectric constants in range of 2.4 to 3.2. Materials better electrical insulators than state-of-the-art commercial polyimides. Several low-dielectric-constant polyimides have excellent resistance to moisture. Useful as film and coating materials for both industrial and aerospace applications where high electrical insulation, resistance to moisture, mechanical strength, and thermal stability required. Applicable to production of high-temperature and moisture-resistance adhesives, films, photoresists, and coatings. Electronic applications include printed-circuit boards, both of composite and flexible-film types and potential use in automotive, aerospace, and electronic industries.

High-throughput shadow mask printing of passive electrical components on paper by supersonic cluster beam deposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Caruso, Francesco; Bellacicca, Andrea; Milani, Paolo, E-mail: pmilani@mi.infn.it

We report the rapid prototyping of passive electrical components (resistors and capacitors) on plain paper by an additive and parallel technology consisting of supersonic cluster beam deposition (SCBD) coupled with shadow mask printing. Cluster-assembled films have a growth mechanism substantially different from that of atom-assembled ones providing the possibility of a fine tuning of their electrical conduction properties around the percolative conduction threshold. Exploiting the precise control on cluster beam intensity and shape typical of SCBD, we produced, in a one-step process, batches of resistors with resistance values spanning a range of two orders of magnitude. Parallel plate capacitors withmore » paper as the dielectric medium were also produced with capacitance in the range of tens of picofarads. Compared to standard deposition technologies, SCBD allows for a very efficient use of raw materials and the rapid production of components with different shape and dimensions while controlling independently the electrical characteristics. Discrete electrical components produced by SCBD are very robust against deformation and bending, and they can be easily assembled to build circuits with desired characteristics. The availability of large batches of these components enables the rapid and cheap prototyping and integration of electrical components on paper as building blocks of more complex systems.« less

Computer circuit card puller

NASA Technical Reports Server (NTRS)

Sawyer, R. V.; Szuwalski, B. (Inventor)

1981-01-01

The invention generally relates to hand tools, and more particularly to an improved device for facilitating removal of printed circuit cards from a card rack characterized by longitudinal side rails arranged in a mutually spaced parallelism and a plurality of printed circuit cards extended between the rails of the rack.

Degradation of organic pollutants by Ag, Cu and Sn doped waste non-metallic printed circuit boards.

PubMed

Ramaswamy, Kadari; Radha, Velchuri; Malathi, M; Vithal, Muga; Munirathnam, Nagegownivari R

2017-02-01

The disposal and reuse of waste printed circuit boards have been the major global concerns. Printed circuit boards, a form of Electronic waste (hereafter e-waste), have been chemically processed, doped with Ag + , Cu 2+ and Sn 2+ , and used as visible light photocatalysts against the degradation of methylene blue and methyl violet. The elemental analyses of pristine and metal doped printed circuit board were obtained using energy dispersive X-ray fluorescence (EDXRF) spectra and inductively coupled plasma optical emission spectroscopy (ICP-OES). The morphology of parent and doped printed circuit board was obtained from scanning electron microscopy (SEM) measurements. The photocatalytic activity of parent and metal doped samples was carried out for the decomposition of organic pollutants, methylene blue and methyl violet, under visible light irradiation. Metal doped waste printed circuit boards (WPCBs) have shown higher photocatalytic activity against the degradation of methyl violet and methylene blue under visible light irradiation. Scavenger experiments were performed to identify the reactive intermediates responsible for the degradation of methylene blue and methyl violet. The reactive species responsible for the degradation of MV and MB were found to be holes and hydroxyl radicals. A possible mechanism of degradation of methylene blue and methyl violet is given. The stability and reusability of the catalysts are also investigated. Copyright © 2016. Published by Elsevier Ltd.

Control of Evaporation Behavior of an Inkjet-Printed Dielectric Layer Using a Mixed-Solvent System

NASA Astrophysics Data System (ADS)

Yang, Hak Soon; Kang, Byung Ju; Oh, Je Hoon

2016-01-01

In this study, the evaporation behavior and the resulting morphology of inkjet-printed dielectric layers were controlled using a mixed-solvent system to fabricate uniform poly-4-vinylphenol (PVP) dielectric layers without any pinholes. The mixed-solvent system consisted of two different organic solvents: 1-hexanol and ethanol. The effects of inkjet-printing variables such as overlap condition, substrate temperature, and different printing sequences (continuous and interlacing printing methods) on the inkjet-printed dielectric layer were also investigated. Increasing volume fraction of ethanol (VFE) is likely to reduce the evaporation rate gradient and the drying time of the inkjet-printed dielectric layer; this diminishes the coffee stain effect and thereby improves the uniformity of the inkjet-printed dielectric layer. However, the coffee stain effect becomes more severe with an increase in the substrate temperature due to the enhanced outward convective flow. The overlap condition has little effect on the evaporation behavior of the printed dielectric layer. In addition, the interlacing printing method results in either a stronger coffee stain effect or wavy structures of the dielectric layers depending on the VFE of the PVP solution. All-inkjet-printed capacitors without electrical short circuiting can be successfully fabricated using the optimized PVP solution (VFE = 0.6); this indicates that the mixed-solvent system is expected to play an important role in the fabrication of high-quality inkjet-printed dielectric layers in various printed electronics applications.

All-Printed Flexible and Stretchable Electronics.

PubMed

Mohammed, Mohammed G; Kramer, Rebecca

2017-05-01

A fully automated additive manufacturing process that produces all-printed flexible and stretchable electronics is demonstrated. The printing process combines soft silicone elastomer printing and liquid metal processing on a single high-precision 3D stage. The platform is capable of fabricating extremely complex conductive circuits, strain and pressure sensors, stretchable wires, and wearable circuits with high yield and repeatability. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Study on Miniaturized UHF Antennas for Partial Discharge Detection in High-Voltage Electrical Equipment.

PubMed

Liu, Jingcun; Zhang, Guogang; Dong, Jinlong; Wang, Jianhua

2015-11-20

Detecting partial discharge (PD) is an effective way to evaluate the condition of high-voltage electrical equipment insulation. The UHF detection method has attracted attention due to its high sensitivity, strong interference resistance, and ability to locate PDs. In this paper, a miniaturized equiangular spiral antenna (ESA) for UHF detection that uses a printed circuit board is proposed. I-shaped, L-shaped, and C-shaped microstrip baluns were designed to match the impedance between the ESA and coaxial cable and were verified by a vector network analyzer. For comparison, three other types of UHF antenna were also designed: A microstrip patch antenna, a microstrip slot antenna, and a printed dipole antenna. Their antenna factors were calibrated in a uniform electric field of different frequencies modulated in a gigahertz transverse electromagnetic cell. We performed comparison experiments on PD signal detection using an artificial defect model based on the international IEC 60270 standard. We also conducted time-delay test experiments on the ESA sensor to locate a PD source. It was found that the proposed ESA sensor meets PD signal detection requirements. The sensor's compact size makes it suitable for internal installation in high-voltage electrical equipment.

Study on Miniaturized UHF Antennas for Partial Discharge Detection in High-Voltage Electrical Equipment

PubMed Central

Liu, Jingcun; Zhang, Guogang; Dong, Jinlong; Wang, Jianhua

2015-01-01

Detecting partial discharge (PD) is an effective way to evaluate the condition of high-voltage electrical equipment insulation. The UHF detection method has attracted attention due to its high sensitivity, strong interference resistance, and ability to locate PDs. In this paper, a miniaturized equiangular spiral antenna (ESA) for UHF detection that uses a printed circuit board is proposed. I-shaped, L-shaped, and C-shaped microstrip baluns were designed to match the impedance between the ESA and coaxial cable and were verified by a vector network analyzer. For comparison, three other types of UHF antenna were also designed: A microstrip patch antenna, a microstrip slot antenna, and a printed dipole antenna. Their antenna factors were calibrated in a uniform electric field of different frequencies modulated in a gigahertz transverse electromagnetic cell. We performed comparison experiments on PD signal detection using an artificial defect model based on the international IEC 60270 standard. We also conducted time-delay test experiments on the ESA sensor to locate a PD source. It was found that the proposed ESA sensor meets PD signal detection requirements. The sensor’s compact size makes it suitable for internal installation in high-voltage electrical equipment. PMID:26610506

Analytical Study on Thermal and Mechanical Design of Printed Circuit Heat Exchanger

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yoon, Su-Jong; Sabharwall, Piyush; Kim, Eung-Soo

2013-09-01

The analytical methodologies for the thermal design, mechanical design and cost estimation of printed circuit heat exchanger are presented in this study. In this study, three flow arrangements of parallel flow, countercurrent flow and crossflow are taken into account. For each flow arrangement, the analytical solution of temperature profile of heat exchanger is introduced. The size and cost of printed circuit heat exchangers for advanced small modular reactors, which employ various coolants such as sodium, molten salts, helium, and water, are also presented.

Air and water cooled modulator

DOEpatents

Birx, Daniel L.; Arnold, Phillip A.; Ball, Don G.; Cook, Edward G.

1995-01-01

A compact high power magnetic compression apparatus and method for delivering high voltage pulses of short duration at a high repetition rate and high peak power output which does not require the use of environmentally unacceptable fluids such as chlorofluorocarbons either as a dielectric or as a coolant, and which discharges very little waste heat into the surrounding air. A first magnetic switch has cooling channels formed therethrough to facilitate the removal of excess heat. The first magnetic switch is mounted on a printed circuit board. A pulse transformer comprised of a plurality of discrete electrically insulated and magnetically coupled units is also mounted on said printed board and is electrically coupled to the first magnetic switch. The pulse transformer also has cooling means attached thereto for removing heat from the pulse transformer. A second magnetic switch also having cooling means for removing excess heat is electrically coupled to the pulse transformer. Thus, the present invention is able to provide high voltage pulses of short duration at a high repetition rate and high peak power output without the use of environmentally unacceptable fluids and without discharging significant waste heat into the surrounding air.

Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors

NASA Astrophysics Data System (ADS)

Bai, Shi; Zhang, Shigang; Zhou, Weiping; Ma, Delong; Ma, Ying; Joshi, Pooran; Hu, Anming

2017-10-01

Stretchable electronic sensing devices are defining the path toward wearable electronics. High-performance flexible strain sensors attached on clothing or human skin are required for potential applications in the entertainment, health monitoring, and medical care sectors. In this work, conducting copper electrodes were fabricated on polydimethylsiloxane as sensitive stretchable microsensors by integrating laser direct writing and transfer printing approaches. The copper electrode was reduced from copper salt using laser writing rather than the general approach of printing with pre-synthesized copper or copper oxide nanoparticles. An electrical resistivity of 96 μΩ cm was achieved on 40-μm-thick Cu electrodes on flexible substrates. The motion sensing functionality successfully demonstrated a high sensitivity and mechanical robustness. This in situ fabrication method leads to a path toward electronic devices on flexible substrates.[Figure not available: see fulltext.

Comparison of inkjet-printed silver conductors on different microsystem substrates

NASA Astrophysics Data System (ADS)

Kruger, Jené; Bezuidenhout, Petroné H.; Joubert, Trudi-Heleen

2016-02-01

Applications for diagnostic and environmental point-of-need require processes and building blocks to add smart features to disposable biosensors on low-cost substrates. A novel method for producing such biosensors is printing electronics using additive technologies. This work contributes to the toolbox of processes, materials and components for printed electronics manufacturing - as well as rapid prototyping - of circuits. Printing protocols were developed to facilitate successful inkjet printing of nanosilver ink (Harima NPS-JL) onto different microsystem substrates using a functional printer (Dimatix DMP-3281). Photo paper is a standard inkjet substrate, which were compared with glass, polycarbonate (PC), plastic projector transparency foil, and polydimethylsiloxane (PDMS). Comparison attributes include physical and electrical properties. The layout design comprised dogbone elements of 8 mm length, and widths varying between 100 μm and 2 mm. All printed features were thermally cured for 1 hour at 120 °C. The physical characteristics were measured with a laser scanning microscope (Zeiss LSM-5) to determine the width, thickness and surface roughness of the printed features. An LCR meter (GW-Instek 8110) was used to measure the printed structures' electrical characteristics (resistance, capacitance and inductance). A lumped element model and layout design rules were extracted to assist in standardized design procedures. The model incorporates prediction of the bandwidth attainable with these structures. The layer thickness on all substrates is larger than the 1 μm on photo paper, and varies between 1.6 μm (PC) and 7 μm (PDMS). The spreading for PDMS is similar to photo paper, but since for the other substrates it is between 5 (glass) and 10 (PC) times larger than for photo paper, the layout design rules require large spacing, leading to larger area networks. Electrical probing on the PDMS is not consistent and results are inconclusive. For the other substrates, the comparative dogbone resistance (100 μm width) is significantly larger than the 2 Ω standard, varying from 12.6 Ω (PC) to 19.3 Ω (glass). The bandwidth relative to photo paper is smaller by a factor of between 6 (PC) and 9.5 (glass).

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi

Highlights: • Environmental impacts of electronic waste and specifically waste printed circuit boards. • Review of the recycling techniques of waste printed circuit boards. • Advantages of physico-mechanical recycling techniques over chemical methods. • Utilization of nonmetallic fraction of waste printed circuit boards as modifier/filler. • Recent advances in the use of nonmetallic fraction of waste printed circuit boards as precursor. - Abstract: Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economicmore » and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced.« less

Design principles and realization of electro-optical circuit boards

NASA Astrophysics Data System (ADS)

Betschon, Felix; Lamprecht, Tobias; Halter, Markus; Beyer, Stefan; Peterson, Harry

2013-02-01

The manufacturing of electro-optical circuit boards (EOCB) is based to a large extent on established technologies. First products with embedded polymer waveguides are currently produced in series. The range of applications within the sensor and data communication markets is growing with the increasing maturity level. EOCBs require design flows, processes and techniques similar to existing printed circuit board (PCB) manufacturing and appropriate for optical signal transmission. A key aspect is the precise and automated assembly of active and passive optical components to the optical waveguides which has to be supported by the technology. The design flow is described after a short introduction into the build-up of EOCBs and the motivation for the usage of this technology within the different application fields. Basis for the design of EOCBs are the required optical signal transmission properties. Thereafter, the devices for the electro-optical conversion are chosen and the optical coupling approach is defined. Then, the planar optical elements (waveguides, splitters, couplers) are designed and simulated. This phase already requires co-design of the optical and electrical domain using novel design flows. The actual integration of an optical system into a PCB is shown in the last part. The optical layer is thereby laminated to the purely electrical PCB using a conventional PCB-lamination process to form the EOCB. The precise alignment of the various electrical and optical layers is thereby essential. Electrical vias are then generated, penetrating also the optical layer, to connect the individual electrical layers. Finally, the board has to be tested electrically and optically.

Laser Integration on Silicon Photonic Circuits Through Transfer Printing

DTIC Science & Technology

2017-03-10

AFRL-AFOSR-UK-TR-2017-0019 Laser integration on silicon photonic circuits through transfer printing Gunther Roelkens UNIVERSITEIT GENT VZW Final...TYPE Final 3. DATES COVERED (From - To) 15 Sep 2015 to 14 Sep 2016 4. TITLE AND SUBTITLE Laser integration on silicon photonic circuits through...parallel integration of III-V lasers on silicon photonic integrated circuits. The report discusses the technological process that has been developed as

Aerosol jet printed p- and n-type electrolyte-gated transistors with a variety of electrode materials: exploring practical routes to printed electronics.

PubMed

Hong, Kihyon; Kim, Se Hyun; Mahajan, Ankit; Frisbie, C Daniel

2014-11-12

Printing electrically functional liquid inks is a promising approach for achieving low-cost, large-area, additive manufacturing of flexible electronic circuits. To print thin-film transistors, a basic building block of thin-film electronics, it is important to have several options for printable electrode materials that exhibit high conductivity, high stability, and low-cost. Here we report completely aerosol jet printed (AJP) p- and n-type electrolyte-gated transistors (EGTs) using a variety of different electrode materials including highly conductive metal nanoparticles (Ag), conducting polymers (polystyrenesulfonate doped poly(3,4-ethylendedioxythiophene, PEDOT:PSS), transparent conducting oxides (indium tin oxide), and carbon-based materials (reduced graphene oxide). Using these source-drain electrode materials and a PEDOT:PSS/ion gel gate stack, we demonstrated all-printed p- and n-type EGTs in combination with poly(3-hexythiophene) and ZnO semiconductors. All transistor components (including electrodes, semiconductors, and gate insulators) were printed by AJP. Both kinds of devices showed typical p- and n-type transistor characteristics, and exhibited both low-threshold voltages (<2 V) and high hole and electron mobilities. Our assessment suggests Ag electrodes may be the best option in terms of overall performance for both types of EGTs.

Unitary Shaft-Angle and Shaft-Speed Sensor Assemblies

NASA Technical Reports Server (NTRS)

Alhorn, Dean C.; Howard, David E.; Smith, Dennis A.

2006-01-01

The figure depicts a unit that contains a rotary-position or a rotary-speed sensor, plus electronic circuitry necessary for its operation, all enclosed in a single housing with a shaft for coupling to an external rotary machine. This rotation sensor unit is complete: when its shaft is mechanically connected to that of the rotary machine and it is supplied with electric power, it generates an output signal directly indicative of the rotary position or speed, without need for additional processing by other circuitry. The incorporation of all of the necessary excitatory and readout circuitry into the housing (in contradistinction to using externally located excitatory and/or readout circuitry) in a compact arrangement is the major difference between this unit and prior rotation-sensor units. The sensor assembly inside the housing includes excitatory and readout integrated circuits mounted on a circular printed-circuit board. In a typical case in which the angle or speed transducer(s) utilize electromagnetic induction, the assembly also includes another circular printed-circuit board on which the transducer windings are mounted. A sheet of high-magnetic permeability metal ("mu metal") is placed between the winding board and the electronic-circuit board to prevent spurious coupling of excitatory signals from the transducer windings to the readout circuits. The housing and most of the other mechanical hardware can be common to a variety of different sensor designs. Hence, the unit can be configured to generate any of variety of outputs by changing the interior sensor assembly. For example, the sensor assembly could contain an analog tachometer circuit that generates an output proportional (in both magnitude and sign or in magnitude only) to the speed of rotation.

HBCU/MI: 3D Formable RF Materials and Devices

DTIC Science & Technology

2016-08-01

SECURITY CLASSIFICATION OF: The aim of this project was to explore 3D printing for RF/microwave circuits and devices. The research produced several... 3D printed microwave filters, a 3D wifi radio circuit, and new materials for 3D printed electromagnetic devices. The research demonstrates that 3D ...journals: Final Report: HBCU/MI: 3D Formable RF Materials and Devices Report Title The aim of this project was to explore 3D printing for RF/microwave

High Speed Imaging using Nanoprobe Arrays

DTIC Science & Technology

2010-06-23

Gotsmann and U. Dürig, Appl. Phys. Lett. 87, 194102 2005. 9 W. P. King, S. Saxena, B. A. Nelson, R. Pitchimani, and B. L. Weeks, Nano Lett. 6, 2145...microcantilevers with selective coatings has been applied as an artificial nose to recognize and characterize alcohol vapors either in a static mode...doped resistive heater. Fig. 4(c) shows a custom printed circuit board (PCB) to mount the array chip and a flexible ribbon cable for the electrical

Direct-referencing Two-dimensional-array Digital Microfluidics Using Multi-layer Printed Circuit Board

PubMed Central

Gong, Jian; Kim, Chang-Jin “CJ”

2008-01-01

Digital (i.e. droplet-based) microfluidics, by the electrowetting-on-dielectric (EWOD) mechanism, has shown great potential for a wide range of applications, such as lab-on-a-chip. While most reported EWOD chips use a series of electrode pads essentially in one-dimensional line pattern designed for specific tasks, the desired universal chips allowing user-reconfigurable paths would require the electrode pads in two-dimensional pattern. However, to electrically access the electrode pads independently, conductive lines need to be fabricated underneath the pads in multiple layers, raising a cost issue especially for disposable chip applications. In this article, we report the building of digital microfluidic plates based on a printed-circuit-board (PCB), in which multilayer electrical access lines were created inexpensively using mature PCB technology. However, due to its surface topography and roughness and resulting high resistance against droplet movement, as-fabricated PCB surfaces require unacceptably high (~500 V) voltages unless coated with or immersed in oil. Our goal is EWOD operations of aqueous droplets not only on oil-covered but also on dry surfaces. To meet varying levels of performances, three types of gradually complex post-PCB microfabrication processes are developed and evaluated. By introducing land-grid-array (LGA) sockets in the packaging, a scalable digital microfluidics system with reconfigurable and low-cost chip is also demonstrated. PMID:19234613

Comprehensive characterization of printed circuit boards of various end-of-life electrical and electronic equipment for beneficiation investigation.

PubMed

Anshu Priya; Hait, Subrata

2018-05-01

Comprehensive characterization of printed circuit board (PCB) of end-of-life electrical and electronic equipment (EEE) is obligatory for prospective profitable beneficiation. In this study, beneficiation oriented comprehensive characterization of two brands of PCBs each of 16 end-of-life EEE was conducted in terms of their physicochemical characteristics with special emphasis on the content of 16 general elements, 2 precious metals and 15 rare earth elements (REEs). General elements and their highest weight percent composition found in different PCBs of the EEEs were Cu (23% in laptop), Al (6% in computer), Pb (15% in DVD player) and Ba (7% in TV). The high abundant of precious metals such as Au (316 g/ton) and Ag (636 g/ton) in mobile phone and laptop, respectively coupled with rapid obsolescence age makes waste PCBs of information technology and telecommunication equipment the most potent resource reservoir. Additionally, most of the waste PCBs were observed to contain REEs in considerable quantity with Sc up to 31 g/ton and Ce up to 13 g/ton being the major constituents. Comprehensive characterization of waste PCBs therefore will systematically help towards better understanding of e-waste recycling processes for beneficiation purpose and sustainable resource circulation and conservation. Copyright © 2018 Elsevier Ltd. All rights reserved.

TSCA Chemical Data Reporting Fact Sheet: Byproducts Reporting for the Printed Circuit Board Industry

EPA Pesticide Factsheets

This fact sheet provides information on existing Chemical Data Reporting (CDR) rule requirements related to byproducts reporting by persons who manufacture printed circuit boards and may be subject to CDR.

Inkjet deposited circuit components

NASA Astrophysics Data System (ADS)

Bidoki, S. M.; Nouri, J.; Heidari, A. A.

2010-05-01

All-printed electronics as a means of achieving ultra-low-cost electronic circuits has attracted great interest in recent years. Inkjet printing is one of the most promising techniques by which the circuit components can be ultimately drawn (i.e. printed) onto the substrate in one step. Here, the inkjet printing technique was used to chemically deposit silver nanoparticles (10-200 nm) simply by ejection of silver nitrate and reducing solutions onto different substrates such as paper, PET plastic film and textile fabrics. The silver patterns were tested for their functionality to work as circuit components like conductor, resistor, capacitor and inductor. Different levels of conductivity were achieved simply by changing the printing sequence, inks ratio and concentration. The highest level of conductivity achieved by an office thermal inkjet printer (300 dpi) was 5.54 × 105 S m-1 on paper. Inkjet deposited capacitors could exhibit a capacitance of more than 1.5 nF (parallel plate 45 × 45 mm2) and induction coils displayed an inductance of around 400 µH (planar coil 10 cm in diameter). Comparison of electronic performance of inkjet deposited components to the performance of conventionally etched items makes the technique highly promising for fabricating different printed electronic devices.

Methode unifiee de simulation et de conception des convertisseurs de puissance

NASA Astrophysics Data System (ADS)

Fortin Blanchette, Handy

High frequency power converters are now master piece in emerging new renewable energy applications such as hybrid vehicules. These new technologies merge the power of electrical machine with the thermal motor power. The power converters used to control those electrical machines are embeded technologies with high efficiency conversion and a high reliability. More than ground vehicule applications, embeded power converters are now present in aeronautic and aerospace domains. In this sense, high reliability and high efficiency are now important characteristics that are not only suitable but needed. In spite of this progression, power converters development remains today a complex science. Even if advanced complex techniques are now available to increase the converter stability, there are no systemic rules to design the converter physical assembly. Very often, an artistic approach is used to place the components inside the converter in the more convenient places. This lack of rigor about EMI problems is not so surprising because this kind of analysis is costly and risky. In general, to solve this type of problems, one designs a second and a third printed circuit generation which is not necessarily a quick and systematic approach. To overcome these difficulties, the main goal of this thesis is to provide simple and improved tools for power converter circuit designers. The key point are to solve EMI and reliability problems at the earlier design stage and not during the prototyping phase. Many solutions are exposed in this text about the magnetic field orientation, leakage inductances identification, power semiconductors modeling and electromagnetic modeling of power converters. The exactness of these methods is proved by using it to develop a matrix converter. The printed circuits are designed to orient properly the magnetic field enabling to introduce low power sensing circuits directly inside the converter. This application is one of the numerous possibilities offered by the techniques presented in this document. Keywords: power converters, modeling, electromagnetic interferences.

Flexible printed circuit board actuators

NASA Astrophysics Data System (ADS)

Lee, Junseok; Cha, Youngsu

2017-12-01

Out-of-plane actuators are made possible by the breaking of planar symmetry. In this paper, we present a thin-film out-of-plane electrostatic actuator for a flexible printed circuit board (FPCB) that can be fabricated with a single step of the conventional manufacturing process. No other components are required for actuation except a single sheet of the FPCB, and it works based on the planar asymmetry resulting from asymmetrically patterned top and bottom electrodes on each side of the polyimide film. With the structural asymmetry, the application of a high voltage in the order of kilovolts results in the asymmetry of the electric fields and the body force density, which generates the bending moment that leads to macroscopic deformations. We applied the finite element method to examine the asymmetry induced by the difference in the electrodes. In the experiment, the displacement responses to step input and square wave input of various frequencies were analyzed. It was found that our actuator constitutes an underdamped system, exhibiting resonance characteristics. The maximum oscillatory amplitude was determined at resonance, and the relationship between the displacement and the applied voltage was investigated.

Flexible ambipolar organic field-effect transistors with reverse-offset-printed silver electrodes for a complementary inverter.

PubMed

Park, Junsu; Kim, Minseok; Yeom, Seung-Won; Ha, Hyeon Jun; Song, Hyenggun; Min Jhon, Young; Kim, Yun-Hi; Ju, Byeong-Kwon

2016-06-03

We report ambipolar organic field-effect transistors and complementary inverter circuits with reverse-offset-printed (ROP) Ag electrodes fabricated on a flexible substrate. A diketopyrrolopyrrole-based co-polymer (PDPP-TAT) was used as the semiconductor and poly(methyl methacrylate) was used as the gate insulator. Considerable improvement is observed in the n-channel electrical characteristics by inserting a cesium carbonate (Cs2CO3) as the electron-injection/hole-blocking layer at the interface between the semiconductors and the electrodes. The saturation mobility values are 0.35 cm(2) V(-1) s(-1) for the p-channel and 0.027 cm(2) V(-1) s(-1) for the n-channel. A complementary inverter is demonstrated based on the ROP process, and it is selectively controlled by the insertion of Cs2CO3 onto the n-channel region via thermal evaporation. Moreover, the devices show stable operation during the mechanical bending test using tensile strains ranging from 0.05% to 0.5%. The results confirm that these devices have great potential for use in flexible and inexpensive integrated circuits over a large area.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Alternatives Assessment: Partnership to Evaluate Flame Retardants in Printed Circuit Boards

EPA Pesticide Factsheets

The partnership project on flame retardants in printed circuit boards seeks to improve understanding of the environmental and human health impacts of new and current materials that can be used to meet fire safety standards

Microfabricated Electrical Connector for Atomic Force Microscopy Probes with Integrated Sensor/Actuator

NASA Astrophysics Data System (ADS)

Akiyama, Terunobu; Staufer, Urs; Rooij, Nico F. de

2002-06-01

A microfabricated, electrical connector is proposed for facilitating the mounting of atomic force microscopy (AFM) probes, which have an integrated sensor and/or actuator. Only a base chip, which acts as a socket, is permanently fixed onto a printed circuit board and electronically connected by standard wire bonding. The AFM chip, the “plug”, is flipped onto the base chip and pressed from the backside by a spring. Electrical contact with the eventual stress sensors, capacitive or piezoelectric sensor/actuators, is provided by contact bumps. These bumps of about 8 μm height are placed onto the base chip. They touch the pads on the AFM chip that were originally foreseen to be for wire bonding and thus provide the electrical contact. This connector schema was successfully used to register AFM images with piezoresistive cantilevers.

Printed circuit boards: a review on the perspective of sustainability.

PubMed

Canal Marques, André; Cabrera, José-María; Malfatti, Célia de Fraga

2013-12-15

Modern life increasingly requires newer equipments and more technology. In addition, the fact that society is highly consumerist makes the amount of discarded equipment as well as the amount of waste from the manufacture of new products increase at an alarming rate. Printed circuit boards, which form the basis of the electronics industry, are technological waste of difficult disposal whose recycling is complex and expensive due to the diversity of materials and components and their difficult separation. Currently, printed circuit boards have a fixing problem, which is migrating from traditional Pb-Sn alloys to lead-free alloys without definite choice. This replacement is an attempt to minimize the problem of Pb toxicity, but it does not change the problem of separation of the components for later reuse and/or recycling and leads to other problems, such as temperature rise, delamination, flaws, risks of mechanical shocks and the formation of "whiskers". This article presents a literature review on printed circuit boards, showing their structure and materials, the environmental problem related to the board, some the different alternatives for recycling, and some solutions that are being studied to reduce and/or replace the solder, in order to minimize the impact of solder on the printed circuit boards. Copyright © 2013 Elsevier Ltd. All rights reserved.

Note: computer controlled rotation mount for large diameter optics.

PubMed

Rakonjac, Ana; Roberts, Kris O; Deb, Amita B; Kjærgaard, Niels

2013-02-01

We describe the construction of a motorized optical rotation mount with a 40 mm clear aperture. The device is used to remotely control the power of large diameter laser beams for a magneto-optical trap. A piezo-electric ultrasonic motor on a printed circuit board provides rotation with a precision better than 0.03° and allows for a very compact design. The rotation unit is controlled from a computer via serial communication, making integration into most software control platforms straightforward.

Lead (Pb)-Free Solder Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

VIANCO,PAUL T.

2000-08-15

Legislative and marketing forces both abroad and in the US are causing the electronics industry to consider the use of Pb-free solders in place of traditional Sn-Pb alloys. Previous case studies have demonstrated the satisfactory manufacturability and reliability of several Pb-free compositions for printed circuit board applications. Those data, together with the results of fundamental studies on Pb-free solder materials, have indicated the general feasibility of their use in the broader range of present-day, electrical and electronic components.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

DOEpatents

Passmore, Brandon; Cole, Zach; Whitaker, Bret; Barkley, Adam; McNutt, Ty; Lostetter, Alexander

2016-08-02

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Inkjet printed circuits based on ambipolar and p-type carbon nanotube thin-film transistors

NASA Astrophysics Data System (ADS)

Kim, Bongjun; Geier, Michael L.; Hersam, Mark C.; Dodabalapur, Ananth

2017-02-01

Ambipolar and p-type single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs) are reliably integrated into various complementary-like circuits on the same substrate by inkjet printing. We describe the fabrication and characteristics of inverters, ring oscillators, and NAND gates based on complementary-like circuits fabricated with such TFTs as building blocks. We also show that complementary-like circuits have potential use as chemical sensors in ambient conditions since changes to the TFT characteristics of the p-channel TFTs in the circuit alter the overall operating characteristics of the circuit. The use of circuits rather than individual devices as sensors integrates sensing and signal processing functions, thereby simplifying overall system design.

Air and water cooled modulator

DOEpatents

Birx, D.L.; Arnold, P.A.; Ball, D.G.; Cook, E.G.

1995-09-05

A compact high power magnetic compression apparatus and method are disclosed for delivering high voltage pulses of short duration at a high repetition rate and high peak power output which does not require the use of environmentally unacceptable fluids such as chlorofluorocarbons either as a dielectric or as a coolant, and which discharges very little waste heat into the surrounding air. A first magnetic switch has cooling channels formed therethrough to facilitate the removal of excess heat. The first magnetic switch is mounted on a printed circuit board. A pulse transformer comprised of a plurality of discrete electrically insulated and magnetically coupled units is also mounted on said printed board and is electrically coupled to the first magnetic switch. The pulse transformer also has cooling means attached thereto for removing heat from the pulse transformer. A second magnetic switch also having cooling means for removing excess heat is electrically coupled to the pulse transformer. Thus, the present invention is able to provide high voltage pulses of short duration at a high repetition rate and high peak power output without the use of environmentally unacceptable fluids and without discharging significant waste heat into the surrounding air. 9 figs.

Soldering Tool for Integrated Circuits

NASA Technical Reports Server (NTRS)

Takahashi, Ted H.

1987-01-01

Many connections soldered simultaneously in confined spaces. Improved soldering tool bonds integrated circuits onto printed-circuit boards. Intended especially for use with so-called "leadless-carrier" integrated circuits.

Developing an Ear Prosthesis Fabricated in Polyvinylidene Fluoride by a 3D Printer with Sensory Intrinsic Properties of Pressure and Temperature

PubMed Central

Suaste-Gómez, Ernesto; Rodríguez-Roldán, Grissel; Reyes-Cruz, Héctor; Terán-Jiménez, Omar

2016-01-01

An ear prosthesis was designed in 3D computer graphics software and fabricated using a 3D printing process of polyvinylidene fluoride (PVDF) for use as a hearing aid. In addition, the prosthesis response to pressure and temperature was observed. Pyroelectric and piezoelectric properties of this ear prosthesis were investigated using an astable multivibrator circuit, as changes in PVDF permittivity were observed according to variations of pressure and temperature. The results show that this prosthesis is reliable for use under different conditions of pressure (0 Pa to 16,350 Pa) and temperature (2 °C to 90 °C). The experimental results show an almost linear and inversely proportional behavior between the stimuli of pressure and temperature with the frequency response. This 3D-printed ear prosthesis is a promising tool and has a great potentiality in the biomedical engineering field because of its ability to generate an electrical potential proportional to pressure and temperature, and it is the first time that such a device has been processed by the additive manufacturing process (3D printing). More work needs to be carried out to improve the performance, such as electrical stimulation of the nervous system, thereby extending the purpose of a prosthesis to the area of sensory perception. PMID:26959026

Developing an Ear Prosthesis Fabricated in Polyvinylidene Fluoride by a 3D Printer with Sensory Intrinsic Properties of Pressure and Temperature.

PubMed

Suaste-Gómez, Ernesto; Rodríguez-Roldán, Grissel; Reyes-Cruz, Héctor; Terán-Jiménez, Omar

2016-03-04

An ear prosthesis was designed in 3D computer graphics software and fabricated using a 3D printing process of polyvinylidene fluoride (PVDF) for use as a hearing aid. In addition, the prosthesis response to pressure and temperature was observed. Pyroelectric and piezoelectric properties of this ear prosthesis were investigated using an astable multivibrator circuit, as changes in PVDF permittivity were observed according to variations of pressure and temperature. The results show that this prosthesis is reliable for use under different conditions of pressure (0 Pa to 16,350 Pa) and temperature (2 °C to 90 °C). The experimental results show an almost linear and inversely proportional behavior between the stimuli of pressure and temperature with the frequency response. This 3D-printed ear prosthesis is a promising tool and has a great potentiality in the biomedical engineering field because of its ability to generate an electrical potential proportional to pressure and temperature, and it is the first time that such a device has been processed by the additive manufacturing process (3D printing). More work needs to be carried out to improve the performance, such as electrical stimulation of the nervous system, thereby extending the purpose of a prosthesis to the area of sensory perception.

Titanium Dioxide Films Prepared by Screen-Printing Technique for Self-Powered Electrochromic Windows

NASA Astrophysics Data System (ADS)

Salleh, Muhamad Mat; Yahaya, Muhamad; Mursyidah

Electrochromic windows could reduce air-conditioning costs by being darkened to absorb sunlight and reject unwanted solar heat. These windows change their color and light transmissivity due to the action of an electric field and can change back to the original state by a field reversal. To save the cost, the electrical power may be supplied by a solar cell that integrated with the electrochromic window in a single device. This paper reports the potential of using titanium oxide, TiO2 as solar cells and as electrochromic windows. The TiO2 films were deposited by screen-printing a paste, consisting of TiO2 particles and an organic binder, onto ITO-covered glass substrates. Then the films were tempered at 400 °C to bum out the organic parts. A solar cell of ITO/TiO2/electrolyte/ITO was fabricated using a mixed ammonium iodide and iodine solution as electrolyte. The cell was illuminated through the TiO2 film. The cells showed rectifier properties in the dark and produced electrical current when illuminated. The short circuit photocurrent and the open circuit voltage of the cell in a 100-mW/cm2 tungsten light source were 2.3 μA and 17.0 mV respectively. The electrochromic behavior of the TiO2 films in a lithium perchlorate solution was examined. When the electrochromic film cell was given a forward bias potential of 5.0 V, the original colorless TiO2 film immediately changed to brown. The color of the film bleached to the original when the applied potential was reversed.

A novel 3D bioprinted flexible and biocompatible hydrogel bioelectronic platform.

PubMed

Agarwala, Shweta; Lee, Jia Min; Ng, Wei Long; Layani, Michael; Yeong, Wai Yee; Magdassi, Shlomo

2018-04-15

Bioelectronics platforms are gaining widespread attention as they provide a template to study the interactions between biological species and electronics. Decoding the effect of the electrical signals on the cells and tissues holds the promise for treating the malignant tissue growth, regenerating organs and engineering new-age medical devices. This work is a step forward in this direction, where bio- and electronic materials co-exist on one platform without any need for post processing. We fabricate a freestanding and flexible hydrogel based platform using 3D bioprinting. The fabrication process is simple, easy and provides a flexible route to print materials with preferred shapes, size and spatial orientation. Through the design of interdigitated electrodes and heating coil, the platform can be tailored to print various circuits for different functionalities. The biocompatibility of the printed platform is tested using C2C12 murine myoblasts cell line. Furthermore, normal human dermal fibroblasts (primary cells) are also seeded on the platform to ascertain the compatibility. Copyright © 2017 Elsevier B.V. All rights reserved.

Board Saver for Use with Developmental FPGAs

NASA Technical Reports Server (NTRS)

Berkun, Andrew

2009-01-01

A device denoted a board saver has been developed as a means of reducing wear and tear of a printed-circuit board onto which an antifuse field programmable gate array (FPGA) is to be eventually soldered permanently after a number of design iterations. The need for the board saver or a similar device arises because (1) antifuse-FPGA design iterations are common and (2) repeated soldering and unsoldering of FPGAs on the printed-circuit board to accommodate design iterations can wear out the printed-circuit board. The board saver is basically a solderable/unsolderable FPGA receptacle that is installed temporarily on the printed-circuit board. The board saver is, more specifically, a smaller, square-ring-shaped, printed-circuit board (see figure) that contains half via holes one for each contact pad along its periphery. As initially fabricated, the board saver is a wider ring containing full via holes, but then it is milled along its outer edges, cutting the via holes in half and laterally exposing their interiors. The board saver is positioned in registration with the designated FPGA footprint and each via hole is soldered to the outer portion of the corresponding FPGA contact pad on the first-mentioned printed-circuit board. The via-hole/contact joints can be inspected visually and can be easily unsoldered later. The square hole in the middle of the board saver is sized to accommodate the FPGA, and the thickness of the board saver is the same as that of the FPGA. Hence, when a non-final FPGA is placed in the square hole, the combination of the non-final FPGA and the board saver occupy no more area and thickness than would a final FPGA soldered directly into its designated position on the first-mentioned circuit board. The contact leads of a non-final FPGA are not bent and are soldered, at the top of the board saver, to the corresponding via holes. A non-final FPGA can readily be unsoldered from the board saver and replaced by another one. Once the final FPGA design has been determined, the board saver can be unsoldered from the contact pads on the first-mentioned printed-circuit board and replaced by the final FPGA.

Inkjet printed circuits based on ambipolar and p-type carbon nanotube thin-film transistors

PubMed Central

Kim, Bongjun; Geier, Michael L.; Hersam, Mark C.; Dodabalapur, Ananth

2017-01-01

Ambipolar and p-type single-walled carbon nanotube (SWCNT) thin-film transistors (TFTs) are reliably integrated into various complementary-like circuits on the same substrate by inkjet printing. We describe the fabrication and characteristics of inverters, ring oscillators, and NAND gates based on complementary-like circuits fabricated with such TFTs as building blocks. We also show that complementary-like circuits have potential use as chemical sensors in ambient conditions since changes to the TFT characteristics of the p-channel TFTs in the circuit alter the overall operating characteristics of the circuit. The use of circuits rather than individual devices as sensors integrates sensing and signal processing functions, thereby simplifying overall system design. PMID:28145438

Printed circuit board recycling: Physical processing and copper extraction by selective leaching.

PubMed

Silvas, Flávia P C; Correa, Mónica M Jiménez; Caldas, Marcos P K; de Moraes, Viviane T; Espinosa, Denise C R; Tenório, Jorge A S

2015-12-01

Global generation of waste electrical and electronic equipment (WEEE) is about 40 million tons per year. Constant increase in WEEE generation added to international legislations has improved the development of processes for materials recovery and sustainability of electrical and electronic industry. This paper describes a new hydrometallurgical route (leaching process) to recycle printed circuit boards (PCBs) from printers to recover copper. Methodology included PCBs characterization and a combined route of physical and hydrometallurgical processing. Magnetic separation, acid digestion and chemical analysis by ICP-OES were performed. On leaching process were used two stages: the first one in a sulfuric media and the second in an oxidant media. The results showed that the PCBs composition was 74.6 wt.% of non-magnetic material and 25.4 wt.% of magnetic one. The metallic fraction corresponded to 44.0 wt.%, the polymeric to 28.5 wt.% and the ceramic to 27.5 wt.%. The main metal was copper and its initial content was 32.5 wt.%. On sulfuric leaching 90 wt.% of Al, 40 wt.% of Zn and 8.6 wt.% of Sn were extracted, whereas on oxidant leaching tests the extraction percentage of Cu was 100 wt.%, of Zn 60 wt.% and of Al 10 wt.%. At the end of the hydrometallurgical processing was obtained 100% of copper extraction and the recovery factor was 98.46%, which corresponds to a 32 kg of Cu in 100 kg of PCB. Copyright © 2015 Elsevier Ltd. All rights reserved.

Advances in Current Rating Techniques for Flexible Printed Circuits

NASA Technical Reports Server (NTRS)

Hayes, Ron

2014-01-01

Twist Capsule Assemblies are power transfer devices commonly used in spacecraft mechanisms that require electrical signals to be passed across a rotating interface. Flexible printed circuits (flex tapes, see Figure 2) are used to carry the electrical signals in these devices. Determining the current rating for a given trace (conductor) size can be challenging. Because of the thermal conditions present in this environment the most appropriate approach is to assume that the only means by which heat is removed from the trace is thru the conductor itself, so that when the flex tape is long the temperature rise in the trace can be extreme. While this technique represents a worst-case thermal situation that yields conservative current ratings, this conservatism may lead to overly cautious designs when not all traces are used at their full rated capacity. A better understanding of how individual traces behave when they are not all in use is the goal of this research. In the testing done in support of this paper, a representative flex tape used for a flight Solar Array Drive Assembly (SADA) application was tested by energizing individual traces (conductors in the tape) in a vacuum chamber and the temperatures of the tape measured using both fine-gauge thermocouples and infrared thermographic imaging. We find that traditional derating schemes used for bundles of wires do not apply for the configuration tested. We also determine that single active traces located in the center of a flex tape operate at lower temperatures than those on the outside edges.

Testing of printed circuit board solder joints by optical correlation

NASA Technical Reports Server (NTRS)

Espy, P. N.

1975-01-01

An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

Space shuttle main engine controller assembly, phase C-D. [with lagging system design and analysis

NASA Technical Reports Server (NTRS)

1973-01-01

System design and system analysis and simulation are slightly behind schedule, while design verification testing has improved. Input/output circuit design has improved, but digital computer unit (DCU) and mechanical design continue to lag. Part procurement was impacted by delays in printed circuit board, assembly drawing releases. These are the result of problems in generating suitable printed circuit artwork for the very complex and high density multilayer boards.

A Printed Organic Circuit System for Wearable Amperometric Electrochemical Sensors.

PubMed

Shiwaku, Rei; Matsui, Hiroyuki; Nagamine, Kuniaki; Uematsu, Mayu; Mano, Taisei; Maruyama, Yuki; Nomura, Ayako; Tsuchiya, Kazuhiko; Hayasaka, Kazuma; Takeda, Yasunori; Fukuda, Takashi; Kumaki, Daisuke; Tokito, Shizuo

2018-04-23

Wearable sensor device technologies, which enable continuous monitoring of biological information from the human body, are promising in the fields of sports, healthcare, and medical applications. Further thinness, light weight, flexibility and low-cost are significant requirements for making the devices attachable onto human tissues or clothes like a patch. Here we demonstrate a flexible and printed circuit system consisting of an enzyme-based amperometric sensor, feedback control and amplification circuits based on organic thin-film transistors. The feedback control and amplification circuits based on pseudo-CMOS inverters were successfuly integrated by printing methods on a plastic film. This simple system worked very well like a potentiostat for electrochemical measurements, and enabled the quantitative and real-time measurement of lactate concentration with high sensitivity of 1 V/mM and a short response time of a hundred seconds.

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Characterization of Printed Circuit Boards for Metal and Energy Recovery after Milling and Mechanical Separation

PubMed Central

Bizzo, Waldir A.; Figueiredo, Renata A.; de Andrade, Valdelis F.

2014-01-01

The proper disposal of electrical and electronic waste is currently a concern of researchers and environmental managers not only because of the large volume of such waste generated, but also because of the heavy metals and toxic substances it contains. This study analyzed printed circuit boards (PCBs) from discarded computers to determine their metal content and characterized them as solid waste and fuel. The analysis showed that PCBs consist of approximately 26% metal, made up mainly of copper, lead, aluminum, iron and tin, as well as other heavy metals such as cadmium and nickel. Comparison with the results of other studies indicated that the concentration of precious metals (gold and silver) has declined over time. Analysis of the leachate revealed high concentrations of cadmium and lead, giving the residue the characteristics of hazardous waste. After milling the PCBs, we found that larger amounts of metal were concentrated in smaller fractions, while the lightest fraction, obtained by density separation, had a gross calorific value of approximately 11 MJ/kg, although with a high ash content. Milling followed by density separation proved potentially useful for recovery of metals and energy-rich fractions. PMID:28788692

A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board.

PubMed

Jiang, Wu; Jia, Li; Zhen-Ming, Xu

2009-01-15

The electrostatic separation is an effective method for recycling waste electrical and electronic equipment (WEEE). The efficiency of electrostatic separation processes depends on the ability of the separator. As a classical one, the roll-type corona-electrostatic separator has some advantages in recycling metals and plastics from waste printed circuit board (PCB). However, its industry application still faces some problems, such as: the further disposal of the middling products of the separation process; the balance of the production capacity and the good separation efficiency; the separation of the fine granular mixture and the stability of the separation process. A new "two-roll-type corona-electrostatic separator" was built to overcome the limitation of the classical one. The experimental data were discussed and the results showed that the outcome of the separation process was improved by using the new separator. Compared with the classical machine, the mass of conductive products increases 8.9% (groups 2 and 3) and10.2% (group 4) while the mass of the middling products decreases 45% (groups 2 and 3) and 31.7% (group 4), respectively. The production capacity of the new machine increases, and the stability of the separation process is enhanced.

Heat sinking for printed circuitry

DOEpatents

Wilson, S.K.; Richardson, G.; Pinkerton, A.L.

1984-09-11

A flat pak or other solid-state device mounted on a printed circuit board directly over a hole extends therethrough so that the bottom of the pak or device extends beyond the bottom of the circuit board. A heat sink disposed beneath the circuit board contacts the bottom of the pak or device and provides direct heat sinking thereto. Pressure may be applied to the top of the pak or device to assure good mechanical and thermal contact with the heat sink.

Compact, high-speed algorithm for laying out printed circuit board runs

NASA Astrophysics Data System (ADS)

Zapolotskiy, D. Y.

1985-09-01

A high speed printed circuit connection layout algorithm is described which was developed within the framework of an interactive system for designing two-sided printed circuit broads. For this reason, algorithm speed was considered, a priori, as a requirement equally as important as the inherent demand for minimizing circuit run lengths and the number of junction openings. This resulted from the fact that, in order to provide psychological man/machine compatibility in the design process, real-time dialog during the layout phase is possible only within limited time frames (on the order of several seconds) for each circuit run. The work was carried out for use on an ARM-R automated work site complex based on an SM-4 minicomputer with a 32K-word memory. This limited memory capacity heightened the demand for algorithm speed and also tightened data file structure and size requirements. The layout algorithm's design logic is analyzed. The structure and organization of the data files are described.

Biodegradable materials for multilayer transient printed circuit boards.

PubMed

Huang, Xian; Liu, Yuhao; Hwang, Suk-Won; Kang, Seung-Kyun; Patnaik, Dwipayan; Cortes, Jonathan Fajardo; Rogers, John A

2014-11-19

Biodegradable printed circuit boards based on water-soluble materials are demonstrated. These systems can dissolve in water within 10 mins to yield end-products that are environmentally safe. These and related approaches have the potential to reduce hazardous waste streams associated with electronics disposal. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Testing Services

NASA Technical Reports Server (NTRS)

1993-01-01

Trace Laboratories is an independent testing laboratory specializing in testing printed circuit boards, automotive products and military hardware. Technical information from NASA Tech Briefs and two subsequent JPL Technical Support packages have assisted Trace in testing surface insulation resistance on printed circuit board materials. Testing time was reduced and customer service was improved because of Jet Propulsion Laboratory technical support packages.

An Integer Programming-Based Generalized Vehicle Routing Approach for Printed Circuit Board Assembly Optimization

ERIC Educational Resources Information Center

Seth, Anupam

2009-01-01

Production planning and scheduling for printed circuit, board assembly has so far defied standard operations research approaches due to the size and complexity of the underlying problems, resulting in unexploited automation flexibility. In this thesis, the increasingly popular collect-and-place machine configuration is studied and the assembly…

78 FR 75360 - Notice of Issuance of Final Determination Concerning Certain Ethernet Switches

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-11

... printed circuit board assembly (``PCBA''), chassis, top cover, power supply, and fans. The switches... printed circuit board is populated with various electronic components to make a PCBA. 2. The PCBA is... Singapore. You argue that without the EOS software, the units exported from Singapore lack the intelligence...

A current-excited triple-time-voltage oversampling method for bio-impedance model for cost-efficient circuit system.

PubMed

Yan Hong; Yong Wang; Wang Ling Goh; Yuan Gao; Lei Yao

2015-08-01

This paper presents a mathematic method and a cost-efficient circuit to measure the value of each component of the bio-impedance model at electrode-electrolyte interface. The proposed current excited triple-time-voltage oversampling (TTVO) method deduces the component values by solving triple simultaneous electric equation (TSEE) at different time nodes during a current excitation, which are the voltage functions of time. The proposed triple simultaneous electric equations (TSEEs) allows random selections of the time nodes, hence numerous solutions can be obtained during a single current excitation. Following that, the oversampling approach is engaged by averaging all solutions of multiple TSEEs acquired after a single current excitation, which increases the practical measurement accuracy through the improvement of the signal-to-noise ratio (SNR). In addition, a print circuit board (PCB) that consists a switched current exciter and an analog-to-digital converter (ADC) is designed for signal acquisition. This presents a great cost reduction when compared against other instrument-based measurement data reported [1]. Through testing, the measured values of this work is proven to be in superb agreements on the true component values of the electrode-electrolyte interface model. This work is most suited and also useful for biological and biomedical applications, to perform tasks such as stimulations, recordings, impedance characterizations, etc.

Biomedical Diagnostics Enabled by Integrated Organic and Printed Electronics.

PubMed

Ahmadraji, Termeh; Gonzalez-Macia, Laura; Ritvonen, Tapio; Willert, Andreas; Ylimaula, Satu; Donaghy, David; Tuurala, Saara; Suhonen, Mika; Smart, Dave; Morrin, Aoife; Efremov, Vitaly; Baumann, Reinhard R; Raja, Munira; Kemppainen, Antti; Killard, Anthony J

2017-07-18

Organic and printed electronics integration has the potential to revolutionize many technologies, including biomedical diagnostics. This work demonstrates the successful integration of multiple printed electronic functionalities into a single device capable of the measurement of hydrogen peroxide and total cholesterol. The single-use device employed printed electrochemical sensors for hydrogen peroxide electroreduction integrated with printed electrochromic display and battery. The system was driven by a conventional electronic circuit designed to illustrate the complete integration of silicon integrated circuits via pick and place or using organic electronic circuits. The device was capable of measuring 8 μL samples of both hydrogen peroxide (0-5 mM, 2.72 × 10 -6 A·mM -1 ) and total cholesterol in serum from 0 to 9 mM (1.34 × 10 -8 A·mM -1 , r 2 = 0.99, RSD < 10%, n = 3), and the result was output on a semiquantitative linear bar display. The device could operate for 10 min via a printed battery, and display the result for many hours or days. A mobile phone "app" was also capable of reading the test result and transmitting this to a remote health care provider. Such a technology could allow improved management of conditions such as hypercholesterolemia.

Computerized power supply analysis: State equation generation and terminal models

NASA Technical Reports Server (NTRS)

Garrett, S. J.

1978-01-01

To aid engineers that design power supply systems two analysis tools that can be used with the state equation analysis package were developed. These tools include integration routines that start with the description of a power supply in state equation form and yield analytical results. The first tool uses a computer program that works with the SUPER SCEPTRE circuit analysis program and prints the state equation for an electrical network. The state equations developed automatically by the computer program are used to develop an algorithm for reducing the number of state variables required to describe an electrical network. In this way a second tool is obtained in which the order of the network is reduced and a simpler terminal model is obtained.

Glass Fibers for Printed Circuit Boards

NASA Astrophysics Data System (ADS)

Longobardo, Anthony V.

Fiberglass imparts numerous positive benefits to modern printed circuit boards. Reinforced laminate composites have an excellent cost-performance relationship that makes sense for most applications. At the leading edge of the technology, new glass fibers with improved properties, in combination with the best resin systems available, are able to meet very challenging performance, cost, and regulatory demands while remaining manufacturable.

Printed-Circuit-Board Soldering Training for Group IV Personnel.

ERIC Educational Resources Information Center

Hooprich, E. A.; Matlock, E. W.

As part of a larger program to determine which Navy skills can be learned by lower aptitude personnel, and which methods and techniques would be most effective, an experimental course in printed circuit board soldering was given to 186 Group IV students in 13 classes. Two different training approaches--one stressing instructor guidance and the…

Interface between a printed circuit board computer aided design tool (Tektronix 4051 based) and a numerical paper tape controlled drill press (Slo-Syn 530: 100 w/ Dumore Automatic Head Number 8391)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Heckman, B.K.; Chinn, V.K.

1981-01-01

The development and use of computer programs written to produce the paper tape needed for the automation, or numeric control, of drill presses employed to fabricate computed-designed printed circuit boards are described. (LCL)

A Formal Algorithm for Routing Traces on a Printed Circuit Board

NASA Technical Reports Server (NTRS)

Hedgley, David R., Jr.

1996-01-01

This paper addresses the classical problem of printed circuit board routing: that is, the problem of automatic routing by a computer other than by brute force that causes the execution time to grow exponentially as a function of the complexity. Most of the present solutions are either inexpensive but not efficient and fast, or efficient and fast but very costly. Many solutions are proprietary, so not much is written or known about the actual algorithms upon which these solutions are based. This paper presents a formal algorithm for routing traces on a print- ed circuit board. The solution presented is very fast and efficient and for the first time speaks to the question eloquently by way of symbolic statements.

Fully-printed high-performance organic thin-film transistors and circuitry on one-micron-thick polymer films

NASA Astrophysics Data System (ADS)

Fukuda, Kenjiro; Takeda, Yasunori; Yoshimura, Yudai; Shiwaku, Rei; Tran, Lam Truc; Sekine, Tomohito; Mizukami, Makoto; Kumaki, Daisuke; Tokito, Shizuo

2014-06-01

Thin, ultra-flexible devices that can be manufactured in a process that covers a large area will be essential to realizing low-cost, wearable electronic applications including foldable displays and medical sensors. The printing technology will be instrumental in fabricating these novel electronic devices and circuits; however, attaining fully printed devices on ultra-flexible films in large areas has typically been a challenge. Here we report on fully printed organic thin-film transistor devices and circuits fabricated on 1-μm-thick parylene-C films with high field-effect mobility (1.0 cm2 V-1 s-1) and fast operating speeds (about 1 ms) at low operating voltages. The devices were extremely light (2 g m-2) and exhibited excellent mechanical stability. The devices remained operational even under 50% compressive strain without significant changes in their performance. These results represent significant progress in the fabrication of fully printed organic thin-film transistor devices and circuits for use in unobtrusive electronic applications such as wearable sensors.

CMOS Imaging of Temperature Effects on Pin-Printed Xerogel Sensor Microarrays.

PubMed

Lei Yao; Ka Yi Yung; Chodavarapu, Vamsy P; Bright, Frank V

2011-04-01

In this paper, we study the effect of temperature on the operation and performance of a xerogel-based sensor microarrays coupled to a complementary metal-oxide semiconductor (CMOS) imager integrated circuit (IC) that images the photoluminescence response from the sensor microarray. The CMOS imager uses a 32 × 32 (1024 elements) array of active pixel sensors and each pixel includes a high-gain phototransistor to convert the detected optical signals into electrical currents. A correlated double sampling circuit and pixel address/digital control/signal integration circuit are also implemented on-chip. The CMOS imager data are read out as a serial coded signal. The sensor system uses a light-emitting diode to excite target analyte responsive organometallic luminophores doped within discrete xerogel-based sensor elements. As a proto type, we developed a 3 × 3 (9 elements) array of oxygen (O2) sensors. Each group of three sensor elements in the array (arranged in a column) is designed to provide a different and specific sensitivity to the target gaseous O2 concentration. This property of multiple sensitivities is achieved by using a mix of two O2 sensitive luminophores in each pin-printed xerogel sensor element. The CMOS imager is designed to be low noise and consumes a static power of 320.4 μW and an average dynamic power of 624.6 μW when operating at 100-Hz sampling frequency and 1.8-V dc power supply.

Exhaust constituent emission factors of printed circuit board pyrolysis processes and its exhaust control.

PubMed

Chiang, Hung-Lung; Lin, Kuo-Hsiung

2014-01-15

The printed circuit board (PCB) is an important part of electrical and electronic equipment, and its disposal and the recovery of useful materials from waste PCBs (WPCBs) are key issues for waste electrical and electronic equipment. Waste PCB compositions and their pyrolysis characteristics were analyzed in this study. In addition, the volatile organic compound (VOC) exhaust was controlled by an iron-impregnated alumina oxide catalyst. Results indicated that carbon and oxygen were the dominant components (hundreds mg/g) of the raw materials, and other elements such as nitrogen, bromine, and copper were several decades mg/g. Exhaust constituents of CO, H2, CH4, CO2, and NOx, were 60-115, 0.4-4.0, 1.1-10, 30-95, and 0-0.7mg/g, corresponding to temperatures ranging from 200 to 500°C. When the pyrolysis temperature was lower than 300°C, aromatics and paraffins were the major species, contributing 90% of ozone precursor VOCs, and an increase in the pyrolysis temperature corresponded to a decrease in the fraction of aromatic emission factors. Methanol, ethylacetate, acetone, dichloromethane, tetrachloromethane and acrylonitrile were the main species of oxygenated and chlorinated VOCs. The emission factors of some brominated compounds, i.e., bromoform, bromophenol, and dibromophenol, were higher at temperatures over 400°C. When VOC exhaust was flowed through the bed of Fe-impregnated Al2O3, the emission of ozone precursor VOCs could be reduced by 70-80%. Copyright © 2013 Elsevier B.V. All rights reserved.

Organic printed photonics: From microring lasers to integrated circuits

PubMed Central

Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

2015-01-01

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices. PMID:26601256

Organic printed photonics: From microring lasers to integrated circuits.

PubMed

Zhang, Chuang; Zou, Chang-Ling; Zhao, Yan; Dong, Chun-Hua; Wei, Cong; Wang, Hanlin; Liu, Yunqi; Guo, Guang-Can; Yao, Jiannian; Zhao, Yong Sheng

2015-09-01

A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 10(5), which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.

Fabrication of Nanoscale Circuits on Inkjet-Printing Patterned Substrates.

PubMed

Chen, Shuoran; Su, Meng; Zhang, Cong; Gao, Meng; Bao, Bin; Yang, Qiang; Su, Bin; Song, Yanlin

2015-07-08

Nanoscale circuits are fabricated by assembling different conducting materials (e.g., metal nanoparticles, metal nano-wires, graphene, carbon nanotubes, and conducting polymers) on inkjet-printing patterned substrates. This non-litho-graphy strategy opens a new avenue for integrating conducting building blocks into nanoscale devices in a cost-efficient manner. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Treatment of Wastewater from Electroplating, Metal Finishing and Printed Circuit Board Manufacturing. Operation of Wastewater Treatment Plants Volume 4.

ERIC Educational Resources Information Center

California State Univ., Sacramento. Dept. of Civil Engineering.

One of four manuals dealing with the operation of wastewater plants, this document was designed to address the treatment of wastewater from electroplating, metal finishing, and printed circuit board manufacturing. It emphasizes how to operate and maintain facilities which neutralize acidic and basic waters; treat waters containing metals; destroy…

A low-power integrated humidity CMOS sensor by printing-on-chip technology.

PubMed

Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A; Wu, Wen-Jung; Lin, Chih-Ting

2014-05-23

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems.

A Low-Power Integrated Humidity CMOS Sensor by Printing-on-Chip Technology

PubMed Central

Lee, Chang-Hung; Chuang, Wen-Yu; Cowan, Melissa A.; Wu, Wen-Jung; Lin, Chih-Ting

2014-01-01

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-on-chip humidity sensor achieves a heterogeneous three dimensional sensor system-on-chip architecture. The humidity sensing of the implemented printing-on-chip sensor system is experimentally tested. The sensor shows a sensitivity of 0.98% to humidity in the atmosphere. The maximum dynamic range of the readout circuit is 9.8 MΩ, which can be further tuned by the frequency of input signal to fit the requirement of the resistance of printed sensor. The power consumption keeps only 154 μW. This printing-on-chip sensor provides a practical solution to fulfill an ultra-small integrated sensor for the applications in miniaturized sensing systems. PMID:24859027

[Newly leaching method of copper from waste print circuit board using hydrochloric acid/n-butylamine/copper sulfate].

PubMed

Wang, Hong-Yan; Cui, Zhao-Jie; Yao, Ya-Wei

2010-12-01

A newly leaching method of copper from waste print circuit board was established by using hydrochloric acid-n-butylamine-copper sulfate mixed solution. The conditions of leaching were optimized by changing the hydrochloric acid, n-butylamine, copper sulfate,temperature and other conditions using copper as target mimics. The results indicated that copper could be leached completely after 8 h at 50 degrees C, hydrochloric acid concentration of 1.75 mol/L, n-butylamine concentration of 0.25 mol/L, and copper sulfate mass of 0.96 g. Under the conditions, copper leaching rates in waste print circuit board samples was up to 95.31% after 9 h. It has many advantages such as better effects, low cost, mild reaction conditions, leaching solution recycling.

Coaxial connector for use with printed circuit board edge connector

DOEpatents

Howard, Donald R.; MacGill, Robert A.

1989-01-01

A coaxial cable connector for interfacing with an edge connector for a printed circuit board whereby a coaxial cable can be interconnected with a printed circuit board through the edge connector. The coaxial connector includes a body having two leg portions extending from one side for receiving the edge connector therebetween, and a tubular portion extending from an opposing side for receiving a coaxial cable. A cavity within the body receives a lug of the edge connector and the center conductor of the coaxial cable. Adjacent lugs of the edge connector can be bend around the edge connector housing to function as spring-loaded contacts for receiving the coaxial connector. The lugs also function to facilitate shielding of the center conductor where fastened to the edge connector lug.

Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen

PubMed Central

Wang, Lei; Liu, Jing

2014-01-01

A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi35In48.6Sn16Zn0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid–solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi35In48.6Sn16Zn0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance–temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future. PMID:25484611

Printing low-melting-point alloy ink to directly make a solidified circuit or functional device with a heating pen.

PubMed

Wang, Lei; Liu, Jing

2014-12-08

A new method to directly print out a solidified electronic circuit through low-melting-point metal ink is proposed. A functional pen with heating capability was fabricated. Several typical thermal properties of the alloy ink Bi 35 In 48.6 Sn 16 Zn 0.4 were measured and evaluated. Owing to the specifically selected melting point of the ink, which is slightly higher than room temperature, various electronic devices, graphics or circuits can be manufactured in a short period of time and then rapidly solidified by cooling in the surrounding air. The liquid-solid phase change mechanism of the written lines was experimentally characterized using a scanning electron microscope. In order to determine the matching substrate, wettability between the metal ink Bi 35 In 48.6 Sn 16 Zn 0.4 and several materials, including mica plate and silicone rubber, was investigated. The resistance-temperature curve of a printed resistor indicated its potential as a temperature control switch. Furthermore, the measured reflection coefficient of a printed double-diamond antenna accords well with the simulated result. With unique merits such as no pollution, no requirement for encapsulation and easy recycling, the present printing approach is an important supplement to current printed electronics and has enormous practical value in the future.

Carbon Nanotube Flexible and Stretchable Electronics

NASA Astrophysics Data System (ADS)

Cai, Le; Wang, Chuan

2015-08-01

The low-cost and large-area manufacturing of flexible and stretchable electronics using printing processes could radically change people's perspectives on electronics and substantially expand the spectrum of potential applications. Examples range from personalized wearable electronics to large-area smart wallpapers and from interactive bio-inspired robots to implantable health/medical apparatus. Owing to its one-dimensional structure and superior electrical property, carbon nanotube is one of the most promising material platforms for flexible and stretchable electronics. Here in this paper, we review the recent progress in this field. Applications of single-wall carbon nanotube networks as channel semiconductor in flexible thin-film transistors and integrated circuits, as stretchable conductors in various sensors, and as channel material in stretchable transistors will be discussed. Lastly, state-of-the-art advancement on printing process, which is ideal for large-scale fabrication of flexible and stretchable electronics, will also be reviewed in detail.

Carbon Nanotube Flexible and Stretchable Electronics.

PubMed

Cai, Le; Wang, Chuan

2015-12-01

The low-cost and large-area manufacturing of flexible and stretchable electronics using printing processes could radically change people's perspectives on electronics and substantially expand the spectrum of potential applications. Examples range from personalized wearable electronics to large-area smart wallpapers and from interactive bio-inspired robots to implantable health/medical apparatus. Owing to its one-dimensional structure and superior electrical property, carbon nanotube is one of the most promising material platforms for flexible and stretchable electronics. Here in this paper, we review the recent progress in this field. Applications of single-wall carbon nanotube networks as channel semiconductor in flexible thin-film transistors and integrated circuits, as stretchable conductors in various sensors, and as channel material in stretchable transistors will be discussed. Lastly, state-of-the-art advancement on printing process, which is ideal for large-scale fabrication of flexible and stretchable electronics, will also be reviewed in detail.

Paper-based piezoelectric touch pads with hydrothermally grown zinc oxide nanowires.

PubMed

Li, Xiao; Wang, Yu-Hsuan; Zhao, Chen; Liu, Xinyu

2014-12-24

This paper describes a new type of paper-based piezoelectric touch pad integrating zinc oxide nanowires (ZnO NWs), which can serve as user interfaces in paper-based electronics. The sensing functionality of these touch pads is enabled by the piezoelectric property of ZnO NWs grown on paper using a simple, cost-efficient hydrothermal method. A piece of ZnO-NW paper with two screen-printed silver electrodes forms a touch button, and touch-induced electric charges from the button are converted into a voltage output using a charge amplifier circuit. A touch pad consisting of an array of buttons can be readily integrated into paper-based electronic devices, allowing user input of information for various purposes such as programming, identification checking, and gaming. This novel design features ease of fabrication, low cost, ultrathin structure, and good compatibility with techniques in printed electronics, and further enriches the available technologies of paper-based electronics.

Condition monitoring of Electric Components

NASA Astrophysics Data System (ADS)

Zaman, Ishtiaque

A universal non-intrusive model of a flexible antenna array is presented in this paper to monitor and identify the failures in electric machines. This adjustable antenna is designed to serve the purpose of condition monitoring of a vast range of electrical components including Induction Motor (IM), Printed Circuit Board (PCB), Synchronous Reluctance Motor (SRM), Permanent Magnet Synchronous Machine (PMSM) etc. by capturing the low frequency magnetic field radiated around these machines. The basic design and specification of the proposed antenna array for low frequency components is portrayed first. The design of the antenna is adjustable to fit for an extensive variety of segments. Subsequent to distinguishing the design and specifications of the antenna, the ideal area of the most delicate stray field has been identified for healthy current streaming around the machineries. Following this, short circuit representing faulty situation has been introduced and compared with the healthy cases. Precision has been found recognizing the faults using this one generic model of Antenna and the results are presented for three different machines i.e. IM, SRM and PMSM. Finite element method has been used to design the antenna and detect the optimum location and faults in the machines. Finally, a 3D Printer is proposed to be employed to build the antenna as per the details tended to in this paper contingent upon the power segments.

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

NASA Astrophysics Data System (ADS)

Elsobky, Mourad; Mahsereci, Yigit; Keck, Jürgen; Richter, Harald; Burghartz, Joachim N.

2017-09-01

Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI) substrate to form a Hybrid System-in-Foil (HySiF), which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing) of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA) in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC). The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC), a differential difference amplifier (DDA), and a 10-bit successive approximation register (SAR) ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

A 128-channel picoammeter system and its application on charged particle beam current distribution measurements.

PubMed

Yu, Deyang; Liu, Junliang; Xue, Yingli; Zhang, Mingwu; Cai, Xiaohong; Hu, Jianjun; Dong, Jinmei; Li, Xin

2015-11-01

A 128-channel picoammeter system is constructed based on instrumentation amplifiers. Taking advantage of a high electric potential and narrow bandwidth in DC energetic charged beam measurements, a current resolution better than 5 fA can be achieved. Two sets of 128-channel strip electrodes are implemented on printed circuit boards and are employed for ion and electron beam current distribution measurements. Tests with 60 keV O(3+) ions and 2 keV electrons show that it can provide exact boundaries when a positive charged particle beam current distribution is measured.

Bubble memory module

NASA Technical Reports Server (NTRS)

Bohning, O. D.; Becker, F. J.

1980-01-01

Design, fabrication and test of partially populated prototype recorder using 100 kilobit serial chips is described. Electrical interface, operating modes, and mechanical design of several module configurations are discussed. Fabrication and test of the module demonstrated the practicality of multiplexing resulting in lower power, weight, and volume. This effort resulted in the completion of a module consisting of a fully engineered printed circuit storage board populated with 5 of 8 possible cells and a wire wrapped electronics board. Interface of the module is 16 bits parallel at a maximum of 1.33 megabits per second data rate on either of two interface buses.

Preparation of hierarchical porous carbon from waste printed circuit boards for high performance electric double-layer capacitors

NASA Astrophysics Data System (ADS)

Du, Xuan; Wang, Li; Zhao, Wei; Wang, Yi; Qi, Tao; Li, Chang Ming

2016-08-01

Renewable clean energy and resources recycling have become inevitable choices to solve worldwide energy shortages and environmental pollution problems. It is a great challenge to recycle tons of waste printed circuit boards (PCB) produced every year for clean environment while creating values. In this work, low cost, high quality activated carbons (ACs) were synthesized from non-metallic fractions (NMF) of waste PCB to offer a great potential for applications of electrochemical double-layer capacitors (EDLCs). After recovering metal from waste PCB, hierarchical porous carbons were produced from NMF by carbonization and activation processes. The experimental results exhibit that some pores were formed after carbonization due to the escape of impurity atoms introduced by additives in NMF. Then the pore structure was further tailored by adjusting the activation parameters. Roles of micropores and non-micropores in charge storage were investigated when the hierarchical porous carbons were applied as electrode of EDLCs. The highest specific capacitance of 210 F g-1 (at 50 mA g-1) and excellent rate capability were achieved when the ACs possessing a proper micropores/non-micropores ratio. This work not only provides a promising method to recycle PCB, but also investigates the structure tailoring arts for a rational hierarchical porous structure in energy storage/conversion.

Recent advances in photonics packaging materials

NASA Astrophysics Data System (ADS)

Zweben, Carl

2006-02-01

There are now over a dozen low-CTE materials with thermal conductivities between that of copper (400 w/m-K) and over 4X copper (1700 W/m-K). Most have low densities. For comparison, traditional low-CTE packaging materials like copper/tungsten have thermal conductivities that are little or no better than that of aluminum (200 W/m-K) and high densities. There are also low-density thermal insulators with low CTEs. Some advanced materials are low cost. Most do not outgas. They have a wide range of electrical properties that can be used to minimize electromagnetic emissions or provide EMI shielding. Several are now in commercial and aerospace applications, including laser diode packages; light-emitting diode (LED) packages; thermoelectric cooler bases, plasma displays; power modules; servers; laptops; heat sinks; thermally conductive, low-CTE printed circuit boards; and printed circuit board cold plates. Advanced material payoffs include: improved thermal performance, reliability, alignment and manufacturing yield; reduced thermal stresses and heating power requirements; simplified thermal design; enablement of hard solder direct attach; weight savings up to 85%; size reductions up to 65%; and lower cost. This paper discusses the large and increasing number of advanced packaging materials, including properties, development status, applications, increasing manufacturing yield, cost, lessons learned and future directions, including nanocomposites.

Examining the evolution of metals utilized in printed circuit boards.

PubMed

Adie, Gilbert Umaye; Sun, Lingyu; Zeng, Xianlai; Zheng, Lixia; Osibanjo, Oladele; Li, Jinhui

2017-07-01

Management of waste electrical and electronic equipment (WEEE) has recently attracted worldwide attention because of high metal concentrations in them. Evolution of toxic and precious metals utilized in WEEE can not only reflect the adventure of eco-design, but can also guide the final recycling option. Pb, As, Cu, Au, Sn and Ag were determined in 10 composite samples of printed circuit boards of cathode ray tube televisions (TV-PCBs) that were produced between 1980 and 2005. The obtained results indicated that average metal concentrations in all TV-PCBs were - Cu: 10.6 ± 4.1%, Sn: 4.21 ± 0.90%, Pb: 3.15 ± 0.54%, Ag: 0.0215 ± 0.0068%, Au: 0.0068 ± 0.0049% and As: 0.0007 ± 0.0004%. No remarkable difference was found in compositions of Pb and Sn over the years, suggesting that there were no major modifications of Sn/Pb solder used in joining the circuitry system. The average composition of Cu fluctuated between 5.10% in 1980 and 12.8% in the mid-1990s and decreased afterwards. The decreases in Ag and Cu compositions could possibly be associated with thinner layers of these metals in newer model products.

Three-Dimensional, Inkjet-Printed Organic Transistors and Integrated Circuits with 100% Yield, High Uniformity, and Long-Term Stability.

PubMed

Kwon, Jimin; Takeda, Yasunori; Fukuda, Kenjiro; Cho, Kilwon; Tokito, Shizuo; Jung, Sungjune

2016-11-22

In this paper, we demonstrate three-dimensional (3D) integrated circuits (ICs) based on a 3D complementary organic field-effect transistor (3D-COFET). The transistor-on-transistor structure was achieved by vertically stacking a p-type OFET over an n-type OFET with a shared gate joining the two transistors, effectively halving the footprint of printed transistors. All the functional layers including organic semiconductors, source/drain/gate electrodes, and interconnection paths were fully inkjet-printed except a parylene dielectric which was deposited by chemical vapor deposition. An array of printed 3D-COFETs and their inverter logic gates comprising over 100 transistors showed 100% yield, and the uniformity and long-term stability of the device were also investigated. A full-adder circuit, the most basic computing unit, has been successfully demonstrated using nine NAND gates based on the 3D structure. The present study fulfills the essential requirements for the fabrication of organic printed complex ICs (increased transistor density, 100% yield, high uniformity, and long-term stability), and the findings can be applied to realize more complex digital/analogue ICs and intelligent devices.

Recovering metallic fractions from waste electrical and electronic equipment by a novel vibration system.

PubMed

Habib, Muddasar; Miles, Nicholas J; Hall, Philip

2013-03-01

The need to recover and recycle valuable resources from Waste Electrical and Electronic Equipment (WEEE) is of growing importance as increasing amounts are generated due to shorter product life cycles, market expansions, new product developments and, higher consumption and production rates. The European Commission (EC) directive, 2002/96/EC, on WEEE became law in UK in January 2007 setting targets to recover up to 80% of all WEEE generated. Printed Wire Board (PWB) and/or Printed Circuit Board (PCB) is an important component of WEEE with an ever increasing tonnage being generated. However, the lack of an accurate estimate for PCB production, future supply and uncertain demands of its recycled materials in international markets has provided the motivation to explore different approaches to recycle PCBs. The work contained in this paper focuses on a novel, dry separation methodology in which vertical vibration is used to separate the metallic and non-metallic fractions of PCBs. When PCBs were comminuted to less than 1mm in size, metallic grades as high as 95% (measured by heavy liquid analysis) could be achieved in the recovered products. Copyright © 2012 Elsevier Ltd. All rights reserved.

Encapsulate-and-peel: fabricating carbon nanotube CMOS integrated circuits in a flexible ultra-thin plastic film.

PubMed

Gao, Pingqi; Zhang, Qing

2014-02-14

Fabrication of single-walled carbon nanotube thin film (SWNT-TF) based integrated circuits (ICs) on soft substrates has been challenging due to several processing-related obstacles, such as printed/transferred SWNT-TF pattern and electrode alignment, electrical pad/channel material/dielectric layer flatness, adherence of the circuits onto the soft substrates etc. Here, we report a new approach that circumvents these challenges by encapsulating pre-formed SWNT-TF-ICs on hard substrates into polyimide (PI) and peeling them off to form flexible ICs on a large scale. The flexible SWNT-TF-ICs show promising performance comparable to those circuits formed on hard substrates. The flexible p- and n-type SWNT-TF transistors have an average mobility of around 60 cm(2) V(-1) s(-1), a subthreshold slope as low as 150 mV dec(-1), operating gate voltages less than 2 V, on/off ratios larger than 10(4) and a switching speed of several kilohertz. The post-transfer technique described here is not only a simple and cost-effective pathway to realize scalable flexible ICs, but also a feasible method to fabricate flexible displays, sensors and solar cells etc.

Dynamic Recrystallization Model for Whisker and Hillock Growth

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vianco, Paul T.; Neilsen, Michael K.

2015-07-01

Tin (Sn) whiskers are not a recent development. Studies in the late 1930’s investigated thin filaments that grew spontaneously from Sn coatings used for the corrosion protection of electronic hardware. It was soon recognized that these Sn filaments,or whiskers, could create short circuits in the same electronic equipment. Figure 1a illustrates whisker growth in the hole of a printed circuit board having an immersion Sn surface finish. The engineering solution was to contaminate the Sn with > 3wt.% of lead (Pb). The result was that whisker growth was replaced with hillock formation (Fig. 1b) that posed a minimal reliability concerntomore » electrical circuits. Today, Pb-containing finishes are being replaced with pure Sn coatings to meet environmental restrictions on Pb use. The same short-circuit concerns have been raised, once again, with respect to Sn whiskers. The present authors have taken the approach that, in order to develop more widely applicable, first-principles strategies to mitigate Sn whisker formation, it is necessary to understand the fundamental mechanism(s) and rate kinetics underlying their development. Numerous mechanisms have been proposed by other authors to describe whisker growth, including static recrystallization by Boguslavsky and Bush.« less

Paper-Based Inkjet-Printed Flexible Electronic Circuits.

PubMed

Wang, Yan; Guo, Hong; Chen, Jin-Ju; Sowade, Enrico; Wang, Yu; Liang, Kun; Marcus, Kyle; Baumann, Reinhard R; Feng, Zhe-Sheng

2016-10-05

Printed flexible electronics have been widely studied for their potential use in various applications. In this paper, a simple, low-cost method of fabricating flexible electronic circuits with high conductivity of 4.0 × 10 7 S·m -1 (about 70% of the conductivity of bulk copper) is demonstrated. Teslin paper substrate is treated with stannous chloride (SnCl 2 ) colloidal solution to reduce the high ink absorption rate, and then the catalyst ink is inkjet-printed on its surface, followed by electroless deposition of copper at low temperature. In spite of the decrease in conductance to some extent, electronic circuits fabricated by this method can maintain function even under various folding angles or after repeated folding. This developed technology has great potential in a variety of applications, such as three-dimensional devices and disposable RFID tags.

Low-voltage-operated organic one-time programmable memory using printed organic thin-film transistors and antifuse capacitors.

PubMed

Jung, Soon-Won; Na, Bock Soon; Park, Chan Woo; Koo, Jae Bon

2014-11-01

We demonstrate an organic one-time programmable memory cell formed entirely at plastic-compatible temperatures. All the processes are performed at below 130 degrees C. Our memory cell consists of a printed organic transistor and an organic capacitor. Inkjet-printed organic transistors are fabricated by using high-k polymer dielectric blends comprising poly(vinylidenefluoride-trifluoroethylene) [P(VDF-TrFE)] and poly(methyl methacrylate) (PMMA) for low-voltage operation. P(NDI2OD-T2) transistors have a high field-effect mobility of 0.2 cm2/Vs and a low operation gate voltage of less than 10 V. The operation voltage effectively decreases owing to the high permittivity of the P(VDF-TrFE):PMMA blended film. The data in the memory cell are programmed by electrically breaking the organic capacitor. The organic capacitor acts like an antifuse capacitor, because it is initially open, and it becomes permanently short-circuited by applying a high voltage. The organic memory cells are programmed with 4 V, and they are read out with 2 V. The memory data are read out by sensing the current in the memory cell. The printed organic one-time programmable memory is suitable for applications storing small amount of data, such as low-cost radio-frequency identification (RFID) tag.

An argon ion beam milling process for native AlOx layers enabling coherent superconducting contacts

NASA Astrophysics Data System (ADS)

Grünhaupt, Lukas; von Lüpke, Uwe; Gusenkova, Daria; Skacel, Sebastian T.; Maleeva, Nataliya; Schlör, Steffen; Bilmes, Alexander; Rotzinger, Hannes; Ustinov, Alexey V.; Weides, Martin; Pop, Ioan M.

2017-08-01

We present an argon ion beam milling process to remove the native oxide layer forming on aluminum thin films due to their exposure to atmosphere in between lithographic steps. Our cleaning process is readily integrable with conventional fabrication of Josephson junction quantum circuits. From measurements of the internal quality factors of superconducting microwave resonators with and without contacts, we place an upper bound on the residual resistance of an ion beam milled contact of 50 mΩ μm2 at a frequency of 4.5 GHz. Resonators for which only 6% of the total foot-print was exposed to the ion beam milling, in areas of low electric and high magnetic fields, showed quality factors above 106 in the single photon regime, and no degradation compared to single layer samples. We believe these results will enable the development of increasingly complex superconducting circuits for quantum information processing.

Chemically programmed ink-jet printed resistive WORM memory array and readout circuit

NASA Astrophysics Data System (ADS)

Andersson, H.; Manuilskiy, A.; Sidén, J.; Gao, J.; Hummelgård, M.; Kunninmel, G. V.; Nilsson, H.-E.

2014-09-01

In this paper an ink-jet printed write once read many (WORM) resistive memory fabricated on paper substrate is presented. The memory elements are programmed for different resistance states by printing triethylene glycol monoethyl ether on the substrate before the actual memory element is printed using silver nano particle ink. The resistance is thus able to be set to a broad range of values without changing the geometry of the elements. A memory card consisting of 16 elements is manufactured for which the elements are each programmed to one of four defined logic levels, providing a total of 4294 967 296 unique possible combinations. Using a readout circuit, originally developed for resistive sensors to avoid crosstalk between elements, a memory card reader is manufactured that is able to read the values of the memory card and transfer the data to a PC. Such printed memory cards can be used in various applications.

Behaviour of one-step spray-coated carbon nanotube supercapacitor in ambient light harvester circuit with printed organic solar cell and electrochromic display.

PubMed

Tuukkanen, Sampo; Välimäki, Marja; Lehtimäki, Suvi; Vuorinen, Tiina; Lupo, Donald

2016-03-09

A printed energy harvesting and storage circuit powered by ambient office lighting and its use to power a printed display is reported. The autonomous device is composed of three printed electronic components: an organic photovoltaic module, a carbon-nanotubes-only supercapacitor and an electrochromic display element. Components are fabricated from safe and environmentally friendly materials, and have been fabricated using solution processing methods, which translate into low-cost and high-throughput manufacturing. A supercapacitor made of spray-coated carbon nanotube based ink and aqueous NaCl electrolyte was charged using a printed organic photovoltaic module exposed to office lighting conditions. The supercapacitor charging rate, self-discharge rate and display operation were studied in detail. The supercapacitor self-discharge rate was found to depend on the charging rate. The fully charged supercapacitor was used as a power source to run the electrochromic display over 50 times.

Spatial Control of Bacteria Using Screen Printing

PubMed Central

Moon, Soonhee; Fritz, Ian L.; Singer, Zakary S.

2016-01-01

Abstract Synthetic biology has led to advances in both our understanding and engineering of genetic circuits that affect spatial and temporal behaviors in living cells. A growing array of native and synthetic circuits such as oscillators, pattern generators, and cell–cell communication systems has been studied, which exhibit spatiotemporal properties. To better understand the design principles of these genetic circuits, there is a need for versatile and precise methods for patterning cell populations in various configurations. In this study, we develop a screen printing methodology to pattern bacteria on agar, glass, and paper surfaces. Initially, we tested three biocompatible resuspension media with appropriate rheological properties for screen printing. Using microscopy, we characterized the resolution and bleed of bacteria screen prints on agar and glass surfaces, obtaining resolutions as low as 188 μm. Next, we engineered bacterial strains producing visible chromoproteins analogous to the cyan, magenta, and yellow subtractive color system for the creation of multicolored bacteria images. Using this system, we printed distinct populations in overlapping or interlocking designs on both paper and agar substrates. These proof-of-principle experiments demonstrated how the screen printing method could be used to study microbial community interactions and pattern formation of biofilms at submillimeter length scales. Overall, our approach allows for rapid and precise prototyping of patterned bacteria species that will be useful in the understanding and engineering of spatiotemporal behaviors in microbial communities. PMID:29577061

Characterization of Novel Thin-Films and Structures for Integrated Circuit and Photovoltaic Applications

NASA Astrophysics Data System (ADS)

Zhao, Zhao

Thin films have been widely used in various applications. This research focuses on the characterization of novel thin films in the integrated circuits and photovoltaic techniques. The ion implanted layer in silicon can be treated as ion implanted thin film, which plays an essential role in the integrated circuits fabrication. Novel rapid annealing methods, i.e. microwave annealing and laser annealing, are conducted to activate ion dopants and repair the damages, and then are compared with the conventional rapid thermal annealing (RTA). In terms of As+ and P+ implanted Si, the electrical and structural characterization confirms that the microwave and laser annealing can achieve more efficient dopant activation and recrystallization than conventional RTA. The efficient dopant activation in microwave annealing is attributed to ion hopping under microwave field, while the liquid phase growth in laser annealing provides its efficient dopant activation. The characterization of dopants diffusion shows no visible diffusion after microwave annealing, some extent of end range of diffusion after RTA, and significant dopant diffusion after laser annealing. For photovoltaic applications, an indium-free novel three-layer thin-film structure (transparent composited electrode (TCE)) is demonstrated as a promising transparent conductive electrode for solar cells. The characterization of TCE mainly focuses on its optical and electrical properties. Transfer matrix method for optical transmittance calculation is validated and proved to be a desirable method for predicting transmittance of TCE containing continuous metal layer, and can estimate the trend of transmittance as the layer thickness changes. TiO2/Ag/TiO2 (TAgT) electrode for organic solar cells (OSCs) is then designed using numerical simulation and shows much higher Haacke figure of merit than indium tin oxide (ITO). In addition, TAgT based OSC shows better performance than ITO based OSC when compatible hole transfer layer is employed. The electrical and structural characterization of hole transfer layers (HTLs) in OSCs reveals MoO3 is the compatible HTL for TAgT anode. In the end, the reactive ink printed Ag film for solar cell contact application is studied by characterizing its electromigration lifetime. A percolative model is proposed and validated for predicting the resistivity and lifetime of printed Ag thin films containing porous structure.

Modular Pulsed Plasma Electric Propulsion System for Cubesats

NASA Technical Reports Server (NTRS)

Perez, Andres Dono; Gazulla, Oriol Tintore; Teel, George Lewis; Mai, Nghia; Lukas, Joseph; Haque, Sumadra; Uribe, Eddie; Keidar, Michael; Agasid, Elwood

2014-01-01

Current capabilities of CubeSats must be improved in order to perform more ambitious missions. Electric propulsion systems will play a key role due to their large specific impulse. Compared to other propulsion alternatives, their simplicity allows an easier miniaturization and manufacturing of autonomous modules into the nano and pico-satellite platform. Pulsed Plasma Thrusters (PPTs) appear as one of the most promising technologies for the near term. The utilization of solid and non-volatile propellants, their low power requirements and their proven reliability in the large scale make them great candidates for rapid implementation. The main challenges are the integration and miniaturization of all the electronic circuitry into a printed circuit board (PCB) that can satisfy the strict requirements that CubeSats present. NASA Ames and the George Washington University have demonstrated functionality and control of three discrete Micro-Cathode Arc Thrusters (CAT) using a bench top configuration that was compatible with the ARC PhoneSat Bus. This demonstration was successfully conducted in a vaccum chamber at the ARC Environmental Test Laboratory. A new effort will integrate a low power Plasma Processing Unit and two plasma thrusters onto a single printed circuit board that will utilize less than 13 U of Bus volume. The target design will be optimized for the accommodation into the PhoneSatEDISON Demonstration of SmallSatellite Networks (EDSN) bus as it uses the same software interface application, which was demonstrated in the previous task. This paper describes the design, integration and architecture of the proposed propulsion subsystem for a planned Technology Demonstration Mission. In addition, a general review of the Pulsed Plasma technology available for CubeSats is presented in order to assess the necessary challenges to overcome further development.

Fault Detection, Isolation and Recovery (FDIR) Portable Liquid Oxygen Hardware Demonstrator

NASA Technical Reports Server (NTRS)

Oostdyk, Rebecca L.; Perotti, Jose M.

2011-01-01

The Fault Detection, Isolation and Recovery (FDIR) hardware demonstration will highlight the effort being conducted by Constellation's Ground Operations (GO) to provide the Launch Control System (LCS) with system-level health management during vehicle processing and countdown activities. A proof-of-concept demonstration of the FDIR prototype established the capability of the software to provide real-time fault detection and isolation using generated Liquid Hydrogen data. The FDIR portable testbed unit (presented here) aims to enhance FDIR by providing a dynamic simulation of Constellation subsystems that feed the FDIR software live data based on Liquid Oxygen system properties. The LO2 cryogenic ground system has key properties that are analogous to the properties of an electronic circuit. The LO2 system is modeled using electrical components and an equivalent circuit is designed on a printed circuit board to simulate the live data. The portable testbed is also be equipped with data acquisition and communication hardware to relay the measurements to the FDIR application running on a PC. This portable testbed is an ideal capability to perform FDIR software testing, troubleshooting, training among others.

Cooling/grounding mount for hybrid circuits

NASA Technical Reports Server (NTRS)

Bagstad, B.; Estrada, R.; Mandel, H.

1981-01-01

Extremely short input and output connections, adequate grounding, and efficient heat removal for hybrid integrated circuits are possible with mounting. Rectangular clamp holds hybrid on printed-circuit board, in contact with heat-conductive ground plate. Clamp is attached to ground plane by bolts.

30 CFR 77.500 - Electric power circuits and electric equipment; deenergization.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Electric power circuits and electric equipment... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.500 Electric power circuits and electric equipment; deenergization. Power circuits and electric equipment shall be deenergized before work is done on...

30 CFR 77.500 - Electric power circuits and electric equipment; deenergization.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Electric power circuits and electric equipment... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.500 Electric power circuits and electric equipment; deenergization. Power circuits and electric equipment shall be deenergized before work is done on...

30 CFR 77.500 - Electric power circuits and electric equipment; deenergization.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Electric power circuits and electric equipment... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.500 Electric power circuits and electric equipment; deenergization. Power circuits and electric equipment shall be deenergized before work is done on...

30 CFR 77.500 - Electric power circuits and electric equipment; deenergization.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Electric power circuits and electric equipment... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.500 Electric power circuits and electric equipment; deenergization. Power circuits and electric equipment shall be deenergized before work is done on...

30 CFR 77.500 - Electric power circuits and electric equipment; deenergization.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Electric power circuits and electric equipment... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.500 Electric power circuits and electric equipment; deenergization. Power circuits and electric equipment shall be deenergized before work is done on...

Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor

PubMed Central

Szałatkiewicz, Jakub

2016-01-01

This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass. PMID:28773804

Metals Recovery from Artificial Ore in Case of Printed Circuit Boards, Using Plasmatron Plasma Reactor.

PubMed

Szałatkiewicz, Jakub

2016-08-10

This paper presents the investigation of metals production form artificial ore, which consists of printed circuit board (PCB) waste, processed in plasmatron plasma reactor. A test setup was designed and built that enabled research of plasma processing of PCB waste of more than 700 kg/day scale. The designed plasma process is presented and discussed. The process in tests consumed 2 kWh/kg of processed waste. Investigation of the process products is presented with their elemental analyses of metals and slag. The average recovery of metals in presented experiments is 76%. Metals recovered include: Ag, Au, Pd, Cu, Sn, Pb, and others. The chosen process parameters are presented: energy consumption, throughput, process temperatures, and air consumption. Presented technology allows processing of variable and hard-to-process printed circuit board waste that can reach up to 100% of the input mass.

Nanowire surface fastener fabrication on flexible substrate.

PubMed

Toku, Yuhki; Uchida, Keita; Morita, Yasuyuki; Ju, Yang

2018-07-27

The market for wearable devices has increased considerably in recent years. In response to this demand, flexible electronic circuit technology has become more important. The conventional bonding technology in electronic assembly depends on high-temperature processes such as reflow soldering, which result in undesired thermal damages and residual stress at a bonding interface. In addition, it exhibits poor compatibility with bendable or stretchable device applications. Therefore, there is an urgent requirement to attach electronic parts on printed circuit boards with good mechanical and electrical properties at room temperature. Nanowire surface fasteners (NSFs) are candidates for resolving these problems. This paper describes the fabrication of an NSF on a flexible substrate, which can be used for room temperature conductive bonding. The template method is used for preparing high-density nanowire arrays. A Cu thin film is layered on the template as the flexible substrate. After etching the template, a Cu NSF is obtained on the Cu film substrate. In addition, the electrical and mechanical properties of the Cu NSF are studied under various fabrication conditions. The Cu NSF exhibits high shear adhesion strength (∼234 N cm -2 ) and low contact resistivity (2.2 × 10 -4 Ω cm 2 ).

Nanowire surface fastener fabrication on flexible substrate

NASA Astrophysics Data System (ADS)

Toku, Yuhki; Uchida, Keita; Morita, Yasuyuki; Ju, Yang

2018-07-01

The market for wearable devices has increased considerably in recent years. In response to this demand, flexible electronic circuit technology has become more important. The conventional bonding technology in electronic assembly depends on high-temperature processes such as reflow soldering, which result in undesired thermal damages and residual stress at a bonding interface. In addition, it exhibits poor compatibility with bendable or stretchable device applications. Therefore, there is an urgent requirement to attach electronic parts on printed circuit boards with good mechanical and electrical properties at room temperature. Nanowire surface fasteners (NSFs) are candidates for resolving these problems. This paper describes the fabrication of an NSF on a flexible substrate, which can be used for room temperature conductive bonding. The template method is used for preparing high-density nanowire arrays. A Cu thin film is layered on the template as the flexible substrate. After etching the template, a Cu NSF is obtained on the Cu film substrate. In addition, the electrical and mechanical properties of the Cu NSF are studied under various fabrication conditions. The Cu NSF exhibits high shear adhesion strength (∼234 N cm‑2) and low contact resistivity (2.2 × 10‑4 Ω cm2).

Packaging Of Control Circuits In A Robot Arm

NASA Technical Reports Server (NTRS)

Kast, William

1994-01-01

Packaging system houses and connects control circuitry mounted on circuit boards within shoulder, upper section, and lower section of seven-degree-of-freedom robot arm. Has modular design that incorporates surface-mount technology, multilayer circuit boards, large-scale integrated circuits, and multi-layer flat cables between sections for compactness. Three sections of robot arm contain circuit modules in form of stardardized circuit boards. Each module contains two printed-circuit cards, one of each face.

29 CFR 1915.181 - Electrical circuits and distribution boards.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 29 Labor 7 2010-07-01 2010-07-01 false Electrical circuits and distribution boards. 1915.181... Electrical Machinery § 1915.181 Electrical circuits and distribution boards. (a) The provisions of this... employee is permitted to work on an electrical circuit, except when the circuit must remain energized for...

Personal electronics printing via tapping mode composite liquid metal ink delivery and adhesion mechanism

NASA Astrophysics Data System (ADS)

Zheng, Yi; He, Zhi-Zhu; Yang, Jun; Liu, Jing

2014-04-01

Printed electronics is becoming increasingly important in a variety of newly emerging areas. However, restricted to the rather limited conductive inks and available printing strategies, the current electronics manufacture is usually confined to industry level. Here, we show a highly cost-effective and entirely automatic printing way towards personal electronics making, through introducing a tapping-mode composite fluid delivery system. Fundamental mechanisms regarding the reliable printing, transfer and adhesion of the liquid metal inks on the substrate were disclosed through systematic theoretical interpretation and experimental measurements. With this liquid metal printer, a series of representative electronic patterns spanning from single wires to desired complex configurations such as integrated circuit (IC), printed-circuits-on-board (PCB), electronic paintings, or more do-it-yourself (DIY) devices, were demonstrated to be printed out with high precision in a moment. And the total machine cost already reached personally affordable price. This is hard to achieve by a conventional PCB technology which generally takes long time and is material, water and energy consuming, while the existing printed electronics is still far away from the real direct printing goal. The present work opens the way for large scale personal electronics manufacture and is expected to generate important value for the coming society.

Personal electronics printing via tapping mode composite liquid metal ink delivery and adhesion mechanism.

PubMed

Zheng, Yi; He, Zhi-Zhu; Yang, Jun; Liu, Jing

2014-04-04

Printed electronics is becoming increasingly important in a variety of newly emerging areas. However, restricted to the rather limited conductive inks and available printing strategies, the current electronics manufacture is usually confined to industry level. Here, we show a highly cost-effective and entirely automatic printing way towards personal electronics making, through introducing a tapping-mode composite fluid delivery system. Fundamental mechanisms regarding the reliable printing, transfer and adhesion of the liquid metal inks on the substrate were disclosed through systematic theoretical interpretation and experimental measurements. With this liquid metal printer, a series of representative electronic patterns spanning from single wires to desired complex configurations such as integrated circuit (IC), printed-circuits-on-board (PCB), electronic paintings, or more do-it-yourself (DIY) devices, were demonstrated to be printed out with high precision in a moment. And the total machine cost already reached personally affordable price. This is hard to achieve by a conventional PCB technology which generally takes long time and is material, water and energy consuming, while the existing printed electronics is still far away from the real direct printing goal. The present work opens the way for large scale personal electronics manufacture and is expected to generate important value for the coming society.

Personal electronics printing via tapping mode composite liquid metal ink delivery and adhesion mechanism

PubMed Central

Zheng, Yi; He, Zhi-Zhu; Yang, Jun; Liu, Jing

2014-01-01

Printed electronics is becoming increasingly important in a variety of newly emerging areas. However, restricted to the rather limited conductive inks and available printing strategies, the current electronics manufacture is usually confined to industry level. Here, we show a highly cost-effective and entirely automatic printing way towards personal electronics making, through introducing a tapping-mode composite fluid delivery system. Fundamental mechanisms regarding the reliable printing, transfer and adhesion of the liquid metal inks on the substrate were disclosed through systematic theoretical interpretation and experimental measurements. With this liquid metal printer, a series of representative electronic patterns spanning from single wires to desired complex configurations such as integrated circuit (IC), printed-circuits-on-board (PCB), electronic paintings, or more do-it-yourself (DIY) devices, were demonstrated to be printed out with high precision in a moment. And the total machine cost already reached personally affordable price. This is hard to achieve by a conventional PCB technology which generally takes long time and is material, water and energy consuming, while the existing printed electronics is still far away from the real direct printing goal. The present work opens the way for large scale personal electronics manufacture and is expected to generate important value for the coming society. PMID:24699375

Optoelectronic Mounting Structure

DOEpatents

Anderson, Gene R.; Armendariz, Marcelino G.; Baca, Johnny R. F.; Bryan, Robert P.; Carson, Richard F.; Chu, Dahwey; Duckett, III, Edwin B.; McCormick, Frederick B.; Peterson, David W.; Peterson, Gary D.; Reber, Cathleen A.; Reysen, Bill H.

2004-10-05

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

Evaluation of test equipment for the detection of contamination on electronic circuits

NASA Astrophysics Data System (ADS)

Bergendahl, C. G.; Dunn, B. D.

1984-08-01

The reproducibility, sensitivity and ease of operation of test equipment for the detection of ionizable contaminants on the surface of printed circuit assemblies were assessed. The characteristics of the test equipment are described. Soldering fluxes were chosen as contaminants and were applied in controlled amounts to printed-circuit board assemblies possessing two different component populations. Results show that the relationship between equipment readings varies with flux type. Each kind of test equipment gives a good measure of board cleanliness, although reservations exist concerning the interpretation of such results. A test method for the analysis of total (organic and inorganic) halides in solder fluxes is presented.

Effect of Ground Layer Patterns with Slits on Conducted Noise Currents from Printed Circuit Board

NASA Astrophysics Data System (ADS)

Maeno, Tsuyoshi; Unou, Takanori; Ichikawa, Kouji; Fujiwara, Osamu

Electromagnetic disturbances for vehicle-mounted radios can be caused by conducted noise currents that flows out from electronic equipment for vehicles to wire-harnesses. In this paper, for reducing the conducted noise currents from electronic equipment for vehicles, we made a simulation and experiment on how ground patterns affect the noise currents from three-layer printed circuit boards (PCBs) with slit-types and plane-type ground patterns. As a result, we could confirm that slits on a ground pattern allow conducted noise currents to flow out from PCBs to wire-harnesses. For the PCBs with plane-type ground and one of three slit-type patterns, on the other hand, both the simulation and examination showed that resonance phenomena occur at unexpected low-frequencies. A circuit analysis revealed that the above phenomena can be caused by the imbalance of a bridge circuit consisting of the trace circuits on the PCB.

Comparative analysis of single-walled and multi-walled carbon nanotubes for electrochemical sensing of glucose on gold printed circuit boards.

PubMed

Alhans, Ruby; Singh, Anukriti; Singhal, Chaitali; Narang, Jagriti; Wadhwa, Shikha; Mathur, Ashish

2018-09-01

In the present work, a comparative study was performed between single-walled carbon nanotubes and multi-walled carbon nanotubes coated gold printed circuit board electrodes for glucose detection. Various characterization techniques were demonstrated in order to compare the modified electrodes viz. cyclic voltammetry, electrochemical impedance spectroscopy and chrono-amperometry. Results revealed that single-walled carbon nanotubes outperformed multi-walled carbon nanotubes and proved to be a better sensing interface for glucose detection. The single-walled carbon nanotubes coated gold printed circuit board electrodes showed a wide linear sensing range (1 mM to 100 mM) with detection limit of 0.1 mM with response time of 5 s while multi-walled carbon nanotubes coated printed circuit board gold electrodes showed linear sensing range (1 mM to 100 mM) with detection limit of 0.1 mM with response time of 5 s. This work provided low cost sensors with enhanced sensitivity, fast response time and reliable results for glucose detection which increased the affordability of such tests in remote areas. In addition, the comparative results confirmed that single-walled carbon nanotubes modified electrodes can be exploited for better amplification signal as compared to multi-walled carbon nanotubes. Copyright © 2018. Published by Elsevier B.V.

30 CFR 77.501 - Electric distribution circuits and equipment; repair.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Electric distribution circuits and equipment... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.501 Electric distribution circuits and equipment; repair. No electrical work shall be performed on electric distribution circuits or equipment...

Sorting of large-diameter semiconducting carbon nanotube and printed flexible driving circuit for organic light emitting diode (OLED)

NASA Astrophysics Data System (ADS)

Xu, Wenya; Zhao, Jianwen; Qian, Long; Han, Xianying; Wu, Liangzhuan; Wu, Weichen; Song, Minshun; Zhou, Lu; Su, Wenming; Wang, Chao; Nie, Shuhong; Cui, Zheng

2014-01-01

A novel approach was developed to sort a large-diameter semiconducting single-walled carbon nanotube (sc-SWCNT) based on copolyfluorene derivative with high yield. High purity sc-SWCNTs inks were obtained by wrapping arc-discharge SWCNTs with poly[2,7-(9,9-dioctylfluorene)-alt-4,7-bis(thiophen-2-yl)benzo-2,1,3-thiadiazole] (PFO-DBT) aided by sonication and centrifugation in tetrahydrofuran (THF). The sorted sc-SWCNT inks and nanosilver inks were used to print top-gated thin-film transistors (TFTs) on flexible substrates with an aerosol jet printer. The printed TFTs demonstrated low operating voltage, small hysteresis, high on-state current (up to 10-3 A), high mobility and on-off ratio. An organic light emitting diode (OLED) driving circuit was constructed based on the printed TFTs, which exhibited high on-off ratio up to 104 and output current up to 3.5 × 10-4 A at Vscan = -4.5 V and Vdd = 0.8 V. A single OLED was switched on with the driving circuit, showing the potential as backplanes for active matrix OLED applications.A novel approach was developed to sort a large-diameter semiconducting single-walled carbon nanotube (sc-SWCNT) based on copolyfluorene derivative with high yield. High purity sc-SWCNTs inks were obtained by wrapping arc-discharge SWCNTs with poly[2,7-(9,9-dioctylfluorene)-alt-4,7-bis(thiophen-2-yl)benzo-2,1,3-thiadiazole] (PFO-DBT) aided by sonication and centrifugation in tetrahydrofuran (THF). The sorted sc-SWCNT inks and nanosilver inks were used to print top-gated thin-film transistors (TFTs) on flexible substrates with an aerosol jet printer. The printed TFTs demonstrated low operating voltage, small hysteresis, high on-state current (up to 10-3 A), high mobility and on-off ratio. An organic light emitting diode (OLED) driving circuit was constructed based on the printed TFTs, which exhibited high on-off ratio up to 104 and output current up to 3.5 × 10-4 A at Vscan = -4.5 V and Vdd = 0.8 V. A single OLED was switched on with the driving circuit, showing the potential as backplanes for active matrix OLED applications. Electronic supplementary information (ESI) available. See DOI: 10.1039/c3nr04870e

Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

NASA Astrophysics Data System (ADS)

Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

2016-09-01

Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

Chemical and biological processes for multi-metal extraction from waste printed circuit boards of computers and mobile phones.

PubMed

Shah, Monal B; Tipre, Devayani R; Dave, Shailesh R

2014-11-01

E-waste printed circuit boards (PCB) of computers, mobile-phones, televisions, LX (LongXiang) PCB in LED lights and bulbs, and tube-lights were crushed to ≥250 µm particle size and 16 different metals were analysed. A comparative study has been carried out to evaluate the extraction of Cu-Zn-Ni from computer printed circuit boards (c-PCB) and mobile-phone printed circuit boards (m-PCB) by chemical and biological methods. Chemical process showed the extraction of Cu-Zn-Ni by ferric sulphate was best among the studied chemical lixiviants. Bioleaching experiments were carried out with the iron oxidising consortium, which showed that when E-waste and inoculum were added simultaneously in the medium (one-step process); 60.33% and 87.50% Cu, 75.67% and 85.67% Zn and 71.09% and 81.87% Ni were extracted from 10 g L(-1) of c-PCB and m-PCB, respectively, within 10-15 days of reaction time. Whereas, E-waste added after the complete oxidation of Fe(2+) to Fe(3+) iron containing medium (two-step process) showed 85.26% and 99.99% Cu, 96.75% and 99.49% Zn and 93.23% and 84.21% Ni extraction from c-PCB and m-PCB, respectively, only in 6-8 days. Influence of varying biogenerated Fe(3+) and c-PCB concentrations showed that 16.5 g L(-1) of Fe(3+) iron was optimum up to 100 g L(-1) of c-PCB. Changes in pH, acid consumed and redox potential during the process were also studied. The present study shows the ability of an eco-friendly process for the recovery of multi-metals from E-waste even at 100 g L(-1) printed circuit boards concentration. © The Author(s) 2014.

Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution

NASA Astrophysics Data System (ADS)

Oh, SeKwon; Kim, YoungJun; Jung, KiMin; Park, MiSeok; Shon, MinYoung; Kwon, HyukSang

2018-01-01

During etching treatments of printed circuit board (PCB) with ammnioa solution, galvanic corrosion occurs between electrically connected gold and copper, and resulting in unexpected over-etching problems. Herein, we determine corrosion of galvanic coupled Cu to Au quantitatively in ammonia solutions, and evaluate factors influencing corrosion of galvanic coupled Cu to Au (i.e., area ratio of anode to cathode and stirring speed). The difference of the corrosion rate (Δi = icouple, (Cu-Au)-icorr, Cu) of Cu connected to Au (117 μA/cm2) and of single Cu (86 μA/cm2) infers the amount of over-etching of Cu resulting from galvanic corrosion in ammonia solution (Δi = 0.31 μA/cm2). As the stirring speed increases from 0 to 400 rpm, the corrosion rate of galvanic coupled Cu to Au increases from 36 to 191 μA/cm2. Furthermore, we confirm that an increase in the area ratio (Au/Cu) from 0.5 to 25 results in a higher rate of corrosion of Cu connected to Au. The corrosion rate of galvanic coupled Cu to Au is approximately 20 times higher when the area ratio of Au to Cu is 25 (1360 μA/cm2) than when the ratio is 0.5 (67 μA/cm2).

Printed Circuit Board Surface Finish and Effects of Chloride Contamination, Electric Field, and Humidity on Corrosion Reliability

NASA Astrophysics Data System (ADS)

Conseil-Gudla, Hélène; Jellesen, Morten S.; Ambat, Rajan

2017-02-01

Corrosion reliability is a serious issue today for electronic devices, components, and printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices which can lead to process-related residues, and global usage effects such as bias voltage and unpredictable user environments. The investigation reported in this paper focuses on understanding the synergistic effect of such parameters, namely contamination, humidity, PCB surface finish, pitch distance, and potential bias on leakage current under different humidity levels, and electrochemical migration probability under condensing conditions. Leakage currents were measured on interdigitated comb test patterns with three different types of surface finish typically used in the electronics industry, namely gold, copper, and tin. Susceptibility to electrochemical migration was studied under droplet conditions. The level of base leakage current (BLC) was similar for the different surface finishes and NaCl contamination levels up to relative humidity (RH) of 65%. A significant increase in leakage current was found for comb patterns contaminated with NaCl above 70% to 75% RH, close to the deliquescent RH of NaCl. Droplet tests on Cu comb patterns with varying pitch size showed that the initial BLC before dendrite formation increased with increasing NaCl contamination level, whereas electrochemical migration and the frequency of dendrite formation increased with bias voltage. The effect of different surface finishes on leakage current under humid conditions was not very prominent.

Screen printed passive components for flexible power electronics

NASA Astrophysics Data System (ADS)

Ostfeld, Aminy E.; Deckman, Igal; Gaikwad, Abhinav M.; Lochner, Claire M.; Arias, Ana C.

2015-10-01

Additive and low-temperature printing processes enable the integration of diverse electronic devices, both power-supplying and power-consuming, on flexible substrates at low cost. Production of a complete electronic system from these devices, however, often requires power electronics to convert between the various operating voltages of the devices. Passive components—inductors, capacitors, and resistors—perform functions such as filtering, short-term energy storage, and voltage measurement, which are vital in power electronics and many other applications. In this paper, we present screen-printed inductors, capacitors, resistors and an RLC circuit on flexible plastic substrates, and report on the design process for minimization of inductor series resistance that enables their use in power electronics. Printed inductors and resistors are then incorporated into a step-up voltage regulator circuit. Organic light-emitting diodes and a flexible lithium ion battery are fabricated and the voltage regulator is used to power the diodes from the battery, demonstrating the potential of printed passive components to replace conventional surface-mount components in a DC-DC converter application.

Screen printed passive components for flexible power electronics

PubMed Central

Ostfeld, Aminy E.; Deckman, Igal; Gaikwad, Abhinav M.; Lochner, Claire M.; Arias, Ana C.

2015-01-01

Additive and low-temperature printing processes enable the integration of diverse electronic devices, both power-supplying and power-consuming, on flexible substrates at low cost. Production of a complete electronic system from these devices, however, often requires power electronics to convert between the various operating voltages of the devices. Passive components—inductors, capacitors, and resistors—perform functions such as filtering, short-term energy storage, and voltage measurement, which are vital in power electronics and many other applications. In this paper, we present screen-printed inductors, capacitors, resistors and an RLC circuit on flexible plastic substrates, and report on the design process for minimization of inductor series resistance that enables their use in power electronics. Printed inductors and resistors are then incorporated into a step-up voltage regulator circuit. Organic light-emitting diodes and a flexible lithium ion battery are fabricated and the voltage regulator is used to power the diodes from the battery, demonstrating the potential of printed passive components to replace conventional surface-mount components in a DC-DC converter application. PMID:26514331

Behaviour of one-step spray-coated carbon nanotube supercapacitor in ambient light harvester circuit with printed organic solar cell and electrochromic display

PubMed Central

Tuukkanen, Sampo; Välimäki, Marja; Lehtimäki, Suvi; Vuorinen, Tiina; Lupo, Donald

2016-01-01

A printed energy harvesting and storage circuit powered by ambient office lighting and its use to power a printed display is reported. The autonomous device is composed of three printed electronic components: an organic photovoltaic module, a carbon-nanotubes-only supercapacitor and an electrochromic display element. Components are fabricated from safe and environmentally friendly materials, and have been fabricated using solution processing methods, which translate into low-cost and high-throughput manufacturing. A supercapacitor made of spray-coated carbon nanotube based ink and aqueous NaCl electrolyte was charged using a printed organic photovoltaic module exposed to office lighting conditions. The supercapacitor charging rate, self-discharge rate and display operation were studied in detail. The supercapacitor self-discharge rate was found to depend on the charging rate. The fully charged supercapacitor was used as a power source to run the electrochromic display over 50 times. PMID:26957019

Screen printed passive components for flexible power electronics.

PubMed

Ostfeld, Aminy E; Deckman, Igal; Gaikwad, Abhinav M; Lochner, Claire M; Arias, Ana C

2015-10-30

Additive and low-temperature printing processes enable the integration of diverse electronic devices, both power-supplying and power-consuming, on flexible substrates at low cost. Production of a complete electronic system from these devices, however, often requires power electronics to convert between the various operating voltages of the devices. Passive components-inductors, capacitors, and resistors-perform functions such as filtering, short-term energy storage, and voltage measurement, which are vital in power electronics and many other applications. In this paper, we present screen-printed inductors, capacitors, resistors and an RLC circuit on flexible plastic substrates, and report on the design process for minimization of inductor series resistance that enables their use in power electronics. Printed inductors and resistors are then incorporated into a step-up voltage regulator circuit. Organic light-emitting diodes and a flexible lithium ion battery are fabricated and the voltage regulator is used to power the diodes from the battery, demonstrating the potential of printed passive components to replace conventional surface-mount components in a DC-DC converter application.

30 CFR 75.518 - Electric equipment and circuits; overload and short circuit protection.

Code of Federal Regulations, 2010 CFR

2010-07-01

... short circuit protection. 75.518 Section 75.518 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION... Equipment-General § 75.518 Electric equipment and circuits; overload and short circuit protection... installed so as to protect all electric equipment and circuits against short circuit and overloads. Three...

Screen-Printed Washable Electronic Textiles as Self-Powered Touch/Gesture Tribo-Sensors for Intelligent Human-Machine Interaction.

PubMed

Cao, Ran; Pu, Xianjie; Du, Xinyu; Yang, Wei; Wang, Jiaona; Guo, Hengyu; Zhao, Shuyu; Yuan, Zuqing; Zhang, Chi; Li, Congju; Wang, Zhong Lin

2018-05-22

Multifunctional electronic textiles (E-textiles) with embedded electric circuits hold great application prospects for future wearable electronics. However, most E-textiles still have critical challenges, including air permeability, satisfactory washability, and mass fabrication. In this work, we fabricate a washable E-textile that addresses all of the concerns and shows its application as a self-powered triboelectric gesture textile for intelligent human-machine interfacing. Utilizing conductive carbon nanotubes (CNTs) and screen-printing technology, this kind of E-textile embraces high conductivity (0.2 kΩ/sq), high air permeability (88.2 mm/s), and can be manufactured on common fabric at large scales. Due to the advantage of the interaction between the CNTs and the fabrics, the electrode shows excellent stability under harsh mechanical deformation and even after being washed. Moreover, based on a single-electrode mode triboelectric nanogenerator and electrode pattern design, our E-textile exhibits highly sensitive touch/gesture sensing performance and has potential applications for human-machine interfacing.

The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology.

PubMed

Kang, Sung-Won; Choi, Hyeob; Park, Hyung-Il; Choi, Byoung-Gun; Im, Hyobin; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung; Roh, Jung-Sim

2017-11-07

Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable "smart wear" for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study.

Electrically-driven GHz range ultrafast graphene light emitter (Conference Presentation)

NASA Astrophysics Data System (ADS)

Kim, Youngduck; Gao, Yuanda; Shiue, Ren-Jye; Wang, Lei; Aslan, Ozgur Burak; Kim, Hyungsik; Nemilentsau, Andrei M.; Low, Tony; Taniguchi, Takashi; Watanabe, Kenji; Bae, Myung-Ho; Heinz, Tony F.; Englund, Dirk R.; Hone, James

2017-02-01

Ultrafast electrically driven light emitter is a critical component in the development of the high bandwidth free-space and on-chip optical communications. Traditional semiconductor based light sources for integration to photonic platform have therefore been heavily studied over the past decades. However, there are still challenges such as absence of monolithic on-chip light sources with high bandwidth density, large-scale integration, low-cost, small foot print, and complementary metal-oxide-semiconductor (CMOS) technology compatibility. Here, we demonstrate the first electrically driven ultrafast graphene light emitter that operate up to 10 GHz bandwidth and broadband range (400 1600 nm), which are possible due to the strong coupling of charge carriers in graphene and surface optical phonons in hBN allow the ultrafast energy and heat transfer. In addition, incorporation of atomically thin hexagonal boron nitride (hBN) encapsulation layers enable the stable and practical high performance even under the ambient condition. Therefore, electrically driven ultrafast graphene light emitters paves the way towards the realization of ultrahigh bandwidth density photonic integrated circuits and efficient optical communications networks.

Reducing Printed Circuit Board Emissions with Low-Noise Design Practices

NASA Technical Reports Server (NTRS)

Bradley, Arthur T.; Fowler, Jennifer; Yavoich, Brian J.; Jennings, Stephen A.

2012-01-01

This paper presents the results of an experiment designed to determine the effectiveness of adopting several low-noise printed circuit board (PCB) design practices. Two boards were designed and fabricated, each consisting of identical mixed signal circuitry. Several important differences were introduced between the board layouts: one board was constructed using recommended low-noise practices and the other constructed without such attention. The emissions from the two boards were then measured and compared, demonstrating an improvement in radiated emissions of up to 22 dB.

Adult Competency Education Kit. Basic Skills in Speaking, Math, and Reading for Employment. Part P: ACE Competency Based Job Descriptions: #77--Secretary; #78--Keypunch Operator; Assembly Worker Core Job Description; #82--Electronics Assembler; #83--Printed Circuit Assembler; #84--Micro Electronics Assembler; #85--Chassis Assembler; #87--Machinist Apprentice.

ERIC Educational Resources Information Center

San Mateo County Office of Education, Redwood City, CA. Career Preparation Centers.

This thirteenth of fifteen sets of Adult Competency Education (ACE) Competency Based Job Descriptions in the ACE kit contains job descriptions for Secretary, Keypunch Operator, Electronics Assembler, Printed Circuit Assembler, Micro Electronincs Assembler, Chassis Assembler, and Machinist Apprentice. Each begins with a fact sheet that includes…

Sorting of large-diameter semiconducting carbon nanotube and printed flexible driving circuit for organic light emitting diode (OLED).

PubMed

Xu, Wenya; Zhao, Jianwen; Qian, Long; Han, Xianying; Wu, Liangzhuan; Wu, Weichen; Song, Minshun; Zhou, Lu; Su, Wenming; Wang, Chao; Nie, Shuhong; Cui, Zheng

2014-01-01

A novel approach was developed to sort a large-diameter semiconducting single-walled carbon nanotube (sc-SWCNT) based on copolyfluorene derivative with high yield. High purity sc-SWCNTs inks were obtained by wrapping arc-discharge SWCNTs with poly[2,7-(9,9-dioctylfluorene)-alt-4,7-bis(thiophen-2-yl)benzo-2,1,3-thiadiazole] (PFO-DBT) aided by sonication and centrifugation in tetrahydrofuran (THF). The sorted sc-SWCNT inks and nanosilver inks were used to print top-gated thin-film transistors (TFTs) on flexible substrates with an aerosol jet printer. The printed TFTs demonstrated low operating voltage, small hysteresis, high on-state current (up to 10(-3) A), high mobility and on-off ratio. An organic light emitting diode (OLED) driving circuit was constructed based on the printed TFTs, which exhibited high on-off ratio up to 10(4) and output current up to 3.5 × 10(-4) A at V(scan) = -4.5 V and Vdd = 0.8 V. A single OLED was switched on with the driving circuit, showing the potential as backplanes for active matrix OLED applications.

Modular chassis simplifies packaging and interconnecting of circuit boards

NASA Technical Reports Server (NTRS)

Arens, W. E.; Boline, K. G.

1964-01-01

A system of modular chassis structures has simplified the design for mounting a number of printed circuit boards. This design is structurally adaptable to computer and industrial control system applications.

Learning high-quality soldering

NASA Technical Reports Server (NTRS)

Read, W. S.

1981-01-01

Soldering techniques for high-reliability electronic equipment are taught in 5 day course at NASA's Jet Propulsion Laboratory. Topic covered include new circuit assembly, printed-wiring board reworking, circuit changes, wire routing, and component installation.

Effect of a Diagram on Primary Students' Understanding About Electric Circuits

NASA Astrophysics Data System (ADS)

Preston, Christine Margaret

2017-09-01

This article reports on the effect of using a diagram to develop primary students' conceptual understanding about electric circuits. Diagrammatic representations of electric circuits are used for teaching and assessment despite the absence of research on their pedagogical effectiveness with young learners. Individual interviews were used to closely analyse Years 3 and 5 (8-11-year-old) students' explanations about electric circuits. Data was collected from 20 students in the same school providing pre-, post- and delayed post-test dialogue. Students' thinking about electric circuits and changes in their explanations provide insights into the role of diagrams in understanding science concepts. Findings indicate that diagram interaction positively enhanced understanding, challenged non-scientific views and promoted scientific models of electric circuits. Differences in students' understanding about electric circuits were influenced by prior knowledge, meta-conceptual awareness and diagram conventions including a stylistic feature of the diagram used. A significant finding that students' conceptual models of electric circuits were energy rather than current based has implications for electricity instruction at the primary level.

Flow-enhanced solution printing of all-polymer solar cells

DOE PAGES

Diao, Ying; Zhou, Yan; Kurosawa, Tadanori; ...

2015-08-12

Morphology control of solution coated solar cell materials presents a key challenge limiting their device performance and commercial viability. Here we present a new concept for controlling phase separation during solution printing using an all-polymer bulk heterojunction solar cell as a model system. The key aspect of our method lies in the design of fluid flow using a microstructured printing blade, on the basis of the hypothesis of flow-induced polymer crystallization. Our flow design resulted in a similar to 90% increase in the donor thin film crystallinity and reduced microphase separated donor and acceptor domain sizes. The improved morphology enhancedmore » all metrics of solar cell device performance across various printing conditions, specifically leading to higher short-circuit current, fill factor, open circuit voltage and significantly reduced device-to-device variation. However, we expect our design concept to have broad applications beyond all-polymer solar cells because of its simplicity and versatility.« less

Flow-enhanced solution printing of all-polymer solar cells

PubMed Central

Diao, Ying; Zhou, Yan; Kurosawa, Tadanori; Shaw, Leo; Wang, Cheng; Park, Steve; Guo, Yikun; Reinspach, Julia A.; Gu, Kevin; Gu, Xiaodan; Tee, Benjamin C. K.; Pang, Changhyun; Yan, Hongping; Zhao, Dahui; Toney, Michael F.; Mannsfeld, Stefan C. B.; Bao, Zhenan

2015-01-01

Morphology control of solution coated solar cell materials presents a key challenge limiting their device performance and commercial viability. Here we present a new concept for controlling phase separation during solution printing using an all-polymer bulk heterojunction solar cell as a model system. The key aspect of our method lies in the design of fluid flow using a microstructured printing blade, on the basis of the hypothesis of flow-induced polymer crystallization. Our flow design resulted in a ∼90% increase in the donor thin film crystallinity and reduced microphase separated donor and acceptor domain sizes. The improved morphology enhanced all metrics of solar cell device performance across various printing conditions, specifically leading to higher short-circuit current, fill factor, open circuit voltage and significantly reduced device-to-device variation. We expect our design concept to have broad applications beyond all-polymer solar cells because of its simplicity and versatility. PMID:26264528

The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent.

PubMed

Zhu, P; Chen, Y; Wang, L Y; Zhou, M; Zhou, J

2013-02-01

Separation of waste printed circuit boards (WPCBs) has been a bottleneck in WPCBs resource processing. In this study, the separation of WPCBs was performed using dimethyl sulfoxide (DMSO) as a solvent. Various parameters, which included solid to liquid ratio, temperature, WPCB sizes, and time, were studied to understand the separation of WPCBs by dissolving bromine epoxy resin using DMSO. Experimental results showed that the concentration of dissolving the bromine epoxy resin increased with increasing various parameters. The optimum condition of complete separation of WPCBs was solid to liquid ratio of 1:7 and WPCB sizes of 16 mm(2) at 145°C for 60 min. The used DMSO was vapored under the decompression, which obtained the regenerated DMSO and dissolved bromine epoxy resin. This clean and non-polluting technology offers a new way to separate valuable materials from WPCBs and prevent the environmental pollution of waste printed circuit boards effectively. Crown Copyright © 2012. Published by Elsevier Ltd. All rights reserved.

Electric Vehicle Interaction at the Electrical Circuit Level

DOT National Transportation Integrated Search

2018-01-01

The objective of the Electric Vehicle Interaction at the Electrical Circuit Level project was to investigate electric vehicle (EV) charging as a means of mitigating transient over-voltages (TOVs) on the circuit level electric utility distribution gri...

Color Coding of Circuit Quantities in Introductory Circuit Analysis Instruction

ERIC Educational Resources Information Center

Reisslein, Jana; Johnson, Amy M.; Reisslein, Martin

2015-01-01

Learning the analysis of electrical circuits represented by circuit diagrams is often challenging for novice students. An open research question in electrical circuit analysis instruction is whether color coding of the mathematical symbols (variables) that denote electrical quantities can improve circuit analysis learning. The present study…

The status and development of treatment techniques of typical waste electrical and electronic equipment in China: a review.

PubMed

He, Yunxia; Xu, Zhenming

2014-04-01

A large quantity of waste electrical and electronic equipment (WEEE) is being generated because technical innovation promotes the unceasing renewal of products. China's household appliances and electronic products have entered the peak of obsolescence. Due to lack of technology and equipment, recycling of WEEE is causing serious environment pollution. In order to achieve the harmless disposal and resource utilization of WEEE, researchers have performed large quantities of work, and some demonstration projects have been built recently. In this paper, the treatment techniques of typical WEEE components, including printed circuit boards, refrigerator cabinets, toner cartridges, cathode ray tubes, liquid crystal display panels, batteries (Ni-Cd and Li-ion), hard disk drives, and wires are reviewed. An integrated recycling system with environmentally friendly and highly efficient techniques for processing WEEE is proposed. The orientation of further development for WEEE recycling is also proposed.

Micropatterned stretchable circuit and strain sensor fabricated by lithography on an electrospun nanofiber mat.

PubMed

Park, Minwoo; Im, Jungkyun; Park, Jongjin; Jeong, Unyong

2013-09-11

This paper describes a novel approach for composite nanofiber mats and its application to fabricate a strain sensor. Electrospun poly(4-vinylpyridine) (P4VP) nanofiber mats are micropatterned by a lithographic approach that includes selective oxidation of the nanofibers and removal of unreacted fibers. The P4VP/HAuCl4 complex is converted to P4VP/Au composites by chemical reduction. We investigate the electrical resistivity of the composite mats according to the number of complexation-and-reduction cycles, the thickness of the fiber mats, and the annealing temperatures which control the percolation of the Au nanoparticles in the fiber mats. Nozzle printing of a polymeric solution on the patterned nanofiber mats simply produces an array of strain-sensitive and strain-invariant units. The patterns demonstrate high strain-sensing performance without any mechanical and electrical failure over 200 bending cycles in the strain range of ε<0.17.

Selective Conversion from p-Type to n-Type of Printed Bottom-Gate Carbon Nanotube Thin-Film Transistors and Application in Complementary Metal-Oxide-Semiconductor Inverters.

PubMed

Xu, Qiqi; Zhao, Jianwen; Pecunia, Vincenzo; Xu, Wenya; Zhou, Chunshan; Dou, Junyan; Gu, Weibing; Lin, Jian; Mo, Lixin; Zhao, Yanfei; Cui, Zheng

2017-04-12

The fabrication of printed high-performance and environmentally stable n-type single-walled carbon nanotube (SWCNT) transistors and their integration into complementary (i.e., complementary metal-oxide-semiconductor, CMOS) circuits are widely recognized as key to achieving the full potential of carbon nanotube electronics. Here, we report a simple, efficient, and robust method to convert the polarity of SWCNT thin-film transistors (TFTs) using cheap and readily available ethanolamine as an electron doping agent. Printed p-type bottom-gate SWCNT TFTs can be selectively converted into n-type by deposition of ethanolamine inks on the transistor active region via aerosol jet printing. Resulted n-type TFTs show excellent electrical properties with an on/off ratio of 10 6 , effective mobility up to 30 cm 2 V -1 s -1 , small hysteresis, and small subthreshold swing (90-140 mV dec -1 ), which are superior compared to the original p-type SWCNT devices. The n-type SWCNT TFTs also show good stability in air, and any deterioration of performance due to shelf storage can be fully recovered by a short low-temperature annealing. The easy polarity conversion process allows construction of CMOS circuitry. As an example, CMOS inverters were fabricated using printed p-type and n-type TFTs and exhibited a large noise margin (50 and 103% of 1/2 V dd = 1 V) and a voltage gain as high as 30 (at V dd = 1 V). Additionally, the CMOS inverters show full rail-to-rail output voltage swing and low power dissipation (0.1 μW at V dd = 1 V). The new method paves the way to construct fully functional complex CMOS circuitry by printed TFTs.

49 CFR 236.308 - Mechanical or electric locking or electric circuits; requisites.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Mechanical or electric locking or electric..., AND APPLIANCES Interlocking Standards § 236.308 Mechanical or electric locking or electric circuits; requisites. Mechanical or electric locking or electric circuits shall be installed to prevent signals from...

Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

NASA Astrophysics Data System (ADS)

Hernández, R.; Zaragoza, J. A. Barrientos; Jiménez-Pérez, J. L.; Orea, A. Cruz; Correa-Pacheco, Z. N.

2017-08-01

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV-visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

30 CFR 57.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Abandoned electric circuits. 57.4011 Section 57.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... and Control § 57.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized...

30 CFR 56.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Abandoned electric circuits. 56.4011 Section 56.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... Control § 56.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized and...

30 CFR 57.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Abandoned electric circuits. 57.4011 Section 57.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... and Control § 57.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized...

30 CFR 56.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Abandoned electric circuits. 56.4011 Section 56.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... Control § 56.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized and...

30 CFR 57.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Abandoned electric circuits. 57.4011 Section 57.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... and Control § 57.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized...

30 CFR 56.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Abandoned electric circuits. 56.4011 Section 56.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... Control § 56.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized and...

30 CFR 56.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Abandoned electric circuits. 56.4011 Section 56.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... Control § 56.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized and...

30 CFR 57.4011 - Abandoned electric circuits.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Abandoned electric circuits. 57.4011 Section 57.4011 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND NONMETAL... and Control § 57.4011 Abandoned electric circuits. Abandoned electric circuits shall be deenergized...

Front-Side Microstrip Line Feeding a Raised Antenna Patch

NASA Technical Reports Server (NTRS)

Hodges, Richard; Hoppe, Daniel

2005-01-01

An improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 ohms. The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained

Mobile Learning Based Worked Example in Electric Circuit (WEIEC) Application to Improve the High School Students' Electric Circuits Interpretation Ability

ERIC Educational Resources Information Center

Yadiannur, Mitra; Supahar

2017-01-01

This research aims to determine the feasibility and effectivity of mobile learning based Worked Example in Electric Circuits (WEIEC) application in improving the high school students' electric circuits interpretation ability on Direct Current Circuits materials. The research method used was a combination of Four-D Models and ADDIE model. The…

Non-resonant electromagnetic energy harvester for car-key applications

NASA Astrophysics Data System (ADS)

Li, X.; Hehn, T.; Thewes, M.; Kuehne, I.; Frey, A.; Scholl, G.; Manoli, Y.

2013-12-01

This paper presents a novel non-resonant electromagnetic energy harvester for application in a remote car-key, to extend the lifetime of the battery or even to realize a fully energy autonomous, maintenance-free car-key product. Characteristic for a car-key are low frequency and large amplitude motions during normal daily operation. The basic idea of this non-resonant generator is to use a round flat permanent magnet moving freely in a round flat cavity, which is packaged on both sides by printed circuit boards embedded with multi-layer copper coils. The primary goal of this structure is to easily integrate the energy harvester with the existing electrical circuit module into available commercial car-key designs. The whole size of the energy harvester is comparable to a CR2032 coin battery. To find out the best power-efficient and optimal design, several magnets with different dimensions and magnetizations, and various layouts of copper coils were analysed and built up for prototype testing. Experimental results show that with an axially magnetized NdFeB magnet and copper coils of design variant B a maximum open circuit voltage of 1.1V can be observed.

High-Throughput Fabrication of Flexible and Transparent All-Carbon Nanotube Electronics.

PubMed

Chen, Yong-Yang; Sun, Yun; Zhu, Qian-Bing; Wang, Bing-Wei; Yan, Xin; Qiu, Song; Li, Qing-Wen; Hou, Peng-Xiang; Liu, Chang; Sun, Dong-Ming; Cheng, Hui-Ming

2018-05-01

This study reports a simple and effective technique for the high-throughput fabrication of flexible all-carbon nanotube (CNT) electronics using a photosensitive dry film instead of traditional liquid photoresists. A 10 in. sized photosensitive dry film is laminated onto a flexible substrate by a roll-to-roll technology, and a 5 µm pattern resolution of the resulting CNT films is achieved for the construction of flexible and transparent all-CNT thin-film transistors (TFTs) and integrated circuits. The fabricated TFTs exhibit a desirable electrical performance including an on-off current ratio of more than 10 5 , a carrier mobility of 33 cm 2 V -1 s -1 , and a small hysteresis. The standard deviations of on-current and mobility are, respectively, 5% and 2% of the average value, demonstrating the excellent reproducibility and uniformity of the devices, which allows constructing a large noise margin inverter circuit with a voltage gain of 30. This study indicates that a photosensitive dry film is very promising for the low-cost, fast, reliable, and scalable fabrication of flexible and transparent CNT-based integrated circuits, and opens up opportunities for future high-throughput CNT-based printed electronics.

Dynamic and Tunable Threshold Voltage in Organic Electrochemical Transistors.

PubMed

Doris, Sean E; Pierre, Adrien; Street, Robert A

2018-04-01

In recent years, organic electrochemical transistors (OECTs) have found applications in chemical and biological sensing and interfacing, neuromorphic computing, digital logic, and printed electronics. However, the incorporation of OECTs in practical electronic circuits is limited by the relative lack of control over their threshold voltage, which is important for controlling the power consumption and noise margin in complementary and unipolar circuits. Here, the threshold voltage of OECTs is precisely tuned over a range of more than 1 V by chemically controlling the electrochemical potential at the gate electrode. This threshold voltage tunability is exploited to prepare inverters and amplifiers with improved noise margin and gain, respectively. By coupling the gate electrode with an electrochemical oscillator, single-transistor oscillators based on OECTs with dynamic time-varying threshold voltages are prepared. This work highlights the importance of electrochemistry at the gate electrode in determining the electrical properties of OECTs, and opens a path toward the system-level design of low-power OECT-based electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Application of lower aliphatic alcohols as reducing agents for increasing efficiency of the LCLD process

NASA Astrophysics Data System (ADS)

Semenok, Dmitrii

2014-05-01

A method is described that is promising for application metal conductors on ceramic substrates during printed-circuit boards (PCBs) production without masking plate. The main idea of laser-induced metal deposition from solution (LCLD) consists of implementation of chemical micro reactor by using a focused laser beam. In this reactor the red/ox reaction would be initiated due to heating of a reaction medium. We used a 532 nm DPSS laser (power: 2100 mW) and water solutions of organic alcohols with low molecular weight, ethanol and isopropanol as reductants. The results of deposition were studied using the SEM, EDX methods and impedance spectroscopy. The equivalent resistance-capacitance circuit of copper tracks was constructed. The experiments showed that increasing the rate of deposition of nanostructured copper tracks up to 50 μm/s with electrical resistivity 5 Ohm/cm is possible by replacing the well-known reductants such as formaldehyde and D-sorbitol with iso-propanol.

Development of high-performance printed organic field-effect transistors and integrated circuits.

PubMed

Xu, Yong; Liu, Chuan; Khim, Dongyoon; Noh, Yong-Young

2015-10-28

Organic electronics is regarded as an important branch of future microelectronics especially suited for large-area, flexible, transparent, and green devices, with their low cost being a key benefit. Organic field-effect transistors (OFETs), the primary building blocks of numerous expected applications, have been intensively studied, and considerable progress has recently been made. However, there are still a number of challenges to the realization of high-performance OFETs and integrated circuits (ICs) using printing technologies. Therefore, in this perspective article, we investigate the main issues concerning developing high-performance printed OFETs and ICs and seek strategies for further improvement. Unlike many other studies in the literature that deal with organic semiconductors (OSCs), printing technology, and device physics, our study commences with a detailed examination of OFET performance parameters (e.g., carrier mobility, threshold voltage, and contact resistance) by which the related challenges and potential solutions to performance development are inspected. While keeping this complete understanding of device performance in mind, we check the printed OFETs' components one by one and explore the possibility of performance improvement regarding device physics, material engineering, processing procedure, and printing technology. Finally, we analyze the performance of various organic ICs and discuss ways to optimize OFET characteristics and thus develop high-performance printed ICs for broad practical applications.

30 CFR 57.6402 - Deenergized circuits near detonators.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Electric Blasting-Surface and Underground § 57.6402 Deenergized circuits near detonators. Electrical distribution circuits within 50 feet of electric detonators at the blast site shall be deenergized. Such circuits need not be deenergized between 25 to 50 feet of the electric detonators if stray current tests...

30 CFR 75.509 - Electric power circuit and electric equipment; deenergization.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Electric power circuit and electric equipment... LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.509 Electric power circuit and electric equipment; deenergization. [Statutory Provisions] All...

30 CFR 75.509 - Electric power circuit and electric equipment; deenergization.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Electric power circuit and electric equipment... LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.509 Electric power circuit and electric equipment; deenergization. [Statutory Provisions] All...

30 CFR 75.509 - Electric power circuit and electric equipment; deenergization.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Electric power circuit and electric equipment... LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.509 Electric power circuit and electric equipment; deenergization. [Statutory Provisions] All...

30 CFR 75.509 - Electric power circuit and electric equipment; deenergization.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Electric power circuit and electric equipment... LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.509 Electric power circuit and electric equipment; deenergization. [Statutory Provisions] All...

30 CFR 75.509 - Electric power circuit and electric equipment; deenergization.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Electric power circuit and electric equipment... LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.509 Electric power circuit and electric equipment; deenergization. [Statutory Provisions] All...

Diesel Electrical Systems. Teacher Edition (Revised).

ERIC Educational Resources Information Center

Sprinkle, Tom; Huston, Jane, Ed.

This module is one of a series of teaching guides that cover diesel mechanics. The module contains eight instructional units that cover the following topics: (1) introduction to electrical systems; (2) electrical circuits; (3) electrical indicator circuits; (4) storage batteries; (5) starting systems and circuits; (6) ignition circuits; (7)…

Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, Richard N.; Wright, Bob W.

2008-12-01

A study directed toward the detection of halogenated solvents in the matrix of circuit boards has recently been completed. This work was undertaken to demonstrate the potential for reliable detection of solvents used during the fabrication of printed circuit boards (PCB). Since many of these solvents are now, or soon will be, restricted under the terms of legislation enacted in response to the Montreal Protocol and other international agreements, the work described here, conducted over a period of more that 4 years, has provided guidance for the development of chromatographic system and analytical protocol to assure compliance with regulations introducedmore » to control, or ban, industrial solvents associated with adverse environmental impact.« less

Printed circuit dispersive transmission line

DOEpatents

Ikezi, Hiroyuki; Lin-Liu, Yuh-Ren; DeGrassie, John S.

1991-01-01

A printed circuit dispersive transmission line structure is disclosed comprising an insulator, a ground plane formed on one surface of the insulator, a first transmission line formed on a second surface of the insulator, and a second transmission line also formed on the second surface of the insulator and of longer length than the first transmission line and periodically intersecting the first transmission line. In a preferred embodiment, the transmission line structure exhibits highly dispersive characteristics by designing the length of one of the transmission line between two adjacent periodic intersections to be longer than the other.

30 CFR 56.6402 - Deenergized circuits near detonators.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Electric Blasting § 56.6402 Deenergized circuits near detonators. Electrical distribution circuits within 50 feet of electric detonators at the blast site shall be deenergized. Such circuits need not be... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Deenergized circuits near detonators. 56.6402...

Toward printed integrated circuits based on unipolar or ambipolar polymer semiconductors.

PubMed

Baeg, Kang-Jun; Caironi, Mario; Noh, Yong-Young

2013-08-21

For at least the past ten years printed electronics has promised to revolutionize our daily life by making cost-effective electronic circuits and sensors available through mass production techniques, for their ubiquitous applications in wearable components, rollable and conformable devices, and point-of-care applications. While passive components, such as conductors, resistors and capacitors, had already been fabricated by printing techniques at industrial scale, printing processes have been struggling to meet the requirements for mass-produced electronics and optoelectronics applications despite their great potential. In the case of logic integrated circuits (ICs), which constitute the focus of this Progress Report, the main limitations have been represented by the need of suitable functional inks, mainly high-mobility printable semiconductors and low sintering temperature conducting inks, and evoluted printing tools capable of higher resolution, registration and uniformity than needed in the conventional graphic arts printing sector. Solution-processable polymeric semiconductors are the best candidates to fulfill the requirements for printed logic ICs on flexible substrates, due to their superior processability, ease of tuning of their rheology parameters, and mechanical properties. One of the strongest limitations has been mainly represented by the low charge carrier mobility (μ) achievable with polymeric, organic field-effect transistors (OFETs). However, recently unprecedented values of μ ∼ 10 cm(2) /Vs have been achieved with solution-processed polymer based OFETs, a value competing with mobilities reported in organic single-crystals and exceeding the performances enabled by amorphous silicon (a-Si). Interestingly these values were achieved thanks to the design and synthesis of donor-acceptor copolymers, showing limited degree of order when processed in thin films and therefore fostering further studies on the reason leading to such improved charge transport properties. Among this class of materials, various polymers can show well balanced electrons and holes mobility, therefore being indicated as ambipolar semiconductors, good environmental stability, and a small band-gap, which simplifies the tuning of charge injection. This opened up the possibility of taking advantage of the superior performances offered by complementary "CMOS-like" logic for the design of digital ICs, easing the scaling down of critical geometrical features, and achieving higher complexity from robust single gates (e.g., inverters) and test circuits (e.g., ring oscillators) to more complete circuits. Here, we review the recent progress in the development of printed ICs based on polymeric semiconductors suitable for large-volume micro- and nano-electronics applications. Particular attention is paid to the strategies proposed in the literature to design and synthesize high mobility polymers and to develop suitable printing tools and techniques to allow for improved patterning capability required for the down-scaling of devices in order to achieve the operation frequencies needed for applications, such as flexible radio-frequency identification (RFID) tags, near-field communication (NFC) devices, ambient electronics, and portable flexible displays. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

General technique for the integration of MIC/MMIC'S with waveguides

NASA Technical Reports Server (NTRS)

Geller, Bernard D. (Inventor); Zaghloul, Amir I. (Inventor)

1987-01-01

A technique for packaging and integrating of a microwave integrated circuit (MIC) or monolithic microwave integrated circuit (MMIC) with a waveguide uses a printed conductive circuit pattern on a dielectric substrate to transform impedance and mode of propagation between the MIC/MMIC and the waveguide. The virtually coplanar circuit pattern lies on an equipotential surface within the waveguide and therefore makes possible single or dual polarized mode structures.

3D printed electromagnetic transmission and electronic structures fabricated on a single platform using advanced process integration techniques

NASA Astrophysics Data System (ADS)

Deffenbaugh, Paul Issac

3D printing has garnered immense attention from many fields including in-office rapid prototyping of mechanical parts, outer-space satellite replication, garage functional firearm manufacture, and NASA rocket engine component fabrication. 3D printing allows increased design flexibility in the fabrication of electronics, microwave circuits and wireless antennas and has reached a level of maturity which allows functional parts to be printed. Much more work is necessary in order to perfect the processes of 3D printed electronics especially in the area of automation. Chapter 1 shows several finished prototypes of 3D printed electronics as well as newly developed techniques in fabrication. Little is known about the RF and microwave properties and applications of the standard materials which have been developed for 3D printing. Measurement of a wide variety of materials over a broad spectrum of frequencies up to 10 GHz using a variety of well-established measurement methods is performed throughout chapter 2. Several types of high frequency RF transmission lines are fabricated and valuable model-matched data is gathered and provided in chapter 3 for future designers' use. Of particular note is a fully 3D printed stripline which was automatically fabricated in one process on one machine. Some core advantages of 3D printing RF/microwave components include rapid manufacturing of complex, dimensionally sensitive circuits (such as antennas and filters which are often iteratively tuned) and the ability to create new devices that cannot be made using standard fabrication techniques. Chapter 4 describes an exemplary fully 3D printed curved inverted-F antenna.

Fabrication of Bendable Circuits on a Polydimethylsiloxane (PDMS) Surface by Inkjet Printing Semi-Wrapped Structures

PubMed Central

Sun, Jiazhen; Jiang, Jieke; Bao, Bin; Wang, Si; He, Min; Zhang, Xingye; Song, Yanlin

2016-01-01

In this work, an effective method was developed to fabricate bendable circuits on a polydimethylsiloxane (PDMS) surface by inkjet printing semi-wrapped structures. It is demonstrated that the precured PDMS liquid film could influence the depositing morphology of coalesced silver precursor inkjet droplets. Accordingly, continuous and uniform lines with a semi-wrapped structure were fabricated on the PDMS surface. When the printed silver precursor was reduced to Ag nanoparticles, the fabricated conductive film exhibited good transparency and high bendability. This work presented a facile way to fabricate flexible patterns on a PDMS surface without any complicated modification or special equipment. Meanwhile, an in situ hydrazine reduction of Ag has been reported using the vapor phase method in the fabricating process. PMID:28773374

Surface Flashover on Epoxy-Resin Printed Circuit Boards in Vacuum under Electron Irradiation

NASA Astrophysics Data System (ADS)

Fujii, Haruhisa; Hasegawa, Taketoshi; Osuga, Hiroyuki; Matsui, Katsuaki

This paper deals with the surface flashover characteristics of dielectric material in vacuum during electron beam irradiation in order to design adequately the conductive patterns on printed circuit boards used inside a spacecraft. The dielectric material, glass-fiber reinforced epoxy resin, and the electrodes printed on it were irradiated with electrons of the energy of 3-10 keV. DC high voltage was applied between the two electrodes during electron irradiation. The voltage was increased stepwise until the surface flashover occurred on the dielectric material. We obtained the results that the surface flashover voltage increased with the insulation distance between the electrodes but electron irradiation made the flashover voltage lower. The flashover voltage characteristics were obtained as parameters of the electrode distance and the energy of the electron beam.

Artificial Muscle (AM) Cilia Array for Underwater Systems

DTIC Science & Technology

2016-12-15

structures, including cilia-like structures. Specifically, a custom 3D printer was created that utilizes custom-made Nafion filament for 30 printing of custom... printing ) of IPMC material to create custom-shaped AM structures, including cilia-like structures. Various custom-shaped AM structures were fabricated via...integrating square cross-section IPMC actuators with a printed circuit board power delivery system. IV. Concise Accomplishments Performance

Low-Cost Fabrication of Printed Electronics Devices through Continuous Wave Laser-Induced Forward Transfer.

PubMed

Sopeña, Pol; Arrese, Javier; González-Torres, Sergio; Fernández-Pradas, Juan Marcos; Cirera, Albert; Serra, Pere

2017-09-06

Laser-induced forward transfer (LIFT) is a direct-writing technique that allows printing inks from a liquid film in a similar way to inkjet printing but with fewer limitations concerning ink viscosity and loading particle size. In this work, we prove that liquid inks can be printed through LIFT by using continuous wave (CW) instead of pulsed lasers, which allows a substantial reduction in the cost of the printing system. Through the fabrication of a functional circuit on both rigid and flexible substrates (plastic and paper), we provide a proof-of-concept that demonstrates the versatility of the technique for printed electronics applications.

Drafting. Advanced Print Reading--Electrical.

ERIC Educational Resources Information Center

Oregon State Dept. of Education, Salem.

This document is a workbook for drafting students learning advanced print reading for electricity applications. The workbook contains seven units covering the following material: architectural working drawings; architectural symbols and dimensions; basic architectural electrical symbols; wiring symbols; riser diagrams; schematic diagrams; and…

Pollutant emissions during pyrolysis and combustion of waste printed circuit boards, before and after metal removal.

PubMed

Ortuño, Nuria; Conesa, Juan A; Moltó, Julia; Font, Rafael

2014-11-15

The constant increase in the production of electronic devices implies the need for an appropriate management of a growing number of waste electrical and electronic equipment. Thermal treatments represent an interesting alternative to recycle this kind of waste, but particular attention has to be paid to the potential emissions of toxic by-products. In this study, the emissions from thermal degradation of printed circuit boards (with and without metals) have been studied using a laboratory scale reactor, under oxidizing and inert atmosphere at 600 and 850 °C. Apart from carbon oxides, HBr was the main decomposition product, followed by high amounts of methane, ethylene, propylene, phenol and benzene. The maximum formation of PAHs was found in pyrolysis at 850 °C, naphthalene being the most abundant. High levels of 2-, 4-, 2,4-, 2,6- and 2,4,6-bromophenols were found, especially at 600 °C. Emissions of PCDD/Fs and dioxin-like PCBs were quite low and much lower than that of PBDD/Fs, due to the higher bromine content of the samples. Combustion at 600 °C was the run with the highest PBDD/F formation: the total content of eleven 2,3,7,8-substituted congeners (tetra- through heptaBDD/Fs) was 7240 and 3250 ng WHO2005-TEQ/kg sample, corresponding to the sample with and without metals, respectively. Copyright © 2014 Elsevier B.V. All rights reserved.

Fast copper extraction from printed circuit boards using supercritical carbon dioxide.

PubMed

Calgaro, C O; Schlemmer, D F; da Silva, M D C R; Maziero, E V; Tanabe, E H; Bertuol, D A

2015-11-01

Technological development and intensive marketing support the growth in demand for electrical and electronic equipment (EEE), for which printed circuit boards (PCBs) are vital components. As these devices become obsolete after short periods, waste PCBs present a problem and require recycling. PCBs are composed of ceramics, polymers, and metals, particularly Cu, which is present in highest percentages. The aim of this study was to develop an innovative method to recover Cu from the PCBs of old mobile phones, obtaining faster reaction kinetics by means of leaching with supercritical CO2 and co-solvents. The PCBs from waste mobile phones were characterized, and evaluation was made of the reaction kinetics during leaching at atmospheric pressure and using supercritical CO2 with H2O2 and H2SO4 as co-solvents. The results showed that the PCBs contained 34.83 wt% of Cu. It was found that the supercritical extraction was 9 times faster, compared to atmospheric pressure extraction. After 20 min of supercritical leaching, approximately 90% of the Cu contained in the PCB was extracted using a 1:20 solid:liquid ratio and 20% of H2O2 and H2SO4 (2.5 M). These results demonstrate the efficiency of the process. Therefore the supercritical CO2 employment in the PCBs recycling is a promising alternative and the CO2 is environmentally acceptable and reusable. Copyright © 2015 Elsevier Ltd. All rights reserved.

Elemental analysis of printed circuit boards considering the ROHS regulations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wienold, Julia, E-mail: julia.wienold@bam.de; Recknagel, Sebastian, E-mail: sebastian.recknagel@bam.de; Scharf, Holger, E-mail: holger.scharf@bam.de

2011-03-15

The EU RoHS Directive (2002/95/EC of the European Parliament and of the Council) bans the placing of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants on the EU market. It necessitates methods for the evaluation of RoHS compliance of assembled electronic equipment. In this study mounted printed circuit boards from personal computers were analyzed on their content of the three elements Cd, Pb and Hg which were limited by the EU RoHS directive. Main focus of the investigations was the influence ofmore » sample pre-treatment on the precision and reproducibility of the results. The sample preparation steps used were based on the guidelines given in EN 62321. Five different types of dissolution procedures were tested on different subsequent steps of sample treatment like cutting and milling. Elemental analysis was carried out using ICP-OES, XRF and CV-AFS (Hg). The results obtained showed that for decision-making with respect to RoHS compliance a size reduction of the material to be analyzed to particles {<=}1.5 mm can already be sufficient. However, to ensure analytical results with relative standard deviations of less than 20%, as recommended by the EN 62321, a much larger effort for sample processing towards smaller particle sizes might be required which strongly depends on the mass fraction of the element under investigation.« less

Flexible CMOS-Like Circuits Based on Printed P-Type and N-Type Carbon Nanotube Thin-Film Transistors.

PubMed

Zhang, Xiang; Zhao, Jianwen; Dou, Junyan; Tange, Masayoshi; Xu, Weiwei; Mo, Lixin; Xie, Jianjun; Xu, Wenya; Ma, Changqi; Okazaki, Toshiya; Cui, Zheng

2016-09-01

P-type and n-type top-gate carbon nanotube thin-film transistors (TFTs) can be selectively and simultaneously fabricated on the same polyethylene terephthalate (PET) substrate by tuning the types of polymer-sorted semiconducting single-walled carbon nanotube (sc-SWCNT) inks, along with low temperature growth of HfO 2 thin films as shared dielectric layers. Both the p-type and n-type TFTs show good electrical properties with on/off ratio of ≈10 5 , mobility of ≈15 cm 2 V -1 s -1 , and small hysteresis. Complementary metal oxide semiconductor (CMOS)-like logic gates and circuits based on as-prepared p-type and n-type TFTs have been achieved. Flexible CMOS-like inverters exhibit large noise margin of 84% at low voltage (1/2 V dd = 1.5 V) and maximum voltage gain of 30 at V dd of 1.5 V and low power consumption of 0.1 μW. Both of the noise margin and voltage gain are one of the best values reported for flexible CMOS-like inverters at V dd less than 2 V. The printed CMOS-like inverters work well at 10 kHz with 2% voltage loss and delay time of ≈15 μs. A 3-stage ring oscillator has also been demonstrated on PET substrates and the oscillation frequency of 3.3 kHz at V dd of 1 V is achieved. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Interfacial and mechanical property analysis of waste printed circuit boards subject to thermal shock.

PubMed

Li, Jinhui; Duan, Huabo; Yu, Keli; Wang, Siting

2010-02-01

Waste printed circuit boards (PCBs) are the focal points for handling electric and electronic waste. In this paper, a thermal shock method was used to pretreat waste PCBs for the improvement of crushing performance. The influence of the thermal shock process on interfacial modification and mechanical property attenuation of PCB waste was studied. The appearance and layer spacing of the basal plane began to change slightly when the temperature reached 200 degrees C. By 250 degrees C, apparent bulging, cracking, and delamination were observed. However, pyrolysis of PCBs occurred when the temperature reached 275 degrees C, where PCBs were carbonized. The thermogravimetric analysis of PCB particles under vacuum showed that 270 degrees C was the starting point of pyrolysis. The tensile and impact strength of PCBs were reduced as shock temperature rose gradually, with a reduction by 2.6 and 16.5%, respectively, at 250 degrees C from its unheated strength. The PCBs that were heated to 250 degrees C achieved 100% liberation, increasing linearly from 13.6% for unheated PCBs through a single-level shear-crusher (2-mm mesh) and resulting in an obvious reduction of 9.5% (dB) in dust and noise at 250 degrees C. These parameters could be helpful for establishing the operational setup for industrial-scale facilities with the aim of achieving a compact process and a highly efficient recovery for waste PCBs compared with those of the traditional combination mechanical technologies.

Basic Guidelines to Introduce Electric Circuit Simulation Software in a General Physics Course

ERIC Educational Resources Information Center

Moya, A. A.

2018-01-01

The introduction of electric circuit simulation software for undergraduate students in a general physics course is proposed in order to contribute to the constructive learning of electric circuit theory. This work focuses on the lab exercises based on dc, transient and ac analysis in electric circuits found in introductory physics courses, and…

30 CFR 75.518 - Electric equipment and circuits; overload and short circuit protection.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Electric equipment and circuits; overload and short circuit protection. 75.518 Section 75.518 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.518 Electric...

30 CFR 75.518 - Electric equipment and circuits; overload and short circuit protection.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Electric equipment and circuits; overload and short circuit protection. 75.518 Section 75.518 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.518 Electric...

30 CFR 75.518 - Electric equipment and circuits; overload and short circuit protection.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Electric equipment and circuits; overload and short circuit protection. 75.518 Section 75.518 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.518 Electric...

30 CFR 75.518 - Electric equipment and circuits; overload and short circuit protection.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Electric equipment and circuits; overload and short circuit protection. 75.518 Section 75.518 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.518 Electric...

The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology

PubMed Central

Kang, Sung-Won; Park, Hyung-Il; Choi, Byoung-Gun; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung

2017-01-01

Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable “smart wear” for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study. PMID:29112125

Composition and Elution Behavior of Various Elements from Printed Circuit Boards, Cathode-ray Tube Glass, and Liquid-crystal Displays in Waste Consumer Electronics.

PubMed

Inaba, Kazuho; Murata, Tomoyoshi; Yamamura, Shigeki; Nagano, Masaaki; Iwasaki, Kazuhiro; Nakajima, Daisuke; Takigami, Hidetaka

2018-01-01

The contents and elution behavior of metals in consumer electronics parts were determined so as to understand their maximum environmental risk. Elements contained most in printed-circuit boards were Cu, Si, Br, Ca, Al, Sn, Pb, Sb, Ba, Fe, Ni, Ti, and Zn; in cathode-ray tube glass were Si, Pb, Ba, Sr, Zn, Zr, Ca, and Sb; in arsenic contained liquid-crystal displays were Si, Ca, Sr, Ba, As, and Fe; and in antimony contained liquid-crystal displays were Si, Ba, Ca, Sb, Sr, Fe, and Sn. The elements eluted most from printed-circuit boards were Zn, Pb, and Cu; from cathode-ray tube glass were Pb, Zn, B, Ba, and Si; and from liquid-crystal displays were B and Si, and the toxic As and Sb. The amount eluted was greatest at acidic pH. It was revealed that officially recommended 6-h-shaking with a pure water test was insufficient to understand the real environmental risk of waste electronics.

Examining the technology acceptance for dismantling of waste printed circuit boards in light of recycling and environmental concerns.

PubMed

Duan, Huabo; Hou, Kun; Li, Jinhui; Zhu, Xiaodong

2011-03-01

The dismantling of printed circuit board assemblies (PCBAs) and the recovery of their useful materials can lead to serious environmental impacts mainly due to their complicated physical structure and the variety of toxic elements contained in their material composition. So far, less attention has been paid to their responsible recycling compared to that of bare printed circuit boards. Combined with other materials recovery process, proper dismantling of PCBAs is beneficial to conserve scarce resources, reuse the components, and eliminate or safely dispose of hazardous materials. In analyzing the generation, resources potential and hazardous risk of scrap PCBAs, technologies used for the dismantling of waste PCBAs have been widely investigated and reviewed from the aspects of both industrial application and laboratory-scale studies. In addition, the feasibility of PCBA dismantling has been discussed, the determinants of which, including the heating conditions and mechanical properties have been identified. Moreover, this paper evaluates the environmental consequences caused by the dismantling of PCBAs. Copyright © 2010 Elsevier Ltd. All rights reserved.

Immobilization of Acidithiobacillus ferrooxidans on Cotton Gauze for the Bioleaching of Waste Printed Circuit Boards.

PubMed

Nie, Hongyan; Zhu, Nengwu; Cao, Yanlan; Xu, Zhiguo; Wu, Pingxiao

2015-10-01

The bioleaching parameters of metal concentrates from waste printed circuit boards by Acidithiobacillus ferrooxidans immobilized on cotton gauze in a two-step reactor were investigated in this study. The results indicated that an average ferrous iron oxidation rate of 0.54 g/(L·h) and a ferrous iron oxidation ratio of 96.90 % were obtained after 12 h at aeration rate of 1 L/min in bio-oxidation reactor. After 96 h, the highest leaching efficiency of copper reached 91.68 % under the conditions of the content of the metal powder 12 g/L, the retention time 6 h, and the aeration rate 1 L/min. The bioleaching efficiency of copper could be above 91.12 % under repeated continuous batch operation. Meanwhile, 95.32 % of zinc, 90.32 % of magnesium, 86.31 % of aluminum, and 59.07 % of nickel were extracted after 96 h. All the findings suggested that the recovery of metal concentrates from waste printed circuit boards via immobilization of A. ferrooxidans on cotton gauze was feasible.

Internet of "printed" Things: low-cost fabrication of autonomous sensing nodes by inkjet printing

NASA Astrophysics Data System (ADS)

Kawahara, Yoshihiro

2014-11-01

"What if electronics devices are printed using an inkjet printer even at home?" "What if those devices no longer need a battery?" I will introduce two enabling technologies for the Internet of Things concept. 1. Instant Inkjet Circuits: A low cost, fast and accessible technology to support the rapid prototyping of electronic devices. We demonstrated that "sintering-free" silver nano particle ink with a commodity inkjet printer can be used to fabricate printed circuit board and high-frequency applications such as antennas and sensors. The technology is now commercialized by AgIC, Inc. 2. Wireless Power: Although large amounts of data can be exchanged over a wireless communication link, mobile devices are still tethered by power cables. We are trying to solve this problem by two different approaches: energy harvesting. A simple circuitry comprised of diodes and capacitor can convert ambient radio signals into DC current. Our research revealed the signals from TV tower located 6.5km apart could be used to feed 100 microwatts to power microcontrollers.

Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB).

PubMed

Lee, Jaeryeong; Kim, Youngjin; Lee, Jae-chun

2012-11-30

Although printed circuit boards (PCBs) contain various elements, only the major elements (i.e., those with content levels in wt% or over grade) of and precious metals (e.g., Ag, Au, and platinum groups) contained within PCBs can be recycled. To recover other elements from PCBs, the PCBs should be properly disassembled as the first step of the recycling process. The recovery of these other elements would be beneficial for efforts to conserve scarce resources, reuse electric/electronic components (EECs), and eliminate environmental problems. This paper examines the disassembly of EECs from wasted PCBs (WPCBs) and the physical separation of these EECs using a self-designed disassembling apparatus and a 3-step separation process of sieving, magnetic separation, and dense medium separation. The disassembling efficiencies were evaluated by using the ratio of grinding area (E(area)) and the weight ratio of the detached EECs (E(weight)). In the disassembly treatment, these efficiencies were improved with an increase of grinder speed and grinder height. 97.7% (E(area)) and 98% (E(weight)) could be accomplished ultimately by 3 repetitive treatments at a grinder speed of 5500 rpm and a grinder height of 1.5mm. Through a series of physical separations, most groups of the EECs (except for the diode, transistor, and IC chip groups) could be sorted at a relatively high separation efficiency of about 75% or more. To evaluate the separation efficiency with regard to the elemental composition, the distribution ratio (R(dis)) and the concentration ratio (R(conc)) were used. 15 elements could be separated with the highest R(dis) and R(conc) in the same separated division. This result implies that the recyclability of the elements is highly feasible, even though the initial content in EECs is lower than several tens of mg/kg. Copyright © 2012 Elsevier B.V. All rights reserved.

Integrating soft sensor systems using conductive thread

NASA Astrophysics Data System (ADS)

Teng, Lijun; Jeronimo, Karina; Wei, Tianqi; Nemitz, Markus P.; Lyu, Geng; Stokes, Adam A.

2018-05-01

We are part of a growing community of researchers who are developing a new class of soft machines. By using mechanically soft materials (MPa modulus) we can design systems which overcome the bulk-mechanical mismatches between soft biological systems and hard engineered components. To develop fully integrated soft machines—which include power, communications, and control sub-systems—the research community requires methods for interconnecting between soft and hard electronics. Sensors based upon eutectic gallium alloys in microfluidic channels can be used to measure normal and strain forces, but integrating these sensors into systems of heterogeneous Young’s modulus is difficult due the complexity of finding a material which is electrically conductive, mechanically flexible, and stable over prolonged periods of time. Many existing gallium-based liquid alloy sensors are not mechanically or electrically robust, and have poor stability over time. We present the design and fabrication of a high-resolution pressure-sensor soft system that can transduce normal force into a digital output. In this soft system, which is built on a monolithic silicone substrate, a galinstan-based microfluidic pressure sensor is integrated with a flexible printed circuit board. We used conductive thread as the interconnect and found that this method alleviates problems arising due to the mechanical mismatch between conventional metal wires and soft or liquid materials. Conductive thread is low-cost, it is readily wetted by the liquid metal, it produces little bending moment into the microfluidic channel, and it can be connected directly onto the copper bond-pads of the flexible printed circuit board. We built a bridge-system to provide stable readings from the galinstan pressure sensor. This system gives linear measurement results between 500-3500 Pa of applied pressure. We anticipate that integrated systems of this type will find utility in soft-robotic systems as used for wearable technologies like virtual reality, or in soft-medical devices such as exoskeletal rehabilitation robots.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, T.; Hu, M.; Guo, Q.

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexiblemore » electronics manufacturing.« less

Beam forming network

NASA Technical Reports Server (NTRS)

Cramer, P. W., Jr. (Inventor)

1985-01-01

The network, which is connected to a layer of 134 feed elements that transmit and receive microwaves, consists of a pair of circuit boards parallel to the feed element layer. One of the two boards has 87 dividers that each divide a signal to be transmitted into seven portions, and the other board has 134 combiners that each collect seven transmit signal portions and deliver the sum to one of the feed elements. A similar arrangement is used to handle received signals. The large number of interconnections are made by printed circuit conductors radiating from each of the numerous dividers and combiners, and by providing interconnection pins that interconnect the ends of pairs of conductors lying on the two boards. The printed circuit conductors extend in undulating paths that provide maximum separation of conductors to minimize crosstalk.

Digital model of a vacuum circuit breaker for the analysis of switching waveforms in electrical circuits

NASA Astrophysics Data System (ADS)

Budzisz, Joanna; Wróblewski, Zbigniew

2016-03-01

The article presents a method of modelling a vaccum circuit breaker in the ATP/EMTP package, the results of the verification of the correctness of the developed digital circuit breaker model operation and its practical usefulness for analysis of overvoltages and overcurrents occurring in commutated capacitive electrical circuits and also examples of digital simulations of overvoltages and overcurrents in selected electrical circuits.

Opportunities and challenges for 3D printing of solid-state lighting systems

NASA Astrophysics Data System (ADS)

Narendran, Nadarajah; Perera, Indika U.; Mou, Xi; Thotagamuwa, Dinusha R.

2017-09-01

Low energy use and reduced maintenance have made the LED, a solid-state light (SSL) source, the preferred technology for many lighting applications. With the explosion of products in the marketplace and subsequent price erosion, manufacturers are looking for lower cost materials and manufacturing methods. 3-D printing, also known as additive manufacturing, could be a potential solution. Recently, manufacturers in the automotive, aerospace, and medical industries have embraced 3-D printing for manufacturing parts and systems. This could pave the way for the lighting industry to produce lower cost, custom lighting systems that are 3-D printed on-site to achieve on-time and on-demand manufacturing. One unique aspect of LED fixture manufacturing is that it requires thermo-mechanical, electrical, and optical components. The goal of our investigation was to understand if current 3-D printing technologies and materials can be used to manufacture functional thermo-mechanical, electrical, and optical components for SSL fixtures. We printed heat sink components and electrical traces using an FFF-type 3-D printer with different filaments. The results showed that the printed heat sinks achieved higher thermal conductivity values compared to components made with plastic materials. For electrical traces, graphene-infused PLA showed low resistivity but it is much higher than bulk copper resistivity. For optics, SLA-printed optical components showed that print resolution, print orientation, and postprocessing affect light transmission and light scatter properties. Overall, 3-D printing offers an opportunity for mass customization of SSL fixtures and changing architectural lighting practice, but several challenges in terms of process and materials still have to be overcome.

Thermally Stimulated Currents in Nanocrystalline Titania

PubMed Central

Bruzzi, Mara; Mori, Riccardo; Baldi, Andrea; Cavallaro, Alessandro; Scaringella, Monica

2018-01-01

A thorough study on the distribution of defect-related active energy levels has been performed on nanocrystalline TiO2. Films have been deposited on thick-alumina printed circuit boards equipped with electrical contacts, heater and temperature sensors, to carry out a detailed thermally stimulated currents analysis on a wide temperature range (5–630 K), in view to evidence contributions from shallow to deep energy levels within the gap. Data have been processed by numerically modelling electrical transport. The model considers both free and hopping contribution to conduction, a density of states characterized by an exponential tail of localized states below the conduction band and the convolution of standard Thermally Stimulated Currents (TSC) emissions with gaussian distributions to take into account the variability in energy due to local perturbations in the highly disordered network. Results show that in the low temperature range, up to 200 K, hopping within the exponential band tail represents the main contribution to electrical conduction. Above room temperature, electrical conduction is dominated by free carriers contribution and by emissions from deep energy levels, with a defect density ranging within 1014–1018 cm−3, associated with physio- and chemi-sorbed water vapour, OH groups and to oxygen vacancies. PMID:29303976

Thermally Stimulated Currents in Nanocrystalline Titania.

PubMed

Bruzzi, Mara; Mori, Riccardo; Baldi, Andrea; Carnevale, Ennio Antonio; Cavallaro, Alessandro; Scaringella, Monica

2018-01-05

A thorough study on the distribution of defect-related active energy levels has been performed on nanocrystalline TiO₂. Films have been deposited on thick-alumina printed circuit boards equipped with electrical contacts, heater and temperature sensors, to carry out a detailed thermally stimulated currents analysis on a wide temperature range (5-630 K), in view to evidence contributions from shallow to deep energy levels within the gap. Data have been processed by numerically modelling electrical transport. The model considers both free and hopping contribution to conduction, a density of states characterized by an exponential tail of localized states below the conduction band and the convolution of standard Thermally Stimulated Currents (TSC) emissions with gaussian distributions to take into account the variability in energy due to local perturbations in the highly disordered network. Results show that in the low temperature range, up to 200 K, hopping within the exponential band tail represents the main contribution to electrical conduction. Above room temperature, electrical conduction is dominated by free carriers contribution and by emissions from deep energy levels, with a defect density ranging within 10 14 -10 18 cm -3 , associated with physio- and chemi-sorbed water vapour, OH groups and to oxygen vacancies.

Printed circuit dispersive transmission line

DOEpatents

Ikezi, H.; Lin-Liu, Y.R.; DeGrassie, J.S.

1991-08-27

A printed circuit dispersive transmission line structure is disclosed comprising an insulator, a ground plane formed on one surface of the insulator, a first transmission line formed on a second surface of the insulator, and a second transmission line also formed on the second surface of the insulator and of longer length than the first transmission line and periodically intersecting the first transmission line. In a preferred embodiment, the transmission line structure exhibits highly dispersive characteristics by designing the length of one of the transmission line between two adjacent periodic intersections to be longer than the other. 5 figures.

Printed dose-recording tag based on organic complementary circuits and ferroelectric nonvolatile memories

PubMed Central

Nga Ng, Tse; Schwartz, David E.; Mei, Ping; Krusor, Brent; Kor, Sivkheng; Veres, Janos; Bröms, Per; Eriksson, Torbjörn; Wang, Yong; Hagel, Olle; Karlsson, Christer

2015-01-01

We have demonstrated a printed electronic tag that monitors time-integrated sensor signals and writes to nonvolatile memories for later readout. The tag is additively fabricated on flexible plastic foil and comprises a thermistor divider, complementary organic circuits, and two nonvolatile memory cells. With a supply voltage below 30 V, the threshold temperatures can be tuned between 0 °C and 80 °C. The time-temperature dose measurement is calibrated for minute-scale integration. The two memory bits are sequentially written in a thermometer code to provide an accumulated dose record. PMID:26307438

A screen-printed circular-type paper-based glucose/O2 biofuel cell

NASA Astrophysics Data System (ADS)

Shitanda, Isao; Nohara, Saki; Hoshi, Yoshinao; Itagaki, Masayuki; Tsujimura, Seiya

2017-08-01

The printable paper-based enzymatic biofuel cell (PBFC) to directly power small devices is an important objective for realizing cost-effective and disposable energy harvesting devices. In the present study, a screen-printed circular-type PBFC, composed of a series of 5 individual cells, was constructed. The PBFC exhibited the open circuit potential of 2.65 V and maximum power of 350 μW at 1.55 V, which were sufficient to illuminate an LED without requiring a booster circuit. The output voltage of this PBFC can also be easily adjusted as required.

Eddy current gauge for monitoring displacement using printed circuit coil

DOEpatents

Visioli, Jr., Armando J.

1977-01-01

A proximity detection system for non-contact displacement and proximity measurement of static or dynamic metallic or conductive surfaces is provided wherein the measurement is obtained by monitoring the change in impedance of a flat, generally spiral-wound, printed circuit coil which is excited by a constant current, constant frequency source. The change in impedance, which is detected as a corresponding change in voltage across the coil, is related to the eddy current losses in the distant conductive material target. The arrangement provides for considerable linear displacement range with increased accuracies, stability, and sensitivity over the entire range.

13 CFR 121.201 - What size standards has SBA identified by North American Industry Classification System codes?

Code of Federal Regulations, 2010 CFR

2010-01-01

... footnote 1 221112 Fossil Fuel Electric Power Generation See footnote 1 221113 Nuclear Electric Power... 500 323115 Digital Printing 500 323116 Manifold Business Forms Printing 500 323117 Books Printing 500... 424590 Other Farm Product Raw Material Merchant Wholesalers 100 424610 Plastics Materials and Basic Forms...

13 CFR 121.201 - What size standards has SBA identified by North American Industry Classification System codes?

Code of Federal Regulations, 2012 CFR

2012-01-01

... footnote 1 221112 Fossil Fuel Electric Power Generation See footnote 1 221113 Nuclear Electric Power... 500 323115 Digital Printing 500 323116 Manifold Business Forms Printing 500 323117 Books Printing 500... Merchant Wholesalers 100 424610 Plastics Materials and Basic Forms and Shapes Merchant Wholesalers 100...

13 CFR 121.201 - What size standards has SBA identified by North American Industry Classification System codes?

Code of Federal Regulations, 2011 CFR

2011-01-01

... footnote 1 221112 Fossil Fuel Electric Power Generation See footnote 1 221113 Nuclear Electric Power... 500 323115 Digital Printing 500 323116 Manifold Business Forms Printing 500 323117 Books Printing 500... Merchant Wholesalers 100 424610 Plastics Materials and Basic Forms and Shapes Merchant Wholesalers 100...

Electronic firing systems and methods for firing a device

DOEpatents

Frickey, Steven J [Boise, ID; Svoboda, John M [Idaho Falls, ID

2012-04-24

An electronic firing system comprising a control system, a charging system, an electrical energy storage device, a shock tube firing circuit, a shock tube connector, a blasting cap firing circuit, and a blasting cap connector. The control system controls the charging system, which charges the electrical energy storage device. The control system also controls the shock tube firing circuit and the blasting cap firing circuit. When desired, the control system signals the shock tube firing circuit or blasting cap firing circuit to electrically connect the electrical energy storage device to the shock tube connector or the blasting cap connector respectively.

Design of a signal conditioner for the Fermilab Magnet Test Facility

DOE Office of Scientific and Technical Information (OSTI.GOV)

Giannelli, Pietro

2012-01-01

This thesis describes the design of a remotely-programmable signal conditioner for the harmonic measurement of accelerator magnets. A 10-channel signal conditioning circuit featuring bucking capabilities was designed from scratch and implemented to the level of the printed circuit board layout. Other system components were chosen from those available on the market. Software design was started with the definition of routine procedures. This thesis is part of an upgrade project for replacing obsolescent automated test equipment belonging to the Fermilab Magnet Test Facility. The design started with a given set of requirements. Using a top-down approach, all the circuits were designedmore » and their expected performances were theoretically predicted and simulated. A limited prototyping phase followed. The printed circuit boards were laid out and routed using a CAD software and focusing the design on maximum electromagnetic interference immunity. An embedded board was selected for controlling and interfacing the signal conditioning circuitry with the instrumentation network. Basic low level routines for hardware access were defined. This work covered the entire design process of the signal conditioner, resulting in a project ready for manufacturing. The expected performances are in line with the requirements and, in the cases where this was not possible, approval of trade-offs was sought and received from the end users. Part I deals with the global structure of the signal conditioner and the subdivision in functional macro-blocks. Part II treats the hardware design phase in detail, covering the analog and digital circuits, the printed circuit layouts, the embedded controller and the power supply selection. Part III deals with the basic hardware-related routines to be implemented in the final software.« less

Fast optoelectric printing of plasmonic nanoparticles into tailored circuits

NASA Astrophysics Data System (ADS)

Rodrigo, José A.

2017-04-01

Plasmonic nanoparticles are able to control light at nanometre-scale by coupling electromagnetic fields to the oscillations of free electrons in metals. Deposition of such nanoparticles onto substrates with tailored patterns is essential, for example, in fabricating plasmonic structures for enhanced sensing. This work presents an innovative micro-patterning technique, based on optoelectic printing, for fast and straightforward fabrication of curve-shaped circuits of plasmonic nanoparticles deposited onto a transparent electrode often used in optoelectronics, liquid crystal displays, touch screens, etc. We experimentally demonstrate that this kind of plasmonic structure, printed by using silver nanoparticles of 40 nm, works as a plasmonic enhanced optical device allowing for polarized-color-tunable light scattering in the visible. These findings have potential applications in biosensing and fabrication of future optoelectronic devices combining the benefits of plasmonic sensing and the functionality of transparent electrodes.

Liter Flow and Mix Selection in Semiclosed-Circuit Scuba

DTIC Science & Technology

1970-01-27

iCUII*. TO USE IT& JUST MNSWER 130 PRINT "INC OUSTIfWS AS IIIEY APPEAR*’ 130 PRINT 340 PRIN’ ISO PRINT MAXIMUM @11 USAGSE LW sees IŔ INPUT US 170 PRINT...34MINIMUM 03 UISAM "i NODS ISO INPUT U4 90Itoli U4bs 113 10 It0 too "i ISO35 310 PRINT 310 PRINT "ETRY MI STAKE* TNT AGAIN" too PRINT SAI0 as To ISO ...113049 S600467 30 4.79063 5.14876 7047556 so 6.32109 6.98531 10.506 T0 IeSSISS lst’$$IS5 11352 t00 10.1472 1.657,6-1 14.0871 too 1707995 10. 79P 4

Electrical Circuits and Water Analogies

ERIC Educational Resources Information Center

Smith, Frederick A.; Wilson, Jerry D.

1974-01-01

Briefly describes water analogies for electrical circuits and presents plans for the construction of apparatus to demonstrate these analogies. Demonstrations include series circuits, parallel circuits, and capacitors. (GS)

Printing method for organic light emitting device lighting

NASA Astrophysics Data System (ADS)

Ki, Hyun Chul; Kim, Seon Hoon; Kim, Doo-Gun; Kim, Tae-Un; Kim, Snag-Gi; Hong, Kyung-Jin; So, Soon-Yeol

2013-03-01

Organic Light Emitting Device (OLED) has a characteristic to change the electric energy into the light when the electric field is applied to the organic material. OLED is currently employed as a light source for the lighting tools because research has extensively progressed in the improvement of luminance, efficiency, and life time. OLED is widely used in the plate display device because of a simple manufacture process and high emitting efficiency. But most of OLED lighting projects were used the vacuum evaporator (thermal evaporator) with low molecular. Although printing method has lower efficiency and life time of OLED than vacuum evaporator method, projects of printing OLED actively are progressed because was possible to combine with flexible substrate and printing technology. Printing technology is ink-jet, screen printing and slot coating. This printing method allows for low cost and mass production techniques and large substrates. In this research, we have proposed inkjet printing for organic light-emitting devices has the dominant method of thick film deposition because of its low cost and simple processing. In this research, the fabrication of the passive matrix OLED is achieved by inkjet printing, using a polymer phosphorescent ink. We are measured optical and electrical characteristics of OLED.

3D printed magnetic polymer composite transformers

NASA Astrophysics Data System (ADS)

Bollig, Lindsey M.; Hilpisch, Peter J.; Mowry, Greg S.; Nelson-Cheeseman, Brittany B.

2017-11-01

The possibility of 3D printing a transformer core using fused deposition modeling methods is explored. With the use of additive manufacturing, ideal transformer core geometries can be achieved in order to produce a more efficient transformer. In this work, different 3D printed settings and toroidal geometries are tested using a custom integrated magnetic circuit capable of measuring the hysteresis loop of a transformer. These different properties are then characterized, and it was determined the most effective 3D printed transformer core requires a high fill factor along with a high concentration of magnetic particulate.

Basic guidelines to introduce electric circuit simulation software in a general physics course

NASA Astrophysics Data System (ADS)

Moya, A. A.

2018-05-01

The introduction of electric circuit simulation software for undergraduate students in a general physics course is proposed in order to contribute to the constructive learning of electric circuit theory. This work focuses on the lab exercises based on dc, transient and ac analysis in electric circuits found in introductory physics courses, and shows how students can use the simulation software to do simple activities associated with a lab exercise itself and with related topics. By introducing electric circuit simulation programs in a general physics course as a brief activitiy complementing lab exercise, students develop basic skills in using simulation software, improve their knowledge on the topology of electric circuits and perceive that the technology contributes to their learning, all without reducing the time spent on the actual content of the course.

Investigation into reversion of polyurethane encapsulants

NASA Technical Reports Server (NTRS)

Lynch, C. R.

1973-01-01

The effect of high humidity (95% RH) at 60 C, 70 C, 85 C and 100 C on the solid-to-liquid reversion of polyurethane elastomers (used for potting electrical connectors and conformal coating printed circuit boards) was investigated. Hardness measurements were conducted on eleven elastomers to track reversion for a 101-day period. The primary purpose of the tests was to provide data to predict service life for the polyurethane elastomers. This was not accomplished as the hardness did not deteriorate rapidly enough at the lower test temperatures. The tests did determine that the potting and coating materials most widely used on the S-1C Program are susceptible to reversion but appear adequate for service in the S-1C environment.

30 CFR 77.506 - Electric equipment and circuits; overload and short-circuit protection.

Code of Federal Regulations, 2010 CFR

2010-07-01

... short-circuit protection. 77.506 Section 77.506 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION... circuits; overload and short-circuit protection. Automatic circuit-breaking devices or fuses of the correct type and capacity shall be installed so as to protect all electric equipment and circuits against short...

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia, E-mail: silvia.serranti@uniroma1.it

Highlights: • A recycling oriented characterization of end-of-life mobile phones was carried out. • Characterization was developed in a zero-waste-perspective, aiming to recover all the mobile phone materials. • Plastic frames and printed circuit boards were analyzed by electronic and chemical imaging. • Suitable milling/classification strategies were set up to define specialized-pre-concentrated-streams. • The proposed approach can improve the recovery of polymers, base/precious metals, rare earths and critical raw materials. - Abstract: This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using thesemore » items as potential raw materials. Correct handling of such a waste is essential for its further “sustainable” recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both “traditional” (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery.« less

Flexible circuits with integrated switches for robotic shape sensing

NASA Astrophysics Data System (ADS)

Harnett, C. K.

2016-05-01

Digital switches are commonly used for detecting surface contact and limb-position limits in robotics. The typical momentary-contact digital switch is a mechanical device made from metal springs, designed to connect with a rigid printed circuit board (PCB). However, flexible printed circuits are taking over from the rigid PCB in robotics because the circuits can bend while carrying signals and power through moving joints. This project is motivated by a previous work where an array of surface-mount momentary contact switches on a flexible circuit acted as an all-digital shape sensor compatible with the power resources of energy harvesting systems. Without a rigid segment, the smallest commercially-available surface-mount switches would detach from the flexible circuit after several bending cycles, sometimes violently. This report describes a low-cost, conductive fiber based method to integrate electromechanical switches into flexible circuits and other soft, bendable materials. Because the switches are digital (on/off), they differ from commercially-available continuous-valued bend/flex sensors. No amplification or analog-to-digital conversion is needed to read the signal, but the tradeoff is that the digital switches only give a threshold curvature value. Boundary conditions on the edges of the flexible circuit are key to setting the threshold curvature value for switching. This presentation will discuss threshold-setting, size scaling of the design, automation for inserting a digital switch into the flexible circuit fabrication process, and methods for reconstructing a shape from an array of digital switch states.

Global Electric Circuit Diurnal Variation Derived from Storm Overflight and Satellite Optical Lightning Datasets

NASA Technical Reports Server (NTRS)

Mach, Douglas M.; Blakeslee, R. J.; Bateman, M. J.; Bailey, J. C.

2011-01-01

We have combined analyses of over 1000 high altitude aircraft observations of electrified clouds with diurnal lightning statistics from the Lightning Imaging Sensor (LIS) and Optical Transient Detector (OTD) to produce an estimate of the diurnal variation in the global electric circuit. Using basic assumptions about the mean storm currents as a function of flash rate and location, and the global electric circuit, our estimate of the current in the global electric circuit matches the Carnegie curve diurnal variation to within 4% for all but two short periods of time. The agreement with the Carnegie curve was obtained without any tuning or adjustment of the satellite or aircraft data. Mean contributions to the global electric circuit from land and ocean thunderstorms are 1.1 kA (land) and 0.7 kA (ocean). Contributions to the global electric circuit from ESCs are 0.22 kA for ocean storms and 0.04 kA for land storms. Using our analysis, the mean total conduction current for the global electric circuit is 2.0 kA.

Nanoink bridge-induced capillary pen printing for chemical sensors.

PubMed

Kahng, Seong-Joong; Cerwyn, Chiew; Dincau, Brian M; Kim, Jong-Hoon; Novosselov, Igor V; Anantram, M P; Chung, Jae-Hyun

2018-08-17

Single-walled carbon nanotubes (SWCNTs) are used as a key component for chemical sensors. For miniature scale design, a continuous printing method is preferred for electrical conductance without damaging the substrate. In this paper, a non-contact capillary pen printing method is presented by the formation of a nanoink bridge between the nib of a capillary pen and a polyethylene terephthalate film. A critical parameter for stable printing is the advancing contact angle at the bridge meniscus, which is a function of substrate temperature and printing speed. The printed pattern including dots, lines, and films of SWCNTs are characterized by morphology, optical transparency, and electrical properties. Gas and pH sensors fabricated using the non-contact printing method are demonstrated as applications.

30 CFR 77.506-1 - Electric equipment and circuits; overload and short circuit protection; minimum requirements.

Code of Federal Regulations, 2010 CFR

2010-07-01

... short circuit protection; minimum requirements. 77.506-1 Section 77.506-1 Mineral Resources MINE SAFETY...-1 Electric equipment and circuits; overload and short circuit protection; minimum requirements. Devices providing either short circuit protection or protection against overload shall conform to the...

Project Circuits in a Basic Electric Circuits Course

ERIC Educational Resources Information Center

Becker, James P.; Plumb, Carolyn; Revia, Richard A.

2014-01-01

The use of project circuits (a photoplethysmograph circuit and a simple audio amplifier), introduced in a sophomore-level electric circuits course utilizing active learning and inquiry-based methods, is described. The development of the project circuits was initiated to promote enhanced engagement and deeper understanding of course content among…

Towards roll-to-roll fabrication of electronics, optics, and optoelectronics for smart and intelligent packaging

NASA Astrophysics Data System (ADS)

Kololuoma, Terho K.; Tuomikoski, Markus; Makela, Tapio; Heilmann, Jali; Haring, Tomi; Kallioinen, Jani; Hagberg, Juha; Kettunen, Ilkka; Kopola, Harri K.

2004-06-01

Embedding of optoelectrical, optical, and electrical functionalities into low-cost products like packages and printed matter can be used to increase their information content. These functionalities make also possible the realization of new type of entertaining, impressive or guiding effects on the product packages and printed matter. For these purposes, components like displays, photodetectors, light sources, solar cells, battery elements, diffractive optical elements, lightguides, electrical conductors, resistors, transistors, switching elements etc. and their integration to functional modules are required. Additionally, the price of the components for low-end products has to be in cent scale or preferably below that. Therefore, new, cost-effective, and volume scale capable manufacturing techniques are required. Recent developments of liquid-phase processable electrical and optical polymeric, inorganic, and hybrid materials - inks - have made it possible to fabricate functional electrical, optical and optoelectrical components by conventional roll-to-roll techniques such as gravure printing, embossing, digital printing, offset, and screen printing on flexible paper and plastic like substrates. In this paper, we show our current achievements in the field of roll-to-roll fabricated, optics, electronics and optoelectronics. With few examples, we also demonstrate the printing and hot-embossing capabilities of table scale printing machines and VTT Electronic's 'PICO' roll-to-roll pilot production facility.

MEMS Technology for Space Applications

NASA Technical Reports Server (NTRS)

vandenBerg, A.; Spiering, V. L.; Lammerink, T. S. J.; Elwenspoek, M.; Bergveld, P.

1995-01-01

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

Device, system and method for a sensing electrical circuit

NASA Technical Reports Server (NTRS)

Vranish, John M. (Inventor)

2009-01-01

The invention relates to a driven ground electrical circuit. A driven ground is a current-measuring ground termination to an electrical circuit with the current measured as a vector with amplification. The driven ground module may include an electric potential source V.sub.S driving an electric current through an impedance (load Z) to a driven ground. Voltage from the source V.sub.S excites the minus terminal of an operational amplifier inside the driven ground which, in turn, may react by generating an equal and opposite voltage to drive the net potential to approximately zero (effectively ground). A driven ground may also be a means of passing information via the current passing through one grounded circuit to another electronic circuit as input. It may ground one circuit, amplify the information carried in its current and pass this information on as input to the next circuit.

SU-8 microprobe with microelectrodes for monitoring electrical impedance in living tissues.

PubMed

Tijero, M; Gabriel, G; Caro, J; Altuna, A; Hernández, R; Villa, R; Berganzo, J; Blanco, F J; Salido, R; Fernández, L J

2009-04-15

This paper presents a minimally invasive needle-shaped probe capable of monitoring the electrical impedance of living tissues. This microprobe consists of a 160 microm thick SU-8 substrate containing four planar platinum (Pt) microelectrodes. We design the probe to minimize damage to the surrounding tissue and to be stiff enough to be inserted in living tissues. The proposed batch fabrication process is low cost and low time consuming. The microelectrodes obtained with this process are strongly adhered to the SU-8 substrate and their impedance does not depend on frequency variation. In vitro experiments are compared with previously developed Si and SiC based microprobes and results suggest that it is preferable to use the SU-8 based microprobes due to their flexibility and low cost. The microprobe is assembled on a flexible printed circuit FPC with a conductive glue, packaged with epoxy and wired to the external instrumentation. This flexible probe is inserted into a rat kidney without fracturing and succeeds in demonstrating the ischemia monitoring.

Applications of Emerging Parallel Optical Link Technology to High Energy Physics Experiments

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chramowicz, J.; Kwan, S.; Prosser, A.

2011-09-01

Modern particle detectors depend upon optical fiber links to deliver event data to upstream trigger and data processing systems. Future detector systems can benefit from the development of dense arrangements of high speed optical links emerging from the telecommunications and storage area network market segments. These links support data transfers in each direction at rates up to 120 Gbps in packages that minimize or even eliminate edge connector requirements. Emerging products include a class of devices known as optical engines which permit assembly of the optical transceivers in close proximity to the electrical interfaces of ASICs and FPGAs which handlemore » the data in parallel electrical format. Such assemblies will reduce required printed circuit board area and minimize electromagnetic interference and susceptibility. We will present test results of some of these parallel components and report on the development of pluggable FPGA Mezzanine Cards equipped with optical engines to provide to collaborators on the Versatile Link Common Project for the HI-LHC at CERN.« less

Highly stretchable and conductive fibers enabled by liquid metal dip-coating

NASA Astrophysics Data System (ADS)

Zhang, Qiang; Roach, Devin J.; Geng, Luchao; Chen, Haosen; Qi, H. Jerry; Fang, Daining

2018-03-01

Highly stretchable and conductive fibers have been fabricated by dip-coating of a layer of liquid metal (eutectic gallium indium, EGaIn) on printed silicone elastomer filaments. This fabrication method exploits a nanolayer of oxide skin that rapidly forms on the surface of EGaIn when exposed to air. Through dip-coating, the sticky nature of the oxide skin leads to the formation of a thin EGaIn coating (˜5 μm thick) on the originally nonconductive filaments and renders these fibers excellent conductivity. Electrical characterization shows that the fiber resistance increases moderately as the fiber elongates but always maintains conductivity even when stretched by 800%. Besides this, these fibers possess good cyclic electrical stability with little degradation after hundreds of stretching cycles, which makes them an excellent candidate for stretchable conductors. We then demonstrate a highly stretchable LED circuit as well as a conductive stretchable net that extends the 1D fibers into a 2D configuration. These examples demonstrate potential applications for topologically complex stretchable electronics.

Signal transduction in Mimosa pudica: biologically closed electrical circuits.

PubMed

Volkov, Alexander G; Foster, Justin C; Markin, Vladislav S

2010-05-01

Biologically closed electrical circuits operate over large distances in biological tissues. The activation of such circuits can lead to various physiological and biophysical responses. Here, we analyse the biologically closed electrical circuits of the sensitive plant Mimosa pudica Linn. using electrostimulation of a petiole or pulvinus by the charged capacitor method, and evaluate the equivalent electrical scheme of electrical signal transduction inside the plant. The discharge of a 100 microF capacitor in the pulvinus resulted in the downward fall of the petiole in a few seconds, if the capacitor was charged beforehand by a 1.5 V power supply. Upon disconnection of the capacitor from Ag/AgCl electrodes, the petiole slowly relaxed to the initial position. The electrical properties of the M. pudica were investigated, and an equivalent electrical circuit was proposed that explains the experimental data.

30 CFR 75.518-1 - Electric equipment and circuits; overload and short circuit protection; minimum requirements.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Electric equipment and circuits; overload and short circuit protection; minimum requirements. 75.518-1 Section 75.518-1 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical...

30 CFR 75.518-1 - Electric equipment and circuits; overload and short circuit protection; minimum requirements.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Electric equipment and circuits; overload and short circuit protection; minimum requirements. 75.518-1 Section 75.518-1 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical...

30 CFR 75.518-1 - Electric equipment and circuits; overload and short circuit protection; minimum requirements.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Electric equipment and circuits; overload and short circuit protection; minimum requirements. 75.518-1 Section 75.518-1 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical...

30 CFR 75.518-1 - Electric equipment and circuits; overload and short circuit protection; minimum requirements.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Electric equipment and circuits; overload and short circuit protection; minimum requirements. 75.518-1 Section 75.518-1 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR COAL MINE SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical...

Device serves as hinge and electrical connector for circuit boards

NASA Technical Reports Server (NTRS)

Bethel, P. G.; Harris, G. G.

1966-01-01

Hinge makes both sides of electrical circuit boards readily accessible for component checkout and servicing. The hinge permits mounting of two circuit boards and incorporates connectors to maintain continuous electrical contact between the components on both boards.

Microfluidic networks embedded in a printed circuit board

NASA Astrophysics Data System (ADS)

Dong, Liangwei; Hu, Yueli

2017-07-01

In order to improve the robustness of microfluidic networks in printed circuit board (PCB)-based microfluidic platforms, a new method was presented. A pattern in a PCB was formed using hollowed-out technology. Polydimethylsiloxane was partly filled in the hollowed-out fields after mounting an adhesive tape on the bottom of the PCB, and solidified in an oven. Then, microfluidic networks were built using soft lithography technology. Microfluidic transportation and dilution operations were demonstrated using the fabricated microfluidic platform. Results show that this method can embed microfluidic networks into a PCB, and microfluidic operations can be implemented in the microfluidic networks embedded into the PCB.

Packaging strategy for maximizing the performance of a screen printed piezoelectric energy harvester

NASA Astrophysics Data System (ADS)

Zhang, Z.; Zhu, D.; Tudor, M. J.; Beeby, S. P.

2013-12-01

This paper reports the extended design and simulation of a screen printed piezoelectric energy harvester. The proposed design was based on a previous credit card sized smart tag sensor node, and packages the power conditioning circuit in the free space above the tungsten proof mass layer. This approach enables electronic components to be mounted onto the cantilever beam, which provides additional weight at the tip of the cantilever structure. The design structure contains a T-shape cantilever beam with size of 47 mm × 30 mm × 0.85 mm which is fabricated using screen printing. ANSYS simulation results predict the revised architecture can generate 421.9 μW approximately twice of the RMS power produced by the original design along with a higher open-circuit RMS Voltage of 8.0 V while the resonant frequency is dropped to 53.4 Hz.

Housing And Mounting Structure

DOEpatents

Anderson, Gene R.; Armendariz, Marcelino G.; Baca, Johnny R.F.; Bryan, Robert P.; Carson, Richard F.; Duckett, III, Edwin B.; McCormick, Frederick B.; Miller, Gregory V.; Peterson, David W.; Smith, Terrance T.

2005-03-08

This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.

Characterization of shredded television scrap and implications for materials recovery.

PubMed

Cui, Jirang; Forssberg, Eric

2007-01-01

Characterization of TV scrap was carried out by using a variety of methods, such as chemical analysis, particle size and shape analysis, liberation degree analysis, thermogravimetric analysis, sink-float test, and IR spectrometry. A comparison of TV scrap, personal computer scrap, and printed circuit board scrap shows that the content of non-ferrous metals and precious metals in TV scrap is much lower than that in personal computer scrap or printed circuit board scrap. It is expected that recycling of TV scrap will not be cost-effective by utilizing conventional manual disassembly. The result of particle shape analysis indicates that the non-ferrous metal particles in TV scrap formed as a variety of shapes; it is much more heterogeneous than that of plastics and printed circuit boards. Furthermore, the separability of TV scrap using density-based techniques was evaluated by the sink-float test. The result demonstrates that a high recovery of copper could be obtained by using an effective gravity separation process. Identification of plastics shows that the major plastic in TV scrap is high impact polystyrene. Gravity separation of plastics may encounter some challenges in separation of plastics from TV scrap because of specific density variations.

Toward environmentally-benign utilization of nonmetallic fraction of waste printed circuit boards as modifier and precursor.

PubMed

Hadi, Pejman; Ning, Chao; Ouyang, Weiyi; Xu, Meng; Lin, Carol S K; McKay, Gordon

2015-01-01

Electronic waste, including printed circuit boards, is growing at an alarming rate due to the accelerated technological progress and the shorter lifespan of the electronic equipment. In the past decades, due to the lack of proper economic and environmentally-benign recycling technologies, a major fraction of e-waste generated was either destined to landfills or incinerated with the sole intention of its disposal disregarding the toxic nature of this waste. Recently, with the increasing public awareness over their environment and health issues and with the enaction of more stringent regulations, environmentally-benign recycling has been driven to be an alternative option partially replacing the traditional eco-unfriendly disposal methods. One of the most favorable green technologies has been the mechanical separation of the metallic and nonmetallic fraction of the waste printed circuit boards. Although metallic fraction, as the most profitable component, is used to generate the revenue of the separation process, the nonmetallic fraction (NMF) has been left isolated. Herein, the recent developments in the application of NMF have been comprehensively reviewed and an eco-friendly emerging usage of NMF as a value-added material for sustainable remediation has been introduced. Copyright © 2014 Elsevier Ltd. All rights reserved.

Recycling-oriented characterization of plastic frames and printed circuit boards from mobile phones by electronic and chemical imaging.

PubMed

Palmieri, Roberta; Bonifazi, Giuseppe; Serranti, Silvia

2014-11-01

This study characterizes the composition of plastic frames and printed circuit boards from end-of-life mobile phones. This knowledge may help define an optimal processing strategy for using these items as potential raw materials. Correct handling of such a waste is essential for its further "sustainable" recovery, especially to maximize the extraction of base, rare and precious metals, minimizing the environmental impact of the entire process chain. A combination of electronic and chemical imaging techniques was thus examined, applied and critically evaluated in order to optimize the processing, through the identification and the topological assessment of the materials of interest and their quantitative distribution. To reach this goal, end-of-life mobile phone derived wastes have been systematically characterized adopting both "traditional" (e.g. scanning electronic microscopy combined with microanalysis and Raman spectroscopy) and innovative (e.g. hyperspectral imaging in short wave infrared field) techniques, with reference to frames and printed circuit boards. Results showed as the combination of both the approaches (i.e. traditional and classical) could dramatically improve recycling strategies set up, as well as final products recovery. Copyright © 2014 Elsevier Ltd. All rights reserved.

30 CFR 75.518-1 - Electric equipment and circuits; overload and short circuit protection; minimum requirements.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Electric equipment and circuits; overload and short circuit protection; minimum requirements. 75.518-1 Section 75.518-1 Mineral Resources MINE SAFETY... short circuit protection; minimum requirements. A device to provide either short circuit protection or...

Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains

PubMed Central

Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma. Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

2015-01-01

In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed. PMID:26413051

Via Method for Lithography Free Contact and Preservation of 2D Materials.

PubMed

Telford, Evan J; Benyamini, Avishai; Rhodes, Daniel; Wang, Da; Jung, Younghun; Zangiabadi, Amirali; Watanabe, Kenji; Taniguchi, Takashi; Jia, Shuang; Barmak, Katayun; Pasupathy, Abhay N; Dean, Cory R; Hone, James

2018-02-14

Atomically thin 2D materials span the common components of electronic circuits as metals, semiconductors, and insulators, and can manifest correlated phases such as superconductivity, charge density waves, and magnetism. An ongoing challenge in the field is to incorporate these 2D materials into multilayer heterostructures with robust electrical contacts while preventing disorder and degradation. In particular, preserving and studying air-sensitive 2D materials has presented a significant challenge since they readily oxidize under atmospheric conditions. We report a new technique for contacting 2D materials, in which metal via contacts are integrated into flakes of insulating hexagonal boron nitride, and then placed onto the desired conducting 2D layer, avoiding direct lithographic patterning onto the 2D conductor. The metal contacts are planar with the bottom surface of the boron nitride and form robust contacts to multiple 2D materials. These structures protect air-sensitive 2D materials for months with no degradation in performance. This via contact technique will provide the capability to produce "atomic printed circuit boards" that can form the basis of more complex multilayer heterostructures.

A wireless multi-channel bioimpedance measurement system for personalized healthcare and lifestyle.

PubMed

Ramos, Javier; Ausín, José Luis; Lorido, Antonio Manuel; Redondo, Francisco; Duque-Carrillo, Juan Francisco

2013-01-01

Miniaturized, noninvasive, wearable sensors constitute a fundamental prerequisite for pervasive, predictive, and preventive healthcare systems. In this sense, this paper presents the design, realization, and evaluation of a wireless multi-channel measurement system based on a cost-effective high-performance integrated circuit for electrical bioimpedance (EBI) measurements in the frequency range from 1 kHz to 1 MHz. The resulting on-chip spectrometer provides high measuring EBI capabilities and together with a low-cost, commercially available radio frequency transceiver device. It provides reliable wireless communication, constitutes the basic node to build EBI wireless sensor networks (EBI-WSNs). The proposed EBI-WSN behaves as a high-performance wireless multi-channel EBI spectrometer, where the number of channels is completely scalable and independently configurable to satisfy specific measurement requirements of each individual. A prototype of the EBI node leads to a very small printed circuit board of approximately 8 cm2 including chip-antenna, which can operate several years on one 3-V coin cell battery and make it suitable for long-term preventive healthcare monitoring.

Bioleaching of gold, copper and nickel from waste cellular phone PCBs and computer goldfinger motherboards by two Aspergillus nigerstrains.

PubMed

Madrigal-Arias, Jorge Enrique; Argumedo-Delira, Rosalba; Alarcón, Alejandro; Mendoza-López, Ma Remedios; García-Barradas, Oscar; Cruz-Sánchez, Jesús Samuel; Ferrera-Cerrato, Ronald; Jiménez-Fernández, Maribel

2015-01-01

In an effort to develop alternate techniques to recover metals from waste electrical and electronic equipment (WEEE), this research evaluated the bioleaching efficiency of gold (Au), copper (Cu) and nickel (Ni) by two strains of Aspergillus niger in the presence of gold-plated finger integrated circuits found in computer motherboards (GFICMs) and cellular phone printed circuit boards (PCBs). These three metals were analyzed for their commercial value and their diverse applications in the industry. Au-bioleaching ranged from 42 to 1% for Aspergillus niger strain MXPE6; with the combination of Aspergillus niger MXPE6 + Aspergillus niger MX7, the Au-bioleaching was 87 and 28% for PCBs and GFICMs, respectively. In contrast, the bioleaching of Cu by Aspergillus niger MXPE6 was 24 and 5%; using the combination of both strains, the values were 0.2 and 29% for PCBs and GFICMs, respectively. Fungal Ni-leaching was only found for PCBs, but with no significant differences among treatments. Improvement of the metal recovery efficiency by means of fungal metabolism is also discussed.

Stable Polyurethane Coatings for Electronic Circuits

NASA Technical Reports Server (NTRS)

Morris, D. E.

1983-01-01

Alkane-based polyurethanes resist deterioration while maintaining good dielectric properties. Weight loss after prolonged immersion in hot water far less for alkane-based polyurethanes than for more common ether based polyurethanes, at any given oxygen content. Major uses of polyurethanes are as connector potting materials and conformal coatings for printed circuit boards.

High-Performance Screen-Printed Thermoelectric Films on Fabrics.

PubMed

Shin, Sunmi; Kumar, Rajan; Roh, Jong Wook; Ko, Dong-Su; Kim, Hyun-Sik; Kim, Sang Il; Yin, Lu; Schlossberg, Sarah M; Cui, Shuang; You, Jung-Min; Kwon, Soonshin; Zheng, Jianlin; Wang, Joseph; Chen, Renkun

2017-08-04

Printing techniques could offer a scalable approach to fabricate thermoelectric (TE) devices on flexible substrates for power generation used in wearable devices and personalized thermo-regulation. However, typical printing processes need a large concentration of binder additives, which often render a detrimental effect on electrical transport of the printed TE layers. Here, we report scalable screen-printing of TE layers on flexible fiber glass fabrics, by rationally optimizing the printing inks consisting of TE particles (p-type Bi 0.5 Sb 1.5 Te 3 or n-type Bi 2 Te 2.7 Se 0.3 ), binders, and organic solvents. We identified a suitable binder additive, methyl cellulose, which offers suitable viscosity for printability at a very small concentration (0.45-0.60 wt.%), thus minimizing its negative impact on electrical transport. Following printing, the binders were subsequently burnt off via sintering and hot pressing. We found that the nanoscale defects left behind after the binder burnt off became effective phonon scattering centers, leading to low lattice thermal conductivity in the printed n-type material. With the high electrical conductivity and low thermal conductivity, the screen-printed TE layers showed high room-temperature ZT values of 0.65 and 0.81 for p-type and n-type, respectively.

Modular control subsystems for use in solar heating systems for multi-family dwellings

NASA Technical Reports Server (NTRS)

1977-01-01

Progress in the development of solar heating modular control subsystems is reported. Circuit design, circuit drawings, and printed circuit board layout are discussed along with maintenance manuals, installation instructions, and verification and acceptance tests. Calculations made to determine the predicted performance of the differential thermostat are given including details and results of tests for the offset temperature, and boil and freeze protect points.

Phoenix Interferometer

DTIC Science & Technology

1975-06-01

proportioning circuit , Triac , and heater blankets. The significant features of the temperature controllers are small size, less than one half per...interferometer. The only change to the Firebird system needed to ac- commodate the new sensor is the replacement of several circuit boards. No hard wiring or...temperature at altitude (220oK). In addition to the sensor head, the Phoe- nix system also includes a set of plug-in printed circuit cards which

Effect of Bypass Capacitor in Common-mode Noise Reduction Technique for Automobile PCB

NASA Astrophysics Data System (ADS)

Uno, Takanori; Ichikawa, Kouji; Mabuchi, Yuichi; Nakamura, Atushi

In this letter, we studied the use of common mode noise reduction technique for in-vehicle electronic equipment, each comprising large-scale integrated circuit (LSI), printed circuit board (PCB), wiring harnesses, and ground plane. We have improved the model circuit of the common mode noise that flows to the wire harness to add the effect of by-pass capacitors located near an LSI.

Bead-on-string structure printed by electrohydrodynamic jet under alternating current electric field

NASA Astrophysics Data System (ADS)

Liu, Juan; Lin, Yihuang; Jiang, Jiaxin; Liu, Haiyan; Zhao, Yang; Zheng, Gaofeng

2016-09-01

Electrohydrodynamic printing (EHDP) under alternating current (AC) electric field provides a novel way for the precise micro-/nano-droplet printing. The AC electric field induces the free charge to reciprocate along the EHDP jet and changes the electric field force on the jet periodically. The stability of jet can be enhanced by increasing the voltage frequency, and the regular bead-on-string structure is direct-written along the trajectory of collector. The deposition frequency of bead structure increases with the increasing of voltage frequency, due to the short period of AC electric field. As the voltage frequency is increased from 10 to 60 Hz, the diameter of bead structure decreases from 200 to 110 µm. As the duty ration increased from 10 to 60 %, the diameter of bead structure increased from 100 to 140 µm. This work would accelerate the development and the application of micro-/nano-printing technology in the fields of flexible electronic and micro-/nano-system.

Combining Different Conceptual Change Methods within Four-Step Constructivist Teaching Model: A Sample Teaching of Series and Parallel Circuits

ERIC Educational Resources Information Center

Ipek, Hava; Calik, Muammer

2008-01-01

Based on students' alternative conceptions of the topics "electric circuits", "electric charge flows within an electric circuit", "how the brightness of bulbs and the resistance changes in series and parallel circuits", the current study aims to present a combination of different conceptual change methods within a four-step constructivist teaching…

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Greener approach for the extraction of copper metal from electronic waste.

PubMed

Jadhao, Prashant; Chauhan, Garima; Pant, K K; Nigam, K D P

2016-11-01

Technology innovations resulted into a major move from agricultural to industrial economy in last few decades. Consequently, generation of waste electronic and electrical equipments (WEEE) has been increased at a significant rate. WEEE contain large amount of precious and heavy metals and therefore, can be considered a potential secondary resource to overcome the scarcity of metals. Also, presence of these metals may affect the ecosystem due to lack of adequate management of WEEE. Building upon our previous experimental investigations for metal extraction from spent catalyst, present study explores the concept of green technology for WEEE management. Efforts have been made to recover base metal from a printed circuit board using eco-friendly chelation technology and results were compared with the conventional acid leaching method. 83.8% recovery of copper metal was achieved using chelation technology whereas only 27% could be recovered using acid leaching method in absence of any oxidant at optimum reaction conditions. Various characterization studies (energy dispersive X-ray analysis, scanning electron microscopy, X-ray diffraction, inductive coupled plasma spectrophotometry) of Printed Circuit Board (PCB) and residues were performed for qualitative and quantitative analysis of samples. Significant metal extraction, more than 96% recovery of chelating agent, recycling of reactant in next chelation cycle and nearly zero discharge to the environment are the major advantages of the proposed green process which articulate the transcendency of chelation technology over other conventional approaches. Kinetic investigation suggests diffusion controlled process as the rate determining step for the chelate assisted recovery of copper from WEEE with activation energy of 22kJ/mol. Copyright © 2015 Elsevier Ltd. All rights reserved.

Separation and recovery of fine particles from waste circuit boards using an inflatable tapered diameter separation bed.

PubMed

Duan, Chenlong; Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

2014-01-01

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (-0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5-0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25-0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (-0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution.

Quantitative analysis of peel-off degree for printed electronics

NASA Astrophysics Data System (ADS)

Park, Janghoon; Lee, Jongsu; Sung, Ki-Hak; Shin, Kee-Hyun; Kang, Hyunkyoo

2018-02-01

We suggest a facile methodology of peel-off degree evaluation by image processing on printed electronics. The quantification of peeled and printed areas was performed using open source programs. To verify the accuracy of methods, we manually removed areas from the printed circuit that was measured, resulting in 96.3% accuracy. The sintered patterns showed a decreasing tendency in accordance with the increase in the energy density of an infrared lamp, and the peel-off degree increased. Thus, the comparison between both results was presented. Finally, the correlation between performance characteristics was determined by quantitative analysis.

Transition-edge sensor with enhanced electrothermal feedback for cryogenic particle detection

DOEpatents

Nam, Sae Woo; Cabrera, Blas

2001-01-01

A superconducting transition-edge sensor with an electrothermal-feedback circuit, a heat sink thermally coupled thereto, a bias-feedback circuit electrically coupled with the electrothermal feedback circuit, and a current sensor electrically coupled with the bias-feedback circuit and inductively coupled with the electrothermal-feedback circuit.

A Bioactive Carbon Nanotube-Based Ink for Printing 2D and 3D Flexible Electronics.

PubMed

Shin, Su Ryon; Farzad, Raziyeh; Tamayol, Ali; Manoharan, Vijayan; Mostafalu, Pooria; Zhang, Yu Shrike; Akbari, Mohsen; Jung, Sung Mi; Kim, Duckjin; Comotto, Mattia; Annabi, Nasim; Al-Hazmi, Faten Ebrahim; Dokmeci, Mehmet R; Khademhosseini, Ali

2016-05-01

The development of electrically conductive carbon nanotube-based inks is reported. Using these inks, 2D and 3D structures are printed on various flexible substrates such as paper, hydrogels, and elastomers. The printed patterns have mechanical and electrical properties that make them beneficial for various biological applications. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Packaging printed circuit boards: A production application of interactive graphics

NASA Technical Reports Server (NTRS)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Organic transistors manufactured using inkjet technology with subfemtoliter accuracy

PubMed Central

Sekitani, Tsuyoshi; Noguchi, Yoshiaki; Zschieschang, Ute; Klauk, Hagen; Someya, Takao

2008-01-01

A major obstacle to the development of organic transistors for large-area sensor, display, and circuit applications is the fundamental compromise between manufacturing efficiency, transistor performance, and power consumption. In the past, improving the manufacturing efficiency through the use of printing techniques has inevitably resulted in significantly lower performance and increased power consumption, while attempts to improve performance or reduce power have led to higher process temperatures and increased manufacturing cost. Here, we lift this fundamental limitation by demonstrating subfemtoliter inkjet printing to define metal contacts with single-micrometer resolution on the surface of high-mobility organic semiconductors to create high-performance p-channel and n-channel transistors and low-power complementary circuits. The transistors employ an ultrathin low-temperature gate dielectric based on a self-assembled monolayer that allows transistors and circuits on rigid and flexible substrates to operate with very low voltages. PMID:18362348

3D Printed Shock Mitigating Structures

NASA Astrophysics Data System (ADS)

Schrand, Amanda; Elston, Edwin; Dennis, Mitzi; Metroke, Tammy; Chen, Chenggang; Patton, Steven; Ganguli, Sabyasachi; Roy, Ajit

Here we explore the durability, and shock mitigating potential, of solid and cellular 3D printed polymers and conductive inks under high strain rate, compressive shock wave and high g acceleration conditions. Our initial designs include a simple circuit with 4 resistors embedded into circular discs and a complex cylindrical gyroid shape. A novel ink consisting of silver-coated carbon black nanoparticles in a thermoplastic polyurethane was used as the trace material. One version of the disc structural design has the advantage of allowing disassembly after testing for direct failure analysis. After increasing impacts, printed and traditionally potted circuits were examined for functionality. Additionally, in the open disc design, trace cracking and delamination of resistors were able to be observed. In a parallel study, we examined the shock mitigating behavior of 3D printed cellular gyroid structures on a Split Hopkinson Pressure Bar (SHPB). We explored alterations to the classic SHPB setup for testing the low impedance, cellular samples to most accurately reflect the stress state inside the sample (strain rates from 700 to 1750 s-1). We discovered that the gyroid can effectively absorb the impact of the test resulting in crushing the structure. Future studies aim to tailor the unit cell dimensions for certain frequencies, increase print accuracy and optimize material compositions for conductivity and adhesion to manufacture more durable devices.

Thin-film copper indium gallium selenide solar cell based on low-temperature all-printing process.

PubMed

Singh, Manjeet; Jiu, Jinting; Sugahara, Tohru; Suganuma, Katsuaki

2014-09-24

In the solar cell field, development of simple, low-cost, and low-temperature fabrication processes has become an important trend for energy-saving and environmental issues. Copper indium gallium selenide (CIGS) solar cells have attracted much attention due to the high absorption coefficient, tunable band gap energy, and high efficiency. However, vacuum and high-temperature processing in fabrication of solar cells have limited the applications. There is a strong need to develop simple and scalable methods. In this work, a CIGS solar cell based on all printing steps and low-temperature annealing is developed. CIGS absorber thin film is deposited by using dodecylamine-stabilized CIGS nanoparticle ink followed by printing buffer layer. Silver nanowire (AgNW) ink and sol-gel-derived ZnO precursor solution are used to prepare a highly conductive window layer ZnO/[AgNW/ZnO] electrode with a printing method that achieves 16 Ω/sq sheet resistance and 94% transparency. A CIGS solar cell based on all printing processes exhibits efficiency of 1.6% with open circuit voltage of 0.48 V, short circuit current density of 9.7 mA/cm(2), and fill factor of 0.34 for 200 nm thick CIGS film, fabricated under ambient conditions and annealed at 250 °C.

Electric Circuit Theory--Computer Illustrated Text.

ERIC Educational Resources Information Center

Riches, Brian

1990-01-01

Discusses the use of a computer-illustrated text (CIT) with integrated software to teach electric circuit theory to college students. Examples of software use are given, including simple animation, graphical displays, and problem-solving programs. Issues affecting electric circuit theory instruction are also addressed, including mathematical…

Design of pressure-driven microfluidic networks using electric circuit analogy.

PubMed

Oh, Kwang W; Lee, Kangsun; Ahn, Byungwook; Furlani, Edward P

2012-02-07

This article reviews the application of electric circuit methods for the analysis of pressure-driven microfluidic networks with an emphasis on concentration- and flow-dependent systems. The application of circuit methods to microfluidics is based on the analogous behaviour of hydraulic and electric circuits with correlations of pressure to voltage, volumetric flow rate to current, and hydraulic to electric resistance. Circuit analysis enables rapid predictions of pressure-driven laminar flow in microchannels and is very useful for designing complex microfluidic networks in advance of fabrication. This article provides a comprehensive overview of the physics of pressure-driven laminar flow, the formal analogy between electric and hydraulic circuits, applications of circuit theory to microfluidic network-based devices, recent development and applications of concentration- and flow-dependent microfluidic networks, and promising future applications. The lab-on-a-chip (LOC) and microfluidics community will gain insightful ideas and practical design strategies for developing unique microfluidic network-based devices to address a broad range of biological, chemical, pharmaceutical, and other scientific and technical challenges.

All-printed capacitors with continuous solution dispensing technology

NASA Astrophysics Data System (ADS)

Ge, Yang; Plötner, Matthias; Berndt, Andreas; Kumar, Amit; Voit, Brigitte; Pospiech, Doris; Fischer, Wolf-Joachim

2017-09-01

Printed electronics have been introduced into the commercial markets in recent years. Various printing technologies have emerged aiming to process printed electronic devices with low cost, environmental friendliness, and compatibility with large areas and flexible substrates. The aim of this study is to propose a continuous solution dispensing technology for processing all-printed thin-film capacitors on glass substrates using a leading-edge printing instrument. Among all printing technologies, this study provides concrete proof of the following outstanding advantages of this technology: high tolerance to inks, high throughput, low cost, and precise pattern transfers. Ag nanoparticle ink based on glycol ethers was used to print the electrodes. To obtain dielectric ink, a copolymer powder of poly(methyl methacrylate-co-benzoylphenyl methacrylate) containing crosslinkable side groups was dissolved in anisole. Various layouts were designed to support multiple electronic applications. Scanning electron microscopy and atomic force microscopy were used to investigate the all-printed capacitor layers formed using the proposed process. Additionally, the printed capacitors were electrically characterized under direct current and alternating current. The measured electrical properties of the printed capacitors were consistent with the theoretical results.

Secondary School Students' Misconceptions about Simple Electric Circuits

ERIC Educational Resources Information Center

Küçüközer, Hüseyin; Kocakülah, Sabri

2007-01-01

The aim of this study is to reveal secondary school students' misconceptions about simple electric circuits and to define whether specific misconceptions peculiar to Turkish students exist within those identified. Data were obtained with a conceptual understanding test for simple electric circuits and semi-structured interviews. Conceptual…

46 CFR 111.91-1 - Power, control, and interlock circuits.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 111.91-1 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Elevators and Dumbwaiters § 111.91-1 Power, control, and interlock circuits. Each electric power, control, and interlock circuit of an elevator or dumbwaiter must meet ASME...

46 CFR 111.91-1 - Power, control, and interlock circuits.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 111.91-1 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Elevators and Dumbwaiters § 111.91-1 Power, control, and interlock circuits. Each electric power, control, and interlock circuit of an elevator or dumbwaiter must meet ASME...

46 CFR 111.91-1 - Power, control, and interlock circuits.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 111.91-1 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Elevators and Dumbwaiters § 111.91-1 Power, control, and interlock circuits. Each electric power, control, and interlock circuit of an elevator or dumbwaiter must meet ASME...

46 CFR 111.91-1 - Power, control, and interlock circuits.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 111.91-1 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Elevators and Dumbwaiters § 111.91-1 Power, control, and interlock circuits. Each electric power, control, and interlock circuit of an elevator or dumbwaiter must meet ASME...

46 CFR 111.91-1 - Power, control, and interlock circuits.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 111.91-1 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Elevators and Dumbwaiters § 111.91-1 Power, control, and interlock circuits. Each electric power, control, and interlock circuit of an elevator or dumbwaiter must meet ASME...

49 CFR 236.16 - Electric lock, main track releasing circuit.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Electric lock, main track releasing circuit. 236... RAILROAD ADMINISTRATION, DEPARTMENT OF TRANSPORTATION RULES, STANDARDS, AND INSTRUCTIONS GOVERNING THE... Rules and Instructions: All Systems General § 236.16 Electric lock, main track releasing circuit. When...

Electroshock protection circuit

NASA Technical Reports Server (NTRS)

Heskett, H.; Meincer, J.; Inglis, A. L.

1973-01-01

Circuit was developed to prevent accidental shock through electrodes used to test subjects as part of Skylab program. This circuit is placed between electrical apparatus and electrode that is attached to patient's body. Thus, patient is effectively protected from dangerous electrical shock that might be caused by failure in electrical apparatus.

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation

PubMed Central

Li, Ying-Chang; Chang, Yuan-Hsiao; Singh, Preetpal; Chang, Liann-Be; Yeh, Der-Hwa; Chao, Ting-Yu; Jian, Si-Yun; Li, Yu-Chi; Lai, Chao-Sung; Ying, Shang-Ping

2018-01-01

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts’ material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method. PMID:29494534

RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation.

PubMed

Li, Ying-Chang; Chang, Yuan-Hsiao; Singh, Preetpal; Chang, Liann-Be; Yeh, Der-Hwa; Chao, Ting-Yu; Jian, Si-Yun; Li, Yu-Chi; Tan, Cher Ming; Lai, Chao-Sung; Chow, Lee; Ying, Shang-Ping

2018-03-01

The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.

[Characterization of pyrolysis of waste printed circuit boards by high-resolution pyrolysis gas chromatography-mass spectrometry].

PubMed

Zhang, Yanhong; Huang, Hong; Xia, Zhengbin; Chen, Huanqin

2008-07-01

Thermal degradation of pyrolysis of waste circuit boards was investigated by high-resolution pyrolysis gas chromatography-mass spectrometry (PyGC-MS) and thermogravimetry (TG). In helium atmosphere, the products of FR-4 waste printed circuit board were pyrolyzed at 350, 450, 550, 650, and 750 degrees degrees C, separately, and the pyrolysis products were identified by online MS. The results indicated that the pyrolysis products of the FR-4 waste circuit board were three kinds of substances, such as the low boiling point products, phenol, bisphenol and their related products. Moreover, under 300 degrees degrees C, only observed less pyrolysis products. As the increase of pyrolysis temperature, the relative content of the low boiling point products increased. In the range of 450-650 degrees degrees C, the qualitative analysis and character were similar, and the relative contents of phenol and bisphenol were higher. The influence of pyrolysis temperature on pyrolyzate yields was studied. On the basis of the pyrolyzate profile and the dependence of pyrolyzate yields on pyrolysis temperature, the thermal degradation mechanism of brominated epoxy resin was proposed.

Integrated testing system FiTest for diagnosis of PCBA

NASA Astrophysics Data System (ADS)

Bogdan, Arkadiusz; Lesniak, Adam

2016-12-01

This article presents the innovative integrated testing system FiTest for automatic, quick inspection of printed circuit board assemblies (PCBA) manufactured in Surface Mount Technology (SMT). Integration of Automatic Optical Inspection (AOI), In-Circuit Tests (ICT) and Functional Circuit Tests (FCT) resulted in universal hardware platform for testing variety of electronic circuits. The platform provides increased test coverage, decreased level of false calls and optimization of test duration. The platform is equipped with powerful algorithms performing tests in a stable and repetitive way and providing effective management of diagnosis.

Water Activated Graphene Oxide Transfer Using Wax Printed Membranes for Fast Patterning of a Touch Sensitive Device.

PubMed

Baptista-Pires, Luis; Mayorga-Martínez, Carmen C; Medina-Sánchez, Mariana; Montón, Helena; Merkoçi, Arben

2016-01-26

We demonstrate a graphene oxide printing technology using wax printed membranes for the fast patterning and water activation transfer using pressure based mechanisms. The wax printed membranes have 50 μm resolution, longtime stability and infinite shaping capability. The use of these membranes complemented with the vacuum filtration of graphene oxide provides the control over the thickness. Our demonstration provides a solvent free methodology for printing graphene oxide devices in all shapes and all substrates using the roll-to-roll automatized mechanism present in the wax printing machine. Graphene oxide was transferred over a wide variety of substrates as textile or PET in between others. Finally, we developed a touch switch sensing device integrated in a LED electronic circuit.

Future opportunities for advancing glucose test device electronics.

PubMed

Young, Brian R; Young, Teresa L; Joyce, Margaret K; Kennedy, Spencer I; Atashbar, Massood Z

2011-09-01

Advancements in the field of printed electronics can be applied to the field of diabetes testing. A brief history and some new developments in printed electronics components applicable to personal test devices, including circuitry, batteries, transmission devices, displays, and sensors, are presented. Low-cost, thin, and lightweight materials containing printed circuits with energy storage or harvest capability and reactive/display centers, made using new printing/imaging technologies, are ideal for incorporation into personal-use medical devices such as glucose test meters. Semicontinuous rotogravure printing, which utilizes flexible substrates and polymeric, metallic, and/or nano "ink" composite materials to effect rapidly produced, lower-cost printed electronics, is showing promise. Continuing research advancing substrate, "ink," and continuous processing development presents the opportunity for research collaboration with medical device designers. © 2011 Diabetes Technology Society.

Interferometric direction finding with a metamaterial detector

NASA Astrophysics Data System (ADS)

Venkatesh, Suresh; Shrekenhamer, David; Xu, Wangren; Sonkusale, Sameer; Padilla, Willie; Schurig, David

2013-12-01

We present measurements and analysis demonstrating useful direction finding of sources in the S band (2-4 GHz) using a metamaterial detector. An augmented metamaterial absorber that supports magnitude and phase measurement of the incident electric field, within each unit cell, is described. The metamaterial is implemented in a commercial printed circuit board process with off-board back-end electronics. We also discuss on-board back-end implementation strategies. Direction finding performance is analyzed for the fabricated metamaterial detector using simulated data and the standard algorithm, MUtiple SIgnal Classification. The performance of this complete system is characterized by its angular resolution as a function of radiation density at the detector. Sources with power outputs typical of mobile communication devices can be resolved at kilometer distances with sub-degree resolution and high frame rates.

High-Performance Screen-Printed Thermoelectric Films on Fabrics

DOE PAGES

Shin, Sunmi; Kumar, Rajan; Roh, Jong Wook; ...

2017-08-04

Printing techniques could offer a scalable approach to fabricate thermoelectric (TE) devices on flexible substrates for power generation used in wearable devices and personalized thermo-regulation. However, typical printing processes need a large concentration of binder additives, which often render a detrimental effect on electrical transport of the printed TE layers. Here, we report scalable screenprinting of TE layers on flexible fiber glass fabrics, by rationally optimizing the printing inks consisting of TE particles (p-type Bi 0.5Sb 1.5Te 3 or n-type Bi 2Te 2.7Se 0.3), binders, and organic solvents. We identified a suitable binder additive, methyl cellulose, which offers suitable viscositymore » for printability at a very small concentration (0.45–0.60 wt.%), thus minimizing its negative impact on electrical transport. Following printing, the binders were subsequently burnt off via sintering and hot pressing. We found that the nanoscale defects left behind after the binder burnt off became effective phonon scattering centers, leading to low lattice thermal conductivity in the printed n-type material. With the high electrical conductivity and low thermal conductivity, the screen-printed TE layers showed high room-temperature ZT values of 0.65 and 0.81 for p-type and n-type, respectively.« less

High-Performance Screen-Printed Thermoelectric Films on Fabrics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shin, Sunmi; Kumar, Rajan; Roh, Jong Wook

Printing techniques could offer a scalable approach to fabricate thermoelectric (TE) devices on flexible substrates for power generation used in wearable devices and personalized thermo-regulation. However, typical printing processes need a large concentration of binder additives, which often render a detrimental effect on electrical transport of the printed TE layers. Here, we report scalable screenprinting of TE layers on flexible fiber glass fabrics, by rationally optimizing the printing inks consisting of TE particles (p-type Bi 0.5Sb 1.5Te 3 or n-type Bi 2Te 2.7Se 0.3), binders, and organic solvents. We identified a suitable binder additive, methyl cellulose, which offers suitable viscositymore » for printability at a very small concentration (0.45–0.60 wt.%), thus minimizing its negative impact on electrical transport. Following printing, the binders were subsequently burnt off via sintering and hot pressing. We found that the nanoscale defects left behind after the binder burnt off became effective phonon scattering centers, leading to low lattice thermal conductivity in the printed n-type material. With the high electrical conductivity and low thermal conductivity, the screen-printed TE layers showed high room-temperature ZT values of 0.65 and 0.81 for p-type and n-type, respectively.« less

Teaching Electricity and Engineering with LEDs

ERIC Educational Resources Information Center

Johnstone, Christopher

2014-01-01

When learning about electricity, students are typically asked to complete a simple circuit involving a battery, wire, and lightbulb. This activity can be enhanced by adding discussion and discourse and can take on a unique final form in the case of "The Friendship Detector." In such electrical circuit activities, the completed circuit is…

Shock absorbing mount for electrical components

NASA Technical Reports Server (NTRS)

Dillon, R. F., Jr.; Mayne, R. C. (Inventor)

1975-01-01

A shock mount for installing electrical components on circuit boards is described. The shock absorber is made of viscoelastic material which interconnects the electrical components. With this system, shocks imposed on one component of the circuit are not transmitted to other components. A diagram of a typical circuit is provided.

User's Guide for Computer Program that Routes Signal Traces

NASA Technical Reports Server (NTRS)

Hedgley, David R., Jr.

2000-01-01

This disk contains both a FORTRAN computer program and the corresponding user's guide that facilitates both its incorporation into your system and its utility. The computer program represents an efficient algorithm that routes signal traces on layers of a printed circuit with both through-pins and surface mounts. The computer program included is an implementation of the ideas presented in the theoretical paper titled "A Formal Algorithm for Routing Signal Traces on a Printed Circuit Board", NASA TP-3639 published in 1996. The computer program in the "connects" file can be read with a FORTRAN compiler and readily integrated into software unique to each particular environment where it might be used.

Some didactical suggestions for a deeper embedding of DC circuits into electromagnetism

NASA Astrophysics Data System (ADS)

Cavinato, M.; Giliberti, M.; Barbieri, S. R.

2017-09-01

Undergraduate students often encounter great difficulties in understanding Ohm’s law and electrical circuits. Considering the widespread students’ beliefs and their common mistakes, as they come out from the literature and our teaching experience, we think that a relevant source of these problems comes from the fact that electrical circuits are generally treated separately from the other topics of electromagnetism, with poor reference to the circulation of the electric field. We present here a way to deal with electrical circuits that could help students to overcome their difficulties. In our approach, the electric field is the protagonist and the mathematical tool the students are asked to use is its circulation. In the light of the circulation of the electric field, the experimental Ohm’s law is revisited, the concept of electromotive force is discussed and some suggestions to eliminate common misconceptions about the role of a battery in a circuit are presented.

10. Photocopy of photograph (original print from Southern Pacific Transportation ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

10. Photocopy of photograph (original print from Southern Pacific Transportation Company) ca. 1916, photographer unknown VIEW OF ORIGINAL PACIFIC ELECTRIC RAILWAY LYNWOOD SHELTER SHED - Lynwood Pacific Electric Railway Depot, 11453 Long Beach Boulevard, Lynwood, Los Angeles County, CA

Radiation-induced insulator discharge pulses in the CRRES internal discharge monitor satellite experiment

NASA Technical Reports Server (NTRS)

Frederickson, A. R.; Mullen, E. G.; Brautigam, D. H.; Kerns, K. J.

1992-01-01

The Internal Discharge Monitor (IDM) was designed to observe electrical pulses from common electrical insulators in space service. The sixteen insulator samples included twelve planar printed circuit boards and four cables. The samples were fully enclosed, mutually isolated, and space radiation penetrated 0.02 cm of aluminum before striking the samples. Pulsing began on the seventh orbit, the maximum pulse rate occurred on the seventeenth orbit when 13 pulses occurred, and the pulses slowly diminished to about one per 3 orbits six months later. After 8 months, the radiation belts abruptly increased and the pulse rates attained a new high. These pulse rates were in agreement with laboratory experience on shorter time scales. Several of the samples never pulsed. If the pulses were not confined within IDM, the physical processes could spread to become a full spacecraft anomaly. The IDM results indicate the rate at which small insulator pulses occur. Small pulses are the seeds of larger satellite electrical anomalies. The pulse rates are compared with space radiation intensities, L shell location, and spectral distributions from the radiation spectrometers on the Combined Release and Radiation Effects Satellite.

On equivalent resistance of electrical circuits

NASA Astrophysics Data System (ADS)

Kagan, Mikhail

2015-01-01

While the standard (introductory physics) way of computing the equivalent resistance of nontrivial electrical circuits is based on Kirchhoff's rules, there is a mathematically and conceptually simpler approach, called the method of nodal potentials, whose basic variables are the values of the electric potential at the circuit's nodes. In this paper, we review the method of nodal potentials and illustrate it using the Wheatstone bridge as an example. We then derive a closed-form expression for the equivalent resistance of a generic circuit, which we apply to a few sample circuits. The result unveils a curious interplay between electrical circuits, matrix algebra, and graph theory and its applications to computer science. The paper is written at a level accessible by undergraduate students who are familiar with matrix arithmetic. Additional proofs and technical details are provided in appendices.

Reusable vibration resistant integrated circuit mounting socket

DOEpatents

Evans, Craig N.

1995-01-01

This invention discloses a novel form of socket for integrated circuits to be mounted on printed circuit boards. The socket uses a novel contact which is fabricated out of a bimetallic strip with a shape which makes the end of the strip move laterally as temperature changes. The end of the strip forms a barb which digs into an integrated circuit lead at normal temperatures and holds it firmly in the contact, preventing loosening and open circuits from vibration. By cooling the contact containing the bimetallic strip the barb end can be made to release so that the integrated circuit lead can be removed from the socket without damage either to the lead or to the socket components.

30 CFR 57.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2011 CFR

2011-07-01

... Extraneous Electricity-Surface and Underground § 57.6605 Isolation of blasting circuits. Lead wires and... shall be protected from sources of stray or static electricity. Blasting circuits shall be protected...

30 CFR 57.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2012 CFR

2012-07-01

... Extraneous Electricity-Surface and Underground § 57.6605 Isolation of blasting circuits. Lead wires and... shall be protected from sources of stray or static electricity. Blasting circuits shall be protected...

30 CFR 57.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2014 CFR

2014-07-01

... Extraneous Electricity-Surface and Underground § 57.6605 Isolation of blasting circuits. Lead wires and... shall be protected from sources of stray or static electricity. Blasting circuits shall be protected...

30 CFR 57.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Extraneous Electricity-Surface and Underground § 57.6605 Isolation of blasting circuits. Lead wires and... shall be protected from sources of stray or static electricity. Blasting circuits shall be protected...

An investigation of the effect of instruction in physics on the formation of mental models for problem-solving in the context of simple electric circuits

NASA Astrophysics Data System (ADS)

Beh, Kian Lim

2000-10-01

This study was designed to explore the effect of a typical traditional method of instruction in physics on the formation of useful mental models among college students for problem-solving using simple electric circuits as a context. The study was also aimed at providing a comprehensive description of the understanding regarding electric circuits among novices and experts. In order to achieve these objectives, the following two research approaches were employed: (1) A students survey to collect data from 268 physics students; and (2) An interview protocol to collect data from 23 physics students and 24 experts (including 10 electrical engineering graduates, 4 practicing electrical engineers, 2 secondary school physics teachers, 8 physics lecturers, and 4 electrical engineers). Among the major findings are: (1) Most students do not possess accurate models of simple electric circuits as presented implicitly in physics textbooks; (2) Most students display good procedural understanding for solving simple problems concerning electric circuits but have no in-depth conceptual understanding in terms of practical knowledge of current, voltage, resistance, and circuit connections; (3) Most students encounter difficulty in discerning parallel connections that are drawn in a non-conventional format; (4) After a year of college physics, students show significant improvement in areas, including practical knowledge of current and voltage, ability to compute effective resistance and capacitance, ability to identify circuit connections, and ability to solve problems; however, no significance was found in practical knowledge of resistance and ability to connect circuits; and (5) The differences and similarities between the physics students and the experts include: (a) Novices perceive parallel circuits more in terms of 'branch', 'current', and 'resistors with the same resistance' while experts perceive parallel circuits more in terms of 'node', 'voltage', and 'less resistance'; and (b) Both novices and experts use phrases such as 'side-by side' and 'one on top of the other' in describing parallel circuits which emphasize the geometry of the standard circuit drawing when describing parallel resistors.

Nuclear code case development of printed-circuit heat exchangers with thermal and mechanical performance testing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Aakre, Shaun R.; Jentz, Ian W.; Anderson, Mark H.

The U.S. Department of Energy has agreed to fund a three-year integrated research project to close technical gaps involved with compact heat exchangers to be used in nuclear applications. This paper introduces the goals of the project, the research institutions, and industrial partners working in collaboration to develop a draft Boiler and Pressure Vessel Code Case for this technology. Heat exchanger testing, as well as non-destructive and destructive evaluation, will be performed by researchers across the country to understand the performance of compact heat exchangers. Testing will be performed using coolants and conditions proposed for Gen IV Reactor designs. Preliminarymore » observations of the mechanical failure mechanisms of the heat exchangers using destructive and non-destructive methods is presented. Unit-cell finite element models assembled to help predict the mechanical behavior of these high-temperature components are discussed as well. Performance testing methodology is laid out in this paper along with preliminary modeling results, an introduction to x-ray and neutron inspection techniques, and results from a recent pressurization test of a printed-circuit heat exchanger. The operational and quality assurance knowledge gained from these models and validation tests will be useful to developers of supercritical CO 2 systems, which commonly employ printed-circuit heat exchangers.« less

Logic circuits composed of flexible carbon nanotube thin-film transistor and ultra-thin polymer gate dielectric

PubMed Central

Lee, Dongil; Yoon, Jinsu; Lee, Juhee; Lee, Byung-Hyun; Seol, Myeong-Lok; Bae, Hagyoul; Jeon, Seung-Bae; Seong, Hyejeong; Im, Sung Gap; Choi, Sung-Jin; Choi, Yang-Kyu

2016-01-01

Printing electronics has become increasingly prominent in the field of electronic engineering because this method is highly efficient at producing flexible, low-cost and large-scale thin-film transistors. However, TFTs are typically constructed with rigid insulating layers consisting of oxides and nitrides that are brittle and require high processing temperatures, which can cause a number of problems when used in printed flexible TFTs. In this study, we address these issues and demonstrate a method of producing inkjet-printed TFTs that include an ultra-thin polymeric dielectric layer produced by initiated chemical vapor deposition (iCVD) at room temperature and highly purified 99.9% semiconducting carbon nanotubes. Our integrated approach enables the production of flexible logic circuits consisting of CNT-TFTs on a polyethersulfone (PES) substrate that have a high mobility (up to 9.76 cm2 V−1 sec−1), a low operating voltage (less than 4 V), a high current on/off ratio (3 × 104), and a total device yield of 90%. Thus, it should be emphasized that this study delineates a guideline for the feasibility of producing flexible CNT-TFT logic circuits with high performance based on a low-cost and simple fabrication process. PMID:27184121

Logic circuits composed of flexible carbon nanotube thin-film transistor and ultra-thin polymer gate dielectric

NASA Astrophysics Data System (ADS)

Lee, Dongil; Yoon, Jinsu; Lee, Juhee; Lee, Byung-Hyun; Seol, Myeong-Lok; Bae, Hagyoul; Jeon, Seung-Bae; Seong, Hyejeong; Im, Sung Gap; Choi, Sung-Jin; Choi, Yang-Kyu

2016-05-01

Printing electronics has become increasingly prominent in the field of electronic engineering because this method is highly efficient at producing flexible, low-cost and large-scale thin-film transistors. However, TFTs are typically constructed with rigid insulating layers consisting of oxides and nitrides that are brittle and require high processing temperatures, which can cause a number of problems when used in printed flexible TFTs. In this study, we address these issues and demonstrate a method of producing inkjet-printed TFTs that include an ultra-thin polymeric dielectric layer produced by initiated chemical vapor deposition (iCVD) at room temperature and highly purified 99.9% semiconducting carbon nanotubes. Our integrated approach enables the production of flexible logic circuits consisting of CNT-TFTs on a polyethersulfone (PES) substrate that have a high mobility (up to 9.76 cm2 V-1 sec-1), a low operating voltage (less than 4 V), a high current on/off ratio (3 × 104), and a total device yield of 90%. Thus, it should be emphasized that this study delineates a guideline for the feasibility of producing flexible CNT-TFT logic circuits with high performance based on a low-cost and simple fabrication process.

Removing lead from metallic mixture of waste printed circuit boards by vacuum distillation: factorial design and removal mechanism.

PubMed

Li, Xingang; Gao, Yujie; Ding, Hui

2013-10-01

The lead removal from the metallic mixture of waste printed circuit boards by vacuum distillation was optimized using experimental design, and a mathematical model was established to elucidate the removal mechanism. The variables studied in lead evaporation consisted of the chamber pressure, heating temperature, heating time, particle size and initial mass. The low-level chamber pressure was fixed at 0.1 Pa as the operation pressure. The application of two-level factorial design generated a first-order polynomial that agreed well with the data for evaporation efficiency of lead. The heating temperature and heating time exhibited significant effects on the efficiency, which was validated by means of the copper-lead mixture experiments. The optimized operating conditions within the region studied were the chamber pressure of 0.1 Pa, heating temperature of 1023 K and heating time of 120 min. After the conditions were employed to remove lead from the metallic mixture of waste printed circuit boards, the efficiency was 99.97%. The mechanism of the effects was elucidated by mathematical modeling that deals with evaporation, mass transfer and condensation, and can be applied to a wider range of metal removal by vacuum distillation. Copyright © 2013 Elsevier Ltd. All rights reserved.

Low energy switching driver for printed electrochromic displays

NASA Astrophysics Data System (ADS)

Ionescu, Ciprian; Dobre, Robert Alexandru

2016-12-01

This paper continues our investigations in relatively new developed printed electrochromic displays (ECDs). There are some advantages of ECDs that recommend them for specific low end and short time disposable display applications, for instance the ECD devices present low power consumption (they are non-emissive, reflective, i.e. passive) and have a good viewing angle, looking like ink on paper. It is to note that these displays are still in research, and partly present on the market. There are a lot of papers regarding the chemistry and electro-chemistry of the device, but very few about concrete schematics for driving these displays. Due to their low penetration in applications, and due to lack of standardization, there are not yet realized custom drivers in form of integrated circuits. The driving of these circuits is not at all so simple. These are very sensitive devices in what it concerns exceeding the drive pulse duration and voltage level. In order to take full advantage of the low power consumption of this device, a good driver circuitry needs to be realized also in the "low power" class. We propose in this paper an original driving circuit, that has very low consumption and that can be even supplied by a supercapacitor or by a printed battery. The whole structure can be further integrated as a system on foil.

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems

NASA Astrophysics Data System (ADS)

Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan

2015-04-01

This paper presents the results of humidity testing of weak organic acids (WOAs), namely adipic, succinic, glutaric, dl-malic, and palmitic acids, which are commonly used as activators in no-clean solder fluxes. The study was performed under humidity conditions varying from 60% relative humidity (RH) to ˜99%RH at 25°C. The following parameters were used for characterization of WOAs: mass gain due to water adsorption and deliquescence of the WOA (by quartz crystal microbalance), resistivity of the water layer formed on the printed circuit board (by impedance spectroscopy), and leakage current measured using the surface insulation resistance pattern in the potential range from 0 V to 10 V. The combined results indicate the importance of the WOA chemical structure for the water adsorption and therefore conductive water layer formation on the printed circuit board assembly (PCBA). A substantial increase of leakage currents and probability of electrochemical migration was observed at humidity levels above the RH corresponding to the deliquescence point of WOAs present as contaminants on the printed circuit boards. The results suggest that use of solder fluxes with WOAs having higher deliquescence point could improve the reliability of electronics operating under circumstances in which exposure to high humidity is likely to occur.

A large-area wireless power-transmission sheet using printed organic transistors and plastic MEMS switches.

PubMed

Sekitani, Tsuyoshi; Takamiya, Makoto; Noguchi, Yoshiaki; Nakano, Shintaro; Kato, Yusaku; Sakurai, Takayasu; Someya, Takao

2007-06-01

The electronics fields face serious problems associated with electric power; these include the development of ecologically friendly power-generation systems and ultralow-power-consuming circuits. Moreover, there is a demand for developing new power-transmission methods in the imminent era of ambient electronics, in which a multitude of electronic devices such as sensor networks will be used in our daily life to enhance security, safety and convenience. We constructed a sheet-type wireless power-transmission system by using state-of-the-art printing technologies using advanced electronic functional inks. This became possible owing to recent progress in organic semiconductor technologies; the diversity of chemical syntheses and processes on organic materials has led to a new class of organic semiconductors, dielectric layers and metals with excellent electronic functionalities. The new system directly drives electronic devices by transmitting power of the order of tens of watts without connectors, thereby providing an easy-to-use and reliable power source. As all of the components are manufactured on plastic films, it is easy to place the wireless power-transmission sheet over desks, floors, walls and any other location imaginable.

Effectiveness of a worker-worn electric-field sensor to detect power-line proximity and electrical-contact.

PubMed

Zeng, Shengke; Powers, John R; Newbraugh, Bradley H

2010-06-01

Construction workers suffer the most electrocutions among all industries. Currently, there are no electrical contact warning devices on the market to protect workers. This paper proposes a worker-worn electric-field sensor. As the worker is in proximity to, or in contact with, a live power-circuit, the sensor sets off an audible/visual warning alarm. The sensor also has the potential to wirelessly trip a wireless-capable circuit breaker, and to trigger a wireless transmitter to notify emergency response of an electrical contact. An experiment was conducted to measure electric-field variation on simulated human-wrists (10 defrosted hog-legs) in various proximities and in electrical-contact to a simulated power-circuit. The purpose of these tests was to determine the feasibility of developing a worker-worn electric-field detection sensor for use in protecting workers from contact with energized electrical conductors. This study observed a significant electric-field-magnitude increase as a hog-leg approaches the live-circuit, and the distinct electric-field-magnitude jump as the leg contacts with the live-circuit. The observation indicates that this sensor can be an effective device to warn the workers of electrical hazards. Additionally, the sensor has the potential to wirelessly trip a wireless-capable circuit-breaker and trigger a wireless transmitter (such as a cell phone) to notify an emergency response. The prompt notification prevents the worker from further injury caused by postponed medical-care. Widespread use of this sensor could lower electrocution and electrically related injury rates in the construction industry. (c) 2010 Elsevier Ltd. All rights reserved.

30 CFR 56.6403 - Branch circuits.

Code of Federal Regulations, 2010 CFR

2010-07-01

... SAFETY AND HEALTH SAFETY AND HEALTH STANDARDS-SURFACE METAL AND NONMETAL MINES Explosives Electric Blasting § 56.6403 Branch circuits. (a) If electric blasting includes the use of branch circuits, each... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Branch circuits. 56.6403 Section 56.6403...

30 CFR 57.12025 - Grounding circuit enclosures.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Electricity Surface and Underground § 57.12025 Grounding circuit enclosures. All metal enclosing or encasing electrical circuits shall be grounded or provided with equivalent protection. This requirement does not apply... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Grounding circuit enclosures. 57.12025 Section...

A Comparison of Experienced and Preservice Elementary School Teachers' Content Knowledge and Pedagogical Content Knowledge about Electric Circuits

ERIC Educational Resources Information Center

Lin, Jing-Wen

2017-01-01

This study investigated the differences between Taiwanese experienced and preservice elementary school science teachers' content knowledge (CK) about electric circuits and their ability to predict students' preconceptions about electric circuits as an indicator of their pedagogical content knowledge (PCK). An innovative web-based recruitment and…

Measuring User Similarity Using Electric Circuit Analysis: Application to Collaborative Filtering

PubMed Central

Yang, Joonhyuk; Kim, Jinwook; Kim, Wonjoon; Kim, Young Hwan

2012-01-01

We propose a new technique of measuring user similarity in collaborative filtering using electric circuit analysis. Electric circuit analysis is used to measure the potential differences between nodes on an electric circuit. In this paper, by applying this method to transaction networks comprising users and items, i.e., user–item matrix, and by using the full information about the relationship structure of users in the perspective of item adoption, we overcome the limitations of one-to-one similarity calculation approach, such as the Pearson correlation, Tanimoto coefficient, and Hamming distance, in collaborative filtering. We found that electric circuit analysis can be successfully incorporated into recommender systems and has the potential to significantly enhance predictability, especially when combined with user-based collaborative filtering. We also propose four types of hybrid algorithms that combine the Pearson correlation method and electric circuit analysis. One of the algorithms exceeds the performance of the traditional collaborative filtering by 37.5% at most. This work opens new opportunities for interdisciplinary research between physics and computer science and the development of new recommendation systems PMID:23145095

Measuring user similarity using electric circuit analysis: application to collaborative filtering.

PubMed

Yang, Joonhyuk; Kim, Jinwook; Kim, Wonjoon; Kim, Young Hwan

2012-01-01

We propose a new technique of measuring user similarity in collaborative filtering using electric circuit analysis. Electric circuit analysis is used to measure the potential differences between nodes on an electric circuit. In this paper, by applying this method to transaction networks comprising users and items, i.e., user-item matrix, and by using the full information about the relationship structure of users in the perspective of item adoption, we overcome the limitations of one-to-one similarity calculation approach, such as the Pearson correlation, Tanimoto coefficient, and Hamming distance, in collaborative filtering. We found that electric circuit analysis can be successfully incorporated into recommender systems and has the potential to significantly enhance predictability, especially when combined with user-based collaborative filtering. We also propose four types of hybrid algorithms that combine the Pearson correlation method and electric circuit analysis. One of the algorithms exceeds the performance of the traditional collaborative filtering by 37.5% at most. This work opens new opportunities for interdisciplinary research between physics and computer science and the development of new recommendation systems.

Various mechanisms and clinical phenotypes in electrical short circuits of high-voltage devices: report of four cases and review of the literature.

PubMed

Tsurugi, Takuo; Matsui, Shogo; Nakajima, Hiroshi; Nishii, Nobuhiro; Honda, Toshihiro; Kaneko, Yoshiaki

2015-06-01

An electrical short circuit is a rare complication in a high-voltage implantable cardioverter-defibrillator (ICD). However, the inability of an ICD to deliver appropriate shock therapy can be life-threatening. During the last 2 years, four cases of serious complications related to an electrical short circuit have been reported in Japan. A spark due to an electrical short circuit resulted in the failure of an ICD shock to terminate ventricular tachycardia and total damage to the ICD generator in three of four cases. Two of the four patients died from an electrical short circuit between the right ventricle and superior vena cava (SVC) leads. The others had audible sounds from the ICD generator site and were diagnosed with a lead-to-can abrasion, which was manifested by the arc mark on the surface of the can. It is still difficult to predict the occurrence of an electrical short circuit in current ICD systems. To reduce the probability of an electrical short circuit, we suggest the following: (i) avoid lead stress at ICD implantation, (ii) select a single-coil lead instead of a dual-coil lead, or (iii) use a unique algorithm which automatically disconnect can or SVC lead from shock deliver circuit when excessive current was detected. Published on behalf of the European Society of Cardiology. All rights reserved. © The Author 2015. For permissions please email: journals.permissions@oup.com.

30 CFR 56.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2012 CFR

2012-07-01

... Extraneous Electricity § 56.6605 Isolation of blasting circuits. Lead wires and blasting lines shall be... sources of stray or static electricity. Blasting circuits shall be protected from any contact between...

30 CFR 56.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2011 CFR

2011-07-01

... Extraneous Electricity § 56.6605 Isolation of blasting circuits. Lead wires and blasting lines shall be... sources of stray or static electricity. Blasting circuits shall be protected from any contact between...

30 CFR 56.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2014 CFR

2014-07-01

... Extraneous Electricity § 56.6605 Isolation of blasting circuits. Lead wires and blasting lines shall be... sources of stray or static electricity. Blasting circuits shall be protected from any contact between...

30 CFR 56.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2013 CFR

2013-07-01

... Extraneous Electricity § 56.6605 Isolation of blasting circuits. Lead wires and blasting lines shall be... sources of stray or static electricity. Blasting circuits shall be protected from any contact between...

30 CFR 56.6605 - Isolation of blasting circuits.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Extraneous Electricity § 56.6605 Isolation of blasting circuits. Lead wires and blasting lines shall be... sources of stray or static electricity. Blasting circuits shall be protected from any contact between...

Helping the Visually Impaired Student with Electronic Video Visual Aids.

ERIC Educational Resources Information Center

Visualtek, Inc., Santa Monica, CA.

THE FOLLOWING IS THE FULL TEXT OF THIS DOCUMENT: Video visual aids are Closed Circuit TV systems (CCTV's) which magnify print and enlarge it electronically upon a screen so partially sighted persons with some residual vision can read and write normal size print. These devices are in use around the world in homes, schools, industries and libraries,…

Electrical Circuit Tester

DOEpatents

Love, Frank

2006-04-18

An electrical circuit testing device is provided, comprising a case, a digital voltage level testing circuit with a display means, a switch to initiate measurement using the device, a non-shorting switching means for selecting pre-determined electrical wiring configurations to be tested in an outlet, a terminal block, a five-pole electrical plug mounted on the case surface and a set of adapters that can be used for various multiple-pronged electrical outlet configurations for voltages from 100 600 VAC from 50 100 Hz.

How Young Children Understand Electric Circuits: Prediction, Explanation and Exploration

ERIC Educational Resources Information Center

Glauert, Esme Bridget

2009-01-01

This paper reports findings from a study of young children's views about electric circuits. Twenty-eight children aged 5 and 6 years were interviewed. They were shown examples of circuits and asked to predict whether they would work and explain why. They were then invited to try out some of the circuit examples or make circuits of their own…

Circuit-lead trimming template

NASA Technical Reports Server (NTRS)

Ofarrell, K.; Winn, E.

1979-01-01

Template for use in trimming leads on production wiring boards is low-cost means for eliminating rejections for short leads and improving lead-strength uniformity. Template is simply unclad piece of printed-circuit board material that is drilled using same drill control tape used in making original production board. Revisions in component layout of board can therefore be made simultaneously in template.

Surface study of graphene ink for fine solid lines printed on BOPP Substrate in micro-flexographic printing using XPS analysis technique

NASA Astrophysics Data System (ADS)

Hassan, S.; Yusof, M. S.; Embong, Z.; Ding, S.; Maksud, M. I.

2018-01-01

Micro-flexographic printing is a combination of flexography and micro-contact printing technique. It is a new printing method for fine solid lines printing purpose. Graphene material has been used as depositing agent or printing ink in other printing technique like inkjet printing. This graphene ink is printed on biaxially oriented polypropylene (BOPP) by using Micro-flexographic printing technique. The choose of graphene as a printing ink is due to its wide application in producing electronic and micro-electronic devices such as Radio-frequency identification (RFID) and printed circuit board. The graphene printed on the surface of BOPP substrate was analyzed using X-Ray Photoelectron Spectroscopy (XPS). The positions for each synthetic component in the narrow scan are referred to the electron binding energy (eV). This research is focused on two narrow scan regions which are C 1s and O 1s. Further discussion of the narrow scan spectrum will be explained in detail. From the narrow scan analysis, it is proposed that from the surface adhesive properties of graphene, it is suitable as an alternative printing ink medium for Micro-flexographic printing technique in printing multiple fine solid lines at micro to nano scale feature.

Apparatus for mounting a diode in a microwave circuit

DOEpatents

Liu, Shing-gong

1976-07-27

Apparatus for mounting a diode in a microwave circuit for making electrical contact between the circuit and ground and for dissipation of heat between the diode and a heat sink. The diode, supported on a thermally and electrically conductive member, is resiliently pressed in electrical contact with the microwave circuit. A tapered collar on the member is elastically deformably wedged into a tapered aperture formed in a heat sink. The wedged collar tightens firmly around the member establishing good thermal and electrical conduction from the diode to the heat sink and ground. Disassembly is facilitated because of the elastically deformed collar.

46 CFR 111.55-3 - Circuit connections.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 4 2011-10-01 2011-10-01 false Circuit connections. 111.55-3 Section 111.55-3 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switches § 111.55-3 Circuit connections. The load side of each circuit must be connected to the...

46 CFR 111.55-3 - Circuit connections.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 4 2012-10-01 2012-10-01 false Circuit connections. 111.55-3 Section 111.55-3 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switches § 111.55-3 Circuit connections. The load side of each circuit must be connected to the...

46 CFR 111.55-3 - Circuit connections.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 4 2010-10-01 2010-10-01 false Circuit connections. 111.55-3 Section 111.55-3 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switches § 111.55-3 Circuit connections. The load side of each circuit must be connected to the...

46 CFR 111.55-3 - Circuit connections.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 4 2013-10-01 2013-10-01 false Circuit connections. 111.55-3 Section 111.55-3 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switches § 111.55-3 Circuit connections. The load side of each circuit must be connected to the...

46 CFR 111.55-3 - Circuit connections.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 4 2014-10-01 2014-10-01 false Circuit connections. 111.55-3 Section 111.55-3 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switches § 111.55-3 Circuit connections. The load side of each circuit must be connected to the...

Practical Active Capacitor Filter

NASA Technical Reports Server (NTRS)

Shuler, Robert L., Jr. (Inventor)

2005-01-01

A method and apparatus is described that filters an electrical signal. The filtering uses a capacitor multiplier circuit where the capacitor multiplier circuit uses at least one amplifier circuit and at least one capacitor. A filtered electrical signal results from a direct connection from an output of the at least one amplifier circuit.

46 CFR 111.75-5 - Lighting branch circuits.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 4 2010-10-01 2010-10-01 false Lighting branch circuits. 111.75-5 Section 111.75-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Lighting Circuits and Protection § 111.75-5 Lighting branch circuits. (a) Loads. A...

49 CFR 236.721 - Circuit, control.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 4 2013-10-01 2013-10-01 false Circuit, control. 236.721 Section 236.721..., MAINTENANCE, AND REPAIR OF SIGNAL AND TRAIN CONTROL SYSTEMS, DEVICES, AND APPLIANCES Definitions § 236.721 Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ...

49 CFR 236.721 - Circuit, control.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 4 2011-10-01 2011-10-01 false Circuit, control. 236.721 Section 236.721..., MAINTENANCE, AND REPAIR OF SIGNAL AND TRAIN CONTROL SYSTEMS, DEVICES, AND APPLIANCES Definitions § 236.721 Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ...

49 CFR 236.721 - Circuit, control.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 49 Transportation 4 2014-10-01 2014-10-01 false Circuit, control. 236.721 Section 236.721..., MAINTENANCE, AND REPAIR OF SIGNAL AND TRAIN CONTROL SYSTEMS, DEVICES, AND APPLIANCES Definitions § 236.721 Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ...

49 CFR 236.721 - Circuit, control.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Circuit, control. 236.721 Section 236.721..., MAINTENANCE, AND REPAIR OF SIGNAL AND TRAIN CONTROL SYSTEMS, DEVICES, AND APPLIANCES Definitions § 236.721 Circuit, control. An electrical circuit between a source of electric energy and a device which it operates. ...

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

PubMed Central

Rogers, John A.; Bao, Zhenan; Baldwin, Kirk; Dodabalapur, Ananth; Crone, Brian; Raju, V. R.; Kuck, Valerie; Katz, Howard; Amundson, Karl; Ewing, Jay; Drzaic, Paul

2001-01-01

Electronic systems that use rugged lightweight plastics potentially offer attractive characteristics (low-cost processing, mechanical flexibility, large area coverage, etc.) that are not easily achieved with established silicon technologies. This paper summarizes work that demonstrates many of these characteristics in a realistic system: organic active matrix backplane circuits (256 transistors) for large (≈5 × 5-inch) mechanically flexible sheets of electronic paper, an emerging type of display. The success of this effort relies on new or improved processing techniques and materials for plastic electronics, including methods for (i) rubber stamping (microcontact printing) high-resolution (≈1 μm) circuits with low levels of defects and good registration over large areas, (ii) achieving low leakage with thin dielectrics deposited onto surfaces with relief, (iii) constructing high-performance organic transistors with bottom contact geometries, (iv) encapsulating these transistors, (v) depositing, in a repeatable way, organic semiconductors with uniform electrical characteristics over large areas, and (vi) low-temperature (≈100°C) annealing to increase the on/off ratios of the transistors and to improve the uniformity of their characteristics. The sophistication and flexibility of the patterning procedures, high level of integration on plastic substrates, large area coverage, and good performance of the transistors are all important features of this work. We successfully integrate these circuits with microencapsulated electrophoretic “inks” to form sheets of electronic paper. PMID:11320233

Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

PubMed Central

Sheng, Cheng; Wu, Lingling; Zhao, Yuemin; He, Jinfeng; Zhou, Enhui

2014-01-01

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed's fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution. PMID:25379546

Josephson junction in the quantum mesoscopic electric circuits with charge discreteness

NASA Astrophysics Data System (ADS)

Pahlavani, H.

2018-04-01

A quantum mesoscopic electrical LC-circuit with charge discreteness including a Josephson junction is considered and a nonlinear Hamiltonian that describing the dynamic of such circuit is introduced. The quantum dynamical behavior (persistent current probability) is studied in the charge and phase regimes by numerical solution approaches. The time evolution of charge and current, number-difference and the bosonic phase and also the energy spectrum of a quantum mesoscopic electric LC-circuit with charge discreteness that coupled with a Josephson junction device are investigated. We show the role of the coupling energy and the electrostatic Coulomb energy of the Josephson junction in description of the quantum behavior and the spectral properties of a quantum mesoscopic electrical LC-circuits with charge discreteness.

Electronic Jewelry

ERIC Educational Resources Information Center

Ward, Vesta

1972-01-01

Brightly banded resisters, condensers, diodes and transistors as well as printed circuit boards were used with the objective of discovering their potential in creating objects for personal adornment. (RB)

Problem Solvers: Problem--Light It up! and Solutions--Flags by the Numbers

ERIC Educational Resources Information Center

Hall, Shaun

2009-01-01

A simple circuit is created by the continuous flow of electricity through conductors (copper wires) from a source of electrical energy (batteries). "Completing a circuit" means that electricity flows from the energy source through the circuit and, in the case described in this month's problem, causes the light bulb tolight up. The presence of…

Pre-Service and In-Service Physics Teachers' Ideas about Simple Electric Circuits

ERIC Educational Resources Information Center

Kucukozer, Huseyin; Demirci, Neset

2008-01-01

The aim of the study is to determine pre-service and high school physics teachers' ideas about simple electric circuits. In this study, a test containing eight questions related to simple electric circuits was given to the pre-service physics teachers (32 subjects) that had graduated from Balikesir University, Necatibey Faculty of Education, the…

The Electron Runaround: Understanding Electric Circuit Basics through a Classroom Activity

ERIC Educational Resources Information Center

Singh, Vandana

2010-01-01

Several misconceptions abound among college students taking their first general physics course, and to some extent pre-engineering physics students, regarding the physics and applications of electric circuits. Analogies used in textbooks, such as those that liken an electric circuit to a piped closed loop of water driven by a water pump, do not…

Fully Screen-Printed, Large-Area, and Flexible Active-Matrix Electrochromic Displays Using Carbon Nanotube Thin-Film Transistors.

PubMed

Cao, Xuan; Lau, Christian; Liu, Yihang; Wu, Fanqi; Gui, Hui; Liu, Qingzhou; Ma, Yuqiang; Wan, Haochuan; Amer, Moh R; Zhou, Chongwu

2016-11-22

Semiconducting single-wall carbon nanotubes are ideal semiconductors for printed electronics due to their advantageous electrical and mechanical properties, intrinsic printability in solution, and desirable stability in air. However, fully printed, large-area, high-performance, and flexible carbon nanotube active-matrix backplanes are still difficult to realize for future displays and sensing applications. Here, we report fully screen-printed active-matrix electrochromic displays employing carbon nanotube thin-film transistors. Our fully printed backplane shows high electrical performance with mobility of 3.92 ± 1.08 cm 2 V -1 s -1 , on-off current ratio I on /I off ∼ 10 4 , and good uniformity. The printed backplane was then monolithically integrated with an array of printed electrochromic pixels, resulting in an entirely screen-printed active-matrix electrochromic display (AMECD) with good switching characteristics, facile manufacturing, and long-term stability. Overall, our fully screen-printed AMECD is promising for the mass production of large-area and low-cost flexible displays for applications such as disposable tags, medical electronics, and smart home appliances.

Description of the three axis low-g accelerometer package

NASA Technical Reports Server (NTRS)

Amalavage, A. J.; Fikes, E. H.; Berry, E. H.

1978-01-01

The three axis low-g accelerometer package designed for use on the Space Processing Application Rocket (SPAR) Program is described. The package consists of the following major sections: (1) three Kearfott model 2412 accelerometers mounted in an orthogonal triad configuration on a temperature controlled, thermally isolated cube, (2) the accelerometer servoelectronics (printed circuit cards PC-6 through PC-12), and (3) the signal conditioner (printed circuit cards PC-15 and PC-16). The measurement range is 0 + or - 0.031 g with a quantization of 1.1 x 10 to the 7th power g. The package was flown successfully on six SPAR launches with the Black Brant booster. These flights provide approximately 300 s of free fall or zero-g environment.

Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder

NASA Astrophysics Data System (ADS)

He, Xiaofei; Azarian, Michael H.; Pecht, Michael G.

2011-09-01

To evaluate the current leakage and electrochemical migration behavior on printed circuit boards with eutectic tin-lead and lead-free solder, IPC B-24 comb structures were exposed to 65°C and 88% relative humidity conditions under direct-current (DC) bias for over 1500 h. These boards were processed with either Sn-3.0Ag-0.5Cu solder or Sn-37Pb solder. In addition to solder alloy, board finish (organic solderability preservative versus lead-free hot air solder leveling), spacing (25 mil versus 12.5 mil), and voltage (40 V versus 5 V bias) were also assessed by using in situ measurements of surface insulation resistance (SIR) and energy-dispersive spectroscopy after testing. It was shown that an initial increase of SIR was caused by consumption of electroactive species on the surface, intermittent drops of SIR were caused by dendritic growth, and a long-term SIR decline was caused by electrodeposition of a metallic layer. The prolonged SIR decline of Sn-3.0Ag-0.5Cu boards was simulated by three-dimensional (3D) progressive and instantaneous nucleation models, whose predictions were compared with experimental data. Sn-37Pb boards exhibited comigration of Sn, Pb, and Cu, while Sn-3.0Ag-0.5Cu boards incurred comigration of Sn, Ag, and Cu. Among the migrated species, Sn always dominated and was observed as either a layer or in polyhedral deposits, Pb was the most common element found in the dendrites, Cu was a minor constituent, and Ag migrated only occasionally. Compared with solder alloy, board finishes played a secondary role in affecting SIR due to their complexation with or dissolution into the solder. The competing effect between electric field and spacing was also investigated.

46 CFR 169.690 - Lighting branch circuits.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 7 2010-10-01 2010-10-01 false Lighting branch circuits. 169.690 Section 169.690... Machinery and Electrical Electrical Installations on Vessels of 100 Gross Tons and Over § 169.690 Lighting branch circuits. Each lighting branch circuit must meet the requirements of § 111.75-5 of this chapter...

Electro-optical Probing Of Terahertz Integrated Circuits

NASA Technical Reports Server (NTRS)

Bhasin, K. B.; Romanofsky, R.; Whitaker, J. F.; Valdmanis, J. A.; Mourou, G.; Jackson, T. A.

1990-01-01

Electro-optical probe developed to perform noncontact, nondestructive, and relatively noninvasive measurements of electric fields over broad spectrum at millimeter and shorter wavelengths in integrated circuits. Manipulated with conventional intregrated-circuit-wafer-probing equipment and operated without any special preparation of integrated circuits. Tip of probe small electro-optical crystal serving as proximity electric-field sensor.

Electrical Circuits in the Mathematics/Computer Science Classroom.

ERIC Educational Resources Information Center

McMillan, Robert D.

1988-01-01

Shows how, with little or no electrical background, students can apply Boolean algebra concepts to design and build integrated electrical circuits in the classroom that will reinforce important ideas in mathematics. (PK)

Thermal cycling tests on surface-mount assemblies

NASA Astrophysics Data System (ADS)

Jennings, C. W.

1988-03-01

The capability of surface-mount (SM) solder joints to withstand various thermal cycle stresses was evaluated through electrical circuit resistance changes of a test pattern and by visual examination for cracks in the solder after exposure to thermal cycling. The joints connected different electrical components, primarily leadless-chip carriers (LCCs), and printed wiring-board (PWB) pads on different laminate substrates. Laminate compositions were epoxy-glass and polyimide-glass with and without copper/Invar/copper (CIC) inner layers, polyimide-quartz, epoxy-Kevlar, and polyimide-Kevlar. The most resistant joints were between small LCCs (24 and 48 pins) and polyimide-glass laminate with CIC inner layers. Processing in joint formation was found to be an important part of joint resistant. Thermal cycling was varied with respect to both time and temperature. A few resistors, capacitors, and inductors showed opens after 500 30-min cycles between -65 C and 125 C. Appreciable moisture contents were measured for laminate materials, especially those of polyimide-Kevlar after equilibration in 100 percent relative humidity at room temperature. If not removed or reduced, moisture can cause delamination in vapor-phase soldering.

Rectangular Ion Funnel: A New Ion Funnel Interface for Structures for Lossless Ion Manipulations

DOE PAGES

Chen, Tsung-Chi; Webb, Ian K.; Prost, Spencer A.; ...

2014-11-19

A recent achievement in Structures for Lossless Ion Manipulations (SLIM) is the ability for near lossless ion focusing, transfer, and trapping in sub-atmospheric pressure regions. While lossless ion manipulations are advantageously applied to the applications of ion mobility separations and gas phase reactions, ion introduction through ring electrode ion funnels or more conventional ion optics to SLIM can involve discontinuities in electric fields or other perturbations that result in ion losses. In this work, we investigated a new funnel design that aims to seamlessly couple to SLIM at the funnel exit. This rectangular ion funnel (RIF) was initially evaluated bymore » ion simulations, fabricated utilizing printed circuit board technology and tested experimentally. The RIF was integrated to a SLIM-TOFMS system, and the operating parameters, including RF, DC bias of the RIF electrodes, and electric fields for effectively interfacing with a SLIM were characterized. The RIF provided a 2-fold sensitivity increase without significant discrimination over a wide m/z range along with greatly improved SLIM operational stability.« less

Electric Circuit Model Analogy for Equilibrium Lattice Relaxation in Semiconductor Heterostructures

NASA Astrophysics Data System (ADS)

Kujofsa, Tedi; Ayers, John E.

2018-01-01

The design and analysis of semiconductor strained-layer device structures require an understanding of the equilibrium profiles of strain and dislocations associated with mismatched epitaxy. Although it has been shown that the equilibrium configuration for a general semiconductor strained-layer structure may be found numerically by energy minimization using an appropriate partitioning of the structure into sublayers, such an approach is computationally intense and non-intuitive. We have therefore developed a simple electric circuit model approach for the equilibrium analysis of these structures. In it, each sublayer of an epitaxial stack may be represented by an analogous circuit configuration involving an independent current source, a resistor, an independent voltage source, and an ideal diode. A multilayered structure may be built up by the connection of the appropriate number of these building blocks, and the node voltages in the analogous electric circuit correspond to the equilibrium strains in the original epitaxial structure. This enables analysis using widely accessible circuit simulators, and an intuitive understanding of electric circuits can easily be extended to the relaxation of strained-layer structures. Furthermore, the electrical circuit model may be extended to continuously-graded epitaxial layers by considering the limit as the individual sublayer thicknesses are diminished to zero. In this paper, we describe the mathematical foundation of the electrical circuit model, demonstrate its application to several representative structures involving In x Ga1- x As strained layers on GaAs (001) substrates, and develop its extension to continuously-graded layers. This extension allows the development of analytical expressions for the strain, misfit dislocation density, critical layer thickness and widths of misfit dislocation free zones for a continuously-graded layer having an arbitrary compositional profile. It is similar to the transition from circuit theory, using lumped circuit elements, to electromagnetics, using distributed electrical quantities. We show this development using first principles, but, in a more general sense, Maxwell's equations of electromagnetics could be applied.