Characterization of micro-contact resistance between a gold nanocrystalline line and a tungsten electrode probe in interconnect fatigue testing.

PubMed

Ling, Xue; Wang, Yusheng; Li, Xide

2014-10-01

An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects of the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li-Etsion-Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.

Characterization of micro-contact resistance between a gold nanocrystalline line and a tungsten electrode probe in interconnect fatigue testing

NASA Astrophysics Data System (ADS)

Ling, Xue; Wang, Yusheng; Li, Xide

2014-10-01

An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects of the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li-Etsion-Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.

Compact Interconnection Networks Based on Quantum Dots

NASA Technical Reports Server (NTRS)

Fijany, Amir; Toomarian, Nikzad; Modarress, Katayoon; Spotnitz, Matthew

2003-01-01

Architectures that would exploit the distinct characteristics of quantum-dot cellular automata (QCA) have been proposed for digital communication networks that connect advanced digital computing circuits. In comparison with networks of wires in conventional very-large-scale integrated (VLSI) circuitry, the networks according to the proposed architectures would be more compact. The proposed architectures would make it possible to implement complex interconnection schemes that are required for some advanced parallel-computing algorithms and that are difficult (and in many cases impractical) to implement in VLSI circuitry. The difficulty of implementation in VLSI and the major potential advantage afforded by QCA were described previously in Implementing Permutation Matrices by Use of Quantum Dots (NPO-20801), NASA Tech Briefs, Vol. 25, No. 10 (October 2001), page 42. To recapitulate: Wherever two wires in a conventional VLSI circuit cross each other and are required not to be in electrical contact with each other, there must be a layer of electrical insulation between them. This, in turn, makes it necessary to resort to a noncoplanar and possibly a multilayer design, which can be complex, expensive, and even impractical. As a result, much of the cost of designing VLSI circuits is associated with minimization of data routing and assignment of layers to minimize crossing of wires. Heretofore, these considerations have impeded the development of VLSI circuitry to implement complex, advanced interconnection schemes. On the other hand, with suitable design and under suitable operating conditions, QCA-based signal paths can be allowed to cross each other in the same plane without adverse effect. In principle, this characteristic could be exploited to design compact, coplanar, simple (relative to VLSI) QCA-based networks to implement complex, advanced interconnection schemes. The proposed architectures require two advances in QCA-based circuitry beyond basic QCA-based binary-signal wires described in the cited prior article. One of these advances would be the development of QCA-based wires capable of bidirectional transmission of signals. The other advance would be the development of QCA circuits capable of high-impedance state outputs. The high-impedance states would be utilized along with the 0- and 1-state outputs of QCA.

14 CFR 25.1709 - System safety: EWIS.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false System safety: EWIS. 25.1709 Section 25.1709 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION, DEPARTMENT OF TRANSPORTATION AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Electrical Wiring Interconnection Systems (EWIS) § 25.1709...

Novel optical interconnect devices applying mask-transfer self-written method

NASA Astrophysics Data System (ADS)

Ishizawa, Nobuhiko; Matsuzawa, Yusuke; Tokiwa, Yu; Nakama, Kenichi; Mikami, Osamu

2012-01-01

The introduction of optical interconnect technology is expected to solve problems of conventional electric wiring. One of the promising technologies realizing optical interconnect is the self-written waveguide (SWW) technology with lightcurable resin. We have developed a new technology of the "Mask-Transfer Self-Written (MTSW)" method. This new method enables fabrication of arrayed M x N optical channels at one shot of UV-light. Using this technology, several new optical interconnect devices and connection technologies have been proposed and investigated. In this paper, first, we introduce MTSW method briefly. Next, we show plug-in alignment approach using optical waveguide plugs (OWP) and a micro-hole array (MHA) which are made of the light-curable resin. Easy and high efficiency plug-in alignment between fibers and an optoelectronic-printed wiring board (OE-PWB), between a fiber and a VCSEL, so on will be feasible. Then, we propose a new three-dimensional (3D) branch waveguide. By controlling the irradiating angle through the photomask aperture, it will be possible to fabricate 2-branch and 4-branch waveguides with a certain branch angle. The 3D branch waveguide will be very promising in the future optical interconnects and coupler devices of the multicore optical fiber.

Characterization of micro-contact resistance between a gold nanocrystalline line and a tungsten electrode probe in interconnect fatigue testing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ling, Xue; Wang, Yusheng; Li, Xide, E-mail: lixide@tsinghua.edu.cn

An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects ofmore » the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li–Etsion–Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.« less

14 CFR 25.1703 - Function and installation: EWIS.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 14 Aeronautics and Space 1 2010-01-01 2010-01-01 false Function and installation: EWIS. 25.1703... AIRCRAFT AIRWORTHINESS STANDARDS: TRANSPORT CATEGORY AIRPLANES Electrical Wiring Interconnection Systems (EWIS) § 25.1703 Function and installation: EWIS. (a) Each EWIS component installed in any area of the...

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

NASA Technical Reports Server (NTRS)

Peckinpaugh, C. J.

1974-01-01

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

SEM technique for imaging and measuring electronic transport in nanocomposites based on electric field induced contrast

DOEpatents

Jesse, Stephen [Knoxville, TN; Geohegan, David B [Knoxville, TN; Guillorn, Michael [Brooktondale, NY

2009-02-17

Methods and apparatus are described for SEM imaging and measuring electronic transport in nanocomposites based on electric field induced contrast. A method includes mounting a sample onto a sample holder, the sample including a sample material; wire bonding leads from the sample holder onto the sample; placing the sample holder in a vacuum chamber of a scanning electron microscope; connecting leads from the sample holder to a power source located outside the vacuum chamber; controlling secondary electron emission from the sample by applying a predetermined voltage to the sample through the leads; and generating an image of the secondary electron emission from the sample. An apparatus includes a sample holder for a scanning electron microscope having an electrical interconnect and leads on top of the sample holder electrically connected to the electrical interconnect; a power source and a controller connected to the electrical interconnect for applying voltage to the sample holder to control the secondary electron emission from a sample mounted on the sample holder; and a computer coupled to a secondary electron detector to generate images of the secondary electron emission from the sample.

Forming electrical interconnections through semiconductor wafers

NASA Technical Reports Server (NTRS)

Anthony, T. R.

1981-01-01

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

High accuracy electronic material level sensor

DOEpatents

McEwan, T.E.

1997-03-11

The High Accuracy Electronic Material Level Sensor (electronic dipstick) is a sensor based on time domain reflectometry (TDR) of very short electrical pulses. Pulses are propagated along a transmission line or guide wire that is partially immersed in the material being measured; a launcher plate is positioned at the beginning of the guide wire. Reflected pulses are produced at the material interface due to the change in dielectric constant. The time difference of the reflections at the launcher plate and at the material interface are used to determine the material level. Improved performance is obtained by the incorporation of: (1) a high accuracy time base that is referenced to a quartz crystal, (2) an ultrawideband directional sampler to allow operation without an interconnect cable between the electronics module and the guide wire, (3) constant fraction discriminators (CFDs) that allow accurate measurements regardless of material dielectric constants, and reduce or eliminate errors induced by triple-transit or ``ghost`` reflections on the interconnect cable. These improvements make the dipstick accurate to better than 0.1%. 4 figs.

High accuracy electronic material level sensor

DOEpatents

McEwan, Thomas E.

1997-01-01

The High Accuracy Electronic Material Level Sensor (electronic dipstick) is a sensor based on time domain reflectometry (TDR) of very short electrical pulses. Pulses are propagated along a transmission line or guide wire that is partially immersed in the material being measured; a launcher plate is positioned at the beginning of the guide wire. Reflected pulses are produced at the material interface due to the change in dielectric constant. The time difference of the reflections at the launcher plate and at the material interface are used to determine the material level. Improved performance is obtained by the incorporation of: 1) a high accuracy time base that is referenced to a quartz crystal, 2) an ultrawideband directional sampler to allow operation without an interconnect cable between the electronics module and the guide wire, 3) constant fraction discriminators (CFDs) that allow accurate measurements regardless of material dielectric constants, and reduce or eliminate errors induced by triple-transit or "ghost" reflections on the interconnect cable. These improvements make the dipstick accurate to better than 0.1%.

The Conductance of Porphyrin-Based Molecular Nanowires Increases with Length.

PubMed

Algethami, Norah; Sadeghi, Hatef; Sangtarash, Sara; Lambert, Colin J

2018-06-13

High electrical conductance molecular nanowires are highly desirable components for future molecular-scale circuitry, but typically molecular wires act as tunnel barriers and their conductance decays exponentially with length. Here, we demonstrate that the conductance of fused-oligo-porphyrin nanowires can be either length independent or increase with length at room temperature. We show that this negative attenuation is an intrinsic property of fused-oligo-porphyrin nanowires, but its manifestation depends on the electrode material or anchor groups. This highly desirable, nonclassical behavior signals the quantum nature of transport through such wires. It arises because with increasing length the tendency for electrical conductance to decay is compensated by a decrease in their highest occupied molecular orbital-lowest unoccupied molecular orbital gap. Our study reveals the potential of these molecular wires as interconnects in future molecular-scale circuitry.

Extreme temperature packaging: challenges and opportunities

NASA Astrophysics Data System (ADS)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

Optical interconnect technologies for high-bandwidth ICT systems

NASA Astrophysics Data System (ADS)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

14 CFR 26.11 - Electrical wiring interconnection systems (EWIS) maintenance program.

Code of Federal Regulations, 2014 CFR

2014-01-01

... configuration of each model series airplane that incorporates all variations of EWIS used in production on that series airplane, and all TC-holder-designed modifications mandated by airworthiness directive as of the... effect on December 10, 2007 for each affected type design, and submit those ICA for review and approval...

14 CFR 26.11 - Electrical wiring interconnection systems (EWIS) maintenance program.

Code of Federal Regulations, 2012 CFR

2012-01-01

... configuration of each model series airplane that incorporates all variations of EWIS used in production on that series airplane, and all TC-holder-designed modifications mandated by airworthiness directive as of the... effect on December 10, 2007 for each affected type design, and submit those ICA for review and approval...

14 CFR 26.11 - Electrical wiring interconnection systems (EWIS) maintenance program.

Code of Federal Regulations, 2010 CFR

2010-01-01

... configuration of each model series airplane that incorporates all variations of EWIS used in production on that series airplane, and all TC-holder-designed modifications mandated by airworthiness directive as of the... effect on December 10, 2007 for each affected type design, and submit those ICA for review and approval...

14 CFR 26.11 - Electrical wiring interconnection systems (EWIS) maintenance program.

Code of Federal Regulations, 2013 CFR

2013-01-01

... configuration of each model series airplane that incorporates all variations of EWIS used in production on that series airplane, and all TC-holder-designed modifications mandated by airworthiness directive as of the... effect on December 10, 2007 for each affected type design, and submit those ICA for review and approval...

14 CFR 26.11 - Electrical wiring interconnection systems (EWIS) maintenance program.

Code of Federal Regulations, 2011 CFR

2011-01-01

... configuration of each model series airplane that incorporates all variations of EWIS used in production on that series airplane, and all TC-holder-designed modifications mandated by airworthiness directive as of the... effect on December 10, 2007 for each affected type design, and submit those ICA for review and approval...

IC layout adjustment method and tool for improving dielectric reliability at interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kahng, Andrew B.; Chan, Tuck Boon

Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges aremore » to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.« less

Symmetric miniaturized heating system for active microelectronic devices.

PubMed

McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

2010-07-01

To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to 5700 thermal cycles between 55 and 195 degrees C, demonstrating reliability under thermal cycling.

Hard and flexible optical printed circuit board

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Hyun Sik; Lee, S. G.; O, B. H.; Park, S. G.; Kim, K. H.

2007-02-01

We report on the design and fabrication of hard and flexible optical printed circuit boards (O-PCBs). The objective is to realize generic and application-specific O-PCBs, either in hard form or flexible form, that are compact, light-weight, low-energy, high-speed, intelligent, and environmentally friendly, for low-cost and high-volume universal applications. The O-PCBs consist of 2-dimensional planar arrays of micro/nano-scale optical wires, circuits and devices that are interconnected and integrated to perform the functions of sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards. For fabrication, the polymer and organic optical wires and waveguides are first fabricated on a board and are used to interconnect and integrate micro/nano-scale photonic devices. The micro/nano-optical functional devices include lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices. For flexible boards, the optical waveguide arrays are fabricated on flexible poly-ethylen terephthalate (PET) substrates by UV embossing. Electrical layer carrying VCSEL and PD array is laminated with the optical layer carrying waveguide arrays. Both hard and flexible electrical lines are replaced with high speed optical interconnection between chips over four waveguide channels up to 10Gbps on each. We discuss uses of hard or flexible O-PCBs for telecommunication systems, computer systems, transportation systems, space/avionic systems, and bio-sensor systems.

Basic EMC (Electromagnetic compatibility) technology advancement for C3 systems. Volume 4D: Modeling crosstalk in balanced twisted pairs

NASA Astrophysics Data System (ADS)

Koopman, D. A.; Paul, C. R.

1984-08-01

Electrical devices (computers, radar systems, communication radios, etc.) are interconnected by wires on most present systems. Electromagnetic fields produced by the excitation of these wires will cause unintentional coupling of signals onto nearby wires. This undesired electromagnetic coupling is termed crosstalk. It is important to be able to determine whether these crosstalk signals will cause the devices at the ends of the wires to malfunction. Wires are often grouped together in cable bundles or harnesses. The close proximity of wires in these bundles enhances the possibility that the crosstalk levels will be sufficiently large to cause malfunctions. The ability to predict crosstalk levels and the means to control crosstalk when it causes a problem are important to optimum system design. It interference of this type is allowed to surface during final system tests, a costly and time consuming retrofit of the wiring or the addition of filters and other interference control measures may be required.

Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

DOEpatents

Passmore, Brandon; Cole, Zach; Whitaker, Bret; Barkley, Adam; McNutt, Ty; Lostetter, Alexander

2016-08-02

A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip

NASA Technical Reports Server (NTRS)

Carson, John C. (Inventor); Indin, Ronald J. (Inventor); Shanken, Stuart N. (Inventor)

1994-01-01

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Chinese Investment in U.S. Aviation

DTIC Science & Technology

2017-01-01

Safran (France) Engines (CFM International), in-flight entertainment Thales (France) Electrical wiring interconnection system (Shanghai SAIFEI...development of a domestic turbine -engine sector for narrow-body aircraft. For example, it calls for China to “accelerate the comprehensive establishment...cash.9 The Technify Motor/AVIC sub- sidiary, Continental Motors, later acquired United Turbine and UT Aeroparts Corporations in January 2015.10 Nexteer

Iodine doped carbon nanotube cables exceeding specific electrical conductivity of metals

PubMed Central

Zhao, Yao; Wei, Jinquan; Vajtai, Robert; Ajayan, Pulickel M.; Barrera, Enrique V.

2011-01-01

Creating highly electrically conducting cables from macroscopic aggregates of carbon nanotubes, to replace metallic wires, is still a dream. Here we report the fabrication of iodine-doped, double-walled nanotube cables having electrical resistivity reaching ∼10−7 Ω.m. Due to the low density, their specific conductivity (conductivity/weight) is higher than copper and aluminum and is only just below that of the highest specific conductivity metal, sodium. The cables exhibit high current-carrying capacity of 104∼105 A/cm2 and can be joined together into arbitrary length and diameter, without degradation of their electrical properties. The application of such nanotube cables is demonstrated by partly replacing metal wires in a household light bulb circuit. The conductivity variation as a function of temperature for the cables is five times smaller than that for copper. The high conductivity nanotube cables could find a range of applications, from low dimensional interconnects to transmission lines. PMID:22355602

Temperature differential detection device

DOEpatents

Girling, P.M.

1986-04-22

A temperature differential detection device for detecting the temperature differential between predetermined portions of a container wall is disclosed as comprising a Wheatstone bridge circuit for detecting resistance imbalance with a first circuit branch having a first elongated wire element mounted in thermal contact with a predetermined portion of the container wall, a second circuit branch having a second elongated wire element mounted in thermal contact with a second predetermined portion of a container wall with the wire elements having a predetermined temperature-resistant coefficient, an indicator interconnected between the first and second branches remote from the container wall for detecting and indicating resistance imbalance between the first and second wire elements, and connector leads for electrically connecting the wire elements to the remote indicator in order to maintain the respective resistance value relationship between the first and second wire elements. The indicator is calibrated to indicate the detected resistance imbalance in terms of a temperature differential between the first and second wall portions. 2 figs.

Temperature differential detection device

DOEpatents

Girling, Peter M.

1986-01-01

A temperature differential detection device for detecting the temperature differential between predetermined portions of a container wall is disclosed as comprising a Wheatstone bridge circuit for detecting resistance imbalance with a first circuit branch having a first elongated wire element mounted in thermal contact with a predetermined portion of the container wall, a second circuit branch having a second elongated wire element mounted in thermal contact with a second predetermined portion of a container wall with the wire elements having a predetermined temperature-resistant coefficient, an indicator interconnected between the first and second branches remote from the container wall for detecting and indicating resistance imbalance between the first and second wire elements, and connector leads for electrically connecting the wire elements to the remote indicator in order to maintain the respective resistance value relationship between the first and second wire elements. The indicator is calibrated to indicate the detected resistance imbalance in terms of a temperature differential between the first and second wall portions.

Recent patents on Cu/low-k dielectrics interconnects in integrated circuits.

PubMed

Jiang, Qing; Zhu, Yong F; Zhao, Ming

2007-01-01

In past decades, the development of microelectronics has moved along with constant speed of scaling to maximize transistor density as driven by the need for electrical and functional performance. For further development, the propagation velocity of electromagnetic waves becomes increasingly important due to their unyielding constraints on interconnect delay. To minimize it, it was forced to the introduction of the Cu/low-k dielectric interconnects to very large scale integrated circuits (VLSI) where k denotes the dielectric constant. In addition, reliable barrier structures, which are the thinnest part among the device parts to maximize space availability for the actual Cu IWs, are required to prevent penetration of different materials. In light of the above statements, this review will focus recent patents and some studies on Cu interconnects including Cu interconnect wires, low-k dielectrics and related barrier materials as well manufacturing techniques in VLSI, which are one of the most essential concerns in microelectronic industry and decides the further development of VLSI. In addition, possible future development in this field is considered.

Numerical simulation of CTE mismatch and thermal-structural stresses in the design of interconnects

NASA Astrophysics Data System (ADS)

Peter, Geoffrey John M.

With the ever-increasing chip complexity, interconnects have to be designed to meet the new challenges. Advances in optical lithography have made chip feature sizes available today at 70 nm dimensions. With advances in Extreme Ultraviolet Lithography, X-ray Lithography, and Ion Projection Lithography it is expected that the line width will further decrease to 20 nm or less. With the decrease in feature size, the number of active devices on the chip increases. With higher levels of circuit integration, the challenge is to dissipate the increased heat flux from the chip surface area. Thermal management considerations include coefficient of thermal expansion (CTE) matching to prevent failure between the chip and the board. This in turn calls for improved system performance and reliability of the electronic structural systems. Experience has shown that in most electronic systems, failures are mostly due to CTE mismatch between the chip, board, and the solder joint (solder interconnect). The resulting high thermal-structural stress and strain due to CTE mismatch produces cracks in the solder joints with eventual failure of the electronic component. In order to reduce the thermal stress between the chip, board, and the solder joint, this dissertation examines the effect of inserting wire bundle (wire interconnect) between the chip and the board. The flexibility of the wires or fibers would reduce the stress at the rigid joints. Numerical simulations of two, and three-dimensional models of the solder and wire interconnects are examined. The numerical simulation is linear in nature and is based on linear isotropic material properties. The effect of different wire material properties is examined. The effect of varying the wire diameter is studied by changing the wire diameter. A major cause of electronic equipment failure is due to fatigue failure caused by thermal cycling, and vibrations. A two-dimensional modal and harmonic analysis was simulated for the wire interconnect and the solder interconnect. The numerical model simulated using ANSYS program was validated with the numerical/experimental results of other published researchers. In addition the results were cross-checked by IDEAS program. A prototype non-working wire interconnect is proposed to emphasize practical application. The numerical analysis, in this dissertation is based on a U.S. Patent granted to G. Peter(42).

Scaling induced performance challenges/limitations of on-chip metal interconnects and comparisons with optical interconnects

NASA Astrophysics Data System (ADS)

Kapur, Pawan

The miniaturization paradigm for silicon integrated circuits has resulted in a tremendous cost and performance advantage. Aggressive shrinking of devices provides faster transistors and a greater functionality for circuit design. However, scaling induced smaller wire cross-sections coupled with longer lengths owing to larger chip areas, result in a steady deterioration of interconnects. This degradation in interconnect trends threatens to slow down the rapid growth along Moore's law. This work predicts that the situation is worse than anticipated. It shows that in the light of technology and reliability constraints, scaling induced increase in electron surface scattering, fractional cross section area occupied by the highly resistive barrier, and realistic interconnect operation temperature will lead to a significant rise in effective resistivity of modern copper based interconnects. We start by discussing various technology factors affecting copper resistivity. We, next, develop simulation tools to model these effects. Using these tools, we quantify the increase in realistic copper resistivity as a function of future technology nodes, under various technology assumptions. Subsequently, we evaluate the impact of these technology effects on delay and power dissipation of global signaling interconnects. Modern long on-chip wires use repeaters, which dramatically improves their delay and bandwidth. We quantify the repeated wire delays and power dissipation using realistic resistance trends at future nodes. With the motivation of reducing power, we formalize a methodology, which trades power with delay very efficiently for repeated wires. Using this method, we find that although the repeater power comes down, the total power dissipation due to wires is still found to be very large at future nodes. Finally, we explore optical interconnects as a possible substitute, for specific interconnect applications. We model an optical receiver and waveguides. Using this we assess future optical system performance. Finally, we compare the delay and power of future metal interconnects with that of optical interconnects for global signaling application. We also compare the power dissipation of the two approaches for an upper level clock distribution application. We find that for long on-chip communication links, optical interconnects have lower latencies than future metal interconnects at comparable levels of power dissipation.

Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications

PubMed Central

Yan, Tian-Hong; Wang, Wei; Chen, Xue-Dong; Li, Qing; Xu, Chang

2009-01-01

A high-frequency ultrasonic transducer for copper or gold wire bonding has been designed, analyzed, prototyped and tested. Modeling techniques were used in the design phase and a practical design procedure was established and used. The transducer was decomposed into its elementary components. For each component, an initial design was obtained with simulations using a finite elements model (FEM). Simulated ultrasonic modules were built and characterized experimentally through the Laser Doppler Vibrometer (LDV) and electrical resonance spectra. Compared with experimental data, the FEM could be iteratively adjusted and updated. Having achieved a remarkably highly-predictive FEM of the whole transducer, the design parameters could be tuned for the desired applications, then the transducer is fixed on the wire bonder with a complete holder clamping was calculated by the FEM. The approach to mount ultrasonic transducers on wire bonding machines also is of major importance for wire bonding in modern electronic packaging. The presented method can lead to obtaining a nearly complete decoupling clamper design of the transducer to the wire bonder. PMID:22408564

Reliability analysis of magnetic logic interconnect wire subjected to magnet edge imperfections

NASA Astrophysics Data System (ADS)

Zhang, Bin; Yang, Xiaokuo; Liu, Jiahao; Li, Weiwei; Xu, Jie

2018-02-01

Nanomagnet logic (NML) devices have been proposed as one of the best candidates for the next generation of integrated circuits thanks to its substantial advantages of nonvolatility, radiation hardening and potentially low power. In this article, errors of nanomagnetic interconnect wire subjected to magnet edge imperfections have been evaluated for the purpose of reliable logic propagation. The missing corner defects of nanomagnet in the wire are modeled with a triangle, and the interconnect fabricated with various magnetic materials is thoroughly investigated by micromagnetic simulations under different corner defect amplitudes and device spacings. The results show that as the defect amplitude increases, the success rate of logic propagation in the interconnect decreases. More results show that from the interconnect wire fabricated with materials, iron demonstrates the best defect tolerance ability among three representative and frequently used NML materials, also logic transmission errors can be mitigated by adjusting spacing between nanomagnets. These findings can provide key technical guides for designing reliable interconnects. Project supported by the National Natural Science Foundation of China (No. 61302022) and the Scientific Research Foundation for Postdoctor of Air Force Engineering University (Nos. 2015BSKYQD03, 2016KYMZ06).

Pressure activated interconnection of micro transfer printed components

NASA Astrophysics Data System (ADS)

Prevatte, Carl; Guven, Ibrahim; Ghosal, Kanchan; Gomez, David; Moore, Tanya; Bonafede, Salvatore; Raymond, Brook; Trindade, António Jose; Fecioru, Alin; Kneeburg, David; Meitl, Matthew A.; Bower, Christopher A.

2016-05-01

Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems of miniaturized components on non-native substrates. Most micro assembled systems include electrical interconnections to the miniaturized components, typically accomplished by metal wires formed on the non-native substrate after the assembly operation. An alternative scheme establishing interconnections during the assembly operation is a cost-effective manufacturing method for producing heterogeneous microsystems, and facilitates the repair of integrated microsystems, such as displays, by ex post facto addition of components to correct defects after system-level tests. This letter describes pressure-concentrating conductor structures formed on silicon (1 0 0) wafers to establish connections to preexisting conductive traces on glass and plastic substrates during micro transfer printing with an elastomer stamp. The pressure concentrators penetrate a polymer layer to form the connection, and reflow of the polymer layer bonds the components securely to the target substrate. The experimental yield of series-connected test systems with >1000 electrical connections demonstrates the suitability of the process for manufacturing, and robustness of the test systems against exposure to thermal shock, damp heat, and mechanical flexure shows reliability of the resulting bonds.

Development of automatic through-insulation welding for microelectric interconnections

NASA Technical Reports Server (NTRS)

Arnett, J. C.

1972-01-01

The capability to automatically route, remove insulation from, and weld small-diameter solid conductor wire is presented. This would facilitate the economical small-quantity production of complex miniature electronic assemblies. An engineering model of equipment having this capability was developed and evaluated. Whereas early work in the use of welded magnet wire interconnections was concentrated on opposed electrode systems, and generally used heat to melt the wire insulation, the present method is based on a concentric electrode system and a wire feed system which splits the insulation by application of pressure prior to welding. The work deals with the design, fabrication, and evaluation testing of an improved version of this concentric electrode system. Two different approaches to feeding the wire to the concentric electrodes were investigated. It was concluded that the process is feasible for the interconnection of complex miniature electronic assemblies.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

Manufacturing and quality control of interconnecting wire harnesses, Volume 2

NASA Technical Reports Server (NTRS)

1972-01-01

Interconnecting wire harnesses defined in the design standard are considered, including type 4, open bundle (not enclosed). Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into the document.

Antenna structure with distributed strip

DOEpatents

Rodenbeck, Christopher T.

2008-10-21

An antenna comprises electrical conductors arranged to form a radiating element including a folded line configuration and a distributed strip configuration, where the radiating element is in proximity to a ground conductor. The folded line and the distributed strip can be electrically interconnected and substantially coplanar. The ground conductor can be spaced from, and coplanar to, the radiating element, or can alternatively lie in a plane set at an angle to the radiating element. Embodiments of the antenna include conductor patterns formed on a printed wiring board, having a ground plane, spacedly adjacent to and coplanar with the radiating element. Other embodiments of the antenna comprise a ground plane and radiating element on opposed sides of a printed wiring board. Other embodiments of the antenna comprise conductors that can be arranged as free standing "foils". Other embodiments include antennas that are encapsulated into a package containing the antenna.

Antenna structure with distributed strip

DOEpatents

Rodenbeck, Christopher T [Albuquerque, NM

2008-03-18

An antenna comprises electrical conductors arranged to form a radiating element including a folded line configuration and a distributed strip configuration, where the radiating element is in proximity to a ground conductor. The folded line and the distributed strip can be electrically interconnected and substantially coplanar. The ground conductor can be spaced from, and coplanar to, the radiating element, or can alternatively lie in a plane set at an angle to the radiating element. Embodiments of the antenna include conductor patterns formed on a printed wiring board, having a ground plane, spacedly adjacent to and coplanar with the radiating element. Other embodiments of the antenna comprise a ground plane and radiating element on opposed sides of a printed wiring board. Other embodiments of the antenna comprise conductors that can be arranged as free standing "foils". Other embodiments include antennas that are encapsulated into a package containing the antenna.

Advanced optical network architecture for integrated digital avionics

NASA Astrophysics Data System (ADS)

Morgan, D. Reed

1996-12-01

For the first time in the history of avionics, the network designer now has a choice in selecting the media that interconnects the sources and sinks of digital data on aircraft. Electrical designs are already giving way to photonics in application areas where the data rate times distance product is large or where special design requirements such as low weight or EMI considerations are critical. Future digital avionic architectures will increasingly favor the use of photonic interconnects as network data rates of one gigabit/second and higher are needed to support real-time operation of high-speed integrated digital processing. As the cost of optical network building blocks is reduced and as temperature-rugged laser sources are matured, metal interconnects will be forced to retreat to applications spanning shorter and shorter distances. Although the trend is already underway, the widespread use of digital optics will first occur at the system level, where gigabit/second, real-time interconnects between sensors, processors, mass memories and displays separated by a least of few meters will be required. The application of photonic interconnects for inter-printed wiring board signalling across the backplane will eventually find application for gigabit/second applications since signal degradation over copper traces occurs before one gigabit/second and 0.5 meters are reached. For the foreseeable future however, metal interconnects will continue to be used to interconnect devices on printed wiring boards since 5 gigabit/second signals can be sent over metal up to around 15 centimeters. Current-day applications of optical interconnects at the system level are described and a projection of how advanced optical interconnect technology will be driven by the use of high speed integrated digital processing on future aircraft is presented. The recommended advanced network for application in the 2010 time frame is a fiber-based system with a signalling speed of around 2-3 gigabits per second. This switch-based unified network will interconnect sensors, displays, mass memory and controls and displays to computer modules within the processing complex. The characteristics of required building blocks needed for the future are described. These building blocks include the fiber, an optical switch, a laser-based transceiver, blind-mate connectors and an optical backplane.

The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology.

PubMed

Kang, Sung-Won; Choi, Hyeob; Park, Hyung-Il; Choi, Byoung-Gun; Im, Hyobin; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung; Roh, Jung-Sim

2017-11-07

Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable "smart wear" for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study.

Innovative Ge Quantum Dot Functional Sensing and Metrology Devices

DTIC Science & Technology

2017-08-21

information latency and power consumption . In contrast, optical interconnects have shown tremendous promise for replacing electrical wires thanks to...single oxidation step of Si0.85Ge0.15 nano-pillars patterned over a buffer layer of Si3N4 on top of the n-Si substrate. During the high- temperature ...exquisitely-controlled dynamic balance between the fluxes of oxygen and silicon interstitials. Results and Discussion: 1. Self-organized, gate

Manufacture and quality control of interconnecting wire harnesses, Volume 3

NASA Technical Reports Server (NTRS)

1972-01-01

The document covers interconnecting wire harnesses defined in the design standard, including type 6, enclosed in TFE heat shrink tubing; and type 7, flexible armored. Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into this document.

Innovative on board payload optical architecture for high throughput satellites

NASA Astrophysics Data System (ADS)

Baudet, D.; Braux, B.; Prieur, O.; Hughes, R.; Wilkinson, M.; Latunde-Dada, K.; Jahns, J.; Lohmann, U.; Fey, D.; Karafolas, N.

2017-11-01

For the next generation of HighThroughPut (HTP) Telecommunications Satellites, space end users' needs will result in higher link speeds and an increase in the number of channels; up to 512 channels running at 10Gbits/s. By keeping electrical interconnections based on copper, the constraints in term of power dissipation, number of electrical wires and signal integrity will become too demanding. The replacement of the electrical links by optical links is the most adapted solution as it provides high speed links with low power consumption and no EMC/EMI. But replacing all electrical links by optical links of an On Board Payload (OBP) is challenging. It is not simply a matter of replacing electrical components with optical but rather the whole concept and architecture have to be rethought to achieve a high reliability and high performance optical solution. In this context, this paper will present the concept of an Innovative OBP Optical Architecture. The optical architecture was defined to meet the critical requirements of the application: signal speed, number of channels, space reliability, power dissipation, optical signals crossing and components availability. The resulting architecture is challenging and the need for new developments is highlighted. But this innovative optically interconnected architecture will substantially outperform standard electrical ones.

Control and Measurement of an Xmon with the Quantum Socket

NASA Astrophysics Data System (ADS)

McConkey, T. G.; Bejanin, J. H.; Earnest, C. T.; McRae, C. R. H.; Rinehart, J. R.; Weides, M.; Mariantoni, M.

The implementation of superconducting quantum processors is rapidly reaching scalability limitations. Extensible electronics and wiring solutions for superconducting quantum bits (qubits) are among the most imminent issues to be tackled. The necessity to substitute planar electrical interconnects (e.g., wire bonds) with three-dimensional wires is emerging as a fundamental pillar towards scalability. In a previous work, we have shown that three-dimensional wires housed in a suitable package, named the quantum socket, can be utilized to measure high-quality superconducting resonators. In this work, we set out to test the quantum socket with actual superconducting qubits to verify its suitability as a wiring solution in the development of an extensible quantum computing architecture. To this end, we have designed and fabricated a series of Xmon qubits. The qubits range in frequency from about 6 to 7 GHz with anharmonicity of 200 MHz and can be tuned by means of Z pulses. Controlling tunable Xmons will allow us to verify whether the three-dimensional wires contact resistance is low enough for qubit operation. Qubit T1 and T2 times and single qubit gate fidelities are compared against current standards in the field.

A Model-Based Probabilistic Inversion Framework for Wire Fault Detection Using TDR

NASA Technical Reports Server (NTRS)

Schuet, Stefan R.; Timucin, Dogan A.; Wheeler, Kevin R.

2010-01-01

Time-domain reflectometry (TDR) is one of the standard methods for diagnosing faults in electrical wiring and interconnect systems, with a long-standing history focused mainly on hardware development of both high-fidelity systems for laboratory use and portable hand-held devices for field deployment. While these devices can easily assess distance to hard faults such as sustained opens or shorts, their ability to assess subtle but important degradation such as chafing remains an open question. This paper presents a unified framework for TDR-based chafing fault detection in lossy coaxial cables by combining an S-parameter based forward modeling approach with a probabilistic (Bayesian) inference algorithm. Results are presented for the estimation of nominal and faulty cable parameters from laboratory data.

The Development of an IMU Integrated Clothes for Postural Monitoring Using Conductive Yarn and Interconnecting Technology

PubMed Central

Kang, Sung-Won; Park, Hyung-Il; Choi, Byoung-Gun; Shin, Dongjun; Jung, Young-Giu; Lee, Jun-Young; Park, Hong-Won; Park, Sukyung

2017-01-01

Spinal disease is a common yet important condition that occurs because of inappropriate posture. Prevention could be achieved by continuous posture monitoring, but most measurement systems cannot be used in daily life due to factors such as burdensome wires and large sensing modules. To improve upon these weaknesses, we developed comfortable “smart wear” for posture measurement using conductive yarn for circuit patterning and a flexible printed circuit board (FPCB) for interconnections. The conductive yarn was made by twisting polyester yarn and metal filaments, and the resistance per unit length was about 0.05 Ω/cm. An embroidered circuit was made using the conductive yarn, which showed increased yield strength and uniform electrical resistance per unit length. Circuit networks of sensors and FPCBs for interconnection were integrated into clothes using a computer numerical control (CNC) embroidery process. The system was calibrated and verified by comparing the values measured by the smart wear with those measured by a motion capture camera system. Six subjects performed fixed movements and free computer work, and, with this system, we were able to measure the anterior/posterior direction tilt angle with an error of less than 4°. The smart wear does not have excessive wires, and its structure will be optimized for better posture estimation in a later study. PMID:29112125

Electromagnetically Clean Solar Arrays

NASA Technical Reports Server (NTRS)

Stem, Theodore G.; Kenniston, Anthony E.

2008-01-01

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

A solar module fabrication process for HALE solar electric UAV's

NASA Astrophysics Data System (ADS)

Carey, P. G.; Aceves, R. C.; Colella, N. J.; Williams, K. A.; Sinton, R. A.; Glenn, G. S.

1994-12-01

We describe a fabrication process used to manufacture high power-to-weight-ratio flexible solar array modules for use on high-altitude-long-endurance (HALE) solar-electric unmanned air vehicles (UAV's). These modules have achieved power-to-weight ratios of 315 and 396 W/kg for 150 micron-thick monofacial and 110 micron-thick bifacial silicon solar cells, respectively. These calculations reflect average module efficiencies of 15.3% (150 micron) and 14.7% (110 micron) obtained from electrical tests performed by Spectrolab, Inc. under AMO global conditions at 25 C, and include weight contributions from all module components (solar cells, lamination material, bypass diodes, interconnect wires, and adhesive tape used to attach the modules to the wing). The fabrication, testing, and performance of 32 sq m of these modules is described.

Manufacture and quality control of interconnecting wire hardnesses, Volume 1

NASA Technical Reports Server (NTRS)

1972-01-01

A standard is presented for manufacture, installation, and quality control of eight types of interconnecting wire harnesses. The processes, process controls, and inspection and test requirements reflected are based on acknowledgment of harness design requirements, acknowledgment of harness installation requirements, identification of the various parts, materials, etc., utilized in harness manufacture, and formulation of a typical manufacturing flow diagram for identification of each manufacturing and quality control process, operation, inspection, and test. The document covers interconnecting wire harnesses defined in the design standard, including type 1, enclosed in fluorocarbon elastomer convolute, tubing; type 2, enclosed in TFE convolute tubing lines with fiberglass braid; type 3, enclosed in TFE convolute tubing; and type 5, combination of types 3 and 4. Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated.

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

NASA Astrophysics Data System (ADS)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

Intelligent, self-contained robotic hand

DOEpatents

Krutik, Vitaliy; Doo, Burt; Townsend, William T.; Hauptman, Traveler; Crowell, Adam; Zenowich, Brian; Lawson, John

2007-01-30

A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movement of a link. Wires for electrical power and communication serially connect the controllers in a distributed control network. A network operating controller coordinates the operation of the network, including power distribution. At least one, but more typically two to five, wires interconnect all the controllers through one or more joints. Motor sensors and external world sensors monitor operating parameters of the robotic hand. The electrical signal output of the sensors can be input anywhere on the distributed control network. V-grooves on the robotic hand locate objects precisely and assist in gripping. The hand is sealed, immersible and has electrical connections through the rotary joints for anodizing in a single dunk without masking. In various forms, this intelligent, self-contained, dexterous hand, or combinations of such hands, can perform a wide variety of object gripping and manipulating tasks, as well as locomotion and combinations of locomotion and gripping.

Process for anodizing a robotic device

DOEpatents

Townsend, William T [Weston, MA

2011-11-08

A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movement of a link. Wires for electrical power and communication serially connect the controllers in a distributed control network. A network operating controller coordinates the operation of the network, including power distribution. At least one, but more typically two to five, wires interconnect all the controllers through one or more joints. Motor sensors and external world sensors monitor operating parameters of the robotic hand. The electrical signal output of the sensors can be input anywhere on the distributed control network. V-grooves on the robotic hand locate objects precisely and assist in gripping. The hand is sealed, immersible and has electrical connections through the rotary joints for anodizing in a single dunk without masking. In various forms, this intelligent, self-contained, dexterous hand, or combinations of such hands, can perform a wide variety of object gripping and manipulating tasks, as well as locomotion and combinations of locomotion and gripping.

Wireless Interconnects for Intra-chip & Inter-chip Transmission

NASA Astrophysics Data System (ADS)

Narde, Rounak Singh

With the emergence of Internet of Things and information revolution, the demand of high performance computing systems is increasing. The copper interconnects inside the computing chips have evolved into a sophisticated network of interconnects known as Network on Chip (NoC) comprising of routers, switches, repeaters, just like computer networks. When network on chip is implemented on a large scale like in Multicore Multichip (MCMC) systems for High Performance Computing (HPC) systems, length of interconnects increases and so are the problems like power dissipation, interconnect delays, clock synchronization and electrical noise. In this thesis, wireless interconnects are chosen as the substitute for wired copper interconnects. Wireless interconnects offer easy integration with CMOS fabrication and chip packaging. Using wireless interconnects working at unlicensed mm-wave band (57-64GHz), high data rate of Gbps can be achieved. This thesis presents study of transmission between zigzag antennas as wireless interconnects for Multichip multicores (MCMC) systems and 3D IC. For MCMC systems, a four-chips 16-cores model is analyzed with only four wireless interconnects in three configurations with different antenna orientations and locations. Return loss and transmission coefficients are simulated in ANSYS HFSS. Moreover, wireless interconnects are designed, fabricated and tested on a 6'' silicon wafer with resistivity of 55O-cm using a basic standard CMOS process. Wireless interconnect are designed to work at 30GHz using ANSYS HFSS. The fabricated antennas are resonating around 20GHz with a return loss of less than -10dB. The transmission coefficients between antenna pair within a 20mm x 20mm silicon die is found to be varying between -45dB to -55dB. Furthermore, wireless interconnect approach is extended for 3D IC. Wireless interconnects are implemented as zigzag antenna. This thesis extends the work of analyzing the wireless interconnects in 3D IC with different configurations of antenna orientations and coolants. The return loss and transmission coefficients are simulated using ANSYS HFSS.

A low-cost, manufacturable method for fabricating capillary and optical fiber interconnects for microfluidic devices.

PubMed

Hartmann, Daniel M; Nevill, J Tanner; Pettigrew, Kenneth I; Votaw, Gregory; Kung, Pang-Jen; Crenshaw, Hugh C

2008-04-01

Microfluidic chips require connections to larger macroscopic components, such as light sources, light detectors, and reagent reservoirs. In this article, we present novel methods for integrating capillaries, optical fibers, and wires with the channels of microfluidic chips. The method consists of forming planar interconnect channels in microfluidic chips and inserting capillaries, optical fibers, or wires into these channels. UV light is manually directed onto the ends of the interconnects using a microscope. UV-curable glue is then allowed to wick to the end of the capillaries, fibers, or wires, where it is cured to form rigid, liquid-tight connections. In a variant of this technique, used with light-guiding capillaries and optical fibers, the UV light is directed into the capillaries or fibers, and the UV-glue is cured by the cone of light emerging from the end of each capillary or fiber. This technique is fully self-aligned, greatly improves both the quality and the manufacturability of the interconnects, and has the potential to enable the fabrication of interconnects in a fully automated fashion. Using these methods, including a semi-automated implementation of the second technique, over 10,000 interconnects have been formed in almost 2000 microfluidic chips made of a variety of rigid materials. The resulting interconnects withstand pressures up to at least 800psi, have unswept volumes estimated to be less than 10 femtoliters, and have dead volumes defined only by the length of the capillary.

Adaptive Code Division Multiple Access Protocol for Wireless Network-on-Chip Architectures

NASA Astrophysics Data System (ADS)

Vijayakumaran, Vineeth

Massive levels of integration following Moore's Law ushered in a paradigm shift in the way on-chip interconnections were designed. With higher and higher number of cores on the same die traditional bus based interconnections are no longer a scalable communication infrastructure. On-chip networks were proposed enabled a scalable plug-and-play mechanism for interconnecting hundreds of cores on the same chip. Wired interconnects between the cores in a traditional Network-on-Chip (NoC) system, becomes a bottleneck with increase in the number of cores thereby increasing the latency and energy to transmit signals over them. Hence, there has been many alternative emerging interconnect technologies proposed, namely, 3D, photonic and multi-band RF interconnects. Although they provide better connectivity, higher speed and higher bandwidth compared to wired interconnects; they also face challenges with heat dissipation and manufacturing difficulties. On-chip wireless interconnects is one other alternative proposed which doesn't need physical interconnection layout as data travels over the wireless medium. They are integrated into a hybrid NOC architecture consisting of both wired and wireless links, which provides higher bandwidth, lower latency, lesser area overhead and reduced energy dissipation in communication. However, as the bandwidth of the wireless channels is limited, an efficient media access control (MAC) scheme is required to enhance the utilization of the available bandwidth. This thesis proposes using a multiple access mechanism such as Code Division Multiple Access (CDMA) to enable multiple transmitter-receiver pairs to send data over the wireless channel simultaneously. It will be shown that such a hybrid wireless NoC with an efficient CDMA based MAC protocol can significantly increase the performance of the system while lowering the energy dissipation in data transfer. In this work it is shown that the wireless NoC with the proposed CDMA based MAC protocol outperformed the wired counterparts and several other wireless architectures proposed in literature in terms of bandwidth and packet energy dissipation. Significant gains were observed in packet energy dissipation and bandwidth even with scaling the system to higher number of cores. Non-uniform traffic simulations showed that the proposed CDMA-WiNoC was consistent in bandwidth across all traffic patterns. It is also shown that the CDMA based MAC scheme does not introduce additional reliability concerns in data transfer over the on-chip wireless interconnects.

Printed wiring board system programmer's manual

NASA Technical Reports Server (NTRS)

Brinkerhoff, C. D.

1973-01-01

The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

Investigation of ball bond integrity for 0.8 mil (20 microns) diameter gold bonding wire on low k die in wire bonding technology

NASA Astrophysics Data System (ADS)

Kudtarkar, Santosh Anil

Microelectronics technology has been undergoing continuous scaling to accommodate customer driven demand for smaller, faster and cheaper products. This demand has been satisfied by using novel materials, design techniques and processes. This results in challenges for the chip connection technology and also the package technology. The focus of this research endeavor was restricted to wire bond interconnect technology using gold bonding wires. Wire bond technology is often regarded as a simple first level interconnection technique. In reality, however, this is a complex process that requires a thorough understanding of the interactions between the design, material and process variables, and their impact on the reliability of the bond formed during this process. This research endeavor primarily focused on low diameter, 0.8 mil thick (20 mum) diameter gold bonding wire. Within the scope of this research, the integrity of the ball bond formed by 1.0 mil (25 mum) and 0.8 mil (20 mum) diameter wires was compared. This was followed by the evaluation of bonds formed on bond pads having doped SiO2 (low k) as underlying structures. In addition, the effect of varying the percentage of the wire dopant, palladium and bonding process parameters (bonding force, bond time, ultrasonic energy) for 0.8 mil (20 mum) bonding wire was also evaluated. Finally, a degradation empirical model was developed to understand the decrease in the wire strength. This research effort helped to develop a fundamental understanding of the various factors affecting the reliability of a ball bond from a design (low diameter bonding wire), material (low k and bonding wire dopants), and process (wire bonding process parameters) perspective for a first level interconnection technique, namely wire bonding. The significance of this research endeavor was the systematic investigation of the ball bonds formed using 0.8 mil (20 microm) gold bonding wire within the wire bonding arena. This research addressed low k structures on 90 nm silicon technology, bonding wires with different percentage of doping element (palladium), and different levels of bonding process parameters. An empirical model to understand the high temperature effects for bonds formed using the low diameter wire was also developed.

Development of a Thin-Film Solar Cell Interconnect for the Powersphere Concept

NASA Technical Reports Server (NTRS)

Simburger, Edward J.; Matsumoto, James H.; Giants, Thomas W.; Garcia, Alexander, III; Liu, Simon; Rawal, Suraj P.; Perry, Alan R.; Marshall, Craig; Lin, John K.; Scarborough, Stephen E.

2005-01-01

Dual junction amorphous silicon (a-Si) solar cells produced on polyimide substrate have been selected as the best candidate to produce a lightweight solar array for the PowerSphere program. The PowerSphere concept features a space-inflatable, geodetic solar array approximately 0.6 meters in diameter and capable of generating about 20W of electrical power. Trade studies of various wiring concepts and connection methods led to an interconnect design with a copper contact that wraps around the edge, to the back of the solar cell. Applying Plasma Vapor Deposited (PVD) copper film to both sides and the edge of the solar cell produces the wrap around contact. This procedure results in a contact pad on the back of the solar cell, which is then laser welded to a flex circuit material. The flex circuit is constructed of copper in a custom designed routing pattern, and then sandwiched in a Kapton insulation layer. The flex circuit then serves as the primary power distribution system between the solar cells and the spacecraft. Flex circuit material is the best candidate for the wiring harness because it allows for low force deployment of the solar cells by the inflatable hinges on the PowerSphere. An additional frame structure, fabricated and assembled by ILC Dover, will reinforce the wrap around contact-flex blanket connection, thus providing a mechanically robust solar cell interconnect for the PowerSphere multifunctional program. The PowerSphere team will use the wraparound contact design approach as the primary solution for solar cell integration and the flex blanket for power distribution.

Microwave interconnection

NASA Astrophysics Data System (ADS)

Fry, P. E.

1993-06-01

A limited evaluation was made of two commonly found microwave interconnections: microstrip-to-microstrip and coaxial-to-microstrip. The evaluation attempted to select the interconnection technique which worked best for the particular interface type. Short ribbon wires worked best for the microstrip-to-microstrip interconnection. A published method of compensating the microstrip conductor had the best performance for the coaxial-to-microstrip interconnection. The work was conducted under the Microwave Technology Process Capability Assurance Program at Allied-Signal Inc., Kansas City Division.

Travel Time Data Collection Field Tests - Lessons Learned

DOT National Transportation Integrated Search

1999-06-28

The Los Angeles Spread Spectrum Radio (SSR) Traffic Signal Interconnect Field Operational Test (FOT) investigated the feasibility of using wireless communications as an alternative to traditional hard-wire interconnection, to extend the coverage of c...

Optical link by using optical wiring method for reducing EMI

NASA Astrophysics Data System (ADS)

Cho, In-Kui; Kwon, Jong-Hwa; Choi, Sung-Woong; Bondarik, Alexander; Yun, Je-Hoon; Kim, Chang-Joo; Ahn, Seung-Beom; Jeong, Myung-Yung; Park, Hyo Hoon

2008-12-01

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx) for reducing EMI (electromagnetic interference). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. The key benefit of fiber optic link is the absence of electromagnetic interference (EMI) noise creation and susceptibility. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (i) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (ii) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (iii) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. Electronic interconnections have uniquely electronic problems such as EMI, shorting, and ground loops. Since these problems only arise during transduction (electronics-to-optics or opticsto- electronics), the purely optical part and optical link(interconnection) is free of these problems. 1 An optical link system constructed with TRx modules was fabricated and the optical characteristics about data links and EMI levels were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for reducing EMI of inter-chip interconnect. We successfully achieved a 4.5 Gb/s data transmission rate without EMI problems.

Multi-Response Optimization of WEDM Process Parameters Using Taguchi Based Desirability Function Analysis

NASA Astrophysics Data System (ADS)

Majumder, Himadri; Maity, Kalipada

2018-03-01

Shape memory alloy has a unique capability to return to its original shape after physical deformation by applying heat or thermo-mechanical or magnetic load. In this experimental investigation, desirability function analysis (DFA), a multi-attribute decision making was utilized to find out the optimum input parameter setting during wire electrical discharge machining (WEDM) of Ni-Ti shape memory alloy. Four critical machining parameters, namely pulse on time (TON), pulse off time (TOFF), wire feed (WF) and wire tension (WT) were taken as machining inputs for the experiments to optimize three interconnected responses like cutting speed, kerf width, and surface roughness. Input parameter combination TON = 120 μs., TOFF = 55 μs., WF = 3 m/min. and WT = 8 kg-F were found to produce the optimum results. The optimum process parameters for each desired response were also attained using Taguchi’s signal-to-noise ratio. Confirmation test has been done to validate the optimum machining parameter combination which affirmed DFA was a competent approach to select optimum input parameters for the ideal response quality for WEDM of Ni-Ti shape memory alloy.

Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits

PubMed Central

Yang, Cheng; Cui, Xiaoya; Zhang, Zhexu; Chiang, Sum Wai; Lin, Wei; Duan, Huan; Li, Jia; Kang, Feiyu; Wong, Ching-Ping

2015-01-01

Fractal metallic dendrites have been drawing more attentions recently, yet they have rarely been explored in electronic printing or packaging applications because of the great challenges in large-scale synthesis and limited understanding in such applications. Here we demonstrate a controllable synthesis of fractal Ag micro-dendrites at the hundred-gram scale. When used as the fillers for isotropically electrically conductive composites (ECCs), the unique three-dimensional fractal geometrical configuration and low-temperature sintering characteristic render the Ag micro dendrites with an ultra-low electrical percolation threshold of 0.97 vol% (8 wt%). The ultra-low percolation threshold and self-limited fusing ability may address some critical challenges in current interconnect technology for microelectronics. For example, only half of the laser-scribe energy is needed to pattern fine circuit lines printed using the present ECCs, showing great potential for wiring ultrathin circuits for high performance flexible electronics. PMID:26333352

First-principles study of the variation of electron transport in a single molecular junction with the length of the molecular wire

NASA Astrophysics Data System (ADS)

Pal, Partha Pratim; Pati, Ranjit

2010-07-01

We report a first-principles study of quantum transport in a prototype two-terminal device consisting of a molecular nanowire acting as an inter-connect between two gold electrodes. The wire is composed of a series of bicyclo[1.1.1]pentane (BCP) cage-units. The length of the wire (L) is increased by sequentially increasing the number of BCP cage units in the wire from 1 to 3. A two terminal model device is made out of each of the three wires. A parameter free, nonequilibrium Green’s function approach, in which the bias effect is explicitly included within a many body framework, is used to calculate the current-voltage characteristics of each of the devices. In the low bias regime that is considered in our study, the molecular devices are found to exhibit Ohmic behavior with resistances of 0.12, 1.4, and 6.5μΩ for the wires containing one, two, and three cages respectively. Thus the conductance value, Gc , which is the reciprocal of resistance, decreases as e-βL with a decay constant (β) of 0.59Å-1 . This observed variation of conductance with the length of the wire is in excellent agreement with the earlier reported exponential decay feature of the electron transfer rate predicted from the electron transfer coupling matrix values obtained using the two-state Marcus-Hush model and the Koopman’s theorem approximation. The downright suppression of the computed electrical current for a bias up to 0.4 V in the longest wire can be exploited in designing a three terminal molecular transistor; this molecular wire could potentially be used as a throttle to avoid leakage gate current.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Guo, Rui; Gao, Liming, E-mail: liming.gao@sjtu.edu.cn; Li, Ming, E-mail: mingli90@sjtu.edu.cn

As the continuous shrinkage of the interconnect line width in microelectronics devices, there is a growing concern about the electromigration (EM) failure of bonding wire. In addition, an innovative Ag–8Au–3Pd alloy wire has shown promise as an economical substitute for gold wire interconnects due to the cost pressure of gold in the last decade. In present study of the Ag–8Au–3Pd alloy wire, the surface diffusion occupied the dominant position during EM failure, and the activation energy was found to be 0.61 eV. In order to reveal the failure mechanism, the cross-sections of the Ag–8Au–3Pd alloy wire during EM were preparedmore » by focused ion beam (FIB) micro-machining for electron backscatter diffraction (EBSD) analysis. The microstructure evolution of the Ag–8Au–3Pd alloy wire was characterized by the grain size and grain boundary. As a result, the EM failure originates in the atom transportation, which causes grain size increasing and atom diffusion on the wire surface. - Highlights: • The activation energy of Ag–8Au–3Pd alloy wire was obtained as 0.61 eV. • During EM, the silver atoms diffused from negative to the positive terminal on the wire surface. • The microstructure (grain size and grain boundary) was characterized by FIB-EBSD. • During EM, the atom transportation was found to cause grain size growth and atom diffusion on the wire surface.« less

Thermoreflectance imaging of electromigration evolution in asymmetric aluminum constrictions

NASA Astrophysics Data System (ADS)

Tian, Hao; Ahn, Woojin; Maize, Kerry; Si, Mengwei; Ye, Peide; Alam, Muhammad Ashraful; Shakouri, Ali; Bermel, Peter

2018-01-01

Electromigration (EM) is a phenomenon whereby the flow of current in metal wires moves the underlying atoms, potentially inducing electronic interconnect failures. The continued decrease in commercial lithographically defined feature sizes means that EM presents an increasing risk to the reliability of modern electronics. To mitigate these risks, it is important to look for novel mechanisms to extend lifetime without forfeiting miniaturization. Typically, only the overall increase in the interconnect resistance and failure voltage are characterized. However, if the current flows non-uniformly, spatially resolving the resulting hot spots during electromigration aging experiments may provide better insights into the fundamental mechanisms of this process. In this study, we focus on aluminum interconnects containing asymmetric reservoir and void pairs with contact pads on each end. Such reservoirs are potential candidates for self-healing. Thermoreflectance imaging was used to detect hot spots in electrical interconnects at risk of failure as the voltage was gradually increased. It reveals differential heating with increasing voltage for each polarity. We find that while current flow going from a constriction to a reservoir causes a break at the void, the identical structure with the opposite polarity can sustain higher current (J = 21 × 106 A/cm2) and more localized joule heating and yet is more stable. Ultimately, a break takes place at the contact pad where the current flows from narrow interconnect to larger pads. In summary, thermoreflectance imaging with submicron spatial resolution provides valuable information about localized electromigration evolution and the potential role of reservoirs to create more robust interconnects.

Micro-fluidic interconnect

DOEpatents

Okandan, Murat [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Benavides, Gilbert L [Los Ranchos, NM; Hetherington, Dale L [Albuquerque, NM

2006-02-28

An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm.times.6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.

Laser printing of 3D metallic interconnects

NASA Astrophysics Data System (ADS)

Beniam, Iyoel; Mathews, Scott A.; Charipar, Nicholas A.; Auyeung, Raymond C. Y.; Piqué, Alberto

2016-04-01

The use of laser-induced forward transfer (LIFT) techniques for the printing of functional materials has been demonstrated for numerous applications. The printing gives rise to patterns, which can be used to fabricate planar interconnects. More recently, various groups have demonstrated electrical interconnects from laser-printed 3D structures. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or of pastes containing dispersed metallic particles. However, the generated 3D structures do not posses the same metallic conductivity as a bulk metal interconnect of the same cross-section and length as those formed by wire bonding or tab welding. An alternative is to laser transfer entire 3D structures using a technique known as lase-and-place. Lase-and-place is a LIFT process whereby whole components and parts can be transferred from a donor substrate onto a desired location with one single laser pulse. This paper will describe the use of LIFT to laser print freestanding, solid metal foils or beams precisely over the contact pads of discrete devices to interconnect them into fully functional circuits. Furthermore, this paper will also show how the same laser can be used to bend or fold the bulk metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief for the circuits under flexing or during motion from thermal mismatch. These interconnect "ridges" can span wide gaps (on the order of a millimeter) and accommodate height differences of tens of microns between adjacent devices. Examples of these laser printed 3D metallic bridges and their role in the development of next generation electronics by additive manufacturing will be presented.

Optical properties of electrically connected plasmonic nanoantenna dimer arrays

NASA Astrophysics Data System (ADS)

Zimmerman, Darin T.; Borst, Benjamin D.; Carrick, Cassandra J.; Lent, Joseph M.; Wambold, Raymond A.; Weisel, Gary J.; Willis, Brian G.

2018-02-01

We fabricate electrically connected gold nanoantenna arrays of homodimers and heterodimers on silica substrates and present a systematic study of their optical properties. Electrically connected arrays of plasmonic nanoantennas make possible the realization of novel photonic devices, including optical sensors and rectifiers. Although the plasmonic response of unconnected arrays has been studied extensively, the present study shows that the inclusion of nanowire connections modifies the device response significantly. After presenting experimental measurements of optical extinction for unconnected dimer arrays, we compare these to measurements of dimers that are interconnected by gold nanowire "busbars." The connected devices show the familiar dipole response associated with the unconnected dimers but also show a second localized surface plasmon resonance (LSPR) that we refer to as the "coupled-busbar mode." Our experimental study also demonstrates that the placement of the nanowire along the antenna modifies the LSPR. Using finite-difference time-domain simulations, we confirm the experimental results and investigate the variation of dimer gap and spacing. Changing the dimer gap in connected devices has a significantly smaller effect on the dipole response than it does in unconnected devices. On the other hand, both LSPR modes respond strongly to changing the spacing between devices in the direction along the interconnecting wires. We also give results for the variation of E-field strength in the dimer gap, which will be important for any working sensor or rectenna device.

Using Ant Colony Optimization for Routing in VLSI Chips

NASA Astrophysics Data System (ADS)

Arora, Tamanna; Moses, Melanie

2009-04-01

Rapid advances in VLSI technology have increased the number of transistors that fit on a single chip to about two billion. A frequent problem in the design of such high performance and high density VLSI layouts is that of routing wires that connect such large numbers of components. Most wire-routing problems are computationally hard. The quality of any routing algorithm is judged by the extent to which it satisfies routing constraints and design objectives. Some of the broader design objectives include minimizing total routed wire length, and minimizing total capacitance induced in the chip, both of which serve to minimize power consumed by the chip. Ant Colony Optimization algorithms (ACO) provide a multi-agent framework for combinatorial optimization by combining memory, stochastic decision and strategies of collective and distributed learning by ant-like agents. This paper applies ACO to the NP-hard problem of finding optimal routes for interconnect routing on VLSI chips. The constraints on interconnect routing are used by ants as heuristics which guide their search process. We found that ACO algorithms were able to successfully incorporate multiple constraints and route interconnects on suite of benchmark chips. On an average, the algorithm routed with total wire length 5.5% less than other established routing algorithms.

Advanced Flip Chips in Extreme Temperature Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2010-01-01

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Method of fabricating high-density hermetic electrical feedthroughs using insulated wire bundles

DOEpatents

Shah, Kedar G.; Benett, William J.; Pannu, Satinderpall S.

2016-05-10

A method of fabricating electrical feedthroughs coats of a plurality of electrically conductive wires with an electrically insulating material and bundles the coated wires together in a substantially parallel arrangement. The bundled coated wires are secured to each other by joining the electrically insulating material of adjacent wires together to form a monolithic block which is then cut transverse to the wires to produce a block section having opposing first and second sides with a plurality of electrically conductive feedthroughs extending between them.

Digital communication system

NASA Technical Reports Server (NTRS)

Monford, L. G., Jr. (Inventor)

1974-01-01

A digital communication system is reported for parallel operation of 16 or more transceiver units with the use of only four interconnecting wires. A remote synchronization circuit produces unit address control words sequentially in data frames of 16 words. Means are provided in each transceiver unit to decode calling signals and to transmit calling and data signals. The transceivers communicate with each other over one data line. The synchronization unit communicates the address control information to the transceiver units over an address line and further provides the timing information over a clock line. A reference voltage level or ground line completes the interconnecting four wire hookup.

Perforation patterned electrical interconnects

DOEpatents

Frey, Jonathan

2014-01-28

This disclosure describes systems and methods for increasing the usable surface area of electrical contacts within a device, such as a thin film solid state device, through the implementation of electrically conductive interconnects. Embodiments described herein include the use of a plurality of electrically conductive interconnects that penetrate through a top contact layer, through one or more multiple layers, and into a bottom contact layer. The plurality of conductive interconnects may form horizontal and vertical cross-sectional patterns. The use of lasers to form the plurality of electrically conductive interconnects from reflowed layer material further aids in the manufacturing process of a device.

Interchip link system using an optical wiring method.

PubMed

Cho, In-Kui; Ryu, Jin-Hwa; Jeong, Myung-Yung

2008-08-15

A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.

The Quantum Socket: Wiring for Superconducting Qubits - Part 1

NASA Astrophysics Data System (ADS)

McConkey, T. G.; Bejanin, J. H.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

Quantum systems with ten superconducting quantum bits (qubits) have been realized, making it possible to show basic quantum error correction (QEC) algorithms. However, a truly scalable architecture has not been developed yet. QEC requires a two-dimensional array of qubits, restricting any interconnection to external classical systems to the third axis. In this talk, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket employs three-dimensional wires and makes it possible to connect classical electronics with quantum circuits more densely and accurately than methods based on wire bonding. The three-dimensional wires are based on spring-loaded pins engineered to insure compatibility with quantum computing applications. Extensive design work and machining was required, with focus on material quality to prevent magnetic impurities. Microwave simulations were undertaken to optimize the design, focusing on the interface between the micro-connector and an on-chip coplanar waveguide pad. Simulations revealed good performance from DC to 10 GHz and were later confirmed against experimental measurements.

Apollo experience report: Electrical wiring subsystem

NASA Technical Reports Server (NTRS)

White, L. D.

1975-01-01

The general requirements of the electrical wiring subsystems and the problem areas and solutions that occurred during the major part of the Apollo Program are detailed in this report. The concepts and definitions of specific requirements for electrical wiring; wire-connecting devices; and wire-harness fabrication, checkout, and installation techniques are discussed. The design and development of electrical wiring and wire-connecting devices are described. Mission performance is discussed, and conclusions and recommendations for future programs are presented.

An interactive wire-wrap board layout program

NASA Technical Reports Server (NTRS)

Schlutsmeyer, A.

1987-01-01

An interactive computer-graphics-based tool for specifying the placement of electronic parts on a wire-wrap circuit board is presented. Input is a data file (currently produced by a commercial logic design system) which describes the parts used and their interconnections. Output includes printed reports describing the parts and wire paths, parts counts, placement lists, board drawing, and a tape to send to the wire-wrap vendor. The program should reduce the engineer's layout time by a factor of 3 to 5 as compared to manual methods.

Processing and characterization of device solder interconnection and module attachment for power electronics modules

NASA Astrophysics Data System (ADS)

Haque, Shatil

This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the surface, which was not observed in the case of Si3N4 passivated devices. X-Ray Photoelectron Spectroscopy (XPS) Spectra showed evidence of possible carbon contaminants, such as carbide (˜282.9eV) and graphite (˜284.3eV) on the surface at binding energies below the binding energy of the hydrocarbon peak (C 1s at 285eV). Whereas above the hydrocarbon peak energy level, carbon-nitrogen compounds, single bond carbon compounds (˜285.9eV) and double bond carbon compounds (˜288.5eV) were evident. The majority of the carbon composition on the pad surface was associated with hydrocarbons, which were hydrophobic in nature, thus making the device contact pad less wettable. (Abstract shortened by UMI.)

System and method for evaluating a wire conductor

DOEpatents

Panozzo, Edward; Parish, Harold

2013-10-22

A method of evaluating an electrically conductive wire segment having an insulated intermediate portion and non-insulated ends includes passing the insulated portion of the wire segment through an electrically conductive brush. According to the method, an electrical potential is established on the brush by a power source. The method also includes determining a value of electrical current that is conducted through the wire segment by the brush when the potential is established on the brush. The method additionally includes comparing the value of electrical current conducted through the wire segment with a predetermined current value to thereby evaluate the wire segment. A system for evaluating an electrically conductive wire segment is also disclosed.

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Elshabini, Aicha; Barlow, Fred D.

A key issue associated with the wider adoption of hybrid-electric vehicles (HEV) and plug in hybrid-electric vehicles (PHEV) is the implementation of the power electronic systems that are required in these products. One of the primary industry goals is the reduction in the price of these vehicles relative to the cost of traditional gasoline powered vehicles. Today these systems, such as the Prius, utilize one coolant loop for the engine at approximately 100 C coolant temperatures, and a second coolant loop for the inverter at 65 C. One way in which significant cost reduction of these systems could be achievedmore » is through the use of a single coolant loop for both the power electronics as well as the internal combustion engine (ICE). This change in coolant temperature significantly increases the junction temperatures of the devices and creates a number of challenges for both device fabrication and the assembly of these devices into inverters and converters for HEV and PHEV applications. Traditional power modules and the state-of-the-art inverters in the current HEV products, are based on chip and wire assembly and direct bond copper (DBC) on ceramic substrates. While a shift to silicon carbide (SiC) devices from silicon (Si) devices would allow the higher operating temperatures required for a single coolant loop, it also creates a number of challenges for the assembly of these devices into power inverters. While this traditional packaging technology can be extended to higher temperatures, the key issues are the substrate material and conductor stability, die bonding material, wire bonds, and bond metallurgy reliability as well as encapsulation materials that are stable at high operating temperatures. The larger temperature differential during power cycling, which would be created by higher coolant temperatures, places tremendous stress on traditional aluminum wire bonds that are used to interconnect power devices. Selection of the bond metallurgy and wire bond geometry can play a key role in mitigating this stress. An alternative solution would be to eliminate the wire bonds completely through a fundamentally different method of forming a reliable top side interconnect. Similarly, the solders used in most power modules exhibit too low of a liquidus to be viable solutions for maximum junction temperatures of 200 C. Commonly used encapsulation materials, such as silicone gels, also suffer from an inability to operate at 200 C for extended periods of time. Possible solutions to these problems exist in most cases but require changes to the traditional manufacturing process used in these modules. In addition, a number of emerging technologies such as Si nitride, flip-chip assembly methods, and the elimination of base-plates would allow reliable module development for operation of HEV and PHEV inverters at elevated junction temperatures.« less

Reliability Criteria for Thick Bonding Wire.

PubMed

Dagdelen, Turker; Abdel-Rahman, Eihab; Yavuz, Mustafa

2018-04-17

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

Reliability Criteria for Thick Bonding Wire

PubMed Central

Yavuz, Mustafa

2018-01-01

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. PMID:29673194

Centralized database for interconnection system design. [for spacecraft

NASA Technical Reports Server (NTRS)

Billitti, Joseph W.

1989-01-01

A database application called DFACS (Database, Forms and Applications for Cabling and Systems) is described. The objective of DFACS is to improve the speed and accuracy of interconnection system information flow during the design and fabrication stages of a project, while simultaneously supporting both the horizontal (end-to-end wiring) and the vertical (wiring by connector) design stratagems used by the Jet Propulsion Laboratory (JPL) project engineering community. The DFACS architecture is centered around a centralized database and program methodology which emulates the manual design process hitherto used at JPL. DFACS has been tested and successfully applied to existing JPL hardware tasks with a resulting reduction in schedule time and costs.

Advanced wiring technique and hardware application: Airplane and space vehicle

NASA Technical Reports Server (NTRS)

Ernst, H. L.; Eichman, C. D.

1972-01-01

An advanced wiring system is described which achieves the safety/reliability required for present and future airplane and space vehicle applications. Also, present wiring installation techniques and hardware are analyzed to establish existing problem areas. An advanced wiring system employing matrix interconnecting unit, plug to plug trunk bundles (FCC or ribbon cable) is outlined, and an installation study presented. A planned program to develop, lab test and flight test key features of these techniques and hardware as a part of the SST technology follow-on activities is discussed.

Fuel cell electrode interconnect contact material encapsulation and method

DOEpatents

Derose, Anthony J.; Haltiner, Jr., Karl J.; Gudyka, Russell A.; Bonadies, Joseph V.; Silvis, Thomas W.

2016-05-31

A fuel cell stack includes a plurality of fuel cell cassettes each including a fuel cell with an anode and a cathode. Each fuel cell cassette also includes an electrode interconnect adjacent to the anode or the cathode for providing electrical communication between an adjacent fuel cell cassette and the anode or the cathode. The interconnect includes a plurality of electrode interconnect protrusions defining a flow passage along the anode or the cathode for communicating oxidant or fuel to the anode or the cathode. An electrically conductive material is disposed between at least one of the electrode interconnect protrusions and the anode or the cathode in order to provide a stable electrical contact between the electrode interconnect and the anode or cathode. An encapsulating arrangement segregates the electrically conductive material from the flow passage thereby, preventing volatilization of the electrically conductive material in use of the fuel cell stack.

30 CFR 77.516 - Electric wiring and equipment; installation and maintenance.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Electric wiring and equipment; installation and... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.516 Electric wiring and equipment; installation and maintenance. In addition to the requirements of §§ 77.503 and 77.506, all wiring and...

Interconnect assembly for an electronic assembly and assembly method therefor

DOEpatents

Gerbsch, Erich William

2003-06-10

An interconnect assembly and method for a semiconductor device, in which the interconnect assembly can be used in lieu of wirebond connections to form an electronic assembly. The interconnect assembly includes first and second interconnect members. The first interconnect member has a first surface with a first contact and a second surface with a second contact electrically connected to the first contact, while the second interconnect member has a flexible finger contacting the second contact of the first interconnect member. The first interconnect member is adapted to be aligned and registered with a semiconductor device having a contact on a first surface thereof, so that the first contact of the first interconnect member electrically contacts the contact of the semiconductor device. Consequently, the assembly method does not require any wirebonds, but instead merely entails aligning and registering the first interconnect member with the semiconductor device so that the contacts of the first interconnect member and the semiconductor device make electrically contact, and then contacting the second contact of the first interconnect member with the flexible finger of the second interconnect member.

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2014 CFR

2014-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2012 CFR

2012-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2013 CFR

2013-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

2001-01-01

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Mountain Plains Learning Experience Guide: Electrical Wiring. Course: Electrical Wiring Rough-In.

ERIC Educational Resources Information Center

Arneson, R.; And Others

One of two individualized courses included in an electrical wiring curriculum, this course covers electrical installations that are generally hidden within the structure. The course is comprised of four units: (1) Outlet and Switch Boxes, (2) Wiring, (3) Service Entrance, and (4) Signal and Low Voltage Systems. Each unit begins with a Unit…

Ultrasonic friction power during Al wire wedge-wedge bonding

NASA Astrophysics Data System (ADS)

Shah, A.; Gaul, H.; Schneider-Ramelow, M.; Reichl, H.; Mayer, M.; Zhou, Y.

2009-07-01

Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultrasonic transducer, the vibration amplitude of the bonding tool tip in free air, and the ultrasonic force acting on the bonding pad during the bond process. The ultrasonic force measurement is like a signature of the bond as it allows for a detailed insight into mechanisms during various phases of the process. It is measured using piezoresistive force microsensors integrated close to the Al bonding pad (Al-Al process) on a custom made test chip. A clear break-off in the force signal is observed, which is followed by a relatively constant force for a short duration. A large second harmonic content is observed, describing a nonsymmetric deviation of the signal wave form from the sinusoidal shape. This deviation might be due to the reduced geometrical symmetry of the wedge tool. For bonds made with typical process parameters, several characteristic values used in the friction power model are determined. The ultrasonic compliance of the bonding system is 2.66μm/N. A typical maximum value of the relative interfacial amplitude of ultrasonic friction is at least 222nm. The maximum interfacial friction power is at least 11.5mW, which is only about 4.8% of the total electrical power delivered to the ultrasonic generator.

Photovoltaic system with improved AC connections and method of making same

DOEpatents

Cioffi, Philip Michael; Todorovic, Maja Harfman; Herzog, Michael Scott; Korman, Charles Steven; Doherty, Donald M.; Johnson, Neil Anthony

2018-02-13

An alternating current (AC) harness for a photovoltaic (PV) system includes a wire assembly having a first end and a second end, the wire assembly having a plurality of lead wires, and at least one AC connection module positioned at a location along a length of the wire assembly between the first end and the second end. Further, the at least one AC connection module includes a first connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a first PV module of the PV system. The at least one AC connection module also includes a second connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a second PV module of the PV system.

Process for electrically interconnecting electrodes

DOEpatents

Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

2002-01-01

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb--Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb--Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

Electricity exchange and the valuation of transnational transmission access: A case study of intra-regional integration of the electric industries of Argentina and Chile

NASA Astrophysics Data System (ADS)

Brereton, Beverly Ann

The interconnection of neighboring electricity networks provides opportunities for the realization of synergies between electricity systems. Examples of the synergies to be realized are the rationalized management of the electricity networks whose fuel source domination differs, and the exploitation of non-coincident system peak demands. These factors allow technology diversity in the satisfaction of electricity demand, the coordination of planning and maintenance schedules between the networks by exploiting the cost differences in the pool of generation assets and the load configuration differences in the neighboring locations. The interconnection decision studied in this dissertation focused on the electricity networks of Argentina and Chile whose electricity systems operate in isolation at the current time. The cooperative game-theoretic framework was applied in the analysis of the decision facing the two countries and the net surplus to be derived from interconnection was evaluated. Measurement of the net gains from interconnection used in this study were reflected in changes in generating costs under the assumption that demand is fixed under all scenarios. With the demand for electricity assumed perfectly inelastic, passive or aggressive bidding strategies were considered under the scenarios for the generators in the two countries. The interconnection decision was modeled using a linear power flow model which utilizes linear programming techniques to reflect dispatch procedures based on generation bids. Results of the study indicate that the current interconnection project between Argentina and Chile will not result in positive net surplus under a variety of scenarios. Only under significantly reduced interconnection cost will the venture prove attractive. Possible sharing mechanisms were also explored in the research and a symmetric distribution of the net surplus to be derived under the reduced interconnection cost scenario was recommended to preserve equity in the allocation of the interconnection gains.

Electron Beam-Induced Writing of Nanoscale Iron Wires on a Functional Metal Oxide

PubMed Central

2013-01-01

Electron beam-induced surface activation (EBISA) has been used to grow wires of iron on rutile TiO2(110)-(1 × 1) in ultrahigh vacuum. The wires have a width down to ∼20 nm and hence have potential utility as interconnects on this dielectric substrate. Wire formation was achieved using an electron beam from a scanning electron microscope to activate the surface, which was subsequently exposed to Fe(CO)5. On the basis of scanning tunneling microscopy and Auger electron spectroscopy measurements, the activation mechanism involves electron beam-induced surface reduction and restructuring. PMID:24159366

PbS-PbSe IR detector arrays

NASA Technical Reports Server (NTRS)

Barrett, John R. (Inventor)

1986-01-01

A silicon wafer is provided which does not employ individually bonded leads between the IR sensitive elements and the input stages of multiplexers. The wafer is first coated with lead selenide in a first detector array area and is thereafter coated with lead sulfide within a second detector array area. The described steps result in the direct chemical deposition of lead selenide and lead sulfide upon the silicon wafer to eliminate individual wire bonding, bumping, flip chipping, planar interconnecting methods of connecting detector array elements to silicon chip circuitry, e.g., multiplexers, to enable easy fabrication of very long arrays. The electrode structure employed, produces an increase in the electrical field gradient between the electrodes for a given volume of detector material, relative to conventional electrode configurations.

Analysis of thermal characteristics of electrical wiring for load groups in cattle barns.

PubMed

Kim, Doo Hyun; Yoo, Sang-Ok; Kim, Sung Chul; Hwang, Dong Kyu

2015-01-01

The purpose of the current study is to analyze the thermal characteristics of electrical wirings depending on the number of operating load by connecting four types of electrical wirings that are selected by surveying the conditions for the electric fans, automatic waterers and halogen warm lamps that were installed in cattle barns in different years. The conditions of 64 cattle barns were surveyed and an experimental test was conducted at a cattle barn. The condition-survey covered inappropriate design, construction and misuse of electrical facility, including electrical wiring mostly used, and the mode of load current was evaluated. The survey showed that the mode of load current increased as the installation year of the fans, waterers and halogen lamps became older. Accordingly, the cattle barn manager needed to increase the capacity of the circuit breaker, which promoted the degradation of insulation of the electrical wires' sheath and increased possibility for electrical fires in the long-run. The test showed that the saturation temperature of the wire insulated sheath increased depending on the installation year of the load groups, in case of VCTFK and VFF electric wires, therefore, requiring their careful usage in the cattle barns.

Photovoltaic sub-cell interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

van Hest, Marinus Franciscus Antonius Maria; Swinger Platt, Heather Anne

2017-05-09

Photovoltaic sub-cell interconnect systems and methods are provided. In one embodiment, a photovoltaic device comprises a thin film stack of layers deposited upon a substrate, wherein the thin film stack layers are subdivided into a plurality of sub-cells interconnected in series by a plurality of electrical interconnection structures; and wherein the plurality of electrical interconnection structures each comprise no more than two scribes that penetrate into the thin film stack layers.

The Unification of Space Qualified Integrated Circuits by Example of International Space Project GAMMA-400

NASA Astrophysics Data System (ADS)

Bobkov, S. G.; Serdin, O. V.; Arkhangelskiy, A. I.; Arkhangelskaja, I. V.; Suchkov, S. I.; Topchiev, N. P.

The problem of electronic component unification at the different levels (circuits, interfaces, hardware and software) used in space industry is considered. The task of computer systems for space purposes developing is discussed by example of scientific data acquisition system for space project GAMMA-400. The basic characteristics of high reliable and fault tolerant chips developed by SRISA RAS for space applicable computational systems are given. To reduce power consumption and enhance data reliability, embedded system interconnect made hierarchical: upper level is Serial RapidIO 1x or 4x with rate transfer 1.25 Gbaud; next level - SpaceWire with rate transfer up to 400 Mbaud and lower level - MIL-STD-1553B and RS232/RS485. The Ethernet 10/100 is technology interface and provided connection with the previously released modules too. Systems interconnection allows creating different redundancy systems. Designers can develop heterogeneous systems that employ the peer-to-peer networking performance of Serial RapidIO using multiprocessor clusters interconnected by SpaceWire.

NEMA wire and cable standards development programs

NASA Astrophysics Data System (ADS)

Baird, Robert W.

1994-01-01

The National Electrical Manufacturers Association (NEMA) is the nation's largest trade association for manufacturers of electrical equipment. Its member companies produce components, end-use equipment and systems for the generation, transmission, distribution, control and use of electricity. The wire and cable division is presented in 6 sections: building wire and cable, fabricated conductors, flexible cords, high performance wire and cable, magnet wire, and power and control cable. Participating companies are listed.

76 FR 20655 - American Electric Power Service Corporation v. PJM Interconnection, L.L.C.; Notice of Complaint

Federal Register 2010, 2011, 2012, 2013, 2014

2011-04-13

... Electric Power Service Corporation v. PJM Interconnection, L.L.C.; Notice of Complaint Take notice that on... complaint against PJM Interconnection, L.L.C. (Respondent), alleging that Schedule 8.1, section D.8 to the PJM Interconnection, L.L.C. Reliability Assurance Agreement is unjust, unreasonable, and unduly...

Ultrastrong Graphene-Copper Core-Shell Wires for High-Performance Electrical Cables.

PubMed

Kim, Sang Jin; Shin, Dong Heon; Choi, Yong Seok; Rho, Hokyun; Park, Min; Moon, Byung Joon; Kim, Youngsoo; Lee, Seuoung-Ki; Lee, Dong Su; Kim, Tae-Wook; Lee, Sang Hyun; Kim, Keun Soo; Hong, Byung Hee; Bae, Sukang

2018-03-27

Recent development in mobile electronic devices and electric vehicles requires electrical wires with reduced weight as well as enhanced stability. In addition, since electric energy is mostly generated from power plants located far from its consuming places, mechanically stronger and higher electric power transmission cables are strongly demanded. However, there has been no alternative materials that can practically replace copper materials. Here, we report a method to prepare ultrastrong graphene fibers (GFs)-Cu core-shell wires with significantly enhanced electrical and mechanical properties. The core GFs are synthesized by chemical vapor deposition, followed by electroplating of Cu shells, where the large surface area of GFs in contact with Cu maximizes the mechanical toughness of the core-shell wires. At the same time, the unique electrical and thermal characteristics of graphene allow a ∼10 times higher current density limit, providing more efficient and reliable delivery of electrical energies through the GFs-Cu wires. We believe that our results would be useful to overcome the current limit in electrical wires and cables for lightweight, energy-saving, and high-power applications.

Increasing component functionality via multi-process additive manufacturing

NASA Astrophysics Data System (ADS)

Coronel, Jose L.; Fehr, Katherine H.; Kelly, Dominic D.; Espalin, David; Wicker, Ryan B.

2017-05-01

Additively manufactured components, although extensively customizable, are often limited in functionality. Multi-process additive manufacturing (AM) grants the ability to increase the functionality of components via subtractive manufacturing, wire embedding, foil embedding and pick and place. These processes are scalable to include several platforms ranging from desktop to large area printers. The Multi3D System is highlighted, possessing the capability to perform the above mentioned processes, all while transferring a fabricated component with a robotic arm. Work was conducted to fabricate a patent inspired, printed missile seeker. The seeker demonstrated the advantage of multi-process AM via introduction of the pick and place process. Wire embedding was also explored, with the successful interconnect of two layers of embedded wires in different planes. A final demonstration of a printed contour bracket, served to show the reduction of surface roughness on a printed part is 87.5% when subtractive manufacturing is implemented in tandem with AM. Functionality of the components on all the cases was improved. Results included optical components embedded within the printed housing, wires embedded with interconnection, and reduced surface roughness. These results highlight the improved functionality of components through multi-process AM, specifically through work conducted with the Multi3D System.

Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2011-01-01

A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..

7 CFR 1730.61 - RUS policy.

Code of Federal Regulations, 2011 CFR

2011-01-01

..., or reliability on the borrower's electric power system or other electric power systems interconnected to the borrower's electric power system. The Agency encourages borrowers to consider model policy... ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.61 RUS policy...

7 CFR 1730.61 - RUS policy.

Code of Federal Regulations, 2010 CFR

2010-01-01

..., or reliability on the borrower's electric power system or other electric power systems interconnected to the borrower's electric power system. The Agency encourages borrowers to consider model policy... ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.61 RUS policy...

A highly crystalline single Au wire network as a high temperature transparent heater

NASA Astrophysics Data System (ADS)

Rao, K. D. M.; Kulkarni, Giridhar U.

2014-05-01

A transparent conductor which can generate high temperatures finds important applications in optoelectronics. In this article, a wire network made of Au on quartz is shown to serve as an effective high temperature transparent heater. The heater has been fabricated by depositing Au onto a cracked sacrificial template. The highly interconnected Au wire network thus formed exhibited a transmittance of ~87% in a wide spectral range with a sheet resistance of 5.4 Ω □-1. By passing current through the network, it could be joule heated to ~600 °C within a few seconds. The extraordinary thermal performance and stability owe much to the seamless junctions present in the wire network. Furthermore, the wire network gets self-annealed through joule heating as seen from its increased crystallinity. Interestingly, both transmittance and sheet resistance improved following annealing to 92% and 3.2 Ω □-1, respectively. A transparent conductor which can generate high temperatures finds important applications in optoelectronics. In this article, a wire network made of Au on quartz is shown to serve as an effective high temperature transparent heater. The heater has been fabricated by depositing Au onto a cracked sacrificial template. The highly interconnected Au wire network thus formed exhibited a transmittance of ~87% in a wide spectral range with a sheet resistance of 5.4 Ω □-1. By passing current through the network, it could be joule heated to ~600 °C within a few seconds. The extraordinary thermal performance and stability owe much to the seamless junctions present in the wire network. Furthermore, the wire network gets self-annealed through joule heating as seen from its increased crystallinity. Interestingly, both transmittance and sheet resistance improved following annealing to 92% and 3.2 Ω □-1, respectively. Electronic supplementary information (ESI) available: Optical micrographs, EDAX, XRD, SEM and TEM images of Au metal wires. See DOI: 10.1039/c4nr00869c

Mountain Plains Learning Experience Guide: Electrical Wiring. Course: Electrical Wiring Trim-Out.

ERIC Educational Resources Information Center

Arneson, R.; And Others

One of two individualized courses included in an electrical wiring curriculum, this course covers electrical materials installation for the trim-out stage. The course is comprised of five units: (1) Outlets, (2) Fixtures, (3) Switches, (4) Appliances, and (5) Miscellaneous. Each unit begins with a Unit Learning Experience Guide that gives…

Radiating dipole model of interference induced in spacecraft circuitry by surface discharges

NASA Technical Reports Server (NTRS)

Metz, R. N.

1984-01-01

Spacecraft in geosynchronous orbit can be charged electrically to high voltages by interaction with the space plasma. Differential charging of spacecraft surfaces leads to arc and blowoff discharging. The discharges are thought to upset interior, computer-level circuitry. In addition to capacitive or electrostatic effects, significant inductive and less significant radiative effects of these discharges exist and can be modeled in a dipole approximation. Flight measurements suggest source frequencies of 5 to 50 MHz. Laboratory tests indicate source current strengths of several amperes. Electrical and magnetic fields at distances of many centimeters from such sources can be as large as tens of volts per meter and meter squared, respectively. Estimates of field attenuation by spacecraft walls and structures suggest that interior fields may be appreciable if electromagnetic shielding is much thinner than about 0.025 mm (1 mil). Pickup of such fields by wires and cables interconnecting circuit components could be a source of interference signals of several volts amplitude.

Electrical continuity scanner facilitates identification of wires for soldering to connectors

NASA Technical Reports Server (NTRS)

Boulton, H. C.; Diclemente, R. A.

1966-01-01

Electrical continuity scanner automatically scans 50 wires in 2 seconds to correlate all wires in a circuit with their respective known ends. Modifications made to the basic plan provide circuitry for scanning up to 250 wires.

Wavelength-addressed intra-board optical interconnection by plug-in alignment with a micro hole array

NASA Astrophysics Data System (ADS)

Nakama, Kenichi; Tokiwa, Yuu; Mikami, Osamu

2010-09-01

Intra-board interconnection between optical waveguide channels is suitable for assembling high-speed optoelectronic printed wiring boards (OE-PWB). Here, we propose a novel optical interconnection method combining techniques for both wavelength-based optical waveguide addressing and plug-in optical waveguide alignment with a micro-hole array (MHA). This array was fabricated by the mask transfer method. For waveguide addressing, we used a micro passive wavelength selector (MPWS) module, which is a type of Littrow mount monochromator consisting of an optical diffraction grating, a focusing lens, and the MHA. From the experimental results, we found that the wavelength addressing operation of the MPWS module was effective for intra-board optical interconnection.

77 FR 9225 - Allegheny Electric Cooperative, Inc., et al. v. PJM Interconnection, L.L.C.; Organization of PJM...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-02-16

...-58-010] Allegheny Electric Cooperative, Inc., et al. v. PJM Interconnection, L.L.C.; Organization of PJM States, Inc., et al. v. PJM Interconnection, L.L.C.; Notice of Filing Take notice that on February... by section 18.17.4 of the Amended and Restated Operating Agreement of PJM Interconnection, L.L.C. and...

Cable Bundle Wire Derating

NASA Technical Reports Server (NTRS)

Lundquist, Ray A.; Leidecker, Henning

1998-01-01

The allowable operating currents of electrical wiring when used in the space vacuum environment is predominantly determined by the maximum operating temperature of the wire insulation. For Kapton insulated wire this value is 200 C. Guidelines provided in the Goddard Space Flight Center (GSFC) Preferred Parts List (PPL) limit the operating current of wire within vacuum to ensure the maximum insulation temperature is not exceeded. For 20 AWG wire, these operating parameters are: 3.7 amps per wire, bundle of 15 or more wires, 70 C environment, and vacuum of 10(exp -5) torr or less. To determine the behavior and temperature of electrical wire at different operating conditions, a thermal vacuum test was performed on a representative electrical harness of the Hubble Space Telescope (HST) power distribution system. This paper describes the test and the results.

Analysis of thermal characteristics of electrical wiring for load groups in cattle barns

PubMed Central

KIM, Doo Hyun; YOO, Sang-Ok; KIM, Sung Chul; HWANG, Dong Kyu

2015-01-01

The purpose of the current study is to analyze the thermal characteristics of electrical wirings depending on the number of operating load by connecting four types of electrical wirings that are selected by surveying the conditions for the electric fans, automatic waterers and halogen warm lamps that were installed in cattle barns in different years. The conditions of 64 cattle barns were surveyed and an experimental test was conducted at a cattle barn. The condition-survey covered inappropriate design, construction and misuse of electrical facility, including electrical wiring mostly used, and the mode of load current was evaluated. The survey showed that the mode of load current increased as the installation year of the fans, waterers and halogen lamps became older. Accordingly, the cattle barn manager needed to increase the capacity of the circuit breaker, which promoted the degradation of insulation of the electrical wires’ sheath and increased possibility for electrical fires in the long-run. The test showed that the saturation temperature of the wire insulated sheath increased depending on the installation year of the load groups, in case of VCTFK and VFF electric wires, therefore, requiring their careful usage in the cattle barns. PMID:26118855

Advanced Lighting Controls for Reducing Energy use and Cost in DoD Installations

DTIC Science & Technology

2013-05-01

OccuSwitch Wireless is a room-based lighting control system employing dimmable light sources, occupancy and daylight sensors , wireless interconnection...combination of wireless and wired control solution for building-wide networked system that maximizes the use of daylight while improving visual...architecture of Hybrid ILDC. Architecture: The system features wireless connectivity among sensors and actuators within a zone and exploits wired

Characterization of copper and nichrome wires for safety fuse

NASA Astrophysics Data System (ADS)

Murdani, E.

2016-11-01

Fuse is an important component of an electrical circuit to limiting the current through the electrical circuit for electrical equipment safety. Safety fuses are made of a conductor such as copper and nichrome wires. The aim of this research was to determine the maximum current that can flow in the conductor wires (copper and nichrome). In the experiment used copper and nichrome wires by varying the length of wires (0.2 cm to 20 cm) and diameter of wires (0.1, 0.2, 0.3, 0.4 and 0.5) mm until maximum current reached that marked by melted or broken wire. From this experiment, it will be obtained the dependences data of maximum current to the length and diameter of wires. All data are plotted and it's known as a standard curve. The standard curve will provide an alternative choice of replacing fuse wire according to the maximum current requirement, including the wire type (copper and nichrome wires) and wire dimensions (length and diameter of wire).

Forming Refractory Insulation On Copper Wire

NASA Technical Reports Server (NTRS)

Setlock, J.; Roberts, G.

1995-01-01

Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

High conductivity carbon nanotube wires from radial densification and ionic doping

NASA Astrophysics Data System (ADS)

Alvarenga, Jack; Jarosz, Paul R.; Schauerman, Chris M.; Moses, Brian T.; Landi, Brian J.; Cress, Cory D.; Raffaelle, Ryne P.

2010-11-01

Application of drawing dies to radially densify sheets of carbon nanotubes (CNTs) into bulk wires has shown the ability to control electrical conductivity and wire density. Simultaneous use of KAuBr4 doping solution, during wire drawing, has led to an electrical conductivity in the CNT wire of 1.3×106 S/m. Temperature-dependent electrical measurements show that conduction is dominated by fluctuation-assisted tunneling, and introduction of KAuBr4 significantly reduces the tunneling barrier between individual nanotubes. Ultimately, the concomitant doping and densification process leads to closer packed CNTs and a reduced charge transfer barrier, resulting in enhanced bulk electrical conductivity.

Examination of rapid phase change in copper wires to improve material models and understanding of burst

NASA Astrophysics Data System (ADS)

Olles, Joseph; Garasi, Christopher; Ball, J. Patrick

2017-11-01

Electrically-pulsed wires undergo multiple phase changes including a postulated metastable phase resulting in explosive wire growth. Simulations using the MHD approximation attempt to account for the governing physics, but lack the material properties (equations-of-state and electrical conductivity) to accurately predict the phase evolution of the exploding (bursting) wire. To explore the dynamics of an exploding copper wire (in water), we employ a digital micro-Schlieren streak photography technique. This imaging quantifies wire expansion and shock waves emitted from the wire during phase changes. Using differential voltage probes, a Rogowski coil, and timing fiducials, the phase change of the wire is aligned with electrical power and energy deposition. Time-correlated electrical diagnostics and imaging allow for detailed validation of MHD simulations, comparing observed phases with phase change details found in the material property descriptions. In addition to streak imaging, a long exposure image is taken to capture axial striations along the length of the wire. These images are used to compare with results from 3D MHD simulations which propose that these perturbations impact the rate of wire expansion and temporal change in phases. If successful, the experimental data will identify areas for improvement in the material property models, and modeling results will provide insight into the details of phase change in the wire with correlation to variations in the electrical signals.

SpaceFibre: The Standard, Simulation, IP Cores and Test Equipment

NASA Astrophysics Data System (ADS)

Parkes, Steve; McClements, Chris; McLaren, David; Ferrer Florit, Albert; Gonzalez Villafranca, Alberto

2015-09-01

SpaceFibre is an emerging new standard for spacecraft on-board data-handling networks. Initially targeted to deliver multi-Gbit/s data rates for synthetic aperture radar and high-resolution, multi-spectral imaging instruments, SpaceFibre has developed into a unified network technology that integrates high bandwidth, with low latency, quality of service (QoS) and fault detection, isolation and recovery (FDIR). Furthermore SpaceFibre is backwards compatible with the widely used SpaceWire standard at the network level allowing simple interconnection of existing SpaceWire equipment to a SpaceFibre link or network. Developed by the University of Dundee for the European Space Agency (ESA) SpaceFibre is able to operate over fibre-optic and electrical cable and supports data rates of 2 Gbit/s in the near future and up to 5 Gbit/s long-term. Multi-laning improves the data-rate further to well over 20 Gbits/s. This paper details the current state of SpaceFibre which is now in the process of formal standardisation by the European Cooperation for Space Standardization (ECSS). It describes the SpaceFibre IP core being developed for ESA. The design of a SpaceFibre demonstration board is introduced and available SpaceFibre test and development equipment is described. The way in which several SpaceWire links can be concentrated over a single SpaceFibre link will be explained.

Means for accommodating large overstrain in lead wires. [by storing extra length of wire in stretchable loop

NASA Technical Reports Server (NTRS)

Rumble, C. V.; Driscoll, K. L. (Inventor)

1974-01-01

An electrical wire is reported along whose length loops are formed at intervals and retained in a plastic capsule that allows unfolding of the loop when tension is exerted on the opposite ends of the wire. The capsule is formed by encompassing each loop with a sleeve of heat shrinkable synthetic plastic material which overlaps the loop and heat shrinking the overlapping portions. Thus, a length of electrical wire is formed which stores extra lengths of wire in the quantity needed to match the expected stretching of materials or elements such as ropes, cords and the like of high elongation to which the electrical wire may be attached.

Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers.

PubMed

Jahanshahi, Amir; Salvo, Pietro; Vanfleteren, Jan

2012-01-01

Stretchable and curvilinear electronics has been used recently for the fabrication of micro systems interacting with the human body. The applications range from different kinds of implantable sensors inside the body to conformable electrodes and artificial skins. One of the key parameters in biocompatible stretchable electronics is the fabrication of reliable electrical interconnects. Although very recent literature has reported on the reliability of stretchable interconnects by cyclic loading, work still needs to be done on the integration of electrical circuitry composed of rigid components and stretchable interconnects in a biological environment. In this work, the feasibility of a developed technology to fabricate simple electrical circuits with meander shaped stretchable interconnects is presented. Stretchable interconnects are 200 nm thin Au layer supported with polyimide (PI). A stretchable array of light emitting diodes (LEDs) is embedded in biocompatible elastomer using this technology platform and it features a 50% total elongation.

Method of fabricating a PbS-PbSe IR detector array

NASA Technical Reports Server (NTRS)

Barrett, John R. (Inventor)

1987-01-01

A silicon wafer is provided which does not employ individually bonded leads between the IR sensitive elements and the input stages of multiplexers. The wafer is first coated with lead selenide in a first detector array area and is thereafter coated with lead sulfide within a second detector array area. The described steps result in the direct chemical deposition of lead selenide and lead sulfide upon the silicon wafer to eliminate individual wire bonding, bumping, flip chiping, planar interconnecting methods of connecting detector array elements to silicon chip circuitry, e.g., multiplexers, to enable easy fabrication of very long arrays. The electrode structure employed, produces an increase in the electrical field gradient between the electrodes for a given volume of detector material, relative to conventional electrode configurations.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tooker, Angela C.; Felix, Sarah H.; Pannu, Satinderpall S.

A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.

Cable Bundle Wire Derating

NASA Technical Reports Server (NTRS)

Lundquist, Ray A.; Leidecker, Henning

1999-01-01

The allowable operating currents of electrical wiring when used in the space vacuum environment is predominantly determined by the maximum operating temperature of the wire insulation. For Kapton insulated wire this value is 200 degree C. Guidelines provided in the Goddard Space Flight Center (GSFC) Preferred Parts List (PPL) limit the operating current of wire within vacuum to ensure the maximum insulation temperature is not exceeded. For 20 AWG wire, these operating parameters are: (1) 3.7 amps per wire (2) bundle of 15 or more wires (3) 70 C environment (4) vacuum of 10(exp -5) torr or less To determine the behavior and temperature of electrical wire at different operating conditions, a thermal vacuum test was performed on a representative electrical harness of the Hubble Space Telescope (HST) power distribution system. This paper describes the test and the results.

Cable Bundle Wire Derating

NASA Technical Reports Server (NTRS)

Lundquist, Ray A.; Leidecker, Henning

1998-01-01

The allowable operating currents of electrical wiring when used in the space vacuum environment is predominantly determined by the maximum operating temperature of the wire insulation. For Kapton insulated wire this value is 200 C. Guidelines provided in the Goddard Space Flight Center (GSFC) Preferred Parts List (PPL) limit the operating current of wire within vacuum to ensure the maximum insulation temperature is not exceeded. For 20 AWG wire, these operating parameters are: (1) 3.7 amps per wire; (2) bundle of 15 or more wires; (3) 70 C environment: and (4) vacuum of 10(exp -5) torr or less. To determine the behavior and temperature of electrical wire at different operating conditions, a thermal vacuum test was performed on a representative electrical harness of the Hubble Space Telescope (HST) power distribution system. This paper describes the test and the results.

29 CFR 1926.906 - Initiation of explosive charges-electric blasting.

Code of Federal Regulations, 2010 CFR

2010-07-01

... dangerous. Blasting cap leg wires shall be kept short-circuited (shunted) until they are connected into the..., in accordance with the manufacturer's recommendations. (f) Connecting wires and lead wires shall be... manufacturer of the electric blasting caps used. (o) The number of electric blasting caps connected to a...

7 CFR 1730.63 - IDR policy criteria.

Code of Federal Regulations, 2012 CFR

2012-01-01

... policies must be consistent with prudent electric utility practice. (2) IDR policies must incorporate the Institute of Electrical and Electronic Engineers (IEEE): IEEE 1547TM—Standard for Interconnecting... AGRICULTURE ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.63 IDR...

7 CFR 1730.63 - IDR policy criteria.

Code of Federal Regulations, 2014 CFR

2014-01-01

... policies must be consistent with prudent electric utility practice. (2) IDR policies must incorporate the Institute of Electrical and Electronic Engineers (IEEE): IEEE 1547TM—Standard for Interconnecting... AGRICULTURE ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.63 IDR...

7 CFR 1730.63 - IDR policy criteria.

Code of Federal Regulations, 2013 CFR

2013-01-01

... policies must be consistent with prudent electric utility practice. (2) IDR policies must incorporate the Institute of Electrical and Electronic Engineers (IEEE): IEEE 1547TM—Standard for Interconnecting... AGRICULTURE ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.63 IDR...

7 CFR 1730.63 - IDR policy criteria.

Code of Federal Regulations, 2011 CFR

2011-01-01

... policies must be consistent with prudent electric utility practice. (2) IDR policies must incorporate the Institute of Electrical and Electronic Engineers (IEEE): IEEE 1547TM—Standard for Interconnecting... AGRICULTURE ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.63 IDR...

The HayWired earthquake scenario—We can outsmart disaster

USGS Publications Warehouse

Hudnut, Kenneth W.; Wein, Anne M.; Cox, Dale A.; Porter, Keith A.; Johnson, Laurie A.; Perry, Suzanne C.; Bruce, Jennifer L.; LaPointe, Drew

2018-04-18

The HayWired earthquake scenario, led by the U.S. Geological Survey (USGS), anticipates the impacts of a hypothetical magnitude-7.0 earthquake on the Hayward Fault. The fault is along the east side of California’s San Francisco Bay and is among the most active and dangerous in the United States, because it runs through a densely urbanized and interconnected region. One way to learn about a large earthquake without experiencing it is to conduct a scientifically realistic scenario. The USGS and its partners in the HayWired Coalition and the HayWired Campaign are working to energize residents and businesses to engage in ongoing and new efforts to prepare the region for such a future earthquake.

Evaluation of electrical conductivity and equations of state of non-ideal plasma through microsecond timescale underwater electrical wire explosion

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sheftman, D.; Krasik, Ya. E.

2011-09-15

Experimental and simulation results of underwater electrical Cu, Al, and W wire explosions in the microsecond timescale are presented. It was shown that the electrical conductivity results for Cu and Al agree well with modified Lee-More and quantum molecular dynamic models for temperatures above 10 kK. The equation of state (EOS) values based on SESAME tables for Cu and Al were slightly modified for intermediate temperatures in order to obtain fitting between experimental and simulated exploding wire radial expansion. Also, it was shown that the electrical conductivity results and the EOS evaluation differ significantly from the results obtained in nanosecondmore » timescale experiments. Finally, it was found that underwater electrical W wire explosion is characterized by the appearance of non-uniformities along the z-axis of the wire. This phenomena adds uncertainty to the possibility of applying this type of experiments for evaluation of the electrical conductivity and EOS of W.« less

76 FR 75876 - Record of Decision for the Modification of the Groton Generation Station Interconnection...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-12-05

...) received a request from Basin Electric Power Cooperative (Basin Electric) to modify its Large Generator Interconnection Agreement (LGIA) with Basin Electric for the Groton Generation Station to eliminate current... considered the environmental impacts and has decided to modify its LGIA with Basin Electric for the Groton...

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2012-03-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

Photopolymerizable liquid encapsulants for microelectronic devices

NASA Astrophysics Data System (ADS)

Baikerikar, Kiran K.

2000-10-01

Plastic encapsulated microelectronic devices consist of a silicon chip that is physically attached to a leadframe, electrically interconnected to input-output leads, and molded in a plastic that is in direct contact with the chip, leadframe, and interconnects. The plastic is often referred to as the molding compound, and is used to protect the chip from adverse mechanical, thermal, chemical, and electrical environments. Encapsulation of microelectronic devices is typically accomplished using a transfer molding process in which the molding compound is cured by heat. Most transfer molding processes suffer from significant problems arising from the high operating temperatures and pressures required to fill the mold. These aspects of the current process can lead to thermal stresses, incomplete mold filling, and wire sweep. In this research, a new strategy for encapsulating microelectronic devices using photopolymerizable liquid encapsulants (PLEs) has been investigated. The PLEs consist of an epoxy novolac-based vinyl ester resin (˜25 wt.%), fused silica filler (70--74 wt.%), and a photoinitiator, thermal initiator, and silane coupling agent. For these encapsulants, the use of light, rather than heat, to initiate the polymerization allows precise control over when the reaction starts, and therefore completely decouples the mold filling and the cure. The low viscosity of the PLEs allows for low operating pressures and minimizes problems associated with wire sweep. In addition, the in-mold cure time for the PLEs is equivalent to the in-mold cure times of current transfer molding compounds. In this thesis, the thermal and mechanical properties, as well as the viscosity and adhesion of photopolymerizable liquid encapsulants, are reported in order to demonstrate that a UV-curable formulation can have the material properties necessary for microelectronic encapsulation. In addition, the effects of the illumination time, postcure time, fused silica loading, and the inclusion of a thermal initiator on the thermal and mechanical properties of the final cured encapsulants have been investigated. The results show that the material properties of the PLEs are the same, if not better, than those exhibited by conventional transfer molding compounds and demonstrate the potential of using PLEs for encapsulating microelectronic devices.

Electron-phonon coupling and phonon subbands in small, electrically heated metal wires

NASA Astrophysics Data System (ADS)

Perrin, N.; Wybourne, M. N.

1996-02-01

The initial work of Perrin and Budd is extended to small metal wires in which the usual bulk phonon spectrum is modified into a series of acoustic subbands at low temperature. We analyze the contribution of the subbands to the lack of equilibrium between the electrons and the phonons in the wire heated by an applied electric field. The resulting electrical behavior of the wire is also considered and compared to experimental results.

Efficient Interconnection Schemes for VLSI and Parallel Computation

DTIC Science & Technology

1989-08-01

Definition: Let R be a routing network. A set S of wires in R is a (directed) cut if it partitions the network into two sets of processors A and B ...such that every path from a processor in A to a processor in B contains a wire in S. The capacity cap(S) is the number of wires in the cut. For a set of...messages M, define the load load(M, S) of M on a cut S to be the number of messages in M from a processor in A to a processor in B . The load factor

Flexible neural interfaces with integrated stiffening shank

DOEpatents

Tooker, Angela C.; Felix, Sarah H.; Pannu, Satinderpall S.; Shah, Kedar G.; Sheth, Heeral; Tolosa, Vanessa

2016-07-26

A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.

Multiple Differential-Amplifier MMICs Embedded in Waveguides

NASA Technical Reports Server (NTRS)

Kangaslahti, Pekka; Schlecht, Erich

2010-01-01

Compact amplifier assemblies of a type now being developed for operation at frequencies of hundreds of gigahertz comprise multiple amplifier units in parallel arrangements to increase power and/or cascade arrangements to increase gains. Each amplifier unit is a monolithic microwave integrated circuit (MMIC) implementation of a pair of amplifiers in differential (in contradistinction to single-ended) configuration. Heretofore, in cascading amplifiers to increase gain, it has been common practice to interconnect the amplifiers by use of wires and/or thin films on substrates. This practice has not yielded satisfactory results at frequencies greater than 200 Hz, in each case, for either or both of two reasons: Wire bonds introduce large discontinuities. Because the interconnections are typically tens of wavelengths long, any impedance mismatches give rise to ripples in the gain-vs.-frequency response, which degrade the performance of the cascade.

Effect of electrical spot welding on load deflection rate of orthodontic wires.

PubMed

Alavi, Shiva; Abrishami, Arezoo

2015-01-01

One of the methods used for joining metals together is welding, which can be carried out using different techniques such as electric spot welding. This study evaluated the effect of electric spot welding on the load deflection rate of stainless steel and chromium-cobalt orthodontic wires. In this experimental-laboratory study, load deflection rate of 0.016 × 0.022 inch stainless steel and chromium cobalt wires were evaluated in five groups (n =18): group one: Stainless steel wires, group two: chromium-cobalt wires, group three: stainless steel wires welded to stainless steel wires, group four: Stainless steel wires welded to chromium-cobalt wires, group five: chromium-cobalt wire welded to chromium-cobalt wires. Afterward, the forces induced by the samples in 0.5 mm, 1 mm, 1.5 mm deflection were measured using a universal testing machine. Then mean force measured for each group was compared with other groups. The data were analyzed using repeated measure analysis of variance (ANOVA), one-way ANOVA, and paired t-test by the SPSS software. The significance level was set as 0.05. The Tukey test showed that there were significant differences between the load deflection rates of welded groups compared to control ones (P < 0.001). Considering the limitation of this study, the electric spot welding process performed on stainless steel and chromium-cobalt wires increased their load deflection rates.

Electrical wire insulation and electromagnetic coil

DOEpatents

Bich, George J.; Gupta, Tapan K.

1984-01-01

An electromagnetic coil for high temperature and high radiation application in which glass is used to insulate the electrical wire. A process for applying the insulation to the wire is disclosed which results in improved insulation properties.

75 FR 72909 - Revision to Electric Reliability Organization Definition of Bulk Electric System

Federal Register 2010, 2011, 2012, 2013, 2014

2010-11-26

...) Comments 135 (b) Commission Determination 139 6. Impact on Generation Owners and Operators 142 (a) Comments... Organization, the electrical generation resources, transmission lines, interconnections with neighboring... above that interconnect with registered generation facilities are excluded from NPCC's list of bulk...

30 CFR 57.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Insulation and fittings for power wires and... NONMETAL MINES Electricity Surface and Underground § 57.12008 Insulation and fittings for power wires and cables. Power wires and cables shall be insulated adequately where they pass into or out of electrical...

30 CFR 57.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Insulation and fittings for power wires and... NONMETAL MINES Electricity Surface and Underground § 57.12008 Insulation and fittings for power wires and cables. Power wires and cables shall be insulated adequately where they pass into or out of electrical...

46 CFR 169.679 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 7 2010-10-01 2010-10-01 false Wiring for power and lighting circuits. 169.679 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.679 Wiring for power and lighting circuits. Wiring...

46 CFR 169.679 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 7 2014-10-01 2014-10-01 false Wiring for power and lighting circuits. 169.679 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.679 Wiring for power and lighting circuits. Wiring...

46 CFR 169.679 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 7 2011-10-01 2011-10-01 false Wiring for power and lighting circuits. 169.679 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.679 Wiring for power and lighting circuits. Wiring...

46 CFR 169.679 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 7 2012-10-01 2012-10-01 false Wiring for power and lighting circuits. 169.679 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.679 Wiring for power and lighting circuits. Wiring...

46 CFR 169.679 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 7 2013-10-01 2013-10-01 false Wiring for power and lighting circuits. 169.679 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of 50 Volts Or More on Vessels of Less Than 100 Gross Tons § 169.679 Wiring for power and lighting circuits. Wiring...

Leadless Chip Carrier Packaging and CAD/CAM-Supported Wire Wrap Interconnect Technology for Subnanosecond ECL.

DTIC Science & Technology

1981-11-01

Showing Wire . 99 Impregnanted Silicone Rubber Contacts, Chip Carrier, ard Lid 35. Technit Connector For 68-Pad JEDEC Type A Leadless . . 100 Chip Carrier...Points of Various . . . . 124 Solders 4. Composition of Alloys Employed in Dual-In-Line . . . . 128 Package Pins and Plating by Mass Spectrographic...swings, and subnanosecond gate delays and risetimes. Presently, emitter coupled logic (ECL) and current mode logic (CML), both fabricated with silicon tech

75 FR 81433 - Airworthiness Directives; Airbus Model A321-211, -212, -231, and -232 Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2010-12-28

... join individual electrical wires in the Wing Tank harness installations to in-tank equipment on QT... are used to join individual electrical wires in the Wing Tank harness installations to in-tank... electrical wires in the Wing Tank harness installations to in-tank equipment on QT circuit. The failure of a...

Solar cell array interconnects

DOEpatents

Carey, P.G.; Thompson, J.B.; Colella, N.J.; Williams, K.A.

1995-11-14

Electrical interconnects are disclosed for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value. 4 figs.

Solar cell array interconnects

DOEpatents

Carey, Paul G.; Thompson, Jesse B.; Colella, Nicolas J.; Williams, Kenneth A.

1995-01-01

Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb-Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb-Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.

Electromagnetic Nondestructive Evaluation of Wire Insulation and Models of Insulation Material Properties

NASA Technical Reports Server (NTRS)

Bowler, Nicola; Kessler, Michael R.; Li, Li; Hondred, Peter R.; Chen, Tianming

2012-01-01

Polymers have been widely used as wiring electrical insulation materials in space/air-craft. The dielectric properties of insulation polymers can change over time, however, due to various aging processes such as exposure to heat, humidity and mechanical stress. Therefore, the study of polymers used in electrical insulation of wiring is important to the aerospace industry due to potential loss of life and aircraft in the event of an electrical fire caused by breakdown of wiring insulation. Part of this research is focused on studying the mechanisms of various environmental aging process of the polymers used in electrical wiring insulation and the ways in which their dielectric properties change as the material is subject to the aging processes. The other part of the project is to determine the feasibility of a new capacitive nondestructive testing method to indicate degradation in the wiring insulation, by measuring its permittivity.

Temperature Diffusion Distribution of Electric Wire Deteriorated by Overcurrent

NASA Astrophysics Data System (ADS)

Choi, Chung-Seog; Kim, Hyang-Kon; Kim, Dong-Woo; Lee, Ki-Yeon

This study presents thermal diffusion distribution of the electric wires when overcurrent is supplied to copper wires. And then, this study intends to provide a basis of knowledge for analyzing the causes of electric accidents through hybrid technology. In the thermal image distribution analysis of the electric wire to which fusing current was supplied, it was found that less heat was accumulated in the thin wires because of easier heat dispersion, while more heat was accumulated in the thicker wires. The 3-dimensional thermal image analysis showed that heat distribution was concentrated at the center of the wire and the inclination of heat distribution was steep in the thicker wires. When 81A was supplied to 1.6mm copper wire for 500 seconds, the surface temperature of wire was maximum 46.68°C and minimum 30.87°C. It revealed the initial characteristics of insulation deterioration that generates white smoke without external deformation. In the analysis with stereoscopic microscope, the surface turned dark brown and rough with the increase of fusing current. Also, it was known that exfoliation occurred when wire melted down with 2 times the fusing current. With the increase of current, we found the number of primary arms of the dendrite structure to be increased and those of the secondary and tertiary arms to be decreased. Also, when the overcurrent reached twice the fusing current, it was found that columnar composition, observed in the cross sectional structure of molten wire, appeared and formed regular directivity. As described above, we could present the burning pattern and change in characteristics of insulation and conductor quantitatively. And we could not only minimize the analysis error by combining the information but also present the scientific basis in the analysis of causes of electric accidents, mediation of disputes on product liability concerning the electric products.

Underwater electrical wire explosion: Shock wave from melting being overtaken by shock wave from vaporization

NASA Astrophysics Data System (ADS)

Li, Liuxia; Qian, Dun; Zou, Xiaobing; Wang, Xinxin

2018-05-01

The shock waves generated by an underwater electrical wire explosion were investigated. A microsecond time-scale pulsed current source was used to trigger the electrical explosion of copper wires with a length of 5 cm and a diameter of 200 μm. The energy-storage capacitor was charged to a relatively low energy so that the energy deposited onto the wire was not large enough to fully vaporize the whole wire. Two shock waves were recorded with a piezoelectric gauge that was located at a position of 100 mm from the exploding wire. The first and weak shock wave was confirmed to be the contribution from wire melting, while the second and stronger shock wave was the contribution from wire vaporization. The phenomenon whereby the first shock wave generated by melting being overtaken by the shock wave due to vaporization was observed.

Wire EDM for Refractory Materials

NASA Technical Reports Server (NTRS)

Zellars, G. R.; Harris, F. E.; Lowell, C. E.; Pollman, W. M.; Rys, V. J.; Wills, R. J.

1982-01-01

In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.

Manned spacecraft electrical fire safety

NASA Technical Reports Server (NTRS)

Wardell, A. W.

1971-01-01

The fire hazards created in spacecraft compartments by malfunction of electrical wiring are described. The tests for electrical wire/cable current overload flammability are presented. The application of electrical and material technologies to the reduction of fire hazards in spacecraft are examined.

Pressure-constrained, reduced-DOF, interconnected parallel manipulators with applications to space suit design

NASA Astrophysics Data System (ADS)

Jacobs, Shane Earl

This dissertation presents the concept of a Morphing Upper Torso, an innovative pressure suit design that incorporates robotic elements to enable a resizable, highly mobile and easy to don/doff spacesuit. The torso is modeled as a system of interconnected, pressure-constrained, reduced-DOF, wire-actuated parallel manipulators, that enable the dimensions of the suit to be reconfigured to match the wearer. The kinematics, dynamics and control of wire-actuated manipulators are derived and simulated, along with the Jacobian transforms, which relate the total twist vector of the system to the vector of actuator velocities. Tools are developed that allow calculation of the workspace for both single and interconnected reduced-DOF robots of this type, using knowledge of the link lengths. The forward kinematics and statics equations are combined and solved to produce the pose of the platforms along with the link tensions. These tools allow analysis of the full Morphing Upper Torso design, in which the back hatch of a rear-entry torso is interconnected with the waist ring, helmet ring and two scye bearings. Half-scale and full-scale experimental models are used along with analytical models to examine the feasibility of this novel space suit concept. The analytical and experimental results demonstrate that the torso could be expanded to facilitate donning and doffng, and then contracted to match different wearer's body dimensions. Using the system of interconnected parallel manipulators, suit components can be accurately repositioned to different desired configurations. The demonstrated feasibility of the Morphing Upper Torso concept makes it an exciting candidate for inclusion in a future planetary suit architecture.

Large constraint length high speed viterbi decoder based on a modular hierarchial decomposition of the deBruijn graph

NASA Technical Reports Server (NTRS)

Collins, Oliver (Inventor); Dolinar, Jr., Samuel J. (Inventor); Hus, In-Shek (Inventor); Bozzola, Fabrizio P. (Inventor); Olson, Erlend M. (Inventor); Statman, Joseph I. (Inventor); Zimmerman, George A. (Inventor)

1991-01-01

A method of formulating and packaging decision-making elements into a long constraint length Viterbi decoder which involves formulating the decision-making processors as individual Viterbi butterfly processors that are interconnected in a deBruijn graph configuration. A fully distributed architecture, which achieves high decoding speeds, is made feasible by novel wiring and partitioning of the state diagram. This partitioning defines universal modules, which can be used to build any size decoder, such that a large number of wires is contained inside each module, and a small number of wires is needed to connect modules. The total system is modular and hierarchical, and it implements a large proportion of the required wiring internally within modules and may include some external wiring to fully complete the deBruijn graph. pg,14.

Hy-wire and fast electric field change measurements near an isolated thunderstorm, appendix C

NASA Technical Reports Server (NTRS)

Holzworth, R. H.; Levine, D. M.

1983-01-01

Electric field measurements near an isolated thunderstorm at 6.4 km distance are presented from both a tethered balloon experiment called Hy-wire and also from ground based fast and slow electric field change systems. Simultaneous measurements were made of the electric fields during several lightning flashes at the beginning of the storm which the data clearly indicate were cloud-to-ground flashes. In addition to providing a comparison between the Hy-wire technique for measuring electric fields and more traditional methods, these data are interesting because the lightning flashes occurred prior to changes in the dc electric field, although Hy-wire measured changes in the dc field of up to 750 V/m in the direction opposite to the fair weather field a short time later. Also, the dc electric field was observed to decay back to its preflash value after each flash. The data suggest that Hy-wire was at the field reversal distance from this storm and suggest the charge realignment was taking place in the cloud with a time constant on the order of 20 seconds.

Synergistic responses of superficial chemistry and micro topography of titanium created by wire-type electric discharge machining.

PubMed

Kataoka, Yu; Tamaki, Yukimichi; Miyazaki, Takashi

2011-01-01

Wire-type electric discharge machining has been applied to the manufacture of endosseous titanium implants as this computer associated technique allows extremely accurate complex sample shaping with an optimal micro textured surface during the processing. Since the titanium oxide layer is sensitively altered by each processing, the authors hypothesized that this technique also up-regulates biological responses through the synergistic effects of the superficial chemistry and micro topography. To evaluate the respective in vitro cellular responses on the superficial chemistry and micro topography of titanium surface processed by wire-type electric discharge, we used titanium-coated epoxy resin replica of the surface. An oxide layer on the titanium surface processed by wire-type electric discharge activated the initial responses of osteoblastic cells through an integrin-mediated mechanism. Since the mRNA expression of ALP on those replicas was up-regulated compared to smooth titanium samples, the micro topography of a titanium surface processed by wire-type electric discharge promotes the osteogenic potential of cells. The synergistic response of the superficial chemistry and micro topography of titanium processed by wire-type electric discharge was demonstrated in this study.

Certification of lightning protection for a full-authority digital engine control

NASA Technical Reports Server (NTRS)

Dargi, M.; Rupke, E.; Wiles, K.

1991-01-01

FADEC systems present many challenges to the lightning protection engineer. Verification of the protection-design adequacy for certification purposes presents additional challenges. The basic requirements of the certification plan of a FADEC is to demonstrate compliance with Federal Airworthiness Regulations (FAR) 25.1309 and 25.581. These FARs are intended for transport aircraft, but there are equivalent sections for general aviation aircraft, normal and transport rotorcraft. Military aircraft may have additional requirements. The criteria for demonstration of adequate lightning protection for a FADEC systems include the procedures outlined in FAA Advisory Circular (AC) 20-136, Protection of aircraft electrical/electronic systems against the indirect effects of lightning. As FADEC systems, including the interconnecting wiring, are generally not susceptible to direct attachment of lightning currents, the verification of protection against indirect effects is primarily described.

Nuclear qualified in-containment electrical connectors and method of connecting electrical conductors

DOEpatents

Powell, J. G.

1991-01-01

A nuclear qualified in-containment electrical connection comprises an insulated, sheathed instrument lead having electrical conductors extending from one end thereof to provide two exposed lead wires, a watertight cable having electrical conducting wires therein and extending from one end of the cable to provide two lead wires therefrom, two butt splice connectors each connecting the ends of respective ones of the lead wires from the instrument lead and cable, a length of heat shrinkable plastic tubing positioned over each butt splice connector and an adjacent portion of a respective lead wire from the cable and heat shrunk into position, a length of heat shrinkable plastic tubing on the end portion of the instrument lead adjacent the lead wires therefrom and heat shrunk thereon and a length of outer heat shrinkable plastic tubing extending over the end portion of the instrument lead and the heat shrinkable tubing thereon and over the butt splice connectors and a portion of the cable adjacent the cable lead lines, the outer heat shrinkable tubing being heat shrunk into sealing position on the instrument lead and cable.

Liquid-level sensing device

DOEpatents

Goldfuss, G.T.

1975-09-16

This invention relates to a device for sensing the level of a liquid while preventing the deposition and accumulation of materials on the exterior surfaces thereof. Two dissimilar metal wires are enclosed within an electrical insulating material, the wires being joined together at one end to form a thermocouple junction outside the insulating material. Heating means is disposed within the electrical insulating material and maintains the device at a temperature substantially greater than that of the environment surrounding the device, the heating means being electrically insulated from the two dissimilar thermocouple wires. In addition, a metal sheath surrounds and contacts both the electrical insulating material and the thermocouple junction. Electrical connections are provided for connecting the heating means with a power source and for connecting the thermocouple wires with a device for sensing the electrical potential across the thermocouple junction. (auth)

Chip-to-chip optical link by using optical wiring method

NASA Astrophysics Data System (ADS)

Cho, In-Kui; Ahn, Seoung Ho; Jeong, Myung-Yung; Rho, Byung Sup; Park, Hyo Hoon

2008-01-01

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (a) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (b) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (c) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. A chip-to-chip optical link system constructed with TRx modules was fabricated and the optical characteristics were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for vertical-cavity surface-emitting lasers (VCSELs) and photodiodes (PDs). We successfully achieved a 5 Gb/s data transmission rate with this optical link.

Interconnect mechanisms in microelectronic packaging

NASA Astrophysics Data System (ADS)

Roma, Maria Penafrancia C.

Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

SUNRISE: A SpaceFibre Router

NASA Astrophysics Data System (ADS)

Parkes, Steve; McClements, Chris; McLaren, David; Florit, Albert Ferrer; Gonzalez Villafranca, Alberto

2016-08-01

SpaceFibre is a new generation of SpaceWire technology which is able to support the very high data- rates required by sensors like SAR and multi-spectral imagers. Data rates of between 1 and 16 Gbits/s are required to support several sensors currently being planned. In addition a mass-memory unit requires high performance networking to interconnect many memory modules. SpaceFibre runs over both electrical and fibre-optic media and provides and adds quality of service and fault detection, isolation and recovery technology to the network. SpaceFibre is compatible with the widely used SpaceWire protocol at the network level allowing existing SpaceWire devices to be readily incorporated into a SpaceFibre network. SpaceFibre provides 2 to 5 Gbits/s links (2.5 to 6.25 Gbits/s data signalling rate) which can be operated in parallel (multi-laning) to give higher data rates. STAR- Dundee with University of Dundee has designed and tested several SpaceFibre interface devices.The SUNRISE project is a UK Space Agency, Centre for Earth Observation and Space Technology (CEOI- ST) project in which STAR-Dundee and University of Dundee will design and prototype critical SpaceFibre router technology necessary for future on-board data- handling systems. This will lay a vital foundation for future very high data-rate sensor and telecommunications systems.This paper give a brief introduction to SpaceFibre, explains the operation of a SpaceFibre network, and then describes the SUNRISE SpaceFibre Router. The initial results of the SUNRISE project are described.

Shift-phase code multiplexing technique for holographic memories and optical interconnection

NASA Astrophysics Data System (ADS)

Honma, Satoshi; Muto, Shinzo; Okamoto, Atsushi

2008-03-01

Holographic technologies for optical memories and interconnection devices have been studied actively because of high storage capacity, many wiring patterns and high transmission rate. Among multiplexing techniques such as angular, phase code and wavelength-multiplexing, speckle multiplexing technique have gotten attention due to the simple optical setup having an adjustable random phase filter in only one direction. To keep simple construction and to suppress crosstalk among adjacent page data or wiring patterns for efficient holographic memories and interconnection, we have to consider about optimum randomness of the phase filter. The high randomness causes expanding an illumination area of reference beam on holographic media. On the other hands, the small randomness causes the crosstalk between adjacent hologram data. We have proposed the method of holographic multiplexing, shift-phase code multiplexing with a two-dimensional orthogonal matrix phase filter. A lot of orthogonal phase codes can be produced by shifting the phase filter in one direction. It is able to read and record the individual holograms with low crosstalk. We give the basic experimental result on holographic data multiplexing and consider the phase pattern of the filter to suppress the crosstalk between adjacent holograms sufficiently.

Interconnect-free parallel logic circuits in a single mechanical resonator

PubMed Central

Mahboob, I.; Flurin, E.; Nishiguchi, K.; Fujiwara, A.; Yamaguchi, H.

2011-01-01

In conventional computers, wiring between transistors is required to enable the execution of Boolean logic functions. This has resulted in processors in which billions of transistors are physically interconnected, which limits integration densities, gives rise to huge power consumption and restricts processing speeds. A method to eliminate wiring amongst transistors by condensing Boolean logic into a single active element is thus highly desirable. Here, we demonstrate a novel logic architecture using only a single electromechanical parametric resonator into which multiple channels of binary information are encoded as mechanical oscillations at different frequencies. The parametric resonator can mix these channels, resulting in new mechanical oscillation states that enable the construction of AND, OR and XOR logic gates as well as multibit logic circuits. Moreover, the mechanical logic gates and circuits can be executed simultaneously, giving rise to the prospect of a parallel logic processor in just a single mechanical resonator. PMID:21326230

Interconnect-free parallel logic circuits in a single mechanical resonator.

PubMed

Mahboob, I; Flurin, E; Nishiguchi, K; Fujiwara, A; Yamaguchi, H

2011-02-15

In conventional computers, wiring between transistors is required to enable the execution of Boolean logic functions. This has resulted in processors in which billions of transistors are physically interconnected, which limits integration densities, gives rise to huge power consumption and restricts processing speeds. A method to eliminate wiring amongst transistors by condensing Boolean logic into a single active element is thus highly desirable. Here, we demonstrate a novel logic architecture using only a single electromechanical parametric resonator into which multiple channels of binary information are encoded as mechanical oscillations at different frequencies. The parametric resonator can mix these channels, resulting in new mechanical oscillation states that enable the construction of AND, OR and XOR logic gates as well as multibit logic circuits. Moreover, the mechanical logic gates and circuits can be executed simultaneously, giving rise to the prospect of a parallel logic processor in just a single mechanical resonator.

NASA wiring for space applications program test results

NASA Astrophysics Data System (ADS)

Stavnes, Mark; Hammoud, Ahmad

1995-11-01

The electrical power wiring tests results from the NASA Wiring for Space Applications program are presented. The goal of the program was to develop a base for the building of a lightweight, arc track-resistant electrical wiring system for aerospace applications. This new wiring system would be applied to such structures as pressurized modules, trans-atmospheric vehicles, LEO/GEO environments, and lunar and Martian environments. Technological developments from this program include the fabrication of new insulating materials, the production of new wiring constructions, an improved system design, and an advanced circuit protection design.

Interconnection Guidelines

EPA Pesticide Factsheets

The Interconnection Guidelines provide general guidance on the steps involved with connecting biogas recovery systems to the utility electrical power grid. Interconnection best practices including time and cost estimates are discussed.

Project demonstration of wind-turbine electricity: Interconnecting a northern Michigan fruit farm with a major utility

NASA Astrophysics Data System (ADS)

Amon, D. M.

Progress is reviewed in a project to test the economic feasibility of wind turbine technology for generating electricity. The use of wind generating electricity on a commercial fruit farm interconnecting a commercial fruit farm with a major utility to sell power are the find project goals.

Self-healable electrically conducting wires for wearable microelectronics.

PubMed

Sun, Hao; You, Xiao; Jiang, Yishu; Guan, Guozhen; Fang, Xin; Deng, Jue; Chen, Peining; Luo, Yongfeng; Peng, Huisheng

2014-09-01

Electrically conducting wires play a critical role in the advancement of modern electronics and in particular are an important key to the development of next-generation wearable microelectronics. However, the thin conducting wires can easily break during use, and the whole device fails to function as a result. Herein, a new family of high-performance conducting wires that can self-heal after breaking has been developed by wrapping sheets of aligned carbon nanotubes around polymer fibers. The aligned carbon nanotubes offer an effective strategy for the self-healing of the electric conductivity, whereas the polymer fiber recovers its mechanical strength. A self-healable wire-shaped supercapacitor fabricated from a wire electrode of this type maintained a high capacitance after breaking and self-healing. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

MPNACK: an optical switching scheme enabling the buffer-less reliable transmission

NASA Astrophysics Data System (ADS)

Yu, Xiaoshan; Gu, Huaxi; Wang, Kun; Xu, Meng; Guo, Yantao

2016-01-01

Optical data center networks are becoming an increasingly promising solution to solve the bottlenecks faced by electrical networks, such as low transmission bandwidth, high wiring complexity, and unaffordable power consumption. However, the optical circuit switching (OCS) network is not flexible enough to carry the traffic burst while the optical packet switching (OPS) network cannot solve the packet contention in an efficient way. To this end, an improved switching strategy named OPS with multi-hop Negative Acknowledgement (MPNACK) is proposed. This scheme uses a feedback mechanism, rather than the buffering structure, to handle the optical packet contention. The collided packet is treated as a NACK packet and sent back to the source server. When the sender receives this NACK packet, it knows a collision happens in the transmission path and a retransmission procedure is triggered. Overall, the OPS-NACK scheme enables a reliable transmission in the buffer-less optical network. Furthermore, with this scheme, the expensive and energy-hungry elements, optical or electrical buffers, can be removed from the optical interconnects, thus a more scalable and cost-efficient network can be constructed for cloud computing data centers.

Control of the electrical resistivity of Ni-Cr wires using low pressure chemical vapor deposition of tin

NASA Astrophysics Data System (ADS)

Kim, Jun-Hyun; Bak, Jeong Geun; Lee, Kangtaek; Kim, Chang-Koo

2018-01-01

Control of the electrical resistivity of Ni-Cr wires is demonstrated using low pressure chemical vapor deposition (LPCVD) of tin on the surface of the wire, after which the effects of the deposition temperature on the structural, morphological, and compositional characteristics of the tin-deposited Ni-Cr wires are investigated. As the deposition temperature is increased, the resistivity of the Ni-Cr wires increases in the temperature range 300-400 °C; then remains nearly constant as the temperature increased to 700 °C. The increase in the resistivity of the Ni-Cr wires is attributed to formation of Ni3Sn2 particulates on the surface of the wire. Compositional analysis shows that the pattern of change in the tin content with the deposition temperature is similar to that of resistivity with temperature, implying that the atomic content of tin on Ni-Cr directly affects the electrical resistivity.

77 FR 2928 - Airworthiness Directives; Airbus Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-01-20

... pressure hose and electrical wiring of the green electrical motor pump (EMP). This proposed AD would... for correct condition and installation of hydraulic pressure hoses, electrical conduits, feeder cables... detect and correct chafing of hydraulic pressure hoses and electrical wiring of the green EMPs, which in...

Hermetic aluminum radio frequency interconnection and method for making

DOEpatents

Kilgo, Riley D.; Kovacic, Larry; Brow, Richard K.

2000-01-01

The present invention provides a light-weight, hermetic coaxial radio-frequency (RF) interconnection having an electrically conductive outer housing made of aluminum or an aluminum alloy, a central electrical conductor made of ferrous or non-ferrous material, and a cylinder of dielectric material comprising a low-melting-temperature, high-thermal-expansion aluminophosphate glass composition for hermetically sealing between the aluminum-alloy outer housing and the ferrous or non-ferrous center conductor. The entire RF interconnection assembly is made permanently hermetic by thermally fusing the center conductor, glass, and housing concurrently by bringing the glass to the melt point by way of exposure to an atmospheric temperature sufficient to melt the glass, less than 540.degree. C., but that does not melt the center conductor or the outer aluminum or aluminum alloy housing. The composition of the glass used is controlled to provide a suitable low dielectric constant so that an appropriate electrical characteristic impedance, for example 50 ohms, can be achieved for an electrical interconnection that performs well at high radio frequencies and also provides an interconnection maintaining a relatively small physical size.

46 CFR 116.610 - Ventilation ducts.

Code of Federal Regulations, 2010 CFR

2010-10-01

... incidental to its installation, must be made of noncombustible material. (c) Combustibles and other foreign materials are not allowed within ventilation ducts. However, metal piping and electrical wiring installed in... the wiring does not interfere with the operation of fire dampers. Electrical wiring and piping may not...

Zee electrical interconnect

NASA Technical Reports Server (NTRS)

Rust, Thomas M. (Inventor); Gaddy, Edward M. (Inventor); Herriage, Michael J. (Inventor); Patterson, Robert E. (Inventor); Partin, Richard D. (Inventor)

2001-01-01

An interconnect, having some length, that reliably connects two conductors separated by the length of the interconnect when the connection is made but in which one length if unstressed would change relative to the other in operation. The interconnect comprises a base element an intermediate element and a top element. Each element is rectangular and formed of a conducting material and has opposed ends. The elements are arranged in a generally Z-shape with the base element having one end adapted to be connected to one conductor. The top element has one end adapted to be connected to another conductor and the intermediate element has its ends disposed against the other end of the base and the top element. Brazes mechanically and electrically interconnect the intermediate element to the base and the top elements proximate the corresponding ends of the elements. When the respective ends of the base and the top elements are connected to the conductors, an electrical connection is formed therebetween, and when the conductors are relatively moved or the interconnect elements change length the elements accommodate the changes and the associated compression and tension forces in such a way that the interconnect does not mechanically fatigue.

Three-Dimensional Wiring for Extensible Quantum Computing: The Quantum Socket

NASA Astrophysics Data System (ADS)

Béjanin, J. H.; McConkey, T. G.; Rinehart, J. R.; Earnest, C. T.; McRae, C. R. H.; Shiri, D.; Bateman, J. D.; Rohanizadegan, Y.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.; Mariantoni, M.

2016-10-01

Quantum computing architectures are on the verge of scalability, a key requirement for the implementation of a universal quantum computer. The next stage in this quest is the realization of quantum error-correction codes, which will mitigate the impact of faulty quantum information on a quantum computer. Architectures with ten or more quantum bits (qubits) have been realized using trapped ions and superconducting circuits. While these implementations are potentially scalable, true scalability will require systems engineering to combine quantum and classical hardware. One technology demanding imminent efforts is the realization of a suitable wiring method for the control and the measurement of a large number of qubits. In this work, we introduce an interconnect solution for solid-state qubits: the quantum socket. The quantum socket fully exploits the third dimension to connect classical electronics to qubits with higher density and better performance than two-dimensional methods based on wire bonding. The quantum socket is based on spring-mounted microwires—the three-dimensional wires—that push directly on a microfabricated chip, making electrical contact. A small wire cross section (approximately 1 mm), nearly nonmagnetic components, and functionality at low temperatures make the quantum socket ideal for operating solid-state qubits. The wires have a coaxial geometry and operate over a frequency range from dc to 8 GHz, with a contact resistance of approximately 150 m Ω , an impedance mismatch of approximately 10 Ω , and minimal cross talk. As a proof of principle, we fabricate and use a quantum socket to measure high-quality superconducting resonators at a temperature of approximately 10 mK. Quantum error-correction codes such as the surface code will largely benefit from the quantum socket, which will make it possible to address qubits located on a two-dimensional lattice. The present implementation of the socket could be readily extended to accommodate a quantum processor with a (10 ×10 )-qubit lattice, which would allow for the realization of a simple quantum memory.

Direct mapping of electrical noise sources in molecular wire-based devices

PubMed Central

Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

2017-01-01

We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices. PMID:28233821

Direct mapping of electrical noise sources in molecular wire-based devices

NASA Astrophysics Data System (ADS)

Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

2017-02-01

We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices.

Multiscale free-space optical interconnects for intrachip global communication: motivation, analysis, and experimental validation.

PubMed

McFadden, Michael J; Iqbal, Muzammil; Dillon, Thomas; Nair, Rohit; Gu, Tian; Prather, Dennis W; Haney, Michael W

2006-09-01

The use of optical interconnects for communication between points on a microchip is motivated by system-level interconnect modeling showing the saturation of metal wire capacity at the global layer. Free-space optical solutions are analyzed for intrachip communication at the global layer. A multiscale solution comprising microlenses, etched compound slope microprisms, and a curved mirror is shown to outperform a single-scale alternative. Microprisms are designed and fabricated and inserted into an optical setup apparatus to experimentally validate the concept. The multiscale free-space system is shown to have the potential to provide the bandwidth density and configuration flexibility required for global communication in future generations of microchips.

High-rate serial interconnections for embedded and distributed systems with power and resource constraints

NASA Astrophysics Data System (ADS)

Sheynin, Yuriy; Shutenko, Felix; Suvorova, Elena; Yablokov, Evgenej

2008-04-01

High rate interconnections are important subsystems in modern data processing and control systems of many classes. They are especially important in prospective embedded and on-board systems that used to be multicomponent systems with parallel or distributed architecture, [1]. Modular architecture systems of previous generations were based on parallel busses that were widely used and standardised: VME, PCI, CompactPCI, etc. Busses evolution went in improvement of bus protocol efficiency (burst transactions, split transactions, etc.) and increasing operation frequencies. However, due to multi-drop bus nature and multi-wire skew problems the parallel bussing speedup became more and more limited. For embedded and on-board systems additional reason for this trend was in weight, size and power constraints of an interconnection and its components. Parallel interfaces have become technologically more challenging as their respective clock frequencies have increased to keep pace with the bandwidth requirements of their attached storage devices. Since each interface uses a data clock to gate and validate the parallel data (which is normally 8 bits or 16 bits wide), the clock frequency need only be equivalent to the byte rate or word rate being transmitted. In other words, for a given transmission frequency, the wider the data bus, the slower the clock. As the clock frequency increases, more high frequency energy is available in each of the data lines, and a portion of this energy is dissipated in radiation. Each data line not only transmits this energy but also receives some from its neighbours. This form of mutual interference is commonly called "cross-talk," and the signal distortion it produces can become another major contributor to loss of data integrity unless compensated by appropriate cable designs. Other transmission problems such as frequency-dependent attenuation and signal reflections, while also applicable to serial interfaces, are more troublesome in parallel interfaces due to the number of additional cable conductors involved. In order to compensate for these drawbacks, higher quality cables, shorter cable runs and fewer devices on the bus have been the norm. Finally, the physical bulk of the parallel cables makes them more difficult to route inside an enclosure, hinders cooling airflow and is incompatible with the trend toward smaller form-factor devices. Parallel busses worked in systems during the past 20 years, but the accumulated problems dictate the need for change and the technology is available to spur the transition. The general trend in high-rate interconnections turned from parallel bussing to scalable interconnections with a network architecture and high-rate point-to-point links. Analysis showed that data links with serial information transfer could achieve higher throughput and efficiency and it was confirmed in various research and practical design. Serial interfaces offer an improvement over older parallel interfaces: better performance, better scalability, and also better reliability as the parallel interfaces are at their limits of speed with reliable data transfers and others. The trend was implemented in major standards' families evolution: e.g. from PCI/PCI-X parallel bussing to PCIExpress interconnection architecture with serial lines, from CompactPCI parallel bus to ATCA (Advanced Telecommunications Architecture) specification with serial links and network topologies of an interconnection, etc. In the article we consider a general set of characteristics and features of serial interconnections, give a brief overview of serial interconnections specifications. In more details we present the SpaceWire interconnection technology. Have been developed for space on-board systems applications the SpaceWire has important features and characteristics that make it a prospective interconnection for wide range of embedded systems.

Fast process flow, on-wafer interconnection and singulation for MEPV

DOE Office of Scientific and Technical Information (OSTI.GOV)

Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis

2017-01-31

A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality ofmore » metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.« less

Fast process flow, on-wafer interconnection and singulation for MEPV

DOE Office of Scientific and Technical Information (OSTI.GOV)

Okandan, Murat; Nielson, Gregory N.; Cruz-Campa, Jose Luis

2017-08-29

A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality ofmore » metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.« less

46 CFR 111.95-7 - Wiring of boat winch components.

Code of Federal Regulations, 2012 CFR

2012-10-01

...-7 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Electric Power-Operated Boat Winches § 111.95-7 Wiring of boat winch... electric installation from all sources of potential. The switch must be in series with and on the supply...

46 CFR 111.95-7 - Wiring of boat winch components.

Code of Federal Regulations, 2013 CFR

2013-10-01

...-7 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Electric Power-Operated Boat Winches § 111.95-7 Wiring of boat winch... electric installation from all sources of potential. The switch must be in series with and on the supply...

46 CFR 111.95-7 - Wiring of boat winch components.

Code of Federal Regulations, 2011 CFR

2011-10-01

...-7 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Electric Power-Operated Boat Winches § 111.95-7 Wiring of boat winch... electric installation from all sources of potential. The switch must be in series with and on the supply...

46 CFR 111.95-7 - Wiring of boat winch components.

Code of Federal Regulations, 2014 CFR

2014-10-01

...-7 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Electric Power-Operated Boat Winches § 111.95-7 Wiring of boat winch... electric installation from all sources of potential. The switch must be in series with and on the supply...

Nuclear qualified in-containment electrical connectors and methods of connecting electrical conductors

NASA Astrophysics Data System (ADS)

Powell, J. G.

1990-07-01

A nuclear qualified in-containment electrical connection is presented that comprises: (1) an insulated, sheathed instrument lead having electrical conductors extending from one end thereof to provide two exposed lead wires; (2) a watertight cable having electrical conducting wires therein and extending from one end of the cable to provide two lead wires therefrom; (3) two butt splice connectors each connecting the ends of respective ones of the lead wires from the instrument lead and cable; (4) a length of heat shrinkable plastic tubing positioned over each butt splice connector and an adjacent portion of a respective lead wire from the cable and heat shrunk into position; and (5) a length of heat shrinkable plastic tubing on the end portion of the instrument lead adjacent the lead wires therefrom, heat shrunk thereon, with a length of outer heat shrinkable plastic tubing. The plastic tubing extends over the end portion of the instrument lead and the heat shrinkable tubing and over the butt splice connectors and a portion of the cable adjacent the cable lead lines. The outer heat shrinkable tubing is heat shrunk into sealing position on the instrument lead and cable.

Interconnection of bundled solid oxide fuel cells

DOEpatents

Brown, Michael; Bessette, II, Norman F; Litka, Anthony F; Schmidt, Douglas S

2014-01-14

A system and method for electrically interconnecting a plurality of fuel cells to provide dense packing of the fuel cells. Each one of the plurality of fuel cells has a plurality of discrete electrical connection points along an outer surface. Electrical connections are made directly between the discrete electrical connection points of adjacent fuel cells so that the fuel cells can be packed more densely. Fuel cells have at least one outer electrode and at least one discrete interconnection to an inner electrode, wherein the outer electrode is one of a cathode and and anode and wherein the inner electrode is the other of the cathode and the anode. In tubular solid oxide fuel cells the discrete electrical connection points are spaced along the length of the fuel cell.

46 CFR 111.30-19 - Buses and wiring.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 4 2014-10-01 2014-10-01 false Buses and wiring. 111.30-19 Section 111.30-19 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switchboards § 111.30-19 Buses and wiring. (a) General. Each bus must meet the requirements of...

46 CFR 111.30-19 - Buses and wiring.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 46 Shipping 4 2011-10-01 2011-10-01 false Buses and wiring. 111.30-19 Section 111.30-19 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switchboards § 111.30-19 Buses and wiring. (a) General. Each bus must meet the requirements of...

46 CFR 111.30-19 - Buses and wiring.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 4 2013-10-01 2013-10-01 false Buses and wiring. 111.30-19 Section 111.30-19 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switchboards § 111.30-19 Buses and wiring. (a) General. Each bus must meet the requirements of...

46 CFR 111.30-19 - Buses and wiring.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 4 2012-10-01 2012-10-01 false Buses and wiring. 111.30-19 Section 111.30-19 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) ELECTRICAL ENGINEERING ELECTRIC SYSTEMS-GENERAL REQUIREMENTS Switchboards § 111.30-19 Buses and wiring. (a) General. Each bus must meet the requirements of...

77 FR 34872 - Airworthiness Directives; Fokker Services B.V. Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-06-12

... require modifying galley power supply wiring by disconnecting it from the affected plug/receptacle and reconnecting the power supply wiring through splices. We are proposing this AD to prevent a high electrical load which may lead to overheating of the galley power supply wiring and/or the electrical connector...

77 FR 47273 - Airworthiness Directives; Airbus Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-08

... the autopilot electrical wiring conduit and the wing bottom skin. This AD requires modifying the wiring installation on the right-hand wing. We are issuing this AD to prevent sparking due to electrical... above, this [EASA] AD requires modification of the wiring installation to improve the routing and the...

Basic Electricity. Part 4.

ERIC Educational Resources Information Center

Kilmer, Donald C.

Designed for the student interested in a vocation in electrical work, this guide, fourth in a set of four, includes three units: Unit X--Splicing Wires, covering thirteen lessons (removing insulation, pigtail splice, Western Union splice, tap splice, extension cord splice, connecting wires to a terminal screw, underwriter's knot, three-wire ground…

Programmability of nanowire networks

NASA Astrophysics Data System (ADS)

Bellew, A. T.; Bell, A. P.; McCarthy, E. K.; Fairfield, J. A.; Boland, J. J.

2014-07-01

Electrical connectivity in networks of nanoscale junctions must be better understood if nanowire devices are to be scaled up from single wires to functional material systems. We show that the natural connectivity behaviour found in random nanowire networks presents a new paradigm for creating multi-functional, programmable materials. In devices made from networks of Ni/NiO core-shell nanowires at different length scales, we discover the emergence of distinct behavioural regimes when networks are electrically stressed. We show that a small network, with few nanowire-nanowire junctions, acts as a unipolar resistive switch, demonstrating very high ON/OFF current ratios (>105). However, large networks of nanowires distribute an applied bias across a large number of junctions, and thus respond not by switching but instead by evolving connectivity. We demonstrate that these emergent properties lead to fault-tolerant materials whose resistance may be tuned, and which are capable of adaptively reconfiguring under stress. By combining these two behavioural regimes, we demonstrate that the same nanowire network may be programmed to act both as a metallic interconnect, and a resistive switch device with high ON/OFF ratio. These results enable the fabrication of programmable, multi-functional materials from random nanowire networks.Electrical connectivity in networks of nanoscale junctions must be better understood if nanowire devices are to be scaled up from single wires to functional material systems. We show that the natural connectivity behaviour found in random nanowire networks presents a new paradigm for creating multi-functional, programmable materials. In devices made from networks of Ni/NiO core-shell nanowires at different length scales, we discover the emergence of distinct behavioural regimes when networks are electrically stressed. We show that a small network, with few nanowire-nanowire junctions, acts as a unipolar resistive switch, demonstrating very high ON/OFF current ratios (>105). However, large networks of nanowires distribute an applied bias across a large number of junctions, and thus respond not by switching but instead by evolving connectivity. We demonstrate that these emergent properties lead to fault-tolerant materials whose resistance may be tuned, and which are capable of adaptively reconfiguring under stress. By combining these two behavioural regimes, we demonstrate that the same nanowire network may be programmed to act both as a metallic interconnect, and a resistive switch device with high ON/OFF ratio. These results enable the fabrication of programmable, multi-functional materials from random nanowire networks. Electronic supplementary information (ESI) available: Nanowire statistics (length, diameter statistics, and oxide thickness) are provided. Forming curves for single junctions and networks. Passive voltage contrast image demonstrating selectivity of conductive pathways in 100 μm network. See DOI: 10.1039/c4nr02338b

Evaluation of electrical conductivity of Cu and Al through sub microsecond underwater electrical wire explosion

NASA Astrophysics Data System (ADS)

Sheftman, D.; Shafer, D.; Efimov, S.; Krasik, Ya. E.

2012-03-01

Sub-microsecond timescale underwater electrical wire explosions using Cu and Al materials have been conducted. Current and voltage waveforms and time-resolved streak images of the discharge channel, coupled to 1D magneto-hydrodynamic simulations, have been used to determine the electrical conductivity of the metals for the range of conditions between hot liquid metal and strongly coupled non-ideal plasma, in the temperature range of 10-60 KK. The results of these studies showed that the conductivity values obtained are typically lower than those corresponding to modern theoretical electrical conductivity models and provide a transition between the conductivity values obtained in microsecond time scale explosions and those obtained in nanosecond time scale wire explosions. In addition, the measured wire expansion shows good agreement with equation of state tables.

Electrical contacts between cathodes and metallic interconnects in solid oxide fuel cells

NASA Astrophysics Data System (ADS)

Yang, Zhenguo; Xia, Guanguang; Singh, Prabhakar; Stevenson, Jeffry W.

In this work, simulated cathode/interconnect structures were used to investigate the effects of different contact materials on the contact resistance between a strontium doped lanthanum ferrite cathode and a Crofer22 APU interconnect. Among the materials studied, Pt, which has a prohibitive cost for the application, demonstrated the best performance as a contact paste. For the relatively cost-effective perovskites, the contact ASR was found to depend on their electrical conductivity, scale growth on the metallic interconnect, and interactions between the contact material and the metallic interconnect or particularly the scale grown on the interconnect. Manganites appeared to promote manganese-containing spinel interlayer formation that helped minimize the increase of contact ASR. Chromium from the interconnects reacted with strontium in the perovskites to form SrCrO 4. An improved performance was achieved by application of a thermally grown (Mn,Co) 3O 4 spinel protection layer on Crofer22 APU that dramatically minimized the contact resistance between the cathodes and interconnects.

Method of Fault Detection and Rerouting

NASA Technical Reports Server (NTRS)

Gibson, Tracy L. (Inventor); Medelius, Pedro J. (Inventor); Lewis, Mark E. (Inventor)

2013-01-01

A system and method for detecting damage in an electrical wire, including delivering at least one test electrical signal to an outer electrically conductive material in a continuous or non-continuous layer covering an electrically insulative material layer that covers an electrically conductive wire core. Detecting the test electrical signals in the outer conductive material layer to obtain data that is processed to identify damage in the outer electrically conductive material layer.

Energy-efficient neural information processing in individual neurons and neuronal networks.

PubMed

Yu, Lianchun; Yu, Yuguo

2017-11-01

Brains are composed of networks of an enormous number of neurons interconnected with synapses. Neural information is carried by the electrical signals within neurons and the chemical signals among neurons. Generating these electrical and chemical signals is metabolically expensive. The fundamental issue raised here is whether brains have evolved efficient ways of developing an energy-efficient neural code from the molecular level to the circuit level. Here, we summarize the factors and biophysical mechanisms that could contribute to the energy-efficient neural code for processing input signals. The factors range from ion channel kinetics, body temperature, axonal propagation of action potentials, low-probability release of synaptic neurotransmitters, optimal input and noise, the size of neurons and neuronal clusters, excitation/inhibition balance, coding strategy, cortical wiring, and the organization of functional connectivity. Both experimental and computational evidence suggests that neural systems may use these factors to maximize the efficiency of energy consumption in processing neural signals. Studies indicate that efficient energy utilization may be universal in neuronal systems as an evolutionary consequence of the pressure of limited energy. As a result, neuronal connections may be wired in a highly economical manner to lower energy costs and space. Individual neurons within a network may encode independent stimulus components to allow a minimal number of neurons to represent whole stimulus characteristics efficiently. This basic principle may fundamentally change our view of how billions of neurons organize themselves into complex circuits to operate and generate the most powerful intelligent cognition in nature. © 2017 Wiley Periodicals, Inc. © 2017 Wiley Periodicals, Inc.

New reaction tester accurate within 56 microseconds

NASA Technical Reports Server (NTRS)

Brown, H.

1972-01-01

Testing device measures simple and disjunctive reaction time of human subject to light stimuli. Tester consists of reaction key, logic card, panel mounted neon indicators, and interconnecting wiring. Device is used for determining reaction times of patients undergoing postoperative neurological therapy.

15 CFR 772.1 - Definitions of terms as used in the Export Administration Regulations (EAR).

Code of Federal Regulations, 2010 CFR

2010-01-01

..., but not a physical change in wiring or interconnections. Digital transfer rate. (Cat 5)—The total bit...) means an electronic control system for gas turbine or combined cycle engines utilizing a digital...

MOCVD Growth of III-V Photodetectors and Light Emitters for Integration of Optoelectronic Devices on Si substrates

NASA Astrophysics Data System (ADS)

Geng, Yu

With the increase of clock speed and wiring density in integrated circuits, inter-chip and intra-chip interconnects through conventional electrical wires encounter increasing difficulties because of the large power loss and bandwidth limitation. Optical interconnects have been proposed as an alternative to copper-based interconnects and are under intense study due to their large data capacity, high data quality and low power consumption. III-V compound semiconductors offer high intrinsic electron mobility, small effective electron mass and direct bandgap, which make this material system advantageous for high-speed optoelectronic devices. The integration of III-V optoelectronic devices on Si substrates will provide the combined advantage of a high level of integration and large volume production of Si-based electronic circuitry with the superior electrical and optical performance of III-V components, paving the way to a new generation of hybrid integrated circuits. In this thesis, the direct heteroepitaxy of photodetectors (PDs) and light emitters using metal-organic chemical vapor deposition for the integration of photonic devices on Si substrates were studied. First we studied the selective-area growth of InP/GaAs on patterned Si substrates for PDs. To overcome the loading effect, a multi-temperature composite growth technique for GaAs was developed. By decreasing various defects such as dislocations and anti-phase domains, the GaAs and InP buffer layers are with good crystalline quality and the PDs show high speed and low dark current performance both at the edge and center of the large growth well. Then the growth and fabrication of GaAs/AlGaAs QW lasers were studied. Ellipsometry was used to calibrate the Al composition of AlGaAs. Thick p and n type AlGaAs with a mirrorlike surface were grown by high V/III ratio and high temperature. The GaAs/AlGaAs broad area QW laser was successfully grown and fabricated on GaAs substrate and showed a pulsed lasing result with a threshold current density of about 800 A/cm2. For the integration of lasers on Si substrate, quantum dot (QD) lasers were studied. A flow-and-stop process of TBA was used to grow InAs QDs with the in-situ monitor EpiRas. QDs with a PL wavelength of ˜1.3 mum were grown on GaAs and Si substrates. To decrease the PL degradation problem caused by the contaminations from AlGaAs, an InGaAs insertion layer was inserted in between the AlGaAs and QDs region. Microdisk and a-Si waveguide lasers are designed and fabricated.

Retroactivity in the Context of Modularly Structured Biomolecular Systems

PubMed Central

Pantoja-Hernández, Libertad; Martínez-García, Juan Carlos

2015-01-01

Synthetic biology has intensively promoted the technical implementation of modular strategies in the fabrication of biological devices. Modules are considered as networks of reactions. The behavior displayed by biomolecular systems results from the information processes carried out by the interconnection of the involved modules. However, in natural systems, module wiring is not a free-of-charge process; as a consequence of interconnection, a reactive phenomenon called retroactivity emerges. This phenomenon is characterized by signals that propagate from downstream modules (the modules that receive the incoming signals upon interconnection) to upstream ones (the modules that send the signals upon interconnection). Such retroactivity signals, depending of their strength, may change and sometimes even disrupt the behavior of modular biomolecular systems. Thus, analysis of retroactivity effects in natural biological and biosynthetic systems is crucial to achieve a deeper understanding of how this interconnection between functionally characterized modules takes place and how it impacts the overall behavior of the involved cell. By discussing the modules interconnection in natural and synthetic biomolecular systems, we propose that such systems should be considered as quasi-modular. PMID:26137457

High temperature solid electrolyte fuel cell configurations and interconnections

DOEpatents

Isenberg, Arnold O.

1984-01-01

High temperature fuel cell configurations and interconnections are made including annular cells having a solid electrolyte sandwiched between thin film electrodes. The cells are electrically interconnected along an elongated axial outer surface.

Industrial Education. Electricity/Electronics Curriculum Guide, Phase II. Instructional Modules, Level I (9 Week).

ERIC Educational Resources Information Center

Lillo, Robert E.; Soffiotto, Nicholas S.

Designed for students in grades 7 and 8, this electricity/electronics curriculum guide contains instructional modules for ten units of instruction (nine-week class): (1) orientation; (2) understanding electricity; (3) safety; (4) methods to generate electricity; (5) wiring tools and wire; (6) soldering; (7) magnetism and electromagnetism; (8)…

Industrial Education. Electricity/Electronics Curriculum Guide, Phase II. Instructional Modules, Level I (18 Week).

ERIC Educational Resources Information Center

Lillo, Robert E.; Soffiotto, Nicholas S.

Designed for students in grades 7 and 8, this electricity/electronics curriculum guide contains instructional modules for twelve units of instruction: (1) orientation; (2) understanding electricity; (3) safety; (4) methods to generate electricity; (5) wiring tools and wire; (6) soldering; (7) magnetism and electromagnetism; (8) circuits, symbols,…

The European project Merlin on multi-gigabit, energy-efficient, ruggedized lightwave engines for advanced on-board digital processors

NASA Astrophysics Data System (ADS)

Stampoulidis, L.; Kehayas, E.; Karppinen, M.; Tanskanen, A.; Heikkinen, V.; Westbergh, P.; Gustavsson, J.; Larsson, A.; Grüner-Nielsen, L.; Sotom, M.; Venet, N.; Ko, M.; Micusik, D.; Kissinger, D.; Ulusoy, A. C.; King, R.; Safaisini, R.

2017-11-01

Modern broadband communication networks rely on satellites to complement the terrestrial telecommunication infrastructure. Satellites accommodate global reach and enable world-wide direct broadcasting by facilitating wide access to the backbone network from remote sites or areas where the installation of ground segment infrastructure is not economically viable. At the same time the new broadband applications increase the bandwidth demands in every part of the network - and satellites are no exception. Modern telecom satellites incorporate On-Board Processors (OBP) having analogue-to-digital (ADC) and digital-to-analogue converters (DAC) at their inputs/outputs and making use of digital processing to handle hundreds of signals; as the amount of information exchanged increases, so do the physical size, mass and power consumption of the interconnects required to transfer massive amounts of data through bulk electric wires.

Embroidered Copper Microwire Current Collector for Improved Cycling Performance of Silicon Anodes in Lithium-Ion Batteries.

PubMed

Breitung, Ben; Aguiló-Aguayo, Noemí; Bechtold, Thomas; Hahn, Horst; Janek, Jürgen; Brezesinski, Torsten

2017-10-12

Si holds great promise as an alloying anode material for Li-ion batteries with improved energy density because of its high theoretical specific capacity and favorable operation voltage range. However, the large volume expansion of Si during electrochemical reaction with Li and the associated adverse effects strongly limit its prospect for application. Here, we report on the use of three-dimensional instead of flat current collectors for high-capacity Si anodes in an attempt to mitigate the loss of electrical contact of active electrode regions as a result of structural disintegration with cycling. The current collectors were produced by technical embroidery and consist of interconnected Cu wires of diameter <150 µm. In comparison to Si/Li cells using a conventional Cu foil current collector, the embroidered microwire network-based cells show much enhanced capacity and reversibility due to a higher degree of tolerance to cycling.

Polarity effect of electromigration on mechanical properties of lead-free solder joints

NASA Astrophysics Data System (ADS)

Ren, Fei

The trend of electronic packaging is to package the chips and the associated interconnections in a compact way that allows high speed operation; that allows for sufficient heat removal; that can withstand the thermal cycling associated with the turning on and turning off of the circuits; and that protects the circuits from environmental attack. These goals require that flip chip solder joints have higher resistance to electromigration, stronger mechanical property to sustain thermal mechanical stress, and are lead-free materials to satisfy environment and health concern. With lots of work on chemical reaction, electromigration and mechanical study in flip chip solder joints, however, the interaction between different driving forces is still little known. As a matter of fact, the combination study of chemical, electrical and mechanical is more and more significant to the understanding of the behavior of flip chip solder joints. In this dissertation, I developed one dimensional Cu (wire)-eutectic SnAgCu(ball)-Cu(wire) structure to investigate the interaction between electrical and mechanical force in lead-free solder joints. Electromigration was first conducted. The mechanical behaviors of solder joints before, after, and during electromigration were examined. Electrical current and mechanical stress were applied either in serial or in parallel to the solder joints. Tensile, creep, and drop tests, combined with different electrical current densities (1˜5x10 3A/cm2) and different stressing time (3˜144 hours), have been performed to study the effect of electromigration on the mechanical behavior of solder joints. Nano-indentation test was conducted to study the localized mechanical property of IMC at both interfaces in nanometer scale. Fracture images help analyze the failure mechanism of solder joints driven by both electrical and mechanical forces. The combination study shows a strain build-up during electromigration. Furthermore, a ductile-to-brittle transition in flip chip solder joints induced by electromigration is observed, in which the fracture position migrates from the middle to the cathode interface of the joint with increasing current density and time. The transition is explained by the polarity effect of electromigration, particular due to the accumulation of vacancies at the cathode interface.

Evaluation of Pd-Cr Wires for Strain Gage Application

NASA Technical Reports Server (NTRS)

Lei, Jih-Fen; Greer, L. C., III; Oberle, L. G.

1995-01-01

A newly developed alloy, palladium-13 weight percent chromium (Pd13Cr), was identified by United Technologies Research Center under a NASA contract to be the best material for high temperature strain gage applications. An electrical resistance strain gage that can provide accurate static strain measurement to a temperature higher than that of a commercially available gage is urgently needed in aerospace and aeronautics research. A strain gage made of a 25.4 micron (1 mil) diameter Pd13Cr wire has been recently demonstrated to be usable for static strain measurements to 800 C. This compares to the 400 C temperature limit of the commercially available strain gages. The performance of the Pd-Cr gage, however, strongly depends on the quality of the Pd13Cr wire. Four batches of Pd-Cr wires purchased from three different manufacturers were therefore evaluated to determine the best source of the wire for strain gage applications. The three suppliers were Precious Metal Institute in China, Sigmund Cohn Co., and G & S Titanium, Inc. in the United States. Two batches of wires obtained from Previous Metal Institute in 1987 and 1992, respectively are referred to herein as China87 and China92 wires. The mechanical, chemical and electrical properties of these wires, both as-received and after high temperature exposures at 800 C for 50 hours were analyzed. The elastic modulus and the failure strength of the wires were evaluated using a tensile test machine equipped with a laser speckle strain measurement system. The chemical and microstructural properties of the wires were inspected using a plasma atomic emission spectrometer and a scanning electron microscope (SEM) equipped with an energy dispersive X-ray spectroscope (EDS). The electrical stability and repeatability of the wires were determined by measuring the electrical resistance of the wires during three thermal cycles to 1000 C and a ten-hour soak at 1000 C. As a result of this study, the wire which has the highest strength, the least impurities content, the best oxidation resistance and the best electrical stability will be selected for upcoming strain gage applications.

Intramuscular Contact Lead Filled With Conductive Solution

NASA Technical Reports Server (NTRS)

Bamford, Robert M.; Hendrickson, James A.

1991-01-01

Proposed sheath for braided-wire intramuscular conductor preserves electrical continuity even if wire breaks. Plastic sheath surrounds conductive solution in which braided wire immersed. At end of cable, wire and sheath crimped together and press-fit in porous titanium electrode. Implanted surgically with aid of device resembling catheter. Used to deliver electrical stimuli to muscles in biomedical research on human and animal physiology, development of prostheses, regeneration of nerves and muscles, and artificial implants.

77 FR 58765 - Airworthiness Directives; Fokker Services B.V. Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-09-24

.... This AD requires modifying galley power supply wiring by disconnecting it from the affected plug/ receptacle and reconnecting the power supply wiring through splices. We are issuing this AD to prevent a high electrical load, which might lead to overheating of the galley power supply wiring and/or the electrical...

46 CFR 169.672 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 7 2010-10-01 2010-10-01 false Wiring for power and lighting circuits. 169.672 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of Less Than 50 Volts on Vessels of Less Than 100 Gross Tons § 169.672 Wiring for power and lighting circuits. (a...

46 CFR 169.673 - Installation of wiring for power and lighting circuits.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 7 2010-10-01 2010-10-01 false Installation of wiring for power and lighting circuits... SCHOOLS SAILING SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of Less Than 50 Volts on Vessels of Less Than 100 Gross Tons § 169.673 Installation of wiring for...

46 CFR 169.672 - Wiring for power and lighting circuits.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 46 Shipping 7 2012-10-01 2012-10-01 false Wiring for power and lighting circuits. 169.672 Section... SCHOOL VESSELS Machinery and Electrical Electrical Installations Operating at Potentials of Less Than 50 Volts on Vessels of Less Than 100 Gross Tons § 169.672 Wiring for power and lighting circuits. (a...

Traveling wire electrode increases productivity of Electrical Discharge Machining /EDM/ equipment

NASA Technical Reports Server (NTRS)

Kotora, J., Jr.; Smith, S. V.

1967-01-01

Traveling wire electrode on electrical discharge machining /EDM/ equipment reduces the time requirements for precision cutting. This device enables cutting with a minimum of lost material and without inducing stress beyond that inherent in the material. The use of wire increases accuracy and enables tighter tolerances to be maintained.

Sensors for monitoring waste glass quality and method of using the same

DOEpatents

Bickford, Dennis F.

1994-01-01

A set of three electrical probes for monitoring alkali and oxygen activity of a glass melt. On-line, real time measurements of the potential difference among the probes when they are placed in electrical contact with the melt yield the activity information and can be used to adjust the composition of the melt in order to produce higher quality glass. The first two probes each has a reference gas and a reference electrolyte and a pair of wires in electrical connection with each other in the reference gas but having one of the wires extending further into the reference electrolyte. The reference gases both include a known concentration of oxygen. The third electrode has a pair of wires extending through an otherwise solid body to join electrically just past the body but having one of the wires extend past this junction. Measuring the potential difference between wires of the first and second probes provides the alkali activity; measurement of the potential difference between wires of the second and third probes provides the oxygen activity of the melt.

Sensors for monitoring waste glass quality and method of using the same

DOEpatents

Bickford, D.F.

1994-03-15

A set of three electrical probes is described for monitoring alkali and oxygen activity of a glass melt. On-line, real time measurements of the potential difference among the probes when they are placed in electrical contact with the melt yield the activity information and can be used to adjust the composition of the melt in order to produce higher quality glass. The first two probes each has a reference gas and a reference electrolyte and a pair of wires in electrical connection with each other in the reference gas but having one of the wires extending further into the reference electrolyte. The reference gases both include a known concentration of oxygen. The third electrode has a pair of wires extending through an otherwise solid body to join electrically just past the body but having one of the wires extend past this junction. Measuring the potential difference between wires of the first and second probes provides the alkali activity; measurement of the potential difference between wires of the second and third probes provides the oxygen activity of the melt. 1 figure.

Integrated Electrical Wire Insulation Repair System

NASA Technical Reports Server (NTRS)

Williams, Martha; Jolley, Scott; Gibson, Tracy; Parks, Steven

2013-01-01

An integrated system tool will allow a technician to easily and quickly repair damaged high-performance electrical wire insulation in the field. Low-melt polyimides have been developed that can be processed into thin films that work well in the repair of damaged polyimide or fluoropolymer insulated electrical wiring. Such thin films can be used in wire insulation repairs by affixing a film of this low-melt polyimide to the damaged wire, and heating the film to effect melting, flow, and cure of the film. The resulting repair is robust, lightweight, and small in volume. The heating of this repair film is accomplished with the use of a common electrical soldering tool that has been modified with a special head or tip that can accommodate the size of wire being repaired. This repair method can furthermore be simplified for the repair technician by providing replaceable or disposable soldering tool heads that have repair film already "loaded" and ready for use. The soldering tool heating device can also be equipped with a battery power supply that will allow its use in areas where plug-in current is not available

Development of a Miniaturized Hadamard Transform Time-of-Flight Mass Spectrometer

DTIC Science & Technology

2007-02-01

technique’s name. These pulses are generated using a Bradbury- Nielson gate (BNG), which is a set of two interleaved, electrically isolated and...interleaved sets of wire electrodes that are electrically isolated from one another and that lie in a plane perpendicular to the trajectory of the ion beam...electrical isolation of the two wire sets that are interleaved. In .the• im-ethod develioped in -th-is ab,-both- challengesar-e- overcome by-weaving wires

Analysis of hybrid electric/thermofluidic inputs for wet shape memory alloy actuators

NASA Astrophysics Data System (ADS)

Flemming, Leslie; Mascaro, Stephen

2013-01-01

A wet shape memory alloy (SMA) actuator is characterized by an SMA wire embedded within a compliant fluid-filled tube. Heating and cooling of the SMA wire produces a linear contraction and extension of the wire. Thermal energy can be transferred to and from the wire using combinations of resistive heating and free/forced convection. This paper analyzes the speed and efficiency of a simulated wet SMA actuator using a variety of control strategies involving different combinations of electrical and thermofluidic inputs. A computational fluid dynamics (CFD) model is used in conjunction with a temperature-strain model of the SMA wire to simulate the thermal response of the wire and compute strains, contraction/extension times and efficiency. The simulations produce cycle rates of up to 5 Hz for electrical heating and fluidic cooling, and up to 2 Hz for fluidic heating and cooling. The simulated results demonstrate efficiencies up to 0.5% for electric heating and up to 0.2% for fluidic heating. Using both electric and fluidic inputs concurrently improves the speed and efficiency of the actuator and allows for the actuator to remain contracted without continually delivering energy to the actuator, because of the thermal capacitance of the hot fluid. The characterized speeds and efficiencies are key requirements for implementing broader research efforts involving the intelligent control of electric and thermofluidic networks to optimize the speed and efficiency of wet actuator arrays.

NASA requirements and applications environments for electrical power wiring

NASA Technical Reports Server (NTRS)

Stavnes, Mark W.; Hammoud, Ahmad N.

1992-01-01

Serious problems can occur from insulation failures in the wiring harnesses of aerospace vehicles. In most recorded incidents, the failures have been identified to be the result of arc tracking, the propagation of an arc along wiring bundles through degradation of insulation. Propagation of the arc can lead to the loss of the entire wiring harness and the functions which it supports. While an extensive database of testing for arc track resistant wire insulations has been developed for aircraft applications, the counterpart requirements for spacecraft are very limited. The electrical, thermal, mechanical, chemical, and operational requirements for specification and testing of candidate wiring systems for spacecraft applications is presented.

LTCC interconnects in microsystems

NASA Astrophysics Data System (ADS)

Rusu, Cristina; Persson, Katrin; Ottosson, Britta; Billger, Dag

2006-06-01

Different microelectromechanical system (MEMS) packaging strategies towards high packaging density of MEMS devices and lower expenditure exist both in the market and in research. For example, electrical interconnections and low stress wafer level packaging are essential for improving device performance. Hybrid integration of low temperature co-fired ceramics (LTCC) with Si can be a way for an easier packaging system with integrated electrical interconnection, and as well towards lower costs. Our research on LTCC-Si integration is reported in this paper.

The importance of carbon nanotube wire density, structural uniformity, and purity for fabricating homogeneous carbon nanotube-copper wire composites by copper electrodeposition

NASA Astrophysics Data System (ADS)

Sundaram, Rajyashree; Yamada, Takeo; Hata, Kenji; Sekiguchi, Atsuko

2018-04-01

We present the influence of density, structural regularity, and purity of carbon nanotube wires (CNTWs) used as Cu electrodeposition templates on fabricating homogeneous high-electrical performance CNT-Cu wires lighter than Cu. We show that low-density CNTWs (<0.6 g/cm3 for multiwall nanotube wires) with regular macro- and microstructures and high CNT content (>90 wt %) are essential for making homogeneous CNT-Cu wires. These homogeneous CNT-Cu wires show a continuous Cu matrix with evenly mixed nanotubes of high volume fractions (˜45 vol %) throughout the wire-length. Consequently, the composite wires show densities ˜5.1 g/cm3 (33% lower than Cu) and electrical conductivities ˜6.1 × 104 S/cm (>100 × CNTW conductivity). However, composite wires from templates with higher densities or structural inconsistencies are non-uniform with discontinuous Cu matrices and poor CNT/Cu mixing. These non-uniform CNT-Cu wires show conductivities 2-6 times lower than the homogeneous composite wires.

Evolution of Mechanical and Electrical Properties During Annealing of the Copper Wire Drawn

NASA Astrophysics Data System (ADS)

Zidani, M.; Messaoudi, S.; Baudin, T.; Derfouf, C.; Boulagroun, A.; Mathon, M. H.

2011-12-01

In this work, the evolution of mechanical and electrical properties and microstructure of industrial copper wire used for electrical cabling was characterized. This work is not limited to the interpretation of the microstructural characteristics of the wire-drawn state but also after different annealing treatments. For the lowest temperatures (160 °C and 200 °C), significant changes are not observed in the microstructure (grain size) in the weak deformed wire (28.5%). Instead, variations of some properties of the metal were observed (hardness and electrical resistivity). For strong deformation (61.4% and 84.59%), annealing, leads to recrystallization with a softening material. Let us note that the resistivity increases with deformation level and becomes higher after annealing at low temperature (200 °C).

SpaceWire Data Handling Demonstration System

NASA Astrophysics Data System (ADS)

Mills, S.; Parkes, S. M.; O'Gribin, N.

2007-08-01

The SpaceWire standard was published in 2003 with the aim of providing a standard for onboard communications, defining the physical and data link layers of an interconnection, in order to improve reusability, reliability and to reduce the cost of mission development. The many benefits which it provides mean that it has already been used in a number of missions, both in Europe and throughout the world. Recent work by the SpaceWire community has included the development of higher level protocols for SpaceWire, such as the Remote Memory Access Protocol (RMAP) which can be used for many purposes, including the configuration of SpaceWire devices. Although SpaceWire has become very popular, the various ways in which it can be used are still being discovered, as are the most efficient ways to use it. At the same time, some in the space industry are not even aware of SpaceWire's existence. This paper describes the SpaceWire Data Handling Demonstration System that has been developed by the University of Dundee. This system simulates an onboard data handling network based on SpaceWire. It uses RMAP for all communication, and so demonstrates how SpaceWire and standardised higher level protocols can be used onboard a spacecraft. The system is not only a good advert for those who are unfamiliar with the benefits of SpaceWire, it is also a useful tool for those using SpaceWire to test ideas.

Novel optical interconnect devices and coupling methods applying self-written waveguide technology

NASA Astrophysics Data System (ADS)

Nakama, Kenichi; Mikami, Osamu

2011-05-01

For the use in cost-effective optical interconnection of opt-electronic printed wiring boards (OE-PWBs), we have developed novel optical interconnect devices and coupling methods simplifying board to board optical interconnect. All these are based on the self-written waveguide (SWW) technology by the mask-transfer method with light-curable resin. This method enables fabrication of arrayed M × N optical channels at one shot of UV light. Very precise patterns, as an example, optical rod with diameters of 50μm to 500μm, can be easily fabricated. The length of the fabricated patterns ,, typically up to about 1000μm , can be controlled by a spacer placed between the photomask and the substrate. Using these technologies, several new optical interfaces have been demonstrated. These are a chip VCSEL with an optical output rod and new coupling methods of "plug-in" alignment and "optical socket" based on SWW.

Current shunting and formation of stationary shock waves during electric explosions of metal wires in air

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ivanenkov, G. V.; Gus'kov, S. Yu.; Barishpol'tsev, D. V.

2010-01-15

Results of experiments on the generation of shock waves during electric explosions of fine copper and tungsten wires in air are analyzed. The generation mechanism of stationary shock wave by a plasma piston formed during the shunting breakdown of the electrode gap in the course of a wire explosion is investigated. The role of structural elements of such discharges, such as the core, corona, and wire environment, is analyzed.

Parallel-wire grid assembly with method and apparatus for construction thereof

DOEpatents

Lewandowski, E.F.; Vrabec, J.

1981-10-26

Disclosed is a parallel wire grid and an apparatus and method for making the same. The grid consists of a generally coplanar array of parallel spaced-apart wires secured between metallic frame members by an electrically conductive epoxy. The method consists of continuously winding a wire about a novel winding apparatus comprising a plurality of spaced-apart generally parallel spindles. Each spindle is threaded with a number of predeterminedly spaced-apart grooves which receive and accurately position the wire at predetermined positions along the spindle. Overlying frame members coated with electrically conductive epoxy are then placed on either side of the wire array and are drawn together. After the epoxy hardens, portions of the wire array lying outside the frame members are trimmed away.

Parallel-wire grid assembly with method and apparatus for construction thereof

DOEpatents

Lewandowski, Edward F.; Vrabec, John

1984-01-01

Disclosed is a parallel wire grid and an apparatus and method for making the same. The grid consists of a generally coplanar array of parallel spaced-apart wires secured between metallic frame members by an electrically conductive epoxy. The method consists of continuously winding a wire about a novel winding apparatus comprising a plurality of spaced-apart generally parallel spindles. Each spindle is threaded with a number of predeterminedly spaced-apart grooves which receive and accurately position the wire at predetermined positions along the spindle. Overlying frame members coated with electrically conductive epoxy are then placed on either side of the wire array and are drawn together. After the epoxy hardens, portions of the wire array lying outside the frame members are trimmed away.

Copper wire theft and high voltage electrical burns

PubMed Central

Francis, Eamon C; Shelley, Odhran P

2014-01-01

High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage copper wire and its omnipresence on an international scale. PMID:25356371

Copper wire theft and high voltage electrical burns.

PubMed

Francis, Eamon C; Shelley, Odhran P

2014-01-01

High voltage electrical burns are uncommon. However in the midst of our economic recession we are noticing an increasing number of these injuries. Copper wire is a valuable commodity with physical properties as an excellent conductor of electricity making it both ubiquitous in society and prized on the black market. We present two consecutive cases referred to the National Burns Unit who sustained life threatening injuries from the alleged theft of high voltage copper wire and its omnipresence on an international scale.

46 CFR 111.95-7 - Wiring of boat winch components.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 4 2010-10-01 2010-10-01 false Wiring of boat winch components. 111.95-7 Section 111.95... SYSTEMS-GENERAL REQUIREMENTS Electric Power-Operated Boat Winches § 111.95-7 Wiring of boat winch... electric installation from all sources of potential. The switch must be in series with and on the supply...

30 CFR 75.1002 - Installation of electric equipment and conductors; permissibility.

Code of Federal Regulations, 2010 CFR

2010-07-01

... conductors; permissibility. 75.1002 Section 75.1002 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION... Wires and Trolley Feeder Wires § 75.1002 Installation of electric equipment and conductors... equipment is located within 150 feet of pillar workings or longwall faces. (b) Electric conductors and...

30 CFR 75.1002 - Installation of electric equipment and conductors; permissibility.

Code of Federal Regulations, 2011 CFR

2011-07-01

... conductors; permissibility. 75.1002 Section 75.1002 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION... Wires and Trolley Feeder Wires § 75.1002 Installation of electric equipment and conductors... equipment is located within 150 feet of pillar workings or longwall faces. (b) Electric conductors and...

77 FR 24833 - Airworthiness Directives; Airbus Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-04-26

... the hydraulic high pressure hose and electrical wiring of the green electrical motor pump (EMP). This... panel; doing a one-time general visual inspection for correct condition and installation of hydraulic... electrical wiring of the green EMPs, which in combination with a system failure, could cause an uncontrolled...

Experimental investigation on the energy deposition and expansion rate under the electrical explosion of aluminum wire in vacuum

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shi, Zongqian; Wang, Kun; Shi, Yuanjie

Experimental investigations on the electrical explosion of aluminum wire using negative polarity current in vacuum are presented. Current pulses with rise rates of 40 A/ns, 80 A/ns, and 120 A/ns are generated for investigating the influence of current rise rate on energy deposition. Experimental results show a significant increase of energy deposition into the wire before the voltage breakdown with the increase of current rise rate. The influence of wire dimension on energy deposition is investigated as well. Decreasing the wire length allows more energy to be deposited into the wire. The energy deposition of a 0.5 cm-long wire explosion ismore » ∼2.5 times higher than the energy deposition of a 2 cm-long wire explosion. The dependence of the energy deposition on wire diameter demonstrates a maximum energy deposition of 2.7 eV/atom with a diameter of ∼18 μm. Substantial increase in energy deposition is observed in the electrical explosion of aluminum wire with polyimide coating. A laser probe is applied to construct the shadowgraphy, schlieren, and interferometry diagnostics. The morphology and expansion trajectory of exploding products are analyzed based on the shadowgram. The interference phase shift is reconstructed from the interferogram. Parallel dual wires are exploded to estimate the expansion velocity of the plasma shell.« less

49 CFR 236.723 - Circuit, double wire; line.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 4 2010-10-01 2010-10-01 false Circuit, double wire; line. 236.723 Section 236... § 236.723 Circuit, double wire; line. An electric circuit not employing a common return wire; a circuit formed by individual wires throughout. ...

49 CFR 236.723 - Circuit, double wire; line.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 4 2011-10-01 2011-10-01 false Circuit, double wire; line. 236.723 Section 236... § 236.723 Circuit, double wire; line. An electric circuit not employing a common return wire; a circuit formed by individual wires throughout. ...

Electronic interconnects and devices with topological surface states and methods for fabricating same

DOEpatents

Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

2017-04-04

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

Electronic interconnects and devices with topological surface states and methods for fabricating same

DOEpatents

Yazdani, Ali; Ong, N. Phuan; Cava, Robert J.

2016-05-03

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

Multilevel Dual Damascene copper interconnections

NASA Astrophysics Data System (ADS)

Lakshminarayanan, S.

Copper has been acknowledged as the interconnect material for future generations of ICs to overcome the bottlenecks on speed and reliability present with the current Al based wiring. A new set of challenges brought to the forefront when copper replaces aluminum, have to be met and resolved to make it a viable option. Unit step processes related to copper technology have been under development for the last few years. In this work, the application of copper as the interconnect material in multilevel structures with SiO2 as the interlevel dielectric has been explored, with emphasis on integration issues and complete process realization. Interconnect definition was achieved by the Dual Damascene approach using chemical mechanical polishing of oxide and copper. The choice of materials used as adhesion promoter/diffusion barrier included Ti, Ta and CVD TiN. Two different polish chemistries (NH4OH or HNO3 based) were used to form the interconnects. The diffusion barrier was removed during polishing (in the case of TiN) or by a post CMP etch (as with Ti or Ta). Copper surface passivation was performed using boron implantation and PECVD nitride encapsulation. The interlevel dielectric way composed of a multilayer stack of PECVD SiO2 and SixNy. A baseline process sequence which ensured the mechanical and thermal compatibility of the different unit steps was first created. A comprehensive test vehicle was designed and test structures were fabricated using the process flow developed. Suitable modifications were subsequently introduced in the sequence as and when processing problems were encountered. Electrical characterization was performed on the fabricated devices, interconnects, contacts and vias. The structures were subjected to thermal stressing to assess their stability and performance. The measurement of interconnect sheet resistances revealed lower copper loss due to dishing on samples polished using HNO3 based slurry. Interconnect resistances remained stable upto 400oC, 500oC and 600oC for Ti, TiN and Ta barriers respectively. Via resistivity on the order of 10-9/ /Omegacm2 was measured for Cu/Ta/Cu interfaces and no degradation in the via resistance was observed upto 600oC on the 2 μm and 3 μm wide contact windows. Characterization of diode leakage and subthreshold currents of CMOS transistors fabricated with Ta adhesion layers, showed the failure of the Ta barrier at 450oC. Despite the good barrier performance of the CVD TiN films, obtaining low contact resistivity may be a concern. The potential use of Cu-Mg alloy as the backend metallization has also been studied. Fully encapsulated wiring has been fabricated by causing the Mg to out- diffuse towards the Cu/SiO2 interfaces and the free copper surface. The inter-connects exhibited good stability and oxidation resistance, but via resistances were extremely high, probably due to the presence of insulating films like MgO or MgF2 at the interface between the two metal levels. It may be possible to decrease the via resistance to values comparable to Cu/Ta/Cu by altering the process flow and using a suitable via clean. When used at the contact level, undesirable interaction with the CoSi2 film was observed at temperatures as low as 350oC. Another problem was the high contact resistance at the Cu-Mg/CoSi2 interface. Hence the use of this alloy as a contact fill material is not feasible at this time. An additional barrier layer may be required between the Cu-Mg and CoSi2 films to protect the integrity of the silicide and provide low contact resistance.

High-density stretchable microelectrode arrays: An integrated technology platform for neural and muscular surface interfacing

NASA Astrophysics Data System (ADS)

Guo, Liang

2011-12-01

Numerous applications in neuroscience research and neural prosthetics, such as retinal prostheses, spinal-cord surface stimulation for prosthetics, electrocorticogram (ECoG) recording for epilepsy detection, etc., involve electrical interaction with soft excitable tissues using a surface stimulation and/or recording approach. These applications require an interface that is able to set up electrical communications with a high throughput between electronics and the excitable tissue and that can dynamically conform to the shape of the soft tissue. Being a compliant and biocompatible material with mechanical impedance close to that of soft tissues, polydimethylsiloxane (PDMS) offers excellent potential as the substrate material for such neural interfaces. However, fabrication of electrical functionalities on PDMS has long been very challenging. This thesis work has successfully overcome many challenges associated with PDMS-based microfabrication and achieved an integrated technology platform for PDMS-based stretchable microelectrode arrays (sMEAs). This platform features a set of technological advances: (1) we have fabricated uniform current density profile microelectrodes as small as 10 mum in diameter; (2) we have patterned high-resolution (feature as small as 10 mum), high-density (pitch as small as 20 mum) thin-film gold interconnects on PDMS substrate; (3) we have developed a multilayer wiring interconnect technology within the PDMS substrate to further boost the achievable integration density of such sMEA; and (4) we have invented a bonding technology---via-bonding---to facilitate high-resolution, high-density integration of the sMEA with integrated circuits (ICs) to form a compact implant. Taken together, this platform provides a high-resolution, high-density integrated system solution for neural and muscular surface interfacing. sMEAs of example designs are evaluated through in vitro and in vivo experimentations on their biocompatibility, surface conformability, and surface recording/stimulation capabilities, with a focus on epimysial (i.e. on the surface of muscle) applications. Finally, as an example medical application, we investigate a prosthesis for unilateral vocal cord paralysis (UVCP) based on simultaneous multichannel epimysial recording and stimulation.

Cassette less SOFC stack and method of assembly

DOE Office of Scientific and Technical Information (OSTI.GOV)

Meinhardt, Kerry D

2014-11-18

A cassette less SOFC assembly and a method for creating such an assembly. The SOFC stack is characterized by an electrically isolated stack current path which allows welded interconnection between frame portions of the stack. In one embodiment electrically isolating a current path comprises the step of sealing a interconnect plate to a interconnect plate frame with an insulating seal. This enables the current path portion to be isolated from the structural frame an enables the cell frame to be welded together.

Thermal Model of a Current-Carrying Wire in a Vacuum

NASA Technical Reports Server (NTRS)

Border, James

2006-01-01

A computer program implements a thermal model of an insulated wire carrying electric current and surrounded by a vacuum. The model includes the effects of Joule heating, conduction of heat along the wire, and radiation of heat from the outer surface of the insulation on the wire. The model takes account of the temperature dependences of the thermal and electrical properties of the wire, the emissivity of the insulation, and the possibility that not only can temperature vary along the wire but, in addition, the ends of the wire can be thermally grounded at different temperatures. The resulting second-order differential equation for the steady-state temperature as a function of position along the wire is highly nonlinear. The wire is discretized along its length, and the equation is solved numerically by use of an iterative algorithm that utilizes a multidimensional version of the Newton-Raphson method.

Flexible nanogenerators

DOEpatents

Wang, Zhong L [Marietta, GA; Wang, Xudong [Atlanta, GA; Qin, Yong [Atlanta, GA; Yang, Rusen [Atlanta, GA

2011-07-19

A small scale electrical generator includes an elongated substrate and a first piezoelectric fine wire. The first piezoelectric fine wire is disposed along a surface of the substrate. The first piezoelectric fine wire has a first end and a spaced-apart second end. A first conductive contact secures the first end of the fine wire to a first portion of the substrate and a second conductive contact secures the second end of the fine wire to a second portion of the substrate. A fabric made of interwoven strands that includes fibers from which piezoelectric nanowires extend radially therefrom and conductive nanostructures extend therefrom is configured to generate electricity.

Scavenging high-voltage copper wire, a hazardous petty larceny.

PubMed

Himel, H N; Ahn, L C; Jones, K C; Edlich, R F

1992-01-01

With the current emphasis on recycling and the establishment of markets for sale of used copper wire, scavenging of copper wire from old buildings and equipment has become common. Although scavenging without permission constitutes theft, a more significant risk to the perpetrator is the potential for electrical burn injury in attempting to remove "hot" wire. A severe high-voltage electrical burn injury sustained while attempting to scavenge wire from an old house is reported. The circumstances surrounding the injury, the clinical management of the case, and the long-term consequences to the patient are presented and discussed.

Three-dimensional reconstruction of brain-wide wiring networks in Drosophila at single-cell resolution.

PubMed

Chiang, Ann-Shyn; Lin, Chih-Yung; Chuang, Chao-Chun; Chang, Hsiu-Ming; Hsieh, Chang-Huain; Yeh, Chang-Wei; Shih, Chi-Tin; Wu, Jian-Jheng; Wang, Guo-Tzau; Chen, Yung-Chang; Wu, Cheng-Chi; Chen, Guan-Yu; Ching, Yu-Tai; Lee, Ping-Chang; Lin, Chih-Yang; Lin, Hui-Hao; Wu, Chia-Chou; Hsu, Hao-Wei; Huang, Yun-Ann; Chen, Jing-Yi; Chiang, Hsin-Jung; Lu, Chun-Fang; Ni, Ru-Fen; Yeh, Chao-Yuan; Hwang, Jenn-Kang

2011-01-11

Animal behavior is governed by the activity of interconnected brain circuits. Comprehensive brain wiring maps are thus needed in order to formulate hypotheses about information flow and also to guide genetic manipulations aimed at understanding how genes and circuits orchestrate complex behaviors. To assemble this map, we deconstructed the adult Drosophila brain into approximately 16,000 single neurons and reconstructed them into a common standardized framework to produce a virtual fly brain. We have constructed a mesoscopic map and found that it consists of 41 local processing units (LPUs), six hubs, and 58 tracts covering the whole Drosophila brain. Despite individual local variation, the architecture of the Drosophila brain shows invariance for both the aggregation of local neurons (LNs) within specific LPUs and for the connectivity of projection neurons (PNs) between the same set of LPUs. An open-access image database, named FlyCircuit, has been constructed for online data archiving, mining, analysis, and three-dimensional visualization of all single neurons, brain-wide LPUs, their wiring diagrams, and neural tracts. We found that the Drosophila brain is assembled from families of multiple LPUs and their interconnections. This provides an essential first step in the analysis of information processing within and between neurons in a complete brain. Copyright © 2011 Elsevier Ltd. All rights reserved.

Electron Scattering at Surfaces of Epitaxial Metal Layers

NASA Astrophysics Data System (ADS)

Chawla, Jasmeet Singh

In the field of electron transport in metal films and wires, the 'size effect' refers to the increase in the resistivity of the films and wires as their critical dimensions (thickness of film, width and height of wires) approach or become less than the electron mean free path lambda, which is, for example, 39 nm for bulk copper at room temperature. This size-effect is currently of great concern to the semiconductor industry because the continued downscaling of feature sizes has already lead to Cu interconnect wires in this size effect regime, with a reported 2.5 times higher resistivity for 40 nm wide Cu wires than for bulk Cu. Silver is a possible alternate material for interconnect wires and titanium nitride is proposed as a gate metal in novel field-effect-transistors. Therefore, it is important to develop an understanding of how the growth, the surface morphology, and the microstructure of ultrathin (few nanometers) Cu, Ag and TiN layers affect their electrical properties. This dissertation aims to advance the scientific knowledge of electron scattering at surfaces (external surfaces and grain boundaries), that are, the primary reasons for the size-effect in metal conductors. The effect of surface and grain boundary scattering on the resistivity of Cu thin films and nanowires is separately quantified using (i) in situ transport measurements on single-crystal, atomically smooth Cu(001) layers, (ii) textured polycrystalline Cu(111) layers and patterned wires with independently varying grain size, thickness and line width, and (iii) in situ grown interfaces including Cu-Ta, Cu-MgO, Cu-vacuum and Cu-oxygen. In addition, the electron surface scattering is also measured in situ for single-crystal Ag(001), (111) twinned epitaxial Ag(001), and single-crystal TiN(001) layers. Cu(001), Ag(001), and TiN(001) layers with a minimum continuous thickness of 4, 3.5 and 1.8 nm, respectively, are grown by ultra-high vacuum magnetron sputter deposition on MgO(001) substrates with and without thin epitaxial TiN(001) wetting layers and are studied for structure, crystalline quality, surface morphology, density and composition by a combination of x-ray diffraction theta-2theta scans, o-rocking curves, pole figures, reciprocal space mapping, Rutherford backscattering, x-ray reflectometry and transmission electron microscopy. The TiN(001) surface suppresses Cu and Ag dewetting, yielding lower defect density, no twinning, and smaller surface roughness than if grown on MgO(001). Textured polycrystalline Cu(111) layers 25-50-nm-thick are deposited on a stack of 7.5-nm-Ta on SiO2/Si(001), and subsequent in situ annealing at 350°C followed by sputter etching in Ar plasma yields Cu layers with independently variable thickness and grain size. Cu nanowires, 75 to 350 nm wide, are fabricated from Cu layers with different average grain size using a subtractive patterning process. In situ electron transport measurements at room temperature in vacuum and at 77 K in liquid nitrogen for single-crystal Cu and Ag layers is consistent with the Fuchs-Sondheimer (FS) model and indicates specular scattering at the metal-vacuum boundary with an average specularity parameter p = 0.8 and 0.6, respectively. In contrast, layers measured ex situ show diffuse surface scattering due to sub-monolayer oxidation. Also, addition of Ta atoms on Cu(001) surface perturbs the smooth interface potential and results in completely diffuse scattering at the Cu-Ta interface, and in turn, a higher resistivity of single-crystal Cu layers. In situ exposure of Cu(001) layers to O2 between 10 -3 and 105 Pa-s results in a sequential increase, decrease and increase of the electrical resistance which is attributed to specular surface scattering for clean Cu(001) and for surfaces with a complete adsorbed monolayer, but diffuse scattering at partial coverage and after chemical oxidation. Electron transport measurements for polycrystalline Cu layers and wires show a 10-15% and 7-9% decrease in resistivity, respectively, when increasing the average lateral grain size by a factor of 1.8. The maximum resistivity decrease that can be achieved by increasing the grain size of polycrystalline Cu layers with an average grain size approximately ˜2.5x the layer thickness is 20-26%.

Optimized design of a low-resistance electrical conductor for the multimegahertz range

NASA Astrophysics Data System (ADS)

Kurs, André; Kesler, Morris; Johnson, Steven G.

2011-04-01

We propose a design for a conductive wire composed of several mutually insulated coaxial conducting shells. With the help of numerical optimization, it is possible to obtain electrical resistances significantly lower than those of a heavy-gauge copper wire or litz wire in the 2-20 MHz range. Moreover, much of the reduction in resistance can be achieved for just a few shells; in contrast, litz wire would need to contain ˜104 strands to perform comparably in this frequency range.

Space Station Freedom secondary power wiring requirements

NASA Technical Reports Server (NTRS)

Sawyer, C. R.

1994-01-01

Secondary power is produced by DDCU's (direct current to direct current converter units) and routed to and through secondary power distribution assemblies (SPDA's) to loads or tertiary distribution assemblies. This presentation outlines requirements of Space Station Freedom (SSF) EEE (electrical, electronic, and electromechanical) parts wire and the approved electrical wire and cable. The SSF PDRD (Program Definition and Requirements Document) language problems and resolution are reviewed. The cable routing to and from the SPDA's is presented as diagrams and the wire recommendations and characteristics are given.

Residential Wiring: Electrical Connections [and] Tools and Equipment.

ERIC Educational Resources Information Center

Texas A and M Univ., College Station. Vocational Instructional Services.

Intended for student use, this unit focuses on making good electrical splices and electrical connections, and discusses tools and equipment used in house wiring jobs. Specific areas covered in the connections section are types of splices, solder equipment and supplies, and solderless connectors (plastic caps, split bolt connectors, crimp-type…

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2013 CFR

2013-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2014 CFR

2014-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2011 CFR

2011-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

10 CFR 205.373 - Application procedures.

Code of Federal Regulations, 2012 CFR

2012-01-01

... interconnection: (i) Proposed location; (ii) Required thermal capacity or power transfer capability of the... interconnection: (i) Location; (ii) Thermal capacity of power transfer capability of interconnection facilities... DEPARTMENT OF ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports...

Spring control of wire harness loops

NASA Technical Reports Server (NTRS)

Curcio, P. J.

1979-01-01

Negator spring control guides wire harness between movable and fixed structure. It prevents electrical wire harness loop from jamming or being severed as wire moves in response to changes in position of aircraft rudder. Spring-loaded coiled cable controls wire loop regardless of rudder movement.

High precision electric gate for time-of-flight ion mass spectrometers

NASA Technical Reports Server (NTRS)

Sittler, Edward C. (Inventor)

2011-01-01

A time-of-flight mass spectrometer having a chamber with electrodes to generate an electric field in the chamber and electric gating for allowing ions with a predetermined mass and velocity into the electric field. The design uses a row of very thin parallel aligned wires that are pulsed in sequence so the ion can pass through the gap of two parallel plates, which are biased to prevent passage of the ion. This design by itself can provide a high mass resolution capability and a very precise start pulse for an ion mass spectrometer. Furthermore, the ion will only pass through the chamber if it is within a wire diameter of the first wire when it is pulsed and has the right speed so it is near all other wires when they are pulsed.

Development of practical high temperature superconducting wire for electric power application

NASA Technical Reports Server (NTRS)

Hawsey, Robert A.; Sokolowski, Robert S.; Haldar, Pradeep; Motowidlo, Leszek R.

1995-01-01

The technology of high temperature superconductivity has gone from beyond mere scientific curiousity into the manufacturing environment. Single lengths of multifilamentary wire are now produced that are over 200 meters long and that carry over 13 amperes at 77 K. Short-sample critical current densities approach 5 x 104 A/sq cm at 77 K. Conductor requirements such as high critical current density in a magnetic field, strain-tolerant sheathing materials, and other engineering properties are addressed. A new process for fabricating round BSCCO-2212 wire has produced wires with critical current densities as high as 165,000 A/sq cm at 4.2 K and 53,000 A/sq cm at 40 K. This process eliminates the costly, multiple pressing and rolling steps that are commonly used to develop texture in the wires. New multifilamentary wires with strengthened sheathing materials have shown improved yield strengths up to a factor of five better than those made with pure silver. Many electric power devices require the wire to be formed into coils for production of strong magnetic fields. Requirements for coils and magnets for electric power applications are described.

[Properties of NiTi wires with direct electric resistance heat treatment method in three-point bending tests].

PubMed

Wang, Hong-mei; Wang, Bang-kang; Ren, Chao-chao; Bai, Yu-xing

2011-03-01

To investigate the mechanical properties of Ni-Ti wires with direct electric resistance heat treatment (DERHT) method in three-point bending tests. Two superelastic Ni-Ti wires (wire A: Smart SE, wire B: SENTALLOY SE, 0.406 mm × 0.559 mm) and 2 heat-actived Ni-Ti wires (wire C: Smart SM, wire D: L&H TITAN, 0.406 mm × 0.559 mm) were selected. They were heat-treated using the DERHT method by a controlled electric current (6.36 A) applied for different period of time [0 (control), 1.0, 1.5, 2.0, 2.5 seconds). Then, a three-point bending test was performed under controlled temperature (37°C) to examine the relationships between the deflection and the load in the bending of wires. After DERHT treatment, the plateau in the force-deflection curve of superelastic Ni-Ti wires and heat-activated Ni-Ti wires were increased. When the wires were heated for 2.0 seconds and deflected to 1.5 mm, the loading force of A, B, C and D Ni-Ti wires increased from (3.85 ± 0.11), (3.62 ± 0.07), (3.28 ± 0.09), (2.91 ± 0.23) N to (4.33 ± 0.07), (4.07 ± 0.05), (4.52 ± 0.08), (3.27 ± 0.15) N respectively. DERHT method is very convenient for clinical use. It is possible to change the arch form and superelastic force of NiTi wires. The longer the heating time is, the more the superelastic characteristics of the wires are altered.

Droplet monitoring probe

NASA Technical Reports Server (NTRS)

Baughman, J. R.; Thys, P. C.

1973-01-01

A droplet monitoring system is disclosed for analysis of mixed-phase fluid flow in development of gas turbines. The system uses a probe comprising two electrical wires spaced a known distance apart and connected at one end to means for establishing a dc potential between the wires. A drop in the fluid stream momentarily contacting both wires simultaneously causes and electrical signal which is amplified, detected and counted.

Comparison of Superelasticity of Nickel Titanium Orthodontic Arch wires using Mechanical Tensile Testing and Correlating with Electrical Resistivity

PubMed Central

Sivaraj, Aravind

2013-01-01

Background: Application of light and continuous forces for optimum physiological response and least damage to the tooth supporting structures should be the primary aim of the orthodontist. Nickel titanium alloys with the properties of excellent spring back, super elasticity and wide range of action is one of the natural choices for the clinicians to achieve this goal. In recent periods, various wire manufacturers have come with a variety of wires exhibiting different properties. It is the duty of the clinician to select appropriate wires during various stages of treatment for excellent results. For achieving this evaluation of the properties of these wires is essential. Materials & Methods: This study is focussed on evaluating the super elastic property of eight groups of austenite active nickel titanium wires. Eight groups of archwires bought from eight different manufacturers were studied. These wires were tested through mechanical tensile testing and electrical resistivity methods. Results: Unloading curves were carefully assessed for superelastic behaviour on deactivation. Rankings of the wires tested were based primarily upon the unloading curve’s slope Conclusion: Ortho organisers wires ranked first and superior, followed by American Orthodontics and Ormco A wires. Morelli and GAClowland NiTi wires were ranked last. It can be concluded that the performance of these wires based on rankings should be further evaluated by clinical studies. How to cite this article: Sivaraj A. Comparison of Superelasticity of Nickel Titanium Orthodontic Arch wires using Mechanical Tensile Testing and Correlating with Electrical Resistivity. J Int Oral Health 2013; 5(3):1-12. PMID:24155596

Wire electric-discharge machining and other fabrication techniques

NASA Technical Reports Server (NTRS)

Morgan, W. H.

1983-01-01

Wire electric discharge machining and extrude honing were used to fabricate a two dimensional wing for cryogenic wind tunnel testing. Electric-discharge cutting is done with a moving wire electrode. The cut track is controlled by means of a punched-tape program and the cutting feed is regulated according to the progress of the work. Electric-discharge machining involves no contact with the work piece, and no mechanical force is exerted. Extrude hone is a process for honing finish-machined surfaces by the extrusion of an abrasive material (silly putty), which is forced through a restrictive fixture. The fabrication steps are described and production times are given.

Research on High Temperature Ceramic Insulation for Electrical Conductors

NASA Technical Reports Server (NTRS)

Kreidler, Eric R.; Bhallamudi, Vidya Praveen

2001-01-01

Three methods for applying ceramic coatings to wires were examined in depth and a fourth (chemical vapor deposition) was studied briefly. CVD coatings were not reported in the thesis because it was realized early in the study that the deposition rate of the coatings was too slow to be used in a commercial process. Of the methods reported in the thesis, slurry coating was the most promising. This method consists of slowly drawing a platinum wire through a thixotropic slurry of alumina in a vehicle composed of polyvinyl butyral, methyl ethyl ketone, and toluene. The coatings produced by this method were continuous and free of cracks after sintering. The sintered coatings crack when the wire is bent around sharp corners, but most of the coating remains in place and still provides electrical insulation between the wire and any metallic structure to which the wire may be attached. The coating thickness was 0.61 mm (16 micrometers). The electrical resistivity of the intact coating was 340 M-Ohm-cm at 800 C and 23 M-Ohm-cm at 1050 C. Therefore, these coatings more than meet the electrical requirements for use in turbine engines. Although adherence of the coating to the wire was generally excellent, a problem was noted in localized areas where the coating flaked off. Further work will be needed to obtain good coating adherence along the entire length of the wire. The next most promising coatings were made by electrophoretic deposition (EPD) of Al2O3 onto platinum wires, using mixtures of ethanol and acetone as the suspending liquid. These EPD coatings were made only on short lengths of wire because the coating is too fragile to allow spooling of the wire. The worst coatings were those made by electrophoretic deposition from aqueous suspensions. Continuous slurry coating of wire was achieved, but due to lack of suitable equipment, the wire had to be cut into short lengths for sintering.

Characteristics of the electrical explosion of fine metallic wires in vacuum

NASA Astrophysics Data System (ADS)

Wang, Kun; Shi, Zongqian; Shi, Yuanjie; Zhao, Zhigang

2017-09-01

The experimental investigations on the electrical explosion of aluminum, silver, tungsten and platinum wires are carried out. The dependence of the parameters related to the specific energy deposition on the primary material properties is investigated. The polyimide coatings are applied to enhance the energy deposition for the exploding wires with percent of vaporized energy less than unit. The characteristics of the exploding wires of different materials with and without insulating coatings are studied. The effect of wire length on the percent of vaporization energy for exploding coated wires is presented. A laser probe is employed to construct the shadowgraphy, schlieren and interferometry diagnostics. The optical diagnostics demonstrate the morphology of the exploding products and structure of the energy deposition. The influence of insulating coatings on different wire materials is analyzed. The expansion trajectories of the exploding wires without and with insulating coatings are estimated from the shadowgram. More specific energy is deposited into the coated wires of shorter wire length, leading to faster expanding velocity of the high-density products.

Concealed wire tracing apparatus

DOEpatents

Kronberg, J.W.

1994-05-31

An apparatus and method that combines a signal generator and a passive signal receiver to detect and record the path of partially or completely concealed electrical wiring without disturbing the concealing surface is disclosed. The signal generator applies a series of electrical pulses to the selected wiring of interest. The applied pulses create a magnetic field about the wiring that can be detected by a coil contained within the signal receiver. An audible output connected to the receiver and driven by the coil reflects the receivers position with respect to the wiring. The receivers audible signal is strongest when the receiver is directly above the wiring and the long axis of the receivers coil is parallel to the wiring. A marking means is mounted on the receiver to mark the location of the wiring as the receiver is directed over the wiring's concealing surface. Numerous marks made on various locations of the concealing surface will trace the path of the wiring of interest. 4 figs.

A one-pot gold seed-assisted synthesis of gold/platinum wire nanoassemblies and their enhanced electrocatalytic activity for the oxidation of oxalic acid

NASA Astrophysics Data System (ADS)

Bai, Juan; Fang, Chun-Long; Liu, Zong-Huai; Chen, Yu

2016-01-01

Three-dimensional (3D) noble metal nanoassemblies composed of one-dimensional (1D) nanowires have been attracting much interest due to the unique physical and chemical properties of 1D nanowires as well as the particular interconnected open-pore structure of 3D nanoassemblies. In this work, well-defined Au/Pt wire nanoassemblies were synthesized by using a facile NaBH4 reduction method in the presence of a branched form of polyethyleneimine (PEI). A study of the growth mechanism indicated the morphology of the final product to be highly related to the molecular structure of the polymeric amine. Also, the preferred Pt-on-Pt deposition contributed to the formation of the 1D Pt nanowires. The Au/Pt wire nanoassemblies were functionalized with PEI at the same time that these nanoassemblies were synthesized due to the strong N-Pt bond. The chemically functionalized Au/Pt wire nanoassemblies exhibited better electrocatalytic activity for the electro-oxidation of oxalic acid than did commercial Pt black.Three-dimensional (3D) noble metal nanoassemblies composed of one-dimensional (1D) nanowires have been attracting much interest due to the unique physical and chemical properties of 1D nanowires as well as the particular interconnected open-pore structure of 3D nanoassemblies. In this work, well-defined Au/Pt wire nanoassemblies were synthesized by using a facile NaBH4 reduction method in the presence of a branched form of polyethyleneimine (PEI). A study of the growth mechanism indicated the morphology of the final product to be highly related to the molecular structure of the polymeric amine. Also, the preferred Pt-on-Pt deposition contributed to the formation of the 1D Pt nanowires. The Au/Pt wire nanoassemblies were functionalized with PEI at the same time that these nanoassemblies were synthesized due to the strong N-Pt bond. The chemically functionalized Au/Pt wire nanoassemblies exhibited better electrocatalytic activity for the electro-oxidation of oxalic acid than did commercial Pt black. Electronic supplementary information (ESI) available: Experimental details and additional physical characterization. See DOI: 10.1039/c5nr08150e

Magnetic Calorimeter Arrays with High Sensor Inductance and Dense Wiring

NASA Astrophysics Data System (ADS)

Stevenson, T. R.; Balvin, M. A.; Bandler, S. R.; Devasia, A. M.; Nagler, P. C.; Smith, S. J.; Yoon, W.

2018-05-01

We describe prototype arrays of magnetically coupled microcalorimeters fabricated with an approach scalable to very large format arrays. The superconducting interconnections and sensor coils have sufficiently low inductance in the wiring and sufficiently high inductance in the coils in each pixel, to enable arrays containing greater than 4000 sensors and 100,000 X-ray absorbers to be used in future astrophysics missions such as Lynx. We have used projection lithography to create submicron patterns (e.g., 400 nm lines and spaces) in our niobium sensor coils and wiring, integrated with gold-erbium sensor films and gold X-ray absorbers. Our prototype devices will explore the device physics of metallic magnetic calorimeters as feature sizes are reduced to nanoscale.

76 FR 41659 - Airworthiness Directives; The Boeing Company Model 747 Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2011-07-15

...), which could result in electrical arcing between the wires and aluminum conduit and consequent fire or... pumps (if installed), which could result in electrical arcing between the wires and aluminum conduit and...

In-Situ Wire Damage Detection System

NASA Technical Reports Server (NTRS)

Jolley, Scott T. (Inventor); Gibson, Tracy L. (Inventor); Medelius, Pedro J. (Inventor); Roberson, Luke B. (Inventor); Tate, Lanetra C. (Inventor); Smith, Trent M. (Inventor); Williams, Martha K. (Inventor)

2014-01-01

An in-situ system for detecting damage in an electrically conductive wire. The system includes a substrate at least partially covered by a layer of electrically conductive material forming a continuous or non-continuous electrically conductive layer connected to an electrical signal generator adapted to delivering electrical signals to the electrically conductive layer. Data is received and processed to identify damage to the substrate or electrically conductive layer. The electrically conductive material may include metalized carbon fibers, a thin metal coating, a conductive polymer, carbon nanotubes, metal nanoparticles or a combination thereof.

Los Angeles FOT spread spectrum radio traffic signal interconnect evaluation task : final report on full deployment

DOT National Transportation Integrated Search

1998-10-01

The use of a spread spectrum radio network (SSRN) as an alternative to hard-wired communications between field equipment and the City of Los Angeless Automated Traffic Surveillance and Control (ATSAC) system has been investigated. The aim of using...

Flexible interconnects for fuel cell stacks

DOEpatents

Lenz, David J.; Chung, Brandon W.; Pham, Ai Quoc

2004-11-09

An interconnect that facilitates electrical connection and mechanical support with minimal mechanical stress for fuel cell stacks. The interconnects are flexible and provide mechanically robust fuel cell stacks with higher stack performance at lower cost. The flexible interconnects replace the prior rigid rib interconnects with flexible "fingers" or contact pads which will accommodate the imperfect flatness of the ceramic fuel cells. Also, the mechanical stress of stacked fuel cells will be smaller due to the flexibility of the fingers. The interconnects can be one-sided or double-sided.

Cables and crosstalk

NASA Astrophysics Data System (ADS)

Paul, Clayton R.

1991-06-01

Crosstalk is the unintentional electromagnetic coupling between circuits which are connected by parallel conductors that lie in close proximity to each other. Some examples are wires in cable harnesses or metallic lands on printed-circuit boards (PCB's). This unintended interaction between two or more circuits via their electromagnetic fields can cause interference problems. Signals from one circuit that couple to another circuit appear at the terminals of the devices that are interconnected by the wires. If these signals are of sufficient magnitude or spectral content, they may cause unintended operation of the device or a degradation in its performance. A summary of the standard models used for predicting crosstalk in various types of configurations is presented. The discussion focusses on the relative accuracies, regions of applicability, and computational complexity of the models. A simple explanation of the ability (or inability) of shielded wires and twisted pairs of wires to reduce the crosstalk is also given.

Nanopowder synthesis based on electric explosion technology

NASA Astrophysics Data System (ADS)

Kryzhevich, D. S.; Zolnikov, K. P.; Korchuganov, A. V.; Psakhie, S. G.

2017-10-01

A computer simulation of the bicomponent nanoparticle formation during the electric explosion of copper and nickel wires was carried out. The calculations were performed in the framework of the molecular dynamics method using many-body potentials of interatomic interaction. As a result of an electric explosion of dissimilar metal wires, bicomponent nanoparticles having different stoichiometry and a block structure can be formed. It is possible to control the process of destruction and the structure of the formed bicomponent nanoparticles by varying the distance between the wires and the loading parameters.

Review of effects of dielectric coatings on electrical exploding wires and Z pinches

NASA Astrophysics Data System (ADS)

Wu, Jian; Li, Xingwen; Li, Mo; Li, Yang; Qiu, Aici

2017-10-01

As the most powerful x-ray source in the laboratories, the wire array Z pinches have been of great relevance to inertial confinement fusions, laboratory astrophysics, and other high-energy density applications. In order to produce x-ray with greater power and higher efficiency, the dynamics of wire array has been investigated extensively, and various methods have been proposed to improve the implosion quality of the wire array. This review focuses on the experimental and theoretical investigations regarding the effects of the dielectric coatings on electrical exploding wires and Z pinches. Since the early 2000, the electrical wire explosion related to the first stage of the wire array Z pinches has been studied extensively, and the results indicated that the dielectric coatings can significantly increase the joule energy deposition into a wire in the initial stage, and even the corona free explosion of tungsten wires can be achieved. Recently, there is an increasing interest in the dynamics of insulated wire array Z pinches. By applying dielectric coatings, the ablation process is suppressed, the x-ray start time is delayed, and the possibility of multi-peak radiation is decreased. This review is organized by the evolution dynamics of wire array Z pinches, and a broad introduction to relevant scientific concepts and various other applications are presented. According to the current research status, the challenges, opportunities and further developments of Z pinch loads using dielectric coatings are proposed to further promote the researches and their applications.

Miniature, shielded electrical connector with strain relief

NASA Technical Reports Server (NTRS)

Diep, Chuong H. (Inventor)

2006-01-01

An electrical connector assembly includes a wire bundle having at least one wire with a metal shield surrounding at least a portion of the wire. The shield has an end portion and provides electromagnetic interference protection to the wire. A backshell includes a body and a cover secured to the body together defining an internal cavity with the wire at least partially arranged within the cavity. The backshell provides EMI protection for the portion of the wire bundle not covered by the shield. The backshell includes a hole in a wall of either the body or the cover with the end portion of the shield extending through the hole. The clamp is secured about the body and the cover with the end portion of the shield arranged between the clamp and the backshell grounding the shield to the backshell. The clamp forces the backshell into engagement with the wire bundle to provide strain relief for the wire bundle.

Electrical Arc Ignition Testing of Spacesuit Materials

NASA Technical Reports Server (NTRS)

Smith, Sarah; Gallus, Tim; Tapia, Susana; Ball, Elizabeth; Beeson, Harold

2006-01-01

A viewgraph presentation on electrical arc ignition testing of spacesuit materials is shown. The topics include: 1) Background; 2) Test Objectives; 3) Test Sample Materials; 4) Test Methods; 5) Scratch Test Objectives; 6) Cotton Scratch Test Video; 7) Scratch Test Results; 8) Entire Date Plot; 9) Closeup Data Plot; 10) Scratch Test Problems; 11) Poke Test Objectives; 12) Poke Test Results; 13) Poke Test Problems; 14) Wire-break Test Objectives; 15) Cotton Wire-Break Test Video; 16) High Speed Cotton Wire-break Test Video; 17) Typical Data Plot; 18) Closeup Data Plot; 19) Wire-break Test Results; 20) Wire-break Tests vs. Scratch Tests; 21) Urethane-coated Nylon; and 22) Moleskin.

The Electromagnetic Compatibility (EMC) Design Challenge for Scientific Spacecraft Powered by a Stirling Power Converter

NASA Technical Reports Server (NTRS)

Sargent, Noel B.

2001-01-01

A 55 We free-piston Stirling Technology Demonstration Convertor (TDC) has been tested as part of an evaluation to determine its feasibility as a means for significantly reducing the amount of radioactive material required compared to Radioisotope Thermoelectric Generators (RTGs) to support long-term space science missions. Measurements were made to quantify the low frequency magnetic and electric fields radiated from the Stirling's 80 Hertz (Hz) linear alternator and control electronics in order to determine the magnitude of reduction that will be required to protect sensitive field sensors aboard some science missions. One identified "Solar Probe" mission requires a 100 dB reduction in the low frequency magnetic field over typical military standard design limits, to protect its plasma wave sensor. This paper discusses the electromagnetic interference (EMI) control options relative to the physical design impacts for this power system, composed of 3 basic electrical elements. They are (1) the Stirling Power Convertor with its linear alternator, (2) the power switching and control electronics to convert the 90 V, 80 Hz alternator output to DC for the use of the spacecraft, and (3) the interconnecting wiring including any instrumentation to monitor and control items 1 and 2.

Free-Space Optical Interconnect Employing VCSEL Diodes

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Savich, Gregory R.; Torres, Heidi

2009-01-01

Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

NASA Technical Reports Server (NTRS)

Savich, Gregory R.

2004-01-01

The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.

Smart Wire Grid: Resisting Expectations

ScienceCinema

Ramsay, Stewart; Lowe, DeJim

2018-05-30

Smart Wire Grid's DSR technology (Discrete Series Reactor) can be quickly deployed on electrical transmission lines to create intelligent mesh networks capable of quickly rerouting electricity to get power where and when it's needed the most. With their recent ARPA-E funding, Smart Wire Grid has been able to move from prototype and field testing to building out a US manufacturing operation in just under a year.

New devices for flow measurements: Hot film and burial wire sensors, infrared imagery, liquid crystal, and piezo-electric model

NASA Technical Reports Server (NTRS)

Mcree, Griffith J., Jr.; Roberts, A. Sidney, Jr.

1991-01-01

An experimental program aimed at identifying areas in low speed aerodynamic research where infrared imaging systems can make significant contributions is discussed. Implementing a new technique, a long electrically heated wire was placed across a laminar flow. By measuring the temperature distribution along the wire with the IR imaging camera, the flow behavior was identified.

Joining characteristics of titanium-based orthodontic wires connected by laser and electrical welding methods.

PubMed

Matsunaga, Junko; Watanabe, Ikuya; Nakao, Noriko; Watanabe, Etsuko; Elshahawy, Waleed; Yoshida, Noriaki

2015-01-01

This study investigated the possibility of electrical and laser welding to connect titanium-based alloy (beta-titanium and nickel-titanium) wires and stainless-steel or cobalt-chromium alloy wires for fabrication of combination arch-wires. Four kinds of straight orthodontic rectangular wires (0.017 × 0.025 inch) were used: stainless-steel (S-S), cobalt-chromium (Co-Cr), beta-titanium alloy (β-Ti), and nickel-titanium (Ni-Ti). Homogeneous and heterogeneous end-to-end joints (15 mm long each) were made by electrical welding and laser welding. Non-welded wires (30 mm long) were also used as a control. Maximum loads at fracture (N) and elongation (%) were measured by conducting tensile test. The data (n = 10) were statistically analyzed using analysis of variance/Tukey test (P < 0.05).The S-S/S-S and Co-Cr/Co-Cr specimens showed significantly higher values of the maximum load (ML) at fracture and elongation (EL) than those of the Ni-Ti/Ni-Ti and β-Ti/β-Ti specimens for electrical welding and those of the S-S/S-S and Co-Cr/Co-Cr specimens welded by laser. On the other hand, the laser-welded Ni-Ti/Ni-Ti and β-Ti/β-Ti specimens exhibited higher values of the ML and EL compared to those of the corresponding specimens welded by electrical method. In the heterogeneously welded combinations, the electrically welded Ni-Ti/S-S, β-Ti/S-S and β-Ti/Co-Cr specimens showed significantly (P < 0.05) higher ML and EL than those of the corresponding specimens welded by laser. Electrical welding exhibited the higher values of maximum load at fracture and elongation for heterogeneously welded combinations than laser-welding.

Structural-Phase States of Fe-Cu and Fe-Ag Bimetallic Particles Produced by Electric Explosion of Two Wires

NASA Astrophysics Data System (ADS)

Lerner, M. I.; Bakina, O. V.; Pervikov, A. V.; Glazkova, E. A.; Lozhkomoev, A. S.; Vorozhtsov, A. B.

2018-05-01

X-ray phase analysis, transmission electron microscopy, and X-ray microanalysis were used to examine the structural-phase states of Fe-Cu and Fe-Ag bimetallic nanoparticles. The nanoparticles were obtained by the electric explosion of two twisted metal wires in argon atmosphere. It was demonstrated that the nanoparticles have the structure of Janus particles. Presence of the Janus particle structure in the samples indicates formation of binary melt under conditions of combined electric explosion of two wires. Phases based on supersaturated solid solutions were not found in the examined samples. The data obtained allow arguing that it is possible to achieve uniform mixing of the two-wire explosion products under the described experiment conditions.

Classical Hall Effect without Magnetic Field

NASA Astrophysics Data System (ADS)

Schade, Nicholas; Tao, Chiao-Yu; Schuster, David; Nagel, Sidney

We show that the sign and density of charge carriers in a material can be obtained without the presence of a magnetic field. This effect, analogous to the classical Hall effect, is due solely to the geometry of the current-carrying wire. When current flows, surface charges along the wire create small electric fields that direct the current to follow the path of the conductor. In a curved wire, the charge carriers must experience a centripetal force, which arises from an electric field perpendicular to the drift velocity. This electric field produces a potential difference between the sides of the wire that depends on the sign and density of the charge carriers. We experimentally investigate circuits made from superconductors or graphene to find evidence for this effect.

Structural-Phase States of Fe–Cu and Fe–Ag Bimetallic Particles Produced by Electric Explosion of Two Wires

NASA Astrophysics Data System (ADS)

Lerner, M. I.; Bakina, O. V.; Pervikov, A. V.; Glazkova, E. A.; Lozhkomoev, A. S.; Vorozhtsov, A. B.

2018-05-01

X-ray phase analysis, transmission electron microscopy, and X-ray microanalysis were used to examine the structural-phase states of Fe-Cu and Fe-Ag bimetallic nanoparticles. The nanoparticles were obtained by the electric explosion of two twisted metal wires in argon atmosphere. It was demonstrated that the nanoparticles have the structure of Janus particles. Presence of the Janus particle structure in the samples indicates formation of binary melt under conditions of combined electric explosion of two wires. Phases based on supersaturated solid solutions were not found in the examined samples. The data obtained allow arguing that it is possible to achieve uniform mixing of the two-wire explosion products under the described experiment conditions.

Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell

DOEpatents

Kuo, Lewis J. H.; Vora, Shailesh D.

1995-01-01

A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La.sub.1-x M.sub.x Cr.sub.1-y N.sub.y O.sub.3, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075-0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO).sub.12. (Al.sub.2 O.sub.3).sub.7 flux particles including Ca and Al dopant, and LaCrO.sub.3 interconnection particles, preferably undoped LaCrO.sub.3, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and, (C) heat treating the interconnection layer at from about 1200.degree. to 1350.degree. C. to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power.

Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell

DOEpatents

Kuo, L.J.H.; Vora, S.D.

1995-02-21

A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La{sub 1{minus}x}M{sub x}Cr{sub 1{minus}y}N{sub y}O{sub 3}, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075--0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO){sub 12}(Al{sub 2}O{sub 3}){sub 7} flux particles including Ca and Al dopant, and LaCrO{sub 3} interconnection particles, preferably undoped LaCrO{sub 3}, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and (C) heat treating the interconnection layer at from about 1,200 to 1,350 C to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power. 4 figs.

Electrical Resistivity of Wire Arc Sprayed Zn and Cu Coatings for In-Mold-Metal-Spraying

NASA Astrophysics Data System (ADS)

Bobzin, K.; Öte, M.; Knoch, M. A.; Liao, X.; Hopmann, Ch; Ochotta, P.

2018-06-01

Electrical functionalities can be integrated into plastic parts by integrating thermally sprayed metal coatings into the non-conductive base material. Thermally sprayed conducting tracks for power and signal transmission are one example. In this case, the electrical resistance or resistivity of the coatings should be investigated. Therefore, the electrical resistivity of wire arc sprayed Zn and Cu coatings has been investigated. In case of Zn coatings, spray distance, gas pressure and wire diameter could be identified as significant influencing parameters on the electrical resistivity. In contrast, process gas, gas pressure and voltage do have a significant influence on the electrical resistivity of Cu coatings. Through the use of the In-Mold-Metal-Spraying method (IMMS), thermal degradation can be avoided by transferring thermally sprayed coating from a mold insert onto the plastic part. Therefore, the influence of the transfer process on the electrical resistance of the coatings has also been investigated.

Sarawak-west Kalimantan interconnection study. Final report. Volume 3, appendices. Export trade information

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-01-06

The study, conducted by Sargent & Lundy, was funded by the U.S. Trade and Development Agency on behalf of the Sarawak Electricity Supply Corporation. The purpose of the project is to determine the feasibility of an interconnection of the electric power systems of Sarawak and West Kalimantan as is being done elsewhere in the region. The report presents technical and economic evaluations and assesses the realibility of the system after the interconnection. The study is divided into three volumes. This is Volume 3 and it contains the Appendices.

Improvisation of mechanical and electrical properties of Cu by reinforcing MWCNT using modified electro-co-deposition process

NASA Astrophysics Data System (ADS)

Belgamwar, Sachin U.; Sharma, N. N.

2018-04-01

Multi-walled Carbon nanotubes–copper (MWCNT/Cu) composite powders with variable MWCNT content were synthesized by modified electro-co-deposition method. The electro-co-deposited MWCNT/Cu powders were consolidated by conventional compaction and sintering process. The consolidated products were then hot rolled and cold drawn to fine wires. The MWCNT/Cu composite wire samples were characterized for electrical and mechanical properties. We have been able to achieve an increase of around 8% in electrical conductivity of the form wires repeatedly. It has been observed that there was gradual improvement in the properties with reinforcement of MWCNT in the copper matrix. The betterment of electrical property has been achieved with simultaneous improvement in mechanical properties of the wire. The yield strength of MWCNT/Cu composite wire was found to be four times and the tensile strength two times greater than that of pure copper. The improved properties are attributed to the proper distribution of MWCNTs in the copper matrix and excellent interfacial bonding between MWCNT and composite copper fabricated by the modified method.

30 CFR 57.12053 - Circuits powered from trolley wires.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Circuits powered from trolley wires. 57.12053... Electricity Surface and Underground § 57.12053 Circuits powered from trolley wires. Ground wires for lighting circuits powered from trolley wires shall be connected securely to the ground return circuit. Surface Only ...

30 CFR 57.12053 - Circuits powered from trolley wires.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Circuits powered from trolley wires. 57.12053... Electricity Surface and Underground § 57.12053 Circuits powered from trolley wires. Ground wires for lighting circuits powered from trolley wires shall be connected securely to the ground return circuit. Surface Only ...

Peculiarity of convergence of shock wave generated by underwater electrical explosion of ring-shaped wire

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shafer, D.; Toker, G. R.; Gurovich, V. Tz.

2013-05-15

Nanosecond timescale underwater electrical wire explosions of ring-shaped Cu wires were investigated using a pulsed generator with a current amplitude up to 50 kA. It was shown that this type of wire explosion results in the generation of a toroidal shock wave (SW). Time- and space-resolved optical diagnostics were used to determine azimuthal uniformity of the shock wave front and its velocity. It was found that the shock wave preserves its circular front shape in the range of radii 50μm

Stiffness Corrections for the Vibration Frequency of a Stretched Wire

ERIC Educational Resources Information Center

Hornung, H. G.; Durie, M. J.

1977-01-01

Discusses the need of introducing corrections due to wire stiffness arising from end constraints and wire axis distribution curvature in the measurement of ac electrical frequency by exciting transverse standing waves in a stretched steel wire. (SL)

Influence of Wire Electrical Discharge Machining (WEDM) process parameters on surface roughness

NASA Astrophysics Data System (ADS)

Yeakub Ali, Mohammad; Banu, Asfana; Abu Bakar, Mazilah

2018-01-01

In obtaining the best quality of engineering components, the quality of machined parts surface plays an important role. It improves the fatigue strength, wear resistance, and corrosion of workpiece. This paper investigates the effects of wire electrical discharge machining (WEDM) process parameters on surface roughness of stainless steel using distilled water as dielectric fluid and brass wire as tool electrode. The parameters selected are voltage open, wire speed, wire tension, voltage gap, and off time. Empirical model was developed for the estimation of surface roughness. The analysis revealed that off time has a major influence on surface roughness. The optimum machining parameters for minimum surface roughness were found to be at a 10 V open voltage, 2.84 μs off time, 12 m/min wire speed, 6.3 N wire tension, and 54.91 V voltage gap.

THERMAL RELAY DEVICE

DOEpatents

Murdoch, R.O.; Record, F.A.

1963-01-29

This invention relates to a fast-acting spring-loaded electrical switch which can break a 1500-volt circuit in one millisecond without arcing. In particular, a springloaded shorting bar is held in tension by a fusible wire. Passage of an electrical current pulse through the fusible wire breaks the fuse thereby releasing the shorting bar to open one and close another electrical circuit. (AEC)

A Study of Interior Wiring, Color Coding, and Switching Principles by Simulation and Practice.

ERIC Educational Resources Information Center

McCormick, B. G.; McCormick, Robert S.

After a preliminary introduction and a chapter on wiring and electricity safety procedures, this study text proceeds to offer a general coverage of single and polyphase alternating current electrical systems used to power factories, farms, small businesses, and homes. Electrical power, from its generation to its application, is discussed, with the…

Review of PREPA Technical Requirements for Interconnecting Wind and Solar Generation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gevorgian, Vahan; Booth, Sarah

2013-11-01

The Puerto Rico Electric Power Authority developed the minimum technical requirements for interconnection of wind turbine generation and photovoltaic power plants. NREL has conducted a review of these requirements based on generic technical aspects and electrical characteristics of wind and photovoltaic power plants, and on existing requirements from other utilities (both U.S. and European).

[Correlative interconnections between impulse activity of aminergic neurons of the brainstem and spectral components of electroencephalogram during action of bemitil].

PubMed

Kolotilova, O I; Pavlenko, V B; Koreniuk, I I; Kulychenko, O M; Fokina, Iu O

2007-01-01

Correlative interconnections between frequency of impulse activity of aminergic neurons and neocortex electrical activity during action of bemitil (50 mg/kg) were investigated in 5 cats. It was shown that bemitil affects correlations between frequency of impulses of aminergic neurons and electrical activity of neocortex.

49 CFR 393.28 - Wiring systems.

Code of Federal Regulations, 2011 CFR

2011-10-01

... 49 Transportation 5 2011-10-01 2011-10-01 false Wiring systems. 393.28 Section 393.28 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL MOTOR CARRIER SAFETY... NECESSARY FOR SAFE OPERATION Lamps, Reflective Devices, and Electrical Wiring § 393.28 Wiring systems...

49 CFR 393.28 - Wiring systems.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 49 Transportation 5 2013-10-01 2013-10-01 false Wiring systems. 393.28 Section 393.28 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL MOTOR CARRIER SAFETY... NECESSARY FOR SAFE OPERATION Lamps, Reflective Devices, and Electrical Wiring § 393.28 Wiring systems...

49 CFR 393.28 - Wiring systems.

Code of Federal Regulations, 2012 CFR

2012-10-01

... 49 Transportation 5 2012-10-01 2012-10-01 false Wiring systems. 393.28 Section 393.28 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL MOTOR CARRIER SAFETY... NECESSARY FOR SAFE OPERATION Lamps, Reflective Devices, and Electrical Wiring § 393.28 Wiring systems...

49 CFR 393.28 - Wiring systems.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 5 2010-10-01 2010-10-01 false Wiring systems. 393.28 Section 393.28 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL MOTOR CARRIER SAFETY... NECESSARY FOR SAFE OPERATION Lamps, Reflective Devices, and Electrical Wiring § 393.28 Wiring systems...

Carbon nanotube wires with continuous current rating exceeding 20 Amperes

NASA Astrophysics Data System (ADS)

Cress, Cory D.; Ganter, Matthew J.; Schauerman, Christopher M.; Soule, Karen; Rossi, Jamie E.; Lawlor, Colleen C.; Puchades, Ivan; Ubnoske, Stephen M.; Bucossi, Andrew R.; Landi, Brian J.

2017-07-01

A process to fabricate carbon nanotube (CNT) wires with diameters greater than 1 cm and continuous current carrying capability exceeding 20 A is demonstrated. Wires larger than 5 mm are formed using a multi-step radial densification process that begins with a densified CNT wire core followed by successive wrapping of additional CNT material to increase the wire size. This process allows for a wide range of wire diameters to be fabricated, with and without potassium tetrabromoaurate (KAuBr4) chemical doping, and the resulting electrical and thermal properties to be characterized. Electrical measurements are performed with on/off current steps to obtain the maximum current before reaching a peak CNT wire temperature of 100 °C and before failure, yielding values of instantaneous currents in excess of 45 A for KAuBr4 doped CNT wires with a diameter of 6 mm achieved prior to failure. The peak temperature of the wires at failure (˜530 °C) is correlated with the primary decomposition peak observed in thermal gravimetric analysis of a wire sample confirming that oxidation is the primary failure mode of CNT wires operated in air. The in operando stability of doped CNT wires is confirmed by monitoring the resistance and temperature, which remain largely unaltered over 40 days and 1 day for wires with 1.5 mm and 11.2 mm diameters, respectively. The 100 °C continuous current rating, or ampacity, is measured for a range of doped CNT wire diameters and corresponding linear mass densities ρL. To describe the results, a new form of the fuse-law, where the critical current is defined as I ∝ρL3 /4, is developed and shows good agreement with the experimental data. Ultimately, CNT wires are shown to be stable electrical conductors, with failure current densities in excess of 50 A in the case of a convectively cooled 11.2 mm doped CNT wire, and amenable for use in applications that have long-term, high-current demands.

Composite Ceramic Superconducting Wires for Electric Motor Applications

DTIC Science & Technology

1989-07-07

generators that have been built using NbTi superconducting wire at liquid 3 helium temperature (4.2*K). Most of these magnets , motors, and generators have...temperature superconductors. A magnetic diffusivity value cannot be rigorously determined for the superconductor in the superconducting state when flux jump...cv, FIRST ANNUAL REPORT FOR THE PROJECT "COMPOSITE CERAMIC SUPERCONDUCTING WIRES FOR ELECTRIC MOTOR APPLICATIONS" 2 PRIME CONTRACTOR CERAMICS PROCESS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Alderfer, B.; Eldridge, M.; Starrs, T.

Distributed power is modular electric generation or storage located close to the point of use. Based on interviews of distributed generation project proponents, this report reviews the barriers that distributed generators of electricity are encountering when attempting to interconnect to the electrical grid. Descriptions of 26 of 65 case studies are included in the report. The survey found and the report describes a wide range of technical, business-practice, and regulatory barriers to interconnection. An action plan for reducing the impact of these barriers is also included.

Electrically-pumped compact hybrid silicon microring lasers for optical interconnects.

PubMed

Liang, Di; Fiorentino, Marco; Okumura, Tadashi; Chang, Hsu-Hao; Spencer, Daryl T; Kuo, Ying-Hao; Fang, Alexander W; Dai, Daoxin; Beausoleil, Raymond G; Bowers, John E

2009-10-26

We demonstrate an electrically-pumped hybrid silicon microring laser fabricated by a self-aligned process. The compact structure (D = 50 microm) and small electrical and optical losses result in lasing threshold as low as 5.4 mA and up to 65 degrees C operation temperature in continuous-wave (cw) mode. The spectrum is single mode with large extinction ratio and small linewidth observed. Application as on-chip optical interconnects is discussed from a system perspective.

Dry and wet arc track propagation resistance testing

NASA Technical Reports Server (NTRS)

Beach, Rex

1995-01-01

The wet arc-propagation resistance test for wire insulation provides an assessment of the ability of an insulation to prevent damage in an electrical environment. Results of an arc-propagation test may vary slightly due to the method of arc initiation; therefore a standard test method must be selected to evaluate the general arc-propagation resistance characteristics of an insulation. This test method initiates an arc by dripping salt water over pre-damaged wires which creates a conductive path between the wires. The power supply, test current, circuit resistances, and other variables are optimized for testing 20 guage wires. The use of other wire sizes may require modifications to the test variables. The dry arc-propagation resistance test for wire insulation also provides an assessment of the ability of an insulation to prevent damage in an electrical arc environment. In service, electrical arcs may originate form a variety of factors including insulation deterioration, faulty installation, and chafing. Here too, a standard test method must be selected to evaluate the general arc-propagation resistance characteristics of an insulation. This test method initiates an arc with a vibrating blade. The test also evaluates the ability of the insulation to prevent further arc-propagation when the electrical arc is re-energized.

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2010-02-01

Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

75 FR 6020 - Electrical Interconnection of the Lower Snake River Wind Energy Project

Federal Register 2010, 2011, 2012, 2013, 2014

2010-02-05

... River Wind Energy Project AGENCY: Bonneville Power Administration (BPA), Department of Energy (DOE... (BPA) has decided to offer Puget Sound Energy Inc., a Large Generator Interconnection Agreement for... and Columbia counties, Washington. To interconnect the Wind Project, BPA will construct a new...

Findings from NASA's 2015-2017 Electric Sail Investigations

NASA Technical Reports Server (NTRS)

Wiegmann, Bruce. M.

2017-01-01

Electric Sail (E-Sail) propulsion systems will enable scientific spacecraft to obtain velocities of up to 10 astronomical units per year without expending any on-board propellant. The E-Sail propulsion is created from the interaction of a spacecraft's positively charged multi-kilometer-length conductor/s with protons that are present in the naturally occurring hypersonic solar wind. The protons are deflected via natural electrostatic repulsion forces from the Debye sheath that is formed around a charged wire in space, and this deflection of protons creates thrust or propulsion in the opposite direction. It is envisioned that this E-Sail propulsion system can provide propulsion throughout the solar system and to the heliosphere and beyond. Consistent with the concept of a "sail," no propellant is needed as electrostatic repulsion interactions between the naturally occurring solar wind protons and a positively charged wire creates the propulsion. The basic principle on which the Electric Sail operates is the exchange of momentum between an "electric sail" and solar wind, which continually flows radially away from the sun at speeds ranging from 300 to 700 kilometers per second. The "sail" consists of an array of long, charged wires which extend radially outward 10 to 30 kilometers from a slowly rotating spacecraft. Momentum is transferred from the solar wind to the array through the deflection of the positively charged solar wind protons by a high voltage potential applied to the wires. The thrust generated by an E-Sail is proportional to the area of the sail, which is given by the product of the total length of the wires and the effective wire diameter. The wire is approximately 0.1 millimeters in diameter. However, the effective diameter is determined by the distance the applied electric potential penetrates into space around the wire (on the order of 10 meters at 1 astronomical unit). As a result, the effective area over which protons are repelled is proportional to the size of the region of electric potential, or the plasma sheath region, surround the wires of the array. A large sheath is, therefore, beneficial to the generation of thrust. However, this benefit must be balanced with the additional fact that electron collection is proportional to sheath size. Electrons collected by the wire array must be injected back into the solar wind in order to maintain the potential on the wires - which requires power. The primary power requirement for E-Sail operation is, therefore, also proportional to sheath size.

Method for forming precision clockplate with pivot pins

DOEpatents

Wild, Ronald L [Albuquerque, NM

2010-06-01

Methods are disclosed for producing a precision clockplate with rotational bearing surfaces (e.g. pivot pins). The methods comprise providing an electrically conductive blank, conventionally machining oversize features comprising bearing surfaces into the blank, optionally machining of a relief on non-bearing surfaces, providing wire accesses adjacent to bearing surfaces, threading the wire of an electrical discharge machine through the accesses and finishing the bearing surfaces by wire electrical discharge machining. The methods have been shown to produce bearing surfaces of comparable dimension and tolerances as those produced by micro-machining methods such as LIGA, at reduced cost and complexity.

30 CFR 56.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Insulation and fittings for power wires and... MINES Electricity § 56.12008 Insulation and fittings for power wires and cables. Power wires and cables... insulated wires, other than cables, pass through metal frames, the holes shall be substantially bushed with...

30 CFR 56.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Insulation and fittings for power wires and... MINES Electricity § 56.12008 Insulation and fittings for power wires and cables. Power wires and cables... insulated wires, other than cables, pass through metal frames, the holes shall be substantially bushed with...

Release Resistant Electrical Interconnections For Mems Devices

DOEpatents

Peterson, Kenneth A.; Garrett, Stephen E.; Reber, Cathleen A.

2005-02-22

A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in-between the conductor and polysilicon pad. After the initial compression bond has been formed, subsequent heat treatment of the joint above 363 C creates a liquid eutectic phase at the bondline comprising gold plus approximately 3 wt % silicon, which, upon re-solidification, significantly improves the bond strength by reforming and enhancing the initial bond. This type of electrical interconnection is resistant to chemical attack from acids used for releasing MEMS elements (HF, HCL), thereby enabling the use of a "package-first, release-second" sequence for fabricating MEMS devices. Likewise, the bond strength of an Au--Ge compression bond may be increased by forming a transient liquid eutectic phase comprising Au-12 wt % Ge.

New design for a rotatory joint actuator made with shape memory alloy contractile wire

NASA Astrophysics Data System (ADS)

Wang, Guoping; Shahinpoor, Mohsen

1996-05-01

A design approach for a rotatory joint actuator using a contractile shape memory alloy (SMA) wire is presented and an example design is followed. In this example, the output torque of the actuator is 18 Newton-meters, and its angular range is 30 degrees. Compared with a SMA spring type actuating component, a SMA wire type actuating component uses less SMA material and uses less electrical energy when it is electrically powered. On the other hand, a SMA wire type actuating component must have a large SMA wire length to produce a required amount of angular rotation of the joint. When pulleys are used to arrange a lengthy SMA wire in a small space, the friction between pulleys and pins is introduced and the performance of the joint actuator is degenerated to some degree. The investigated joint actuator provides a good chance for developing powered orthoses with SMA actuators for disabled individuals. It can relieve the weight concern with hydraulic and motor-powered orthoses and the safety concern with motor-powered orthoses. When electrically powered, a SMA actuator has the disadvantage of low energy efficiency.

The fabrication of well-interconnected polycaprolactone/hydroxyapatite composite scaffolds, enhancing the exposure of hydroxyapatite using the wire-network molding technique.

PubMed

Cho, Yong Sang; Hong, Myoung Wha; Jeong, Hoon-Jin; Lee, Seung-Jae; Kim, Young Yul; Cho, Young-Sam

2017-11-01

In this study, the fabrication method was proposed for the well-interconnected polycaprolactone/hydroxyapatite composite scaffold with exposed hydroxyapatite using modified WNM technique. To characterize well-interconnected scaffolds in terms of hydroxyapatite exposure, several assessments were performed as follows: morphology, mechanical property, wettability, calcium ion release, and cell response assessments. The results of these assessments were compared with those of control scaffolds which were fabricated by precision extruding deposition (PED) apparatus. The control PED scaffolds have interconnected pores with nonexposed hydroxyapatite. Consequently, cell attachment of proposed WNM scaffold was improved by increased hydrophilicity and surface roughness of scaffold surface resulting from the exposure of hydroxyapatite particles and fabrication process using powders. Moreover, cell proliferation and differentiation of WNM scaffold were increased, because the exposure of hydroxyapatite particles may enhance cell adhesion and calcium ion release. © 2016 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater, 105B: 2315-2325, 2017. © 2016 Wiley Periodicals, Inc.

Accurate guide wire of lag screw placement in the intertrochanteric fractures: a technical note.

PubMed

Li, Jiang; Wang, Liao; Li, Xiaodong; Feng, Kai; Tang, Jian; Wang, Xiaoqing

2017-09-01

Cephalomedullary fixations are commonly used in the treatment of intertrochanteric fractures. In clinical practice, one of the difficulties is when we exit the guide wire in a wrong position of femoral neck and insert near the hole again, the guide wire often flow into the previous track. This study develops a surgical technique to direct the guide wire to slip away the previous track and slip into a right position. When guide wire is exited to the cortex of femoral, we let the wire in and out at the cortical layer for several times to enlarge the entry hole. After that, electric drill is inverted, rubbed and entered slowly at a right angle. When guide wire encountered new resistance, the electric drill is turned back instantly. This technique can help trauma and orthopedic surgeons to obtain precision placement of the lag screw after the first try is failed.

Investigation of factors affecting the heater wire method of calibrating fine wire thermocouples

NASA Technical Reports Server (NTRS)

Keshock, E. G.

1972-01-01

An analytical investigation was made of a transient method of calibrating fine wire thermocouples. The system consisted of a 10 mil diameter standard thermocouple (Pt, Pt-13% Rh) and an 0.8 mil diameter chromel-alumel thermocouple attached to a 20 mil diameter electrically heated platinum wire. The calibration procedure consisted of electrically heating the wire to approximately 2500 F within about a seven-second period in an environment approximating atmospheric conditions at 120,000 feet. Rapid periodic readout of the standard and fine wire thermocouple signals permitted a comparison of the two temperature indications. An analysis was performed which indicated that the temperature distortion at the heater wire produced by the thermocouple junctions appears to be of negligible magnitude. Consequently, the calibration technique appears to be basically sound, although several practical changes which appear desirable are presented and discussed. Additional investigation is warranted to evaluate radiation effects and transient response characteristics.

A user's manual for the Electromagnetic Surface Patch code: ESP version 3

NASA Technical Reports Server (NTRS)

Newman, E. H.; Dilsavor, R. L.

1987-01-01

This report serves as a user's manual for Version III of the Electromagnetic Surface Patch Code or ESP code. ESP is user-oriented, based on the method of moments (MM) for treating geometries consisting of an interconnection of thin wires and perfectly conducting polygonal plates. Wire/plate junctions must be about 0.1 lambda or more from any plate edge. Several plates may intersect along a common edge. Excitation may be by either a delta-gap voltage generator or by a plane wave. The thin wires may have finite conductivity and also may contain lumped loads. The code computes most of the usual quantities of interest such as current distribution, input impedance, radiation efficiency, mutual coupling, far zone gain patterns (both polarizations) and radar-cross-section (both/cross polarizations).

Method for making electro-fluidic connections in microfluidic devices

DOEpatents

Frye-Mason, Gregory C.; Martinez, David; Manginell, Ronald P.; Heller, Edwin J.; Chanchani, Rajen

2004-08-10

A method for forming electro-fluidic interconnections in microfluidic devices comprises forming an electrical connection between matching bond pads on a die containing an active electrical element and a microfluidic substrate and forming a fluidic seal ring that circumscribes the active electrical element and a fluidic feedthrough. Preferably, the electrical connection and the seal ring are formed in a single bonding step. The simple method is particularly useful for chemical microanalytical systems wherein a plurality of microanalytical components, such as a chemical preconcentrator, a gas chromatography column, and a surface acoustic wave detector, are fluidically interconnected on a hybrid microfluidic substrate having electrical connection to external support electronics.

AIN-Based Packaging for SiC High-Temperature Electronics

NASA Technical Reports Server (NTRS)

Savrun, Ender

2004-01-01

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Optical printed circuit board (O-PCB) and VLSI photonic integrated circuits: visions, challenges, and progresses

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, S. G.; O, B. H.; Park, S. G.; Noh, H. S.; Kim, K. H.; Song, S. H.

2006-09-01

A collective overview and review is presented on the original work conducted on the theory, design, fabrication, and in-tegration of micro/nano-scale optical wires and photonic devices for applications in a newly-conceived photonic systems called "optical printed circuit board" (O-PCBs) and "VLSI photonic integrated circuits" (VLSI-PIC). These are aimed for compact, high-speed, multi-functional, intelligent, light-weight, low-energy and environmentally friendly, low-cost, and high-volume applications to complement or surpass the capabilities of electrical PCBs (E-PCBs) and/or VLSI electronic integrated circuit (VLSI-IC) systems. These consist of 2-dimensional or 3-dimensional planar arrays of micro/nano-optical wires and circuits to perform the functions of all-optical sensing, storing, transporting, processing, switching, routing and distributing optical signals on flat modular boards or substrates. The integrated optical devices include micro/nano-scale waveguides, lasers, detectors, switches, sensors, directional couplers, multi-mode interference devices, ring-resonators, photonic crystal devices, plasmonic devices, and quantum devices, made of polymer, silicon and other semiconductor materials. For VLSI photonic integration, photonic crystals and plasmonic structures have been used. Scientific and technological issues concerning the processes of miniaturization, interconnection and integration of these systems as applicable to board-to-board, chip-to-chip, and intra-chip integration, are discussed along with applications for future computers, telecommunications, and sensor-systems. Visions and challenges toward these goals are also discussed.

REACH. Residential Electrical Wiring Units.

ERIC Educational Resources Information Center

Ansley, Jimmy; Ennis, Mike

As a part of the REACH (Refrigeration, Electro-Mechanical, Air-Conditioning, Heating) electromechanical cluster, this student manual contains individualized instructional units in the area of residential electrical wiring. The instructional units focus on grounded outlets, service entrance, and blueprint reading. Each unit follows a typical format…

7 CFR 1730.60 - General.

Code of Federal Regulations, 2010 CFR

2010-01-01

... ELECTRIC SYSTEM OPERATIONS AND MAINTENANCE Interconnection of Distributed Resources § 1730.60 General. Each... maintaining a written standard policy relating to the Interconnection of Distributed Resources (IDR) having an...

Oxidation of interconnect alloys in an electric field

DOE Office of Scientific and Technical Information (OSTI.GOV)

Holcomb, G.R.; Alman, D.E.; Adler, T.A.

The effect of an electric field on the oxidation of interconnect alloys was examined with a representative array of materials: an iron-base ferritic chromia former (E-brite), an iron-base ferritic chromia former with Mn and La (Crofer 22APU), a nickel-base chromia former (IN-718), and a nickelbase chromia former with Mn and La (Haynes 230). Environmental variables include temperature and oxygen partial pressure. The resulting scales were examined to determine if applied electrical current induces changes in mechanism or scale growth kinetics.

Aerogel-supported filament

DOEpatents

Wuest, Craig R.; Tillotson, Thomas M.; Johnson, III, Coleman V.

1995-01-01

The present invention is a thin filament embedded in a low density aerogel for use in radiation detection instruments and incandescent lamps. The aerogel provides a supportive matrix that is thermally and electrically nonconductive, mechanically strong, highly porous, gas-permeable, and transparent to ionizing radiation over short distances. A low density, open-cell aerogel is cast around a fine filament or wire, which allows the wire to be positioned with little or no tension and keeps the wire in place in the event of breakage. The aerogel support reduces the stresses on the wire caused by vibrational, gravitational, electrical, and mechanical forces.

Aerogel-supported filament

DOEpatents

Wuest, C.R.; Tillotson, T.M.; Johnson, C.V. III

1995-05-16

The present invention is a thin filament embedded in a low density aerogel for use in radiation detection instruments and incandescent lamps. The aerogel provides a supportive matrix that is thermally and electrically nonconductive, mechanically strong, highly porous, gas-permeable, and transparent to ionizing radiation over short distances. A low density, open-cell aerogel is cast around a fine filament or wire, which allows the wire to be positioned with little or no tension and keeps the wire in place in the event of breakage. The aerogel support reduces the stresses on the wire caused by vibrational, gravitational, electrical, and mechanical forces. 6 Figs.

Towards plant wires.

PubMed

Adamatzky, Andrew

2014-08-01

In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self-growing wetware circuits and devices, and integration of plant-based electronic components into future and emergent bio-hybrid systems. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

High-Performance Computing for the Electromagnetic Modeling and Simulation of Interconnects

NASA Technical Reports Server (NTRS)

Schutt-Aine, Jose E.

1996-01-01

The electromagnetic modeling of packages and interconnects plays a very important role in the design of high-speed digital circuits, and is most efficiently performed by using computer-aided design algorithms. In recent years, packaging has become a critical area in the design of high-speed communication systems and fast computers, and the importance of the software support for their development has increased accordingly. Throughout this project, our efforts have focused on the development of modeling and simulation techniques and algorithms that permit the fast computation of the electrical parameters of interconnects and the efficient simulation of their electrical performance.

Multiplex Superconducting Transmission Line for green power consolidation on a Smart Grid

NASA Astrophysics Data System (ADS)

McIntyre, P.; Gerity, J.; Kellams, J.; Sattarov, A.

2017-12-01

A multiplex superconducting transmission line (MSTL) is being developed for applications requiring interconnection of multi-MW electric power generation among a number of locations. MSTL consists of a cluster of many 2- or 3-conductor transmission lines within a coaxial cryostat envelope. Each line operates autonomously, so that the interconnection of multiple power loads can be done in a failure-tolerant network. Specifics of the electrical, mechanical, and cryogenic design are presented. The consolidation of transformation and conditioning and the failure-tolerant interconnects have the potential to offer important benefit for the green energy components of a Smart Grid.

Sarawak-west Kalimantan interconnection study. Final report. Volume 1, executive summary. Volume 2, main report. Export trade information

DOE Office of Scientific and Technical Information (OSTI.GOV)

NONE

1995-01-06

The study, conducted by Sargent & Lundy, was funded by the U.S. Trade and Development Agency on behalf of the Sarawak Electricity Supply Corporation. The purpose of the project is to determine the feasibility of an interconnection of the electric power systems of Sarawak and West Kalimantan as is being done elsewhere in the region. The report presents technical and economic evaluations and assesses the realibility of the system after the interconnection. The study is divided into three volumes. The report combines the Executive Summary (Volume 1) and the Main Report (Volume 2).

Thermal and Electrical Conductivity Measurements of Cda 510 Phosphor Bronze

NASA Astrophysics Data System (ADS)

Tuttle, J.; Canavan, E.; DiPirro, M.

2010-04-01

Many cryogenic systems use electrical cables containing phosphor bronze wire. While phosphor bronze's electrical and thermal conductivity values have been published, results vary among different phosphor bronze formulations. The James Webb Space Telescope (JWST) will use several phosphor bronze wire harnesses containing a specific formulation (CDA 510, annealed temper). These harnesses dominate the heat conducted into the JWST instrument stage, and approximately half of the harness conductance is due to the phosphor bronze wires. Since the JWST radiators are expected to keep the instruments at their operating temperature with limited cooling margin, it is important to know the thermal conductivity of the actual alloy being used. We describe an experiment that measured its electrical and thermal conductivity between 4 and 295 Kelvin.

3-D integrated heterogeneous intra-chip free-space optical interconnect.

PubMed

Ciftcioglu, Berkehan; Berman, Rebecca; Wang, Shang; Hu, Jianyun; Savidis, Ioannis; Jain, Manish; Moore, Duncan; Huang, Michael; Friedman, Eby G; Wicks, Gary; Wu, Hui

2012-02-13

This paper presents the first chip-scale demonstration of an intra-chip free-space optical interconnect (FSOI) we recently proposed. This interconnect system provides point-to-point free-space optical links between any two communication nodes, and hence constructs an all-to-all intra-chip communication fabric, which can be extended for inter-chip communications as well. Unlike electrical and other waveguide-based optical interconnects, FSOI exhibits low latency, high energy efficiency, and large bandwidth density, and hence can significantly improve the performance of future many-core chips. In this paper, we evaluate the performance of the proposed FSOI interconnect, and compare it to a waveguide-based optical interconnect with wavelength division multiplexing (WDM). It shows that the FSOI system can achieve significantly lower loss and higher energy efficiency than the WDM system, even with optimistic assumptions for the latter. A 1×1-cm2 chip prototype is fabricated on a germanium substrate with integrated photodetectors. Commercial 850-nm GaAs vertical-cavity-surface-emitting-lasers (VCSELs) and fabricated fused silica microlenses are 3-D integrated on top of the substrate. At 1.4-cm distance, the measured optical transmission loss is 5 dB, the crosstalk is less than -20 dB, and the electrical-to-electrical bandwidth is 3.3 GHz. The latter is mainly limited by the 5-GHz VCSEL.

Reconfigurable optical interconnections via dynamic computer-generated holograms

NASA Technical Reports Server (NTRS)

Liu, Hua-Kuang (Inventor); Zhou, Shaomin (Inventor)

1994-01-01

A system is proposed for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for largescale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

A MATHEMATICAL MODEL FOR CALCULATING ELECTRICAL CONDITIONS IN WIRE-DUCT ELECTROSTATIC PRECIPITATION DEVICES

EPA Science Inventory

The article reports the development of a new method of calculating electrical conditions in wire-duct electrostatic precipitation devices. The method, based on a numerical solution to the governing differential equations under a suitable choice of boundary conditions, accounts fo...

High tension electrical injury from a telephone receiver.

PubMed

Thomas, P C; Kumar, P

2001-08-01

A high tension (13000 V) electrical injury to a young man from telephone receiver is described. The current entered the telephone circuit due to contact with a high tension live wire running close to the telephone wire 2 km away from the site of incidence.

24 CFR 3280.801 - Scope.

Code of Federal Regulations, 2010 CFR

2010-04-01

... of the National Electrical Code must be followed for electrical installations in manufactured homes... provisions of this standard apply to manufactured homes intended for connection to a wiring system nominally... circuit wiring in manufactured homes. [40 FR 58752, Dec. 18, 1975. Redesignated at 44 FR 20679, Apr. 6...

78 FR 73239 - Small Generator Interconnection Agreements and Procedures

Federal Register 2010, 2011, 2012, 2013, 2014

2013-12-05

... distributed resources.\\35\\ Public Interest Organizations go on to state that: \\29\\ See, e.g., American Wind... Society and Wind on the Wires are referred to collectively as Public Interest Organizations in this Final...\\ Similarly, installed wind generation with a capacity of 20 MW or less has increased in the contiguous United...

Nested Neural Networks

NASA Technical Reports Server (NTRS)

Baram, Yoram

1992-01-01

Report presents analysis of nested neural networks, consisting of interconnected subnetworks. Analysis based on simplified mathematical models more appropriate for artificial electronic neural networks, partly applicable to biological neural networks. Nested structure allows for retrieval of individual subpatterns. Requires fewer wires and connection devices than fully connected networks, and allows for local reconstruction of damaged subnetworks without rewiring entire network.

Measurement of the geometric parameters of power contact wire based on binocular stereovision

NASA Astrophysics Data System (ADS)

Pan, Xue-Tao; Zhang, Ya-feng; Meng, Fei

2010-10-01

In the electrified railway power supply system, electric locomotive obtains power from the catenary's wire through the pantograph. Under the action of the pantograph, combined with various factors such as vibration, touch current, relative sliding speed, load, etc, the contact wire will produce mechanical wear and electrical wear. Thus, in electrified railway construction and daily operations, the geometric parameters such as line height, pull value, the width of wear surface must be under real-timely and non-contact detection. On the one hand, the safe operation of electric railways will be guaranteed; on the other hand, the wire endurance will be extended, and operating costs reduced. Based on the characteristics of the worn wires' image signal, the binocular stereo vision technology was applied for measurement of contact wire geometry parameters, a mathematical model of measurement of geometric parameters was derived, and the boundaries of the wound wire abrasion-point value were extracted by means of sub-pixel edge detection method based on the LOG operator with the least-squares fitting, thus measurements of the wire geometry parameters were realized. Principles were demonstrated through simulation experiments, and the experimental results show that the detection methods presented in this paper for measuring the accuracy, efficiency and convenience, etc. are close to or superior to the traditional measurements, which has laid a good foundation for the measurement system of geometric parameters for the contact wire of the development of binocular vision.

30 CFR 75.516 - Power wires; support.

Code of Federal Regulations, 2014 CFR

2014-07-01

... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.516 Power wires; support. [Statutory Provision] All power wires (except trailing cables on mobile equipment, specially designed cables... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Power wires; support. 75.516 Section 75.516...

30 CFR 75.516 - Power wires; support.

Code of Federal Regulations, 2012 CFR

2012-07-01

... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.516 Power wires; support. [Statutory Provision] All power wires (except trailing cables on mobile equipment, specially designed cables... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Power wires; support. 75.516 Section 75.516...

30 CFR 75.516 - Power wires; support.

Code of Federal Regulations, 2013 CFR

2013-07-01

... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.516 Power wires; support. [Statutory Provision] All power wires (except trailing cables on mobile equipment, specially designed cables... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Power wires; support. 75.516 Section 75.516...

30 CFR 77.508-1 - Lightning arresters; wires entering buildings.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Lightning arresters; wires entering buildings... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.508-1 Lightning arresters; wires entering buildings. Lightning arresters protecting exposed telephone wires entering buildings shall be provided at...

30 CFR 77.508-1 - Lightning arresters; wires entering buildings.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Lightning arresters; wires entering buildings... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.508-1 Lightning arresters; wires entering buildings. Lightning arresters protecting exposed telephone wires entering buildings shall be provided at...

30 CFR 75.516 - Power wires; support.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Power wires; support. 75.516 Section 75.516... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.516 Power wires; support. [Statutory Provision] All power wires (except trailing cables on mobile equipment, specially designed cables...

30 CFR 75.516 - Power wires; support.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Power wires; support. 75.516 Section 75.516... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Electrical Equipment-General § 75.516 Power wires; support. [Statutory Provision] All power wires (except trailing cables on mobile equipment, specially designed cables...

46 CFR 129.340 - Cable and wiring.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 46 Shipping 4 2010-10-01 2010-10-01 false Cable and wiring. 129.340 Section 129.340 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY (CONTINUED) OFFSHORE SUPPLY VESSELS ELECTRICAL INSTALLATIONS Power Sources and Distribution Systems § 129.340 Cable and wiring. (a) If individual wires, rather than...

30 CFR 77.508-1 - Lightning arresters; wires entering buildings.

Code of Federal Regulations, 2012 CFR

2012-07-01

... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Lightning arresters; wires entering buildings... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.508-1 Lightning arresters; wires entering buildings. Lightning arresters protecting exposed telephone wires entering buildings shall be provided at...

30 CFR 77.508-1 - Lightning arresters; wires entering buildings.

Code of Federal Regulations, 2014 CFR

2014-07-01

... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Lightning arresters; wires entering buildings... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.508-1 Lightning arresters; wires entering buildings. Lightning arresters protecting exposed telephone wires entering buildings shall be provided at...

30 CFR 77.508-1 - Lightning arresters; wires entering buildings.

Code of Federal Regulations, 2013 CFR

2013-07-01

... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Lightning arresters; wires entering buildings... OF UNDERGROUND COAL MINES Electrical Equipment-General § 77.508-1 Lightning arresters; wires entering buildings. Lightning arresters protecting exposed telephone wires entering buildings shall be provided at...

New Materials for the Repair of Polyimide Electrical Wire Insulation

NASA Technical Reports Server (NTRS)

2008-01-01

Two viable polyimide backbone materials have been identified that will allow the repair of polyimide electrical wire insulation found on the Space Shuttle and other aging aircraft. This identification is the outcome of ongoing efforts to assess the viability of using such polyimides and polyimide precursors (polyamic acids [PAAs]) as repair materials for aging polyimide electrical wire insulation. These repair materials were selected because they match the chemical makeup of the underlying wire insulation as closely as possible. This similarity allows for maximum compatibility, coupled with the outstanding physical properties of polyimides. The two polyimide backbone materials allow the polymer to be extremely flexible and to melt at low temperatures. A polymer chain end capping group that allows the polymer to crosslink into a nonflowable repair upon curing at around 200 C was also identified.

Remarks on the thermal stability of an Ohmic-heated nanowire

NASA Astrophysics Data System (ADS)

Timsit, Roland S.

2018-05-01

The rise in temperature of a wire made from specific materials, due to ohmic heating by a DC electrical current, may lead to uncontrollable thermal runaway with ensuing melting. Thermal runaway stems from a steep decrease with increasing temperature of the thermal conductivity of the conducting material and subsequent trapping of the ohmic heat in the wire, i.e., from the inability of the wire to dissipate the heat sufficiently quickly by conduction to the cooler ends of the wire. In this paper, we show that the theory used to evaluate the temperature of contacting surfaces in a bulk electrical contact may be applied to calculate the conditions for thermal runaway in a nanowire. Implications of this effect for electrical contacts are addressed. A possible implication for memory devices using ohmic-heated nanofilms or nanowires is also discussed.

Method for starting operation of a resistance melter

DOEpatents

Chapman, Christopher Charles

1977-01-01

A method for starting the operation of a resistance furnace, where heating occurs by passing a current through the charge between two furnace electrodes and the charge is a material which is essentially electrically nonconductive when in a solid physical state but which becomes more electrically conductive when in a molten physical state, by connecting electrical resistance heating wire between the furnace electrodes, placing the wire in contact with the charge material between the electrodes and passing a current through the wire to heat the wire to a temperature sufficient to melt the material between the furnace electrodes so that as the material melts, current begins to pass between the electrodes through the melted material, further heating and melting more material until all current between the electrodes passes through the charge material without the aid or presence of the resistance element.

Device for removing foreign objects from anatomic organs

NASA Technical Reports Server (NTRS)

Angulo, Earl D. (Inventor)

1992-01-01

A device is disclosed for removing foreign objects from anatomic organs such as the ear canal or throat. It has a housing shaped like a flashlight, an electrical power source such as a battery or AC power from a wall socket, and a tip extending from the housing. The tip has at least one wire loop made from a shape-memory-effect alloy, such as Nitinol, switchably connected to the electrical power source such that when electric current flows through the wire loop the wire loop heats up and returns to a previously programmed shape such as a curet or tweezers so as to facilitate removal of the foreign object.

Explosion symmetry improvement of polyimide-coated tungsten wire in vacuum on negative discharge facility

NASA Astrophysics Data System (ADS)

Li, Mo; Wu, Jian; Lu, Yihan; Li, Xingwen; Li, Yang; Qiu, Mengtong

2018-01-01

Tungsten wire explosion is very asymmetric when fast current rate and insulated coatings are both applied on negative discharge facility using a 24-mm-diameter cathode geometry, which is commonly used on mega-ampere facilities. It is inferred, based on an analytical treatment of the guiding center drift and COMSOL simulations, that the large negative radial electric field causes early voltage breakdown and terminates energy deposition into the wire core on the anode side of the wire. After the anode side is short circuited, the radial electric field along the wire surface on the cathode side will change its polarity and thus leading to additional energy deposition into the wire core. This change causes ˜10 times larger energy deposition and ˜14 times faster explosion velocity in the cathode side than the anode side. In order to reduce this asymmetry, a hollow cylindrical cathode geometry was used to reverse the polarity of radial electric field and was optimized to use on multi-MA facilities. In this case, fully vaporized polyimide-coated tungsten wire with great symmetry improvement was achieved with energy deposition of ˜8.8 eV/atom. The atomic and electronic density distributions for the two different load geometries were obtained by the double-wavelength measurement.

Ultralow-Noise Atomic-Scale Structures for Quantum Circuitry in Silicon.

PubMed

Shamim, Saquib; Weber, Bent; Thompson, Daniel W; Simmons, Michelle Y; Ghosh, Arindam

2016-09-14

The atomically precise doping of silicon with phosphorus (Si:P) using scanning tunneling microscopy (STM) promises ultimate miniaturization of field effect transistors. The one-dimensional (1D) Si:P nanowires are of particular interest, retaining exceptional conductivity down to the atomic scale, and are predicted as interconnects for a scalable silicon-based quantum computer. Here, we show that ultrathin Si:P nanowires form one of the most-stable electrical conductors, with the phenomenological Hooge parameter of low-frequency noise being as low as ≈10(-8) at 4.2 K, nearly 3 orders of magnitude lower than even carbon-nanotube-based 1D conductors. A in-built isolation from the surface charge fluctuations due to encapsulation of the wires within the epitaxial Si matrix is the dominant cause for the observed suppression of noise. Apart from quantum information technology, our results confirm the promising prospects for precision-doped Si:P structures in atomic-scale circuitry for the 11 nm technology node and beyond.

Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

PubMed Central

Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.

2013-01-01

A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

Development of termination and utilization concepts for flat conductor cables. Volume 2: Utilization of small gage wire round conductor cables

NASA Technical Reports Server (NTRS)

1972-01-01

The practical use of small-gage round wire for electrical wiring in manned air and space vehicle environments is discussed. The investigation consisted on a study of wire construction and candidate wire harness concepts, fabrication of small-gage wire harnesses, and verification of promising configurations by laboratory evaluation. The wire constructions selected for harness fabrication are described. Results of the laboratory evaluation are included.

77 FR 61593 - North American Natural Resources, Inc. Complainant v. PJM Interconnection, L.L.C, American...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-10-10

... DEPARTMENT OF ENERGY Federal Energy Regulatory Commission [Docket No. EL13-10-000] North American Natural Resources, Inc. Complainant v. PJM Interconnection, L.L.C, American Electric Power Service...), North American Natural Resource, Inc. (NSANR) filed a formal complaint against PJM Interconnection, L.L...

DOE Office of Scientific and Technical Information (OSTI.GOV)

Thomas, H. P.; Basso, T. S.; Kroposki, B.

The Department of Energy (DOE) Distributed Power Program (DPP) is conducting work to complete, validate in the field, and support the development of a national interconnection standard for distributed energy resources (DER), and to address the institutional and regulatory barriers slowing the commercial adoption of DER systems. This work includes support for the IEEE standards, including P1547 Standard for Interconnecting Distributed Resources with Electric Power Systems, P1589 Standard for Conformance Test Procedures for Equipment Interconnecting Distributed Resources with Electric Power Systems, and the P1608 Application Guide. Work is also in progress on system integration research and development (R&D) on themore » interface and control of DER with local energy systems. Additional efforts are supporting high-reliability power for industry, evaluating innovative concepts for DER applications, and exploring plug-and-play interface and control technologies for intelligent autonomous interconnection systems. This paper summarizes (1) the current status of the IEEE interconnection standards and application guides in support of DER, and (2) the R&D in progress at the National Renewable Energy Laboratory (NREL) for interconnection and system integration and application of distributed energy resources.« less

Extraction of temperature dependent electrical resistivity and thermal conductivity from silicon microwires self-heated to melting temperature

NASA Astrophysics Data System (ADS)

Bakan, Gokhan; Adnane, Lhacene; Gokirmak, Ali; Silva, Helena

2012-09-01

Temperature-dependent electrical resistivity, ρ(T), and thermal conductivity, k(T), of nanocrystalline silicon microwires self-heated to melt are extracted by matching simulated current-voltage (I-V) characteristics to experimental I-V characteristics. Electrical resistivity is extracted from highly doped p-type wires on silicon dioxide in which the heat losses are predominantly to the substrate and the self-heating depends mainly on ρ(T) of the wires. The extracted ρ(T) decreases from 11.8 mΩ cm at room-temperature to 5.2 mΩ cm at 1690 K, in reasonable agreement with the values measured up to ˜650 K. Electrical resistivity and thermal conductivity are extracted from suspended highly doped n-type silicon wires in which the heat losses are predominantly through the wires. In this case, measured ρ(T) (decreasing from 20.5 mΩ cm at room temperature to 12 mΩ cm at 620 K) is used to extract ρ(T) at higher temperatures (decreasing to 1 mΩ cm at 1690 K) and k(T) (decreasing from 30 W m-1 K-1 at room temperature to 20 W m-1 K-1 at 1690 K). The method is tested by using the extracted parameters to model wires with different dimensions. The experimental and simulated I-V curves for these wires show good agreement up to high voltage and temperature levels. This technique allows extraction of the electrical resistivity and thermal conductivity up to very high temperatures from self-heated microstructures.

30 CFR 57.12069 - Lightning protection for telephone wires and ungrounded conductors.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Lightning protection for telephone wires and... AND NONMETAL MINES Electricity Surface Only § 57.12069 Lightning protection for telephone wires and ungrounded conductors. Each ungrounded conductor or telephone wire that leads underground and is directly...

30 CFR 56.12069 - Lightning protection for telephone wires and ungrounded conductors.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Lightning protection for telephone wires and... NONMETAL MINES Electricity § 56.12069 Lightning protection for telephone wires and ungrounded conductors. Each ungrounded power conductor or telephone wire that leads underground and is directly exposed to...

30 CFR 57.12050 - Installation of trolley wires.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Installation of trolley wires. 57.12050 Section 57.12050 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND... Electricity Surface and Underground § 57.12050 Installation of trolley wires. Trolley wires shall be installed...

30 CFR 57.12050 - Installation of trolley wires.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Installation of trolley wires. 57.12050 Section 57.12050 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF LABOR METAL AND... Electricity Surface and Underground § 57.12050 Installation of trolley wires. Trolley wires shall be installed...

30 CFR 56.12069 - Lightning protection for telephone wires and ungrounded conductors.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Lightning protection for telephone wires and... NONMETAL MINES Electricity § 56.12069 Lightning protection for telephone wires and ungrounded conductors. Each ungrounded power conductor or telephone wire that leads underground and is directly exposed to...

30 CFR 57.12069 - Lightning protection for telephone wires and ungrounded conductors.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Lightning protection for telephone wires and... AND NONMETAL MINES Electricity Surface Only § 57.12069 Lightning protection for telephone wires and ungrounded conductors. Each ungrounded conductor or telephone wire that leads underground and is directly...

Simple circuit monitors "third wire" in ac lines

NASA Technical Reports Server (NTRS)

Kojima, T. T.; Stuck, D. E.

1980-01-01

Device detects interruption of ground connection in three-wire electrical equipment and shuts off ac power to prevent shock hazard. Silicon-controlled rectifiers detect floating ground, and deenergize optoelectric relays thereby breaking power connections. Circuit could be incorporated into hand tools, appliances, and other electrical equipment.

Vocational Preparation Curriculum: Electrical Wiring.

ERIC Educational Resources Information Center

Usoro, Hogan

This document is a curriculum guide for instructors teaching vocational preparation for electrical wiring to special needs students. The purpose of the curriculum guide is to provide minimum skills for disadvantaged and handicapped students entering the mainstream; to supplement vocational skills of those students already in a regular training…

Building Trades. Carpentry, Electrical Wiring, Plumbing.

ERIC Educational Resources Information Center

Missouri Univ., Columbia. Instructional Materials Lab.

This curriculum guide contains 21 units of self-paced, self-contained instructional materials in the complete building trades curriculum. It is divided into vocational areas of carpentry, electrical wiring, and plumbing. The purpose of the curriculum is to provide minimum skills for disadvantaged and handicapped students entering mainstream…

Freshwater Vulnerability beyond Local Water Stress: Heterogeneous Effects of Water-Electricity Nexus Across the Continental United States.

PubMed

Wang, Ranran; Zimmerman, Julie B; Wang, Chunyan; Font Vivanco, David; Hertwich, Edgar G

2017-09-05

Human health and economic prosperity are vulnerable to freshwater shortage in many parts of the world. Despite a growing literature that examines the freshwater vulnerability in various spatiotemporal contexts, existing knowledge has been conventionally constrained by a territorial perspective. On the basis of spatial analyses of monthly water and electricity flows across 2110 watersheds and three interconnected power systems, this study investigates the water-electricity nexus (WEN)'s transboundary effects on freshwater vulnerability in the continental United States in 2014. The effects are shown to be considerable and heterogeneous across time and space. For at least one month a year, 58 million people living in water-abundant watersheds were exposed to additional freshwater vulnerability by relying on electricity generated by freshwater-cooled thermal energy conversion cycles in highly stressed watersheds; for 72 million people living in highly stressed watersheds, their freshwater vulnerability was mitigated by using imported electricity generated in water-abundant watersheds or power plants running dry cooling or using nonfreshwater for cooling purposes. On the country scale, the mitigation effects were the most significant during September and October, while the additional freshwater vulnerability was more significant in February, March, and December. Due to the WEN's transboundary effects, overall, the freshwater vulnerability was slightly worsened within the Eastern Interconnection, substantially improved within the Western Interconnection, and least affected within the ERCOT Interconnection.

Second NASA Workshop on Wiring for Space Applications

NASA Technical Reports Server (NTRS)

1994-01-01

This document contains the proceedings of the Second NASA Workshop on Wiring for Space Applications held at NASA LeRC in Cleveland, OH, 6-7 Oct. 1993. The workshop was sponsored by NASA Headquarters Code QW Office of Safety and Mission Quality, Technical Standards Division and hosted by NASA LeRC, Power Technology Division, Electrical Components and Systems Branch. The workshop addressed key technology issues in the field of electrical power wiring for space applications. Speakers from government, industry, and academia presented and discussed topics on arc tracking phenomena, wiring system design, insulation constructions, and system protection. Presentation materials provided by the various speakers are included in this document.

Thermal and Electrical Conductivity Measurements of CDA 510 Phosphor Bronze

NASA Technical Reports Server (NTRS)

Tuttle, James E.; Canavan, Edgar; DiPirro, Michael

2009-01-01

Many cryogenic systems use electrical cables containing phosphor bronze wire. While phosphor bronze's electrical and thermal conductivity values have been published, there is significant variation among different phosphor bronze formulations. The James Webb Space Telescope (JWST) will use several phosphor bronze wire harnesses containing a specific formulation (CDA 510, annealed temper). The heat conducted into the JWST instrument stage is dominated by these harnesses, and approximately half of the harness conductance is due to the phosphor bronze wires. Since the JWST radiators are expected to just keep the instruments at their operating temperature with limited cooling margin, it is important to know the thermal conductivity of the actual alloy being used. We describe an experiment which measured the electrical and thermal conductivity of this material between 4 and 295 Kelvin.

Specification and testing for power by wire aircraft

NASA Technical Reports Server (NTRS)

Hansen, Irving G.; Kenney, Barbara H.

1993-01-01

A power by wire aircraft is one in which all active functions other than propulsion are implemented electrically. Other nomenclature are 'all electric airplane,' or 'more electric airplane.' What is involved is the task of developing and certifying electrical equipment to replace existing hydraulics and pneumatics. When such functions, however, are primary flight controls which are implemented electrically, new requirements are imposed that were not anticipated by existing power system designs. Standards of particular impact are the requirements of ultra-high reliability, high peak transient bi-directional power flow, and immunity to electromagnetic interference and lightning. Not only must the electromagnetic immunity of the total system be verifiable, but box level tests and meaningful system models must be established to allow system evaluation. This paper discusses some of the problems, the system modifications involved, and early results in establishing wiring harness and interface susceptibility requirements.

Low-Melt Poly(Amic Acids) and Polyimides and Their Uses

NASA Technical Reports Server (NTRS)

Parrish, Clyde F. (Inventor); Jolley, Scott T. (Inventor); Gibson, Tracy L. (Inventor); Williams, Martha K. (Inventor); Parks, Steven L. (Inventor)

2014-01-01

Provided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.

Low-Melt Poly(amic Acids) and Polyimides and Their Uses

NASA Technical Reports Server (NTRS)

Jolley, Scott T. (Inventor); Gibson, Tracy L. (Inventor); Williams, Martha K. (Inventor); Parrish, Clyde F. (Inventor); Parks, Steven L. (Inventor)

2015-01-01

Provided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.

Trade Electricity. Signal Wiring--Level 1. Standardized Curriculum.

ERIC Educational Resources Information Center

New York City Board of Education, Brooklyn, NY. Office of Occupational and Career Education.

This curriculum guide consists of nine modules on signal wiring, one of the three divisions of the standardized trade electricity curriculum in high schools in New York City. The modules cover the following subjects: bells, double contact pushbuttons, annunciator circuits, open circuit burglar alarms, closed circuit burglar alarms, fire alarms,…

77 FR 60653 - Airworthiness Directives; Airbus Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-10-04

... compartments, as applicable. Since we issued that AD, we have received reports that the installation has been..., electrical wiring, or other equipment located in the forward and aft cargo compartments. This damage could..., hydraulic system, electrical wiring, etc.), and therefore could have an impact on the safety of the flight...

Composite ceramic superconducting wires for electric motor applications

NASA Astrophysics Data System (ADS)

Holloran, John W.

1989-07-01

Progress is described on developing Y-123 wire for an HTSC motor. The wire development involves synthesis of Y-123 powder, spinning polymer containing green fiber, heat treating the fiber to produce metallized superconducting filaments, and characterizing the electrical properties. A melt spinning process was developed for producing 125-micron diameter green fiber containing 50 vol percent Y-123. This fiber can be braided for producing transposed multifilamentary wire. A process was developed to coat green fiber with silver alloys which can be continuous sintering. A second process for multifilamentary ribbon wire is also being developed. The Y-123 filaments have 77 deg self-field Jc values up to 2600 A/sq cm, but Jc is reduced to 10 A/cm squared at 800 G. Preliminary data is presented on mechanical properties. A dc homopolar motor with an iron magnetic circuit is being designed to operate with early HTSC wire.

Reconfigurable Optical Interconnections Via Dynamic Computer-Generated Holograms

NASA Technical Reports Server (NTRS)

Liu, Hua-Kuang (Inventor); Zhou, Shao-Min (Inventor)

1996-01-01

A system is presented for optically providing one-to-many irregular interconnections, and strength-adjustable many-to-many irregular interconnections which may be provided with strengths (weights) w(sub ij) using multiple laser beams which address multiple holograms and means for combining the beams modified by the holograms to form multiple interconnections, such as a cross-bar switching network. The optical means for interconnection is based on entering a series of complex computer-generated holograms on an electrically addressed spatial light modulator for real-time reconfigurations, thus providing flexibility for interconnection networks for large-scale practical use. By employing multiple sources and holograms, the number of interconnection patterns achieved is increased greatly.

Developing hydropower in Washington state. Volume 2: An electricity marketing manual

NASA Astrophysics Data System (ADS)

James, J. W.; McCoy, G. A.

1982-03-01

An electricity marketing manual for the potential small and micro-hydroelectric project developer within the state of Washington is presented. Public utility regulatory policies (PURPA) requires electric utilities to interconnect with and pay a rate based on their full avoided costs for the purchase of electrical output from qualifying small power production facilities. The determination of avoided costs, as business organizational considerations, utility interface concerns, interconnection requirements, metering options, and liability and wheeling are discussed. The utility responses are summarized, legislation which is of importance to hydropower developers and the powers and functions of the authorities responsible for enforcing the mandate of PURPA are described.

24 CFR 3280.808 - Wiring methods and materials.

Code of Federal Regulations, 2011 CFR

2011-04-01

... 24 Housing and Urban Development 5 2011-04-01 2011-04-01 false Wiring methods and materials. 3280... § 3280.808 Wiring methods and materials. (a) Except as specifically permitted by this part, the wiring methods and materials specified in the National Electrical Code, NFPA No. 70-2005, must be used in...

30 CFR 56.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2014 CFR

2014-07-01

... MINES Electricity § 56.12008 Insulation and fittings for power wires and cables. Power wires and cables... 30 Mineral Resources 1 2014-07-01 2014-07-01 false Insulation and fittings for power wires and cables. 56.12008 Section 56.12008 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF...

30 CFR 56.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2013 CFR

2013-07-01

... MINES Electricity § 56.12008 Insulation and fittings for power wires and cables. Power wires and cables... 30 Mineral Resources 1 2013-07-01 2013-07-01 false Insulation and fittings for power wires and cables. 56.12008 Section 56.12008 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF...

30 CFR 56.12008 - Insulation and fittings for power wires and cables.

Code of Federal Regulations, 2012 CFR

2012-07-01

... MINES Electricity § 56.12008 Insulation and fittings for power wires and cables. Power wires and cables... 30 Mineral Resources 1 2012-07-01 2012-07-01 false Insulation and fittings for power wires and cables. 56.12008 Section 56.12008 Mineral Resources MINE SAFETY AND HEALTH ADMINISTRATION, DEPARTMENT OF...

14 CFR Appendix F to Part 23 - Test Procedure

Code of Federal Regulations, 2011 CFR

2011-01-01

... materials used in electrical wire and cable insulation and in small parts, materials must be tested either... wire and cable insulation, the wire and cable specimens must be the same size as used in the airplane... specification (make and size) must be tested. The specimen of wire or cable (including insulation) must be...

30 CFR 77.515 - Bare signal or control wires; voltage.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Bare signal or control wires; voltage. 77.515... COAL MINES Electrical Equipment-General § 77.515 Bare signal or control wires; voltage. The voltage on bare signal or control wires accessible to personal contact shall not exceed 40 volts. ...

30 CFR 56.12066 - Guarding trolley wires and bare powerlines.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Guarding trolley wires and bare powerlines. 56... Electricity § 56.12066 Guarding trolley wires and bare powerlines. Where metallic tools or equipment can come in contact with trolley wires or bare powerlines, the lines shall be guarded or deenergized. ...

30 CFR 56.12066 - Guarding trolley wires and bare powerlines.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Guarding trolley wires and bare powerlines. 56... Electricity § 56.12066 Guarding trolley wires and bare powerlines. Where metallic tools or equipment can come in contact with trolley wires or bare powerlines, the lines shall be guarded or deenergized. ...

30 CFR 77.515 - Bare signal or control wires; voltage.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Bare signal or control wires; voltage. 77.515... COAL MINES Electrical Equipment-General § 77.515 Bare signal or control wires; voltage. The voltage on bare signal or control wires accessible to personal contact shall not exceed 40 volts. ...

30 CFR 57.12066 - Guarding trolley wires and bare powerlines.

Code of Federal Regulations, 2011 CFR

2011-07-01

... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Guarding trolley wires and bare powerlines. 57... MINES Electricity Surface Only § 57.12066 Guarding trolley wires and bare powerlines. Where metallic tools or equipment can come in contact with trolley wires or bare powerlines, the lines shall be guarded...

30 CFR 57.12066 - Guarding trolley wires and bare powerlines.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Guarding trolley wires and bare powerlines. 57... MINES Electricity Surface Only § 57.12066 Guarding trolley wires and bare powerlines. Where metallic tools or equipment can come in contact with trolley wires or bare powerlines, the lines shall be guarded...

Basic Wiring. Third Edition. Teacher Edition [and] Student Edition.

ERIC Educational Resources Information Center

Kaltwasser, Stan; Flowers, Gary; Blasingame, Don; Batson, Larry; Ipock, Dan; Carroll, Charles; Friesen, Wade; Fleming, Glenn

This publication contains both a teacher edition and a student edition of materials for a foundation course in an electrical wiring program. The course introduces basic concepts and skills that are prerequisites to residential wiring and commercial and industrial wiring courses. The contents of the materials are tied to measurable and observable…

Ultrasonics Equipped Crimp Tool: A New Technology for Aircraft Wiring Safety

NASA Technical Reports Server (NTRS)

Yost, William T.; Perey, Daniel F.; Cramer, Elliott

2006-01-01

We report on the development of a new measurement technique to quantitatively assess the condition of wire crimp connections. This ultrasonic (UT) method transmits high frequency sound waves through the joint under inspection. The wire-crimp region filters and scatters the ultrasonic energy as it passes through the crimp and wire. The resulting output (both time and frequency domains) provides a quantitative measure of the joint quality that is independent and unaffected by current. Crimps of poor mechanical and electrical quality will result in low temporal output and will distort the spectrum into unique and predictable patterns, depending on crimp "quality". This inexpensive, real-time measurement system can provide certification of crimps as they are made and recertification of existing wire crimps currently in service. The measurements for re-certification do not require that the wire be disconnected from its circuit. No other technology exists to measure in-situ the condition of wire joints (no electrical currents through the crimp are used in this analytical technique). We discuss the signals obtained from this instrument, and correlate these signals with destructive wire pull tests.

Emission of energetic protons from relativistic intensity laser interaction with a cone-wire target.

PubMed

Paradkar, B S; Yabuuchi, T; Sawada, H; Higginson, D P; Link, A; Wei, M S; Stephens, R B; Krasheninnikov, S I; Beg, F N

2012-11-01

Emission of energetic protons (maximum energy ∼18 MeV) from the interaction of relativistic intensity laser with a cone-wire target is experimentally measured and numerically simulated with hybrid particle-in-cell code, lsp [D. R. Welch et al., Phys. Plasmas 13, 063105 (2006)]. The protons originate from the wire attached to the cone after the OMEGA EP laser (670 J, 10 ps, 5 × 10^{18} W/cm^{2}) deposits its energy inside the cone. These protons are accelerated from the contaminant layer on the wire surface, and are measured in the radial direction, i.e., in a direction transverse to the wire length. Simulations show that the radial electric field, responsible for the proton acceleration, is excited by three factors, viz., (i) transverse momentum of the relativistic fast electrons beam entering into the wire, (ii) scattering of electrons inside the wire, and (iii) refluxing of escaped electrons by "fountain effect" at the end of the wire. The underlying physics of radial electric field and acceleration of protons is discussed.

H2-norm for mesh optimization with application to electro-thermal modeling of an electric wire in automotive context

NASA Astrophysics Data System (ADS)

Chevrié, Mathieu; Farges, Christophe; Sabatier, Jocelyn; Guillemard, Franck; Pradere, Laetitia

2017-04-01

In automotive application field, reducing electric conductors dimensions is significant to decrease the embedded mass and the manufacturing costs. It is thus essential to develop tools to optimize the wire diameter according to thermal constraints and protection algorithms to maintain a high level of safety. In order to develop such tools and algorithms, accurate electro-thermal models of electric wires are required. However, thermal equation solutions lead to implicit fractional transfer functions involving an exponential that cannot be embedded in a car calculator. This paper thus proposes an integer order transfer function approximation methodology based on a spatial discretization for this class of fractional transfer functions. Moreover, the H2-norm is used to minimize approximation error. Accuracy of the proposed approach is confirmed with measured data on a 1.5 mm2 wire implemented in a dedicated test bench.

Optimization of metals and plastics recovery from electric cable wastes using a plate-type electrostatic separator.

PubMed

Richard, Gontran; Touhami, Seddik; Zeghloul, Thami; Dascalescu, Lucien

2017-02-01

Plate-type electrostatic separators are commonly employed for the selective sorting of conductive and non-conductive granular materials. The aim of this work is to identify the optimal operating conditions of such equipment, when employed for separating copper and plastics from either flexible or rigid electric wire wastes. The experiments are performed according to the response surface methodology, on samples composed of either "calibrated" particles, obtained by manually cutting of electric wires at a predefined length (4mm), or actual machine-grinded scraps, characterized by a relatively-wide size distribution (1-4mm). The results point out the effect of particle size and shape on the effectiveness of the electrostatic separation. Different optimal operating conditions are found for flexible and rigid wires. A separate processing of the two classes of wire wastes is recommended. Copyright © 2016 Elsevier Ltd. All rights reserved.

Easily-wired toggle switch

NASA Technical Reports Server (NTRS)

Dean, W. T.; Stringer, E. J.

1979-01-01

Crimp-type connectors reduce assembly and disassembly time. With design, no switch preparation is necessary and socket contracts are crimped to wires inserted in module attached to back of toggle switch engaging pins inside module to make electrical connections. Wires are easily removed with standard detachment tool. Design can accommodate wires of any gage and as many terminals can be placed on switch as wire gage and switch dimensions will allow.

14 CFR 25.1715 - Electrical bonding and protection against static electricity: EWIS.

Code of Federal Regulations, 2012 CFR

2012-01-01

... static electricity: EWIS. 25.1715 Section 25.1715 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION... Interconnection Systems (EWIS) § 25.1715 Electrical bonding and protection against static electricity: EWIS. (a) EWIS components used for electrical bonding and protection against static electricity must meet the...

14 CFR 25.1715 - Electrical bonding and protection against static electricity: EWIS.

Code of Federal Regulations, 2011 CFR

2011-01-01

... static electricity: EWIS. 25.1715 Section 25.1715 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION... Interconnection Systems (EWIS) § 25.1715 Electrical bonding and protection against static electricity: EWIS. (a) EWIS components used for electrical bonding and protection against static electricity must meet the...

14 CFR 25.1715 - Electrical bonding and protection against static electricity: EWIS.

Code of Federal Regulations, 2010 CFR

2010-01-01

... static electricity: EWIS. 25.1715 Section 25.1715 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION... Interconnection Systems (EWIS) § 25.1715 Electrical bonding and protection against static electricity: EWIS. (a) EWIS components used for electrical bonding and protection against static electricity must meet the...

14 CFR 25.1715 - Electrical bonding and protection against static electricity: EWIS.

Code of Federal Regulations, 2013 CFR

2013-01-01

... static electricity: EWIS. 25.1715 Section 25.1715 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION... Interconnection Systems (EWIS) § 25.1715 Electrical bonding and protection against static electricity: EWIS. (a) EWIS components used for electrical bonding and protection against static electricity must meet the...

14 CFR 25.1715 - Electrical bonding and protection against static electricity: EWIS.

Code of Federal Regulations, 2014 CFR

2014-01-01

... static electricity: EWIS. 25.1715 Section 25.1715 Aeronautics and Space FEDERAL AVIATION ADMINISTRATION... Interconnection Systems (EWIS) § 25.1715 Electrical bonding and protection against static electricity: EWIS. (a) EWIS components used for electrical bonding and protection against static electricity must meet the...

Facile fabrication of wire-type indium gallium zinc oxide thin-film transistors applicable to ultrasensitive flexible sensors.

PubMed

Kim, Yeong-Gyu; Tak, Young Jun; Kim, Hee Jun; Kim, Won-Gi; Yoo, Hyukjoon; Kim, Hyun Jae

2018-04-03

We fabricated wire-type indium gallium zinc oxide (IGZO) thin-film transistors (TFTs) using a self-formed cracked template based on a lift-off process. The electrical characteristics of wire-type IGZO TFTs could be controlled by changing the width and density of IGZO wires through varying the coating conditions of template solution or multi-stacking additional layers. The fabricated wire-type devices were applied to sensors after functionalizing the surface. The wire-type pH sensor showed a sensitivity of 45.4 mV/pH, and this value was an improved sensitivity compared with that of the film-type device (27.6 mV/pH). Similarly, when the wire-type device was used as a glucose sensor, it showed more variation in electrical characteristics than the film-type device. The improved sensing properties resulted from the large surface area of the wire-type device compared with that of the film-type device. In addition, we fabricated wire-type IGZO TFTs on flexible substrates and confirmed that such structures were very resistant to mechanical stresses at a bending radius of 10 mm.

Electrothermal Action of the Pulse of the Current of a Short Artificial-Lightning Stroke on Test Specimens of Wires and Cables of Electric Power Objects

NASA Astrophysics Data System (ADS)

Baranov, M. I.; Rudakov, S. V.

2018-03-01

The authors have given results of investigations of the electrothermal action of aperiodic pulses of temporal shape 10/350 μs of the current of a short artificial-lightning stroke on test specimens of electric wires and cables with copper and aluminum cores and sheaths with polyvinylchloride and polyethylene insulations of power circuits of industrial electric power objects. It has been shown that the thermal stability of such wires and cables is determined by the action integral of the indicated current pulse. The authors have found the maximum permissible and critical densities of this pulse in copper and aluminum current-carrying parts of the wires and cables. High-current experiments conducted under high-voltage laboratory conditions on a unique generator of 10/350 μs pulses of an artificial-lightning current with amplitude-time parameters normalized according to the existing requirements of international and national standards and with tolerances on them have confirmed the reliability of the proposed calculated estimate for thermal lightning resistance of cabling and wiring products.

A semi-analytical study of positive corona discharge in wire-plane electrode configuration

NASA Astrophysics Data System (ADS)

Yanallah, K.; Pontiga, F.; Chen, J. H.

2013-08-01

Wire-to-plane positive corona discharge in air has been studied using an analytical model of two species (electrons and positive ions). The spatial distributions of electric field and charged species are obtained by integrating Gauss's law and the continuity equations of species along the Laplacian field lines. The experimental values of corona current intensity and applied voltage, together with Warburg's law, have been used to formulate the boundary condition for the electron density on the corona wire. To test the accuracy of the model, the approximate electric field distribution has been compared with the exact numerical solution obtained from a finite element analysis. A parametrical study of wire-to-plane corona discharge has then been undertaken using the approximate semi-analytical solutions. Thus, the spatial distributions of electric field and charged particles have been computed for different values of the gas pressure, wire radius and electrode separation. Also, the two dimensional distribution of ozone density has been obtained using a simplified plasma chemistry model. The approximate semi-analytical solutions can be evaluated in a negligible computational time, yet provide precise estimates of corona discharge variables.

Subcutaneous electrode structure

NASA Technical Reports Server (NTRS)

Lund, G. F. (Inventor)

1980-01-01

A subcutaneous electrode structure suitable for a chronic implant and for taking a low noise electrocardiogram of an active animal, comprises a thin inflexible, smooth disc of stainless steel having a diameter as of 5 to 30 mm, which is sutured in place to the animal being monitored. The disc electrode includes a radially directed slot extending in from the periphery of the disc for approximately 1/3 of the diameter. Electrical connection is made to the disc by means of a flexible lead wire that extends longitudinally of the slot and is woven through apertures in the disc and held at the terminal end by means of a spot welded tab. Within the slot, an electrically insulative sleeve, such as silicone rubber, is placed over the wire. The wire with the sleeve mounted thereon is captured in the plane of the disc and within the slot by means of crimping tabs extending laterally of the slot and over the insulative wire. The marginal lip of the slot area is apertured and an electrically insulative potting material such as silicone rubber, is potted in place overlaying the wire slot region and through the apertures.

Electrothermal Action of the Pulse of the Current of a Short Artificial-Lightning Stroke on Test Specimens of Wires and Cables of Electric Power Objects

NASA Astrophysics Data System (ADS)

Baranov, M. I.; Rudakov, S. V.

2018-05-01

The authors have given results of investigations of the electrothermal action of aperiodic pulses of temporal shape 10/350 μs of the current of a short artificial-lightning stroke on test specimens of electric wires and cables with copper and aluminum cores and sheaths with polyvinylchloride and polyethylene insulations of power circuits of industrial electric power objects. It has been shown that the thermal stability of such wires and cables is determined by the action integral of the indicated current pulse. The authors have found the maximum permissible and critical densities of this pulse in copper and aluminum current-carrying parts of the wires and cables. High-current experiments conducted under high-voltage laboratory conditions on a unique generator of 10/350 μs pulses of an artificial-lightning current with amplitude-time parameters normalized according to the existing requirements of international and national standards and with tolerances on them have confirmed the reliability of the proposed calculated estimate for thermal lightning resistance of cabling and wiring products.

Torsional bridge setup for the characterization of integrated circuits and microsensors under mechanical shear stress.

PubMed

Herrmann, M; Gieschke, P; Ruther, P; Paul, O

2011-12-01

We present a torsional bridge setup for the electro-mechanical characterization of devices integrated in the surface of silicon beams under mechanical in-plane shear stress. It is based on the application of a torsional moment to the longitudinal axis of the silicon beams, which results in a homogeneous in-plane shear stress in the beam surface. The safely applicable shear stresses span the range of ±50 MPa. Thanks to a specially designed clamping mechanism, the unintended normal stress typically stays below 2.5% of the applied shear stress. An analytical model is presented to compute the induced shear stress. Numerical computations verify the analytical results and show that the homogeneity of the shear stress is very high on the beam surface in the region of interest. Measurements with piezoresistive microsensors fabricated using a complementary metal-oxide-semiconductor process show an excellent agreement with both the computational results and comparative measurements performed on a four-point bending bridge. The electrical connection to the silicon beam is performed with standard bond wires. This ensures that minimal forces are applied to the beam by the electrical interconnection to the external instrumentation and that devices with arbitrary bond pad layout can be inserted into the setup.

Induced Voltage in an Open Wire

NASA Astrophysics Data System (ADS)

Morawetz, K.; Gilbert, M.; Trupp, A.

2017-07-01

A puzzle arising from Faraday's law has been considered and solved concerning the question which voltage will be induced in an open wire with a time-varying homogeneous magnetic field. In contrast to closed wires where the voltage is determined by the time variance of the magnetic field and the enclosed area, in an open wire we have to integrate the electric field along the wire. It is found that the longitudinal electric field with respect to the wave vector contributes with 1/3 and the transverse field with 2/3 to the induced voltage. In order to find the electric fields the sources of the magnetic fields are necessary to know. The representation of a spatially homogeneous and time-varying magnetic field implies unavoidably a certain symmetry point or symmetry line which depend on the geometry of the source. As a consequence the induced voltage of an open wire is found to be the area covered with respect to this symmetry line or point perpendicular to the magnetic field. This in turn allows to find the symmetry points of a magnetic field source by measuring the voltage of an open wire placed with different angles in the magnetic field. We present exactly solvable models of the Maxwell equations for a symmetry point and for a symmetry line, respectively. The results are applicable to open circuit problems like corrosion and for astrophysical applications.

76 FR 53326 - Airworthiness Directives; Eurocopter France (ECF) Model EC120B Helicopters

Federal Register 2010, 2011, 2012, 2013, 2014

2011-08-26

... also requires modifying the emergency switch electrical wiring and performing tests to ensure correct... the RFM after modifying the emergency switch electrical wiring and performing tests to ensure correct... likely to exist or develop on other helicopters of the same type design. Differences Between This AD and...

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2012-01-01

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

Unusual self-electrocution simulating judicial electrocution by an adolescent.

PubMed

Murty, O P

2008-06-01

Electrocution is one of the rarest modes of suicide. In this case, one school going adolescent committed suicide by electrocution using bare electric wire. This is a rare case of suicidal death by applying live wires around the wrists, simulating the act of judicial electrocution. He positioned himself on armed chair and placed the nude wire loops from a cable around both wrists and switched on the current by plugging in to nearest socket by foot. There were linear electric contact wounds completely encircling around the both wrists. In addition to these linear electric burns all around wrists, there were electrical burns over both hands. This death highlights the need of supervision and close watch on children for self-destructing activities and behavior. This case also highlights unusual method adopted by adolescent to end his life.

Flywheel system using wire-wound rotor

DOEpatents

Chiao, Edward Young; Bender, Donald Arthur; Means, Andrew E.; Snyder, Philip K.

2016-06-07

A flywheel is described having a rotor constructed of wire wound onto a central form. The wire is prestressed, thus mitigating stresses that occur during operation. In another aspect, the flywheel incorporates a low-loss motor using electrically non-conducting permanent magnets.

Microfabricated structures with electrical isolation and interconnections

NASA Technical Reports Server (NTRS)

Clark, William A. (Inventor); Juneau, Thor N. (Inventor); Roessig, Allen W. (Inventor); Lemkin, Mark A. (Inventor)

2001-01-01

The invention is directed to a microfabricated device. The device includes a substrate that is etched to define mechanical structures at least some of which are anchored laterally to the remainder of the substrate. Electrical isolation at points where mechanical structures are attached to the substrate is provided by filled isolation trenches. Filled trenches may also be used to electrically isolate structure elements from each other at points where mechanical attachment of structure elements is desired. The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and circuits except where electrical interconnection is desired.

Avionics electromagnetic interference immunity and environment

NASA Technical Reports Server (NTRS)

Clarke, C. A.

1986-01-01

Aircraft electromagnetic spectrum and radio frequency (RF) field strengths are charted, profiling the higher levels of electromagnetic voltages encountered by the commercial aircraft wiring. Selected military, urban, and rural electromagnetic field levels are plotted and provide a comparison of radiation amplitudes. Low frequency magnetic fields and electric fields from 400 H(Z) power systems are charted versus frequency and wire separation to indicate induced voltages on adjacent or neighboring circuits. Induced EMI levels and attenuation characteristics of electric, magnetic, RF fields, and transients are plotted and graphed for common types of wire circuits. The significance of wire circuit returns and shielding is emphasized to highlight the techniques that help block the paths of electromagnetic interference and maintain avionic interface signal quality.

First NASA Workshop on Wiring for Space Applications

NASA Technical Reports Server (NTRS)

Hammond, Ahmad (Compiler); Stavnes, Mark W. (Compiler)

1994-01-01

This document contains the proceedings of the First NASA Workshop on Wiring for Space Applications held at NASA Lewis Research Center in Cleveland, OH, July 23-24, 1991. The workshop was sponsored by NASA Headquarters Code QE Office of Safety and Mission Quality, Technical Standards Division and hosted by the NASA Lewis Research Center, Power Technology Division, Electrical Components and Systems Branch. The workshop addressed key technology issues in the field of electrical power wiring for space applications. Speakers from government, industry and academia presented and discussed topics on arc tracking phenomena, wiring applications and requirements, and new candidate insulation materials and constructions. Presentation materials provided by the various speakers are included in this document.

METAL SPRAYER FOR USE IN VACUUM OR INERT ATMOSPHERE

DOEpatents

Monroe, R.E.

1958-10-14

A metal sprayer is described for use in a vacuum or inert atmosphere with a straight line wire feed and variable electrode contact angle. This apparatus comprises two wires which are fed through straight tubes of two mechanisms positioned on opposite sides of a central tube to which an inert gas is fed. The two mechanisms and the wires being fed constitute electrodes to which electrical current is supplied so that the wires are melted by the electric are formed at their contacting region and sprayed by the gas supplied by the central tube. This apparatus is designed specifically to apply a zirconium coating to uranium in an inert atmosphere and without the use of an oxidizing flame.

In Situ Electrochemical Deposition of Microscopic Wires

NASA Technical Reports Server (NTRS)

Yun, Minhee; Myung, Nosang; Vasquez, Richard

2005-01-01

A method of fabrication of wires having micron and submicron dimensions is built around electrochemical deposition of the wires in their final positions between electrodes in integrated circuits or other devices in which the wires are to be used. Heretofore, nanowires have been fabricated by a variety of techniques characterized by low degrees of controllability and low throughput rates, and it has been necessary to align and electrically connect the wires in their final positions by use of sophisticated equipment in expensive and tedious post-growth assembly processes. The present method is more economical, offers higher yields, enables control of wire widths, and eliminates the need for post-growth assembly. The wires fabricated by this method could be used as simple electrical conductors or as transducers in sensors. Depending upon electrodeposition conditions and the compositions of the electroplating solutions in specific applications, the wires could be made of metals, alloys, metal oxides, semiconductors, or electrically conductive polymers. In this method, one uses fabrication processes that are standard in the semiconductor industry. These include cleaning, dry etching, low-pressure chemical vapor deposition, lithography, dielectric deposition, electron-beam lithography, and metallization processes as well as the electrochemical deposition process used to form the wires. In a typical case of fabrication of a circuit that includes electrodes between which microscopic wires are to be formed on a silicon substrate, the fabrication processes follow a standard sequence until just before the fabrication of the microscopic wires. Then, by use of a thermal SiO-deposition technique, the electrodes and the substrate surface areas in the gaps between them are covered with SiO. Next, the SiO is electron-beam patterned, then reactive-ion etched to form channels having specified widths (typically about 1 m or less) that define the widths of the wires to be formed. Drops of an electroplating solution are placed on the substrate in the regions containing the channels thus formed, then the wires are electrodeposited from the solution onto the exposed portions of the electrodes and into the channels. The electrodeposition is a room-temperature, atmospheric-pressure process. The figure shows an example of palladium wires that were electrodeposited into 1-mm-wide channels between gold electrodes.

Pre-wired systems prove their worth.

PubMed

2012-03-01

The 'new generation' of modular wiring systems from Apex Wiring Solutions have been specified for two of the world's foremost teaching hospitals - the Royal London and St Bartholomew's Hospital, as part of a pounds sterling 1 billion redevelopment project, to cut electrical installation times, reduce on-site waste, and provide a pre-wired, factory-tested, power and lighting system. HEJ reports.

Electric network interconnection of Mashreq Arab Countries

DOE Office of Scientific and Technical Information (OSTI.GOV)

El-Amin, I.M.; Al-Shehri, A.M.; Opoku, G.

1994-12-01

Power system interconnection is a well established practice for a variety of technical and economical reasons. Several interconnected networks exist worldwide for a number of factors. Some of these networks cross international boundaries. This presentation discusses the future developments of the power systems of Mashreq Arab Countries (MAC). MAC consists of Bahrain, Egypt, Iraq, Jordan, Kuwait, Lebanon, Oman, Qatar, Saudi Arabia, United Arab Emirates (UAE), and Yemen. Mac power systems are operated by government or semigovernment bodies. Many of these countries have national or regional electric grids but are generally isolated from each other. With the exception of Saudi Arabiamore » power systems, which employ 60 Hz, all other MAC utilities use 50 Hz frequency. Each country is served by one utility, except Saudi Arabia, which is served by four major utilities and some smaller utilities serving remote towns and small load centers. The major utilities are the Saudi Consolidated electric Company in the Eastern Province (SCECO East), SCECO Center, SCECO West, and SCECO South. These are the ones considered in this study. The energy resources in MAC are varied. Countries such as Egypt, Iraq, and Syria have significant hydro resources.The gulf countries and Iraq have abundant fossil fuel, The variation in energy resources as well as the characteristics of the electric load make it essential to look into interconnections beyond the national boundaries. Most of the existing or planned interconnections involve few power systems. A study involving 12 countries and over 20 utilities with different characteristics represents a very large scale undertaking.« less

Wiring economy and volume exclusion determine neuronal placement in the Drosophila brain.

PubMed

Rivera-Alba, Marta; Vitaladevuni, Shiv N; Mishchenko, Yuriy; Mischenko, Yuriy; Lu, Zhiyuan; Takemura, Shin-Ya; Scheffer, Lou; Meinertzhagen, Ian A; Chklovskii, Dmitri B; de Polavieja, Gonzalo G

2011-12-06

Wiring economy has successfully explained the individual placement of neurons in simple nervous systems like that of Caenorhabditis elegans [1-3] and the locations of coarser structures like cortical areas in complex vertebrate brains [4]. However, it remains unclear whether wiring economy can explain the placement of individual neurons in brains larger than that of C. elegans. Indeed, given the greater number of neuronal interconnections in larger brains, simply minimizing the length of connections results in unrealistic configurations, with multiple neurons occupying the same position in space. Avoiding such configurations, or volume exclusion, repels neurons from each other, thus counteracting wiring economy. Here we test whether wiring economy together with volume exclusion can explain the placement of neurons in a module of the Drosophila melanogaster brain known as lamina cartridge [5-13]. We used newly developed techniques for semiautomated reconstruction from serial electron microscopy (EM) [14] to obtain the shapes of neurons, the location of synapses, and the resultant synaptic connectivity. We show that wiring length minimization and volume exclusion together can explain the structure of the lamina microcircuit. Therefore, even in brains larger than that of C. elegans, at least for some circuits, optimization can play an important role in individual neuron placement. Copyright © 2011 Elsevier Ltd. All rights reserved.

Thermo-electric analysis of the interconnection of the LHC main superconducting bus bars

NASA Astrophysics Data System (ADS)

Granieri, P. P.; Breschi, M.; Casali, M.; Bottura, L.; Siemko, A.

2013-01-01

Spurred by the question of the maximum allowable energy for the operation of the Large Hadron Collider (LHC), we have progressed in the understanding of the thermo-electric behavior of the 13 kA superconducting bus bars interconnecting its main magnets. A deep insight of the underlying mechanisms is required to ensure the protection of the accelerator against undesired effects of resistive transitions. This is especially important in case of defective interconnections which can jeopardize the operation of the whole LHC. In this paper we present a numerical model of the interconnections between the main dipole and quadrupole magnets, validated against experimental tests of an interconnection sample with a purposely built-in defect. We consider defective interconnections featuring a lack of bonding among the superconducting cables and the copper stabilizer components, such as those that could be present in the machine. We evaluate the critical defect length limiting the maximum allowable current for powering the magnets. We determine the dependence of the critical defect length on different parameters as the heat transfer towards the cooling helium bath, the quality of manufacturing, the operating conditions and the protection system parameters, and discuss the relevant mechanisms.

Optical interconnections and networks; Proceedings of the Meeting, The Hague, Netherlands, Mar. 14, 15, 1990

NASA Technical Reports Server (NTRS)

Bartelt, Hartmut (Editor)

1990-01-01

The conference presents papers on interconnections, clock distribution, neural networks, and components and materials. Particular attention is given to a comparison of optical and electrical data interconnections at the board and backplane levels, a wafer-level optical interconnection network layout, an analysis and simulation of photonic switch networks, and the integration of picosecond GaAs photoconductive devices with silicon circuits for optical clocking and interconnects. Consideration is also given to the optical implementation of neural networks, invariance in an optoelectronic implementation of neural networks, and the recording of reversible patterns in polymer lightguides.

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

NASA Technical Reports Server (NTRS)

Strickland, S. M.; Hester, J. D.; Gowan, A. K.; Montgomery, R. K.; Geist, D. L.; Blanche, J. F.; McGuire, G. D.; Nash, T. S.

2011-01-01

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Assessing human exposure to power-frequency electric and magnetic fields.

PubMed Central

Kaune, W T

1993-01-01

This paper reviews published literature and current problems relating to the assessment of occupational and residential human exposures to power-frequency electric and magnetic fields. Available occupational exposure data suggest that the class of job titles known as electrical workers may be an effective surrogate for time-weighted-average (TWA) magnetic-field (but not electric-field) exposure. Current research in occupational-exposure assessment is directed to the construction of job-exposure matrices based on electric- and magnetic-field measurements and estimates of worker exposures to chemicals and other factors of interest. Recent work has identified five principal sources of residential magnetic fields: electric power transmission lines, electric power distribution lines, ground currents, home wiring, and home appliances. Existing residential-exposure assessments have used one or more of the following techniques: questionnaires, wiring configuration coding, theoretical field calculations, spot electric- and magnetic-field measurements, fixed-site magnetic-field recordings, personal- exposure measurements, and geomagnetic-field measurements. Available normal-power magnetic-field data for residences differ substantially between studies. It is not known if these differences are due to geographical differences, differences in measurement protocols, or instrumentation differences. Wiring codes and measured magnetic fields (but not electric fields) are associated weakly. Available data suggest, but are far from proving, that spot measurements may be more effective than wire codes as predictors of long-term historical magnetic-field exposure. Two studies find that away-from-home TWA magnetic-field exposures are less variable than at-home exposures. The importance of home appliances as contributors to total residential magnetic-field exposure is not known at this time. It also is not known what characteristics (if any) of residential electric and magnetic fields are determinants of human health effects. PMID:8206021

Fuel cell system with interconnect

DOEpatents

Liu, Zhien; Goettler, Richard

2016-12-20

The present invention includes an integrated planar, series connected fuel cell system having electrochemical cells electrically connected via interconnects, wherein the anodes of the electrochemical cells are protected against Ni loss and migration via an engineered porous anode barrier layer.

Process for 3D chip stacking

DOEpatents

Malba, V.

1998-11-10

A manufacturable process for fabricating electrical interconnects which extend from a top surface of an integrated circuit chip to a sidewall of the chip using laser pantography to pattern three dimensional interconnects. The electrical interconnects may be of an L-connect or L-shaped type. The process implements three dimensional (3D) stacking by moving the conventional bond or interface pads on a chip to the sidewall of the chip. Implementation of the process includes: (1) holding individual chips for batch processing, (2) depositing a dielectric passivation layer on the top and sidewalls of the chips, (3) opening vias in the dielectric, (4) forming the interconnects by laser pantography, and (5) removing the chips from the holding means. The process enables low cost manufacturing of chips with bond pads on the sidewalls, which enables stacking for increased performance, reduced space, and higher functional per unit volume. 3 figs.

Process for 3D chip stacking

DOEpatents

Malba, Vincent

1998-01-01

A manufacturable process for fabricating electrical interconnects which extend from a top surface of an integrated circuit chip to a sidewall of the chip using laser pantography to pattern three dimensional interconnects. The electrical interconnects may be of an L-connect or L-shaped type. The process implements three dimensional (3D) stacking by moving the conventional bond or interface pads on a chip to the sidewall of the chip. Implementation of the process includes: 1) holding individual chips for batch processing, 2) depositing a dielectric passivation layer on the top and sidewalls of the chips, 3) opening vias in the dielectric, 4) forming the interconnects by laser pantography, and 5) removing the chips from the holding means. The process enables low cost manufacturing of chips with bond pads on the sidewalls, which enables stacking for increased performance, reduced space, and higher functional per unit volume.

10 CFR 205.377 - Reports.

Code of Federal Regulations, 2010 CFR

2010-01-01

... ENERGY OIL ADMINISTRATIVE PROCEDURES AND SANCTIONS Electric Power System Permits and Reports; Applications; Administrative Procedures and Sanctions Emergency Interconnection of Electric Facilities and the Transfer of Electricity to Alleviate An Emergency Shortage of Electric Power § 205.377 Reports. In addition...

Experiments on Plasma Turbulence Created by Supersonic Plasma Flows with Shear

DTIC Science & Technology

2014-04-01

for producing a plasma column (in black). An insulated wire traverses the plasma and car - ries a pulsed current in x-direction. The unmagnetized ions... electric field which together with the B field around the wire causes an electron ExB drift. The ions are unmagnetized. A radial space charge electric field...by the self-consistent currents passing through the grid. These currents, consisting of electron and ion flows, are controlled by the electrical

AIRBORNE RADIATION DETECTOR

DOEpatents

Cartmell, T.R.; Gifford, J.F.

1959-08-01

An ionization chamber used for measuring the radioactivity of dust present in atmospheric air is described. More particularly. the patent describes a device comprising two concentric open ended, electrically connected cylinders between which is disposed a wire electrcde. A heating source is disposed inside of the cylinder to circulate air through the space between the two cylinders by convective flow. A high voltage electric field between the wire electrcde of the electrically connected cylinder will cause ionization of the air as it passes therethrough.

Exposure to residential electric and magnetic fields and risk of childhood leukemia.

PubMed

London, S J; Thomas, D C; Bowman, J D; Sobel, E; Cheng, T C; Peters, J M

1991-11-01

The relation between exposure to electric and magnetic fields in the home, as assessed by measurements, wiring configuration, and self-reported appliance use, and risk of leukemia was investigated in a case-control study among children from birth to age 10 years in Los Angeles County, California. Cases were ascertained through a population-based tumor registry from 1980 to 1987. Controls were drawn from friends and by random digit dialing. Interviews were obtained from 232 cases and 232 controls. Available for analysis were measurements of the magnetic field in the child's bedroom over 24 hours or longer (164 cases and 144 controls), spot measurements of magnetic and electric fields (140 cases and 109 controls), and wiring configuration (219 cases and 207 controls). No clear associations between leukemia risk and measured magnetic or electric fields were seen. An association between the Denver Wertheimer-Leeper wiring configuration and childhood leukemia risk was observed (odds ratio for very high relative to very low current and underground configuration combined = 2.15, 95% confidence interval 1.08-4.28; p for trend = 0.008) and was not substantially altered by adjustment for potential confounding factors. Cases were more likely than controls to report use of several appliances that produce high electric and magnetic fields. Our results support an association between childhood leukemia risk and wiring configuration, but not direct measurements of electric and magnetic fields.

Hot wire needle probe for thermal conductivity detection

DOEpatents

Condie, Keith Glenn; Rempe, Joy Lynn; Knudson, Darrell lee; Daw, Joshua Earl; Wilkins, Steven Curtis; Fox, Brandon S.; Heng, Ban

2015-11-10

An apparatus comprising a needle probe comprising a sheath, a heating element, a temperature sensor, and electrical insulation that allows thermal conductivity to be measured in extreme environments, such as in high-temperature irradiation testing. The heating element is contained within the sheath and is electrically conductive. In an embodiment, the heating element is a wire capable of being joule heated when an electrical current is applied. The temperature sensor is contained within the sheath, electrically insulated from the heating element and the sheath. The electrical insulation electrically insulates the sheath, heating element and temperature sensor. The electrical insulation fills the sheath having electrical resistance capable of preventing electrical conduction between the sheath, heating element, and temperature sensor. The control system is connected to the heating element and the temperature sensor.

78 FR 57253 - Airworthiness Directives; Honeywell ASCa Inc. Emergency Locator Transmitters Installed on Various...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-09-18

... detect and correct discrepancies of the battery wiring installation inside the TU, which could result in... TUs revealed battery wiring installation discrepancies inside the TU that may result in an electrical short. The AAIB noted that in case of an electrical short, the ELT battery could provide the energy for...

Coaxial Electric Heaters

NASA Technical Reports Server (NTRS)

Strekalov, Dmitry; Matsko, Andrey; Savchenkov, Anatoliy; Maleki, Lute

2008-01-01

Coaxial electric heaters have been conceived for use in highly sensitive instruments in which there are requirements for compact heaters but stray magnetic fields associated with heater electric currents would adversely affect operation. Such instruments include atomic clocks and magnetometers that utilize heated atomic-sample cells, wherein stray magnetic fields at picotesla levels could introduce systematic errors into instrument readings. A coaxial electric heater is essentially an axisymmetric coaxial cable, the outer conductor of which is deliberately made highly electrically resistive so that it can serve as a heating element. As in the cases of other axisymmetric coaxial cables, the equal magnitude electric currents flowing in opposite directions along the inner and outer conductors give rise to zero net magnetic field outside the outer conductor. Hence, a coaxial electric heater can be placed near an atomic-sample cell or other sensitive device. A coaxial electric heater can be fabricated from an insulated copper wire, the copper core of which serves as the inner conductor. For example, in one approach, the insulated wire is dipped in a colloidal graphite emulsion, then the emulsion-coated wire is dried to form a thin, uniform, highly electrically resistive film that serves as the outer conductor. Then the film is coated with a protective layer of high-temperature epoxy except at the end to be electrically connected to the power supply. Next, the insulation is stripped from the wire at that end. Finally, electrical leads from the heater power supply are attached to the exposed portions of the wire and the resistive film. The resistance of the graphite film can be tailored via its thickness. Alternatively, the film can be made from an electrically conductive paint, other than a colloidal graphite emulsion, chosen to impart the desired resistance. Yet another alternative is to tailor the resistance of a graphite film by exploiting the fact that its resistance can be changed permanently within about 10 percent by heating it to a temperature above 300 C. A coaxial heater, with electrical leads attached, that has been bent into an almost full circle for edge heating of a circular window is shown. (In the specific application, there is a requirement for a heated cell window, through which an optical beam enters the cell.)

Using of fiber-array diagnostic to measure the propagation of fast axial ionization wave during breakdown of electrically exploding tungsten wire in vacuum.

PubMed

Shi, Huantong; Zou, Xiaobing; Wang, Xinxin

2017-12-01

The physical process of electrical explosion of wires in vacuum is featured with the surface discharge along the wire, which generates the corona plasma layer and terminates the Joule heating of the wire core. In this paper, a fiber-array probe was designed to directly measure the radiation of surface arc with spatial and temporal resolution. The radiation of the exploding wire was casted to the section of an optical-fiber-array by a lens and transmitted to PIN diodes and finally collected with an oscilloscope. This probe enables direct diagnostics of the evolution of surface discharge with high temporal resolution and certain spatial resolution. The radiation of a tungsten wire driven by a positive current pulse was measured, and results showed that surface discharge initiates near the cathode and propagates toward the anode with a speed of 7.7 ± 1.6 mm/ns; further estimations showed that this process is responsible for the "conical" structure of the exploding wire.

Using of fiber-array diagnostic to measure the propagation of fast axial ionization wave during breakdown of electrically exploding tungsten wire in vacuum

NASA Astrophysics Data System (ADS)

Shi, Huantong; Zou, Xiaobing; Wang, Xinxin

2017-12-01

The physical process of electrical explosion of wires in vacuum is featured with the surface discharge along the wire, which generates the corona plasma layer and terminates the Joule heating of the wire core. In this paper, a fiber-array probe was designed to directly measure the radiation of surface arc with spatial and temporal resolution. The radiation of the exploding wire was casted to the section of an optical-fiber-array by a lens and transmitted to PIN diodes and finally collected with an oscilloscope. This probe enables direct diagnostics of the evolution of surface discharge with high temporal resolution and certain spatial resolution. The radiation of a tungsten wire driven by a positive current pulse was measured, and results showed that surface discharge initiates near the cathode and propagates toward the anode with a speed of 7.7 ± 1.6 mm/ns; further estimations showed that this process is responsible for the "conical" structure of the exploding wire.

SpaceFibre: The Standard and the Multi-Lane Layer

NASA Astrophysics Data System (ADS)

Parkes, Steve; McClements, Chris; McLaren, David; Florit, Albert Ferrer; Gonzalez Villafranca, Alberto

2016-08-01

SpaceFibre is a new standard for spacecraft on-board data-handling networks, initially designed to deliver multi-Gbit/s data rates for synthetic aperture radar and high-resolution, multi-spectral imaging instruments, The addition of quality of service (QoS) and fault detection, isolation and recovery (FDIR) capabilities to SpaceFibre has resulted in a unified network technology. SpaceFibre provides high bandwidth, low latency, fault isolation and recovery suitable for space applications, and novel QoS that combines priority, bandwidth reservation and scheduling and which provides babbling node protection. SpaceFibre is backwards compatible with the widely used SpaceWire standard at the network level allowing simple interconnection of existing SpaceWire equipment to a SpaceFibre link or network.Developed by STAR-Dundee and the University of Dundee for the European Space Agency (ESA) SpaceFibre is able to operate over fibre-optic and electrical cable. A single lane of SpaceFibre comprises four signals (TX+/- and RX+/-) and supports data rates of 2 Gbits/s (2.5 Gbits/s data signalling rate) with data rates up to 5 Gbits/s already planned.Several lanes can operate together to provide a multi- lane link. Multi-laning increases the data-rate to well over 20 Gbits/s.This paper details the current state of SpaceFibre which is now in the process of formal standardisation by the European Cooperation for Space Standardization (ECSS). The multi-lane layer of SpaceFibre is then described.

CoNNeCT Baseband Processor Module

NASA Technical Reports Server (NTRS)

Yamamoto, Clifford K; Jedrey, Thomas C.; Gutrich, Daniel G.; Goodpasture, Richard L.

2011-01-01

A document describes the CoNNeCT Baseband Processor Module (BPM) based on an updated processor, memory technology, and field-programmable gate arrays (FPGAs). The BPM was developed from a requirement to provide sufficient computing power and memory storage to conduct experiments for a Software Defined Radio (SDR) to be implemented. The flight SDR uses the AT697 SPARC processor with on-chip data and instruction cache. The non-volatile memory has been increased from a 20-Mbit EEPROM (electrically erasable programmable read only memory) to a 4-Gbit Flash, managed by the RTAX2000 Housekeeper, allowing more programs and FPGA bit-files to be stored. The volatile memory has been increased from a 20-Mbit SRAM (static random access memory) to a 1.25-Gbit SDRAM (synchronous dynamic random access memory), providing additional memory space for more complex operating systems and programs to be executed on the SPARC. All memory is EDAC (error detection and correction) protected, while the SPARC processor implements fault protection via TMR (triple modular redundancy) architecture. Further capability over prior BPM designs includes the addition of a second FPGA to implement features beyond the resources of a single FPGA. Both FPGAs are implemented with Xilinx Virtex-II and are interconnected by a 96-bit bus to facilitate data exchange. Dedicated 1.25- Gbit SDRAMs are wired to each Xilinx FPGA to accommodate high rate data buffering for SDR applications as well as independent SpaceWire interfaces. The RTAX2000 manages scrub and configuration of each Xilinx.

Self-Rerouting and Curative Interconnect Technology (SERCUIT)

DTIC Science & Technology

2017-12-01

microcompounder and a single screw extruder. The volume fraction of conductive filler is designed to provide conductivity comparable to traditional wires in...REPORT ARE NOT TO BE CONSTRUED AS AN OFFICIAL DEPARTMENT OF THE ARMY POSITION UNLESS SO DESIGNATED BY OTHER AUTHORIZED DOCUMENTS. TRADE...7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) Commander, U.S. Army Research , Development, and Engineering Command ATTN: RDMR-CS

Infrared-enhanced TV for fire detection

NASA Technical Reports Server (NTRS)

Hall, J. R.

1978-01-01

Closed-circuit television is superior to conventional smoke or heat sensors for detecting fires in large open spaces. Single TV camera scans entire area, whereas many conventional sensors and maze of interconnecting wiring might be required to get same coverage. Camera is monitored by person who would trip alarm if fire were detected, or electronic circuitry could process camera signal for fully-automatic alarm system.

High bit rate mass data storage device

NASA Technical Reports Server (NTRS)

1973-01-01

The HDDR-II mass data storage system consists of a Leach MTR 7114 recorder reproducer, a wire wrapped, integrated circuit flat plane and necessary power supplies for the flat plane. These units, with interconnecting cables and control panel are enclosed in a common housing mounted on casters. The electronics used in the HDDR-II double density decoding and encoding techniques are described.

Enamel Insulated Copper Wire in Electric Motors: Sliding Behavior and Possible Damage Mechanisms During Die Bending

NASA Astrophysics Data System (ADS)

Demiri, Albion

This study investigates the sliding friction and the forming behaviour of enamel insulated copper wire during the die-forming process. It also aims to determine potential damage mechanisms to the wire during bending process for electric motor coils. In this investigation a wire-bending machine was designed and built in order to simulate the wire forming process in a laboratory scale. Bending angle of the wire and the bending radii were used to control the strain on the wire surface. The effect of speed on COF was investigated for different speeds of of 1, 5, 10, 15, and 20mm/s. A positive correlation was observed between the COF and the testing speed. Additionally, the effect of strain on COF was studied for 2% and 23% to determine its influence on the COF. A general trend was observed of decreased COF with increased strain in wires. Finally, the ability of the enamel coating to resist external damage and wire strain was investigated by tensile testing of pre-scratched magnet wire. The results showed that wire enamel can withstand significant surface damage prior to breach and failure. The insulating polymer coating failed under the scratch tests at 20N load using a Rockwell indenter and at 5N load using a 90° conical steel indenter. Additional tests, such as tensile testing, scratch testing and reciprocating friction testing, were used to characterize the mechanical and tribological properties of the enamel insulated copper wire.

Integrating soft sensor systems using conductive thread

NASA Astrophysics Data System (ADS)

Teng, Lijun; Jeronimo, Karina; Wei, Tianqi; Nemitz, Markus P.; Lyu, Geng; Stokes, Adam A.

2018-05-01

We are part of a growing community of researchers who are developing a new class of soft machines. By using mechanically soft materials (MPa modulus) we can design systems which overcome the bulk-mechanical mismatches between soft biological systems and hard engineered components. To develop fully integrated soft machines—which include power, communications, and control sub-systems—the research community requires methods for interconnecting between soft and hard electronics. Sensors based upon eutectic gallium alloys in microfluidic channels can be used to measure normal and strain forces, but integrating these sensors into systems of heterogeneous Young’s modulus is difficult due the complexity of finding a material which is electrically conductive, mechanically flexible, and stable over prolonged periods of time. Many existing gallium-based liquid alloy sensors are not mechanically or electrically robust, and have poor stability over time. We present the design and fabrication of a high-resolution pressure-sensor soft system that can transduce normal force into a digital output. In this soft system, which is built on a monolithic silicone substrate, a galinstan-based microfluidic pressure sensor is integrated with a flexible printed circuit board. We used conductive thread as the interconnect and found that this method alleviates problems arising due to the mechanical mismatch between conventional metal wires and soft or liquid materials. Conductive thread is low-cost, it is readily wetted by the liquid metal, it produces little bending moment into the microfluidic channel, and it can be connected directly onto the copper bond-pads of the flexible printed circuit board. We built a bridge-system to provide stable readings from the galinstan pressure sensor. This system gives linear measurement results between 500-3500 Pa of applied pressure. We anticipate that integrated systems of this type will find utility in soft-robotic systems as used for wearable technologies like virtual reality, or in soft-medical devices such as exoskeletal rehabilitation robots.

Multi-pin chemiresistors for microchemical sensors

DOEpatents

Ho, Clifford K [Albuquerque, NM

2007-02-20

A multi-pin chemiresistor for use in microchemical sensors. A pair of free-standing, bare wires is supported by an electrically insulating support, and are oriented parallel to each other and spaced closely together. A free-standing film of a chemically sensitive polymer that swells when exposed to vapors of a volatile chemical is formed in-between the pair of closely-spaced wires by capillary action. Similar in construction to a thermocouple, this "chemicouple" is relatively inexpensive and easy to fabricate by dipping the pair of bare wires into a bath of well-mixed chemiresistor ink. Also, a chemiresistor "stick" is formed by dipping an electrically insulating rod with two or more linear or spiral-wrapped electrical traces into the bath of well-mixed chemiresistor ink, which deposits a uniform coating of the chemically sensitive polymer on the rod and the electrical traces. These "sticks" can be easily removed and replaced from a multi-chemiresistor plug.

Electrical Arc Ignition Testing for Constellation Program

NASA Technical Reports Server (NTRS)

Sparks, Kyle; Gallus, Timothy; Smith, Sarah

2009-01-01

NASA Johnson Space Center (JSC) Materials and Processes Branch requested that NASA JSC White Sands Test Facility (WSTF) perform testing for the Constellation Program to evaluate the hazard of electrical arc ignition of materials that could be in close proximity to batteries. Specifically, WSTF was requested to perform wire-break electrical arc tests to determine the current threshold for ignition of generic cotton woven fabric samples with a fixed voltage of 3.7 V, a common voltage for hand-held electrical devices. The wire-break test was developed during a previous test program to evaluate the hazard of electrical arc ignition inside the Extravehicular Mobility Unit [1].

Laser printed interconnects for flexible electronics

NASA Astrophysics Data System (ADS)

Pique, Alberto; Beniam, Iyoel; Mathews, Scott; Charipar, Nicholas

Laser-induced forward transfer (LIFT) can be used to generate microscale 3D structures for interconnect applications non-lithographically. The laser printing of these interconnects takes place through aggregation of voxels of either molten metal or dispersed metallic nanoparticles. However, the resulting 3D structures do not achieve the bulk conductivity of metal interconnects of the same cross-section and length as those formed by wire bonding or tab welding. It is possible, however, to laser transfer entire structures using a LIFT technique known as lase-and-place. Lase-and-place allows whole components and parts to be transferred from a donor substrate onto a desired location with one single laser pulse. This talk will present the use of LIFT to laser print freestanding solid metal interconnects to connect individual devices into functional circuits. Furthermore, the same laser can bend or fold the thin metal foils prior to transfer, thus forming compliant 3D structures able to provide strain relief due to flexing or thermal mismatch. Examples of these laser printed 3D metallic bridges and their role in the development of next generation flexible electronics by additive manufacturing will be presented. This work was funded by the Office of Naval Research (ONR) through the Naval Research Laboratory Basic Research Program.

A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

DTIC Science & Technology

2014-05-19

their acceptable thermal stability, Polyimides have established as a conventional substrate material for flexible interconnects, which can be...of the silver flake ink for the screen-printed interconnects, the assembled unit fulfills biocompatibility requirements in a limited manner ([29...30]). Even though biocompatibility of substrate [31] is fulfilled, toxicity of the insulating mask [32] and encapsulation need to be considered

Electrical behavior of aluminosilicate glass-ceramic sealants and their interaction with metallic solid oxide fuel cell interconnects

NASA Astrophysics Data System (ADS)

Goel, Ashutosh; Tulyaganov, Dilshat U.; Kharton, Vladislav V.; Yaremchenko, Aleksey A.; Ferreira, José M. F.

A series of alkaline-earth aluminosilicate glass-ceramics (GCs) were appraised with respect to their suitability as sealants for solid oxide fuel cells (SOFCs). The parent composition with general formula Ca 0.9MgAl 0.1La 0.1Si 1.9O 6 was modified with Cr 2O 3 and BaO. The addition of BaO led to a substantial decrease in the total electrical conductivity of the GCs, thus improving their insulating properties. BaO-containing GCs exhibited higher coefficient of thermal expansion (CTE) in comparison to BaO-free GCs. An extensive segregation of oxides of Ti and Mn, components of the Crofer22 APU interconnect alloy, along with negligible formation of BaCrO 4 was observed at the interface between GC/interconnects diffusion couples. Thermal shock resistance and gas-tightness of GC sealants in contact with yttria-stabilized zirconia electrolyte (8YSZ) was evaluated in air and water. Good matching of CTE and strong, but not reactive, adhesion to the solid electrolyte and interconnect, in conjunction with a high level of electrical resistivity, are all advantageous for potential SOFC applications.

Air Quality Improvements of Increased Integration of Renewables: Solar Photovoltaics Penetration Scenarios

NASA Astrophysics Data System (ADS)

Duran, P.; Holloway, T.; Brinkman, G.; Denholm, P.; Littlefield, C. M.

2011-12-01

Solar photovoltaics (PV) are an attractive technology because they can be locally deployed and tend to yield high production during periods of peak electric demand. These characteristics can reduce the need for conventional large-scale electricity generation, thereby reducing emissions of criteria air pollutants (CAPs) and improving ambient air quality with regard to such pollutants as nitrogen oxides, sulfur oxides and fine particulates. Such effects depend on the local climate, time-of-day emissions, available solar resources, the structure of the electric grid, and existing electricity production among other factors. This study examines the air quality impacts of distributed PV across the United States Eastern Interconnection. In order to accurately model the air quality impact of distributed PV in space and time, we used the National Renewable Energy Lab's (NREL) Regional Energy Deployment System (ReEDS) model to form three unique PV penetration scenarios in which new PV construction is distributed spatially based upon economic drivers and natural solar resources. Those scenarios are 2006 Eastern Interconnection business as usual, 10% PV penetration, and 20% PV penetration. With the GridView (ABB, Inc) dispatch model, we used historical load data from 2006 to model electricity production and distribution for each of the three scenarios. Solar PV electric output was estimated using historical weather data from 2006. To bridge the gap between dispatch and air quality modeling, we will create emission profiles for electricity generating units (EGUs) in the Eastern Interconnection from historical Continuous Emissions Monitoring System (CEMS) data. Via those emissions profiles, we will create hourly emission data for EGUs in the Eastern Interconnect for each scenario during 2006. Those data will be incorporated in the Community Multi-scale Air Quality (CMAQ) model using the Sparse Matrix Operator Kernel Emissions (SMOKE) model. Initial results indicate that PV penetration significantly reduces conventional peak electricity production and that, due to reduced emissions during periods of extremely active photochemistry, air quality could see benefits.

Investigation of Axial Electric Field Measurements with Grounded-Wire TEM Surveys

NASA Astrophysics Data System (ADS)

Zhou, Nan-nan; Xue, Guo-qiang; Li, Hai; Hou, Dong-yang

2018-01-01

The grounded-wire transient electromagnetic (TEM) surveying is often performed along the equatorial direction with its observation lines paralleling to the transmitting wire with a certain transmitter-receiver distance. However, such method takes into account only the equatorial component of the electromagnetic field, and a little effort has been made on incorporating the other major component along the transmitting wire, here denoted as axial field. To obtain a comprehensive understanding of its fundamental characteristics and guide the designing of the corresponding observation system for reliable anomaly detection, this study for the first time investigates the axial electric field from three crucial aspects, including its decay curve, plane distribution, and anomaly sensitivity, through both synthetic modeling and real application to one major coal field in China. The results demonstrate a higher sensitivity to both high- and low-resistivity anomalies by the electric field in axial direction and confirm its great potentials for robust anomaly detection in the subsurface.

24 CFR 3285.701 - Electrical crossovers.

Code of Federal Regulations, 2010 CFR

2010-04-01

... URBAN DEVELOPMENT MODEL MANUFACTURED HOME INSTALLATION STANDARDS Electrical Systems and Equipment § 3285.701 Electrical crossovers. Multi-section homes with electrical wiring in more than one section require... installation instructions. ...

Computer simulation of metal wire explosion under high rate heating

NASA Astrophysics Data System (ADS)

Zolnikov, K. P.; Kryzhevich, D. S.; Korchuganov, A. V.

2017-05-01

Synchronous electric explosion of metal wires and synthesis of bicomponent nanoparticles were investigated on the base of molecular dynamics method. Copper and nickel nanosized crystallites of cylindrical shape were chosen as conductors for explosion. The embedded atom approximation was used for calculation of the interatomic interactions. The agglomeration process after explosion metal wires was the main mechanism for particle synthesis. The distribution of chemical elements was non-uniform over the cross section of the bicomponent particles. The copper concentration in the surface region was higher than in the bulk of the synthesized particle. By varying the loading parameters (heating temperature, the distance between the wires) one can control the size and internal structure of the synthesized bicomponent nanoparticles. The obtained results showed that the method of molecular dynamics can be effectively used to determine the optimal technological mode of nanoparticle synthesis on the base of electric explosion of metal wires.

Effects of thermal and electrical stressing on the breakdown behavior of space wiring

NASA Technical Reports Server (NTRS)

Hammoud, Ahmad; Stavnes, Mark; Suthar, Jayant; Laghari, Javaid

1995-01-01

Several failures in the electrical wiring systems of many aircraft and space vehicles have been attributed to arc tracking and damaged insulation. In some instances, these failures proved to be very costly as they have led to the loss of many aircraft and imperilment of space missions. Efforts are currently underway to develop lightweight, reliable, and arc track resistant wiring for aerospace applications. In this work, six wiring constructions were evaluated in terms of their breakdown behavior as a function of temperature. These hybrid constructions employed insulation consisting of Kapton, Teflon, and cross-linked Tefzel. The properties investigated included the 400 Hz AC dielectric strength at ambient and 200 C, and the lifetime at high temperature with an applied bias of 40, 60, and 80% of breakdown voltage level. The results obtained are discussed, and conclusions are made concerning the suitability of the wiring constructions investigated for aerospace applications.

Effects of thermal and electrical stressing on the breakdown behavior of space wiring

NASA Astrophysics Data System (ADS)

Hammoud, Ahmad; Stavnes, Mark; Suthar, Jayant; Laghari, Javaid

1995-06-01

Several failures in the electrical wiring systems of many aircraft and space vehicles have been attributed to arc tracking and damaged insulation. In some instances, these failures proved to be very costly as they have led to the loss of many aircraft and imperilment of space missions. Efforts are currently underway to develop lightweight, reliable, and arc track resistant wiring for aerospace applications. In this work, six wiring constructions were evaluated in terms of their breakdown behavior as a function of temperature. These hybrid constructions employed insulation consisting of Kapton, Teflon, and cross-linked Tefzel. The properties investigated included the 400 Hz AC dielectric strength at ambient and 200 C, and the lifetime at high temperature with an applied bias of 40, 60, and 80% of breakdown voltage level. The results obtained are discussed, and conclusions are made concerning the suitability of the wiring constructions investigated for aerospace applications.

7 CFR 1755.860 - RUS specification for filled buried wires.

Code of Federal Regulations, 2012 CFR

2012-01-01

... sufficient heat barrier to prevent visible evidence of conductor insulation deformation or adhesion between... Insulations and Jackets for Telecommunications Wire and Cable; ASTM D 4566-90, Standard Test Methods for Electrical Performance Properties of Insulations and Jackets for Telecommunications Wire and Cable; ASTM D...

7 CFR 1755.860 - RUS specification for filled buried wires.

Code of Federal Regulations, 2014 CFR

2014-01-01

... sufficient heat barrier to prevent visible evidence of conductor insulation deformation or adhesion between... Insulations and Jackets for Telecommunications Wire and Cable; ASTM D 4566-90, Standard Test Methods for Electrical Performance Properties of Insulations and Jackets for Telecommunications Wire and Cable; ASTM D...

7 CFR 1755.860 - RUS specification for filled buried wires.

Code of Federal Regulations, 2013 CFR

2013-01-01

... sufficient heat barrier to prevent visible evidence of conductor insulation deformation or adhesion between... Insulations and Jackets for Telecommunications Wire and Cable; ASTM D 4566-90, Standard Test Methods for Electrical Performance Properties of Insulations and Jackets for Telecommunications Wire and Cable; ASTM D...

Ultra-flexible biomedical electrodes and wires

NASA Technical Reports Server (NTRS)

Rositano, S. A.

1970-01-01

Soft, flexible electrode conforms to body contour during body motion. It is fabricated from an elastomer impregnated with a conductive powder which can be configured into any required shape, including a wire shape to connect the electrode directly to an electrical instrument or to a conventional metallic wire.

Wire Stripper Holds Insulation Debris

NASA Technical Reports Server (NTRS)

Cook, Allen D.; Morris, Henry S.; Bauer, Laverne

1994-01-01

Attachment to standard wire-stripping tool catches bits of insulation as they are removed from electrical wire and retains them for proper disposal. Prevents insulation particles from falling at random, contaminating electronic equipment and soiling workspace. Commercial tool modified by attaching small collection box to one of the jaws.

Electrically isolated, high melting point, metal wire arrays and method of making same

DOE Office of Scientific and Technical Information (OSTI.GOV)

Simpson, John T.; Cunningham, Joseph P.; D'Urso, Brian R.

2016-01-26

A method of making a wire array includes the step of providing a tube of a sealing material and having an interior surface, and positioning a wire in the tube, the wire having an exterior surface. The tube is heated to soften the tube, and the softened tube is drawn and collapsed by a mild vacuum to bring the interior surface of the tube into contact with the wire to create a coated wire. The coated wires are bundled. The bundled coated wires are heated under vacuum to fuse the tube material coating the wires and create a fused rodmore » with a wire array embedded therein. The fused rod is cut to form a wire array. A wire array is also disclosed.« less