The Copper Sulfide Coating on Polyacrylonitrile with Chelating Agents by an Electroless Deposition Method and its EMI Shielding Effectiveness

DOE Office of Scientific and Technical Information (OSTI.GOV)

Roan, M.-L.; Chen, Y.-H.; Huang, C.-Y.

2008-08-28

In this study, a variety of concentrations of chelating agents were added to obtain the anchoring effect and chelating effect in the electroless plating bath. The mechanism of the Cu{sub x(x=1,2)}S growth and the electromagnetic interference shielding effectiveness (EMI SE) of the composite were studied. It was found that the vinyl acetate residued in PAN substrate would be purged due to the swelling effect by chelating agents solution. And then, the anchoring effect occurred due to the hydrogen bonding between the pits of PAN substrate and the chelating agent. Consequently, the copper sulfide layer deposited by the electroless plating reactionmore » with EDTA and TEA. The swelling degree (S{sub d}) was proposed and evaluated from the FT-IR spectra. The relationship between swelling degree of the PAN films and EDTA (C) is expressed as: S{sub d} = 0.13+0.90xe and (-15.15C). And TEA series is expressed as: S{sub d} = 0.07+1.00xe and (-15.15C). On the other hand, the FESEM micrograph showed that the average thickness of copper sulfide increased from 76 nm to 383 nm when the concentration of EDTA increased from 0.00M to 0.20M. Consequently, the EMI SE of the composites increased from 10{approx}12 dB to 25{approx}27 dB. The GIA-XRD analyze indicated that the deposited layer consisted of CuS and Cu{sub 2}S.« less

Direct write of copper-graphene composite using micro-cold spray

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dardona, Sameh, E-mail: dardona@utrc.utc.com; She, Ying; Schmidt, Wayde R.

Direct write of a new class of composite materials containing copper and graphene in the powder phase is described. The composite was synthesized using batch electroless plating of copper for various times onto Nano Graphene Platelets (NGP) to control the amount of copper deposited within the loosely aggregated graphene powder. Copper deposition was confirmed by both Focused Ion Beam (FIB) and Auger electron spectroscopic analysis. A micro-cold spray technique was used to deposit traces that are ∼230 μm wide and ∼5 μm thick of the formulated copper/graphene powder onto a glass substrate. The deposited traces were found to have goodmore » adhesion to the substrate with ∼65x the copper bulk resistivity.« less

Electroless nickel plating on stainless steels and aluminum

NASA Technical Reports Server (NTRS)

1966-01-01

Procedures for applying an adherent electroless nickel plating on 303 SE, 304, and 17-7 PH stainless steels, and 7075 aluminum alloy was developed. When heat treated, the electroless nickel plating provides a hard surface coating on a high strength, corrosion resistant substrate.

Electroless shielding of plastic electronic enclosures

NASA Astrophysics Data System (ADS)

Thompson, D.

1985-12-01

The containment or exclusion of radio frequency interference (RFI) via metallized plastic enclosures and the electroless plating as a solution are examined. The electroless coating and process, shielding principles and test data, shielding design requirements, and shielding advantages and limitations are reviewed. It is found that electroless shielding provides high shielding effectiveness to plastic substrates. After application of a conductive metallic coating by electroless plating, various plastics have passed the ASTM adhesion test after thermal cycle and severe environmental testing. Electroless shielding provides a lightweight, totally metallized housing to EMI/RFI shielding. Various compositions of electroless deposits are found to optimize electroless shielding cost/benefit ratio.

Phase 2 of the array automated assembly task for the low cost silicon solar array project

NASA Technical Reports Server (NTRS)

Petersen, R. C.

1980-01-01

Studies were conducted on several fundamental aspects of electroless nickel/solder metallization for silicon solar cells. A process, which precedes the electroless nickel plating with several steps of palladium plating and heat treatment, was compared directly with single step electroless nickel plating. Work was directed toward answering specific questions concerning the effect of silicon surface oxide on nickel plating, effects of thermal stresses on the metallization, sintering of nickel plated on silicon, and effects of exposure to the plating solution on solar cell characteristics. The process was found to be extremely lengthy and cumbersome, and was also found to produce a product virtually identical to that produced by single step electroless nickel plating, as shown by adhesion tests and electrical characteristics of cells under illumination.

40 CFR 413.70 - Applicability: Description of the electroless plating subcategory.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Applicability: Description of the electroless plating subcategory. 413.70 Section 413.70 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroless...

Electroless plated maghemite for three-dimensional magneto photonic crystals

NASA Astrophysics Data System (ADS)

Mito, Shinichiro; Kawashima, Takuya; Kawaguchi, Takuma; Sasano, Junji; Takagi, Hiroyuki; Inoue, Mitsuteru

2017-05-01

Three-dimensional magneto photonic crystals (3D-MPCs) are promising material for manipulating light in 3D space. In this study, we fabricated 3D-MPC that is filling the air-gap of opal photonic crystal with magnetic material by electroless plating. The electroless plating is an attractive film-forming method which provides magnetic material films on various substrates in aqueous solution at 24-90 °C. As magnetic material for filling the air-gap, maghemite (γ-Fe2O3) film was plated in opal photonic crystal. The plated maghemite film showed a Faraday rotation of 0.6 deg./μm at 440 nm and significantly lower absorption than magnetite. The plated opal showed photonic band gap and magneto-optic response. Faraday rotation of the plated opal was enhanced at the band edge. The photonic band gap and the Faraday rotation spectra were changed as a function of incident angle of light. Electroless plating of maghemite could be promising technique for fabricating 3D-MPCs.

Copper Decoration of Carbon Nanotubes and High Resolution Electron Microscopy

NASA Astrophysics Data System (ADS)

Probst, Camille

A new process of decorating carbon nanotubes with copper was developed for the fabrication of nanocomposite aluminum-nanotubes. The process consists of three stages: oxidation, activation and electroless copper plating on the nanotubes. The oxidation step was required to create chemical function on the nanotubes, essential for the activation step. Then, catalytic nanoparticles of tin-palladium were deposited on the tubes. Finally, during the electroless copper plating, copper particles with a size between 20 and 60 nm were uniformly deposited on the nanotubes surface. The reproducibility of the process was shown by using another type of carbon nanotube. The fabrication of nanocomposites aluminum-nanotubes was tested by aluminum vacuum infiltration. Although the infiltration of carbon nanotubes did not produce the expected results, an interesting electron microscopy sample was discovered during the process development: the activated carbon nanotubes. Secondly, scanning transmitted electron microscopy (STEM) imaging in SEM was analysed. The images were obtained with a new detector on the field emission scanning electron microscope (Hitachi S-4700). Various parameters were analysed with the use of two different samples: the activated carbon nanotubes (previously obtained) and gold-palladium nanodeposits. Influences of working distance, accelerating voltage or sample used on the spatial resolution of images obtained with SMART (Scanning Microscope Assessment and Resolution Testing) were analysed. An optimum working distance for the best spatial resolution related to the sample analysed was found for the imaging in STEM mode. Finally, relation between probe size and spatial resolution of backscattered electrons (BSE) images was studied. An image synthesis method was developed to generate the BSE images from backscattered electrons coefficients obtained with CASINO software. Spatial resolution of images was determined using SMART. The analysis shown that using a probe size smaller than the size of the observed object (sample features) does not improve the spatial resolution. In addition, the effects of the accelerating voltage, the current intensity and the sample geometry and composition were analysed.

Conformal Electroless Nickel Plating on Silicon Wafers, Convex and Concave Pyramids, and Ultralong Nanowires.

PubMed

Gill, Thomas Mark; Zhao, Jiheng; Berenschot, Erwin J W; Tas, Niels; Zheng, Xiaolin

2018-06-25

Nickel (Ni) plating has garnered great commercial interest, as it provides excellent hardness, corrosion resistance, and electrical conductivity. Though Ni plating on conducting substrates is commonly employed via electrodeposition, plating on semiconductors and insulators often necessitates electroless approaches. Corresponding plating theory for deposition on planar substrates was developed as early as 1946, but for substrates with micro- and nanoscale features, very little is known of the relationships between plating conditions, Ni deposition quality, and substrate morphology. Herein, we describe the general theory and mechanisms of electroless Ni deposition on semiconducting silicon (Si) substrates, detailing plating bath failures and establishing relationships between critical plating bath parameters and the deposited Ni film quality. Through this theory, we develop two different plating recipes: galvanic displacement (GD) and autocatalytic deposition (ACD). Neither recipe requires pretreatment of the Si substrate, and both methods are capable of depositing uniform Ni films on planar Si substrates and convex Si pyramids. In comparison, ACD has better tunability than GD, and it provides a more conformal Ni coating on complex and high-aspect-ratio Si structures, such as inverse fractal Si pyramids and ultralong Si nanowires. Our methodology and theoretical analyses can be leveraged to develop electroless plating processes for other metals and metal alloys and to generally provide direction for the adaptation of electroless deposition to modern applications.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Owens, W.W.; Sullivan, H.H.

Electroless nicke-plate characteristics are substantially influenced by percent phosphorous concentrations. Available ASTM analytical methods are designed for phosphorous concentrations of less than one percent compared to the 4.0 to 20.0% concentrations common in electroless nickel plate. A variety of analytical adaptations are applied through the industry resulting in poor data continuity. This paper presents a statistical comparison of five analytical methods and recommends accurate and precise procedures for use in percent phosphorous determinations in electroless nickel plate. 2 figures, 1 table.

Surface rejuvenation for multilayer metal deposition on polymer microspheres via self-seeded electroless plating

NASA Astrophysics Data System (ADS)

Karagoz, Bunyamin; Sirkecioglu, Okan; Bicak, Niyazi

2013-11-01

A surface rejuvenation process was developed for generation variable thickness of metal deposits on polymer microspheres via electroless plating. Thus, Ni(II), Cu(II) and Ag(I) complexes formed on triethylenetetramine (TETA) functional crosslinked poly(glycidyl methacrylate) (PGMA) microspheres were reduced to zero-valent metals. The resulting metals (1.1-1.5 mmol g-1) were employed as seed points for electroless metal plating (self-seeding) without using Pd or tin pre-activating species. Treatment of the metalized surfaces with hydrazine or hydrazinium formate was demonstrated to reactivate (rejuvenate) the surface and allows further metal deposition from electroless plating solutions. Followed repeating of the surface rejuvenation-metalization steps resulted in step wise increasing of the metal deposits (90-290 mg per g in each cycle), as inferred from metal analyses, ESEM and XPS analysis. Experiments showed that, after 6 times of cycling the metal deposits exceed 1 g per g of the microspheres on average. The process seemed to be promising for tuning up of the metal thickness by stepwise electroless plating.

A novel Ag catalyzation process using swelling impregnation method for electroless Ni deposition on Kevlar® fiber

NASA Astrophysics Data System (ADS)

Pang, Hongwei; Bai, Ruicheng; Shao, Qinsi; Gao, Yufang; Li, Aijun; Tang, Zhiyong

2015-12-01

A novel Ag catalyzation process using swelling impregnation pretreatment method was developed for electroless nickel (EN) deposition on Kevlar fiber. Firstly, the fiber was immersed into an aqueous dimethylsulfoxide (DMSO) solution of silver nitrate to impart silver nitrate into the inner part of the fiber near the surface. Subsequently silver nitrate was reduced to metal silver nanoparticles on the fiber surface by treatment with aqueous solution of sodium borohydride. After electroless plating, a dense and homogeneous nickel coating was obtained on the fiber surface. The silver nanoparticles formed at the fiber surface functioned as a catalyst for electroless deposition as well as an anchor for the plated layer. The study also revealed that the incorporation of surfactant sodium dodecyl sulfate (SDS) in electroless nickel plating bath can enhance the adhesion strength of EN layer with the fiber surface and minimize the surface roughness of the EN coating. The Ni plated Kevlar fiber possessed excellent corrosion resistance and high tensile strength.

Electroless-plated Ni pattern with catalyst printing on indium-gallium-zinc oxide surface

NASA Astrophysics Data System (ADS)

Onoue, Miki; Ogura, Shintaro; Kusaka, Yasuyuki; Fukuda, Nobuko; Yamamoto, Noritaka; Kojima, Keisuke; Chikama, Katsumi; Ushijima, Hirobumi

2017-05-01

Electroless plated metals have been used for wiring and electrodes in the manufacture of electronic devices. To obtain plated patterns, etching and photoresist are generally used. However, through catalyst patterning by printing, we can obtain metal patterns without etching and photoresists by electroless plating. Solution-processed indium-gallium-zinc oxide (IGZO) has received significant attention for showing high performance and ease of preparation in air atmosphere. In this study, we prepared an electroless plated pattern by catalyst printing as electrodes of IGZO TFT. There are few reports on the application of plated metal electrodes prepared by catalyst printing to the source and drain electrodes of IGZO TFT. The prepared IGZO TFT exhibits a typical current-voltage (I-V) curve. The plated electrodes caused many problems such as performance degradation. However, our result showed that the plated metal electrodes can drive IGZO TFT. In addition, we confirm plated metal growth into the catalyst layer by cross sectional scanning electron microscopy and energy-dispersive X-ray spectroscopy (SEM/EDS) of the plated Ni. We discuss the relevance of the measured work function (WF) of the electrode materials and the performance of IGZO TFT.

Plasmonic nanostructures for surface-enhanced Raman spectroscopy

NASA Astrophysics Data System (ADS)

Jiang, Ruiqian

In the last three decades, a large number of different plasmonic nanostructures have attracted much attention due to their unique optical properties. Those plasmonic nanostructures include nanoparticles, nanoholes and metal nanovoids. They have been widely utilized in optical devices and sensors. When the plasmonic nanostructures interact with the electromagnetic wave and their surface plasmon frequency match with the light frequency, the electrons in plasmonic nanostructures will resonate with the same oscillation as incident light. In this case, the plasmonic nanostructures can absorb light and enhance the light scattering. Therefore, the plasmonic nanostructures can be used as substrate for surface-enhanced Raman spectroscopy to enhance the Raman signal. Using plasmonic nanostructures can significantly enhance Raman scattering of molecules with very low concentrations. In this thesis, two different plasmonic nanostructures Ag dendrites and Au/Ag core-shell nanoparticles are investigated. Simple methods were used to produce these two plasmonic nanostructures. Then, their applications in surface enhanced Raman scattering have been explored. Ag dendrites were produced by galvanic replacement reaction, which was conducted using Ag nitrate aqueous solution and copper metal. Metal copper layer was deposited at the bottom side of anodic aluminum oxide (AAO) membrane. Silver wires formed inside AAO channels connected Ag nitrate on the top of AAO membrane and copper layer at the bottom side of AAO. Silver dendrites were formed on the top side of AAO. The second plasmonic nanostructure is Au/Ag core-shell nanoparticles. They were fabricated by electroless plating (galvanic replacement) reaction in a silver plating solution. First, electrochemically evolved hydrogen bubbles were used as template through electroless deposition to produce hollow Au nanoparticles. Then, the Au nanoparticles were coated with Cu shells in a Cu plating solution. In the following step, a AgCN based plating solution was used to replace Cu shell to form Au/Ag core-shell nanoparticles. These two plasmonic nanostructures were tested as substrates for Raman spectroscopy. It demonstrated that these plasmonic nanostructures could enhance Raman signal from the molecules on their surface. The results indicate that these plasmonic nanostructures could be utilized in many fields, such as such as biological and environmental sensors.

Electroless Plated Nanodiamond Coating for Stainless Steel Passivation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, D.; Korinko, P.; Spencer, W.

Tritium gas sample bottles and manifold components require passivation surface treatments to minimize the interaction of the hydrogen isotopes with surface contamination on the stainless steel containment materials. This document summarizes the effort to evaluate electroless plated nanodiamond coatings as a passivation layer for stainless steel. In this work, we developed an electroless nanodiamond (ND)-copper (Cu) coating process to deposit ND on stainless steel parts with the diamond loadings of 0%, 25% and 50% v/v in a Cu matrix. The coated Conflat Flanged Vessel Assemblies (CFVAs) were evaluated on surface morphology, composition, ND distribution, residual hydrogen release, and surface reactivitymore » with deuterium. For as-received Cu and ND-Cu coated CFVAs, hydrogen off-gassing is rapid, and the off-gas rates of H 2 was one to two orders of magnitude higher than that for both untreated and electropolished stainless steel CFVAs, and hydrogen and deuterium reacted to form HD as well. These results indicated that residual H 2 was entrapped in the Cu and ND-Cu coated CFVAs during the coating process, and moisture was adsorbed on the surface, and ND and/or Cu might facilitate catalytic isotope exchange reaction for HD formation. However, hydrocarbons (i.e., CH 3) did not form, and did not appear to be an issue for the Cu and ND-Cu coated CFVAs. After vacuum heating, residual H 2 and adsorbed H 2O in the Cu and ND-Cu coated CFVAs were dramatically reduced. The H 2 off-gassing rate after the vacuum treatment of Cu and 50% ND-Cu coated CFVAs was on the level of 10 -14 l mbar/s cm 2, while H 2O off-gas rate was on the level of 10 -15 l mbar/s cm 2, consistent with the untreated or electropolished stainless steel CFVA, but the HD formation remained. The Restek EP bottle was used as a reference for this work. The Restek Electro-Polished (EP) bottle and their SilTek coated bottles tested under a different research project exhibited very little hydrogen off-gassing and unmeasurable HD formation. ND and Cu were initially chosen to develop improved passivation technology, because Cu has a lower permeability of hydrogen, and diamond is more inert than other materials under a hydrogen atmosphere. However, our tests demonstrated that even after an 8-18 day vacuum extraction heat treatment, the electroless plated Cu and ND-Cu coated stainless steel CFVAs exhibited H 2 off-gassing rates that were just comparable to those for the untreated or electropolished stainless steel CFVA, and the HD formation was still observed. Thus, the Restek Electro-Polished (EP) bottle outperformed the electroless plated Cu and ND-Cu coated stainless steel CFVAs, and the electroless plated nanodiamond coating is not promising as a surface passivation technology. However, the ND-Cu coating may be beneficial to another application in which catalyzing the H 2-D 2 exchange reaction is desired.« less

An experimental investigation of silicon wafer surface roughness and its effect on the full strength of plated metals

NASA Technical Reports Server (NTRS)

Spiers, G. D.

1981-01-01

Plated silicon wafers with surface roughness ranging from 0.4 to 130 microinches were subjected to tensile pull strength tests. Electroless Ni/electroless Cu/electroplated Cu and electroless Ni/electroplated Cu were the two types of plate contacts tested. It was found that smoother surfaces had higher pull strength than rougher, chemically etched surfaces. The presence of the electroless Cu layer was found to be important to adhesion. The mode of fracture of the contact as it left the silicon was studied, and it was found that in almost all cases separation was due to fracture of the bulk silicon phase. The correlation between surface roughness and mode of contact failure is presented and interpreted.

Environmentally friendly electroless plating for Ag/TiO2-coated core-shell magnetic particles using ultrasonic treatment.

PubMed

Kim, Soo-Dong; Choe, Won-Gyun; Jeong, Jong-Ryul

2013-11-01

In this work, high-reflectance brilliant white color magnetic microspheres comprising a Fe/TiO2/Ag core-shell structure with a continuous, uniform compact silver layer were successfully fabricated by TiO2-assisted electroless plating in a simple and eco-friendly method. The coating procedure for TiO2 and Ag involved a sol-gel reaction and electroless plating with ultrasound treatment. The electroless plating step was carried out in an eco-friendly manner in a single process without environmentally toxic additives. The TiO2 layer was used as a modification layer between the Fe microspheres and the silver layer to improve adhesion. A continuous and compact silver layer could be formed with a high degree of morphological control by introducing ultrasonication and adjusting the ammonium hydroxide concentration. Copyright © 2013 Elsevier B.V. All rights reserved.

Superhydrophobic coatings on wood substrate for self-cleaning and EMI shielding

NASA Astrophysics Data System (ADS)

Xing, Yingjie; Xue, Yaping; Song, Jinlong; Sun, Yankui; Huang, Liu; Liu, Xin; Sun, Jing

2018-04-01

A layer of superhydrophobic coating having good electromagnetic shielding and self-cleaning performance was fabricated on a wood surface through an electroless copper plated process. The superhydrophobic property of the wood surface was measured by contact angle (CA) and roll-off angle (RA) measurements. The microstructure and chemical composition of the superhydrophobic coating were analyzed by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and X-ray diffraction (XRD). The analysis revealed that the microscale particles were uniformly distributed on the wood surface and the main component of the coating is metallic copper. The as-prepared Cu coatings on wood substrate exhibit a good superhydrophobicity with water contact angle about 160° and rolling angle less than 5°.

Electroless silver plating on PET fabric initiated by in situ reduction of polyaniline

NASA Astrophysics Data System (ADS)

Mu, Shipeng; Xie, Huayang; Wang, Wei; Yu, Dan

2015-10-01

Novel electroless silver plating poly(ethylene terephthalate) (PET) fabric was prepared by a two-step procedure. In the first step, the in situ polymerized polyaniline (PANI) occurred on the fabric surface in the presence of ammonium persulfate (APS). Then, Ag(0) species reduced from silver nitrate (AgNO3) by in situ reduction of PANI were used as catalyst to initiate electroless silver plating. Hence, this composite material was prepared by conductive polymer combined with electroless plating. The silver layer on PET fabric surface was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy dispersive spectroscopy (EDX) as well as X-ray photoelectron spectroscopy (XPS). The results showed that the silver layer was plated uniformly and compactly with surface resistance about 0.1 Ω/sq on average. The shielding effectiveness (SE) of silver-plated PET fabric was around 50-90 dB, which was considered to have potential applications in electromagnetic shielding materials. Thermogravimetric (TG) analysis was carried out to study thermal stability. The antibacterial tests demonstrated that the silver-plated fabric exhibited excellent antibacterial activity against Staphylococcus aureus and Escherichia coli both with 100%.

A Study on Characterization of Light-Induced Electroless Plated Ni Seed Layer and Silicide Formation for Solar Cell Application

NASA Astrophysics Data System (ADS)

Takaloo, Ashkan Vakilipour; Joo, Seung Ki; Es, Firat; Turan, Rasit; Lee, Doo Won

2018-03-01

Light-induced electroless plating (LIEP) is an easy and inexpensive method that has been widely used for seed layer deposition of Nickel/Copper (Ni/Cu)-based metallization in the solar cell. In this study, material characterization aspects of the Ni seed layer and Ni silicide formation at different bath conditions and annealing temperatures on the n-side of a silicon diode structure have been examined to achieve the optimum cell contacts. The effects of morphology and chemical composition of Ni film on its electrical conductivity were evaluated and described by a quantum mechanical model. It has been found that correlation exists between the theoretical and experimental conductivity of Ni film. Residual stress and phase transformation of Ni silicide as a function of annealing temperature were evaluated using Raman and XRD techniques. Finally, transmission line measurement (TLM) technique was employed to determine the contact resistance of Ni/Si stack after thermal treatment and to understand its correlation with the chemical-structural properties. Results indicated that low electrical resistive mono-silicide (NiSi) phase as low as 5 mΩ.cm2 was obtained.

Developments in convective heat transfer models featuring seamless and selected detail surfaces, employing electroless plating

NASA Technical Reports Server (NTRS)

Stalmach, C. J., Jr.

1975-01-01

Several model/instrument concepts employing electroless metallic skin were considered for improvement of surface condition, accuracy, and cost of contoured-geometry convective heat transfer models. A plated semi-infinite slab approach was chosen for development and evaluation in a hypersonic wind tunnel. The plated slab model consists of an epoxy casting containing fine constantan wires accurately placed at specified surface locations. An electroless alloy was deposited on the plastic surface that provides a hard, uniformly thick, seamless skin. The chosen alloy forms a high-output thermocouple junction with each exposed constantan wire, providing means of determining heat transfer during tunnel testing of the model. A selective electroless plating procedure was used to deposit scaled heatshield tiles on the lower surface of a 0.0175-scale shuttle orbiter model. Twenty-five percent of the tiles were randomly selected and plated to a height of 0.001-inch. The purpose was to assess the heating effects of surface roughness simulating misalignment of tiles that may occur during manufacture of the spacecraft.

Silicon Sheet Growth Development for the Large Area Sheet Task of the Low Cost Solar Array Project. Heat Exchanger Method - Ingot Casting Fixed Abrasive Method - Multi-Wire Slicing

NASA Technical Reports Server (NTRS)

Schmid, F.; Khattak, C. P.

1978-01-01

Solar cells fabricated from HEM cast silicon yielded up to 15% conversion efficiencies. This was achieved in spite of using unpurified graphite parts in the HEM furnace and without optimization of material or cell processing parameters. Molybdenum retainers prevented SiC formation and reduced carbon content by 50%. The oxygen content of vacuum cast HEM silicon is lower than typical Czochralski grown silicon. Impregnation of 45 micrometers diamonds into 7.5 micrometers copper sheath showed distortion of the copper layer. However, 12.5 micrometers and 15 micrometers copper sheath can be impregnated with 45 micrometers diamonds to a high concentration. Electroless nickel plating of wires impregnated only in the cutting edge showed nickel concentration around the diamonds. This has the possibility of reducing kerf. The high speed slicer fabricated can achieve higher speed and longer stroke with vibration isolation.

Activation of amino-based monolayers for electroless metallization of high-aspect-ratio through-silicon vias by using a simple ultrasonic-assisted plating solution

NASA Astrophysics Data System (ADS)

Chen, Sung-Te; Cheng, Yu-Syun; Chang, Yiu-Hsiang; Yang, Tzu-Ming; Lee, Jyun-Ting; Chen, Giin-Shan

2018-05-01

In this paper, we present the method and results of electroless plating of through-silicon via (TSV) contacts using Ni nanoparticle seeds on self-assembled monolayers (SAMs). This approach where the nanoparticles are evenly distributed and stabilized on the SAM allows the successive electroless metallization schemes such as Co-alloy barrier and Cu plug used typically in TSV as interconnects. The seeding was tested on SiO2 layers with surfaces functionalized by an amino-based aminopropyltrimethoxysilane (APTMS) SAM. APTMS-SAM after a suitable SC-1 treatment yielded a remarkably good barrier layer, with high adhesion strength (70 MPa) and low electrical resistivity (28 μΩ-cm). Moreover, the SAM assisted seeding protocol was followed by an ultrasonic-assisted (or mechanically agitated) electroless-plating stage together with a relatively simple plating solution. Conformal plating of Co-alloy barrier and seem/void-free Cu-plug filling into high-aspect-ratio TSVs (>10) was only achieved by using an ultrasonic-assisted plating process. The SAM layers were characterized by X-ray photoelectron spectroscopy to elucidate the surface functionalization effect.

Pd menbrane having improved H.sub.2-permeance, and method of making

DOEpatents

Vanderspurt, Thomas Henry [Glastonbury, CT; She, Ying [Worcester, MA; Dardas, Zissis [Worcester, MA; Walker, Craig [South Glastonbury, CT; MacLeod, James D [Vernon, CT

2011-12-06

An H.sub.2-permeable membrane system (117) comprises an electroless-deposited plating (115) of Pd or Pd alloy on a porous support (110, 110'). The Pd plating comprises face-centered cubic crystals cumulatively having a morphology of hexagonal platelets. The permeability to H.sub.2 of the membrane plating (115) on the porous support is significantly enhanced, being at least greater than about 1.3.times.10.sup.-8 molm.sup.-1s.sup.-Pa.sup.-0.5 at 350.degree. C., and even greater than about 3.4.times.10.sup.-8 molm.sup.-1s.sup.-1Pa.sup.-0.5. The porous support (110, 110') may be stainless steel (1100 and include a thin ceramic interlayer (110') on which the Pd is plated. The method of providing the electroless-deposited plating includes preheating a Pd electroless plating solution to near a plating temperature substantially greater than room temperature, e.g. 60.degree. C., prior to plating.

Efficacy of reducing agent and surfactant contacting pattern on the performance characteristics of nickel electroless plating baths coupled with and without ultrasound.

PubMed

Agarwal, Amrita; Pujari, Murali; Uppaluri, Ramgopal; Verma, Anil

2014-07-01

This article addresses furthering the role of sonication for the optimal fabrication of nickel ceramic composite membranes using electroless plating. Deliberating upon process modifications for surfactant induced electroless plating (SIEP) and combined surfactant and sonication induced electroless plating (SSOEP), this article highlights a novel method of contacting of the reducing agent and surfactant to the conventional electroless nickel plating baths. Rigorous experimental investigations indicated that the combination of ultrasound (in degas mode), surfactant and reducing agent pattern had a profound influence in altering the combinatorial plating characteristics. For comparison purpose, purely surfactant induced nickel ELP baths have also been investigated. These novel insights consolidate newer research horizons for the role of ultrasound to achieve dense metal ceramic composite membranes in a shorter span of total plating time. Surface and physical characterizations were carried out using BET, FTIR, XRD, FESEM and nitrogen permeation experiments. It has been analyzed that the SSOEP baths provided maximum ratio of percent pore densification per unit metal film thickness (PPDδ) and hold the key for further fine tuning of the associated degrees of freedom. On the other hand SIEP baths provided lower (PPDδ) ratio but higher PPD. For SSOEP baths with dropwise reducing agent and bulk surfactant, the PPD and metal film thickness values were 73.4% and 8.4 μm which varied to 66.9% and 13.3 μm for dropwise reducing agent and drop surfactant case. Copyright © 2014 Elsevier B.V. All rights reserved.

INVESTIGATION INTO THE REJUVENATION OF SPENT ELECTROLESS NICKEL BATHS BY ELECTRODIALYSIS

EPA Science Inventory

Electroless nickel plating generates substantially more waste than other metal-finishing processes due to the inherent limited bath life and the need for regular bath disposal. Electrodialysis can be used to generate electroless nickel baths, but poor membrane permselectivity, l...

CURRENT AND EMERGING TECHNOLOGIES FOR EXTENDING THE LIFETIME OF ELECTROLESS NICKEL PLATING BATHS

EPA Science Inventory

The waste treatment and rejuvenation of spent electroless nickel baths has attracted a considerable amount of interest from electroplating shops, electroless nickel suppliers, universities and regulatory agencies due to the finite life of the baths and the associated waste that t...

Making a Lightweight Battery Plaque

NASA Technical Reports Server (NTRS)

Reid, M. A.; Post, R. E.; Soltis, D.

1986-01-01

Plaque formed in porous plastic by electroless plating. Lightweight plaque prepared by electroless plating of porous plastic contains embedded wire or expanded metal grid. Plastic may or may not be filled with soluble pore former. If it contains soluble pore former, treated to remove soluble pore former and increase porosity. Porous plastic then clamped into rig that allows plating solutions to flow through plastic. Lightweight nickel plaque used as electrode substrate for alkaline batteries, chiefly Ni and Cd electrodes, and for use as electrolyte-reservoir plates for fuel cells.

Preparation and characterization of Ni-P/Ni3.1B composite alloy coatings

NASA Astrophysics Data System (ADS)

Wang, Yurong; He, Jiawei; Wang, Wenchang; Shi, Jianhua; Mitsuzaki, Naotoshi; Chen, Zhidong

2014-02-01

The preparation of Ni-P/Ni3.1B composite alloy coating on the surface of copper was achieved by co-deposition of Ni3.1B nanoparticles with Ni-P coating during electroless plating. Ni-P-B alloy coating was obtained by heat-treating the as-plated Ni-P/Ni3.1B composite coating. The effect of the concentration of sodium alginate, borax, thiourea, Ni3.1B, temperature, and pH value on the deposition rate and B content were investigated and determined to be: 30 g L-1, 10 g L-1, 2 mg L-1, 20 mg L-1, 70 °C and 9.0 , respectively. Sodium alginate and thiourea were played as surfactant for coating Ni3.1B nanoparticles and stabilizer for the plating bath, respectively. Ni-P/Ni3.1B composite coating had good performance such as corrosion resistance and solderability.

Reliability of copper wire bonds on a novel over-pad metallization

NASA Astrophysics Data System (ADS)

Kawashiro, Fumiyoshi; Itoh, Satoshi; Maeda, Takehiko; Hirose, Tetsuya; Yajima, Akira; Etoh, Takaki; Nishikawa, Hiroshi

2015-05-01

Wire bonding technology is used in most semiconductor products. Recently, high gold prices have forced semiconductor manufacturers to replace Au wires with Cu wires. Because Cu wire bonds are vulnerable to high temperature and humidity, they remain unpopular in automotive and industrial applications with narrow-bond-pad pitches and small deformed ball diameters. To avoid forming the corrosive Cu-rich intermetallic compound Cu9Al4, the use of a Ni/Pd(/Au) over-pad metallization (OPM) structure produced by electroless plating on the Al metallization has been proposed. However, certain technical issues must be overcome, such as variations in the purity and thickness of the plating. To tackle these issues, a novel OPM structure produced by physical vapor deposition is proposed and evaluated in this study.

High performance fuel electrodes fabricated by electroless plating of copper on BaZr0.8Ce0.1Y0.1O3-δ proton-conducting ceramic

NASA Astrophysics Data System (ADS)

Patki, Neil S.; Way, J. Douglas; Ricote, Sandrine

2017-10-01

The stability of copper at high temperatures in reducing and hydrocarbon-containing atmospheres makes it a good candidate for fabricating fuel electrodes on proton-conducting ceramics, such as BaZr0.9-xCexY0.1O3-δ (BZCY). In this work, the electrochemical performance of Cu-based electrodes fabricated by electroless plating (ELP) on BaZr0.8Ce0.1Y0.1O3-δ is studied with impedance spectroscopy. Three activation catalysts (Pd, Ru, and Cu) are investigated and ELP is compared to a commercial Cu paste (ESL 2312-G) for electrode fabrication. The area specific resistances (ASR) for Pd, Ru, and Cu activations at 700 °C in moist 5% H2 in Ar are 2.1, 3.2, and 13.4 Ω cm2, respectively. That is a 1-2 orders of magnitude improvement over the commercial Cu paste (192 Ω cm2). Furthermore, the ASR has contributions from electrode processes and charge transfer at the electrode/electrolyte interface. Additionally, the morphology of the as-fabricated electrode is unaffected by the activation catalyst. However, heat treatment at 750 °C in H2 for 24 h leads to sintering and large reorganization of the electrode fabricated with Cu activation (micron sized pores seen in the tested sample), while Pd and Ru activations are immune to such reorganization. Thus, Pd and Ru are identified as candidates for future work with improvements to charge transfer required for the former, and better electrode processes required for the latter.

Process for metallization of a substrate by irradiative curing of a catalyst applied thereto

DOEpatents

Chen, Ken S.; Morgan, William P.; Zich, John L.

1999-01-01

An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

Process for metallization of a substrate by curing a catalyst applied thereto

DOEpatents

Chen, Ken S.; Morgan, William P.; Zich, John L.

2002-10-08

An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by heating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface coated with catalyst solution. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

Surface free energy of TiC layers deposited by electrophoretic deposition (EPD)

NASA Astrophysics Data System (ADS)

Gorji, Mohammad Reza; Sanjabi, Sohrab

2018-01-01

In this study porous structure coatings of bare TiC (i.e. 20 nm, 0.7 µm and 5/45 µm) and core-shell structures of TiC/NiP synthesized through electroless plating were deposited by EPD. Room temperature surface free energy (i.e. γs) of TiC and TiC/NiP coatings were determined via measuring contact angles of distilled water and diiodemethane liquids. The effect of Ni-P shell on spreading behavior of pure copper on porous EPD structures was also investigated by high temperature wetting experiments. According to the results existence of a Ni-P layer around the TiC particles has led to roughness (i.e. at least 0.1 µm), and porosity mean length (i.e. at least 1 µm) increase. This might be related to various sizes of TiC agglomerates formed during electroless plating. It has been observed that room temperature γs changed from 44.49 to 54.12 mJ.m-2 as a consequence of particle size enlargement for TiC. The highest and lowest (67.25 and 44.49 mJ.m-2) γs were measured for TiC nanoparticles which showed 1.5 times increase in surface free energy after being plated with Ni-P. It was also observed that plating Ni-P altered non-spreading (θs > 100 o) behavior of TiC to full-spreading ((θs 0o)) which can be useful for preparation of hard coatings by infiltration sintering phenomenon. Zeta potential of EPD suspensions, morphology, phase structure and topography of as-EPD layers were investigated through Zetasizer, field emission scanning electron microscopy (FESEM), X-ray diffraction (XRD) and atomic force microscopy (AFM) instruments respectively.

Morphology of one-time coated palladium-alumina composite membrane prepared by sol-gel process and electroless plating technique

NASA Astrophysics Data System (ADS)

Sari, R.; Dewi, R.; Pardi; Hakim, L.; Diana, S.

2018-03-01

Palladium coated porous alumina ceramic membrane tube was obtained using a combination of sol-gel process and electroless plating technique. The thickness, structure and composition of palladium-alumina composite membrane were analyzed by transmission electron microscopy (TEM), scanning electron microscopy (SEM), energy-dispersive X-ray (EDX), and atomic force microscopy (AFM). Palladium particle size was 6.18 to 7.64 nm. Palladium membrane with thickness of approximately 301.5 to 815.1 nm was formed at the outer surface of the alumina layer. EDX data confirmed the formation of palladium-alumina membrane containing 45% of palladium. From this research it shows the combination of sol-gel process and electroless plating technique with one-time coating can produce a homogeneous and smoother palladium nano layer film on alumina substrate.

The automated array assembly task of the low-cost silicon solar array project, phase 2

NASA Technical Reports Server (NTRS)

Coleman, M. G.; Pryor, R. A.; Sparks, T. G.; Legge, R.; Saltzman, D. L.

1980-01-01

Several specific processing steps as part of a total process sequence for manufacturing silicon solar cells were studied. Ion implantation was identified as the preferred process step for impurity doping. Unanalyzed beam ion implantation was shown to have major cost advantages over analyzed beam implantation. Further, high quality cells were fabricated using a high current unanalyzed beam. Mechanically masked plasma patterning of silicon nitride was shown to be capable of forming fine lines on silicon surfaces with spacings between mask and substrate as great as 250 micrometers. Extensive work was performed on advances in plated metallization. The need for the thick electroless palladium layer was eliminated. Further, copper was successfully utilized as a conductor layer utilizing nickel as a barrier to copper diffusion into the silicon. Plasma etching of silicon for texturing and saw damage removal was shown technically feasible but not cost effective compared to wet chemical etching techniques.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, T.; Hu, M.; Guo, Q.

Here we report a study of printing of electronics using an office use laser printer. The proposed method eliminates those critical disadvantages of solvent-based printing techniques by taking the advantages of electroless deposition and laser printing. The synthesized toner acts as a catalyst for the electroless copper deposition as well as an adhesion-promoting buffer layer between the substrate and deposited copper. The easy metallization of printed patterns and strong metal-substrate adhesion make it an especially effective method for massive production of flexible printed circuits. The proposed process is a high throughput, low cost, efficient, and environmentally benign method for flexiblemore » electronics manufacturing.« less

Application of electroless Ni-P coating on magnesium alloy via CrO3/HF free titanate pretreatment

NASA Astrophysics Data System (ADS)

Rajabalizadeh, Z.; Seifzadeh, D.

2017-11-01

The titanate conversion coating was applied as CrO3/HF free pretreatment for the electroless Ni-P plating on AM60B magnesium alloy. The microscopic images revealed that the alloy surface was completely covered by a cracked conversion film after titanate pretreatment which was mainly composed of Mg(OH)2/MgO, MgF2, TiO2, SiO2, and Al2O3/Al(OH)3. The microscopic images also revealed that numerous Ni nucleation centers were formed over the titanate film after short electroless plating times. The nucleation centers were created not only on the cracked area but also over the whole pretreated surface due to the catalytic action of the titanate film. Also, uniform, dense, and defect-free Ni-P coating with fine structure was achieved after 3 h plating. The Ni-P coating showed mixed crystalline-amorphous structure due to its moderate phosphorus content. The results of two traditional corrosion monitoring methods indicated that the Ni-P coating significantly increases the corrosion resistance of the magnesium alloy. Moreover, Electrochemical Noise (EN) method was used as a non-polarized technique to study the corrosion behavior of the electroless coating at different immersion times. The results of the EN tests were clearly showed the localized nature of the corrosion process. Micro-hardness value of the magnesium alloy was remarkably enhanced after the electroless plating. Finally, suitable adhesion between the Ni-P coating and the magnesium alloy substrate was confirmed by thermal shock and pull-off-adhesion tests.

Study of electroless Ni-W-P alloy coating on martensitic stainless steel

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nikitasari, Arini, E-mail: arini-nikitasari@yahoo.com; Mabruri, Efendi, E-mail: efendi-lipi@yahoo.com

Electroless nickel phospor (Ni-P) is widely used in many industries due to their corrosion and wear resistance, coating uniformity, and ability to coat non-conductive surfaces. The unique properties of tungsten such as high hardness, higher melting point, lower coefficient of linear thermal expansion, and high tensile strength have created a lot of interest in developing ternary Ni-W-P alloys. This article presents the study of electroless Ni-W-P alloys coating using acid or alkaline bath on martensitic stainless steel. Nickel sulfate and sodium tungstate were used as nickel and tungsten sources, respectively, and sodium hypophosphite was used as a reducing agent. Acidmore » or alkaline bath refer to bath pH condition was adjusted by adding sulfuric acid. Martensitic stainless steel was immersed in Ni-W-P bath for 15, 30, and 60 minutes. The substrate of martensitic stainless steel was subjected to pre-treatment (polishing and cleaning) and activation prior to electroless plating. The plating characteristics were investigated for concentration ratio of nickel and hypophosphite (1:3), sodium tungstate concentration 0,1 M, immersion time (15 min, 30 min, 60 min), and bath condition (acid, alkaline). The electroless Ni-W-P plating was heat treated at 400°C for 1 hour. Deposits were characterized using scanning electron microscope (SEM) and corrosion measurement system (CMS).« less

Recovery process for electroless plating baths

DOEpatents

Anderson, Roger W.; Neff, Wayne A.

1992-01-01

A process for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchangers with strong acid cation exchangers. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO.sub.3. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths.

Recovery process for electroless plating baths

DOEpatents

Anderson, R.W.; Neff, W.A.

1992-05-12

A process is described for removing, from spent electroless metal plating bath solutions, accumulated byproducts and counter-ions that have deleterious effects on plating. The solution, or a portion thereof, is passed through a selected cation exchange resin bed in hydrogen form, the resin selected from strong acid cation exchangers and combinations of intermediate acid cation exchangers with strong acid cation exchangers. Sodium and nickel ions are sorbed in the selected cation exchanger, with little removal of other constituents. The remaining solution is subjected to sulfate removal through precipitation of calcium sulfate hemihydrate using, sequentially, CaO and then CaCO[sub 3]. Phosphite removal from the solution is accomplished by the addition of MgO to form magnesium phosphite trihydrate. The washed precipitates of these steps can be safely discarded in nontoxic land fills, or used in various chemical industries. Finally, any remaining solution can be concentrated, adjusted for pH, and be ready for reuse. The plating metal can be removed from the exchanger with sulfuric acid or with the filtrate from the magnesium phosphite precipitation forming a sulfate of the plating metal for reuse. The process is illustrated as applied to processing electroless nickel plating baths. 18 figs.

Characterization and Properties of Electroless Nickel Plated Poly (ethylene terephthalate) Nonwoven Fabric Enhanced by Dielectric Barrier Discharge Plasma Pretreatment

NASA Astrophysics Data System (ADS)

Geng, Yamin; Lu, Canhui; Liang, Mei; Zhang, Wei

2010-12-01

In order to develop a more economical pretreatment method for electroless nickel plating, a dielectric barrier discharge (DBD) plasma at atmospheric pressure was used to improve the hydrophilicity and adhesion of poly (ethylene terephthalate) (PET) nonwoven fabric. The properties of the PET nonwoven fabric including its liquid absorptive capacity (WA), aging behavior, surface chemical composition, morphology of the surface, adhesion strength, surface electrical resistivity and electromagnetic interference (EMI)- shielding effectiveness (SE) were studied. The liquid absorptive capacity (WA) increased due to the incorporation of oxygen-containing and nitrogen-containing functional groups on the surface of PET nonwoven fabric after DBD air-plasma treatment. The surface morphology of the nonwoven fibers became rougher after plasma treatment. Therefore, the surface was more prone to absorb tin sensitizer and palladium catalyst to form an active layer for the deposition of electroless nickel. SEM and X-ray diffraction (XRD) measurements indicated that a uniform coating of nickel was formed on the PET nonwoven fabric. The average EMI-SE of Ni-plating of PET nonwoven fabric maintained a relatively stable value (38.2 dB to 37.3 dB) in a frequency range of 50 MHz to 1500 MHz. It is concluded that DBD is feasible for pretreatment of nonwoven fabric for electroless nickel plating to prepare functional material with good EMI-SE properties.

Integral resistors and capacitors for mixed-signal packages using electroless plating and polymer-ceramic nanocomposites

NASA Astrophysics Data System (ADS)

Chahal, Premjeet

In this work, new approaches to achieving integral resistors and capacitors on large area substrates at low temperatures in a high density wiring (HDW) environment using non-vacuum deposition techniques are introduced. This includes the use of polymer-ceramic nanocomposites for integral capacitors and electroless plating for integral resistors. From the literature review it is believed that resistors in the range of 5--50 ohm/square and capacitors in the range of 1--20 nF/cm2 can satisfy most of the mixed-signal application needs. The proposed materials can satisfy this need as demonstrated in this work. Several test vehicles were fabricated and measured to characterize the material properties, and demonstrate conventional and novel circuits for mixed-signal applications. To begin with, several polymer-ceramic combinations were analyzed under varying conditions to gain a fundamental understanding of the material system. Experimental advances have been made to achieve high dielectric constant values for both epoxy-ceramic and polyimide-ceramic systems. These material systems in general can satisfy specific capacitances in the range of 1--22 nF/cm2. These materials were found to be stable into the GHz range and have low loss-tangent. For electroless resistors, several plating baths were studied and a combination of Ni-P/Ni-W-P was found to produce the best results. Uniform plating was achieved through better nucleation of PdCl2 catalyst through the use of organosilane surface treatment. The Ni-P/Ni-W-P films produced sheet resistance in the range of 5--50 ohm/square and TCR below 50 ppm/°C. The material is stable into the GHz range. Upon optimizing the electrical properties and processing of capacitors and resistors, several test vehicles were fabricated to demonstrate some conventional and novel passive structures for RF and mixed-signal applications (e.g., filters, delay lines, etc.). Some of the structures were modeled using MDS and PSPICE and a good correlation between measured and modeled results were obtained. Capacitors on large area PWB substrates using meniscus coating are also demonstrated with a typical capacitance of 10 nF/cm2. The yield of the capacitor structures is found to be affected by the surface roughness of the bottom copper electrode. Resistors have been demonstrated on 6″ x 6″ substrates using a simple set-up.

Real time monitoring of electroless nickel plating

NASA Astrophysics Data System (ADS)

Rains, Aaron E.; Kline, Ronald A.

2013-01-01

This work deals with the design and manufacturing of the heat and chemical resistant transducer case required for on-line immersion testing, experimental design, data acquisition and signal processing. Results are presented for several depositions with an accuracy of two ten-thousandths of an inch in coating thickness obtained. Monitoring the deposition rate of Electroless Nickel (EN) plating in-situ will provide measurement of the accurate dimensions of the component being plated, in real time. EN is used as for corrosion and wear protection for automotive an - Electroless Nickel (EN) plating is commonly used for corrosion and wear protection for automotive and aerospace components. It plates evenly and symmetrically, theoretically allowing the part to be plated to its final dimension. Currently the standard approach to monitoring the thickness of the deposited nickel is to remove the component from the plating bath and physically measure the part. This can lead to plating problems such as pitting, non-adhesion of the deposit and contamination of the plating solution. The goal of this research effort is to demonstrate that plating thickness can be rapidly and accurately measured using ultrasonic testing. Here a special housing is designed to allow immersion of the ultrasonic transducers directly into the plating bath. An FFT based signal processing algorithm was developed to resolve closely spaced echoes for precise thickness determination. The technique in this research effort was found to be capable of measuring plating thicknesses to within 0.0002 inches. It is expected that this approach will lead to cost savings in many EN plating operations.

Metallization of Kevlar fibers with gold.

PubMed

Little, Brian K; Li, Yunfeng; Cammarata, V; Broughton, R; Mills, G

2011-06-01

Electrochemical gold plating processes were examined for the metallization of Kevlar yarn. Conventional Sn(2+)/Pd(2+) surface activation coupled with electroless Ni deposition rendered the fibers conductive enough to serve as cathodes for electrochemical plating. The resulting coatings were quantified gravimetrically and characterized via adhesion tests together with XRD, SEM, TEM; the coatings effect on fiber strength was also probed. XRD data showed that metallic Pd formed during surface activation whereas amorphous phases and trace amounts of pure Ni metal were plated via the electroless process. Electrodeposition in a thiosulfate bath was the most efficient Au coating process as compared with the analogous electroless procedure, and with electroplating using a commercial cyanide method. Strongly adhering coatings resulted upon metallization with three consecutive electrodepositions, which produced conductive fibers able to sustain power outputs in the range of 1 W. On the other hand, metallization affected the tensile strength of the fiber and defects present in the metal deposits make questionable the effectiveness of the coatings as protective barriers. © 2011 American Chemical Society

ELECTRODIALYSIS AS A TECHNIQUE FOR EXTENDING ELECTROLESS NICKEL BATH LIFE-IMPROVING SELECTIVITY AND REDUCING LOSSES OF VALUABLE BATH COMPONENTS

EPA Science Inventory

Over the last decade electrodialysis has emerged as an effective technique for removing accumulated reactant counterions (sodium and sulfate) and reaction products (orthophosphite) that interfere with the electroless nickel plating process, thus extending bath life by up to 50 me...

A novel process of electroless Ni-P plating with plasma electrolytic oxidation pretreatment

NASA Astrophysics Data System (ADS)

Liu, Zhenmin; Gao, Wei

2006-12-01

A novel Ni based coating - plasma electrolytic oxidation (PEO) pre-treatment followed by electroless nickel (EN) plating - has been developed to produce pore free Ni coatings on AZ91 magnesium alloy. The application of the PEO film between the nickel coating and the substrate acts as an effective barrier and catalytic layer for the subsequent nickel plating. The potentiodynamic tests indicated that the corrosion current density of the PEO + EN plating on AZ91 decreased by almost two orders of magnitudes compared to the traditional EN coating. Salt fog spray testing further proved this improvement. More importantly, the new technique does not use Cr +6 and HF in its pretreatment, therefore is a much environmentally friendlier process.

Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish

NASA Astrophysics Data System (ADS)

Bui, Q. V.; Nam, N. D.; Yoon, J. W.; Choi, D. H.; Kar, A.; Kim, J. G.; Jung, S. B.

2011-09-01

The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability.

Fabrication of a superhydrophobic and high-glossy copper coating on aluminum substrates

NASA Astrophysics Data System (ADS)

Yang, Hao; He, Yuantao; Wu, Zhongqiang; Miao, Jing; Yang, Fang; Lu, Zhong

2018-03-01

Superhydrophobic metal coatings have been extensively studied in recent years because of their significant potential applications. Unfortunately, most of them lost the original metallic luster due to the micro/nano binary structures. In this paper, a facile method was developed to prepare a superhydrophobic and high-glossy copper coating on aluminum substrates. The bionic lotus leaf surfaces were constructed by electroless plating method and further modified with octadecanethiol. The wettability and gloss could be tuned by the concentration of the precursor. With the increase of CuSO4 concentration, the surface roughness of the coating raised, thus resulting in increase of contact angle and decrease of glossiness. When the CuSO4 concentration was 30 mmol/L, the coating exhibited a sub-micro/nano binary structure, in which 20-30 nm protuberances were grown on 300-500 nm mastoids. Such special morphology endowed the coating with superhydrophobic and high-glossy properties, and the coating also showed ultra-low water adhesion and stable dynamic water repellence.

Aluminum transfer method for plating plastics

NASA Technical Reports Server (NTRS)

Goodrich, W. D.; Stalmach, C. J., Jr.

1977-01-01

Electroless plating technique produces plate of uniform thickness. Hardness and abrasion resistance can be increased further by heat treatment. Method results in seamless coating over many materials, has low thermal conductivity, and is relatively inexpensive compared to conventional methods.

Preparation of cuxinygazsen precursor films and powders by electroless deposition

DOEpatents

Bhattacharya, Raghu N.; Batchelor, Wendi Kay; Wiesner, Holm; Ramanathan, Kannan; Noufi, Rommel

1999-01-01

A method for electroless deposition of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) precursor films and powders onto a metallic substrate comprising: preparing an aqueous bath solution of compounds selected from the group consisting of: I) a copper compound, a selenium compound, an indium compound and gallium compound; II) a copper compound, a selenium compound and an indium compound; III) a selenium compound, and indium compound and a gallium compound; IV) a selenium compound and a indium compound; and V) a copper compound and selenium compound; each compound being present in sufficient quantity to react with each other to produce Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3); adjusting the pH of the aqueous bath solution to an acidic value by the addition of a dilute acid; and initiating an electroless reaction with an oxidizing counterelectrode for a sufficient time to cause a deposit of Cu.sub.x In.sub.y Ga.sub.z Se.sub.n (x=0-2, y=0-2, z=0-2, n=0-3) from the aqueous bath solution onto a metallic substrate.

Selective electroless plating of 3D-printed plastic structures for three-dimensional microwave metamaterials

NASA Astrophysics Data System (ADS)

Ishikawa, Atsushi; Kato, Taiki; Takeyasu, Nobuyuki; Fujimori, Kazuhiro; Tsuruta, Kenji

2017-10-01

A technique of selective electroless plating onto PLA-ABS (Polylactic Acid-Acrylonitrile Butadiene Styrene) composite structures fabricated by three-dimensional (3D) printing is demonstrated to construct 3D microwave metamaterials. The reducing activity of the PLA surface is selectively enhanced by the chemical modification involving Sn2+ in a simple wet process, thereby forming a highly conductive Ag-plated membrane only onto the PLA surface. The fabricated metamaterial composed of Ag-plated PLA and non-plated ABS parts is characterized experimentally and numerically to demonstrate the important bi-anisotropic microwave responses arising from the 3D nature of metallodielectric structures. Our approach based on a simple wet chemical process allows for the creation of highly complex 3D metal-insulator structures, thus paving the way toward the sophisticated microwave applications of the 3D printing technology.

Aeroheating model advancements featuring electroless metallic plating

NASA Technical Reports Server (NTRS)

Stalmach, C. J., Jr.; Goodrich, W. D.

1976-01-01

Discussed are advancements in wind tunnel model construction methods and hypersonic test data demonstrating the methods. The general objective was to develop model fabrication methods for improved heat transfer measuring capability at less model cost. A plated slab model approach was evaluated with cast models containing constantan wires that formed single-wire-to-plate surface thermocouple junctions with a seamless skin of electroless nickel alloy. The surface of a space shuttle orbiter model was selectively plated with scaled tiles to simulate, with high fidelity, the probable misalignments of the heatshield tiles on a flight vehicle. Initial, Mach 8 heating results indicated a minor effect of tile misalignment roughness on boundary layer transition, implying a possible relaxation of heatshield manufacturing tolerances. Some loss of the plated tiles was experienced when the model was tested at high heating rates.

Enhanced Dissolution of Platinum Group Metals Using Electroless Iron Deposition Pretreatment

NASA Astrophysics Data System (ADS)

Taninouchi, Yu-ki; Okabe, Toru H.

2017-12-01

In order to develop a new method for efficiently recovering platinum group metals (PGMs) from catalyst scraps, the authors investigated an efficient dissolution process where the material was pretreated by electroless Fe deposition. When Rh-loaded alumina powder was kept in aqua regia at 313 K (40 °C) for 30 to 60 minutes, the Rh hardly dissolved. Meanwhile, after electroless Fe plating using a bath containing sodium borohydride and potassium sodium tartrate as the reducing and complexing agents, respectively, approximately 60 pct of Rh was extracted by aqua regia at 313 K (40 °C) after 30 minutes. Furthermore, when heat treatment was performed at 1200 K (927 °C) for 60 minutes in vacuum after electroless plating, the extraction of Rh approached 100 pct for the same leaching conditions. The authors also confirmed that the Fe deposition pretreatment enhanced the dissolution of Pt and Pd. These results indicate that an effective and environmentally friendly process for the separation and extraction of PGMs from catalyst scraps can be developed utilizing this Fe deposition pretreatment.

Friction Stir Processing of Copper-Coated SiC Particulate-Reinforced Aluminum Matrix Composite

PubMed Central

Huang, Chih-Wei; Aoh, Jong-Ning

2018-01-01

In the present work, we proposed a novel friction stir processing (FSP) to produce a locally reinforced aluminum matrix composite (AMC) by stirring copper-coated SiC particulate reinforcement into Al6061 alloy matrix. Electroless-plating process was applied to deposit the copper surface coating on the SiC particulate reinforcement for the purpose of improving the interfacial adhesion between SiC particles and Al matrix. The core-shell SiC structure provides a layer for the atomic diffusion between aluminum and copper to enhance the cohesion between reinforcing particles and matrix on one hand, the dispersion of fine copper in the Al matrix during FSP provides further dispersive strengthening and solid solution strengthening, on the other hand. Hardness distribution and tensile results across the stir zone validated the novel concept in improving the mechanical properties of AMC that was realized via FSP. Optical microscope (OM) and Transmission Electron Microscopy (TEM) investigations were conducted to investigate the microstructure. Energy dispersive spectrometer (EDS), electron probe micro-analyzer (EPMA), and X-ray diffraction (XRD) were explored to analyze the atomic inter-diffusion and the formation of intermetallic at interface. The possible strengthening mechanisms of the AMC containing Cu-coated SiC particulate reinforcement were interpreted. The concept of strengthening developed in this work may open a new way of fabricating of particulate reinforced metal matrix composites. PMID:29652846

Nanostructured copper-coated solid-phase microextraction fiber for gas chromatographic analysis of dibutyl phthalate and diethylhexyl phthalate environmental estrogens.

PubMed

Feng, Juanjuan; Sun, Min; Bu, Yanan; Luo, Chuannan

2015-01-01

A novel nanostructured copper-based solid-phase microextraction fiber was developed and applied for determining the two most common types of phthalate environmental estrogens (dibutyl phthalate and diethylhexyl phthalate) in aqueous samples, coupled to gas chromatography with flame ionization detection. The copper film was coated onto a stainless-steel wire via an electroless plating process, which involved a surface activation process to improve the surface properties of the fiber. Several parameters affecting extraction efficiency such as extraction time, extraction temperature, ionic strength, desorption temperature, and desorption time were optimized by a factor-by-factor procedure to obtain the highest extraction efficiency. The as-established method showed wide linear ranges (0.05-250 μg/L). Precision of single fiber repeatability was <7.0%, and fiber-to-fiber repeatability was <10%. Limits of detection were 0.01 μg/L. The proposed method exhibited better or comparable extraction performance compared with commercial and other lab-made fibers, and excellent thermal stability and durability. The proposed method was applied successfully for the determination of model analytes in plastic soaking water. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

40 CFR 413.71 - Specialized definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... deposition of conductive material from an autocatalytic plating solution without application of electrical current. (c) The term operation shall mean any step in the electroless plating process in which a metal is...

Method for regeneration of electroless nickel plating solution

DOEpatents

Eisenmann, Erhard T.

1997-01-01

An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorous acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution.

Method for regeneration of electroless nickel plating solution

DOEpatents

Eisenmann, E.T.

1997-03-11

An electroless nickel(EN)/hypophosphite plating bath is provided employing acetic acid/acetate as a buffer and which is, as a result, capable of perpetual regeneration while avoiding the production of hazardous waste. A regeneration process is provided to process the spent EN plating bath solution. A concentrated starter and replenishment solution is provided for ease of operation of the plating bath. The regeneration process employs a chelating ion exchange system to remove nickel cations from spent EN plating solution. Phosphites are then removed from the solution by precipitation. The nickel cations are removed from the ion exchange system by elution with hypophosphorus acid and the nickel concentration of the eluate adjusted by addition of nickel salt. The treated solution and adjusted eluate are combined, stabilizer added, and the volume of resulting solution reduced by evaporation to form the bath starter and replenishing solution. 1 fig.

Electroless plating apparatus for discrete microsized particles

DOEpatents

Mayer, Anton

1978-01-01

Method and apparatus are disclosed for producing very uniform coatings of a desired material on discrete microsized particles by electroless techniques. Agglomeration or bridging of the particles during the deposition process is prevented by imparting a sufficiently random motion to the particles that they are not in contact with each other for a time sufficient for such to occur.

Method for conducting electroless metal-plating processes

DOEpatents

Petit, George S.; Wright, Ralph R.

1978-01-01

This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

Template-Free Electroless Plating of Gold Nanowires: Direct Surface Functionalization with Shape-Selective Nanostructures for Electrochemical Applications.

PubMed

Muench, Falk; Schaefer, Sandra; Hagelüken, Lorenz; Molina-Luna, Leopoldo; Duerrschnabel, Michael; Kleebe, Hans-Joachim; Brötz, Joachim; Vaskevich, Alexander; Rubinstein, Israel; Ensinger, Wolfgang

2017-09-13

Metal nanowires (NWs) represent a prominent nanomaterial class, the interest in which is fueled by their tunable properties as well as their excellent performance in, for example, sensing, catalysis, and plasmonics. Synthetic approaches to obtain metal NWs mostly produce colloids or rely on templates. Integrating such nanowires into devices necessitates additional fabrication steps, such as template removal, nanostructure purification, or attachment. Here, we describe the development of a facile electroless plating protocol for the direct deposition of gold nanowire films, requiring neither templates nor complex instrumentation. The method is general, producing three-dimensional nanowire structures on substrates of varying shape and composition, with different seed types. The aqueous plating bath is prepared by ligand exchange and partial reduction of tetrachloroauric acid in the presence of 4-dimethylaminopyridine and formaldehyde. Gold deposition proceeds by nucleation of new grains on existing nanostructure tips and thus selectively produces curvy, polycrystalline nanowires of high aspect ratio. The nanofabrication potential of this method is demonstrated by producing a sensor electrode, whose performance is comparable to that of known nanostructures and discussed in terms of the catalyst architecture. Due to its flexibility and simplicity, shape-selective electroless plating is a promising new tool for functionalizing surfaces with anisotropic metal nanostructures.

Replicate Wolter-I x-ray mirrors

NASA Technical Reports Server (NTRS)

Engelhaupt, D. E.; Rood, R.; Fawcett, S.; Griffith, C.; Khanijow, R.

1994-01-01

Cylindrical (hyperbolic - parabolic Wolter I) mirrors have been electroformed from nickel over an electroless nickel-phosphorous (NiP) plated aluminum mandrel in support of the NASA AXAF-S x-ray spectrometer program. The electroless nickel was diamond turned and polished to achieve a surface finish of 10 angstroms rms or better. Gold was then plated on the nickel alloy after an electrochemical passivation step. Next a heavy layer of pure nickel was plated one millimeter thick with controlled stress at zero using a commercial PID program to form the actual mirror. This shell was removed from the NiP alloy coated mandrel by cryogenic cooling and contraction of the aluminum to release the mirror. It is required that the gold not adhere well to the NiP but all other plated coatings must exhibit good adherence. Four mirrors were fabricated from two mandrels prepared by this method. The area of each part is 0.7 square meters (7.5 square feet).

Palladium nanoparticle deposition via precipitation: a new method to functionalize macroporous silicon

PubMed Central

Scheen, Gilles; Bassu, Margherita; Douchamps, Antoine; Zhang, Chao; Debliquy, Marc; Francis, Laurent A

2014-01-01

We present an original two-step method for the deposition via precipitation of Pd nanoparticles into macroporous silicon. The method consists in immersing a macroporous silicon sample in a PdCl2/DMSO solution and then in annealing the sample at a high temperature. The impact of composition and concentration of the solution and annealing time on the nanoparticle characteristics is investigated. This method is compared to electroless plating, which is a standard method for the deposition of Pd nanoparticles. Scanning electron microscopy and computerized image processing are used to evaluate size, shape, surface density and deposition homogeneity of the Pd nanoparticles on the pore walls. Energy-dispersive x-ray spectroscopy (EDX) and x-ray photoelectron spectroscopy (XPS) analyses are used to evaluate the composition of the deposited nanoparticles. In contrast to electroless plating, the proposed method leads to homogeneously distributed Pd nanoparticles along the macropores depth with a surface density that increases proportionally with the PdCl2 concentration. Moreover EDX and XPS analysis showed that the nanoparticles are composed of Pd in its metallic state, while nanoparticles deposited by electroless plating are composed of both metallic Pd and PdOx. PMID:27877732

Additive and Photochemical Manufacturing of Copper

PubMed Central

Yung, Winco K. C.; Sun, Bo; Meng, Zhengong; Huang, Junfeng; Jin, Yingdi; Choy, Hang Shan; Cai, Zhixiang; Li, Guijun; Ho, Cheuk Lam; Yang, Jinlong; Wong, Wai Yeung

2016-01-01

In recent years, 3D printing technologies have been extensively developed, enabling rapid prototyping from a conceptual design to an actual product. However, additive manufacturing of metals in the existing technologies is still cost-intensive and time-consuming. Herein a novel platform for low-cost additive manufacturing is introduced by simultaneously combining the laser-induced forward transfer (LIFT) method with photochemical reaction. Using acrylonitrile butadiene styrene (ABS) polymer as the sacrificial layer, sufficient ejection momentum can be generated in the LIFT method. A low-cost continuous wave (CW) laser diode at 405 nm was utilized and proved to be able to transfer the photochemically synthesized copper onto the target substrate. The wavelength-dependent photochemical behaviour in the LIFT method was verified and characterized by both theoretical and experimental studies compared to 1064 nm fiber laser. The conductivity of the synthesized copper patterns could be enhanced using post electroless plating while retaining the designed pattern shapes. Prototypes of electronic circuits were accordingly built and demonstrated for powering up LEDs. Apart from pristine PDMS materials with low surface energies, the proposed method can simultaneously perform laser-induced forward transfer and photochemical synthesis of metals, starting from their metal oxide forms, onto various target substrates such as polyimide, glass and thermoplastics. PMID:28000733

Additive and Photochemical Manufacturing of Copper

NASA Astrophysics Data System (ADS)

Yung, Winco K. C.; Sun, Bo; Meng, Zhengong; Huang, Junfeng; Jin, Yingdi; Choy, Hang Shan; Cai, Zhixiang; Li, Guijun; Ho, Cheuk Lam; Yang, Jinlong; Wong, Wai Yeung

2016-12-01

In recent years, 3D printing technologies have been extensively developed, enabling rapid prototyping from a conceptual design to an actual product. However, additive manufacturing of metals in the existing technologies is still cost-intensive and time-consuming. Herein a novel platform for low-cost additive manufacturing is introduced by simultaneously combining the laser-induced forward transfer (LIFT) method with photochemical reaction. Using acrylonitrile butadiene styrene (ABS) polymer as the sacrificial layer, sufficient ejection momentum can be generated in the LIFT method. A low-cost continuous wave (CW) laser diode at 405 nm was utilized and proved to be able to transfer the photochemically synthesized copper onto the target substrate. The wavelength-dependent photochemical behaviour in the LIFT method was verified and characterized by both theoretical and experimental studies compared to 1064 nm fiber laser. The conductivity of the synthesized copper patterns could be enhanced using post electroless plating while retaining the designed pattern shapes. Prototypes of electronic circuits were accordingly built and demonstrated for powering up LEDs. Apart from pristine PDMS materials with low surface energies, the proposed method can simultaneously perform laser-induced forward transfer and photochemical synthesis of metals, starting from their metal oxide forms, onto various target substrates such as polyimide, glass and thermoplastics.

Study on micro-hardness of electroless composite plating of Ni-P with SiC Nano-particles

NASA Astrophysics Data System (ADS)

Sun, Yong; Zhang, Zhaoguo; Li, Jiamin; Xu, Donghui

2007-07-01

In this paper, a Ni-P electroless composite coating containing nano SiC particles was produced. The wearability of the composite coating was studied. Temperature, PH of the plating liquid and the concentration of SiC nanoparticles in the plating liquid were taken as parameters and the experiment with three factors and five levels was designed through the method of quadratic orthogonal rotation combination. SiC nanoparticles were dispersed by ultrasonic. The influence of the testing parameters on the hardness of the coating was studied intensively. The optimal parameters were obtained when the temperature is 86+/-1°C, PH is 6+/-0.5 and the concentration of SiC nanoparticles is 6g/L. The maximal hardness of the coating is over 1700HV after heat treatment.

Process for electroless deposition of metals on zirconium materials

DOEpatents

Donaghy, Robert E.

1978-01-01

A process for the electroless deposition of a metal layer on an article comprised of zirconium or a zirconium alloy is disclosed. The article is activated in an aged aqueous solution comprising from about 10 to about 20 grams per liter ammonium bifluoride and from about 0.75 to about 2 grams per liter of sulfuric acid. The solution is aged by immersion of pickled zirconium in the solution for at least about 10 minutes. The loosely adhering film formed on the article in the activating step is removed and the article is contacted with an electroless plating solution containing the metal to be deposited on the article upon sufficient contact with the article.

Fabrication of Pd Micro-Membrane Supported on Nano-Porous Anodized Aluminum Oxide for Hydrogen Separation.

PubMed

Kim, Taegyu

2015-08-01

In the present study, nano-porous anodized aluminum oxide (AAO) was used as a support of the Pd membrane. The AAO fabrication process consists of an electrochemical polishing, first/second anodizing, barrier layer dissolving and pores widening. The Pd membrane was deposited on the AAO support using an electroless plating with ethylenediaminetetraacetic acid (EDTA) as a plating agent. The AAO had the regular pore structure with the maximum pore diameter of ~100 nm so it had a large opening area but a small free standing area. The 2 µm-thick Pd layer was obtained by the electroless plating for 3 hours. The Pd layer thickness increased with increasing the plating time. However, the thickness was limited to ~5 µm in maximum. The H2 permeation flux was 0.454 mol/m2-s when the pressure difference of 66.36 kPa0.5 was applied at the Pd membrane under 400 °C.

Plating methods, a survey

NASA Technical Reports Server (NTRS)

Berkowitz, J. B.; Emerson, N. H.

1972-01-01

Results are presented of a comprehensive search of the literature available, much of which has been generated by the research centers of NASA and its contractors, on plating and coating methods and techniques. Methods covered included: (1) electroplating from aqueous solutions; (2) electroplating from nonaqueous solutions; (3) electroplating from fused-salt baths; (4) electroforming; (5) electroless plating, immersion plating, and mirroring; (6) electroplating from gaseous plasmas; and (7) anodized films and conversion coatings.

Flexible metal patterning in glass microfluidic structures using femtosecond laser direct-write ablation followed by electroless plating

NASA Astrophysics Data System (ADS)

Xu, Jian; Midorikawa, Katsumi; Sugioka, Koji

2014-03-01

A simple and flexible technique for integrating metal micropatterns into glass microfluidic structures based on threedimensional femtosecond laser microfabrication is presented. Femtosecond laser direct writing followed by thermal treatment and successive chemical etching allows us to fabricate three-dimensional microfluidic structures such as microchannels and microreservoirs inside photosensitive glass. Then, the femtosecond laser direct-write ablation followed by electroless metal plating enables space-selective deposition of patterned metal films on desired locations of internal walls of the fabricated microfluidic structures. The developed technique is applied to integrate a metal microheater into a glass microchannel to control the temperature of liquid samples in the channel, which can be used as a microreactor for enhancement of chemical reactions.

Electroless Plating of Copper on Polyimide Film Modified by 50 Hz Plasma Graft Polymerization with 1-Vinylimidazole

NASA Astrophysics Data System (ADS)

Wong, Chiow San; Lem, Hon Pong; Goh, Boon Tong; Wong, Cin Wie

2009-03-01

This paper reports on the proof of concept work on the novel process of producing metalized polyimide (PI) film by coating a layer of copper (Cu) thin film on the surface of the PI film without using any adhesive. The method which is employed to produce a metalized PI film used in flexible printed circuit (FPC) is based on plasma graft polymerization of 1-vinlyimidazole (VIDz) on plasma pre-treated PI surface. The plasma grafted PI film (VIDz-g-PI) surfaces are characterized by X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and scanning electron microscopy (SEM). AFM results show that the PI film surface has been successfully treated and grafted with VIDz. As post-thermal treatment is known to promote adhesion strength between the metallic film and the PI surface, the effects of post-thermal treatment environment and temperature on the adhesion property of Cu plated VIDz-g-PI (Cu/VIDz-g-PI) are evaluated. Post-thermal treatment in air shows better adhesion strength than in vacuum. The adhesion strength decreases as the post-thermal treatment temperature is increased. In the present development work, the adhesion strength obtained has met the initial market targeted 9-10 N/cm adhesion strength. Samples obtained at a pre-selected plasma power and time window are able to maintain their adhesion strength after being subjected to ageing at 100 °C for 168 h.

Broadband infrared absorption enhancement by electroless-deposited silver nanoparticles

NASA Astrophysics Data System (ADS)

Gritti, Claudia; Raza, Søren; Kadkhodazadeh, Shima; Kardynal, Beata; Malureanu, Radu; Mortensen, N. Asger; Lavrinenko, Andrei V.

2017-01-01

Decorating semiconductor surfaces with plasmonic nanoparticles (NPs) is considered a viable solution for enhancing the absorptive properties of photovoltaic and photodetecting devices. We propose to deposit silver NPs on top of a semiconductor wafer by a cheap and fast electroless plating technique. Optical characterization confirms that the random array of electroless-deposited NPs improves absorption by up to 20% in a broadband of near-infrared frequencies from the bandgap edge to 2000 nm. Due to the small filling fraction of particles, the reflection in the visible range is practically unchanged, which points to the possible applications of such deposition method for harvesting photons in nanophotonics and photovoltaics. The broadband absorption is a consequence of the resonant behavior of particles with different shapes and sizes, which strongly localize the incident light at the interface of a high-index semiconductor substrate. Our hypothesis is substantiated by examining the plasmonic response of the electroless-deposited NPs using both electron energy loss spectroscopy and numerical calculations.

CLOSED-LOOP TREATMENT OF ELECTROLYTIC AND ELECTROLESS NICKEL RINSE WATER BY POINT-OF-USE ION EXCHANGE: A CASE STUDY

EPA Science Inventory

Many recent pilot tests have demonstrated the benefits and cost effectiveness of point-of-use treatment technologies as opposed to centralized wastewater treatment for all sizes of plating facilities. A 9-month case study at a small plating facility in Cincinnati, OH utilizing po...

A novel method of reducing agent contacting pattern for metal ceramic composite membrane fabrication

NASA Astrophysics Data System (ADS)

Agarwal, Amrita; Pujari, Murali; Uppaluri, Ramgopal; Verma, Anil

2014-11-01

Deliberating upon process modifications for surfactant induced electroless plating (SIEP), this article highlights the plating bath performance characteristics for two distinct reducing agent contacting modes (bulk and drop wise). Eventually, the effect of reducing agent concentration (50, 100, 200% excess) suitable for electroless plating bath for a nickel concentration of 0.08 mol/L was investigated. Finally, the compatibility of variation in nickel concentration (0.08-0.24 mol/L) with respect to variation in reducing agent concentration (50, 100, 200% excess) was investigated. LPSA, BET, FTIR, XRD, FESEM and nitrogen permeation experiments were used for surface and physical characterization. It was observed that for the bulk addition of reducing agent, the PPD values were 84.5% which increased to 89.3% for dropwise addition case. Thus the optimal combinations of SIEP process parameters were identified as 0.08 mol/L of nickel metal solution concentration with 100% excess drop-wise reducing agent. These conditions provided a plating rate of 5.5 × 10-5 mol/m2 s, PPD of 89.3% and a metal film thickness of 15.7 μm respectively after 12 h of sequential plating.

Study of Nickel Silicide as a Copper Diffusion Barrier in Monocrystalline Silicon Solar Cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kale, Abhijit; Beese, Emily; Saenz, Theresa

NiSi as a conductive diffusion barrier to silicon has been studied. We demonstrate that the NiSi films formed using the single step annealing process are as good as the two step process using XRD and Raman. Quality of NiSi films formed using e-beam Ni and electroless Ni process has been compared. Incomplete surface coverage and presence of constituents other than Ni are the main challenges with electroless Ni. We also demonstrate that Cu reduces the thermal stability of NiSi films. The detection of Cu has proven to be difficult due to temperature limitations.

40 CFR 63.11505 - What parts of my plant does this subpart cover?

Code of Federal Regulations, 2010 CFR

2010-07-01

... electroplating; electroforming; electropolishing; electroless plating or other non-electrolytic metal coating... Chromium Electroplating and Chromium Anodizing Tanks). (2) Research and development process units, as...

Collection of Ni-bearing material from electroless plating waste by magnetic separation with HTS bulk magnet

NASA Astrophysics Data System (ADS)

Oka, T.; Fukazawa, H.; Fukui, S.; Ogawa, J.; Sato, T.; Ooizumi, M.; Tsujimura, M.; Yokoyama, K.

2014-01-01

The magnetic separation experiment to collect the Ni compounds from the waste liquid of electroless plating processes was conducted in the open-gradient magnetic separation process with the high temperature superconducting bulk magnet system. The magnetic pole containing Gd-based bulk superconductors was activated to 3.45 T at 35 K in the static magnetic field of 5 T with use of a superconducting solenoid magnet. The coarse Ni-sulfate crystals were formed by adding the concentrated sulfuric acid to the Ni-phosphite precipitates which yielded from the plating waste liquid by controlling the temperature and the pH value. The open-gradient magnetic separation technique was employed to separate the Ni-sulfate crystals from the mixture of the Ni-sulfate and Ni-phosphite compounds by the difference between their magnetic properties. And we succeeded in collecting Ni-sulfate crystals preferentially to the Ni-phosphite by attracting them to the magnetic pole soon after the Ni-sulfate crystals began to grow.

An experimental investigation of microstrip properties on soft substrates from 2 to 40 GHz

NASA Technical Reports Server (NTRS)

Romanofsky, R. R.; Bhasin, K. B.; Ponchak, G. E.; Downey, A. N.; Connolly, D. J.

1985-01-01

Dispersion and loss characteristics of microstrip lines on 10 mil and 31 mil electrodeposited and electroless copper clad-Teflon substrates were experimentally obtained from 2 to 40 GHz. The roles of surface roughness and radiation in total loss were examined.

MODIFICATIONS TO REDUCE DRAG OUT AT A PRINTED CIRCUIT BOARD MANUFACTURER

EPA Science Inventory

This MnTAP/EPA Waste Reduction Innovative Technology Evaluation project at Micom, Inc., demonstrated the waste reducing capability of two simple rinsing modifications on an etchant and an electroless copper process. he simple, tow (or no) cost, low technology changes that were ma...

Brazing method

DOEpatents

McCormick, James T.; Ferry, Paul B.; Hall, John C.

1981-10-06

There is disclosed a positive cathode electrode structure formed by brazing a thin porous membrane to a backing material by preselecting a predetermined area of the thin porous membrane and thereafter providing a braze flow barrier throughout the remainder of the membrane and electrolessly plating a nickel-phosphide alloy on the backing material, or in this case the honeycomb structure. The preselected area of the thin porous membrane is placed in intimate contact with the electrolessly plated portion of the backing material and heated to elevated temperatures in the absence of oxygen to form a brazed joint limited to a preselected area. If the braze flow barrier is provided by application of a liquid organic solvent, then the organic solvent is driven off by maintaining the thin porous membrane at elevated temperatures for an extended period of time prior to the brazing operation.

Electroless plating of Ni-B film as a binder-free highly efficient electrocatalyst for hydrazine oxidation

NASA Astrophysics Data System (ADS)

Wen, Xiao-Ping; Dai, Hong-Bin; Wu, Lin-Song; Wang, Ping

2017-07-01

Hydrazine is a promising energy carrier for fuel cells owing to its combined advantages of high theoretical cell voltage, high-power density, and no greenhouse gas emission. By using an electroless plating process, we have prepared a robust Ni-B film grown on Ni foam that is highly effective for hydrazine electrooxidation in alkaline media. The effects of reaction temperature, concentrations of hydrous hydrazine and sodium hydroxide in the fuel solution on performance of hydrazine electrooxidation reaction are investigated. The mechanistic reason for the property advantage of as-prepared Ni-B/Ni foam catalyst over the relevant catalysts is discussed based on careful kinetics studies and characterization. The facile synthesis of Ni-based catalyst with high activity and good stability is of clear significance for the development of hydrous hydrazine as a viable energy carrier.

Silver nanoparticles-coated glass frits for silicon solar cells

NASA Astrophysics Data System (ADS)

Li, Yingfen; Gan, Weiping; Li, Biyuan

2016-04-01

Silver nanoparticles-coated glass frit composite powders for silicon solar cells were prepared by electroless plating. Silver colloids were used as the activating agent of glass frits. The products were characterized by X-ray diffraction, scanning electron microscopy, and differential scanning calorimetry. The characterization results indicated that silver nanoparticles with the melting temperature of 838 °C were uniformly deposited on glass frit surface. The particle size of silver nanoparticles could be controlled by adjusting the [Ag(NH3)2]NO3 concentration. The as-prepared composite powders were applied in the front side metallization of silicon solar cells. Compared with those based on pure glass frits, the solar cells containing the composite powders had the denser silver electrodes and the better silver-silicon ohmic contacts. Furthermore, the photovoltaic performances of solar cells were improved after the electroless plating.

Fabrication and characterization of Ni-decorated h-BN powders with ChCl-EG ionic liquid as addition by electroless deposition

NASA Astrophysics Data System (ADS)

Yang, Qionglian; Ru, Juanjian; Song, Peng; Hu, Mingyu; Feng, Jing

2018-05-01

Ni-decorated h-BN powders are fabricated with ChCl-EG as additive via electroless plating in the paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0 g l-1, 30 g l-1, 60 g l-1, 90 g l-1) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders and the residual Ni2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30 g l-1, the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10-1000 nm. It can be found that 30 g l-1 ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of nickel plating times, which is characterized with scanning electron microscope and transmission electron microscope. Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.

Fabrication and characterization of Ni-decorated h-BN powders with ChCl-EG ionic liquid as addition by electroless deposition.

PubMed

Yang, Qionglian; Ru, Juanjian; Song, Peng; Hu, Mingyu; Feng, Jing

2018-05-01

Ni-decorated h-BN powders are fabricated with ChCl-EG as additive via electroless plating in the paper. As comparison, the different additive concentration of choline chloride-ethylene glycol (ChCl-EG) ionic liquid (0 g l -1 , 30 g l -1 , 60 g l -1 , 90 g l -1 ) is presented. The effects of ChCl-EG concentration are studied, including the surface morphologies, phase analysis of Ni-decorated h-BN powders and the residual Ni 2+ concentration is measured in electroless plating bath. It is demonstrated that the deposition phenomena of nickel particles on h-BN surface is changed with the addition of ChCl-EG. When the concentration of ChCl-EG is 30 g l -1 , the Ni particles on h-BN surface are in dispersed and spheroid state with the average size of 10-1000 nm. It can be found that 30 g l -1 ChCl-EG is conducive to the arise of deposition phenomena, which is the formation of the single nickel particle on h-BN surface. Besides, more Ni particles are deposited on h-BN surface with the increase of nickel plating times, which is characterized with scanning electron microscope and transmission electron microscope. Furthermore, the deposition phenomenon and growth mechanism are proposed without and with ChCl-EG as additive to further elaborate the formation of Ni particles on h-BN surface.

Preparation and corrosion resistance of electroless Ni-P/SiC functionally gradient coatings on AZ91D magnesium alloy

NASA Astrophysics Data System (ADS)

Wang, Hui-Long; Liu, Ling-Yun; Dou, Yong; Zhang, Wen-Zhu; Jiang, Wen-Feng

2013-12-01

In this paper, the protective electroless Ni-P/SiC gradient coatings on AZ91D magnesium alloy substrate were successfully prepared. The prepared Ni-P/SiC gradient coatings were characterized for its microstructure, morphology, microhardness and adhesion to the substrate. The deposition reaction kinetics was investigated and an empirical rate equation for electroless Ni-P/SiC plating on AZ91D magnesium alloy was developed. The anticorrosion properties of the Ni-P/SiC gradient coatings in 3.5 wt.% NaCl solution were evaluated by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) studies. The potentiodynamic polarization measurements revealed that the SiC concentration in the bath and heat treatment can influence the corrosion protection performance of electroless deposited Ni-P/SiC gradient coatings. EIS studies indicated that higher charge transfer resistance and slightly lower capacitance values were obtained for Ni-P/SiC gradient coatings compared to Ni-P coatings. The corrosion resistance of the Ni-P/SiC gradient coatings increases initially and decreases afterwards with the sustained increasing of immersion time in the aggressive medium. The electroless Ni-P/SiC gradient coatings can afford better corrosion protection for magnesium alloy substrate compared with Ni-P coatings.

APPLICATION OF ELECTROLESS-NICKEL BRAZING TO TUBULAR FUEL ELEMENTS FOR THE N.S. SAVANNAH. Status Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lamartine, J T; Thurber, W C

1959-06-01

The feasibility of using electroless nickel, a chemical deposit containing about 10 wt.% phosphorous in nickel, as the brazing alloy for assembling tubular stainless steel fuel elements of the type specified in Core I of the N. S. Savannah was investigated. This material was selected primarily because of the ease of braze-metal preplacement by chemical deposition of the alloy on type 304 stainiess steel ferrule spacers, prior to fuelbundle assembly. Brazed joints produced by this method were generally characterized by a relatively ductile solid-solution region at the thinnest portions of the fillet. This ductile zone should minimize the possibility ofmore » complete propagation of hairline cracks, which form in the brittle, eutectic regions of fillet. The microstructural appearance of the electroless-nickel joints was not appreciably affected by variations in the brazing temperature from 1750 to 1900 deg F or the brazing time from 15 to 60 min. Several plating solutions were evaluated and all were found to be capable of producing deposits suitable for brazing applications. Corrosion tests conducted in static 525 deg F water indicated that no significant attack of joints brazed with electroless nickel had occurred after 300-hr exposure. A small fuel bundle was successfully assembled by brazing with electroless nickel. (auth)« less

Potentiodynamic studies of Ni-P-TiO2 nano-composited coating on the mild steel deposited by electroless plating method

NASA Astrophysics Data System (ADS)

Uttam, Vibha; Duchaniya, R. K.

2016-05-01

Now a days, corrosion studies are important for reducing the wastage of metals. The importance of corrosion studies is two folds i.e. first is economic, including the reduction of material losses resulting from the wasting away or sudden failure of materials and second is conservation Electroless process is an autocatalytic reduction method in which metallic ions are reduced in the solution. Nanocomposite coatings of Ni-P-TiO2 on mild steel are deposited by varying volume of TiO2 nano-powder by electroless method from Ni-P plating bath containing Nickel Sulphate as a source of nickel ions, sodium hypophosphite as the reducing agent, lactic acid as a complexing agents and TiO2 nano powder. Electroless Ni-P-TiO2 coating have been widely used in the chemical process industries, mechanical industries, electronic industries and chloroalkali industries due to their excellent corrosion with mechanical properties. In the present work, deposition of Ni-P alloy coating and Ni-P-TiO2 nanocomposited coatings were done on the mild steel and corrosion properties were studied with Potentio-dynamic polarization measurements method in 3.5 wt% sodium chloride solution. It showed in the experiments that Ni-P-TiO2 nanocomposited coating has better corrosion resistance as comparedthan Ni-P alloy coating. Morphological studies were done by field emission scanning electron microscopy (FESEM), energy-dispersive analysis of X-ray (EDAX) and X-ray diffraction (XRD). These studies confirmed the deposition of Ni-P alloy coating and Ni-P-TiO2 nanocomposited coating.

Engineering hierarchical Diatom@CuO@MnO2 hybrid for high performance supercapacitor

NASA Astrophysics Data System (ADS)

Zhang, Yan; Guo, Wan Wan; Zheng, Tian Xu; Zhang, Yu Xin; Fan, Xing

2018-01-01

A rational and hierarchical Diatom@CuO@MnO2 hybrid was fabricated via a facile electroless copper plating technology, following by a one-pot hydrothermal reaction with KMnO4. Such unique architecture acts as a supercapacitor electrode, which exhibits a high specific capacitance (240 F g-1 at a current density of 0.5 A g-1), good rate capability (58.3% retention when the current density increases from 0.5 to 5 A g-1), and excellent electrochemical cycling stability (91.2% retention of the initial specific capacitance after 4000 cycles at a current density of 2 A g-1). The impressive electrochemical performance of this Diatom@CuO@MnO2 electrode ascribed to the synergistic effect between the CuO particles and MnO2 nanosheets. Therefore, it can be expected that this unique Diatom@CuO@MnO2 electrode may have great promise for the application in supercapacitors.

Highly adhesive and high fatigue-resistant copper/PET flexible electronic substrates

NASA Astrophysics Data System (ADS)

Park, Sang Jin; Ko, Tae-Jun; Yoon, Juil; Moon, Myoung-Woon; Oh, Kyu Hwan; Han, Jun Hyun

2018-01-01

A voidless Cu/PET substrate is fabricated by producing a superhydrophilic PET surface comprised of nanostructures with large width and height and then by Cu electroless plating. Effect of PET surface nanostructure size on the failure mechanism of the Cu/PET substrate is studied. The fabricated Cu/PET substrate exhibits a maximum peel strength of 1300 N m-1 without using an interlayer, and virtually no increase in electrical resistivity under the extreme cyclic bending condition of 1 mm curvature radius after 300 k cycles. The authors find that there is an optimum nanostructure size for the highest Cu/PET adhesion strength, and the failure mechanism of the Cu/PET flexible substrate depends on the PET surface nanostructure size. Thus, this work presents the possibility to produce flexible metal/polymer electronic substrates that have excellent interfacial adhesion between the metal and polymer and high fatigue resistance against repeated bending. Such metal/polymer substrates provides new design opportunities for wearable electronic devices that can withstand harsh environments and have extended lifetimes.

Fabrication and Mechanical Behavior of Ex Situ Mg-Based Bulk Metallic Glass Matrix Composite Reinforced with Electroless Cu-Coated SiC Particles.

PubMed

Wang, Xin; Zhao, Lichen; Hu, Ximei; Cheng, Yongjian; Liu, Shuiqing; Chen, Peng; Cui, Chunxiang

2017-11-30

Magnesium-based bulk metallic glass matrix composites (BMGMCs) have better plasticity than the corresponding bulk metallic glasses (BMGs); however, their strength and density are often compromised due to the fact that the effective reinforcement phase is mostly plastic heavy metal. For lightweight SiC-particle reinforced BMGMCs, interface wettability and the sharpness of the particles often reduce the strengthening effect. In this work, SiC particles were coated with a thin Cu coating by electroless plating, and added to Mg 54 Cu 26.5 Ag 8.5 Gd 11 melt in an amount of 5 wt % to prepare a BMGMC. The microstructure of the interface, mechanical behavior and fracture morphology of the BMGMC were studied by scanning electron microscopy and quasi-static compression testing. The results showed that the Cu coating improved the wettability between SiC and the matrix alloy without obvious interfacial reactions, leading to the dispersion of SiC particles in the matrix. The addition of Cu-coated SiC particles improved the plastic deformation ability of Mg 54 Cu 26.5 Ag 8.5 Gd 11 BMG, proving that electroless plating was an effective method for controlling the interface microstructure and mechanical behavior of BMGMCs.

Nanoporous Ni with High Surface Area for Potential Hydrogen Storage Application.

PubMed

Zhou, Xiaocao; Zhao, Haibo; Fu, Zhibing; Qu, Jing; Zhong, Minglong; Yang, Xi; Yi, Yong; Wang, Chaoyang

2018-06-01

Nanoporous metals with considerable specific surface areas and hierarchical pore structures exhibit promising applications in the field of hydrogen storage, electrocatalysis, and fuel cells. In this manuscript, a facile method is demonstrated for fabricating nanoporous Ni with a high surface area by using SiO₂ aerogel as a template, i.e., electroless plating of Ni into an SiO₂ aerogel template followed by removal of the template at moderate conditions. The effects of the prepared conditions, including the electroless plating time, temperature of the structure, and the magnetism of nanoporous Ni are investigated in detail. The resultant optimum nanoporous Ni with a special 3D flower-like structure exhibited a high specific surface area of about 120.5 m²/g. The special nanoporous Ni exhibited a promising prospect in the field of hydrogen storage, with a hydrogen capacity of 0.45 wt % on 4.5 MPa at room temperature.

Electroless Cu/Ni Plating on Graphite Flake and the Effects to the Properties of Graphite Flake/Si/Al Hybrid Composites

NASA Astrophysics Data System (ADS)

Huang, Ying; Peng, Xuanyi; Yang, Yiwen; Wu, Haiwei; Sun, Xu; Han, Xiaopeng

2018-03-01

Proper process and parameter were investigated to coat Cu or Ni on graphite flake (Gf) by electroless plating. Microstructural characterization indicated that the Cu/Ni was coated on the Gf uniformly and comprehensively. Then aluminum matrix composites reinforced with Si and graphite were fabricated by a unique vacuum gas pressure infiltration. The thermal conductivity and mechanical properties of the composites, both with and without Cu or Ni coating layers on the graphite surface, have been studied. The obtained results indicated that the mechanical property of the Cu or Ni coated Gf/Si/Al composites dramatically increased, as compared with the non-coated Gf/Si/Al composite. In the meantime, Cu or Ni coated Gf proved to have better wettability and interfacial bonding with the aluminum matrix, which were expected to be a highly sustainable and dispersible reinforcement for metal matrix composites.

Characterization and application of selective all-wet metallization of silicon

NASA Astrophysics Data System (ADS)

Uncuer, Muhammet; Koser, Hur

2012-01-01

We demonstrate selective, two-level metallization of silicon using electroless deposition of copper and gold. In this process, adhesion between the copper and silicon is improved with the formation of intermediary copper-silicide, and the gold layer protects copper from oxidation. The resistivity and residual stress of Au/Cu is 450 Ω nm (220 Ω nm annealed) and 56 MPa (tensile), respectively. These Au/Cu films allow a truly conformal and selective coating of high-aspect-ratio Si structures with good adhesion. We demonstrate the potential of these films in microswitches/relays, accelerometers and sensors by conformally coating the sidewalls of long (up to 1 mm in length), slender microbeams (5 µm × 5 µm) without inducing curvature.

Metallized polymeric foam material

NASA Technical Reports Server (NTRS)

Birnbaum, B. A.; Bilow, N.

1974-01-01

Open-celled polyurethane foams can be coated uniformly with thin film of metal by vapor deposition of aluminum or by sensitization of foam followed by electroless deposition of nickel or copper. Foam can be further processed to increase thickness of metal overcoat to impart rigidity or to provide inert surface with only modest increase in weight.

Al/Pb lightweight grids prepared by molten salt electroless plating for application in lead-acid batteries

NASA Astrophysics Data System (ADS)

Hong, Bo; Jiang, Liangxing; Hao, Ketao; Liu, Fangyang; Yu, Xiaoying; Xue, Haitao; Li, Jie; Liu, Yexiang

2014-06-01

In this paper, a lightweight Pb plated Al (Al/Pb) grid was prepared by molten salt electroless plating. The SEM and bonding strength test show that the lead coating is deposited with a smooth surface and firm combination. CV test shows that the electrochemical properties of Al/Pb electrodes are stable. 2.0 V single-cell flooded lead-acid batteries with Al/Pb grids as negative collectors are assembled and the performances including 20 h capacity, rate capacity, cycle life, internal resistance are investigated. The results show that the cycle life of Al/Pb-grid cells is about 475 cycles and can meet the requirement of lead-acid batteries. Al/Pb grids are conducive to the refinement of PbSO4 grain, and thereby reduce the internal resistance of battery and advance the utilization of active mass. Moreover, weight of Al/Pb grid is only 55.4% of the conventional-grid. In this way, mass specific capacity of Al/Pb-grid negatives is 17.8% higher and the utilization of active mass is 6.5% higher than conventional-grid negatives.

Pre-treatment for molybdenum or molybdenum-rich alloy articles to be plated

DOEpatents

Wright, Ralph R.

1980-01-01

This invention is a method for etching a molybdenum or molybdenum-rich alloy surface to promote the formation of an adherent bond with a subsequently deposited metallic plating. In a typical application, the method is used as a pre-treatment for surfaces to be electrolessly plated with nickel. The pre-treatment comprises exposing the crystal boundaries of the surface by (a) anodizing the surface in acidic solution to form a continuous film of gray molybdenum oxide thereon and (b) removing the film.

40 CFR 413.71 - Specialized definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true Specialized definitions. 413.71 Section 413.71 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroless Plating Subcategory § 413.71 Specialized...

Potentiodynamic studies of Ni-P-TiO{sub 2} nano-composited coating on the mild steel deposited by electroless plating method

DOE Office of Scientific and Technical Information (OSTI.GOV)

Uttam, Vibha, E-mail: vibhauttam74@gmail.com; Duchaniya, R. K., E-mail: rkduchaniya.meta@mnit.ac.in

2016-05-06

Now a days, corrosion studies are important for reducing the wastage of metals. The importance of corrosion studies is two folds i.e. first is economic, including the reduction of material losses resulting from the wasting away or sudden failure of materials and second is conservation Electroless process is an autocatalytic reduction method in which metallic ions are reduced in the solution. Nanocomposite coatings of Ni-P-TiO{sub 2} on mild steel are deposited by varying volume of TiO{sub 2} nano-powder by electroless method from Ni-P plating bath containing Nickel Sulphate as a source of nickel ions, sodium hypophosphite as the reducing agent,more » lactic acid as a complexing agents and TiO{sub 2} nano powder. Electroless Ni-P-TiO{sub 2} coating have been widely used in the chemical process industries, mechanical industries, electronic industries and chloroalkali industries due to their excellent corrosion with mechanical properties. In the present work, deposition of Ni-P alloy coating and Ni-P-TiO{sub 2} nanocomposited coatings were done on the mild steel and corrosion properties were studied with Potentio-dynamic polarization measurements method in 3.5 wt% sodium chloride solution. It showed in the experiments that Ni-P-TiO{sub 2} nanocomposited coating has better corrosion resistance as comparedthan Ni-P alloy coating. Morphological studies were done by field emission scanning electron microscopy (FESEM), energy–dispersive analysis of X-ray (EDAX) and X-ray diffraction (XRD). These studies confirmed the deposition of Ni-P alloy coating and Ni-P-TiO{sub 2} nanocomposited coating.« less

Electroless deposition of Ni Cu P alloy and study of the influences of some parameters on the properties of deposits

NASA Astrophysics Data System (ADS)

Ashassi-Sorkhabi, H.; Dolati, H.; Parvini-Ahmadi, N.; Manzoori, J.

2002-01-01

Cupronickel alloys are known for their excellent corrosion resistance, especially in marine atmosphere. The development of an appropriate electroless bath involves the use of a reducing agent, complexing and stabilizing compounds and metallic salts. In this work, autocatalytic deposition of Ni-Cu-P alloys (28-95 wt.% Ni, 66-0 wt.% Cu, 7.5-3 wt.% P) has been carried out on 302 b steel sheets from bath containing: NiCl 2·6H 2O, CuCl 2·2H 2O, NaH 2PO 2, Na citrate, sulphosalicilic acid and triethanolamine. The effects of pH, temperature, and bath composition on the hardness and the composition of deposits have been studied. In addition, the deposition rates of alloy, nickel, copper and phosphorus were investigated and optimum conditions were obtained. The average rate of alloy deposition was 9 mg cm -2 h -1 and the optimum pH and temperature were 8.5 and 80 °C, respectively. The chemical stability of bath was desirable, and no spontaneous decomposition occurred. The changes in the structure of deposit by heat treatment were studied by the X-ray diffraction (XRD) method. The XRD patterns indicate that the copper content affects the structure changes. With increasing copper content, the phosphorus content decreased and the crystallinity of the deposits grew. After heat treatment of alloys with lower copper content at 400 °C for 1 h, the crystallization to Ni 3P was observed.

In-depth survey report of American Airlines plating facility

NASA Astrophysics Data System (ADS)

Mortimer, V. D., Jr.

1982-12-01

An in depth survey was conducted at the American Airlines Maintenance and Engineering Center as part of National Institute for Occupational Safety and Health (NIOSH) study evaluating measures to control occupational health hazards associated with the metal plating industry. This American Airlines plating facility, employing approximately 25 workers, is primarily engaged in plating hard chromium, nickel and cadmium on aircraft engine and landing gear parts. Six tanks were studied, including an electroless nickel tank. Area and personal samples for chromium, nickel, cadmium, and cyanide were collected. Ventilation airflow and tank dimensions were measured and data recorded on plating operations. The relationships between air contaminants emitted, local exhaust ventilation flow rate, tank size, and plating activity were evaluated.

Mechanically robust silver coatings prepared by electroless plating on thermoplastic polyurethane

NASA Astrophysics Data System (ADS)

Vasconcelos, B.; Vediappan, K.; Oliveira, J. C.; Fonseca, C.

2018-06-01

A simple and low-cost surface functionalization method is proposed to activate a thermoplastic polyurethane (TPU) for the electroless deposition of a silver coating with excellent adhesion and low resistivity. The TPU surface functionalization was performed in solution and consisted in forming a physical interpenetrating network at the TPU surface, involving TPU and polyvinylpyrrolidone (PVP), a polymer displaying a strong affinity for metals. The presence of PVP on the TPU surface and its stability in aqueous solution were assessed by ATR-FTIR and contact angle measurements as a function of the PVP concentration and treatment time. A modified Tollens solution was used to grow a silver film on the TPU substrate, by using the electroless plating method. Compact silver films with an average thickness of 12.5 μm and a resistivity of 8.57 mΩ·cm were obtained for a 24 h plating time. The adhesion strength of the silver film proved to be higher than 8.5 N/cm. The resistance to fatigue of the silver films was studied by performing series of compression/stretching tests (150 cycles). It was concluded that the films kept low resistance values, although displaying a higher sensitivity to compression than to stretching. Furthermore, the films keep a good conductivity for strains up to 400%. The excellent electrical and mechanical properties of the films make them suitable candidates for the coating of multipin dry bioelectrodes. Owing to the high affinity of many metals for PVP, this activation technique has the potential to be extended to the deposition of other metals and other polymers as well, provided a suitable solvent is used.

Comparative study of electroless Co-Ni-P plating on Tencel fabric by Co0-based and Ni0-based activation for electromagnetic interference shielding

NASA Astrophysics Data System (ADS)

Bi, Siyi; Zhao, Hang; Hou, Lei; Lu, Yinxiang

2017-10-01

The primary objective of this research work was to develop high-performance conductive fabrics with desired electromagnetic interference (EMI) shielding effectiveness (SE), excellent durability and improved corrosion resistance. Such conductive fabrics were fabricated by combining an ultra-low-cost electroless plating method with an alkoxy silane self-assembly technology, which involved successive steps of modification, activation, Co-Ni-P coating deposition and 3-aminopropyltrimethoxysilane (APTMS) thin coatings assembling. Malic acid (MA) was selected to modify the pristine Tencel (TS) substrates, and the probably interaction mechanism was investigated by FT-IR measurement. Co0 and Ni0 nanoparticles (NPs) were used as the activators to initiate electroless plating, respectively, and thereby two categories of Co-Ni-P coatings with different Co/Ni atomic ratio were obtained. Both of them presented compact morphologies and preferential (1 1 1) crystal orientation, which were validated by FE-SEM and XRD measurements. Owing to the lower square resistance and higher magnetic properties, the Co-Ni-P coated fabric activated by Co0 activator showed a higher EMI SE (18.2-40.1 dB) at frequency of 30-1000 MHz. APTMS thin coatings were then assembled on the top of alloy coated fabrics to act as anti-corrosion barriers. Electrochemical polarization measurement in 3.5 wt.% NaCl solution showed that top-APTMS coated conductive fabric exhibited a higher corrosion resistance than the one in absence of APTMS assembly. Overall, the whole process of fabrication could be performed in several hours (or less) without any specialized equipment, which shows a great potential as EMI shielding fabrics in mass-production.

Facile morphology-controlled synthesis of nickel-coated graphite core-shell particles for excellent conducting performance of polymer-matrix composites and enhanced catalytic reduction of 4-nitrophenol

NASA Astrophysics Data System (ADS)

Bian, Juan; Lan, Fang; Wang, Yilong; Ren, Ke; Zhao, Suling; Li, Wei; Chen, Zhihong; Li, Jiangyu; Guan, Jianguo

2018-04-01

We have developed a novel seed-mediated growth method to fabricate nickel-coated graphite composite particles (GP@Ni-CPs) with controllable shell morphology by simply adjusting the concentration of sodium hydroxide ([NaOH]). The fabrication of two kinds of typical GP@Ni-CPs includes adsorption of Ni2+ via electrostatic attraction, sufficient heterogeneous nucleation of Ni atoms by an in situ reduction, and shell-controlled growth by regulating the kinetics of electroless Ni plating in turn. High [NaOH] results in fast kinetics of electroless plating, which causes heterogeneous nuclei to grow isotropically. After fast and uniform growth of Ni nuclei, GP@Ni-CPs with dense shells can be achieved. The first typical GP@Ni-CPs exhibit denser shells, smaller diameters and higher conductivities than the available commercial ones, indicating their important applications in the conducting of polymer-matrix composites. On the other hand, low [NaOH] favors slow kinetics. Thus, the reduction rate of Ni2+ slows down to a relatively low level so that electroless plating is dominated thermodynamically instead of kinetically, leading to an anisotropic crystalline growth of nuclei and finally to the formation of GP@Ni-CPs with nanoneedle-like shells. The second typical samples can effectively catalyze the reduction of p-nitrophenol into p-aminophenol with NaBH4 in comparison with commercial GP@Ni-CPs and RANEY® Ni, owing to the strong charge accumulation effect of needle-like Ni shells. This work proposes a model system for fundamental investigations and has important applications in the fields of electronic interconnection and catalysis.

Electroless metal plating of plastics

DOEpatents

Krause, Lawrence J.

1986-01-01

Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.

Electroless metal plating of plastics

DOEpatents

Krause, L.J.

1982-09-20

Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.

Electroless metal plating of plastics

DOEpatents

Krause, Lawrence J.

1984-01-01

Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.

A Palladium free method to create a Nickel coated electrode for electrochemical application

NASA Astrophysics Data System (ADS)

Tran, Thien Khanh; Vu, Thanh, Vi; Vo, Minh Xuan

2018-04-01

For many generations, the coating of metals provides many applications in the industry: decoration, functional, electroforming. Electroless plating of Nickel with the supports of Palladium/Tin is famous for its properties and effects. In this study, we provide another catalysis solution for the electroless plating process of Nickel. With plastic Polyvinyl Chloride substrate controlled in thickness (2 mm) and scale (200x400 mm), the efficiency of the coating process was carried out under simple lab scale condition. The result of the process is a thin film layer of Nickel coated on the surface of the substrate with exceptional adhesion and strong physical properties also. The product sample then was tested by many methods such as SEM, XRD, EDS, and FTIR to clarify its properties. According to our observation and the result we obtained, we believe there is still more room for improvement to this method, and a further investigation on its application as well can be carried on in the future.

Interlaminar and ductile characteristics of carbon fibers-reinforced plastics produced by nanoscaled electroless nickel plating on carbon fiber surfaces.

PubMed

Park, Soo-Jin; Jang, Yu-Sin; Rhee, Kyong-Yop

2002-01-15

In this work, a new method based on nanoscaled Ni-P alloy coating on carbon fiber surfaces is proposed for the improvement of interfacial properties between fibers and epoxy matrix in a composite system. Fiber surfaces and the mechanical interfacial properties of composites were characterized by atomic absorption spectrophotometer (AAS), scanning electron microscopy (SEM), X-ray photoelectron spectrometry (XPS), interlaminar shear strength (ILSS), and impact strength. Experimental results showed that the O(1s)/C(1s) ratio or Ni and P amounts had been increased as the electroless nickel plating proceeded; the ILSS had also been slightly improved. The impact properties were significantly improved in the presence of Ni-P alloy on carbon fiber surfaces, increasing the ductility of the composites. This was probably due to the effect of substituted Ni-P alloy, leading to an increase of the resistance to the deformation and the crack initiation of the epoxy system.

Microstructures and Properties of 40Cu/Ag(Invar) Composites Fabricated by Powder Metallurgy and Subsequent Thermo-Mechanical Treatment

NASA Astrophysics Data System (ADS)

Zhang, Xin; Huang, Yingqiu; Liu, Xiangyu; Yang, Lei; Shi, Changdong; Wu, Yucheng; Tang, Wenming

2018-03-01

Composites of 40Cu/Ag(Invar) were prepared via pressureless sintering and subsequent thermo-mechanical treatment from raw materials of electroless Ag-plated Invar alloy powder and electrolytic Cu powder. Microstructures and properties of the prepared composites were studied to evaluate the effect of the Ag layer on blocking Cu/Invar interfacial diffusion in the composites. The electroless-plated Ag layer was dense, uniform, continuous, and bonded tightly with the Invar alloy substrate. During sintering of the composites, the Ag layer effectively prevented Cu/Invar interfacial diffusion. During cold-rolling, the Ag layer was deformed uniformly with the Invar alloy particles. The composites exhibited bi-continuous network structure and considerably improved properties. After sintering at 775 °C and subsequent thermo-mechanical treatment, the 40Cu/Ag(Invar) composites showed satisfactory comprehensive properties: relative density of 99.0 pct, hardness of HV 253, thermal conductivity of 55.7 W/(m K), and coefficient of thermal expansion of 11.2 × 10-6/K.

40 CFR 413.72-413.73 - [Reserved

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 28 2010-07-01 2010-07-01 true [Reserved] 413.72-413.73 Section 413.72-413.73 Protection of Environment ENVIRONMENTAL PROTECTION AGENCY (CONTINUED) EFFLUENT GUIDELINES AND STANDARDS ELECTROPLATING POINT SOURCE CATEGORY Electroless Plating Subcategory §§ 413.72-413.73 [Reserved] ...

Laboratory Demonstration of Low-Cost Method for Producing Thin Film on Nonconductors.

ERIC Educational Resources Information Center

Ebong, A. U.; And Others

1991-01-01

A low-cost procedure for metallizing a silicon p-n junction diode by electroless nickel plating is reported. The procedure demonstrates that expensive salts can be excluded without affecting the results. The experimental procedure, measurement, results, and discussion are included. (Author/KR)

Analysis of International Space Station Vehicle Materials on MISSE 6

NASA Technical Reports Server (NTRS)

Finckenor, Miria; Golden, Johnny; Kravchenko, Michael; O'Rourke, Mary Jane

2010-01-01

The International Space Station Materials and Processes team has multiple material samples on MISSE 6, 7 and 8 to observe Low Earth Orbit (LEO) environmental effects on Space Station materials. Optical properties, thickness/mass loss, surface elemental analysis, visual and microscopic analysis for surface change are some of the techniques employed in this investigation. Results for the following MISSE 6 samples materials will be presented: deionized water sealed anodized aluminum; Hyzod(tm) polycarbonate used to temporarily protect ISS windows; Russian quartz window material; Beta Cloth with Teflon(tm) reformulated without perfluorooctanoic acid (PFOA), and electroless nickel. Discussion for current and future MISSE materials experiments will be presented. MISSE 7 samples are: more deionized water sealed anodized aluminum, including Photofoil(tm); indium tin oxide (ITO) over-coated Kapton(tm) used as thermo-optical surfaces; mechanically scribed tin-plated beryllium-copper samples for "tin pest" growth (alpha/beta transformation); and beta cloth backed with a black coating rather than aluminization. MISSE 8 samples are: exposed "scrim cloth" (fiberglass weave) from the ISS solar array wing material, protective fiberglass tapes and sleeve materials, and optical witness samples to monitor contamination.

Ultralight metal foams

NASA Astrophysics Data System (ADS)

Jiang, Bin; He, Chunnian; Zhao, Naiqin; Nash, Philip; Shi, Chunsheng; Wang, Zejun

2015-09-01

Ultralight (<10 mg/cm3) cellular materials are desirable for thermal insulation; battery electrodes; catalyst supports; and acoustic, vibration, or shock energy damping. However, most of these ultralight materials, especially ultralight metal foams, are fabricated using either expensive materials or complicated procedures, which greatly limit their large-scale production and practical applications. Here we report a simple and versatile method to obtain ultralight monolithic metal foams. These materials are fabricated with a low-cost polymeric template and the method is based on the traditional silver mirror reaction and electroless plating. We have produced ultralight monolithic metal foams, such as silver, nickel, cobalt, and copper via this method. The resultant ultralight monolithic metal foams have remarkably low densities down to 7.4 mg/cm3 or 99.9% porosity. The metal foams have a long flat stress-train curve in compression tests and the densification strain ɛD of the Ni/Ag foam with a porosity of 99.8% can reach 82%. The plateau stress σpl was measured and found to be in agreement with the value predicted by the cellular solids theory.

Ultralight metal foams.

PubMed

Jiang, Bin; He, Chunnian; Zhao, Naiqin; Nash, Philip; Shi, Chunsheng; Wang, Zejun

2015-09-08

Ultralight (<10 mg/cm3) cellular materials are desirable for thermal insulation; battery electrodes; catalyst supports; and acoustic, vibration, or shock energy damping. However, most of these ultralight materials, especially ultralight metal foams, are fabricated using either expensive materials or complicated procedures, which greatly limit their large-scale production and practical applications. Here we report a simple and versatile method to obtain ultralight monolithic metal foams. These materials are fabricated with a low-cost polymeric template and the method is based on the traditional silver mirror reaction and electroless plating. We have produced ultralight monolithic metal foams, such as silver, nickel, cobalt, and copper via this method. The resultant ultralight monolithic metal foams have remarkably low densities down to 7.4 mg/cm3 or 99.9% porosity. The metal foams have a long flat stress-train curve in compression tests and the densification strain εD of the Ni/Ag foam with a porosity of 99.8% can reach 82%. The plateau stress σpl was measured and found to be in agreement with the value predicted by the cellular solids theory.

Characterisation of a PdCl 2/SnCl 2 electroless plating catalyst system adsorbed on barium titanate-based electroactive ceramics

NASA Astrophysics Data System (ADS)

Meenan, B. J.; Brown, N. M. D.; Wilson, J. W.

1994-03-01

A PdCl 2/SnCl 2 metallisation catalyst system, of the type used to activate non-conducting surfaces for electroless metal deposition, has been characterised by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The substrate is a barium titanate (BaTiO 3)-based electroactive ceramic of the type used in the fabrication of multilayer ceramic capacitors (MLCC). The treatment of the substrate surface with the PdCl 2/SnCl 2 "sensitiser" solution leads to the adsorption of catalytically inactive compounds of palladium and tin. Subsequent treatment of this surface with an "accelerator" solution removes excess oxides, hydroxides and salts of tin thereby leaving the active catalyst species, Pd xSn y, on the surface. Such sites, on exposure to the appropriete electroless plating bath, are then responsible for the metal deposition. In this study, the chemical state and relative quantities of the various surface species present after each of the processing stages have been determined by XPS. The surface roughness of the substrate results in less of the tin compounds present thereon being removed on washing the catalysed surface in the accelerator solution than normally reported for such systems, thereby affecting the measured Pd: Sn ratio. SEM studies show that the accelerator solution treatment generates crystalline areas, which may be a result of coagulation of the Pd xSn y particles present, in the otherwise amorphous catalyst coating.

Detailed Analysis and Design Review of the MARK IX (Modified) Underwater Breathing Apparatus

DTIC Science & Technology

1969-07-30

hard- chrome plated, and the purge-valve assembly and regulator piston . electroless-nickel plated. Manufacturing/Assembly Controls and Tests The control...high a flow through the orifice, peak pressures of 4500 psi have been applied repeatedly with- out failure or damage to any component. (7) Orifice...c) Proved In use. (d) "Functional" test by stpplkir. (5)J (e) Peak pressure of only 4500 jsi reached. (1) (f) Leak test at 1-1/2 •is. (g) Predive

Method of making a hydrogen transport membrane, and article

DOEpatents

Schwartz, Joseph M.; Corpus, Joseph M.; Lim, Hankwon

2015-07-21

The present invention relates to a method of manufacturing a hydrogen transport membrane and the composite article itself. More specifically, the invention relates to producing a membrane substrate, wherein the ceramic substrate is coated with a metal oxide slurry, thereby eliminating the need for an activation step prior to plating the ceramic membrane through an electroless plating process. The invention also relates to modifying the pore size and porosity of the substrate by oxidation or reduction of the particles deposited by the metal oxide slurry.

Microchannel plate for high-efficiency field emission display

NASA Astrophysics Data System (ADS)

Yi, Whikun; Jin, Sunghwan; Jeong, Taewon; Lee, Jeonghee; Yu, SeGi; Choi, Yongsoo; Kim, J. M.

2000-09-01

The efficiency of a field emission display was improved significantly with a newly developed microchannel plate. The key features of this unit and its fabrication are summarized as follows: (a) bulk alumina is used as a substrate material, (b) channel location is defined by a programed-hole puncher, and (c) thin film deposition is conducted by electroless plating followed by a sol-gel process. With the microchannel plate between the cathode and the anode of a field emission display, the brightness of luminescent light increases three- to fourfold by electron multiplication through an array of pores in the device. In addition, the fabricated microchannel plate prevents spreading of electrons emitted from the cathode tips, thus improving both display resolution and picture quality.

Understanding the antimicrobial activity behind thin- and thick-rolled copper plates.

PubMed

Yousuf, Basit; Ahire, Jayesh J; Dicks, Leon M T

2016-06-01

The aim of this study was to compare the antibacterial properties of the surfaces of copper plates that were rolled to a thickness of 25 and 100 μm. Differences in topology of 25- and 100-μm-thick copper plates were studied using scanning electron microscopy (SEM), atomic force microscopy (AFM), and X-ray diffraction (XRD). Antibacterial activity of the copper surfaces was tested against strains of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, Pseudomonas aeruginosa, Listeria monocytogenes, Salmonella typhimurium, Streptococcus sp. BY1, Enterococcus sp. BY2, and Bacillus cereus BY3. Changes in viable cell numbers were determined by plating onto optimal growth media and staining with LIVE/DEAD BacLight™. Changes in metabolic activity were recorded by expression of the luciferase (lux) gene. Cell morphology was studied using SEM. Accumulation and diffusion of copper from cells were recorded using inductively coupled plasma mass spectroscopy (ICP-MS). Lipid and protein oxidation were recorded spectrophotometrically. Surfaces of 25-μm-thick copper plates were rough compared to that of 100-μm-thick copper plates. For most species, a five-log reduction in cell numbers, cell membrane instability, and a decline in metabolic activity were recorded after 15 min of exposure to 25-μm-thick copper plates. Copper accumulated in the cells, and lipids and proteins were oxidized. The rough surface of thinner copper plates (25 μm thick) released more copper and was more antimicrobial compared to thicker (100 μm) copper plates. Cell death was attributed to destabilization of the cell membrane, lipid peroxidation, and protein oxidation.

Electroless plating of silver nanoparticles on porous silicon for laser desorption/ionization mass spectrometry

NASA Astrophysics Data System (ADS)

Yan, Hong; Xu, Ning; Huang, Wen-Yi; Han, Huan-Mei; Xiao, Shou-Jun

2009-03-01

An improved DIOS (desorption ionization on porous silicon) method for laser desorption/ionization mass spectrometry (LDI MS) by electroless plating of silver nanoparticles (AgNPs) on porous silicon (PSi) was developed. By addition of 4-aminothiophenol (4-ATP) into the AgNO3 plating solution, the plating speed can be slowed down and simultaneously 4-ATP self-assembled monolayers (SAMs) on AgNPs (4-ATP/AgNPs) were formed. Both AgNPs and 4-ATP/AgNPs coated PSi substrates present much higher stability, sensitivity and reproducibility for LDI MS than the un-treated porous silicon ones. Their shelf life in air was tested for several weeks to a month and their mass spectra still displayed the same high quality and sensitivity as the freshly prepared ones. And more 4-ATP SAMs partly play a role of matrix to increase the ionization efficiency. A small organic molecule of tetrapyridinporphyrin (TPyP), oligomers of polyethylene glycol (PEG 400 and 2300), and a peptide of oxytocin were used as examples to demonstrate the feasibility of the silver-plated PSi as a matrix-free-like method for LDI MS. This approach can obtain limits of detection to femtomoles for TPyP, subpicomoles for oxytocin, and picomoles for PEG 400 and 2300, comparable to the traditional matrix method and much better than the DIOS method. It simplifies the sample preparation as a matrix-free-like method without addition of matrix molecules and homogenizes the sample spread over the spot for better and more even mass signals.

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

NASA Astrophysics Data System (ADS)

Seo, Wonil; Kim, Kyoung-Ho; Kim, Young-Ho; Yoo, Sehoon

2018-01-01

The growth of interfacial intermetallic compound and the brittle fracture behavior of Sn-3.0Ag-0.5-Cu solder (SAC305) joints on electroless nickel immersion gold (ENIG) surface finish have been investigated using Ni-P plating solution at temperatures from 75°C to 85°C and fixed pH of 4.5. SAC305 solder balls with diameter of 450 μm were mounted on the prepared ENIG-finished Cu pads and reflowed with peak temperature of 250°C. The interfacial intermetallic compound (IMC) thickness after reflow decreased with increasing Ni-P plating temperature. After 800 h of thermal aging, the IMC thickness of the sample prepared at 85°C was higher than for that prepared at 75°C. Scanning electron microscopy of the Ni-P surface after removal of the Au layer revealed a nodular structure on the Ni-P surface. The nodule size of the Ni-P decreased with increasing Ni-P plating temperature. The Cu content near the IMC layer increased to 0.6 wt.%, higher than the original Cu content of 0.5 wt.%, indicating that Cu diffused from the Cu pad to the solder ball through the Ni-P layer at a rate depending on the nodule size. The sample prepared at 75°C with thicker interfacial IMC showed greater high-speed shear strength than the sample prepared at 85°C. Brittle fracture increased with decreasing Ni-P plating temperature.

Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells

PubMed Central

Hsieh, Shu Huei; Hsieh, Jhong Min; Chen, Wen Jauh; Chuang, Chia Chih

2017-01-01

In this work, nickel thin films were deposited on texture silicon by electroless plated deposition. The electroless-deposited Ni layers were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction analysis (XRD), and sheet resistance measurement. The results indicate that the dominant phase was Ni2Si and NiSi in samples annealed at 300–800 °C. Sheet resistance values were found to correlate well with the surface morphology obtained by SEM and the results of XRD diffraction. The Cu/Ni contact system was used to fabricate solar cells by using two different activating baths. The open circuit voltage (Voc) of the Cu/Ni samples, before and after annealing, was measured under air mass (AM) 1.5 conditions to determine solar cell properties. The results show that open circuit voltage of a solar cell can be enhanced when the activation solution incorporated hydrofluoric acid (HF). This is mainly attributed to the native silicon oxide layer that can be decreased and/or removed by HF with the corresponding reduction of series resistance. PMID:28805724

Solder flow over fine line PWB surface finishes

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hosking, F.M.; Hernandez, C.L.

1998-08-01

The rapid advancement of interconnect technology has stimulated the development of alternative printed wiring board (PWB) surface finishes to enhance the solderability of standard copper and solder-coated surfaces. These new finishes are based on either metallic or organic chemistries. As part of an ongoing solderability study, Sandia National Laboratories has investigated the solder flow behavior of two azole-based organic solderability preservations, immersion Au, immersion Ag, electroless Pd, and electroless Pd/Ni on fine line copper features. The coated substrates were solder tested in the as-fabricated and environmentally-stressed conditions. Samples were processed through an inerted reflow machine. The azole-based coatings generally providedmore » the most effective protection after aging. Thin Pd over Cu yielded the best wetting results of the metallic coatings, with complete dissolution of the Pd overcoat and wetting of the underlying Cu by the flowing solder. Limited wetting was measured on the thicker Pd and Pd over Ni finishes, which were not completely dissolved by the molten solder. The immersion Au and Ag finishes yielded the lowest wetted lengths, respectively. These general differences in solderability were directly attributed to the type of surface finish which the solder came in contact with. The effects of circuit geometry, surface finish, stressing, and solder processing conditions are discussed.« less

Microchannel apparatus and methods of conducting catalyzed oxidative dehydrogenation

DOEpatents

Tonkovich, Anna Lee [Dublin, OH; Yang, Bin [Columbus, OH; Perry, Steven T [Galloway, OH; Mazanec, Terry [Solon, OH; Arora, Ravi [New Albany, OH; Daly, Francis P [Delaware, OH; Long, Richard [New Albany, OH; Yuschak, Thomas D [Lewis Center, OH; Neagle, Paul W [Westerville, OH; Glass, Amanda [Galloway, OH

2011-08-16

Methods of oxidative dehydrogenation are described. Surprisingly, Pd and Au alloys of Pt have been discovered to be superior for oxidative dehydrogenation in microchannels. Methods of forming these catalysts via an electroless plating methodology are also described. An apparatus design that minimizes heat transfer to the apparatus' exterior is also described.

Electroless plating of ultrathin palladium films: self-initiated deposition and application in microreactor fabrication

NASA Astrophysics Data System (ADS)

Muench, Falk; Oezaslan, Mehtap; Svoboda, Ingrid; Ensinger, Wolfgang

2015-10-01

We present new electroless palladium plating reactions, which can be applied to complex-shaped substrates and lead to homogeneous, dense and conformal palladium films consisting of small nanoparticles. Notably, autocatalytic and surface-selective metal deposition could be achieved on a wide range of materials without sensitization and activation pretreatments. This provides a facile and competitive route to directly deposit well-defined palladium nanofilms on e.g. carbon, paper, polymers or glass substrates. The reactions proceed at mild conditions and are based on easily accessible chemicals (reducing agent: hydrazine; metal source: PdCl2; ligands: ethylenediaminetetraacetic acid (EDTA), acetylacetone). Additionally, the water-soluble capping agent 4-dimethylaminopyridine (DMAP) is employed to increase the bath stability, to ensure the formation of small particles and to improve the film conformity. The great potential of the outlined reactions for micro- and nanofabrication is demonstrated by coating an ion-track etched polycarbonate membrane with a uniform Pd film of approximately 20 nm thickness. The as-prepared membrane is then employed as a highly miniaturized flow reactor, using the reduction of 4-nitrophenol with NaBH4 as a model reaction.

Fabrication and characterization of flaky core-shell particles by magnetron sputtering silver onto diatomite

NASA Astrophysics Data System (ADS)

Wang, Yuanyuan; Zhang, Deyuan; Cai, Jun

2016-02-01

Diatomite has delicate porous structures and various shapes, making them ideal templates for microscopic core-shell particles fabrication. In this study, a new process of magnetron sputtering assisted with photoresist positioning was proposed to fabricate lightweight silver coated porous diatomite with superior coating quality and performance. The diatomite has been treated with different sputtering time to investigate the silver film growing process on the surface. The morphologies, constituents, phase structures and surface roughness of the silver coated diatomite were analyzed with SEM, EDS, XRD and AFM respectively. The results showed that the optimized magnetron sputtering time was 8-16 min, under which the diatomite templates were successfully coated with uniform silver film, which exhibits face centered cubic (fcc) structure, and the initial porous structures were kept. Moreover, this silver coating has lower surface roughness (RMS 4.513 ± 0.2 nm) than that obtained by electroless plating (RMS 15.692 ± 0.5 nm). And the infrared emissivity of coatings made with magnetron sputtering and electroless plating silver coated diatomite can reach to the lowest value of 0.528 and 0.716 respectively.

Interface structure and properties of CNTs/Cu composites fabricated by electroless deposition and spark plasma sintering

NASA Astrophysics Data System (ADS)

Wang, Hu; Zhang, Zhao-Hui; Hu, Zheng-Yang; Song, Qi; Yin, Shi-Pan

2018-01-01

In this paper, we fabricated a novel copper matrix composites reinforced by carbon nanotubes (CNTs) using electroless deposition (ED) and spark plasma sintering technique. Microstructure, mechanical, electric conductivity, and thermal properties of the CNTs/Cu composites were investigated. The results show that a favorable interface containing C-O and O-Cu bond was formed between CNTs and matrix when the CNTs were coated with nano-Cu by ED method. Thus, we accomplished the uniformly dispersed CNTs in the CNTs/Cu powders and compacted composites, which eventually leads to the enhancement of the mechanical properties of the CNTs/Cu composites in the macro-scale environment. However, the interface structure can hinder the movement of carriers and free electrons and increase the interface thermal resistance, which leads to modest decrease of electrical and thermal conductivity of the CNTs/Cu composites.

Review of Supported Pd-Based Membranes Preparation by Electroless Plating for Ultra-Pure Hydrogen Production

PubMed Central

Alique, David; Martinez-Diaz, David; Sanz, Raul

2018-01-01

In the last years, hydrogen has been considered as a promising energy vector for the oncoming modification of the current energy sector, mainly based on fossil fuels. Hydrogen can be produced from water with no significant pollutant emissions but in the nearest future its production from different hydrocarbon raw materials by thermochemical processes seems to be more feasible. In any case, a mixture of gaseous compounds containing hydrogen is produced, so a further purification step is needed to purify the hydrogen up to required levels accordingly to the final application, i.e., PEM fuel cells. In this mean, membrane technology is one of the available separation options, providing an efficient solution at reasonable cost. Particularly, dense palladium-based membranes have been proposed as an ideal chance in hydrogen purification due to the nearly complete hydrogen selectivity (ideally 100%), high thermal stability and mechanical resistance. Moreover, these membranes can be used in a membrane reactor, offering the possibility to combine both the chemical reaction for hydrogen production and the purification step in a unique device. There are many papers in the literature regarding the preparation of Pd-based membranes, trying to improve the properties of these materials in terms of permeability, thermal and mechanical resistance, poisoning and cost-efficiency. In this review, the most relevant advances in the preparation of supported Pd-based membranes for hydrogen production in recent years are presented. The work is mainly focused in the incorporation of the hydrogen selective layer (palladium or palladium-based alloy) by the electroless plating, since it is one of the most promising alternatives for a real industrial application of these membranes. The information is organized in different sections including: (i) a general introduction; (ii) raw commercial and modified membrane supports; (iii) metal deposition insights by electroless-plating; (iv) trends in preparation of Pd-based alloys, and, finally; (v) some essential concluding remarks in addition to futures perspectives. PMID:29360777

Decoration of silicon nanostructures with copper particles for simultaneous selective capture and mass spectrometry detection of His-tagged model peptide.

PubMed

Coffinier, Yannick; Kurylo, Ievgen; Drobecq, Hervé; Szunerits, Sabine; Melnyk, Oleg; Zaitsev, Vladimir N; Boukherroub, Rabah

2014-10-21

We present in this work a simple and fast preparation method of a new affinity surface-assisted laser/desorption ionization mass spectrometry (SALDI-MS) substrate based on silicon nanostructures decorated with copper particles. The silicon nanostructures were fabricated by the metal-assisted chemical etching (MACE) method. Then, superhydrophilic areas surrounded by superhydrophobic regions were formed through hydrosilylation reaction of 1-octadecene, followed by local degradation of the octadecyl layer. After that, copper particles were deposited in the hydrophilic areas by using the electroless method. We have demonstrated that these surfaces were able to perform high selective capture of model His-tag peptide even in a complex mixture such as serum solution. Then, the captured peptide was detected by mass spectrometry at a femtomolar level without the need of organic matrix.

Metal Nanowires: Synthesis, Processing, and Structure-Property Relationships in the Context of Flexible Transparent Conducting Films

NASA Astrophysics Data System (ADS)

Rathmell, Aaron R.

The demand for flat-panel televisions, e-readers, smart-phones, and touch-screens has been increasing over the past few years and will continue to increase for the foreseeable future. Each of these devices contains a transparent conductor, which is usually indium tin oxide (ITO) because of its high transparency and low sheet resistance. ITO films, however, are brittle, expensive, and difficult to deposit, and because of these problems, alternative transparent electrodes are being studied. One cheap and flexible alternative to ITO is films of randomly oriented copper nanowires. We have developed a synthesis to make long, thin, and well-dispersed copper nanowires that can be suspended in an ink and coated onto a substrate to make flexible transparent films. These films are then made conductive by annealing in a hydrogen atmosphere or by a solution processing technique that can be done in air at room temperature. The resulting flexible transparent conducting films display transparencies and sheet resistance values comparable to ITO. Since it is well known that copper oxidizes, we also developed a synthesis to coat the copper nanowires with a layer of nickel in solution. Our measurements indicated that copper nanowires would double their sheet resistance in 3 months, but the sheet resistance of cupronickel nanowire films containing 20 mole% nickel will double in about 400 years. The addition of nickel to the copper nanowires also gave the film a more neutral grey appearance. The nickel coating can also be applied to the copper nanowires after the film is formed via an electroless plating method. To further optimize the properties of our transparent conductors we developed a framework to understand how the dimensions and area coverage of the nanowires affect the overall film properties. To quantify the effect of length on the sheet resistance and transmittance, wires with different lengths but the same diameter were synthesized to make transparent conducting films and finite-difference time-domain calculations were used to determine the effect of the nanowire diameter on the film's transmittance. The experimental data and calculations were then incorporated into random resistor network simulations that demonstrated that wires with an aspect ratio of 400 or higher are required to make a network that transmits >90% of visible light while maintaining a sheet resistance below 100 O/sq-1. These properties, and the fact that copper and nickel are 1000 times more abundant than indium or silver, make copper and cupronickel nanowire films a promising alternative for the sustainable, efficient production of transparent conductors.

Simple and rapid hydrogenation of p-nitrophenol with aqueous formic acid in catalytic flow reactors

PubMed Central

Kawasaki, Shin-ichiro; Suzuki, Akira

2013-01-01

Summary The inner surface of a metallic tube (i.d. 0.5 mm) was coated with a palladium (Pd)-based thin metallic layer by flow electroless plating. Simultaneous plating of Pd and silver (Ag) from their electroless-plating solution produced a mixed distributed bimetallic layer. Preferential acid leaching of Ag from the Pd–Ag layer produced a porous Pd surface. Hydrogenation of p-nitrophenol was examined in the presence of formic acid simply by passing the reaction solution through the catalytic tubular reactors. p-Aminophenol was the sole product of hydrogenation. No side reaction occurred. Reaction conversion with respect to p-nitrophenol was dependent on the catalyst layer type, the temperature, pH, amount of formic acid, and the residence time. A porous and oxidized Pd (PdO) surface gave the best reaction conversion among the catalytic reactors examined. p-Nitrophenol was converted quantitatively to p-aminophenol within 15 s of residence time in the porous PdO reactor at 40 °C. Evolution of carbon dioxide (CO2) was observed during the reaction, although hydrogen (H2) was not found in the gas phase. Dehydrogenation of formic acid did not occur to any practical degree in the absence of p-nitrophenol. Consequently, the nitro group was reduced via hydrogen transfer from formic acid to p-nitrophenol and not by hydrogen generated by dehydrogenation of formic acid. PMID:23843908

Fabrication and Characteristics of High Capacitance Al Thin Films Capacitor Using a Polymer Inhibitor Bath in Electroless Plating Process.

PubMed

Cho, Young-Lae; Lee, Jung-Woo; Lee, Chang-Hyoung; Choi, Hyung-Seon; Kim, Sung-Su; Song, Young Il; Park, Chan; Suh, Su-Jeong

2015-10-01

An aluminum (Al) thin film capacitor was fabricated for a high capacitance capacitor using electrochemical etching, barrier-type anodizing, and electroless Ni-P plating. In this study, we focused on the bottom-up filling of Ni-P electrodes on Al2O3/Al with etched tunnels. The Al tunnel pits were irregularly distributed on the Al foil, diameters were in the range of about 0.5~1 μm, the depth of the tunnel pits was approximately 35~40 μm, and the complex structure was made full filled hard metal. To control the plating rate, the experiment was performed by adding polyethyleneimine (PEI, C2H5N), a high molecular substance. PEI forms a cross-link at the etching tunnel inlet, playing the role of delaying the inlet plating. When the PEI solution bath was used after activation, the Ni-P layer was deposited selectively on the bottoms of the tunnels. The characteristics were analyzed by adding the PEI addition quantity rate of 100~600 mg/L into the DI water. The capacitance of the Ni-P/Al2O3 (650~700 nm)/Al film was measured at 1 kHz using an impedance/gain phase analyzer. For the plane film without etch tunnels the capacitance was 12.5 nF/cm2 and for the etch film with Ni-P bottom-up filling the capacitance was 92 nF/cm2. These results illustrate a remarkable maximization of capacitance for thin film metal capacitors.

Fabrication of Aluminum-Based Thermal Radiation Plate for Thermoelectric Module Using Aluminum Anodic Oxidization and Copper Electroplating.

PubMed

Choi, Yi Taek; Bae, Sung Hwa; Son, Injoon; Sohn, Ho Sang; Kim, Kyung Tae; Ju, Young-Wan

2018-09-01

In this study, electrolytic etching, anodic oxidation, and copper electroplating were applied to aluminum to produce a plate on which a copper circuit for a thermoelectric module was formed. An oxide film insulating layer was formed on the aluminum through anodic oxidation, and platinum was coated by sputtering to produce conductivity. Finally, copper electroplating was performed directly on the substrate. In this structure, the copper plating layer on the insulating layer served as a conductive layer in the circuit. The adhesion of the copper plating layer was improved by electrolytic etching. As a result, the thermoelectric module fabricated in this study showed excellent adhesion and good insulation characteristics. It is expected that our findings can contribute to the manufacture of plates applicable to thermoelectric modules with high dissipation performance.

Development of a soft-soldering system for aluminum

NASA Astrophysics Data System (ADS)

Falke, W. L.; Lee, A. Y.; Neumeier, L. A.

1983-03-01

The method employs application of a thin nickel copper alloy coating to the substrate, which enables the tin lead solders to wet readily and spread over the areas to be joined. The aluminum substrate is mechanically or chemically cleaned to facilitate bonding to a minute layer of zinc that is subsequently applied, with an electroless zincate solution. The nickel copper alloy (30 to 70 pct Ni) coating is then applied electrolytically over the zinc, using immersion cell or brush coating techniques. Development of acetate electrolytes has permitted deposition of the proper alloys coatings. The coated areas can then be readily joined with conventional tin lead solders and fluxs. The joints so formed are ductile, strong, and relatively corrosion resistant, and exhibit strengths equivalent to those formed on copper and brass when the same solders and fluxes are used. The method has also been employed to soft solder magnesium alloys.

Copper-assisted, anti-reflection etching of silicon surfaces

DOEpatents

Toor, Fatima; Branz, Howard

2014-08-26

A method (300) for etching a silicon surface (116) to reduce reflectivity. The method (300) includes electroless deposition of copper nanoparticles about 20 nanometers in size on the silicon surface (116), with a particle-to-particle spacing of 3 to 8 nanometers. The method (300) includes positioning (310) the substrate (112) with a silicon surface (116) into a vessel (122). The vessel (122) is filled (340) with a volume of an etching solution (124) so as to cover the silicon surface (116). The etching solution (124) includes an oxidant-etchant solution (146), e.g., an aqueous solution of hydrofluoric acid and hydrogen peroxide. The silicon surface (116) is etched (350) by agitating the etching solution (124) with, for example, ultrasonic agitation, and the etching may include heating (360) the etching solution (124) and directing light (365) onto the silicon surface (116). During the etching, copper nanoparticles enhance or drive the etching process.

Fabrication of Porous Ag/TiO2/Au Coatings with Excellent Multipactor Suppression

PubMed Central

Wu, Duoduo; Ma, Jianzhong; Bao, Yan; Cui, Wanzhao; Hu, Tiancun; Yang, Jing; Bai, Yuanrui

2017-01-01

Porous Ag/TiO2/Au coatings with excellent multipactor suppression were prepared by fabrication of porous Ag surface through two-step wet chemical etching, synthesis of TiO2 coatings by electroless-plating-like solution deposition and deposition of Au coatings via electroless plating. Porous structure of Ag surface, TiO2 coatings on porous Ag surface and Au coatings on porous Ag/TiO2 surface were verified by field-emission scanning electron microscopy, the composition and crystal type of TiO2 coatings was characterized by X-ray photoelectron spectroscopy and X-ray diffraction. Secondary electron yield (SEY) measurement was used to monitor the SEY coefficient of the porous Ag coatings and Ag/TiO2/Au coatings. The as-obtained porous Ag coatings were proved exhibiting low SEY below 1.2, and the process was highly reproducible. In addition, the porous Ag/TiO2/Au coatings showed excellent multipactor suppression with the SEY 1.23 and good environmental stability. It is worth mentioning that the whole preparation process is simple and feasible, which would provide a promising application in RF devices. PMID:28281546

Lightweight bipolar storage battery

NASA Technical Reports Server (NTRS)

Rowlette, John J. (Inventor)

1992-01-01

An apparatus [10] is disclosed for a lightweight bipolar battery of the end-plate cell stack design. Current flow through a bipolar cell stack [12] is collected by a pair of copper end-plates [16a,16b] and transferred edgewise out of the battery by a pair of lightweight, low resistance copper terminals [28a,28b]. The copper terminals parallel the surface of a corresponding copper end-plate [16a,16b] to maximize battery throughput. The bipolar cell stack [12], copper end-plates [16a,16b] and copper terminals [28a,28b] are rigidly sandwiched between a pair of nonconductive rigid end-plates [20] having a lightweight fiber honeycomb core which eliminates distortion of individual plates within the bipolar cell stack due to internal pressures. Insulating foam [30] is injected into the fiber honeycomb core to reduce heat transfer into and out of the bipolar cell stack and to maintain uniform cell performance. A sealed battery enclosure [ 22] exposes a pair of terminal ends [26a,26b] for connection with an external circuit.

Self-assembled monolayer of designed and synthesized triazinedithiolsilane molecule as interfacial adhesion enhancer for integrated circuit

PubMed Central

2011-01-01

Self-assembled monolayer (SAM) with tunable surface chemistry and smooth surface provides an approach to adhesion improvement and suppressing deleterious chemical interactions. Here, we demonstrate the SAM comprising of designed and synthesized 6-(3-triethoxysilylpropyl)amino-1,3,5-triazine-2,4-dithiol molecule, which can enhance interfacial adhesion to inhibit copper diffusion used in device metallization. The formation of the triazinedithiolsilane SAM is confirmed by X-ray photoelectron spectroscopy. The adhesion strength between SAM-coated substrate and electroless deposition copper film was up to 13.8 MPa. The design strategy of triazinedithiolsilane molecule is expected to open up the possibilities for replacing traditional organosilane to be applied in microelectronic industry. PMID:21812994

Effect of nanostructure on rapid boiling of water on a hot copper plate: a molecular dynamics study

NASA Astrophysics Data System (ADS)

Fu, Ting; Mao, Yijin; Tang, Yong; Zhang, Yuwen; Yuan, Wei

2016-08-01

Molecular dynamic simulations are performed to study the effects of nanostructure on rapid boiling of water that is suddenly heated by a hot copper plate. The results show that the nanostructure has significant effects on energy transfer from solid copper plate to liquid water and phase change process from liquid water to vapor. The liquid water on the solid surface rapidly boil after contacting with an extremely hot copper plate and consequently a cluster of liquid water moves upward during phase change. The temperature of the water film when it separates from solid surface and its final temperature when the system is at equilibrium strongly depend on the size of the nanostructure. These temperatures increase with increasing size of nanostructure. Furthermore, a non-vaporized molecular layer is formed on the surface of the copper plate even continuous heat flux is passing into water domain through the plate.

Thermal and Surface Evaluation on The Process of Forming a Cu2O/CuO Semiconductor Photocatalyst on a Thin Copper Plate

NASA Astrophysics Data System (ADS)

Zainul, R.; Oktavia, B.; Dewata, I.; Efendi, J.

2018-04-01

This research aims to investigate the process of forming a multi-scale copper oxide semiconductor (CuO/Cu2O) through a process of calcining a copper plate. The changes that occur during the formation of the oxide are thermally and surface evaluated. Evaluation using Differential Thermal Analysis (DTA) obtained by surface change of copper plate happened at temperature 380°C. Calcination of oxide formation was carried out at temperature 380°C for 1 hour. Surface evaluation process by using Scanning Electron Microscope (SEM) surface and cross-section, to determine diffusion of oxide formation on copper plate. The material composition is monitored by XRF and XRD to explain the process of structural and physical changes of the copper oxide plate formed during the heating process. The thickness of Cu plates used is 200-250 μm. SEM analysis results, the oxygen atom interruption region is in the range of 20-30 μm, and diffuses deeper during thermal oxidation process. The maximum diffusion depth of oxygen atoms reaches 129 μm.

Research on metal-plated cellulose nitrate flakes and their infrared / millimeter wave characteristics

NASA Astrophysics Data System (ADS)

Ye, Shu-qin; Zhu, Chen-guang; Wang, Li-hong; Ou'yang, De-hua; Pan, Gong-pei

2016-10-01

Copper-plated and silver-plated cellulose nitrate flakes, which were prepared by using chemical plating technology, were used to jam infrared detector and millimeter-wave radar. It was tested for the conductivity and infrared jamming performance of plating and also the RCS (Radar Cross Section) performance of millimeter-wave radar. Test results showed that the prepared metal-plated cellulose nitrate flakes have obvious conductivity, and infrared total radiation energy of silver plating and copper plating had approximately increased 32% and 21% respectively. Through determination, the millimeter-wave reflecting property and RCS of silver-plated cellulose nitrate flakes were higher than that of copper-plated cellulose nitrate flakes. Therefore, silver-plated cellulose nitrate flakes can be used as an effective infrared / millimeter wave composite jamming material.

Preparation of graphite dispersed copper composite on copper plate with CO2 laser

NASA Astrophysics Data System (ADS)

Yokoyama, S.; Ishikawa, Y.; Muizz, M. N. A.; Hisyamudin, M. N. N.; Nishiyama, K.; Sasano, J.; Izaki, M.

2018-01-01

It was tried in this work to prepare the graphite dispersed copper composite locally on a copper plate with a CO2 laser. The objectives of this study were to clear whether copper graphite composite was prepared on a copper plate and how the composite was prepared. The carbon content at the laser spot decreased with the laser irradiation time. This mainly resulted from the elimination by the laser trapping. The carbon content at the outside of the laser spot increased with time. Both the laser ablation and the laser trapping did not act on the graphite particles at the outside of the laser spot. Because the copper at the outside of the laser spot melted by the heat conduction from the laser spot, the particles were fixed by the wetting. However, the graphite particles were half-floated on the copper plate. The Vickers hardness decreased with an increase with laser irradiation time because of annealing.

Indentation property and corrosion resistance of electroless nickel-phosphorus coatings deposited on austenitic high-Mn TWIP steel

NASA Astrophysics Data System (ADS)

Hamada, A. S.; Sahu, P.; Porter, D. A.

2015-11-01

A multilayer coating using electroless nickel-phosphorus (Ni-P) was applied on a twinning-induced plasticity (TWIP) steel containing nominally 25 wt.% Mn and 3 wt.% Al to improve the indentation hardness and corrosion properties. Microindentation tests with two different indenters, namely, a three-sided pyramidal Berkovich indenter and a ball indenter were performed to study the mechanical response, the indentation hardness and elastic modulus of the coatings in conditions: as-plated, and post treated (PT) at 350 °C and 700 °C for 1 h. The deformation morphology underneath the indenters was examined using a scanning laser microscope. The results showed that Ni-P coatings could significantly enhance the surface hardness of the TWIP steel. Significant improvement in the corrosion resistance could be observed in a sulfuric acid solution for the Ni-P coated steel compared to the uncoated substrate TWIP steel.

New fabrication method for an ellipsoidal neutron focusing mirror with a metal substrate.

PubMed

Guo, Jiang; Takeda, Shin; Morita, Shin-ya; Hino, Masahiro; Oda, Tatsuro; Kato, Jun-ichi; Yamagata, Yutaka; Furusaka, Michihiro

2014-10-06

We propose an ellipsoidal neutron focusing mirror using a metal substrate made with electroless nickel-phosphorus (NiP) plated material for the first time. Electroless NiP has great advantages for realizing an ellipsoidal neutron mirror because of its amorphous structure, good machinability and relatively large critical angle of total reflection for neutrons. We manufactured the mirror by combining ultrahigh precision cutting and fine polishing to generate high form accuracy and low surface roughness. The form accuracy of the mirror was estimated to be 5.3 μm P-V and 0.8 μm P-V for the minor-axis and major-axis direction respectively, while the surface roughness was reduced to 0.2 nm rms. The effect of form error on focusing spot size was evaluated by using a laser beam and the focusing performance of the mirror was verified by neutron experiments.

A microchip-based flow injection-amperometry system with mercaptopropionic acid modified electroless gold microelectrode for the selective determination of dopamine.

PubMed

Wang, Yi; Luo, Jie; Chen, Hengwu; He, Qiaohong; Gan, Nin; Li, Tianhua

2008-09-12

A novel chip-based flow injection analysis (FIA) system has been developed for automatic, rapid and selective determination of dopamine (DA) in the presence of ascorbic acid (AA). The system is composed of a polycarbonate (PC) microfluidic chip with an electrochemical detector (ED), a gravity pump, and an automatic sample loading and injection unit. The selectivity of the ED was improved by modification of the gold working microelectrode, which was fabricated on the PC chip by UV-directed electroless gold plating, with a self-assembled monolayer (SAM) of 3-mercaptopropionic acid (MPA). Postplating treatment methods for cleaning the surface of electroless gold microelectrodes were investigated to ensure the formation of high quality SAMs. The effects of detection potential, flow rate, and sampling volume on the performance of the chip-based FIA system were studied. Under optimum conditions, a detection limit of 74 nmol L(-1) for DA was achieved at the sample throughput rate of 180 h(-1). A RSD of 0.9% for peak heights was observed for 19 runs of a 100 micromol L(-1) DA solution. Interference-free determination of DA could be conducted if the concentration ratio of AA-DA was no more than 10.

Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments

NASA Astrophysics Data System (ADS)

Hannigan, K.; Reid, M.; Collins, M. N.; Dalton, E.; Xu, C.; Wright, B.; Demirkan, K.; Opila, R. L.; Reents, W. D.; Franey, J. P.; Fleming, D. A.; Punch, J.

2012-03-01

Recently, the corrosion resistance of printed wiring board (PWB) finishes has generated considerable interest due to field failures observed in various parts of the world. This study investigates the corrosion issues associated with the different lead-free PWB surface finishes. Corrosion products on various PWB surface finishes generated in mixed flowing gas (MFG) environments were studied, and analysis techniques such as scanning electron microscopy, energy-dispersive x-ray, x-ray diffraction, focused ion beam, and scanning Auger microscopy were used to quantify the corrosion layer thickness and determine the composition of corrosion products. The corrosion on organic solderability preservative samples shows similar corrosion products to bare copper and is mainly due to direct attack of copper traces by corrosive gases. The corrosion on electroless nickel immersion gold occurs primarily through the porosity in the film and is accelerated by the galvanic potential between gold and copper; similar results were observed on immersion silver. Immersion tin shows excellent corrosion resistance due to its inherent corrosion resistance in the MFG environment as well as the opposite galvanic potential between tin and copper compared with gold or silver and copper.

Copper Multiwall Carbon Nanotubes and Copper-Diamond Composites for Advanced Rocket Engines

NASA Technical Reports Server (NTRS)

Bhat, Biliyar N.; Ellis, Dave L.; Smelyanskiy, Vadim; Foygel, Michael; Singh, Jogender; Rape, Aaron; Vohra, Yogesh; Thomas, Vinoy; Li, Deyu; Otte, Kyle

2013-01-01

This paper reports on the research effort to improve the thermal conductivity of the copper-based alloy NARloy-Z (Cu-3 wt.%Ag-0.5 wt.% Zr), the state-of-the-art alloy used to make combustion chamber liners in regeneratively-cooled liquid rocket engines, using nanotechnology. The approach was to embed high thermal conductivity multiwall carbon nanotubes (MWCNTs) and diamond (D) particles in the NARloy-Z matrix using powder metallurgy techniques. The thermal conductivity of MWCNTs and D have been reported to be 5 to 10 times that of NARloy-Z. Hence, 10 to 20 vol. % MWCNT finely dispersed in NARloy-Z matrix could nearly double the thermal conductivity, provided there is a good thermal bond between MWCNTs and copper matrix. Quantum mechanics-based modeling showed that zirconium (Zr) in NARloy-Z should form ZrC at the MWCNT-Cu interface and provide a good thermal bond. In this study, NARloy-Z powder was blended with MWCNTs in a ball mill, and the resulting mixture was consolidated under high pressure and temperature using Field Assisted Sintering Technology (FAST). Microstructural analysis showed that the MWCNTs, which were provided as tangles of MWCNTs by the manufacturer, did not detangle well during blending and formed clumps at the prior particle boundaries. The composites made form these powders showed lower thermal conductivity than the base NARloy-Z. To eliminate the observed physical agglomeration, tangled multiwall MWCNTs were separated by acid treatment and electroless plated with a thin layer of chromium to keep them separated during further processing. Separately, the thermal conductivities of MWCNTs used in this work were measured, and the results showed very low values, a major factor in the low thermal conductivity of the composite. On the other hand, D particles embedded in NARloy-Z matrix showed much improved thermal conductivity. Elemental analysis showed migration of Zr to the NARloy-Z-D interface to form ZrC, which appeared to provide a low contact thermal resistance. These results are consistent with the quantum mechanics-based model predictions. NARloy-Z-D composites have relatively high thermal conductivities and are promising for further development.

Copper-Multiwall Carbon Nanotubes and Copper-Diamond Composites for Advanced Rocket Engines

NASA Technical Reports Server (NTRS)

Bhat, Biliyar N.; Ellis, Dave L.; Smelyanskiy, Vadim; Foygel, Michael; Rape, Aaron; Singh, Jogender; Vohra, Yogesh K.; Thomas, Vinoy; Otte, Kyle G.; Li, Deyu

2013-01-01

This paper reports on the research effort to improve the thermal conductivity of the copper-based alloy NARloy-Z (Cu-3 wt.%Ag-0.5 wt.% Zr), the state-of-the-art alloy used to make combustion chamber liners in regeneratively-cooled liquid rocket engines, using nanotechnology. The approach was to embed high thermal conductivity multiwall carbon nanotubes (MWCNTs) and diamond (D) particles in the NARloy-Z matrix using powder metallurgy techniques. The thermal conductivity of MWCNTs and D have been reported to be 5 to 10 times that of NARloy-Z. Hence, 10 to 20 vol. % MWCNT finely dispersed in NARloy-Z matrix could nearly double the thermal conductivity, provided there is a good thermal bond between MWCNTs and copper matrix. Quantum mechanics-based modeling showed that zirconium (Zr) in NARloy-Z should form ZrC at the MWCNT-Cu interface and provide a good thermal bond. In this study, NARloy-Z powder was blended with MWCNTs in a ball mill, and the resulting mixture was consolidated under high pressure and temperature using Field Assisted Sintering Technology (FAST). Microstructural analysis showed that the MWCNTs, which were provided as tangles of MWCNTs by the manufacturer, did not detangle well during blending and formed clumps at the prior particle boundaries. The composites made form these powders showed lower thermal conductivity than the base NARloy-Z. To eliminate the observed physical agglomeration, tangled multiwall MWCNTs were separated by acid treatment and electroless plated with a thin layer of chromium to keep them separated during further processing. Separately, the thermal conductivities of MWCNTs used in this work were measured, and the results showed very low values, a major factor in the low thermal conductivity of the composite. On the other hand, D particles embedded in NARloy-Z matrix showed much improved thermal conductivity. Elemental analysis showed migration of Zr to the NARloy-Z-D interface to form ZrC, which appeared to provide a low contact thermal resistance. These results are consistent with the quantum mechanics-based model predictions. NARloy-Z-D composites have relatively high thermal conductivities and are promising for further development.

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2014 CFR

2014-10-01

... Conshohocken, PA 19428-2959 ASTM B 96-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip... Operating Salt Spray (Fog) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and...

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2013 CFR

2013-10-01

... Conshohocken, PA 19428-2959 ASTM B 96-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip... Operating Salt Spray (Fog) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel-Zinc Alloy (Nickel Silver), and Copper-Nickel Alloy Plate, Sheet, Strip, and...

Purity test for copper-plating solutions

NASA Technical Reports Server (NTRS)

Mansfeld, F. B.

1977-01-01

Electrode configuration can be used to measure extent of impurities in acid-copper plating solution. It can be inserted into any plating tank and will show whether bath is clean or contaminated, within fifteen minutes.

Best Practices for Fuel System Contamination Detection and Remediation

DTIC Science & Technology

2015-12-14

Valve Fyre Ring GR DBB Style Plug Valve Gasket SS graphite Spiral DBB Style Plug Valve O- rings & slip seals VI DBB Style Plug Valve Packing gland...Pumps Impeller Key SS Vertical Turbine Pumps Impeller Retaining Ring SS Vertical Turbine Pumps Impellers (Electroless Nickel Plating) DI Vertical... Turbine Pumps Line Shaft SS Vertical Turbine Pumps Lineshaft Bearing CA Vertical Turbine Pumps Mating Ring Si-C Vertical Turbine Pumps Mechanical

Best Practices for Fuel System Contamination Detection and Remediation

DTIC Science & Technology

2016-01-15

Valve Fyre Ring GR DBB Style Plug Valve Gasket SS graphite Spiral DBB Style Plug Valve O- rings & slip seals VI DBB Style Plug Valve Packing gland...Pumps Impeller Key SS Vertical Turbine Pumps Impeller Retaining Ring SS Vertical Turbine Pumps Impellers (Electroless Nickel Plating) DI Vertical... Turbine Pumps Line Shaft SS Vertical Turbine Pumps Lineshaft Bearing CA Vertical Turbine Pumps Mating Ring Si-C Vertical Turbine Pumps Mechanical

A Module Experimental Process System Development Unit (MEPSDU). [development of low cost solar arrays

NASA Technical Reports Server (NTRS)

1981-01-01

The technical readiness of a cost effective process sequence that has the potential for the production of flat plate photovoltaic modules which met the price goal in 1986 of $.70 or less per Watt peak was demonstrated. The proposed process sequence was reviewed and laboratory verification experiments were conducted. The preliminary process includes the following features: semicrystalline silicon (10 cm by 10 cm) as the silicon input material; spray on dopant diffusion source; Al paste BSF formation; spray on AR coating; electroless Ni plate solder dip metallization; laser scribe edges; K & S tabbing and stringing machine; and laminated EVA modules.

New Methods of Enhancing the Thermal Durability of Silica Optical Fibers.

PubMed

Wysokiński, Karol; Stańczyk, Tomasz; Gibała, Katarzyna; Tenderenda, Tadeusz; Ziołowicz, Anna; Słowikowski, Mateusz; Broczkowska, Małgorzata; Nasiłowski, Tomasz

2014-10-13

Microstructured optical fibers can be precisely tailored for many different applications, out of which sensing has been found to be particularly interesting. However, placing silica optical fiber sensors in harsh environments results in their quick destruction as a result of the hydrolysis process. In this paper, the degradation mechanism of bare and metal-coated optical fibers at high temperatures under longitudinal strain has been determined by detailed analysis of the thermal behavior of silica and metals, like copper and nickel. We furthermore propose a novel method of enhancing the lifetime of optical fibers by the deposition of electroless nickel-phosphorous alloy in a low-temperature chemical process. The best results were obtained for a coating comprising an inner layer of copper and outer layer of low phosphorous nickel. Lifetime values obtained during the annealing experiments were extrapolated to other temperatures by a dedicated model elaborated by the authors. The estimated copper-coated optical fiber lifetime under cycled longitudinal strain reached 31 h at 450 °C.

New Methods of Enhancing the Thermal Durability of Silica Optical Fibers

PubMed Central

Wysokiński, Karol; Stańczyk, Tomasz; Gibała, Katarzyna; Tenderenda, Tadeusz; Ziołowicz, Anna; Słowikowski, Mateusz; Broczkowska, Małgorzata; Nasiłowski, Tomasz

2014-01-01

Microstructured optical fibers can be precisely tailored for many different applications, out of which sensing has been found to be particularly interesting. However, placing silica optical fiber sensors in harsh environments results in their quick destruction as a result of the hydrolysis process. In this paper, the degradation mechanism of bare and metal-coated optical fibers at high temperatures under longitudinal strain has been determined by detailed analysis of the thermal behavior of silica and metals, like copper and nickel. We furthermore propose a novel method of enhancing the lifetime of optical fibers by the deposition of electroless nickel-phosphorous alloy in a low-temperature chemical process. The best results were obtained for a coating comprising an inner layer of copper and outer layer of low phosphorous nickel. Lifetime values obtained during the annealing experiments were extrapolated to other temperatures by a dedicated model elaborated by the authors. The estimated copper-coated optical fiber lifetime under cycled longitudinal strain reached 31 h at 450 °C. PMID:28788224

Brazing open cell reticulated copper foam to stainless steel tubing with vacuum furnace brazed gold/indium alloy plating

DOEpatents

Howard, Stanley R [Windsor, SC; Korinko, Paul S [Aiken, SC

2008-05-27

A method of fabricating a heat exchanger includes brush electroplating plated layers for a brazing alloy onto a stainless steel tube in thin layers, over a nickel strike having a 1.3 .mu.m thickness. The resultant Au-18 In composition may be applied as a first layer of indium, 1.47 .mu.m thick, and a second layer of gold, 2.54 .mu.m thick. The order of plating helps control brazing erosion. Excessive amounts of brazing material are avoided by controlling the electroplating process. The reticulated copper foam rings are interference fit to the stainless steel tube, and in contact with the plated layers. The copper foam rings, the plated layers for brazing alloy, and the stainless steel tube are heated and cooled in a vacuum furnace at controlled rates, forming a bond of the copper foam rings to the stainless steel tube that improves heat transfer between the tube and the copper foam.

A Novel Method for Electroplating Ultra-High-Strength Glassy Metals

NASA Technical Reports Server (NTRS)

Ramsey, Brian; Engelhaupt, Darell; Six, N. Frank (Technical Monitor)

2002-01-01

A novel method for electroplating ultra-high-strength glassy metals, nickel-phosphorous and nickel-cobalt-phosphorous, has been developed at NASA Marshall Space Flight Center, cooperatively with the University of Alabama in Huntsville. Traditionally, thin coatings of these metals are achieved via electroless deposition. Benefits of the new electrolytic process include thick, low-stress deposits, free standing shapes, lower plating temperature, low maintenance, and safer operation with substantially lower cost.

Polyfibroblast: A Self-Healing and Galvanic Protection Additive

DTIC Science & Technology

2009-01-29

microencapsulated MCPU would have a limited shelf life. The shelf-life is expected to improve even further once the zinc outer shell is added and the microcapsules ...MEMBRANE 4 3.3 PREPARATION OF POLYURETHANE MICROCAPSULES 5 3.4 ELECTROLESS ZINC DEPOSITION 7 4 NEXT STEPS 4.1 ELECTROCHEMICAL ROUTE 7 4.2...Plating conditions must be adjusted to form thicker walls, however. We were also successful in microencapsulating uncured polyurethane resin in a hard

The Electrodeposition of Rhenium and Its Alloys

DTIC Science & Technology

2015-09-18

of the coating . In order to improve the stability of such layers, thermal treatment is required. The observation of the H0.57ReO3 phase is...the range of 10–100 nm on conductive and non- conductive substrates, either as a stand-alone coating or as a seed DISTRIBUTION A: Distribution approved... coatings on carbons, carbon-carbon composites, semiconducting and non- conducting surfaces. Pure Re cannot be deposited from electroless plating

Preparation of graphite dispersed copper composite with intruding graphite particles in copper plate

NASA Astrophysics Data System (ADS)

Noor, Abdul Muizz Mohd; Ishikawa, Yoshikazu; Yokoyama, Seiji

2017-01-01

In this study, it was attempted that copper-graphite composite was prepared locally on the surface of a copper plate with using a spot welding machine. Experiments were carried out with changing the compressive load, the repetition number of the compression and the electrical current in order to study the effect of them on carbon content and Vickers hardness on the copper plate surface. When the graphite was pushed into copper plate only with the compressive load, the composite was mainly hardened by the work hardening. The Vickers hardness increased linearly with an increase in the carbon content. When an electrical current was energized through the composite at the compression, the copper around the graphite particles were heated to the temperature above approximately 2100 K and melted. The graphite particles partially or entirely dissolved into the melt. The graphite particles were precipitated from the melt under solidification. In addition, this high temperature caused the improvement of wetting of copper to graphite. This high temperature caused the annealing, and reduced the Vickers hardness. Even in this case, the Vickers hardness increased with an increase in the carbon content. This resulted from the dispersion hardening.

Paper-Based Inkjet-Printed Flexible Electronic Circuits.

PubMed

Wang, Yan; Guo, Hong; Chen, Jin-Ju; Sowade, Enrico; Wang, Yu; Liang, Kun; Marcus, Kyle; Baumann, Reinhard R; Feng, Zhe-Sheng

2016-10-05

Printed flexible electronics have been widely studied for their potential use in various applications. In this paper, a simple, low-cost method of fabricating flexible electronic circuits with high conductivity of 4.0 × 10 7 S·m -1 (about 70% of the conductivity of bulk copper) is demonstrated. Teslin paper substrate is treated with stannous chloride (SnCl 2 ) colloidal solution to reduce the high ink absorption rate, and then the catalyst ink is inkjet-printed on its surface, followed by electroless deposition of copper at low temperature. In spite of the decrease in conductance to some extent, electronic circuits fabricated by this method can maintain function even under various folding angles or after repeated folding. This developed technology has great potential in a variety of applications, such as three-dimensional devices and disposable RFID tags.

Neutronics Benchmarks for the Utilization of Mixed-Oxide Fuel: Joint U.S./ Russian Progress Report for Fiscal Year 1997, Volume 4, Part 8 - Neutron Poison Plates in Assemblies Containing Homogeneous Mixtures of Polystyrene-Moderated Plutonium and Uranium Oxides

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yavuz, M.

1999-05-01

In the 1970s at the Battelle Pacific Northwest Laboratory (PNL), a series of critical experiments using a remotely operated Split-Table Machine was performed with homogeneous mixtures of (Pu-U)O{sub 2}-polystyrene fuels in the form of square compacts having different heights. The experiments determined the critical geometric configurations of MOX fuel assemblies with and without neutron poison plates. With respect to PuO{sub 2} content and moderation [H/(Pu+U)atomic] ratio (MR), two different homogeneous (Pu-U) O{sub 2}-polystyrene mixtures were considered: Mixture (1) 14.62 wt% PuO{sub 2} with 30.6 MR, and Mixture (2) 30.3 wt% PuO{sub 2} with 2.8 MR. In all mixtures, the uraniummore » was depleted to about O.151 wt% U{sup 235}. Assemblies contained copper, copper-cadmium or aluminum neutron poison plates having thicknesses up to {approximately}2.5 cm. This evaluation contains 22 experiments for Mixture 1, and 10 for Mixture 2 compacts. For Mixture 1, there are 10 configurations with copper plates, 6 with aluminum, and 5 with copper-cadmium. One experiment contained no poison plate. For Mixture 2 compacts, there are 3 configurations with copper, 3 with aluminum, and 3 with copper-cadmium poison plates. One experiment contained no poison plate.« less

Migration of copper and some other metals from copper tableware

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ishiwata, H.; Inoue, T.; Yoshihira, K.

Intake of heavy metals is an important problem in human health. Certain heavy metals are avoided with regard to their use for utensils or tableware coming into contact with food, although copper is widely used in food processing factories or at home. The use of copper products for the processing, cooking or serving of foods and beverages is considered to be a cause of a copper contamination. Although copper is essential element, its excess ingestion is undesirable. In this study, the migration of copper from tin-plated or non-plated copperware under several experimental conditions was investigated using food-simulating solvents.

Surface texturing of fluoropolymers

NASA Technical Reports Server (NTRS)

Banks, B. A.; Mirtich, M. J.; Sovey, J. S. (Inventor)

1982-01-01

A method is disclosed for improving surface texture for adhesive bonding, metal bonding, substrate plating, decal substrate preparation, and biomedical implant applications. The surface to be bonded is dusted in a controlled fashion to produce a disbursed layer of fine mesh particles which serve as masks. The surface texture is produced by impinging gas ions on the masked surface. The textured surface takes the form of pillars or cones. The bonding material, such as a liquid epoxy, flows between the pillars which results in a bond having increased strength. For bonding metals a thin film of metal is vapor or sputter deposited onto the textured surface. Electroplating or electroless plating is then used to increase the metal thickness in the desired amount.

Crack Growth of D6 Steel in Air and High Pressure Oxygen

NASA Technical Reports Server (NTRS)

Bixler, W. D.; Engstrom, W. L.

1971-01-01

Fracture and subcritical flaw growth characteristics were experimentally deter­mined for electroless nickel plated D6 steel in dry air and high pressure oxygen environments as applicable to the Lunar Module/Environmental Control System (LM/ECS) descent gaseous oxygen (GOX) tank. The material tested included forgings, plate, and actual LM/ECS descent GOX tank material. Parent metal and TIG (tungsten inert gas) welds were tested. Tests indicate that proof testing the tanks at 4000 pounds per square inch or higher will insure safe operation at 3060 pounds per square inch. Although significant flaw growth can occur during proofing, subsequent growth of flaws during normal tank operation is negligible.

A REVIEW OF ACID COPPER PLATING BATH LIFE EXTENSION AND COPPER RECOVERY FROM ACID COPPER BATHS

EPA Science Inventory

Large quantities of hazardous waste, most in aqueous solution or sludges, are being produced at numerous metal plating and processing facilities in the U.S. Regulatory pressures, future liability, and limited landfill space have driven the cost of metal waste disposal to level...

Modeling, Fabrication and Characterization of Scalable Electroless Gold Plated Nanostructures for Enhanced Surface Plasmon Resonance

NASA Astrophysics Data System (ADS)

Jang, Gyoung Gug

The scientific and industrial demand for controllable thin gold (Au) film and Au nanostructures is increasing in many fields including opto-electronics, photovoltaics, MEMS devices, diagnostics, bio-molecular sensors, spectro-/microscopic surfaces and probes. In this study, a novel continuous flow electroless (CF-EL) Au plating method is developed to fabricate uniform Au thin films in ambient condition. The enhanced local mass transfer rate and continuous deposition resulting from CF-EL plating improved physical uniformity of deposited Au films and thermally transformed nanoparticles (NPs). Au films and NPs exhibited improved optical photoluminescence (PL) and surface plasmon resonance (SPR), respectively, relative to batch immersion EL (BI-EL) plating. Suggested mass transfer models of Au mole deposition are consistent with optical feature of CF-EL and BI-EL films. The prototype CF-EL plating system is upgraded an automated scalable CF-EL plating system with real-time transmission UV-vis (T-UV) spectroscopy which provides the advantage of CF-EL plating, such as more uniform surface morphology, and overcomes the disadvantages of conventional EL plating, such as no continuous process and low deposition rate, using continuous process and controllable deposition rate. Throughout this work, dynamic morphological and chemical transitions during redox-driven self-assembly of Ag and Au film on silica surfaces under kinetic and equilibrium conditions are distinguished by correlating real-time T-UV spectroscopy with X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) measurements. The characterization suggests that four previously unrecognized time-dependent physicochemical regimes occur during consecutive EL deposition of silver (Ag) and Au onto tin-sensitized silica surfaces: self-limiting Ag activation; transitory Ag NP formation; transitional Au-Ag alloy formation during galvanic replacement of Ag by Au; and uniform morphology formation under controlled hydraulic conditions. A method to achieve the time-resolved optical profile of EL Au plating was devised and provided a new transitional EL Au film growth model which validated mass transfer model prediction of the deposited thickness of ≤100 nm thin films. As a part of the project, validation of mass transfer model, a spectrophotometric method for quantitative analysis of metal ion is developed that improves the limit of detection comparable to conventional instrumental analysis. The present work suggests that modeling, fabrication and characterization of this novel CF-EL plating method is performed to achieve an ultimate purpose: developing a reliable, inexpensive wet chemical process for controlled metal thin film and nanostructure fabrication.

Annealing effects in plated-wire memory elements. I - Interdiffusion of copper and Permalloy.

NASA Technical Reports Server (NTRS)

Knudson, C. I.; Kench, J. R.

1971-01-01

Results of investigations using X-ray diffraction and electron-beam microprobe techniques have shown that copper and Permalloy platings interdiffuse at low temperatures when plated-wire memory elements are annealed for times as short as 50 hr. Measurable interdiffusion between Permalloy platings and gold substrates does not occur in similar conditions. Both magnetic and compositional changes during aging are found to occur by a thermally activated process with activation energies around 38 kcal/mol. It is shown, however, that copper-diffusion and magnetic-dispersion changes during aging are merely concurrent processes, neither being the other's cause.

METHOD OF APPLYING COPPER COATINGS TO URANIUM

DOEpatents

Gray, A.G.

1959-07-14

A method is presented for protecting metallic uranium, which comprises anodic etching of the uranium in an aqueous phosphoric acid solution containing chloride ions, cleaning the etched uranium in aqueous nitric acid solution, promptly electro-plating the cleaned uranium in a copper electro-plating bath, and then electro-plating thereupon lead, tin, zinc, cadmium, chromium or nickel from an aqueous electro-plating bath.

The Effect of Size and Size Distribution on the Oxidation Kinetics and Plasmonics of Nanoscale Ag Particles

DTIC Science & Technology

2010-01-01

examine the stability to oxidation of the silver nanoparticles , SERS measurements were carried out on a single dielectric ZnO nanowire core/silver...employed a simple and effective electroless (EL) plating approach to produce silver nanoparticles (NPs) on bare silicon, on dielectric ZnO nanowires (NWs...nature of silver, the Ag surface is easily oxidized in the air. Hence, it is important to understand the silver nanoparticle oxidation processes in

Effect of nucleation time on bending response of ionic polymer–metal composite actuators

DOE PAGES

Kim, Suran; Hong, Seungbum; Choi, Yoon-Young; ...

2013-07-02

We attempted an autocatalytic electro-less plating of nickel in order to replace an electroless impregnation-reduction (IR) method in ionic polymer–metal composite (IPMC) actuators to reduce cost and processing time. Because nucleation time of Pd–Sn colloids is the determining factor of overall processing time, we used the nucleation time as our control parameter. In order to optimize nucleation time and investigate its effect on the performance of IPMC actuators, we analyzed the relationship between the nucleation time, interface morphology and electrical properties. The optimized nucleation time was 10 h. Furthermore, the trends of the performance and electrical properties as a functionmore » of nucleation time were attributed to the fact that the Ni penetration depth was determined by the minimum diffusion length of either Pd–Sn colloids or reducing agent ions. The Ni-IPMC actuators can be fabricated less than 14 h processing time without deteriorating performance of the actuators, which is comparable to Pt-IPMC prepared by IR method.« less

Laser-induced surface modification of biopolymers – micro/nanostructuring and functionalization

NASA Astrophysics Data System (ADS)

Stankova, N. E.; Atanasov, P. A.; Nedyalkov, N. N.; Tatchev, Dr; Kolev, K. N.; Valova, E. I.; Armyanov, St. A.; Grochowska, K.; Śliwiński, G.; Fukata, N.; Hirsch, D.; Rauschenbach, B.

2018-03-01

The medical-grade polydimethylsiloxane (PDMS) elastomer is a widely used biomaterial in medicine for preparation of high-tech devices because of its remarkable properties. In this paper, we present experimental results on surface modification of PDMS elastomer by using ultraviolet, visible, and near-infrared ns-laser system and investigation of the chemical composition and the morphological structure inside the treated area in dependence on the processing parameters – wavelength, laser fluence and number of pulses. Remarkable chemical transformations and changes of the morphological structure were observed, resulting in the formation of a highly catalytically active surface, which was successfully functionalized via electroless Ni and Pt deposition by a sensitizing-activation free process. The results obtained are very promising in view of applying the methods of laser-induced micro- and nano-structuring and activation of biopolymers’ surface and further electroless metal plating to the preparation of, e.g., multielectrode arrays (MEAs) devices in neural and muscular surface interfacing implantable systems.

The Electrochemical Behavior of Carbon Fiber Microelectrodes Modified with Carbon Nanotubes Using a Two-Step Electroless Plating/Chemical Vapor Deposition Process

PubMed Central

Lu, Longsheng; Liang, Linsheng; Teh, Kwok Siong; Xie, Yingxi; Wan, Zhenping; Tang, Yong

2017-01-01

Carbon fiber microelectrode (CFME) has been extensively applied in the biosensor and chemical sensor domains. In order to improve the electrochemical activity and sensitivity of the CFME, a new CFME modified with carbon nanotubes (CNTs), denoted as CNTs/CFME, was fabricated and investigated. First, carbon fiber (CF) monofilaments grafted with CNTs (simplified as CNTs/CFs) were fabricated in two key steps: (i) nickel electroless plating, followed by (ii) chemical vapor deposition (CVD). Second, a single CNTs/CF monofilament was selected and encapsulated into a CNTs/CFME with a simple packaging method. The morphologies of as-prepared CNTs/CFs were characterized by scanning electron microscopy. The electrochemical properties of CNTs/CFMEs were measured in potassium ferrocyanide solution (K4Fe(CN)6), by using a cyclic voltammetry (CV) and a chronoamperometry method. Compared with a bare CFME, a CNTs/CFME showed better CV curves with a higher distinguishable redox peak and response current; the higher the CNT content was, the better the CV curves were. Because the as-grown CNTs significantly enhanced the effective electrode area of CNTs/CFME, the contact area between the electrode and reactant was enlarged, further increasing the electrocatalytic active site density. Furthermore, the modified microelectrode displayed almost the same electrochemical behavior after 104 days, exhibiting remarkable stability and outstanding reproducibility. PMID:28358344

Enhanced electrochemical performance and carbon anti-coking ability of solid oxide fuel cells with silver modified nickel-yttrium stabilized zirconia anode by electroless plating

NASA Astrophysics Data System (ADS)

Wu, Xiaoyan; Tian, Yu; Zhang, Jun; Zuo, Wei; Kong, Xiaowei; Wang, Jinghui; Sun, Kening; Zhou, Xiaoliang

2016-01-01

In this paper, silver (Ag) particles are introduced into the conventional Ni/YSZ anode by utilizing electroless plating method to improve its carbon anti-coking ability in hydrocarbons. The experimental results show that electrochemical performances of the decorated cells in H2, CH4 and C2H6 are all increased as compared to the cell with unmodified Ni/YSZ anode, which are verified by impedance spectrums as well. The durability experiment is carried out for as long as 24 h at the current density of 0.33 A/cm2 where the modified anode is subjected to dry C2H6 indicating the anti-coking ability of the anode is greatly improved. Scanning electron microscope shows that the slight decreasing in the cell terminal voltage can be attributed to the minimized carbon deposition which maybe resulted from the aggregation of silver particles at high temperature. Energy-dispersive X-ray spectroscopy line scanning results after long-term stability operation of the anode suggest that the carbon deposition can be depressed effectively both inside the anode and on the surface of the anode. Therefore, the results show that silver is a promising candidate material for modifying the Ni/YSZ anode with regard to improving electrochemical performance and suppressing the carbon deposition when taking the hydrocarbons as fuels.

Nondestructive test method accurately sorts mixed bolts

NASA Technical Reports Server (NTRS)

Dezeih, C. J.

1966-01-01

Neutron activation analysis method sorts copper plated steel bolts from nickel plated steel bolts. Copper and nickel plated steel bolt specimens of the same configuration are irradiated with thermal neutrons in a test reactor for a short time. After thermal neutron irradiation, the bolts are analyzed using scintillation energy readout equipment.

Optimizing friction stir weld parameters of aluminum and copper using conventional milling machine

NASA Astrophysics Data System (ADS)

Manisegaran, Lohappriya V.; Ahmad, Nurainaa Ayuni; Nazri, Nurnadhirah; Noor, Amirul Syafiq Mohd; Ramachandran, Vignesh; Ismail, Muhammad Tarmizizulfika; Ahmad, Ku Zarina Ku; Daruis, Dian Darina Indah

2018-05-01

The joining of two of any particular materials through friction stir welding (FSW) are done by a rotating tool and the work piece material that generates heat which causes the region near the FSW tool to soften. This in return will mechanically intermix the work pieces. The first objective of this study is to join aluminum plates and copper plates by means of friction stir welding process using self-fabricated tools and conventional milling machine. This study also aims to investigate the optimum process parameters to produce the optimum mechanical properties of the welding joints for Aluminum plates and Copper plates. A suitable tool bit and a fixture is to be fabricated for the welding process. A conventional milling machine will be used to weld the aluminum and copper. The most important parameters to enable the process are speed and pressure of the tool (or tool design and alignment of the tool onto the work piece). The study showed that the best surface finish was produced from speed of 1150 rpm and tool bit tilted to 3°. For a 200mm × 100mm Aluminum 6061 with plate thickness of 2 mm at a speed of 1 mm/s, the time taken to complete the welding is only 200 seconds or equivalent to 3 minutes and 20 seconds. The Copper plates was successfully welded using FSW with tool rotation speed of 500 rpm, 700 rpm, 900 rpm, 1150 rpm and 1440 rpm and with welding traverse rate of 30 mm/min, 60 mm/min and 90 mm/min. As the conclusion, FSW using milling machine can be done on both Aluminum and Copper plates, however the weld parameters are different for the two types of plates.

Modification and Utilization of Nanoporous Gold for Loading and Release of Drugs

NASA Astrophysics Data System (ADS)

Al-badri, Ibtisam

Nanoporous gold (np-Au) is a sponge-like structure of gold, which can be created by removing the less noble element from the precursor alloy, most typically silver or copper, using different chemical or electrochemical methods. It consists of interconnected ligaments and gaps between the ligaments, whose width can range from a few nanometers to a few hundreds of nanometers, creating a high surface area-to-volume ratio. Due to its many important properties (e.g., conductivity, high surface area-to-volume ratio, plasmonic response, biocompatibility, chemically inertness, and physically robustness), np-Au is suitable for different types of applications, including as a transducer for biosensors, in catalysis, for biomolecule separation, as a substrate for enzyme immobilization, and in drug delivery. The widths of the ligaments and gaps of np-Au can be easily tuned by varying conditions during the pre- or post-production process, for example, time kept in an acid bath and post-annealing (e.g. thermal, chemical, and electrochemical), depending on the requirement of the study. Thermal annealing is a commonly used process for tuning the ligaments and pore size of np-Au. However, the effects of thermal annealing on modification of ligaments and gaps sizes are not completely understood and more research needs to be done. Herein, we have explored the effect of annealing time and thickness of the np-Au sample on modification of ligaments and gaps. Furthermore, we used the electroless plating method to cover the pores or gaps partially on the surface without modifying the interior of np-Au. As-prepared np-Au was then studied as a platform for molecular loading and releasing kinetics for the possible use in drug delivery. We have found that simply applying the electroless deposition for 1 to 5 min can drastically decrease the rate of release of the molecules, and flow cell-based loading is the preferred way to load the molecules inside np-Au compared to the static method. The structure of the np-Au monoliths before and after the modification was characterized using Energy-Dispersive X-ray Spectroscopy (EDS) and scanning electron microscopy (SEM), whereas the molecular loading and releasing studies were performed using UV-Vis spectrophotometer.

EFFECTS OF LASER RADIATION ON MATTER. LASER PLASMA: Selective metallisation of diamonds with the aid of laser radiation

NASA Astrophysics Data System (ADS)

Shafeev, Georgii A.; Pimenov, S. M.; Lubnin, Evgenii N.; Smolin, A. A.; Konov, Vitalii I.; Laptev, V. A.

1995-02-01

An experimental investigation was made of laser activation of diamond surfaces (single crystals and polycrystalline diamond films) prior to electroless before catalytic deposition of metals from solutions. The activation was carried out by a copper vapour laser or a KrF excimer laser in two ways: decomposition of a thin film of palladium acetylacetonate and local laser stimulated modification of the diamond surface by laser evaporation. An ohmic contact (Cu or Ni) with an adhesive strength of 3 N mm-2 was formed and the spatial resolution achieved was 10 μm.

Effect of Pd Interlayer on Electrochemical Properties of ENIG Surface Finish in 3.5 wt.% NaCl Solution

NASA Astrophysics Data System (ADS)

Nam, N. D.; Bui, Q. V.; Nhan, H. T.; Phuong, D. V.; Bian, M. Z.

2014-09-01

The corrosion resistance of a multilayered (NiP-Pd-Au) coating with various thicknesses of palladium (Pd) interlayer deposited on copper by an electroless method was investigated using electrochemical techniques including potentiodynamic polarization and electrochemical impedance spectroscopy. In addition, the surface finish was examined by x-ray diffraction analysis and scanning electron microscopy, and the contact angle of the liquid-solid interface was recorded. The corrosion resistance of the copper substrate was considerably improved by Pd interlayer addition. Increase of the thickness of the Pd interlayer enhanced the performance of the Cu-NiP-Pd-Au coating due to low porosity, high protective efficiency, high charge-transfer resistance, and contact angle. These are attributed to the diffusion of layers in the Cu-NiP-Pd-Au coating acting as a physical barrier layer, leading to the protection provided by the coating.

Tribological Analysis of Copper-Coated Graphite Particle-Reinforced A359 Al/5 wt.% SiC Composites

NASA Astrophysics Data System (ADS)

Lin, C. B.; Wang, T. C.; Chang, Z. C.; Chu, H. Y.

2013-01-01

Copper-coated graphite particles can be mass-produced by the cementation process using simple equipment. Graphite particulates that were coated with electroless copper and 5 wt.% SiC particulates were introduced into an aluminum alloy by compocasting to make A359 Al/5 wt.% SiC(p) composite that contained 2, 4, 6, and 8 wt.% graphite particulate composite. The effects of SiC particles, quantity of graphite particles, normal loading, sliding speed and wear debris on the coefficient of friction, and the wear rate were investigated. The results thus obtained indicate that the wear properties were improved by adding small amounts of SiC and graphite particles into the A359 Al alloy. The coefficient of friction of the A359 Al/5 wt.% SiC(p) composite that contained 6.0 wt.% graphite particulates was reduced to 0.246 and the amount of graphite film that was released on the worn surface increased with the graphite particulate content. The coefficient of friction and the wear rate were insensitive to the variation in the sliding speed and normal loading.

Laser patterning of laminated structures for electroplating

DOEpatents

Mayer, Steven T.; Evans, Leland B.

1993-01-01

A process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale.

Laser patterning of laminated structures for electroplating

DOEpatents

Mayer, S.T.; Evans, L.B.

1993-11-23

A process for laser patterning of a substrate so that it can be subsequently electroplated or electrolessly plated. The process utilizes a laser to treat an inactive (inert) layer formed over an active layer to either combine or remove the inactive layer to produce a patterned active layer on which electrodeposition can occur. The process is carried out by utilizing laser alloying and laser etching, and involves only a few relatively high yield steps and can be performed on a very small scale. 9 figures.

Preparation and Properties of Polyurethane and Polyurethaneurea Elastomers from Methylene Bis(4-Cyclohexylisocyanate).

DTIC Science & Technology

1983-10-01

EMILY A. MCHUGH , RICHARD W. MATTON, MARK A. CLEAVES, DANIEL P. MACK, and NATHANIEL S. SCHNEIDER POLYMER RESEARCH DIVISION Octoer 1983 DT’C E’’ i 0...AUTHOR(e) S. CONTRACT OR GRANT NUMBER(O) Catherine A. Byrne, Emily A. McHugh , Richard W. Matton, Mark A. Cleaves, Daniel P. Mack,* and Nathaniel S...impregnated Poly-plating, Inc. see text electroless nickel 4610 Westover Rd. Westover Industrial Air Park Chicopee, MA 01022 Plasm-deposited Dr. N. Morosoff

Finding Platinum-Coating Gaps On Titanium Anodes

NASA Technical Reports Server (NTRS)

Bodemeijer, Ronnald; Flowers, Cecil E.

1990-01-01

Simple procedure makes gaps visible to eye. New gap-detection method consists of plating thin layer of non-silver-colored metal like copper or gold on anode. Contrast in color between plated metal and bare anode material makes gaps stand out. If anode passes inspection, copper or gold plate removable by reversal of test-plating current. Remains to be determined whether test plating and removal damages anode. New method simpler and more economical than previous attempts to identify gaps in platinum.

Process for making diamonds

NASA Technical Reports Server (NTRS)

Rasquin, J. R.; Estes, M. F. (Inventor)

1973-01-01

A description is given of a device and process for making industrial diamonds. The device is composed of an exponential horn tapering from a large end to a small end, with a copper plate against the large end. A magnetic hammer abuts the copper plate. The copper plate and magnetic hammer function together to create a shock wave at the large end of the horn. As the wave propagates to the small end, the extreme pressure and temperature caused by the wave transforms the graphite, present in an anvil pocket at the small end, into diamonds.

Array automated assembly task, phase 2. Low cost silicon solar array project

NASA Technical Reports Server (NTRS)

Rhee, S. S.; Jones, G. T.; Allison, K. T.

1978-01-01

Several modifications instituted in the wafer surface preparation process served to significantly reduce the process cost to 1.55 cents per peak watt in 1975 cents. Performance verification tests of a laser scanning system showed a limited capability to detect hidden cracks or defects, but with potential equipment modifications this cost effective system could be rendered suitable for applications. Installation of electroless nickel plating system was completed along with an optimization of the wafer plating process. The solder coating and flux removal process verification test was completed. An optimum temperature range of 500-550 C was found to produce uniform solder coating with the restriction that a modified dipping procedure is utilized. Finally, the construction of the spray-on dopant equipment was completed.

Shock induced spall fracture in polycrystalline copper

NASA Astrophysics Data System (ADS)

Mukherjee, D.; Rav, Amit; Sur, Amit; Joshi, K. D.; Gupta, Satish C.

2014-04-01

The plate impact experiments have been conducted on commercially available 99.99% pure polycrystalline samples of copper using single stage gas gun facility. The free surface velocity history of the sample plate measured using VISAR instrument is utilized to determine the dynamic yield strength and spall strength of copper. The dynamic yield strength and spall strength of polycrystalline copper sample has been determined to be 0.14 GPa and 1.32 GPa, respectively with corresponding strain rates of the order of 104/s.

Development of technique for AR coating and nickel and copper metallization of solar cells. FPS Project: Product development

NASA Technical Reports Server (NTRS)

Taylor, W.

1982-01-01

Printed nickel overplated with copper and applied on top of a predeposited silicon nitride antireflective coating system for metallizing solar cells was analyzed. The ESL D and E paste formulations, and the new formulations F, G, H, and D-1 were evaluated. The nickel thick films were tested after firing for stability in the cleaning and plating solutions used in the Vanguard-Pacific brush plating process. It was found that the films are very sensitive to the leaning and alkaline copper solutions. Less sensitivity was displayed to the neutral copper solution. Microscopic and SEM observations show segregation of frit at the silicon nitride thick film interface with loose frit residues after lifting off plated grid lines.

Installation Assessment of Frankford Arsenal.

DTIC Science & Technology

1977-10-01

sulfate , sulfuric acid , ac ’solution 40 Hot water bath 41 Nickel plate Nickel sulfate and chloride sulfuric acid , acid ...solution 42 Chromium Copper plate Copper sulfate and sulfuric acid , acid solution 11-14 TABLE 11-2 (continued) Tank No. Plating Process Use Contents...46 Water rinse Water 47 Water rinse Water 48 Water rinse Water 49 Acid Chromic acid , acetic acid , nickel sulfate and sulfuric

Degradation of graphene coated copper in simulated proton exchange membrane fuel cell environment: Electrochemical impedance spectroscopy study

NASA Astrophysics Data System (ADS)

Ren, Y. J.; Anisur, M. R.; Qiu, W.; He, J. J.; Al-Saadi, S.; Singh Raman, R. K.

2017-09-01

Metallic materials are most suitable for bipolar plates of proton exchange membrane fuel cell (PEMFC) because they possess the required mechanical strength, durability, gas impermeability, acceptable cost and are suitable for mass production. However, metallic bipolar plates are prone to corrosion or they can passivate under PEMFC environment and interrupt the fuel cell operation. Therefore, it is highly attractive to develop corrosion resistance coating that is also highly conductive. Graphene fits these criteria. Graphene coating is developed on copper by chemical vapor deposition (CVD) with an aim to improving corrosion resistance of copper under PEMFC condition. The Raman Spectroscopy shows the graphene coating to be multilayered. The electrochemical degradation of graphene coated copper is investigated by electrochemical impedance spectroscopy (EIS) in 0.5 M H2SO4 solution at room temperature. After exposure to the electrolyte for up to 720 h, the charge transfer resistance (Rt) of the graphene coated copper is ∼3 times greater than that of the bare copper, indicating graphene coatings could improve the corrosion resistance of copper bipolar plates.

Microstructure Evolution During Stainless Steel-Copper Vacuum Brazing with a Ag/Cu/Pd Filler Alloy: Effect of Nickel Plating

NASA Astrophysics Data System (ADS)

Choudhary, R. K.; Laik, A.; Mishra, P.

2017-03-01

Vacuum brazing of stainless steel and copper plates was done using a silver-based filler alloy. In one set of experiments, around 30-µm-thick nickel coatings were electrochemically applied on stainless steel plates before carrying out the brazing runs and its effect in making changes in the braze-zone microstructure was studied. For brazing temperature of 830 °C, scanning electron microscopy examination of the braze-zone revealed that relatively sound joints were obtained when brazing was done with nickel-coated stainless steel than with uncoated one. However, when brazing of nickel-coated stainless steel and copper plates was done at 860 °C, a wide crack appeared in the braze-zone adjacent to copper side. Energy-dispersive x-ray analysis and electron microprobe analysis confirmed that at higher temperature, the diffusion of Cu atoms from copper plate towards the braze-zone was faster than that of Ni atoms from nickel coating. Helium leak rate of the order 10-11 Pa m3/s was obtained for the crack-free joint, whereas this value was higher than 10-4 Pa m3/s for the joint having crack. The shear strength of the joint was found to decrease considerably due to the presence of crack.

Electroless silver plating of the surface of organic semiconductors.

PubMed

Campione, Marcello; Parravicini, Matteo; Moret, Massimo; Papagni, Antonio; Schröter, Bernd; Fritz, Torsten

2011-10-04

The integration of nanoscale processes and devices demands fabrication routes involving rapid, cost-effective steps, preferably carried out under ambient conditions. The realization of the metal/organic semiconductor interface is one of the most demanding steps of device fabrication, since it requires mechanical and/or thermal treatments which increment costs and are often harmful in respect to the active layer. Here, we provide a microscopic analysis of a room temperature, electroless process aimed at the deposition of a nanostructured metallic silver layer with controlled coverage atop the surface of single crystals and thin films of organic semiconductors. This process relies on the reaction of aqueous AgF solutions with the nonwettable crystalline surface of donor-type organic semiconductors. It is observed that the formation of a uniform layer of silver nanoparticles can be accomplished within 20 min contact time. The electrical characterization of two-terminal devices performed before and after the aforementioned treatment shows that the metal deposition process is associated with a redox reaction causing the p-doping of the semiconductor. © 2011 American Chemical Society

A base-metal conductor system for silicon solar cells

NASA Technical Reports Server (NTRS)

Coleman, M. G.; Pryor, R. A.; Sparks, T. G.

1980-01-01

Solder, copper, and silver are evaluated as conductor layer metals for silicon solar cell metallization on the basis of metal price stability and reliability under operating conditions. Due to its properties and cost, copper becomes an attractive candidate for the conductor layer. It is shown that nickel operates as an excellent diffusion barrier between copper and silicon while simultaneously serving as an electrical contact and mechanical contact to silicon. The nickel-copper system may be applied to the silicon by plating techniques utilizing a variety of plating bath compositions. Solar cells having excellent current-voltage characteristics are fabricated to demonstrate the nickel-copper metallization system.

Sulfidation treatment of copper-containing plating sludge towards copper resource recovery.

PubMed

Kuchar, D; Fukuta, T; Onyango, M S; Matsuda, H

2006-11-02

The present study is concerned with the sulfidation treatment of copper-containing plating sludge towards copper resource recovery by flotation of copper sulfide from treated sludge. The sulfidation treatment was carried out by contacting simulated or real copper plating sludge with Na(2)S solution for a period of 5 min to 24 h. The initial molar ratio of S(2-) to Cu(2+) (S(2-) to Me(2+) in the case of real sludge) was adjusted to 1.00, 1.25 or 1.50, while the solid to liquid ratio was set at 1:50. As a result, it was found that copper compounds were converted to various copper sulfides within the first 5 min. In the case of simulated copper sludge, CuS was identified as the main sulfidation product at the molar ratio of S(2-) to Cu(2+) of 1.00, while Cu(7)S(4) (Roxbyite) was mainly found at the molar ratios of S(2-) to Cu(2+) of 1.50 and 1.25. Based on the measurements of oxidation-reduction potential, the formation of either CuS or Cu(7)S(4) at different S(2-) to Cu(2+) molar ratios was attributed to the changes in the oxidation-reduction potential. By contrast, in the case of sulfidation treatment of real copper sludge, CuS was predominantly formed, irrespective of S(2-) to Me(2+) molar ratio.

Forming electrical interconnections through semiconductor wafers

NASA Technical Reports Server (NTRS)

Anthony, T. R.

1981-01-01

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

Phase 2 of the Array Automated Assembly Task for the Low Cost Solar Array Project

NASA Technical Reports Server (NTRS)

Campbell, R. B.; Rai-Choundhury, P.; Seman, E. J.; Rohatgi, A.; Davis, J. R.; Ostroski, J. W.; Stapleton, R. E.

1979-01-01

Two process specifications supplied by contractors were tested. The aluminum silk screening process resulted in cells comparable to those from sputtered Al. The electroless plating of contacts specification could be used only with extensive modification. Several experiments suggest that there is some degradation of the front junction during the Al back surface field (BSF) fabrication. A revised process sequence was defined which incorporates Al BSF formation. A cost analysis of this process yielded a selling price of $0.75/watt peak in 1980.

Development of technique for AR coating and nickel and copper metallization of solar cells: FPS project, product development

NASA Technical Reports Server (NTRS)

Rominger, C. G.

1981-01-01

Silicon nitride and nickel pastes are investigated in conjunction with a brush copper plating process for the purpose of identifying one or more fabrication sequences which yield at least 10 percent efficient N(+)/P(+) flat plate solar cells. The adhesion of all nickel pastes is reduced significantly when subjected to acidic and alkaline brush copper plating solutions as a result of a combination of thermally induced stress and chemical attack of the frit, which occurs at the interface with the silicon solar cell. The AgF is penetrating the 800 a of Si3N4 and ohmic contact is occurring at all fire-in tempertures. During the brush plating process, fingers and buss bars tend to spread.

Electrical Characterization of Spherical Copper Oxide Memristive Array Sensors

DTIC Science & Technology

2014-03-27

Quartz Tube Furnace . . . . . . . 37 3.3.2.2 Thermal Oxidation in Air on a Hot Plate . . . . . . . . . 38 3.4 Experimental Setup for Electrical...closed hot plate . . . 80 B.1 Oxidation rates for copper at 100 °C by two different formulas . . . . . . . . . 81 xi List of Tables Table Page 2.1 The... Tectonics Inc. and manufactured by Canfield Technologies using a proprietary fabrication method. As received, the copper spheres may have contaminants

High adherence copper plating process

DOEpatents

Nignardot, Henry

1993-01-01

A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.

Rapid determination of trace copper in animal feed based on micro-plate colorimetric reaction and statistical partitioning correction.

PubMed

Niu, Yiming; Wang, Jiayi; Zhang, Chi; Chen, Yiqiang

2017-04-15

The objective of this study was to develop a micro-plate based colorimetric assay for rapid and high-throughput detection of copper in animal feed. Copper ion in animal feed was extracted by trichloroacetic acid solution and reduced to cuprous ion by hydroxylamine. The cuprous ion can chelate with 2,2'-bicinchoninic acid to form a Cu-BCA complex which was detected with high sensitivity by micro-plate reader at 354nm. The whole assay procedure can be completed within 20min. To eliminate matrix interference, a statistical partitioning correction approach was proposed, which makes the detection of copper in complex samples possible. The limit of detection was 0.035μg/mL and the detection range was 0.1-10μg/mL of copper in buffer solution. Actual sample analysis indicated that this colorimetric assay produced results consistent with atomic absorption spectrometry analysis. These results demonstrated that the developed assay can be used for rapid determination of copper in animal feed. Copyright © 2016 Elsevier Ltd. All rights reserved.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, R. E.

1987-10-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. IC provides results on ions not expected in the production solutions. Thus, solution contamination and breakdown products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet blasting to roughen up the surface, 20 mu in. of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 in. of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for total fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Ion chromatography in the manufacture of multilayer circuit boards

NASA Astrophysics Data System (ADS)

Smith, Robert E.

1990-01-01

Ion chromatography (IC) has proven useful in analyzing chemical solutions used in the manufacture of multilayer circuit boards. Unlike other chemical quantification techniques, IC provides results on ions not expected in the production solutions. Thus, solution contamination and break-down products can be monitored in every phase of the circuit board manufacturing. During the first phase, epoxy laminates experience an etchback, first in chromic acid, which can be analyzed for trace chloride and sulfate, then in ammonium bifluoride/HCl, which can be analyzed for fluoride and chloride. Following a wet-blasting to roughen up the surface, 20 microinches of copper are deposited using an electroless bath. Again, IC is applicable for monitoring formate, tartarate, and sulfate levels. Next, an acid copper bath is used to electroplate the through holes with 0.001 inches of ductile copper. This bath is analyzed for trace chloride. Photoimaging is then performed, and the organic solvents used can be assayed for trace ionic chloride. Finally, a fluoroboric acid-based tin-lead bath is used to deposit a solderable alloy. This bath is analyzed for fluoroborate, tin, and lead. In addition, mobile phase ion chromatography (MPIC) is used to monitor the nonionic organic brighteners in the baths.

Reducing chromium losses from a chromium plating bath. 1987 summer intern report. Project conducted at New Dimension Plating, Hutchinson, Minnesota

DOE Office of Scientific and Technical Information (OSTI.GOV)

Achman, D.

1987-12-31

The company employs about forty people and operates for one or two eight hour shifts with an average of 315 racks of chrome plating per eight hour day. They plate a variety of metals including copper, nickel, gold, brass and chromium. Chromium is the major metal plated and is usually the last step in plating cycle. Most parts are copper plated and then nickel plated in preparation for chrome plating. The main difference between New Dimension Plating and other plating shops is the variety of parts plated. As New Dimension Plating is a job shop, a wide range of partsmore » such as motorcycle accessories, stove parts, and custom items are metal finished. The plating lines are manual, meaning employees dip the racks into the tanks by hand. This fact along with the fact that parts vary greatly in size and shape accounts for the significant drag-out on the chromium plating line.« less

Memristive Responses of Jammed Granular Copper Array Sensors to Mechanical Stress

DTIC Science & Technology

2014-03-27

called Industrial Tectonics Inc. (itiball.com) with the statement of 99.95% minimum copper; stating the residual is most likely silver [12]. Their...atmosphere hot plate and quartz tube furnace with controlled atmosphere were used to oxidize the spheres at various temperatures, the hot plate ...combination spheres, as was seen by Branly. Using a nitric acid etch and 15 minute (min.) hot plate oxidized sphere array consisting of four spheres

Nanoporous gold membranes: From morphological control to fuel cell catalysis

NASA Astrophysics Data System (ADS)

Ding, Yi

Porous noble metals are particularly attractive for scientific research and industrial applications such as catalysis, sensing, and filtration. In this thesis, I will discuss the fabrication, characterization, and application of a new class of porous metals, called nanoporous metals (NPM). NPM is made during selective dissolution (also called dealloying) of reactive components (e.g., silver) from multi-component alloys (e.g., Ag/Au alloy). Commercially available white gold leaf (Ag65Au35) can, for example, be etched into nanoporous gold (NPG) membrane by simply floating the leaf on concentrated nitric acid for periods of a few minutes. NPG leaf adopts a single crystal porous structure within individual grains. The microstructure of NPG, such as the pore size, is tunable between a few nanometers to sub-micron length scale by either thermal annealing or post-treatment in nitric acid for extended period of time. A new gas-liquid-solid interface electroless plating technique is developed to uniformly cover the NPG surface with other metals, such as silver and platinum. This technique allows new opportunities of making functionalized nanostructures. We show that a combination of silver plating and dealloying can be used to make multimodal porous metals, which are expected to have application in sensing field. Electroless platinum plating onto NPG shows very usual growth mode. TEM observation indicates that the platinum layer on NPG surface takes a novel form of layer-islanding growth (Stranski-Krastanov growth). Annealing the Pt/NPG composite smoothens the Pt islands and forms a 1 nm coherent Pt layer on the NPG backbone, possibly with dislocation formation at the Pt/Au interface. Furthermore, it was found that we could dissolve the gold away in aqueous gold etchant, leaving behind the 1 nm-thick Pt shell, a structure we call nanotubular mesoporous platinum (NMP). Pt plated NPG has a series of unique structural properties, such as high active surface area, thermally stable, low Pt usage, and better tolerance to CO poisoning. We incorporated it as a membrane electrode into a working proton exchange membrane fuel cells (PEMFC). Preliminary results show that Pt/NPG has very good fuel cell performance at a very low platinum loading.

Active heat exchange system development for latent heat thermal energy storage

NASA Technical Reports Server (NTRS)

Lefrois, R. T.

1980-01-01

Alternative mechanizations of active heat exchange concepts were analyzed for use with heat of fusion Phase Change Materials (PCM's) in the temperature range of 250 C to 350 C for solar and conventional power plant applications. Over 24 heat exchange concepts were reviewed, and eight were selected for detailed assessment. Two candidates were chosen for small-scale experimentation: a coated tube and shell that exchanger, and a direct contact reflux boiler. A dilute eutectic mixture of sodium nitrate and sodium hydroxide was selected as the PCM from over fifty inorganic salt mixtures investigated. Preliminary experiments with various tube coatings indicated that a nickel or chrome plating of Teflon or Ryton coating had promise of being successful. An electroless nickel plating was selected for further testing. A series of tests with nickel-plated heat transfer tubes showed that the solidifying sodium nitrate adhered to the tubes and the experiment failed to meet the required discharge heat transfer rate of 10 kW(t). Testing of the reflux boiler is under way.

Active heat exchange system development for latent heat thermal energy storage

NASA Astrophysics Data System (ADS)

Lefrois, R. T.

1980-03-01

Alternative mechanizations of active heat exchange concepts were analyzed for use with heat of fusion Phase Change Materials (PCM's) in the temperature range of 250 C to 350 C for solar and conventional power plant applications. Over 24 heat exchange concepts were reviewed, and eight were selected for detailed assessment. Two candidates were chosen for small-scale experimentation: a coated tube and shell that exchanger, and a direct contact reflux boiler. A dilute eutectic mixture of sodium nitrate and sodium hydroxide was selected as the PCM from over fifty inorganic salt mixtures investigated. Preliminary experiments with various tube coatings indicated that a nickel or chrome plating of Teflon or Ryton coating had promise of being successful. An electroless nickel plating was selected for further testing. A series of tests with nickel-plated heat transfer tubes showed that the solidifying sodium nitrate adhered to the tubes and the experiment failed to meet the required discharge heat transfer rate of 10 kW(t). Testing of the reflux boiler is under way.

Rhombic Coulomb diamonds in a single-electron transistor based on an Au nanoparticle chemically anchored at both ends.

PubMed

Azuma, Yasuo; Onuma, Yuto; Sakamoto, Masanori; Teranishi, Toshiharu; Majima, Yutaka

2016-02-28

Rhombic Coulomb diamonds are clearly observed in a chemically anchored Au nanoparticle single-electron transistor. The stability diagrams show stable Coulomb blockade phenomena and agree with the theoretical curve calculated using the orthodox model. The resistances and capacitances of the double-barrier tunneling junctions between the source electrode and the Au core (R1 and C1, respectively), and those between the Au core and the drain electrode (R2 and C2, respectively), are evaluated as 4.5 MΩ, 1.4 aF, 4.8 MΩ, and 1.3 aF, respectively. This is determined by fitting the theoretical curve against the experimental Coulomb staircases. Two-methylene-group short octanedithiols (C8S2) in a C8S2/hexanethiol (C6S) mixed self-assembled monolayer is concluded to chemically anchor the core of the Au nanoparticle at both ends between the electroless-Au-plated nanogap electrodes even when the Au nanoparticle is protected by decanethiol (C10S). This is because the R1 value is identical to that of R2 and corresponds to the tunneling resistances of the octanedithiol chemically bonded with the Au core and the Au electrodes. The dependence of the Coulomb diamond shapes on the tunneling resistance ratio (R1/R2) is also discussed, especially in the case of the rhombic Coulomb diamonds. Rhombic Coulomb diamonds result from chemical anchoring of the core of the Au nanoparticle at both ends between the electroless-Au-plated nanogap electrodes.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

NASA Astrophysics Data System (ADS)

Stein, Matthew; Bauer, Dan; Bunker, Ray; Calkins, Rob; Cooley, Jodi; Loer, Ben; Scorza, Silvia

2018-02-01

Polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m3 at SNOLAB. A time-dependent model of alpha activity is discussed for these materials placed in similar environmental conditions.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stein, Matthew; Bauer, Dan; Bunker, Ray

2018-02-01

Polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at SMU. From these measurements, we determine an averagemore » $$^{210}$$Pb plate-out rate of 249 and 423~atoms/day/cm$$^{2}$$ for polyethylene and copper, respectively, when exposed to radon activity of 135 Bq/m$$^{3}$$ at SNOLAB. A time-dependent model of alpha activity is discussed for these materials placed in similar environmental conditions.« less

Closed loop oscillating heat pipe as heating device for copper plate

NASA Astrophysics Data System (ADS)

Kamonpet, Patrapon; Sangpen, Waranphop

2017-04-01

In manufacturing parts by molding method, temperature uniformity of the mold holds a very crucial aspect for the quality of the parts. Studies have been carried out in searching for effective method in controlling the mold temperature. Using of heat pipe is one of the many effective ways to control the temperature of the molding area to the right uniform level. Recently, there has been the development of oscillating heat pipe and its application is very promising. The semi-empirical correlation for closed-loop oscillating heat pipe (CLOHP) with the STD of ±30% was used in design of CLOHP in this study. By placing CLOHP in the copper plate at some distance from the plate surface and allow CLOHP to heat the plate up to the set surface temperature, the temperature of the plate was recorded. It is found that CLOHP can be effectively used as a heat source to transfer heat to copper plate with excellent temperature distribution. The STDs of heat rate of all experiments are well in the range of ±30% of the correlation used.

High adherence copper plating process

DOEpatents

Nignardot, H.

1993-09-21

A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.

MISSE 6, 7 and 8 Materials Sample Experiments from the International Space Station Materials and Processes Team

NASA Technical Reports Server (NTRS)

Kravchenko, Michael; ORourke, Mary Jane; Golden, Johnny; Finckenor, Miria; Leatherwood, Michael; Alred, John

2010-01-01

The International Space Station Materials and Processes (ISS M&P) team has multiple material samples on MISSE 6, 7 and 8 to observe Low Earth Orbit (LEO) environmental effects on Space Station materials. Optical properties, thickness/mass loss, surface elemental analysis, visual and microscopic analysis for surface change are some of the techniques employed in this investigation. The ISS M&P team has participated in previous MISSE activities in order to better characterize the LEO effects on Space Station materials. This investigation will further this effort. Results for the following MISSE 6 samples materials will be presented: a comparison of anodize and chemical conversion coatings on various aluminum alloys, electroless nickel; AZ93 white ceramic thermal control coating with and without Teflon; Hyzod(TM) polycarbonate used to temporarily protect ISS windows; Russian quartz window material; reformulated Teflon (TM) coated Beta Cloth (Teflon TM without perfluorooctanoic acid (PFOA)) and a Dutch version of beta cloth. Discussion for current and future MISSE materials experiments will be presented. MISSE 7 samples are: deionized water sealed anodized aluminum Photofoil(TM); indium tin oxide (ITO)- coated Kapton(TM) used as thermo-optical surfaces; mechanically scribed tin-plated beryllium-copper samples for "tin pest" growth ( alpha/Beta transformation); Crew Exploration Vehicle (CEV) parachute soft goods. MISSE 8 sample: exposed "scrim cloth" (fiberglass weave) from the ISS solar array wing material, Davlyn fiberglass sleeve material, Permacel and Intertape protective tapes, and ITO-coated Kapton.

Infiltration processing of metal matrix composites using coated ceramic particulates

NASA Astrophysics Data System (ADS)

Leon-Patino, Carlos Alberto

2001-07-01

A new process was developed to fabricate particulate metal matrix composites (MMCs). The process involves three steps: (1) modifying the particulate surface by metal coating, (2) forming a particulate porous compact; and (3) introducing metal into the channel network by vacuum infiltration. MMCs with different reinforcements, volume fractions, and sizes can be produced by this technique. Powders of alumina and silicon carbide were successfully coated with nickel and copper in preparation for infiltration with molten aluminum. Electroless Ni and Cu deposition was used since it enhances the wettability of the reinforcements for composite fabrication. While Cu deposits were polycrystalline, traces of phosphorous co-deposited from the electroless bath gave an amorphous Ni-P coating. The effect of metal coating on wetting behavior was evaluated at 800°C on plain and metal-coated ceramic plates using a sessile drop technique. The metallic films eliminated the non-wetting behavior of the uncoated ceramics, leading to equilibrium contact angles in the order of 12° and below 58° for Ni and Cu coated ceramics, respectively. The spreading data indicated that local diffusion at the triple junction was the governing mechanism of the wetting process. Precipitation of intermetallic phases in the drop/ceramic interface delayed the formation of Al4C3. Infiltration with molten Al showed that the coated-particulates are suitable as reinforcing materials for fabricating MMCs, giving porosity-free components with a homogeneously distributed reinforcing phase. The coating promoted easy metal flow through the preform, compared to the non-infiltration behavior of the uncoated counterparts. Liquid state diffusion kinetics due to temperature dependent viscosity forces controlled the infiltration process. Microstructural analysis indicated the formation of intermetallic phases such as CuAl 2, in the case of Cu coating, and Ni2Al3 and NiAl 3 when Ni-coated powders were infiltrated. The overall Ni and Cu content increased from bottom to top of the samples due to dissolution of the metal film by the stream of liquid Al during infiltration. The strengths of the Al/Ni-SiC composites, measured by four-point bending, were 205 and 225 MPa for samples reinforced with 78 mum and 49 mum Ni-SiC, respectively. The mode of fracture was mainly controlled by SiC particle fracture.

High-strength braze joints between copper and steel

NASA Technical Reports Server (NTRS)

Kuhn, R. F.

1967-01-01

High-strength braze joints between copper and steel are produced by plating the faying surface of the copper with a layer of gold. This reduces porosity in the braze area and strengthens the resultant joint.

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stein, Matthew; Bauer, Dan; Bunker, Ray

We report that polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm 2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m 3 at SNOLAB. Finally, a time-dependent model of alpha activity is discussed for these materials placedmore » in similar environmental conditions.« less

Radon daughter plate-out measurements at SNOLAB for polyethylene and copper

DOE PAGES

Stein, Matthew; Bauer, Dan; Bunker, Ray; ...

2017-11-04

We report that polyethylene and copper samples were exposed to the underground air at SNOLAB for approximately three months while several environmental factors were monitored. Predictions of the radon-daughter plate-out rate are compared to the resulting surface activities, obtained from high-sensitivity measurements of alpha emissivity using the XIA UltraLo-1800 spectrometer at Southern Methodist University. From these measurements, we determine an average 210Pb plate-out rate of 249 and 423 atoms/day/cm 2 for polyethylene and copper, respectively, when exposed to radon activity concentration of 135 Bq/m 3 at SNOLAB. Finally, a time-dependent model of alpha activity is discussed for these materials placedmore » in similar environmental conditions.« less

Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading

NASA Astrophysics Data System (ADS)

Pearl, Adam; Osterman, Michael; Pecht, Michael

2016-01-01

The effect of printed circuit board surface finish on the drop loading reliability of ball grid array (BGA) solder interconnects has been examined. The finishes examined include electroless nickel/electroless palladium/immersion gold (ENEPIG) and immersion silver (ImAg). For the ENEPIG finish, the effect of the Pd plating layer thickness was evaluated by testing two different thicknesses: 0.05 μm and 0.15 μm. BGA components were assembled onto the boards using either eutectic Sn-Pb or Sn-3.0Ag-0.5Cu (SAC305) solder. Prior to testing, the assembled boards were aged at 100°C for 24 h or 500 h. The boards were then subjected to multiple 1500-g drop tests. Failure analysis indicated the primary failure site for the BGAs to be the solder balls at the board-side solder interface. Cratering of the board laminate under the solder-attached pads was also observed. In all cases, isothermal aging reduced the number of drops to failure. The components soldered onto the boards with the 0.15- μm-Pd ENEPIG finish with the SAC305 solder had the highest characteristic life, at 234 drops to failure, compared with the other finish-solder combinations.

In-situ deposition of Pd nanoparticles on tubular halloysite template for initiation of metallization.

PubMed

Fu, Yubin; Zhang, Lide; Zheng, Jiyong

2005-04-01

Halloysite template has a tubular microstructure; its wall has a multi-layer aluminosilicate structure. A new catalytic method is adopted here, through the in-situ reduction of Pd ions on the surface of tubular halloysite by methanol to initiate electroless plating; the detailed deposition features of Pd nanoparticles are investigated for the first time. The results indicate that an in-situ reduction and deposition of Pd occurs at room temperature, in which the halloysite template plays an important role. Impurities in halloysite (such as ferric oxide) influence the formation and distribution of the Pd nanoparticles. The Pd nanoparticles are of a non-spherical shape in most cases, which would be caused by the irregular appearance of halloysite. No intercalation of the nanoparticles occurs between the aluminosilicate layers in the halloysite. The diameter of Pd nanoparticles increases with time; the average diameter ranges from 1 nm to 4 nm. Pd nanoparticles on a halloysite template can catalyze electroless deposition of Ni to prepare a novel nano-sized cermet at low cost. This practicable catalytic method could also be used on other clay substrates for the initiation of metallization.

Application of electroless deposition for surface modification of the multiwall carbon nanotubes

NASA Astrophysics Data System (ADS)

Kurkowska, M.; Awietjan, S.; Kozera, R.; Jezierska, E.; Boczkowska, A.

2018-06-01

The paper describes modification of carbon nanotubes surface by attaching the grains of Ni-P, Ni-B, Co-B and Fe-B. The modification was obtained by electroless metallization using sodium hypophosphite (NaH2PO2). We have investigated the parameters of electroless metallization process of CNTs. The uniformity of the coating on the carbon nanotubes was related to proper surface activation. While optimizing the electroless deposition, a range of catalyst concentrations from 0.1 to 1.0 gPd/l were tested. Deposition was used to improve the electrical properties of the later composite materials CNT-Ni-P/epoxy. The best results of electroless deposition were obtained for Ni-P and Ni-B coatings.

An experimental attenuation plate to improve the dose distribution in intraoperative electron beam radiotherapy for breast cancer.

PubMed

Oshima, T; Aoyama, Y; Shimozato, T; Sawaki, M; Imai, T; Ito, Y; Obata, Y; Tabushi, K

2009-06-07

Intraoperative electron beam radiotherapy (IOERT) is a technique in which a single-fraction high dose is intraoperatively delivered to subclinical tumour cells using an electron beam after breast-conserving surgery. In IOERT, an attenuation plate consisting of a pair of metal disks is commonly used to protect the normal tissues posterior to the breast. However, the dose in front of the plate is affected by backscatter, resulting in an unpredictable delivered dose to the tumour cells. In this study, an experimental attenuation plate, termed a shielding plate, was designed using Monte Carlo simulation, which significantly diminished the electron beam without introducing any backscatter radiation. The plate's performance was verified by measurements. It was made of two layers, a first layer (source side) of polymethyl methacrylate (PMMA) and a second layer of copper, which was selected from among other metals (aluminium, copper and lead) after testing for shielding capability and the range and magnitude of backscatter. The optimal thicknesses of the PMMA (0.71 cm) and copper (0.3 cm) layers were determined by changing their thicknesses during simulations. On the basis of these results, a shielding plate was prototyped and depth doses with and without the plate were measured by radiophotoluminescence glass dosimeters using a conventional stationary linear accelerator and a mobile linear accelerator dedicated for IOERT. The trial shielding plate functioned as intended, indicating its applicability in clinical practice.

Feasibility Study on a Process for Electroless Metal Deposition in Pits and Fissures of Teeth for Use in Preventive Dentistry.

DTIC Science & Technology

1980-08-01

been used in topical fluoride solutions applied to prevent caries . The use of SnF 2 . and similar chemical compounds, in the plating process appears to...Methods Tin fluoride solutions are prepared by dissolving SnF 2 in demineralized water at concentrations of 1, 5, 5.7, and 10%. The pH ranges from...saturated FeSO4 with or without 1 gpl thiourea a. .4 34 REFERENCES 1. P. Gron, "Chemistry of Topical Fluorides ", Caries Res. 11 (Suppl. 1): 172-204

Preliminary Comparison of Properties between Ni-electroplated Stainless Steel Parts Fabricated with Laser Additive Manufacturing and Conventional Machining

NASA Astrophysics Data System (ADS)

Mäkinen, Mika; Jauhiainen, Eeva; Matilainen, Ville-Pekka; Riihimäki, Jaakko; Ritvanen, Jussi; Piili, Heidi; Salminen, Antti

Laser additive manufacturing (LAM) is a fabrication technology, which enables production of complex parts from metallic materials with mechanical properties comparable to those of conventionally machined parts. These LAM parts are manufactured via melting metallic powder layer by layer with laser beam. Aim of this study is to define preliminarily the possibilities of using electroplating to supreme surface properties. Electrodeposited nickel and chromium as well as electroless (autocatalytic) deposited nickel was used to enhance laser additive manufactured and machined parts properties, like corrosion resistance, friction and wearing. All test pieces in this study were manufactured with a modified research AM equipment, equal to commercial EOS M series. The laser system used for tests was IPG 200 W CW fiber laser. The material used in this study for additive manufacturing was commercial stainless steel powder grade named SS316L. This SS316L is not equal to AISI 316L grade, but commercial name of this kind of powder is widely known in additive manufacturing as SS316L. Material used for fabrication of comparison test pieces (i.e. conventionally manufactured) was AISI 316L stainless steel bar. Electroplating was done in matrix cell and electroless was done in plastic sink properties of plated parts were tested within acetic acid salt spray corrosion chamber (AASS, SFS-EN-ISO 9227 standard). Adhesion of coating, friction and wearing properties were tested with Pin-On-Rod machine. Results show that in these preliminary tests, LAM parts and machined parts have certain differences due to manufacturing route and surface conditions. These have an effect on electroplated and electroless parts features on adhesion, corrosion, wearing and friction. However, further and more detailed studies are needed to fully understand these phenomena.

Copper-mercury film electrode for cathodic stripping voltammetric determination of Se(IV).

PubMed

Sladkov, Vladimir; David, François; Fourest, Blandine

2003-01-01

The copper-mercury film electrode has been suggested for the determination of Se(IV) in a wide range of concentration from 1x10(-9) to 1x10(-6) mol L(-1)by square-wave cathodic stripping voltammetry. Insufficient reproducibility and sensitivity of the mercury film electrode have been overcome by using copper(II) ions during the plating procedure. Copper(II) has been found to be reduced and form a reproducible copper-mercury film on a glassy carbon electrode surface. The plating potential and time, the concentration of copper(II) and the concentration of the supporting electrolyte have been optimised. Microscopy has been used for a study of the morphology of the copper-mercury film. It has been found that it is the same as for the mercury one. The preconcentration step consists in electrodeposition of copper selenide on the copper-mercury film. The relative standard deviation is 4.3% for 1x10(-6) mol L(-1) of Se(IV). The limit of detection is 8x10(-10) mol L(-1) for 5 min of accumulation.

Quenching characteristics of bathocuproinedisulfonic acid, disodium salt in aqueous solution and copper sulfate plating solution

NASA Astrophysics Data System (ADS)

Koga, Toshiaki; Hirakawa, Chieko; Takeshita, Michinori; Terasaki, Nao

2018-04-01

Bathocuproinedisulfonic acid, disodium salt (BCS) is generally used to detect Cu(I) through a color reaction. We newly found BCS fluorescence in the visible blue region in an aqueous solution. However, the fluorescence mechanism of BCS is not well known, so we should investigate its fundamental information. We confirmed that the characteristics of fluorescence are highly dependent on the molecular concentration and solvent properties. In particular, owing to the presence of the copper compound, the fluorescence intensity extremely decreases. By fluorescence quenching, we observed that a copper compound concentration of 10-6 mol/L or less could easily be measured in an aqueous solution. We also observed BCS fluorescence in copper sulfate plating solution and the possibility of detecting monovalent copper by fluorescence reabsorption.

Steel test panel helps control additives in pyrophosphate copper plating

NASA Technical Reports Server (NTRS)

Hollar, W. T.

1967-01-01

Test panel helps control maximum tolerance level for plating solution contaminants. It provides low, medium, and high-current density areas such as exist in production plating, and plating is examined for uniformity of texture and ductility.

Comparison of Spall Pullback Signals and X-ray Tomography Analysis in Copper

NASA Astrophysics Data System (ADS)

Gard, Marcie; Russell, Rod; Hanna, Romy; Bless, Stephan; InstituteAdvanced Technology Collaboration; Department of Geological Sciences-UT Austin Collaboration

2011-06-01

Spall experiments were conducted on electrolytic tough pitch C110 copper plates. Flyer plates half the target-plate thickness were launched with a single-stage compressed-gas gun. Pullback signals were measured with a photonic Doppler velocimeter (PDV). Spall stresses were determined and found to be about 1 GPa. In addition, damage on the spall plane for samples that failed to separate a spall plate was characterized by x-ray tomography. The paper will include a description of threshold damage. The threshold for appearance of a pullback signal corresponded to the initiation of tensile damage, not formation of a spall separation plane.

A Kinetic Study of the Reaction of Ch3 02 with N02. Volume I,

DTIC Science & Technology

1980-01-01

Ravishankara F.L. Eisele IP.H. Wine ABSTRACT The technique of pulsed laser photolysis-long path laser aborption is employed to study the kinetics of the...Inrad Corp.) which was housed in a gold plated copper block. This copper block was in snug contact with a gold plated pedestal which was backed by a

Rolling contact fatigue behavior of Cu and TiN coatings on bearing steel substrates

NASA Technical Reports Server (NTRS)

Hochman, R. F.; Erdemir, A.; Dolan, F. J.; Thom, R. L.

1985-01-01

The resistance of copper and TiN coatings on various bearing substrates to high-load rolling contact fatigue (RCF) is investigated. Special attention is given to the lubricating characteristics of copper deposited by ion plating, and the wear resistant characteristics of TiN deposited by ion plating and magnetron sputtering techniques. RCF samples of 440C and AMS 5749 bearing steels were coated. Sputter deposited and ion plated films were on the RCF samples in a range of thickness from about 2000 A to 2 microns. Results showed a marked improvement of the RCF for pure copper tested on 440C, but a degradation for copper on AMS 5749. It is also found that the 2000 A TiN films behave favorably on the 440C and AMS 5749 bearing steels at RCF stress levels of 786 ksi. Scanning electron microscopy, X-ray diffraction, and electron spectroscopy for chemical analysis were used during the investigation.

Development of micromachined preconcentrators and gas chromatographic separation columns by an electroless gold plating technology

NASA Astrophysics Data System (ADS)

Kuo, C.-Y.; Chen, P.-S.; Chen, H.-T.; Lu, C.-J.; Tian, W.-C.

2017-03-01

In this study, a simple process for fabricating a novel micromachined preconcentrator (μPCT) and a gas chromatographic separation column (μSC) for use in a micro gas chromatograph (μGC) using one photomask is described. By electroless gold plating, a high-surface-area gold layer was deposited on the surface of channels inside the μPCT and μSC. For this process, (3-aminopropyl) trimethoxysilane (APTMS) was used as a promoter for attaching gold nanoparticles on a silicon substrate to create a seed layer. For this purpose, a gold sodium sulfite solution was used as reagent for depositing gold to form heating structures. The microchannels of the μPCT and μSC were coated with the adsorbent and stationary phase, Tenax-TA and polydimethylsiloxane (DB-1), respectively. μPCTs were heated at temperatures greater than 280 °C under an applied electrical power of 24 W and a heating rate of 75 °C s-1. Repeatable thermal heating responses for μPCTs were achieved; good linearity (R 2  >  0.9997) was attained at three heating rates for the temperature programme for the μSC (0.2, 0.5 and 1 °C s-1). The volatile organic compounds (VOCs) toluene and m-xylene were concentrated over the μPCT by rapid thermal desorption (peak width of half height (PWHH)  <1.5 s) preconcentration factors for both VOCs are  >7900. The VOCs acetone, benzene, toluene, m-xylene and 1,3,5-trimethylbenzene were also separated on the μSC as evidenced by their different retention times (47-184 s).

Investigate zero-stress replicated optics

NASA Technical Reports Server (NTRS)

Engelhaupt, Darell; Rood, Robert

1993-01-01

The contracted activities for the procurement of 'Investigate Zero-Stress Replicated Optics' to support the AXAF-S x-ray spectrometer mirrors has been completed. To date four large Wolter I grazing incidence x-ray optical shells have been electroformed from nickel. The mirrors were fabricated utilizing each of two nickel alloy plated aluminum substrates twice. A wide variety of testing has been completed by NASA MSFC and UAH. This testing includes heat treatment control tests, subscale plating and fixture testing, alloy control of the electroless nickel, adhesion and release testing of the gold to electroless nickel, electroforming instrumentation and software and fabrication of subscale models. The full scale shells are one millimeter thick nickel electrodeposited over a thin gold layer which in turn has the optical surface on the inside. The optical surface is the replicate of the surface prepared on the substrate. Appendix I briefly outlines the fabrication process. Major objectives which were shared by UAH and MSFC include the design of facilities, equipment and tooling and procurement of materials and equipment. Process development followed with the fabrication of small scale pilot units. Procurement commenced immediately and equipment and materials were ordered to implement the fabrication of first surface full scale substrates (mandrels) and the second surface electroformed optical components. All principal objectives have been achieved. Inspection of the mirrors in visible and x-ray modes validates that the required performance and the quality can be achieved by an electroforming replication process. A very distinct progressive improvement has been achieved with each of the four mirrors produced. The final mirror exceeded the original goals and set an improved standard for flight hardware. The future goal of a 30 arc second resolution at 8 KEV x-ray appears to be achievable by this process when proper cleanliness and process control is utilized.

46 CFR 114.600 - Incorporation by reference.

Code of Federal Regulations, 2012 CFR

2012-10-01

... Storage Tank Water Heaters 119.320 UL 486A-1992—Wire Connectors and Soldering Lugs For Use With Copper...-93, Standard Specification for Copper-Silicon Alloy Plate, Sheet, Strip, and Rolled Bar for General...) Apparatus 114.400 ASTM B 122/B 122M-95, Standard Specification for Copper-Nickel-Tin Alloy , Copper-Nickel...

DETAILED INVESTIGATION OF THE REJUVENATION OF A SPENT ELECTROLESS NICKEL SOLUTION BY ELECTRODIALYSIS WITH A VIEW TO OPTIMIZING ELECTRODIALYSIS PERFORMANCE

EPA Science Inventory

The rejuvenation of spent electroless nickel baths by electrodialysis has received a considerable amount of attention over the past decade and the technique is being increasingly employed to extend electroless nickel bath life. However, thus far there has not been a detailed inve...

Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates

NASA Astrophysics Data System (ADS)

Xiang, Jing; Wang, Chong; Chen, Yuanming; Wang, Shouxu; Hong, Yan; Zhang, Huaiwu; Gong, Lijun; He, Wei

2017-07-01

The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2sbnd CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of Csbnd O, Osbnd Cdbnd O, Cdbnd O and sbnd NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.

Positive electrode current collector for liquid metal cells

DOEpatents

Shimotake, Hiroshi; Bartholme, Louis G.

1984-01-01

A current collector for the positive electrode of an electrochemical cell with a positive electrode including a sulfide. The cell also has a negative electrode and a molten salt electrolyte including halides of a metal selected from the alkali metals and the alkaline earth metals in contact with both the positive and negative electrodes. The current collector has a base metal of copper, silver, gold, aluminum or alloys thereof with a coating thereon of iron, nickel, chromium or alloys thereof. The current collector when subjected to cell voltage forms a sulfur-containing compound on the surface thereby substantially protecting the current collector from further attack by sulfur ions during cell operation. Both electroless and electrolytic processes may be used to deposit coatings.

Interferometric phase measurement of zerodur, aluminum and SXA mirrors at cryogenic temperatures

NASA Technical Reports Server (NTRS)

Magner, Thomas J.; Barney, Richard D.

1988-01-01

A research program was undertaken to determine the surface figure error of several different types of mirrors at cryogenic temperatures. Two-inch diameter parabolic, spherical and flat mirrors were fabricated from zerodur, aluminum and a metal matrix composite of silicon carbide reinforced aluminum (SXA). The ratio of silicon carbide to aluminum was selected so that the coefficient of thermal expansion (CTE) of the metal matrix matched electroless nickel. A liquuid helium dewar was modified to add an interferometric grade window, a cold electronic shutter and a strain-free copper mirror mount. Interferometric phase measurements on each mirror mounted in the dewar were made without the window, with the window, under vacuum, at around 80K and between 10K and 24K.

Tectonic environments of South American porphyry copper magmatism through time revealed by spatiotemporal data mining

NASA Astrophysics Data System (ADS)

Butterworth, N.; Steinberg, D.; Müller, R. D.; Williams, S.; Merdith, A. S.; Hardy, S.

2016-12-01

Porphyry ore deposits are known to be associated with arc magmatism on the overriding plate at subduction zones. While general mechanisms for driving magmatism are well established, specific subduction-related parameters linking episodes of ore deposit formation to specific tectonic environments have only been qualitatively inferred and have not been formally tested. We develop a four-dimensional approach to reconstruct age-dated ore deposits, with the aim of isolating the tectonomagmatic parameters leading to the formation of copper deposits during subduction. We use a plate tectonic model with continuously closing plate boundaries, combined with reconstructions of the spatiotemporal distribution of the ocean floor, including subducted portions of the Nazca/Farallon plates. The models compute convergence rates and directions, as well as the age of the downgoing plate through time. To identify and quantify tectonic parameters that are robust predictors of Andean porphyry copper magmatism and ore deposit formation, we test two alternative supervised machine learning methods; the "random forest" (RF) ensemble and "support vector machines" (SVM). We find that a combination of rapid convergence rates ( 100 km/Myr), subduction obliquity of 15°, a subducting plate age between 25-70 Myr old, and a location far from the subducting trench boundary (>2000 km) represents favorable conditions for porphyry magmatism and related ore deposits to occur. These parameters are linked to the availability of oceanic sediments, the changing small-scale convection around the subduction zone, and the availability of the partial melt in the mantle wedge. When coupled, these parameters could influence the genesis and exhumation of porphyry copper deposits.

Novel fabrication method of microchannel plates

NASA Astrophysics Data System (ADS)

Yi, Whikun; Jeong, Taewon; Jin, Sunghwan; Yu, SeGi; Lee, Jeonghee; Kim, J. M.

2000-11-01

We have developed a novel microchannel plate (MCP) by introducing new materials and process technologies. The key features of our MCP are summarized as follows: (i) bulk alumina as a substrate, (ii) the channel location defined by a programmed-hole puncher, (iii) thin film deposition by electroless plating and/or sol-gel process, and (iv) an easy fabrication process suitable for mass production and a large-sized MCP. The characteristics of the resulting MCP have been evaluated with a high input current source such as a continuous electron beam from an electron gun and Spindt-type field emitters to obtain information on electron multiplication. In the case of a 0.28 μA incident beam, the output current enhances ˜170 times, which is equal to 1% of the total bias current of the MCP at a given bias voltage of 2600 V. When we insert a MCP between the cathode and the anode of a field emission display panel, the brightness of luminescent light increases 3-4 times by multiplying the emitted electrons through pore arrays of a MCP.

46 CFR 105.20-3 - Cargo tanks.

Code of Federal Regulations, 2010 CFR

2010-10-01

...) Construction and Materials. (1) The cargo tanks must be constructed of iron, steel, copper, nickel alloy, copper alloy; or aluminum. The tanks shall be designed to withstand the maximum head to which they may be... inches and gage number 2,3 Nickel copper B127, hot rolled sheet or plate 0.107 (USSG 12). Copper nickel 1...

The effects of deposition parameters on surface morphology and crystallographic orientation of electroless Ni-B coatings

NASA Astrophysics Data System (ADS)

Bulbul, Ferhat

2011-02-01

Electroless Ni-B coatings were deposited on AISI 304 stainless steels by electroless deposition method, which was performed for nine different test conditions at various levels of temperature, concentration of NaBH4, concentration of NiCl2, and time, using the Taguchi L9(34) experimental method. The effects of deposition parameters on the crystallographic orientation of electroless Ni-B coatings were investigated using SEM and XRD equipment. SEM analysis revealed that the Ni-B coatings developed six types (pea-like, maize-like, primary nodular, blackberry-like or grapes-like, broccoli-like, and cauliflower-like) of morphological structures depending on the deposition parameters. XRD results also showed that these structures exhibited different levels of amorphous character. The concentration of NaBH4 had the most dominant effect on the morphological and crystallographic development of electroless Ni-B coatings.

Crystal growth patterns in DC and pulsed plated galvanic copper films on (1 1 1), (1 0 0) and (1 1 0) copper surfaces

NASA Astrophysics Data System (ADS)

Brown, Delilah A.; Morgan, Sean; Peldzinski, Vera; Brüning, Ralf

2017-11-01

Copper films for printed circuit board applications have to be fine-grained to achieve even filling of vias. Electroplated Cu films on roll annealed Cu substrates may have unacceptably large epitaxial crystals. Here galvanic films were plated on oriented single-crystal Cu substrates from an additive-free electrolyte, as well as DC plating and pulse reverse (PR) plating with additives. The distribution of crystallite orientations was mapped with XRD and compared with the microstructure determined by SEM. For the additive-free bath on [1 1 1] and [1 0 0] oriented surfaces a gradual transition from epitaxial to polycrystalline is seen, while films on [1 1 0] substrates are persistently epitaxial. Without bath additives, twinning is the main mechanism for the transition to polycrystalline texture. For DC plating, additives (carriers, accelerators and levelers) promote fine-grained films with isotropic grain orientations, with films on [1 1 0] substrates being partially isotropic. Plating with carriers and accelerators (no leveler) yields films with many distinct crystallite orientations. These orientations result from up to five steps of recursive twinning. PR plating produces isotropic films with no or very few twins (〈1 1 1〉 and 〈1 0 0〉 substrates, respectively), while on 〈1 1 0〉 oriented surfaces the deposits are about 20% epitaxial.

Electroless-plating technique for fabricating thin-wall convective heat-transfer models

NASA Technical Reports Server (NTRS)

Avery, D. E.; Ballard, G. K.; Wilson, M. L.

1984-01-01

A technique for fabricating uniform thin-wall metallic heat-transfer models and which simulates a Shuttle thermal protection system tile is described. Two 6- by 6- by 2.5-in. tiles were fabricated to obtain local heat transfer rates. The fabrication process is not limited to any particular geometry and results in a seamless thin-wall heat-transfer model which uses a one-wire thermocouple to obtain local cold-wall heat-transfer rates. The tile is relatively fragile because of the brittle nature of the material and the structural weakness of the flat-sided configuration; however, a method was developed and used for repairing a cracked tile.

Electrodeposition of High Quality Nickel Phosphorous Alloys for Pollution Reduction and Energy Conservation

NASA Technical Reports Server (NTRS)

Engelhaupt, Darell; Ramsey, Brian

2003-01-01

NASA and the University of Alabama in Huntsville have developed ecologically friendly, versatile nickel and nickel cobalt phosphorous electroplating processes. Solutions show excellent performance with high efficiency for vastly extended throughput. Properties include, clean, low temperature operation (40 - 60 C), high Faradaic efficiency, low stress and high hardness. A variety of alloy and plating speed options are easily achieved from the same chemistry using soluble anodes for metal replacement with only 25% of the phosphorous additions required for electroless nickel. Thick deposits are easily achieved unattended, for electroforming freestanding shapes without buildup of excess orthophosphate or stripping of equipment.

Electrodeposition of High Quality Nickel Phosphorous Alloys for Pollution Reduction and Energy Conservation

NASA Technical Reports Server (NTRS)

Engelhaupt, Darell; Ramsey, Brian

2004-01-01

NASA and the University of Alabama in Huntsville have developed ecologically friendly, versatile nickel and nickel cobalt phosphorous electroplating processes. Solutions show excellent performance with high efficiency for vastly extended throughput. Properties include, clean, low temperature operation (40 - 60 C), high Faradaic efficiency, low stress and high hardness. A variety of alloy and plating speed options are easily achieved from the same chemistry using soluble anodes for metal replacement with only 25% of the phosphorous additions required for electroless nickel. Thick deposits are easily achieved unattended, for electroforming freestanding shapes without buildup of excess orthophosphate or stripping of equipment.

Methods of Making Z-Shielding

NASA Technical Reports Server (NTRS)

Thomsen, III, Donald Laurence (Inventor); Cano, Roberto J. (Inventor); Jensen, Brian J. (Inventor); Hales, Stephen J. (Inventor); Alexa, Joel A. (Inventor)

2014-01-01

Methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the methods include improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade from the enclosure.

Silicon solar cells with nickel/solder metallization

NASA Technical Reports Server (NTRS)

Petersen, R. C.; Muleo, A.

1981-01-01

The use of nickel plus solder is shown to be feasible for contact metallization for silicon solar cells by offering a relatively inexpensive method of making electrical contact with the cell surfaces. Nickel is plated on silicon solar cells using an electroless chemical deposition method to give contacts with good adhesion, and in some cases where adhesion is poor initially, sintering under relatively mild conditions will dramatically improve the quality of the bond without harming the p-n junction of the cell. The cells can survive terrestrial environment stresses, which is demonstrated by a 1000 hour test at 85 C and 85% relative humidity under constant forward bias of 0.45 volt.

Fabrication of a nanosize-Pt-embedded membrane electrode assembly to enhance the utilization of Pt in proton exchange membrane fuel cells.

PubMed

Choe, Junseok; Kim, Doyoung; Shim, Jinyong; Lee, Inhae; Tak, Yongsug

2011-08-01

A procedure to locate the Pt nanostructure inside the hydrophilic channel of a Nafion membrane was developed in order to enhance Pt utilization in PEMFCs. Nanosize Pt-embedded MEA was constructed by Cu electroless plating and subsequent Pt electrodeposition inside the hydrophilic channels of the Nafion membrane. The metallic Pt nanostructure fabricated inside the membrane was employed as an oxygen reduction catalyst for a PEMFC and facilitated effective use of the hydrophilic channels inside the membrane. Compared to the conventional MEA, a Pt-embedded MEA with only 68% Pt loading showed better PEMFC performance.

Dynamic Shock Compression of Copper to Multi-Megabar Pressure

NASA Astrophysics Data System (ADS)

Haill, T. A.; Furnish, M. D.; Twyeffort, L. L.; Arrington, C. L.; Lemke, R. W.; Knudson, M. D.; Davis, J.-P.

2015-11-01

Copper is an important material for a variety of shock and high energy density applications and experiments. Copper is used as a standard reference material to determine the EOS properties of other materials. The high conductivity of copper makes it useful as an MHD driver layer in high current dynamic materials experiments on Sandia National Laboratories Z machine. Composite aluminum/copper flyer plates increase the dwell time in plate impact experiments by taking advantage of the slower wave speeds in copper. This presentation reports on recent efforts to reinstate a composite Al/Cu flyer capability on Z and to extend the range of equation-of-state shock compression data through the use of hyper-velocity composite flyers and symmetric planar impact with copper targets. We will present results from multi-dimensional ALEGRA MHD simulations, as well as experimental designs and methods of composite flyer fabrication. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Company, for the U.S. DOE's National Nuclear Security Administration under contract DE-AC04-94AL85000.

Use of Electrodeposition for Sample Preparation and Rejection Rate Prediction for Assay of Electroformed Ultra High Purity Copper for 232Th and 238U Prior to Inductively Coupled Plasma Mass Spectrometry (ICP/MS)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hoppe, Eric W.; Aalseth, Craig E.; Brodzinski, Ronald L.

The search for neutrinoless double beta decay in 76Ge has driven the need for ultra-low background Ge detectors shielded by electroformed copper of ultra-high radiopurity (<0.1µBq/kg). Although electrodeposition processes are almost sophisticated enough to produce copper of this purity, to date there are no methods sensitive enough to assay it. Inductively-coupled plasma mass spectrometry (ICP/MS) can detect thorium and uranium at femtogram levels, but in the past, this assay has been hindered by high copper concentrations in the sample. Electrodeposition of copper samples removes copper from the solution while selectively concentrating thorium and uranium contaminants to be assayed by ICP/MS.more » Spiking 232Th and 238U into the plating bath simulates low purity copper and allows for the calculation of the electrochemical rejection rate of thorium and uranium in the electroplating system. This rejection value will help to model plating bath chemistry.« less

Thermal performance evaluation of the Semco (liquid) solar collector

NASA Technical Reports Server (NTRS)

1979-01-01

Procedures used and results obtained during the evaluation test program on a flat plate collector which uses water as the working fluid are discussed. The absorber plate is copper tube soldered to copper fin coated with flat black paint. The glazing consists of two plates of Lo-Iron glass; the insulation is polyurethane foam. The collector weight is 242.5 pounds with overall external dimensions of approximately 48.8 in. x 120.8 in. x 4.1 in. The test program was conducted to obtain thermal performance data before and after 34 days of weather exposure test.

Salt Spray Test to Determine Galvanic Corrosion Levels of Electroless Nickel Connectors Mounted on an Aluminum Bracket

NASA Technical Reports Server (NTRS)

Rolin, T. D.; Hodge, R. E.; Torres, P. D.; Jones, D. D.; Laird, K. R.

2014-01-01

During preliminary vehicle design reviews, requests were made to change flight termination systems from an electroless nickel (EN) connector coating to a zinc-nickel (ZN) plating. The reason for these changes was due to a new NASA-STD-6012 corrosion requirement where connectors must meet the performance requirement of 168 hr of exposure to salt spray. The specification for class F connectors, MIL-DTL-38999, certifies the EN coating will meet a 48-hr salt spray test, whereas the ZN is certified to meet a 168-hr salt spray test. The ZN finish is a concern because Marshall Space Flight Center has no flight experience with ZN-finished connectors, and MSFC-STD-3012 indicates that zinc and zinc alloys should not be used. The purpose of this test was to run a 168-hr salt spray test to verify the electrical and mechanical integrity of the EN connectors and officially document the results. The salt spray test was conducted per ASTM B117 on several MIL-DTL-38999 flight-like connectors mounted to an aluminum 6061-T6 bracket that was alodined. The configuration, mounting techniques, electrical checks, and materials used were typical of flight and ground support equipment.

Electroless controllable growth of ZnO films and their morphology-dependent antimicrobial properties.

PubMed

Ruíz-Gómez, M A; Figueroa-Torres, M Z; Alonso-Lemus, I L; Vega-Becerra, O E; González-López, J R; Zaldívar-Cadena, A A

2018-04-05

An electroless deposition process was used to synthesize with a controlled morphology, polycrystalline ZnO on glass substrates as antimicrobial coatings. The influence of deposition temperature (T dep ) on the physicochemical and antimicrobial properties of the ZnO films was analyzed. The results indicated that a change in deposition temperature greatly affected the morphology and the degree of crystallinity of the films. Scanning electron microscope images show that the film surface is porous at a deposition temperature of 40 and 50 °C, whereas hexagonal-plate shaped morphology predominated at 60 °C and finally at 70 and 80 °C the films consisted of rod-like particles. The films showed good transparency in the visible region. All ZnO films presented notable antimicrobial activity against the gram-negative bacteria Escherichia coli (E. coli) and the gram-positive Staphylococcus aureus (S. aureus). It was found that the antimicrobial efficiency is strongly dependent on morphology and structural properties. The best antimicrobial performance was recorded for the films consisting of rod-like morphology with a high degree of crystallinity. The procedure used in this investigation is strongly recommended for the development of functional surfaces. Copyright © 2017 Elsevier B.V. All rights reserved.

Double coating protection of Nd-Fe-B magnets: Intergranular phosphating treatment and copper plating

NASA Astrophysics Data System (ADS)

Zheng, Jingwu; Chen, Haibo; Qiao, Liang; Lin, Min; Jiang, Liqiang; Che, Shenglei; Hu, Yangwu

2014-12-01

In this work, a double coating protection technique of phosphating treatment and copper plating was made to improve the corrosion resistance of sintered Nd-Fe-B magnets. In other words, the intergranular region of sintered Nd-Fe-B is allowed to generate passive phosphate conversion coating through phosphating treatment, followed by the copper coating on the surface of sintered Nd-Fe-B. The morphology and corrosion resistance of the phosphated sintered Nd-Fe-B were observed using SEM and electrochemical method respectively. The phosphate conversion coating was formed more preferably on the intergranular region of sintered Nd-Fe-B than on the main crystal region; just after a short time of phosphating treatment, the intergranular region of sintered Nd-Fe-B has been covered by the phosphate conversion coating and the corrosion resistance is significantly improved. With the synergistic protection of the intergranular phosphorization and the followed copper electrodeposition, the corrosion resistance of the sintered Nd-Fe-B is significantly better than that with a single phosphate film or single plating protection.

Textured carbon surfaces on copper by sputtering

NASA Technical Reports Server (NTRS)

Curren, A. N. (Inventor); Jensen, K. A. (Inventor); Roman, R. F. (Inventor)

1986-01-01

A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target and a copper substrate are simultaneously exposed to an argon plasma in a vacuum chamber. The resulting carbon surface is characterized by a dense, random array of needle like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.

Quick-Change Anode for Plating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1987-01-01

Proposed fastener for attaching electroplating anode improves quality of plating and increases productivity. Notches in twist-lock fastener mates with projections on end of anode bar. Fastener made of titanium for compatibility with copper-plating solution. Also constructed in snap-on, snap-off configuration.

Perforated plates for cryogenic regenerators and method of fabrication

DOEpatents

Hendricks, J.B.

1994-03-29

Perforated plates having very small holes with a uniform diameter throughout the plate thickness are prepared by a [open quotes]wire drawing[close quotes] process in which a billet of sacrificial metal is disposed in an extrusion can of the plate metal, and the can is extruded and restacked repeatedly, converting the billet to a wire of the desired hole diameter. At final size, the rod is then sliced into wafers, and the wires are removed by selective etching. This process is useful for plate metals of interest for high performance regenerator applications, in particular, copper, niobium, molybdenum, erbium, and other rare earth metals. Er[sub 3]Ni, which has uniquely favorable thermophysical properties for such applications, may be incorporated in regions of the plates by providing extrusion cans containing erbium and nickel metals in a stacked array with extrusion cans of the plate metal, which may be copper. The array is heated to convert the erbium and nickel metals to Er[sub 3]Ni. Perforated plates having two sizes of perforations, one of which is small enough for storage of helium, are also disclosed. 10 figures.

Perforated plates for cryogenic regenerators and method of fabrication

DOEpatents

Hendricks, John B.

1994-01-01

Perforated plates (10) having very small holes (14) with a uniform diameter throughout the plate thickness are prepared by a "wire drawing" process in which a billet of sacrificial metal is disposed in an extrusion can of the plate metal, and the can is extruded and restacked repeatedly, converting the billet to a wire of the desired hole diameter. At final size, the rod is then sliced into wafers, and the wires are removed by selective etching. This process is useful for plate metals of interest for high performance regenerator applications, in particular, copper, niobium, molybdenum, erbium, and other rare earth metals. Er.sub.3 Ni, which has uniquely favorable thermophysical properties for such applications, may be incorporated in regions of the plates by providing extrusion cans (20) containing erbium and nickel metals in a stacked array (53) with extrusion cans of the plate metal, which may be copper. The array is heated to convert the erbium and nickel metals to Er.sub.3 Ni. Perforated plates having two sizes of perforations (38, 42), one of which is small enough for storage of helium, are also disclosed.

Electroplating and stripping copper on molybdenum and niobium

NASA Technical Reports Server (NTRS)

Power, J. L.

1978-01-01

Molybdenum and niobium are often electroplated and subsequently stripped of copper. Since general standard plating techniques produce poor quality coatings, general procedures have been optimized and specified to give good results.

Absolute measurement of the Hugoniot and sound velocity of liquid copper at multimegabar pressures

DOE PAGES

McCoy, Chad August; Knudson, Marcus David; Root, Seth

2017-11-13

Measurement of the Hugoniot and sound velocity provides information on the bulk modulus and Grüneisen parameter of a material at extreme conditions. The capability to launch multilayered (copper/aluminum) flyer plates at velocities in excess of 20 km/s with the Sandia Z accelerator has enabled high-precision sound-velocity measurements at previously inaccessible pressures. For these experiments, the sound velocity of the copper flyer must be accurately known in the multi-Mbar regime. Here we describe the development of copper as an absolutely calibrated sound-velocity standard for high-precision measurements at pressures in excess of 400 GPa. Using multilayered flyer plates, we performed absolute measurementsmore » of the Hugoniot and sound velocity of copper for pressures from 500 to 1200 GPa. These measurements enabled the determination of the Grüneisen parameter for dense liquid copper, clearly showing a density dependence above the melt transition. As a result, combined with earlier data at lower pressures, these results constrain the sound velocity as a function of pressure, enabling the use of copper as a Hugoniot and sound-velocity standard for pressures up to 1200 GPa.« less

Absolute measurement of the Hugoniot and sound velocity of liquid copper at multimegabar pressures

DOE Office of Scientific and Technical Information (OSTI.GOV)

McCoy, Chad August; Knudson, Marcus David; Root, Seth

Measurement of the Hugoniot and sound velocity provides information on the bulk modulus and Grüneisen parameter of a material at extreme conditions. The capability to launch multilayered (copper/aluminum) flyer plates at velocities in excess of 20 km/s with the Sandia Z accelerator has enabled high-precision sound-velocity measurements at previously inaccessible pressures. For these experiments, the sound velocity of the copper flyer must be accurately known in the multi-Mbar regime. Here we describe the development of copper as an absolutely calibrated sound-velocity standard for high-precision measurements at pressures in excess of 400 GPa. Using multilayered flyer plates, we performed absolute measurementsmore » of the Hugoniot and sound velocity of copper for pressures from 500 to 1200 GPa. These measurements enabled the determination of the Grüneisen parameter for dense liquid copper, clearly showing a density dependence above the melt transition. As a result, combined with earlier data at lower pressures, these results constrain the sound velocity as a function of pressure, enabling the use of copper as a Hugoniot and sound-velocity standard for pressures up to 1200 GPa.« less

Micro-Welding of Copper Plate by Frequency Doubled Diode Pumped Pulsed Nd:YAG Laser

NASA Astrophysics Data System (ADS)

Nakashiba, Shin-Ichi; Okamoto, Yasuhiro; Sakagawa, Tomokazu; Takai, Sunao; Okada, Akira

A pulsed laser of 532 nm wavelength with ms range pulse duration was newly developed by second harmonic generation of diode pumped pulsed Nd:YAG laser. High electro-optical conversion efficiency more than 13% could be achieved, and 1.5 kW peak power green laser pulse was put in optical fiber of 100 μm in diameter. In micro- welding of 1.0 mm thickness copper plate, a keyhole welding was successfully performed by 1.0 kW peak power at spot diameter less than 200 μm. The frequency doubled pulsed laser improved the processing efficiency of copper welding, and narrow and deep weld bead was stably obtained.

Multiple-layer printed-wiring trace connector

NASA Technical Reports Server (NTRS)

Pizzeck, D. E.

1977-01-01

Nickel-plated spring-steel foil connector is hollow pin, with lengthwise slit, that is inserted into improperly plated-through holes. Edges of connector make positive contact with copper pads within hole.

Method of making sulfur-resistant composite metal membranes

DOEpatents

Way, J Douglas [Boulder, CO; Lusk, Mark [Golden, CO; Thoen, Paul [Littleton, CO

2012-01-24

The invention provides thin, hydrogen-permeable, sulfur-resistant membranes formed from palladium or palladium-alloy coatings on porous, ceramic or metal supports. Also disclosed are methods of making these membranes via sequential electroless plating techniques, wherein the method of making the membrane includes decomposing any organic ligands present on the substrate, reducing the palladium crystallites on the substrate to reduced palladium crystallites, depositing a film of palladium metal on the substrate and then depositing a second, gold film on the palladium film. These two metal films are then annealed at a temperature between about 200.degree. C. and about 1200.degree. C. to form a sulfur-resistant, composite PdAu alloy membrane.

Analysis and evaluation in the production process and equipment area of the low-cost solar array project

NASA Technical Reports Server (NTRS)

Wolf, M.; Goldman, H.

1981-01-01

The attributes of the various metallization processes were investigated. It is shown that several metallization process sequences will lead to adequate metallization for large area, high performance solar cells at a metallization add on price in the range of $6. to 12. m squared, or 4 to $.8/W(peak), assuming 15% efficiency. Conduction layer formation by thick film silver or by tin or tin/lead solder leads to metallization add-on prices significantly above the $6. to 12/m squared range c.) The wet chemical processes of electroless and electrolytic plating for strike/barrier layer and conduction layer formation, respectively, seem to be most cost effective.

Differential bacteriophage mortality on exposure to copper.

PubMed

Li, Jinyu; Dennehy, John J

2011-10-01

Many studies report that copper can be used to control microbial growth, including that of viruses. We determined the rates of copper-mediated inactivation for a wide range of bacteriophages. We used two methods to test the effect of copper on bacteriophage survival. One method involved placing small volumes of bacteriophage lysate on copper and stainless steel coupons. Following exposure, metal coupons were rinsed with lysogeny broth, and the resulting fluid was serially diluted and plated on agar with the corresponding bacterial host. The second method involved adding copper sulfate (CuSO(4)) to bacteriophage lysates to a final concentration of 5 mM. Aliquots were removed from the mixture, serially diluted, and plated with the appropriate bacterial host. Significant mortality was observed among the double-stranded RNA (dsRNA) bacteriophages Φ6 and Φ8, the single-stranded RNA (ssRNA) bacteriophage PP7, the ssDNA bacteriophage ΦX174, and the dsDNA bacteriophage PM2. However, the dsDNA bacteriophages PRD1, T4, and λ were relatively unaffected by copper. Interestingly, lipid-containing bacteriophages were most susceptible to copper toxicity. In addition, in the first experimental method, the pattern of bacteriophage Φ6 survival over time showed a plateau in mortality after lysates dried out. This finding suggests that copper's effect on bacteriophage is mediated by the presence of water.

Critical Evaluation of State-of-the-Art In Situ Thermal Treatment Technologies for DNAPL Source Zone Treatment. State-of-the-Practice Overview

DTIC Science & Technology

2009-05-01

recovery in their design. Electrodes have been constructed from steel pipe , copper plate for heating distinct zones, and sheet pile. Sheet pile...energy transfer/ heating in the subsurface) The components required to implement ERH include: • Electrodes (steel pipe , copper plate, well points...including piping , blower, and condenser • A vapor treatment system Electrical Resistance Heating (Smith) A-3 • An ERH power control unit to

Magnetic precipitate separation for Ni plating waste liquid using HTS bulk magnets

NASA Astrophysics Data System (ADS)

Oka, T.; Kimura, T.; Mimura, D.; Fukazawa, H.; Fukui, S.; Ogawa, J.; Sato, T.; Ooizumi, M.; Yokoyama, K.; Tsujimura, M.; Terasawa, T.

2013-01-01

The magnetic separation experiment for recycling the nickel-bearing precipitates in the waste liquid from the electroless plating processes has been practically conducted under the high gradient magnetic separation technique with use of the face-to-face HTS bulk magnet system. A couple of facing magnetic poles containing Sm123 bulk superconductors were activated through the pulsed field magnetization process to 1.86 T at 38 K and 2.00 T at 37 K, respectively. The weakly magnetized metallic precipitates of Ni crystals and Ni-P compounds deposited from the waste solution after heating it and pH controlling. The high gradient magnetic separation technique was employed with the separation channels filled with the stainless steel balls with dimension of 1 and 3 mm in diameter, which periodically moved between and out of the facing magnetic poles. The Ni-bearing precipitates were effectively attracted to the magnetized ferromagnetic balls. We have succeeded in obtaining the separation ratios over 90% under the flow rates less than 1.35 L/min.

A study on EMI shielding enhancement behaviors of Ni-plated CFs-reinforced polymer matrix composites by post heat treatment

NASA Astrophysics Data System (ADS)

Kim, Kwan-Woo; Han, Woong; Kim, Byoung-Suhk; Kim, Byung-Joo; An, Kay-Hyeok

2017-09-01

In order to develop the high quality electromagnetic interference shielding efficiency (EMI-SE) materials, Ni-plated carbon fiber fabrics (Ni-CFFs) were prepared by an electroless method. Effects of post heat-treatment conditions on EMI-SE and electrical conductivity of Ni-CFFs/epoxy composites were also investigated. The morphologies and structural properties of Ni-CFFs were measured by a SEM and a XRD. It was found that all the Ni peaks increased with increasing post-heat treatment temperature, indicating that some impurities were removed and nickel particle sharp crystalline peaks. Also, It was found that the EMI-SE of composites enhanced was increased after post heat-treatment. In the frequency range of electromagnetic wave occurred from appliances (3.0 × 107-6.0 × 108), EMI-SE of post-heat treatment Ni-CFs was increased. This result concludes that the EMI-SE of the composites can be enhanced according to the microstructure of Ni in the Ni-CFFs/epoxy composites.

Braze alloy process and strength characterization studies for 18 nickel grade 200 maraging steel with application to wind tunnel models

NASA Technical Reports Server (NTRS)

Bradshaw, James F.; Sandefur, Paul G., Jr.; Young, Clarence P., Jr.

1991-01-01

A comprehensive study of braze alloy selection process and strength characterization with application to wind tunnel models is presented. The applications for this study include the installation of stainless steel pressure tubing in model airfoil sections make of 18 Ni 200 grade maraging steel and the joining of wing structural components by brazing. Acceptable braze alloys for these applications are identified along with process, thermal braze cycle data, and thermal management procedures. Shear specimens are used to evaluate comparative shear strength properties for the various alloys at both room and cryogenic (-300 F) temperatures and include the effects of electroless nickel plating. Nickel plating was found to significantly enhance both the wetability and strength properties for the various braze alloys studied. The data are provided for use in selecting braze alloys for use with 18 Ni grade 200 steel in the design of wind tunnel models to be tested in an ambient or cryogenic environment.

A novel electroless method to prepare a platinum electrocatalyst on diamond for fuel cell applications

NASA Astrophysics Data System (ADS)

Lyu, Xiao; Hu, Jingping; Foord, John S.; Wang, Qiang

2013-11-01

A novel electroless deposition method was demonstrated to prepare a platinum electrocatalyst on boron doped diamond (BDD) substrates without the need for pre-activation. This green method addresses the uniformity and particle size issues associated with electrodeposition and circumvents the pre-activation procedure which is necessary for conventional electroless deposition. The inert BDD substrate formed a galvanic couple with an iron wire, to overcome the activation barrier associated with conventional electroless deposition on diamond, leading to the formation of Pt nanoparticles on the electrode surface in a galvanic process coupled to a chemical process. When sodium hypophosphite was employed as the reducing agent to drive the electroless reaction Pt deposits which were contaminated with iron and phosphorus resulted. In contrast, the reducing agent ascorbic acid gave rise to high purity Pt nanoparticles. Optimal deposition conditions with respect to bath temperature, pH value and stabilizing additives are identified. Using this approach, high purity and uniformly distributed platinum nanoparticles are obtained on the diamond electrode surface, which demonstrate a high electrochemical activity towards methanol oxidation.

Electrically controllable twisted-coiled artificial muscle actuators using surface-modified polyester fibers

NASA Astrophysics Data System (ADS)

Park, Jungwoo; Yoo, Ji Wang; Seo, Hee Won; Lee, Youngkwan; Suhr, Jonghwan; Moon, Hyungpil; Koo, Ja Choon; Ryeol Choi, Hyouk; Hunt, Robert; Kim, Kwang Jin; Kim, Soo Hyun; Nam, Jae-Do

2017-03-01

As a new class of thermally activated actuators based on polymeric fibers, we investigated polyethylene terephthalate (PET) yarns for the development of a twisted-coiled polymer fiber actuator (TCA). The PET yarn TCA exhibited the maximum linear actuation up to 8.9% by external heating at above the glass transition temperature, 160 °C-180 °C. The payload of the actuator was successfully correlated with the preload and training-load conditions by an empirical equation. Furthermore, the PET-based TCA was electrically driven by Joule heating after the PET surface was metallization with silver. For the fast and precise control of PET yarn TCA, electroless silver plating was conducted to form electrical conductive layers on the PET fiber surface. The silver plated PET-based TCA was tested by Joule heating and the tensile actuation was increased up to 12.1% (6 V) due to the enhanced surface hardness and slippage of PET fibers. Overall, silver plating of the polymeric yarn provided a fast actuation speed and enhanced actuation performance of the TCA actuator by Joule heating, providing a great potential for being used in artificial muscle for biomimetic machines including robots, industrial actuators and powered exoskeletons.

Large-Scale Stretchable Semiembedded Copper Nanowire Transparent Conductive Films by an Electrospinning Template.

PubMed

Yang, Xia; Hu, Xiaotian; Wang, Qingxia; Xiong, Jian; Yang, Hanjun; Meng, Xiangchuan; Tan, Licheng; Chen, Lie; Chen, Yiwang

2017-08-09

With recent emergence of wearable electronic devices, flexible and stretchable transparent electrodes are the core components to realize innovative devices. The copper nanowire (CuNW) network is commonly chosen because of its high conductivity and transparency. However, the junction resistances and low aspect ratios still limit its further stretchable performance. Herein, a large-scale stretchable semiembedded CuNW transparent conductive film (TCF) was fabricated by electrolessly depositing Cu on the electrospun poly(4-vinylpyridine) polymer template semiembedded in polydimethylsiloxane. Compared with traditional CuNWs, which are as-coated on the flexible substrate, the semiembedded CuNW TCFs showed low sheet resistance (15.6 Ω·sq -1 at ∼82% transmittance) as well as outstanding stretchability and mechanical stability. The light-emitting diode connected the stretchable semiembedded CuNW TCFs in the electric circuit still lighted up even after stretching with 25% strain. Moreover, this semiembedded CuNW TCF was successfully applied in polymer solar cells as a stretchable conductive electrode, which yielded a power conversion efficiency of 4.6% with 0.1 cm 2 effective area. The large-scale stretchable CuNW TCFs show potential for the development of wearable electronic devices.

Copper Hugoniot measurements to 2.8 TPa on Z.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Furnish, Michael D.; Haill, Thomas A

We conducted three Hugoniot and release experiments on copper on the Z machine at Hugoniot stress levels of 0.34 and 2.6 TPa, using two-layer copper/aluminum impactors travelling at 8 and 27 km/s and Z-quartz windows. Velocity histories were recorded for 4 samples of different thicknesses and 5 locations on the flyer plate (3 and 4 for the first two experiments). On-sample measurements provided Hugoniot points (via transit time) and partial release states (via Z-quartz wavespeed). Fabrication of the impactor required thick plating and several diamond-machining steps. The lower-pressure test was planned as a 2.5 TPa test, but a failure onmore » the Z machine degraded its performance; however, these results corroborated earlier Cu data in the same stress region. The second test suffered from significant flyer plate bowing, but the third did not. The Hugoniot data are compared with the APtshuler/Nellis nuclear-driven data, other data from Z and elsewhere, and representative Sesame models.« less

Electroless epitaxial etching for semiconductor applications

DOEpatents

McCarthy, Anthony M.

2002-01-01

A method for fabricating thin-film single-crystal silicon on insulator substrates using electroless etching for achieving efficient etch stopping on epitaxial silicon substrates. Microelectric circuits and devices are prepared on epitaxial silicon wafers in a standard fabrication facility. The wafers are bonded to a holding substrate. The silicon bulk is removed using electroless etching leaving the circuit contained within the epitaxial layer remaining on the holding substrate. A photolithographic operation is then performed to define streets and wire bond pad areas for electrical access to the circuit.

Removal of single point diamond-turning marks by abrasive jet polishing.

PubMed

Li, Z Z; Wang, J M; Peng, X Q; Ho, L T; Yin, Z Q; Li, S Y; Cheung, C F

2011-06-01

Single point diamond turning (SPDT) is highly controllable and versatile in producing axially symmetric forms, non-axially-symmetric forms, microstructured surfaces, and free forms. However, the fine SPDT marks left in the surface limit its performance, and they are difficult to reduce or eliminate. It is unpractical for traditional methods to remove the fine marks without destroying their forms, especially for the aspheres and free forms. This paper introduces abrasive jet polishing (AJP) for the posttreatment of diamond-turned surfaces to remove the periodic microstructures. Samples of diamond-turned electroless nickel plated plano mirror were used in the experiments. One sample with an original surface roughness of more than 400 nm decreased to 4 nm after two iterations abrasive jet polishing; the surface roughness of another sample went from 3.7 nm to 1.4 nm after polishing. The periodic signatures on both of the samples were removed entirely after polishing. Contrastive experimental research was carried out on electroless nickel mirror with magnetorheological finishing, computer controlled optical surfacing, and AJP. The experimental results indicate that AJP is more appropriate in removing the periodic SPDT marks. Also, a figure maintaining experiment was carried out with the AJP process; the uniform polishing process shows that the AJP process can remove the periodic turning marks without destroying the original form.

Preparation of ZnO nanorods on conductive PET-ITO-Ag fibers

NASA Astrophysics Data System (ADS)

Li, Yiwen; Ji, Shuai; Chen, Yuanyu; Zhang, Hong; Gong, Yumei; Guo, Jing

2016-12-01

We studied the vertical ZnO nanorods grown on conductive conventional polyethylene terephthalate (PET) fibers which are prepared by electroless silver depositing on tin-doped indium oxide (ITO) coated PET fibers through an efficient and low-cost green approach. The PET fibers were firstly functionalized with a layer of ITO gel synthesized through a sol-gel process at rather low temperature, simply by immersing the fibers into ITO sol for several minutes followed by gelation at 120 °C. Once the ITO gel layer surface was activated by SnCl2, a continuous, uniform, and compact layer of silver was carried out on the surface of the PET-ITO fibers through electroless plating operation at room temperature. The as-prepared PET-ITO-Ag fibers had good electrical conductivity, with surface resistivity as low as 0.23 mΩ cm. The overall procedure is simple, efficient, nontoxic, and controllable. The conductive PET-ITO-Ag fiber was used successfully as a flexible basal material to plant vertical ZnO nanorods through controlling the seeding and growth processes. The morphology of the PET-ITO, PET-ITO-Ag, and PET-ITO-Ag-ZnO fibers were observed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Undergone the whole process, although the tensile strength of the fiber decreased slightly, they may still exert their applications in flexible electronic such as photovoltaic and piezoelectric devices.

Structure and Microhardness of Cu-Ta Joints Produced by Explosive Welding

PubMed Central

Maliutina, Iu. N.; Mali, V. I.; Bataev, I. A.; Bataev, A. A.; Esikov, M. A.; Smirnov, A. I.; Skorokhod, K. A.

2013-01-01

The structure and microhardness of Cu-Ta joints produced by explosive welding were studied. It was found that, during explosive welding, an intermediate layer 20⋯40 μm thick with a finely dispersed heterophase structure, formed between the welded copper and tantalum plates. The structure of the layer was studied by scanning and transmission electron microscopy. Microvolumes with tantalum particles distributed in a copper matrix and microvolumes of copper particles in a tantalum matrix were detected. The tantalum particles in copper have a size of 5⋯500 nm, with a predominance of 5⋯50 nm particles. A mechanism for the formation of the finely dispersed heterophase structure in explosive welding is proposed. The microhardness of interlayers with the heterophase structure reaches 280 HV, which far exceeds the microhardness of copper (~130 HV) and tantalum (~160 HV). Many twins of deformation origin were found in the structure of the copper plate. The effect of heating temperature in the range from 100 to 900°C on the microhardness of copper, tantalum, and the Cu-Ta welded joint was studied. Upon heating to 900°C, the microhardness of the intermediate layer decreases from 280 to 150 HV. The reduction in the strength properties of the weld material is mainly due to structural transformations in copper. PMID:24453818

19. VIEW OF THE PLATING BATHS AND CONTROL PANELS. GOLD ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

19. VIEW OF THE PLATING BATHS AND CONTROL PANELS. GOLD AND SILVER WERE AMONG THE MATERIALS PLATED ONTO PARTS MADE OF COPPER, STAINLESS STEEL AND STEEL. (11/15/89) - Rocky Flats Plant, Non-Nuclear Production Facility, South of Cottonwood Avenue, west of Seventh Avenue & east of Building 460, Golden, Jefferson County, CO

Large-scale fabrication of polymer/Ag core-shell nanorod array as flexible SERS substrate by combining direct nanoimprint and electroless deposition

NASA Astrophysics Data System (ADS)

Liu, Sisi; Xu, Zhimou; Sun, Tangyou; Zhao, Wenning; Wu, Xinghui; Ma, Zhichao; Xu, Haifeng; He, Jian; Chen, Cunhua

2014-06-01

We demonstrate a highly sensitive surface-enhanced Raman scattering (SERS) substrate, which consists of Ag nanoparticles (NPs) assembled on the surface of a nanopatterned polymer film. The fabrication route of a polymer/Ag core-shell nanorod (PACSN) array employed a direct nanoimprint technique to create a high-resolution polymer nanorod array. The obtained nanopatterned polymer film was subjected to electroless deposition to form a sea-cucumber-like Ag shell over the surface of the polymer nanorod. The morphology and structures of PACSNs were analyzed by using scanning electron microscopy and X-ray diffraction. The as-synthesized PACSNs exhibited a remarkable SERS activity and Raman signal reproducibility to rhodamine 6G, and a concentration down to 10-12 M can be identified. The effect of electroless deposition time of Ag NPs onto the polymer nanorod surface was investigated. It was found that the electroless deposition time played an important role in SERS activity. Our results revealed that the combination of direct nanoimprint and electroless deposition provided a convenient and cost-effective way for large-scale fabrication of reliable SERS substrates without the requirement of expensive instruments.

Recycling Of Cis Photovoltaic Waste

DOEpatents

Drinkard, Jr., William F.; Long, Mark O.; Goozner; Robert E.

1998-07-14

A method for extracting and reclaiming metals from scrap CIS photovoltaic cells and associated photovoltaic manufacturing waste by leaching the waste with dilute nitric acid, skimming any plastic material from the top of the leaching solution, separating glass substrate from the leachate, electrolyzing the leachate to plate a copper and selenium metal mixture onto a first cathode, replacing the cathode with a second cathode, re-electrolyzing the leachate to plate cadmium onto the second cathode, separating the copper from selenium, and evaporating the depleted leachate to yield a zinc and indium containing solid.

Remediation System Evaluation, Peerless Plating Site

EPA Pesticide Factsheets

The Peerless Plating Superfund Site is located at 2554 South Getty Street, north of the intersection of South Getty Street and East Sherman Boulevard in Muskegon, Michigan. Copper, nickel, chromium, cadmium, and zinc electroplating operations as well as...

Hermetically sealable package for hybrid solid-state electronic devices and the like

NASA Technical Reports Server (NTRS)

Miller, Wilson N. (Inventor); Gray, Ormal E. (Inventor)

1988-01-01

A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.

Electroless atomic layer deposition

DOEpatents

Robinson, David Bruce; Cappillino, Patrick J.; Sheridan, Leah B.; Stickney, John L.; Benson, David M.

2017-10-31

A method of electroless atomic layer deposition is described. The method electrolessly generates a layer of sacrificial material on a surface of a first material. The method adds doses of a solution of a second material to the substrate. The method performs a galvanic exchange reaction to oxidize away the layer of the sacrificial material and deposit a layer of the second material on the surface of the first material. The method can be repeated for a plurality of iterations in order to deposit a desired thickness of the second material on the surface of the first material.

Microstructure and Mechanical Properties of High Copper HSLA-100 Steel in 2-inch Plate Form

DTIC Science & Technology

1992-06-01

2. HSLA-100 Steel Continuous Cooling Transformation Diagram [Ref. 13:p. 262] One of the most desirable characteristics of the low -carbon, copper ...none V mild v.strong v. strong V. strong moderate The use of copper as an alloying element in low carbon HSLA steel has resulted in the following...HY-130 steel . In research presently being done, it has been determined that the high copper alloy has a highly dislocated martensitic /bainitic

Characteristics of coated copper wire specimens using high frequency ultrasonic complex vibration welding equipments.

PubMed

Tsujino, J; Ihara, S; Harada, Y; Kasahara, K; Sakamaki, N

2004-04-01

Welding characteristic of thin coated copper wires were studied using 40, 60, 100 kHz ultrasonic complex vibration welding equipments with elliptical to circular vibration locus. The complex vibration systems consisted of a longitudinal-torsional vibration converter and a driving longitudinal vibration system. Polyurethane coated copper wires of 0.036 mm outer diameter and copper plates of 0.3 mm thickness and the other dimension wires were used as welding specimens. The copper wire part is completely welded on the copper substrate and the insulated coating material is driven from welded area to outsides of the wire specimens by high frequency complex vibration.

Conductive Au nanowires regulated by silk fibroin nanofibers

NASA Astrophysics Data System (ADS)

Dong, Bo-Ju; Lu, Qiang

2014-03-01

Conductive Au-biopolymer composites have promising applications in tissue engineering such as nerve tissue regeneration. In this study, silk fibroin nanofibers were formed in aqueous solution by regulating silk self-assembly process and then used as template for Au nanowire fabrication. We performed the synthesis of Au seeds by repeating the seeding cycles for several times in order to increase the density of Au seeds on the nanofibers. After electroless plating, densely decorated Au seeds grew into irregularly shaped particles following silk nanofiber to fill the gaps between particles and finally form uniform continuous nanowires. The conductive property of the Au-silk fibroin nanowires was studied with current-voltage ( I-V) measurement. A typical ohmic behavior was observed, which highlighted their potential applications in nerve tissue regeneration.

A Module Experimental Process System Development Unit (MEPSDU)

NASA Technical Reports Server (NTRS)

1981-01-01

The purpose of this program is to demonstrate the technical readiness of a cost effective process sequence that has the potential for the production of flat plate photovoltaic modules which met the price goal in 1986 of $.70 or less per watt peak. Program efforts included: preliminary design review, preliminary cell fabrication using the proposed process sequence, verification of sandblasting back cleanup, study of resist parameters, evaluation of pull strength of the proposed metallization, measurement of contact resistance of Electroless Ni contacts, optimization of process parameter, design of the MEPSDU module, identification and testing of insulator tapes, development of a lamination process sequence, identification, discussions, demonstrations and visits with candidate equipment vendors, evaluation of proposals for tabbing and stringing machine.

Soft actuator based on Kraton with GO/Ag/Pani composite electrodes for robotic applications

NASA Astrophysics Data System (ADS)

Khan, Ajahar; Kant Jain, Ravi; Banerjee, Priyabrata; Inamuddin; Asiri, Abdullah M.

2017-11-01

In this work, electrochemically-driven Kraton/graphene oxide/Ag/polyaniline (Kraton/GO/Ag/Pani) polymer composite based ionic polymer metal composite (IPMC) was fabricated as a soft actuator. Silver nanopowder with polyaniline coating used as an electrode material is a novel approach in the fabrication of IPMC, which gives new opportunities for development of the electrode on ionic polymer actuator surfaces directly without electroless plating of Pt or Au metal. The Kraton/GO/Ag/Pani membrane showed much higher water-uptake (WU), ion exchange capacity (IEC), proton conductivity than those of several reported IPMC membranes. The enhanced actuation performance indicates that the Kraton/GO/Ag/Pani is a better alternative to the highly expensive commercialized IPMC actuator.

Silver and tin plating as medieval techniques of producing counterfeit coins and their identification by means of micro-XRF

NASA Astrophysics Data System (ADS)

Hložek, M.; Trojek, T.

2017-08-01

Archaeological surveys and metal detector prospecting yield a great amount of coins from the medieval period. Naturally, some of these are counterfeit which an experienced numismatist can determine without using chemical methods. The production of counterfeit coins in the middle ages took place in castles, caves or other remote areas where waste from this activity can still be found today - copper sheets, technical ceramics and counterfeit coins. Until recently, it has been assumed that medieval counterfeit coins are made by silver-plating copper blanks using an amalgam. However, the performed analyses reveal that there are many more techniques of counterfeiting of coins. Other techniques were based on e.g. tin amalgam plating of the blanks or alloying so-called white metal with silver-like appearance from which the coins were minted. Current chemical analyses indicate that the coins were often tinned by hot dipping with no amalgamation. Micro-X-ray fluorescence analysis has been chosen as a suitable non-destructive method to identify present chemical elements in investigated artifacts and to quantify their concentrations. In addition, a quick technique telltale the plating was applied. This technique utilizes the detected fluorescence ratio Kα/Kβ of copper, which is the main ingredient of a lot of historical metallic materials.

Development of ceramic-coated weld backing bars

DOE Office of Scientific and Technical Information (OSTI.GOV)

Eggleston, B.R.

1994-10-20

In shipbuilding and many other industries, copper weld backing bars are used to draw the heat out of the weld. The problem that some users of these bars encounter is that these bars, on occasion, actually melt in spots and become welded to the weld plates. After this happens a number of times, the backing bar becomes so degraded that it must be either discarded or machined, both of which are very costly and time-consuming actions. To avoid this fusion between the backing bar and the weld plate, the weld processes that are used cannot be ones of high beatmore » input. This requirement is very limiting when thick plates are being welded. The plates must be beveled, and more weld passes must be run. These problems are also costly and time consuming. The aim of this project is to find a way to produce backing bars with nearly the same `chilling` effect but with both a greater resistance to molten metal and resistance to arcing to the backing bar itself. A possible solution currently being tested is to coat the copper bars with a thin layer of a ceramic coating. The procedure used was to coat the copper bars with either alumina or spinel by a plasma spraying method.« less

Minimizing the bimetallic bending for cryogenic metal optics based on electroless nickel

NASA Astrophysics Data System (ADS)

Kinast, Jan; Hilpert, Enrico; Lange, Nicolas; Gebhardt, Andreas; Rohloff, Ralf-Rainer; Risse, Stefan; Eberhardt, Ramona; Tünnermann, Andreas

2014-07-01

Ultra-precise metal optics are key components of sophisticated scientific instruments in astronomy and space applications. Especially for cryogenic applications, a detailed knowledge and the control of the coefficient of thermal expansion (CTE) of the used materials are essential. Reflective optical components in IR- and NIR-instruments primarily consist of the aluminum alloy Al6061. The achievable micro-roughness of diamond machined and directly polished Al6061 does not fulfill the requirements for applications in the visible spectral range. Electroless nickel enables the reduction of the mirror surface roughness to the sub-nm range by polishing. To minimize the associated disadvantageous bimetallic effect, a novel material combination for cryogenic mirrors based on electroless nickel and hypereutectic aluminum-silicon is investigated. An increasing silicon content of the aluminum material decreases the CTE in the temperature range to be considered. This paper shows the CTE for aluminum materials containing about 42 wt% silicon (AlSi42) and for electroless nickel with a phosphorous content ranging from 10.5 to 13 %. The CTE differ to about 0.5 × 10-6 K-1 in a temperature range from -185 °C (LN2) to 100 °C. Besides, the correlations between the chemical compositions of aluminum-silicon materials and electroless nickel are shown. A metrology setup for cryo-interferometry was developed to analyze the remaining and reversible shape deviation at cryogenic temperatures. Changes could be caused by different CTE, mounting forces and residual stress conditions. In the electroless nickel layer, the resulting shape deviation can be preshaped by deterministic correction processes such as magnetorheological finishing (MRF) at room temperature.

Production of Copper-Plated Beamline Bellows and Spools for LCLS-II

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wilson, Katherine M.; Carpenter, Brian C.; Daly, Ed

The SLAC National Accelerator Laboratory is currently constructing a major upgrade to its accelerator, the Linac Coherent Light Source II (LCLS-II). Several Department of Energy national laboratories, including the Thomas Jefferson National Accelerator Facility (JLab) and Fermi National Accelerator Laboratory (FNAL), are participating in this project. The 1.3-GHz cryomodules for this project consist of eight cavities separated by bellows (expansion joints) and spools (tube sections), which are copper plated for RF conduction. JLab is responsible for procurement of these bellows and spools, which are delivered to JLab and FNAL for assembly into cryomodules. Achieving accelerator-grade copper plating is always amore » challenge and requires careful specification of requirements and application of quality control processes. Due to the demanding technical requirements of this part, JLab implemented procurement strategies to make the process more efficient as well as provide process redundancy. This paper discusses the manufacturing challenges that were encountered and resolved, as well as the strategies that were employed to minimize the impact of any technical issues.« less

Estimates of microbial quality and concentration of copper in distributed drinking water are highly dependent on sampling strategy.

PubMed

Lehtola, Markku J; Miettinen, Ilkka T; Hirvonen, Arja; Vartiainen, Terttu; Martikainen, Pertti J

2007-12-01

The numbers of bacteria generally increase in distributed water. Often household pipelines or water fittings (e.g., taps) represent the most critical location for microbial growth in water distribution systems. According to the European Union drinking water directive, there should not be abnormal changes in the colony counts in water. We used a pilot distribution system to study the effects of water stagnation on drinking water microbial quality, concentration of copper and formation of biofilms with two commonly used pipeline materials in households; copper and plastic (polyethylene). Water stagnation for more than 4h significantly increased both the copper concentration and the number of bacteria in water. Heterotrophic plate counts were six times higher in PE pipes and ten times higher in copper pipes after 16 h of stagnation than after only 40 min stagnation. The increase in the heterotrophic plate counts was linear with time in both copper and plastic pipelines. In the distribution system, bacteria originated mainly from biofilms, because in laboratory tests with water, there was only minor growth of bacteria after 16 h stagnation. Our study indicates that water stagnation in the distribution system clearly affects microbial numbers and the concentration of copper in water, and should be considered when planning the sampling strategy for drinking water quality control in distribution systems.

Glass-bead peen plating

NASA Technical Reports Server (NTRS)

Graves, J. R.

1974-01-01

Peen plating of aluminum, copper, and nickel powders was investigated. Only aluminum was plated successfully within the range of peen plating conditions studied. Optimum plating conditions for aluminum were found to be: (1) bead/powder mixture containing 25 to 35% powder by weight, (2) peening intensity of 0.007A as measured by Almen strip, and (3) glass impact bead diameter of at least 297 microns (0.0117 inches) for depositing-100 mesh aluminum powder. No extensive cleaning or substrate preparation is required beyond removing loose dirt or heavy oil.

The Influence of Impurities and Metallic Capping Layers on the Microstructure of Copper Interconnects

NASA Astrophysics Data System (ADS)

Rizzolo, Michael

As copper interconnects have scaled to ever smaller dimensions on semiconductor devices, the microstructure has become increasingly detrimental for performance and reliability. Small grains persist in interconnects despite annealing at high temperatures, leading to higher line resistance and more frequent electromigration-induced failures. Conventionally, it was believed that impurities from the electrodeposition pinned grain growth, but limitations in analytical techniques meant the effect was inferred rather than observed. Recent advances in analytical techniques, however, have enabled this work to quantify impurity content, location, and diffusion in relation to microstructural changes in electroplated copper. Surface segregation of impurities during the initial burst of grain growth was investigated. After no surface segregation was observed, a microfluidic plating cell was constructed to plate multilayer films with regions of intentionally high and low impurity concentrations to determine if grain growth could be pinned by the presence of impurities; it was not. An alternate mechanism for grain boundary pinning based on the texture of the seed layer is proposed, supported by time-resolved transmission electron microscopy and transmission electron backscatter diffraction data. The suggested model posits that the seed in narrow features has no preferred orientation, which results in rapid nucleation of subsurface grains in trench regions prior to recrystallization from the overburden down. These rapidly growing grains are able to block off several trenches from the larger overburden grains, inhibiting grain growth in narrow features. With this knowledge in hand, metallic capping layers were employed to address the problematic microstructure in 70nm lines. The capping layers (chromium, nickel, zinc, and tin) were plated on the copper overburden prior to annealing to manipulate the stress gradient and microstructural development during annealing. It appeared that regardless of as-plated stress, nickel capping altered the recrystallized texture of the copper over patterned features. The nickel capping also caused a 2x increase in the number of advantageous 'bamboo' grains that span the entire trench, which effectively block electromigration pathways. These data provides a more fundamental understanding of manipulating the microstructure in copper interconnects using pre-anneal capping layers, and demonstrates a strategy to improve the microstructure beyond the capabilities of simple annealing.

Fixation of the stressed state of glass plates by coating them with thin films using a plasma focus installation

NASA Astrophysics Data System (ADS)

Kolokoltsev, V. N.; Degtiarev, V. F.; Borovitskaya, I. V.; Nikulin, V. Ya.; Peregudova, E. N.; Silin, P. V.; Eriskin, A. A.

2018-01-01

Elastic deformation in transparent mediums is usually studied by the photoelasticity method. For opaque mediums the method of film coating and strain gauge method are used. After the external load was removed, the interference pattern corresponding to elastic deformation of the material disappears. It is found that the elastic deformation state of the thin glass plate under the action of concentrated load can be fixed during the deposition of a thin metal film. Deposition of thin copper films was carried out by passing of plasma through the copper tube installed inside the Plasma Focus installation. After removing of the load, interference pattern on the glass plates was observed in the form of Newton’s rings and isogers in non-monochromatic light on the CCD scanners which uses uorescent lamps with cold cathode. It is supposed that the copper film fixes the relief of the surface of the glass plate at the time of deformation and saves it when the load is removed. In the case of a concentrated load, this relief has the shape of a thin lens of large radius. For this reason, the interference of coherent light rays in a thin air gap between the glass of the scanners atbed and the lens surface has the shape of Newton's rings. In this case, when scanning the back side of the plate, isogyres are observed. The presented method can be used in the analysis of the mechanical stress in a various optical elements.

Bitter-type magnet plate design with compound conductor of ultrahigh mechanical strength

DOE Office of Scientific and Technical Information (OSTI.GOV)

Haubenberger, W.D.

1981-01-01

A Bitter-type magnet plate design based on a compound conductor of ultrahigh mechanical strength is described. An explosion-bonded and cold-worked copper-austenite compound is jointed by a special procedure with a soft compound sheet.

Boron-doped diamond microdisc arrays: electrochemical characterisation and their use as a substrate for the production of microelectrode arrays of diverse metals (Ag, Au, Cu)via electrodeposition.

PubMed

Simm, Andrew O; Banks, Craig E; Ward-Jones, Sarah; Davies, Trevor J; Lawrence, Nathan S; Jones, Timothy G J; Jiang, Li; Compton, Richard G

2005-09-01

A novel boron-doped diamond (BDD) microelectrode array is characterised with electrochemical and atomic force microscopic techniques. The array consists of 40 micron-diameter sized BDD discs which are separated by 250 microns from their nearest neighbour in a hexagonal arrangement. The conducting discs can be electroplated to produce arrays of copper, silver or gold for analytical purposes in addition to operating as an array of BDD-microelectrodes. Proof-of-concept is shown for four separate examples; a gold plated array for arsenic detection, a copper plated array for nitrate analysis, a silver plated array for hydrogen peroxide monitoring and last, cathodic stripping voltammetry for lead at the bare BDD-array.

Printed Nano Cu and NiSi Contacts and Metallization for Solar Cell Modules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Carmody, Michael John

There has long been a desire to replace the front-side silver contacts in silicon solar cells. There are two driving forces to do this. First, silver is an expensive precious metal. Secondly, the process to use silver requires that it be formulated into screen print pastes that need a lead-containing glass frit, and the use of lead is forbidden in many parts of the world. Because of the difficulty in replacing these pastes and the attendant processes, lead exemptions have granted to solar cells. Copper has been the replacement metal of choice because it is significantly cheaper than silver andmore » is very close to silver in electrical conductivity. Using processes which do not use lead, obviates it as an environmental contaminant. However, copper cannot be in contact with the silicon of the cell since it migrates through the silicon and causes defects which severely damage the efficiency of the cell. Hence, a conductive barrier must be placed between the copper and silicon and nickel, and especially nickel silicide, have been shown to be materials of choice. However, nickel must be sputtered and annealed to create the nickel silicide barrier, and copper has either been sputtered or plated. All of these processes require expensive, specialized equipment and plating uses environmentally unfriendly chemicals. Therefore, Intrinsiq proposed using printed nano nickel silicide ink (which we had previously invented) and printed nano copper ink to create these electrodes and barriers. We found that nano copper ink could be readily printed and sintered under a reducing atmosphere to give highly conductive grids. We further showed that nano nickel silicide ink could be readily jetted into grids on top of the silicon cell. It could then be annealed to create a barrier. However, it was found that the combination of printed NiSi and printed Cu did not give contact resistivity good enough to produce efficient cells. Only plated copper on top of the printed NiSi gave useful contact resistivity, and that proved to five to ten times less conductive than the commercial silver grids. Even so, the NiSi layer was a very good barrier to copper migration, even under harsh environmental conditions. Additionally, both plated copper and printed copper could be soldered to. While it may be possible to produce an all printed copper/nickel silicide top electrode for silicon cells, it was not easily demonstrated within the time and monetary constraints of the present project. Additionally, potential customers have told us that having to laser ablate the anti-reflection coating of cells to create a connection for NiSi, and the addition of two printing and annealing (sintering for copper) steps, adds too much expense to compensate for any potential cost savings from using copper. The cost benefits of copper have been further eroded by the facts that over the lifetime of this project, the cost of silver electrodes decreased due to manufacturers finding ways to use less and less silver, and inventing pastes which use less costly silver materials to begin with. All of these factors were considered and led to the decision to stop the program before actual manufacturing scale was attempted.« less

Thermal conductance measurements of bolted copper joints for SuperCDMS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schmitt, R.; Tatkowski, Greg; Ruschman, M.

2015-09-01

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Results obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

Development of replicated optics for AXAF-1 XDA testing

NASA Technical Reports Server (NTRS)

Engelhaupt, Darell; Wilson, Michele; Martin, Greg

1995-01-01

Advanced optical systems for applications such as grazing incidence Wolter I x-ray mirror assemblies require extraordinary mirror surfaces in terms of fine finish and surface figure. The impeccable mirror surface is on the inside of the rotational mirror form. One practical method of producing devices with these requirements is to first fabricate an exterior surface for the optical device then replicate that surface to have the inverse component with lightweight characteristics. The replicated optic is not better than the master or mandrel from which it is made. This task identifies methods and materials for forming these extremely low roughness optical components. The objectives of this contract were to (1) prepare replication samples of electroless nickel coated aluminum, and determine process requirements for plating XDA test optic; (2) prepare and assemble plating equipment required to process a demonstration optic; (3) characterize mandrels, replicas and test samples for residual stress, surface contamination and surface roughness and figure using equipment at MSFC and; (4) provide technical expertise in establishing the processes, procedures, supplies and equipment needed to process the XDA test optics.

Evident Enhancement of Photoelectrochemical Hydrogen Production by Electroless Deposition of M-B (M = Ni, Co) Catalysts on Silicon Nanowire Arrays.

PubMed

Yang, Yong; Wang, Mei; Zhang, Peili; Wang, Weihan; Han, Hongxian; Sun, Licheng

2016-11-09

Modification of p-type Si surface by active and stable earth-abundant electrocatalysts is an effective strategy to improve the sluggish kinetics for the hydrogen evolution reaction (HER) at p-Si/electrolyte interface and to develop highly efficient and low-cost photocathodes for hydrogen production from water. To this end, Si nanowire (Si-NW) array has been loaded with highly efficient electrocatalysts, M-B (M = Ni, Co), by facile and quick electroless plating to build M-B catalyst-modified Si nanowire-array-textured photocathodes for water reduction to H 2 . Compared with the bare Si-NW array, composite Si-NWs/M-B arrays display evidently enhanced photoelectrochemical (PEC) performance. The onset potential (V phon ) of cathodic photocurrent is positively shifted by 530-540 mV to 0.44-0.45 V vs RHE, and the short-circuit current density (J sc ) is up to 19.5 mA cm -2 in neutral buffer solution under simulated 1 sun illumination. Impressively, the half-cell photopower conversion efficiencies (η hc ) of the optimized Si-NWs/Co-B (2.53%) and Si-NWs/Ni-B (2.45%) are comparable to that of Si-NWs/Pt (2.46%). In terms of the large J sc , V phon , and η hc values, as well as the high Faradaic efficiency, Si-NWs/M-B electrodes are among the top performing Si photocathodes which are modified with HER electrocatalysts but have no buried solid/solid junction.

Stability of nonfouling electroless nickel-polytetrafluoroethylene coatings after exposure to commercial dairy equipment sanitizers.

PubMed

Huang, Kang; Goddard, Julie M

2015-09-01

Application of nonfouling coatings on thermal processing equipment can improve operational efficiency. However, to enable effective commercial translation, a need exists for more comprehensive studies on the stability of nonfouling coatings after exposure to different sanitizers. In the current study, the influence of different commercial dairy equipment sanitizers on the nonfouling properties of stainless steel modified with electroless Ni-polytetrafluoroethylene (PTFE) coatings was determined. Surface properties, such as dynamic contact angle, surface energy, surface morphology, and elemental composition, were measured before and after the coupons were exposed to the sanitizers for 168 cleaning cycles. The fouling behavior of Ni-PTFE-modified stainless steel coupons after exposure was also evaluated by processing raw milk on a self-fabricated benchtop-scale plate heat exchanger. The results indicated that peroxide sanitizer had only minor effect on the Ni-PTFE-modified stainless steel surface, whereas chlorine- and iodine-based sanitizers influenced the surface properties drastically. The coupons after 168 cycles of exposure to peroxide sanitizer accumulated the least amount of fouling material (4.44±0.24mg/cm(2)) compared with the coupons exposed to the other 3 sanitizers. These observations indicated that the Ni-PTFE nonfouling coating retained antifouling properties after 168 cycles of exposure to peroxide-based sanitizer, supporting their potential application as nonfouling coatings for stainless steel dairy processing equipment. Copyright © 2015 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Zheng; Li, Zhilin; Institute of Carbon Fibers and Composites, Beijing University of Chemical Technology, Beijing 100029

Graphical abstract: The MWCNT/Ni-B catalyst has been successfully prepared by an electroless deposition process. The Ni-B nanoparticles on the supporter are amorphous and are well-distributed. The catalytic conversion towards hydrogenation of styrene shows excellent catalytic activity of the obtained materials. Highlights: Black-Right-Pointing-Pointer A two-step treatment of MWCNTs enabled the homogeneous growth of Ni-B nanoparticles. Black-Right-Pointing-Pointer Ni-B nanoparticles were amorphous with an average size of 60 nm. Black-Right-Pointing-Pointer There were electron transfer between Ni and B. Black-Right-Pointing-Pointer The catalyst had excellent catalytic activity towards hydrogenation of styrene. -- Abstract: Nickel-boron (Ni-B) nanoparticles supported on multi-walled carbon nanotubes (MWCNTs) were successfully synthesizedmore » through an electroless deposition process using the plating bath with sodium borohydride as a reducing agent. The structural and morphological analyses using field-emission scanning electron microscopy, X-ray diffractometry and high-resolution transmission electron microscopy have shown that the Ni-B nanoparticles deposited on the sidewalls of MWCNTs are fine spheres comprised of amorphous structure with the morphologically unique fine-structure like flowers, and homogenously dispersed with a narrow particle size distribution centered at around 60 nm diameter. The catalytic activity of MWCNT/Ni-B nanoparticles was evaluated with respect to hydrogenation of styrene. The hydrogenation catalyzed by MWCNT-supported Ni-B nanoparticles has been found to make styrene selectively converted into ethylbenzene. The highest conversion reaches 99.8% under proper reaction conditions, which demonstrates the high catalytic activity of MWCNT/Ni-B nanoparticles.« less

Lead zirconate titanate (PZT)-based thin film capacitors for embedded passive applications

NASA Astrophysics Data System (ADS)

Kim, Taeyun

Investigations on the key processing parameters and properties relationship for lead zirconate titanate (PZT, 52/48) based thin film capacitors for embedded passive capacitor application were performed using electroless Ni coated Cu foils as substrates. Undoped and Ca-doped PZT (52/48) thin film capacitors were prepared on electroless Ni coated Cu foil by chemical solution deposition. For PZT (52/48) thin film capacitors on electroless Ni coated Cu foil, voltage independent (zero tunability) capacitance behavior was observed. Dielectric constant reduced to more than half of the identical capacitor processed on Pt/SiO2/Si. Dielectric properties of the capacitors were mostly dependent on the crystallization temperature. Capacitance densities of almost 350 nF/cm2 and 0.02˜0.03 of loss tangent were routinely measured for capacitors crystallized at 575˜600°C. Leakage current showed dependence on film thickness and crystallization temperature. From a two-capacitor model, the existence of a low permittivity interface layer (permittivity ˜30) was suggested. For Ca-doped PZT (52/48) thin film capacitors prepared on Pt, typical ferroelectric and dielectric properties were measured up to 5 mol% Ca doping. When Ca-doped PZT (52/48) thin film capacitors were prepared on electroless Ni coated Cu foil, phase stability was influenced by Ca doping and phosphorous content. Dielectric properties showed dependence on the crystallization temperature and phosphorous content. Capacitance density of ˜400 nF/cm2 was achieved, which is an improvement by more than 30% compared to undoped composition. Ca doping also reduced the temperature coefficient of capacitance (TCC) less than 10%, all of them were consistent in satisfying the requirements of embedded passive capacitor. Leakage current density was not affected significantly by doping. To tailor the dielectric and reliability properties, ZrO2 was selected as buffer layer between PZT and electroless Ni. Only RF magnetron sputtering process could yield stable ZrO2 layers on electroless Ni coated Cu foil. Other processes resulted in secondary phase formation, which supports the reaction between PZT capacitor and electroless Ni might be dominated by phosphorous component. (Abstract shortened by UMI.)

[Study on physical properties of titanium alloy sample fabricated with vacuum-sintered powder metallurgy].

PubMed

Ding, X; Liang, X; Chao, Y; Han, X

2000-06-01

To investigate the physical properties of titanium alloy fabricated with vacuum-sintered powder metallurgy. The titanium powders of three different particle sizes(-160mesh, -200 - +300mesh, -300mesh) were selected, and mixed with copper and aluminum powder in different proportions. Two other groups were made up of titanium powder(-200 - +300mesh) plated with copper and tin. The build-up and, condensation method and a double-direction press with a metal mold were used. The green compacts were sintered at 1000 degrees C for 15 minutes in a vacuum furnace at 0.025 Pa. In the double-direction press, the specimens were compacted at the pressure of 100 MPa, 200 MPa and 300 MPa respectively. Then the linear shrinkage ratio and the opening porosity of the sintered compacts were evaluated respectively. 1. The linear shrinkage ratio of specimens decreased with the increased compacted pressure(P < 0.05). There was no significant difference among the linear shrinkage ratios of three different titanium powders at the same compacted pressure(P > 0.05), but that of titanium powder plated with copper and tin was higher than those of other specimens without plating(P < 0.05). 2. The opening porosity of specimens decreased with the increased compacted pressure(P < 0.05). Three different sized particle of titanium powder did not affect the opening porosity at the same compacted pressure(P > 0.05). The composition of titanium-based metal powder mixtures and the compacted pressures affect the physical properties of sintered compacts. Titanium powder plated with copper and tin is compacted and sintered easily, and the physical properties of sintered compacts are greatly improved.

Large-displacement structural durability analyses of simple bend specimen emulating rocket nozzle liners

NASA Technical Reports Server (NTRS)

Arya, Vinod K.; Halford, Gary R.

1994-01-01

Large-displacement elastic and elastic-plastic, finite-element stress-strain analyses of an oxygen-tree high-conductivity (OFHC) copper plate specimen were performed using an updated Lagrangian formulation. The plate specimen is intended for low-cost experiments that emulate the most important thermomechanical loading and failure modes of a more complex rocket nozzle. The plate, which is loaded in bending at 593 C, contains a centrally located and internally pressurized channel. The cyclic crack initiation lives were estimated using the results from the analyses and isothermal strain-controlled low-cycle fatigue data for OFHC copper. A comparison of the predicted and experimental cyclic lives showed that an elastic analysis predicts a longer cyclic life than that observed in experiments by a factor greater than 4. The results from elastic-plastic analysis for the plate bend specimen, however, predicted a cyclic life in close agreement with experiment, thus justifying the need for the more rigorous stress-strain analysis.

Improved Cloud Condensation Nucleus Spectrometer

NASA Technical Reports Server (NTRS)

Leu, Ming-Taun

2010-01-01

An improved thermal-gradient cloud condensation nucleus spectrometer (CCNS) has been designed to provide several enhancements over prior thermal- gradient counters, including fast response and high-sensitivity detection covering a wide range of supersaturations. CCNSs are used in laboratory research on the relationships among aerosols, supersaturation of air, and the formation of clouds. The operational characteristics of prior counters are such that it takes long times to determine aerosol critical supersaturations. Hence, there is a need for a CCNS capable of rapid scanning through a wide range of supersaturations. The present improved CCNS satisfies this need. The improved thermal-gradient CCNS (see Figure 1) incorporates the following notable features: a) The main chamber is bounded on the top and bottom by parallel thick copper plates, which are joined by a thermally conductive vertical wall on one side and a thermally nonconductive wall on the opposite side. b) To establish a temperature gradient needed to establish a supersaturation gradient, water at two different regulated temperatures is pumped through tubes along the edges of the copper plates at the thermally-nonconductive-wall side. Figure 2 presents an example of temperature and supersaturation gradients for one combination of regulated temperatures at the thermally-nonconductive-wall edges of the copper plates. c) To enable measurement of the temperature gradient, ten thermocouples are cemented to the external surfaces of the copper plates (five on the top plate and five on the bottom plate), spaced at equal intervals along the width axis of the main chamber near the outlet end. d) Pieces of filter paper or cotton felt are cemented onto the interior surfaces of the copper plates and, prior to each experimental run, are saturated with water to establish a supersaturation field inside the main chamber. e) A flow of monodisperse aerosol and a dilution flow of humid air are introduced into the main chamber at the inlet end. The inlet assembly is designed to offer improved (relative to prior such assemblies) laminar-flow performance within the main chamber. Dry aerosols are subjected to activation and growth in the supersaturation field. f) After aerosol activation, at the outlet end of the main chamber, a polished stainless-steel probe is used to sample droplets into a laser particle counter. The probe features an improved design for efficient sampling. The counter has six channels with size bins in the range of 0.5- to 5.0-micron diameter. g) To enable efficient sampling, the probe is scanned along the width axis of the main chamber (thereby effecting scanning along the temperature gradient and thereby, further, effecting scanning along the supersaturation gradient) by means of a computer-controlled translation stage.

Optimization of reaction parameters in hydrothermal synthesis: a strategy towards the formation of CuS hexagonal plates

PubMed Central

2013-01-01

Background For decades, copper sulphide has been renowned as the superior optical and semiconductor materials. Its potential applications can be ranged from solar cells, lithium-ion batteries, sensors, and catalyst systems. The synthesis methodologies of copper sulphide with different controlled morphology have been widely explored in the literature. Nevertheless, the understanding on the formation chemistry of CuS is still limited. The ultimate approach undertaking in this article is to investigate the formation of CuS hexagonal plates via the optimization of reaction parameters in hydrothermal reaction between copper (II) nitrate and sodium thiosulphate without appending any assistant agent. Results Covellite (CuS) hexagonal plates were formed at copper ion: thiosulphate ion (Cu2+:S2O32−) mole ratio of 1:2 under hydrothermal treatment of 155°C for 12 hours. For synthesis conducted at reaction temperature lower than 155°C, copper sulphate (CuSO4), krohnite (NaCu2(SO4)(H2O)2] and cyclooctasulphur (S8) were present as main impurities with covellite (CuS). When Cu2+:S2O32− mole ratio was varied to 1: 1 and 1: 1.5, phase pure plate-like natrochalcite [NaCu2(SO4)(H2O)] and digenite (Cu9S5) were produced respectively. Meanwhile, mixed phases of covellite (CuS) and cyclooctasulphur (S8) were both identified when Cu2+:S2O32− mole ratio was varied to 1: 2.5, 1: 3 and 1: 5 as well as when reaction time was shortened to 1 hour. Conclusions CuS hexagonal plates with a mean edge length of 1 μm, thickness of 100 nm and average crystallite size of approximately (45 ± 2) nm (Scherrer estimation) were successfully synthesized via assisting agent- free hydrothermal method. Under a suitable Cu2+:S2O32− mole ratio, we evidenced that the formation of covellite (CuS) is feasible regardless of the reaction temperature applied. However, a series of impurities were attested with CuS if reaction temperature was not elevated high enough for the additional crystallite phase decomposition. It was also identified that Cu2+:S2O32− mole ratio plays a vital role in controlling the amount of cyclooctasulphur (S8) in the final powder obtained. Finally, reaction time was recognized as an important parameter in impurity decomposition as well as increasing the crystallite size and crystallinity of the CuS hexagonal plates formed. PMID:23575312

Formation of silicon nanowire packed films from metallurgical-grade silicon powder using a two-step metal-assisted chemical etching method.

PubMed

Ouertani, Rachid; Hamdi, Abderrahmen; Amri, Chohdi; Khalifa, Marouan; Ezzaouia, Hatem

2014-01-01

In this work, we use a two-step metal-assisted chemical etching method to produce films of silicon nanowires shaped in micrograins from metallurgical-grade polycrystalline silicon powder. The first step is an electroless plating process where the powder was dipped for few minutes in an aqueous solution of silver nitrite and hydrofluoric acid to permit Ag plating of the Si micrograins. During the second step, corresponding to silicon dissolution, we add a small quantity of hydrogen peroxide to the plating solution and we leave the samples to be etched for three various duration (30, 60, and 90 min). We try elucidating the mechanisms leading to the formation of silver clusters and silicon nanowires obtained at the end of the silver plating step and the silver-assisted silicon dissolution step, respectively. Scanning electron microscopy (SEM) micrographs revealed that the processed Si micrograins were covered with densely packed films of self-organized silicon nanowires. Some of these nanowires stand vertically, and some others tilt to the silicon micrograin facets. The thickness of the nanowire films increases from 0.2 to 10 μm with increasing etching time. Based on SEM characterizations, laser scattering estimations, X-ray diffraction (XRD) patterns, and Raman spectroscopy, we present a correlative study dealing with the effect of the silver-assisted etching process on the morphological and structural properties of the processed silicon nanowire films.

Formation of silicon nanowire packed films from metallurgical-grade silicon powder using a two-step metal-assisted chemical etching method

PubMed Central

2014-01-01

In this work, we use a two-step metal-assisted chemical etching method to produce films of silicon nanowires shaped in micrograins from metallurgical-grade polycrystalline silicon powder. The first step is an electroless plating process where the powder was dipped for few minutes in an aqueous solution of silver nitrite and hydrofluoric acid to permit Ag plating of the Si micrograins. During the second step, corresponding to silicon dissolution, we add a small quantity of hydrogen peroxide to the plating solution and we leave the samples to be etched for three various duration (30, 60, and 90 min). We try elucidating the mechanisms leading to the formation of silver clusters and silicon nanowires obtained at the end of the silver plating step and the silver-assisted silicon dissolution step, respectively. Scanning electron microscopy (SEM) micrographs revealed that the processed Si micrograins were covered with densely packed films of self-organized silicon nanowires. Some of these nanowires stand vertically, and some others tilt to the silicon micrograin facets. The thickness of the nanowire films increases from 0.2 to 10 μm with increasing etching time. Based on SEM characterizations, laser scattering estimations, X-ray diffraction (XRD) patterns, and Raman spectroscopy, we present a correlative study dealing with the effect of the silver-assisted etching process on the morphological and structural properties of the processed silicon nanowire films. PMID:25349554

Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization

NASA Astrophysics Data System (ADS)

Kao, Szu-Tsung; Duh, Jenq-Gong

2005-08-01

Electroless Ni-P under bump metallization (UBM) has been widely used in electronic interconnections due to the good diffusion barrier between Cu and solder. In this study, the mechanical alloying (MA) process was applied to produce the SnAgCu lead-free solder pastes. Solder joints after annealing at 240°C for 15 min were employed to investigate the evolution of interfacial reaction between electroless Ni-P/Cu UBM and SnAgCu solder with various Cu concentrations ranging from 0.2 to 1.0 wt.%. After detailed quantitative analysis with an electron probe microanalyzer, the effect of Cu content on the formation of intermetallic compounds (IMCs) at SnAgCu solder/electroless Ni-P interface was evaluated. When the Cu concentration in the solder was 0.2 wt.%, only one (Ni, Cu)3Sn4 layer was observed at the solder/electroless Ni-P interface. As the Cu content increased to 0.5 wt.%, (Cu, Ni)6Sn5 formed along with (Ni, Cu)3Sn4. However, only one (Cu, Ni)6Sn5 layer was revealed, if the Cu content was up to 1 wt.%. With the aid of microstructure evolution, quantitative analysis, and elemental distribution by x-ray color mapping, the presence of the Ni-Sn-P phase and P-rich layer was evidenced.

Preparation and electrochemistry of Pd-Ni/Si nanowire nanocomposite catalytic anode for direct ethanol fuel cell.

PubMed

Miao, Fengjuan; Tao, Bairui; Chu, Paul K

2012-04-28

A new silicon-based anode suitable for direct ethanol fuel cells (DEFCs) is described. Pd-Ni nanoparticles are coated on Si nanowires (SiNWs) by electroless co-plating to form the catalytic materials. The electrocatalytic properties of the SiNWs and ethanol oxidation on the Pd-Ni catalyst (Pd-Ni/SiNWs) are investigated electrochemically. The effects of temperature and working potential limit in the anodic direction on ethanol oxidation are studied by cyclic voltammetry. The Pd-Ni/SiNWs electrode exhibits higher electrocatalytic activity and better long-term stability in an alkaline solution. It also yields a larger current density and negative onset potential thus boding well for its application to fuel cells. This journal is © The Royal Society of Chemistry 2012

Extreme ultraviolet reflection efficiencies of diamond-turned aluminum, polished nickel, and evaporated gold surfaces. [for telescope mirrors

NASA Technical Reports Server (NTRS)

Malina, R. F.; Cash, W.

1978-01-01

Measured reflection efficiencies are presented for flat samples of diamond-turned aluminum, nickel, and evaporated gold surfaces fabricated by techniques suited for EUV telescopes. The aluminum samples were 6.2-cm-diameter disks of 6061-T6, the electroless nickel samples were formed by plating beryllium disks with 7.5-microns of Kanigen. Gold samples were produced by coating the aluminum and nickel samples with 5 strips of evaporated gold. Reflection efficiencies are given for grazing angles in the 5-75 degree range. The results indicate that for wavelengths over about 100 A, the gold-coated nickel samples yield highest efficiencies. For shorter wavelengths, the nickel samples yield better efficiencies. 500 A is found to be the optimal gold thickness.

Investigation of reliability attributes and accelerated stress factors on terrestrial solar cells

NASA Technical Reports Server (NTRS)

Lathrop, J. W.

1982-01-01

The accelerated stress test results obtained on all terrestrial solar cells since the inception of the program are summarized. Tested cells were grouped according to the method used to form the conductive metallization layer: solder dipped, vacuum deposited, screen printed, and copper plated. Although metallization systems within each group were quite similar, they differed in numerous details according to the procedures employed by each manufacturer. Test results were summarized for all cells according to both electrical degradation and catastrophic mechanical changes. These results indicated a variability within each metallization category which was dependent on the manufacturer. Only one manufacturer was represented in the copper plated category and, although these showed no signs of detrimental copper diffusion during high temperature testing, their metallization was removed easily during high humidity pressure cooker testing. Preliminary testing of encapsulated cells showed no major differences between encapsulated and unencapsulated cells when subjected to accelerated testing.

Synthesis of Copper Pigments, Malachite and Verdigris: Making Tempera Paint

ERIC Educational Resources Information Center

Solomon, Sally D.; Rutkowsky, Susan A.; Mahon, Megan L.; Halpern, Erica M.

2011-01-01

Malachite and verdigris, two copper-based pigments, are synthesized in this experiment intended for use in a general chemistry laboratory. The preparation of egg tempera paint from malachite is also described. All procedures can be done with a magnetic stir plate, standard glassware present in any first-year laboratory, and household chemicals.…

Weld Repair of Thin Aluminum Sheet

NASA Technical Reports Server (NTRS)

Beuyukian, C. S.; Mitchell, M. J.

1986-01-01

Weld repairing of thin aluminum sheets now possible, using niobium shield and copper heat sinks. Refractory niobium shield protects aluminum adjacent to hole, while copper heat sinks help conduct heat away from repair site. Technique limits tungsten/inert-gas (TIG) welding bombardment zone to melt area, leaving surrounding areas around weld unaffected. Used successfully to repair aluminum cold plates on Space Shuttle, Commercial applications, especially in sealing fractures, dents, and holes in thin aluminum face sheets or clad brazing sheet in cold plates, heat exchangers, coolers, and Solar panels. While particularly suited to thin aluminum sheet, this process also used in thicker aluminum material to prevent surface damage near weld area.

Modeling and Implementation of Solder-activated Joints for Single Actuator, Centimeter-Scale Robotic Mechanisms

DTIC Science & Technology

2010-06-01

Modulus Ratio Annealed Copper 1.0 1.0 1.0 6066 Aluminum 0.63 2.48 3.96 High-Temp Nitinol 0.68 16.8 24.7 1095 Spring Steel 1.82 16.5 9.08 106 5.2.2...were: copper, aluminum, Nitinol , and spring steel. The wetting ability of aluminum and Nitinol to lead-tin solders is poor. There are solders that have...32],[33]. Copper plating may be used to improve a material’s solderability. Nitinol and aluminum are not easily electroplated with copper. Steel and

Thermal conductance measurements of bolted copper joints for SuperCDMS

DOE PAGES

Schmitt, R. L.; Tatkowski, G.; Ruschman, M.; ...

2015-04-28

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Finally, the results we obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.

Libbey-Owens-Ford solar collector static load test

NASA Technical Reports Server (NTRS)

1978-01-01

The test article is a flat plate solar collector that uses liquid as the heat transfer medium. The absorber plate is copper and has a double tempered glass cover. Test requirements and procedures are described and results are presented in a table. Results demonstrate that the collector performed satisfactorily.

Thermal treatment and mechanical properties of aluminum-2021

NASA Technical Reports Server (NTRS)

Brennecke, M. W.

1970-01-01

Mechanical properties, after thermal treatments, are summarized for sheet and plate of copper-rich, high-strength, heat-treatable aluminum-2021. The alloy is quench sensitive, quench rate and variations in aging affect corrosion behavior. Aging effects on yield strength, tensile strength, and elongation of sheet and plate are compared.

Pretinning Nickel-Plated Wire Shields

NASA Technical Reports Server (NTRS)

Igawa, J. A.

1985-01-01

Nickel-plated copper shielding for wires pretinned for subsequent soldering with help of activated rosin flux. Shield cut at point 0.25 to 0.375 in. (6 to 10 mm) from cut end of outer jacket. Loosened end of shield straightened and pulled toward cut end. Insulation of inner wires kept intact during pretinning.

Bitter-type toroidal field magnet for zephyr

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nathrath, N.; Keinath, W.; Kobusch, W.

1981-09-01

A feasibility study concerning stress computations, design and material technology of a Bitter-type magnet for the ZEPHYR project conducted in West Germany is reported. The big overall dimensions of the magnet (6.50 m diam 2.80 m high), access for diagnostics and neutral injection (16 ports), the possibility of remote handling of activated parts and high forces form the main requirements for design and material. A design with 16 identical modules (coils) was chosen, each coil consisting of 16 Bitter plates, plate housings and one diagnostic/neutral injection wedge. The structural parts are connected by bolts and form the bending stiff structuremore » of the magnet. The most critical area of the magnet is the inner wedge-shaped part of the coils (''throat area'') with extremely high tension, compression and shear stress values, to which temperature effects contribute heavily. Steel-copper compounds are found to be the best Bitter-plate materials. Copper-plating austenitic steel can be done galvanically or by explosive techniques. Cold-worked austenitic steels fulfil the requirements in the throat, in the flat-plate region milder steels can be used. Different plate concepts are being considered. Plasma-sprayed Al/sub 2/O/sub 3//TiO/sub 2/ and reinforced epoxy layers are provided as insulating materials in different magnet areas.« less

Integral window/photon beam position monitor and beam flux detectors for x-ray beams

DOEpatents

Shu, Deming; Kuzay, Tuncer M.

1995-01-01

A monitor/detector assembly in a synchrotron for either monitoring the position of a photon beam or detecting beam flux may additionally function as a vacuum barrier between the front end and downstream segment of the beamline in the synchrotron. A base flange of the monitor/detector assembly is formed of oxygen free copper with a central opening covered by a window foil that is fused thereon. The window foil is made of man-made materials, such as chemical vapor deposition diamond or cubic boron nitrate and in certain configurations includes a central opening through which the beams are transmitted. Sensors of low atomic number materials, such as aluminum or beryllium, are laid on the window foil. The configuration of the sensors on the window foil may be varied depending on the function to be performed. A contact plate of insulating material, such as aluminum oxide, is secured to the base flange and is thereby clamped against the sensor on the window foil. The sensor is coupled to external electronic signal processing devices via a gold or silver lead printed onto the contact plate and a copper post screw or alternatively via a copper screw and a copper spring that can be inserted through the contact plate and coupled to the sensors. In an alternate embodiment of the monitor/detector assembly, the sensors are sandwiched between the window foil of chemical vapor deposition diamond or cubic boron nitrate and a front foil made of similar material.

[Exposure to metal compounds in occupational galvanic processes].

PubMed

Surgiewicz, Jolanta; Domański, Wojciech

2006-01-01

Occupational galvanic processes are provided in more than 600 small and medium enterprises in Poland. Workers who deal with galvanic coating are exposed to heavy metal compounds: tin, silver, copper and zinc. Some of them are carcinogenic, for example, hexavalent chromium compounds, nickel and cadmium compounds. Research covered several tens of workstations involved in chrome, nickel, zinc, tin, silver, copper and cadmium plating. Compounds of metals present in the air were determined: Cr, Ni, Cd, Sn, Ag--by atomic absorption spectrometry with electrothermal atomization (ET-AAS) and Zn--by atomic absorption spectrometry with flame atomization (F-AAS). The biggest metal concentrations--of silver and copper--were found at workstations of copper, brass, cadmium, nickel and chrome plating, conducted at the same time. Significant concentrations of copper were found at workstations of maintenance bathing and neutralizing of sewage. The concentrations of metals did not exceed Polish MAC values. MAC values were not exceeded for carcinogenic chromium(VI), nickel or cadmium, either. In galvanic processes there was no hazard related to single metals or their compounds, even carcinogenic ones. Combined exposure indicators for metals at each workstation did not exceed 1, either. However, if there are even small quantities of carcinogenic agents, health results should always be taken into consideration.

Tribological and corrosion behaviour of electroless Ni-B coating possessing a blackberry like structure

NASA Astrophysics Data System (ADS)

Bülbül, Ferhat; Altun, Hikmet; Küçük, Özkan; Ezirmik, Vefa

2012-08-01

This study aims to evaluate the tribological and corrosion properties of the electroless Ni-B coating deposited on AISI 304 stainless steels. The microstructure of the coating was characterized using x-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectrometry (SEM-EDS). XRD analysis revealed that the prepared coating possessed an amorphous character. SEM-EDS investigation also indicated that a non-stoichiometric Ni-B coating was deposited with a columnar growth mechanism on the stainless steel substrate and the morphology of the growth surface was blackberry-like. The hardness and tribological properties were characterized by microhardness and a pin-on-disc wear test. The electroless Ni-B coated sample had a higher degree of hardness, a lower friction coefficient and a lower wear rate than the uncoated substrate. The electrochemical potentiodynamic polarization method was used to evaluate the corrosion resistance of the coating. The electroless Ni-B coating offered cathodic protection on the substrate by acting as a sacrificial anode although it was electrochemically more reactive than the stainless steel substrate.

Application of Self-Assembled Monolayers to the Electroless Metallization of High Aspect Ratio Vias for Microelectronics

NASA Astrophysics Data System (ADS)

Bernasconi, R.; Molazemhosseini, A.; Cervati, M.; Armini, S.; Magagnin, L.

2016-10-01

All-wet electroless metallization of through-silicon vias (TSVs) with a width of 5 μm and a 1:10 aspect ratio was carried out. Immersion in a n-(2-aminoethyl) 3-aminopropyl-trimethoxysilane (AEAPTMS) self-assembled monolayer (SAM) was used to enhance the adhesion between the metal film and substrate. Contact angle variation and atomic force microscopy were used to verify the formation of a SAM layer. A PdCl2 solution was later used to activate the silanized substrates, exploiting the affinity of the -NH3 functional group of AEAPTMS to palladium. A nickel-phosphorus-boron electroless bath was employed to deposit the first barrier layer onto silicon. The NiPB growth rate was evaluated on flat silicon wafers, while the structure of the coating obtained was investigated via glow discharge optical emission spectroscopy. Cross-sectional scanning electron microscope observations were carried out on metallized TSVs to characterize the NiPB seed, the Cu seed layer deposited with a second electroless step, and the Cu superfilling obtained with a commercial solution. Complete filling of TSV was achieved.

The Effect of Cu Powder During Friction Stir Welding on Microstructure and Mechanical Properties of AA3003-H18

NASA Astrophysics Data System (ADS)

Abnar, B.; Kazeminezhad, M.; Kokabi, A. H.

2014-08-01

Friction stir welding (FSW) was used to join 3003-H18 non-heat-treatable aluminum alloy plates by adding copper powder. The copper powder was first added to the gap (0.1 and 0.2 mm) between two plates and then the FSW was performed. The specimens were joined at various rotational speeds of 800, 1000, and 1200 rpm at traveling speeds of 70 and 100 mm/min. The effects of rotational speed, second pass of FSW, and direction of second pass also were studied on copper particle distribution and formation of Al-Cu intermetallic compounds in the stir zone. The second pass of FSW was carried out in two ways; in line with the first pass direction (2F) and in the reverse direction of the first pass (FB). The microstructure, mechanical properties, and formation of intermetallic compounds type were investigated. In high copper powder compaction into the gap, large clusters were formed in the stir zone, while fine clusters and sound copper particles distribution were obtained in low powder compaction. The copper particle distribution and amount of Al-Cu intermetallic compounds were increased in the stir zone with increasing the rotational speed and applying the second pass. Al2Cu and AlCu intermetallic phases were formed in the stir zone and consequently the hardness was significantly increased. The copper particles and in situ intermetallic compounds were symmetrically distributed in both advancing and retreating sides of weld zone after FB passes. Thus, the wider area was reinforced by the intermetallic compounds. Also, the tensile test specimens tend to fracture from the coarse copper aggregation at the low rotational speeds. At high rotational speeds, the fracture locations are placed in HAZ and TMAZ.

Multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chen, Ken Shuang

2004-11-01

This report documents the author's efforts in the deterministic modeling of copper-sulfidation corrosion on non-planar substrates such as diodes and electrical connectors. A new framework based on Goma was developed for multi-dimensional modeling of atmospheric copper-sulfidation corrosion on non-planar substrates. In this framework, the moving sulfidation front is explicitly tracked by treating the finite-element mesh as a pseudo solid with an arbitrary Lagrangian-Eulerian formulation and repeatedly performing re-meshing using CUBIT and re-mapping using MAPVAR. Three one-dimensional studies were performed for verifying the framework in asymptotic regimes. Limited model validation was also carried out by comparing computed copper-sulfide thickness with experimentalmore » data. The framework was first demonstrated in modeling one-dimensional copper sulfidation with charge separation. It was found that both the thickness of the space-charge layers and the electrical potential at the sulfidation surface decrease rapidly as the Cu{sub 2}S layer thickens initially but eventually reach equilibrium values as Cu{sub 2}S layer becomes sufficiently thick; it was also found that electroneutrality is a reasonable approximation and that the electro-migration flux may be estimated by using the equilibrium potential difference between the sulfidation and annihilation surfaces when the Cu{sub 2}S layer is sufficiently thick. The framework was then employed to model copper sulfidation in the solid-state-diffusion controlled regime (i.e. stage II sulfidation) on a prototypical diode until a continuous Cu{sub 2}S film was formed on the diode surface. The framework was also applied to model copper sulfidation on an intermittent electrical contact between a gold-plated copper pin and gold-plated copper pad; the presence of Cu{sub 2}S was found to raise the effective electrical resistance drastically. Lastly, future research needs in modeling atmospheric copper sulfidation are discussed.« less

Morphology of gold and copper ion-plated coatings

NASA Technical Reports Server (NTRS)

Spalvins, T.

1978-01-01

Copper and gold films (0.2 to 2 microns thick) were ion plated onto polished 304-stainless-steel, glass, mica surfaces. These coatings were examined by SEM for defects in their morphological growth. Three types of defects were distinguished: nodular growth, abnormal or runaway growth, and spits. The cause for each type of defect was investigated. Nodular growth is due to inherent substrate microdefects, abnormal or runaway growth is due to external surface inclusions, and spits are due to nonuniform evaporation (ejection of droplets). All these defects induce stresses and produce porosity in the coatings and thus weaken their mechanical properties. During surface rubbing, large nodules are pulled out, leaving vacancies in the coatings.

Development of Surfaces Optically Suitable for Flat Solar Panels. [using a reflectometer which separately evaluates spectral and diffuse reflectivities of surfaces

NASA Technical Reports Server (NTRS)

1979-01-01

A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces is described. A phase locked detection system for the reflectometer is also described. A selective coating on aluminum potentially useful for flat plate solar collector applications is presented. The coating is composed of strongly bound copper oxide (divalent) and is formed by an etching process performed on an aluminum alloy with high copper content. Fabrication costs are expected to be small due to the one stop fabrication process. A number of conclusions gathered from the literature as to the required optical properties of flat plate solar collectors are discussed.

Long-Term Effects of Soldering By-Products on Nickel-Coated Copper Wire

NASA Technical Reports Server (NTRS)

Rolin, T. D.; Hodge, R. E.

2008-01-01

An analysis of thirty-year-old, down graded flight cables was conducted to determine the makeup of a green material on the surface of the shielded wire near soldered areas and to ascertain if the green material had corroded the nickel-coated copper wire. Two likely candidates were possible due to the handling and environments to which these cables were exposed. The flux used to solder the cables is known to contain abietic acid, a carboxylic acid found in many pine rosins used for the soldering process. The resulting material copper abietate is green in color and is formed during the application of heat during soldering operations. Copper (II) chloride, which is also green in color is known to contaminate flight parts and is corrosive. Data is presented that shows the material is copper abietate, not copper (II) chloride, and more importantly that the abietate does not aggressively attack nickel-plated copper wire.

Anode Design Based on Microscale Porous Scaffolds for Advanced Lithium Ion Batteries

NASA Astrophysics Data System (ADS)

Park, Hyeji; Choi, Hyelim; Nam, Kyungju; Lee, Sukyung; Um, Ji Hyun; Kim, Kyungbae; Kim, Jae-Hun; Yoon, Won-Sub; Choe, Heeman

2017-06-01

Considering the increasing demands for advanced power sources, present-day lithium-ion batteries (LIBs) must provide a higher energy and power density and better cycling stability than conventional LIBs. This study suggests a promising electrode design solution to this problem using Cu, Co, and Ti scaffolds with a microscale porous structure synthesized via freeze-casting. Co3O4 and TiO2 layers are uniformly formed on the Co and Ti scaffolds, respectively, through a simple thermal heat-treatment process, and a SnO2 layer is formed on the Cu scaffold through electroless plating and thermal oxidation. This paper characterizes and evaluates the physical and electrochemical properties of the proposed electrodes using scanning electron microscopy, four-point probe and coin-cell tests to confirm the feasibility of their potential use in LIBs.

Halloysite nanotube supported Ag nanoparticles heteroarchitectures as catalysts for polymerization of alkylsilanes to superhydrophobic silanol/siloxane composite microspheres.

PubMed

Li, Cuiping; Li, Xueyuan; Duan, Xuelan; Li, Guangjie; Wang, Jiaqiang

2014-12-15

Halloysite nanotube supported Ag nanoparticles heteroarchitectures have been prepared through a very simple electroless plating method. Robust Ag nanocrystals can be reproducibly fabricated by soaking halloysite nanotubes in ethanolic solutions of AgNO3 and butylamine. By simply adjusting the molar ratio of AgNO3 and butylamine, Ag nanoparticles with tunable size and quantity on halloysite nanotube are achieved. It reveals that the Ag nanoparticles are well-dispersed on the surface of halloysite nanotubes. The halloysite nanotube supported Ag nanoparticles heteroarchitectures can serve as active catalysts for the polymerization of an alkylsilane C18H37SiH3 with water to form silanol/siloxane composite microspheres and exhibit interesting superhydrophobicity ascribed to the micro/nanobinary structure. Copyright © 2014 Elsevier Inc. All rights reserved.

Metal Alloy ICF Capsules Created by Electrodeposition

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Metal Alloy ICF Capsules Created by Electrodeposition

DOE PAGES

Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

2017-12-04

Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

Activity of two strobilurin fungicides against three species of decay fungi in agar plate tests

Treesearch

Juliet D. Tang; Tina Ciaramitaro; Maria Tomaso-Peterson; Susan V. Diehl

2017-01-01

The objective of this study was to examine the toxicity of strobilurin fungicides against wood decay fungi in order to assess their potential to act as a co-biocide for copper-based wood protection. Two strobilurin fungicides, Heritage (50% azoxystrobin active ingredient) and Insignia (20% pyraclostrobin active ingredients), and copper sulfate pentahydrate were tested...

Design and Fabrication of Smart Diapers with Antibacterial Yarn

PubMed Central

Lin, Jia-Horng; Shiu, Bing-Chiuan; Lou, Ching-Wen

2017-01-01

In this study, intelligent eco-diapers are made by combining antibacterial yarns coated with quaternary ammonium salts with conductive yarns to improve caretaking for urinary incontinence. The combination of conductive yarns and sensors can detect the moisture content in eco-diapers, and an alarm is sent when moisture is significant. A wireless module is used to send detected signals to a smartphone or tablet PC via the Internet. This concept is used for a scenario in which nurses do not randomly check on patients in a long-term care institution. When used offline, eco-diapers can send caregivers an alarm for the need to change diapers via cell phones. The diameters of the copper and silver-plated copper fibers are 0.08 and 0.10 mm, respectively. Cotton yarns are twisted with copper and silver-plated copper fibers to form the conductive yarns, which are 0.12 mm in diameter. Moreover, 30-count cotton and 150 D nylon yarns are coated with quaternary ammonium salt via dyeing and finishing processes to form antibacterial yarns. In the current study, intelligent eco-diapers are tested for their electrical and antibacterial properties as specified by AATC and JISL test standards. PMID:29065646

Reductive spectrophotometry of divalent tin sensitization on soda lime glass

NASA Astrophysics Data System (ADS)

Bejugam, Vinith; Wei, Xingfei; Roper, D. Keith

2016-07-01

Rapid and facile evaluation of tin (II) sensitization could lead to improved understanding of metal deposition in electroless (EL) plating. This report used a balanced redox reaction between 3,3‧,5,5‧-tetramethylbenzidine dihydrochloride (TMB-HCL) and N-bromosuccinimide (NBS) to evaluate effects of sensitization conditions (i.e., sensitization time, analyte concentration, aqueous immersion, and acid content) on the accumulated mass of surface-associated divalent tin ion. The accumulated mass of tin (II) increased as the sensitization time increased up to 30 s in proportion to aqueous tin (II) chloride concentrations between 2.6 and 26 mM at a trifluoroacetic acid (TFA) content of 68 mM. The average mass peaked at 7.3 nanomoles (nmol) per cm2 after a 5 s aqueous immersion post-sensitization, and then decreased with increasing aqueous immersion post-sensitization. The total average tin (II) + tin (IV) accumulated on soda lime glass measured by inductively coupled plasma optical emission spectrometry (ICP-OES) was 17% higher at 30 s sensitization, suggesting a fraction of the tin (II) present may have oxidized to tin (IV). These results indicated that in situ spectrophotometric evaluation of tin (II) could support development of EL plating for electronics, catalysis, and solar cells.

Experimental Investigation of Mechanical Properties of Welded Corten Steel A588 Grade Plate Using ER70S - 6 Filler Material for Construction Application

NASA Astrophysics Data System (ADS)

Deepak, J. R.; Bupesh Raja, V. K.; Janardhan Guptha, Mittapalli; Durga Prasad, Palaparthi Hari; Sriram, V.

2017-05-01

ASTM A588 Grade A steel plate is a high strength, low alloy structural steel with 0.19 % of carbon content. When exposed to the atmosphere, A588 Grade A is suitable for construction in the bare (paint - free) condition. The main problems are lack of fusion, lack of penetration and corrosion on heat affected zone. In this research work Corten ASTM A588 Grade steel of 3mm thickness is electroplated with copper and then both raw and copper electroplated are welded by GMAW welding process with ER70S-6 as a filler material. The welded ASTM A588 is cut according to ASTM size for further testing of mechanical properties. Considering its welding strength after the process of electroplating, this research clearly states the metal can be utilized for better results in any given field. Here both the tensile and hardness are higher in copper electroplated welded when compare to raw welded.

Manipulator having thermally conductive rotary joint for transferring heat from a test specimen

DOEpatents

Haney, Steven J.; Stulen, Richard H.; Toly, Norman F.

1985-01-01

A manipulator for rotatably moving a test specimen in an ultra-high vacuum chamber includes a translational unit movable in three mutually perpendicular directions. A manipulator frame is rigidly secured to the translational unit for rotatably supporting a rotary shaft. A first copper disc is rigidly secured to an end of the rotary shaft for rotary movement within the vacuum chamber. A second copper disc is supported upon the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. A sapphire plate is interposed between the first and second discs to prevent galling of the copper material while maintaining high thermal conductivity between the first and second discs. A spring is disposed on the shaft to urge the second disc toward the first disc and compressingly engage the interposed sapphire plate. A specimen mount is secured to the first disc for rotation within the vacuum chamber. The specimen maintains high thermal conductivity with the second disc receiving the cryogenic transfer line.

355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration

NASA Astrophysics Data System (ADS)

Dupont, F.; Stoukatch, S.; Laurent, P.; Dricot, S.; Kraft, M.

2018-01-01

Laser direct patterning of fine pitch features on standard PCB (Printed Circuit Board) was investigated. As a feasibility study, eight parameter sets were selected and the smallest achievable grooves and tracks were determined. Three regular FR4 (Flame Resistant 4) PCB substrates have been experimented with. The first two have respectively 18 μm and 35 μm bare copper conductive layer without finish while the third one has a 18 μm copper layer with ENIG (Electroless Nickel Immersion Gold) finish. Laser patterning of PCB conductive structure is a single step, maskless and purely dry operation expected to allow reaching fine pitch features, even on thick copper layers (≥ 18 μm) for which the traditional chemical wet processes encounter underetch problems. Aside PCB complete structuring, a second objective is to evaluate laser post-processing of standard patterned PCB as an economically viable technique to integrate a few fine pitch components on low cost PCBs. This process is suitable for prototyping and for small and medium series. The widths of the smallest grooves and tracks that we achieved were measured about 11 μm and 19 μm on 18 μm thick cooper layer, 13 μm and 39 μm on 35 μm thick cooper layer, and 11 μm and 38 μm on 18 μm cooper layer with ENIG finish. These values are well below what can be achieved with a wet process. Etching results are presented at high magnification both from the top and from a cross-sectioning perspective. The latter allows observation of the TAZ (Thermal Affected Zone) in the conductive layer and the damages in the FR4.

Standardized performance tests of collectors of solar thermal energy - A flat-plate copper collector with parallel mylar striping

NASA Technical Reports Server (NTRS)

Johnson, S. M.

1976-01-01

Basic test results are reported for a flat plate solar collector whose performance was determined in a solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and one coolant flow rate. Collector efficiency is correlated in terms of inlet temperature and flux level.

All-metal, compact heat exchanger for space cryocoolers

NASA Technical Reports Server (NTRS)

Swift, Walter L.; Valenzuela, Javier; Sixsmith, Herbert

1990-01-01

This report describes the development of a high performance, all metal compact heat exchanger. The device is designed for use in a reverse Brayton cryogenic cooler which provides five watts of refrigeration at 70 K. The heat exchanger consists of a stainless steel tube concentrically assembled within a second stainless steel tube. Approximately 300 pairs of slotted copper disks and matching annular slotted copper plates are positioned along the centerline axis of the concentric tubes. Each of the disks and plates has approximately 1200 precise slots machined by means of a special electric discharge process. Positioning of the disk and plate pairs is accomplished by means of dimples in the surface of the tubes. Mechanical and thermal connections between the tubes and plate/disk pairs are made by solder joints. The heat exchanger assembly is 9 cm in diameter by 50 cm in length and has a mass of 10 kg. The predicted thermal effectiveness is greater than 0.985 at design conditions. Pressure loss at design conditions is less than 5 kPa in both fluid passages. Tests were performed on a subassembly of plates integrally soldered to two end headers. The measured thermal effectiveness of the test article exceeded predicted levels. Pressure losses were negligibly higher than predictions.

Effect of Reduced Graphene Oxide Reinforcement on the Wear Characteristics of Electroless Ni-P Coatings

NASA Astrophysics Data System (ADS)

Tamilarasan, T. R.; Sanjith, U.; Rajendran, R.; Rajagopal, G.; Sudagar, J.

2018-03-01

Electroless composite coatings with various concentrations of reduced graphene oxide (rGO) particles were deposited onto mild steel substrate. The effects of adding rGO particles by varying their concentration from 0 to 100 mg/L on morphology, composition, microhardness, adhesion, wear and friction of the electroless composite coatings were investigated. Among the various parameters that influence the tribological behavior, sliding velocity was varied within a specific range for definite concentrations of rGO to obtain enhanced wear resistance in this study. The micrographs of the worn surfaces and indented spots were examined for the nature of wear mechanism and interfacial adhesion. The wear rate increased with increasing sliding velocity but was relatively stable for coatings with lower concentrations of rGO.

Solution-Processed Metal Coating to Nonwoven Fabrics for Wearable Rechargeable Batteries.

PubMed

Lee, Kyulin; Choi, Jin Hyeok; Lee, Hye Moon; Kim, Ki Jae; Choi, Jang Wook

2017-12-27

Wearable rechargeable batteries require electrode platforms that can withstand various physical motions, such as bending, folding, and twisting. To this end, conductive textiles and paper have been highlighted, as their porous structures can accommodate the stress built during various physical motions. However, fabrics with plain weaves or knit structures have been mostly adopted without exploration of nonwoven counterparts. Also, the integration of conductive materials, such as carbon or metal nanomaterials, to achieve sufficient conductivity as current collectors is not well-aligned with large-scale processing in terms of cost and quality control. Here, the superiority of nonwoven fabrics is reported in electrochemical performance and bending capability compared to currently dominant woven counterparts, due to smooth morphology near the fiber intersections and the homogeneous distribution of fibers. Moreover, solution-processed electroless deposition of aluminum and nickel-copper composite is adopted for cathodes and anodes, respectively, demonstrating the large-scale feasibility of conductive nonwoven platforms for wearable rechargeable batteries. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Fabrication of durable copper plating superhydrophobic surface with improved corrosion resistance and oil-water separation properties

NASA Astrophysics Data System (ADS)

Zhao, Yichao; Xiao, Xinyan; Ye, Zhihao; Ji, Qiang; Xie, Wei

2018-02-01

A mechanical durable superhydrophobic copper-plated stainless steel mesh was successfully fabricated by an electrodeposition process and 1-octadecanethiol modification. The as-prepared superhydrophobic mesh displays water contact angle of 153° and shows excellent anti-corrosion and water-oil separation properties in the condition of 0.1 A/cm2 current density for 35 s. In comparison with bare stainless steel mesh, the corrosion current of the as-prepared superhydrophobic mesh is close to 1/6 of the former. Meanwhile, the as-prepared superhydrophobic mesh could continuously separate oil from oil-water mixtures. The separation efficiency of continuous separation is as high as 96% and shows less than 1% decrease after ten cycles.

Bacteria cut by 'up to 95%' in copper trial.

PubMed

2008-11-01

The first results from an 18-month trial at Birmingham's Selly Oak Hospital, which has seen a range of items in one ward, including taps, door handles, sink fittings, push plates and light switches made from "conventional" plastic and stainless steel materials substituted with copper replacements, has proven beyond doubt the metal's effectiveness in destroying pathogens in a clinical environment. Health Estate Journal reports.

Polyimide-glass multilayer printed wiring boards

NASA Astrophysics Data System (ADS)

Lula, J. W.

1984-07-01

Multilayer printed wiring boards (PWBs) from a polyimide/glass reinforced copper clad laminate and prepreg were manufactured. A lamination cycle and innerlayer copper surface treatment that gave satisfactory delamination resistance at soldering temperatures were developed. When compared to similar epoxy/glass multilayer PWBs, the polyimide PWBs had higher thermal stability, greater resistance to raised lands, fewer plating voids, less outgassing, and adhesion that was equivalent to urethane foam encapsulants.

iMAST Quarterly, Number 3, 2000

DTIC Science & Technology

2000-01-01

components which depend on evaporating unit capabilities. There are three components (EB-gun, water cooled copper crucible and vacuum chamber) in the EB-PVD...Ion Implantation and Ion Plating electromagnetic deflected through 180 or 2700. Similarly, evaporant material is placed in a water-cooled copper ... crucible , which could be either pocket type for small quantity evaporation application or continuous ingot feeding through the crucible for larger quantity

Influence of nanomodification additives on the properties of multilayer composite coating obtained in laser surfacing

NASA Astrophysics Data System (ADS)

Cherepanov, A. N.; Orishich, A. M.; Ovcharenko, V. E.; Malikov, A. G.; Drozdov, V. O.; Pshenichnikov, A. P.

2017-10-01

The paper presents the results of numerical and experimental studies of the process of obtaining a permanent joint of two plates of heterogeneous metals that cannot be welded in the usual way: alloy Grade 4 and steel AISI 321 using a laser beam and an intermediate composite insert. The composite insert was obtained by explosion welding of four thin plates of titanium (Grade 4), niobium, copper, and steel (AISI 321). The insert was placed between the welded plates of titanium and steel, and the steel plate was welded with the steel part of the insert, and the titanium plate was welded with the titanium part of the insert. The plates were welded using a CO2 laser. The connection of metals with the help of explosion is carried out without their melting, so the formation of the brittle intermetallics does not occur in most cases. This ensures the greatest strength of the joints as compared to the joints obtained by other welding methods. To analyze the distribution of thermal fields in the composite insert and welded plates, a numerical study was conducted of the laser welding of steel and titanium plates with the corresponding parts of the insert. The purpose of the study was to determine the rational parameters of welding (laser beam power, speed of its movement, size and position of the focal spot), at which there was no complete melting of the steel and titanium parts of the insert during through penetration of the welded plates. The experimental part of the work is devoted to analysis of formation of the internal boundaries and microstructure of the composite insert and the strength of the permanent joint. It is shown that as a result of the explosion welding, weld seams of different wavelike configuration are formed. The most pronounced wavelike boundary is observed in the steel-copper connection, since these materials have a face-centered cubic lattice and are easily subjected to plastic deformation. At the contact boundaries of the plates, transition diffusion zones with different widths (from 5 to 40 μm) and element concentrations are formed. The hardness in the boundary diffusion zones is higher than in the connected metals, which is due to the diffusion interaction of the materials adjacent to each other. It has been established that the tensile strength of the composite insert is comparable to the maximum strength of Grade 4 alloy (456-511 MPa), and the failure in most cases occurred over the least durable component of the composite material, which is the copper plate, whose strength was significantly increased by cold hardening during explosion welding and diffusion of elements of the contacting plates.

Potential use of copper surfaces to reduce survival of epidemic meticillin-resistant Staphylococcus aureus in the healthcare environment.

PubMed

Noyce, J O; Michels, H; Keevil, C W

2006-07-01

Epidemic meticillin-resistant Staphylococcus aureus (EMRSA) emerged in the early 1980s with EMRSA-15 and -16 being the most prevalent strains within the UK. MRSA transmission between patients is largely via the hands of healthcare workers, and contamination of the hospital environment may occur. The objective of this study was to evaluate the effectiveness of copper and brass to reduce the viability of air-dried deposits of three MRSA strains [MRSA (NCTC 10442), EMRSA-1 (NCTC 11939) and EMRSA-16 (NCTC 13143)] compared with stainless steel. MRSA and EMRSA [10(7)colony-forming units (CFU)] were inoculated on to coupons (1 cm x 1 cm) of copper, brass or stainless steel and incubated at either 22 degrees C or 4 degrees C for various time periods. Viability was determined by resuspending removed CFUs and plating out on tryptone soy agar plates in addition to staining with the respiratory indicator fluorochrome 5-cyano-2,3-ditolyl tetrazolium. On pure copper surfaces, 10(7) MRSA, EMRSA-1 and EMRSA-16 were completely killed after 45, 60 and 90 min, respectively, at 22 degrees C. In contrast, viable organisms for all three strains were detected on stainless steel (grade 304) after 72 h at 22 degrees C. At 4 degrees C, complete kill was achieved on copper for all three strains within 6 h. The results demonstrate an antimicrobial effect of copper on MRSA, EMRSA-1 and -16 in contrast to stainless steel. Consequently, the contemporary application of stainless steel in hospital environments for work surfaces and door furniture is not recommended.

CLOSED-LOOP TREATMENT OF ELECTROLYTIC AND ELECTROLESS NICKEL RINSE WATER BY POINT-OF-USE ION EXCHANGE: A CASE STUDY.

EPA Science Inventory

Closed-Loop Treatment of Electrolytic and Electroless Nickel Rinse Water by Point-Of-Use Ion Exchange: A Case Study.

Dave Szlag1, Joe Leonhardt2, Albert Foster1, Mike Goss1 and Paul Bolger1.
1 U.S. EPA, National Risk Management Research Laboratory, 26 W. M. L. King D...

Thermal conductivity and thermal expansion of graphite fiber/copper matrix composites

NASA Technical Reports Server (NTRS)

Ellis, David L.; Mcdanels, David L.

1991-01-01

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites

NASA Technical Reports Server (NTRS)

Ellis, David L.; Mcdanels, David L.

1993-01-01

The high specific conductivity of graphite fiber/copper matrix (Gr/Cu) composites offers great potential for high heat flux structures operating at elevated temperatures. To determine the feasibility of applying Gr/Cu composites to high heat flux structures, composite plates were fabricated using unidirectional and cross-plied pitch-based P100 graphite fibers in a pure copper matrix. Thermal conductivity of the composites was measured from room temperature to 1073 K, and thermal expansion was measured from room temperature to 1050 K. The longitudinal thermal conductivity, parallel to the fiber direction, was comparable to pure copper. The transverse thermal conductivity, normal to the fiber direction, was less than that of pure copper and decreased with increasing fiber content. The longitudinal thermal expansion decreased with increasing fiber content. The transverse thermal expansion was greater than pure copper and nearly independent of fiber content.

Effects of copper supplement on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture.

PubMed

Rodríguez, L Mato; Alatossava, T

2008-10-01

To determine the effects of supplemented copper (Cu2+) on growth and viability of strains used as starters and adjunct cultures for Emmental cheese manufacture. Thirteen strains belonging to Lactobacillus delbrueckii, Lactobacillus helveticus, Lactobacillus rhamnosus, Streptococcus thermophilus or Propionibacterium freudenreichii species were exposed to various copper concentrations in the proper growth medium at relevant growth temperatures, and the effects of supplemented copper on bacterial growth and cell viability were determined by optical density and pH measurements, also by platings. Among the species considered, L. delbrueckii was the most copper resistant and S. thermophilus the most sensitive to copper. Anaerobic conditions increased this sensitivity significantly. There was also a considerable amount of variation in copper resistance at strain level. Copper resistance is both a species- and strain-dependent property and may reflect variability in copper-binding capacities by cell wall components among species and strains. In addition, the chemical state of copper may be involved. This study revealed that copper resistance is a highly variable property among starter and adjunct strains, and this variability should be considered when strains are selected for Emmental cheese manufacture.

Comparison of the surfaces and interfaces formed for sputter and electroless deposited gold contacts on CdZnTe

NASA Astrophysics Data System (ADS)

Bell, Steven J.; Baker, Mark A.; Duarte, Diana D.; Schneider, Andreas; Seller, Paul; Sellin, Paul J.; Veale, Matthew C.; Wilson, Matthew D.

2018-01-01

Cadmium zinc telluride (CdZnTe) is a leading sensor material for spectroscopic X/γ-ray imaging in the fields of homeland security, medical imaging, industrial analysis and astrophysics. The metal-semiconductor interface formed during contact deposition is of fundamental importance to the spectroscopic performance of the detector and is primarily determined by the deposition method. A multi-technique analysis of the metal-semiconductor interface formed by sputter and electroless deposition of gold onto (111) aligned CdZnTe is presented. Focused ion beam (FIB) cross section imaging, X-ray photoelectron spectroscopy (XPS) depth profiling and current-voltage (IV) analysis have been applied to determine the structural, chemical and electronic properties of the gold contacts. In a novel approach, principal component analysis has been employed on the XPS depth profiles to extract detailed chemical state information from different depths within the profile. It was found that electroless deposition forms a complicated, graded interface comprised of tellurium oxide, gold/gold telluride particulates, and cadmium chloride. This compared with a sharp transition from surface gold to bulk CdZnTe observed for the interface formed by sputter deposition. The electronic (IV) response for the detector with electroless deposited contacts was symmetric, but was asymmetric for the detector with sputtered gold contacts. This is due to the electroless deposition degrading the difference between the Cd- and Te-faces of the CdZnTe (111) crystal, whilst these differences are maintained for the sputter deposited gold contacts. This work represents an important step in the optimisation of the metal-semiconductor interface which currently is a limiting factor in the development of high resolution CdZnTe detectors.

76 FR 75873 - Certain Helical Spring Lock Washers From Taiwan and the People's Republic of China: Continuation...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-12-05

... or bolts; and (3) provide a hardened bearing surface. The scope does not include internal or external tooth washers, nor does it include spring lock washers made of other metals, such as copper. Lock..., or of stainless steel, heat-treated or non-heat-treated, plated or non-plated, with ends that are off...

Laser-induced selective copper plating of polypropylene surface

NASA Astrophysics Data System (ADS)

Ratautas, K.; Gedvilas, M.; Stankevičiene, I.; JagminienÄ--, A.; Norkus, E.; Li Pira, N.; Sinopoli, S.; Emanuele, U.; Račiukaitis, G.

2016-03-01

Laser writing for selective plating of electro-conductive lines for electronics has several significant advantages, compared to conventional printed circuit board technology. Firstly, this method is faster and cheaper at the prototyping stage. Secondly, material consumption is reduced, because it works selectively. However, the biggest merit of this method is potentiality to produce moulded interconnect device, enabling to create electronics on complex 3D surfaces, thus saving space, materials and cost of production. There are two basic techniques of laser writing for selective plating on plastics: the laser-induced selective activation (LISA) and laser direct structuring (LDS). In the LISA method, pure plastics without any dopant (filler) can be used. In the LDS method, special fillers are mixed in the polymer matrix. These fillers are activated during laser writing process, and, in the next processing step, the laser modified area can be selectively plated with metals. In this work, both methods of the laser writing for the selective plating of polymers were investigated and compared. For LDS approach, new material: polypropylene with carbon-based additives was tested using picosecond and nanosecond laser pulses. Different laser processing parameters (laser pulse energy, scanning speed, the number of scans, pulse durations, wavelength and overlapping of scanned lines) were applied in order to find out the optimal regime of activation. Areal selectivity tests showed a high plating resolution. The narrowest width of a copper-plated line was less than 23 μm. Finally, our material was applied to the prototype of the electronic circuit board on a 2D surface.

One-step internal-tin Nb/sub 3/Sn superconductor fabrication. Final report, June 1983-August 1984

DOE Office of Scientific and Technical Information (OSTI.GOV)

Marancik, W.

1985-03-01

The object of this research is to demonstrate the feasibility of producing a Nb/sub 3/Sn superconductor in a single extrusion process with a large number of filaments with internal tin. The technique chosen uses .010'-diameter Nb and tin-plated Cu wires formed into a solenoid. The solenoid is covered with tin-plated copper foil and isostatically compacted to a pressure of 17,000 psi. The solenoid is slit along its length. This results in a ribbon about 40 inches long by about 5-inches wide, with the Nb wires running across the 5-inch-width. The ribbon is then rolled up (Jelly Roll) around a 0.5more » inch diameter Ta covered copper rod to produce a composite of about 1.5 inches in diameter by 5 inches long. The composite geometry is now a cylindrical bundle of 0.010-inch-diameter Nb wire separated from each other by tin-plated copper. Each Nb wire is aligned with the axis of cylinder. The cylinder is slid into a Ta-lined copper extrusion can which is evacuated and sealed. The can is extruded at a low temperature and drawn to final wire size without intermediate annealing. The advantage of the process is that it is an internal tin process with the tin uniformly distributed through the matrix. The Nb is in a relatively soft state having been fully annealed at 0.020-inch diameter. Only one extrusion is required since the bundling technique allows a large number of wires to be precisely aligned and spaced in the matrix.« less

Development of low cost contacts to silicon solar cells

NASA Technical Reports Server (NTRS)

Tanner, D. P.

1980-01-01

The results of the second phase of the program of developing low cost contacts to silicon solar cells using copper are presented. Phase 1 yielded the development of a plated Pd-Cr-Cu contact system. This process produced cells with shunting problems when they were heated to 400 C for 5 minutes. Means of stopping the identified copper diffusion which caused the shunting were investigated. A contact heat treatment study was conducted with Pd-Ag, Ci-Ag, Pd-Cu, Cu-Cr, and Ci-Ni-Cu. Nickel is shown to be an effective diffusion barrier to copper.

A study of ignition by rifle bullets

Treesearch

Mark A. Finney; Trevor B. Maynard; Sara S. McAllister; Ian J. Grob

2013-01-01

Experiments were conducted to examine the potential for rifle bullets to ignite organic matter after impacting a hard surface. The tests were performed using a variety of common cartridges (7.62x51, 7.62x39, 7.62x54R, and 5.56x45) and bullet materials (steel core, lead core, solid copper, steel jacket, and copper jacket). Bullets were fired at a steel plate that...

Fabrication of Copper-Rich Cu-Al Alloy Using the Wire-Arc Additive Manufacturing Process

NASA Astrophysics Data System (ADS)

Dong, Bosheng; Pan, Zengxi; Shen, Chen; Ma, Yan; Li, Huijun

2017-12-01

An innovative wire-arc additive manufacturing (WAAM) process is used to fabricate Cu-9 at. pct Al on pure copper plates in situ, through separate feeding of pure Cu and Al wires into a molten pool, which is generated by the gas tungsten arc welding (GTAW) process. After overcoming several processing problems, such as opening the deposition molten pool on the extremely high-thermal conductive copper plate and conducting the Al wire into the molten pool with low feed speed, the copper-rich Cu-Al alloy was successfully produced with constant predesigned Al content above the dilution-affected area. Also, in order to homogenize the as-fabricated material and improve the mechanical properties, two further homogenization heat treatments at 1073 K (800 °C) and 1173 K (900 °C) were applied. The material and mechanical properties of as-fabricated and heat-treated samples were compared and analyzed in detail. With increased annealing temperatures, the content of precipitate phases decreased and the samples showed gradual improvements in both strength and ductility with little variation in microstructures. The present research opened a gate for in-situ fabrication of Cu-Al alloy with target chemical composition and full density using the additive manufacturing process.

Development of Aspherical Active Gratings at NSRRC

NASA Astrophysics Data System (ADS)

Tseng, Tse-Chuan; Wang, Duan Jen; Perng, Shen-Yaw; Chen, Chien-Te; Lin, Chia-Jui; Kuan, Chien-Kuang; Ho, His-Chou; Wang, Jeremy; Fung, H. S.; Chang, Shuo-Hung

2007-01-01

An active grating based on a novel optical concept with bendable polynomial surface profile to reduce the coma and defocus aberrations had been designed and proved by the prototype testing. Due to the low glass transition temperature of the glue and the difference of thermal expansion coefficient between the 17-4 steel bender and silicon, the prototype distorted from flat polished condition when thermally de-blocked the polishing pitch. To improve the thermal deformation of the active grating in the polishing process, a new invar bender and high curing temperature glue were adapted to glue a silicon substrate on the bender. After some tests and manufacturer polishing, it showed acceptable conditions. In this paper we will present the design and preliminary tests of the invar active grating. Meanwhile, the design and analysis of a new 17-4 PH steel bender to be electro-less nickel plating and mechanical ruling for a new beamline will also be discussed.

Backside contacted field effect transistor array for extracellular signal recording.

PubMed

Ingebrandt, S; Yeung, C K; Staab, W; Zetterer, T; Offenhäusser, A

2003-04-01

A new approach to the design of field-effect transistor (FET) sensors and the use of these FETs in detecting extracellular electrophysiological recordings is reported. Backside contacts were engineered by deep reactive ion etching and a gas phase boron doping process of the holes using planar diffusion sources. The metal contacts were designed to fit on top of the bonding pads of a standard industrial 22-pin DIL (dual inline) chip carrier. To minimise contact resistance, the metal backside contacts of the chips were electroless plated with gold. The chips were mounted on top of the bonding pads using a standard flip-chip process and a fineplacer unit previously described. Rat embryonic myocytes were cultured on these new devices (effective growth area 6 x 6 mm(2)) in order to confirm their validity in electrophysiological recording. Copyright 2003 Elsevier Science B.V.

FeCoNi coated glass fibers in composite sheets for electromagnetic absorption and shielding behaviors

NASA Astrophysics Data System (ADS)

Lee, Joonsik; Jung, Byung Mun; Lee, Sang Bok; Lee, Sang Kwan; Kim, Ki Hyeon

2017-09-01

To evaluate the electromagnetic (EM) absorption and shield of magnetic composite sheet, we prepared the FeCoNi coated glass fibers filled in composite sheet. The FeCoNi was coated by electroless plating on glass fiber as a filler. The coated FeCoNi found that consist of mixtures of bcc and fcc phase. The magnetization and coercivity of coated FeCoNi are about 110 emu/g and 57 Oe, respectively. The permittivity and permeability of the FeCoNi composite sheet were about 21 and 1, respectively. Power absorption increased 95% with the increment of frequency up to 10 GHz. Inter-decoupling of this composite sheet showed maximum 30 dB at around 5.3 GHz, which is comparable to that of a conductive Cu foil. Shielding effectiveness (SE) was measured by using rectangular waveguide method. SE of composite obtained about 37 dB at X-band frequency region.

Biofabrication of Tobacco mosaic virus-nanoscaffolded supercapacitors via temporal capillary microfluidics

NASA Astrophysics Data System (ADS)

Zang, Faheng; Chu, Sangwook; Gerasopoulos, Konstantinos; Culver, James N.; Ghodssi, Reza

2017-06-01

This paper reports the implementation of temporal capillary microfluidic patterns and biological nanoscaffolds in autonomous microfabrication of nanostructured symmetric electrochemical supercapacitors. A photoresist layer was first patterned on the substrate, forming a capillary microfluidics layer with two separated interdigitated microchannels. Tobacco mosaic virus (TMV) macromolecules suspended in solution are autonomously delivered into the microfluidics, and form a dense bio-nanoscaffolds layer within an hour. This TMV layer is utilized in the electroless plating and thermal oxidation for creating nanostructured NiO supercapacitor. The galvanostatic charge/discharge cycle showed a 3.6-fold increase in areal capacitance for the nanostructured electrode compared to planar structures. The rapid creation of nanostructure-textured microdevices with only simple photolithography and bionanostructure self-assembly can completely eliminate the needs for sophisticated synthesis or deposition processes. This method will contribute to rapid prototyping of wide range of nano-/micro-devices with enhanced performance.

P(VDF-TrFE) ferroelectric nanotube array for high energy density capacitor applications.

PubMed

Li, Xue; Lim, Yee-Fun; Yao, Kui; Tay, Francis Eng Hock; Seah, Kar Heng

2013-01-14

Poly(vinylidene-fluoride-co-trifluoroethylene) (P(VDF-TrFE)) ferroelectric nanotube arrays were fabricated using an anodized alumina membrane (AAM) as a template and silver electrodes were deposited on both the outer and inner sides of the nanotubes by an electroless plating method. The nanotubes have the unique structure of being sealed at one end and linked at the open end, thus preventing electrical shorting between the inner and outer electrodes. Compared with a P(VDF-TrFE) film with a similar overall thickness, the idealized nanotube array has a theoretical capacitance that is 763 times larger due to the greatly enlarged contact area between the electrodes and the polymer dielectric. A capacitance that is 95 times larger has been demonstrated experimentally, thus indicating that such nanotube arrays are promising for realizing high density capacitance and high power dielectric energy storage.

Glass frits coated with silver nanoparticles for silicon solar cells

NASA Astrophysics Data System (ADS)

Li, Yingfen; Gan, Weiping; Zhou, Jian; Li, Biyuan

2015-06-01

Glass frits coated with silver nanoparticles were prepared by electroless plating. Gum Arabic (GA) was used as the activating agent of glass frits without the assistance of stannous chloride or palladium chloride. The silver-coated glass frits prepared with different GA dosages were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), and thermogravimetric analysis (TGA). The characterization results indicated that silver-coated glass frits had the structures of both glass and silver. Spherical silver nanoparticles were distributed on the glass frits evenly. The density and particle size of silver nanoparticles on the glass frits can be controlled by adjusting the GA dosage. The silver-coated glass frits were applied to silver pastes to act as both the densification promoter and silver crystallite formation aid in the silver electrodes. The prepared silver-coated glass frits can improve the photovoltaic performances of solar cells.

Method for producing highly reflective metal surfaces

DOEpatents

Arnold, Jones B.; Steger, Philip J.; Wright, Ralph R.

1983-01-01

The invention is a novel method for producing mirror surfaces which are extremely smooth and which have high optical reflectivity. The method includes electrolessly depositing an amorphous layer of nickel on an article and then diamond-machining the resulting nickel surface to increase its smoothness and reflectivity. The machined nickel surface then is passivated with respect to the formation of bonds with electrodeposited nickel. Nickel then is electrodeposited on the passivated surface to form a layer of electroplated nickel whose inside surface is a replica of the passivated surface. The electroplated nickel layer then is separated from the passivated surface. The mandrel then may be re-passivated and provided with a layer of electrodeposited nickel, which is then recovered from the mandrel providing a second replica. The mandrel can be so re-used to provide many such replicas. As compared with producing each mirror-finished article by plating and diamond-machining, the new method is faster and less expensive.

Synthesis and improved explosion behaviors of aluminum powders coated with nano-sized nickel film

NASA Astrophysics Data System (ADS)

Kim, Kyung Tae; Kim, Dong Won; Kim, Soo Hyung; Kim, Chang Kee; Choi, Yoon Jeong

2017-09-01

Nickel (Ni) materials with a thickness of a few hundred nm were homogeneously coated on the surfaces of aluminum (Al) powders by an electroless plating process. The Ni-coated Al powders show characteristic interfacial structures mixed of Ni, Al and O instead of densely packed Al oxide at the surface. The explosion test of the Ni-coated Al powders utilizing flame ignition showed that the powders had a 3.6 times enhanced pressurization rate of 405 kPa/ms compared to 111 kPa/ms of uncoated Al powders. It was found that this is due to a feasible diffusion of oxygen atoms into the Al powders through the thin and rough interfacial layers present at the Ni/Al interface. These results clearly indicate that nano-sized Ni film introduced instead of surface oxide acts as a very profitable layer to achieve efficient combustion behaviors by a rapid oxidation of Al powders.

Palladium coated porous anodic alumina membranes for gas reforming processes

NASA Astrophysics Data System (ADS)

Wu, Jeremy P.; Brown, Ian W. M.; Bowden, Mark E.; Kemmitt, Timothy

2010-11-01

Nanostructured ceramic membranes with ultrathin coatings of palladium metal have been demonstrated to separate hydrogen gas from a gas mixture containing nitrogen with 10% carbon dioxide and 10% hydrogen at temperatures up to 550 °C. The mechanically robust and thermally durable membranes were fabricated using a combination of conventional and high-efficiency anodisation processes on high purity aluminium foils. A pH-neutral plating solution has also been developed to enable electroless deposition of palladium metal on templates which were normally prone to chemical corrosion in strong acid or base environment. Activation and thus seeding of palladium nuclei on the surface of the template were essential to ensure uniform and fast deposition, and the thickness of the metal film was controlled by time of deposition. The palladium coated membranes showed improved hydrogen selectivity with increased temperature as well as after prolonged exposure to hydrogen, demonstrating excellent potential for gas separation technologies.

Effect of Cu content on microstructure, mechanical and anti-fouling properties of TiSiN-Cu coating deposited by multi-arc ion plating

NASA Astrophysics Data System (ADS)

Bai, Xuebing; Li, Jinlong; Zhu, Lihui; Wang, Liping

2018-01-01

The copper-doped TiSiN coatings were deposited on 316L stainless steel by reactive co-sputtering in multi-arc ion plating. The surface morphology and structure of the coating were analyzed by scanning electron microcopies, X-ray diffraction and X-ray photoelectron spectroscopy. The hardness was tested using Nano-indentation. The influence of the copper content in the coatings on the structure and mechanical properties of TiSiN-Cu coatings was investigated. Antifouling behaviors of the coatings were evaluated by analyzing adhesion and propagation of P. tricornutum, N. closterium, and Chlorella sp. The TiSiN-Cu coatings had a unique structure of amorphous Si3N4 and nanocrystalline nc-TiN/nc-Cu. The Cu-TiSiN coatings can inhibit effectively attachment and colonization of the algae on the surface. When the copper content increases from 6.75 at.% to 25.15 at.%, the coatings show an obvious decrease in hardness, significantly increase in the surface roughness and greatly weaken in antifouling properties. When the copper content is 6.75 at.%, the coating has the highest hardness with 30 GPa, and the best reduction ratio with 89%, 93% and 57% attachment of P. triceratium, N. closterium and Chlorella sp., respectively. The TiSiN-Cu coating with a copper dosage of 6.75 at.% has the excellent mechanical properties and capability of killing effectively microalgae.

Fundamental studies of tin whiskering in microelectronics finishes

NASA Astrophysics Data System (ADS)

Pinol, Lesly Agnes

Common electronics materials, such as tin, copper, steel, and brass, are ambient reactive under common use conditions, and as such are prone to corrosion. During the early 1940s, reports of failures due to electrical shorting of components caused by 'whisker' (i.e., filamentary surface protrusion) growth on many surface types---including the aforementioned metals---began to emerge. Lead alloying of tin (3--10% by weight, typically in the eutectic proportion) eliminated whiskering risk for decades, until the July 2006 adoption of the Restriction of Hazardous Substances (RoHS) directive was issued by the European Union. This directive, which has since been adopted by California and parts of China, severely restricted the use of lead (<1000 ppm) in all electrical and electronics equipment being placed on the EU market, imposing the need for developing reliable new "lead-free" alternatives to SnPb. In spite of the abundance of modern-day anecdotes chronicling whisker-related failures in satellites, nuclear power stations, missiles, pacemakers, and spacecraft navigation equipment, pure tin finishes are still increasingly being employed today, and the root cause(s) of tin whiskering remains elusive. This work describes a series of structured experiments exploring the fundamental relationships between the incidence of tin whiskering (as dependent variable) and numerous independent variables. These variables included deposition method (electroplating, electroless plating, template-based electrochemical synthesis, and various physical vapor deposition techniques, including resistive evaporation, electron beam evaporation, and sputtering), the inclusion of microparticles and organic contamination, the effects of sample geometry, and nanostructuring. Key findings pertain to correlations between sample geometry and whisker propensity, and also to the stress evolution across a series of 4"-diameter silicon wafers of varying thicknesses with respect to the degree of post-metallization whiskering. Regarding sample geometry, it was found that smaller, thinner substrates displayed a more rapid onset of whiskering immediately following metallization. Changes in wafer-level stress were not found to correlate with whiskering morphology (number, density, length) after 6 weeks of aging. This result points either to the irrelevance of macrostress in the substrate/film composite, or to a difference in whiskering mechanism for rigid substrates (whose stress gradient over time is significant) when compared with thinner, flexible substrates (whose stress is less variable with time). Organic contamination was found to have no appreciable effect when explicitly introduced. Furthermore, electron-beam evaporated films whiskered more readily than films deposited via electroplating from baths containing organic "brighteners." Beyond such findings, novel in themselves, our work is also unique in that we emphasize the "clean" deposition of tin (with chromium adhesion layers and copper underlayers) by vacuum-based physical vapor deposition, to circumvent the question of contamination entirely. By employing silicon substrates exclusively, we have distinguished ourselves from other works (which, for example, use copper coupons fabricated from rolled shim stock) because we have better sample-to-sample consistency in terms of material properties, machinability, and orientation.

Catalyst surfaces for the chromous/chromic redox couple

NASA Technical Reports Server (NTRS)

Giner, J. D.; Cahill, K. J. (Inventor)

1981-01-01

An electricity producing cell of the reduction-oxidation (REDOX) type divided into two compartments by a membrane is disclosed. A ferrous/ferric couple in a chloride solution serves as a cathode fluid to produce a positive electric potential. A chromic/chromous couple in a chloride solution serves as an anode fluid to produce a negative potential. The electrode is an electrically conductive, inert material plated with copper, silver or gold. A thin layer of lead plates onto the copper, silver or gold layer when the cell is being charged, the lead ions being available from lead chloride which has been added to the anode fluid. If the REDOX cell is then discharged, the lead deplates from the negative electrode and the metal coating on the electrode acts as a catalyst to increase current density.

Geiger Counter Technique

DTIC Science & Technology

1942-01-01

ONLY; ADMINISTRATIVE/OPERATIONAL USE; 03 MAR 1999. OTHER REQUESTS SHALL BE REFERRED THROUGH COMMANDING OFFICER, NAVAL RESEARCH LAB , WASHINGTON, DC 20375...Used as Glow Tube Voltage + " -- -+a...... .-..... . .... . . . . . .. . . Plate 41. Tar of aCotrolust Voltaep with Gas Pressure lab A-gtarator of’ Plate...construation cf vapor comatera. Acst Lay metal wll menru as cathode aterial, but oxidiste copper Lad bras han given beest res-ts. fe ride choice of

Dynamic High-Pressure Behavior of Hierarchical Heterogeneous Geological Materials

DTIC Science & Technology

2016-04-01

sandwiched between two 25µm FEP copolymer layers attached to the copper driver plate . The total package thickness with thin-film epoxy on all bonding...public release. 3 OUTLINE Page # ABSTRACT 2 1. BACKGROUND 4 2. CHARACTERISTICS OF SAND INVESTIGATED 8 3. PLATE ...constituents, phases, inter-phase boundaries ; distributions in shock states; as well as the structural evolutions which can result in strain

Manipulator having thermally conductive rotary joint for transferring heat from a test specimen

DOEpatents

Haney, S.J.; Stulen, R.H.; Toly, N.F.

1983-05-03

A manipulator for rotatably moving a test specimen in an ultra-high vacuum chamber includes a translational unit movable in three mutually perpendicular directions. A manipulator frame is rigidly secured to the translational unit for rotatably supporting a rotary shaft. A first copper disc is rigidly secured to an end of the rotary shaft for rotary movement within the vacuum chamber. A second copper disc is supported upon the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. The second disc receives a cryogenic cold head and does not rotate with the first disc. A sapphire plate is interposed between the first and second discs to prevent galling of the copper material while maintaining high thermal conductivity between the first and second discs. A spring is disposed on the shaft to urge the second disc toward the first disc and compressingly engage the interposed sapphire plate. A specimen mount is secured to the first disc for rotation within the vacuum chamber. The specimen maintains high thermal conductivity with the second disc receiving the cryogenic transfer line.

Characterization and control of the microbial community affiliated with copper or aluminum heat exchangers of HVAC systems.

PubMed

Schmidt, Michael G; Attaway, Hubert H; Terzieva, Silva; Marshall, Anna; Steed, Lisa L; Salzberg, Deborah; Hamoodi, Hameed A; Khan, Jamil A; Feigley, Charles E; Michels, Harold T

2012-08-01

Microbial growth in heating ventilation and air-conditioning (HVAC) systems with the subsequent contamination of indoor air is of increasing concern. Microbes and the subsequent biofilms grow easily within heat exchangers. A comparative study where heat exchangers fabricated from antimicrobial copper were evaluated for their ability to limit microbial growth was conducted using a full-scale HVAC system under conditions of normal flow rates using single-pass outside air. Resident bacterial and fungal populations were quantitatively assessed by removing triplicate sets of coupons from each exchanger commencing the fourth week after their installation for the next 30 weeks. The intrinsic biofilm associated with each coupon was extracted and characterized using selective and differential media. The predominant organisms isolated from aluminum exchangers were species of Methylobacterium of which at least three colony morphologies and 11 distinct PFGE patterns we found; of the few bacteria isolated from the copper exchangers, the majority were species of Bacillus. The concentrations and type of bacteria recovered from the control, aluminum, exchangers were found to be dependent on the type of plating media used and were 11,411-47,257 CFU cm(-2) per coupon surface. The concentration of fungi was found to average 378 CFU cm(-2). Significantly lower concentrations of bacteria, 3 CFU cm(-2), and fungi, 1 CFU cm(-2), were recovered from copper exchangers regardless of the plating media used. Commonly used aluminum heat exchangers developed stable, mixed, bacterial/fungal biofilms in excess of 47,000 organisms per cm(2) within 4 weeks of operation, whereas the antimicrobial properties of metallic copper were able to limit the microbial load affiliated with the copper heat exchangers to levels 99.97 % lower during the same time period.

High Sensitivity and High Detection Specificity of Gold-Nanoparticle-Grafted Nanostructured Silicon Mass Spectrometry for Glucose Analysis.

PubMed

Tsao, Chia-Wen; Yang, Zhi-Jie

2015-10-14

Desorption/ionization on silicon (DIOS) is a high-performance matrix-free mass spectrometry (MS) analysis method that involves using silicon nanostructures as a matrix for MS desorption/ionization. In this study, gold nanoparticles grafted onto a nanostructured silicon (AuNPs-nSi) surface were demonstrated as a DIOS-MS analysis approach with high sensitivity and high detection specificity for glucose detection. A glucose sample deposited on the AuNPs-nSi surface was directly catalyzed to negatively charged gluconic acid molecules on a single AuNPs-nSi chip for MS analysis. The AuNPs-nSi surface was fabricated using two electroless deposition steps and one electroless etching step. The effects of the electroless fabrication parameters on the glucose detection efficiency were evaluated. Practical application of AuNPs-nSi MS glucose analysis in urine samples was also demonstrated in this study.

"Electroless" E-Coating for Magnesium Alloys

NASA Astrophysics Data System (ADS)

Song, Guang-Ling

By utilizing the unique electrochemistry of Mg, a thin organic film can rapidly be deposited on the surface of a Mg alloy by dipping the Mg alloy in a cathodic E-coating bath solution without applying a current or potential. The self-deposited coating is selectively formed on Mg alloy surfaces. Although the "electroless" E-coating pre-film is relatively thin, it can offer sufficient corrosion protection for Mg alloys in a chloride-containing environment. The stability of the film can be significantly improved after curing. The corrosion resistance of the substrate Mg alloy has an important effect on the corrosion protection performance of the coating. The coating is more protective on a corrosion resistant Mg alloy than on a non-corrosion resistant Mg substrate. The coating protection performance is also influenced by the substrate surface condition or pre-treatment process. Wet cleaning + heat-treatment may be a cost-effective surface preparation/treatment for the "electroless" E-coating in industrial applications.

Optical substrate materials for synchrotron radiation beamlines

DOE Office of Scientific and Technical Information (OSTI.GOV)

Howells, M.R.; Paquin, R.A.

1997-06-01

The authors consider the materials choices available for making optical substrates for synchrotron radiation beam lines. They find that currently the optical surfaces can only be polished to the required finish in fused silica and other glasses, silicon, CVD silicon carbide, electroless nickel and 17-4 PH stainless steel. Substrates must therefore be made of one of these materials or of a metal that can be coated with electroless nickel. In the context of material choices for mirrors they explore the issues of dimensional stability, polishing, bending, cooling, and manufacturing strategy. They conclude that metals are best from an engineering andmore » cost standpoint while the ceramics are best from a polishing standpoint. They then give discussions of specific materials as follows: silicon carbide, silicon, electroless nickel, Glidcop{trademark}, aluminum, precipitation-hardening stainless steel, mild steel, invar and superinvar. Finally they summarize conclusions and propose ideas for further research.« less

Development of high performance electroless Ni-P-HNT composite coatings

NASA Astrophysics Data System (ADS)

Ranganatha, S.; Venkatesha, T. V.; Vathsala, K.

2012-12-01

Halloysite nanotubes (HNTs) of the dimension 50 nm × 1-3 μm (diameter × length) are utililized to fabricate the alloy composite by employing electroless/autocatalytic deposition technique. Electroless Ni-P-HNT binary alloy composite coatings are prepared successfully on low carbon steel. These nanotubes were made to get inserted/incorporated into nickel matrix and corresponding composites are examined for their electrochemical, mechanical and tribological performances and compared with that of plain Ni-P. The coatings were characterized using scanning electron microscopy (SEM) and Energy dispersive X-ray analysis (EDX) techniques to analyze surface nature and composition correspondingly. Small amount of incorporated HNTs made Ni-P deposits appreciable enhancement and betterment in corrosion resistance, hardness and friction resistance. This drastic improvement in the properties reflects the effect of addition of HNTs into Ni-P matrix leading to the development of high performance Ni-P-HNT composite coatings.

Archeological Testing at Two Sites Near White Castle, Iberville Parish, Louisiana: 16 IV 147 and 16 IV 149

DTIC Science & Technology

1988-07-26

McIntire (1958: Plate 13) reported on work conducted at the Clara Murray Site (16 IV 12), also located just north of the town of Bayou Goula. Two...as early as 1750, but it only was applied as over-glaze decoration until post- 1760. This process started with a design engraved on copper plating ...Once the plate was covered with paint, tissue paper was placed over it, transferring the design to the paper, which in turn was transferred to the

Installation Restoration Program. Phase 1: Records Search, Williams AFB, Arizona

DTIC Science & Technology

1984-02-01

Minimum 4.5 Trace substances, maximum -. allowable limits, (mg/1) Arsenic 2.00 Boron 1.00 Cadmium 0.05 Chromium (hexavalent and trivalent ) 1.00 Copper...located in Building 32. Chromium , cadmium, and copper electroplating operations were conducted in a temporary building, T-31 . Paint stripping was... chromium plating wastes. The paint separator receives wastes from paint stri.pping operations that are performed in Buildings 25 and 1086. It also

46 CFR 182.440 - Independent fuel tanks.

Code of Federal Regulations, 2012 CFR

2012-10-01

...(150 gal) tanks Over 570 liter(150 gal) 2 tanks Nickel-copper B 127, hot rolled sheet or plate 0.94 (0.037) [USSG 20] 3 1.27 (0.050) [USSG 18] 2.72 (0.107) [USSG 12]. Copper-nickel 4 B 122, UNS alloy... C65100 and C65500 1.29 (0.051) [AWG 16] 1.63 (0.064) [AWG 14] 3.66 (0.144) [AWG 7]. Steel or iron 5,6 1...

46 CFR 182.440 - Independent fuel tanks.

Code of Federal Regulations, 2011 CFR

2011-10-01

...(150 gal) tanks Over 570 liter(150 gal) 2 tanks Nickel-copper B 127, hot rolled sheet or plate 0.94 (0.037) [USSG 20] 3 1.27 (0.050) [USSG 18] 2.72 (0.107) [USSG 12]. Copper-nickel 4 B 122, UNS alloy... C65100 and C65500 1.29 (0.051) [AWG 16] 1.63 (0.064) [AWG 14] 3.66 (0.144) [AWG 7]. Steel or iron 5,6 1...

Templated synthesis of cyclic [4]rotaxanes consisting of two stiff rods threaded through two bis-macrocycles with a large and rigid central plate as spacer.

PubMed

Collin, Jean-Paul; Durola, Fabien; Frey, Julien; Heitz, Valérie; Reviriego, Felipe; Sauvage, Jean-Pierre; Trolez, Yann; Rissanen, Kari

2010-05-19

Two related cyclic [4]rotaxanes consisting of double macrocycles and rigid rods incorporating two bidentate chelates have each been prepared in high yield. The first step is a multigathering and threading reaction driven by coordination of two different bidentate chelates (part of either the rings or the rods) to each copper(I) center so as to afford the desired precursor. In both cases, the assembly step is done under very mild conditions, and it is quantitative. The second key reaction is the stopper-attaching reaction, based on click chemistry. Even if the quadruple stoppering reaction is not quantitative, it is relatively high-yielding (60% and 95%), and the copper-driven assembly process is carried out at room temperature without any aggressive reagent. The final copper-complexed [4]rotaxanes obtained contain two aromatic plates roughly parallel to one another located at the center of each bis-macrocycle. In the most promising case in terms of host-guest properties, the plates are zinc(II) porphyrins of the tetra-aryl series. The compounds have been fully characterized by various spectroscopic techniques ((1)H NMR, mass spectrometry, and electronic absorption spectroscopy). Unexpectedly, the copper-complexed porphyrinic [4]rotaxane could be crystallized as its 4PF(6)(-) salt to afford X-ray quality crystals. The structure obtained is in perfect agreement with the postulated chemical structure of the compound. It is particularly attractive in terms of symmetry and molecular aesthetics. The distance between the zinc atoms of the two porphyrins is 8.673 A, which is sufficient to allow insertion between the two porphyrinic plates of small ditopic basic substrates able to interact with the central porphyrinic Zn atoms. This prediction has been confirmed by absorption spectroscopy measurements in the presence of various organic substrates. However, large substrates cannot be introduced in the corresponding recognition site and are thus complexed mostly in an exo fashion, being located outside the receptor cavity. Noteworthy, the stability constants of the 1:1 host-guest complexes are high (10(7) M(-1)).

Effect of сopper сoating on fibers made of aluminum alloy, titanium, and FeCrAl alloy on surface morphology and activity in CO oxidation

NASA Astrophysics Data System (ADS)

Lukiyanchuk, I. V.; Rudnev, V. S.; Serov, M. M.; Krit, B. L.; Lukiyanchuk, G. D.; Nedozorov, P. M.

2018-04-01

The catalytic activity of both copper fibers and copper-coated fibers of a diameter of 50-100 μm made of aluminum alloy, technical grade titanium, and FeCrAl alloy in CO oxidation has been estimated. Metal fibers have been fabricated by the method of pendant drop melt extraction (PDME). The fibers copper plating was carried out by chemical and electrochemical methods. The composition and structure of samples and coatings before and after catalytic tests have been characterized by the methods of scanning electron microscopy, energy-dispersive analysis, and X-ray fluorescence analysis. It has been shown that the catalytic activity of copper-coated fibers made of FeCrAl alloy in the reaction of CO oxidation is not inferior to that of copper fibers.

Microwave electromagnetic and absorption properties of SiO2/C core/shell composites plated with metal cobalt

NASA Astrophysics Data System (ADS)

Shen, Guozhu; Fang, Xumin; Wu, Hongyan; Wei, Hongyu; Li, Jingfa; Li, Kaipeng; Mei, Buqing; Xu, Yewen

2017-04-01

A facile method has been developed to fabricate magnetic core/shell SiO2/C/Co sub-microspheres via the pyrolysis of SiO2/PANI (polyaniline) and electroless plating method. The electromagnetic parameters of these SiO2/C and SiO2/C/Co composites were measured and the microwave reflection loss properties were evaluated in the frequency range of 2-18 GHz. The results show that the dielectric loss of SiO2/C composite increases with the increase of carbonization temperature and the magnetic loss enhances due to the deposition of cobalt on the SiO2/C sub-microspheres. The reflection loss results exhibit that the microwave absorption properties of the SiO2/C/Co composites are more excellent than those of SiO2/C composites for each thickness. The maximum effective absorption bandwidth (reflection loss ≤ -10 dB) arrives at 5.0 GHz (13.0-18 GHz) for SiO2/C/Co composite with 1.5 mm of thickness and the minimum reflection loss value is -24.0 dB at 5.0 GHz with 4.0 mm of thickness. The microwave loss mechanism of the SiO2/C/Co composites was also discussed in this paper.

Laser Direct Writing and Selective Metallization of Metallic Circuits for Integrated Wireless Devices.

PubMed

Cai, Jinguang; Lv, Chao; Watanabe, Akira

2018-01-10

Portable and wearable devices have attracted wide research attention due to their intimate relations with human daily life. As basic structures in the devices, the preparation of high-conductive metallic circuits or micro-circuits on flexible substrates should be facile, cost-effective, and easily integrated with other electronic units. In this work, high-conductive carbon/Ni composite structures were prepared by using a facile laser direct writing method, followed by an electroless Ni plating process, which exhibit a 3-order lower sheet resistance of less than 0.1 ohm/sq compared to original structures before plating, showing the potential for practical use. The carbon/Ni composite structures exhibited a certain flexibility and excellent anti-scratch property due to the tight deposition of Ni layers on carbon surfaces. On the basis of this approach, a wireless charging and storage device on a polyimide film was demonstrated by integrating an outer rectangle carbon/Ni composite coil for harvesting electromagnetic waves and an inner carbon micro-supercapacitor for energy storage, which can be fast charged wirelessly by a commercial wireless charger. Furthermore, a near-field communication (NFC) tag was prepared by combining a carbon/Ni composite coil for harvesting signals and a commercial IC chip for data storage, which can be used as an NFC tag for practical application.

The Myszkow porphyry copper-molybdenum deposit, Poland

USGS Publications Warehouse

Chaffee, M.A.; Eppinger, R.G.; Lason, K.; Slosarz, J.; Podemski, M.

1994-01-01

The porphyry copper-molybdenum deposit at Myszkow, south-central Poland, lies in the Cracow-Silesian orogenic belt, in the vicinity of a Paleozoic boundary between two tectonic plates. The deposit is hosted in a complex that includes early Paleozoic metasedimentary rocks intruded in the late Paleozoic by a predominantly granodioritic pluton. This deposit exhibits many features that are typical of porphyry copper deposits associated with calc-alkaline intrusive rocks, including ore- and alteration-mineral suites, zoning of ore and alteration minerals, fluid-inclusion chemistry, tectonic setting, and structural style of veining. Unusual features of the Myszkow deposit include high concentrations of tungsten and the late Paleozoic (Variscan) age. -Authors

A Flexible Alignment Fixture for the Fabrication of Replication Mandrels

NASA Technical Reports Server (NTRS)

Cuttino, James F.; Todd, Michael W.

1996-01-01

NASA uses precision diamond turning technology to fabricate replication mandrels for its X-ray Calibration Facility (XRCF) optics. The XRCF optics are tubular, and the internal surface contains a parabolic profile over the first section and a hyperbolic profile over the last. The optic is fabricated by depositing layers of gold and nickel on to the replication mandrel and then separating it from the mandrel. Since the mandrel serves as a replication form, it must contain the inverse image of the surface. The difficulty in aligning the mandrel comes from the fabrication steps which it undergoes. The mandrel is rough machined and heat treated prior to diamond turning. After diamond turning, silicon rubber separators which are undercut in radius by 3 mm (0.12 in.) are inserted between the two end caps of the mandrel to allow the plating to wrap around the ends (to prevent flaking). The mandrel is then plated with a nickel-phosphor alloy using an electroless nickel process. At this point, the separators are removed and the mandrel is reassembled for the final cut on the DTM. The mandrel is measured for profile and finish, and polished to achieve an acceptable surface finish. Wrapping the plating around the edges helps to prevent flaking, but it also destroys the alignment surfaces between the parts of the mandrel that insure that the axes of the parts are coincident. Several mandrels have been realigned by trial-and-error methods, consuming significant amounts of setup time. When the mandrel studied in this paper was reassembled, multiple efforts resulted in a minimum radial error motion of 100 microns. Since 50 microns of nickel plating was to be removed, and a minimum plating thickness of 25 microns was to remain on the part, the radial error motion had to be reduced to less than 25 microns. The mandrel was therefore not usable in its current state.

Cantilever testing of sintered-silver interconnects

DOE PAGES

Wereszczak, Andrew A.; Chen, Branndon R.; Jadaan, Osama M.; ...

2017-10-19

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimationsmore » of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.« less

Cantilever testing of sintered-silver interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wereszczak, Andrew A.; Chen, Branndon R.; Jadaan, Osama M.

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimationsmore » of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.« less

Effect of Current Density and Plating Time on Cu Electroplating in TSV and Low Alpha Solder Bumping

NASA Astrophysics Data System (ADS)

Jung, Do-Hyun; Sharma, Ashutosh; Kim, Keong-Heum; Choo, Yong-Chul; Jung, Jae-Pil

2015-03-01

In this study, copper filling in through-silicon via (TSV) by pulse periodic reverse electroplating and low alpha solder bumping on Cu-filled TSVs was investigated. The via diameter and depth of TSV were 60 and 120 µm, respectively. The experimental results indicated that the thickness of electrodeposited copper layer increased with increasing cathodic current density and plating time. The electroplated Cu in TSV showed a typical bottom-up filling. A defectless, complete, and fast 100% Cu-filled TSV was achieved at cathodic and anodic current densities of -8 and 16 mA/cm2 for a plating time of 4 h, respectively. A sound low alpha solder ball, Sn-1.0 wt.% Ag-0.5 wt.% Cu (SAC 105) with a diameter of 83 µm and height of 66 µm was reflow processed at 245 °C on Cu-filled TSV. The Cu/solder joint interface was subjected to high temperature aging at 85 °C for 150 h, which showed an excellent bonding characteristic with minimum Cu-Sn intermetallic compounds growth.

Standard performance tests of collectors of solar thermal energy: A selectively coated, flat-plate copper collector with one transparent cover and a tube-to-tube spacing of 3-7/8 inches

NASA Technical Reports Server (NTRS)

1976-01-01

Basic test results are given of a flat-plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes, and coolant flow rates. Collector efficiency is correlated in terms of inlet temperature and flux level.

The Impact of Morphology and Composition on the Resistivity and Oxidation Resistance of Metal Nanostructure Films

NASA Astrophysics Data System (ADS)

Stewart, Ian Edward

Printed electronics, including transparent conductors, currently rely on expensive materials to generate high conductivity devices. Conductive inks for thick film applications utilizing inkjet, aerosol, and screen printing technologies are often comprised of expensive and rare silver particles. Thin film applications such as organic light emitting diodes (OLEDs) and organic photovoltaics (OPVs) predominantly employ indium tin oxide (ITO) as the transparent conductive layer which requires expensive and wasteful vapor deposition techniques. Thus an alternative to silver and ITO with similar performance in printed electronics warrants considerable attention. Copper nanomaterials, being orders of magnitude cheaper and more abundant than silver or indium, solution-coatable, and exhibiting a bulk conductivity only 6 % less than silver, have emerged as a promising candidate for incorporation in printed electronics. First, we examine the effect of nanomaterial shape on the conductivity of thick films. The inks used in such films often require annealing at elevated temperature in order to sinter the silver nanoparticles together and obtain low resistivities. We explore the change in morphology and resistivity that occurs upon heating thick films of silver nanowires (of two different lengths, Ag NWs), nanoparticles (Ag NPs), and microflakes (Ag MFs) deposited from water at temperatures between 70 and 400 °C. At the lowest temperatures, longer Ag NWs exhibited the lowest resistivity (1.8 x 10-5 O cm), suggesting that the resistivity of thick films of silver nanostructures is dominated by the contact resistance between particles. This result supported previous research showing that junction resistance between Ag NWs in thin film conductors also dominates optoelectronic performance. Since the goal is to replace silver with copper, we perform a similar analysis by using a pseudo-2D rod network modeling approach that has been modified to include lognormal distributions in length that more closely reflect experimental data collected from the nanowire transparent conductors. In our analysis, we find that Cu NW-based transparent conductors are capable of achieving comparable electrical performance to Ag NW transparent conductors with similar dimensions. We also synthesize high aspect ratio Cu NWs (as high as 5700 in an aqueous based synthesis taking less than 30 minutes) and show that this increase in aspect ratio can result results in transparent conducting films with a transmittance >95% at a sheet resistance <100 O sq-1, optoelectronic properties similar to that for ITO. Two of the major barriers preventing the further use of Cu NWs in printed electronics are the necessity to anneal the nanowires under H2 at higher temperatures and copper's susceptibility to oxidation. The former issue is solved by removing the insulating oxide along the Cu NWs with acetic acid and pressing the nanowires together to make H2 annealing obsolete. Finally, several methods of preventing copper oxidation in the context of transparent conductors were successfully developed such as electroplating zinc, tin, and indium and electrolessly plating benzotriazole (BTAH), nickel, silver, gold, and platinum. While all of the shells lessened or prevented oxidation both in dry and humid conditions, it was found that a thin layer of silver confers identical optoelectronic properties to the Cu NWs as pure Ag NWs. These results are expected provide motivation to replace pure silver and ITO in printed electronics.

High-speed off-axis holographic cinematography with a copper-vapor-pumped dye laser.

PubMed

Lauterborn, W; Judt, A; Schmitz, E

1993-01-01

A series of coherent light pulses is generated by pumping a dye laser with the pulsed output of a copper-vapor laser at rates of as much as 20 kHz. Holograms are recorded at this pulse rate on a rotating holographic plate. This technique of high-speed holographic cinematography is demonstrated by viewing the bubble filaments that appear in water under the action of a sound field of high intensity.

Deposit formation and heat transfer in hydrocarbon rocket fuels

NASA Technical Reports Server (NTRS)

Giovanetti, A. J.; Spadaccini, L. J.; Szetela, E. J.

1983-01-01

An experimental research program was undertaken to investigate the thermal stability and heat transfer characteristics of several hydrocarbon fuels under conditions that simulate high-pressure, rocket engine cooling systems. The rates of carbon deposition in heated copper and nickel-plated copper tubes were determined for RP-1, propane, and natural gas using a continuous flow test apparatus which permitted independent variation and evaluation of the effect on deposit formation of wall temperature, fuel pressure, and fuel velocity. In addition, the effects of fuel additives and contaminants, cryogenic fuel temperatures, and extended duration testing with intermittent operation were examined. Parametric tests to map the thermal stability characteristics of RP-1, commercial-grade propane, and natural gas were conducted at pressures of 6.9 to 13.8 MPa, bulk fuel velocities of 30 to 90 m/s, and tube wall temperatures in the range of 230 to 810 K. Also, tests were run in which propane and natural gas fuels were chilled to 230 and 160 K, respectively. Corrosion of the copper tube surface was detected for all fuels tested. Plating the inside of the copper tubes with nickel reduced deposit formation and eliminated tube corrosion in most cases. The lowest rates of carbon deposition were obtained for natural gas, and the highest rates were obtained for propane. For all fuels tested, the forced-convection heat transfer film coefficients were satisfactorily correlated using a Nusselt-Reynolds-Prandtl number equation.

Analysis of metals with luster: Roman brass and silver

NASA Astrophysics Data System (ADS)

Fajfar, H.; Rupnik, Z.; Šmit, Ž.

2015-11-01

Non-destructive PIXE analysis using in-air proton beam was used for the studies of earliest brass coins issued during the 1st century BC by Greek cities in Asia Minor, Romans and Celts, and for the studies of plated low grade silver coins of the 3rd century AD. The analysis determined the levels of zinc and important trace elements, notably selenium, which confirms spread of selenium-marked copper from the east. For plating, combined tinning and silvering was identified by the mapping technique for the mid 3rd century AD, which evolved into mere plating by 270 AD.

The design and evaluation of superconducting connectors

NASA Technical Reports Server (NTRS)

Payne, J. E.

1982-01-01

The development of a superconducting connector for superconducting circuits on space flights is described. It is proposed that such connectors be used between the superconducting readout loop and the SQUID magnetometer in the Gravity Probe B experiment. Two types of connectors were developed. One type employs gold plated niobium wires making pressure connections to gold plated niobium pads. Lead-plated beryllium-copper spring contacts can replace the niobium wires. The other type is a rigid solder or weld connection between the niobium wires and the niobium pads. A description of the methods used to produce these connectors is given and their performance analyzed.

Development of Low-Carbon, Copper-Strengthened HSLA Steel Plate for Naval Ship Construction

DTIC Science & Technology

1990-06-01

steel plate microstructures, 2% nital etch . ...................................................... 13 2. Charpy V-notch impact energy transition for...met a minimum yield strength requirement of 80 ksi yield strength through 3/4 inch gage, had high Charpy V-notch impact energy at low tempera- tures...tempered HSLA line-pipe steels, which typically could not meet the minimum Charpy V-notch impact toughness requirement of 35 ft-lb at -1 200 F. In 1984

Standardized performance tests of collectors of solar thermal energy: A selectively coated, flat-plate copper collector with one transparent cover and a tube-to-tube spacing of 5 5/8 inches

NASA Technical Reports Server (NTRS)

1976-01-01

This preliminary data report gives basic test results of a flat-plate solar collector whose performance was determined in the NASA-Lewis solar simulator. The collector was tested over ranges of inlet temperatures, fluxes and coolant flow rates. Collector efficiency is correlated in terms of inlet temperature and flux level.

Fire Resistance Testing of Bulkhead and Deck Penetrations. Phase 2

DTIC Science & Technology

1988-12-01

thick steel plate. All sample 12 construction was representative of Class A-0 construction. The UL staff secured insulation ( rockwool batts) to the...designated side of the steel plates and penetrants for testing as Class A-60 deck assemblies. The rockwool batts complied with the Class A-60...insulated with rockwool batts and tested for a Class A-60 rating. This group consisted of one steel penetration, eight copper penetrations, four PVC

Electroless silver coating of rod-like glass particles.

PubMed

Moon, Jee Hyun; Kim, Kyung Hwan; Choi, Hyung Wook; Lee, Sang Wha; Park, Sang Joon

2008-09-01

An electroless silver coating of rod-like glass particles was performed and silver glass composite powders were prepared to impart electrical conductivity to these non-conducting glass particles. The low density Ag-coated glass particles may be utilized for manufacturing conducting inorganic materials for electromagnetic interference (EMI) shielding applications and the techniques for controlling the uniform thickness of silver coating can be employed in preparation of biosensor materials. For the surface pretreatment, Sn sensitization was performed and the coating powders were characterized by scanning electron microscopy (SEM), focused ion beam microscopy (FIB), and atomic force microscopy (AFM) along with the surface resistant measurements. In particular, the use of FIB technique for determining directly the Ag-coating thickness was very effective on obtaining the optimum conditions for coating. The surface sensitization and initial silver loading for electroless silver coating could be found and the uniform and smooth silver-coated layer with thickness of 46 nm was prepared at 2 mol/l of Sn and 20% silver loading.

Quantification of metallic nanoparticle morphology with tilt series imaging by transmission electron microscopy

NASA Astrophysics Data System (ADS)

Dutta, Aniruddha; Yuan, Biao; Clukay, Christopher J.; Grabill, Christopher N.; Heinrich, Helge; Bhattacharya, Aniket; Kuebler, Stephen M.

2012-02-01

We report on the quantitative analysis of electrolessly deposited Au and Ag nanoparticles (NPs) on SU8 polymer with the help of High-Angle Annular Dark-Field Scanning Transmission Electron Microscopy (HAADF-STEM) in tilt series. Au NPs act as nucleating agents for the electroless deposition of silver. Au NPs were prepared by attachingAu^3+cations to amine functionalized SU8 polymeric surfaces and then reducing it with aqueous NaBH4. The nanoscale morphology of the deposited NPs on the surface of polymer has been studied from the dark field TEM cross sectional images. Ag NPs were deposited on the cross-linked polymeric surface from a silver citrate solution reduced by hydroquinone. HAADF-STEM enables us to determine the distances between the NPs and their exact locations at and near the surface. The particle distribution, sizes and densities provide us with the data necessary to control the parameters for the development of the electroless deposition technique for emerging nanoscale technologies.

Experimental investigations of tungsten inert gas assisted friction stir welding of pure copper plates

NASA Astrophysics Data System (ADS)

Constantin, M. A.; Boșneag, A.; Nitu, E.; Iordache, M.

2017-10-01

Welding copper and its alloys is usually difficult to join by conventional fusion welding processes because of high thermal diffusivity of the copper, alloying elements, necessity of using a shielding gas and a clean surface. To overcome this inconvenience, Friction Stir Welding (FSW), a solid state joining process that relies on frictional heating and plastic deformation, is used as a feasible welding process. In order to achieve an increased welding speed and a reduction in tool wear, this process is assisted by another one (WIG) which generates and adds heat to the process. The aim of this paper is to identify the influence of the additional heat on the process parameters and on the welding joint properties (distribution of the temperature, hardness and roughness). The research includes two experiments for the FSW process and one experiment for tungsten inert gas assisted FSW process. The outcomes of the investigation are compared and analysed for both welding variants. Adding a supplementary heat source, the plates are preheated and are obtain some advantages such as reduced forces used in process and FSW tool wear, faster and better plasticization of the material, increased welding speed and a proper weld quality.

DCT-TCI: Real Gas Characterization of Plasma Flow Control - An Integrated Approach

DTIC Science & Technology

2011-12-23

as Navier-Stokes equations are solved in this study. We utilize the two-species basic model to reduce the computational complexity of plasma...constant of 3.0. Copper tape was first adhered to both sides of a 3 mm thick acrylic plate. A negative photo-resist, a transparent film and a UV light...ferric chloride. The reminiscence of the adhesive glue left behind by the copper tape was removed using a solvent such as methanol or acetone. The

Detection of lack of fusion using opaque additives, phase 2

NASA Technical Reports Server (NTRS)

Cook, J. L.

1973-01-01

Plasma-sprayed copper coatings were developed to protect the aluminum surfaces of spacecraft structures from oxidation, as well as to provide a means of reliable nondestructive X-ray inspection of possible incomplete weldment penetration. Sixty day storage tests of coated aluminum samples indicated the promise of long-term oxidation protection, but revealed no advantage in detecting penetration defects. Delta-scan techniques were used, and peen plating as a means of applying copper to the aluminum surface was investigated.

Suppressing tin whisker growth in lead-free solders and platings

DOEpatents

Hoffman, Elizabeth N; Lam, Poh-Sang

2014-04-29

A process of irradiation Sn containing Pb-free solder to mitigate whisker formation and growth thereon is provided. The use of gamma radiation such as cobalt-60 has been applied to a substrate of Sn on copper has been found to change the morphology of the crystalline whisker growth to a more truncated hillock pattern. The change in morphology greatly reduces the tendency of whiskers to contribute to electrical short-circuits being used as a Pb-free solder system on a copper substrate.

Mechanical properties and microstructure of copper alloys and copper alloy-stainless steel laminates for fusion reactor high heat flux applications

NASA Astrophysics Data System (ADS)

Leedy, Kevin Daniel

A select group of copper alloys and bonded copper alloy-stainless steel panels are under consideration for heat sink applications in first wall and divertor structures of a planned thermonuclear fusion reactor. Because these materials must retain high strengths and withstand high heat fluxes, their material properties and microstructures must be well understood. Candidate copper alloys include precipitate strengthened CuNiBe and CuCrZr and dispersion strengthened Cu-Alsb2Osb3 (CuAl25). In this study, uniaxial mechanical fatigue tests were conducted on bulk copper alloy materials at temperatures up to 500sp°C in air and vacuum environments. Based on standardized mechanical properties measurement techniques, a series of tests were also implemented to characterize copper alloy-316L stainless steel joints produced by hot isostatic pressing or by explosive bonding. The correlation between mechanical properties and the microstructure of fatigued copper alloys and the interface of copper alloy-stainless steel laminates was examined. Commercial grades of these alloys were used to maintain a degree of standardization in the materials testing. The commercial alloys used were OMG Americas Glidcop CuAl25 and CuAl15; Brush Wellman Hycon 3HP and Trefimetaux CuNiBe; and Kabelmetal Elbrodur and Trefimetaux CuCrZr. CuAl25 and CuNiBe alloys possessed the best combination of fatigue resistance and microstructural stability. The CuAl25 alloy showed only minimal microstructural changes following fatigue while the CuNiBe alloy consistently exhibited the highest fatigue strength. Transmission electron microscopy observations revealed that small matrix grain sizes and high densities of submicron strengthening phases promoted homogeneous slip deformation in the copper alloys. Thus, highly organized fatigue dislocation structure formation, as commonly found in oxygen-free high conductivity Cu, was inhibited. A solid plate of CuAl25 alloy hot isostatically pressed to a 316L stainless steel plate showed the best overall mechanical properties of the studied bi-metallic bonded panels. Bond properties were nominally inferior to constituent bulk material properties and fracture toughness values, in particular, were quite low for all bonded laminates. Delamination near the copper alloy-stainless steel interface was the dominate failure mode in the bi-metallic panels. The joining processes caused microstructural alterations in the bond interfacial regions including: microporosity, new precipitate formation, existing precipitate morphology changes and interdiffusion of constituent elements.

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper

DOE PAGES

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

2018-04-16

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

In this work, we combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State and estimated Gurney velocity at the tube wall. The test also provides an additional method to estimate reaction products Hugoniot through knowledge of the copper test cap. Our experiments and simulations are within expected uncertainty. Lastly, the test and the analysis effectively reducemore » costs while keeping or increasing fidelity.« less

Interfacial microstructure and properties of copper clad steel produced using friction stir welding versus gas metal arc welding

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shen, Z.; Chen, Y.; Haghshenas, M., E-mail: mhaghshe@uwaterloo.ca

A preliminary study compares the feasibility and microstructures of pure copper claddings produced on a pressure vessel A516 Gr. 70 steel plate, using friction stir welding versus gas metal arc welding. A combination of optical and scanning electron microscopy is used to characterize the grain structures in both the copper cladding and heat affected zone in the steel near the fusion line. The friction stir welding technique produces copper cladding with a grain size of around 25 μm, and no evidence of liquid copper penetration into the steel. The gas metal arc welding of copper cladding exhibits grain sizes overmore » 1 mm, and with surface microcracks as well as penetration of liquid copper up to 50 μm into the steel substrate. Transmission electron microscopy reveals that metallurgical bonding is produced in both processes. Increased diffusion of Mn and Si into the copper cladding occurs when using gas metal arc welding, although some nano-pores were detected in the FSW joint interface. - Highlights: • Cladding of steel with pure copper is possible using either FSW or GMAW. • The FSW yielded a finer grain structure in the copper, with no evidence of cracking. • The FSW joint contains some evidence of nano-pores at the interface of the steel/copper. • Copper cladding by GMAW contained surface cracks attributed to high thermal stresses. • The steel adjacent to the fusion line maintained a hardness value below 248 HV.« less

Studies on the reduction of radon plate-out

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bruemmer, M.; Nakib, M.; Calkins, R.

The decay of common radioactive gases, such as radon, produces stable isotopes by a sequence of daughter particles with varied half-lives. These daughter particles are a significant source of gamma, neutron, and alpha (α) particle backgrounds that can mimic desired signals in dark matter and neutrinoless double beta decay experiments. In the LUMINA Laboratory at Southern Methodist University (SMU), studies of radon plate-out onto copper samples are conducted using one of XIA’s first five UltraLo 1800 alpha counters. We present results from investigations into various mitigation approaches. A custom-built copper holder (in either plastic or metal) has been designed andmore » produced to maximize the copper’s exposure to {sup 220}Rn. The {sup 220}Rn source is a collection of camping lantern mantles. We present the current status of control and experimental methods for addressing radon exposure levels.« less

Three-dimensional atlas of iron, copper, and zinc in the mouse cerebrum and brainstem.

PubMed

Hare, Dominic J; Lee, Jason K; Beavis, Alison D; van Gramberg, Amanda; George, Jessica; Adlard, Paul A; Finkelstein, David I; Doble, Philip A

2012-05-01

Atlases depicting molecular and functional features of the brain are becoming an integral part of modern neuroscience. In this study we used laser ablation-inductively coupled plasma-mass spectrometry (LA-ICPMS) to quantitatively measure iron (Fe), copper (Cu), and zinc (Zn) levels in a serially sectioned C57BL/6 mouse brain (cerebrum and brainstem). Forty-six sections were analyzed in a single experiment of approximately 158 h in duration. We constructed a 46-plate reference atlas by aligning quantified images of metal distribution with corresponding coronal sections from the Allen Mouse Brain Reference Atlas. The 46 plates were also used to construct three-dimensional models of Fe, Cu, and Zn distribution. This atlas represents the first reconstruction of quantitative trace metal distribution through the brain by LA-ICPMS and will facilitate the study of trace metals in the brain and help to elucidate their role in neurobiology.

Aluminum and Other Coatings for the Passivation of Tritium Storage Vessels

DOE Office of Scientific and Technical Information (OSTI.GOV)

Spencer, W.; Korinko, P.

Using a highly sensitive residual gas analyzer, the off-gassing of hydrogen, water, and hydrocarbons from surface-treated storage vessels containing deuterium was measured. The experimental storage vessels were compared to a low-off-gassing, electro-polished 304L canister. Alternative vessels were made out of aluminum, or were coatings on 304L steel. Coatings included powder pack aluminide, electro-plated aluminum, powder pack chromide, dense electro-plated chromium, copper plated, and copper plated with 25 and 50 percent nano-diamond. Vessels were loaded with low pressure deuterium to observe exchange with protium or hydrogen as observed with formation of HD and HDO. Off gas of D 2O or possiblemore » CD 4 was observed at mass 20. The main off-gas in all of the studies was H 2. The studies indicated that coatings required significant post-coating treatment to reduce off-gas and enhance the permeation barrier from gases likely added during the coating process. Dense packed aluminum coatings needed heating to drive off water. Electro-plated aluminum, chromium and copper coatings appeared to trap hydrogen from the plating process. Nano-diamond appeared to enhance the exchange rate with hydrogen off gas, and its coating process trapped significant amounts of hydrogen. Aluminum caused more protium exchange than chromium-treated surfaces. Aluminum coatings released more water, but pure aluminum vessels released small amounts of hydrogen, little water, and generally performed well. Chromium coating had residual hydrogen that was difficult to totally outgas but otherwise gave low residuals for water and hydrocarbons. Our studies indicated that simple coating of as received 304L metal will not adequately block hydrogen. The base vessel needs to be carefully out-gassed before applying a coating, and the coating process will likely add additional hydrogen that must be removed. Initial simple bake-out and leak checks up to 350° C for a few hours was found to be inadequate. All of the studies indicated that vessels needed several days of vacuum baking at 350-450° C to fully outgas the residual gases, which were mostly hydrogen. The current standard practice of out-gassing from ultra-clean, electro-polished 304L vessels with both vacuum bake-out and followed by an oxidative bake out to enhance the chromium surface performed the best in these studies.« less

Cleaning and passivation of copper surfaces to remove surface radioactivity and prevent oxide formation

NASA Astrophysics Data System (ADS)

Hoppe, E. W.; Seifert, A.; Aalseth, C. E.; Bachelor, P. P.; Day, A. R.; Edwards, D. J.; Hossbach, T. W.; Litke, K. E.; McIntyre, J. I.; Miley, H. S.; Schulte, S. M.; Smart, J. E.; Warren, G. A.

2007-08-01

High-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. Many low-background experiments using high-purity copper have indicated surface contamination emerges as the dominant background. Radon daughters plate out on exposed surfaces, leaving a residual 210Pb background that is difficult to avoid. Dust is also a problem; even under cleanroom conditions, the amount of U and Th deposited on surfaces can represent the largest remaining background. To control these backgrounds, a copper cleaning chemistry has been developed. Designed to replace an effective, but overly aggressive concentrated nitric acid etch, this peroxide-based solution allows for a more controlled cleaning of surfaces. The acidified hydrogen peroxide solution will generally target the Cu +/Cu 2+ species which are the predominant surface participants, leaving the bulk of copper metal intact. This preserves the critical tolerances of parts and eliminates significant waste disposal issues. Accompanying passivation chemistry has also been developed that protects copper surfaces from oxidation. Using a high-activity polonium surface spike, the most difficult-to-remove daughter isotope of radon, the performance of these methods are quantified.

The interaction of copper ions with Staphylococcus aureus, Pseudomonas aeruginosa, and Escherichia coli: an X-ray absorption near-edge structure (XANES) spectroscopy study.

PubMed

Zanzen, Ulrike; Bovenkamp-Langlois, Lisa; Klysubun, Wantana; Hormes, Josef; Prange, Alexander

2018-04-01

The antimicrobial properties of copper ions have been known for a long time. However, the exact mechanism of action of the transition metal on microorganisms has long been unclear. X-ray absorption near-edge structure (XANES) spectroscopy at the Cu K edge allows the determination of copper speciation in Staphylococcus aureus, Escherichia coli, and Pseudomonas aeruginosa that have been treated with Cu(II) and Cu(I) solutions. The death/inactivation of the bacteria was observed using plate counting and light microscopy. The Cu K-XANES spectra of the two Gram-negative bacteria are different than those of the Gram-positive strain. The results clearly show that the Cu + -S bond contributes to the antibacterial activity of copper, as in the case of silver. The detailed evaluation of the differentiated absorption spectra shows that Cu + (not Cu 2+ ) is the dominant ion that binds to the bacteria. Because Cu + is not the most common copper ion, copper is not as effective an antibacterial agent as silver, whose common valency is actually + 1. Any reaction of copper with phosphorus from the bacteria can be excluded after the evaluation of the absorption spectra.

Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Kitiyakara, Amarit; Redick, Richard W., III; Sunada, Eric T.

2011-01-01

A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.

Self-organized synthesis of silver dendritic nanostructures via an electroless metal deposition method

NASA Astrophysics Data System (ADS)

Qiu, T.; Wu, X. L.; Mei, Y. F.; Chu, P. K.; Siu, G. G.

2005-09-01

Unique silver dendritic nanostructures, with stems, branches, and leaves, were synthesized with self-organization via a simple electroless metal deposition method in a conventional autoclave containing aqueous HF and AgNO3 solution. Their growth mechanisms are discussed in detail on the basis of a self-assembled localized microscopic electrochemical cell model. A process of diffusion-limited aggregation is suggested for the formation of the silver dendritic nanostructures. This nanostructured material is of great potential to be building blocks for assembling mini-functional devices of the next generation.

Rapid recovery of dilute copper from a simulated Cu-SDS solution with low-cost steel wool cathode reactor.

PubMed

Chang, Shih-Hsien; Wang, Kai-Sung; Hu, Pei-I; Lui, I-Chun

2009-04-30

Copper-surfactant wastewaters are often encountered in electroplating, printed circuit boards manufacturing, and metal finishing industries, as well as in retentates from micellar-enhanced ultrafiltration process. A low-cost three-dimensional steel wool cathode reactor was evaluated for electrolytic recovery of Cu ion from dilute copper solution (0.2mM) in the presence of sodium dodecyl sulfate (SDS), octylphenol poly (ethyleneglycol) 9.5 ether (TX), nonylphenol poly (oxyethylene) 9 ether (NP9) and polyoxyethylene (20) sorbitan monooleate (TW) and also mixed surfactants (anionic/nonionic). The reactor showed excellent copper recovery ability in comparison to a parallel-plate reactor. The reactor rapidly recovered copper with a reasonable current efficiency. 93% of copper was recovered at current density of 1 A m(-2) and pH 4 in the presence of 8.5mM SDS. Initial solution pH, cathodic current density, solution mixing condition, SDS concentration, and initial copper concentrations significantly influenced copper recovery. The copper recovery rate increased with an increase in aqueous SDS concentrations between 5 and 8.5mM. The influences of nonionic surfactants on Cu recovery from SDS-Cu solution depended not only on the type of surfactants used, but also on applied concentrations. From the copper recovery perspective, TX at 0.1mM or NP should be selected rather than TW, because they did not inhibit copper recovery from SDS-Cu solution.

Report on accelerated corrosion studies.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mowry, Curtis Dale; Glass, Sarah Jill; Sorensen, Neil Robert

2011-03-01

Sandia National Laboratories (SNL) conducted accelerated atmospheric corrosion testing for the U.S. Consumer Product Safety Commission (CPSC) to help further the understanding of the development of corrosion products on conductor materials in household electrical components exposed to environmental conditions representative of homes constructed with problem drywall. The conditions of the accelerated testing were chosen to produce corrosion product growth that would be consistent with long-term exposure to environments containing humidity and parts per billion (ppb) levels of hydrogen sulfide (H{sub 2}S) that are thought to have been the source of corrosion in electrical components from affected homes. This report documentsmore » the test set-up, monitoring of electrical performance of powered electrical components during the exposure, and the materials characterization conducted on wires, screws, and contact plates from selected electrical components. No degradation in electrical performance (measured via voltage drop) was measured during the course of the 8-week exposure, which was approximately equivalent to 40 years of exposure in a light industrial environment. Analyses show that corrosion products consisting of various phases of copper sulfide, copper sulfate, and copper oxide are found on exposed surfaces of the conductor materials including wires, screws, and contact plates. The morphology and the thickness of the corrosion products showed a range of character. In some of the copper wires that were observed, corrosion product had flaked or spalled off the surface, exposing fresh metal to the reaction with the contaminant gasses; however, there was no significant change in the wire cross-sectional area.« less

78 FR 7394 - Foreign-Trade Zone 41-Milwaukee, WI; Notification of Proposed Production Activity; CNH America...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-02-01

.... On its domestic sales, CNH would be able to choose the duty rates during customs entry procedures... hoses, copper alloy adapters, aluminum plates, feed filters, GPS kits including electrical connections...

Measurement of dew droplets in initial deposition at dew point by using a phase-shift interference microscope

NASA Astrophysics Data System (ADS)

Matsumoto, Shigeaki; Toyooka, Satoru; Hoshino, Mitsuo

2002-09-01

In order to measure the total mass per unit area of dew droplets deposited on a metal plate in the dew-point hygrometer, the shape of a dew droplet deposited on a copper plate was measured accurately by using an interference microscope that employed a phase-shift technique. The microscope was constructed by adding a piezoelectric transducer to an usual interference microscope. A simple method that uses a conventional speaker horn and an optical fiber cable was introduced to depress speckle noise. The shape of a dew droplet deposited on the copper plate surface with 0.1 μm in average roughness was measured with an accuracy of +/-3nm. The mass of a dew droplet could be calculated numerically from the volume of its shape and was of the order of 10-9 g. The total mass of dew droplets deposited per unit area and the deposition velocity were obtained under a gentle wind. The total mass was the order of 10-5 g/cm2 at the beginning of deposition and the deposition velocity was ranged from 2x10-6 to 6x10-5 g/cm2.min.

Indoor test for thermal performance evaluation of Lenox-Honeywell solar collector. [conducted using Marshall Space Flight Center Solar Simulator

NASA Technical Reports Server (NTRS)

Shih, K.

1977-01-01

The test procedures used and the test results obtained from an evaluation test program conducted on a double-covered liquid solar collector under simulated conditions are presented. The test article was a flat plate solar collector using liquid as the heat transfer medium. The absorber plate was steel with the copper tubes bonded on the upper surface. The plate was coated with black chrome with an absorptivity factor of .95 and emissivity factor of .12. A time constant test and incident angle modifier test were conducted to determine the transient effect and the incident angle effect on the collector.

Chemically assembled double-dot single-electron transistor analyzed by the orthodox model considering offset charge

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kano, Shinya; Maeda, Kosuke; Majima, Yutaka, E-mail: majima@msl.titech.ac.jp

2015-10-07

We present the analysis of chemically assembled double-dot single-electron transistors using orthodox model considering offset charges. First, we fabricate chemically assembled single-electron transistors (SETs) consisting of two Au nanoparticles between electroless Au-plated nanogap electrodes. Then, extraordinary stable Coulomb diamonds in the double-dot SETs are analyzed using the orthodox model, by considering offset charges on the respective quantum dots. We determine the equivalent circuit parameters from Coulomb diamonds and drain current vs. drain voltage curves of the SETs. The accuracies of the capacitances and offset charges on the quantum dots are within ±10%, and ±0.04e (where e is the elementary charge),more » respectively. The parameters can be explained by the geometrical structures of the SETs observed using scanning electron microscopy images. Using this approach, we are able to understand the spatial characteristics of the double quantum dots, such as the relative distance from the gate electrode and the conditions for adsorption between the nanogap electrodes.« less

Thin and Flexible Fe-Si-B/Ni-Cu-P Metallic Glass Multilayer Composites for Efficient Electromagnetic Interference Shielding.

PubMed

Zhang, Jijun; Li, Jiawei; Tan, Guoguo; Hu, Renchao; Wang, Junqiang; Chang, Chuntao; Wang, Xinmin

2017-12-06

Thin and flexible materials that can provide efficient electromagnetic interference (EMI) shielding are urgently needed, especially if they can be easily processed and withstand harsh environments. Herein, layer-structured Fe-Si-B/Ni-Cu-P metallic glass composites have been developed by simple electroless plating Ni-Cu-P coating on commercial Fe-Si-B metallic glasses. The 0.1 mm-thick composite shows EMI shielding effectiveness of 40 dB over the X-band frequency range, which is higher than those of traditional metals, metal oxides, and their polymer composites of larger thickness. Most of the applied electromagnetic waves are proved to be absorbed rather than bounced back. This performance originates from the combination of a superior soft magnetic property, excellent electrical conductivity, and multiple internal reflections from multilayer composites. In addition, the flexible composites also exhibit good corrosion resistance, high thermal stability, and excellent tensile strength, making them suitable for EMI shielding in harsh chemical or thermal environments.

Effects of electrode surface structure on the mechanoelectrical transduction of IPMC sensors

NASA Astrophysics Data System (ADS)

Palmre, Viljar; Pugal, David; Kim, Kwang

2014-03-01

This study investigates the effects of electrode surface structure on the mechanoelectrical transduction of IPMC sensors. A physics-based mechanoelectrical transduction model was developed that takes into account the electrode surface profile (shape) by describing the polymer-electrode interface as a Koch fractal structure. Based on the model, the electrode surface effects were experimentally investigated in case of IPMCs with Pd-Pt electrodes. IPMCs with different electrode surface structures were fabricated through electroless plating process by appropriately controlling the synthesis parameters and conditions. The changes in the electrode surface morphology and the corresponding effects on the IPMC mechanoelectrical transduction were examined. Our experimental results indicate that increasing the dispersion of Pd particles near the membrane surface, and thus the polymer-electrode interfacial area, leads to a higher peak mechanoelectrically induced voltage of IPMC. However, the overall effect of the electrode surface structure is relatively low compared to the electromechanical transduction, which is in good agreement with theoretical prediction.

Microchannel contacting of crystalline silicon solar cells

DOE PAGES

Bullock, James; Ota, Hiroki; Wang, Hanchen; ...

2017-08-22

There is tremendous interest in reducing losses caused by the metal contacts in silicon photovoltaics, particularly the optical and resistive losses of the front metal grid. One commonly sought-after goal is the creation of high aspect-ratio metal fingers which provide an optically narrow and low resistance pathway to the external circuit. Currently, the most widely used metal contact deposition techniques are limited to widths and aspect-ratios of ~40 μm and ~0.5, respectively. In this study, we introduce the use of a micropatterned polydimethylsiloxane encapsulation layer to form narrow (~20 μm) microchannels, with aspect-ratios up to 8, on the surface ofmore » solar cells. We demonstrate that low temperature metal pastes, electroless plating and atomic layer deposition can all be used within the microchannels. Further, we fabricate proof-of-concept structures including simple planar silicon heterojunction and homojunction solar cells. While preliminary in both design and efficiency, these results demonstrate the potential of this approach and its compatibility with current solar cell architectures.« less

Alternative technological development for RF hybridization

NASA Astrophysics Data System (ADS)

Antônio Finardi, Célio; da Fontoura Ponchet, André; Battesini Adamo, Cristina; Flacker, Alexander; Cotrin Teixeira, Ricardo; Panepucci, Roberto Ricardo

2017-03-01

The paper presents a technological solution for high frequency packaging platform evaluated up to 40 GHz. The main purpose of this development was to define an alternative hybrid technology that is more flexible and faster to prototype compared with thin film or multi chip module (MCM-D). The alternative technology also shows adequate performance for high bit rate solutions integrating optical and electronics blocks. This approach consists of a soft substrate (laminate material), plating processes (electroless Ni-P/Au, electrolytic Au) and lithography patterning. Ground coplanar waveguide was used for microwave structures with excellent ground planes connections due to easy via holes implementation. We present results of high frequency packaging of important RF blocks, such as integrated broadband bias-T, transimpedance amplifier ICs and silicon photonics optical modulators. The paper demonstrates a solution for high frequency hybridization that can be implemented with standard substrates, designed with any shape and with large numbers of metalized via holes and compatible with usual assembling techniques.

Microchannel contacting of crystalline silicon solar cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bullock, James; Ota, Hiroki; Wang, Hanchen

There is tremendous interest in reducing losses caused by the metal contacts in silicon photovoltaics, particularly the optical and resistive losses of the front metal grid. One commonly sought-after goal is the creation of high aspect-ratio metal fingers which provide an optically narrow and low resistance pathway to the external circuit. Currently, the most widely used metal contact deposition techniques are limited to widths and aspect-ratios of ~40 μm and ~0.5, respectively. In this study, we introduce the use of a micropatterned polydimethylsiloxane encapsulation layer to form narrow (~20 μm) microchannels, with aspect-ratios up to 8, on the surface ofmore » solar cells. We demonstrate that low temperature metal pastes, electroless plating and atomic layer deposition can all be used within the microchannels. Further, we fabricate proof-of-concept structures including simple planar silicon heterojunction and homojunction solar cells. While preliminary in both design and efficiency, these results demonstrate the potential of this approach and its compatibility with current solar cell architectures.« less

Pt-Bi decorated nanoporous gold for high performance direct glucose fuel cell

PubMed Central

Guo, Hong; Yin, Huiming; Yan, Xiuling; Shi, Shuai; Yu, Qingyang; Cao, Zhen; Li, Jian

2016-01-01

Binary PtBi decorated nanoporous gold (NPG-PtBi) electrocatalyst is specially designed and prepared for the anode in direct glucose fuel cells (DGFCs). By using electroless and electrochemical plating methods, a dense Pt layer and scattered Bi particles are sequentially coated on NPG. A simple DGFC with NPG-PtBi as anode and commercial Pt/C as cathode is constructed and operated to study the effect of operating temperatures and concentrations of glucose and NaOH. With an anode noble metal loading of only 0.45 mg cm−2 (Au 0.3 mg and Pt 0.15 mg), an open circuit voltage (OCV) of 0.9 V is obtained with a maximum power density of 8 mW cm−2. Furthermore, the maximum gravimetric power density of NPG-PtBi is 18 mW mg−1, about 4.5 times higher than that of commercial Pt/C. PMID:27966629

Surface structure and electrochemical characteristics of Ti-V-Cr bcc-type solid solution alloys sintered with Ni

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tsuji, Yoichiro; Yamamoto, Osamu; Matsuda, Hiromu

2000-07-01

Ti-V-Cr bcc-type solid solution alloys can absorb a large amount of hydrogen and be applied to active materials of the negative electrode in Ni-MH batteries. However, because of the insolubility of Ni into these alloys, the electrochemical characteristics like discharge capacity and cycle life were poor. In order to increase the discharge capacity of hydrogen absorbing alloy electrodes, Ti-V-Cr bcc-type alloy powders were sintered with Ni in order to form Ni contained surface layer on the alloy surface. As sintering temperature rose up, the surface composition changed from TiNi to Ti{sub 2}Ni. TiNi surface layer showed better electrochemical characteristics. Formore » the Ni adding method, Ni electroless plating was preferred because of good adhesion. As a result of optimized conditions, a discharge capacity of 570 mAh/g and an improvement of cycle life were achieved.« less

Characterization of SnO2/Ni/SiO2-MCP anode in three-dimensional lithium-ion battery

NASA Astrophysics Data System (ADS)

Lou, Xuefeng; Xu, Shaohui; Zhu, Yiping; Wang, Lianwei; Chu, Paul K.

2013-12-01

By combining a SnO2 thin film with silicon dioxide microchannel plate (SiO2-MCP), a three-dimensional (3D) structure with enough space to accommodate the volume change of SnO2 during charging-discharging is produced by MEMS and electroless deposition. Owing to the special structure of the MCP, the battery is able to deliver a reversible Li storage capacity of 408 mAhg-1 after 100 cycles. If the current density is reduced to 200 mAg-1 at a constant current during charging and discharging, the battery exhibits reversible capacities of 1575 and 996 mAhg-1 in the first discharging and charging cycle, respectively. However, a reversible Li-storage capacity of only 298 mAhg-1 is obtained after 50 cycles of deep charging at a current of 200 mAg-1. It is found that silicon is involved in the charging-discharging process at a low current.

Phase singularities in 3D plasmonic crystal metamaterials for ultra-sensitive biosensing

NASA Astrophysics Data System (ADS)

Danilov, Artem; Aristov, Andrey I.; Manousidaki, Maria; Terzaki, Konstantina; Fotakis, Costas; Farsari, Maria; Kabashin, Andrei V.

2017-02-01

Plasmonic biosensors form the core label-free technology for studies of biomolecular interactions, but they still need a drastic improvement of sensitivity and novel nano-architectural implementations to match modern trends of nanobiotechnology. Here, we consider the generation of resonances in light reflected from 3D woodpile plasmonic crystal metamaterials fabricated by Direct Laser Writing by Multi-Photon Polymerization, followed by silver electroless plating. We show that the generation of these resonances is accompanied by the appearance of singularities of phase of reflected light and examine the response of phase characteristics to refractive index variations inside the metamaterial matrix. The recorded phase sensitivity (3*104 deg. of phase shift per RIU change) outperforms most plasmonic counterparts and is attributed to particular conditions of plasmon excitation in 3D plasmonic crystal geometry. Combined with a large surface for biomolecular immobilizations offered by the 3D woodpile matrix, the proposed sensor architecture promises a new important landmark in the advancement of plasmonic biosensing technology.

Selective coating for collecting solar energy on aluminum

NASA Technical Reports Server (NTRS)

Lowery, J. R.

1974-01-01

Presently used coatings, which were originally developed for brass, copper, and steel substrates, yield relatively low absorptance/emittance ratios when applied to aluminum. Efficient, black-nickel plating applied to aluminum substrate enhances solar absorptance to 93% and reduces emittance to 6%.

77 FR 12556 - Certain Steel Nails From the People's Republic of China: Final Results and Final Partial...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-01

..., respectively. Case History On September 12, 2011, the Department published in the Federal Register the... Comment 6: Stanley's Surrogate Values A. Copper Plated Steel Welding Wire B. Sodium Sulfate C. Glass Balls...

Transient thermal analysis during friction stir welding between AA2014-T6 and pure copper

NASA Astrophysics Data System (ADS)

Gadhavi, A. R.; Ghetiya, N. D.; Patel, K. M.

2018-04-01

AA2xxx-Cu alloys showed larger applications in the defence sectors and in aerospace industries due to high strength to weight ratio and toughness. FSW in a butt joint configuration was carried out between AA2014-T6 and pure Copper placing AA2014 on AS and Cu on RS. Temperature profiles were observed by inserting K-type thermocouples in the mid-thickness at various locations of the plate. A sharp decrease in temperature profiles was observed on Copper side due to its higher thermal conductivity. A thermal numerical model was prepared in ANSYS to compare the simulated temperature profiles with the experimental temperature profiles and both the temperature profiles were found to be in good agreement.

Model of the porphyry copper and polymetallic vein family of deposits - Applications in Slovakia, Hungary, and Romania

USGS Publications Warehouse

Drew, L.J.

2003-01-01

A tectonic model useful in estimating the occurrence of undiscovered porphyry copper and polymetallic vein systems has been developed. This model is based on the manner in which magmatic and hydrothermal fluids flow and are trapped in fault systems as far-field stress is released in tectonic strain features above subducting plates (e.g. strike-slip fault systems). The structural traps include preferred locations for stock emplacement and tensional-shear fault meshes within the step-overs that localize porphyry- and vein-style deposits. The application of the model is illustrated for the porphyry copper and polymetallic vein deposits in the Central Slovakian Volcanic Field, Slovakia; the Ma??tra Mountains, Hungary; and the Apuseni Mountains, Romania.

Star tracking reticles

NASA Technical Reports Server (NTRS)

Smith, W. O.; Toft, A. R. (Inventor)

1973-01-01

A method for the production of reticles, particularly those for use in outer space, where the product is a quartz base coated with highly adherent layers of chromium, chromium-silver, and silver vacuum deposited through a mask, and then coated with an electrodeposit of copper from a copper sulfate solution followed by an electrodeposit of black chromium is described. The masks are produced by coating a beryllium-copper alloy substrate with a positive working photoresist, developing the photoresist, according to a pattern to leave a positive mask, plating uncoated areas with gold, removing the photoresist, coating the substrate with a negative working photoresist, developing the negative working photoresist to expose the base metal of the pattern, and chemically etching the unplated side of the pattern to produce the mask.

Thermal conductance of gold plated metallic contacts at liquid helium temperatures

NASA Technical Reports Server (NTRS)

Kittel, Peter; Spivak, Alan L.; Salerno, Louis J.

1992-01-01

The thermal conductance of gold plated OFHC copper, 6061-T6 aluminum, free-machining brass, and 304 stainless steel contacts has been measured over the temperature range of 1.6 to 4.2 K, with applied forces from 22 N to 670 N. The contact surfaces were prepared with a 0.8 micron lapped finish prior to gold coating. It was found that for all materials, except stainless steel, the thermal conductance was significantly improved as the result of gold coating the contact surfaces.

Ionization chamber dosimeter

DOEpatents

Renner, Tim R.; Nyman, Mark A.; Stradtner, Ronald

1991-01-01

A method for fabricating an ion chamber dosimeter collecting array of the type utilizing plural discrete elements formed on a uniform collecting surface which includes forming a thin insulating layer over an aperture in a frame having surfaces, forming a predetermined pattern of through holes in the layer, plating both surfaces of the layer and simultaneously tilting and rotating the frame for uniform plate-through of the holes between surfaces. Aligned masking and patterned etching of the surfaces provides interconnects between the through holes and copper leads provided to external circuitry.

CALUTRON ION SOURCE

DOEpatents

Lofgren, E.J.

1959-02-17

An improvement is described in ion source mechanisms whereby the source structure is better adapted to withstanid the ravages of heat, erosion, and deterioration concomitant with operation of an ion source of the calutron type. A pair of molybdenum plates define the exit opening of the arc chamber and are in thermal contact with the walls of the chamber. These plates are maintained at a reduced temperature by a pair of copper blocks in thermal conducting contact therewith to form subsequent diverging margins for the exit opening.

Storing Drinking-water in Copper pots Kills Contaminating Diarrhoeagenic Bacteria

PubMed Central

Sudha, V.B. Preethi; Ganesan, Sheeba; Pazhani, G.P.; Ramamurthy, T.; Nair, G.B.

2012-01-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83±0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177±16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries. PMID:22524115

Storing drinking-water in copper pots kills contaminating diarrhoeagenic bacteria.

PubMed

Sudha, V B Preethi; Ganesan, Sheeba; Pazhani, G P; Ramamurthy, T; Nair, G B; Venkatasubramanian, Padma

2012-03-01

Microbially-unsafe water is still a major concern in most developing countries. Although many water-purification methods exist, these are expensive and beyond the reach of many people, especially in rural areas. Ayurveda recommends the use of copper for storing drinking-water. Therefore, the objective of this study was to evaluate the effect of copper pot on microbially-contaminated drinking-water. The antibacterial effect of copper pot against important diarrhoeagenic bacteria, including Vibrio cholerae O1, Shigella flexneri 2a, enterotoxigenic Escherichia coli, enteropathogenic E. coli, Salmonella enterica Typhi, and Salmonella Paratyphi is reported. When drinking-water (pH 7.83 +/- 0.4; source: ground) was contaminated with 500 CFU/mL of the above bacteria and stored in copper pots for 16 hours at room temperature, no bacteria could be recovered on the culture medium. Recovery failed even after resuscitation in enrichment broth, followed by plating on selective media, indicating loss of culturability. This is the first report on the effect of copper on S. flexneri 2a, enteropathogenic E. coli, and Salmonella Paratyphi. After 16 hours, there was a slight increase in the pH of water from 7.83 to 7.93 in the copper pots while the other physicochemical parameters remained unchanged. Copper content (177 +/- 16 ppb) in water stored in copper pots was well within the permissible limits of the World Health Organization. Copper holds promise as a point-of-use solution for microbial purification of drinking-water, especially in developing countries.

Tracing the 5000-year recorded history of inorganic thin films from ˜3000 BC to the early 1900s AD

NASA Astrophysics Data System (ADS)

Greene, J. E.

2014-12-01

Gold is very likely the first metal discovered by man, more than 11 000 years ago. However, unlike copper (˜9000 BC), bronze (˜3500 BC), and wrought iron (˜2500-3000 BC), gold is too soft for fabrication of tools and weapons. Instead, it was used for decoration, religious artifacts, and commerce. The earliest documented inorganic thin films were gold layers, some less than 3000 Å thick, produced chemi-mechanically by Egyptians approximately 5000 years ago. Examples, gilded on statues and artifacts (requiring interfacial adhesion layers), were found in early stone pyramids dating to ˜2650 BC in Saqqara, Egypt. Spectacular samples of embossed Au sheets date to at least 2600 BC. The Moche Indians of northern Peru developed electroless gold plating (an auto-catalytic reaction) in ˜100 BC and applied it to intricate Cu masks. The earliest published electroplating experiments were ˜1800 AD, immediately following the invention of the dc electrochemical battery by Volta. Chemical vapor deposition (CVD) of metal films was reported in 1649, atmospheric arc deposition of oxides (Priestley) in the mid-1760s, and atmospheric plasmas (Siemens) in 1857. Sols were produced in the mid-1850s (Faraday) and sol-gel films synthesized in 1885. Vapor phase film growth including sputter deposition (Grove, 1852), vacuum arc deposition ("deflagration," Faraday, 1857), plasma-enhanced CVD (Barthelot, 1869) and evaporation (Stefan, Hertz, and Knudsen, 1873-1915) all had to wait for the invention of vacuum pumps whose history ranges from ˜1650 for mechanical pumps, through ˜1865 for mercury pumps that produce ballistic pressures in small systems. The development of crystallography, beginning with Plato in 360 BC, Kepler in 1611, and leading to Miller indices (1839) for describing orientation and epitaxial relationships in modern thin film technology, was already well advanced by the 1780s (Haüy). The starting point for the development of heterogeneous thin film nucleation theory was provided by Young in 1805. While an historical timeline tracing the progress of thin film technology is interesting of itself, the stories behind these developments are even more fascinating and provide insight into the evolution of scientific reasoning.

Development of technique for air coating and nickel and copper metalization of solar cells

NASA Technical Reports Server (NTRS)

1982-01-01

Solar cells were made with a variety of base metal screen printing inks applied over silicon nitride AR coating and copper electroplated. Fritted and fritless nickel and fritless tin base printing inks were evaluated. Conversion efficiencies as high as 9% were observed with fritted nickel ink contacts, however, curve shapes were generally poor, reflecting high series resistance. Problems encountered in addition to high series reistance included loss of adhesion of the nickel contacts during plating and poor adhesion, oxidation and inferior curve shapes with the tin base contacts.

85. HENNESSY'S DEPARTMENT STORE (130 NORTH MAIN, 18971898) IS A ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

85. HENNESSY'S DEPARTMENT STORE (130 NORTH MAIN, 1897-1898) IS A STEEL FRAME AND BRICK STRUCTURE DESIGNED BY FREDERICK KEES OF MINNEAPOLIS. IT HAS INLAID MARBLE TILES IN THE HALLS, AND PLATE GLASS WINDOWS FRAMED IN COPPER ON THE FIRST AND SECOND FLOORS. THERE IS ALSO A CAST-IRON AND ORNAMENTAL GLASS LOWER LEVEL AND TERRA-COTTA DETAILING AROUND THE WINDOWS. THE ENTRANCE IS AN ELLIPTICAL ARCH WITH IRON GRILL WORK. - Butte Historic District, Bounded by Copper, Arizona, Mercury & Continental Streets, Butte, Silver Bow County, MT

61. Hennessy's Department Store (130 North Main, 18971898) is a ...

Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

61. Hennessy's Department Store (130 North Main, 1897-1898) is a steel frame and brick structure designed by Frederick Kees of Minneapolis. It has inlaid marble tiles in the halls, and plate glass windows framed in copper on the first and second floors. There is also a cast-iron and ornamental glass lower level and terra-cotta detailing around the windows. The entrance is an eliptical arch with iron grill work. - Butte Historic District, Bounded by Copper, Arizona, Mercury & Continental Streets, Butte, Silver Bow County, MT

Wear behavior of electroless Ni-P-W coating under lubricated condition - a Taguchi based approach

NASA Astrophysics Data System (ADS)

Mukhopadhyay, Arkadeb; Duari, Santanu; Barman, Tapan Kumar; Sahoo, Prasanta

2016-09-01

The present study aims to investigate the tribological behavior of electroless Ni-P-W coating under engine oil lubricated condition to ascertain its suitability in automotive applications. Coating is deposited onto mild steel specimens by the electroless method. The experiments are carried out on a pin - on - disc type tribo tester under lubrication. Three tribotesting parameters namely the applied normal load, sliding speed and sliding duration are varied at their three levels and their effects on the wear depth of the deposits are studied. The experiments are carried out based on the combinations available in Taguchi's L27 orthogonal array (OA). Optimization of the tribo-testing parameters is carried out using Taguchi's S/N ratio method to minimize the wear depth. Analysis of variance carried out at a confidence level of 99% indicates that the sliding speed is the most significant parameter in controlling the wear behavior of the deposits. Coating characterization is done using scanning electron microscope, energy dispersive X-ray analysis and X-ray diffraction techniques. It is seen that the wear mechanism under lubricated condition is abrasive in nature.

Thermal response of solar receiver aperture plates during sun walk-off

NASA Technical Reports Server (NTRS)

Wen, L.; Roschke, J.

1982-01-01

The tracking mechanism for a point-focusing concentrator may be subject to failure. If this should occur, the solar image will travel across the aperture plate, and it may also impinge on the adjacent support structure. Such an event is called 'sun walk-off'. The present investigation is concerned with the transient response of different aperture plate materials to the intense heating produced in a typical walk-off situation for parabolic dish concentrators. Receivers for two solar module systems are considered, including a high-temperature receiver that utilizes a 2-milliradian (mrad) concentrator, and a lower-temperature receiver which is coupled with a 4-mrad concentrator. It is found that during a walk-off situation the solar image travels in a straight line in the radial direction. The results obtained for a copper aperture plate were disappointing. It appears that passive metallic plates without cooling or other protective support cannot withstand the intense heating.

Selection of Fecal Enterococci Exhibiting tcrB-Mediated Copper Resistance in Pigs Fed Diets Supplemented with Copper † ▿

PubMed Central

Amachawadi, R. G.; Shelton, N. W.; Shi, X.; Vinasco, J.; Dritz, S. S.; Tokach, M. D.; Nelssen, J. L.; Scott, H. M.; Nagaraja, T. G.

2011-01-01

Copper, as copper sulfate, is increasingly used as an alternative to in-feed antibiotics for growth promotion in weaned piglets. Acquired copper resistance, conferred by a plasmid-borne, transferable copper resistance (tcrB) gene, has been reported in Enterococcus faecium and E. faecalis. A longitudinal field study was undertaken to determine the relationship between copper supplementation and the prevalence of tcrB-positive enterococci in piglets. The study was done with weaned piglets, housed in 10 pens with 6 piglets per pen, fed diets supplemented with a normal (16.5 ppm; control) or an elevated (125 ppm) level of copper. Fecal samples were randomly collected from three piglets per pen on days 0, 14, 28, and 42 and plated on M-Enterococcus agar, and three enterococcal isolates were obtained from each sample. The overall prevalence of tcrB-positive enterococci was 21.1% (38/180) in piglets fed elevated copper and 2.8% (5/180) in the control. Among the 43 tcrB-positive isolates, 35 were E. faecium and 8 were E. faecalis. The mean MICs of copper for tcrB-negative and tcrB-positive enterococci were 6.2 and 22.2 mM, respectively. The restriction digestion of the genomic DNA of E. faecium or E. faecalis with S1 nuclease yielded a band of ∼194-kbp size to which both tcrB and the erm(B) gene probes hybridized. A conjugation assay demonstrated cotransfer of tcrB and erm(B) genes between E. faecium and E. faecalis strains. The higher prevalence of tcrB-positive enterococci in piglets fed elevated copper compared to that in piglets fed normal copper suggests that supplementation of copper in swine diets selected for resistance. PMID:21705534

Palladium Nanoparticles Immobilized on Individual Calcium Carbonate Plates Derived from Mussel Shell Waste: An Ecofriendly Catalyst for the Copper-Free Sonogashira Coupling Reaction.

PubMed

Saetan, Trin; Lertvachirapaiboon, Chutiparn; Ekgasit, Sanong; Sukwattanasinitt, Mongkol; Wacharasindhu, Sumrit

2017-09-05

The conversion of waste into high-value materials is considered an important sustainability strategy in modern chemical industries. A large volume of shell waste is generated globally from mussel cultivation. In this work, mussel shell waste (Perna viridis) is transformed into individual calcium carbonate plates (ICCPs) and is applied as a support for a heterogeneous catalyst. Palladium nanoparticles (3-6 nm) are deposited with an even dispersion on the ICCP surface, as demonstrated by X-ray diffraction and scanning electron microscopy. Using this system, Sonogashira cross-coupling reactions between aryl iodides and terminal acetylenes were accomplished in high yields with the use of 1 % Pd/ICCP in the presence of potassium carbonate without the use of any copper metal or external ligand. The Pd/ICCP catalyst could also be reused up to three times and activity over 90 % was maintained with negligible Pd-metal leaching. This work demonstrates that mussel shell waste can be used as an inexpensive and effective support for metal catalysts in coupling reactions, as demonstrated by the successful performance of the Pd-catalyzed, copper-free Sonogashira cross-coupling process. © 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

A novel graded density impactor

NASA Astrophysics Data System (ADS)

Winter, Ron; Cotton, Matthew; Harris, Ernest; Eakins, Daniel; Chapman, David

2013-06-01

Ramp loading using graded-density-impactors as flyers in plate impact experiments can yield useful information about the dynamic properties of the loaded material. Selective Laser Melting, an additive manufacture technique, was used to fabricate a graded-density flyer, termed the ``bed of nails'' (BON). A 2 mm thick x 100 mm diameter solid disc of stainless steel formed a base for an array of tapered spikes of length 6 mm and spaced 1 mm apart. Two experiments to test the concept were performed at impact velocities of 900 m/s and 1100 m/s using the 100 mm gas gun at The Institute of Shock Physics, Imperial College, London. In each experiment a BON flyer was impacted onto a copper buffer plate which helped to smooth out perturbations in the wave profile. The ramp delivered to the copper buffer was in turn transmitted to three tantalum targets of thicknesses 3, 5 and 7 mm, mounted in contact with the back face of the copper. Heterodyne velocimetry was used to measure the velocity-time history, at the back faces of the tantalum discs. The wave profiles display a smooth increase in free surface velocity over a period of about 2.5 microseconds. The measured profiles have been analysed to generate a stress vs. volume curve for tantalum.

Synergistic effect between nano-ceramic lubricating additives and electroless deposited Ni-W-P coating

NASA Astrophysics Data System (ADS)

Chen, Min; Cheng, Wushan; Zhao, Zuxin; Huang, Xiaobo

2013-01-01

The major solving ways for the material wear are surface modification and lubrication. Currently, the researches at home and abroad are all limited to the single study of either nano-lubricating oil additive or electroless deposited coating. The surface coating has high hardness and high wear resistance, however, the friction reduction performance of the coating with high hardness is not good, the thickness of the coating is limited, and the coating can not regenerate after wearing. The nano-lubricating additives have good tribological performance and self-repair function, but under heavy load, the self-repair rate to the worn surface with the nano-additives is smaller than the wearing rate of the friction pair. To solve the above problems, the Ni-W-P alloy coating and deposition process with excellent anti-wear, and suitable for industrial application were developed, the optimum bath composition and process can be obtained by studying the influence of the bath composition, temperature and PH value to the deposition rate and the plating solution stability. The tribological properties as well as anti-wear and friction reduction mechanism of wear self-repair nano-ceramic lubricating additives are also studied. The ring-block abrasion testing machine and energy dispersive spectrometer are used to explore the internal relation between the coating and the nano-lubricating oil additives, and the tribology mechanism, to seek the synergetic effect between the two. The test results show that the wear resistance of Ni-W-P alloy coating (with heat treatment and in oil with nano-ceramic additives) has increased hundreds times than 45 steel as the metal substrate in basic oil, the friction reduction performance is improved. This research breaks through the bottleneck of previous separate research of the above-mentioned two methods, and explores the combination use of the two methods in industrial field.

Fabrication of nanoscale to macroscale nickel-multiwall carbon nanotube hybrid materials with tunable material properties

NASA Astrophysics Data System (ADS)

Abdalla, Ahmed M.; Majdi, Tahereh; Ghosh, Suvojit; Puri, Ishwar K.

2016-12-01

To utilize their superior properties, multiwall carbon nanotubes (MWNTs) must be manipulated and aligned end-to-end. We describe a nondestructive method to magnetize MWNTs and provide a means to remotely manipulate them through the electroless deposition of magnetic nickel nanoparticles on their surfaces. The noncovalent bonds between Ni nanoparticles and MWNTs produce a Ni-MWNT hybrid material (NiCH) that is electrically conductive and has an enhanced magnetic susceptibility and elastic modulus. Our experiments show that MWNTs can be plated with Ni for Ni:MWNT weight ratios of γ = 1, 7, 14 and 30, to control the material properties. The phase, atom-level, and morphological information from x-ray diffraction, energy dispersive x-ray spectroscopy, scanning electron microscopy, transmission electron microscopy, dark field STEM, and atomic force microscopy clarify the plating process and reveal the mechanical properties of the synthesized material. Ni metalizes at the surface of the Pd catalyst, forming a continuous wavy layer that encapsulates the MWNT surfaces. Subsequently, Ni acts as an autocatalyst, allowing the plating to continue even after the original Pd catalyst has been completely covered. Raising γ increases the coating layer thickness from 10 to 150 nm, which influences the NiCH magnetic properties and tunes its elastic modulus from 12.5 to 58.7 GPa. The NiCH was used to fabricate Ni-MWNT macrostructures and tune their morphologies by changing the direction of an applied magnetic field. Leveraging the hydrophilic Ni-MWNT outer surface, a water-based conductive ink was created and used to print a conductive path that had an electrical resistivity of 5.9 Ω m, illustrating the potential of this material for printing electronic circuits.

Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits

NASA Technical Reports Server (NTRS)

Zakraysek, Louis

1987-01-01

Printed Wiring Multilayer Board (PWMLB) structures for high speed, high density circuits are prone to failure due to the microcracking of electrolytic copper interconnections. The failure can occur in the foil that makes up the inner layer traces or in the plated through holes (PTH) deposit that forms the layer to layer interconnections. It is shown that there are some distinctive differences in the quality of Type E copper and that these differences can be detected before its use in a PWMLB. It is suggested that the strength of some Type E copper can be very low when the material is hot and that it is the use of this poor quality material in a PWMLB that results in PTH and inner layer microcracking. Since the PWMLB failure in question are induced by a thermal stress, and since the poorer grades of Type E materials used in these structures are susceptible to premature failure under thermal stress, the use of elevated temperature rupture and creep rupture testing is proposed as a means for screening copper foil, or its PTH equivalent, in order to eliminate the problem of Type E copper microcracking in advanced PWMLBs.

Cleaning and passivation of copper surfaces to remove surface radioactivity and prevent oxide formation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hoppe, Eric W.; Seifert, Allen; Aalseth, Craig E.

High-purity copper is an attractive material for constructing ultra-low-background radiation measurement devices. Many low-background experiments using high-purity copper have indicated surface contamination emerges as the dominant background. Radon daughters plate out on exposed surfaces, leaving a residual 210Pb background that is difficult to avoid. Dust is also a problem; even under cleanroom conditions, the amount of U and Th deposited on surfaces can represent the largest remaining background. To control these backgrounds, a copper cleaning chemistry has been developed. Designed to replace an effective, but overly aggressive concentrated nitric acid etch, this peroxide-based solution allows for a more controlled cleaningmore » of surfaces. The acidified hydrogen peroxide solution will generally target the Cu+/Cu2+ species which are the predominant surface participants, leaving the bulk of copper metal intact. This preserves the critical tolerances of parts and eliminates significant waste disposal issues. Accompanying passivation chemistry has also been developed that protects copper surfaces from oxidation. Using a high-activity polonium surface spike, the most difficult-to-remove daughter isotope of radon, the performance of these methods are quantified. © 2001 Elsevier Science. All rights reserved« less

Modeling pore corrosion in normally open gold- plated copper connectors.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Battaile, Corbett Chandler; Moffat, Harry K.; Sun, Amy Cha-Tien

2008-09-01

The goal of this study is to model the electrical response of gold plated copper electrical contacts exposed to a mixed flowing gas stream consisting of air containing 10 ppb H{sub 2}S at 30 C and a relative humidity of 70%. This environment accelerates the attack normally observed in a light industrial environment (essentially a simplified version of the Battelle Class 2 environment). Corrosion rates were quantified by measuring the corrosion site density, size distribution, and the macroscopic electrical resistance of the aged surface as a function of exposure time. A pore corrosion numerical model was used to predict bothmore » the growth of copper sulfide corrosion product which blooms through defects in the gold layer and the resulting electrical contact resistance of the aged surface. Assumptions about the distribution of defects in the noble metal plating and the mechanism for how corrosion blooms affect electrical contact resistance were needed to complete the numerical model. Comparisons are made to the experimentally observed number density of corrosion sites, the size distribution of corrosion product blooms, and the cumulative probability distribution of the electrical contact resistance. Experimentally, the bloom site density increases as a function of time, whereas the bloom size distribution remains relatively independent of time. These two effects are included in the numerical model by adding a corrosion initiation probability proportional to the surface area along with a probability for bloom-growth extinction proportional to the corrosion product bloom volume. The cumulative probability distribution of electrical resistance becomes skewed as exposure time increases. While the electrical contact resistance increases as a function of time for a fraction of the bloom population, the median value remains relatively unchanged. In order to model this behavior, the resistance calculated for large blooms has been weighted more heavily.« less

Bulk substrate porosity verification by applying Monte Carlo modeling and Castaing's formula using energy-dispersive x-rays

NASA Astrophysics Data System (ADS)

Yung, Lai Chin; Fei, Cheong Choke; Mandeep, Jit Singh; Amin, Nowshad; Lai, Khin Wee

2015-11-01

The leadframe fabrication process normally involves additional thin-metal layer plating on the bulk copper substrate surface for wire bonding purposes. Silver, tin, and copper flakes are commonly adopted as plating materials. It is critical to assess the density of the plated metal layer, and in particular to look for porosity or voids underneath the layer, which may reduce the reliability during high-temperature stress. A fast, reliable inspection technique is needed to assess the porosity or void weakness. To this end, the characteristics of x-rays generated from bulk samples were examined using an energy-dispersive x-ray (EDX) detector to examine the porosity percentage. Monte Carlo modeling was integrated with Castaing's formula to verify the integrity of the experimental data. Samples with different porosity percentages were considered to test the correlation between the intensity of the collected x-ray signal and the material density. To further verify the integrity of the model, conventional cross-sectional samples were also taken to observe the porosity percentage using Image J software measurement. A breakthrough in bulk substrate assessment was achieved by applying EDX for the first time to nonelemental analysis. The experimental data showed that the EDX features were not only useful for elemental analysis, but also applicable to thin-film metal layer thickness measurement and bulk material density determination. A detailed experiment was conducted using EDX to assess the plating metal layer and bulk material porosity.

Role of copper oxides in contact killing of bacteria.

PubMed

Hans, Michael; Erbe, Andreas; Mathews, Salima; Chen, Ying; Solioz, Marc; Mücklich, Frank

2013-12-31

The potential of metallic copper as an intrinsically antibacterial material is gaining increasing attention in the face of growing antibiotics resistance of bacteria. However, the mechanism of the so-called "contact killing" of bacteria by copper surfaces is poorly understood and requires further investigation. In particular, the influences of bacteria-metal interaction, media composition, and copper surface chemistry on contact killing are not fully understood. In this study, copper oxide formation on copper during standard antimicrobial testing was measured in situ by spectroscopic ellipsometry. In parallel, contact killing under these conditions was assessed with bacteria in phosphate buffered saline (PBS) or Tris-Cl. For comparison, defined Cu2O and CuO layers were thermally generated and characterized by grazing incidence X-ray diffraction. The antibacterial properties of these copper oxides were tested under the conditions used above. Finally, copper ion release was recorded for both buffer systems by inductively coupled plasma atomic absorption spectroscopy, and exposed copper samples were analyzed for topographical surface alterations. It was found that there was a fairly even growth of CuO under wet plating conditions, reaching 4-10 nm in 300 min, but no measurable Cu2O was formed during this time. CuO was found to significantly inhibit contact killing, compared to pure copper. In contrast, thermally generated Cu2O was essentially as effective in contact killing as pure copper. Copper ion release from the different surfaces roughly correlated with their antibacterial efficacy and was highest for pure copper, followed by Cu2O and CuO. Tris-Cl induced a 10-50-fold faster copper ion release compared to PBS. Since the Cu2O that primarily forms on copper under ambient conditions is as active in contact killing as pure copper, antimicrobial objects will retain their antimicrobial properties even after oxide formation.

Nanoscale coatings for erosion and corrosion protection of copper microchannel coolers for high powered laser diodes

NASA Astrophysics Data System (ADS)

Flannery, Matthew; Fan, Angie; Desai, Tapan G.

2014-03-01

High powered laser diodes are used in a wide variety of applications ranging from telecommunications to industrial applications. Copper microchannel coolers (MCCs) utilizing high velocity, de-ionized water coolant are used to maintain diode temperatures in the recommended range to produce stable optical power output and control output wavelength. However, aggressive erosion and corrosion attack from the coolant limits the lifetime of the cooler to only 6 months of operation. Currently, gold plating is the industry standard for corrosion and erosion protection in MCCs. However, this technique cannot perform a pin-hole free coating and furthermore cannot uniformly cover the complex geometries of current MCCs involving small diameter primary and secondary channels. Advanced Cooling Technologies, Inc., presents a corrosion and erosion resistant coating (ANCERTM) applied by a vapor phase deposition process for enhanced protection of MCCs. To optimize the coating formation and thickness, coated copper samples were tested in 0.125% NaCl solution and high purity de-ionized (DIW) flow loop. The effects of DIW flow rates and qualities on erosion and corrosion of the ANCERTM coated samples were evaluated in long-term erosion and corrosion testing. The robustness of the coating was also evaluated in thermal cycles between 30°C - 75°C. After 1000 hours flow testing and 30 thermal cycles, the ANCERTM coated copper MCCs showed a corrosion rate 100 times lower than the gold plated ones and furthermore were barely affected by flow rates or temperatures thus demonstrating superior corrosion and erosion protection and long term reliability.

Preparation of ultrafine grained copper nanoparticles via immersion deposit method

NASA Astrophysics Data System (ADS)

Abbasi-Kesbi, Fatemeh; Rashidi, Ali Mohammad; Astinchap, Bandar

2018-03-01

Today, the exploration about synthesis of nanoparticles is much of interest to materials scientists. In this work, copper nanoparticles have been successfully synthesized by immersion deposit method in the absence of any stabilizing and reducing agents. Copper (II) sulfate pentahydrate as precursor salt and distilled water and Ethylene glycol as solvents were used. The copper nanoparticles were deposited on plates of low carbon steel. The effects of copper sulfate concentrations and solvent type were investigated. X-ray diffraction, scanning electron microscopy and UV-Visible spectroscopy were taken to investigate the crystallite size, crystal structure, and morphology and size distribution and the growth process of the nanoparticles of obtained Cu particles. The results indicated that the immersion deposit method is a particularly suitable method for synthesis of semispherical copper nanoparticles with the crystallites size in the range of 22 to 37 nm. By increasing the molar concentration of copper sulfate in distilled water solvent from 0.04 to 0.2 M, the average particles size is increased from 57 to 81 nm. The better size distribution of Cu nanoparticles was achieved using a lower concentration of copper sulfate. By increasing the molar concentration of copper sulfate in water solvent from 0.04 to 0.2, the location of the SPR peak has shifted from 600 to 630 nm. The finer Cu nanoparticles were formed using ethylene glycol instead water as a solvent. Also, the agglomeration and overlapping of nanoparticles in ethylene glycol were less than that of water solvent.

A REVIEW OF NICKEL PLATING BATH LIFE EXTENSION, NICKEL RECOVERY & COPPER RECOVERY FROM NICKEL BATHS

EPA Science Inventory

For metal finishing operations to remain competitive and in compliance with environmental requirements, companies must focus their efforts on pollution prevention to reduce waste generation and disposal costs, limit liability and restore maximum profits. By applying the pollutio...

Polyurethane Filler for Electroplating

NASA Technical Reports Server (NTRS)

Beasley, J. L.

1984-01-01

Polyurethane foam proves suitable as filler for slots in parts electroplated with copper or nickel. Polyurethane causes less contamination of plating bath and of cleaning and filtering tanks than wax fillers used previously. Direct cost of maintenance and indirect cost of reduced operating time during tank cleaning also reduced.

Friction Stir Welding of GR-Cop 84 for Combustion Chamber Liners

NASA Technical Reports Server (NTRS)

Russell, Carolyn K.; Carter, Robert; Ellis, David L.; Goudy, Richard

2004-01-01

GRCop-84 is a copper-chromium-niobium alloy developed by the Glenn Research Center for liquid rocket engine combustion chamber liners. GRCop-84 exhibits superior properties over conventional copper-base alloys in a liquid hydrogen-oxygen operating environment. The Next Generation Launch Technology program has funded a program to demonstrate scale-up production capabilities of GR-Cop 84 to levels suitable for main combustion chamber production for the prototype rocket engine. This paper describes a novel method of manufacturing the main combustion chamber liner. The process consists of several steps: extrude the GR-Cop 84 powder into billets, roll the billets into plates, bump form the plates into cylinder halves and friction stir weld the halves into a cylinder. The cylinder is then metal spun formed to near net liner dimensions followed by finish machining to the final configuration. This paper describes the friction stir weld process development including tooling and non-destructive inspection techniques, culminating in the successful production of a liner preform completed through spin forming.

Catalyst surfaces for the chromous/chromic redox couple

NASA Technical Reports Server (NTRS)

Giner, J. D.; Cahill, K. J. (Inventor)

1980-01-01

An electricity producing cell of the reduction-oxidation (REDOX) type is described. The cell is divided into two compartments by a membrane, each compartment containing a solid inert electrode. A ferrous/ferric couple in a chloride solution serves as a cathode fluid which is circulated through one of the compartments to produce a positive electric potential disposed therein. A chromic/chromous couple in a chloride solution serves as an anode fluid which is circulated through the second compartment to produce a negative potential on an electrode disposed therein. The electrode is an electrically conductive, inert material plated with copper, silver or gold. A thin layer of lead plates onto the copper, silver or gold layer when the cell is being charged, the lead ions being available from lead chloride which was added to the anode fluid. If the REDOX cell is then discharged, the current flows between the electrodes causing the lead to deplate from the negative electrode and the metal coating on the electrode will act as a catalyst to cause increased current density.

Laser etching of polymer masked leadframes

NASA Astrophysics Data System (ADS)

Ho, C. K.; Man, H. C.; Yue, T. M.; Yuen, C. W.

1997-02-01

A typical electroplating production line for the deposition of silver pattern on copper leadframes in the semiconductor industry involves twenty to twenty five steps of cleaning, pickling, plating, stripping etc. This complex production process occupies large floor space and has also a number of problems such as difficulty in the production of rubber masks and alignment, generation of toxic fumes, high cost of water consumption and sometimes uncertainty on the cleanliness of the surfaces to be plated. A novel laser patterning process is proposed in this paper which can replace many steps in the existing electroplating line. The proposed process involves the application of high speed laser etching techniques on leadframes which were protected with polymer coating. The desired pattern for silver electroplating is produced by laser ablation of the polymer coating. Excimer laser was found to be most effective for this process as it can expose a pattern of clean copper substrate which can be silver plated successfully. Previous working of Nd:YAG laser ablation showed that 1.06 μm radiation was not suitable for this etching process because a thin organic and transparent film remained on the laser etched region. The effect of excimer pulse frequency and energy density upon the removal rate of the polymer coating was studied.

An inexpensive approach for bright-field and dark-field imaging by scanning transmission electron microscopy in scanning electron microscopy.

PubMed

Patel, Binay; Watanabe, Masashi

2014-02-01

Scanning transmission electron microscopy in scanning electron microscopy (STEM-in-SEM) is a convenient technique for soft materials characterization. Various specimen-holder geometries and detector arrangements have been used for bright-field (BF) STEM-in-SEM imaging. In this study, to further the characterization potential of STEM-IN-SEM, a new specimen holder has been developed to facilitate direct detection of BF signals and indirect detection of dark-field (DF) signals without the need for substantial instrument modification. DF imaging is conducted with the use of a gold (Au)-coated copper (Cu) plate attached to the specimen holder which directs highly scattered transmitted electrons to an off-axis yttrium-aluminum-garnet (YAG) detector. A hole in the copper plate allows for BF imaging with a transmission electron (TE) detector. The inclusion of an Au-coated Cu plate enhanced DF signal intensity. Experiments validating the acquisition of true DF signals revealed that atomic number (Z) contrast may be achieved for materials with large lattice spacing. However, materials with small lattice spacing still exhibit diffraction contrast effects in this approach. The calculated theoretical fine probe size is 1.8 nm. At 30 kV, in this indirect approach, DF spatial resolution is limited to 3.2 nm as confirmed experimentally.

High current capacity electrical connector

DOEpatents

Bettis, Edward S.; Watts, Harry L.

1976-01-13

An electrical connector is provided for coupling high current capacity electrical conductors such as copper busses or the like. The connector is arranged in a "sandwiched" configuration in which a conductor plate contacts the busses along major surfaces thereof clamped between two stainless steel backing plates. The conductor plate is provided with a plurality of contact buttons affixed therein in a spaced array such that the caps of the buttons extend above the conductor plate surface to contact the busses. When clamping bolts provided through openings in the sandwiched arrangement are tightened, Belleville springs provided under the rim of each button cap are compressed and resiliently force the caps into contact with the busses' contacting surfaces to maintain a predetermined electrical contact area provided by the button cap tops. The contact area does not change with changing thermal or mechanical stresses applied to the coupled conductors.

Improving the Magnetic Damping of an AS-1 Seismometer

NASA Astrophysics Data System (ADS)

Marton, F.; Echreshzadeh, M.; Tokman, T. L.; Palaric, K. D.; Filippone, N. V.; Balzarette, M.; Sivo, J.

2016-12-01

Last year, students working on the SeismoSTEM project at Bergen Community College in New Jersey successfully manufactured and assembled an AS-1 seismometer1. For 2016, our objective has been to improve the magnetic damping mechanism invented by Chris Chapman2. As the mass on the boom is displaced by seismic waves, the spring will cause the mass to oscillate, therefore, damping is required. To achieve this, a paddle-shaped piece of copper, along with steel plates holding strong neodymium magnets are used. A localized eddy current is then induced, which then creates an opposing magnetic field. The challenges we faced for the summer internship was the fact that there was either too much or too little damping to distinguish the waves of an earthquake. However, we resolved the issue by designing our own prototype for moving the steel plates away and toward the copper paddle, to achieve critical damping. This was successfully completed by attaching two L-shaped pieces of aluminum, along with a cylindrical piece, to form a yoke. We then drilled a hole through the cylindrical piece and a plastic block for a bolt to slide through. Finally, the head of the bolt would then be used as a knob to shift the two plates away from and toward the paddle simultaneously. Although this was our solution for moving the plates horizontally, we also needed to find a way to lock the plates in place once we found the correct amount of damping. We accomplished this task by drilling two slotted holes on two symmetrical sheets of aluminum, which will allow us to slide the plates, and finally, lock them into place to avoid wobbling. References: 1Tokman, T.L. et al., What's shaking? Manufacturing & assembling an AS-1 educational seismometer for undergraduate stem research, Geological Society of America Abstracts with Programs. Vol. 47, No. 7, p.524, 2015. 2http://www.jclahr.com/science/psn/chapman/as1%20damping/

SFD-261 Crossed-Field Amplifier Manufacturing Technology Program.

DTIC Science & Technology

1979-09-28

microwave amplifier used to increase tet pow--rlel of pulses of energy by a factor of 20. It is used in the Aegis A4/SPY1V DD 1473 ECIIOwOF I MOV 65...transmitter. A single ship.,; complement without spares is seventy-six. Its internal parts are made from high purity copper and many are complex and...23 Cathode Support 39 24 Mounting Plate ’i 25 Support Plate 42 26 Tubing Support 43 27 SFD-261 High Voltage Can End 45 b 28 Comparison of MT Tube

Combined Mini-Cylex & Disk Acceleration Tests in Type K Copper.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maines, Warren Russell; Kittell, David E.; Hobbs, Michael L.

We combined the miniature cylinder expansion test (Mini-Cylex), with the Disk Acceleration Test (DAX) using Type K copper, Picatinny Liquid Explosive, and photonic Doppler velocimetry. We estimated the CJ state using plate reverberation methods at the test cap. We extracted velocities at 2, 7, and 10 volume expansions to fit Jones-Wilkins-Lee Equation of State at the tube wall. And we estimated Gurney velocity both at the test cap and tube wall. Our experiments and simulations are within expected uncertainty. The test and the analysis effectively reduce costs while keeping similar fidelity compared with more expensive tests.

Development of Surfaces Optically Suitable for Flat Solar Panels

NASA Technical Reports Server (NTRS)

Desmet, D.; Jason, A.

1978-01-01

Three areas of research in the development of flat solar panels are described. (1) A reflectometer which can separately evaluate the spectral and diffuse reflectivities of surfaces was developed. The reflectometer has a phase locked detection system. (2) A coating composed of strongly bound copper oxide that is formed by an etching process performed on an aluminum alloy with high copper content was also developed. Because of this one step fabrication process, fabrication costs are expected to be small. (3) A literature search was conducted and conclusions on the required optical properties of flat plate solar collectors are presented.

Silver-free Metallization Technology for Producing High Efficiency, Industrial Silicon Solar Cells

DOE Office of Scientific and Technical Information (OSTI.GOV)

Michaelson, Lynne M.; Munoz, Krystal; Karas, Joseph

The goal of this project is to provide a commercially viable Ag-free metallization technology that will both reduce cost and increase efficiency of standard silicon solar cells. By removing silver from the front grid metallization and replacing it with lower cost nickel, copper, and tin metal, the front grid direct materials costs will decrease. This reduction in material costs should provide a path to meeting the Sunshot 2020 goal of 1 dollar / W DC. As of today, plated contacts are not widely implemented in large scale manufacturing. For organizations that wish to implement pilot scale manufacturing, only two equipmentmore » choices exist. These equipment manufacturers do not supply plating chemistry. The main goal of this project is to provide a chemistry and equipment solution to the industry that enables reliable manufacturing of plated contacts marked by passing reliability results and higher efficiencies than silver paste front grid contacts. To date, there have been several key findings that point to plated contacts performing equal to or better than the current state of the art silver paste contacts. Poor adhesion and reliability concerns are a few of the hurdles for plated contacts, specifically plated nickel directly on silicon. A key finding of the Phase 1 budget period is that the plated contacts have the same adhesion as the silver paste controls. This is a huge win for plated contacts. With very little optimization work, state of the art electrical results for plated contacts on laser ablated lines have been demonstrated with efficiencies up to 19.1% and fill factors ~80% on grid lines 40-50 um wide. The silver paste controls with similar line widths demonstrate similar electrical results. By optimizing the emitter and grid design for the plated contacts, it is expected that the electrical performance will exceed the silver paste controls. In addition, cells plated using Technic chemistry and equipment pass reliability testing; i.e. 1000 hours damp heat and 200 thermal cycles, with results similar to silver paste control cells. 100 cells have been processed through Technic’s novel demo plating tool built and installed during budget period 2. This plating tool performed consistently from cell to cell, providing gentle handling for the solar cells. An agreement has been signed with a cell manufacturer to process their cells through our plating chemistry and equipment. Their main focus for plated contacts is to reduce the direct materials cost by utilizing nickel, copper, and tin in place of silver paste. Based on current market conditions and cost model calculations, the overall savings offered by plated contacts is only 3.5% dollar/W versus silver paste contacts; however, the direct materials savings depend on the silver market. If silver prices increase, plated contacts may find a wider adoption in the solar industry in order to keep the direct materials costs down for front grid contacts.« less

Capable Copper Electrodeposition Process for Integrated Circuit - substrate Packaging Manufacturing

NASA Astrophysics Data System (ADS)

Ghanbari, Nasrin

This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked microvia that varies in depth from 20microm to 100microm with an aspect ratio of 0.5 to 1.5 and fine line patterns defined by photolithography. Photolithography defined pattern regions incorporate a wide variety of feature sizes including large circular pad structures with diameter of 20microm - 200microm, fine traces with varying widths of 3microm - 30microm and additional planar regions to define a IC substrate package. Electrodeposition of copper is performed to establish the desired circuit. Electrodeposition of copper in IC substrate applications holds certain unique challenges in that they require a low cost manufacturing process that enables a void-free gap fill inside the microvia along with uniform deposition of copper on exposed patterned regions. Deposition time scales to establish the desired metal thickness for such packages could range from several minutes to few hours. This work showcases a reverse pulse electrodeposition methodology that achieves void-free gap fill inside the microvia and uniform plating in FLS (Fine Lines and Spaces) regions with significantly higher deposition rates than traditional approaches. In order to achieve this capability, systematic experimental and simulation studies were performed. A strong correlation of independent parameters that govern the electrodeposition process such as bath temperature, reverse pulse plating parameters and the ratio of electrolyte concentrations is shown to the deposition kinetics and deposition uniformity in fine patterned regions and gap fill rate inside the microvia. Additionally, insight into the physics of via fill process is presented with secondary and tertiary current simulation efforts. Such efforts lead to show "smart" control of deposition rate at the top and bottom of via to avoid void formation. Finally, a parametric effect on grain size and the ensuing copper metallurgical characteristics of bulk copper is also shown to enable high reliability substrate packages for the IC packaging industry.