Silicon Carbide Integrated Circuit Chip

NASA Image and Video Library

2015-02-17

A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2008-01-01

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

AIN-Based Packaging for SiC High-Temperature Electronics

NASA Technical Reports Server (NTRS)

Savrun, Ender

2004-01-01

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Flat conductor cable for electrical packaging

NASA Technical Reports Server (NTRS)

Angele, W.

1972-01-01

Flat conductor cable (FCC) is relatively new, highly promising means for electrical packaging and system integration. FCC offers numerous desirable traits (weight, volume and cost savings, flexibility, high reliability, predictable and repeatable electrical characteristics) which make it extremely attractive as a packaging medium. FCC, today, finds wide application in everything from integration of lunar equipment to the packaging of electronics in nuclear submarines. Described are cable construction and means of termination, applicable specifications and standards, and total FCC systems. A list of additional sources of data is also included for more intensive study.

Japan's technology and manufacturing infrastructure

NASA Astrophysics Data System (ADS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-02-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Japan's technology and manufacturing infrastructure

NASA Technical Reports Server (NTRS)

Boulton, William R.; Meieran, Eugene S.; Tummala, Rao R.

1995-01-01

The JTEC panel found that, after four decades of development in electronics and manufacturing technologies, Japanese electronics companies are leaders in the development, support, and management of complex, low-cost packaging and assembly technologies used in the production of a broad range of consumer electronics products. The electronics industry's suppliers provide basic materials and equipment required for electronic packaging applications. Panelists concluded that some Japanese firms could be leading U.S. competitors by as much as a decade in these areas. Japan's technology and manufacturing infrastructure is an integral part of its microelectronics industry's success.

Electronic Router

NASA Technical Reports Server (NTRS)

Crusan, Jason

2005-01-01

Electronic Router (E-Router) is an application program for routing documents among the cognizant individuals in a government agency or other organization. E-Router supplants a prior 14 NASA Tech Briefs, May 2005 system in which paper documents were routed physically in packages by use of paper slips, packages could be lost, routing times were unacceptably long, tracking of packages was difficult, and there was a need for much photocopying. E-Router enables a user to create a digital package to be routed. Input accepted by E-Router includes the title of the package, the person(s) to whom the package is to be routed, attached files, and comments to reviewers. Electronic mail is used to notify reviewers of needed actions. The creator of the package can, at any time, see the status of the package in the routing structure. At the end of the routing process, E-Router keeps a record of the package and of approvals and/or concurrences of the reviewers. There are commercial programs that perform the general functions of E-Router, but they are more complicated. E-Router is Web-based, easy to use, and does not require the installation or use of client software.

Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2012-03-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surfacemount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions.

Information Technology.

ERIC Educational Resources Information Center

Marcum, Deanna; Boss, Richard

1983-01-01

Relates office automation to its application in libraries, discussing computer software packages for microcomputers performing tasks involved in word processing, accounting, statistical analysis, electronic filing cabinets, and electronic mail systems. (EJS)

Visualization of electronic density

DOE PAGES

Grosso, Bastien; Cooper, Valentino R.; Pine, Polina; ...

2015-04-22

An atom’s volume depends on its electronic density. Although this density can only be evaluated exactly for hydrogen-like atoms, there are many excellent numerical algorithms and packages to calculate it for other materials. 3D visualization of charge density is challenging, especially when several molecular/atomic levels are intertwined in space. We explore several approaches to 3D charge density visualization, including the extension of an anaglyphic stereo visualization application based on the AViz package to larger structures such as nanotubes. We will describe motivations and potential applications of these tools for answering interesting questions about nanotube properties.

Reliability of CCGA and PBGA assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2005-01-01

Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.

Custom electronic subsystems for the laboratory telerobotic manipulator

NASA Technical Reports Server (NTRS)

Glassell, R. L.; Butler, P. L.; Rowe, J. C.; Zimmermann, S. D.

1990-01-01

The National Aeronautics and Space Administration (NASA) Space Station Program presents new opportunities for the application of telerobotic and robotic systems. The Laboratory Telerobotic Manipulator (LTM) is a highly advanced 7 degrees-of-freedom (DOF) telerobotic/robotic manipulator. It was developed and built for the Automation Technology Branch at NASA's Langley Research Center (LaRC) for work in research and to demonstrate ground-based telerobotic manipulator system hardware and software systems for future NASA applications in the hazardous environment of space. The LTM manipulator uses an embedded wiring design with all electronics, motor power, and control and communication cables passing through the pitch-yaw differential joints. This design requires the number of cables passing through the pitch/yaw joint to be kept to a minimum. To eliminate the cables needed to carry each pitch-yaw joint's sensor data to the VME control computers, a custom-embedded electronics package for each manipulator joint was developed. The electronics package collects and sends the joint's sensor data to the VME control computers over a fiber optic cable. The electronics package consist of five individual subsystems: the VME Link Processor, the Joint Processor and the Joint Processor power supply in the joint module, the fiber optics communications system, and the electronics and motor power cabling.

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Microstructure and Sn crystal orientation evolution in Sn-3.5Ag lead-free solders in high temperature packaging applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhou, Bite; Muralidharan, Govindarajan; Kurumaddali, Nalini Kanth

2014-01-01

Understanding the reliability of eutectic Sn-3.5Ag lead-free solders in high temperature packaging applications is of significant interest in power electronics for the next generation electric grid. Large area (2.5mm 2.5mm) Sn-3.5Ag solder joints between silicon dies and direct bonded copper substrates were thermally cycled between 5 C and 200 C. Sn crystal orientation and microstructure evolution during thermal cycling were characterized by electron backscatter diffraction (EBSD) in scanning electron microscope (SEM). Comparisons are made between observed initial texture and microstructure and its evolution during thermal cycling. Gradual lattice rotation and grain boundary misorientation evolution suggested the continuous recrystallization mechanism. Recrystallizationmore » behavior was correlated with dislocation slip activities.« less

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2012-01-01

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

Reusable Rapid Prototyped Blunt Impact Simulator

DTIC Science & Technology

2016-08-01

for a nonclassical gun experimental application. 15. SUBJECT TERMS rapid prototype, additive manufacturing, reusable projectile, 3-axis accelerometer... gun -launched applications.1,2 SLS technology uses a bed of powdered material that is introduced to a laser. The laser is controlled by a computer to...in creating internal gun -hardened electronics for a variety of high-g applications, GTB developed an internal electronics package containing a COTS

NASA Electronic Parts and Packaging (NEPP) Program

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2008-01-01

This viewgraph presentation reviews NASA's Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission needs. The NEPP Program focuses on the reliability aspects of electronic devices. Three principal aspects to this reliability: (1) lifetime, (2) effects of space radiation and the space environment, and (3) creation and maintenance of the assurance support infrastructure required for success.

Barrier layers against oxygen transmission on the basis of electron beam cured methacrylated gelatin

NASA Astrophysics Data System (ADS)

Scherzer, Tom

1997-08-01

The development of barrier layers against oxygen transmission on the basis of radiation-curable methacrylated gelatin will be reported. The electron beam cured gelatin coatings show an extremely low oxygen permeability and a high resistance against boiling water. Moreover, the methacrylated gelatins possess good adhesion characteristics. Therefore, they are suited as barrier adhesives in laminates for food packaging applications. If substrate foils from biodegradable polymers are used, the development of completely biodegradable packaging materials seems to be possible.

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

CarbAl Heat Transfer Material

NASA Technical Reports Server (NTRS)

Fink, Richard

2015-01-01

The increasing use of power electronics, such as high-current semiconductor devices and modules, within space vehicles is driving the need to develop specialty thermal management materials in both the packaging of these discrete devices and the packaging of modules consisting of these device arrays. Developed by Applied Nanotech, Inc. (ANI), CarbAl heat transfer material is uniquely characterized by its low density, high thermal diffusivity, and high thermal conductivity. Its coefficient of thermal expansion (CTE) is similar to most power electronic materials, making it an effective base plate substrate for state-of-the-art silicon carbide (SiC) super junction transistors. The material currently is being used to optimize hybrid vehicle inverter packaging. Adapting CarbAl-based substrates to space applications was a major focus of the SBIR project work. In Phase I, ANI completed modeling and experimentation to validate its deployment in a space environment. Key parameters related to cryogenic temperature scaling of CTE, thermal conductivity, and mechanical strength. In Phase II, the company concentrated on improving heat sinks and thermally conductive circuit boards for power electronic applications.

Packaging and Embedded Electronics for the Next Generation

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

Accelerated thermal and mechanical testing of CSP assemblies

NASA Technical Reports Server (NTRS)

Ghaffarian, R.

2000-01-01

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.

Plastic packaged microcircuits: Quality, reliability, and cost issues

NASA Astrophysics Data System (ADS)

Pecht, Michael G.; Agarwal, Rakesh; Quearry, Dan

1993-12-01

Plastic encapsulated microcircuits (PEMs) find their main application in commercial and telecommunication electronics. The advantages of PEMs in cost, size, weight, performance, and market lead-time, have attracted 97% of the market share of worldwide microcircuit sales. However, PEMs have always been resisted in US Government and military applications due to the perception that PEM reliability is low. This paper surveys plastic packaging with respect to the issues of reliability, market lead-time, performance, cost, and weight as a means to guide part-selection and system-design.

Robust, Rework-able Thermal Electronic Packaging: Applications in High Power TR Modules for Space

NASA Technical Reports Server (NTRS)

Hoffman, James Patrick; Del Castillo, Linda; Hunter, Don; Miller, Jennifer

2012-01-01

The higher output power densities required of modern radar architectures, such as the proposed DESDynI [Deformation, Ecosystem Structure, and Dynamics of Ice] SAR [Synthetic Aperture Radar] Instrument (or DSI) require increasingly dense high power electronics. To enable these higher power densities, while maintaining or even improving hardware reliability, requires improvements in integrating advanced thermal packaging technologies into radar transmit/receive (TR) modules. New materials and techniques have been studied and are now being implemented side-by-side with more standard technology typically used in flight hardware.

Proceedings of the International Electronic Circuit Packaging Symposium (3rd) on Advances in Electronic Circuit Packaging Held at Boulder, Colorado on 15-17 August 1962. Volume 3,

DTIC Science & Technology

1963-01-01

the connector pin, which was then sol - dered at various levels of wire build up. It is proposed, with a slight modification of the connector terminal...sacrificial anode for galvanic protection of other metals. Aluminum Aluminum and its alloys show promise for applications in long-life oceano - graphic...section of a dumet weld lead. Calculations and actual heat measurements on the effects of welding and sol - dering within 0.060 in. of the component

A streaming multi-GPU implementation of image simulation algorithms for scanning transmission electron microscopy

DOE PAGES

Pryor, Alan; Ophus, Colin; Miao, Jianwei

2017-10-25

Simulation of atomic-resolution image formation in scanning transmission electron microscopy can require significant computation times using traditional methods. A recently developed method, termed plane-wave reciprocal-space interpolated scattering matrix (PRISM), demonstrates potential for significant acceleration of such simulations with negligible loss of accuracy. In this paper, we present a software package called Prismatic for parallelized simulation of image formation in scanning transmission electron microscopy (STEM) using both the PRISM and multislice methods. By distributing the workload between multiple CUDA-enabled GPUs and multicore processors, accelerations as high as 1000 × for PRISM and 15 × for multislice are achieved relative to traditionalmore » multislice implementations using a single 4-GPU machine. We demonstrate a potentially important application of Prismatic, using it to compute images for atomic electron tomography at sufficient speeds to include in the reconstruction pipeline. Prismatic is freely available both as an open-source CUDA/C++ package with a graphical user interface and as a Python package, PyPrismatic.« less

A streaming multi-GPU implementation of image simulation algorithms for scanning transmission electron microscopy.

PubMed

Pryor, Alan; Ophus, Colin; Miao, Jianwei

2017-01-01

Simulation of atomic-resolution image formation in scanning transmission electron microscopy can require significant computation times using traditional methods. A recently developed method, termed plane-wave reciprocal-space interpolated scattering matrix (PRISM), demonstrates potential for significant acceleration of such simulations with negligible loss of accuracy. Here, we present a software package called Prismatic for parallelized simulation of image formation in scanning transmission electron microscopy (STEM) using both the PRISM and multislice methods. By distributing the workload between multiple CUDA-enabled GPUs and multicore processors, accelerations as high as 1000 × for PRISM and 15 × for multislice are achieved relative to traditional multislice implementations using a single 4-GPU machine. We demonstrate a potentially important application of Prismatic , using it to compute images for atomic electron tomography at sufficient speeds to include in the reconstruction pipeline. Prismatic is freely available both as an open-source CUDA/C++ package with a graphical user interface and as a Python package, PyPrismatic .

A streaming multi-GPU implementation of image simulation algorithms for scanning transmission electron microscopy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pryor, Alan; Ophus, Colin; Miao, Jianwei

Simulation of atomic-resolution image formation in scanning transmission electron microscopy can require significant computation times using traditional methods. A recently developed method, termed plane-wave reciprocal-space interpolated scattering matrix (PRISM), demonstrates potential for significant acceleration of such simulations with negligible loss of accuracy. In this paper, we present a software package called Prismatic for parallelized simulation of image formation in scanning transmission electron microscopy (STEM) using both the PRISM and multislice methods. By distributing the workload between multiple CUDA-enabled GPUs and multicore processors, accelerations as high as 1000 × for PRISM and 15 × for multislice are achieved relative to traditionalmore » multislice implementations using a single 4-GPU machine. We demonstrate a potentially important application of Prismatic, using it to compute images for atomic electron tomography at sufficient speeds to include in the reconstruction pipeline. Prismatic is freely available both as an open-source CUDA/C++ package with a graphical user interface and as a Python package, PyPrismatic.« less

Diamond-based heat spreaders for power electronic packaging applications

NASA Astrophysics Data System (ADS)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging potential of the two heat-spreading solutions invoked was evaluated. This study was carried out within the framework of a French-American collaboration between the Electrical Engineering department of the University of Nebraska-Lincoln (United States, U.S.) and the Institute of Condensed Matter Chemistry of the University of Bordeaux (France). This study was financed by the Office of Naval Research in the U.S., and by the Region Aquitaine in France.

MEMS packaging: state of the art and future trends

NASA Astrophysics Data System (ADS)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

QmeQ 1.0: An open-source Python package for calculations of transport through quantum dot devices

NASA Astrophysics Data System (ADS)

Kiršanskas, Gediminas; Pedersen, Jonas Nyvold; Karlström, Olov; Leijnse, Martin; Wacker, Andreas

2017-12-01

QmeQ is an open-source Python package for numerical modeling of transport through quantum dot devices with strong electron-electron interactions using various approximate master equation approaches. The package provides a framework for calculating stationary particle or energy currents driven by differences in chemical potentials or temperatures between the leads which are tunnel coupled to the quantum dots. The electronic structures of the quantum dots are described by their single-particle states and the Coulomb matrix elements between the states. When transport is treated perturbatively to lowest order in the tunneling couplings, the possible approaches are Pauli (classical), first-order Redfield, and first-order von Neumann master equations, and a particular form of the Lindblad equation. When all processes involving two-particle excitations in the leads are of interest, the second-order von Neumann approach can be applied. All these approaches are implemented in QmeQ. We here give an overview of the basic structure of the package, give examples of transport calculations, and outline the range of applicability of the different approximate approaches.

Printed electronic on flexible and glass substrates

NASA Astrophysics Data System (ADS)

Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna

2010-09-01

Organic electronics is a platform technology that enables multiple applications based on organic electronics but varied in specifications. Organic electronics is based on the combination of new materials and cost-effective, large area production processes that provide new fields of application. Organic electronic by its size, weight, flexibility and environmental friendliness electronics enables low cost production of numerous electrical components and provides for such promising fields of application as: intelligent packaging, low cost RFID, flexible solar cells, disposable diagnostic devices or games, and printed batteries [1]. The paper presents results of inkjetted electronics elements on flexible and glass substrates. The investigations was target on characterizing shape, surface and geometry of printed structures. Variety of substrates were investigated, within some, low cost, non specialized substrate, design for other purposes than organic electronic.

MEMS Applications in Aerodynamic Measurement Technology

NASA Technical Reports Server (NTRS)

Reshotko, E.; Mehregany, M.; Bang, C.

1998-01-01

Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.

The NASA Electronic Parts and Packaging (NEPP) Program: Results and Direction

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.

2007-01-01

The NASA Electronic Parts and Packaging (NEPP) Program's mission is to provide guidance to NASA for the selection and application of microelectronic technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. This viewgraph presentation reviews the NEPP program's goals and objectives, and reviews many of the missions that the NEPP program has impacted, both in and out of NASA. Also included are examples of the evaluation that the program performed.

76 FR 39813 - Notice of Funding Availability of Applications (NOFA) for Section 514 Farm Labor Housing Loans...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-07-07

...- application. If leveraged funds are in the form of tax credits, the applicant must document that it has... provide an electronic copy of all hard copy forms and documents submitted in the pre-application/ application package as requested by this Notice. The forms and documents must be submitted to the appropriate...

Electronic packaging: new results in singulation by Laser Microjet

NASA Astrophysics Data System (ADS)

Wagner, Frank; Sibailly, Ochelio; Richerzhagen, Bernold

2004-07-01

Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today"s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Special Section on InterPACK 2017—Part 1

DOE PAGES

Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan; ...

2018-03-02

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly togethermore » with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.« less

Special Section on InterPACK 2017—Part 1

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mysore, Kaushik; Narumanchi, Sreekant; Dede, Ercan

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly togethermore » with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.« less

Guest Editorial: Special Section on InterPACK 2017 - Part 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

Narumanchi, Sreekant V; Mysore, Kaushik; Dede, Ercan

InterPACK is a premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of micro-electronics packaging. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD) founded in 1992 as an ASME-JSME joint biannual conference. Rapid changes in the semiconductor landscape together with findings from InterPACK Pathfinding workshop (IPW) in 2016 led to a significant reset of InterPACK conference priorities and focus to comprehensively address needs of the InterPACK community. As a result, starting in 2017, InterPACK has become an annual conference and the scope of the conference has increased significantly togethermore » with a systems-focus to include some of the most cutting-edge topics in electronics packaging, device integration, and reliability. These topics are organized across five different tracks: (1) heterogeneous integration: microsystems with diverse functionality, (2) servers of the future, (3) structural and physical health monitoring, (4) energy conversion and storage, and (5) transportation: autonomous and electric vehicles.« less

15 CFR 30.5 - Electronic Export Information filing application and certification processes and standards.

Code of Federal Regulations, 2011 CFR

2011-01-01

... through the AES. A service center shall be certified to transmit electronically to the AES. The USPPI, authorized agent, or service center may use a software package designed by a certified vendor to file EEI... software vendor or service center shall complete certification testing. Service centers may only transmit...

Flexible packaging of solid-state integrated circuit chips with elastomeric microfluidics

PubMed Central

Zhang, Bowei; Dong, Quan; Korman, Can E.; Li, Zhenyu; Zaghloul, Mona E.

2013-01-01

A flexible technology is proposed to integrate smart electronics and microfluidics all embedded in an elastomer package. The microfluidic channels are used to deliver both liquid samples and liquid metals to the integrated circuits (ICs). The liquid metals are used to realize electrical interconnects to the IC chip. This avoids the traditional IC packaging challenges, such as wire-bonding and flip-chip bonding, which are not compatible with current microfluidic technologies. As a demonstration we integrated a CMOS magnetic sensor chip and associate microfluidic channels on a polydimethylsiloxane (PDMS) substrate that allows precise delivery of small liquid samples to the sensor. Furthermore, the packaged system is fully functional under bending curvature radius of one centimetre and uniaxial strain of 15%. The flexible integration of solid-state ICs with microfluidics enables compact flexible electronic and lab-on-a-chip systems, which hold great potential for wearable health monitoring, point-of-care diagnostics and environmental sensing among many other applications.

Corrosion of silicon integrated circuits and lifetime predictions in implantable electronic devices.

PubMed

Vanhoestenberghe, A; Donaldson, N

2013-06-01

Corrosion is a prime concern for active implantable devices. In this paper we review the principles underlying the concepts of hermetic packages and encapsulation, used to protect implanted electronics, some of which remain widely overlooked. We discuss how technological advances have created a need to update the way we evaluate the suitability of both protection methods. We demonstrate how lifetime predictability is lost for very small hermetic packages and introduce a single parameter to compare different packages, with an equation to calculate the minimum sensitivity required from a test method to guarantee a given lifetime. In the second part of this paper, we review the literature on the corrosion of encapsulated integrated circuits (ICs) and, following a new analysis of published data, we propose an equation for the pre-corrosion lifetime of implanted ICs, and discuss the influence of the temperature, relative humidity, encapsulation and field-strength. As any new protection will be tested under accelerated conditions, we demonstrate the sensitivity of acceleration factors to some inaccurately known parameters. These results are relevant for any application of electronics working in a moist environment. Our comparison of encapsulation and hermetic packages suggests that both concepts may be suitable for future implants.

Analysis of Plane-Parallel Electron Beam Propagation in Different Media by Numerical Simulation Methods

NASA Astrophysics Data System (ADS)

Miloichikova, I. A.; Bespalov, V. I.; Krasnykh, A. A.; Stuchebrov, S. G.; Cherepennikov, Yu. M.; Dusaev, R. R.

2018-04-01

Simulation by the Monte Carlo method is widely used to calculate the character of ionizing radiation interaction with substance. A wide variety of programs based on the given method allows users to choose the most suitable package for solving computational problems. In turn, it is important to know exactly restrictions of numerical systems to avoid gross errors. Results of estimation of the feasibility of application of the program PCLab (Computer Laboratory, version 9.9) for numerical simulation of the electron energy distribution absorbed in beryllium, aluminum, gold, and water for industrial, research, and clinical beams are presented. The data obtained using programs ITS and Geant4 being the most popular software packages for solving the given problems and the program PCLab are presented in the graphic form. A comparison and an analysis of the results obtained demonstrate the feasibility of application of the program PCLab for simulation of the absorbed energy distribution and dose of electrons in various materials for energies in the range 1-20 MeV.

An Overview of Wide Bandgap Silicon Carbide Sensors and Electronics Development at NASA Glenn Research Center

NASA Technical Reports Server (NTRS)

Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Okojie, Robert S.; Chen, Liangyu; Spry, D.; Trunek, A.

2007-01-01

A brief overview is presented of the sensors and electronics development work ongoing at NASA Glenn Research Center which is intended to meet the needs of future aerospace applications. Three major technology areas are discussed: 1) high temperature SiC electronics, 2) SiC gas sensor technology development, and 3) packaging of harsh environment devices. Highlights of this work include world-record operation of SiC electronic devices including 500?C JFET transistor operation with excellent properties, atomically flat SiC gas sensors integrated with an on-chip temperature detector/heater, and operation of a packaged AC amplifier. A description of the state-of-the-art is given for each topic. It is concluded that significant progress has been made and that given recent advancements the development of high temperature smart sensors is envisioned.

Cooling system for electronic components

DOEpatents

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

2015-12-15

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Cooling system for electronic components

DOEpatents

Anderl, William James; Colgan, Evan George; Gerken, James Dorance; Marroquin, Christopher Michael; Tian, Shurong

2016-05-17

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

78 FR 17776 - Community Volunteer Income Tax Assistance (VITA) Matching Grant Program-Availability of...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-03-22

... Grant Program. DATES: Application packages are available electronically from the IRS on May 1, 2013 by visiting: IRS.gov (key word search--``VITA Grant'') or through Grants.gov . The deadline for submitting an application to the IRS for the Community VITA Matching Grant Program is May 31, 2013. All applications must be...

The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

NASA Astrophysics Data System (ADS)

Liu, Weiping; Lee, Ning-Cheng

2007-07-01

The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for lead-free applications. However, BGA and CSP solder joints using SAC alloys are fragile and prone to premature interfacial failure, especially under shock loading. To further enhance impact reliability, a family of SAC alloys doped with a small amount of additives such as Mn, Ce, Ti, Bi, and Y was developed. The effects of doping elements on drop test performance, creep resistance, and microstructure of the solder joints were investigated, and the solder joints made with the modified alloys exhibited significantly higher impact reliability.

Depolymerization of Trityl End-Capped Poly(Ethyl Glyoxylate): Potential Applications in Smart Packaging.

PubMed

Fan, Bo; Salazar, Rómulo; Gillies, Elizabeth R

2018-06-01

The temperature-dependent depolymerization of self-immolative poly(ethyl glyoxylate) (PEtG) capped with triphenylmethyl (trityl) groups is studied and its potential application for smart packaging is explored. PEtGs with four different trityl end-caps are prepared and found to undergo depolymerization to volatile products from the solid state at different rates depending on temperature and the electron-donating substituents on the trityl aromatic rings. Through the incorporation of hydrophobic dyes including Nile red and IR-780, the depolymerization is visualized as a color change of the dye as it changes from a dispersed to aggregated state. The ability of this platform to provide information on thermal history through an easily readable signal makes it promising in smart packaging applications for sensitive products such a food and other cargo that is susceptible to degradation. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

77 FR 3386 - Export and Reexport License Requirements for Certain Microwave and Millimeter Wave Electronic...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-01-24

... electronic components. The two components are packaged high electron mobility transistors and packaged..., 2012, FR Doc. 2012- 135). The two components are packaged high electron mobility transistors (HEMT) and...

Dimpled ball grid array process development for space flight applications

NASA Technical Reports Server (NTRS)

Barr, S. L.; Mehta, A.

2000-01-01

A 472 dimpled ball grid array (D-BGA) package has not been used in past space flight environments, therefore it was necessary to develop a process that would yield robust and reliable solder joints. The process developing assembly, inspection and rework techniques, were verified by conducting environmental tests. Since the 472 D-BGA packages passed the above environmental tests within the specifications, the process was successfully developed for space flight electronics.

Lithium-Ion Technology for Aerospace Applications- Advancing Battery Management Electronics

NASA Astrophysics Data System (ADS)

Gitzendanner, R.; Jones, E.; Deory, C.; Carmen, D.

2005-05-01

Lithium-ion technology offers a unique, weight and volume saving, solution to the power storage needs of space applications. With higher energy and power densities than conventional technologies, such as Nickel-Hydrogen (Ni-H) and Nickel/Cadmium (Ni- Cd), and comparable cycle life and reliability, Lithium-ion technology is gaining interest in many space applications. As the demand for Lithium-ion batteries with high reliability and long life increases, the need for battery management electronics, including individual cell balancing and monitoring, becomes apparent. With onboard electronics, the cells are monitored individually, and are protected from over charge or over discharge by way of integral protection circuitry. State of Charge, State of Health and other useful telemetry can also be calculated by the integrated electronics and reported to the application. Lab-based, and real-life, testing and use of these battery systems has shown the advantages of an integrated electronics package.

An investigation of nonuniform dose deposition from an electron beam

NASA Astrophysics Data System (ADS)

Lilley, William; Luu, Kieu X.

1994-08-01

In a search for an explanation of nonuniform electron-beam dose deposition, the integrated tiger series (ITS) of coupled electron/photon Monte Carlo transport codes was used to calculate energy deposition in the package materials of an application-specific integrated circuit (ASIC) while the thicknesses of some of the materials were varied. The thicknesses of three materials that were in the path of an electron-beam pulse were varied independently so that analysis could determine how the radiation dose measurements using thermoluminescent dosimeters (TLD's) would be affected. The three materials were chosen because they could vary during insertion of the die into the package or during the process of taking dose measurements. The materials were aluminum, HIPEC (a plastic), and silver epoxy. The calculations showed that with very small variations in thickness, the silver epoxy had a large effect on the dose uniformity over the area of the die.

The Ettention software package.

PubMed

Dahmen, Tim; Marsalek, Lukas; Marniok, Nico; Turoňová, Beata; Bogachev, Sviatoslav; Trampert, Patrick; Nickels, Stefan; Slusallek, Philipp

2016-02-01

We present a novel software package for the problem "reconstruction from projections" in electron microscopy. The Ettention framework consists of a set of modular building-blocks for tomographic reconstruction algorithms. The well-known block iterative reconstruction method based on Kaczmarz algorithm is implemented using these building-blocks, including adaptations specific to electron tomography. Ettention simultaneously features (1) a modular, object-oriented software design, (2) optimized access to high-performance computing (HPC) platforms such as graphic processing units (GPU) or many-core architectures like Xeon Phi, and (3) accessibility to microscopy end-users via integration in the IMOD package and eTomo user interface. We also provide developers with a clean and well-structured application programming interface (API) that allows for extending the software easily and thus makes it an ideal platform for algorithmic research while hiding most of the technical details of high-performance computing. Copyright © 2015 Elsevier B.V. All rights reserved.

NASA Electronic Parts and Packaging (NEPP) Program - Update

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

DOE DISS/ET pilot system

DOE Office of Scientific and Technical Information (OSTI.GOV)

Strait, R.S.; Wagner, E.E.

1994-07-01

The US Department of Energy (DOE) Office of Safeguards and Security initiated the DOE Integrated Security System / Electronic Transfer (DISS/ET) for the purpose of reducing the time required to process security clearance requests. DISS/ET will be an integrated system using electronic commerce technologies for the collection and processing of personnel security clearance data, and its transfer between DOE local security clearance offices, DOE Operations Offices, and the Office of Personnel Management. The system will use electronic forms to collect clearance applicant data. The forms data will be combined with electronic fingerprint images and packaged in a secure encrypted electronicmore » mail envelope for transmission across the Internet. Information provided by the applicant will be authenticated using digital signatures. All processing will be done electronically.« less

PAINeT: An object-oriented software package for simulations of flow-field, transport coefficients and flux terms in non-equilibrium gas mixture flows

NASA Astrophysics Data System (ADS)

Istomin, V. A.

2018-05-01

The software package Planet Atmosphere Investigator of Non-equilibrium Thermodynamics (PAINeT) has been devel-oped for studying the non-equilibrium effects associated with electronic excitation, chemical reactions and ionization. These studies are necessary for modeling process in shock tubes, in high enthalpy flows, in nozzles or jet engines, in combustion and explosion processes, in modern plasma-chemical and laser technologies. The advantages and possibilities of the package implementation are stated. Within the framework of the package implementation, based on kinetic theory approximations (one-temperature and state-to-state approaches), calculations are carried out, and the limits of applicability of a simplified description of shock-heated air flows and any other mixtures chosen by the user are given. Using kinetic theory algorithms, a numerical calculation of the heat fluxes and relaxation terms can be performed, which is necessary for further comparison of engineering simulation with experi-mental data. The influence of state-to-state distributions over electronic energy levels on the coefficients of thermal conductivity, diffusion, heat fluxes and diffusion velocities of the components of various gas mixtures behind shock waves is studied. Using the software package the accuracy of different approximations of the kinetic theory of gases is estimated. As an example state-resolved atomic ionized mixture of N/N+/O/O+/e- is considered. It is shown that state-resolved diffusion coefficients of neutral and ionized species vary from level to level. Comparing results of engineering applications with those given by PAINeT, recommendations for adequate models selection are proposed.

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2010-02-01

Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

Modular electronics packaging system

NASA Technical Reports Server (NTRS)

Hunter, Don J. (Inventor)

2001-01-01

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Devoto, D.

2014-11-01

The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.

The NASA Electronic Parts and Packaging (NEPP) Program: Overview and Update FY15 and Beyond

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

The NASA Electronic Parts and Packaging (NEPP) program, and its subset the NASA Electronic Parts Assurance Group (NEPAG), are NASA's point-of-contacts for reliability and radiation tolerance of electrical, electronic, and electromechanical (EEE) parts and their packages. This presentation includes a Fiscal Year 2015 program overview.

Electronics for a focal plane crystal spectrometer

NASA Technical Reports Server (NTRS)

Goeke, R. F.

1978-01-01

The HEAO-B program forced the usual constraints upon the spacecraft experiment electronics: high reliability, low power consumption, and tight packaging at reasonable cost. The programmable high voltage power supplies were unique in both application and simplicity of manufacture. The hybridized measurement chain is a modification of that used on the SAS-C program; the charge amplifier design in particular shows definite improvement in performance over previous work.

Practical application of HgI2 detectors to a space-flight scanning electron microscope

NASA Technical Reports Server (NTRS)

Bradley, J. G.; Conley, J. M.; Albee, A. L.; Iwanczyk, J. S.; Dabrowski, A. J.

1989-01-01

Mercuric iodide X-ray detectors have been undergoing tests in a prototype scanning electron microscope system being developed for unmanned space flight. The detector program addresses the issues of geometric configuration in the SEM, compact packaging that includes separate thermoelectric coolers for the detector and FET, X-ray transparent hermetic encapsulation and electrical contacts, and a clean vacuum environment.

A new algorithm to handle finite nuclear mass effects in electronic calculations: the ISOTOPE program.

PubMed

Gonçalves, Cristina P; Mohallem, José R

2004-11-15

We report the development of a simple algorithm to modify quantum chemistry codes based on the LCAO procedure, to account for the isotope problem in electronic structure calculations. No extra computations are required compared to standard Born-Oppenheimer calculations. An upgrade of the Gamess package called ISOTOPE is presented, and its applicability is demonstrated in some examples.

Terahertz MMICs and Antenna-in-Package Technology at 300 GHz for KIOSK Download System

NASA Astrophysics Data System (ADS)

Tajima, Takuro; Kosugi, Toshihiko; Song, Ho-Jin; Hamada, Hiroshi; El Moutaouakil, Amine; Sugiyama, Hiroki; Matsuzaki, Hideaki; Yaita, Makoto; Kagami, Osamu

2016-12-01

Toward the realization of ultra-fast wireless communications systems, the inherent broad bandwidth of the terahertz (THz) band is attracting attention, especially for short-range instant download applications. In this paper, we present our recent progress on InP-based THz MMICs and packaging techniques based on low-temperature co-fibered ceramic (LTCC) technology. The transmitter MMICs are based on 80-nm InP-based high electron mobility transistors (HEMTs). Using the transmitter packaged in an E-plane split-block waveguide and compact lens receiver packaged in LTCC multilayered substrates, we tested wireless data transmission up to 27 Gbps with the simple amplitude key shifting (ASK) modulation scheme. We also present several THz antenna-in-packaging solutions based on substrate integrated waveguide (SIW) technology. A vertical hollow (VH) SIW was applied to a compact medium-gain SIW antenna and low-loss interconnection integrated in LTCC multi-layer substrates. The size of the LTCC antennas with 15-dBi gain is less than 0.1 cm3. For feeding the antenna, we investigated an LTCC-integrated transition and polyimide transition to LTCC VH SIWs. These transitions exhibit around 1-dB estimated loss at 300 GHz and more than 35 GHz bandwidth with 10-dB return loss. The proposed package solutions make antennas and interconnections easy to integrate in a compact LTCC package with an MMIC chip for practical applications.

NASA EEE Parts and NASA Electronic Parts and Packaging (NEPP) Program Update 2018

NASA Technical Reports Server (NTRS)

Label, Kenneth A.; Sampson, Michael J.; Pellish, Jonathan A.; Majewicz, Peter J.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) Program and NASA Electronic Parts Assurance Group (NEPAG) are NASAs point-of-contacts for reliability and radiation tolerance of EEE parts and their packages. This presentation includes an FY18 program overview.

Advanced Interconnect Roadmap for Space Applications

NASA Technical Reports Server (NTRS)

Galbraith, Lissa

1999-01-01

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

A systems approach to solder joint fatigue in spacecraft electronic packaging

NASA Technical Reports Server (NTRS)

Ross, R. G., Jr.

1991-01-01

Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.

Functional Requirements for an Electronic Work Package System

DOE Office of Scientific and Technical Information (OSTI.GOV)

Oxstrand, Johanna H.

This document provides a set of high level functional requirements for a generic electronic work package (eWP) system. The requirements have been identified by the U.S. nuclear industry as a part of the Nuclear Electronic Work Packages - Enterprise Requirements (NEWPER) initiative. The functional requirements are mainly applied to eWP system supporting Basic and Moderate types of smart documents, i.e., documents that have fields for recording input such as text, dates, numbers, and equipment status, and documents which incorporate additional functionalities such as form field data “type“ validation (e.g. date, text, number, and signature) of data entered and/or self-populate basicmore » document information (usually from existing host application meta data) on the form when the user first opens it. All the requirements are categorized by the roles; Planner, Supervisor, Craft, Work Package Approval Reviewer, Operations, Scheduling/Work Control, and Supporting Functions. The categories Statistics, Records, Information Technology are also included used to group the requirements. All requirements are presented in Section 2 through Section 11. Examples of more detailed requirements are provided for the majority of high level requirements. These examples are meant as an inspiration to be used as each utility goes through the process of identifying their specific requirements. The report’s table of contents provides a summary of the high level requirements.« less

The Assurance Challenges of Advanced Packaging Technologies for Electronics

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2010-01-01

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Packaging of electronic modules

NASA Technical Reports Server (NTRS)

Katzin, L.

1966-01-01

Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

BOK-Printed Electronics

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2013-01-01

The use of printed electronics technologies (PETs), 2D or 3D printing approaches either by conventional electronic fabrication or by rapid graphic printing of organic or nonorganic electronic devices on various small or large rigid or flexible substrates, is projected to grow exponentially in commercial industry. This has provided an opportunity to determine whether or not PETs could be applicable for low volume and high-reliability applications. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the current status of organic and printed electronics technologies. It reviews three key industry roadmaps- on this subject-OE-A, ITRS, and iNEMI-each with a different name identification for this emerging technology. This followed by a brief review of the status of the industry on standard development for this technology, including IEEE and IPC specifications. The report concludes with key technologies and applications and provides a technology hierarchy similar to those of conventional microelectronics for electronics packaging. Understanding key technology roadmaps, parameters, and applications is important when judicially selecting and narrowing the follow-up of new and emerging applicable technologies for evaluation, as well as the low risk insertion of organic, large area, and printed electronics.

Software Applications on the Peregrine System | High-Performance Computing

Science.gov Websites

programming and optimization. Gaussian Chemistry Program for calculating molecular electronic structure and Materials Science Open-source classical molecular dynamics program designed for massively parallel systems framework Q-Chem Chemistry ab initio quantum chemistry package for predictin molecular structures

Monolithic ceramic capacitors for high reliability applications

NASA Technical Reports Server (NTRS)

Thornley, E. B.

1981-01-01

Monolithic multi-layer ceramic dielectric capacitors are widely used in high reliability applications in spacecraft, launch vehicles, and military equipment. Their relatively low cost, wide range of values, and package styles are attractive features that result in high usage in electronic circuitry in these applications. Design and construction of monolithic ceramic dielectric capacitors, defects that can lead to failure, and methods for defect detection that are being incorporated in military specifications are discussed.

Halloysite Nanocapsules Containing Thyme Essential Oil: Preparation, Characterization, and Application in Packaging Materials.

PubMed

Jang, Si-Hoon; Jang, So-Ri; Lee, Gyeong-Min; Ryu, Jee-Hoon; Park, Su-Il; Park, No-Hyung

2017-09-01

Halloysite nanotubes (HNTs), which are natural nanomaterials, have a hollow tubular structure with about 15 nm inner and 50 nm outer diameters. Because of their tubular shape, HNTs loaded with various materials have been investigated as functional nanocapsules. In this study, thyme essential oil (TO) was encapsulated successfully in HNTs using vacuum pulling methods, followed by end-capping or a layer-by-layer surface coating process for complete encapsulation. Nanocapsules loaded with TO were mixed with flexographic ink and coated on a paper for applications as food packaging materials. Scanning electron microscopy and transmission electron microscopy were used to characterize the morphology of the nanocapsules and to confirm the TO loading of the nanocapsules. Fourier transform infrared spectroscopy and thermogravimetric analyses analysis were used to complement the structural information. In addition, the controlled release of TO from the nanocapsules showed sustained release properties over a period of many days. The results reveal that the release properties of TO in these nanocapsules could be controlled by surface modifications such as end-capping and/or surface coating of bare nanocapsules. The packaging paper with TO-loaded HNT capsules was effective in eliminating against Escherichia coli during the first 5 d and showed strong antibacterial activity for about 10 d. © 2017 Institute of Food Technologists®.

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2010 CFR

2010-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2014 CFR

2014-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2013 CFR

2013-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2011 CFR

2011-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

21 CFR 1314.110 - Reports for mail-order sales.

Code of Federal Regulations, 2012 CFR

2012-04-01

... Administration, submit the report in electronic form, either via computer disk or direct electronic data... units (e.g., 100 doses per package); (11) Package type (blister pack, etc.); (12) Number of packages...

Metastable Polymers for On Demand Transient Electronic Packaging

DTIC Science & Technology

2018-01-17

a triggerable polymer for engineering applications. 25 Approved for public release; distribution is unlimited. 6 REFERENCES (1) Aso, C.; Tagami, S...R. Advanced Materials 2014, 26, 7637. (4) Ito, H.; Willson, C. G. Polymer Engineering & Science 1983, 23, 1012. (5) Ito, H.; England, W. P.; Ueda, M

76 FR 12729 - Cambridge Environmental Inc; Transfer of Data

Federal Register 2010, 2011, 2012, 2013, 2014

2011-03-08

...) and/ or electronic form. Due dates for each data package and/or assessment and/or project shall be...; Transfer of Data AGENCY: Environmental Protection Agency (EPA). ACTION: Notice. SUMMARY: This notice... evaluating assessments. This includes evaluating the applicability of the data and methods used in the...

Laser applications in advanced chip packaging

NASA Astrophysics Data System (ADS)

Müller, Dirk; Held, Andrew; Pätzel, Rainer; Clark, Dave; van Nunen, Joris

2016-03-01

While applications such as drilling μ-vias and laser direct imaging have been well established in the electronics industry, the mobile device industry's push for miniaturization is generating new demands for packaging technologies that allow for further reduction in feature size while reducing manufacturing cost. CO lasers have recently become available and their shorter wavelength allows for a smaller focus and drilling hole diameters down to 25μm whilst keeping the cost similar to CO2 lasers. Similarly, nanosecond UV lasers have gained significantly in power, become more reliable and lower in cost. On a separate front, the cost of ownership reduction for Excimer lasers has made this class of lasers attractive for structuring redistribution layers of IC substrates with feature sizes down to 2μm. Improvements in reliability and lower up-front cost for picosecond lasers is enabling applications that previously were only cost effective with mechanical means or long-pulsed lasers. We can now span the gamut from 100μm to 2μm for via drilling and can cost effectively structure redistribution layers with lasers instead of UV lamps or singulate packages with picosecond lasers.

Novel silver-based nanoclay as an antimicrobial in polylactic acid food packaging coatings.

PubMed

Busolo, Maria A; Fernandez, Patricia; Ocio, Maria J; Lagaron, Jose M

2010-11-01

This paper presents a comprehensive performance study of polylactic acid (PLA) biocomposites, obtained by solvent casting, containing a novel silver-based antimicrobial layered silicate additive for use in active food packaging applications. The silver-based nanoclay showed strong antimicrobial activity against Gram-negative Salmonella spp. Despite the fact that no exfoliation of the silver-based nanoclay in PLA was observed, as suggested by transmission electron microscopy (TEM) and wide angle X-ray scattering (WAXS) experiments, the additive dispersed nicely throughout the PLA matrix to a nanoscale, yielding nanobiocomposites. The films were highly transparent with enhanced water barrier and strong biocidal properties. Silver migration from the films to a slightly acidified water medium, considered an aggressive food simulant, was measured by stripping voltammetry. Silver migration accelerated after 6 days of exposure. Nevertheless, the study suggests that migration levels of silver, within the specific migration levels referenced by the European Food Safety Agency (EFSA), exhibit antimicrobial activity, supporting the potential application of this biocidal additive in active food-packaging applications to improve food quality and safety.

Characterizing the temperature dependence of electronic packaging-material properties

NASA Astrophysics Data System (ADS)

Fu, Chia-Yu; Ume, Charles

1995-06-01

A computer-controlled, temperature-dependent material characterization system has been developed for thermal deformation analysis in electronic packaging applications, especially for printed wiring assembly warpage study. For fiberglass-reinforced epoxy (FR-4 type) material, the Young's moduli decrease to as low as 20-30% of the room-temperature values, while the shear moduli decrease to as low as 60-70% of the room-temperature values. The electrical resistance strain gage technique was used in this research. The test results produced overestimated values in property measurements, and this was shown in a case study. A noncontact strau]n measurement technique (laser extensometer) is now being used to measure these properties. Discrepancies of finite-element warpage predictions using different property values increase as the temperature increases from the stress-free temperature.

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

PubMed Central

Maxa, Jacob; Novikov, Andrej; Nowottnick, Mathias

2017-01-01

Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

Diode Lasers used in Plastic Welding and Selective Laser Soldering - Applications and Products

NASA Astrophysics Data System (ADS)

Reinl, S.

Aside from conventional welding methods, laser welding of plastics has established itself as a proven bonding method. The component-conserving and clean process offers numerous advantages and enables welding of sensitive assemblies in automotive, electronic, medical, human care, food packaging and consumer electronics markets. Diode lasers are established since years within plastic welding applications. Also, soft soldering using laser radiation is becoming more and more significant in the field of direct diode laser applications. Fast power controllability combined with a contactless temperature measurement to minimize thermal damage make the diode laser an ideal tool for this application. These advantages come in to full effect when soldering of increasingly small parts in temperature sensitive environments is necessary.

Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.

PubMed

Schuettler, Martin; Kohler, Fabian; Ordonez, Juan S; Stieglitz, Thomas

2012-01-01

Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.

Polyethylene glycol grafted polyethylene: a versatile platform for nonmigratory active packaging applications.

PubMed

Barish, Jeffrey A; Goddard, Julie M

2011-01-01

Nonmigratory active packaging, in which bioactive components are tethered to the package, offers the potential to reduce the need for additives in food products while maintaining safety and quality. A challenge in developing nonmigratory active packaging materials is the loss of biomolecular activity that can occur when biomolecules are immobilized. In this work, we describe a method in which a biocompatible polymer (polyethylene glycol, PEG) is grafted from the surface of ozone-treated low-density polyethylene (LDPE) resulting in a surface functionalized polyethylene to which a range of amine-terminated bioactive molecules can be immobilized. Free radical graft polymerization is used to graft PEG onto the LDPE surface, followed by immobilization of ethylenediamine onto the PEG tether. Ethylenediamine was used to demonstrate that amine-terminated molecules could be covalently attached to the PEG-grafted film. Changes in surface chemistry and topography were measured by attenuated total reflectance Fourier transform infrared spectroscopy, contact angle, atomic force microscopy, scanning electron microscopy, and X-ray photoelectron spectroscopy. We demonstrate the ability to graft PEG onto the surface of polymer packaging films by free radical graft polymerization, and to covalently link an amine-terminated molecule to the PEG tether, demonstrating that amine-terminated bioactive compounds (such as peptides, enzymes, and some antimicrobials) can be immobilized onto PEG-grafted LDPE in the development of nonmigratory active packaging.   Nonmigratory active packaging offers the potential for improving food safety and quality while minimizing the migration of the active agent into food. In this paper, we describe a technique to modify polyethylene packaging films such that active agents can be covalently immobilized by a biocompatible tether. Such a technique can be adapted to a number of applications such as antimicrobial, antioxidant, or immobilized enzyme active packaging. © 2011 Institute of Food Technologists®

GT-SUPREEM: the Georgia Tech summer undergraduate packaging research and engineering experience for minorities

NASA Astrophysics Data System (ADS)

May, Gary S.

1996-07-01

The Georgia Tech SUmmer Undergraduate Packaging Research and Engineering Experience for Minorities (GT-SUPREEM) is an eight-week summer program designed to attract qualified minority students to pursue graduate degrees in packaging- related disciplines. The program is conducted under the auspices of the Georgia Tech Engineering Research Center in Low-Cost Electronic Packaging, which is sponsored by the National Science Foundation. In this program, nine junior and senior level undergraduate students are selected on a nationwide basis and paired with a faculty advisor to undertake research projects in the Packaging Research CEnter. The students are housed on campus and provided with a $DLR3,000 stipend and a travel allowance. At the conclusion of the program, the students present both oral and written project summaries. It is anticipated that this experience will motivate these students to become applicants for graduate study in ensuring years. This paper will provide an overview of the GT-SUPREEM program, including student research activities, success stories, lessons learned, and overall program outlook.

Control of lipid oxidation by nonmigratory active packaging films prepared by photoinitiated graft polymerization.

PubMed

Tian, Fang; Decker, Eric A; Goddard, Julie M

2012-08-08

Transition metal-promoted oxidation impacts the quality, shelf life, and nutrition of many packaged foods. Metal-chelating active packaging therefore offers a means to protect foods against oxidation. Herein, we report the development and characterization of nonmigratory metal-chelating active packaging. To prepare the films, carboxylic acids were grafted onto the surfaces of polypropylene films by photoinitiated graft polymerization of acrylic acid. Attenuated total reflectance/Fourier transform infrared spectroscopy, contact angle, scanning electron microscopy, and iron-chelating assay were used to characterize film properties. Graft polymerization yielded a carboxylic acid density of 68.67 ± 9.99 nmol per cm(2) film, with ferrous iron-chelating activity of 71.07 ± 12.95 nmol per cm(2). The functionalized films extended the lag phase of lipid oxidation in a soybean oil-in-water emulsion system from 2 to 9 days. The application of such nonmigratory active packaging films represents a promising approach to reduce additive use while maintaining food quality.

Fully Packaged Carbon Nanotube Supercapacitors by Direct Ink Writing on Flexible Substrates.

PubMed

Chen, Bolin; Jiang, Yizhou; Tang, Xiaohui; Pan, Yayue; Hu, Shan

2017-08-30

The ability to print fully packaged integrated energy storage components (e.g., supercapacitors) is of critical importance for practical applications of printed electronics. Due to the limited variety of printable materials, most studies on printed supercapacitors focus on printing the electrode materials but rarely the full-packaged cell. This work presents for the first time the printing of a fully packaged single-wall carbon nanotube-based supercapacitor with direct ink writing (DIW) technology. Enabled by the developed ink formula, DIW setup, and cell architecture, the whole printing process is mask free, transfer free, and alignment free with precise and repeatable control on the spatial distribution of all constituent materials. Studies on cell design show that a wider electrode pattern and narrower gap distance between electrodes lead to higher specific capacitance. The as-printed fully packaged supercapacitors have energy and power performances that are among the best in recently reported planar carbon-based supercapacitors that are only partially printed or nonprinted.

NASA Electronic Parts and Packaging (NEPP) Program - Radiation Activities

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2008-01-01

The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs.

Government Microelectronics Assessment for Trust (GOMAT)

NASA Technical Reports Server (NTRS)

Berg, Melanie D.; LaBel, Kenneth A.

2018-01-01

NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

ASIC/FPGA Trust Assessment Framework

NASA Technical Reports Server (NTRS)

Berg, Melanie

2018-01-01

NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of Trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

[The development and operation of a package inserts service system for electronic medical records].

PubMed

Yamada, Hidetoshi; Nishimura, Sachiho; Shimamori, Yoshimitsu; Sato, Seiji; Hayase, Yukitoshi

2003-03-01

To promote the appropriate use of pharmaceuticals and to prevent side effects, physicians need package inserts on medicinal drugs as soon as possible. A medicinal drug information service system was established for electronic medical records to speed up and increase the efficiency of package insert communications within a medical institution. Development of this system facilitates access to package inserts by, for example, physicians. The time required to maintain files of package inserts was shortened, and the efficiency of the drug information service increased. As a source of package inserts for this system, package inserts using a standard generalized markup language (SGML) form were used, which are accessible to the public on the homepage of the Organization for Pharmaceutical Safety and Research (OPSR). This study found that a delay occurred in communicating revised package inserts from pharmaceutical companies to the OPSR. Therefore a pharmaceutical department page was set up as part of the homepage of the medical institution for electronic medical records to shorten the delay in the revision of package inserts posted on the medicinal drug information service homepage of the OPSR. The usefulness of this package insert service system for electronic medical records is clear. For more effective use of this system based on the OPSR homepage pharmaceutical companies have been requested to provide quicker updating of package inserts.

Micromolded thick PZT sol gel composite structures for ultrasound transducer devices operating at high frequencies

NASA Astrophysics Data System (ADS)

Pang, Guofeng

The objective of this work has been to design and develop a micromolding technique useful for batch fabrication to microfabricate 3D ceramic structures for device purposes using a sol gel composite processing technique and deep photolithography (UV LIGA). These structures may be the elements of ultrasound transducers, the structures associated with electronic packaging, or microstructures for microfluidic applications. To demonstrate the technique, the project has focused on the design and fabrication of annular and linear arrays for high frequency (>20 MHz) ultrasound imaging applications, particularly where an electronically steered imaging modality is employed. Other typical micromolded structures have been demonstrated to show the potential for micromolding. The transferability of the technique for industrial purposes is proposed. Using a sol gel composite process, the critical components in this technique are mold making, mold filling, material-processing, demolding, top electrode and essential material characterization. Two types of molds have been created using UV LIGA and/or electroplating. A purely organic mold made of Su-8 epoxy based photo-resist has shown tremendous performance for micromolding. The transducer packaging process has also been designed and evaluated at the laboratory level. A Su-8 micro bridge and bond pad has been used for wire bonding purposes. A 5-element annular array transducer has been fabricated by this technique and fully packaged. The micromolded piezoceramic structures have been characterized. The pulse echo performance of each element and the focusing performance of 5 elements of a packaged transducer array have been evaluated using a coaxial cable and a cable delay system.

Packaging printed circuit boards: A production application of interactive graphics

NASA Technical Reports Server (NTRS)

Perrill, W. A.

1975-01-01

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

The Integrated Sensor System Data Enhancement Package

NASA Technical Reports Server (NTRS)

Trankle, T. L.; Reed, W. B.; Rabin, U.; Vincent, J.

1983-01-01

The purpose of the Integrated Sensor System (ISS) Data Enhancement Package (DEP) is to improve the accuracies of the data obtained from the inflight tests performed on aircraft. The DEP is a microprocessor-based, flight-qualified electronics package that assimilates data from a Ring Laser Gyro (RGL) system, a standard NASA air data package, and other inputs. The DEP then processes these inputs in real-time to obtain optimal estimates of the aircraft velocity, attitude, and altitude. These estimates can be passed to the flight crew, downlinked, and/or stored on a mass storage medium. The DEP is now being built for the NASA Dryden Flight Research Center. Completion is anticipated in early 1984. A primary use of the ISS/DEP will be for the collection of quality data for the estimation of aircraft aerodynamic coefficients, including stability derivatives, using system identification methods. Initial anticipated applications will be on the AV-8B, F-14, and X-29 test aircraft.

JTEC Panel report on electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John; Meieran, Gene; Pecht, Michael; Peeples, John; Tummala, Rao; Dehaemer, Michael J.; Holdridge, Geoff (Editor); Gamota, George

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-07-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-03-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Antimicrobial and Physicochemical Characterization of Biodegradable, Nitric Oxide-Releasing Nanocellulose-Chitosan Packaging Membranes.

PubMed

Sundaram, Jaya; Pant, Jitendra; Goudie, Marcus J; Mani, Sudhagar; Handa, Hitesh

2016-06-29

Biodegradable composite membranes with antimicrobial properties consisting of nanocellulose fibrils (CNFs), chitosan, and S-nitroso-N-acetyl-d-penicillamine (SNAP) were developed and tested for food packaging applications. As a nitric oxide donor, SNAP was encapsulated into completely dispersed chitosan in 100 mL of 0.1 N acetic acid and was thoroughly mixed with CNFs to produce a composite membrane. The fabricated membranes had a uniform dispersion of chitosan and SNAP within the CNFs, which was confirmed through scanning electron microscopy (SEM) micrographs and a chemiluminescence nitric oxide analyzer. The membranes prepared without SNAP showed lower water vapor permeability than that of the membranes with SNAP. The addition of SNAP resulted in a decrease in Young's modulus for both two- and three-layer membrane configurations. Antimicrobial property evaluation of SNAP-incorporated membranes showed an effective zone of inhibition against bacterial strains of Enterococcus faecalis, Staphylococcus aureus, and Listeria monocytogenes and demonstrated its potential applications for food packaging.

Packaging Concerns/Techniques for Large Devices

NASA Technical Reports Server (NTRS)

Sampson, Michael J.

2009-01-01

This slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

Thermal Management and Packaging Reliability (Text Version) |

Science.gov Websites

Transportation Research | NREL Thermal Management and Packaging Reliability (Text Version ) Thermal Management and Packaging Reliability (Text Version) Learn how NREL's thermal management and ;Boosting Thermal Management & Reliability of Vehicle Power Electronics." Better power electronics

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2012-01-01

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

WavePropaGator: interactive framework for X-ray free-electron laser optics design and simulations.

PubMed

Samoylova, Liubov; Buzmakov, Alexey; Chubar, Oleg; Sinn, Harald

2016-08-01

This article describes the WavePropaGator ( WPG ) package, a new interactive software framework for coherent and partially coherent X-ray wavefront propagation simulations. The package has been developed at European XFEL for users at the existing and emerging free-electron laser (FEL) facilities, as well as at the third-generation synchrotron sources and future diffraction-limited storage rings. The WPG addresses the needs of beamline scientists and user groups to facilitate the design, optimization and improvement of X-ray optics to meet their experimental requirements. The package uses the Synchrotron Radiation Workshop ( SRW ) C/C++ library and its Python binding for numerical wavefront propagation simulations. The framework runs reliably under Linux, Microsoft Windows 7 and Apple Mac OS X and is distributed under an open-source license. The available tools allow for varying source parameters and optics layouts and visualizing the results interactively. The wavefront history structure can be used for tracking changes in every particular wavefront during propagation. The batch propagation mode enables processing of multiple wavefronts in workflow mode. The paper presents a general description of the package and gives some recent application examples, including modeling of full X-ray FEL beamlines and start-to-end simulation of experiments.

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Ghaffarian, Reza; Shapiro, Andrew; Napala, Phil A.; Martin, Patrick A.

2005-01-01

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

Preparation, characterization and antibacterial applications of ZnO-nanoparticles coated polyethylene films for food packaging.

PubMed

Tankhiwale, Rasika; Bajpai, S K

2012-02-01

The present work describes the preparation of ZnO nanoparticles loaded starch-coated polyethylene film. The presence of ZnO nanoparticles was confirmed by surface plasmon resonance (SPR), X-ray diffraction (XRD) studies and transmission electron microscopy (TEM). The ZnO loaded film was tested for its biocidal action against model bacteria Escherichia coli using zone inhibition and killing kinetics of bacterial growth methods. This newly developed material bears potential to be used as food packaging material to prevent food stuff from bacterial contamination. Copyright © 2011 Elsevier B.V. All rights reserved.

Advanced packaging for Integrated Micro-Instruments

NASA Technical Reports Server (NTRS)

Lyke, James L.

1995-01-01

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Barlow, F.D.; Elshabini, A.

A key issue associated with the wider adoption of hybrid-electric vehicles (HEV) and plug in hybrid-electric vehicles (PHEV) is the implementation of the power electronic systems that are required in these products [1]. To date, many consumers find the adoption of these technologies problematic based on a financial analysis of the initial cost versus the savings available from reduced fuel consumption. Therefore, one of the primary industry goals is the reduction in the price of these vehicles relative to the cost of traditional gasoline powered vehicles. Part of this cost reduction must come through optimization of the power electronics requiredmore » by these vehicles. In addition, the efficiency of the systems must be optimized in order to provide the greatest range possible. For some drivers, any reduction in the range associated with a potential HEV or PHEV solution in comparison to a gasoline powered vehicle represents a significant barrier to adoption and the efficiency of the power electronics plays an important role in this range. Likewise, high efficiencies are also important since lost power further complicates the thermal management of these systems. Reliability is also an important concern since most drivers have a high level of comfort with gasoline powered vehicles and are somewhat reluctant to switch to a less proven technology. Reliability problems in the power electronics or associated components could not only cause a high warranty cost to the manufacturer, but may also taint these technologies in the consumer's eyes. A larger vehicle offering in HEVs is another important consideration from a power electronics point of view. A larger vehicle will need more horsepower, or a larger rated drive. In some ways this will be more difficult to implement from a cost and size point of view. Both the packaging of these modules and the thermal management of these systems at competitive price points create significant challenges. One way in which significant cost reduction of these systems could be achieved is through the use of a single coolant loop for both the power electronics as well as the internal combustion engine (ICE) [2]. This change would reduce the complexity of the cooling system which currently relies on two loops to a single loop [3]. However, the current nominal coolant temperature entering these inverters is 65 C [3], whereas a normal ICE coolant temperature would be much higher at approximately 100 C. This change in coolant temperature significantly increases the junction temperatures of the devices and creates a number of challenges for both device fabrication and the assembly of these devices into inverters and converters for HEV and PHEV applications. With this change in mind, significant progress has been made on the use of SiC devices for inverters that can withstand much higher junction temperatures than traditional Si based inverters [4,5,6]. However, a key problem which the single coolant loop and high temperature devices is the effective packaging of these devices and related components into a high temperature inverter. The elevated junction temperatures that exist in these modules are not compatible with reliable inverters based on existing packaging technology. This report seeks to provide a literature survey of high temperature packaging and to highlight the issues related to the implementation of high temperature power electronic modules for HEV and PHEV applications. For purposes of discussion, it will be assumed in this report that 200 C is the targeted maximum junction temperature.« less

Silicon Power MOSFETs

NASA Technical Reports Server (NTRS)

Lauenstein, Jean-Marie; Casey, Megan; Campola, Michael; Ladbury, Raymond; Label, Kenneth; Wilcox, Ted; Phan, Anthony; Kim, Hak; Topper, Alyson

2017-01-01

Recent work for the NASA Electronic Parts and Packaging Program Power MOSFET task is presented. The Task technology focus, roadmap, and partners are given. Recent single-event effect test results on commercial, automotive, and radiation hardened trench power MOSFETs are summarized with an emphasis on risk of using commercial and automotive trench-gate power MOSFETs in space applications.

High Value Products from Waste: Grape Pomace Extract—A Three-in-One Package for the Synthesis of Metal Nanoparticles

EPA Science Inventory

Synthesis of metal nanoparticles (NPs) has been the topic of intense research during the last decade. This is primarily due to their unique properties and potential applications from the technological point of view. The optical,[1] electronic,[2] magnetic,[3] and catalytic [4] pr...

An On-the-Fly Surface-Hopping Program JADE for Nonadiabatic Molecular Dynamics of Polyatomic Systems: Implementation and Applications.

PubMed

Du, Likai; Lan, Zhenggang

2015-04-14

Nonadiabatic dynamics simulations have rapidly become an indispensable tool for understanding ultrafast photochemical processes in complex systems. Here, we present our recently developed on-the-fly nonadiabatic dynamics package, JADE, which allows researchers to perform nonadiabatic excited-state dynamics simulations of polyatomic systems at an all-atomic level. The nonadiabatic dynamics is based on Tully's surface-hopping approach. Currently, several electronic structure methods (CIS, TDHF, TDDFT(RPA/TDA), and ADC(2)) are supported, especially TDDFT, aiming at performing nonadiabatic dynamics on medium- to large-sized molecules. The JADE package has been interfaced with several quantum chemistry codes, including Turbomole, Gaussian, and Gamess (US). To consider environmental effects, the Langevin dynamics was introduced as an easy-to-use scheme into the standard surface-hopping dynamics. The JADE package is mainly written in Fortran for greater numerical performance and Python for flexible interface construction, with the intent of providing open-source, easy-to-use, well-modularized, and intuitive software in the field of simulations of photochemical and photophysical processes. To illustrate the possible applications of the JADE package, we present a few applications of excited-state dynamics for various polyatomic systems, such as the methaniminium cation, fullerene (C20), p-dimethylaminobenzonitrile (DMABN) and its primary amino derivative aminobenzonitrile (ABN), and 10-hydroxybenzo[h]quinoline (10-HBQ).

Reliability and quality EEE parts issues

NASA Technical Reports Server (NTRS)

Barney, Dan; Feigenbaum, Irwin

1990-01-01

NASA policy and procedures are established which govern the selection, testing, and application of electrical, electronic, and electromechanical (EEE) parts. Recent advances in the state-of-the-art of electronic parts and associated technologies can significantly impact the electronic designs and reliability of NASA space transportation avionics. Significant issues that result from these advances are examined, including: recent advances in microelectronics technology (as applied to or considered for use in NASA projects); electron packaging technology advances (concurrent with, and as a result of, the development of the advanced microelectronic devices); availability of parts used in space avionics; and standardization and integration of parts activities between projects, centers, and contractors.

Solder Creep-Fatigue Interactions with Flexible Leaded Part

NASA Technical Reports Server (NTRS)

Ross, R. G., Jr.; Wen, L. C.

1994-01-01

In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.

Results on 3D interconnection from AIDA WP3

NASA Astrophysics Data System (ADS)

Moser, Hans-Günther; AIDA-WP3

2016-09-01

From 2010 to 2014 the EU funded AIDA project established in one of its work packages (WP3) a network of groups working collaboratively on advanced 3D integration of electronic circuits and semiconductor sensors for applications in particle physics. The main motivation came from the severe requirements on pixel detectors for tracking and vertexing at future Particle Physics experiments at LHC, super-B factories and linear colliders. To go beyond the state-of-the-art, the main issues were studying low mass, high bandwidth applications, with radiation hardness capabilities, with low power consumption, offering complex functionality, with small pixel size and without dead regions. The interfaces and interconnects of sensors to electronic readout integrated circuits are a key challenge for new detector applications.

Application of Electronic Nose for Measuring Total Volatile Basic Nitrogen and Total Viable Counts in Packaged Pork During Refrigerated Storage.

PubMed

Li, Miaoyun; Wang, Haibiao; Sun, Lingxia; Zhao, Gaiming; Huang, Xianqing

2016-04-01

The objective of this study was to predict the total viable counts (TVC) and total volatile basic nitrogen (TVB-N) in pork using an electronic nose (E-nose), and to assess the freshness of chilled pork during storage using different packaging methods, including pallet packaging (PP), vacuum packaging (VP), and modified atmosphere packaging (MAP, 40% O2 /40% CO2 /20% N2 ). Principal component analysis (PCA) was used to analyze the E-nose signals, and the results showed that the relationships between the freshness of chilled pork and E-nose signals could be distinguished in the loadings plots, and the freshness of chilled pork could be distributed along 2 first principal components. Multiple linear regression (MLR) was used to correlate TVC and TVB-N to E-nose signals. High F and R2 values were obtained in the MLR output of TVB-N (F = 32.1, 21.6, and 24.2 for PP [R2 = 0.93], VP [R2 = 0.94], and MAP [R2 = 0.95], respectively) and TVC (F = 34.2, 46.4, and 7.8 for PP [R2 = 0.98], VP [R2 = 0.89], and MAP [R2 = 0.85], respectively). The results of this study suggest that it is possible to use the E-nose technology to predict TVB-N and TVC for assessing the freshness of chilled pork during storage. © 2016 Institute of Food Technologists®

An electron-beam dose deposition experiment: TIGER 1-D simulation code versus thermoluminescent dosimetry

NASA Astrophysics Data System (ADS)

Murrill, Steven R.; Tipton, Charles W.; Self, Charles T.

1991-03-01

The dose absorbed in an integrated circuit (IC) die exposed to a pulse of low-energy electrons is a strong function of both electron energy and surrounding packaging materials. This report describes an experiment designed to measure how well the Integrated TIGER Series one-dimensional (1-D) electron transport simulation program predicts dose correction factors for a state-of-the-art IC package and package/printed circuit board (PCB) combination. These derived factors are compared with data obtained experimentally using thermoluminescent dosimeters (TLD's) and the FX-45 flash x-ray machine (operated in electron-beam (e-beam) mode). The results of this experiment show that the TIGER 1-D simulation code can be used to accurately predict FX-45 e-beam dose deposition correction factors for reasonably complex IC packaging configurations.

Decontamination of food packaging using electron beam—status and prospects

NASA Astrophysics Data System (ADS)

Mittendorfer, J.; Bierbaumer, H. P.; Gratzl, F.; Kellauer, E.

2002-03-01

In this paper the status of food packaging disinfection decontamination using electron beam at Mediscan GmbH is presented. The first section of the paper describes the activities at the service center, where food packaging materials, e.g. yoghurt cups are decontaminated in their final shipment containers. As important step in the hazard analysis and critical control point of food processing, microbiological uncontaminated food packaging material is of public interest and attracts a lot of attention from packaging material producers and food processors. The dose ranges for different sterility assurance levels are discussed and results from microbiological test are presented. Studies at Mediscan have demonstrated, that an electron beam treatment at a dose of 5-7 kGy is most effective against yeast and mold, which are mainly responsible for spoilage and short shelf-life of a variety of products. The second section is devoted to the field of inline decontamination of food packaging and sterilization of pharmaceutical packaging material and the research currently conducted at Mediscan. The requirements for industrial inline electron beam systems are summarized and design concepts discussed in terms of beam energy, beam current, irradiation topology, product handling and shielding.

Design and Development of a CPCI-Based Electronics Package for Space Station Experiments

NASA Technical Reports Server (NTRS)

Kolacz, John S.; Clapper, Randy S.; Wade, Raymond P.

2006-01-01

The NASA John H. Glenn Research Center is developing a Compact-PCI (CPCI) based electronics package for controlling space experiment hardware on the International Space Station. Goals of this effort include an easily modified, modular design that allows for changes in experiment requirements. Unique aspects of the experiment package include a flexible circuit used for internal interconnections and a separate enclosure (box in a box) for controlling 1 kW of power for experiment fuel heating requirements. This electronics package was developed as part of the FEANICS (Flow Enclosure Accommodating Novel Investigations in Combustion of Solids) mini-facility which is part of the Fluids and Combustion Facility s Combustion Integrated Rack (CIR). The CIR will be the platform for future microgravity combustion experiments and will reside on the Destiny Module of the International Space Station (ISS). The FEANICS mini-facility will be the primary means for conducting solid fuel combustion experiments in the CIR on ISS. The main focus of many of these solid combustion experiments will be to conduct applied scientific investigations in fire-safety to support NASA s future space missions. A description of the electronics package and the results of functional testing are the subjects of this report. The report concludes that the use of innovative packaging methods combined with readily available COTS hardware can provide a modular electronics package which is easily modified for changing experiment requirements.

Highly-hermetic feedthrough fiber pigtailed circular TO-can electro-optic sensor for avionics applications

NASA Astrophysics Data System (ADS)

Lauzon, Jocelyn; Leduc, Lorrain; Bessette, Daniel; Bélanger, Nicolas

2012-06-01

Electro-optic sensors made of lasers or photodetectors assemblies can be associated with a window interface. In order to use these sensors in an avionics application, this interface has to be set on the periphery of the aircraft. This creates constraints on both the position/access of the associated electronics circuit card and the aircraft fuselage. Using an optical fiber to guide the light signal to a sensor being situated inside the aircraft where electronics circuit cards are deployed is an obvious solution that can be readily available. Fiber collimators that adapt to circular TO-can type window sensors do exist. However, they are bulky, add weight to the sensor and necessitate regular maintenance of the optical interface since both the sensor window and the collimator end-face are unprotected against contamination. Such maintenance can be complex since the access to the electronics circuit card, where the sensor is sitting, is usually difficult. This interface alignment can also be affected by vibrations and mechanical shocks, thus impacting sensor performances. As a solution to this problem, we propose a highly-hermetic feedthrough fiber pigtailed circular TO-can package. The optical element to optical fiber interface being set inside the hermetic package, there is no risk of contamination and thus, such a component does not require any maintenance. The footprint of these sensors being identical to their window counterparts, they offer drop-in replacement opportunities. Moreover, we have validated such packaged electro-optic sensors can be made to operate between -55 to 115°C, sustain 250 temperature cycles, 1500G mechanical shocks, 20Grms random vibrations without any performance degradations. Their water content is much smaller than the 0.5% limit set by MIL-STD-883, Method 1018. They have also been verified to offer a fiber pigtail strain relief resistance over 400g. Depending on the electronics elements inside these sensors, they can be made to have a MTBF over 50 000h at 100°C.

MEMS in Space Systems

NASA Technical Reports Server (NTRS)

Lyke, J. C.; Michalicek, M. A.; Singaraju, B. K.

1995-01-01

Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.

Nodes packaging option for Space Station application

NASA Technical Reports Server (NTRS)

So, Kenneth T.; Hall, John B., Jr.

1988-01-01

Space Station nodes packaging analyses are presented relative to moving environmental control and life support system (ECLSS) equipment from the habitability (HAB) module to node 4, in order to provide more living space and privacy for the crew, remove inherently noisy equipment from the crew quarter, retain crew waste collection and processing equipment in one location, and keep objectionable odor away from the living quarters. In addition, options for moving external electronic equipment from the Space Station truss to pressurized node 3 were evaluated in order to reduce the crew extravehicular-activity time required to install and maintain the equipment. Node size considered in this analysis is 3.66 m in diameter and 5.38 m long. The analysis shows that significant external electronic equipment could be relocated from the Space Station truss structure to node 3, and nonlife critical ECLSS HAB module equipment could be moved to node 4.

Electronic Packaging for Space Applications Workshop 1999

NASA Technical Reports Server (NTRS)

Sandor, Mike; Agarwal, Shri; Villegas, Enrique

1999-01-01

This paper presents viewgraphs on the Commercial Off-The-Shelf (COTS) Program. The topics include: 1) Advocacy for COTS; 2) MARS01 Program/Requirements; 3) MARS01 COTS Screening Flow; 4) Test Results-Electrical, C-Sam, Burn-In; 5) Value Added Analysis (Risk Reduction); 6) Value Added Analysis (Cost); 7) Impact of COTS ++ Screening and 8) Summary.

78 FR 35273 - Agency Information Collection Activities; Proposed Collection; Comment Request; General Licensing...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-06-12

..., to FDA for approval to market a product in interstate commerce. The container and package labeling... be in electronic format and in a form that FDA can process, review, and archive. This requirement is... 356h ``Application to Market a New Drug, Biologic, or an Antibiotic Drug for Human Use'' to harmonize...

Compact fiber optic gyroscopes for platform stabilization

NASA Astrophysics Data System (ADS)

Dickson, William C.; Yee, Ting K.; Coward, James F.; McClaren, Andrew; Pechner, David A.

2013-09-01

SA Photonics has developed a family of compact Fiber Optic Gyroscopes (FOGs) for platform stabilization applications. The use of short fiber coils enables the high update rates required for stabilization applications but presents challenges to maintain high performance. We are able to match the performance of much larger FOGs by utilizing several innovative technologies. These technologies include source noise reduction to minimize Angular Random Walk (ARW), advanced digital signal processing that minimizes bias drift at high update rates, and advanced passive thermal packaging that minimizes temperature induced bias drift while not significantly affecting size, weight, or power. In addition, SA Photonics has developed unique distributed FOG packaging technologies allowing the FOG electronics and photonics to be packaged remotely from the sensor head or independent axis heads to minimize size, weight, and power at the sensing location(s). The use of these technologies has resulted in high performance, including ARW less than 0.001 deg/rt-hr and bias drift less than 0.004 deg/hr at an update rate of 10 kHz, and total packaged volume less than 30 cu. in. for a 6 degree of freedom FOG-based IMU. Specific applications include optical beam stabilization for LIDAR and LADAR, beam stabilization for long-range free-space optical communication, Optical Inertial Reference Units for HEL stabilization, and Ka band antenna pedestal pointing and stabilization. The high performance of our FOGs also enables their use in traditional navigation and positioning applications. This paper will review the technologies enabling our high-performance compact FOGs, and will provide performance test results.

1st NASA Electronic Parts Packaging (NEPP) Program Electronic Technology Workshop (ETW)

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NEPP supports all of NASA for >20 years - 7 NASA Centers and JPL actively participate The NEPP Program focuses on the reliability aspects of electronic devices - Three prime technical areas: Parts (die), Packaging, and Radiation Alternately, reliability may be viewed as: -

Modelling of optoelectronic circuits based on resonant tunneling diodes

NASA Astrophysics Data System (ADS)

Rei, João. F. M.; Foot, James A.; Rodrigues, Gil C.; Figueiredo, José M. L.

2017-08-01

Resonant tunneling diodes (RTDs) are the fastest pure electronic semiconductor devices at room temperature. When integrated with optoelectronic devices they can give rise to new devices with novel functionalities due to their highly nonlinear properties and electrical gain, with potential applications in future ultra-wide-band communication systems (see e.g. EU H2020 iBROW Project). The recent coverage on these devices led to the need to have appropriated simulation tools. In this work, we present RTD based optoelectronic circuits simulation packages to provide circuit signal level analysis such as transient and frequency responses. We will present and discuss the models, and evaluate the simulation packages.

Preparation of conductive paper composites based on natural cellulosic fibers for packaging applications.

PubMed

Youssef, Ahmed M; El-Samahy, Magda Ali; Abdel Rehim, Mona H

2012-08-01

Conducting paper based on natural cellulosic fibers and conductive polymers was prepared using unbleached bagasse and/or rice straw fibers (as cellulosic raw materials) and polyaniline (PANi) as conducting polymer. These composites were synthesized by in situ emulsion polymerization using ammonium persulfate (APS) as oxidant in the presence of dodecylbenzene sulfonic acid (DBSA) as emulsifier. The prepared composites were characterized using Fourier transform infrared (FTIR), thermal gravimetric analysis (TGA), differential scanning calorimeter (DSC), and their morphology was investigated using scanning electron microscope (SEM). Electrical conductivity measurements showed that the conductivity of the paper sheets increases by increasing the ratio of PANi in the composite. Mechanical properties of the paper sheets were also investigated, the results revealed that the values of breaking length, burst factor, and tear factor are decreased with increasing ratio of added PANi, and this effect is more pronounced in bagasse-based composites. The new conductive composites can have potential use as anti-static packaging material or anti-bacterial paper for packaging applications. Copyright © 2012 Elsevier Ltd. All rights reserved.

Motor/Generator and Inverter Characterization for Flywheel System Applications

NASA Technical Reports Server (NTRS)

Tamarcus, Jeffries L.

2004-01-01

The Advanced Electrical Systems Development Branch at NASA Glenn Research Center (GRC) has been involved in the research and development of high speed flywheels systems for satellite energy storage and attitude applications. These flywheels will serve as replacement for chemical nickel hydrogen, nickel cadmium batteries and gyroscopic wheels. The advantages of using flywheel systems for energy storage on satellites are high energy density, high power density, long life, deep depth of discharge, and broad operating temperature ranges. A flywheel system for space applications consist of a number of flywheel modules, the motor/generator and magnetic bearing, and an electronics package. The motor/generator electronics package includes a pulse-width modulated inverter that drives the flywheel permanent magnet motor/generator located at one end of the shaft. This summer, I worked under the direct supervision of my mentor, Walter Santiago, and the goal for this summer was to characterize motor generator and inverter attributes in order to increase their viability as a more efficient energy storage source for space applications. To achieve this goal, magnetic field measurements around the motor/generator permanent magnet and the impedance of the motor/generator three phase windings were characterized, and a recreation of the inverter pulse width modulated control system was constructed. The Flywheel modules for space use are designed to maximize energy density and minimize loss, and attaining these values will aid in locating and reducing losses within the flywheel system as a whole, making flywheel technology more attractive for use as energy storage in future space applications.

Enhancement of DFT-calculations at petascale: Nuclear Magnetic Resonance, Hybrid Density Functional Theory and Car-Parrinello calculations

NASA Astrophysics Data System (ADS)

Varini, Nicola; Ceresoli, Davide; Martin-Samos, Layla; Girotto, Ivan; Cavazzoni, Carlo

2013-08-01

One of the most promising techniques used for studying the electronic properties of materials is based on Density Functional Theory (DFT) approach and its extensions. DFT has been widely applied in traditional solid state physics problems where periodicity and symmetry play a crucial role in reducing the computational workload. With growing compute power capability and the development of improved DFT methods, the range of potential applications is now including other scientific areas such as Chemistry and Biology. However, cross disciplinary combinations of traditional Solid-State Physics, Chemistry and Biology drastically improve the system complexity while reducing the degree of periodicity and symmetry. Large simulation cells containing of hundreds or even thousands of atoms are needed to model these kind of physical systems. The treatment of those systems still remains a computational challenge even with modern supercomputers. In this paper we describe our work to improve the scalability of Quantum ESPRESSO (Giannozzi et al., 2009 [3]) for treating very large cells and huge numbers of electrons. To this end we have introduced an extra level of parallelism, over electronic bands, in three kernels for solving computationally expensive problems: the Sternheimer equation solver (Nuclear Magnetic Resonance, package QE-GIPAW), the Fock operator builder (electronic ground-state, package PWscf) and most of the Car-Parrinello routines (Car-Parrinello dynamics, package CP). Final benchmarks show our success in computing the Nuclear Magnetic Response (NMR) chemical shift of a large biological assembly, the electronic structure of defected amorphous silica with hybrid exchange-correlation functionals and the equilibrium atomic structure of height Porphyrins anchored to a Carbon Nanotube, on many thousands of CPU cores.

HALT to qualify electronic packages: a proof of concept

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2014-03-01

A proof of concept of the Highly Accelerated Life Testing (HALT) technique was explored to assess and optimize electronic packaging designs for long duration deep space missions in a wide temperature range (-150°C to +125°C). HALT is a custom hybrid package suite of testing techniques using environments such as extreme temperatures and dynamic shock step processing from 0g up to 50g of acceleration. HALT testing used in this study implemented repetitive shock on the test vehicle components at various temperatures to precipitate workmanship and/or manufacturing defects to show the weak links of the designs. The purpose is to reduce the product development cycle time for improvements to the packaging design qualification. A test article was built using advanced electronic package designs and surface mount technology processes, which are considered useful for a variety of JPL and NASA projects, i.e. (surface mount packages such as ball grid arrays (BGA), plastic ball grid arrays (PBGA), very thin chip array ball grid array (CVBGA), quad flat-pack (QFP), micro-lead-frame (MLF) packages, several passive components, etc.). These packages were daisy-chained and independently monitored during the HALT test. The HALT technique was then implemented to predict reliability and assess survivability of these advanced packaging techniques for long duration deep space missions in much shorter test durations. Test articles were built using advanced electronic package designs that are considered useful in various NASA projects. All the advanced electronic packages were daisychained independently to monitor the continuity of the individual electronic packages. Continuity of the daisy chain packages was monitored during the HALT testing using a data logging system. We were able to test the boards up to 40g to 50g shock levels at temperatures ranging from +125°C to -150°C. The HALT system can deliver 50g shock levels at room temperature. Several tests were performed by subjecting the test boards to various g levels ranging from 5g to 50g, test durations of 10 minutes to 60 minutes, hot temperatures of up to +125°C and cold temperatures down to -150°C. During the HALT test, electrical continuity measurements of the PBGA package showed an open-circuit, whereas the BGA, MLF, and QFPs showed signs of small variations of electrical continuity measurements. The electrical continuity anomaly of the PBGA occurred in the test board within 12 hours of commencing the accelerated test. Similar test boards were assembled, thermal cycled independently from -150°C to +125°C and monitored for electrical continuity through each package design. The PBGA package on the test board showed an anomalous electrical continuity behavior after 959 thermal cycles. Each thermal cycle took around 2.33 hours, so that a total test time to failure of the PBGA was 2,237 hours (or ~3.1 months) due to thermal cycling alone. The accelerated technique (thermal cycling + shock) required only 12 hours to cause a failure in the PBGA electronic package. Compared to the thermal cycle only test, this was an acceleration of ~186 times (more than 2 orders of magnitude). This acceleration process can save significant time and resources for predicting the life of a package component in a given environment, assuming the failure mechanisms are similar in both the tests. Further studies are in progress to make systematic evaluations of the HALT technique on various other advanced electronic packaging components on the test board. With this information one will be able to estimate the number of mission thermal cycles to failure with a much shorter test program. Further studies are in progress to make systematic study of various components, constant temperature range for both the tests. Therefore, one can estimate the number of hours to fail in a given thermal and shock levels for a given test board physical properties.

Hermetic electronics package with dual-sided electrical feedthrough configuration

DOEpatents

Shah, Kedar G.; Pannu, Satinderpall S.

2016-11-22

A hermetic electronics package includes a metal case with opposing first and second open ends, with each end connected to a first feedthrough construction and a second feedthrough construction. Each feedthrough contruction has an electrically insulating substrate and an array of electrically conductive feedthroughs extending therethrough, with the electrically insulating substrates connected to the opposing first and second open ends, respectively, of the metal case so as to form a hermetically sealed enclosure. A set of electronic components are located within the hermetically sealed enclosure and are operably connected to the feedthroughs of the first and second feedthrough constructions so as to electrically communicate outside the package from opposite sides of the package.

Information Business: Applying Infometry (Informational Geometry) in Cognitive Coordination and Genetic Programming for Electronic Information Packaging and Marketing.

ERIC Educational Resources Information Center

Tsai, Bor-sheng

1994-01-01

Describes the use of infometry, or informational geometry, to meet the challenges of information service businesses. Highlights include theoretical models for cognitive coordination and genetic programming; electronic information packaging; marketing electronic information products, including cost-benefit analyses; and recapitalization, including…

21 CFR 1305.21 - Requirements for electronic orders.

Code of Federal Regulations, 2013 CFR

2013-04-01

... 1311 of this chapter. (b) The following data fields must be included on an electronic order for... either the purchaser or the supplier). (8) The quantity in a single package or container. (9) The number of packages or containers of each item ordered. (c) An electronic order may include controlled...

21 CFR 1305.21 - Requirements for electronic orders.

Code of Federal Regulations, 2014 CFR

2014-04-01

... 1311 of this chapter. (b) The following data fields must be included on an electronic order for... either the purchaser or the supplier). (8) The quantity in a single package or container. (9) The number of packages or containers of each item ordered. (c) An electronic order may include controlled...

21 CFR 1305.21 - Requirements for electronic orders.

Code of Federal Regulations, 2012 CFR

2012-04-01

... 1311 of this chapter. (b) The following data fields must be included on an electronic order for... either the purchaser or the supplier). (8) The quantity in a single package or container. (9) The number of packages or containers of each item ordered. (c) An electronic order may include controlled...

Electron beam accelerators—trends in radiation processing technology for industrial and environmental applications in Latin America and the Caribbean

NASA Astrophysics Data System (ADS)

Parejo Calvo, Wilson A.; Duarte, Celina L.; Machado, Luci Diva B.; Manzoli, Jose E.; Geraldo, Aurea Beatriz C.; Kodama, Yasko; Silva, Leonardo Gondim A.; Pino, Eddy S.; Somessari, Elizabeth S. R.; Silveira, Carlos G.; Rela, Paulo R.

2012-08-01

The radiation processing technology for industrial and environmental applications has been developed and used worldwide. In Latin America and the Caribbean and particularly in Brazil there are 24 and 16 industrial electron beam accelerators (EBA) respectively with energy from 200 keV to 10 MeV, operating in private companies and governmental institutions to enhance the physical and chemical properties of materials. However, there are more than 1500 high-current electron beam accelerators in commercial use throughout the world. The major needs and end-use markets for these electron beam (EB) units are R and D, wire and electric cables, heat shrinkable tubes and films, PE foams, tires, components, semiconductors and multilayer packaging films. Nowadays, the emerging opportunities in Latin America and the Caribbean are paints, adhesives and coatings cure in order to eliminate VOCs and for less energy use than thermal process; disinfestations of seeds; and films and multilayer packaging irradiation. For low-energy EBA (from 150 keV to 300 keV). For mid-energy EBA (from 300 keV to 5 MeV), they are flue gas treatment (SO2 and NOX removal); composite and nanocomposite materials; biodegradable composites based on biorenewable resources; human tissue sterilization; carbon and silicon carbide fibers irradiation; irradiated grafting ion-exchange membranes for fuel cells application; electrocatalysts nanoparticles production; and natural polymers irradiation and biodegradable blends production. For high-energy EBA (from 5 MeV to 10 MeV), they are sterilization of medical, pharmaceutical and biological products; gemstone enhancement; treatment of industrial and domestic effluents and sludge; preservation and disinfestations of foods and agricultural products; soil disinfestations; lignocellulosic material irradiation as a pretreatment to produce ethanol biofuel; decontamination of pesticide packing; solid residues remediation; organic compounds removal from wastewater; and treatment of effluent from petroleum production units and liquid irradiation process to treat vessel water ballast. On the other hand, there is a growing need of mobile EB facilities for different applications in South America.

Overview of the application of nanosecond electron beams for radiochemical sterilization

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kotov, Y.A.; Sokovnin, S.Y.

Problems concerning the use of nanosecond electron beams for sterilization of hermetically packed objects, and powdered or granulated materials, are discussed. The advantages and disadvantages of this type of radiation sterilization are demonstrated. The results are of interest to researchers who study the mechanism by which nanosecond electron beams act on microorganisms. It is worth considering repetitively pulsed electron accelerators as highly promising systems for use in commercial sterilization applications. Technologies and setups for the radiochemical sterilization (RCS) of medical glassware for blood products, beer bottles, bone meal used in food industry, medical instruments (surgical needles, systems for human kidneys),more » and of the external packaging for some biological materials used in ophthalmology are discussed. Such applications have been developed based on the use of the URT-0.2 and URT-0.5 repetitively nanosecond-pulsed electron accelerators. The observed sterilization of areas shaded from line-of-site irradiation and of the bottoms of, for example, glassware cannot be attributed to radiation sterilization alone, since the glass thickness was much larger than the range of electrons. Therefore, it can be conjectured that the demonstrated sterilization effect is due both to the electron beam and to the ozone and chemical radicals produced by the beam. Thus, one may introduce the notion of RCS.« less

Advances in miniature spectrometer and sensor development

NASA Astrophysics Data System (ADS)

Malinen, Jouko; Rissanen, Anna; Saari, Heikki; Karioja, Pentti; Karppinen, Mikko; Aalto, Timo; Tukkiniemi, Kari

2014-05-01

Miniaturization and cost reduction of spectrometer and sensor technologies has great potential to open up new applications areas and business opportunities for analytical technology in hand held, mobile and on-line applications. Advances in microfabrication have resulted in high-performance MEMS and MOEMS devices for spectrometer applications. Many other enabling technologies are useful for miniature analytical solutions, such as silicon photonics, nanoimprint lithography (NIL), system-on-chip, system-on-package techniques for integration of electronics and photonics, 3D printing, powerful embedded computing platforms, networked solutions as well as advances in chemometrics modeling. This paper will summarize recent work on spectrometer and sensor miniaturization at VTT Technical Research Centre of Finland. Fabry-Perot interferometer (FPI) tunable filter technology has been developed in two technical versions: Piezoactuated FPIs have been applied in miniature hyperspectral imaging needs in light weight UAV and nanosatellite applications, chemical imaging as well as medical applications. Microfabricated MOEMS FPIs have been developed as cost-effective sensor platforms for visible, NIR and IR applications. Further examples of sensor miniaturization will be discussed, including system-on-package sensor head for mid-IR gas analyzer, roll-to-roll printed Surface Enhanced Raman Scattering (SERS) technology as well as UV imprinted waveguide sensor for formaldehyde detection.

The NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond and Recent Radiation Highlights

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2015-01-01

This presentation is a NASA Electronic Parts and Packaging (NEPP) Program: Roadmap for FY15 and Beyond. This roadmap provides a snapshot for current plans and collaborations on testing and evaluation of electronics as well as a discussion of the technology selection approach.

76 FR 52862 - Time for Payment of Certain Excise Taxes, and Quarterly Excise Tax Payments for Small Alcohol...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-08-24

... 40 Cigars and cigarettes, Claims, Electronic fund transfers, Excise taxes, Labeling, Packaging and... that are not required to pay taxes through electronic funds transfer (EFT), this first payment period..., Electronic funds transfers, Excise taxes, Exports, Food additives, Fruit juices, Labeling, Liquors, Packaging...

Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

NASA Technical Reports Server (NTRS)

Dawe, R. H.; Arnett, J. C.

1974-01-01

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

Design of Amphoteric Refraction Models Using WAVICA and RAYICA

NASA Technical Reports Server (NTRS)

Su, Richard

2004-01-01

The phenomenon of refraction of light is due to refractive index mismatches in two different media. However, to achieve this effect, a finite reflection loss is inevitable. A recent finding presented a unique type of interface, ferroelastic materials, that enables refraction without any reflection for either an electron or a light beam. This property is called total refraction. The same type of interface that yields total refraction can also yield amphoteric refraction, where the index of refraction can be either positive or negative depending on the incident angle. This interface could potentially be used to steer light without reflections which could have major applications in high power optics. My goal this summer is to first familiarize myself with the Mathematica software, especially the Wavica and Rayica packages. I will then model the amphoteric refraction by either modifying the Wavica and Rayica packages or using the built-in functions in these packages.

Meteorological Instruction Software

NASA Technical Reports Server (NTRS)

1990-01-01

At Florida State University and the Naval Postgraduate School, meteorology students have the opportunity to apply theoretical studies to current weather phenomena, even prepare forecasts and see how their predictions stand up utilizing GEMPAK. GEMPAK can display data quickly in both conventional and non-traditional ways, allowing students to view multiple perspectives of the complex three-dimensional atmospheric structure. With GEMPAK, mathematical equations come alive as students do homework and laboratory assignments on the weather events happening around them. Since GEMPAK provides data on a 'today' basis, each homework assignment is new. At the Naval Postgraduate School, students are now using electronically-managed environmental data in the classroom. The School's Departments of Meteorology and Oceanography have developed the Interactive Digital Environment Analysis (IDEA) Laboratory. GEMPAK is the IDEA Lab's general purpose display package; the IDEA image processing package is a modified version of NASA's Device Management System. Bringing the graphic and image processing packages together is NASA's product, the Transportable Application Executive (TAE).

MOlecular MAterials Property Prediction Package (MOMAP) 1.0: a software package for predicting the luminescent properties and mobility of organic functional materials

NASA Astrophysics Data System (ADS)

Niu, Yingli; Li, Wenqiang; Peng, Qian; Geng, Hua; Yi, Yuanping; Wang, Linjun; Nan, Guangjun; Wang, Dong; Shuai, Zhigang

2018-04-01

MOlecular MAterials Property Prediction Package (MOMAP) is a software toolkit for molecular materials property prediction. It focuses on luminescent properties and charge mobility properties. This article contains a brief descriptive introduction of key features, theoretical models and algorithms of the software, together with examples that illustrate the performance. First, we present the theoretical models and algorithms for molecular luminescent properties calculation, which includes the excited-state radiative/non-radiative decay rate constant and the optical spectra. Then, a multi-scale simulation approach and its algorithm for the molecular charge mobility are described. This approach is based on hopping model and combines with Kinetic Monte Carlo and molecular dynamics simulations, and it is especially applicable for describing a large category of organic semiconductors, whose inter-molecular electronic coupling is much smaller than intra-molecular charge reorganisation energy.

Low-Temperature Power Electronics Program

NASA Technical Reports Server (NTRS)

Patterson, Richard L.; Dickman, John E.; Hammoud, Ahmad; Gerber, Scott

1997-01-01

Many space and some terrestrial applications would benefit from the availability of low-temperature electronics. Exploration missions to the outer planets, Earth-orbiting and deep-space probes, and communications satellites are examples of space applications which operate in low-temperature environments. Space probes deployed near Pluto must operate in temperatures as low as -229 C. Figure 1 depicts the average temperature of a space probe warmed by the sun for various locations throughout the solar system. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. The development of electrical power systems capable of extremely low-temperature operation represents a key element of some advanced space power systems. The Low-Temperature Power Electronics Program at NASA Lewis Research Center focuses on the design, fabrication, and characterization of low-temperature power systems and the development of supporting technologies for low-temperature operations such as dielectric and insulating materials, power components, optoelectronic components, and packaging and integration of devices, components, and systems.

Thermal interface material characterization for cryogenic electronic packaging solutions

NASA Astrophysics Data System (ADS)

Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

2017-12-01

As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

Human exposure assessment of silver and copper migrating from an antimicrobial nanocoated packaging material into an acidic food simulant.

PubMed

Hannon, Joseph Christopher; Kerry, Joseph P; Cruz-Romero, Malco; Azlin-Hasim, Shafrina; Morris, Michael; Cummins, Enda

2016-09-01

To examine the human exposure to a novel silver and copper nanoparticle (AgNP and CuNP)/polystyrene-polyethylene oxide block copolymer (PS-b-PEO) food packaging coating, the migration of Ag and Cu into 3% acetic acid (3% HAc) food simulant was assessed at 60 °C for 10 days. Significantly lower migration was observed for Ag (0.46 mg/kg food) compared to Cu (0.82 mg/kg food) measured by inductively coupled plasma - atomic emission spectrometry (ICP-AES). In addition, no distinct population of AgNPs or CuNPs were observed in 3% HAc by nanoparticle tracking analysis (NTA) and transmission electron microscopy (TEM). The predicted human exposure to Ag and Cu was used to calculate a margin of exposure (MOE) for ionic species of Ag and Cu, which indicated the safe use of the food packaging in a hypothetical scenario (e.g. as fruit juice packaging). While migration exceeded regulatory limits, the calculated MOE suggests current migration limits may be conservative for specific nano-packaging applications. Copyright © 2016 Elsevier Ltd. All rights reserved.

A generalized any particle propagator theory: Assessment of nuclear quantum effects on electron propagator calculations

NASA Astrophysics Data System (ADS)

Romero, Jonathan; Posada, Edwin; Flores-Moreno, Roberto; Reyes, Andrés

2012-08-01

In this work we propose an extended propagator theory for electrons and other types of quantum particles. This new approach has been implemented in the LOWDIN package and applied to sample calculations of atomic and small molecular systems to determine its accuracy and performance. As a first application of the method we have studied the nuclear quantum effects on electron ionization energies. We have observed that ionization energies of atoms are similar to those obtained with the electron propagator approach. However, for molecular systems containing hydrogen atoms there are improvements in the quality of the results with the inclusion of nuclear quantum effects. An energy term analysis has allowed us to conclude that nuclear quantum effects are important for zero order energies whereas propagator results correct the electron and electron-nuclear correlation terms. Results presented for a series of n-alkanes have revealed the potential of this method for the accurate calculation of ionization energies of a wide variety of molecular systems containing hydrogen nuclei. The proposed methodology will also be applicable to exotic molecular systems containing positrons or muons.

Electrical applications of CVD diamond films

NASA Astrophysics Data System (ADS)

Fujimori, Naoji

Electronics applications of CVD diamond films are reported. The properties of epitaxial diamond films are affected by the orientation of the substrate and the deposition conditions. Boron-doped epitaxial films are found to have the same characteristics as natural IIb diamonds. An LED and an FET were successfully fabricated using boron-doped epitaxial films and Schottky junctions. However, these devices did not exhibit satisfactory properties. Other applications of CVD diamond films include speaker diaphragms (as both a thin-film coating and a free-standing film), and as an ideal packaging material (due to its high thermal conductivity and low dielectric constant).

Electron-processing technology: A promising application for the viscose industry

NASA Astrophysics Data System (ADS)

Stepanik, T. M.; Rajagopal, S.; Ewing, D.; Whitehouse, R.

1998-06-01

In marketing its IMPELA ® line of high power, high-throughput industrial accelerators, Atomic Energy of Canada Limited (AECL) is working with viscose (rayon) companies world-wide to integrate electron-processing technology as part of the viscose manufacturing process. The viscose industry converts cellulose wood pulp into products such as staple fiber, filament, cord, film, packaging, and non-edible sausage casings. This multibillion dollar industry is currently suffering from high production costs, and is facing increasingly stringent environmental regulations. The use of electron-treated pulp can significantly lower production costs and can provide equally significant environmental benefits. This paper describes our current understanding of the benefits of using electron-treated pulp in this process, and AECL's efforts in developing this technology.

Design, Fabrication, and Characterization of Carbon Nanotube Field Emission Devices for Advanced Applications

NASA Astrophysics Data System (ADS)

Radauscher, Erich Justin

Carbon nanotubes (CNTs) have recently emerged as promising candidates for electron field emission (FE) cathodes in integrated FE devices. These nanostructured carbon materials possess exceptional properties and their synthesis can be thoroughly controlled. Their integration into advanced electronic devices, including not only FE cathodes, but sensors, energy storage devices, and circuit components, has seen rapid growth in recent years. The results of the studies presented here demonstrate that the CNT field emitter is an excellent candidate for next generation vacuum microelectronics and related electron emission devices in several advanced applications. The work presented in this study addresses determining factors that currently confine the performance and application of CNT-FE devices. Characterization studies and improvements to the FE properties of CNTs, along with Micro-Electro-Mechanical Systems (MEMS) design and fabrication, were utilized in achieving these goals. Important performance limiting parameters, including emitter lifetime and failure from poor substrate adhesion, are examined. The compatibility and integration of CNT emitters with the governing MEMS substrate (i.e., polycrystalline silicon), and its impact on these performance limiting parameters, are reported. CNT growth mechanisms and kinetics were investigated and compared to silicon (100) to improve the design of CNT emitter integrated MEMS based electronic devices, specifically in vacuum microelectronic device (VMD) applications. Improved growth allowed for design and development of novel cold-cathode FE devices utilizing CNT field emitters. A chemical ionization (CI) source based on a CNT-FE electron source was developed and evaluated in a commercial desktop mass spectrometer for explosives trace detection. This work demonstrated the first reported use of a CNT-based ion source capable of collecting CI mass spectra. The CNT-FE source demonstrated low power requirements, pulsing capabilities, and average lifetimes of over 320 hours when operated in constant emission mode under elevated pressures, without sacrificing performance. Additionally, a novel packaged ion source for miniature mass spectrometer applications using CNT emitters, a MEMS based Nier-type geometry, and a Low Temperature Cofired Ceramic (LTCC) 3D scaffold with integrated ion optics were developed and characterized. While previous research has shown other devices capable of collecting ion currents on chip, this LTCC packaged MEMS micro-ion source demonstrated improvements in energy and angular dispersion as well as the ability to direct the ions out of the packaged source and towards a mass analyzer. Simulations and experimental design, fabrication, and characterization were used to make these improvements. Finally, novel CNT-FE devices were developed to investigate their potential to perform as active circuit elements in VMD circuits. Difficulty integrating devices at micron-scales has hindered the use of vacuum electronic devices in integrated circuits, despite the unique advantages they offer in select applications. Using a combination of particle trajectory simulation and experimental characterization, device performance in an integrated platform was investigated. Solutions to the difficulties in operating multiple devices in close proximity and enhancing electron transmission (i.e., reducing grid loss) are explored in detail. A systematic and iterative process was used to develop isolation structures that reduced crosstalk between neighboring devices from 15% on average, to nearly zero. Innovative geometries and a new operational mode reduced grid loss by nearly threefold, thereby improving transmission of the emitted cathode current to the anode from 25% in initial designs to 70% on average. These performance enhancements are important enablers for larger scale integration and for the realization of complex vacuum microelectronic circuits.

Quality assurance plan for Solar Maximum Mission (SSM) Instruments electronic assembly - HRUV spectrometer/polarimeter

NASA Technical Reports Server (NTRS)

1976-01-01

The quality assurance program demonstrates recognition of the quality aspects and an organized approach to achieve them. It ensures that quality requirements are determined and satisfied throughout all phases of contract performance, including preliminary and engineering design, development, fabrication, processing, assembly, inspection, test, checkout, packaging, shipping, storage, maintenance field use, flight preparations, flight operations and post-flight analysis, as applicable.

Installation package for integrated programmable electronic controller and hydronic subsystem - solar heating and cooling

NASA Technical Reports Server (NTRS)

1978-01-01

A description is given of the Installation, Operation, and Maintenance Manual and information on the power panel and programmable microprocessor, a hydronic solar pump system and a hydronic heating hot water pumping system. These systems are integrated into various configurations for usages in solar energy management, control and monitoring, lighting control, data logging and other solar related applications.

Solar powered hybrid sensor module program

NASA Technical Reports Server (NTRS)

Johnson, J. M.; Holmes, H. K.

1985-01-01

Geo-orbital systems of the near future will require more sophisticated electronic and electromechanical monitoring and control systems than current satellite systems with an emphasis in the design on the electronic density and autonomy of the subsystem components. Results of a project to develop, design, and implement a proof-of-concept sensor system for space applications, with hybrids forming the active subsystem components are described. The design of the solar power hybrid sensor modules is discussed. Module construction and function are described. These modules combined low power CMOS electronics, GaAs solar cells, a crystal oscillatory standard UART data formatting, and a bidirectional optical data link into a single 1.25 x 1.25 x 0.25 inch hybrid package which has no need for electrical input or output. Several modules were built and tested. Applications of such a system for future space missions are also discussed.

Column Grid Array Rework for High Reliability

NASA Technical Reports Server (NTRS)

Mehta, Atul C.; Bodie, Charles C.

2008-01-01

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

Microfluidics on compliant substrates: recent developments in foldable and bendable devices and system packaging

NASA Astrophysics Data System (ADS)

Gray, Bonnie L.

2012-04-01

Microfluidics is revolutionizing laboratory methods and biomedical devices, offering new capabilities and instrumentation in multiple areas such as DNA analysis, proteomics, enzymatic analysis, single cell analysis, immunology, point-of-care medicine, personalized medicine, drug delivery, and environmental toxin and pathogen detection. For many applications (e.g., wearable and implantable health monitors, drug delivery devices, and prosthetics) mechanically flexible polymer devices and systems that can conform to the body offer benefits that cannot be achieved using systems based on conventional rigid substrate materials. However, difficulties in implementing active devices and reliable packaging technologies have limited the success of flexible microfluidics. Employing highly compliant materials such as PDMS that are typically employed for prototyping, we review mechanically flexible polymer microfluidic technologies based on free-standing polymer substrates and novel electronic and microfluidic interconnection schemes. Central to these new technologies are hybrid microfabrication methods employing novel nanocomposite polymer materials and devices. We review microfabrication methods using these materials, along with demonstrations of example devices and packaging schemes that employ them. We review these recent developments and place them in the context of the fields of flexible microfluidics and conformable systems, and discuss cross-over applications to conventional rigid-substrate microfluidics.

On-chip cooling by superlattice-based thin-film thermoelectrics.

PubMed

Chowdhury, Ihtesham; Prasher, Ravi; Lofgreen, Kelly; Chrysler, Gregory; Narasimhan, Sridhar; Mahajan, Ravi; Koester, David; Alley, Randall; Venkatasubramanian, Rama

2009-04-01

There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.

Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, D. J.; Paret, P. P.; Wereszczak, A. A.

2014-08-01

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesismore » of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.« less

Chitosan nanocomposite films based on Ag-NP and Au-NP biosynthesis by Bacillus Subtilis as packaging materials.

PubMed

Youssef, Ahmed M; Abdel-Aziz, Mohamed S; El-Sayed, Samah M

2014-08-01

Chitosan-silver (CS-Ag) and Chitosan-gold (CS-Au) nanocomposites films were synthesized by a simple chemical method. A local bacterial isolate identified as Bacillus subtilis ss subtilis was found to be capable to synthesize both silver nanoparticles (Ag-NP) and gold nanoparticles (Au-NP) from silver nitrate (AgNO3) and chloroauric acid (AuCl(4-)) solutions, respectively. The biosynthesis of both Ag-NP and Au-NP characterize using UV/vis spectroscopy, scanning electron microscopy (SEM), transmission electron microscopy (TEM) and X-ray diffraction (XRD), and then added to chitosan by different ratios (0.5, 1 and 2%). The prepared chitosan nanocomposites films were characterize using UV, XRD, SEM and TEM. Moreover, the antibacterial activity of the prepared films was evaluated against gram positive (Staphylococcus aureus) and gram negative bacteria (Pseudomonas aerugenosa), fungi (Aspergillus niger) and yeast (Candida albicans). Therefore, these materials can be potential used as antimicrobial agents in packaging applications. Copyright © 2014 Elsevier B.V. All rights reserved.

A Boundary Scan Test Vehicle for Direct Chip Attach Testing

NASA Technical Reports Server (NTRS)

Parsons, Heather A.; DAgostino, Saverio; Arakaki, Genji

2000-01-01

To facilitate the new faster, better and cheaper spacecraft designs, smaller more mass efficient avionics and instruments are using higher density electronic packaging technologies such as direct chip attach (DCA). For space flight applications, these technologies need to have demonstrated reliability and reasonably well defined fabrication and assembly processes before they will be accepted as baseline designs in new missions. As electronics shrink in size, not only can repair be more difficult, but 49 probing" circuitry can be very risky and it becomes increasingly more difficult to identify the specific source of a problem. To test and monitor these new technologies, the Direct Chip Attach Task, under NASA's Electronic Parts and Packaging Program (NEPP), chose the test methodology of boundary scan testing. The boundary scan methodology was developed for interconnect integrity and functional testing at hard to access electrical nodes. With boundary scan testing, active devices are used and failures can be identified to the specific device and lead. This technology permits the incorporation of "built in test" into almost any circuit and thus gives detailed test access to the highly integrated electronic assemblies. This presentation will describe boundary scan, discuss the development of the boundary scan test vehicle for DCA and current plans for testing of direct chip attach configurations.

An Investigation of Nonuniform Dose Deposition From an Electron Beam

DTIC Science & Technology

1994-08-01

to electron - beam pulse. Ceramic package HIPEC Lid Electron beam Die Bond wires TLD TLD Silver epoxy 6 package cavity die TLD’s 21 3 4 5 Figure 2...these apertures was documented in a previous experiment relating to HIFX electron -beam dosimetry .2 The hardware required for this setup was a 60-cm...impurity serves 2Gregory K. Ovrebo, Steven M. Blomquist, and Steven R. Murrill, A HIFX Electron -Beam Dosimetry System, Army Research Laboratory, ARL-TR

Modeling parameterized geometry in GPU-based Monte Carlo particle transport simulation for radiotherapy.

PubMed

Chi, Yujie; Tian, Zhen; Jia, Xun

2016-08-07

Monte Carlo (MC) particle transport simulation on a graphics-processing unit (GPU) platform has been extensively studied recently due to the efficiency advantage achieved via massive parallelization. Almost all of the existing GPU-based MC packages were developed for voxelized geometry. This limited application scope of these packages. The purpose of this paper is to develop a module to model parametric geometry and integrate it in GPU-based MC simulations. In our module, each continuous region was defined by its bounding surfaces that were parameterized by quadratic functions. Particle navigation functions in this geometry were developed. The module was incorporated to two previously developed GPU-based MC packages and was tested in two example problems: (1) low energy photon transport simulation in a brachytherapy case with a shielded cylinder applicator and (2) MeV coupled photon/electron transport simulation in a phantom containing several inserts of different shapes. In both cases, the calculated dose distributions agreed well with those calculated in the corresponding voxelized geometry. The averaged dose differences were 1.03% and 0.29%, respectively. We also used the developed package to perform simulations of a Varian VS 2000 brachytherapy source and generated a phase-space file. The computation time under the parameterized geometry depended on the memory location storing the geometry data. When the data was stored in GPU's shared memory, the highest computational speed was achieved. Incorporation of parameterized geometry yielded a computation time that was ~3 times of that in the corresponding voxelized geometry. We also developed a strategy to use an auxiliary index array to reduce frequency of geometry calculations and hence improve efficiency. With this strategy, the computational time ranged in 1.75-2.03 times of the voxelized geometry for coupled photon/electron transport depending on the voxel dimension of the auxiliary index array, and in 0.69-1.23 times for photon only transport.

Quantification of free convection for embarked QFN64 electronic package: An experimental and numerical survey

NASA Astrophysics Data System (ADS)

Baïri, A.

2017-08-01

Embarked Quad Flat Non-lead (QFN) electronic devices are equipped with a significant number of sensors used for flight parameters measurement purposes. Their accuracy directly depends on the package thermal state. Flight safety therefore depends on the reliability of these QFNs, whose junction temperature must remain as low as possible while operating. The QFN64 is favored for these applications. In the operating power range considered here (0.01-0.1W), the study shows that radiative heat transfer is negligible with respect to natural convective exchanges. It is then essential to quantify the convective heat transfer coefficient on its different areas so that the arrangement is properly dimensioned. This is the objective of this work. The device is welded on a PCB which may be inclined with respect to the horizontal plane by an angle ranging from 0° to 90°. Numerical approach results are confirmed by thermal and electrical measurements carried out on prototypes for all power-inclination angle combinations. The correlations here proposed help determine the natural convective heat transfer coefficient in any area of the assembly. This work allowed to thermally characterize and certify a new QFN64 package equipped with sensors designed for aeronautics, currently under industrialization process.

The Electrical Properties for Phenolic Isocyanate-Modified Bisphenol-Based Epoxy Resins Comprising Benzoate Group.

PubMed

Lee, Eun Yong; Chae, Il Seok; Park, Dongkyung; Suh, Hongsuk; Kang, Sang Wook

2016-03-01

Epoxy resin has been required to have a low dielectric constant (D(k)), low dissipation factor (Df), low coefficient of thermal expansion (CTE), low water absorption, high mechanical, and high adhesion properties for various applications. A series of novel phenolic isocyanate-modified bisphenol-based epoxy resins comprising benzoate group were prepared for practical electronic packaging applications. The developed epoxy resins showed highly reduced dielectric constants (D(k)-3.00 at 1 GHz) and low dissipation values (Df-0.014 at 1 GHz) as well as enhanced thermal properties.

1998 IEEE Aerospace Conference. Proceedings.

NASA Astrophysics Data System (ADS)

The following topics were covered: science frontiers and aerospace; flight systems technologies; spacecraft attitude determination and control; space power systems; smart structures and dynamics; military avionics; electronic packaging; MEMS; hyperspectral remote sensing for GVP; space laser technology; pointing, control, tracking and stabilization technologies; payload support technologies; protection technologies; 21st century space mission management and design; aircraft flight testing; aerospace test and evaluation; small satellites and enabling technologies; systems design optimisation; advanced launch vehicles; GPS applications and technologies; antennas and radar; software and systems engineering; scalable systems; communications; target tracking applications; remote sensing; advanced sensors; and optoelectronics.

Diffraction radiation generators

NASA Astrophysics Data System (ADS)

Shestopalov, Viktor P.; Vertii, Aleksei A.; Ermak, Gennadii P.; Skrynnik, Boris K.; Khlopov, Grigorii I.; Tsvyk, Aleksei I.

Research in the field of diffraction radiation generators (DRG) conducted at the Radio Physics and electronics Institute of the Ukranian Academy of Sciences over the past 25 years is reviewed. The effect of diffraction radiation is analyzed in detail, and various operating regimes of DRGs are discussed. The discussion then focuses on the principal requirements for the design of packaged DRGs and their principal parameters. Finally, applications of DRGs in various fields of science and technology are reviewed, including such applications as DRG spectroscopy, diagnostics of plasma, biological specimens, and vibration, and DRG radar systems.

FOREWORD: Proceedings of the 39th International Microelectronics and Packaging IMAPS Poland Conference

NASA Astrophysics Data System (ADS)

Jasiński, Piotr; Górecki, Krzysztof; Bogdanowicz, Robert

2016-01-01

These proceedings are a collection of the selected articles presented at the 39th International Microelectronics and Packaging IMAPS Poland Conference, held in Gdansk, Poland on September 20-23, 2015 (IMAPS Poland 2015). The conference has been held under the scientific patronage of the International Microelectronics and Packaging Society Poland Chapter and the Committee of Electronics and Telecommunication, Polish Academy of Science and jointly hosted by the Gdansk University of Technology, Faculty of Electronics, Telecommunication and Informatics (GUT) and the Gdynia Maritime University, Faculty of Electrical Engineering (GMU). The IMAPS Poland conference series aims to advance interdisciplinary scientific information exchange and the discussion of the science and technology of advanced electronics. The IMAPS Poland 2015 conference took place in the heart of Gdansk, two minutes walking distance from the beach. The surroundings and location of the venue guaranteed excellent working and leisure conditions. The three-day conference highlighted invited talks by outstanding scientists working in important areas of electronics and electronic material science. The eight sessions covered areas in the fields of electronics packaging, interconnects on PCB, Low Temperature Co-fired Ceramic (LTCC), MEMS devices, transducers, sensors and modelling of electronic devices. The conference was attended by 99 participants from 11 countries. The conference schedule included 18 invited presentations and 78 poster presentations.

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

NASA Technical Reports Server (NTRS)

Patterson, Richard; Hammoud, Ahmad; Elbuluk, Malik

2008-01-01

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

Investigation Of The Effects Of Reflow Profile Parameters On Lead-free Solder Bump Volumes And Joint Integrity

NASA Astrophysics Data System (ADS)

Amalu, E. H.; Lui, Y. T.; Ekere, N. N.; Bhatti, R. S.; Takyi, G.

2011-01-01

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24-1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Zero-dimensional to three-dimensional nanojoining: current status and potential applications

DOE PAGES

Ma, Ying; Li, Hong; Bridges, Denzel; ...

2016-08-01

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

Very large scale heterogeneous integration (VLSHI) and wafer-level vacuum packaging for infrared bolometer focal plane arrays

NASA Astrophysics Data System (ADS)

Forsberg, Fredrik; Roxhed, Niclas; Fischer, Andreas C.; Samel, Björn; Ericsson, Per; Hoivik, Nils; Lapadatu, Adriana; Bring, Martin; Kittilsland, Gjermund; Stemme, Göran; Niklaus, Frank

2013-09-01

Imaging in the long wavelength infrared (LWIR) range from 8 to 14 μm is an extremely useful tool for non-contact measurement and imaging of temperature in many industrial, automotive and security applications. However, the cost of the infrared (IR) imaging components has to be significantly reduced to make IR imaging a viable technology for many cost-sensitive applications. This paper demonstrates new and improved fabrication and packaging technologies for next-generation IR imaging detectors based on uncooled IR bolometer focal plane arrays. The proposed technologies include very large scale heterogeneous integration for combining high-performance, SiGe quantum-well bolometers with electronic integrated read-out circuits and CMOS compatible wafer-level vacuum packing. The fabrication and characterization of bolometers with a pitch of 25 μm × 25 μm that are arranged on read-out-wafers in arrays with 320 × 240 pixels are presented. The bolometers contain a multi-layer quantum well SiGe thermistor with a temperature coefficient of resistance of -3.0%/K. The proposed CMOS compatible wafer-level vacuum packaging technology uses Cu-Sn solid-liquid interdiffusion (SLID) bonding. The presented technologies are suitable for implementation in cost-efficient fabless business models with the potential to bring about the cost reduction needed to enable low-cost IR imaging products for industrial, security and automotive applications.

The NASA Electronic Parts and Packaging (NEPP) Program - NASA Items of Interest

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2017-01-01

This presentation provides a background summary of the NEPP Program, its origins and operating principles followed by examples of issues and opportunities that NEPP is currently pursuing. These examples include Electrostatic Discharge protection procedures that are not being properly applied, one reason for which is the confusion caused by the numerous, different standards covering this topic. Updates are provided for key activities in radiation hardness assurance, and the evaluation of automotive grade electronic parts for use in space applications. Some recent examples of part problems experienced by NASA are briefly described and the latest trending of incidences of counterfeit electronic parts is shown graphically. Finally some forward actions are identified and the time, place and typical topics is provided for the next NEPP Electronic Technology Workshop (ETW).

Magnetoresistive Current Sensors for High Accuracy, High Bandwidth Current Measurement in Spacecraft Power Electronics

NASA Astrophysics Data System (ADS)

Slatter, Rolf; Goffin, Benoit

2014-08-01

The usage of magnetoresistive (MR) current sensors is increasing steadily in the field of power electronics. Current sensors must not only be accurate and dynamic, but must also be compact and robust. The MR effect is the basis for current sensors with a unique combination of precision and bandwidth in a compact package. A space-qualifiable magnetoresistive current sensor with high accuracy and high bandwidth is being jointly developed by the sensor manufacturer Sensitec and the spacecraft power electronics supplier Thales Alenia Space (T AS) Belgium. Test results for breadboards incorporating commercial-off-the-shelf (COTS) sensors are presented as well as an application example in the electronic control and power unit for the thrust vector actuators of the Ariane5-ME launcher.

Identification of New Potential Scientific and Technology Areas for DoD Application. Summary of Activities

DTIC Science & Technology

1986-07-31

designer will be able to more rapid- ly assemble a total software package from perfected modules that can be easily de - bugged or replaced with more...antinuclear interactions e. gravitational effects of antimatter 2. possible machine parameters and lattice design 3. electron and stochastic cooling needs 4...implementation, reliability requirements; development of design environments and of experimental methodology; technology transfer methods from

Membrane Pump for Synthetic Muscle Actuation

DTIC Science & Technology

2009-09-28

FIG. 3 is a schematic representation of an embodiment of a muscle equipped to use electroosmotic flow in accordance with the present invention...water through the membrane to the cathode. This movement of water across the membrane during the application of current is called electroosmotic ...current and a 120 V AC source, again with an appropriate electronics package to control voltage and current. Preferably, the power source 316 can be

Thermal Testing and Quality Assurance of BGA LCC & QFN Electronic Packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kuper, Cameron Mathias

The purpose of this project is to experimentally validate the thermal fatigue life of solder interconnects for a variety of surface mount electronic packages. Over the years, there has been a significant amount of research and analysis in the fracture of solder joints on printed circuit boards. Solder is important in the mechanical and electronic functionality of the component. It is important throughout the life of the product that the solder remains crack and fracture free. The specific type of solder used in this experiment is a 63Sn37Pb eutectic alloy. Each package was surrounded conformal coating or underfill material.

Searching for 'Unknown Unknowns'

NASA Technical Reports Server (NTRS)

Parsons, Vickie S.

2005-01-01

The NASA Engineering and Safety Center (NESC) was established to improve safety through engineering excellence within NASA programs and projects. As part of this goal, methods are being investigated to enable the NESC to become proactive in identifying areas that may be precursors to future problems. The goal is to find unknown indicators of future problems, not to duplicate the program-specific trending efforts. The data that is critical for detecting these indicators exist in a plethora of dissimilar non-conformance and other databases (without a common format or taxonomy). In fact, much of the data is unstructured text. However, one common database is not required if the right standards and electronic tools are employed. Electronic data mining is a particularly promising tool for this effort into unsupervised learning of common factors. This work in progress began with a systematic evaluation of available data mining software packages, based on documented decision techniques using weighted criteria. The four packages, which were perceived to have the most promise for NASA applications, are being benchmarked and evaluated by independent contractors. Preliminary recommendations for "best practices" in data mining and trending are provided. Final results and recommendations should be available in the Fall 2005. This critical first step in identifying "unknown unknowns" before they become problems is applicable to any set of engineering or programmatic data.

Processing of NiTi Reinforced Adaptive Solder for Electronic Packaging

DTIC Science & Technology

2004-03-01

NAVAL POSTGRADUATE SCHOOL MONTEREY, CALIFORNIA THESIS PROCESSING OF NITI REINFORCED ADAPTIVE SOLDER FOR ELECTRONIC PACKAGING...March 2004 3. REPORT TYPE AND DATES COVERED Master’s Thesis 4. TITLE AND SUBTITLE: Processing of NiTi Reinforced Adaptive Solder for Electronic...reports in the development a process to fabricate solder joints with a fine distribution of shape memory alloys (SMA) NiTi particulates. The

IMGui-A Desktop GUI Application for Isolation with Migration Analyses.

PubMed

Knoblauch, Jared; Sethuraman, Arun; Hey, Jody

2017-02-01

The Isolation with Migration (IM) programs (e.g., IMa2) have been utilized extensively by evolutionary biologists for model-based inference of demographic parameters including effective population sizes, migration rates, and divergence times. Here, we describe a graphical user interface for the latest IM program. IMGui provides a comprehensive set of tools for performing demographic analyses, tracking progress of runs, and visualizing results. Developed using node. js and the Electron framework, IMGui is an application that runs on any desktop operating system, and is available for download at https://github.com/jaredgk/IMgui-electron-packages. © The Author 2016. Published by Oxford University Press on behalf of the Society for Molecular Biology and Evolution. All rights reserved. For permissions, please e-mail: journals.permissions@oup.com.

Construction of RNA nanocages by re-engineering the packaging RNA of Phi29 bacteriophage

NASA Astrophysics Data System (ADS)

Hao, Chenhui; Li, Xiang; Tian, Cheng; Jiang, Wen; Wang, Guansong; Mao, Chengde

2014-05-01

RNA nanotechnology promises rational design of RNA nanostructures with wide array of structural diversities and functionalities. Such nanostructures could be used in applications such as small interfering RNA delivery and organization of in vivo chemical reactions. Though having impressive development in recent years, RNA nanotechnology is still quite limited and its programmability and complexity could not rival the degree of its closely related cousin: DNA nanotechnology. Novel strategies are needed for programmed RNA self-assembly. Here, we have assembled RNA nanocages by re-engineering a natural, biological RNA motif: the packaging RNA of phi29 bacteriophage. The resulting RNA nanostructures have been thoroughly characterized by gel electrophoresis, cryogenic electron microscopy imaging and dynamic light scattering.

Power Electronics Packaging Reliability | Transportation Research | NREL

Science.gov Websites

interface materials, are a key enabling technology for compact, lightweight, low-cost, and reliable power , reliability, and cost. High-temperature bonded interface materials are an important facilitating technology for compact, lightweight, low-cost, reliable power electronics packaging that fully utilizes the

7 CFR Exhibit D to Subpart B of... - Designated Counties for Housing Application Packaging Grants

Code of Federal Regulations, 2010 CFR

2010-01-01

... 7 Agriculture 13 2010-01-01 2009-01-01 true Designated Counties for Housing Application Packaging... Application Packaging Grants Pt. 1944, Subpt. B, Exh. D Exhibit D to Subpart B of Part 1944—Designated Counties for Housing Application Packaging Grants ER25my05.036 ER25my05.037 ER25my05.038 ER25my05.039 [70...

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2013-01-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

30 CFR 906.30 - State-Federal cooperative agreement.

Code of Federal Regulations, 2010 CFR

2010-07-01

... Federal lands to submit a permit application package or an application for a permit revision or renewal in... documentation is submitted as part of a permit application, a copy of the entire package will be forwarded to the MMS by OSM. The permit application package or application for a permit revision or renewal shall...

30 CFR 906.30 - State-Federal cooperative agreement.

Code of Federal Regulations, 2012 CFR

2012-07-01

... Federal lands to submit a permit application package or an application for a permit revision or renewal in... documentation is submitted as part of a permit application, a copy of the entire package will be forwarded to the MMS by OSM. The permit application package or application for a permit revision or renewal shall...

30 CFR 906.30 - State-Federal cooperative agreement.

Code of Federal Regulations, 2011 CFR

2011-07-01

... Federal lands to submit a permit application package or an application for a permit revision or renewal in... documentation is submitted as part of a permit application, a copy of the entire package will be forwarded to the MMS by OSM. The permit application package or application for a permit revision or renewal shall...

Development and testing of the Junkeeper Control Corporation integrated programmable electronic controller and hydronics package

NASA Technical Reports Server (NTRS)

Hankins, J. D.

1979-01-01

Additional developmental work on the existing programmable electronic controller and hydronic package for use with solar heating and cooling systems is summarized. The controller/hydronics subsystems passed all acceptance tests and performance criteria. The subsystems were shown marketable for public use.

Japan's electronic packaging technologies

NASA Technical Reports Server (NTRS)

Tummala, Rao R.; Pecht, Michael

1995-01-01

The JTEC panel found Japan to have significant leadership over the United States in the strategic area of electronic packaging. Many technologies and products once considered the 'heart and soul' of U.S. industry have been lost over the past decades to Japan and other Asian countries. The loss of consumer electronics technologies and products is the most notable of these losses, because electronics is the United States' largest employment sector and is critical for growth businesses in consumer products, computers, automobiles, aerospace, and telecommunications. In the past there was a distinction between consumer and industrial product technologies. While Japan concentrated on the consumer market, the United States dominated the industrial sector. No such distinction is anticipated in the future; the consumer-oriented technologies Japan has dominated are expected to characterize both domains. The future of U.S. competitiveness will, therefore, depend on the ability of the United States to rebuild its technological capabilities in the area of portable electronic packaging.

Thermally Stabilized Transmit/Receive Modules

NASA Technical Reports Server (NTRS)

Hoffman, James; DelCastillo, Linda; Miller, Jennifer; Birur, Gaj

2011-01-01

RF-hybrid technologies enable smaller packaging and mass reduction in radar instruments, especially for subsystems with dense electronics, such as electronically steered arrays. We are designing thermally stabilized RF-hybrid T/R modules using new materials for improved thermal performance of electronics. We are combining advanced substrate and housing materials with a thermal reservoir material, and develop new packaging techniques to significantly improve thermal-cycling reliability and performance stability over temperature.

Packaging - Materials review

NASA Astrophysics Data System (ADS)

Herrmann, Matthias

2014-06-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.

Optical fiber sensors embedded in flexible polymer foils

NASA Astrophysics Data System (ADS)

van Hoe, Bram; van Steenberge, Geert; Bosman, Erwin; Missinne, Jeroen; Geernaert, Thomas; Berghmans, Francis; Webb, David; van Daele, Peter

2010-04-01

In traditional electrical sensing applications, multiplexing and interconnecting the different sensing elements is a major challenge. Recently, many optical alternatives have been investigated including optical fiber sensors of which the sensing elements consist of fiber Bragg gratings. Different sensing points can be integrated in one optical fiber solving the interconnection problem and avoiding any electromagnetical interference (EMI). Many new sensing applications also require flexible or stretchable sensing foils which can be attached to or wrapped around irregularly shaped objects such as robot fingers and car bumpers or which can even be applied in biomedical applications where a sensor is fixed on a human body. The use of these optical sensors however always implies the use of a light-source, detectors and electronic circuitry to be coupled and integrated with these sensors. The coupling of these fibers with these light sources and detectors is a critical packaging problem and as it is well-known the costs for packaging, especially with optoelectronic components and fiber alignment issues are huge. The end goal of this embedded sensor is to create a flexible optical sensor integrated with (opto)electronic modules and control circuitry. To obtain this flexibility, one can embed the optical sensors and the driving optoelectronics in a stretchable polymer host material. In this article different embedding techniques for optical fiber sensors are described and characterized. Initial tests based on standard manufacturing processes such as molding and laser structuring are reported as well as a more advanced embedding technique based on soft lithography processing.

Effect of gamma irradiation on physicochemical properties of commercial poly(lactic acid) clamshell for food packaging

NASA Astrophysics Data System (ADS)

Madera-Santana, Tomás J.; Meléndrez, R.; González-García, Gerardo; Quintana-Owen, Patricia; Pillai, Suresh D.

2016-06-01

Poly(lactic acid) (PLA) is a well-known biodegradable polymer with strong potential application in food packaging industry. In this paper, samples of PLA clamshell for tomatoes packaging were exposed with 60CO γ-ray's source (1.33 MeV) at different dose levels (0, 10, 60, 150, 300, and 600 kGy), at room temperature and in presence of air. The physicochemical properties of neat PLA and sample exposed to gamma irradiation were investigated using Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), gel permeation chromatography (GPC), differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), scanning electron microscopy (SEM) and tensile measurements. Results show as the dose increases, the molecular weight (Mw), melting temperature (Tm), tensile strength and elongation at break decreased. However, the tensile modulus increased with increasing doses. The surface of PLA clamshells was degraded (scratches and minor cracks) when samples were exposed to doses greater than 60 kGy.

The Conference on High Temperature Electronics

NASA Technical Reports Server (NTRS)

Hamilton, D. J.; Mccormick, J. B.; Kerwin, W. J.; Narud, J. A.

1981-01-01

The status of and directions for high temperature electronics research and development were evaluated. Major objectives were to (1) identify common user needs; (2) put into perspective the directions for future work; and (3) address the problem of bringing to practical fruition the results of these efforts. More than half of the presentations dealt with materials and devices, rather than circuits and systems. Conference session titles and an example of a paper presented in each session are (1) User requirements: High temperature electronics applications in space explorations; (2) Devices: Passive components for high temperature operation; (3) Circuits and systems: Process characteristics and design methods for a 300 degree QUAD or AMP; and (4) Packaging: Presently available energy supply for high temperature environment.

The Conference on High Temperature Electronics

NASA Astrophysics Data System (ADS)

Hamilton, D. J.; McCormick, J. B.; Kerwin, W. J.; Narud, J. A.

The status of and directions for high temperature electronics research and development were evaluated. Major objectives were to (1) identify common user needs; (2) put into perspective the directions for future work; and (3) address the problem of bringing to practical fruition the results of these efforts. More than half of the presentations dealt with materials and devices, rather than circuits and systems. Conference session titles and an example of a paper presented in each session are (1) User requirements: High temperature electronics applications in space explorations; (2) Devices: Passive components for high temperature operation; (3) Circuits and systems: Process characteristics and design methods for a 300 degree QUAD or AMP; and (4) Packaging: Presently available energy supply for high temperature environment.

Report of the sensor readout electronics panel

NASA Technical Reports Server (NTRS)

Fossum, Eric R.; Carson, J.; Kleinhans, W.; Kosonocky, W.; Kozlowski, L.; Pecsalski, A.; Silver, A.; Spieler, H.; Woolaway, J.

1991-01-01

The findings of the Sensor Readout Electronics Panel are summarized in regard to technology assessment and recommended development plans. In addition to two specific readout issues, cryogenic readouts and sub-electron noise, the panel considered three advanced technology areas that impact the ability to achieve large format sensor arrays. These are mega-pixel focal plane packaging issues, focal plane to data processing module interfaces, and event driven readout architectures. Development in each of these five areas was judged to have significant impact in enabling the sensor performance desired for the Astrotech 21 mission set. Other readout issues, such as focal plane signal processing or other high volume data acquisition applications important for Eos-type mapping, were determined not to be relevant for astrophysics science goals.

30 CFR 931.30 - State-Federal cooperative agreement.

Code of Federal Regulations, 2010 CFR

2010-07-01

... package or application for a permit revision or renewal and specify any requirements for additional data... requirements of this Agreement. Article VII: Permit Application Package 11. Mining and Minerals and OSM shall require an operator on Federal lands to submit a permit application package or an application for a permit...

30 CFR 931.30 - State-Federal cooperative agreement.

Code of Federal Regulations, 2011 CFR

2011-07-01

... package or application for a permit revision or renewal and specify any requirements for additional data... requirements of this Agreement. Article VII: Permit Application Package 11. Mining and Minerals and OSM shall require an operator on Federal lands to submit a permit application package or an application for a permit...

Tool for use in lifting pin supported objects

NASA Technical Reports Server (NTRS)

Marzek, R. A.; Read, W. S. (Inventor)

1974-01-01

A tool for use in lifting a pin-supported, electronic package mounted in juxtaposition with the surface of an electronic circuit board is described. The tool is configured to be received beneath a pin-supported package and is characterized by a manually operable linkage, including an elongated, rigid link is supported for axial reciprocation and a pivotal link pinned to the body and supported for oscillation induced in response to axial motion imparted to the rigid link. A lifting plate is pivotally coupled to the distal end of the pivotal link so that oscillatory motion imparted to the pivotal link serves to move the plate vertically for elevating the plate into lifting engagement with the electronic package positioned thereabove.

Radiation applications research and facilities in AECL research company

NASA Astrophysics Data System (ADS)

Iverson, S. L.

In the 60's and 70's Atomic Energy of Canada had a very active R&D program to discover and develop applications of ionizing radiation. Out of this grew the technology underlying the company's current product line of industrial irradiators. With the commercial success of that product line the company turned its R&D attention to other activities. Presently, widespread interest in the use of radiation for food processing and the possibility of developing reliable and competitive machine sources of radiation hold out the promise of a major increase in industrial use of radiation. While many of the applications being considered are straightforward applications of existing knowledge, others depend on more subtle effects including combined effects of two or more agents. Further research is required in these areas. In March 1985 a new branch, Radiation Applications Research, began operations with the objective of working closely with industry to develop and assist the introduction of new uses of ionizing radiation. The Branch is equipped with appropriate analytical equipment including HPLC (high performance liquid chromatograph) and GC/MS (gas chromatograph/mass spectrometer) as well as a Gammacell 220 and an I-10/1, one kilowatt 10 MeV electron accelerator. The accelerator is located in a specially designed facility equipped for experimental irradiation of test quantities of packaged products as well as solids, liquids and gases in various configurations. A conveyor system moves the packaged products from the receiving area, through a maze, past the electron beam at a controlled rate and finally to the shipping area. Other necessary capabilities, such as gamma and electron dosimetry and a microbiology laboratory, have also been developed. Initial projects in areas ranging from food through environmental and industrial applications have been assessed and the most promising have been selected for further work. As an example, the use of charcoal adsorbent beds to concentrate the components of gas or liquid waste streams requiring treatment is showing promise as a method of significantly reducing the cost of radiation treatment for some effluents. A number of other projects are described.

Hermetic diode laser transmitter module

NASA Astrophysics Data System (ADS)

Ollila, Jyrki; Kautio, Kari; Vahakangas, Jouko; Hannula, Tapio; Kopola, Harri K.; Oikarinen, Jorma; Sivonen, Matti

1999-04-01

In very demanding optoelectronic sensor applications it is necessary to encapsulate semiconductor components hermetically in metal housings to ensure reliable operation of the sensor. In this paper we report on the development work to package a laser diode transmitter module for a time- off-light distance sensor application. The module consists of a lens, laser diode, electronic circuit and optomechanics. Specifications include high acceleration, -40....+75 degree(s)C temperature range, very low gas leakage and mass-production capability. We have applied solder glasses for sealing optical lenses and electrical leads hermetically into a metal case. The lens-metal case sealing has been made by using a special soldering glass preform preserving the optical quality of the lens. The metal housings are finally sealed in an inert atmosphere by welding. The assembly concept to retain excellent optical power and tight optical axis alignment specifications is described. The reliability of the laser modules manufactured has been extensively tested using different aging and environmental test procedures. Sealed packages achieve MIL- 883 standard requirements for gas leakage.

Modelling of an Orthovoltage X-ray Therapy Unit with the EGSnrc Monte Carlo Package

NASA Astrophysics Data System (ADS)

Knöös, Tommy; Rosenschöld, Per Munck Af; Wieslander, Elinore

2007-06-01

Simulations with the EGSnrc code package of an orthovoltage x-ray machine have been performed. The BEAMnrc code was used to transport electrons, produce x-ray photons in the target and transport of these through the treatment machine down to the exit level of the applicator. Further transport in water or CT based phantoms was facilitated by the DOSXYZnrc code. Phase space files were scored with BEAMnrc and analysed regarding the energy spectra at the end of the applicator. Tuning of simulation parameters was based on the half-value layer quantity for the beams in either Al or Cu. Calculated depth dose and profile curves have been compared against measurements and show good agreement except at shallow depths. The MC model tested in this study can be used for various dosimetric studies as well as generating a library of typical treatment cases that can serve as both educational material and guidance in the clinical practice

40 CFR 262.30 - Packaging.

Code of Federal Regulations, 2010 CFR

2010-07-01

... 40 Protection of Environment 25 2010-07-01 2010-07-01 false Packaging. 262.30 Section 262.30... APPLICABLE TO GENERATORS OF HAZARDOUS WASTE Pre-Transport Requirements § 262.30 Packaging. Before... the waste in accordance with the applicable Department of Transportation regulations on packaging...

Aging of electronics with application to nuclear power plant instrumentation. [PWR; BWR

DOE Office of Scientific and Technical Information (OSTI.GOV)

Johnson, Jr, R T; Thome, F V; Craft, C M

1983-01-01

A survey to identify areas of needed research to understand aging mechanisms for electronics in nuclear power plant instrumentation has been completed. The emphasis was on electronic components such as semiconductors, capacitors, and resistors used in safety-related instrumentation in the reactor containment area. The environmental and operational stress factors which may produce degradation during long-term operation were identified. Some attention was also given to humidity effects as related to seals and encapsulants, and failures in printed circuit boards and bonds and solder joints. Results suggest that neutron as well as gamma irradiations should be considered in simulating the aging environmentmore » for electronic components. Radiation dose-rate effects in semiconductor devices and organic capacitors need to be further investigated, as well as radiation-voltage bias synergistic effects in semiconductor devices and leakage and permeation of moisture through seals in electronics packages.« less

ProbeZT: Simulation of transport coefficients of molecular electronic junctions under environmental effects using Büttiker's probes

NASA Astrophysics Data System (ADS)

Korol, Roman; Kilgour, Michael; Segal, Dvira

2018-03-01

We present our in-house quantum transport package, ProbeZT. This program provides linear response coefficients: electrical and electronic thermal conductances, as well as the thermopower of molecular junctions in which electrons interact with the surrounding thermal environment. Calculations are performed based on the Büttiker probe method, which introduces decoherence, energy exchange and dissipation effects phenomenologically using virtual electrode terminals called probes. The program can realize different types of probes, each introducing various environmental effects, including elastic and inelastic scattering of electrons. The molecular system is described by an arbitrary tight-binding Hamiltonian, allowing the study of different geometries beyond simple one-dimensional wires. Applications of the program to study the thermoelectric performance of molecular junctions are illustrated. The program also has a built-in functionality to simulate electron transport in double-stranded DNA molecules based on a tight-binding (ladder) description of the junction.

Dissemination Package for Transition into Electronics (TIE) Project, October 1979-June 1980.

ERIC Educational Resources Information Center

Evergreen Valley Coll., San Jose, CA.

This dissemination package consists of a variety of advertising materials, forms, questionnaires, tests, and handouts developed as a part of the Transition into Electronics (TIE) Project. (The TIE Project was a project that developed, implemented, and evaluated a model designed to encourage persons to pursue education and training leading to…

45 CFR Appendix C to Part 1355 - Electronic Data Transmission Format

Code of Federal Regulations, 2010 CFR

2010-10-01

... mainframe-to-mainframe data exchange system using the Sterling Software data transfer package called “SUPERTRACS.” This package will allow data exchange between most computer platforms (both mini and mainframe... 45 Public Welfare 4 2010-10-01 2010-10-01 false Electronic Data Transmission Format C Appendix C...

45 CFR Appendix C to Part 1355 - Electronic Data Transmission Format

Code of Federal Regulations, 2011 CFR

2011-10-01

... mainframe-to-mainframe data exchange system using the Sterling Software data transfer package called “SUPERTRACS.” This package will allow data exchange between most computer platforms (both mini and mainframe... 45 Public Welfare 4 2011-10-01 2011-10-01 false Electronic Data Transmission Format C Appendix C...

Design and Performance of a Miniature Radar L-Band Transceiver

NASA Technical Reports Server (NTRS)

McWatters, D.; Price, D.; Edelstein, W.

2004-01-01

Radar electronics developed for past JPL space missions historically had been custom designed and as such, given budgetary, time, and risk constraints, had not been optimized for maximum flexibility or miniaturization. To help reduce cost and risk of future radar missions, a generic radar module was conceived. The module includes a 1.25-GHz (L-band) transceiver and incorporates miniature high-density packaging of integrated circuits in die/chip form. The technology challenges include overcoming the effect of miniaturization and high packaging density to achieve the performance, reliability, and environmental ruggedness required for space missions. The module was chosen to have representative (generic) functionality most likely required from an L-band radar. For very large aperture phased-array spaceborne radar missions, the large dimensions of the array suggest the benefit of distributing the radar electronics into the antenna array. For such applications, this technology is essential in order to bring down the cost, mass, and power of the radar electronics module replicated in each panel of the array. For smaller sized arrays, a single module can be combined with the central radar controller and still provide the bene.ts of configuration .exibility, low power, and low mass. We present the design approach for the radar electronics module and the test results for its radio frequency (RF) portion: a miniature, low-power, radiation-hard L-band transceiver.

Integrated three-dimensional module heat exchanger for power electronics cooling

DOEpatents

Bennion, Kevin; Lustbader, Jason

2013-09-24

Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.

Multi-dimensional simulation package for ultrashort pulse laser-matter interactions

NASA Astrophysics Data System (ADS)

Suslova, Anastassiya; Hassanein, Ahmed

2017-10-01

Advanced simulation models recently became a popular tool of investigation of ultrashort pulse lasers (USPLs) to enhance understanding of the physics and allow minimizing the experimental costs for optimization of laser and target parameters for various applications. Our research interest is focused on developing multi-dimensional simulation package FEMTO-2D to investigate the USPL-matter interactions and laser induced effects. The package is based on solution of two heat conduction equations for electron and lattice sub-systems - enhanced two temperature model (TTM). We have implemented theoretical approach based on the collision theory to define the thermal dependence of target material optical properties and thermodynamic parameters. Our approach allowed elimination of fitted parameters commonly used in TTM based simulations. FEMTO-2D is used to simulated the light absorption and interactions for several metallic targets as a function of wavelength and pulse duration for wide range of laser intensity. The package has capability to consider different angles of incidence and polarization. It has also been used to investigate the damage threshold of the gold coated optical components with the focus on the role of the film thickness and substrate heat sink effect. This work was supported by the NSF, PIRE project.

Equation of motion coupled cluster methods for electron attachment and ionization potential in fullerenes C60 and C70

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bhaskaran-Nair, Kiran; Kowalski, Karol; Moreno, Juana

Discovery of fullerenes has opened a entirely new chapter in chemistry due to their wide range of properties which holds exciting applications in numerous disciplines of science. The Nobel Prize in Chemistry 1996 was awarded jointly to Robert F. Curl Jr., Sir Harold W. Kroto and Richard E. Smalley in recoginition for their discovery of this new carbon allotrope. In this letter we are reporting ionization potential and electron attachment studies on fullerenes (C60 and C70) obtained with novel parallel implementation of the EA-EOM-CCSD and IP-EOM-CCSD methods in NWChem program package.

High Temperature Wireless Communication And Electronics For Harsh Environment Applications

NASA Technical Reports Server (NTRS)

Hunter, G. W.; Neudeck, P. G.; Beheim, G. M.; Ponchak, G. E.; Chen, L.-Y

2007-01-01

In order for future aerospace propulsion systems to meet the increasing requirements for decreased maintenance, improved capability, and increased safety, the inclusion of intelligence into the propulsion system design and operation becomes necessary. These propulsion systems will have to incorporate technology that will monitor propulsion component conditions, analyze the incoming data, and modify operating parameters to optimize propulsion system operations. This implies the development of sensors, actuators, and electronics, with associated packaging, that will be able to operate under the harsh environments present in an engine. However, given the harsh environments inherent in propulsion systems, the development of engine-compatible electronics and sensors is not straightforward. The ability of a sensor system to operate in a given environment often depends as much on the technologies supporting the sensor element as the element itself. If the supporting technology cannot handle the application, then no matter how good the sensor is itself, the sensor system will fail. An example is high temperature environments where supporting technologies are often not capable of operation in engine conditions. Further, for every sensor going into an engine environment, i.e., for every new piece of hardware that improves the in-situ intelligence of the components, communication wires almost always must follow. The communication wires may be within or between parts, or from the engine to the controller. As more hardware is added, more wires, weight, complexity, and potential for unreliability is also introduced. Thus, wireless communication combined with in-situ processing of data would significantly improve the ability to include sensors into high temperature systems and thus lead toward more intelligent engine systems. NASA Glenn Research Center (GRC) is presently leading the development of electronics, communication systems, and sensors capable of prolonged stable operation in harsh 500C environments. This has included world record operation of SiC-based transistor technology (including packaging) that has demonstrated continuous electrical operation at 500C for over 2000 hours. Based on SiC electronics, development of high temperature wireless communication has been on-going. This work has concentrated on maturing the SiC electronic devices for communication purposes as well as the passive components such as resistors and capacitors needed to enable a high temperature wireless system. The objective is to eliminate wires associated with high temperature sensors which add weight to a vehicle and can be a cause of sensor unreliability. This paper discusses the development of SiC based electronics and wireless communications technology for harsh environment applications such as propulsion health management systems and in Venus missions. A brief overview of the future directions in sensor technology is given including maturing of near-room temperature "Lick and Stick" leak sensor technology for possible implementation in the Crew Launch Vehicle program. Then an overview of high temperature electronics and the development of high temperature communication systems is presented. The maturity of related technologies such as sensor and packaging will also be discussed. It is concluded that a significant component of efforts to improve the intelligence of harsh environment operating systems is the development and implementation of high temperature wireless technology

Applications of high thermal conductivity composites to electronics and spacecraft thermal design

NASA Technical Reports Server (NTRS)

Sharp, G. Richard; Loftin, Timothy A.

1990-01-01

Recently, high thermal conductivity continuous graphite fiber reinforced metal matrix composites (MMC's) have become available that can save much weight over present methods of heat conduction. These materials have two or three times higher thermal conductivity in the fiber direction than the pure metals when compared on a thermal conductivity to weight basis. Use of these materials for heat conduction purposes can result in weight savings of from 50 to 70 percent over structural aluminum. Another significant advantage is that these materials can be used without the plumbing and testing complexities that accompany the use of liquid heat pipes. A spinoff of this research was the development of other MMC's as electronic device heat sinks. These use particulates rather than fibers and are formulated to match the coefficient of thermal expansion of electronic substrates in order to alleviate thermally induced stresses. The development of both types of these materials as viable weight saving substitutes for traditional methods of thermal control for electronics packaging and also for spacecraft thermal control applications are the subject of this report.

High-Throughput Printing Process for Flexible Electronics

NASA Astrophysics Data System (ADS)

Hyun, Woo Jin

Printed electronics is an emerging field for manufacturing electronic devices with low cost and minimal material waste for a variety of applications including displays, distributed sensing, smart packaging, and energy management. Moreover, its compatibility with roll-to-roll production formats and flexible substrates is desirable for continuous, high-throughput production of flexible electronics. Despite the promise, however, the roll-to-roll production of printed electronics is quite challenging due to web movement hindering accurate ink registration and high-fidelity printing. In this talk, I will present a promising strategy for roll-to-roll production using a novel printing process that we term SCALE (Self-aligned Capillarity-Assisted Lithography for Electronics). By utilizing capillarity of liquid inks on nano/micro-structured substrates, the SCALE process facilitates high-resolution and self-aligned patterning of electrically functional inks with greatly improved printing tolerance. I will show the fabrication of key building blocks (e.g. transistor, resistor, capacitor) for electronic circuits using the SCALE process on plastics.

Review and analysis of dense linear system solver package for distributed memory machines

NASA Technical Reports Server (NTRS)

Narang, H. N.

1993-01-01

A dense linear system solver package recently developed at the University of Texas at Austin for distributed memory machine (e.g. Intel Paragon) has been reviewed and analyzed. The package contains about 45 software routines, some written in FORTRAN, and some in C-language, and forms the basis for parallel/distributed solutions of systems of linear equations encountered in many problems of scientific and engineering nature. The package, being studied by the Computer Applications Branch of the Analysis and Computation Division, may provide a significant computational resource for NASA scientists and engineers in parallel/distributed computing. Since the package is new and not well tested or documented, many of its underlying concepts and implementations were unclear; our task was to review, analyze, and critique the package as a step in the process that will enable scientists and engineers to apply it to the solution of their problems. All routines in the package were reviewed and analyzed. Underlying theory or concepts which exist in the form of published papers or technical reports, or memos, were either obtained from the author, or from the scientific literature; and general algorithms, explanations, examples, and critiques have been provided to explain the workings of these programs. Wherever the things were still unclear, communications were made with the developer (author), either by telephone or by electronic mail, to understand the workings of the routines. Whenever possible, tests were made to verify the concepts and logic employed in their implementations. A detailed report is being separately documented to explain the workings of these routines.

Green Composites Made of Bamboo Fabric and Poly (Lactic) Acid for Packaging Applications—A Review

PubMed Central

Nurul Fazita, M.R.; Jayaraman, Krishnan; Bhattacharyya, Debes; Mohamad Haafiz, M.K.; Saurabh, Chaturbhuj K.; Hussin, M. Hazwan; H.P.S., Abdul Khalil

2016-01-01

Petroleum based thermoplastics are widely used in a range of applications, particularly in packaging. However, their usage has resulted in soaring pollutant emissions. Thus, researchers have been driven to seek environmentally friendly alternative packaging materials which are recyclable as well as biodegradable. Due to the excellent mechanical properties of natural fibres, they have been extensively used to reinforce biopolymers to produce biodegradable composites. A detailed understanding of the properties of such composite materials is vital for assessing their applicability to various products. The present review discusses several functional properties related to packaging applications in order to explore the potential of bamboo fibre fabric-poly (lactic) acid composites for packaging applications. Physical properties, heat deflection temperature, impact resistance, recyclability and biodegradability are important functional properties of packaging materials. In this review, we will also comprehensively discuss the chronological events and applications of natural fibre biopolymer composites. PMID:28773558

3D packaging of a microfluidic system with sensory applications

NASA Astrophysics Data System (ADS)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ma, Ying; Li, Hong; Bridges, Denzel

We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

7 CFR 1944.72 - Application packaging orientation and training.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 7 Agriculture 13 2010-01-01 2009-01-01 true Application packaging orientation and training. 1944... SERVICE, RURAL BUSINESS-COOPERATIVE SERVICE, RURAL UTILITIES SERVICE, AND FARM SERVICE AGENCY, DEPARTMENT... Grants § 1944.72 Application packaging orientation and training. Agency approval officials will orient...

Electron irradiation of dry food products

NASA Astrophysics Data System (ADS)

Grünewald, Th.

The interest of the industrial food producer is increasing in having the irradiation facility installed in the food processing chain. The throughput of the irradiator should be high and the residence time of the product in the facility should be short. These conditions can be accomplished by electron irradiators. To clarify the irradiation conditions spices taken out of the industrial process, food grade salt, sugar, and gums as models of dry food products were irradiated. With a radiation dose of 10 kGy microbial load can be reduced on 10∗∗4 microorganisms/g. The sensory properties of the spices were not changed in an atypical way. For food grade salt and sugar changes of colour were observed which are due to lattice defects or initiated browning. The irradiation of several gums led only in some cases to an improvement of the thickness properties in the application below 50°C, in most cases the thickness effect was reduced. The products were packaged before irradiation. But it would be possible also to irradiate the products without packaging moving the product through the iradiation field in a closed conveyor system.

Detailed Wave Function Analysis for Multireference Methods: Implementation in the Molcas Program Package and Applications to Tetracene.

PubMed

Plasser, Felix; Mewes, Stefanie A; Dreuw, Andreas; González, Leticia

2017-11-14

High-level multireference computations on electronically excited and charged states of tetracene are performed, and the results are analyzed using an extensive wave function analysis toolbox that has been newly implemented in the Molcas program package. Aside from verifying the strong effect of dynamic correlation, this study reveals an unexpected critical influence of the atomic orbital basis set. It is shown that different polarized double-ζ basis sets produce significantly different results for energies, densities, and overall wave functions, with the best performance obtained for the atomic natural orbital (ANO) basis set by Pierloot et al. Strikingly, the ANO basis set not only reproduces the energies but also performs exceptionally well in terms of describing the diffuseness of the different states and of their attachment/detachment densities. This study, thus, not only underlines the fact that diffuse basis functions are needed for an accurate description of the electronic wave functions but also shows that, at least for the present example, it is enough to include them implicitly in the contraction scheme.

Broadband Terahertz Refraction Index Dispersion and Loss of Polymeric Dielectric Substrate and Packaging Materials

NASA Astrophysics Data System (ADS)

Motaharifar, E.; Pierce, R. G.; Islam, R.; Henderson, R.; Hsu, J. W. P.; Lee, Mark

2018-01-01

In the effort to push the high-frequency performance of electronic circuits and signal interconnects from millimeter waves to beyond 1 THz, a quantitative knowledge of complex refraction index values and dispersion in potential dielectric substrate, encapsulation, waveguide, and packaging materials becomes critical. Here we present very broadband measurements of the real and imaginary index spectra of four polymeric dielectric materials considered for use in high-frequency electronics: benzocyclobutene (BCB), polyethylene naphthalate (PEN), the photoresist SU-8, and polydimethylsiloxane (PDMS). Reflectance and transmittance spectra from 3 to 75 THz were made using a Fourier transform spectrometer on freestanding material samples. These data were quantitatively analyzed, taking into account multiple partial reflections from front and back surfaces and molecular bond resonances, where applicable, to generate real and imaginary parts of the refraction index as a function of frequency. All materials showed signatures of infrared active organic molecular bond resonances between 10 and 50 THz. Low-loss transmission windows as well as anti-window bands of high dispersion and loss can be readily identified and incorporated into high-frequency design models.

75 FR 39510 - Office of Postsecondary Education; Overview Information; Off-Campus Community Service Program...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-07-09

... To Request Application Package: You can obtain an application package via the Internet or from the... disabilities can obtain a copy of the application package in an accessible format (e.g., braille, large print... primary registrant database; and (3) you must provide those same numbers on your application. You can...

NASA DOD Lead Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2008-01-01

The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

NASA Technical Reports Server (NTRS)

Neudeck, Philip G.; Okojie, Robert S.; Chen, Liang-Yu

2002-01-01

It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

Sensors Applications, Volume 3, Sensors in Medicine and Health Care

NASA Astrophysics Data System (ADS)

Öberg, P. Åke; Togawa, Tatsuo; Spelman, Francis A.

2004-08-01

Taken as a whole, this series covers all major fields of application for commercial sensors, as well as their manufacturing techniques and major types. As such the series does not treat bulk sensors, but rather places strong emphasis on microsensors, microsystems and integrated electronic sensor packages. Each of the individual volumes is tailored to the needs and queries of readers from the relevant branch of industry. A review of applications for point-of-care diagnostics, their integration into portable systems and the comfortable, easy-to-use sensors that allow patients to monitor themselves at home. The book covers such advanced topics as minimal invasive surgery, implantable sensors and prostheses, as well as biocompatible sensing.

Microstructure-Evolution and Reliability Assessment Tool for Lead-Free Component Insertion in Army Electronics

DTIC Science & Technology

2008-10-01

provide adequate means for thermal heat dissipation and cooling. Thus electronic packaging has four main functions [1]: • Signal distribution which... dissipation , involving structural and materials consideration. • Mechanical, chemical and electromagnetic protection of components and... nature when compared to phenomenological models. Microelectronic packaging industry spends typically several months building and reliability

Stresses in Solder Joints of Electronic Packages

DTIC Science & Technology

1991-12-31

soldering process. The device is soldered to the circuit board at a temperature of +185zc and this tempature is assumed to propagate only to the lead wire...tri-material assembly, showing the notation used hereafter, is shown in Figure 7. The Suhir model is applicable to assemblies with continuous...therefore the radii of curvature of layers are all equal. Using equilibrium equation (7) and moment-curvature equation (9) yields ()D D Xp (x) D T() -m 3 x

Smart packaging systems for food applications: a review.

PubMed

Biji, K B; Ravishankar, C N; Mohan, C O; Srinivasa Gopal, T K

2015-10-01

Changes in consumer preference for safe food have led to innovations in packaging technologies. This article reviews about different smart packaging systems and their applications in food packaging, packaging research with latest innovations. Active and intelligent packing are such packaging technologies which offer to deliver safer and quality products. Active packaging refers to the incorporation of additives into the package with the aim of maintaining or extending the product quality and shelf life. The intelligent systems are those that monitor the condition of packaged food to give information regarding the quality of the packaged food during transportation and storage. These technologies are designed to the increasing demand for safer foods with better shelf life. The market for active and intelligent packaging systems is expected to have a promising future by their integration into packaging materials or systems.

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

NASA Technical Reports Server (NTRS)

Jah, Muzar; Simon, Eric; Sharma, Ashok

2003-01-01

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Microelectronics in Japan

NASA Astrophysics Data System (ADS)

Boulton, William R.

1995-02-01

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

Microelectronics in Japan

NASA Technical Reports Server (NTRS)

Boulton, William R.

1995-01-01

The purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.

75 FR 38510 - Office of Postsecondary Education; Overview Information Training for Realtime Writers; Notice...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-07-02

.... Address to Request Application Package: You can obtain an application package via the Internet or from the... disabilities can obtain a copy of the application package in an accessible format (e.g., braille, large print...; and (3) you must provide those same numbers on your application. You can obtain a DUNS number from Dun...

Performance of High-Speed PWM Control Chips at Cryogenic Temperatures

NASA Technical Reports Server (NTRS)

Elbuluk, Malik E.; Gerber, Scott; Hammoud, Ahmad; Patterson, Richard; Overton, Eric

2001-01-01

The operation of power electronic systems at cryogenic temperatures is anticipated in many NASA space missions such as planetary exploration and deep space probes. In addition to surviving the space hostile environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing development and launch costs. As part of the NASA Glenn Low Temperature Electronics Program, several commercial high-speed Pulse Width Modulation (PWM) chips have been characterized in terms of their performance as a function of temperature in the range of 25 to -196 C (liquid nitrogen). These chips ranged in their electrical characteristics, modes of control, packaging options, and applications. The experimental procedures along with the experimental data obtained on the investigated chips are presented and discussed.

Natural biopolymer-based nanocomposite films for packaging applications.

PubMed

Rhim, Jong-Whan; Ng, Perry K W

2007-01-01

Concerns on environmental waste problems caused by non-biodegradable petrochemical-based plastic packaging materials as well as the consumer's demand for high quality food products has caused an increasing interest in developing biodegradable packaging materials using annually renewable natural biopolymers such as polysaccharides and proteins. Inherent shortcomings of natural polymer-based packaging materials such as low mechanical properties and low water resistance can be recovered by applying a nanocomposite technology. Polymer nanocomposites, especially natural biopolymer-layered silicate nanocomposites, exhibit markedly improved packaging properties due to their nanometer size dispersion. These improvements include increased modulus and strength, decreased gas permeability, and increased water resistance. Additionally, biologically active ingredients can be added to impart the desired functional properties to the resulting packaging materials. Consequently, natural biopolymer-based nanocomposite packaging materials with bio-functional properties have a huge potential for application in the active food packaging industry. In this review, recent advances in the preparation of natural biopolymer-based films and their nanocomposites, and their potential use in packaging applications are addressed.

Time And Temperature Dependent Micromechanical Properties Of Solder Joints For 3D-Package Integration

NASA Astrophysics Data System (ADS)

Roellig, Mike; Meier, Karsten; Metasch, Rene

2010-11-01

The recent development of 3D-integrated electronic packages is characterized by the need to increase the diversity of functions and to miniaturize. Currently many 3D-integration concepts are being developed and all of them demand new materials, new designs and new processing technologies. The combination of simulation and experimental investigation becomes increasingly accepted since simulations help to shorten the R&D cycle time and reduce costs. Numerical calculations like the Finite-Element-Method are strong tools to calculate stress conditions in electronic packages resulting from thermal strains due to the manufacturing process and environmental loads. It is essential for the application of numerical calculations that the material data is accurate and describes sufficiently the physical behaviour. The developed machine allows the measurement of time and temperature dependent micromechanical properties of solder joints. Solder joints, which are used to mechanically and electrically connect different packages, are physically measured as they leave the process. This allows accounting for process influences, which may change material properties. Additionally, joint sizes and metallurgical interactions between solder and under bump metallization can be respected by this particular measurement. The measurement allows the determination of material properties within a temperature range of 20° C-200° C. Further, the time dependent creep deformation can be measured within a strain-rate range of 10-31/s-10-81/s. Solder alloys based on Sn-Ag/Sn-Ag-Cu with additionally impurities and joint sizes down to O/ 200 μm were investigated. To finish the material characterization process the material model coefficient were extracted by FEM-Simulation to increase the accuracy of data.

Packaging optical sensors for the real world

NASA Astrophysics Data System (ADS)

Kachmar, Wayne; Nardone, Kenneth C.

2007-09-01

Optical fiber based sensing has now moved from laboratory demonstrations to actual applications in the real world. This has necessitated an entirely new area of extrusion - the packaging (cabling) of optical fibers and sensor arrays to protect them from the intended environment and installation handling while not masking or attenuating the phenomenon that is being sensed. Although each application presents new and unique challenges, the goal is to create a packaging concept for fiber sensors. Fiber sensing applications can be narrowed down to the five items below: 1. Conventional cable packages 2. Assembled (typically by hand) discrete sensor packages 3. Package enhanced sensors (where the packaging improves the effect of the sensor) 4. Linear sensor installation packaging 5. Scalar packaging (where the cabling adds to the range of the sensor) The above applications can be accomplished in a number of ways, and methods are still being developed in this relatively new science. Some of the new technology methods being explored include: UV cured liquids; Voided space cores; Conventional cable extrusion & its determination of mechanical characteristics. This paper reviews the pluses and minuses of the above methods and how their combination ultimately determines how the fiber or sensor array is to be jacketed in order to meet the specific application requirements. This paper will also review non-standard material characteristics, strength members and their role in measuring strain and stress values along with the overall influence of packaging on optical fibers and sensor arrays.

Electronic manufacturing and packaging in Japan

NASA Technical Reports Server (NTRS)

Kelly, Michael J.; Boulton, William R. (Editor); Kukowski, John A.; Meieran, Eugene S.; Pecht, Michael; Peeples, John W.; Tummala, Rao R.

1995-01-01

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies. Japan has established this marked competitive advantage in electronics as a consequence of developing low-cost, high-volume consumer products. Japan's infrastructure, and the remarkable cohesiveness of vision and purpose in government and industry, are key factors in the success of Japan's electronics industry. Although Japan will continue to dominate consumer electronics in the foreseeable future, opportunities exist for the United States and other industrial countries to capture an increasingly large part of the market. The JTEC panel has identified no insurmountable barriers that would prevent the United States from regaining a significant share of the consumer electronics market; in fact, there is ample evidence that the United States needs to aggressively pursue high-volume, low-cost electronic assembly, because it is a critical path leading to high-performance electronic systems.

Electronic Joint Army/Navy Point Detonating/Delay Fuze

DTIC Science & Technology

1982-08-01

be battery powered and will use an existing S & A , such as an M739 . We recormiended that the fuzes be fired at various zones and high-speed cameras...Demonstrator 10 Power Supply Tasks 47 11 Electronic S & A 43 11.1 Explosive Barrier Module 49 11.2 Internal Development Program 51 12 Fuze Packaging...program, contract number DAAK10-80-C-0049. We included the Electronic S & A and Fuze Packaging sections to present a complete understanding of the overall

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bateman, V.I.; Brown, F.A.; Hansen, N.R.

Sandia National Laboratories (SNL) designs mechanical systems with electronics that must survive high shock environments. These mechanical systems include penetrators that must survive soil, rock, and ice penetration, nuclear transportation casks that must survive transportation environments, and laydown weapons that must survive delivery impact of 125 fps. These mechanical systems contain electronics that may operate during and after the high shock environment and that must be protected from the high shock environments. A study has been started to improve the packaging techniques for the advanced electronics utilized in these mechanical systems because current packaging techniques are inadequate for these moremore » sensitive electronics. In many cases, it has been found that the packaging techniques currently used not only do not mitigate the shock environment but actually amplify the shock environment. An ambitious goal for this packaging study is to avoid amplification and possibly attenuate the shock environment before it reaches the electronics contained in the various mechanical systems. As part of the investigation of packaging techniques, a two phase study of shock mitigating materials is being conducted. The purpose of the first phase reported here is to examine the performance of a joint that consists of shock mitigating material sandwiched in between steel and to compare the performance of the shock mitigating materials. A split Hopkinson bar experimental configuration simulates this joint and has been used to study the shock mitigating characteristics of seventeen, unconfined materials. The nominal input for these tests is an incident compressive wave with 50 fps peak (1,500 {micro}{var_epsilon} peak) amplitude and a 100 {micro}s duration (measured at 10% amplitude).« less

NASA-DoD Lead-Free Electronics Project

NASA Technical Reports Server (NTRS)

Kessel, Kurt R.

2009-01-01

The primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.

Innovative thermal energy harvesting for future autonomous applications

NASA Astrophysics Data System (ADS)

Monfray, Stephane

2013-12-01

As communicating autonomous systems market is booming, the role of energy harvesting will be a key enabler. As example, heat is one of the most abundant energy sources that can be converted into electricity in order to power circuits. Harvesting systems that use wasted heat open new ways to power autonomous sensors when the energy consumption is low, or to create systems of power generators when the conversion efficiency is high. The combination of different technologies (low power μ-processors, μ-batteries, radio, sensors...) with new energy harvesters compatible with large varieties of use-cases with allow to address this booming market. Thanks to the conjunction of ultra-low power electronic development, 3D technologies & Systems in Package approaches, the integration of autonomous sensors and electronics with ambient energy harvesting will be achievable. The applications are very wide, from environment and industrial sensors to medical portable applications, and the Internet of things may also represent in the future a several billions units market.

Automated data collection in single particle electron microscopy

PubMed Central

Tan, Yong Zi; Cheng, Anchi; Potter, Clinton S.; Carragher, Bridget

2016-01-01

Automated data collection is an integral part of modern workflows in single particle electron microscopy (EM) research. This review surveys the software packages available for automated single particle EM data collection. The degree of automation at each stage of data collection is evaluated, and the capabilities of the software packages are described. Finally, future trends in automation are discussed. PMID:26671944

77 FR 33486 - Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and Products...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-06-06

... INTERNATIONAL TRADE COMMISSION [Docket No. 2899] Certain Integrated Circuit Packages Provided With... complaint entitled Certain Integrated Circuit Packages Provided With Multiple Heat-Conducting Paths and..., telephone (202) 205-2000. The public version of the complaint can be accessed on the Commission's electronic...

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Materials for high-density electronic packaging and interconnection

NASA Technical Reports Server (NTRS)

1990-01-01

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

77 FR 20695 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

Federal Register 2010, 2011, 2012, 2013, 2014

2012-04-05

... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program...: This document provides notice of the availability of Application Packages for the 2013 Tax Counseling... . The deadline for submitting an application package to the IRS for the Tax Counseling for the Elderly...

76 FR 30243 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

Federal Register 2010, 2011, 2012, 2013, 2014

2011-05-24

... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program...: This document provides notice of the availability of Application Packages for the 2012 Tax Counseling.... The deadline for submitting an application package to the IRS for the 2012 Tax Counseling for the...

78 FR 17777 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

Federal Register 2010, 2011, 2012, 2013, 2014

2013-03-22

... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program...: This document provides notice of the availability of Application Packages for the 2014 Tax Counseling... for submitting an application package to the IRS for the Tax Counseling for the Elderly (TCE) Program...

75 FR 22437 - Tax Counseling for the Elderly (TCE) Program Availability of Application Packages

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-28

... DEPARTMENT OF THE TREASURY Internal Revenue Service Tax Counseling for the Elderly (TCE) Program...: This document provides notice of the availability of Application Packages for the 2011 Tax Counseling.... The deadline for submitting an application package to the IRS for the 2011 Tax Counseling for the...

3-D Packaging: A Technology Review

NASA Technical Reports Server (NTRS)

Strickland, Mark; Johnson, R. Wayne; Gerke, David

2005-01-01

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Highly efficient on-chip direct electronic-plasmonic transducers

NASA Astrophysics Data System (ADS)

Du, Wei; Wang, Tao; Chu, Hong-Son; Nijhuis, Christian A.

2017-10-01

Photonic elements can carry information with a capacity exceeding 1,000 times that of electronic components, but, due to the optical diffraction limit, these elements are large and difficult to integrate with modern-day nanoelectronics or upcoming packages, such as three-dimensional integrated circuits or stacked high-bandwidth memories1-3. Surface plasmon polaritons can be confined to subwavelength dimensions and can carry information at high speeds (>100 THz)4-6. To combine the small dimensions of nanoelectronics with the fast operating speed of optics via plasmonics, on-chip electronic-plasmonic transducers that directly convert electrical signals into plasmonic signals (and vice versa) are required. Here, we report electronic-plasmonic transducers based on metal-insulator-metal tunnel junctions coupled to plasmonic waveguides with high-efficiency on-chip generation, manipulation and readout of plasmons. These junctions can be readily integrated into existing technologies, and we thus believe that they are promising for applications in on-chip integrated plasmonic circuits.

Packaging Technology for Dielectric-Coating-Less Heavy Ion Radiation Testing of High-Voltage (HV) Electronic Parts

NASA Technical Reports Server (NTRS)

Woodworth, Andrew; Chen, Liangyu

2017-01-01

Testing high voltage (HV) electronic parts (greater than 300 V) for sudden event effects (SEE) caused by cosmic rays in the space environment, consisting of energetic heavy-ions, and neutron radiation in the upper atmosphere is a crucial step towards using these parts in spacecraft and aircraft. Due to the nature of cosmic radiation and neutrons, electronic parts are tested for SEE without any packaging and/or shielding over the top of the device. In the case of commercial HV parts, the top of the packaging is etched off and then a thin dielectric coating is placed over the part in order to avoid electrical arcing between the device surface and wire bonds and other components. Even though the effects of the thin dielectric layer on SEE testing can be accounted for, the dielectric layer significantly hinders post testing failure analysis. Replicating the test capability of state-of-the-art packaging while eliminating the need for post radiation test processing of the die surface (that obscures failure analysis) is the goal. To that end, a new packaging concept for HV parts has been developed that requires no dielectric coating over the part. Testing of prototype packages used with Schottky diodes (rated at 1200V) has shown no electrical arcing during testing and leakage currents during reverse bias testing are within the manufactures specifications.

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

NASA Technical Reports Server (NTRS)

Shalkhauser, K. A.; Li, K.; Shih, Y. C.

1992-01-01

Packaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.

Fractal dendrite-based electrically conductive composites for laser-scribed flexible circuits

PubMed Central

Yang, Cheng; Cui, Xiaoya; Zhang, Zhexu; Chiang, Sum Wai; Lin, Wei; Duan, Huan; Li, Jia; Kang, Feiyu; Wong, Ching-Ping

2015-01-01

Fractal metallic dendrites have been drawing more attentions recently, yet they have rarely been explored in electronic printing or packaging applications because of the great challenges in large-scale synthesis and limited understanding in such applications. Here we demonstrate a controllable synthesis of fractal Ag micro-dendrites at the hundred-gram scale. When used as the fillers for isotropically electrically conductive composites (ECCs), the unique three-dimensional fractal geometrical configuration and low-temperature sintering characteristic render the Ag micro dendrites with an ultra-low electrical percolation threshold of 0.97 vol% (8 wt%). The ultra-low percolation threshold and self-limited fusing ability may address some critical challenges in current interconnect technology for microelectronics. For example, only half of the laser-scribe energy is needed to pattern fine circuit lines printed using the present ECCs, showing great potential for wiring ultrathin circuits for high performance flexible electronics. PMID:26333352

Investigation of application of two-degree-of-freedom dry tuned-gimbal gyroscopes to strapdown navigation systems. [for use in VTOL aircraft

NASA Technical Reports Server (NTRS)

1974-01-01

The work is described which was accomplished during the investigation of the application of dry-tuned gimbal gyroscopes to strapdown navigation systems. A conventional strapdown configuration, employing analog electronics in conjunction with digital attitude and navigation computation, was examined using various levels of redundancy and both orthogonal and nonorthogonal sensor orientations. It is concluded that the cost and reliability performance constraints which had been established could not be met simultaneously with such a system. This conclusion led to the examination of an alternative system configuration which utilizes an essentially new strapdown system concept. This system employs all-digital signal processing in conjunction with the newly-developed large scale integration (LSI) electronic packaging techniques and a new two-degree-of-freedom dry tuned-gimbal instrument which is capable of providing both angular rate and acceleration information. Such a system is capable of exceeding the established performance goals.

Spacecraft Applications of Compact Optical and Mass Spectrometers

NASA Technical Reports Server (NTRS)

Davinic, N. M.; Nagel, D. J.

1995-01-01

Optical spectrometers, and mass spectrometers to a lesser extent, have a long and rich history of use aboard spacecraft. Space mission applications include deep space science spacecraft, earth orbiting satellites, atmospheric probes, and surface landers, rovers, and penetrators. The large size of capable instruments limited their use to large, expensive spacecraft. Because of the novel application of micro-fabrication technologies, compact optical and mass spectrometers are now available. The new compact devices are especially attractive for spacecraft because of their small mass and volume, as well as their low power consumption. Dispersive optical multi-channel analyzers which cover the 0.4-1.1 micrometer wavelength are now commercially available in packages as small as 3 x 6 x 18 mm exclusive of drive and recording electronics. Mass spectrometers as small as 3 x 3 mm, again without electronics, are under development. A variety of compact optical and mass spectrometers are reviewed in this paper. A number of past space applications are described, along with some upcoming opportunities that are likely candidate missions to fly this new class of compact spectrometers.

System-on-chip-centric unattended embedded sensors in homeland security and defense applications

NASA Astrophysics Data System (ADS)

Jannson, Tomasz; Forrester, Thomas; Degrood, Kevin; Shih, Min-Yi; Walter, Kevin; Lee, Kang; Gans, Eric; Esterkin, Vladimir

2009-05-01

System-on-chip (SoC) single-die electronic integrated circuit (IC) integration has recently been attracting a great deal of attention, due to its high modularity, universality, and relatively low fabrication cost. The SoC also has low power consumption and it is naturally suited to being a base for integration of embedded sensors. Such sensors can run unattended, and can be either commercial off-the-shelf (COTS) electronic, COTS microelectromechanical systems (MEMS), or optical-COTS or produced in house (i.e., at Physical Optics Corporation, POC). In the version with the simplest electronic packaging, they can be integrated with low-power wireless RF that can communicate with a central processing unit (CPU) integrated in-house and installed on the specific platform of interest. Such a platform can be a human body (for e-clothing), unmanned aerial vehicle (UAV), unmanned ground vehicle (UGV), or many others. In this paper we discuss SoC-centric embedded unattended sensors in Homeland Security and military applications, including specific application scenarios (or CONOPS). In one specific example, we analyze an embedded polarization optical sensor produced in house, including generalized Lambertian light-emitting diode (LED) sources and secondary nonimaging optics (NIO).

Isolated post resonator mesogyroscope

NASA Technical Reports Server (NTRS)

Challoner, Dorian; Peay, Chris; Wellman, Joanne; Shcheglov, Kirill; Hayworth, Ken; Wiberg, Dean; Yee, Karl; Sipppola, Clayton

2004-01-01

A new symmetric vibratory gyroscope principle has been devised in which a central post proof mass is counter-rocked against an outer sensing plate such that the motion is isolated from the gyroscope case. Prototype gyroscopes have been designed and fabricated with micromachined silicon at mesoscale (20-cm resonator width), vs. microscale (e.g., 2-mm resonator width) to achieve higher sensitivity and machined precision. This novel mesogyro design arose out of an ongoing technical cooperation between JPL and Boeing begun in 1997 to advance the design of micro-inertial sensors for low-cost space applications. This paper describes the theory of operation of the mesogyro and relationships with other vibratory gyroscopes, the mechanical design, closed loop electronics design, bulk silicon fabrication and packaged gyroscope assembly and test methods. The initial packaged prototype test results are reported for what is believed to be the first silicon mesogyroscope.

Miniature penetrator (MinPen) acceleration recorder development test

DOE Office of Scientific and Technical Information (OSTI.GOV)

Franco, R.J.; Platzbecker, M.R.

1998-08-01

The Telemetry Technology Development Department at Sandia National Laboratories actively develops and tests acceleration recorders for penetrating weapons. This new acceleration recorder (MinPen) utilizes a microprocessor-based architecture for operational flexibility while maintaining electronics and packaging techniques developed over years of penetrator testing. MinPen has been demonstrated to function in shock environments up to 20,000 Gs. The MinPen instrumentation development has resulted in a rugged, versatile, miniature acceleration recorder and is a valuable tool for penetrator testing in a wide range of applications.

Micro/nano electro mechanical systems for practical applications

NASA Astrophysics Data System (ADS)

Esashi, Masayoshi

2009-09-01

Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.

NASA Electronic Parts and Packaging (NEPP): Space Qualification Guidelines of Optoelectronic and Photonic Devices for Optical Communication Systems

NASA Technical Reports Server (NTRS)

Kim, Quiesup

2001-01-01

Key elements of space qualification of opto-electric and photonic optical devices were overviewed. Efforts were concentrated on the reliability concerns of the devices needed for potential applications in space environments. The ultimate goal for this effort is to gradually establish enough data to develop a space qualification plan of newly developed specific photonic parts using empirical and numerical models to assess the life-time and degradation of the devices for potential long term space missions.

Investigation of discrete component chip mounting technology for hybrid microelectronic circuits

NASA Technical Reports Server (NTRS)

Caruso, S. V.; Honeycutt, J. O.

1975-01-01

The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.

Thermoplastic Adhesives based on polyolefin and olefinic copolymers

NASA Astrophysics Data System (ADS)

Paul, Rituparna

2014-03-01

H.B. Fuller has been a leading global industrial adhesive manufacturer for over 125 years. It is a company with a rich history of consistently delivering adhesive innovations for enhancing product performance in the market place. H.B. Fuller technologies/products find application in several markets including packaging, personal hygiene and nonwovens, durable assembly and electronics. In this presentation, H. B. Fuller's technology innovation journey will be shared with emphasis on groundbreaking technologies/products based on polyolefin and olefin copolymers.

Naima: a Python package for inference of particle distribution properties from nonthermal spectra

NASA Astrophysics Data System (ADS)

Zabalza, V.

2015-07-01

The ultimate goal of the observation of nonthermal emission from astrophysical sources is to understand the underlying particle acceleration and evolution processes, and few tools are publicly available to infer the particle distribution properties from the observed photon spectra from X-ray to VHE gamma rays. Here I present naima, an open source Python package that provides models for nonthermal radiative emission from homogeneous distribution of relativistic electrons and protons. Contributions from synchrotron, inverse Compton, nonthermal bremsstrahlung, and neutral-pion decay can be computed for a series of functional shapes of the particle energy distributions, with the possibility of using user-defined particle distribution functions. In addition, naima provides a set of functions that allow to use these models to fit observed nonthermal spectra through an MCMC procedure, obtaining probability distribution functions for the particle distribution parameters. Here I present the models and methods available in naima and an example of their application to the understanding of a galactic nonthermal source. naima's documentation, including how to install the package, is available at http://naima.readthedocs.org.

Chemical effect on diffusion in intermetallic compounds

NASA Astrophysics Data System (ADS)

Chen, Yi-Ting

With the trend of big data and the Internet of things, we live in a world full of personal electronic devices and small electronic devices. In order to make the devices more powerful, advanced electronic packaging such as wafer level packaging or 3D IC packaging play an important role. Furthermore, ?-bumps, which connect silicon dies together with dimension less than 10 ?m, are crucial parts in advanced packaging. Owing to the dimension of ?-bumps, they transform into intermetallic compound from tin based solder after the liquid state bonding process. Moreover, many new reliability issues will occur in electronic packaging when the bonding materials change; in this case, we no longer have tin based solder joint, instead, we have intermetallic compound ?-bumps. Most of the potential reliability issues in intermetallic compounds are caused by the chemical reactions driven by atomic diffusion in the material; thus, to know the diffusivities of atoms inside a material is significant and can help us to further analyze the reliability issues. However, we are lacking these kinds of data in intermetallic compound because there are some problems if used traditional Darken's analysis. Therefore, we considered Wagner diffusivity in our system to solve the problems and applied the concept of chemical effect on diffusion by taking the advantage that large amount of energy will release when compounds formed. Moreover, by inventing the holes markers made by Focus ion beam (FIB), we can conduct the diffusion experiment and obtain the tracer diffusivities of atoms inside the intermetallic compound. We applied the technique on Ni3Sn4 and Cu3Sn, which are two of the most common materials in electronic packaging, and the tracer diffusivities are measured under several different temperatures; moreover, microstructure of the intermetallic compounds are investigated to ensure the diffusion environment. Additionally, the detail diffusion mechanism was also discussed in aspect of diffusion activation enthalpy and diffusion pre-factor by using lattice structure simulation. Last but not the least, X-ray photoelectron spectroscopy and First principal calculation simulation were used to observe the electron binding energies in the intermetallic compound and illustrate the partial covalent bonding behavior in the intermetallic compounds.

CPMC-Lab: A MATLAB package for Constrained Path Monte Carlo calculations

NASA Astrophysics Data System (ADS)

Nguyen, Huy; Shi, Hao; Xu, Jie; Zhang, Shiwei

2014-12-01

We describe CPMC-Lab, a MATLAB program for the constrained-path and phaseless auxiliary-field Monte Carlo methods. These methods have allowed applications ranging from the study of strongly correlated models, such as the Hubbard model, to ab initio calculations in molecules and solids. The present package implements the full ground-state constrained-path Monte Carlo (CPMC) method in MATLAB with a graphical interface, using the Hubbard model as an example. The package can perform calculations in finite supercells in any dimensions, under periodic or twist boundary conditions. Importance sampling and all other algorithmic details of a total energy calculation are included and illustrated. This open-source tool allows users to experiment with various model and run parameters and visualize the results. It provides a direct and interactive environment to learn the method and study the code with minimal overhead for setup. Furthermore, the package can be easily generalized for auxiliary-field quantum Monte Carlo (AFQMC) calculations in many other models for correlated electron systems, and can serve as a template for developing a production code for AFQMC total energy calculations in real materials. Several illustrative studies are carried out in one- and two-dimensional lattices on total energy, kinetic energy, potential energy, and charge- and spin-gaps.

Steady-state low thermal resistance characterization apparatus: The bulk thermal tester

DOE Office of Scientific and Technical Information (OSTI.GOV)

Burg, Brian R.; Kolly, Manuel; Blasakis, Nicolas

The reliability of microelectronic devices is largely dependent on electronic packaging, which includes heat removal. The appropriate packaging design therefore necessitates precise knowledge of the relevant material properties, including thermal resistance and thermal conductivity. Thin materials and high conductivity layers make their thermal characterization challenging. A steady state measurement technique is presented and evaluated with the purpose to characterize samples with a thermal resistance below 100 mm{sup 2} K/W. It is based on the heat flow meter bar approach made up by two copper blocks and relies exclusively on temperature measurements from thermocouples. The importance of thermocouple calibration is emphasizedmore » in order to obtain accurate temperature readings. An in depth error analysis, based on Gaussian error propagation, is carried out. An error sensitivity analysis highlights the importance of the precise knowledge of the thermal interface materials required for the measurements. Reference measurements on Mo samples reveal a measurement uncertainty in the range of 5% and most accurate measurements are obtained at high heat fluxes. Measurement techniques for homogeneous bulk samples, layered materials, and protruding cavity samples are discussed. Ultimately, a comprehensive overview of a steady state thermal characterization technique is provided, evaluating the accuracy of sample measurements with thermal resistances well below state of the art setups. Accurate characterization of materials used in heat removal applications, such as electronic packaging, will enable more efficient designs and ultimately contribute to energy savings.« less

The NASA Electronic Parts and Packaging (NEPP) Program: An Overview

NASA Technical Reports Server (NTRS)

Label, Kenneth A.; Sampson, Michael J.

2016-01-01

This presentation provides an overview of the NEPP Program. The NEPP Mission is to provide guidance to NASA for the selection and application of microelectronics technologies; Improve understanding of the risks related to the use of these technologies in the space environment; Ensure that appropriate research is performed to meet NASA mission assurance needs. NEPP's Goals are to provide customers with appropriate and cost-effective risk knowledge to aid in: Selection and application of microelectronics technologies; Improved understanding of risks related to the use of these technologies in the space environment; Appropriate evaluations to meet NASA mission assurance needs; Guidelines for test and application of parts technologies in space; Assurance infrastructure and support for technologies in use by NASA space systems.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bateman, V.I.; Bell, R.G. III; Brown, F.A.

Sandia National Laboratories (SNL) designs mechanical systems with electronics that must survive high shock environments. These mechanical systems include penetrators that must survive soil, rock, and ice penetration, nuclear transportation casks that must survive transportation environments, and laydown weapons that must survive delivery impact of 125-fps. These mechanical systems contain electronics that may operate during and after the high shock environment and that must be protected from the high shock environments. A study has been started to improve the packaging techniques for the advanced electronics utilized in these mechanical systems because current packaging techniques are inadequate for these more sensitivemore » electronics. In many cases, it has been found that the packaging techniques currently used not only do not mitigate the shock environment but actually amplify the shock environment. An ambitious goal for this packaging study is to avoid amplification and possibly attenuate the shock environment before it reaches the electronics contained in the various mechanical system. As part of the investigation of packaging techniques, a two part study of shock mitigating materials is being conducted. This paper reports the first part of the shock mitigating materials study. A study to compare three thicknesses (0.125, 0.250, and 0.500 in.) of seventeen, unconfined materials for their shock mitigating characteristics has been completed with a split Hopkinson bar configuration. The nominal input as measured by strain gages on the incident Hopkinson bar is 50 fps {at} 100 {micro}s for these tests. It is hypothesized that a shock mitigating material has four purposes: to lengthen the shock pulse, to attenuate the shock pulse, to mitigate high frequency content in the shock pulse, and to absorb energy. Both time domain and frequency domain analyses of the split Hopkinson bar data have been performed to compare the materials` achievement of these purposes.« less

QEDMOD: Fortran program for calculating the model Lamb-shift operator

NASA Astrophysics Data System (ADS)

Shabaev, V. M.; Tupitsyn, I. I.; Yerokhin, V. A.

2018-02-01

We present Fortran package QEDMOD for computing the model QED operator hQED that can be used to account for the Lamb shift in accurate atomic-structure calculations. The package routines calculate the matrix elements of hQED with the user-specified one-electron wave functions. The operator can be used to calculate Lamb shift in many-electron atomic systems with a typical accuracy of few percent, either by evaluating the matrix element of hQED with the many-electron wave function, or by adding hQED to the Dirac-Coulomb-Breit Hamiltonian.

Preparation of a YAG:Ce phosphor glass by screen-printing technology and its application in LED packaging.

PubMed

Yang, Liang; Chen, Mingxiang; Lv, Zhicheng; Wang, Simin; Liu, Xiaogang; Liu, Sheng

2013-07-01

A simple and practical method for preparing phosphor glass is proposed. Phosphor distribution and element analysis are investigated by optical microscope and field emission scanning electron microscope (FE-SEM). The phosphor particles dispersed in the matrix are vividly observed, and their distributions are uniform. Spectrum distribution and color coordinates dependent on the thickness of the screen-printed phosphor layer coupled with a blue light emitting diode (LED) chip are studied. The luminous efficacy of the 75 μm printed phosphor-layer phosphor glass packaged white LED is 81.24 lm/W at 350 mA. This study opens up many possibilities for applications using the phosphor glass on a selected chip in which emission is well absorbed by all phosphors. The screen-printing technique also offers possibilities for the design and engineering of complex phosphor layers on glass substrates. Phosphor screen-printing technology allows the realization of high stability and thermal conductivity for the phosphor layer. This phosphor glass method provides many possibilities for LED packing, including thin-film flip chip and remote phosphor technology.

7 CFR Exhibit B to Subpart B of... - Housing Application Packaging Grant (HAPG) Fee Processing

Code of Federal Regulations, 2012 CFR

2012-01-01

... Processing B Exhibit B to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture... Application Packaging Grants Pt. 1944, Subpt. B, Exh. B Exhibit B to Subpart B of Part 1944—Housing...) and (B) of this exhibit. Funds for all loan and/or grant application packages will be paid as follows...

7 CFR Exhibit B to Subpart B of... - Housing Application Packaging Grant (HAPG) Fee Processing

Code of Federal Regulations, 2013 CFR

2013-01-01

... Processing B Exhibit B to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture... Application Packaging Grants Pt. 1944, Subpt. B, Exh. B Exhibit B to Subpart B of Part 1944—Housing...) and (B) of this exhibit. Funds for all loan and/or grant application packages will be paid as follows...

7 CFR Exhibit B to Subpart B of... - Housing Application Packaging Grant (HAPG) Fee Processing

Code of Federal Regulations, 2010 CFR

2010-01-01

... Processing B Exhibit B to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture... Application Packaging Grants Pt. 1944, Subpt. B, Exh. B Exhibit B to Subpart B of Part 1944—Housing...) and (B) of this exhibit. Funds for all loan and/or grant application packages will be paid as follows...

7 CFR Exhibit B to Subpart B of... - Housing Application Packaging Grant (HAPG) Fee Processing

Code of Federal Regulations, 2011 CFR

2011-01-01

... Processing B Exhibit B to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture... Application Packaging Grants Pt. 1944, Subpt. B, Exh. B Exhibit B to Subpart B of Part 1944—Housing...) and (B) of this exhibit. Funds for all loan and/or grant application packages will be paid as follows...

7 CFR Exhibit B to Subpart B of... - Housing Application Packaging Grant (HAPG) Fee Processing

Code of Federal Regulations, 2014 CFR

2014-01-01

... Processing B Exhibit B to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture... Application Packaging Grants Pt. 1944, Subpt. B, Exh. B Exhibit B to Subpart B of Part 1944—Housing...) and (B) of this exhibit. Funds for all loan and/or grant application packages will be paid as follows...

78 FR 46953 - CDC and ATSDR Use of the SF-424 Research and Related Forms (Application Packages) in Grants.gov...

Federal Register 2010, 2011, 2012, 2013, 2014

2013-08-02

... Use of the SF-424 Research and Related Forms (Application Packages) in Grants.gov and the eRA Commons... Management and Budget approved form sets available through Grants.gov . CDC and other agencies serviced by eRA use the `Competition ID' field of Grants.gov application packages for quick and easy...

Miniature fiber Bragg grating sensor interrogator (FBG-Transceiver) system

NASA Astrophysics Data System (ADS)

Mendoza, Edgar A.; Kempen, Cornelia; Lopatin, Craig

2007-04-01

This paper describes recent progress conducted towards the development of a miniature fiber Bragg grating sensor interrogator (FBG-Transceiver TM) system based on multi-channel integrated optic sensor (InOSense TM) microchip technology. The hybrid InOSense TM microchip technology enables the integration of all of the functionalities, both passive and active, of conventional bench top FBG sensor interrogator systems, packaged in a miniaturized, low power operation, 2-cm x 5-cm package suitable for the long-term structural health monitoring in applications where size, weight, and power are critical for operation. The FBG-Transceiver system uses active optoelectronic components monolithically integrated to the InOSense TM microchip, a microprocessor controlled signal processing electronics board capable of processing the FBG sensors signals related to stress-strain and temperature as well as vibration and acoustics. The FBG-Transceiver TM system represents a new, reliable, highly robust technology that can be used to accurately monitor the status of an array of distributed fiber optic Bragg grating sensors installed in critical infrastructures. Its miniature package, low power operation, and state-of-the-art data communications architecture, all at a very affordable price makes it a very attractive solution for a large number of SHM/NDI applications in aerospace, naval and maritime industry, civil structures like bridges, buildings and dams, the oil and chemical industry, and for homeland security applications. The miniature, cost-efficient FBG-Transceiver TM system is poised to revolutionize the field of structural health monitoring and nondestructive inspection market. The sponsor of this program is NAVAIR under a DOD SBIR contract.

Warning Statements and Safety Practices among Manufacturers and Distributors of Electronic Cigarette Liquids in the United States.

PubMed

Fagan, Pebbles; Pokhrel, Pallav; Herzog, Thaddeus A; Guy, Mignonne C; Sakuma, Kari-Lyn K; Trinidad, Dennis R; Cassel, Kevin; Jorgensen, Dorothy; Lynch, Tania; Felicitas-Perkins, Jamie Q; Palafox, Sherilyn; Hamamura, Faith; Maloney, Sarah; Degree, Kaylah; Sterling, Kymberle; Moolchan, Eric; Clanton, Mark S; Eissenberg, Thomas

2017-05-18

Prior to the Food and Drug Administration's (FDA) regulation of electronic cigarettes and warning statements related to nicotine addiction, there was no critical examination of manufacturer/distributor voluntary practices that could potentially inform FDA actions aimed to protect consumers. This study examined the content of warning statements and safety characteristics of electronic cigarette liquid bottles using a national sample. Research staff randomly selected four electronic cigarette liquid manufacturers/distributors from four U.S. geographic regions. Staff documented the characteristics of product packaging and content of warning statements on 147 electronic cigarette liquids (0-30 mg/ml of nicotine) purchased online from 16 manufacturers/distributors in April of 2016. Data showed that 97.9% of the electronic cigarette liquid bottles included a warning statement, most of which focused on nicotine exposure rather than health. Only 22.4% of bottles used a warning statement that indicated the product "contained nicotine". Of bottles that advertised a nicotine-based concentration of 12 mg/ml, 26% had a warning statements stated that the product "contains nicotine". None of the statements that indicated that the product "contained nicotine" stated that nicotine was "addictive". All bottles had a safety cap and 12% were in plastic shrink-wrap. Fifty-six percent of the websites had a minimum age requirement barrier that prevented under-aged persons from entering. Most manufacturers/distributors printed a warning statement on electronic cigarette liquid bottles, but avoided warning consumers about the presence and the addictiveness of nicotine. Studies are needed to examine manufacturer/distributor modifications to product packaging and how packaging affects consumer behaviors. These data can inform future FDA requirements related to the packaging and advertising of e-cigarette liquids; regulation related to the content of warning statements, including exposure warning statements, which are not currently mandated; and requirements on websites or language on packaging to help manufacturers adhere to the minimum age of purchase regulation. The data can also be used to help FDA develop additional guidance on the framing of statements on packaging that helps consumers make informed decisions about purchasing the product or protecting young people from use or unintentional exposure to the product. © The Author 2017. Published by Oxford University Press on behalf of the Society for Research on Nicotine and Tobacco. All rights reserved. For permissions, please e-mail: journals.permissions@oup.com.

Study of multilayer polymer materials after ionization treatment

NASA Astrophysics Data System (ADS)

Tarasyuk, V. T.; Semkina, A. A.; Solovyeva, V. I.; Fedotova, D. D.; Strokova, N. E.; Malenko, D. M.; Baranov, O. V.; Bakumenko, A. V.; Puchkov, S. N.; Prokopenko, A. V.

2017-12-01

Electron-beam technologies of food products processing involves the use of modern packaging materials in form of polymer films of different composition. The objective of the research is to study the impact of accelerated electrons on the structure of the polymeric packaging materials used for storage of agricultural products. It was investigated radiation exposure on film material PE/PA (80/20) with a thickness of 80 mkm. This film used for storage of vegetables and fruits and has the necessary indicators for gas and vapor permeability. Electron beam treatment of the films was performed on a compact radiation sterilization installation with local bio-protection with electron energy of 5 MeV. A polymer films were irradiated with doses from 1 to 10 kGy. Changing the structure of the film composition was monitored by IR spectrometry. As a result of irradiation by accelerated electrons with doses up to 18 kGy is established that the polymer film is modification of the polymeric material in the form of a partial degradation with subsequent intra-molecular crosslinking. This improves the physico-mechanical properties in the transverse direction, and such film can be used for food packaging before electron-beam treatment.

Polynomial expressions of electron depth dose as a function of energy in various materials: application to thermoluminescence (TL) dosimetry

NASA Astrophysics Data System (ADS)

Deogracias, E. C.; Wood, J. L.; Wagner, E. C.; Kearfott, K. J.

1999-02-01

The CEPXS/ONEDANT code package was used to produce a library of depth-dose profiles for monoenergetic electrons in various materials for energies ranging from 500 keV to 5 MeV in 10 keV increments. The various materials for which depth-dose functions were derived include: lithium fluoride (LiF), aluminum oxide (Al 2O 3), beryllium oxide (BeO), calcium sulfate (CaSO 4), calcium fluoride (CaF 2), lithium boron oxide (LiBO), soft tissue, lens of the eye, adiopose, muscle, skin, glass and water. All materials data sets were fit to five polynomials, each covering a different range of electron energies, using a least squares method. The resultant three dimensional, fifth-order polynomials give the dose as a function of depth and energy for the monoenergetic electrons in each material. The polynomials can be used to describe an energy spectrum by summing the doses at a given depth for each energy, weighted by the spectral intensity for that energy. An application of the polynomial is demonstrated by explaining the energy dependence of thermoluminescent detectors (TLDs) and illustrating the relationship between TLD signal and actual shallow dose due to beta particles.

Theoretical and Experimental Beam Plasma Physics (TEBPP)

NASA Technical Reports Server (NTRS)

Roberts, W. T.

1985-01-01

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is deployed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations in the near field ( 10 m) and mid field (10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Theoretical and Experimental Beam Plasma Physics (TEBPP)

NASA Technical Reports Server (NTRS)

Roberts, B.

1986-01-01

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is developed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations field ( 10 m) and mid field ( 10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

CATPAC -- Catalogue Applications Package on UNIX

NASA Astrophysics Data System (ADS)

Wood, A. R.

CATPAC is the STARLINK Catalogue and Table Package. This document describes the CATPAC applications available on UNIX. These include applications for inputing, processing and reporting tabular data including astronomical catalogues.

Optical properties of an indium doped CdSe nanocrystal: A density functional approach

DOE Office of Scientific and Technical Information (OSTI.GOV)

Salini, K.; Mathew, Vincent, E-mail: vincent@cukerala.ac.in; Mathew, Thomas

2016-05-06

We have studied the electronic and optical properties of a CdSe nanocrystal doped with n-type impurity atom. First principle calculations of the CdSe nanocrystal based on the density functional theory (DFT), as implemented in the Vienna Ab Initio Simulation Package (VASP) was used in the calculations. We have introduced a single Indium impurity atom into CdSe nanocrystal with 1.3 nm diameter. Nanocrystal surface dangling bonds are passivated with hydrogen atom. The band-structure, density of states and absorption spectra of the doped and undopted nanocrystals were discussed. Inclusion of the n-type impurity atom introduces an additional electron in conduction band, and significantlymore » alters the electronic and optical properties of undoped CdSe nanocrystal. Indium doped CdSe nannocrystal have potential applications in optoelectronic devices.« less

Self-Powered Human-Interactive Transparent Nanopaper Systems.

PubMed

Zhong, Junwen; Zhu, Hongli; Zhong, Qize; Dai, Jiaqi; Li, Wenbo; Jang, Soo-Hwan; Yao, Yonggang; Henderson, Doug; Hu, Qiyi; Hu, Liangbing; Zhou, Jun

2015-07-28

Self-powered human-interactive but invisible electronics have many applications in anti-theft and anti-fake systems for human society. In this work, for the first time, we demonstrate a transparent paper-based, self-powered, and human-interactive flexible system. The system is based on an electrostatic induction mechanism with no extra power system appended. The self-powered, transparent paper device can be used for a transparent paper-based art anti-theft system in museums or for a smart mapping anti-fake system in precious packaging and documents, by virtue of the advantages of adding/removing freely, having no impairment on the appearance of the protected objects, and being easily mass manufactured. This initial study bridges the transparent nanopaper with a self-powered and human-interactive electronic system, paving the way for the development of smart transparent paper electronics.

Integration and test of high-speed transmitter electronics for free-space laser communications

NASA Technical Reports Server (NTRS)

Soni, Nitin J.; Lizanich, Paul J.

1994-01-01

The NASA Lewis Research Center in Cleveland, Ohio, has developed the electronics for a free-space, direct-detection laser communications system demonstration. Under the High-Speed Laser Integrated Terminal Electronics (Hi-LITE) Project, NASA Lewis has built a prototype full-duplex, dual-channel electronics transmitter and receiver operating at 325 megabit S per second (Mbps) per channel and using quaternary pulse-position modulation (QPPM). This paper describes the integration and testing of the transmitter portion for future application in free-space, direct-detection laser communications. A companion paper reviews the receiver portion of the prototype electronics. Minor modifications to the transmitter were made since the initial report on the entire system, and this paper addresses them. The digital electronics are implemented in gallium arsenide integrated circuits mounted on prototype boards. The fabrication and implementation issues related to these high-speed devices are discussed. The transmitter's test results are documented, and its functionality is verified by exercising all modes of operation. Various testing issues pertaining to high-speed circuits are addressed. A description of the transmitter electronics packaging concludes the paper.

NLC Electrical

Science.gov Websites

Racks and Cable Plant Instrumentation Systems Tunnel Electronics Enclosures Low Level RF Beam Positron Electronics Vacuum Electronics (Summary) System Notes NLC Electrical System Work Package Task Descriptions

NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Overview

NASA Technical Reports Server (NTRS)

Label, Kenneth A.; Sampson, Michael J.

2017-01-01

This presentation will cover NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance Structure, NASA Electronic Parts and Packaging (NEPP) Program, NASA Electronic Parts Assurance Group (NEPAG), examples of assurance challenges, and future challenges.

The Evaluation of the Safety Benefits of Combined Passive and On-Board Active Safety Applications

PubMed Central

Page, Yves; Cuny, Sophie; Zangmeister, Tobias; Kreiss, Jens-Peter; Hermitte, Thierry

2009-01-01

One of the objectives of the European TRACE project (TRaffic Accident Causation in Europe, 2006–2008) was to estimate the proportion of injury accidents that could be avoided and/or the proportion of injury accidents where the severity could be mitigated for on-the-market safety applications, if 100 % of the car fleet would be equipped with them. We have selected for evaluation the Electronic Stability Control (ESC) and the Emergency Brake Assist (EBA) applications. As for passive safety systems, recent cars are designed to offer overall safety protection. Car structure, load limiters, front airbags, side airbags, knee airbags, pretensioners, padding and non aggressive structures in the door panel, the dashboard, the windshield, the seats, and the head rest also contribute to applying more protection. The whole safety package is very difficult to evaluate separately, one element independently segmented from the others. We decided to consider evaluating the effectivenessof the whole passive safety package, This package,, for the sake of simplicity, was the number of stars awarded at the Euro NCAP testing. The challenges were to compare the effectiveness of some safety configuration SC I, with the effectiveness of a different safety configuration SC II. A safety configuration is understood as a package of safety functions. Ten comparisons have been carried out such as the evaluation of the safety benefit of a fifth star given that the car has four stars and an EBA. The main outcome of this analysis is that any addition of a passive or active safety function selected in this analysis is producing increased safety benefits. For example, if all cars were five stars fitted with EBA and ESC, instead of four stars without ESC and EBA, injury accidents would be reduced by 47.2% for severe injuries and 69.5% for fatal injuries. PMID:20184838

Packaging - Materials review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Herrmann, Matthias

2014-06-16

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in manymore » shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.« less

Introduction to Software Packages. [Final Report.

ERIC Educational Resources Information Center

Frankel, Sheila, Ed.; And Others

This document provides an introduction to applications computer software packages that support functional managers in government and encourages the use of such packages as an alternative to in-house development. A review of current application areas includes budget/project management, financial management/accounting, payroll, personnel,…

The NASA Electronic Parts and Packaging (NEPP) Program - Presentation to Korean Aerospace Research Institute

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2016-01-01

This presentation will provide basic information about NASA's Electronic Parts and Packaging Program (NEPP), for sharing with representatives of the South Korean Aerospace Research Institute (KARI) as part of a larger presentation by Headquarters Office of Safety and Mission Assurance. The NEPP information includes mission and goals, history of the program, basic focus areas, strategies, deliverables and some examples of current tasks.

Electronic and software subsystems for an autonomous roving vehicle. M.S. Thesis

NASA Technical Reports Server (NTRS)

Doig, G. A.

1980-01-01

The complete electronics packaging which controls the Mars roving vehicle is described in order to provide a broad overview of the systems that are part of that package. Some software debugging tools are also discussed. Particular emphasis is given to those systems that are controlled by the microprocessor. These include the laser mast, the telemetry system, the command link prime interface board, and the prime software.

Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, San Diego, CA, July 12, 13, 1990

NASA Astrophysics Data System (ADS)

Carson, John C.

1990-11-01

Various papers on materials, devices, techniques, and applications for X-plane focal plane array technology are presented. Individual topics addressed include: application of Z-plane technology to the remote sensing of the earth from GEO, applications of smart neuromorphic focal planes, image-processing of Z-plane technology, neural network Z-plane implementation with very high interconnection rates, using a small IR surveillance satellite for tactical applications, establishing requirements for homing applications, Z-plane technology. Also discussed are: on-array spike suppression signal processing, algorithms for on-focal-plane gamma circumvention and time-delay integration, current HYMOSS Z-technology, packaging of electrons for on- and off-FPA signal processing, space/performance qualification of tape automated bonded devices, automation in tape automated bonding, high-speed/high-volume radiometric testing of Z-technology focal planes, 128-layer HYMOSS-module fabrication issues, automation of IRFPA production processes.

IONIZING RADIATION AND PACKAGING EFFECTS ON RESPIRATORY BEHAVIOR, FUNGAL GROWTH, AND STORAGE-LIFE OF PEACHES, PRUNUS PERSICA

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dhaliwal, A.S.; Salunkhe, D.K.

1963-01-01

Investigations were conducted in 1960 to study effects of fast electron and gamma radiations and packaging films on respiratory rate, control of fungal deterioration, and subsequent refrigeration life of peaches. The fungi responsible for deterioration of peaches were also studied in vitro to determine if they were susceptible or resistant to ionizing (fast electron and gamma) radiations. Respiratory behavior of the fruits under normal as well as modified conditions was assessed with a Claypool and Keefer-type respirometer and Orsat- type gas analyzer. Two kinds of polyethylene films were used for packaging fruits. The fruits after treatments and packaging were storedmore » at 40 un. Concent 85% F and 85 per cent relative humidity and at 75 un. Concent 85% F and 35 per cent relative humidity. (auth)« less

49 CFR 173.472 - Requirements for exporting DOT Specification Type B and fissile packages.

Code of Federal Regulations, 2010 CFR

2010-10-01

... or (202) 366-3650, or by electronic mail (e-mail) to “[email protected]” Each request is considered in... the package identification marking indicated in the U.S. Competent Authority Certificate. (e) Before... into or through which the package will be transported, unless the offeror has documentary evidence that...

High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhou, Yongcun; Liu, Feng, E-mail: liufeng@nwpu.edu.cn

2016-08-22

The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PImore » composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.« less

Conventions and workflows for using Situs

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wriggers, Willy, E-mail: wriggers@biomachina.org

2012-04-01

Recent developments of the Situs software suite for multi-scale modeling are reviewed. Typical workflows and conventions encountered during processing of biophysical data from electron microscopy, tomography or small-angle X-ray scattering are described. Situs is a modular program package for the multi-scale modeling of atomic resolution structures and low-resolution biophysical data from electron microscopy, tomography or small-angle X-ray scattering. This article provides an overview of recent developments in the Situs package, with an emphasis on workflows and conventions that are important for practical applications. The modular design of the programs facilitates scripting in the bash shell that allows specific programs tomore » be combined in creative ways that go beyond the original intent of the developers. Several scripting-enabled functionalities, such as flexible transformations of data type, the use of symmetry constraints or the creation of two-dimensional projection images, are described. The processing of low-resolution biophysical maps in such workflows follows not only first principles but often relies on implicit conventions. Situs conventions related to map formats, resolution, correlation functions and feature detection are reviewed and summarized. The compatibility of the Situs workflow with CCP4 conventions and programs is discussed.« less

49 CFR 178.350 - Specification 7A; general packaging, Type A.

Code of Federal Regulations, 2010 CFR

2010-10-01

... 49 Transportation 2 2010-10-01 2010-10-01 false Specification 7A; general packaging, Type A. 178... FOR PACKAGINGS Specifications for Packagings for Class 7 (Radioactive) Materials § 178.350 Specification 7A; general packaging, Type A. (a) Each packaging must meet all applicable requirements of subpart...

Polylactic acid (PLA)/Silver-NP/VitaminE bionanocomposite electrospun nanofibers with antibacterial and antioxidant activity

NASA Astrophysics Data System (ADS)

Munteanu, Bogdanel Silvestru; Aytac, Zeynep; Pricope, Gina M.; Uyar, Tamer; Vasile, Cornelia

2014-10-01

The antibacterial property of silver nanoparticles (Ag-NPs) and the antioxidant activity of Vitamin E have been combined by incorporation of these two active components within polylactic acid (PLA) nanofibers via electrospinning (PLA/Ag-NP/VitaminE nanofibers). The morphological and structural characterizations of PLA/Ag-NP/VitaminE nanofibers were performed by Scanning Electron Microscopy (SEM), Transmission Electron Microscopy and X-ray diffraction. The average fiber diameter was 140 ± 60 nm, and the size of the Ag-NP was 2.7 ± 1.5 nm. PLA/Ag-NP/VitaminE nanofibers inhibited growth of Escherichia coli, Listeria monocytogenes and Salmonella typhymurium up to 100 %. The amount of released Ag ions from the nanofibers immersed in aqueous solution was determined by Inductively Coupled Plasma Mass Spectrometry, and it has been observed that the release of Ag ions was kept approximately constant after 10 days of immersion. The antioxidant activity of PLA/Ag-NP/VitaminE nanofibers was evaluated according to DPPH (2,2-diphenyl-1-picrylhydrazyl) method and determined as 94 %. The results of the tests on fresh apple and apple juice indicated that the PLA/Ag/VitaminE nanofiber membrane actively reduced the polyphenol oxidase activity. The multifunctional electrospun PLA nanofibers incorporating Ag-NP and Vitamin E may be quite applicable in food packaging due to the extremely large surface area of nanofibers along with antibacterial and antioxidant activities. These materials could find application in food industry as a potential preservative packaging for fruits and juices.

Package architecture and component design for an implanted neural stimulator with closed loop control.

PubMed

Bjune, Caroline K; Marinis, Thomas F; Brady, Jeanne M; Moran, James; Wheeler, Jesse; Sriram, Tirunelveli S; Parks, Philip D; Widge, Alik S; Dougherty, Darin D; Eskandar, Emad N

2015-08-01

An implanted neural stimulator with closed loop control requires electrodes for stimulation pulses and recording neuron activity. Our system features arrays of 64 electrodes. Each electrode can be addressed through a cross bar switch, to enable it to be used for stimulation or recording. This electrode switch, a bank of low noise amplifiers with an integrated analog to digital converter, power conditioning electronics, and a communications and control gate array are co-located with the electrode array in a 14 millimeter diameter satellite package that is designed to be flush mounted in a skull burr hole. Our system features five satellite packages connected to a central hub processor-controller via ten conductor cables that terminate in a custom designed, miniaturized connector. The connector incorporates features of high reliability, military grade devices and utilizes three distinct seals to isolate the contacts from fluid permeation. The hub system is comprised of a connector header, hermetic electronics package, and rechargeable battery pack, which are mounted on and electrically interconnected by a flexible circuit board. The assembly is over molded with a compliant silicone rubber. The electronics package contains two antennas, a large coil, used for recharging the battery and a high bandwidth antenna that is used to download data and update software. The package is assembled from two machined alumina pieces, a flat base with brazed in, electrical feed through pins and a rectangular cover with rounded corners. Titanium seal rings are brazed onto these two pieces so that they can be sealed by laser welding. A third system antenna is incorporated in the flexible circuit board. It is used to communicate with an externally worn control package, which monitors the health of the system and allows both the user and clinician to control or modify various system function parameters.

Multi-layered Poly-Dimethylsiloxane As A Non-Hermetic Packaging Material For Medical MEMS

PubMed Central

Lachhman, S.; Zorman, C.A.; Ko, W.H.

2012-01-01

Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer. This paper describes an effort to improve the performance of PDMS as packaging material by constructing the encapsulant from multiple, thin layers of PDMS as a part of a polymeric multi-material package PMID:23366225

Emerging Chitosan-Based Films for Food Packaging Applications.

PubMed

Wang, Hongxia; Qian, Jun; Ding, Fuyuan

2018-01-17

Recent years have witnessed great developments in biobased polymer packaging films for the serious environmental problems caused by the petroleum-based nonbiodegradable packaging materials. Chitosan is one of the most abundant biopolymers after cellulose. Chitosan-based materials have been widely applied in various fields for their biological and physical properties of biocompatibility, biodegradability, antimicrobial ability, and easy film forming ability. Different chitosan-based films have been fabricated and applied in the field of food packaging. Most of the review papers related to chitosan-based films are focusing on antibacterial food packaging films. Along with the advances in the nanotechnology and polymer science, numerous strategies, for instance direct casting, coating, dipping, layer-by-layer assembly, and extrusion, have been employed to prepare chitosan-based films with multiple functionalities. The emerging food packaging applications of chitosan-based films as antibacterial films, barrier films, and sensing films have achieved great developments. This article comprehensively reviews recent advances in the preparation and application of engineered chitosan-based films in food packaging fields.

40 CFR 152.50 - Contents of application.

Code of Federal Regulations, 2010 CFR

2010-07-01

... applicant must submit materials to demonstrate that he has complied with the FIFRA sec. 3(c)(1)(F) and... child-resistant packaging. If the product meets the criteria for child-resistant packaging, the... packaging. Refer to part 157 of this chapter for the criteria and certification requirements. (h) Request...

40 CFR 152.50 - Contents of application.

Code of Federal Regulations, 2011 CFR

2011-07-01

... applicant must submit materials to demonstrate that he has complied with the FIFRA sec. 3(c)(1)(F) and... child-resistant packaging. If the product meets the criteria for child-resistant packaging, the... packaging. Refer to part 157 of this chapter for the criteria and certification requirements. (h) Request...

Long life assurance study for manned spacecraft long life hardware. Volume 2: Long life assurance studies of EEE parts and packaging

NASA Technical Reports Server (NTRS)

1972-01-01

Guidelines for the design, development, and fabrication of electronic components and circuits for use in spacecraft construction are presented. The subjects discussed involve quality control procedures and test methodology for the following subjects: (1) monolithic integrated circuits, (2) hybrid integrated circuits, (3) transistors, (4) diodes, (5) tantalum capacitors, (6) electromechanical relays, (7) switches and circuit breakers, and (8) electronic packaging.

QMCPACK: an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

NASA Astrophysics Data System (ADS)

Kim, Jeongnim; Baczewski, Andrew D.; Beaudet, Todd D.; Benali, Anouar; Chandler Bennett, M.; Berrill, Mark A.; Blunt, Nick S.; Josué Landinez Borda, Edgar; Casula, Michele; Ceperley, David M.; Chiesa, Simone; Clark, Bryan K.; Clay, Raymond C., III; Delaney, Kris T.; Dewing, Mark; Esler, Kenneth P.; Hao, Hongxia; Heinonen, Olle; Kent, Paul R. C.; Krogel, Jaron T.; Kylänpää, Ilkka; Li, Ying Wai; Lopez, M. Graham; Luo, Ye; Malone, Fionn D.; Martin, Richard M.; Mathuriya, Amrita; McMinis, Jeremy; Melton, Cody A.; Mitas, Lubos; Morales, Miguel A.; Neuscamman, Eric; Parker, William D.; Pineda Flores, Sergio D.; Romero, Nichols A.; Rubenstein, Brenda M.; Shea, Jacqueline A. R.; Shin, Hyeondeok; Shulenburger, Luke; Tillack, Andreas F.; Townsend, Joshua P.; Tubman, Norm M.; Van Der Goetz, Brett; Vincent, Jordan E.; ChangMo Yang, D.; Yang, Yubo; Zhang, Shuai; Zhao, Luning

2018-05-01

QMCPACK is an open source quantum Monte Carlo package for ab initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater–Jastrow type trial wavefunctions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary-field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performance computing architectures, including multicore central processing unit and graphical processing unit systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://qmcpack.org.

QMCPACK: an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids.

PubMed

Kim, Jeongnim; Baczewski, Andrew T; Beaudet, Todd D; Benali, Anouar; Bennett, M Chandler; Berrill, Mark A; Blunt, Nick S; Borda, Edgar Josué Landinez; Casula, Michele; Ceperley, David M; Chiesa, Simone; Clark, Bryan K; Clay, Raymond C; Delaney, Kris T; Dewing, Mark; Esler, Kenneth P; Hao, Hongxia; Heinonen, Olle; Kent, Paul R C; Krogel, Jaron T; Kylänpää, Ilkka; Li, Ying Wai; Lopez, M Graham; Luo, Ye; Malone, Fionn D; Martin, Richard M; Mathuriya, Amrita; McMinis, Jeremy; Melton, Cody A; Mitas, Lubos; Morales, Miguel A; Neuscamman, Eric; Parker, William D; Pineda Flores, Sergio D; Romero, Nichols A; Rubenstein, Brenda M; Shea, Jacqueline A R; Shin, Hyeondeok; Shulenburger, Luke; Tillack, Andreas F; Townsend, Joshua P; Tubman, Norm M; Van Der Goetz, Brett; Vincent, Jordan E; Yang, D ChangMo; Yang, Yubo; Zhang, Shuai; Zhao, Luning

2018-05-16

QMCPACK is an open source quantum Monte Carlo package for ab initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater-Jastrow type trial wavefunctions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary-field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performance computing architectures, including multicore central processing unit and graphical processing unit systems. We detail the program's capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://qmcpack.org.

Increasing Student Retention Through Application of Attitude Change Packages (and) Increasing GPA and Student Retention of Low Income Minority Community College Students Through Application of Nightengale Conant Change Packages; A Pilot STUDY.

ERIC Educational Resources Information Center

Preising, Paul P.; Frost, Robert

The first of two studies reported was conducted to determine whether unemployed aerospace engineers who received computer science training as well as the Nightengale-Conant attitude change packages would have a significantly higher course completion rate than control classes who were given the same training without the attitude change packages.…

3-D readout-electronics packaging for high-bandwidth massively paralleled imager

DOEpatents

Kwiatkowski, Kris; Lyke, James

2007-12-18

Dense, massively parallel signal processing electronics are co-packaged behind associated sensor pixels. Microchips containing a linear or bilinear arrangement of photo-sensors, together with associated complex electronics, are integrated into a simple 3-D structure (a "mirror cube"). An array of photo-sensitive cells are disposed on a stacked CMOS chip's surface at a 45.degree. angle from light reflecting mirror surfaces formed on a neighboring CMOS chip surface. Image processing electronics are held within the stacked CMOS chip layers. Electrical connections couple each of said stacked CMOS chip layers and a distribution grid, the connections for distributing power and signals to components associated with each stacked CSMO chip layer.

The Jovian Electron and Ion Spectrometer (JEI) for the JUICE mission

NASA Astrophysics Data System (ADS)

Fränz, M.; Bührke, U.; Ferreira, P.; Fischer, H.; Heumüller, P.; Krupp, N.; Kühne, W.; Roussos, E.

2017-09-01

The magnetosphere of Jupiter is apart from the Sun the strongest source of charged particles in the Solar system. The interaction of these particles with the exospheres of the Jovian moons forms one of the most complex plasma laboratories encountered by human space flight. For this reason the plasma analyzer package forms a crucial experiment of the Jupiter Icy Moon Explorer (JUICE). As part of the Plasma Environment Package (PEP) we here describe a combined electron and ion spectrometer which is able to measure the electron and ion distribution functions in the energy range 1 to 50000 eV with high sensitivity and time resolution. This instrument is called the Jovian Electron and Ion Analyzer, JEI.

NASA Parts Selection List (NPSL) WWW Site http://nepp.nasa.gov/npsl

NASA Technical Reports Server (NTRS)

Brusse, Jay

2000-01-01

The NASA Parts Selection List (NPSL) is an on-line resource for electronic parts selection tailored for use by spaceflight projects. The NPSL provides a list of commonly used electronic parts that have a history of satisfactory use in spaceflight applications. The objective of this www site is to provide NASA projects, contractors, university experimenters, et al with an easy to use resource that provides a baseline of electronic parts from which designers are encouraged to select. The NPSL is an ongoing resource produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The NPSL is produced as an electronic format deliverable made available via the referenced www site administered by Code 562. The NPSL does not provide information pertaining to patented or proprietary information. All of the information contained in the NPSL is available through various other public domain resources such as US Military procurement specifications for electronic parts, NASA GSFC's Preferred Parts List (PPL-21), and NASA's Standard Parts List (MIL-STD975).

EEE Links. Volume 5

NASA Technical Reports Server (NTRS)

Humphrey, Robert (Editor)

1999-01-01

The EEE Links Newsletter is a quarterly publication produced by Code 562 in support of the NASA HQ funded NASA Electronic Parts and Packaging (NEPP) Program. The newsletter is produced as an electronic format deliverable made available via the referenced www site administered by Code 562, The newsletter publishes brief articles on topics of interest to NASA programs and projects in the area of electronic parts and packaging. The newsletter does not provide information pertaining to patented or proprietary information. The information provided is at the level of that produced by industry and university researchers and is published at national and international conferences.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2003-04-15

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Packaging of electro-microfluidic devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

2002-01-01

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

Status and Trend of Automotive Power Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liang, Zhenxian

2012-01-01

Comprehensive requirements in aspects of cost, reliability, efficiency, form factor, weight, and volume for power electronics modules in modern electric drive vehicles have driven the development of automotive power packaging technology intensively. Innovation in materials, interconnections, and processing techniques is leading to enormous improvements in power modules. In this paper, the technical development of and trends in power module packaging are evaluated by examining technical details with examples of industrial products. The issues and development directions for future automotive power module packaging are also discussed.

On the release of cppxfel for processing X-ray free-electron laser images.

PubMed

Ginn, Helen Mary; Evans, Gwyndaf; Sauter, Nicholas K; Stuart, David Ian

2016-06-01

As serial femtosecond crystallography expands towards a variety of delivery methods, including chip-based methods, and smaller collected data sets, the requirement to optimize the data analysis to produce maximum structure quality is becoming increasingly pressing. Here cppxfel , a software package primarily written in C++, which showcases several data analysis techniques, is released. This software package presently indexes images using DIALS (diffraction integration for advanced light sources) and performs an initial orientation matrix refinement, followed by post-refinement of individual images against a reference data set. Cppxfel is released with the hope that the unique and useful elements of this package can be repurposed for existing software packages. However, as released, it produces high-quality crystal structures and is therefore likely to be also useful to experienced users of X-ray free-electron laser (XFEL) software who wish to maximize the information extracted from a limited number of XFEL images.

On the release of cppxfel for processing X-ray free-electron laser images

DOE PAGES

Ginn, Helen Mary; Evans, Gwyndaf; Sauter, Nicholas K.; ...

2016-05-11

As serial femtosecond crystallography expands towards a variety of delivery methods, including chip-based methods, and smaller collected data sets, the requirement to optimize the data analysis to produce maximum structure quality is becoming increasingly pressing. Herecppxfel, a software package primarily written in C++, which showcases several data analysis techniques, is released. This software package presently indexes images using DIALS (diffraction integration for advanced light sources) and performs an initial orientation matrix refinement, followed by post-refinement of individual images against a reference data set.Cppxfelis released with the hope that the unique and useful elements of this package can be repurposed formore » existing software packages. However, as released, it produces high-quality crystal structures and is therefore likely to be also useful to experienced users of X-ray free-electron laser (XFEL) software who wish to maximize the information extracted from a limited number of XFEL images.« less

Integrated microsystems packaging approach with LCP

NASA Astrophysics Data System (ADS)

Jaynes, Paul; Shacklette, Lawrence W.

2006-05-01

Within the government communication market there is an increasing push to further miniaturize systems with the use of chip-scale packages, flip-chip bonding, and other advances over traditional packaging techniques. Harris' approach to miniaturization includes these traditional packaging advances, but goes beyond this level of miniaturization by combining the functional and structural elements of a system, thus creating a Multi-Functional Structural Circuit (MFSC). An emerging high-frequency, near hermetic, thermoplastic electronic substrate material, Liquid Crystal Polymer (LCP), is the material that will enable the combination of the electronic circuit and the physical structure of the system. The first embodiment of this vision for Harris is the development of a battlefield acoustic sensor module. This paper will introduce LCP and its advantages for MFSC, present an example of the work that Harris has performed, and speak to LCP MFSCs' potential benefits to miniature communications modules and sensor platforms.

Transmission of ˜ 10 keV electron beams through thin ceramic foils: Measurements and Monte Carlo simulations of electron energy distribution functions

NASA Astrophysics Data System (ADS)

Morozov, A.; Heindl, T.; Skrobol, C.; Wieser, J.; Krücken, R.; Ulrich, A.

2008-07-01

Electron beams with particle energy of ~10 keV were sent through 300 nm thick ceramic (Si3N4 + SiO2) foils and the resulting electron energy distribution functions were recorded using a retarding grid technique. The results are compared with Monte Carlo simulations performed with two publicly available packages, Geant4 and Casino v2.42. It is demonstrated that Geant4, unlike Casino, provides electron energy distribution functions very similar to the experimental distributions. Both simulation packages provide a quite precise average energy of transmitted electrons: we demonstrate that the maximum uncertainty of the calculated values of the average energy is 6% for Geant4 and 8% for Casino, taking into account all systematic uncertainties and the discrepancies in the experimental and simulated data.

16 CFR 1701.3 - Applicability of special packaging requirements to hazardous substances in large size containers.

Code of Federal Regulations, 2014 CFR

2014-01-01

... 16 Commercial Practices 2 2014-01-01 2014-01-01 false Applicability of special packaging requirements to hazardous substances in large size containers. 1701.3 Section 1701.3 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS STATEMENTS OF POLICY...

16 CFR 1701.3 - Applicability of special packaging requirements to hazardous substances in large size containers.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 16 Commercial Practices 2 2010-01-01 2010-01-01 false Applicability of special packaging requirements to hazardous substances in large size containers. 1701.3 Section 1701.3 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS STATEMENTS OF POLICY...

16 CFR 1701.3 - Applicability of special packaging requirements to hazardous substances in large size containers.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 16 Commercial Practices 2 2011-01-01 2011-01-01 false Applicability of special packaging requirements to hazardous substances in large size containers. 1701.3 Section 1701.3 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS STATEMENTS OF POLICY...

16 CFR 1701.3 - Applicability of special packaging requirements to hazardous substances in large size containers.

Code of Federal Regulations, 2012 CFR

2012-01-01

... 16 Commercial Practices 2 2012-01-01 2012-01-01 false Applicability of special packaging requirements to hazardous substances in large size containers. 1701.3 Section 1701.3 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS STATEMENTS OF POLICY...

Enabling More than Moore: Accelerated Reliability Testing and Risk Analysis for Advanced Electronics Packaging

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza; Evans, John W.

2014-01-01

For five decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in miniaturization of electronics products-Moore's Law. Now, scaling hits a brick wall, a paradigm shift. The industry roadmaps recognized the scaling limitation and project that packaging technologies will meet further miniaturization needs or ak.a "More than Moore". This paper presents packaging technology trends and accelerated reliability testing methods currently being practiced. Then, it presents industry status on key advanced electronic packages, factors affecting accelerated solder joint reliability of area array packages, and IPC/JEDEC/Mil specifications for characterizations of assemblies under accelerated thermal and mechanical loading. Finally, it presents an examples demonstrating how Accelerated Testing and Analysis have been effectively employed in the development of complex spacecraft thereby reducing risk. Quantitative assessments necessarily involve the mathematics of probability and statistics. In addition, accelerated tests need to be designed which consider the desired risk posture and schedule for particular project. Such assessments relieve risks without imposing additional costs. and constraints that are not value added for a particular mission. Furthermore, in the course of development of complex systems, variances and defects will inevitably present themselves and require a decision concerning their disposition, necessitating quantitative assessments. In summary, this paper presents a comprehensive view point, from technology to systems, including the benefits and impact of accelerated testing in offsetting risk.

High frequency optical communications; Proceedings of the Meeting, Cambridge, MA, Sept. 23, 24, 1986

NASA Astrophysics Data System (ADS)

Ramer, O. Glenn; Sierak, Paul

Topics discussed in this volume include systems and applications, detectors, sources, and coherent communications. Papers are presented on RF fiber optic links for avionics applications, fiber optics and optoelectronics for radar and electronic warfare applications, symmetric coplanar electrodes for high-speed Ti:LiNbO3 devices, and surface wave electrooptic modulator. Attention is given to X-band RF fiber-optic links, fiber-optic links for microwave signal transmission, GaAs monolithic receiver and laser driver for GHz transmission rates, and monolithically integrable high-speed photodetectors. Additional papers are on irregular and chaotic behavior of semiconductor lasers under modulation, high-frequency laser package for microwave optical communications, receiver modeling for coherent light wave communications, and polarization sensors and controllers for coherent optical communication systems.

Multi-layered poly-dimethylsiloxane as a non-hermetic packaging material for medical MEMS.

PubMed

Lachhman, S; Zorman, C A; Ko, W H

2012-01-01

Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated solely by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer caused by conventional deposition processes such as spin coating. This paper describes an effort to improve the performance of PDMS as a packaging material by constructing the encapsulant from multiple, thin roller casted layers of PDMS as a part of a polymeric multi-material package.

Hydroxylated graphene-based flexible carbon film with ultrahigh electrical and thermal conductivity.

PubMed

Ding, Jiheng; Ur Rahman, Obaid; Zhao, Hongran; Peng, Wanjun; Dou, Huimin; Chen, Hao; Yu, Haibin

2017-09-29

Graphene-based films are widely used in the electronics industry. Here, surface hydroxylated graphene sheets (HGS) have been synthesized from natural graphite (NG) by a rapid and efficient molten hydroxide-assisted exfoliation technique. This method enables preparation of aqueous dispersible graphene sheets with a high dispersed concentration (∼10.0 mg ml -1 ) and an extraordinary production yield (∼100%). The HGS dispersion was processed into graphene flexible film (HGCF) through fast filtration, annealing treatment and mechanical compression. The HGS endows graphene flexible film with a high electrical conductivity of 11.5 × 10 4 S m -1 and a superior thermal conductivity of 1842 W m -1 K -1 . Simultaneously, the superflexible HGCF could endure 3000 repeated cycles of bending or folding. As a result, this graphene flexible film is expected to be integrated into electronic packaging and high-power electronics applications.

Conversion of continuous-direct-current TIG welder to pulse-arc operation

NASA Technical Reports Server (NTRS)

Lien, D. R.

1969-01-01

Electronics package converts a continuous-dc tungsten-inert gas welder for pulse-arc operation. Package allows presetting of the pulse rate, duty cycle, and current value, and enables welding of various alloys and thicknesses of materials.

Materials for High-Density Electronic Packaging and Interconnection

DTIC Science & Technology

1990-04-10

play a prominent role in the future. Glass and Porcelain The earliest use of electronic ceramics was as insulators for carrying telegraph lines...Administration 61L & CORES , (Ot. stem. SAI WCJm 76. LOISS (C". SUMt *oW WVCf B’%2101 Constitution Avenue. N W Washington, D.C. 20418 Washington. D.C. 20301 G...Density Packaging 84 Tape Automated Bonding 87 Diamond 88 Superconductors 88 Composites 89 Materials for Very-High-Frequency Digital Systems 91

Applications of multi-walled carbon nanotube in electronic packaging

PubMed Central

2012-01-01

Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work. PMID:22405035

10 CFR 71.10 - Public inspection of application.

Code of Federal Regulations, 2013 CFR

2013-01-01

... 10 Energy 2 2013-01-01 2013-01-01 false Public inspection of application. 71.10 Section 71.10 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL General Provisions § 71.10 Public inspection of application. Applications for approval of a package design...

10 CFR 71.10 - Public inspection of application.

Code of Federal Regulations, 2014 CFR

2014-01-01

... 10 Energy 2 2014-01-01 2014-01-01 false Public inspection of application. 71.10 Section 71.10 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL General Provisions § 71.10 Public inspection of application. Applications for approval of a package design...

10 CFR 71.10 - Public inspection of application.

Code of Federal Regulations, 2010 CFR

2010-01-01

... 10 Energy 2 2010-01-01 2010-01-01 false Public inspection of application. 71.10 Section 71.10 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL General Provisions § 71.10 Public inspection of application. Applications for approval of a package design...

10 CFR 71.10 - Public inspection of application.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 10 Energy 2 2011-01-01 2011-01-01 false Public inspection of application. 71.10 Section 71.10 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) PACKAGING AND TRANSPORTATION OF RADIOACTIVE MATERIAL General Provisions § 71.10 Public inspection of application. Applications for approval of a package design...

Ultra-thin layer packaging for implantable electronic devices

NASA Astrophysics Data System (ADS)

Hogg, A.; Aellen, T.; Uhl, S.; Graf, B.; Keppner, H.; Tardy, Y.; Burger, J.

2013-07-01

State of the art packaging for long-term implantable electronic devices generally uses reliable metal and glass housings; however, these are limited in the miniaturization potential and cost reduction. This paper focuses on the development of biocompatible hermetic thin-film packaging based on poly-para-xylylene (Parylene-C) and silicon oxide (SiOx) multilayers for smart implantable microelectromechanical systems (MEMS) devices. For the fabrication, a combined Parylene/SiOx single-chamber deposition system was developed. Topological aspects of multilayers were characterized by atomic force microscopy and scanning electron microscopy. Material compositions and layer interfaces were analyzed by Fourier transform infrared spectrometry and x-ray photoelectron spectroscopy. To evaluate the multilayer corrosion protection, water vapor permeation was investigated using a calcium mirror test. The calcium mirror test shows very low water permeation rates of 2 × 10-3 g m-2 day-1 (23 °C, 45% RH) for a 4.7 µm multilayer, which is equivalent to a 1.9 mm pure Parylene-C coating. According to the packaging standard MIL-STD-883, the helium gas tightness was investigated. These helium permeation measurements predict that a multilayer of 10 µm achieves the hermeticity acceptance criterion required for long-term implantable medical devices.

Qualification and Reliability for MEMS and IC Packages

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2004-01-01

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

Three-Dimensional (3D) Nanometrology Based on Scanning Electron Microscope (SEM) Stereophotogrammetry.

PubMed

Tondare, Vipin N; Villarrubia, John S; Vlada R, András E

2017-10-01

Three-dimensional (3D) reconstruction of a sample surface from scanning electron microscope (SEM) images taken at two perspectives has been known for decades. Nowadays, there exist several commercially available stereophotogrammetry software packages. For testing these software packages, in this study we used Monte Carlo simulated SEM images of virtual samples. A virtual sample is a model in a computer, and its true dimensions are known exactly, which is impossible for real SEM samples due to measurement uncertainty. The simulated SEM images can be used for algorithm testing, development, and validation. We tested two stereophotogrammetry software packages and compared their reconstructed 3D models with the known geometry of the virtual samples used to create the simulated SEM images. Both packages performed relatively well with simulated SEM images of a sample with a rough surface. However, in a sample containing nearly uniform and therefore low-contrast zones, the height reconstruction error was ≈46%. The present stereophotogrammetry software packages need further improvement before they can be used reliably with SEM images with uniform zones.

Relativistic semiempirical-core-potential calculations in Ca+,Sr+ , and Ba+ ions on Lagrange meshes

NASA Astrophysics Data System (ADS)

Filippin, Livio; Schiffmann, Sacha; Dohet-Eraly, Jérémy; Baye, Daniel; Godefroid, Michel

2018-01-01

Relativistic atomic structure calculations are carried out in alkaline-earth-metal ions using a semiempirical-core-potential approach. The systems are partitioned into frozen-core electrons and an active valence electron. The core orbitals are defined by a Dirac-Hartree-Fock calculation using the grasp2k package. The valence electron is described by a Dirac-like Hamiltonian involving a core-polarization potential to simulate the core-valence electron correlation. The associated equation is solved with the Lagrange-mesh method, which is an approximate variational approach having the form of a mesh calculation because of the use of a Gauss quadrature to calculate matrix elements. Properties involving the low-lying metastable D 3 /2 ,5 /2 2 states of Ca+, Sr+, and Ba+ are studied, such as polarizabilities, one- and two-photon decay rates, and lifetimes. Good agreement is found with other theory and observation, which is promising for further applications in alkalilike systems.

Novel food packaging systems with natural antimicrobial agents.

PubMed

Irkin, Reyhan; Esmer, Ozlem Kizilirmak

2015-10-01

A new type of packaging that combines food packaging materials with antimicrobial substances to control microbial surface contamination of foods to enhance product microbial safety and to extend shelf-life is attracting interest in the packaging industry. Several antimicrobial compounds can be combined with different types of packaging materials. But in recent years, since consumer demand for natural food ingredients has increased because of safety and availability, these natural compounds are beginning to replace the chemical additives in foods and are perceived to be safer and claimed to alleviate safety concerns. Recent research studies are mainly focused on the application of natural antimicrobials in food packaging system. Biologically derived compounds like bacteriocins, phytochemicals, enzymes can be used in antimicrobial food packaging. The aim of this review is to give an overview of most important knowledge about application of natural antimicrobial packagings with model food systems and their antimicrobial effects on food products.

Edible packaging materials.

PubMed

Janjarasskul, Theeranun; Krochta, John M

2010-01-01

Research groups and the food and pharmaceutical industries recognize edible packaging as a useful alternative or addition to conventional packaging to reduce waste and to create novel applications for improving product stability, quality, safety, variety, and convenience for consumers. Recent studies have explored the ability of biopolymer-based food packaging materials to carry and control-release active compounds. As diverse edible packaging materials derived from various by-products or waste from food industry are being developed, the dry thermoplastic process is advancing rapidly as a feasible commercial edible packaging manufacturing process. The employment of nanocomposite concepts to edible packaging materials promises to improve barrier and mechanical properties and facilitate effective incorporation of bioactive ingredients and other designed functions. In addition to the need for a more fundamental understanding to enable design to desired specifications, edible packaging has to overcome challenges such as regulatory requirements, consumer acceptance, and scaling-up research concepts to commercial applications.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rashdan, Ahmad Al; Oxstrand, Johanna; Agarwal, Vivek

As part of the ongoing efforts at the U.S. Department of Energy’s Light Water Reactor Sustainability Program, Idaho National Laboratory is conducting several pilot projects in collaboration with the nuclear industry to improve the reliability, safety, and economics of the nuclear power industry, especially as the nuclear power plants extend their operating licenses to 80 years. One of these pilot projects is the automated work package (AWP) pilot project. An AWP is an electronic intelligent and interactive work package. It uses plant condition, resources status, and user progress to adaptively drive the work process in a manner that increases efficiencymore » while reducing human error. To achieve this mission, the AWP acquires information from various systems of a nuclear power plant’s and incorporates several advanced instrumentation and control technologies along with modern human factors techniques. With the current rapid technological advancement, it is possible to envision several available or soon-to-be-available capabilities that can play a significant role in improving the work package process. As a pilot project, the AWP project develops a prototype of an expanding set of capabilities and evaluates them in an industrial environment. While some of the proposed capabilities are based on using technological advances in other applications, others are conceptual; thus, require significant research and development to be applicable in an AWP. The scope of this paper is to introduce a set of envisioned capabilities, their need for the industry, and the industry difficulties they resolve.« less

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Biosynthesis and Characterization of AgNPs–Silk/PVA Film for Potential Packaging Application

PubMed Central

Tao, Gang; Cai, Rui; Wang, Yejing; Song, Kai; Guo, Pengchao; Zhao, Ping; Zuo, Hua; He, Huawei

2017-01-01

Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP) is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag+ by the tyrosine residue of fibroin, and then prepared AgNPs–silk/poly(vinyl alcohol) (PVA) composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs–silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs–silk/PVA film offers more choices to be potentially applied in the active packaging field. PMID:28773026

Biosynthesis and Characterization of AgNPs-Silk/PVA Film for Potential Packaging Application.

PubMed

Tao, Gang; Cai, Rui; Wang, Yejing; Song, Kai; Guo, Pengchao; Zhao, Ping; Zuo, Hua; He, Huawei

2017-06-17

Bionanocomposite packaging materials have a bright future for a broad range of applications in the food and biomedical industries. Antimicrobial packaging is one of the bionanocomposite packaging materials. Silver nanoparticle (AgNP) is one of the most attractive antimicrobial agents for its broad spectrum of antimicrobial activity against microorganisms. However, the traditional method of preparing AgNPs-functionalized packaging material is cumbersome and not environmentally friendly. To develop an efficient and convenient biosynthesis method to prepare AgNPs-modified bionanocomposite material for packaging applications, we synthesized AgNPs in situ in a silk fibroin solution via the reduction of Ag⁺ by the tyrosine residue of fibroin, and then prepared AgNPs-silk/poly(vinyl alcohol) (PVA) composite film by blending with PVA. AgNPs were synthesized evenly on the surface or embedded in the interior of silk/PVA film. The prepared AgNPs-silk/PVA film exhibited excellent mechanical performance and stability, as well as good antibacterial activity against both Gram-negative and Gram-positive bacteria. AgNPs-silk/PVA film offers more choices to be potentially applied in the active packaging field.

Inorganic and metal nanoparticles and their antimicrobial activity in food packaging applications.

PubMed

Hoseinnejad, Mahmoud; Jafari, Seid Mahdi; Katouzian, Iman

2018-03-01

Nanotechnology has revolutionized almost all the fields of science and technology, particularly the food packaging industry. Accordingly, some nanoparticles can be used in food contact materials to preserve food products for longer periods. To date, many inorganic and metal nanoparticles have been implemented to synthesize active food packaging materials and to extend the shelf-life of foods. Packaging with nanocomposites containing these nanoparticles offers advantages, such as reduction in the usage of preservatives and higher rate of reactions to inhibit the microbial growth. Nevertheless, the safety issues of employing the metal and inorganic nanoparticles in food packaging are still a major concern and more studies along with clinical trials need to be carried out prior to the mass production of these promising food containers. In this review, we have evaluated recent studies plus the applications of inorganic and metal nanoparticles mostly in food packaging applications along with their antimicrobial properties and reaction mechanisms. Many examples have been provided with the aim of opening new horizons for researchers to implement inorganic and metal nanoparticles in active food packaging field.

Alignment Jig for the Precise Measurement of THz Radiation

NASA Technical Reports Server (NTRS)

Javadi, Hamid H.

2009-01-01

A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

GPS/MEMS IMU/Microprocessor Board for Navigation

NASA Technical Reports Server (NTRS)

Gender, Thomas K.; Chow, James; Ott, William E.

2009-01-01

A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

General-Purpose Ada Software Packages

NASA Technical Reports Server (NTRS)

Klumpp, Allan R.

1991-01-01

Collection of subprograms brings to Ada many features from other programming languages. All generic packages designed to be easily instantiated for types declared in user's facility. Most packages have widespread applicability, although some oriented for avionics applications. All designed to facilitate writing new software in Ada. Written on IBM/AT personal computer running under PC DOS, v.3.1.

16 CFR § 1701.3 - Applicability of special packaging requirements to hazardous substances in large size containers.

Code of Federal Regulations, 2013 CFR

2013-01-01

... 16 Commercial Practices 2 2013-01-01 2013-01-01 false Applicability of special packaging requirements to hazardous substances in large size containers. § 1701.3 Section § 1701.3 Commercial Practices CONSUMER PRODUCT SAFETY COMMISSION POISON PREVENTION PACKAGING ACT OF 1970 REGULATIONS STATEMENTS OF POLICY...

7 CFR Exhibit C to Subpart B of... - Requirements for Housing Application Packages

Code of Federal Regulations, 2011 CFR

2011-01-01

... 7 Agriculture 13 2011-01-01 2009-01-01 true Requirements for Housing Application Packages C Exhibit C to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture (Continued... Packaging Grants Pt. 1944, Subpt. B, Exh. C Exhibit C to Subpart B of Part 1944—Requirements for Housing...

7 CFR Exhibit C to Subpart B of... - Requirements for Housing Application Packages

Code of Federal Regulations, 2012 CFR

2012-01-01

... 7 Agriculture 13 2012-01-01 2012-01-01 false Requirements for Housing Application Packages C Exhibit C to Subpart B of Part 1944 Agriculture Regulations of the Department of Agriculture (Continued... Packaging Grants Pt. 1944, Subpt. B, Exh. C Exhibit C to Subpart B of Part 1944—Requirements for Housing...

78 FR 27208 - Applications for New Awards; Rehabilitation Services Administration-Centers for Independent Living

Federal Register 2010, 2011, 2012, 2013, 2014

2013-05-09

... DEPARTMENT OF EDUCATION Applications for New Awards; Rehabilitation Services Administration... Application Package: ED Pubs, U.S. Department of Education, P.O. Box 22207, Alexandria, VA 22304. Telephone... with disabilities can obtain a copy of the application package in an accessible format (e.g., braille...

75 FR 22763 - Office of Postsecondary Education; Overview Information: Underground Railroad Educational and...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-30

... and Submission Information 1. Address to Request Application Package: You can obtain an application... number 84.345A. Individuals with disabilities can obtain a copy of the application package in an... forms: The Application for Federal Assistance (SF 424), the Department of Education Supplemental...

Method Of Packaging And Assembling Electro-Microfluidic Devices

DOEpatents

Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

2004-11-23

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

75 FR 5375 - Hazardous Material; Miscellaneous Packaging Amendments

Federal Register 2010, 2011, 2012, 2013, 2014

2010-02-02

...In this final rule, PHMSA is amending packaging requirements in the Hazardous Materials Regulations to enhance compliance flexibility, improve clarity, and reduce regulatory burdens. Specifically, we are revising several packaging related definitions; adding provisions to allow more flexibility when preparing and transmitting closure instructions, including conditions under which closure instructions may be transmitted electronically; adding a requirement for shippers to retain packaging closure instructions; incorporating new language that will allow for a practicable means of stenciling the ``UN'' symbol on packagings; and clarifying a requirement to document the methodology used when determining whether a change in packaging configuration requires retesting as a new design or may be considered a variation of a previously tested design. This final rule also incorporates requirements for construction, maintenance, and use of Large Packagings.

PAREMD: A parallel program for the evaluation of momentum space properties of atoms and molecules

NASA Astrophysics Data System (ADS)

Meena, Deep Raj; Gadre, Shridhar R.; Balanarayan, P.

2018-03-01

The present work describes a code for evaluating the electron momentum density (EMD), its moments and the associated Shannon information entropy for a multi-electron molecular system. The code works specifically for electronic wave functions obtained from traditional electronic structure packages such as GAMESS and GAUSSIAN. For the momentum space orbitals, the general expression for Gaussian basis sets in position space is analytically Fourier transformed to momentum space Gaussian basis functions. The molecular orbital coefficients of the wave function are taken as an input from the output file of the electronic structure calculation. The analytic expressions of EMD are evaluated over a fine grid and the accuracy of the code is verified by a normalization check and a numerical kinetic energy evaluation which is compared with the analytic kinetic energy given by the electronic structure package. Apart from electron momentum density, electron density in position space has also been integrated into this package. The program is written in C++ and is executed through a Shell script. It is also tuned for multicore machines with shared memory through OpenMP. The program has been tested for a variety of molecules and correlated methods such as CISD, Møller-Plesset second order (MP2) theory and density functional methods. For correlated methods, the PAREMD program uses natural spin orbitals as an input. The program has been benchmarked for a variety of Gaussian basis sets for different molecules showing a linear speedup on a parallel architecture.

7 CFR 3402.10 - Application package.

Code of Federal Regulations, 2010 CFR

2010-01-01

..., AND EXTENSION SERVICE, DEPARTMENT OF AGRICULTURE FOOD AND AGRICULTURAL SCIENCES NATIONAL NEEDS... package. Applications will be available at http://www.grants.gov and through the CSREES Web site. An...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2013 CFR

2013-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2014 CFR

2014-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2012 CFR

2012-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

49 CFR 1104.3 - Copies.

Code of Federal Regulations, 2010 CFR

2010-10-01

... fully evaluate evidence, all spreadsheets must be fully accessible and manipulable. Electronic databases... Microsoft Open Database Connectivity (ODBC) standard. ODBC is a Windows technology that allows a database software package to import data from a database created using a different software package. We currently...

24 CFR 208.108 - Requirements.

Code of Federal Regulations, 2012 CFR

2012-04-01

... package to process certifications and recertifications and to provide subsidy billings to HUD must update their software packages and begin electronic transmission of that data in a HUD specified format by... TRANSMISSION OF REQUIRED DATA FOR CERTIFICATION AND RECERTIFICATION AND SUBSIDY BILLING PROCEDURES FOR...

24 CFR 208.108 - Requirements.

Code of Federal Regulations, 2011 CFR

2011-04-01

... package to process certifications and recertifications and to provide subsidy billings to HUD must update their software packages and begin electronic transmission of that data in a HUD specified format by... TRANSMISSION OF REQUIRED DATA FOR CERTIFICATION AND RECERTIFICATION AND SUBSIDY BILLING PROCEDURES FOR...

24 CFR 208.108 - Requirements.

Code of Federal Regulations, 2014 CFR

2014-04-01

... package to process certifications and recertifications and to provide subsidy billings to HUD must update their software packages and begin electronic transmission of that data in a HUD specified format by... TRANSMISSION OF REQUIRED DATA FOR CERTIFICATION AND RECERTIFICATION AND SUBSIDY BILLING PROCEDURES FOR...

24 CFR 208.108 - Requirements.

Code of Federal Regulations, 2013 CFR

2013-04-01

... package to process certifications and recertifications and to provide subsidy billings to HUD must update their software packages and begin electronic transmission of that data in a HUD specified format by... TRANSMISSION OF REQUIRED DATA FOR CERTIFICATION AND RECERTIFICATION AND SUBSIDY BILLING PROCEDURES FOR...

A blended learning approach to teaching CVAD care and maintenance.

PubMed

Hainey, Karen; Kelly, Linda J; Green, Audrey

2017-01-26

Nurses working within both acute and primary care settings are required to care for and maintain central venous access devices (CVADs). To support these nurses in practice, a higher education institution and local health board developed and delivered CVAD workshops, which were supported by a workbook and competency portfolio. Following positive evaluation of the workshops, an electronic learning (e-learning) package was also introduced to further support this clinical skill in practice. To ascertain whether this blended learning approach to teaching CVAD care and maintenance prepared nurses for practice, the learning package was evaluated through the use of electronic questionnaires. Results highlighted that the introduction of the e-learning package supported nurses' practice, and increased their confidence around correct clinical procedures.

’Pushing a Big Rock Up a Steep Hill’: Acquisition Lessons Learned from DoD Applications Storefront

DTIC Science & Technology

2014-04-30

software patches, web applications, widgets, and mobile application packages. The envisioned application store will deliver software from a central...automated delivery of software patches, web applications, widgets, and mobile application packages. The envisioned application store will deliver... mobile technologies, hoping to enhance warfighter situational awareness and access to information. Unfortunately, the Defense Acquisition System has not

7 CFR 3402.10 - Application package.

Code of Federal Regulations, 2011 CFR

2011-01-01

... AGRICULTURE FOOD AND AGRICULTURAL SCIENCES NATIONAL NEEDS GRADUATE AND POSTGRADUATE FELLOWSHIP GRANTS PROGRAM....grants.gov and through the CSREES Web site. An application package will be made available to any...

Perceived risks and perceived benefits of different nanotechnology foods and nanotechnology food packaging.

PubMed

Siegrist, Michael; Stampfli, Nathalie; Kastenholz, Hans; Keller, Carmen

2008-09-01

Nanotechnology has the potential to generate new food products and new food packaging. In a mail survey in the German speaking part of Switzerland, lay people's (N=337) perceptions of 19 nanotechnology applications were examined. The goal was to identify food applications that are more likely and food applications that are less likely to be accepted by the public. The psychometric paradigm was employed, and applications were described in short scenarios. Results suggest that affect and perceived control are important factors influencing risk and benefit perception. Nanotechnology food packaging was assessed as less problematic than nanotechnology foods. Analyses of individual data showed that the importance of naturalness in food products and trust were significant factors influencing the perceived risk and the perceived benefit of nanotechnology foods and nanotechnology food packaging.

Novel Low-Cost, Low-Power Miniature Thermionic Cathode Developed for Microwave/Millimeter Wave Tube and Cathode Ray Tube Applications

NASA Technical Reports Server (NTRS)

Wintucky, Edwin G.

1999-01-01

A low cost, small size and mass, low heater power, durable high-performance barium dispenser thermionic cathode has been developed that offers significant advancements in the design, manufacture, and performance of the electron sources used in vacuum electronic devices--such as microwave (and millimeter wave) traveling-wave tubes (TWT's)--and in display devices such as high-brightness, high-resolution cathode ray tubes (CRT's). The lower cathode heater power and the reduced size and mass of the new cathode are expected to be especially beneficial in TWT's for deep space communications, where future missions are requiring smaller spacecraft, higher data transfer rates (higher frequencies and radiofrequency output power), and greater electrical efficiency. Also expected to benefit are TWT's for commercial and government communication satellites, for both low and geosynchronous Earth orbit, with additional benefits offered by lower cost and potentially higher cathode current loading. A particularly important TWT application is in the microwave power module (MPM), which is a hybrid microwave (or millimeter wave) amplifier consisting of a low-noise solid state driver, a vacuum power booster (small TWT), and an electronic power conditioner integrated into a single compact package. The attributes of compactness and potentially high electrical efficiency make the MPM very attractive for many commercial and government (civilian and defense) applications in communication and radar systems. The MPM is already finding application in defense electronic systems and is under development by NASA for deep space communications. However, for the MPM to become competitive and commercially successful, a major reduction in cost must be achieved.

Characterization of shape and deformation of MEMS by quantitative optoelectronic metrology techniques

NASA Astrophysics Data System (ADS)

Furlong, Cosme; Pryputniewicz, Ryszard J.

2002-06-01

Recent technological trends based on miniaturization of mechanical, electro-mechanical, and photonic devices to the microscopic scale, have led to the development of microelectromechanical systems (MEMS). Effective development of MEMS components requires the synergism of advanced design, analysis, and fabrication methodologies, and also of quantitative metrology techniques for characterizing their performance, reliability, and integrity during the electronic packaging cycle. In this paper, we describe opto-electronic techniques for measuring, with sub-micrometer accuracy, shape and changes in states of deformation of MEMS strictures. With the described opto-electronic techniques, it is possible to characterize MEMS components using the display and data modes. In the display mode, interferometric information related to shape and deformation is displayed at video frame rates, providing the capability for adjusting and setting experimental conditions. In the data mode, interferometric information related to shape and deformation is recorded as high-spatial and high-digital resolution images, which are further processed to provide quantitative 3D information. Furthermore, the quantitative 3D data are exported to computer-aided design (CAD) environments and utilized for analysis and optimization of MEMS devices. Capabilities of opto- electronic techniques are illustrated with representative applications demonstrating their applicability to provide indispensable quantitative information for the effective development and optimization of MEMS devices.

Trends in Food Packaging.

ERIC Educational Resources Information Center

Ott, Dana B.

1988-01-01

This article discusses developments in food packaging, processing, and preservation techniques in terms of packaging materials, technologies, consumer benefits, and current and potential food product applications. Covers implications due to consumer life-style changes, cost-effectiveness of packaging materials, and the ecological impact of…

Meat Quality Assessment by Electronic Nose (Machine Olfaction Technology)

PubMed Central

Ghasemi-Varnamkhasti, Mahdi; Mohtasebi, Seyed Saeid; Siadat, Maryam; Balasubramanian, Sundar

2009-01-01

Over the last twenty years, newly developed chemical sensor systems (so called “electronic noses”) have made odor analyses possible. These systems involve various types of electronic chemical gas sensors with partial specificity, as well as suitable statistical methods enabling the recognition of complex odors. As commercial instruments have become available, a substantial increase in research into the application of electronic noses in the evaluation of volatile compounds in food, cosmetic and other items of everyday life is observed. At present, the commercial gas sensor technologies comprise metal oxide semiconductors, metal oxide semiconductor field effect transistors, organic conducting polymers, and piezoelectric crystal sensors. Further sensors based on fibreoptic, electrochemical and bi-metal principles are still in the developmental stage. Statistical analysis techniques range from simple graphical evaluation to multivariate analysis such as artificial neural network and radial basis function. The introduction of electronic noses into the area of food is envisaged for quality control, process monitoring, freshness evaluation, shelf-life investigation and authenticity assessment. Considerable work has already been carried out on meat, grains, coffee, mushrooms, cheese, sugar, fish, beer and other beverages, as well as on the odor quality evaluation of food packaging material. This paper describes the applications of these systems for meat quality assessment, where fast detection methods are essential for appropriate product management. The results suggest the possibility of using this new technology in meat handling. PMID:22454572

7 CFR 3402.10 - Application package.

Code of Federal Regulations, 2014 CFR

2014-01-01

... AGRICULTURE FOOD AND AGRICULTURAL SCIENCES NATIONAL NEEDS GRADUATE AND POSTGRADUATE FELLOWSHIP GRANTS PROGRAM....grants.gov and through the NIFA Web site. An application package will be made available to any potential...

7 CFR 3402.10 - Application package.

Code of Federal Regulations, 2012 CFR

2012-01-01

... AGRICULTURE FOOD AND AGRICULTURAL SCIENCES NATIONAL NEEDS GRADUATE AND POSTGRADUATE FELLOWSHIP GRANTS PROGRAM....grants.gov and through the NIFA Web site. An application package will be made available to any potential...

7 CFR 3402.10 - Application package.

Code of Federal Regulations, 2013 CFR

2013-01-01

... AGRICULTURE FOOD AND AGRICULTURAL SCIENCES NATIONAL NEEDS GRADUATE AND POSTGRADUATE FELLOWSHIP GRANTS PROGRAM....grants.gov and through the NIFA Web site. An application package will be made available to any potential...

Ultra high speed image processing techniques. [electronic packaging techniques

NASA Technical Reports Server (NTRS)

Anthony, T.; Hoeschele, D. F.; Connery, R.; Ehland, J.; Billings, J.

1981-01-01

Packaging techniques for ultra high speed image processing were developed. These techniques involve the development of a signal feedthrough technique through LSI/VLSI sapphire substrates. This allows the stacking of LSI/VLSI circuit substrates in a 3 dimensional package with greatly reduced length of interconnecting lines between the LSI/VLSI circuits. The reduced parasitic capacitances results in higher LSI/VLSI computational speeds at significantly reduced power consumption levels.

Radiation treatment for sterilization of packaging materials

NASA Astrophysics Data System (ADS)

Haji-Saeid, Mohammad; Sampa, Maria Helena O.; Chmielewski, Andrzej G.

2007-08-01

Treatment with gamma and electron radiation is becoming a common process for the sterilization of packages, mostly made of natural or synthetic plastics, used in the aseptic processing of foods and pharmaceuticals. The effect of irradiation on these materials is crucial for packaging engineering to understand the effects of these new treatments. Packaging material may be irradiated either prior to or after filling. The irradiation prior to filling is usually chosen for dairy products, processed food, beverages, pharmaceutical, and medical device industries in the United States, Europe, and Canada. Radiation effects on packaging material properties still need further investigation. This paper summarizes the work done by different groups and discusses recent developments in regulations and testing procedures in the field of packaging technology.

Electron treatment of wood pulp for the viscose process

NASA Astrophysics Data System (ADS)

Stepanik, T. M.; Ewing, D. E.; Whitehouse, R.

2000-03-01

Electron processing is currently being evaluated by several viscose producers for integration into their process. The viscose industry converts dissolving wood pulp into products such as staple fibre, filament, cord, film, packaging, and non-edible sausage casings. These materials are used in the clothing, drapery, hygiene, automobile, food, and packaging industries. Viscose producers are facing increasingly high production costs and stringent environmental regulations that have forced some plants to close. Electron treatment of wood pulp can significantly reduce the amounts of chemicals used for producing viscose and the production of hazardous pollutants. Acsion Industries has worked with companies worldwide to demonstrate the benefits of using electron treated pulp for producing viscose (rayon). This paper describes the viscose process, the benefits of using electron treatment in the viscose process, and Acsion's efforts in developing this technology.

PLA/PBAT Bionanocomposites with Antimicrobial Natural Rosin for Green Packaging.

PubMed

Moustafa, Hesham; El Kissi, Nadia; Abou-Kandil, Ahmed I; Abdel-Aziz, Mohamed S; Dufresne, Alain

2017-06-14

The use of biodegradable polymers is of great importance nowadays in many applications. Some of the most commonly used biopolymers are polylactic acid (PLA) and poly(butylene adipate-co-terephthalate) (PBAT) due to their superior properties and availability. In this manuscript, we use a facile and green modification method of organoclay (OC) by antimicrobial natural rosin which is considered as a toxicity-free reinforcing material, thus keeping the green character of the material. It increases the interlayer spacing between the clay platelets. This was proven by X-ray diffraction (XRD) and Fourier transform infrared spectroscopy (FTIR) and found to impart antimicrobial properties to PLA/PBAT blends. The morphology of the resulting blends was conducted using scanning and transmission electron microscopies (SEM and TEM), and evidence of exfoliation and intercalation was observed. The thermal properties of the blends were studied using differential scanning calorimetry (DSC), and a detailed study of the crystallization of both PLA and PBAT was reported showing cold crystallization behavior of PLA. The final effect on mechanical and antimicrobial properties was also investigated. The obtained results reveal excellent possibility of using expanded OC modified PLA/PBAT polymer blends by adding a green material, antimicrobial natural rosin, for food packaging and biomembranes applications.

Monolithic silicon-photonic platforms in state-of-the-art CMOS SOI processes [Invited].

PubMed

Stojanović, Vladimir; Ram, Rajeev J; Popović, Milos; Lin, Sen; Moazeni, Sajjad; Wade, Mark; Sun, Chen; Alloatti, Luca; Atabaki, Amir; Pavanello, Fabio; Mehta, Nandish; Bhargava, Pavan

2018-05-14

Integrating photonics with advanced electronics leverages transistor performance, process fidelity and package integration, to enable a new class of systems-on-a-chip for a variety of applications ranging from computing and communications to sensing and imaging. Monolithic silicon photonics is a promising solution to meet the energy efficiency, sensitivity, and cost requirements of these applications. In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our "zero-change" silicon photonics platforms in 45 nm and 32 nm SOI CMOS. The results indicate that the 45 nm and 32 nm processes provide a "sweet-spot" for adding photonic capability and enhancing integrated system applications beyond the Moore-scaling, while being able to offload major communication tasks from more deeply-scaled compute and memory chips without complicated 3D integration approaches.

METLIN-PC: An applications-program package for problems of mathematical programming

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pshenichnyi, B.N.; Sobolenko, L.A.; Sosnovskii, A.A.

1994-05-01

The METLIN-PC applications-program package (APP) was developed at the V.M. Glushkov Institute of Cybernetics of the Academy of Sciences of Ukraine on IBM PC XT and AT computers. The present version of the package was written in Turbo Pascal and Fortran-77. The METLIN-PC is chiefly designed for the solution of smooth problems of mathematical programming and is a further development of the METLIN prototype, which was created earlier on a BESM-6 computer. The principal property of the previous package is retained - the applications modules employ a single approach based on the linearization method of B.N. Pschenichnyi. Hence the namemore » {open_quotes}METLIN.{close_quotes}« less

75 FR 21606 - Office of Special Education and Rehabilitative Services; Overview Information; Rehabilitation...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-26

... Application Package: You can obtain an application package via the Internet or from the Education Publications.... Department of Education, Application Control Center, Attention: CFDA Number 84.275A, LBJ Basement Level 1.... Department of Education. If you mail your application through the U.S. Postal Service, we do not accept...

75 FR 1044 - Office of Postsecondary Education; Overview Information; Fund for the Improvement of...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-01-08

... to Request Application Package: You can obtain an application package via the Internet or from the... application deadline date, to the Department at the following address: U.S. Department of Education..., to the Department at the following address: U.S. Department of Education, Application Control Center...

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2014 CFR

2014-01-01

... supplier under whose brand name and firm name the material is marketed to the official establishment. The... packaging materials must be traceable to the applicable guaranty. (c) The guaranty by the packaging supplier.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2012 CFR

2012-01-01

... supplier under whose brand name and firm name the material is marketed to the official establishment. The... packaging materials must be traceable to the applicable guaranty. (c) The guaranty by the packaging supplier.... Official establishments and packaging suppliers providing written guaranties to those official...

9 CFR 317.24 - Packaging materials.

Code of Federal Regulations, 2013 CFR

2013-01-01

... supplier under whose brand name and firm name the material is marketed to the official establishment. The... packaging materials must be traceable to the applicable guaranty. (c) The guaranty by the packaging supplier.... Official establishments and packaging suppliers providing written guaranties to those official...

LTCC Thick Film Process Characterization

DOE PAGES

Girardi, M. A.; Peterson, K. A.; Vianco, P. T.

2016-05-01

Low temperature cofired ceramic (LTCC) technology has proven itself in military/space electronics, wireless communication, microsystems, medical and automotive electronics, and sensors. The use of LTCC for high frequency applications is appealing due to its low losses, design flexibility and packaging and integration capability. Moreover, we summarize the LTCC thick film process including some unconventional process steps such as feature machining in the unfired state and thin film definition of outer layer conductors. The LTCC thick film process was characterized to optimize process yields by focusing on these factors: 1) Print location, 2) Print thickness, 3) Drying of tapes and panels,more » 4) Shrinkage upon firing, and 5) Via topography. Statistical methods were used to analyze critical process and product characteristics in the determination towards that optimization goal.« less

Lumped element filters for electronic warfare systems

NASA Astrophysics Data System (ADS)

Morgan, D.; Ragland, R.

1986-02-01

Increasing demands which future generations of electronic warfare (EW) systems are to satisfy include a reduction in the size of the equipment. The present paper is concerned with lumped element filters which can make a significant contribution to the downsizing of advanced EW systems. Lumped element filter design makes it possible to obtain very small package sizes by utilizing classical low frequency inductive and capacitive components which are small compared to the size of a wavelength. Cost-effective, temperature-stable devices can be obtained on the basis of new design techniques. Attention is given to aspects of design flexibility, an interdigital filter equivalent circuit diagram, conditions for which the use of lumped element filters can be recommended, construction techniques, a design example, and questions regarding the application of lumped element filters to EW processing systems.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

QMCPACK : an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

DOE PAGES

Kim, Jeongnim; Baczewski, Andrew T.; Beaudet, Todd D.; ...

2018-04-19

QMCPACK is an open source quantum Monte Carlo package for ab-initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater-Jastrow type trial wave functions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performancemore » computing architectures, including multicore central processing unit (CPU) and graphical processing unit (GPU) systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://www.qmcpack.org.« less

Thermal Analysis of the NASA Integrated Vehicle Health Monitoring Experiment Technology for X-Vehicles (NITEX)

NASA Technical Reports Server (NTRS)

Hegab, Hisham E.

2002-01-01

The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.

Thermal Analysis Of The NASA Integrated Vehicle Health Monitoring Experiment Technology For X-Vehicles (NITEX)

NASA Technical Reports Server (NTRS)

Hegab, Hisham E.

2001-01-01

The purpose of this project was to perform a thermal analysis for the NASA Integrated Vehicle Health Monitoring (IVHM) Technology Experiment for X-vehicles (NITEX). This electronics package monitors vehicle sensor information in flight and downlinks vehicle health summary information via telemetry. The experiment will be tested on the X-34 in an unpressurized compartment, in the vicinity of one of the vehicle's liquid oxygen tanks. The transient temperature profile for the electronics package has been determined using finite element analysis for possible mission profiles that will most likely expose the package to the most extreme hot and cold environmental conditions. From the analyses, it was determined that temperature limits for the electronics would be exceeded for the worst case cold environment mission profile. The finite element model used for the analyses was modified to examine the use of insulation to address this problem. Recommendations for insulating the experiment for the cold environment are presented, and were analyzed to determine their effect on a nominal mission profile.

QMCPACK : an open source ab initio quantum Monte Carlo package for the electronic structure of atoms, molecules and solids

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Jeongnim; Baczewski, Andrew T.; Beaudet, Todd D.

QMCPACK is an open source quantum Monte Carlo package for ab-initio electronic structure calculations. It supports calculations of metallic and insulating solids, molecules, atoms, and some model Hamiltonians. Implemented real space quantum Monte Carlo algorithms include variational, diffusion, and reptation Monte Carlo. QMCPACK uses Slater-Jastrow type trial wave functions in conjunction with a sophisticated optimizer capable of optimizing tens of thousands of parameters. The orbital space auxiliary field quantum Monte Carlo method is also implemented, enabling cross validation between different highly accurate methods. The code is specifically optimized for calculations with large numbers of electrons on the latest high performancemore » computing architectures, including multicore central processing unit (CPU) and graphical processing unit (GPU) systems. We detail the program’s capabilities, outline its structure, and give examples of its use in current research calculations. The package is available at http://www.qmcpack.org.« less

48 CFR 47.305-1 - Solicitation requirements.

Code of Federal Regulations, 2012 CFR

2012-10-01

... much of the following data as is applicable to the particular acquisition: (a) Modes of transportation... packaging; e.g., box, carton, crate, drum, bundle, skids, and when applicable, package number from the...

48 CFR 47.305-1 - Solicitation requirements.

Code of Federal Regulations, 2013 CFR

2013-10-01

... much of the following data as is applicable to the particular acquisition: (a) Modes of transportation... packaging; e.g., box, carton, crate, drum, bundle, skids, and when applicable, package number from the...

48 CFR 47.305-1 - Solicitation requirements.

Code of Federal Regulations, 2014 CFR

2014-10-01

... much of the following data as is applicable to the particular acquisition: (a) Modes of transportation... packaging; e.g., box, carton, crate, drum, bundle, skids, and when applicable, package number from the...

48 CFR 47.305-1 - Solicitation requirements.

Code of Federal Regulations, 2011 CFR

2011-10-01

... much of the following data as is applicable to the particular acquisition: (a) Modes of transportation... packaging; e.g., box, carton, crate, drum, bundle, skids, and when applicable, package number from the...

48 CFR 47.305-1 - Solicitation requirements.

Code of Federal Regulations, 2010 CFR

2010-10-01

... much of the following data as is applicable to the particular acquisition: (a) Modes of transportation... packaging; e.g., box, carton, crate, drum, bundle, skids, and when applicable, package number from the...

National Information Exchange Model (NIEM): DoD Adoption and Implications for C2 (Briefing Charts)

DTIC Science & Technology

2014-06-18

Application Data Consumers Information Exchange Package ( IEP ) the data exchanged at runtime Data Producers IES defines Information Exchange...Specification (IES) build-time description of the data to be exchanged Developers System / Application System / Application IEP | 9 | Data...Exchange Package ( IEP ) the data exchanged at runtime Data Producers System / Application System / Application IEP Consumer’s Understanding

Pilot production and advanced development of large-area picosecond photodetectors

NASA Astrophysics Data System (ADS)

Minot, Michael J.; Adams, Bernhard W.; Aviles, Melvin; Bond, Justin L.; Craven, Christopher A.; Cremer, Till; Foley, Michael R.; Lyashenko, Alexey; Popecki, Mark A.; Stochaj, Michael E.; Worstell, William A.; Mane, Anil U.; Elam, Jeffrey W.; Siegmund, Oswald H. W.; Ertley, Camden; Frisch, Henry; Elagin, Andrey

2016-09-01

We report pilot production and advanced development performance results achieved for Large Area Picosecond Photodetectors (LAPPD). The LAPPD is a microchannel plate (MCP) based photodetector, capable of imaging with single-photon sensitivity at high spatial and temporal resolutions in a hermetic package with an active area of 400 square centimeters. In December 2015, Incom Inc. completed installation of equipment and facilities for demonstration of early stage pilot production of LAPPD. Initial fabrication trials commenced in January 2016. The "baseline" LAPPD employs an all-glass hermetic package with top and bottom plates and sidewalls made of borosilicate float glass. Signals are generated by a bi-alkali Na2KSb photocathode and amplified with a stacked chevron pair of "next generation" MCPs produced by applying resistive and emissive atomic layer deposition coatings to borosilicate glass capillary array (GCA) substrates. Signals are collected on RF strip-line anodes applied to the bottom plates which exit the detector via pinfree hermetic seals under the side walls. Prior tests show that LAPPDs have electron gains greater than 107, submillimeter space resolution for large pulses and several mm for single photons, time resolutions of 50 picoseconds for single photons, predicted resolution of less than 5 picoseconds for large pulses, high stability versus charge extraction, and good uniformity. LAPPD performance results for product produced during the first half of 2016 will be reviewed. Recent advances in the development of LAPPD will also be reviewed, as the baseline design is adapted to meet the requirements for a wide range of emerging application. These include a novel ceramic package design, ALD coated MCPs optimized to have a low temperature coefficient of resistance (TCR) and further advances to adapt the LAPPD for cryogenic applications using Liquid Argon (LAr). These developments will meet the needs for DOE-supported RD for the Deep Underground Neutrino Experiment (DUNE), nuclear physics applications such as EIC, medical, homeland security and astronomical applications for direct and indirect photon detection.

NASA EEE Parts 2014 Year in Review

NASA Technical Reports Server (NTRS)

Lee, Sara-Anne

2015-01-01

The NASA Electronic Parts and Packaging Program continue to support Electrical, Electronic and Electromagnetic Parts for the agency with an eventful year of workshops, innovations, testing and challenges.

Investigation of Thermal Interface Materials Using Phase-Sensitive Transient Thermoreflectance Technique: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, X.; King, C.; DeVoto, D.

2014-08-01

With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat conduction model was constructed and theoretical solutions were derived to obtain the relation between phase lag and the thermal/physical properties. This technique enables simultaneous extraction of the contact resistance and bulk thermal conductivity of the TIMs. With the measurements, the bulk thermal conductivity of Dow TC-5022 thermal grease (70 tomore » 75 um bondline thickness) was 3 to 5 W/(m-K) and the contact resistance was 5 to 10 mm2-K/W. For the Btech thermoplastic material (45 to 80 μm bondline thickness), the bulk thermal conductivity was 20 to 50 W/(m-K) and the contact resistance was 2 to 5 mm2-K/W. Measurements were also conducted to quantify the thermal performance of diffusion-bonded interface for power electronics applications. Results with the diffusion-bonded sample showed that the interfacial thermal resistance is more than one order of magnitude lower than those of traditional TIMs, suggesting potential pathways to efficient thermal management.« less

Cryogenic Amplifier Based Receivers at Submillimeter Wavelengths

NASA Technical Reports Server (NTRS)

Chattopadhyay, Goutam; Reck, Theodore and; Schlecht, Erich; Lin, Robert; Deal, William

2012-01-01

The operating frequency of InP high electron mobility transistor (HEMT) based amplifiers has moved well in the submillimeter-wave frequencies over the last couple of years. Working amplifiers with usable gain in waveguide packages has been reported beyond 700 GHz. When cooled cryogenically, they have shown substantial improvement in their noise temperature. This has opened up the real possibility of cryogenic amplifier based heterodyne receivers at submillimeter wavelengths for ground-based, air-borne, and space-based instruments for astrophysics, planetary, and Earth science applications. This paper provides an overview of the science applications at submillimeter wavelengths that will benefit from this technology. It also describes the current state of the InP HEMT based cryogenic amplifier receivers at submillimeter wavelengths.

49 CFR 173.310 - Exceptions for radiation detectors.

Code of Federal Regulations, 2010 CFR

2010-10-01

...-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Gases; Preparation and Packaging § 173.310 Exceptions for radiation detectors. Radiation detectors, radiation sensors, electron tube devices, or ionization chambers, herein referred to as “radiation detectors,” that contain only Division 2.2 gases, are excepted...

49 CFR 173.310 - Exceptions for radiation detectors.

Code of Federal Regulations, 2011 CFR

2011-10-01

...-GENERAL REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Gases; Preparation and Packaging § 173.310 Exceptions for radiation detectors. Radiation detectors, radiation sensors, electron tube devices, or ionization chambers, herein referred to as “radiation detectors,” that contain only Division 2.2 gases, are excepted...

Transit safety retrofit package development : applications requirements document.

DOT National Transportation Integrated Search

2014-05-01

This Application Requirements Document for the Transit Safety Retrofit Package (TRP) Development captures the system, hardware and software requirements towards fulfilling the technical objectives stated within the contract. To achieve the objective ...

Application of Thermo-Mechanical Measurements of Plastic Packages for Reliability Evaluation of PEMS

NASA Technical Reports Server (NTRS)

Sharma, Ashok K.; Teverovsky, Alexander

2004-01-01

Thermo-mechanical analysis (TMA) is typically employed for measurements of the glass transition temperature (Tg) and coefficients of thermal expansion (CTE) in molding compounds used in plastic encapsulated microcircuits (PEMs). Application of TMA measurements directly to PEMs allows anomalies to be revealed in deformation of packages with temperature, and thus indicates possible reliability concerns related to thermo-mechanical integrity and stability of the devices. In this work, temperature dependencies of package deformation were measured in several types of PEMs that failed environmental stress testing including temperature cycling, highly accelerated stress testing (HAST) in humid environments, and bum-in (BI) testing. Comparison of thermo-mechanical characteristics of packages and molding compounds in the failed parts allowed for explanation of the observed failures. The results indicate that TMA of plastic packages might be used for quality evaluation of PEMs intended for high-reliability applications.

SVGA and XGA active matrix microdisplays for head-mounted applications

NASA Astrophysics Data System (ADS)

Alvelda, Phillip; Bolotski, Michael; Brown, Imani L.

2000-03-01

The MicroDisplay Corporation's liquid crystal on silicon (LCOS) display devices are based on the union of several technologies with the extreme integration capability of conventionally fabricated CMOS substrates. The fast liquid crystal operation modes and new scalable high-performance pixel addressing architectures presented in this paper enable substantially improved color, contrast, and brightness while still satisfying the optical, packaging, and power requirements of portable applications. The entire suite of MicroDisplay's technologies was devised to create a line of mixed-signal application-specific integrated circuits (ASICs) in single-chip display systems. Mixed-signal circuits can integrate computing, memory, and communication circuitry on the same substrate as the display drivers and pixel array for a multifunctional complete system-on-a-chip. System-on-a-chip benefits also include reduced head supported weight requirements through the elimination of off-chip drive electronics.

My Favorite Things Electronically Speaking, 1997 Edition.

ERIC Educational Resources Information Center

Glantz, Shelley

1997-01-01

Responding to an informal survey, 96 media specialists named favorite software, CD-ROMs, and online sites. This article lists automation packages, electronic encyclopedias, CD-ROMs, electronic magazine indexes, CD-ROM and online database services, electronic sources of current events, laser disks for grades 6-12, word processing programs for…

Development and characterization of a ferroelectric non-volatile memory for flexible electronics

NASA Astrophysics Data System (ADS)

Mao, Duo

Flexible electronics have received significant attention recently because of the potential applications in displays, sensors, radio frequency identification (RFID) tags and other integrated circuits. Electrically addressable non-volatile memory is a key component for these applications. The major challenges are to fabricate the memory at a low temperature compatible with plastic substrates while maintaining good device reliability, by being compatible with process as needed to integrate with other electronic components for system-on-chip applications. In this work, ferroelectric capacitors fabricated at low temperature were developed. Based on that, a ferroelectric random access memory (FRAM) for flexible electronics was developed and characterized. Poly(vinylidene fluoride-trifluoroethylene) [P(VDF-TrFE)] copolymer was used as a ferroelectric material and a photolithographic process was developed to fabricate ferroelectric capacitors. Different characterization methods including atomic force microscopy, x-ray diffraction and Fourier-transform infrared reflection-absorption spectroscopy were used to study the material properties of the P(VDF-TrFE) film. The material properties were correlated with the electrical characteristics of the ferroelectric capacitors. To understand the polarization switching behavior of the P(VDF-TrFE) ferroelectric capacitors, a Nucleation-Limited-Switching (NLS) model was used to study the switching kinetics. The switching kinetics were characterized over the temperature range from -60 °C to 100 °C. Fatigue characteristics were studied at different electrical stress voltages and frequencies to evaluate the reliability of the ferroelectric capacitor. The degradation mechanism is attributed to the increase of the activation field and the suppression of the switchable polarization. To develop a FRAM circuit for flexible electronics, an n-channel thin film transistor (TFT) based on CdS as the semiconductor was integrated with a P(VDF-TrFE) ferroelectric capacitor for a one-transistor-one-capacitor (1T1C) memory cell. The 1T1C devices were fabricated at low temperature and demonstrated a memory window (DeltaVBL) of 2.3 V and 3.5 V, depending on the device dimensions. Next, FRAM arrays (4-bit, 16-bit and 64-bit) based on the two-transistor-two-capacitor (2T2C) memory cell architecture were designed and fabricated using a photolithographic process with 9 masks. The fabricated FRAM arrays were packaged in 28-pin ceramic packages. The read/write schemes were developed and the FRAM arrays show successful program and erase with a memory window of approximately 1 V at the output of the sense amplifier.

Battery packaging - Technology review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maiser, Eric

2014-06-16

This paper gives a brief overview of battery packaging concepts, their specific advantages and drawbacks, as well as the importance of packaging for performance and cost. Production processes, scaling and automation are discussed in detail to reveal opportunities for cost reduction. Module standardization as an additional path to drive down cost is introduced. A comparison to electronics and photovoltaics production shows 'lessons learned' in those related industries and how they can accelerate learning curves in battery production.

75 FR 21614 - Office of Special Education and Rehabilitative Services; Overview Information; Rehabilitation...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-04-26

... Application Package: You can obtain an application package via the Internet or from the Education Publications... of Education, Application Control Center, Attention: (CFDA Number 84.246K), LBJ Basement Level 1, 400... Education. If you mail your application through the U.S. Postal Service, we do not accept either of the...

Utilization of Pb-free solders in MEMS packaging

NASA Astrophysics Data System (ADS)

Selvaduray, Guna S.

2003-01-01

Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

Distinct DNA exit and packaging portals in the virus Acanthamoeba polyphaga mimivirus.

PubMed

Zauberman, Nathan; Mutsafi, Yael; Halevy, Daniel Ben; Shimoni, Eyal; Klein, Eugenia; Xiao, Chuan; Sun, Siyang; Minsky, Abraham

2008-05-13

Icosahedral double-stranded DNA viruses use a single portal for genome delivery and packaging. The extensive structural similarity revealed by such portals in diverse viruses, as well as their invariable positioning at a unique icosahedral vertex, led to the consensus that a particular, highly conserved vertex-portal architecture is essential for viral DNA translocations. Here we present an exception to this paradigm by demonstrating that genome delivery and packaging in the virus Acanthamoeba polyphaga mimivirus occur through two distinct portals. By using high-resolution techniques, including electron tomography and cryo-scanning electron microscopy, we show that Mimivirus genome delivery entails a large-scale conformational change of the capsid, whereby five icosahedral faces open up. This opening, which occurs at a unique vertex of the capsid that we coined the "stargate", allows for the formation of a massive membrane conduit through which the viral DNA is released. A transient aperture centered at an icosahedral face distal to the DNA delivery site acts as a non-vertex DNA packaging portal. In conjunction with comparative genomic studies, our observations imply a viral packaging pathway akin to bacterial DNA segregation, which might be shared by diverse internal membrane-containing viruses.

Distinct DNA Exit and Packaging Portals in the Virus Acanthamoeba polyphaga mimivirus

PubMed Central

Zauberman, Nathan; Mutsafi, Yael; Halevy, Daniel Ben; Shimoni, Eyal; Klein, Eugenia; Xiao, Chuan; Sun, Siyang; Minsky, Abraham

2008-01-01

Icosahedral double-stranded DNA viruses use a single portal for genome delivery and packaging. The extensive structural similarity revealed by such portals in diverse viruses, as well as their invariable positioning at a unique icosahedral vertex, led to the consensus that a particular, highly conserved vertex-portal architecture is essential for viral DNA translocations. Here we present an exception to this paradigm by demonstrating that genome delivery and packaging in the virus Acanthamoeba polyphaga mimivirus occur through two distinct portals. By using high-resolution techniques, including electron tomography and cryo-scanning electron microscopy, we show that Mimivirus genome delivery entails a large-scale conformational change of the capsid, whereby five icosahedral faces open up. This opening, which occurs at a unique vertex of the capsid that we coined the “stargate”, allows for the formation of a massive membrane conduit through which the viral DNA is released. A transient aperture centered at an icosahedral face distal to the DNA delivery site acts as a non-vertex DNA packaging portal. In conjunction with comparative genomic studies, our observations imply a viral packaging pathway akin to bacterial DNA segregation, which might be shared by diverse internal membrane–containing viruses. PMID:18479185

Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S. E.; Esener, Sadik C.

1999-09-01

We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI s) can be integrated simply on electronic multichip modules (MCM s) for intra-MCM board interconnects. Our system-level packaging architecture is based on a modified folded 4 f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than 20 dB at low frequency have been measured. The system is compact at only 10 in. 3 (25.4 cm 3 ) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

7 CFR 1944.52 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-01-01

... subpart L of part 1940 of this chapter. Complete application package (hereafter called package). The package submitted to the appropriate FmHA or its successor agency under Public Law 103-354 office which is... the Administrator that equals the customary and reasonable costs incurred in preparing a package for a...

7 CFR 1944.52 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-01-01

... subpart L of part 1940 of this chapter. Complete application package (hereafter called package). The package submitted to the appropriate FmHA or its successor agency under Public Law 103-354 office which is... the Administrator that equals the customary and reasonable costs incurred in preparing a package for a...

7 CFR 1944.52 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-01-01

... subpart L of part 1940 of this chapter. Complete application package (hereafter called package). The package submitted to the appropriate FmHA or its successor agency under Public Law 103-354 office which is... the Administrator that equals the customary and reasonable costs incurred in preparing a package for a...

7 CFR 1944.52 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-01-01

... subpart L of part 1940 of this chapter. Complete application package (hereafter called package). The package submitted to the appropriate FmHA or its successor agency under Public Law 103-354 office which is... the Administrator that equals the customary and reasonable costs incurred in preparing a package for a...

7 CFR 1944.52 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-01-01

... subpart L of part 1940 of this chapter. Complete application package (hereafter called package). The package submitted to the appropriate FmHA or its successor agency under Public Law 103-354 office which is... the Administrator that equals the customary and reasonable costs incurred in preparing a package for a...

Trends in antimicrobial food packaging systems: Emitting sachets and absorbent pads

USDA-ARS?s Scientific Manuscript database

Active antimicrobial packaging interacts with packaged food and headspace to reduce, retard, or even inhibit the growth of spoilage and pathogenic microorganisms. Sachets and pads are one of the most successful applications of active food packaging. This review discusses recent developments of antim...

Shock-isolation material selection for electronic packages in hard-target environment

DOE Office of Scientific and Technical Information (OSTI.GOV)

Stotts, Jarrett Eugene

High velocity munitions and kinetic penetrators experience monumental external forces, impulses, and accelerations. The hard target environment is immensely taxing on sophisticated electronic components and recorders designed to retrieve valuable data related to the systems performance and characteristics in the periods of flight, impact, and post-impact. Such electronic systems have upper limits of overall shock intensity which, if exceeded, will either shorten the operating life of the parts or risk destruction resulting in loss of both the data and the principal value of the recorder. The focus of this project was to refine the categorization of leading material types formore » encapsulation and passive shock isolation and implement them in a method useable for a wide variety of environments. Namely, a design methodology capable of being tailored to the specific impact conditions to maximize the lively hood of sensitive electronics and the information recorded. The results of the study concluded that the materials observed under consistent dynamic high strain rate tests, which include Conathane® EN-4/9, Slygard®-184, and Stycast™-2651, behaved well in certain aspects of energy transmission and shock when considering the frequency environment or package coupled with the isolation material’s application. Key points about the implementation of the materials in extreme shock environments is discussed with the connection to energy analysis, loss attributes, and pulse transmissibility modeling. However, attempts to model the materials solely based on energy transmissibility in the frequency domain using only external experimental data and simplified boundary conditions was not found to be consistent with that acquired from the pressure bar experiments. Further work will include the addition of further material experimentation of the encapsulants in other frequency and temperature states, confined and pre-load boundary states, and composite constructions.« less

Vibration analysis of printed circuit boards: Effect of boundary condition

NASA Astrophysics Data System (ADS)

Prashanth, M. D.

2018-04-01

A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing. A number of electronic components are mounted on the printed circuit board (PCB). A spacecraft experiences various types of loads during its launch such as vibration, acoustic and shock loads. Prediction of response for printed circuit boards due to vibration loads is important for mechanical design and reliability of electronic packages. The modeling and analysis of printed circuit boards is required for accurate prediction of response due to vibration loads. The response of PCB is highly dependent on the mounting configuration of PCB. In addition, anti-vibration mounts or stiffeners are used to reduce the PCB response. Vibration analysis of printed circuit boards is carried out using finite element method. The objective of this paper is to determine the dynamic characteristics of a printed circuit board. Modeling and analysis of PCB shall be carried out to study the effect of boundary conditions on the vibration response. The modeling of stiffeners or ribs shall also be considered in detail. The analysis results shall be validated using vibration tests of PCB.

Polysaccharide-Based Membranes in Food Packaging Applications.

PubMed

Ferreira, Ana R V; Alves, Vítor D; Coelhoso, Isabel M

2016-04-13

Plastic packaging is essential nowadays. However, the huge environmental problem caused by landfill disposal of non-biodegradable polymers in the end of life has to be minimized and preferentially eliminated. The solution may rely on the use of biopolymers, in particular polysaccharides. These macromolecules with film-forming properties are able to produce attracting biodegradable materials, possibly applicable in food packaging. Despite all advantages of using polysaccharides obtained from different sources, some drawbacks, mostly related to their low resistance to water, mechanical performance and price, have hindered their wider use and commercialization. Nevertheless, with increasing attention and research on this field, it has been possible to trace some strategies to overcome the problems and recognize solutions. This review summarizes some of the most used polysaccharides in food packaging applications.

76 FR 10065 - Agency Information Collection Activities: Revision of a Previously Approved Collection, With...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-02-23

... Information Collection Under Review: COPS Application Package. The Department of Justice (DOJ) Office of Community Oriented Policing Services (COPS), will be submitting the following information collection request.../Collection: COPS Application Package. (3) Agency form number, if any, and the applicable component of the...

Principles of Pesticide Use, Handling, and Application: Instructional Modules for Vocational Agriculture Education. Student Manual.

ERIC Educational Resources Information Center

Ellis Associates, Inc., College Park, MD.

This training package is designed to present the basic principles of pesticide use, handling, and application. Included in this package is information on federal laws and regulations, personal safety, environmental implications, storage and disposal considerations, proper application procedures, and fundamentals of pest management. Successful…

Principles of Pesticide Use, Handling, and Application: Instructional Modules for Vocational Agriculture Education. Teacher Manual.

ERIC Educational Resources Information Center

Ellis Associates, Inc., College Park, MD.

The training package is designed to present the basic principles of pesticide use, handling, and application. Included in this package is information on Federal laws and regulations, personal safety, environmental implications, storage and disposal considerations, proper application procedures, and fundamentals of pest management. Successful…

75 FR 33605 - Overview Information Fund for the Improvement of Postsecondary Education (FIPSE)-Comprehensive...

Federal Register 2010, 2011, 2012, 2013, 2014

2010-06-14

... Improvement of Postsecondary Education (FIPSE)--Comprehensive Program; Notice Inviting Applications for New.... Address to Request Application Package: ED Pubs, U.S. Department of Education, P.O. Box 22207, Alexandria....116B. Individuals with disabilities can obtain a copy of the application package in an accessible...

Introduction and NASA Electronic Parts and Packaging (NEPP) Program Overview

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2014-01-01

This presentation includes an introduction to the space radiation environment, the effects on electronics, the environment in action, flight projects, mission needs, and radiation hardness assurance (RHA).

21 CFR 111.25 - What are the requirements under this subpart D for written procedures?

Code of Federal Regulations, 2012 CFR

2012-04-01

... MANUFACTURING, PACKAGING, LABELING, OR HOLDING OPERATIONS FOR DIETARY SUPPLEMENTS Equipment and Utensils § 111... dietary supplement; (b) Calibrating, inspecting, and checking automated, mechanical, and electronic... other contact surfaces that are used to manufacture, package, label, or hold components or dietary...

21 CFR 111.25 - What are the requirements under this subpart D for written procedures?

Code of Federal Regulations, 2014 CFR

2014-04-01

... MANUFACTURING, PACKAGING, LABELING, OR HOLDING OPERATIONS FOR DIETARY SUPPLEMENTS Equipment and Utensils § 111... dietary supplement; (b) Calibrating, inspecting, and checking automated, mechanical, and electronic... other contact surfaces that are used to manufacture, package, label, or hold components or dietary...

16 CFR 260.2 - Scope of guides.

Code of Federal Regulations, 2012 CFR

2012-01-01

... directly or by implication, through words, symbols, emblems, logos, depictions, product brand names, or... electronic mail. The guides apply to any claim about the environmental attributes of a product, package or service in connection with the sale, offering for sale, or marketing of such product, package or service...

78 FR 41721 - New Standards to Enhance Package Visibility

Federal Register 2010, 2011, 2012, 2013, 2014

2013-07-11

... supporting electronic documentation including piece-level address or ZIP+4[supreg] Code information effective... package strategy relies on the availability of piece- level information provided through the widespread use of IMpb. IMpb can offer a number of benefits to mailers by providing piece- level visibility...

Teaching Science and Mathematics Subjects Using the Excel Spreadsheet Package

ERIC Educational Resources Information Center

Ibrahim, Dogan

2009-01-01

The teaching of scientific subjects usually require laboratories where students can put the theory they have learned into practice. Traditionally, electronic programmable calculators, dedicated software, or expensive software simulation packages, such as MATLAB have been used to simulate scientific experiments. Recently, spreadsheet programs have…

77 FR 18707 - USPS Package Intercept-New Product Offerings

Federal Register 2010, 2011, 2012, 2013, 2014

2012-03-28

... service that replaced the former recall of mail process. Plans were announced to implement new features.... Additionally, customers using the electronic process will have the option of adding selected extra services to... POSTAL SERVICE 39 CFR Part 111 USPS Package Intercept--New Product Offerings AGENCY: Postal...

Multilead, Vaporization-Cooled Soldering Heat Sink

NASA Technical Reports Server (NTRS)

Rice, John

1995-01-01

Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.

Ion resonances and ELF wave production by an electron beam injected into the ionosphere - ECHO 6

NASA Astrophysics Data System (ADS)

Winckler, J. R.; Steffen, J. E.; Malcolm, P. R.; Erickson, K. N.; Abe, Y.; Swanson, R. L.

1984-09-01

Two effects observed with electron antennas ejected from a sounding rocket launched into the ionosphere in March 1983 carrying electron beam guns are discussed. The sensor packages were ejected and travelled parallel to the vehicle trajectory. Electric potentials were measured between the single probes and a plasma diagnostic package while the gun injected electrons into the ionosphere in perpendicular and parallel 1 kHz directions. Signal pulses over the dc-1250 kHz range were detected. A kHz gun frequency caused a signal that decreased by two orders of magnitude between 45-90 m from the beam field line. However, the signal was detectable at 1 mV/m at 120 m, supporting earlier data that indicated that pulsed electron beams can cause ELF waves in space. Beam injection parallel to the magnetic field produced an 840 Hz resonance that could be quenched by activation of a transverse beam.

Application of Temperature-Controlled Thermal Atomization for Printing Electronics in Space

NASA Technical Reports Server (NTRS)

Wu, Chih-Hao; Thompson, Furman V.

2017-01-01

Additive Manufacturing (AM) is a technology that builds three dimensional objects by adding material layer-upon-layer throughout the fabrication process. The Electrical, Electronic and Electromechanical (EEE) parts packaging group at Marshall Space Flight Center (MSFC) is investigating how various AM and 3D printing processes can be adapted to the microgravity environment of space to enable on demand manufacturing of electronics. The current state-of-the art processes for accomplishing the task of printing electronics through non-contact, direct-write means rely heavily on the process of atomization of liquid inks into fine aerosols to be delivered ultimately to a machine's print head and through its nozzle. As a result of cumulative International Space Station (ISS) research into the behaviors of fluids in zero-gravity, our experience leads us to conclude that the direct adaptation of conventional atomization processes will likely fall short and alternative approaches will need to be explored. In this report, we investigate the development of an alternative approach to atomizing electronic materials by way of thermal atomization, to be used in place of conventional aerosol generation and delivery processes for printing electronics in space.

NREL in the News | Transportation Research | NREL

Science.gov Websites

Promises Power Electronics Innovation Wide bandgap (WBG) technology promises to dramatically increase performance, reduce cost, and improve reliability of electronics packaging in electric-drive vehicles and Department's new Manufacturing Innovation Institute for Next Generation Power Electronics to accelerate

Instrument Packages for the Cold, Dark, High Radiation Environments

NASA Technical Reports Server (NTRS)

Clark, P. E.; Millar, P. S.; Yeh, P. S.; Beamna, B.; Brigham, D.; Feng, S.

2011-01-01

We are developing a small cold temperature instrument package concept that integrates a cold temperature power system and radhard ultra low temperature ultra low power electronics components and power supplies now under development into a cold temperature surface operational version of a planetary surface instrument package. We are already in the process of developing a lower power lower tem-perature version for an instrument of mutual interest to SMD and ESMD to support the search for volatiles (the mass spectrometer VAPoR, Volatile Analysis by Pyrolysis of Regolith) both as a stand alone instrument and as part of an environmental monitoring package.

Polymer surface modification using UV treatment for attachment of natamycin and the potential applications for conventional food cling wrap (LDPE)

NASA Astrophysics Data System (ADS)

Shin, Joongmin; Liu, Xiaojing; Chikthimmah, Naveen; Lee, Youn Suk

2016-11-01

The purpose of this study was to develop an active non-migratory antifungal Low Density Polyethylene (LDPE) polymer for use in food packaged applications. The functional acrylic acid monomer was grafted on the LDPE film surface by photo-initiated graft polymerization using Ultra Violet light irradiation (from 0 to 5 min). Natamycin, an antifungal agent, was applied to the treated film to bind with the pendent functional groups and were evaluated its performance against mold and yeast. The grafted amounts were determined by gravimetric measurement and dye absorbance. Attenuated Total Reflectance/Fourier Transfer Infrared Spectroscopy, scanning electron microscopy, mechanical strength test was used to characterize film properties. The antifungal efficacy of the film was evaluated with Saccharomyces cerevisiae and Penicillium chrysogenum on growth media and fresh cut cantaloupe. The amounts of the grafted group were increased with the longer ultraviolet exposure time. The amount of the grafted natamycin on the treated film was up to 49.87 μg/cm2, and the film inhibited mycelium formation of P. chrysogenum spores by over 60%. Due to the thickness of the film (less than 12.25 μm), long time UV exposure decrease the film's mechanical strength. The application of such non-migratory active packaging film represents a promising approach to maintaining food quality with reduced additive.

Nanocomposites in food packaging applications and their risk assessment for health.

PubMed

Honarvar, Zohreh; Hadian, Zahra; Mashayekh, Morteza

2016-06-01

Nanotechnology has shown many advantages in different fields. As the uses of nanotechnology have progressed, it has been found to be a promising technology for the food packaging industry in the global market. It has proven capabilities that are valuable in packaging foods, including improved barriers; mechanical, thermal, and biodegradable properties; and applications in active and intelligent food packaging. Examples of the latter are anti-microbial agents and nanosensors, respectively. However, the use of nanocomposites in food packaging might be challenging due to the reduced particle size of nanomaterials and the fact that the chemical and physical characteristics of such tiny materials may be quite different from those of their macro-scale counterparts. In order to discuss the potential risks of nanoparticles for consumers, in addition to the quantification of data, a thorough investigation of their characteristics is required. Migration studies must be conducted to determine the amounts of nanomaterials released into the food matrices. In this article, different applications of nanocomposites in food packaging, migration issues, analyzing techniques, and the main concerns about their usage are discussed briefly.

Nanocomposites in food packaging applications and their risk assessment for health

PubMed Central

Honarvar, Zohreh; Hadian, Zahra; Mashayekh, Morteza

2016-01-01

Nanotechnology has shown many advantages in different fields. As the uses of nanotechnology have progressed, it has been found to be a promising technology for the food packaging industry in the global market. It has proven capabilities that are valuable in packaging foods, including improved barriers; mechanical, thermal, and biodegradable properties; and applications in active and intelligent food packaging. Examples of the latter are anti-microbial agents and nanosensors, respectively. However, the use of nanocomposites in food packaging might be challenging due to the reduced particle size of nanomaterials and the fact that the chemical and physical characteristics of such tiny materials may be quite different from those of their macro-scale counterparts. In order to discuss the potential risks of nanoparticles for consumers, in addition to the quantification of data, a thorough investigation of their characteristics is required. Migration studies must be conducted to determine the amounts of nanomaterials released into the food matrices. In this article, different applications of nanocomposites in food packaging, migration issues, analyzing techniques, and the main concerns about their usage are discussed briefly. PMID:27504168

Electronics for a Spectrometer

NASA Image and Video Library

2014-01-24

NASA has provided part of the electronics package for an instrument called the Double Focusing Mass Spectrometer, which is part of the Swiss-built Rosetta Orbiter Spectrometer for Ion and Neutral Analysis ROSINA instrument.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

NASA Astrophysics Data System (ADS)

Sokolovskij, R.; Liu, P.; van Zeijl, H. W.; Mimoun, B.; Zhang, G. Q.

2015-05-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies.

A proposal for an open source graphical environment for simulating x-ray optics

NASA Astrophysics Data System (ADS)

Sanchez del Rio, Manuel; Rebuffi, Luca; Demsar, Janez; Canestrari, Niccolo; Chubar, Oleg

2014-09-01

A new graphic environment to drive X-ray optics simulation packages such as SHADOW and SRW is proposed. The aim is to simulate a virtual experiment, including the description of the electron beam and simulate the emitted radiation, the optics, the scattering by the sample and radiation detection. Python is chosen as common interaction language. The ingredients of the new application, a glossary of variables for optical component, the selection of visualization tools, and the integration of all these components in a high level workflow environment built on Orange are presented.

Photocured epoxy/graphene nanocomposites with enhanced water vapor barrier properties

DOE Office of Scientific and Technical Information (OSTI.GOV)

Periolatto, M.; Spena, P. Russo; Sangermano, M.

A transparent, water vapor barrier film made of an epoxy resin and graphene oxide (GO) was synthesized by photopolymerization process. The epoxy/GO film with just 0.05 wt% GO gives a 93% WVTR reduction with respect to the pristine polymer, reaching barrier properties better than other polymer composites containing higher amounts of graphene. The excellent water vapor barrier is attributed to the good dispersion of GO in the polymer matrix. Moreover, GO significantly enhances the toughness and the damping capacity of the epoxy resins. The hybrid film can have potential applications in anticorrosive coatings, electronic devices, pharmaceuticals and food packaging.

Sustainable polymers from renewable resources

NASA Astrophysics Data System (ADS)

Zhu, Yunqing; Romain, Charles; Williams, Charlotte K.

2016-12-01

Renewable resources are used increasingly in the production of polymers. In particular, monomers such as carbon dioxide, terpenes, vegetable oils and carbohydrates can be used as feedstocks for the manufacture of a variety of sustainable materials and products, including elastomers, plastics, hydrogels, flexible electronics, resins, engineering polymers and composites. Efficient catalysis is required to produce monomers, to facilitate selective polymerizations and to enable recycling or upcycling of waste materials. There are opportunities to use such sustainable polymers in both high-value areas and in basic applications such as packaging. Life-cycle assessment can be used to quantify the environmental benefits of sustainable polymers.

Sustainable polymers from renewable resources.

PubMed

Zhu, Yunqing; Romain, Charles; Williams, Charlotte K

2016-12-14

Renewable resources are used increasingly in the production of polymers. In particular, monomers such as carbon dioxide, terpenes, vegetable oils and carbohydrates can be used as feedstocks for the manufacture of a variety of sustainable materials and products, including elastomers, plastics, hydrogels, flexible electronics, resins, engineering polymers and composites. Efficient catalysis is required to produce monomers, to facilitate selective polymerizations and to enable recycling or upcycling of waste materials. There are opportunities to use such sustainable polymers in both high-value areas and in basic applications such as packaging. Life-cycle assessment can be used to quantify the environmental benefits of sustainable polymers.

Adaptation of ion beam technology to microfabrication of solid state devices and transducers

NASA Technical Reports Server (NTRS)

Topich, J. A.

1978-01-01

A number of areas were investigated to determine the potential uses of ion beam techniques in the construction of solid state devices and transducers and the packaging of implantable electronics for biomedical applications. The five areas investigated during the past year were: (1) diode-like devices fabricated on textured silicon; (2) a photolithographic technique for patterning ion beam sputtered PVC (polyvinyl chloride); (3) use of sputtered Teflon as a protective coating for implantable pressure sensors; (4) the sputtering of Macor to seal implantable hybrid circuits; and (5) the use of sputtered Teflon to immobilize enzymes.

Photocured epoxy/graphene nanocomposites with enhanced water vapor barrier properties

NASA Astrophysics Data System (ADS)

Periolatto, M.; Sangermano, M.; Spena, P. Russo

2016-05-01

A transparent, water vapor barrier film made of an epoxy resin and graphene oxide (GO) was synthesized by photopolymerization process. The epoxy/GO film with just 0.05 wt% GO gives a 93% WVTR reduction with respect to the pristine polymer, reaching barrier properties better than other polymer composites containing higher amounts of graphene. The excellent water vapor barrier is attributed to the good dispersion of GO in the polymer matrix. Moreover, GO significantly enhances the toughness and the damping capacity of the epoxy resins. The hybrid film can have potential applications in anticorrosive coatings, electronic devices, pharmaceuticals and food packaging.

Effects of health-oriented descriptors on combustible cigarette and electronic cigarette packaging: an experiment among adult smokers in the United States.

PubMed

Sanders-Jackson, Ashley; Tan, Andy S L; Yie, Kyeungyeun

2017-10-05

Certain tobacco companies use health-oriented descriptors (eg, 100% organic) on product packaging and advertising of combustible cigarettes or electronic cigarettes (e-cigarettes) that create a 'health halo' around smoking and vaping. Previous observational research suggests that such language may be associated with more favourable attitudes and reduced risk perceptions toward these brands compared with others. This study aimed to determine the effects of health-oriented descriptors on smokers' attitude toward the brand, perception of packaging information, comparative harm versus other brands and intention to purchase either combustible cigarettes or e-cigarettes. US adult smokers were randomly assigned to view either a health-oriented language package ('100% organic,' 'all natural' or 'no additives'), traditional marketing language package ('fine quality,' 'premium blend' or '100% original') or a no-language package of a combustible cigarette brand (Study 1, n=405) or an e-cigarette brand (Study 2, n=396) in an experimental design. Study 1: Participants in the health-oriented condition reported more favourable perceptions toward the package information, lower comparative harm and higher intention to purchase combustible cigarettes versus the no language control. In addition, participants in the health-oriented condition reported more positive attitude toward the brand and lower comparative harm versus the traditional marketing condition. Study 2: Compared with the traditional marketing condition, participants in the health-oriented condition reported greater intention to purchase Absolute e-cigarettes. There were no significant differences in attitude toward the brand, perception of packaging information and comparative harm versus other brands across conditions. The effect of health-oriented language was significant for combustible cigarettesand e-cigarette packages. Policies to restrict health-oriented language on cigarette and e-cigarette packaging are recommended. © Article author(s) (or their employer(s) unless otherwise stated in the text of the article) 2017. All rights reserved. No commercial use is permitted unless otherwise expressly granted.

76 FR 29733 - Petition for Waiver From LG Electronics, Inc. and Granting of the Interim Waiver From Commercial...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-05-23

... for Waiver From LG Electronics, Inc. and Granting of the Interim Waiver From Commercial Package Air... LG Electronics, Inc. (LG). The petition for waiver (hereafter ``petition'') requests a waiver from... factors stated in the waivers that DOE granted to Mitsubishi Electric & Electronics USA, Inc. (Mitsubishi...

The Articulation of Secondary and Post-Secondary Vocational Education Programs. Workshop Products.

ERIC Educational Resources Information Center

Keene State Coll., NH.

As a result of the cooperative efforts in articulation by secondary/postsecondary instructor teams, six packages representing the occupational areas of child care, culinary arts, electronics, health occupations, power mechanics, and industrial welding were developed. Each package contains the following three components: a series of job titles…

Efficient Calculation of Exact Exchange Within the Quantum Espresso Software Package

NASA Astrophysics Data System (ADS)

Barnes, Taylor; Kurth, Thorsten; Carrier, Pierre; Wichmann, Nathan; Prendergast, David; Kent, Paul; Deslippe, Jack

Accurate simulation of condensed matter at the nanoscale requires careful treatment of the exchange interaction between electrons. In the context of plane-wave DFT, these interactions are typically represented through the use of approximate functionals. Greater accuracy can often be obtained through the use of functionals that incorporate some fraction of exact exchange; however, evaluation of the exact exchange potential is often prohibitively expensive. We present an improved algorithm for the parallel computation of exact exchange in Quantum Espresso, an open-source software package for plane-wave DFT simulation. Through the use of aggressive load balancing and on-the-fly transformation of internal data structures, our code exhibits speedups of approximately an order of magnitude for practical calculations. Additional optimizations are presented targeting the many-core Intel Xeon-Phi ``Knights Landing'' architecture, which largely powers NERSC's new Cori system. We demonstrate the successful application of the code to difficult problems, including simulation of water at a platinum interface and computation of the X-ray absorption spectra of transition metal oxides.

Cold Atmospheric-Pressure Plasmas Applied to Active Packaging of Fruits and Vegetables

NASA Astrophysics Data System (ADS)

Pedrow, Patrick; Fernandez, Sulmer; Pitts, Marvin

2008-10-01

Active packaging of fruits and vegetables uses films that absorb molecules from or contribute molecules to the produce. Applying uniform film to specific parts of a plant will enhance safe and economic adoption of expensive biofilms and biochemicals which would damage the plant or surrounding environment if misapplied. The pilot application will be to apply wax film to apples, replacing hot wax which is expensive and lowers the textural quality of the apple. The plasma zone will be obtained by increasing the voltage on an electrode structure until the electric field in the feed material (Argon + monomer) is sufficiently high to yield electron avalanches. The ``corona onset criterion'' is used to design the cold plasma reactor. The apple will be placed in a treatment chamber downstream from the activation zone. Key physical properties of the film will be measured. The deposition rate will be optimized in terms of economics and fruit surface quality for the purpose of determining if the technique is competitive in food processing plants.

Miniature thermal matches: from nanoheaters to reactive fractals

NASA Astrophysics Data System (ADS)

Rebholz, Claus; Emre Gunduz, Ibrahim; Ando, Teiichi; Doumanidis, Charalabos C.

2015-04-01

Fine thermal actuation by miniature heat sources enables applications from electronics fabrication to tumor cauterization. This paper introduces the concept of nanoheaters, i.e., reactive bimetallic material dots (0D), ignited electrically to exothermically release precise heat amounts where and when needed. This concept is extended to nanoheater wires (1D) and foils (2D), as well as bulk nanoheaters (3D) manufactured via ball milling and ultrasonic consolidation of nickel and aluminum powders. The fractal structure of such powders and consolidates, with self-similar, multiscale Apollonian or lamellar packaging, is discovered to hold the key for their ignition sensitivity: nanoscale structures ignite first, to produce enough heat and raise the temperature of submicron formations, which then ignite microscale regions and so on; while inert areas quench and arrest the self-propagating exothermic reaction. Therefore, such engineered fractal reactive heaters lend themselves to affordable, high-throughput manufacture and controllable, safe, efficient, supplyless in situ thermal release. This can be transformative for innovations from self-healing composites and self-heating packages to underwater construction and mining.

Regeneration of tert-butylhydroquinone by tea polyphenols.

PubMed

Guo, Yafang; Guo, Yahui; Xie, Yunfei; Cheng, Yuliang; Qian, He; Yao, Weirong

2017-05-01

To study the antioxidant capacity (AC) regeneration of tert-butylhydroquinone (TBHQ) by tea polyphenols (TPs), a separable system has been designed for its evaluation. The AC values of three natural food matrices (liquorice, oat, and ginger) and TBHQ regenerated by TPs were all higher than their controls, and similar to the initial values (p<0.05). The average regeneration efficiency (RE) value was 1.49 for these three natural food matrices, and 0.82 for TBHQ. Electron paramagnetic resonance spectroscopy analysis has revealed the synergistic effect of TBHQ and TPs, which arose from the regeneration of TBHQ by TPs. The RE value of TBHQ regeneration by TPs embedded in a gelatine membrane was 0.51. The results demonstrated that TPs showed a capacity for regenerating TBHQ, indicating a potential application in regenerative packaging, whereby one antioxidant would be added to the food matrix, with another one as the regenerator incorporated into the packaging material. Copyright © 2017 Elsevier Ltd. All rights reserved.

Numerical calculation of charge exchange cross sections for plasma diagnostics

NASA Astrophysics Data System (ADS)

Mendez, Luis

2016-09-01

The diagnostics of impurity density and temperature in the plasma core in tokamak plasmas is carried out by applying the charge exchange recombination spectroscopy (CXRS) technique, where a fast beam of H atoms collides with the plasma particles leading to electron capture reactions with the impurity ions. The diagnostics is based on the emission of the excited ions formed in the electron capture. The application of the CXRS requires the knowledge of accurate state-selective cross sections, which in general are not accessible experimentally, and the calculation of cross sections for the high n capture levels, required for the diagnostics in the intermediate energy domain of the probe beam, is particularly difficult. In this work, we present a lattice numerical method to solve the time dependent Schrödinger equation. The method is based on the GridTDSE package, it is applicable in the wide energy range 1 - 500 keV/u and can be used to assess the accuracy of previous calculations. The application of the method will be illustrated with calculations for collisions of multiply charged ions with H. Work partially supported by project ENE2014-52432-R (Secretaria de Estado de I+D+i, Spain).

Integrated digital printing of flexible circuits for wireless sensing (Conference Presentation)

NASA Astrophysics Data System (ADS)

Mei, Ping; Whiting, Gregory L.; Schwartz, David E.; Ng, Tse Nga; Krusor, Brent S.; Ready, Steve E.; Daniel, George; Veres, Janos; Street, Bob

2016-09-01

Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost. At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.

Entity- Version 1.0

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hart, Brian; Oppel, Fred; Rigdon, Brian

2012-09-13

This package contains classes that capture high-level aspects of characters and vehicles. Vehicles manage seats and riders. Vehicles and characters now can be configured to compose different behaviors and have certain capabilities, by adding them through xml data. These behaviors and capabilities are not included in this package, but instead are part of other packages such as mobility behavior, path planning, sight, sound. Entity is not dependent on these other packages. This package also contains the icons used for Umbra applications Dante Scenario Editor, Dante Tabletop and OpShed. This assertion includes a managed C++ wrapper code (EntityWrapper) to enable C#more » applications, such as Dante Scenario Editor, Dante Tabletop, and OpShed, to incorporate this library.« less

Development and Applications of Portable Biosensors.

PubMed

Srinivasan, Balaji; Tung, Steve

2015-08-01

The significance of microfluidics-based and microelectromechanical systems-based biosensors has been widely acknowledged, and many reviews have explored their potential applications in clinical diagnostics, personalized medicine, global health, drug discovery, food safety, and forensics. Because health care costs are increasing, there is an increasing need to remotely monitor the health condition of patients by point-of-care-testing. The demand for biosensors for detection of biological warfare agents has increased, and research is focused on ways of producing small portable devices that would allow fast, accurate, and on-site detection. In the past decade, the demand for rapid and accurate on-site detection of plant disease diagnosis has increased due to emerging pathogens with resistance to pesticides, increased human mobility, and regulations limiting the application of toxic chemicals to prevent spread of diseases. The portability of biosensors for on-site diagnosis is limited due to various issues, including sample preparation techniques, fluid-handling techniques, the limited lifetime of biological reagents, device packaging, integrating electronics for data collection/analysis, and the requirement of external accessories and power. Many microfluidic, electronic, and biological design strategies, such as handling liquids in biosensors without pumps/valves, the application of droplet-based microfluidics, paper-based microfluidic devices, and wireless networking capabilities for data transmission, are being explored. © 2015 Society for Laboratory Automation and Screening.

The development of a colour liquid crystal display spatial light modulator and applications in polychromatic optical data processing

NASA Astrophysics Data System (ADS)

Aiken, John Charles

The development of a colour Spatial Light Modulator (SLM) and its application to optical information processing is described. Whilst monochrome technology has been established for many years, this is not the case for colour where commercial systems are unavailable. A main aspect of this study is therefore, how the use of colour can add an additional dimension to optical information processing. A well established route to monochrome system development has been the use of (black and white) liquid crystal televisions (LCTV) as SLM, providing useful performance at a low-cost. This study is based on the unique use of a colour display removed from a LCTV and operated as a colour SLM. A significant development has been the replacement of the original TV electronics operating the display with enhanced drive electronics specially developed for this application. Through a computer interface colour images from a drawing package or video camera can now be readily displayed on the LCD as input to an optical system. A detailed evaluation of the colour LCD optical properties, indicates that the new drive electronics have considerably improved the operation of the display for use as a colour SLM. Applications are described employing the use of colour in Fourier plane filtering, image correlation and speckle metrology. The SLM (and optical system) developed demonstrates, how the addition of colour has greatly enhanced its capabilities to implement principles of optical data processing, conventionally performed monochromatically. The hybrid combination employed, combining colour optical data processing with electronic techniques has resulted in a capable development system. Further development of the system using current colour LCDs and the move towards a portable system, is considered in the study conclusion.

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

NASA Technical Reports Server (NTRS)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Polysaccharide-Based Membranes in Food Packaging Applications

PubMed Central

Ferreira, Ana R. V.; Alves, Vítor D.; Coelhoso, Isabel M.

2016-01-01

Plastic packaging is essential nowadays. However, the huge environmental problem caused by landfill disposal of non-biodegradable polymers in the end of life has to be minimized and preferentially eliminated. The solution may rely on the use of biopolymers, in particular polysaccharides. These macromolecules with film-forming properties are able to produce attracting biodegradable materials, possibly applicable in food packaging. Despite all advantages of using polysaccharides obtained from different sources, some drawbacks, mostly related to their low resistance to water, mechanical performance and price, have hindered their wider use and commercialization. Nevertheless, with increasing attention and research on this field, it has been possible to trace some strategies to overcome the problems and recognize solutions. This review summarizes some of the most used polysaccharides in food packaging applications. PMID:27089372

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

NASA Technical Reports Server (NTRS)

Shalkhauser, K. A.; Li, K.; Shih, Y. C.

1992-01-01

Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.