Next Generation Ceramic Substrate Fabricated at Room Temperature.

PubMed

Kim, Yuna; Ahn, Cheol-Woo; Choi, Jong-Jin; Ryu, Jungho; Kim, Jong-Woo; Yoon, Woon-Ha; Park, Dong-Soo; Yoon, Seog-Young; Ma, Byungjin; Hahn, Byung-Dong

2017-07-26

A ceramic substrate must not only have an excellent thermal performance but also be thin, since the electronic devices have to become thin and small in the electronics industry of the next generation. In this manuscript, a thin ceramic substrate (thickness: 30-70 µm) is reported for the next generation ceramic substrate. It is fabricated by a new process [granule spray in vacuum (GSV)] which is a room temperature process. For the thin ceramic substrates, AlN GSV films are deposited on Al substrates and their electric/thermal properties are compared to those of the commercial ceramic substrates. The thermal resistance is significantly reduced by using AlN GSV films instead of AlN bulk-ceramics in thermal management systems. It is due to the removal of a thermal interface material which has low thermal conductivity. In particular, the dielectric strengths of AlN GSV films are much higher than those of AlN bulk-ceramics which are commercialized, approximately 5 times. Therefore, it can be expected that this GSV film is a next generation substrate in thermal management systems for the high power application.

Land Breeze and Thermals: A Scale Threshold to Distinguish Their Effects

Treesearch

Yongqiang Liu

2005-01-01

Land breeze is a type of mesoscale circulation developed due to thermal forcing over a heterogeneous landscape. It can contribute to atmospheric dynamic and hydrologic processes through affecting heat and water fluxes on the land-atmosphere interface and generating shallow convective precipitation. If the scale of the landscape heterogeneity is smaller than a certain...

Measurement of interfacial thermal conductance in Lithium ion batteries

NASA Astrophysics Data System (ADS)

Gaitonde, Aalok; Nimmagadda, Amulya; Marconnet, Amy

2017-03-01

Increasing usage and recent accidents due to Lithium ion (Li-ion) batteries exploding or catching on fire has inspired research on the thermal management of these batteries. In cylindrical 18650 cells, heat generated during the charge/discharge cycle must dissipate to the surrounding through its metallic case due to the poor thermal conductivity of the jelly roll, which is spirally wound with many interfaces between electrodes and the polymeric separator. This work develops a technique to measure the thermal resistance across the case-separator interface, which ultimately limits heat transfer out of the jelly roll. Commercial 18650 batteries are discharged and opened using a battery disassembly tool, and the 25 μm thick separator and the 200 μm thick metallic case are harvested to make samples. A miniaturized version of the conventional reference bar method (ASTM astm:D5470)

Study of SiO{sub 2}/4H-SiC interface nitridation by post-oxidation annealing in pure nitrogen gas

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chanthaphan, Atthawut, E-mail: chanthaphan@asf.mls.eng.osaka-u.ac.jp; Hosoi, Takuji, E-mail: hosoi@mls.eng.osaka-u.ac.jp; Shimura, Takayoshi

An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semiconductor (MOS) devices was developed. We found that the high-temperature post-oxidation annealing (POA) in N{sub 2} ambient was beneficial to incorporate a sufficient amount of nitrogen atoms directly into thermal SiO{sub 2}/SiC interfaces. Although N{sub 2}-POA was ineffective for samples with thick thermal oxide layers, interface nitridation using N{sub 2}-POA was achieved under certain conditions, i.e., thin SiO{sub 2} layers (< 15 nm) and high annealing temperatures (>1350°C). Electrical characterizations of SiC-MOS capacitors treated with high-temperature N{sub 2}-POA revealed the same evidence of slow trap passivation and fast trapmore » generation that occurred in NO-treated devices fabricated with the optimized nitridation conditions.« less

Thermal management systems and methods

DOEpatents

Gering, Kevin L.; Haefner, Daryl R.

2006-12-12

A thermal management system for a vehicle includes a heat exchanger having a thermal energy storage material provided therein, a first coolant loop thermally coupled to an electrochemical storage device located within the first coolant loop and to the heat exchanger, and a second coolant loop thermally coupled to the heat exchanger. The first and second coolant loops are configured to carry distinct thermal energy transfer media. The thermal management system also includes an interface configured to facilitate transfer of heat generated by an internal combustion engine to the heat exchanger via the second coolant loop in order to selectively deliver the heat to the electrochemical storage device. Thermal management methods are also provided.

Effect of asymmetric concentration profile on thermal conductivity in Ge/SiGe superlattices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hahn, Konstanze R., E-mail: konstanze.hahn@dsf.unica.it; Cecchi, Stefano; Colombo, Luciano

2016-05-16

The effect of the chemical composition in Si/Ge-based superlattices on their thermal conductivity has been investigated using molecular dynamics simulations. Simulation cells of Ge/SiGe superlattices have been generated with different concentration profiles such that the Si concentration follows a step-like, a tooth-saw, a Gaussian, and a gamma-type function in direction of the heat flux. The step-like and tooth-saw profiles mimic ideally sharp interfaces, whereas Gaussian and gamma-type profiles are smooth functions imitating atomic diffusion at the interface as obtained experimentally. Symmetry effects have been investigated comparing the symmetric profiles of the step-like and the Gaussian function to the asymmetric profilesmore » of the tooth-saw and the gamma-type function. At longer sample length and similar degree of interdiffusion, the thermal conductivity is found to be lower in asymmetric profiles. Furthermore, it is found that with smooth concentration profiles where atomic diffusion at the interface takes place the thermal conductivity is higher compared to systems with atomically sharp concentration profiles.« less

Anomalous Seebeck coefficient observed in silicon nanowire micro thermoelectric generator

NASA Astrophysics Data System (ADS)

Hashimoto, S.; Asada, S.; Xu, T.; Oba, S.; Himeda, Y.; Yamato, R.; Matsukawa, T.; Matsuki, T.; Watanabe, T.

2017-07-01

We have found experimentally an anomalous thermoelectric characteristic of an n-type Si nanowire micro thermoelectric generator (μTEG). The μTEG is fabricated on a silicon-on-insulator wafer by electron beam lithography and dry etching, and its surface is covered with a thermally grown silicon dioxide film. The observed thermoelectric current is opposite to what is expected from the Seebeck coefficient of n-type Si. The result is understandable by considering a potential barrier in the nanowire. Upon the application of the temperature gradient across the nanowire, the potential barrier impedes the diffusion of thermally activated majority carriers into the nanowire, and it rather stimulates the injection of thermally generated minority carriers. The most plausible origin of the potential barrier is negative charges trapped at the interface between the Si nanowire and the oxide film. We practically confirmed that the normal Seebeck coefficient of the n-type Si nanowire is recovered after the hydrogen forming gas annealing. This implies that the interface traps are diminished by the hydrogen termination of bonding defects. The present results show the importance of the surface inactivation treatment of μTEGs to suppress the potential barrier and unfavorable contribution of minority carriers.

Thermal transport in lithium ion batteries: An experimental investigation of interfaces and granular materials

NASA Astrophysics Data System (ADS)

Gaitonde, Aalok Jaisheela Uday

Increasing usage and recent accidents due to lithium-ion (Li-ion) batteries exploding or catching on fire has inspired research on the characterization and thermal management of these batteries. In cylindrical 18650 cells, heat generated during the battery's charge/discharge cycle is poorly dissipated to the surrounding through its metallic case due to the poor thermal conductivity of the jelly roll, which is spirally wound with many interfaces between electrodes and the polymeric separator. This work presents a technique to measure the thermal conduction across the metallic case-plastic separator interface, which ultimately limits heat transfer out of the jelly roll. The polymeric separator and metallic case are harvested from discharged commercial 18650 battery cells for thermal testing. A miniaturized version of the reference bar method enables measurements of the interface resistance between the case and the separator by establishing a temperature gradient across a multilayer stack consisting of two reference layers of known thermal conductivity and the case-separator sample. The case-separator interfacial conductance is reported for a range of case temperatures and interface pressures. The mean thermal conductance across the case-separator interface is 670 +/- 275 W/(m2K) and no significant temperature or pressure dependence is observed. The effective thermal conductivity of the battery stack is measured to be 0.27 W/m/K and 0.32 W/m/K in linear and radial configurations, respectively. Many techniques for fabricating battery electrodes involve coating particles of the active materials on metallic current collectors. The impact of mechanical shearing on the resultant thermal properties of these packed particle beds during the fabrication process has not yet been studied. Thus, the final portion of this thesis designs and validates a measurement system to measure the effects of mechanical shearing on the thermal conductivity of packed granular beds. This system simultaneously shears the sample while applying a temperature gradient across the particle bed, enabling thermal conductivity measurements using a radial equivalent of the conventional reference bar method. Results of this research, which includes characterization of thermal conductance across the rate limiting separator-case interface, will help improve the design and reliability of lithium ion batteries. Cells of larger dimension and capacity could also be achieved by the improved understanding of thermal transport across the microscopic electrode stack. Better analytic models of the thermal response of the batteries could be constructed, by taking into account the interfacial conductance and thermal conductivity of the electrodes measured in this work. This is of particular importance in the current circumstances, where accidents and safety issues related to lithium ion batteries are on the increase.

Methods of forming thermal management systems and thermal management methods

DOEpatents

Gering, Kevin L.; Haefner, Daryl R.

2012-06-05

A thermal management system for a vehicle includes a heat exchanger having a thermal energy storage material provided therein, a first coolant loop thermally coupled to an electrochemical storage device located within the first coolant loop and to the heat exchanger, and a second coolant loop thermally coupled to the heat exchanger. The first and second coolant loops are configured to carry distinct thermal energy transfer media. The thermal management system also includes an interface configured to facilitate transfer of heat generated by an internal combustion engine to the heat exchanger via the second coolant loop in order to selectively deliver the heat to the electrochemical storage device. Thermal management methods are also provided.

Measurements of the effects of thermal contact resistance on steady state heat transfer in phosphoric-acid fuel cell stack

NASA Technical Reports Server (NTRS)

Abdul-Aziz, Ali; Alkasab, Kalil A.

1991-01-01

The influence of the thermal contact resistance on the heat transfer between the electrode plates, and the cooling system plate in a phosphoric-acid fuel-cell stack was experimentally investigated. The investigation was conducted using a set-up that simulates the operating conditions prevailing in a phosphoric acid fuel-cell stack. The fuel-cell cooling system utilized three types of coolants, water, engine oil, and air, to remove excess heat generated in the cell electrode and to maintain a reasonably uniform temperature distribution in the electrode plate. The thermal contact resistance was measured as a function of pressure at the interface between the electrode plate and the cooling system plate. The interface pressure range was from 0 kPa to 3448 kPa, while the Reynolds number for the cooling limits varied from 15 to 79 for oil, 1165 to 6165 for water, and 700 to 6864 for air. Results showed that increasing the interface pressure resulted in a higher heat transfer coefficient.

Effect of the interface on the mechanical properties and thermal conductivity of bismuth telluride films

NASA Astrophysics Data System (ADS)

Lai, Tang-Yu; Wang, Kuan-Yu; Fang, Te-Hua; Huang, Chao-Chun

2018-02-01

Bismuth telluride (Bi2Te3) is a type of thermoelectric material used for energy generation that does not cause pollution. Increasing the thermoelectric conversion efficiency (ZT) is one of the most important steps in the development of thermoelectric components. In this study, we use molecular dynamics to investigate the mechanical properties and thermal conductivity of quintuple layers of Bi2Te3 nanofilms with different atomic arrangements at the interface and study the effects of varying layers, angles, and grain boundaries. The results indicate that the Bi2Te3 nanofilm perfect substrate has the ideal Young’s modulus and thermal conductivity, and the maximum yield stress is observed for a thickness of ∼90 Å. As the interface changed, the structural disorder of atomic arrangement affected the mechanical properties; moreover, the phonons encounter lattice disordered atomic region will produce scattering reduce heat conduction. The results of this investigation are helpful for the application of Bi2Te3 nanofilms as thermoelectric materials.

Molecular dynamics study of interfacial thermal transport between silicene and substrates.

PubMed

Zhang, Jingchao; Hong, Yang; Tong, Zhen; Xiao, Zhihuai; Bao, Hua; Yue, Yanan

2015-10-07

In this work, the interfacial thermal transport across silicene and various substrates, i.e., crystalline silicon (c-Si), amorphous silicon (a-Si), crystalline silica (c-SiO2) and amorphous silica (a-SiO2) are explored by classical molecular dynamics (MD) simulations. A transient pulsed heating technique is applied in this work to characterize the interfacial thermal resistance in all hybrid systems. It is reported that the interfacial thermal resistances between silicene and all substrates decrease nearly 40% with temperature from 100 K to 400 K, which is due to the enhanced phonon couplings from the anharmonicity effect. Analysis of phonon power spectra of all systems is performed to interpret simulation results. Contradictory to the traditional thought that amorphous structures tend to have poor thermal transport capabilities due to the disordered atomic configurations, it is calculated that amorphous silicon and silica substrates facilitate the interfacial thermal transport compared with their crystalline structures. Besides, the coupling effect from substrates can improve the interface thermal transport up to 43.5% for coupling strengths χ from 1.0 to 2.0. Our results provide fundamental knowledge and rational guidelines for the design and development of the next-generation silicene-based nanoelectronics and thermal interface materials.

A thermal control approach for a solar electric propulsion thrust subsystem

NASA Technical Reports Server (NTRS)

Maloy, J. E.; Oglebay, J. C.

1979-01-01

A thrust subsystem thermal control design is defined for a Solar Electric Propulsion System (SEPS) proposed for the comet Halley Flyby/comet Tempel 2 rendezvous mission. A 114 node analytic model, developed and coded on the systems improved numerical differencing analyzer program, was employed. A description of the resulting thrust subsystem thermal design is presented as well as a description of the analytic model and comparisons of the predicted temperature profiles for various SEPS thermal configurations that were generated using this model. It was concluded that: (1) a BIMOD engine system thermal design can be autonomous; (2) an independent thrust subsystem thermal design is feasible; (3) the interface module electronics temperatures can be controlled by a passive radiator and supplementary heaters; (4) maintaining heat pipes above the freezing point would require an additional 322 watts of supplementary heating power for the situation where no thrusters are operating; (5) insulation is required around the power processors, and between the interface module and the avionics module, as well as in those areas which may be subjected to solar heating; and (6) insulation behind the heat pipe radiators is not necessary.

Heat transfer analysis of the Bridgman-Stockbarger configuration for crystal growth. Part 1: Analytical treatment of the axial temperature distribution

NASA Technical Reports Server (NTRS)

Jasinski, T. J.; Rohsenow, W. M.; Witt, A. F.

1982-01-01

All first order effects on the axial temperature distribution in a solidifying charge in a Bridgman-Stockbarger configuration for crystal growth are analyzed on the basis of a one dimensional model whose validity can be verified through comparison with published finite difference ana;uses of two dimensional models. The model presented includes an insulated region between axially aligned heat pipes and considers the effects of charge diameter, charge motion, thickness, and thermal conductivity of a confining crucible, thermal conductivity change at the crystal-melt interface, generation of latent heat at the interface, and finite charge length. Results are primarily given in analytical form and can be used without recourse to computer work for both improve furnace design and optimization of growth conditions in a given thermal configuration.

Radiation Hardened Silicon-on-Insulator Structures with N+ Ion Modified Buried SiO2 Layer

NASA Astrophysics Data System (ADS)

Tyschenko, I. E.; Popov, V. P.

2009-12-01

Radiation-resistant silicon-on-insulator structures were produced by N+ ion implantation into thermally grown SiO2 film and subsequent hydrogen transfer of the Si layer to the nitrogen-implanted substrate under conditions of vacuum wafer bonding. Accumulation of the carriers in the buried SiO2 was investigated as a function of fluence of nitrogen ions in the range (1-6)×1015 cm2 and as a function of total radiation dose ranging from 104 to 107 rad (Si). It was found that the charge generated near the nitrided bonding interface was reduced by a factor of four compared to the thermal SiO2/Si interface.

Evaluation of used fuel disposition in clay-bearing rock

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jove-Colon, Carlos F.; Hammond, Glenn Edward; Kuhlman, Kristopher L.

The R&D program from the DOE Used Fuel Disposition Campaign (UFDC) has documented key advances in coupled Thermal-Hydrological-Mechanical-Chemical (THMC) modeling of clay to simulate its complex dynamic behavior in response to thermal and hydrochemical feedbacks. These efforts have been harnessed to assess the isolation performance of heat-generating nuclear waste in a deep geological repository in clay/shale/argillaceous rock formations. This report describes the ongoing disposal R&D efforts on the advancement and refinement of coupled THMC process models, hydrothermal experiments on barrier clay interactions, used fuel and canister material degradation, thermodynamic database development, and reactive transport modeling of the near-field under non-isothermalmore » conditions. These play an important role to the evaluation of sacrificial zones as part of the EBS exposure to thermally-driven chemical and transport processes. Thermal inducement of chemical interactions at EBS domains enhances mineral dissolution/precipitation but also generates mineralogical changes that result in mineral H2O uptake/removal (hydration/dehydration reactions). These processes can result in volume changes that can affect the interface / bulk phase porosities and the mechanical (stress) state of the bentonite barrier. Characterization studies on bentonite barrier samples from the FEBEX-DP international activity have provided important insight on clay barrier microstructures (e.g., microcracks) and interactions at EBS interfaces. Enhancements to the used fuel degradation model outlines the need to include the effects of canister corrosion due the strong influence of H2 generation on the source term.« less

Thermal-hydraulic interfacing code modules for CANDU reactors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, W.S.; Gold, M.; Sills, H.

1997-07-01

The approach for CANDU reactor safety analysis in Ontario Hydro Nuclear (OHN) and Atomic Energy of Canada Limited (AECL) is presented. Reflecting the unique characteristics of CANDU reactors, the procedure of coupling the thermal-hydraulics, reactor physics and fuel channel/element codes in the safety analysis is described. The experience generated in the Canadian nuclear industry may be useful to other types of reactors in the areas of reactor safety analysis.

Graphene-enhanced thermal interface materials for heat removal from photovoltaic solar cells

NASA Astrophysics Data System (ADS)

Saadah, M.; Gamalath, D.; Hernandez, E.; Balandin, A. A.

2016-09-01

The increase in the temperature of photovoltaic (PV) solar cells affects negatively their power conversion efficiency and decreases their lifetime. The negative effects are particularly pronounced in concentrator solar cells. Therefore, it is crucial to limit the PV cell temperature by effectively removing the excess heat. Conventional thermal phase change materials (PCMs) and thermal interface materials (TIMs) do not possess the thermal conductivity values sufficient for thermal management of the next generation of PV cells. In this paper, we report the results of investigation of the increased efficiency of PV cells with the use of graphene-enhanced TIMs. Graphene reveals the highest values of the intrinsic thermal conductivity. It was also shown that the thermal conductivity of composites can be increased via utilization of graphene fillers. We prepared TIMs with up to 6% of graphene designed specifically for PV cell application. The solar cells were tested using the solar simulation module. It was found that the drop in the output voltage of the solar panel under two-sun concentrated illumination can be reduced from 19% to 6% when grapheneenhanced TIMs are used. The proposed method can recover up to 75% of the power loss in solar cells.

Effect of thermal interface on heat flow in carbon nanofiber composites.

PubMed

Gardea, F; Naraghi, M; Lagoudas, D

2014-01-22

The thermal transport process in carbon nanofiber (CNF)/epoxy composites is addressed through combined micromechanics and finite element modeling, guided by experiments. The heat exchange between CNF constituents and matrix is studied by explicitly accounting for interface thermal resistance between the CNFs and the epoxy matrix. The effects of nanofiber orientation and discontinuity on heat flow and thermal conductivity of nanocomposites are investigated through simulation of the laser flash experiment technique and Fourier's model of heat conduction. Our results indicate that when continuous CNFs are misoriented with respect to the average temperature gradient, the presence of interfacial resistance does not affect the thermal conductivity of the nanocomposites, as most of the heat flow will be through CNFs; however, interface thermal resistance can significantly alter the patterns of heat flow within the nanocomposite. It was found that very high interface resistance leads to heat entrapment at the interface near to the heat source, which can promote interface thermal degradation. The magnitude of heat entrapment, quantified via the peak transient temperature rise at the interface, in the case of high thermal resistance interfaces becomes an order of magnitude more intense as compared to the case of low thermal resistance interfaces. Moreover, high interface thermal resistance in the case of discontinuous fibers leads to a nearly complete thermal isolation of the fibers from the matrix, which will marginalize the contribution of the CNF thermal conductivity to the heat transfer in the composite.

Degradation Characterization of Thermal Interface Greases

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas J; Major, Joshua; Paret, Paul P

Thermal interface materials (TIMs) are used in power electronics packaging to minimize thermal resistance between the heat generating component and the heat sink. Thermal greases are one such class. The conformability and thin bond line thickness (BLT) of these TIMs can potentially provide low thermal resistance throughout the operation lifetime of a component. However, their performance degrades over time due to pump-out and dry-out during thermal and power cycling. The reliability performance of greases through operational cycling needs to be quantified to develop new materials with superior properties. NREL, in collaboration with DuPont, has performed thermal and reliability characterization ofmore » several commercially available thermal greases. Initial bulk and contact thermal resistance of grease samples were measured, and then the thermal degradation that occurred due to pump-out and dry-out during temperature cycling was monitored. The thermal resistances of five different grease materials were evaluated using NREL's steady-state thermal resistance tester based on the ASTM test method D5470. Greases were then applied, utilizing a 2.5 cm x 2.5 cm stencil, between invar and aluminum plates to compare the thermomechanical performance of the materials in a representative test fixture. Scanning Acoustic microscopy, thermal, and compositional analyses were performed periodically during thermal cycling from -40 degrees Celcius to 125 degrees Celcius. Completion of this characterization has allowed for a comprehensive evaluation of thermal greases both for their initial bulk and contact thermal performance, as well as their degradation mechanisms under accelerated thermal cycling conditions.« less

Degradation Characterization of Thermal Interface Greases: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas J; Major, Joshua; Paret, Paul P

Thermal interface materials (TIMs) are used in power electronics packaging to minimize thermal resistance between the heat generating component and the heat sink. Thermal greases are one such class. The conformability and thin bond line thickness (BLT) of these TIMs can potentially provide low thermal resistance throughout the operation lifetime of a component. However, their performance degrades over time due to pump-out and dry-out during thermal and power cycling. The reliability performance of greases through operational cycling needs to be quantified to develop new materials with superior properties. NREL, in collaboration with DuPont, has performed thermal and reliability characterization ofmore » several commercially available thermal greases. Initial bulk and contact thermal resistance of grease samples were measured, and then the thermal degradation that occurred due to pump-out and dry-out during temperature cycling was monitored. The thermal resistances of five different grease materials were evaluated using NREL's steady-state thermal resistance tester based on the ASTM test method D5470. Greases were then applied, utilizing a 2.5 cm x 2.5 cm stencil, between invar and aluminum plates to compare the thermomechanical performance of the materials in a representative test fixture. Scanning Acoustic microscopy, thermal, and compositional analyses were performed periodically during thermal cycling from -40 degrees Celcius to 125 degrees Celcius. Completion of this characterization has allowed for a comprehensive evaluation of thermal greases both for their initial bulk and contact thermal performance, as well as their degradation mechanisms under accelerated thermal cycling conditions.« less

Degradation Characterization of Thermal Interface Greases

DOE Office of Scientific and Technical Information (OSTI.GOV)

Major, Joshua; Narumanchi, Sreekant V; Paret, Paul P

Thermal interface materials (TIMs) are used in power electronics packaging to minimize thermal resistance between the heat generating component and the heat sink. Thermal greases are one such class. The conformability and thin bond line thickness (BLT) of these TIMs can potentially provide low thermal resistance throughout the operation lifetime of a component. However, their performance degrades over time due to pump-out and dry-out during thermal and power cycling. The reliability performance of greases through operational cycling needs to be quantified to develop new materials with superior properties. NREL, in collaboration with DuPont, has performed thermal and reliability characterization ofmore » several commercially available thermal greases. Initial bulk and contact thermal resistance of grease samples were measured, and then the thermal degradation that occurred due to pump-out and dry-out during temperature cycling was monitored. The thermal resistances of five different grease materials were evaluated using NREL's steady-state thermal resistance tester based on the ASTM test method D5470. Greases were then applied, utilizing a 2.5 cm x 2.5 cm stencil, between invar and aluminum plates to compare the thermomechanical performance of the materials in a representative test fixture. Scanning Acoustic microscopy, thermal, and compositional analyses were performed periodically during thermal cycling from -40 degrees C to 125 degrees C. Completion of this characterization has allowed for a comprehensive evaluation of thermal greases both for their initial bulk and contact thermal performance, as well as their degradation mechanisms under accelerated thermal cycling conditions.« less

Thermal Analysis of Step 2 GPHS for Next Generation Radioisotope Power Source Missions

NASA Astrophysics Data System (ADS)

Pantano, David R.; Hill, Dennis H.

2005-02-01

The Step 2 General Purpose Heat Source (GPHS) is a slightly larger and more robust version of the heritage GPHS modules flown on previous Radioisotope Thermoelectric Generator (RTG) missions like Galileo, Ulysses, and Cassini. The Step 2 GPHS is to be used in future small radioisotope power sources, such as the Stirling Radioisotope Generator (SRG110) and the Multi-Mission Radioisotope Thermoelectric Generator (MMRTG). New features include an additional central web of Fine Weave Pierced Fabric (FWPF) graphite in the aeroshell between the two Graphite Impact Shells (GIS) to improve accidental reentry and impact survivability and an additional 0.1-inch of thickness to the aeroshell broad faces to improve ablation protection. This paper details the creation of the thermal model using Thermal Desktop and AutoCAD interfaces and provides comparisons of the model to results of previous thermal analysis models of the heritage GPHS. The results of the analysis show an anticipated decrease in total thermal gradient from the aeroshell to the iridium clads compared to the heritage results. In addition, the Step 2 thermal model is investigated under typical SRG110 boundary conditions, with cover gas and gravity environments included where applicable, to provide preliminary guidance for design of the generator. Results show that the temperatures of the components inside the GPHS remain within accepted design limits during all envisioned mission phases.

High temperature solar thermal receiver

NASA Technical Reports Server (NTRS)

1979-01-01

A design concept for a high temperature solar thermal receiver to operate at 3 atmospheres pressure and 2500 F outlet was developed. The performance and complexity of windowed matrix, tube-header, and extended surface receivers were evaluated. The windowed matrix receiver proved to offer substantial cost and performance benefits. An efficient and cost effective hardware design was evaluated for a receiver which can be readily interfaced to fuel and chemical processes or to heat engines for power generation.

Optimized Characterization of Thermoelectric Generators for Automotive Application

NASA Astrophysics Data System (ADS)

Tatarinov, Dimitri; Wallig, Daniel; Bastian, Georg

2012-06-01

New developments in the field of thermoelectric materials bring the prospect of consumer devices for recovery of some of the waste heat from internal combustion engines closer to reality. Efficiency improvements are expected due to the development of high-temperature thermoelectric generators (TEG). In contrast to already established radioisotope thermoelectric generators, the temperature difference in automotive systems is not constant, and this imposes a set of specific requirements on the TEG system components. In particular, the behavior of the TEGs and interface materials used to link the heat flow from the heat source through the TEG to the heat sink must be examined. Due to the usage patterns of automobiles, the TEG will be subject to cyclic thermal loads, which leads to module degradation. Additionally, the automotive TEG will be exposed to an inhomogeneous temperature distribution, leading to inhomogeneous mechanical loads and reduced system efficiency. Therefore, a characterization rig is required to allow determination of the electrical, thermal, and mechanical properties of such high-temperature TEG systems. This paper describes a measurement setup using controlled adjustment of cold-side and warm-side temperatures as well as controlled feed-in of electrical power for evaluation of TEGs for application in vehicles with combustion engines. The temperature profile in the setup can be varied to simulate any vehicle usage pattern, such as the European standard driving cycle, allowing the power yield of the TEGs to be evaluated for the chosen cycle. The spatially resolved temperature distribution of a TEG system can be examined by thermal imaging. Hotspots or cracks on thermocouples of the TEGs and the thermal resistance of thermal interface materials can also be examined using this technology. The construction of the setup is briefly explained, followed by detailed discussion of the experimental results.

Scaled-Up Production and Transport Applications of Graphitic Carbon Nanomaterials

NASA Astrophysics Data System (ADS)

Saviers, Kimberly R.

Graphitic carbon nanomaterials enhance the performance of engineered systems for energy harvesting and storage. However, commercial availability remains largely cost-prohibitive due to technical barriers to mass production. This thesis examines both the scaled-up production and energy transport applications of graphitic materials. Cost driven-production of graphitic petals is developed, carbon nanotube array thermal interface materials enhance waste heat energy harvesting, and microsupercapacitors are visually examined using a new electroreflectance measurement method. Graphitic materials have previously been synthesized using batch-style processing methods with small sample sizes, limiting their commercial viability. In order to increase production throughput, a roll-to-roll radio-frequency plasma chemical vapor deposition method is employed to continuously deposit graphitic petals on carbon fiber tow. In consideration of a full production framework, efficient and informative characterization methods in the form of electrical resistance and electrochemical capacitance are highlighted. To co-optimize the functional characteristics of the material, the processing conditions are comprehensively varied using a data-driven predictive design of experiments method. Repeatable and reliable production of graphitic materials will enable a host of creative graphene-based devices to emerge into the marketplace. Two such applications are discussed in the remaining chapters. Waste heat is most efficiently harvested at high temperatures, such as vehicle exhaust systems near 600°C. However, the resistance to heat flux at the interfaces between the harvesting device and its surroundings is detrimental to the system-level performance. To study the performance of thermal interface materials up to 700°C, a reference bar measurement method was designed. Design considerations are discussed and compared to past implementations, particularly regarding radiation heat flux and thermal expansion at these elevated temperatures. The microscale roughness of the contacting measurement surface is fully characterized, as it fundamentally affects the resulting thermal interface resistance. This comprehensive method for determining thermal interface resistance at high temperatures includes the physical equipment, data acquisition system, and data analysis method. Thermomechanical evaluation of carbon nanotube arrays up to 700°C has shown that the arrays provide mechanical flexibility to accommodate thermal expansion in a thermomechanically mismatched interface. To demonstrate the application of the arrays for improving energy generation, they were evaluated in conjunction with a thermoelectric module. The system-level efficiency increases significantly when a carbon nanotube array is applied to the hot side of the thermoelectric module. Additional materials characterization suggests the presence of a strong thermal connection between the carbon nanotubes and their catalyst layers, due to covalent bonding between them. In another application of harvesting waste heat, the carbon nanotube arrays increase the performance of a thermo-magnetically actuated shuttle device for solar photovoltaic cells due to decreased thermal interface resistance. Vertically-oriented graphitic petals have previously enhanced supercapacitor power density. Here, a spatiotemporal characterization method is developed and utilized to study ageing phenomena in microsupercapacitor electrodes. The electroreflectance method captures images of charge accumulation in the electrodes at varying states during each charge-discharge cycle. The method was exploited by imaging each an ideal device and a device with defects over an extended period of over four million cycles. The charge accumulation patterns over the ageing period relate to the physical transport behavior. During a single discharge cycle, one may visually observe the electrons drifting out of the electrode. Overall, the investigations herein determine the following. Continuous production of graphitic petals is possible and is optimized by considering the effect of plasma conditions on the resulting functional performance of the material. Thermal interface resistance may be measured at high temperatures in order to understand the viability of interface materials for energy harvesting applications. Carbon nanotube array thermal interface materials lead to increased energy generation from thermoelectric modules. Spatial electroreflectance measurements of microsupercapacitors lead to observation of decreased physical wetting between the electrode and electrolyte, impacting device performance. Looking forward, creative application of graphitic carbon nanomaterials, coupled with cost-driven production capability, will launch them into the commercial marketplace.

Thermal structure and geodynamics of subduction zones

NASA Astrophysics Data System (ADS)

Wada, Ikuko

The thermal structure of subduction zones depends on the age-controlled thermal state of the subducting slab and mantle wedge flow. Observations indicate that the shallow part of the forearc mantle wedge is stagnant and the slab-mantle interface is weakened. In this dissertation, the role of the interface strength in controlling mantle wedge flow, thermal structure, and a wide range of subduction zone processes is investigated through two-dimensional finite-element modelling and a global synthesis of geological and geophysical observations. The model reveals that the strong temperature-dependence of the mantle strength always results in full slab-mantle decoupling along the weakened part of the interface and hence complete stagnation of the overlying mantle. The interface immediately downdip of the zone of decoupling is fully coupled, and the overlying mantle is driven to flow at a rate compatible with the subduction rate. The sharpness of the transition from decoupling to coupling depends on the rheology assumed and increases with the nonlinearity of the flow system. This bimodal behaviour of the wedge flow gives rise to a strong thermal contrast between the cold stagnant and hot flowing parts of the mantle wedge. The maximum depth of decoupling (MDD) thus dictates the thermal regime of the forearc. Observed surface heat flow patterns and petrologically and geochemically estimated mantle wedge temperatures beneath the volcanic arc require an MDD of 70--80 km in most, if not all, subduction zones regardless of their thermal regime of the slab. The common MDD of 70--80 km explains the observed systematic variations of the petrologic, seismological, and volcanic processes with the thermal state of the slab and thus explains the rich diversity of subduction zones in a unified fashion. Models for warm-slab subduction zones such as Cascadia and Nankai predict shallow dehydration of the slab beneath the cold stagnant part of the mantle wedge, which provides ample fluid for mantle wedge serpentinization in the forearc but little fluid for melt generation beneath the arc. In contrast, models for colder-slab subduction zones such as NE Japan and Kamchatka predict deeper dehydration, which provides greater fluid supply for melt generation beneath the arc and allows deeper occurrence of intraslab earthquakes but less fluid for forearc mantle wedge serpentinization. The common MDD also explains the intriguing uniform configuration of subduction zones, that is, the volcanic arc always tends to be situated where the slab is at about 100 km depth. The sudden onset of mantle wedge flow downdip of the common MDD overshadows the thermal effect of the slab, and the resultant thermal field and slab dehydration control the location of the volcanic arc. The recognition of the fundamental importance of the MDD has important implications to the study of geodynamics and earthquake hazard in subduction zones.

Compact vehicle drive module having improved thermal control

DOEpatents

Meyer, Andreas A.; Radosevich, Lawrence D.; Beihoff, Bruce C.; Kehl, Dennis L.; Kannenberg, Daniel G.

2006-01-03

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Estimation of Thermoelectric Generator Performance by Finite Element Modeling

NASA Astrophysics Data System (ADS)

Ziolkowski, P.; Poinas, P.; Leszczynski, J.; Karpinski, G.; Müller, E.

2010-09-01

Prediction of thermoelectric performance parameters by numerical methods is an inherent part of thermoelectric generator (TEG) development and allows for time- and cost-saving assessment of material combinations and variations of crucial design parameters (e.g., shape, pellet length, and thermal coupling). Considering the complexity of a TEG system and its numerous affecting factors, the clarity and the flexibility of a mathematical treatment comes to the fore. Comfortable tools are provided by commercial finite element modeling (FEM) software offering powerful geometry interfaces, mesh generators, solvers, and postprocessing options. We describe the level of development and the simulation results of a three dimensional (3D) TEG FEM. Using ANSYS 11.0, we implemented and simulated a TEG module geometry under various conditions. Comparative analytical one dimensional (1D) results and a direct comparison with inhouse-developed TEG simulation software show the consistency of results. Several pellet aspect ratios and contact property configurations (thermal/electrical interface resistance) were evaluated for their impact on the TEG performance as well as parasitic effects such as convection, radiation, and conductive heat bypass. The scenarios considered revealed the highest efficiency decay for convectionally loaded setups (up to 4.8%pts), followed by the impacts of contact resistances (up to 4.8%pts), by radiation (up to 0.56%pts), and by thermal conduction of a solid filling material within the voids of the module construction (up to 0.14%pts).

Microorganism Nutrition Processes as a General Route for the Preparation of Bionic Nanocomposites Based on Intractable Polymers.

PubMed

Valentini, L; Bon, S Bittolo; Pugno, N M

2016-08-31

In this paper the fermentation process activated by living microorganisms of the baker's yeast is proposed as a facile assembly method of hybrid nanoparticles at liquid interface. Water dispersion of commercial baker's yeast extract used for bread production, graphene nanoplatelets (GNPs), and carbon nanotubes (CNTs) were added to oil/water interface; when the yeast is activated by adding sugar, the byproduct carbon dioxide bubbles migrate from the water phase to the oil/water interface generating a floating nanostructured film at liquid interface where it is trapped. Starting from this simple method, we propose a general approach for the stabilization of intractable poly(etheretherketone) polymeric particles with GNPs and CNTs at immiscible liquid interface. This process allowed the formation of sintered porous composites with improved mechanical properties. The porous structure of the composites gave rise to a low thermal conductivity making them good candidates for thermal insulating applications. Liquid absorption by these porous composites has been also reported. We believe that this new approach may have applications in the large scale fabrication of nanomaterials and is particularly suited for the preparation of nanocomposites starting from polymers that are intractable by solvent casting.

Deconstructing Temperature Gradients across Fluid Interfaces: The Structural Origin of the Thermal Resistance of Liquid-Vapor Interfaces

NASA Astrophysics Data System (ADS)

Muscatello, Jordan; Chacón, Enrique; Tarazona, Pedro; Bresme, Fernando

2017-07-01

The interfacial thermal resistance determines condensation-evaporation processes and thermal transport across material-fluid interfaces. Despite its importance in transport processes, the interfacial structure responsible for the thermal resistance is still unknown. By combining nonequilibrium molecular dynamics simulations and interfacial analyses that remove the interfacial thermal fluctuations we show that the thermal resistance of liquid-vapor interfaces is connected to a low density fluid layer that is adsorbed at the liquid surface. This thermal resistance layer (TRL) defines the boundary where the thermal transport mechanism changes from that of gases (ballistic) to that characteristic of dense liquids, dominated by frequent particle collisions involving very short mean free paths. We show that the thermal conductance is proportional to the number of atoms adsorbed in the TRL, and hence we explain the structural origin of the thermal resistance in liquid-vapor interfaces.

An Investigation of DC-DC Converter Power Density Using Si and SiC MOSFETS

DTIC Science & Technology

2010-05-07

submarine or small surface combatant, volumetric constraints quickly become extremely prohibitive. Dedicating generators for high power loads takes...thermal compounds were applied to the MOSFET-heat sink interface. For the Si APT26F120B2, MG Chemicals TC-450ML thermal epoxy was used to connect the... submarines , bus converter modules must be made optimally power dense in order to decrease volumetric requirements of the modules for a rated throughput

Tuning the Seebeck effect in C60-based hybrid thermoelectric devices through temperature-dependent surface polarization and thermally-modulated interface dipoles.

PubMed

Liu, Yuchun; Xu, Ling; Zhao, Chen; Shao, Ming; Hu, Bin

2017-06-07

Fullerene (C 60 ) is an important n-type organic semiconductor with high electron mobility and low thermal conductivity. In this work, we report the experimental results on the tunable Seebeck effect of C 60 hybrid thin-film devices by adopting different oxide layers. After inserting n-type high-dielectric constant titanium oxide (TiO x ) and zinc oxide (ZnO) layers, we observed a significantly enhanced n-type Seebeck effect in oxide/C 60 hybrid devices with Seebeck coefficients of -5.8 mV K -1 for TiO x /C 60 and -2.08 mV K -1 for ZnO/C 60 devices at 100 °C, compared with the value of -400 μV K -1 for the pristine C 60 device. However, when a p-type nickel oxide (NiO) layer is inserted, the C 60 hybrid devices show a p-type to n-type Seebeck effect transition when the temperature increases. The remarkable Seebeck effect and change in Seebeck coefficient in different oxide/C 60 hybrid devices can be attributed to two reasons: the temperature-dependent surface polarization difference and thermally-dependent interface dipoles. Firstly, the surface polarization difference due to temperature-dependent electron-phonon coupling can be enhanced by inserting an oxide layer and functions as an additional driving force for the Seebeck effect development. Secondly, thermally-dependent interface dipoles formed at the electrode/oxide interface play an important role in modifying the density of interface states and affecting the charge diffusion in hybrid devices. The surface polarization difference and interface dipoles function in the same direction in hybrid devices with TiO x and ZnO dielectric layers, leading to enhanced n-type Seebeck effect, while the surface polarization difference and interface dipoles generate the opposite impact on electron diffusion in ITO/NiO/C 60 /Al, leading to a p-type to n-type transition in the Seebeck effect. Therefore, inserting different oxide layers could effectively modulate the Seebeck effect of C 60 -based hybrid devices through the surface polarization difference and thermally-dependent interface dipoles, which represents an effective approach to tune the vertical Seebeck effect in organic functional devices.

Physics of direct-contact ultrasonic cloth drying process

DOE PAGES

Peng, Chang; Ravi, Saitej; Patel, Viral K.; ...

2017-02-27

Existing methods of drying fabrics involve energy-intensive thermal evaporation of moisture from clothes. Drying fabrics using high-frequency vibrations of piezoelectric transducers can substantially reduce drying time and energy consumption. In this method, vibrational energy generates instability on the liquid-air interface and mechanically ejects water from a wet fabric. For the first time, the physics of the ultrasonic fabric drying process in direct-contact mode is studied. The kinematic and thermal responses of water droplets and fabrics on piezoelectric crystal transducers and metal mesh–based transducers are studied. The results suggest that on piezoelectric crystal transducers, the response of a droplet subjected tomore » ultrasonic excitation is dictated by the relative magnitude of the surface tension and the ultrasonic excitation forces. The drying process for a fabric on the studied transducers consists of two regimes—vibrational and thermal. When the water content is high, the vibrational forces can eject bulk water rapidly. But the more strongly bound water within the smaller fabric pores evaporates by the thermal energy generated as a result of the viscous losses. Our study finds that a metal mesh–based transducer is more suitable for dewatering fabrics, as it facilitates the ejection of water from the fabric–transducer interface to the opposite side of the mesh. A demonstration unit developed consumes 10–20% of the water latent heat energy at water contents greater than 20%.« less

Physics of direct-contact ultrasonic cloth drying process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Peng, Chang; Ravi, Saitej; Patel, Viral K.

Existing methods of drying fabrics involve energy-intensive thermal evaporation of moisture from clothes. Drying fabrics using high-frequency vibrations of piezoelectric transducers can substantially reduce drying time and energy consumption. In this method, vibrational energy generates instability on the liquid-air interface and mechanically ejects water from a wet fabric. For the first time, the physics of the ultrasonic fabric drying process in direct-contact mode is studied. The kinematic and thermal responses of water droplets and fabrics on piezoelectric crystal transducers and metal mesh–based transducers are studied. The results suggest that on piezoelectric crystal transducers, the response of a droplet subjected tomore » ultrasonic excitation is dictated by the relative magnitude of the surface tension and the ultrasonic excitation forces. The drying process for a fabric on the studied transducers consists of two regimes—vibrational and thermal. When the water content is high, the vibrational forces can eject bulk water rapidly. But the more strongly bound water within the smaller fabric pores evaporates by the thermal energy generated as a result of the viscous losses. Our study finds that a metal mesh–based transducer is more suitable for dewatering fabrics, as it facilitates the ejection of water from the fabric–transducer interface to the opposite side of the mesh. A demonstration unit developed consumes 10–20% of the water latent heat energy at water contents greater than 20%.« less

Interface-based two-way tuning of the in-plane thermal transport in nanofilms

NASA Astrophysics Data System (ADS)

Hua, Yu-Chao; Cao, Bing-Yang

2018-03-01

Here, the two-way tuning of in-plane thermal transport is obtained in the bi-layer nanofilms with an interfacial effect by using the Boltzmann transport equation (BTE) and the phonon Monte Carlo (MC) technique. A thermal conductivity model was derived from the BTE and verified by the MC simulations. Both the model and the MC simulations indicate that the tuning of the thermal transport can be bidirectional (reduced or enhanced), depending on the interface conditions (i.e., roughness and adhesion energy) and the phonon property dissimilarity at the interface. For the identical-material interface, the emergence of thermal conductivity variation requires two conditions: (a) the interface is not completely specular and (b) the transmission specularity parameter differs from the reflection specularity parameter at the interface. When the transmission specularity parameter is larger than the reflection specularity parameter at the interface, the thermal conductivity improvement effect emerges, whereas the thermal conductivity reduction effect occurs. For the disparate-material interface, the phonon property perturbation near the interface causes the thermal conductivity variation, even when neither the above two conditions are satisfied. The mean free path ratio (γ) between the disparate materials was defined to characterize the phonon property dissimilarity. γ > 1 can lead to the thermal conductivity improvement effect, while γ < 1 corresponds to the thermal conductivity reduction effect. Our work provides a more in-depth understanding of the interfacial effect on the nanoscale thermal transport, with an applicable predictive model, which can be helpful for predicting and manipulating phonon transport in nanofilms.

Mixing and transient interface condensation of a liquid hydrogen tank

NASA Technical Reports Server (NTRS)

Lin, C. S.; Hasan, M. M.; Nyland, T. W.

1993-01-01

Experiments were conducted to investigate the effect of axial jet-induced mixing on the pressure reduction of a thermally stratified liquid hydrogen tank. The tank was nearly cylindrical, having a volume of about 0.144 cu m with 0.559 m in diameter and 0.711 m length. A mixer/pump unit, which had a jet nozzle outlet of 0.0221 m in diameter was located 0.178 m from the tank bottom and was installed inside the tank to generate the axial jet mixing and tank fluid circulation. Mixing tests began with the tank pressures at which the thermal stratification results in 4.9-6.2 K liquid subcooling. The mixing time and transient vapor condensation rate at the liquid-vapor interface are determined. Two mixing time correlations, based on the thermal equilibrium and pressure equilibrium, are developed and expressed as functions of system and buoyancy parameters. The limited liquid hydrogen data of the present study shows that the modified steady state condensation rate correlation may be used to predict the transient condensation rate in a mixing process if the instantaneous values of jet sub cooling and turbulence intensity at the interface are employed.

A low thermal impact annealing process for SiO2-embedded Si nanocrystals with optimized interface quality

NASA Astrophysics Data System (ADS)

Hiller, Daniel; Gutsch, Sebastian; Hartel, Andreas M.; Löper, Philipp; Gebel, Thoralf; Zacharias, Margit

2014-04-01

Silicon nanocrystals (Si NCs) for 3rd generation photovoltaics or optoelectronic applications can be produced by several industrially compatible physical or chemical vapor deposition technologies. A major obstacle for the integration into a fabrication process is the typical annealing to form and crystallize these Si quantum dots (QDs) which involves temperatures ≥1100 °C for 1 h. This standard annealing procedure allows for interface qualities that correspond to more than 95% dangling bond defect free Si NCs. We study the possibilities to use rapid thermal annealing (RTA) and flash lamp annealing to crystallize the Si QDs within seconds or milliseconds at high temperatures. The Si NC interface of such samples exhibits huge dangling bond defect densities which makes them inapplicable for photovoltaics or optoelectronics. However, if the RTA high temperature annealing is combined with a medium temperature inert gas post-annealing and a H2 passivation, luminescent Si NC fractions of up to 90% can be achieved with a significantly reduced thermal load. A new figure or merit, the relative dopant diffusion length, is introduced as a measure for the impact of a Si NC annealing procedure on doping profiles of device structures.

CNT-based Thermal Interface Materials for Load-Bearing Aerospace Applications

DTIC Science & Technology

2012-08-01

CNT -based Thermal Interface Materials for Load-Bearing Aerospace Applications Michael Bifano, Pankaj Kaul and Vikas Prakash (PI) Department...4. TITLE AND SUBTITLE CNT -based Thermal Interface Materials for Load-Bearing Aerospace Applications 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c...Z39-18 Objective Develop multifunctional CNT -epoxy Thermal Interface Materials (TIMs) for load bearing aerospace applications. Emphasis - To

Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source Upgrade

NASA Astrophysics Data System (ADS)

Lee, S. H.; Yang, B. X.; Collins, J. T.; Ramanathan, M.

2017-02-01

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs), which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This paper presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.

Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source Upgrade.

PubMed

Lee, S H; Yang, B X; Collins, J T; Ramanathan, M

2017-02-01

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs), which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This paper presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.

Thermal force induced by the presence of a particle near a solidifying interface.

PubMed

Hadji, L

2001-11-01

The presence of a foreign particle in the melt, ahead of a solid-liquid interface, leads to the onset of interfacial deformations if the thermal conductivity of the particle, k(p), differs from that of the melt, k(l). In this paper, the influence of the thermal conductivity contrast on the interaction between the solidifying interface and the particle is quantified. We show that the interface distortion gives rise to a thermal force whose expression is given by F(th)=2piLGa3(1-alpha)/(2+alpha)T(m), where L is the latent heat of fusion per unit volume, T(m) is the melting point, a is the particle's radius, G the thermal gradient in the liquid phase and alpha=k(p)/k(l). The derivation makes use of the following assumptions: (i) the particle is small compared to the horizontal extent of the interface, (ii) the particle is placed in the near proximity of the deformable solid-liquid interface, and (iii) the interface is practically immobile in the calculation of the thermal field, i.e., V

Rectifying full-counting statistics in a spin Seebeck engine

NASA Astrophysics Data System (ADS)

Tang, Gaomin; Chen, Xiaobin; Ren, Jie; Wang, Jian

2018-02-01

In terms of the nonequilibrium Green's function framework, we formulate the full-counting statistics of conjugate thermal spin transport in a spin Seebeck engine, which is made by a metal-ferromagnet insulator interface driven by a temperature bias. We obtain general expressions of scaled cumulant generating functions of both heat and spin currents that hold special fluctuation symmetry relations, and demonstrate intriguing properties, such as rectification and negative differential effects of high-order fluctuations of thermal excited spin current, maximum output spin power, and efficiency. The transport and noise depend on the strongly fluctuating electron density of states at the interface. The results are relevant for designing an efficient spin Seebeck engine and can broaden our view in nonequilibrium thermodynamics and the nonlinear phenomenon in quantum transport systems.

Energy-Efficient Phase-Change Memory with Graphene as a Thermal Barrier.

PubMed

Ahn, Chiyui; Fong, Scott W; Kim, Yongsung; Lee, Seunghyun; Sood, Aditya; Neumann, Christopher M; Asheghi, Mehdi; Goodson, Kenneth E; Pop, Eric; Wong, H-S Philip

2015-10-14

Phase-change memory (PCM) is an important class of data storage, yet lowering the programming current of individual devices is known to be a significant challenge. Here we improve the energy-efficiency of PCM by placing a graphene layer at the interface between the phase-change material, Ge2Sb2Te5 (GST), and the bottom electrode (W) heater. Graphene-PCM (G-PCM) devices have ∼40% lower RESET current compared to control devices without the graphene. This is attributed to the graphene as an added interfacial thermal resistance which helps confine the generated heat inside the active PCM volume. The G-PCM achieves programming up to 10(5) cycles, and the graphene could further enhance the PCM endurance by limiting atomic migration or material segregation at the bottom electrode interface.

Solar thermal repowering systems integration. Final report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dubberly, L. J.; Gormely, J. E.; McKenzie, A. W.

1979-08-01

This report is a solar repowering integration analysis which defines the balance-of-plant characteristics and costs associated with the solar thermal repowering of existing gas/oil-fired electric generating plants. Solar repowering interface requirements for water/steam and salt or sodium-cooled central receivers are defined for unit sizes ranging from 50 MWe non-reheat to 350 MWe reheat. Finally balance-of-plant cost estimates are presented for each of six combinations of plant type, receiver type and percent solar repowering.

The environmental heat flux routine, version 4 (EHFR-4) and Multiple Reflections Routine (MRR), volume 1

NASA Technical Reports Server (NTRS)

Dietz, J. B.

1973-01-01

The environmental heat flux routine version 4, (EHFR-4) is a generalized computer program which calculates the steady state and/or transient thermal environments experienced by a space system during lunar surface, deep space, or thermal vacuum chamber operation. The specific environments possible for EHFR analysis include: lunar plain, lunar crater, combined lunar plain and crater, lunar plain in the region of spacecraft surfaces, intervehicular, deep space in the region of spacecraft surfaces, and thermal vacuum chamber generation. The EHFR was used for Extra Vehicular Mobility Unit environment analysis of the Apollo 11-17 missions, EMU manned and unmanned thermal vacuum qualification testing, and EMU-LRV interface environmental analyses.

Nickel-Graphite Composite Compliant Interface and/or Hot Shoe Material

NASA Technical Reports Server (NTRS)

Firdosy, Samad A.; Chun-Yip Li, Billy; Ravi, Vilupanur A.; Fleurial, Jean-Pierre; Caillat, Thierry; Anjunyan, Harut

2013-01-01

Next-generation high-temperature thermoelectric-power-generating devices will employ segmented architectures and will have to reliably withstand thermally induced mechanical stresses produced during component fabrication, device assembly, and operation. Thermoelectric materials have typically poor mechanical strength, exhibit brittle behavior, and possess a wide range of coefficient of thermal expansion (CTE) values. As a result, the direct bonding at elevated temperatures of these materials to each other to produce segmented leg components is difficult, and often results in localized microcracking at interfaces and mec hanical failure due to the stresses that arise from the CTE mismatch between the various materials. Even in the absence of full mechanical failure, degraded interfaces can lead to increased electrical and thermal resistances, which adversely impact conversion efficiency and power output. The proposed solution is the insertion of a mechanically compliant layer, with high electrical and thermal conductivity, between the low- and high-temperature segments to relieve thermomechanical stresses during device fabrication and operation. This composite material can be used as a stress-relieving layer between the thermoelectric segments and/or between a thermoelectric segment and a hot- or cold-side interconnect material. The material also can be used as a compliant hot shoe. Nickel-coated graphite powders were hot-pressed to form a nickel-graphite composite material. A freestanding thermoelectric segmented leg was fabricated by brazing the compliant pad layer between the high-temperature p- Zintl and low-temperature p-SKD TE segments using Cu-Ag braze foils. The segmented leg stack was heated in vacuum under a compressive load to achieve bonding. The novelty of the innovation is the use of composite material that re duces the thermomechanical stresses en - countered in the construction of high-efficiency, high-temperature therm - o-electric devices. The compliant pad enables the bonding of dissimilar thermoelectric materials while maintaining the desired electrical and thermal properties essential for efficient device operation. The modulus, CTE, electrical, and thermal conductances of the composite can be controlled by varying the ratio of nickel to graphite.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, S. H.; Yang, B. X.; Collins, J. T.

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs),more » which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This study presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.« less

Engineering Interface Structures and Thermal Stabilities via SPD Processing in Bulk Nanostructured Metals

DOE PAGES

Zheng, Shijian; Carpenter, John S.; McCabe, Rodney J.; ...

2014-02-27

Nanostructured metals achieve extraordinary strength but suffer from low thermal stability, both a consequence of a high fraction of interfaces. Overcoming this tradeoff relies on making the interfaces themselves thermally stable. In this paper, we show that the atomic structures of bi-metal interfaces in macroscale nanomaterials suitable for engineering structures can be significantly altered via changing the severe plastic deformation (SPD) processing pathway. Two types of interfaces are formed, both exhibiting a regular atomic structure and providing for excellent thermal stability, up to more than half the melting temperature of one of the constituents. Most importantly, the thermal stability ofmore » one is found to be significantly better than the other, indicating the exciting potential to control and optimize macroscale robustness via atomic-scale bimetal interface tuning. As a result, we demonstrate an innovative way to engineer pristine bimetal interfaces for a new class of simultaneously strong and thermally stable materials.« less

Thermal Interface Comparisons Under Flight Like Conditions

NASA Technical Reports Server (NTRS)

Rodriquez-Ruiz, Juan

2008-01-01

Thermal interface materials are used in bolted interfaces to promote good thermal conduction between the two. The mounting surface can include panels, heat pipes, electronics boxes, etc.. . On Lunar Reconnaissance Orbiter (LRO) project the results are directly applicable: a) Several high power avionics boxes b) Several interfaces from RWA to radiator through heat pipe network

Thermally activated delayed photoluminescence from pyrenyl-functionalized CdSe quantum dots

NASA Astrophysics Data System (ADS)

Mongin, Cédric; Moroz, Pavel; Zamkov, Mikhail; Castellano, Felix N.

2018-02-01

The generation and transfer of triplet excitons across semiconductor nanomaterial-molecular interfaces will play an important role in emerging photonic and optoelectronic technologies, and understanding the rules that govern such phenomena is essential. The ability to cooperatively merge the photophysical properties of semiconductor quantum dots with those of well-understood and inexpensive molecular chromophores is therefore paramount. Here we show that 1-pyrenecarboxylic acid-functionalized CdSe quantum dots undergo thermally activated delayed photoluminescence. This phenomenon results from a near quantitative triplet-triplet energy transfer from the nanocrystals to 1-pyrenecarboxylic acid, producing a molecular triplet-state 'reservoir' that thermally repopulates the photoluminescent state of CdSe through endothermic reverse triplet-triplet energy transfer. The photoluminescence properties are systematically and predictably tuned through variation of the quantum dot-molecule energy gap, temperature and the triplet-excited-state lifetime of the molecular adsorbate. The concepts developed are likely to be applicable to semiconductor nanocrystals interfaced with molecular chromophores, enabling potential applications of their combined excited states.

Bimodal Control of Heat Transport at Graphene–Metal Interfaces Using Disorder in Graphene

PubMed Central

Kim, Jaehyeon; Khan, Muhammad Ejaz; Ko, Jae-Hyeon; Kim, Jong Hun; Lee, Eui-Sup; Suh, Joonki; Wu, Junqiao; Kim, Yong-Hyun; Park, Jeong Young; Lyeo, Ho-Ki

2016-01-01

Thermal energy transport across the interfaces of physically and chemically modified graphene with two metals, Al and Cu, was investigated by measuring thermal conductance using the time-domain thermoreflectance method. Graphene was processed using a He2+ ion-beam with a Gaussian distribution or by exposure to ultraviolet/O3, which generates structural or chemical disorder, respectively. Hereby, we could monitor changes in the thermal conductance in response to varying degrees of disorder. We find that the measured conductance increases as the density of the physical disorder increases, but undergoes an abrupt modulation with increasing degrees of chemical modification, which decreases at first and then increases considerably. Moreover, we find that the conductance varies inverse proportionally to the average distance between the structural defects in the graphene, implying a strong in-plane influence of phonon kinetics on interfacial heat flow. We attribute the bimodal results to an interplay between the distinct effects on graphene’s vibrational modes exerted by graphene modification and by the scattering of modes. PMID:27698372

Computer tools for face seal analyses developed at John Crane

NASA Technical Reports Server (NTRS)

Wu, Shifeng

1994-01-01

The purposes of the computer tools for face seal analysis are new product optimization, existing seals on new applications, existing seals on off-duty conditions, and trouble-shooting. Discussed in this viewgraph presentation are interface forces, friction/heat generation, heat transfer/temperature distribution, axisymmetric pressure/thermal distortion, leakage, and an example case.

Preliminary design of a solar central receiver for a site-specific repowering application (Saguaro Power Plant). Volume III. Specifications. Final report, October 1982-September 1983

DOE Office of Scientific and Technical Information (OSTI.GOV)

Weber, E.R.

1983-09-01

This volume on specifications for the Saguaro Power Plant includes the following: subsystem interface definition document; solar collector subsystem specification; receiver specification; thermal energy storage specification; solar steam generator specification; and master control system specification.

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier Coatings

NASA Technical Reports Server (NTRS)

Zhu, Dong-Ming; Choi, Sung R.; Eldridge, Jeffrey I.; Lee, Kang N.; Miller, Robert A.

2003-01-01

In this paper, surface cracking and interface reactions of a BSAS coating and a multi-layer ZrO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions, which were largely enhanced by the coating surface cracking in the water vapor environment, were investigated in detail, and the reaction phases were identified for the coating system after the long-term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions.

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier Coatings

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Choi, Sung R.; Eldridge, Jeffrey I.; Lee, Kang N.; Miller, Robert A.

2003-01-01

In this paper, surface cracking and interface reactions of a BSAS coating and a multi-layer ZTO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions, which were largely enhanced by the coating surface cracking in the water vapor environment, were investigated in detail, and the reaction phases were identified for the coating system after the long- term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions.

Thermal conductance at atomically clean and disordered silicon/aluminum interfaces: A molecular dynamics simulation study

NASA Astrophysics Data System (ADS)

Ih Choi, Woon; Kim, Kwiseon; Narumanchi, Sreekant

2012-09-01

Thermal resistance between layers impedes effective heat dissipation in electronics packaging applications. Thermal conductance for clean and disordered interfaces between silicon (Si) and aluminum (Al) was computed using realistic Si/Al interfaces and classical molecular dynamics with the modified embedded atom method potential. These realistic interfaces, which include atomically clean as well as disordered interfaces, were obtained using density functional theory. At 300 K, the magnitude of interfacial conductance due to phonon-phonon scattering obtained from the classical molecular dynamics simulations was approximately five times higher than the conductance obtained using analytical elastic diffuse mismatch models. Interfacial disorder reduced the thermal conductance due to increased phonon scattering with respect to the atomically clean interface. Also, the interfacial conductance, due to electron-phonon scattering at the interface, was greater than the conductance due to phonon-phonon scattering. This indicates that phonon-phonon scattering is the bottleneck for interfacial transport at the semiconductor/metal interfaces. The molecular dynamics modeling predictions for interfacial thermal conductance for a 5-nm disordered interface between Si/Al were in-line with recent experimental data in the literature.

Interface Shape Control Using Localized Heating during Bridgman Growth

NASA Technical Reports Server (NTRS)

Volz, M. P.; Mazuruk, K.; Aggarwal, M. D.; Croll, A.

2008-01-01

Numerical calculations were performed to assess the effect of localized radial heating on the melt-crystal interface shape during vertical Bridgman growth. System parameters examined include the ampoule, melt and crystal thermal conductivities, the magnitude and width of localized heating, and the latent heat of crystallization. Concave interface shapes, typical of semiconductor systems, could be flattened or made convex with localized heating. Although localized heating caused shallower thermal gradients ahead of the interface, the magnitude of the localized heating required for convexity was less than that which resulted in a thermal inversion ahead of the interface. A convex interface shape was most readily achieved with ampoules of lower thermal conductivity. Increasing melt convection tended to flatten the interface, but the amount of radial heating required to achieve a convex interface was essentially independent of the convection intensity.

Current and anticipated uses of thermal-hydraulic codes in Germany

DOE Office of Scientific and Technical Information (OSTI.GOV)

Teschendorff, V.; Sommer, F.; Depisch, F.

1997-07-01

In Germany, one third of the electrical power is generated by nuclear plants. ATHLET and S-RELAP5 are successfully applied for safety analyses of the existing PWR and BWR reactors and possible future reactors, e.g. EPR. Continuous development and assessment of thermal-hydraulic codes are necessary in order to meet present and future needs of licensing organizations, utilities, and vendors. Desired improvements include thermal-hydraulic models, multi-dimensional simulation, computational speed, interfaces to coupled codes, and code architecture. Real-time capability will be essential for application in full-scope simulators. Comprehensive code validation and quantification of uncertainties are prerequisites for future best-estimate analyses.

Flight evaluation of Spacelab 1 payload thermal/ECS interfaces

NASA Technical Reports Server (NTRS)

Ray, C. D.; Humphries, W. R.; Patterson, W. C.

1984-01-01

The Spacelab (SL-1) thermal/Environmental Control Systems (ECS) are discussed. Preflight analyses and flight data are compared in order to validate payload to Spacelab interfaces as well as corroborate modeling/analysis techniques. In doing so, a brief description of the Spacelab 1 payload configuration and the interactive Spacelab thermal/ECS systems are given. In particular, these interfaces address equipment cooling air, thermal and fluid conditions, humidity levels, both freon and water loop temperatures and load states, as well as passive radiant environment interfaces.

Reduction of thermal stresses in continuous fiber reinforced metal matrix composites with interface layers

NASA Technical Reports Server (NTRS)

Jansson, S.; Leckie, F. A.

1990-01-01

The potential of using an interface layer to reduce thermal stresses in the matrix of composites with a mismatch in coefficients of thermal expansion of fiber and matrix was investigated. It was found that compliant layers, with properties of readily available materials, do not have the potential to reduce thermal stresses significantly. However, interface layers with high coefficient of thermal expansion can compensate for the mismatch and reduce thermal stresses in the matrix significantly.

Evaluation of GeO desorption behavior in the metalGeO(2)Ge structure and its improvement of the electrical characteristics.

PubMed

Oniki, Yusuke; Koumo, Hideo; Iwazaki, Yoshitaka; Ueno, Tomo

2010-06-15

The relation between germanium monoxide (GeO) desorption and either improvement or deterioration in electrical characteristics of metalGeO(2)Ge capacitors fabricated by thermal oxidation has been investigated. In the metalGeO(2)Ge stack, two processes of GeO desorption at different sites and at different temperatures were observed by thermal desorption spectroscopy measurements. The electrical characteristics of as-oxidized metalGeO(2)Ge capacitors shows a large flat-band voltage shift and minority carrier generation due to the GeO desorption from the GeO(2)Ge interface during oxidation of Ge substrates. On the other hand, the electrical properties were drastically improved by a postmetallization annealing at low temperature resulting in a metal catalyzed GeO desorption from the top interface.

Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

DOE PAGES

Cheaito, Ramez; Hattar, Khalid Mikhiel; Gaskins, John T.; ...

2015-03-05

The interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers was studied. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffusemore » mismatch model. The results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.« less

Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source Upgrade

DOE PAGES

Lee, S. H.; Yang, B. X.; Collins, J. T.; ...

2017-02-07

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs),more » which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This study presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.« less

The Influence of a TiN Film on the Electronic Contribution to the Thermal Conductivity of a TiC Film in a TiN-TiC Layer System

NASA Astrophysics Data System (ADS)

Jagannadham, K.

2018-01-01

TiC and TiN films were deposited by reactive magnetron sputtering on Si substrates. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) characterization of the microstructure and interface structure have been carried out and the stoichiometric composition of TiC is determined. Thermal conductivity and interface thermal conductance between different layers in the films are evaluated by the transient thermo reflectance (TTR) and three-omega (3- ω) methods. The results showed that the thermal conductivity of the TiC films increased with temperature. The thermal conductivity of TiC in the absence of TiN is dominated by phonon contribution. The electronic contribution to the thermal conductivity of TiC in the presence of TiN is found to be more significant. The interface thermal conductance of the TiC/TiN interface is much larger than that of interfaces at Au/TiC, TiC/Si, or TiN/Si. The interface thermal conductance between TiC and TiN is reduced by the layer formed as a result of interdiffusion.

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

NASA Astrophysics Data System (ADS)

Xu, Hui; Chen, Jian-hao; Ren, Shu-bin; He, Xin-bo; Qu, Xuan-hui

2018-04-01

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650°C and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

A TBA approach to thermal transport in the XXZ Heisenberg model

NASA Astrophysics Data System (ADS)

Zotos, X.

2017-10-01

We show that the thermal Drude weight and magnetothermal coefficient of the 1D easy-plane Heisenberg model can be evaluated by an extension of the Bethe ansatz thermodynamics formulation by Takahashi and Suzuki (1972 Prog. Theor. Phys. 48 2187). They have earlier been obtained by the quantum transfer matrix method (Klümper 1999 Z. Phys. B 91 507). Furthermore, this approach can be applied to the study of the far-out of equilibrium energy current generated at the interface between two semi-infinite chains held at different temperatures.

Thermal conductance of and heat generation in tire-pavement interface and effect on aircraft braking

NASA Technical Reports Server (NTRS)

Miller, C. D.

1976-01-01

A finite-difference analysis was performed on temperature records obtained from a free rolling automotive tire and from pavement surface. A high thermal contact conductance between tire and asphalt was found on a statistical basis. Average slip due to squirming between tire and asphalt was about 1.5 mm. Consequent friction heat was estimated as 64 percent of total power absorbed by bias-ply, belted tire. Extrapolation of results to aircraft tire indicates potential braking improvement by even moderate increase of heat absorbing capacity of runway surface.

Influence of engineered interfaces on residual stresses and mechanical response in metal matrix composites

NASA Technical Reports Server (NTRS)

Arnold, Steven M.; Wilt, Thomas E.

1992-01-01

Because of the inherent coefficient of thermal expansion (CTE) mismatch between fiber and matrix within metal and intermetallic matrix composite systems, high residual stresses can develop under various thermal loading conditions. These conditions include cooling from processing temperature to room temperature as well as subsequent thermal cycling. As a result of these stresses, within certain composite systems, radial, circumferential, and/or longitudinal cracks have been observed to form at the fiber matrix interface region. A number of potential solutions for reducing this thermally induced residual stress field have been proposed recently. Examples of some potential solutions are high CTE fibers, fiber preheating, thermal anneal treatments, and an engineered interface. Here the focus is on designing an interface (by using a compensating/compliant layer concept) to reduce or eliminate the thermal residual stress field and, therefore, the initiation and propagation of cracks developed during thermal loading. Furthermore, the impact of the engineered interface on the composite's mechanical response when subjected to isothermal mechanical load histories is examined.

Evaluation of using ferrofluid as an interface material for a field-reversible thermal connector

NASA Astrophysics Data System (ADS)

Yousif, Ahmed S.

The electrical functionality of an avionics chassis is limited due to heat dissipation limits. The limits arise due to the fact that components in an avionic computer boxes are packed very compactly, with the components mounted onto plug-in cards, and the harsh environment experienced by the chassis limits how heat can be dissipated from the cards. Convective and radiative heat transfer to the ambient are generally not possible. Therefore it is necessary to have heat transferred from the components conducted to the edge of the plug-in cards. The heat then needs to conduct from the card edge to a cold block that not only holds the card in place, but also removes the generated heat by some heat transfer fluid that is circulated through the cold block. The interface between the plug-in card and the cold block typically has a high thermal resistance since it is necessary for the card to have the capability to be re-workable, meaning that the card can be removed and then returned to the chassis. Reducing the thermal resistance of the interface is the objective of the current study and the topic of this thesis. The current design uses a pressure interface between the card and cold block. The contact pressure is increased through the addition of a wedgelock, which is a field-reversible mechanical connector. To use a wedgelock, the cold block has channels milled on the surface with widths that are larger than the thickness of the plug-in card and the un-expanded wedgelock. The card edge is placed in the channel and placed against one of the channel walls. A wedgelock is then placed between the card and the other channel wall. The wedgelock is then expanded by using either a screw or a lever. As the wedgelock expands it fills in the remaining channel gap and bears against the other face of the plug-in card. The majority of heat generated by the components on the plug-in card is forced to conduct from the card into the wall of the cold block, effectively a single sided, dry conduction heat transfer path. Having started as a student design competition named RevCon Challenge, work was performed to evaluate the use of new field-reversible thermal connectors. The new design proposed by the University of Missouri utilized oil based iron nanoparticles, commonly known as a ferrofluid, as a thermal interface material. By using a liquid type of interface material the channel gap can be reduced to a few micrometers, within machining tolerances, and heat can be dissipated off both sides of the card. The addition of nanoparticles improves the effective thermal conductivity of base fluid. The use of iron nanoparticles allows magnets to be used to hold the fluid in place, so the electronic cards may be easily inserted and removed while keeping the ferrofluid in the cold block channel. The ferrofluid-based design which was investigated has shown lower thermal resistance than the current wedgelock design. These results open the door for further development of electronic cards by using higher heat emitting components without compromising the simplicity of attaching/detaching cards from cooling plates.

Compliant Interfacial Layers in Thermoelectric Devices

NASA Technical Reports Server (NTRS)

Firdosy, Samad A. (Inventor); Li, Billy Chun-Yip (Inventor); Ravi, Vilupanur A. (Inventor); Fleurial, Jean-Pierre (Inventor); Caillat, Thierry (Inventor); Anjunyan, Harut (Inventor)

2017-01-01

A thermoelectric power generation device is disclosed using one or more mechanically compliant and thermally and electrically conductive layers at the thermoelectric material interfaces to accommodate high temperature differentials and stresses induced thereby. The compliant material may be metal foam or metal graphite composite (e.g. using nickel) and is particularly beneficial in high temperature thermoelectric generators employing Zintl thermoelectric materials. The compliant material may be disposed between the thermoelectric segments of the device or between a thermoelectric segment and the hot or cold side interconnect of the device.

Investigation of Thermal Interface Materials Using Phase-Sensitive Transient Thermoreflectance Technique: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, X.; King, C.; DeVoto, D.

2014-08-01

With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat conduction model was constructed and theoretical solutions were derived to obtain the relation between phase lag and the thermal/physical properties. This technique enables simultaneous extraction of the contact resistance and bulk thermal conductivity of the TIMs. With the measurements, the bulk thermal conductivity of Dow TC-5022 thermal grease (70 tomore » 75 um bondline thickness) was 3 to 5 W/(m-K) and the contact resistance was 5 to 10 mm2-K/W. For the Btech thermoplastic material (45 to 80 μm bondline thickness), the bulk thermal conductivity was 20 to 50 W/(m-K) and the contact resistance was 2 to 5 mm2-K/W. Measurements were also conducted to quantify the thermal performance of diffusion-bonded interface for power electronics applications. Results with the diffusion-bonded sample showed that the interfacial thermal resistance is more than one order of magnitude lower than those of traditional TIMs, suggesting potential pathways to efficient thermal management.« less

Influence of convection on microstructure

NASA Technical Reports Server (NTRS)

Wilcox, William R.; Caram, Rubens; Mohanty, A. P.; Seth, Jayshree

1990-01-01

In eutectic growth, as the solid phases grow they reject atoms to the liquid. This results in a variation of melt composition along the solid/liquid interface. In the past, mass transfer in eutectic solidification, in the absence of convection, was considered to be governed only by the diffusion induced by compositional gradients. However, mass transfer can also be generated by a temperature gradient. This is called thermotransport, thermomigration, thermal diffusion or the Soret effect. A theoretical model of the influence of the Soret effect on the growth of eutectic alloys is presented. A differential equation describing the compositional field near the interface during unidirectional solidification of a binary eutectic alloy was formulated by including the contributions of both compositional and thermal gradients in the liquid. A steady-state solution of the differential equation was obtained by applying appropriate boundary conditions and accounting for heat flow in the melt. Following that, the average interfacial composition was converted to a variation of undercooling at the interface, and consequently to microstructural parameters. The results obtained show that thermotransport can, under certain circumstances, be a parameter of paramount importance.

Chemistry of MOS-LSI radiation hardening

NASA Technical Reports Server (NTRS)

Grunthaner, P.

1985-01-01

The objective of this task was to obtain chemical information on MOS test samples. Toward this end, high resolution X-ray photoemission spectroscopy (XPS) has been the primary techniques used to characterize the chemistry and structure of the SiO2/Si interface for a variety of MOS structures with differing degrees of susceptibility to damage by ionizing radiation. The major accomplishments of this program are: (1) the identification of a structurally distinct region of SiO2 in the near-interfacial region of thermal SiO2 on Si; (2) the identification in the near-interfacial region of SiO2 structural differences between radiation hard and soft gate oxides; (3) the direct observation of radiation-induced damage sites in thermal SiO2 with XPS using in situ electron stress; (4) the correlation of suboxide state distributions at the SiO2/Si interface with processing parameters and radiation susceptibility; (5) the development of a chemical mechanism for radiation-induced interface state generation in SiO2/Si structures; and (6) the development benign chemical profiling techniques which permit the investigation of oxide/semiconductor structures using surface sensitive electron spectroscopic techniques.

In-situ fabrication of diketopyrrolopyrrole-carbazole-based conjugated polymer/TiO2 heterojunction for enhanced visible light photocatalysis

NASA Astrophysics Data System (ADS)

Yang, Long; Yu, Yuyan; Zhang, Jianling; Chen, Fu; Meng, Xiao; Qiu, Yong; Dan, Yi; Jiang, Long

2018-03-01

Aiming at developing highly efficient photocatalysts by broadening the light-harvesting region and suppressing photo-generated electron-hole recombination simultaneously, this work reports rational design and fabrication of donor-acceptor (D-A) conjugated polymer/TiO2 heterojunction catalyst with strong interfacial interactions by a facile in-situ thermal treatment. To expand the light-harvesting window, soluable conjugated copolymers with D-A architecture are prepared by Pd-mediated polycondensation of diketopyrrolopyrrole (DPP) and t-butoxycarbonyl (t-Boc) modified carbazole (Car), and used as visible-light-harvesting antenna to couple with TiO2 nanocrystals. The DPP-Car/TiO2 composites show wide range absorption in 300-1000 nm. To improve the interfacial binding at the interface, a facile in-situ thermal treatment is carried out to cleave the pendant t-Boc groups in carbazole units and liberate the polar amino groups (-NH-) which strongly bind to the surface of TiO2 through dipole-dipole interactions, forming a heterojunction interface. This in-situ thermal treatment changes the surface elemental distribution of TiO2, reinforces the interface bonding at the boundary of conjugated polymers/TiO2 and finally improves the photocatalytic efficiency of DPP-Car/TiO2 under visible-light irradiation. The interface changes are characterized and verified through Fourier-transform infrared spectroscopy (FT-IR), photo images, UV/Vis (solution state and powder diffuse reflection spectroscopy), X-ray powder diffraction (XRD), X-ray photoelectron spectroscopy (XPS), fluorescence, scanning electron microscopy(SEM) and transmission electron microscopy (TEM) techniques. This study provides a new strategy to avoid the low solubility of D-A conjugated polymers and construct highly-efficient conjugated polymer/TiO2 heterojunction by enforcing the interface contact and facilitating charge or energy transfer for the applications in photocatalysis.

Mechanical design of thin-film diamond crystal mounting apparatus with optimized thermal contact and crystal strain for coherence preservation x-ray optics

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shu, Deming; Shvydko, Yury; Stoupin, Stanislav

A method and mechanical design for a thin-film diamond crystal mounting apparatus for coherence preservation x-ray optics with optimized thermal contact and minimized crystal strain are provided. The novel thin-film diamond crystal mounting apparatus mounts a thin-film diamond crystal supported by a thick chemical vapor deposition (CVD) diamond film spacer with a thickness slightly thicker than the thin-film diamond crystal, and two groups of thin film thermal conductors, such as thin CVD diamond film thermal conductor groups separated by the thick CVD diamond spacer. The two groups of thin CVD film thermal conductors provide thermal conducting interface media with themore » thin-film diamond crystal. A piezoelectric actuator is integrated into a flexural clamping mechanism generating clamping force from zero to an optimal level.« less

Thermal transport across metal–insulator interface via electron–phonon interaction.

PubMed

Zhang, Lifa; Lü, Jing-Tao; Wang, Jian-Sheng; Li, Baowen

2013-11-06

The thermal transport across a metal–insulator interface can be characterized by electron–phonon interaction through which an electron lead is coupled to a phonon lead if phonon–phonon coupling at the interface is very weak. We investigate the thermal conductance and rectification between the electron part and the phonon part using the nonequilibrium Green's function method. It is found that the thermal conductance has a nonmonotonic behavior as a function of average temperature or the coupling strength between the phonon leads in the metal part and the insulator part. The metal–insulator interface shows a clear thermal rectification effect, which can be reversed by a change in average temperature or the electron–phonon coupling.

ANALOG I/O MODULE TEST SYSTEM BASED ON EPICS CA PROTOCOL AND ACTIVEX CA INTERFACE

DOE Office of Scientific and Technical Information (OSTI.GOV)

YENG,YHOFF,L.

2003-10-13

Analog input (ADC) and output (DAC) modules play a substantial role in device level control of accelerator and large experiment physics control system. In order to get the best performance some features of analog modules including linearity, accuracy, crosstalk, thermal drift and so on have to be evaluated during the preliminary design phase. Gain and offset error calibration and thermal drift compensation (if needed) may have to be done in the implementation phase as well. A natural technique for performing these tasks is to interface the analog VO modules and GPIB interface programmable test instruments with a computer, which canmore » complete measurements or calibration automatically. A difficulty is that drivers of analog modules and test instruments usually work on totally different platforms (vxworks VS Windows). Developing new test routines and drivers for testing instruments under VxWorks (or any other RTOS) platform is not a good solution because such systems have relatively poor user interface and developing such software requires substantial effort. EPICS CA protocol and ActiveX CA interface provide another choice, a PC and LabVIEW based test system. Analog 110 module can be interfaced from LabVIEW test routines via ActiveX CA interface. Test instruments can be controlled via LabVIEW drivers, most of which are provided by instrument vendors or by National Instruments. Labview also provides extensive data analysis and process functions. Using these functions, users can generate powerful test routines very easily. Several applications built for Spallation Neutron Source (SNS) Beam Loss Monitor (BLM) system are described in this paper.« less

Thermal conductivity of III-V semiconductor superlattices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mei, S., E-mail: song.mei@wisc.edu; Knezevic, I., E-mail: irena.knezevic@wisc.edu

2015-11-07

This paper presents a semiclassical model for the anisotropic thermal transport in III-V semiconductor superlattices (SLs). An effective interface rms roughness is the only adjustable parameter. Thermal transport inside a layer is described by the Boltzmann transport equation in the relaxation time approximation and is affected by the relevant scattering mechanisms (three-phonon, mass-difference, and dopant and electron scattering of phonons), as well as by diffuse scattering from the interfaces captured via an effective interface scattering rate. The in-plane thermal conductivity is obtained from the layer conductivities connected in parallel. The cross-plane thermal conductivity is calculated from the layer thermal conductivitiesmore » in series with one another and with thermal boundary resistances (TBRs) associated with each interface; the TBRs dominate cross-plane transport. The TBR of each interface is calculated from the transmission coefficient obtained by interpolating between the acoustic mismatch model (AMM) and the diffuse mismatch model (DMM), where the weight of the AMM transmission coefficient is the same wavelength-dependent specularity parameter related to the effective interface rms roughness that is commonly used to describe diffuse interface scattering. The model is applied to multiple III-arsenide superlattices, and the results are in very good agreement with experimental findings. The method is both simple and accurate, easy to implement, and applicable to complicated SL systems, such as the active regions of quantum cascade lasers. It is also valid for other SL material systems with high-quality interfaces and predominantly incoherent phonon transport.« less

Interplay of point defects, biaxial strain, and thermal conductivity in homoepitaxial SrTiO3 thin films

NASA Astrophysics Data System (ADS)

Wiedigen, S.; Kramer, T.; Feuchter, M.; Knorr, I.; Nee, N.; Hoffmann, J.; Kamlah, M.; Volkert, C. A.; Jooss, Ch.

2012-02-01

Separating out effects of point defects and lattice strain on thermal conductivity is essential for improvement of thermoelectric properties of SrTiO3. We study relations between defects generated during deposition, induced lattice strain, and their impact on thermal conductivity κ in homoepitaxial SrTiO3 films prepared by ion-beam sputtering. Lowering the deposition temperature gives rise to lattice expansion by enhancement of point defect density which increases the hardness of the films. Due to a fully coherent substrate-film interface, the lattice misfit induces a large biaxial strain. However, we can show that the temperature dependence of κ is mainly sensitive on the defect concentration.

Thermally matched fluid cooled power converter

DOEpatents

Radosevich, Lawrence D.; Kannenberg, Daniel G.; Kaishian, Steven C.; Beihoff, Bruce C.

2005-06-21

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Evaluation of GeO desorption behavior in the metal∕GeO2∕Ge structure and its improvement of the electrical characteristics

PubMed Central

Oniki, Yusuke; Koumo, Hideo; Iwazaki, Yoshitaka; Ueno, Tomo

2010-01-01

The relation between germanium monoxide (GeO) desorption and either improvement or deterioration in electrical characteristics of metal∕GeO2∕Ge capacitors fabricated by thermal oxidation has been investigated. In the metal∕GeO2∕Ge stack, two processes of GeO desorption at different sites and at different temperatures were observed by thermal desorption spectroscopy measurements. The electrical characteristics of as-oxidized metal∕GeO2∕Ge capacitors shows a large flat-band voltage shift and minority carrier generation due to the GeO desorption from the GeO2∕Ge interface during oxidation of Ge substrates. On the other hand, the electrical properties were drastically improved by a postmetallization annealing at low temperature resulting in a metal catalyzed GeO desorption from the top interface. PMID:20644659

Optical stress generator and detector

DOEpatents

Maris, Humphrey J.; Stoner, Robert J

2001-01-01

Disclosed is a system for the characterization of thin films and interfaces between thin films through measurements of their mechanical and thermal properties. In the system light is absorbed in a thin film or in a structure made up of several thin films, and the change in optical transmission or reflection is measured and analyzed. The change in reflection or transmission is used to give information about the ultrasonic waves that are produced in the structure. The information that is obtained from the use of the measurement methods and apparatus of this invention can include: (a) a determination of the thickness of thin films with a speed and accuracy that is improved compared to earlier methods; (b) a determination of the thermal, elastic, and optical properties of thin films; (c) a determination of the stress in thin films; and (d) a characterization of the properties of interfaces, including the presence of roughness and defects.

Optical stress generator and detector

DOEpatents

Maris, Humphrey J.; Stoner, Robert J.

1998-01-01

Disclosed is a system for the characterization of thin films and interfaces between thin films through measurements of their mechanical and thermal properties. In the system light is absorbed in a thin film or in a structure made up of several thin films, and the change in optical transmission or reflection is measured and analyzed. The change in reflection or transmission is used to give information about the ultrasonic waves that are produced in the structure. The information that is obtained from the use of the measurement methods and apparatus of this invention can include: (a) a determination of the thickness of thin films with a speed and accuracy that is improved compared to earlier methods; (b) a determination of the thermal, elastic, and optical properties of thin films; (c) a determination of the stress in thin films; and (d) a characterization of the properties of interfaces, including the presence of roughness and defects.

Optical stress generator and detector

DOEpatents

Maris, H.J.; Stoner, R.J.

1998-05-05

Disclosed is a system for the characterization of thin films and interfaces between thin films through measurements of their mechanical and thermal properties. In the system light is absorbed in a thin film or in a structure made up of several thin films, and the change in optical transmission or reflection is measured and analyzed. The change in reflection or transmission is used to give information about the ultrasonic waves that are produced in the structure. The information that is obtained from the use of the measurement methods and apparatus of this invention can include: (a) a determination of the thickness of thin films with a speed and accuracy that is improved compared to earlier methods; (b) a determination of the thermal, elastic, and optical properties of thin films; (c) a determination of the stress in thin films; and (d) a characterization of the properties of interfaces, including the presence of roughness and defects. 32 figs.

Optical stress generator and detector

DOEpatents

Maris, Humphrey J.; Stoner, Robert J

2002-01-01

Disclosed is a system for the characterization of thin films and interfaces between thin films through measurements of their mechanical and thermal properties. In the system light is absorbed in a thin film or in a structure made up of several thin films, and the change in optical transmission or reflection is measured and analyzed. The change in reflection or transmission is used to give information about the ultrasonic waves that are produced in the structure. The information that is obtained from the use of the measurement methods and apparatus of this invention can include: (a) a determination of the thickness of thin films with a speed and accuracy that is improved compared to earlier methods; (b) a determination of the thermal, elastic, and optical properties of thin films; (c) a determination of the stress in thin films; and (d) a characterization of the properties of interfaces, including the presence of roughness and defects.

Optical stress generator and detector

DOEpatents

Maris, Humphrey J.; Stoner, Robert J

1999-01-01

Disclosed is a system for the characterization of thin films and interfaces between thin films through measurements of their mechanical and thermal properties. In the system light is absorbed in a thin film or in a structure made up of several thin films, and the change in optical transmission or reflection is measured and analyzed. The change in reflection or transmission is used to give information about the ultrasonic waves that are produced in the structure. The information that is obtained from the use of the measurement methods and apparatus of this invention can include: (a) a determination of the thickness of thin films with a speed and accuracy that is improved compared to earlier methods; (b) a determination of the thermal, elastic, and optical properties of thin films; (c) a determination of the stress in thin films; and (d) a characterization of the properties of interfaces, including the presence of roughness and defects.

Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites.

PubMed

Barako, Michael T; Roy-Panzer, Shilpi; English, Timothy S; Kodama, Takashi; Asheghi, Mehdi; Kenny, Thomas W; Goodson, Kenneth E

2015-09-02

The ability to efficiently and reliably transfer heat between sources and sinks is often a bottleneck in the thermal management of modern energy conversion technologies ranging from microelectronics to thermoelectric power generation. These interfaces contribute parasitic thermal resistances that reduce device performance and are subjected to thermomechanical stresses that degrade device lifetime. Dense arrays of vertically aligned metal nanowires (NWs) offer the unique combination of thermal conductance from the constituent metal and mechanical compliance from the high aspect ratio geometry to increase interfacial heat transfer and device reliability. In the present work, we synthesize copper NW arrays directly onto substrates via templated electrodeposition and extend this technique through the use of a sacrificial overplating layer to achieve improved uniformity. Furthermore, we infiltrate the array with an organic phase change material and demonstrate the preservation of thermal properties. We use the 3ω method to measure the axial thermal conductivity of freestanding copper NW arrays to be as high as 70 W m(-1) K(-1), which is more than an order of magnitude larger than most commercial interface materials and enhanced-conductivity nanocomposites reported in the literature. These arrays are highly anisotropic, and the lateral thermal conductivity is found to be only 1-2 W m(-1) K(-1). We use these measured properties to elucidate the governing array-scale transport mechanisms, which include the effects of morphology and energy carrier scattering from size effects and grain boundaries.

Oxidation- and Creep-Enhanced Fatigue of Haynes 188 Alloy-Oxide Scale System Under Simulated Pulse Detonation Engine Conditions

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Fox, Dennis S.; Miller, Robert A.

2002-01-01

The development of the pulse detonation engine (PDE) requires robust design of the engine components that are capable of enduring harsh detonation environments. In this study, a high cycle thermal fatigue test rig was developed for evaluating candidate PDE combustor materials using a CO2 laser. The high cycle thermal fatigue behavior of Haynes 188 alloy was investigated under an enhanced pulsed laser test condition of 30 Hz cycle frequency (33 ms pulse period, and 10 ms pulse width including 0.2 ms pulse spike). The temperature swings generated by the laser pulses near the specimen surface were characterized by using one-dimensional finite difference modeling combined with experimental measurements. The temperature swings resulted in significant thermal cyclic stresses in the oxide scale/alloy system, and induced extensive surface cracking. Striations of various sizes were observed at the cracked surfaces and oxide/alloy interfaces under the cyclic stresses. The test results indicated that oxidation and creep-enhanced fatigue at the oxide scale/alloy interface was an important mechanism for the surface crack initiation and propagation under the simulated PDE condition.

Superior Thermal Interface via Vertically Aligned Carbon Nanotubes Grown on Graphite Foils

DTIC Science & Technology

2012-01-01

accepted 12 November 2012) In an attempt to study the thermal transport at the interface between nanotubes and graphene, vertically aligned multiwalled...tually increases the thermal barrier in a significant manner. On the other hand, thermal transport properties of thermal tapes and thermally conductive...aforementioned study achieved superior thermal transport properties, the processing and scale-up of the developed process would be prohibitively

Interfacial Thermal Conductance Limit and Thermal Rectification Across Vertical Carbon Nanotube/Graphene Nanoribbon-Silicon Interfaces

DTIC Science & Technology

2013-01-01

Interfacial thermal conductance limit and thermal rectification across vertical carbon nanotube/graphene nanoribbon-silicon interfaces Ajit K...054308 (2013) Investigation on interfacial thermal resistance and phonon scattering at twist boundary of silicon J. Appl. Phys. 113, 053513 (2013...2013 to 00-00-2013 4. TITLE AND SUBTITLE Interfacial thermal conductance limit and thermal rectification across vertical carbon nanotube/graphene

Ultrafast spintronics roadmap: from femtosecond spin current pulses to terahertz non-uniform spin dynamics via nano-confined spin transfer torques (Conference Presentation)

NASA Astrophysics Data System (ADS)

Melnikov, Alexey; Razdolski, Ilya; Alekhin, Alexandr; Ilin, Nikita; Meyburg, Jan; Diesing, Detlef; Roddatis, Vladimir; Rungger, Ivan; Stamenova, Maria; Sanvito, Stefano; Bovensiepen, Uwe

2016-10-01

Further development of spintronics requires miniaturization and reduction of characteristic timescales of spin dynamics combining the nanometer spatial and femtosecond temporal ranges. These demands shift the focus of interest towards the fundamental open question of the interaction of femtosecond spin current (SC) pulses with a ferromagnet (FM). The spatio-temporal properties of the spin transfer torque (STT) exerted by ultrashort SC pulses on the FM open the time domain for studying STT fingerprint on spatially non-uniform magnetization dynamics. Using the sensitivity of magneto-induced second harmonic generation to SC, we develop technique for SC monitoring. With 20 fs resolution, we demonstrate the generation of 250 fs-long SC pulses in Fe/Au/Fe/MgO(001) structures. Their temporal profile indicates (i) nearly-ballistic hot electron transport in Au and (ii) that the pulse duration is primarily determined by the thermalization time of laser-excited hot carriers in Fe. Together with strongly spin-dependent Fe/Au interface transmission calculated for these carriers, this suggests the non-thermal spin-dependent Seebeck effect dominating the generation of ultrashort SC pulses. The analysis of SC transmission/reflection at the Au/Fe interface shows that hot electron spins orthogonal to the Fe magnetization rotate gaining huge parallel (anti-parallel) projection in transmitted (reflected) SC. This is accompanied by a STT-induced perturbation of the magnetization localized at the interface, which excites the inhomogeneous high-frequency spin dynamics in the FM. Time-resolved magneto-optical studies reveal the excitation of several standing spin wave modes in the Fe film with their spectrum extending up to 0.6 THz and indicating the STT spatial confinement to 2 nm.

Thermal system design and modeling of meniscus controlled silicon growth process for solar applications

NASA Astrophysics Data System (ADS)

Wang, Chenlei

The direct conversion of solar radiation to electricity by photovoltaics has a number of significant advantages as an electricity generator. That is, solar photovoltaic conversion systems tap an inexhaustible resource which is free of charge and available anywhere in the world. Roofing tile photovoltaic generation, for example, saves excess thermal heat and preserves the local heat balance. This means that a considerable reduction of thermal pollution in densely populated city areas can be attained. A semiconductor can only convert photons with the energy of the band gap with good efficiency. It is known that silicon is not at the maximum efficiency but relatively close to it. There are several main parts for the photovoltaic materials, which include, single- and poly-crystalline silicon, ribbon silicon, crystalline thin-film silicon, amorphous silicon, copper indium diselenide and related compounds, cadmium telluride, et al. In this dissertation, we focus on melt growth of the single- and poly-crystalline silicon manufactured by Czochralski (Cz) crystal growth process, and ribbon silicon produced by the edge-defined film-fed growth (EFG) process. These two methods are the most commonly used techniques for growing photovoltaic semiconductors. For each crystal growth process, we introduce the growth mechanism, growth system design, general application, and progress in the numerical simulation. Simulation results are shown for both Czochralski and EFG systems including temperature distribution of the growth system, velocity field inside the silicon melt and electromagnetic field for the EFG growth system. Magnetic field is applied on Cz system to reduce the melt convection inside crucible and this has been simulated in our numerical model. Parametric studies are performed through numerical and analytical models to investigate the relationship between heater power levels and solidification interface movement and shape. An inverse problem control scheme is developed to control the solidification interface of Cz system by adjusting heater powers. For the EFG system, parametric studies are performed to discuss the effect of several growth parameters including window opening size, argon gas flow rate and growth thermal environment on the temperature distribution, silicon tube thickness and pulling rate. Two local models are developed and integrated with the global model to investigate the detailed transport phenomena in a small region around the solidification interface including silicon crystal, silicon melt, free surface, liquid-solid interface and graphite die design. Different convection forms are taken into consideration.

Thermal Characterization of Nanostructures and Advanced Engineered Materials

NASA Astrophysics Data System (ADS)

Goyal, Vivek Kumar

Continuous downscaling of Si complementary metal-oxide semiconductor (CMOS) technology and progress in high-power electronics demand more efficient heat removal techniques to handle the increasing power density and rising temperature of hot spots. For this reason, it is important to investigate thermal properties of materials at nanometer scale and identify materials with the extremely large or extremely low thermal conductivity for applications as heat spreaders or heat insulators in the next generation of integrated circuits. The thin films used in microelectronic and photonic devices need to have high thermal conductivity in order to transfer the dissipated power to heat sinks more effectively. On the other hand, thermoelectric devices call for materials or structures with low thermal conductivity because the performance of thermoelectric devices is determined by the figure of merit Z=S2sigma/K, where S is the Seebeck coefficient, K and sigma are the thermal and electrical conductivity, respectively. Nanostructured superlattices can have drastically reduced thermal conductivity as compared to their bulk counterparts making them promising candidates for high-efficiency thermoelectric materials. Other applications calling for thin films with low thermal conductivity value are high-temperature coatings for engines. Thus, materials with both high thermal conductivity and low thermal conductivity are technologically important. The increasing temperature of the hot spots in state-of-the-art chips stimulates the search for innovative methods for heat removal. One promising approach is to incorporate materials, which have high thermal conductivity into the chip design. Two suitable candidates for such applications are diamond and graphene. Another approach is to integrate the high-efficiency thermoelectric elements for on-spot cooling. In addition, there is strong motivation for improved thermal interface materials (TIMs) for heat transfer from the heat-generating chip to heat-sinking units. This dissertation presents results of the experimental investigation and theoretical interpretation of thermal transport in the advanced engineered materials, which include thin films for thermal management of nanoscale devices, nanostructured superlattices as promising candidates for high-efficiency thermoelectric materials, and improved TIMs with graphene and metal particles as fillers providing enhanced thermal conductivity. The advanced engineered materials studied include chemical vapor deposition (CVD) grown ultrananocrystalline diamond (UNCD) and microcrystalline diamond (MCD) films on Si substrates, directly integrated nanocrystalline diamond (NCD) films on GaN, free-standing polycrystalline graphene (PCG) films, graphene oxide (GOx) films, and "pseudo-superlattices" of the mechanically exfoliated Bi2Te3 topological insulator films, and thermal interface materials (TIMs) with graphene fillers.

Silicide/Silicon Hetero-Junction Structure for Thermoelectric Applications.

PubMed

Jun, Dongsuk; Kim, Soojung; Choi, Wonchul; Kim, Junsoo; Zyung, Taehyoung; Jang, Moongyu

2015-10-01

We fabricated silicide/silicon hetero-junction structured thermoelectric device by CMOS process for the reduction of thermal conductivity with the scatterings of phonons at silicide/silicon interfaces. Electrical conductivities, Seebeck coefficients, power factors, and temperature differences are evaluated using the steady state analysis method. Platinum silicide/silicon multilayered structure showed an enhanced Seebeck coefficient and power factor characteristics, which was considered for p-leg element. Also, erbium silicide/silicon structure showed an enhanced Seebeck coefficient, which was considered for an n-leg element. Silicide/silicon multilayered structure is promising for thermoelectric applications by reducing thermal conductivity with an enhanced Seebeck coefficient. However, because of the high thermal conductivity of the silicon packing during thermal gradient is not a problem any temperature difference. Therefore, requires more testing and analysis in order to overcome this problem. Thermoelectric generators are devices that based on the Seebeck effect, convert temperature differences into electrical energy. Although thermoelectric phenomena have been used for heating and cooling applications quite extensively, it is only in recent years that interest has increased in energy generation.

Transfer of control system interface solutions from other domains to the thermal power industry.

PubMed

Bligård, L-O; Andersson, J; Osvalder, A-L

2012-01-01

In a thermal power plant the operators' roles are to control and monitor the process to achieve efficient and safe production. To achieve this, the human-machine interfaces have a central part. The interfaces need to be updated and upgraded together with the technical functionality to maintain optimal operation. One way of achieving relevant updates is to study other domains and see how they have solved similar issues in their design solutions. The purpose of this paper is to present how interface design solution ideas can be transferred from domains with operator control to thermal power plants. In the study 15 domains were compared using a model for categorisation of human-machine systems. The result from the domain comparison showed that nuclear power, refinery and ship engine control were most similar to thermal power control. From the findings a basic interface structure and three specific display solutions were proposed for thermal power control: process parameter overview, plant overview, and feed water view. The systematic comparison of the properties of a human-machine system allowed interface designers to find suitable objects, structures and navigation logics in a range of domains that could be transferred to the thermal power domain.

A technique for the optical analysis of deformed telescope mirrors

NASA Technical Reports Server (NTRS)

Bolton, John F.

1986-01-01

The NASTRAN-ACCOS V programs' interface merges structural and optical analysis capabilities in order to characterize the performance of the NASA Goddard Space Flight Center's Solar Optical Telescope primary mirror, which has a large diameter/thickness ratio. The first step in the optical analysis is to use NASTRAN's FEM to model the primary mirror, simulating any distortions due to gravitation, thermal gradients, and coefficient of thermal expansion nonuniformities. NASTRAN outputs are then converted into an ACCOS V-acceptable form; ACCOS V generates the deformed optical surface on the basis of these inputs, and imaging qualities can be determined.

Linked gas chromatograph-thermal energy analyzer/ion trap mass spectrometer

DOE Office of Scientific and Technical Information (OSTI.GOV)

Alcaraz, A.; Martin, W.H.; Andresen, B.D.

1991-05-01

The capability of comparing a nitrogen chromatogram generated from a gas chromatograph (GC, Varian model 3400) linked to a thermal energy analyzer (TEA, Thermedics Inc. Model 610) with a total ion chromatogram (from a Finnigan-MAT Ion Trap Mass Spectrometer, ITMS) has provided a new means to screen and identifying trace levels of nitrogen-containing compounds in complex mixtures. Prior to the work described here, it has not been possible to simultaneously acquire TEA and MS data. What was needed was a viable GC-TEA/ITMS interface to combine the capabilities of both instruments. 4 figs.

Large Advanced Space Systems (LASS) computer-aided design program additions

NASA Technical Reports Server (NTRS)

Farrell, C. E.

1982-01-01

The LSS preliminary and conceptual design requires extensive iteractive analysis because of the effects of structural, thermal, and control intercoupling. A computer aided design program that will permit integrating and interfacing of required large space system (LSS) analyses is discussed. The primary objective of this program is the implementation of modeling techniques and analysis algorithms that permit interactive design and tradeoff studies of LSS concepts. Eight software modules were added to the program. The existing rigid body controls module was modified to include solar pressure effects. The new model generator modules and appendage synthesizer module are integrated (interfaced) to permit interactive definition and generation of LSS concepts. The mass properties module permits interactive specification of discrete masses and their locations. The other modules permit interactive analysis of orbital transfer requirements, antenna primary beam n, and attitude control requirements.

Magnon Mode Selective Spin Transport in Compensated Ferrimagnets.

PubMed

Cramer, Joel; Guo, Er-Jia; Geprägs, Stephan; Kehlberger, Andreas; Ivanov, Yurii P; Ganzhorn, Kathrin; Della Coletta, Francesco; Althammer, Matthias; Huebl, Hans; Gross, Rudolf; Kosel, Jürgen; Kläui, Mathias; Goennenwein, Sebastian T B

2017-06-14

We investigate the generation of magnonic thermal spin currents and their mode selective spin transport across interfaces in insulating, compensated ferrimagnet/normal metal bilayer systems. The spin Seebeck effect signal exhibits a nonmonotonic temperature dependence with two sign changes of the detected voltage signals. Using different ferrimagnetic garnets, we demonstrate the universality of the observed complex temperature dependence of the spin Seebeck effect. To understand its origin, we systematically vary the interface between the ferrimagnetic garnet and the metallic layer, and by using different metal layers we establish that interface effects play a dominating role. They do not only modify the magnitude of the spin Seebeck effect signal but in particular also alter its temperature dependence. By varying the temperature, we can select the dominating magnon mode and we analyze our results to reveal the mode selective interface transmission probabilities for different magnon modes and interfaces. The comparison of selected systems reveals semiquantitative details of the interfacial coupling depending on the materials involved, supported by the obtained field dependence of the signal.

Molecular modeling studies of structural properties of polyvinyl alcohol: a comparative study using INTERFACE force field.

PubMed

Radosinski, Lukasz; Labus, Karolina

2017-10-05

Polyvinyl alcohol (PVA) is a material with a variety of applications in separation, biotechnology, and biomedicine. Using combined Monte Carlo and molecular dynamics techniques, we present an extensive comparative study of second- and third-generation force fields Universal, COMPASS, COMPASS II, PCFF, and the newly developed INTERFACE, as applied to this system. In particular, we show that an INTERFACE force field provides a possibility of composing a reliable atomistic model to reproduce density change of PVA matrix in a narrow temperature range (298-348 K) and calculate a thermal expansion coefficient with reasonable accuracy. Thus, the INTERFACE force field may be used to predict mechanical properties of the PVA system, being a scaffold for hydrogels, with much greater accuracy than latter approaches. Graphical abstract Molecular Dynamics and Monte Carlo studies indicate that it is possible to predict properties of the PVA in narrow temperature range by using the INTERFACE force field.

Impacts and Awards | Transportation Research | NREL

Science.gov Websites

for Si-based materials and the electrochemical lithiation and delithiation of the coated materials -cooling lab equipment New Thermal Interface Materials Deliver Ultralow Thermal Resistance for Compact Electronics Graphic of data chart showing thermal contact resistances at various interfaces. Optical Thermal

Trap density of GeNx/Ge interface fabricated by electron-cyclotron-resonance plasma nitridation

NASA Astrophysics Data System (ADS)

Fukuda, Yukio; Otani, Yohei; Toyota, Hiroshi; Ono, Toshiro

2011-07-01

We have investigated GeNx/Ge interface properties using Si3N4(7 nm)/GeNx(2 nm)/Ge metal-insulator-semiconductor structures fabricated by the plasma nitridation of Ge substrates using an electron-cyclotron-resonance-generated nitrogen plasma. The interface trap density (Dit) measured by the conductance method is found to be distributed symmetrically in the Ge band gap with a minimum Dit value lower than 3 × 1011 cm-2eV-1 near the midgap. This result may lead to the development of processes for the fabrication of p- and n-Ge Schottky-barrier (SB) source/drain metal-insulator-semiconductor field-effect transistors using chemically and thermally robust GeNx dielectrics as interlayers for SB source/drain contacts and high-κ gate dielectrics.

Thermally Induced Interdiffusion and Precipitation in a Ni/Ni 3 Al System

DOE PAGES

Sun, C.; Martinez, E.; Aguiar, J. A.; ...

2015-05-20

Ordered Ni 3Al intermetallic precipitates constitute the main hardening sources of Ni-based superalloys. Here, we report the interdiffusion and precipitation behavior in a Ni/Ni3Al model system. The deposition of Ni3Al on a pure Ni layer at 500°C generated L12-structured γ' (Ni3Al) precipitates, preferentially at the interface. After annealing at 800°C for 1 h, interdiffusion between Ni and Ni3Al layers occurred, and the γ' precipitates that grew near the parent Ni/Ni 3Al interface are ~2.8 times larger in size than those formed in the matrix. In conclusion, Monte Carlo simulations indicate that vacancies preferentially diffuse along the Ni/Ni 3Al interface, increasingmore » the probability of precipitation.« less

Integrated thermal disturbance analysis of optical system of astronomical telescope

NASA Astrophysics Data System (ADS)

Yang, Dehua; Jiang, Zibo; Li, Xinnan

2008-07-01

During operation, astronomical telescope will undergo thermal disturbance, especially more serious in solar telescope, which may cause degradation of image quality. As drives careful thermal load investigation and measure applied to assess its effect on final image quality during design phase. Integrated modeling analysis is boosting the process to find comprehensive optimum design scheme by software simulation. In this paper, we focus on the Finite Element Analysis (FEA) software-ANSYS-for thermal disturbance analysis and the optical design software-ZEMAX-for optical system design. The integrated model based on ANSYS and ZEMAX is briefed in the first from an overview of point. Afterwards, we discuss the establishment of thermal model. Complete power series polynomial with spatial coordinates is introduced to present temperature field analytically. We also borrow linear interpolation technique derived from shape function in finite element theory to interface the thermal model and structural model and further to apply the temperatures onto structural model nodes. Thereby, the thermal loads are transferred with as high fidelity as possible. Data interface and communication between the two softwares are discussed mainly on mirror surfaces and hence on the optical figure representation and transformation. We compare and comment the two different methods, Zernike polynomials and power series expansion, for representing and transforming deformed optical surface to ZEMAX. Additionally, these methods applied to surface with non-circular aperture are discussed. At the end, an optical telescope with parabolic primary mirror of 900 mm in diameter is analyzed to illustrate the above discussion. Finite Element Model with most interested parts of the telescope is generated in ANSYS with necessary structural simplification and equivalence. Thermal analysis is performed and the resulted positions and figures of the optics are to be retrieved and transferred to ZEMAX, and thus final image quality is evaluated with thermal disturbance.

Effects of interfaces on the thermal conductivity in Si/Si0.75Ge0.25 multilayer with varying Au layers

NASA Astrophysics Data System (ADS)

Hu, Yangsen; Wu, Zhenghua; Ye, Fengjie; Hu, Zhiyu

2018-02-01

The manoeuvre of thermal transport property across multilayer films with inserted metal layers through controlling the metal-nonmetal interfaces is of fundamental interest. In this work, amorphous Si/Si0.75Ge0.25 multilayer films inserted with varying Au layers were fabricated by magnetron sputtering. The structure and sharp interface of multilayers films were characterized by low angle x-ray diffraction (LAXRD), grazing incidence small angle x-ray scattering (GISAXS) and scanning electron microscopy (SEM). A differential 3ω method was applied to measure the effective thermal conductivity. The measurements show that thermal conductivity has changed as varying Au layers. Thermal conductivity increased from 0.94 to 1.31 Wm-1K-1 while Si0.75Ge0.25 layer was replaced by different Au layers, which was attributed to the strong electron-phonon coupling and interface thermal resistance in a metal-nonmetal multilayered system. Theoretical calculation combined with experimental results indicate that the thermal conductivity of the multilayer film could be facilely controlled by introducing different number of nanoconstructed metal-nonmetal interfaces, which provide a more insightful understanding of the thermal transport manipulation mechanism of the thin film system with inserting metal layers.

Phonon-interface scattering in multilayer graphene on an amorphous support

PubMed Central

Sadeghi, Mir Mohammad; Jo, Insun; Shi, Li

2013-01-01

The recent studies of thermal transport in suspended, supported, and encased graphene just began to uncover the richness of two-dimensional phonon physics, which is relevant to the performance and reliability of graphene-based functional materials and devices. Among the outstanding questions are the exact causes of the suppressed basal-plane thermal conductivity measured in graphene in contact with an amorphous material, and the layer thickness needed for supported or embedded multilayer graphene (MLG) to recover the high thermal conductivity of graphite. Here we use sensitive in-plane thermal transport measurements of graphene samples on amorphous silicon dioxide to show that full recovery to the thermal conductivity of the natural graphite source has yet to occur even after the MLG thickness is increased to 34 layers, considerably thicker than previously thought. This seemingly surprising finding is explained by long intrinsic scattering mean free paths of phonons in graphite along both basal-plane and cross-plane directions, as well as partially diffuse scattering of MLG phonons by the MLG-amorphous support interface, which is treated by an interface scattering model developed for highly anisotropic materials. Based on the phonon transmission coefficient calculated from reported experimental thermal interface conductance results, phonons emerging from the interface consist of a large component that is scattered across the interface, making rational choice of the support materials a potential approach to increasing the thermal conductivity of supported MLG. PMID:24067656

The Development of Dispatcher Training Simulator in a Thermal Energy Generation System

NASA Astrophysics Data System (ADS)

Hakim, D. L.; Abdullah, A. G.; Mulyadi, Y.; Hasan, B.

2018-01-01

A dispatcher training simulator (DTS) is a real-time Human Machine Interface (HMI)-based control tool that is able to visualize industrial control system processes. The present study was aimed at developing a simulator tool for boilers in a thermal power station. The DTS prototype was designed using technical data of thermal power station boilers in Indonesia. It was then designed and implemented in Wonderware Intouch 10. The resulting simulator came with component drawing, animation, control display, alarm system, real-time trend, historical trend. This application used 26 tagnames and was equipped with a security system. The test showed that the principles of real-time control worked well. It is expected that this research could significantly contribute to the development of thermal power station, particularly in terms of its application as a training simulator for beginning dispatchers.

Thermal Protection Supplement for Reducing Interface Thermal Mismatch

NASA Technical Reports Server (NTRS)

Stewart, David A. (Inventor); Leiser, Daniel B. (Inventor)

2017-01-01

A thermal protection system that reduces a mismatch of thermal expansion coefficients CTE between a first material layer (CTE1) and a second material layer (CTE2) at a first layer-second layer interface. A portion of aluminum borosilicate (abs) or another suitable additive (add), whose CTE value, CTE(add), satisfies (CTE(add)-CTE1)(CTE(add)-CTE2)<0, is distributed with variable additive density,.rho.(z;add), in the first material layer and/or in the second material layer, with.rho.(z;add) near the materials interface being relatively high (alternatively, relatively low) and.rho.(z;add) in a region spaced apart from the interface being relatively low (alternatively, relatively high).

Time Dependent Frictional Changes in Ice due to Contact Area Changes

NASA Astrophysics Data System (ADS)

Sevostianov, V.; Lipovsky, B. P.; Rubinstein, S.; Dillavou, S.

2017-12-01

Sliding processes along the ice-bed interface of Earth's great ice sheets are the largest contributor to our uncertainty in future sea level rise. Laboratory experiments that have probed sliding processes have ubiquitously shown that ice-rock interfaces strengthen while in stationary contact (Schulson and Fortt, 2013; Zoet et al., 2013; McCarthy et al., 2017). This so-called frictional ageing effect may have profound consequences for ice sheet dynamics because it introduces the possibility of basal strength hysteresis. Furthermore this effect is quite strong in ice-rock interfaces (more than an order of magnitude more pronounced than in rock-rock sliding) and can double in frictional strength in a matter of minutes, much faster than most frictional aging (Dieterich, 1972; Baumberger and Caroli, 2006). Despite this importance, the underling physics of frictional ageing of ice remain poorly understood. Here we conduct laboratory experiments to image the microscopic points of contact along an ice-glass interface. We optically measure changes in the real area of contact over time using measurements of this reflected optical light intensity. We show that contact area increases with time of stationary contact. This result suggests that thermally enhanced creep of microscopic icy contacts is responsible for the much larger frictional ageing observed in ice-rock versus rock-rock interfaces. Furthermore, this supports a more physically detailed description of the thermal dependence of basal sliding than that used in the current generation of large scale ice sheet models.

Ion irradiation of the native oxide/silicon surface increases the thermal boundary conductance across aluminum/silicon interfaces

NASA Astrophysics Data System (ADS)

Gorham, Caroline S.; Hattar, Khalid; Cheaito, Ramez; Duda, John C.; Gaskins, John T.; Beechem, Thomas E.; Ihlefeld, Jon F.; Biedermann, Laura B.; Piekos, Edward S.; Medlin, Douglas L.; Hopkins, Patrick E.

2014-07-01

The thermal boundary conductance across solid-solid interfaces can be affected by the physical properties of the solid boundary. Atomic composition, disorder, and bonding between materials can result in large deviations in the phonon scattering mechanisms contributing to thermal boundary conductance. Theoretical and computational studies have suggested that the mixing of atoms around an interface can lead to an increase in thermal boundary conductance by creating a region with an average vibrational spectra of the two materials forming the interface. In this paper, we experimentally demonstrate that ion irradiation and subsequent modification of atoms at solid surfaces can increase the thermal boundary conductance across solid interfaces due to a change in the acoustic impedance of the surface. We measure the thermal boundary conductance between thin aluminum films and silicon substrates with native silicon dioxide layers that have been subjected to proton irradiation and post-irradiation surface cleaning procedures. The thermal boundary conductance across the Al/native oxide/Si interfacial region increases with an increase in proton dose. Supported with statistical simulations, we hypothesize that ion beam mixing of the native oxide and silicon substrate within ˜2.2nm of the silicon surface results in the observed increase in thermal boundary conductance. This ion mixing leads to the spatial gradation of the silicon native oxide into the silicon substrate, which alters the acoustic impedance and vibrational characteristics at the interface of the aluminum film and native oxide/silicon substrate. We confirm this assertion with picosecond acoustic analyses. Our results demonstrate that under specific conditions, a "more disordered and defected" interfacial region can have a lower resistance than a more "perfect" interface.

Effect of graphene nanofillers on the enhanced thermoelectric properties of Bi2Te3 nanosheets: elucidating the role of interface in de-coupling the electrical and thermal characteristics

NASA Astrophysics Data System (ADS)

Kumar, Sunil; Singh, Simrjit; Dhawan, Punit Kumar; Yadav, R. R.; Khare, Neeraj

2018-04-01

In this report, we investigate the effect of graphene nanofillers on the thermoelectric properties of Bi2Te3 nanosheets and demonstrate the role of interface for enhancing the overall figure of merit (ZT) ∼ 53%. The enhancement in the ZT is obtained due to an increase in the electrical conductivity (∼111%) and decrease in the thermal conductivity (∼12%) resulting from increased conducting channels and phonon scattering, respectively at the interfaces between graphene and Bi2Te3 nanosheets. A detailed analysis of the thermal conductivity reveals ∼4 times decrease in the lattice thermal conductivity in contrast to ∼2 times increase in the electronic thermal conductivity after the addition of graphene. Kelvin probe measurements have also been carried which reveals presence of low potential barrier at the interface between graphene and Bi2Te3 nanosheets which assist the flow of charge carriers thereby, increasing the mobility of the carriers. Thus, our results reveals a significant decrease in the lattice thermal conductivity (due to the formation of interfaces) and increase in the electron mobility (due to conducting paths at the interfaces) strongly participate in deciding observed enhancement in the thermoelectric figure of merit.

Effect of graphene nanofillers on the enhanced thermoelectric properties of Bi2Te3 nanosheets: elucidating the role of interface in de-coupling the electrical and thermal characteristics.

PubMed

Kumar, Sunil; Singh, Simrjit; Dhawan, Punit Kumar; Yadav, R R; Khare, Neeraj

2018-04-03

In this report, we investigate the effect of graphene nanofillers on the thermoelectric properties of Bi 2 Te 3 nanosheets and demonstrate the role of interface for enhancing the overall figure of merit (ZT) ∼ 53%. The enhancement in the ZT is obtained due to an increase in the electrical conductivity (∼111%) and decrease in the thermal conductivity (∼12%) resulting from increased conducting channels and phonon scattering, respectively at the interfaces between graphene and Bi 2 Te 3 nanosheets. A detailed analysis of the thermal conductivity reveals ∼4 times decrease in the lattice thermal conductivity in contrast to ∼2 times increase in the electronic thermal conductivity after the addition of graphene. Kelvin probe measurements have also been carried which reveals presence of low potential barrier at the interface between graphene and Bi 2 Te 3 nanosheets which assist the flow of charge carriers thereby, increasing the mobility of the carriers. Thus, our results reveals a significant decrease in the lattice thermal conductivity (due to the formation of interfaces) and increase in the electron mobility (due to conducting paths at the interfaces) strongly participate in deciding observed enhancement in the thermoelectric figure of merit.

General theories and features of interfacial thermal transport

NASA Astrophysics Data System (ADS)

Zhou, Hangbo; Zhang, Gang

2018-03-01

A clear understanding and proper control of interfacial thermal transport is important in nanoscale device. In this review, we first discuss the theoretical methods to handle the interfacial thermal transport problem, such as the macroscopic model, molecular dynamics, lattice dynamics and modern quantum transport theories. Then we discuss various effects that can significantly affect the interfacial thermal transport, such as the formation of chemical bonds at interface, defects and interface roughness, strain and substrates, atomic species and mass ratios, structural orientations. Then importantly, we analyze the role of inelastic scatterings at the interface, and discuss its application in thermal rectifications. Finally, the challenges and promising directions are discussed.

Thermal conductance of metal–diamond interfaces at high pressure

DOE PAGES

Hohensee, Gregory T.; Wilson, R. B.; Cahill, David G.

2015-03-06

The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two phonon-processes. The high pressures achievable in a diamond anvil cell can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. Here we report time-domain thermoreflectance measurements of metal-diamond interface thermal conductance up to 50 GPa in the DAC for Pb, Au 0.95Pd 0.05, Pt, and Al films deposited on Type 1A natural [100] and Type 2A synthetic [110] diamond anvils. Inmore » all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. Lastly, our results suggest that anharmonic conductance at metal-diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon.« less

An Investigation into the Effects of Interface Stress and Interfacial Arrangement on Temperature Dependent Thermal Properties of a Biological and a Biomimetic Material

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tomar, Vikas

2015-01-12

A significant effort in the biomimetic materials research is on developing materials that can mimic and function in the same way as biological tissues, on bio-inspired electronic circuits, on bio-inspired flight structures, on bio-mimetic materials processing, and on structural biomimetic materials, etc. Most structural biological and biomimetic material properties are affected by two primary factors: (1) interfacial interactions between an organic and an inorganic phase usually in the form of interactions between an inorganic mineral phase and organic protein network; and (2) structural arrangement of the constituents. Examples are exoskeleton structures such as spicule, nacre, and crustacean exoskeletons. A significantmore » effort is being directed towards making synthetic biomimetic materials based on a manipulation of the above two primary factors. The proposed research is based on a hypothesis that in synthetic materials with biomimetic morphology thermal conductivity, k, (how fast heat is carried away) and thermal diffusivity, D, (how fast a material’s temperature rises: proportional to the ratio of k and heat capacity) can be engineered to be either significantly low or significantly high based on a combination of chosen interface orientation and interfacial arrangement in comparison to conventional material microstructures with the same phases and phase volume fractions. METHOD DEVELOPMENT 1. We have established a combined Raman spectroscopy and nanomechanical loading based experimental framework to perform environment (liquid vs. air vs. vacuum) dependent and temperature dependent (~1000 degree-C) in-situ thermal diffusivity measurements in biomaterials at nanoscale to micron scale along with the corresponding analytical theoretic calculations. (Zhang and Tomar, 2013) 2. We have also established a new classical molecular simulation based framework to measure thermal diffusivity in biomolecular interfaces. We are writing a publication currently (Qu and Tomar, 2013) to report the framework and findings in tropocollagen-hydroxyapatite based idealized biomaterial interfaces. PHYSICAL FINDINGS 1. Analyses using experiments have revealed that in the case of bone thermal conductivity and thermal diffusivity at micron scale shows significant dependence on compressive stress and temperature. Overall, there is a decrease with respect to increase in temperature and increase with respect to increase in compressive stress. Bio-molecular simulations on idealized tropocollagen-hydroxyapatite interfaces confirm such findings. However, simulations also reveal that thermal diffusivity and thermal conductivity can be significantly tailored by interfacial orientation. More importantly, in inorganic materials, interfaces contribute to reduce thermal conductivity and diffusivity. However, analyses here reveal that both can be increased despite presence of a lot of interfaces. 2. Based on significant role played by interfaces in affecting bone thermal properties, a crustacean-exoskeleton system is examined for thermal diffusivity using the newly developed setup. Special emphasis here is on this system since such arrangement is found to be common in fresh water shrimp as well as in some deep water organisms surviving in environment extremes. Experiments reveal that in such system thermal diffusivity is highly tailorable. 3. Overall, experiments and models have established that in biomaterial interfaces a counterintuitive role of interfaces in mediating thermal conduction as a function of stress and temperature is possible in contrast to inorganic materials where interfaces almost always lead to reduction of thermal conductivity as a function of such factors. More investigations are underway to reveal physical origins of such counter-physical characteristics. Such principles can be significantly useful in developing new and innovative bioenergy and inorganic energy systems where heat dissipation significantly affects system performance.« less

Enhanced energy transport owing to nonlinear interface interaction

PubMed Central

Su, Ruixia; Yuan, Zongqiang; Wang, Jun; Zheng, Zhigang

2016-01-01

It is generally expected that the interface coupling leads to the suppression of thermal transport through coupled nanostructures due to the additional interface phonon-phonon scattering. However, recent experiments demonstrated that the interface van der Waals interactions can significantly enhance the thermal transfer of bonding boron nanoribbons compared to a single freestanding nanoribbon. To obtain a more in-depth understanding on the important role of the nonlinear interface coupling in the heat transports, in the present paper, we explore the effect of nonlinearity in the interface interaction on the phonon transport by studying the coupled one-dimensional (1D) Frenkel-Kontorova lattices. It is found that the thermal conductivity increases with increasing interface nonlinear intensity for weak inter-chain nonlinearity. By developing the effective phonon theory of coupled systems, we calculate the dependence of heat conductivity on interfacial nonlinearity in weak inter-chain couplings regime which is qualitatively in good agreement with the result obtained from molecular dynamics simulations. Moreover, we demonstrate that, with increasing interface nonlinear intensity, the system dimensionless nonlinearity strength is reduced, which in turn gives rise to the enhancement of thermal conductivity. Our results pave the way for manipulating the energy transport through coupled nanostructures for future emerging applications. PMID:26787363

Burner liner thermal-structural load modeling

NASA Technical Reports Server (NTRS)

Maffeo, R.

1986-01-01

The software package Transfer Analysis Code to Interface Thermal/Structural Problems (TRANCITS) was developed. The TRANCITS code is used to interface temperature data between thermal and structural analytical models. The use of this transfer module allows the heat transfer analyst to select the thermal mesh density and thermal analysis code best suited to solve the thermal problem and gives the same freedoms to the stress analyst, without the efficiency penalties associated with common meshes and the accuracy penalties associated with the manual transfer of thermal data.

Parallel Fin ORU Thermal Interface for space applications. [Orbital Replaceable Unit

NASA Technical Reports Server (NTRS)

Stobb, C. A.; Limardo, Jose G.

1992-01-01

The Parallel Fin Thermal Interface has been developed as an Orbital Replaceable Unit (ORU) interface. The interface transfers heat from an ORU baseplate to a Heat Acquisition Plate (HAP) through pairs of fins sandwiched between insert plates that press against the fins with uniform pressure. The insert plates are spread apart for ORU baseplate separation and replacement. Two prototype interfaces with different fin dimensions were built (Model 140 and 380). Interfacing surface samples were found to have roughnesses of 56 to 89 nm. Conductance values of 267 to 420 W/sq m C were obtained for the 140 model in vacuum with interface pressures of 131 to 262 kPa (19 to 38 psi). Vacuum conductances ranging from 176 to 267 W/sq m F were obtained for the 380 model at interface pressures of 97 to 152 kPa (14 and 22 psi). Correlations from several sources were found to agree with test data within 20 percent using thermal math models of the interfaces.

Trajectory and Aeroheating Environment Development and Sensitivity Analysis for Capsule-shaped Vehicles

NASA Technical Reports Server (NTRS)

Robinson, Jeffrey S.; Wurster, Kathryn E.

2006-01-01

Recently, NASA's Exploration Systems Research and Technology Project funded several tasks that endeavored to develop and evaluate various thermal protection systems and high temperature material concepts for potential use on the crew exploration vehicle. In support of these tasks, NASA Langley's Vehicle Analysis Branch generated trajectory information and associated aeroheating environments for more than 60 unique entry cases. Using the Apollo Command Module as the baseline entry system because of its relevance to the favored crew exploration vehicle design, trajectories for a range of lunar and Mars return, direct and aerocapture Earth-entry scenarios were developed. For direct entry, a matrix of cases was created that reflects reasonably expected minimum and maximum values of vehicle ballistic coefficient, inertial velocity at entry interface, and inertial flight path angle at entry interface. For aerocapture, trajectories were generated for a range of values of initial velocity and ballistic coefficient that, when combined with proper initial flight path angles, resulted in achieving a low Earth orbit either by employing a full lift vector up or full lift vector down attitude. For each trajectory generated, aeroheating environments were generated which were intended to bound the thermal protection system requirements for likely crew exploration vehicle concepts. The trades examined clearly pointed to a range of missions / concepts that will require ablative systems as well as a range for which reusable systems may be feasible. In addition, the results clearly indicated those entry conditions and modes suitable for manned flight, considering vehicle deceleration levels experienced during entry. This paper presents an overview of the analysis performed, including the assumptions, methods, and general approach used, as well as a summary of the trajectory and aerothermal environment information that was generated.

Effect of van der Waals forces on thermal conductance at the interface of a single-wall carbon nanotube array and silicon

NASA Astrophysics Data System (ADS)

Feng, Ya; Zhu, Jie; Tang, Dawei

2014-12-01

Molecular dynamics simulations are performed to evaluate the effect of van der Waals forces among single-wall carbon nanotubes (SWNTs) on the interfacial thermal conductance between a SWNT array and silicon substrate. First, samples of SWNTs vertically aligned on silicon substrate are simulated, where both the number and arrangement of SWNTs are varied. Results reveal that the interfacial thermal conductance of a SWNT array/Si with van der Waals forces present is higher than when they are absent. To better understand how van der Waals forces affect heat transfer through the interface between SWNTs and silicon, further constructs of one SWNT surrounded by different numbers of other ones are studied, and the results show that the interfacial thermal conductance of the central SWNT increases with increasing van der Waals forces. Through analysis of the covalent bonds and vibrational density of states at the interface, we find that heat transfer across the interface is enhanced with a greater number of chemical bonds and that improved vibrational coupling of the two sides of the interface results in higher interfacial thermal conductance. Van der Waals forces stimulate heat transfer at the interface.

Experimental Investigation on Thermal Effects in Ultrasonic Joining of Thin Poly(ethylene terephthalate) Films Using Torsional Vibrations

NASA Astrophysics Data System (ADS)

Adachi, Kazunari; Uchiyama, Kenta; Kuriyama, Takashi; Miyata, Ken; Hisamatsu, Tokuro

2009-11-01

The authors previously determined that thermal effects are not a dominant factor in the ultrasonic joining of very low density polyethylene (VLDPE) films using torsional vibration. Now, to confirm that the plastic materials are not “melted” by mechanically generated heat in the joining, they have conducted joining experiments for thin poly(ethylene terephthalate) (PET) films. The temperature at the interface of two PET films of 0.1 mm thickness only increased to approximately 100 °C, and no trace of liquidation of the material was observed at the interface under a polarizing microscope. Investigation using a differential scanning calorimeter (DSC) revealed that the “melting point” of PET is about 260 °C, and an ultrasonically joined specimen showed no significant difference in thermal characteristics compared with an intact PET film. It was also determined that the PET films cannot be joined even after being pressed together for a period of 30 min or longer at approximately 150 °C. From the results obtained using the microscope and the DSC, the authors conclude that melting of the materials plays essentially no role in ultrasonic plastic joining.

Enhanced interfacial thermal transport in pnictogen tellurides metallized with a lead-free solder alloy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Devender,; Ramanath, Ganpati, E-mail: Ramanath@rpi.edu; Lofgreen, Kelly

2015-11-15

Controlling thermal transport across metal–thermoelectric interfaces is essential for realizing high efficiency solid-state refrigeration and waste-heat harvesting power generation devices. Here, the authors report that pnictogen chalcogenides metallized with bilayers of Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5} solder and Ni barrier exhibit tenfold higher interfacial thermal conductance Γ{sub c} than that obtained with In/Ni bilayer metallization. X-ray diffraction and x-ray spectroscopy indicate that reduced interdiffusion and diminution of interfacial SnTe formation due to Ni layer correlates with the higher Γ{sub c}. Finite element modeling of thermoelectric coolers metallized with Sn{sub 96.5}Ag{sub 3}Cu{sub 0.5}/Ni bilayers presages a temperature drop ΔT ∼ 22 K that is 40%more » higher than that obtained with In/Ni metallization. Our results underscore the importance of controlling chemical intermixing at solder–metal–thermoelectric interfaces to increase the effective figure of merit, and hence, the thermoelectric cooling efficiency. These findings should facilitate the design and development of lead-free metallization for pnictogen chalcogenide-based thermoelectrics.« less

Ultrasensitive molecular detection using thermal conductance of a hydrophobic gold-water interface.

PubMed

Green, Andrew J; Alaulamie, Arwa A; Baral, Susil; Richardson, Hugh H

2013-09-11

The thermal conductance from a hydrophobic gold aqueous interface is measured with increasing solute concentration. A small amount of aqueous solute molecules (1 solute molecule in 550 water molecules) dramatically increases the heat dissipation into the surrounding liquid. This result is consistent with a thermal conductance that is limited by an interface interaction where minority aqueous components significantly alter the surface properties and heat transport through the interface. The increase in heat dissipation can be used to make an extremely sensitive molecular detector that can be scaled to give single molecule detection without amplification or utilizing fluorescence labels.

Thermal transport across metal silicide-silicon interfaces: An experimental comparison between epitaxial and nonepitaxial interfaces

NASA Astrophysics Data System (ADS)

Ye, Ning; Feser, Joseph P.; Sadasivam, Sridhar; Fisher, Timothy S.; Wang, Tianshi; Ni, Chaoying; Janotti, Anderson

2017-02-01

Silicides are used extensively in nano- and microdevices due to their low electrical resistivity, low contact resistance to silicon, and their process compatibility. In this work, the thermal interface conductance of TiSi2, CoSi2, NiSi, and PtSi are studied using time-domain thermoreflectance. Exploiting the fact that most silicides formed on Si(111) substrates grow epitaxially, while most silicides on Si(100) do not, we study the effect of epitaxy, and show that for a wide variety of interfaces there is no dependence of interface conductance on the detailed structure of the interface. In particular, there is no difference in the thermal interface conductance between epitaxial and nonepitaxial silicide/silicon interfaces, nor between epitaxial interfaces with different interface orientations. While these silicide-based interfaces yield the highest reported interface conductances of any known interface with silicon, none of the interfaces studied are found to operate close to the phonon radiation limit, indicating that phonon transmission coefficients are nonunity in all cases and yet remain insensitive to interfacial structure. In the case of CoSi2, a comparison is made with detailed computational models using (1) full-dispersion diffuse mismatch modeling (DMM) including the effect of near-interfacial strain, and (2) an atomistic Green' function (AGF) approach that integrates near-interface changes in the interatomic force constants obtained through density functional perturbation theory. Above 100 K, the AGF approach significantly underpredicts interface conductance suggesting that energy transport does not occur purely by coherent transmission of phonons, even for epitaxial interfaces. The full-dispersion DMM closely predicts the experimentally observed interface conductances for CoSi2, NiSi, and TiSi2 interfaces, while it remains an open question whether inelastic scattering, cross-interfacial electron-phonon coupling, or other mechanisms could also account for the high-temperature behavior. The effect of degenerate semiconductor dopant concentration on metal-semiconductor thermal interface conductance was also investigated with the result that we have found no dependencies of the thermal interface conductances up to (n or p type) ≈1 ×1019 cm-3, indicating that there is no significant direct electronic transport and no transport effects that depend on long-range metal-semiconductor band alignment.

Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, D. J.; Paret, P. P.; Wereszczak, A. A.

2014-08-01

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesismore » of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.« less

Graphene-Enhanced Thermal Interface Materials for Thermal Management of Solar Cells

NASA Astrophysics Data System (ADS)

Saadah, Mohammed Ahmed

The interest to photovoltaic solar cells as a source of energy for a variety of applications has been rapidly increasing in recent years. Solar cells panels that employ optical concentrators can convert more than 30% of absorbed light into electricity. Most of the remaining 70% of absorbed energy is turned into heat inside the solar cell. The increase in the photovoltaic cell temperature negatively affects its power conversion efficiency and lifetime. In this dissertation research I investigated a feasibility of using graphene fillers in thermal interface materials for improving thermal management of multi-junction concentrator solar cells. Graphene and few-layer graphene fillers, produced by a scalable environmentally-friendly liquid-phase exfoliation technique, were incorporated into conventional thermal interface materials. Characteristics of the composites have been examined with Raman spectroscopy, optical microscopy and thermal conductivity measurements. Graphene-enhanced thermal interface materials have been applied between a solar cell and heat sink to improve heat dissipation. The performance of the single and multi-junction solar cells has been tested using an industry-standard solar simulator under the light concentration of up to 2000 suns. It was found that the application of graphene-enhanced thermal interface materials allows one to reduce the solar cell temperature and increase the open-circuit voltage. We demonstrated that the use of graphene helps in recovering significant amount of the power loss due to solar cell overheating. The obtained results are important for the development of new technologies for thermal management of concentrated and multi-junction photovoltaic solar cells.

Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

NASA Astrophysics Data System (ADS)

Hua, Chengyun; Chen, Xiangwen; Ravichandran, Navaneetha K.; Minnich, Austin J.

2017-05-01

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. However, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electron microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. Our work provides a useful perspective on the microscopic processes governing interfacial heat conduction.

Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

DOE PAGES

Hua, Chengyun; Chen, Xiangwen; Ravichandran, Navaneetha K.; ...

2017-05-17

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. But, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electronmore » microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. This work provides a useful perspective on the microscopic processes governing interfacial heat conduction.« less

Super-strengthening and stabilizing with carbon nanotube harnessed high density nanotwins in metals by shock loading

PubMed Central

Lin, Dong; Saei, Mojib; Suslov, Sergey; Jin, Shengyu; Cheng, Gary J.

2015-01-01

CNTs reinforced metal composites has great potential due to their superior properties, such as light weight, high strength, low thermal expansion and high thermal conductivity. The current strengthening mechanisms of CNT/metal composite mainly rely on CNTs’ interaction with dislocations and CNT’s intrinsic high strength. Here we demonstrated that laser shock loading the CNT/metal composite results in high density nanotwins, stacking fault, dislocation around the CNT/metal interface. The composites exhibit enhanced strength with excellent stability. The results are interpreted by both molecular dynamics simulation and experiments. It is found the shock wave interaction with CNTs induces a stress field, much higher than the applied shock pressure, surrounding the CNT/metal interface. As a result, nanotwins were nucleated under a shock pressure much lower than the critical values to generate twins in metals. This hybrid unique nanostructure not only enhances the strength, but also stabilize the strength, as the nanotwin boundaries around the CNTs help pin the dislocation movement. PMID:26493533

Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions

NASA Technical Reports Server (NTRS)

Glasgow, S. D.; Kittredge, K. B.

2003-01-01

A thermal interface material is one of the many tools often used as part of the thermal control scheme for space-based applications. Historically, at Marshall Space Flight Center, CHO-THERM 1671 has primarily been used for applications where an interface material was deemed necessary. However, numerous alternatives have come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and do not take into consideration other design issues, such as off-gassing, electrical conduction, isolation, etc. The purpose of this Technical Memorandum is to detail the materials tested, test apparatus, procedures, and results of these tests. The results show that there are a number of better performing alternatives now available.

Processing eutectics in space

NASA Technical Reports Server (NTRS)

Douglas, F. C.; Galasso, F. S.

1974-01-01

Experimental work is reported which was directed toward obtaining interface shape control while a numerical thermal analysis program was being made operational. An experimental system was developed in which the solid-liquid interface in a directionally solidified aluminum-nickel eutectic could be made either concave to the melt or convex to the melt. This experimental system provides control over the solid-liquid interface shape and can be used to study the effect of such control on the microstructure. The SINDA thermal analysis program, obtained from Marshall Space Flight Center, was used to evaluate experimental directional solidification systems for the aluminum-nickel and the aluminum-copper eutectics. This program was applied to a three-dimensional ingot, and was used to calculate the thermal profiles in axisymmetric heat flow. The results show that solid-liquid interface shape control can be attained with physically realizable thermal configurations and the magnitudes of the required thermal inputs were indicated.

Optomechanical Light-Matter Interface with Optical Wavelength Conversion

DTIC Science & Technology

2015-07-21

Using the concept of Bogoliubov dark mode, high- fidelity entanglement can be generated between cavity outputs as well. In Fig.7, we plot the...In addition, Bogoliubov mechanical mode, which is a precursor for entangled mechanical mode, has also been realized in a system, in which two...thermal mechanical motion in mechanically mediated optical state transfer or optical entanglement . The dark mode and the Sorensen-Molmer approaches have

A thermal scale modeling study for Apollo and Apollo applications, volume 1

NASA Technical Reports Server (NTRS)

Shannon, R. L.

1972-01-01

The program is reported for developing and demonstrating the capabilities of thermal scale modeling as a thermal design and verification tool for Apollo and Apollo Applications Projects. The work performed for thermal scale modeling of STB; cabin atmosphere/spacecraft cabin wall thermal interface; closed loop heat rejection radiator; and docked module/spacecraft thermal interface are discussed along with the test facility requirements for thermal scale model testing of AAP spacecraft. It is concluded that thermal scale modeling can be used as an effective thermal design and verification tool to provide data early in a spacecraft development program.

Some Aspects of Thermal Transport across the Interface between Graphene and Epoxy in Nanocomposites.

PubMed

Wang, Yu; Yang, Chunhui; Pei, Qing-Xiang; Zhang, Yingyan

2016-03-01

Owing to the superior thermal properties of graphene, graphene-reinforced polymer nanocomposites hold great potential as the thermal interface materials (TIMs) dissipating heat for electronic packages. However, this application is greatly hindered by the high thermal resistance at the interface between graphene and polymer. In this paper, some important aspects of the improvement of the thermal transport across the interface between graphene and epoxy in graphene-epoxy nanocomposites, including the effectiveness of covalent and noncovalent functionalization, isotope doping, and acetylenic linkage in graphene are systematically investigated using molecular dynamics (MD) simulations. The simulation results show that the covalent and noncovalent functionalization techniques could considerably reduce the graphene-epoxy interfacial thermal resistance in the nanocomposites. Among different covalent functional groups, butyl is more effective than carboxyl and hydroxyl in reducing the interfacial thermal resistance. Different noncovalent functional molecules, including 1-pyrenebutyl, 1-pyrenebutyric acid, and 1-pyrenebutylamine, yield a similar amount of reductions. Moreover, it is found that the graphene-epoxy interfacial thermal resistance is insensitive to the carbon isotope doping in graphene, while it can be reduced moderately by replacing the sp(2) bonds in graphene with acetylenic linkages.

Anomalous Epitaxial Growth in Thermally Sprayed YSZ and LZ Splats

NASA Astrophysics Data System (ADS)

Chen, Lin; Yang, Guan-Jun

2017-08-01

Thermally sprayed coatings are essentially layered materials, and lamellar interfaces are of great importance to coatings' performances. In the present study, to investigate the microstructures and defect features at thermally sprayed coating interfaces, homoepitaxial 8 mol.% yttria-stabilized zirconia (YSZ) and heteroepitaxial lanthanum zirconia (LZ) films were fabricated. The epitaxial interfaces were examined by high-resolution transmission electron microscope (HR-TEM) in detail. As a result, we report, for the first time, an anomalous incommensurate homoepitaxial growth with mismatch-induced dislocations in thermally sprayed YSZ splats to create a homointerface. We also find the anomalous heteroepitaxial growth in thermally sprayed LZ splats. The mechanism of the anomalous incommensurate growth was analyzed in detail. Essentially, it is a pseudo-heteroepitaxy because of the lattice mismatch between the film and the locally heated substrate, as the locally heated substrate is significantly strained by its cold surroundings. Moreover, the super-high-density dislocations were found in the interfacial region, which resulted from sufficient thermal fluctuations and extremely rapid cooling rates. Both the anomalous lattice mismatch and super-high-density dislocations lead to weak interfaces and violent cracking in thermally sprayed coatings. These were also the essential differences between the conventional and the present epitaxy by thermal spray technique.

Current and anticipated use of thermal-hydraulic codes for BWR transient and accident analyses in Japan

DOE Office of Scientific and Technical Information (OSTI.GOV)

Arai, Kenji; Ebata, Shigeo

1997-07-01

This paper summarizes the current and anticipated use of the thermal-hydraulic and neutronic codes for the BWR transient and accident analyses in Japan. The codes may be categorized into the licensing codes and the best estimate codes for the BWR transient and accident analyses. Most of the licensing codes have been originally developed by General Electric. Some codes have been updated based on the technical knowledge obtained in the thermal hydraulic study in Japan, and according to the BWR design changes. The best estimates codes have been used to support the licensing calculations and to obtain the phenomenological understanding ofmore » the thermal hydraulic phenomena during a BWR transient or accident. The best estimate codes can be also applied to a design study for a next generation BWR to which the current licensing model may not be directly applied. In order to rationalize the margin included in the current BWR design and develop a next generation reactor with appropriate design margin, it will be required to improve the accuracy of the thermal-hydraulic and neutronic model. In addition, regarding the current best estimate codes, the improvement in the user interface and the numerics will be needed.« less

Dynamic fracture and hot-spot modeling in energetic composites

NASA Astrophysics Data System (ADS)

Grilli, Nicolò; Duarte, Camilo A.; Koslowski, Marisol

2018-02-01

Defects such as cracks, pores, and particle-matrix interface debonding affect the sensitivity of energetic materials by reducing the time-to-ignition and the threshold pressure to initiate an explosion. Frictional sliding of preexisting cracks is considered to be one of the most important causes of localized heating. Therefore, understanding the dynamic fracture of crystalline energetic materials is of extreme importance to assess the reliability and safety of polymer-bonded explosives. Phase field damage model simulations, based on the regularization of the crack surface as a diffuse delta function, are used to describe crack propagation in cyclotetramethylene-tetranitramine crystals embedded in a Sylgard matrix. A thermal transport model that includes heat generation by friction at crack interfaces is coupled to the solution of crack propagation. 2D and 3D dynamic compression simulations are performed with different boundary velocities and initial distributions of cracks and interface defects to understand their effect on crack propagation and heat generation. It is found that, at an impact velocity of 400 m/s, localized damage at the particle-binder interface is of key importance and that the sample reaches temperatures high enough to create a hot-spot that will lead to ignition. At an impact velocity of 10 m/s, preexisting cracks advanced inside the particle, but the increase of temperature will not cause ignition.

Thermal stability comparison of nanocrystalline Fe-based binary alloy pairs

DOE PAGES

Clark, Blythe G.; Hattar, Khalid Mikhiel; Marshall, Michael Thomas; ...

2016-03-24

Here, the widely recognized property improvements of nanocrystalline (NC) materials have generated significant interest, yet have been difficult to realize in engineering applications due to the propensity for grain growth in these interface-dense systems. While traditional pathways to thermal stabilization can slow the mobility of grain boundaries, recent theories suggest that solute segregation in NC alloy can reduce the grain boundary energy such that thermodynamic stabilization is achieved. Following the predictions of Murdock et al., here we compare for the first time the thermal stability of a predicted NC stable alloy (Fe-10at.% Mg) with a predicted non-NC stable alloy (Fe-10at.%more » Cu) using the same processing and characterization methodologies. Results indicate improved thermal stability of the Fe-Mg alloy in comparison to the Fe-Cu, and observed microstructures are consistent with those predicted by Monte Carlo simulations.« less

Calorimetric thermal-vacuum performance characterization of the BAe 80 K space cryocooler

NASA Technical Reports Server (NTRS)

Kotsubo, V. Y.; Johnson, D. L.; Ross, R. G., Jr.

1992-01-01

A comprehensive characterization program is underway at JPL to generate test data on long-life, miniature Stirling-cycle cryocoolers for space application. The key focus of this paper is on the thermal performance of the British Aerospace (BAe) 80 K split-Stirling-cycle cryocooler as measured in a unique calorimetric thermal-vacuum test chamber that accurately simulates the heat-transfer interfaces of space. Two separate cooling fluid loops provide precise individual control of the compressor and displacer heatsink temperatures. In addition, heatflow transducers enable calorimetric measurements of the heat rejected separately by the compressor and displacer. Cooler thermal performance has been mapped for coldtip temperatures ranging from below 45 K to above 150 K, for heatsink temperatures ranging from 280 K to 320 K, and for a wide variety of operational variables including compressor-displacer phase, compressor-displacer stroke, drive frequency, and piston-displacer dc offset.

Limits to solar power conversion efficiency with applications to quantum and thermal systems

NASA Technical Reports Server (NTRS)

Byvik, C. E.; Buoncristiani, A. M.; Smith, B. T.

1983-01-01

An analytical framework is presented that permits examination of the limit to the efficiency of various solar power conversion devices. Thermodynamic limits to solar power efficiency are determined for both quantum and thermal systems, and the results are applied to a variety of devices currently considered for use in space systems. The power conversion efficiency for single-threshold energy quantum systems receiving unconcentrated air mass zero solar radiation is limited to 31 percent. This limit applies to photovoltaic cells directly converting solar radiation, or indirectly, as in the case of a thermophotovoltaic system. Photoelectrochemical cells rely on an additional chemical reaction at the semiconductor-electrolyte interface, which introduces additional second-law demands and a reduction of the solar conversion efficiency. Photochemical systems exhibit even lower possible efficiencies because of their relatively narrow absorption bands. Solar-powered thermal engines in contact with an ambient reservoir at 300 K and operating at maximum power have a peak conversion efficiency of 64 percent, and this occurs for a thermal reservoir at a temperature of 2900 K. The power conversion efficiency of a solar-powered liquid metal magnetohydrodydnamic generator, a solar-powered steam turbine electric generator, and an alkali metal thermoelectric converter is discussed.

Advanced Software for Analysis of High-Speed Rolling-Element Bearings

NASA Technical Reports Server (NTRS)

Poplawski, J. V.; Rumbarger, J. H.; Peters, S. M.; Galatis, H.; Flower, R.

2003-01-01

COBRA-AHS is a package of advanced software for analysis of rigid or flexible shaft systems supported by rolling-element bearings operating at high speeds under complex mechanical and thermal loads. These loads can include centrifugal and thermal loads generated by motions of bearing components. COBRA-AHS offers several improvements over prior commercial bearing-analysis programs: It includes innovative probabilistic fatigue-life-estimating software that provides for computation of three-dimensional stress fields and incorporates stress-based (in contradistinction to prior load-based) mathematical models of fatigue life. It interacts automatically with the ANSYS finite-element code to generate finite-element models for estimating distributions of temperature and temperature-induced changes in dimensions in iterative thermal/dimensional analyses: thus, for example, it can be used to predict changes in clearances and thermal lockup. COBRA-AHS provides an improved graphical user interface that facilitates the iterative cycle of analysis and design by providing analysis results quickly in graphical form, enabling the user to control interactive runs without leaving the program environment, and facilitating transfer of plots and printed results for inclusion in design reports. Additional features include roller-edge stress prediction and influence of shaft and housing distortion on bearing performance.

Effects of interface morphology and TGO thickness on residual stress of EB-PVD thermal barrier coatings

NASA Astrophysics Data System (ADS)

Chen, Jianwei; Zhao, Yang; Ma, Jian

2015-04-01

The residual stress of electron beam-physical vapor deposition (EB-PVD) thermal barrier coatings (TBC) is complex and difficult to be obtained. In this paper, the interface morphology of TBCs subjected to cyclic heating and cooling was observed by SEM. Based on the thermal elastic-plastic finite method, corresponding interface model of TBCs was established. The residual stress of EB-PVD TBCs with different interface morphologies and TGO thicknesses was calculated using the FE method without regard to the presence of cracks and defects. The result shows that the distribution of residual stress is significantly affected by the interface morphology, and the growth of TGO also has influence on the residual stress of TC and TGO.

Cooled electrical terminal assembly and device incorporating same

DOEpatents

Beihoff, Bruce C.; Radosevich, Lawrence D.; Phillips, Mark G.; Kehl, Dennis L.; Kaishian, Steven C.; Kannenberg, Daniel G.

2006-08-22

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter having improved fluid cooling

DOEpatents

Meyer, Andreas A.; Radosevich, Lawrence D.; Beihoff, Bruce C.; Kehl, Dennis L.; Kannenberg, Daniel G.

2007-03-06

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support, which may be controlled in a closed-loop manner. Interfacing between circuits, circuit mounting structure, and the support provide for greatly enhanced cooling. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Cooled electrical terminal assembly and device incorporating same

DOEpatents

Beihoff, Bruce C.; Radosevich, Lawrence D.; Phillips, Mark G.; Kehl, Dennis L.; Kaishian, Steven C.; Kannenberg, Daniel G.

2005-05-24

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Magnon mode selective spin transport in compensated ferrimagnets

DOE PAGES

Cramer, Joel; Guo, Er -Jia; Geprags, Stephan; ...

2017-04-13

We investigate the generation of magnonic thermal spin currents and their mode selective spin transport across interfaces in insulating, compensated ferrimagnet/normal metal bilayer systems. The spin Seebeck effect signal exhibits a nonmonotonic temperature dependence with two sign changes of the detected voltage signals. Using different ferrimagnetic garnets, we demonstrate the universality of the observed complex temperature dependence of the spin Seebeck effect. To understand its origin, we systematically vary the interface between the ferrimagnetic garnet and the metallic layer, and by using different metal layers we establish that interface effects play a dominating role. They do not only modify themore » magnitude of the spin Seebeck effect signal but in particular also alter its temperature dependence. By varying the temperature, we can select the dominating magnon mode and we analyze our results to reveal the mode selective interface transmission probabilities for different magnon modes and interfaces. As a result, the comparison of selected systems reveals semiquantitative details of the interfacial coupling depending on the materials involved, supported by the obtained field dependence of the signal.« less

Magnon mode selective spin transport in compensated ferrimagnets

DOE Office of Scientific and Technical Information (OSTI.GOV)

Cramer, Joel; Guo, Er -Jia; Geprags, Stephan

We investigate the generation of magnonic thermal spin currents and their mode selective spin transport across interfaces in insulating, compensated ferrimagnet/normal metal bilayer systems. The spin Seebeck effect signal exhibits a nonmonotonic temperature dependence with two sign changes of the detected voltage signals. Using different ferrimagnetic garnets, we demonstrate the universality of the observed complex temperature dependence of the spin Seebeck effect. To understand its origin, we systematically vary the interface between the ferrimagnetic garnet and the metallic layer, and by using different metal layers we establish that interface effects play a dominating role. They do not only modify themore » magnitude of the spin Seebeck effect signal but in particular also alter its temperature dependence. By varying the temperature, we can select the dominating magnon mode and we analyze our results to reveal the mode selective interface transmission probabilities for different magnon modes and interfaces. As a result, the comparison of selected systems reveals semiquantitative details of the interfacial coupling depending on the materials involved, supported by the obtained field dependence of the signal.« less

Pyroclast/snow interactions and thermally driven slurry formation. Part 1: Theory for monodisperse grain beds

USGS Publications Warehouse

Walder, J.S.

2000-01-01

Lahars are often produced as pyroclastic flows move over snow. This phenomenon involves a complicated interplay of mechanical and thermal processes that need to be separated to get at the fundamental physics. The thermal physics of pyroclast/snow interactions form the focus of this paper. A theoretical model is developed of heat- and mass transfer at the interface between a layer of uniformly sized pyroclasts and an underlying bed of snow, for the case in which there is no relative shear motion between pyroclasts and snow. A microscale view of the interface is required to properly specify boundary conditions. The physical model leads to the prediction that the upward flux of water vapor - which depends upon emplacement temperature, pyroclast grain size, pyroclast-layer thickness, and snow permeability - is sometimes sufficient to fluidize the pyroclasts. Uniform fluidization is usually unstable to bubble formation, which leads to vigorous convection of the pyroclasts themselves. Thus, predicted threshold conditions for fluidization are tantamount to predicted thresholds for particle convection. Such predictions are quantitatively in good agreement with results of experiments described in part 2 of this paper. Because particle convection commonly causes scour of the snow bed and transformation of the pyroclast layer to a slurry, there exists a 'thermal scour' process for generating lahars from pyroclastic flows moving over snow regardless of the possible role of mechanical scour.

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics.

PubMed

Subramaniam, Chandramouli; Yasuda, Yuzuri; Takeya, Satoshi; Ata, Seisuke; Nishizawa, Ayumi; Futaba, Don; Yamada, Takeo; Hata, Kenji

2014-03-07

Increasing functional complexity and dimensional compactness of electronic devices have led to progressively higher power dissipation, mainly in the form of heat. Overheating of semiconductor-based electronics has been the primary reason for their failure. Such failures originate at the interface of the heat sink (commonly Cu and Al) and the substrate (silicon) due to the large mismatch in thermal expansion coefficients (∼300%) of metals and silicon. Therefore, the effective cooling of such electronics demands a material with both high thermal conductivity and a similar coefficient of thermal expansion (CTE) to silicon. Addressing this demand, we have developed a carbon nanotube-copper (CNT-Cu) composite with high metallic thermal conductivity (395 W m(-1) K(-1)) and a low, silicon-like CTE (5.0 ppm K(-1)). The thermal conductivity was identical to that of Cu (400 W m(-1) K(-1)) and higher than those of most metals (Ti, Al, Au). Importantly, the CTE mismatch between CNT-Cu and silicon was only ∼10%, meaning an excellent compatibility. The seamless integration of CNTs and Cu was achieved through a unique two-stage electrodeposition approach to create an extensive and continuous interface between the Cu and CNTs. This allowed for thermal contributions from both Cu and CNTs, resulting in high thermal conductivity. Simultaneously, the high volume fraction of CNTs balanced the thermal expansion of Cu, accounting for the low CTE of the CNT-Cu composite. The experimental observations were in good quantitative concurrence with the theoretically described 'matrix-bubble' model. Further, we demonstrated identical in-situ thermal strain behaviour of the CNT-Cu composite to Si-based dielectrics, thereby generating the least interfacial thermal strain. This unique combination of properties places CNT-Cu as an isolated spot in an Ashby map of thermal conductivity and CTE. Finally, the CNT-Cu composite exhibited the greatest stability to temperature as indicated by its low thermal distortion parameter (TDP). Thus, this material presents a viable and efficient alternative to existing materials for thermal management in electronics.

Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

NASA Astrophysics Data System (ADS)

Qi, Lihua; Huang, Jihua; Zhang, Hua; Zhao, Xingke; Wang, Haitao; Cheng, Donghai

2010-02-01

The growth behavior of reaction-formed intermetallic compounds (IMCs) at Sn3.5Ag0.5Cu/Ni and Cu interfaces under thermal-shear cycling conditions was investigated. The results show that the morphology of (Cu x Ni1- x )6Sn5 and Cu6Sn5 IMCs formed both at Sn3.5Ag0.5Cu/Ni and Cu interfaces gradually changed from scallop-like to chunk-like, and different IMC thicknesses developed with increasing thermal-shear cycling time. Furthermore, Cu6Sn5 IMC growth rate at the Sn3.5Ag0.5Cu/Cu interface was higher than that of (Cu x Ni1- x )6Sn5 IMC under thermal-shear cycling. Compared to isothermal aging, thermal-shear cycling led to only one Cu6Sn5 layer at the interface between SnAgCu solder and Cu substrate after 720 cycles. Moreover, Ag3Sn IMC was dispersed uniformly in the solder after reflow. The planar Ag3Sn formed near the interface changed remarkably and merged together to large platelets with increasing cycles. The mechanism of formation of Cu6Sn5, (Cu x Ni1- x )6Sn5 and Ag3Sn IMCs during thermal-shear cycling process was investigated.

Utilizing Radioisotope Power System Waste Heat for Spacecraft Thermal Management

NASA Technical Reports Server (NTRS)

Pantano, David R.; Dottore, Frank; Geng, Steven M.; Schrieber, Jeffrey G.; Tobery, E. Wayne; Palko, Joseph L.

2005-01-01

One of the advantages of using a Radioisotope Power System (RPS) for deep space or planetary surface missions is the readily available waste heat, which can be used to maintain electronic components within a controlled temperature range, to warm propulsion tanks and mobility actuators, and to gasify liquid propellants. Previous missions using Radioisotope Thermoelectric Generators (RTGs) dissipated a very large quantity of waste heat due to the relatively low efficiency of the thermoelectric conversion technology. The next generation RPSs, such as the 110-watt Stirling Radioisotope Generator (SRG110) will have much higher conversion efficiencies than their predecessors and therefore may require alternate approaches to transferring waste heat to the spacecraft. RTGs, with efficiencies of approx. 6 to 7% and 200 C housing surface temperatures, would need to use large and heavy radiator heat exchangers to transfer the waste heat to the internal spacecraft components. At the same time, sensitive spacecraft instruments must be shielded from the thermal radiation by using the heat exchangers or additional shields. The SRG110, with an efficiency around 22% and 50 C nominal housing surface temperature, can use the available waste heat more efficiently by more direct heat transfer methods such as heat pipes, thermal straps, or fluid loops. The lower temperatures allow the SRG110 much more flexibility to the spacecraft designers in configuring the generator without concern of overheating nearby scientific instruments, thereby eliminating the need for thermal shields. This paper will investigate using a high efficiency SRG110 for spacecraft thermal management and outline potential methods in several conceptual missions (Lunar Rover, Mars Rover, and Titan Lander) to illustrate the advantages with regard to ease of assembly, less complex interfaces, and overall mass savings.

Spin Seebeck insulator.

PubMed

Uchida, K; Xiao, J; Adachi, H; Ohe, J; Takahashi, S; Ieda, J; Ota, T; Kajiwara, Y; Umezawa, H; Kawai, H; Bauer, G E W; Maekawa, S; Saitoh, E

2010-11-01

Thermoelectric generation is an essential function in future energy-saving technologies. However, it has so far been an exclusive feature of electric conductors, a situation which limits its application; conduction electrons are often problematic in the thermal design of devices. Here we report electric voltage generation from heat flowing in an insulator. We reveal that, despite the absence of conduction electrons, the magnetic insulator LaY(2)Fe(5)O(12) can convert a heat flow into a spin voltage. Attached Pt films can then transform this spin voltage into an electric voltage as a result of the inverse spin Hall effect. The experimental results require us to introduce a thermally activated interface spin exchange between LaY(2)Fe(5)O(12) and Pt. Our findings extend the range of potential materials for thermoelectric applications and provide a crucial piece of information for understanding the physics of the spin Seebeck effect.

Metallic Nanocomposites as Next-Generation Thermal Interface Materials: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, Xuhui; Narumanchi, Sreekant V; King, Charles C

Thermal interface materials (TIMs) are an integral and important part of thermal management in electronic devices. The electronic devices are becoming more compact and powerful. This increase in power processed or passing through the devices leads to higher heat fluxes and makes it a challenge to maintain temperatures at the optimal level during operation. Herein, we report a free standing nanocomposite TIM in which boron nitride nanosheets (BNNS) are uniformly dispersed in copper matrices via an organic linker, thiosemicarbazide. Integration of these metal-organic-inorganic nanocomposites was made possible by a novel electrodeposition technique where the functionalized BNNS (f-BNNS) experience the Brownianmore » motion and reach the cathode through diffusion, while the nucleation and growth of the copper on the cathode occurs via the electrochemical reduction. Once the f-BNNS bearing carbonothioyl/thiol groups on the terminal edges come into the contact with copper crystals, the chemisorption reaction takes place. We performed thermal, mechanical, and structural characterization of these nanocomposites using scanning electron microcopy (SEM), diffusive laser flash (DLF) analysis, phase-sensitive transient thermoreflectence (PSTTR), and nanoindentation. The nanocomposites exhibited a thermal conductivity ranging from 211 W/mK to 277 W/mK at a filler mass loading of 0-12 wt.percent. The nanocomposites also have about 4 times lower hardness as compared to copper, with values ranging from 0.27 GPa to 0.41 GPa. The structural characterization studies showed that most of the BNNS are localized at grain boundaries - which enable efficient thermal transport while making the material soft. PSTTR measurements revealed that the synergistic combinations of these properties yielded contact resistances on the order of 0.10 to 0.13 mm2K/W, and the total thermal resistance of 0.38 to 0.56 mm2K/W at bondline thicknesses of 30-50 um. The coefficient of thermal expansion (CTE) of the nanocomposite is 11 ppm/K, which lies between the CTEs of aluminum (22 ppm/K) and silicon (3 ppm/K), which are common heat sink and heat source materials, respectively. The nanocomposite can also be deposited directly on to heat sink which will simplify the packaging processes by removing one possible element to assemble. These unique properties and ease of assembly makes the nanocomposite a promising next-generation TIM.« less

Metallic Nanocomposites as Next-Generation Thermal Interface Materials

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, Xuhui; Narumanchi, Sreekant V; King, Charles C

Thermal interface materials (TIMs) are an integral and important part of thermal management in electronic devices. The electronic devices are becoming more compact and powerful. This increase in power processed or passing through the devices leads to higher heat fluxes and makes it a challenge to maintain temperatures at the optimal level during operation. Herein, we report a free standing nanocomposite TIM in which boron nitride nanosheets (BNNS) are uniformly dispersed in copper matrices via an organic linker, thiosemicarbazide. Integration of these metal-organic-inorganic nanocomposites was made possible by a novel electrodeposition technique where the functionalized BNNS (f-BNNS) experience the Brownianmore » motion and reach the cathode through diffusion, while the nucleation and growth of the copper on the cathode occurs via the electrochemical reduction. Once the f-BNNS bearing carbonothioyl/thiol groups on the terminal edges come into the contact with copper crystals, the chemisorption reaction takes place. We performed thermal, mechanical, and structural characterization of these nanocomposites using scanning electron microcopy (SEM), diffusive laser flash (DLF) analysis, phase-sensitive transient thermoreflectence (PSTTR), and nanoindentation. The nanocomposites exhibited a thermal conductivity ranging from 211 W/mK to 277 W/mK at a filler mass loading of 0-12 wt.percent. The nanocomposites also have about 4 times lower hardness as compared to copper, with values ranging from 0.27 GPa to 0.41 GPa. The structural characterization studies showed that most of the BNNS are localized at grain boundaries - which enable efficient thermal transport while making the material soft. PSTTR measurements revealed that the synergistic combinations of these properties yielded contact resistances on the order of 0.10 to 0.13 mm2K/W, and the total thermal resistance of 0.38 to 0.56 mm2K/W at bondline thicknesses of 30-50 um. The coefficient of thermal expansion (CTE) of the nanocomposite is 11 ppm/K, which lies between the CTEs of aluminum (22 ppm/K) and silicon (3 ppm/K), which are common heat sink and heat source materials, respectively. The nanocomposite can also be deposited directly on to heat sink which will simplify the packaging processes by removing one possible element to assemble. These unique properties and ease of assembly makes the nanocomposite a promising next-generation TIM.« less

IAC-1.5 - INTEGRATED ANALYSIS CAPABILITY

NASA Technical Reports Server (NTRS)

Vos, R. G.

1994-01-01

The objective of the Integrated Analysis Capability (IAC) system is to provide a highly effective, interactive analysis tool for the integrated design of large structures. IAC was developed to interface programs from the fields of structures, thermodynamics, controls, and system dynamics with an executive system and a database to yield a highly efficient multi-disciplinary system. Special attention is given to user requirements such as data handling and on-line assistance with operational features, and the ability to add new modules of the user's choice at a future date. IAC contains an executive system, a database, general utilities, interfaces to various engineering programs, and a framework for building interfaces to other programs. IAC has shown itself to be effective in automating data transfer among analysis programs. The IAC system architecture is modular in design. 1) The executive module contains an input command processor, an extensive data management system, and driver code to execute the application modules. 2) Technical modules provide standalone computational capability as well as support for various solution paths or coupled analyses. 3) Graphics and model generation modules are supplied for building and viewing models. 4) Interface modules provide for the required data flow between IAC and other modules. 5) User modules can be arbitrary executable programs or JCL procedures with no pre-defined relationship to IAC. 6) Special purpose modules are included, such as MIMIC (Model Integration via Mesh Interpolation Coefficients), which transforms field values from one model to another; LINK, which simplifies incorporation of user specific modules into IAC modules; and DATAPAC, the National Bureau of Standards statistical analysis package. The IAC database contains structured files which provide a common basis for communication between modules and the executive system, and can contain unstructured files such as NASTRAN checkpoint files, DISCOS plot files, object code, etc. The user can define groups of data and relations between them. A full data manipulation and query system operates with the database. The current interface modules comprise five groups: 1) Structural analysis - IAC contains a NASTRAN interface for standalone analysis or certain structural/control/thermal combinations. IAC provides enhanced structural capabilities for normal modes and static deformation analysis via special DMAP sequences. 2) Thermal analysis - IAC supports finite element and finite difference techniques for steady state or transient analysis. There are interfaces for the NASTRAN thermal analyzer, SINDA/SINFLO, and TRASYS II. 3) System dynamics - A DISCOS interface allows full use of this simulation program for either nonlinear time domain analysis or linear frequency domain analysis. 4) Control analysis - Interfaces for the ORACLS, SAMSAN, NBOD2, and INCA programs allow a wide range of control system analyses and synthesis techniques. 5) Graphics - The graphics packages PLOT and MOSAIC are included in IAC. PLOT generates vector displays of tabular data in the form of curves, charts, correlation tables, etc., while MOSAIC generates color raster displays of either tabular of array type data. Either DI3000 or PLOT-10 graphics software is required for full graphics capability. IAC is available by license for a period of 10 years to approved licensees. The licensed program product includes one complete set of supporting documentation. Additional copies of the documentation may be purchased separately. IAC is written in FORTRAN 77 and has been implemented on a DEC VAX series computer operating under VMS. IAC can be executed by multiple concurrent users in batch or interactive mode. The basic central memory requirement is approximately 750KB. IAC includes the executive system, graphics modules, a database, general utilities, and the interfaces to all analysis and controls programs described above. Source code is provided for the control programs ORACLS, SAMSAN, NBOD2, and DISCOS. The following programs are also available from COSMIC a

IAC-1.5 - INTEGRATED ANALYSIS CAPABILITY

NASA Technical Reports Server (NTRS)

Vos, R. G.

1994-01-01

The objective of the Integrated Analysis Capability (IAC) system is to provide a highly effective, interactive analysis tool for the integrated design of large structures. IAC was developed to interface programs from the fields of structures, thermodynamics, controls, and system dynamics with an executive system and a database to yield a highly efficient multi-disciplinary system. Special attention is given to user requirements such as data handling and on-line assistance with operational features, and the ability to add new modules of the user's choice at a future date. IAC contains an executive system, a database, general utilities, interfaces to various engineering programs, and a framework for building interfaces to other programs. IAC has shown itself to be effective in automating data transfer among analysis programs. The IAC system architecture is modular in design. 1) The executive module contains an input command processor, an extensive data management system, and driver code to execute the application modules. 2) Technical modules provide standalone computational capability as well as support for various solution paths or coupled analyses. 3) Graphics and model generation modules are supplied for building and viewing models. 4) Interface modules provide for the required data flow between IAC and other modules. 5) User modules can be arbitrary executable programs or JCL procedures with no pre-defined relationship to IAC. 6) Special purpose modules are included, such as MIMIC (Model Integration via Mesh Interpolation Coefficients), which transforms field values from one model to another; LINK, which simplifies incorporation of user specific modules into IAC modules; and DATAPAC, the National Bureau of Standards statistical analysis package. The IAC database contains structured files which provide a common basis for communication between modules and the executive system, and can contain unstructured files such as NASTRAN checkpoint files, DISCOS plot files, object code, etc. The user can define groups of data and relations between them. A full data manipulation and query system operates with the database. The current interface modules comprise five groups: 1) Structural analysis - IAC contains a NASTRAN interface for standalone analysis or certain structural/control/thermal combinations. IAC provides enhanced structural capabilities for normal modes and static deformation analysis via special DMAP sequences. 2) Thermal analysis - IAC supports finite element and finite difference techniques for steady state or transient analysis. There are interfaces for the NASTRAN thermal analyzer, SINDA/SINFLO, and TRASYS II. 3) System dynamics - A DISCOS interface allows full use of this simulation program for either nonlinear time domain analysis or linear frequency domain analysis. 4) Control analysis - Interfaces for the ORACLS, SAMSAN, NBOD2, and INCA programs allow a wide range of control system analyses and synthesis techniques. 5) Graphics - The graphics packages PLOT and MOSAIC are included in IAC. PLOT generates vector displays of tabular data in the form of curves, charts, correlation tables, etc., while MOSAIC generates color raster displays of either tabular of array type data. Either DI3000 or PLOT-10 graphics software is required for full graphics capability. IAC is available by license for a period of 10 years to approved licensees. The licensed program product includes one complete set of supporting documentation. Additional copies of the documentation may be purchased separately. IAC is written in FORTRAN 77 and has been implemented on a DEC VAX series computer operating under VMS. IAC can be executed by multiple concurrent users in batch or interactive mode. The basic central memory requirement is approximately 750KB. IAC includes the executive system, graphics modules, a database, general utilities, and the interfaces to all analysis and controls programs described above. Source code is provided for the control programs ORACLS, SAMSAN, NBOD2, and DISCOS. The following programs are also available from COSMIC as separate packages: NASTRAN, SINDA/SINFLO, TRASYS II, DISCOS, ORACLS, SAMSAN, NBOD2, and INCA. IAC was developed in 1985.

Thermal transport study across interface “nanostructured solid surface / fluid” by photoacoustic technique

NASA Astrophysics Data System (ADS)

Voitenko, K.; Isaiev, M.; Pastushenko, A.; Andrusenko, D.; Kuzmich, A.; Lysenko, V.; Burbelo, R.

2017-01-01

In the paper the experimental study of heat transport across the interface “porous silicon/liquid” by photoacoustic technique is reported. Two cases with and without liquid covering of porous silicon surface were considered. Thermal perturbations were excited at the surface of porous silicon as a result of absorption of the light with modulated intensity. The resulting thermal-elastic stresses arising in the system were registered with piezoelectric transducer. The amplitude-frequency dependencies of the voltage on the piezoelectric electrodes were measured. The presence of the liquid film leads to decreasing of the amplitude of photoacoustic signal as a result of the thermal energy evacuation from the porous silicon into the liquid. The experimental dependencies were fitted with the results of simulation that takes into account heat fluxes separation at the porous silicon/liquid interface. With the presented method one can precisely measure heat fluxes transferred from the solid into contacting fluid. Moreover, the presented approach can be easily adopted for the thermal conductivity study of the different nanofluids as well as thermal resistance at the interface nanostructured solid/fluid.

Modeling of Thermal Barrier Coatings

NASA Technical Reports Server (NTRS)

Ferguson, B. L.; Petrus, G. J.; Krauss, T. M.

1992-01-01

The project examined the effectiveness of studying the creep behavior of thermal barrier coating system through the use of a general purpose, large strain finite element program, NIKE2D. Constitutive models implemented in this code were applied to simulate thermal-elastic and creep behavior. Four separate ceramic-bond coat interface geometries were examined in combination with a variety of constitutive models and material properties. The reason for focusing attention on the ceramic-bond coat interface is that prior studies have shown that cracking occurs in the ceramic near interface features which act as stress concentration points. The model conditions examined include: (1) two bond coat coefficient of thermal expansion curves; (2) the creep coefficient and creep exponent of the bond coat for steady state creep; (3) the interface geometry; and (4) the material model employed to represent the bond coat, ceramic, and superalloy base.

Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism.

PubMed

Liu, Donghuan; Zhang, Jing

2018-01-01

High-temperature thermal contact resistance (TCR) plays an important role in heat-pipe-cooled thermal protection structures due to the existence of contact interface between the embedded heat pipe and the heat resistive structure, and the reduction mechanism of thermal contact resistance is of special interests in the design of such structures. The present paper proposed a finite element model of the high-temperature thermal contact resistance based on the multi-point contact model with the consideration of temperature-dependent material properties, heat radiation through the cavities at the interface and the effect of thermal interface material (TIM), and the geometry parameters of the finite element model are determined by simple surface roughness test and experimental data fitting. The experimental results of high-temperature thermal contact resistance between superalloy GH600 and C/C composite material are employed to validate the present finite element model. The effect of the crucial parameters on the thermal contact resistance with and without TIM are also investigated with the proposed finite element model.

Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism

PubMed Central

Zhang, Jing

2018-01-01

High-temperature thermal contact resistance (TCR) plays an important role in heat-pipe-cooled thermal protection structures due to the existence of contact interface between the embedded heat pipe and the heat resistive structure, and the reduction mechanism of thermal contact resistance is of special interests in the design of such structures. The present paper proposed a finite element model of the high-temperature thermal contact resistance based on the multi-point contact model with the consideration of temperature-dependent material properties, heat radiation through the cavities at the interface and the effect of thermal interface material (TIM), and the geometry parameters of the finite element model are determined by simple surface roughness test and experimental data fitting. The experimental results of high-temperature thermal contact resistance between superalloy GH600 and C/C composite material are employed to validate the present finite element model. The effect of the crucial parameters on the thermal contact resistance with and without TIM are also investigated with the proposed finite element model. PMID:29547651

Tutorial: Determination of thermal boundary resistance by molecular dynamics simulations

NASA Astrophysics Data System (ADS)

Liang, Zhi; Hu, Ming

2018-05-01

Due to the high surface-to-volume ratio of nanostructured components in microelectronics and other advanced devices, the thermal resistance at material interfaces can strongly affect the overall thermal behavior in these devices. Therefore, the thermal boundary resistance, R, must be taken into account in the thermal analysis of nanoscale structures and devices. This article is a tutorial on the determination of R and the analysis of interfacial thermal transport via molecular dynamics (MD) simulations. In addition to reviewing the commonly used equilibrium and non-equilibrium MD models for the determination of R, we also discuss several MD simulation methods which can be used to understand interfacial thermal transport behavior. To illustrate how these MD models work for various interfaces, we will show several examples of MD simulation results on thermal transport across solid-solid, solid-liquid, and solid-gas interfaces. The advantages and drawbacks of a few other MD models such as approach-to-equilibrium MD and first-principles MD are also discussed.

Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions

NASA Technical Reports Server (NTRS)

Glasgow, Shaun; Kittredge, Ken

2003-01-01

A thermal interface material is one of the many tools that are often used as part of the thermal control scheme for space-based applications. These materials are placed between, for example, an avionics box and a cold plate, in order to improve the conduction heat transfer so that proper temperatures can be maintained. Historically at Marshall Space Flight Center, CHO-THERM@ 1671 has primarily been used for applications where an interface material was deemed necessary. However, there have been numerous alternatives come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and they do not take into consideration other design issues such as off-gassing, electrical conduction or isolation, etc. This paper details the materials tested, test apparatus, procedures, and results of these tests.

Pulsed Corona Discharge Induced Hydroxyl Radical Transfer Through the Gas-Liquid Interface.

PubMed

Ajo, Petri; Kornev, Iakov; Preis, Sergei

2017-11-23

The highly energetic electrons in non-thermal plasma generated by gas phase pulsed corona discharge (PCD) produce hydroxyl (OH) radicals via collision reactions with water molecules. Previous work has established that OH radicals are formed at the plasma-liquid interface, making it an important location for the oxidation of aqueous pollutants. Here, by contacting water as aerosol with PCD plasma, it is shown that OH radicals are produced on the gas side of the interface, and not in the liquid phase. It is also demonstrated that the gas-liquid interfacial boundary poses a barrier for the OH radicals, one they need to cross for reactive affinity with dissolved components, and that this process requires a gaseous atomic H scavenger. For gaseous oxidation, a scavenger, oxygen in common cases, is an advantage but not a requirement. OH radical efficiency in liquid phase reactions is strongly temperature dependent as radical termination reaction rates increase with temperature.

Design of high strength polymer metal interfaces by laser microstructured surfaces

NASA Astrophysics Data System (ADS)

Steinert, P.; Dittes, A.; Schimmelpfennig, R.; Scharf, I.; Lampke, T.; Schubert, A.

2018-06-01

In the areas of automotive, aeronautics and civil structures, lightweight construction is a current and a future need. Thus, multi material design has rapidly grown in importance, especially hybrid materials based on fiber reinforced plastics and aluminum offer great potential. Therefore, mechanical interlocking is a convenient way of designing the interface. Laser structuring is already used to generate a variety of surface topographies leading to high bond strengths. This paper investigates different laser structures aiming on highest joint strengths for aluminum and glass fiber reinforced polyamide 6 interfaces. Self-organizing pin structures comprised by additional micro/nano features as well as drilled hole structures, both ranging on the micrometer range, are compared to corundum blasting as a standard method for surface conditioning. For the presented surface structures, thermal joining and ultrasonic assisted joining are regarded towards their potential for an optimum joint design.

Velocity of the high-spin low-spin interface inside the thermal hysteresis loop of a spin-crossover crystal, via photothermal control of the interface motion.

PubMed

Slimani, Ahmed; Varret, François; Boukheddaden, Kamel; Garrot, Damien; Oubouchou, Hassane; Kaizaki, Sumio

2013-02-22

We investigated by optical microscopy the thermal transition of the spin-crossover dinuclear iron(II) compound [(Fe(NCSe)(py)(2))(2)(m-bpypz)]. In a high-quality crystal the high-spin (HS) low-spin (LS) thermal transition took place with a sizable hysteresis, at ~108 K and ~116 K on cooling and heating, respectively, through the growth of a single macroscopic domain with a straight LS and HS interface. The interface orientation was almost constant and its propagation velocity was close to ~6 and 26 μ m s(-1) for the on-cooling and on-heating processes, respectively. We found that the motion of the interface was sensitive to the intensity of the irradiation beam of the microscope, through a photothermal effect. By fine-tuning the intensity we could stop and even reverse the interface motion. This way we stabilized a biphasic state of the crystal, and we followed the spontaneous motion of the interface at different temperatures inside the thermal hysteresis loop. This experiment gives access for the first time to an accurate determination of the equilibrium temperature in the case of thermal hysteresis--which was not accessible by the usual quasistatic investigations. The temperature dependence of the propagation velocity inside the hysteretic interval was revealed to be highly nonlinear, and it was quantitatively reproduced by a dynamical mean-field theory, which made possible an estimate of the macroscopic energy barrier.

IAC - INTEGRATED ANALYSIS CAPABILITY

NASA Technical Reports Server (NTRS)

Frisch, H. P.

1994-01-01

The objective of the Integrated Analysis Capability (IAC) system is to provide a highly effective, interactive analysis tool for the integrated design of large structures. With the goal of supporting the unique needs of engineering analysis groups concerned with interdisciplinary problems, IAC was developed to interface programs from the fields of structures, thermodynamics, controls, and system dynamics with an executive system and database to yield a highly efficient multi-disciplinary system. Special attention is given to user requirements such as data handling and on-line assistance with operational features, and the ability to add new modules of the user's choice at a future date. IAC contains an executive system, a data base, general utilities, interfaces to various engineering programs, and a framework for building interfaces to other programs. IAC has shown itself to be effective in automatic data transfer among analysis programs. IAC 2.5, designed to be compatible as far as possible with Level 1.5, contains a major upgrade in executive and database management system capabilities, and includes interfaces to enable thermal, structures, optics, and control interaction dynamics analysis. The IAC system architecture is modular in design. 1) The executive module contains an input command processor, an extensive data management system, and driver code to execute the application modules. 2) Technical modules provide standalone computational capability as well as support for various solution paths or coupled analyses. 3) Graphics and model generation interfaces are supplied for building and viewing models. Advanced graphics capabilities are provided within particular analysis modules such as INCA and NASTRAN. 4) Interface modules provide for the required data flow between IAC and other modules. 5) User modules can be arbitrary executable programs or JCL procedures with no pre-defined relationship to IAC. 6) Special purpose modules are included, such as MIMIC (Model Integration via Mesh Interpolation Coefficients), which transforms field values from one model to another; LINK, which simplifies incorporation of user specific modules into IAC modules; and DATAPAC, the National Bureau of Standards statistical analysis package. The IAC database contains structured files which provide a common basis for communication between modules and the executive system, and can contain unstructured files such as NASTRAN checkpoint files, DISCOS plot files, object code, etc. The user can define groups of data and relations between them. A full data manipulation and query system operates with the database. The current interface modules comprise five groups: 1) Structural analysis - IAC contains a NASTRAN interface for standalone analysis or certain structural/control/thermal combinations. IAC provides enhanced structural capabilities for normal modes and static deformation analysis via special DMAP sequences. IAC 2.5 contains several specialized interfaces from NASTRAN in support of multidisciplinary analysis. 2) Thermal analysis - IAC supports finite element and finite difference techniques for steady state or transient analysis. There are interfaces for the NASTRAN thermal analyzer, SINDA/SINFLO, and TRASYS II. FEMNET, which converts finite element structural analysis models to finite difference thermal analysis models, is also interfaced with the IAC database. 3) System dynamics - The DISCOS simulation program which allows for either nonlinear time domain analysis or linear frequency domain analysis, is fully interfaced to the IAC database management capability. 4) Control analysis - Interfaces for the ORACLS, SAMSAN, NBOD2, and INCA programs allow a wide range of control system analyses and synthesis techniques. Level 2.5 includes EIGEN, which provides tools for large order system eigenanalysis, and BOPACE, which allows for geometric capabilities and finite element analysis with nonlinear material. Also included in IAC level 2.5 is SAMSAN 3.1, an engineering analysis program which contains a general purpose library of over 600 subroutin

Interfacing a small thermophotovoltaic generator to the grid

NASA Astrophysics Data System (ADS)

Durisch, W.; Grob, B.; Mayor, J.-C.; Panitz, J.-C.; Rosselet, A.

1999-03-01

A prototype thermophotovoltaic generator and grid-interfacing device have been developed to demonstrate the feasibility of grid-connected operation. For this purpose a conventional butane burner (rated power 1.35 kWth) was equipped with a ceramic composite emitter made of rare earth oxides. A water layer between emitter and photocells was used to protect the photocells against overheating. It absorbs the nonconvertible emitter radiation and is heated up thereby. The hot water so produced in larger units of this type could be used in a primary recirculation loop to transfer heat to a secondary domestic hot water system. For the photovoltaic generator, commercial grade silicon solar cells with 16% efficiency (under standard test conditions) were used. With the radiation of the emitter, a current of 4.6 A at a maximum power point voltage of 3.3 V was produced, corresponding to a DC output of 15 W and a thermal to DC power conversion efficiency of 1.1%. A specially developed high efficiency DC/DC converter and a modified, commercially available inverter were used to feed the generated power to the local grid. Under the experimental conditions in question the DC/DC-converter and the grid-inverter had efficiencies of 98 and 91%, respectively resulting in an overall interface efficiency of 89%. From modeling of the measured electrical characteristics of the photo cell generator under solar and emitter radiation, it is concluded that the photo current was about three times higher under the filtered emitter radiation. Under these conditions the electrical losses of the photocells were significantly higher than under sunlight.

Are Observed Variations of Topography of The '660' Influenced By Lateral Variations of An Underlying Interface ?

NASA Astrophysics Data System (ADS)

Castillo, J.; Mocquet, A.; Vacher, P.; Sotin, C.

Most global studies of lateral variations of topography of the '660' have been per- formed so far with long-period data. This presentation assess the seismic signature of this region when studied with broadband data in the frequency range 0.1-1 Hz. When sampled with P-to-s converted phases, this region shows a complex pattern, associat- ing 3 interfaces at the average depths of 600, 650 and 715 km. First results indicate that lateral topography variations of the '650' fit previous observations by long-period data (Gu et al., 1998), except in some subduction zones, especially in East Asia, where vari- ation trends appear to behave in an opposite way. In such regions, better correlations are found with the behaviour of the '715'. We propose that the seismic signature of long-period waves generated at the bottom of the transition zone may be influenced by both interfaces. Because of the lateral variations of their thickness and velocity jump as a function of thermal context, the signature of one interface could prevail against the other. The transformation of garnet into perovskite, and dissociation of ringwood- ite are tested as possible candidates for the '715' and '650', respectively (Vacher et al., 1998), using available thermoelastic data. Synthetic modelling of converted phases on the velocity profiles computed in different thermal contexts can explain our broadband observations. References : Gu et al., EPSL, 157, 57-67, 1998 ; Vacher et al., PEPI, 106, 275-298, 1998.

Stabilizing the Electrode/Electrolyte Interface of LiNi0.8Co0.15Al0.05O2 through Tailoring Aluminum Distribution in Microspheres as Long-Life, High-Rate, and Safe Cathode for Lithium-Ion Batteries.

PubMed

Hou, Peiyu; Zhang, Hongzhou; Deng, Xiaolong; Xu, Xijin; Zhang, Lianqi

2017-09-06

The unstable electrode/electrolyte interface of high-capacity LiNi 0.8 Co 0.15 Al 0.05 O 2 (NCA) cathodes, especially at a highly delithiated state, usually leads to the transformation of layered to spinel and/or rock-salt phases, resulting in drastic capacity fade and poor thermal stability. Herein, the Al-increased and Ni-,Co-decreased electrode surface is fabricated through tailoring element distribution in micrometer-sized spherical NCA secondary particles via coprecipitation and solid-state reactions, aimed at stabilizing the electrode/electrolyte interface during continuous cycles. As expected, it shows much extended cycle life, 93.6% capacity retention within 100 cycles, compared with that of 78.5% for the normal NCA. It also delivers large reversible capacity of about 140 mAh g -1 even at 20 C, corresponding to energy density of around 480 Wh kg -1 , which is enhanced by 45% compared to that of the normal NCA (about 330 Wh kg -1 ). Besides, the delayed heat emission temperature and reduced heat generation mean remarkably improved thermal stability. These foregoing improvements are ascribed to the Al-increased spherical secondary particle surface that stabilizes the electrode/electrolyte interface by protecting inner components from directly contacting with electrolyte and suppressing the side reaction on electrode surface between high oxidizing Ni 4+ and electrolyte.

Heat generated during seating of dental implant fixtures.

PubMed

Flanagan, Dennis

2014-04-01

Frictional heat can be generated during seating of dental implants into a drill-prepared osteotomy. This in vitro study tested the heat generated by implant seating in dense bovine mandible ramus. A thermocouple was placed approximately 0.5 mm from the rim of the osteotomy during seating of each dental implant. Four diameters of implants were tested. The average temperature increases were 0.075°C for the 5.7-mm-diameter implant, 0.97°C for the 4.7-mm-diameter implant, 1.4°C for the 3.7-mm-diameter implant, and 8.6°C for the 2.5-mm-diameter implant. The results showed that heat was indeed generated and a small temperature rise occurred, apparently by the friction of the implant surface against the fresh-cut bone surface. Bone is a poor thermal conductor. The titanium of the implant and the steel of the handpiece are much better heat conductors. Titanium may be 70 times more heat conductive than bone. The larger diameter and displacement implant may act as a heat sink to draw away any heat produced from the friction of seating the implant at the bone-implant interface. The peak temperature duration was momentary, and not measured, but this was approximately less than 1 second. Except for the 2.5-mm-diameter implants, the temperature rises and durations were found to be below those previously deemed to be detrimental, so no clinically significant osseous damage would be expected during dental implant fixture seating of standard and large-diameter-sized implants. A 2.5-mm implant may generate detrimental heat during seating in nonvital bone, but this may be clinically insignificant in vital bone. The surface area and thermal conductivity are important factors in removing generated heat transfer at the bone-implant interface. The F value as determined by analysis of variance was 69.22, and the P value was less than .0001, demonstrating significant differences between the groups considered as a whole.

Thermal Vacuum Testing of Swift XRT Ethane Heat Pipes

NASA Technical Reports Server (NTRS)

Kobel, Mark; Ku, Jentung

2003-01-01

This paper presents the results obtained from a recent ethane heat pipe program. Three identical ethane heat pipes were tested individually, and then two selected heat pipes were tested collectively in their system configuration. Heat transport, thermal conductance, and non-condensable gas tests were performed on each heat pipe. To gain insight into the reflux operation as seen at spacecraft level ground testing, the test fixture was oriented in a vertical configuration. The system level test included a computer-controlled heater designed to emulate the heat load generated at the thermoelectric cooler interface. The system performance was successfully characterized for a wide range of environmental conditions while staying within the operating limits.

Vehicle drive module having improved cooling configuration

DOEpatents

Radosevich, Lawrence D.; Meyer, Andreas A.; Kannenberg, Daniel G.; Kaishian, Steven C.; Beihoff, Bruce C.

2007-02-13

An electric vehicle drive includes a thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Burner liner thermal/structural load modeling: TRANCITS program user's manual

NASA Technical Reports Server (NTRS)

Maffeo, R.

1985-01-01

Transfer Analysis Code to Interface Thermal/Structural Problems (TRANCITS) is discussed. The TRANCITS code satisfies all the objectives for transferring thermal data between heat transfer and structural models of combustor liners and it can be used as a generic thermal translator between heat transfer and stress models of any component, regardless of the geometry. The TRANCITS can accurately and efficiently convert the temperature distributions predicted by the heat transfer programs to those required by the stress codes. It can be used for both linear and nonlinear structural codes and can produce nodal temperatures, elemental centroid temperatures, or elemental Gauss point temperatures. The thermal output of both the MARC and SINDA heat transfer codes can be interfaced directly with TRANCITS, and it will automatically produce stress model codes formatted for NASTRAN and MARC. Any thermal program and structural program can be interfaced by using the neutral input and output forms supported by TRANCITS.

Probing Nanoscale Thermal Transport in Surfactant Solutions

PubMed Central

Cao, Fangyu; Liu, Ying; Xu, Jiajun; He, Yadong; Hammouda, B.; Qiao, Rui; Yang, Bao

2015-01-01

Surfactant solutions typically feature tunable nanoscale, internal structures. Although rarely utilized, they can be a powerful platform for probing thermal transport in nanoscale domains and across interfaces with nanometer-size radius. Here, we examine the structure and thermal transport in solution of AOT (Dioctyl sodium sulfosuccinate) in n-octane liquids using small-angle neutron scattering, thermal conductivity measurements, and molecular dynamics simulations. We report the first experimental observation of a minimum thermal conductivity occurring at the critical micelle concentration (CMC): the thermal conductivity of the surfactant solution decreases as AOT is added till the onset of micellization but increases as more AOT is added. The decrease of thermal conductivity with AOT loading in solutions in which AOT molecules are dispersed as monomers suggests that even the interfaces between individual oleophobic headgroup of AOT molecules and their surrounding non-polar octane molecules can hinder heat transfer. The increase of thermal conductivity with AOT loading after the onset of micellization indicates that the thermal transport in the core of AOT micelles and across the surfactant-oil interfaces, both of which span only a few nanometers, are efficient. PMID:26534840

Origin of flatband voltage shift and unusual minority carrier generation in thermally grown GeO2/Ge metal-oxide-semiconductor devices

NASA Astrophysics Data System (ADS)

Hosoi, Takuji; Kutsuki, Katsuhiro; Okamoto, Gaku; Saito, Marina; Shimura, Takayoshi; Watanabe, Heiji

2009-05-01

Improvement in electrical properties of thermally grown GeO2/Ge metal-oxide-semiconductor (MOS) capacitors, such as significantly reduced flatband voltage (VFB) shift, small hysteresis, and minimized minority carrier response in capacitance-voltage (C-V) characteristics, has been demonstrated by in situ low temperature vacuum annealing prior to gate electrode deposition. Thermal desorption analysis has revealed that not only water but also hydrocarbons are easily infiltrated into GeO2 layers during air exposure and desorbed at around 300 °C, indicating that organic molecules within GeO2/Ge MOS structures are possible origins of electrical defects. The inversion capacitance, indicative of minority carrier generation, increases with air exposure time for Au/GeO2/Ge MOS capacitors, while maintaining an interface state density (Dit) of about a few 1011 cm-2 eV-1. Unusual increase in inversion capacitance was found to be suppressed by Al2O3 capping (Au/Al2O3/GeO2/Ge structures). This suggests that electrical defects induced outside the Au electrode by infiltrated molecules may enhance the minority carrier generation, and thus acting as a minority carrier source just like MOS field-effect transistors.

The Thermal and Microstructural Effect of Plasticizing HMX-Nitrocellulose Composites

DOE PAGES

Yeager, John David; Watkins, Erik Benjamin; Duque, Amanda Lynn; ...

2017-03-15

Thermal ignition via self-heating (cook-off) of cyclotetramethylene-tetranitramine (HMX)-containing plastic-bonded explosives (PBXs) is driven by the β → δ phase transition in the HMX, which is affected if not dominated by microstructure. Here, we studied the HMX-binder interface and phase transition for several variations of PBX 9404 (HMX with plasticized nitrocellulose [NC] binder). Neutron reflectometry was used to examine the interface under several conditions—pristine, after aging, and after thermal treatment. The initial interfacial structure depended on the plasticizer, but the interface homogenized over time. Thermal and optical analyses showed that all formulated materials had higher transition temperatures than neat HMX. Thismore » effect increased with NC content.« less

The Thermal and Microstructural Effect of Plasticizing HMX-Nitrocellulose Composites

NASA Astrophysics Data System (ADS)

Yeager, John D.; Watkins, Erik B.; Higginbotham Duque, Amanda L.; Majewski, Jaroslaw

2018-01-01

Thermal ignition via self-heating (cook-off) of cyclotetramethylene-tetranitramine (HMX)-containing plastic-bonded explosives (PBXs) is driven by the β → δ phase transition in the HMX, which is affected if not dominated by microstructure. Here, the HMX-binder interface and phase transition were studied for several variations of PBX 9404 (HMX with plasticized nitrocellulose [NC] binder). Neutron reflectometry was used to examine the interface under several conditions-pristine, after aging, and after thermal treatment. The initial interfacial structure depended on the plasticizer, but the interface homogenized over time. Thermal and optical analyses showed that all formulated materials had higher transition temperatures than neat HMX. This effect increased with NC content.

Interface Shape and Convection During Solidification and Melting of Succinonitrile

NASA Technical Reports Server (NTRS)

Degroh, Henry C., III; Lindstrom, Tiffany

1994-01-01

An experimental study was conducted of the crystal growth of succinonitrile during solidification, melting, and no-growth conditions using a horizontal Bridgman furnace and square glass ampoule. For use as input boundary conditions to numerical codes, thermal profiles on the outside of the ampoule at five locations around its periphery were measured along the ampoule's length. Temperatures inside the ampoule were also measured. The shapes of the s/l interface in various two dimensional planes were quantitatively determined. Though interfaces were nondendritic and noncellular, they were not flat, but were highly curved and symmetric in only one unique longitudinal y-z plane (at x=O). The shapes of the interface were dominated by the primary longitudinal flow cell characteristic of shallow cavity flow in horizontal Bridgman; this flow cell was driven by the imposed furnace temperature gradient and caused a 'radical' thermal gradient such that the upper half of the ampoule was hotter than the bottom half. We believe that due to the strong convection, the release of latent heat does not significantly influence the thermal conditions near the interface. We hope that the interface shape and thermal data presented in this paper can be used to optimize crystal growth processes and validate numerical models.

Mixing and transient interface condensation of a liquid hydrogen tank

NASA Technical Reports Server (NTRS)

Lin, C. S.; Hasan, M. M.; Nyland, T. W.

1993-01-01

Experiments were conducted to investigate the effect of axial jet-induced mixing on the pressure reduction of a thermally stratified liquid hydrogen tank. The tank was nearly cylindrical, having a volume of about 0.144 cu m with 0.559 m in diameter and 0.711 m long. A mixer/pump unit, which had a jet nozzle outlet of 0.0221 m in diameter was located 0.178 m from the tank bottom and was installed inside the tank to generate the axial jet mixing and tank fluid circulation. The liquid fill and jet flow rate ranged from 42 to 85 percent (by volume) and 0.409 to 2.43 cu m/hr, respectively. Mixing tests began with the tank pressure ranging from 187.5 to 238.5 kPa at which the thermal stratification results in 4.9 to 6.2 K liquid sub cooling. The mixing time and transient vapor condensation rate at the liquid-vapor interface are determined. Two mixing time correlations, based on the thermal equilibrium and pressure equilibrium, are developed. Both mixing time correlations are expressed as functions of system and buoyancy parameters and compared well with other experimental data. The steady state condensation rate correlation of Sonin et al. based on steam-water data is modified and expressed as a function of jet subcooling. The limited liquid hydrogen data of the present study shows that the modified steady state condensation rate correlation may be used to predict the transient condensation rate in a mixing process if the instantaneous values of jet sub cooling and turbulence intensity at the interface are employed.

Influence of sodium fluoride (NaF) on the crystallization and spectral properties of L-tyrosine

NASA Astrophysics Data System (ADS)

Thenmozhi, M.; Suguna, K.; Sekar, C.

2011-12-01

L-Tyrosine (C 9H 11NO 3) is an essential amino acid in living organisms. It is also a building unit in protein, takes part in bio-synthesis of hormones, neurotransmitters, pigments and one of the organic chemical constituents of urinary stones. L-Tyrosine has been crystallized in silica gel by double diffusion technique with and without the addition of NaF. The crystals had rosette-like shape. In case of fluoride addition, two types of crystals have formed: rosette like crystallites, at the gel-solution interface and reticulate type crystallites beneath the interface. XRD results confirmed that both the products are of L-tyrosine with identical crystal structures. Crystal structure, morphology, thermal and spectral properties are analyzed using powder X-ray diffraction (XRD), scanning electron microscopy (SEM), thermogravimetric and differential thermal analysis (TG-DTA), Fourier transform infrared spectroscopy (FTIR) and UV-vis transmittance studies. The TG-DTA results suggest that the thermal stability of L-tyrosine has markedly improved due to fluoride doping. Optical band gap energy of NaF grown L-tyrosine crystallite is estimated as 4.28 eV. Second harmonic generation efficiency test indicates that L-tyrosine crystals can be used for application in nonlinear optical devices.

Hyperthermia in bone generated with MR imaging-controlled focused ultrasound: control strategies and drug delivery.

PubMed

Staruch, Robert; Chopra, Rajiv; Hynynen, Kullervo

2012-04-01

To evaluate the feasibility of achieving image-guided drug delivery in bone by using magnetic resonance (MR) imaging-controlled focused ultrasound hyperthermia and temperature-sensitive liposomes. Experiments were approved by the institutional animal care committee. Hyperthermia (43°C, 20 minutes) was generated in 10-mm-diameter regions at a muscle-bone interface in nine rabbit thighs by using focused ultrasound under closed-loop temperature control with MR thermometry. Thermosensitive liposomal doxorubicin was administered systemically during heating. Heating uniformity and drug delivery were evaluated for control strategies with the temperature control image centered 10 mm (four rabbits) or 0 mm (five rabbits) from the bone. Simulations estimated temperature elevations in bone. Drug delivery was quantified by using the fluorescence of doxorubicin extracted from bone marrow and muscle and was compared between treated and untreated thighs by using the one-sided Wilcoxon signed rank test. With ultrasound focus and MR temperature control plane 0 mm and 10 mm from the bone interface, average target region temperatures were 43.1°C and 43.3°C, respectively; numerically estimated bone temperatures were 46.8°C and 78.1°C. The 10-mm offset resulted in thermal ablation; numerically estimated muscle temperature was 66.1°C at the bone interface. Significant increases in doxorubicin concentration occurred in heated versus unheated marrow (8.2-fold, P = .002) and muscle (16.8-fold, P = .002). Enhancement occurred for 0- and 10-mm offsets, which suggests localized drug delivery in bone is possible with both hyperthermia and thermal ablation. MR imaging-controlled focused ultrasound can achieve localized hyperthermia in bone for image-guided drug delivery in bone with temperature-sensitive drug carriers. © RSNA, 2012.

Thermal transport across metal silicide-silicon interfaces: First-principles calculations and Green's function transport simulations

NASA Astrophysics Data System (ADS)

Sadasivam, Sridhar; Ye, Ning; Feser, Joseph P.; Charles, James; Miao, Kai; Kubis, Tillmann; Fisher, Timothy S.

2017-02-01

Heat transfer across metal-semiconductor interfaces involves multiple fundamental transport mechanisms such as elastic and inelastic phonon scattering, and electron-phonon coupling within the metal and across the interface. The relative contributions of these different transport mechanisms to the interface conductance remains unclear in the current literature. In this work, we use a combination of first-principles calculations under the density functional theory framework and heat transport simulations using the atomistic Green's function (AGF) method to quantitatively predict the contribution of the different scattering mechanisms to the thermal interface conductance of epitaxial CoSi2-Si interfaces. An important development in the present work is the direct computation of interfacial bonding from density functional perturbation theory (DFPT) and hence the avoidance of commonly used "mixing rules" to obtain the cross-interface force constants from bulk material force constants. Another important algorithmic development is the integration of the recursive Green's function (RGF) method with Büttiker probe scattering that enables computationally efficient simulations of inelastic phonon scattering and its contribution to the thermal interface conductance. First-principles calculations of electron-phonon coupling reveal that cross-interface energy transfer between metal electrons and atomic vibrations in the semiconductor is mediated by delocalized acoustic phonon modes that extend on both sides of the interface, and phonon modes that are localized inside the semiconductor region of the interface exhibit negligible coupling with electrons in the metal. We also provide a direct comparison between simulation predictions and experimental measurements of thermal interface conductance of epitaxial CoSi2-Si interfaces using the time-domain thermoreflectance technique. Importantly, the experimental results, performed across a wide temperature range, only agree well with predictions that include all transport processes: elastic and inelastic phonon scattering, electron-phonon coupling in the metal, and electron-phonon coupling across the interface.

Thermal conductivity engineering of bulk and one-dimensional Si-Ge nanoarchitectures.

PubMed

Kandemir, Ali; Ozden, Ayberk; Cagin, Tahir; Sevik, Cem

2017-01-01

Various theoretical and experimental methods are utilized to investigate the thermal conductivity of nanostructured materials; this is a critical parameter to increase performance of thermoelectric devices. Among these methods, equilibrium molecular dynamics (EMD) is an accurate technique to predict lattice thermal conductivity. In this study, by means of systematic EMD simulations, thermal conductivity of bulk Si-Ge structures (pristine, alloy and superlattice) and their nanostructured one dimensional forms with square and circular cross-section geometries (asymmetric and symmetric) are calculated for different crystallographic directions. A comprehensive temperature analysis is evaluated for selected structures as well. The results show that one-dimensional structures are superior candidates in terms of their low lattice thermal conductivity and thermal conductivity tunability by nanostructuring, such as by diameter modulation, interface roughness, periodicity and number of interfaces. We find that thermal conductivity decreases with smaller diameters or cross section areas. Furthermore, interface roughness decreases thermal conductivity with a profound impact. Moreover, we predicted that there is a specific periodicity that gives minimum thermal conductivity in symmetric superlattice structures. The decreasing thermal conductivity is due to the reducing phonon movement in the system due to the effect of the number of interfaces that determine regimes of ballistic and wave transport phenomena. In some nanostructures, such as nanowire superlattices, thermal conductivity of the Si/Ge system can be reduced to nearly twice that of an amorphous silicon thermal conductivity. Additionally, it is found that one crystal orientation, [Formula: see text]100[Formula: see text], is better than the [Formula: see text]111[Formula: see text] crystal orientation in one-dimensional and bulk SiGe systems. Our results clearly point out the importance of lattice thermal conductivity engineering in bulk and nanostructures to produce high-performance thermoelectric materials.

Thermal conductivity engineering of bulk and one-dimensional Si-Ge nanoarchitectures

PubMed Central

Kandemir, Ali; Ozden, Ayberk; Cagin, Tahir; Sevik, Cem

2017-01-01

Various theoretical and experimental methods are utilized to investigate the thermal conductivity of nanostructured materials; this is a critical parameter to increase performance of thermoelectric devices. Among these methods, equilibrium molecular dynamics (EMD) is an accurate technique to predict lattice thermal conductivity. In this study, by means of systematic EMD simulations, thermal conductivity of bulk Si-Ge structures (pristine, alloy and superlattice) and their nanostructured one dimensional forms with square and circular cross-section geometries (asymmetric and symmetric) are calculated for different crystallographic directions. A comprehensive temperature analysis is evaluated for selected structures as well. The results show that one-dimensional structures are superior candidates in terms of their low lattice thermal conductivity and thermal conductivity tunability by nanostructuring, such as by diameter modulation, interface roughness, periodicity and number of interfaces. We find that thermal conductivity decreases with smaller diameters or cross section areas. Furthermore, interface roughness decreases thermal conductivity with a profound impact. Moreover, we predicted that there is a specific periodicity that gives minimum thermal conductivity in symmetric superlattice structures. The decreasing thermal conductivity is due to the reducing phonon movement in the system due to the effect of the number of interfaces that determine regimes of ballistic and wave transport phenomena. In some nanostructures, such as nanowire superlattices, thermal conductivity of the Si/Ge system can be reduced to nearly twice that of an amorphous silicon thermal conductivity. Additionally, it is found that one crystal orientation, <100>, is better than the <111> crystal orientation in one-dimensional and bulk SiGe systems. Our results clearly point out the importance of lattice thermal conductivity engineering in bulk and nanostructures to produce high-performance thermoelectric materials. PMID:28469733

Space Shuttle Main Engine structural analysis and data reduction/evaluation. Volume 2: High pressure oxidizer turbo-pump turbine end bearing analysis

NASA Technical Reports Server (NTRS)

Sisk, Gregory A.

1989-01-01

The high-pressure oxidizer turbopump (HPOTP) consists of two centrifugal pumps, on a common shaft, that are directly driven by a hot-gas turbine. Pump shaft axial thrust is balanced in that the double-entry main inducer/impeller is inherently balanced and the thrusts of the preburner pump and turbine are nearly equal but opposite. Residual shaft thrust is controlled by a self-compensating, non-rubbing, balance piston. Shaft hang-up must be avoided if the balance piston is to perform properly. One potential cause of shaft hang-up is contact between the Phase 2 bearing support and axial spring cartridge of the HPOTP main pump housing. The status of the bearing support/axial spring cartridge interface is investigated under current loading conditions. An ANSYS version 4.3, three-dimensional, finite element model was generated on Lockheed's VAX 11/785 computer. A nonlinear thermal analysis was then executed on the Marshall Space Flight Center Engineering Analysis Data System (EADS). These thermal results were then applied along with the interference fit and bolt preloads to the model as load conditions for a static analysis to determine the gap status of the bearing support/axial spring cartridge interface. For possible further analysis of the local regions of HPOTP main pump housing assembly, detailed ANSYS submodels were generated using I-DEAS Geomod and Supertab (Appendix A).

Thermal analysis of continuous and patterned multilayer films in the presence of a nanoscale hot spot

NASA Astrophysics Data System (ADS)

Juang, Jia-Yang; Zheng, Jinglin

2016-10-01

Thermal responses of multilayer films play essential roles in state-of-the-art electronic systems, such as photo/micro-electronic devices, data storage systems, and silicon-on-insulator transistors. In this paper, we focus on the thermal aspects of multilayer films in the presence of a nanoscale hot spot induced by near field laser heating. The problem is set up in the scenario of heat assisted magnetic recording (HAMR), the next-generation technology to overcome the data storage density limit imposed by superparamagnetism. We characterized thermal responses of both continuous and patterned multilayer media films using transient thermal modeling. We observed that material configurations, in particular, the thermal barriers at the material layer interfaces crucially impact the temperature field hence play a key role in determining the hot spot geometry, transient response and power consumption. With a representative generic media model, we further explored the possibility of optimizing thermal performances by designing layers of heat sink and thermal barrier. The modeling approach demonstrates an effective way to characterize thermal behaviors of micro and nano-scale electronic devices with multilayer thin film structures. The insights into the thermal transport scheme will be critical for design and operations of such electronic devices.

Conversion efficiency of skutterudite-based thermoelectric modules.

PubMed

Salvador, James R; Cho, Jung Y; Ye, Zuxin; Moczygemba, Joshua E; Thompson, Alan J; Sharp, Jeffrey W; Koenig, Jan D; Maloney, Ryan; Thompson, Travis; Sakamoto, Jeffrey; Wang, Hsin; Wereszczak, Andrew A

2014-06-28

Presently, the only commercially available power generating thermoelectric (TE) modules are based on bismuth telluride (Bi2Te3) alloys and are limited to a hot side temperature of 250 °C due to the melting point of the solder interconnects and/or generally poor power generation performance above this point. For the purposes of demonstrating a TE generator or TEG with higher temperature capability, we selected skutterudite based materials to carry forward with module fabrication because these materials have adequate TE performance and are mechanically robust. We have previously reported the electrical power output for a 32 couple skutterudite TE module, a module that is type identical to ones used in a high temperature capable TEG prototype. The purpose of this previous work was to establish the expected power output of the modules as a function of varying hot and cold side temperatures. Recent upgrades to the TE module measurement system built at the Fraunhofer Institute for Physical Measurement Techniques allow for the assessment of not only the power output, as previously described, but also the thermal to electrical energy conversion efficiency. Here we report the power output and conversion efficiency of a 32 couple, high temperature skutterudite module at varying applied loading pressures and with different interface materials between the module and the heat source and sink of the test system. We demonstrate a 7% conversion efficiency at the module level when a temperature difference of 460 °C is established. Extrapolated values indicate that 7.5% is achievable when proper thermal interfaces and loading pressures are used.

Characterization of the Heat Extraction Capability of a Compliant, Sliding, Thermal Interface for Use in a High Temperature, Vacuum, Microgravity Furnace

NASA Technical Reports Server (NTRS)

Bellomy-Ezell, Jenny; Farmer, Jeff; Breeding, Shawn; Spivey, Reggie

2001-01-01

A compliant, thermal interface material is tested to evaluate its thermal behavior at elevated temperatures, in vacuum conditions, and under varying levels of compression. Preliminary results indicate that the thermal performance of this polymer fiber-based, felt-like material is sufficient to meet thermal extraction requirements for the Quench Module Insert, a Bridgman furnace for microgravity material science investigation. This paper discusses testing and modeling approaches employed, gives of a status of characterization activities and provides preliminary test results.

Thermal conductivity of SrVO3-SrTiO3 thin films: Evidence of intrinsic thermal resistance at the interface between oxide layers

NASA Astrophysics Data System (ADS)

Katsufuji, T.; Saiki, T.; Okubo, S.; Katayama, Y.; Ueno, K.

2018-05-01

By using a technique of thermoreflectance that can precisely measure the thermal conductivity of thin films, we found that the thermal conductivity of SrVO3-SrTiO3 multilayer thin films normal to the surface was substantially reduced by decreasing the thickness of each layer. This indicates that a large intrinsic thermal resistance exists at the interface between SrVO3 and SrTiO3 in spite of the similar phononic properties for these two compounds.

Thermoelectric and morphological effects of Peltier pulsing on directional solidification of eutectic Bi-Mn

NASA Technical Reports Server (NTRS)

Silberstein, R. P.; Larson, D. J., Jr.; Dressler, B.

1984-01-01

Extensive in situ thermal measurements using Peltier Interface Demarcation (PID) during directional solidification of eutectic Bi/MnBi were carried out. Observations indicate that significant thermal transients occur throughout the sample as a result of the Peltier pulsing. The contributions of the Peltier, Thomson, and Joule heats were separated and studied as a function of pulse intensity and polarity. The Joule and the combined Peltier and Thomson thermal contributions were determined as a function of time during and after the current pulses, close to the solid/liquid interface. Variations of the Bi/MnBi particle morphology clearly reveal the interface shape, changes in interface velocity, meltback, and temporary loss of cooperative growth, as a result of the pulsing.

Self-pressurization of a spherical liquid hydrogen storage tank in a microgravity environment

NASA Technical Reports Server (NTRS)

Lin, C. S.; Hasan, M. M.

1992-01-01

Thermal stratification and self-pressurization of partially filled liquid hydrogen (LH2) storage tanks under microgravity condition is studied theoretically. A spherical tank is subjected to a uniform and constant wall heat flux. It is assumed that a vapor bubble is located in the tank center such that the liquid-vapor interface and tank wall form two concentric spheres. This vapor bubble represents an idealized configuration of a wetting fluid in microgravity conditions. Dimensionless mass and energy conservation equations for both vapor and liquid regions are numerically solved. Coordinate transformation is used to capture the interface location which changes due to liquid thermal expansion, vapor compression, and mass transfer at liquid-vapor interface. The effects of tank size, liquid fill level, and wall heat flux on the pressure rise and thermal stratification are studied. Liquid thermal expansion tends to cause vapor condensation and wall heat flux tends to cause liquid evaporation at the interface. The combined effects determine the direction of mass transfer at the interface. Liquid superheat increases with increasing wall heat flux and liquid fill level and approaches an asymptotic value.

Carbon nanotube thermal interfaces and related applications

NASA Astrophysics Data System (ADS)

Hodson, Stephen L.

The development of thermal interface materials (TIMs) is necessitated by the temperature drop across interfacing materials arising from macro and microscopic irregularities of their surfaces that constricts heat through small contact regions as well as mismatches in their thermal properties. Similar to other types of TIMs, CNT TIMs alleviate the thermal resistance across the interface by thermally bridging two materials together with cylindrical, high-aspect ratio, and nominally vertical conducting elements. Within the community of TIM engineers, the vision driving the development of CNT TIMs was born from measurements that revealed impressively high thermal conductivities of individual CNTs. This vision was then projected to efforts focused on packing many individual CNTs on a single substrate that efficiently conduct heat in parallel and ultimately through many contact regions at CNT-to-substrate contacts. This thesis encompasses a comprehensive investigation of the viability of carbon nanotube based thermal interface materials (CNT TIMs) to efficiently conduct heat across two contacting materials. The efforts in this work were initially devoted to engaging CNT TIMs with an opposing substrate using two bonding techniques. Using palladium hexadecanethiolate, Pd(SC16H35)2 the CNT ends were bonded to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The palladium weld is particularly attractive for its mechanical stability at high temperatures. The engagement of CNT TIMs with an opposing substrate was also achieved by inserting a solder foil between the CNT TIM and opposing substrate and subsequently raising the temperature of the interface above the eutectic point of the solder foil. This bonding technique creates a strong weld that not only reduces the thermal resistance significantly but also minimizes the change in thermal resistance with an applied compressive load. The thermal performance was further improved by infiltrating the CNT TIM with paraffin wax, which serves as an alternate pathway for heat conduction across the interface that ultimately reduces the bulk thermal resistance of the CNT TIM. For CNT TIMs synthesized at the Birck Nanotechnology Center at Purdue University, the thermal resistance was shown to scale linearly with their aggregate, as-grown height. Thus, the bulk thermal resistance can alternatively be tuned by adjusting the as-grown height. The linear relationship between thermal resistance and CNT TIM height provides a simple and efficient methodology to estimate the contact resistance and effective thermal conductivity of CNT TIMs. In this work, the contact resistance and effective thermal conductivity were estimated using two measurement techniques: (i) one-dimensional, steady-state reference bar and (ii) photoacoustic technique. A discrepancy in the estimated contact resistance exists between the two measurement techniques, which is due to the difficulty in measuring the true contact area. In contrast, the effective thermal conductivities estimated from both measurement techniques moderately agreed and were estimated to be on the order of O(1 W/mK). The final chapter is in collaboration with Sandia National Laboratories and focuses on the development of an apparatus to measure the thermal conductivity of insulation materials critical for the operation of molten salt batteries. Molten salt batteries are particularly useful power sources for radar and guidance systems in military applications such as guided missiles, ordinance, and other weapons. Molten salt batteries are activated by raising the temperature of the electrolyte above its melting temperature using pyrotechnic heat pellets. The battery will remain active as long as the electrolyte is molten. As a result, the thermal processes within the components and interactions between them are critical to the overall performance of molten salt batteries. A molten salt battery is typically thermally insulated using wrappable and board-like insulation materials such as Fiberfrax wrap, Fiberfrax board, and Min-K insulation. The Fiberfrax board and Min-K insulation are composites of alumino-silicate and fumed silica-titania, respectively. In Chapter 9, the thermal conductivities of the Fiberfrax board and Min-K insulation were measured under different uniaxial compressive states and ambient environments. The thermal conductivity of the mixed separator pellets (LiCl/MgO/KCl) was also measured along with its contact resistances with interfacing members. To measure the thermal quantities, a steady-state reference bar with thermocouples was employed. The resulting values serve as inputs to a thermal model that aims to predict lifetimes of the batteries. (Abstract shortened by ProQuest.).

Elucidation of the atomic-scale mechanism of the anisotropic oxidation rate of 4H-SiC between the (0001) Si-face and ( 000 1 ¯ ) C-face by using a new Si-O-C interatomic potential

NASA Astrophysics Data System (ADS)

Takamoto, So; Yamasaki, Takahiro; Ohno, Takahisa; Kaneta, Chioko; Hatano, Asuka; Izumi, Satoshi

2018-05-01

Silicon carbide (SiC) is an attractive semiconductor material for applications in power electronic devices. However, fabrication of a high-quality SiC/SiO2 interface has been a challenge. It is well-known that there is a great difference in the oxidation rate between the Si-face and the C-face and that the quality of oxide on the Si-face is greater than that on the C-face. However, the atomistic mechanism of the thermal oxidation of SiC remains to be solved. In this paper, a new Si-O-C interatomic potential was developed to reproduce the kinetics of the thermal oxidation of SiC. Using this newly developed potential, large-scale SiC oxidation simulations at various temperatures were performed. The results showed that the activation energy of the Si-face is much larger than that of the C-face. In the case of the Si-face, a flat and aligned interface structure including Si1+ was created. Based on the estimated activation energies of the intermediate oxide states, it is proposed that the stability of the flat interface structure is the origin of the high activation energy of the oxidation of the Si-face. In contrast, in the case of the C-face, it is found that the Si atom at the interface is easily pulled up by the O atoms. This process generates the disordered interface and decreases the activation energy of the oxidation. It is also proposed that many excess C atoms are created in the case of the C-face.

Pressurized-Flat-Interface Heat Exchanger

NASA Technical Reports Server (NTRS)

Voss, F. E.; Howell, H. R.; Winkler, R. V.

1990-01-01

High thermal conductance obtained without leakage between loops. Heat-exchanger interface enables efficient transfer of heat between two working fluids without allowing fluids to intermingle. Interface thin, flat, and easy to integrate into thermal system. Possible application in chemical or pharmaceutical manufacturing when even trace contamination of process stream with water or other coolant ruins product. Reduces costs when highly corrosive fluids must be cooled or heated.

Solar energy/utility interface - The technical issues

NASA Astrophysics Data System (ADS)

Tabors, R. D.; White, D. C.

1982-01-01

The technical and economic factors affecting an interface between solar/wind power sources and utilities are examined. Photovoltaic, solar thermal, and wind powered systems are subject to stochastic local climatic variations and as such may require full back-up services from utilities, which are then in a position of having reserve generating power and power lines and equipment which are used only part time. The low reliability which has degraded some economies of scale formerly associated with large, centralized power plants, and the lowered rate of the increase in electricity usage is taken to commend the inclusion of power sources with a modular nature such as is available from solar derived electrical generation. Technical issues for maintaining the quality of grid power and also effectively metering purchased and supplied back-up power as part of a homeostatic system of energy control are discussed. It is concluded that economic considerations, rather than technical issues, bear the most difficulty in integrating solar technologies into the utility network.

Characterization of the heat transfer properties of thermal interface materials

NASA Astrophysics Data System (ADS)

Fullem, Travis Z.

Physicists have studied the thermal conductivity of solids for decades. As a result of these efforts, thermal conduction in crystalline solids is well understood; there are detailed theories describing thermal conduction due to electrons and phonons. Phonon scattering and transmission at solid/solid interfaces, particularly above cryogenic temperatures, is not well understood and more work is needed in this area. The desire to solve engineering problems which require good thermal contact between mating surfaces has provided enhanced motivation for furthering the state of the art on this topic. Effective thermal management is an important design consideration in microelectronic systems. A common technique for removing excess heat from an electronic device is to attach a heatsink to the device; it is desirable to minimize the thermal resistance between the device and the heatsink. This can be accomplished by placing a thermal interface material (TIM) between the two surfaces. Due to the ever-increasing power densities found in electronic components, there is a desire to design better TIMs, which necessitates the ability to characterize TIM bondlines and to better understand the physics of heat conduction through TIM bondlines. A micro Fourier apparatus which employs Pt thin film thermometers of our design has been built and is capable of precisely quantifying the thermal resistance of thermal interface materials. In the present work several types of commercially available TIMs have been studied using this apparatus, including: greases, filled epoxies, and thermally conductive pads. In the case of filled epoxies, bondlines of various thicknesses, ranging from thirty microns to several hundred microns, have been measured. The microstructure of these bondlines has been investigated using optical microscopy and acoustic microscopy. Measured values of thermal conductivity are considered in terms of microstructural features such as percolation networks and filler particle depleted regions at the interface between the TIM and the substrate. The extent to which depleted regions contribute to the interfacial resistance is examined. The relationship between electrical and thermal resistance of the TIM bondline is considered in the context of comparing the relative contribution of electron and phonon heat conduction and how this correlates to microstructural features.

High-Temperature Performance of Stacked Silicon Nanowires for Thermoelectric Power Generation

NASA Astrophysics Data System (ADS)

Stranz, Andrej; Waag, Andreas; Peiner, Erwin

2013-07-01

Deep reactive-ion etching at cryogenic temperatures (cryo-DRIE) has been used to produce arrays of silicon nanowires (NWs) for thermoelectric (TE) power generation devices. Using cryo-DRIE, we were able to fabricate NWs of large aspect ratios (up to 32) using a photoresist mask. Roughening of the NW sidewalls occurred, which has been recognized as beneficial for low thermal conductivity. Generated NWs, which were 7 μm in length and 220 nm to 270 nm in diameter, were robust enough to be stacked with a bulk silicon chip as a common top contact to the NWs. Mechanical support of the NW array, which can be created by filling the free space between the NWs using silicon oxide or polyimide, was not required. The Seebeck voltage, measured across multiple stacks of up to 16 bulk silicon dies, revealed negligible thermal interface resistance. With stacked silicon NWs, we observed Seebeck voltages that were an order of magnitude higher than those observed for bulk silicon. Degradation of the TE performance of silicon NWs was not observed for temperatures up to 470°C and temperature gradients up to 170 K.

Compatibility between Co-Metallized PbTe Thermoelectric Legs and an Ag-Cu-In Brazing Alloy.

PubMed

Ben-Ayoun, Dana; Sadia, Yatir; Gelbstein, Yaniv

2018-01-10

In thermoelectric (TE) generators, maximizing the efficiency of conversion of direct heat to electricity requires the reduction of any thermal and electrical contact resistances between the TE legs and the metallic contacts. This requirement is especially challenging in the development of intermediate to high-temperature TE generators. PbTe-based TE materials are known to be highly efficient up to temperatures of around 500 °C; however, only a few practical TE generators based on these materials are currently commercially available. One reason for that is the insufficient bonding techniques between the TE legs and the hot-side metallic contacts. The current research is focused on the interaction between cobalt-metallized n -type 9.104 × 10 -3 mol % PbI₂-doped PbTe TE legs and the Ag 0.32 Cu 0.43 In 0.25 brazing alloy, which is free of volatile species. Clear and fine interfaces without any noticeable formation of adverse brittle intermetallic compounds were observed following prolonged thermal treatment testing. Moreover, a reasonable electrical contact resistance of ~2.25 mΩmm² was observed upon brazing at 600 °C, highlighting the potential of such contacts while developing practical PbTe-based TE generators.

Efficient p-n junction-based thermoelectric generator that can operate at extreme temperature conditions

NASA Astrophysics Data System (ADS)

Chavez, Ruben; Angst, Sebastian; Hall, Joseph; Maculewicz, Franziska; Stoetzel, Julia; Wiggers, Hartmut; Thanh Hung, Le; Van Nong, Ngo; Pryds, Nini; Span, Gerhard; Wolf, Dietrich E.; Schmechel, Roland; Schierning, Gabi

2018-01-01

In many industrial processes, a large proportion of energy is lost in the form of heat. Thermoelectric generators can convert this waste heat into electricity by means of the Seebeck effect. However, the use of thermoelectric generators in practical applications on an industrial scale is limited in part because electrical, thermal, and mechanical bonding contacts between the semiconductor materials and the metal electrodes in current designs are not capable of withstanding thermal-mechanical stress and alloying of the metal-semiconductor interface when exposed to the high temperatures occurring in many real-world applications. Here we demonstrate a concept for thermoelectric generators that can address this issue by replacing the metallization and electrode bonding on the hot side of the device by a p-n junction between the two semiconductor materials, making the device robust against temperature induced failure. In our proof-of-principle demonstration, a p-n junction device made from nanocrystalline silicon is at least comparable in its efficiency and power output to conventional devices of the same material and fabrication process, but with the advantage of sustaining high hot side temperatures and oxidative atmosphere.

Understanding the liquid-liquid (water-hexane) interface

NASA Astrophysics Data System (ADS)

Murad, Sohail; Puri, Ishwar K.

2017-10-01

Nonequilibrium molecular dynamics simulations are employed to investigate the interfacial thermal resistance of nanoscale hexane-water interfaces subject to an applied heat flux. Our studies show that these liquid-liquid interfaces exhibit behavior significantly dissimilar to that of solid-liquid and solid-vapor interfaces. Notably, the thermal resistance of a hexane-water interface is contingent on the interfacial temperature gradient alone with negligible dependence on the mean interfacial temperature, while the solid-liquid dependent strongly on the interfacial temperature. Application of a heat flux also increases the interface thickness significantly as compared to an equilibrium isothermal interface. Since liquid-liquid interfaces have been proposed for diverse applications, e.g., sensors for wastewater treatment and for extraction of toxic ions from water, they can be designed to be wider by applying a heat flux. This may allow the interface to be used for other applications not possible currently because of the very limited thickness of the interface in isothermal systems.

Evaluation of the thermal conductance of flip-chip bonding structure utilizing the measurement based on Fourier's law of heat conduction at steady-state

NASA Astrophysics Data System (ADS)

Wu, Chia-Yu; Huang, Yin-Hsien; Wu, Hsin-Han; Hsieh, Tsung-Eong

2018-06-01

Fourier's law of heat conduction at steady-state was adopted to establish a measurement method utilizing platinum (Pt) thin-film electrodes as the heater and the temperature sensor. The thermal conductivities (κ's) of Pyrex glass, an epoxy resin and a commercial underfill for flip-chip devices were measured and a good agreement with previously reported values was obtained. The thermal boundary resistances (RTBR's) of Pt/sample interfaces were also extracted for discussing their influence on the thermal conduction of samples. Afterward, the flip-chip samples with 2×2 solder joint array utilizing Si wafers as the die and the substrate, without and with the underfills, were prepared and their thermal conductance were measured. For the sample without underfill, the air presenting in the gap of die and the substrate led to the poor thermal conductance of sample. With the insertion of underfills, the thermal conductance of flip-chip samples improved. The resistance to heat transfer across Si/underfill interfaces was also suppressed and to promote the thermal conductance of samples. The thermal properties of underfill and RTBR at Si/underfill interface were further implanted in the calculation of thermal conductance of flip-chip samples containing various solder joint arrays. The increasing number of solder joints diminished the influence of thermal conduction of underfill and RTBR of Si/underfill interface on the thermal conductance of samples. The insertion of underfill with high-κ value might promote the heat conductance of samples containing low-density solder joint arrays; however, it became insignificant in improving the heat conductance of samples containing high-density solder joint arrays.

Utility of Thermal Infrared Satellite Data For Urban Landscapes

NASA Astrophysics Data System (ADS)

Xian, G.; Crane, M.; Granneman, B.

2006-12-01

Urban landscapes are comprised of a variety of surfaces that are characterized by contrasting radiative, thermal, aerodynamic, and moisture properties. These different surfaces possess diverse physical and thermal attributes that directly influence surface energy balance and our ability to determine surface characteristics in urban areas. Reflectance properties obtained from satellite imagery have proven useful for mapping urban land use and land cover change, as well as ecosystem health. Landsat reflectance bands are commonly used in regression tree models to generate linear equations that correspond to distinct land surface materials. However, urban land cover is generally a heterogeneous mix of bare soil, vegetation, rock, and anthropogenic impervious surfaces. Surface temperature obtained from satellite thermal infrared bands provides valuable information about surface biophysical properties and radiant thermal characteristics of land cover elements, especially for urban environments. This study demonstrates the improved characterization of land cover conditions for Seattle, Washington, and Las Vegas, Nevada, that were achieved by using both the reflectance and thermal bands of Landsat Enhanced Thematic Mapper Plus (ETM+) data. Including the thermal band in the image analysis increased the accuracy of discriminating cover types in heterogeneous landscapes with extreme contrasts, especially for mixed pixels at the urban interface.

Integrated Thermal Response Tool for Earth Entry Vehicles

NASA Technical Reports Server (NTRS)

Chen, Y.-K.; Milos, F. S.; Partridge, Harry (Technical Monitor)

2001-01-01

A system is presented for multi-dimensional, fully-coupled thermal response modeling of hypersonic entry vehicles. The system consists of a two-dimensional implicit thermal response, pyrolysis and ablation program (TITAN), a commercial finite-element thermal and mechanical analysis code (MARC), and a high fidelity Navier-Stokes equation solver (GIANTS). The simulations performed by this integrated system include hypersonic flow-field, fluid and solid interaction, ablation, shape change, pyrolysis gas generation and flow, and thermal response of heatshield and structure. The thermal response of the ablating and charring heatshield material is simulated using TITAN, and that of the underlying structural is simulated using MARC. The ablating heatshield is treated as an outer boundary condition of the structure, and continuity conditions of temperature and heat flux are imposed at the interface between TITAN and MARC. Aerothermal environments with fluid and solid interaction are predicted by coupling TITAN and GIANTS through surface energy balance equations. With this integrated system, the aerothermal environments for an entry vehicle and the thermal response of both the heatshield and the structure can be obtained simultaneously. Representative computations for a proposed blunt body earth entry vehicle are presented and discussed in detail.

Thermal Response Modeling System for a Mars Sample Return Vehicle

NASA Technical Reports Server (NTRS)

Chen, Y.-K.; Milos, F. S.

2002-01-01

A multi-dimensional, coupled thermal response modeling system for analysis of hypersonic entry vehicles is presented. The system consists of a high fidelity Navier-Stokes equation solver (GIANTS), a two-dimensional implicit thermal response, pyrolysis and ablation program (TITAN), and a commercial finite element thermal and mechanical analysis code (MARC). The simulations performed by this integrated system include hypersonic flowfield, fluid and solid interaction, ablation, shape change, pyrolysis gas generation and flow, and thermal response of heatshield and structure. The thermal response of the heatshield is simulated using TITAN, and that of the underlying structural is simulated using MARC. The ablating heatshield is treated as an outer boundary condition of the structure, and continuity conditions of temperature and heat flux are imposed at the interface between TITAN and MARC. Aerothermal environments with fluid and solid interaction are predicted by coupling TITAN and GIANTS through surface energy balance equations. With this integrated system, the aerothermal environments for an entry vehicle and the thermal response of the entire vehicle can be obtained simultaneously. Representative computations for a flat-faced arc-jet test model and a proposed Mars sample return capsule are presented and discussed.

Optical processing for semiconductor device fabrication

NASA Technical Reports Server (NTRS)

Sopori, Bhushan L.

1994-01-01

A new technique for semiconductor device processing is described that uses optical energy to produce local heating/melting in the vicinity of a preselected interface of the device. This process, called optical processing, invokes assistance of photons to enhance interface reactions such as diffusion and melting, as compared to the use of thermal heating alone. Optical processing is performed in a 'cold wall' furnace, and requires considerably lower energies than furnace or rapid thermal annealing. This technique can produce some device structures with unique properties that cannot be produced by conventional thermal processing. Some applications of optical processing involving semiconductor-metal interfaces are described.

Thermal interface material characterization for cryogenic electronic packaging solutions

NASA Astrophysics Data System (ADS)

Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

2017-12-01

As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

Electrical characteristics and thermal stability of HfO{sub 2} metal-oxide-semiconductor capacitors fabricated on clean reconstructed GaSb surfaces

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miyata, Noriyuki, E-mail: nori.miyata@aist.go.jp; Mori, Takahiro; Yasuda, Tetsuji

2014-06-09

HfO{sub 2}/GaSb interfaces fabricated by high-vacuum HfO{sub 2} deposition on clean reconstructed GaSb surfaces were examined to explore a thermally stable GaSb metal-oxide-semiconductor structure with low interface-state density (D{sub it}). Interface Sb-O bonds were electrically and thermally unstable, and post-metallization annealing at temperatures higher than 200 °C was required to stabilize the HfO{sub 2}/GaSb interfaces. However, the annealing led to large D{sub it} in the upper-half band gap. We propose that the decomposition products that are associated with elemental Sb atoms act as interface states, since a clear correlation between the D{sub it} and the Sb coverage on the initial GaSbmore » surfaces was observed.« less

Effects of isothermal and cyclic exposures on interface structure and mechanical properties of FPalpha-Al2O3/aluminum composites. [polycrystaline alumina fibers

NASA Technical Reports Server (NTRS)

Kim, W. M.; Koczak, M. J.; Lawley, A.

1979-01-01

The microstructural and interface stability of FPalpha-Al203/Al-Li composites are investigated as a function of isothermal exposure at 500 C or thermal cycling between 140 and 500 C with hold time at Tmax. Interfacial morphology, growth kinetics, crystal structure, and composition of interfacial reaction products are characterized. Strength is monitored in the transverse orientation, and fracture mechanics is analyzed in terms of interface reaction products. The interfacial reaction product in FP/Al is Li2O.5Al2O3. Significant fiber-matrix reaction occurs during fabrication. The number of thermal cycles rather than total time at Tmax is the determining factor in strength degradation, thermal cycling giving rise to voids at the fiber-matrix interface. Extensive interface failures occur at composite fracture stresses below about 128 MPa; above this stress level failure is attributed to ductile matrix fracture.

Enhanced thermal stability of RuO2/polyimide interface for flexible device applications

NASA Astrophysics Data System (ADS)

Music, Denis; Schmidt, Paul; Chang, Keke

2017-09-01

We have studied the thermal stability of RuO2/polyimide (Kapton) interface using experimental and theoretical methods. Based on calorimetric and spectroscopic analyses, this inorganic-organic system does not exhibit any enthalpic peaks as well as all bonds in RuO2 and Kapton are preserved up to 500 °C. In addition, large-scale density functional theory based molecular dynamics, carried out in the same temperature range, validates the electronic structure and points out that numerous Ru-C and a few Ru-O covalent/ionic bonds form across the RuO2/Kapton interface. This indicates strong adhesion, but there is no evidence of Kapton degradation upon thermal excitation. Furthermore, RuO2 does not exhibit any interfacial bonds with N and H in Kapton, providing additional evidence for the thermal stability notion. It is suggested that the RuO2/Kapton interface is stable due to aromatic architecture of Kapton. This enhanced thermal stability renders Kapton an appropriate polymeric substrate for RuO2 containing systems in various applications, especially for flexible microelectronic and energy devices.

Reverse Non-Equilibrium Molecular Dynamics Demonstrate That Surface Passivation Controls Thermal Transport at Semiconductor-Solvent Interfaces.

PubMed

Hannah, Daniel C; Gezelter, J Daniel; Schaller, Richard D; Schatz, George C

2015-06-23

We examine the role played by surface structure and passivation in thermal transport at semiconductor/organic interfaces. Such interfaces dominate thermal transport in semiconductor nanomaterials owing to material dimensions much smaller than the bulk phonon mean free path. Utilizing reverse nonequilibrium molecular dynamics simulations, we calculate the interfacial thermal conductance (G) between a hexane solvent and chemically passivated wurtzite CdSe surfaces. In particular, we examine the dependence of G on the CdSe slab thickness, the particular exposed crystal facet, and the extent of surface passivation. Our results indicate a nonmonotonic dependence of G on ligand-grafting density, with interfaces generally exhibiting higher thermal conductance for increasing surface coverage up to ∼0.08 ligands/Å(2) (75-100% of a monolayer, depending on the particular exposed facet) and decreasing for still higher coverages. By analyzing orientational ordering and solvent penetration into the ligand layer, we show that a balance of competing effects is responsible for this nonmonotonic dependence. Although the various unpassivated CdSe surfaces exhibit similar G values, the crystal structure of an exposed facet nevertheless plays an important role in determining the interfacial thermal conductance of passivated surfaces, as the density of binding sites on a surface determines the ligand-grafting densities that may ultimately be achieved. We demonstrate that surface passivation can increase G relative to a bare surface by roughly 1 order of magnitude and that, for a given extent of passivation, thermal conductance can vary by up to a factor of ∼2 between different surfaces, suggesting that appropriately tailored nanostructures may direct heat flow in an anisotropic fashion for interface-limited thermal transport.

Spin Seebeck effect and thermal spin galvanic effect in Ni80Fe20/p-Si bilayers

NASA Astrophysics Data System (ADS)

Bhardwaj, Ravindra G.; Lou, Paul C.; Kumar, Sandeep

2018-01-01

The development of spintronics and spin-caloritronics devices needs efficient generation, detection, and manipulation of spin current. The thermal spin current from the spin-Seebeck effect has been reported to be more energy efficient than the electrical spin injection methods. However, spin detection has been the one of the bottlenecks since metals with large spin-orbit coupling is an essential requirement. In this work, we report an efficient thermal generation and interfacial detection of spin current. We measured a spin-Seebeck effect in Ni80Fe20 (25 nm)/p-Si (50 nm) (polycrystalline) bilayers without a heavy metal spin detector. p-Si, having a centrosymmetric crystal structure, has insignificant intrinsic spin-orbit coupling, leading to negligible spin-charge conversion. We report a giant inverse spin-Hall effect, essential for the detection of spin-Seebeck effects, in the Ni80Fe20/p-Si bilayer structure, which originates from Rashba spin orbit coupling due to structure inversion asymmetry at the interface. In addition, the thermal spin pumping in p-Si leads to spin current from p-Si to the Ni80Fe20 layer due to the thermal spin galvanic effect and the spin-Hall effect, causing spin-orbit torques. The thermal spin-orbit torques lead to collapse of magnetic hysteresis of the 25 nm thick Ni80Fe20 layer. The thermal spin-orbit torques can be used for efficient magnetic switching for memory applications. These scientific breakthroughs may give impetus to the silicon spintronics and spin-caloritronics devices.

Challenges of designing and testing a highly stable sensor platform: Cesic solves MTG star sensor bracket thermoelastic requirements

NASA Astrophysics Data System (ADS)

Kroedel, Matthias; Zauner, Christoph

2017-09-01

The Meteosat Third Generation's extreme pointing requirements call for a highly stable bracket for mounting the Star Trackers. HB-Cesic®, a chopped fibre reinforced silicon carbide, was selected as a base material for the sensor bracket. The high thermal conductivity and low thermal expansion of HB-Cesic® were the key properties to fulfil the demanding thermo-elastic pointing requirements of below 1μrad/K for the Star Trackers mounting interfaces. Dominated by thermoelastic stability requirements, the design and analysis of the Bracket required a multidisciplinary approach with the focus on thermal and thermo-elastic analyses. Dedicated modal and thermal post-processing strategies have been applied in the scope of the light weighting process. The experimental verification of this thermo-elastic stable system has been a challenging task of its own. A thermo-elastic distortion measurement rig was developed with a stability of <0.1μrad/K in all three rotational degrees of freedom.

Carbon-Fiber Brush Heat Exchangers

NASA Technical Reports Server (NTRS)

Knowles, Timothy R.

2004-01-01

Velvetlike and brushlike pads of carbon fibers have been proposed for use as mechanically compliant, highly thermally conductive interfaces for transferring heat. A pad of this type would be formed by attaching short carbon fibers to either or both of two objects that one desires to place in thermal contact with each other. The purpose of using a thermal-contact pad of this or any other type is to reduce the thermal resistance of an interface between a heat source and a heat sink.

Analysis Method of Friction Torque and Weld Interface Temperature during Friction Process of Steel Friction Welding

NASA Astrophysics Data System (ADS)

Kimura, Masaaki; Inoue, Haruo; Kusaka, Masahiro; Kaizu, Koichi; Fuji, Akiyoshi

This paper describes an analysis method of the friction torque and weld interface temperature during the friction process for steel friction welding. The joining mechanism model of the friction welding for the wear and seizure stages was constructed from the actual joining phenomena that were obtained by the experiment. The non-steady two-dimensional heat transfer analysis for the friction process was carried out by calculation with FEM code ANSYS. The contact pressure, heat generation quantity, and friction torque during the wear stage were calculated using the coefficient of friction, which was considered as the constant value. The thermal stress was included in the contact pressure. On the other hand, those values during the seizure stage were calculated by introducing the coefficient of seizure, which depended on the seizure temperature. The relationship between the seizure temperature and the relative speed at the weld interface in the seizure stage was determined using the experimental results. In addition, the contact pressure and heat generation quantity, which depended on the relative speed of the weld interface, were solved by taking the friction pressure, the relative speed and the yield strength of the base material into the computational conditions. The calculated friction torque and weld interface temperatures of a low carbon steel joint were equal to the experimental results when friction pressures were 30 and 90 MPa, friction speed was 27.5 s-1, and weld interface diameter was 12 mm. The calculation results of the initial peak torque and the elapsed time for initial peak torque were also equal to the experimental results under the same conditions. Furthermore, the calculation results of the initial peak torque and the elapsed time for initial peak torque at various friction pressures were equal to the experimental results.

Analysis of hybrid interface cooling system using air ventilation and nanofluid

NASA Astrophysics Data System (ADS)

Rani, M. F. H.; Razlan, Z. M.; Bakar, S. A.; Desa, H.; Wan, W. K.; Ibrahim, I.; Kamarrudin, N. S.; Bin-Abdun, Nazih A.

2017-09-01

The hybrid interface cooling system needs to be designed for maintaining the electric vehicle's battery cell temperature at 25°C. The hybrid interface cooling system is a combination of two individual systems, where the primary cooling system (R-134a) and the secondary cooling system (CuO + Water) will be used to absorb the heat generated by the battery cells. The ventilation system is designed using air as the medium to transfer the heat from the batteries to the refrigeration system (R-134a). Research will focus on determining the suitable compressor displacement, the heat exchanger volume and the expansion valve resistance value. The analysis for the secondary cooling system is focused on the cooling coil where low temperature nanofluid is passing through each interval of the battery cells. For analysing purposes, the thermal properties of the mixture of 50 grams, Copper (II) Oxide and the base fluid have been determined. The hybrid interface cooling system are able to achieve 57.82% increments in term of rate of heat transfer as compared to the individual refrigeration system.

Thermal conductance at the interface between crystals using equilibrium and nonequilibrium molecular dynamics

NASA Astrophysics Data System (ADS)

Merabia, Samy; Termentzidis, Konstantinos

2012-09-01

In this article, we compare the results of nonequilibrium (NEMD) and equilibrium (EMD) molecular dynamics methods to compute the thermal conductance at the interface between solids. We propose to probe the thermal conductance using equilibrium simulations measuring the decay of the thermally induced energy fluctuations of each solid. We also show that NEMD and EMD give generally speaking inconsistent results for the thermal conductance: Green-Kubo simulations probe the Landauer conductance between two solids which assumes phonons on both sides of the interface to be at equilibrium. On the other hand, we show that NEMD give access to the out-of-equilibrium interfacial conductance consistent with the interfacial flux describing phonon transport in each solid. The difference may be large and reaches typically a factor 5 for interfaces between usual semiconductors. We analyze finite size effects for the two determinations of the interfacial thermal conductance, and show that the equilibrium simulations suffer from severe size effects as compared to NEMD. We also compare the predictions of the two above-mentioned methods—EMD and NEMD—regarding the interfacial conductance of a series of mass mismatched Lennard-Jones solids. We show that the Kapitza conductance obtained with EMD can be well described using the classical diffuse mismatch model (DMM). On the other hand, NEMD simulation results are consistent with an out-of-equilibrium generalization of the acoustic mismatch model (AMM). These considerations are important in rationalizing previous results obtained using molecular dynamics, and help in pinpointing the physical scattering mechanisms taking place at atomically perfect interfaces between solids, which is a prerequisite to understand interfacial heat transfer across real interfaces.

Interface Energy Coupling between β-tungsten Nanofilm and Few-layered Graphene

DOE PAGES

Han, Meng; Yuan, Pengyu; Liu, Jing; ...

2017-09-22

We report the thermal conductance induced by few-layered graphene (G) sandwiched between β-phase tungsten (β-W) films of 15, 30 and 40 nm thickness. Our differential characterization is able to distinguish the thermal conductance of β-W film and β-W/G interface. The cross-plane thermal conductivity (k) of β-W films is determined at 1.69~2.41 Wm -1K -1 which is much smaller than that of α-phase tungsten (174 Wm -1K -1). This small value is consistent with the large electrical resistivity reported for β-W in literatures and in this work. The β-W/β-W and β-W/G interface thermal conductance (GW/W and GW/G) are characterized and comparedmore » using multilayered β-W films with and without sandwiched graphene layers. The average GW/W is found to be at 280 MW m -2K -1. GW/G features strong variation from sample to sample, and has a lower-limit of 84 MW m -2K -1, taking into consideration of the uncertainties. This is attributed to possible graphene structure damage and variation during graphene transfer and W sputtering. The difference between G2W/G and GW/W uncovers the finite thermal resistance induced by the graphene layer. Compared with up-to-date reported graphene interface thermal conductance, the β-W/G interface is at the high end in terms of local energy coupling.« less

Interface Energy Coupling between β-tungsten Nanofilm and Few-layered Graphene

DOE Office of Scientific and Technical Information (OSTI.GOV)

Han, Meng; Yuan, Pengyu; Liu, Jing

We report the thermal conductance induced by few-layered graphene (G) sandwiched between β-phase tungsten (β-W) films of 15, 30 and 40 nm thickness. Our differential characterization is able to distinguish the thermal conductance of β-W film and β-W/G interface. The cross-plane thermal conductivity (k) of β-W films is determined at 1.69~2.41 Wm -1K -1 which is much smaller than that of α-phase tungsten (174 Wm -1K -1). This small value is consistent with the large electrical resistivity reported for β-W in literatures and in this work. The β-W/β-W and β-W/G interface thermal conductance (GW/W and GW/G) are characterized and comparedmore » using multilayered β-W films with and without sandwiched graphene layers. The average GW/W is found to be at 280 MW m -2K -1. GW/G features strong variation from sample to sample, and has a lower-limit of 84 MW m -2K -1, taking into consideration of the uncertainties. This is attributed to possible graphene structure damage and variation during graphene transfer and W sputtering. The difference between G2W/G and GW/W uncovers the finite thermal resistance induced by the graphene layer. Compared with up-to-date reported graphene interface thermal conductance, the β-W/G interface is at the high end in terms of local energy coupling.« less

IAC - INTEGRATED ANALYSIS CAPABILITY

NASA Technical Reports Server (NTRS)

Frisch, H. P.

1994-01-01

The objective of the Integrated Analysis Capability (IAC) system is to provide a highly effective, interactive analysis tool for the integrated design of large structures. With the goal of supporting the unique needs of engineering analysis groups concerned with interdisciplinary problems, IAC was developed to interface programs from the fields of structures, thermodynamics, controls, and system dynamics with an executive system and database to yield a highly efficient multi-disciplinary system. Special attention is given to user requirements such as data handling and on-line assistance with operational features, and the ability to add new modules of the user's choice at a future date. IAC contains an executive system, a data base, general utilities, interfaces to various engineering programs, and a framework for building interfaces to other programs. IAC has shown itself to be effective in automatic data transfer among analysis programs. IAC 2.5, designed to be compatible as far as possible with Level 1.5, contains a major upgrade in executive and database management system capabilities, and includes interfaces to enable thermal, structures, optics, and control interaction dynamics analysis. The IAC system architecture is modular in design. 1) The executive module contains an input command processor, an extensive data management system, and driver code to execute the application modules. 2) Technical modules provide standalone computational capability as well as support for various solution paths or coupled analyses. 3) Graphics and model generation interfaces are supplied for building and viewing models. Advanced graphics capabilities are provided within particular analysis modules such as INCA and NASTRAN. 4) Interface modules provide for the required data flow between IAC and other modules. 5) User modules can be arbitrary executable programs or JCL procedures with no pre-defined relationship to IAC. 6) Special purpose modules are included, such as MIMIC (Model Integration via Mesh Interpolation Coefficients), which transforms field values from one model to another; LINK, which simplifies incorporation of user specific modules into IAC modules; and DATAPAC, the National Bureau of Standards statistical analysis package. The IAC database contains structured files which provide a common basis for communication between modules and the executive system, and can contain unstructured files such as NASTRAN checkpoint files, DISCOS plot files, object code, etc. The user can define groups of data and relations between them. A full data manipulation and query system operates with the database. The current interface modules comprise five groups: 1) Structural analysis - IAC contains a NASTRAN interface for standalone analysis or certain structural/control/thermal combinations. IAC provides enhanced structural capabilities for normal modes and static deformation analysis via special DMAP sequences. IAC 2.5 contains several specialized interfaces from NASTRAN in support of multidisciplinary analysis. 2) Thermal analysis - IAC supports finite element and finite difference techniques for steady state or transient analysis. There are interfaces for the NASTRAN thermal analyzer, SINDA/SINFLO, and TRASYS II. FEMNET, which converts finite element structural analysis models to finite difference thermal analysis models, is also interfaced with the IAC database. 3) System dynamics - The DISCOS simulation program which allows for either nonlinear time domain analysis or linear frequency domain analysis, is fully interfaced to the IAC database management capability. 4) Control analysis - Interfaces for the ORACLS, SAMSAN, NBOD2, and INCA programs allow a wide range of control system analyses and synthesis techniques. Level 2.5 includes EIGEN, which provides tools for large order system eigenanalysis, and BOPACE, which allows for geometric capabilities and finite element analysis with nonlinear material. Also included in IAC level 2.5 is SAMSAN 3.1, an engineering analysis program which contains a general purpose library of over 600 subroutines for numerical analysis. 5) Graphics - The graphics package IPLOT is included in IAC. IPLOT generates vector displays of tabular data in the form of curves, charts, correlation tables, etc. Either DI3000 or PLOT-10 graphics software is required for full graphic capability. In addition to these analysis tools, IAC 2.5 contains an IGES interface which allows the user to read arbitrary IGES files into an IAC database and to edit and output new IGES files. IAC is available by license for a period of 10 years to approved U.S. licensees. The licensed program product includes one set of supporting documentation. Additional copies may be purchased separately. IAC is written in FORTRAN 77 and has been implemented on a DEC VAX series computer operating under VMS. IAC can be executed by multiple concurrent users in batch or interactive mode. The program is structured to allow users to easily delete those program capabilities and "how to" examples they do not want in order to reduce the size of the package. The basic central memory requirement for IAC is approximately 750KB. The following programs are also available from COSMIC as separate packages: NASTRAN, SINDA/SINFLO, TRASYS II, DISCOS, ORACLS, SAMSAN, NBOD2, and INCA. The development of level 2.5 of IAC was completed in 1989.

Observation of interface defects in thermally oxidized SiC using positron annihilation

NASA Astrophysics Data System (ADS)

Dekker, James; Saarinen, Kimmo; Ólafsson, Halldór; Sveinbjörnsson, Einar Ö.

2003-03-01

Positron annihilation has been applied to study thermally oxidized 4H- and 6H-SiC. The SiC/SiO2 interface is found to contain a high density of open-volume defects. The positron trapping at the interface defects correlates with the charge of the interface determined by capacitance-voltage experiments. For oxides grown on n-SiC substrates, the positron annihilation characteristics at these defects are nearly indistinguishable from those of a silicon/oxide interface, with no discernable contribution from C-related bonds or carbon clusters. These results indicate that those defects at the SiC/oxide interface, which are visible to positrons, are similar to those at the Si/oxide interface. The positron annihilation characteristics suggest that these defects are vacancies surrounded by oxygen atoms.

Simulation of solidification in a Bridgman cell

NASA Technical Reports Server (NTRS)

Dakhoul, Y. M.; Farmer, R. C.

1984-01-01

Bridgman-type crystal growth techniques are attractive methods for producing homogeneous, high-quality infrared detector and junction device materials. However, crystal imperfections and interface shapes still must be controlled through modification of the temperature and concentration gradients created during solidification. The objective of this investigation was to study the temperature fields generated by various cell and heatpipe configurations and operating conditions. Continuum's numerical model of the temperature, species concentrations, and velocity fields was used to describe the thermal characteristics of Bridgman cell operation.

Kapitza thermal resistance studied by high-frequency photothermal radiometry

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horny, Nicolas; Chirtoc, Mihai; Hamaoui, Georges

2016-07-18

Kapitza thermal resistance is determined using high-frequency photothermal radiometry (PTR) extended for modulation up to 10 MHz. Interfaces between 50 nm thick titanium coatings and silicon or stainless steel substrates are studied. In the used configuration, the PTR signal is not sensitive to the thermal conductivity of the film nor to its optical absorption coefficient, thus the Kapitza resistance is directly determined from single thermal parameter fits. Results of thermal resistances show the significant influence of the nature of the substrate, as well as of the presence of free electrons at the interface.

Thermal contact through a two-temperature kinetic Ising chain

NASA Astrophysics Data System (ADS)

Bauer, M.; Cornu, F.

2018-05-01

We consider a model for thermal contact through a diathermal interface between two macroscopic bodies at different temperatures: an Ising spin chain with nearest neighbor interactions is endowed with a Glauber dynamics with different temperatures and kinetic parameters on alternating sites. The inhomogeneity of the kinetic parameter is a novelty with respect to the model of Racz and Zia (1994 Phys. Rev. E 49 139), and we exhibit its influence upon the stationary non equilibrium values of the two-spin correlations at any distance. By mapping to the dynamics of spin domain walls and using free fermion techniques, we determine the scaled generating function for the cumulants of the exchanged heat amounts per unit of time in the long time limit.

SubductionGenerator: A program to build three-dimensional plate configurations

NASA Astrophysics Data System (ADS)

Jadamec, M. A.; Kreylos, O.; Billen, M. I.; Turcotte, D. L.; Knepley, M.

2016-12-01

Geologic, geochemical, and geophysical data from subduction zones indicate that a two-dimensional paradigm for plate tectonic boundaries is no longer adequate to explain the observations. Many open source software packages exist to simulate the viscous flow of the Earth, such as the dynamics of subduction. However, there are few open source programs that generate the three-dimensional model input. We present an open source software program, SubductionGenerator, that constructs the three-dimensional initial thermal structure and plate boundary structure. A 3D model mesh and tectonic configuration are constructed based on a user specified model domain, slab surface, seafloor age grid file, and shear zone surface. The initial 3D thermal structure for the plates and mantle within the model domain is then constructed using a series of libraries within the code that use a half-space cooling model, plate cooling model, and smoothing functions. The code maps the initial 3D thermal structure and the 3D plate interface onto the mesh nodes using a series of libraries including a k-d tree to increase efficiency. In this way, complicated geometries and multiple plates with variable thickness can be built onto a multi-resolution finite element mesh with a 3D thermal structure and 3D isotropic shear zones oriented at any angle with respect to the grid. SubductionGenerator is aimed at model set-ups more representative of the earth, which can be particularly challenging to construct. Examples include subduction zones where the physical attributes vary in space, such as slab dip and temperature, and overriding plate temperature and thickness. Thus, the program can been used to construct initial tectonic configurations for triple junctions and plate boundary corners.

Advanced Soldier Thermoelectric Power System for Power Generation from Battlefield Heat Sources

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hendricks, Terry J.; Hogan, Tim; Case, Eldon D.

2010-09-01

The U.S. military uses large amounts of fuel during deployments and battlefield operations. This project sought to develop a lightweight, small form-factor, soldier-portable advanced thermoelectric (TE) system prototype to recover and convert waste heat from various deployed military equipment (i.e., diesel generators/engines, incinerators, vehicles, and potentially mobile kitchens), with the ultimate purpose of producing power for soldier battery charging, advanced capacitor charging, and other battlefield power applications. The technical approach employed microchannel technology, a unique “power panel” approach to heat exchange/TE system integration, and newly-characterized LAST (lead-antimony-silver-telluride) and LASTT (lead-antimony-silver-tin-telluride) TE materials segmented with bismuth telluride TE materials in designingmore » a segmented-element TE power module and system. This project researched never-before-addressed system integration challenges (thermal expansion, thermal diffusion, electrical interconnection, thermal and electrical interfaces) of designing thin “power panels” consisting of alternating layers of thin, microchannel heat exchangers (hot and cold) sandwiching thin, segmented-element TE power generators. The TE properties, structurally properties, and thermal fatigue behavior of LAST and LASTT materials were developed and characterized such that the first segmented-element TE modules using LAST / LASTT materials were fabricated and tested at hot-side temperatures = 400 °C and cold-side temperatures = 40 °C. LAST / LASTT materials were successfully segmented with bismuth telluride and electrically interconnected with diffusion barrier materials and copper strapping within the module electrical circuit. A TE system design was developed to produce 1.5-1.6 kW of electrical energy using these new TE modules from the exhaust waste heat of 60-kW Tactical Quiet Generators as demonstration vehicles.« less

Models of charge pair generation in organic solar cells.

PubMed

Few, Sheridan; Frost, Jarvist M; Nelson, Jenny

2015-01-28

Efficient charge pair generation is observed in many organic photovoltaic (OPV) heterojunctions, despite nominal electron-hole binding energies which greatly exceed the average thermal energy. Empirically, the efficiency of this process appears to be related to the choice of donor and acceptor materials, the resulting sequence of excited state energy levels and the structure of the interface. In order to establish a suitable physical model for the process, a range of different theoretical studies have addressed the nature and energies of the interfacial states, the energetic profile close to the heterojunction and the dynamics of excited state transitions. In this paper, we review recent developments underpinning the theory of charge pair generation and phenomena, focussing on electronic structure calculations, electrostatic models and approaches to excited state dynamics. We discuss the remaining challenges in achieving a predictive approach to charge generation efficiency.

Getting in shape: molten wax drop deformation and solidification at an immiscible liquid interface.

PubMed

Beesabathuni, Shilpa N; Lindberg, Seth E; Caggioni, Marco; Wesner, Chris; Shen, Amy Q

2015-05-01

The controlled production of non-spherical shaped particles is important for many applications such as food processing, consumer goods, adsorbents, drug delivery, and optical sensing. In this paper, we investigated the deformation and simultaneous solidification of millimeter size molten wax drops as they impacted an immiscible liquid interface of higher density. By varying initial temperature and viscoelasticity of the molten drop, drop size, impact velocity, viscosity and temperature of the bath fluid, and the interfacial tension between the molten wax and bath fluid, spherical molten wax drops impinged on a cooling water bath and were arrested into non-spherical solidified particles in the form of ellipsoid, mushroom, disc, and flake-like shapes. We constructed cursory phase diagrams for the various particle shapes generated over a range of Weber, Capillary, Reynolds, and Stefan numbers, governed by the interfacial, inertial, viscous, and thermal effects. We solved a simplified heat transfer problem to estimate the time required to initiate the solidification at the interface of a spherical molten wax droplet and cooling aqueous bath after impact. By correlating this time with the molten wax drop deformation history captured from high speed imaging experiments, we elucidate the delicate balance of interfacial, inertial, viscous, and thermal forces that determine the final morphology of wax particles. Copyright © 2015 Elsevier Inc. All rights reserved.

Packet based serial link realized in FPGA dedicated for high resolution infrared image transmission

NASA Astrophysics Data System (ADS)

Bieszczad, Grzegorz

2015-05-01

In article the external digital interface specially designed for thermographic camera built in Military University of Technology is described. The aim of article is to illustrate challenges encountered during design process of thermal vision camera especially related to infrared data processing and transmission. Article explains main requirements for interface to transfer Infra-Red or Video digital data and describes the solution which we elaborated based on Low Voltage Differential Signaling (LVDS) physical layer and signaling scheme. Elaborated link for image transmission is built using FPGA integrated circuit with built-in high speed serial transceivers achieving up to 2500Gbps throughput. Image transmission is realized using proprietary packet protocol. Transmission protocol engine was described in VHDL language and tested in FPGA hardware. The link is able to transmit 1280x1024@60Hz 24bit video data using one signal pair. Link was tested to transmit thermal-vision camera picture to remote monitor. Construction of dedicated video link allows to reduce power consumption compared to solutions with ASIC based encoders and decoders realizing video links like DVI or packed based Display Port, with simultaneous reduction of wires needed to establish link to one pair. Article describes functions of modules integrated in FPGA design realizing several functions like: synchronization to video source, video stream packeting, interfacing transceiver module and dynamic clock generation for video standard conversion.

Metallized compliant 3D microstructures for dry contact thermal conductance enhancement

NASA Astrophysics Data System (ADS)

Cui, Jin; Wang, Jicheng; Zhong, Yang; Pan, Liang; Weibel, Justin A.

2018-05-01

Microstructured three-dimensional (3D) materials can be engineered to enable new capabilities for various engineering applications; however, microfabrication of large 3D structures is typically expensive due to the conventional top-down fabrication scheme. Herein we demonstrated the use of projection micro-stereolithography and electrodeposition as cost-effective and high-throughput methods to fabricate compliant 3D microstructures as a thermal interface material (TIM). This novel TIM structure consists of an array of metallized micro-springs designed to enhance the dry contact thermal conductance between nonflat surfaces under low interface pressures (10s-100s kPa). Mechanical compliance and thermal resistance measurements confirm that this dry contact TIM can achieve conformal contact between mating surfaces with a nonflatness of approximately 5 µm under low interface pressures.

Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film

PubMed Central

Qiu, Lin; Wang, Xiaotian; Su, Guoping; Tang, Dawei; Zheng, Xinghua; Zhu, Jie; Wang, Zhiguo; Norris, Pamela M.; Bradford, Philip D.; Zhu, Yuntian

2016-01-01

It has been more than a decade since the thermal conductivity of vertically aligned carbon nanotube (VACNT) arrays was reported possible to exceed that of the best thermal greases or phase change materials by an order of magnitude. Despite tremendous prospects as a thermal interface material (TIM), results were discouraging for practical applications. The primary reason is the large thermal contact resistance between the CNT tips and the heat sink. Here we report a simultaneous sevenfold increase in in-plane thermal conductivity and a fourfold reduction in the thermal contact resistance at the flexible CNT-SiO2 coated heat sink interface by coupling the CNTs with orderly physical overlapping along the horizontal direction through an engineering approach (shear pressing). The removal of empty space rapidly increases the density of transport channels, and the replacement of the fine CNT tips with their cylindrical surface insures intimate contact at CNT-SiO2 interface. Our results suggest horizontally aligned CNT arrays exhibit remarkably enhanced in-plane thermal conductivity and reduced out-of-plane thermal conductivity and thermal contact resistance. This novel structure makes CNT film promising for applications in chip-level heat dissipation. Besides TIM, it also provides for a solution to anisotropic heat spreader which is significant for eliminating hot spots. PMID:26880221

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yeager, John David; Watkins, Erik Benjamin; Duque, Amanda Lynn

Thermal ignition via self-heating (cook-off) of cyclotetramethylene-tetranitramine (HMX)-containing plastic-bonded explosives (PBXs) is driven by the β → δ phase transition in the HMX, which is affected if not dominated by microstructure. Here, we studied the HMX-binder interface and phase transition for several variations of PBX 9404 (HMX with plasticized nitrocellulose [NC] binder). Neutron reflectometry was used to examine the interface under several conditions—pristine, after aging, and after thermal treatment. The initial interfacial structure depended on the plasticizer, but the interface homogenized over time. Thermal and optical analyses showed that all formulated materials had higher transition temperatures than neat HMX. Thismore » effect increased with NC content.« less

Tuning Transpiration by Interfacial Solar Absorber-Leaf Engineering.

PubMed

Zhuang, Shendong; Zhou, Lin; Xu, Weichao; Xu, Ning; Hu, Xiaozhen; Li, Xiuqiang; Lv, Guangxin; Zheng, Qinghui; Zhu, Shining; Wang, Zhenlin; Zhu, Jia

2018-02-01

Plant transpiration, a process of water movement through a plant and its evaporation from aerial parts especially leaves, consumes a large component of the total continental precipitation (≈48%) and significantly influences global water distribution and climate. To date, various chemical and/or biological explorations have been made to tune the transpiration but with uncertain environmental risks. In recent years, interfacial solar steam/vapor generation is attracting a lot of attention for achieving high energy transfer efficiency. Various optical and thermal designs at the solar absorber-water interface for potential applications in water purification, seawater desalination, and power generation appear. In this work, the concept of interfacial solar vapor generation is extended to tunable plant transpiration by showing for the first time that the transpiration efficiency can also be enhanced or suppressed through engineering the solar absorber-leaf interface. By tuning the solar absorption of membrane in direct touch with green leaf, surface temperature of green leaf will change accordingly because of photothermal effect, thus the transpiration efficiency as well as temperature and relative humidity in the surrounding environment will be tuned. This tunable transpiration by interfacial absorber-leaf engineering can open an alternative avenue to regulate local atmospheric temperature, humidity, and eventually hydrologic cycle.

Coupling device with improved thermal interface

NASA Astrophysics Data System (ADS)

Milam, Malcolm Bruce

1992-04-01

The primary object of the present invention is to provide a simple, reliable, and lightweight coupling that will also have an efficient thermal interface. A further object of the invention is to provide a coupling that is capable of blind mating with little or no insertion forces. Another object of the invention is to provide a coupling that acts as a thermal regulator to maintain a constant temperature on one side of the coupling. Another object of the invention is to increase the available surface area of a coupling thus providing a larger area for the conduction of heat across the thermal interface. Another object of the invention is to provide a fluidic coupling that has no fluid passing across the interface, thus reducing the likelihood of leaks and contamination. The foregoing objects are achieved by utilizing, as in the prior art, a hot area (at an elevated temperature as compared to a cold area) with a need to remove excess heat from the hot area to a cold area. In this device, the thermal interface will occur not on a planar horizontal surface, but along a non-planar vertical surface, which will reduce the reaction forces and increase the thermal conductivity of the device. One non-planar surface is a surface on a cold pin extending from the cold area and the other non-planar surface is a surface on a hot pin extending from the hot area. The cold pin is fixed and does not move while the hot pin is a flexible member and its movement towards the cold pin will bring the two non-planar surfaces together forming the thermal interface. The actuating member for the device is a shape-memory actuation wire which is attached through an aperture to the hot pin and through another aperture to an actuation wire retainer. By properly programming the actuation wire, heat from the hot area will cause the actuation wire to bend the hot wire. Heat from the hot area will cause the actuation wire to bend the hot pin towards the cold pin forming the coupling and the desired thermal interface. The shape-memory actuation wire is made of a shape-memory-effect alloy such as Nitinol.

Role of direct electron-phonon coupling across metal-semiconductor interfaces in thermal transport via molecular dynamics.

PubMed

Lin, Keng-Hua; Strachan, Alejandro

2015-07-21

Motivated by significant interest in metal-semiconductor and metal-insulator interfaces and superlattices for energy conversion applications, we developed a molecular dynamics-based model that captures the thermal transport role of conduction electrons in metals and heat transport across these types of interface. Key features of our model, denoted eleDID (electronic version of dynamics with implicit degrees of freedom), are the natural description of interfaces and free surfaces and the ability to control the spatial extent of electron-phonon (e-ph) coupling. Non-local e-ph coupling enables the energy of conduction electrons to be transferred directly to the semiconductor/insulator phonons (as opposed to having to first couple to the phonons in the metal). We characterize the effect of the spatial e-ph coupling range on interface resistance by simulating heat transport through a metal-semiconductor interface to mimic the conditions of ultrafast laser heating experiments. Direct energy transfer from the conduction electrons to the semiconductor phonons not only decreases interfacial resistance but also increases the ballistic transport behavior in the semiconductor layer. These results provide new insight for experiments designed to characterize e-ph coupling and thermal transport at the metal-semiconductor/insulator interfaces.

Modeling of dislocation dynamics in germanium Czochralski growth

NASA Astrophysics Data System (ADS)

Artemyev, V. V.; Smirnov, A. D.; Kalaev, V. V.; Mamedov, V. M.; Sidko, A. P.; Podkopaev, O. I.; Kravtsova, E. D.; Shimansky, A. F.

2017-06-01

Obtaining very high-purity germanium crystals with low dislocation density is a practically difficult problem, which requires knowledge and experience in growth processes. Dislocation density is one of the most important parameters defining the quality of germanium crystal. In this paper, we have performed experimental study of dislocation density during 4-in. germanium crystal growth using the Czochralski method and comprehensive unsteady modeling of the same crystal growth processes, taking into account global heat transfer, melt flow and melt/crystal interface shape evolution. Thermal stresses in the crystal and their relaxation with generation of dislocations within the Alexander-Haasen model have been calculated simultaneously with crystallization dynamics. Comparison to experimental data showed reasonable agreement for the temperature, interface shape and dislocation density in the crystal between calculation and experiment.

Cross-plane thermal conductivity of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices

NASA Astrophysics Data System (ADS)

Saha, Bivas; Koh, Yee Rui; Comparan, Jonathan; Sadasivam, Sridhar; Schroeder, Jeremy L.; Garbrecht, Magnus; Mohammed, Amr; Birch, Jens; Fisher, Timothy; Shakouri, Ali; Sands, Timothy D.

2016-01-01

Reduction of cross-plane thermal conductivity and understanding of the mechanisms of heat transport in nanostructured metal/semiconductor superlattices are crucial for their potential applications in thermoelectric and thermionic energy conversion devices, thermal management systems, and thermal barrier coatings. We have developed epitaxial (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices with periodicity ranging from 1 nm to 240 nm that show significantly lower thermal conductivity compared to the parent TiN/(Al,Sc)N superlattice system. The (Ti,W)N/(Al,Sc)N superlattices grow with [001] orientation on the MgO(001) substrates with well-defined coherent layers and are nominally single crystalline with low densities of extended defects. Cross-plane thermal conductivity (measured by time-domain thermoreflectance) decreases with an increase in the superlattice interface density in a manner that is consistent with incoherent phonon boundary scattering. Thermal conductivity values saturate at 1.7 W m-1K-1 for short superlattice periods possibly due to a delicate balance between long-wavelength coherent phonon modes and incoherent phonon scattering from heavy tungsten atomic sites and superlattice interfaces. First-principles density functional perturbation theory based calculations are performed to model the vibrational spectrum of the individual component materials, and transport models are used to explain the interface thermal conductance across the (Ti,W)N/(Al,Sc)N interfaces as a function of periodicity. The long-wavelength coherent phonon modes are expected to play a dominant role in the thermal transport properties of the short-period superlattices. Our analysis of the thermal transport properties of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices addresses fundamental questions about heat transport in multilayer materials.

Constructing a High-Sensitivity, Computer-Interfaced, Differential Thermal Analysis Device for Teaching and Research

ERIC Educational Resources Information Center

Martinez, L. M.; Videa, M.; Mederos, F.; Mesquita, J.

2007-01-01

The construction of a new highly-sensitive, computer-interfaced, differential thermal analysis (DTA) device, used for gathering different information about the chemical reactions, is described. The instrument provides a better understanding about the phase transitions, phase diagrams and many more concepts to the students.

Electrical switching of antiferromagnets via strongly spin-orbit coupled materials

NASA Astrophysics Data System (ADS)

Li, Xi-Lai; Duan, Xiaopeng; Semenov, Yuriy G.; Kim, Ki Wook

2017-01-01

Electrically controlled ultra-fast switching of an antiferromagnet (AFM) is shown to be realizable by interfacing it with a material of strong spin-orbit coupling. The proximity interaction between the sublattice magnetic moments of a layered AFM and the spin-polarized free electrons at the interface offers an efficient way to manipulate antiferromagnetic states. A quantitative analysis, using the combination with a topological insulator as an example, demonstrates highly reliable 90° and 180° rotations of AFM magnetic states under two different mechanisms of effective torque generation at the interface. The estimated switching speed and energy requirement are in the ps and aJ ranges, respectively, which are about two-three orders of magnitude better than the ferromagnetic counterparts. The observed differences in the magnetization dynamics may explain the disparate characteristic responses. Unlike the usual precessional/chiral motions in the ferromagnets, those of the AFMs can essentially be described as a damped oscillator with a more direct path. The impact of random thermal fluctuations is also examined.

Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material

NASA Astrophysics Data System (ADS)

Sharma, Deepak; Jain, Aman; Somaiah, Nalla; Narayanan, P. Ramesh; Kumar, Praveen

2018-05-01

The effect of embedding Cu-graphene hybrid powder, namely "graphene nano-sheet Cu" (GNS-Cu) powder, into In-40 vol.% Cu solder alloy on the electrical and mechanical properties of In-Cu solder is investigated. GNS-Cu hybrid powders were prepared by mixing reduced graphene oxide powders and CuSO4·5H2O, followed by reduction of the mixture with hydrazine. Subsequently, In-Cu solders with GNS-Cu powders were prepared using a 2-step process, comprising liquid phase sintering (LPS) of In and Cu powders followed by accumulative roll bonding (ARB). During ARB, the GNS-Cu powders were embedded as distinct layers into In-Cu composite solders. Electrical conductivity of the GNS-Cu embedded solders increased by > 20% as compared to pure In-Cu solders processed through the same combination of LPS-ARB steps. The yield strength of In-Cu solder increased by only 10% with the addition of GNS-Cu powders and thus retained the moderate strength often associated with pure In-Cu composite solders. Moreover, the thermal conductivity of GNS-Cu-embedded solders was estimated theoretically to increase by > 60%. These promising findings suggest that GNS-Cu-embedded In-Cu solders can be suitable for next-generation metallic thermal interface material and package-level interconnect applications.

Thermal modeling of head disk interface system in heat assisted magnetic recording

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vemuri, Sesha Hari; Seung Chung, Pil; Jhon, Myung S., E-mail: mj3a@andrew.cmu.edu

2014-05-07

A thorough understanding of the temperature profiles introduced by the heat assisted magnetic recording is required to maintain the hotspot at the desired location on the disk with minimal heat damage to other components. Here, we implement a transient mesoscale modeling methodology termed lattice Boltzmann method (LBM) for phonons (which are primary carriers of energy) in the thermal modeling of the head disk interface (HDI) components, namely, carbon overcoat (COC). The LBM can provide more accurate results compared to conventional Fourier methodology by capturing the nanoscale phenomena due to ballistic heat transfer. We examine the in-plane and out-of-plane heat transfermore » in the COC via analyzing the temperature profiles with a continuously focused and pulsed laser beam on a moving disk. Larger in-plane hotspot widening is observed in continuously focused laser beam compared to a pulsed laser. A pulsed laser surface develops steeper temperature gradients compared to continuous hotspot. Furthermore, out-of-plane heat transfer from the COC to the media is enhanced with a continuous laser beam then a pulsed laser, while the temperature takes around 140 fs to reach the bottom surface of the COC. Our study can lead to a realistic thermal model describing novel HDI material design criteria for the next generation of hard disk drives with ultra high recording densities.« less

The Effect of Prosthetic Socket Interface Design on Socket Comfort, Residual Limb Health, and Function for the Transfemoral Amputee

DTIC Science & Technology

2016-10-01

laminated rigid frame to reduce thermal layers, increase flexibility and comfort while retaining ischial containment. In contrast, a Sub-I design has...design is comprised of a flexible interface and minimal laminated rigid frame to reduce thermal layers, increase flexibility and comfort while...AWARD NUMBER: W81XWH-15-1-0410 TITLE: The Effect of Prosthetic Socket Interface Design on Socket Comfort , Residual Limb Health, and Function

Ultrafast Microwave Welding/Reinforcing Approach at the Interface of Thermoplastic Materials.

PubMed

Poyraz, Selcuk; Zhang, Lin; Schroder, Albrecht; Zhang, Xinyu

2015-10-14

As an attempt to address the needs and tackle the challenges in welding of thermoplastic materials (TPMs), a novel process was performed via short-term microwave (MW) heating of a specific composite, made up of conducting polypyrrole nanogranule (PPy NG) coated carbon and catalyst source precursor (ferrocene) fine particles, at substrate polypropylene (PP) dog bone pieces' interface. Upon vigorous interactions between MWs and electromagnetic absorbent PPy NG coating, the energy was transformed into a large amount of heat leading to a drastic temperature increase that was simultaneously used for the instant carbonization of PPy and the decomposition of fine ferrocene particles, which resulted in multiwalled carbon nanotubes (CNTs) growth at the interface. Meanwhile, the as-grown CNTs on the surface conveyed the heat into the adjacent bulk PP and caused locally molten surface layers' formation. Eventually, the light pressure applied at the interface during the heating process squeezed the molten layers together and a new weld was generated. The method is considerably advantageous compared to other alternatives due to (i) its fast, straightforward, and affordable nature, (ii) its applicability at ambient conditions without the need of any extra equipment or chemicals, and also (iii) its ability to provide clean, durable, and functional welds, via precisely controlling process parameters, without causing any thermal distortion or physical alterations in the bulk TPM. Thus, it is believed that this novel welding process will become much preferable for the manufacturing of next-generation TPM composites in large scale, through short-term MW heating.

Ceramic blade with tip seal

DOEpatents

Glezer, B.; Bhardwaj, N.K.; Jones, R.B.

1997-08-05

The present gas turbine engine includes a disc assembly defining a disc having a plurality of blades attached thereto. The disc has a preestablished rate of thermal expansion and the plurality of blades have a preestablished rate of thermal expansion being less than the preestablished rate of thermal expansion of the disc. A shroud assembly is attached to the gas turbine engine and is spaced from the plurality of blades a preestablished distance forming an interface there between. Positioned in the interface is a seal having a preestablished rate of thermal expansion being generally equal to the rate of thermal expansion of the plurality of blades. 4 figs.

Heat transport by phonons in crystalline materials and nanostructures

NASA Astrophysics Data System (ADS)

Koh, Yee Kan

This dissertation presents experimental studies of heat transport by phonons in crystalline materials and nanostructures, and across solid-solid interfaces. Particularly, this dissertation emphasizes advancing understanding of the mean-free-paths (i.e., the distance phonons propagate without being scattered) of acoustic phonons, which are the dominant heat carriers in most crystalline semiconductor nanostructures. Two primary tools for the studies presented in this dissertation are time-domain thermoreflectance (TDTR) for measurements of thermal conductivity of nanostructures and thermal conductance of interfaces; and frequency-domain thermoreflectance (FDTR), which I developed as a direct probe of the mean-free-paths of dominant heat-carrying phonons in crystalline solids. The foundation of FDTR is the dependence of the apparent thermal conductivity on the frequency of periodic heat sources. I find that the thermal conductivity of semiconductor alloys (InGaP, InGaAs, and SiGe) measured by TDTR depends on the modulation frequency, 0.1 ≤ f ≤ 10 MHz, used in TDTR measurements. Reduction in the thermal conductivity of the semiconductor alloys at high f compares well to the reduction in the thermal conductivity of epitaxial thin films, indicating that frequency dependence and thickness dependence of thermal conductivity are fundamentally equivalent. I developed the frequency dependence of thermal conductivity into a convenient probe of phonon mean-free-paths, a technique which I call frequency-domain thermoreflectance (FDTR). In FDTR, I monitor the changes in the intensity of the reflected probe beam as a function of the modulation frequency. To facilitate the analysis of FDTR measurements, I developed a nonlocal theory for heat conduction by phonons at high heating frequencies. Calculations of the nonlocal theory confirm my experimental findings that phonons with mean-free-paths longer than two times the penetration depth do not contribute to the apparent thermal conductivity. I employed FDTR to study the mean-free-paths of acoustic phonons in Si1-xGex. I experimentally demonstrate that 40% of heat is carried in Si1-xGe x alloys by phonons with mean-free-path 0.5 ≤ ℓ ≤ 5 mum, and phonons with > 2 mum do not contribute to the thermal conductivity of Si. I employed TDTR and frequency-dependent TDTR to study scattering of long- and medium-wavelength phonons in two important thermoelectric materials embedded with nanoscale precipitates. I find that the through-thickness lattice thermal conductivity of (PbTe)1-x/(PbSe)x nanodot superlattices (NDSLs) approaches the thermal conductivity of bulk homogenous PbTe1-x Sex alloys with the same average composition. On the other hand, I find that 3% of ErAs nanoparticles embedded in InGaAs is sufficient to scatter most of the phonons in InGaAs that have intermediate mean-free-paths, and thus reduces the thermal conductivity of InGaAs below the alloy limit. I find that scattering by nanoparticles approach the geometrical limit and can be readily accounted for by an additional boundary scattering which depends on the concentration of nanoparticles. Finally, I studied the thermal conductance of Au/Ti/Graphene/SiO 2 interfaces by TDTR. I find that heat transport across the interface is dominated by phonons. Even though graphene is only one atomic layer thick, graphene interfaces should be treated as two discrete interfaces instead of one diffuse interface in thermal analysis, suggesting that direct transmission of phonons from Au to SiO2 is negligible. My study is important for thermal management of graphene devices.

Performance Evaluation of Nose Cap to Silica Tile Joint of RLV-TD under the Simulated Flight Environment using Plasma Wind Tunnel Facility

NASA Astrophysics Data System (ADS)

Pillai, Aravindakshan; Krishnaraj, K.; Sreenivas, N.; Nair, Praveen

2017-12-01

Indian Space Research Organisation, India has successfully flight tested the reusable launch vehicle through launching of a demonstration flight known as RLV-TD HEX mission. This mission has given a platform for exposing the thermal protection system to the real hypersonic flight thermal conditions and thereby validated the design. In this vehicle, the nose cap region is thermally protected by carbon-carbon followed by silica tiles with a gap in between them for thermal expansion. The gap is filled with silica fibre. Base material on which the C-C is placed is made of molybdenum. Silica tile with strain isolation pad is bonded to aluminium structure. These interfaces with a variety of materials are characterised with different coefficients of thermal expansion joined together. In order to evaluate and qualify this joint, model tests were carried out in Plasma Wind Tunnel facility under the simultaneous simulation of heat flux and shear levels as expected in flight. The thermal and flow parameters around the model are determined and made available for the thermal analysis using in-house CFD code. Two tests were carried out. The measured temperatures at different locations were benign in both these tests and the SiC coating on C-C and the interface were also intact. These tests essentially qualified the joint interface between C-C and molybdenum bracket and C-C to silica tile interface of RLV-TD.

Thermal conductivity investigation of adhesive-free bond laser components

NASA Astrophysics Data System (ADS)

Li, Da; Hong, Pengda; Vedula, MahaLakshmi; Meissner, Helmuth E.

2017-02-01

An interferometric method has been developed and employed at Onyx Optics, Inc. to accurately measure the thermal conductivity of laser-active crystals as function of dopant concentration or inactive materials such as single crystals, optical ceramics and glasses relative to a standard of assumed to be known thermal conductivity [1]. This technique can also provide information on heat transfer resistance at the interface between two materials in close thermal contact. While the technique appears generally applicable to composites between optically homogeneous materials, we report on thermal conductivities and heat transfer coefficients of selected adhesive-free bond (AFB®) laser composites. Single crystal bars and AFB bonded crystal doublets with the combinations of various rare-earth (Nd3+, Yb3+, Er3+, and Tm3+ trivalent ion doped YAG, and un-doped YAG have been fabricated with the AFB technique. By loading the test sample in a vacuum cryostat, with a precisely controlled heat load at one end of the doublets, the temperature distribution inside the single crystal or the composite samples can been precisely mapped by measuring the optical path difference interferometrically, given the material's thermal-optical properties. No measurable heat transfer resistance can be identified for the AFB interfaces between low-concentration doped YAG and un-doped YAG. For the heavily doped RE3+:YAG, for example, 10% Yb:YAG, the thermal conductivity measured in our experiment is 8.3 W/m•K, using the thermal conductivity of undoped YAG reported in [1] as basis. The thermal transfer resistance of the AFB interface with un-doped YAG, if there is any at the AFB interface, could be less than 1.29×10-6 m2•K/W.

Dynamics of melt crystal interface and thermal stresses in rotational Bridgman crystal growth process

NASA Astrophysics Data System (ADS)

Ma, Ronghui; Zhang, Hui; Larson, David J.; Mandal, Krishna C.

2004-05-01

The growth process of potassium bromide (KBr) single crystals in a vertical Bridgman furnace has been studied numerically using an integrated model that combines formulation of global heat transfer and thermal elastic stresses. The global heat transfer sub-model accounts for conduction, convection and interface movement in the multiphase system. Using the elastic stress sub-model, thermal stresses in the growing crystal caused by the non-uniform temperature distribution is predicted. Special attention is directed to the interaction between the crystal and the ampoule. The global temperature distribution in the furnace, the flow pattern in the melt and the interface shapes are presented. We also investigate the effects of the natural convection and rotational forced convection on the shape of the growth fronts. Furthermore, the state of the thermal stresses in the crystal is studied to understand the plastic deformation mechanisms during the cooling process. The influence of the wall contact on thermal stresses is also addressed.

Compatibility between Co-Metallized PbTe Thermoelectric Legs and an Ag–Cu–In Brazing Alloy

PubMed Central

Ben-Ayoun, Dana; Sadia, Yatir; Gelbstein, Yaniv

2018-01-01

In thermoelectric (TE) generators, maximizing the efficiency of conversion of direct heat to electricity requires the reduction of any thermal and electrical contact resistances between the TE legs and the metallic contacts. This requirement is especially challenging in the development of intermediate to high-temperature TE generators. PbTe-based TE materials are known to be highly efficient up to temperatures of around 500 °C; however, only a few practical TE generators based on these materials are currently commercially available. One reason for that is the insufficient bonding techniques between the TE legs and the hot-side metallic contacts. The current research is focused on the interaction between cobalt-metallized n-type 9.104 × 10−3 mol % PbI2-doped PbTe TE legs and the Ag0.32Cu0.43In0.25 brazing alloy, which is free of volatile species. Clear and fine interfaces without any noticeable formation of adverse brittle intermetallic compounds were observed following prolonged thermal treatment testing. Moreover, a reasonable electrical contact resistance of ~2.25 mΩmm2 was observed upon brazing at 600 °C, highlighting the potential of such contacts while developing practical PbTe-based TE generators. PMID:29320430

Hydro-Thermal Fatigue Resistance Measurements on Polymer Interfaces

NASA Astrophysics Data System (ADS)

Gurumurthy, Charan K.; Kramer, Edward J.; Hui, Chung-Yuen

1998-03-01

We have developed a new technique based on a fiber optic displacement sensor for rapid determination of hydro-thermal fatigue crack growth rate per cycle (da/dN) of an epoxy/polyimide interface used in flip chip attach microelectronic assembly. The sample is prepared as a trilayered cantilever beam by capillary flow of the epoxy underfill over a polyimide coated metallic beam. During hydro-thermal cycling the crack growth along the interface (from the free end) changes the displacement of this end of the beam and we measure the free end displacement at the lowest temperature in each hydro-thermal cycle. The change in beam displacement is then converted into crack growth rate (da/dN). da/dN depends on the maximum change in the strain energy release rate of the crack and the phase angle in each cycle. The relation between da/dN and maximum strain energy release rate characterizes the fatigue crack growth resistance of the interface. We have developed and used a simple model anhydride cured and a commercially available PMDA/ODA passivation for this study.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Devoto, D.

2014-11-01

The thermal performance and reliability of sintered-silver is being evaluated for power electronics packaging applications. This will be experimentally accomplished by the synthesis of large-area bonded interfaces between metalized substrates that will be subsequently subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. The experiment is outlined, and the modeling approach is discussed.

The role of process history, phase morphology and interface strength upon the mechanical properties of dispersion strengthened alloys

NASA Technical Reports Server (NTRS)

Ansell, G. S.

1972-01-01

An analytical rationale for the sensitivity-insensitivity of dispersion-strengthened systems to process history is provided. In particular, the research was focussed upon the influence of the particle-matrix interface bond in TD-Nickel and TD-Nichrome, and the manner in which the differences in both elastic constants and thermal expansion coefficients between these phases stress this interface when these alloys are subjected to mechanical and thermal loads upon the mechanical properties of these alloys.

Epitaxial CdSe-Au nanocrystal heterostructures by thermal annealing.

PubMed

Figuerola, Albert; van Huis, Marijn; Zanella, Marco; Genovese, Alessandro; Marras, Sergio; Falqui, Andrea; Zandbergen, Henny W; Cingolani, Roberto; Manna, Liberato

2010-08-11

The thermal evolution of a collection of heterogeneous CdSe-Au nanosystems (Au-decorated CdSe nanorods, networks, vertical assemblies) prepared by wet-chemical approaches was monitored in situ in the transmission electron microscope. In contrast to interfaces that are formed during kinetically controlled wet chemical synthesis, heating under vacuum conditions results in distinct and well-defined CdSe/Au interfaces, located at the CdSe polar surfaces. The high quality of these interfaces should make the heterostructures more suitable for use in nanoscale electronic devices.

Reexamination of METMAN, Recommendations on Enhancement of LCVG, and Development of New Concepts for EMU Heat Sink

NASA Technical Reports Server (NTRS)

Karimi, Amir

1990-01-01

METMAN is a 41-node transient metabolic computer code developed in 1970 and revised in 1989 by Lockheed Engineering and Sciences, Inc. This program relies on a mathematical model to predict the transient temperature distribution in a body influenced by metabolic heat generation and thermal interaction with the environment. A more complex 315-node model is also available that not only simulates the thermal response of a body exposed to a warm environment, but is also capable of describing the thermal response resulting from exposure to a cold environment. It is important to compare the two models for the prediction of the body's thermal response to metabolic heat generation and exposure to various environmental conditions. Discrepancies between the twi models may warrant an investigation of METMAN to ensure its validity for describing the body's thermal response in space environment. The Liquid Cooling and Ventilation Garment is a subsystem of the Extravehicular Mobility Unit (EMU). This garment, worn under the pressure suit, contains the liquid cooling tubing and gas ventilation manifolds; its purpose is to alleviate or reduce thermal stress resulting from metabolic heat generation. There is renewed interest in modifying this garment through identification of the locus of maximum heat transfer at body-liquid cooled tubing interface. The sublimator is a vital component of the Primary Life Support System (PLSS) in the EMU. It acts as a heat sink to remove heat and humidity from the gas ventilating circuit and the liquid cooling loop of the LCVG. The deficiency of the sublimator is that the ice, used as the heat sink, sublimates into space. There is an effort to minimize water losses in the feedwater circuit of the EMU. This requires developing new concepts to design an alternative heat sink system. Efforts are directed to review and verify the heat transfer formulation of the analytical model employed by METMAN. A conceptual investigation of regenerative non-venting heat-sink subsystem for the EMU is recommended.

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment.

PubMed

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-12-16

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.

Nonlocal thermal transport across embedded few-layer graphene sheets

DOE PAGES

Liu, Ying; Huxtable, Scott T.; Yang, Bao; ...

2014-11-13

Thermal transport across the interfaces between few-layer graphene sheets and soft materials exhibits intriguing anomalies when interpreted using the classical Kapitza model, e.g., the conductance of the same interface differs greatly for different modes of interfacial thermal transport. Using atomistic simulations, we show that such thermal transport follows a nonlocal flux-temperature drop constitutive law and is characterized jointly by a quasi-local conductance and a nonlocal conductance instead of the classical Kapitza conductance. Lastly, the nonlocal model enables rationalization of many anomalies of the thermal transport across embedded few-layer graphene sheets and should be used in studies of interfacial thermal transportmore » involving few-layer graphene sheets or other ultra-thin layered materials.« less

Interface structure and properties of CNTs/Cu composites fabricated by electroless deposition and spark plasma sintering

NASA Astrophysics Data System (ADS)

Wang, Hu; Zhang, Zhao-Hui; Hu, Zheng-Yang; Song, Qi; Yin, Shi-Pan

2018-01-01

In this paper, we fabricated a novel copper matrix composites reinforced by carbon nanotubes (CNTs) using electroless deposition (ED) and spark plasma sintering technique. Microstructure, mechanical, electric conductivity, and thermal properties of the CNTs/Cu composites were investigated. The results show that a favorable interface containing C-O and O-Cu bond was formed between CNTs and matrix when the CNTs were coated with nano-Cu by ED method. Thus, we accomplished the uniformly dispersed CNTs in the CNTs/Cu powders and compacted composites, which eventually leads to the enhancement of the mechanical properties of the CNTs/Cu composites in the macro-scale environment. However, the interface structure can hinder the movement of carriers and free electrons and increase the interface thermal resistance, which leads to modest decrease of electrical and thermal conductivity of the CNTs/Cu composites.

Utilizing Radioisotope Power System Waste Heat for Spacecraft Thermal Management

NASA Technical Reports Server (NTRS)

Pantano, David R.; Dottore, Frank; Tobery, E. Wayne; Geng, Steven M.; Schreiber, Jeffrey G.; Palko, Joseph L.

2005-01-01

An advantage of using a Radioisotope Power System (RPS) for deep space or planetary surface missions is the readily available waste heat, which can be used for a number of beneficial purposes including: maintaining electronic components within a controlled temperature range, warming propulsion tanks and mobility actuators, and maintaining liquid propellants above their freezing temperature. Previous missions using Radioisotope Thermoelectric Generators (RTGs) dissipated large quantities of waste heat due to the low efficiency of the thermoelectric conversion technology. The next generation RPSs, such as the 110-Watt Stirling Radioisotope Generator (SRG110) will have higher conversion efficiencies, thereby rejecting less waste heat at a lower temperature and may require alternate approaches to transferring waste heat to the spacecraft. RTGs, with efficiencies of 6 to 7 percent, reject their waste heat at the relatively high heat rejection temperature of 200 C. This is an advantage when rejecting heat to space; however, transferring heat to the internal spacecraft components requires a large and heavy radiator heat exchanger. At the same time, sensitive spacecraft instruments must be shielded from the thermal radiation of the RTG. The SRG110, with an efficiency around 22 percent and 50 C nominal housing surface temperature, can readily transfer the available waste heat directly via heat pipes, thermal straps, or fluid loops. The lower temperatures associated with the SRG110 avoid the chances of overheating other scientific components, eliminating the need for thermal shields. This provides the spacecraft designers more flexibility when locating the generator for a specific mission. A common misconception with high-efficiency systems is that there is not enough waste heat for spacecraft thermal management. This paper will dispel this misconception and investigate the use of a high-efficiency SRG110 for spacecraft thermal management and outline potential methods of waste heat utilization in several conceptual missions (Lunar Rover, Mars Rover, and Titan Lander). The advantages associated with the SRG110 as they relate to ease of assembly, less complex interfaces, and overall mass savings for a spacecraft will be highlighted.

Thermal oxidation induced degradation of carbon fiber reinforced composites and carbon nanotube sheet enhanced fiber/matrix interface for high temperature aerospace structural applications

NASA Astrophysics Data System (ADS)

Haque, Mohammad Hamidul

Recent increase in the use of carbon fiber reinforced polymer matrix composite, especially for high temperature applications in aerospace primary and secondary structures along with wind energy and automotive industries, have generated new challenges to predict its failure mechanisms and service life. This dissertation reports the experimental study of a unidirectional carbon fiber reinforced bismaleimide (BMI) composites (CFRC), an excellent candidate for high temperature aerospace components, undergoing thermal oxidation at 260 °C in air for over 3000 hours. The key focus of the work is to investigate the mechanical properties of the carbon fiber BMI composite subjected to thermal aging in three key aspects - first, studying its bulk flexural properties (in macro scale), second, characterizing the crack propagation along the fiber direction, representing the interfacial bonding strength between fiber and matrix (in micro scale), and third, introducing nano-structured materials to modify the interface (in nano scale) between the carbon fiber and BMI resin and mechanical characterization to study its influence on mitigating the aging effect. Under the first category, weight loss and flexural properties have been monitored as the oxidation propagates through the fiber/matrix interface. Dynamic mechanical analysis and micro-computed tomography analysis have been performed to analyze the aging effects. In the second category, the long-term effects of thermal oxidation on the delamination (between the composite plies) and debonding (between fiber and matrix) type fracture toughness have been characterized by preparing two distinct types of double cantilever beam specimens. Digital image correlation has been used to determine the deformation field and strain distribution around the crack propagation path. Finally the resin system and the fiber/matrix interface have been modified using nanomaterials to mitigate the degradations caused by oxidation. Nanoclay modified epoxy resin has been characterized for hardness and modulus using nanoindentation technique. A significant reduction of oxidation, which is anticipated to eventually translate into improvement in mechanical properties, has been observed as the nanoclay particles have worked as a retarding agent for the oxidation propagation. Carbon nanotube sheet scrolled carbon fiber tows embedded in epoxy matrix have been investigated for interfacial properties using nanoindentation (push-out test), in micro scale, and using tensile testing (pull-out test), in macro scale. A significant increase in interfacial shear strength has been achieved by this unique materials combination.

Interactions at the planar Ag3Sn/liquid Sn interface under ultrasonic irradiation.

PubMed

Shao, Huakai; Wu, Aiping; Bao, Yudian; Zhao, Yue; Liu, Lei; Zou, Guisheng

2017-11-01

The interactions at the interface between planar Ag 3 Sn and liquid Sn under ultrasonic irradiation were investigated. An intensive thermal grooving process occurred at Ag 3 Sn grain boundaries due to ultrasonic effects. Without ultrasonic application, planar shape of Ag 3 Sn layer gradually evolved into scalloped morphology after the solid-state Sn melting, due to a preferential dissolution of the intermetallic compounds from the regions at grain boundaries, which left behind the grooves embedding in the Ag 3 Sn layer. Under the effect of ultrasonic, stable grooves could be rapidly generated within an extremely short time (<10s) that was far less than the traditional soldering process (>10min). In addition, the deepened grooves leaded to the formation of necks at the roots of Ag 3 Sn grains, and further resulted in the strong detachment of intermetallic grains from the substrate. The intensive thermal grooving could promote the growth of Ag 3 Sn grains in the vertical direction but restrain their coarsening in the horizontal direction, consequently, an elongated morphology was presented. All these phenomena could be attributed to the acoustic cavitation and streaming effects of ultrasonic vibration. Copyright © 2017 Elsevier B.V. All rights reserved.

Fracture mechanics analysis for various fiber/matrix interface loadings

NASA Technical Reports Server (NTRS)

Naik, R. A.; Crews, J. H., Jr.

1991-01-01

Fiber/matrix (F/M) cracking was analyzed to provide better understanding and guidance in developing F/M interface fracture toughness tests. Two configurations, corresponding to F/M cracking at a broken fiber and at the free edge, were investigated. The effects of mechanical loading, thermal cooldown, and friction were investigated. Each configuration was analyzed for two loadings: longitudinal and normal to the fiber. A nonlinear finite element analysis was performed to model friction and slip at the F/M interface. A new procedure for fitting a square-root singularity to calculated stresses was developed to determine stress intensity factors (K sub I and K sub II) for a bimaterial interface crack. For the case of F/M cracking at a broken fiber with longitudinal loading, crack tip conditions were strongly influenced by interface friction. As a result, an F/M interface toughness test based on this case was not recommended because nonlinear data analysis methods would be required. For the free edge crack configuration, both mechanical and thermal loading caused crack opening, thereby avoiding frictional effects. A F/M interface toughness test based on this configuration would provide data for K(sub I)/K(sub II) ratios of about 0.7 and 1.6 for fiber and radial normal loading, respectively. However, thermal effects must be accounted for in the data analysis.

Fracture mechanics analysis for various fiber/matrix interface loadings

NASA Technical Reports Server (NTRS)

Naik, Rajiv A.; Crews, John H., Jr.

1992-01-01

Fiber/matrix (F/M) cracking was analyzed to provide better understanding and guidance in developing F/M interface fracture toughness tests. Two configurations, corresponding to F/M cracking at a broken fiber and at the free edge, were investigated. The effects of mechanical loading, thermal cooldown, and friction were investigated. Each configuration was analyzed for two loadings: longitudinal and normal to the fiber. A nonlinear finite element analysis was performed to model friction and slip at the F/M interface. A new procedure for fitting a square-root singularity to calculated stresses was developed to determine stress intensity factors (K sub I and K sub II) for a bimaterial interface crack. For the case of F/M cracking at a broken fiber with longitudinal loading, crack tip conditions were strongly influenced by interface friction. As a result, an F/M interface toughness test based on this case was not recommended because nonlinear data analysis methods would be required. For the free edge crack configuration, both mechanical and thermal loading caused crack opening, theory avoiding fractional effects. A F/M interface toughness test based on this configuration would provide data for K(sub I/K(sub II) ratios of about 0.7 and 1.6 for fiber and radial normal loading, respectively. However, thermal effects must be accounted for in the data analysis.

Fracture mechanics analysis for various fiber/matrix interface loadings

NASA Technical Reports Server (NTRS)

Naik, R. A.; Crews, J. H., Jr.

1991-01-01

Fiber/matrix (F/M) cracking was analyzed to provide better understanding and guidance in developing F/M interface fracture toughness tests. Two configurations, corresponding to F/M cracking at a broken fiber and at the free edge, were investigated. The effects of mechanical loading, thermal cooldown, and friction were investigated. Each configuration was analyzed for two loadings: longitudinal and normal to the fiber. A nonlinear finite element analysis was performed to model friction and slip at the F/M interface. A new procedure for fitting a square-root singularity to calculated stresses was developed to determine stress intensity factors (K sub I and K sub II) for a bimaterial interface crack. For the case of F/M cracking at a broken fiber with longitudinal loading, crack tip conditions were strongly influenced by interface friction. As a result, an F/M interface toughness test based on this case was not recommended because nonlinear data analysis methods would be required. For the free edge crack configuration, both mechanical and thermal loading caused crack opening, thereby avoiding frictional effects. An F/M interface toughness test based on this configuration would provide data for K(sub I)/K(sub II) ratios of about 0.7 and 1.6 for fiber and radial normal loading, respectively. However, thermal effects must be accounted for in the data analysis.

Role of fluttering dislocations in the thermal interface resistance between a silicon crystal and plastic solid 4He

NASA Astrophysics Data System (ADS)

Amrit, Jay; Ramiere, Aymeric; Volz, Sebastian

2018-01-01

A quantum solid (solid 4He) in contact with a classical solid defines a new class of interfaces. In addition to its quantum nature, solid 4He is indeed a very plastic medium. We examine the thermal interface resistance upon solidification of superfluid 4He in contact with a silicon crystal surface (111) and show that dislocations play a crucial role in the thermal interface transport. The growth of solid 4He and the measurements are conducted at the minimum of the melting curve of helium (0.778 K and ˜25 bar ). The results display a first-order transition in the Kapitza resistance from a value of RK ,L=(80 ±8 ) c m2K /W at a pressure of 24.5 bar to a value of RK ,S=(41.7 ±8 ) c m2K /W after the formation of solid helium at ˜25.2 bar . The drop in RK ,S is only of a factor of ˜2 , although transverse phonon modes in solid 4He now participate in heat transmission at the interface. We provide an explanation for the measured RK ,S by considering the interaction of thermal phonons with vibrating dislocations in solid 4He. We demonstrate that this mechanism, also called fluttering, induces a thermal resistance RF l∝NdT-6 , where T is the temperature and Nd is the density of dislocations. We estimate that for dislocation densities on the order of ˜107c m-2 , RF l predominates over the boundary resistance RK ,S. These fundamental findings shed light on the role of dislocations and provide a quantitative explanation for previous experiments which showed no measurable change in the Kapitza resistance between Cu and superfluid 4He upon solidification of the latter. This demonstrates the possibility of using dislocations as an additional means to tailor thermal resistances at interfaces, formed especially with a plastic material.

Cr incorporated phase transformation in Y 2O 3 under ion irradiation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, Nan; Yadav, Satyesh Kumar; Xu, Yun

Under irradiation, chemical species can redistribute in ways not expected from equilibrium behavior. In oxide-dispersed ferritic alloys, the phenomenon of irradiation-induced Cr redistribution at the metal/oxide interfaces has drawn recent attention. Here, the thermal and irradiation stability of the FeCr/Y 2O 3 interface has been systematically studied. Trilayer thin films of 90 nm Fe - 20 at.% Cr (1 st layer)/100 nm Y 2O 3 (2 nd layer)/135 nm Fe - 20 at.% Cr (3 rd layer) were deposited on MgO substrates at 500 °C. After irradiation, Cr diffuses towards and enriches the FeCr/Y 2O 3 interface. Further, correlated withmore » Cr redistributed into the oxide, an amorphous layer is generated at the interface. In the Y 2O 3 layer, the original cubic phase is observed to transform to the monoclinic phase after irradiation. Meanwhile, nanosized voids, with relatively larger size at interfaces, are also observed in the oxide layer. First-principles calculations reveal that Cr substitution of Y interstitials in Y 2O 3 containing excess Y interstitials is favored and the irradiation-induced monoclinic phase enhances this process. Lastly, our findings provide new insights that may aid in the development of irradiation resistant oxide-dispersed ferritic alloys.« less

Cr incorporated phase transformation in Y2O3 under ion irradiation

PubMed Central

Li, N.; Yadav, S. K.; Xu, Y.; Aguiar, J. A.; Baldwin, J. K.; Wang, Y. Q.; Luo, H. M.; Misra, A.; Uberuaga, B. P.

2017-01-01

Under irradiation, chemical species can redistribute in ways not expected from equilibrium behavior. In oxide-dispersed ferritic alloys, the phenomenon of irradiation-induced Cr redistribution at the metal/oxide interfaces has drawn recent attention. Here, the thermal and irradiation stability of the FeCr/Y2O3 interface has been systematically studied. Trilayer thin films of 90 nm Fe - 20 at.% Cr (1st layer)/100 nm Y2O3 (2nd layer)/135 nm Fe - 20 at.% Cr (3rd layer) were deposited on MgO substrates at 500 °C. After irradiation, Cr diffuses towards and enriches the FeCr/Y2O3 interface. Further, correlated with Cr redistributed into the oxide, an amorphous layer is generated at the interface. In the Y2O3 layer, the original cubic phase is observed to transform to the monoclinic phase after irradiation. Meanwhile, nanosized voids, with relatively larger size at interfaces, are also observed in the oxide layer. First-principles calculations reveal that Cr substitution of Y interstitials in Y2O3 containing excess Y interstitials is favored and the irradiation-induced monoclinic phase enhances this process. Our findings provide new insights that may aid in the development of irradiation resistant oxide-dispersed ferritic alloys. PMID:28091522

Simulations of viscous and compressible gas-gas flows using high-order finite difference schemes

NASA Astrophysics Data System (ADS)

Capuano, M.; Bogey, C.; Spelt, P. D. M.

2018-05-01

A computational method for the simulation of viscous and compressible gas-gas flows is presented. It consists in solving the Navier-Stokes equations associated with a convection equation governing the motion of the interface between two gases using high-order finite-difference schemes. A discontinuity-capturing methodology based on sensors and a spatial filter enables capturing shock waves and deformable interfaces. One-dimensional test cases are performed as validation and to justify choices in the numerical method. The results compare well with analytical solutions. Shock waves and interfaces are accurately propagated, and remain sharp. Subsequently, two-dimensional flows are considered including viscosity and thermal conductivity. In Richtmyer-Meshkov instability, generated on an air-SF6 interface, the influence of the mesh refinement on the instability shape is studied, and the temporal variations of the instability amplitude is compared with experimental data. Finally, for a plane shock wave propagating in air and impacting a cylindrical bubble filled with helium or R22, numerical Schlieren pictures obtained using different grid refinements are found to compare well with experimental shadow-photographs. The mass conservation is verified from the temporal variations of the mass of the bubble. The mean velocities of pressure waves and bubble interface are similar to those obtained experimentally.

Cr incorporated phase transformation in Y 2O 3 under ion irradiation

DOE PAGES

Li, Nan; Yadav, Satyesh Kumar; Xu, Yun; ...

2017-01-16

Under irradiation, chemical species can redistribute in ways not expected from equilibrium behavior. In oxide-dispersed ferritic alloys, the phenomenon of irradiation-induced Cr redistribution at the metal/oxide interfaces has drawn recent attention. Here, the thermal and irradiation stability of the FeCr/Y 2O 3 interface has been systematically studied. Trilayer thin films of 90 nm Fe - 20 at.% Cr (1 st layer)/100 nm Y 2O 3 (2 nd layer)/135 nm Fe - 20 at.% Cr (3 rd layer) were deposited on MgO substrates at 500 °C. After irradiation, Cr diffuses towards and enriches the FeCr/Y 2O 3 interface. Further, correlated withmore » Cr redistributed into the oxide, an amorphous layer is generated at the interface. In the Y 2O 3 layer, the original cubic phase is observed to transform to the monoclinic phase after irradiation. Meanwhile, nanosized voids, with relatively larger size at interfaces, are also observed in the oxide layer. First-principles calculations reveal that Cr substitution of Y interstitials in Y 2O 3 containing excess Y interstitials is favored and the irradiation-induced monoclinic phase enhances this process. Lastly, our findings provide new insights that may aid in the development of irradiation resistant oxide-dispersed ferritic alloys.« less

Improvement of the GaSb/Al2O3 interface using a thin InAs surface layer

NASA Astrophysics Data System (ADS)

Greene, Andrew; Madisetti, Shailesh; Nagaiah, Padmaja; Yakimov, Michael; Tokranov, Vadim; Moore, Richard; Oktyabrsky, Serge

2012-12-01

The highly reactive GaSb surface was passivated with a thin InAs layer to limit interface trap state density (Dit) at the III-V/high-k oxide interface. This InAs surface was subjected to various cleaning processes to effectively reduce native oxides before atomic layer deposition (ALD). Ammonium sulfide pre-cleaning and trimethylaluminum/water ALD were used in conjunction to provide a clean interface and annealing in forming gas (FG) at 350 °C resulted in an optimized fabrication for n-GaSb/InAs/high-k gate stacks. Interface trap density, Dit ≈ 2-3 × 1012 cm-2eV-1 resided near the n-GaSb conductance band which was extracted and compared with three different methods. Conductance-voltage-frequency plots showed efficient Fermi level movement and a sub-threshold slope of 200 mV/dec. A composite high-k oxide process was also developed using ALD of Al2O3 and HfO2 resulting in a Dit ≈ 6-7 × 1012 cm-2eV-1. Subjecting these samples to a higher (450 °C) processing temperature results in increased oxidation and a thermally unstable interface. p-GaSb displayed very fast minority carrier generation/recombination likely due to a high density of bulk traps in GaSb.

Design concepts for hot carrier-based detectors and energy converters in the near ultraviolet and infrared

NASA Astrophysics Data System (ADS)

Gong, Tao; Krayer, Lisa; Munday, Jeremy N.

2016-10-01

Semiconductor materials are well suited for power conversion when the incident photon energy is slightly larger than the bandgap energy of the semiconductor. However, for photons with energy significantly greater than the bandgap energy, power conversion efficiencies are low. Further, for photons with energy below the bandgap energy, the absence of absorption results in no power generation. Here, we describe photon detection and power conversion of both high- and low-energy photons using hot carrier effects. For the absorption of high-energy photons, excited electrons and holes have excess kinetic energy that is typically lost through thermalization processes between the carriers and the lattice. However, collection of hot carriers before thermalization allows for reduced power loss. Devices utilizing plasmonic nanostructures or simple three-layer stacks (transparent conductor-insulator-metal) can be used to generate and collect these hot carriers. Alternatively, hot carrier collection from sub-bandgap photons can be possible by forming a Schottky junction with an absorbing metal so that hot carriers generated in the metal can be injected across the semiconductor-metal interface. Such structures enable near-IR detection based on sub-bandgap photon absorption. Further, utilization and optimization of localized surface plasmon resonances can increase optical absorption and hot carrier generation (through plasmon decay). Combining these concepts, hot carrier generation and collection can be exploited over a large range of incident wavelengths spanning the UV, visible, and IR.

Thermal Improvement and Stability of Si3N4/GeNx/p- and n-Ge Structures Prepared by Electron-Cyclotron-Resonance Plasma Nitridation and Sputtering at Room Temperature

NASA Astrophysics Data System (ADS)

Fukuda, Yukio; Okamoto, Hiroshi; Iwasaki, Takuro; Izumi, Kohei; Otani, Yohei; Ishizaki, Hiroki; Ono, Toshiro

2012-09-01

This paper reports on the thermal improvement of Si3N4/GeNx/Ge structures. After the Si3N4 (5 nm)/GeNx (2 nm) stacks were prepared on Ge substrates by electron-cyclotron-resonance plasma nitridation and sputtering at room temperature, they were thermally annealed in atmospheric N2 + 10% H2 ambient at temperatures from 400 to 600 °C. It was demonstrated that the electronic properties of the GeNx/Ge interfaces were thermally improved at temperatures of up to 500 °C with a minimum interface trap density (Dit) of ˜1×1011 cm-2 eV-1 near the Ge midgap, whereas the interface properties were slightly degraded after annealing at 600 °C with a minimum Dit value of ˜4×1011 cm-2 eV-1.

Thermal Interface Evaluation of Heat Transfer from a Pumped Loop to Titanium-Water Thermosyphons

NASA Technical Reports Server (NTRS)

Jaworske, Donald A.; Sanzi, James L.; Gibson, Marc A.; Sechkar, Edward A.

2009-01-01

Titanium-water thermosyphons are being considered for use in the heat rejection system for lunar outpost fission surface power. Key to their use is heat transfer between a closed loop heat source and the heat pipe evaporators. This work describes laboratory testing of several interfaces that were evaluated for their thermal performance characteristics, in the temperature range of 350 to 400 K, utilizing a water closed loop heat source and multiple thermosyphon evaporator geometries. A gas gap calorimeter was used to measure heat flow at steady state. Thermocouples in the closed loop heat source and on the evaporator were used to measure thermal conductance. The interfaces were in two generic categories, those immersed in the water closed loop heat source and those clamped to the water closed loop heat source with differing thermal conductive agents. In general, immersed evaporators showed better overall performance than their clamped counterparts. Selected clamped evaporator geometries offered promise.

A gigantically increased ratio of electrical to thermal conductivity and synergistically enhanced thermoelectric properties in interface-controlled TiO2-RGO nanocomposites.

PubMed

Nam, Woo Hyun; Lim, Young Soo; Kim, Woochul; Seo, Hyeon Kook; Dae, Kyun Seong; Lee, Soonil; Seo, Won-Seon; Lee, Jeong Yong

2017-06-14

We report synergistically enhanced thermoelectric properties through the independently controlled charge and thermal transport properties in a TiO 2 -reduced graphene oxide (RGO) nanocomposite. By the consolidation of TiO 2 -RGO hybrid powder using spark plasma sintering, we prepared an interface-controlled TiO 2 -RGO nanocomposite where its grain boundaries are covered with the RGO network. Both the enhancement in electrical conductivity and the reduction in thermal conductivity were simultaneously achieved thanks to the beneficial effects of the RGO network, and detailed mechanisms are discussed. This led to the gigantic increase in the ratio of electrical to thermal conductivity by six orders of magnitude and also the synergistic enhancement in the thermoelectric figure of merit by two orders. Our results present a strategy for the realization of 'phonon-glass electron-crystals' through interface control using graphene in graphene hybrid thermoelectric materials.

Ceramic blade with tip seal

DOEpatents

Glezer, Boris; Bhardwaj, Narender K.; Jones, Russell B.

1997-01-01

The present gas turbine engine (10) includes a disc assembly (64) defining a disc (66) having a plurality of blades (70) attached thereto. The disc (66) has a preestablished rate of thermal expansion and the plurality of blades have a preestablished rate of thermal expansion being less than the preestablished rate of thermal expansion of the disc (66). A shroud assembly (100) is attached to the gas turbine engine (10) and is spaced from the plurality of blades (70) a preestablished distance forming an interface (108) therebetween. Positioned in the interface is a seal (110) having a preestablished rate of thermal expansion being generally equal to the rate of thermal expansion of the plurality of blades (70).

Interfacing superhydrophobic silica nanoparticle films with graphene and thermoplastic polyurethane for wear/abrasion resistance.

PubMed

Naderizadeh, Sara; Athanassiou, Athanassia; Bayer, Ilker S

2018-06-01

Nanoparticle films are one of the most suitable platforms for obtaining sub-micrometer and nanometer dual-scale surface texture required for liquid repellency. The assembly of superhydrophobic nanoparticles into conformal and strongly adherent films having abrasion-induced wear resistance still poses a significant challenge. Various techniques have been developed over the years to render nanoparticle films with good liquid repellent properties and transparency. However, forming abrasion resistant superhydrophobic nanoparticle films on hard surfaces is challenging. One possibility is to partially embed or weld nanoparticles in thin thermoplastic primers applied over metals. Hexamethyldisilazane-functionalized fumed silica nanoparticle films spray deposited on aluminum surfaces were rendered abrasion resistant by thermally welding them into thermoplastic polyurethane (TPU) primer applied a priori over aluminum. Different solvents, nanoparticle concentrations and annealing temperatures were studied to optimize nanoparticle film morphology and hydrophobicity. Thermal annealing at 150 °C enhanced stability and wear resistance of nanoparticle films. A thin thermal interface layer of graphene nanoplatelets (GnPs) between the primer and the nanoparticle film significantly improved superhydrophobic wear resistance after annealing. As such, superhydrophobic nanocomposite films with the GnPs thermal interface layer displayed superior abrasion-induced wear resistance under 20 kPa compared to films having no GnPs-based thermal interface. Copyright © 2018 Elsevier Inc. All rights reserved.

Producibility improvements suggested by a validated process model of seeded CdZnTe vertical Bridgman growth

NASA Astrophysics Data System (ADS)

Larson, David J., Jr.; Casagrande, Louis G.; Di Marzio, Don; Levy, Alan; Carlson, Frederick M.; Lee, Taipao; Black, David R.; Wu, Jun; Dudley, Michael

1994-07-01

We have successfully validated theoretical models of seeded vertical Bridgman-Stockbarger CdZnTe crystal growth and post-solidification processing, using in-situ thermal monitoring and innovative material characterization techniques. The models predict the thermal gradients, interface shape, fluid flow and solute redistribution during solidification, as well as the distributions of accumulated excess stress that causes defect generation and redistribution. Data from the furnace and ampoule wall have validated predictions from the thermal model. Results are compared to predictions of the thermal and thermo-solutal models. We explain the measured initial, change-of-rate, and terminal compositional transients as well as the macrosegregation. Macro and micro-defect distributions have been imaged on CdZnTe wafers from 40 mm diameter boules. Superposition of topographic defect images and predicted excess stress patterns suggests the origin of some frequently encountered defects, particularly on a macro scale, to result from the applied and accumulated stress fields and the anisotropic nature of the CdZnTe crystal. Implications of these findings with respect to producibility are discussed.

Thermally Stable Silver Nanowires-Embedding Metal Oxide for Schottky Junction Solar Cells.

PubMed

Kim, Hong-Sik; Patel, Malkeshkumar; Park, Hyeong-Ho; Ray, Abhijit; Jeong, Chaehwan; Kim, Joondong

2016-04-06

Thermally stable silver nanowires (AgNWs)-embedding metal oxide was applied for Schottky junction solar cells without an intentional doping process in Si. A large scale (100 mm(2)) Schottky solar cell showed a power conversion efficiency of 6.1% under standard illumination, and 8.3% under diffused illumination conditions which is the highest efficiency for AgNWs-involved Schottky junction Si solar cells. Indium-tin-oxide (ITO)-capped AgNWs showed excellent thermal stability with no deformation at 500 °C. The top ITO layer grew in a cylindrical shape along the AgNWs, forming a teardrop shape. The design of ITO/AgNWs/ITO layers is optically beneficial because the AgNWs generate plasmonic photons, due to the AgNWs. Electrical investigations were performed by Mott-Schottky and impedance spectroscopy to reveal the formation of a single space charge region at the interface between Si and AgNWs-embedding ITO layer. We propose a route to design the thermally stable AgNWs for photoelectric device applications with investigation of the optical and electrical aspects.

Phonon cross-plane transport and thermal boundary resistance: effect of heat source size and thermal boundary resistance on phonon characteristics

NASA Astrophysics Data System (ADS)

Ali, H.; Yilbas, B. S.

2016-09-01

Phonon cross-plane transport across silicon and diamond thin films pair is considered, and thermal boundary resistance across the films pair interface is examined incorporating the cut-off mismatch and diffusive mismatch models. In the cut-off mismatch model, phonon frequency mismatch for each acoustic branch is incorporated across the interface of the silicon and diamond films pair in line with the dispersion relations of both films. The frequency-dependent and transient solution of the Boltzmann transport equation is presented, and the equilibrium phonon intensity ratios at the silicon and diamond film edges are predicted across the interface for each phonon acoustic branch. Temperature disturbance across the edges of the films pair is incorporated to assess the phonon transport characteristics due to cut-off and diffusive mismatch models across the interface. The effect of heat source size, which is allocated at high-temperature (301 K) edge of the silicon film, on the phonon transport characteristics at the films pair interface is also investigated. It is found that cut-off mismatch model predicts higher values of the thermal boundary resistance across the films pair interface as compared to that of the diffusive mismatch model. The ratio of equilibrium phonon intensity due to the cut-off mismatch over the diffusive mismatch models remains >1 at the silicon edge, while it becomes <1 at the diamond edge for all acoustic branches.

Heat-transport mechanisms in molecular building blocks of inorganic/organic hybrid superlattices

NASA Astrophysics Data System (ADS)

Giri, Ashutosh; Niemelä, Janne-Petteri; Tynell, Tommi; Gaskins, John T.; Donovan, Brian F.; Karppinen, Maarit; Hopkins, Patrick E.

2016-03-01

Nanomaterial interfaces and concomitant thermal resistances are generally considered as atomic-scale planes that scatter the fundamental energy carriers. Given that the nanoscale structural and chemical properties of solid interfaces can strongly influence this thermal boundary conductance, the ballistic and diffusive nature of phonon transport along with the corresponding phonon wavelengths can affect how energy is scattered and transmitted across an interfacial region between two materials. In hybrid composites composed of atomic layer building blocks of inorganic and organic constituents, the varying interaction between the phononic spectrum in the inorganic crystals and vibronic modes in the molecular films can provide a new avenue to manipulate the energy exchange between the fundamental vibrational energy carriers across interfaces. Here, we systematically study the heat transfer mechanisms in hybrid superlattices of atomic- and molecular-layer-grown zinc oxide and hydroquinone with varying thicknesses of the inorganic and organic layers in the superlattices. We demonstrate ballistic energy transfer of phonons in the zinc oxide that is limited by scattering at the zinc oxide/hydroquinone interface for superlattices with a single monolayer of hydroquinone separating the thicker inorganic layers. The concomitant thermal boundary conductance across the zinc oxide interfacial region approaches the maximal thermal boundary conductance of a zinc oxide phonon flux, indicative of the contribution of long wavelength vibrations across the aromatic molecular monolayers in transmitting energy across the interface. This transmission of energy across the molecular interface decreases considerably as the thickness of the organic layers are increased.

A new setup for studying thermal microcracking through acoustic emission monitoring

NASA Astrophysics Data System (ADS)

Griffiths, Luke; Heap, Michael; Baud, Patrick; Schmittbuhl, Jean

2016-04-01

Thermal stressing is common in geothermal environments and has been shown in the laboratory to induce changes in the physical and mechanical properties of rocks. These changes are generally considered to be a consequence of the generation of thermal microcracks and debilitating chemical reactions. Thermal microcracks form as a result of the build-up of internal stresses due to: (1) the thermal expansion mismatch between the different phases present in the material, (2) thermal expansion anisotropy within individual minerals, and (3) thermal gradients. The generation of cracks during thermal stressing has been monitored in previous studies using the output of acoustic emissions (AE), a common proxy for microcrack damage, and through microstructural observations. Here we present a new experimental setup which is optimised to record AE from a rock sample at high temperatures and under a servo-controlled uniaxial stress. The design is such that the AE transducer is embedded in the top of the piston, which acts as a continuous wave guide to the sample. In this way, we simplify the ray path geometry whilst minimising the number of interfaces between the microcrack and the transducer, maximising the quality of the signal. This allows for an in-depth study of waveform attributes such as energy, amplitude, counts and duration. Furthermore, the capability of this device to apply a servo-controlled load on the sample, whilst measuring strain in real time, leads to a spectrum of possible tests combining mechanical and thermal stress. It is also an essential feature to eliminate the build-up of stresses through thermal expansion of the pistons and the sample. We plan a systematic experimental study of the AE of thermally stressed rock during heating and cooling cycles. We present results from pilot tests performed on Darley Dale sandstone and Westerly granite. Understanding the effects of thermal stressing in rock is of particular interest at a geothermal site, where circulating fluids influence the temperature field in the surrounding rock mass. These stresses can, for example, provoke thermal borehole breakouts due to cooling-induced tensile microcracking or may be actively used to enhance the injectivity of geothermal wells.

Phase evolution and thermal properties of yttria-stabilized hafnia nano-coatings deposited on alumina

NASA Astrophysics Data System (ADS)

Rubio, Ernesto Javier

High-temperature coatings are critical to the future power-generation systems and industries. Thermal barrier coatings (TBCs), which are usually the ceramic materials applied as thin coatings, protect engine components and allow further increase in engine temperatures for higher efficiency. Thus, the durability and reliability of the coating systems have to be more robust compared to current natural gas based engines. While a near and mid-term target is to develop TBC architecture with a 1300 °C surface temperature tolerance, a deeper understanding of the structure evolution and thermal behavior of the TBC-bond coat interface, specifically the thermally grown oxide (TGO), is of primary importance. In the present work, attention is directed towards yttria-stabilized hafnia (YSH) coatings on alumina (α-Al2O 3) to simulate the TBC-TGO interface and understand the phase evolution, microstructure and thermal oxidation of the coatings. YSH coatings were grown on α-Al2O3 substrates by sputter deposition by varying coating thickness in a wide range ˜30-1000 nm. The effect of coating thickness on the structure, morphology and the residual stress has been investigated using X-ray diffraction (XRD) and high resolution scanning electron microscopy (SEM). Thermal oxidation behavior of the coatings has been evaluated using the isothermal oxidation measurements under static conditions. X-ray diffraction analyses revealed the existence of monoclinic hafnia phase for relatively thin coatings indicating that the interfacial phenomena are dominant in phase stabilization. The evolution towards pure stabilized cubic phase of hafnia with the increasing coating thickness is observed. The SEM results indicate the changes in morphology of the coatings; the average grain size increases from 15 to 500 nm with increasing thickness. Residual stress was calculated employing XRD using the variable ψ-angle. Relation between residual stress and structural change is also studied. The results obtained on the thermal oxidation behavior indicate that the YSH coatings exhibit initial mass gain in the first 6 hours and sustained structure for extended hours of thermal treatment.

Thermal analysis of Bridgman-Stockbarger growth. [mercury cadmium telluride single crystals

NASA Technical Reports Server (NTRS)

Knopf, F. W.

1979-01-01

A thermal analysis of a cylindrical HgCdTe sample in a Bridgman-Stockbarger crystal growth configuration was conducted with emphasis on the thermal profile, interface shape and position, and the thermal gradients at the liquid-solid interface. Alloys of HgTe and CdTe with compositions approximating 20 percent CdTe, 80 percent HgTe were used. This composition results in a bandgap suited for the detection of 10.6 micron CO2 radiation. The sensitivity of the sample thermal characteristics to important growth parameters, such as thermal diffusivities, thermal conductivities, furnace temperature profile, ampoule dimensions, and growth velocity was assessed. Numerical techniques and associated computational models necessary to analyze the heat transfer process within the sample and the Bridgman-Stockbarger boundary conditions were developed. This thermal analysis mode was programmed in FORTRAN V, and is currently operational on the MSFC Univac 1100 system.

Interface thermal resistance of nanostructured FeCoCu film and Si substrate

NASA Astrophysics Data System (ADS)

Nikolaenko, Yuri M.; Medvedev, Yuri V.; Genenko, Yuri A.; Ghafari, Mohammad; Hahn, Horst

2006-05-01

Results of measurement of thermal resistance (RFS ) of film substrate interface of 10 nm (Fe1-x Cox )1-y Cuy film on Si substrate with 50 nm SiO2 sublayer are presented. The estimated magnitude is two orders greater then RFS of epitaxial manganite films on StTiO3 substrate with and without sublayer. The significant increase of RFS is explained by granular structure of film with average size of grain about 10 nm. In this case the additional thermal barier in the film-substrate interface is appeared. It provides the change of regime of phonons propagation from ballistic to diffusion one. The principle possibility of variation of RFS in wide range as a task of nanotechnology is discussed.

Systems evaluation of thermal bus concepts

NASA Technical Reports Server (NTRS)

Stalmach, D. D.

1982-01-01

Thermal bus concepts, to provide a centralized thermal utility for large, multihundred kilowatt space platforms, were studied and the results are summarized. Concepts were generated, defined, and screened for inclusion in system level thermal bus trades. Parametric trade studies were conducted in order to define the operational envelope, performance, and physical characteristics of each. Two concepts were selected as offering the most promise for thermal bus development. All of four concepts involved two phase flow in order to meet the required isothermal nature of the thermal bus. Two of the concepts employ a mechanical means to circulate the working fluid, a liquid pump in one case and a vapor compressor in another. Another concept utilizes direct osmosis as the driving force of the thermal bus. The fourth concept was a high capacity monogroove heat pipe. After preliminary sizing and screening, three of these concepts were selected to carry into the trade studies. The monogroove heat pipe concept was deemed unsuitable for further consideration because of its heat transport limitations. One additional concept utilizing capillary forces to drive the working fluid was added. Parametric system level trade studies were performed. Sizing and weight calculations were performed for thermal bus sizes ranging from 5 to 350 kW and operating temperatures in the range of 4 to 120 C. System level considerations such as heat rejection and electrical power penalties and interface temperature losses were included in the weight calculations.

Reconstruction of phonon relaxation times from systems featuring interfaces with unknown properties

NASA Astrophysics Data System (ADS)

Forghani, Mojtaba; Hadjiconstantinou, Nicolas G.

2018-05-01

We present a method for reconstructing the phonon relaxation-time function τω=τ (ω ) (including polarization) and associated phonon free-path distribution from thermal spectroscopy data for systems featuring interfaces with unknown properties. Our method does not rely on the effective thermal-conductivity approximation or a particular physical model of the interface behavior. The reconstruction is formulated as an optimization problem in which the relaxation times are determined as functions of frequency by minimizing the discrepancy between the experimentally measured temperature profiles and solutions of the Boltzmann transport equation for the same system. Interface properties such as transmissivities are included as unknowns in the optimization; however, because for the thermal spectroscopy problems considered here the reconstruction is not very sensitive to the interface properties, the transmissivities are only approximately reconstructed and can be considered as byproducts of the calculation whose primary objective is the accurate determination of the relaxation times. The proposed method is validated using synthetic experimental data obtained from Monte Carlo solutions of the Boltzmann transport equation. The method is shown to remain robust in the presence of uncertainty (noise) in the measurement.

Recent advances in chemical synthesis methodology of inorganic materials and theoretical computations of metal nanoparticles/carbon interfaces

NASA Astrophysics Data System (ADS)

Harris, Andrew G.

With increased public interest in protecting the environment, scientists and engineers aim to improve energy conversion efficiency. Thermoelectrics offer many advantages as thermal management technology. When compared to vapor compression refrigeration, above approximately 200 to 600 watts, cost in dollars per watt as well as COP are not advantageous for thermoelectrics. The goal of this work was to determine if optimized pulse supercooling operation could improve cooling capacity or efficiency of a thermoelectric device. The basis of this research is a thermal-electrical analogy based modeling study using SPICE. Two models were developed. The first model, a standalone thermocouple with no attached mass to be cooled. The second, a system that includes a module attached to a heat generating mass. With the thermocouple study, a new approach of generating response surfaces with characteristic parameters was applied. The current pulse height and pulse on-time was identified for maximizing Net Transient Advantage, a newly defined metric. The corresponding pulse height and pulse on-time was utilized for the system model. Along with the traditional steady state starting current of Imax, Iopt was employed. The pulse shape was an isosceles triangle. For the system model, metrics new to pulse cooling were Qc, power consumption and COP. The effects of optimized current pulses were studied by changing system variables. Further studies explored time spacing between pulses and temperature distribution in the thermoelement. It was found net Q c over an entire pulse event can be improved over Imax steady operation but not over steady I opt operation. Qc can be improved over Iopt operation but only during the early part of the pulse event. COP is reduced in transient pulse operation due to the different time constants of Qc and Pin. In some cases lower performance interface materials allow more Qc and better COP during transient operation than higher performance interface materials. Important future work might look at developing innovative ways of biasing Joule heat to Th..

Characterization of Thermal Oxides on 4H-SiC Epitaxial Substrates Using Fourier-Transform Infrared Spectroscopy.

PubMed

Seki, Hirofumi; Yoshikawa, Masanobu; Kobayashi, Takuma; Kimoto, Tsunenobu; Ozaki, Yukihiro

2017-05-01

Fourier transform infrared (FT-IR) spectra were measured for thermal oxides with different electrical properties grown on 4H-SiC substrates. The peak frequency of the transverse optical (TO) phonon mode was blue-shifted by 5 cm -1 as the oxide-layer thickness decreased to 3 nm. The blue shift of the TO mode indicates interfacial compressive stress in the oxide. Comparison of data for the oxide on a SiC substrate with that for similar oxides on a Si substrate implies that the peak shift of the TO mode at the SiO 2 /SiC interface is larger than that of SiO 2 /Si, which suggests that the interfacial stress for the oxide on the SiC substrate is larger than that on the Si substrate. For the SiO 2 /SiC interfacial region (<3 nm oxide thickness), despite the fact that the blue shift of the TO modes becomes larger while approaching the oxide/SiC interface, the peak frequency of the TO modes red-shifts at the oxide/SiC interface. The peak-frequency shift of the TO mode for the sample without post-oxidation annealing was larger than that for the samples post-annealed in a nitric oxide atmosphere. The channel mobilities are correlated with the degree of shift of the TO mode when the oxide thickness is <3 nm. It appears that the compressive stress at the SiO 2 /SiC interface generates silicon suboxide components and weakens the Si-O bonds. As the result, the TO mode was red-shifted and the oxygen deficiency increased to relax the compressive stress in the oxide with <3 nm thickness. Fourier transform infrared spectroscopy measurements provide unique and useful information about stress and inhomogeneity at the oxide/SiC interface.

UIVerify: A Web-Based Tool for Verification and Automatic Generation of User Interfaces

NASA Technical Reports Server (NTRS)

Shiffman, Smadar; Degani, Asaf; Heymann, Michael

2004-01-01

In this poster, we describe a web-based tool for verification and automatic generation of user interfaces. The verification component of the tool accepts as input a model of a machine and a model of its interface, and checks that the interface is adequate (correct). The generation component of the tool accepts a model of a given machine and the user's task, and then generates a correct and succinct interface. This write-up will demonstrate the usefulness of the tool by verifying the correctness of a user interface to a flight-control system. The poster will include two more examples of using the tool: verification of the interface to an espresso machine, and automatic generation of a succinct interface to a large hypothetical machine.

Thermally Conductive Tape Based on Carbon Nanotube Arrays

NASA Technical Reports Server (NTRS)

Kashani, Ali

2011-01-01

To increase contact conductance between two mating surfaces, a conductive tape has been developed by growing dense arrays of carbon nanotubes (CNTs, graphite layers folded into cylinders) on both sides of a thermally conductive metallic foil. When the two mating surfaces are brought into contact with the conductive tape in between, the CNT arrays will adhere to the mating surface. The van der Waals force between the contacting tubes and the mating surface provides adhesion between the two mating surfaces. Even though the thermal contact conductance of a single tube-to-tube contact is small, the tremendous amount of CNTs on the surface leads to a very large overall contact conductance. Interface contact thermal resistance rises from the microroughness and the macroscopic non-planar quality of mating surfaces. When two surfaces come into contact with each other, the actual contact area may be much less than the total area of the surfaces. The real area of contact depends on the load, the surface roughness, and the elastic and inelastic properties of the surface. This issue is even more important at cryogenic temperatures, where materials become hard and brittle and vacuum is used, which prevents any gas conduction through the interstitial region. A typical approach to increase thermal contact conductance is to use thermally conducting epoxies or greases, which are not always compatible with vacuum conditions. In addition, the thermal conductivities of these compounds are often relatively low. The CNTs used in this approach can be metallic or semiconducting, depending on the folding angle and diameter. The electrical resistivity of multiwalled carbon nanotubes (MWCNTs) has been reported. MWCNTs can pass a current density and remain stable at high temperatures in air. The thermal conductivity of a MWCNT at room temperature is measured to be approximately 3,000 W/m-K, which is much larger than that of diamond. At room temperature, the thermal conductance of a 0.3 sq cm array of CNTs was measured to be as high as 10 W/K. The high thermal conductivity and the nanoscale size make CNTs ideal as thermal interface materials. The CNT-based thermal tape can be used for the thermal management of microelectronic packages and electronic systems. It also can be integrated with current device technology and packaging. The material would allow for an efficient method to manage excess heat generation without requiring any additional power. Lastly, the CNT tape can be used to enhance thermal contact conductance across two mating surfaces on some NASA missions.

Suppression of thermally excited capillary waves by shear flow.

PubMed

Derks, Didi; Aarts, Dirk G A L; Bonn, Daniel; Lekkerkerker, Henk N W; Imhof, Arnout

2006-07-21

We investigate the thermal fluctuations of the colloidal gas-liquid interface subjected to a shear flow parallel to the interface. Strikingly, we find that the shear strongly suppresses capillary waves, making the interface smoother. This phenomenon can be described by introducing an effective interfacial tension that increases with the shear rate. The increase of sigma(eff) is a direct consequence of the loss of interfacial entropy caused by the flow, which affects especially the slow fluctuations. This demonstrates that the interfacial tension of fluids results from an intrinsic as well as a fluctuation contribution.

Multifunctional semi-interpenetrating polymer network-nanoencapsulated cathode materials for high-performance lithium-ion batteries.

PubMed

Kim, Ju-Myung; Park, Jang-Hoon; Lee, Chang Kee; Lee, Sang-Young

2014-04-08

As a promising power source to boost up advent of next-generation ubiquitous era, high-energy density lithium-ion batteries with reliable electrochemical properties are urgently requested. Development of the advanced lithium ion-batteries, however, is staggering with thorny problems of performance deterioration and safety failures. This formidable challenge is highly concerned with electrochemical/thermal instability at electrode material-liquid electrolyte interface, in addition to structural/chemical deficiency of major cell components. Herein, as a new concept of surface engineering to address the abovementioned interfacial issue, multifunctional conformal nanoencapsulating layer based on semi-interpenetrating polymer network (semi-IPN) is presented. This unusual semi-IPN nanoencapsulating layer is composed of thermally-cured polyimide (PI) and polyvinyl pyrrolidone (PVP) bearing Lewis basic site. Owing to the combined effects of morphological uniqueness and chemical functionality (scavenging hydrofluoric acid that poses as a critical threat to trigger unwanted side reactions), the PI/PVP semi-IPN nanoencapsulated-cathode materials enable significant improvement in electrochemical performance and thermal stability of lithium-ion batteries.

Multifunctional semi-interpenetrating polymer network-nanoencapsulated cathode materials for high-performance lithium-ion batteries

NASA Astrophysics Data System (ADS)

Kim, Ju-Myung; Park, Jang-Hoon; Lee, Chang Kee; Lee, Sang-Young

2014-04-01

As a promising power source to boost up advent of next-generation ubiquitous era, high-energy density lithium-ion batteries with reliable electrochemical properties are urgently requested. Development of the advanced lithium ion-batteries, however, is staggering with thorny problems of performance deterioration and safety failures. This formidable challenge is highly concerned with electrochemical/thermal instability at electrode material-liquid electrolyte interface, in addition to structural/chemical deficiency of major cell components. Herein, as a new concept of surface engineering to address the abovementioned interfacial issue, multifunctional conformal nanoencapsulating layer based on semi-interpenetrating polymer network (semi-IPN) is presented. This unusual semi-IPN nanoencapsulating layer is composed of thermally-cured polyimide (PI) and polyvinyl pyrrolidone (PVP) bearing Lewis basic site. Owing to the combined effects of morphological uniqueness and chemical functionality (scavenging hydrofluoric acid that poses as a critical threat to trigger unwanted side reactions), the PI/PVP semi-IPN nanoencapsulated-cathode materials enable significant improvement in electrochemical performance and thermal stability of lithium-ion batteries.

Artificial nacre-like papers based on noncovalent functionalized boron nitride nanosheets with excellent mechanical and thermally conductive properties.

PubMed

Zeng, Xiaoliang; Ye, Lei; Yu, Shuhui; Li, Hao; Sun, Rong; Xu, Jianbin; Wong, Ching-Ping

2015-04-21

Inspired by the nano/microscale hierarchical structure and the precise inorganic/organic interface of natural nacre, we fabricated artificial nacre-like papers based on noncovalent functionalized boron nitride nanosheets (NF-BNNSs) and poly(vinyl alcohol) (PVA) via a vacuum-assisted self-assembly technique. The artificial nacre-like papers exhibit excellent tensile strength (125.2 MPa), on a par with that of the natural nacre, and moreover display a 30% higher toughness (2.37 MJ m(-3)) than that of the natural nacre. These excellent mechanical properties result from an ordered 'brick-and-mortar' arrangement of NF-BNNSs and PVA, in which the long-chain PVA molecules act as the bridge to link NF-BNNSs via hydrogen bonds. The resulting papers also render high thermal conductivity (6.9 W m(-1) K(-1)), and reveal their superiority as flexible substrates to support light-emitting-diode chips. The combined mechanical and thermal properties make the materials highly desirable as flexible substrates for next-generation commercial portable electronics.

Multifunctional semi-interpenetrating polymer network-nanoencapsulated cathode materials for high-performance lithium-ion batteries

PubMed Central

Kim, Ju-Myung; Park, Jang-Hoon; Lee, Chang Kee; Lee, Sang-Young

2014-01-01

As a promising power source to boost up advent of next-generation ubiquitous era, high-energy density lithium-ion batteries with reliable electrochemical properties are urgently requested. Development of the advanced lithium ion-batteries, however, is staggering with thorny problems of performance deterioration and safety failures. This formidable challenge is highly concerned with electrochemical/thermal instability at electrode material-liquid electrolyte interface, in addition to structural/chemical deficiency of major cell components. Herein, as a new concept of surface engineering to address the abovementioned interfacial issue, multifunctional conformal nanoencapsulating layer based on semi-interpenetrating polymer network (semi-IPN) is presented. This unusual semi-IPN nanoencapsulating layer is composed of thermally-cured polyimide (PI) and polyvinyl pyrrolidone (PVP) bearing Lewis basic site. Owing to the combined effects of morphological uniqueness and chemical functionality (scavenging hydrofluoric acid that poses as a critical threat to trigger unwanted side reactions), the PI/PVP semi-IPN nanoencapsulated-cathode materials enable significant improvement in electrochemical performance and thermal stability of lithium-ion batteries. PMID:24710575

Control of grown-in defects and oxygen precipitates in silicon wafers with DZ-IG structure by ultrahigh-temperature rapid thermal oxidation

NASA Astrophysics Data System (ADS)

Maeda, Susumu; Sudo, Haruo; Okamura, Hideyuki; Nakamura, Kozo; Sueoka, Koji; Izunome, Koji

2018-04-01

A new control technique for achieving compatibility between crystal quality and gettering ability for heavy metal impurities was demonstrated for a nitrogen-doped Czochralski silicon wafer with a diameter of 300 mm via ultra-high temperature rapid thermal oxidation (UHT-RTO) processing. We have found that the DZ-IG structure with surface denuded zone and the wafer bulk with dense oxygen precipitates were formed by the control of vacancies in UHT-RTO process at temperature exceeding 1300 °C. It was also confirmed that most of the void defects were annihilated from the sub-surface of the wafer due to the interstitial Si atoms that were generated at the SiO2/Si interface. These results indicated that vacancies corresponded to dominant species, despite numerous interstitial silicon injections. We have explained these prominent features by the degree of super-saturation for the interstitial silicon due to oxidation and the precise thermal properties of the vacancy and interstitial silicon.

Quantifying surface roughness effects on phonon transport in silicon nanowires.

PubMed

Lim, Jongwoo; Hippalgaonkar, Kedar; Andrews, Sean C; Majumdar, Arun; Yang, Peidong

2012-05-09

Although it has been qualitatively demonstrated that surface roughness can reduce the thermal conductivity of crystalline Si nanowires (SiNWs), the underlying reasons remain unknown and warrant quantitative studies and analysis. In this work, vapor-liquid-solid (VLS) grown SiNWs were controllably roughened and then thoroughly characterized with transmission electron microscopy to obtain detailed surface profiles. Once the roughness information (root-mean-square, σ, correlation length, L, and power spectra) was extracted from the surface profile of a specific SiNW, the thermal conductivity of the same SiNW was measured. The thermal conductivity correlated well with the power spectra of surface roughness, which varies as a power law in the 1-100 nm length scale range. These results suggest a new realm of phonon scattering from rough interfaces, which restricts phonon transport below the Casimir limit. Insights gained from this study can help develop a more concrete theoretical understanding of phonon-surface roughness interactions as well as aid the design of next generation thermoelectric devices.

Oxidation Control with Chromate Pretreatment of MCrAlY Unmelted Particle and Bond Coat in Thermal Barrier Systems

NASA Astrophysics Data System (ADS)

Yamano, Hideaki; Tani, Kazumi; Harada, Yoshio; Teratani, Takema

2008-06-01

MCrAlY alloy bond coat is widely used in thermal barrier coating (TBC) systems to protect substrates from high-temperature oxidizing environments. However, failure of the ceramic topcoat can occur due to a thermally grown oxide (TGO) that grows at the interface between the bond coat and the topcoat. In this study, the effect of chromate treatment was investigated. Prior to topcoat deposition, a thin film of Cr2O3 was formed on the bond coat surface. High-temperature oxidation tests were carried out, and the oxidation rates were determined by inspection of cross sections. Similar oxidation tests were carried out using MCrAlY powder material assumed to be unmelted particles. As a result, the chromate-treated bond coat showed outstanding oxidation resistance. Calculations that take into account the oxidation of particles in the topcoat indicated the generation of internal stress to cause local fracture of the topcoat.

Heat recovery subsystem and overall system integration of fuel cell on-site integrated energy systems

NASA Technical Reports Server (NTRS)

Mougin, L. J.

1983-01-01

The best HVAC (heating, ventilating and air conditioning) subsystem to interface with the Engelhard fuel cell system for application in commercial buildings was determined. To accomplish this objective, the effects of several system and site specific parameters on the economic feasibility of fuel cell/HVAC systems were investigated. An energy flow diagram of a fuel cell/HVAC system is shown. The fuel cell system provides electricity for an electric water chiller and for domestic electric needs. Supplemental electricity is purchased from the utility if needed. An excess of electricity generated by the fuel cell system can be sold to the utility. The fuel cell system also provides thermal energy which can be used for absorption cooling, space heating and domestic hot water. Thermal storage can be incorporated into the system. Thermal energy is also provided by an auxiliary boiler if needed to supplement the fuel cell system output. Fuel cell/HVAC systems were analyzed with the TRACE computer program.

Lubricant reflow after laser heating in heat assisted magnetic recording

NASA Astrophysics Data System (ADS)

Wu, Haoyu; Mendez, Alejandro Rodriguez; Xiong, Shaomin; Bogy, David B.

2015-05-01

In heat assisted magnetic recording (HAMR) technology for hard disk drives, the media will be heated to about 500 °C during the writing process in order to reduce its magnetic coercivity and thus allow data writing with the magnetic head transducers. The traditional lubricants such as Z-dol and Z-tetraol may not be able to perform in such harsh heating conditions due to evaporation, decomposition and thermal depletion. However, some of the lubricant depletion can be recovered due to reflow after a period of time, which can help to reduce the chance of head disk interface failure. In this study, experiments of lubricant thermal depletion and reflow were performed using a HAMR test stage for a Z-tetraol type lubricant. Various lubricant depletion profiles were generated using different laser heating conditions. The lubricant reflow process after thermal depletion was monitored by use of an optical surface analyzer. In addition, a continuum based lubrication model was developed to simulate the lubricant reflow process. Reasonably good agreement between simulations and experiments was achieved.

Design and development of a very high resolution thermal imager

NASA Astrophysics Data System (ADS)

Kuerbitz, Gunther; Duchateau, Ruediger

1998-10-01

The design goal of this project was to develop a thermal imaging system with ultimate geometrical resolution without sacrificing thermal sensitivity. It was necessary to fulfil the criteria for a future advanced video standard. This video standard is the so-called HDTV standard (HDTV High Definition TeleVision). The thermal imaging system is a parallel scanning system working in the 7...11 micrometer spectral region. The detector for that system has to have 576 X n (n number of TDI stages) detector elements taking into account a twofold interlace. It must be carefully optimized in terms of range performance and size of optics entrance pupil as well as producibility and yield. This was done in strong interaction with the detector manufacturer. The 16:9 aspect ratio of the HDTV standard together with the high number of 1920 pixels/line impose high demands on the scanner design in terms of scan efficiency and linearity. As an advanced second generation thermal imager the system has an internal thermal reference. The electronics is fully digitized and comprises circuits for Non Uniformity Correction (NUC), scan conversion, electronic zoom, auto gain and level, edge enhancement, up/down and left/right reversion etc. It can be completely remote-controlled via a serial interface.

Dynamic Stability of the Rate, State, Temperature, and Pore Pressure Friction Model at a Rock Interface

NASA Astrophysics Data System (ADS)

Sinha, Nitish; Singh, Arun K.; Singh, Trilok N.

2018-05-01

In this article, we study numerically the dynamic stability of the rate, state, temperature, and pore pressure friction (RSTPF) model at a rock interface using standard spring-mass sliding system. This particular friction model is a basically modified form of the previously studied friction model namely the rate, state, and temperature friction (RSTF). The RSTPF takes into account the role of thermal pressurization including dilatancy and permeability of the pore fluid due to shear heating at the slip interface. The linear stability analysis shows that the critical stiffness, at which the sliding becomes stable to unstable or vice versa, increases with the coefficient of thermal pressurization. Critical stiffness, on the other hand, remains constant for small values of either dilatancy factor or hydraulic diffusivity, but the same decreases as their values are increased further from dilatancy factor (˜ 10^{ - 4} ) and hydraulic diffusivity (˜ 10^{ - 9} {m}2 {s}^{ - 1} ) . Moreover, steady-state friction is independent of the coefficient of thermal pressurization, hydraulic diffusivity, and dilatancy factor. The proposed model is also used for predicting time of failure of a creeping interface of a rock slope under the constant gravitational force. It is observed that time of failure decreases with increase in coefficient of thermal pressurization and hydraulic diffusivity, but the dilatancy factor delays the failure of the rock fault under the condition of heat accumulation at the creeping interface. Moreover, stiffness of the rock-mass also stabilizes the failure process of the interface as the strain energy due to the gravitational force accumulates in the rock-mass before it transfers to the sliding interface. Practical implications of the present study are also discussed.

Polarized neutron reflectivity study of a thermally treated MnIr/CoFe exchange bias system.

PubMed

Awaji, Naoki; Miyajima, Toyoo; Doi, Shuuichi; Nomura, Kenji

2010-12-01

It has recently been found that the exchange bias of a MnIr/CoFe system can be increased significantly by adding a thermal treatment to the bilayer. To reveal the origin of the higher exchange bias, we performed polarized neutron reflectivity measurements at the JRR-3 neutron source. The magnetization vector near the MnIr/CoFe interface for thermally treated samples differed from that for samples without the treatment. We propose a model in which the pinned spin area at the interface is extended due to the increased roughness and atomic interdiffusion that result from the thermal treatment.

Tuning Transpiration by Interfacial Solar Absorber‐Leaf Engineering

PubMed Central

Zhuang, Shendong; Zhou, Lin; Xu, Weichao; Xu, Ning; Hu, Xiaozhen; Li, Xiuqiang; Lv, Guangxin; Zheng, Qinghui; Zhu, Shining

2017-01-01

Abstract Plant transpiration, a process of water movement through a plant and its evaporation from aerial parts especially leaves, consumes a large component of the total continental precipitation (≈48%) and significantly influences global water distribution and climate. To date, various chemical and/or biological explorations have been made to tune the transpiration but with uncertain environmental risks. In recent years, interfacial solar steam/vapor generation is attracting a lot of attention for achieving high energy transfer efficiency. Various optical and thermal designs at the solar absorber–water interface for potential applications in water purification, seawater desalination, and power generation appear. In this work, the concept of interfacial solar vapor generation is extended to tunable plant transpiration by showing for the first time that the transpiration efficiency can also be enhanced or suppressed through engineering the solar absorber–leaf interface. By tuning the solar absorption of membrane in direct touch with green leaf, surface temperature of green leaf will change accordingly because of photothermal effect, thus the transpiration efficiency as well as temperature and relative humidity in the surrounding environment will be tuned. This tunable transpiration by interfacial absorber‐leaf engineering can open an alternative avenue to regulate local atmospheric temperature, humidity, and eventually hydrologic cycle. PMID:29619300

Power Electronics and Thermal Management | Transportation Research | NREL

Science.gov Websites

Power Electronics and Thermal Management Power Electronics and Thermal Management This is the March Gearhart's testimony. Optical Thermal Characterization Enables High-Performance Electronics Applications New transient thermoreflectance measures the thermal performance of materials and their interfaces that cannot

Toward Improved Lifetimes of Organic Solar Cells under Thermal Stress: Substrate-Dependent Morphological Stability of PCDTBT:PCBM Films and Devices.

PubMed

Li, Zhe; Ho Chiu, Kar; Shahid Ashraf, Raja; Fearn, Sarah; Dattani, Rajeev; Cheng Wong, Him; Tan, Ching-Hong; Wu, Jiaying; Cabral, João T; Durrant, James R

2015-10-15

Morphological stability is a key requirement for outdoor operation of organic solar cells. We demonstrate that morphological stability and lifetime of polymer/fullerene based solar cells under thermal stress depend strongly on the substrate interface on which the active layer is deposited. In particular, we find that the stability of benchmark PCDTBT/PCBM solar cells under modest thermal stress is substantially increased in inverted solar cells employing a ZnO substrate compared to conventional devices employing a PSS substrate. This improved stability is observed to correlate with PCBM nucleation at the 50 nm scale, which is shown to be strongly influenced by different substrate interfaces. Employing this approach, we demonstrate remarkable thermal stability for inverted PCDTBT:PC70BM devices on ZnO substrates, with negligible (<2%) loss of power conversion efficiency over 160 h under 85 °C thermal stress and minimal thermally induced "burn-in" effect. We thus conclude that inverted organic solar cells, in addition to showing improved environmental stability against ambient humidity exposure as widely reported previously, can also demonstrate enhanced morphological stability. As such we show that the choice of suitable substrate interfaces may be a key factor in achieving prolonged lifetimes for organic solar cells under thermal stress conditions.

Residual thermal stresses in composites for dimensionally stable spacecraft applications

NASA Technical Reports Server (NTRS)

Bowles, David E.; Tompkins, Stephen S.; Funk, Joan G.

1992-01-01

An overview of NASA LaRC's research on thermal residual stresses and their effect on the dimensional stability of carbon fiber reinforced polymer-matrix composites is presented. The data show that thermal residual stresses can induce damage in polymer matrix composites and significantly affect the dimensional stability of these composites by causing permanent residual strains and changes in CTE. The magnitude of these stresses is primarily controlled by the laminate configuration and the applied temperature change. The damage caused by thermal residual stresses initiates at the fiber/matrix interface and micromechanics level analyses are needed to accurately predict it. An increased understanding of fiber/matrix interface interactions appears to be the best approach for improving a composite's resistance to thermally induced damage.

Elasto-plastic analysis of interface layers for fiber reinforced metal matrix composites

NASA Technical Reports Server (NTRS)

Doghri, I.; Leckie, F. A.

1991-01-01

The mismatch in coefficients of thermal expansion (CTE) of fiber and matrix in metal matrix composites reinforced with ceramic fibers induces high thermal stresses in the matrix. Elasto-plastic analyses - with different degrees of simplification and modelization - show that an interface layer with a sufficiently high CTE can reduce the tensile hoop stress in the matrix substantially.

Effect of power history on the shape and the thermal stress of a large sapphire crystal during the Kyropoulos process

NASA Astrophysics Data System (ADS)

Nguyen, Tran Phu; Chuang, Hsiao-Tsun; Chen, Jyh-Chen; Hu, Chieh

2018-02-01

In this study, the effect of the power history on the shape of a sapphire crystal and the thermal stress during the Kyropoulos process are numerically investigated. The simulation results show that the thermal stress is strongly dependent on the power history. The thermal stress distributions in the crystal for all growth stages produced with different power histories are also studied. The results show that high von Mises stress regions are found close to the seed of the crystal, the highly curved crystal surface and the crystal-melt interface. The maximum thermal stress, which occurs at the crystal-melt interface, increases significantly in value as the crystal expands at the crown. After this, there is reduction in the maximum thermal stress as the crystal lengthens. There is a remarkable enhancement in the maximum von Mises stress when the crystal-melt interface is close to the bottom of the crucible. There are two obvious peaks in the maximum Von Mises stress, at the end of the crown stage and in the final stage, when cracking defects can form. To alleviate this problem, different power histories are considered in order to optimize the process to produce the lowest thermal stress in the crystal. The optimal power history is found to produce a significant reduction in the thermal stress in the crown stage.

Thermal analysis of the vertical bridgman semiconductor crystal growth technique. Ph.D. Thesis

NASA Technical Reports Server (NTRS)

Jasinski, T. J.

1982-01-01

The quality of semiconductor crystals grown by the vertical Bridgman technique is strongly influenced by the axial and radial variations of temperature within the charge. The relationship between the thermal parameters of the vertical Bridgman system and the thermal behavior of the charge are examined. Thermal models are developed which are capable of producing results expressable in analytical form and which can be used without recourse to extensive computer work for the preliminary thermal design of vertical Bridgman crystal growth systems. These models include the effects of thermal coupling between the furnace and the charge, charge translation rate, charge diameter, thickness and thermal conductivity of the confining crucible, thermal conductivity change and liberation of latent heat at the growth interface, and infinite charge length. The hot and cold zone regions, considered to be at spatially uniform temperatures, are separated by a gradient control region which provides added thermal design flexibility for controlling the temperature variations near the growth interface.

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

PubMed Central

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-01-01

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor. PMID:26671673

Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials.

PubMed

Barako, Michael T; Isaacson, Scott G; Lian, Feifei; Pop, Eric; Dauskardt, Reinhold H; Goodson, Kenneth E; Tice, Jesse

2017-12-06

Thermal interface materials (TIMs) are essential for managing heat in modern electronics, and nanocomposite TIMs can offer critical improvements. Here, we demonstrate thermally conductive, mechanically compliant TIMs based on dense, vertically aligned copper nanowires (CuNWs) embedded into polymer matrices. We evaluate the thermal and mechanical characteristics of 20-25% dense CuNW arrays with and without polydimethylsiloxane infiltration. The thermal resistance achieved is below 5 mm 2 K W -1 , over an order of magnitude lower than commercial heat sink compounds. Nanoindentation reveals that the nonlinear deformation mechanics of this TIM are influenced by both the CuNW morphology and the polymer matrix. We also implement a flip-chip bonding protocol to directly attach CuNW composites to copper surfaces, as required in many thermal architectures. Thus, we demonstrate a rational design strategy for nanocomposite TIMs that simultaneously retain the high thermal conductivity of aligned CuNWs and the mechanical compliance of a polymer.

Experimental Characterization and Modeling of Thermal Contact Resistance of Electric Machine Stator-to-Cooling Jacket Interface Under Interference Fit Loading

DOE PAGES

Cousineau, Justine Emily; Bennion, Kevin S.; Chieduko, Victor; ...

2018-05-08

Cooling of electric machines is a key to increasing power density and improving reliability. This paper focuses on the design of a machine using a cooling jacket wrapped around the stator. The thermal contact resistance (TCR) between the electric machine stator and cooling jacket is a significant factor in overall performance and is not well characterized. This interface is typically an interference fit subject to compressive pressure exceeding 5 MPa. An experimental investigation of this interface was carried out using a thermal transmittance setup using pressures between 5 and 10 MPa. Furthermore, the results were compared to currently available modelsmore » for contact resistance, and one model was adapted for prediction of TCR in future motor designs.« less

Experimental Characterization and Modeling of Thermal Contact Resistance of Electric Machine Stator-to-Cooling Jacket Interface Under Interference Fit Loading

DOE Office of Scientific and Technical Information (OSTI.GOV)

Cousineau, Justine Emily; Bennion, Kevin S.; Chieduko, Victor

Cooling of electric machines is a key to increasing power density and improving reliability. This paper focuses on the design of a machine using a cooling jacket wrapped around the stator. The thermal contact resistance (TCR) between the electric machine stator and cooling jacket is a significant factor in overall performance and is not well characterized. This interface is typically an interference fit subject to compressive pressure exceeding 5 MPa. An experimental investigation of this interface was carried out using a thermal transmittance setup using pressures between 5 and 10 MPa. Furthermore, the results were compared to currently available modelsmore » for contact resistance, and one model was adapted for prediction of TCR in future motor designs.« less

Au-assisted fabrication of nano-holes on c-plane sapphire via thermal treatment guided by Au nanoparticles as catalysts

NASA Astrophysics Data System (ADS)

Sui, Mao; Pandey, Puran; Li, Ming-Yu; Zhang, Quanzhen; Kunwar, Sundar; Lee, Jihoon

2017-01-01

Nanoscale patterning of sapphires is a challenging task due to the high mechanical strength, chemical stability as well as thermal durability. In this paper, we demonstrate a gold droplet assisted approach of nano-hole fabrication on c-plane sapphire via a thermal treatment. Uniformly distributed nano-holes are fabricated on the sapphire surface guided by dome shaped Au nanoparticles (NPs) as catalysts and the patterning process is discussed based on the disequilibrium of vapor, liquid, solid interface energies at the Au NP/sapphire interface induced by the Au evaporation at high temperature. Followed by the re-equilibration of interface energy, transport of alumina from the beneath of NPs to the sapphire surface can occur along the NP/sapphire interface resulting in the formation of nano-holes. The fabrication of nano-holes using Au NPs as catalysts is a flexible, economical and convenient approach and can find applications in various optoelectronics.

Hydrogen incorporation and radiation induced dynamics in metal-oxide-silicon structures: A study using nuclear reaction analysis

NASA Astrophysics Data System (ADS)

Briere, M. A.

Resonant Nuclear Reaction Analysis (NRA), using the H-1/N-15, alpha gamma/c-12 reaction at 6.4 MeV, is successfully applied to the investigation of hydrogen incorporation and radiation induced migration in metal oxide silicon structures. The influence of processing parameters on the H content of thermal oxides, with and without gate material present, is studied. Hydrogen accumulation at the Si-SiO2 interface is reproducibly demonstrated for as-oxidized samples, as well as for oxides exposed to H2 containing atmospheres during subsequent thermal processing. The migration of hydrogen, from the bulk oxide to the silicon oxide interface during NRA, is investigated. It is found that the cross section for this migration, per incident N-15 ion, depends on the sample processing history. It is argued that the release is due to electron capture at Si-OH sites and that the migration is driven by reductions in the interfacial free energy associated with the incorporation of hydrogen within the strained oxide region. A similar migration of hydrogen during irradiation with 2.5 MeV electrons is presented, which suggests that the migration occurs preferentially under applied fields which are directed to the silicon interface. It is argued that this bias effect is due to holes, which modify the interfacial region so as to increase hydrogen solubility, that is explained by the diffusivity of the hydrogen species during N-15 irradiation, which suggest identification as neutral atomic hydrogen. The spatial distribution of hydrogen at the Si-SiO2 interface is shown to be confined to within ca. 2 nm of the metallurgical boundary, in agreement with measurements of the location of oxide charge states, paramagnetic centers, as well as the width of the strained transition region in the neighborhood of this interface. A direct correlation between the hydrogen content of the bulk oxide and the radiation generated oxide charges and interface states is presented. These data provide strong support for the important role of hydrogen in determining the radiation sensitivity of electronic devices.

Interplay between total thickness and period thickness in the phonon thermal conductivity of superlattices from the nanoscale to the microscale: Coherent versus incoherent phonon transport

NASA Astrophysics Data System (ADS)

Cheaito, Ramez; Polanco, Carlos A.; Addamane, Sadhvikas; Zhang, Jingjie; Ghosh, Avik W.; Balakrishnan, Ganesh; Hopkins, Patrick E.

2018-02-01

We report on the room temperature thermal conductivity of AlAs-GaAs superlattices (SLs), in which we systematically vary the period thickness and total thickness between 2 -24 nm and 20.1 -2 ,160 nm , respectively. The thermal conductivity increases with the SL thickness and plateaus at a thickness around 200 nm, showing a clear transition from a quasiballistic to a diffusive phonon transport regime. These results demonstrate the existence of classical size effects in SLs, even at the highest interface density samples. We use harmonic atomistic Green's function calculations to capture incoherence in phonon transport by averaging the calculated transmission over several purely coherent simulations of independent SL with different random mixing at the AlAs-GaAs interfaces. These simulations demonstrate the significant contribution of incoherent phonon transport through the decrease in the transmission and conductance in the SLs as the number of interfaces increases. In spite of this conductance decrease, our simulations show a quasilinear increase in thermal conductivity with the superlattice thickness. This suggests that the observation of a quasilinear increase in thermal conductivity can have important contributions from incoherent phonon transport. Furthermore, this seemingly linear slope in thermal conductivity versus SL thickness data may actually be nonlinear when extended to a larger number of periods, which is a signature of incoherent effects. Indeed, this trend for superlattices with interatomic mixing at the interfaces could easily be interpreted as linear when the number of periods is small. Our results reveal that the change in thermal conductivity with period thickness is dominated by incoherent (particlelike) phonons, whose properties are not dictated by changes in the AlAs or GaAs phonon dispersion relations. This work demonstrates the importance of studying both period and sample thickness dependencies of thermal conductivity to understand the relative contributions of coherent and incoherent phonon transport in the thermal conductivity in SLs.

Thermal barrier coating life prediction model development, phase 2

NASA Technical Reports Server (NTRS)

Meier, Susan Manning; Sheffler, Keith D.; Nissley, David M.

1991-01-01

The objective of this program was to generate a life prediction model for electron-beam-physical vapor deposited (EB-PVD) zirconia thermal barrier coating (TBC) on gas turbine engine components. Specific activities involved in development of the EB-PVD life prediction model included measurement of EB-PVD ceramic physical and mechanical properties and adherence strength, measurement of the thermally grown oxide (TGO) growth kinetics, generation of quantitative cyclic thermal spallation life data, and development of a spallation life prediction model. Life data useful for model development was obtained by exposing instrumented, EB-PVD ceramic coated cylindrical specimens in a jet fueled burner rig. Monotonic compression and tensile mechanical tests and physical property tests were conducted to obtain the EB-PVD ceramic behavior required for burner rig specimen analysis. As part of that effort, a nonlinear constitutive model was developed for the EB-PVD ceramic. Spallation failure of the EB-PVD TBC system consistently occurred at the TGO-metal interface. Calculated out-of-plane stresses were a small fraction of that required to statically fail the TGO. Thus, EB-PVD spallation was attributed to the interfacial cracking caused by in-plane TGO strains. Since TGO mechanical properties were not measured in this program, calculation of the burner rig specimen TGO in-plane strains was performed by using alumina properties. A life model based on maximum in-plane TGO tensile mechanical strain and TGO thickness correlated the burner rig specimen EB-PVD ceramic spallation lives within a factor of about plus or minus 2X.

Effect of interfacial interactions on the thermal conductivity and interfacial thermal conductance in tungsten–graphene layered structure

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jagannadham, K., E-mail: jag-kasichainula@ncsu.edu

2014-09-01

Graphene film was deposited by microwave plasma assisted deposition on polished oxygen free high conductivity copper foils. Tungsten–graphene layered film was formed by deposition of tungsten film by magnetron sputtering on the graphene covered copper foils. Tungsten film was also deposited directly on copper foil without graphene as the intermediate film. The tungsten–graphene–copper samples were heated at different temperatures up to 900 °C in argon atmosphere to form an interfacial tungsten carbide film. Tungsten film deposited on thicker graphene platelets dispersed on silicon wafer was also heated at 900 °C to identify the formation of tungsten carbide film by reaction of tungstenmore » with graphene platelets. The films were characterized by scanning electron microscopy, Raman spectroscopy, and x-ray diffraction. It was found that tungsten carbide film formed at the interface upon heating only above 650 °C. Transient thermoreflectance signal from the tungsten film surface on the samples was collected and modeled using one-dimensional heat equation. The experimental and modeled results showed that the presence of graphene at the interface reduced the cross-plane effective thermal conductivity and the interfacial thermal conductance of the layer structure. Heating at 650 and 900 °C in argon further reduced the cross-plane thermal conductivity and interface thermal conductance as a result of formation nanocrystalline tungsten carbide at the interface leading to separation and formation of voids. The present results emphasize that interfacial interactions between graphene and carbide forming bcc and hcp elements will reduce the cross-plane effective thermal conductivity in composites.« less

Seeing Below the Drop: Direct Nano-to-microscale Imaging of Complex Interfaces involving Solid, Liquid, and Gas Phases

NASA Astrophysics Data System (ADS)

Rykaczewski, Konrad; Landin, Trevan; Walker, Marlon L.; Scott, John Henry J.; Varanasi, Kripa K.

2012-11-01

Nanostructured surfaces with special wetting properties have the potential to transform number of industries, including power generation, water desalination, gas and oil production, and microelectronics thermal management. Predicting the wetting properties of these surfaces requires detailed knowledge of the geometry and the composition of the contact volume linking the droplet to the underlying substrate. Surprisingly, a general nano-to-microscale method for direct imaging of such interfaces has previously not been developed. Here we introduce a three dimensional imaging method which resolves this one-hundred-year-old metrology gap in wetting research. Specifically, we demonstrate direct nano-to-microscale imaging of complex fluidic interfaces using cryofixation in combination with cryo-FIB/SEM. We show that application of this method yields previously unattainable quantitative information about the interfacial geometry of water condensed on silicon nanowire forests with hydrophilic and hydrophobic surface termination in the presence or absence of an intermediate water repelling oil. We also discuss imaging artifacts and the advantages of secondary and backscatter electron imaging, Energy Dispersive Spectrometry (EDS), and three dimensional FIB/SEM tomography.

Impact of the intermixed phase and the channel network on the carrier mobility of nanostructured solar cells

NASA Astrophysics Data System (ADS)

Woellner, Cristiano F.; Freire, José A.

2016-02-01

We analyzed the impact of the complex channel network of donor and acceptor domains in nanostructured solar cells on the mobility of the charge carriers moving by thermally activated hopping. Particular attention was given to the so called intermixed phase, or interface roughness, that has recently been shown to promote an increase in the cell efficiency. The domains were obtained from a Monte Carlo simulation of a two-species lattice gas. We generated domain morphologies with controllable channel size and interface roughness. The field and density dependence of the carrier hopping mobility in different morphologies was obtained by solving a master equation. Our results show that the mobility decreases with roughness and increases with typical channel sizes. The deleterious effect of the roughness on the mobility is quite dramatic at low carrier densities and high fields. The complex channel network is shown to be directly responsible for two potentially harmful effects to the cell performance: a remarkable decrease of the mobility with increasing field and the accumulation of charge at the domains interface, which leads to recombination losses.

Determination of the density of surface states at the semiconductor-insulator interface in a metal-insulator-semiconductor structure

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gulyamov, G., E-mail: Gulyamov1949@rambler.ru; Sharibaev, N. U.

2011-02-15

The temporal dependence of thermal generation of electrons from occupied surface states at the semiconductor-insulator interface in a metal-insulator-semiconductor structure is studied. It is established that, at low temperatures, the derivative of the probability of depopulation of occupied surface states with respect to energy is represented by the Dirac {delta} function. It is shown that the density of states of a finite number of discrete energy levels under high-temperature measurements manifests itself as a continuous spectrum, whereas this spectrum appears discrete at low temperatures. A method for processing the continuous spectrum of the density of surface states is suggested thatmore » method makes it possible to determine the discrete energy spectrum. The obtained results may be conducive to an increase in resolution of the method of non-stationary spectroscopy of surface states.« less

Light-induced hysteresis and recovery behaviors in photochemically activated solution-processed metal-oxide thin-film transistors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jo, Jeong-Wan; Park, Sung Kyu, E-mail: yhkim76@skku.edu, E-mail: skpark@cau.ac.kr; Kim, Yong-Hoon, E-mail: yhkim76@skku.edu, E-mail: skpark@cau.ac.kr

2014-07-28

In this report, photo-induced hysteresis, threshold voltage (V{sub T}) shift, and recovery behaviors in photochemically activated solution-processed indium-gallium-zinc oxide (IGZO) thin-film transistors (TFTs) are investigated. It was observed that a white light illumination caused negative V{sub T} shift along with creation of clockwise hysteresis in electrical characteristics which can be attributed to photo-generated doubly ionized oxygen vacancies at the semiconductor/gate dielectric interface. More importantly, the photochemically activated IGZO TFTs showed much reduced overall V{sub T} shift compared to thermally annealed TFTs. Reduced number of donor-like interface states creation under light illumination and more facile neutralization of ionized oxygen vacancies bymore » electron capture under positive gate potential are claimed to be the origin of the less V{sub T} shift in photochemically activated TFTs.« less

Thermal Shock Damage and Microstructure Evolution of Thermal Barrier Coatings on Mar-M247 Superalloy in a Combustion Gas Environment

NASA Astrophysics Data System (ADS)

Mei, Hui

2012-06-01

The effect of preoxidation on the thermal shock of air plasma sprayed thermal barrier coatings (TBCs) was completely investigated in a combustion gas environment by burning jet fuel with high speed air. Results show that with increasing cycles, the as-oxidized TBCs lost more weight and enlarged larger spallation area than the as-sprayed ones. Thermally grown oxide (TGO) growth and thermal mismatch stress were proven to play critical roles on the as-oxidized TBC failure. Two types of significant cracks were identified: the type I crack was vertical to the TGO interface and the type II crack was parallel to the TGO interface. The former accelerated the TGO growth to develop the latter as long as the oxidizing gas continuously diffused inward and then oxidized the more bond coat (BC). The preoxidation treatment directly increased the TGO thickness, formed the parallel cracks earlier in the TGO during the thermal shocks, and eventually resulted in the worse thermal shock resistance.

Active Control of Interface Shape During the Crystal Growth of Lead Bromide

NASA Technical Reports Server (NTRS)

Duval, W. M. B.; Batur, C.; Singh, N. B.

2003-01-01

A thermal model for predicting and designing the furnace temperature profile was developed and used for the crystal growth of lead bromide. The model gives the ampoule temperature as a function of the furnace temperature, thermal conductivity, heat transfer coefficients, and ampoule dimensions as variable parameters. Crystal interface curvature was derived from the model and it was compared with the predicted curvature for a particular furnace temperature and growth parameters. Large crystals of lead bromide were grown and it was observed that interface shape was in agreement with the shape predicted by this model.

A Steady State and Quasi-Steady Interface Between the Generalized Fluid System Simulation Program and the SINDA/G Thermal Analysis Program

NASA Technical Reports Server (NTRS)

Schallhorn, Paul; Majumdar, Alok; Tiller, Bruce

2001-01-01

A general purpose, one dimensional fluid flow code is currently being interfaced with the thermal analysis program SINDA/G. The flow code, GFSSP, is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development is conducted in multiple phases. This paper describes the first phase of the interface which allows for steady and quasisteady (unsteady solid, steady fluid) conjugate heat transfer modeling.

A continuously growing web-based interface structure databank

NASA Astrophysics Data System (ADS)

Erwin, N. A.; Wang, E. I.; Osysko, A.; Warner, D. H.

2012-07-01

The macroscopic properties of materials can be significantly influenced by the presence of microscopic interfaces. The complexity of these interfaces coupled with the vast configurational space in which they reside has been a long-standing obstacle to the advancement of true bottom-up material behavior predictions. In this vein, atomistic simulations have proven to be a valuable tool for investigating interface behavior. However, before atomistic simulations can be utilized to model interface behavior, meaningful interface atomic structures must be generated. The generation of structures has historically been carried out disjointly by individual research groups, and thus, has constituted an overlap in effort across the broad research community. To address this overlap and to lower the barrier for new researchers to explore interface modeling, we introduce a web-based interface structure databank (www.isdb.cee.cornell.edu) where users can search, download and share interface structures. The databank is intended to grow via two mechanisms: (1) interface structure donations from individual research groups and (2) an automated structure generation algorithm which continuously creates equilibrium interface structures. In this paper, we describe the databank, the automated interface generation algorithm, and compare a subset of the autonomously generated structures to structures currently available in the literature. To date, the automated generation algorithm has been directed toward aluminum grain boundary structures, which can be compared with experimentally measured population densities of aluminum polycrystals.

Thermal cycling fatigue of organic thermal interface materials using a thermal-displacement measurement technique

NASA Astrophysics Data System (ADS)

Steill, Jason Scott

The long term reliability of polymer-based thermal interface materials (TIM) is essential for modern electronic packages which require robust thermal management. The challenge for today's materials scientists and engineers is to maximize the heat flow from integrated circuits through a TIM and out the heat sink. Thermal cycling of the electronic package and non-uniformity in the heat flux with respect to the plan area can lead to void formation and delamination which re-introduces inefficient heat transfer. Measurement and understanding at the nano-scale is essential for TIM development. Finding and documenting the evolution of the defects is dependent upon a full understanding of the thermal probes response to changing environmental conditions and the effects of probe usage. The response of the thermal-displacement measurement technique was dominated by changes to the environment. Accurate measurement of the thermal performance was hindered by the inability to create a model system and control the operating conditions. This research highlights the need for continued study into the probe's thermal and mechanical response using tightly controlled test conditions.

Development and optimization of a stove-powered thermoelectric generator

NASA Astrophysics Data System (ADS)

Mastbergen, Dan

Almost a third of the world's population still lacks access to electricity. Most of these people use biomass stoves for cooking which produce significant amounts of wasted thermal energy, but no electricity. Less than 1% of this energy in the form of electricity would be adequate for basic tasks such as lighting and communications. However, an affordable and reliable means of accomplishing this is currently nonexistent. The goal of this work is to develop a thermoelectric generator to convert a small amount of wasted heat into electricity. Although this concept has been around for decades, previous attempts have failed due to insufficient analysis of the system as a whole, leading to ineffective and costly designs. In this work, a complete design process is undertaken including concept generation, prototype testing, field testing, and redesign/optimization. Detailed component models are constructed and integrated to create a full system model. The model encompasses the stove operation, thermoelectric module, heat sinks, charging system and battery. A 3000 cycle endurance test was also conducted to evaluate the effects of operating temperature, module quality, and thermal interface quality on the generator's reliability, lifetime and cost effectiveness. The results from this testing are integrated into the system model to determine the lowest system cost in $/Watt over a five year period. Through this work the concept of a stove-based thermoelectric generator is shown to be technologically and economically feasible. In addition, a methodology is developed for optimizing the system for specific regional stove usage habits.

Tunable organization of cellulose nanocrystals for controlled thermal and optical response

NASA Astrophysics Data System (ADS)

Diaz A., Jairo A.

The biorenewable nature of cellulose nanocrystals (CNCs) has opened up new opportunities for cost-effective, sustainable materials design. By taking advantage of their distinctive structural properties and self-assembly, promising applications have started to nurture the fields of flexible electronics, biomaterials, and nanocomposites. CNCs exhibit two fundamental characteristics: rod-like morphology (5-20 nm wide, 50-500 nm long), and lyotropic behavior (i.e., liquid crystalline mesophases formed in solvents), which offer unique opportunities for structural control and fine tuning of thermal and optical properties based on a proper understanding of their individual behavior and interactions at different length scales. In the present work, we attempt to provide an integral description of the influence of single crystals in the thermal and optical response exhibited by nanostructured films. Our approach involved the connection of experimental evidence with predictions of molecular dynamics (MD) simulations. In order to assess the effect of CNC orientation in the bulk response, we produced cellulose nanostructured films under two different mechanisms, namely, self-organization and shear orientation. Self-organized nanostructured films exhibited the typical iridescent optical reflection generated by chiral nematic organization. Shear oriented films disrupted the cholesteric organization, generating highly aligned structures with high optical transparency. The resultant CNC organization present in all nanostructured films was estimated by a second order statistical orientational distribution based on two- dimensional XRD signals. A new method to determine the coefficient of thermal expansion (CTE) in a contact-free fashion was developed to properly characterize the thermal expansion of thin soft films by excluding other thermally activated phenomena. The method can be readily extended to other soft materials to accurately measure thermal strains in a non-destructive way. By evaluating the magnitude of film CTEs relative to those of individual CNC crystals, we highlighted the significant role played by crystalline interfaces. Likewise, after measuring the thermal conductivity of a single crystal and CNC films having multiple organizations, the interfacial thermal resistance arose as a governing factor for heat transport. We will offer further insights into the intricate connection of thermal and optical properties towards a future efficient manufacture and optimal CNC based-materials design.

Thermal characteristics of carbon fiber reinforced epoxy containing multi-walled carbon nanotubes

NASA Astrophysics Data System (ADS)

Lee, Jin-woo; Park, Soo-Jeong; Kim, Yun-hae; Riichi-Murakami

2018-06-01

The material with irregular atomic structures such as polymer material exhibits low thermal conductivity because of the complex structural properties. Even materials with same atomic configurations, thermal conductivity may be different based on their structural properties. It is expected that nanoparticles with conductivity will change non-conductive polymer base materials to electrical conductors, and improve the thermal conductivity even with extremely small filling amount. Nano-composite materials contain nanoparticles with a higher surface ratio which makes the higher interface percentage to the total surface of nanoparticles. Therefore, thermal resistance of the interface becomes a dominating factor determines the effective thermal conductivity in nano-composite materials. Carbon fiber has characteristic of resistance or magnetic induction and Also, Carbon nanotube (CNT) has electronic and thermal property. It can be applied for heating system. These characteristic are used as heating composite. In this research, the exothermic characteristics of Carbon fiber reinforced composite added CNT were evaluated depend on CNT length and particle size. It was found that the CNT dispersed in the resin reduces the resistance between the interfaces due to the decrease in the total resistance of the heating element due to the addition of CNTs. It is expected to improve the life and performance of the carbon fiber composite material as a result of the heating element resulting from this paper.

Space station common module thermal management: Design and construction of a test bed

NASA Technical Reports Server (NTRS)

Barile, R. G.

1986-01-01

In this project, a thermal test bed was designed, simulated, and planned for construction. The thermal system features interior and exterior thermal loads and interfacing with the central-radiator thermal bus. Components of the test bed include body mounted radiator loop with interface heat exchangers (600 Btu/hr); an internal loop with cabin air-conditioning and cold plates (3400 Btu/hr); interface heat exchangers to the central bus (13,000 Btu/hr); and provisions for new technology including advanced radiators, thermal storage, and refrigeration. The apparatus will be mounted in a chamber, heated with lamps, and tested in a vacuum chamber with LN2-cooled walls. Simulation of the test bed was accomplished using a DEC PRO 350 computer and the software package TK! olver. Key input variables were absorbed solar radiation and cold plate loads. The results indicate temperatures on the two loops will be nominal when the radiation and cold plate loads are in the range of 25% to 75% of peak loads. If all loads fall to zero, except the cabin air system which was fixed, the radiator fluid will drop below -100 F and may cause excessive pressure drop. If all loads reach 100%, the cabin air temperature could rise to 96 F.

Thermal Conductivity Changes Due to Degradation of Cathode Film Subjected to Charge-Discharge Cycles in a Li Ion Battery

NASA Astrophysics Data System (ADS)

Jagannadham, K.

2018-05-01

A battery device with graphene platelets as anode, lithium nickel manganese oxide as cathode, and solid-state electrolyte consisting of layers of lithium phosphorous oxynitride and lithium lanthanum titanate is assembled on the stainless steel substrate. The battery in a polymer enclosure is subjected to several electrical tests consisting of charge and discharge cycles at different current and voltage levels. Thermal conductivity of the cathode layer is determined at the end of charge-discharge cycles using transient thermoreflectance. The microstructure and composition of the cathode layer and the interface between the cathode, the anode, and the electrolyte are characterized using scanning electron microscopy and elemental mapping. The decrease in the thermal conductivity of the same cathode observed after each set of electrical test cycles is correlated with the volume changes and formation of low ionic and thermal conductivity lithium oxide and lithium oxychloride at the interface and along porous regions. The interface between the metal current collector and the cathode is also found to be responsible for the increase in thermal resistance. The results indicate that changes in the thermal conductivity of the electrodes provide a measure of the resistance to heat transfer and degradation of ionic transport in the cathode accompanying the charge-discharge cycles in the batteries.

Measuring the thermal boundary resistance of van der Waals contacts using an individual carbon nanotube.

PubMed

Hirotani, Jun; Ikuta, Tatsuya; Nishiyama, Takashi; Takahashi, Koji

2013-01-16

Interfacial thermal transport via van der Waals interaction is quantitatively evaluated using an individual multi-walled carbon nanotube bonded on a platinum hot-film sensor. The thermal boundary resistance per unit contact area was obtained at the interface between the closed end or sidewall of the nanotube and platinum, gold, or a silicon dioxide surface. When taking into consideration the surface roughness, the thermal boundary resistance at the sidewall is found to coincide with that at the closed end. A new finding is that the thermal boundary resistance between a carbon nanotube and a solid surface is independent of the materials within the experimental errors, which is inconsistent with a traditional phonon mismatch model, which shows a clear material dependence of the thermal boundary resistance. Our data indicate the inapplicability of existing phonon models when weak van der Waals forces are dominant at the interfaces.

Reduction of thermal conductivity in MnSi{sub 1.7} multi-layered thin films with artificially inserted Si interfaces

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kurosaki, Y., E-mail: yosuke.kurosaki.uy@hitachi.com; Yabuuchi, S.; Nishide, A.

We report a lowered lattice thermal conductivity in nm-scale MnSi{sub 1.7}/Si multilayers which were fabricated by controlling thermal diffusions of Mn and Si atoms. The thickness of the constituent layers is 1.5–5.0 nm, which is comparable to the phonon mean free path of both MnSi{sub 1.7} and Si. By applying the above nanostructures, we reduced the lattice thermal conductivity down to half that of bulk MnSi{sub 1.7}/Si composite materials. The obtained value of 1.0 W/K m is the experimentally observed minimum in MnSi{sub 1.7}-based materials without any heavy element doping and close to the minimum thermal conductivity. We attribute the reduced latticemore » thermal conductivity to phonon scattering at the MnSi{sub 1.7}/Si interfaces in the multilayers.« less

Explosive decomposition of hydrazine by rapid compression of a gas volume

NASA Technical Reports Server (NTRS)

Bunker, R. L.; Baker, D. L.; Lee, J. H. S.

1991-01-01

In the present investigation of the initiation mechanism and the explosion mode of hydrazine decomposition, a 20 cm-long column of liquid hydrazine was accelerated into a column of gaseous nitrogen, from which it was separated by a thin Teflon diaphragm, in a close-ended cylindrical chamber. Video data obtained reveal the formation of a froth generated by the acceleration of hydrazine into nitrogen at the liquid hydrazine-gaseous nitrogen interface. The explosive hydrazine decomposition had as its initiation mechanism the formation of a froth at a critical temperature; the explosion mode of hydrazine is a confined thermal runaway reaction.

Local conductivity enhancement due to the tetragonal domain structure in LaAlO3- SrTiO3 heterointerfaces

NASA Astrophysics Data System (ADS)

Moler, Kathryn

2014-03-01

Progress in the difficult task of growing oxide heterostructures has enabled the field of oxide interface engineering. The ability to control materials properties through interface engineering is demonstrated by the appearance of conductivity at the interface of certain insulators, most famously the {001}interface of the band insulators LaAlO3 (LAO) and TiO2-terminated SrTiO3 (STO). The prevailing explanation of conduction at the interface is electronic reconstruction due to a `polar catastrophe' in which charge migrates from the top LAO layer to the interface. Transport and other measurements in this system display a plethora of diverse physical phenomena. To better understand the interface conductivity, we used scanning superconducting quantum interference device (SQUID) microscopy to image the magnetic field locally generated by current in an interface. At low temperature, we found that the current flowed in conductive narrow paths oriented along the crystallographic axes, embedded in a less conductive background. The configuration of these paths changed upon thermal cycling above the STO cubic to tetragonal structural transition temperature, implying that the local conductivity is strongly modified by the STO tetragonal domain structure. In this talk, I will summarize these results and also report on measurements of conductivity and diamagnetism in related materials that firmly establish the influence of the STO tetragonal domains on electronic properties. Coauthors C. Bell, H.K. Sato, M. Hosoda, Y. Xie, Y. Hikita, & H.Y. Hwang (SIMES); R. Jany & C. Richter (Augsburg); C. Woltmann, G. Pfanzelt, & J. Mannhart (MP Stuttgart); B. Kalisky, E.M. Spanton, H. Noad, K.C. Nowack, A. Rosenberg, & J.R. Kirtley.

Using high pressure to study thermal transport and phonon scattering mechanisms

NASA Astrophysics Data System (ADS)

Hohensee, Gregory Thomas

The aerospace industry studies nanocomposites for heat dissipation and moderation of thermal expansion, and the semiconductor industry faces a Joule heating barrier in devices with high power density. My primary experimental tools are the diamond anvil cell (DAC) coupled with time-domain thermoreflectance (TDTR). TDTR is a precise optical method well-suited to measuring thermal conductivities and conductances at the nanoscale and across interfaces. The DAC-TDTR method yields thermal property data as a function of pressure, rather than temperature. This relatively unexplored independent variable can separate the components of thermal conductance and serve as an independent test for phonon-defect scattering models. I studied the effect of non-equilibrium thermal transport at the aluminum-coated surface of an exotic cuprate material Ca9La5Cu 24O41, which boasts a tenfold enhanced thermal conductivity along one crystalline axis where two-leg copper-oxygen spin-ladder structures carry heat in the form of thermalized magnetic excitations. Highly anisotropic materials are of interest for controlled thermal management applications, and the spin-ladder magnetic heat carriers ("magnons") are not well understood. I found that below room temperature, the apparent thermal conductivity of Ca9La5Cu24O41 depends on the frequency of the applied surface heating in TDTR. This occurs because the thermal penetration depth in the TDTR experiment is comparable to the length-scale for the equilibration of the magnons that are the dominant channel for heat conduction and the phonons that dominate the heat capacity. I applied a two-temperature model to analyze the TDTR data and extracted an effective volumetric magnon-phonon coupling parameter g for Ca9La5Cu24O 41 at temperatures from 75 K to 300 K; g varies by approximately two orders of magnitude over this range of temperature and has the value g = 1015 W m-3 K-1 near the peak of the thermal conductivity at T ≈ 180 K. To examine intrinsic phonon-mediated interface conductance between dissimilar materials, I applied DAC-TDTR to measure the thermal conductance of a series of metal-diamond interfaces as a function of pressure up to 50 GPa. The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two phonon-processes, and the nature of heat transport between such dissimilar materials is central to the thermal design of composite materials. The high pressures achievable in a diamond anvil cell can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. I measured the interface thermal conductances of Pb, Au0.95Pd0.05, Pt, and Al films deposited on Type 1A natural [100] and Type 2A synthetic [110] diamond anvils, from ambient pressure to 50 GPa. In all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. My results suggest that anharmonic conductance at metal-diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon. The thermal conductivity and absolute electrical resistivity of metallic silicon have not been measured previously. I performed regular and beam-offset TDTR to establish the thermal conductivities of Si and Si0.991Ge 0.009 across the semiconductor-metal phase transition and up to 45 GPa. The thermal conductivities of metallic Si and Si(Ge) are comparable to aluminum and indicative of predominantly electronic heat carriers. Metallic Si and Si(Ge) have a transport anisotropy of approximately 1.4, similar to that of beryllium, due to the primitive hexagonal crystal structure. I used the Wiedemann-Franz law to derive the associated electrical resistivity, and found it consistent with the Bloch-Gruneisen model. Not all crystalline point defects are alike in how they scatter phonons and reduce the thermal conductivity of mixed crystals. Heat-carrying phonons in iron (Fe) doped MgO, or [Mg,Fe]O ferropericlase, are known to be resonantly scattered by interaction with a 3.3 THz electronic transition in the high-spin state of the Fe impurities. At sufficiently high pressures, the Fe atoms transition from a high-spin to a low-spin state, which eliminates the resonant interaction and reduces the Fe atoms to simpler point defect phonon scatterers. To study the behavior of phonon-defect scattering with and without this resonant scattering process, I measured the thermal conductivity of Mg0.92Fe0.08 O ferropericlase up to and above the 40--60 GPa spin transition. Fe-doped MgO (ferropericlase) is also a model system relevant to geophysical modeling of the Earth's core-mantle boundary, so data on its thermal transport under pressure is valuable in itself. (Abstract shortened by UMI.).

Hall Thruster Thermal Modeling and Test Data Correlation

NASA Technical Reports Server (NTRS)

Myers, James

2016-01-01

HERMeS - Hall Effect Rocket with Magnetic Shielding. Developed through a joint effort by NASA/GRC and the Jet Propulsion Laboratory (JPL). Design goals: High power (12.5 kW) high Isp (3000 sec), high efficiency (> 60%), high throughput (10,000 kg), reduced plasma erosion and increased life (5 yrs) to support Asteroid Redirect Robotic Mission (ARRM). Further details see "Performance, Facility Pressure Effects and Stability Characterization Tests of NASAs HERMeS Thruster" by H. Kamhawi and team. Hall Thrusters (HT) inherently operate at elevated temperatures approx. 600 C (or more). Due to electric magnetic (E x B) fields used to ionize and accelerate propellant gas particles (i.e., plasma). Cooling is largely limited to radiation in vacuum environment.Thus the hardware components must withstand large start-up delta-T's. HT's are constructed of multiple materials; assorted metals, non-metals and ceramics for their required electrical and magnetic properties. To mitigate thermal stresses HT design must accommodate the differential thermal growth from a wide range of material Coef. of Thermal Expansion (CTEs). Prohibiting the use of some bolted/torqued interfaces.Commonly use spring loaded interfaces, particularly at the metal-to-ceramic interfaces to allow for slippage.However most component interfaces must also effectively conduct heat to the external surfaces for dissipation by radiation.Thus contact pressure and area are important.

Development of Cross Section Library and Application Programming Interface (API)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, C. H.; Marin-Lafleche, A.; Smith, M. A.

2014-04-09

The goal of NEAMS neutronics is to develop a high-fidelity deterministic neutron transport code termed PROTEUS for use on all reactor types of interest, but focused primarily on sodium-cooled fast reactors. While PROTEUS-SN has demonstrated good accuracy for homogeneous fast reactor problems and partially heterogeneous fast reactor problems, the simulation results were not satisfactory when applied on fully heterogeneous thermal problems like the Advanced Test Reactor (ATR). This is mainly attributed to the quality of cross section data for heterogeneous geometries since the conventional cross section generation approach does not work accurately for such irregular and complex geometries. Therefore, onemore » of the NEAMS neutronics tasks since FY12 has been the development of a procedure to generate appropriate cross sections for a heterogeneous geometry core.« less

Comparing the Richtmyer-Meshkov instability of thermal and ion-species interfaces in two-fluid plasmas

NASA Astrophysics Data System (ADS)

Wheatley, Vincent; Bond, Daryl; Li, Yuan; Samtaney, Ravi; Pullin, Dale

2017-11-01

The Richtmyer-Meshkov instability (RMI) of a shock accelerated perturbed density interface is important in both inertial confinement fusion and astrophysics, where the materials involved are typically in the plasma state. Initial density interfaces can be due to either temperature or ion-species discontinuities. If the Atwood number of the interfaces and specific heat ratios of the fluids are matched, these two cases behave similarly when modeled using the equations of either hydrodynamics or magnetohydrodynamics. In the two-fluid ion-electron plasma model, however, there is a significant difference between them: In the thermal interface case, there is a discontinuity in electron density that is also subject to the RMI, while for the ion-species interface case there is not. It will be shown via ideal two-fluid plasma simulations that this causes substantial differences in the dynamics of the flow between the two cases. This work was partially supported by the KAUST Office of Sponsored Research under Award URF/1/2162-01.

Instrument interface description for NOAA 2000 instruments with European morning spacecraft and/or NOAA-OPQ spacecraft

NASA Technical Reports Server (NTRS)

1993-01-01

The purpose is to describe at a high level the common interface provisions and constraints placed on the NOAA-2000 instruments and the interfacing spacecraft elements in the following areas: electrical interface, mechanical interface, thermal interface, magnetic interface, electromagnetic compatibility, structural/mechanical environmental interface, contamination control, and the ionizing radiation environment. The requirements reflect the fact that these instruments must be compatible with a number of different polar orbiting satellite vehicles including the NOAA-OPQ satellites and the EUMETSAT METOP satellites.

International interface design for Space Station Freedom - Challenges and solutions

NASA Technical Reports Server (NTRS)

Mayo, Richard E.; Bolton, Gordon R.; Laurini, Daniele

1988-01-01

The definition of interfaces for the International Space Station is discussed, with a focus on negotiations between NASA and ESA. The program organization and division of responsibilities for the Space Station are outlined; the basic features of physical and functional interfaces are described; and particular attention is given to the interface management and documentation procedures, architectural control elements, interface implementation and verification, and examples of Columbus interface solutions (including mechanical, ECLSS, thermal-control, electrical, data-management, standardized user, and software interfaces). Diagrams, drawings, graphs, and tables listing interface types are provided.

Abundance and Temperature Dependency of Protein-Protein Interaction Revealed by Interface Structure Analysis and Stability Evolution

PubMed Central

He, Yi-Ming; Ma, Bin-Guang

2016-01-01

Protein complexes are major forms of protein-protein interactions and implement essential biological functions. The subunit interface in a protein complex is related to its thermostability. Though the roles of interface properties in thermal adaptation have been investigated for protein complexes, the relationship between the interface size and the expression level of the subunits remains unknown. In the present work, we studied this relationship and found a positive correlation in thermophiles rather than mesophiles. Moreover, we found that the protein interaction strength in complexes is not only temperature-dependent but also abundance-dependent. The underlying mechanism for the observed correlation was explored by simulating the evolution of protein interface stability, which highlights the avoidance of misinteraction. Our findings make more complete the picture of the mechanisms for protein complex thermal adaptation and provide new insights into the principles of protein-protein interactions. PMID:27220911

Abundance and Temperature Dependency of Protein-Protein Interaction Revealed by Interface Structure Analysis and Stability Evolution

NASA Astrophysics Data System (ADS)

He, Yi-Ming; Ma, Bin-Guang

2016-05-01

Protein complexes are major forms of protein-protein interactions and implement essential biological functions. The subunit interface in a protein complex is related to its thermostability. Though the roles of interface properties in thermal adaptation have been investigated for protein complexes, the relationship between the interface size and the expression level of the subunits remains unknown. In the present work, we studied this relationship and found a positive correlation in thermophiles rather than mesophiles. Moreover, we found that the protein interaction strength in complexes is not only temperature-dependent but also abundance-dependent. The underlying mechanism for the observed correlation was explored by simulating the evolution of protein interface stability, which highlights the avoidance of misinteraction. Our findings make more complete the picture of the mechanisms for protein complex thermal adaptation and provide new insights into the principles of protein-protein interactions.

Dynamics of Defects and Dopants in Complex Systems: Si and Oxide Surfaces and Interfaces

NASA Astrophysics Data System (ADS)

Kirichenko, Taras; Yu, Decai; Banarjee, Sanjay; Hwang, Gyeong

2004-10-01

Fabrication of forthcoming nanometer scale electronic devices faces many difficulties including formation of extremely shallow and highly doped junctions. At present, ultra-low-energy ion implantation followed by high-temperature thermal annealing is most widely used to fabricate such ultra-shallow junctions. In the process, a great challenge lies in achieving precise control of redistribution and electrical activation of dopant impurities. Native defects (such as vacancies and interstitials) generated during implantation are known to be mainly responsible for the TED and also influence significantly the electrical activation/deactivation. Defect-dopant dynamics is rather well understood in crystalline Si and SiO2. However, little is known about their diffusion and annihilation (or precipitation) at the surfaces and interfaces, despite its growing importance in determining junction profiles as device dimensions get smaller. In this talk, we will present our density functional theory calculation results on the atomic and electronic structure and dynamical behavior of native defects and dopant-defect complexes in disordered/strained Si and oxide systems, such as i) clean and absorbent-modified Si(100) surface and subsurface layers, ii) amorphous-crystalline Si interfaces and iii) amorphous SiO2/Si interfaces. The fundamental understanding and data is essential in developing a comprehensive kinetic model for junction formation, which would contribute greatly in improving current process technologies.

SAGE III on ISS Lessons Learned on Thermal Interface Design

NASA Technical Reports Server (NTRS)

Davis, Warren

2015-01-01

The Stratospheric Aerosol and Gas Experiment III (SAGE III) instrument - the fifth in a series of instruments developed for monitoring vertical distribution of aerosols, ozone, and other trace gases in the Earth's stratosphere and troposphere - is currently scheduled for delivery to the International Space Station (ISS) via the SpaceX Dragon vehicle in 2016. The Instrument Adapter Module (IAM), one of many SAGE III subsystems, continuously dissipates a considerable amount of thermal energy during mission operations. Although a portion of this energy is transferred via its large radiator surface area, the majority must be conductively transferred to the ExPRESS Payload Adapter (ExPA) to satisfy thermal mitigation requirements. The baseline IAM-ExPA mechanical interface did not afford the thermal conductance necessary to prevent the IAM from overheating in hot on-orbit cases, and high interfacial conductance was difficult to achieve given the large span between mechanical fasteners, less than stringent flatness specifications, and material usage constraints due to strict contamination requirements. This paper will examine the evolution of the IAM-ExPA thermal interface over the course of three design iterations and will include discussion on design challenges, material selection, testing successes and failures, and lessons learned.

Ultracompliant Heterogeneous Copper-Tin Nanowire Arrays Making a Supersolder.

PubMed

Gong, Wei; Li, Pengfei; Zhang, Yunheng; Feng, Xuhui; Major, Joshua; DeVoto, Douglas; Paret, Paul; King, Charles; Narumanchi, Sreekant; Shen, Sheng

2018-06-13

Due to the substantial increase in power density, thermal interface resistance that can constitute more than 50% of the total thermal resistance has generally become a bottleneck for thermal management in electronics. However, conventional thermal interface materials (TIMs) such as solder, epoxy, gel, and grease cannot fulfill the requirements of electronics for high-power and long-term operation. Here, we demonstrate a high-performance TIM consisting of a heterogeneous copper-tin nanowire array, which we term "supersolder" to emulate the role of conventional solders in bonding various surfaces. The supersolder is ultracompliant with a shear modulus 2-3 orders of magnitude lower than traditional solders and can reduce the thermal resistance by two times as compared with the state-of-the-art TIMs. This supersolder also exhibits excellent long-term reliability with >1200 thermal cycles over a wide temperature range. By resolving this critical thermal bottleneck, the supersolder enables electronic systems, ranging from microelectronics and portable electronics to massive data centers, to operate at lower temperatures with higher power density and reliability.

The effect of filler parameters on the healing of thermal conductivity and mechanical properties of a thermal interface material based on a self-healable organic-inorganic polymer matrix

NASA Astrophysics Data System (ADS)

Zhong, Nan; Garcia, Santiago J.; van der Zwaag, Sybrand

2016-08-01

Thermal interface materials (TIMs) are widely used in all kinds of electronic devices to handle the heat dissipation and the mechanical anchoring of the heat producing component. The aging of TIMs may lead to delamination and internal crack formation causing a loss of heat transfer and mechanical integrity both leading to premature device failure. In the present work, a novel TIM system based on a self-healing organic-inorganic polymer matrix filled with spherical glass beads is presented which is capable of healing both the thermal conductivity and the mechanical properties upon thermal activation. The effect of particle volume concentration (PVC) and particle size on tensile strength and thermal conductivity healing behavior is investigated. The results show that a higher PVC increases the mechanical property but decreases mechanical healing. For the same PVC, bigger particles lead to lower mechanical properties but higher thermal conductivities and higher mechanical healing efficiencies.

Reduction in thermal conductivity and tunable heat capacity of inorganic/organic hybrid superlattices

NASA Astrophysics Data System (ADS)

Giri, Ashutosh; Niemelä, Janne-Petteri; Szwejkowski, Chester J.; Karppinen, Maarit; Hopkins, Patrick E.

2016-01-01

We study the influence of molecular monolayers on the thermal conductivities and heat capacities of hybrid inorganic/organic superlattice thin films fabricated via atomic/molecular layer deposition. We measure the cross plane thermal conductivities and volumetric heat capacities of TiO2- and ZnO-based superlattices with periodic inclusion of hydroquinone layers via time domain thermoreflectance. In comparison to their homogeneous counterparts, the thermal conductivities in these superlattice films are considerably reduced. We attribute this reduction in the thermal conductivity mainly due to incoherent phonon boundary scattering at the inorganic/organic interface. Increasing the inorganic/organic interface density reduces the thermal conductivity and heat capacity of these films. High-temperature annealing treatment of the superlattices results in a change in the orientation of the hydroquinone molecules to a 2D graphitic layer along with a change in the overall density of the hybrid superlattice. The thermal conductivity of the hybrid superlattice increases after annealing, which we attribute to an increase in crystallinity.

Thermal Fatigue and Fracture Behavior of Ceramic Thermal Barrier Coatings

NASA Technical Reports Server (NTRS)

Zhu, Dong-Ming; Choi, Sung R.; Miller, Robert A.

2001-01-01

Thermal fatigue and fracture behavior of plasma-sprayed ceramic thermal barrier coatings has been investigated under high heat flux and thermal cyclic conditions. The coating crack propagation is studied under laser heat flux cyclic thermal loading, and is correlated with dynamic fatigue and strength test results. The coating stress response and inelasticity, fatigue and creep interactions, and interface damage mechanisms during dynamic thermal fatigue processes are emphasized.

Photovoltaic Performance and Interface Behaviors of Cu(In,Ga)Se2 Solar Cells with a Sputtered-Zn(O,S) Buffer Layer by High-Temperature Annealing.

PubMed

Wi, Jae-Hyung; Kim, Tae Gun; Kim, Jeong Won; Lee, Woo-Jung; Cho, Dae-Hyung; Han, Won Seok; Chung, Yong-Duck

2015-08-12

We selected a sputtered-Zn(O,S) film as a buffer material and fabricated a Cu(In,Ga)Se2 (CIGS) solar cell for use in monolithic tandem solar cells. A thermally stable buffer layer was required because it should withstand heat treatment during processing of top cell. Postannealing treatment was performed on a CIGS solar cell in vacuum at temperatures from 300-500 °C to examine its thermal stability. Serious device degradation particularly in VOC was observed, which was due to the diffusion of thermally activated constituent elements. The elements In and Ga tend to out-diffuse to the top surface of the CIGS, while Zn diffuses into the interface of Zn(O,S)/CIGS. Such rearrangement of atomic fractions modifies the local energy band gap and band alignment at the interface. The notch-shape induced at the interface after postannealing could function as an electrical trap during electron transport, which would result in the reduction of solar cell efficiency.

The impact of the Fermi-Dirac distribution on charge injection at metal/organic interfaces.

PubMed

Wang, Z B; Helander, M G; Greiner, M T; Lu, Z H

2010-05-07

The Fermi level has historically been assumed to be the only energy-level from which carriers are injected at metal/semiconductor interfaces. In traditional semiconductor device physics, this approximation is reasonable as the thermal distribution of delocalized states in the semiconductor tends to dominate device characteristics. However, in the case of organic semiconductors the weak intermolecular interactions results in highly localized electronic states, such that the thermal distribution of carriers in the metal may also influence device characteristics. In this work we demonstrate that the Fermi-Dirac distribution of carriers in the metal has a much more significant impact on charge injection at metal/organic interfaces than has previously been assumed. An injection model which includes the effect of the Fermi-Dirac electron distribution was proposed. This model has been tested against experimental data and was found to provide a better physical description of charge injection. This finding indicates that the thermal distribution of electronic states in the metal should, in general, be considered in the study of metal/organic interfaces.

Silicon Cations Intermixed Indium Zinc Oxide Interface for High-Performance Thin-Film Transistors Using a Solution Process.

PubMed

Na, Jae Won; Rim, You Seung; Kim, Hee Jun; Lee, Jin Hyeok; Hong, Seonghwan; Kim, Hyun Jae

2017-09-06

Solution-processed amorphous metal-oxide thin-film transistors (TFTs) utilizing an intermixed interface between a metal-oxide semiconductor and a dielectric layer are proposed. In-depth physical characterizations are carried out to verify the existence of the intermixed interface that is inevitably formed by interdiffusion of cations originated from a thermal process. In particular, when indium zinc oxide (IZO) semiconductor and silicon dioxide (SiO 2 ) dielectric layer are in contact and thermally processed, a Si 4+ intermixed IZO (Si/IZO) interface is created. On the basis of this concept, a high-performance Si/IZO TFT having both a field-effect mobility exceeding 10 cm 2 V -1 s -1 and a on/off current ratio over 10 7 is successfully demonstrated.

Interfacing a General Purpose Fluid Network Flow Program with the SINDA/G Thermal Analysis Program

NASA Technical Reports Server (NTRS)

Schallhorn, Paul; Popok, Daniel

1999-01-01

A general purpose, one dimensional fluid flow code is currently being interfaced with the thermal analysis program Systems Improved Numerical Differencing Analyzer/Gaski (SINDA/G). The flow code, Generalized Fluid System Simulation Program (GFSSP), is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development is conducted in multiple phases. This paper describes the first phase of the interface which allows for steady and quasi-steady (unsteady solid, steady fluid) conjugate heat transfer modeling.

Optimized Heat Pipe Backup Cooling System Tested with a Stirling Convertor

NASA Technical Reports Server (NTRS)

Tarau, Calin; Schwendeman, Carl L.; Schifer, Nicholas A.; Anderson, William G.

2016-01-01

Advanced Stirling Radioisotope Generator (ASRG) is an attractive energy system for select space missions, and with the addition of a VCHP, it becomes even more versatile. The ASRG is powered through thermal energy from decaying radioisotopes acting as General Purpose Heat Sources (GPHS). A Stirling engine converts the thermal energy to electrical energy and cools the GPHS [2]. The Stirling convertor must operate continuously to maintain acceptable temperatures of the GPHS and protect their cladding. The addition of alkali metal VCHP allows the Stirling to cycle on and off during a mission and can be used as a backup cooling system. The benefits of being able to turn the Stirling off are: allowing for a restart of the Stirling and reducing vibrations for sensitive measurements. The VCHP addition should also increase the efficiency of the Stirling by providing a uniform temperature distribution at the heat transfer interface into the heater head.

Solution-processed soldering of carbon nanotubes for flexible electronics.

PubMed

Rao, K D M; Radha, B; Smith, K C; Fisher, T S; Kulkarni, G U

2013-02-22

We report a simple lithography-free, solution-based method of soldering of carbon nanotubes with Ohmic contacts, by taking specific examples of multi-walled carbon nanotubes (MWNTs). This is achieved by self-assembling a monolayer of soldering precursor, Pd(2+) anchored to 1,10 decanedithiol, onto which MWNTs could be aligned across the gap electrodes via solvent evaporation. The nanosoldering was realized by thermal/electrical activation or by both in sequence. Electrical activation and the following step of washing ensure selective retention of MWNTs spanning across the gap electrodes. The soldered joints were robust enough to sustain strain caused during the bending of flexible substrates as well as during ultrasonication. The estimated temperature generated at the MWNT-Au interface using an electro-thermal model is ∼150 °C, suggesting Joule heating as the primary mechanism of electrical activation. Further, the specific contact resistance is estimated from the transmission line model.

Nano Enabled Thermo-Mechanical Materials in Adhesive Joints: A New Paradigm to Materials Functionality (Preprint)

DTIC Science & Technology

2006-12-01

interface as well as to minimize the interface contact resistance. There is an on- going effort by numerous researchers of dispersing conductive nano...constituents (single wall carbon nanotube (SWCNT), multi wall carbon nano tube ( MWCNT )) in polymers (adhesive) to enhance its thermal conductivity [1...propose to use vertically aligned MWCNT in joints to enhance through-thickness conductivity [10] because of its known high thermal conductivity

Parametric study of thin film evaporation from nanoporous membranes

NASA Astrophysics Data System (ADS)

Wilke, Kyle L.; Barabadi, Banafsheh; Lu, Zhengmao; Zhang, TieJun; Wang, Evelyn N.

2017-10-01

The performance and lifetime of advanced electronics are often dictated by the ability to dissipate heat generated within the device. Thin film evaporation from nanoporous membranes is a promising thermal management approach, which reduces the thermal transport distance across the liquid film while also providing passive capillary pumping of liquid to the evaporating interface. In this work, we investigated the dependence of thin film evaporation from nanoporous membranes on a variety of geometric parameters. Anodic aluminum oxide membranes were used as experimental templates, where pore radii of 28-75 nm, porosities of 0.1-0.35, and meniscus locations down to 1 μm within the pore were tested. We demonstrated different heat transfer regimes and observed more than an order of magnitude increase in dissipated heat flux by operating in the pore-level evaporation regime. The pore diameter had little effect on pore-level evaporation performance due to the negligible conduction resistance from the pore wall to the evaporating interface. The dissipated heat flux scaled with porosity as the evaporative area increased. Furthermore, moving the meniscus as little as 1 μm into the pore decreased the dissipated heat flux by more than a factor of two due to the added resistance to vapor escaping the pore. The experimental results elucidate thin film evaporation from nanopores and confirm findings of recent modeling efforts. This work also provides guidance for the design of future thin film evaporation devices for advanced thermal management. Furthermore, evaporation from nanopores is relevant to water purification, chemical separations, microfluidics, and natural processes such as transpiration.

77 FR 48514 - Certain New Chemicals; Receipt and Status Information

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-14

... emission; Use as an additive for electromagnetic interface (EMI) shielding; Use as a pigment; use as a... additive for heat transfer and thermal emission; Use as an additive for electromagnetic interface (EMI... electromagnetic interface (EMI) shielding; Use as a pigment; Use as a functional additive in composites and paints...

Thermal boundary conductance of hydrophilic and hydrophobic ionic liquids

NASA Astrophysics Data System (ADS)

Oyake, Takafumi; Sakata, Masanori; Yada, Susumu; Shiomi, Junichiro

2015-03-01

A solid/liquid interface plays a critical role for understanding mechanisms of biological and physical science. Moreover, carrier density of the surface is dramatically enhanced by electric double layer with ionic liquid, salt in the liquid state. Here, we have measured the thermal boundary conductance (TBC) across an interface of gold thin film and ionic liquid by using time-domain thermoreflectance technique. Following the prior researches, we have identified the TBC of two interfaces. One is gold and hydrophilic ionic liquid, N,N-Diethyl-N-methyl-N-(2-methoxyethyl) ammonium tetrafluoroborate (DEME-BF4), which is a hydrophilic ionic liquid, and the other is N,N-Diethyl-N-methyl-N-(2-methoxyethyl) ammonium bis (trifluoromethanesulfonyl) imide (DEME-TFSI), which is a hydrophobic ionic liquid. We found that the TBC between gold and DEME-TFIS (19 MWm-2K-1) is surprisingly lower than the interface between gold and DEME-BF4 (45 MWm-2K-1). With these data, the importance of the wetting angle and ion concentration for the thermal transport at the solid/ionic liquid interface is discussed. Part of this work is financially supported by Japan Society for the Promotion of Science (JSPS) and Japan Science and Technology Agency. The author is financially supported by JSPS Fellowship.

Development of an integrated thermal-hydraulics capability incorporating RELAP5 and PANTHER neutronics code

DOE Office of Scientific and Technical Information (OSTI.GOV)

Page, R.; Jones, J.R.

1997-07-01

Ensuring that safety analysis needs are met in the future is likely to lead to the development of new codes and the further development of existing codes. It is therefore advantageous to define standards for data interfaces and to develop software interfacing techniques which can readily accommodate changes when they are made. Defining interface standards is beneficial but is necessarily restricted in application if future requirements are not known in detail. Code interfacing methods are of particular relevance with the move towards automatic grid frequency response operation where the integration of plant dynamic, core follow and fault study calculation toolsmore » is considered advantageous. This paper describes the background and features of a new code TALINK (Transient Analysis code LINKage program) used to provide a flexible interface to link the RELAP5 thermal hydraulics code with the PANTHER neutron kinetics and the SIBDYM whole plant dynamic modelling codes used by Nuclear Electric. The complete package enables the codes to be executed in parallel and provides an integrated whole plant thermal-hydraulics and neutron kinetics model. In addition the paper discusses the capabilities and pedigree of the component codes used to form the integrated transient analysis package and the details of the calculation of a postulated Sizewell `B` Loss of offsite power fault transient.« less

Improvement and evaluation of thermal, electrical, sealing and mechanical contacts, and their interface materials

NASA Astrophysics Data System (ADS)

Luo, Xiangcheng

Material contacts, including thermal, electrical, seating (fluid sealing and electromagnetic sealing) and mechanical (pressure) contacts, together with their interface materials, were, evaluated, and in some cases, improved beyond the state of the art. The evaluation involved the use of thermal, electrical and mechanical methods. For thermal contacts, this work evaluated and improved the heat transfer efficiency between two contacting components by developing various thermal interface pastes. Sodium silicate based thermal pastes (with boron nitride particles as the thermally conductive filler) as well as polyethylene glycol (PEG) based thermal pastes were developed and evaluated. The optimum volume fractions of BN in sodium silicate based pastes and PEG based pastes were 16% and 18% respectively. The contribution of Li+ ions to the thermal contact conductance in the PEG-based paste was confirmed. For electrical contacts, the relationship between the mechanical reliability and electrical reliability of solder/copper and silver-epoxy/copper joints was addressed. Mechanical pull-out testing was conducted on solder/copper and silver-epoxy/copper joints, while the contact electrical resistivity was measured. Cleansing of the copper surface was more effective for the reliability of silver-epoxy/copper joint than that of solder/copper joint. For sealing contacts, this work evaluated flexible graphite as an electromagnetic shielding gasket material. Flexible graphite was found to be at least comparable to conductive filled silicone (the state of the art) in terms of the shielding effectiveness. The conformability of flexible graphite with its mating metal surface under repeated compression was characterized by monitoring the contact electrical resistance, as the conformability is important to both electromagnetic scaling and fluid waling using flexible graphite. For mechanical contacts, this work focused on the correlation of the interface structure (such as elastic/plastic deformation, oxidation, strain hardening, passive layer damage, fracture, etc.) with the electrical contact resistance, which was measured in real time for contacts under dynamic compression, thus allowing both reversible and irreversible changes to be observed. The materials studied included metals (carbon steel, stainless steel, aluminum and copper), carbon fiber reinforced polymer-matrix composite (nylon-6), ceramic (mortar) and graphite, due to their relevance to fastening, concrete structures, electric brushes and electrical pressure contacts.

Oxidation kinetics of Si and SiGe by dry rapid thermal oxidation, in-situ steam generation oxidation and dry furnace oxidation

NASA Astrophysics Data System (ADS)

Rozé, Fabien; Gourhant, Olivier; Blanquet, Elisabeth; Bertin, François; Juhel, Marc; Abbate, Francesco; Pribat, Clément; Duru, Romain

2017-06-01

The fabrication of ultrathin compressively strained SiGe-On-Insulator layers by the condensation technique is likely a key milestone towards low-power and high performances FD-SOI logic devices. However, the SiGe condensation technique still requires challenges to be solved for an optimized use in an industrial environment. SiGe oxidation kinetics, upon which the condensation technique is founded, has still not reached a consensus in spite of various studies which gave insights into the matter. This paper aims to bridge the gaps between these studies by covering various oxidation processes relevant to today's technological needs with a new and quantitative analysis methodology. We thus address oxidation kinetics of SiGe with three Ge concentrations (0%, 10%, and 30%) by means of dry rapid thermal oxidation, in-situ steam generation oxidation, and dry furnace oxidation. Oxide thicknesses in the 50 Å to 150 Å range grown with oxidation temperatures between 850 and 1100 °C were targeted. The present work shows first that for all investigated processes, oxidation follows a parabolic regime even for thin oxides, which indicates a diffusion-limited oxidation regime. We also observe that, for all investigated processes, the SiGe oxidation rate is systematically higher than that of Si. The amplitude of the variation of oxidation kinetics of SiGe with respect to Si is found to be strongly dependent on the process type. Second, a new quantitative analysis methodology of oxidation kinetics is introduced. This methodology allows us to highlight the dependence of oxidation kinetics on the Ge concentration at the oxidation interface, which is modulated by the pile-up mechanism. Our results show that the oxidation rate increases with the Ge concentration at the oxidation interface.

On the photoresponse of several novel functionalized oligoacene and anthradithiophene derivatives

NASA Astrophysics Data System (ADS)

Day, Jonathan

The results of an investigation into carrier dynamics in several novel functionalized and solution-processable pentacene and anthradithiophene derivatives are reported. Measurements were made of real-time photoresponse of polycrystalline thin films of these materials to ultrafast laser pulses, on picosecond to microsecond time-scales, as well as measurements of dark current and current under steady illumination. This data was taken over varied field-strength, light intensity and temperature. The results support a model for carrier generation and transport with the following features. Carrier photo-generation is assisted weakly, if it is assisted at all, thermally or by applied fields. Carriers are initially (picosecond to nanosecond time-scales) in extended states and transport is "bandlike." Carriers then relax into more localized states, transported via thermally assisted hopping (nanosecond to second time-scales). This model was supported by further experiments with the electric behavior of films prepared from a pure anthradithophene derivative, doped with either the buckminsterfullerene C60 or with other molecular dopants. These results also show that samples with traps of known density and depth can be prepared, as a means of manipulating transport dynamics. The electronic and photo-electronic behaviors of films with self-anodized aluminum and of films with gold electrodes were compared, and a model of the particular energy profile and dynamics which exist at the different interfaces between the films and the different contacts was developed. This model views the metal-organic-metal system as an anode-to-anode Schottky strucure, whose I-V relation is shaped both by the nature of the interface dynamics for different metal contacts, and by the different distributions of space-charge in the thin film between different electrodes.

Investigation of thermal energy transport interface of hybrid graphene-carbon nanotube/polyethylene nanocomposites.

PubMed

Liu, Feng; Liu, Xuyang; Hu, Ning; Ning, Huiming; Atobe, Satoshi; Yan, Cheng; Mo, Fuhao; Fu, Shaoyun; Zhang, Jianyu; Wang, Yu; Mu, Xiaojing

2017-10-31

It is well known the thermal properties of three-dimensional (3-D) hybrid graphene (GR)-carbon nanotube (CNT) structures are not superior to that of the individual GR and CNT, however, the 3-D hybrid GR-CNT structures can effectively improve the thermal properties of polymer matrix. Therefore, understanding the thermal energy transport in the interface between polymer matrix and 3-D hybrid GR-CNT structure is essential. Here, the enhancement mechanism of interfacial thermal transport of hybrid GR-CNT structure was explored by applying non-equilibrium molecular dynamics (NEMD) simulations. Three different types of hybrid GR-CNT structures were built. The influences of CNT radius and CNT type for the hybrid GR-CNT on the interfacial thermal properties were also analyzed. Computational results show that among the three different types of hybrid GR-CNT structures, the Model-I, i.e., the covalent bond hybrid GR-CNT structures are of the best interfacial thermal properties. Meanwhile, the CNT radius of hybrid GR-CNT structure has a great influence on the interfacial thermal properties.

Investigation of Oxygen and Hydrogen Associated Charge Trapping and Electrical Characteristics of Silicon Nitride Films for Mnos Devices.

NASA Astrophysics Data System (ADS)

Xu, Dan

Silicon nitride (Si_3N _4) and silicon oxynitride (SiO _{rm x}N_ {rm y}) films in the form of metal -nitride-oxide-silicon (MNOS) structures were investigated to determine the correlation between their electrical characteristics and the nature of the chemical bonding so as to provide guidelines for the next generation of nonvolatile memory devices. The photoionization cross section of electron traps in the oxynitride films of MNOS devices were also measured as a function photon energy and oxygen concentration of the silicon oxynitride films. An effective photoionization cross section associated with electron traps was determined to be between 4.9 times 10 ^{-19} cm^2 to 10.8 times 10^ {-19} cm^2 over the photon energy of 2.06 eV to 3.1 eV for silicon oxynitride films containing 7 atomic % to 17 atomic % of oxygen. The interface state density of metal-nitride-oxide -silicon (MNOS) devices was investigated as a function of processing conditions. The interface state density around the midgap of the oxide-silicon interface of the MNOS structures for deposition temperature between 650^ circC to 850^circC increased from 1.1 to 8.2 times 10 ^{11} cm^ {-2}eV^{-1}, for as-deposited silicon nitride films; but decreased from 5.0 to 3.5 times 10^ {11} cm^{-2} eV^{-1}, for films annealed in nitrogen at 900^circC for 60 minutes; and further decreased and remained constant at 1.5 times 10^{11 } cm^{-2}eV ^{-1}, for films which were further annealed in hydrogen at 900^ circC for an additional 60 minutes. The interface state density increase was due to an increase in the loss of hydrogen at the interfacial region and also due to an increase in the thermal stress caused by differences in thermal expansion coefficients of silicon nitride and silicon dioxide films at higher deposition temperatures. The interface state density was subject to two opposing influences; an increase by thermal stress, and a reduction by hydrogen compensation of these states. The photocurrent-voltage (photoI-V) technique in combination with internal photo-electric technique were employed to determine the trapped charge density and its centroid as a function of processing conditions. Results showed that the trapped charge density was of the order of 10^{18} cm ^{-3}. However, the charge trapping density increased about 30% as the atomic percentage of hydrogen decreased from 6 to 2 atomic %.

Investigation of phonon transport and thermal boundary conductance at the interface of functionalized SWCNT and poly (ether-ketone)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Huang, Haoxiang; Kumar, Satish, E-mail: satish.kumar@me.gatech.edu; Chen, Liang

2016-09-07

Carbon nanostructures such as carbon nanotube (CNT), graphene, and carbon fibers can be used as fillers in amorphous polymers to improve their thermal properties. In this study, the effect of covalent bonding of CNT with poly(ether ketone) (PEK) on interfacial thermal interactions is investigated using non-equilibrium molecular dynamics simulations. The number of covalent bonds between (20, 20) CNT and PEK is varied in the range of 0–80 (0%–6.25%), and the thermal boundary conductance is computed. The analysis reveals that covalent functionalization of CNT atoms can enhance the thermal boundary conductance by an order of magnitude compared to the non-functionalized CNT-PEKmore » interface at a high degree of CNT functionalization. Besides strengthening the thermal coupling, covalent functionalization is also shown to modify the phonon spectra of CNT. The transient spectral energy analysis shows that the crosslinks cause faster energy exchange from CNT to PEK in different frequency bands. The oxygen atom of hydroxyl group of PEK contributes energy transfer in the low frequency band, while aromatic and carbonyl carbon atoms play a more significant role in high frequency bands. In addition, by analyzing the relaxation time of the spectral temperature of different frequency bands of CNT, it is revealed that with increasing number of bonds, both lower frequency vibrational modes and higher frequency modes efficiently couple across the CNT-PEK interface and contribute in thermal energy transfer from CNT to the matrix.« less

Nonequilibrium kinetic boundary condition at the vapor-liquid interface of argon

NASA Astrophysics Data System (ADS)

Ishiyama, Tatsuya; Fujikawa, Shigeo; Kurz, Thomas; Lauterborn, Werner

2013-10-01

A boundary condition for the Boltzmann equation (kinetic boundary condition, KBC) at the vapor-liquid interface of argon is constructed with the help of molecular dynamics (MD) simulations. The KBC is examined at a constant liquid temperature of 85 K in a wide range of nonequilibrium states of vapor. The present investigation is an extension of a previous one by Ishiyama, Yano, and Fujikawa [Phys. Rev. Lett.PRLTAO0031-900710.1103/PhysRevLett.95.084504 95, 084504 (2005)] and provides a more complete form of the KBC. The present KBC includes a thermal accommodation coefficient in addition to evaporation and condensation coefficients, and these coefficients are determined in MD simulations uniquely. The thermal accommodation coefficient shows an anisotropic behavior at the interface for molecular velocities normal versus tangential to the interface. It is also found that the evaporation and condensation coefficients are almost constant in a fairly wide range of nonequilibrium states. The thermal accommodation coefficient of the normal velocity component is almost unity, while that of the tangential component shows a decreasing function of the density of vapor incident on the interface, indicating that the tangential velocity distribution of molecules leaving the interface into the vapor phase may deviate from the tangential parts of the Maxwell velocity distribution at the liquid temperature. A mechanism for the deviation of the KBC from the isotropic Maxwell KBC at the liquid temperature is discussed in terms of anisotropic energy relaxation at the interface. The liquid-temperature dependence of the present KBC is also discussed.

Thermal effects on transducer material for heat assisted magnetic recording application

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ji, Rong, E-mail: Ji-Rong@dsi.a-star.edu.sg; Xu, Baoxi; Cen, Zhanhong

2015-05-07

Heat Assisted Magnetic Recording (HAMR) is a promising technology for next generation hard disk drives with significantly increased data recording capacities. In HAMR, an optical near-field transducer (NFT) is used to concentrate laser energy on a magnetic recording medium to fulfill the heat assist function. The key components of a NFT are transducer material, cladding material, and adhesion material between the cladding and the transducer materials. Since transducer materials and cladding materials have been widely reported, this paper focuses on the adhesion materials between the Au transducer and the Al{sub 2}O{sub 3} cladding material. A comparative study for two kindsmore » of adhesion material, Ta and Cr, has been conducted. We found that Ta provides better thermal stability to the whole transducer than Cr. This is because after thermal annealing, chromium forms oxide material at interfaces and chromium atoms diffuse remarkably into the Au layer and react with Au to form Au alloy. This study also provides insights on the selection of adhesion material for HAMR transducer.« less

Thermal conductivity of hydrate-bearing sediments

USGS Publications Warehouse

Cortes, Douglas D.; Martin, Ana I.; Yun, Tae Sup; Francisca, Franco M.; Santamarina, J. Carlos; Ruppel, Carolyn D.

2009-01-01

A thorough understanding of the thermal conductivity of hydrate-bearing sediments is necessary for evaluating phase transformation processes that would accompany energy production from gas hydrate deposits and for estimating regional heat flow based on the observed depth to the base of the gas hydrate stability zone. The coexistence of multiple phases (gas hydrate, liquid and gas pore fill, and solid sediment grains) and their complex spatial arrangement hinder the a priori prediction of the thermal conductivity of hydrate-bearing sediments. Previous studies have been unable to capture the full parameter space covered by variations in grain size, specific surface, degree of saturation, nature of pore filling material, and effective stress for hydrate-bearing samples. Here we report on systematic measurements of the thermal conductivity of air dry, water- and tetrohydrofuran (THF)-saturated, and THF hydrate–saturated sand and clay samples at vertical effective stress of 0.05 to 1 MPa (corresponding to depths as great as 100 m below seafloor). Results reveal that the bulk thermal conductivity of the samples in every case reflects a complex interplay among particle size, effective stress, porosity, and fluid-versus-hydrate filled pore spaces. The thermal conductivity of THF hydrate–bearing soils increases upon hydrate formation although the thermal conductivities of THF solution and THF hydrate are almost the same. Several mechanisms can contribute to this effect including cryogenic suction during hydrate crystal growth and the ensuing porosity reduction in the surrounding sediment, increased mean effective stress due to hydrate formation under zero lateral strain conditions, and decreased interface thermal impedance as grain-liquid interfaces are transformed into grain-hydrate interfaces.

Microstructure, Tensile Adhesion Strength and Thermal Shock Resistance of TBCs with Different Flame-Sprayed Bond Coat Materials Onto BMI Polyimide Matrix Composite

NASA Astrophysics Data System (ADS)

Abedi, H. R.; Salehi, M.; Shafyei, A.

2017-10-01

In this study, thermal barrier coatings (TBCs) composed of different bond coats (Zn, Al, Cu-8Al and Cu-6Sn) with mullite top coats were flame-sprayed and air-plasma-sprayed, respectively, onto bismaleimide matrix composites. These polyimide matrix composites are of interest to replace PMR-15, due to concerns about the toxicity of the MDA monomer from which PMR-15 is made. The results showed that pores and cracks appeared at the bond coat/substrate interface for the Al-bonded TBC because of its high thermal conductivity and diffusivity resulting in transferring of high heat flux and temperature to the polymeric substrate during top coat deposition. The other TBC systems due to the lower conductivity and diffusivity of bonding layers could decrease the adverse thermal effect on the polymer substrate during top coat deposition and exhibited adhesive bond coat/substrate interfaces. The tensile adhesion test showed that the adhesion strength of the coatings to the substrate is inversely proportional to the level of residual stress in the coatings. However, the adhesion strength of Al bond-coated sample decreased strongly after mullite top coat deposition due to thermal damage at the bond coat/substrate interface. TBC system with the Cu-6Sn bond coat exhibited the best thermal shock resistance, while Al-bonded TBC showed the lowest. It was inferred that thermal mismatch stresses and oxidation of the bond coats were the main factors causing failure in the thermal shock test.

Universal Controller for Spacecraft Mechanisms

NASA Technical Reports Server (NTRS)

Levanas, Greg; McCarthy, Thomas; Hunter, Don; Buchanan, Christine; Johnson, Michael; Cozy, Raymond; Morgan, Albert; Tran, Hung

2006-01-01

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Materials and Manufacturing Technology Directorate Thermal Sciences and Materials Branch (Overview)

DTIC Science & Technology

2010-09-01

Molecular Mechanics for thermo-mechanical response Materials Characterization • CNT modified durable thermal interface ( DTI ) • MEMS-based RTD micro...stabilization. Surface Characterization by Atomic Force Microscopy: Probing Thermal, Electrical, and Mechanical Properties Heater Current Path Anchor Leg 50 µm

Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport

NASA Astrophysics Data System (ADS)

Vishwakarma, Vivek; Waghela, Chirag; Wei, Zi; Prasher, Ravi; Nagpure, Shrikant C.; Li, Jianlin; Liu, Fuqiang; Daniel, Claus; Jain, Ankur

2015-12-01

While Li-ion cells offer excellent electrochemical performance for several applications including electric vehicles, they also exhibit poor thermal transport characteristics, resulting in reduced performance, overheating and thermal runaway. Inadequate heat removal from Li-ion cells originates from poor thermal conductivity within the cell. This paper identifies the rate-limiting material-level process that dominates overall thermal conduction in a Li-ion cell. Results indicate that thermal characteristics of a Li-ion cell are largely dominated by heat transfer across the cathode-separator interface rather than heat transfer through the materials themselves. This interfacial thermal resistance contributes around 88% of total thermal resistance in the cell. Measured value of interfacial resistance is close to that obtained from theoretical models that account for weak adhesion and large acoustic mismatch between cathode and separator. Further, to address this problem, an amine-based chemical bridging of the interface is carried out. This is shown to result in in four-times lower interfacial thermal resistance without deterioration in electrochemical performance, thereby increasing effective thermal conductivity by three-fold. This improvement is expected to reduce peak temperature rise during operation by 60%. By identifying and addressing the material-level root cause of poor thermal transport in Li-ion cells, this work may contributes towards improved thermal performance of Li-ion cells.

Calculation of the Naval Long and Short Waste Package Three-Dimensional Thermal Interface Temperatures

DOE Office of Scientific and Technical Information (OSTI.GOV)

H. Marr

2006-10-25

The purpose of this calculation is to evaluate the thermal performance of the Naval Long and Naval Short spent nuclear fuel (SNF) waste packages (WP) in the repository emplacement drift. The scope of this calculation is limited to the determination of the temperature profiles upon the surfaces of the Naval Long and Short SNF waste package for up to 10,000 years of emplacement. The temperatures on the top of the outside surface of the naval canister are the thermal interfaces for the Naval Nuclear Propulsion Program (NNPP). The results of this calculation are intended to support Licensing Application design activities.

Reliability of emerging bonded interface materials for large-area attachments

DOE PAGES

Paret, Paul P.; DeVoto, Douglas J.; Narumanchi, Sreekant

2015-12-30

In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMsmore » for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn 63Pb 37) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.« less

Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation

NASA Astrophysics Data System (ADS)

Li, Ganglong; Wu, Houya; Luo, Honglong; Chen, Zhuo; Tay, Andrew A. O.; Zhu, Wenhui

2017-09-01

Three-dimensional (3D) integration technology using Cu interconnections has emerged as a promising solution to improve the performance of silicon microelectronic devices. However, Cu diffuses into SiO2 and requires a barrier layer such as Ta to ensure acceptable reliability. In this paper, the effects of temperature and strain normal to the interface on the inter-diffusion of Cu and Ta at annealing conditions are investigated using a molecular dynamics (MD) technique with embedded atomic method (EAM) potentials. Under thermal annealing conditions without strain, it is found that a Cu-rich diffusion region approximately 2 nm thick is formed at 1000 K after 10 ns of annealing. Ta is capable of diffusing into the interior of Cu but Cu hardly diffuses into the inner lattice of Ta. At the Cu side near the interface an amorphous structure is formed due to the process of diffusion. The diffusion activation energy of Cu and Ta are found to be 0.9769 and 0.586 eV, respectively. However, when a strain is applied, a large number of crystal defects are generated in the sample. As the strain is increased, extrinsic stacking faults (ESFs) and lots of Shockley partial dislocations appear. The density of the dislocations and the diffusion channels increase, promoting the diffusion of Cu atoms into the inner lattice of Ta. The thickness of the diffusion layer increases to 4 times the value when only a temperature load of 700 K is applied. The MD simulations demonstrated that Ta is very effective as a barrier layer under thermal loading only, and its effectiveness is impaired by tensile strain at the Cu/Ta interface. The simulations also clarified the mechanism that caused the impairment. The methodology and approach described in this paper can be followed further to study the effectiveness of barrier layers under various annealing and strain conditions, and to determine the minimum thickness of barrier layers required for a particular application.

Brownian thermal noise in functional optical surfaces

NASA Astrophysics Data System (ADS)

Kroker, S.; Dickmann, J.; Rojas Hurtado, C. B.; Heinert, D.; Nawrodt, R.; Levin, Y.; Vyatchanin, S. P.

2017-07-01

We present a formalism to compute Brownian thermal noise in functional optical surfaces such as grating reflectors, photonic crystal slabs, or complex metamaterials. Such computations are based on a specific readout variable, typically a surface integral of a dielectric interface displacement weighed by a form factor. This paper shows how to relate this form factor to Maxwell's stress tensor computed on all interfaces of the moving surface. As an example, we examine Brownian thermal noise in monolithic T-shaped grating reflectors. The previous computations by Heinert et al. [Phys. Rev. D 88, 042001 (2013), 10.1103/PhysRevD.88.042001] utilizing a simplified readout form factor produced estimates of thermal noise that are tens of percent higher than those of the exact analysis in the present paper. The relation between the form factor and Maxwell's stress tensor implies a close correlation between the optical properties of functional optical surfaces and thermal noise.

Growth rates and interface shapes in germanium and lead tin telluride observed in-situ, real-time in vertical Bridgman furnaces

NASA Technical Reports Server (NTRS)

Barber, P. G.; Berry, R. F.; Debnam, W. J.; Fripp, A. L.; Woodell, G.; Simchick, R. T.

1995-01-01

Using the advanced technology developed to visualize the melt-solid interface in low Prandtl number materials, crystal growth rates and interface shapes have been measured in germanium and lead tin telluride semiconductors grown in vertical Bridgman furnaces. The experimental importance of using in-situ, real time observations to determine interface shapes, to measure crystal growth rates, and to improve furnace and ampoule designs is demonstrated. The interface shapes observed in-situ, in real-time were verified by quenching and mechanically induced interface demarcation, and they were also confirmed using machined models to ascertain the absence of geometric distortions. Interface shapes depended upon the interface position in the furnace insulation zone, varied with the nature of the crystal being grown, and were dependent on the extent of transition zones at the ends of the ampoule. Actual growth rates varied significantly from the constant translation rate in response to the thermophysical properties of the crystal and its melt and the thermal conditions existing in the furnace at the interface. In the elemental semiconductor germanium the observed rates of crystal growth exceeded the imposed translation rate, but in the compound semiconductor lead tin telluride the observed rates of growth were less than the translation rate. Finally, the extent of ampoule thermal loading influenced the interface positions, the shapes, and the growth rates.

Carbon nanotubes for thermal interface materials in microelectronic packaging

NASA Astrophysics Data System (ADS)

Lin, Wei

As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon. 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ˜35% and ˜65%, respectively, in tensile strength (˜0.8 GPa) and modulus (˜90 GPa) during tensile testing; an ˜20% improvement in electrical conductivity (˜80000 S m-1) was also reported. The mechanism of the microwave response of CNTs was discussed. Such a microwave annealing process has been extended to the preparation of reduced graphene oxide. 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding. 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ˜30 mm2 s-1 along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ˜27 and ˜540 W m-1 K-1, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ˜1x10-7 m2 K W -1. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging. 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.

Vertically aligned carbon nanotube arrays as thermal interface material for vibrational structure of piezoelectric transformer

NASA Astrophysics Data System (ADS)

Chen, Lie; Ju, Bin; Feng, Zhihua; Zhao, Yang

2018-07-01

The application and characterization of thermal interface material (TIM) for vibrational structures is investigated in this paper. The vibrating feature during the operation requires unique solution for its thermal management, since the connection between the device and heat dissipater should be able to conduct heat efficiently and impose minimum constraint onto the vibration simultaneously. As a typical vibrational device, piezoelectric transformers (PTs) are discussed in this paper. The PTs have urgent demands for thermal dissipation since their power conversion efficiency decrease rapidly with the rising temperature. A novel method by applying vertically aligned carbon nanotube (VACNT) arrays to the interface between PT and heat dissipater is presented to enhance the performance of piezoelectric transformers. VACNT arrays are one of the excellent TIMs. It can directly establish thermal contact between two surfaces by van der Waals’ forces. In addition, the unique anisotropic character of CNT arrays provides enough flexibility to accommodate the vibration during the operation. Different configurations of TIMs are compared with each other in this work, including CNT arrays, tape of polypropylene (PP) membrane and without heat transfer structure (HTS). The results indicate that the temperature rise is lowest and the efficiency is highest at the same power density while CNT arrays served as the TIM. Almost no significant fretting and wearing damage occurred on PT electrode surface with CNT arrays TIM even after working continuously for 120 days. Meanwhile, the thermo-physical properties of CNT arrays at contact interface are measured by optical transient thermo-reflectance technique.

An analytical/numerical correlation study of the multiple concentric cylinder model for the thermoplastic response of metal matrix composites

NASA Technical Reports Server (NTRS)

Pindera, Marek-Jerzy; Salzar, Robert S.; Williams, Todd O.

1993-01-01

The utility of a recently developed analytical micromechanics model for the response of metal matrix composites under thermal loading is illustrated by comparison with the results generated using the finite-element approach. The model is based on the concentric cylinder assemblage consisting of an arbitrary number of elastic or elastoplastic sublayers with isotropic or orthotropic, temperature-dependent properties. The elastoplastic boundary-value problem of an arbitrarily layered concentric cylinder is solved using the local/global stiffness matrix formulation (originally developed for elastic layered media) and Mendelson's iterative technique of successive elastic solutions. These features of the model facilitate efficient investigation of the effects of various microstructural details, such as functionally graded architectures of interfacial layers, on the evolution of residual stresses during cool down. The available closed-form expressions for the field variables can readily be incorporated into an optimization algorithm in order to efficiently identify optimal configurations of graded interfaces for given applications. Comparison of residual stress distributions after cool down generated using finite-element analysis and the present micromechanics model for four composite systems with substantially different temperature-dependent elastic, plastic, and thermal properties illustrates the efficacy of the developed analytical scheme.

Experimental investigation on IXV TPS interface effects in Plasmatron

NASA Astrophysics Data System (ADS)

Ceglia, Giuseppe; Trifoni, Eduardo; Gouriet, Jean-Baptiste; Chazot, Olivier; Mareschi, Vincenzo; Rufolo, Giuseppe; Tumino, Giorgio

2016-06-01

An experimental investigation related to the thermal protection system (TPS) interfaces of the intermediate experimental vehicle has been carried out in the Plasmatron facility at the von Karman Institute for fluid dynamics. The objective of this test campaign is to qualify the thermal behaviours of two different TPS interfaces under flight representative conditions in terms of heat flux and integral heat load ( 180 kW/m2 for 700 s). Three test samples are tested in off-stagnation configuration installed on an available flat plate holder under the same test conditions. The first junction is composed of an upstream ceramic matrix composite (CMC) plate and an ablative P50 cork composite block separated by a gap of 2 mm. The second one is made of an upstream P50 block and a downstream ablative SV2A silicon elastomer block with silicon-based filler in between. A sample composed of P50 material is tested in order to obtain reference results without TPS interface effect. The overheating at the CMC-P50 interface due to the jump of the catalytic properties of the materials, and the recession/swelling behaviour of the P50-SV2A interface are under investigation. All the test samples withstand relatively well the imposed heat flux for the test duration. As expected, both the ablative materials undergo a thermal degradation. The P50 exhibits the formation of a porous char layer and its recession; on the other hand, the SV2A swells and forms a fragile char layer.

Thermal conductance of Teflon and Polyethylene: Insight from an atomistic, single-molecule level

PubMed Central

Buerkle, Marius; Asai, Yoshihiro

2017-01-01

The thermal transport properties of teflon (polytetrafluoroethylene) and its polyethylene counterparts are, while highly desirable and widely used, only superficially understood. Here, we aim therefore to provide rigorous insight from an atomistic point of view in context of single-molecule devices. We show that for vinyl polymers adsorbed on metal-surfaces the thermal transport strongly depends on the properties of the metal-molecule interface and that the reduced thermal conductance observed for teflon derivatives originates in a reduced phonon injection life time. In asymmetric molecules phonon blocking on the intra molecular interface leads to a further reduction of thermal conductance. For hetrojunctions with different electrode materials we find that thermal conductance is suppressed due to a reduced overlap of the available phonon modes in the different electrodes. A detailed atomistic picture is thereby provided by studying the transport through perfluorooctane and octane on a single-molecule level using first principles transport calculations and nonequilibrium molecular dynamic simulations. PMID:28150738

A 3D graphene interface (Si-doped) of Ag matrix with excellent electronic transmission and thermal conductivity via nano-assembly modification

NASA Astrophysics Data System (ADS)

Ye, Xianzhu; Li, Ming; Zhang, Yafei

2018-04-01

The wide development of electronic materials requires higher load capacity and high temperature resistance. In this study, a novel architecture was fabricated consisting of a 3D reduced graphene oxide (rGO)-Si interface using a simple nano-assembly sintering to achieve high current capacity and excellent thermal features. Via the analysis of catalytic oxidation for methanol, the loading catalytic activity of nano-Ag still remained to a certain extent for the composite with 0.8 vol.% rGO. The final Ag-rGO composite apparently possesses a higher initial oxidation temperature and lower rate of oxidation for internal passing and shielding, and the thermal conductivity is significantly enhanced from 344 to 407 W m‑1 K‑1. Importantly, with a 3D synergistic transportation network, the resistivity of the Ag-rGO composite is much lower than pure Ag, and with a longer conductive time under a stress condition of current density of 6.0  ×  104 A cm‑2. Thermal-electronic features demonstrate that the dispersed graphene interface can efficiently suppress the primary failure pathways (high temperature) in Ag matrix and make it uniquely efficient for the advancement of microscale and thermal-management electronics.

The Effect of Interface Roughness and Oxide Film Thickness on the Inelastic Response of Thermal Barrier Coatings to Thermal Cycling

NASA Technical Reports Server (NTRS)

Pindera, Marek-Jerzy; Aboudi, Jacob; Arnold, Steven M.

1999-01-01

The effects of interfacial roughness and oxide film thickness on thermally-induced stresses in plasma-sprayed thermal barrier coatings subjected to thermal cycling are investigated using the recently developed higher-order theory for functionally graded materials. The higher-order theory is shown to be a viable alternative to the finite-element approach, capable of modeling different interfacial roughness architectures in the presence of an aluminum oxide layer and capturing the high stress gradients that occur at the top coat/bond coat interface. The oxide layer thickness is demonstrated to have a substantially greater effect on the evolution of residual stresses than local variations in interfacial roughness. Further, the location of delamination initiation in the top coat is predicted to change with increasing oxide layer thickness. This result can be used to optimize the thickness of a pre-oxidized layer introduced at the top coat/bond coat interface in order to enhance TBC durability as suggested by some researchers. The results of our investigation also support a recently proposed hypothesis regarding delamination initiation and propagation in the presence of an evolving bond coat oxidation, while pointing to the importance of interfacial roughness details and specimen geometry in modeling this phenomenon.

Thermal time constant: optimising the skin temperature predictive modelling in lower limb prostheses using Gaussian processes

PubMed Central

Buis, Arjan

2016-01-01

Elevated skin temperature at the body/device interface of lower-limb prostheses is one of the major factors that affect tissue health. The heat dissipation in prosthetic sockets is greatly influenced by the thermal conductive properties of the hard socket and liner material employed. However, monitoring of the interface temperature at skin level in lower-limb prosthesis is notoriously complicated. This is due to the flexible nature of the interface liners used which requires consistent positioning of sensors during donning and doffing. Predicting the residual limb temperature by monitoring the temperature between socket and liner rather than skin and liner could be an important step in alleviating complaints on increased temperature and perspiration in prosthetic sockets. To predict the residual limb temperature, a machine learning algorithm – Gaussian processes is employed, which utilizes the thermal time constant values of commonly used socket and liner materials. This Letter highlights the relevance of thermal time constant of prosthetic materials in Gaussian processes technique which would be useful in addressing the challenge of non-invasively monitoring the residual limb skin temperature. With the introduction of thermal time constant, the model can be optimised and generalised for a given prosthetic setup, thereby making the predictions more reliable. PMID:27695626

Thermal time constant: optimising the skin temperature predictive modelling in lower limb prostheses using Gaussian processes.

PubMed

Mathur, Neha; Glesk, Ivan; Buis, Arjan

2016-06-01

Elevated skin temperature at the body/device interface of lower-limb prostheses is one of the major factors that affect tissue health. The heat dissipation in prosthetic sockets is greatly influenced by the thermal conductive properties of the hard socket and liner material employed. However, monitoring of the interface temperature at skin level in lower-limb prosthesis is notoriously complicated. This is due to the flexible nature of the interface liners used which requires consistent positioning of sensors during donning and doffing. Predicting the residual limb temperature by monitoring the temperature between socket and liner rather than skin and liner could be an important step in alleviating complaints on increased temperature and perspiration in prosthetic sockets. To predict the residual limb temperature, a machine learning algorithm - Gaussian processes is employed, which utilizes the thermal time constant values of commonly used socket and liner materials. This Letter highlights the relevance of thermal time constant of prosthetic materials in Gaussian processes technique which would be useful in addressing the challenge of non-invasively monitoring the residual limb skin temperature. With the introduction of thermal time constant, the model can be optimised and generalised for a given prosthetic setup, thereby making the predictions more reliable.

Mechanism of electromigration failure in Damascene processed copper interconnects

NASA Astrophysics Data System (ADS)

Michael, Nancy Lyn

2002-11-01

A major unresolved issue in Cu interconnect reliability is the interface role in the failure mechanism of real structures. The present study investigates failure in single-level damascene Cu interconnects with variations in interface condition, passivation and barrier, and linewidth. In the first phase, accelerated electromigration testing of 0.25mum Cu interconnects capped with SiN or SiCN, shows that lifetime and failure mode vary with capping layer. The first mode, seen primarily in SiN samples, is characterized by gradual resistance increase and extensive interface damage, believed to result from failure led by interface electromigration. The competing failure mode, found in SiCN capped samples, is characterized by abrupt resistance increase and localized voiding. The second phase fixes SiCN as the capping material and varies barrier material and line width. The three barrier materials, Ta, TaN, and Ta/TaN, produce similar lifetime statistics and failure is abrupt. Line width, however, does have a strong influence on failure time. The line width/grain size ratio ranged from 0.53 to 2.2 but does not correlate with mean time to failure (MTF). The strong dependence on interface fraction, combined with the conclusion from phase one that interface electromigration is not rate controlling, suggests another mechanism related to the interface is a controlling factor. The possibility that contamination and defects at the interface are key to this failure mode was investigated using electro-thermal fatigue (ETF). In ETF, where lines are simultaneously subjected to thermal cycling and constant current, damage caused by thermal stress is accelerated. Tests reveal that in 80 nm lines, transient failure occurs at times far below MTF in electromigration tests at higher temperatures. Failure found in ETF is clearly a result of damage growth due to thermal/mechanical stress rather than electromigration. At the stress levels created by the moderate ETF test conditions, the only place voids are likely to nucleate and grow is at pre-existing defects and impurities. In narrower lines, where smaller voids can cause catastrophic damage, defects have a greater effect on MTF. Results from this investigation suggest that impurities and defects in the Cu and at the interface, must be carefully controlled to make reliable narrow Cu interconnects.

High thermal stability of abrupt SiO2/GaN interface with low interface state density

NASA Astrophysics Data System (ADS)

Truyen, Nguyen Xuan; Taoka, Noriyuki; Ohta, Akio; Makihara, Katsunori; Yamada, Hisashi; Takahashi, Tokio; Ikeda, Mitsuhisa; Shimizu, Mitsuaki; Miyazaki, Seiichi

2018-04-01

The effects of postdeposition annealing (PDA) on the interface properties of a SiO2/GaN structure formed by remote oxygen plasma-enhanced chemical vapor deposition (RP-CVD) were systematically investigated. X-ray photoelectron spectroscopy clarified that PDA in the temperature range from 600 to 800 °C has almost no effects on the chemical bonding features at the SiO2/GaN interface, and that positive charges exist at the interface, the density of which can be reduced by PDA at 800 °C. The capacitance-voltage (C-V) and current density-SiO2 electric field characteristics of the GaN MOS capacitors also confirmed the reduction in interface state density (D it) and the improvement in the breakdown property of the SiO2 film after PDA at 800 °C. Consequently, a high thermal stability of the SiO2/GaN structure with a low fixed charge density and a low D it formed by RP-CVD was demonstrated. This is quite informative for realizing highly robust GaN power devices.

Adsorption and solvation of ethanol at the water liquid-vapor interface: a molecular dynamics study

NASA Technical Reports Server (NTRS)

Wilson, M. A.; Pohorille, A.

1997-01-01

The free energy profiles of methanol and ethanol at the water liquid-vapor interface at 310K were calculated using molecular dynamics computer simulations. Both alcohols exhibit a pronounced free energy minimum at the interface and, therefore, have positive adsorption at this interface. The surface excess was computed from the Gibbs adsorption isotherm and was found to be in good agreement with experimental results. Neither compound exhibits a free energy barrier between the bulk and the surface adsorbed state. Scattering calculations of ethanol molecules from a gas phase thermal distribution indicate that the mass accommodation coefficient is 0.98, and the molecules become thermalized within 10 ps of striking the interface. It was determined that the formation of the solvation structure around the ethanol molecule at the interface is not the rate-determining step in its uptake into water droplets. The motion of an ethanol molecule in a water lamella was followed for 30 ns. The time evolution of the probability distribution of finding an ethanol molecule that was initially located at the interface is very well described by the diffusion equation on the free energy surface.

The photoacoustic effect generated by an incompressible sphere.

PubMed

Diebold, Gerald J; Beveridge, Andrew C; Hamilton, Theron J

2002-11-01

An incompressible sphere with a vanishing thermal expansivity suspended in a fluid can generate a photoacoustic effect when the heat deposited in the sphere by a light beam diffuses into the surrounding liquid causing it to expand and launch a sound wave. The properties of the photoacoustic effect for the sphere are found using a Green's function solution to the wave equation for pressure with Neumann boundary conditions. The results of the calculation show that the acoustic wave for fast heat liberation is an outgoing compressive pulse followed by a reflected pulse whose time profile is modified as a result of frequency dependent reflection from the sphere. For slow heat release by the sphere, the photoacoustic effect is shown to be proportional to the first time derivative of the heat flux at the particle-fluid interface.

Design and analysis of multifunctional structures for embedded electronics in unmanned aerial vehicles

NASA Astrophysics Data System (ADS)

Kothari, Rushabh M.

Multifunctional structures are a new trend in the aerospace industry for the next generation structural design. Many future structures are expected to be something in addition to a load bearing structure. The design and analysis of multifunctional structures combining structural, electrical and thermal functionalities are presented here. The sandwich beam is considered as a starting point for the load bearing structure and then it is modified with a cavity to embed avionics and thermal controls. The embedded avionics inside the load bearing structure would allow weight reduction of the aerospace vehicle due to elimination of separate electronics housing, interconnects, cables etc. The cavity reduces strength of the structure so various reinforcements methods are evaluated. The result of various reinforcements and their effectiveness are presented. The current generation of electronics produce massive amount of heat. In the case of embedded electronics, the excessive heat presents a major challenge to the structural and heat transfer engineers. The embedded nature of electronics prevents the use of the classical heat dissipative methods such as fans and high velocity air flows, etc. The integrated thermal control of the electronics has been designed using passive heat transfer device and highly optimized particulate composite thermal interface material (TIM). The TIMs are used to fill the air gaps and reduce contact resistance between two surfaces, such as electronics and heat dissipators. The efficiency of TIM directly affects the overall heat transfer ability of the integrated thermal control system. The effect of the particles at micron and nano scales are studied for the particulate composite TIM. The thermal boundary resistance study for the particulate composite TIM with nano silica particles is presented in this thesis. The FEA analysis is used to model thermal boundary resistance and compared with the theoretical micromechanics model. The heat pipes are chosen as a part of passive heat transfer device due to their durability and excellent thermal conductivities. The multifunctional system consisting of all above components is modeled for unmanned aerial vehicle (UAV) at subsonic air speeds to demonstrate the validity of the design.

Process dependent morphology of the Si/SiO2 interface measured with scanning tunneling microscopy

NASA Technical Reports Server (NTRS)

Hecht, Michael H.; Bell, L. D.; Grunthaner, F. J.; Kaiser, W. J.

1988-01-01

A new experimental technique to determine Si/SiO2 interface morphology is described. Thermal oxides of silicon are chemically removed, and the resulting surface topography is measured with scanning tunneling microscopy. Interfaces prepared by oxidation of Si (100) and (111) surfaces, followed by postoxidation anneal (POA) at different temperatures, have been characterized. Correlations between interface structure, chemistry, and electrical characteristics are described.

Ultracompliant Heterogeneous Copper-Tin Nanowire Arrays Making a Supersolder

DOE Office of Scientific and Technical Information (OSTI.GOV)

Narumanchi, Sreekant V; Feng, Xuhui; Major, Joshua

Due to the substantial increase in power density, thermal interface resistance that can constitute more than 50% of the total thermal resistance has generally become a bottleneck for thermal management in electronics. However, conventional thermal interface materials (TIMs) such as solder, epoxy, gel, and grease cannot fulfill the requirements of electronics for high-power and long-term operation. Here, we demonstrate a high-performance TIM consisting of a heterogeneous copper-tin nanowire array, which we term 'supersolder' to emulate the role of conventional solders in bonding various surfaces. The supersolder is ultracompliant with a shear modulus 2-3 orders of magnitude lower than traditional soldersmore » and can reduce the thermal resistance by two times as compared with the state-of-the-art TIMs. This supersolder also exhibits excellent long-term reliability with >1200 thermal cycles over a wide temperature range. By resolving this critical thermal bottleneck, the supersolder enables electronic systems, ranging from microelectronics and portable electronics to massive data centers, to operate at lower temperatures with higher power density and reliability.« less

Thermal diffusivity measurement of GaAs/AlGaAs thin-film structures

NASA Astrophysics Data System (ADS)

Chen, G.; Tien, C. L.; Wu, X.; Smith, J. S.

1994-05-01

This work develops a new measurement technique that determines the thermal diffusivity of thin films in both parallel and perpendicular directions, and presents experimental results on the thermal diffusivity of GaAs/AlGaAs-based thin-film structures. In the experiment, a modulated laser source heats up the sample and a fast-response temperature sensor patterned directly on the sample picks up the thermal response. From the phase delay between the heating source and the temperature sensor, the thermal diffusivity in either the parallel or perpendicular direction is obtained depending on the experimental configuration. The experiment is performed on a molecular-beam-epitaxy grown vertical-cavity surface-emitting laser (VCSEL) structure. The substrates of the samples are etched away to eliminate the effects of the interface between the film and the substrate. The results show that the thermal diffusivity of the VCSEL structure is 5-7 times smaller than that of its corresponding bulk media. The experiments also provide evidence on the anisotropy of thermal diffusivity caused solely by the effects of interfaces and boundaries of thin films.

Thermal Stir Welder

NASA Technical Reports Server (NTRS)

Ding, R. Jeffrey (Inventor)

2012-01-01

A welding apparatus is provided for forming a weld joint between first and second elements of a workpiece. The apparatus heats the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding mixer, to remove any dendritic-type weld microstructures introduced into the interface material during heating.

High thermal conductivity materials for thermal management applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Broido, David A.; Reinecke, Thomas L.; Lindsay, Lucas R.

High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit (304) and a thermally conductive unit (306, 308, 310) in thermal communication with the heat generating unit (304) for conducting heat generated by the heat generating unit (304) away from the heat generating unit (304), the thermally conductive unit (306, 308, 310) comprising a thermally conductive compound, alloy or composite thereof. The thermally conductive compound may include Boron Arsenide, Boron Antimonide, Germanium Carbide and Beryllium Selenide.

Flexural resonance mechanism of thermal transport across graphene-SiO2 interfaces

NASA Astrophysics Data System (ADS)

Ong, Zhun-Yong; Qiu, Bo; Xu, Shanglong; Ruan, Xiulin; Pop, Eric

2018-03-01

Understanding the microscopic mechanism of heat dissipation at the dimensionally mismatched interface between a two-dimensional (2D) crystal and its substrate is crucial for the thermal management of devices based on 2D materials. Here, we study the lattice contribution to thermal (Kapitza) transport at graphene-SiO2 interfaces using molecular dynamics (MD) simulations and non-equilibrium Green's functions (NEGF). We find that 78 percent of the Kapitza conductance is due to sub-20 THz flexural acoustic modes, and that a resonance mechanism dominates the interfacial phonon transport. MD and NEGF estimate the classical Kapitza conductance to be hK ≈ 10 to 16 MW K-1 m-2 at 300 K, respectively, consistent with existing experimental observations. Taking into account quantum mechanical corrections, this value is approximately 28% lower at 300 K. Our calculations also suggest that hK scales as T2 at low temperatures (T < 100 K) due to the linear frequency dependence of phonon transmission across the graphene-SiO2 interface at low frequencies. Our study sheds light on the role of flexural acoustic phonons in heat dissipation from graphene to its substrate.

Structural and thermal interface characteristics of Stirling cycle cryocoolers for space applications

NASA Technical Reports Server (NTRS)

Boyle, R.; James, E.; Miller, P.; Arillo, V.; Sparr, L.; Castles, S.

1991-01-01

Integration of a Stirling cycle cryocooler into a flight system will require careful attention to the thermal, structural, and electrical interfaces between the cryocooler, the instrument and the spacecraft. These issues are currently under investigation by National Aeronautics and Space Administration/Goddard Space Flight Center personnel in laboratory tests of representative longlife cryocoolers. An 80 K cryocooler has been instrumented as a testbed for vibration control systems characterization. Initial vibration data using a new six-DOF force dynamometer is presented in this report.

Interface conductance modal analysis of lattice matched InGaAs/InP

NASA Astrophysics Data System (ADS)

Gordiz, Kiarash; Henry, Asegun

2016-05-01

We studied the heat conduction at InGaAs/InP interfaces and found that the total value of interface conductance was quite high ˜830 MW m-2 K-1. The modal contributions to the thermal interface conductance (TIC) were then investigated to determine the mode responsible. Using the recently developed interface conductance modal analysis method, we showed that more than 70% of the TIC arises from extended modes in the system. The lattice dynamics calculations across the interface revealed that, unlike any other interfaces previously studied, the different classes of vibration around the interface of InGaAs/InP naturally segregate into distinct regions with respect to frequency. In addition, interestingly, the entire region of frequency overlap between the sides of the interface is occupied by extended modes, whereby the two materials vibrate together with a single frequency. We also mapped the correlations between modes, which showed that the contribution by extended modes to the TIC primarily arises from coupling to the modes that have the same frequencies of vibration (i.e., autocorrelations). Moreover, interfacial modes despite their low population still contribute more than 6% to interfacial thermal transport. The analysis sheds light on the nature of heat conduction by different classes of vibration that exist in interfacial systems, which has technological relevance to applications such as thermophotovoltaics and optoelectronics.

Low thermal budget annealing technique for high performance amorphous In-Ga-ZnO thin film transistors

NASA Astrophysics Data System (ADS)

Shin, Joong-Won; Cho, Won-Ju

2017-07-01

In this paper, we investigate a low thermal budget post-deposition-annealing (PDA) process for amorphous In-Ga-ZnO (a-IGZO) oxide semiconductor thin-film-transistors (TFTs). To evaluate the electrical characteristics and reliability of the TFTs after the PDA process, microwave annealing (MWA) and rapid thermal annealing (RTA) methods were applied, and the results were compared with those of the conventional annealing (CTA) method. The a-IGZO TFTs fabricated with as-deposited films exhibited poor electrical characteristics; however, their characteristics were improved by the proposed PDA process. The CTA-treated TFTs had excellent electrical properties and stability, but the CTA method required high temperatures and long processing times. In contrast, the fabricated RTA-treated TFTs benefited from the lower thermal budget due to the short process time; however, they exhibited poor stability. The MWA method uses a low temperature (100 °C) and short annealing time (2 min) because microwaves transfer energy directly to the substrate, and this method effectively removed the defects in the a-IGZO TFTs. Consequently, they had a higher mobility, higher on-off current ratio, lower hysteresis voltage, lower subthreshold swing, and higher interface trap density than TFTs treated with CTA or RTA, and exhibited excellent stability. Based on these results, low thermal budget MWA is a promising technology for use on various substrates in next generation displays.

Thermal Design, Analysis, and Testing of the Quench Module Insert Bread Board

NASA Technical Reports Server (NTRS)

Breeding, Shawn; Khodabandeh, Julia

2002-01-01

Contents include the following: Quench Module Insert (QMI) science requirements. QMI interfaces. QMI design layout. QMI thermal analysis and design methodology. QMI bread board testing and instrumentation approach. QMI thermal probe design parameters. Design features for gradient measurement. Design features for heated zone measurements. Thermal gradient analysis results. Heated zone analysis results. Bread board thermal probe layout. QMI bread board correlation and performance. Summary and conclusions.

Investigation, Modeling and Validation of Digital Bridge for a New Generation Hot-Wire Anemometer

NASA Astrophysics Data System (ADS)

Joshi, Karthik Kamalakar

The Digital Bridge Thermal Anemometer (DBTA) is a new generation anemometer that uses advanced electronics and a modified half-Wheatstone bridge configuration, specifically a sensor and a shunt resistor in series. This allows the miniaturization of the anemometer and the communication between host computer and anemometer is carried out using serial or ethernet which eliminates the noise due to the use of long cables in conventional anemometer and the digital data sent to host computer is immune to electrical noise. In the new configuration the potential drop across a shunt resistor is used to control the bridge. This thesis is confined to the anemometer used in constant temperature (CT) mode. The heat transfer relations are studied and new expressions are developed based on the new configuration of the bridge using perturbation analysis. The theoretical plant model of a commercially available sensor and a custom built sensor are derived and quantified. The plant model is used to design a controller to control the plant in closed-loop using feedback. To test the performance of the modified sensor used with a "generation-I" bridge and DAQ, an experiment was conducted. The controller was implemented in a user interface in LabVIEW. The test is to compare the results between a conventional TSI sensor with an IFA 300 anemometer and the setup describe above, in the wake behind a circular cylinder. Performance of the DBTA is satisfactory at low frequencies. A user interface capable of communicating with the anemometer to control the operation and collect data generated by anemometer is developed in LabVIEW.

The effects of crystal proximity and crystal-binder adhesion on the thermal responses of ultrasonically-excited composite energetic materials

NASA Astrophysics Data System (ADS)

Roberts, Z. A.; Casey, A. D.; Gunduz, I. E.; Rhoads, J. F.; Son, S. F.

2017-12-01

Composite energetic materials have been shown to generate heat under certain ultrasonic excitations, enough to drive rapid reactions in some cases. In an attempt to isolate the proposed heat generation mechanisms of frictional and viscoelastic heating at crystal-crystal and crystal-binder interfaces, a systematic study was conducted with cyclotetramethylene-tetranitramine crystals arranged as discrete inclusions within Sylgard 184 binder. Groups of three embedded crystals, or "triads," were arranged in two geometries with the crystals either in contact or slightly separated. Additionally, samples with good crystal-binder adhesion as well as ones mechanically debonded using compression were considered. The samples were excited ultrasonically with a contact piezoelectric transducer, and the top surface of each sample was monitored via infrared thermography. The contacting triads showed evidence of an intense localized heat source conducting to the polymer surface above the crystal locations in contrast to the separated triads. The debonded samples of both types reached higher maximum surface temperatures, on average. The results of both two-way and nested analysis of variance indicate a statistically significant difference for both adhesion and separation distance on temperature rise. We conclude that friction between crystal contact points and a debonded, moving binder at the crystal interface (also a mode of friction) play a significant role in localized heat generation, while viscoelastic/viscoplastic heating appears comparatively minor for these specific excitation conditions. The significance of frictional heat generation over viscoelastic heating in these systems may influence future design considerations related to the selection of binder materials for composite energetic materials.

The energetics of adhesion in composite materials

NASA Astrophysics Data System (ADS)

Harding, Philip Hiram

Composite materials are used throughout modern society, and often the most important parameter in determining their properties is the adhesion at material interfaces within the composite. A broad investigation is completed, the global objective of which is to develop understanding of the role of adhesion in composite materials. The scope of this study ranges from macroscopic effects of adhesion on filled polymer composites to microscopic adhesion measurements with engineered interfaces. The surface of a filler material is systematically modified and surface characterization techniques are used to quantify the influence of the surface treatments on surface energetics and wetting properties. Filled polymer composites are prepared and composite mechanical properties determined with beam deflection tests. Filler surface treatments significantly alter the composite yield stress for composites which fail interfacially and are observed to increase or decrease mechanical strength, depending on the chemical nature of the modification. Thermodynamic adhesion mechanisms active at the filler-matrix interfaces are then explored by making direct interfacial strength measurements whereby a single spherical particle is introduced into the polymeric matrix. Interfacial strength is determined by submitting the single-particle composite (SPC) to uni-axial tension and relating the macroscopic stress at interfacial failure to that experienced at the interface. The technique provides a measurement of interfacial strength between two elastic materials, one unaffected by frictional forces, viscoelasticity, and thermal stresses. The SPC measurements are used to verify proposed adhesion mechanisms at the various filler-polymer interfaces and establish the role of adhesion in the filled polymer composites. The SPC technique is then used to investigate the adhesion promotion mechanism of organofunctional silanes, which are shown to be controlled by the compatibility and penetration of the silane organofunctional group. The effects of thermal residual stresses on interfacial strength are also investigated using the SPC technique. Processing conditions, i.e., time-temperature profiles, are used to systematically vary the thermal residual stresses within the polymeric matrix. The interfaces studied are deleteriously affected by increases in thermal residual stresses.

A numerical study on optimising the cryosurgical process for effective tumour necrosis

NASA Astrophysics Data System (ADS)

Ramajayam, K. K.; Kumar, A.; Sarangi, S. K.; Thirugnanam, A.

2017-05-01

This study presents the concept of improving the efficacy of cryosurgery using a low thermal conductivity liquid around the interface of a tumour. In the same context, perfluorohexane, a low thermal conductivity liquid has been used for the insulation of tumour. In the presence of a perfluorohexane layer, results demonstrate that the lethal front and the freezing front do not cross the tumour boundary. The results of numerical modelling indicate that there is an optimal thickness of the perfluorohexane layer which enables a perfect insulation to the tumour. Further, the contour plot presents that the optimal thickness of the perfluorohexane layer is 1 mm. The results also suggest that the lethal front reaches the tumour boundary at 100 s when perfluorohexane is used as an insulation at the tumour boundary. It is seen that a change in the thermal conductivity of the insulation at the tumour interface affects the lethal front propagation drastically. Among perfluorohexane, octafluoropropane and water, this study reveals perfluorohexane as the best substitute for the formation of the insulating layer at the tumour interface. The lower thermal conductivity of perfluorohexane provides a good barrier to the healthy tissue surrounding the tumour (as seen from the comparison of gap, i.e. the distance between the lethal front and the tumour interface). Furthermore, the calculation of gap indicates the most optimal configuration for cooling the tumour (termed as the optimal offset). In conclusion, the results presented in the study help in optimising the layer thickness at the tumour interface, the identification of an appropriate substance for making the layer and the use of gap to evaluate the most optimal configuration for freezing the tumours effectively.

Evolution of the interfacial perpendicular magnetic anisotropy constant of the Co2FeAl/MgO interface upon annealing

NASA Astrophysics Data System (ADS)

Conca, A.; Niesen, A.; Reiss, G.; Hillebrands, B.

2018-04-01

We investigate a series of films with different thickness of the Heusler alloy Co2FeAl in order to study the effect of annealing on the interface with a MgO layer and on the bulk magnetic properties. Our results reveal that while the perpendicular interface anisotropy constant K\\perpS is zero for the as-deposited samples, its value increases with annealing up to a value of 1.14 +/- 0.07 mJ m‑2 for the series annealed at 320 °C and of 2.01 +/- 0.7 mJ m‑2 for the 450 °C annealed series owing to a strong modification of the interface during the thermal treatment. This large value ensures a stabilization of a perpendicular magnetization orientation for an extrapolated thickness below 1.7 nm. The data additionally shows that the in-plane biaxial anisotropy constant has a different evolution with thickness in as-deposited and annealed systems. The Gilbert damping parameter α shows minima for all series for a thickness of 40 nm and an absolute minimum value of 2.8+/-0.1×10-3 . The thickness dependence is explained in terms of an inhomogeneous magnetization state generated by the interplay between the different anisotropies of the system and by the crystalline disorder.

Relationship between negative differential thermal resistance and asymmetry segment size

NASA Astrophysics Data System (ADS)

Kong, Peng; Hu, Tao; Hu, Ke; Jiang, Zhenhua; Tang, Yi

2018-03-01

Negative differential thermal resistance (NDTR) was investigated in a system consisting of two dissimilar anharmonic lattices exemplified by Frenkel-Kontorova (FK) lattices and Fremi-Pasta-Ulam (FPU) lattices (FK-FPU). The previous theoretical and numerical simulations show the dependence of NDTR are the coupling constant, interface and system size, but we find the segment size also to be an important element. It’s interesting that NDTR region depends on FK segment size rather than FPU segment size in this coupling FK-FPU model. Remarkably, we could observe that NDTR appears in the strong interface coupling strength case which is not NDTR in previous studies. The results are conducive to further developments in designing and fabricating thermal devices.

Orion Passive Thermal Control Overview

NASA Technical Reports Server (NTRS)

Miller, Stephen W.

2007-01-01

An viewgraph presentation of Orion's passive thermal control system is shown. The topics include: 1) Orion in CxP Hierarchy; 2) General Orion Description/Orientation; 3) Module Descriptions and Images; 4) Orion PTCS Overview; 5) Requirements/Interfaces; 6) Design Reference Missions; 7) Natural Environments; 8) Thermal Models; 9) Challenges/Issues; and 10) Testing

Artificial nacre-like papers based on noncovalent functionalized boron nitride nanosheets with excellent mechanical and thermally conductive properties

NASA Astrophysics Data System (ADS)

Zeng, Xiaoliang; Ye, Lei; Yu, Shuhui; Li, Hao; Sun, Rong; Xu, Jianbin; Wong, Ching-Ping

2015-04-01

Inspired by the nano/microscale hierarchical structure and the precise inorganic/organic interface of natural nacre, we fabricated artificial nacre-like papers based on noncovalent functionalized boron nitride nanosheets (NF-BNNSs) and poly(vinyl alcohol) (PVA) via a vacuum-assisted self-assembly technique. The artificial nacre-like papers exhibit excellent tensile strength (125.2 MPa), on a par with that of the natural nacre, and moreover display a 30% higher toughness (2.37 MJ m-3) than that of the natural nacre. These excellent mechanical properties result from an ordered `brick-and-mortar' arrangement of NF-BNNSs and PVA, in which the long-chain PVA molecules act as the bridge to link NF-BNNSs via hydrogen bonds. The resulting papers also render high thermal conductivity (6.9 W m-1 K-1), and reveal their superiority as flexible substrates to support light-emitting-diode chips. The combined mechanical and thermal properties make the materials highly desirable as flexible substrates for next-generation commercial portable electronics.Inspired by the nano/microscale hierarchical structure and the precise inorganic/organic interface of natural nacre, we fabricated artificial nacre-like papers based on noncovalent functionalized boron nitride nanosheets (NF-BNNSs) and poly(vinyl alcohol) (PVA) via a vacuum-assisted self-assembly technique. The artificial nacre-like papers exhibit excellent tensile strength (125.2 MPa), on a par with that of the natural nacre, and moreover display a 30% higher toughness (2.37 MJ m-3) than that of the natural nacre. These excellent mechanical properties result from an ordered `brick-and-mortar' arrangement of NF-BNNSs and PVA, in which the long-chain PVA molecules act as the bridge to link NF-BNNSs via hydrogen bonds. The resulting papers also render high thermal conductivity (6.9 W m-1 K-1), and reveal their superiority as flexible substrates to support light-emitting-diode chips. The combined mechanical and thermal properties make the materials highly desirable as flexible substrates for next-generation commercial portable electronics. Electronic supplementary information (ESI) available: TEM images of NF-BNNSs, Raman spectra of raw h-BN and BNNSs, TGA curves of raw BN and NF-BNNSs, XRD patterns of NF-BNNS-PVA papers and pure BNNS papers, optical images of NF-BNNS-PVA papers and pure BNNS papers, TGA curves of NF-BNNS-PVA papers, stress-strain curves of the NF-BNNS-PMMA papers as a function of PMMA contents, typical DSC curves of blank, sapphire, and samples to calculate the CP of samples, measurement of in-plane thermal conductivity, summary of the mechanical properties of the papers measured by tensile testing, comparison of mechanical properties of our artificial nacre with the natural nacre and the reported graphene and graphene oxide papers, a summary of the detailed sample information and thermal properties. See DOI: 10.1039/c5nr00228a

Instability of evaporation fronts in the interstellar medium

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Jeong-Gyu; Kim, Woong-Tae, E-mail: jgkim@astro.snu.ac.kr, E-mail: wkim@astro.snu.ac.kr

2013-12-10

The neutral component of the interstellar medium is segregated into the cold neutral medium (CNM) and warm neutral medium (WNM) as a result of thermal instability. It was found that a plane-parallel CNM-WNM evaporation interface, across which the CNM undergoes thermal expansion, is linearly unstable to corrugational disturbances, in complete analogy with the Darrieus-Landau instability (DLI) of terrestrial flames. We perform a full linear stability analysis as well as nonlinear hydrodynamic simulations of the DLI of such evaporation fronts in the presence of thermal conduction. We find that the DLI is suppressed at short length scales by conduction. The lengthmore » and time scales of the fastest growing mode are inversely proportional to the evaporation flow speed of the CNM and its square, respectively. In the nonlinear stage, the DLI saturates to a steady state where the front deforms to a finger-like shape protruding toward the WNM, without generating turbulence. The evaporation rate at nonlinear saturation is larger than the initial plane-parallel value by a factor of ∼2.4 when the equilibrium thermal pressure is 1800 k {sub B} cm{sup –3} K. The degrees of front deformation and evaporation-rate enhancement at nonlinear saturation are determined primarily by the density ratio between the CNM and WNM. We demonstrate that the Field length in the thermally unstable medium should be resolved by at least four grid points to obtain reliable numerical outcomes involving thermal instability.« less

Dominant phonon polarization conversion across dimensionally mismatched interfaces: Carbon-nanotube-graphene junction

NASA Astrophysics Data System (ADS)

Shi, Jingjing; Lee, Jonghoon; Dong, Yalin; Roy, Ajit; Fisher, Timothy S.; Ruan, Xiulin

2018-04-01

Dimensionally mismatched interfaces are emerging for thermal management applications, but thermal transport physics remains poorly understood. Here we consider the carbon-nanotube-graphene junction, which is a dimensionally mismatched interface between one- and two-dimensional materials and is the building block for carbon-nanotube (CNT)-graphene three-dimensional networks. We predict the transmission function of individual phonon modes using the wave packet method; surprisingly, most incident phonon modes show predominantly polarization conversion behavior. For instance, longitudinal acoustic (LA) polarizations incident from CNTs transmit mainly into flexural transverse (ZA) polarizations in graphene. The frequency stays the same as the incident mode, indicating elastic transmission. Polarization conversion is more significant as the phonon wavelength increases. We attribute such unique phonon polarization conversion behavior to the dimensional mismatch across the interface, and it opens significantly new phonon transport channels as compared to existing theories where polarization conversion is neglected.

Cyclic Failure Mechanisms of Thermal and Environmental Barrier Coating Systems Under Thermal Gradient Test Conditions

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Lee, Kang N.; Miller, Robert A.

2002-01-01

Plasma-sprayed ZrO2-8wt%Y2O3 and mullite+BSAS/Si multilayer thermal and environmental barrier coating (TBC-EBC) systems on SiC/SiC ceramic matrix composite (CMC) substrates were thermally cyclic tested under high thermal gradients using a laser high-heat-flux rig in conjunction with furnace exposure in water-vapor environments. Coating sintering and interface damage were assessed by monitoring the real-time thermal conductivity changes during the laser heat-flux tests and by examining the microstructural changes after exposure. Sintering kinetics of the coating systems were also independently characterized using a dilatometer. It was found that the coating failure involved both the time-temperature dependent sintering and the cycle frequency dependent cyclic fatigue processes. The water vapor environments not only facilitated the initial coating conductivity increases due to enhanced sintering and interface reaction, but also promoted later conductivity reductions due to the accelerated coating cracking and delamination. The failure mechanisms of the coating systems are also discussed based on the cyclic test results and are correlated to the sintering and thermal stress behavior under the thermal gradient test conditions.

The Neural-fuzzy Thermal Error Compensation Controller on CNC Machining Center

NASA Astrophysics Data System (ADS)

Tseng, Pai-Chung; Chen, Shen-Len

The geometric errors and structural thermal deformation are factors that influence the machining accuracy of Computer Numerical Control (CNC) machining center. Therefore, researchers pay attention to thermal error compensation technologies on CNC machine tools. Some real-time error compensation techniques have been successfully demonstrated in both laboratories and industrial sites. The compensation results still need to be enhanced. In this research, the neural-fuzzy theory has been conducted to derive a thermal prediction model. An IC-type thermometer has been used to detect the heat sources temperature variation. The thermal drifts are online measured by a touch-triggered probe with a standard bar. A thermal prediction model is then derived by neural-fuzzy theory based on the temperature variation and the thermal drifts. A Graphic User Interface (GUI) system is also built to conduct the user friendly operation interface with Insprise C++ Builder. The experimental results show that the thermal prediction model developed by neural-fuzzy theory methodology can improve machining accuracy from 80µm to 3µm. Comparison with the multi-variable linear regression analysis the compensation accuracy is increased from ±10µm to ±3µm.

Dilute condition corrosion behavior of glass-ceramic waste form

DOE PAGES

Crum, Jarrod V.; Neeway, James J.; Riley, Brian J.; ...

2016-08-11

Borosilicate glass-ceramics are being developed to immobilize high-level waste generated by aqueous reprocessing into a stable waste form. The corrosion behavior of this multiphase waste form is expected to be complicated by multiple phases and crystal-glass interfaces. A modified single-pass flow-through test was performed on polished monolithic coupons at a neutral pH (25 °C) and 90 °C for 33 d. The measured glass corrosion rates by micro analysis in the samples ranged from 0.019 to 0.29 g m -2 d -1 at a flow rate per surface area = 1.73 × 10 -6 m s -1. The crystal phases (oxyapatitemore » and Ca-rich powellite) corroded below quantifiable rates, by micro analysis. While, Ba-rich powellite corroded considerably in O10 sample. The corrosion rates of C1 and its replicate C20 were elevated an order of magnitude by mechanical stresses at crystal-glass interface caused by thermal expansion mismatch during cooling and unique morphology (oxyapatite clustering).« less

Dilute condition corrosion behavior of glass-ceramic waste form

DOE Office of Scientific and Technical Information (OSTI.GOV)

Crum, Jarrod V.; Neeway, James J.; Riley, Brian J.

Borosilicate glass-ceramics are being developed to immobilize high-level waste generated by aqueous reprocessing into a stable waste form. The corrosion behavior of this multiphase waste form is expected to be complicated by multiple phases and crystal-glass interfaces. A modified single-pass flow-through test was performed on polished monolithic coupons at a neutral pH (25 °C) and 90 °C for 33 d. The measured glass corrosion rates by micro analysis in the samples ranged from 0.019 to 0.29 g m -2 d -1 at a flow rate per surface area = 1.73 × 10 -6 m s -1. The crystal phases (oxyapatitemore » and Ca-rich powellite) corroded below quantifiable rates, by micro analysis. While, Ba-rich powellite corroded considerably in O10 sample. The corrosion rates of C1 and its replicate C20 were elevated an order of magnitude by mechanical stresses at crystal-glass interface caused by thermal expansion mismatch during cooling and unique morphology (oxyapatite clustering).« less

Effect of surface tension anisotropy on cellular morphologies

NASA Technical Reports Server (NTRS)

Mcfadden, G. B.; Coriell, S. R.; Sekerka, R. F.

1988-01-01

A three-dimensional weakly nonlinear analysis for conditions near the onset of instability at the crystal-melt interface was carried out to second order, taking into account the effects of latent heat generation and surface-tension anisotropy of the crystal-melt interface; particular consideration was given to the growth of a cubic crystal in the 001-, 011-, and 111-line directions. Numerical calculations by McFadden et al. (1987), performed for an aluminum-chromium alloy with the assumption of a linear temperature field and an isotropic surface tension, showed that only hexagonal nodes (and not hexagonal cells) occurred near the onset of instability. The results of the present analysis indicate that the nonlinear temperature field (which occurs when thermal conductivities of the crystal and the melt are different and/or the latent heat effects are not negligible) can modify this result and, for certain alloys and processing conditions, can cause the occurrence of hexagonal cells near the onset of instability.

The physics and chemistry of graphene-on-surfaces.

PubMed

Zhao, Guoke; Li, Xinming; Huang, Meirong; Zhen, Zhen; Zhong, Yujia; Chen, Qiao; Zhao, Xuanliang; He, Yijia; Hu, Ruirui; Yang, Tingting; Zhang, Rujing; Li, Changli; Kong, Jing; Xu, Jian-Bin; Ruoff, Rodney S; Zhu, Hongwei

2017-07-31

Graphene has demonstrated great potential in next-generation electronics due to its unique two-dimensional structure and properties including a zero-gap band structure, high electron mobility, and high electrical and thermal conductivity. The integration of atom-thick graphene into a device always involves its interaction with a supporting substrate by van der Waals forces and other intermolecular forces or even covalent bonding, and this is critical to its real applications. Graphene films on different surfaces are expected to exhibit significant differences in their properties, which lead to changes in their morphology, electronic structure, surface chemistry/physics, and surface/interface states. Therefore, a thorough understanding of the surface/interface properties is of great importance. In this review, we describe the major "graphene-on-surface" structures and examine the roles of their properties and related phenomena in governing the overall performance for specific applications including optoelectronics, surface catalysis, anti-friction and superlubricity, and coatings and composites. Finally, perspectives on the opportunities and challenges of graphene-on-surface systems are discussed.

The microstructural changes of Ge2Sb2Te5 thin film during crystallization process

NASA Astrophysics Data System (ADS)

Xu, Jingbo; Qi, Chao; Chen, Limin; Zheng, Long; Xie, Qiyun

2018-05-01

Phase change memory is known as the most promising candidate for the next generation nonvolatile memory technology. In this paper, the microstructural changes of Ge2Sb2Te5 film, which is the most common choice of phase change memory material, has been carefully studied by the combination of several characterization techniques. The combination of resistance measurements, X-ray diffraction, Raman spectroscopy and X-ray reflectivity allows us to simultaneously extract the characteristics of microstructural changes during crystallization process. The existence of surface/interface Ge2Sb2Te5 layer has been proposed here based on X-ray reflectivity measurements. Although the total film thickness decreases, as a result of the phase transition from amorphous to metastable crystalline cubic and then to the stable hexagonal phase, the surface/interface thickness increases after crystallization. Moreover, the increase of average grain size, density and surface roughness has been confirmed during thermal annealing process.

Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vishwakarma, Vivek; Waghela, Chirag; Wei, Zi

2016-09-25

We report that while Li-ion cells offer excellent electrochemical performance for several applications including electric vehicles, they also exhibit poor thermal transport characteristics, resulting in reduced performance, overheating and thermal runaway. Inadequate heat removal from Li-ion cells originates from poor thermal conductivity within the cell. This paper identifies the rate-limiting material-level process that dominates overall thermal conduction in a Li-ion cell. Results indicate that thermal characteristics of a Li-ion cell are largely dominated by heat transfer across the cathode-separator interface rather than heat transfer through the materials themselves. This interfacial thermal resistance contributes around 88% of total thermal resistance inmore » the cell. Measured value of interfacial resistance is close to that obtained from theoretical models that account for weak adhesion and large acoustic mismatch between cathode and separator. Further, to address this problem, an amine-based chemical bridging of the interface is carried out. This is shown to result in in four-times lower interfacial thermal resistance without deterioration in electrochemical performance, thereby increasing effective thermal conductivity by three-fold. This improvement is expected to reduce peak temperature rise during operation by 60%. Finally, by identifying and addressing the material-level root cause of poor thermal transport in Li-ion cells, this work may contribute towards improved thermal performance of Li-ion cells.« less

Formal analysis and automatic generation of user interfaces: approach, methodology, and an algorithm.

PubMed

Heymann, Michael; Degani, Asaf

2007-04-01

We present a formal approach and methodology for the analysis and generation of user interfaces, with special emphasis on human-automation interaction. A conceptual approach for modeling, analyzing, and verifying the information content of user interfaces is discussed. The proposed methodology is based on two criteria: First, the interface must be correct--that is, given the interface indications and all related information (user manuals, training material, etc.), the user must be able to successfully perform the specified tasks. Second, the interface and related information must be succinct--that is, the amount of information (mode indications, mode buttons, parameter settings, etc.) presented to the user must be reduced (abstracted) to the minimum necessary. A step-by-step procedure for generating the information content of the interface that is both correct and succinct is presented and then explained and illustrated via two examples. Every user interface is an abstract description of the underlying system. The correspondence between the abstracted information presented to the user and the underlying behavior of a given machine can be analyzed and addressed formally. The procedure for generating the information content of user interfaces can be automated, and a software tool for its implementation has been developed. Potential application areas include adaptive interface systems and customized/personalized interfaces.

Thermal analysis of a growing crystal in an aqueous solution

NASA Astrophysics Data System (ADS)

Shiomi, Yuji; Kuroda, Toshio; Ogawa, Tomoya

1980-10-01

The temperature profiles around growing crystals in aqueous solutions of Rochelle salt were measured with accuracy of 0.005°C in a two-dimensional cell which was used for elimination of thermal convection current in the cell. The temperature distribution became stationary after 2 h from injection of the mother liquid, but the concentration distribution did not become stationary because the diffusion constant of solute in the solution was much smaller than the thermal diffusivity of the solution. The growth rate was linearly proportional to the temperature gradient at every growing interface. Since crystal growth is a typical interaction process between thermal and material flow, the experimental results were analysed by such an interaction model. The analysis confirms that the material flow is limited by diffusion within a layer width of about a few hundreds micrometers on the growing interface.

Creation of a sharp compositional interface in the Pu`u `O`o shallow magma reservoir, Kilauea volcano, Hawai`i

NASA Astrophysics Data System (ADS)

Mittelstaedt, E.; Garcia, M. O.

2006-12-01

Lavas from the early episodes of the Pu`u `O`O eruption (1983-85) of Kilauea Volcano on the island of Hawai'i display rapid compositional variation over short periods for some episodes, especially from the well sampled episode 30 with ~2 wt% MgO variation in <4 hours. Little chemical variation is observed within the episode 30 lavas before or after this abrupt change suggesting a sharp compositional interface within the Pu`u `O`o dike-like shallow reservoir. The change in lava composition throughout the eruption is due to changes in cooling within the dike-like shallow reservoir of Pu`u `O`o. Potential explanations for a sharp interface, such as a reservoir of changing width and changing country rock thermal properties, are evaluated using a simple thermal model of a dike-like body with spatially variable thermal conductivity. The model that best reproduces the compositional data involves a change in thermal conductivity from 2.7 to 11 W m-1 C-1. which is consistent with deep drill hole data in the east rift zone. The change in thermal conductivity may indicate that fluid flow in the east rift zone is restricted at depth possibly by increasing numbers of dikes acting as acuacludes or decreasing pore space due to formation of secondary minerals. Results suggest that country rock thermal gradients can strongly influence magma chemistry in shallow reservoirs.

Modeling the sharp compositional interface in the Pùu ̀Ṑō magma reservoir, Kīlauea volcano, Hawaìi

NASA Astrophysics Data System (ADS)

Mittelstaedt, Eric; Garcia, Michael O.

2007-05-01

Lavas from the early episodes of the Pu`u `Ō`ō eruption (1983-1985) of Kīlauea Volcano on the island of Hawai`i display rapid compositional variation over short periods for some episodes, especially the well-sampled episode 30 with ˜2 wt% MgO variation in <4 hours. Little chemical variation is observed within the episode 30 lavas before or after this abrupt change, suggesting a sharp compositional interface within the Pu`u `Ō`ō dike-like shallow reservoir. Cooling-induced crystal fractionation in this reservoir is thought to be the main control on intraepisode compositional variation. Potential explanations for a sharp interface, such as changing reservoir width and wall rock thermal properties, are evaluated using a simple thermal model of a dike-like body surrounded by wall rock with spatially variable thermal conductivity. The model that best reproduces the compositional data involves a change in wall rock thermal conductivity from 2.7 to 9 W m-1 C-1, which is consistent with deep drill hole data in the east rift zone. The change in thermal conductivity may indicate that fluid flow in the east rift zone is restricted to shallow depths possibly by increasing numbers of dikes acting as aquicludes and/or decreasing pore space due to formation of secondary minerals. Results suggest that wall rock thermal gradients can strongly influence magma chemistry in shallow reservoirs.

The PLATO Dome A site-testing observatory: power generation and control systems.

PubMed

Lawrence, J S; Ashley, M C B; Hengst, S; Luong-Van, D M; Storey, J W V; Yang, H; Zhou, X; Zhu, Z

2009-06-01

The atmospheric conditions above Dome A, a currently unmanned location at the highest point on the Antarctic plateau, are uniquely suited to astronomy. For certain types of astronomy Dome A is likely to be the best location on the planet, and this has motivated the development of the Plateau Observatory (PLATO). PLATO was deployed to Dome A in early 2008. It houses a suite of purpose-built site-testing instruments designed to quantify the benefits of Dome A site for astronomy, and science instruments designed to take advantage of the observing conditions. The PLATO power generation and control system is designed to provide continuous power and heat, and a high-reliability command and communications platform for these instruments. PLATO has run and collected data throughout the winter 2008 season completely unattended. Here we present a detailed description of the power generation, power control, thermal management, instrument interface, and communications systems for PLATO, and an overview of the system performance for 2008.

The PLATO Dome A site-testing observatory: Power generation and control systems

NASA Astrophysics Data System (ADS)

Lawrence, J. S.; Ashley, M. C. B.; Hengst, S.; Luong-van, D. M.; Storey, J. W. V.; Yang, H.; Zhou, X.; Zhu, Z.

2009-06-01

The atmospheric conditions above Dome A, a currently unmanned location at the highest point on the Antarctic plateau, are uniquely suited to astronomy. For certain types of astronomy Dome A is likely to be the best location on the planet, and this has motivated the development of the Plateau Observatory (PLATO). PLATO was deployed to Dome A in early 2008. It houses a suite of purpose-built site-testing instruments designed to quantify the benefits of Dome A site for astronomy, and science instruments designed to take advantage of the observing conditions. The PLATO power generation and control system is designed to provide continuous power and heat, and a high-reliability command and communications platform for these instruments. PLATO has run and collected data throughout the winter 2008 season completely unattended. Here we present a detailed description of the power generation, power control, thermal management, instrument interface, and communications systems for PLATO, and an overview of the system performance for 2008.

Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jiang, Longtao, E-mail: longtaojiang@163.com; Wang, Pingping; Xiu, Ziyang

2015-08-15

In this work, aluminum matrix composites reinforced with diamond particles (diamond/aluminum composites) were fabricated by squeeze casting method. The material exhibited a thermal conductivity as high as 613 W / (m · K). The obtained composites were investigated by scanning electron microscope and transmission electron microscope in terms of the (100) and (111) facets of diamond particles. The diamond particles were observed to be homogeneously distributed in the aluminum matrix. The diamond{sub (111)}/Al interface was found to be devoid of reaction products. While at the diamond{sub (100)}/Al interface, large-sized aluminum carbides (Al{sub 4}C{sub 3}) with twin-crystal structure were identified. Themore » interfacial characteristics were believed to be responsible for the excellent thermal conductivity of the material. - Graphical abstract: Display Omitted - Highlights: • Squeeze casting method was introduced to fabricate diamond/Al composite. • Sound interfacial bonding with excellent thermal conductivity was produced. • Diamond{sub (111)}/ aluminum interface was firstly characterized by TEM/HRTEM. • Physical combination was the controlling bonding for diamond{sub (111)}/aluminum. • The growth mechanism of Al{sub 4}C{sub 3} was analyzed by crystallography theory.« less

Directional Solidification of Pure Succinonitrile and a Succinonitrile-Acetone Alloy

NASA Technical Reports Server (NTRS)

Simpson, James E.; deGroh, Henry C., III; Garimella, Suresh V.

1999-01-01

An experimental study of the horizontal Bridgman growth of pure succinonitrile (SCN) and of a succinonitrile-1.0 mol.% acetone alloy (SCN-1.0 mol.% ACE) has been performed. Experiments involving both a stationary thermal field (no-growth case) and a translating thermal field (growth case) were conducted. Growth rates of 2 and 40 micrometers/s were investigated. For the pure SCN experiments, the velocity field in the melt was estimated using video images of seed particles in the melt. Observations of the seed particles indicate that a primary longitudinal convective cell is formed. The maximum velocity of two different particles which traveled along similar paths was the same and equal to 1.49 +/- 0.01 mm/s. The general accuracy of velocity measurements is estimated to be +/- 0.08 mm/s, though the data shows consistency to within +/- 0.02 mm/s. The shape of the solid/liquid interface was also quantitatively determined. The solid/liquid interface was stable (non-dendritic and non-cellular) but not flat; rather it was significantly distorted by the influence of convection in (he melt and, for the growth case, by the moving temperature boundary conditions along the ampoule. It was found that the interface shape and position were highly dependent on the alignment of the ampoule in the apparatus. Consequently, the ampoule was carefully aligned for all experiments. The values for front location agree with those determined in previous experiments. For the alloy experiments, the solid/liquid interface was determined to be unstable at growth rates greater than 2.8 micrometers/s, but stable for the cases of no-growth and growth at 2 micrometers/s. When compared to the shape of the pure SCN interface, the alloy interface forms closer to the cold zone, indicating that the melting temperature decreased due to the alloying element. Extensive temperature measurements were performed on the outside of the ampoule containing pure SCN. The resulting thermal profiles are presented in detail in the results section. It is intended that the interface shape, thermal boundary condition and velocity data presented in this paper be used to test numerical simulations.

Directional Solidification of Pure Succinonitrile and a Succinonitrile-Acetone Alloy

NASA Technical Reports Server (NTRS)

Simpson, James E.; deGroh, Henry C., III; Garimella, Suresh V.

2000-01-01

An experimental study of the horizontal Bridgman growth of pure succinonitrile (SCN) and of a succinonitrile-1.0 mol% acetone alloy (SCN-1.0 mol.% ACE) has been performed. Experiments involving both a stationary thermal field (no-growth case) and a translating thermal field (growth case) were conducted. Growth rates of 2 and 40 micrometers/sec were investigated. For the pure SCN experiments, the velocity field in the melt was estimated using video images of seed particles in the melt. Observations of the seed particles indicate that a primary longitudinal convective cell is formed. The maximum velocity of two different particles which traveled along similar paths was the same and equal to 1.49 +/- 0.01 mm/s. The general accuracy of velocity measurements is estimated to be +/-0.08 mm/s, though the data shows consistency to within +/- 0.02 mm/s. The shape of the solid/liquid interface was also quantitatively determined. The solid/liquid interface was stable (non-dendritic and non-cellular) but not flat: rather it was significantly distorted by the influence of connection in the melt and, for the growth case, by the moving temperature boundary conditions along the ampoule. It was found that the interface shape and position were highly dependent on the alignment of the ampoule in the apparatus. Consequently, the ampoule was carefully aligned for all experiments. The values for front location agree with those determined in previous experiments. For the alloy experiments, the solid/liquid interface was determined to be unstable at growth rates greater than 2.8 micrometers/sec, but stable for the cases of no-growth and growth at 2 micrometers/sec. When compared to the shape of the pure SCN interface, the alloy interface forms closer to the cold zone, indicating that the melting temperature decreased due to the alloying element. Extensive temperature measurements were performed on the outside of the ampoule containing pure SCN. The resulting thermal profiles are presented in detail in the results section. It is intended that the interface shape, thermal boundary condition, and velocity data presented in this paper be used to test numerical simulations.

Specificity Switching Pathways in Thermal and Mass Evaporation of Multicomponent Hydrocarbon Droplets: A Mesoscopic Observation.

PubMed

Nasiri, Rasoul; Luo, Kai H

2017-07-10

For well over one century, the Hertz-Knudsen equation has established the relationship between thermal - mass transfer coefficients through a liquid - vapour interface and evaporation rate. These coefficients, however, have been often separately estimated for one-component equilibrium systems and their simultaneous influences on evaporation rate of fuel droplets in multicomponent systems have yet to be investigated at the atomic level. Here we first apply atomistic simulation techniques and quantum/statistical mechanics methods to understand how thermal and mass evaporation effects are controlled kinetically/thermodynamically. We then present a new development of a hybrid method of quantum transition state theory/improved kinetic gas theory, for multicomponent hydrocarbon systems to investigate how concerted-distinct conformational changes of hydrocarbons at the interface affect the evaporation rate. The results of this work provide an important physical concept in fundamental understanding of atomistic pathways in topological interface transitions of chain molecules, resolving an open problem in kinetics of fuel droplets evaporation.

Effects of fluoride residue on thermal stability in Cu/porous low-k interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kobayashi, Y.; Ozaki, S.; Nakamura, T.

2014-06-19

We have investigated the effects of fluoride residue on the thermal stability of a Cu/barrier metal (BM)/porous low-k film (k < 2.3) structure. We confirmed that the Cu agglomerated more on a BM/inter layer dielectric (ILD) with a fluoride residue. To consider the effect of fluoride residue on Cu agglomeration, the structural state at the Cu/BM interface was evaluated with a cross-section transmission electron microscope (TEM) and atomic force microscope (AFM). In addition, the chemical bonding state at the Cu/BM interface was evaluated with the interface peeling-off method and X-ray photoelectron spectroscopy (XPS). Moreover, we confirmed the ionization of fluoridemore » residue and oxidation of Cu with fluoride and moisture to clarify the effect of fluoride residue on Cu. Our experimental results indicated that the thermal stability in Cu/porous low-k interconnects was degraded by enhancement of Cu oxidation with fluoride ions diffusion as an oxidizing catalyst.« less

Enhancing the ballistic thermal transport of silicene through smooth interface coupling

NASA Astrophysics Data System (ADS)

Chen, Chao-Yu; She, Yanchao; Xiao, Huaping; Ding, Jianwen; Cao, Juexian; Guo, Zhi-Xin

2016-04-01

We have performed nonequilibrium molecular dynamics calculations on the length (L ) dependence of thermal conductivity (K ) of silicene both supported on and sandwiched between the smooth surfaces, i.e. h-BN, at room temperature. We find that K of silicene follows a power law K\\propto {{L}β} , with β increasing from about 0.3-0.4 under the effect of interface coupling, showing an enhancement of the ballistic thermal transport of silicene. We also find that β can be further increased to about 0.6 by increasing the interface coupling strength for the silicene sandwiched between h-BN. The increase of β for the supported case is found to come from the variation of the flexural acoustic (ZA) phonon mode and the first optical phonon mode induced by the substrate, whereas the unusual increase of β for the sandwiched case is attributed to the increment of velocities of all three acoustic phonon modes. These findings provide an interesting route for manipulating the ballistic energy flow in nanomaterials.

Interface and properties of inorganic fullerene tungsten sulphide nanoparticle reinforced poly (ether ether ketone) nanocomposites

NASA Astrophysics Data System (ADS)

Wang, Nannan; Yang, Zhuxian; Wang, Yuan; Thummavichai, Kunyapat; Xia, Yongde; Ghita, Oana; Zhu, Yanqiu

We report a simple and effective method to fabricate PEEK (poly ether ether ketone)/IF-WS2 (Inorganic Fullerene Tungsten Sulphide) nanocomposites with IF-WS2 content up to 8 wt%. We have used electron microscopies to characterise the morphology and structural features of the nancomposites, and FTIR and XPS to show that some chemical interface bondings were formed between the PEEK and IF-WS2. We demonstrate that the resulting PEEK/IF-WS2 nanocomposites showed an extraordinary 190% increase in thermal conductivity, 50 °C higher in degradation temperature, and mild improvements in strength and hardness. The increased degradation activation energy from 64 to 76 kJ/mol for neat PEEK and PEEK/IF-WS2 nanocomposites, respectively, is attributed to the synergistic interface between the PEEK matrix and IF-WS2 nanoparticles. The enhancements in both the mechanical and thermal properties will significantly expand the capacities of PEEK-based nanocomposites towards applications where thermal conductivity and stability are important.

Living Together in Space: The International Space Station Internal Active Thermal Control System Issues and Solutions-Sustaining Engineering Activities at the Marshall Space Flight Center From 1998 to 2005

NASA Technical Reports Server (NTRS)

Wieland, P. O.; Roman, M. C.; Miller, L.

2007-01-01

On board the International Space Station, heat generated by the crew and equipment is removed by the internal active thermal control system to maintain a comfortable working environment and prevent equipment overheating. Test facilities simulating the internal active thermal control system (IATCS) were constructed at the Marshall Space Flight Center as part of the sustaining engineering activities to address concerns related to operational issues, equipment capability, and reliability. A full-scale functional simulator of the Destiny lab module IATCS was constructed and activated prior to launch of Destiny in 2001. This facility simulates the flow and thermal characteristics of the flight system and has a similar control interface. A subscale simulator was built, and activated in 2000, with special attention to materials and proportions of wetted surfaces to address issues related to changes in fluid chemistry, material corrosion, and microbial activity. The flight issues that have arisen and the tests performed using the simulator facilities are discussed in detail. In addition, other test facilities at the MSFC have been used to perform specific tests related to IATCS issues. Future testing is discussed as well as potential modifications to the simulators to enhance their utility.

Hybrid graphene/silicon Schottky photodiode with intrinsic gating effect

NASA Astrophysics Data System (ADS)

Di Bartolomeo, Antonio; Luongo, Giuseppe; Giubileo, Filippo; Funicello, Nicola; Niu, Gang; Schroeder, Thomas; Lisker, Marco; Lupina, Grzegorz

2017-06-01

We propose a hybrid device consisting of a graphene/silicon (Gr/Si) Schottky diode in parallel with a Gr/SiO2/Si capacitor for high-performance photodetection. The device, fabricated by transfer of commercial graphene on low-doped n-type Si substrate, achieves a photoresponse as high as 3 \\text{A} {{\\text{W}}-1} and a normalized detectivity higher than 3.5× {{10}12} \\text{cm} \\text{H}{{\\text{z}}1/2} {{\\text{W}}-1} in the visible range. It exhibits a photocurrent exceeding the forward current because photo-generated minority carriers, accumulated at Si/SiO2 interface of the Gr/SiO2/Si capacitor, diffuse to the Gr/Si junction. We show that the same mechanism, when due to thermally generated carriers, although usually neglected or disregarded, causes the increased leakage often measured in Gr/Si heterojunctions. We perform extensive I-V and C-V characterization at different temperatures and we measure a zero-bias Schottky barrier height of 0.52 eV at room temperature, as well as an effective Richardson constant A **  =  4× {{10}-5} \\text{A} \\text{c}{{\\text{m}}-2} {{\\text{K}}-2} and an ideality factor n≈ 3.6 , explained by a thin (<1 nm) oxide layer at the Gr/Si interface.

Interface Generation and Compositional Verification in JavaPathfinder

NASA Technical Reports Server (NTRS)

Giannakopoulou, Dimitra; Pasareanu, Corina

2009-01-01

We present a novel algorithm for interface generation of software components. Given a component, our algorithm uses learning techniques to compute a permissive interface representing legal usage of the component. Unlike our previous work, this algorithm does not require knowledge about the component s environment. Furthermore, in contrast to other related approaches, our algorithm computes permissive interfaces even in the presence of non-determinism in the component. Our algorithm is implemented in the JavaPathfinder model checking framework for UML statechart components. We have also added support for automated assume-guarantee style compositional verification in JavaPathfinder, using component interfaces. We report on the application of the presented approach to the generation of interfaces for flight software components.

Design and performance of radioisotope space power systems based on OSC multitube AMTEC converter designs

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schock, A.; Noravian, H.; Or, C.

1997-12-31

This paper extends the analytical procedure described in another paper in these proceedings to analyze a variety of compact and light-weight OSC-designed radioisotope-heated generators. Those generators employed General Purpose Heat Source (GPHS) modules and a converter containing sixteen AMTEC cells of OSC`s revised five-tube design with enhanced cell wall reflectivity described in a companion paper in these proceedings. OSC found that the performance of the generator is primarily a function of the thermal insulation between the outside of the generator`s 16 cells and the inside of its wall. After examining a variety of insulation options, it was found that themore » generator`s performance is optimized by employing a hybrid insulation system, in which the space between the cells is filled with fibrous Min-K insulation, and the generator walls are lined with tapered (i.e., graded-length) multifoil insulation. The OSC design results in a very compact generator, with eight AMTEC cells on each end of the heat source stack. The choice of the five-tube cells makes it possible to expand the BASE tube diameter without increasing the cell diameter. This is important because the eight cells mate well with the stacked GPHS modules. The OSC generator design includes a compliant heat source support and preload arrangement, to hold the heat source modules together during launch, and to maintain thermal contact conductance at the generator`s interfaces despite creep relaxation of its housing. The BOM and EOM (up to 15 years) performances of the revised generators were analyzed for two and three GPHS modules, both for fresh fuel and for aged fuel left over from a spare RTG (Radioisotope Thermoelectric Generator) fueled in 1982. The resulting power outputs were compared with JPL`s latest EOM power demand goals for the Pluto Express and Europa Orbiter missions, and with the generic goals of DOE`s Advanced Radioisotope Power System (ARPS) study. The OSC AMTEC designs yielded system efficiencies three to four times as high as present-generation RTGs.« less

Thermal Fatigue Behavior of Air-Plasma Sprayed Thermal Barrier Coating with Bond Coat Species in Cyclic Thermal Exposure

PubMed Central

Lu, Zhe; Myoung, Sang-Won; Jung, Yeon-Gil; Balakrishnan, Govindasamy; Lee, Jeongseung; Paik, Ungyu

2013-01-01

The effects of the bond coat species on the delamination or fracture behavior in thermal barrier coatings (TBCs) was investigated using the yclic thermal fatigue and thermal-shock tests. The interface microstructures of each TBC showed a good condition without cracking or delamination after flame thermal fatigue (FTF) for 1429 cycles. The TBC with the bond coat prepared by the air-plasma spray (APS) method showed a good condition at the interface between the top and bond coats after cyclic furnace thermal fatigue (CFTF) for 1429 cycles, whereas the TBCs with the bond coats prepared by the high-velocity oxygen fuel (HVOF) and low-pressure plasma spray (LPPS) methods showed a partial cracking (and/or delamination) and a delamination after 780 cycles, respectively. The TBCs with the bond coats prepared by the APS, HVOF and LPPS methods were fully delaminated (>50%) after 159, 36, and 46 cycles, respectively, during the thermal-shock tests. The TGO thickness in the TBCs was strongly dependent on the both exposure time and temperature difference tested. The hardness values were found to be increased only after the CFTF, and the TBC with the bond coat prepared by the APS showed the highest adhesive strength before and after the FTF. PMID:28811441

Metal-Organic-Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances.

PubMed

Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui; King, Charles; Catalano, Massimo; Oh, Jun Kyun; Talib, Ansam J; Scholar, Ethan A; Verkhoturov, Stanislav V; Cagin, Tahir; Sokolov, Alexei V; Kim, Moon J; Matin, Kaiser; Narumanchi, Sreekant; Akbulut, Mustafa

2017-03-22

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix-which are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2-28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38-0.56 mm 2 K/W for a typical bond-line thickness of 30-50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

Impact and Origin of Interface States in MOS Capacitor with Monolayer MoS2 and HfO2 High-k Dielectric

PubMed Central

Xia, Pengkun; Feng, Xuewei; Ng, Rui Jie; Wang, Shijie; Chi, Dongzhi; Li, Cequn; He, Zhubing; Liu, Xinke; Ang, Kah-Wee

2017-01-01

Two-dimensional layered semiconductors such as molybdenum disulfide (MoS2) at the quantum limit are promising material for nanoelectronics and optoelectronics applications. Understanding the interface properties between the atomically thin MoS2 channel and gate dielectric is fundamentally important for enhancing the carrier transport properties. Here, we investigate the frequency dispersion mechanism in a metal-oxide-semiconductor capacitor (MOSCAP) with a monolayer MoS2 and an ultra-thin HfO2 high-k gate dielectric. We show that the existence of sulfur vacancies at the MoS2-HfO2 interface is responsible for the generation of interface states with a density (Dit) reaching ~7.03 × 1011 cm−2 eV−1. This is evidenced by a deficit S:Mo ratio of ~1.96 using X-ray photoelectron spectroscopy (XPS) analysis, which deviates from its ideal stoichiometric value. First-principles calculations within the density-functional theory framework further confirms the presence of trap states due to sulfur deficiency, which exist within the MoS2 bandgap. This corroborates to a voltage-dependent frequency dispersion of ~11.5% at weak accumulation which decreases monotonically to ~9.0% at strong accumulation as the Fermi level moves away from the mid-gap trap states. Further reduction in Dit could be achieved by thermally diffusing S atoms to the MoS2-HfO2 interface to annihilate the vacancies. This work provides an insight into the interface properties for enabling the development of MoS2 devices with carrier transport enhancement. PMID:28084434

Impact and Origin of Interface States in MOS Capacitor with Monolayer MoS2 and HfO2 High-k Dielectric.

PubMed

Xia, Pengkun; Feng, Xuewei; Ng, Rui Jie; Wang, Shijie; Chi, Dongzhi; Li, Cequn; He, Zhubing; Liu, Xinke; Ang, Kah-Wee

2017-01-13

Two-dimensional layered semiconductors such as molybdenum disulfide (MoS 2 ) at the quantum limit are promising material for nanoelectronics and optoelectronics applications. Understanding the interface properties between the atomically thin MoS 2 channel and gate dielectric is fundamentally important for enhancing the carrier transport properties. Here, we investigate the frequency dispersion mechanism in a metal-oxide-semiconductor capacitor (MOSCAP) with a monolayer MoS 2 and an ultra-thin HfO 2 high-k gate dielectric. We show that the existence of sulfur vacancies at the MoS 2 -HfO 2 interface is responsible for the generation of interface states with a density (D it ) reaching ~7.03 × 10 11  cm -2  eV -1 . This is evidenced by a deficit S:Mo ratio of ~1.96 using X-ray photoelectron spectroscopy (XPS) analysis, which deviates from its ideal stoichiometric value. First-principles calculations within the density-functional theory framework further confirms the presence of trap states due to sulfur deficiency, which exist within the MoS 2 bandgap. This corroborates to a voltage-dependent frequency dispersion of ~11.5% at weak accumulation which decreases monotonically to ~9.0% at strong accumulation as the Fermi level moves away from the mid-gap trap states. Further reduction in D it could be achieved by thermally diffusing S atoms to the MoS 2 -HfO 2 interface to annihilate the vacancies. This work provides an insight into the interface properties for enabling the development of MoS 2 devices with carrier transport enhancement.

Interaction of Porosity with a Planar Solid/Liquid Interface

NASA Technical Reports Server (NTRS)

Catalina, Adrian V.; Stefanescu, Doru M.; Sen, Subhayu; Kaukler, William F.

2004-01-01

In this article, an investigation of the interaction between gas porosity and a planar solid/liquid (SL) interface is reported. A two-dimensional numerical model able to accurately track sharp SL interfaces during solidification of pure metals and alloys is proposed. The finite-difference method and a rectangular undeformed grid are used for computation. The SL interface is described through the points of intersection with the grid lines. Its motion is determined by the thermal and solute gradients at each particular point. Changes of the interface temperature because of capillarity or solute redistribution as well as any perturbation of the thermal and solute field produced by the presence of non-metallic inclusions can be computed. To validate the model, the dynamics of the interaction between a gas pore and a solidification front in metal alloys was observed using a state of the art X-ray transmission microscope (XTM). The experiments included observation of the distortion of the SL interface near a pore, real-time measurements of the growth rate, and the change in shape of the porosity during interaction with the SL interface in pure Al and Al-0.25 wt pct Au alloy. In addition, porosity-induced solute segregation patterns surrounding a pore were also quantified.

Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials.

PubMed

Chen, Jin; Huang, Xingyi; Sun, Bin; Wang, Yuxin; Zhu, Yingke; Jiang, Pingkai

2017-09-13

The continuous evolution toward semiconductor technology in the "more-than-Moore" era and rapidly increasing power density of modern electronic devices call for advanced thermal interface materials (TIMs). Here, we report a novel strategy to construct flexible polymer nanocomposite TIMs for advanced thermal management applications. First, aligned polyvinyl alcohol (PVA) supported and interconnected 2D boron nitride nanosheets (BNNSs) composite fiber membranes were fabricated by electrospinning. Then, the nanocomposite TIMs were constructed by rolling the PVA/BNNS composite fiber membranes to form cylinders and subsequently vacuum-assisted impregnation of polydimethylsiloxane (PDMS) into the porous cylinders. The nanocomposite TIMs not only exhibit a superhigh through-plane thermal conductivity enhancement of about 10 times at a low BNNS loading of 15.6 vol % in comparison with the pristine PDMS but also show excellent electrical insulating property (i.e., high volume electrical resistivity). The outstanding thermal management capability of the nanocomposite TIMs was practically confirmed by capturing the surface temperature variations of a working LED chip integrated with the nanocomposite TIMs.

Smoothed dissipative particle dynamics model for mesoscopic multiphase flows in the presence of thermal fluctuations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lei, Huan; Baker, Nathan A.; Wu, Lei

2016-08-05

Thermal fluctuations cause perturbations of fluid-fluid interfaces and highly nonlinear hydrodynamics in multiphase flows. In this work, we develop a novel multiphase smoothed dissipative particle dynamics model. This model accounts for both bulk hydrodynamics and interfacial fluctuations. Interfacial surface tension is modeled by imposing a pairwise force between SDPD particles. We show that the relationship between the model parameters and surface tension, previously derived under the assumption of zero thermal fluctuation, is accurate for fluid systems at low temperature but overestimates the surface tension for intermediate and large thermal fluctuations. To analyze the effect of thermal fluctuations on surface tension,more » we construct a coarse-grained Euler lattice model based on the mean field theory and derive a semi-analytical formula to directly relate the surface tension to model parameters for a wide range of temperatures and model resolutions. We demonstrate that the present method correctly models the dynamic processes, such as bubble coalescence and capillary spectra across the interface.« less

Exploring Novel Spintronic Responses from Advanced Functional Organic Materials

DTIC Science & Technology

2015-11-12

March 20-22, 2014 (8) Interface enhanced photovoltaic and Seebeck effects in organic solar cells and thermoelectric devices DISTRIBUTION A...on thermoelectric effects by using polymer/metal interface-controllable thermal and electric conductions. The project explored a new strategy by using...following major breakthroughs on molecular metamaterials by using spin radicals and on thermoelectric effects by using polymer/metal interface

Implementing a Quantitative Analysis Design Tool for Future Generation Interfaces

DTIC Science & Technology

2012-03-01

with Remotely Piloted Aircraft (RPA) has resulted in the need of a platform to evaluate interface design. The Vigilant Spirit Control Station ( VSCS ...Spirit interface. A modified version of the HCI Index was successfully applied to perform a quantitative analysis of the baseline VSCS interface and...time of the original VSCS interface. These results revealed the effectiveness of the tool and demonstrated in the design of future generation

Design and Construction of a Thermal Contact Resistance and Thermal Conductivity Measurement System

DTIC Science & Technology

2015-09-01

plate interface resistance control. Numerical heat transfer and uncertainty analyses with applied engineering judgement were extensively used to come... heat transfer issues facing the Department of Defense. 14. SUBJECT TERMS Thermal contact resistance, thermal conductivity, measurement system 15... heat transfer and uncertainty analyses with applied engineering judgement were extensively used to come up with an optimized design and construction

Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding

PubMed Central

Zeng, L. F.; Gao, R.; Xie, Z. M.; Miao, S.; Fang, Q. F.; Wang, X. P.; Zhang, T.; Liu, C. S.

2017-01-01

Traditional nanostructured metals are inherently comprised of a high density of high-energy interfaces that make this class of materials not stable in extreme conditions. Therefore, high performance bulk nanostructured metals containing stable interfaces are highly desirable for extreme environments applications. Here, we reported an attractive bulk Cu/V nanolamellar composite that was successfully developed by integrating interface engineering and severe plastic deformation techniques. The layered morphology and ordered Cu/V interfaces remained stable with respect to continued rolling (total strain exceeding 12). Most importantly, for layer thickness of 25 nm, this bulk Cu/V nanocomposite simultaneously achieves high strength (hardness of 3.68 GPa) and outstanding thermal stability (up to 700 °C), which are quite difficult to realize simultaneously in traditional nanostructured materials. Such extraordinary property in our Cu/V nanocomposite is achieved via an extreme rolling process that creates extremely high density of stable Cu/V heterophase interfaces and low density of unstable grain boundaries. In addition, high temperature annealing result illustrates that Rayleigh instability is the dominant mechanism driving the onset of thermal instability after exposure to 800 °C. PMID:28094346

Simultaneous measurement of the dynamic emissivity and the radiance of the shocked Al/LiF interface in the near-infrared wavelength

NASA Astrophysics Data System (ADS)

Liu, Shenggang; Li, Jiabo; Li, Jun; Xue, Tao; Tao, Tianjiong; Ma, Heli; Wang, Xiang; Weng, Jidong; Li, Zeren

2018-04-01

A novel method based on signal superimposing has been presented to simultaneously measure the dynamic emissivity and the radiance of a shocked sample/window interface in the near-infrared wavelength. In this method, we have used three rectangle laser pulses to illuminate the sample/window interface via an integrating sphere and expect that the reflected laser pulses from the sample/window interface can be superimposed on its thermal radiation at the shocked steady state by time precision synchronization. In the two proving trials, the second laser pulse reflected from the Al/LiF interface has been successfully superimposed on its thermal radiation despite large flyer velocity uncertainty. The dynamic emissivity and the radiance at 1064 nm have been obtained simultaneously from the superimposing signals. The obtained interface temperatures are 1842 ± 82 K and 1666 ± 154 K, respectively, the corresponding release pressures are 65.7 GPa and 62.6 GPa, and the deduced Hugonoit temperatures are consistent with the theoretical calculations. In comparison, the fitting temperatures from the gray body model are 300-500 K higher than our experimental measurement results and the theoretical calculations.

Analysis of heat conduction in a drum brake system of the wheeled armored personnel carriers

NASA Astrophysics Data System (ADS)

Puncioiu, A. M.; Truta, M.; Vedinas, I.; Marinescu, M.; Vinturis, V.

2015-11-01

This paper is an integrated study performed over the Braking System of the Wheeled Armored Personnel Carriers. It mainly aims to analyze the heat transfer process which is present in almost any industrial and natural process. The vehicle drum brake systems can generate extremely high temperatures under high but short duration braking loads or under relatively light but continuous braking. For the proper conduct of the special vehicles mission in rough terrain, we are talking about, on one hand, the importance of the possibility of immobilization and retaining position and, on the other hand, during the braking process, the importance movement stability and reversibility or reversibility, to an encounter with an obstacle. Heat transfer processes influence the performance of the braking system. In the braking phase, kinetic energy transforms into thermal energy resulting in intense heating and high temperature states of analyzed vehicle wheels. In the present work a finite element model for the temperature distribution in a brake drum is developed, by employing commercial finite element software, ANSYS. These structural and thermal FEA models will simulate entire braking event. The heat generated during braking causes distortion which modifies thermoelastic contact pressure distribution drum-shoe interface. In order to capture the effect of heat, a transient thermal analysis is performed in order to predict the temperature distribution transitional brake components. Drum brakes are checked both mechanical and thermal. These tests aim to establish their sustainability in terms of wear and the variation coefficient of friction between the friction surfaces with increasing temperature. Modeling using simulation programs led eventually to the establishment of actual thermal load of the mechanism of brake components. It was drawn the efficiency characteristic by plotting the coefficient of effectiveness relative to the coefficient of friction shoe-drum. Thus induced thermal loads determine thermo mechanical behavior of the structure of wheels. Study the transfer of heat generated during braking is useful because results can improve and validate existing theory or may lead to the development of a mathematical model to simulate the behavior of the brake system for various tactical and operational situations. Conclusions of this paper are relevant because theoretical data analysis results are validated by experimental research.

New Class of Thermal Interface Materials Delivers Ultralow Thermal

Science.gov Websites

chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix functionalized with soft organic linkers and a copper matrix. Researchers selected BNNS as a filler due to its metal/organic/inorganic hybrid nanocomposites provide a promising start to a thermal management solution

Ceramic joints

DOEpatents

Miller, Bradley J.; Patten, Jr., Donald O.

1991-01-01

Butt joints between materials having different coefficients of thermal expansion are prepared having a reduced probability of failure of stress facture. This is accomplished by narrowing/tapering the material having the lower coefficient of thermal expansion in a direction away from the joint interface and not joining the narrow-tapered surface to the material having the higher coefficient of thermal expansion.

Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kang, Qiping; He, Xinbo, E-mail: xb_he@163.com; Ren, Shubin

2015-07-15

An effective method for preparing tungsten carbide coating on diamond surfaces was proposed to improve the interface bonding between diamond and copper. The WC coating was formed on the diamond surfaces with a reaction medium of WO{sub 3} in mixed molten NaCl–KCl salts and the copper–diamond composites were obtained by vacuum pressure infiltration of WC-coated diamond particles with pure copper. The microstructure of interface bonding between diamond and copper was discussed. Thermal conductivity and thermal expansion behavior of the obtained copper–diamond composites were investigated. Results indicated that the thermal conductivity of as-fabricated composite reached 658 W m{sup −} {sup 1}more » K{sup −} {sup 1}. Significant reduction in coefficient of thermal expansion of the composite compared with that of pure copper was obtained. - Highlights: • WC coating was successfully synthesized on diamond particles in molten salts. • WC coating obviously promoted the wettability of diamond and copper matrix. • WC coating greatly enhanced the thermal conductivity of Cu–diamond composite. • The composites are suitable candidates for heat sink applications.« less

Thermal stir welding process

NASA Technical Reports Server (NTRS)

Ding, R. Jeffrey (Inventor)

2012-01-01

A welding method is provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Thermal stir welding apparatus

NASA Technical Reports Server (NTRS)

Ding, R. Jeffrey (Inventor)

2011-01-01

A welding method and apparatus are provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Investigating Morphological Stability of Faceted Interfaces with Axial Heat Processing (AHP) Technique

NASA Technical Reports Server (NTRS)

Abbaschian, Reza; Balikci, Ercan; Deal, Andrew; Gonik, Michael; Golyshev, Viladimir D.; Leonardi, Eddie; deVahlDavis, G.; Chen, P. Y. P.; Timchenko, V.

2003-01-01

Successful processing of homogeneous semiconductor single crystals from their melts depends strongly on precise control of thermal and fluid flow conditions near the solid/liquid interface. In this project, we utilize a novel crystal growth technique called Axial Heat Processing (AHP) that uses a baffle, positioned inside the melt near the interface, to supply and/or conduct heat axially to the interface. The baffle, which may or may not have a heater encased in it, can promote more stable and planar growth as well as reduce buoyancy driven convection. The latter is because the baffle reduces the aspect ratio of the melt as it separates the melt into three sections, above the baffle, in the feed gap between the baffle and the crucible wall, and below the baffle between the baffle base and the interface. AHP also enables a close monitoring and/or control of thermal boundaries near the solid/liquid interface during crystal growth by means of thermocouples placed in the baffle. The interface is kept planar when a heating element in the baffle is used. However, a proper choice of melt height is necessary to keep the interface planar when using the baffle without a heater. This study addresses the influence of melt height and growth velocity on the segregation profile of AHP-grown Sb doped Ge single crystals.

In situ SEM thermal fatigue of Al/graphite metal matrix composites

NASA Technical Reports Server (NTRS)

Zong, G. S.; Rabenberg, L.; Marcus, H. L.

1990-01-01

Several thermal fatigue-induced failure mechanisms are deduced for unidirectional graphite-reinforced 6061 Al-alloy MMCs subjected to in situ thermal cycling. These thermal cycling conditions are representative of MMC service cycles in aerospace environments, where thermal fatigue is primarily associated with changes in the stress states near the interfaces due to coefficient of thermal expansion mismatch between fiber and matrix. This in situ SEM thermal-cycling study clarified such factors affecting MMCs' thermal fatigue as local fiber content and distribution, void volume, fiber stiffness, thermal excursion magnitude, and number of thermal cycles. MMC microfailure modes in thermal fatigue have been deduced.

A review of passive thermal management of LED module

NASA Astrophysics Data System (ADS)

Huaiyu, Ye; Koh, Sau; van Zeijl, Henk; Gielen, A. W. J.; Guoqi, Zhang

2011-01-01

Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module.

A molecular dynamics study of the role of pressure on the response of reactive materials to thermal initiation

NASA Astrophysics Data System (ADS)

Weingarten, N. Scott; Mattson, William D.; Yau, Anthony D.; Weihs, Timothy P.; Rice, Betsy M.

2010-05-01

To elucidate the mechanisms of energy release in a reacting nickel/aluminum bilayer, we simulate the exothermic alloying reactions using both microcanonical and isoenthalpic-isobaric molecular dynamics simulations and an embedded-atom method type potential. The mechanism of the mixing consists of a sequence of steps in which mixing and reaction first occurs at the interface; the resulting heat generated from the mixing then melts the Al layer; subsequent mixing leads to further heat generation after which the Ni layer melts. The mixing continues until the alloying reactions are completed. The results indicate that pressure has a significant influence on the rates of atomic mixing and alloying reactions. Local pressures and temperatures within the individual layers at the time of melting are calculated, and these results are compared with the pressure-dependent melting curves determined for pure Al and pure Ni using this interaction potential.

Organophophorous Ester Degradation by Chromium(III) Terephthalate Metal-Organic Framework (MIL-101) Chelated to N,N-Dimethylaminopyridine and Related Aminopyridines

DTIC Science & Technology

2013-01-22

hydrofluoric acid in the hydro- thermal synthesis of MIL-101 MOF, and employed an optimized TMAOH/Cr(NO3)3/TPA/H2O (0.25/1/1/280) alkaline medium.41 MOF...identical to those of as-synthesized, parent MIL-101. This demonstrates that the framework integrity of MIL-101 was retained after both thermal water...Materials & Interfaces Research Article dx.doi.org/10.1021/am302359b | ACS Appl. Mater. Interfaces 2013, 5, 1269−12781272 of most zeolites or silicas

TIA Software User's Manual

NASA Technical Reports Server (NTRS)

Cramer, K. Elliott; Syed, Hazari I.

1995-01-01

This user's manual describes the installation and operation of TIA, the Thermal-Imaging acquisition and processing Application, developed by the Nondestructive Evaluation Sciences Branch at NASA Langley Research Center, Hampton, Virginia. TIA is a user friendly graphical interface application for the Macintosh 2 and higher series computers. The software has been developed to interface with the Perceptics/Westinghouse Pixelpipe(TM) and PixelStore(TM) NuBus cards and the GW Instruments MacADIOS(TM) input-output (I/O) card for the Macintosh for imaging thermal data. The software is also capable of performing generic image-processing functions.

Time-Dependent Thermally-Driven Interfacial Flows in Multilayered Fluid Structures

NASA Technical Reports Server (NTRS)

Haj-Hariri, Hossein; Borhan, A.

1996-01-01

A computational study of thermally-driven convection in multilayered fluid structures will be performed to examine the effect of interactions among deformable fluid-fluid interfaces on the structure of time-dependent flow in these systems. Multilayered fluid structures in two models configurations will be considered: the differentially heated rectangular cavity with a free surface, and the encapsulated cylindrical liquid bridge. An extension of a numerical method developed as part of our recent NASA Fluid Physics grant will be used to account for finite deformations of fluid-fluid interfaces.

Vibrational energy flow through the green fluorescent protein-water interface: communication maps and thermal boundary conductance.

PubMed

Xu, Yao; Leitner, David M

2014-07-17

We calculate communication maps for green fluorescent protein (GFP) to elucidate energy transfer pathways between the chromophore and other parts of the protein in the ground and excited state. The approach locates energy transport channels from the chromophore to remote regions of the protein via residues and water molecules that hydrogen bond to the chromophore. We calculate the thermal boundary conductance between GFP and water over a wide range of temperature and find that the interface between the protein and the cluster of water molecules in the β-barrel poses negligible resistance to thermal flow, consistent with facile vibrational energy transfer from the chromophore to the β-barrel waters observed in the communication maps.

Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures

DOE PAGES

Dhuley, R. C.; Geelhoed, M. I.; Thangaraj, J. C. T.

2018-06-15

Here, we examine the resistance to heat flow across contacts of mechanically pressed aluminum and niobium near liquid helium temperatures for designing a thermally conducting joint of aluminum and superconducting niobium. Measurements in the temperature range of 3.5 K to 5.5 K show the thermal contact resistance to grow as a near-cubic function of decreasing temperature, indicating phonons to be the primary heat carriers across the interface. In the 4 kN to 14 kN range of pressing force the contact resistance shows linear drop with the increasing force, in agreement with the model of micro-asperity plastic deformation at pressed contacts.more » Several thermal contact resistance models as well as the phonon diffuse mismatch model of interface thermal resistance are compared with the experimental data. The diffuse mismatch model shows closest agreement. The joints are further augmented with thin foil of indium, which lowers the joint resistance by an order of magnitude. The developed joint has nearly 1 K*cm2/W of thermal resistance at 4.2 K, is demountable, and free of the thermally resistive interfacial alloy layer that typically exists at welded, casted, or soldered joints of dissimilar metals.« less

Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dhuley, R. C.; Geelhoed, M. I.; Thangaraj, J. C. T.

Here, we examine the resistance to heat flow across contacts of mechanically pressed aluminum and niobium near liquid helium temperatures for designing a thermally conducting joint of aluminum and superconducting niobium. Measurements in the temperature range of 3.5 K to 5.5 K show the thermal contact resistance to grow as a near-cubic function of decreasing temperature, indicating phonons to be the primary heat carriers across the interface. In the 4 kN to 14 kN range of pressing force the contact resistance shows linear drop with the increasing force, in agreement with the model of micro-asperity plastic deformation at pressed contacts.more » Several thermal contact resistance models as well as the phonon diffuse mismatch model of interface thermal resistance are compared with the experimental data. The diffuse mismatch model shows closest agreement. The joints are further augmented with thin foil of indium, which lowers the joint resistance by an order of magnitude. The developed joint has nearly 1 K*cm2/W of thermal resistance at 4.2 K, is demountable, and free of the thermally resistive interfacial alloy layer that typically exists at welded, casted, or soldered joints of dissimilar metals.« less

Disturbance Impacts on Thermal Hot Spots and Hot Moments at the Peatland-Atmosphere Interface

NASA Astrophysics Data System (ADS)

Leonard, R. M.; Kettridge, N.; Devito, K. J.; Petrone, R. M.; Mendoza, C. A.; Waddington, J. M.; Krause, S.

2018-01-01

Soil-surface temperature acts as a master variable driving nonlinear terrestrial ecohydrological, biogeochemical, and micrometeorological processes, inducing short-lived or spatially isolated extremes across heterogeneous landscape surfaces. However, subcanopy soil-surface temperatures have been, to date, characterized through isolated, spatially discrete measurements. Using spatially complex forested northern peatlands as an exemplar ecosystem, we explore the high-resolution spatiotemporal thermal behavior of this critical interface and its response to disturbances by using Fiber-Optic Distributed Temperature Sensing. Soil-surface thermal patterning was identified from 1.9 million temperature measurements under undisturbed, trees removed and vascular subcanopy removed conditions. Removing layers of the structurally diverse vegetation canopy not only increased mean temperatures but it shifted the spatial and temporal distribution, range, and longevity of thermal hot spots and hot moments. We argue that linking hot spots and/or hot moments with spatially variable ecosystem processes and feedbacks is key for predicting ecosystem function and resilience.

Investigation of failure mechanism of thermal barrier coatings (TBCs) deposited by EB-PVD technique

NASA Astrophysics Data System (ADS)

Shahid, M. R.; Abbas, Musharaf

2013-06-01

Failure mechanism of thermal barrier coatings (TBCs) prepared by electron beam physical vapor deposition (EB-PVD) technique owing to formation of micro cracks was investigated. The TBCs were deposited on the Ni-based super alloy IN-100 and the micro cracks were observed within the top ceramic coat of thermally cycled TBCs at 1050°C. It was observed that these cracks propagate in the ceramic coat in the direction normal to interface while no cracks were observed in the bond coat. SEM/EDS studies revealed that some non-uniform oxides were formed on the interface between ceramic top and metallic bond coat just below the cracks. Study proposed that the cracks were initiated due to stress owing to big difference in Pilling-Bed worth ratio of non-uniform oxides as well as thermal stress, which caused the formation of cracks in top ceramic coat leading to failure of TBCs

Morphological instability of a thermophoretically growing deposit

NASA Technical Reports Server (NTRS)

Castillo, Jose L.; Garcia-Ybarra, Pedro L.; Rosner, Daniel E.

1992-01-01

The stability of the planar interface of a structureless solid growing from a depositing component dilute in a carrier fluid is studied when the main solute transport mechanism is thermal (Soret) diffusion. A linear stability analysis, carried out in the limit of low growth Peclet number, leads to a dispersion relation which shows that the planar front is unstable either when the thermal diffusion factor of the condensing component is positive and the latent heat release is small or when the thermal diffusion factor is negative and the solid grows over a thermally-insulating substrate. Furthermore, the influence of interfacial energy effects and constitutional supersaturation in the vicinity of the moving interface is analyzed in the limit of very small Schmidt numbers (small solute Fickian diffusion). The analysis is relevant to physical vapor deposition of very massive species on cold surfaces, as in recent experiments of organic solid film growth under microgravity conditions.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yao, Kaisheng; Henan Normal University, School of Chemistry and Environmental Science, Key Laboratory of Green Chemical Media and Reactions, Xin xiang, Henan 453007; Lu, Weiwei

A novel method was proposed for successful fabrication of CuS nanostructures with various morphologies. At the ionic liquids (ILs)-modulated CHCl{sub 3}-H{sub 2}O interface, copper cupferronate [Cu(cup){sub 2}] in CHCl{sub 3} reacted with thiourea in water to generate CuS nanostructures via a solvothermal reaction process. The effects of alkyl chain length of imidazolium cations and nature of anions of the ILs, molar ratio of Cu(cup){sub 2} to thiourea, the reaction temperature and time on the morphology of the products were studied systematically. It was shown that by changing alkyl chain length of imidazolium cations and nature of anions of the ILs,more » CuS nanostructures with various morphologies, including flowers, urchins, large nanodisks and nanoparticles, could be obtained at the liquid-liquid interface, and the ILs played important template roles in directing the formation of CuS nanostructures. Furthermore, the as-prepared CuS samples exhibited high catalytic activity for photodegradation of methyl orange and thermal decomposition of ammonium perchlorate. - Graphical abstract: At the ionic liquids-modulated CHCl{sub 3}-H{sub 2}O interface, the CuS nanostructures with the various morphologies of flowers, urchins, large nanodisks and nanoparticles have been successfully prepared via a solvothermal reaction process. Highlights: Black-Right-Pointing-Pointer The properties of oil-H{sub 2}O interface can be modulated by employing different ILs. Black-Right-Pointing-Pointer The modulated interface has been used to prepare CuS nanostructures with various morphologies. Black-Right-Pointing-Pointer The CuS samples exhibited high catalytic activity for the photodegradation of methyl orange.« less

Interfacing the Generalized Fluid System Simulation Program with the SINDA/G Thermal Program

NASA Technical Reports Server (NTRS)

Schallhorn, Paul; Palmiter, Christopher; Farmer, Jeffery; Lycans, Randall; Tiller, Bruce

2000-01-01

A general purpose, one dimensional fluid flow code has been interfaced with the thermal analysis program SINDA/G. The flow code, GFSSP, is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development was conducted in two phases. This paper describes the first (which allows for steady and quasi-steady - unsteady solid, steady fluid - conjugate heat transfer modeling). The second (full transient conjugate heat transfer modeling) phase of the interface development will be addressed in a later paper. Phase 1 development has been benchmarked to an analytical solution with excellent agreement. Additional test cases for each development phase demonstrate desired features of the interface. The results of the benchmark case, three additional test cases and a practical application are presented herein.

Closed-form analysis of fiber-matrix interface stresses under thermo-mechanical loadings

NASA Technical Reports Server (NTRS)

Naik, Rajiv A.; Crews, John H., Jr.

1992-01-01

Closed form techniques for calculating fiber matrix (FM) interface stresses, using repeating square and diamond regular arrays, were presented for a unidirectional composite under thermo-mechanical loadings. An Airy's stress function micromechanics approach from the literature, developed for calculating overall composite moduli, was extended in the present study to compute FM interface stresses for a unidirectional graphite/epoxy (AS4/3501-6) composite under thermal, longitudinal, transverse, transverse shear, and longitudinal shear loadings. Comparison with finite element results indicate excellent agreement of the FM interface stresses for the square array. Under thermal and longitudinal loading, the square array has the same FM peak stresses as the diamond array. The square array predicted higher stress concentrations under transverse normal and longitudinal shear loadings than the diamond array. Under transverse shear loading, the square array had a higher stress concentration while the diamond array had a higher radial stress concentration. Stress concentration factors under transverse shear and longitudinal shear loadings were very sensitive to fiber volume fraction. The present analysis provides a simple way to calculate accurate FM interface stresses for both the square and diamond array configurations.

Phonon impedance matching: minimizing interfacial thermal resistance of thin films

NASA Astrophysics Data System (ADS)

Polanco, Carlos; Zhang, Jingjie; Ghosh, Avik

2014-03-01

The challenge to minimize interfacial thermal resistance is to allow a broad band spectrum of phonons, with non-linear dispersion and well defined translational and rotational symmetries, to cross the interface. We explain how to minimize this resistance using a frequency dependent broadening matrix that generalizes the notion of acoustic impedance to the whole phonon spectrum including symmetries. We show how to ``match'' two given materials by joining them with a single atomic layer, with a multilayer material and with a graded superlattice. Atomic layer ``matching'' requires a layer with a mass close to the arithmetic mean (or spring constant close to the harmonic mean) to favor high frequency phonon transmission. For multilayer ``matching,'' we want a material with a broadening close to the geometric mean to maximize transmission peaks. For graded superlattices, a continuous sequence of geometric means translates to an exponentially varying broadening that generates a wide-band antireflection coating for both the coherent and incoherent limits. Our results are supported by ``first principles'' calculations of thermal conductance for GaAs / Gax Al1 - x As / AlAs thin films using the Non-Equilibrium Greens Function formalism coupled with Density Functional Perturbation Theory. NSF-CAREER (QMHP 1028883), NSF-IDR (CBET 1134311), XSEDE.

External Tank (ET) Foam Thermal/Structural Analysis Project

NASA Technical Reports Server (NTRS)

Moore, David F.; Ungar, Eugene K.; Chang, Li C.; Malroy, Eric T.; Stephan, Ryan A.

2008-01-01

An independent study was performed to assess the pre-launch thermally induced stresses in the Space Shuttle External Tank Bipod closeout and Ice/Frost ramps (IFRs). Finite element models with various levels of detail were built that included the three types of foam (BX-265, NCFI 24-124, and PDL 1034) and the underlying structure and bracketry. Temperature profiles generated by the thermal analyses were input to the structural models to calculate the stress levels. An area of high stress in the Bipod closeout was found along the aluminum tank wall near the phenolic insulator and along the phenolic insulator itself. This area of high stress might be prone to cracking and possible delamination. There is a small region of slightly increased stress in the NCFI 24-124 foam near its joint with the Bipod closeout BX-265 foam. The calculated stresses in the NCFI 24-124 acreage foam are highest at the NCFI 24-124/PDL 1034/tank wall interface under the LO2 and LH2 IFRs. The highest calculated stresses in the LH2 NCFI 24-124 foam are higher than in similar locations in the LO2 IFR. This finding is consistent with the dissection results of IFRs on ET-120.

Comprehensive study of thin film evaporation from nanoporous membranes for enhanced thermal management

NASA Astrophysics Data System (ADS)

Wilke, Kyle; Barabadi, Banafsheh; Lu, Zhengmao; Zhang, Tiejun; Wang, Evelyn

Performance of emerging electronics is often dictated by the ability to dissipate heat generated in the device. Thin film evaporation from nanopores promises enhanced thermal management by reducing the thermal transport resistance across the liquid film while providing capillary pumping. We present a study of the dependence of evaporation from nanopores on a variety of geometric parameters. Anodic aluminum oxide membranes were used as an experimental template. A biphilic treatment was also used to create a hydrophobic section of the pore to control meniscus location. We demonstrated different heat transfer regimes and observed more than an order of magnitude increase in dissipated heat flux by confining fluid within the nanopore. Pore diameter had little effect on evaporation performance at pore radii of this length scale due to the negligible conduction resistance from the pore wall to the evaporating interface. The dissipated heat flux scaled linearly with porosity as the evaporative area increased. Furthermore, it was demonstrated that moving the meniscus as little as 1 μm into the pore could decrease performance significantly. The results provide a better understanding of evaporation from nanopores and provide guidance in future device design.

Atomistic modeling of metallic thin films by modified embedded atom method

NASA Astrophysics Data System (ADS)

Hao, Huali; Lau, Denvid

2017-11-01

Molecular dynamics simulation is applied to investigate the deposition process of metallic thin films. Eight metals, titanium, vanadium, iron, cobalt, nickel, copper, tungsten, and gold, are chosen to be deposited on the aluminum substrate. The second nearest-neighbor modified embedded atom method potential is adopted to predict their thermal and mechanical properties. When quantifying the screening parameters of the potential, the error for Young's modulus and coefficient of thermal expansion between the simulated results and the experimental measurements is less than 15%, demonstrating the reliability of the potential to predict metallic behaviors related to thermal and mechanical properties. A set of potential parameters which governs the interactions between aluminum and other metals in a binary system is also generated from ab initio calculation. The details of interfacial structures between the chosen films and substrate are successfully simulated with the help of these parameters. Our results indicate that the preferred orientation of film growth depends on the film crystal structure, and the inter-diffusion at the interface is correlated the cohesive energy parameter of potential for the binary system. Such finding provides an important basis to further understand the interfacial science, which contributes to the improvement of the mechanical properties, reliability and durability of films.

Material Properties of Three Candidate Elastomers for Space Seals Applications

NASA Technical Reports Server (NTRS)

Bastrzyk, Marta B.; Daniels, Christopher C.; Oswald, Jay J.; Dunlap, Patrick H., Jr.; Steinetz, Bruce M.

2010-01-01

A next-generation docking system is being developed by the National Aeronautics and Space Administration (NASA) to support Constellation Space Exploration Missions to low Earth orbit (LEO), to the Moon, and to Mars. A number of investigations were carried out to quantify the properties of candidate elastomer materials for use in the main interface seal of the Low Impact Docking System (LIDS). This seal forms the gas pressure seal between two mating spacecraft. Three candidate silicone elastomer compounds were examined: Esterline ELA-SA-401, Parker Hannifin S0383-70, and Parker Hannifin S0899-50. All three materials were characterized as low-outgassing compounds, per ASTM E595, so as to minimize the contamination of optical and solar array systems. Important seal properties such as outgas levels, durometer, tensile strength, elongation to failure, glass transition temperature, permeability, compression set, Yeoh strain energy coefficients, coefficients of friction, coefficients of thermal expansion, thermal conductivity and diffusivity were measured and are reported herein.

Advantages and Uses of AMTEC

NASA Astrophysics Data System (ADS)

Lodhi, M. A. K.

2012-10-01

Static conversion systems are gaining importance in recent times because of newer applications of electricity like in spacecraft, hybrid-electric vehicles, military uses and domestic purposes. Of the many new static energy conversion systems that are being considered, one is the Alkali Metal Thermal Electric Converter (AMTEC). It is a thermally regenerative, electrochemical device for the direct conversion of heat to electrical power. As the name suggests, this system uses an alkali metal in its process. The electrochemical process involved in the working of AMTEC is ionization of alkali metal atoms at the interface of electrode and electrolyte. The electrons produced as a result flow through the external load thus doing work, and finally recombine with the metal ions at the cathode. AMTECs convert the work done during the nearly isothermal expansion of metal vapor to produce a high current and low voltage electron flow. Due to its principle of working it has many inherent advantages over other conventional generators. These will be discussed briefly.

A library of protein cage architectures as nanomaterials.

PubMed

Flenniken, M L; Uchida, M; Liepold, L O; Kang, S; Young, M J; Douglas, T

2009-01-01

Virus capsids and other structurally related cage-like proteins such as ferritins, dps, and heat shock proteins have three distinct surfaces (inside, outside, interface) that can be exploited to generate nanomaterials with multiple functionality by design. Protein cages are biological in origin and each cage exhibits extremely homogeneous size distribution. This homogeneity can be used to attain a high degree of homogeneity of the templated material and its associated property. A series of protein cages exhibiting diversity in size, functionality, and chemical and thermal stabilities can be utilized for materials synthesis under a variety of conditions. Since synthetic approaches to materials science often use harsh temperature and pH, it is an advantage to utilize protein cages from extreme environments. In this chapter, we review recent studies on discovering novel protein cages from harsh natural environments such as the acidic thermal hot springs at Yellowstone National Park (YNP) and on utilizing protein cages as nano-scale platforms for developing nanomaterials with wide range of applications from electronics to biomedicine.

Integration and Utilization of Nuclear Systems on the Moon and Mars

DOE Office of Scientific and Technical Information (OSTI.GOV)

Houts, Michael G.; Schmidt, George R.; Bragg-Sitton, Shannon

2006-01-20

Over the past five decades numerous studies have identified nuclear energy as an enhancing or enabling technology for planetary surface exploration missions. This includes both radioisotope and fission sources for providing both heat and electricity. Nuclear energy sources were used to provide electricity on Apollo missions 12, 14, 15, 16, and 17, and on the Mars Viking landers. Very small nuclear energy sources were used to provide heat on the Mars Pathfinder, Spirit, and Opportunity rovers. Research has been performed at NASA MSFC to help assess potential issues associated with surface nuclear energy sources, and to generate data that couldmore » be useful to a future program. Research areas include System Integration, use of Regolith as Radiation Shielding, Waste Heat Rejection, Surface Environmental Effects on the Integrated System, Thermal Simulators, Surface System Integration / Interface / Interaction Testing, End-to-End Breadboard Development, Advanced Materials Development, Surface Energy Source Coolants, and Planetary Surface System Thermal Management and Control. This paper provides a status update on several of these research areas.« less