Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Compact electro-optical module with polymer waveguides on a flexible substrate for high-density board-level communication

NASA Astrophysics Data System (ADS)

Weiss, J. R. M.; Lamprecht, T.; Meier, N.; Dangel, R.; Horst, F.; Jubin, D.; Beyeler, R.; Offrein, B. J.

2010-02-01

We report on the co-packaging of electrical CMOS transceiver and VCSEL chip arrays on a flexible electrical substrate with optical polymer waveguides. The electro-optical components are attached to the substrate edge and butt-coupled to the waveguides. Electrically conductive silver-ink connects them to the substrate at an angle of 90°. The final assembly contacts the surface of a package laminate with an integrated compressible connector. The module can be folded to save space, requires only a small footprint on the package laminate and provides short electrical high-speed signal paths. With our approach, the electro-optical package becomes a compact electro-optical module with integrated polymer waveguides terminated with either optical connectors (e.g., at the card edge) or with an identical assembly for a second processor on the board. Consequently, no costly subassemblies and connectors are needed, and a very high integration density and scalability to virtually arbitrary channel counts and towards very high data rates (20+ Gbps) become possible. Future cost targets of much less than US$1 per Gbps will be reached by employing standard PCB materials and technologies that are well established in the industry. Moreover, our technology platform has both electrical and optical connectivity and functionality.

Effect of packaging materials on the chemical composition and microbiological quality of edible mushroom (Pleurotus ostreatus) grown on cassava peels.

PubMed

Ajayi, Oluwakemi; Obadina, Adewale; Idowu, Micheal; Adegunwa, Mojisola; Kajihausa, Olatundun; Sanni, Lateef; Asagbra, Yemisi; Ashiru, Bolanle; Tomlins, Keith

2015-07-01

Edible fungi such as mushrooms are highly perishable and deteriorate few days after harvest due to its high moisture content and inability to maintain their physiological status. In this study, the effect of packaging materials on the nutritional composition of mushroom cultivated from cassava peels was investigated. Mushroom samples were dried at 50°C in a cabinet dryer for 8 h. The dried mushroom samples packaged in four different packaging materials; high density polyethylene (HDPE), polypropylene (PP), laminated aluminum foil (LAF), high density polyethylene under vacuum (HDPEV) were stored at freezing (0°C) temperatures for 12 weeks. Samples were collected at 2-week intervals and analyzed for proximate composition (carbohydrate, protein, fat, fiber, ash, moisture), mineral content (calcium, potassium), vitamin C content, and microbiological qualities (total aerobic count, Pseudomonal count, Coliform count, Staphylococcal count, Salmonella count) using the standard laboratory procedures. Carbohydrate, protein, fat content of dried mushrooms packaged in HDPE at freezing temperature ranged from 45.2% to 53.5%, 18.0% to 20.3%, and 3.2% to 4.3%, while mushrooms in polypropylene ranged from 45.2% to 53.5%, 18.5% to 20.3%, 2.6% to 4.3%. Carbohydrate, protein, fat of mushroom in LAF ranged from 47.8% to 53.5%, 17.3% to 20.3%, and 3.3% to 4.3%, respectively, while carbohydrate, protein, fat of mushroom in HDPEV ranged from 51.1% to 53.5%, 19.5% to 20.3%, and 3.5% to 4.3%. Microbiological analysis showed that total aerobic count, Pseudomonal count, and Staphyloccocal count of dried mushroom ranged from 2.3 to 3.8 log cfu/g, 0.6 to 1.1 log cfu/g, and 0.4 to 0.5 log cfu/g, respectively. In conclusion, dried mushroom in HDPE packaged under vacuum at freezing temperature retained the nutritional constituents than those packaged with other packaging materials.

Effect of packaging materials on the chemical composition and microbiological quality of edible mushroom (Pleurotus ostreatus) grown on cassava peels

PubMed Central

Ajayi, Oluwakemi; Obadina, Adewale; Idowu, Micheal; Adegunwa, Mojisola; Kajihausa, Olatundun; Sanni, Lateef; Asagbra, Yemisi; Ashiru, Bolanle; Tomlins, Keith

2015-01-01

Edible fungi such as mushrooms are highly perishable and deteriorate few days after harvest due to its high moisture content and inability to maintain their physiological status. In this study, the effect of packaging materials on the nutritional composition of mushroom cultivated from cassava peels was investigated. Mushroom samples were dried at 50°C in a cabinet dryer for 8 h. The dried mushroom samples packaged in four different packaging materials; high density polyethylene (HDPE), polypropylene (PP), laminated aluminum foil (LAF), high density polyethylene under vacuum (HDPEV) were stored at freezing (0°C) temperatures for 12 weeks. Samples were collected at 2-week intervals and analyzed for proximate composition (carbohydrate, protein, fat, fiber, ash, moisture), mineral content (calcium, potassium), vitamin C content, and microbiological qualities (total aerobic count, Pseudomonal count, Coliform count, Staphylococcal count, Salmonella count) using the standard laboratory procedures. Carbohydrate, protein, fat content of dried mushrooms packaged in HDPE at freezing temperature ranged from 45.2% to 53.5%, 18.0% to 20.3%, and 3.2% to 4.3%, while mushrooms in polypropylene ranged from 45.2% to 53.5%, 18.5% to 20.3%, 2.6% to 4.3%. Carbohydrate, protein, fat of mushroom in LAF ranged from 47.8% to 53.5%, 17.3% to 20.3%, and 3.3% to 4.3%, respectively, while carbohydrate, protein, fat of mushroom in HDPEV ranged from 51.1% to 53.5%, 19.5% to 20.3%, and 3.5% to 4.3%. Microbiological analysis showed that total aerobic count, Pseudomonal count, and Staphyloccocal count of dried mushroom ranged from 2.3 to 3.8 log cfu/g, 0.6 to 1.1 log cfu/g, and 0.4 to 0.5 log cfu/g, respectively. In conclusion, dried mushroom in HDPE packaged under vacuum at freezing temperature retained the nutritional constituents than those packaged with other packaging materials. PMID:26288720

Recent advances in photonics packaging materials

NASA Astrophysics Data System (ADS)

Zweben, Carl

2006-02-01

There are now over a dozen low-CTE materials with thermal conductivities between that of copper (400 w/m-K) and over 4X copper (1700 W/m-K). Most have low densities. For comparison, traditional low-CTE packaging materials like copper/tungsten have thermal conductivities that are little or no better than that of aluminum (200 W/m-K) and high densities. There are also low-density thermal insulators with low CTEs. Some advanced materials are low cost. Most do not outgas. They have a wide range of electrical properties that can be used to minimize electromagnetic emissions or provide EMI shielding. Several are now in commercial and aerospace applications, including laser diode packages; light-emitting diode (LED) packages; thermoelectric cooler bases, plasma displays; power modules; servers; laptops; heat sinks; thermally conductive, low-CTE printed circuit boards; and printed circuit board cold plates. Advanced material payoffs include: improved thermal performance, reliability, alignment and manufacturing yield; reduced thermal stresses and heating power requirements; simplified thermal design; enablement of hard solder direct attach; weight savings up to 85%; size reductions up to 65%; and lower cost. This paper discusses the large and increasing number of advanced packaging materials, including properties, development status, applications, increasing manufacturing yield, cost, lessons learned and future directions, including nanocomposites.

Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

NASA Astrophysics Data System (ADS)

Hongqi, Jing; Li, Zhong; Yuxi, Ni; Junjie, Zhang; Suping, Liu; Xiaoyu, Ma

2015-10-01

A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks. Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software. Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks. Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced. Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime. This heat-sink is an ideal choice for the package of high power density laser diode array stacks. Project supported by the Defense Industrial Technology Development Program (No. B1320133033).

Stability Study of Sunscreens with Free and Encapsulated UV Filters Contained in Plastic Packaging

PubMed Central

Briasco, Benedetta; Capra, Priscilla; Mannucci, Barbara; Perugini, Paola

2017-01-01

Sunscreens play a fundamental role in skin cancer prevention and in protection against photo-aging. UV filters are often photo-unstable, especially in relation to their vehicles and, being lipophilic substances, they are able to interact with plastic packaging. Finally, UV filter stability can be significantly affected by the routine use of the product at high temperatures. This work aims to study the stability of sunscreen formulations in polyethylene packaging. Butyl methoxydibenzoylmethane and octocrylene, both in a free form and as encapsulated filters were chosen as UV filters. Stability evaluations were performed both in the packaging and on the formulations. Moreover, a further two non-destructive techniques, near-infrared (NIR) spectroscopy and a multiple light scattering technique, were also used to evaluate the stability of the formulation. Results demonstrated clearly that all of the pack underwent significant changes in its elastic/plastic behavior and in external color after solar irradiation. From the evaluation of the extractable profile of untreated and treated packaging material an absorption of 2-phenoxyethanol and octocrylene were shown. In conclusion, the results highlighted clearly that a reduction of the UV filter in the formulation packed in high-density polyethylene/low-density polyethylene (HDPE/LDPE) material can occur over time, reducing the protective effect of the product when applied to the skin. PMID:28561775

Stability Study of Sunscreens with Free and Encapsulated UV Filters Contained in Plastic Packaging.

PubMed

Briasco, Benedetta; Capra, Priscilla; Mannucci, Barbara; Perugini, Paola

2017-05-31

Sunscreens play a fundamental role in skin cancer prevention and in protection against photo-aging. UV filters are often photo-unstable, especially in relation to their vehicles and, being lipophilic substances, they are able to interact with plastic packaging. Finally, UV filter stability can be significantly affected by the routine use of the product at high temperatures. This work aims to study the stability of sunscreen formulations in polyethylene packaging. Butyl methoxydibenzoylmethane and octocrylene, both in a free form and as encapsulated filters were chosen as UV filters. Stability evaluations were performed both in the packaging and on the formulations. Moreover, a further two non-destructive techniques, near-infrared (NIR) spectroscopy and a multiple light scattering technique, were also used to evaluate the stability of the formulation. Results demonstrated clearly that all of the pack underwent significant changes in its elastic/plastic behavior and in external color after solar irradiation. From the evaluation of the extractable profile of untreated and treated packaging material an absorption of 2-phenoxyethanol and octocrylene were shown. In conclusion, the results highlighted clearly that a reduction of the UV filter in the formulation packed in high-density polyethylene/low-density polyethylene (HDPE/LDPE) material can occur over time, reducing the protective effect of the product when applied to the skin.

DOE Office of Scientific and Technical Information (OSTI.GOV)

NREL developed a modeling and experimental strategy to characterize thermal performance of materials. The technique provides critical data on thermal properties with relevance for electronics packaging applications. Thermal contact resistance and bulk thermal conductivity were characterized for new high-performance materials such as thermoplastics, boron-nitride nanosheets, copper nanowires, and atomically bonded layers. The technique is an important tool for developing designs and materials that enable power electronics packaging with small footprint, high power density, and low cost for numerous applications.

A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Whitaker, B; Barkley, A; Cole, Z

2014-05-01

This paper presents an isolated on-board vehicular battery charger that utilizes silicon carbide (SiC) power devices to achieve high density and high efficiency for application in electric vehicles (EVs) and plug-in hybrid EVs (PHEVs). The proposed level 2 charger has a two-stage architecture where the first stage is a bridgeless boost ac-dc converter and the second stage is a phase-shifted full-bridge isolated dc-dc converter. The operation of both topologies is presented and the specific advantages gained through the use of SiC power devices are discussed. The design of power stage components, the packaging of the multichip power module, and themore » system-level packaging is presented with a primary focus on system density and a secondary focus on system efficiency. In this work, a hardware prototype is developed and a peak system efficiency of 95% is measured while operating both power stages with a switching frequency of 200 kHz. A maximum output power of 6.1 kW results in a volumetric power density of 5.0 kW/L and a gravimetric power density of 3.8 kW/kg when considering the volume and mass of the system including a case.« less

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

NASA Technical Reports Server (NTRS)

Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Sims, Gerard; Li, Jun; Meyyappa, M.; Yang, Cary Y.

2005-01-01

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

[Effect of grain-bean package, grain-bean package dietary fiber and single whole grain dietary fiber on dyslipidemia rats].

PubMed

Liu, Yang; Zhai, Chengkai; Sun, Guiju; Zhang, Hong; Jiang, Mingxia; Zhang, Haifeng; Guo, Junling; Lan, Xi

2014-05-01

To observe and compare the effects of grain-bean package, dietary fiber (DF) extracted from grain-bean package, and DF from grain corn on the blood lipids and fatty acid synthase (FAS) activity in high-fat, high-cholesterol feeding induced dyslipidemia rats, and observe its effects on regulation of sterol regulatory element protein-1c (SREBP-1c) mRNA expression in rat liver. Consolidation 50 SD rats of clean grade feeding adaptation for one week, randomly assigned into normal control group, hyperlipidemia model group, grain-bean package group, grain-bean package DF group and grain corn group. Feed with corresponding diets for 8 weeks, and measure the total cholesterol (TC), triglyceridaemia (TG), high density lipoprotein cholesterol (HDL-C), fasting blood glucose (FBG), FAS, SREBP-1c mRNA of all groups. Compared with control group, TC, TG, FBG levels of hyperlipidemia model group were significantly increased (P < 0.05). Compared with model group, TC, TG, FBG levels of grain-bean package group, grain-bean package DF group were significantly decreased, HDL-C levels significantly increased, and activity of FAS, regulation of SREBP-1c were significantly decreased (P < 0.05). The Grain-bean package dietary fiber can improve blood lipids levels of dyslipidemia rats, and decrease FAS activity and SREBP-1c mRNA expression.

Calculations with off-shell matrix elements, TMD parton densities and TMD parton showers

NASA Astrophysics Data System (ADS)

Bury, Marcin; van Hameren, Andreas; Jung, Hannes; Kutak, Krzysztof; Sapeta, Sebastian; Serino, Mirko

2018-02-01

A new calculation using off-shell matrix elements with TMD parton densities supplemented with a newly developed initial state TMD parton shower is described. The calculation is based on the KaTie package for an automated calculation of the partonic process in high-energy factorization, making use of TMD parton densities implemented in TMDlib. The partonic events are stored in an LHE file, similar to the conventional LHE files, but now containing the transverse momenta of the initial partons. The LHE files are read in by the Cascade package for the full TMD parton shower, final state shower and hadronization from Pythia where events in HEPMC format are produced. We have determined a full set of TMD parton densities and developed an initial state TMD parton shower, including all flavors following the TMD distribution. As an example of application we have calculated the azimuthal de-correlation of high p_t dijets as measured at the LHC and found very good agreement with the measurement when including initial state TMD parton showers together with conventional final state parton showers and hadronization.

Calculations with off-shell matrix elements, TMD parton densities and TMD parton showers.

PubMed

Bury, Marcin; van Hameren, Andreas; Jung, Hannes; Kutak, Krzysztof; Sapeta, Sebastian; Serino, Mirko

2018-01-01

A new calculation using off-shell matrix elements with TMD parton densities supplemented with a newly developed initial state TMD parton shower is described. The calculation is based on the KaTie package for an automated calculation of the partonic process in high-energy factorization, making use of TMD parton densities implemented in TMDlib. The partonic events are stored in an LHE file, similar to the conventional LHE files, but now containing the transverse momenta of the initial partons. The LHE files are read in by the Cascade package for the full TMD parton shower, final state shower and hadronization from Pythia where events in HEPMC format are produced. We have determined a full set of TMD parton densities and developed an initial state TMD parton shower, including all flavors following the TMD distribution. As an example of application we have calculated the azimuthal de-correlation of high [Formula: see text] dijets as measured at the LHC and found very good agreement with the measurement when including initial state TMD parton showers together with conventional final state parton showers and hadronization.

Packaging-induced failure of semiconductor lasers and optical telecommunications components

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sharps, J.A.

1996-12-31

Telecommunications equipment for field deployment generally have specified lifetimes of > 100,000 hr. To achieve this high reliability, it is common practice to package sensitive components in hermetic, inert gas environments. The intent is to protect components from particulate and organic contamination, oxidation, and moisture. However, for high power density 980 nm diode lasers used in optical amplifiers, the authors found that hermetic, inert gas packaging induced a failure mode not observed in similar, unpackaged lasers. They refer to this failure mode as packaging-induced failure, or PIF. PIF is caused by nanomole amounts of organic contamination which interact with highmore » intensity 980 nm light to form solid deposits over the emitting regions of the lasers. These deposits absorb 980 nm light, causing heating of the laser, narrowing of the band gap, and eventual thermal runaway. The authors have found PIF is averted by packaging with free O{sub 2} and/or a getter material that sequesters organics.« less

Radiolysis products and sensory properties of electron-beam-irradiated high-barrier food-packaging films containing a buried layer of recycled low-density polyethylene.

PubMed

Chytiri, S D; Badeka, A V; Riganakos, K A; Kontominas, M G

2010-04-01

The aim was to study the effect of electron-beam irradiation on the production of radiolysis products and sensory changes in experimental high-barrier packaging films composed of polyamide (PA), ethylene-vinyl alcohol (EVOH) and low-density polyethylene (LDPE). Films contained a middle buried layer of recycled LDPE, while films containing 100% virgin LDPE as the middle buried layer were taken as controls. Irradiation doses ranged between zero and 60 kGy. Generally, a large number of radiolysis products were produced during electron-beam irradiation, even at the lower absorbed doses of 5 and 10 kGy (approved doses for food 'cold pasteurization'). The quantity of radiolysis products increased with irradiation dose. There were no significant differences in radiolysis products identified between samples containing a recycled layer of LDPE and those containing virgin LDPE (all absorbed doses), indicating the 'functional barrier' properties of external virgin polymer layers. Sensory properties (mainly taste) of potable water were affected after contact with irradiated as low as 5 kGy packaging films. This effect increased with increasing irradiation dose.

Thermal Characterization for a Modular 3-D Multichip Module

NASA Technical Reports Server (NTRS)

Fan, Mark S.; Plante, Jeannette; Shaw, Harry

2000-01-01

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

The fate of a toxigenic strain of Staphylococcus aureus in vacuum-packaged bacon.

PubMed

Dempster, J F; Kelly, W R

1973-09-01

Pork was cured by (a) the Wiltshire method and (b) a hygienic sweet cure process. Representative samples of both bacons were inoculated at ;low' density (10(3) organisms/g.) and ;high' density (10(6) organisms/g.) with a toxin-producing strain of Staphylococcus aureus, ;High' and ;low' density samples of both bacons were each stored at 5 degrees C. for 42 days and 15 degrees C. for 21 days.Results indicated that the test organism at high inoculum density grew slowly in both bacons at 5 degrees C. The organism survived at 5 degrees C. in both ;low density' bacons. At 15 degrees C. the test organism grew; growth being more pronounced in the ;hygienic' than in Wiltshire bacon.

Ferroelectric nanoparticle-embedded sponge structure triboelectric generators

NASA Astrophysics Data System (ADS)

Park, Daehoon; Shin, Sung-Ho; Yoon, Ick-Jae; Nah, Junghyo

2018-05-01

We report high-performance triboelectric nanogenerators (TENGs) employing ferroelectric nanoparticles (NPs) embedded in a sponge structure. The ferroelectric BaTiO3 NPs inside the sponge structure play an important role in increasing surface charge density by polarized spontaneous dipoles, enabling the packaging of TENGs even with a minimal separation gap. Since the friction surfaces are encapsulated in the packaged device structure, it suffers negligible performance degradation even at a high relative humidity of 80%. The TENGs also demonstrated excellent mechanical durability due to the elasticity and flexibility of the sponge structure. Consequently, the TENGs can reliably harvest energy even under harsh conditions. The approach introduced here is a simple, effective, and reliable way to fabricate compact and packaged TENGs for potential applications in wearable energy-harvesting devices.

Ferroelectric nanoparticle-embedded sponge structure triboelectric generators.

PubMed

Park, Daehoon; Shin, Sung-Ho; Yoon, Ick-Jae; Nah, Junghyo

2018-05-04

We report high-performance triboelectric nanogenerators (TENGs) employing ferroelectric nanoparticles (NPs) embedded in a sponge structure. The ferroelectric BaTiO 3 NPs inside the sponge structure play an important role in increasing surface charge density by polarized spontaneous dipoles, enabling the packaging of TENGs even with a minimal separation gap. Since the friction surfaces are encapsulated in the packaged device structure, it suffers negligible performance degradation even at a high relative humidity of 80%. The TENGs also demonstrated excellent mechanical durability due to the elasticity and flexibility of the sponge structure. Consequently, the TENGs can reliably harvest energy even under harsh conditions. The approach introduced here is a simple, effective, and reliable way to fabricate compact and packaged TENGs for potential applications in wearable energy-harvesting devices.

Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress

NASA Astrophysics Data System (ADS)

Chen, Po-Ying; Kung, Heng-Yu; Lai, Yi-Shao; Hsiung Tsai, Ming; Yeh, Wen-Kuan

2008-02-01

In this work, we present a novel approach and method for elucidating the characteristics of wafer-level chip-scale packages (WLCSPs) for electromigration (EM) tests. The die in WLCSP was directly attached to the substrate via a soldered interconnect. The shrinking of the area of the die that is available for power, and the solder bump also shrinks the volume and increases the density of electrons for interconnect efficiency. The bump current density now approaches to 106 A/cm2, at which point the EM becomes a significant reliability issue. As known, the EM failure depends on numerous factors, including the working temperature and the under bump metallization (UBM) thickness. A new interconnection geometry is adopted extensively with moderate success in overcoming larger mismatches between the displacements of components during current and temperature changes. Both environments and testing parameters for WLCSP are increasingly demanded. Although failure mechanisms are considered to have been eliminated or at least made manageable, new package technologies are again challenging its process, integrity and reliability. WLCSP technology was developed to eliminate the need for encapsulation to ensure compatibility with smart-mount technology (SMT). The package has good handing properties but is now facing serious reliability problems. In this work, we investigated the reliability of a WLCSP subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 °C. A very strong correlation exists between the mean time to failure (MTTF) of the WLCSP test vehicle and the mean current density that is carried by a solder joint. A series of current densities were applied to the WLCSP architecture; Black's power law was employed in a failure mode simulation. Additionally, scanning electron microscopy (SEM) was adopted to determine the differences existing between high- and low-current-density failure modes.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Salama, A.; Mikhail, M.

Comprehensive software packages have been developed at the Western Research Centre as tools to help coal preparation engineers analyze, evaluate, and control coal cleaning processes. The COal Preparation Software package (COPS) performs three functions: (1) data handling and manipulation, (2) data analysis, including the generation of washability data, performance evaluation and prediction, density and size modeling, evaluation of density and size partition characteristics and attrition curves, and (3) generation of graphics output. The Separation ChARacteristics Estimation software packages (SCARE) are developed to balance raw density or size separation data. The cases of density and size separation data are considered. Themore » generated balanced data can take the balanced or normalized forms. The scaled form is desirable for direct determination of the partition functions (curves). The raw and generated separation data are displayed in tabular and/or graphical forms. The computer softwares described in this paper are valuable tools for coal preparation plant engineers and operators for evaluating process performance, adjusting plant parameters, and balancing raw density or size separation data. These packages have been applied very successfully in many projects carried out by WRC for the Canadian coal preparation industry. The software packages are designed to run on a personal computer (PC).« less

High voltage requirements and issues for the 1990's. [for spacecraft power supplies

NASA Technical Reports Server (NTRS)

Dunbar, W. G.; Faymon, K. A.

1984-01-01

The development of high-power high-voltage space systems will require advances in power generation and processing. The systems must be reliable, adaptable, and durable for space mission success. The issues, which must be resolved in order to produce a high power system, are weight and volume reduction of components and modules and the creation of a reliable high repetition pulse power processor. Capacitor energy density must be increased by twice the present capacity and packaging must be reduced by a factor of 10 to 20 times. The packaging must also protect the system from interaction with the natural space environment and the induced environment, produced from spacecraft systems and environment interaction.

21 CFR 178.3130 - Antistatic and/or anti-fogging agents in food-packaging materials.

Code of Federal Regulations, 2010 CFR

2010-04-01

... antistatic agent at levels not to exceed 0.2 percent by weight in molded or extruded high-density polyethylene (having a density ≥0.95 g/cm3 and polypropylene containers that contact food only of the types... levels not to exceed 0.15 pct by weight in molded or extruded polyethylene containers that contact food...

Fabrication of Solid-State Multilayer Glass Capacitors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wilke, Rudeger H. T.; Brown-Shaklee, Harlan James; Casias, Adrian L.

Alkali-free glasses show immense promise for the development of high-energy density capacitors. The high breakdown strengths on single-layer sheets of glass suggest the potential for improved energy densities over existing state-of-the art polymer capacitors. In this paper, we demonstrate the ability to package thin glass to make solid-state capacitors. Individual layers are bonded using epoxy, leading to capacitors that exhibit stable operation over the temperature range -55 °C to +65 °C. Here, this fabrication approach is scalable and allows for proof testing individual layers prior to incorporation of the stack, providing a blueprint for the fabrication of high-energy density capacitors.

Fabrication of Solid-State Multilayer Glass Capacitors

DOE PAGES

Wilke, Rudeger H. T.; Brown-Shaklee, Harlan James; Casias, Adrian L.; ...

2017-07-31

Alkali-free glasses show immense promise for the development of high-energy density capacitors. The high breakdown strengths on single-layer sheets of glass suggest the potential for improved energy densities over existing state-of-the art polymer capacitors. In this paper, we demonstrate the ability to package thin glass to make solid-state capacitors. Individual layers are bonded using epoxy, leading to capacitors that exhibit stable operation over the temperature range -55 °C to +65 °C. Here, this fabrication approach is scalable and allows for proof testing individual layers prior to incorporation of the stack, providing a blueprint for the fabrication of high-energy density capacitors.

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages.

PubMed

Carlton, Holly D; Elmer, John W; Li, Yan; Pacheco, Mario; Goyal, Deepak; Parkinson, Dilworth Y; MacDowell, Alastair A

2016-04-13

Synchrotron radiation micro-tomography (SRµT) is a non-destructive three-dimensional (3D) imaging technique that offers high flux for fast data acquisition times with high spatial resolution. In the electronics industry there is serious interest in performing failure analysis on 3D microelectronic packages, many which contain multiple levels of high-density interconnections. Often in tomography there is a trade-off between image resolution and the volume of a sample that can be imaged. This inverse relationship limits the usefulness of conventional computed tomography (CT) systems since a microelectronic package is often large in cross sectional area 100-3,600 mm(2), but has important features on the micron scale. The micro-tomography beamline at the Advanced Light Source (ALS), in Berkeley, CA USA, has a setup which is adaptable and can be tailored to a sample's properties, i.e., density, thickness, etc., with a maximum allowable cross-section of 36 x 36 mm. This setup also has the option of being either monochromatic in the energy range ~7-43 keV or operating with maximum flux in white light mode using a polychromatic beam. Presented here are details of the experimental steps taken to image an entire 16 x 16 mm system within a package, in order to obtain 3D images of the system with a spatial resolution of 8.7 µm all within a scan time of less than 3 min. Also shown are results from packages scanned in different orientations and a sectioned package for higher resolution imaging. In contrast a conventional CT system would take hours to record data with potentially poorer resolution. Indeed, the ratio of field-of-view to throughput time is much higher when using the synchrotron radiation tomography setup. The description below of the experimental setup can be implemented and adapted for use with many other multi-materials.

Sodium content in packaged foods by census division in the United States, 2009.

PubMed

Lee, Alexandra K; Schieb, Linda J; Yuan, Keming; Maalouf, Joyce; Gillespie, Cathleen; Cogswell, Mary E

2015-04-02

Excess sodium intake correlates positively with high blood pressure. Blood pressure varies by region, but whether sodium content of foods sold varies across regions is unknown. We combined nutrition and sales data from 2009 to assess the regional variation of sodium in packaged food products sold in 3 of the 9 US census divisions. Although sodium density and concentration differed little by region, fewer than half of selected food products met Food and Drug Administration sodium-per-serving conditions for labeling as "healthy." Regional differences in hypertension were not reflected in differences in the sodium content of packaged foods from grocery stores.

The equation of state package FEOS for high energy density matter

NASA Astrophysics Data System (ADS)

Faik, Steffen; Tauschwitz, Anna; Iosilevskiy, Igor

2018-06-01

Adequate equation of state (EOS) data is of high interest in the growing field of high energy density physics and especially essential for hydrodynamic simulation codes. The semi-analytical method used in the newly developed Frankfurt equation of state (FEOS) package provides an easy and fast access to the EOS of - in principle - arbitrary materials. The code is based on the well known QEOS model (More et al., 1988; Young and Corey, 1995) and is a further development of the MPQeos code (Kemp and Meyer-ter Vehn, 1988; Kemp and Meyer-ter Vehn, 1998) from Max-Planck-Institut für Quantenoptik (MPQ) in Garching Germany. The list of features contains the calculation of homogeneous mixtures of chemical elements and the description of the liquid-vapor two-phase region with or without a Maxwell construction. Full flexibility of the package is assured by its structure: A program library provides the EOS with an interface designed for Fortran or C/C++ codes. Two additional software tools allow for the generation of EOS tables in different file output formats and for the calculation and visualization of isolines and Hugoniot shock adiabats. As an example the EOS of fused silica (SiO2) is calculated and compared to experimental data and other EOS codes.

Self-Patterning of Silica/Epoxy Nanocomposite Underfill by Tailored Hydrophilic-Superhydrophobic Surfaces for 3D Integrated Circuit (IC) Stacking.

PubMed

Tuan, Chia-Chi; James, Nathan Pataki; Lin, Ziyin; Chen, Yun; Liu, Yan; Moon, Kyoung-Sik; Li, Zhuo; Wong, C P

2017-03-15

As microelectronics are trending toward smaller packages and integrated circuit (IC) stacks nowadays, underfill, the polymer composite filled in between the IC chip and the substrate, becomes increasingly important for interconnection reliability. However, traditional underfills cannot meet the requirements for low-profile and fine pitch in high density IC stacking packages. Post-applied underfills have difficulties in flowing into the small gaps between the chip and the substrate, while pre-applied underfills face filler entrapment at bond pads. In this report, we present a self-patterning underfilling technology that uses selective wetting of underfill on Cu bond pads and Si 3 N 4 passivation via surface energy engineering. This novel process, fully compatible with the conventional underfilling process, eliminates the issue of filler entrapment in typical pre-applied underfilling process, enabling high density and fine pitch IC die bonding.

Advances in rechargeable lithium molybdenum disulfide batteries

NASA Technical Reports Server (NTRS)

Brandt, K.; Stiles, J. A. R.

1985-01-01

The lithium molybdenum disulfide system as demonstrated in a C size cell, offers performance characteristics for applications where light weight and low volume are important. A gravimetric energy density of 90 watt hours per kilogram can be achieved in a C size cell package. The combination of charge retention capabilities, high energy density and a state of charge indicator in a rechargeable cell provides power package for a wide range of devices. The system overcomes the memory effect in Nicads where the full capacity of the battery cannot be utilized unless it was utilized on previous cycles. The development of cells with an advanced electrolyte formulation led to an improved rate capability especially at low temperatures and to a significantly improved life cycle.

Packaging's Contribution for the Effectiveness of the Space Station's Food Service Operation

NASA Technical Reports Server (NTRS)

Rausch, B. A.

1985-01-01

Storage limitations will have a major effect on space station food service. For example: foods with low bulk density such as ice cream, bread, cake, standard type potato chips and other low density snacks, flaked cereals, etc., will exacerbate the problem of space limitations; package containers are inherently volume consuming and refuse creating; and the useful observation that the optimum package is no package at all leads to the tentative conclusion that the least amount of packaging per unit of food, consistent with storage, aesthetics, preservation, cleanliness, cost and disposal criteria, is the most practical food package for the space station. A series of trade offs may have to be made to arrive at the most appropriate package design for a particular type of food taking all the criteria into account. Some of these trade offs are: single serve vs. bulk; conventional oven vs. microwave oven; nonmetallic aseptically vs. non-aseptically packaged foods; and comparison of aseptic vs. nonaseptic food packages. The advantages and disadvantages are discussed.

Stochastic approach for radionuclides quantification

NASA Astrophysics Data System (ADS)

Clement, A.; Saurel, N.; Perrin, G.

2018-01-01

Gamma spectrometry is a passive non-destructive assay used to quantify radionuclides present in more or less complex objects. Basic methods using empirical calibration with a standard in order to quantify the activity of nuclear materials by determining the calibration coefficient are useless on non-reproducible, complex and single nuclear objects such as waste packages. Package specifications as composition or geometry change from one package to another and involve a high variability of objects. Current quantification process uses numerical modelling of the measured scene with few available data such as geometry or composition. These data are density, material, screen, geometric shape, matrix composition, matrix and source distribution. Some of them are strongly dependent on package data knowledge and operator backgrounds. The French Commissariat à l'Energie Atomique (CEA) is developing a new methodology to quantify nuclear materials in waste packages and waste drums without operator adjustment and internal package configuration knowledge. This method suggests combining a global stochastic approach which uses, among others, surrogate models available to simulate the gamma attenuation behaviour, a Bayesian approach which considers conditional probability densities of problem inputs, and Markov Chains Monte Carlo algorithms (MCMC) which solve inverse problems, with gamma ray emission radionuclide spectrum, and outside dimensions of interest objects. The methodology is testing to quantify actinide activity in different kind of matrix, composition, and configuration of sources standard in terms of actinide masses, locations and distributions. Activity uncertainties are taken into account by this adjustment methodology.

Low Temperature and Modified Atmosphere: Hurdles for Antibiotic Resistance Transfer?

PubMed

Van Meervenne, Eva; Van Coillie, Els; Van Weyenberg, Stephanie; Boon, Nico; Herman, Lieve; Devlieghere, Frank

2015-12-01

Food is an important dissemination route for antibiotic-resistant bacteria. Factors used during food production and preservation may contribute to the transfer of antibiotic resistance genes, but research on this subject is scarce. In this study, the effect of temperature (7 to 37°C) and modified atmosphere packaging (air, 50% CO2-50% N2, and 100% N2) on antibiotic resistance transfer from Lactobacillus sakei subsp. sakei to Listeria monocytogenes was evaluated. Filter mating was performed on nonselective agar plates with high-density inocula. A more realistic setup was created by performing modified atmosphere experiments on cooked ham using high-density and low-density inocula. Plasmid transfer was observed between 10 and 37°C, with plasmid transfer also observed at 7°C during a prolonged incubation period. When high-density inocula were used, transconjugants were detected, both on agar plates and cooked ham, under the three atmospheres (air, 50% CO2-50% N2, and 100% N2) at 7°C. This yielded a median transfer ratio (number of transconjugants/number of recipients) with an order of magnitude of 10(-4) to 10(-6). With low-density inocula, transfer was only detected under the 100% N2 atmosphere after 10-day incubation at 7°C, yielding a transfer ratio of 10(-5). Under this condition, the highest bacterial density was obtained. The results indicate that low temperature and modified atmosphere packaging, two important hurdles in the food industry, do not necessarily prevent plasmid transfer from Lactobacillus sakei subsp. sakei to Listeria monocytogenes.

DARPA/ISTO Rapid VLSI Implementation

DTIC Science & Technology

1991-12-01

temperature tigation. Motorola MCI00E111, very fast 1:9 clock buffers. were procured to drive high - speed waveforrms onto the substrate clock distribution...The hot image is normalized to a rootn- temperature image, which removes all optical anomalies and leaves a high -resolution thermal image. 69 j APT...9 High -density DRAM ..................... 9 Aquarius MI Packaging Study ........................ ....... 10 NUT Alewife

Microbial barrier assessment of Tyvek stopper packaging for rubber closures.

PubMed

Moldenhauer, J E; Bass, S A; Kupinski, M J; Walters, M L; Rubio, S L

1996-01-01

Two types of Tyvek and high density polyethylene or polypropylene packaging used for sterilization of rubber closures were evaluated for Microbial Barrier properties. The packaging evaluated was "Ready to Sterilize" (1) stoppers and a second test package (Test 2) which was designated as appropriate for a clean room, filled with washed and siliconized stoppers and then heat sealed. Each type of packaging was subjected to three different sterilization temperatures (125 degrees C, 128 degrees C and 131 degrees C) in a production sterilizer (15-18 psi). Following sterilization, a microbial barrier assessment was performed, using Bacillus subtilis niger (ATCC 9372), to determine whether the packaging could maintain a sterile barrier following sterilization. Results of the testing indicated that a microbial barrier was maintained for products in "Ready to Sterilize" packages at 125 degrees C and 128 degrees C. For products sterilized in the Test 2 container a microbial barrier could not be maintained at 128 degrees C, and no further testing was performed. Following sterilization at 131 degrees C physical defects were noted for the "Ready to Sterilize" bag and a microbial barrier could not be maintained.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

Assessing contamination of smoked sprats (Sprattus sprattus) with polycyclic aromatic hydrocarbons (PAHs) and changes in its level during storage in various types of packaging.

PubMed

Kuźmicz, Kamila; Ciemniak, Artur

2018-01-02

The analysis of material used in this study demonstrated that the amount of polycyclic aromatic hydrocarbons (PAHs) in smoked sprats varies from the level below the lowest detection limit in muscles up to 9.99 µg kg -1 of benzo[a]pyrene (BaP) in fish skin. Such a high level of PAHs in skin was reported only in one of six batches of sprats, while mean BaP level was at 1.69 µg kg -1 . Regardless such a high BaP level in skin, its concentration in muscles did not exceed the maximum acceptable level. The study objective was to assess to what extent packaging materials adsorb PAH compounds from food. Changes in the PAH levels were monitored in fish during their storage in packages made of various materials. The storage time was from 0 to 168 hours. The obtained results varied considerably, therefore their scatter did not allow to confirm unequivocally the preliminary hypothesis about the reduction of PAHs due to their migration to packaging material. However, analysis of the packaging used in this study demonstrated a significant increase in the level of total 16 PAHs. When high-density polyethylene (HDPE) packaging was analysed, a six-fold increase in the total 16 PAHs was observed comparing to the blank sample.

Theoretical and Experimental Beam Plasma Physics (TEBPP)

NASA Technical Reports Server (NTRS)

Roberts, W. T.

1985-01-01

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is deployed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations in the near field ( 10 m) and mid field (10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Theoretical and Experimental Beam Plasma Physics (TEBPP)

NASA Technical Reports Server (NTRS)

Roberts, B.

1986-01-01

The theoretical and experimental beam plasma physics (TEBPP) consists of a package of five instruments to measure electric and magnetic fields, plasma density and temperature, neutral density, photometric emissions, and energetic particle spectra during firings of the particle injector (SEPAC) electron beam. The package is developed on a maneuverable boom (or RMS) and is used to measure beam characteristics and induced perturbations field ( 10 m) and mid field ( 10 m to 100 m) along the electron beam. The TEBPP package will be designed to investigate induced oscillations and induced electromagnetic mode waves, neutral and ion density and temperature effects, and beam characteristics as a function of axial distance.

Resistance to moist conditions of whey protein isolate and pea starch biodegradable films and low density polyethylene nondegradable films: a comparative study

NASA Astrophysics Data System (ADS)

Mehyar, G. F.; Bawab, A. Al

2015-10-01

Biodegradable packaging materials are degraded under the natural environmental conditions. Therefore using them could alleviate the problem of plastics accumulation in nature. For effective replacement of plastics, with biodegradable materials, biodegradable packages should keep their properties under the high relative humidity (RH) conditions. Therefore the objectives of the study were to develop biodegradable packaging material based on whey protein isolate (WPI) and pea starch (PS). To study their mechanical, oxygen barrier and solubility properties under different RHs compared with those of low density polyethylene (LDPE), the most used plastic in packaging. Films of WPI and PS were prepared separately and conditioned at different RH (30-90%) then their properties were studied. At low RHs (<50%), WPI films had 2-3 times lower elongation at break (E or stretchability) than PS and LDPE. Increasing RH to 90% significantly (P<0.01) increased the elongation of PS but not WPI and LDPE films. LDPE and WPI films kept significantly (P<0.01) higher tensile strength (TS) than PS films at high RH (90%). Oxygen permeability (OP) of all films was very low (<0.5 cm3 μm m-2 d-1 kPa-1) below 40% RH but increased for PS films and became significantly (P<0.01) different than that of LDPE and WPI at > 40% RH. Oxygen permeability of WPI and LDPE did not adversely affected by increasing RH to 65%. Furthermore, WPI and LDPE films had lower degree of hydration at 50% and 90% RH and total soluble matter than PS films. These results suggest that WPI could be successfully replacing LDPE in packaging of moist products.

Accelerator mass spectrometry analysis of aroma compound absorption in plastic packaging materials

NASA Astrophysics Data System (ADS)

Stenström, Kristina; Erlandsson, Bengt; Hellborg, Ragnar; Wiebert, Anders; Skog, Göran; Nielsen, Tim

1994-05-01

Absorption of aroma compounds in plastic packaging materials may affect the taste of the packaged food and it may also change the quality of the packaging material. A method to determine the aroma compound absorption in polymers by accelerator mass spectrometry (AMS) is being developed at the Lund Pelletron AMS facility. The high sensitivity of the AMS method makes it possible to study these phenomena under realistic conditions. As a first test low density polyethylene exposed to 14C-doped ethyl acetate is examined. After converting the polymer samples with the absorbed aroma compounds to graphite, the {14C }/{13C } ratio of the samples is measured by the AMS system and the degree of aroma compound absorption is established. The results are compared with those obtained by supercritical fluid extraction coupled to gas chromatography (SFE-GC).

Rapid and semi-analytical design and simulation of a toroidal magnet made with YBCO and MgB 2 superconductors

DOE PAGES

Dimitrov, I. K.; Zhang, X.; Solovyov, V. F.; ...

2015-07-07

Recent advances in second-generation (YBCO) high-temperature superconducting wire could potentially enable the design of super high performance energy storage devices that combine the high energy density of chemical storage with the high power of superconducting magnetic storage. However, the high aspect ratio and the considerable filament size of these wires require the concomitant development of dedicated optimization methods that account for the critical current density in type-II superconductors. In this study, we report on the novel application and results of a CPU-efficient semianalytical computer code based on the Radia 3-D magnetostatics software package. Our algorithm is used to simulate andmore » optimize the energy density of a superconducting magnetic energy storage device model, based on design constraints, such as overall size and number of coils. The rapid performance of the code is pivoted on analytical calculations of the magnetic field based on an efficient implementation of the Biot-Savart law for a large variety of 3-D “base” geometries in the Radia package. The significantly reduced CPU time and simple data input in conjunction with the consideration of realistic input variables, such as material-specific, temperature, and magnetic-field-dependent critical current densities, have enabled the Radia-based algorithm to outperform finite-element approaches in CPU time at the same accuracy levels. Comparative simulations of MgB 2 and YBCO-based devices are performed at 4.2 K, in order to ascertain the realistic efficiency of the design configurations.« less

High-density interconnect substrates and device packaging using conductive composites

NASA Astrophysics Data System (ADS)

Gandhi, Pradeep; Gallagher, Catherine; Matijasevic, Goran

1998-02-01

High-end printed circuit board manufacturing technology is receiving increasing attention due to higher functionality in smaller form factors. This is evident from the industry efforts to produced reliable microvias and related trace features to pack as much circuit density as possible. Cost, density and performance requirements have prodded entry into a market that was mainly reserved for ceramic and molded packages for the last forty years. To successfully meet the demanding specifications of this market segment, a worldwide effort is underway for the development of new materials, processes and equipment. A novel base technology that is applicable to most of the major packaging and redistribution elements in an electronic module is presented.High density multilayer circuits with landless blind and buried vias can be fabricated by filling the conductor paste into photoimaged dielectrics and thermally processing it at a relatively lower temperature. Via layers are prepared directly on the inherently planarized circuit layer in an identical fashion. Because these composite materials are applied in an additive fabrication method, metal substrates can be employed for high thermal dissipation and excellent CTE control over a wide temperature range. The conductor material is based on interpenetrating polymer and metal networks that are formed in situ from metal particles and a thermosetting flux/binder. The metal network is formed when the alloy particles melt and react with adjacent high melting point metal particle. Interaction also occurs between the alloy particles and pad, lead or previous trace metallizations provided they are solderable by alloys of tin. The new alloy composition created by the interdiffusion process within the bulk material has a higher melting point than the original alloy and thus solidifies immediately upon formation. This metallurgical reaction, known as transient liquid phase sintering, is facilitated by the polymer mixture. INtegration of the polymer and metal networks is maintained by utilizing a thermosetting polymer system that cures simultaneously with the metallurgical reaction. Although similar in concept and performance to cermet inks, these compositions differ in that their process temperatures are compatible with conventional printed wiring board materials and that the polymeric binder remains to provide adhesion and fatigue resistance to the metallurgical network.

Chip-scale thermal management of high-brightness LED packages

NASA Astrophysics Data System (ADS)

Arik, Mehmet; Weaver, Stanton

2004-10-01

The efficiency and reliability of the solid-state lighting devices strongly depend on successful thermal management. Light emitting diodes, LEDs, are a strong candidate for the next generation, general illumination applications. LEDs are making great strides in terms of lumen performance and reliability, however the barrier to widespread use in general illumination still remains the cost or $/Lumen. LED packaging designers are pushing the LED performance to its limits. This is resulting in increased drive currents, and thus the need for lower thermal resistance packaging designs. As the power density continues to rise, the integrity of the package electrical and thermal interconnect becomes extremely important. Experimental results with high brightness LED packages show that chip attachment defects can cause significant thermal gradients across the LED chips leading to premature failures. A numerical study was also carried out with parametric models to understand the chip active layer temperature profile variation due to the bump defects. Finite element techniques were utilized to evaluate the effects of localized hot spots at the chip active layer. The importance of "zero defects" in one of the more popular interconnect schemes; the "epi down" soldered flip chip configuration is investigated and demonstrated.

Effect of Packaging on Shelf-life and Lutein Content of Marigold (Tagetes erecta L.) Flowers.

PubMed

Pal, Sayani; Ghosh, Probir Kumar; Bhattacharjee, Paramita

2016-01-01

African marigold (Tagetes erecta L.) flowers are highly valued for their ornamental appeal as well as medicinal properties. However, their short shelf lives cause high post-harvest loss and limit their export potential. The review of patents and research articles revealed that different types of packaging designs/materials have been successfully employed for extension of shelf lives of cut flowers. The current work focuses on designing of different packaging configurations and selection of best configuration for preservation of marigold cut flowers. Ten packaging configurations, composed of four different packaging materials i.e., low density polyethylene (LDPE), polyethylene terephthalate, glassine paper and cellophane paper, were designed. Each pack, consisting of 20 ± 1 g of marigold flowers along with non-packaged control set were stored at 23 ± 2°C, 80% R.H., in an environmental chamber and the flowers were evaluated for their sensory attributes, phytochemical characteristics and physicochemical parameters of senescence to determine their shelf lives. Flowers packed in LDPE bag showed highest shelf life of 8 days with a lead of 4 days compared to control (shelf life - 4 days). This study also established for the first time the phenomenon of carotenogenesis in marigold cut flowers with significantly (P<0.01) higher production of lutein in LDPE packaged flowers. LDPE pack was the best design among the ten package designs, in preserving lutein content of marigold flowers and extending their shelf lives. This economically viable packaging can not only boost the export potential of this ornamental flower, but also allow utilization of nutraceutical potency of lutein.

GSFC Cutting Edge Avionics Technologies for Spacecraft

NASA Technical Reports Server (NTRS)

Luers, Philip J.; Culver, Harry L.; Plante, Jeannette

1998-01-01

With the launch of NASA's first fiber optic bus on SAMPEX in 1992, GSFC has ushered in an era of new technology development and insertion into flight programs. Predating such programs the Lewis and Clark missions and the New Millenium Program, GSFC has spearheaded the drive to use cutting edge technologies on spacecraft for three reasons: to enable next generation Space and Earth Science, to shorten spacecraft development schedules, and to reduce the cost of NASA missions. The technologies developed have addressed three focus areas: standard interface components, high performance processing, and high-density packaging techniques enabling lower cost systems. To realize the benefits of standard interface components GSFC has developed and utilized radiation hardened/tolerant devices such as PCI target ASICs, Parallel Fiber Optic Data Bus terminals, MIL-STD-1773 and AS1773 transceivers, and Essential Services Node. High performance processing has been the focus of the Mongoose I and Mongoose V rad-hard 32-bit processor programs as well as the SMEX-Lite Computation Hub. High-density packaging techniques have resulted in 3-D stack DRAM packages and Chip-On-Board processes. Lower cost systems have been demonstrated by judiciously using all of our technology developments to enable "plug and play" scalable architectures. The paper will present a survey of development and insertion experiences for the above technologies, as well as future plans to enable more "better, faster, cheaper" spacecraft. Details of ongoing GSFC programs such as Ultra-Low Power electronics, Rad-Hard FPGAs, PCI master ASICs, and Next Generation Mongoose processors.

Reliability of CGA/LGA/HDI Package Board/Assembly (Final Report)

NASA Technical Reports Server (NTRS)

Ghaffaroam. Reza

2014-01-01

Package manufacturers are now offering commercial-off-the-shelf column grid array (COTS CGA) packaging technologies in high-reliability versions. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronics packages. The previous reports, released in January of 2012 and January of 2013, presented package test data, assembly information, and reliability evaluation by thermal cycling for CGA packages with 1752, 1517, 1509, and 1272 inputs/outputs (I/Os) and 1-mm pitch. It presented the thermal cycling (-55C either 100C or 125C) test results for up to 200 cycles. This report presents up to 500 thermal cycles with quality assurance and failure analysis evaluation represented by optical photomicrographs, 2D real time X-ray images, dye-and-pry photomicrographs, and optical/scanning electron Microscopy (SEM) cross-sectional images. The report also presents assembly challenge using reflowing by either vapor phase or rework station of CGA and land grid array (LGA) versions of three high I/O packages both ceramic and plastic configuration. A new test vehicle was designed having high density interconnect (HDI) printed circuit board (PCB) with microvia-in-pad to accommodate both LGA packages as well as a large number of fine pitch ball grid arrays (BGAs). The LGAs either were assembled onto HDI PCB as an LGA or were solder paste print and reflow first to form solder dome on pads before assembly. Both plastic BGAs with 1156 I/O and ceramic LGAs were assembled. It also presented the X-ray inspection results as well as failures due to 200 thermal cycles. Lessons learned on assembly of ceramic LGAs are also presented.

Visualization of electronic density

DOE PAGES

Grosso, Bastien; Cooper, Valentino R.; Pine, Polina; ...

2015-04-22

An atom’s volume depends on its electronic density. Although this density can only be evaluated exactly for hydrogen-like atoms, there are many excellent numerical algorithms and packages to calculate it for other materials. 3D visualization of charge density is challenging, especially when several molecular/atomic levels are intertwined in space. We explore several approaches to 3D charge density visualization, including the extension of an anaglyphic stereo visualization application based on the AViz package to larger structures such as nanotubes. We will describe motivations and potential applications of these tools for answering interesting questions about nanotube properties.

Beneficial effects of polyethylene packages containing micrometer-sized silver particles on the quality and shelf life of dried barberry (Berberis vulgaris).

PubMed

Motlagh, N Valipoor; Mosavian, M T Hamed; Mortazavi, S A; Tamizi, A

2012-01-01

In this research, the effects of low-density polyethylene (LDPE) packages containing micrometer-sized silver particles (LDPE-Ag) on microbial and sensory factors of dried barberry were investigated in comparison with the pure LDPE packages. LDPE-Ag packages with 1% and 2% concentrations of silver particles statistically caused a decrease in the microbial growth of barberry, especially in the case of mold and total bacteria count, compared with the pure LDPE packages. The taste, aroma, appearance, and total acceptance were evaluated by trained panelists using the 9-point hedonic scale. This test showed improvement of all these factors in the samples related to packages containing 1% and 2% concentrations of silver particles in comparison with other samples. Low-density polyethylene package containing micrometer-sized silver particles had beneficial effects on the sensory and microbial quality of barberry when compared with normal packing material. © 2011 Institute of Food Technologists®

DOE Office of Scientific and Technical Information (OSTI.GOV)

Langer, Steven H.; Karlin, Ian; Marinak, Marty M.

HYDRA is used to simulate a variety of experiments carried out at the National Ignition Facility (NIF) [4] and other high energy density physics facilities. HYDRA has packages to simulate radiation transfer, atomic physics, hydrodynamics, laser propagation, and a number of other physics effects. HYDRA has over one million lines of code and includes both MPI and thread-level (OpenMP and pthreads) parallelism. This paper measures the performance characteristics of HYDRA using hardware counters on an IBM BlueGene/Q system. We report key ratios such as bytes/instruction and memory bandwidth for several different physics packages. The total number of bytes read andmore » written per time step is also reported. We show that none of the packages which use significant time are memory bandwidth limited on a Blue Gene/Q. HYDRA currently issues very few SIMD instructions. The pressure on memory bandwidth will increase if high levels of SIMD instructions can be achieved.« less

Potential for on-orbit manufacture of large space structures using the pultrusion process

NASA Technical Reports Server (NTRS)

Wilson, Maywood L.; Macconochie, Ian O.; Johnson, Gary S.

1987-01-01

On-orbit manufacture of lightweight, high-strength, advanced-composite structures using the pultrusion process is proposed. This process is adaptable to a zero-gravity environment by using preimpregnated graphite-fiber reinforcement systems. The reinforcement material is preimpregnated with a high-performance thermoplastic resin at a ground station, is coiled on spools for compact storage, and is transported into Earth orbit. A pultrusion machine is installed in the Shuttle cargo bay from which very long lengths of the desired structure is fabricated on-orbit. Potential structural profiles include rods, angles, channels, hat sections, tubes, honeycomb-cored panels, and T, H, and I beams. A potential pultrudable thermoplastic/graphite composite material is presented as a model for determining the effect on Earth-to-orbit package density of an on-orbit manufacture, the package density is increased by 132 percent, and payload volume requirement is decreased by 56.3 percent. The fabrication method has the potential for on-orbit manufacture of structural members for space platforms, large space antennas, and long tethers.

Influence of Food with High Moisture Content on Oxygen Barrier Property of Polyvinyl Alcohol (PVA)/Vermiculite Nanocomposite Coated Multilayer Packaging Film.

PubMed

Kim, Jung Min; Lee, Min Hyeock; Ko, Jung A; Kang, Dong Ho; Bae, Hojae; Park, Hyun Jin

2018-02-01

This study investigates the potential complications in applying nanoclay-based waterborne coating to packaging films for food with high moisture content. Multilayer packaging films were prepared by dry laminating commercially available polyvinyl alcohol (PVA)/vermiculite nanocomposite coating films and linear low-density polyethylene film, and the changes in oxygen barrier properties were investigated according to different relative humidity using 3 types of food simulants. When the relative humidity was above 60%, the oxygen permeability increased sharply, but this was reversible. Deionized water and 3% acetic acid did not cause any large structural change in the PVA/vermiculite nanocomposite but caused a reversible deterioration of the oxygen barrier properties. In contrast, 50% ethanol, a simulant for the semifatty food, induced irreversible structural changes with deterioration of the oxygen barrier property. These changes are due to the characteristics of PVA rather than vermiculite. We believe this manuscript would be of interest to the wide group of researchers, organizations, and companies in the field of developing nanoclay-based gas barrier packaging for foods with high moisture content. Hence, we wish to diffuse our knowledge to the scientific community. © 2018 Institute of Food Technologists®.

Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning; Fricke-Begemann, Thomas; Ihlemann, Jürgen

2014-03-01

The future need for more bandwidth forces the development of optical transmission solutions for rack-to-rack, boardto- board and chip-to-chip interconnects. The goals are significant reduction of power consumption, highest density and potential for bandwidth scalability to overcome the limitations of the systems today with mostly copper based interconnects. For system integration the enabling of thin glass as a substrate material for electro-optical components with integrated micro-optics for efficient light coupling to integrated optical waveguides or fibers is becoming important. Our glass based packaging approach merges micro-system packaging and glass integrated optics. This kind of packaging consists of a thin glass substrate with integrated micro lenses providing a platform for photonic component assembly and optical fiber or waveguide interconnection. Thin glass is commercially available in panel and wafer size and characterizes excellent optical and high frequency properties. That makes it perfect for microsystem packaging. A suitable micro lens approach has to be comparable with different commercial glasses and withstand post-processing like soldering. A benefit of using laser ablated Fresnel lenses is the planar integration capability in the substrate for highest integration density. In the paper we introduce our glass based packaging concept and the Fresnel lens design for different scenarios like chip-to-fiber, chip-to-optical-printed-circuit-board coupling. Based on the design the Fresnel lenses were fabricated by using a 157 nm fluorine laser ablation system.

Compact DFB laser modules with integrated isolator at 935 nm

NASA Astrophysics Data System (ADS)

Reggentin, M.; Thiem, H.; Tsianos, G.; Malach, M.; Hofmann, J.; Plocke, T.; Kneier, M.; Richter, L.

2018-02-01

New developments in industrial applications and applications under rough environmental conditions within the field of spectroscopy and quantum technology in the 935 nm wavelength regime demand new compact, stable and robust laser systems. Beside a stable laser source the integration of a compact optical isolator is necessary to reduce size and power consumption for the whole laser system. The integration of a suitable optical isolator suppresses back reflections from the following optical system efficiently. However, the miniaturization of the optics inside the package leads to high optical power density levels that make a more detailed analysis of the components and their laser damage threshold necessary. We present test results on compact stable DFB laser sources (butterfly style packages) with newly integrated optical isolators operating around 935 nm. The presented data includes performance and lifetime tests for the laser diodes as well as package components. Overall performance data of the packaged laser diodes will be shown as well.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

LIP: The Livermore Interpolation Package, Version 1.6

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fritsch, F. N.

2016-01-04

This report describes LIP, the Livermore Interpolation Package. LIP was totally rewritten from the package described in [1]. In particular, the independent variables are now referred to as x and y, since it is a general-purpose package that need not be restricted to equation of state data, which uses variables ρ (density) and T (temperature).

Reparable, high-density microelectronic module provides effective heat sink

NASA Technical Reports Server (NTRS)

Carlson, K. J.; Maytone, F. F.

1967-01-01

Reparable modular system is used for packaging microelectronic flat packs and miniature discrete components. This three-dimensional compartmented structure incorporates etched phosphor bronze sheets and frames with etched wire conductors. It provides an effective heat sink for electric power dissipation in the absence of convective cooling means.

Study on ternary low density polyethylene/linear low density polyethylene/thermoplastic starch blend films.

PubMed

Sabetzadeh, Maryam; Bagheri, Rouhollah; Masoomi, Mahmood

2015-03-30

In this work, low-density polyethylene/linear low-density polyethylene/thermoplastic starch (LDPE/LLDPE/TPS) films are prepared with the aim of obtaining environmentally friendly materials containing high TPS content with required packaging properties. Blending of LDPE/LLDPE (70/30 wt/wt) with 5-20 wt% of TPS and 3 wt% of PE-grafted maleic anhydride (PE-g-MA) is performed in a twin-screw extruder, followed by the blowing process. Differential scanning calorimetric results indicate starch has more pronounced effect on crystallization of LLDPE than LDPE. Scanning electron micrograph shows a fairly good dispersion of TPS in PE matrices. Fourier transfer infrared spectra confirm compatibility between polymers using PE-g-MA as the compatibilizer. Storage modulus, loss modulus and complex viscosity increase with incorporation of starch. Tensile strength and elongation-at-break decrease from 18 to 10.5 MPa and 340 to 200%, respectively when TPS increases from 5 to 20%. However, the required mechanical properties for packaging applications are attained when 15 wt% starch is added, as specified in ASTM D4635. Finally 12% increase in water uptake is achieved with inclusion of 15 wt% starch. Copyright © 2014 Elsevier Ltd. All rights reserved.

Food losses, shelf life extension and environmental impact of a packaged cheesecake: A life cycle assessment.

PubMed

Gutierrez, Michele Mario; Meleddu, Marta; Piga, Antonio

2017-01-01

Packaging is associated with a high environmental impact. This is also the case in the food industry despite packaging being necessary for maintaining food quality, safety assurance and preventing food waste. The aim of the present study was to identify improvements in food packaging solutions able to minimize environmental externalities while maximizing the economic sustainability. To this end, the life cycle assessment (LCA) methodology was applied to evaluate the environmental performance of new packaging solutions. The environmental impact of packaging and food losses and the balance between the two were examined in relation to a cheesecake that is normally packaged in low density polyethylene film and has a limited shelf life due to microbial growth. A shelf life extension was sought via application of the well-established modified atmosphere packaging (MAP) technique. Samples for MAP (N 2 /CO 2 : 70/30) were placed inside multilayer gas barrier trays, which were then wrapped with a multilayer gas and water barrier film (i.e. AerPack packaging); control batches were packaged in gas barrier recycled polyethylene terephthalate (XrPet) trays and wrapped with a XrPet film. Samples were then stored at 20°C and inspected at regular intervals for chemical-physical, microbiological and sensory parameters. Results show that the new packaging solution could considerably extend the shelf life of cheesecakes, thereby reducing food waste and decreasing the overall environmental impact. Moreover, the new packaging allows one to minimize transport costs and to generate economies of scale in manufacturing. Copyright © 2016 Elsevier Ltd. All rights reserved.

High temperature insulation materials for reradiative thermal protection systems

NASA Technical Reports Server (NTRS)

Hughes, T. A.

1972-01-01

Results are presented of a two year program to evaluate packaged thermal insulations for use under a metallic radiative TPS of a shuttle orbiter vehicle. Evaluations demonstrated their survival for up to 100 mission reuse cycles under shuttle acoustic and thermal loads with peak temperatures of 1000 F, 1800 F, 2000 F, 2200 F and 2500 F. The specimens were composed of low density refractory fiber felts, packaged in thin gage metal foils. In addition, studies were conducted on the venting requirements of the packages, salt spray resistance of the metal foils, and the thermal conductivity of many of the insulations as a function of temperature and ambient air pressure. Data is also presented on the radiant energy transport through insulations, and back-scattering coefficients were experimentally determined as a function of source temperature.

Materials for high-density electronic packaging and interconnection

NASA Technical Reports Server (NTRS)

1990-01-01

Electronic packaging and interconnections are the elements that today limit the ultimate performance of advanced electronic systems. Materials in use today and those becoming available are critically examined to ascertain what actions are needed for U.S. industry to compete favorably in the world market for advanced electronics. Materials and processes are discussed in terms of the final properties achievable and systems design compatibility. Weak points in the domestic industrial capability, including technical, industrial philosophy, and political, are identified. Recommendations are presented for actions that could help U.S. industry regain its former leadership position in advanced semiconductor systems production.

A Novel and Generalized Lithium-Ion-Battery Configuration utilizing Al Foil as Both Anode and Current Collector for Enhanced Energy Density.

PubMed

Ji, Bifa; Zhang, Fan; Sheng, Maohua; Tong, Xuefeng; Tang, Yongbing

2017-02-01

A novel battery configuration based on an aluminum foil anode and a conventional cathode is developed. The aluminum foil plays a dual role as both the active anode material and the current collector, which enhances the energy density of the packaged battery, and reduces the production cost. This generalized battery configuration has high potential for application in next-generation lithium-ion batteries. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Communication: Origin of the contributions to DNA structure in phages

PubMed Central

Myers, Christopher G.; Pettitt, B. Montgomery

2013-01-01

Cryo electron microscopy (cryo-EM) data of the interior of phages show ordering of the interior DNA that has been interpreted as a nearly perfectly ordered polymer. We show surface-induced correlations, excluded volume, and electrostatic forces are sufficient to predict most of the major features of the current structural data for DNA packaged within viral capsids without additional ordering due to elastic bending forces for the polymer. Current models assume highly-ordered, even spooled, hexagonally packed conformations based on interpretation of cryo-EM density maps. We show herein that the surface induced packing of short (6mer), unconnected DNA polymer segments is the only necessary ingredient in creating ringed densities consistent with experimental density maps. This implies the ensemble of possible conformations of polymeric DNA within the capsid that are consistent with cryo-EM data may be much larger than implied by traditional interpretations where such rings can only result from highly-ordered spool-like conformations. This opens the possibility of a more disordered, entropically-driven view of phage packaging thermodynamics. We also show the electrostatics of the DNA contributes a large portion of the internal hydrostatic and osmotic pressures of a phage virion, suggesting that nonlinear elastic anomalies might reduce the overall elastic bending enthalpy of more disordered conformations to have allowable free energies. PMID:23444988

Communication: Origin of the contributions to DNA structure in phages.

PubMed

Myers, Christopher G; Pettitt, B Montgomery

2013-02-21

Cryo electron microscopy (cryo-EM) data of the interior of phages show ordering of the interior DNA that has been interpreted as a nearly perfectly ordered polymer. We show surface-induced correlations, excluded volume, and electrostatic forces are sufficient to predict most of the major features of the current structural data for DNA packaged within viral capsids without additional ordering due to elastic bending forces for the polymer. Current models assume highly-ordered, even spooled, hexagonally packed conformations based on interpretation of cryo-EM density maps. We show herein that the surface induced packing of short (6mer), unconnected DNA polymer segments is the only necessary ingredient in creating ringed densities consistent with experimental density maps. This implies the ensemble of possible conformations of polymeric DNA within the capsid that are consistent with cryo-EM data may be much larger than implied by traditional interpretations where such rings can only result from highly-ordered spool-like conformations. This opens the possibility of a more disordered, entropically-driven view of phage packaging thermodynamics. We also show the electrostatics of the DNA contributes a large portion of the internal hydrostatic and osmotic pressures of a phage virion, suggesting that nonlinear elastic anomalies might reduce the overall elastic bending enthalpy of more disordered conformations to have allowable free energies.

Column Grid Array Rework for High Reliability

NASA Technical Reports Server (NTRS)

Mehta, Atul C.; Bodie, Charles C.

2008-01-01

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

Advanced packaging for Integrated Micro-Instruments

NASA Technical Reports Server (NTRS)

Lyke, James L.

1995-01-01

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

High-sensitivity Leak-testing Method with High-Resolution Integration Technique

NASA Astrophysics Data System (ADS)

Fujiyoshi, Motohiro; Nonomura, Yutaka; Senda, Hidemi

A high-resolution leak-testing method named HR (High-Resolution) Integration Technique has been developed for MEMS (Micro Electro Mechanical Systems) sensors such as a vibrating angular-rate sensor housed in a vacuum package. Procedures of the method to obtain high leak-rate resolution were as follows. A package filled with helium gas was kept in a small accumulation chamber to accumulate helium gas leaking from the package. After the accumulation, the accumulated helium gas was introduced into a mass spectrometer in a short period of time, and the flux of the helium gas was measured by the mass spectrometer as a transient phenomenon. The leak-rate of the package was calculated from the detected transient waveform of the mass spectrometer and the accumulation time of the helium gas in the accumulation chamber. Because the density of the helium gas in the vacuum chamber increased and the accumulated helium gas was measured in a very short period of time with the mass spectrometer, the peak strength of the transient waveform became high and the signal to noise ratio was much improved. The detectable leak-rate resolution of the technique reached 1×10-15 (Pa·m3/s). This resolution is 103 times superior to that of the conventional helium vacuum integration method. The accuracy of the measuring system was verified with a standard helium gas leak source. The results were well matched between theoretical calculation based on the leak-rate of the source and the experimental results within only 2% error.

CarbAl Heat Transfer Material

NASA Technical Reports Server (NTRS)

Fink, Richard

2015-01-01

The increasing use of power electronics, such as high-current semiconductor devices and modules, within space vehicles is driving the need to develop specialty thermal management materials in both the packaging of these discrete devices and the packaging of modules consisting of these device arrays. Developed by Applied Nanotech, Inc. (ANI), CarbAl heat transfer material is uniquely characterized by its low density, high thermal diffusivity, and high thermal conductivity. Its coefficient of thermal expansion (CTE) is similar to most power electronic materials, making it an effective base plate substrate for state-of-the-art silicon carbide (SiC) super junction transistors. The material currently is being used to optimize hybrid vehicle inverter packaging. Adapting CarbAl-based substrates to space applications was a major focus of the SBIR project work. In Phase I, ANI completed modeling and experimentation to validate its deployment in a space environment. Key parameters related to cryogenic temperature scaling of CTE, thermal conductivity, and mechanical strength. In Phase II, the company concentrated on improving heat sinks and thermally conductive circuit boards for power electronic applications.

Influence of some packaging materials and of natural tocopherols on the sensory properties of breakfast cereals.

PubMed

Paradiso, Vito M; Caponio, Francesco; Summo, Carmine; Gomes, Tommaso

2014-04-01

The combined effect of natural antioxidants and packaging materials on the quality decay of breakfast cereals during storage was evaluated. Corn flakes were produced on industrial scale, using different packages and adding natural tocopherols to the ingredients, and stored for 1 year. The samples were then submitted to sensory analysis and HS-solid phase microextraction/gas chromatography/mass spectrometry (SPME/GC/MS) analysis. The packaging had a significant influence on the sensory profile of the aged product: metallized polypropylene gave the highest levels of oxidation compounds and sensory defects. The sensory profile was improved using polypropylene and especially high-density polyethylene. Natural tocopherols reduced the sensory decay of the flakes and the oxidative evolution of the volatile profile. They gave the most remarkable improvement in polypropylene (either metallized or not) packs. Polypropylene showed a barrier effect on the scalping of volatiles outside of the pack. This led to higher levels of oxidation volatiles and faster rates of the further oxidative processes involving the volatiles.

Impact of nano-CaCO3 -LDPE packaging on quality of fresh-cut sugarcane.

PubMed

Luo, Zisheng; Wang, Yansheng; Wang, Haohui; Feng, Simin

2014-12-01

In order to evaluate the effects of nano-CaCO3 -based low density polyethylene (nano-CaCO3 -LDPE) packaging on the quality of fresh-cut sugarcane, concentrations of O2 and CO2 within the packages, overall visual quality (OVQ), total bacterial count (TBC), yeast and mould count (YMC), reducing sugar content and total phenolic content, respiration, ethylene production, and the activities of phenylalanine ammonia-lyase (PAL), polyphenol oxidase (PPO), peroxidase (POD), acid invertase (AI) and neutral invertase (NI) were examined during storage at 10 °C for 5 days. The transmission rate of O2 and CO2 of the nano-CaCO3 -LDPE material was lower than that of LDPE, which lead to the more rapid formation of gas environment with low O2 and high CO2 concentration in the package. TBC and YMC counts of fresh-cut sugarcane were significantly retarded by nano-CaCO3 -LDPE packaging. Nano-CaCO3 -LDPE packaging fresh-cut sugarcane exhibited significantly lower activities of PAL, PPO, POD AI and NI than LDPE packaging fresh-cut sugarcanes during the storage. Meanwhile, nano-CaCO3 -LDPE packaging significantly inhibited the increase of browning index and total phenolic content, while improving OVQ. Our results indicated that nano-CaCO3 -LDPE packaging together with the cold storage is a promising approach in inhibiting browning and maintaining quality of fresh-cut sugarcane. © 2014 Society of Chemical Industry.

Advanced Power Electronics Components

NASA Technical Reports Server (NTRS)

Schwarze, Gene E.

2004-01-01

This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

A new model for predicting moisture uptake by packaged solid pharmaceuticals.

PubMed

Chen, Y; Li, Y

2003-04-14

A novel mathematical model has been developed for predicting moisture uptake by packaged solid pharmaceutical products during storage. High density polyethylene (HDPE) bottles containing the tablet products of two new chemical entities and desiccants are investigated. Permeability of the bottles is determined at different temperatures using steady-state data. Moisture sorption isotherms of the two model drug products and desiccants at the same temperatures are determined and expressed in polynomial equations. The isotherms are used for modeling the time-humidity profile in the container, which enables the prediction of the moisture content of individual component during storage. Predicted moisture contents agree well with real time stability data. The current model could serve as a guide during packaging selection for moisture protection, so as to reduce the cost and cycle time of screening study.

Color design model of high color rendering index white-light LED module.

PubMed

Ying, Shang-Ping; Fu, Han-Kuei; Hsieh, Hsin-Hsin; Hsieh, Kun-Yang

2017-05-10

The traditional white-light light-emitting diode (LED) is packaged with a single chip and a single phosphor but has a poor color rendering index (CRI). The next-generation package comprises two chips and a single phosphor, has a high CRI, and retains high luminous efficacy. This study employs two chips and two phosphors to improve the diode's color tunability with various proportions of two phosphors and various densities of phosphor in the silicone used. A color design model is established for color fine-tuning of the white-light LED module. The maximum difference between the measured and color-design-model simulated CIE 1931 color coordinates is approximately 0.0063 around a correlated color temperature (CCT) of 2500 K. This study provides a rapid method to obtain the color fine-tuning of a white-light LED module with a high CRI and luminous efficacy.

Fabrication method to create high-aspect ratio pillars for photonic coupling of board level interconnects

NASA Astrophysics Data System (ADS)

Debaes, C.; Van Erps, J.; Karppinen, M.; Hiltunen, J.; Suyal, H.; Last, A.; Lee, M. G.; Karioja, P.; Taghizadeh, M.; Mohr, J.; Thienpont, H.; Glebov, A. L.

2008-04-01

An important challenge that remains to date in board level optical interconnects is the coupling between the optical waveguides on printed wiring boards and the packaged optoelectronics chips, which are preferably surface mountable on the boards. One possible solution is the use of Ball Grid Array (BGA) packages. This approach offers a reliable attachment despite the large CTE mismatch between the organic FR4 board and the semiconductor materials. Collimation via micro-lenses is here typically deployed to couple the light vertically from the waveguide substrate to the optoelectronics while allowing for a small misalignment between board and package. In this work, we explore the fabrication issues of an alternative approach in which the vertical photonic connection between board and package is governed by a micro-optical pillar which is attached both to the board substrate and to the optoelectronic chips. Such an approach allows for high density connections and small, high-speed detector footprints while maintaining an acceptable tolerance between board and package. The pillar should exhibit some flexibility and thus a high-aspect ratio is preferred. This work presents and compares different fabrication methods and applies different materials for such high-aspect ratio pillars. The different fabrication methods are: photolithography, direct laser writing and deep proton writing. The selection of optical materials that was investigated is: SU8, Ormocers, PU and a multifunctional acrylate polymer. The resulting optical pillars have diameters ranging from 20um up to 80um, with total heights ranging between 30um and 100um (symbol for micron). The aspect-ratio of the fabricated structures ranges from 1.5 to 5.

Sodium Reduction in US Households' Packaged Food and Beverage Purchases, 2000 to 2014.

PubMed

Poti, Jennifer M; Dunford, Elizabeth K; Popkin, Barry M

2017-07-01

Initiatives to reduce sodium in packaged foods have been launched in the United States, yet corresponding changes in the amount of sodium that US households obtain from packaged foods have not been evaluated, to our knowledge. To assess 15-year changes in the amount of sodium that US households acquire from packaged food purchases, the sodium content of purchases, and the proportion of households that have purchases with optimal sodium density. Longitudinal study of US households in the 2000 to 2014 Nielsen Homescan Consumer Panel, a population-based sample of households that used barcode scanners to record all packaged foods purchased throughout the year. Time-varying brand- and product-specific nutrition information was used for 1 490 141 products. Sociodemographic-adjusted changes in mean sodium per capita (mg/d) and sodium content (mg/100 g), overall and for top food group sources of sodium, and the proportion of households that have total purchases with sodium density of 1.1 mg/kcal or less. In a nationwide sample of 172 042 US households (754 608 year-level observations), the amount of sodium that households acquired from packaged food and beverage purchases decreased significantly between 2000 and 2014 by 396 mg/d (95% CI, -407 to -385 mg/d) per capita. The sodium content of households' packaged food purchases decreased significantly during this 15-year period by 49 mg/100 g (95% CI, -50 to -48 mg/100 g), a 12.0% decline; decreases began in 2005 and continued through 2014. Moreover, the sodium content of households' purchases decreased significantly for all top food sources of sodium between 2000 and 2014, including declines of more than 100 mg/100 g for condiments, sauces, and dips (-114 mg/100 g; 95% CI, -117 to -111 mg/100 g) and salty snacks (-142 mg/100 g; 95% CI, -144 to -141 mg/100 g). However, in all years, less than 2% of US households had packaged food and beverage purchases with sodium density of 1.1 mg/kcal or less. In this nationwide study, significant reductions in sodium from packaged food purchases were achieved in the past 15 years. Nonetheless, most US households had food and beverage purchases with excessive sodium density. Findings suggest that more concerted sodium reduction efforts are needed in the United States.

Department of Defense Advisory Group on Electron Devices. Special Technology Area Review on Microwave Packaging Technology. Appendix

DTIC Science & Technology

1993-02-01

sintered in hydrogen furnace at very high temperatures . Multiple furnace firing occurs until the binders are removed and part density is achieved "* Process...and base Low temperature co-fired ceramic - Metallized for shielding and grounding - Low resistance thick-film metallization - High thermal resistance...ESPECIALLY LOW TEMPERATURE COFIRED CERAMIC CERAMICS HIGH THERMAL CONDUCTIVITY,MATCHED GaAS AND SILICON SUBSTRATE MATERIALS I I,1Z#A,17Mr1 J, TI

Retail lighting and packaging influence consumer acceptance of fluid milk.

PubMed

Potts, H L; Amin, K N; Duncan, S E

2017-01-01

Little is known about the effect of retail light-emitting diode (LED) exposure on consumer acceptance of milk. The study objective was to determine effects of fluorescent and LED lighting under retail storage conditions on consumer acceptance of milk. Consumer acceptance of milk stored under retail conditions was determined through sensory evaluation (2 studies; n=150+ each) and analytical measures (dissolved oxygen, secondary oxidation products, riboflavin retention). Study 1 evaluated milk stored in high-density polyethylene (HDPE) packages for 4h under LED light (960 lx). Commercially available HDPE package treatments included translucent HDPE (most commonly used), white HDPE [low concentration (1.3%) TiO 2 ], and yellow HDPE; in addition, HDPE with a higher TiO 2 concentration (high white; 4.9% TiO 2 ) and a foil-wrapped translucent HDPE (control) were tested. Translucent and control packages also were tested under fluorescent light. Study 2 evaluated polyethylene terephthalate (PET) packages for 4h under fluorescent and LED light (1,460 lx). The PET packaging included 2 treatments (medium, 4.0% TiO 2 ; high, 6.6% TiO 2 ) as well as translucent HDPE (exposed to fluorescent), clear PET (fluorescent and LED), and light-protected control. Overall mean acceptability of milk ranged from "like slightly" to "like moderately" with significantly lower acceptability for milk exposed to fluorescent light. Milk in HDPE and PET packages had comparable overall acceptability scores when exposed to LED light. Only the fluorescent light condition (both PET and HDPE) diminished overall acceptability. Fluorescent light exposure negatively influenced flavor with significant penalty (2.0-2.5 integers) to overall acceptability of milk in translucent HDPE and clear PET. The LED also diminished aftertaste of milk packaged in translucent HDPE. Changes in dissolved oxygen content, as an indication of oxidation, supported the observed differences in consumer acceptance of milk stored under fluorescent and LED light. Consumers like the flavor of fresh milk, which can be protected by selecting appropriate packaging that blocks detrimental light wavelengths. Copyright © 2017 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

Dynamics of bacteriophage genome ejection in vitro and in vivo

NASA Astrophysics Data System (ADS)

Panja, Debabrata; Molineux, Ian J.

2010-12-01

Bacteriophages, phages for short, are viruses of bacteria. The majority of phages contain a double-stranded DNA genome packaged in a capsid at a density of ~500 mg ml-1. This high density requires substantial compression of the normal B-form helix, leading to the conjecture that DNA in mature phage virions is under significant pressure, and that pressure is used to eject the DNA during infection. A large number of theoretical, computer simulation and in vitro experimental studies surrounding this conjecture have revealed many—though often isolated and/or contradictory—aspects of packaged DNA. This prompts us to present a unified view of the statistical physics and thermodynamics of DNA packaged in phage capsids. We argue that the DNA in a mature phage is in a (meta)stable state, wherein electrostatic self-repulsion is balanced by curvature stress due to confinement in the capsid. We show that in addition to the osmotic pressure associated with the packaged DNA and its counterions, there are four different pressures within the capsid: pressure on the DNA, hydrostatic pressure, the pressure experienced by the capsid and the pressure associated with the chemical potential of DNA ejection. Significantly, we analyze the mechanism of force transmission in the packaged DNA and demonstrate that the pressure on DNA is not important for ejection. We derive equations showing a strong hydrostatic pressure difference across the capsid shell. We propose that when a phage is triggered to eject by interaction with its receptor in vitro, the (thermodynamic) incentive of water molecules to enter the phage capsid flushes the DNA out of the capsid. In vivo, the difference between the osmotic pressures in the bacterial cell cytoplasm and the culture medium similarly results in a water flow that drags the DNA out of the capsid and into the bacterial cell.

Motor/Generator and Inverter Characterization for Flywheel System Applications

NASA Technical Reports Server (NTRS)

Tamarcus, Jeffries L.

2004-01-01

The Advanced Electrical Systems Development Branch at NASA Glenn Research Center (GRC) has been involved in the research and development of high speed flywheels systems for satellite energy storage and attitude applications. These flywheels will serve as replacement for chemical nickel hydrogen, nickel cadmium batteries and gyroscopic wheels. The advantages of using flywheel systems for energy storage on satellites are high energy density, high power density, long life, deep depth of discharge, and broad operating temperature ranges. A flywheel system for space applications consist of a number of flywheel modules, the motor/generator and magnetic bearing, and an electronics package. The motor/generator electronics package includes a pulse-width modulated inverter that drives the flywheel permanent magnet motor/generator located at one end of the shaft. This summer, I worked under the direct supervision of my mentor, Walter Santiago, and the goal for this summer was to characterize motor generator and inverter attributes in order to increase their viability as a more efficient energy storage source for space applications. To achieve this goal, magnetic field measurements around the motor/generator permanent magnet and the impedance of the motor/generator three phase windings were characterized, and a recreation of the inverter pulse width modulated control system was constructed. The Flywheel modules for space use are designed to maximize energy density and minimize loss, and attaining these values will aid in locating and reducing losses within the flywheel system as a whole, making flywheel technology more attractive for use as energy storage in future space applications.

Polymorphism of DNA conformation inside the bacteriophage capsid.

PubMed

Leforestier, Amélie

2013-03-01

Double-stranded DNA bacteriophage genomes are packaged into their icosahedral capsids at the highest densities known so far (about 50 % w:v). How the molecule is folded at such density and how its conformation changes upon ejection or packaging are fascinating questions still largely open. We review cryo-TEM analyses of DNA conformation inside partially filled capsids as a function of the physico-chemical environment (ions, osmotic pressure, temperature). We show that there exists a wide variety of DNA conformations. Strikingly, the different observed structures can be described by some of the different models proposed over the years for DNA organisation inside bacteriophage capsids: either spool-like structures with axial or concentric symmetries, or liquid crystalline structures characterised by a DNA homogeneous density. The relevance of these conformations for the understanding of DNA folding and unfolding upon ejection and packaging in vivo is discussed.

Potential migration of buoyant LNAPL from intermediate level waste (ILW) emplaced in a geological disposal facility (GDF) for U.K. radioactive waste.

PubMed

Benbow, Steven J; Rivett, Michael O; Chittenden, Neil; Herbert, Alan W; Watson, Sarah; Williams, Steve J; Norris, Simon

2014-10-15

A safety case for the disposal of Intermediate Level (radioactive) Waste (ILW) in a deep geological disposal facility (GDF) requires consideration of the potential for waste-derived light non-aqueous phase liquid (LNAPL) to migrate under positive buoyancy from disposed waste packages. Were entrainment of waste-derived radionuclides in LNAPL to occur, such migration could result in a shorter overall travel time to environmental or human receptors than radionuclide migration solely associated with the movement of groundwater. This paper provides a contribution to the assessment of this issue through multiphase-flow numerical modelling underpinned by a review of the UK's ILW inventory and literature to define the nature of the associated ILW LNAPL source term. Examination has been at the waste package-local GDF environment scale to determine whether proposed disposal of ILW would lead to significant likelihood of LNAPL migration, both from waste packages and from a GDF vault into the local host rock. Our review and numerical modelling support the proposition that the release of a discrete free phase LNAPL from ILW would not present a significant challenge to the safety case even with conservative approximations. 'As-disposed' LNAPL emplaced with the waste is not expected to pose a significant issue. 'Secondary LNAPL' generated in situ within the disposed ILW, arising from the decomposition of plastics, in particular PVC (polyvinyl chloride), could form the predominant LNAPL source term. Released high molecular weight phthalate plasticizers are judged to be the primary LNAPL potentially generated. These are expected to have low buoyancy-based mobility due to their very low density contrast with water and high viscosity. Due to the inherent uncertainties, significant conservatisms were adopted within the numerical modelling approach, including: the simulation of a deliberately high organic material--PVC content wastestream (2D03) within an annular grouted waste package vulnerable to LNAPL release; upper bound inventory estimates of LNAPLs; incorporating the lack of any hydraulic resistance of the package vent; the lack of any degradation of dissolved LNAPL; and, significantly, the small threshold displacement pressure assumed at which LNAPL is able to enter initially water-saturated pores. Initial scoping calculations on the latter suggested that the rate at which LNAPL is able to migrate from a waste package is likely to be very small and insignificant for likely representative displacement pressure data: this represents a key result. Adopting a conservative displacement pressure, however, allowed the effect of other features and processes in the system to be assessed. High LNAPL viscosity together with low density contrast with water reduces LNAPL migration potential. Migration to the host rock is less likely if waste package vent fluxes are small, solubility limits are high and path lengths through the backfill are short. The capacity of the system to dissolve all of the free LNAPL will, however, depend on groundwater availability. Even with the conservatisms invoked, the overall conclusion of model simulations of intact and compromised (cracked or corroded) waste packages, for a range of realistic ILW LNAPL scenarios, is that it is unlikely that significant LNAPL would be able to migrate from the waste packages and even more unlikely it would be sufficiently persistent to reach the host rock immediately beyond the GDF. Copyright © 2014. Published by Elsevier B.V.

States of phage T3/T7 capsids: buoyant density centrifugation and cryo-EM.

PubMed

Serwer, Philip; Wright, Elena T; Demeler, Borries; Jiang, Wen

2018-04-01

Mature double-stranded DNA bacteriophages have capsids with symmetrical shells that typically resist disruption, as they must to survive in the wild. However, flexibility and associated dynamism assist function. We describe biochemistry-oriented procedures used to find previously obscure flexibility for capsids of the related phages, T3 and T7. The primary procedures are hydration-based buoyant density ultracentrifugation and purified particle-based cryo-electron microscopy (cryo-EM). We review the buoyant density centrifugation in detail. The mature, stable T3/T7 capsid is a shell flexibility-derived conversion product of an initially assembled procapsid (capsid I). During DNA packaging, capsid I expands and loses a scaffolding protein to form capsid II. The following are observations made with capsid II. (1) The in vivo DNA packaging of wild type T3 generates capsid II that has a slight (1.4%), cryo-EM-detected hyper-expansion relative to the mature phage capsid. (2) DNA packaging in some altered conditions generates more extensive hyper-expansion of capsid II, initially detected by hydration-based preparative buoyant density centrifugation in Nycodenz density gradients. (3) Capsid contraction sometimes occurs, e.g., during quantized leakage of DNA from mature T3 capsids without a tail.

DeePMD-kit: A deep learning package for many-body potential energy representation and molecular dynamics

NASA Astrophysics Data System (ADS)

Wang, Han; Zhang, Linfeng; Han, Jiequn; E, Weinan

2018-07-01

Recent developments in many-body potential energy representation via deep learning have brought new hopes to addressing the accuracy-versus-efficiency dilemma in molecular simulations. Here we describe DeePMD-kit, a package written in Python/C++ that has been designed to minimize the effort required to build deep learning based representation of potential energy and force field and to perform molecular dynamics. Potential applications of DeePMD-kit span from finite molecules to extended systems and from metallic systems to chemically bonded systems. DeePMD-kit is interfaced with TensorFlow, one of the most popular deep learning frameworks, making the training process highly automatic and efficient. On the other end, DeePMD-kit is interfaced with high-performance classical molecular dynamics and quantum (path-integral) molecular dynamics packages, i.e., LAMMPS and the i-PI, respectively. Thus, upon training, the potential energy and force field models can be used to perform efficient molecular simulations for different purposes. As an example of the many potential applications of the package, we use DeePMD-kit to learn the interatomic potential energy and forces of a water model using data obtained from density functional theory. We demonstrate that the resulted molecular dynamics model reproduces accurately the structural information contained in the original model.

A digital miniature x-ray tube with a high-density triode carbon nanotube field emitter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jeong, Jin-Woo; Kang, Jun-Tae; Choi, Sungyoul

2013-01-14

We have fabricated a digital miniature x-ray tube (6 mm in diameter and 32 mm in length) with a high-density triode carbon nanotube (CNT) field emitter for special x-ray applications. The triode CNT emitter was densely formed within a diameter of below 4 mm with the focusing-functional gate. The brazing process enables us to obtain and maintain a desired vacuum level for the reliable electron emission from the CNT emitters after the vacuum packaging. The miniature x-ray tube exhibited a stable and reliable operation over 250 h in a pulse mode at an anode voltage of above 25 kV.

Multiphysical simulation analysis of the dislocation structure in germanium single crystals

NASA Astrophysics Data System (ADS)

Podkopaev, O. I.; Artemyev, V. V.; Smirnov, A. D.; Mamedov, V. M.; Sid'ko, A. P.; Kalaev, V. V.; Kravtsova, E. D.; Shimanskii, A. F.

2016-09-01

To grow high-quality germanium crystals is one of the most important problems of growth industry. The dislocation density is an important parameter of the quality of single crystals. The dislocation densities in germanium crystals 100 mm in diameter, which have various shapes of the side surface and are grown by the Czochralski technique, are experimentally measured. The crystal growth is numerically simulated using heat-transfer and hydrodynamics models and the Alexander-Haasen dislocation model in terms of the CGSim software package. A comparison of the experimental and calculated dislocation densities shows that the dislocation model can be applied to study lattice defects in germanium crystals and to improve their quality.

Cost-Effectiveness of Rural Incentive Packages for Graduating Medical Students in Lao PDR

PubMed Central

Keuffel, Eric; Jaskiewicz, Wanda; Theppanya, Khampasong; Tulenko, Kate

2017-01-01

Background: The dearth of health workers in rural settings in Lao People’s Democratic Republic (PDR) and other developing countries limits healthcare access and outcomes. In evaluating non-wage financial incentive packages as a potential policy option to attract health workers to rural settings, understanding the expected costs and effects of the various programs ex ante can assist policy-makers in selecting the optimal incentive package. Methods: We use discrete choice experiments (DCEs), costing analyses and recent empirical results linking health worker density and health outcomes to estimate the future location decisions of physicians and determine the cost-effectiveness of 15 voluntary incentives packages for new physicians in Lao PDR. Our data sources include a DCE survey completed by medical students (n = 329) in May 2011 and secondary cost, economic and health data. Mixed logit regressions provide the basis for estimating how each incentive package influences rural versus urban location choice over time. We estimate the expected rural density of physicians and the cost-effectiveness of 15 separate incentive packages from a societal perspective. In order to generate the cost-effectiveness ratios we relied on the rural uptake probabilities inferred from the DCEs, the costing data and prior World Health Organization (WHO) estimates that relate health outcomes to health worker density. Results: Relative to no program, the optimal voluntary incentive package would increase rural physician density by 15% by 2016 and 65% by 2041. After incorporating anticipated health effects, seven (three) of the 15 incentive packages have anticipated average cost-effectiveness ratio less than the WHO threshold (three times gross domestic product [GDP] per capita) over a 5-year (30 year) period. The optimal package’s incremental cost-effectiveness ratio is $1454/QALY (quality-adjusted life year) over 5 years and $2380/QALY over 30 years. Capital intensive components, such as housing or facility improvement, are not efficient. Conclusion: Conditional on using voluntary incentives, Lao PDR should emphasize non-capital intensive options such as advanced career promotion, transport subsidies and housing allowances to improve physician distribution and rural health outcomes in a cost-effective manner. Other countries considering voluntary incentive programs can implement health worker/trainee DCEs and costing surveys to determine which incentive bundles improve rural uptake most efficiently but should be aware of methodological caveats. PMID:28812834

polymapR - linkage analysis and genetic map construction from F1 populations of outcrossing polyploids.

PubMed

Bourke, Peter M; van Geest, Geert; Voorrips, Roeland E; Jansen, Johannes; Kranenburg, Twan; Shahin, Arwa; Visser, Richard G F; Arens, Paul; Smulders, Marinus J M; Maliepaard, Chris

2018-05-02

Polyploid species carry more than two copies of each chromosome, a condition found in many of the world's most important crops. Genetic mapping in polyploids is more complex than in diploid species, resulting in a lack of available software tools. These are needed if we are to realise all the opportunities offered by modern genotyping platforms for genetic research and breeding in polyploid crops. polymapR is an R package for genetic linkage analysis and integrated genetic map construction from bi-parental populations of outcrossing autopolyploids. It can currently analyse triploid, tetraploid and hexaploid marker datasets and is applicable to various crops including potato, leek, alfalfa, blueberry, chrysanthemum, sweet potato or kiwifruit. It can detect, estimate and correct for preferential chromosome pairing, and has been tested on high-density marker datasets from potato, rose and chrysanthemum, generating high-density integrated linkage maps in all of these crops. polymapR is freely available under the general public license from the Comprehensive R Archive Network (CRAN) at http://cran.r-project.org/package=polymapR. Chris Maliepaard chris.maliepaard@wur.nl or Roeland E. Voorrips roeland.voorrips@wur.nl. Supplementary data are available at Bioinformatics online.

Rocket-borne thermal plasma instrument "MIPEX" for the ionosphere D, E layer in-situ measurements

NASA Astrophysics Data System (ADS)

Fang, H. K.; Chen, A. B. C.; Lin, C. C. H.; Wu, T. J.; Liu, K. S.; Chuang, C. W.

2017-12-01

In this presentation, the design concepts, performances and status of a thermal plasma particle instrument package "Mesosphere and Ionosphere Plasma Exploration complex (MIPEX)", which is going to be installed onboard a NSPO-funded hybrid rocket, to investigate the electrodynamic processes in ionosphere D, E layers above Taiwan are reported. MIPEX is capable of measuring plasma characteristics including ion temperature, ion composition, ion drift, electron temperature and plasma density at densities as low as 1-10 cm-1. This instrument package consists of an improved retarding potential analyzer with a channel electron multiplier (CEM), a simplified ion drift meter and a planar Langmuir probe. To achieve the working atmospheric pressure of CEM at the height of lower D layer ( 70km), a portable vacuum pump is also placed in the package. A prototype set of the MIPEX has been developed and tested in the Space Plasma Operation Chamber (SPOC) at NCKU, where in ionospheric plasma is generated by back-diffusion plasma sources. A plasma density of 10-106 cm-1, ion temperature of 300-1500 K and electron temperature of 1000-3000K is measured and verified. Limited by the flight platform and the performance of the instruments, the in-situ plasma measurements at the Mesosphere and lower Thermosphere is very challenging and rare. MIPEX is capable of extending the altitude of the effective plasma measurement down to 70 km height and this experiment can provide unique high-quality data of the plasma environment to explore the ion distribution and the electrodynamic processes in the Ionosphere D, E layers at dusk.

Plato: A localised orbital based density functional theory code

NASA Astrophysics Data System (ADS)

Kenny, S. D.; Horsfield, A. P.

2009-12-01

The Plato package allows both orthogonal and non-orthogonal tight-binding as well as density functional theory (DFT) calculations to be performed within a single framework. The package also provides extensive tools for analysing the results of simulations as well as a number of tools for creating input files. The code is based upon the ideas first discussed in Sankey and Niklewski (1989) [1] with extensions to allow high-quality DFT calculations to be performed. DFT calculations can utilise either the local density approximation or the generalised gradient approximation. Basis sets from minimal basis through to ones containing multiple radial functions per angular momenta and polarisation functions can be used. Illustrations of how the package has been employed are given along with instructions for its utilisation. Program summaryProgram title: Plato Catalogue identifier: AEFC_v1_0 Program summary URL:http://cpc.cs.qub.ac.uk/summaries/AEFC_v1_0.html Program obtainable from: CPC Program Library, Queen's University, Belfast, N. Ireland Licensing provisions: Standard CPC licence, http://cpc.cs.qub.ac.uk/licence/licence.html No. of lines in distributed program, including test data, etc.: 219 974 No. of bytes in distributed program, including test data, etc.: 1 821 493 Distribution format: tar.gz Programming language: C/MPI and PERL Computer: Apple Macintosh, PC, Unix machines Operating system: Unix, Linux and Mac OS X Has the code been vectorised or parallelised?: Yes, up to 256 processors tested RAM: Up to 2 Gbytes per processor Classification: 7.3 External routines: LAPACK, BLAS and optionally ScaLAPACK, BLACS, PBLAS, FFTW Nature of problem: Density functional theory study of electronic structure and total energies of molecules, crystals and surfaces. Solution method: Localised orbital based density functional theory. Restrictions: Tight-binding and density functional theory only, no exact exchange. Unusual features: Both atom centred and uniform meshes available. Can deal with arbitrary angular momenta for orbitals, whilst still retaining Slater-Koster tables for accuracy. Running time: Test cases will run in a few minutes, large calculations may run for several days.

Cost-Effectiveness of Rural Incentive Packages for Graduating Medical Students in Lao PDR.

PubMed

Keuffell, Eric; Jaskiewicz, Wanda; Theppanya, Khampasong; Tulenko, Kate

2016-10-29

The dearth of health workers in rural settings in Lao People's Democratic Republic (PDR) and other developing countries limits healthcare access and outcomes. In evaluating non-wage financial incentive packages as a potential policy option to attract health workers to rural settings, understanding the expected costs and effects of the various programs ex ante can assist policy-makers in selecting the optimal incentive package. We use discrete choice experiments (DCEs), costing analyses and recent empirical results linking health worker density and health outcomes to estimate the future location decisions of physicians and determine the cost-effectiveness of 15 voluntary incentives packages for new physicians in Lao PDR. Our data sources include a DCE survey completed by medical students (n = 329) in May 2011 and secondary cost, economic and health data. Mixed logit regressions provide the basis for estimating how each incentive package influences rural versus urban location choice over time. We estimate the expected rural density of physicians and the cost-effectiveness of 15 separate incentive packages from a societal perspective. In order to generate the cost-effectiveness ratios we relied on the rural uptake probabilities inferred from the DCEs, the costing data and prior World Health Organization (WHO) estimates that relate health outcomes to health worker density. Relative to no program, the optimal voluntary incentive package would increase rural physician density by 15% by 2016 and 65% by 2041. After incorporating anticipated health effects, seven (three) of the 15 incentive packages have anticipated average cost-effectiveness ratio less than the WHO threshold (three times gross domestic product [GDP] per capita) over a 5-year (30 year) period. The optimal package's incremental cost-effectiveness ratio is $1454/QALY (quality-adjusted life year) over 5 years and $2380/QALY over 30 years. Capital intensive components, such as housing or facility improvement, are not efficient. Conditional on using voluntary incentives, Lao PDR should emphasize non-capital intensive options such as advanced career promotion, transport subsidies and housing allowances to improve physician distribution and rural health outcomes in a cost-effective manner. Other countries considering voluntary incentive programs can implement health worker/trainee DCEs and costing surveys to determine which incentive bundles improve rural uptake most efficiently but should be aware of methodological caveats. © 2017 The Author(s); Published by Kerman University of Medical Sciences. This is an open-access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Examination of SR101 shipping packages

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

Four SR101 shipping packages were removed from service and provided for disassembly and examination of the internal fiberboard assemblies. These packages were 20 years old, and had experienced varying levels of degradation. Two of the packages were successfully disassembled and fiberboard samples were removed from these packages and tested. Mechanical and thermal property values are generally comparable to or higher than baseline values measured on fiberboard from 9975 packages, which differs primarily in the specified density range. While baseline data for the SR101 material is not available, this comparison with 9975 material suggests that the material properties of the SR101more » fiberboard have not significantly degraded.« less

High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology

NASA Astrophysics Data System (ADS)

Wang, Boxue; Jia, Yangtao; Zhang, Haoyu; Jia, Shiyin; Liu, Jindou; Wang, Weifeng; Liu, Xingsheng

2018-02-01

An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report.

Rapid discrimination of plastic packaging materials using MIR spectroscopy coupled with independent components analysis (ICA)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kassouf, Amine, E-mail: amine.kassouf@agroparistech.fr; INRA, UMR1145 Ingénierie Procédés Aliments, 1 Avenue des Olympiades, 91300 Massy; AgroParisTech, UMR1145 Ingénierie Procédés Aliments, 16 rue Claude Bernard, 75005 Paris

2014-11-15

Highlights: • An innovative technique, MIR-ICA, was applied to plastic packaging separation. • This study was carried out on PE, PP, PS, PET and PLA plastic packaging materials. • ICA was applied to discriminate plastics and 100% separation rates were obtained. • Analyses performed on two spectrometers proved the reproducibility of the method. • MIR-ICA is a simple and fast technique allowing plastic identification/classification. - Abstract: Plastic packaging wastes increased considerably in recent decades, raising a major and serious public concern on political, economical and environmental levels. Dealing with this kind of problems is generally done by landfilling and energymore » recovery. However, these two methods are becoming more and more expensive, hazardous to the public health and the environment. Therefore, recycling is gaining worldwide consideration as a solution to decrease the growing volume of plastic packaging wastes and simultaneously reduce the consumption of oil required to produce virgin resin. Nevertheless, a major shortage is encountered in recycling which is related to the sorting of plastic wastes. In this paper, a feasibility study was performed in order to test the potential of an innovative approach combining mid infrared (MIR) spectroscopy with independent components analysis (ICA), as a simple and fast approach which could achieve high separation rates. This approach (MIR-ICA) gave 100% discrimination rates in the separation of all studied plastics: polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polystyrene (PS) and polylactide (PLA). In addition, some more specific discriminations were obtained separating plastic materials belonging to the same polymer family e.g. high density polyethylene (HDPE) from low density polyethylene (LDPE). High discrimination rates were obtained despite the heterogeneity among samples especially differences in colors, thicknesses and surface textures. The reproducibility of the proposed approach was also tested using two spectrometers with considerable differences in their sensitivities. Discrimination rates were not affected proving that the developed approach could be extrapolated to different spectrometers. MIR combined with ICA is a promising tool for plastic waste separation that can help improve performance in this field; however further technological improvements and developments are required before it can be applied at an industrial level given that all tests presented here were performed under laboratory conditions.« less

Thermal control of high energy nuclear waste, space option. [mathematical models

NASA Technical Reports Server (NTRS)

Peoples, J. A.

1979-01-01

Problems related to the temperature and packaging of nuclear waste material for disposal in space are explored. An approach is suggested for solving both problems with emphasis on high energy density waste material. A passive cooling concept is presented which utilized conduction rods that penetrate the inner core. Data are presented to illustrate the effectiveness of the rods and the limit of their capability. A computerized thermal model is discussed and developed for the cooling concept.

Recycling potential of post-consumer plastic packaging waste in Finland.

PubMed

Dahlbo, Helena; Poliakova, Valeria; Mylläri, Ville; Sahimaa, Olli; Anderson, Reetta

2018-01-01

Recycling of plastics is urged by the need for closing material loops to maintain our natural resources when striving towards circular economy, but also by the concern raced by observations of plastic scrap in oceans and lakes. Packaging industry is the sector using the largest share of plastics, hence packaging dominates in the plastic waste flow. The aim of this paper was to sum up the recycling potential of post-consumer plastic packaging waste in Finland. This potential was evaluated based on the quantity, composition and mechanical quality of the plastic packaging waste generated by consumers and collected as a source-separated fraction, within the mixed municipal solid waste (MSW) or within energy waste. Based on the assessment 86,000-117,000 tons (18 kg/person/a) of post-consumer plastic packaging waste was generated in Finland in 2014. The majority, 84% of the waste was in the mixed MSW flow in 2014. Due to the launching of new sorting facilities and separate collections for post-consumer plastic packaging in 2016, almost 40% of the post-consumer plastic packaging could become available for recycling. However, a 50% recycling rate for post-consumer plastic packaging (other than PET bottles) would be needed to increase the overall MSW recycling rate from the current 41% by around two percentage points. The share of monotype plastics in the overall MSW plastics fraction was 80%, hence by volume the recycling potential of MSW plastics is high. Polypropylene (PP) and low density polyethylene (LDPE) were the most common plastic types present in mixed MSW, followed by polyethylene terephthalate (PET), polystyrene (PS) and high density polyethylene (HDPE). If all the Finnish plastic packaging waste collected through the three collection types would be available for recycling, then 19,000-25,000 tons of recycled PP and 6000-8000 tons of recycled HDPE would be available on the local market. However, this assessment includes uncertainties due to performing the composition study only on mixed MSW plastic fraction. In order to obtain more precise figures of the recycling potential of post-consumer plastic packaging, more studies should be performed on both the quantities and the qualities of plastic wastes. The mechanical and rheological test results indicated that even plastic wastes originating from the mixed MSW, can be useful raw materials. Recycled HDPE showed a smaller decline in the mechanical properties than recycled PP. The origin and processing method of waste plastic seemed to have less effect on the mechanical quality than the type of plastic. The applicability of a plastic waste for a product needs to be assessed case by case, due to product specific quality requirements. In addition to mechanical properties, the chemical composition of plastic wastes is of major importance, in order to be able to restrict hazardous substances from being circulated undesirably. In addition to quantity and quality of plastic wastes, the sustainability of the whole recycling chain needs to be assessed prior to launching operations so that the chain can be optimized to generate both environmental and economic benefits to society and operators. Copyright © 2017 Elsevier Ltd. All rights reserved.

Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2013-01-01

Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.

A longitudinal analysis of alcohol outlet density and domestic violence.

PubMed

Livingston, Michael

2011-05-01

A small number of studies have identified a positive relationship between alcohol outlet density and domestic violence. These studies have all been based on cross-sectional data and have been limited to the assessment of ecological correlations between outlet density and domestic violence rates. This study provides the first longitudinal examination of this relationship. Cross-sectional time-series using aggregated data from small areas. The relationships between alcohol outlet density and domestic violence were assessed over time using a fixed-effects model. Controls for the spatial autocorrelation of the data were included in the model. The study uses data for 186 postcodes from within the metropolitan area of Melbourne, Australia for the years 1996 to 2005. Alcohol outlet density measures for three different types of outlets (hotel/pub, packaged liquor, on-premise) were derived from liquor licensing records and domestic violence rates were calculated from police-recorded crime data, based on the victim's postcode. Alcohol outlet density was associated significantly with rates of domestic violence, over time. All three licence categories were positively associated with domestic violence rates, with small effects for general (pub) and on-premise licences and a large effect for packaged liquor licences. In Melbourne, the density of liquor licences is positively associated with rates of domestic violence over time. The effects were particularly large for packaged liquor outlets, suggesting a need for licensing policies that pay more attention to o off-premise alcohol availability. © 2011 The Authors, Addiction © 2011 Society for the Study of Addiction.

High-Temperature, Wirebondless, Ultracompact Wide Bandgap Power Semiconductor Modules

NASA Technical Reports Server (NTRS)

Elmes, John

2015-01-01

Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.

An ab-initio study of mechanical, dynamical and electronic properties of MgEu intermetallic

NASA Astrophysics Data System (ADS)

Kumar, S. Ramesh; Jaiganesh, G.; Jayalakshmi, V.

2018-04-01

The theoretical investigation on the mechanical, dynamical and electronic properties of MgEu in CsCl-type structure has been carried out through the ab-initio calculations within the framework of the density functional theory and the density functional perturbation theory. For the purpose, Vienna Ab initio Simulation Package and Phonopy packages were used. Our calculated ground-state properties of MgEu are in good agreement with other available results. Our computed elastic constants and phonon spectrum results suggest that MgEu is mechanically and dynamically stable up to 5 GPa. The thermodynamic quantities as a function of temperatures are also reported and discussed. The band structure, density of states and charge density also calculated to understand the electronic properties of MgEu.

Packaging and Mounting of In-Fibre Bragg Grating Arrays for Structural Health Monitoring of Large Structures

DTIC Science & Technology

2010-10-01

33 Abbreviations CFRP Carbon Fibre Reinforced Polymer FBG Fibre Bragg Grating FGI Fiberglass International FO... Fibre Optic FOS Fibre Optic Sensor GFRP Glass Fibre Reinforced Polymer HDPE High Density Polyethylene LED Light Emitting Diode MHC Mine Hunter...subsequent paragraphs. An operational loads monitoring system for wind turbine blades was demonstrated [7] using FBGs surface-mounted onto glass fibre

Cluster-lensing: A Python Package for Galaxy Clusters and Miscentering

NASA Astrophysics Data System (ADS)

Ford, Jes; VanderPlas, Jake

2016-12-01

We describe a new open source package for calculating properties of galaxy clusters, including Navarro, Frenk, and White halo profiles with and without the effects of cluster miscentering. This pure-Python package, cluster-lensing, provides well-documented and easy-to-use classes and functions for calculating cluster scaling relations, including mass-richness and mass-concentration relations from the literature, as well as the surface mass density {{Σ }}(R) and differential surface mass density {{Δ }}{{Σ }}(R) profiles, probed by weak lensing magnification and shear. Galaxy cluster miscentering is especially a concern for stacked weak lensing shear studies of galaxy clusters, where offsets between the assumed and the true underlying matter distribution can lead to a significant bias in the mass estimates if not accounted for. This software has been developed and released in a public GitHub repository, and is licensed under the permissive MIT license. The cluster-lensing package is archived on Zenodo. Full documentation, source code, and installation instructions are available at http://jesford.github.io/cluster-lensing/.

Manufacturing Methods and Technology Engineering (MM&TE) Program for the Establishment of Production Techniques for High Density Thick Film Circuits Used in Crystal Oscillators. Volume I.

DTIC Science & Technology

1980-04-01

incorporate the high reliability ceramic-packaged quartz crystal resonator developed at ERADCOM, and utilize beam -leaded devices wherever possible...the form of a truncated cylinder. The rather complex module outline is best accomplished through the use of a precast potting shell filled with a low...crossover connections are achieved by means of thick-film dielectric material. Chip components attached to the metallized substrate complete the circuits

Floating macro-litter along the Mediterranean French coast: Composition, density, distribution and overlap with cetacean range.

PubMed

Di-Méglio, Nathalie; Campana, Ilaria

2017-05-15

This study investigated the composition, density and distribution of floating macro-litter along the Liguro-Provençal basin with respect to cetaceans presence. Survey transects were performed in summer between 2006 and 2015 from sailing vessels with simultaneous cetaceans observations. During 5171km travelled, 1993 floating items were recorded, widespread in the whole study area. Plastics was the predominant category, with bags/packaging always representing >45% of total items. Overall mean density (14.98 items/km 2 ) was stable with significant increase reported only in 2010-2011; monthly analysis showed lower litter densities in July-September, suggesting possible seasonal patterns. Kernel density estimation for plastics revealed ubiquitous distribution rather than high accumulation areas, mainly due to the circulation dynamics of this area. The presence range of cetaceans (259 sightings, 6 species) corresponded by ~50% with plastic distribution, indicating high potential of interaction, especially in the eastern part of the area, but effective risks for marine species might be underrepresented. Copyright © 2017 Elsevier Ltd. All rights reserved.

Optimal segmentation and packaging process

DOEpatents

Kostelnik, Kevin M.; Meservey, Richard H.; Landon, Mark D.

1999-01-01

A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D&D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded.

Modeling ICF With RAGE, BHR, And The New Laser Package

NASA Astrophysics Data System (ADS)

Cliche, Dylan; Welser-Sherrill, Leslie; Haines, Brian; Mancini, Roberto

2017-10-01

Inertial Confinement Fusion (ICF) is one method used to obtain thermonuclear burn through the either direct or indirect ablation of a millimeter-scale capsule with several lasers. Although progress has been made in theory, experiment, and diagnostics, the community has yet to reach ignition. A way of investigating this is through the use of high performance computer simulations of the implosion. RAGE is an advanced 1D, 2D, and 3D radiation adaptive grid Eulerian code used to simulate hydrodynamics of a system. Due to the unstable nature of two unequal densities accelerating into one another, it is important to include a turbulence model. BHR is a turbulence model which uses Reynolds-averaged Navier-Stokes (RANS) equations to model the mixing that occurs between the shell and fusion fuel material. Until recently, it was still difficult to model direct drive experiments because there was no laser energy deposition model in RAGE. Recently, a new laser energy deposition model has been implemented using the same ray tracing method as the Mazinisin laser package used at the OMEGA laser facility at the Laboratory for Laser Energetics (LLE) in Rochester, New York. Using the new laser package along with BHR for mixing allows us to more accurately simulate ICF implosions and obtain spatially and temporally resolved information (e.g. position, temperature, density, and mix concentrations) to give insight into what is happening inside the implosion.

Advanced nickel-hydrogen cell configuration study

NASA Technical Reports Server (NTRS)

1983-01-01

Long-term trends in the evolution of space power technology point toward increased payload power demand which in turn translates into both higher battery system charge storage capability and higher operating voltages. State of the art nickel-hydrogen cells of the 50 to 60 Wh size, packaged in individual pressure vessels, are capable of meeting the required cycle life for a wide range of anticipated operating conditions; however, they provided several drawbacks to battery system integrated efforts. Because of size, high voltage/high power systems require integrating hundreds of cells into the operating system. Packaging related weight and volume inefficiencies degrade the energy density and specific energy of individual cells currently at 30 Wh/cudm and 40 Wh/kg respectively. In addition, the increased parts count and associated handling significantly affect the overall battery related costs. Spacecraft battery systems designers within industry and Government realize that to reduce weight, volume, and cost requires increases in the capacity of nickel-hydrogen cells.

Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C)

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2010-02-01

Ceramic Column Grid Array packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performance, compatibility with standard surface-mount packaging assembly processes, etc. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, payload electronics, etc. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short and long-term space missions. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide have been assembled, inspected non-destructively and subsequently subjected to extreme temperature thermal cycling to assess the reliability for future deep space, short and long-term, extreme temperature missions. In this investigation, the employed temperature range covers from -185°C to +125°C extreme thermal environments. The test hardware consists of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The CCGA717 package is 33 mm × 33 mm with a 27×27 array of 80%/20% Pb/Sn columns on a 1.27 mm pitch. The resistance of daisy-chained, CCGA interconnects were continuously monitored as a function of thermal cycling. Electrical resistance measurements as a function of thermal cycling are reported and the tests to date have shown significant change in daisy chain resistance as a function of thermal cycling. The change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. This paper will describe the experimental test results of CCGA testing under wide extreme temperatures. Standard Weibull analysis tools were used to extract the Weibull parameters to understand the CCGA failures. Optical inspection results clearly indicate that the solder joints of columns with the board and the ceramic package have failed as a function of thermal cycling. The first failure was observed at 137th thermal cycle and 63.2% failures of daisy chains have occurred at about 664 thermal cycles. The shape parameter extracted from Weibull plot was about 1.47 which indicates the failures were related to failures occurred during the flat region or useful life region of standard bath tub curve. Based on this experimental test data one can use the CCGAs for the temperature range studied for ~100 thermal cycles (ΔT = 310°C, 5oC/minute, and 15 minutes dwell) with high degree of confidence for high reliability space and other applications.

Performance characterization of high quantum efficiency metal package photomultiplier tubes for time-of-flight and high-resolution PET applications.

PubMed

Ko, Guen Bae; Lee, Jae Sung

2015-01-01

Metal package photomultiplier tubes (PMTs) with a metal channel dynode structure have several advanced features for devising such time-of-flight (TOF) and high spatial resolution positron emission tomography (PET) detectors, thanks to their high packing density, large effective area ratio, fast time response, and position encoding capability. Here, we report on an investigation of new metal package PMTs with high quantum efficiency (QE) for high-resolution PET and TOF PET detector modules. The latest metal package PMT, the Hamamatsu R11265 series, is served with two kinds of photocathodes that have higher quantum efficiency than normal bialkali (typical QE ≈ 25%), super bialkali (SBA; QE ≈ 35%), and ultra bialkali (UBA; QE ≈ 43%). In this study, the authors evaluated the performance of the new PMTs with SBA and UBA photocathodes as a PET detector by coupling various crystal arrays. They also investigated the performance improvements of high QE, focusing in particular on a block detector coupled with a lutetium-based scintillator. A single 4 × 4 × 10 mm(3) LYSO, a 7 × 7 array of 3 × 3 × 20 mm(3) LGSO, a 9 × 9 array of 1.2 × 1.2 × 10 mm(3) LYSO, and a 6 × 6 array of 1.5 × 1.5 × 7 mm(3) LuYAP were used for evaluation. All coincidence data were acquired with a DRS4 based fast digitizer. This new PMT shows promising crystal positioning accuracy, energy and time discrimination performance for TOF, and high-resolution PET applications. The authors also found that a metal channel PMT with SBA was enough for both TOF and high-resolution application, although UBA gave a minor improvement to time resolution. However, significant performance improvement was observed in relative low light output crystals (LuYAP) coupled with UBA. The results of this study will be of value as a useful reference to select PMTs for high-performance PET detectors.

High-power LED package requirements

NASA Astrophysics Data System (ADS)

Wall, Frank; Martin, Paul S.; Harbers, Gerard

2004-01-01

Power LEDs have evolved from simple indicators into illumination devices. For general lighting applications, where the objective is to light up an area, white LED arrays have been utilized to serve that function. Cost constraints will soon drive the industry to provide a discrete lighting solution. Early on, that will mean increasing the power densities while quantum efficiencies are addressed. For applications such as automotive headlamps & projection, where light needs to be tightly collimated, or controlled, arrays of die or LEDs will not be able to satisfy the requirements & limitations defined by etendue. Ultimately, whether a luminaire requires a small source with high luminance, or light spread over a general area, economics will force the evolution of the illumination LED into a compact discrete high power package. How the customer interfaces with this new package should be an important element considered early on in the design cycle. If an LED footprint of adequate size is not provided, it may prove impossible for the customer, or end user, to get rid of the heat in a manner sufficient to prevent premature LED light output degradation. Therefore it is critical, for maintaining expected LED lifetime & light output, that thermal performance parameters be defined, by design, at the system level, which includes heat sinking methods & interface materials or methdology.

Characterization of the interaction between two food aroma components, alpha-pinene and ethyl butyrate, and ethylene-vinyl alcohol copolymer (EVOH) packaging films as a function of environmental humidity.

PubMed

López-Carballo, Gracia; Cava, David; Lagarón, Jose M; Catalá, Ramón; Gavara, Rafael

2005-09-07

The ethylene-vinyl alcohol copolymers (EVOHs) are well-known high oxygen barrier materials that are being used successfully in the design of packaging structures for oxygen-sensitive food or pharmaceutical products. Recently, there has been increasing interest in using EVOH materials to provide a high barrier to organic compounds as a means to reduce food aroma scalping. However, the barrier function of this family of materials diminishes significantly in humid environments, and it is supposed that so does the organic vapor barrier. In this work, a new sorption-based method to characterize the interaction between food aroma and polymer films for packaging as a function of relative humidity is presented and is used to determine the barrier to ethyl butyrate and alpha-pinene of EVOH at 23 degrees C. The results show that although EVOH is an excellent barrier to food aroma when dry, a property that even improves at low relative humidity (RH), the solubility and diffusivity of the compounds tested increase dramatically with humidity at medium to high water activities. However, even in the worst case (100% RH), EVOH outperforms low-density polyethylene (LDPE) as a barrier to organic vapors at least 500,000-fold.

3D packaging of a microfluidic system with sensory applications

NASA Astrophysics Data System (ADS)

Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

1997-09-01

Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

CUGatesDensity—Quantum circuit analyser extended to density matrices

NASA Astrophysics Data System (ADS)

Loke, T.; Wang, J. B.

2013-12-01

CUGatesDensity is an extension of the original quantum circuit analyser CUGates (Loke and Wang, 2011) [7] to provide explicit support for the use of density matrices. The new package enables simulation of quantum circuits involving statistical ensemble of mixed quantum states. Such analysis is of vital importance in dealing with quantum decoherence, measurements, noise and error correction, and fault tolerant computation. Several examples involving mixed state quantum computation are presented to illustrate the use of this package. Catalogue identifier: AEPY_v1_0 Program summary URL:http://cpc.cs.qub.ac.uk/summaries/AEPY_v1_0.html Program obtainable from: CPC Program Library, Queen’s University, Belfast, N. Ireland Licensing provisions: Standard CPC licence, http://cpc.cs.qub.ac.uk/licence/licence.html No. of lines in distributed program, including test data, etc.: 5368 No. of bytes in distributed program, including test data, etc.: 143994 Distribution format: tar.gz Programming language: Mathematica. Computer: Any computer installed with a copy of Mathematica 6.0 or higher. Operating system: Any system with a copy of Mathematica 6.0 or higher installed. Classification: 4.15. Nature of problem: To simulate arbitrarily complex quantum circuits comprised of single/multiple qubit and qudit quantum gates with mixed state registers. Solution method: A density matrix representation for mixed states and a state vector representation for pure states are used. The construct is based on an irreducible form of matrix decomposition, which allows a highly efficient implementation of general controlled gates with multiple conditionals. Running time: The examples provided in the notebook CUGatesDensity.nb take approximately 30 s to run on a laptop PC.

Detailed Wave Function Analysis for Multireference Methods: Implementation in the Molcas Program Package and Applications to Tetracene.

PubMed

Plasser, Felix; Mewes, Stefanie A; Dreuw, Andreas; González, Leticia

2017-11-14

High-level multireference computations on electronically excited and charged states of tetracene are performed, and the results are analyzed using an extensive wave function analysis toolbox that has been newly implemented in the Molcas program package. Aside from verifying the strong effect of dynamic correlation, this study reveals an unexpected critical influence of the atomic orbital basis set. It is shown that different polarized double-ζ basis sets produce significantly different results for energies, densities, and overall wave functions, with the best performance obtained for the atomic natural orbital (ANO) basis set by Pierloot et al. Strikingly, the ANO basis set not only reproduces the energies but also performs exceptionally well in terms of describing the diffuseness of the different states and of their attachment/detachment densities. This study, thus, not only underlines the fact that diffuse basis functions are needed for an accurate description of the electronic wave functions but also shows that, at least for the present example, it is enough to include them implicitly in the contraction scheme.

49 CFR 173.316 - Cryogenic liquids in cylinders.

Code of Federal Regulations, 2011 CFR

2011-10-01

... filling density for hydrogen, cryogenic liquid is defined as the percent ratio of the weight of lading in... 49 Transportation 2 2011-10-01 2011-10-01 false Cryogenic liquids in cylinders. 173.316 Section... REQUIREMENTS FOR SHIPMENTS AND PACKAGINGS Gases; Preparation and Packaging § 173.316 Cryogenic liquids in...

Physical and Thermal Structure of the Bishop Tuff, California

NASA Astrophysics Data System (ADS)

Wilson, C. J.; Hildreth, W.

2001-12-01

The 0.76 Ma Bishop Tuff, California, includes an ignimbrite constructed from a series of overlapping packages of material erupted sequentially and simultaneously from multiple sources around the ring fracture of Long Valley caldera (Wilson, C.J.N., Hildreth, W., 1997, Journal of Geology 105, 407-439). Exceptionally good continuous exposures of the ignimbrite in the walls of Owens Gorge to the east of Long Valley provide a cross-section through the east-side packages (Ig1E and Ig2E). We have measured 10 sections up the gorge walls to draw up a cross section of the ignimbrite down Owens Gorge, using lithic abundances and lithologies to define the physical eruptive packages and their subdivisions, and measurements of tuff bulk density (as an easily measured proxy for welding intensity) to define the thermal eruptive packages. The physically emplaced bodies of ignimbrite represent an overlapping, shingling suite of material such that successively later ignimbrite occurs most prominently farther away from source. Two major and two lesser zones of maximum density (welding) are present, the lower two (in Ig1Ea and lower Ig1Eb) in upper Owens Gorge, and the two most prominent (upper Ig1Eb and Ig2Eb) in middle and lower parts of the gorge. Welding fluctuations are controlled by bulk temperatures of individual batches of hotter and cooler material, but the intensity of the welding also depends on deposit thickness (i.e. load stress). Physically defined contacts between ignimbrite packages show that time breaks inferred to be of hours may not result in formation of any visible parting or flow unit boundary. Furthermore, positions of density (welding) minima between zones of higher density tuff do not coincide with horizons of stratigraphic significance. These observations lead to two conclusions. (1) The absence of clear partings or flow unit boundaries in an ignimbrite sequence is not diagnostic either of the material representing a single flow unit, or of the material being continuously progressively aggraded. (2) Use of the density (welding) minimum to locate the boundaries of cooling units and in measuring and modelling the emplacement and thermal history of compound cooling units may lead to errors.

Physically separating printed circuit boards with a resilient, conductive contact

NASA Technical Reports Server (NTRS)

Baker, John D. (Inventor); Montalvo, Alberto (Inventor)

1999-01-01

A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.

Changes in pectin methyl esterase activity with different packaging materials and stages of fruit harvesting during cold storage of pear cv. Punjab beauty.

PubMed

Kaur, Kirandeep; Dhillon, W S; Mahajan, B V C

2014-10-01

Pear cv. Punjab Beauty has become quite popular in Punjab. Excessive softening during cold storage leading to low shelf life is the major factor limiting its wider adoption. Studies were, therefore, conducted to determine the firmness and pectin methyl esterase (PME) activity at 4 harvest dates (2nd, 3rd and 4th week of July, and 1st week of August). Various packaging materials i.e. corrugated fiber board boxes and crates with high and low density polyethylene liners, corrugated fiber board boxes, crates and wooden boxes were also evaluated for their role in extending the shelf life of fruits. The enzyme activity and fruit firmness was evaluated periodically after 30, 45, 60 and 75 days of storage at 0-1 °C and 90-95 % RH. The firmness of the fruits decreased with the increase in storage intervals but the enzyme activity increased with the storage period up to 60 days and declined thereafter. Ripening-related changes in all the harvests were characterized mainly by an increase in the solubilization of pectin with a concomitant decrease in the degree of firmness. There was a continuous increase in enzyme activity with the advancement in harvesting dates and then fell sharply in the advanced ripening stages. Highest pectin methyl esterase activity was in fruits packed in crates followed by wooden boxes and corrugated fiber board boxes while the lowest was recorded in fruits packed in corrugated fiber board boxes with high density polyethylene liners. Therefore, high density polyethylene lined CFB boxes proved to be most effective in preventing the loss in firmness.

Aerogel-Based Multilayer Insulation with Micrometeoroid Protection

NASA Technical Reports Server (NTRS)

Begag, Redouane; White, Shannon

2013-01-01

Ultra-low-density, highly hydrophobic, fiber-reinforced aerogel material integrated with MLI (aluminized Mylar reflectors and B4A Dacron separators) offers a highly effective insulation package by providing unsurpassed thermal performance and significant robustness, delivering substantial MMOD protection via the addition of a novel, durable, external aerogel layer. The hydrophobic nature of the aerogel is an important property for maintaining thermal performance if the material is exposed to the environment (i.e. rain, snow, etc.) during ground installations. The hybrid aerogel/MLI/MMOD solution affords an attractive alternative because it will perform thermally in the same range as MLI at all vacuum levels (including high vacuum), and offers significant protection from micrometeoroid damage. During this effort, the required low-density and resilient aerogel materials have been developed that are needed to optimize the thermal performance for space (high vacuum) cryotank applications. The proposed insulation/MMOD package is composed of two sections: a stack of interleaved aerogel layers and MLI intended for cryotank thermal insulation, and a 1.5- to 1-in. (.2.5- to 3.8- cm) thick aerogel layer (on top of the insulation portion) for MMOD protection. Learning that low-density aerogel cannot withstand the hypervelocity impact test conditions, the innovators decided during the course of the program to fabricate a high-density and strong material based on a cross-linked aerogel (X-aerogel; developed elsewhere by the innovators) for MMOD protection. This system has shown a very high compressive strength that is capable of withstanding high-impact tests if a proper configuration of the MMOD aerogel layer is used. It was learned that by stacking two X-aerogel layers [1.5-in. (.3.8-cm) thick] separated by an air gap, the system would be able to hold the threat at a speed of 5 km/s and gpass h the test. The first aerogel panel stopped the projectile from damaging the second aerogel panel. The impacted X-aerogel (the back specimen from the successful test) was further tested in comparison to another similar sample (not impacted) at Kennedy Space Center for thermal conductivity evaluation at cryogenic conditions. The specimens were tested under high vacuum and cryogenic temperatures, using Cryostat 500. The results show that the specimen did not lose a significant amount of thermal performance due to the impact test, especially at high vacuum.

SEAWAT Version 4: A Computer Program for Simulation of Multi-Species Solute and Heat Transport

USGS Publications Warehouse

Langevin, Christian D.; Thorne, Daniel T.; Dausman, Alyssa M.; Sukop, Michael C.; Guo, Weixing

2008-01-01

The SEAWAT program is a coupled version of MODFLOW and MT3DMS designed to simulate three-dimensional, variable-density, saturated ground-water flow. Flexible equations were added to the program to allow fluid density to be calculated as a function of one or more MT3DMS species. Fluid density may also be calculated as a function of fluid pressure. The effect of fluid viscosity variations on ground-water flow was included as an option. Fluid viscosity can be calculated as a function of one or more MT3DMS species, and the program includes additional functions for representing the dependence on temperature. Although MT3DMS and SEAWAT are not explicitly designed to simulate heat transport, temperature can be simulated as one of the species by entering appropriate transport coefficients. For example, the process of heat conduction is mathematically analogous to Fickian diffusion. Heat conduction can be represented in SEAWAT by assigning a thermal diffusivity for the temperature species (instead of a molecular diffusion coefficient for a solute species). Heat exchange with the solid matrix can be treated in a similar manner by using the mathematically equivalent process of solute sorption. By combining flexible equations for fluid density and viscosity with multi-species transport, SEAWAT Version 4 represents variable-density ground-water flow coupled with multi-species solute and heat transport. SEAWAT Version 4 is based on MODFLOW-2000 and MT3DMS and retains all of the functionality of SEAWAT-2000. SEAWAT Version 4 also supports new simulation options for coupling flow and transport, and for representing constant-head boundaries. In previous versions of SEAWAT, the flow equation was solved for every transport timestep, regardless of whether or not there was a large change in fluid density. A new option was implemented in SEAWAT Version 4 that allows users to control how often the flow field is updated. New options were also implemented for representing constant-head boundaries with the Time-Variant Constant-Head (CHD) Package. These options allow for increased flexibility when using CHD flow boundaries with the zero-dispersive flux solute boundaries implemented by MT3DMS at constant-head cells. This report contains revised input instructions for the MT3DMS Dispersion (DSP) Package, Variable-Density Flow (VDF) Package, Viscosity (VSC) Package, and CHD Package. The report concludes with seven cases of an example problem designed to highlight many of the new features.

Optimal segmentation and packaging process

DOEpatents

Kostelnik, K.M.; Meservey, R.H.; Landon, M.D.

1999-08-10

A process for improving packaging efficiency uses three dimensional, computer simulated models with various optimization algorithms to determine the optimal segmentation process and packaging configurations based on constraints including container limitations. The present invention is applied to a process for decontaminating, decommissioning (D and D), and remediating a nuclear facility involving the segmentation and packaging of contaminated items in waste containers in order to minimize the number of cuts, maximize packaging density, and reduce worker radiation exposure. A three-dimensional, computer simulated, facility model of the contaminated items are created. The contaminated items are differentiated. The optimal location, orientation and sequence of the segmentation and packaging of the contaminated items is determined using the simulated model, the algorithms, and various constraints including container limitations. The cut locations and orientations are transposed to the simulated model. The contaminated items are actually segmented and packaged. The segmentation and packaging may be simulated beforehand. In addition, the contaminated items may be cataloged and recorded. 3 figs.

Peering down the barrel of a bacteriophage portal: the genome packaging and release valve in p22.

PubMed

Tang, Jinghua; Lander, Gabriel C; Olia, Adam S; Olia, Adam; Li, Rui; Casjens, Sherwood; Prevelige, Peter; Cingolani, Gino; Baker, Timothy S; Johnson, John E

2011-04-13

The encapsidated genome in all double-strand DNA bacteriophages is packaged to liquid crystalline density through a unique vertex in the procapsid assembly intermediate, which has a portal protein dodecamer in place of five coat protein subunits. The portal orchestrates DNA packaging and exit, through a series of varying interactions with the scaffolding, terminase, and closure proteins. Here, we report an asymmetric cryoEM reconstruction of the entire P22 virion at 7.8 Å resolution. X-ray crystal structure models of the full-length portal and of the portal lacking 123 residues at the C terminus in complex with gene product 4 (Δ123portal-gp4) obtained by Olia et al. (2011) were fitted into this reconstruction. The interpreted density map revealed that the 150 Å, coiled-coil, barrel portion of the portal entraps the last DNA to be packaged and suggests a mechanism for head-full DNA signaling and transient stabilization of the genome during addition of closure proteins. Copyright © 2011 Elsevier Ltd. All rights reserved.

Laser-induced forward transfer for flip-chip packaging of single dies.

PubMed

Kaur, Kamal S; Van Steenberge, Geert

2015-03-20

Flip-chip (FC) packaging is a key technology for realizing high performance, ultra-miniaturized and high-density circuits in the micro-electronics industry. In this technique the chip and/or the substrate is bumped and the two are bonded via these conductive bumps. Many bumping techniques have been developed and intensively investigated since the introduction of the FC technology in 1960(1) such as stencil printing, stud bumping, evaporation and electroless/electroplating2. Despite the progress that these methods have made they all suffer from one or more than one drawbacks that need to be addressed such as cost, complex processing steps, high processing temperatures, manufacturing time and most importantly the lack of flexibility. In this paper, we demonstrate a simple and cost-effective laser-based bump forming technique known as Laser-induced Forward Transfer (LIFT)3. Using the LIFT technique a wide range of bump materials can be printed in a single-step with great flexibility, high speed and accuracy at RT. In addition, LIFT enables the bumping and bonding down to chip-scale, which is critical for fabricating ultra-miniature circuitry.

Waste product profile: Polyethylene terephthalate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miller, C.

1996-02-01

Polyethylene terephthalate (PET) is a plastic resin used primarily to make bottles. Soft drinks are the primary product packaged in PET. Salad dressing, peanut butter, and other household and consumer products also use PET bottles. PET is also used for film, sheeting for cups and food trays, ovenable trays, and other uses. PET is a relatively new packaging resin, first commercialized in the early `70s. Because it is an ``engineered`` resin, it is more expensive than commodity resins such as high-density polyethylene (HDPE). The primary market for recycled PET is the fiber industry, which uses PET for carpet fiber, sweatersmore » and other clothing, and for other uses. Recycled PET can also be used for food and beverage containers. Export markets, particularly Asian countries, are becoming increasingly important.« less

Magnetic Tape Recording for the Eighties

NASA Technical Reports Server (NTRS)

Kalil, Ford (Editor)

1982-01-01

The practical and theoretical aspects of state-of-the-art magnetic tape recording technology are reviewed. Topics covered include the following: (1) analog and digital magnetic tape recording, (2) tape and head wear, (3) wear testing, (4) magnetic tape certification, (5) care, handling, and management of magnetic tape, (6) cleaning, packing, and winding of magnetic tape, (7) tape reels, bands, and packaging, (8) coding techniques for high-density digital recording, and (9) tradeoffs of coding techniques.

Joint U.S. Defense Science Board, UK Defence Scientific Advisory Council Task Force on Defense Critical Technologies

DTIC Science & Technology

2006-03-01

electrons (e.g., betavoltaics ) in a compact package is emerging as a possible new high energy density power source. Proliferation is not an issue...10 13 10 12 10 11 10 10 10 9 10 8 10 7 10 6 10 5 10 2 10 3 10 4 10 5 10 6 10 7 Total Dose [rad) Si )] Strategic Space Strategic Missiles St ra te gi

Silicon photonics integrated circuits: a manufacturing platform for high density, low power optical I/O's.

PubMed

Absil, Philippe P; Verheyen, Peter; De Heyn, Peter; Pantouvaki, Marianna; Lepage, Guy; De Coster, Jeroen; Van Campenhout, Joris

2015-04-06

Silicon photonics integrated circuits are considered to enable future computing systems with optical input-outputs co-packaged with CMOS chips to circumvent the limitations of electrical interfaces. In this paper we present the recent progress made to enable dense multiplexing by exploiting the integration advantage of silicon photonics integrated circuits. We also discuss the manufacturability of such circuits, a key factor for a wide adoption of this technology.

Designing an Electronics Data Package for Printed Circuit Boards (PCBs)

DTIC Science & Technology

2013-08-01

finished PCB flatness deviation should be less than 0.010 inches per inch. 4  The minimum copper wall thickness of plated-thru holes should be...Memory Card International Association)  IPC-6015 MCM-L (Multi-Chip Module – Laminated )  IPC-6016 HDI (High Density Interconnect)  IPC-6018...Interconnect ICT In Circuit Tester IPC Association Connecting Electronics Industries MCM-L Multi-Chip Module – Laminated MIL Military NEMA National

Rapid discrimination of plastic packaging materials using MIR spectroscopy coupled with independent components analysis (ICA).

PubMed

Kassouf, Amine; Maalouly, Jacqueline; Rutledge, Douglas N; Chebib, Hanna; Ducruet, Violette

2014-11-01

Plastic packaging wastes increased considerably in recent decades, raising a major and serious public concern on political, economical and environmental levels. Dealing with this kind of problems is generally done by landfilling and energy recovery. However, these two methods are becoming more and more expensive, hazardous to the public health and the environment. Therefore, recycling is gaining worldwide consideration as a solution to decrease the growing volume of plastic packaging wastes and simultaneously reduce the consumption of oil required to produce virgin resin. Nevertheless, a major shortage is encountered in recycling which is related to the sorting of plastic wastes. In this paper, a feasibility study was performed in order to test the potential of an innovative approach combining mid infrared (MIR) spectroscopy with independent components analysis (ICA), as a simple and fast approach which could achieve high separation rates. This approach (MIR-ICA) gave 100% discrimination rates in the separation of all studied plastics: polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polystyrene (PS) and polylactide (PLA). In addition, some more specific discriminations were obtained separating plastic materials belonging to the same polymer family e.g. high density polyethylene (HDPE) from low density polyethylene (LDPE). High discrimination rates were obtained despite the heterogeneity among samples especially differences in colors, thicknesses and surface textures. The reproducibility of the proposed approach was also tested using two spectrometers with considerable differences in their sensitivities. Discrimination rates were not affected proving that the developed approach could be extrapolated to different spectrometers. MIR combined with ICA is a promising tool for plastic waste separation that can help improve performance in this field; however further technological improvements and developments are required before it can be applied at an industrial level given that all tests presented here were performed under laboratory conditions. Copyright © 2014 Elsevier Ltd. All rights reserved.

High-efficiency and high-reliability 9xx-nm bars and fiber-coupled devices at Coherent

NASA Astrophysics Data System (ADS)

Zhou, Hailong; Kennedy, Keith; Weiss, Eli; Li, Jun; Anikitchev, Serguei; Reichert, Patrick; Du, Jihua; Schleuning, David; Nabors, David; Reed, Murray; Toivonen, Mika; Lehkonen, Sami; Haapamaa, Jouko

2006-02-01

Ongoing optimization of epitaxial design within Coherent device engineering has led to a family of high power-conversion-efficiency (PCE) products on conductively cooled packages (CCP) and fiber array packages (FAP). At a 25°C heat sink temperature, the PCE was measured at 71.5% with 75W CW output power on 30% fill-factor (FF) bars with passive cooling. At heat sink temperatures as high as 60°C the PCE of these bars is still maintained above 60%. Powered by such high efficiency 9xx nm diodes, Coherent FAP products have consistently exceeded 55% PCE up to 50W power levels, with 62% PCE demonstrated out of the fiber. High linear-power-density (LPD) operation of 100μm x 7-emitter bars at LPD = 80 mW/μm was also demonstrated. Bars with 7-emitter were measured up to 140W QCW power before catastrophic optical mirror damage (COMD) occurred, which corresponds to a COMD value of 200mW/μm or 2D facet power density of 29.4 MW/cm2. Leveraging these improvements has enabled high power FAPs with >90W CW from an 800μm-diameter fiber bundle. Extensive reliability testing has already accumulated 400,000 total real-time device hours at a variety of accelerated and non-accelerated operating conditions. A random failure rate <0.5% per kilo-hours and gradual degradation rate <0.4% per kilo-hours have been observed. For a 30% FF 50W CW 9xx nm bar, this equates to >30,000 hours of median lifetime at a 90% confidence level. More optimized 30% FF 9xx nm bars are under development for power outputs up to 80W CW with extrapolated median lifetimes greater than 20,000 hours.

Novel packaging for CW and QCW diode laser modules for operation with high power and duty cycles

NASA Astrophysics Data System (ADS)

Fassbender, Wilhelm; Lotz, Jens; Kissel, Heiko; Biesenbach, Jens

2018-02-01

Continuous wave (CW) and quasi-continuous wave (QCW) operated diode laser bars and arrays have found a wide range of industrial, medical, scientific, military and space applications with a broad variety in wavelength, pulse energy, pulse duration and beam quality. Recent applications require even higher power, duty cycles and power density. The heat loss will be dissipated by conductive cooling or liquid cooling close to the bars. We present the latest performance and reliability data of two novel high-brightness CW and QCW arrays of customized and mass-production modules, in compact and robust industry design for operation with high power and high duty cycles. All designs are based on single diode packages consisting of 10mm laser bars, soft or hard soldered between expansion matched submounts. The modular components cover a wide span of designs which differ basically in water/conduction (active/passive) cooled, single, linear (horizontal and vertical) arranged designs, as well as housed and unhoused modules. The different assembling technologies of active and passive cooled base plates affect the heat dissipation and therefore the reachable power at different QCW operating conditions, as well as the lifetime. As an example, a package consisting of 8 laser diodes, connected to a 28.8*13.5*7.0mm3 DCB (direct copper bonded) submount, passively or actively cooled is considered. This design is of particular interest for mobile applications seamless module to module building system, with an infinite number of laser bars at 1.7mm pitch. Using 940nm bars we can reach an optical output power per bar of 450W at 25°C base plate temperature with 10Hz, 1.2% duty cycle and 1.2ms pulse duration. As an additional example, micro channel coolers can be vertically stacked up to 50 diodes with a 1,15mm pitch. This design is suitable for all applications, demanding also compactness and light weight and high power density. Using near infrared bars and others, we can reach an optical output power of 250W per bar at 25°C coolant temperature at CW operation.

Model 9975 Life Extension Test Package 3 - Interim Report - January 2017

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W.

2017-01-31

Life extension package LE3 (9975-03203) has been instrumented and subjected to an elevated temperature environment for approximately 8 years. During this time, the cane fiberboard has been maintained at a maximum temperature of ~160 - 165 °F, which was established by a combination of internal (19 watts) and external heat sources. Several tests and parameters were used to characterize the package components. Results from these tests generally indicate agreement between this full-scale shipping package and small-scale laboratory tests on fiberboard samples, including the degradation models based on the laboratory tests. These areas of agreement include the rate of change ofmore » fiberboard weight, dimensions and density, and change in fiberboard thermal conductivity. Corrosion of the lead shield occurred at a high rate during the first several weeks of aging, but dropped significantly after most of the moisture in the fiberboard migrated away from the lead shield. Dimensional measurements of the lead shield indicate that no significant creep deformation has occurred. This is consistent with literature data that predict a very small creep deformation for the time at temperature experienced by this package. The SCV O-rings were verified to remain leak-tight after ~5 years aging at an average temperature of ~170 °F. This package provides an example of the extent to which moisture within a typical fiberboard assembly can redistribute in the presence of a temperature gradient such as might be created by a 19 watt internal heat load. The majority of water within the fiberboard migrated to the bottom layers of fiberboard, with approximately 2 kg of water (2 liters) eventually escaping from the package. Two conditions have developed that are not consistent with package certification requirements. The axial gap at the top of the package increased to a maximum value of 1.549 inches, exceeding the 1 inch criterion. In addition, staining and/or corrosion have formed in a few spots on the drum. However, the package remains capable of performing its function. Aging of this package continues.« less

Theoretical investigation of structures and energetics of sodium adatom and its dimer on graphene: DFT study

NASA Astrophysics Data System (ADS)

Kaur, Gagandeep; Gupta, Shuchi; Rani, Pooja; Dharamvir, Keya

2015-11-01

Extensive ab initio calculations have been performed to study the energetics of a sodium (Na) atom and its dimer adsorbed on graphene using the SIESTA package Soler et al. (2002) [1] which works within a DFT(density functional theory)-GGA (generalized gradient approximation) pseudopotential framework. The adsorption energy, geometry, charge transfer, ionization potential and density of states (DOS), partial density states (PDOS) of adatom/dimer-graphene system have been calculated. After considering various sites for adsorption of Na on graphene, the center of a hexagonal ring of carbon atoms is found to be the preferred site of adsorption while the Na2 dimer prefers to rest parallel to the graphene sheet. We find insignificant energy differences among adsorption configurations involving different possible sites in parallel orientation, which implies high mobility of the dimer on the graphene sheet. We also notice only a slight distortion of the graphene sheet perpendicular to its plane upon adatom adsorption. However, some lateral displacements seen are more perceptible. Summary The adsorption energy, geometry, charge transfer, ionization potential and density of states (DOS) and PDOS of adatom/dimer-graphene system have been calculated using SIESTA package Soler et al. (2002) [1] which works within a DFT(density functional theory)-GGA (generalized gradient approximation) pseudopotential framework. Preferred site for adsorption of a sodium atom on graphene is the hollow site. For the Na dimer adsorption, we found that horizontal orientation is favored over the vertical one. From DOS plots, it is clear that graphene's states are nearly unaffected by the adsorption of Na adatom and Interaction between sodium and graphene is predominantly ionic

Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments

NASA Astrophysics Data System (ADS)

Ramesham, Rajeshuni

2013-03-01

Life testing/qualification of reflowed (1st reflow) and reworked (1st reflow, 1st removal, and then 1st rework) advanced ceramic column grid array (CCGA) surface mount interconnect electronic packaging technologies for future flight projects has been studied to enhance the mission assurance of JPL-NASA projects. The reliability of reworked/reflowed surface mount technology (SMT) packages is very important for short-duration and long-duration deep space harsh extreme thermal environmental missions. The life testing of CCGA electronic packages under extreme thermal environments (for example: -185°C to +125°C) has been performed with reference to various JPL/NASA project requirements which encompass the temperature range studied. The test boards of reflowed and reworked CCGA packages (717 Xilinx package, 624, 1152, and 1272 column Actel Packages) were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases or cycles to failure to assess the life of the hardware. Qualification/life testing was performed by subjecting test boards to the environmental harsh temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance solder-joint failures due to either overstress or thermal cycle fatigue. The large, high density, high input/output (I/O) electronic interconnect SMT packages such as CCGA have increased usage in avionics hardware of NASA projects during the last two decades. The test boards built with CCGA packages are expensive and often require a rework to replace a reflowed, reprogrammed, failed, redesigned, etc., CCGA packages. Theoretically speaking, a good rework process should have similar temperature-time profile as that used for the original manufacturing process of solder reflow. A multiple rework processes may be implemented with CCGA packaging technology to understand the effect of number of reworks on the reliability of this technology for harsh thermal environments. In general, reliability of the assembled electronic packages reduces as a function of number of reworks and the extent is not known yet. A CCGA rework process has been tried and implemented to design a daisy-chain test board consists of 624 and 717 packages. Reworked CCGA interconnect electronic packages of printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging and optical microscope techniques. The assembled boards after 1st rework and 1st reflow were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space JPL/NASA for moderate to harsh thermal mission environments. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling to determine intermittent failures. This paper provides the experimental reliability test results to failure of assemblies for the first time of reflowed and reworked CCGA packages under extreme harsh thermal environments.

Highly Processed and Ready-to-Eat Packaged Food and Beverage Purchases Differ by Race/Ethnicity among US Households.

PubMed

Poti, Jennifer M; Mendez, Michelle A; Ng, Shu Wen; Popkin, Barry M

2016-09-01

Racial/ethnic disparities in dietary quality persist among Americans, but it is unclear whether highly processed foods or convenience foods contribute to these inequalities. We examined the independent associations of race/ethnicity with highly processed and ready-to-eat (RTE) food purchases among US households. We determined whether controlling for between-group differences in purchases of these products attenuated associations between race/ethnicity and the nutritional quality of purchases. The 2000-2012 Homescan Panel followed US households (n = 157,142) that scanned their consumer packaged goods (CPG) food and beverage purchases. By using repeated-measures regression models adjusted for sociodemographic characteristics, we examined time-varying associations of race/ethnicity with processed and convenience food purchases, expressed as a percentage of calories purchased. We estimated associations between race/ethnicity and saturated fat, sugar, or energy density of total purchases with and without adjustment for processed and convenience food purchases. Compared with white households, black households had significantly lower purchases of highly processed foods (-4.1% kcal) and RTE convenience foods (-4.9% kcal) and had higher purchases of basic processed foods, particularly cooking oils and sugar (+5.4% kcal), foods requiring cooking/preparation (+4.5% kcal), and highly processed beverages (+7.1% kcal). Hispanics also had lower purchases of highly processed and RTE foods than whites. Blacks had CPG purchases with significantly higher median sugar (+2.2% kcal) and energy density (+72 kcal/1000 g), whereas Hispanics had purchases with lower saturated fat (-0.6% kcal) and energy density (-25 kcal/1000 g) than whites. Racial/ethnic differences remained significant after adjustment for processed and convenience food purchases. In our study, compared with white households, both black and Hispanic households had lower purchases of highly processed and RTE foods, yet had total CPG purchases with differing nutritional quality. Our findings suggest that highly processed convenience foods are associated with, but cannot fully explain, racial/ethnic disparities in the nutritional quality of CPG purchases. © 2016 American Society for Nutrition.

Highly Processed and Ready-to-Eat Packaged Food and Beverage Purchases Differ by Race/Ethnicity among US Households123

PubMed Central

Mendez, Michelle A

2016-01-01

Background: Racial/ethnic disparities in dietary quality persist among Americans, but it is unclear whether highly processed foods or convenience foods contribute to these inequalities. Objective: We examined the independent associations of race/ethnicity with highly processed and ready-to-eat (RTE) food purchases among US households. We determined whether controlling for between-group differences in purchases of these products attenuated associations between race/ethnicity and the nutritional quality of purchases. Methods: The 2000–2012 Homescan Panel followed US households (n = 157,142) that scanned their consumer packaged goods (CPG) food and beverage purchases. By using repeated-measures regression models adjusted for sociodemographic characteristics, we examined time-varying associations of race/ethnicity with processed and convenience food purchases, expressed as a percentage of calories purchased. We estimated associations between race/ethnicity and saturated fat, sugar, or energy density of total purchases with and without adjustment for processed and convenience food purchases. Results: Compared with white households, black households had significantly lower purchases of highly processed foods (–4.1% kcal) and RTE convenience foods (–4.9% kcal) and had higher purchases of basic processed foods, particularly cooking oils and sugar (+5.4% kcal), foods requiring cooking/preparation (+4.5% kcal), and highly processed beverages (+7.1% kcal). Hispanics also had lower purchases of highly processed and RTE foods than whites. Blacks had CPG purchases with significantly higher median sugar (+2.2% kcal) and energy density (+72 kcal/1000 g), whereas Hispanics had purchases with lower saturated fat (–0.6% kcal) and energy density (–25 kcal/1000 g) than whites. Racial/ethnic differences remained significant after adjustment for processed and convenience food purchases. Conclusions: In our study, compared with white households, both black and Hispanic households had lower purchases of highly processed and RTE foods, yet had total CPG purchases with differing nutritional quality. Our findings suggest that highly processed convenience foods are associated with, but cannot fully explain, racial/ethnic disparities in the nutritional quality of CPG purchases. PMID:27466605

Investigation of Expandable Polymeric Microspheres for Packaging Applications

DTIC Science & Technology

2012-06-06

FILMS COST REDUCTION OLEFIN POLYMERS COSTS PACKAGING MICROSPHERES WASTE DISPOSAL WEIGHT...MANAGEMENT THERMAL INSULATION DENSITY SOLID WASTES ENVIRONMENTAL IMPACT THERMOPLASTIC POLYMERS POLYMERS ...research. The purpose was to provide information on the incorporation of hollow, expandable  polymeric microspheres  into  thermoplastic   polymers   to

Future Development of Dense Ferroelectric Memories for Space Applications

NASA Technical Reports Server (NTRS)

Philpy, Stephen C.; Derbenwick, Gary F.

2001-01-01

The availability of high density, radiation tolerant, nonvolatile memories is critical for space applications. Ferroelectric memories, when fabricated with radiation hardened complementary metal oxide semiconductors (CMOS), can be manufactured and packaged to provide high density replacements for Flash memory, which is not radiation tolerant. Previous work showed ferroelectric memory cells to be resistant to single event upsets and proton irradiation, and ferroelectric storage capacitors to be resistant to neutron exposure. In addition to radiation hardness, the fast programming times, virtually unlimited endurance, and low voltage, low power operation make ferroelectric memories ideal for space missions. Previously, a commercial double level metal 64-kilobit ferroelectric memory was presented. Although the capabilities of radiation hardened wafer fabrication facilities lag behind those of the most modern commercial wafer fabrication facilities, several paths to achieving radiation tolerant, dense ferroelectric memories are emerging. Both short and long term solutions are presented in this paper. Although worldwide major semiconductor companies are introducing commercial ferroelectric memories, funding limitations must be overcome to proceed with the development of high density, radiation tolerant ferroelectric memories.

Aqueous Rechargeable Alkaline CoxNi2-xS2/TiO2 Battery.

PubMed

Liu, Jilei; Wang, Jin; Ku, Zhiliang; Wang, Huanhuan; Chen, Shi; Zhang, Lili; Lin, Jianyi; Shen, Ze Xiang

2016-01-26

An electrochemical energy storage system with high energy density, stringent safety, and reliability is highly desirable for next-generation energy storage devices. Here an aqueous rechargeable alkaline CoxNi2-xS2 // TiO2 battery system is designed by integrating two reversible electrode processes associated with OH(-) insertion/extraction in the cathode part and Li ion insertion/extraction in the anode part, respectively. The prototype CoxNi2-xS2 // TiO2 battery is able to deliver high energy/power densities of 83.7 Wh/kg at 609 W/kg (based on the total mass of active materials) and good cycling stabilities (capacity retention 75.2% after 1000 charge/discharge cycles). A maximum volumetric energy density of 21 Wh/l (based on the whole packaged cell) has been achieved, which is comparable to that of a thin-film battery and better than that of typical commercial supercapacitors, benefiting from the unique battery and hierarchical electrode design. This hybrid system would enrich the existing aqueous rechargeable LIB chemistry and be a promising battery technology for large-scale energy storage.

Simulation-based Bayesian inference for latent traits of item response models: Introduction to the ltbayes package for R.

PubMed

Johnson, Timothy R; Kuhn, Kristine M

2015-12-01

This paper introduces the ltbayes package for R. This package includes a suite of functions for investigating the posterior distribution of latent traits of item response models. These include functions for simulating realizations from the posterior distribution, profiling the posterior density or likelihood function, calculation of posterior modes or means, Fisher information functions and observed information, and profile likelihood confidence intervals. Inferences can be based on individual response patterns or sets of response patterns such as sum scores. Functions are included for several common binary and polytomous item response models, but the package can also be used with user-specified models. This paper introduces some background and motivation for the package, and includes several detailed examples of its use.

Assessment of Quality Assurance Measures for Radioactive Material Transport Packages not Requiring Competent Authority Design Approval - 13282

DOE Office of Scientific and Technical Information (OSTI.GOV)

Komann, Steffen; Groeke, Carsten; Droste, Bernhard

The majority of transports of radioactive materials are carried out in packages which don't need a package design approval by a competent authority. Low-active radioactive materials are transported in such packages e.g. in the medical and pharmaceutical industry and in the nuclear industry as well. Decommissioning of NPP's leads to a strong demand for packages to transport low and middle active radioactive waste. According to IAEA regulations the 'non-competent authority approved package types' are the Excepted Packages and the Industrial Packages of Type IP-1, IP-2 and IP-3 and packages of Type A. For these types of packages an assessment bymore » the competent authority is required for the quality assurance measures for the design, manufacture, testing, documentation, use, maintenance and inspection (IAEA SSR 6, Chap. 306). In general a compliance audit of the manufacturer of the packaging is required during this assessment procedure. Their regulatory level in the IAEA regulations is not comparable with the 'regulatory density' for packages requiring competent authority package design approval. Practices in different countries lead to different approaches within the assessment of the quality assurance measures in the management system as well as in the quality assurance program of a special package design. To use the package or packaging in a safe manner and in compliance with the regulations a management system for each phase of the life of the package or packaging is necessary. The relevant IAEA-SSR6 chap. 801 requires documentary verification by the consignor concerning package compliance with the requirements. (authors)« less

Advanced Electrical Materials and Components Being Developed

NASA Technical Reports Server (NTRS)

Schwarze, Gene E.

2004-01-01

All aerospace systems require power management and distribution (PMAD) between the energy and power source and the loads. The PMAD subsystem can be broadly described as the conditioning and control of unregulated power from the energy source and its transmission to a power bus for distribution to the intended loads. All power and control circuits for PMAD require electrical components for switching, energy storage, voltage-to-current transformation, filtering, regulation, protection, and isolation. Advanced electrical materials and component development technology is a key technology to increasing the power density, efficiency, reliability, and operating temperature of the PMAD. The primary means to develop advanced electrical components is to develop new and/or significantly improved electronic materials for capacitors, magnetic components, and semiconductor switches and diodes. The next important step is to develop the processing techniques to fabricate electrical and electronic components that exceed the specifications of presently available state-of-the-art components. The NASA Glenn Research Center's advanced electrical materials and component development technology task is focused on the following three areas: 1) New and/or improved dielectric materials for the development of power capacitors with increased capacitance volumetric efficiency, energy density, and operating temperature; 2) New and/or improved high-frequency, high-temperature soft magnetic materials for the development of transformers and inductors with increased power density, energy density, electrical efficiency, and operating temperature; 3) Packaged high-temperature, high-power density, high-voltage, and low-loss SiC diodes and switches.

US Food Industry Progress During the National Salt Reduction Initiative: 2009-2014.

PubMed

Curtis, Christine J; Clapp, Jenifer; Niederman, Sarah A; Ng, Shu Wen; Angell, Sonia Y

2016-10-01

To assess the US packaged food industry's progress from 2009 to 2014, when the National Salt Reduction Initiative had voluntary, category-specific sodium targets with the goal of reducing sodium in packaged and restaurant foods by 25% over 5 years. Using the National Salt Reduction Initiative Packaged Food Database, we assessed target achievement and change in sales-weighted mean sodium density in top-selling products in 61 food categories in 2009 (n = 6336), 2012 (n = 6898), and 2014 (n = 7396). In 2009, when the targets were established, no categories met National Salt Reduction Initiative 2012 or 2014 targets. By 2014, 26% of categories met 2012 targets and 3% met 2014 targets. From 2009 to 2014, the sales-weighted mean sodium density declined significantly in almost half of all food categories (43%; 26/61 categories). Overall, sales-weighted mean sodium density declined significantly (by 6.8%; P < .001). National target setting with monitoring through a partnership of local, state, and national health organizations proved feasible, but industry progress was modest. The US Food and Drug Administration's proposed voluntary targets will be an important step in achieving more substantial sodium reductions.

VIBRATION TESTING OF RESILIENT PACKAGE CUSHIONING MATERIALS

DTIC Science & Technology

government and industry. Testing equipment which meets tentative ASTM requirements was developed. Preliminary tests were conducted on a resilient expanded ... polystyrene foam (in 3 densities) and a polyether urethane foam (in one density). When vibrated under static loads known to provide optimum shock

An econometric analysis of regional differences in household waste collection: the case of plastic packaging waste in Sweden.

PubMed

Hage, Olle; Söderholm, Patrik

2008-01-01

The Swedish producer responsibility ordinance mandates producers to collect and recycle packaging materials. This paper investigates the main determinants of collection rates of household plastic packaging waste in Swedish municipalities. This is done by the use of a regression analysis based on cross-sectional data for 252 Swedish municipalities. The results suggest that local policies, geographic/demographic variables, socio-economic factors and environmental preferences all help explain inter-municipality collection rates. For instance, the collection rate appears to be positively affected by increases in the unemployment rate, the share of private houses, and the presence of immigrants (unless newly arrived) in the municipality. The impacts of distance to recycling industry, urbanization rate and population density on collection outcomes turn out, though, to be both statistically and economically insignificant. A reasonable explanation for this is that the monetary compensation from the material companies to the collection entrepreneurs vary depending on region and is typically higher in high-cost regions. This implies that the plastic packaging collection in Sweden may be cost ineffective. Finally, the analysis also shows that municipalities that employ weight-based waste management fees generally experience higher collection rates than those municipalities in which flat and/or volume-based fees are used.

Comparative stability of repackaged metoprolol tartrate tablets.

PubMed

Yang, Yongsheng; Gupta, Abhay; Carlin, Alan S; Faustino, Patrick J; Lyon, Robbe C; Ellison, Christopher D; Rothman, Barry; Khan, Mansoor A

2010-01-29

The stability of metoprolol tartrate tablets packaged in original high density polyethylene containers and repackaged in USP Class A unit-dose blister packs was investigated. Studies were conducted at 25 degrees C/60% relative humidity (RH) for 52 weeks and at 40 degrees C/75% RH for 13 weeks. The potency, dissolution, water content, loss on drying and hardness of the drug products were analyzed. Results indicated no differences in the stability between the tablets in both packages stored under 25 degrees C/60% RH. No difference in potency was found in both packages under either condition. However, a significant weight increase due to moisture uptake was observed for the repackaged tablets stored under 40 degrees C/75% RH. The weight increase was accompanied by a decrease in tablet hardness (6.5-0 kp) and a increase in dissolution rate (51-92%) in 5 min. Near-infrared (NIR) chemical imaging also monitored moisture uptake of the tablet non-invasively through the package. The observed changes in product stability may adversely affect the products bioavailability profile, even though the potency of the active drug remained within USP specification range of 90-110%. Study results suggest product quality can be negatively impacted even when using USP Class A repackaging materials. Published by Elsevier B.V.

An econometric analysis of regional differences in household waste collection: The case of plastic packaging waste in Sweden

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hage, Olle; Soederholm, Patrik

2008-07-01

The Swedish producer responsibility ordinance mandates producers to collect and recycle packaging materials. This paper investigates the main determinants of collection rates of household plastic packaging waste in Swedish municipalities. This is done by the use of a regression analysis based on cross-sectional data for 252 Swedish municipalities. The results suggest that local policies, geographic/demographic variables, socio-economic factors and environmental preferences all help explain inter-municipality collection rates. For instance, the collection rate appears to be positively affected by increases in the unemployment rate, the share of private houses, and the presence of immigrants (unless newly arrived) in the municipality. Themore » impacts of distance to recycling industry, urbanization rate and population density on collection outcomes turn out, though, to be both statistically and economically insignificant. A reasonable explanation for this is that the monetary compensation from the material companies to the collection entrepreneurs vary depending on region and is typically higher in high-cost regions. This implies that the plastic packaging collection in Sweden may be cost ineffective. Finally, the analysis also shows that municipalities that employ weight-based waste management fees generally experience higher collection rates than those municipalities in which flat and/or volume-based fees are used.« less

Detection of micro solder balls using active thermography and probabilistic neural network

NASA Astrophysics Data System (ADS)

He, Zhenzhi; Wei, Li; Shao, Minghui; Lu, Xingning

2017-03-01

Micro solder ball/bump has been widely used in electronic packaging. It has been challenging to inspect these structures as the solder balls/bumps are often embedded between the component and substrates, especially in flip-chip packaging. In this paper, a detection method for micro solder ball/bump based on the active thermography and the probabilistic neural network is investigated. A VH680 infrared imager is used to capture the thermal image of the test vehicle, SFA10 packages. The temperature curves are processed using moving average technique to remove the peak noise. And the principal component analysis (PCA) is adopted to reconstruct the thermal images. The missed solder balls can be recognized explicitly in the second principal component image. Probabilistic neural network (PNN) is then established to identify the defective bump intelligently. The hot spots corresponding to the solder balls are segmented from the PCA reconstructed image, and statistic parameters are calculated. To characterize the thermal properties of solder bump quantitatively, three representative features are selected and used as the input vector in PNN clustering. The results show that the actual outputs and the expected outputs are consistent in identification of the missed solder balls, and all the bumps were recognized accurately, which demonstrates the viability of the PNN in effective defect inspection in high-density microelectronic packaging.

Principles and Application of Magnetic Rubber Testing for Crack Detection in High-Strength Steel Components: II. Residual-Field Inspection

DTIC Science & Technology

2014-12-01

and low Hmax. In this way, the flux density in the material for the specimen with intermediate k (k = 36.4) magnetised using Hmax = 250 Oe... aerospace components for surface-breaking fatigue cracks. In the residual-field variant of MRT, inspections are performed following the application...packages which can adequately predict the fields produced in practical residual-field MRT. Finally, central- conductor MRT, for which there are fewer

Digital 3D Microstructure Analysis of Concrete using X-Ray Micro Computed Tomography SkyScan 1173: A Preliminary Study

NASA Astrophysics Data System (ADS)

Latief, F. D. E.; Mohammad, I. H.; Rarasati, A. D.

2017-11-01

Digital imaging of a concrete sample using high resolution tomographic imaging by means of X-Ray Micro Computed Tomography (μ-CT) has been conducted to assess the characteristic of the sample’s structure. A standard procedure of image acquisition, reconstruction, image processing of the method using a particular scanning device i.e., the Bruker SkyScan 1173 High Energy Micro-CT are elaborated. A qualitative and a quantitative analysis were briefly performed on the sample to deliver some basic ideas of the capability of the system and the bundled software package. Calculation of total VOI volume, object volume, percent of object volume, total VOI surface, object surface, object surface/volume ratio, object surface density, structure thickness, structure separation, total porosity were conducted and analysed. This paper should serve as a brief description of how the device can produce the preferred image quality as well as the ability of the bundled software packages to help in performing qualitative and quantitative analysis.

Microscale synthesis and characterization of polystyrene: NSF-POLYED scholars project

NASA Technical Reports Server (NTRS)

Quaal, Karen S.; Wu, Chang-Ning

1994-01-01

Polystyrene is a familiar polymer with many commercial uses. Its applications range from the clear, high index of refraction, brittle plastic used to form audio cassette and CD cases to the foamed material used in insulated drink cups and packaging material. Polystyrene constitutes 11 percent of the plastics used in packaging with only High Density Polyethylene (HDPE) and Low Density Polyethylene (LDPE) contributing a larger share: so much polystyrene is used today, it is one of six common plastics that manufacturers have assigned an identification code. The code helps recycling efforts. Polystyrene's code is (PS code 6). During the summer and fall of 1992 several new polymeric experiments were developed by the NSF POLYED Scholars for introduction into the chemistry core curriculum. In this presentation, one such project will be discussed. This laboratory project is recommended for a first or second year laboratory course allowing the introduction of polymeric science to undergraduates at the earliest opportunity. The reliability of the experiments which make up this project and the recognition factor of polystyrene, a material we come in contact with everyday, makes the synthesis and characterization of polystyrene a good choice for the introduction of polymerization to undergraduates. This laboratory project appeals to the varied interests of students enrolled in the typical first year chemistry course and becomes an ideal way to introduce polymers to a wide variety of science and engineering students.

Design and Performance of a Miniature Radar L-Band Transceiver

NASA Technical Reports Server (NTRS)

McWatters, D.; Price, D.; Edelstein, W.

2004-01-01

Radar electronics developed for past JPL space missions historically had been custom designed and as such, given budgetary, time, and risk constraints, had not been optimized for maximum flexibility or miniaturization. To help reduce cost and risk of future radar missions, a generic radar module was conceived. The module includes a 1.25-GHz (L-band) transceiver and incorporates miniature high-density packaging of integrated circuits in die/chip form. The technology challenges include overcoming the effect of miniaturization and high packaging density to achieve the performance, reliability, and environmental ruggedness required for space missions. The module was chosen to have representative (generic) functionality most likely required from an L-band radar. For very large aperture phased-array spaceborne radar missions, the large dimensions of the array suggest the benefit of distributing the radar electronics into the antenna array. For such applications, this technology is essential in order to bring down the cost, mass, and power of the radar electronics module replicated in each panel of the array. For smaller sized arrays, a single module can be combined with the central radar controller and still provide the bene.ts of configuration .exibility, low power, and low mass. We present the design approach for the radar electronics module and the test results for its radio frequency (RF) portion: a miniature, low-power, radiation-hard L-band transceiver.

Inhibition of Listeria monocytogenes in Fresh Cheese Using Chitosan-Grafted Lactic Acid Packaging.

PubMed

Sandoval, Laura N; López, Monserrat; Montes-Díaz, Elizabeth; Espadín, Andres; Tecante, Alberto; Gimeno, Miquel; Shirai, Keiko

2016-04-08

A chitosan from biologically obtained chitin was successfully grafted with d,l-lactic acid (LA) in aqueous media using p-toluenesulfonic acid as catalyst to obtain a non-toxic, biodegradable packaging material that was characterized using scanning electron microscopy, water vapor permeability, and relative humidity (RH) losses. Additionally, the grafting in chitosan with LA produced films with improved mechanical properties. This material successfully extended the shelf life of fresh cheese and inhibited the growth of Listeria monocytogenes during 14 days at 4 °C and 22% RH, whereby inoculated samples with chitosan-g-LA packaging presented full bacterial inhibition. The results were compared to control samples and commercial low-density polyethylene packaging.

NASA's 3D Flight Computer for Space Applications

NASA Technical Reports Server (NTRS)

Alkalai, Leon

2000-01-01

The New Millennium Program (NMP) Integrated Product Development Team (IPDT) for Microelectronics Systems was planning to validate a newly developed 3D Flight Computer system on its first deep-space flight, DS1, launched in October 1998. This computer, developed in the 1995-97 time frame, contains many new computer technologies previously never used in deep-space systems. They include: advanced 3D packaging architecture for future low-mass and low-volume avionics systems; high-density 3D packaged chip-stacks for both volatile and non-volatile mass memory: 400 Mbytes of local DRAM memory, and 128 Mbytes of Flash memory; high-bandwidth Peripheral Component Interface (Per) local-bus with a bridge to VME; high-bandwidth (20 Mbps) fiber-optic serial bus; and other attributes, such as standard support for Design for Testability (DFT). Even though this computer system did not complete on time for delivery to the DS1 project, it was an important development along a technology roadmap towards highly integrated and highly miniaturized avionics systems for deep-space applications. This continued technology development is now being performed by NASA's Deep Space System Development Program (also known as X2000) and within JPL's Center for Integrated Space Microsystems (CISM).

Long-term lumen depreciation behavior and failure modes of multi-die array LEDs

NASA Astrophysics Data System (ADS)

Jayawardena, Asiri; Marcus, Daniel; Prugue, Ximena; Narendran, Nadarajah

2013-09-01

One of the main advantages of multi-die array light-emitting diodes (LEDs) is their high flux density. However, a challenge for using such a product in lighting fixture applications is the heat density and the need for thermal management to keep the junction temperatures of all the dies low for long-term reliable performance. Ten multi-die LED array samples for each product from four different manufacturers were subjected to lumen maintenance testing (as described in IES-LM-80-08), and their resulting lumen depreciation and failure modes were studied. The products were tested at the maximum case (or pin) temperature reported by the respective manufacturer by appropriately powering the LEDs. In addition, three samples for each product from two different manufacturers were subjected to rapid thermal cycling, and the resulting lumen depreciation and failure modes were studied. The results showed that the exponential lumen decay model using long-term lumen maintenance data as recommended in IES TM-21 does not fit for all package types. The failure of a string of dies and single die failure in a string were observed in some of the packages.

Packaging Technologies for 500C SiC Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2013-01-01

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

ELSA: An integrated, semi-automated nebular abundance package

NASA Astrophysics Data System (ADS)

Johnson, Matthew D.; Levitt, Jesse S.; Henry, Richard B. C.; Kwitter, Karen B.

We present ELSA, a new modular software package, written in C, to analyze and manage spectroscopic data from emission-line objects. In addition to calculating plasma diagnostics and abundances from nebular emission lines, the software provides a number of convenient features including the ability to ingest logs produced by IRAF's splot task, to semi-automatically merge spectra in different wavelength ranges, and to automatically generate various data tables in machine-readable or LaTeX format. ELSA features a highly sophisticated interstellar reddening correction scheme that takes into account temperature and density effects as well as He II contamination of the hydrogen Balmer lines. Abundance calculations are performed using a 5-level atom approximation with recent atomic data, based on R. Henry's ABUN program. Downloading and detailed documentation for all aspects of ELSA are available at the following URL:

Stored product mites (Acari: Astigmata) infesting food in various types of packaging.

PubMed

Hubert, Jan; Nesvorna, Marta; Volek, Vlado

2015-02-01

From 2008 to 2014, stored product mites have been reported from prepackaged dried food on the market in the Czech Republic. The infestation was by Carpoglyphus lactis (L.) in dried fruits and Tyrophagus putrescentiae (Schrank) in dog feed. The infestation is presumably caused by poor protection of the packages. We compared various packaging methods for their resistance to mites using dried apricots and dog feed in laboratory experiments. The trial packages included nine different plastic films, monofilm, duplex and triplex, and one type of plastic cup (ten replicates per packaging type). All packaging materials are available on the Czech market for dried food products. The samples of dried food were professionally packed in a factory and packaged dried apricots were exposed to C. lactis and dog food to T. putrescentiae. After 3 months of exposure, the infestation and mite density of the prepackaged food was assessed. Mites were found to infest six types of packages. Of the packaging types with mites, 1-5 samples were infested and the maximum abundance was 1,900 mites g(-1) of dried food. Mites entered the prepackaged food by faulty sealing. Inadequate sealing is suggested to be the major cause of the emerged infestation of dried food.

Role of DNA-DNA Interactions on the Structure and Thermodynamics of Bacteriophages Lambda and P4

PubMed Central

Petrov, Anton S.; Harvey, Stephen C.

2010-01-01

Electrostatic interactions play an important role in both packaging of DNA inside bacteriophages and its release into bacterial cells. While at physiological conditions DNA strands repel each other, the presence of polyvalent cations such as spermine and spermidine in solutions leads to the formation of DNA condensates. In this study, we discuss packaging of DNA into bacteriophages P4 and Lambda under repulsive and attractive conditions using a coarse-grained model of DNA and capsids. Packaging under repulsive conditions leads to the appearance of the coaxial spooling conformations; DNA occupies all available space inside the capsid. Under the attractive potential both packed systems reveal toroidal conformations, leaving the central part of the capsids empty. We also present a detailed thermodynamic analysis of packaging and show that the forces required to pack the genomes in the presence of polyamines are significantly lower than those observed under repulsive conditions. The analysis reveals that in both the repulsive and attractive regimes the entropic penalty of DNA confinement has a significant non-negligible contribution into the total energy of packaging. Additionally we report the results of simulations of DNA condensation inside partially packed Lambda. We found that at low densities DNA behaves as free unconfined polymer and condenses into the toroidal structures; at higher densities rearrangement of the genome into toroids becomes hindered, and condensation results in the formation of non-equilibrium structures. In all cases packaging in a specific conformation occurs as a result of interplay between bending stresses experienced by the confined polymer and interactions between the strands. PMID:21074621

Effectiveness of reactive case detection for malaria elimination in three archetypical transmission settings: a modelling study.

PubMed

Gerardin, Jaline; Bever, Caitlin A; Bridenbecker, Daniel; Hamainza, Busiku; Silumbe, Kafula; Miller, John M; Eisele, Thomas P; Eckhoff, Philip A; Wenger, Edward A

2017-06-12

Reactive case detection could be a powerful tool in malaria elimination, as it selectively targets transmission pockets. However, field operations have yet to demonstrate under which conditions, if any, reactive case detection is best poised to push a region to elimination. This study uses mathematical modelling to assess how baseline transmission intensity and local interconnectedness affect the impact of reactive activities in the context of other possible intervention packages. Communities in Southern Province, Zambia, where elimination operations are currently underway, were used as representatives of three archetypes of malaria transmission: low-transmission, high household density; high-transmission, low household density; and high-transmission, high household density. Transmission at the spatially-connected household level was simulated with a dynamical model of malaria transmission, and local variation in vectorial capacity and intervention coverage were parameterized according to data collected from the area. Various potential intervention packages were imposed on each of the archetypical settings and the resulting likelihoods of elimination by the end of 2020 were compared. Simulations predict that success of elimination campaigns in both low- and high-transmission areas is strongly dependent on stemming the flow of imported infections, underscoring the need for regional-scale strategies capable of reducing transmission concurrently across many connected areas. In historically low-transmission areas, treatment of clinical malaria should form the cornerstone of elimination operations, as most malaria infections in these areas are symptomatic and onward transmission would be mitigated through health system strengthening; reactive case detection has minimal impact in these settings. In historically high-transmission areas, vector control and case management are crucial for limiting outbreak size, and the asymptomatic reservoir must be addressed through reactive case detection or mass drug campaigns. Reactive case detection is recommended only for settings where transmission has recently been reduced rather than all low-transmission settings. This is demonstrated in a modelling framework with strong out-of-sample accuracy across a range of transmission settings while including methodologies for understanding the most resource-effective allocations of health workers. This approach generalizes to providing a platform for planning rational scale-up of health systems based on locally-optimized impact according to simplified stratification.

Present, future of automotive hybrid IC applications discussed

NASA Astrophysics Data System (ADS)

Matsuda, Nobuyoshi; Fukuoka, Atuhisa

1987-09-01

Hybrid ICs are presently utilized in various fields such as commercial televisions, VTRs, and audio devices, industrial usage of communication equipment, computers, terminals, and automobiles. Its applications and environments are various and diverse. The functions required for hybrid ICs vary from simple high density mounting for a system to the realization of high mechanisms with the application of function timing. The functions are properly used depending upon the system with its hybrid ICs and its circuit composition. Considering structure and reliability requirements for automotive hybrid ICs, an application example for hybrid ICs which use the package (COMPACT), will be discussed.

Three-dimensional magnetic bubble memory system

NASA Technical Reports Server (NTRS)

Stadler, Henry L. (Inventor); Katti, Romney R. (Inventor); Wu, Jiin-Chuan (Inventor)

1994-01-01

A compact memory uses magnetic bubble technology for providing data storage. A three-dimensional arrangement, in the form of stacks of magnetic bubble layers, is used to achieve high volumetric storage density. Output tracks are used within each layer to allow data to be accessed uniquely and unambiguously. Storage can be achieved using either current access or field access magnetic bubble technology. Optical sensing via the Faraday effect is used to detect data. Optical sensing facilitates the accessing of data from within the three-dimensional package and lends itself to parallel operation for supporting high data rates and vector and parallel processing.

Fabrication, testing and simulation of all solid state three dimensional Li-ion batteries

DOE PAGES

Talin, Albert Alec; Ruzmetov, Dmitry; Kolmakov, Andrei; ...

2016-11-10

Realization of safe, long cycle life and simple to package solid-state rechargeable batteries with high energy and power density has been a long-standing goal of the energy storage community. [1,2] Much of the research activity has been focused on developing new solid electrolytes with high Li ionic conductivity. In addition, LiPON, the only solid electrolyte currently used in commercial thin film solid state Li-ion batteris (SSLIBs), has a conductivity of ~10 -6 S/cm, compared to ~0.01 S/cm typically observed for liquid organic electrolytes [3].

The association of alcohol outlet density with illegal underage adolescent purchasing of alcohol.

PubMed

Rowland, Bosco; Toumbourou, John W; Livingston, Michael

2015-02-01

Although previous studies have suggested that greater community densities of alcohol sales outlets are associated with greater alcohol use and problems, the mechanisms are unclear. The present study examined whether density was associated with increased purchasing of alcohol by adolescents younger than the legal purchase age of 18 in Australia. The number of alcohol outlets per 10,000 population was identified within geographic regions in Victoria, Australia. A state-representative student survey (N = 10,143) identified adolescent reports of purchasing alcohol, and multilevel modeling was then used to predict the effects for different densities of outlet types (packaged, club, on-premise, general, and overall). Each extra sales outlet per 10,000 population was associated with a significant increase in the risk of underage adolescent purchasing. The strongest effect was for club density (odds ratio = 1.22) and packaged (takeaway) outlet density (odds ratio = 1.12). Males, older children, smokers, and those with substance-using friends were more likely to purchase alcohol. One mechanism by which alcohol sales outlet density may influence population rates of alcohol use and related problems is through increasing the illegal underage purchasing of alcohol. Copyright © 2015 Society for Adolescent Health and Medicine. Published by Elsevier Inc. All rights reserved.

High density circuit technology, part 3

NASA Technical Reports Server (NTRS)

Wade, T. E.

1982-01-01

Dry processing - both etching and deposition - and present/future trends in semiconductor technology are discussed. In addition to a description of the basic apparatus, terminology, advantages, glow discharge phenomena, gas-surface chemistries, and key operational parameters for both dry etching and plasma deposition processes, a comprehensive survey of dry processing equipment (via vendor listing) is also included. The following topics are also discussed: fine-line photolithography, low-temperature processing, packaging for dense VLSI die, the role of integrated optics, and VLSI and technology innovations.

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2010 CFR

2010-01-01

... Section 60.135 Energy NUCLEAR REGULATORY COMMISSION (CONTINUED) DISPOSAL OF HIGH-LEVEL RADIOACTIVE WASTES... for the waste package and its components. (a) High-level-waste package design in general. (1) Packages... package's permanent written records. (c) Waste form criteria for HLW. High-level radioactive waste that is...

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Blending of Low-Density Polyethylene and Poly-Lactic Acid with Maleic Anhydride as A Compatibilizer for Better Environmentally Food-Packaging Material

NASA Astrophysics Data System (ADS)

Setiawan, A. H.; Aulia, F.

2017-05-01

The common conventional food packaging materialsare using a thin layer plastic or film, which is made of a synthetic polymer, such as Low-Density Poly Ethylene (LDPE). However, the use of these polymers hasan adverse impact on the environment, because the synthetic polymersare difficult to degrade naturally. Poly-Lactic Acid (PLA) is a biodegradable polymer that can be substituted to synthetic polymers. Since LDPE and PLA have a difference in polarity, therefore the first step of research is to graft them with maleic anhydride (MAH) for increasing the properties of its miscibility. The interaction between them is confirmed by FTIR; whereas the environment issueis characterized by the water adsorption and biodegradability. The FTIR spectra indicated that there had been an interaction between LDPE and MAH and LDPE/LDPE-g-MAH/PLA blend. Increasing PLA content in the blend affected to the increasing in their water absorption and biodegradable. Poly-blend with 20% PLA content was the optimum composition for environmentally food packaging.

Lumber and panel products consumption for packaging and shipping in the United States, perspective for the 1980`s

Treesearch

D. B. McKeever; H. E. Dickerhoof

Trends in demand for lumber and panel products in packaging and materials handling are examined both for the past and the future. Effects of recent technological developments and innovations such as molded particleboard pallets, medium-density fiberboard pallets, and plywood pallets, are analyzed. Increased use of pallets is seen as the main reason for the expected...

Integrated packaging of multiple double sided cooling planar bond power modules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liang, Zhenxian

An integrated double sided cooled power module has one or multiple phase legs configuration including one or more planar power packages, each planar power package having an upper power switch unit and a lower power switch unit directly bonded and interconnected between two insulated power substrates, and further sandwiched between two heat exchangers via direct bonds. A segmented coolant manifold is interposed with the one or more planar power packages and creates a sealed enclosure that defines a coolant inlet, a coolant outlet and a coolant flow path between the inlet and the outlet. A coolant circulates along the flowmore » path to remove heat and increase the power density of the power module.« less

Lithium Sulfur Primary Battery with Super High Energy Density: Based on the Cauliflower-like Structured C/S Cathode

NASA Astrophysics Data System (ADS)

Ma, Yiwen; Zhang, Hongzhang; Wu, Baoshan; Wang, Meiri; Li, Xianfeng; Zhang, Huamin

2015-10-01

The lithium-sulfur primary batteries, as seldom reported in the previous literatures, were developed in this work. In order to maximize its practical energy density, a novel cauliflower-like hierarchical porous C/S cathode was designed, for facilitating the lithium-ions transport and sulfur accommodation. This kind of cathode could release about 1300 mAh g-1 (S) capacity at sulfur loading of 6 ~ 14 mg cm-2, and showed excellent shelf stability during a month test at room temperature. As a result, the assembled Li-S soft package battery achieved an energy density of 504 Wh kg-1 (654 Wh L-1), which was the highest value ever reported to the best of our knowledge. This work might arouse the interests on developing primary Li-S batteries, with great potential for practical application.

CheckDen, a program to compute quantum molecular properties on spatial grids.

PubMed

Pacios, Luis F; Fernandez, Alberto

2009-09-01

CheckDen, a program to compute quantum molecular properties on a variety of spatial grids is presented. The program reads as unique input wavefunction files written by standard quantum packages and calculates the electron density rho(r), promolecule and density difference function, gradient of rho(r), Laplacian of rho(r), information entropy, electrostatic potential, kinetic energy densities G(r) and K(r), electron localization function (ELF), and localized orbital locator (LOL) function. These properties can be calculated on a wide range of one-, two-, and three-dimensional grids that can be processed by widely used graphics programs to render high-resolution images. CheckDen offers also other options as extracting separate atom contributions to the property computed, converting grid output data into CUBE and OpenDX volumetric data formats, and perform arithmetic combinations with grid files in all the recognized formats.

Lithium Sulfur Primary Battery with Super High Energy Density: Based on the Cauliflower-like Structured C/S Cathode.

PubMed

Ma, Yiwen; Zhang, Hongzhang; Wu, Baoshan; Wang, Meiri; Li, Xianfeng; Zhang, Huamin

2015-10-12

The lithium-sulfur primary batteries, as seldom reported in the previous literatures, were developed in this work. In order to maximize its practical energy density, a novel cauliflower-like hierarchical porous C/S cathode was designed, for facilitating the lithium-ions transport and sulfur accommodation. This kind of cathode could release about 1300 mAh g(-1) (S) capacity at sulfur loading of 6 ~ 14 mg cm(-2), and showed excellent shelf stability during a month test at room temperature. As a result, the assembled Li-S soft package battery achieved an energy density of 504 Wh kg(-1) (654 Wh L(-1)), which was the highest value ever reported to the best of our knowledge. This work might arouse the interests on developing primary Li-S batteries, with great potential for practical application.

Lithium Sulfur Primary Battery with Super High Energy Density: Based on the Cauliflower-like Structured C/S Cathode

PubMed Central

Ma, Yiwen; Zhang, Hongzhang; Wu, Baoshan; Wang, Meiri; Li, Xianfeng; Zhang, Huamin

2015-01-01

The lithium-sulfur primary batteries, as seldom reported in the previous literatures, were developed in this work. In order to maximize its practical energy density, a novel cauliflower-like hierarchical porous C/S cathode was designed, for facilitating the lithium-ions transport and sulfur accommodation. This kind of cathode could release about 1300 mAh g−1 (S) capacity at sulfur loading of 6 ~ 14 mg cm−2, and showed excellent shelf stability during a month test at room temperature. As a result, the assembled Li-S soft package battery achieved an energy density of 504 Wh kg−1 (654 Wh L−1), which was the highest value ever reported to the best of our knowledge. This work might arouse the interests on developing primary Li-S batteries, with great potential for practical application. PMID:26456914

Design factors for a super high energy density Ni-MH battery for military uses

DOE Office of Scientific and Technical Information (OSTI.GOV)

Brown, J.T.; Klein, M.G.

1997-12-01

The nickel-metal hydride battery is a relatively new commercial product which meets the needs for a more environmentally friendly battery than either the lead-acid or nickel-cadmium couples. While the presently available product also provides significantly improved performance over these other batteries, it is believed possible to develop a new generation of Ni-MH batteries with perhaps 80% greater density by using improved hydrogen storage alloys with the capability to store up to 2% by weight hydrogen, improved nickel electrodes which can stably cycle with an electron transfer of greater than 1.5 per nickel atom, and utilizing improved new cell and batterymore » packaging designs which minimize inactive battery weight and volume. This could raise the energy density of today`s commercial product (55--70 Wh/kg) to greater than 120 Wh/kg.« less

Test report dot 7A type a liquid packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ketusky, E. T.; Brandjes, C.; Benoit, T. J.

This test report documents the performance of Savannah River National Laboratory’s (SRNL’s) U.S. Department of Transportation (DOT) Specification 7A; General Packaging, Type A shielded liquid shipping packaging and compliance with the regulatory requirements of Title 49 of the Code of Federal Regulations (CFR). The primary use of this packaging design is for the transport of radioactive liquids of up to 1.3 liters in an unshielded configuration and up to 113 mL of radioactive liquids in a shielded configuration, with no more than an A2 quantity in either configuration, over public highways and/or commercial aircraft. The contents are liquid radioactive materialsmore » sufficiently shielded and within the activity limits specified in173.435 or 173.433 for A2 (normal form) materials, as well as within the analyzed thermal heat limits. Any contents must be compatibly packaged and must be compatible with the packaging. The basic packaging design is based on the U.S. Department of Energy’s (DOE’s) Model 9979 Type A fissile shipping packaging designed and tested by SRNL. The shielded liquid configuration consists of the outer and inner drums of the 9979 package with additional low density polyethylene (LDPE) dunnage nesting a tungsten shielded cask assembly (WSCA) within the 30-gallon inner drum. The packaging model for the DOT Specification 7A, Type A liquids packaging is HVYTAL.« less

PAREMD: A parallel program for the evaluation of momentum space properties of atoms and molecules

NASA Astrophysics Data System (ADS)

Meena, Deep Raj; Gadre, Shridhar R.; Balanarayan, P.

2018-03-01

The present work describes a code for evaluating the electron momentum density (EMD), its moments and the associated Shannon information entropy for a multi-electron molecular system. The code works specifically for electronic wave functions obtained from traditional electronic structure packages such as GAMESS and GAUSSIAN. For the momentum space orbitals, the general expression for Gaussian basis sets in position space is analytically Fourier transformed to momentum space Gaussian basis functions. The molecular orbital coefficients of the wave function are taken as an input from the output file of the electronic structure calculation. The analytic expressions of EMD are evaluated over a fine grid and the accuracy of the code is verified by a normalization check and a numerical kinetic energy evaluation which is compared with the analytic kinetic energy given by the electronic structure package. Apart from electron momentum density, electron density in position space has also been integrated into this package. The program is written in C++ and is executed through a Shell script. It is also tuned for multicore machines with shared memory through OpenMP. The program has been tested for a variety of molecules and correlated methods such as CISD, Møller-Plesset second order (MP2) theory and density functional methods. For correlated methods, the PAREMD program uses natural spin orbitals as an input. The program has been benchmarked for a variety of Gaussian basis sets for different molecules showing a linear speedup on a parallel architecture.

Effectiveness of antimicrobial food packaging materials.

PubMed

Cooksey, K

2005-10-01

Antimicrobial additives have been used successfully for many years as direct food additives. The literature provides evidence that some of these additives may be effective as indirect food additives incorporated into food packaging materials. Antimicrobial food packaging is directed toward the reduction of surface contamination of processed, prepared foods such as sliced meats and Frankfurter sausages (hot dogs). The use of such packaging materials is not meant to be a substitute for good sanitation practices, but it should enhance the safety of food as an additional hurdle for the growth of pathogenic and/or spoilage microorganisms. Studies have focused on establishing methods for coating low-density polyethylene film or barrier films with methyl cellulose as a carrier for nisin. These films have significantly reduced the presence of Listeria monocytogenes in solutions and in vacuum packaged hot dogs. Other research has focused on the use of chitosan to inhibit L. monocytogenes and chlorine dioxide sachets for the reduction of Salmonella on modified atmosphere-packaged fresh chicken breasts. Overall, antimicrobial packaging shows promise as an effective method for the inhibition of certain bacteria in foods, but barriers to their commercial implementation continue to exist.

DNA Packaging in Bacteriophage: Is Twist Important?

PubMed Central

Spakowitz, Andrew James; Wang, Zhen-Gang

2005-01-01

We study the packaging of DNA into a bacteriophage capsid using computer simulation, specifically focusing on the potential impact of twist on the final packaged conformation. We perform two dynamic simulations of packaging a polymer chain into a spherical confinement: one where the chain end is rotated as it is fed, and one where the chain is fed without end rotation. The final packaged conformation exhibits distinct differences in these two cases: the packaged conformation from feeding with rotation exhibits a spool-like character that is consistent with experimental and previous theoretical work, whereas feeding without rotation results in a folded conformation inconsistent with a spool conformation. The chain segment density shows a layered structure, which is more pronounced for packaging with rotation. However, in both cases, the conformation is marked by frequent jumps of the polymer chain from layer to layer, potentially influencing the ability to disentangle during subsequent ejection. Ejection simulations with and without Brownian forces show that Brownian forces are necessary to achieve complete ejection of the polymer chain in the absence of external forces. PMID:15805174

DNA packaging in bacteriophage: is twist important?

PubMed

Spakowitz, Andrew James; Wang, Zhen-Gang

2005-06-01

We study the packaging of DNA into a bacteriophage capsid using computer simulation, specifically focusing on the potential impact of twist on the final packaged conformation. We perform two dynamic simulations of packaging a polymer chain into a spherical confinement: one where the chain end is rotated as it is fed, and one where the chain is fed without end rotation. The final packaged conformation exhibits distinct differences in these two cases: the packaged conformation from feeding with rotation exhibits a spool-like character that is consistent with experimental and previous theoretical work, whereas feeding without rotation results in a folded conformation inconsistent with a spool conformation. The chain segment density shows a layered structure, which is more pronounced for packaging with rotation. However, in both cases, the conformation is marked by frequent jumps of the polymer chain from layer to layer, potentially influencing the ability to disentangle during subsequent ejection. Ejection simulations with and without Brownian forces show that Brownian forces are necessary to achieve complete ejection of the polymer chain in the absence of external forces.

Band Gap Tuning in 2D Layered Materials by Angular Rotation.

PubMed

Polanco-Gonzalez, Javier; Carranco-Rodríguez, Jesús Alfredo; Enríquez-Carrejo, José L; Mani-Gonzalez, Pierre G; Domínguez-Esquivel, José Manuel; Ramos, Manuel

2017-02-08

We present a series of computer-assisted high-resolution transmission electron (HRTEM) simulations to determine Moiré patters by induced twisting effects between slabs at rotational angles of 3°, 5°, 8°, and 16°, for molybdenum disulfide, graphene, tungsten disulfide, and tungsten selenide layered materials. In order to investigate the electronic structure, a series of numerical simulations using density functional methods (DFT) methods was completed using Cambridge serial total energy package (CASTEP) with a generalized gradient approximation to determine both the band structure and density of states on honeycomb-like new superlattices. Our results indicated metallic transitions when the rotation approached 8° with respect to each other laminates for most of the two-dimensional systems that were analyzed.

Band Gap Tuning in 2D Layered Materials by Angular Rotation

PubMed Central

Polanco-Gonzalez, Javier; Carranco-Rodríguez, Jesús Alfredo; Enríquez-Carrejo, José L.; Mani-Gonzalez, Pierre G.; Domínguez-Esquivel, José Manuel; Ramos, Manuel

2017-01-01

We present a series of computer-assisted high-resolution transmission electron (HRTEM) simulations to determine Moiré patters by induced twisting effects between slabs at rotational angles of 3°, 5°, 8°, and 16°, for molybdenum disulfide, graphene, tungsten disulfide, and tungsten selenide layered materials. In order to investigate the electronic structure, a series of numerical simulations using density functional methods (DFT) methods was completed using Cambridge serial total energy package (CASTEP) with a generalized gradient approximation to determine both the band structure and density of states on honeycomb-like new superlattices. Our results indicated metallic transitions when the rotation approached 8° with respect to each other laminates for most of the two-dimensional systems that were analyzed. PMID:28772507

Semi-automated Anatomical Labeling and Inter-subject Warping of High-Density Intracranial Recording Electrodes in Electrocorticography.

PubMed

Hamilton, Liberty S; Chang, David L; Lee, Morgan B; Chang, Edward F

2017-01-01

In this article, we introduce img_pipe, our open source python package for preprocessing of imaging data for use in intracranial electrocorticography (ECoG) and intracranial stereo-EEG analyses. The process of electrode localization, labeling, and warping for use in ECoG currently varies widely across laboratories, and it is usually performed with custom, lab-specific code. This python package aims to provide a standardized interface for these procedures, as well as code to plot and display results on 3D cortical surface meshes. It gives the user an easy interface to create anatomically labeled electrodes that can also be warped to an atlas brain, starting with only a preoperative T1 MRI scan and a postoperative CT scan. We describe the full capabilities of our imaging pipeline and present a step-by-step protocol for users.

Broadband and scalable optical coupling for silicon photonics using polymer waveguides

NASA Astrophysics Data System (ADS)

La Porta, Antonio; Weiss, Jonas; Dangel, Roger; Jubin, Daniel; Meier, Norbert; Horst, Folkert; Offrein, Bert Jan

2018-04-01

We present optical coupling schemes for silicon integrated photonics circuits that account for the challenges in large-scale data processing systems such as those used for emerging big data workloads. Our waveguide based approach allows to optimally exploit the on-chip optical feature size, and chip- and package real-estate. It further scales well to high numbers of channels and is compatible with state-of-the-art flip-chip die packaging. We demonstrate silicon waveguide to polymer waveguide coupling losses below 1.5 dB for both the O- and C-bands with a polarisation dependent loss of <1 dB. Over 100 optical silicon waveguide to polymer waveguide interfaces were assembled within a single alignment step, resulting in a physical I/O channel density of up to 13 waveguides per millimetre along the chip-edge, with an average coupling loss of below 3.4 dB measured at 1310 nm.

Semi-automated Anatomical Labeling and Inter-subject Warping of High-Density Intracranial Recording Electrodes in Electrocorticography

PubMed Central

Hamilton, Liberty S.; Chang, David L.; Lee, Morgan B.; Chang, Edward F.

2017-01-01

In this article, we introduce img_pipe, our open source python package for preprocessing of imaging data for use in intracranial electrocorticography (ECoG) and intracranial stereo-EEG analyses. The process of electrode localization, labeling, and warping for use in ECoG currently varies widely across laboratories, and it is usually performed with custom, lab-specific code. This python package aims to provide a standardized interface for these procedures, as well as code to plot and display results on 3D cortical surface meshes. It gives the user an easy interface to create anatomically labeled electrodes that can also be warped to an atlas brain, starting with only a preoperative T1 MRI scan and a postoperative CT scan. We describe the full capabilities of our imaging pipeline and present a step-by-step protocol for users. PMID:29163118

Effectiveness of some recent antimicrobial packaging concepts.

PubMed

Vermeiren, L; Devlieghere, F; Debevere, J

2002-01-01

A new type of active packaging is the combination of food-packaging materials with antimicrobial substances to control microbial surface contamination of foods. For both migrating and non-migrating antimicrobial materials, intensive contact between the food product and packaging material is required and therefore potential food applications include especially vacuum or skin-packaged products, e.g. vacuum-packaged meat, fish, poultry or cheese. Several antimicrobial compounds have been combined with different types of carriers (plastic and rubber articles, paper-based materials, textile fibrils and food-packaging materials). Until now, however, few antimicrobial concepts have found applications as a food-packaging material. Antimicrobial packaging materials cannot legally be used in the EU at the moment. The potential use would require amendments of several different legal texts involving areas such as food additives, food packaging, hygiene, etc. The main objective of this paper is to provide a state of the art about the different types of antimicrobial concepts, their experimental development and commercialization, and to present a case study summarizing the results of investigations on the feasibility of a low-density polyethylene (LDPE)-film containing triclosan to inhibit microbial growth on food surfaces and consequently prolong shelf-life or improve microbial food safety. In contrast with the strong antimicrobial effect in in-vitro simulated vacuum-packaged conditions against the psychrotrophic food pathogen L. monocytogenes, the 1000 mg kg(-1) containing triclosan film did not effectively reduce spoilage bacteria and growth of L. monocytogenes on refrigerated vacuum-packaged chicken breasts stored at 7 degrees C.

Layer by layer assembly of a biocatalytic packaging film: lactase covalently bound to low-density polyethylene.

PubMed

Wong, Dana E; Talbert, Joey N; Goddard, Julie M

2013-06-01

Active packaging is utilized to overcome limitations of traditional processing to enhance the health, safety, economics, and shelf life of foods. Active packaging employs active components to interact with food constituents to give a desired effect. Herein we describe the development of an active package in which lactase is covalently attached to low-density polyethylene (LDPE) for in-package production of lactose-free dairy products. The specific goal of this work is to increase the total protein content loading onto LDPE using layer by layer (LbL) deposition, alternating polyethylenimine, glutaraldehyde (GL), and lactase, to enhance the overall activity of covalently attached lactase. The films were successfully oxidized via ultraviolet light, functionalized with polyethylenimine and glutaraldehyde, and layered with immobilized purified lactase. The total protein content increased with each additional layer of conjugated lactase, the 5-layer sample reaching up to 1.3 μg/cm2 . However, the increase in total protein did not lend to an increase in overall lactase activity. Calculated apparent Km indicated the affinity of immobilized lactase to substrate remains unchanged when compared to free lactase. Calculated apparent turnover numbers (kcat ) showed with each layer of attached lactase, a decrease in substrate turnover was experienced when compared to free lactase; with a decrease from 128.43 to 4.76 s(-1) for a 5-layer conjugation. Our results indicate that while LbL attachment of lactase to LDPE successfully increases total protein mass of the bulk material, the adverse impact in enzyme efficiency may limit the application of LbL immobilization chemistry for bioactive packaging use. © 2013 Institute of Food Technologists®

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wilke, Rudeger H. T.; Baker, Amanda; Brown-Shaklee, Harlan

Here, alkali-free glasses, which exhibit high energy storage densities (~35 J/cc), present a unique opportunity to couple high temperature stability with high breakdown strength, and thus provide an avenue for capacitor applications with stringent temperature and power requirements. Realizing the potential of these materials in kilovolt class capacitors with >1 J/cc recoverable energy density requires novel packaging strategies that incorporate these extremely fragile dielectrics. In this paper, we demonstrate the feasibility of fabricating wound capacitors using 50-μm-thick glass. Two capacitors were fabricated from 2.8-m-long ribbons of thin (50 μm) glass wound into 125-140-mm-diameter spools. The capacitors exhibit a capacitance ofmore » 70-75 nF with loss tangents below 1%. The wound capacitors can operate up to 1 kV and show excellent temperature stability to 150 °C. By improving the end terminations, the self-resonance can be shifted to above 1 MHz, indicating that these materials may be useful for pulsed power applications with microsecond discharge times.« less

Development and quality evaluation of quick cooking dhal-A convenience product.

PubMed

Sethi, Shruti; Samuel, D V K; Khan, Islam

2014-03-01

Owing to rapid urbanization and more women joining the workforce, use of ready-to-eat and ready-to-use convenience foods is gaining increasing popularity. Women require dhal that cooks fast and increases in volume when cooked. In an attempt to prepare quick cooking dhal from pigeon pea, variety UPAS 120 was milled, pre-treated with sodium chloride solution (1%), flaked and dried. The quick cooking dhal was packed in three packaging materials, namely, high molecular weight high density polyethylene (HMHDPE), high density polyethylene (HDPE) and laminated pouches. The quality evaluation of the prepared flakes with respect to the cooking quality attributes, changes in proximate composition, free fatty acid (FFA) and peroxide value (PV) were carried out during storage at ambient temperature (8-36°C) at regular intervals for a period of 10 months. During storage, quick cooking dhal packed in laminated pouches performed better than samples stored in other pouches with respect to the changes in the overall quality and acceptability of the product.

Wearable woven supercapacitor fabrics with high energy density and load-bearing capability.

PubMed

Shen, Caiwei; Xie, Yingxi; Zhu, Bingquan; Sanghadasa, Mohan; Tang, Yong; Lin, Liwei

2017-10-30

Flexible power sources with load bearing capability are attractive for modern wearable electronics. Here, free-standing supercapacitor fabrics that can store high electrical energy and sustain large mechanical loads are directly woven to be compatible with flexible systems. The prototype with reduced package weight/volume provides an impressive energy density of 2.58 mWh g -1 or 3.6 mWh cm -3 , high tensile strength of over 1000 MPa, and bearable pressure of over 100 MPa. The nanoporous thread electrodes are prepared by the activation of commercial carbon fibers to have three-orders of magnitude increase in the specific surface area and 86% retention of the original strength. The novel device configuration woven by solid electrolyte-coated threads shows excellent flexibility and stability during repeated mechanical bending tests. A supercapacitor watchstrap is used to power a liquid crystal display as an example of load-bearing power sources with various form-factor designs for wearable electronics.

Dependence of high density nitrogen-vacancy center ensemble coherence on electron irradiation doses and annealing time

NASA Astrophysics Data System (ADS)

Zhang, C.; Yuan, H.; Zhang, N.; Xu, L. X.; Li, B.; Cheng, G. D.; Wang, Y.; Gui, Q.; Fang, J. C.

2017-12-01

Negatively charged nitrogen-vacancy (NV-) center ensembles in diamond have proved to have great potential for use in highly sensitive, small-package solid-state quantum sensors. One way to improve sensitivity is to produce a high-density NV- center ensemble on a large scale with a long coherence lifetime. In this work, the NV- center ensemble is prepared in type-Ib diamond using high energy electron irradiation and annealing, and the transverse relaxation time of the ensemble—T 2—was systematically investigated as a function of the irradiation electron dose and annealing time. Dynamical decoupling sequences were used to characterize T 2. To overcome the problem of low signal-to-noise ratio in T 2 measurement, a coupled strip lines waveguide was used to synchronously manipulate NV- centers along three directions to improve fluorescence signal contrast. Finally, NV- center ensembles with a high concentration of roughly 1015 mm-3 were manipulated within a ~10 µs coherence time. By applying a multi-coupled strip-lines waveguide to improve the effective volume of the diamond, a sub-femtotesla sensitivity for AC field magnetometry can be achieved. The long-coherence high-density large-scale NV- center ensemble in diamond means that types of room-temperature micro-sized solid-state quantum sensors with ultra-high sensitivity can be further developed in the near future.

DensToolKit: A comprehensive open-source package for analyzing the electron density and its derivative scalar and vector fields

NASA Astrophysics Data System (ADS)

Solano-Altamirano, J. M.; Hernández-Pérez, Julio M.

2015-11-01

DensToolKit is a suite of cross-platform, optionally parallelized, programs for analyzing the molecular electron density (ρ) and several fields derived from it. Scalar and vector fields, such as the gradient of the electron density (∇ρ), electron localization function (ELF) and its gradient, localized orbital locator (LOL), region of slow electrons (RoSE), reduced density gradient, localized electrons detector (LED), information entropy, molecular electrostatic potential, kinetic energy densities K and G, among others, can be evaluated on zero, one, two, and three dimensional grids. The suite includes a program for searching critical points and bond paths of the electron density, under the framework of Quantum Theory of Atoms in Molecules. DensToolKit also evaluates the momentum space electron density on spatial grids, and the reduced density matrix of order one along lines joining two arbitrary atoms of a molecule. The source code is distributed under the GNU-GPLv3 license, and we release the code with the intent of establishing an open-source collaborative project. The style of DensToolKit's code follows some of the guidelines of an object-oriented program. This allows us to supply the user with a simple manner for easily implement new scalar or vector fields, provided they are derived from any of the fields already implemented in the code. In this paper, we present some of the most salient features of the programs contained in the suite, some examples of how to run them, and the mathematical definitions of the implemented fields along with hints of how we optimized their evaluation. We benchmarked our suite against both a freely-available program and a commercial package. Speed-ups of ˜2×, and up to 12× were obtained using a non-parallel compilation of DensToolKit for the evaluation of fields. DensToolKit takes similar times for finding critical points, compared to a commercial package. Finally, we present some perspectives for the future development and growth of the suite.

Diamond-based heat spreaders for power electronic packaging applications

NASA Astrophysics Data System (ADS)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging potential of the two heat-spreading solutions invoked was evaluated. This study was carried out within the framework of a French-American collaboration between the Electrical Engineering department of the University of Nebraska-Lincoln (United States, U.S.) and the Institute of Condensed Matter Chemistry of the University of Bordeaux (France). This study was financed by the Office of Naval Research in the U.S., and by the Region Aquitaine in France.

Preparation and Application of LDPE/ZnO Nanocomposites for Extending Shelf Life of Fresh Strawberries

PubMed Central

Mohammadizadeh, Mehri

2015-01-01

Summary Strawberries have a very short post-harvest life mostly due to their relatively high water content, intense metabolic activity and susceptibility to microbial rot. Antimicrobial low-density polyethylene nanocomposite films containing ZnO nanoparticles at different mass fractions were prepared by melt mixing and followed by compression moulding using a hot press machine. Fresh strawberries were packed in nanocomposite films and stored at 4 °C. Their microbial stability, ascorbic acid content and titratable acidity were evaluated after 0, 4, 8, 12 and 16 days of storage. Microbial growth rate was significantly reduced up to 16 days as a result of the use of nanocomposite packaging material containing ZnO nanoparticles. By increasing the ZnO nanoparticle mass fraction to 5%, the antimicrobial activity of the film increased. All packages containing the ZnO nanoparticles kept the microbial load of fresh strawberries below the level that affects shelf life (5 log CFU/g) up to 16 days. The lowest degradation of ascorbic acid content (6.55 mg per 100 g), and loss of acidity (0.68%) were observed in packages containing 3% of ZnO nanoparticles with 10% polyethylene-grafted maleic anhydride. PMID:27904384

Preparation and Application of LDPE/ZnO Nanocomposites for Extending Shelf Life of Fresh Strawberries.

PubMed

Emamifar, Aryou; Mohammadizadeh, Mehri

2015-12-01

Strawberries have a very short post-harvest life mostly due to their relatively high water content, intense metabolic activity and susceptibility to microbial rot. Antimicrobial low-density polyethylene nanocomposite films containing ZnO nanoparticles at different mass fractions were prepared by melt mixing and followed by compression moulding using a hot press machine. Fresh strawberries were packed in nanocomposite films and stored at 4 °C. Their microbial stability, ascorbic acid content and titratable acidity were evaluated after 0, 4, 8, 12 and 16 days of storage. Microbial growth rate was significantly reduced up to 16 days as a result of the use of nanocomposite packaging material containing ZnO nanoparticles. By increasing the ZnO nanoparticle mass fraction to 5%, the antimicrobial activity of the film increased. All packages containing the ZnO nanoparticles kept the microbial load of fresh strawberries below the level that affects shelf life (5 log CFU/g) up to 16 days. The lowest degradation of ascorbic acid content (6.55 mg per 100 g), and loss of acidity (0.68%) were observed in packages containing 3% of ZnO nanoparticles with 10% polyethylene-grafted maleic anhydride.

Novel Power Electronics Three-Dimensional Heat Exchanger: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bennion, K.; Cousineau, J.; Lustbader, J.

2014-08-01

Electric drive systems for vehicle propulsion enable technologies critical to meeting challenges for energy, environmental, and economic security. Enabling cost-effective electric drive systems requires reductions in inverter power semiconductor area. As critical components of the electric drive system are made smaller, heat removal becomes an increasing challenge. In this paper, we demonstrate an integrated approach to the design of thermal management systems for power semiconductors that matches the passive thermal resistance of the packaging with the active convective cooling performance of the heat exchanger. The heat exchanger concept builds on existing semiconductor thermal management improvements described in literature and patents,more » which include improved bonded interface materials, direct cooling of the semiconductor packages, and double-sided cooling. The key difference in the described concept is the achievement of high heat transfer performance with less aggressive cooling techniques by optimizing the passive and active heat transfer paths. An extruded aluminum design was selected because of its lower tooling cost, higher performance, and scalability in comparison to cast aluminum. Results demonstrated a heat flux improvement of a factor of two, and a package heat density improvement over 30%, which achieved the thermal performance targets.« less

More Efficient Power Conversion for EVs: Gallium-Nitride Advanced Power Semiconductor and Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

None

2010-02-01

Broad Funding Opportunity Announcement Project: Delphi is developing power converters that are smaller and more energy efficient, reliable, and cost-effective than current power converters. Power converters rely on power transistors which act like a very precisely controlled on-off switch, controlling the electrical energy flowing through an electrical circuit. Most power transistors today use silicon (Si) semiconductors. However, Delphi is using semiconductors made with a thin layer of gallium-nitride (GaN) applied on top of the more conventional Si material. The GaN layer increases the energy efficiency of the power transistor and also enables the transistor to operate at much higher temperatures,more » voltages, and power-density levels compared to its Si counterpart. Delphi is packaging these high-performance GaN semiconductors with advanced electrical connections and a cooling system that extracts waste heat from both sides of the device to further increase the device’s efficiency and allow more electrical current to flow through it. When combined with other electronic components on a circuit board, Delphi’s GaN power transistor package will help improve the overall performance and cost-effectiveness of HEVs and EVs.« less

Community Seismic Network (CSN)

NASA Astrophysics Data System (ADS)

Clayton, R. W.; Kohler, M. D.; Heaton, T. H.; Massari, A.; Guy, R.; Bunn, J.; Chandy, M.

2015-12-01

The CSN now has approximately 600 stations in the northern Los Angeles region. The sensors are class-C MEMs accelerometers that are packaged with backup power and data memory and are connected to a cloud-based processing system through the Internet. Most of the sensors are located in an xy-spatial network with an average minimum station spacing of 800 m. This density allows the lateral variations in ground motion to be determined, which will lead to detailed microzonation maps of the region. Approximately 100 of the sensors are located on campuses of the Los Angeles Unified School District (LAUSD), and this is part of a plan to provide schools with critical earthquake information immediately following an earthquake using the ShakeCast system. The software system in the sensors is being upgraded to allow on site measurements of PGA and PVA to be sent directly to the ShakeMap and earthquake early warning systems. More than 160 of the sensor packages are located on multiple floors of buildings with typically one or two 3-component sensors per floor. With these data we can identify traveling waves in the building, as well as determine the eigenfrequencies and mode shapes. By monitoring these quantities with high spatial density before, during, and after a major shaking event, we hope to determine the state of health of the structure.

Experimental and computational studies on the DNA translocation mechanism of the T4 viral packaging motor

NASA Astrophysics Data System (ADS)

Migliori, Amy; Arya, Gaurav; Smith, Douglas E.

2012-10-01

Bacteriophage T4 is a double stranded DNA virus that infects E.coli by injecting the viral genome through the cellular wall of a host cell. The T4 genome must be ejected from the viral capsid with sufficient force to ensure infection. To generate high ejection forces, the genome is packaged to high density within the viral capsid. A DNA translocation motor, in which the protein gp17 hydrolyzes ATP and binds to the DNA, is responsible for translocating the genome into the capsid during viral maturation of T4. This motor generates forces in excess of 60 pN and packages DNA at rates exceeding 2000 base pairs/second (bp/s)1. Understanding these small yet powerful motors is important, as they have many potential applications. Though much is known about the activity of these motors from bulk and single molecule biophysical techniques, little is known about their detailed molecular mechanism. Recently, two structures of gp17 have been obtained: a high-resolution X-ray crystallographic structure showing a monomeric compacted form of the enzyme, and a cryo-electron microscopic structure of the extended form of gp17 in complex with actively packaging prohead complexes. Comparison of these two structures indicates several key differences, and a model has been proposed to explain the translocation action of the motor2. Key to this model are a set of residues forming ion pairs across two domains of the gp17 molecule that are proposed to be involved in force generation by causing the collapse of the extended form of gp17. Using a dual optical trap to measure the rates of DNA packaging and the generated forces, we present preliminary mutational data showing that these several of these ion pairs are important to motor function. We have also performed preliminary free energy calculations on the extended and collapsed state of gp17, to confirm that these interdomain ion pairs have large contributions to the change in free energy that occurs upon the collapse of gp17 during the proposed ratcheting mechanism.

Reversible rigid coupling apparatus and method for borehole seismic transducers

DOEpatents

Owen, Thomas E.; Parra, Jorge O.

1992-01-01

An apparatus and method of high resolution reverse vertical seismic profile (VSP) measurements is shown. By encapsulating the seismic detector and heaters in a meltable substance (such as wax), the seismic detector can be removably secured in a borehole in a manner capable of measuring high resolution signals in the 100 to 1000 hertz range and higher. The meltable substance is selected to match the overall density of the detector package with the underground formation, yet still have relatively low melting point and rigid enough to transmit vibrations to accelerometers in the seismic detector. To minimize voids in the meltable substance upon solidification, the meltable substance is selected for minimum shrinkage, yet still having the other desirable characteristics. Heaters are arranged in the meltable substance in such a manner to allow the lowermost portion of the meltable substance to cool and solidify first. Solidification continues upwards from bottom-to-top until the top of the meltable substance is solidified and the seismic detector is ready for use. To remove, the heaters melt the meltable substance and the detector package is pulled from the borehole.

Defect printability for high-exposure dose advanced packaging applications

NASA Astrophysics Data System (ADS)

Mikles, Max; Flack, Warren; Nguyen, Ha-Ai; Schurz, Dan

2003-12-01

Pellicles are used in semiconductor lithography to minimize printable defects and reduce reticle cleaning frequency. However, there are a growing number of microlithography applications, such as advanced packaging and nanotechnology, where it is not clear that pellicles always offer a significant benefit. These applications have relatively large critical dimensions and require ultra thick photoresists with extremely high exposure doses. Given that the lithography is performed in Class 100 cleanroom conditions, it is possible that the risk of defects from contamination is sufficiently low that pellicles would not be required on certain process layer reticles. The elimination of the pellicle requirement would provide a cost reduction by saving the original pellicle cost and eliminating future pellicle replacement and repair costs. This study examines the imaging potential of defects with reticle patterns and processes typical for gold-bump and solder-bump advanced packaging lithography. The test reticle consists of 30 to 90 μm octagonal contact patterns representative of advanced packaging reticles. Programmed defects are added that represent the range of particle sizes (3 to 30 μm) normally protected by the pellicle and that are typical of advanced packaging lithography cleanrooms. The reticle is exposed using an Ultratech Saturn Spectrum 300e2 1X stepper on wafers coated with a variety of ultra thick (30 to 100 μm) positive and negative-acting photoresists commonly used in advanced packaging. The experimental results show that in many cases smaller particles continue to be yield issues for the feature size and density typical of advanced packaging processes. For the two negative photoresists studied it appears that a pellicle is not required for protection from defects smaller than 10 to 15 μm depending on the photoresist thickness. Thus the decision on pellicle usage for these materials would need to be made based on the device fabrication process and the cleanliness of a fabrication facility. For the two positive photoresists studied it appears that a pellicle is required to protect from defects down to 3 μm defects depending on the photoresist thickness. This suggests that a pellicle should always be used for these materials. Since a typical fabrication facility would use both positive and negative photoresists it may be advantageous to use pellicles on all reticles simply to avoid confusion. The cost savings of not using a pellicle could easily be outweighed by the yield benefits of using one.

High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology

NASA Astrophysics Data System (ADS)

Yu, Dongshan; Liang, Xuejie; Wang, Jingwei; Li, Xiaoning; Nie, Zhiqiang; Liu, Xingsheng

2017-02-01

A novel marco channel cooler (MaCC) has been developed for packaging high power diode vertical stacked (HPDL) lasers, which eliminates many of the issues in commercially-available copper micro-channel coolers (MCC). The MaCC coolers, which do not require deionized water as coolant, were carefully designed for compact size and superior thermal dissipation capability. Indium-free packaging technology was adopted throughout product design and fabrication process to minimize the risk of solder electromigration and thermal fatigue at high current density and long pulse width under QCW operation. Single MaCC unit with peak output power of up to 700W/bar at pulse width in microsecond range and 200W/bar at pulse width in millisecond range has been recorded. Characteristic comparison on thermal resistivity, spectrum, near filed and lifetime have been conducted between a MaCC product and its counterpart MCC product. QCW lifetime test (30ms 10Hz, 30% duty cycle) has also been conducted with distilled water as coolant. A vertical 40-MaCC stack product has been fabricated, total output power of 9 kilowatts has been recorded under QCW mode (3ms, 30Hz, 9% duty cycle).

Compositions and Methods for Inhibiting Gene Expressions

NASA Technical Reports Server (NTRS)

Williams, Loren D. (Inventor); Hsiao, Chiaolong (Inventor); Fang, Po-Yu (Inventor); Williams, Justin (Inventor)

2018-01-01

A combined packing and assembly method that efficiently packs ribonucleic acid (RNA) into virus like particles (VLPs) has been developed. The VLPs can spontaneously assemble and load RNA in vivo, efficiently packaging specifically designed RNAs at high densities and with high purity. In some embodiments the RNA is capable of interference activity, or is a precursor of a RNA capable of causing interference activity. Compositions and methods for the efficient expression, production and purification of VLP-RNAs are provided. VLP-RNAs can be used for the storage of RNA for long periods, and provide the ability to deliver RNA in stable form that is readily taken up by cells.

Short communication: Effect of active food packaging materials on fluid milk quality and shelf life.

PubMed

Wong, Dana E; Goddard, Julie M

2014-01-01

Active packaging, in which active agents are embedded into or on the surface of food packaging materials, can enhance the nutritive value, economics, and stability of food, as well as enable in-package processing. In one embodiment of active food packaging, lactase was covalently immobilized onto packaging films for in-package lactose hydrolysis. In prior work, lactase was covalently bound to low-density polyethylene using polyethyleneimine and glutaraldehyde cross-linkers to form the packaging film. Because of the potential contaminants of proteases, lipases, and spoilage organisms in typical enzyme preparations, the goal of the current work was to determine the effect of immobilized-lactase active packaging technology on unanticipated side effects, such as shortened shelf-life and reduced product quality. Results suggested no evidence of lipase or protease activity on the active packaging films, indicating that such active packaging films could enable in-package lactose hydrolysis without adversely affecting product quality in terms of dairy protein or lipid stability. Storage stability studies indicated that lactase did not migrate from the film over a 49-d period, and that dry storage resulted in 13.41% retained activity, whereas wet storage conditions enabled retention of 62.52% activity. Results of a standard plate count indicated that the film modification reagents introduced minor microbial contamination; however, the microbial population remained under the 20,000 cfu/mL limit through the manufacturer's suggested 14-d storage period for all film samples. This suggests that commercially produced immobilized lactase active packaging should use purified cross-linkers and enzymes. Characterization of unanticipated effects of active packaging on food quality reported here is important in demonstrating the commercial potential of such technologies. Copyright © 2014 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

Packaging - Materials review

NASA Astrophysics Data System (ADS)

Herrmann, Matthias

2014-06-01

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in many shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.

Extended shelf life of soy bread using modified atmosphere packaging.

PubMed

Fernandez, Ursula; Vodovotz, Yael; Courtney, Polly; Pascall, Melvin A

2006-03-01

This study investigated the use of modified atmosphere packaging (MAP) to extend the shelf life of soy bread with and without calcium propionate as a chemical preservative. The bread samples were packaged in pouches made from low-density polyethylene (LDPE) as the control (film 1), high-barrier laminated linear low-density polyethylene (LLDPE)-nylon-ethylene vinyl alcohol-nylon-LLDPE (film 2), and medium-barrier laminated LLDPE-nylon-LLDPE (film 3). The headspace gases used were atmosphere (air) as control, 50% CO2-50% N2, or 20% CO2-80% N2. The shelf life was determined by monitoring mold and yeast (M+Y) and aerobic plate counts (APC) in soy bread samples stored at 21 degrees C +/- 3 degrees C and 38% +/- 2% relative humidity. At 0, 2, 4, 6, 8, 10, and 12 days of storage, soy bread samples were removed, and the M+Y and APC were determined. The preservative, the films, and the headspace gases had significant effects on both the M+Y counts and the APC of soy bread samples. The combination of film 2 in the 50% CO2-50% N2 or 20% CO2-80% N2 headspace gases without calcium propionate as the preservative inhibited the M+Y growth by 6 days and the APC by 4 days. It was thus concluded that MAP using film 2 with either the 50% CO2-50% N2 or 20% CO2-80% N2 was the best combination for shelf-life extension of the soy bread without the need for a chemical preservative. These MAP treatments extended the shelf life by at least 200%.

Abdominal X-ray signs of intra-intestinal drug smuggling.

PubMed

Niewiarowski, Sylwia; Gogbashian, Andrew; Afaq, Asim; Kantor, Robin; Win, Zarni

2010-05-01

"Body packers" either swallow or insert drug filled packets rectally or vaginally in order to smuggle illicit drugs. AXR is used routinely to screen suspects for the presence of intra-intestinal drug packages. AXR diagnosis can be difficult as stool or gas within the intestine may resemble ingested foreign bodies. We identify the frequency and co-existence of several signs; tic-tac sign, rosette sign, double condom sign, dense surrounding material, density and discover a new sign; parallelism, which will aid in increasing the radiological accuracy. We retrospectively reviewed 285 AXRs performed for suspicion of drug smuggling during the period of March 2006-March 2009 to identify the frequency of these signs. Of the 285 AXRs performed 59 were positive, 221 negative and five were indeterminate. The tic-tac sign was present in 93%, double condom sign in 73%, dense surrounding wrapping material in 36% and parallelism in 27%. Sixty one percentage of drug packages were iso-dense to faeces and 39% hyperdense. Twenty percentage of the positive abdominal radiographs demonstrated one of the radiographic signs, 39% demonstrated two signs, 32% demonstrated three and 7% four. The most common radiographic sign combination was the tic-tac sign with either dense surrounding material or double condom sign. The most commonly encountered radiographic sign is the tic-tac sign, followed by the double condom sign and dense surrounding material. We also discover a new sign, "parallelism" which although uncommon is highly specific. Accuracy is further increased by comparing the density of packages to faeces and looking for the co-existence of multiple signs. Copyright (c) 2010 Elsevier Ltd and Faculty of Forensic and Legal Medicine. All rights reserved.

Packaging of MEMS/MOEMS and nanodevices: reliability, testing, and characterization aspects

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Ngo, Ha-Duong; Wittler, Olaf; Bouhlal, Bouchaib; Lang, Klaus-Dieter

2011-02-01

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Space station power semiconductor package

NASA Technical Reports Server (NTRS)

Balodis, Vilnis; Berman, Albert; Devance, Darrell; Ludlow, Gerry; Wagner, Lee

1987-01-01

A package of high-power switching semiconductors for the space station have been designed and fabricated. The package includes a high-voltage (600 volts) high current (50 amps) NPN Fast Switching Power Transistor and a high-voltage (1200 volts), high-current (50 amps) Fast Recovery Diode. The package features an isolated collector for the transistors and an isolated anode for the diode. Beryllia is used as the isolation material resulting in a thermal resistance for both devices of .2 degrees per watt. Additional features include a hermetical seal for long life -- greater than 10 years in a space environment. Also, the package design resulted in a low electrical energy loss with the reduction of eddy currents, stray inductances, circuit inductance, and capacitance. The required package design and device parameters have been achieved. Test results for the transistor and diode utilizing the space station package is given.

Wafer level reliability for high-performance VLSI design

NASA Technical Reports Server (NTRS)

Root, Bryan J.; Seefeldt, James D.

1987-01-01

As very large scale integration architecture requires higher package density, reliability of these devices has approached a critical level. Previous processing techniques allowed a large window for varying reliability. However, as scaling and higher current densities push reliability to its limit, tighter control and instant feedback becomes critical. Several test structures developed to monitor reliability at the wafer level are described. For example, a test structure was developed to monitor metal integrity in seconds as opposed to weeks or months for conventional testing. Another structure monitors mobile ion contamination at critical steps in the process. Thus the reliability jeopardy can be assessed during fabrication preventing defective devices from ever being placed in the field. Most importantly, the reliability can be assessed on each wafer as opposed to an occasional sample.

High-Performance Power-Semiconductor Packages

NASA Technical Reports Server (NTRS)

Renz, David; Hansen, Irving; Berman, Albert

1989-01-01

A 600-V, 50-A transistor and 1,200-V, 50-A diode in rugged, compact, lightweight packages intended for use in inverter-type power supplies having switching frequencies up to 20 kHz. Packages provide low-inductance connections, low loss, electrical isolation, and long-life hermetic seal. Low inductance achieved by making all electrical connections to each package on same plane. Also reduces high-frequency losses by reducing coupling into inherent shorted turns in packaging material around conductor axes. Stranded internal power conductors aid conduction at high frequencies, where skin effect predominates. Design of packages solves historical problem of separation of electrical interface from thermal interface of high-power semiconductor device.

Effect of ionizing radiation on physicochemical and mechanical properties of commercial multilayer coextruded flexible plastics packaging materials

NASA Astrophysics Data System (ADS)

Goulas, Antonios E.; Riganakos, Kyriakos A.; Kontominas, Michael G.

2003-12-01

The effect of gamma radiation (doses: 5, 10 and 30 kGy) on mechanical properties, gas and water vapour permeability and overall migration values into distilled water, 3% aqueous acetic acid and iso-octane was studied for a series of commercial multilayer flexible packaging materials based on coextruded polypropylene (PP), ethylene vinyl alcohol (EVOH), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), polyamide (PA) and Ionomer. The results showed that radiation doses of 5 and 10 kGy induced no statistically significant differences ( p>0.05) in all polymer properties examined. A dose of 30 kGy induced differences ( p<0.05) in the mechanical properties of PA/LDPE, LDPE/EVOH/LDPE and LDPE/PA/Ionomer films. In addition, the same dose induced differences ( p<0.05) in the overall migration from Ionomer/EVOH/LDPE and LDPE/PA/Ionomer films into 3% acetic acid and iso-octane and in the overall migration from PP/EVOH/LDPE-LLDPE into iso-octane. Differences recorded, are discussed in relation to food irradiation applications of respective packaging materials.

Net costs of health worker rural incentive packages: an example from the Lao People's Democratic Republic.

PubMed

Keuffel, Eric; Jaskiewicz, Wanda; Paphassarang, Chanthakhath; Tulenko, Kate

2013-11-01

Many developing countries are examining whether to institute incentive packages that increase the share of health workers who opt to locate in rural settings; however, uncertainty exists with respect to the expected net cost (or benefit) from these packages. We utilize the findings from the discrete choice experiment surveys applied to students training to be health professionals and costing analyses in Lao People's Democratic Republic to model the anticipated effect of incentive packages on new worker location decisions and direct costs. Incorporating evidence on health worker density and health outcomes, we then estimate the expected 5-year net cost (or benefit) of each incentive packages for 3 health worker cadres--physicians, nurses/midwives, and medical assistants. Under base case assumptions, the optimal incentive package for each cadre produced a 5-year net benefit (maximum net benefit for physicians: US$ 44,000; nurses/midwives: US$ 5.6 million; medical assistants: US$ 485,000). After accounting for health effects, the expected net cost of select incentive packages would be substantially less than the original estimate of direct costs. In the case of Lao People's Democratic Republic, incentive packages that do not invest in capital-intensive components generally should produce larger net benefits. Combining discrete choice experiment surveys, costing surveys and cost-benefit analysis methods may be replicated by other developing countries to calculate whether health worker incentive packages are viable policy options.

Transparent, flexible supercapacitors from nano-engineered carbon films.

PubMed

Jung, Hyun Young; Karimi, Majid B; Hahm, Myung Gwan; Ajayan, Pulickel M; Jung, Yung Joon

2012-01-01

Here we construct mechanically flexible and optically transparent thin film solid state supercapacitors by assembling nano-engineered carbon electrodes, prepared in porous templates, with morphology of interconnected arrays of complex shapes and porosity. The highly textured graphitic films act as electrode and current collector and integrated with solid polymer electrolyte, function as thin film supercapacitors. The nanostructured electrode morphology and the conformal electrolyte packaging provide enough energy and power density for the devices in addition to excellent mechanical flexibility and optical transparency, making it a unique design in various power delivery applications.

Transparent, flexible supercapacitors from nano-engineered carbon films

PubMed Central

Jung, Hyun Young; Karimi, Majid B.; Hahm, Myung Gwan; Ajayan, Pulickel M.; Jung, Yung Joon

2012-01-01

Here we construct mechanically flexible and optically transparent thin film solid state supercapacitors by assembling nano-engineered carbon electrodes, prepared in porous templates, with morphology of interconnected arrays of complex shapes and porosity. The highly textured graphitic films act as electrode and current collector and integrated with solid polymer electrolyte, function as thin film supercapacitors. The nanostructured electrode morphology and the conformal electrolyte packaging provide enough energy and power density for the devices in addition to excellent mechanical flexibility and optical transparency, making it a unique design in various power delivery applications. PMID:23105970

Transparent, flexible supercapacitors from nano-engineered carbon films

NASA Astrophysics Data System (ADS)

Jung, Hyun Young; Karimi, Majid B.; Hahm, Myung Gwan; Ajayan, Pulickel M.; Jung, Yung Joon

2012-10-01

Here we construct mechanically flexible and optically transparent thin film solid state supercapacitors by assembling nano-engineered carbon electrodes, prepared in porous templates, with morphology of interconnected arrays of complex shapes and porosity. The highly textured graphitic films act as electrode and current collector and integrated with solid polymer electrolyte, function as thin film supercapacitors. The nanostructured electrode morphology and the conformal electrolyte packaging provide enough energy and power density for the devices in addition to excellent mechanical flexibility and optical transparency, making it a unique design in various power delivery applications.

Profiles in garbage: Polyethylene terephthalate

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miller, C.

1997-11-01

Polyethylene terephthalate (PET) is a plastic resin used primarily to make bottles. Soft drinks -- along with salad dressing, fruit juices, peanut butter, and other household and consumer products -- use PET bottles. PET also is used for film, sheeting for cups and food trays, oven-safe trays, and other uses. PET is a relatively new packaging resin, first commercialized in the early 1970s. Because it is an ``engineered`` resin, PET is more expensive than commodity resins such as high-density polyethylene (HDPE) and, for the same reason, it is usually the highest valued plastic recyclable.

Elimination of polycyclic aromatic hydrocarbons from smoked sausages by migration into polyethylene packaging.

PubMed

Semanová, Jana; Skláršová, Božena; Šimon, Peter; Šimko, Peter

2016-06-15

The objective of this work was a study of interactions between a smoked meat product and plastic packaging to find a possibility of elimination of polycyclic aromatic hydrocarbons (PAH) from smoked sausages by migration into the packaging. Smoked meat sausages were packed into o-polyamide/low density polyethylene laminated film and content of four PAH was determined at 0, 15, 30, 45, 60, 75, 90, 120, 150 and 180 min by HPLC. During this time, total PAH4 content decreased from 30.1 to 5.7 μg/kg, benzo[a]anthracene decreased from 11.5 to 2.1 μg/kg, chrysene from 9.4 to 1.9 μg/kg, benzo[b]fluoranthene from 5.3 to 0.6 μg/kg and benzo[a]pyrene from 3.9 to 1.1 μg/kg while PAH4 content in non-packed sausages remained at a constant level. So, while sausages did not meet European safety limits set for PAH4 content of 12 μg/kg and 2 μg/kg for benzo[a]pyrene before packaging, these limits were met at the end of the experiment. This decrease was brought about by migration of PAH4 from sausages into low density polyethylene packaging bulk and the measure of decrease can be predicted by a kinetic equation, making it possible to calculate PAH content equal to any time of experiment as well as the time of interaction necessary to fulfil EU legislative limits. Copyright © 2016 Elsevier Ltd. All rights reserved.

Epoxide-mediated differential packaging of Cif and other virulence factors into outer membrane vesicles.

PubMed

Ballok, Alicia E; Filkins, Laura M; Bomberger, Jennifer M; Stanton, Bruce A; O'Toole, George A

2014-10-01

Pseudomonas aeruginosa produces outer membrane vesicles (OMVs) that contain a number of secreted bacterial proteins, including phospholipases, alkaline phosphatase, and the CFTR inhibitory factor (Cif). Previously, Cif, an epoxide hydrolase, was shown to be regulated at the transcriptional level by epoxides, which serve as ligands of the repressor, CifR. Here, we tested whether epoxides have an effect on Cif levels in OMVs. We showed that growth of P. aeruginosa in the presence of specific epoxides but not a hydrolysis product increased Cif packaging into OMVs in a CifR-independent fashion. The outer membrane protein, OprF, was also increased under these conditions, but alkaline phosphatase activity was not significantly altered. Additionally, we demonstrated that OMV shape and density were affected by epoxide treatment, with two distinct vesicle fractions present when cells were treated with epibromohydrin (EBH), a model epoxide. Vesicles isolated from the two density fractions exhibited different protein profiles in Western blotting and silver staining. We have shown that a variety of clinically or host-relevant treatments, including antibiotics, also alter the proteins packaged in OMVs. Proteomic analysis of purified OMVs followed by an analysis of transposon mutant OMVs yielded mutants with altered vesicle packaging. Finally, epithelial cell cytotoxicity was reduced in the vesicles formed in the presence of EBH, suggesting that this epoxide alters the function of the OMVs. Our data support a model whereby clinically or host-relevant signals mediate differential packaging of virulence factors in OMVs, which results in functional consequences for host-pathogen interactions. Copyright © 2014, American Society for Microbiology. All Rights Reserved.

Evaluating laser-driven Bremsstrahlung radiation sources for imaging and analysis of nuclear waste packages.

PubMed

Jones, Christopher P; Brenner, Ceri M; Stitt, Camilla A; Armstrong, Chris; Rusby, Dean R; Mirfayzi, Seyed R; Wilson, Lucy A; Alejo, Aarón; Ahmed, Hamad; Allott, Ric; Butler, Nicholas M H; Clarke, Robert J; Haddock, David; Hernandez-Gomez, Cristina; Higginson, Adam; Murphy, Christopher; Notley, Margaret; Paraskevoulakos, Charilaos; Jowsey, John; McKenna, Paul; Neely, David; Kar, Satya; Scott, Thomas B

2016-11-15

A small scale sample nuclear waste package, consisting of a 28mm diameter uranium penny encased in grout, was imaged by absorption contrast radiography using a single pulse exposure from an X-ray source driven by a high-power laser. The Vulcan laser was used to deliver a focused pulse of photons to a tantalum foil, in order to generate a bright burst of highly penetrating X-rays (with energy >500keV), with a source size of <0.5mm. BAS-TR and BAS-SR image plates were used for image capture, alongside a newly developed Thalium doped Caesium Iodide scintillator-based detector coupled to CCD chips. The uranium penny was clearly resolved to sub-mm accuracy over a 30cm(2) scan area from a single shot acquisition. In addition, neutron generation was demonstrated in situ with the X-ray beam, with a single shot, thus demonstrating the potential for multi-modal criticality testing of waste materials. This feasibility study successfully demonstrated non-destructive radiography of encapsulated, high density, nuclear material. With recent developments of high-power laser systems, to 10Hz operation, a laser-driven multi-modal beamline for waste monitoring applications is envisioned. Copyright © 2016. Published by Elsevier B.V.

Control of lipid oxidation by nonmigratory active packaging films prepared by photoinitiated graft polymerization.

PubMed

Tian, Fang; Decker, Eric A; Goddard, Julie M

2012-08-08

Transition metal-promoted oxidation impacts the quality, shelf life, and nutrition of many packaged foods. Metal-chelating active packaging therefore offers a means to protect foods against oxidation. Herein, we report the development and characterization of nonmigratory metal-chelating active packaging. To prepare the films, carboxylic acids were grafted onto the surfaces of polypropylene films by photoinitiated graft polymerization of acrylic acid. Attenuated total reflectance/Fourier transform infrared spectroscopy, contact angle, scanning electron microscopy, and iron-chelating assay were used to characterize film properties. Graft polymerization yielded a carboxylic acid density of 68.67 ± 9.99 nmol per cm(2) film, with ferrous iron-chelating activity of 71.07 ± 12.95 nmol per cm(2). The functionalized films extended the lag phase of lipid oxidation in a soybean oil-in-water emulsion system from 2 to 9 days. The application of such nonmigratory active packaging films represents a promising approach to reduce additive use while maintaining food quality.

Numerical Simulation of Doped Targets for ICF

NASA Astrophysics Data System (ADS)

Phillips, Lee; Gardner, John H.; Bodner, Stephen E.; Colombant, Denis; Klapisch, Marcel; Bar-Shalom, Avraham

1997-11-01

The ablative Rayleigh-Taylor (RT) instability can be reduced by preheating the ablator, thereby reducing the peak density and increasing the mass ablation velocity. The ablator can be preheated with radiation from higher Z dopants.(Gardner, J.H., Bodner, S.E., Dahlburg, J.P., Phys. Fluids 3), 1070 (1991) Dopants also reduce the density gradient at the ablator, which provides a second mechanism to reduce the RT growth rate. We have recently developed a more sophisticated and detailed radiation package that uses opacities generated by an STA code, with non-LTE radiation transport based on the Busquet method. This radiation package has been incorporated into NRL's FAST2D radiation hydrodynamics code, which has been used to evaluate and optimize the use of various dopants that can provide interesting levels of preheat for an ICF target.

Low-crystalline iron oxide hydroxide nanoparticle anode for high-performance supercapacitors

PubMed Central

Owusu, Kwadwo Asare; Qu, Longbing; Li, Jiantao; Wang, Zhaoyang; Zhao, Kangning; Yang, Chao; Hercule, Kalele Mulonda; Lin, Chao; Shi, Changwei; Wei, Qiulong; Zhou, Liang; Mai, Liqiang

2017-01-01

Carbon materials are generally preferred as anodes in supercapacitors; however, their low capacitance limits the attained energy density of supercapacitor devices with aqueous electrolytes. Here, we report a low-crystalline iron oxide hydroxide nanoparticle anode with comprehensive electrochemical performance at a wide potential window. The iron oxide hydroxide nanoparticles present capacitances of 1,066 and 716 F g−1 at mass loadings of 1.6 and 9.1 mg cm−2, respectively, a rate capability with 74.6% of capacitance retention at 30 A g−1, and cycling stability retaining 91% of capacitance after 10,000 cycles. The performance is attributed to a dominant capacitive charge-storage mechanism. An aqueous hybrid supercapacitor based on the iron oxide hydroxide anode shows stability during float voltage test for 450 h and an energy density of 104 Wh kg−1 at a power density of 1.27 kW kg−1. A packaged device delivers gravimetric and volumetric energy densities of 33.14 Wh kg−1 and 17.24 Wh l−1, respectively. PMID:28262797

The Multi-Needle Langmuir Probe System on Board NorSat-1

NASA Astrophysics Data System (ADS)

Hoang, H.; Clausen, L. B. N.; Røed, K.; Bekkeng, T. A.; Trondsen, E.; Lybekk, B.; Strøm, H.; Bang-Hauge, D. M.; Pedersen, A.; Spicher, A.; Moen, J. I.

2018-06-01

On July 14th, 2017, the first Norwegian scientific satellite NorSat-1 was launched into a high-inclination (98∘), low-Earth orbit (600 km altitude) from Baikonur, Kazakhstan. As part of the payload package, NorSat-1 carries the multi-needle Langmuir probe (m-NLP) instrument which is capable of sampling the electron density at a rate up to 1 kHz, thus offering an unprecedented opportunity to continuously resolve ionospheric plasma density structures down to a few meters. Over the coming years, NorSat-1 will cross the equatorial and polar regions twice every 90 minutes, providing a wealth of data that will help to better understand the mechanisms that dissipate energy input from larger spatial scales by creating small-scale plasma density structures within the ionosphere. In this paper we describe the m-NLP system on board NorSat-1 and present some first results from the instrument commissioning phase. We show that the m-NLP instrument performs as expected and highlight its unique capabilities at resolving small-scale ionospheric plasma density structures.

Design, processing and testing of LSI arrays: Hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.

1979-01-01

Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-07-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Study of the Fracture Mechanisms of Electroplated Metallization Systems Using In Situ Microtension Test

NASA Astrophysics Data System (ADS)

Msolli, Sabeur; Kim, Heung Soo

2018-03-01

This framework assesses the mechanical behavior of some potential thin/thick metallization systems in use as either ohmic contacts for diamond semi-conductors or for metallization on copper double bounded ceramic substrates present in the next-generation power electronics packaging. The interesting and unique characteristic of this packaging is the use of diamond as a semi-conductor material instead of silicon to increase the lifetime of embedded power converters for use in aeronautical applications. Theoretically, such packaging is able to withstand temperatures of up to 300 °C without breaking the semi-conductor, provided that the constitutive materials of the packaging are compatible. Metallization is very important to protect the chips and substrates. Therefore, we address this issue in the present work. The tested metallization systems are Ni/Au, Ni/Cr/Au and Ni/Cr. These specific systems were studied since they can be used in conjunction with existing bonding technologies, including AuGe soldering, Ag-In Transient liquid Phase Bonding and silver nanoparticle sintering. The metallization is achieved via electrodeposition, and a mechanical test, consisting of a microtension technique, is carried out at room temperature inside a scanning electron microscopy chamber. The technique permits observations the cracks initiation and growth in the metallization to locate the deformation zones and identify the fracture mechanisms. Different failure mechanisms were shown to occur depending on the metallic layers deposited on top of the copper substrate. The density of these cracks depends on the imposed load and the involved metallization. These observations will help choose the metallization that is compatible with the particular bonding material, and manage mechanical stress due to thermal cycling so that they can be used as a constitutive component for high-temperature power electronics packaging.

Metal-chelating active packaging film enhances lysozyme inhibition of Listeria monocytogenes.

PubMed

Roman, Maxine J; Decker, Eric A; Goddard, Julie M

2014-07-01

Several studies have demonstrated that metal chelators enhance the antimicrobial activity of lysozyme. This study examined the effect of metal-chelating active packaging film on the antimicrobial activity of lysozyme against Listeria monocytogenes. Polypropylene films were surface modified by photoinitiated graft polymerization of acrylic acid (PP-g-PAA) from the food contact surface of the films to impart chelating activity based on electrostatic interactions. PP-g-PAA exhibited a carboxylic acid density of 113 ± 5.4 nmol cm(-2) and an iron chelating activity of 53.7 ± 9.8 nmol cm(-2). The antimicrobial interaction of lysozyme and PP-g-PAA depended on growth media composition. PP-g-PAA hindered lysozyme activity at low ionic strength (2.48-log increase at 64.4 mM total ionic strength) and enhanced lysozyme activity at moderate ionic strength (5.22-log reduction at 120 mM total ionic strength). These data support the hypothesis that at neutral pH, synergy between carboxylate metal-chelating films (pKa(bulk) 6.45) and lysozyme (pI 11.35) is optimal in solutions of moderate to high ionic strength to minimize undesirable charge interactions, such as lysozyme absorption onto film. These findings suggest that active packaging, which chelates metal ions based on ligand-specific interactions, in contrast to electrostatic interactions, may improve antimicrobial synergy. This work demonstrates the potential application of metal-chelating active packaging films to enhance the antimicrobial activity of membrane-disrupting antimicrobials, such as lysozyme.

The high energy multicharged particle exposure of the microbial ecology evaluation device on board the Apollo 16 spacecraft

NASA Technical Reports Server (NTRS)

Benton, E. V.; Henke, R. P.

1973-01-01

The high energy multicharged cosmic-ray-particle exposure of the Microbial Ecology Evaluation Device package on board the Apollo 16 spacecraft was monitored using cellulose nitrate, Lexan polycarbonate, nuclear emulsion, and silver chloride crystal nuclear-track detectors. The results of the analysis of these detectors include the measured particle fluences, the linear energy transfer spectra, and the integral atomic number spectrum of stopping particle density. The linear energy transfer spectrum is used to compute the fractional cell loss in human kidney (T1) cells caused by heavy particles. Because the Microbial Ecology Evaluation Device was better shielded, the high-energy multicharged particle exposure was less than that measured on the crew passive dosimeters.

Mango and acerola pulps as antioxidant additives in cassava starch bio-based film.

PubMed

Souza, Carolina O; Silva, Luciana T; Silva, Jaff R; López, Jorge A; Veiga-Santos, Pricila; Druzian, Janice I

2011-03-23

The objective of this study was to investigate the feasibility of incorporating mango and acerola pulps into a biodegradable matrix as a source of polyphenols, carotenoids, and other antioxidant compounds. We also sought to evaluate the efficacy of mango and acerola pulps as antioxidants in film-forming dispersions using a response surface methodology design experiment. The bio-based films were used to pack palm oil (maintained for 45 days of storage) under accelerated oxidation conditions (63% relative humidity and 30 °C) to simulate a storage experiment. The total carotenoid, total polyphenol, and vitamin C contents of films were evaluated, while the total carotenoid, peroxide index, conjugated diene, and hexanal content of the packaged product (palm oil) were also monitored. The same analysis also evaluated palm oil packed in films without antioxidant additives (C1), palm oil packed in low-density polyethylene films (C2), and palm oil with no package (C3) as a control. Although the film-forming procedure affected the antioxidant compounds, the results indicated that antioxidants were effective additives for protecting the packaged product. A lower peroxide index (36.12%), which was significantly different from that of the control (p<0.05), was detected in products packed in film formulations containing high concentration of additives. However, it was found that the high content of vitamin C in acerola pulp acted as a prooxidant agent, which suggests that the use of rich vitamin C pulps should be avoided as additives for films.

Self-assembled virus-membrane complexes

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, Lihua; Liang, Hongjun; Angelini, Thomas

Anionic polyelectrolytes and cationic lipid membranes can self-assemble into lamellar structures ranging from alternating layers of membranes and polyelectrolytes to 'missing layer' superlattice structures. We show that these structural differences can be understood in terms of the surface-charge-density mismatch between the polyelectrolyte and membrane components by examining complexes between cationic membranes and highly charged M13 viruses, a system that allowed us to vary the polyelectrolyte diameter independently of the charge density. Such virus-membrane complexes have pore sizes that are about ten times larger in area than DNA-membrane complexes, and can be used to package and organize large functional molecules; correlatedmore » arrays of Ru(bpy){sub 3}{sup 2+} macroionic dyes have been directly observed within the virus-membrane complexes using an electron-density reconstruction. These observations elucidate fundamental design rules for rational control of self-assembled polyelectrolyte-membrane structures, which have applications ranging from non-viral gene therapy to biomolecular templates for nanofabrication.« less

Nondestructive determination of activity

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chabalier, B.

1996-08-01

Characterization and appraisal tests include the measurement of activity in raw waste and waste packages. After conditioning, variations in density, matrix composition, and geometry make evaluation of the radionuclide activity in a package destined for storage nearly impossible without measurements and with a low uncertainty. Various nondestructive measuring techniques that use ionizing radiation are employed to characterize waste packages and raw waste. Gamma spectrometry is the most widely used technique because of its simple operation and low cost. This technique is used to quantify the beta-gamma and alpha activity of gamma-emitting radionuclides as well as to check the radioactive homogeneitymore » of the waste packages. Numerous systems for directly measuring waste packages have been developed. Two types of methods may be distinguished, depending on whether results that come from the measurements are weighted by an experimentally determined corrective term or by calculation. Through the MARCO and CARACO measuring systems, a method is described that allows one to quantify the activity of the beta-gamma and alpha radionuclides contained in either a waste package or raw waste whose geometries and material compositions are more or less accurately known. This method is based on (a) measurement by gamma spectrometry of the beta-gamma and alpha activity of the gamma-emitting radionuclides contained in the waste package and (b) the application of calculated corrections; thus, the limitations imposed by reference package geometry and matrix are avoided.« less

Nanoporous Ni(OH)2 thin film on 3D Ultrathin-graphite foam for asymmetric supercapacitor.

PubMed

Ji, Junyi; Zhang, Li Li; Ji, Hengxing; Li, Yang; Zhao, Xin; Bai, Xin; Fan, Xiaobin; Zhang, Fengbao; Ruoff, Rodney S

2013-07-23

Nanoporous nickel hydroxide (Ni(OH)2) thin film was grown on the surface of ultrathin-graphite foam (UGF) via a hydrothermal reaction. The resulting free-standing Ni(OH)2/UGF composite was used as the electrode in a supercapacitor without the need for addition of either binder or metal-based current collector. The highly conductive 3D UGF network facilitates electron transport and the porous Ni(OH)2 thin film structure shortens ion diffusion paths and facilitates the rapid migration of electrolyte ions. An asymmetric supercapacitor was also made and studied with Ni(OH)2/UGF as the positive electrode and activated microwave exfoliated graphite oxide ('a-MEGO') as the negative electrode. The highest power density of the fully packaged asymmetric cell (44.0 kW/kg) was much higher (2-27 times higher), while the energy density was comparable to or higher, than high-end commercially available supercapacitors. This asymmetric supercapacitor had a capacitance retention of 63.2% after 10,000 cycles.

Thermal management methods for compact high power LED arrays

NASA Astrophysics Data System (ADS)

Christensen, Adam; Ha, Minseok; Graham, Samuel

2007-09-01

The package and system level temperature distributions of a high power (>1W) light emitting diode (LED) array has been investigated using numerical heat flow models. For this analysis, a thermal resistor network model was combined with a 3D finite element submodel of an LED structure to predict system and die level temperatures. The impact of LED array density, LED power density, and active versus passive cooling methods on device operation were calculated. In order to help understand the role of various thermal resistances in cooling such compact arrays, the thermal resistance network was analyzed in order to estimate the contributions from materials as well as active and passive cooling schemes. An analysis of thermal stresses and residual stresses in the die are also calculated based on power dissipation and convection heat transfer coefficients. Results show that the thermal stress in the GaN layer are compressive which can impact the band gap and performance of the LEDs.

The AGORA High-resolution Galaxy Simulations Comparison Project II: Isolated disk test

DOE PAGES

Kim, Ji-hoon; Agertz, Oscar; Teyssier, Romain; ...

2016-12-20

Using an isolated Milky Way-mass galaxy simulation, we compare results from 9 state-of-the-art gravito-hydrodynamics codes widely used in the numerical community. We utilize the infrastructure we have built for the AGORA High-resolution Galaxy Simulations Comparison Project. This includes the common disk initial conditions, common physics models (e.g., radiative cooling and UV background by the standardized package Grackle) and common analysis toolkit yt, all of which are publicly available. Subgrid physics models such as Jeans pressure floor, star formation, supernova feedback energy, and metal production are carefully constrained across code platforms. With numerical accuracy that resolves the disk scale height, wemore » find that the codes overall agree well with one another in many dimensions including: gas and stellar surface densities, rotation curves, velocity dispersions, density and temperature distribution functions, disk vertical heights, stellar clumps, star formation rates, and Kennicutt-Schmidt relations. Quantities such as velocity dispersions are very robust (agreement within a few tens of percent at all radii) while measures like newly-formed stellar clump mass functions show more significant variation (difference by up to a factor of ~3). Systematic differences exist, for example, between mesh-based and particle-based codes in the low density region, and between more diffusive and less diffusive schemes in the high density tail of the density distribution. Yet intrinsic code differences are generally small compared to the variations in numerical implementations of the common subgrid physics such as supernova feedback. Lastly, our experiment reassures that, if adequately designed in accordance with our proposed common parameters, results of a modern high-resolution galaxy formation simulation are more sensitive to input physics than to intrinsic differences in numerical schemes.« less

The AGORA High-resolution Galaxy Simulations Comparison Project II: Isolated disk test

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Ji-hoon; Agertz, Oscar; Teyssier, Romain

Using an isolated Milky Way-mass galaxy simulation, we compare results from 9 state-of-the-art gravito-hydrodynamics codes widely used in the numerical community. We utilize the infrastructure we have built for the AGORA High-resolution Galaxy Simulations Comparison Project. This includes the common disk initial conditions, common physics models (e.g., radiative cooling and UV background by the standardized package Grackle) and common analysis toolkit yt, all of which are publicly available. Subgrid physics models such as Jeans pressure floor, star formation, supernova feedback energy, and metal production are carefully constrained across code platforms. With numerical accuracy that resolves the disk scale height, wemore » find that the codes overall agree well with one another in many dimensions including: gas and stellar surface densities, rotation curves, velocity dispersions, density and temperature distribution functions, disk vertical heights, stellar clumps, star formation rates, and Kennicutt-Schmidt relations. Quantities such as velocity dispersions are very robust (agreement within a few tens of percent at all radii) while measures like newly-formed stellar clump mass functions show more significant variation (difference by up to a factor of ~3). Systematic differences exist, for example, between mesh-based and particle-based codes in the low density region, and between more diffusive and less diffusive schemes in the high density tail of the density distribution. Yet intrinsic code differences are generally small compared to the variations in numerical implementations of the common subgrid physics such as supernova feedback. Lastly, our experiment reassures that, if adequately designed in accordance with our proposed common parameters, results of a modern high-resolution galaxy formation simulation are more sensitive to input physics than to intrinsic differences in numerical schemes.« less

THE AGORA HIGH-RESOLUTION GALAXY SIMULATIONS COMPARISON PROJECT. II. ISOLATED DISK TEST

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kim, Ji-hoon; Agertz, Oscar; Teyssier, Romain

Using an isolated Milky Way-mass galaxy simulation, we compare results from nine state-of-the-art gravito-hydrodynamics codes widely used in the numerical community. We utilize the infrastructure we have built for the AGORA High-resolution Galaxy Simulations Comparison Project. This includes the common disk initial conditions, common physics models (e.g., radiative cooling and UV background by the standardized package Grackle) and common analysis toolkit yt, all of which are publicly available. Subgrid physics models such as Jeans pressure floor, star formation, supernova feedback energy, and metal production are carefully constrained across code platforms. With numerical accuracy that resolves the disk scale height, wemore » find that the codes overall agree well with one another in many dimensions including: gas and stellar surface densities, rotation curves, velocity dispersions, density and temperature distribution functions, disk vertical heights, stellar clumps, star formation rates, and Kennicutt–Schmidt relations. Quantities such as velocity dispersions are very robust (agreement within a few tens of percent at all radii) while measures like newly formed stellar clump mass functions show more significant variation (difference by up to a factor of ∼3). Systematic differences exist, for example, between mesh-based and particle-based codes in the low-density region, and between more diffusive and less diffusive schemes in the high-density tail of the density distribution. Yet intrinsic code differences are generally small compared to the variations in numerical implementations of the common subgrid physics such as supernova feedback. Our experiment reassures that, if adequately designed in accordance with our proposed common parameters, results of a modern high-resolution galaxy formation simulation are more sensitive to input physics than to intrinsic differences in numerical schemes.« less

Loss of Ductility Caused by AlN Precipitation in Hadfield Steel

NASA Astrophysics Data System (ADS)

Radis, Rene; Schlacher, Christian; Kozeschnik, Ernst; Mayr, Peter; Enzinger, Norbert; Schröttner, Hartmuth; Sommitsch, Christof

2012-04-01

Two modified X120Mn12 Hadfield steels, differing in the amount of the alloying elements Al and N, are analyzed with respect to AlN precipitation and its effects on ductility. Charpy impact tests are performed, demonstrating the loss of ductility in the one grade containing a high density of AlN precipitates. The characterization of the precipitates is carried out by high-resolution scanning electron microscopy (HRSEM). Depending on chemical composition, primary and secondary AlN precipitates are detected on prior austenite grain boundaries and within the bulk volume. The experimental observations are confirmed by thermokinetic simulations, using the software package MatCalc (Vienna University of Technology, Vienna, Austria).

High-performance wire-grid polarizers using jet and Flash™ imprint lithography

NASA Astrophysics Data System (ADS)

Ahn, Se Hyun; Yang, Shuqiang; Miller, Mike; Ganapathisubramanian, Maha; Menezes, Marlon; Choi, Jin; Xu, Frank; Resnick, Douglas J.; Sreenivasan, S. V.

2013-07-01

Extremely large-area roll-to-roll (R2R) manufacturing on flexible substrates is ubiquitous for applications such as paper and plastic processing. It combines the benefits of high speed and inexpensive substrates to deliver a commodity product at low cost. The challenge is to extend this approach to the realm of nanopatterning and realize similar benefits. In order to achieve low-cost nanopatterning, it is imperative to move toward high-speed imprinting, less complex tools, near zero waste of consumables, and low-cost substrates. We have developed a roll-based J-FIL process and applied it to a technology demonstrator tool, the LithoFlex 100, to fabricate large-area flexible bilayer wire-grid polarizers (WGPs) and high-performance WGPs on rigid glass substrates. Extinction ratios of better than 10,000 are obtained for the glass-based WGPs. Two simulation packages are also employed to understand the effects of pitch, aluminum thickness, and pattern defectivity on the optical performance of the WGP devices. It is determined that the WGPs can be influenced by both clear and opaque defects in the gratings; however, the defect densities are relaxed relative to the requirements of a high-density semiconductor device.

High volume nanoscale roll-based imprinting using jet and flash imprint lithography

NASA Astrophysics Data System (ADS)

Ahn, Se Hyun; Miller, Mike; Yang, Shuqiang; Ganapathisubramanian, Maha; Menezes, Marlon; Singh, Vik; Choi, Jin; Xu, Frank; LaBrake, Dwayne; Resnick, Douglas J.; Sreenivasan, S. V.

2013-09-01

Extremely large-area roll-to-roll (R2R) manufacturing on flexible substrates is ubiquitous for applications such as paper and plastic processing. It combines the benefits of high speed and inexpensive substrates to deliver a commodity product at low cost. The challenge is to extend this approach to the realm of nanopatterning and realize similar benefits. In order to achieve low-cost nanopatterning, it is imperative to move toward high-speed imprinting, less complex tools, near zero waste of consumables, and low-cost substrates. We have developed a roll-based J-FIL process and applied it to a technology demonstrator tool, the LithoFlex 100, to fabricate large-area flexible bilayer wire-grid polarizers (WGPs) and high-performance WGPs on rigid glass substrates. Extinction ratios of better than 10,000 are obtained for the glass-based WGPs. Two simulation packages are also employed to understand the effects of pitch, aluminum thickness, and pattern defectivity on the optical performance of the WGP devices. It is determined that the WGPs can be influenced by both clear and opaque defects in the gratings; however, the defect densities are relaxed relative to the requirements of a high-density semiconductor device.

Fabrication of wound capacitors using flexible alkali-free glass

DOE PAGES

Wilke, Rudeger H. T.; Baker, Amanda; Brown-Shaklee, Harlan; ...

2016-10-01

Here, alkali-free glasses, which exhibit high energy storage densities (~35 J/cc), present a unique opportunity to couple high temperature stability with high breakdown strength, and thus provide an avenue for capacitor applications with stringent temperature and power requirements. Realizing the potential of these materials in kilovolt class capacitors with >1 J/cc recoverable energy density requires novel packaging strategies that incorporate these extremely fragile dielectrics. In this paper, we demonstrate the feasibility of fabricating wound capacitors using 50-μm-thick glass. Two capacitors were fabricated from 2.8-m-long ribbons of thin (50 μm) glass wound into 125-140-mm-diameter spools. The capacitors exhibit a capacitance ofmore » 70-75 nF with loss tangents below 1%. The wound capacitors can operate up to 1 kV and show excellent temperature stability to 150 °C. By improving the end terminations, the self-resonance can be shifted to above 1 MHz, indicating that these materials may be useful for pulsed power applications with microsecond discharge times.« less

Effect of bending on the performance of spool-packaged shape memory alloy actuators

NASA Astrophysics Data System (ADS)

Redmond, John A.; Brei, Diann; Luntz, Jonathan; Browne, Alan L.; Johnson, Nancy L.

2009-03-01

Shape memory alloy (SMA) actuation is becoming an increasingly viable technology for industrial applications as many of the technical issues that have limited its use are being addressed (speed of actuation, mechanical connections, performance degradation, quality control, etc.) while increasing production capacities drive costs to practical levels. Shape memory alloys are often selected because of their high energy density which can lead to compact actuators; however, wire forms with small cross-sectional diameters tend to be long (10 to 50 times the length of required stroke). Spooling the wire can be used for compact packaging, but as the spool diameter decreases performance losses and fatigue increase due to bending strains and stresses. This paper presents a simple, design-level model for spooled SMA wire actuators with linear motion outputs that includes the effects of friction and wire bending and accounts for the actuator geometry, applied load, and material friction and constitutive properties. The model was validated experimentally with respect to the ratio of mandrel to SMA wire diameter and agrees well in both form and magnitude with experiments. The resulting model provides the framework for the analysis and synthesis of spooled SMA wire actuators to guide the selection of design parameters with respect to the tradeoffs between performance and packaging.

Virtual rough samples to test 3D nanometer-scale scanning electron microscopy stereo photogrammetry.

PubMed

Villarrubia, J S; Tondare, V N; Vladár, A E

2016-01-01

The combination of scanning electron microscopy for high spatial resolution, images from multiple angles to provide 3D information, and commercially available stereo photogrammetry software for 3D reconstruction offers promise for nanometer-scale dimensional metrology in 3D. A method is described to test 3D photogrammetry software by the use of virtual samples-mathematical samples from which simulated images are made for use as inputs to the software under test. The virtual sample is constructed by wrapping a rough skin with any desired power spectral density around a smooth near-trapezoidal line with rounded top corners. Reconstruction is performed with images simulated from different angular viewpoints. The software's reconstructed 3D model is then compared to the known geometry of the virtual sample. Three commercial photogrammetry software packages were tested. Two of them produced results for line height and width that were within close to 1 nm of the correct values. All of the packages exhibited some difficulty in reconstructing details of the surface roughness.

Nanocellulose in green food packaging.

PubMed

Vilarinho, Fernanda; Sanches Silva, Ana; Vaz, M Fátima; Farinha, José Paulo

2018-06-13

The development of packaging materials with new functionalities and lower environmental impact is now an urgent need of our society. On one hand, the shelf-life extension of packaged products can be an answer to the exponential increase of worldwide demand for food. On the other hand, uncertainty of crude oil prices and reserves has imposed the necessity to find raw materials to replace oil-derived polymers. Additionally, consumers' awareness toward environmental issues increasingly pushes industries to look with renewed interest to "green" solutions. In response to these issues, numerous polymers have been exploited to develop biodegradable food packaging materials. Although the use of biopolymers has been limited due to their poor mechanical and barrier properties, these can be enhanced by adding reinforcing nanosized components to form nanocomposites. Cellulose is probably the most used and well-known renewable and sustainable raw material. The mechanical properties, reinforcing capabilities, abundance, low density, and biodegradability of nanosized cellulose make it an ideal candidate for polymer nanocomposites processing. Here we review the potential applications of cellulose based nanocomposites in food packaging materials, highlighting the several types of biopolymers with nanocellulose fillers that have been used to form bio-nanocomposite materials. The trends in nanocellulose packaging applications are also addressed.

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2015-01-01

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology

NASA Astrophysics Data System (ADS)

Wang, Jingwei; Zhu, Pengfei; Liu, Hui; Liang, Xuejie; Wu, Dihai; Liu, Yalong; Yu, Dongshan; Zah, Chung-en; Liu, Xingsheng

2017-02-01

High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.

46 CFR 160.037-3 - Materials, workmanship, construction, and performance requirements.

Code of Federal Regulations, 2010 CFR

2010-10-01

... preclude variations of density which may adversely affect uniformity of its smoke emitting characteristics... the signal plus packaging in a sealed plastic waterproof bag satisfactory to the Commandant. (d...

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

NASA Technical Reports Server (NTRS)

Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2016-01-01

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

Raman Optical Activity Spectra from Density Functional Perturbation Theory and Density-Functional-Theory-Based Molecular Dynamics.

PubMed

Luber, Sandra

2017-03-14

We describe the calculation of Raman optical activity (ROA) tensors from density functional perturbation theory, which has been implemented into the CP2K software package. Using the mixed Gaussian and plane waves method, ROA spectra are evaluated in the double-harmonic approximation. Moreover, an approach for the calculation of ROA spectra by means of density functional theory-based molecular dynamics is derived and used to obtain an ROA spectrum via time correlation functions, which paves the way for the calculation of ROA spectra taking into account anharmonicities and dynamic effects at ambient conditions.

Stan : A Probabilistic Programming Language

DOE Office of Scientific and Technical Information (OSTI.GOV)

Carpenter, Bob; Gelman, Andrew; Hoffman, Matthew D.

Stan is a probabilistic programming language for specifying statistical models. A Stan program imperatively defines a log probability function over parameters conditioned on specified data and constants. As of version 2.14.0, Stan provides full Bayesian inference for continuous-variable models through Markov chain Monte Carlo methods such as the No-U-Turn sampler, an adaptive form of Hamiltonian Monte Carlo sampling. Penalized maximum likelihood estimates are calculated using optimization methods such as the limited memory Broyden-Fletcher-Goldfarb-Shanno algorithm. Stan is also a platform for computing log densities and their gradients and Hessians, which can be used in alternative algorithms such as variational Bayes, expectationmore » propagation, and marginal inference using approximate integration. To this end, Stan is set up so that the densities, gradients, and Hessians, along with intermediate quantities of the algorithm such as acceptance probabilities, are easily accessible. Stan can also be called from the command line using the cmdstan package, through R using the rstan package, and through Python using the pystan package. All three interfaces support sampling and optimization-based inference with diagnostics and posterior analysis. rstan and pystan also provide access to log probabilities, gradients, Hessians, parameter transforms, and specialized plotting.« less

ExGUtils: A Python Package for Statistical Analysis With the ex-Gaussian Probability Density.

PubMed

Moret-Tatay, Carmen; Gamermann, Daniel; Navarro-Pardo, Esperanza; Fernández de Córdoba Castellá, Pedro

2018-01-01

The study of reaction times and their underlying cognitive processes is an important field in Psychology. Reaction times are often modeled through the ex-Gaussian distribution, because it provides a good fit to multiple empirical data. The complexity of this distribution makes the use of computational tools an essential element. Therefore, there is a strong need for efficient and versatile computational tools for the research in this area. In this manuscript we discuss some mathematical details of the ex-Gaussian distribution and apply the ExGUtils package, a set of functions and numerical tools, programmed for python, developed for numerical analysis of data involving the ex-Gaussian probability density. In order to validate the package, we present an extensive analysis of fits obtained with it, discuss advantages and differences between the least squares and maximum likelihood methods and quantitatively evaluate the goodness of the obtained fits (which is usually an overlooked point in most literature in the area). The analysis done allows one to identify outliers in the empirical datasets and criteriously determine if there is a need for data trimming and at which points it should be done.

ExGUtils: A Python Package for Statistical Analysis With the ex-Gaussian Probability Density

PubMed Central

Moret-Tatay, Carmen; Gamermann, Daniel; Navarro-Pardo, Esperanza; Fernández de Córdoba Castellá, Pedro

2018-01-01

The study of reaction times and their underlying cognitive processes is an important field in Psychology. Reaction times are often modeled through the ex-Gaussian distribution, because it provides a good fit to multiple empirical data. The complexity of this distribution makes the use of computational tools an essential element. Therefore, there is a strong need for efficient and versatile computational tools for the research in this area. In this manuscript we discuss some mathematical details of the ex-Gaussian distribution and apply the ExGUtils package, a set of functions and numerical tools, programmed for python, developed for numerical analysis of data involving the ex-Gaussian probability density. In order to validate the package, we present an extensive analysis of fits obtained with it, discuss advantages and differences between the least squares and maximum likelihood methods and quantitatively evaluate the goodness of the obtained fits (which is usually an overlooked point in most literature in the area). The analysis done allows one to identify outliers in the empirical datasets and criteriously determine if there is a need for data trimming and at which points it should be done. PMID:29765345

Stan : A Probabilistic Programming Language

DOE PAGES

Carpenter, Bob; Gelman, Andrew; Hoffman, Matthew D.; ...

2017-01-01

Stan is a probabilistic programming language for specifying statistical models. A Stan program imperatively defines a log probability function over parameters conditioned on specified data and constants. As of version 2.14.0, Stan provides full Bayesian inference for continuous-variable models through Markov chain Monte Carlo methods such as the No-U-Turn sampler, an adaptive form of Hamiltonian Monte Carlo sampling. Penalized maximum likelihood estimates are calculated using optimization methods such as the limited memory Broyden-Fletcher-Goldfarb-Shanno algorithm. Stan is also a platform for computing log densities and their gradients and Hessians, which can be used in alternative algorithms such as variational Bayes, expectationmore » propagation, and marginal inference using approximate integration. To this end, Stan is set up so that the densities, gradients, and Hessians, along with intermediate quantities of the algorithm such as acceptance probabilities, are easily accessible. Stan can also be called from the command line using the cmdstan package, through R using the rstan package, and through Python using the pystan package. All three interfaces support sampling and optimization-based inference with diagnostics and posterior analysis. rstan and pystan also provide access to log probabilities, gradients, Hessians, parameter transforms, and specialized plotting.« less

Applications in the Nuclear Industry for Thermal Spray Amorphous Metal and Ceramic Coatings

NASA Astrophysics Data System (ADS)

Blink, J.; Farmer, J.; Choi, J.; Saw, C.

2009-06-01

Amorphous metal and ceramic thermal spray coatings have been developed with excellent corrosion resistance and neutron absorption. These coatings, with further development, could be cost-effective options to enhance the corrosion resistance of drip shields and waste packages, and limit nuclear criticality in canisters for the transportation, aging, and disposal of spent nuclear fuel. Iron-based amorphous metal formulations with chromium, molybdenum, and tungsten have shown the corrosion resistance believed to be necessary for such applications. Rare earth additions enable very low critical cooling rates to be achieved. The boron content of these materials and their stability at high neutron doses enable them to serve as high efficiency neutron absorbers for criticality control. Ceramic coatings may provide even greater corrosion resistance for waste package and drip shield applications, although the boron-containing amorphous metals are still favored for criticality control applications. These amorphous metal and ceramic materials have been produced as gas-atomized powders and applied as near full density, nonporous coatings with the high-velocity oxy-fuel process. This article summarizes the performance of these coatings as corrosion-resistant barriers and as neutron absorbers. This article also presents a simple cost model to quantify the economic benefits possible with these new materials.

Platform technologies for hybrid optoelectronic integration and packaging

NASA Astrophysics Data System (ADS)

Datta, Madhumita

In order to bring fiber-optics closer to individual home and business services, the optical network components have to be inexpensive and reliable. Integration and packaging of optoelectronic devices holds the key to high-volume low-cost component manufacturing. The goal of this dissertation is to propose, study, and demonstrate various ways to integrate optoelectronic devices on a packaging platform to implement cost-effective, functional optical modules. Two types of hybrid integration techniques have been proposed: flip-chip solder bump bonding for high-density two-dimensional array packaging of surface-emitting devices, and solder preform bonding for fiber-coupled edge-emitting semiconductor devices. For flip-chip solder bump bonding, we developed a simple, inexpensive remetallization process called "electroless plating", which converts the aluminum bond pads of foundry-made complementary metal oxide semiconductor (CMOS) chips into solder-bondable and wire-bondable gold surfaces. We have applied for a patent on this remetallization technique. For fiber-pigtailed edge-emitting laser modules, we have studied the coupling characteristics of different types of lensed single-mode fibers including semispherically lensed fiber, cylindrically lensed fiber and conically lensed fiber. We have experimentally demonstrated 66% coupling efficiency with semispherically lensed fiber and 50% efficiency with conically lensed fibers. We have proposed and designed a packaging platform on which lensed fibers can be actively aligned to a laser and solder-attached reliably to the platform so that the alignment is retained. We have designed thin-film nichrome heaters on fused quartz platforms as local heat source to facilitate on-board solder alignment and attachment of fiber. The thermal performance of the heaters was simulated using finite element analysis tool ANSYS prior to fabrication. Using the heater's reworkability advantage, we have estimated the shift of the fiber due to solder shrinkage and introduced a pre-correction in the alignment process to restore optimum coupling efficiency close to 50% with conically lensed fibers. We have applied for a patent on this unique active alignment method through the University of Maryland's Technology Commercialization Office. Although we have mostly concentrated on active alignment platforms, we have proposed the idea of combining the passive alignment advantages of silicon optical benches to the on-board heater-assisted active alignment technique. This passive-active alignment process has the potential of cost-effective array packaging of edge-emitting devices.

Computing and software

USGS Publications Warehouse

White, Gary C.; Hines, J.E.

2004-01-01

The reality is that the statistical methods used for analysis of data depend upon the availability of software. Analysis of marked animal data is no different than the rest of the statistical field. The methods used for analysis are those that are available in reliable software packages. Thus, the critical importance of having reliable, up–to–date software available to biologists is obvious. Statisticians have continued to develop more robust models, ever expanding the suite of potential analysis methodsavailable. But without software to implement these newer methods, they will languish in the abstract, and not be applied to the problems deserving them.In the Computers and Software Session, two new software packages are described, a comparison of implementation of methods for the estimation of nest survival is provided, and a more speculative paper about how the next generation of software might be structured is presented.Rotella et al. (2004) compare nest survival estimation with different software packages: SAS logistic regression, SAS non–linear mixed models, and Program MARK. Nests are assumed to be visited at various, possibly infrequent, intervals. All of the approaches described compute nest survival with the same likelihood, and require that the age of the nest is known to account for nests that eventually hatch. However, each approach offers advantages and disadvantages, explored by Rotella et al. (2004).Efford et al. (2004) present a new software package called DENSITY. The package computes population abundance and density from trapping arrays and other detection methods with a new and unique approach. DENSITY represents the first major addition to the analysis of trapping arrays in 20 years.Barker & White (2004) discuss how existing software such as Program MARK require that each new model’s likelihood must be programmed specifically for that model. They wishfully think that future software might allow the user to combine pieces of likelihood functions together to generate estimates. The idea is interesting, and maybe some bright young statistician can work out the specifics to implement the procedure.Choquet et al. (2004) describe MSURGE, a software package that implements the multistate capture–recapture models. The unique feature of MSURGE is that the design matrix is constructed with an interpreted language called GEMACO. Because MSURGE is limited to just multistate models, the special requirements of these likelihoods can be provided.The software and methods presented in these papers gives biologists and wildlife managers an expanding range of possibilities for data analysis. Although ease–of–use is generally getting better, it does not replace the need for understanding of the requirements and structure of the models being computed. The internet provides access to many free software packages as well as user–discussion groups to share knowledge and ideas. (A starting point for wildlife–related applications is (http://www.phidot.org).

Development status of a sealed bipolar lead/acid battery for high-power battery applications

NASA Astrophysics Data System (ADS)

Arias, J. L.; Rowlette, J. J.; Drake, E. D.

A sealed bipolar lead/acid (SBLA) battery is being developed by Arias Research Associates (ARA) which will offer a number of important advantages in applications requiring high power densities. These applications include electric vehicles (EVs) and hybrid electric vehicles, uninterruptable power supplies (UPS), electrically-heated catalysts (EHCs) for automobiles, utility-power peak-shaving, and others. The advantages of the SBLA over other types of batteries will by significantly higher power density, together with good energy density, high cycle life, high voltage density, low production cost and zero maintenance. In addition, the lead/acid battery represents a technology which is familiar and accepted by Society, is recyclable within the existing infrastructure, and does not raise the safety concerns of many other new batteries (e.g., fire, explosion and toxic gases). This paper briefly reviews the basic design concepts and issues of the SBLA battery technology, various quasi-bipolar approaches and the results of ARA's development work during the past four years. Performance data are given based on both in-house and independent testing of ARA laboratory test batteries. In addition, performance projections and other characteristics are given for three ARA SBLA battery designs, which are compared with other batteries in three example applications: UPS, EHCs, and EVs. The most notable advantages of the SBLA battery are substantial reductions in product size and weight for the UPS, smaller packaging and longer life for the EHC, and higher vehicle performance and lower cost for the EV, compared to both existing and advanced EV batteries.

Ultra-high pressure LC for astaxanthin determination in shrimp by-products and active food packaging.

PubMed

Sanches-Silva, A; Ribeiro, T; Albuquerque, T G; Paseiro, P; Sendón, R; de Quirós, A Bernaldo; López-Cervantes, J; Sánchez-Machado, D I; Soto Valdez, H; Angulo, I; Aurrekoetxea, G P; Costa, H S

2013-06-01

Nowadays, there is increasing interest in natural antioxidants from food by-products. Astaxanthin is a potent antioxidant and one of the major carotenoids in crustaceans and salmonids. An ultra-high pressure liquid chromatographic method was developed and validated for the determination of astaxanthin in shrimp by-products, and its migration from new packaging materials to food simulants was also studied. The method uses an UPLC® BEH guard-column (2.1 × 5 mm, 1.7 µm particle size) and an UPLC® BEH analytical column (2.1 × 50 mm, 1.7 µm particle size). Chromatographic separation was achieved using a programmed gradient mobile phase consisting of (A) acetonitrile-methanol (containing 0.05 m ammonium acetate)-dichloromethane (75:20:5, v/v/v) and (B) ultrapure water. This method was evaluated with respect to validation parameters such as linearity, precision, limit of detection, limit of quantification and recovery. Low-density polyethylene films were prepared with different amounts of the lipid fraction of fermented shrimp waste by extrusion, and migration was evaluated into food simulants (isooctane and ethanol 95%, v/v). Migration was not detected under the tested conditions. Copyright © 2012 John Wiley & Sons, Ltd.

The High Resolution Accelerometer Package (HiRAP) flight experiment summary for the first 10 flights

NASA Technical Reports Server (NTRS)

Blanchard, Robert C.; Larman, K. T.; Barrett, M.

1992-01-01

The High Resolution Accelerometer Package (HiRAP) instrument is a triaxial, orthogonal system of gas damped accelerometers with a resolution of 1 x 10(exp -6) g (1 micro-g). The purpose of HiRAP is to measure the low frequency component of the total acceleration along the orbiter vehicle (OV) body axes while the OV descends through the rarefied flow flight regime. Two HiRAP instruments have flown on a total of 10 Space Transport System (STS) missions. The aerodynamic component of the acceleration measurements was separated from the total acceleration. Instrument bias and orbiter mechanical system acceleration effects were incorporated into one bulk bias. The bulk bias was subtracted from the acceleration measurements to produce aerodynamic descent data sets for all 10 flights. The aerodynamic acceleration data sets were input to an aerodynamic coefficient model. The aerodynamic acceleration data and coefficient model were used to estimate the atmospheric density for the altitude range of 140 to 60 km and a downrange distance of 600 km. For 8 of 10 flights results from this model agree with expected results. For the results that do not agree with expected results, a variety of error sources have been explored.

Compact efficient microlasers (Invited Paper)

NASA Astrophysics Data System (ADS)

Brown, David C.; Kuper, Jerry W.

2005-04-01

In this paper we discuss the design and performance of high-density microlaser devices we have been developing, including a series of compact Nd:Vanadate lasers operating at 1064 and 532 nm, and miniature green lasers producing 1-100 mW single-transverse-mode output at 532 nm. In particular, our miniature green lasers have been designed and tested in both 9 mm and 5.6 mm industry standard modified TO cans. These packages pave the way for mass production of low cost yet reliable green lasers that may eventually substitute for red diode lasers in many consumer-oriented applications.

Packaging Technology for SiC High Temperature Electronics

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Meredith, Roger D.; Nakley, Leah M.; Beheim, Glenn M.; Hunter, Gary W.

2017-01-01

High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.

Packaging of solid state devices

DOEpatents

Glidden, Steven C.; Sanders, Howard D.

2006-01-03

A package for one or more solid state devices in a single module that allows for operation at high voltage, high current, or both high voltage and high current. Low thermal resistance between the solid state devices and an exterior of the package and matched coefficient of thermal expansion between the solid state devices and the materials used in packaging enables high power operation. The solid state devices are soldered between two layers of ceramic with metal traces that interconnect the devices and external contacts. This approach provides a simple method for assembling and encapsulating high power solid state devices.

Effect of packaging material on enological parameters and volatile compounds of dry white wine.

PubMed

Revi, M; Badeka, A; Kontakos, S; Kontominas, M G

2014-01-01

The enological parameters and volatile compounds of white wine packaged in dark coloured glass and two commercial bag-in-box (BIB) pouches (low density polyethylene - LDPE and ethylene vinyl acetate - EVA lined) were determined for a period of 6 months at 20 °C. Parameters monitored included: titratable acidity, volatile acidity, pH, total SO2, free SO2, colour, volatile compounds and sensory attributes. The BIB packaging materials affected the titratable acidity, total and free SO2 and colour of wine. A substantial portion of the wine aroma compounds was adsorbed by the plastic materials or lost to the environment through leakage of the valve fitment. Between the two plastics, the LDPE lined pouch showed a considerably higher aroma sorption as compared to EVA. Wine packaged in glass retained the largest portion of its aroma compounds. Sensory evaluation showed that white wine packaged in both plastics was of acceptable quality for 3 months vs. at least 6 months for that in glass bottles. Copyright © 2013 Elsevier Ltd. All rights reserved.

Unloading LDSD Test Device in Hawaii

NASA Image and Video Library

2014-05-28

The saucer-shaped test vehicle for NASA Low-Density Supersonic Decelerator LDSD project, packaged in the box shown here, was shipped via plane to the Navy Pacific Missile Range Facility in Kauai, Hawaii on April 17.

Flavoured cigarettes, sensation seeking and adolescents' perceptions of cigarette brands.

PubMed

Manning, K C; Kelly, K J; Comello, M L

2009-12-01

This study examined the interactive effects of cigarette package flavour descriptors and sensation seeking on adolescents' brand perceptions. High school students (n = 253) were randomly assigned to one of two experimental conditions and sequentially exposed to cigarette package illustrations for three different brands. In the flavour descriptor condition, the packages included a description of the cigarettes as "cherry", while in the traditional descriptor condition the cigarette brands were described with common phrases found on tobacco packages such as "domestic blend." Following exposure to each package participants' hedonic beliefs, brand attitudes and trial intentions were assessed. Sensation seeking was also measured, and participants were categorised as lower or higher sensation seekers. Across hedonic belief, brand attitude and trial intention measures, there were interactions between package descriptor condition and sensation seeking. These interactions revealed that among high (but not low) sensation seekers, exposure to cigarette packages including sweet flavour descriptors led to more favourable brand impressions than did exposure to packages with traditional descriptors. Among high sensation seeking youths, the appeal of cigarette brands is enhanced through the use of flavours and associated descriptions on product packaging.

High strain rate behaviour of polypropylene microfoams

NASA Astrophysics Data System (ADS)

Gómez-del Río, T.; Garrido, M. A.; Rodríguez, J.; Arencón, D.; Martínez, A. B.

2012-08-01

Microcellular materials such as polypropylene foams are often used in protective applications and passive safety for packaging (electronic components, aeronautical structures, food, etc.) or personal safety (helmets, knee-pads, etc.). In such applications the foams which are used are often designed to absorb the maximum energy and are generally subjected to severe loadings involving high strain rates. The manufacture process to obtain polymeric microcellular foams is based on the polymer saturation with a supercritical gas, at high temperature and pressure. This method presents several advantages over the conventional injection moulding techniques which make it industrially feasible. However, the effect of processing conditions such as blowing agent, concentration and microfoaming time and/or temperature on the microstructure of the resulting microcellular polymer (density, cell size and geometry) is not yet set up. The compressive mechanical behaviour of several microcellular polypropylene foams has been investigated over a wide range of strain rates (0.001 to 3000 s-1) in order to show the effects of the processing parameters and strain rate on the mechanical properties. High strain rate tests were performed using a Split Hopkinson Pressure Bar apparatus (SHPB). Polypropylene and polyethylene-ethylene block copolymer foams of various densities were considered.

High Performance Lithium-Ion Hybrid Capacitors Employing Fe3O4-Graphene Composite Anode and Activated Carbon Cathode.

PubMed

Zhang, Shijia; Li, Chen; Zhang, Xiong; Sun, Xianzhong; Wang, Kai; Ma, Yanwei

2017-05-24

Lithium-ion capacitors (LICs) are considered as promising energy storage devices to realize excellent electrochemical performance, with high energy-power output. In this work, we employed a simple method to synthesize a composite electrode material consisting of Fe 3 O 4 nanocrystallites mechanically anchored among the layers of three-dimensional arrays of graphene (Fe 3 O 4 -G), which exhibits several advantages compared with other traditional electrode materials, such as high Li storage capacity (820 mAh g -1 at 0.1 A g -1 ), high electrical conductivity, and improved electrochemical stability. Furthermore, on the basis of the appropriated charge balance between cathode and anode, we successfully fabricated Fe 3 O 4 -G//activated carbon (AC) soft-packaging LICs with a high energy density of 120.0 Wh kg -1 , an outstanding power density of 45.4 kW kg -1 (achieved at 60.5 Wh kg -1 ), and an excellent capacity retention of up to 94.1% after 1000 cycles and 81.4% after 10 000 cycles. The energy density of the Fe 3 O 4 -G//AC hybrid device is comparable with Ni-metal hydride batteries, and its capacitive power capability and cycle life is on par with supercapacitors (SCs). Therefore, this lithium-ion hybrid capacitor is expected to bridge the gap between Li-ion battery and SCs and gain bright prospects in next-generation energy storage fields.

Current topics in active and intelligent food packaging for preservation of fresh foods.

PubMed

Lee, Seung Yuan; Lee, Seung Jae; Choi, Dong Soo; Hur, Sun Jin

2015-11-01

The purpose of this review is to provide an overview of current packaging systems, e.g. active packaging and intelligent packaging, for various foods. Active packaging, such as modified atmosphere packaging (MAP), extends the shelf life of fresh produce, provides a high-quality product, reduces economic losses, including those caused by delay of ripening, and improves appearance. However, in active packaging, several variables must be considered, such as temperature control and different gas formulations with different product types and microorganisms. Active packaging refers to the incorporation of additive agents into packaging materials with the purpose of maintaining or extending food product quality and shelf life. Intelligent packaging is emerging as a potential advantage in food processing and is an especially useful tool for tracking product information and monitoring product conditions. Moreover, intelligent packaging facilitates data access and information exchange by altering conditions inside or outside the packaging and product. In spite of these advantages, few of these packaging systems are commercialized because of high cost, strict safety and hygiene regulations or limited consumer acceptance. Therefore more research is needed to develop cheaper, more easily applicable and effective packaging systems for various foods. © 2015 Society of Chemical Industry.

Modelled Cost-Effectiveness of a Package Size Cap and a Kilojoule Reduction Intervention to Reduce Energy Intake from Sugar-Sweetened Beverages in Australia.

PubMed

Crino, Michelle; Herrera, Ana Maria Mantilla; Ananthapavan, Jaithri; Wu, Jason H Y; Neal, Bruce; Lee, Yong Yi; Zheng, Miaobing; Lal, Anita; Sacks, Gary

2017-09-06

Interventions targeting portion size and energy density of food and beverage products have been identified as a promising approach for obesity prevention. This study modelled the potential cost-effectiveness of: a package size cap on single-serve sugar sweetened beverages (SSBs) >375 mL ( package size cap ), and product reformulation to reduce energy content of packaged SSBs ( energy reduction ). The cost-effectiveness of each intervention was modelled for the 2010 Australia population using a multi-state life table Markov model with a lifetime time horizon. Long-term health outcomes were modelled from calculated changes in body mass index to their impact on Health-Adjusted Life Years (HALYs). Intervention costs were estimated from a limited societal perspective. Cost and health outcomes were discounted at 3%. Total intervention costs estimated in AUD 2010 were AUD 210 million. Both interventions resulted in reduced mean body weight ( package size cap : 0.12 kg; energy reduction : 0.23 kg); and HALYs gained ( package size cap : 73,883; energy reduction : 144,621). Cost offsets were estimated at AUD 750.8 million ( package size cap ) and AUD 1.4 billion ( energy reduction ). Cost-effectiveness analyses showed that both interventions were "dominant", and likely to result in long term cost savings and health benefits. A package size cap and kJ reduction of SSBs are likely to offer excellent "value for money" as obesity prevention measures in Australia.

Modelled Cost-Effectiveness of a Package Size Cap and a Kilojoule Reduction Intervention to Reduce Energy Intake from Sugar-Sweetened Beverages in Australia

PubMed Central

Mantilla Herrera, Ana Maria; Neal, Bruce; Zheng, Miaobing; Lal, Anita; Sacks, Gary

2017-01-01

Interventions targeting portion size and energy density of food and beverage products have been identified as a promising approach for obesity prevention. This study modelled the potential cost-effectiveness of: a package size cap on single-serve sugar sweetened beverages (SSBs) >375 mL (package size cap), and product reformulation to reduce energy content of packaged SSBs (energy reduction). The cost-effectiveness of each intervention was modelled for the 2010 Australia population using a multi-state life table Markov model with a lifetime time horizon. Long-term health outcomes were modelled from calculated changes in body mass index to their impact on Health-Adjusted Life Years (HALYs). Intervention costs were estimated from a limited societal perspective. Cost and health outcomes were discounted at 3%. Total intervention costs estimated in AUD 2010 were AUD 210 million. Both interventions resulted in reduced mean body weight (package size cap: 0.12 kg; energy reduction: 0.23 kg); and HALYs gained (package size cap: 73,883; energy reduction: 144,621). Cost offsets were estimated at AUD 750.8 million (package size cap) and AUD 1.4 billion (energy reduction). Cost-effectiveness analyses showed that both interventions were “dominant”, and likely to result in long term cost savings and health benefits. A package size cap and kJ reduction of SSBs are likely to offer excellent “value for money” as obesity prevention measures in Australia. PMID:28878175

The Origin of Salt-Encased Sediment Packages: Observations from the SE Precaspian Basin (Kazakhstan)

NASA Astrophysics Data System (ADS)

Fernandez, Naiara; Duffy, Oliver B.; Hudec, Michael R.; Jackson, Martin P. A.; Burg, George; Jackson, Christopher A.-L.; Dooley, Tim P.

2017-04-01

Intrasalt sediment packages containing siliciclastic sediments, carbonate sediments, or non-halite evaporites such as gypsum or anhydrite are common within most salt sequences. Intrasalt sediment packages may have been deposited before, during, or after salt deposition and be incorporated into the salt by various processes. Understanding the origin and evolution of intrasalt sediment packages may yield important insights into the tectonic and geodynamic history of the basin, and also into the understanding of salt tectonics. Despite the importance of intrasalt sediment packages, currently there is no systematic description of their possible origins and their distinguishing criteria. This work is divided in three parts. First, we outline the possible origins of intrasalt sediment packages, as well as criteria to determine if they originated as subsalt, suprasalt or intrasalt sequences. Second, we examine how sediment packages that originated on top of salt, such as minibasins, can be encased within salt. We propose four key processes by which salt can be expelled and emplaced above minibasins to encase them: a) salt expulsion from beneath a minibasin experiencing density-driven subsidence; b) salt expulsion from beneath adjacent subsiding minibasins; c) salt expulsion associated with lateral shortening; d) override of minibasins by a salt sheet sourced from elsewhere. Third, we present a case study from the SE Precaspian Basin, Kazakhstan, where, using a borehole-constrained 3D seismic reflection dataset, the proposed criteria are applied to an area with abundant, newly discovered sediment packages within salt.

A methodology of SiP testing based on boundary scan

NASA Astrophysics Data System (ADS)

Qin, He; Quan, Haiyang; Han, Yifei; Zhu, Tianrui; Zheng, Tuo

2017-10-01

System in Package (SiP) play an important role in portable, aerospace and military electronic with the microminiaturization, light weight, high density, and high reliability. At present, SiP system test has encountered the problem on system complexity and malfunction location with the system scale exponentially increase. For SiP system, this paper proposed a testing methodology and testing process based on the boundary scan technology. Combining the character of SiP system and referencing the boundary scan theory of PCB circuit and embedded core test, the specific testing methodology and process has been proposed. The hardware requirement of the under test SiP system has been provided, and the hardware platform of the testing has been constructed. The testing methodology has the character of high test efficiency and accurate malfunction location.

Specificity of interactions among the DNA-packaging machine components of T4-related bacteriophages.

PubMed

Gao, Song; Rao, Venigalla B

2011-02-04

Tailed bacteriophages use powerful molecular motors to package the viral genome into a preformed capsid. Packaging at a rate of up to ∼2000 bp/s and generating a power density twice that of an automobile engine, the phage T4 motor is the fastest and most powerful reported to date. Central to DNA packaging are dynamic interactions among the packaging components, capsid (gp23), portal (gp20), motor (gp17, large "terminase"), and regulator (gp16, small terminase), leading to precise orchestration of the packaging process, but the mechanisms are poorly understood. Here we analyzed the interactions between small and large terminases of T4-related phages. Our results show that the gp17 packaging ATPase is maximally stimulated by homologous, but not heterologous, gp16. Multiple interaction sites are identified in both gp16 and gp17. The specificity determinants in gp16 are clustered in the diverged N- and C-terminal domains (regions I-III). Swapping of diverged region(s), such as replacing C-terminal RB49 region III with that of T4, switched ATPase stimulation specificity. Two specificity regions, amino acids 37-52 and 290-315, are identified in or near the gp17-ATPase "transmission" subdomain II. gp16 binding at these sites might cause a conformational change positioning the ATPase-coupling residues into the catalytic pocket, triggering ATP hydrolysis. These results lead to a model in which multiple weak interactions between motor and regulator allow dynamic assembly and disassembly of various packaging complexes, depending on the functional state of the packaging machine. This might be a general mechanism for regulation of the phage packaging machine and other complex molecular machines.

Miniature solid-state lasers for pointing, illumination, and warning devices

NASA Astrophysics Data System (ADS)

Brown, D. C.; Singley, J. M.; Yager, E.; Kowalewski, K.; Lotito, B.; Guelzow, J.; Hildreth, J.; Kuper, J. W.

2008-04-01

In this paper we review the current status of and progress towards higher power and more wavelength diverse diode-pumped solid-state miniature lasers. Snake Creek Lasers now offers unprecedented continuous wave (CW) output power from 9.0 mm and 5.6 mm TO type packages, including the smallest green laser in the world, the MicroGreen TM laser, and the highest density green laser in the world, the MiniGreen TM laser. In addition we offer an infrared laser, the MiniIR TM, operating at 1064 nm, and have just introduced a blue Mini laser operating at 473 nm in a 9.0 mm package. Recently we demonstrated over 1 W of output power at 1064 nm from a 12 mm TO type package, and green output power from 300-500 mW from the same 12 mm package. In addition, the company is developing a number of other innovative new miniature CW solid-state lasers operating at 750 nm, 820 nm, 458 nm, and an eye-safe Q-switched laser operating at 1550 nm. We also review recently demonstrated combining volume Bragg grating (VBG) technology has been combined with automatic power control (APC) to produce high power MiniGreen TM lasers whose output is constant to +/- 10 % over a wide temperature range, without the use of a thermoelectric cooler (TEC). This technology is expected to find widespread application in military and commercial applications where wide temperature operation is particularly important. It has immediate applications in laser pointers, illuminators, and laser flashlights, and displays.

Extreme temperature packaging: challenges and opportunities

NASA Astrophysics Data System (ADS)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

77 FR 3386 - Export and Reexport License Requirements for Certain Microwave and Millimeter Wave Electronic...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-01-24

... electronic components. The two components are packaged high electron mobility transistors and packaged..., 2012, FR Doc. 2012- 135). The two components are packaged high electron mobility transistors (HEMT) and...

The experimental charge-density approach in the evaluation of intermolecular interactions. Application of a new module of the XD programming package to several solids including a pentapeptide.

PubMed

Abramov, Y A; Volkov, A; Wu, G; Coppens, P

2000-11-01

A new module interfaced to the XD programming package has been used in the evaluation of intermolecular interactions and lattice energies of the crystals of p-nitroaniline, L-asparagine monohydrate and the pentapeptide Boc-Gln-D-Iva-Hyp-Ala-Phol (Boc = butoxycarbonyl, Iva = isovaline = ethylalanine, Phol = phenylalaninol). The electrostatic interactions are evaluated with the atom-centered distributed multipoles from KRMM (kappa'-restricted multipole model) refinements, using the Buckingham expression for non-overlapping charge densities. Results for p-nitroaniline are compared with Hartree-Fock (HF), density functional (DFT) and Moller-Plesset (MP2) supermolecular calculations and with HF and DFT periodic calculations. The HF and DFT methods fail to predict the stability of the p-nitroaniline crystal but the results of the experimental charge-density approach (ECDA) are in good agreement with both MP2 interaction energies and the experimental lattice energy. ECDA results for L-asparagine monohydrate compare well with those from DFT supermolecular and periodic HF calculations. The disorder of the terminal group in the pentapeptide, which persists at the experimental temperature of 20 K, corresponds to an energy difference of only 0.35 kJ mol(-1), which is too small to be reproduced with current methods.

Accelerating large scale Kohn-Sham density functional theory calculations with semi-local functionals and hybrid functionals

NASA Astrophysics Data System (ADS)

Lin, Lin

The computational cost of standard Kohn-Sham density functional theory (KSDFT) calculations scale cubically with respect to the system size, which limits its use in large scale applications. In recent years, we have developed an alternative procedure called the pole expansion and selected inversion (PEXSI) method. The PEXSI method solves KSDFT without solving any eigenvalue and eigenvector, and directly evaluates physical quantities including electron density, energy, atomic force, density of states, and local density of states. The overall algorithm scales as at most quadratically for all materials including insulators, semiconductors and the difficult metallic systems. The PEXSI method can be efficiently parallelized over 10,000 - 100,000 processors on high performance machines. The PEXSI method has been integrated into a number of community electronic structure software packages such as ATK, BigDFT, CP2K, DGDFT, FHI-aims and SIESTA, and has been used in a number of applications with 2D materials beyond 10,000 atoms. The PEXSI method works for LDA, GGA and meta-GGA functionals. The mathematical structure for hybrid functional KSDFT calculations is significantly different. I will also discuss recent progress on using adaptive compressed exchange method for accelerating hybrid functional calculations. DOE SciDAC Program, DOE CAMERA Program, LBNL LDRD, Sloan Fellowship.

Multiphonon: Phonon Density of States tools for Inelastic Neutron Scattering Powder Data

DOE Office of Scientific and Technical Information (OSTI.GOV)

Y. Y. Lin, Jiao; Islam, Fahima; Kresh, Max

The multiphonon python package calculates phonon density of states, a reduced representation of vibrational property of condensed matter (see, for example, Section “Density of Normal Modes” in Chapter 23 “Quantum Theory of the Harmonic Crystal” of (Ashcroft and Mermin 2011)), from inelastic neutron scattering (see, for example (B. Fultz et al. 2006–2016)) spectrum from a powder sample. Inelastic neutron spectroscopy (INS) is a probe of excitations in solids of vibrational or magnetic origins. In INS, neutrons can lose(gain) energy to(from) the solid in the form of quantized lattice vibrations – phonons. Measuring phonon density of states is usually the firstmore » step in determining the phonon properties of a material experimentally. Phonons play a very important role in understanding the physical properties of a solid, including thermal conductivity and electrical conductivity. Hence, INS is an important tool for studying thermoelectric materials (Budai et al. 2014, Li et al. (2015)), where low thermal conductivity and high electrical conductivity are desired. Study of phonon entropy also made important contributions to the research of thermal dynamics and phase stability of materials (B. Fultz 2010, bogdanoff2002phonon, swan2006vibrational).« less

Multiphonon: Phonon Density of States tools for Inelastic Neutron Scattering Powder Data

DOE PAGES

Y. Y. Lin, Jiao; Islam, Fahima; Kresh, Max

2018-01-29

The multiphonon python package calculates phonon density of states, a reduced representation of vibrational property of condensed matter (see, for example, Section “Density of Normal Modes” in Chapter 23 “Quantum Theory of the Harmonic Crystal” of (Ashcroft and Mermin 2011)), from inelastic neutron scattering (see, for example (B. Fultz et al. 2006–2016)) spectrum from a powder sample. Inelastic neutron spectroscopy (INS) is a probe of excitations in solids of vibrational or magnetic origins. In INS, neutrons can lose(gain) energy to(from) the solid in the form of quantized lattice vibrations – phonons. Measuring phonon density of states is usually the firstmore » step in determining the phonon properties of a material experimentally. Phonons play a very important role in understanding the physical properties of a solid, including thermal conductivity and electrical conductivity. Hence, INS is an important tool for studying thermoelectric materials (Budai et al. 2014, Li et al. (2015)), where low thermal conductivity and high electrical conductivity are desired. Study of phonon entropy also made important contributions to the research of thermal dynamics and phase stability of materials (B. Fultz 2010, bogdanoff2002phonon, swan2006vibrational).« less

Image-analysis library

NASA Technical Reports Server (NTRS)

1980-01-01

MATHPAC image-analysis library is collection of general-purpose mathematical and statistical routines and special-purpose data-analysis and pattern-recognition routines for image analysis. MATHPAC library consists of Linear Algebra, Optimization, Statistical-Summary, Densities and Distribution, Regression, and Statistical-Test packages.

Design, processing and testing of LSI arrays hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Salmassy, S.

1978-01-01

Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed.

Packaging - Materials review

DOE Office of Scientific and Technical Information (OSTI.GOV)

Herrmann, Matthias

2014-06-16

Nowadays, a large number of different electrochemical energy storage systems are known. In the last two decades the development was strongly driven by a continuously growing market of portable electronic devices (e.g. cellular phones, lap top computers, camcorders, cameras, tools). Current intensive efforts are under way to develop systems for automotive industry within the framework of electrically propelled mobility (e.g. hybrid electric vehicles, plug-in hybrid electric vehicles, full electric vehicles) and also for the energy storage market (e.g. electrical grid stability, renewable energies). Besides the different systems (cell chemistries), electrochemical cells and batteries were developed and are offered in manymore » shapes, sizes and designs, in order to meet performance and design requirements of the widespread applications. Proper packaging is thereby one important technological step for designing optimum, reliable and safe batteries for operation. In this contribution, current packaging approaches of cells and batteries together with the corresponding materials are discussed. The focus is laid on rechargeable systems for industrial applications (i.e. alkaline systems, lithium-ion, lead-acid). In principle, four different cell types (shapes) can be identified - button, cylindrical, prismatic and pouch. Cell size can be either in accordance with international (e.g. International Electrotechnical Commission, IEC) or other standards or can meet application-specific dimensions. Since cell housing or container, terminals and, if necessary, safety installations as inactive (non-reactive) materials reduce energy density of the battery, the development of low-weight packages is a challenging task. In addition to that, other requirements have to be fulfilled: mechanical stability and durability, sealing (e.g. high permeation barrier against humidity for lithium-ion technology), high packing efficiency, possible installation of safety devices (current interrupt device, valve, etc.), chemical inertness, cost issues, and others. Finally, proper cell design has to be considered for effective thermal management (i.e. cooling and heating) of battery packs.« less

Bio-inspired piezoelectric artificial hair cell sensor fabricated by powder injection molding

NASA Astrophysics Data System (ADS)

Han, Jun Sae; Oh, Keun Ha; Moon, Won Kyu; Kim, Kyungseop; Joh, Cheeyoung; Seo, Hee Seon; Bollina, Ravi; Park, Seong Jin

2015-12-01

A piezoelectric artificial hair cell sensor was fabricated by the powder injection molding process in order to make an acoustic vector hydrophone. The entire process of powder injection molding was developed and optimized for PMN-PZT ceramic powder. The artificial hair cell sensor, which consists of high aspect ratio hair cell and three rectangular mechanoreceptors, was precisely fabricated through the developed powder injection molding process. The density and the dielectric property of the fabricated sensor shows 98% of the theoretical density and 85% of reference dielectric property of PMN-PZT ceramic powder. With regard to homogeneity, three rectangular mechanoreceptors have the same dimensions, with 3 μm of tolerance with 8% of deviation of dielectric property. Packaged vector hydrophones measure the underwater acoustic signals from 500 to 800 Hz with -212 dB of sensitivity. Directivity of vector hydrophone was acquired at 600 Hz as analyzing phase differences of electric signals.

Waste Generator Instructions: Key to Successful Implementation of the US DOE's 435.1 for Transuranic Waste Packaging Instructions (LA-UR-12-24155) - 13218

DOE Office of Scientific and Technical Information (OSTI.GOV)

French, David M.; Hayes, Timothy A.; Pope, Howard L.

In times of continuing fiscal constraints, a management and operation tool that is straightforward to implement, works as advertised, and virtually ensures compliant waste packaging should be carefully considered and employed wherever practicable. In the near future, the Department of Energy (DOE) will issue the first major update to DOE Order 435.1, Radioactive Waste Management. This update will contain a requirement for sites that do not have a Waste Isolation Pilot Plant (WIPP) waste certification program to use two newly developed technical standards: Contact-Handled Defense Transuranic Waste Packaging Instructions and Remote-Handled Defense Transuranic Waste Packaging Instructions. The technical standards aremore » being developed from the DOE O 435.1 Notice, Contact-Handled and Remote-Handled Transuranic Waste Packaging, approved August 2011. The packaging instructions will provide detailed information and instruction for packaging almost every conceivable type of transuranic (TRU) waste for disposal at WIPP. While providing specificity, the packaging instructions leave to each site's own discretion the actual mechanics of how those Instructions will be functionally implemented at the floor level. While the Technical Standards are designed to provide precise information for compliant packaging, the density of the information in the packaging instructions necessitates a type of Rosetta Stone that translates the requirements into concise, clear, easy to use and operationally practical recipes that are waste stream and facility specific for use by both first line management and hands-on operations personnel. The Waste Generator Instructions provide the operator with step-by-step instructions that will integrate the sites' various operational requirements (e.g., health and safety limits, radiological limits or dose limits) and result in a WIPP certifiable waste and package that can be transported to and emplaced at WIPP. These little known but widely productive Waste Generator Instructions (WGIs) have been used occasionally in the past at large sites for treatment and packaging of TRU waste. The WGIs have resulted in highly efficient waste treatment, packaging and certification for disposal of TRU waste at WIPP. For example, a single WGI at LANL, combined with an increase in gram loading, resulted in a mind boggling 6,400% increase in waste loading for {sup 238}Pu heat source waste. In fact, the WGI combined with a new Contact Handled (CH) TRU Waste Content (TRUCON) Code provided a massive increase in shippable wattage per Transuranic Package Transporter-II (TRUPACT-II) over the previously used and more restrictive TRUCON Code that have been used previously for the heat source waste. In fact, the use of the WGI process at LANL's TA-55 facility reduced non-compliant drums for WIPP certification and disposal from a 13% failure rate down to a 0.5% failure rate and is expected to further reduce the failure rate to zero drums per year. The inherent value of the WGI is that it can be implemented in a site's current procedure issuance process and it provides documented proof of what actions were taken for each waste stream packaged. The WGI protocol provides a key floor-level operational component to achieve goal alignment between actual site operations, the WIPP TRU waste packaging instructions, and DOE O 435.1. (authors)« less

A Package of Information as the Planck Unit of Information and Also as a Fundamental Physical (Universal) Constant

NASA Astrophysics Data System (ADS)

Gholibeigian, Hassan

Dimension of information as the fifth dimension of the universe including packages of new information, is nested with space-time. Distributed density of information is matched on its correspondence distributed mater in space-time. Fundamental particle (string) like photon and graviton needs a package of information including its exact quantum state and law for process and travel a Planck length in a Planck time. This process is done via sub-particles (substrings). Processed information is carried by particle as the universe's history. My proposed formula for Planck unit of information (IP) and also for Fundamental Physical (Universal) Constant is: IP =lP ct P =1 Planck length lP, Planck time tP, and c , is light speed. Also my proposed formula for calculation of the packages is: I =tP- 1 . τ , in which, I is number of packages, and τ is lifetime of the particle. ``Communication of information'' as a ``fundamental symmetry'' leads phenomena. Packages should be always up to date including new information for evolution of the Universe. But, where come from or how are created new information which Hawking and his colleagues forgot it bring inside the black hole and leave it behind the horizon in form of soft hair?

Back-illuminated imager and method for making electrical and optical connections to same

NASA Technical Reports Server (NTRS)

Pain, Bedabrata (Inventor)

2010-01-01

Methods for bringing or exposing metal pads or traces to the backside of a backside-illuminated imager allow the pads or traces to reside on the illumination side for electrical connection. These methods provide a solution to a key packaging problem for backside thinned imagers. The methods also provide alignment marks for integrating color filters and microlenses to the imager pixels residing on the frontside of the wafer, enabling high performance multispectral and high sensitivity imagers, including those with extremely small pixel pitch. In addition, the methods incorporate a passivation layer for protection of devices against external contamination, and allow interface trap density reduction via thermal annealing. Backside-illuminated imagers with illumination side electrical connections are also disclosed.

Integrated Avionics System (IAS)

NASA Technical Reports Server (NTRS)

Hunter, D. J.

2001-01-01

As spacecraft designs converge toward miniaturization and with the volumetric and mass constraints placed on avionics, programs will continue to advance the 'state of the art' in spacecraft systems development with new challenges to reduce power, mass, and volume. Although new technologies have improved packaging densities, a total system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and scalability to accommodate multiple missions. With these challenges in mind, a novel packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. This paper will describe the fundamental elements of the Integrated Avionics System (IAS), Horizontally Mounted Cube (HMC) hardware design, system and environmental test results. Additional information is contained in the original extended abstract.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Larbalestier, David C.; Lee, Peter J.; Tarantini, Chiara

All present circular accelerators use superconducting magnets to bend and to focus the particle beams. The most powerful of these machines is the large hadron collider (LHC) at CERN. The main ring dipole magnets of the LHC are made from Nb-Ti but, as the machine is upgraded to higher luminosity, more powerful magnets made of Nb 3Sn will be required. Our work addresses how to make the Nb 3Sn conductors more effective and more suitable for use in the LHC. The most important property of the superconducting conductor used for an accelerator magnet is that it must have very highmore » critical current density, the property that allows the generation of high magnetic fields in small spaces. Nb 3Sn is the original high field superconductor, the material which was discovered in 1960 to allow a high current density in the field of about 9 T. For the high luminosity upgrade of the LHC, much higher current densities in fields of about 12 Tesla will be required. The critical value of the current density is of order 2600 A/mm 2 in a field of 12 Tesla. But there are very important secondary factors that complicate the attainment of this critical current density. The first is that the effective filament diameter must be no larger than about 40 µm. The second factor is that 50% of the cross-section of the Nb 3Sn conductor that is pure copper must be protected from any poisoning by any Sn leakage through the diffusion barrier that protects the package of niobium and tin from which the Nb 3Sn is formed by a high temperature reaction. These three, somewhat conflicting requirements, mean that optimization of the conductor is complex. The work described in this contract report addresses these conflicting requirements. They show that very sophisticated characterizations can uncover the way to satisfy all 3 requirements and they also suggest that the ultimate optimization of Nb 3Sn is still not yet in sight« less

Starch-based Antimicrobial Films Incorporated with Lauric Acid and Chitosan

NASA Astrophysics Data System (ADS)

Salleh, E.; Muhamad, I. I.

2010-03-01

Antimicrobial (AM) packaging is one of the most promising active packaging systems. Starch-based film is considered an economical material for antimicrobial packaging. This study aimed at the development of food packaging based on wheat starch incorporated with lauric acid and chitosan as antimicrobial agents. The purpose is to restrain or inhibit the growth of spoilage and/or pathogenic microorganisms that are contaminating foods. The antimicrobial effect was tested on B. substilis and E. coli. Inhibition of bacterial growth was examined using two methods, i.e. zone of inhibition test on solid media and liquid culture test (optical density measurements). The control and AM films (incorporated with chitosan and lauric acid) were produced by casting method. From the observations, AM films exhibited inhibitory zones. Interestingly, a wide clear zone on solid media was observed for B. substilis growth inhibition whereas inhibition for E. coli was not as effective as B. substilis. From the liquid culture test, the AM films clearly demonstrated a better inhibition against B. substilis than E. coli.

AIN-Based Packaging for SiC High-Temperature Electronics

NASA Technical Reports Server (NTRS)

Savrun, Ender

2004-01-01

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.

2001-01-01

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2016-01-01

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

Shuttle derived atmospheric density model. Part 2: STS atmospheric implications for AOTV trajectory analysis, a proposed GRAM perturbation density model

NASA Technical Reports Server (NTRS)

Findlay, J. T.; Kelly, G. M.; Troutman, P. A.

1984-01-01

A perturbation model to the Marshall Space Flight Center (MSFC) Global Reference Atmosphere Model (GRAM) was developed for use in the Aeroassist Orbital Transfer Vehicle (AOTV) trajectory and analysis. The model reflects NASA Space Shuttle experience over the first twelve entry flights. The GRAM was selected over the Air Force 1978 Reference Model because of its more general formulation and wider use throughout NASA. The add-on model, a simple scaling with altitude to reflect density structure encountered by the Shuttle Orbiter was selected principally to simplify implementation. Perturbations, by season, can be utilized to minimize the number of required simulations, however, exact Shuttle flight history can be exercised using the same model if desired. Such a perturbation model, though not meteorologically motivated, enables inclusion of High Resolution Accelerometer Package (HiRAP) results in the thermosphere. Provision is made to incorporate differing perturbations during the AOTV entry and exit phases of the aero-asist maneuver to account for trajectory displacement (geographic) along the ground track.

The incompressibility assumption in computational simulations of nasal airflow.

PubMed

Cal, Ismael R; Cercos-Pita, Jose Luis; Duque, Daniel

2017-06-01

Most of the computational works on nasal airflow up to date have assumed incompressibility, given the low Mach number of these flows. However, for high temperature gradients, the incompressibility assumption could lead to a loss of accuracy, due to the temperature dependence of air density and viscosity. In this article we aim to shed some light on the influence of this assumption in a model of calm breathing in an Asian nasal cavity, by solving the fluid flow equations in compressible and incompressible formulation for different ambient air temperatures using the OpenFOAM package. At low flow rates and warm climatological conditions, similar results were obtained from both approaches, showing that density variations need not be taken into account to obtain a good prediction of all flow features, at least for usual breathing conditions. This agrees with most of the simulations previously reported, at least as far as the incompressibility assumption is concerned. However, parameters like nasal resistance and wall shear stress distribution differ for air temperatures below [Formula: see text]C approximately. Therefore, density variations should be considered for simulations at such low temperatures.

Polyethylene glycol grafted polyethylene: a versatile platform for nonmigratory active packaging applications.

PubMed

Barish, Jeffrey A; Goddard, Julie M

2011-01-01

Nonmigratory active packaging, in which bioactive components are tethered to the package, offers the potential to reduce the need for additives in food products while maintaining safety and quality. A challenge in developing nonmigratory active packaging materials is the loss of biomolecular activity that can occur when biomolecules are immobilized. In this work, we describe a method in which a biocompatible polymer (polyethylene glycol, PEG) is grafted from the surface of ozone-treated low-density polyethylene (LDPE) resulting in a surface functionalized polyethylene to which a range of amine-terminated bioactive molecules can be immobilized. Free radical graft polymerization is used to graft PEG onto the LDPE surface, followed by immobilization of ethylenediamine onto the PEG tether. Ethylenediamine was used to demonstrate that amine-terminated molecules could be covalently attached to the PEG-grafted film. Changes in surface chemistry and topography were measured by attenuated total reflectance Fourier transform infrared spectroscopy, contact angle, atomic force microscopy, scanning electron microscopy, and X-ray photoelectron spectroscopy. We demonstrate the ability to graft PEG onto the surface of polymer packaging films by free radical graft polymerization, and to covalently link an amine-terminated molecule to the PEG tether, demonstrating that amine-terminated bioactive compounds (such as peptides, enzymes, and some antimicrobials) can be immobilized onto PEG-grafted LDPE in the development of nonmigratory active packaging.   Nonmigratory active packaging offers the potential for improving food safety and quality while minimizing the migration of the active agent into food. In this paper, we describe a technique to modify polyethylene packaging films such that active agents can be covalently immobilized by a biocompatible tether. Such a technique can be adapted to a number of applications such as antimicrobial, antioxidant, or immobilized enzyme active packaging. © 2011 Institute of Food Technologists®

Modeling Transport of Relativistic Electrons through Warm-Dense Matter Using Collisional PIC

NASA Astrophysics Data System (ADS)

May, J.; McGuffey, C.; Yabuuchi, T.; Wei, Ms; Beg, F.; Mori, Wb

2017-10-01

In electron transport experiments performed on the OMEGA EP laser system, a relativistic electron beam was created by focusing a high intensity (eA /me c > 1) laser onto a gold (Au) foil. Behind the Au foil was a layer of plastic (CH) foam, with an initial density of 200mg /cm3 . Before the high intensity laser was switched on, this foam was either left unperturbed; or it was shocked using a lower intensity laser (eA /me c 10-4) with beam path perpendicular to the high intensity laser, which left the CH layer in a warm dense matter (WDM) state with temperature of 40 eV and density of 30mg /cm3 . The electron beam was imaged by observing the k- α signal from a copper foil on the far side from the Au. The result was that transport was decreased by an order of magnitude in the WDM compared to the cold foam. We have modeled this experiment using the PIC code OSIRIS, with also a Monte Carlo Coulomb collision package. Our simulations indicate that the main cause of the differences in transport is a collimating magnetic field in the higher density, cold foam, created by collisional resistivity. The plasma density of the Au layer, difficult to model fully in PIC, appears to effect the heat capacity and therefore temperature and resistivity of the target. The authors acknowledge the support of the Department of Energy under contract DE-NA 0001833 and the National Science Foundation under contract ACI 1339893.

A highly miniaturized vacuum package for a trapped ion atomic clock

DOE PAGES

Schwindt, Peter D. D.; Jau, Yuan-Yu; Partner, Heather; ...

2016-05-12

We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm 3 in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, the packagemore » was sealed with a copper pinch-off and was then pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of 171Yb +. The fractional frequency stability of the clock was measured to be 2 × 10 -11 / τ 1/2.« less

Fundamental properties of monolithic bentonite buffer material formed by cold isostatic pressing for high-level radioactive waste repository

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kawakami, S.; Yamanaka, Y.; Kato, K.

1999-07-01

The methods of fabrication, handling, and emplacement of engineered barriers used in a deep geological repository for high level radioactive waste should be planned as simply as possible from the engineering and economic viewpoints. Therefore, a new concept of a monolithic buffer material around a waste package have been proposed instead of the conventional concept with the use of small blocks, which would decrease the cost for buffer material. The monolithic buffer material is composed of two parts of highly compacted bentonite, a cup type body and a cover. As the forming method of the monolithic buffer material, compaction bymore » the cold isostatic pressing process (CIP) has been employed. In this study, monolithic bentonite bodies with the diameter of about 333 mm and the height of about 455 mm (corresponding to the approx. 1/5 scale for the Japanese reference concept) were made by the CIP of bentonite powder. The dry densities: {rho}d of the bodies as a whole were measured and the small samples were cut from several locations to investigate the density distribution. The swelling pressure and hydraulic conductivity as function of the monolithic body density for CIP-formed specimens were also measured. High density ({rho}d: 1.4--2.0 Mg/m{sup 3}) and homogeneous monolithic bodies were formed by the CIP. The measured results of the swelling pressure (3--15 MPa) and hydraulic conductivity (0.5--1.4 x 10{sup {minus}13} m/s) of the specimens were almost the same as those for the uniaxial compacted bentonite in the literature. It is shown that the vacuum hoist system is an applicable handling method for emplacement of the monolithic bentonite.« less

flexsurv: A Platform for Parametric Survival Modeling in R

PubMed Central

Jackson, Christopher H.

2018-01-01

flexsurv is an R package for fully-parametric modeling of survival data. Any parametric time-to-event distribution may be fitted if the user supplies a probability density or hazard function, and ideally also their cumulative versions. Standard survival distributions are built in, including the three and four-parameter generalized gamma and F distributions. Any parameter of any distribution can be modeled as a linear or log-linear function of covariates. The package also includes the spline model of Royston and Parmar (2002), in which both baseline survival and covariate effects can be arbitrarily flexible parametric functions of time. The main model-fitting function, flexsurvreg, uses the familiar syntax of survreg from the standard survival package (Therneau 2016). Censoring or left-truncation are specified in ‘Surv’ objects. The models are fitted by maximizing the full log-likelihood, and estimates and confidence intervals for any function of the model parameters can be printed or plotted. flexsurv also provides functions for fitting and predicting from fully-parametric multi-state models, and connects with the mstate package (de Wreede, Fiocco, and Putter 2011). This article explains the methods and design principles of the package, giving several worked examples of its use. PMID:29593450

Optomechanical Design and Characterization of a Printed-Circuit-Board-Based Free-Space Optical Interconnect Package

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Marchand, Philippe J.; Huang, Dawei; Kibar, Osman; Ozkan, Nur S. E.; Esener, Sadik C.

1999-09-01

We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI s) can be integrated simply on electronic multichip modules (MCM s) for intra-MCM board interconnects. Our system-level packaging architecture is based on a modified folded 4 f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than 20 dB at low frequency have been measured. The system is compact at only 10 in. 3 (25.4 cm 3 ) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.

An insight into the dopant selection for CeO2-based resistive-switching memory system: a DFT and experimental study

NASA Astrophysics Data System (ADS)

Hussain, Fayyaz; Imran, Muhammad; Rana, Anwar Manzoor; Khalil, R. M. Arif; Khera, Ejaz Ahmad; Kiran, Saira; Javid, M. Arshad; Sattar, M. Atif; Ismail, Muhammad

2018-03-01

The aim of this study is to figure out better metal dopants for CeO2 for designing highly efficient non-volatile memory (NVM) devices. The present DFT work involves four different metals doped interstitially and substitutionally in CeO2 thin films. First principle calculations involve electron density of states (DOS) and partial density of states (PDOS), and isosurface charge densities are carried out within the plane-wave density functional theory using GGA and GGA + U approach by employing the Vienna ab initio simulation package VASP. Isosurface charge density plots confirmed that interstitial doping of Zr and Ti metals truly assists in generating conduction filaments (CFs), while substitutional doping of these metals cannot do so. Substitutional doping of W may contribute in generating CFs in CeO2 directly, but its interstitial doping improves conductivity of CeO2. However, Ni-dopant is capable of directly generating CFs both as substitutional and interstitial dopants in ceria. Such a capability of Ni appears acting as top electrode in Ni/CeO2/Pt memory devices, but its RS behavior is not so good. On inserting Zr layer to make Ni/Zr:CeO2/Pt memory stacks, Ni does not contribute in RS characteristics, but Zr plays a vital role in forming CFs by creating oxygen vacancies and forming ZrO2 interfacial layer. Therefore, Zr-doped devices exhibit high-resistance ratio of 104 and good endurance as compared to undoped devices suitable for RRAM applications.

Impact of Data Transmission over 10 Gbps on High-Density and Low-Cost Optoelectronic Module with Polynorbornene Waveguides

NASA Astrophysics Data System (ADS)

Ito, Yuka; Terada, Shinsuke; Arai, Shinya; Fujiwara, Makoto; Mori, Tetsuya; Choki, Koji; Fukushima, Takafumi; Koyanagi, Mitsumasa

2012-04-01

We proposed a rigid/flex optoelectronic (O/E) module with 48-channel polymeric waveguides for short-distance board-level optical interconnection. A flexible O/E test module was fabricated in the following two steps by using standard packaging processes. First, two vertical cavity surface emitting laser diodes (VCSELs) and one VCSEL driver (VD) were flip-chip bonded to a completed flexible printed circuit board (PCB), and two photodiodes (PDs) and one transimpedance amplifier/limiting amplifier (TIA/LA) to another flexible PCB. Second, the two flexible PCBs were attached with a polynorbornene (PNB) sheet in which high-density PNB waveguides were formed by UV exposure. Active areas of VCSELs and PDs on the flexible PCBs were aligned to micromirrors of the waveguides with -6 µm offset toward the signal propagation direction. We successfully demonstrated data transmission over 10 Gbps and low inter-channel crosstalk of less than -20 dB was achieved in the flexible O/E test module with 120-mm-long and 62.5-µm-pitch waveguides.

Integrated on-chip solid state capacitor based on vertically aligned carbon nanofibers, grown using a CMOS temperature compatible process

NASA Astrophysics Data System (ADS)

Saleem, Amin M.; Andersson, Rickard; Desmaris, Vincent; Enoksson, Peter

2018-01-01

Complete miniaturized on-chip integrated solid-state capacitors have been fabricated based on conformal coating of vertically aligned carbon nanofibers (VACNFs), using a CMOS temperature compatible microfabrication processes. The 5 μm long VACNFs, operating as electrode, are grown on a silicon substrate and conformally coated by aluminum oxide dielectric using atomic layer deposition (ALD) technique. The areal (footprint) capacitance density value of 11-15 nF/mm2 is realized with high reproducibility. The CMOS temperature compatible microfabrication, ultra-low profile (less than 7 μm thickness) and high capacitance density would enables direct integration of micro energy storage devices on the active CMOS chip, multi-chip package and passives on silicon or glass interposer. A model is developed to calculate the surface area of VACNFs and the effective capacitance from the devices. It is thereby shown that 71% of surface area of the VACNFs has contributed to the measured capacitance, and by using the entire area the capacitance can potentially be increased.

A High Power Density Power System Electronics for NASA's Lunar Reconnaissance Orbiter

NASA Technical Reports Server (NTRS)

Hernandez-Pellerano, A.; Stone, R.; Travis, J.; Kercheval, B.; Alkire, G.; Ter-Minassian, V.

2009-01-01

A high power density, modular and state-of-the-art Power System Electronics (PSE) has been developed for the Lunar Reconnaissance Orbiter (LRO) mission. This paper addresses the hardware architecture and performance, the power handling capabilities, and the fabrication technology. The PSE was developed by NASA s Goddard Space Flight Center (GSFC) and is the central location for power handling and distribution of the LRO spacecraft. The PSE packaging design manages and distributes 2200W of solar array input power in a volume less than a cubic foot. The PSE architecture incorporates reliable standard internal and external communication buses, solid state circuit breakers and LiIon battery charge management. Although a single string design, the PSE achieves high reliability by elegantly implementing functional redundancy and internal fault detection and correction. The PSE has been environmentally tested and delivered to the LRO spacecraft for the flight Integration and Test. This modular design is scheduled to flight in early 2009 on board the LRO and Lunar Crater Observation and Sensing Satellite (LCROSS) spacecrafts and is the baseline architecture for future NASA missions such as Global Precipitation Measurement (GPM) and Magnetospheric MultiScale (MMS).

Exploring packaging strategies of nano-embedded thermoelectric generators

DOE Office of Scientific and Technical Information (OSTI.GOV)

Singha, Aniket; Muralidharan, Bhaskaran, E-mail: bm@ee.iitb.ac.in; Mahanti, Subhendra D.

2015-10-15

Embedding nanostructures within a bulk matrix is an important practical approach towards the electronic engineering of high performance thermoelectric systems. For power generation applications, it ideally combines the efficiency benefit offered by low dimensional systems along with the high power output advantage offered by bulk systems. In this work, we uncover a few crucial details about how to embed nanowires and nanoflakes in a bulk matrix so that an overall advantage over pure bulk may be achieved. First and foremost, we point out that a performance degradation with respect to bulk is inevitable as the nanostructure transitions to a multimore » moded one. It is then shown that a nano embedded system of suitable cross-section offers a power density advantage over a wide range of efficiencies at higher packing fractions, and this range gradually narrows down to the high efficiency regime, as the packing fraction is reduced. Finally, we introduce a metric - the advantage factor, to elucidate quantitatively, the enhancement in the power density offered via nano-embedding at a given efficiency. In the end, we explore the maximum effective width of nano-embedding which serves as a reference in designing generators in the efficiency range of interest.« less

Progress in composite structure and space construction systems technology

NASA Technical Reports Server (NTRS)

Bodle, J. B.; Jenkins, L. M.

1981-01-01

The development of deployable and fabricated composite trusses for large space structures by NASA and private industry is reviewed. Composite materials technology is discussed with a view toward fabrication processes and the characteristics of finished truss beams. Advances in roll-forming open section caps from graphite-composite strip material and new ultrasonic welding techniques are outlined. Vacuum- and gravity-effect test results show that the ultrasonic welding of graphite-thermoplastic materials in space is feasible. The structural characteristics of a prototype truss segment are presented. A new deployable graphite-composite truss with high packaging density for broad application to large space platforms is described.

New Developments in Nickel-Hydrogen Dependent Pressure Vessel (DPV) Cell and Battery Design

NASA Technical Reports Server (NTRS)

Caldwell, Dwight B.; Fox, Chris L.; Miller, Lee E.

1997-01-01

THe Dependent Pressure Vessel (DPV) Nickel-Hydrogen (NiH2) design is being developed as an advanced battery for military and commercial, aerospace and terrestrial applications. The DPV cell design offers high specific energy and energy density as well as reduced cost, while retaining the established Individual Pressure Vessel (IPV) technology flight heritage and database. This advanced DPV design also offers a more efficient mechanical, electrical and thermal cell and battery configuration and a reduced part count. The DPV battery design promotes compact, minimum volume packaging and weight efficiency, and delivers cost and weight savings with minimal design risk.

Modeling the Structure of Helical Assemblies with Experimental Constraints in Rosetta.

PubMed

André, Ingemar

2018-01-01

Determining high-resolution structures of proteins with helical symmetry can be challenging due to limitations in experimental data. In such instances, structure-based protein simulations driven by experimental data can provide a valuable approach for building models of helical assemblies. This chapter describes how the Rosetta macromolecular package can be used to model homomeric protein assemblies with helical symmetry in a range of modeling scenarios including energy refinement, symmetrical docking, comparative modeling, and de novo structure prediction. Data-guided structure modeling of helical assemblies with experimental information from electron density, X-ray fiber diffraction, solid-state NMR, and chemical cross-linking mass spectrometry is also described.

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2011 CFR

2011-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2013 CFR

2013-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2014 CFR

2014-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

10 CFR 60.135 - Criteria for the waste package and its components.

Code of Federal Regulations, 2012 CFR

2012-01-01

... IN GEOLOGIC REPOSITORIES Technical Criteria Design Criteria for the Waste Package § 60.135 Criteria for the waste package and its components. (a) High-level-waste package design in general. (1) Packages for HLW shall be designed so that the in situ chemical, physical, and nuclear properties of the waste...

High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhou, Yongcun; Liu, Feng, E-mail: liufeng@nwpu.edu.cn

2016-08-22

The increasing density of electronic devices underscores the need for efficient thermal management. Silver nanowires (AgNWs), as one-dimensional nanostructures, possess a high aspect ratio and intrinsic thermal conductivity. However, high electrical conductivity of AgNWs limits their application for electronic packaging. We synthesized boron nitride-coated silver nanowires (AgNWs@BN) using a flexible and fast method followed by incorporation into synthetic polyimide (PI) for enhanced thermal conductivity and dielectric properties of nanocomposites. The thinner boron nitride intermediate nanolayer on AgNWs not only alleviated the mismatch between AgNWs and PI but also enhanced their interfacial interaction. Hence, the maximum thermal conductivity of an AgNWs@BN/PImore » composite with a filler loading up to 20% volume was increased to 4.33 W/m K, which is an enhancement by nearly 23.3 times compared with that of the PI matrix. The relative permittivity and dielectric loss were about 9.89 and 0.015 at 1 MHz, respectively. Compared with AgNWs@SiO{sub 2}/PI and Ag@BN/PI composites, boron nitride-coated core-shell structures effectively increased the thermal conductivity and reduced the permittivity of nanocomposites. The relative mechanism was studied and discussed. This study enables the identification of appropriate modifier fillers for polymer matrix nanocomposites.« less

Effects of deceptive packaging and product involvement on purchase intention: an elaboration likelihood model perspective.

PubMed

Lammers, H B

2000-04-01

From an Elaboration Likelihood Model perspective, it was hypothesized that postexposure awareness of deceptive packaging claims would have a greater negative effect on scores for purchase intention by consumers lowly involved rather than highly involved with a product (n = 40). Undergraduates who were classified as either highly or lowly (ns = 20 and 20) involved with M&Ms examined either a deceptive or non-deceptive package design for M&Ms candy and were subsequently informed of the deception employed in the packaging before finally rating their intention to purchase. As anticipated, highly deceived subjects who were low in involvement rated intention to purchase lower than their highly involved peers. Overall, the results attest to the robustness of the model and suggest that the model has implications beyond advertising effects and into packaging effects.

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Merging parallel optics packaging and surface mount technologies

NASA Astrophysics Data System (ADS)

Kopp, Christophe; Volpert, Marion; Routin, Julien; Bernabé, Stéphane; Rossat, Cyrille; Tournaire, Myriam; Hamelin, Régis

2008-02-01

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

Effect of TiO2 photocatalytic activity in a HDPE-based food packaging on the structural and microbiological stability of a short-ripened cheese.

PubMed

Gumiero, Matteo; Peressini, Donatella; Pizzariello, Andrea; Sensidoni, Alessandro; Iacumin, Lucilla; Comi, Giuseppe; Toniolo, Rosanna

2013-06-01

A high density polyethylene (HDPE)/calcium carbonate (CaCO(3)) film containing TiO(2) was prepared via blown film extrusion process. The photocatalytic properties of this film were evaluated by voltammetric, UV-Vis spectrophotometric and gas chromatographic measurements following the decomposition rate of suitably selected molecular probes, such as 4-hydroxybenzoic acid and methylene blue. The film containing 1% w/w of TiO(2) displayed a profitable and reproducible photoinduced degradation activity towards target organic compounds. The effect of packaging photocatalytic activity on the structural and microbiological stability of a short-ripened cheese was studied. Cheese structure was assessed by dynamic, small deformation rheological tests. A container consisting of a multilayer material, where the layer brought in contact with the food, made from the HDPE+CaCO(3)+TiO(2) composite matrix, was able to provide a greater maintenance of the original cheese structure than a rigid container currently used, mainly due to the inhibition of lactic acid bacteria and coliforms. Copyright © 2012 Elsevier Ltd. All rights reserved.

The disposal of nuclear waste in space

NASA Technical Reports Server (NTRS)

Burns, R. E.

1978-01-01

The important problem of disposal of nuclear waste in space is addressed. A prior study proposed carrying only actinide wastes to space, but the present study assumes that all actinides and all fission products are to be carried to space. It is shown that nuclear waste in the calcine (oxide) form can be packaged in a container designed to provide thermal control, radiation shielding, mechanical containment, and an abort reentry thermal protection system. This package can be transported to orbit via the Space Shuttle. A second Space Shuttle delivers an oxygen-hydrogen orbit transfer vehicle to a rendezvous compatible orbit and the mated OTV and waste package are sent to the preferred destination. Preferred locations are either a lunar crater or a solar orbit. Shuttle traffic densities (which vary in time) are given and the safety of space disposal of wastes discussed.

Extended Lagrangian Density Functional Tight-Binding Molecular Dynamics for Molecules and Solids.

PubMed

Aradi, Bálint; Niklasson, Anders M N; Frauenheim, Thomas

2015-07-14

A computationally fast quantum mechanical molecular dynamics scheme using an extended Lagrangian density functional tight-binding formulation has been developed and implemented in the DFTB+ electronic structure program package for simulations of solids and molecular systems. The scheme combines the computational speed of self-consistent density functional tight-binding theory with the efficiency and long-term accuracy of extended Lagrangian Born-Oppenheimer molecular dynamics. For systems without self-consistent charge instabilities, only a single diagonalization or construction of the single-particle density matrix is required in each time step. The molecular dynamics simulation scheme can be applied to a broad range of problems in materials science, chemistry, and biology.

Plastic-Sealed Hybrid Power Circuit Package

NASA Technical Reports Server (NTRS)

Miller, W. N.; Gray, O. E.

1983-01-01

Proposed design for hybrid high-voltage power-circuit package uses molded plastic for hermetic sealing instead of glass-to-metal seal. New package used to house high-voltage regulators and solid-state switches for applications in aircraft, electric automobiles, industrial equipment, satellites, solarcell arrays, and other equipment in extreme environments.

A computational framework for automation of point defect calculations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Goyal, Anuj; Gorai, Prashun; Peng, Haowei

We have developed a complete and rigorously validated open-source Python framework to automate point defect calculations using density functional theory. Furthermore, the framework provides an effective and efficient method for defect structure generation, and creation of simple yet customizable workflows to analyze defect calculations. This package provides the capability to compute widely-accepted correction schemes to overcome finite-size effects, including (1) potential alignment, (2) image-charge correction, and (3) band filling correction to shallow defects. Using Si, ZnO and In2O3 as test examples, we demonstrate the package capabilities and validate the methodology.

A computational framework for automation of point defect calculations

DOE PAGES

Goyal, Anuj; Gorai, Prashun; Peng, Haowei; ...

2017-01-13

We have developed a complete and rigorously validated open-source Python framework to automate point defect calculations using density functional theory. Furthermore, the framework provides an effective and efficient method for defect structure generation, and creation of simple yet customizable workflows to analyze defect calculations. This package provides the capability to compute widely-accepted correction schemes to overcome finite-size effects, including (1) potential alignment, (2) image-charge correction, and (3) band filling correction to shallow defects. Using Si, ZnO and In2O3 as test examples, we demonstrate the package capabilities and validate the methodology.

Design automation for complex CMOS/SOS LSI hybrid substrates

NASA Technical Reports Server (NTRS)

Ramondetta, P. W.; Smiley, J. W.

1976-01-01

A design automated approach used to develop thick-film hybrid packages is described. The hybrid packages produced combine thick-film and silicon on sapphire (SOS) laser surface interaction technologies to bring the on-chip performance level of SOS to the subsystem level. Packing densities are improved by a factor of eight over ceramic dual in-line packing; interchip wiring capacitance is low. Due to significant time savings, the design automated approach presented can be expected to yield a 3:1 reduction in cost over the use of manual methods for the initial design of a hybrid.

Agony of the ecstasy: report of five cases of MDMA smuggling.

PubMed

Low, V H S; Dillon, E K

2005-10-01

The international smuggling of illicit drugs by the ingestion or rectal insertion of drug-filled packages is recognized in the trafficking of heroin and cocaine. Customs authorities, with suspicion of such activities, presented five subjects. The legally allowed radiological examination comprising one supine abdominal radiograph was performed. Radiographic findings demonstrated the presence of multiple enteric oval, capsule-shaped packages of soft tissue density. This was confirmed following supervised evacuation of bowel contents induced by the administration of laxatives. Analysis of the concealed material identified ecstasy (methylenedioxymethamphetamine (MDMA)), a substance not previously reported as transported by this route.

In Situ Packaging FeFx into Sack-like Carbon Nanoreactors: A Smart Way To Make Soluble Fluorides Applicable to Aqueous Batteries.

PubMed

Jiang, Jian; Li, Linpo; Xu, Maowen; Zhu, Jianhui; Li, Chang Ming

2016-02-17

Ferruginous materials have long attracted great interest in aqueous batteries since Fe is an earth-abundant and low toxic element. However, their practical application is severely hindered by their poor structural stability during deep cycling. To maximize their cyclability, we herein propose a simple and effective method, by in situ packaging Fe-based materials into carbon nanosacks via a facile CVD approach. To verify our strategy, we purposely choose water-soluble Fe2F5 as a study paradigm. The in situ formed Fe2F5@C nanosacks product exhibits prominent anodic performance with high electrochemical activity and capacity, obviously prolonged cyclic lifetime, and outstanding rate capabilities. Besides, by pairing with the cathode of α-Co(OH)2 nanowire arrays@carbon cloth, a full device of rechargeable aqueous batteries has been developed, capable to deliver both high specific energy and power densities (Max. values reaching up to ∼163 Wh kg(-1) and ∼14.2 kW kg(-1)), which shows great potential in practical usage. Our present work may not only demonstrate the feasibility of using soluble fluorides as anodes for aqueous batteries but also provide a smart way to upgrade cyclic behaviors of Fe-based anodes.

Investigating a Multimodal Intervention for Children With Limited Expressive Vocabularies Associated With Autism

PubMed Central

Storkel, Holly L.; Bushnell, Paige; Barker, R. Michael; Saunders, Kate; Daniels, Debby; Fleming, Kandace

2015-01-01

Purpose This study investigated a new intervention package aimed at increasing expressive word learning by school-age children with autism who have limited expressive vocabularies. This pilot investigation was intended to show proof of concept. Method Ten children between the ages of 6 and 10 years participated, with educational diagnoses of autism and limited expressive vocabularies at the outset of the study. A multimodal intervention composed of speech sound practice and augmentative and alternative communication was used to teach individualized vocabulary words that were selected on the basis of initial speech sound repertoires and principles of phonotactic probability and neighborhood density. A multiple-probe design was used to evaluate learning outcomes. Results Five children showed gains in spoken-word learning across successive word sets (high responders). Five children did not meet learning criteria (low responders). Comparisons of behaviors measured prior to intervention indicated that high responders had relatively higher skills in receptive language, prelinguistic communication, vocal/verbal imitation, adaptive behavior, and consonant productions. Conclusions The intervention package holds promise for improving spoken word productions for some children with autism who have limited expressive vocabularies. Further research is needed to better describe who may most benefit from this approach as well as investigate generalized benefits to untaught contexts and targets. PMID:25910710

Spacecraft computer technology at Southwest Research Institute

NASA Technical Reports Server (NTRS)

Shirley, D. J.

1993-01-01

Southwest Research Institute (SwRI) has developed and delivered spacecraft computers for a number of different near-Earth-orbit spacecraft including shuttle experiments and SDIO free-flyer experiments. We describe the evolution of the basic SwRI spacecraft computer design from those weighing in at 20 to 25 lb and using 20 to 30 W to newer models weighing less than 5 lb and using only about 5 W, yet delivering twice the processing throughput. Because of their reduced size, weight, and power, these newer designs are especially applicable to planetary instrument requirements. The basis of our design evolution has been the availability of more powerful processor chip sets and the development of higher density packaging technology, coupled with more aggressive design strategies in incorporating high-density FPGA technology and use of high-density memory chips. In addition to reductions in size, weight, and power, the newer designs also address the necessity of survival in the harsh radiation environment of space. Spurred by participation in such programs as MSTI, LACE, RME, Delta 181, Delta Star, and RADARSAT, our designs have evolved in response to program demands to be small, low-powered units, radiation tolerant enough to be suitable for both Earth-orbit microsats and for planetary instruments. Present designs already include MIL-STD-1750 and Multi-Chip Module (MCM) technology with near-term plans to include RISC processors and higher-density MCM's. Long term plans include development of whole-core processors on one or two MCM's.

Nondestructive Evaluation (NDE) Technology Initiatives (NTIP). Delivery Order 0039: Statistical Comparison of Competing Material Models

DTIC Science & Technology

2003-01-01

adapted from Kass and Rafferty (1995) and Congdon (2001). Page 10 of 57 density adjusted for resin content, z, since resin contributes to the density...c.f.: Congdon , 2001). How to Download the WinBUGS Software Package BUGS was originally a statistical research project at the Medical Research...Likelihood Estimation,” July 2002, working paper to be published. 18) Congdon , Peter, Bayesian Statistical Modeling, Wiley, 2001 19) Cox, D. R. and

Effect of nanoclay on the properties of low density polyethylene/linear low density polyethylene/thermoplastic starch blend films.

PubMed

Sabetzadeh, Maryam; Bagheri, Rouhollah; Masoomi, Mahmood

2016-05-05

The aim of this work is to study effect of nanoclay (Cloisite(®)15A) on morphology and properties of low-density polyethylene/linear low-density polyethylene/thermoplastic starch (LDPE/LLDPE/TPS) blend films. LDPE/LLDPE blend (70/30wt/wt) containing 15wt.% TPS in the presence of PE-grafted maleic anhydride (PE-g-MA, 3wt.%) with 1, 3 and 5phr of nanoclay are compounded in a twin-screw extruder and then film blown using a blowing machine. Nanocomposites with intercalated structures are obtained, based on the X-ray diffraction (XRD) and transmission electron microscopy (TEM) studies. However, some exfoliated single platelets in the samples are also observable. Scanning electron microscopic (SEM) images confirm the ability of both exfoliated nanoclay and PE-g-MA to reduce the size of TPS domains and deform their particles within the PE matrices. As the nanoclay content increases from 1 to 5phr, the tensile strength, tear resistance and impact strength of the films increase, whereas a slight decrease in the elongation at break is observed. The film samples with 5phr nanoclay possess the required packaging properties, as specified by ASTM D4635. These films provide desired optical transparency and surface roughness which are more attractive for packaging applications. Copyright © 2016. Published by Elsevier Ltd.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Bornea, A.; Zamfirache, M.; Stefan, L.

ICIT (Institute for Cryogenics and Isotopic Technologies) has used its experience in cryogenic water distillation process to propose a similar process for hydrogen distillation that can be used in detritiation technologies. This process relies on the same packages but a stainless filling is tested instead of the phosphorous bronze filling used for water distillation. This paper presents two types of packages developed for hydrogen distillation, both have a stainless filling but it differs in terms of density, exchange surface and specific volume. Performance data have been obtained on laboratory scale. In order to determine the characteristics of the package, themore » installation was operated in the total reflux mode, for different flow rate for the liquid. There were made several experiments considering different operating conditions. Samples extracted at the top and bottom of cryogenic distillation column allowed mathematical processing to determine the separation performance. The experiments show a better efficiency for the package whose exchange surface was higher and there were no relevant differences between both packages as the operating pressure of the cryogenic column was increasing. For a complete characterization of the packages, future experiments will be considered to determine performance at various velocities in the column and their correlation with the pressure in the column. We plan further experiments to separate tritium from the mixture of isotopes DT, having in view that our goal is to apply this results to a detritiation plant.« less

Effects of nano-TiO2 -LDPE packaging on postharvest quality and antioxidant capacity of strawberry (Fragaria ananassa Duch.) stored at refrigeration temperature.

PubMed

Li, Dongdong; Ye, Qingyang; Jiang, Lei; Luo, Zisheng

2017-03-01

Nano-TiO 2 -low-density polyethylene (NTLDPE) packaging was prepared, and the effects of NTLDPE packaging on quality and antioxidant capacity of strawberry fruits were investigated. With increased barrier properties, NTLDPE packaging quickly formed a relative lower O 2 and higher CO 2 air composition in comparison with LDPE. It was also more efficient in maintaining the overall quality of strawberry fruit, as reflected by lower decay rate and weight loss, as well as retarding the decrease in firmness and titratable acid. Meanwhile, reactive oxygen species (ROS) including superoxide anion and hydrogen peroxide in NTLDPE-packed fruits were 10.8% and 21.9% lower, respectively. Furthermore, the activities of antioxidant enzymes involved in ROS scavenging in NTLDPE-packed fruits were significantly higher at the later period of storage time. Anthocyanin accumulation was inhibited, whereas ascorbic acid and total phenolics contents were better retained and 1-diphenyl-2-picrylhydrazyl radical scavenging activity was 13.2% higher in NTLDPE-packed fruit by the end of storage. These data indicate that the beneficial effects of NTLDPE packaging on postharvest quality and antioxidant capacity of strawberry are probably associated with the promotion of ROS scavenging and related antioxidant enzyme activities, and NTLDPE packaging together with refrigeration storage is a promising method for strawberry fruit preservation. © 2016 Society of Chemical Industry. © 2016 Society of Chemical Industry.

Response of antioxidant activity and sensory quality in fresh-cut pear as affected by high O2,active packaging compared with low O2 packaging

USDA-ARS?s Scientific Manuscript database

Effects of active modified atmosphere packaging (MAP, initial O2/CO2: 5/5; 30/5; 80/0) and passive packaging (initial O2/CO2: 20.8/0 (air)) on the antioxidant capacity and sensory quality of fresh-cut ‘Yaoshan’ pear stored at 4C for 12 days were investigated. Samples stored in high O2 (30% and 80%) ...

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2012-01-01

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Examination of shipping packages 9975-01641, 9975-01692, 9975-03373, 9975-02101 AND 9975-02713

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W. L.

SRNL has assisted in the examination of five 9975 shipping packages following storage of nuclear material in K-Area Complex (KAC). Two packages (9975-01641 and -01692) with water intrusion resulting from a roof leak were selected for detailed examination after internal fiberboard degradation (mold) was observed. 9975-01692 contained regions of saturated fiberboard and significant mold, while the second package was less degraded. A third package (9975-03373) was removed from storage for routine surveillance activities, and set aside for further examination after a musty odor was noted inside. No additional degradation was noted in 9975-03373, but the lower assembly could not bemore » removed from the drum for detailed examination. Two additional packages (9975-02101 and -02713) identified for further examination were among a larger group selected for surveillance as part of a specific focus on high-wattage packages. These two packages displayed several non-conforming conditions, including the following: (1) the axial gap criterion was exceeded, (2) a significant concentration of moisture was found in the bottom fiberboard layers, with active mold in this area, (3) condensation and/or water stains were observed on internal components (drum, lid, air shield), and (4) both drums contained localized corrosion along the bottom lip. It is recommended that a new screening check be implemented for packages that are removed from storage, as well as high wattage packages remaining in storage. An initial survey for corrosion along the drum bottom lip of high wattage packages could identify potential degraded packages for future surveillance focus. In addition, after packages have been removed from storage (and unloaded), the drum bottom lip and underside should be inspected for corrosion. The presence of corrosion could signal the need to remove the lower fiberboard assembly for further inspection of the fiberboard and drum prior to recertification of the package.« less

Vacuum microelectronics for beam power and rectennas

NASA Technical Reports Server (NTRS)

Gray, Henry F.

1989-01-01

Vacuum Microelectronic devices can be described as vacuum transistors or micro-miniature vacuum tubes, as one chooses. The fundamental reason behind this new technology is the very large current densities available from field emitters, namely as high as 10(8) A/sq cm. Array current densities as high as 1000 A/sq cm have been measured. Total electron transit times from source to drain for 1 micron feature size devices have been predicted to be about 150fs. This very short transit time implies the possibility of submillimeter wave transmitters and rectennas in devices which can operate with reasonably high voltages and which are small in size and are lightweight. In addition, they are expected to be extremely radiation hard and very temperature insensitive. That is, they are expected to have radiation hardness characteristics similar to vacuum tubes, and both the high temperature and low temperature limits should be determined by the package. That is, there should be no practical intrinsic temperature or carrier freezeout problems for devices based on metals or composites. But the technology is difficult to implement at the present time because it is based on 300 to 500 angstrom radius field emitters which must be relatively uniform. There is also the need to understand the non-equilibrium transport physics in the near-surface regions of the field emitters.

TSPmap, a tool making use of traveling salesperson problem solvers in the efficient and accurate construction of high-density genetic linkage maps.

PubMed

Monroe, J Grey; Allen, Zachariah A; Tanger, Paul; Mullen, Jack L; Lovell, John T; Moyers, Brook T; Whitley, Darrell; McKay, John K

2017-01-01

Recent advances in nucleic acid sequencing technologies have led to a dramatic increase in the number of markers available to generate genetic linkage maps. This increased marker density can be used to improve genome assemblies as well as add much needed resolution for loci controlling variation in ecologically and agriculturally important traits. However, traditional genetic map construction methods from these large marker datasets can be computationally prohibitive and highly error prone. We present TSPmap , a method which implements both approximate and exact Traveling Salesperson Problem solvers to generate linkage maps. We demonstrate that for datasets with large numbers of genomic markers (e.g. 10,000) and in multiple population types generated from inbred parents, TSPmap can rapidly produce high quality linkage maps with low sensitivity to missing and erroneous genotyping data compared to two other benchmark methods, JoinMap and MSTmap . TSPmap is open source and freely available as an R package. With the advancement of low cost sequencing technologies, the number of markers used in the generation of genetic maps is expected to continue to rise. TSPmap will be a useful tool to handle such large datasets into the future, quickly producing high quality maps using a large number of genomic markers.

A highly miniaturized vacuum package for a trapped ion atomic clock

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schwindt, Peter D. D., E-mail: pschwin@sandia.gov; Jau, Yuan-Yu; Partner, Heather

2016-05-15

We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm{sup 3} in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, it wasmore » sealed with a copper pinch-off and was subsequently pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of {sup 171}Y b{sup +}. The fractional frequency stability of the clock was measured to be 2 × 10{sup −11}/τ{sup 1/2}.« less

Effect of Rosmarinus officinalis L. essential oil combined with different packaging conditions to extend the shelf life of refrigerated beef meat.

PubMed

Sirocchi, Veronica; Devlieghere, Frank; Peelman, Nanou; Sagratini, Gianni; Maggi, Filippo; Vittori, Sauro; Ragaert, Peter

2017-04-15

Rosemary essential oil (REO) contains bioactives having antioxidant and antimicrobial properties. This work investigated the effect of REO combined with modified atmosphere packaging conditions (MAP), in our case, aerobic, vacuum or high O 2 , to extend the shelf life of beef. Beef slices were wrapped in special three-layer sheets of packaging material, some with a coating of REO (active packaging, AP), and some without REO (non active packaging, NAP), and stored at 4°C for 20days. The use of REO proved efficacious in every storage condition, as seen in the lower counts of psychrotrophics, Brochothrix thermosphacta, Pseudomonas spp., and Enterobacteriaceae in AP meat compared to NAP meat. Sensory and colourimetric analyses showed that the best packaging conditions were high-O 2 atmosphere in combination with REO. Based on microbiological data, shelf life of beef was 5-6days for AP samples packaged under aerobic conditions and 14-15days for AP samples in high-O 2 conditions. Copyright © 2016 Elsevier Ltd. All rights reserved.

The characterization of radioactive waste: a critical review of techniques implemented or under development at CEA, France

NASA Astrophysics Data System (ADS)

Pérot, Bertrand; Jallu, Fanny; Passard, Christian; Gueton, Olivier; Allinei, Pierre-Guy; Loubet, Laurent; Estre, Nicolas; Simon, Eric; Carasco, Cédric; Roure, Christophe; Boucher, Lionel; Lamotte, Hervé; Comte, Jérôme; Bertaux, Maïté; Lyoussi, Abdallah; Fichet, Pascal; Carrel, Frédérick

2018-03-01

This review paper describes the destructive and non-destructive measurements implemented or under development at CEA, in view to perform the most complete radioactive waste characterization. First, high-energy photon imaging (radiography, tomography) brings essential information on the waste packages, such as density, position and shape of the waste inside the container and in the possible binder, quality of coating and blocking matrices, presence of internal shields or structures, presence of cracks, voids, or other defects in the container or in the matrix, liquids or other forbidden materials, etc. Radiological assessment is then performed using a series of non-destructive techniques such as gamma-ray spectroscopy, which allows characterizing a wide range of radioactive and nuclear materials, passive neutron coincidence counting and active neutron interrogation with the differential die-away technique, or active photon interrogation with high-energy photons (photofission), to measure nuclear materials. Prompt gamma neutron activation analysis (PGNAA) can also be employed to detect toxic chemicals or elements which can greatly influence the above measurements, such as neutron moderators or absorbers. Digital auto-radiography can also be used to detect alpha and beta contaminated waste. These non-destructive assessments can be completed by gas measurements, to quantify the radioactive and radiolysis gas releases, and by destructive examinations such as coring homogeneous waste packages or cutting the heterogeneous ones, in view to perform visual examination and a series of physical, chemical, and radiochemical analyses on samples. These last allow for instance to check the mechanical and containment properties of the package envelop, or of the waste binder, to measure toxic chemicals, to assess the activity of long-lived radionuclides or pure beta emitters, to determine the isotopic composition of nuclear materials, etc.

Thermal Conductivity of Carbon Nanotube Composite Films

NASA Technical Reports Server (NTRS)

Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Walker, Megan D.; Koehne, Jessica E.; Meyyappan, M.; Li, Jun; Yang, Cary Y.

2004-01-01

State-of-the-art ICs for microprocessors routinely dissipate power densities on the order of 50 W/sq cm. This large power is due to the localized heating of ICs operating at high frequencies, and must be managed for future high-frequency microelectronic applications. Our approach involves finding new and efficient thermally conductive materials. Exploiting carbon nanotube (CNT) films and composites for their superior axial thermal conductance properties has the potential for such an application requiring efficient heat transfer. In this work, we present thermal contact resistance measurement results for CNT and CNT-Cu composite films. It is shown that Cu-filled CNT arrays enhance thermal conductance when compared to as-grown CNT arrays. Furthermore, the CNT-Cu composite material provides a mechanically robust alternative to current IC packaging technology.

Effect of novel food processing methods on packaging: structure, composition, and migration properties.

PubMed

Guillard, V; Mauricio-Iglesias, M; Gontard, N

2010-11-01

Classical stabilization techniques (thermal treatments) usually involve food to be packed after being processed. On the contrary and increasingly, novel food processing methods, such as high pressure or microwaves, imply that both packaging and foodstuff undergo the stabilization treatment. Moreover, novel treatments (UV light, irradiation, ozone, cold plasma) are specifically used for disinfection and sterilization of the packaging material itself. Therefore, in the last several years a number of papers have focused on the effects of these new treatments on food-packaging interactions with a special emphasis on chemical migration and safety concerns. New packaging materials merged on the market with specific interest regarding the environment (i.e. bio-sourced materials) or mechanical and barrier properties (i.e. nanocomposites packaging materials). It is time to evaluate the knowledge about how these in-package food technologies affect food/packaging interactions, and especially for novel biodegradable and/or active materials. This article presents the effect of high pressure treatment, microwave heating, irradiation, UV-light, ozone and, cold plasma treatment on food/packaging interactions.

Irradiation Tests Supporting LEU Conversion of Very High Power Research Reactors in the US

DOE Office of Scientific and Technical Information (OSTI.GOV)

Woolstenhulme, N. E.; Cole, J. I.; Glagolenko, I.

The US fuel development team is developing a high density uranium-molybdenum alloy monolithic fuel to enable conversion of five high-power research reactors. Previous irradiation tests have demonstrated promising behavior for this fuel design. A series of future irradiation tests will enable selection of final fuel fabrication process and provide data to qualify the fuel at moderately-high power conditions for use in three of these five reactors. The remaining two reactors, namely the Advanced Test Reactor and High Flux Isotope Reactor, require additional irradiation tests to develop and demonstrate the fuel’s performance with even higher power conditions, complex design features, andmore » other unique conditions. This paper reviews the program’s current irradiation testing plans for these moderately-high irradiation conditions and presents conceptual testing strategies to illustrate how subsequent irradiation tests will build upon this initial data package to enable conversion of these two very-high power research reactors.« less

Ferroelectric and piezoelectric thin films and their applications for integrated capacitors, piezoelectric ultrasound transducers and piezoelectric switches

NASA Astrophysics Data System (ADS)

Klee, M.; Boots, H.; Kumar, B.; van Heesch, C.; Mauczok, R.; Keur, W.; de Wild, M.; van Esch, H.; Roest, A. L.; Reimann, K.; van Leuken, L.; Wunnicke, O.; Zhao, J.; Schmitz, G.; Mienkina, M.; Mleczko, M.; Tiggelman, M.

2010-02-01

Ferroelectric and piezoelectric thin films are gaining more and more importance for the integration of high performance devices in small modules. High-K 'Integrated Discretes' devices have been developed, which are based on thin film ferroelectric capacitors integrated together with resistors and ESD protection diodes in a small Si-based chip-scale package. Making use of ferroelectric thin films with relative permittivity of 950-1600 and stacking processes of capacitors, extremely high capacitance densities of 20-520 nF/mm2, high breakdown voltages up to 140 V and lifetimes of more than 10 years at operating voltages of 5 V and 85°C are achieved. Thin film high-density capacitors play also an important role as tunable capacitors for applications such as tuneable matching circuits for RF sections of mobile phones. The performance of thin film tuneable capacitors at frequencies between 1 MHz and 1 GHz is investigated. Finally thin film piezoelectric ultrasound transducers, processed in Si- related processes, are attractive for medical imaging, since they enable large bandwidth (>100%), high frequency operation and have the potential to integrate electronics. With these piezoelectric thin film ultrasound transducers real time ultrasound images have been realized. Finally, piezoelectric thin films are used to manufacture galvanic MEMS switches. A model for the quasi-static mechanical behaviour is presented and compared with measurements.

Hidden costs of antiretroviral treatment: the public health efficiency of drug packaging.

PubMed

Andreu-Crespo, Àngels; Llibre, Josep M; Cardona-Peitx, Glòria; Sala-Piñol, Ferran; Clotet, Bonaventura; Bonafont-Pujol, Xavier

2015-01-01

While the overall percentage of unused antiretroviral medicines returned to the hospital pharmacy is low, their cost is quite high. Adverse events, treatment failure, pharmacokinetic interactions, pregnancy, or treatment simplification are common reasons for unplanned treatment changes. Socially inefficient antiretroviral packages prevent the reuse of drugs returned to the hospital pharmacy. We defined antiretroviral package categories based on the excellence of drug packaging and analyzed the number of pills and costs of drugs returned during a period of 1 year in a hospital-based HIV unit attending to 2,413 treated individuals. A total of 6,090 pills (34% of all returned antiretrovirals) - with a cost of 47,139.91 € - would be totally lost, mainly due to being packed up in the lowest efficiency packages. Newer treatments are packaged in low-excellence categories of packages, thus favoring the maintenance of these hidden costs in the near future. Therefore, costs of this low-efficiency drug packaging, where medication packages are started but not completed, in high-cost medications are substantial and should be properly addressed. Any improvement in the packaging by the manufacturer, and favoring the choice of drugs supplied through efficient packages (when efficacy, toxicity, and convenience are similar), should minimize the treatment expenditures paid by national health budgets.

Hidden costs of antiretroviral treatment: the public health efficiency of drug packaging

PubMed Central

Andreu-Crespo, Àngels; Llibre, Josep M; Cardona-Peitx, Glòria; Sala-Piñol, Ferran; Clotet, Bonaventura; Bonafont-Pujol, Xavier

2015-01-01

While the overall percentage of unused antiretroviral medicines returned to the hospital pharmacy is low, their cost is quite high. Adverse events, treatment failure, pharmacokinetic interactions, pregnancy, or treatment simplification are common reasons for unplanned treatment changes. Socially inefficient antiretroviral packages prevent the reuse of drugs returned to the hospital pharmacy. We defined antiretroviral package categories based on the excellence of drug packaging and analyzed the number of pills and costs of drugs returned during a period of 1 year in a hospital-based HIV unit attending to 2,413 treated individuals. A total of 6,090 pills (34% of all returned antiretrovirals) – with a cost of 47,139.91€ – would be totally lost, mainly due to being packed up in the lowest efficiency packages. Newer treatments are packaged in low-excellence categories of packages, thus favoring the maintenance of these hidden costs in the near future. Therefore, costs of this low-efficiency drug packaging, where medication packages are started but not completed, in high-cost medications are substantial and should be properly addressed. Any improvement in the packaging by the manufacturer, and favoring the choice of drugs supplied through efficient packages (when efficacy, toxicity, and convenience are similar), should minimize the treatment expenditures paid by national health budgets. PMID:26273190

ShortRead: a bioconductor package for input, quality assessment and exploration of high-throughput sequence data

PubMed Central

Morgan, Martin; Anders, Simon; Lawrence, Michael; Aboyoun, Patrick; Pagès, Hervé; Gentleman, Robert

2009-01-01

Summary: ShortRead is a package for input, quality assessment, manipulation and output of high-throughput sequencing data. ShortRead is provided in the R and Bioconductor environments, allowing ready access to additional facilities for advanced statistical analysis, data transformation, visualization and integration with diverse genomic resources. Availability and Implementation: This package is implemented in R and available at the Bioconductor web site; the package contains a ‘vignette’ outlining typical work flows. Contact: mtmorgan@fhcrc.org PMID:19654119

High-performance packaging for monolithic microwave and millimeter-wave integrated circuits

NASA Technical Reports Server (NTRS)

Shalkhauser, K. A.; Li, K.; Shih, Y. C.

1992-01-01

Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices.

Effects of lactate and modified atmospheric packaging on premature browning in cooked ground beef patties.

PubMed

Mancini, R A; Ramanathan, R; Suman, S P; Konda, M K R; Joseph, P; Dady, G A; Naveena, B M; López-López, I

2010-06-01

Our objectives were to determine the effects of lactate and modified atmosphere packaging on raw surface color, lipid oxidation, and internal cooked color of ground beef patties. Eight chubs (85% lean) were divided in half and each half was either assigned to the control (no lactate) or mixed with 2.5% lactate (w/w). Following treatment, patties were prepared and packaged in either vacuum, PVC (atmospheric oxygen level), high-oxygen (80% O(2)+20% CO(2)), or 0.4% CO (30% CO(2)+69.6% N(2)) and stored for 0, 2, or 4days at 2 degrees C. After storage, raw surface color and lipid oxidation were measured and patties were cooked to either 66 degrees C or 71 degrees C. Lactate improved (p<0.05) color stability of PVC, high-oxygen, and vacuum packaged raw patties, but had no effect (p>0.05) on the a * values and visual color scores of patties in 0.4% CO. Lactate decreased (p<0.05) lipid oxidation in all packaging atmospheres. Nevertheless, high-oxygen and PVC-packaged patties had more (p<0.05) lipid oxidation than patties in CO and vacuum. Lactate had no effect (p>0.05) on premature browning, whereas patties packaged in high-oxygen demonstrated premature browning. Conversely, cooked patties in 0.4% CO and vacuum were more red (p<0.05) than both high-oxygen and PVC-packaged patties. Although lactate improved raw color stability, it did not minimize premature browning in cooked ground beef patties. Copyright 2010 Elsevier Ltd. All rights reserved.

Nutrient profile of 23 596 packaged supermarket foods and non-alcoholic beverages in Australia and New Zealand.

PubMed

Ni Mhurchu, Cliona; Brown, Ryan; Jiang, Yannan; Eyles, Helen; Dunford, Elizabeth; Neal, Bruce

2016-02-01

To compare the nutrient profile of packaged supermarket food products available in Australia and New Zealand. Eligibility to carry health claims and relationship between nutrient profile score and nutritional content were also evaluated. Nutritional composition data were collected in six major Australian and New Zealand supermarkets in 2012. Mean Food Standards Australia New Zealand Nutrient Profiling Scoring Criterion (NPSC) scores were calculated and the proportion of products eligible to display health claims was estimated. Regression analyses quantified associations between NPSC scores and energy density, saturated fat, sugar and sodium contents. NPSC scores were derived for 23,596 packaged food products (mean score 7.0, range -17 to 53). Scores were lower (better nutrient profile) for foods in Australia compared with New Zealand (mean 6.6 v. 7.8). Overall, 45% of foods were eligible to carry health claims based on NPSC thresholds: 47% in Australia and 41% in New Zealand. However, less than one-third of dairy (32%), meat and meat products (28%) and bread and bakery products (27.5%) were eligible to carry health claims. Conversely, >75% of convenience food products were eligible to carry health claims (82.5%). Each two-unit higher NPSC score was associated with higher energy density (78 kJ/100 g), saturated fat (0.95 g/100 g), total sugar (1.5 g/100 g) and sodium (66 mg/100 g; all P values<0.001). Fewer than half of all packaged foods available in Australia and New Zealand in 2012 met nutritional criteria to carry health claims. The few healthy choices available in key staple food categories is a concern. Improvements in nutritional quality of foods through product reformulation have significant potential to improve population diets.

Reliability of emerging bonded interface materials for large-area attachments

DOE PAGES

Paret, Paul P.; DeVoto, Douglas J.; Narumanchi, Sreekant

2015-12-30

In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMsmore » for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn 63Pb 37) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.« less

Leveraging socially networked mobile ICT platforms for the last-mile delivery problem.

PubMed

Suh, Kyo; Smith, Timothy; Linhoff, Michelle

2012-09-04

Increasing numbers of people are managing their social networks on mobile information and communication technology (ICT) platforms. This study materializes these social relationships by leveraging spatial and networked information for sharing excess capacity to reduce the environmental impacts associated with "last-mile" package delivery systems from online purchases, particularly in low population density settings. Alternative package pickup location systems (PLS), such as a kiosk on a public transit platform or in a grocery store, have been suggested as effective strategies for reducing package travel miles and greenhouse gas emissions, compared to current door-to-door delivery models (CDS). However, our results suggest that a pickup location delivery system operating in a suburban setting may actually increase travel miles and emissions. Only once a social network is employed to assist in package pickup (SPLS) are significant reductions in the last-mile delivery distance and carbon emissions observed across both urban and suburban settings. Implications for logistics management's decades-long focus on improving efficiencies of dedicated distribution systems through specialization, as well as for public policy targeting carbon emissions of the transport sector are discussed.

Genome packaging in EL and Lin68, two giant phiKZ-like bacteriophages of P. aeruginosa.

PubMed

Sokolova, O S; Shaburova, O V; Pechnikova, E V; Shaytan, A K; Krylov, S V; Kiselev, N A; Krylov, V N

2014-11-01

A unique feature of the Pseudomonas aeruginosa giant phage phiKZ is its way of genome packaging onto a spool-like protein structure, the inner body. Until recently, no similar structures have been detected in other phages. We have studied DNA packaging in P. aeruginosa phages EL and Lin68 using cryo-electron microscopy and revealed the presence of inner bodies. The shape and positioning of the inner body and the density of the DNA packaging in EL are different from those found in phiKZ and Lin68. This internal organization explains how the shorter EL genome is packed into a large EL capsid, which has the same external dimensions as the capsids of phiKZ and Lin68. The similarity in the structural organization in EL and other phiKZ-like phages indicates that EL is phylogenetically related to other phiKZ-like phages, and, despite the lack of detectable DNA homology, EL, phiKZ, and Lin68 descend from a common ancestor. Copyright © 2014 Elsevier Inc. All rights reserved.

Sandwich-structured nanohybrid paper based on controllable growth of nanostructured MnO2 on ionic liquid functionalized graphene paper as a flexible supercapacitor electrode.

PubMed

Sun, Yimin; Fang, Zheng; Wang, Chenxu; Ariyawansha, K R Rakhitha Malinga; Zhou, Aijun; Duan, Hongwei

2015-05-07

A sandwich-structured flexible supercapacitor electrode has been developed based on MnO2 nanonest (MNN) modified ionic liquid (IL) functionalized graphene paper (GP), which is fabricated by functionalizing graphene nanosheets with an amine-terminated IL (i.e., 1-(3-aminopropyl)-3-methylimidazolium bromide) to form freestanding IL functionalized GP (IL-GP), and then modifying IL-GP with a unique MNN structure via controllable template-free ultrasonic electrodeposition. The as-obtained MNN modified IL-GP (MNN/IL-GP) inherits the excellent pseudocapacity of the metal oxide, the high conductivity and electric double layer charging/discharging of IL-graphene composites, and therefore shows an enhanced supercapacitor performance. The maximum specific capacitance of 411 F g(-1) can be achieved by chronopotentiometry at a current density of 1 A g(-1). Meanwhile, the MNN/IL-GP electrode exhibits excellent rate capability and cycling stability, its specific capacitance is maintained at 70% as the current densities increase from 1 to 20 A g(-1) and 85% at a current density of 10 A g(-1) after 10 000 cycles. More importantly, the MNN/IL-GP displays distinguished mechanical stability and flexibility for device packaging, although its thickness is merely 8 μm. These features collectively demonstrate the potential of MNN/IL-GP as a high-performance paper electrode for flexible and lightweight and highly efficient electrochemical capacitor applications.

Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists

PubMed Central

Chen, Lung-Tai; Chang, Jin-Sheng; Hsu, Chung-Yi; Cheng, Wood-Hi

2009-01-01

A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span (TCO) response of −0.19% span/°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of −0.065% span/°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification −0.2% span/°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors. PMID:22454580

New Ultra Low Permittivity Composites for Use in Ceramic Packaging of Ga:As Integrated Circuits.

DTIC Science & Technology

1985-09-18

detectable Si compound . 4.2.1.3 Density. Densities were obtained by pycnometry using a non-wetting liquid (kerosene) and measuring the volume...controlling gel formation and densification. Of particular interest is the possibility of using photopolymerizable resins or gels as a means of...successful process. If feasibility can be demonstrated, intentions would be to use a compound such as A1BN, i.e. 2,2’-Azobis(2-methylpropionitrile), as a

Stability of color in Spanish-style green table olives pasteurized and stored in plastic containers.

PubMed

Sánchez, Antonio Higinio; López-López, Antonio; Beato, Víctor Manuel; de Castro, Antonio; Montaño, Alfredo

2017-08-01

There is an increasing interest in the use of pasteurizable plastic packaging by the olive industry. In order to investigate the change from traditional glass or varnished can containers to plastic packaging, the proper plastic material that is compatible with fermented olives while maintaining color quality during pasteurization treatment and storage must be selected. This work is focused on color stability in two distinct pasteurizable plastic containers with different oxygen permeability. In PET + MDPE/EVOH (polyethylene terephthalate + medium-density polyethylene/ethylene vinyl alcohol) pouches, pasteurization provoked severe browning which drastically decreased their color shelf life (<6 weeks). However, this browning did not occur in the unpasteurized product without preservatives owing to the presence of microorganisms. In AlOx-coated PET + MDPE (aluminum oxide coating on polyethylene terephthalate + medium-density polyethylene) pouches, color changes were small or negligible throughout storage, especially if ascorbic acid was added to the packing solution (shelf life > 6.5 months). The plastic material had a significant effect on the retention of color of the pasteurized product. The use of AlOx-coated PET + MDPE pouches could be an alternative to traditional packaging for the pasteurization and storage of Spanish-style green olives from a color quality standpoint. © 2017 Society of Chemical Industry. © 2017 Society of Chemical Industry.

Flame resistant elastomeric polymer development. [for use in space shuttle instrument packaging

NASA Technical Reports Server (NTRS)

Howarth, J. T.; Sheth, S. G.; Sidman, K. R.

1975-01-01

Elastomeric products were developed for use in the space shuttle program, and investigations were conducted to improve the properties of elastomers developed in previous programs, and to evaluate the possibility of using lower-cost general purpose polymers. Products were fabricated and processed on conventional processing equipment; these products include: foams based on fluorinated rubber flame-retarded compounds with a density of 20-30 pounds/cubic foot for use as padding and in helmets; foams based on urethane for use in instrument packaging in the space shuttle; flexible and semi-rigid films of fluorinated rubber and neoprene compounds that would not burn in a 70% nitrogen, 30% oxygen atmosphere, and in a 30% nitrogen, 70% oxygen atmosphere, respectively for use in packaging or in laminates; coated fabrics which used both nylon and Kelvar fabric substrates, coated with either fluorinated or neoprene polymer compositions to meet specific levels of flame retardancy; and other flame-resistant materials.

Array Technology for Terahertz Imaging

NASA Technical Reports Server (NTRS)

Reck, Theodore; Siles, Jose; Jung, Cecile; Gill, John; Lee, Choonsup; Chattopadhyay, Goutam; Mehdi, Imran; Cooper, Ken

2012-01-01

Heterodyne terahertz (0.3 - 3THz) imaging systems are currently limited to single or a low number of pixels. Drastic improvements in imaging sensitivity and speed can be achieved by replacing single pixel systems with an array of detectors. This paper presents an array topology that is being developed at the Jet Propulsion Laboratory based on the micromachining of silicon. This technique fabricates the array's package and waveguide components by plasma etching of silicon, resulting in devices with precision surpassing that of current metal machining techniques. Using silicon increases the versatility of the packaging, enabling a variety of orientations of circuitry within the device which increases circuit density and design options. The design of a two-pixel transceiver utilizing a stacked architecture is presented that achieves a pixel spacing of 10mm. By only allowing coupling from the top and bottom of the package the design can readily be arrayed in two dimensions with a spacing of 10mm x 18mm.

Extended Lagrangian Density Functional Tight-Binding Molecular Dynamics for Molecules and Solids

DOE Office of Scientific and Technical Information (OSTI.GOV)

Aradi, Bálint; Niklasson, Anders M. N.; Frauenheim, Thomas

A computationally fast quantum mechanical molecular dynamics scheme using an extended Lagrangian density functional tight-binding formulation has been developed and implemented in the DFTB+ electronic structure program package for simulations of solids and molecular systems. The scheme combines the computational speed of self-consistent density functional tight-binding theory with the efficiency and long-term accuracy of extended Lagrangian Born–Oppenheimer molecular dynamics. Furthermore, for systems without self-consistent charge instabilities, only a single diagonalization or construction of the single-particle density matrix is required in each time step. The molecular dynamics simulation scheme can also be applied to a broad range of problems in materialsmore » science, chemistry, and biology.« less

Extended Lagrangian Density Functional Tight-Binding Molecular Dynamics for Molecules and Solids

DOE PAGES

Aradi, Bálint; Niklasson, Anders M. N.; Frauenheim, Thomas

2015-06-26

A computationally fast quantum mechanical molecular dynamics scheme using an extended Lagrangian density functional tight-binding formulation has been developed and implemented in the DFTB+ electronic structure program package for simulations of solids and molecular systems. The scheme combines the computational speed of self-consistent density functional tight-binding theory with the efficiency and long-term accuracy of extended Lagrangian Born–Oppenheimer molecular dynamics. Furthermore, for systems without self-consistent charge instabilities, only a single diagonalization or construction of the single-particle density matrix is required in each time step. The molecular dynamics simulation scheme can also be applied to a broad range of problems in materialsmore » science, chemistry, and biology.« less

Robust statistical reconstruction for charged particle tomography

DOEpatents

Schultz, Larry Joe; Klimenko, Alexei Vasilievich; Fraser, Andrew Mcleod; Morris, Christopher; Orum, John Christopher; Borozdin, Konstantin N; Sossong, Michael James; Hengartner, Nicolas W

2013-10-08

Systems and methods for charged particle detection including statistical reconstruction of object volume scattering density profiles from charged particle tomographic data to determine the probability distribution of charged particle scattering using a statistical multiple scattering model and determine a substantially maximum likelihood estimate of object volume scattering density using expectation maximization (ML/EM) algorithm to reconstruct the object volume scattering density. The presence of and/or type of object occupying the volume of interest can be identified from the reconstructed volume scattering density profile. The charged particle tomographic data can be cosmic ray muon tomographic data from a muon tracker for scanning packages, containers, vehicles or cargo. The method can be implemented using a computer program which is executable on a computer.

Silicate phosphors and white LED technology: improvements and opportunities

NASA Astrophysics Data System (ADS)

Sommer, Christian; Wenzl, Franz P.; Hartmann, Paul; Pachler, Peter; Schweighart, Marko; Leising, Guenther; Tasch, Stefan

2007-09-01

With the advent of a new generation of high brightness LEDs especially in the blue spectral range, white light technology based on phosphor conversion gains maturity for a successful penetration of, e.g., the general lighting market within the next years. Major challenges ahead are originating from the specific demands of the markets on small emission areas, highest possible intensities, long-term color stability, and spatial homogeneity of color coordinates. The LED industry more or less relies on the conversion phosphor classes of YAG, Sulfates, and Silicates, embedded in silicone matrices. A number of conformal coating technologies are in use. The optimization of the coating geometries with the help of software simulation offers a high potential for increased angular color homogeneity and high package densities, especially when secondary optics is in use. We report on recent progress in simulating parameters for improved white LEDs manufactured by coating technologies.

Does size and buoyancy affect the long-distance transport of floating debris?

NASA Astrophysics Data System (ADS)

Ryan, Peter G.

2015-08-01

Floating persistent debris, primarily made from plastic, disperses long distances from source areas and accumulates in oceanic gyres. However, biofouling can increase the density of debris items to the point where they sink. Buoyancy is related to item volume, whereas fouling is related to surface area, so small items (which have high surface area to volume ratios) should start to sink sooner than large items. Empirical observations off South Africa support this prediction: moving offshore from coastal source areas there is an increase in the size of floating debris, an increase in the proportion of highly buoyant items (e.g. sealed bottles, floats and foamed plastics), and a decrease in the proportion of thin items such as plastic bags and flexible packaging which have high surface area to volume ratios. Size-specific sedimentation rates may be one reason for the apparent paucity of small plastic items floating in the world’s oceans.

Flip chip bumping technology—Status and update

NASA Astrophysics Data System (ADS)

Juergen Wolf, M.; Engelmann, Gunter; Dietrich, Lothar; Reichl, Herbert

2006-09-01

Flip chip technology is a key driver for new complex system architectures and high-density packaging, e.g. sensor or pixel devices. Bumped wafers/dice as key elements become very important in terms of general availability at low cost, high yield and quality level. Today, different materials, e.g. Au, Ni, AuSn, SnAg, SnAgCu, SnCu, etc., are used for flip chip interconnects and different bumping approaches are available. Electroplating is the technology of choice for high-yield wafer bumping for small bump sizes and pitches. Lead-free solder bumps require an increase in knowledge in the field of under bump metallization (UBM) and the interaction of bump and substrate metallization, the formation and growth of intermetallic compounds (IMCs) during liquid- and solid-phase reactions. Results of a new bi-layer UBM of Ni-Cu which is especially designed for small-sized lead-free solder bumps will be discussed.

Effect of the ripening time under vacuum and packaging film permeability on processing and quality characteristics of low-fat fermented sausages.

PubMed

Liaros, N G; Katsanidis, E; Bloukas, J G

2009-12-01

The effect of vacuum ripening of low-fat fermented sausages packaged in films with different permeabilities on their microbiological, physicochemical and sensorial characteristics was studied. High-fat control sausages were produced with 30% initial fat and low-fat sausages with 10% initial fat. The low-fat sausages were separated into: (a) non-packaged (control) and (b) packaged under vacuum on 7th, 12th and 17th day of processing, remaining under vacuum during the ripening period for 21, 16 and 11days, respectively, in three different oxygen (100, 38 and⩽5cm(3)/m(2)/24h/1atm) and water vapour (4.5, <2.5 and 1g/m(2)24h) permeability plastic bags. Vacuum packaging reduced (p<0.05) the weight loss, the hardness and extent of lipid oxidation in the sausages, increased (p<0.05) their lightness, but had no effect (p>0.05) on the redness, compared to the control sausages. Packaging low-fat fermented sausages under vacuum for the last 11days of ripening in packaging film with high permeability increased (p<0.05) the lactic acid bacteria count. The same product packaged in film with medium permeability had a higher (p<0.05) Micrococcaceae count and the same (p>0.05) hardness and overall acceptability as the high-fat control sausages. A ripening time of 11days and the medium packaging film permeability were the most appropriate conditions for the vacuum packaging of low-fat fermented sausages.

High duty cycle hard soldered kilowatt laser diode arrays

NASA Astrophysics Data System (ADS)

Klumel, Genady; Karni, Yoram; Oppenheim, Jacob; Berk, Yuri; Shamay, Moshe; Tessler, Renana; Cohen, Shalom

2010-02-01

High-brightness laser diode arrays operating at a duty cycle of 10% - 20% are in ever-increasing demand for the optical pumping of solid state lasers and directed energy applications. Under high duty-cycle operation at 10% - 20%, passive (conductive) cooling is of limited use, while micro-coolers using de-ionized cooling water can considerably degrade device reliability. When designing and developing actively-cooled collimated laser diode arrays for high duty cycle operation, three main problems should be carefully addressed: an effective local and total heat removal, a minimization of packaging-induced and operational stresses, and high-precision fast axis collimation. In this paper, we present a novel laser diode array incorporating a built-in tap water cooling system, all-hard-solder bonded assembly, facet-passivated high-power 940 nm laser bars and tight fast axis collimation. By employing an appropriate layout of water cooling channels, careful choice of packaging materials, proper design of critical parts, and active optics alignment, we have demonstrated actively-cooled collimated laser diode arrays with extended lifetime and reliability, without compromising their efficiency, optical power density, brightness or compactness. Among the key performance benchmarks achieved are: 150 W/bar optical peak power at 10% duty cycle, >50% wallplug efficiency and <1° collimated fast axis divergence. A lifetime of >0.5 Ghots with <2% degradation has been experimentally proven. The laser diode arrays have also been successfully tested under harsh environmental conditions, including thermal cycling between -20°C and 40°C and mechanical shocks at 500g acceleration. The results of both performance and reliability testing bear out the effectiveness and robustness of the manufacturing technology for high duty-cycle laser arrays.

Improvements and new features in the PDF module

NASA Technical Reports Server (NTRS)

Norris, Andrew T.

1995-01-01

This viewgraph presentation discusses what models are used in this package and what their advantages and disadvantages are, how the probability density function (PDF) model is implemented and the features of the program, and what can be expected in the future from the NASA Lewis PDF code.

Owl Pellet Analysis--A Useful Tool in Field Studies

ERIC Educational Resources Information Center

Medlin, G. C.

1977-01-01

Describes a technique by which the density and hunting habits of owls can be inferred from their pellets. Owl pellets--usually small, cylindrical packages of undigested bone, hair, etc.--are regurgitated by a roosting bird. A series of activities based on owl pellets are provided. (CP)

A review of flexible lithium-sulfur and analogous alkali metal-chalcogen rechargeable batteries.

PubMed

Peng, Hong-Jie; Huang, Jia-Qi; Zhang, Qiang

2017-08-29

Flexible energy storage systems are imperative for emerging flexible devices that are revolutionizing our life. Lithium-ion batteries, the current main power sources, are gradually approaching their theoretical limitation in terms of energy density. Therefore, alternative battery chemistries are urgently required for next-generation flexible power sources with high energy densities, low cost, and inherent safety. Flexible lithium-sulfur (Li-S) batteries and analogous flexible alkali metal-chalcogen batteries are of paramount interest owing to their high energy densities endowed by multielectron chemistry. In this review, we summarized the recent progress of flexible Li-S and analogous batteries. A brief introduction to flexible energy storage systems and general Li-S batteries has been provided first. Progress in flexible materials for flexible Li-S batteries are reviewed subsequently, with a detailed classification of flexible sulfur cathodes as those based on carbonaceous (e.g., carbon nanotubes, graphene, and carbonized polymers) and composite (polymers and inorganics) materials and an overview of flexible lithium anodes and flexible solid-state electrolytes. Advancements in other flexible alkali metal-chalcogen batteries are then introduced. In the next part, we emphasize the importance of cell packaging and flexibility evaluation, and two special flexible battery prototypes of foldable and cable-type Li-S batteries are highlighted. In the end, existing challenges and future development of flexible Li-S and analogous alkali metal-chalcogen batteries are summarized and prospected.

Determination of the structure and heating mechanisms of coronal loops from soft X-ray observations with the solar probe. [grazing incidence telescope

NASA Technical Reports Server (NTRS)

Davis, J. M.; Krieger, A. S.

1978-01-01

High resolution soft X-ray imaging from the solar probe is justified in terms of the expected scientific returns which include the determination of the temperature and density structure of a coronal loop. The advantages of the grazing incidence telescope over the multiple pinhole camera are discussed. An instrument package is described which includes a grazing incidence mirror, a thermal prefilter, a three position filter wheel and a focal plane detector baselined as an 800 by 800 back-illuminated charge coupled device. The structural assembly together with the data processing equipment would draw heavily on the designs being developed for the Solar Polar Mission.

Flat conductor cable for electrical packaging

NASA Technical Reports Server (NTRS)

Angele, W.

1972-01-01

Flat conductor cable (FCC) is relatively new, highly promising means for electrical packaging and system integration. FCC offers numerous desirable traits (weight, volume and cost savings, flexibility, high reliability, predictable and repeatable electrical characteristics) which make it extremely attractive as a packaging medium. FCC, today, finds wide application in everything from integration of lunar equipment to the packaging of electronics in nuclear submarines. Described are cable construction and means of termination, applicable specifications and standards, and total FCC systems. A list of additional sources of data is also included for more intensive study.

Flexible carbon micro-supercapacitors prepared by direct cw-laser writing

NASA Astrophysics Data System (ADS)

Cai, Jinguang; Watanabe, Akira

2016-03-01

Micro-/nano-scale power supply units with high energy and high power densities are critical components for the development of compact miniaturized portable electronic devices. Supercapacitors have attracted many research attentions due to their high power density, robust cycle performance, pollution-free operation, and maintenance-free features. Besides, the properties of small size, light weight, and flexibility are also required. On-chip microsupercapacitors (MSCs) have the potential acting as power supply units in portable devices, due to their simplified packaging processes and compatibility to the integrated circuits. However, the fabrication methods and materials should be cost-effective, scalable, and compatible to current electronic industry. Carbon materials own high specific surface areas, electrochemical stability, and high electrical conductivity, which are critical parameters for high-power supercapacitors. Moreover, the high mechanical tolerance makes them good candidates for flexible wearable devices. Therefore, MSCs based on carbon materials would satisfy the requirements of portable electronics. In this work, we demonstrated the fabrication of carbon MSCs by laser direct writing on commercial polyimide sheets in Ar with lowcost semiconductor cw-laser with a wavelength of 405nm. The obtained structures are macro-nanostructures comprising graphitized and amorphous carbon with relatively smooth surfaces and low resistance, in compared with the structures obtained by laser writing in air. As-prepared micro-supercapacitors show a high capacitance of about 14.9 mF/cm2 at a scanning rate of 10 mV/s, which is comparable to the reported highest capacitance of carbon-based supercapacitors fabricated by pulse-laser writing.

Standard high-reliability integrated circuit logic packaging. [for deep space tracking stations

NASA Technical Reports Server (NTRS)

Slaughter, D. W.

1977-01-01

A family of standard, high-reliability hardware used for packaging digital integrated circuits is described. The design transition from early prototypes to production hardware is covered and future plans are discussed. Interconnections techniques are described as well as connectors and related hardware available at both the microcircuit packaging and main-frame level. General applications information is also provided.

Enhanced antioxidant activity of polyolefin films integrated with grape tannins.

PubMed

Olejar, Kenneth J; Ray, Sudip; Kilmartin, Paul A

2016-06-01

A natural antioxidant derived from an agro-waste of the wine industry, grape tannin, was incorporated by melt blending into three different polyolefins (high-density polyethylene, linear low-density polyethylene and polypropylene) to introduce antioxidant functionality. Significant antioxidant activity was observed at 1% tannin inclusion in all polymer blends. The antioxidant activity was observed to increase steadily with a greater concentration of grape tannins, the highest increases being seen with polypropylene. The mechanical and thermal properties of the polymer films following antioxidant incorporation were minimally altered with up to 3% grape tannins. All of the polyolefin-grape tannin films successfully passed the leachability test following USP661 standard protocol. Superior antioxidant activity was established in polyolefin thin films by utilization of a bulk grape extract obtained from winery waste. Significant increases in antioxidant activity were seen with 1% extract inclusion. This not only demonstrates the potential for food packaging applications of the polyolefin blends, but also valorizes the agro-waste. © 2015 Society of Chemical Industry. © 2015 Society of Chemical Industry.

Chemical recycling of plastic wastes made from polyethylene (LDPE and HDPE) and polypropylene (PP).

PubMed

Achilias, D S; Roupakias, C; Megalokonomos, P; Lappas, A A; Antonakou, Epsilon V

2007-11-19

The recycling of either model polymers or waste products based on low-density polyethylene (LDPE), high-density polyethylene (HDPE) or polypropylene (PP) is examined using the dissolution/reprecipitation method, as well as pyrolysis. In the first technique, different solvents/non-solvents were examined at different weight percent amounts and temperatures using as raw material both model polymers and commercial products (packaging film, bags, pipes, food-retail outlets). The recovery of polymer in every case was greater than 90%. FT-IR spectra and tensile mechanical properties of the samples before and after recycling were measured. Furthermore, catalytic pyrolysis was carried out in a laboratory fixed bed reactor with an FCC catalyst using again model polymers and waste products as raw materials. Analysis of the derived gases and oils showed that pyrolysis gave a mainly aliphatic composition consisting of a series of hydrocarbons (alkanes and alkenes), with a great potential to be recycled back into the petrochemical industry as a feedstock for the production of new plastics or refined fuels.

Wave Resource Characterization Using an Unstructured Grid Modeling Approach

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wu, Wei-Cheng; Yang, Zhaoqing; Wang, Taiping

This paper presents a modeling study conducted on the central Oregon coast for wave resource characterization using the unstructured-grid SWAN model coupled with a nested-grid WWIII model. The flexibility of models of various spatial resolutions and the effects of open- boundary conditions simulated by a nested-grid WWIII model with different physics packages were evaluated. The model results demonstrate the advantage of the unstructured-grid modeling approach for flexible model resolution and good model skills in simulating the six wave resource parameters recommended by the International Electrotechnical Commission in comparison to the observed data in Year 2009 at National Data Buoy Centermore » Buoy 46050. Notably, spectral analysis indicates that the ST4 physics package improves upon the model skill of the ST2 physics package for predicting wave power density for large waves, which is important for wave resource assessment, device load calculation, and risk management. In addition, bivariate distributions show the simulated sea state of maximum occurrence with the ST4 physics package matched the observed data better than that with the ST2 physics package. This study demonstrated that the unstructured-grid wave modeling approach, driven by the nested-grid regional WWIII outputs with the ST4 physics package, can efficiently provide accurate wave hindcasts to support wave resource characterization. Our study also suggests that wind effects need to be considered if the dimension of the model domain is greater than approximately 100 km, or O (10^2 km).« less

Melting, crystallization and storage stability of virgin coconut oil and its blends by differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR).

PubMed

Srivastava, Yashi; Semwal, Anil Dutt; Sajeevkumar, Vallayil Appukuttan; Sharma, G K

2017-01-01

The blends were prepared of virgin coconut oil with refined soyabean oil (VCO-RSOY) and refined safflower oil (VCO-RSAFF). Blending with VCO improved the fatty acid composition which increased the shelf stability of 20:80 VCO-RSOY and VCO-RSAFF up to 12 months in different packaging systems such as low density polyethylene, linear low density polyethylene, metalized polyester pouches, polyethylene teteraphthalate, high density polyethylene (HDPE), Amber HDPE bottle. The specific spectral regions of FTIR proved to be very useful for the determination of adulteration as well as for the study of oxidation process. Band shifts observed at 3008, 1652, 1397, 1097, 912 and 845 cm -1 have been used to differentiate RSAFF from VCO. VCO spectrums did not have these chemical shifts. Further the spectrum of RSOY showed same band shifts as RSAFF except 1652, 1397, 869.6 and 845 cm -1 . Differential Scanning Calorimetry provided useful information regarding the nature of thermodynamic changes related to physical state of vegetable oil. The physical state changes included melting and crystallization events which require the intake and release of energy.

Turbulent Simulations of Divertor Detachment Based On BOUT + + Framework

NASA Astrophysics Data System (ADS)

Chen, Bin; Xu, Xueqiao; Xia, Tianyang; Ye, Minyou

2015-11-01

China Fusion Engineering Testing Reactor is under conceptual design, acting as a bridge between ITER and DEMO. The detached divertor operation offers great promise for a reduction of heat flux onto divertor target plates for acceptable erosion. Therefore, a density scan is performed via an increase of D2 gas puffing rates in the range of 0 . 0 ~ 5 . 0 ×1023s-1 by using the B2-Eirene/SOLPS 5.0 code package to study the heat flux control and impurity screening property. As the density increases, it shows a gradually change of the divertor operation status, from low-recycling regime to high-recycling regime and finally to detachment. Significant radiation loss inside the confined plasma in the divertor region during detachment leads to strong parallel density and temperature gradients. Based on the SOLPS simulations, BOUT + + simulations will be presented to investigate the stability and turbulent transport under divertor plasma detachment, particularly the strong parallel gradient driven instabilities and enhanced plasma turbulence to spread heat flux over larger surface areas. The correlation between outer mid-plane and divertor turbulence and the related transport will be analyzed. Prepared by LLNL under Contract DE-AC52-07NA27344. LLNL-ABS-675075.

Definition of a high-affinity Gag recognition structure mediating packaging of a retroviral RNA genome

PubMed Central

Gherghe, Cristina; Lombo, Tania; Leonard, Christopher W.; Datta, Siddhartha A. K.; Bess, Julian W.; Gorelick, Robert J.; Rein, Alan; Weeks, Kevin M.

2010-01-01

All retroviral genomic RNAs contain a cis-acting packaging signal by which dimeric genomes are selectively packaged into nascent virions. However, it is not understood how Gag (the viral structural protein) interacts with these signals to package the genome with high selectivity. We probed the structure of murine leukemia virus RNA inside virus particles using SHAPE, a high-throughput RNA structure analysis technology. These experiments showed that NC (the nucleic acid binding domain derived from Gag) binds within the virus to the sequence UCUG-UR-UCUG. Recombinant Gag and NC proteins bound to this same RNA sequence in dimeric RNA in vitro; in all cases, interactions were strongest with the first U and final G in each UCUG element. The RNA structural context is critical: High-affinity binding requires base-paired regions flanking this motif, and two UCUG-UR-UCUG motifs are specifically exposed in the viral RNA dimer. Mutating the guanosine residues in these two motifs—only four nucleotides per genomic RNA—reduced packaging 100-fold, comparable to the level of nonspecific packaging. These results thus explain the selective packaging of dimeric RNA. This paradigm has implications for RNA recognition in general, illustrating how local context and RNA structure can create information-rich recognition signals from simple single-stranded sequence elements in large RNAs. PMID:20974908

Density-based empirical likelihood procedures for testing symmetry of data distributions and K-sample comparisons.

PubMed

Vexler, Albert; Tanajian, Hovig; Hutson, Alan D

In practice, parametric likelihood-ratio techniques are powerful statistical tools. In this article, we propose and examine novel and simple distribution-free test statistics that efficiently approximate parametric likelihood ratios to analyze and compare distributions of K groups of observations. Using the density-based empirical likelihood methodology, we develop a Stata package that applies to a test for symmetry of data distributions and compares K -sample distributions. Recognizing that recent statistical software packages do not sufficiently address K -sample nonparametric comparisons of data distributions, we propose a new Stata command, vxdbel, to execute exact density-based empirical likelihood-ratio tests using K samples. To calculate p -values of the proposed tests, we use the following methods: 1) a classical technique based on Monte Carlo p -value evaluations; 2) an interpolation technique based on tabulated critical values; and 3) a new hybrid technique that combines methods 1 and 2. The third, cutting-edge method is shown to be very efficient in the context of exact-test p -value computations. This Bayesian-type method considers tabulated critical values as prior information and Monte Carlo generations of test statistic values as data used to depict the likelihood function. In this case, a nonparametric Bayesian method is proposed to compute critical values of exact tests.

High Performance Hermetic Package For LiNbO3 Electro-Optic Waveguide Devices

NASA Astrophysics Data System (ADS)

Preston, K. R.; Macdonald, B. M.; Harmon, R. A.; Ford, C. W.; Shaw, R. N.; Reid, I.; Davidson, J. H.; Beaumont, A. R.; Booth, R. C.

1989-02-01

A high performance fibre-tailed package for LiNbO3 electro-optic waveguide devices is described. The package is based around a hermetic metal submodule which contains no epoxy or other organic materials. The LiNbO3 chip is mounted using a soldering technique, and laser welding is used for fibre fixing to give stable, low loss optical coupling to single mode fibres. Optical reflections are minimised by the use of antireflective coatings on the fibre ends and waveguide facets. High speed electrical connections are made via coplanar glass-sealed leadthroughs to LiNb03 travelling wave devices, and packaged device operation to frequencies in excess of 4GHz is demonstrated.

High resolution X-ray CT for advanced electronics packaging

NASA Astrophysics Data System (ADS)

Oppermann, M.; Zerna, T.

2017-02-01

Advanced electronics packaging is a challenge for non-destructive Testing (NDT). More, smaller and mostly hidden interconnects dominate modern electronics components and systems. To solve the demands of customers to get products with a high functionality by low volume, weight and price (e.g. mobile phones, personal medical monitoring systems) often the designers use System-in-Package solutions (SiP). The non-destructive testing of such devices is a big challenge. So our paper will impart fundamentals and applications for non-destructive evaluation of inner structures of electronics packaging for quality assurance and reliability investigations with a focus on X-ray methods, especially on high resolution X-ray computed tomography (CT).

Investigation of low cost, high reliability sealing techniques for hybrid microcircuits, phase 1

NASA Technical Reports Server (NTRS)

Perkins, K. L.; Licari, J. J.

1976-01-01

A preliminary investigation was made to determine the feasibility of using adhesive package sealing for hybrid microcircuits. Major effort consisted of: (1) surveying representative hybrid manufacturers to assess the current use of adhesives for package sealing; (2) making a cost comparison of metallurgical versus adhesive package sealing; (3) determining the seal integrity of gold plated flatpack type packages sealed with selected adhesives, thermal shock, temperature cycling, mechanical shock, and constant acceleration test environments; and (4) defining a more comprehensive study to continue the evaluation of adhesives for package sealing. Results showed that 1.27 cm square gold plated flatpack type packages sealed with the film adhesives and the paste adhesive retained their seal integrity after all tests, and that similarly prepared 2.54 cm square packages retained their seal integrity after all tests except the 10,000 g's constant acceleration test. It is concluded that these results are encouraging, but by no means sufficient to establish the suitability of adhesives for sealing high reliability hybrid microcircuits.

Accounting for Errors in Low Coverage High-Throughput Sequencing Data When Constructing Genetic Maps Using Biparental Outcrossed Populations

PubMed Central

Bilton, Timothy P.; Schofield, Matthew R.; Black, Michael A.; Chagné, David; Wilcox, Phillip L.; Dodds, Ken G.

2018-01-01

Next-generation sequencing is an efficient method that allows for substantially more markers than previous technologies, providing opportunities for building high-density genetic linkage maps, which facilitate the development of nonmodel species’ genomic assemblies and the investigation of their genes. However, constructing genetic maps using data generated via high-throughput sequencing technology (e.g., genotyping-by-sequencing) is complicated by the presence of sequencing errors and genotyping errors resulting from missing parental alleles due to low sequencing depth. If unaccounted for, these errors lead to inflated genetic maps. In addition, map construction in many species is performed using full-sibling family populations derived from the outcrossing of two individuals, where unknown parental phase and varying segregation types further complicate construction. We present a new methodology for modeling low coverage sequencing data in the construction of genetic linkage maps using full-sibling populations of diploid species, implemented in a package called GUSMap. Our model is based on the Lander–Green hidden Markov model but extended to account for errors present in sequencing data. We were able to obtain accurate estimates of the recombination fractions and overall map distance using GUSMap, while most existing mapping packages produced inflated genetic maps in the presence of errors. Our results demonstrate the feasibility of using low coverage sequencing data to produce genetic maps without requiring extensive filtering of potentially erroneous genotypes, provided that the associated errors are correctly accounted for in the model. PMID:29487138

Accounting for Errors in Low Coverage High-Throughput Sequencing Data When Constructing Genetic Maps Using Biparental Outcrossed Populations.

PubMed

Bilton, Timothy P; Schofield, Matthew R; Black, Michael A; Chagné, David; Wilcox, Phillip L; Dodds, Ken G

2018-05-01

Next-generation sequencing is an efficient method that allows for substantially more markers than previous technologies, providing opportunities for building high-density genetic linkage maps, which facilitate the development of nonmodel species' genomic assemblies and the investigation of their genes. However, constructing genetic maps using data generated via high-throughput sequencing technology ( e.g. , genotyping-by-sequencing) is complicated by the presence of sequencing errors and genotyping errors resulting from missing parental alleles due to low sequencing depth. If unaccounted for, these errors lead to inflated genetic maps. In addition, map construction in many species is performed using full-sibling family populations derived from the outcrossing of two individuals, where unknown parental phase and varying segregation types further complicate construction. We present a new methodology for modeling low coverage sequencing data in the construction of genetic linkage maps using full-sibling populations of diploid species, implemented in a package called GUSMap. Our model is based on the Lander-Green hidden Markov model but extended to account for errors present in sequencing data. We were able to obtain accurate estimates of the recombination fractions and overall map distance using GUSMap, while most existing mapping packages produced inflated genetic maps in the presence of errors. Our results demonstrate the feasibility of using low coverage sequencing data to produce genetic maps without requiring extensive filtering of potentially erroneous genotypes, provided that the associated errors are correctly accounted for in the model. Copyright © 2018 Bilton et al.

Efficient Predictions of Excited State for Nanomaterials Using Aces 3 and 4

DTIC Science & Technology

2017-12-20

by first-principle methods in the software package ACES by using large parallel computers, growing tothe exascale. 15. SUBJECT TERMS Computer...modeling, excited states, optical properties, structure, stability, activation barriers first principle methods , parallel computing 16. SECURITY...2 Progress with new density functional methods

Individualized Instruction in Science, Time-Space-Matter, Self-Directed Activities.

ERIC Educational Resources Information Center

Kuczma, R. M.

As a supplement to Learning Activity Packages (LAP) on the time-space-matter subject, details are presented for self-directed activities. Major descriptions are given on the background of LAP characteristics, metric system, profile graph construction, spectroscope operation, radiant energy measurement, sunspot effects, density determination,…

Unmanned Air Vehicle -Version 1.0

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fred Oppel, SNL 06134

2013-04-17

This package contains modules that model the mobility of systems such as helicopters and fixed wing flying in the air. This package currently models first order physics - basically a velocity integrator. UAV mobility uses an internal clock to maintain stable, high-fidelity simulations over large time steps This package depends on interface that reside in the Mobility package.

Activated graphene as a cathode material for Li-ion hybrid supercapacitors.

PubMed

Stoller, Meryl D; Murali, Shanthi; Quarles, Neil; Zhu, Yanwu; Potts, Jeffrey R; Zhu, Xianjun; Ha, Hyung-Wook; Ruoff, Rodney S

2012-03-14

Chemically activated graphene ('activated microwave expanded graphite oxide', a-MEGO) was used as a cathode material for Li-ion hybrid supercapacitors. The performance of a-MEGO was first verified with Li-ion electrolyte in a symmetrical supercapacitor cell. Hybrid supercapacitors were then constructed with a-MEGO as the cathode and with either graphite or Li(4)Ti(5)O(12) (LTO) for the anode materials. The results show that the activated graphene material works well in a symmetrical cell with the Li-ion electrolyte with specific capacitances as high as 182 F g(-1). In a full a-MEGO/graphite hybrid cell, specific capacitances as high as 266 F g(-1) for the active materials at operating potentials of 4 V yielded gravimetric energy densities for a packaged cell of 53.2 W h kg(-1).

Improved Information and Educational Messages on Outer Packaging of Micronutrient Powders Distributed in Indonesia Increase Caregiver Knowledge and Adherence to Recommended Use.

PubMed

Sutrisna, Aang; Vossenaar, Marieke; Poonawala, Alia; Mallipu, Agnes; Izwardy, Doddy; Menon, Ravi; Tumilowicz, Alison

2018-06-08

The objective of this study was to examine the influence of improved information and educational messages on outer packaging of a micronutrient powder (MNP), locally known as “ Taburia ”, on knowledge and adherence to recommended use. A community-based cluster randomized controlled trial was conducted among 1149 caregivers and their children aged 6⁻36 months. Caregiver⁻child dyads were randomized by their villages to receive 30 sachets of Taburia with the: (i) original outer packaging; (ii) improved outer packaging; or (iii) improved outer packaging combined with cooking demonstrations. Adherence to Taburia use was assessed through caregiver interviews and observation of unused sachets during home visits; “high” adherence was defined as consuming 13⁻17 sachets in the previous month. Data collection included surveys and focus groups discussions. The majority of caregivers (>80%) preferred the improved packaging because it was more attractive and contained more comprehensive information. Caregivers who received the improved packaging had better knowledge regarding the recommended use of Taburia ( p < 0.001) and higher adherence with the prescribed use of Taburia (43% with “high” adherence) ( p < 0.001) than those who received the original packaging (29% with “high” adherence). Caregivers who participated in cooking demonstrations generally had better knowledge regarding the benefits of Taburia and recommended use, but this did not lead to higher adherence to recommended use. “Underconsumption” of Taburia (≤7 sachets) was much less prevalent than “overconsumption” (≥23 sachets), and original packaging users were more likely to consume Taburia daily instead of every two days as recommended. We conclude that the design of the outer packaging and comprehensiveness of information provided are important influencers of recommended MNP use by caregivers.

Production of an impermeable composite of irradiated graphite and glass by hot isostatic pressing as a long term leach resistant waste form

DOE Office of Scientific and Technical Information (OSTI.GOV)

Fachinger, Johannes; Muller, Walter; Marsat, Eric

2013-07-01

Around 250,000 tons of irradiated graphite (i-graphite) exists worldwide and can be considered as a current waste or future waste stream. The largest national i-graphite inventory is located in UK (∼ 100,000 tons) with significant quantities also in Russia and France [5]. Most of the i-graphite remains in the cores of shutdown nuclear reactors including the MAGNOX type in UK and the UNGG in France. Whilst there are still operational power reactors with graphite cores, such as the Russian RBMKs and the AGRs in UK, all of them will reach their end of life during the next two decades. Themore » most common reference waste management option of i-graphite is a wet or dry retrieval of the graphite blocks from the reactor core and the grouting of these blocks in a container without further conditioning. This produces large waste package volumes because the encapsulation capacity of the grout is limited and large cavities in the graphite blocks could reduce the packing densities. Packing densities from 0.5 to 1 tons per cubic meter have been assumed for grouting solutions. Furthermore the grout is permeable. This could over time allow the penetration of aqueous phases into the waste block and a potential dissolution and release of radionuclides. As a result particularly highly soluble radionuclides may not be retained by the grout. Vitrification could present an alternative, however a similar waste package volume increase may be expected since the encapsulation capacity of glass is potentially similar to or worse than that of grout. FNAG has developed a process for the production of a graphite-glass composite material called Impermeable Graphite Matrix (IGM) [3]. This process is also applicable to irradiated graphite which allows the manufacturing of an impermeable material without volume increase. Crushed i-graphite is mixed with 20 vol.% of glass and then pressed under vacuum at an elevated temperature in an axial hot vacuum press (HVP). The obtained product has zero or negligible porosity and a water impermeable structure. Structural analysis shows that the glass in the composite has replaced the pores in the graphite structure. The typical pore volume of a graphite material is in the range of 20 vol.%. Therefore no volume increase will occur in comparison with the former graphite material. This IGM material will allow the encapsulation of graphite with package densities larger than 1.5 ton per cubic meter. Therefore a huge volume saving can be achieved by such an alternative encapsulation method. Disposal performance is also enhanced since little or no leaching of radionuclides is observed due to the impermeability of the material NNL and FNAG have proved that IGM can be produced by hot isostatic pressing (HIP) which has several advantages for radioactive materials over the HVP process. - The sealed HIP container avoids the release of any radionuclides. - The outside of the waste package is not contaminated. - The HIP process time is shorter than the HVP process time. The isostatic press avoids anisotropic density distributions. - Simple filling of the HIP container has advantages over the filling of an axial die. (authors)« less

DESIGN ANALYSIS FOR THE DEFENSE HIGH-LEVEL WASTE DISPOSAL CONTAINER

DOE Office of Scientific and Technical Information (OSTI.GOV)

G. Radulesscu; J.S. Tang

The purpose of ''Design Analysis for the Defense High-Level Waste Disposal Container'' analysis is to technically define the defense high-level waste (DHLW) disposal container/waste package using the Waste Package Department's (WPD) design methods, as documented in ''Waste Package Design Methodology Report'' (CRWMS M&O [Civilian Radioactive Waste Management System Management and Operating Contractor] 2000a). The DHLW disposal container is intended for disposal of commercial high-level waste (HLW) and DHLW (including immobilized plutonium waste forms), placed within disposable canisters. The U.S. Department of Energy (DOE)-managed spent nuclear fuel (SNF) in disposable canisters may also be placed in a DHLW disposal container alongmore » with HLW forms. The objective of this analysis is to demonstrate that the DHLW disposal container/waste package satisfies the project requirements, as embodied in Defense High Level Waste Disposal Container System Description Document (SDD) (CRWMS M&O 1999a), and additional criteria, as identified in Waste Package Design Sensitivity Report (CRWMS M&Q 2000b, Table 4). The analysis briefly describes the analytical methods appropriate for the design of the DHLW disposal contained waste package, and summarizes the results of the calculations that illustrate the analytical methods. However, the analysis is limited to the calculations selected for the DHLW disposal container in support of the Site Recommendation (SR) (CRWMS M&O 2000b, Section 7). The scope of this analysis is restricted to the design of the codisposal waste package of the Savannah River Site (SRS) DHLW glass canisters and the Training, Research, Isotopes General Atomics (TRIGA) SNF loaded in a short 18-in.-outer diameter (OD) DOE standardized SNF canister. This waste package is representative of the waste packages that consist of the DHLW disposal container, the DHLW/HLW glass canisters, and the DOE-managed SNF in disposable canisters. The intended use of this analysis is to support Site Recommendation reports and to assist in the development of WPD drawings. Activities described in this analysis were conducted in accordance with the Development Plan ''Design Analysis for the Defense High-Level Waste Disposal Container'' (CRWMS M&O 2000c) with no deviations from the plan.« less

Thermal conductivity measurements of impregnated Nb3Sn coil samples in the temperature range of 3.5 K to 100 K

NASA Astrophysics Data System (ADS)

Koettig, T.; Maciocha, W.; Bermudez, S.; Rysti, J.; Tavares, S.; Cacherat, F.; Bremer, J.

2017-02-01

In the framework of the luminosity upgrade of the LHC, high-field magnets are under development. Magnetic flux densities of up to 13 T require the use of Nb3Sn superconducting coils. Quench protection becomes challenging due to the high stored energy density and the low stabilizer fraction. The thermal conductivity and diffusivity of the combination of insulating layers and Nb3Sn based cables are an important thermodynamic input parameter for quench protection systems and superfluid helium cooling studies. A two-stage cryocooler based test stand is used to measure the thermal conductance of the coil sample in two different heat flow directions with respect to the coil package geometry. Variable base temperatures of the experimental platform at the cryocooler allow for a steady-state heat flux method up to 100 K. The heat is applied at wedges style copper interfaces of the Rutherford cables. The respective temperature difference represents the absolute value of thermal conductance of the sample arrangement. We report about the measurement methodology applied to this kind of non-uniform sample composition and the evaluation of the used resin composite materials.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nguyen, Thao; Luscher, D. J.; Wilkerson, J. W.

We developed a framework for dislocation-based viscoplasticity and dynamic ductile failure to model high strain rate deformation and damage in single crystals. The rate-dependence of the crystal plasticity formulation is based on the physics of relativistic dislocation kinetics suited for extremely high strain rates. The damage evolution is based on the dynamics of void growth, which are governed by both micro-inertia as well as dislocation kinetics and dislocation substructure evolution. Furthermore, an averaging scheme is proposed in order to approximate the evolution of the dislocation substructure in both the macroscale as well as its spatial distribution at the microscale. Inmore » addition, a concept of a single equivalent dislocation density that effectively captures the collective influence of dislocation density on all active slip systems is proposed here. Together, these concepts and approximations enable the use of semi-analytic solutions for void growth dynamics developed in [J. Wilkerson and K. Ramesh. A dynamic void growth model governed by dislocation kinetics. J. Mech. Phys. Solids, 70:262–280, 2014.], which greatly reduce the computational overhead that would otherwise be required. The resulting homogenized framework has been implemented into a commercially available finite element package, and a validation study against a suite of direct numerical simulations was carried out.« less

A dislocation-based crystal plasticity framework for dynamic ductile failure of single crystals

NASA Astrophysics Data System (ADS)

Nguyen, Thao; Luscher, D. J.; Wilkerson, J. W.

2017-11-01

A framework for dislocation-based viscoplasticity and dynamic ductile failure has been developed to model high strain rate deformation and damage in single crystals. The rate-dependence of the crystal plasticity formulation is based on the physics of relativistic dislocation kinetics suited for extremely high strain rates. The damage evolution is based on the dynamics of void growth, which are governed by both micro-inertia as well as dislocation kinetics and dislocation substructure evolution. An averaging scheme is proposed in order to approximate the evolution of the dislocation substructure in both the macroscale as well as its spatial distribution at the microscale. Additionally, a concept of a single equivalent dislocation density that effectively captures the collective influence of dislocation density on all active slip systems is proposed here. Together, these concepts and approximations enable the use of semi-analytic solutions for void growth dynamics developed in (Wilkerson and Ramesh, 2014), which greatly reduce the computational overhead that would otherwise be required. The resulting homogenized framework has been implemented into a commercially available finite element package, and a validation study against a suite of direct numerical simulations was carried out.

Thermoforming of HDPE

NASA Astrophysics Data System (ADS)

McKelvey, David; Menary, Gary; Martin, Peter; Yan, Shiyong

2017-10-01

The thermoforming process involves a previously extruded sheet of material being reheated to a softened state below the melting temperature and then forced into a mould either by a plug, air pressure or a combination of both. Thermoplastics such as polystyrene (PS) and polypropylene (PP) are commonly processed via thermoforming for products in the packaging industry. However, high density polyethylene (HDPE) is generally not processed via thermoforming and yet HDPE is extensively processed throughout the packaging industry. The aim of this study was to investigate the potential of thermoforming HDPE. The objectives were to firstly investigate the mechanical response under comparable loading conditions and secondly, to investigate the final mechanical properties post-forming. Obtaining in-process stress-strain behavior during thermoforming is extremely challenging if not impossible. To overcome this limitation the processing conditions were replicated offline using the QUB biaxial stretcher. Typical processing conditions that the material will experience during the process are high strain levels, high strain rates between 0.1-10s-1 and high temperatures in the solid phase (1). Dynamic Mechanical Analysis (DMA) was used to investigate the processing range of the HDPE grade used in this study, a peak in the tan delta curve was observed just below the peak melting temperature and hence, a forming temperature was selected in this range. HPDE was biaxially stretched at 128°C at a strain rate of 4s-1, under equal biaxial deformation (EB). The results showed a level of biaxial orientation was induced which was accompanied by an increase in the modulus from 606 MPa in the non-stretched sample to 1212MPa in the stretched sample.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Brown, S

A database was generated of estimates of geographically referenced carbon densities of forest vegetation in tropical Southeast Asia for 1980. A geographic information system (GIS) was used to incorporate spatial databases of climatic, edaphic, and geomorphological indices and vegetation to estimate potential (i.e., in the absence of human intervention and natural disturbance) carbon densities of forests. The resulting map was then modified to estimate actual 1980 carbon density as a function of population density and climatic zone. The database covers the following 13 countries: Bangladesh, Brunei, Cambodia (Campuchea), India, Indonesia, Laos, Malaysia, Myanmar (Burma), Nepal, the Philippines, Sri Lanka, Thailand,more » and Vietnam. The data sets within this database are provided in three file formats: ARC/INFOTM exported integer grids, ASCII (American Standard Code for Information Interchange) files formatted for raster-based GIS software packages, and generic ASCII files with x, y coordinates for use with non-GIS software packages. This database includes ten ARC/INFO exported integer grid files (five with the pixel size 3.75 km x 3.75 km and five with the pixel size 0.25 degree longitude x 0.25 degree latitude) and 27 ASCII files. The first ASCII file contains the documentation associated with this database. Twenty-four of the ASCII files were generated by means of the ARC/INFO GRIDASCII command and can be used by most raster-based GIS software packages. The 24 files can be subdivided into two groups of 12 files each. These files contain real data values representing actual carbon and potential carbon density in Mg C/ha (1 megagram = 10{sup 6} grams) and integer-coded values for country name, Weck's Climatic Index, ecofloristic zone, elevation, forest or non-forest designation, population density, mean annual precipitation, slope, soil texture, and vegetation classification. One set of 12 files contains these data at a spatial resolution of 3.75 km, whereas the other set of 12 files has a spatial resolution of 0.25 degree. The remaining two ASCII data files combine all of the data from the 24 ASCII data files into 2 single generic data files. The first file has a spatial resolution of 3.75 km, and the second has a resolution of 0.25 degree. Both files also provide a grid-cell identification number and the longitude and latitude of the center-point of each grid cell. The 3.75-km data in this numeric data package yield an actual total carbon estimate of 42.1 Pg (1 petagram = 10{sup 15} grams) and a potential carbon estimate of 73.6 Pg; whereas the 0.25-degree data produced an actual total carbon estimate of 41.8 Pg and a total potential carbon estimate of 73.9 Pg. Fortran and SAS{trademark} access codes are provided to read the ASCII data files, and ARC/INFO and ARCVIEW command syntax are provided to import the ARC/INFO exported integer grid files. The data files and this documentation are available without charge on a variety of media and via the Internet from the Carbon Dioxide Information Analysis Center (CDIAC).« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Brown, S.

A database was generated of estimates of geographically referenced carbon densities of forest vegetation in tropical Southeast Asia for 1980. A geographic information system (GIS) was used to incorporate spatial databases of climatic, edaphic, and geomorphological indices and vegetation to estimate potential (i.e., in the absence of human intervention and natural disturbance) carbon densities of forests. The resulting map was then modified to estimate actual 1980 carbon density as a function of population density and climatic zone. The database covers the following 13 countries: Bangladesh, Brunei, Cambodia (Campuchea), India, Indonesia, Laos, Malaysia, Myanmar (Burma), Nepal, the Philippines, Sri Lanka, Thailand,more » and Vietnam. The data sets within this database are provided in three file formats: ARC/INFO{trademark} exported integer grids, ASCII (American Standard Code for Information Interchange) files formatted for raster-based GIS software packages, and generic ASCII files with x, y coordinates for use with non-GIS software packages. This database includes ten ARC/INFO exported integer grid files (five with the pixel size 3.75 km x 3.75 km and five with the pixel size 0.25 degree longitude x 0.25 degree latitude) and 27 ASCII files. The first ASCII file contains the documentation associated with this database. Twenty-four of the ASCII files were generated by means of the ARC/INFO GRIDASCII command and can be used by most raster-based GIS software packages. The 24 files can be subdivided into two groups of 12 files each. These files contain real data values representing actual carbon and potential carbon density in Mg C/ha (1 megagram = 10{sup 6} grams) and integer- coded values for country name, Weck's Climatic Index, ecofloristic zone, elevation, forest or non-forest designation, population density, mean annual precipitation, slope, soil texture, and vegetation classification. One set of 12 files contains these data at a spatial resolution of 3.75 km, whereas the other set of 12 files has a spatial resolution of 0.25 degree. The remaining two ASCII data files combine all of the data from the 24 ASCII data files into 2 single generic data files. The first file has a spatial resolution of 3.75 km, and the second has a resolution of 0.25 degree. Both files also provide a grid-cell identification number and the longitude and latitude of the centerpoint of each grid cell. The 3.75-km data in this numeric data package yield an actual total carbon estimate of 42.1 Pg (1 petagram = 10{sup 15} grams) and a potential carbon estimate of 73.6 Pg; whereas the 0.25-degree data produced an actual total carbon estimate of 41.8 Pg and a total potential carbon estimate of 73.9 Pg. Fortran and SASTM access codes are provided to read the ASCII data files, and ARC/INFO and ARCVIEW command syntax are provided to import the ARC/INFO exported integer grid files. The data files and this documentation are available without charge on a variety of media and via the Internet from the Carbon Dioxide Information Analysis Center (CDIAC).« less

Characterization of a small (25-kilodalton) derivative of the Rous sarcoma virus Gag protein competent for particle release.

PubMed Central

Weldon, R A; Wills, J W

1993-01-01

Retroviral Gag proteins have the ability to induce budding and particle release from the plasma membrane when expressed in the absence of all of the other virus-encoded components; however, the locations of the functional domains within the Gag protein that are important for this process are poorly understood. It was shown previously that the protease sequence of the Rous sarcoma virus (RSV) Gag protein can be replaced with a foreign polypeptide, iso-1-cytochrome c from a yeast, without disrupting particle assembly (R. A. Weldon, Jr., C. R. Erdie, M. G. Oliver, and J. W. Wills, J. Virol. 64:4169-4179, 1990). An unexpected product of the chimeric gag gene is a small, Gag-related protein named p25C. This product was of interest because of its high efficiency of packaging into particles. The goal of the experiments described here was to determine the mechanism by which p25C is synthesized and packaged into particles. The results demonstrate that it is not the product of proteolytic processing of the Gag-cytochrome precursor but is derived from an unusual spliced mRNA. cDNA clones of the spliced mRNA were obtained, and each expressed a product of approximately 25 kDa, designated p25M1, which was released into the growth medium in membrane-enclosed particles that were much lighter than authentic retrovirions as measured in sucrose density gradients. DNA sequencing revealed that the clones encode the first 180 of the 701 amino acids of the RSV Gag protein and no residues from iso-1-cytochrome c. This suggested that a domain in the carboxy-terminal half of Gag is important for the packaging of Gag proteins into dense arrays within the particles. In support of this hypothesis, particles of the correct density were obtained when a small segment from the carboxy terminus of the RSV Gag protein (residues 417 to 584) was included on the end of p25. Images PMID:8394460

The NOD3 software package: A graphical user interface-supported reduction package for single-dish radio continuum and polarisation observations

NASA Astrophysics Data System (ADS)

Müller, Peter; Krause, Marita; Beck, Rainer; Schmidt, Philip

2017-10-01

Context. The venerable NOD2 data reduction software package for single-dish radio continuum observations, which was developed for use at the 100-m Effelsberg radio telescope, has been successfully applied over many decades. Modern computing facilities, however, call for a new design. Aims: We aim to develop an interactive software tool with a graphical user interface for the reduction of single-dish radio continuum maps. We make a special effort to reduce the distortions along the scanning direction (scanning effects) by combining maps scanned in orthogonal directions or dual- or multiple-horn observations that need to be processed in a restoration procedure. The package should also process polarisation data and offer the possibility to include special tasks written by the individual user. Methods: Based on the ideas of the NOD2 package we developed NOD3, which includes all necessary tasks from the raw maps to the final maps in total intensity and linear polarisation. Furthermore, plot routines and several methods for map analysis are available. The NOD3 package is written in Python, which allows the extension of the package via additional tasks. The required data format for the input maps is FITS. Results: The NOD3 package is a sophisticated tool to process and analyse maps from single-dish observations that are affected by scanning effects from clouds, receiver instabilities, or radio-frequency interference. The "basket-weaving" tool combines orthogonally scanned maps into a final map that is almost free of scanning effects. The new restoration tool for dual-beam observations reduces the noise by a factor of about two compared to the NOD2 version. Combining single-dish with interferometer data in the map plane ensures the full recovery of the total flux density. Conclusions: This software package is available under the open source license GPL for free use at other single-dish radio telescopes of the astronomical community. The NOD3 package is designed to be extendable to multi-channel data represented by data cubes in Stokes I, Q, and U.

An experimental analysis of the effectiveness and sustainability of a Chinese tutoring package.

PubMed

Wu, Hang; Miller, L Keith

2012-01-01

This experiment evaluated the effects of training tutors to use an instructional package to teach pronunciation and translation of the Chinese language. Tutors' correct use of the package increased from 68% of trials to 92% after training, and student correct pronunciation increased from 45% to 90%, with similar effects for translation. Continued use of the package, high social validity, and extended follow-up suggest that use of the package may be sustainable.

AN EXPERIMENTAL ANALYSIS OF THE EFFECTIVENESS AND SUSTAINABILITY OF A CHINESE TUTORING PACKAGE

PubMed Central

Wu, Hang; Miller, L. Keith

2012-01-01

This experiment evaluated the effects of training tutors to use an instructional package to teach pronunciation and translation of the Chinese language. Tutors' correct use of the package increased from 68% of trials to 92% after training, and student correct pronunciation increased from 45% to 90%, with similar effects for translation. Continued use of the package, high social validity, and extended follow-up suggest that use of the package may be sustainable. PMID:22403470

Enhanced thermaly managed packaging for III-nitride light emitters

NASA Astrophysics Data System (ADS)

Kudsieh, Nicolas

In this Dissertation our work on `enhanced thermally managed packaging of high power semiconductor light sources for solid state lighting (SSL)' is presented. The motivation of this research and development is to design thermally high stable cost-efficient packaging of single and multi-chip arrays of III-nitrides wide bandgap semiconductor light sources through mathematical modeling and simulations. Major issues linked with this technology are device overheating which causes serious degradation in their illumination intensity and decrease in the lifetime. In the introduction the basics of III-nitrides WBG semiconductor light emitters are presented along with necessary thermal management of high power cingulated and multi-chip LEDs and laser diodes. This work starts at chip level followed by its extension to fully packaged lighting modules and devices. Different III-nitride structures of multi-quantum well InGaN/GaN and AlGaN/GaN based LEDs and LDs were analyzed using advanced modeling and simulation for different packaging designs and high thermal conductivity materials. Study started with basic surface mounted devices using conventional packaging strategies and was concluded with the latest thermal management of chip-on-plate (COP) method. Newly discovered high thermal conductivity materials have also been incorporated for this work. Our study also presents the new approach of 2D heat spreaders using such materials for SSL and micro LED array packaging. Most of the work has been presented in international conferences proceedings and peer review journals. Some of the latest work has also been submitted to well reputed international journals which are currently been reviewed for publication. .

HiTC: exploration of high-throughput ‘C’ experiments

PubMed Central

Servant, Nicolas; Lajoie, Bryan R.; Nora, Elphège P.; Giorgetti, Luca; Chen, Chong-Jian; Heard, Edith; Dekker, Job; Barillot, Emmanuel

2012-01-01

Summary: The R/Bioconductor package HiTC facilitates the exploration of high-throughput 3C-based data. It allows users to import and export ‘C’ data, to transform, normalize, annotate and visualize interaction maps. The package operates within the Bioconductor framework and thus offers new opportunities for future development in this field. Availability and implementation: The R package HiTC is available from the Bioconductor website. A detailed vignette provides additional documentation and help for using the package. Contact: nicolas.servant@curie.fr Supplementary information: Supplementary data are available at Bioinformatics online. PMID:22923296

Effects of a Voluntary Front-of-Pack Nutrition Labelling System on Packaged Food Reformulation: The Health Star Rating System in New Zealand

PubMed Central

Eyles, Helen; Choi, Yeun-Hyang

2017-01-01

Interpretive, front-of-pack (FOP) nutrition labels may encourage reformulation of packaged foods. We aimed to evaluate the effects of the Health Star Rating (HSR), a new voluntary interpretive FOP labelling system, on food reformulation in New Zealand. Annual surveys of packaged food and beverage labelling and composition were undertaken in supermarkets before and after adoption of HSR i.e., 2014 to 2016. Outcomes assessed were HSR uptake by food group star ratings of products displaying a HSR label; nutritional composition of products displaying HSR compared with non-HSR products; and the composition of products displaying HSR labels in 2016 compared with their composition prior to introduction of HSR. In 2016, two years after adoption of the voluntary system, 5.3% of packaged food and beverage products surveyed (n = 807/15,357) displayed HSR labels. The highest rates of uptake were for cereals, convenience foods, packaged fruit and vegetables, sauces and spreads, and ‘Other’ products (predominantly breakfast beverages). Products displaying HSR labels had higher energy density but had significantly lower mean saturated fat, total sugar and sodium, and higher fibre, contents than non-HSR products (all p-values < 0.001). Small but statistically significant changes were observed in mean energy density (−29 KJ/100 g, p = 0.002), sodium (−49 mg/100 g, p = 0.03) and fibre (+0.5 g/100 g, p = 0.001) contents of HSR-labelled products compared with their composition prior to adoption of HSR. Reformulation of HSR-labelled products was greater than that of non-HSR-labelled products over the same period, e.g., energy reduction in HSR products was greater than in non-HSR products (−1.5% versus −0.4%), and sodium content of HSR products decreased by 4.6% while that of non-HSR products increased by 3.1%. We conclude that roll-out of the voluntary HSR labelling system is driving healthier reformulation of some products. Greater uptake across the full food supply should improve population diets. PMID:28829380

Effects of a Voluntary Front-of-Pack Nutrition Labelling System on Packaged Food Reformulation: The Health Star Rating System in New Zealand.

PubMed

Mhurchu, Cliona Ni; Eyles, Helen; Choi, Yeun-Hyang

2017-08-22

Interpretive, front-of-pack (FOP) nutrition labels may encourage reformulation of packaged foods. We aimed to evaluate the effects of the Health Star Rating (HSR), a new voluntary interpretive FOP labelling system, on food reformulation in New Zealand. Annual surveys of packaged food and beverage labelling and composition were undertaken in supermarkets before and after adoption of HSR i.e., 2014 to 2016. Outcomes assessed were HSR uptake by food group star ratings of products displaying a HSR label; nutritional composition of products displaying HSR compared with non-HSR products; and the composition of products displaying HSR labels in 2016 compared with their composition prior to introduction of HSR. In 2016, two years after adoption of the voluntary system, 5.3% of packaged food and beverage products surveyed ( n = 807/15,357) displayed HSR labels. The highest rates of uptake were for cereals, convenience foods, packaged fruit and vegetables, sauces and spreads, and 'Other' products (predominantly breakfast beverages). Products displaying HSR labels had higher energy density but had significantly lower mean saturated fat, total sugar and sodium, and higher fibre, contents than non-HSR products (all p -values < 0.001). Small but statistically significant changes were observed in mean energy density (-29 KJ/100 g, p = 0.002), sodium (-49 mg/100 g, p = 0.03) and fibre (+0.5 g/100 g, p = 0.001) contents of HSR-labelled products compared with their composition prior to adoption of HSR. Reformulation of HSR-labelled products was greater than that of non-HSR-labelled products over the same period, e.g., energy reduction in HSR products was greater than in non-HSR products (-1.5% versus -0.4%), and sodium content of HSR products decreased by 4.6% while that of non-HSR products increased by 3.1%. We conclude that roll-out of the voluntary HSR labelling system is driving healthier reformulation of some products. Greater uptake across the full food supply should improve population diets.

High-brightness diode pump sources for solid-state and fiber laser pumping across 8xx-9xx nm range

NASA Astrophysics Data System (ADS)

Diamant, Ronen; Berk, Yuri; Cohen, Shalom; Klumel, Genady; Levy, Moshe; Openhaim, Yaki; Peleg, Ophir; Yanson, Dan; Karni, Yoram

2011-06-01

Advanced solid state laser architectures place increasingly demanding requirements on high-brightness, low-cost QCW laser diode pump sources, with custom apertures both for side and end rod pumping configurations. To meet this need, a new series of scalable QCW pump sources at 808nm and 940nm was developed. The stacks, available in multiple output formats, allow for custom aperture filling by varying both the length and quantity of stacked laser bars. For these products, we developed next-generation laser bars based on improved epitaxial wafer designs delivering power densities of 20W/mm of emission aperture. With >200W of peak QCW power available from a full-length 1cm bar, we have demonstrated power scaling to over 2kW in 10-bar stacks with 55% wall plug efficiency. We also present the design and performance of several stack configurations using full-length and reduced-length (mini) bars that demonstrate the versatility of both the bar and packaging designs. We illustrate how the ROBUST HEAD packaging technology developed at SCD is capable of accommodating variable bar length, pitch and quantity for custom rod pumping geometries. The excellent all-around performance of the stacks is supported by reliability data in line with the previously reported 20 Gshot space-grade qualification of SCD's stacks.

Stretchable Lithium-Ion Batteries Enabled by Device-Scaled Wavy Structure and Elastic-Sticky Separator

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Wei; Chen, Jun; Chen, Zheng

Fast developments and substantial achievements have been shaping the field of wearable electronic devices, resulting in the persistent requirement for stretchable lithium-ion batteries (LIBs). Despite recent progress in stretchable electrodes, stretching full batteries, including electrodes, separator, and sealing material, remains a great challenge. Here, a simple design concept for stretchable LIBs via a wavy structure at the full battery device scale is reported. All components including the package are capable of being reversibly stretched by folding the entire pouch cell into a wavy shape with polydimethylsiloxane filled in each valley region. In addition, the stretchable, sticky, and porous polyurethane/poly(vinylidene fluoride)more » membrane is adopted as a separator for the first time, which can maintain intimate contact between electrodes and separator to continuously secure ion pathway under dynamic state. Commercial cathode, anode, and package can be utilized in this rationally designed wavy battery to enable stretchability. The results indicate good electrochemical performances and long-term stability at repeatable release–stretch cycles. A high areal capacity of 3.6 mA h cm -2 and energy density of up to 172 W h L -1 can be achieved for the wavy battery. The promising results of the cost-effective wavy battery with high stretchability shed light on the development of stretchable energy storages.« less

Stretchable Lithium-Ion Batteries Enabled by Device-Scaled Wavy Structure and Elastic-Sticky Separator

DOE PAGES

Liu, Wei; Chen, Jun; Chen, Zheng; ...

2017-07-17

Fast developments and substantial achievements have been shaping the field of wearable electronic devices, resulting in the persistent requirement for stretchable lithium-ion batteries (LIBs). Despite recent progress in stretchable electrodes, stretching full batteries, including electrodes, separator, and sealing material, remains a great challenge. Here, a simple design concept for stretchable LIBs via a wavy structure at the full battery device scale is reported. All components including the package are capable of being reversibly stretched by folding the entire pouch cell into a wavy shape with polydimethylsiloxane filled in each valley region. In addition, the stretchable, sticky, and porous polyurethane/poly(vinylidene fluoride)more » membrane is adopted as a separator for the first time, which can maintain intimate contact between electrodes and separator to continuously secure ion pathway under dynamic state. Commercial cathode, anode, and package can be utilized in this rationally designed wavy battery to enable stretchability. The results indicate good electrochemical performances and long-term stability at repeatable release–stretch cycles. A high areal capacity of 3.6 mA h cm -2 and energy density of up to 172 W h L -1 can be achieved for the wavy battery. The promising results of the cost-effective wavy battery with high stretchability shed light on the development of stretchable energy storages.« less

Freshness maintenance of cherries ready for consumption using convenient, microperforated, bio-based packaging.

PubMed

Koutsimanis, Georgios; Harte, Janice; Almenar, Eva

2015-03-30

Current consumer demand for high-quality ready-to-eat fresh fruit in convenient bio-based packaging was met utilizing sanitized stem-free sweet cherries and a polylactic acid (PLA) cup with a PLA peelable microperforated lid. The newly developed packaging system was compared with the petroleum-based macroperforated bag currently used for retail. After 27 days of storage at 1 °C, the PLA package maintained the cherry firmness, compared with a 50% reduction of the controls. No fungal decay was detected in the cherries stored in PLA, while the controls were non-marketable after 21 days. The PLA package allowed minimal weight loss (0.8%), compared with a weight loss of approximately 16% in the controls. Differences in the cherry aroma, color, acidity, soluble solids content, pH and quality index were also caused by the packaging type. A consumer sensory evaluation showed that cherries stored in PLA packages were more acceptable than those of the controls for appearance, texture, flavor and overall acceptability. The new package matched both the consumer demand for high-quality fresh fruit ready for consumption in convenient bio-based packaging and the extended fruit marketability and consumer satisfaction desired by industry. © 2014 Society of Chemical Industry.

Analysis on annealing-induced stress of blind-via TSV using FEM

NASA Astrophysics Data System (ADS)

Shao, Jie; Shi, Tielin; Du, Li; Su, Lei; Lu, Xiangning; Liao, Guanglan

2017-07-01

Copper-filled through silicon via (TSV) is a promising material owing to its application in high-density three-dimensional (3D) packaging. However, in TSV manufacturing, thermo-mechanical stress is induced during the annealing process, often causing reliability issues. In this paper, the finite element method is employed to investigate the impacts of via shape and SiO2 liner uniformity on the thermo-mechanical properties of copper- filled blind-via TSV after annealing. Top interface stress analysis on the TSV structure shows that the curvature of via openings releases stress concentration that leads to 60 MPa decrease of normal stresses, σ xx and σ yy , in copper and 70 MPa decrease of σ xx in silicon. Meanwhile, the vertical interface analysis shows that annealing-induced stress at the SiO2/Si interface depends heavily on SiO2 uniformity. By increasing the thickness of SiO2 linear, the stress at the vertical interface can be significantly reduced. Thus, process optimization to reduce the annealing-induced stress becomes feasible. The results of this study help us gain a better understanding of the thermo-mechanical behavior of the annealed TSV in 3D packaging.

The GONG Data Reduction and Analysis System. [solar oscillations

NASA Technical Reports Server (NTRS)

Pintar, James A.; Andersen, Bo Nyborg; Andersen, Edwin R.; Armet, David B.; Brown, Timothy M.; Hathaway, David H.; Hill, Frank; Jones, Harrison P.

1988-01-01

Each of the six GONG observing stations will produce three, 16-bit, 256X256 images of the Sun every 60 sec of sunlight. These data will be transferred from the observing sites to the GONG Data Management and Analysis Center (DMAC), in Tucson, on high-density tapes at a combined rate of over 1 gibabyte per day. The contemporaneous processing of these data will produce several standard data products and will require a sustained throughput in excess of 7 megaflops. Peak rates may exceed 50 megaflops. Archives will accumulate at the rate of approximately 1 terabyte per year, reaching nearly 3 terabytes in 3 yr of observing. Researchers will access the data products with a machine-independent GONG Reduction and Analysis Software Package (GRASP). Based on the Image Reduction and Analysis Facility, this package will include database facilities and helioseismic analysis tools. Users may access the data as visitors in Tucson, or may access DMAC remotely through networks, or may process subsets of the data at their local institutions using GRASP or other systems of their choice. Elements of the system will reach the prototype stage by the end of 1988. Full operation is expected in 1992 when data acquisition begins.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. Annual Report

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas

2016-04-01

Current generation automotive power electronics packages utilize silicon devices and lead-free solder alloys. To meet stringent technical targets for 2020 and beyond (for cost, power density, specific power, efficiency and reliability), wide-bandgap devices are being considered since they offer advantages such as operation at higher frequencies, voltages, and temperatures. Traditional power electronics packages must be redesigned to utilize the full potential of wide-bandgap devices, and the die- and substrate-attach layers are key areas where new material development and validation is required. Present solder alloys do not meet the performance requirements for these new package designs while also meeting cost andmore » hazardous substance restrictions. Sintered silver (Ag) promises to meet the needs for die- and substrate-attach interfaces but synthesis optimization and reliability evaluation must be completed. Sintered Ag material was proposed as an alternative solution in power electronics packages almost 20 years back. However, synthesis pressure requirements up 40 MPa caused a higher complexity in the production process and more stringent flatness specifications for the substrates. Recently, several manufacturers have developed sintered Ag materials that require lower (3-5 MPa) or even no bonding pressures. Degradation mechanisms for these sintered Ag materials are not well known and need to be addressed. We are addressing these aspects to some extent in this project. We are developing generalized (i.e., independent of geometry) stress intensity factor versus cycles-to-failure relations for sintered Ag. Because sintered Ag is a relatively new material for automotive power electronics, the industry currently does not have a good understanding of recommended synthesis parameters or expected reliability under prescribed conditions. It is an important deliverable of this project to transfer findings to industry to eliminate barriers to using sintered Ag as a viable and commercialized die- and substrate-attach material. Only a few manufacturers produce sintered Ag pastes and may consider some processing conditions as proprietary. It is the goal of this project to openly explore and define best practices in order to impact the maximum number of power electronics module manufacturers and suppliers.« less

An open-source framework for analyzing N-electron dynamics. II. Hybrid density functional theory/configuration interaction methodology.

PubMed

Hermann, Gunter; Pohl, Vincent; Tremblay, Jean Christophe

2017-10-30

In this contribution, we extend our framework for analyzing and visualizing correlated many-electron dynamics to non-variational, highly scalable electronic structure method. Specifically, an explicitly time-dependent electronic wave packet is written as a linear combination of N-electron wave functions at the configuration interaction singles (CIS) level, which are obtained from a reference time-dependent density functional theory (TDDFT) calculation. The procedure is implemented in the open-source Python program detCI@ORBKIT, which extends the capabilities of our recently published post-processing toolbox (Hermann et al., J. Comput. Chem. 2016, 37, 1511). From the output of standard quantum chemistry packages using atom-centered Gaussian-type basis functions, the framework exploits the multideterminental structure of the hybrid TDDFT/CIS wave packet to compute fundamental one-electron quantities such as difference electronic densities, transient electronic flux densities, and transition dipole moments. The hybrid scheme is benchmarked against wave function data for the laser-driven state selective excitation in LiH. It is shown that all features of the electron dynamics are in good quantitative agreement with the higher-level method provided a judicious choice of functional is made. Broadband excitation of a medium-sized organic chromophore further demonstrates the scalability of the method. In addition, the time-dependent flux densities unravel the mechanistic details of the simulated charge migration process at a glance. © 2017 Wiley Periodicals, Inc. © 2017 Wiley Periodicals, Inc.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2014-01-01

Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications.

Effect of packaging and storage temperature on the survival of Listeria monocytogenes inoculated postprocessing on sliced salami.

PubMed

Gounadaki, Antonia S; Skandamis, Panagiotis N; Drosinos, Eleftherios H; Nychas, George-John E

2007-10-01

The survival of postprocess Listeria monocytogenes contamination on sliced salami, stored under the temperatures associated with retail and domestic storage, was investigated. Sliced salami was inoculated with low and high concentrations of L. monocytogenes before being packaged under vacuum or air. Survival of L. monocytogenes was determined after storage of sausages for 45 or 90 days for low or high sample inocula, respectively, at 5, 15, and 25 degrees C. All survival curves of L. monocytogenes were characterized by an initial rapid inactivation within the first days of storage, followed by a second, slower inactivation phase or "tailing." Greater reduction of L. monocytogenes was observed at the high storage temperature (25 degrees C), followed by ambient (15 degrees C) and chill (5 degrees C) storage conditions. Moreover, vacuum packaging resulted in a slower destruction of L. monocytogenes than air packaging, and this effect increased as storage temperature decreased. Although L. monocytogenes numbers decreased to undetectable levels by the end of the storage period, the time (in days) needed for this reduction and for the total elimination of the pathogen decreased with high temperature, aerobic storage, and high inoculum. Results of this study clearly indicated that the kinetics of L. monocytogenes were highly dependent on the interaction of factors such as storage temperature, packaging conditions, and initial level of contamination (inoculum). These results may contribute to the exposure assessment of quantitative microbial risk assessment and to the establishment of storage-packaging recommendations of fermented sausages.

High-Resolution Detection of Identity by Descent in Unrelated Individuals

PubMed Central

Browning, Sharon R.; Browning, Brian L.

2010-01-01

Detection of recent identity by descent (IBD) in population samples is important for population-based linkage mapping and for highly accurate genotype imputation and haplotype-phase inference. We present a method for detection of recent IBD in population samples. Our method accounts for linkage disequilibrium between SNPs to enable full use of high-density SNP data. We find that our method can detect segments of a length of 2 cM with moderate power and negligible false discovery rate in Illumina 550K data in Northwestern Europeans. We compare our method with GERMLINE and PLINK, and we show that our method has a level of resolution that is significantly better than these existing methods, thus extending the usefulness of recent IBD in analysis of high-density SNP data. We survey four genomic regions in a sample of UK individuals of European descent and find that on average, at a given location, our method detects IBD in 2.7 per 10,000 pairs of individuals in Illumina 550K data. We also present methodology and results for detection of homozygosity by descent (HBD) and survey the whole genome in a sample of 1373 UK individuals of European descent. We detect HBD in 4.7 individuals per 10,000 on average at a given location. Our methodology is implemented in the freely available BEAGLE software package. PMID:20303063

Ultra high speed image processing techniques. [electronic packaging techniques

NASA Technical Reports Server (NTRS)

Anthony, T.; Hoeschele, D. F.; Connery, R.; Ehland, J.; Billings, J.

1981-01-01

Packaging techniques for ultra high speed image processing were developed. These techniques involve the development of a signal feedthrough technique through LSI/VLSI sapphire substrates. This allows the stacking of LSI/VLSI circuit substrates in a 3 dimensional package with greatly reduced length of interconnecting lines between the LSI/VLSI circuits. The reduced parasitic capacitances results in higher LSI/VLSI computational speeds at significantly reduced power consumption levels.

Method of fabricating a microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-01-01

A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

Determining integral density distribution in the mach reflection of shock waves

NASA Astrophysics Data System (ADS)

Shevchenko, A. M.; Golubev, M. P.; Pavlov, A. A.; Pavlov, Al. A.; Khotyanovsky, D. V.; Shmakov, A. S.

2017-05-01

We present a method for and results of determination of the field of integral density in the structure of flow corresponding to the Mach interaction of shock waves at Mach number M = 3. The optical diagnostics of flow was performed using an interference technique based on self-adjusting Zernike filters (SA-AVT method). Numerical simulations were carried out using the CFS3D program package for solving the Euler and Navier-Stokes equations. Quantitative data on the distribution of integral density on the path of probing radiation in one direction of 3D flow transillumination in the region of Mach interaction of shock waves were obtained for the first time.

Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform.

PubMed

Maeng, Jimin; Meng, Chuizhou; Irazoqui, Pedro P

2015-02-01

We present wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible parylene platform, as progress toward sustainably powering biomedical microsystems suitable for implantable and wearable applications. All-solid-state, low-profile (<30 μm), and high-density (up to ~500 μF/mm(2)) micro-supercapacitors are formed on an ultrathin (~20 μm) freestanding parylene film by a wafer-scale parylene packaging process in combination with a polyaniline (PANI) nanowire growth technique assisted by surface plasma treatment. These micro-supercapacitors are highly flexible and shown to be resilient toward flexural stress. Further, direct integration of micro-supercapacitors into a radio frequency (RF) rectifying circuit is achieved on a single parylene platform, yielding a complete RF energy harvesting microsystem. The system discharging rate is shown to improve by ~17 times in the presence of the integrated micro-supercapacitors. This result suggests that the integrated micro-supercapacitor technology described herein is a promising strategy for sustainably powering biomedical microsystems dedicated to implantable and wearable applications.

Telescoping Solar Array Concept for Achieving High Packaging Efficiency

NASA Technical Reports Server (NTRS)

Mikulas, Martin; Pappa, Richard; Warren, Jay; Rose, Geoff

2015-01-01

Lightweight, high-efficiency solar arrays are required for future deep space missions using high-power Solar Electric Propulsion (SEP). Structural performance metrics for state-of-the art 30-50 kW flexible blanket arrays recently demonstrated in ground tests are approximately 40 kW/cu m packaging efficiency, 150 W/kg specific power, 0.1 Hz deployed stiffness, and 0.2 g deployed strength. Much larger arrays with up to a megawatt or more of power and improved packaging and specific power are of interest to mission planners for minimizing launch and life cycle costs of Mars exploration. A new concept referred to as the Compact Telescoping Array (CTA) with 60 kW/cu m packaging efficiency at 1 MW of power is described herein. Performance metrics as a function of array size and corresponding power level are derived analytically and validated by finite element analysis. Feasible CTA packaging and deployment approaches are also described. The CTA was developed, in part, to serve as a NASA reference solar array concept against which other proposed designs of 50-1000 kW arrays for future high-power SEP missions could be compared.

Extension of the shelf life of prawns (Penaeus japonicus) by vacuum packaging and high-pressure treatment.

PubMed

López-Caballero, M E; Pérez-Mateos, M; Borderías, J A; Montero, P

2000-10-01

The present study has investigated the application of high pressures (200 and 400 MPa) in chilled prawn tails, both conventionally stored (air) and vacuum packaged. Vacuum packaging and high-pressure treatment did extend the shelf life of the prawn samples, although it did affect muscle color very slightly, giving it a whiter appearance. The viable shelf life of 1 week for the air-stored samples was extended to 21 days in the vacuum-packed samples, 28 days in the samples treated at 200 MPa, and 35 days in the samples pressurized at 400 MPa. Vacuum packaging checked the onset of blackening, whereas high-pressure treatment aggravated the problem. From a microbiological point of view, batches conventionally stored reached about 6 log CFU/g or even higher at 14 days. Similar figures were reached in total number of bacteria in vacuum-packed samples and in pressurized at 200-MPa samples at 21 days. When samples were pressurized at 400 MPa, total numbers of bacteria were below 5.5 log CFU/g at 35 days of storage. Consequently, a combination of vacuum packaging and high-pressure treatment would appear to be beneficial in prolonging freshness and preventing spotting.

Three-dimensional printing and deformation behavior of low-density target structures by two-photon polymerization

NASA Astrophysics Data System (ADS)

Liu, Ying; Stein, Ori; Campbell, John H.; Jiang, Lijia; Petta, Nicole; Lu, Yongfeng

2017-08-01

Two-photon polymerization (2PP), a 3D nano to microscale additive manufacturing process, is being used for the first time to fabricate small custom experimental packages ("targets") to support laser-driven high-energy-density (HED) physics research. Of particular interest is the use of 2PP to deterministically print low-density, low atomic-number (CHO) polymer matrices ("foams") at millimeter scale with sub-micrometer resolution. Deformation during development and drying of the foam structures remains a challenge when using certain commercial photo-resins; here we compare use of acrylic resins IP-S and IP-Dip. The mechanical strength of polymeric beam and foam structures is examined particularly the degree of deformation that occurs during the development and drying processes. The magnitude of the shrinkage in the two resins in quantified by printing sample structures and by use of FEA to simulate the deformation. Capillary drying forces are shown to be small and likely below the elastic limit of the core foam structure. In contrast the substantial shrinkage in IP-Dip ( 5-10%) cause large shear stresses and associated plastic deformation particularly near constrained boundaries such as the substrate and locations with sharp density variation. The inherent weakness of stitching boundaries is also evident and in certain cases can lead to delamination. Use of IP-S shows marked reduction in deformation with a minor loss of print resolution

EFFECTS OF FLUID AND COMPUTED TOMOGRAPHIC TECHNICAL FACTORS ON CONSPICUITY OF CANINE AND FELINE NASAL TURBINATES

PubMed Central

Uosyte, Raimonda; Shaw, Darren J; Gunn-Moore, Danielle A; Fraga-Manteiga, Eduardo; Schwarz, Tobias

2015-01-01

Turbinate destruction is an important diagnostic criterion in canine and feline nasal computed tomography (CT). However decreased turbinate visibility may also be caused by technical CT settings and nasal fluid. The purpose of this experimental, crossover study was to determine whether fluid reduces conspicuity of canine and feline nasal turbinates in CT and if so, whether CT settings can maximize conspicuity. Three canine and three feline cadaver heads were used. Nasal slabs were CT-scanned before and after submerging them in a water bath; using sequential, helical, and ultrahigh resolution modes; with images in low, medium, and high frequency image reconstruction kernels; and with application of additional posterior fossa optimization and high contrast enhancing filters. Visible turbinate length was measured by a single observer using manual tracing. Nasal density heterogeneity was measured using the standard deviation (SD) of mean nasal density from a region of interest in each nasal cavity. Linear mixed-effect models using the R package ‘nlme’, multivariable models and standard post hoc Tukey pair-wise comparisons were performed to investigate the effect of several variables (nasal content, scanning mode, image reconstruction kernel, application of post reconstruction filters) on measured visible total turbinate length and SD of mean nasal density. All canine and feline water-filled nasal slabs showed significantly decreased visibility of nasal turbinates (P < 0.001). High frequency kernels provided the best turbinate visibility and highest SD of aerated nasal slabs, whereas medium frequency kernels were optimal for water-filled nasal slabs. Scanning mode and filter application had no effect on turbinate visibility. PMID:25867935

Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

NASA Technical Reports Server (NTRS)

Le, Binh Q.; Nhan, Elbert; Maurer, Richard H.; Lew, Ark L.; Lander, Juan R.

1996-01-01

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

CoFFEE: Corrections For Formation Energy and Eigenvalues for charged defect simulations

NASA Astrophysics Data System (ADS)

Naik, Mit H.; Jain, Manish

2018-05-01

Charged point defects in materials are widely studied using Density Functional Theory (DFT) packages with periodic boundary conditions. The formation energy and defect level computed from these simulations need to be corrected to remove the contributions from the spurious long-range interaction between the defect and its periodic images. To this effect, the CoFFEE code implements the Freysoldt-Neugebauer-Van de Walle (FNV) correction scheme. The corrections can be applied to charged defects in a complete range of material shapes and size: bulk, slab (or two-dimensional), wires and nanoribbons. The code is written in Python and features MPI parallelization and optimizations using the Cython package for slow steps.

Program SPACECAP: software for estimating animal density using spatially explicit capture-recapture models

USGS Publications Warehouse

Gopalaswamy, Arjun M.; Royle, J. Andrew; Hines, James E.; Singh, Pallavi; Jathanna, Devcharan; Kumar, N. Samba; Karanth, K. Ullas

2012-01-01

1. The advent of spatially explicit capture-recapture models is changing the way ecologists analyse capture-recapture data. However, the advantages offered by these new models are not fully exploited because they can be difficult to implement. 2. To address this need, we developed a user-friendly software package, created within the R programming environment, called SPACECAP. This package implements Bayesian spatially explicit hierarchical models to analyse spatial capture-recapture data. 3. Given that a large number of field biologists prefer software with graphical user interfaces for analysing their data, SPACECAP is particularly useful as a tool to increase the adoption of Bayesian spatially explicit capture-recapture methods in practice.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, Yuxuan; Bilheux, Jean -Christophe

ImagingReso is an open-source Python library that simulates the neutron resonance signal for neutron imaging measurements. By defining the sample information such as density, thickness in the neutron path, and isotopic ratios of the elemental composition of the material, this package plots the expected resonance peaks for a selected neutron energy range. Various sample types such as layers of single elements (Ag, Co, etc. in solid form), chemical compounds (UO 3, Gd 2O 3, etc.), or even multiple layers of both types can be plotted with this package. As a result, major plotting features include display of the transmission/attenuation inmore » wavelength, energy, and time scale, and show/hide elemental and isotopic contributions in the total resonance signal.« less

Status Report - Cane Fiberboard Properties And Degradation Rates For Storage Of The 9975 Shipping Package In KAC

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daugherty, W.

Thermal, mechanical and physical properties have been measured on cane fiberboard samples following accelerated aging for up to approximately 10 years. The aging environments have included elevated temperature < 250 ºF (the maximum allowed service temperature for fiberboard in 9975 packages) and elevated humidity. The results from this testing have been analyzed, and aging models fit to the data. Correlations relating several properties (thermal conductivity, energy absorption, weight, dimensions and density) to their rate of change in potential storage environments have been developed. Combined with an estimate of the actual conditions the fiberboard experiences in KAC, these models allow developmentmore » of service life predictions.« less

77 FR 43561 - Proposed Eligibility Criteria for Bound Printed Matter Parcels

Federal Register 2010, 2011, 2012, 2013, 2014

2012-07-25

... physical density threshold for individual mailpieces. DATES: Comments on this advance notice are due.... Code, require that each class of mail or type of mail service bear the direct and indirect costs... a 98.8% cost coverage. Greater efficiency in the packaging of BPM parcels will provide for more...

Fallon, Nevada FORGE Gravity and Magnetics Data

DOE Office of Scientific and Technical Information (OSTI.GOV)

Blankenship, Doug; Witter, Jeff; Carpenter, Thomas

This package contains principal facts for new gravity data collected September - November 2017 in support of the Fallon FORGE project. Also included are rock core density and magnetic susceptibility data for key core intervals, used in modeling 2D and 3D gravity inversions. Individual metadata summaries are provided as .pdf within each attached archive.

selectSNP – An R package for selecting SNPs optimal for genetic evaluation

USDA-ARS?s Scientific Manuscript database

There has been a huge increase in the number of SNPs in the public repositories. This has made it a challenge to design low and medium density SNP panels, which requires careful selection of available SNPs considering many criteria, such as map position, allelic frequency, possible biological functi...

Structure-function analysis of the DNA translocating portal of the bacteriophage T4 packaging machine.

PubMed

Padilla-Sanchez, Victor; Gao, Song; Kim, Hyung Rae; Kihara, Daisuke; Sun, Lei; Rossmann, Michael G; Rao, Venigalla B

2014-03-06

Tailed bacteriophages and herpesviruses consist of a structurally well conserved dodecameric portal at a special 5-fold vertex of the capsid. The portal plays critical roles in head assembly, genome packaging, neck/tail attachment, and genome ejection. Although the structures of portals from phages φ29, SPP1, and P22 have been determined, their mechanistic roles have not been well understood. Structural analysis of phage T4 portal (gp20) has been hampered because of its unusual interaction with the Escherichia coli inner membrane. Here, we predict atomic models for the T4 portal monomer and dodecamer, and we fit the dodecamer into the cryo-electron microscopy density of the phage portal vertex. The core structure, like that from other phages, is cone shaped with the wider end containing the "wing" and "crown" domains inside the phage head. A long "stem" encloses a central channel, and a narrow "stalk" protrudes outside the capsid. A biochemical approach was developed to analyze portal function by incorporating plasmid-expressed portal protein into phage heads and determining the effect of mutations on head assembly, DNA translocation, and virion production. We found that the protruding loops of the stalk domain are involved in assembling the DNA packaging motor. A loop that connects the stalk to the channel might be required for communication between the motor and the portal. The "tunnel" loops that project into the channel are essential for sealing the packaged head. These studies established that the portal is required throughout the DNA packaging process, with different domains participating at different stages of genome packaging. © 2013.

Effect of different types of plastic packaging films on the moisture and aflatoxin contents of pistachio nuts during storage.

PubMed

Shakerardekani, Ahmad; Karim, Roselina

2013-04-01

Pistachio nut (Pistacia vera L.) is one of the popular tree nuts in the world. Proper selection of packaging materials is necessary to prevent absorption of moisture and aflatoxin formation which will influence the overall product quality and safety. This research is undertaken to study the effect of different type of flexible packaging films on the moisture and aflatoxin contents of whole pistachio nuts during storage at ambient temperature (22-28 °C) and relative humidity of 85-100%. Five types of plastic films tested were low density polyethylene (LDPE) which serves as the control, food-grade polyvinyl chloride (PVC), nylon (LDPE/PA), polyamide/polypropylene (PA/PP) and polyethylene terephthalate (PET). The moisture content and aflatoxin content of pistachio nuts were measured using oven drying method and HPLC, respectively. Sample were analysed at 0, 2, 4, 6, 8 and 10 months during the storage period. Results showed that there was an increase in moisture content with the increase in storage time of pistachio nuts. The increase in moisture content was associated with the aflatoxin level of pistachio nuts during storage time. All the packaging materials except LDPE delayed the moisture absorption and aflatoxin formation of the product. The most suitable packaging materials for maintaining the quality and safety of pistachio nuts is PET films followed by nylon, PA/PP and PVC. The shelf-life of pistachio can be extended from 2 months (Control) to 5 months when PET is used as the packaging material.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Variable Depth Bragg Peak Method for Single Event Effects Testing

NASA Technical Reports Server (NTRS)

Buchner, S.; Kanyogoro, N.; Foster, C.; O'Neill, P.

2011-01-01

Traditionally, accelerator SEE testing is accomplished by removing the tops of packages so that the IC chips are accessible to heavy ions. However, ICs in some advanced packages cannot be de-lidded so a different approach is used that involves grinding and/or chemically etching away part of the package and the chip from the back side. The parts are then tested from the back side with ions having sufficient range to reach the sensitive volume. More recently, the entire silicon substrate in an SOI/SRAM was removed, making it possible to use low-energy ions with shorter ranges. Where removal of part of the package is not possible, facilities at Michigan State, NASA Space Radiation Laboratory, GANIL (France) and GSI (Germany) offer high-energy heavy ions with long ranges so that the ions can reach the devices' sensitive volumes without much change in the LET. Unfortunately, a run will typically involve only one ion species having a single energy and LET due to the long time it takes to tune a new energy. The Variable Depth Bragg Peak (VDBP) method is similar to the above method in that it involves the use of high-energy heavy ions that are able to pass through the packaging material and reach the device, obviating the need to remove the package. However, the method provides a broad range of LETs from a single ion by inserting degraders in the beam that modify the ion energy and, therefore, the LET. The crux of the method involves establishing a fiduciary point for degrader thickness, i.e., where the Bragg peak is located precisely at the sensitive volume in the device, for which the measured SEU cross-section and the ion LET are both also maxima and can be calculated using a Monte-Carlo program, TRIM. Once the fiduciary point has been established, calibrated high density polyethylene (HDPE) degraders are inserted into or removed from the beam to vary the ion LET at the device in a known manner. After each change of degrader thickness, the SEU cross-section is measured and the corresponding LET calculated from the change in degrader thickness. That information is used to generate a plot of cross-section as a function of ion LET. The advantages of this approach are that the part does not have to be de-lidded and a broad range of LETs is available from a single heavy ion without having to go to non-normal angles of incidence to change the "effective" LET. As we will show, it is possible to obtain an entire curve of cross-section versus LET using just two or three ions. Fig. 1 shows curves of cross-section vs LET for a Freescale 4 Mbit SOI/SRAM measured at the 88" Cyclotron at Berkeley and at NSRL. The open symbols are the data obtained from Berkeley for top-side and back-side irradiation. The solid data points are for the data obtained at NSRL using a device for which the package was intact. The data are for Iron and Gold and cover a range of LETs from 4 MeV.cm2/mg to 84 MeV.cm2/mg. The agreement between the data obtained from Berkeley and from NSRL is excellent, demonstrating that the VDBP method is capable of providing accurate values of cross-section versus LET, at least for the 4 Mbit SRAM. Details of the technique will be included in the final presentation.

Scalable, Economical Fabrication Processes for Ultra-Compact Warm-White LEDs

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lowes, Ted

Conventional warm-white LED component fabrication consists of a large number of sequential steps which are required to incorporate electrical, mechanical, and optical functionality into the component. Each of these steps presents cost and yield challenges which multiply throughout the entire process. Although there has been significant progress in LED fabrication over the last decade, significant advances are needed to enable further reductions in cost per lumen while not sacrificing efficacy or color quality. Cree conducted a focused 18-month program to develop a new low-cost, high-efficiency light emitting diode (LED) architecture enabled by novel large-area parallel processing technologies, reduced number ofmore » fabrication steps, and minimized raw materials use. This new scheme is expected to enable ultra-compact LED components exhibiting simultaneously high efficacy and high color quality. By the end of the program, Cree fabricated warm-white LEDs with a room-temperature “instant on” efficacy of >135 lm/W at ~3500K and 90 CRI (when driven at the DOE baseline current density of 35 A/cm2). Cree modified the conventional LED fabrication process flow in a manner that is expected to translate into simultaneously high throughput and yield for ultra-compact packages. Building on its deep expertise in LED wafer fabrication, Cree developed these ultra-compact LEDs to have no compromises in color quality or efficacy compared to their conventional counterparts. Despite their very small size, the LEDs will also be robustly electrically integrated into luminaire systems with the same attach yield as conventional packages. The versatility of the prototype high-efficacy LED architecture will likely benefit solid-state lighting (SSL) luminaire platforms ranging from bulbs to troffers. We anticipate that the prototype LEDs will particularly benefit luminaires with large numbers of distributed compact packages, such as linear and area luminaires (e.g. troffers). The fraction of total SSL luminaire cost made up by the LEDs themselves has steadily fallen over the past several years, but can still make up 30% or more of the bill of materials; the new LED design will radically lower this proportion. Ultra-compact, highly efficient LEDs with optimal distribution in the system will further benefit luminaire materials and assembly costs by reducing the complexity and volume of thermal management and optical subsystems.« less

A novel post-weld-shift measurement and compensation technique in butterfly-type laser module packages

NASA Astrophysics Data System (ADS)

Hsu, Yi-Cheng, Sr.; Tsai, Y. C.; Hung, Y. S.; Cheng, W. H.

2005-08-01

One of the greatest challenges in the packaging of laser modules using laser welding technique is to use a reliable and accurate joining process. However, during welding, due to the material property difference between welded components, the rapid solidification of the welded region and the associated material shrinkage often introduced a post-weld-shift (PWS) between welded components. For a typical single-mode fiber application, if the PWS induced fiber alignment shift by the laser welding joining process is even a few micrometers, up to 50 % or greater loss in the coupled power may occur. The fiber alignment shift of the PWS effect in the laser welding process has a significant impact on the laser module package yield. Therefore, a detailed understanding of the effects of PWS on the fiber alignment shifts in laser-welded laser module packages and then the compensation of the fiber alignment shifts due to PWS effects are the key research subjects in laser welding techniques for optoelectronic packaging applications. Previously, the power losses due to PWS in butterfly-type laser module packages have been qualitatively corrected by applying the laser hammering technique to the direction of the detected shift. Therefore, by applying an elastic deformation to the welded components and by observing the corresponding power variation, the direction and magnitude of the PWS may be predicted. Despite numerous studies on improving the fabrication yields of laser module packaging using the PWS correction in laser welding techniques by a qualitative estimate, limited information is available for the quantitative understanding of the PWS induced fiber alignment shift which can be useful in designing and fabricating high-yield and high-performance laser module packages. The purpose of this paper is to present a quantitative probing of the PWS induced fiber alignment shift in laser-welded butterfly-type laser module packaging by employing a novel technique of a high-magnification camera with image capture system (HMCICS). The benefit of using the HMCICS technique to determine the fiber alignment shift are quantitatively measure and compensate the PWS direction and magnitude during the laser-welded laser module packages. This study makes it possible to probe the nonlinear behavior of the PWS by using a novel HMCICS technique that results in a real time quantitative compensation of the PWS in butterfly-type laser module packages, when compared to the currently available qualitatively estimated techniques to correct the PWS2. Therefore, the reliable butterfly-type laser modules with high yield and high performance used in lightwave transmission systems may thus be developed and fabricated.

Large-scale 3D simulations of ICF and HEDP targets

NASA Astrophysics Data System (ADS)

Marinak, Michael M.

2000-10-01

The radiation hydrodynamics code HYDRA continues to be developed and applied to 3D simulations of a variety of targets for both inertial confinement fusion (ICF) and high energy density physics. Several packages have been added enabling this code to perform ICF target simulations with similar accuracy as two-dimensional codes of long-time historical use. These include a laser ray trace and deposition package, a heavy ion deposition package, implicit Monte Carlo photonics, and non-LTE opacities, derived from XSN or the linearized response matrix approach.(R. More, T. Kato, Phys. Rev. Lett. 81, 814 (1998), S. Libby, F. Graziani, R. More, T. Kato, Proceedings of the 13th International Conference on Laser Interactions and Related Plasma Phenomena, (AIP, New York, 1997).) LTE opacities can also be calculated for arbitrary mixtures online by combining tabular values generated by different opacity codes. Thermonuclear burn, charged particle transport, neutron energy deposition, electron-ion coupling and conduction, and multigroup radiation diffusion packages are also installed. HYDRA can employ ALE hydrodynamics; a number of grid motion algorithms are available. Multi-material flows are resolved using material interface reconstruction. Results from large-scale simulations run on up to 1680 processors, using a combination of massively parallel processing and symmetric multiprocessing, will be described. A large solid angle simulation of Rayleigh-Taylor instability growth in a NIF ignition capsule has resolved simultaneously the full spectrum of the most dangerous modes that grow from surface roughness. Simulations of a NIF hohlraum illuminated with the initial 96 beam configuration have also been performed. The effect of the hohlraum’s 3D intrinsic drive asymmetry on the capsule implosion will be considered. We will also discuss results from a Nova experiment in which a copper sphere is crushed by a planar shock. Several interacting hydrodynamic instabilities, including the Widnall instability, cause breakup of the resulting vortex ring.

Quasi-Particle Self-Consistent GW for Molecules.

PubMed

Kaplan, F; Harding, M E; Seiler, C; Weigend, F; Evers, F; van Setten, M J

2016-06-14

We present the formalism and implementation of quasi-particle self-consistent GW (qsGW) and eigenvalue only quasi-particle self-consistent GW (evGW) adapted to standard quantum chemistry packages. Our implementation is benchmarked against high-level quantum chemistry computations (coupled-cluster theory) and experimental results using a representative set of molecules. Furthermore, we compare the qsGW approach for five molecules relevant for organic photovoltaics to self-consistent GW results (scGW) and analyze the effects of the self-consistency on the ground state density by comparing calculated dipole moments to their experimental values. We show that qsGW makes a significant improvement over conventional G0W0 and that partially self-consistent flavors (in particular evGW) can be excellent alternatives.

GENIE: a software package for gene-gene interaction analysis in genetic association studies using multiple GPU or CPU cores.

PubMed

Chikkagoudar, Satish; Wang, Kai; Li, Mingyao

2011-05-26

Gene-gene interaction in genetic association studies is computationally intensive when a large number of SNPs are involved. Most of the latest Central Processing Units (CPUs) have multiple cores, whereas Graphics Processing Units (GPUs) also have hundreds of cores and have been recently used to implement faster scientific software. However, currently there are no genetic analysis software packages that allow users to fully utilize the computing power of these multi-core devices for genetic interaction analysis for binary traits. Here we present a novel software package GENIE, which utilizes the power of multiple GPU or CPU processor cores to parallelize the interaction analysis. GENIE reads an entire genetic association study dataset into memory and partitions the dataset into fragments with non-overlapping sets of SNPs. For each fragment, GENIE analyzes: 1) the interaction of SNPs within it in parallel, and 2) the interaction between the SNPs of the current fragment and other fragments in parallel. We tested GENIE on a large-scale candidate gene study on high-density lipoprotein cholesterol. Using an NVIDIA Tesla C1060 graphics card, the GPU mode of GENIE achieves a speedup of 27 times over its single-core CPU mode run. GENIE is open-source, economical, user-friendly, and scalable. Since the computing power and memory capacity of graphics cards are increasing rapidly while their cost is going down, we anticipate that GENIE will achieve greater speedups with faster GPU cards. Documentation, source code, and precompiled binaries can be downloaded from http://www.cceb.upenn.edu/~mli/software/GENIE/.

GENIE: a software package for gene-gene interaction analysis in genetic association studies using multiple GPU or CPU cores

PubMed Central

2011-01-01

Background Gene-gene interaction in genetic association studies is computationally intensive when a large number of SNPs are involved. Most of the latest Central Processing Units (CPUs) have multiple cores, whereas Graphics Processing Units (GPUs) also have hundreds of cores and have been recently used to implement faster scientific software. However, currently there are no genetic analysis software packages that allow users to fully utilize the computing power of these multi-core devices for genetic interaction analysis for binary traits. Findings Here we present a novel software package GENIE, which utilizes the power of multiple GPU or CPU processor cores to parallelize the interaction analysis. GENIE reads an entire genetic association study dataset into memory and partitions the dataset into fragments with non-overlapping sets of SNPs. For each fragment, GENIE analyzes: 1) the interaction of SNPs within it in parallel, and 2) the interaction between the SNPs of the current fragment and other fragments in parallel. We tested GENIE on a large-scale candidate gene study on high-density lipoprotein cholesterol. Using an NVIDIA Tesla C1060 graphics card, the GPU mode of GENIE achieves a speedup of 27 times over its single-core CPU mode run. Conclusions GENIE is open-source, economical, user-friendly, and scalable. Since the computing power and memory capacity of graphics cards are increasing rapidly while their cost is going down, we anticipate that GENIE will achieve greater speedups with faster GPU cards. Documentation, source code, and precompiled binaries can be downloaded from http://www.cceb.upenn.edu/~mli/software/GENIE/. PMID:21615923

Effect of nano packaging on preservation quality of Nanjing 9108 rice variety at high temperature and humidity.

PubMed

Wang, Fan; Hu, Qiuhui; Mugambi Mariga, Alfred; Cao, Chongjiang; Yang, Wenjian

2018-01-15

A nano packaging material containing nano Ag, nano TiO 2 , nano attapulgite and SiO 2 was prepared, and its impact on quality of Nanjing 9108 rice at 37°C and 85% relative humidity was studied. Effects of the packaging on ambient gases and chromatic aberration of rice were determined. Moreover, oxidation level, molds growth and flavor of rice were also analyzed. Results showed that nano packaging material had antimicrobial effects and maintained low O 2 and high CO 2 content in the packages. The packages thereby inhibited the growth of molds and the production of fatty acids, restrained the increase of lipase activity, and reduced the oxidation of fats and proteins. As a result, the production of yellow and white-belly rice were inhibited. Furthermore, the color and flavor of rice were maintained. Therefore, the nano-packing material could be applied for preservation of rice to improve preservation quality. Copyright © 2017 Elsevier Ltd. All rights reserved.

High-voltage leak detection of a parenteral proteinaceous solution product packaged in form-fill-seal plastic laminate bags. Part 1. Method development and validation.

PubMed

Damgaard, Rasmus; Rasmussen, Mats; Buus, Peter; Mulhall, Brian; Guazzo, Dana Morton

2013-01-01

In Part 1 of this three-part research series, a leak test performed using high-voltage leak detection (HVLD) technology, also referred to as an electrical conductivity and capacitance leak test, was developed and validated for container-closure integrity verification of a small-volume laminate plastic bag containing an aqueous solution for injection. The sterile parenteral product is the rapid-acting insulin analogue, insulin aspart (NovoRapid®/NovoLog®, by Novo Nordisk A/S, Bagsværd, Denmark). The aseptically filled and sealed package is designed to preserve product sterility through expiry. Method development and validation work incorporated positive control packages with a single hole laser-drilled through the laminate film of each bag. A unique HVLD method characterized by specific high-voltage and potentiometer set points was established for testing bags positioned in each of three possible orientations as they are conveyed through the instrument's test zone in each of two possible directions-resulting in a total of six different test method options. Validation study results successfully demonstrated the ability of all six methods to accurately and reliably detect those packages with laser-drilled holes from 2.5-11.2 μm in nominal diameter. Part 2 of this series will further explore HVLD test results as a function of package seal and product storage variables. The final Part 3 will report the impact of HVLD exposure on product physico-chemical stability. In this Part 1 of a three-part research series, a leak test method based on electrical conductivity and capacitance, called high voltage leak detection (HVLD), was used to find leaks in small plastic bags filled with an insulin pharmaceutical solution for human injection by Novo Nordisk A/S (Bagsværd, Denmark). To perform the test, the package is electrically grounded while being conveyed past an electrode linked to a high-voltage, low-amperage transformer. The instrument measures the current that passes from the transformer to the electrode, through the packaged product and along the package walls, to the ground. Plastic packages without defect are relatively nonconductive and yield a low voltage reading; a leaking package with electrically conductive solution located in or near the leak triggers a spike in voltage reading. Test methods were optimized and validated, enabling the detection of leaking packages with holes as small as 2.5 μm in diameter. Part 2 of this series will further explore HVLD test results as a function of package seal and product storage variables. The final Part 3 will report the impact of HVLD exposure on product stability.

A Linear Electromagnetic Piston Pump

NASA Astrophysics Data System (ADS)

Hogan, Paul H.

Advancements in mobile hydraulics for human-scale applications have increased demand for a compact hydraulic power supply. Conventional designs couple a rotating electric motor to a hydraulic pump, which increases the package volume and requires several energy conversions. This thesis investigates the use of a free piston as the moving element in a linear motor to eliminate multiple energy conversions and decrease the overall package volume. A coupled model used a quasi-static magnetic equivalent circuit to calculate the motor inductance and the electromagnetic force acting on the piston. The force was an input to a time domain model to evaluate the mechanical and pressure dynamics. The magnetic circuit model was validated with finite element analysis and an experimental prototype linear motor. The coupled model was optimized using a multi-objective genetic algorithm to explore the parameter space and maximize power density and efficiency. An experimental prototype linear pump coupled pistons to an off-the-shelf linear motor to validate the mechanical and pressure dynamics models. The magnetic circuit force calculation agreed within 3% of finite element analysis, and within 8% of experimental data from the unoptimized prototype linear motor. The optimized motor geometry also had good agreement with FEA; at zero piston displacement, the magnetic circuit calculates optimized motor force within 10% of FEA in less than 1/1000 the computational time. This makes it well suited to genetic optimization algorithms. The mechanical model agrees very well with the experimental piston pump position data when tuned for additional unmodeled mechanical friction. Optimized results suggest that an improvement of 400% of the state of the art power density is attainable with as high as 85% net efficiency. This demonstrates that a linear electromagnetic piston pump has potential to serve as a more compact and efficient supply of fluid power for the human scale.

Surface modification of food contact materials for processing and packaging applications

NASA Astrophysics Data System (ADS)

Barish, Jeffrey A.

This body of work investigates various techniques for the surface modification of food contact materials for use in food packaging and processing applications. Nanoscale changes to the surface of polymeric food packaging materials enables changes in adhesion, wettability, printability, chemical functionality, and bioactivity, while maintaining desirable bulk properties. Polymer surface modification is used in applications such as antimicrobial or non-fouling materials, biosensors, and active packaging. Non-migratory active packagings, in which bioactive components are tethered to the package, offer the potential to reduce the need for additives in food products while maintaining safety and quality. A challenge in developing non-migratory active packaging materials is the loss of biomolecular activity that can occur when biomolecules are immobilized. Polyethylene glycol (PEG), a biocompatible polymer, is grafted from the surface of ozone treated low-density polyethylene (LDPE) resulting in a surface functionalized polyethylene to which a range of amine-terminated bioactive molecules can be immobilized. The grafting of PEG onto the surface of polymer packaging films is accomplished by free radical graft polymerization, and to covalently link an amine-terminated molecule to the PEG tether, demonstrating that amine-terminated bioactive compounds (such as peptides, enzymes, and some antimicrobials) can be immobilized onto PEG-grafted LDPE in the development of non-migratory active packaging. Fouling on food contact surfaces during food processing has a significant impact on operating efficiency and can promote biofilm development. Processing raw milk on plate heat exchangers results in significant fouling of proteins as well as minerals, and is exacerbated by the wall heating effect. An electroless nickel coating is co-deposited with polytetrafluoroethylene onto stainless steel to test its ability to resist fouling on a pilot plant scale plate heat exchanger. Further work was performed to test the stability of non-fouling material after extended exposure to an alkali detergent or acid sanitizer formulated for clean-in-place procedures in dairy processing facilities. Additionally, the anti-corrosive property of the surface coating was tested on carbon steel against chlorine ions, a common corrosive agent found in the food industry. Accelerated corrosion and long-term chemical exposure studies were conducted to measure the coating stability against the harsh corrosive agents.

A Comparative Study of Inspection Techniques for Array Packages

NASA Technical Reports Server (NTRS)

Mohammed, Jelila; Green, Christopher

2008-01-01

This viewgraph presentation reviews the inspection techniques for Column Grid Array (CGA) packages. The CGA is a method of chip scale packaging using high temperature solder columns to attach part to board. It is becoming more popular over other techniques (i.e. quad flat pack (QFP) or ball grid array (BGA)). However there are environmental stresses and workmanship challenges that require good inspection techniques for these packages.

JetWeb: A WWW interface and database for Monte Carlo tuning and validation

NASA Astrophysics Data System (ADS)

Butterworth, J. M.; Butterworth, S.

2003-06-01

A World Wide Web interface to a Monte Carlo tuning facility is described. The aim of the package is to allow rapid and reproducible comparisons to be made between detailed measurements at high-energy physics colliders and general physics simulation packages. The package includes a relational database, a Java servlet query and display facility, and clean interfaces to simulation packages and their parameters.

WCPP-THE WOLF PLOTTING AND CONTOURING PACKAGE

NASA Technical Reports Server (NTRS)

Masaki, G. T.

1994-01-01

The WOLF Contouring and Plotting Package provides the user with a complete general purpose plotting and contouring capability. This package is a complete system for producing line printer, SC4020, Gerber, Calcomp, and SD4060 plots. The package has been designed to be highly flexible and easy to use. Any plot from a quick simple plot (which requires only one call to the package) to highly sophisticated plots (including motion picture plots) can be easily generated with only a basic knowledge of FORTRAN and the plot commands. Anyone designing a software system that requires plotted output will find that this package offers many advantages over the standard hardware support packages available. The WCPP package is divided into a plot segment and a contour segment. The plot segment can produce output for any combination of line printer, SC4020, Gerber, Calcomp, and SD4060 plots. The line printer plots allow the user to have plots available immediately after a job is run at a low cost. Although the resolution of line printer plots is low, the quick results allows the user to judge if a high resolution plot of a particular run is desirable. The SC4020 and SD4060 provide high speed high resolution cathode ray plots with film and hard copy output available. The Gerber and Calcomp plotters provide very high quality (of publishable quality) plots of good resolution. Being bed or drum type plotters, the Gerber and Calcomp plotters are usually slow and not suited for large volume plotting. All output for any or all of the plotters can be produced simultaneously. The types of plots supported are: linear, semi-log, log-log, polar, tabular data using the FORTRAN WRITE statement, 3-D perspective linear, and affine transformations. The labeling facility provides for horizontal labels, vertical labels, diagonal labels, vector characters of a requested size (special character fonts are easily implemented), and rotated letters. The gridding routines label the grid lines according to user specification. Special line features include multiple lines, dashed lines, and tic marks. The contour segment of this package is a collection of subroutines which can be used to produce contour plots and perform related functions. The package can contour any data which can be placed on a grid or data which is regularly spaced, including any general affine or polar grid data. The package includes routines which will grid random data. Contour levels can be specified at any values desired. Input data can be smoothed with undefined points being acceptable where data is unreliable or unknown. Plots which are extremely large or detailed can be automatically output in parts to improve resolution or overcome plotter size limitations. The contouring segment uses the plot segment for actual plotting, thus all the features described for the plotting segment are available to the user of the contouring segment. Included with this package are two data bases for producing world map plots in Mercator projection. One data base provides just continent outlines and another provides continent outlines and national borders in great detail. This package is written in FORTRAN IV and IBM OS ASSEMBLER and has been implemented on an IBM 360 with a central memory requirement of approximately 140K of 8 bit bytes. The ASSEMBLER routines are basic plotter interface routines. The WCPP package was developed in 1972.

Assessment of the migration potential of nanosilver from nanoparticle-coated low-density polyethylene food packaging into food simulants.

PubMed

Hannon, Joseph Christopher; Kerry, Joseph P; Cruz-Romero, Malco; Azlin-Hasim, Shafrina; Morris, Michael; Cummins, Enda

2016-01-01

An experimental nanosilver-coated low-density polyethylene (LDPE) food packaging was incubated with food simulants using a conventional oven and tested for migration according to European Commission Regulation No. 10/2011. The commercial LDPE films were coated using a layer-by-layer (LbL) technique and three levels of silver (Ag) precursor concentration (0.5%, 2% and 5% silver nitrate (AgNO3), respectively) were used to attach antimicrobial Ag. The experimental migration study conditions (time, temperature and food simulant) under conventional oven heating (10 days at 60°C, 2 h at 70°C, 2 h at 60°C or 10 days at 70°C) were chosen to simulate the worst-case storage period of over 6 months. In addition, migration was quantified under microwave heating. The total Ag migrant levels in the food simulants were quantified by inductively coupled plasma-atomic emission spectroscopy (ICP-AES). Mean migration levels obtained by ICP-AES for oven heating were in the range 0.01-1.75 mg l(-1). Migration observed for microwave heating was found to be significantly higher when compared with oven heating for similar temperatures (100°C) and identical exposure times (2 min). In each of the packaging materials and food simulants tested, the presence of nanoparticles (NPs) was confirmed by scanning electron microscopy (SEM). On inspection of the migration observed under conventional oven heating, an important finding was the significant reduction in migration resulting from the increased Ag precursor concentration used to attach Ag on the LDPE LbL-coated films. This observation merits further investigation into the LbL coating process used, as it suggests potential for process modifications to reduce migration. In turn, any reduction in NP migration below regulatory limits could greatly support the antimicrobial silver nanoparticle (AgNP)-LDPE LbL-coated films being used as a food packaging material.

Design of magnetic system to produce intense beam of polarized molecules of H2 and D2

NASA Astrophysics Data System (ADS)

Yurchenko, A. V.; Nikolenko, D. M.; Rachek, I. A.; Shestakov, Yu V.; Toporkov, D. K.; Zorin, A. V.

2017-12-01

A magnetic-separating system is designed to produce polarized molecular high-density beams of H2/D2. The distribution of the magnetic field inside the aperture of the multipole magnet was calculated using the Mermaid software package. The calculation showed that the characteristic value of the magnetic field is 40 kGs, the field gradient is about 60 kGs/cm. A numerical calculation of the trajectories of the motion of molecules with different spin projections in this magnetic system is performed. The article discusses the possibility of using the magnetic system designed for the creation of a high-intensity source of polarized molecules. The expected intensity of this source is calculated. The expected flux of molecules focused in the receiver tube is 3.5·1016 mol/s for the hydrogen molecule and 2.0·1015 mol/s for the deuterium molecule.

On mechanism of explosive boiling in nanosecond regime

NASA Astrophysics Data System (ADS)

Çelen, Serap

2016-06-01

Today laser-based machining is used to manufacture vital parts for biomedical, aviation and aerospace industries. The aim of the paper is to report theoretical, numerical and experimental investigations of explosive boiling under nanosecond pulsed ytterbium fiber laser irradiation. Experiments were performed in an effective peak power density range between 1397 and 1450 MW/cm2 on pure titanium specimens. The threshold laser fluence for phase explosion, the pressure and temperature at the target surface and the velocity of the expulsed material were reported. A narrow transition zone was realized between the normal vaporization and phase explosion fields. The proof of heterogeneous boiling was given with detailed micrographs. A novel thermal model was proposed for laser-induced splashing at high fluences. Packaging factor and scattering arc radius terms were proposed to state the level of the melt ejection process. Results of the present investigation explain the explosive boiling during high-power laser interaction with metal.

Laboratory Connections: Review of Two Commercial Interfacing Packages.

ERIC Educational Resources Information Center

Powers, Michael H.

1989-01-01

Evaluates two Apple II interfacing packages designed to measure pH: (1) "Experiments in Chemistry" by HRM Software and (2) "Voltage Plotter III" by Vernier Software. Provides characteristics and screen dumps of each package. Reports both systems are suitable for high school or beginning college laboratories. (MVL)

A High Temperature Silicon Carbide mosfet Power Module With Integrated Silicon-On-Insulator-Based Gate Drive

DOE PAGES

Wang, Zhiqiang; Shi, Xiaojie; Tolbert, Leon M.; ...

2014-04-30

Here we present a board-level integrated silicon carbide (SiC) MOSFET power module for high temperature and high power density application. Specifically, a silicon-on-insulator (SOI)-based gate driver capable of operating at 200°C ambient temperature is designed and fabricated. The sourcing and sinking current capability of the gate driver are tested under various ambient temperatures. Also, a 1200 V/100 A SiC MOSFET phase-leg power module is developed utilizing high temperature packaging technologies. The static characteristics, switching performance, and short-circuit behavior of the fabricated power module are fully evaluated at different temperatures. Moreover, a buck converter prototype composed of the SOI gate drivermore » and SiC power module is built for high temperature continuous operation. The converter is operated at different switching frequencies up to 100 kHz, with its junction temperature monitored by a thermosensitive electrical parameter and compared with thermal simulation results. The experimental results from the continuous operation demonstrate the high temperature capability of the power module at a junction temperature greater than 225°C.« less

Packaging of a unit-length viral genome: the role of nucleotides and the gpD decoration protein in stable nucleocapsid assembly in bacteriophage lambda.

PubMed

Yang, Qin; Maluf, Nasib Karl; Catalano, Carlos Enrique

2008-11-28

The developmental pathways for a variety of eukaryotic and prokaryotic double-stranded DNA viruses include packaging of viral DNA into a preformed procapsid structure, catalyzed by terminase enzymes and fueled by ATP hydrolysis. In most instances, a capsid expansion process accompanies DNA packaging, which significantly increases the volume of the capsid to accommodate the full-length viral genome. "Decoration" proteins add to the surface of the expanded capsid lattice, and the terminase motors tightly package DNA, generating up to approximately 20 atm of internal capsid pressure. Herein we describe biochemical studies on genome packaging using bacteriophage lambda as a model system. Kinetic analysis suggests that the packaging motor possesses at least four ATPase catalytic sites that act cooperatively to effect DNA translocation, and that the motor is highly processive. While not required for DNA translocation into the capsid, the phage lambda capsid decoration protein gpD is essential for the packaging of the penultimate 8-10 kb (15-20%) of the viral genome; virtually no DNA is packaged in the absence of gpD when large DNA substrates are used, most likely due to a loss of capsid structural integrity. Finally, we show that ATP hydrolysis is required to retain the genome in a packaged state subsequent to condensation within the capsid. Presumably, the packaging motor continues to "idle" at the genome end and to maintain a positive pressure towards the packaged state. Surprisingly, ADP, guanosine triphosphate, and the nonhydrolyzable ATP analog 5'-adenylyl-beta,gamma-imidodiphosphate (AMP-PNP) similarly stabilize the packaged viral genome despite the fact that they fail to support genome packaging. In contrast, the poorly hydrolyzed ATP analog ATP-gammaS only partially stabilizes the nucleocapsid, and a DNA is released in "quantized" steps. We interpret the ensemble of data to indicate that (i) the viral procapsid possesses a degree of plasticity that is required to accommodate the packaging of large DNA substrates; (ii) the gpD decoration protein is required to stabilize the fully expanded capsid; and (iii) nucleotides regulate high-affinity DNA binding interactions that are required to maintain DNA in the packaged state.

Sensitivity and specificity of CT scanning for determining the number of internally concealed packages in 'body-packers'.

PubMed

Asha, Stephen Edward; Higham, Matthew; Child, Peter

2015-05-01

If package counts on abdominal CTs of body-packers were known to be accurate, follow-up CTs could be avoided. The objective was to determine the accuracy of CT for the number of concealed packages in body-packers, and the reliability of package counts reported by body-packers who admit to concealing drugs. Suspected body-packers were identified from the emergency departments (ED) database. The medical record and radiology reports were reviewed for package counts determined by CT, patient-reported and physically retrieved. The last method was used as the reference standard. Sensitivity, specificity, positive predictive values (PPV) and negative predictive values (NPV) were calculated for CT package count accuracy. Reliability of patient-reported package counts was assessed using Pearson's correlation coefficient. There were 50 confirmed body-packers on whom 104 CT scans were performed. Data for the index and reference tests were available for 84 scans. The sensitivity, specificity, PPV and NPV for CT package count were 63% (95% CI 46% to 77%), 82% (95% CI 67% to 92%), 76% (95% CI 58% to 89%) and 71% (95% CI 56% to 83%) respectively. For CTs with a package count<15, the sensitivity, specificity, PPV and NPV for CT package count were 96% (95% CI 80% to 99%), 95% (95% CI 82% to 99%), 93% (95% CI 76% to 99%) and 97% (95% CI 86% to 100%), respectively. Correlation between patient-reported package counts and the number of packages retrieved was high (r=0.90, p<0.001, R2=81%). The accuracy of CT for determining the number of concealed packages is poor, although when applied to patients with few concealed packages accuracy is high and is useful as a rule-out test. Among patients who have admitted to drug concealment, the number of packages reported to be concealed is reliable. Published by the BMJ Publishing Group Limited. For permission to use (where not already granted under a licence) please go to http://group.bmj.com/group/rights-licensing/permissions.

High-Voltage Leak Detection of a Parenteral Proteinaceous Solution Product Packaged in Form-Fill-Seal Plastic Laminate Bags. Part 3. Chemical Stability and Visual Appearance of a Protein-Based Aqueous Solution for Injection as a Function of HVLD Exposure.

PubMed

Rasmussen, Mats; Damgaard, Rasmus; Buus, Peter; Guazzo, Dana Morton

2013-01-01

This Part 3 of this three-part research series reports the impact of high-voltage leak detection (HVLD) exposure on the physico-chemical stability of the packaged product. The product, intended for human administration by injection, is an aqueous solution formulation of the rapid acting insulin analogue, insulin aspart (NovoRapid®/NovoLog®) by Novo Nordisk A/S, Bagsværd, Denmark. The package is a small-volume form-fill-seal plastic laminate bag. Product-packages exposed to HVLD were compared to unexposed product after storage for 9 months at recommended storage conditions of 5 ± 3 °C. No differences in active ingredient or degradation products assays were noted. No changes in any other stability indicating parameter results were observed. This report concludes this three-part series. Part 1 documented HVLD method development and validation work. Part 2 explored the impact of various package material, package temperature, and package storage conditions on HVLD test results. Detection of leaks in the bag seal area was investigated. In conclusion, HVLD is reported to be a validatable leak test method suitable for rapid, nondestructive container-closure integrity evaluation of the subject product-package. In Part 1 of this three-part series, a leak test method based on electrical conductivity and capacitance, also called high-voltage leak detection (HVLD), was proven to find hole leaks in small plastic bags filled with a solution of insulin aspart intended for human injection (NovoRapid®/NovoLog® by Novo Nordisk A/S, Bagsværd, Denmark). In Part 2, the ability of the HVLD method to find other types of package leaks was tested, and the impact of package material and product storage temperature on HVLD results was explored. This final Part 3 checked how well the packaged protein drug solution maintained its potency after HVLD exposure over 9 months of storage under long-term stability conditions. Results showed that HVLD caused no harm to the product.

A microelectronics approach for the ROSETTA surface science package

NASA Technical Reports Server (NTRS)

Sandau, Rainer (Editor); Alkalaj, Leon

1996-01-01

In relation to the Rosetta surface science package, the benefits of the application of advanced microelectronics packaging technologies and other output from the Mars environmental survey (MESUR) integrated microelectronics study are reported on. The surface science package will be designed to operate for tens of hours. Its limited mass and power consumption make necessary a highly integrated design with all the instruments and subunits operated from a centralized control and information management subsystem.

Kinematics Simulation Analysis of Packaging Robot with Joint Clearance

NASA Astrophysics Data System (ADS)

Zhang, Y. W.; Meng, W. J.; Wang, L. Q.; Cui, G. H.

2018-03-01

Considering the influence of joint clearance on the motion error, repeated positioning accuracy and overall position of the machine, this paper presents simulation analysis of a packaging robot — 2 degrees of freedom(DOF) planar parallel robot based on the characteristics of high precision and fast speed of packaging equipment. The motion constraint equation of the mechanism is established, and the analysis and simulation of the motion error are carried out in the case of turning the revolute clearance. The simulation results show that the size of the joint clearance will affect the movement accuracy and packaging efficiency of the packaging robot. The analysis provides a reference point of view for the packaging equipment design and selection criteria and has a great significance on the packaging industry automation.

76 FR 54808 - Agency Information Collection Activities: Submission for the Office of Management and Budget (OMB...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-09-02

... the Independent Storage of Spent Nuclear Fuel, High-Level Radioactive Waste and Reactor-Related... receive, transfer, package and possess power reactor spent fuel, high-level waste, and other radioactive..., package, and possess power reactor spent fuel and high-level radioactive waste, and other associated...

Transmitter experiment package for the communications technology satellite

NASA Technical Reports Server (NTRS)

Farber, B.; Goldin, D. S.; Marcus, B.; Mock, P.

1977-01-01

The operating requirements, system design characteristics, high voltage packaging considerations, nonstandard components development, and test results for the transmitter experiment package (TEP) are described. The TEP is used for broadcasting power transmission from the Communications Technology Satellite. The TEP consists of a 12 GHz, 200-watt output stage tube (OST), a high voltage processing system that converts the unregulated spacecraft solar array power to the regulated voltages required for OST operation, and a variable conductance heat pipe system that is used to cool the OST body.

[A research of letter color visibility in package insert information using simulator].

PubMed

Kamimura, Naoki; Kinoshita, Noriyuki; Onaga, Midori; Watanabe, Yurika; Ijuin, Kazushige; Shikamura, Yoshiaki; Negishi, Kenichi; Kaiho, Fusao; Ohta, Takafumi

2012-01-01

Package insert of pharmaceutical drug is one of the most prioritized information for pharmacists to secure safety of patients. However, the color of character, size, font and so on are various company by company product to product from a viewpoint of visibility. It may be cause a serious accident in case visibility is unclear, although it is the most important information. Moreover, package insert with high visibility is required for color vision defectives from a viewpoint of a universal design. Then, the authors selected the package insert which has the boxed warning in the ethical pharmaceutical currently stored mostly in the present health insurance pharmacy and quantified the red color using the color meter. We advocate the state of a suitable package insert from a viewpoint of a universal design, whether the red color is high visible or not for color vision defectives using simulator.

Application of Thermo-Mechanical Measurements of Plastic Packages for Reliability Evaluation of PEMS

NASA Technical Reports Server (NTRS)

Sharma, Ashok K.; Teverovsky, Alexander

2004-01-01

Thermo-mechanical analysis (TMA) is typically employed for measurements of the glass transition temperature (Tg) and coefficients of thermal expansion (CTE) in molding compounds used in plastic encapsulated microcircuits (PEMs). Application of TMA measurements directly to PEMs allows anomalies to be revealed in deformation of packages with temperature, and thus indicates possible reliability concerns related to thermo-mechanical integrity and stability of the devices. In this work, temperature dependencies of package deformation were measured in several types of PEMs that failed environmental stress testing including temperature cycling, highly accelerated stress testing (HAST) in humid environments, and bum-in (BI) testing. Comparison of thermo-mechanical characteristics of packages and molding compounds in the failed parts allowed for explanation of the observed failures. The results indicate that TMA of plastic packages might be used for quality evaluation of PEMs intended for high-reliability applications.

Child-directed and nutrition-focused marketing cues on food packaging: links to nutritional content.

PubMed

Lapierre, Matthew A; Brown, Autumn M; Houtzer, Hunter V; Thomas, Tyler J

2017-04-01

We tested whether the presence of both child-targeted and nutrition-focused (i.e. parent-targeted) marketing cues on food packaging was associated with the nutritional content of these products. We conducted a quantitative content analysis of 403 food packages chosen randomly from the supermarket's online portal along with all products (n 312) from the cereal aisle in a supermarket from the Southeastern USA. We examined main and interaction effects for cues on nutritional content (e.g. energy density, sugar, sodium, fibre). A regional supermarket chain in the Southeastern USA. Tests of main effects indicated that increased presence of nutritional cues was linked to more nutritious content (e.g. less sugar, less saturated fat, more fibre) while the increased presence of child-targeted cues was uniformly associated with less nutritious content (e.g. more sugar, less protein, less fibre). Among the interaction effects, results revealed that products with increased nutrition-focused and child-targeted cues were likely to contain significantly more sugar and less protein than other products. Products that seek to engage children with their packaging in the supermarket are significantly less nutritious than foods that do not, while product packages that suggest nutritional benefits have more nutritious content. More importantly, the study provides evidence that those products which try to engage both child and parent consumers are significantly less healthy in crucial ways (e.g. more sugar, less fibre) than products that do not.

EFTofPNG: a package for high precision computation with the effective field theory of post-Newtonian gravity

NASA Astrophysics Data System (ADS)

Levi, Michele; Steinhoff, Jan

2017-12-01

We present a novel public package ‘EFTofPNG’ for high precision computation in the effective field theory of post-Newtonian (PN) gravity, including spins. We created this package in view of the timely need to publicly share automated computation tools, which integrate the various types of physics manifested in the expected increasing influx of gravitational wave (GW) data. Hence, we created a free and open source package, which is self-contained, modular, all-inclusive, and accessible to the classical gravity community. The ‘EFTofPNG’ Mathematica package also uses the power of the ‘xTensor’ package, suited for complicated tensor computation, where our coding also strategically approaches the generic generation of Feynman contractions, which is universal to all perturbation theories in physics, by efficiently treating n-point functions as tensors of rank n. The package currently contains four independent units, which serve as subsidiaries to the main one. Its final unit serves as a pipeline chain for the obtainment of the final GW templates, and provides the full computation of derivatives and physical observables of interest. The upcoming ‘EFTofPNG’ package version 1.0 should cover the point mass sector, and all the spin sectors, up to the fourth PN order, and the two-loop level. We expect and strongly encourage public development of the package to improve its efficiency, and to extend it to further PN sectors, and observables useful for the waveform modelling.

On the implicit density based OpenFOAM solver for turbulent compressible flows

NASA Astrophysics Data System (ADS)

Fürst, Jiří

The contribution deals with the development of coupled implicit density based solver for compressible flows in the framework of open source package OpenFOAM. However the standard distribution of OpenFOAM contains several ready-made segregated solvers for compressible flows, the performance of those solvers is rather week in the case of transonic flows. Therefore we extend the work of Shen [15] and we develop an implicit semi-coupled solver. The main flow field variables are updated using lower-upper symmetric Gauss-Seidel method (LU-SGS) whereas the turbulence model variables are updated using implicit Euler method.

Influence of man-made aluminosilicate raw materials on physical and mechanical properties of building materials.

NASA Astrophysics Data System (ADS)

Volodchenko, A. A.; Lesovik, V. S.; Stoletov, A. A.; Glagolev, E. S.; Volodchenko, A. N.; Magomedov, Z. G.

2018-03-01

It has been identified that man-made aluminosilicate raw materials represented by clay rock of varied genesis can be used as energy-efficient raw materials to obtain efficient highly-hollow non-autoclaved silicate materials. A technique of structure formation in the conditions of pressureless steam treatment has been offered. Cementing compounds of non- autoclaved silicate materials based on man-made aluminosilicate raw materials possess hydraulic properties that are conditioned by the process of further formation and recrystallization of calcium silicate hydrates, which optimizes the ratio between gellike and crystalline components and densifies the cementing compound structure, which leads to improvement of performance characteristics. Increasing the performance characteristics of the obtained products is possible by changing the molding conditions. For this reason, in order to create high-density material packaging and, as a result, to increase the strength properties of the products, it is reasonable to use higher pressure, under which raw brick is formed, which will facilitate the increase of quality of highly-hollow products.

Natural biopolymer-based nanocomposite films for packaging applications.

PubMed

Rhim, Jong-Whan; Ng, Perry K W

2007-01-01

Concerns on environmental waste problems caused by non-biodegradable petrochemical-based plastic packaging materials as well as the consumer's demand for high quality food products has caused an increasing interest in developing biodegradable packaging materials using annually renewable natural biopolymers such as polysaccharides and proteins. Inherent shortcomings of natural polymer-based packaging materials such as low mechanical properties and low water resistance can be recovered by applying a nanocomposite technology. Polymer nanocomposites, especially natural biopolymer-layered silicate nanocomposites, exhibit markedly improved packaging properties due to their nanometer size dispersion. These improvements include increased modulus and strength, decreased gas permeability, and increased water resistance. Additionally, biologically active ingredients can be added to impart the desired functional properties to the resulting packaging materials. Consequently, natural biopolymer-based nanocomposite packaging materials with bio-functional properties have a huge potential for application in the active food packaging industry. In this review, recent advances in the preparation of natural biopolymer-based films and their nanocomposites, and their potential use in packaging applications are addressed.

Phosphor chessboard packaging for white LEDs in high efficiency and high color performance

NASA Astrophysics Data System (ADS)

Nguyen, Quang-Khoi; Chang, Yu-Yu; Lu, Chun-Yan; Yang, Tsung-Hsun; Chung, Te-Yuan; Sun, Ching-Cherng

2016-09-01

We performed the simulation of white LEDs packaging with different chessboard structures of white light converting phosphor layer covered on GaN die chip. Three different types of chessboard structures are called type 1, type 2 and type 3, respectively. The result of investigation according to the phosphor thickness show the increasing of thickness of phosphor layer are, the decreasing of output blue light power are. Meanwhile, the changes of yellow light are neglect. Type 3 shows highest packaging efficiency of 74.3 % compares with packaging efficiency of type 2 and type 1 (72.5 % and 71.3 %, respectively). Type 3 also shows the most effect of forward light. Attention that the type 3 chessboard structure gets packaging efficiency of 74.3 % at color temperature of daylight as well as high saving of phosphor amount. The color temperatures of three types of chessboard structure are higher than 5000 K, so they are suitable for lighting purpose. The angular correlate color temperature deviation (ACCTD) of type 1, type 2 and type 3 are 6500K, 11500K and 17000K, respectively.

ImagingReso: A Tool for Neutron Resonance Imaging

DOE PAGES

Zhang, Yuxuan; Bilheux, Jean -Christophe

2017-11-01

ImagingReso is an open-source Python library that simulates the neutron resonance signal for neutron imaging measurements. By defining the sample information such as density, thickness in the neutron path, and isotopic ratios of the elemental composition of the material, this package plots the expected resonance peaks for a selected neutron energy range. Various sample types such as layers of single elements (Ag, Co, etc. in solid form), chemical compounds (UO 3, Gd 2O 3, etc.), or even multiple layers of both types can be plotted with this package. As a result, major plotting features include display of the transmission/attenuation inmore » wavelength, energy, and time scale, and show/hide elemental and isotopic contributions in the total resonance signal.« less

Structure-Function Analysis of the DNA Translocating Portal of the Bacteriophage T4 Packaging Machine

PubMed Central

Padilla-Sanchez, Victor; Gao, Song; Kim, Hyung Rae; Kihara, Daisuke; Sun, Lei; Rossmann, Michael G.; Rao, Venigalla B.

2013-01-01

Tailed bacteriophages and herpesviruses consist of a structurally well conserved dodecameric portal at a special five-fold vertex of the capsid. The portal plays critical roles in head assembly, genome packaging, neck/tail attachment, and genome ejection. Although the structures of portals from phages φ29, SPP1 and P22 have been determined, their mechanistic roles have not been well understood. Structural analysis of phage T4 portal (gp20) has been hampered because of its unusual interaction with the E. coli inner membrane. Here, we predict atomic models for the T4 portal monomer and dodecamer, and fit the dodecamer into the cryoEM density of the phage portal vertex. The core structure, like that from other phages, is cone-shaped with the wider end containing the “wing” and “crown” domains inside the phage head. A long “stem” encloses a central channel, and a narrow “stalk” protrudes outside the capsid. A biochemical approach was developed to analyze portal function by incorporating plasmid-expressed portal protein into phage heads and determining the effect of mutations on head assembly, DNA translocation, and virion production. We found that the protruding loops of the stalk domain are involved in assembling the DNA packaging motor. A loop that connects the stalk to the channel might be required for communication between the motor and portal. The “tunnel” loops that project into the channel are essential for sealing the packaged head. These studies established that the portal is required throughout the DNA packaging process, with different domains participating at different stages of genome packaging. PMID:24126213

Development of antioxidant packaging material by applying corn-zein to LLDPE film in combination with phenolic compounds.

PubMed

Park, Hye-Yeon; Kim, Sung-Jin; Kim, Ki Myong; You, Young-Sun; Kim, So Yeon; Han, Jaejoon

2012-10-01

Functional active packaging materials were successfully developed by incorporating antioxidant agents into corn-zein-laminated linear low-density polyethylene (LLDPE) film. The minimum effective concentrations of the active compounds (for example, thymol, carvacrol, eugenol) were determined and these compounds were then laminated into LLDPE films to develop corn-zein-laminated films with antioxidant agents. The release rate of antioxidant agents in gas and liquid media were determined along with the mechanical and water barrier properties of the films containing these compounds. Tensile strength and percentage elongation at break were reduced in the corn-zein-laminated LLDPE films when compared to typical LLDPE film. Furthermore, the ability of the corn-zein-laminated films to repel moisture decreased by approximately 12.2%, but was improved by incorporating hydrophobic antioxidant compounds in the corn-zein layer. Examination of release kinetics in the gas and liquid phases verified that antioxidants were effectively released from the films and inhibited oxidation during testing. Finally, the films were used for fresh ground beef packaging, and effectively inhibited lipid oxidation and had a positive effect on the color stability of beef patties during storage. These results indicate that the developed antioxidant films are a novel active packaging material that can be effectively implemented by the food industry to improve the quality and safety of foods. Zein protein, a by-product of corn processing industry, was laminated into plastic films in combination with natural phenolic compounds to develop antioxidant packaging films. The films demonstrated their efficient release patterns of antioxidant compounds, which are suitable for packaging applications and food protection. © 2012 Institute of Food Technologists®

Multi-layer accretion disks around black holes and formation of a hot ion-torus

NASA Astrophysics Data System (ADS)

Hujeirat, A.; Camenzind, M.

2000-08-01

We present the first 2D steady-state numerical radiative hydrodynamical calculations showing the formation of a low-density hot torus in the very inner region of accretion disks around a black hole. The inner part of the disk is found to be thermally unstable when Bremsstrahlung is the dominant cooling mechanism. Within the parameter regime used and in the absence of magnetic fields, the torus-plasma is highly time-dependent with supersonic oscillating motion with respect to the electron temperature. When the soft photons from the disk comptonize the electrons efficiently, the ion-pressure supported torus shrinks in volume, but decelerates further the inward motion into the hole. We speculate that magnetic fields would stabilize the tori by lowering its energy package through initiating jets and/or outflows. In the outer region, we find that the scale height of the angular velocity HΩ largely exceeds the scale height of the density Hρ. This yields a multi-layer flow-structure in the vertical direction which slows the inwards motion into the BH significantly, enhancing further the formation of the hot torus.

Space shuttle food system study: Food and beverage package development, modification 8S

NASA Technical Reports Server (NTRS)

1976-01-01

A new, highly utile rehydration package was developed for foods in zero gravity. Rehydratable foods will become more acceptable as a result of their overall rehydration capability and improved palatability. This new package design is greatly enhanced by the specified spacecraft condition of atmospheric pressure; the pressure differential between the atmosphere and the package carries the functional responsibility for rapid food rehydration without excess package manipulation by the consumer. Crew acceptance will further be enhanced by less manipulation, hotter rehydration water temperatures and the ability to hold the foods at preparation temperatures until they are consumed.

High barrier multilayer packaging by the coextrusion method: The effect of nanocomposites and biodegradable polymers on flexible film properties

NASA Astrophysics Data System (ADS)

Thellen, Christopher T.

The objective of this research was to investigate the use of nanocomposite and multilayer co-extrusion technologies for the development of high gas barrier packaging that is more environmentally friendly than many current packaging system. Co-extruded bio-based and biodegradable polymers that could be composted in a municipal landfill were one direction that this research was aimed. Down-gauging of high performance barrier films using nanocomposite technology and co-extrusion was also investigated in order to reduce the amount of solid waste being generated by the packaging. Although the research is focused on military ration packaging, the technologies could easily be introduced into the commercial flexible packaging market. Multilayer packaging consisting of poly(m-xylylene adipamide) nanocomposite layers along with adhesive and tie layers was co-extruded using both laboratory and pilot-scale film extrusion equipment. Co-extrusion of biodegradable polyhydroxyalkanoates (PHA) along with polyvinyl alcohol (PVOH) and tie layers was also accomplished using similar co-extrusion technology. All multilayer films were characterized for gas barrier, mechanical, and thermal properties. The biodegradability of the PVOH and PHA materials in a marine environment was also investigated. The research has shown that co-extrusion of these materials is possible at a research and pilot level. The use of nanocomposite poly(m-xylylene adipamide) was effective in down-gauging the un-filled barrier film to thinner structures. Bio-based PHA/PVOH films required the use of a malefic anhydride grafted PHA tie layer to improve layer to layer adhesion in the structure to avoid delamination. The PHA polymer demonstrated a high rate of biodegradability/mineralization in the marine environment while the rate of biodegradation of the PVOH polymer was slower.