Science.gov

Sample records for high quality gan

  1. High Quality, Low Cost Ammonothermal Bulk GaN Substrates

    SciTech Connect

    Ehrentraut, D; Pakalapati, RT; Kamber, DS; Jiang, WK; Pocius, DW; Downey, BC; McLaurin, M; D'Evelyn, MP

    2013-12-18

    Ammonothermal GaN growth using a novel apparatus has been performed on c-plane, m-plane, and semipolar seed crystals with diameters between 5 mm and 2 in. to thicknesses of 0.5-3 mm. The highest growth rates are greater than 40 mu m/h and rates in the 10-30 mu m/h range are routinely observed for all orientations. These values are 5-100x larger than those achieved by conventional ammonothermal GaN growth. The crystals have been characterized by X-ray diffraction rocking-curve (XRC) analysis, optical and scanning electron microscopy (SEM), cathodoluminescence (CL), optical spectroscopy, and capacitance-voltage measurements. The crystallinity of the grown crystals is similar to or better than that of the seed crystals, with FWHM values of about 20-100 arcsec and dislocation densities of 1 x 10(5)-5 x 10(6) cm(-2). Dislocation densities below 10(4) cm(-2) are observed in laterally-grown crystals. Epitaxial InGaN quantum well structures have been successfully grown on ammonothermal wafers. (C) 2013 The Japan Society of Applied Physics

  2. (-201) β-Gallium oxide substrate for high quality GaN materials

    NASA Astrophysics Data System (ADS)

    Roqan, I. S.; Muhammed, M. M.

    2014-03-01

    (-201) oriented β-Ga2O3 has the potential to be used as a transparent and conductive substrate for GaN-growth. The key advantages of Ga2O3 are its small lattice mismatches (4.7%), appropriate structural, thermal and electrical properties and a competitive price compared to other substrates. Optical characterization show that GaN layers grown on (-201) oriented β-Ga2O3 are dominated by intense bandedge emission with a high luminescence efficiency. Atomic force microscopy studies show a modest threading dislocation density of ~108 cm-2, while complementary Raman spectroscopy indicates that the GaN epilayer is of high quality with slight compressive strain. Room temperature time-findings suggest that the limitation of the photoluminescence lifetime (~500 ps) is due to nonradiative recombination arising from threading dislocation. Therefore, by optimizing the growth conditions, high quality material with significant optical efficiency can be obtained.

  3. High-quality GaN nanowires grown on Si and porous silicon by thermal evaporation

    NASA Astrophysics Data System (ADS)

    Shekari, L.; Ramizy, A.; Omar, K.; Hassan, H. Abu; Hassan, Z.

    2012-12-01

    Nanowires (NWs) of GaN thin films were prepared on as-grown Si (1 1 1) and porous silicon (PS) substrates using thermal evaporation method. The film growth produced high-quality wurtzite GaN NWs. The size, morphology, and nanostructures of the crystals were investigated through scanning electron microscopy, high-resolution X-ray diffraction and photoluminescence spectroscopy. The NWs grown on porous silicon were thinner, longer and denser compared with those on as-grown Si. The energy band gap of the NWs grown on PS was larger than that of NWs on as-grown Si. This is due to the greater quantum confinement effects of the crystalline structure of the NWs grown on PS.

  4. High quality factor two dimensional GaN photonic crystal cavity membranes grown on silicon substrate

    NASA Astrophysics Data System (ADS)

    Vico Triviño, N.; Rossbach, G.; Dharanipathy, U.; Levrat, J.; Castiglia, A.; Carlin, J.-F.; Atlasov, K. A.; Butté, R.; Houdré, R.; Grandjean, N.

    2012-02-01

    We report on the achievement of freestanding GaN photonic crystal L7 nanocavities with embedded InGaN/GaN quantum wells grown by metal organic vapor phase epitaxy on Si (111). GaN was patterned by e-beam lithography, using a SiO2 layer as a hard mask, and usual dry etching techniques. The membrane was released by underetching the Si (111) substrate. Micro-photoluminescence measurements performed at low temperature exhibit a quality factor as high as 5200 at ˜420 nm, a value suitable to expand cavity quantum electrodynamics to the near UV and the visible range and to develop nanophotonic platforms for biofluorescence spectroscopy.

  5. High-quality GaN films obtained by air-bridged lateral epitaxial growth

    NASA Astrophysics Data System (ADS)

    Ishibashi, Akihiko; Kidoguchi, Isao; Sugahara, Gaku; Ban, Yuzaburoh

    2000-12-01

    High-quality GaN films with low dislocation density and low wing tilt of c-axis orientation have been successfully obtained by a promising technique of selected area growth, namely air-bridged lateral epitaxial growth (ABLEG). A GaN film was grown from the exposed (0 0 0 1) top facet of the ridged GaN seed structures, whose side walls and etched bottoms were covered with silicon nitride mask, using low-pressure metalorganic vapor-phase epitaxy. The ridge-stripe structures of the GaN seed were constructed in the 1 1¯00 GaN direction. At the optimum growth temperature of 950°C, only the 1 1 2¯ 0 and {0 0 0 1} facets were obtained. Continuing the growth led to fabricating the air-bridged structure, where the coalescence of the wing region occurred. From the transmission electron microscopy study, it was found that most of the vertical dislocations along the c-axis were confined to the seed region, while the horizontal dislocations were newly generated in the vicinity of coalescence boundary. The densities of the vertical dislocations were about 9×10 8 cm -2 in the seed region, while below 1×10 6 cm -2 in other regions. The densities of the horizontal dislocations were about 1×10 6 cm -2 in the wing region and 4×10 7 cm -2 in the vicinity of the coalescence boundary, respectively. The X-ray diffraction (XRD) measurements revealed that the tilt angle of c-axis relative to underlying seed GaN was about 297 arcsec (0.083°), and the full-width at half-maximum of the XRD curve for the wing region was 138 arcsec, indicating that the wing region has high uniformity of c-axis orientation. Both of the wing and the coalescence boundary region exhibited atomically smooth surfaces with stepped terraces, whose root mean square roughness was found to be 0.089 nm by atomic force microscopy measurements.

  6. GaN High Power Devices

    SciTech Connect

    PEARTON,S.J.; REN,F.; ZHANG,A.P.; DANG,G.; CAO,X.A.; LEE,K.P.; CHO,H.; GILA,B.P.; JOHNSON,J.W.; MONIER,C.; ABERNATHY,C.R.; HAN,JUNG; BACA,ALBERT G.; CHYI,J.-I.; LEE,C.-M.; NEE,T.-E.; CHUO,C.-C.; CHI,G.C.; CHU,S.N.G.

    2000-07-17

    A brief review is given of recent progress in fabrication of high voltage GaN and AlGaN rectifiers, GaN/AlGaN heterojunction bipolar transistors, GaN heterostructure and metal-oxide semiconductor field effect transistors. Improvements in epitaxial layer quality and in fabrication techniques have led to significant advances in device performance.

  7. A new approach to epitaxially grow high-quality GaN films on Si substrates: the combination of MBE and PLD

    PubMed Central

    Wang, Wenliang; Wang, Haiyan; Yang, Weijia; Zhu, Yunnong; Li, Guoqiang

    2016-01-01

    High-quality GaN epitaxial films have been grown on Si substrates with Al buffer layer by the combination of molecular beam epitaxy (MBE) and pulsed laser deposition (PLD) technologies. MBE is used to grow Al buffer layer at first, and then PLD is deployed to grow GaN epitaxial films on the Al buffer layer. The surface morphology, crystalline quality, and interfacial property of as-grown GaN epitaxial films on Si substrates are studied systematically. The as-grown ~300 nm-thick GaN epitaxial films grown at 850 °C with ~30 nm-thick Al buffer layer on Si substrates show high crystalline quality with the full-width at half-maximum (FWHM) for GaN(0002) and GaN(102) X-ray rocking curves of 0.45° and 0.61°, respectively; very flat GaN surface with the root-mean-square surface roughness of 2.5 nm; as well as the sharp and abrupt GaN/AlGaN/Al/Si hetero-interfaces. Furthermore, the corresponding growth mechanism of GaN epitaxial films grown on Si substrates with Al buffer layer by the combination of MBE and PLD is hence studied in depth. This work provides a novel and simple approach for the epitaxial growth of high-quality GaN epitaxial films on Si substrates. PMID:27101930

  8. Grouped and Multistep Nanoheteroepitaxy: Toward High-Quality GaN on Quasi-Periodic Nano-Mask.

    PubMed

    Feng, Xiaohui; Yu, Tongjun; Wei, Yang; Ji, Cheng; Cheng, Yutian; Zong, Hua; Wang, Kun; Yang, Zhijian; Kang, Xiangning; Zhang, Guoyi; Fan, Shoushan

    2016-07-20

    A novel nanoheteroepitaxy method, namely, the grouped and multistep nanoheteroepitaxy (GM-NHE), is proposed to attain a high-quality gallium nitride (GaN) epilayer by metal-organic vapor phase epitaxy. This method combines the effects of sub-100 nm nucleation and multistep lateral growth by using a low-cost but unique carbon nanotube mask, which consists of nanoscale growth windows with a quasi-periodic 2D fill factor. It is found that GM-NHE can facilely reduce threading dislocation density (TDD) and modulate residual stress on foreign substrate without any regrowth. As a result, high-quality GaN epilayer is produced with homogeneously low TDD of 4.51 × 10(7) cm(-2) and 2D-modulated stress, and the performance of the subsequent 410 nm near-ultraviolet light-emitting diode is greatly boosted. In this way, with the facile fabrication of nanomask and the one-off epitaxy procedure, GaN epilayer is prominently improved with the assistance of nanotechnology, which demonstrates great application potential for high-efficiency TDD-sensitive optoelectronic and electronic devices.

  9. GaN Electronics For High Power, High Temperature Applications

    SciTech Connect

    PEARTON,S.J.; REN,F.; ZHANG,A.P.; DANG,G.; CAO,X.A.; LEE,K.P.; CHO,H.; GILA,B.P.; JOHNSON,J.W.; MONIER,C.; ABERNATHY,C.R.; HAN,JUNG; BACA,ALBERT G.; CHYI,J.-I.; LEE,C.-M.; NEE,T.-E.; CHUO,C.-C.; CHU,S.N.G.

    2000-06-12

    A brief review is given of recent progress in fabrication of high voltage GaN and AlGaN rectifiers. GaN/AlGaN heterojunction bipolar transistors and GaN metal-oxide semiconductor field effect transistors. Improvements in epitaxial layer quality and in fabrication techniques have led to significant advances in device performance.

  10. High quality InAlN single layers lattice-matched to GaN grown by molecular beam epitaxy

    SciTech Connect

    Gacevic, Z.; Fernandez-Garrido, S.; Calleja, E.; Estrade, S.

    2011-07-18

    We report on properties of high quality {approx}60 nm thick InAlN layers nearly in-plane lattice-matched to GaN, grown on c-plane GaN-on-sapphire templates by plasma-assisted molecular beam epitaxy. Excellent crystalline quality and low surface roughness are confirmed by X-ray diffraction, transmission electron microscopy, and atomic force microscopy. High annular dark field observations reveal a periodic in-plane indium content variation (8 nm period), whereas optical measurements evidence certain residual absorption below the band-gap. The indium fluctuation is estimated to be {+-} 1.2% around the nominal 17% indium content via plasmon energy oscillations assessed by electron energy loss spectroscopy with sub-nanometric spatial resolution.

  11. Influence of High Nitrogen Flux on Crystal Quality of Plasma-Assisted MBE Grown GaN Layers Using Raman Spectroscopy: Part-II

    SciTech Connect

    Asghar, M.; Hussain, I.; Islah u din; Saleemi, F.

    2007-05-09

    We have investigated lattice properties of plasma assisted MBE grown hexagonal GaN layers at varying nitrogen and gallium fluxes using Raman spectroscopy. Room temperature Raman spectra of Ga-rich layers and stoichiometric GaN are similar showing excitation modes at 434 cm-1, 567 cm-1 and 729 cm-1 identified as residual laser line, E{sub 2}{sup H} and A1(LO) mode, respectively. Similarity of Ga-rich and stoichiometric GaN layers is interpreted as the indication of comparable crystal quality of both GaN layers. In contrast, Raman scattering associated with N-rich GaN samples mere exhibit a broad band of excitations in the range of 250-650cm-1 leaving out A1(LO) mode. This typical observation along with intensity distribution of the peaks, is correlated with rough surface, bad crystal quality and high concentration of defects. Based on atomic displacement scheme, the broad band is identified as Ga- vacancies.

  12. Study of the effects of GaN buffer layer quality on the dc characteristics of AlGaN/GaN high electron mobility transistors

    DOE PAGES

    Ahn, Shihyun; Zhu, Weidi; Dong, Chen; ...

    2015-04-21

    Here we studied the effect of buffer layer quality on dc characteristics of AlGaN/GaN high electron mobility (HEMTs). AlGaN/GaN HEMT structures with 2 and 5 μm GaN buffer layers on sapphire substrates from two different vendors with the same Al concentration of AlGaN were used. The defect densities of HEMT structures with 2 and 5 μm GaN buffer layer were 7 × 109 and 5 × 108 cm₋2, respectively, as measured by transmission electron microscopy. There was little difference in drain saturation current or in transfer characteristics in HEMTs on these two types of buffer. However, there was no dispersionmore » observed on the nonpassivated HEMTs with 5 μm GaN buffer layer for gate-lag pulsed measurement at 100 kHz, which was in sharp contrast to the 71% drain current reduction for the HEMT with 2 μm GaN buffer layer.« less

  13. Study of the effects of GaN buffer layer quality on the dc characteristics of AlGaN/GaN high electron mobility transistors

    SciTech Connect

    Ahn, Shihyun; Zhu, Weidi; Dong, Chen; Le, Lingcong; Hwang, Ya-Hsi; Kim, Byung-Jae; Ren, Fan; Pearton, Stephen J.; Lind, Aaron G.; Jones, Kevin S.; Kravchenko, I. I.; Zhang, Ming-Lan

    2015-04-21

    Here we studied the effect of buffer layer quality on dc characteristics of AlGaN/GaN high electron mobility (HEMTs). AlGaN/GaN HEMT structures with 2 and 5 μm GaN buffer layers on sapphire substrates from two different vendors with the same Al concentration of AlGaN were used. The defect densities of HEMT structures with 2 and 5 μm GaN buffer layer were 7 × 109 and 5 × 108 cm₋2, respectively, as measured by transmission electron microscopy. There was little difference in drain saturation current or in transfer characteristics in HEMTs on these two types of buffer. However, there was no dispersion observed on the nonpassivated HEMTs with 5 μm GaN buffer layer for gate-lag pulsed measurement at 100 kHz, which was in sharp contrast to the 71% drain current reduction for the HEMT with 2 μm GaN buffer layer.

  14. High nitrogen pressure solution growth of GaN

    NASA Astrophysics Data System (ADS)

    Bockowski, Michal

    2014-10-01

    Results of GaN growth from gallium solution under high nitrogen pressure are presented. Basic of the high nitrogen pressure solution (HNPS) growth method is described. A new approach of seeded growth, multi-feed seed (MFS) configuration, is demonstrated. The use of two kinds of seeds: free-standing hydride vapor phase epitaxy GaN (HVPE-GaN) obtained from metal organic chemical vapor deposition (MOCVD)-GaN/sapphire templates and free-standing HVPE-GaN obtained from the ammonothermally grown GaN crystals, is shown. Depending on the seeds’ structural quality, the differences in the structural properties of pressure grown material are demonstrated and analyzed. The role and influence of impurities, like oxygen and magnesium, on GaN crystals grown from gallium solution in the MFS configuration is presented. The properties of differently doped GaN crystals are discussed. An application of the pressure grown GaN crystals as substrates for electronic and optoelectronic devices is reported.

  15. High-quality III-nitride films on conductive, transparent (2̅01)-oriented β-Ga2O3 using a GaN buffer layer.

    PubMed

    Muhammed, M M; Roldan, M A; Yamashita, Y; Sahonta, S-L; Ajia, I A; Iizuka, K; Kuramata, A; Humphreys, C J; Roqan, I S

    2016-07-14

    We demonstrate the high structural and optical properties of InxGa1-xN epilayers (0 ≤ x ≤ 23) grown on conductive and transparent (01)-oriented β-Ga2O3 substrates using a low-temperature GaN buffer layer rather than AlN buffer layer, which enhances the quality and stability of the crystals compared to those grown on (100)-oriented β-Ga2O3. Raman maps show that the 2″ wafer is relaxed and uniform. Transmission electron microscopy (TEM) reveals that the dislocation density reduces considerably (~4.8 × 10(7) cm(-2)) at the grain centers. High-resolution TEM analysis demonstrates that most dislocations emerge at an angle with respect to the c-axis, whereas dislocations of the opposite phase form a loop and annihilate each other. The dislocation behavior is due to irregular (01) β-Ga2O3 surface at the interface and distorted buffer layer, followed by relaxed GaN epilayer. Photoluminescence results confirm high optical quality and time-resolved spectroscopy shows that the recombination is governed by bound excitons. We find that a low root-mean-square average (≤1.5 nm) of InxGa1-xN epilayers can be achieved with high optical quality of InxGa1-xN epilayers. We reveal that (01)-oriented β-Ga2O3 substrate has a strong potential for use in large-scale high-quality vertical light emitting device design.

  16. High-quality III-nitride films on conductive, transparent (2̅01)-oriented β-Ga2O3 using a GaN buffer layer

    PubMed Central

    Muhammed, M. M.; Roldan, M. A.; Yamashita, Y.; Sahonta, S.-L.; Ajia, I. A.; Iizuka, K.; Kuramata, A.; Humphreys, C. J.; Roqan, I. S.

    2016-01-01

    We demonstrate the high structural and optical properties of InxGa1−xN epilayers (0 ≤ x ≤ 23) grown on conductive and transparent (01)-oriented β-Ga2O3 substrates using a low-temperature GaN buffer layer rather than AlN buffer layer, which enhances the quality and stability of the crystals compared to those grown on (100)-oriented β-Ga2O3. Raman maps show that the 2″ wafer is relaxed and uniform. Transmission electron microscopy (TEM) reveals that the dislocation density reduces considerably (~4.8 × 107 cm−2) at the grain centers. High-resolution TEM analysis demonstrates that most dislocations emerge at an angle with respect to the c-axis, whereas dislocations of the opposite phase form a loop and annihilate each other. The dislocation behavior is due to irregular (01) β-Ga2O3 surface at the interface and distorted buffer layer, followed by relaxed GaN epilayer. Photoluminescence results confirm high optical quality and time-resolved spectroscopy shows that the recombination is governed by bound excitons. We find that a low root-mean-square average (≤1.5 nm) of InxGa1−xN epilayers can be achieved with high optical quality of InxGa1−xN epilayers. We reveal that (01)-oriented β-Ga2O3 substrate has a strong potential for use in large-scale high-quality vertical light emitting device design. PMID:27412372

  17. High-quality III-nitride films on conductive, transparent (2̅01)-oriented β-Ga2O3 using a GaN buffer layer

    NASA Astrophysics Data System (ADS)

    Muhammed, M. M.; Roldan, M. A.; Yamashita, Y.; Sahonta, S.-L.; Ajia, I. A.; Iizuka, K.; Kuramata, A.; Humphreys, C. J.; Roqan, I. S.

    2016-07-01

    We demonstrate the high structural and optical properties of InxGa1‑xN epilayers (0 ≤ x ≤ 23) grown on conductive and transparent (01)-oriented β-Ga2O3 substrates using a low-temperature GaN buffer layer rather than AlN buffer layer, which enhances the quality and stability of the crystals compared to those grown on (100)-oriented β-Ga2O3. Raman maps show that the 2″ wafer is relaxed and uniform. Transmission electron microscopy (TEM) reveals that the dislocation density reduces considerably (~4.8 × 107 cm‑2) at the grain centers. High-resolution TEM analysis demonstrates that most dislocations emerge at an angle with respect to the c-axis, whereas dislocations of the opposite phase form a loop and annihilate each other. The dislocation behavior is due to irregular (01) β-Ga2O3 surface at the interface and distorted buffer layer, followed by relaxed GaN epilayer. Photoluminescence results confirm high optical quality and time-resolved spectroscopy shows that the recombination is governed by bound excitons. We find that a low root-mean-square average (≤1.5 nm) of InxGa1‑xN epilayers can be achieved with high optical quality of InxGa1‑xN epilayers. We reveal that (01)-oriented β-Ga2O3 substrate has a strong potential for use in large-scale high-quality vertical light emitting device design.

  18. High quality and uniformity GaN grown on 150 mm Si substrate using in-situ NH3 pulse flow cleaning process

    NASA Astrophysics Data System (ADS)

    Ji, Panfeng; Yang, Xuelin; Feng, Yuxia; Cheng, Jianpeng; Zhang, Jie; Hu, Anqi; Song, Chunyan; Wu, Shan; Shen, Jianfei; Tang, Jun; Tao, Chun; Pan, Yaobo; Wang, Xinqiang; Shen, Bo

    2017-04-01

    By using in-situ NH3 pulse flow cleaning method, we have achieved the repeated growth of high quality and uniformity GaN and AlGaN/GaN high electron mobility transistors (HEMTs) on 150 mm Si substrate. The two dimensional electron gas (2DEG) mobility is 2200 cm2/Vs with an electron density of 7.3 × 1012 cm-2. The sheet resistance is 305 ± 4 Ω/□ with ±1.3% variation. The achievement is attributed to the fact that this method can significantly remove the Al, Ga, etc. metal droplets coating on the post growth flow flange and reactor wall which are difficult to clean by normal bake process under H2 ambient.

  19. Growth of thick and high crystalline quality InGaN layers on GaN (0001bar) substrate using tri-halide vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Hirasaki, Takahide; Eriksson, Martin; Thieu, Quang Tu; Karlsson, Fredrik; Murakami, Hisashi; Kumagai, Yoshinao; Monemar, Bo; Holtz, Per Olof; Koukitu, Akinori

    2016-12-01

    The growth of thick InGaN layers on free-standing GaN (0001bar) substrates was studied using tri-halide vapor phase epitaxy. It was found that high-indium-content InGaN can be grown under higher InCl3 input partial pressure at higher growth temperature, which allows the fabrication of a high crystalline quality InGaN layer with a smooth surface morphology. Using the growth conditions of high InCl3 input partial pressure and high growth temperature, crack- and droplet-free InGaN layers with a thickness of over 10 μm and with an indium fraction of 0.05 were successfully grown. Although the surface showed many hillocks, the number of hillocks was reduced upon growth of thicker InGaN layers. Photoluminescence measurements confirm that thick InGaN layers could be successfully grown without degradation of the crystalline quality.

  20. Gallium Nitride (GaN) High Power Electronics (FY11)

    DTIC Science & Technology

    2012-01-01

    Gallium Nitride (GaN) High Power Electronics (FY11) by Kenneth A. Jones, Randy P. Tompkins, Michael A. Derenge, Kevin W. Kirchner, Iskander...Army Research Laboratory Adelphi, MD 20783-1197 ARL-TR-5903 January 2012 Gallium Nitride (GaN) High Power Electronics (FY11) Kenneth A...DSI 3. DATES COVERED (From - To) 4. TITLE AND SUBTITLE Gallium Nitride (GaN) High Power Electronics (FY11) 5a. CONTRACT NUMBER 5b. GRANT

  1. High-Q GaN nanowire resonators and oscillators

    SciTech Connect

    Tanner, S. M.; Gray, J. M.; Rogers, C. T.; Bertness, K. A.; Sanford, N. A.

    2007-11-12

    We report high mechanical quality factors Q for GaN nanowire cantilevers grown by molecular beam epitaxy. Nanowires with 30-500 nm diameters and 5-20 {mu}m lengths having resonance frequencies from 400 kHz to 2.8 MHz were measured. Q near room temperature and 10{sup -4} Pa ranged from 2700 to above 60 000 with most above 10 000. Positive feedback to a piezoelectric stack caused spontaneous nanowire oscillations with Q exceeding 10{sup 6}. Spontaneous oscillations also occurred with direct e-beam excitation of unintentionally doped nanowires. Doped nanowires showed no oscillations, consistent with oscillation arising via direct actuation of piezoelectric GaN.

  2. High-quality Ga-rich AlGaN grown on trapezoidal patterned GaN template using super-short period AlN/GaN superlattices for rapid coalescence

    NASA Astrophysics Data System (ADS)

    Xiao, Ming; Zhang, Jincheng; Hao, Yue

    2017-04-01

    High quality crack-free Ga-rich Al26.1Ga73.9N film was grown on trapezoidal patterned GaN template (TPGT) by low-pressure metalorganic chemical vapor deposition. The super-short period AlN/GaN superlattices structure was used to grow AlGaN material instead of the direct growth method. We obtained large lateral to vertical growth rate ratio larger than 4.79. The growth rate of GaN layer was proved to be the decisive factor of the lateral to vertical growth rate ratio. Moreover, for AlGaN growth, we found that that the TPGT is more beneficial to suppression of crack and relaxation of biaxial tensile strain than planar GaN template. The obtained results demonstrate that, comparing with AlGaN grown on planar GaN template, the threading dislocation density in AlGaN grown on TPGT was reduced from 2×109 cm-2 to 2×108 cm-2.

  3. N-polar GaN epitaxy and high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Hoi Wong, Man; Keller, Stacia; Nidhi; Dasgupta, Sansaptak; Denninghoff, Daniel J.; Kolluri, Seshadri; Brown, David F.; Lu, Jing; Fichtenbaum, Nicholas A.; Ahmadi, Elaheh; Singisetti, Uttam; Chini, Alessandro; Rajan, Siddharth; DenBaars, Steven P.; Speck, James S.; Mishra, Umesh K.

    2013-07-01

    This paper reviews the progress of N-polar (000\\mathop 1\\limits^\\_) GaN high frequency electronics that aims at addressing the device scaling challenges faced by GaN high electron mobility transistors (HEMTs) for radio-frequency and mixed-signal applications. Device quality (Al, In, Ga)N materials for N-polar heterostructures are developed using molecular beam epitaxy and metalorganic chemical vapor deposition. The principles of polarization engineering for designing N-polar HEMT structures will be outlined. The performance, scaling behavior and challenges of microwave power devices as well as highly-scaled depletion- and enhancement-mode devices employing advanced technologies including self-aligned processes, n+ (In,Ga)N ohmic contact regrowth and high aspect ratio T-gates will be discussed. Recent research results on integrating N-polar GaN with Si for prospective novel applications will also be summarized.

  4. High electron mobility GaN grown under N-rich conditions by plasma-assisted molecular beam epitaxy

    SciTech Connect

    Koblmueller, G.; Wu, F.; Mates, T.; Speck, J. S.; Fernandez-Garrido, S.; Calleja, E.

    2007-11-26

    An alternative approach is presented for the plasma-assisted molecular beam epitaxy of high-quality GaN. Under N-rich growth conditions, an unexpected layer-by-layer growth mode was found for a wide range of growth temperatures in the GaN thermal decomposition regime (>750 deg. C). Consequently, superior surface morphologies with roughness of less than 1 nm (rms) have been achieved. For lightly Si-doped GaN films, room-temperature electron mobilities exceeding 1100 cm{sup 2}/V s were measured, surpassing the commonly insulating nature of GaN grown under N-rich conditions at low temperature.

  5. High-resistivity GaN buffer templates and their optimization for GaN-based HFETs

    NASA Astrophysics Data System (ADS)

    Hubbard, S. M.; Zhao, G.; Pavlidis, D.; Sutton, W.; Cho, E.

    2005-11-01

    High-resistance (HR) GaN templates for AlGaN/GaN heterojunction field effect transistor (HFET) applications were grown using organometallic vapor phase epitaxy. The GaN sheet resistance was tuned using final nucleation layer (NL) annealing temperature and NL thickness. Using an annealing temperature of 1033 °C and NL thickness of 26 nm, GaN with sheet resistance of 10 10 Ω/sq was achieved, comparable to that of Fe-doped GaN. Material characterization results show that the high-resistance GaN is achieved due to compensating acceptor levels that may be introduced through edge-type threading dislocations. Optimization of annealing temperature and NL thickness provided a means to maximize GaN sheet resistance without significantly degrading material quality. In situ laser reflectance was used to correlate the NL properties to sheet resistance and material quality, providing a figure of merit for expected sheet resistance. AlGaN/GaN HFET layers grown using HR GaN templates with R of 10 10 Ω/sq gave surface and interface roughness of 14 and 7 Å, respectively. The 2DEG Hall mobility and sheet charge of HFETs grown using HR GaN templates was comparable to similar layers grown using unintentionally doped (UID) GaN templates.

  6. Influence of Ga/N ratio on morphology, vacancies, and electrical transport in GaN grown by molecular beam epitaxy at high temperature

    NASA Astrophysics Data System (ADS)

    Koblmüller, G.; Reurings, F.; Tuomisto, F.; Speck, J. S.

    2010-11-01

    The effect of Ga/N flux ratio on surface morphology, incorporation of point defects and electrical transport properties of GaN films grown by plasma-assisted molecular beam epitaxy in a recently developed high-temperature growth regime was investigated. The homoepitaxial (0001) GaN films grown at ˜780-790 °C showed smoothest morphologies near the cross-over between N-rich and Ga-rich growth (0.75<Ga/N<1.1) contrasting previous observations for low-temperature growth. The higher-quality growth near Ga/N˜1 resulted from lower thermal decomposition rates and was corroborated by slightly lower Ga vacancy concentrations [VGa], lower unintentional oxygen incorporation, and improved electron mobilities. The consistently low [VGa], i.e., ˜1016 cm-3 for all films attribute further to the significant benefits of the high-temperature growth regime.

  7. High-resistance GaN epilayers with low dislocation density via growth mode modification

    NASA Astrophysics Data System (ADS)

    Xu, Z. Y.; Xu, F. J.; Wang, J. M.; Lu, L.; Yang, Z. J.; Wang, X. Q.; Shen, B.

    2016-09-01

    High-resistance GaN with low dislocation density adopting growth mode modification has been investigated by metalorganic chemical vapor deposition. The sheet resistance of the order of 1016 Ω/sq has been achieved at room temperature by diminishing the oxygen impurity level close to the substrate with an AlN blocking layer. Attributed to this method which offers more freedom to tailor the growth mode, a three-dimensional (3D) growth process is introduced by adjusting the growth pressure and temperature at the initial stage of the GaN epitaxy to improve the crystalline quality. The large 3D GaN grains formed during this period roughen the surface, and the following coalescence of the GaN grains causes threading dislocations bending, which finally remarkably reduces the dislocation density.

  8. Novel high frequency devices with graphene and GaN

    NASA Astrophysics Data System (ADS)

    Zhao, Pei

    This work focuses on exploring new materials and new device structures to develop novel devices that can operate at very high speed. In chapter 2, the high frequency performance limitations of graphene transistor with channel length less than 100 nm are explored. The simulated results predict that intrinsic cutoff frequency fT of graphene transistor can be close to 2 THz at 15 nm channel length. In chapter 3, we explored the possibility of developing a 2D materials based vertical tunneling device. An analytical model to calculate the channel potentials and current-voltage characteristics in a Symmetric tunneling Field-Effect-Transistor (SymFET) is presented. The symmetric resonant peak in SymFET is a good candidate for high-speed analog applications. Rest of the work focuses on Gallium Nitride (GaN), several novel device concepts based on GaN heterostructure have been proposed for high frequency and high power applications. In chapter 4, we compared the performance of GaN Schottky diodes on bulk GaN substrates and GaN-on-sapphire substrates. In addition, we also discussed the lateral GaN Schottky diode between metal/2DEGs. The advantage of lateral GaN Schottky diodes is the intrinsic cutoff frequency is in the THz range. In chapter 5, a GaN Heterostructure barrier diode (HBD) is designed using the polarization charge and band offset at the AlGaN/GaN heterojunction. The polarization charge at AlGaN/GaN interface behaves as a delta-doping which induces a barrier without any chemical doping. The IV characteristics can be explained by the barrier controlled thermionic emission current. GaN HBDs can be directly integrated with GaN HEMTs, and serve as frequency multipliers or mixers for RF applications. In chapter 6, a GaN based negative effective mass oscillator (NEMO) is proposed. The current in NEMO is estimated under the ballistic limits. Negative differential resistances (NDRs) can be observed with more than 50% of the injected electrons occupied the negative

  9. Highly c-axis oriented growth of GaN film on sapphire (0001) by laser molecular beam epitaxy using HVPE grown GaN bulk target

    SciTech Connect

    Kushvaha, S. S.; Kumar, M. Senthil; Maurya, K. K.; Dalai, M. K.; Sharma, Nita D.

    2013-09-15

    Growth temperature dependant surface morphology and crystalline properties of the epitaxial GaN layers grown on pre-nitridated sapphire (0001) substrates by laser molecular beam epitaxy (LMBE) were investigated in the range of 500–750 °C. The grown GaN films were characterized using high resolution x-ray diffraction, atomic force microscopy (AFM), micro-Raman spectroscopy, and secondary ion mass spectroscopy (SIMS). The x-ray rocking curve full width at a half maximum (FWHM) value for (0002) reflection dramatically decreased from 1582 arc sec to 153 arc sec when the growth temperature was increased from 500 °C to 600 °C and the value further decreased with increase of growth temperature up to 720 °C. A highly c-axis oriented GaN epitaxial film was obtained at 720 °C with a (0002) plane rocking curve FWHM value as low as 102 arc sec. From AFM studies, it is observed that the GaN grain size also increased with increasing growth temperature and flat, large lateral grains of size 200-300 nm was obtained for the film grown at 720 °C. The micro-Raman spectroscopy studies also exhibited the high-quality wurtzite nature of GaN film grown on sapphire at 720 °C. The SIMS measurements revealed a non-traceable amount of background oxygen impurity in the grown GaN films. The results show that the growth temperature strongly influences the surface morphology and crystalline quality of the epitaxial GaN films on sapphire grown by LMBE.

  10. Highly c-axis oriented growth of GaN film on sapphire (0001) by laser molecular beam epitaxy using HVPE grown GaN bulk target

    NASA Astrophysics Data System (ADS)

    Kushvaha, S. S.; Kumar, M. Senthil; Maurya, K. K.; Dalai, M. K.; Sharma, Nita D.

    2013-09-01

    Growth temperature dependant surface morphology and crystalline properties of the epitaxial GaN layers grown on pre-nitridated sapphire (0001) substrates by laser molecular beam epitaxy (LMBE) were investigated in the range of 500-750 °C. The grown GaN films were characterized using high resolution x-ray diffraction, atomic force microscopy (AFM), micro-Raman spectroscopy, and secondary ion mass spectroscopy (SIMS). The x-ray rocking curve full width at a half maximum (FWHM) value for (0002) reflection dramatically decreased from 1582 arc sec to 153 arc sec when the growth temperature was increased from 500 °C to 600 °C and the value further decreased with increase of growth temperature up to 720 °C. A highly c-axis oriented GaN epitaxial film was obtained at 720 °C with a (0002) plane rocking curve FWHM value as low as 102 arc sec. From AFM studies, it is observed that the GaN grain size also increased with increasing growth temperature and flat, large lateral grains of size 200-300 nm was obtained for the film grown at 720 °C. The micro-Raman spectroscopy studies also exhibited the high-quality wurtzite nature of GaN film grown on sapphire at 720 °C. The SIMS measurements revealed a non-traceable amount of background oxygen impurity in the grown GaN films. The results show that the growth temperature strongly influences the surface morphology and crystalline quality of the epitaxial GaN films on sapphire grown by LMBE.

  11. O3-sourced atomic layer deposition of high quality Al2O3 gate dielectric for normally-off GaN metal-insulator-semiconductor high-electron-mobility transistors

    NASA Astrophysics Data System (ADS)

    Huang, Sen; Liu, Xinyu; Wei, Ke; Liu, Guoguo; Wang, Xinhua; Sun, Bing; Yang, Xuelin; Shen, Bo; Liu, Cheng; Liu, Shenghou; Hua, Mengyuan; Yang, Shu; Chen, Kevin J.

    2015-01-01

    High quality Al2O3 film grown by atomic layer deposition (ALD), with ozone (O3) as oxygen source, is demonstrated for fabrication of normally-off AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs). Significant suppression of Al-O-H and Al-Al bonds in ALD-Al2O3 has been realized by substituting conventional H2O source with O3. A high dielectric breakdown E-field of 8.5 MV/cm and good TDDB behavior are achieved in a gate dielectric stack consisting of 13-nm O3-Al2O3 and 2-nm H2O-Al2O3 interfacial layer on recessed GaN. By using this 15-nm gate dielectric and a high-temperature gate-recess technique, the density of positive bulk/interface charges in normally-off AlGaN/GaN MIS-HEMTs is remarkably suppressed to as low as 0.9 × 1012 cm-2, contributing to the realization of normally-off operation with a high threshold voltage of +1.6 V and a low specific ON-resistance RON,sp of 0.49 mΩ cm2.

  12. High-Sensitivity GaN Microchemical Sensors

    NASA Technical Reports Server (NTRS)

    Son, Kyung-ah; Yang, Baohua; Liao, Anna; Moon, Jeongsun; Prokopuk, Nicholas

    2009-01-01

    Systematic studies have been performed on the sensitivity of GaN HEMT (high electron mobility transistor) sensors using various gate electrode designs and operational parameters. The results here show that a higher sensitivity can be achieved with a larger W/L ratio (W = gate width, L = gate length) at a given D (D = source-drain distance), and multi-finger gate electrodes offer a higher sensitivity than a one-finger gate electrode. In terms of operating conditions, sensor sensitivity is strongly dependent on transconductance of the sensor. The highest sensitivity can be achieved at the gate voltage where the slope of the transconductance curve is the largest. This work provides critical information about how the gate electrode of a GaN HEMT, which has been identified as the most sensitive among GaN microsensors, needs to be designed, and what operation parameters should be used for high sensitivity detection.

  13. Highly transparent ammonothermal bulk GaN substrates

    SciTech Connect

    Jiang, WK; Ehrentraut, D; Downey, BC; Kamber, DS; Pakalapati, RT; Do Yoo, H; D'Evelyn, MP

    2014-10-01

    A novel apparatus has been employed to grow ammonothermal (0001) gallium nitride (GaN) with diameters up to 2 in The crystals have been characterized by x-ray diffraction rocking-curve (XRC) analysis, optical and scanning electron microscopy (SEM), cathodoluminescence (CL), and optical spectroscopy. High crystallinity GaN with FWHM values about 20-50 arcsec and dislocation densities below 1 x 10(5) cm(-2) have been obtained. High optical transmission was achieved with an optical absorption coefficient below 1 cm(-1) at a wavelength of 450 nm. (C) 2014 Elsevier B.V. All rights reserved.

  14. Fabrications and application of single crystalline GaN for high-performance deep UV photodetectors

    SciTech Connect

    Velazquez, R.; Rivera, M.; Feng, P.

    2016-08-15

    High-quality single crystalline Gallium Nitride (GaN) semiconductor has been synthesized using molecule beam epitaxy (MBE) technique for development of high-performance deep ultraviolet (UV) photodetectors. Thickness of the films was estimated by using surface profile meter and scanning electron microscope. Electronic states and elemental composition of the films were obtained using Raman scattering spectroscopy. The orientation, crystal structure and phase purity of the films were examined using a Siemens x-ray diffractometer radiation. The surface microstructure was studied using high resolution scanning electron microscopy (SEM). Two types of metal pairs: Al-Al, Al-Cu or Cu-Cu were used for interdigital electrodes on GaN film in order to examine the Schottky properties of the GaN based photodetector. The characterizations of the fabricated prototype include the stability, responsivity, response and recovery times. Typical time dependent photoresponsivity by switching different UV light source on and off five times for each 240 seconds at a bias of 2V, respectively, have been obtained. The detector appears to be highly sensitive to various UV wavelengths of light with very stable baseline and repeatability. The obtained photoresponsivity was up to 354 mA/W at the bias 2V. Higher photoresponsivity could be obtained if higher bias was applied but it would unavoidably result in a higher dark current. Thermal effect on the fabricated GaN based prototype was discussed.

  15. Fabrications and application of single crystalline GaN for high-performance deep UV photodetectors

    NASA Astrophysics Data System (ADS)

    Velazquez, R.; Aldalbahi, A.; Rivera, M.; Feng, P.

    2016-08-01

    High-quality single crystalline Gallium Nitride (GaN) semiconductor has been synthesized using molecule beam epitaxy (MBE) technique for development of high-performance deep ultraviolet (UV) photodetectors. Thickness of the films was estimated by using surface profile meter and scanning electron microscope. Electronic states and elemental composition of the films were obtained using Raman scattering spectroscopy. The orientation, crystal structure and phase purity of the films were examined using a Siemens x-ray diffractometer radiation. The surface microstructure was studied using high resolution scanning electron microscopy (SEM). Two types of metal pairs: Al-Al, Al-Cu or Cu-Cu were used for interdigital electrodes on GaN film in order to examine the Schottky properties of the GaN based photodetector. The characterizations of the fabricated prototype include the stability, responsivity, response and recovery times. Typical time dependent photoresponsivity by switching different UV light source on and off five times for each 240 seconds at a bias of 2V, respectively, have been obtained. The detector appears to be highly sensitive to various UV wavelengths of light with very stable baseline and repeatability. The obtained photoresponsivity was up to 354 mA/W at the bias 2V. Higher photoresponsivity could be obtained if higher bias was applied but it would unavoidably result in a higher dark current. Thermal effect on the fabricated GaN based prototype was discussed.

  16. GaN IMPATT diode: a photo-sensitive high power terahertz source

    NASA Astrophysics Data System (ADS)

    Mukherjee, Moumita; Mazumder, Nilraton; Roy, Sitesh Kumar; Goswami, Kushalendu

    2007-12-01

    The prospects of wurtzite phase single-drift-region (SDR), flat and single-low-high-low (SLHL) type GaN IMPATT devices as terahertz sources are studied through a simulation experiment. The study indicates that GaN IMPATT diodes are capable of generating high RF power (at least 2.5 W) at around 1.45 THz with high efficiency (17-20%). The superior electronic properties of GaN make this a promising candidate for IMPATT operation in the THz regime, unapproachable by conventional Si, GaAs and InP based IMPATT diodes. The effect of parasitic series resistance on the THz performance of the device is further simulated. It is interesting to note that the presence of a charge bump in a flatly doped SDR structure reduces the value of parasitic series resistance by 22%. The effects of photo- illumination on the devices are also investigated using a modified double iterative simulation technique. Under photo-illumination (i) the negative conductance and (ii) the negative resistance of the devices (both flat and SLHL) decrease, while the frequency of operation and the device quality factor shift upwards. However, the upward shift in operating frequency is found to be more (~16 GHz) in the case of the SLHL SDR IMPATT device. The study indicates that GaN IMPATT is a promising opto-sensitive high power THz source.

  17. O{sub 3}-sourced atomic layer deposition of high quality Al{sub 2}O{sub 3} gate dielectric for normally-off GaN metal-insulator-semiconductor high-electron-mobility transistors

    SciTech Connect

    Huang, Sen; Liu, Xinyu Wei, Ke; Liu, Guoguo; Wang, Xinhua; Sun, Bing; Yang, Xuelin; Shen, Bo; Liu, Cheng; Liu, Shenghou; Hua, Mengyuan; Yang, Shu; Chen, Kevin J.

    2015-01-19

    High quality Al{sub 2}O{sub 3} film grown by atomic layer deposition (ALD), with ozone (O{sub 3}) as oxygen source, is demonstrated for fabrication of normally-off AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs). Significant suppression of Al–O–H and Al–Al bonds in ALD-Al{sub 2}O{sub 3} has been realized by substituting conventional H{sub 2}O source with O{sub 3}. A high dielectric breakdown E-field of 8.5 MV/cm and good TDDB behavior are achieved in a gate dielectric stack consisting of 13-nm O{sub 3}-Al{sub 2}O{sub 3} and 2-nm H{sub 2}O-Al{sub 2}O{sub 3} interfacial layer on recessed GaN. By using this 15-nm gate dielectric and a high-temperature gate-recess technique, the density of positive bulk/interface charges in normally-off AlGaN/GaN MIS-HEMTs is remarkably suppressed to as low as 0.9 × 10{sup 12 }cm{sup −2}, contributing to the realization of normally-off operation with a high threshold voltage of +1.6 V and a low specific ON-resistance R{sub ON,sp} of 0.49 mΩ cm{sup 2}.

  18. Halogen-free vapor phase epitaxy for high-rate growth of GaN bulk crystals

    NASA Astrophysics Data System (ADS)

    Nakamura, Daisuke; Kimura, Taishi; Horibuchi, Kayo

    2017-04-01

    Here, we propose a halogen-free vapor phase epitaxy (HF-VPE) technique to grow bulk GaN single crystals. This technique employs the simplest reaction for GaN synthesis (reaction of Ga vapor with NH3) and can potentially achieve a high growth rate, a prolonged growth duration, a high crystal quality, and a low cost. The analyses of thick HF-VPE-GaN layers grown under optimized growth conditions revealed that high-quality crystals, both in terms of dislocation density and impurity concentration, are obtained at high growth rates of over 100 µm/h.

  19. Nitrogen-Polar (0001¯) GaN Grown on c-Plane Sapphire with a High-Temperature AlN Buffer

    PubMed Central

    Song, Jie; Han, Jung

    2017-01-01

    We demonstrate growing nitrogen-polar (N-polar) GaN epilayer on c-plane sapphire using a thin AlN buffer layer by metalorganic chemical vapor deposition. We have studied the influence of the AlN buffer layer on the polarity, crystalline quality, and surface morphology of the GaN epilayer and found that the growth temperature of the AlN buffer layer played a critical role in the growth of the GaN epilayer. The low growth temperature of the AlN buffer results in gallium-polar GaN. Even a nitridation process has been conducted. High growth temperature for an AlN buffer layer is required to achieve pure N-polarity, high crystalline quality, and smooth surface morphology for a GaN epilayer. PMID:28772612

  20. High Efficiency m-plane LEDs on Low Defect Density Bulk GaN Substrates

    SciTech Connect

    David, Aurelien

    2012-10-15

    Solid-state lighting is a key technology for reduction of energy consumption in the US and worldwide. In principle, by replacing standard incandescent bulbs and other light sources with sources based on light-emitting diodes (LEDs), ultimate energy efficiency can be achieved. The efficiency of LEDs has improved tremendously over the past two decades, however further progress is required for solid- state lighting to reach its full potential. The ability of an LED at converting electricity to light is quantified by its internal quantum efficiency (IQE). The material of choice for visible LEDs is Gallium Nitride (GaN), which is at the basis of blue-emitting LEDs. A key factor limiting the performance of GaN LEDs is the so-called efficiency droop, whereby the IQE of the LED decreases significantly at high current density. Despite decades of research, efficiency droop remains a major issue. Since high-current operation is necessary for practical lighting applications, reducing droop is a major challenge for the scientific community and the LED industry. Our approach to solving the droop issue is the use of newly available low-defect-density bulk GaN non-polar substrates. In contrast to the standard foreign substrates (sapphire, silicon carbide, silicon) used in the industry, we have employed native bulk GaN substrates with very low defect density, thus ensuring exquisite material quality and high IQE. Whereas all commercial LEDs are grown along the c-plane crystal direction of GaN, we have used m-plane non-polar substrates; these drastically modify the physical properties of the LED and enable a reduction of droop. With this approach, we have demonstrated very high IQE performance and low droop. Our results focused on violet and blue LEDs. For these, we have demonstrated very high peak IQEs and current droops of 6% and 10% respectively (up to a high current density of 200A.cm-2). All these results were obtained under electrical operation. These high IQE and low droop

  1. Highly resistive C-doped hydride vapor phase epitaxy-GaN grown on ammonothermally crystallized GaN seeds

    NASA Astrophysics Data System (ADS)

    Iwinska, Malgorzata; Piotrzkowski, Ryszard; Litwin-Staszewska, Elzbieta; Sochacki, Tomasz; Amilusik, Mikolaj; Fijalkowski, Michal; Lucznik, Boleslaw; Bockowski, Michal

    2017-01-01

    GaN crystals were grown by hydride vapor phase epitaxy (HVPE) and doped with C. The seeds were high-structural-quality ammonothermally crystallized GaN. The grown crystals were highly resistive at 296 K and of high structural quality. High-temperature Hall effect measurements revealed p-type conductivity and a deep acceptor level in the material with an activation energy of 1 eV. This is in good agreement with density functional theory calculations based on hybrid functionals as presented by the Van de Walle group. They obtained an ionization energy of 0.9 eV when C was substituted for N in GaN and acted as a deep acceptor.

  2. Improving the quality of GaN crystals by using graphene or hexagonal boron nitride nanosheets substrate.

    PubMed

    Zhang, Lei; Li, Xianlei; Shao, Yongliang; Yu, Jiaoxian; Wu, Yongzhong; Hao, Xiaopeng; Yin, Zhengmao; Dai, Yuanbin; Tian, Yuan; Huo, Qin; Shen, Yinan; Hua, Zhen; Zhang, Baoguo

    2015-03-04

    The progress in nitrides technology is widely believed to be limited and hampered by the lack of high-quality gallium nitride wafers. Though various epitaxial techniques like epitaxial lateral overgrowth and its derivatives have been used to reduce defect density, there is still plenty of room for the improvement of gallium nitride crystal. Here, we report graphene or hexagonal boron nitride nanosheets can be used to improve the quality of GaN crystal using hydride vapor phase epitaxy methods. These nanosheets were directly deposited on the substrate that is used for the epitaxial growth of GaN crystal. Systematic characterizations of the as-obtained crystal show that quality of GaN crystal is greatly improved. The fabricated light-emitting diodes using the as-obtained GaN crystals emit strong electroluminescence under room illumination. This simple yet effective technique is believed to be applicable in metal-organic chemical vapor deposition systems and will find wide applications on other crystal growth.

  3. Selective area growth of high-density GaN nanowire arrays on Si(111) using thin AlN seeding layers

    NASA Astrophysics Data System (ADS)

    Wu, C. H.; Lee, P. Y.; Chen, K. Y.; Tseng, Y. T.; Wang, Y. L.; Cheng, K. Y.

    2016-11-01

    Selective area growth (SAG) of high-density (2.5×109 cm-2) GaN nanowires (NWs) on Si(111) substrate by plasma-assisted molecular beam epitaxy is presented. The effects of morphology and thickness of the AlN seeding layer on the quality of SAG GaN NWs are investigated. A thin AlN seeding layer of 30 nm thick with a surface roughness of less than 0.5 nm is suitable for high quality SAG GaN NWs growth. High-density AlN nanopedestal arrays used as seeds for SAG GaN NWs are fabricated from thin AlN seeding layers using soft nanoimprint lithography. By adjusting the growth temperature and Ga/N flux ratio, hexagonal shaped SAG GaN NWs are realized. The quality of SAG GaN NWs is evaluated by low temperature photoluminescence (PL) measurements. Three major groups of PL peaks at 3.47, 3.45, and 3.41 eV are identified. The peak at 3.471 eV is related to the neutral donor-bound exciton emission, and the 3.41 eV broadband emission is attributed to stacking faults or structural defects. The 3.45 eV peak is identified as the emission due to exciton recombination at polar inversion domain boundaries of NWs.

  4. Epitaxial Growth of GaN Nanowires with High Structural Perfection on a Metallic TiN Film.

    PubMed

    Wölz, M; Hauswald, C; Flissikowski, T; Gotschke, T; Fernández-Garrido, S; Brandt, O; Grahn, H T; Geelhaar, L; Riechert, H

    2015-06-10

    Vertical GaN nanowires are grown in a self-induced way on a sputtered Ti film by plasma-assisted molecular beam epitaxy. Both in situ electron diffraction and ex situ ellipsometry show that Ti is converted to TiN upon exposure of the surface to the N plasma. In addition, the ellipsometric data demonstrate this TiN film to be metallic. The diffraction data evidence that the GaN nanowires have a strict epitaxial relationship to this film. Photoluminescence spectroscopy of the GaN nanowires shows excitonic transitions virtually identical in spectral position, line width, and decay time to those of state-of-the-art GaN nanowires grown on Si. Therefore, the crystalline quality of the GaN nanowires grown on metallic TiN and on Si is equivalent. The freedom to employ metallic substrates for the epitaxial growth of semiconductor nanowires in high structural quality may enable novel applications that benefit from the associated high thermal and electrical conductivity as well as optical reflectivity.

  5. Materials physics and device development for improved efficiency of GaN HEMT high power amplifiers.

    SciTech Connect

    Kurtz, Steven Ross; Follstaedt, David Martin; Wright, Alan Francis; Baca, Albert G.; Briggs, Ronald D.; Provencio, Paula Polyak; Missert, Nancy A.; Allerman, Andrew Alan; Marsh, Phil F.; Koleske, Daniel David; Lee, Stephen Roger; Shul, Randy John; Seager, Carleton Hoover; Tigges, Christopher P.

    2005-12-01

    GaN-based microwave power amplifiers have been identified as critical components in Sandia's next generation micro-Synthetic-Aperture-Radar (SAR) operating at X-band and Ku-band (10-18 GHz). To miniaturize SAR, GaN-based amplifiers are necessary to replace bulky traveling wave tubes. Specifically, for micro-SAR development, highly reliable GaN high electron mobility transistors (HEMTs), which have delivered a factor of 10 times improvement in power performance compared to GaAs, need to be developed. Despite the great promise of GaN HEMTs, problems associated with nitride materials growth currently limit gain, linearity, power-added-efficiency, reproducibility, and reliability. These material quality issues are primarily due to heteroepitaxial growth of GaN on lattice mismatched substrates. Because SiC provides the best lattice match and thermal conductivity, SiC is currently the substrate of choice for GaN-based microwave amplifiers. Obviously for GaN-based HEMTs to fully realize their tremendous promise, several challenges related to GaN heteroepitaxy on SiC must be solved. For this LDRD, we conducted a concerted effort to resolve materials issues through in-depth research on GaN/AlGaN growth on SiC. Repeatable growth processes were developed which enabled basic studies of these device layers as well as full fabrication of microwave amplifiers. Detailed studies of the GaN and AlGaN growth of SiC were conducted and techniques to measure the structural and electrical properties of the layers were developed. Problems that limit device performance were investigated, including electron traps, dislocations, the quality of semi-insulating GaN, the GaN/AlGaN interface roughness, and surface pinning of the AlGaN gate. Surface charge was reduced by developing silicon nitride passivation. Constant feedback between material properties, physical understanding, and device performance enabled rapid progress which eventually led to the successful fabrication of state of the art

  6. Hydride-vapor-phase epitaxial growth of highly pure GaN layers with smooth as-grown surfaces on freestanding GaN substrates

    NASA Astrophysics Data System (ADS)

    Fujikura, Hajime; Konno, Taichiro; Yoshida, Takehiro; Horikiri, Fumimasa

    2017-08-01

    Thick (20-30 µm) layers of highly pure GaN with device-quality smooth as-grown surfaces were prepared on freestanding GaN substrates by using our advanced hydride-vapor-phase epitaxy (HVPE) system. Removal of quartz parts from the HVPE system markedly reduced concentrations of residual impurities to below the limits of detection by secondary-ion mass spectrometry. Appropriate gas-flow management in the HVPE system realized device-quality, smooth, as-grown surfaces with an excellent uniformity of thickness. The undoped GaN layer showed insulating properties. By Si doping, the electron concentration could be controlled over a wide range, down to 2 × 1014 cm-3, with a maximum mobility of 1150 cm2·V-1·s-1. The concentration of residual deep levels in lightly Si-doped layers was in the 1014 cm-3 range or less throughout the entire 2-in. wafer surface. These achievements clearly demonstrate the potential of HVPE as a tool for epitaxial growth of power-device structures.

  7. High field effects of GaN HEMTs.

    SciTech Connect

    Barker, Joy; Shul, Randy John

    2004-09-01

    This report represents the completion of a Laboratory-Directed Research and Development (LDRD) program to develop and fabricate geometric test structures for the measurement of transport properties in bulk GaN and AlGaN/GaN heterostructures. A large part of this study was spent examining fabrication issues related to the test structures used in these measurements, due to the fact that GaN processing is still in its infancy. One such issue had to do with surface passivation. Test samples without a surface passivation, often failed at electric fields below 50 kV/cm, due to surface breakdown. A silicon nitride passivation layer of approximately 200 nm was used to reduce the effects of surface states and premature surface breakdown. Another issue was finding quality contacts for the material, especially in the case of the AlGaN/GaN heterostructure samples. Poor contact performance in the heterostructures plagued the test structures with lower than expected velocities due to carrier injection from the contacts themselves. Using a titanium-rich ohmic contact reduced the contact resistance and stopped the carrier injection. The final test structures had an etch constriction with varying lengths and widths (8x2, 10x3, 12x3, 12x4, 15x5, and 16x4 {micro}m) and massive contacts. A pulsed voltage input and a four-point measurement in a 50 {Omega} environment was used to determine the current through and the voltage dropped across the constriction. From these measurements, the drift velocity as a function of the applied electric field was calculated and thus, the velocity-field characteristics in n-type bulk GaN and AlGaN/GaN test structures were determined. These measurements show an apparent saturation velocity near to 2.5x10{sup 7} cm/s at 180 kV/cm and 3.1x10{sup 7} cm/s, at a field of 140 kV/cm, for the bulk GaN and AlGaN heterostructure samples, respectively. These experimental drift velocities mark the highest velocities measured in these materials to date and confirm

  8. The Formation and Characterization of GaN Hexagonal Pyramids

    NASA Astrophysics Data System (ADS)

    Zhang, Shi-Ying; Xiu, Xiang-Qian; Lin, Zeng-Qin; Hua, Xue-Mei; Xie, Zi-Li; Zhang, Rong; Zheng, You-Dou

    2013-05-01

    GaN with hexagonal pyramids is fabricated using the photo-assisted electroless chemical etching method. Defective areas of the GaN substrate are selectively etched in a mixed solution of KOH and K2S2O8 under ultraviolet illumination, producing submicron-sized pyramids. Hexagonal pyramids on the etched GaN with well-defined {101¯1¯} facets and very sharp tips are formed. High-resolution x-ray diffraction shows that etched GaN with pyramids has a higher crystal quality, and micro-Raman spectra reveal a tensile stress relaxation in GaN with pyramids compared with normal GaN. The cathodoluminescence intensity of GaN after etching is significantly increased by three times, which is attributed to the reduction in the internal reflection, high-quality GaN with pyramids and the Bragg effect.

  9. High frequency dynamic bending response of piezoresistive GaN microcantilevers

    NASA Astrophysics Data System (ADS)

    Talukdar, Abdul; Qazi, Muhammad; Koley, Goutam

    2012-12-01

    Static and dynamic ac responses of piezoresistive GaN microcantilevers, with integrated AlGaN/GaN heterostructure field effect transistors as highly sensitive deflection transducers, have been investigated. Very high gauge factor exceeding 3500 was exhibited by the microcantilevers, with quality factor determined from electronically transduced ac response exceeding 200 in air and 4500 at low pressure. The gauge factor reduced at resonance frequency of the cantilevers, possibly due to reduced charge exchange with surface donor and trap states. Ultrasonic waves generated in air by a piezochip, and in the Si substrate through photoacoustic effect, could be detected by the cantilevers with high sensitivity.

  10. Highly conductive Ge-doped GaN epitaxial layers prepared by pulsed sputtering

    NASA Astrophysics Data System (ADS)

    Ueno, Kohei; Arakawa, Yasuaki; Kobayashi, Atsushi; Ohta, Jitsuo; Fujioka, Hiroshi

    2017-10-01

    Highly conductive Ge-doped GaN epitaxial layers were grown by low-temperature pulsed sputtering, and their fundamental structural and electrical properties were investigated. The room-temperature (RT) electron concentration was increased to 5.1 × 1020 cm‑3 by the Ge doping, and the atomically flat stepped and terraced surface and the crystalline quality of the layers were maintained. Consequently, the RT resistivity was reduced to 0.20 mΩ·cm, which is comparable to that for typical transparent conductive oxides such as indium tin oxide. The contact resistance of Ge-doped GaN with a Ti/Al/Ti/Au metal stack prepared without annealing was as low as 0.087 Ω·mm. Furthermore, the selective formation of a Ge-doped region using an SiO2 mask was demonstrated. The results clearly indicate the strong potential of pulsed sputtering Ge-doped GaN growth for forming low-parasitic-resistance contact layers of various electrical and optical devices.

  11. Improved crystal quality of semipolar (10 1 bar 3) GaN on Si(001) substrates using AlN/GaN superlattice interlayer

    NASA Astrophysics Data System (ADS)

    Lee, Ho-Jun; Bae, Si-Young; Lekhal, Kaddour; Mitsunari, Tadashi; Tamura, Akira; Honda, Yoshio; Amano, Hiroshi

    2016-11-01

    The planar epitaxial growth of semipolar (10 1 bar 3) GaN on a Si(001) substrate was performed on a directionally sputtered AlN buffer layer. Three types of interlayers, i.e., single AlN, double AlN, and a stack of AlN/GaN layers were grown by metalorganic chemical vapor deposition (MOCVD) to achieve high quality GaN films. The results for the stack of AlN/GaN layers provide highest crystal quality and optical properties for GaN. Comparing the top (Ga face) and bottom (N face) surfaces of grown semipolar (10 1 bar 3) GaN confirms the defect density reduction that is due to the application of interlayers. Moreover, reduced inversion domain density on the bottom surface is attributed with the insertion of interlayers. Improving the quality of semipolar GaN on Si(001) substrates is expected to be useful for GaN/Si(001) integrated optoelectronics.

  12. GaN nanorod arrays as a high-stability field emitter

    NASA Astrophysics Data System (ADS)

    Seo, H. W.; Tu, L. W.; Chen, M.; Chen, Q. Y.; Bensaoula, A.; Wang, X. M.; Chu, W. K.

    2017-09-01

    Patterned arrays of epitaxial GaN (0001) nanorods by Si-ion bombardment of Si (111) substrates have been fabricated for the field emitters. The field emission characteristics of the GaN nanorod arrays were measured; both GaN nanorods on self-implanted and GaN matrix on unimplanted Si substrates. The current densities as high as 10 mA/cm2 have been observed for GaN nanorod arrays under applied electrical field of about 70 V/μm, while the stability of field emission at 3.93 mA/cm2 has been tested up to 7 hours with the standard deviation of 0.2%.

  13. Ammothermal Growth of Gan Substrates For Leds: High-Pressure Ammonothermal Process for Bulk Gallium Nitride Crystal Growth for Energy Efficient Commercially Competitive Lighting

    SciTech Connect

    2011-01-01

    Broad Funding Opportunity Announcement Project: The new GaN crystal growth method is adapted from that used to grow quartz crystals, which are very inexpensive and represent the second-largest market for single crystals for electronic applications (after silicon). More extreme conditions are required to grow GaN crystals and therefore a new type of chemical growth chamber was invented that is suitable for large-scale manufacturing. A new process was developed that grows GaN crystals at a rate that is more than double that of current processes. The new technology will enable GaN substrates with best-in-world quality at lowest-in-world prices, which in turn will enable new generations of white LEDs, lasers for full-color displays, and high-performance power electronics.

  14. Improved crystalline quality of N-polar GaN epitaxial layers grown with reformed flow-rate-modulation technology

    NASA Astrophysics Data System (ADS)

    Zhang, Heng; Zhang, Xiong; Wang, Shuchang; Wang, Xiaolei; Zhao, Jianguo; Wu, Zili; Dai, Qian; Yang, Hongquan; Cui, Yiping

    2017-01-01

    A reformed flow-rate-modulation technology was developed for the metalorganic vapor phase epitaxy (MOVPE) growth of the N-polar GaN epitaxial layers. To improve the crystalline quality of the N-polar GaN epitaxial layers, a GaN nucleation layer was grown at relatively low temperature with carefully-controlled pulsed supply of Ga source and showed diverse morphology with atomic force microscope (AFM). Furthermore, the electrical and optical properties of the grown N-polar GaN epitaxial layers were investigated extensively by means of Hall effect, photoluminescence (PL), and X-ray rocking curve (XRC) measurements. The characterization results revealed that as compared with the N-polar GaN epitaxial layer grown over the conventional GaN nucleation layer which was deposited with continuous supply of both N and Ga sources, the electrical and optical properties of the N-polar GaN epitaxial layer grown with optimized supply of Ga source for the GaN nucleation layer were significantly improved.

  15. Growth of self-standing GaN substrates

    NASA Astrophysics Data System (ADS)

    Lee, Hyun-Jae; Fujii, Katsushi; Goto, Takenari; Kim, Chinkyo; Chang, Jiho; Hong, Soon-Ku; Cho, Meoungwhan; Yao, Takafumi

    2010-03-01

    Large-sized and high-quality free standing GaN are required with the development of GaN-based devices. We have developed new techniques to reduce the price of GaN substrates. In this paper, we introduce a simple fabrication way of freestanding GaN substrate using hydride vapor phase epitaxy (HVPE). An evaporable buffer layer was applied for the fabrication of 2inch freestanding GaN to separate from a sapphire substrate, in other words, a freestanding GaN was fabricated only by HVPE (one-stop process) without any process.

  16. High quality (In)GaN films on homoepitaxial substrates

    NASA Astrophysics Data System (ADS)

    Liu, Li; Zhang, Yong; Yin, Yian

    2017-02-01

    High quality GaN and InGaN epitaxial thin films were deposited by metal organic chemical vapor deposition (MOCVD). Two sets of thin film samples were prepared by varying the substrates and temperatures under a proper condition for achieving better optical properties. The morphological, crystalline quality and optical property of epitaxial layers were characterized by atomic force microscope (AFM), X-ray diffraction (XRD), photoluminescence (PL) and Raman spectra, respectively. It was found that the epitaxial layers grown on GaN homoepitaxial substrate have higher quality than those grown on sapphire substrate. The root mean square (RMS) of GaN film and InGaN film in AFM morphological were 0.5 nm, 2.7 nm respectively. The full width at half maximum (FWHM) of (102) in GaN film on GaN substrate was 33arcsec and the FWHM of (002) in InGaN film on GaN substrate was 50.58arcsec by XRD. The PL peaks of GaN film and InGaN film were 361 nm, 458 nm respectively. The E2 (high) of GaN film and InGaN film in Raman were both 567.08 cm-1.

  17. Epitaxial integration of the highly spin-polarized ferromagnetic semiconductor EuO with silicon and GaN.

    PubMed

    Schmehl, Andreas; Vaithyanathan, Venu; Herrnberger, Alexander; Thiel, Stefan; Richter, Christoph; Liberati, Marco; Heeg, Tassilo; Röckerath, Martin; Kourkoutis, Lena Fitting; Mühlbauer, Sebastian; Böni, Peter; Muller, David A; Barash, Yuri; Schubert, Jürgen; Idzerda, Yves; Mannhart, Jochen; Schlom, Darrell G

    2007-11-01

    Doped EuO is an attractive material for the fabrication of proof-of-concept spintronic devices. Yet for decades its use has been hindered by its instability in air and the difficulty of preparing and patterning high-quality thin films. Here, we establish EuO as the pre-eminent material for the direct integration of a carrier-concentration-matched half-metal with the long-spin-lifetime semiconductors silicon and GaN, using methods that transcend these difficulties. Andreev reflection measurements reveal that the spin polarization in doped epitaxial EuO films exceeds 90%, demonstrating that EuO is a half-metal even when highly doped. Furthermore, EuO is epitaxially integrated with silicon and GaN. These results demonstrate the high potential of EuO for spintronic devices.

  18. High breakdown single-crystal GaN p-n diodes by molecular beam epitaxy

    SciTech Connect

    Qi, Meng; Zhao, Yuning; Yan, Xiaodong; Li, Guowang; Verma, Jai; Fay, Patrick; Nomoto, Kazuki; Zhu, Mingda; Hu, Zongyang; Protasenko, Vladimir; Song, Bo; Xing, Huili Grace; Jena, Debdeep; Bader, Samuel

    2015-12-07

    Molecular beam epitaxy grown GaN p-n vertical diodes are demonstrated on single-crystal GaN substrates. A low leakage current <3 nA/cm{sup 2} is obtained with reverse bias voltage up to −20 V. With a 400 nm thick n-drift region, an on-resistance of 0.23 mΩ cm{sup 2} is achieved, with a breakdown voltage corresponding to a peak electric field of ∼3.1 MV/cm in GaN. Single-crystal GaN substrates with very low dislocation densities enable the low leakage current and the high breakdown field in the diodes, showing significant potential for MBE growth to attain near-intrinsic performance when the density of dislocations is low.

  19. Development of high-performance gan-based power transistors

    NASA Astrophysics Data System (ADS)

    Pang, Liang

    This thesis presents a comprehensive study on the development of GaN-based high-power transistors. First, selective area growth by plasma-assisted molecular beam epitaxy, a technology developed by our group for Ohmic contact improvement, is utilized to fabricate large-periphery AlGaN / GaN high electron mobility transistors (HEMTs) for high current operation. A novel Ti / Al multi-layered contact scheme is then introduced to further reduce the contact resistance by inhibiting the Al diffusion during Ohmic contact annealing. Second, to reduce the gate leakage current and enhance the breakdown voltage, gate-SiO 2 deposited by radiofrequency magnetron sputtering is investigated. The routinely occurring degradation of the two-dimensional electron gas properties due to the sputtering-induced surface damage is effectively removed by a buffer layer protection or a post-annealing treatment. A metal-oxide-semiconductor (MOS)-HEMT with sputtered-gate-SiO2 is demonstrated for the first time, which exhibits a record high breakdown voltage density. Furthermore, the sputtered-SiO2, together with the atomic-layer-deposited-Al 2O3, forms a bimodal-gate-oxide scheme, which is combined with the fluoride-plasma treatment to realize high-performance enhancement-mode MOSHEMT. Finally, a new transfer printing approach is developed to fabricate flexible hybrid inductorcapacitor (LC) filters via the pre-etched silicon-on-insulator wafer. The selectively patterned semi-stable Si-supporting membranes are sufficiently robust to support the entire device fabrication process, yet flexible enough to facilitate the subsequent transfer printing via adhesive stamp. The flexible hybrid LC filter has the potential to be incorporated into GaN-MOSHEMTbased high power DC-DC converters.

  20. Enhancement in wafer bow of free-standing GaN substrates due to high-dose hydrogen implantation: implications for GaN layer transfer applications

    NASA Astrophysics Data System (ADS)

    Singh, R.; Radu, I.; Bruederl, G.; Eichler, C.; Haerle, V.; Gösele, U.; Christiansen, S. H.

    2007-04-01

    Two-inch free-standing GaN wafers were implanted by 100 keV H+2 ions with a dose of 1.3 × 1017 cm-2 at room temperature. The hydrogen implantation induced damage in GaN extends between 230 to 500 nm from the surface as measured by cross-sectional transmission electron microscopy (XTEM). The wafer bow of the free-standing GaN wafers was measured using a Tencor long range profilometer on a scan length of 48 mm before and after the hydrogen implantation. Before implantation the bow of two different free-standing GaN wafers (named A and B) with different thicknesses was 1.5 µm and 6 µm, respectively. Initially, both wafers were concave in shape. After implantation the bow changed to convex with a value of 36 µm for wafer A and a value of 32 µm for wafer B. High dose hydrogen implantation leads to an in-plane compressive stress in the top damaged layer of the GaN, which is responsible for the enhancement of wafer bow and change of bow direction. The high value of bow after implantation hinders the direct wafer bonding of the free-standing GaN wafers to sapphire or any other handle wafers. Tight bonding between hydrogen implanted GaN wafers and the handle wafers is a necessary requirement for the successful layer transfer of thin GaN layers onto other substrates based on wafer bonding and layer splitting (Smart-cut).

  1. Ultra-high implant activation efficiency in GaN using novel high temperature RTP system

    SciTech Connect

    Cao, X.A.; Abernathy, C.R.; Singh, R.K.

    1998-04-01

    Si{sup +} implant activation efficiencies above 90%, even at doses of 5 {times} 10{sup 15} cm{sup {minus}2}, have been achieved in GaN by RTP at 1,400--1,500 C for 10 secs. The annealing system utilizes with MoSi{sub 2} heating elements capable of operation up to 1,900 C, producing high heating and cooling rates (up to 100 C{center_dot}s{sup {minus}1}). Unencapsulated GaN show severe surface pitting at 1,300 C, and complete loss of the film by evaporation at 1,400 C. Dissociation of nitrogen from the surface is found to occur with an approximate activation energy of 3.8 eV for GaN (compared to 4.4 eV for AlN and 3.4 eV for InN). Encapsulation with either rf-magnetron reactively sputtered or MOMBE-grown AlN thin films provide protection against GaN surface degradation up to 1,400 C, where peak electron concentrations of {approximately} 5 {times} 10{sup 20} cm{sup {minus}3} can be achieved in Si-implanted GaN. SIMS profiling showed little measurable redistribution of Si, suggesting D{sub Si} {le} 10{sup {minus}13} cm{sup 2}{center_dot}s{sup {minus}1} at 1,400 C . The implant activation efficiency decreases at higher temperatures, which may result from Si{sub Ga} to Si{sub N} site switching and resultant self-compensation.

  2. Transport, Growth Mechanisms, and Material Quality in GaN Epitaxial Lateral Overgrowth

    SciTech Connect

    Baca, Albert G.; Bartram, M.E.; Coltrin, M.E.; Crawford, M.H.; Han, J.; Missert, N.; Willan, C.C.

    1999-01-11

    Growth kinetics, mechanisms, and material quality in GaN epitaxial lateral over-growth (ELO) were examined using a single mask of systematically varied patterns. A 2-D gas phase reaction/diffusion model describes how transport of the Ga precursor to the growth surface enhances the lateral rate in the early stages of growth. In agreement with SEM studies of truncated growth runs, the model also predicts the dramatic decrease in the lateral rate that occurs as GaN over-growth reduces the exposed area of the mask. At the point of convergence, a step-flow coalescence mechanism is observed to fill in the area between lateral growth-fronts. This alternative growth mode in which a secondary growth of GaN is nucleated along a single convergence line, may be responsible for producing smooth films observed to have uniform cathodoluminescence (CL) when using 1{micro}m nucleation zones. Although emission is comprised of both UV ({approximately}365nm) and yellow ({approximately}550nm) components, the spectra suggest these films have reduced concentrations of threading dislocations normally associated with non-radiative recombination centers and defects known to accompany growth-front convergence lines.

  3. Effect of defects in oxide templates on Non-catalytic growth of GaN nanowires for high-efficiency light-emitting diodes

    NASA Astrophysics Data System (ADS)

    Hwang, Sung Won; Choi, Suk-Ho

    2016-04-01

    Two kinds of oxide templates, one with and one without undercuts, are employed to study the effect of defects in oxide templates on non-catalytic growth of GaN nanowires (NWs). GaN NWs abnormally grown from the templates containing undercuts exhibit two types of patterns: earlystage growth of premature NWs and abnormally-overgrown (~2 μm) NWs. GaN NWs grown on perfectly-symmetric template patterns are highly crystalline and have high aspect ratios (2 ~ 5), and their tops are shaped as pyramids with semipolar facets, clearly indicating hexagonal symmetry. The internal quantum efficiency of the well-grown NWs is 10% larger than that of the deformed NWs, as estimated by using photoluminescence. These results suggest that our technique is an effective approach for growing large-area-patterned, vertically-aligned, hexagonal GaN NWs without catalysts, in strong contrast to catalytic vapor-liquid-solid growth, and that good formation of the oxide templates is crucial for the growth of high-quality GaN NWs.

  4. A high efficiency C-band internally-matched harmonic tuning GaN power amplifier

    NASA Astrophysics Data System (ADS)

    Lu, Y.; Zhao, B. C.; Zheng, J. X.; Zhang, H. S.; Zheng, X. F.; Ma, X. H.; Hao, Y.; Ma, P. J.

    2016-09-01

    In this paper, a high efficiency C-band gallium nitride (GaN) internally-matched power amplifier (PA) is presented. This amplifier consists of 2-chips of self-developed GaN high-electron mobility transistors (HEMTs) with 16 mm total gate width on SiC substrate. New harmonic manipulation circuits are induced both in the input and output matching networks for high efficiency matching at fundamental and 2nd-harmonic frequency, respectively. The developed amplifier has achieved 72.1% power added efficiency (PAE) with 107.4 W output power at 5 GHz. To the best of our knowledge, this amplifier exhibits the highest PAE in C-band GaN HEMT amplifiers with over 100 W output power. Additionally, 1000 hours' aging test reveals high reliability for practical applications.

  5. High voltage and high current density vertical GaN power diodes

    SciTech Connect

    Fischer, A. J.; Dickerson, J. R.; Armstrong, A. M.; Moseley, M. W.; Crawford, M. H.; King, M. P.; Allerman, A. A.; Kaplar, R. J.; van Heukelom, M. S.; Wierer, J. J.

    2016-01-01

    We report on the realization of a GaN high voltage vertical p-n diode operating at > 3.9 kV breakdown with a specific on-resistance < 0.9 mΩ.cm2. Diodes achieved a forward current of 1 A for on-wafer, DC measurements, corresponding to a current density > 1.4 kA/cm2. An effective critical electric field of 3.9 MV/cm was estimated for the devices from analysis of the forward and reverse current-voltage characteristics. Furthermore this suggests that the fundamental limit to the GaN critical electric field is significantly greater than previously believed.

  6. High voltage and high current density vertical GaN power diodes

    DOE PAGES

    Fischer, A. J.; Dickerson, J. R.; Armstrong, A. M.; ...

    2016-01-01

    We report on the realization of a GaN high voltage vertical p-n diode operating at > 3.9 kV breakdown with a specific on-resistance < 0.9 mΩ.cm2. Diodes achieved a forward current of 1 A for on-wafer, DC measurements, corresponding to a current density > 1.4 kA/cm2. An effective critical electric field of 3.9 MV/cm was estimated for the devices from analysis of the forward and reverse current-voltage characteristics. Furthermore this suggests that the fundamental limit to the GaN critical electric field is significantly greater than previously believed.

  7. Contactless Mobility, Carrier Density, and Sheet Resistance Measurements on Si, GaN, and AlGaN/GaN High Electron Mobility Transistor (HEMT) Wafers

    DTIC Science & Technology

    2015-02-01

    Si, GaN , and AlGaN/ GaN High Electron Mobility Transistor (HEMT) Wafers by Randy P Tompkins and Danh Nguyen Approved for...7209 ● FEB 2015 US Army Research Laboratory Contactless Mobility, Carrier Density, and Sheet Resistance Measurements on Si, GaN , and AlGaN/ GaN ...Resistance Measurements on Si, GaN , and AlGaN/ GaN High Electron Mobility Transistor (HEMT) Wafers 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c. PROGRAM

  8. Ultra High Temperature Rapid Thermal Annealing of GaN

    SciTech Connect

    Cao, X.A.; Fu, M.; Han, J.; Pearton, S.J.; Rieger, D.J.; Sekhar, J.A.; Shul, R.J.; Singh, R.K.; Wilson, R.G.; Zolper, J.C.

    1998-11-20

    All of the major acceptor (Mg, C, Be) and donor (Si, S, Se and Te) dopants have been implanted into GaN films grown on A1203 substrates. Annealing was performed at 1100- 1500 C, using AIN encapsulation. Activation percentages of >90Y0 were obtained for Si+ implantation annealed at 1400 C, while higher temperatures led to a decrease in both carrier concentration and electron mobility. No measurable redistribution of any of the implanted dopants was observed at 1450 C.

  9. Ge doped GaN with controllable high carrier concentration for plasmonic applications

    SciTech Connect

    Kirste, Ronny; Hoffmann, Marc P.; Sachet, Edward; Bobea, Milena; Bryan, Zachary; Bryan, Isaac; Maria, Jon-Paul; Collazo, Ramón; Sitar, Zlatko; Nenstiel, Christian; Hoffmann, Axel

    2013-12-09

    Controllable Ge doping in GaN is demonstrated for carrier concentrations of up to 2.4 × 10{sup 20} cm{sup −3}. Low temperature luminescence spectra from the highly doped samples reveal band gap renormalization and band filling (Burstein-Moss shift) in addition to a sharp transition. Infrared ellipsometry spectra demonstrate the existence of electron plasma with an energy around 3500 cm{sup −1} and a surface plasma with an energy around 2000 cm{sup −1}. These findings open possibilities for the application of highly doped GaN for plasmonic devices.

  10. Dislocation annihilation in regrown GaN on nanoporous GaN template with optimization of buffer layer growth

    NASA Astrophysics Data System (ADS)

    Soh, C. B.; Hartono, H.; Chow, S. Y.; Chua, S. J.; Fitzgerald, E. A.

    2007-01-01

    Nanoporous GaN template has been fabricated by electrochemical etching to give hexagonal pits with nanoscale pores of size 20-50nm in the underlying grains. The effect of GaN buffer layer grown at various temperatures from 650to1015°C on these as-fabricated nanopores templates is investigated by transmission electron microscopy. The buffer layer grown at the optimized temperature of 850°C partially fill up the pores and voids with annihilation of threading dislocations, serving as an excellent template for high-quality GaN growth. This phenomenon is, however, not observed for the samples grown with other temperature buffer layers. Micro-Raman measurements show significant strain relaxation and improvement in the crystal quality of the overgrown GaN layer on nanoporous GaN template as compared to overgrown on conventional GaN template.

  11. Studies on high temperature vapor phase epitaxy of GaN

    NASA Astrophysics Data System (ADS)

    Schneider, T.; Lukin, G.; Zimmermann, F.; Barchuk, M.; Niederschlag, E.; Pätzold, O.; Stelter, M.

    2017-06-01

    This paper deals with technological development and investigation of the high temperature vapor phase epitaxy (HTVPE) for the growth of GaN films. A novel Ga evaporation cell designed for an optimal local temperature field and gas flow is described. The influence of the reactor pressure and the temperature of the Ga melt on the growth rate in HTVPE is studied. The experiments demonstrated growth rates up to 165 μm/h, which could be of potential interest for the deposition of thick GaN layers. Optical properties of the HTVPE layers, as well as typical process impurities are studied by PL, SIMS and GDMS, and discussed in detail. First experiments on a deposition of GaN films on sapphire substrates by HTVPE are presented.

  12. Botulinum toxin detection using AlGaN /GaN high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Wang, Yu-Lin; Chu, B. H.; Chen, K. H.; Chang, C. Y.; Lele, T. P.; Tseng, Y.; Pearton, S. J.; Ramage, J.; Hooten, D.; Dabiran, A.; Chow, P. P.; Ren, F.

    2008-12-01

    Antibody-functionalized, Au-gated AlGaN /GaN high electron mobility transistors (HEMTs) were used to detect botulinum toxin. The antibody was anchored to the gate area through immobilized thioglycolic acid. The AlGaN /GaN HEMT drain-source current showed a rapid response of less than 5s when the target toxin in a buffer was added to the antibody-immobilized surface. We could detect a range of concentrations from 1to10ng/ml. These results clearly demonstrate the promise of field-deployable electronic biological sensors based on AlGaN /GaN HEMTs for botulinum toxin detection.

  13. High-temperature molecular beam epitaxial growth of AlGaN/GaN on GaN templates with reduced interface impurity levels

    SciTech Connect

    Koblmueller, G.; Chu, R. M.; Raman, A.; Mishra, U. K.; Speck, J. S.

    2010-02-15

    We present combined in situ thermal cleaning and intentional doping strategies near the substrate regrowth interface to produce high-quality AlGaN/GaN high electron mobility transistors on semi-insulating (0001) GaN templates with low interfacial impurity concentrations and low buffer leakage. By exposing the GaN templates to an optimized thermal dissociation step in the plasma-assisted molecular beam epitaxy environment, oxygen, carbon, and, to lesser extent, Si impurities were effectively removed from the regrowth interface under preservation of good interface quality. Residual Si was further compensated by C-doped GaN via CBr{sub 4} to yield highly resistive GaN buffer layers. Improved N-rich growth conditions at high growth temperatures were then utilized for subsequent growth of the AlGaN/GaN device structure, yielding smooth surface morphologies and low residual oxygen concentration with large insensitivity to the (Al+Ga)N flux ratio. Room temperature electron mobilities of the two-dimensional electron gas at the AlGaN/GaN interface exceeded >1750 cm{sup 2}/V s and the dc drain current reached {approx}1.1 A/mm at a +1 V bias, demonstrating the effectiveness of the applied methods.

  14. High-temperature molecular beam epitaxial growth of AlGaN/GaN on GaN templates with reduced interface impurity levels

    NASA Astrophysics Data System (ADS)

    Koblmüller, G.; Chu, R. M.; Raman, A.; Mishra, U. K.; Speck, J. S.

    2010-02-01

    We present combined in situ thermal cleaning and intentional doping strategies near the substrate regrowth interface to produce high-quality AlGaN/GaN high electron mobility transistors on semi-insulating (0001) GaN templates with low interfacial impurity concentrations and low buffer leakage. By exposing the GaN templates to an optimized thermal dissociation step in the plasma-assisted molecular beam epitaxy environment, oxygen, carbon, and, to lesser extent, Si impurities were effectively removed from the regrowth interface under preservation of good interface quality. Residual Si was further compensated by C-doped GaN via CBr4 to yield highly resistive GaN buffer layers. Improved N-rich growth conditions at high growth temperatures were then utilized for subsequent growth of the AlGaN/GaN device structure, yielding smooth surface morphologies and low residual oxygen concentration with large insensitivity to the (Al+Ga)N flux ratio. Room temperature electron mobilities of the two-dimensional electron gas at the AlGaN/GaN interface exceeded >1750 cm2/V s and the dc drain current reached ˜1.1 A/mm at a +1 V bias, demonstrating the effectiveness of the applied methods.

  15. Bulk GaN Ion Cleaving

    NASA Astrophysics Data System (ADS)

    Moutanabbir, O.; Gösele, U.

    2010-05-01

    Bulk or freestanding GaN is a key material in various devices other than the blue laser diodes. However, the high cost of bulk GaN wafers severely limits the large scale exploitation of these potential technologies. In this paper, we discuss some engineering issues involved in the application of the ion-cut process to split a thin layer from 2-inch freestanding GaN. This process combines the implantation of light ions and wafer bonding and can possibly be used to reduce the cost of the fabrication of GaN-based devices by allowing the transfer of several bulk quality thin layers from the same donor wafer. To achieve this multi-layer transfer several conditions must be fulfilled. Here issues related to bulk GaN surface irregularities and wafer bowing are discussed. We also describe a method to circumvent most of these problems and achieve high quality bonding.

  16. Fabrication of non-polar GaN based highly responsive and fast UV photodetector

    NASA Astrophysics Data System (ADS)

    Gundimeda, Abhiram; Krishna, Shibin; Aggarwal, Neha; Sharma, Alka; Sharma, Nita Dilawar; Maurya, K. K.; Husale, Sudhir; Gupta, Govind

    2017-03-01

    We report the fabrication of ultraviolet photodetector on non-polar (11-20), nearly stress free, Gallium Nitride (GaN) film epitaxially grown on r-plane (1-102) sapphire substrate. High crystalline film leads to the formation of two faceted triangular islands like structures on the surface. The fabricated GaN ultraviolet photodetector exhibited a high responsivity of 340 mA/W at 5 V bias at room temperature which is the best performance reported for a-GaN/r-sapphire films. A detectivity of 1.24 × 109 Jones and noise equivalent power of 2.4 × 10-11 WHz-1/2 were also attained. The rise time and decay time of 280 ms and 450 ms have been calculated, respectively, which were the fastest response times reported for non-polar GaN ultraviolet photodetector. Such high performance devices substantiate that non-polar GaN can serve as an excellent photoconductive material for ultraviolet photodetector based applications.

  17. Ion implantation doping and high temperature annealing of GaN

    SciTech Connect

    Zolper, J.C.; Crawford, M.H.; Howard, A.J. |

    1995-12-31

    The III-V nitride-containing semiconductors InN, GaN, and AIN and their ternary alloys are the focus of extensive research for application to visible light emitters and as the basis for high temperature electronics. Recent advances in ion implantation doping of GaN and studies of the effect of rapid thermal annealing up to 1100{degrees}C are making new device structures possible. Both p- and n-type implantation doping of GaN has been achieved using Mg co-implanted with P for p-type and Si-implantation for n-type. Electrical activation was achieved by rapid thermal anneals in excess of 1000{degrees}C. Atomic force microscopy studies of the surface of GaN after a series of anneals from 750 to 1100{degrees}C shows that the surface morphology gets smoother following anneals in Ar or N{sub 2}. The photoluminescence of the annealed samples also shows enhanced bandedge emission for both annealing ambients. For the deep level emission near 2.2 eV, the sample annealed in N{sub 2} shows slightly reduced emission while the sample annealed in Ar shows increased emission. These annealing results suggest a combination of defect interactions occur during the high temperature processing.

  18. Significant improvement of GaN crystal quality with ex-situ sputtered AlN nucleation layers

    NASA Astrophysics Data System (ADS)

    Chen, Shuo-Wei; Yang, Young; Wen, Wei-Chih; Li, Heng; Lu, Tien-Chang

    2016-03-01

    Ex-situ sputtered AlN nucleation layer has been demonstrated effective to significantly improve crystal quality and electrical properties of GaN epitaxy layers for GaN based Light-emitting diodes (LEDs). In this report, we have successfully reduced X-ray (102) FWHM from 240 to 110 arcsec, and (002) FWHM from 230 to 101 arcsec. In addition, reverse-bias voltage (Vr) increased around 20% with the sputtered AlN nucleation layer. Furthermore, output power of LEDs grown on sputtered AlN nucleation layer can be improved around 4.0% compared with LEDs which is with conventional GaN nucleation layer on pattern sapphire substrate (PSS).

  19. Selective heteroepitaxy on deeply grooved substrate: A route to low cost semipolar GaN platforms of bulk quality

    SciTech Connect

    Tendille, Florian Vennéguès, Philippe; De Mierry, Philippe; Martin, Denis; Grandjean, Nicolas

    2016-08-22

    Semipolar GaN crystal stripes larger than 100 μm with dislocation densities below 5 × 10{sup 6} cm{sup −2} are achieved using a low cost fabrication process. An original sapphire patterning procedure is proposed, enabling selective growth of semipolar oriented GaN stripes while confining the defects to specific areas. Radiative and non-radiative crystalline defects are investigated by cathodoluminescence and can be correlated to the development of crystal microstructure during the growth process. A dislocation reduction mechanism, supported by transmission electron microscopy, is proposed. This method represents a step forward toward low-cost quasi-bulk semipolar GaN epitaxial platforms with an excellent structural quality which will allow for even more efficient III-nitride based devices.

  20. Nanoair-bridged lateral overgrowth of GaN on ordered nanoporous GaN template

    NASA Astrophysics Data System (ADS)

    Wang, Y. D.; Zang, K. Y.; Chua, S. J.; Tripathy, S.; Chen, P.; Fonstad, C. G.

    2005-12-01

    We report the growth of high-quality GaN epilayers on an ordered nanoporous GaN template by metalorganic chemical vapor deposition. The nanopores in GaN template were created by inductively coupled plasma etching using anodic aluminum oxide film as an etch mask. The average pore diameter and interpore distance is about 65 and 110nm, respectively. Subsequent overgrowth of GaN first begins at the GaN crystallite surface between the pores, and then air-bridge-mediated lateral overgrowth leads to the formation of the continuous layer. Microphotoluminescence and micro-Raman measurements show improved optical properties and significant strain relaxation in the overgrown layer when compared to GaN layer of same thickness simultaneously grown on sapphire without any template. Similar to conventional epitaxial lateral overgrown GaN, such overgrown GaN on a nanopatterned surface would also serve as a template for the growth of ultraviolet-visible light-emitting III-nitride devices.

  1. Density-dependent electron transport and precise modeling of GaN high electron mobility transistors

    SciTech Connect

    Bajaj, Sanyam Shoron, Omor F.; Park, Pil Sung; Krishnamoorthy, Sriram; Akyol, Fatih; Hung, Ting-Hsiang; Reza, Shahed; Chumbes, Eduardo M.; Khurgin, Jacob; Rajan, Siddharth

    2015-10-12

    We report on the direct measurement of two-dimensional sheet charge density dependence of electron transport in AlGaN/GaN high electron mobility transistors (HEMTs). Pulsed IV measurements established increasing electron velocities with decreasing sheet charge densities, resulting in saturation velocity of 1.9 × 10{sup 7 }cm/s at a low sheet charge density of 7.8 × 10{sup 11 }cm{sup −2}. An optical phonon emission-based electron velocity model for GaN is also presented. It accommodates stimulated longitudinal optical (LO) phonon emission which clamps the electron velocity with strong electron-phonon interaction and long LO phonon lifetime in GaN. A comparison with the measured density-dependent saturation velocity shows that it captures the dependence rather well. Finally, the experimental result is applied in TCAD-based device simulator to predict DC and small signal characteristics of a reported GaN HEMT. Good agreement between the simulated and reported experimental results validated the measurement presented in this report and established accurate modeling of GaN HEMTs.

  2. GaN Quantum Dot Superlattices Grown by Molecular Beam Epitaxy at High Temperature

    SciTech Connect

    Xu,T.; Zhou, L.; Wang, Y.; Ozcan, A.; Ludwig, K.; Smith, D.; Moustakas, T.

    2007-01-01

    In this paper, we report the growth of GaN quantum dot superlattices (QDSLs) with AlN barriers on (0001) sapphire substrates by molecular beam epitaxy at relatively high temperature (770? C) using the modified Stranski-Krastanov growth mode. Observations with atomic force microscopy show that the height distribution of the dots depends strongly on the number of GaN monolayers (MLs) grown on the AlN barriers. Specifically, the height distribution consists of two Gaussian distributions (bimodal) for coverages of 3 or 4 ML, and becomes a single Gaussian distribution for 5 and 6 ML of coverage. Furthermore, the density of quantum dots increases with the degree of coverage and saturates at 2x1011?dots/cm2. An increase in the number of stacks in the superlattice structure with 4 ML coverage also leads to a more pronounced bimodal height distribution. Electron microscopy observations indicate that the GaN QDs are truncated pyramids faceted along the {l_brace}1math03{r_brace} planes and suggest that larger dots are associated with threading dislocations which presumably provide low-energy nucleation sites. Transmission electron microscopy studies also indicate that most of the larger dots are nucleated next to edge-type dislocations, while most of the smaller dots are located in dislocation-free regions. These GaN QDSLs were also studied by grazing-incidence small angle x-ray scattering and grazing-incidence x-ray diffraction methods. The average lateral deviation and the vertical correlation length between QD positions for two successive layers were determined to be 1.4?nm and 190?nm, respectively. A GaN QD growth model is proposed to explain the phenomenon.

  3. Growth and characterizations of various GaN nanostructures on C-plane sapphire using laser MBE

    NASA Astrophysics Data System (ADS)

    Ch., Ramesh; Tyagi, P.; Maurya, K. K.; Kumar, M. Senthil; Kushvaha, S. S.

    2017-05-01

    We have grown various GaN nanostructures such as three-dimensional islands, nanowalls and nanocolumns on c-plane sapphire substrates using laser assisted molecular beam epitaxy (LMBE) system. The shape of the GaN nanostructures was controlled by using different nucleation surfaces such as bare and nitridated sapphire with GaN or AlN buffer layers. The structural and surface morphological properties of grown GaN nanostructures were characterized by ex-situ high resolution x-ray diffraction, Raman spectroscopy and field emission scanning electron microscopy. The symmetric x-ray rocking curve along GaN (0002) plane shows that the GaN grown on pre-nitridated sapphire with GaN or AlN buffer layer possesses good crystalline quality compared to sapphire without nitridation. The Raman spectroscopy measurements revealed the wurtzite phase for all the GaN nanostructures grown on c-sapphire.

  4. High performance of Ga-doped ZnO transparent conductive layers using MOCVD for GaN LED applications.

    PubMed

    Horng, Ray-Hua; Shen, Kun-Ching; Yin, Chen-Yang; Huang, Chiung-Yi; Wuu, Dong-Sing

    2013-06-17

    High performance of Ga-doped ZnO (GZO) prepared using metalorganic chemical vapor deposition (MOCVD) was employed in GaN blue light-emitting diodes (LEDs) as transparent conductive layers (TCL). By the post-annealing process, the annealed 800°C GZO films exhibited a high transparency above 97% at wavelength of 450 nm. The contact resistance of GZO decreased with the annealing temperature increasing. It was attributed to the improvement of the GZO crystal quality, leading to an increase in electron concentration. It was also found that some Zn atom caused from the decomposition process diffused into the p-GaN surface of LED, which generated a stronger tunneling effect at the GZO/p-GaN interface and promoted the formation of ohmic contact. Moreover, contrast to the ITO-LED, a high light extraction efficiency of 77% was achieved in the GZO-LED at injection current of 20 mA. At 350 mA injection current, the output power of 256.51 mW of GZO-LEDs, corresponding to a 21.5% enhancement as compared to ITO-LEDs was obtained; results are promising for the development of GZO using the MOCVD technique for GaN LED applications.

  5. Influence of edge-grown HVPE GaN on the structural quality of c-plane oriented HVPE-GaN grown on ammonothermal GaN substrates

    NASA Astrophysics Data System (ADS)

    Domagala, J. Z.; Smalc-Koziorowska, J.; Iwinska, M.; Sochacki, T.; Amilusik, M.; Lucznik, B.; Fijalkowski, M.; Kamler, G.; Grzegory, I.; Kucharski, R.; Zajac, M.; Bockowski, M.

    2016-12-01

    Study on the sources of stress in HVPE-GaN layer crystallized on 1-in. ammonothermally grown GaN seed is presented in this paper. Characterization by means of X-ray diffraction and transmission electron microscopy is performed. HVPE-GaN samples of high quality and those with visible quality deterioration are investigated on c-plane and m-plane cross-sections. Special attention is paid to HVPE material growing in semi-polar and non-polar directions on the edges of the seed and the growing layer. It is shown that this material generates significant stress leading to a structural deterioration of HVPE-GaN growing in the c-direction.

  6. Radar Waveform Pulse Analysis Measurement System for High-Power GaN Amplifiers

    NASA Technical Reports Server (NTRS)

    Thrivikraman, Tushar; Perkovic-Martin, Dragana; Jenabi, Masud; Hoffman, James

    2012-01-01

    This work presents a measurement system to characterize the pulsed response of high-power GaN amplifiers for use in space-based SAR platforms that require very strict amplitude and phase stability. The measurement system is able to record and analyze data on three different time scales: fast, slow, and long, which allows for greater detail of the mechanisms that impact amplitude and phase stability. The system is fully automated through MATLAB, which offers both instrument control capability and in-situ data processing. To validate this system, a high-power GaN HEMT amplifier operated in saturation was characterized. The fast time results show that variations to the amplitude and phase are correlated to DC supply transients, while long time characteristics are correlated to temperature changes.

  7. Radar Waveform Pulse Analysis Measurement System for High-Power GaN Amplifiers

    NASA Technical Reports Server (NTRS)

    Thrivikraman, Tushar; Perkovic-Martin, Dragana; Jenabi, Masud; Hoffman, James

    2012-01-01

    This work presents a measurement system to characterize the pulsed response of high-power GaN amplifiers for use in space-based SAR platforms that require very strict amplitude and phase stability. The measurement system is able to record and analyze data on three different time scales: fast, slow, and long, which allows for greater detail of the mechanisms that impact amplitude and phase stability. The system is fully automated through MATLAB, which offers both instrument control capability and in-situ data processing. To validate this system, a high-power GaN HEMT amplifier operated in saturation was characterized. The fast time results show that variations to the amplitude and phase are correlated to DC supply transients, while long time characteristics are correlated to temperature changes.

  8. Spectroscopic study of semipolar (112{sup ¯}2)-HVPE GaN exhibiting high oxygen incorporation

    SciTech Connect

    Schustek, Philipp; Hocker, Matthias; Thonke, Klaus; Klein, Martin; Scholz, Ferdinand; Simon, Ulrich

    2014-10-28

    Spatially resolved luminescence and Raman spectroscopy investigations are applied to a series of (112{sup ¯}2)-GaN samples grown by hydride vapor phase epitaxy (HVPE) grown over an initial layer deposited by metal organic vapor phase epitaxy on patterned sapphire substrates. Whereas these two differently grown GaN layers are crystallographically homogeneous, they differ largely in their doping level due to high unintentional oxygen uptake in the HVPE layer. This high doping shows up in luminescence spectra, which can be explained by a free-electron recombination band for which an analytical model considering the Burstein-Moss shift, conduction band tailing, and the bandgap renormalization is included. Secondary ion mass spectrometry, Raman spectroscopy, and Hall measurements concordantly determine the electron density to be above 10{sup 19 }cm{sup −3}. In addition, the strain state is assessed by Raman spectroscopy and compared to a finite element analysis.

  9. Design and simulation of a novel GaN based resonant tunneling high electron mobility transistor on a silicon substrate

    NASA Astrophysics Data System (ADS)

    Chowdhury, Subhra; Chattaraj, Swarnabha; Biswas, Dhrubes

    2015-04-01

    For the first time, we have introduced a novel GaN based resonant tunneling high electron mobility transistor (RTHEMT) on a silicon substrate. A monolithically integrated GaN based inverted high electron mobility transistor (HEMT) and a resonant tunneling diode (RTD) are designed and simulated using the ATLAS simulator and MATLAB in this study. The 10% Al composition in the barrier layer of the GaN based RTD structure provides a peak-to-valley current ratio of 2.66 which controls the GaN based HEMT performance. Thus the results indicate an improvement in the current-voltage characteristics of the RTHEMT by controlling the gate voltage in this structure. The introduction of silicon as a substrate is a unique step taken by us for this type of RTHEMT structure.

  10. Improvement of Crystalline Quality in GaN Films by Air-Bridged Lateral Epitaxial Growth

    NASA Astrophysics Data System (ADS)

    Kidoguchi, Isao; Ishibashi, Akihiko; Sugahara, Gaku; Tsujimura, Ayumu; Ban, Yuzaburoh

    2000-05-01

    Air-bridged lateral epitaxial growth (ABLEG), a new technique of lateral growth of GaN films, has been developed using low-pressure metalorganic vapor phase epitaxy. A previously grown 1-μm-thick GaN film is grooved along the < 1{\\bar 1}00 >\\textrm{GaN} direction, and the bottoms of the trenches and the sidewalls are covered with a silicon nitride mask. A free-standing GaN material is regrown from the exposed (0001) surface of the ridged GaN seed structure. Cross-sectional transmission electron microscopy analysis reveals that the dislocations originating from the underlying seed GaN extend straight in the < 0001 > direction and dislocations do not propagate into the wing region. The wing region also exhibits a smooth surface and the root mean square roughness is found to be 0.088 nm by atomic force microscopy measurement of the (0001) face of the wing region.

  11. AlGaN/GaN high electron mobility transistors with a low sub-threshold swing on free-standing GaN wafer

    NASA Astrophysics Data System (ADS)

    Liu, Xinke; Gu, Hong; Li, Kuilong; Guo, Lunchun; Zhu, Deliang; Lu, Youming; Wang, Jianfeng; Kuo, Hao-Chung; Liu, Zhihong; Liu, Wenjun; Chen, Lin; Fang, Jianping; Ang, Kah-Wee; Xu, Ke; Ao, Jin-Ping

    2017-09-01

    This paper reported AlGaN/GaN high electron mobility transistors (HEMTs) with low sub-threshold swing SS on free-standing GaN wafer. High quality AlGaN/GaN epi-layer has been grown by metal-organic chemical vapor deposition (MOCVD) on free-standing GaN, small full-width hall maximum (FWHM) of 42.9 arcsec for (0002) GaN XRD peaks and ultralow dislocation density (˜104-105 cm-2) were obtained. Due to these extremely high quality material properties, the fabricated AlGaN/GaN HEMTs achieve a low SS (˜60 mV/decade), low hysteresis of 54 mV, and high peak electron mobility μeff of ˜1456 cm2V-1s-1. Systematic study of materials properties and device characteristics exhibits that GaN-on-GaN AlGaN/GaN HEMTs are promising candidate for next generation high power device applications.

  12. Ultra-low resistance ohmic contacts to GaN with high Si doping concentrations grown by molecular beam epitaxy

    SciTech Connect

    Afroz Faria, Faiza; Guo Jia; Zhao Pei; Li Guowang; Kumar Kandaswamy, Prem; Wistey, Mark; Xing Huili; Jena, Debdeep

    2012-07-16

    Ti/Al/Ni/Au ohmic contacts were formed on heavily doped n{sup +} metal-polar GaN samples with various Si doping concentrations grown by molecular beam epitaxy. The contact resistivity (R{sub C}) and sheet resistance (R{sub sh}) as a function of corresponding GaN free carrier concentration (n) were measured. Very low R{sub C} values (<0.09 {Omega} mm) were obtained, with a minimum R{sub C} of 0.035 {Omega} mm on a sample with a room temperature carrier concentration of {approx}5 Multiplication-Sign 10{sup 19} cm{sup -3}. Based on the systematic study, the role of R{sub C} and R{sub sh} is discussed in the context of regrown n{sup +} GaN ohmic contacts for GaN based high electron mobility transistors.

  13. In situ GaN decomposition analysis by quadrupole mass spectrometry and reflection high-energy electron diffraction

    SciTech Connect

    Fernandez-Garrido, S.; Calleja, E.; Koblmueller, G.; Speck, J. S.

    2008-08-01

    Thermal decomposition of wurtzite (0001)-oriented GaN was analyzed: in vacuum, under active N exposure, and during growth by rf plasma-assisted molecular beam epitaxy. The GaN decomposition rate was determined by measurements of the Ga desorption using in situ quadrupole mass spectrometry, which showed Arrhenius behavior with an apparent activation energy of 3.1 eV. Clear signatures of intensity oscillations during reflection high-energy electron diffraction measurements facilitated complementary evaluation of the decomposition rate and highlighted a layer-by-layer decomposition mode in vacuum. Exposure to active nitrogen, either under vacuum or during growth under N-rich growth conditions, strongly reduced the GaN losses due to GaN decomposition.

  14. Basic Equations for the Modeling of Gallium Nitride (gan) High Electron Mobility Transistors (hemts)

    NASA Technical Reports Server (NTRS)

    Freeman, Jon C.

    2003-01-01

    Gallium nitride (GaN) is a most promising wide band-gap semiconductor for use in high-power microwave devices. It has functioned at 320 C, and higher values are well within theoretical limits. By combining four devices, 20 W has been developed at X-band. GaN High Electron Mobility Transistors (HEMTs) are unique in that the two-dimensional electron gas (2DEG) is supported not by intentional doping, but instead by polarization charge developed at the interface between the bulk GaN region and the AlGaN epitaxial layer. The polarization charge is composed of two parts: spontaneous and piezoelectric. This behavior is unlike other semiconductors, and for that reason, no commercially available modeling software exists. The theme of this document is to develop a self-consistent approach to developing the pertinent equations to be solved. A Space Act Agreement, "Effects in AlGaN/GaN HEMT Semiconductors" with Silvaco Data Systems to implement this approach into their existing software for III-V semiconductors, is in place (summer of 2002).

  15. GaN nanowire tip for high aspect ratio nano-scale AFM metrology (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Behzadirad, Mahmoud; Dawson, Noel; Nami, Mohsen; Rishinaramangalam, Ashwin K.; Feezell, Daniel F.; Busani, Tito L.

    2016-09-01

    In this study we introduce Gallium Nitride (GaN) nanowire (NW) as high aspect ratio tip with excellent durability for nano-scale metrology. GaN NWs have superior mechanical property and young modulus compare to commercial Si and Carbon tips which results in having less bending issue during measurement. The GaN NWs are prepared via two different methods: i) Catalyst-free selected area growth, using Metal Organic Chemical Vapor Deposition (MOCVD), ii) top-down approach by employing Au nanoparticles as the mask material in dry-etch process. To achieve small diameter tips, the semipolar planes of the NWs grown by MOCVD are etched using AZ400k. The diameter of the NWs fabricated using the top down process is controlled by using different size of nanoparticles and by Inductively Coupled Plasma etching. NWs with various diameters were manipulated on Si cantilevers using Focus Ion Beam (FIB) to make tips for AFM measurement. A Si (110) substrate containing nano-scale grooves with vertical 900 walls were used as a sample for inspection. AFM measurements were carried out in tapping modes for both types of nanowires (top-down and bottom-up grown nanowires) and results are compared with conventional Si and carbon nanotube tips. It is shown our fabricated tips are robust and have improved edge resolution over conventional Si tips. GaN tips made with NW's fabricated using our top down method are also shown to retain the gold nanoparticle at tip, which showed enhanced field effects in Raman spectroscopy.

  16. Highly mismatched GaN1-x Sb x alloys: synthesis, structure and electronic properties

    NASA Astrophysics Data System (ADS)

    Yu, K. M.; Sarney, W. L.; Novikov, S. V.; Segercrantz, N.; Ting, M.; Shaw, M.; Svensson, S. P.; Martin, R. W.; Walukiewicz, W.; Foxon, C. T.

    2016-08-01

    Highly mismatched alloys (HMAs) is a class of semiconductor alloys whose constituents are distinctly different in terms of size, ionicity and/or electronegativity. Electronic properties of the alloys deviate significantly from an interpolation scheme based on small deviations from the virtual crystal approximation. Most of the HMAs were only studied in a dilute composition limit. Recent advances in understanding of the semiconductor synthesis processes allowed growth of thin films of HMAs under non-equilibrium conditions. Thus reducing the growth temperature allowed synthesis of group III-N-V HMAs over almost the entire composition range. This paper focuses on the GaN x Sb1-x HMA which has been suggested as a potential material for solar water dissociation devices. Here we review our recent work on the synthesis, structural and optical characterization of GaN1-x Sb x HMA. Theoretical modeling studies on its electronic structure based on the band anticrossing (BAC) model are also reviewed. In particular we discuss the effects of growth temperature, Ga flux and Sb flux on the incorporation of Sb, film microstructure and optical properties of the alloys. Results obtained from two separate MBE growths are directly compared. Our work demonstrates that a large range of direct bandgap energies from 3.4 eV to below 1.0 eV can be achieved for this alloy grown at low temperature. We show that the electronic band structure of GaN1-x Sb x HMA over the entire composition range is well described by a modified BAC model which includes the dependence of the host matrix band edges as well as the BAC model coupling parameters on composition. We emphasize that the modified BAC model of the electronic band structure developed for the full composition of GaN x Sb1-x is general and is applicable to any HMA.

  17. Investigation of different mechanisms of GaN growth induced on AlN and GaN nucleation layers

    SciTech Connect

    Tasco, V.; Campa, A.; Tarantini, I.; Passaseo, A.; Gonzalez-Posada, F.; Munoz, E.; Redondo-Cubero, A.; Lorenz, K.; Franco, N.

    2009-03-15

    The evolution of GaN growth on AlN and GaN nucleation layers is compared through morphological and structural analyses, including ion beam analysis. By using AlN nucleation layer grown at high temperature, improved crystalline quality is exhibited by 300 nm thin GaN epilayers. GaN (002) x-ray rocking curve as narrow as 168 arc sec and atomic-step surface morphology characterize such a thin GaN film on AlN. Defects are strongly confined into the first 50 nm of growth, whereas a fast laterally coherent growth is observed when increasing thickness, as an effect of high temperature AlN surface morphology and Ga adatom dynamics over this template.

  18. The impact of substrate nitridation temperature and buffer design and synthesis on the polarity of GaN epitaxial films

    NASA Astrophysics Data System (ADS)

    Namkoong, Gon; Alan Doolittle, W.; Brown, April S.; Losurdo, Maria; Giangregorio, Maria M.; Bruno, Giovanni

    2003-05-01

    The polarity of GaN epitaxial layers grown on GaN and AlN buffer layers was investigated and found to be dependent on nitridation temperature over the range of 200-700°C. When low temperature (LT), 500°C, GaN buffer layers are used, GaN epitaxial layers grown on 200°C nitrided sapphire have a higher density of N-polar inversion domains. However, a high density of dislocation pits was observed on GaN epitaxial layers based on AFM morphology when GaN epitaxial layers were grown on LT GaN buffer of 700°C nitrided sapphire substrate. With high temperature (HT), 850°C, AlN buffer layers, the density of N-polar inversion domains in GaN epitaxial layers depends on the thickness of AlN buffer layer. The structural quality of Ga-polar GaN epitaxial layer is dramatically improved when LT GaN and HT AlN buffer layers are combined with an optimized annealing time. The measured full-widths at half-maximum of (0 0 0 2) symmetric and (1 0 .4) asymmetric reflections are 68 and 246 arcsec, respectively, for 1.0 μm GaN epitaxial layers. The results presented here can be implemented to produce low dislocation density, single Ga-polar GaN epitaxial layers.

  19. P-type doping of GaN

    SciTech Connect

    Wong, Raechelle Kimberly

    2000-04-01

    After implantation of As, As + Be, and As + Ga into GaN and annealing for short durations at temperatures as high as 1500 C, the GaN films remained highly resistive. It was apparent from c-RBS studies that although implantation damage did not create an amorphous layer in the GaN film, annealing at 1500 C did not provide enough energy to completely recover the radiation damage. Disorder recovered significantly after annealing at temperatures up to 1500 C, but not completely. From SIMS analysis, oxygen contamination in the AIN capping layer causes oxygen diffusion into the GaN film above 1400 C. The sapphire substrate (A1203) also decomposed and oxygen penetrated into the backside of the GaN layer above 1400 C. To prevent donor-like oxygen impurities from the capping layer and the substrate from contaminating the GaN film and compensating acceptors, post-implantation annealing should be done at temperatures below 1500 C. Oxygen in the cap could be reduced by growing the AIN cap on the GaN layer after the GaN growth run or by depositing the AIN layer in a ultra high vacuum (UHV) system post-growth to minimize residual oxygen and water contamination. With longer annealing times at 1400 C or at higher temperatures with a higher quality AIN, the implantation drainage may fully recover.

  20. The effect of nucleation layer thickness on the structural evolution and crystal quality of bulk GaN grown by a two-step process on cone-patterned sapphire substrate

    NASA Astrophysics Data System (ADS)

    Shang, Lin; Zhai, Guangmei; Mei, Fuhong; Jia, Wei; Yu, Chunyan; Liu, Xuguang; Xu, Bingshe

    2016-05-01

    The role of nucleation layer thickness on the GaN crystal quality grown on cone-patterned sapphire substrate (PSS) was explored. The morphologies of epitaxial GaN at different growth stages were investigated by a series of growth interruption in detail. After 10- and 15-min three-dimensional growth, the nucleation sites are very important for the bulk GaN crystal quality. They have a close relationship with the nucleation layer thickness, as confirmed through the scanning electron microscope (SEM) analysis. Nucleation sites formed mainly on patterns are bad for bulk GaN crystal quality and nucleation sites formed mainly in the trenches of PSS mounds are good for bulk GaN crystal quality, as proved by X-ray diffraction analysis. Nucleation layer thickness can effectively control the nucleation sites and thus determine the crystal quality of bulk GaN.

  1. AlGaN/GaN high electron mobility transistors with intentionally doped GaN buffer using propane as carbon precursor

    NASA Astrophysics Data System (ADS)

    Bergsten, Johan; Li, Xun; Nilsson, Daniel; Danielsson, Örjan; Pedersen, Henrik; Janzén, Erik; Forsberg, Urban; Rorsman, Niklas

    2016-05-01

    AlGaN/GaN high electron mobility transistors (HEMTs) fabricated on a heterostructure grown by metalorganic chemical vapor deposition using an alternative method of carbon (C) doping the buffer are characterized. C-doping is achieved by using propane as precursor, as compared to tuning the growth process parameters to control C-incorporation from the gallium precursor. This approach allows for optimization of the GaN growth conditions without compromising material quality to achieve semi-insulating properties. The HEMTs are evaluated in terms of isolation and dispersion. Good isolation with OFF-state currents of 2 × 10-6 A/mm, breakdown fields of 70 V/µm, and low drain induced barrier lowering of 0.13 mV/V are found. Dispersive effects are examined using pulsed current-voltage measurements. Current collapse and knee walkout effects limit the maximum output power to 1.3 W/mm. With further optimization of the C-doping profile and GaN material quality this method should offer a versatile approach to decrease dispersive effects in GaN HEMTs.

  2. Figures of merit in high-frequency and high-power GaN HEMTs

    NASA Astrophysics Data System (ADS)

    Marino, F. A.; Faralli, N.; Ferry, D. K.; Goodnick, S. M.; Saraniti, M.

    2009-11-01

    The most important metrics for the high-frequency and high-power performance of microwave transistors are the cut-off frequency fT, and the Johnson figure of merit FoMJohnson. We have simulated a state-of-the-art, high-frequency and high-power GaN HEMT using our full band Cellular Monte Carlo (CMC) simulator, in order to study the RF performance and compare different methods to obtain such metrics. The current gain as a function of the frequency, was so obtained both by the Fourier decomposition (FD) method and the analytical formula proposed by Akis. A cut-off frequency fT of 150 GHz was found in both the transit time analysis given by the analytical approach, and the transient Fourier analysis, which matches well with the 153 GHz value measured experimentally. Furthermore, through some physical considerations, we derived the relation between the FoMJohnson as a function of the breakdown voltage, VBD, and the cut-off frequency, fT . Using this relation and assuming a breakdown voltage of 80V as measured experimentally, a Johnson figure of merit of around 20 × 1012V/s was found for the HEMT device analyzed in this work.

  3. GaN film growth on LiNbO3 surfaces using molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Hoai Nam, Man; Goo, Son Chul; Deock Kim, Moon; Yang, Woochul

    2009-09-01

    GaN has been used for high power, high frequency electronic and optoelectronic devices such as light emitting diodes and laser diodes. Most of the GaN films grow on sapphire (0001) and silicon (111) substrates. In these work, we are trying to grow GaN films on lithium niobate (LiNbO3) substrates using molecular beam epitaxy (MBE). As a ferroelectric materials, LiNbO3 has a spontaneous polarization which may provide excellent control of polarity of GaN. The growth of GaN films on LiNbO3 has been performed after the LiNbO3 substrates was annealed in air at 1000°C for 2 hours. The annealed substrates allowed us to prepare atomically flat surfaces and improve adhesion of GaN on LiNbO3. The AlN buffer layer was deposited to get a smaller lattice mismatch with the GaN films. Compared with GaN films grown without a AlN layer, the crystal qualities of GaN films with AlN buffer layers are extremely improved. The surface morphology of LiNbO3 substrates and the grown GaN films were characterized by atomic force microscopy (AFM), and the crystal structures were studied by X-ray diffraction (XRD).

  4. GaN HEMT with AlGaN back barrier for high power MMIC switch application

    NASA Astrophysics Data System (ADS)

    Chunjiang, Ren; Hongchang, Shen; Zhonghui, Li; Tangsheng, Chen; Bin, Zhang; Tao, Gao

    2015-01-01

    0.25 μm GaN HEMT with AlGaN back barrier for high power switch application has been presented. By introducing AlGaN back barrier, the buffer layer breakdown voltage for the metal-organic chemical vapor deposited AlGaN/GaN hetero-structure on 3-inch SiC substrate showed a considerable increment, which was nearly 4× and 2× of that for the conventional GaN buffer layer and GaN buffer layer with Fe doped, respectively. GaN switch HEMTs with source to drain spacing of 2, 2.5, 3, 3.5 and 4 μm were fabricated on the AlGaN/GaN epitaxial material with AlGaN back barrier and estimated off state power handling for the GaN switch HEMTs were 25.0, 46.2, 64.0, 79.2, and 88.4 W, respectively. A demonstrator DC-12 GHz GaN SPDT MMIC switch was designed in reflective series-shunt-shunt configuration based on the GaN HEMT, with a source to drain spacing of 2.5 μm. The developed SPDT MMIC switch showed a maximum insertion loss of 1.0 dB and a minimum isolation of 30 dB at a frequency range of DC-12 GHz. A power handling capability of 44.1 dBm was achieved at 10 GHz for the MMIC switch with continuous wave power compression measurement.

  5. 4 Gbps direct modulation of 450 nm GaN laser for high-speed visible light communication.

    PubMed

    Lee, Changmin; Zhang, Chong; Cantore, Michael; Farrell, Robert M; Oh, Sang Ho; Margalith, Tal; Speck, James S; Nakamura, Shuji; Bowers, John E; DenBaars, Steven P

    2015-06-15

    We demonstrate high-speed data transmission with a commercial high power GaN laser diode at 450 nm. 2.6 GHz bandwidth was achieved at an injection current of 500 mA using a high-speed visible light communication setup. Record high 4 Gbps free-space data transmission rate was achieved at room temperature.

  6. Probing temperature gradients within the GaN buffer layer of AlGaN/GaN high electron mobility transistors with Raman thermography

    SciTech Connect

    Hodges, C. Pomeroy, J.; Kuball, M.

    2014-02-14

    We demonstrate the ability of confocal Raman thermography using a spatial filter and azimuthal polarization to probe vertical temperature gradients within the GaN buffer layer of operating AlGaN/GaN high electron mobility transistors. Temperature gradients in the GaN layer are measured by using offset focal planes to minimize the contribution from different regions of the GaN buffer. The measured temperature gradient is in good agreement with a thermal simulation treating the GaN thermal conductivity as homogeneous throughout the layer and including a low thermal conductivity nucleation layer to model the heat flow between the buffer and substrate.

  7. High temperature stable WSi{sub x} ohmic contacts on GaN

    SciTech Connect

    Pearton, S.J.; Donovan, S.M.; Abernathy, C.R.; Ren, F.; Zolper, J.C.; Cole, M.W.; Zeitouny, A.; Eizenberg, M.; Shul, R.J.

    1998-06-01

    The authors have sputter-deposited 500--1200{angstrom} thick WSi{sub 0.45} metallization onto n{sup +} GaN (n{ge}10{sup 19}cm{sup {minus}3}) doped either during MOCVD growth or by direct Si{sup +} ion implantation (5{times}10{sup 15}cm{sup {minus}2}, 100 keV) activated by RTA at 1,100 C for 30 secs. In the epi samples R{sub C} values of {approximately}10{sup {minus}14}{Omega}cm{sup 2} were obtained, and were stable to {approximately}1000 C. The annealing treatments up to 600 C had little effect on the WSi{sub x}/GaN interface, but the {beta}-W{sub 2}N phase formed between 700--800 C, concomitant with a strong reduction in near-surface crystalline defects in the GaN. Spiking of the metallization down the threading and misfit dislocations was observed at 800 C, extending >5,000{angstrom} in some cases. This can create junction shorting in bipolar or thyristor devices, R{sub C} values of <10{sup {minus}6}{Omega}cm{sup 2} were obtained on the implanted samples for 950 C annealing, with values of after 1050 C anneals. The lower R{sub C} values compared to epi samples appear to be a result of the higher peak doping achieved. The authors observed wide spreads in R{sub C} values over a wafer surface, with the values on 950 C annealed material ranging from 10{sup {minus}7} to 10{sup {minus}4}{Omega}cm{sup 2}. There appear to be highly nonuniform doping regions in the GaN, perhaps associated with the high defect density in heteroepitaxial material, and this may contribute to the variations observed. They believe that near-surface stoichiometry is variable in much of the GaN currently produced due to the relative ease of preferential N{sub 2} loss and the common use of H{sub 2}-containing growth (and cool-down) ambients. Finally, the ohmic contact behavior of WSi{sub x} on abrupt and graded composition In{sub x}Al{sub 1{minus}x}N layers has been studied as a function of growth temperature, InN mole fraction (x = 0.5--1) and post WSi{sub x} deposition annealing treatment.

  8. Highly ordered catalyst-free and mask-free GaN nanorods on r-plane sapphire.

    PubMed

    Aschenbrenner, T; Kruse, C; Kunert, G; Figge, S; Sebald, K; Kalden, J; Voss, T; Gutowski, J; Hommel, D

    2009-02-18

    Self-organized and highly ordered GaN nanorods were grown without catalyst on r-plane sapphire using a combination of molecular beam epitaxy and metal-organic vapor-phase epitaxy. AlN nucleation centers for the nanorods were prepared by nitridation of the sapphire in a metal-organic vapor-phase epitaxy reactor, while the nanorods were grown by molecular beam epitaxy. A coalesced two-dimensional GaN layer was observed between the nanorods. The nanorods are inclined by 62 degrees towards the [Formula: see text]-directions of the a-plane GaN layer. The high degree of ordering and the structural perfection were confirmed by micro-photoluminescence measurements.

  9. Nonlithographic nanopatterning through anodic aluminum oxide template and selective growth of highly ordered GaN nanostructures

    NASA Astrophysics Data System (ADS)

    Wang, Y. D.; Zang, K. Y.; Chua, S. J.

    2006-09-01

    Ordered GaN nanostructures, i.e., nanopore and nanodot arrays, have been demonstrated by combining a nonlithographic nanopatterning technique and nanoscale selective epitaxial growth. Hexagonal-close-packed nanopore arrays were fabricated in GaN surfaces and SiO2 surfaces on GaN films by inductively coupled plasma etching using anodic aluminum oxide templates as etching masks. Selective area growth through nanopores in SiO2 by metal organic chemical vapor deposition results in ordered GaN nanodot arrays with an average dot diameter and height of 60 and 100nm, respectively. The diameter and density of the GaN nanopore arrays and nanodot arrays are controlled by that of the anodic aluminum oxide template, which can be tuned in a wide range by controlling the anodization conditions. Applying anodic aluminum oxide as an etching mask provides an effective nonlithographic and free of foreign catalysts method to fabricate ordered and dense nitride nanostructures for either bottom-up or top-down technique in the application of high efficiency nitride light emitting diodes.

  10. Ultrahigh Si+ implant activation efficiency in GaN using a high-temperature rapid thermal process system

    NASA Astrophysics Data System (ADS)

    Cao, X. A.; Abernathy, C. R.; Singh, R. K.; Pearton, S. J.; Fu, M.; Sarvepalli, V.; Sekhar, J. A.; Zolper, J. C.; Rieger, D. J.; Han, J.; Drummond, T. J.; Shul, R. J.; Wilson, R. G.

    1998-07-01

    Si+ implant activation efficiencies above 90%, even at doses of 5×1015cm-2, have been achieved in GaN by rapid thermal processing at 1400-1500 °C for 10 s. The annealing system utilizes molybdenum intermetallic heating elements capable of operation up to 1900 °C, producing high heating and cooling rates (up to 100 °C s-1). Unencapsulated GaN shows severe surface pitting at 1300 °C and complete loss of the film by evaporation at 1400 °C. Dissociation of nitrogen from the surface is found to occur with an approximate activation energy of 3.8 eV for GaN (compared to 4.4 eV for AlN and 3.4 eV for InN). Encapsulation with either rf magnetron reactively sputtered or metal organic molecular beam epitaxy-grown AlN thin films provides protection against GaN surface degradation up to 1400 °C, where peak electron concentrations of ˜5×1020cm-3 can be achieved in Si-implanted GaN. Secondary ion mass spectrometry profiling showed little measurable redistribution of Si, suggesting DSi⩽10-13 cm2 s-1 at 1400 °C. The implant activation efficiency decreases at higher temperatures, which may result from SiGa to SiN site switching and resultant self-compensation.

  11. The effect of substrate on high-temperature annealing of GaN epilayers: Si versus sapphire

    SciTech Connect

    Pastor, D.; Cusco, R.; Artus, L.; Gonzalez-Diaz, G.; Iborra, E.; Jimenez, J.; Peiro, F.; Calleja, E.

    2006-08-15

    We have studied the effects of rapid thermal annealing at 1300 deg.C on GaN epilayers grown on AlN buffered Si(111) and on sapphire substrates. After annealing, the epilayers grown on Si display visible alterations with craterlike morphology scattered over the surface. The annealed GaN/Si layers were characterized by a range of experimental techniques: scanning electron microscopy, optical confocal imaging, energy dispersive x-ray microanalysis, Raman scattering, and cathodoluminescence. A substantial Si migration to the GaN epilayer was observed in the crater regions, where decomposition of GaN and formation of Si{sub 3}N{sub 4} crystallites as well as metallic Ga droplets and Si nanocrystals have occurred. The average diameter of the Si nanocrystals was estimated from Raman scattering to be around 3 nm. Such annealing effects, which are not observed in GaN grown on sapphire, are a significant issue for applications of GaN grown on Si(111) substrates when subsequent high-temperature processing is required.

  12. Direct growth of freestanding GaN on C-face SiC by HVPE.

    PubMed

    Tian, Yuan; Shao, Yongliang; Wu, Yongzhong; Hao, Xiaopeng; Zhang, Lei; Dai, Yuanbin; Huo, Qin

    2015-06-02

    In this work, high quality GaN crystal was successfully grown on C-face 6H-SiC by HVPE using a two steps growth process. Due to the small interaction stress between the GaN and the SiC substrate, the GaN was self-separated from the SiC substrate even with a small thickness of about 100 μm. Moreover, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth. Hot phosphoric acid etching (at 240 °C for 30 min) was employed to identify the polarity of the GaN layer. According to the etching results, the obtained layer was Ga-polar GaN. High-resolution X-ray diffraction (HRXRD) and electron backscatter diffraction (EBSD) were done to characterize the quality of the freestanding GaN. The Raman measurements showed that the freestanding GaN film grown on the C-face 6H-SiC was stress-free. The optical properties of the freestanding GaN layer were determined by photoluminescence (PL) spectra.

  13. Direct growth of freestanding GaN on C-face SiC by HVPE

    PubMed Central

    Tian, Yuan; Shao, Yongliang; Wu, Yongzhong; Hao, Xiaopeng; Zhang, Lei; Dai, Yuanbin; Huo, Qin

    2015-01-01

    In this work, high quality GaN crystal was successfully grown on C-face 6H-SiC by HVPE using a two steps growth process. Due to the small interaction stress between the GaN and the SiC substrate, the GaN was self-separated from the SiC substrate even with a small thickness of about 100 μm. Moreover, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth. Hot phosphoric acid etching (at 240 °C for 30 min) was employed to identify the polarity of the GaN layer. According to the etching results, the obtained layer was Ga-polar GaN. High-resolution X-ray diffraction (HRXRD) and electron backscatter diffraction (EBSD) were done to characterize the quality of the freestanding GaN. The Raman measurements showed that the freestanding GaN film grown on the C-face 6H-SiC was stress-free. The optical properties of the freestanding GaN layer were determined by photoluminescence (PL) spectra. PMID:26034939

  14. GaN HEMTs

    NASA Astrophysics Data System (ADS)

    Anderson, Jonathan W.; Lee, Kyoung-Keun; Piner, Edwin L.

    2012-03-01

    Gallium nitride (GaN) has enormous potential for applications in high electron mobility transistors (HEMTs) used in RF and power devices. Intrinsic device properties such as high electron mobility, high breakdown voltage, very high current density, electron confinement in a narrow channel, and high electron velocity in the 2-dimensional electron gas of the HEMT structure are due in large part to the wide band gap of this novel semiconductor material system. This presentation discusses the properties of GaN that make it superior to other semiconductor materials, and outlines the research that will be undertaken in a new program at Texas State University to advance GaN HEMT technology. This program's aim is to further innovate the exceptional performance of GaN through improved material growth processes and epitaxial structure design.

  15. Critical issues for homoepitaxial GaN growth by molecular beam epitaxy on hydride vapor-phase epitaxy-grown GaN substrates

    NASA Astrophysics Data System (ADS)

    Storm, D. F.; Hardy, M. T.; Katzer, D. S.; Nepal, N.; Downey, B. P.; Meyer, D. J.; McConkie, Thomas O.; Zhou, Lin; Smith, David J.

    2016-12-01

    While the heteroepitaxial growth of gallium nitride-based materials and devices on substrates such as SiC, sapphire, and Si has been well-documented, the lack of a cost-effective source of bulk GaN crystals has hindered similar progress on homoepitaxy. Nevertheless, freestanding GaN wafers are becoming more widely available, and there is great interest in growing GaN films and devices on bulk GaN substrates, in order to take advantage of the greatly reduced density of threading dislocations, particularly for vertical devices. However, homoepitaxial GaN growth is far from a trivial task due to the reactivity and different chemical sensitivities of N-polar (000_1) and Ga-polar (0001) GaN surfaces, which can affect the microstructure and concentrations of impurities in homoepitaxial GaN layers. In order to achieve high quality, high purity homoepitaxial GaN, it is necessary to investigate the effect of the ex situ wet chemical clean, the use of in situ cleaning procedures, the sensitivity of the GaN surface to thermal decomposition, and the effect of growth temperature. We review the current understanding of these issues with a focus on homoepitaxial growth of GaN by molecular beam epitaxy (MBE) on c-plane surfaces of freestanding GaN substrates grown by hydride vapor phase epitaxy (HVPE), as HVPE-grown substrates are most widely available. We demonstrate methods for obtaining homoepitaxial GaN layers by plasma-assisted MBE in which no additional threading dislocations are generated from the regrowth interface and impurity concentrations are greatly reduced.

  16. High-field electron transport in GaN under crossed electric and magnetic fields

    NASA Astrophysics Data System (ADS)

    Kochelap, V. A.; Korotyeyev, V. V.; Syngayivska, G. I.; Varani, L.

    2015-10-01

    High-field electron transport studied in crossed electric and magnetic fields in bulk GaN with doping of 1016 cm-3, compensation around 90% at the low lattice temperature (30 K). It was found the range of the magnetic and electric fields where the non-equilibrium electron distribution function has a complicated topological structure in the momentum space with a tendency to the formation of the inversion population. Field dependences of dissipative and Hall components of the drift velocity were calculated for the samples with short- and open- circuited Hall contacts in wide ranges of applied electric (0 — 20 kV/cm) and magnetic (1 — 10 T) fields. For former sample, field dependences of dissipative and Hall components of the drift velocity have a non-monotonic behavior. The dissipative component has the inflection point which corresponds to the maximum point of the Hall component. For latter sample, the drift velocity demonstrate a usual sub-linear growth without any critical points. We found that GaN samples with controlled resistance of the Hall circuit can be utilized as a electronic high-power switch.

  17. MOVPE growth of GaN on 6-inch SOI-substrates: effect of substrate parameters on layer quality and strain

    NASA Astrophysics Data System (ADS)

    Lemettinen, J.; Kauppinen, C.; Rudzinski, M.; Haapalinna, A.; Tuomi, T. O.; Suihkonen, S.

    2017-04-01

    We demonstrate that higher crystalline quality, lower strain and improved electrical characteristics can be achieved in gallium nitride (GaN) epitaxy by using a silicon-on-insulator (SOI) substrate compared to a bulk silicon (Si) substrate. GaN layers were grown by metal–organic vapor phase epitaxy on 6-inch bulk Si and SOI wafers using the standard step graded AlGaN and AlN approach. The GaN layers grown on SOI exhibited lower strain according to x-ray diffraction analysis. Defect selective etching measurements suggested that the use of SOI substrate for GaN epitaxy reduces the dislocation density approximately by a factor of two. Furthermore, growth on SOI substrate allows one to use a significantly thinner AlGaN buffer compared to bulk Si. Synchrotron radiation x-ray topography analysis confirmed that the stress relief mechanism in GaN on SOI epitaxy is the formation of a dislocation network to the SOI device Si layer. In addition, the buried oxide layer significantly improves the vertical leakage characteristics as the onset of the breakdown is delayed by approximately 400 V. These results show that the GaN on the SOI platform is promising for power electronics applications.

  18. GaN power devices for automotive applications

    NASA Astrophysics Data System (ADS)

    Uesugi, T.; Kachi, Tetsu

    2013-03-01

    GaN is an attractive material for high performance power devices. Vertical GaN power devices are suitable for high current operation, on the other hand, lateral GaN power devices, namely GaN lateral HEMTs have both low on-resistance and low parasitic capacitance. In addition, the GaN lateral HEMTs can be fabricated on Si substrate. We can get low conduction loss and low switching loss devices with low cost. So the GaN lateral HEMTs are suitable for subsystems like an air conditioner and an electric power steering. Serious technical issues about GaN power devices are a normally-off operation, a current collapse, and a high quality gate insulator. Several normally-off operation techniques have been proposed but there is no decisive method. An NH3 surface treatment and a SiO2 passivation are useful to suppress the current collapse. An Al2O3 deposited by ALD is excellent for gate insulator in breakdown and it has enough TDDB reliability under room temperature and 150°C.

  19. Electric field dependence of optical phonon frequencies in wurtzite GaN observed in GaN high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Bagnall, Kevin R.; Dreyer, Cyrus E.; Vanderbilt, David; Wang, Evelyn N.

    2016-10-01

    Due to the high dissipated power densities in gallium nitride (GaN) high electron mobility transistors (HEMTs), temperature measurement techniques with high spatial resolution, such as micro-Raman thermography, are critical for ensuring device reliability. However, accurately determining the temperature rise in the ON state of a transistor from shifts in the Raman peak positions requires careful decoupling of the simultaneous effects of temperature, stress, strain, and electric field on the optical phonon frequencies. Although it is well-known that the vertical electric field in the GaN epilayers can shift the Raman peak positions through the strain and/or stress induced by the inverse piezoelectric (IPE) effect, previous studies have not shown quantitative agreement between the strain and/or stress components derived from micro-Raman measurements and those predicted by electro-mechanical models. We attribute this discrepancy to the fact that previous studies have not considered the impact of the electric field on the optical phonon frequencies of wurtzite GaN apart from the IPE effect, which results from changes in the atomic coordinates within the crystal basis and in the electronic configuration. Using density functional theory, we calculated the zone center E2 (high), A1 (LO), and E2 (low) modes to shift by -1.39 cm-1/(MV/cm), 2.16 cm-1/(MV/cm), and -0.36 cm-1/(MV/cm), respectively, due to an electric field component along the c -axis, which are an order of magnitude larger than the shifts associated with the IPE effect. Then, we measured changes in the E2 (high) and A1 (LO) Raman peak positions with ≈1 μm spatial resolution in GaN HEMTs biased in the pinched OFF state and showed good agreement between the strain, stress, and electric field components derived from the measurements and our 3D electro-mechanical model. This study helps to explain the reason the pinched OFF state is a suitable reference for removing the contributions of the electric field and

  20. High-field transport and terahertz generation in GaN

    NASA Astrophysics Data System (ADS)

    Dyson, A.; Ridley, B. K.

    2008-12-01

    The conduction-band structure of GaN suggests that electron transport at high fields should exhibit a negative differential resistance (NDR) either via the transferred-electron effect or as a consequence of the negative effective mass beyond the inflection point. In order to discuss these possibilities we use a simple model of the band structure and obtain analytical expressions for the density of states and scattering rates due to the interaction with polar-optical phonons. Estimates of the cutoff frequencies for the Gunn effect in GaN and AlN are obtained. The negative-mass NDR is described in terms of a hydrodynamic model and the result is compared with that of Esaki and Tsu [IBM J. Res. Dev. 14, 61 (1970)]. We explore the effect in short diodes of length and transit time on the frequency-dependent NDR associated with quasiballistic motion and conclude with a discussion of transport when the electrons are localized by Bragg reflection.

  1. Crystallography and elasticity of individual GaN nanotubes

    NASA Astrophysics Data System (ADS)

    Liu, Baodan; Bando, Yoshio; Wang, Mingsheng; Tang, Chengchun; Mitome, Masanori; Golberg, Dmitri

    2009-05-01

    High-purity, crystalline [001]-oriented GaN nanotubes with outer diameters of 200 nm or more, rough surfaces and irregular internal channels were synthesized under epitaxial growth on [001]-oriented sapphire substrates. Elastic property measurements on free-standing individual GaN nanotubes, using the in situ transmission electron microscopy (TEM) electromechanical resonance technique, pointed at an average Young's modulus E of 37 GPa and minimum quality factor of 320. These numbers are notably lower than those for previously reported GaN nanowires. The crystallography and chemistry of the GaN nanotubes were analyzed using TEM and energy dispersion x-ray spectroscopy (EDS). It is suggested that the lowered Young's modulus and quality factor of the nanotubes are mainly due to the surface roughness and defectiveness.

  2. New buffer layers for GaN on sapphire by atomic layer and molecular stream epitaxy

    SciTech Connect

    Piner, E.L.; He, Y.W.; Boutros, K.S.; McIntosh, F.G.; Roberts, J.C.; Bedair, S.M.; El-Masry, N.A.

    1996-11-01

    The current approach of depositing a low temperature then annealed AlN or GaN buffer for the growth of GaN on sapphire results in a high dislocation density. These dislocations thread through the GaN layer to the surface. Reducing their density either by growing thicker films or using a strained layer superlattice is ineffective. Two new approaches for AlN/GaN buffer layer growth for GaN on sapphire have been employed: Atomic Layer Epitaxy (ALE) and molecular Stream Epitaxy (MSE). ALE is distinguished by organo-metallic/ammonia separation while MSE is distinguished by cyclic annealing of the growing film. Both ALE and MSE enhance two dimensional growth of single crystal GaN on sapphire. The structural quality of epitaxial GaN grown on these buffer layers was studied by transmission electron microscopy (TEM) and x-ray diffraction (XRD). The initial result for the ALE buffer shows an improved quality GaN film with lower defect densities. The MSE grown buffer layer closely resembles that of conventionally grown MOCVD buffer layers observed by others, with dislocations threading through the GaN epilayer. The effects of these buffer layers on the structural and optical properties of GaN grown on sapphire will be presented.

  3. A Compact Two-Stage 120 W GaN High Power Amplifier for SweepSAR Radar Systems

    NASA Technical Reports Server (NTRS)

    Thrivikraman, Tushar; Horst, Stephen; Price, Douglas; Hoffman, James; Veilleux, Louise

    2014-01-01

    This work presents the design and measured results of a fully integrated switched power two-stage GaN HEMT high-power amplifier (HPA) achieving 60% power-added efficiency at over 120Woutput power. This high-efficiency GaN HEMT HPA is an enabling technology for L-band SweepSAR interferometric instruments that enable frequent repeat intervals and high-resolution imagery. The L-band HPA was designed using space-qualified state-of-the-art GaN HEMT technology. The amplifier exhibits over 34 dB of power gain at 51 dBm of output power across an 80 MHz bandwidth. The HPA is divided into two stages, an 8 W driver stage and 120 W output stage. The amplifier is designed for pulsed operation, with a high-speed DC drain switch operating at the pulsed-repetition interval and settles within 200 ns. In addition to the electrical design, a thermally optimized package was designed, that allows for direct thermal radiation to maintain low-junction temperatures for the GaN parts maximizing long-term reliability. Lastly, real radar waveforms are characterized and analysis of amplitude and phase stability over temperature demonstrate ultra-stable operation over temperature using integrated bias compensation circuitry allowing less than 0.2 dB amplitude variation and 2 deg phase variation over a 70 C range.

  4. Ultrasensitive and Highly Selective Photodetections of UV-A Rays Based on Individual Bicrystalline GaN Nanowire.

    PubMed

    Zhang, Xinglai; Liu, Baodan; Liu, Qingyun; Yang, Wenjin; Xiong, Changmin; Li, Jing; Jiang, Xin

    2017-01-25

    The detection of UV-A rays (wavelength of 320-400 nm) using functional semiconductor nanostructures is of great importance in either fundamental research or technological applications. In this work, we report the catalytic synthesis of peculiar bicrystalline GaN nanowires and their utilization for building high-performance optoelectronic nanodevices. The as-prepared UV-A photodetector based on individual bicrystalline GaN nanowire demonstrates a fast photoresponse time (144 ms), a high wavelength selectivity (UV-A light response only), an ultrahigh photoresponsivity of 1.74 × 10(7) A/W and EQE of 6.08 × 10(9)%, a sensitivity of 2 × 10(4)%, and a very large on/off ratio of more than two orders, as well as robust photocurrent stability (photocurrent fluctuation of less than 7% among 4000 s), showing predominant advantages in comparison with other peer semiconductor photodetectors. The outstanding optoelectronic performance of the bicrystalline GaN nanowire UV-A photodetector is further analyzed based on a detailed high-resolution transmission electron microscope (HRTEM) study, and the two separated crystal domains within the GaN nanowires are believed to provide separated and rapid carrier transfer channels. This work paves a solid way toward the integration of high-performance optoelectronic nanodevices based on bicrystalline or horizontally aligned one-dimensional semiconductor nanostructures.

  5. Cathodoluminescence characterization of suspended GaN nanomembranes

    NASA Astrophysics Data System (ADS)

    Stevens-Kalceff, M. A.; Tiginyanu, I. M.; Popa, V.; Braniste, T.; Brenner, P.

    2013-07-01

    Continuous suspended ˜15 nm thick gallium nitride (GaN) nano-membranes have been investigated using cathodoluminescence microanalysis. The GaN nanomembranes are fabricated by focused ion beam (FIB) pre-treatment of GaN epilayer surfaces followed by photoelectrochemical (PEC) etching. CL microanalysis enables high sensitivity, nanoscale spatial resolution detection of impurities, and defects, and is associated with key features of the suspended GaN nano-membranes. CL spectra and images of the suspended nano-membranes reveal the broad emission band at ˜2.2 eV which is associated with deep acceptor states and the near edge emission at ˜3.4 eV which is associated with free exciton transitions at 295 K. The near edge emission can be resolved into two components, one associated with emission from the nanomembrane and the other associated with CL from underlying GaN transmitted through the nanomembrane. CL spectroscopy gives insight into the physical properties and optical quality of the suspended GaN nano-membranes. Blue shift of the CL near band edge emission indicates that the suspended GaN nanomembranes exhibit the combined effects of quantum confinement and strain.

  6. Semipolar single component GaN on planar high index Si(11h) substrates

    SciTech Connect

    Ravash, Roghaiyeh; Blaesing, Juergen; Dadgar, Armin; Krost, Alois

    2010-10-04

    We present metal organic vapor phase epitaxy growth of polarization reduced, single component GaN on nonpatterned Si(112), Si(113), Si(114), Si(115), and Si(116) substrates. We find that the inclination angle of GaN c-axis with respect to the surface normal depends on the angle between Si(111) and above mentioned Si(11h)-surfaces. The growth of the GaN layer is essentially performed as c-axis oriented growth on the naturally occurring Si(111) facets of these Si(11h)-surfaces. The c-axis tilt-angle of GaN crystallites depends on the Si-surface direction and increases from Si(112) to Si(116) planes. GaN layers are investigated by x-ray analysis and scanning electron microscopy.

  7. High speed visible light communication using blue GaN laser diodes

    NASA Astrophysics Data System (ADS)

    Watson, S.; Viola, S.; Giuliano, G.; Najda, S. P.; Perlin, P.; Suski, T.; Marona, L.; Leszczyński, M.; Wisniewski, P.; Czernecki, R.; Targowski, G.; Watson, M. A.; White, H.; Rowe, D.; Laycock, L.; Kelly, A. E.

    2016-10-01

    GaN-based laser diodes have been developed over the last 20 years making them desirable for many security and defence applications, in particular, free space laser communications. Unlike their LED counterparts, laser diodes are not limited by their carrier lifetime which makes them attractive for high speed communication, whether in free space, through fiber or underwater. Gigabit data transmission can be achieved in free space by modulating the visible light from the laser with a pseudo-random bit sequence (PRBS), with recent results approaching 5 Gbit/s error free data transmission. By exploiting the low-loss in the blue part of the spectrum through water, data transmission experiments have also been conducted to show rates of 2.5 Gbit/s underwater. Different water types have been tested to monitor the effect of scattering and to see how this affects the overall transmission rate and distance. This is of great interest for communication with unmanned underwater vehicles (UUV) as the current method using acoustics is much slower and vulnerable to interception. These types of laser diodes can typically reach 50-100 mW of power which increases the length at which the data can be transmitted. This distance could be further improved by making use of high power laser arrays. Highly uniform GaN substrates with low defectivity allow individually addressable laser bars to be fabricated. This could ultimately increase optical power levels to 4 W for a 20-emitter array. Overall, the development of GaN laser diodes will play an important part in free space optical communications and will be vital in the advancement of security and defence applications.

  8. DC and High-Frequency Characteristics of GaN Schottky Varactors for Frequency Multiplication

    NASA Astrophysics Data System (ADS)

    Jin, Chong; Pavlidis, Dimitris; Considine, Laurence

    The design, fabrication and characterization of GaN based varactor diodes are presented. MOCVD was used for layer growth and the DC characteristic of 4µm diameter diodes showed a turn-on voltage of 0.5V, a breakdown voltage of 21V and a modulation ratio of 1.63. High frequency characterization allowed obtaining the diode equivalent circuit and observed the bias dependence of the series resistance. The diode cutoff frequency was 900GHz. A large-signal model was developed for the diode and the device power performance was evaluated. A power of 7.2dBm with an efficiency of 16.6% was predicted for 47GHz to 94GHz doubling.

  9. Characterizations of GaN film growth by ECR plasma chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Fu, Silie; Chen, Junfang; Zhang, Hongbin; Guo, Chaofen; Li, Wei; Zhao, Wenfen

    2009-06-01

    The electron cyclotron resonance plasma-enhanced metalorganic chemical vapor deposition technology (ECR-MOPECVD) is adopted to grow GaN films on (0 0 0 1) α-Al2O3 substrate. The gas sources are pure N2 and trimethylgallium (TMG). Optical emission spectroscopy (OES) and thermodynamic analysis of GaN growth are applied to understand the GaN growth process. The OES of ECR plasma shows that TMG is significantly dissociated in ECR plasma. Reactants N and Ga in the plasma, obtained easily under the self-heating condition, are essential for the GaN growth. They contribute to the realization of GaN film growth at a relatively low temperature. The thermodynamic study shows that the driving force for the GaN growth is high when N2:TMG>1. Furthermore, higher N2:TMG flow ratio makes the GaN growth easier. Finally, X-ray diffraction, photoluminescence, and atomic force microscope are applied to investigate crystal quality, morphology, and roughness of the GaN films. The results demonstrate that the ECR-MOPECVD technology is favorable for depositing GaN films at low temperatures.

  10. Preparation and characterization of one-dimensional GaN nanorods with Tb intermediate layer

    SciTech Connect

    Shi, Feng; Xue, Chengshan

    2012-12-15

    Graphical abstract: Display Omitted Highlights: ► GaN nanorods have been prepared on Si substrates by magnetron sputtering. ► GaN nanorods are single crystal with hexagonal wurtzite structure. ► GaN nanorods are high-quality crystalline after ammoniating at 950 °C for 15 min. ► Ammoniating temperatures and times affect the growth of GaN nanorods significantly. -- Abstract: GaN nanorods have been successfully prepared on Si(1 1 1) substrates by magnetron sputtering through ammoniating Ga{sub 2}O{sub 3}/Tb thin films. X-ray diffraction (XRD), X-ray photoelectron spectroscope (XPS), FT-IR spectrophotometer, scanning electron microscope (SEM), high-resolution transmission electron microscope (HRTEM), and photoluminescence (PL) spectroscopy were used to characterize the microstructures, morphologies compositions and optical properties of the GaN samples. The results demonstrate that the nanorods are single crystal GaN with hexagonal wurtzite structure and high-quality crystalline after ammoniating at 950 °C for 15 min, which have the size of 100–150 nm in diameter. Ammoniating temperatures and times affect the growth of GaN nanorods significantly. The growth procedure mainly follows the Tb catalyst-assisted VLS mechanism.

  11. Improvement in crystal quality and optical properties of n-type GaN employing nano-scale SiO2 patterned n-type GaN substrate.

    PubMed

    Jo, Min Sung; Sadasivam, Karthikeyan Giri; Tawfik, Wael Z; Yang, Seung Bea; Lee, Jung Ju; Ha, Jun Seok; Moon, Young Boo; Ryu, Sang Wan; Lee, June Key

    2013-01-01

    n-type GaN epitaxial layers were regrown on the patterned n-type GaN substrate (PNS) with different size of silicon dioxide (SiO2) nano dots to improve the crystal quality and optical properties. PNS with SiO2 nano dots promotes epitaxial lateral overgrowth (ELOG) for defect reduction and also acts as a light scattering point. Transmission electron microscopy (TEM) analysis suggested that PNS with SiO2 nano dots have superior crystalline properties. Hall measurements indicated that incrementing values in electron mobility were clear indication of reduction in threading dislocation and it was confirmed by TEM analysis. Photoluminescence (PL) intensity was enhanced by 2.0 times and 3.1 times for 1-step and 2-step PNS, respectively.

  12. Scalable preparation and characterization of GaN nanopowders with high crystallinity by soluble salts-assisted route

    NASA Astrophysics Data System (ADS)

    Lv, Yingying; Yu, Leshu; Ai, Wenwen; Li, Chungen

    2014-11-01

    By using Na3PO4 as a dispersant, soluble salt-assisted route has been further developed to prepare high-crystalline GaN nanoparticles powder on a large scale through the direct nitridation of Ga-Na3PO4 mixture at 750-950 °C and followed by washing with water. The systematical characterizations including XRD, Raman, IR, TEM, XPS, and PL spectrum showed that the as-prepared nanopowders were composed of nanoparticles in diameters of 8-18 nm, hexagonal phase, pure GaN, and had a broad UV centered at 388 nm and blue emissions band centered at around 547 nm. Because of the utilization of the simple reaction between metallic Ga and NH3, the preparation of pure GaN nanopowders becomes very easy, economical, and scalable, suggesting broad application in optoelectronic device material. The interesting results indicate the wide range of soluble salt-assisted route for promising industrial production of GaN nanopowders.

  13. Influence of highly-charged 209Bi33+ irradiation on structure and optoelectric characteristics of GaN epilayer

    NASA Astrophysics Data System (ADS)

    Zhang, L. Q.; Zhang, C. H.; Xu, C. L.; Li, J. J.; Yang, Y. T.; Ma, Y. Z.; Li, J. Y.; Liu, H. P.; Ding, Z. N.; Yan, T. X.; Song, Y.

    2017-09-01

    The microstructure and optoelectric properties of GaN epilayer irradiated by highly-charged 209Bi33+ to different fluences are investigated by means of atomic force microscopy, X-ray photoelectron spectroscopy, Raman scattering spectroscopy and photoluminescence spectroscopy. After Bi33+ irradiation, AFM observation shows the irradiated GaN surface is a swelling and swelling rate nonlinearly increases with increasing ions fluence. XPS analysis reveals the relative content of Ga-N bond reduces and Ga-O, Ga-Ga bonds have been produced as the fluence increases. Raman scattering spectra display the thickness of surface depletion layer increases, free carrier concentration and its mobility decrease generally with an increase in ions fluence. Furthermore, the length of Ga-N bond shortens and lattices experience compressive stress with increasing ions fluence are observed from Raman spectra. Room temperature PL spectra reflect the intensity of yellow luminescence (YL) emission increases and its peak has a blueshift after 1.061 × 1012 Bi33+/cm2 irradiation. Moreover, as the temperature rises, the thermal quenching of YL occurs and its peak position first exhibits a blueshift and then a redshift. Results may be served as a useful reference for HCI to be used in semiconductor fields.

  14. Switching performance and efficiency investigation of GaN based DC-DC Buck converter for low voltage and high current applications

    NASA Astrophysics Data System (ADS)

    Alatawi, Khaled; Almasoudi, Fahad; Matin, Mohammad

    2016-09-01

    The Wide band-gap (WBG) materials "such as Silicon Carbide (SiC) and Gallium nitride (GaN)" based power switching devices provide higher performance capabilities compared to Si-based power switching devices. The wide band-gap materials based power switching devices outperform Si-based devices in many performance characteristics such as: low witching loss, low conduction loss, high switching frequencies, and high operation temperature. GaN based switching devices benefit a lot of applications such as: future electric vehicles and solar power inverters. In this paper, a DC-DC Buck converter based on GaN FET for low voltage and high current applications is designed and investigated. The converter is designed for stepping down a voltage of 48V to 12V with high switching frequency. The capability of the GaN FET based buck converter is studied and compared to equivalent SiC MOSFET and Si-based MOSFET buck converters. The analysis of switching losses and efficiency was performed to compare the performance capabilities of GaN FET, SiC MOSFET and Si-based MOSFET. The results showed that the overall switching losses of GaN FET are lower than that of SiC and Si-based power switching devices. Also, the performance capability of GaN devices with higher frequencies is studied. GaN devices with high frequencies will reduce the total size and the cost of the power converter. In Addition, the overall efficiency of the DC-DC Buck converter is higher with the GaN FET switching devices, which make it more suitable for low voltage and high current applications.

  15. Ultrahigh Si{sup +} implant activation efficiency in GaN using a high-temperature rapid thermal process system

    SciTech Connect

    Cao, X.A.; Abernathy, C.R.; Singh, R.K.; Pearton, S.J.; Fu, M.; Sarvepalli, V.; Sekhar, J.A.; Zolper, J.C.; Rieger, D.J.; Han, J.; Drummond, T.J.; Shul, R.J.; Wilson, R.G.

    1998-07-01

    Si{sup +} implant activation efficiencies above 90{percent}, even at doses of 5{times}10{sup 15}thinspcm{sup {minus}2}, have been achieved in GaN by rapid thermal processing at 1400{endash}1500thinsp{degree}C for 10 s. The annealing system utilizes molybdenum intermetallic heating elements capable of operation up to 1900thinsp{degree}C, producing high heating and cooling rates (up to 100thinsp{degree}Cthinsps{sup {minus}1}). Unencapsulated GaN shows severe surface pitting at 1300thinsp{degree}C and complete loss of the film by evaporation at 1400thinsp{degree}C. Dissociation of nitrogen from the surface is found to occur with an approximate activation energy of 3.8 eV for GaN (compared to 4.4 eV for AlN and 3.4 eV for InN). Encapsulation with either rf magnetron reactively sputtered or metal organic molecular beam epitaxy-grown AlN thin films provides protection against GaN surface degradation up to 1400thinsp{degree}C, where peak electron concentrations of {approximately}5{times}10{sup 20}thinspcm{sup {minus}3} can be achieved in Si-implanted GaN. Secondary ion mass spectrometry profiling showed little measurable redistribution of Si, suggesting D{sub Si}{le}10{sup {minus}13}thinspcm{sup 2}thinsps{sup {minus}1} at 1400thinsp{degree}C. The implant activation efficiency decreases at higher temperatures, which may result from Si{sub Ga} to Si{sub N} site switching and resultant self-compensation. {copyright} {ital 1998 American Institute of Physics.}

  16. Epitaxial growth of GaN by radical-enhanced metalorganic chemical vapor deposition (REMOCVD) in the downflow of a very high frequency (VHF) N2/H2 excited plasma - effect of TMG flow rate and VHF power

    NASA Astrophysics Data System (ADS)

    Lu, Yi; Kondo, Hiroki; Ishikawa, Kenji; Oda, Osamu; Takeda, Keigo; Sekine, Makoto; Amano, Hiroshi; Hori, Masaru

    2014-04-01

    Gallium nitride (GaN) films have been grown by using our newly developed Radical-Enhanced Metalorganic Chemical Vapor Deposition (REMOCVD) system. This system has three features: (1) application of very high frequency (60 MHz) power in order to increase the plasma density, (2) introduction of H2 gas together with N2 gas in the plasma discharge region to generate not only nitrogen radicals but also active NHx molecules, and (3) radical supply under remote plasma arrangement with suppression of charged ions and photons by employing a Faraday cage. Using this new system, we have studied the effect of the trimethylgallium (TMG) source flow rate and of the plasma generation power on the GaN crystal quality by using scanning electron microscopy (SEM) and double crystal X-ray diffraction (XRD). We found that this REMOCVD allowed the growth of epitaxial GaN films of the wurtzite structure of (0001) orientation on sapphire substrates with a high growth rate of 0.42 μm/h at a low temperature of 800 °C. The present REMOCVD is a promising method for GaN growth at relatively low temperature and without using costly ammonia gas.

  17. MBE and ALD grown High k Dielectrics Gate Stacks on GaN

    NASA Astrophysics Data System (ADS)

    Chang, Y. C.; Lee, K. Y.; Lee, W. C.; Lin, T. D.; Lee, Y. J.; Huang, M. L.; Hong, M.; Kwo, J.; Wang, Y. H.

    2007-03-01

    III-nitride compound semiconductors are attractive for high-temperature and high-power MOSFET applications due to their intrinsic properties of wide band gap, high breakdown field, and high saturation velocity under high fields. In this work GaN-based high k MOS diodes were fabricated using MBE-grown Ga2O3(Gd2O3), MBE-grown HfO2 and ALD-grown HfO2 as the gate dielectrics with dielectric constants of 14.7, 17.4 and 16.5, respectively. All MOS diodes exhibited low leakage (<10-6 A/cm^2 at Vfb+1) and well behaved capacitance-voltage curves with a low interfacial density of states of ˜10^11 cm-2eV-1. Energy-band diagrams of the MOS structures have been determined by extracting valance-band offset (δEV) from HR-XPS and with the bandgaps of the oxides. For example, the ALD-grown HfO2-GaN at the interfaces gave approximately δEC and δEV of 1.2 eV and 1.1 eV, respectively.

  18. Gate stack engineering for GaN lateral power transistors

    NASA Astrophysics Data System (ADS)

    Yang, Shu; Liu, Shenghou; Liu, Cheng; Hua, Mengyuan; Chen, Kevin J.

    2016-02-01

    Developing optimal gate-stack technology is a key to enhancing the reliability and performance of GaN insulated-gate devices for high-voltage power switching applications. In this paper, we discuss current challenges and review our recent progresses in gate-stack technology development toward high-performance and high-reliability GaN power devices, including (1) interface engineering that creates a high-quality dielectric/III-nitride interface with low trap density; (2) barrier-layer engineering that enables optimal trade-off between performance and stability; (3) bulk quality and reliability enhancement of the gate dielectric. These gate-stack techniques in terms of new process development and device structure design are valuable to realize highly reliable and competitive GaN power devices.

  19. High active nitrogen flux growth of GaN by plasma assisted molecular beam epitaxy

    SciTech Connect

    McSkimming, Brian M. Speck, James S.; Chaix, Catherine

    2015-09-15

    In the present study, the authors report on a modified Riber radio frequency (RF) nitrogen plasma source that provides active nitrogen fluxes more than 30 times higher than those commonly used for plasma assisted molecular beam epitaxy (PAMBE) growth of gallium nitride (GaN) and thus a significantly higher growth rate than has been previously reported. GaN films were grown using N{sub 2} gas flow rates between 5 and 25 sccm while varying the plasma source's RF forward power from 200 to 600 W. The highest growth rate, and therefore the highest active nitrogen flux, achieved was ∼7.6 μm/h. For optimized growth conditions, the surfaces displayed a clear step-terrace structure with an average RMS roughness (3 × 3 μm) on the order of 1 nm. Secondary ion mass spectroscopy impurity analysis demonstrates oxygen and hydrogen incorporation of 1 × 10{sup 16} and ∼5 × 10{sup 17}, respectively. In addition, the authors have achieved PAMBE growth of GaN at a substrate temperature more than 150 °C greater than our standard Ga rich GaN growth regime and ∼100 °C greater than any previously reported PAMBE growth of GaN. This growth temperature corresponds to GaN decomposition in vacuum of more than 20 nm/min; a regime previously unattainable with conventional nitrogen plasma sources. Arrhenius analysis of the decomposition rate shows that samples with a flux ratio below stoichiometry have an activation energy greater than decomposition of GaN in vacuum while samples grown at or above stoichiometry have decreased activation energy. The activation energy of decomposition for GaN in vacuum was previously determined to be ∼3.1 eV. For a Ga/N flux ratio of ∼1.5, this activation energy was found to be ∼2.8 eV, while for a Ga/N flux ratio of ∼0.5, it was found to be ∼7.9 eV.

  20. The investigation of stress in freestanding GaN crystals grown from Si substrates by HVPE.

    PubMed

    Lee, Moonsang; Mikulik, Dmitry; Yang, Mino; Park, Sungsoo

    2017-08-17

    We investigate the stress evolution of 400 µm-thick freestanding GaN crystals grown from Si substrates by hydride vapour phase epitaxy (HVPE) and the in situ removal of Si substrates. The stress generated in growing GaN can be tuned by varying the thickness of the MOCVD AlGaN/AlN buffer layers. Micro Raman analysis shows the presence of slight tensile stress in the freestanding GaN crystals and no stress accumulation in HVPE GaN layers during the growth. Additionally, it is demonstrated that the residual tensile stress in HVPE GaN is caused only by elastic stress arising from the crystal quality difference between Ga- and N-face GaN. TEM analysis revealed that the dislocations in freestanding GaN crystals have high inclination angles that are attributed to the stress relaxation of the crystals. We believe that the understanding and characterization on the structural properties of the freestanding GaN crystals will help us to use these crystals for high-performance opto-electronic devices.

  1. Nuclear microprobe investigation of the effects of ionization and displacement damage in vertical, high voltage GaN diodes

    NASA Astrophysics Data System (ADS)

    Vizkelethy, G.; King, M. P.; Aktas, O.; Kizilyalli, I. C.; Kaplar, R. J.

    2017-08-01

    Radiation responses of high-voltage, vertical gallium-nitride (GaN) diodes were investigated using Sandia National Laboratories' nuclear microprobe. Effects of the ionization and the displacement damage were studied using various ion beams. We found that the devices show avalanche effect for heavy ions operated under bias well below the breakdown voltage. The displacement damage experiments showed a surprising effect for moderate damage: the charge collection efficiency demonstrated an increase instead of a decrease for higher bias voltages.

  2. Nuclear microprobe investigation of the effects of ionization and displacement damage in vertical, high voltage GaN diodes

    DOE PAGES

    Vizkelethy, G.; King, M. P.; Aktas, O.; ...

    2016-12-02

    Radiation responses of high-voltage, vertical gallium-nitride (GaN) diodes were investigated using Sandia National Laboratories’ nuclear microprobe. Effects of the ionization and the displacement damage were studied using various ion beams. We found that the devices show avalanche effect for heavy ions operated under bias well below the breakdown voltage. Here, the displacement damage experiments showed a surprising effect for moderate damage: the charge collection efficiency demonstrated an increase instead of a decrease for higher bias voltages.

  3. High-power GaN diode-pumped continuous wave Pr3+-doped LiYF4 laser.

    PubMed

    Hashimoto, Kohei; Kannari, Fumihiko

    2007-09-01

    A cw Pr(3+):LiYF(4) laser at 639 nm pumped by a high-power GaN laser diode (444 nm) is demonstrated. The highest laser power of 112 mW is achieved with an optical-optical conversion efficiency of 33.5%. Characteristics of this laser at elevated temperatures are also investigated for practical applications such as a laser projector.

  4. Bulk ammonothermal GaN

    NASA Astrophysics Data System (ADS)

    Dwiliński, R.; Doradziński, R.; Garczyński, J.; Sierzputowski, L. P.; Puchalski, A.; Kanbara, Y.; Yagi, K.; Minakuchi, H.; Hayashi, H.

    2009-05-01

    In this work, results of structural characterization of high-quality ammonothermal GaN are presented. Besides expected low dislocation density (being of the order of 10 3 cm -2) the most interesting feature seems perfect flatness of the crystal lattice of studied crystals. Regardless the size of crystals, lattice curvature radius exceeds 100 m, whereas better crystals reveal radius of several hundred meters and the best above 1000 m. Excellent crystallinity manifests in very narrow X-ray diffraction peaks of full-width at half-maximum (FWHM) values about 16 arcsec.

  5. Transistors for Electric Motor Drives: High-Performance GaN HEMT Modules for Agile Power Electronics

    SciTech Connect

    2010-09-01

    ADEPT Project: Transphorm is developing transistors with gallium nitride (GaN) semiconductors that could be used to make cost-effective, high-performance power converters for a variety of applications, including electric motor drives which transmit power to a motor. A transistor acts like a switch, controlling the electrical energy that flows around an electrical circuit. Most transistors today use low-cost silicon semiconductors to conduct electrical energy, but silicon transistors don’t operate efficiently at high speeds and voltage levels. Transphorm is using GaN as a semiconductor material in its transistors because GaN performs better at higher voltages and frequencies, and it is more energy efficient than straight silicon. However, Transphorm is using inexpensive silicon as a base to help keep costs low. The company is also packaging its transistors with other electrical components that can operate quickly and efficiently at high power levels—increasing the overall efficiency of both the transistor and the entire motor drive.

  6. Growth kinetics and electronic properties of unintentionally doped semi-insulating GaN on SiC and high-resistivity GaN on sapphire grown by ammonia molecular-beam epitaxy

    NASA Astrophysics Data System (ADS)

    Tang, H.; Fang, Z. Q.; Rolfe, S.; Bardwell, J. A.; Raymond, S.

    2010-05-01

    Growth of unintentionally doped (UID) semi-insulating GaN on SiC and highly resistive GaN on sapphire using the ammonia molecular-beam epitaxy technique is reported. The semi-insulating UID GaN on SiC shows room temperature (RT) resistivity of 1011 Ω cm and well defined activation energy of 1.0 eV. The balance of compensation of unintentional donors and acceptors is such that the Fermi level is lowered to midgap, and controlled by a 1.0 eV deep level defect, which is thought to be related to the nitrogen antisite NGa, similar to the "EL2" center (arsenic antisite) in unintentionally doped semi-insulating GaAs. The highly resistive GaN on sapphire shows RT resistivity in range of 106-109 Ω cm and activation energy varying from 0.25 to 0.9 eV. In this case, the compensation of shallow donors is incomplete, and the Fermi level is controlled by levels shallower than the 1.0 eV deep centers. The growth mechanisms for the resistive UID GaN materials were investigated by experimental studies of the surface kinetics during growth. The required growth regime involves a moderate growth temperature range of 740-780 °C, and a high ammonia flux (beam equivalent pressure of 1×10-4 Torr), which ensures supersaturated coverage of surface adsorption sites with NHx radicals. Such highly nitrogen rich growth conditions lead to two-dimensional layer by layer growth and reduced oxygen incorporation.

  7. Growth kinetics and electronic properties of unintentionally doped semi-insulating GaN on SiC and high-resistivity GaN on sapphire grown by ammonia molecular-beam epitaxy

    SciTech Connect

    Tang, H.; Rolfe, S.; Bardwell, J. A.; Raymond, S.; Fang, Z. Q.

    2010-05-15

    Growth of unintentionally doped (UID) semi-insulating GaN on SiC and highly resistive GaN on sapphire using the ammonia molecular-beam epitaxy technique is reported. The semi-insulating UID GaN on SiC shows room temperature (RT) resistivity of 10{sup 11} {Omega} cm and well defined activation energy of 1.0 eV. The balance of compensation of unintentional donors and acceptors is such that the Fermi level is lowered to midgap, and controlled by a 1.0 eV deep level defect, which is thought to be related to the nitrogen antisite N{sub Ga}, similar to the ''EL2'' center (arsenic antisite) in unintentionally doped semi-insulating GaAs. The highly resistive GaN on sapphire shows RT resistivity in range of 10{sup 6}-10{sup 9} {Omega} cm and activation energy varying from 0.25 to 0.9 eV. In this case, the compensation of shallow donors is incomplete, and the Fermi level is controlled by levels shallower than the 1.0 eV deep centers. The growth mechanisms for the resistive UID GaN materials were investigated by experimental studies of the surface kinetics during growth. The required growth regime involves a moderate growth temperature range of 740-780 deg. C, and a high ammonia flux (beam equivalent pressure of 1x10{sup -4} Torr), which ensures supersaturated coverage of surface adsorption sites with NH{sub x} radicals. Such highly nitrogen rich growth conditions lead to two-dimensional layer by layer growth and reduced oxygen incorporation.

  8. Effect of the Ammonia Flow on the Formation of Microstructure Defects in GaN Layers Grown by High-Temperature Vapor Phase Epitaxy

    NASA Astrophysics Data System (ADS)

    Barchuk, M.; Lukin, G.; Zimmermann, F.; Röder, C.; Motylenko, M.; Pätzold, O.; Heitmann, J.; Kortus, J.; Rafaja, D.

    2016-12-01

    High-temperature vapor phase epitaxy (HTVPE) is a physical vapor transport technology for a deposition of gallium nitride (GaN) layers. However, little is known about the influence of the deposition parameters on the microstructure of the layers. In order to fill this gap, the influence of the ammonia (NH3) flow applied during the HTVPE growth on the microstructure of the deposited GaN layers is investigated in this work. Although the HTVPE technology is intended to grow GaN layers on foreign substrates, the GaN layers under study were grown on GaN templates produced by metal organic vapor phase epitaxy in order to be able to separate the growth defects from the defects induced by the lattice misfit between the foreign substrate and the GaN layer. The microstructure of the layers is characterized by means of high-resolution x-ray diffraction (XRD), transmission electron microscopy and photoluminescence. In samples deposited at low ammonia flow, planar defects were detected, along which the nitrogen atoms are found to be substituted by impurity atoms. The interplay between these planar defects and the threading dislocations is discussed. A combination of XRD and micro-Raman spectroscopy reveals the presence of compressive residual stress in the samples.

  9. Effect of the Ammonia Flow on the Formation of Microstructure Defects in GaN Layers Grown by High-Temperature Vapor Phase Epitaxy

    NASA Astrophysics Data System (ADS)

    Barchuk, M.; Lukin, G.; Zimmermann, F.; Röder, C.; Motylenko, M.; Pätzold, O.; Heitmann, J.; Kortus, J.; Rafaja, D.

    2017-03-01

    High-temperature vapor phase epitaxy (HTVPE) is a physical vapor transport technology for a deposition of gallium nitride (GaN) layers. However, little is known about the influence of the deposition parameters on the microstructure of the layers. In order to fill this gap, the influence of the ammonia (NH3) flow applied during the HTVPE growth on the microstructure of the deposited GaN layers is investigated in this work. Although the HTVPE technology is intended to grow GaN layers on foreign substrates, the GaN layers under study were grown on GaN templates produced by metal organic vapor phase epitaxy in order to be able to separate the growth defects from the defects induced by the lattice misfit between the foreign substrate and the GaN layer. The microstructure of the layers is characterized by means of high-resolution x-ray diffraction (XRD), transmission electron microscopy and photoluminescence. In samples deposited at low ammonia flow, planar defects were detected, along which the nitrogen atoms are found to be substituted by impurity atoms. The interplay between these planar defects and the threading dislocations is discussed. A combination of XRD and micro-Raman spectroscopy reveals the presence of compressive residual stress in the samples.

  10. Structural, optical, and magnetic properties of highly-resistive Sm-implanted GaN thin films

    SciTech Connect

    Lo, Fang-Yuh Huang, Cheng-De; Chou, Kai-Chieh; Guo, Jhong-Yu; Liu, Hsiang-Lin; Chia, Chi-Ta; Ney, Verena; Ney, Andreas; Shvarkov, Stepan; Reuter, Dirk; Wieck, Andreas D.; Pezzagna, Sébastien; Chern, Ming-Yau; Massies, Jean

    2014-07-28

    Samarium ions of 200 keV in energy were implanted into highly-resistive molecular-beam-epitaxy grown GaN thin films with a focused-ion-beam implanter at room temperature. The implantation doses range from 1 × 10{sup 14} to 1 × 10{sup 16 }cm{sup −2}. Structural properties studied by x-ray diffraction and Raman-scattering spectroscopy revealed Sm incorporation into GaN matrix without secondary phase. The optical measurements showed that the band gap and optical constants changed very slightly by the implantation. Photoluminescence measurements showed emission spectra similar to p-type GaN for all samples. Magnetic investigations with a superconducting quantum interference device identified magnetic ordering for Sm dose of and above 1 × 10{sup 15 }cm{sup −2} before thermal annealing, while ferromagnetism was only observed after thermal annealing from the sample with highest Sm dose. The long-range magnetic ordering can be attributed to interaction of Sm ions through the implantation-induced Ga vacancy.

  11. Role of sapphire nitridation temperature on GaN growth by plasma assisted molecular beam epitaxy: Part II. Interplay between chemistry and structure of layers

    NASA Astrophysics Data System (ADS)

    Losurdo, Maria; Capezzuto, Pio; Bruno, Giovanni; Namkoong, Gon; Doolittle, W. Alan; Brown, April S.

    2002-02-01

    The effect of sapphire nitridation temperature on the chemistry and microstructure of the sapphire substrate/GaN interface, nucleation layer, and of the GaN epilayers grown by rf plasma assisted molecular beam epitaxy is investigated. It is found that a sapphire nitridation temperature as low as 200 °C improves the structural and optical quality of GaN epilayers. This result can be explained by the chemistry of the sapphire nitridation process, which is discussed in the framework of a model considering the competitive formation of AlN and oxynitride (NO). In particular, at 200 °C, NO desorbs from the sapphire surface, yielding an homogeneous 6 Å AlN layer upon N2 plasma nitridation. This low temperature AlN template favors the nucleation of hexagonal GaN nuclei which coalesce completely resulting in a hexagonal GaN buffer layer that homogeneously covers the sapphire substrate. This condition promotes the growth of a high quality GaN epilayer. In contrast, high nitridation temperatures result in a mixed AlN/NO nitrided sapphire surface which induce a perturbed and more defected interface with the occurrence of cubic crystallites in the GaN buffer. A sapphire surface with random GaN islands is found upon annealing of the GaN buffer and this condition results in a low-quality GaN epilayer.

  12. Study of GaN nanowires converted from β-Ga2O3 and photoconduction in a single nanowire

    NASA Astrophysics Data System (ADS)

    Kumar, Mukesh; Kumar, Sudheer; Chauhan, Neha; Sakthi Kumar, D.; Kumar, Vikram; Singh, R.

    2017-08-01

    The formation of GaN nanowires from β-Ga2O3 nanowires and photoconduction in a fabricated single GaN nanowire device has been studied. Wurtzite phase GaN were formed from monoclinic β-Ga2O3 nanowires with or without catalyst particles at their tips. The formation of faceted nanostructures from catalyst droplets presented on a nanowire tip has been discussed. The nucleation of GaN phases in β-Ga2O3 nanowires and their subsequent growth due to interfacial strain energy has been examined using a high resolution transmission electron microscope. The high quality of the converted GaN nanowire is confirmed by fabricating single nanowire photoconducting devices which showed ultra high responsivity under ultra-violet illumination.

  13. Transmission electron microscopy of electrospun GaN nanofibers

    NASA Astrophysics Data System (ADS)

    Robles-García, Joshua L.; Meléndez, Anamaris; Yates, Douglas; Santiago-Avilés, Jorge J.; Ramos, Idalia; Campo, Eva M.

    2011-06-01

    We have reported earlier progress in producing polycrystalline wurtzite-polymorph and photo-conductive GaN nanofibers by electrospinning. This paper shows grain stacking during heat treatment and suggests the need to understand nucleation and grain growth following electrospinning. Transmission Electron Microscopy (TEM) analysis of GaN shows brittle fibers, grain stacking, and unfinished grain nucleation. X-Ray Diffraction analysis confirmed dominant hexagonal 101-wurtzite preferential overall orientation and the incipient grains are of high crystalline quality as seen by high resolution TEM.

  14. Crystallographically tilted and partially strain relaxed GaN grown on inclined {111} facets etched on Si(100) substrate

    NASA Astrophysics Data System (ADS)

    Ansah Antwi, K. K.; Soh, C. B.; Wee, Q.; Tan, Rayson J. N.; Yang, P.; Tan, H. R.; Sun, L. F.; Shen, Z. X.; Chua, S. J.

    2013-12-01

    High resolution X-ray diffractometry (HR-XRD), Photoluminescence, Raman spectroscopy, and Transmission electron microscope measurements are reported for GaN deposited on a conventional Si(111) substrate and on the {111} facets etched on a Si(100) substrate. HR-XRD reciprocal space mappings showed that the GaN(0002) plane is tilted by about 0.63° ± 0.02° away from the exposed Si{111} growth surface for GaN deposited on the patterned Si(100) substrate, while no observable tilt existed between the GaN(0002) and Si(111) planes for GaN deposited on the conventional Si(111) substrate. The ratio of integrated intensities of the yellow to near band edge (NBE) luminescence (IYL/INBE) was determined to be about one order of magnitude lower in the case of GaN deposited on the patterned Si(100) substrate compared with GaN deposited on the conventional Si(111) substrate. The Raman E2(high) optical phonon mode at 565.224 ± 0.001 cm-1 with a narrow full width at half maximum of 1.526 ± 0.002 cm-1 was measured, for GaN deposited on the patterned Si(100) indicating high material quality. GaN deposition within the trench etched on the Si(100) substrate occurred via diffusion and mass-transport limited mechanism. This resulted in a differential GaN layer thickness from the top (i.e., 1.8 μm) of the trench to the bottom (i.e., 0.3 μm) of the trench. Mixed-type dislocation constituted about 80% of the total dislocations in the GaN grown on the inclined Si{111} surface etched on Si(100).

  15. Crystallographically tilted and partially strain relaxed GaN grown on inclined (111) facets etched on Si(100) substrate

    SciTech Connect

    Ansah Antwi, K. K.; Soh, C. B.; Wee, Q.; Tan, Rayson J. N.; Tan, H. R.; Yang, P.; Sun, L. F.; Shen, Z. X.; Chua, S. J.

    2013-12-28

    High resolution X-ray diffractometry (HR-XRD), Photoluminescence, Raman spectroscopy, and Transmission electron microscope measurements are reported for GaN deposited on a conventional Si(111) substrate and on the (111) facets etched on a Si(100) substrate. HR-XRD reciprocal space mappings showed that the GaN(0002) plane is tilted by about 0.63° ± 0.02° away from the exposed Si(111) growth surface for GaN deposited on the patterned Si(100) substrate, while no observable tilt existed between the GaN(0002) and Si(111) planes for GaN deposited on the conventional Si(111) substrate. The ratio of integrated intensities of the yellow to near band edge (NBE) luminescence (I{sub YL}/I{sub NBE}) was determined to be about one order of magnitude lower in the case of GaN deposited on the patterned Si(100) substrate compared with GaN deposited on the conventional Si(111) substrate. The Raman E{sub 2}(high) optical phonon mode at 565.224 ± 0.001 cm{sup −1} with a narrow full width at half maximum of 1.526 ± 0.002 cm{sup −1} was measured, for GaN deposited on the patterned Si(100) indicating high material quality. GaN deposition within the trench etched on the Si(100) substrate occurred via diffusion and mass-transport limited mechanism. This resulted in a differential GaN layer thickness from the top (i.e., 1.8 μm) of the trench to the bottom (i.e., 0.3 μm) of the trench. Mixed-type dislocation constituted about 80% of the total dislocations in the GaN grown on the inclined Si(111) surface etched on Si(100)

  16. MOCVD growth of GaN on Si through novel substrate modification techniques

    NASA Astrophysics Data System (ADS)

    Gagnon, Jarod C.

    GaN is a semiconductor material with great potential for use in high power electronics and optoelectronics due to the high electron mobility, high breakdown voltage, high thermal stability, and large direct bandgap of GaN. Si is a desirable substrate material for GaN heteroepitaxy due to the low cost of production, large wafer sizes available, and current widespread use in the electronics industry. The growth of GaN/Si devices suffers from the lattice and CTE mismatches between GaN and Si and therefore multiple methods of strain reduction have been employed to counter these effects. In this work we presented two novel methods of substrate modification to promote the growth of device quality GaN on Si. Initial work focused on the implantation of AlN/Si(111) substrates with N+ ions below the AlN/Si(111) interface. A reduction in the initial compressive stress in GaN films as well as the degree of tensile stress generation during growth was observed on implanted samples. Optical microscopy of the GaN surfaces showed reduced channeling crack density on implanted substrates. Transmission electron microscopy (TEM) studies showed a disordered layer in the Si substrate at the implantation depth which consisted of a mixture of polycrystalline and amorphous Si. Evidence was provided to suggest that the disordered layer at the implantation depth was acting as a compliant layer which decoupled the GaN film from the bulk Si substrate and partially accommodated the tensile stress formed during growth and cooling. A reduction in threading dislocation (TD) density on ion implanted substrates was also observed. Additional studies showed that by increasing the lateral size of AlN islands, the tensile growth stress and TD density in GaN films on ion implanted substrates could be further reduced. XRD studies showed an expansion of the AlN lattice on implanted substrates with larger lateral island sizes. The final tensile growth stress of films on implanted substrates was further

  17. Abnormal variation of the growth rate under high NH3 injected regime in the growth of GaN by NH3-source MBE

    NASA Astrophysics Data System (ADS)

    Choi, Sungkuk; Jung, Soohoon; Cho, Youngji; Lee, Sangtae; Chang, Jiho

    2017-03-01

    Unusual growth-rate variation during GaN formation using gas-source MBE has been discussed with respect to the chemical reactions occurring in the transition layer. A series of samples were prepared to confirm the assumption by verifying the growth regime and the impacts on the crystal quality of the GaN film. We found that the growth rate can be varied along with the amount of NH3 supply even under NH3-rich condition with a fixed Ga flux. Two growth conditions were investigated for their impact on the transition layer. One was the atomic force microscopy result, which revealed that the adatom migration length is closely related to the transition layer formation. The other one is the photoluminescent spectra, which revealed that the luminescence property of GaN is strongly related to the transition layer.

  18. Semi-polar (11-22) AlGaN on overgrown GaN on micro-rod templates: Simultaneous management of crystal quality improvement and cracking issue

    NASA Astrophysics Data System (ADS)

    Li, Z.; Jiu, L.; Gong, Y.; Wang, L.; Zhang, Y.; Bai, J.; Wang, T.

    2017-02-01

    Thick and crack-free semi-polar (11-22) AlGaN layers with various high Al compositions have been achieved by means of growth on the top of nearly but not yet fully coalesced GaN overgrown on micro-rod templates. The range of the Al composition of up to 55.7% was achieved, corresponding to an emission wavelength of up to 270 nm characterised by photoluminescence at room temperature. X-ray diffraction (XRD) measurements show greatly improved crystal quality as a result of lateral overgrowth compared to the AlGaN counterparts on standard planar substrates. The full width at half maximums of the XRD rocking curves measured along the [1-100]/[11-2-3] directions (the two typical orientations for characterizing the crystal quality of (11-22) AlGaN) are 0.2923°/0.2006° for 37.8% Al and 0.3825°/0.2064° for 55.7% Al, respectively, which have never been achieved previously. Our calculation based on reciprocal space mapping measurements has demonstrated significant strain relaxation in the AlGaN as a result of utilising the non-coalesced GaN underneath, contributing to the elimination of any cracks. The results presented have demonstrated that our overgrowth technique can effectively manage strain and improve crystal quality simultaneously.

  19. 1.2 kV GaN Schottky barrier diodes on free-standing GaN wafer using a CMOS-compatible contact material

    NASA Astrophysics Data System (ADS)

    Liu, Xinke; Liu, Qiang; Li, Chao; Wang, Jianfeng; Yu, Wenjie; Xu, Ke; Ao, Jin-Ping

    2017-02-01

    In this paper, we report the formation of vertical GaN Schottky barrier diodes (SBDs) on a 2-in. free-standing (FS) GaN wafer, using CMOS-compatible contact material. By realizing an off-state breakdown voltage V BR of 1200 V and an on-state resistance R on of 7 mΩ·cm2, the FS-GaN SBDs fabricated in this work achieve a power device figure-of-merit V\\text{BR}2/R\\text{on} of 2.1 × 108 V2·Ω-1·cm-2 on a high quality GaN wafer. In addition, the fabricated FS-GaN SBDs show the highest I on/I off current ratio of ˜2.3 × 1010 among the GaN SBDs reported in the literature.

  20. A 600 VOLT MULTI-STAGE, HIGH REPETITION RATE GAN FET SWITCH

    SciTech Connect

    Frolov, D.; Pfeffer, H.; Saewert, G.

    2016-10-05

    Using recently available GaN FETs, a 600 Volt three- stage, multi-FET switch has been developed having 2 nanosecond rise time driving a 200 Ohm load with the potential of approaching 30 MHz average switching rates. Possible applications include driving particle beam choppers kicking bunch-by-bunch and beam deflectors where the rise time needs to be custom tailored. This paper reports on the engineering issues addressed, the design approach taken and some performance results of this switch.

  1. Effect of residual stress on the microstructure of GaN epitaxial films grown by pulsed laser deposition

    NASA Astrophysics Data System (ADS)

    Wang, Haiyan; Wang, Wenliang; Yang, Weijia; Zhu, Yunnong; Lin, Zhiting; Li, Guoqiang

    2016-04-01

    The stress-free GaN epitaxial films have been directly grown by pulsed laser deposition (PLD) at 850 °C, and the effect of different stress on the microstructure of as-grown GaN epitaxial films has been explored in detail. The as-grown stress-free GaN epitaxial films exhibit very smooth surface without any particles and grains, which is confirmed by the smallest surface root-mean-square roughness of 2.3 nm measured by atomic force microscopy. In addition, they also have relatively high crystalline quality, which is proved by the small full-width at half maximum values of GaN(0002) and GaN (10 1 bar 2) X-ray rocking curves as 0.27° and 0.68°, respectively. However, when the growth temperature is lower or higher than 850 °C, internal or thermal stress would be increased in as-grown GaN epitaxial films. To release the larger stress, a great number of dislocations are generated. Many irregular particulates, hexagonal GaN gains and pits are therefore produced on the films surface, and the crystalline quality is greatly reduced consequently. This work has demonstrated the direct growth of stress-free GaN epitaxial films with excellent surface morphology and high crystalline quality by PLD, and presented a comprehensive study on the origins and the effect of stress in GaN layer. It is instructional to achieve high-quality nitride films by PLD, and shows great potential and broad prospect for the further development of high-performance GaN-based devices.

  2. High uniform growth of 4-inch GaN wafer via flow field optimization by HVPE

    NASA Astrophysics Data System (ADS)

    Cheng, Yutian; Liu, Peng; Wu, Jiejun; Xiang, Yong; Chen, Xinjuan; Ji, Cheng; Yu, Tongjun; Zhang, Guoyi

    2016-07-01

    The uniformity of flow field inner the reactor plays a crucial role for hydride vapor phase epitaxy (HVPE) crystal growth and its more important for large scale substrate. A new nozzle structure was designed by adding a push and dilution (PD) gas pipe in the center of gas channels for a 4-inch HVPE (PD-HVPE) system. Experimental results showed that the thickness inhomogeneity of 46 μm 4-inch GaN layer could reach ±1.8% by optimizing PD gas, greatly improved from ±14% grown with conventional nozzle. The simulations of the internal flow field were consistent with our experiment, and the enhancement in uniformity should be attributed to the redistribution of GaCl and NH3 upon the wafer induced by PD pipe. The full width at half maximum (FWHM) of X-ray diffraction rocking curves for the 4-inch GaN film were about 224 and 200 arcsec for (002) and (102) reflection. The dislocation density of as-grown GaN was about 6.4×107 cm-2.

  3. Anisotropy of effective electron masses in highly doped nonpolar GaN

    SciTech Connect

    Feneberg, Martin Lange, Karsten; Lidig, Christian; Wieneke, Matthias; Witte, Hartmut; Bläsing, Jürgen; Dadgar, Armin; Krost, Alois; Goldhahn, Rüdiger

    2013-12-02

    The anisotropic effective electron masses in wurtzite GaN are determined by generalized infrared spectroscopic ellipsometry. Nonpolar (112{sup ¯}0) oriented thin films allow accessing both effective masses, m{sub ⊥}{sup *} and m{sub ∥}{sup *}, by determining the screened plasma frequencies. A n-type doping range up to 1.7 × 10{sup 20} cm{sup −3} is investigated. The effective mass ratio m{sub ⊥}{sup *}/m{sub ∥}{sup *} is obtained with highest accuracy and is found to be 1.11 independent on electron concentration up to 1.2 × 10{sup 20} cm{sup −3}. For higher electron concentrations, the conduction band non-parabolicity is mirrored in changes. Absolute values for effective electron masses depend on additional input of carrier concentrations determined by Hall effect measurements. We obtain m{sub ⊥}{sup *}=(0.239±0.004)m{sub 0} and m{sub ∥}{sup *}=(0.216±0.003)m{sub 0} for the parabolic range of the GaN conduction band. Our data are indication of a parabolic GaN conduction band up to an energy of approximately 400 meV above the conduction band minimum.

  4. Growth of ZnO and GaN Films

    NASA Astrophysics Data System (ADS)

    Chang, J.; Hong, S.-K.; Matsumoto, K.; Tokunaga, H.; Tachibana, A.; Lee, S. W.; Cho, M.-W.

    . Zinc oxide (ZnO) and gallium nitride (GaN) are wide bandgap semi conductors applicable to light emitting diodes (LEDs) and laser diodes (LDs) with wavelengths ranging from ultraviolet to blue light. Now ZnO and GaN are key ma terials for optoelectronic device applications and their applications are being rapidly expanded to lots of other technology including electronics, biotechnology, nanotech-nology, and fusion technology among all these. As a fundamental starting point for the development of this new technique, epitaxy of ZnO and GaN films is one of the most important key technology. Hence, development of the growth technique for high quality epitaxial films is highly necessary. Among the various kinds of epi taxy technique for semiconductor films developed so far, physical vapor deposition (PVD)-based epitaxy technique has been revealed to be the appropriate way for the high quality ZnO film and related alloy growths, while chemical vapor deposition (CVD)-based epitaxy technique has been proved to be the best method for the high quality GaN film and related alloy growths.

  5. Highly mismatched crystalline and amorphous GaN(1-x)As(x) alloys in the whole composition range

    SciTech Connect

    Yu, K. M.; Novikov, S. V.; Broesler, R.; Demchenko, I. N.; Denlinger, J. D.; Liliental-Weber, Z.; Luckert, F.; Martin, R. W.; Walukiewicz, W.; Foxon, C. T.

    2009-08-29

    Alloying is a commonly accepted method to tailor properties of semiconductor materials for specific applications. Only a limited number of semiconductor alloys can be easily synthesized in the full composition range. Such alloys are, in general, formed of component elements that are well matched in terms of ionicity, atom size, and electronegativity. In contrast there is a broad class of potential semiconductor alloys formed of component materials with distinctly different properties. In most instances these mismatched alloys are immiscible under standard growth conditions. Here we report on the properties of GaN1-xAsx, a highly mismatched, immiscible alloy system that was successfully synthesized in the whole composition range using a nonequilibrium low temperature molecular beam epitaxy technique. The alloys are amorphous in the composition range of 0.17GaN to ~;;0.8 eV at x~;;0.85. The reduction in the band gap can be attributed primarily to the downward movement of the conduction band for alloys with x>0.2, and to the upward movement of the valence band for alloys with x<0.2. The unique features of the band structure offer an opportunity of using GaN1-xAsx alloys for various types of solar power conversion devices.

  6. Growth optimization and characterization of GaN epilayers on multifaceted (111) surfaces etched on Si(100) substrates

    SciTech Connect

    Ansah-Antwi, KwaDwo Konadu Chua, Soo Jin; Soh, Chew Beng; Liu, Hongfei

    2015-11-15

    The four nearest Si(111) multifaceted sidewalls were exposed inside an array of 3 μm-wide square holes patterned on an Si(100) substrate, and this patterned Si(100) substrate was used as a substrate for the deposition of a gallium nitride (GaN) epilayer. Subsequently the effect that the growth pressure, the etched-hole profiles, and the etched-hole arrangement had upon the quality of the as-grown GaN was investigated. The coalescence of the as-grown GaN epilayer on the exposed Si(111) facets was observed to be enhanced with reduced growth pressure from 120 to 90 Torr. A larger Si(001) plane area at the bottom of the etched holes resulted in bidirectional GaN domains, which resulted in poor material quality. The bidirectional GaN domains were observed as two sets of six peaks via a high-resolution x-ray diffraction phi scan of the GaN(10-11) reflection. It was also shown that a triangular array of etched holes was more desirable than square arrays of etched holes for the growth high-quality and continuous GaN films.

  7. High Cubic-Phase Purity InN on MgO (001) Using Cubic-Phase GaN as a Buffer Layer

    SciTech Connect

    Sanorpim, S.; Kuntharin, S.; Parinyataramas, J.; Yaguchi, H.; Iwahashi, Y.; Orihara, M.; Hijikata, Y.; Yoshida, S.

    2011-12-23

    High cubic-phase purity InN films were grown on MgO (001) substrates by molecular beam epitaxy with a cubic-phase GaN buffer layer. The cubic phase purity of the InN grown layers has been analyzed by high resolution X-ray diffraction, {mu}-Raman scattering and transmission electron microscopy. It is evidenced that the hexagonal-phase content in the InN overlayer much depends on hexagonal-phase content in the cubic-phase GaN buffer layer and increases with increasing the hexagonal-phase GaN content. From Raman scattering measurements, in addition, the InN layer with lowest hexagonal component (6%), only Raman characteristics of cubic TO{sub InN} and LO{sub InN} modes were observed, indicating a formation of a small amount of stacking faults, which does not affect on vibrational property.

  8. Growth of GaN nanowall network on Si (111) substrate by molecular beam epitaxy.

    PubMed

    Zhong, Aihua; Hane, Kazuhiro

    2012-12-27

    GaN nanowall network was epitaxially grown on Si (111) substrate by molecular beam epitaxy. GaN nanowalls overlap and interlace with one another, together with large numbers of holes, forming a continuous porous GaN nanowall network. The width of the GaN nanowall can be controlled, ranging from 30 to 200 nm by adjusting the N/Ga ratio. Characterization results of a transmission electron microscope and X-ray diffraction show that the GaN nanowall is well oriented along the C axis. Strong band edge emission centered at 363 nm is observed in the spectrum of room temperature photoluminescence, indicating that the GaN nanowall network is of high quality. The sheet resistance of the Si-doped GaN nanowall network along the lateral direction was 58 Ω/. The conductive porous nanowall network can be useful for integrated gas sensors due to the large surface area-to-volume ratio and electrical conductivity along the lateral direction by combining with Si micromachining.

  9. Pulsed laser annealing of Be-implanted GaN

    SciTech Connect

    Wang, H.T.; Tan, L.S.; Chor, E.F.

    2005-11-01

    Postimplantation thermal processing of Be in molecular-beam-epitaxy-grown GaN by rapid thermal annealing (RTA) and pulsed laser annealing (PLA) was investigated. It has been found that the activation of Be dopants and the repair of implantation-induced defects in GaN films cannot be achieved efficiently by conventional RTA alone. On the other hand, good dopant activation and surface morphology and quality were obtained when the Be-implanted GaN film was annealed by PLA with a 248 nm KrF excimer laser. However, observations of off-resonant micro-Raman and high-resolution x-ray-diffraction spectra indicated that crystal defects and strain resulting from Be implantation were still existent after PLA, which probably degraded the carrier mobility and limited the activation efficiency to some extent. This can be attributed to the shallow penetration depth of the 248 nm laser in GaN, which only repaired the crystal defects in a thin near-surface layer, while the deeper defects were not annealed out well. This situation was significantly improved when the Be-implanted GaN was subjected to a combined process of PLA followed by RTA, which produced good activation of the dopants, good surface morphology, and repaired bulk and surface defects well.

  10. Pulsed laser annealing of Be-implanted GaN

    NASA Astrophysics Data System (ADS)

    Wang, H. T.; Tan, L. S.; Chor, E. F.

    2005-11-01

    Postimplantation thermal processing of Be in molecular-beam-epitaxy-grown GaN by rapid thermal annealing (RTA) and pulsed laser annealing (PLA) was investigated. It has been found that the activation of Be dopants and the repair of implantation-induced defects in GaN films cannot be achieved efficiently by conventional RTA alone. On the other hand, good dopant activation and surface morphology and quality were obtained when the Be-implanted GaN film was annealed by PLA with a 248 nm KrF excimer laser. However, observations of off-resonant micro-Raman and high-resolution x-ray-diffraction spectra indicated that crystal defects and strain resulting from Be implantation were still existent after PLA, which probably degraded the carrier mobility and limited the activation efficiency to some extent. This can be attributed to the shallow penetration depth of the 248 nm laser in GaN, which only repaired the crystal defects in a thin near-surface layer, while the deeper defects were not annealed out well. This situation was significantly improved when the Be-implanted GaN was subjected to a combined process of PLA followed by RTA, which produced good activation of the dopants, good surface morphology, and repaired bulk and surface defects well.

  11. Highly-stable and low-state-density Al2O3/GaN interfaces using epitaxial n-GaN layers grown on free-standing GaN substrates

    NASA Astrophysics Data System (ADS)

    Kaneki, Shota; Ohira, Joji; Toiya, Shota; Yatabe, Zenji; Asubar, Joel T.; Hashizume, Tamotsu

    2016-10-01

    Interface characterization was carried out on Al2O3/GaN structures using epitaxial n-GaN layers grown on free-standing GaN substrates with relatively low dislocation density (<3 × 106 cm-2). The Al2O3 layer was prepared by atomic layer deposition. The as-deposited metal-oxide-semiconductor (MOS) sample showed a significant frequency dispersion and a bump-like feature in capacitance-voltage (C-V) curves at reverse bias, showing high-density interface states in the range of 1012 cm-1 eV-1. On the other hand, excellent C-V characteristics with negligible frequency dispersion were observed from the MOS sample after annealing under a reverse bias at 300 °C in air for 3 h. The reverse-bias-annealed sample showed state densities less than 1 × 1011 cm-1 eV-1 and small shifts of flat-band voltage. In addition, the C-V curve measured at 200 °C remained essentially similar compared with the room-temperature C-V curves. These results indicate that the present process realizes a stable Al2O3/GaN interface with low interface state densities.

  12. MOCVD growth of GaN on SEMI-spec 200 mm Si

    NASA Astrophysics Data System (ADS)

    Zhang, Li; Lee, Kwang Hong; Made Riko, I.; Huang, Chieh-Chih; Kadir, Abdul; E Lee, Kenneth; Chua, Soo Jin; Fitzgerald, Eugene A.

    2017-06-01

    We describe the results produced from our research on integrating GaN devices with Si CMOS integrated circuits. High quality, low bow and robust 200 mm GaN on SEMI-spec epitaxial Si (725 μm) wafers are achieved by using a unique shaped susceptor and careful control of buffer design. High brightness InGaN/GaN MQW LEDs emitting at 450 nm with total III-N stack thickness of 3.6 μm have also been demonstrated. The growth technology of GaN on SEMI-spec 200 mm leads to new wafer/device platforms such as GaN-OI and CMOS + GaN that will open new avenues in device performance and integration of III-N devices with Si CMOS.

  13. Ionic liquid gating on atomic layer deposition passivated GaN: Ultra-high electron density induced high drain current and low contact resistance

    SciTech Connect

    Zhou, Hong; Du, Yuchen; Ye, Peide D.

    2016-05-16

    Herein, we report on achieving ultra-high electron density (exceeding 10{sup 14 }cm{sup −2}) in a GaN bulk material device by ionic liquid gating, through the application of atomic layer deposition (ALD) of Al{sub 2}O{sub 3} to passivate the GaN surface. Output characteristics demonstrate a maximum drain current of 1.47 A/mm, the highest reported among all bulk GaN field-effect transistors, with an on/off ratio of 10{sup 5} at room temperature. An ultra-high electron density exceeding 10{sup 14 }cm{sup −2} accumulated at the surface is confirmed via Hall-effect measurement and transfer length measurement. In addition to the ultra-high electron density, we also observe a reduction of the contact resistance due to the narrowing of the Schottky barrier width on the contacts. Taking advantage of the ALD surface passivation and ionic liquid gating technique, this work provides a route to study the field-effect and carrier transport properties of conventional semiconductors in unprecedented ultra-high charge density regions.

  14. Ionic liquid gating on atomic layer deposition passivated GaN: Ultra-high electron density induced high drain current and low contact resistance

    NASA Astrophysics Data System (ADS)

    Zhou, Hong; Du, Yuchen; Ye, Peide D.

    2016-05-01

    Herein, we report on achieving ultra-high electron density (exceeding 1014 cm-2) in a GaN bulk material device by ionic liquid gating, through the application of atomic layer deposition (ALD) of Al2O3 to passivate the GaN surface. Output characteristics demonstrate a maximum drain current of 1.47 A/mm, the highest reported among all bulk GaN field-effect transistors, with an on/off ratio of 105 at room temperature. An ultra-high electron density exceeding 1014 cm-2 accumulated at the surface is confirmed via Hall-effect measurement and transfer length measurement. In addition to the ultra-high electron density, we also observe a reduction of the contact resistance due to the narrowing of the Schottky barrier width on the contacts. Taking advantage of the ALD surface passivation and ionic liquid gating technique, this work provides a route to study the field-effect and carrier transport properties of conventional semiconductors in unprecedented ultra-high charge density regions.

  15. Selective-area growth of vertically oriented GaN nanostructures with a hafnium pre-orienting layer

    NASA Astrophysics Data System (ADS)

    Bae, S.-Y.; Lekhal, K.; Lee, H.-J.; Mitsunari, T.; Min, J.-W.; Lee, D.-S.; Kushimoto, M.; Honda, Y.; Amano, H.

    2017-06-01

    Severe melt-back etching has forced the epitaxy of GaN on Si to use an AlN buffer layer for growing high-quality two-dimensional layers, despite its high resistivity. Herein, we report a metal-based pre-orienting layer (POL) for growing GaN nanostructures (NSs) to replace the traditional AlN buffer layer. Two metals, titanium (Ti) and hafnium (Hf), were evaluated as POLs. We succeeded in fabricating arrays of GaN NSs with highly preferred orientation using selective-area growth. The crystallographic phase of the POLs critically affected the evolved orientation of the crystals. Photoluminescence measurements revealed that GaN NSs with Hf-based POLs were of reasonably high quality. We believe that this result will facilitate broader III-V semiconductor applications using alternative substrates moving beyond conventional Si-based optoelectronics.

  16. High-power blue laser diodes with indium tin oxide cladding on semipolar (202{sup ¯}1{sup ¯}) GaN substrates

    SciTech Connect

    Pourhashemi, A. Farrell, R. M.; Cohen, D. A.; Speck, J. S.; DenBaars, S. P.; Nakamura, S.

    2015-03-16

    We demonstrate a high power blue laser diode (LD) using indium tin oxide as a cladding layer on semipolar oriented GaN. These devices show peak output powers and external quantum efficiencies comparable to state-of-the-art commercial c-plane devices. Ridge waveguide LDs were fabricated on (202{sup ¯}1{sup ¯}) oriented GaN substrates using InGaN waveguiding layers and GaN cladding layers. At a lasing wavelength of 451 nm at room temperature, an output power of 2.52 W and an external quantum efficiency of 39% were measured from a single facet under a pulsed injection current of 2.34 A. The measured differential quantum efficiency was 50%.

  17. Optical and structural characteristics of high indium content InGaN/GaN multi-quantum wells with varying GaN cap layer thickness

    SciTech Connect

    Yang, J.; Zhao, D. G. Jiang, D. S.; Chen, P.; Zhu, J. J.; Liu, Z. S.; Le, L. C.; Li, X. J.; He, X. G.; Liu, J. P.; Yang, H.; Zhang, Y. T.; Du, G. T.

    2015-02-07

    The optical and structural properties of InGaN/GaN multi-quantum wells (MQWs) with different thicknesses of low temperature grown GaN cap layers are investigated. It is found that the MQW emission energy red-shifts and the peak intensity decreases with increasing GaN cap layer thickness, which may be partly caused by increased floating indium atoms accumulated at quantum well (QW) surface. They will result in the increased interface roughness, higher defect density, and even lead to a thermal degradation of QW layers. An extra growth interruption introduced before the growth of GaN cap layer can help with evaporating the floating indium atoms, and therefore is an effective method to improve the optical properties of high indium content InGaN/GaN MQWs.

  18. Pulsed high-power AlGaN-cladding-free blue laser diodes on semipolar (202xAF1xAF) GaN substrates

    NASA Astrophysics Data System (ADS)

    Pourhashemi, A.; Farrell, R. M.; Hardy, M. T.; Hsu, P. S.; Kelchner, K. M.; Speck, J. S.; DenBaars, S. P.; Nakamura, S.

    2013-10-01

    We demonstrate high-power AlGaN-cladding-free blue laser diodes (LDs) on semipolar (202¯1¯) GaN substrates with peak output powers and external quantum efficiencies (EQEs) that are comparable to state-of-the-art commercial c-plane devices. Ridge waveguide LDs were fabricated on (202¯1¯) GaN substrates using InGaN waveguiding layers and GaN cladding layers. The devices lased at 454 nm at room temperature. We measured an output power of 2.15 W, an EQE of 39%, and a differential quantum efficiency of 49% from a single facet with a pulsed drive current (current density) of 2.02 A (28.1 kA/cm2).

  19. Coherent vertical beaming using Bragg mirrors for high-efficiency GaN light-emitting diodes.

    PubMed

    Kim, Sun-Kyung; Park, Hong-Gyu

    2013-06-17

    We propose a dielectric Bragg mirror that utilizes coherent coupling with multiple quantum wells (MQWs) to significantly enhance light extraction from GaN light-emitting diode (LED). Full vectorial electromagnetic simulation showed that, under constructive interference conditions, the Bragg mirror consisting of two dielectric (SiO(2)/TiO(2)) stacks and a silver layer led to >30% enhancement in light extraction, as compared to a single silver mirror. Such significant enhancement by a pre-designed Bragg/metal mirror was ascribed to the vertically oriented radiation pattern and reduced plasmonic metal loss. In addition, the gap distance between the MQWs and a Bragg mirror at which the constructive interference takes place could be controlled by modulating the thickness of the first low-refractive-index layer. Moreover, a two-dimensional periodic pattern was incorporated into an upper GaN layer with the designed Bragg mirror and it was shown that a lattice constant of ~800 nm was optimal for light extraction. We believe that tailoring the radiation profile of light emitters by coherent coupling with designed high-reflectivity mirrors will be a promising route to overcome the efficiency limit of current semiconductor LED devices.

  20. Self-Supporting GaN Nanowires/Graphite Paper: Novel High-Performance Flexible Supercapacitor Electrodes.

    PubMed

    Wang, Shouzhi; Sun, Changlong; Shao, Yongliang; Wu, Yongzhong; Zhang, Lei; Hao, Xiaopeng

    2017-02-01

    Flexible supercapacitors have attracted great interest as energy storage devices because of their promise in applications such as wearable and smart electronic devices. Herein, a novel flexible supercapacitor electrode based on gallium nitride nanowire (GaN NW)/graphite paper (GP) nanocomposites is reported. The outstanding electrical conductivities of the GaN NW (6.36 × 10(2) S m(-1) ) and GP (7.5 × 10(4) S m(-1) ) deliver a synergistically enhanced electrochemical performance that cannot be achieved by either of the components alone. The composite electrode exhibits excellent specific capacitance (237 mF cm(-2) at 0.1 mA cm(-2) ) and outstanding cycling performance (98% capacitance retention after 10 000 cycles). The flexible symmetric supercapacitor also manifests high energy and power densities (0.30 mW h cm(-3) and 1000 mW cm(-3) ). These findings demonstrate that the GaN/GP composite electrode has significant potential as a candidate for the flexible energy storage devices.

  1. Controlled low Si doping and high breakdown voltages in GaN on sapphire grown by MOCVD

    NASA Astrophysics Data System (ADS)

    Agarwal, Anchal; Gupta, Chirag; Enatsu, Yuuki; Keller, Stacia; Mishra, Umesh

    2016-12-01

    Controlled n-type doping down to 2 × 1015 cm-3 was achieved in GaN grown on sapphire by MOCVD by balancing the n-type Si doping with respect to the background carbon and oxygen levels. A dopant level of ˜1 × 1016 cm-3 displayed a very high mobility of 899 cm2 V-1 s-1. High electron mobility in the drift layer leads to a low on resistance and high current densities without compromising on any other properties of the device. Schottky diodes processed on these low n-type layers showed low R on values, while the p-n diodes display high reverse breakdown voltages in excess of 1000 V for 8 μm thick drift layers with a doping of 2 × 1015 cm-3.

  2. Strain-induced step bunching in orientation-controlled GaN on Si

    NASA Astrophysics Data System (ADS)

    Narita, Tetsuo; Iguchi, Hiroko; Horibuchi, Kayo; Otake, Nobuyuki; Hoshi, Shinichi; Tomita, Kazuyoshi

    2016-05-01

    We report a technique for the fabrication of high-quality GaN-on-silicon (Si) substrates for use in various power applications. GaN epitaxial layers were generated on Si(111) vicinal faces that had been previously covered with a thin coating of Al2O3 to control the orientation of the AlN seed layers. We obtained orientation-controlled GaN layers and found a linear relationship between the GaN c-axis and Si[111] tilt angles. As a result, the threading dislocation density in the AlN seed layer was reduced and high-quality GaN layers were generated. The X-ray rocking curves for these layers exhibited full width at half maximum values of 390‧‧ and 550‧‧ for the (004) and (114) reflections, respectively. Significant step bunching was observed on a GaN(0001) vicinal face produced using this technique, attributed to strain-induced attractive interactions between steps. Thus, by controlling the strain near the surface layer, we achieved the step flow growth of GaN on Si.

  3. Effects of Al additives on growth of GaN polycrystals by the Na flux method

    NASA Astrophysics Data System (ADS)

    Imabayashi, Hiroki; Murakami, Kosuke; Matsuo, Daisuke; Honjo, Masatomo; Imanishi, Masayuki; Maruyama, Mihoko; Imade, Mamoru; Yoshimura, Masashi; Mori, Yusuke

    2017-03-01

    In this study, we investigated the growth of GaN polycrystals using the Al-added Na flux method. We studied the effects of Al on accelerating the nucleation and purity of GaN polycrystals. The yields of GaN crystals grown in Al-added Na flux were dramatically increased from those in Al-free Na flux, and the polycrystals grown by the Al-added Na flux method were highly transparent. As observed in secondary ion mass spectroscopy measurements, the Al content of the polycrystals was below the detection limit of 3 × 1016 atoms/cm3. From these results, the Al-added Na flux method is found to be appropriate for fabricating a large amount of GaN polycrystals without deteriorating the crystal quality.

  4. Controlled morphology of regular GaN microrod arrays by selective area growth with HVPE

    NASA Astrophysics Data System (ADS)

    Lekhal, Kaddour; Bae, Si-Young; Lee, Ho-Jun; Mitsunari, Tadashi; Tamura, Akira; Deki, Manato; Honda, Yoshio; Amano, Hiroshi

    2016-08-01

    The selective area growth (SAG) of GaN was implemented on patterned GaN/sapphire templates by hydride vapor phase epitaxy (HVPE) to fabricate regular arrays of Ga-polar GaN microrods. The control of growth parameters such as H2/N2 carrier gas ratio, growth temperature, and absolute NH3/HCl gas flow resulted in changes in the growth morphology. In particular, for an optimized mixed-carrier gas ratio of H2 to N2, we achieved vertically well-aligned microrods. The topmost regions of the GaN microrods were terminated with pyramidal facets, indicating typical Ga polarity. The optical properties of the grown microrods were characterized by cathodoluminescence (CL) at a low temperature. This revealed that the GaN microrods had high crystal quality since they exhibited suppressed yellow luminescence as well as strong band edge emission.

  5. Electrical detection of kidney injury molecule-1 with AlGaN /GaN high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Wang, H. T.; Kang, B. S.; Ren, F.; Pearton, S. J.; Johnson, J. W.; Rajagopal, P.; Roberts, J. C.; Piner, E. L.; Linthicum, K. J.

    2007-11-01

    AlGaN /GaN high electron mobility transistors (HEMTs) were used to detect kidney injury molecule-1 (KIM-1), an important biomarker for early kidney injury detection. The gate region consisted of 5nm gold deposited onto the AlGaN surface. The gold was conjugated to highly specific KIM-1 antibodies through a self-assembled monolayer of thioglycolic acid. The HEMT source-drain current showed a clear dependence on the KIM-1 concentration in phosphate-buffered saline solution. The limit of detection was 1ng/ml using a 20×50μm2 gate sensing area. This approach shows potential for both preclinical and clinical kidney injury diagnosis with accurate, rapid, noninvasive, and high throughput capabilities.

  6. Refractive index of erbium doped GaN thin films

    SciTech Connect

    Alajlouni, S.; Sun, Z. Y.; Li, J.; Lin, J. Y.; Jiang, H. X.; Zavada, J. M.

    2014-08-25

    GaN is an excellent host for erbium (Er) to provide optical emission in the technologically important as well as eye-safe 1540 nm wavelength window. Er doped GaN (GaN:Er) epilayers were synthesized on c-plane sapphire substrates using metal organic chemical vapor deposition. By employing a pulsed growth scheme, the crystalline quality of GaN:Er epilayers was significantly improved over those obtained by conventional growth method of continuous flow of reaction precursors. X-ray diffraction rocking curve linewidths of less than 300 arc sec were achieved for the GaN (0002) diffraction peak, which is comparable to the typical results of undoped high quality GaN epilayers and represents a major improvement over previously reported results for GaN:Er. Spectroscopic ellipsometry was used to determine the refractive index of the GaN:Er epilayers in the 1540 nm wavelength window and a linear dependence on Er concentration was found. The observed refractive index increase with Er incorporation and the improved crystalline quality of the GaN:Er epilayers indicate that low loss GaN:Er optical waveguiding structures are feasible.

  7. Plasticity and optical properties of GaN under highly localized nanoindentation stress fields

    NASA Astrophysics Data System (ADS)

    Caldas, P. G.; Silva, E. M.; Prioli, R.; Huang, J. Y.; Juday, R.; Fischer, A. M.; Ponce, F. A.

    2017-03-01

    Nanoscale plasticity has been studied on (0001) GaN thin films, using tips with very small radius of curvature. Cross-section transmission electron microscopy images of the nanoindentations indicate that the primary slip systems are the pyramidal {1 1 ¯ 01 } ⟨11 2 ¯ 3 ⟩ and {11 2 ¯ 2 } ⟨11 2 ¯ 3 ⟩ , followed by the basal {0002 } ⟨11 2 ¯ 0 ⟩ . Incipient plasticity was observed to be initiated by metastable atomic-scale slip events that occur as the crystal conforms to the shape of the tip. Large volumetric material displacements along the {1 1 ¯ 01 } ⟨11 2 ¯ 3 ⟩ and {11 2 ¯ 2 } ⟨11 2 ¯ 3 ⟩ slip systems were observed at an average shear stress of 11 GPa. Hexagonal shaped nanoindentation impressions following the symmetry of GaN were observed, with material pile-up in the ⟨11 2 ¯ 0 ⟩ directions. Spatially resolved cathodoluminescence images were used to correlate the microstructure with the optical properties. A large number of non-radiative defects were observed directly below the indentation. Regions under tensile stress extending from the nanoindentation along ⟨11 2 ¯ 0 ⟩ directions were associated with the {0002 } ⟨11 2 ¯ 0 ⟩ slip.

  8. Fabrication of GaN Microporous Structure at a GaN/Sapphire Interface as the Template for Thick-Film GaN Separation Grown by HVPE

    NASA Astrophysics Data System (ADS)

    Chen, Jianli; Cheng, Hongjuan; Zhang, Song; Lan, Feifei; Qi, Chengjun; Xu, Yongkuan; Wang, Zaien; Li, Jing; Lai, Zhanping

    2016-10-01

    In this paper, a microporous structure at the GaN/sapphire interface has been obtained by an electrochemical etching method via a selective etching progress using an as-grown GaN/sapphire wafer grown by metal organic chemical vapor deposition. The as-prepared GaN interfacial microporous structure has been used as a template for the following growth of thick-film GaN crystal by hydride vapor phase epitaxy (HVPE), facilitating the fabrication of a free-standing GaN substrate detached from a sapphire substrate. The evolution of the interfacial microporous structure has been investigated by varying the etching voltages and time, and the formation mechanism of interfacial microporous structure has been discussed in detail as well. Appropriate interfacial microporous structure is beneficial for separating the thick GaN crystal grown by HVPE from sapphire during the cooling down process. The separation that occurred at the place of interfacial microporous can be attributed to the large thermal strain between GaN and sapphire. This work realized the fabrication of a free-standing GaN substrate with high crystal quality and nearly no residual strain.

  9. Features of molecular beam epitaxy of the GaN (0001) and GaN (0001-bar) layers with the use of different methods of activation of nitrogen

    SciTech Connect

    Mizerov, A. M. Jmerik, V. N.; Kaibyshev, V. K.; Komissarova, T. A.; Masalov, S. A.; Ivanov, S. V.

    2009-08-15

    The results of comparative studies of the growth kinetics of the GaN layers of different polarity during ammonia molecular beam epitaxy and plasma-assisted molecular beam epitaxy (PA MBE) of nitrogen with the use of sapphire substrates and GaN(0001-bar)/c-Al{sub 2}O{sub 3} templates grown by gas-phase epitaxy from metalorganic compounds are presented. The possibility is shown of obtaining the GaN layers with an atomically smooth surface during molecular beam epitaxy with plasma activation of nitrogen. For this purpose, it is suggested to carry out the growth in conditions enriched with metal near the mode of formation of the Ga drops at a temperature close to the decomposition temperature of GaN (TS {approx} 760 deg. C). The conclusion is made that an increase in the growth temperature positively affects the structural, optical, and electrical properties of the GaN (0001-bar) layers. A high quality of the GaN (0001) films grown by the PA MBE method at a low temperature of {approx}700 deg. C on the GaN/c-Al{sub 2}O{sub 3} templates is shown.

  10. Carbon doped GaN buffer layer using propane for high electron mobility transistor applications: Growth and device results

    SciTech Connect

    Li, X.; Nilsson, D.; Danielsson, Ö.; Pedersen, H.; Janzén, E.; Forsberg, U.; Bergsten, J.; Rorsman, N.

    2015-12-28

    The creation of a semi insulating (SI) buffer layer in AlGaN/GaN High Electron Mobility Transistor (HEMT) devices is crucial for preventing a current path beneath the two-dimensional electron gas (2DEG). In this investigation, we evaluate the use of a gaseous carbon gas precursor, propane, for creating a SI GaN buffer layer in a HEMT structure. The carbon doped profile, using propane gas, is a two stepped profile with a high carbon doping (1.5 × 10{sup 18 }cm{sup −3}) epitaxial layer closest to the substrate and a lower doped layer (3 × 10{sup 16 }cm{sup −3}) closest to the 2DEG channel. Secondary Ion Mass Spectrometry measurement shows a uniform incorporation versus depth, and no memory effect from carbon doping can be seen. The high carbon doping (1.5 × 10{sup 18 }cm{sup −3}) does not influence the surface morphology, and a roughness root-mean-square value of 0.43 nm is obtained from Atomic Force Microscopy. High resolution X-ray diffraction measurements show very sharp peaks and no structural degradation can be seen related to the heavy carbon doped layer. HEMTs are fabricated and show an extremely low drain induced barrier lowering value of 0.1 mV/V, demonstrating an excellent buffer isolation. The carbon doped GaN buffer layer using propane gas is compared to samples using carbon from the trimethylgallium molecule, showing equally low leakage currents, demonstrating the capability of growing highly resistive buffer layers using a gaseous carbon source.

  11. Carbon doped GaN buffer layer using propane for high electron mobility transistor applications: Growth and device results

    NASA Astrophysics Data System (ADS)

    Li, X.; Bergsten, J.; Nilsson, D.; Danielsson, Ö.; Pedersen, H.; Rorsman, N.; Janzén, E.; Forsberg, U.

    2015-12-01

    The creation of a semi insulating (SI) buffer layer in AlGaN/GaN High Electron Mobility Transistor (HEMT) devices is crucial for preventing a current path beneath the two-dimensional electron gas (2DEG). In this investigation, we evaluate the use of a gaseous carbon gas precursor, propane, for creating a SI GaN buffer layer in a HEMT structure. The carbon doped profile, using propane gas, is a two stepped profile with a high carbon doping (1.5 × 1018 cm-3) epitaxial layer closest to the substrate and a lower doped layer (3 × 1016 cm-3) closest to the 2DEG channel. Secondary Ion Mass Spectrometry measurement shows a uniform incorporation versus depth, and no memory effect from carbon doping can be seen. The high carbon doping (1.5 × 1018 cm-3) does not influence the surface morphology, and a roughness root-mean-square value of 0.43 nm is obtained from Atomic Force Microscopy. High resolution X-ray diffraction measurements show very sharp peaks and no structural degradation can be seen related to the heavy carbon doped layer. HEMTs are fabricated and show an extremely low drain induced barrier lowering value of 0.1 mV/V, demonstrating an excellent buffer isolation. The carbon doped GaN buffer layer using propane gas is compared to samples using carbon from the trimethylgallium molecule, showing equally low leakage currents, demonstrating the capability of growing highly resistive buffer layers using a gaseous carbon source.

  12. Effect of a Cooling Step Treatment on a High-Voltage GaN LED During ICP Dry Etching

    NASA Astrophysics Data System (ADS)

    Lin, Yen-Sheng; Hsiao, Sheng-Yu; Tseng, Chun-Lung; Shen, Ching-Hsing; Chiang, Jung-Sheng

    2017-02-01

    In this study, a lower dislocation density for a GaN surface and a reduced current path are observed at the interface of a SiO2 isolation sidewall, using high-resolution transmission electron microscopy. This is grown using a 3-min cooling step treatment during inductivity coupled plasma dry etching. The lower forward voltage is measured, the leakage current decreases from 53nA to 32nA, and the maximum output power increases from 354.8 W to 357.2 W for an input current of 30 mA. The microstructure and the optoelectronic properties of high-voltage light-emitting-diodes is proven to be affected by the cooling step treatment, which allows enough time to release the thermal energy of the SiO2 isolation well.

  13. High-efficiency vertical GaN slab light-emitting diodes using self-coherent directional emitters.

    PubMed

    Kim, Sun-Kyung; Lee, Jin Wook; Ee, Ho-Seok; Moon, Yong-Tae; Kwon, Soon-Hong; Kwon, Hoki; Park, Hong-Gyu

    2010-05-24

    We demonstrate a highly-efficient, large-area (1x1 mm2) GaN slab light-emitting diode using a vertically directional emitter produced from constructive interference. The vertical radiation can be coupled effectively into leaky modes from the beginning and thus a high-extraction efficiency can be expected with reduced material absorption. The far-field measurements show that the desired vertical emission profiles are obtained by varying the thickness of the dielectric layer between the emitter and bottom silver mirror. With the combination of a light extractor of a randomly textured surface, the output power was increased approximately 1.4 fold compared to a non-patterned device at a standard current of 350 mA without electrical degradation.

  14. Basic ammonothermal GaN growth in molybdenum capsules

    NASA Astrophysics Data System (ADS)

    Pimputkar, S.; Speck, J. S.; Nakamura, S.

    2016-12-01

    Single crystal, bulk gallium nitride (GaN) crystals were grown using the basic ammonothermal method in a high purity growth environment created using a non-hermetically sealed molybdenum (Mo) capsule and compared to growths performed in a similarly designed silver (Ag) capsule and capsule-free René 41 autoclave. Secondary ion mass spectrometry (SIMS) analysis revealed transition metal free (<1×1017 cm-3) GaN crystals. Anomalously low oxygen concentrations ((2-6)×1018 cm-3) were measured in a {0001} seeded crystal boule grown using a Mo capsule, despite higher source material oxygen concentrations ((1-5)×1019 cm-3) suggesting that molybdenum (or molybdenum nitrides) may act to getter oxygen under certain conditions. Total system pressure profiles from growth runs in a Mo capsule system were comparable to those without a capsule, with pressures peaking within 2 days and slowly decaying due to hydrogen diffusional losses. Measured Mo capsule GaN growth rates were comparable to un-optimized growth rates in capsule-free systems and appreciably slower than in Ag-capsule systems. Crystal quality replicated that of the GaN seed crystals for all capsule conditions, with high quality growth occurring on the (0001) Ga-face. Optical absorption and impurity concentration characterization suggests reduced concentrations of hydrogenated gallium vacancies (VGa-Hx).

  15. Effect of GaN interlayer on polarity control of epitaxial ZnO thin films grown by molecular beam epitaxy

    SciTech Connect

    Wang, X. Q.; Sun, H. P.; Pan, X. Q.

    2010-10-11

    Epitaxial ZnO thin films were grown on nitrided (0001) sapphire substrates with an intervening GaN layer by rf-plasma-assisted molecular beam epitaxy. It was found that polarity of the ZnO epilayer could be controlled by modifying the GaN interlayer. ZnO grown on a distorted 3-nm-thick GaN interlayer has Zn-polarity while ZnO on a 20-nm-thick GaN interlayer with a high structural quality has O-polarity. High resolution transmission electron microscopy analysis indicates that the polarity of ZnO epilayer is controlled by the atomic structure of the interface between the ZnO buffer layer and the intervening GaN layer.

  16. ZnO nanorod arrays and direct wire bonding on GaN surfaces for rapid fabrication of antireflective, high-temperature ultraviolet sensors

    NASA Astrophysics Data System (ADS)

    So, Hongyun; Senesky, Debbie G.

    2016-11-01

    Rapid, cost-effective, and simple fabrication/packaging of microscale gallium nitride (GaN) ultraviolet (UV) sensors are demonstrated using zinc oxide nanorod arrays (ZnO NRAs) as an antireflective layer and direct bonding of aluminum wires to the GaN surface. The presence of the ZnO NRAs on the GaN surface significantly reduced the reflectance to less than 1% in the UV and 4% in the visible light region. As a result, the devices fabricated with ZnO NRAs and mechanically stable aluminum bonding wires (pull strength of 3-5 gf) showed higher sensitivity (136.3% at room temperature and 148.2% increase at 250 °C) when compared with devices with bare (uncoated) GaN surfaces. In addition, the devices demonstrated reliable operation at high temperatures up to 300 °C, supporting the feasibility of simple and cost-effective UV sensors operating with higher sensitivity in high-temperature conditions, such as in combustion, downhole, and space exploration applications.

  17. A novel MOCVD reactor for growth of high-quality GaN-related LED layers

    NASA Astrophysics Data System (ADS)

    Hu, Shaolin; Liu, Sheng; Zhang, Zhi; Yan, Han; Gan, Zhiyin; Fang, Haisheng

    2015-04-01

    Gallium nitride (GaN), a direct bandgap semiconductor widely used in bright light-emitting diodes (LEDs), is mostly grown by metal-organic chemical vapor deposition (MOCVD) method. A good reactor design is critical for the production of high-quality GaN thin films. In this paper, we presented a novel buffered distributed spray (BDS) MOCVD reactor with vertical gas sprayers and horizontal gas inlets. Experiments based on a 36×2″ BDS reactor were conducted to examine influence of the process parameters, such as the operating pressure and the gas flow rate, on the growth efficiency and on the layer thickness uniformity. Transmission electron microscopy (TEM) and photoluminescence (PL) are further conducted to evaluate quality of the epitaxial layers and to check performance of the reactor. Results show that the proposed novel reactor is of high performance in growing high-quality thin films, including InGaN/GaN multiquantum wells (MQWs) structures.

  18. Semi-polar GaN materials technology for high IQE green LEDs.

    SciTech Connect

    Koleske, Daniel; Lee, Stephen Roger; Crawford, Mary H; Coltrin, Michael Elliott; Fini, Paul

    2013-06-01

    The goal of this NETL funded program was to improve the IQE in green (and longer wavelength) nitride- based LEDs structures by using semi-polar GaN planar orientations for InGaN multiple quantum well (MQW) growth. These semi-polar orientations have the advantage of significantly reducing the piezoelectric fields that distort the QW band structure and decrease electron-hole overlap. In addition, semipolar surfaces potentially provide a more open surface bonding environment for indium incorporation, thus enabling higher indium concentrations in the InGaN MQW. The goal of the proposed work was to select the optimal semi-polar orientation and explore wafer miscuts around this orientation that produced the highest quantum efficiency LEDs. At the end of this program we had hoped to have MQWs active regions at 540 nm with an IQE of 50% and an EQE of 40%, which would be approximately twice the estimated current state-of-the-art.

  19. A sub-terahertz broadband detector based on a GaN high-electron-mobility transistor with nanoantennas

    NASA Astrophysics Data System (ADS)

    Hou, Haowen; Liu, Zhihong; Teng, Jinghua; Palacios, Tomás; Chua, Soo-Jin

    2017-01-01

    We report a sub-terahertz (THz) detector based on a 0.25-µm-gate-length AlGaN/GaN high-electron-mobility transistor (HEMT) on a Si substrate with nanoantennas. The fabricated device shows excellent performance with a maximum responsivity (R v) of 15 kV/W and a minimal noise equivalent power (NEP) of 0.58 pW/Hz0.5 for 0.14 THz radiation at room temperature. We consider these excellent results as due to the design of asymmetric nanoantennas. From simulation, we show that indeed such nanoantennas can effectively enhance the local electric field induced by sub-THz radiation and thereby improve the detection response. The excellent results indicate that GaN HEMTs with nanoantennas are future competitive detectors for sub-THz and THz imaging applications.

  20. High-yield thin GaN LED using metal bonding and laser lift-off technology

    NASA Astrophysics Data System (ADS)

    Horng, Ray-Hua; Chen, Ching-Ho; Kao, Wei-Cheng; Wuu, Dong-Sing

    2012-10-01

    Gold-indium metal bonding method was used in this study to increase the product yield of vertical light emitting diodes (LEDs) during laser lift-off (LLO) process. The vertical GaN LED transferred onto Si substrate presented good electrical and optical properties due to the existence of high reflective mirror and texture surface. The chip size and dominant wavelength for vertical type LED are 40×40 mil2 and 450 nm. The optimal conditions of temperature and pressure for 2-inch wafer bonding are set of 200oC and 100 kg/inch2, respectively. The products yield of light output power, forward voltage and leakage current are 96 %, 96.4% and 61.2%, respectively. After aging test, the characteristics decay of light output power, forward voltage and leakage current are less than 4%. Summarization of optical and electrical properties, the total yield of these LEDs products is about 60 %.

  1. Electronic structure of ytterbium-implanted GaN at ambient and high pressure: experimental and crystal field studies.

    PubMed

    Kaminska, A; Ma, C-G; Brik, M G; Kozanecki, A; Boćkowski, M; Alves, E; Suchocki, A

    2012-03-07

    The results of high-pressure low-temperature optical measurements in a diamond-anvil cell of bulk gallium nitride crystals implanted with ytterbium are reported in combination with crystal field calculations of the Yb(3+) energy levels. Crystal field analysis of splitting of the (2)F(7/2) and (2)F(5/2) states has been performed, with the aim of assigning all features of the experimental luminescence spectra. A thorough analysis of the pressure behavior of the Yb(3+) luminescence lines in GaN allowed the determination of the ambient-pressure positions and pressure dependence of the Yb(3+) energy levels in the trigonal crystal field as well as the pressure-induced changes of the spin-orbit coupling coefficient.

  2. Effective surface treatment for GaN metal-insulator-semiconductor high-electron-mobility transistors using HF plus N2 plasma prior to SiN passivation

    NASA Astrophysics Data System (ADS)

    Liu, Shih-Chien; Trinh, Hai-Dang; Dai, Gu-Ming; Huang, Chung-Kai; Dee, Chang-Fu; Yeop Majlis, Burhanuddin; Biswas, Dhrubes; Chang, Edward Yi

    2016-01-01

    An effective surface cleaning technique is demonstrated for the GaN metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) passivation process. In this study, dilute HF solution and in situ N2 plasma treatments were adopted to remove the native oxide and recover the nitrogen-vacancy defects at the GaN surface before device passivation. To investigate the correlation between the properties of the SiN/GaN interface and the device performance, the GaN MIS-HEMTs were characterized using current-voltage (I-V) measurement, capacitance-voltage (C-V) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. With the application of this surface treatment technique, the device exhibits improved I-V characteristics with low leakage current, low dynamic ON-resistance, and good C-V response with a steep slope. Overall, the results reveal that the oxide-related bonds and nitrogen-vacancy defects at the SiN/GaN interface are the root cause of the GaN MIS-HEMTs performance degradation.

  3. Halide vapor phase epitaxy of thick GaN films on ScAlMgO4 substrates and their self-separation for fabricating freestanding wafers

    NASA Astrophysics Data System (ADS)

    Ohnishi, Kazuki; Kanoh, Masaya; Tanikawa, Tomoyuki; Kuboya, Shigeyuki; Mukai, Takashi; Matsuoka, Takashi

    2017-10-01

    Halide vapor phase epitaxy of thick GaN films was demonstrated on ScAlMgO4 (SCAM) substrates, and their self-separation was achieved. The 320-µm-thick GaN film was self-separated from the SCAM substrate during the cooling process after the growth. This separation phenomenon occurred because of both the c-plane cleavability of SCAM and the difference in the thermal-expansion coefficients between GaN and SCAM. The dark-spot densities for the GaN films on the SCAM substrates were approximately 30% lower than those on sapphire substrates. These results indicate that SCAM substrates are promising for fabricating a high-quality freestanding GaN wafer at a low cost.

  4. An Octave Bandwidth, High PAE, Linear, Class J GaN High Power Amplifier

    DTIC Science & Technology

    2012-03-12

    the signal modulated with QPSK (18 Mbps data rate) and an EVM of -14 dB or better; at 16- QAM (36 Mbps) and an EVM of -20 dB or better; and at 64...waveforms with up to 64- QAM modulation . Operating at peak power levels up to 210-W, the WLPA represents a significant advancement for wideband, high...a stability risk for a single module in that there is a potential for oscillations due to signal feedback. The PA provides 200-W saturated power

  5. Toward the realization of erbium-doped GaN bulk crystals as a gain medium for high energy lasers

    NASA Astrophysics Data System (ADS)

    Sun, Z. Y.; Li, J.; Zhao, W. P.; Lin, J. Y.; Jiang, H. X.

    2016-08-01

    Er-doped GaN (Er:GaN) is a promising candidate as a gain medium for solid-state high energy lasers (HELs) at the technologically important and eye-safe 1.54 μm wavelength window, as GaN has superior thermal properties over traditional laser gain materials such as Nd:YAG. However, the attainment of wafer-scale Er:GaN bulk or quasi-bulk crystals is a prerequisite to realize the full potential of Er:GaN as a gain medium for HELs. We report the realization of freestanding Er:GaN wafers of 2-in. in diameter with a thickness on the millimeter scale. These freestanding wafers were obtained via growth by hydride vapor phase epitaxy in conjunction with a laser-lift-off process. An Er doping level of 1.4 × 1020 atoms/cm3 has been confirmed by secondary ion mass spectrometry measurements. The freestanding Er:GaN wafers exhibit strong photoluminescent emission at 1.54 μm with its emission intensity increasing dramatically with wafer thickness under 980 nm resonant excitation. A low thermal quenching of 10% was measured for the 1.54 μm emission intensity between 10 K and 300 K. This work represents a significant step in providing a practical approach for producing Er:GaN materials with sufficient thicknesses and dimensions to enable the design of gain media in various geometries, allowing for the production of HELs with improved lasing efficiency, atmosphere transmission, and eye-safety.

  6. Toward the realization of erbium-doped GaN bulk crystals as a gain medium for high energy lasers

    SciTech Connect

    Sun, Z. Y.; Li, J.; Zhao, W. P.; Lin, J. Y.; Jiang, H. X.

    2016-08-01

    Er-doped GaN (Er:GaN) is a promising candidate as a gain medium for solid-state high energy lasers (HELs) at the technologically important and eye-safe 1.54 μm wavelength window, as GaN has superior thermal properties over traditional laser gain materials such as Nd:YAG. However, the attainment of wafer-scale Er:GaN bulk or quasi-bulk crystals is a prerequisite to realize the full potential of Er:GaN as a gain medium for HELs. We report the realization of freestanding Er:GaN wafers of 2-in. in diameter with a thickness on the millimeter scale. These freestanding wafers were obtained via growth by hydride vapor phase epitaxy in conjunction with a laser-lift-off process. An Er doping level of 1.4 × 10{sup 20} atoms/cm{sup 3} has been confirmed by secondary ion mass spectrometry measurements. The freestanding Er:GaN wafers exhibit strong photoluminescent emission at 1.54 μm with its emission intensity increasing dramatically with wafer thickness under 980 nm resonant excitation. A low thermal quenching of 10% was measured for the 1.54 μm emission intensity between 10 K and 300 K. This work represents a significant step in providing a practical approach for producing Er:GaN materials with sufficient thicknesses and dimensions to enable the design of gain media in various geometries, allowing for the production of HELs with improved lasing efficiency, atmosphere transmission, and eye-safety.

  7. Evolution of threading dislocations in GaN epitaxial laterally overgrown on GaN templates using self-organized graphene as a nano-mask

    NASA Astrophysics Data System (ADS)

    Xu, Yu; Cao, Bing; He, Shunyu; Qi, Lin; Li, Zongyao; Cai, Demin; Zhang, Yumin; Ren, Guoqiang; Wang, Jianfeng; Wang, Chinhua; Xu, Ke

    2017-09-01

    Growth of high-quality GaN within a limited thickness is still a challenge, which is important both in improving device performance and in reducing the cost. In this work, a self-organized graphene is investigated as a nano-mask for two-step GaN epitaxial lateral overgrowth (2S-ELOG) in hydride vapor phase epitaxy. Efficient improvement of crystal quality was revealed by x-ray diffraction. The microstructural properties, especially the evolution of threading dislocations (TDs), were investigated by scanning electron microscopy and transmission electron microscopy. Stacking faults blocked the propagation of TDs, and fewer new TDs were subsequently generated by the coalescence of different orientational domains and lateral-overgrown GaN. This evolution mechanism of TDs was different from that of traditional ELOG technology or one-step ELOG (1S-ELOG) technology using a two-dimensional (2D) material as a mask.

  8. Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs

    PubMed Central

    Shih, Huan-Yu; Shiojiri, Makoto; Chen, Ching-Hsiang; Yu, Sheng-Fu; Ko, Chung-Ting; Yang, Jer-Ren; Lin, Ray-Ming; Chen, Miin-Jang

    2015-01-01

    High threading dislocation (TD) density in GaN-based devices is a long unresolved problem because of the large lattice mismatch between GaN and the substrate, which causes a major obstacle for the further improvement of next-generation high-efficiency solid-state lighting and high-power electronics. Here, we report InGaN/GaN LEDs with ultralow TD density and improved efficiency on a sapphire substrate, on which a near strain-free GaN compliant buffer layer was grown by remote plasma atomic layer deposition. This “compliant” buffer layer is capable of relaxing strain due to the absorption of misfit dislocations in a region within ~10 nm from the interface, leading to a high-quality overlying GaN epilayer with an unusual TD density as low as 2.2 × 105 cm−2. In addition, this GaN compliant buffer layer exhibits excellent uniformity up to a 6” wafer, revealing a promising means to realize large-area GaN hetero-epitaxy for efficient LEDs and high-power transistors. PMID:26329829

  9. Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs.

    PubMed

    Shih, Huan-Yu; Shiojiri, Makoto; Chen, Ching-Hsiang; Yu, Sheng-Fu; Ko, Chung-Ting; Yang, Jer-Ren; Lin, Ray-Ming; Chen, Miin-Jang

    2015-09-02

    High threading dislocation (TD) density in GaN-based devices is a long unresolved problem because of the large lattice mismatch between GaN and the substrate, which causes a major obstacle for the further improvement of next-generation high-efficiency solid-state lighting and high-power electronics. Here, we report InGaN/GaN LEDs with ultralow TD density and improved efficiency on a sapphire substrate, on which a near strain-free GaN compliant buffer layer was grown by remote plasma atomic layer deposition. This "compliant" buffer layer is capable of relaxing strain due to the absorption of misfit dislocations in a region within ~10 nm from the interface, leading to a high-quality overlying GaN epilayer with an unusual TD density as low as 2.2 × 10(5) cm(-2). In addition, this GaN compliant buffer layer exhibits excellent uniformity up to a 6" wafer, revealing a promising means to realize large-area GaN hetero-epitaxy for efficient LEDs and high-power transistors.

  10. Separation of thick HVPE-GaN films from GaN templates using nanoporous GaN layers

    NASA Astrophysics Data System (ADS)

    Dong, Zengyin; Yang, Ruixia; Zhang, Song; Wang, Zaien; Chen, Jianli; Li, Xun

    2017-10-01

    In this work, we have succeeded in growing an approximate 2-inch self-separated thick GaN wafer by hydride vapor phase epitaxy with an introduction of a sacrificial layer of nanoporous GaN. Such nanoporous GaN layer is invented by using the HVPE growth of thin GaN layer on the spin-coating silica nanosphere layer followed by a hydrofluoric acid etching to the silica nanosphere layer. It has been found that the nanoporous GaN layer, enabling a reduction of stickiness between thick GaN films and the substrates, plays a significant role in the self-separation of thick GaN films during the cooling process. However, the thickness of the nanoporous GaN layer is another key issue to achieve good quality self-separated GaN thick films. In our study, we suggest that the nanoporous GaN layer with a thickness of approximately 150-240 nm can best serve as the sacrificial layer in self-separation process. Raman spectroscopy also indicates the self-separated thick GaN films by using the proposed approach are virtually strain-free.

  11. Growth of large-scale vertically aligned GaN nanowires and their heterostructures with high uniformity on SiO(x) by catalyst-free molecular beam epitaxy.

    PubMed

    Zhao, S; Kibria, M G; Wang, Q; Nguyen, H P T; Mi, Z

    2013-06-21

    The catalyst-free molecular beam epitaxial growth of GaN nanowires and their heterostructures on a SiOx template is studied in detail. It was found that by optimizing the growth temperature, highly uniform and vertically aligned GaN nanowires and InGaN/GaN heterostructures with excellent optical properties can be obtained on a SiOx template in a large-scale. This work provides an entirely new avenue for GaN nanowire based optoelectronic devices.

  12. Comparison between structural properties of bulk GaN grown under high N pressure and GaN grown by other methods

    SciTech Connect

    Liliental-Weber, Z.; Jasinski, J.; Washburn, J.

    2002-07-31

    In this paper defects formed in GaN grown by different methods are reviewed. Formation of particular defects are often related to the crystallographic direction in which the crystals grow. For bulk crystals the highest growth rates are observed for directions perpendicular to the c-axis. Threading dislocations and nanopipes along the c-axis are not formed in these crystals, but polarity of the growth direction plays a role concerning defects that are formed and surface roughness. For growth of homoepitaxial layers, where growth is forced to take place in the c-direction threading dislocations are formed and their density is related to the purity of constituents used for growth and to substrate surface inhomogeneities. In heteroepitaxial layers two other factors: lattice mismatch and thermal expansion mismatch are related to the formation of dislocations. Doping of crystals can also lead to formation of defects characteristic for a specific dopant. This type of defects tends to be growth method independent but can depend on growth polarity.

  13. Influence of different aspect ratios on the structural and electrical properties of GaN thin films grown on nanoscale-patterned sapphire substrates

    NASA Astrophysics Data System (ADS)

    Lee, Fang-Wei; Ke, Wen-Cheng; Cheng, Chun-Hong; Liao, Bo-Wei; Chen, Wei-Kuo

    2016-07-01

    This study presents GaN thin films grown on nanoscale-patterned sapphire substrates (NPSSs) with different aspect ratios (ARs) using a homemade metal-organic chemical vapor deposition system. The anodic aluminum oxide (AAO) technique is used to prepare the dry etching mask. The cross-sectional view of the scanning electron microscope image shows that voids exist between the interface of the GaN thin film and the high-AR (i.e. ∼2) NPSS. In contrast, patterns on the low-AR (∼0.7) NPSS are filled full of GaN. The formation of voids on the high-AR NPSS is believed to be due to the enhancement of the lateral growth in the initial growth stage, and the quick-merging GaN thin film blocks the precursors from continuing to supply the bottom of the pattern. The atomic force microscopy images of GaN on bare sapphire show a layer-by-layer surface morphology, which becomes a step-flow surface morphology for GaN on a high-AR NPSS. The edge-type threading dislocation density can be reduced from 7.1 × 108 cm-2 for GaN on bare sapphire to 4.9 × 108 cm-2 for GaN on a high-AR NPSS. In addition, the carrier mobility increases from 85 cm2/Vs for GaN on bare sapphire to 199 cm2/Vs for GaN on a high-AR NPSS. However, the increased screw-type threading dislocation density for GaN on a low-AR NPSS is due to the competition of lateral growth on the flat-top patterns and vertical growth on the bottom of the patterns that causes the material quality of the GaN thin film to degenerate. Thus, the experimental results indicate that the AR of the particular patterning of a NPSS plays a crucial role in achieving GaN thin film with a high crystalline quality.

  14. Ultralow nonalloyed Ohmic contact resistance to self aligned N-polar GaN high electron mobility transistors by In(Ga)N regrowth

    NASA Astrophysics Data System (ADS)

    Dasgupta, Sansaptak; Nidhi, Brown, David F.; Wu, Feng; Keller, Stacia; Speck, James S.; Mishra, Umesh K.

    2010-04-01

    Ultralow Ohmic contact resistance and a self-aligned device structure are necessary to reduce the effect of parasitic elements and obtain higher ft and fmax in high electron mobility transistors (HEMTs). N-polar (0001¯) GaN HEMTs, offer a natural advantage over Ga-polar HEMTs, in terms of contact resistance since the contact is not made through a high band gap material [Al(Ga)N]. In this work, we extend the advantage by making use of polarization induced three-dimensional electron-gas through regrowth of graded InGaN and thin InN cap in the contact regions by plasma (molecular beam epitaxy), to obtain an ultralow Ohmic contact resistance of 27 Ω μm to a GaN 2DEG.

  15. Ultralow nonalloyed Ohmic contact resistance to self aligned N-polar GaN high electron mobility transistors by In(Ga)N regrowth

    SciTech Connect

    Dasgupta, Sansaptak; Nidhi,; Brown, David F.; Wu, Feng; Keller, Stacia; Speck, James S.; Mishra, Umesh K.

    2010-04-05

    Ultralow Ohmic contact resistance and a self-aligned device structure are necessary to reduce the effect of parasitic elements and obtain higher f{sub t} and f{sub max} in high electron mobility transistors (HEMTs). N-polar (0001) GaN HEMTs, offer a natural advantage over Ga-polar HEMTs, in terms of contact resistance since the contact is not made through a high band gap material [Al(Ga)N]. In this work, we extend the advantage by making use of polarization induced three-dimensional electron-gas through regrowth of graded InGaN and thin InN cap in the contact regions by plasma (molecular beam epitaxy), to obtain an ultralow Ohmic contact resistance of 27 OMEGA mum to a GaN 2DEG.

  16. Design of an Ultra-Efficient GaN High Power Amplifier for Radar Front-Ends Using Active Harmonic Load-Pull

    NASA Technical Reports Server (NTRS)

    Thrivikraman, Tushar; Hoffman, James

    2012-01-01

    This work presents a new measurement technique, mixed-signal active harmonic load-pull (MSALP) developed by Anterverta-mw in partnership with Maury Microwave, that allows for wide-band ultra-high efficiency amplifiers to be designed using GaN technology. An overview of the theory behind active load-pull is presented and why load-pull is important for high-power device characterization. In addition, an example procedure is presented that outlines a methodology for amplifier design using this measurement system. Lastly, measured results of a 10W GaN amplifier are presented. This work aims to highlight the benefit of using this sophisticated measurement systems for to optimize amplifier design for real radar waveforms that in turn will simplify implementation of space-based radar systems

  17. Single-pass UV generation at 222.5 nm based on high-power GaN external cavity diode laser.

    PubMed

    Ruhnke, N; Müller, A; Eppich, B; Güther, R; Maiwald, M; Sumpf, B; Erbert, G; Tränkle, G

    2015-05-01

    We demonstrate a compact system for single-pass frequency doubling of high-power GaN diode laser radiation. The deep UV laser light at 222.5 nm is generated in a β-BaB2O4 (BBO) crystal. A high-power GaN external cavity diode laser (ECDL) system in Littrow configuration with narrowband emission at 445 nm is used as pump source. At a pump power of 680 mW, a maximum UV power of 16 μW in continuous-wave operation at 222.5 nm is achieved. This concept enables a compact diode laser-based system emitting in the deep ultraviolet spectral range.

  18. High kappa Dielectrics on InGaAs and GaN - Growth, Interfacial Structural Studies, and Surface Fermi Level Unpinning

    DTIC Science & Technology

    2011-04-20

    devices, e.g. hetero-junction field-effect transistors (HFETs) and bipolar junction transistors (BJTs). Compared to conventional high power RF...AlGaN/GaN HFETs, GaN metal-oxide-semiconductor field-effect- transistors (MOSFETs) feature lower gate leakage currents, a larger gate voltage sweep range...reporting burden for the collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching

  19. Self-organization of dislocation-free, high-density, vertically aligned GaN nanocolumns involving InGaN quantum wells on graphene/SiO2 covered with a thin AlN buffer layer.

    PubMed

    Hayashi, Hiroaki; Konno, Yuta; Kishino, Katsumi

    2016-02-05

    We demonstrated the self-organization of high-density GaN nanocolumns on multilayer graphene (MLG)/SiO2 covered with a thin AlN buffer layer by RF-plasma-assisted molecular beam epitaxy. MLG/SiO2 substrates were prepared by the transfer of CVD graphene onto thermally oxidized SiO2/Si [100] substrates. Employing the MLG with an AlN buffer layer enabled the self-organization of high-density and vertically aligned nanocolumns. Transmission electron microscopy observation revealed that no threading dislocations, stacking faults, or twinning defects were included in the self-organized nanocolumns. The photoluminescence (PL) peak intensities of the self-organized GaN nanocolumns were 2.0-2.6 times higher than those of a GaN substrate grown by hydride vapor phase epitaxy. Moreover, no yellow luminescence or ZB-phase GaN emission was observed from the nanocolumns. An InGaN/GaN MQW and p-type GaN were integrated into GaN nanocolumns grown on MLG, displaying a single-peak PL emission at a wavelength of 533 nm. Thus, high-density nitride p-i-n nanocolumns were fabricated on SiO2/Si using the transferred MLG interlayer, indicating the possibility of developing visible nanocolumn LEDs on graphene/SiO2.

  20. Topical Review: Development of overgrown semi-polar GaN for high efficiency green/yellow emission

    NASA Astrophysics Data System (ADS)

    Wang, T.

    2016-09-01

    The most successful example of large lattice-mismatched epitaxial growth of semiconductors is the growth of III-nitrides on sapphire, leading to the award of the Nobel Prize in 2014 and great success in developing InGaN-based blue emitters. However, the majority of achievements in the field of III-nitride optoelectronics are mainly limited to polar GaN grown on c-plane (0001) sapphire. This polar orientation poses a number of fundamental issues, such as reduced quantum efficiency, efficiency droop, green and yellow gap in wavelength coverage, etc. To date, it is still a great challenge to develop longer wavelength devices such as green and yellow emitters. One clear way forward would be to grow III-nitride device structures along a semi-/non-polar direction, in particular, a semi-polar orientation, which potentially leads to both enhanced indium incorporation into GaN and reduced quantum confined Stark effects. This review presents recent progress on developing semi-polar GaN overgrowth technologies on sapphire or Si substrates, the two kinds of major substrates which are cost-effective and thus industry-compatible, and also demonstrates the latest achievements on electrically injected InGaN emitters with long emission wavelengths up to and including amber on overgrown semi-polar GaN. Finally, this review presents a summary and outlook on further developments for semi-polar GaN based optoelectronics.

  1. Defect analysis in GaN films of HEMT structure by cross-sectional cathodoluminescence

    NASA Astrophysics Data System (ADS)

    Isobe, Yasuhiro; Hung, Hung; Oasa, Kohei; Ono, Tasuku; Onizawa, Takashi; Yoshioka, Akira; Takada, Yoshiharu; Saito, Yasunobu; Sugiyama, Naoharu; Tsuda, Kunio; Sugiyama, Toru; Mizushima, Ichiro

    2017-06-01

    Defect analysis of GaN films in high electron mobility transistor (HEMT) structures by cross-sectional cathodoluminescence (X-CL) is demonstrated as a useful technique for improving the current collapse of GaN-HEMT devices, and the relationship between crystal quality and device characteristics is also investigated. The crystal quality of intrinsic-GaN (i-GaN) and carbon-doped GaN produced clearly different peak intensities of blue luminescence (BL), yellow luminescence (YL), and band-edge emission (BE), which is independently detected by X-CL. Current collapse in GaN-HEMT devices is found to be determined by the BL/BE and YL/BE ratios at the top of the i-GaN layer, which is close to the channel. Moreover, the i-GaN thickness required in order to minimize the BL/BE and YL/BE ratios and the thickness dependency of GaN for minimizing the BL/BE and YL/BE ratios depending on the growth conditions can be evaluated by X-CL. However, there is no correlation between current collapse in GaN-HEMT devices and the YL/BE ratio by conventional photoluminescence because HEMT devices consist of multiple GaN layers and the YL signal is detected from the carbon-doped GaN layer. Thus, the X-CL analysis method is a useful technique for device design in order to suppress current collapse.

  2. Anisotropic structural and optical properties of semi-polar (11–22) GaN grown on m-plane sapphire using double AlN buffer layers

    PubMed Central

    Zhao, Guijuan; Wang, Lianshan; Yang, Shaoyan; Li, Huijie; Wei, Hongyuan; Han, Dongyue; Wang, Zhanguo

    2016-01-01

    We report the anisotropic structural and optical properties of semi-polar (11–22) GaN grown on m-plane sapphire using a three-step growth method which consisted of a low temperature AlN buffer layer, followed by a high temperature AlN buffer layer and GaN growth. By introducing double AlN buffer layers, we substantially improve the crystal and optical qualities of semi-polar (11–22) GaN, and significantly reduce the density of stacking faults and dislocations. The high resolution x-ray diffraction measurement revealed that the in-plane anisotropic structural characteristics of GaN layer are azimuthal dependent. Transmission electron microscopy analysis showed that the majority of dislocations in the GaN epitaxial layer grown on m-sapphire are the mixed-type and the orientation of GaN layer was rotated 58.4° against the substrate. The room temperature photoluminescence (PL) spectra showed the PL intensity and wavelength have polarization dependence along parallel and perpendicular to the [1–100] axis (polarization degrees ~ 0.63). The realization of a high polarization semi-polar GaN would be useful to achieve III-nitride based lighting emission device for displays and backlighting. PMID:26861595

  3. Mg-compensation effect in GaN buffer layer for AlGaN/GaN high-electron-mobility transistors grown on 4H-SiC substrate

    NASA Astrophysics Data System (ADS)

    Ko, Kwangse; Lee, Kyeongjae; So, Byeongchan; Heo, Cheon; Lee, Kyungbae; Kwak, Taemyung; Han, Sang-Woo; Cha, Ho-Young; Nam, Okhyun

    2017-01-01

    The present study investigated the Mg doping effect in the gallium nitride (GaN) buffer layers (BLs) of AlGaN/GaN high-electron-mobility transistor (HEMT) structures grown on semi-insulating 4H-SiC substrates by metal organic chemical vapor deposition. When the Mg concentration was increased from 3 × 1017 to 8 × 1018 cm-3, the crystal quality slightly deteriorated, whereas electrical properties were significantly changed. The buffer leakage increased approximately 50 times from 0.77 to 39.2 nA at -50 V with the Mg doping concentration. The Mg-compensation effect and electron trapping effect were observed at Mg concentration of 3 × 1017 and 8 × 1018 cm-3, respectively, which were confirmed by an isolation leakage current test and low-temperature photoluminescence. When the BL was compensated, the two-dimensional electron gas (2DEG) mobility and sheet carrier concentration of the HEMTs were 1560 cm2 V-1 s-1 and 5.06 × 1012 cm-2, respectively. As a result, Mg-doped GaN BLs were demonstrated as a candidates of semi-insulating BLs for AlGaN/GaN HEMT.

  4. Optical properties of GaN pyramids

    SciTech Connect

    Zeng, K.C.; Lin, J.Y.; Jiang, H.X.; Yang, W.

    1999-03-01

    Picosecond time-resolved photoluminescence (PL) spectroscopy has been used to investigate the optical properties of GaN pyramids overgrown on hexagonal-patterned GaN(0001) epilayers on sapphire and silicon substrates with AlN buffer layers. We found that: (i) the release of the biaxial compressive strain in GaN pyramids on GaN/AlN/sapphire substrate led to a 7 meV redshift of the spectral peak position with respect to the strained GaN epilayer grown under identical conditions; (ii) in the GaN pyramids on GaN/AlN/sapphire substrate, strong band edge transitions with much narrower linewidths than those in the GaN epilayer have been observed, indicating the improved crystalline quality of the overgrown pyramids; (iii) PL spectra taken from different parts of the pyramids revealed that the top of the pyramid had the highest crystalline quality; and (iv) the presence of strong band-to-impurity transitions in the pyramids were primarily due to the incorporation of the oxygen and silicon impurities from the SiO{sub 2} mask. {copyright} {ital 1999 American Institute of Physics.}

  5. Magnetic Resonance Studies of the 3.0 eV PL Band in High-Resistivity GaN

    NASA Astrophysics Data System (ADS)

    Glaser, E. R.; Kennedy, T. A.; Freitas, J. A., Jr.; Wickenden, A. E.; Koleske, D. D.

    1997-03-01

    Optically-detected magnetic resonance (ODMR) experiments have been performed on the broad 3.0 eV PL band from high-resistivity (HR) GaN layers. This band has recently been assigned to strongly phonon-coupled distant DAP recombination involving three residual donors (Ed ~34, 54, and 57 meV) and residual acceptors (E_a ~116 meV).(U. Kaufmann et al., Mat. Res. Soc. Proc. Vol. 395, 619 (1996).) Two ODMR signals are found on this band. The first resonance is sharp (ΔB ~3.5 mT) with g ~1.950 and is assigned to EM donors with E_d ~34 meV based on previous observations.(E.R. Glaser et al., Phys. Rev. B 51, 13326 (1995).) The second feature is much broader (ΔB ~18 mT) with a donor-like g-value of ~ 1.977. Due to the larger degree of wavefunction localization inferred from this g-value, the resonance is tentatively assigned to the deeper donor states (partially EM-like) ~ 55 meV below the CB edge. Thus, these donors may be the source of the strong electron-phonon coupling. The acceptors (not observed in ODMR) with E_a ~116 meV may play a role as compensation centers and, hence, with the HR character of these films. Work supported by the Office of Naval Research.

  6. Hot electron generation under large-signal radio frequency operation of GaN high-electron-mobility transistors

    NASA Astrophysics Data System (ADS)

    Latorre-Rey, Alvaro D.; Sabatti, Flavio F. M.; Albrecht, John D.; Saraniti, Marco

    2017-07-01

    In order to assess the underlying physical mechanisms of hot carrier-related degradation such as defect generation in millimeter-wave GaN power amplifiers, we have simulated the electron energy distribution function under large-signal radio frequency conditions in AlGaN/GaN high-electron-mobility transistors. Our results are obtained through a full band Monte Carlo particle-based simulator self-consistently coupled to a harmonic balance circuit solver. At lower frequency, simulations of a Class AB power amplifier at 10 GHz show that the peak hot electron generation is up to 43% lower under RF drive than it is under DC conditions, regardless of the input power or temperature of operation. However, at millimeter-wave operation up to 40 GHz, RF hot carrier generation reaches that from DC biasing and even exceeds it up to 75% as the amplifier is driven into compression. Increasing the temperature of operation also shows that degradation of DC and RF characteristics are tightly correlated and mainly caused by increased phonon scattering. The accurate determination of the electron energy mapping is demonstrated to be a powerful tool for the extraction of compact models used in lifetime and reliability analysis.

  7. Study of interface barrier of SiNx/GaN interface for nitrogen-polar GaN based high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Nidhi, Rajan, Siddharth; Keller, Stacia; Wu, Feng; DenBaars, Steven P.; Speck, James S.; Mishra, Umesh K.

    2008-06-01

    The SiNx/GaN interface barrier height for N-polar GaN based metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) was investigated. N-polar SiNx/GaN/AlGaN/GaN MISHEMT structures with different GaN cap thicknesses were grown by metal-organic chemical vapor deposition. The properties of the SiNx/GaN interface are of critical importance to device operation and modeling in these devices. An analytical expression for the pinch-off voltage of the HEMT was obtained, and capacitance-voltage (C-V) measurements with different Schottky metals were used to extract the barrier height. The Fermi level at the interface was found to be pinned at approximately 1 eV with respect to GaN conduction band edge, irrespective of the work function of the gate metal. Hall measurements of the two-dimensional electron gas density were found to corroborate the predicted interface barrier height. An approximate value for interface charge causing this pinning was calculated to be 4.5×1012 cm-2.

  8. Strain in epitaxial Bi2Se3 grown on GaN and graphene substrates: A reflection high-energy electron diffraction study

    NASA Astrophysics Data System (ADS)

    Li, Bin; Guo, Xin; Ho, Wingkin; Xie, Maohai

    2015-08-01

    Topological insulator (TI) has been one of the focus research themes in condensed matter physics in recent years. Due to the relatively large energy bandgap, Bi2Se3 has been identified as one of the most promising three-dimensional TIs with application potentials. Epitaxial Bi2Se3 by molecular-beam epitaxy has been reported by many groups using different substrates. A common feature is that Bi2Se3 grows readily along the c-axis direction irrespective of the type and condition of the substrate. Because of the weak van deer Waals interaction between Bi2Se3 quintuple layers, the grown films are reported to be strain-free, taking the lattice constant of the bulk crystal. At the very initial stage of Bi2Se3 deposition, however, strain may still exist depending on the substrate. Strain may bring some drastic effects to the properties of the TIs and so achieving strained TIs can be of great fundamental interests as well as practical relevance. In this work, we employ reflection high-energy electron diffraction to follow the lattice constant evolution of Bi2Se3 during initial stage depositions on GaN and graphene, two very different substrates. We reveal that epitaxial Bi2Se3 is tensile strained on GaN but strain-free on graphene. Strain relaxation on GaN is gradual.

  9. Tri-halide vapor phase epitaxy of thick GaN using gaseous GaCl3 precursor

    NASA Astrophysics Data System (ADS)

    Murakami, Hisashi; Takekawa, Nao; Shiono, Anna; Thieu, Quang Tu; Togashi, Rie; Kumagai, Yoshinao; Matsumoto, Koh; Koukitu, Akinori

    2016-12-01

    Tri-halide vapor phase epitaxy (THVPE) of thick GaN using GaCl3 was investigated for fabricating low-cost, high-crystalline-quality GaN substrates instead of the conventional manufacturing method of GaCl-based hydride vapor phase epitaxy (HVPE). The growth rate and upper growth temperature limit of GaN using THVPE were found to be much higher than those obtained using conventional HVPE under the same growth conditions. Drastic reduction in the number of dark spots measured by cathodoluminescence at room temperature was observed for the high-temperature-grown GaN layer on the (000-1) GaN/sapphire template due to the enhancement of precursor migration on the growing surface. It was found that the incorporation of impurities such as O, C, and Cl can be reduced even on the N-polarity GaN by increasing the growth temperature. The possibility of enlargement of the crystal diameter by growing the N-polarity GaN layer using THVPE was also proposed.

  10. Study on GaN buffer leakage current in AlGaN/GaN high electron mobility transistor structures grown by ammonia-molecular beam epitaxy on 100-mm Si(111)

    SciTech Connect

    Ravikiran, L.; Radhakrishnan, K. Ng, G. I.; Munawar Basha, S.; Dharmarasu, N.; Agrawal, M.; Manoj kumar, C. M.; Arulkumaran, S.

    2015-06-28

    The effect of carbon doping on the structural and electrical properties of GaN buffer layer of AlGaN/GaN high electron mobility transistor (HEMT) structures has been studied. In the undoped HEMT structures, oxygen was identified as the dominant impurity using secondary ion mass spectroscopy and photoluminescence (PL) measurements. In addition, a notable parallel conduction channel was identified in the GaN buffer at the interface. The AlGaN/GaN HEMT structures with carbon doped GaN buffer using a CBr{sub 4} beam equivalent pressure of 1.86 × 10{sup −7} mTorr showed a reduction in the buffer leakage current by two orders of magnitude. Carbon doped GaN buffers also exhibited a slight increase in the crystalline tilt with some pits on the growth surface. PL and Raman measurements indicated only a partial compensation of donor states with carbon acceptors. However, AlGaN/GaN HEMT structures with carbon doped GaN buffer with 200 nm thick undoped GaN near the channel exhibited good 2DEG characteristics.

  11. Luminescence of GaN nanocolumns obtained by photon-assisted anodic etching

    NASA Astrophysics Data System (ADS)

    Tiginyanu, I. M.; Ursaki, V. V.; Zalamai, V. V.; Langa, S.; Hubbard, S.; Pavlidis, D.; Föll, H.

    2003-08-01

    GaN nanocolumns with transverse dimensions of about 50 nm were obtained by illumination-assisted anodic etching of epilayers grown by metalorganic chemical vapor deposition on sapphire substrates. The photoluminescence spectroscopy characterization shows that the as-grown bulk GaN layers suffer from compressive biaxial strain of 0.5 GPa. The majority of nanocolumns are fully relaxed from strain, and the room-temperature luminescence is free excitonic. The high quality of the columnar nanostructures evidenced by the enhanced intensity of the exciton luminescence and by the decrease of the yellow luminescence is explained by the peculiarities of the anodic etching processing.

  12. Selectively Enhanced UV-A Photoresponsivity of a GaN MSM UV Photodetector with a Step-Graded AlxGa1−xN Buffer Layer

    PubMed Central

    Lee, Chang-Ju; Won, Chul-Ho; Lee, Jung-Hee; Hahm, Sung-Ho; Park, Hongsik

    2017-01-01

    The UV-to-visible rejection ratio is one of the important figure of merits of GaN-based UV photodetectors. For cost-effectiveness and large-scale fabrication of GaN devices, we tried to grow a GaN epitaxial layer on silicon substrate with complicated buffer layers for a stress-release. It is known that the structure of the buffer layers affects the performance of devices fabricated on the GaN epitaxial layers. In this study, we show that the design of a buffer layer structure can make effect on the UV-to-visible rejection ratio of GaN UV photodetectors. The GaN photodetector fabricated on GaN-on-silicon substrate with a step-graded AlxGa−xN buffer layer has a highly-selective photoresponse at 365-nm wavelength. The UV-to-visible rejection ratio of the GaN UV photodetector with the step-graded AlxGa1−xN buffer layer was an order-of-magnitude higher than that of a photodetector with a conventional GaN/AlN multi buffer layer. The maximum photoresponsivity was as high as 5 × 10−2 A/W. This result implies that the design of buffer layer is important for photoresponse characteristics of GaN UV photodetectors as well as the crystal quality of the GaN epitaxial layers. PMID:28753989

  13. Microstructures of GaN and In{sub x}Ga{sub 1-x}N films grown by MOCVD on free-standing GaN templates

    SciTech Connect

    Jasinski, J.; Liliental-Weber, Z.; Huang, D.; Reshchikov, M.A.; Yun, F.; Morkoc, H.; Sone, C.; Park, S.S.; Lee, K.Y.

    2002-04-30

    We summarize structural properties of thick HVPE GaN templates from the point of view of their application as substrates for growth of nitride layers. This is followed by the results of optical and structural studies, mostly transmission electron microscopy, of nitride layers grown by MOCVD on top of the HVPE substrates. The results indicate high structural quality of these layers with a low density of threading dislocations (in the range of 10{sup 6} cm{sup -2}). Convergent beam electron diffraction studies showed that the MOCVD GaN films have Ga-polarity, the same polarity as the HVPE GaN substrates. Structural studies of an InGaN layer grown on top of the MOCVD GaN film showed the presence of two layers, which differed in lattice parameter and composition. The upper layer, on the top of the structure had a c-lattice parameter about 2% larger than that of GaN and contained 10.3 {+-} 0.8% of In. Values measured for the thinner, intermediate layer adjacent to the GaN layer were about 2 .5 times lower.

  14. Self-assembled GaN nanowires on diamond.

    PubMed

    Schuster, Fabian; Furtmayr, Florian; Zamani, Reza; Magén, Cesar; Morante, Joan R; Arbiol, Jordi; Garrido, Jose A; Stutzmann, Martin

    2012-05-09

    We demonstrate the nucleation of self-assembled, epitaxial GaN nanowires (NWs) on (111) single-crystalline diamond without using a catalyst or buffer layer. The NWs show an excellent crystalline quality of the wurtzite crystal structure with m-plane faceting, a low defect density, and axial growth along the c-axis with N-face polarity, as shown by aberration corrected annular bright-field scanning transmission electron microscopy. X-ray diffraction confirms single domain growth with an in-plane epitaxial relationship of (10 ̅10)(GaN) [parallel] (01 ̅1)(Diamond) as well as some biaxial tensile strain induced by thermal expansion mismatch. In photoluminescence, a strong and sharp excitonic emission reveals excellent optical properties superior to state-of-the-art GaN NWs on silicon substrates. In combination with the high-quality diamond/NW interface, confirmed by high-resolution transmission electron microscopy measurements, these results underline the potential of p-type diamond/n-type nitride heterojunctions for efficient UV optoelectronic devices.

  15. High-voltage thin-film GaN LEDs fabricated on ceramic substrates: the alleviated droop effect at 670 W/cm(2).

    PubMed

    Tsai, M L; Liao, J H; Yeh, J H; Hsu, T C; Hon, S J; Chung, T Y; Lai, K Y

    2013-11-04

    High-voltage thin-film GaN LEDs with the emission wavelength of 455 nm were fabricated on ceramic substrates (230 W/m · K). The high-voltage operation was achieved by three cascaded sub-LEDs with dielectric passivation and metal bridges conformally deposited on the side walls. Under the driving power of 670 W/cm(2), the high-voltage LEDs exhibit much alleviated efficiency droop and the operative temperature below 80 °C. The excellent performances were attributed to the improved current spreading within each sub-LED and the superior heat sinking of the ceramic substrate.

  16. Fabrication of well-aligned ZnO nanorods by hydrothermal process using GaN epitaxial layer

    NASA Astrophysics Data System (ADS)

    Jang, Jae-Min; Yi, Sung-Hak; Choi, Seung-Kyu; Kim, Jung-A.; Jung, Woo-Gwang

    2007-02-01

    One dimensional (1-D) ZnO nanorod structure of hexagonal shape was fabricated on epitaxial GaN layer by hydrothermal method. The growth of GaN epitaxial layer was carried out in a two-flow horizontal MOCVD reactor maintained at a pressure of 200 torr. Firstly, a 25 nm thick GaN buffer layer was grown at 520 °C. Then 2~3μm thick GaN epilayer was deposited at 1070 °C. Trimethylgallium (TMG) and NH 3 were used as Ga and N source, and H II gas was used as carrier gas. After the deposition of GaN epilayer thin-film, single crystalline ZnO nanorod was fabricated in aqueous solution. XRD and FE-SEM results showed ZnO nanorod arrays were oriented highly along the (002) plane. The ZnO nanorod was analyzed to have good quality crystallization by FE-TEM. The SAED pattern has shown that ZnO nanorod was grown in the direction along (002)-plane. Photoluminescence (PL) has shown that the GaN-ZnO hetero-structure has shown ultra-violet lasing action at room temperature. Narrow and strong ultra-violet peak was observed in comparison with PL result from epitaxial GaN layer. The analysis results have proved that aqueous solution growth method developed in the present work can be a good application for optical electronic device.

  17. Improved performance of GaN based light emitting diodes with ex-situ sputtered AlN nucleation layers

    SciTech Connect

    Chen, Shuo-Wei; Li, Heng; Lu, Tien-Chang

    2016-04-15

    The crystal quality, electrical and optical properties of GaN based light emitting diodes (LEDs) with ex-situ sputtered physical vapor deposition (PVD) aluminum nitride (AlN) nucleation layers were investigated. It was found that the crystal quality in terms of defect density and x-ray diffraction linewidth was greatly improved in comparison to LEDs with in-situ low temperature GaN nucleation layer. The light output power was 3.7% increased and the reverse bias voltage of leakage current was twice on LEDs with ex-situ PVD AlN nucleation layers. However, larger compressive strain was discovered in LEDs with ex-situ PVD AlN nucleation layers. The study shows the potential and constrain in applying ex-situ PVD AlN nucleation layers to fabricate high quality GaN crystals in various optoelectronics.

  18. Improved performance of GaN based light emitting diodes with ex-situ sputtered AlN nucleation layers

    NASA Astrophysics Data System (ADS)

    Chen, Shuo-Wei; Li, Heng; Lu, Tien-Chang

    2016-04-01

    The crystal quality, electrical and optical properties of GaN based light emitting diodes (LEDs) with ex-situ sputtered physical vapor deposition (PVD) aluminum nitride (AlN) nucleation layers were investigated. It was found that the crystal quality in terms of defect density and x-ray diffraction linewidth was greatly improved in comparison to LEDs with in-situ low temperature GaN nucleation layer. The light output power was 3.7% increased and the reverse bias voltage of leakage current was twice on LEDs with ex-situ PVD AlN nucleation layers. However, larger compressive strain was discovered in LEDs with ex-situ PVD AlN nucleation layers. The study shows the potential and constrain in applying ex-situ PVD AlN nucleation layers to fabricate high quality GaN crystals in various optoelectronics.

  19. Long-Lived, Coherent Acoustic Phonon Oscillations in GaN Single Crystals

    SciTech Connect

    Wu, S.; Geiser, P.; Jun, J.; Karpinski, J.; Park, J.-R.; Sobolewski, R.

    2006-01-31

    We report on coherent acoustic phonon (CAP) oscillations studied in high-quality bulk GaN single crystals with a two-color femtosecond optical pump-probe technique. Using a far-above-the-band gap ultraviolet excitation (~270 nm wavelength) and a near-infrared probe beam (~810 nm wavelength), the long-lived, CAP transients were observed within a 10 ns time-delay window between the pump and probe pulses, with a dispersionless (proportional to the probe-beam wave vector) frequency of ~45 GHz. The measured CAP attenuation corresponded directly to the absorption of the probe light in bulk GaN, indicating that the actual (intrinsic) phonon-wave attenuation in our crystals was significantly smaller than the measured 65.8 cm^-1 value. The velocity of the phonon propagation was equal to the velocity of sound in GaN.

  20. Electrical characterization of ensemble of GaN nanowires grown by the molecular beam epitaxy technique

    NASA Astrophysics Data System (ADS)

    Kolkovsky, Vl.; Zytkiewicz, Z. R.; Sobanska, M.; Klosek, K.

    2013-08-01

    High quality Schottky contacts are formed on GaN nanowires (NWs) structures grown by the molecular beam epitaxy technique on Si(111) substrate. The current-voltage characteristics show the rectification ratio of about 103 and the leakage current of about 10-4 A/cm2 at room temperature. From the capacitance-voltage measurements the free carrier concentration in GaN NWs is determined as about 1016 cm-3. Two deep levels (H200 and E280) are found in the structures containing GaN NWs. H200 is attributed to an extended defect located at the interface between the substrate and SiNx or near the sidewalls at the bottom of the NWs whereas E280 is tentatively assigned to a gallium-vacancy- or nitrogen interstitials-related defect.

  1. Coaxial metal-oxide-semiconductor (MOS) Au/Ga2O3/GaN nanowires.

    PubMed

    Hsieh, Chin-Hua; Chang, Mu-Tung; Chien, Yu-Jen; Chou, Li-Jen; Chen, Lih-Juann; Chen, Chii-Dong

    2008-10-01

    Coaxial metal-oxide-semiconductor (MOS) Au-Ga2O3-GaN heterostructure nanowires were successfully fabricated by an in situ two-step process. The Au-Ga2O3 core-shell nanowires were first synthesized by the reaction of Ga powder, a mediated Au thin layer, and a SiO2 substrate at 800 degrees C. Subsequently, these core-shell nanowires were nitridized in ambient ammonia to form a GaN coating layer at 600 degrees C. The GaN shell is a single crystal, an atomic flat interface between the oxide and semiconductor that ensures that the high quality of the MOS device is achieved. These novel 1D nitride-based MOS nanowires may have promise as building blocks to the future nitride-based vertical nanodevices.

  2. ScAlMgO{sub 4}: An oxide substrate for GaN epitaxy

    SciTech Connect

    Hellman, E.S.; Brandle, C.D.; Schneemeyer, L.F.; Wiesmann, D.; Brener, I.; Siegrist, T.; Berkstresser, G.W.; Buchanan, D.N.E.; Hartford, E.H. Jr.

    1996-11-01

    The authors report the use of ScAlMgO{sub 4} as a substrate for the epitaxial growth of wurzitic GaN. The low misfit (+ 1.8%) allows coherent epitaxy of GaN, as observed by RHEED. The congruent melting of ScAlMgO{sub 4} makes Czochralski growth possible, suggesting that large, high quality substrates can be realized. Boules about 17 mm in diameter are reported. The authors have used nitrogen-plasma molecular beam epitaxy to grow GaN epitaxial films onto ScAlMgO{sub 4} substrates. Band-gap photoluminescence has been observed from some of these films, depending primarily on the deposition conditions. A 3 x 3 superstructure has been observed by RHEED on the GaN surfaces. Structural analysis by x-ray diffraction indicates very good in-plane alignment of the GaN films. They also report thermal expansion measurements for ScAlMgO{sub 4}.

  3. Spatially resolved and orientation dependent Raman mapping of epitaxial lateral overgrowth nonpolar a-plane GaN on r-plane sapphire

    PubMed Central

    Jiang, Teng; Xu, Sheng-rui; Zhang, Jin-cheng; Xie, Yong; Hao, Yue

    2016-01-01

    Uncoalesced a-plane GaN epitaxial lateral overgrowth (ELO) structures have been synthesized along two mask stripe orientations on a-plane GaN template by MOCVD. The morphology of two ELO GaN structures is performed by Scanning electronic microscopy. The anisotropy of crystalline quality and stress are investigated by micro-Raman spectroscopy. According to the Raman mapping spectra, the variations on the intensity, peak shift and the full width at half maximum (FWHM) of GaN E2 (high) peak indicate that the crystalline quality improvement occurs in the window region of the GaN stripes along [0001], which is caused by the dislocations bending towards the sidewalls. Conversely, the wing regions have better quality with less stress as the dislocations propagated upwards when the GaN stripes are along []. Spatial cathodoluminescence mapping results further support the explanation for the different dislocation growth mechanisms in the ELO processes with two different mask stripe orientations. PMID:26821824

  4. Heteroepitaxial VO{sub 2} thin films on GaN: Structure and metal-insulator transition characteristics

    SciTech Connect

    Zhou You; Ramanathan, Shriram

    2012-10-01

    Monolithic integration of correlated oxide and nitride semiconductors may open up new opportunities in solid-state electronics and opto-electronics that combine desirable functional properties of both classes of materials. Here, we report on epitaxial growth and phase transition-related electrical properties of vanadium dioxide (VO{sub 2}) thin films on GaN epitaxial layers on c-sapphire. The epitaxial relation is determined to be (010){sub vo{sub 2}} parallel (0001){sub GaN} parallel (0001){sub A1{sub 2O{sub 3}}} and [100]{sub vo{sub 2}} parallel [1210]{sub GaN} parallel [0110]{sub A1{sub 2O{sub 3}}} from x-ray diffraction. VO{sub 2} heteroepitaxial growth and lattice mismatch are analyzed by comparing the GaN basal plane (0001) with the almost close packed corrugated oxygen plane in vanadium dioxide and an experimental stereographic projection describing the orientation relationship is established. X-ray photoelectron spectroscopy suggests a slightly oxygen rich composition at the surface, while Raman scattering measurements suggests that the quality of GaN layer is not significantly degraded by the high-temperature deposition of VO{sub 2}. Electrical characterization of VO{sub 2} films on GaN indicates that the resistance changes by about four orders of magnitude upon heating, similar to epitaxial VO{sub 2} films grown directly on c-sapphire. It is shown that the metal-insulator transition could also be voltage-triggered at room temperature and the transition threshold voltage scaling variation with temperature is analyzed in the framework of a current-driven Joule heating model. The ability to synthesize high quality correlated oxide films on GaN with sharp phase transition could enable new directions in semiconductor-photonic integrated devices.

  5. SF6/O2 plasma effects on silicon nitride passivation of AlGaN /GaN high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Meyer, David J.; Flemish, Joseph R.; Redwing, Joan M.

    2006-11-01

    The effects of various plasma and wet chemical surface pretreatments on the electrical characteristics of AlGaN /GaN high electron mobility transistors (HEMTs) passivated with plasma-deposited silicon nitride were investigated. The results of pulsed IV measurements show that samples exposed to various SF6/O2 plasma treatments have markedly better rf dispersion characteristics compared to samples that were either untreated or treated in wet buffered oxide etch prior to encapsulation. The improvement in these characteristics correlates with the reduction of carbon on the semiconductor surface as measured with x-ray photoelectron spectroscopy. HEMT channel sheet resistance was also affected by varying silicon nitride deposition parameters.

  6. X-ray absorption near-edge structure of GaN with high Mn concentration grown on SiC

    NASA Astrophysics Data System (ADS)

    Sancho-Juan, O.; Cantarero, A.; Garro, N.; Cros, A.; Martínez-Criado, G.; Salomé, M.; Susini, J.; Olguín, D.; Dhar, S.

    2009-07-01

    By means of x-ray absorption near-edge structure (XANES) several Ga1-xMnxN (0.03GaN samples consisted of different epilayers grown by molecular beam epitaxy on [0001] SiC substrates. The low mismatch between GaN and SiC allows for a good quality and homogeneity of the material. The measurements were performed in fluorescence mode around both the Ga and Mn K edges. All samples studied present a similar Mn ionization state, very close to 2+, and tetrahedral coordination. In order to interpret the near-edge structure, we have performed ab initio calculations using the full potential linear augmented plane wave method as implemented in the Wien2k code. The calculations show the appearance of a Mn bonding \\mathrm {t_{2}}\\uparrow band localized in the gap region, and the corresponding anti-bonding state \\mathrm {t_{2}}\\downarrow , which seem to be responsible for the double structure which appears at the pre-edge absorption region. The shoulders and main absorption peak of the XANES spectra are attributed to transitions from the Mn(1s) band to the conduction bands, which are partially dipole allowed because of the Mn(4p) contribution to these bands.

  7. High efficiency GaN LEDs with submicron-scale 2Dperiodic structures directly fabricated by laser interference ablation

    NASA Astrophysics Data System (ADS)

    Chen, Yuanyuan; Yuan, Dajun; Yang, Muchuan; Wang, Deli; Sun, Xiaohan

    2017-05-01

    We report the investigation of directly ablating submicron-scale 2D periodic structure method on the p-layer of blue GaN light-emitting diode (LED) by laser interference. Hexagonal lattice structures on the p-layer surface of GaN LED are fabricated by three beam laser interference and the air hole radius can be changed by adjusting the laser fluence. The structure with a period of 400 nm, hole radius of 180 nm, and depth of 78 nm is patterned with the laser fluence of 215 mJ/cm2. Experimental results coincide well with the simulation, and reveal that the patterned LED get a maximum enhancement of 55.7% in light output power compared to flat LED.

  8. High-performance GaN metal-insulator-semiconductor ultraviolet photodetectors using gallium oxide as gate layer.

    PubMed

    Lee, Ming-Lun; Mue, T S; Huang, F W; Yang, J H; Sheu, J K

    2011-06-20

    In this study, gallium nitride (GaN)-based metal-insulator-semiconductor (MIS) ultraviolet (UV) photodetectors (PDs) with a gallium oxide (GaO(x)) gate layer formed by alternating current bias-assisted photoelectrochemical oxidation of n-GaN are presented. By introducing the GaO(x) gate layer to the GaN MIS UV PDs, the leakage current is reduced and a much larger UV-to-visible rejection ratio (R(UV/vis)) of spectral responsivity is achieved. In addition, a bias-dependent spectral response results in marked increase of the R(UV/vis) with bias voltage up to ~10(5). The bias-dependent responsivity suggests the possible existence of internal gain in of the GaN MIS PDs.

  9. High carrier activation of Mg ion-implanted GaN by conventional rapid thermal annealing

    NASA Astrophysics Data System (ADS)

    Niwa, Takaki; Fujii, Takahiro; Oka, Tohru

    2017-09-01

    A high activation ratio of Mg ion implantation by conventional rapid thermal annealing (RTA) was demonstrated. To obtain the high activation ratio of Mg ion implantation, the dependence of hole concentration on Mg dose was investigated. A maximum hole concentration and a high activation ratio of 2.3% were obtained at a Mg dose of 2.3 × 1014 cm-2 between 9.2 × 1013 and 2.3 × 1015 cm-2. The ratio is, to the best of our knowledge, the highest ever obtained by conventional RTA.

  10. 450-nm GaN laser diode enables high-speed visible light communication with 9-Gbps QAM-OFDM.

    PubMed

    Chi, Yu-Chieh; Hsieh, Dan-Hua; Tsai, Cheng-Ting; Chen, Hsiang-Yu; Kuo, Hao-Chung; Lin, Gong-Ru

    2015-05-18

    A TO-38-can packaged Gallium nitride (GaN) blue laser diode (LD) based free-space visible light communication (VLC) with 64-quadrature amplitude modulation (QAM) and 32-subcarrier orthogonal frequency division multiplexing (OFDM) transmission at 9 Gbps is preliminarily demonstrated over a 5-m free-space link. The 3-dB analog modulation bandwidth of the TO-38-can packaged GaN blue LD biased at 65 mA and controlled at 25°C is only 900 MHz, which can be extended to 1.5 GHz for OFDM encoding after throughput intensity optimization. When delivering the 4-Gbps 16-QAM OFDM data within 1-GHz bandwidth, the error vector magnitude (EVM), signal-to-noise ratio (SNR) and bit-error-rate (BER) of the received data are observed as 8.4%, 22.4 dB and 3.5 × 10(-8), respectively. By increasing the encoded bandwidth to 1.5 GHz, the TO-38-can packaged GaN blue LD enlarges its transmission capacity to 6 Gbps but degrades its transmitted BER to 1.7 × 10(-3). The same transmission capacity of 6 Gbps can also be achieved with a BER of 1 × 10(-6) by encoding 64-QAM OFDM data within 1-GHz bandwidth. Using the 1.5-GHz full bandwidth of the TO-38-can packaged GaN blue LD provides the 64-QAM OFDM transmission up to 9 Gbps, which successfully delivers data with an EVM of 5.1%, an SNR of 22 dB and a BER of 3.6 × 10(-3) passed the forward error correction (FEC) criterion.

  11. GaN Device Processing

    SciTech Connect

    Pearton, S.J.; Ren, F.; Zolper, J.C.; Shul, R.J.

    1998-01-01

    Recent progress in the development of dry and wet etching techniques, implant doping and isolation, thermal processing, gate insulator technology and high reliability contacts is reviewed. Etch selectivities up to 10 for InN over AlN are possible in Inductively Coupled Plasmas using a Cl2/Ar chemistry, but in general selectivities for each binary nitride relative to each other are low ({lt} OR = 2) BECAUSE OF THE HIGH ION ENERGIES NEEDED TO INITIATE ETCHING. IMPROVED N-TYPE OHMIC CONTACT RESISTANCES ARE OBTAINED BY SELECTIVE AREA SI+ IMPLANTATION FOLLOWED BY VERY HIGH TEMPERATURE ({gt}1300 deg C) anneals in which the thermal budget is minimized and AlN encapsulation prevents GaN surface decomposition. Implant isolation is effective in GaN, AlGaN and AlInN, but marginal in InGaN. Candidate gate insulators for GaN include AlN, AlON and Ga(Gd)O(x), but interface state densities are still to high to realize state-of-the-art MIS devices.

  12. Wafer-scale Fabrication of Non-Polar Mesoporous GaN Distributed Bragg Reflectors via Electrochemical Porosification

    NASA Astrophysics Data System (ADS)

    Zhu, Tongtong; Liu, Yingjun; Ding, Tao; Fu, Wai Yuen; Jarman, John; Ren, Christopher Xiang; Kumar, R. Vasant; Oliver, Rachel A.

    2017-03-01

    Distributed Bragg reflectors (DBRs) are essential components for the development of optoelectronic devices. For many device applications, it is highly desirable to achieve not only high reflectivity and low absorption, but also good conductivity to allow effective electrical injection of charges. Here, we demonstrate the wafer-scale fabrication of highly reflective and conductive non-polar gallium nitride (GaN) DBRs, consisting of perfectly lattice-matched non-polar (11-20) GaN and mesoporous GaN layers that are obtained by a facile one-step electrochemical etching method without any extra processing steps. The GaN/mesoporous GaN DBRs exhibit high peak reflectivities (>96%) across the entire visible spectrum and wide spectral stop-band widths (full-width at half-maximum >80 nm), while preserving the material quality and showing good electrical conductivity. Such mesoporous GaN DBRs thus provide a promising and scalable platform for high performance GaN-based optoelectronic, photonic, and quantum photonic devices.

  13. Wafer-scale Fabrication of Non-Polar Mesoporous GaN Distributed Bragg Reflectors via Electrochemical Porosification

    PubMed Central

    Zhu, Tongtong; Liu, Yingjun; Ding, Tao; Fu, Wai Yuen; Jarman, John; Ren, Christopher Xiang; Kumar, R. Vasant; Oliver, Rachel A.

    2017-01-01

    Distributed Bragg reflectors (DBRs) are essential components for the development of optoelectronic devices. For many device applications, it is highly desirable to achieve not only high reflectivity and low absorption, but also good conductivity to allow effective electrical injection of charges. Here, we demonstrate the wafer-scale fabrication of highly reflective and conductive non-polar gallium nitride (GaN) DBRs, consisting of perfectly lattice-matched non-polar (11–20) GaN and mesoporous GaN layers that are obtained by a facile one-step electrochemical etching method without any extra processing steps. The GaN/mesoporous GaN DBRs exhibit high peak reflectivities (>96%) across the entire visible spectrum and wide spectral stop-band widths (full-width at half-maximum >80 nm), while preserving the material quality and showing good electrical conductivity. Such mesoporous GaN DBRs thus provide a promising and scalable platform for high performance GaN-based optoelectronic, photonic, and quantum photonic devices. PMID:28345612

  14. Strain in epitaxial Bi{sub 2}Se{sub 3} grown on GaN and graphene substrates: A reflection high-energy electron diffraction study

    SciTech Connect

    Li, Bin; Guo, Xin; Ho, Wingkin; Xie, Maohai

    2015-08-24

    Topological insulator (TI) has been one of the focus research themes in condensed matter physics in recent years. Due to the relatively large energy bandgap, Bi{sub 2}Se{sub 3} has been identified as one of the most promising three-dimensional TIs with application potentials. Epitaxial Bi{sub 2}Se{sub 3} by molecular-beam epitaxy has been reported by many groups using different substrates. A common feature is that Bi{sub 2}Se{sub 3} grows readily along the c-axis direction irrespective of the type and condition of the substrate. Because of the weak van der Waals interaction between Bi{sub 2}Se{sub 3} quintuple layers, the grown films are reported to be strain-free, taking the lattice constant of the bulk crystal. At the very initial stage of Bi{sub 2}Se{sub 3} deposition, however, strain may still exist depending on the substrate. Strain may bring some drastic effects to the properties of the TIs and so achieving strained TIs can be of great fundamental interests as well as practical relevance. In this work, we employ reflection high-energy electron diffraction to follow the lattice constant evolution of Bi{sub 2}Se{sub 3} during initial stage depositions on GaN and graphene, two very different substrates. We reveal that epitaxial Bi{sub 2}Se{sub 3} is tensile strained on GaN but strain-free on graphene. Strain relaxation on GaN is gradual.

  15. Sensitivity Analysis of Algan/GAN High Electron Mobility Transistors to Process Variation

    DTIC Science & Technology

    2008-02-01

    fullest, specifically its use in high power amplifiers operating at GHz or higher frequencies. Unfortunately, there were, and still are, fabrication...simulated data and since optimal operation is found at Vmax the drop at -1V Vg is not explored in this research. Figure 60: Transconductance vs Vg...6 2.2.1 Transconductance (gm

  16. High drain current density and reduced gate leakage current in channel-doped AlGaN /GaN heterostructure field-effect transistors with Al2O3/Si3N4 gate insulator

    NASA Astrophysics Data System (ADS)

    Maeda, Narihiko; Wang, Chengxin; Enoki, Takatomo; Makimoto, Toshiki; Tawara, Takehiko

    2005-08-01

    Channel-doped AlGaN /GaN heterostructure field-effect transistors (HFETs) with metal-insulator-semiconductor (MIS) structures have been fabricated to obtain the high drain current density and reduced gate leakage current. A thin bilayer dielectric of Al2O3(4nm)/Si3N4(1nm) was used as the gate insulator, to simultaneously take advantage of the high-quality interface between Si3N4 and AlGaN, and high resistivity and a high dielectric constant of Al2O3. A MIS HFET with a gate length of 1.5μm has exhibited a record high drain current density of 1.87A/mm at a gate voltage (Vg) of +3V, which is ascribed to a high applicable Vg and a very high two-dimensional electron gas (2DEG) density of 2.6×1013cm-2 in the doped channel. The gate leakage current was reduced by two or three orders of magnitude, compared with that in normal HFETs without a gate insulator. The transconductance (gm) was 168mS/mm, which is high in the category of the MIS structure. Channel-doped MIS HFETs fabricated have thus been proved to exhibit the high current density, reduced gate leakage current, and relatively high transconductance, hence, promising for high-power applications.

  17. Surface state of GaN after rapid-thermal-annealing using AlN cap-layer

    NASA Astrophysics Data System (ADS)

    El-Zammar, G.; Khalfaoui, W.; Oheix, T.; Yvon, A.; Collard, E.; Cayrel, F.; Alquier, D.

    2015-11-01

    Critical issues need to be overcome to produce high performance Schottky diodes on gallium nitride (GaN). To activate dopant, high temperature thermal treatments are required but damage GaN surface where hexagonal pits appear and prevent any device processing. In this paper, we investigated the efficiency of cap-layers on GaN during thermal treatments to avoid degradation. Aluminum nitride (AlN) and silicon oxide (SiOx) were grown on GaN by direct current reactive magnetron sputtering and plasma-enhanced chemical vapor deposition, respectively. AlN growth parameters were studied to understand their effect on the grown layers and their protection efficiency. Focused ion beam was used to measure AlN layer thickness. Crystalline quality and exact composition were verified using X-ray diffraction and energy dispersive X-ray spectroscopy. Two types of rapid thermal annealing at high temperatures were investigated. Surface roughness and pits density were evaluated using atomic force microscopy and scanning electron microscopy. Cap-layers wet etching was processed in H3PO4 at 120 °C for AlN and in HF (10%) for SiOx. This work reveals effective protection of GaN during thermal treatments at temperatures as high as 1150 °C. Low surface roughness was obtained. Furthermore, no hexagonal pit was observed on the surface.

  18. High optical bandwidth GaN based photonic-crystal light-emitting diodes

    NASA Astrophysics Data System (ADS)

    Lin, Tung-Ching; Yin, Yu-Feng; Lan, Wen-Yi; Huang, JianJang

    2016-09-01

    Light emitting diodes (LEDs) for visible light communication (VLC) as radio sources is a solution to channel crowding of radio frequency (RF) signal. However, for the application on high-speed communication, getting higher bandwidth of LEDs is always the problem which is limited by the spontaneous carrier lifetime in the multiple quantum wells. In this paper, we proposed GaN-based LEDs accompanied with photonic crystal (PhC) nanostructure for high speed communication. Using the characteristic of photonic band selection in photonic crystal structure, the guided modes are modulated by RF signal. The PhC can also provide faster mode extraction. From time resolved photoluminescence (TRPL) at room temperature, carrier lifetime of both lower- and higher-order modes is shortened. By observing f-3dB -J curve, it reveals that the bandwidth of PhC LEDs is higher than that of typical LED. The optical - 3-dB bandwidth (f-3dB) can be achieved up to 240 MHz in the PhC LED (PhCLED). We conclude that the higher operation speed can be obtained due to faster radiative carrier recombination of extracted guided modes from the PhC nanostructure.

  19. Structural properties of Al-rich AlInN grown on c-plane GaN substrate by metal-organic chemical vapor deposition

    PubMed Central

    2014-01-01

    The attractive prospect for AlInN/GaN-based devices for high electron mobility transistors with advanced structure relies on high-quality AlInN epilayer. In this work, we demonstrate the growth of high-quality Al-rich AlInN films deposited on c-plane GaN substrate by metal-organic chemical vapor deposition. X-ray diffraction, scanning electron microscopy, and scanning transmission electron microscopy show that the films lattice-matched with GaN can have a very smooth surface with good crystallinity and uniform distribution of Al and In in AlInN. PMID:25489282

  20. Enhanced terahertz radiation from high stacking fault density nonpolar GaN

    NASA Astrophysics Data System (ADS)

    Metcalfe, Grace D.; Shen, Hongen; Wraback, Michael; Hirai, Asako; Wu, Feng; Speck, James S.

    2008-06-01

    Terahertz emission from high stacking fault density m-GaN has been observed using ultrafast pulse excitation. The terahertz signal exhibits a 360° periodicity with sample rotation and a polarity flip at 180°, characteristic of real carrier transport in an in-plane electric field parallel to the c axis induced by stacking fault (SF)-terminated internal polarization at wurtzite domain boundaries. The terahertz emission can be enhanced by several times relative to that from a SF-free m-GaN sample, for which the terahertz signal emanates from surface surge currents and diffusion-driven carrier transport normal to the surface and is independent of the c-axis orientation.

  1. Role of the ganSPQAB Operon in Degradation of Galactan by Bacillus subtilis

    PubMed Central

    Watzlawick, Hildegard; Altenbuchner, Josef

    2016-01-01

    ABSTRACT Bacillus subtilis possesses different enzymes for the utilization of plant cell wall polysaccharides. This includes a gene cluster containing galactan degradation genes (ganA and ganB), two transporter component genes (ganQ and ganP), and the sugar-binding lipoprotein-encoding gene ganS (previously known as cycB). These genes form an operon that is regulated by GanR. The degradation of galactan by B. subtilis begins with the activity of extracellular GanB. GanB is an endo-β-1,4-galactanase and is a member of glycoside hydrolase (GH) family 53. This enzyme was active on high-molecular-weight arabinose-free galactan and mainly produced galactotetraose as well as galactotriose and galactobiose. These galacto-oligosaccharides may enter the cell via the GanQP transmembrane proteins of the galactan ABC transporter. The specificity of the galactan ABC transporter depends on the sugar-binding lipoprotein, GanS. Purified GanS was shown to bind galactotetraose and galactotriose using thermal shift assay. The energy for this transport is provided by MsmX, an ATP-binding protein. The transported galacto-oligosaccharides are further degraded by GanA. GanA is a β-galactosidase that belongs to GH family 42. The GanA enzyme was able to hydrolyze short-chain β-1,4-galacto-oligosaccharides as well as synthetic β-galactopyranosides into galactose. Thermal shift assay as well as electrophoretic mobility shift assay demonstrated that galactobiose is the inducer of the galactan operon regulated by GanR. DNase I footprinting revealed that the GanR protein binds to an operator overlapping the −35 box of the σA-type promoter of Pgan, which is located upstream of ganS. IMPORTANCE Bacillus subtilis is a Gram-positive soil bacterium that utilizes different types of carbohydrates, such as pectin, as carbon sources. So far, most of the pectin degradation systems and enzymes have been thoroughly studied in B. subtilis. Nevertheless, the B. subtilis utilization system of galactan

  2. Role of the ganSPQAB Operon in Degradation of Galactan by Bacillus subtilis.

    PubMed

    Watzlawick, Hildegard; Morabbi Heravi, Kambiz; Altenbuchner, Josef

    2016-10-15

    Bacillus subtilis possesses different enzymes for the utilization of plant cell wall polysaccharides. This includes a gene cluster containing galactan degradation genes (ganA and ganB), two transporter component genes (ganQ and ganP), and the sugar-binding lipoprotein-encoding gene ganS (previously known as cycB). These genes form an operon that is regulated by GanR. The degradation of galactan by B. subtilis begins with the activity of extracellular GanB. GanB is an endo-β-1,4-galactanase and is a member of glycoside hydrolase (GH) family 53. This enzyme was active on high-molecular-weight arabinose-free galactan and mainly produced galactotetraose as well as galactotriose and galactobiose. These galacto-oligosaccharides may enter the cell via the GanQP transmembrane proteins of the galactan ABC transporter. The specificity of the galactan ABC transporter depends on the sugar-binding lipoprotein, GanS. Purified GanS was shown to bind galactotetraose and galactotriose using thermal shift assay. The energy for this transport is provided by MsmX, an ATP-binding protein. The transported galacto-oligosaccharides are further degraded by GanA. GanA is a β-galactosidase that belongs to GH family 42. The GanA enzyme was able to hydrolyze short-chain β-1,4-galacto-oligosaccharides as well as synthetic β-galactopyranosides into galactose. Thermal shift assay as well as electrophoretic mobility shift assay demonstrated that galactobiose is the inducer of the galactan operon regulated by GanR. DNase I footprinting revealed that the GanR protein binds to an operator overlapping the -35 box of the σ(A)-type promoter of Pgan, which is located upstream of ganS IMPORTANCE: Bacillus subtilis is a Gram-positive soil bacterium that utilizes different types of carbohydrates, such as pectin, as carbon sources. So far, most of the pectin degradation systems and enzymes have been thoroughly studied in B. subtilis Nevertheless, the B. subtilis utilization system of galactan, which is

  3. High speed GaN micro-light-emitting diode arrays for data communications

    NASA Astrophysics Data System (ADS)

    Watson, Scott; McKendry, Jonathan J. D.; Zhang, Shuailong; Massoubre, David; Rae, Bruce R.; Green, Richard P.; Gu, Erdan; Henderson, Robert K.; Kelly, A. E.; Dawson, Martin D.

    2012-10-01

    Micro light-emitting diode (micro-LED) arrays based on an AlInGaN structure have attracted much interest recently as light sources for data communications. Visible light communication (VLC), over free space or plastic optical fibre (POF), has become a very important technique in the role of data transmission. The micro-LEDs which are reported here contain pixels ranging in diameter from 14 to 84μm and can be driven directly using a high speed probe or via complementary metal-oxide semiconductor (CMOS) technology. The CMOS arrays allow for easy, computer control of individual pixels within arrays containing up to 16×16 elements. The micro-LEDs best suited for data transmission have peak emissions of 450nm or 520nm, however various other wavelengths across the visible spectrum can also be used. Optical modulation bandwidths of over 400MHz have been achieved as well as error-free (defined as an error rate of <1x10-10) data transmission using on-off keying (OOK) non-return-to-zero (NRZ) modulation at data rates of over 500Mbit/s over free space. Also, as a step towards a more practical multi-emitter data transmitter, the frequency response of a micro-LED integrated with CMOS circuitry was measured and found to be up to 185MHz. Despite the reduction in bandwidth compared to the bare measurements using a high speed probe, a good compromise is achieved from the additional control available to select each pixel. It has been shown that modulating more than one pixel simultaneously can increase the data rate. As work continues in this area, the aim will be to further increase the data transmission rate by modulating more pixels on a single device to transmit multiple parallel data channels simultaneously.

  4. Low-temperature growth of AlN and GaN by metal organic vapor phase epitaxy for polarization engineered water splitting photocathode

    NASA Astrophysics Data System (ADS)

    Nakamura, Akihiro; Suzuki, Michihiro; Fujii, Katsushi; Nakano, Yoshiaki; Sugiyama, Masakazu

    2017-04-01

    Crystal properties of low-temperature grown AlN (LT-AlN) combined with low temperature GaN (LT-GaN) grown by metal organic vapor phase epitaxy (MOVPE) were investigated to obtain a high quality GaN/AlN/GaN structure with a few-nm-thick AlN layer. LT-AlN suppresses unintentional Ga incorporation and can be pseudomorphically grown on GaN with a relatively smooth surface morphology. The lattice of LT-AlN coherent to GaN, however, was found to relax after reactor conditions were changed to grow the subsequent GaN layer at higher temperature. The top GaN layer grown on the relaxed LT-AlN, thus, exhibited a rough surface morphology and a threading dislocation density (TDD) higher than 109 cm-2 estimated from an X-ray diffraction measurement. An LT-GaN capping layer was found to be highly effective for avoiding such lattice relaxation of LT-AlN. The combination of LT-AlN and LT-GaN enables us to obtain a GaN/AlN/GaN junction with high Al content, a low TDD, and abrupt interfaces. As a result, introducing an LT-GaN layer improved the photoelectrochemical (PEC) property of a polarization engineered un-doped GaN/AlN/n-type GaN (u-GaN/AlN/n-GaN) photocathode for water splitting.

  5. Compact deep UV laser system at 222.5 nm by single-pass frequency doubling of high-power GaN diode laser emission

    NASA Astrophysics Data System (ADS)

    Ruhnke, Norman; Müller, André; Eppich, Bernd; Güther, Reiner; Maiwald, Martin; Sumpf, Bernd; Erbert, Götz; Tränkle, Günther

    2016-03-01

    Deep ultraviolet (DUV) lasers emitting below 300 nm are of great interest for many applications, for instance in medical diagnostics or for detecting biological agents. Established DUV lasers, e.g. gas lasers or frequency quadrupled solid-state lasers, are relatively bulky and have high power consumptions. A compact and reliable laser diode based system emitting in the DUV could help to address applications in environments where a portable and robust light source with low power consumption is needed. In this work, a compact DUV laser system based on single-pass frequency doubling of highpower GaN diode laser emission is presented. A commercially available high-power GaN laser diode from OSRAM Opto Semiconductors serves as a pump source. The laser diode is spectrally stabilized in an external cavity diode laser (ECDL) setup in Littrow configuration. The ECDL system reaches a maximum optical output power of 700 mW, maintaining narrowband emission below 60 pm (FWHM) at 445 nm over the entire operating range. By direct single pass frequency doubling in a BBO crystal with a length of 7.5 mm a maximum DUV output power of 16 μW at a wavelength of 222.5 nm is generated. The presented concept enables compact and efficient diode laser based light sources emitting in the DUV spectral range that are potentially suitable for in situ applications where a small footprint and low power consumption is essential.

  6. Study of GaP single crystal layers grown on GaN by MOCVD

    SciTech Connect

    Li, Shuti; Liu, Chao; Ye, Guoguang; Xiao, Guowei; Zhou, Yugang; Su, Jun; Fan, Guanghan; Zhang, Yong; Liang, Fubo; Zheng, Shuwen

    2011-11-15

    Highlights: {yields} We investigated the growth of GaP layers on GaN by MOCVD. {yields} A single crystal GaP layer could be grown on GaN. {yields} The V/III ratio played an important role to improve GaP layer quality. {yields} The GaP:Mg layer with hole concentration of 4.2 x 10{sup 18} cm{sup -3} was obtained. -- Abstract: The performance of GaN based devices could possibly be improved by utilizing the good p-type properties of GaP layer and it provides the possibility of the integration of InAlGaN and AlGaInP materials to produce new devices, if high quality GaP compounds can be grown on III-nitride compounds. In this paper, the growth of GaP layers on GaN by metalorganic chemical vapor deposition (MOCVD) has been investigated. The results show that the GaP low temperature buffer layer can provide a high density of nucleation sites for high temperature GaP growth. Using a 40 nm thick GaP buffer layer, a single crystal GaP layer, whose full-width at half-maximum of the (1 1 1) plane measured by double crystal X-ray diffraction is 580'', can be grown on GaN. The V/III ratio plays an important role in the GaP layer growth and an appropriate V/III ratio can improve the quality of GaP layer. The GaP:Mg layer with hole carrier concentration of 4.2 x 10{sup 18} cm{sup -3} has been obtained.

  7. Degradation Mechanisms for GaN and GaAs High Speed Transistors

    PubMed Central

    Cheney, David J.; Douglas, Erica A.; Liu, Lu; Lo, Chien-Fong; Gila, Brent P.; Ren, Fan; Pearton, Stephen J.

    2012-01-01

    We present a review of reliability issues in AlGaN/GaN and AlGaAs/GaAs high electron mobility transistors (HEMTs) as well as Heterojunction Bipolar Transistors (HBTs) in the AlGaAs/GaAs materials systems. Because of the complex nature and multi-faceted operation modes of these devices, reliability studies must go beyond the typical Arrhenius accelerated life tests. We review the electric field driven degradation in devices with different gate metallization, device dimensions, electric field mitigation techniques (such as source field plate), and the effect of device fabrication processes for both DC and RF stress conditions. We summarize the degradation mechanisms that limit the lifetime of these devices. A variety of contact and surface degradation mechanisms have been reported, but differ in the two device technologies: For HEMTs, the layers are thin and relatively lightly doped compared to HBT structures and there is a metal Schottky gate that is directly on the semiconductor. By contrast, the HBT relies on pn junctions for current modulation and has only Ohmic contacts. This leads to different degradation mechanisms for the two types of devices.

  8. Selective area growth and characterization of GaN nanocolumns, with and without an InGaN insertion, on semi-polar (11–22) GaN templates

    SciTech Connect

    Bengoechea-Encabo, A.; Albert, S.; Barbagini, F.; Sanchez-Garcia, M. A.; Calleja, E.; Trampert, A.

    2013-12-09

    The aim of this work is the selective area growth (SAG) of GaN nanocolumns, with and without an InGaN insertion, by molecular beam epitaxyon semi-polar (11–22) GaN templates. The high density of stacking faults present in the template is strongly reduced after SAG. A dominant sharp photoluminescence emission at 3.473 eV points to high quality strain-free material. When embedding an InGaN insertion into the ordered GaN nanostructures, very homogeneous optical properties are observed, with two emissions originating from different regions of each nanostructure, most likely related to different In contents on different crystallographic planes.

  9. MOCVD growth of N-polar GaN on on-axis sapphire substrate: Impact of AlN nucleation layer on GaN surface hillock density

    NASA Astrophysics Data System (ADS)

    Marini, Jonathan; Leathersich, Jeffrey; Mahaboob, Isra; Bulmer, John; Newman, Neil; (Shadi) Shahedipour-Sandvik, F.

    2016-05-01

    We report on the impact of growth conditions on surface hillock density of N-polar GaN grown on nominally on-axis (0001) sapphire substrate by metal organic chemical vapor deposition (MOCVD). Large reduction in hillock density was achieved by implementation of an optimized high temperature AlN nucleation layer and use of indium surfactant in GaN overgrowth. A reduction by more than a factor of five in hillock density from 1000 to 170 hillocks/cm-2 was achieved as a result. Crystal quality and surface morphology of the resultant GaN films were characterized by high resolution x-ray diffraction and atomic force microscopy and found to be relatively unaffected by the buffer conditions. It is also shown that the density of smaller surface features is unaffected by AlN buffer conditions.

  10. Effect of flux composition ratio on the coalescence growth of GaN crystals by the Na-flux method

    NASA Astrophysics Data System (ADS)

    Honjo, Masatomo; Imanishi, Masayuki; Imabayashi, Hiroki; Nakamura, Kosuke; Murakami, Kosuke; Matsuo, Daisuke; Maruyama, Mihoko; Imade, Mamoru; Yoshimura, Masashi; Mori, Yusuke

    2017-03-01

    Previously, we demonstrated that the Na-flux coalescence growth technique had high potential for the fabrication of large-diameter, high-quality GaN crystals. This present study investigates the relation between the flux composition (Ga/Na) and void formation in GaN crystals grown by this technique. It was found that void formation decreases with a decrease in the Ga composition of the flux and that stable coalescence with no voids at the GaN grain boundaries occurred for a Ga composition of 15 mol%. Band-edge emission peaks were clearly observed for a crystal grown at 15 mol% Ga composition, while other peaks were hardly observed.

  11. Trap states in enhancement-mode double heterostructures AlGaN/GaN high electron mobility transistors with different GaN channel layer thicknesses

    SciTech Connect

    He, Yunlong; Wang, Chong Li, Xiangdong; Zhao, Shenglei; Mi, Minhan; Pei, Jiuqing; Zhang, Jincheng; Hao, Yue; Li, Peixian; Ma, Xiaohua

    2015-08-10

    This is the report on trap states in enhancement-mode AlGaN/GaN/AlGaN double heterostructures high electron mobility transistors by fluorine plasma treatment with different GaN channel layer thicknesses. Compared with the thick GaN channel layer sample, the thin one has smaller 2DEG concentration, lower electron mobility, lower saturation current, and lower peak transconductance, but it has a higher threshold voltage of 1.2 V. Deep level transient spectroscopy measurements are used to obtain the accurate capture cross section of trap states. By frequency dependent capacitance and conductance measurements, the trap state density of (1.98–2.56) × 10{sup 12 }cm{sup −2} eV{sup −1} is located at E{sub T} in a range of (0.37–0.44) eV in the thin sample, while the trap state density of (2.3–2.92) × 10{sup 12 }cm{sup −2} eV{sup −1} is located at E{sub T} in a range of (0.33–0.38) eV in the thick one. It indicates that the trap states in the thin sample are deeper than those in the thick one.

  12. The controlled growth of GaN microrods on Si(111) substrates by MOCVD

    NASA Astrophysics Data System (ADS)

    Foltynski, Bartosz; Garro, Nuria; Vallo, Martin; Finken, Matthias; Giesen, Christoph; Kalisch, Holger; Vescan, Andrei; Cantarero, Andrés; Heuken, Michael

    2015-03-01

    In this paper, a selective area growth (SAG) approach for growing GaN microrods on patterned SiNx/Si(111) substrates by metal-organic chemical vapor deposition (MOCVD) is studied. The surface morphology, optical and structural properties of vertical GaN microrods terminated by pyramidal shaped facets (six { 10 1 bar 1} planes) were characterized using scanning electron microscopy (SEM), room temperature photoluminescence (PL) and Raman spectroscopy, respectively. Measurements revealed high-quality GaN microcolumns grown with silane support. Characterized structures were grown nearly strain-free (central frequency of Raman peak of 567±1 cm-1) with crystal quality comparable to bulk crystals (FWHM=4.2±1 cm-1). Such GaN microrods might be used as a next-generation device concept for solid-state lighting (SSL) applications by realizing core-shell InGaN/GaN multi-quantum wells (MQWs) on the n-GaN rod base.

  13. Some of structural and morphological optimization of GaN thin film on Si(100) substrate grown by RF sputter

    NASA Astrophysics Data System (ADS)

    Mantarcı, Asim; Kundakçı, Mutlu

    2017-04-01

    One of important material of III-nitrides can be said to be GaN with direct-wide band gap ( 3.4 eV) and many industrial devices such as solar cell, LED has been based on GaN thin film. In this research, we elaborately investigated growth of GaN thin film on Si(100) substrate by RF sputter technique and characterization of the film. We have successfully grown GaN thin film on Si substrate with hexagonal structure which has been confirmed by analysis of X-ray measurements. Also, we obtained structural properties of GaN film by (XRD) X-ray Diffraction measurements depending on different Argon, nitrogen and RF power values. During experiment, the value from 25sccm to 100sccm Argon gas value, the value from 0sccm to 4sccm Nitrogen gas value and from 50 watt to 125 watt RF power value has been applied. Among these values, we determined the best film in terms of crystalline structure of film. From AFM results, we attained and analyzed average roughness (Ra), maximum peak height (Rp), and maximum depth (Rv), average absolute slope of the profile (Δa)(°) of the fılms successfully. The film having the lowest roughness (Ra) has been achieved depending on different Argon, nitrogen and RF power values. Atomic Force Microscopy results confirmed that some of the films have homogeneous and uniform structure without any holes and crack; but others has voids referring impurities coming from growth process. To sum up, not only growing GaN thin film on Si substrate has been investigated, but also some of structural and morphological parameters' optimization has been studied, analyzed and the best film was determined in view of varied Argon, nitrogen and RF power values. For future direction, optimization of GaN thin film in detail can enable us to fabricate high quality film; therefore it will helps to improving device technology.

  14. Structural and optical properties of GaN and InGaN nanoparticles by chemical co-precipitation method

    SciTech Connect

    Gopalakrishnan, M.; Purushothaman, V.; Venkatesh, P. Sundara; Ramakrishnan, V.; Jeganathan, K.

    2012-11-15

    Highlights: ► First report on InGaN NPs by chemical co-precipitation method. ► There is no phase separation in InGaN NPs. ► Both NPs are suitable for optoelectronic devices in the visible region. ► First experimental observation of phonon mode at 272 cm{sup −1} for GaN NPs. ► First report on μ-Raman analysis for InGaN NPs. -- Abstract: A facile method for the synthesis of gallium nitride (GaN) and indium gallium nitride (InGaN) nanoparticles (NPs) has been reported by simple chemical co-precipitation method. The average diameters of the GaN and InGaN NPs were 12 nm and 38 nm respectively. GaN NPs show high crystalline quality with hexagonal structure while InGaN NPs exhibits some cubic inclusion by X-ray diffraction. Room-temperature photoluminescence analysis shows the near-band edge emission at 3.43 eV for GaN and a strong blue emission at 3.0 eV for In{sub 0.4}Ga{sub 0.6}N NPs. The E{sub 2}{sup H} phonon peaks from micro-Raman scattering at 567 cm{sup −1} for GaN and 564 cm{sup −1} for InGaN confirms the wurtzite nature of both the NPs. In addition, we have also assigned some other phonon modes of GaN associated with zone boundary K point of the Brillouin zone which is not experimentally observed for their bulk counterparts.

  15. Analysis of GaN high electron mobility transistor switching characteristics for high-power applications with HiSIM-GaN compact model

    NASA Astrophysics Data System (ADS)

    Mizoguchi, Takeshi; Naka, Toshiyuki; Tanimoto, Yuta; Okada, Yasuhiro; Saito, Wataru; Miura-Mattausch, Mitiko; Jürgen Mattausch, Hans

    2016-04-01

    This paper presents a newly developed compact model HiSIM-GaN [Hiroshima University STARC IGFET Model for GaN high electron mobility transistors (HEMTs)]. The developed model includes two specific features of GaN-HEMT to reproduce the power efficiency accurately. One is the two-dimensional electron gas induced at the heterojunction, which is modeled by considering the potential distribution across the junction including the trap density contribution. The second feature is the field plate, which is introduced to delocalize the electric-field peak that occurs at the electrode edge. Using HiSIM-GaN, device characteristics have been simulated. It is demonstrated that measured DC/AC characteristics are well reproduced with the developed model. The model has also been applied to analyze circuit characteristics of a boost converter. It is shown that the waveform is well reproduced by considering one half of the trap density extracted with measured DC characteristics due to the time constant of trap events. Furthermore, it is verified that the power efficiency as a function of the load current is predicted within an accuracy of 1%. Influence of the trap density and the field plate on circuit performances is also discussed.

  16. High kappa Dielectrics on InGaAs and GaN: Growth, Interfacial Structural Studies, and Surface Fermi Level Unpinning

    DTIC Science & Technology

    2010-12-24

    nano-thick Al2O3, HfO2, and Ga2O3 (Gd2O3)/ InGaAs (and GaN) using high-resolution x-ray reflectivity using in-situ/ex-situ high-resolution synchrotron...aligned inversion-channel In0.75Ga0.25As MOSFETs using MBE- grown Al2O3/ Ga2O3 (Gd2O3) Chips integrating high κ’s/InGaAs and /Ge onto Si substrates have...using molecular beam epitaxy (MBE)-Al2O3/ Ga2O3 (Gd2O3) [GGO] and atomic layer deposited (ALD)-Al2O3, with gate lengths (LG) of 1 μm and 0.4 μm

  17. Theory of high field carrier transport and impact ionization in wurtzite GaN. Part II: Application to avalanche photodetectors

    NASA Astrophysics Data System (ADS)

    Moresco, Michele; Bertazzi, Francesco; Bellotti, Enrico

    2009-09-01

    The coming to age of GaN-based ultraviolet avalanche photodiodes (APDs) has made them increasingly preferred over PIN photodetectors in several areas spanning from communication to defense systems, and from commercial to scientific applications. In this work, which is the second article of a two-part series, we study the physics and performance of GaN APDs using the full-band Monte Carlo (FBMC) model described in Part I. The proposed FBMC model is based on a realistic electronic structure obtained by pseudopotential calculations and a phonon dispersion relation determined by ab initio techniques. We determine the key performance figures such as the carrier multiplication gain and the breakdown voltage for several GaN APD structures that have been fabricated by a number of experimental groups. The calculated electron and hole multiplication gains as a function of the applied bias, as well as the breakdown voltage, are found to be in good agreement with the experimental data available. Based on the FBMC results we also propose an efficient recurrence equation model, which provides a first-order estimate of the multiplication gain without resorting to the full fledge microscopic approach.

  18. Anisotropic strain relaxation and high quality AlGaN/GaN heterostructures on Si (110) substrates

    NASA Astrophysics Data System (ADS)

    Feng, Yuxia; Yang, Xuelin; Cheng, Jianpeng; Zhang, Jie; Ji, Panfeng; Shen, Jianfei; Hu, Anqi; Xu, Fujun; Yu, Tongjun; Wang, Xinqiang; Shen, Bo

    2017-05-01

    We have investigated the growth and relaxation mechanisms of anisotropic lattice misfit strain in AlN and GaN layers on Si (110) substrates. A qualitative model is proposed to explain the relaxation process. It is revealed that the anisotropic misfit strain is quickly relaxed in the low temperature AlN layer by the formation of interface misfit dislocations, small misoriented grains, and lattice distortion. As a result, isotropic properties and atomically smooth surface are observed in the high temperature AlN layer. Based on this isotropic AlN layer, a high quality GaN layer and AlGaN/GaN heterostructures with a high electron mobility of 2160 cm2/(V . s) have been obtained. This work will have important impacts on the understanding of the epitaxy of isotropic semiconductor films on anisotropic substrates.

  19. Effect of ZnO seed layer on the morphology and optical properties of ZnO nanorods grown on GaN buffer layers

    SciTech Connect

    Nandi, R. Mohan, S. Major, S. S.; Srinivasa, R. S.

    2014-04-24

    ZnO nanorods were grown by chemical bath deposition on sputtered, polycrystalline GaN buffer layers with and without ZnO seed layer. Scanning electron microscopy and X-ray diffraction show that the ZnO nanorods on GaN buffer layers are not vertically well aligned. Photoluminescence spectrum of ZnO nanorods grown on GaN buffer layer, however exhibits a much stronger near-band-edge emission and negligible defect emission, compared to the nanorods grown on ZnO buffer layer. These features are attributed to gallium incorporation at the ZnO-GaN interface. The introduction of a thin (25 nm) ZnO seed layer on GaN buffer layer significantly improves the morphology and vertical alignment of ZnO-NRs without sacrificing the high optical quality of ZnO nanorods on GaN buffer layer. The presence of a thick (200 nm) ZnO seed layer completely masks the effect of the underlying GaN buffer layer on the morphology and optical properties of nanorods.

  20. Reduction of crack density in ammonothermal bulk GaN growth

    NASA Astrophysics Data System (ADS)

    Letts, Edward; Key, Daryl; Hashimoto, Tadao

    2016-12-01

    The growth of high quality GaN by the ammonothermal method is appealing due to the potential to scale and achieve very high crystal quality. Several applications could benefit from the supply of very high quality GaN such as high power light emitting diodes, laser diodes, and high power electronics. Despite steady advancement by the few groups developing ammonothermal growth technology, high quality ammonothermal GaN wafers have yet be manufactured in great quantities. This paper reviews the current progress of ammonothermal growth at SixPoint Materials. Growths were performed at T<600 °C and P<300 MPa on GaN seed crystals produced by hydride vapor phase epitaxy (HVPE). For thin boules, <1 mm growth thickness, no cracking is observed. Historically however, SixPoint Materials' ammonothermal growth on HVPE seeds eventually experiences a curvature flip giving extremely high radius of curvature at a critical thickness. As the growth continues the radius of curvature degrades and cracking is observed. Since IWBNSVIII, SixPoint Materials has improved the crack free area for 5 mm thick boules from 5 to 80 mm2 to the complete seed area. This result is repeatable in multiple reactors. Careful selection of the HVPE seeds led to the greatest reduction in cracking. Seed selection combined with an additional technique has allowed boules to be grown crack free. X-ray diffraction was carried out on an ammonothermally grown boule at 90 points along a 44 mm line providing a mean (002) and (201) full width half max (FWHM) reflection of 29 and 35″ respectively using a beam spot of 0.3 mm x 0.3 mm and an open detector. The radius of curvature is typically between 3 and 20 m across the sample. Dislocation densities are routinely low 105 cm-2 .

  1. Semipolar (202̅1̅) GaN and InGaN Light-Emitting Diodes Grown on Sapphire.

    PubMed

    Song, Jie; Choi, Joowon; Xiong, Kanglin; Xie, Yujun; Cha, Judy J; Han, Jung

    2017-04-26

    We have demonstrated growing uniform and purely nitrogen polar semipolar (202̅1̅) GaN epilayers on 2 in. patterned sapphire substrates. The as-grown surface of (202̅1̅) GaN is composed of two stable facets: (101̅0) and (101̅1̅). A chemical mechanical polishing process was further used to planarize the surface with a final surface root-mean-square roughness of less than 1.5 nm over an area of 10 × 10 μm(2). InGaN light-emitting diodes were grown on a polished (202̅1̅) GaN/sapphire template with an electroluminescence emission at around 490 nm. Our work exhibits the potential to produce high-quality nitrogen-polar semipolar GaN templates and optoelectronic devices on large-area sapphire substrates with economical feasibility.

  2. Vacancy-type defects in bulk GaN grown by the Na-flux method probed using positron annihilation

    NASA Astrophysics Data System (ADS)

    Uedono, Akira; Imanishi, Masayuki; Imade, Mamoru; Yoshimura, Masashi; Ishibashi, Shoji; Sumiya, Masatomo; Mori, Yusuke

    2017-10-01

    Defects in bulk GaN grown by the Na-flux method have been studied using a positron annihilation technique. Pyramidal bulk samples showed striation and inhomogeneous color distributions. Measurements of the Doppler broadening spectra of the annihilation radiation and lifetime spectra of positrons revealed that the concentration of vacancy-type defects increased with decreasing transparency of the samples. The major defect species was identified as a Ga vacancy coupled with nitrogen vacancies. A correlation between the oxygen incorporation and the introduction of such vacancies was observed. For c-plane GaN grown by a coalescence growth method, the concentration of vacancy-type defects was close to or under the detection limit of positron annihilation technique (≤1015cm-3), suggesting that high-quality bulk GaN can be fabricated using this method.

  3. Improved crystalline properties of laser molecular beam epitaxy grown SrTiO{sub 3} by rutile TiO{sub 2} layer on hexagonal GaN

    SciTech Connect

    Luo, W. B.; Zhu, J.; Chen, H.; Wang, X. P.; Zhang, Y.; Li, Y. R.

    2009-11-15

    Epitaxial SrTiO{sub 3} films were fabricated by laser molecular beam epitaxy on bare and TiO{sub 2} buffered GaN(0002), respectively. The whole deposition processes were in situ monitored by reflection high energy electron diffraction (RHEED). X-ray diffraction (XRD) was carried out to study the growth orientation and crystalline quality of STO films. The interfacial characters and epitaxial relationships were also investigated by high revolution transition electron microscope and selected area electron diffraction (SAED). According to the RHEED observation, the lowest epitaxy temperature of STO on TiO{sub 2} buffered GaN was decreased compared with the direct deposited one. The epitaxial relationship was (111)[110]STO//(0002)[1120]GaN in both cases as confirmed by RHEED, XRD, and SAED. The full width at half maximum of omega-scan and PHI-scan of STO on TiO{sub 2} buffered GaN was reduced compared with that deposited on bare GaN, indicating that epitaxial quality of STO film is improved by inserting TiO{sub 2} layer. In summary, the lattice mismatch was reduced by inserting rutile TiO{sub 2}. As a result, the crystalline temperature was reduced and enhanced epitaxial quality of STO thin film was obtained.

  4. Direct Growth of a-Plane GaN on r-Plane Sapphire by Metal Organic Chemical Vapor Deposition

    NASA Astrophysics Data System (ADS)

    Hsu, Hsiao-Chiu; Su, Yan-Kuin; Huang, Shyh-Jer; Wang, Yu-Jen; Wu, Chun-Ying; Chou, Ming-Chieh

    2010-04-01

    In this study, we had demonstrated the direct growth of nonpolar a-plane GaN on an r-plane sapphire by metal organic chemical vapor deposition (MOCVD) without any buffer layer. First, in this experiment, we had determined the optimum temperature for two-step growth, including obtaining three-dimensional (3D) GaN islands in the nucleation layer and coalescing with a further two-dimensional (2D) growth mode. The result shows that the nucleation layer grown under high temperature (1150 °C) leads to large islands with few grain boundaries. Under the same temperature, the effect of the V/III ratio on the growth of the overlaying GaN layer to obtain a flat and void free a-plane GaN layer is also studied. The result indicates one can directly grow a smooth epitaxial layer on an r-plane sapphire by changing the V/III ratio. The rms roughness decreases from 13.61 to 2.02 nm. The GaN crystal quality is verified using a mixed acid to etch the film surface. The etch pit density (EPD) is 3.16 ×107 cm-2.

  5. Heteroepitaxial VO2 thin films on GaN: Structure and metal-insulator transition characteristics

    NASA Astrophysics Data System (ADS)

    Zhou, You; Ramanathan, Shriram

    2012-10-01

    Monolithic integration of correlated oxide and nitride semiconductors may open up new opportunities in solid-state electronics and opto-electronics that combine desirable functional properties of both classes of materials. Here, we report on epitaxial growth and phase transition-related electrical properties of vanadium dioxide (VO2) thin films on GaN epitaxial layers on c-sapphire. The epitaxial relation is determined to be (010)vo2‖(0001)GaN‖(0001)A12O3 and [100]vo2‖[1¯21¯0]A12O3 from x-ray diffraction. VO2 heteroepitaxial growth and lattice mismatch are analyzed by comparing the GaN basal plane (0001) with the almost close packed corrugated oxygen plane in vanadium dioxide and an experimental stereographic projection describing the orientation relationship is established. X-ray photoelectron spectroscopy suggests a slightly oxygen rich composition at the surface, while Raman scattering measurements suggests that the quality of GaN layer is not significantly degraded by the high-temperature deposition of VO2. Electrical characterization of VO2 films on GaN indicates that the resistance changes by about four orders of magnitude upon heating, similar to epitaxial VO2 films grown directly on c-sapphire. It is shown that the metal-insulator transition could also be voltage-triggered at room temperature and the transition threshold voltage scaling variation with temperature is analyzed in the framework of a current-driven Joule heating model. The ability to synthesize high quality correlated oxide films on GaN with sharp phase transition could enable new directions in semiconductor-photonic integrated devices.

  6. New approaches for calculating absolute surface energies of wurtzite (0001)/(000 1 ¯ ): A study of ZnO and GaN

    NASA Astrophysics Data System (ADS)

    Zhang, Jingzhao; Zhang, Yiou; Tse, Kinfai; Deng, Bei; Xu, Hu; Zhu, Junyi

    2016-05-01

    The accurate absolute surface energies of (0001)/(000 1 ¯ ) surfaces of wurtzite structures are crucial in determining the thin film growth mode of important energy materials. However, the surface energies still remain to be solved due to the intrinsic difficulty of calculating the dangling bond energy of asymmetrically bonded surface atoms. In this study, we used a pseudo-hydrogen passivation method to estimate the dangling bond energy and calculate the polar surfaces of ZnO and GaN. The calculations were based on the pseudo chemical potentials obtained from a set of tetrahedral clusters or simple pseudo-molecules, using density functional theory approaches. The surface energies of (0001)/(000 1 ¯ ) surfaces of wurtzite ZnO and GaN that we obtained showed relatively high self-consistencies. A wedge structure calculation with a new bottom surface passivation scheme of group-I and group-VII elements was also proposed and performed to show converged absolute surface energy of wurtzite ZnO polar surfaces, and these results were also compared with the above method. The calculated results generally show that the surface energies of GaN are higher than those of ZnO, suggesting that ZnO tends to wet the GaN substrate, while GaN is unlikely to wet ZnO. Therefore, it will be challenging to grow high quality GaN thin films on ZnO substrates; however, high quality ZnO thin film on GaN substrate would be possible. These calculations and comparisons may provide important insights into crystal growth of the above materials, thereby leading to significant performance enhancements in semiconductor devices.

  7. Atomic force microscopy studies of homoepitaxial GaN layers grown on GaN template by laser MBE

    SciTech Connect

    Choudhary, B. S.; Singh, A.; Tyagi, P. K.; Tanwar, S.; Kumar, M. Senthil; Kushvaha, S. S.

    2016-04-13

    We have grown homoepitaxial GaN films on metal organic chemical vapor deposition (MOCVD) grown 3.5 µm thick GaN on sapphire (0001) substrate (GaN template) using an ultra-high vacuum (UHV) laser assisted molecular beam epitaxy (LMBE) system. The GaN films were grown by laser ablating a polycrystalline solid GaN target in the presence of active r.f. nitrogen plasma. The influence of laser repetition rates (10-30 Hz) on the surface morphology of homoepitaxial GaN layers have been studied using atomic force microscopy. It was found that GaN layer grown at 10 Hz shows a smooth surface with uniform grain size compared to the rough surface with irregular shape grains obtained at 30 Hz. The variation of surface roughness of the homoepitaxial GaN layer with and without wet chemical etching has been also studied and it was observed that the roughness of the film decreased after wet etching due to the curved structure/rough surface.

  8. Suppression of plasma-induced damage on GaN etched by a Cl2 plasma at high temperatures

    NASA Astrophysics Data System (ADS)

    Liu, Zecheng; Pan, Jialin; Kako, Takashi; Ishikawa, Kenji; Takeda, Keigo; Kondo, Hiroki; Oda, Osamu; Sekine, Makoto; Hori, Masaru

    2015-06-01

    Plasma-induced damage (PID) during plasma-etching processes was suppressed by the application of Cl2 plasma etching at an optimal temperature of 400 °C, based on results of evaluations of photoluminescence (PL), stoichiometric composition, and surface roughness. The effects of ions, photons, and radicals on damage formation were separated from the effects of plasma using the pallet for plasma evaluation (PAPE) method. The PID was induced primarily by energetic ion bombardments at temperatures lower than 400 °C and decreased with increasing temperature. Irradiations by photons and radicals were enhanced to form the PID and to develop surface roughness at temperatures higher than 400 °C. Consequently, Cl2 plasma etching at 400 °C resulted optimally in low damage and a stoichiometric and smooth GaN surface.

  9. Green high-power tunable external-cavity GaN diode laser at 515  nm.

    PubMed

    Chi, Mingjun; Jensen, Ole Bjarlin; Petersen, Paul Michael

    2016-09-15

    A 480 mW green tunable diode laser system is demonstrated for the first time to our knowledge. The laser system is based on a GaN broad-area diode laser and Littrow external-cavity feedback. The green laser system is operated in two modes by switching the polarization direction of the laser beam incident on the grating. When the laser beam is p-polarized, an output power of 50 mW with a tunable range of 9.2 nm is achieved. When the laser beam is s-polarized, an output power of 480 mW with a tunable range of 2.1 nm is obtained. This constitutes the highest output power from a tunable green diode laser system.

  10. Impact of barrier thickness on transistor performance in AlN/GaN high electron mobility transistors grown on free-standing GaN substrates

    SciTech Connect

    Deen, David A. Storm, David F.; Meyer, David J.; Bass, Robert; Binari, Steven C.; Gougousi, Theodosia; Evans, Keith R.

    2014-09-01

    A series of six ultrathin AlN/GaN heterostructures with varied AlN thicknesses from 1.5–6 nm have been grown by molecular beam epitaxy on free-standing hydride vapor phase epitaxy GaN substrates. High electron mobility transistors (HEMTs) were fabricated from the set in order to assess the impact of barrier thickness and homo-epitaxial growth on transistor performance. Room temperature Hall characteristics revealed mobility of 1700 cm{sup 2}/V s and sheet resistance of 130 Ω/□ for a 3 nm thick barrier, ranking amongst the lowest room-temperature sheet resistance values reported for a polarization-doped single heterostructure in the III-Nitride family. DC and small signal HEMT electrical characteristics from submicron gate length HEMTs further elucidated the effect of the AlN barrier thickness on device performance.

  11. Impact of barrier thickness on transistor performance in AlN/GaN high electron mobility transistors grown on free-standing GaN substrates

    NASA Astrophysics Data System (ADS)

    Deen, David A.; Storm, David F.; Meyer, David J.; Bass, Robert; Binari, Steven C.; Gougousi, Theodosia; Evans, Keith R.

    2014-09-01

    A series of six ultrathin AlN/GaN heterostructures with varied AlN thicknesses from 1.5-6 nm have been grown by molecular beam epitaxy on free-standing hydride vapor phase epitaxy GaN substrates. High electron mobility transistors (HEMTs) were fabricated from the set in order to assess the impact of barrier thickness and homo-epitaxial growth on transistor performance. Room temperature Hall characteristics revealed mobility of 1700 cm2/V s and sheet resistance of 130 Ω / □ for a 3 nm thick barrier, ranking amongst the lowest room-temperature sheet resistance values reported for a polarization-doped single heterostructure in the III-Nitride family. DC and small signal HEMT electrical characteristics from submicron gate length HEMTs further elucidated the effect of the AlN barrier thickness on device performance.

  12. Characterization of GaN nanowires grown on PSi, PZnO and PGaN on Si (111) substrates by thermal evaporation

    SciTech Connect

    Shekari, Leila; Hassan, Haslan Abu; Thahab, Sabah M.; Hassan, Zainuriah

    2012-06-20

    In this research, we used an easy and inexpensive method to synthesize highly crystalline GaN nanowires (NWs); on different substrates such as porous silicon (PSi), porous zinc oxide (PZnO) and porous gallium nitride (PGaN) on Si (111) wafer by thermal evaporation using commercial GaN powder without any catalyst. Micro structural studies by scanning electron microscopy and transmission electron microscope measurements reveal the role of different substrates in the morphology, nucleation and alignment of the GaN nanowires. The degree of alignment of the synthesized nanowires does not depend on the lattice mismatch between wires and their substrates. Further structural and optical characterizations were performed using high resolution X-ray diffraction and energy-dispersive X-ray spectroscopy. Results indicate that the nanowires are of single-crystal hexagonal GaN. The quality and density of grown GaN nanowires for different substrates are highly dependent on the lattice mismatch between the nanowires and their substrates and also on the size of the porosity of the substrates. Nanowires grown on PGaN have the best quality and highest density as compared to nanowires on other substrates. By using three kinds of porous substrates, we are able to study the increase in the alignment and density of the nanowires.

  13. Incorporation of Mg in Free-Standing HVPE GaN Substrates

    NASA Astrophysics Data System (ADS)

    Zvanut, M. E.; Dashdorj, J.; Freitas, J. A.; Glaser, E. R.; Willoughby, W. R.; Leach, J. H.; Udwary, K.

    2016-06-01

    Mg, the only effective p-type dopant for nitrides, is well studied in thin films due to the important role of the impurity in light-emitting diodes and high-power electronics. However, there are few reports of Mg in thick free-standing GaN substrates. Here, we demonstrate successful incorporation of Mg into GaN grown by hydride vapor-phase epitaxy (HVPE) using metallic Mg as the doping source. The concentration of Mg obtained from four separate growth runs ranged between 1016 cm-3 and 1019 cm-3. Raman spectroscopy and x-ray diffraction revealed that Mg did not induce stress or perturb the crystalline quality of the HVPE GaN substrates. Photoluminescence (PL) and electron paramagnetic resonance (EPR) spectroscopies were performed to investigate the types of point defects in the crystals. The near-band-edge excitonic and shallow donor-shallow acceptor radiative recombination processes involving shallow Mg acceptors were prominent in the PL spectrum of a sample doped to 3 × 1018 cm-3, while the EPR signal was also thought to represent a shallow Mg acceptor. Detection of this signal reflects minimization of nonuniform strain obtained in the thick free-standing HVPE GaN compared with heteroepitaxial thin films.

  14. Fine structure of the red luminescence band in undoped GaN

    SciTech Connect

    Reshchikov, M. A.; Usikov, A.; Helava, H.; Makarov, Yu.

    2014-01-20

    Many point defects in GaN responsible for broad photoluminescence (PL) bands remain unidentified. Their presence in thick GaN layers grown by hydride vapor phase epitaxy (HVPE) detrimentally affects the material quality and may hinder the use of GaN in high-power electronic devices. One of the main PL bands in HVPE-grown GaN is the red luminescence (RL) band with a maximum at 1.8 eV. We observed the fine structure of this band with a zero-phonon line (ZPL) at 2.36 eV, which may help to identify the related defect. The shift of the ZPL with excitation intensity and the temperature-related transformation of the RL band fine structure indicate that the RL band is caused by transitions from a shallow donor (at low temperature) or from the conduction band (above 50 K) to an unknown deep acceptor having an energy level 1.130 eV above the valence band.

  15. Qualitative and quantitative analysis of the major constituents in Jin-Mu-Gan-Mao tablet by high-performance liquid chromatography with diode-array detection and quadrupole time-of-flight tandem mass spectrometry.

    PubMed

    Huang, Mingqing; Xu, Shuyu; Xu, Wen; Chen, Daxing; Chu, Kedan; Xu, Wei; Peng, Jun; Lu, Jinjian

    2014-12-01

    Jin-Mu-Gan-Mao tablet is a well-known traditional Chinese medicinal preparation, which has been used to treat the common cold in China. In this study, a systematic method was established for the qualitative and quantitative analysis of the major constituents in Jin-Mu-Gan-Mao tablet. First, a method of high-performance liquid chromatography with diode-array detection and quadrupole time-of-flight mass spectrometry was developed for identification of the multi-constituents. Thirty-one compounds including ten phenolic acids, 18 flavonoids, and three iridoid glycosides were clearly identified by comparison with the reference standards, and 11 compounds were deduced by comparison with the literature data. Second, a new quantitative analysis method of Jin-Mu-Gan-Mao tablet was established by high-performance liquid chromatography with diode-array detection. Twelve compounds, either with high contents or strong bioactivities, were chosen as marker components. This analytical method was validated through intra- and interday precision, repeatability, and stability, with respective relative standard deviations less than 1.74, 2.54, 2.44, and 2.48%. The limits of detection and quantification were less than 0.327 and 0.881 μg/mL, respectively. The overall recoveries ranged from 97.04-102.76% (relative standard deviation ≤ 2.91%). Then this validated method was applied to determine ten batches of Jin-Mu-Gan-Mao tablet. The results indicated that these new approaches can be applicable for the qualitative and quantitative analysis of Jin-Mu-Gan-Mao tablet. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  16. Photoluminescence enhancement from GaN by beryllium doping

    NASA Astrophysics Data System (ADS)

    García-Gutiérrez, R.; Ramos-Carrazco, A.; Berman-Mendoza, D.; Hirata, G. A.; Contreras, O. E.; Barboza-Flores, M.

    2016-10-01

    High quality Be-doped (Be = 0.19 at.%) GaN powder has been grown by reacting high purity Ga diluted alloys (Be-Ga) with ultra high purity ammonia in a horizontal quartz tube reactor at 1200 °C. An initial low-temperature treatment to dissolve ammonia into the Ga melt produced GaN powders with 100% reaction efficiency. Doping was achieved by dissolving beryllium into the gallium metal. The powders synthesized by this method regularly consist of two particle size distributions: large hollow columns with lengths between 5 and 10 μm and small platelets in a range of diameters among 1 and 3 μm. The GaN:Be powders present a high quality polycrystalline profile with preferential growth on the [10 1 bar 1] plane, observed by means of X-ray diffraction. The three characteristics growth planes of the GaN crystalline phase were found by using high resolution TEM microscopy. The optical enhancing of the emission in the GaN powder is attributed to defects created with the beryllium doping. The room temperature photoluminescence emission spectra of GaN:Be powders, revealed the presence of beryllium on a shoulder peak at 3.39 eV and an unusual Y6 emission at 3.32eV related to surface donor-acceptor pairs. Also, a donor-acceptor-pair transition at 3.17 eV and a phonon replica transition at 3.1 eV were observed at low temperature (10 K). The well-known yellow luminescence band coming from defects was observed in both spectra at room and low temperature. Cathodoluminescence emission from GaN:Be powders presents two main peaks associated with an ultraviolet band emission and the yellow emission known from defects. To study the trapping levels related with the defects formed in the GaN:Be, thermoluminescence glow curves were obtained using UV and β radiation in the range of 50 and 150 °C.

  17. Nearly stress-free substrates for GaN homoepitaxy

    NASA Astrophysics Data System (ADS)

    Hermann, M.; Gogova, D.; Siche, D.; Schmidbauer, M.; Monemar, B.; Stutzmann, M.; Eickhoff, M.

    2006-08-01

    High-quality 300 μm thick GaN crack-free layers grown by hydride vapor phase epitaxy (HVPE) on c-plane sapphire without buffer layers and separated from the substrate by laser lift-off were investigated by high resolution X-ray diffraction (XRD), low-temperature photoluminescence and cathodoluminescence. All these characterization techniques confirm the high structural quality of the resulting material. Lateral X-ray mapping of the free-standing bulk-like GaN shows a homogeneous compressive stress of less than 40 MPa and a heterogeneous stress of about 80 MPa. The formation of twin grains (domains) were observed both in the reciprocal space mapping of the (2 0 .5) reflection and in rocking curve measurements. The latter ones revealed an estimated lateral coherence length of about 1.2 μm. The crystallite size along the c-axis is estimated to be larger than 20 μm. An upper limit of the density of dislocations with a component of the Burgers vector along the c-axis (screw and mixed type) of 1.3×10 7 cm -2 was extracted from the XRD data, while transmission electron microscopy measurements revealed a dislocation density of 1.7×10 7 cm -2. Thus, these layers are suitable as lattice-parameter and thermal-expansion matched substrates for strain-free homoepitaxy of GaN-based device heterostructures.

  18. Q-Band (45 GHz) Microwave Integrated Circuit Power Amplifier Designs Submitted to TriQuint Semiconductor for Fabrication with 0.15-micron High-Electron-Mobility Transistors (HEMT) Using 2-mil Gallium Nitride (GaN) on Silicon Carbide (SiC)

    DTIC Science & Technology

    2013-09-01

    Electron-Mobility Transistors (HEMT) Using 2-mil Gallium Nitride (GaN) on Silicon Carbide (SiC) by John E. Penn ARL-TN-0574 September 2013...µm High-Electron-Mobility Transistors (HEMT) Using 2-mil Gallium Nitride (GaN) on Silicon Carbide (SiC) John E. Penn Sensors and Electron Devices...with 0.15-µm High- Electron-Mobility Transistors (HEMT) Using 2-mil Gallium Nitride (GaN) on Silicon Carbide (SiC) 5a. CONTRACT NUMBER 5b. GRANT

  19. Study of photoemission mechanism for varied doping GaN photocathode

    NASA Astrophysics Data System (ADS)

    Qiao, Jianliang; Xu, Yuan; Niu, Jun; Gao, Youtang; Chang, Benkang

    2015-10-01

    Negative electron affinity (NEA) GaN photocathode has many virtues, such as high quantum efficiency, low dark current, concentrated electrons energy distribution and angle distribution, adjustive threshold and so on. The quantum efficiency is an important parameter for the preparation and evaluation of NEA GaN photocathode. The varied doping GaN photocathode has the directional inside electric field within the material, so the higher quantum efficiency can be obtained. The varied doping NEA GaN photocathode has better photoemission performance. According to the photoemission theory of NEA GaN photocathode, the quantum efficiency formulas for uniform doping and varied doping NEA GaN photocathodes were given. In the certain condition, the quantum efficiency formula for varied doping GaN photocathode consists with the uniform doping. The activation experiment was finished for varied doping GaN photocathode. The cleaning method and technics for varied doping GaN photocathode were given in detail. To get an atom clean surface, the heat cleaning must be done after the chemical cleaning. Using the activation and evaluation system for NEA photocathode, the varied doping GaN photocathode was activated with Cs and O, and the photocurrent curve for varied doping GaN photocathode was gotten.

  20. A new system for sodium flux growth of bulk GaN. Part I: System development

    NASA Astrophysics Data System (ADS)

    Von Dollen, Paul; Pimputkar, Siddha; Alreesh, Mohammed Abo; Albrithen, Hamad; Suihkonen, Sami; Nakamura, Shuji; Speck, James S.

    2016-12-01

    Though several methods exist to produce bulk crystals of gallium nitride (GaN), none have been commercialized on a large scale. The sodium flux method, which involves precipitation of GaN from a sodium-gallium melt supersaturated with nitrogen, offers potentially lower cost production due to relatively mild process conditions while maintaining high crystal quality. We successfully developed a novel apparatus for conducting crystal growth of bulk GaN using the sodium flux method which has advantages with respect to prior reports. A key task was to prevent sodium loss or migration from the growth environment while permitting N2 to access the growing crystal. We accomplished this by implementing a reflux condensing stem along with a reusable capsule containing a hermetic seal. The reflux condensing stem also enabled direct monitoring of the melt temperature, which has not been previously reported for the sodium flux method. Furthermore, we identified and utilized molybdenum and the molybdenum alloy TZM as a material capable of directly containing the corrosive sodium-gallium melt. This allowed implementation of a crucible-free system, which may improve process control and potentially lower crystal impurity levels. Nucleation and growth of parasitic GaN (;PolyGaN;) on non-seed surfaces occurred in early designs. However, the addition of carbon in later designs suppressed PolyGaN formation and allowed growth of single crystal GaN. Growth rates for the (0001) Ga face (+c-plane) were up to 14 μm/h while X-ray omega rocking (ω-XRC) curve full width half-max values were 731″ for crystals grown using a later system design. Oxygen levels were high, >1019 atoms/cm3, possibly due to reactor cleaning and handling procedures.

  1. Development of GaN photocathodes for UV detectors

    NASA Astrophysics Data System (ADS)

    Siegmund, O.; Vallerga, J.; McPhate, J.; Malloy, J.; Tremsin, A.; Martin, A.; Ulmer, M.; Wessels, B.

    2006-11-01

    We have made substantial progress in the development of GaN photocathodes, including crystalline and polycrystalline GaN and InGaN coatings grown by chemical vapor deposition or molecular beam epitaxy on sapphire substrates. GaN and InGaN photocathodes have been developed with efficiencies up to 70% and cutoffs at ˜380 nm with low out of band response, and high stability and longevity. Samples have been processed and tested at ultra high vacuum to establish cathode process parameters, and some have been integrated into sealed tubes for long-term evaluation.

  2. Design of an Ultra-High Efficiency GaN High-Power Amplifier for SAR Remote Sensing

    NASA Technical Reports Server (NTRS)

    Thrivikraman, Tushar; Hoffman, James

    2013-01-01

    This work describes the development of a high-power amplifier for use with a remote sensing SAR system. The amplifier is intended to meet the requirements for the Sweep-SAR technique for use in the proposed DESDynI SAR instrument. In order to optimize the amplifier design, active load-pull technique is employed to provide harmonic tuning to provide efficiency improvements. In addition, some of the techniques to overcome the challenges of load-pulling high power devices are presented. The design amplifier was measured to have 49 dBm of output power with 75% PAE, which is suitable to meet the proposed system requirements.

  3. Design of an Ultra-High Efficiency GaN High-Power Amplifier for SAR Remote Sensing

    NASA Technical Reports Server (NTRS)

    Thrivikraman, Tushar; Hoffman, James

    2013-01-01

    This work describes the development of a high-power amplifier for use with a remote sensing SAR system. The amplifier is intended to meet the requirements for the Sweep-SAR technique for use in the proposed DESDynI SAR instrument. In order to optimize the amplifier design, active load-pull technique is employed to provide harmonic tuning to provide efficiency improvements. In addition, some of the techniques to overcome the challenges of load-pulling high power devices are presented. The design amplifier was measured to have 49 dBm of output power with 75% PAE, which is suitable to meet the proposed system requirements.

  4. Defect reduction in overgrown semi-polar (11-22) GaN on a regularly arrayed micro-rod array template

    SciTech Connect

    Zhang, Y.; Bai, J.; Hou, Y.; Smith, R. M.; Yu, X.; Gong, Y.; Wang, T.

    2016-02-15

    We demonstrate a great improvement in the crystal quality of our semi-polar (11-22) GaN overgrown on regularly arrayed micro-rod templates fabricated using a combination of industry-matched photolithography and dry-etching techniques. As a result of our micro-rod configuration specially designed, an intrinsic issue on the anisotropic growth rate which is a great challenge in conventional overgrowth technique for semi-polar GaN has been resolved. Transmission electron microscopy measurements show a different mechanism of defect reduction from conventional overgrowth techniques and also demonstrate major advantages of our approach. The dislocations existing in the GaN micro-rods are effectively blocked by both a SiO{sub 2} mask on the top of each GaN micro-rod and lateral growth along the c-direction, where the growth rate along the c-direction is faster than that along any other direction. Basal stacking faults (BSFs) are also effectively impeded, leading to a distribution of BSF-free regions periodically spaced by BSF regions along the [-1-123] direction, in which high and low BSF density areas further show a periodic distribution along the [1-100] direction. Furthermore, a defect reduction model is proposed for further improvement in the crystalline quality of overgrown (11-22) GaN on sapphire.

  5. Tellurium n-type doping of highly mismatched amorphous GaN1-xAsx alloys in plasma-assisted molecular beam epitaxy

    DOE PAGES

    Novikov, S. V.; Ting, M.; Yu, K. M.; ...

    2014-10-01

    In this paper we report our study on n-type Te doping of amorphous GaN1-xAsx layers grown by plasma-assisted molecular beam epitaxy. We have used a low temperature PbTe source as a source of tellurium. Reproducible and uniform tellurium incorporation in amorphous GaN1-xAsx layers has been successfully achieved with a maximum Te concentration of 9×10²⁰ cm⁻³. Tellurium incorporation resulted in n-doping of GaN1-xAsx layers with Hall carrier concentrations up to 3×10¹⁹ cm⁻³ and mobilities of ~1 cm²/V s. The optimal growth temperature window for efficient Te doping of the amorphous GaN1-xAsx layers has been determined.

  6. Optical spectroscopy of cubic GaN in nanowires

    NASA Astrophysics Data System (ADS)

    Renard, J.; Tourbot, G.; Sam-Giao, D.; Bougerol, C.; Daudin, B.; Gayral, B.

    2010-08-01

    We show that highly homogeneous cubic GaN can be grown by plasma-assisted molecular beam epitaxy on wurtzite GaN nanowires. The line width of the donor bound exciton is below 3 meV and can reach 1.6 meV in the best parts of the studied sample. This allows to perform a detailed spectroscopy of cubic GaN, and, in particular, to determine the precise spectral positions of the donor bound exciton, the fundamental free exciton and the split-off exciton in a photoluminescence experiment.

  7. Growth and characteristics of self-assembly defect-free GaN surface islands by molecular beam epitaxy.

    PubMed

    Hsu, Kuang-Yuan; Wang, Cheng-Yu; Liu, Chuan-Pu

    2011-04-01

    GaN surface nano-islands of high crystal quality, without any dislocations or other extended defects, are grown on a c-plane sapphire substrate by plasma-assisted molecular beam epitaxy. Nano-island growth requires special conditions in terms of V/III ratio and substrate temperature, distinct from either film or nanocolumn growth. The insertion of a nitrided Ga layer can effectively improve the uniformity of the nano-islands in both shape and size. The islands are well faced truncated pyramids with island size ranged from 30 to 110 nm, and height ranged from 30 to 55 nm. On, the other hand, the density and facet of the GaN surface islands would be affected by the growth conditions. An increase of the V/III ratio from 30 to 40 led to an increase in density from 1.4 x 10(9) to 4.3 x 10(9) cm(-2) and an evolution from {1-21-1} facets to {1-21-2} facets. The GaN layers containing the surface islands can moderate the compressive strain due to the lattice and thermal mismatch between GaN and c-sapphire. Conductive atomic force microscopy shows that the off-axis sidewall facets are more electrically active than those at the island center. The formation of the GaN surface islands is strongly induced by the Ehrlich-Schwoebel barrier effect of preexisting islands grown in the early growth stage. GaN surface islands are ideal templates for growing nano-devices.

  8. Less strained and more efficient GaN light-emitting diodes with embedded silica hollow nanospheres

    PubMed Central

    Kim, Jonghak; Woo, Heeje; Joo, Kisu; Tae, Sungwon; Park, Jinsub; Moon, Daeyoung; Park, Sung Hyun; Jang, Junghwan; Cho, Yigil; Park, Jucheol; Yuh, Hwankuk; Lee, Gun-Do; Choi, In-Suk; Nanishi, Yasushi; Han, Heung Nam; Char, Kookheon; Yoon, Euijoon

    2013-01-01

    Light-emitting diodes (LEDs) become an attractive alternative to conventional light sources due to high efficiency and long lifetime. However, different material properties between GaN and sapphire cause several problems such as high defect density in GaN, serious wafer bowing, particularly in large-area wafers, and poor light extraction of GaN-based LEDs. Here, we suggest a new growth strategy for high efficiency LEDs by incorporating silica hollow nanospheres (S-HNS). In this strategy, S-HNSs were introduced as a monolayer on a sapphire substrate and the subsequent growth of GaN by metalorganic chemical vapor deposition results in improved crystal quality due to nano-scale lateral epitaxial overgrowth. Moreover, well-defined voids embedded at the GaN/sapphire interface help scatter lights effectively for improved light extraction, and reduce wafer bowing due to partial alleviation of compressive stress in GaN. The incorporation of S-HNS into LEDs is thus quite advantageous in achieving high efficiency LEDs for solid-state lighting. PMID:24220259

  9. Charge transfer in Fe-doped GaN: The role of the donor

    SciTech Connect

    Sunay, Ustun; Dashdorj, J.; Zvanut, M. E.; Harrison, J. G.; Leach, J. H.; Udwary, K.

    2014-02-21

    Several nitride-based device structures would benefit from the availability of high quality, large-area, freestanding semi-insulating GaN substrates. Due to the intrinsic n-type nature of GaN, however, the incorporation of compensating centers such as Fe is necessary to achieve the high resistivity required. We are using electron paramagnetic resonance (EPR) to explore charge transfer in 450 um thick GaN:Fe plates to understand the basic mechanisms related to compensation so that the material may be optimized for device applications. The results suggest that the simple model based on one shallow donor and a single Fe level is insufficient to describe compensation. Rather, the observation of the neutral donor and Fe3+ indicates that either the two species are spatially segregated or additional compensating and donor defects must be present.

  10. CONDENSED MATTER: STRUCTURE, THERMAL AND MECHANICAL PROPERTIES: The effect of single AlGaN interlayer on the structural properties of GaN epilayers grown on Si (111) substrates

    NASA Astrophysics Data System (ADS)

    Wu, Yu-Xin; Zhu, Jian-Jun; Zhao, De-Gang; Liu, Zong-Shun; Jiang, De-Sheng; Zhang, Shu-Ming; Wang, Yu-Tian; Wang, Hui; Chen, Gui-Feng; Yang, Hui

    2009-10-01

    High-quality and nearly crack-free GaN epitaxial layer was obtained by inserting a single AlGaN interlayer between GaN epilayer and high-temperature AlN buffer layer on Si (111) substrate by metalorganic chemical vapor deposition. This paper investigates the effect of AlGaN interlayer on the structural properties of the resulting GaN epilayer. It confirms from the optical microscopy and Raman scattering spectroscopy that the AlGaN interlayer has a remarkable effect on introducing relative compressive strain to the top GaN layer and preventing the formation of cracks. X-ray diffraction and transmission electron microscopy analysis reveal that a significant reduction in both screw and edge threading dislocations is achieved in GaN epilayer by the insertion of AlGaN interlayer. The process of threading dislocation reduction in both AlGaN interlayer and GaN epilayer is demonstrated.

  11. Alignment control and atomically-scaled heteroepitaxial interface study of GaN nanowires.

    PubMed

    Liu, Qingyun; Liu, Baodan; Yang, Wenjin; Yang, Bing; Zhang, Xinglai; Labbé, Christophe; Portier, Xavier; An, Vladimir; Jiang, Xin

    2017-04-11

    Well-aligned GaN nanowires are promising candidates for building high-performance optoelectronic nanodevices. In this work, we demonstrate the epitaxial growth of well-aligned GaN nanowires on a [0001]-oriented sapphire substrate in a simple catalyst-assisted chemical vapor deposition process and their alignment control. It is found that the ammonia flux plays a key role in dominating the initial nucleation of GaN nanocrystals and their orientation. Typically, significant improvement of the GaN nanowire alignment can be realized at a low NH3 flow rate. X-ray diffraction and cross-sectional scanning electron microscopy studies further verified the preferential orientation of GaN nanowires along the [0001] direction. The growth mechanism of GaN nanowire arrays is also well studied based on cross-sectional high-resolution transmission electron microscopy (HRTEM) characterization and it is observed that GaN nanowires have good epitaxial growth on the sapphire substrate following the crystallographic relationship between (0001)GaN∥(0001)sapphire and (101[combining macron]0)GaN∥(112[combining macron]0)sapphire. Most importantly, periodic misfit dislocations are also experimentally observed in the interface region due to the large lattice mismatch between the GaN nanowire and the sapphire substrate, and the formation of such dislocations will favor the release of structural strain in GaN nanowires. HRTEM analysis also finds the existence of "type I" stacking faults and voids inside the GaN nanowires. Optical investigation suggests that the GaN nanowire arrays have strong emission in the UV range, suggesting their crystalline nature and chemical purity. The achievement of aligned GaN nanowires will further promote the wide applications of GaN nanostructures toward diverse high-performance optoelectronic nanodevices including nano-LEDs, photovoltaic cells, photodetectors etc.

  12. GaN growth on Si pillar arrays by metalorganic chemical vapor deposition

    NASA Astrophysics Data System (ADS)

    Won, Dongjin; Weng, Xiaojun; Yuwen, Yu A.; Ke, Yue; Kendrick, Chito; Shen, Haoting; Mayer, Theresa S.; Redwing, Joan M.

    2013-05-01

    GaN growth on high aspect ratio Si micro-pillar arrays prepared by deep reactive ion etching (DRIE) was investigated using Si(111), Si(110), Si(112), and Si(100) substrates. The sidewall roughness of the Si pillars resulting from DRIE was reduced by thermal annealing at 1100 °C in H2 for 5 min. Conformal AlN buffer layers were grown at 1100 °C on the pillars. In contrast, GaN films grown at 1100 °C were always faceted since GaN preferentially nucleated and grew on the Si{1 1¯ 0} and Si{1 1¯ 1} sidewall planes of the Si pillars. The preferential growth lead to unique symmetries for the independent GaN fins depending on pillar orientation. Lateral growth of the GaN fins at 1100 °C was enhanced with increasing V/III ratio up to 22710. However, the GaN fins did not coalesce seamlessly. A lower growth temperature of 800 °C gave rise to a conformal polycrystalline GaN shell. Post-annealing of the GaN shells at 1100 °C in H2 for 15 min after growth at 800 °C induced highly textured GaN films although the GaN films became partly faceted.

  13. Study on the relationships between Raman shifts and temperature range for a-plane GaN using temperature-dependent Raman scattering

    NASA Astrophysics Data System (ADS)

    Wang, Dang-Hui; Xu, Sheng-Rui; Hao, Yue; Zhang, Jin-Cheng; Xu, Tian-Han; Lin, Zhi-Yu; Zhou, Hao; Xue, Xiao-Yong

    2013-02-01

    In this paper, Raman shifts of a-plane GaN layers grown on r-plane sapphire substrates by low-pressure metal—organic chemical vapor deposition (LPMOCVD) are investigated. We compare the crystal qualities and study the relationships between Raman shift and temperature for conventional a-plane GaN epilayer and insertion AlN/AlGaN superlattice layers for a-plane GaN epilayer using temperature-dependent Raman scattering in a temperature range from 83 K to 503 K. The temperature-dependences of GaN phonon modes (A1 (TO), E2 (high), and E1 (TO)) and the linewidths of E2 (high) phonon peak are studied. The results indicate that there exist two mechanisms between phonon peaks in the whole temperature range, and the relationship can be fitted to the pseudo-Voigt function. From analytic results we find a critical temperature existing in the relationship, which can characterize the anharmonic effects of a-plane GaN in different temperature ranges. In the range of higher temperature, the relationship exhibits an approximately linear behavior, which is consistent with the analyzed results theoretically.

  14. Thermal stability of deep level defects induced by high energy proton irradiation in n-type GaN

    SciTech Connect

    Zhang, Z.; Farzana, E.; Sun, W. Y.; Arehart, A. R.; Ringel, S. A.; Chen, J.; Zhang, E. X.; Fleetwood, D. M.; Schrimpf, R. D.; McSkimming, B.; Kyle, E. C. H.; Speck, J. S.

    2015-10-21

    The impact of annealing of proton irradiation-induced defects in n-type GaN devices has been systematically investigated using deep level transient and optical spectroscopies. Moderate temperature annealing (>200–250 °C) causes significant reduction in the concentration of nearly all irradiation-induced traps. While the decreased concentration of previously identified N and Ga vacancy related levels at E{sub C} − 0.13 eV, 0.16 eV, and 2.50 eV generally followed a first-order reaction model with activation energies matching theoretical values for N{sub I} and V{sub Ga} diffusion, irradiation-induced traps at E{sub C} − 0.72 eV, 1.25 eV, and 3.28 eV all decrease in concentration in a gradual manner, suggesting a more complex reduction mechanism. Slight increases in concentration are observed for the N-vacancy related levels at E{sub C} − 0.20 eV and 0.25 eV, which may be due to the reconfiguration of other N-vacancy related defects. Finally, the observed reduction in concentrations of the states at E{sub C} − 1.25 and E{sub C} − 3.28 eV as a function of annealing temperature closely tracks the detailed recovery behavior of the background carrier concentration as a function of annealing temperature. As a result, it is suggested that these two levels are likely to be responsible for the underlying carrier compensation effect that causes the observation of carrier removal in proton-irradiated n-GaN.

  15. Structural defects in bulk GaN

    NASA Astrophysics Data System (ADS)

    Liliental-Weber, Z.; dos Reis, R.; Mancuso, M.; Song, C. Y.; Grzegory, I.; Porowski, S.; Bockowski, M.

    2014-10-01

    Transmission Electron Microscopy (TEM) studies of undoped and Mg doped GaN layers grown on the HVPE substrates by High Nitrogen Pressure Solution (HNPS) with the multi-feed-seed (MFS) configuration are shown. The propagation of dislocations from the HVPE substrate to the layer is observed. Due to the interaction between these dislocations in the thick layers much lower density of these defects is observed in the upper part of the HNPS layers. Amorphous Ga precipitates with attached voids pointing toward the growth direction are observed in the undoped layer. This is similar to the presence of Ga precipitates in high-pressure platelets, however the shape of these precipitates is different. The Mg doped layers do not show Ga precipitates, but MgO rectangular precipitates are formed, decorating the dislocations. Results of TEM studies of HVPE layers grown on Ammonothermal substrates are also presented. These layers have superior crystal quality in comparison to the HNPS layers, as far as density of dislocation is concern. Occasionally some small inclusions can be found, but their chemical composition was not yet determined. It is expected that growth of the HNPS layers on these substrate will lead to large layer thickness obtained in a short time and with high crystal perfection needed in devices.

  16. High power, high beam quality regenerative amplifier

    DOEpatents

    Hackel, L.A.; Dane, C.B.

    1993-08-24

    A regenerative laser amplifier system generates high peak power and high energy per pulse output beams enabling generation of X-rays used in X-ray lithography for manufacturing integrated circuits. The laser amplifier includes a ring shaped optical path with a limited number of components including a polarizer, a passive 90 degree phase rotator, a plurality of mirrors, a relay telescope, and a gain medium, the components being placed close to the image plane of the relay telescope to reduce diffraction or phase perturbations in order to limit high peak intensity spiking. In the ring, the beam makes two passes through the gain medium for each transit of the optical path to increase the amplifier gain to loss ratio. A beam input into the ring makes two passes around the ring, is diverted into an SBS phase conjugator and proceeds out of the SBS phase conjugator back through the ring in an equal but opposite direction for two passes, further reducing phase perturbations. A master oscillator inputs the beam through an isolation cell (Faraday or Pockels) which transmits the beam into the ring without polarization rotation. The isolation cell rotates polarization only in beams proceeding out of the ring to direct the beams out of the amplifier. The diffraction limited quality of the input beam is preserved in the amplifier so that a high power output beam having nearly the same diffraction limited quality is produced.

  17. High power, high beam quality regenerative amplifier

    DOEpatents

    Hackel, Lloyd A.; Dane, Clifford B.

    1993-01-01

    A regenerative laser amplifier system generates high peak power and high energy per pulse output beams enabling generation of X-rays used in X-ray lithography for manufacturing integrated circuits. The laser amplifier includes a ring shaped optical path with a limited number of components including a polarizer, a passive 90 degree phase rotator, a plurality of mirrors, a relay telescope, and a gain medium, the components being placed close to the image plane of the relay telescope to reduce diffraction or phase perturbations in order to limit high peak intensity spiking. In the ring, the beam makes two passes through the gain medium for each transit of the optical path to increase the amplifier gain to loss ratio. A beam input into the ring makes two passes around the ring, is diverted into an SBS phase conjugator and proceeds out of the SBS phase conjugator back through the ring in an equal but opposite direction for two passes, further reducing phase perturbations. A master oscillator inputs the beam through an isolation cell (Faraday or Pockels) which transmits the beam into the ring without polarization rotation. The isolation cell rotates polarization only in beams proceeding out of the ring to direct the beams out of the amplifier. The diffraction limited quality of the input beam is preserved in the amplifier so that a high power output beam having nearly the same diffraction limited quality is produced.

  18. Mechanism of stress control for GaN growth on Si using AlN interlayers

    NASA Astrophysics Data System (ADS)

    Suzuki, Michihiro; Nakamura, Akihiro; Nakano, Yoshiaki; Sugiyama, Masakazu

    2017-04-01

    For the purpose of controlling the wafer bow of GaN-on-Si structure, in situ curvature transient during the growth of a GaN layer on an AlN interlayer was investigated systematically by estimating the compressive strain applied to the GaN layer with the progress of the layer growth. The compressive strain was dependent on the morphology of the GaN surface prior to the growth of the AlN interlayer. It was found that the transition sequence from GaN growth to AlN growth induces roughening of the GaN surface and both high NH3 partial pressure and the short transition time were effective for reducing the roughness of the GaN surface beneath the AlN interlayer. The improved transition sequence increased the compressive strain in GaN by a factor of 2.5. The AlN grown at the same temperature as that of GaN was beneficial in both better surface morphology and the reduction of the transition time between GaN growth and AlN growth. With this high-temperature AlN interlayer, its thickness is another important factor governing the compressive strain in GaN. To get AlN relaxed for applying the compressive strain to GaN, the AlN layer should be thicker but too thick layer after relaxation results in surface roughening, which in turn introduces defects to the overlying GaN layer and reduces the compressive strain by partial lattice relaxation of GaN.

  19. Europium doping of zincblende GaN by ion implantation

    SciTech Connect

    Lorenz, K.; Franco, N.; Darakchieva, V.; Alves, E.; Roqan, I. S.; O'Donnell, K. P.; Trager-Cowan, C.; Martin, R. W.; As, D. J.; Panfilova, M.

    2009-06-01

    Eu was implanted into high quality cubic (zincblende) GaN (ZB-GaN) layers grown by molecular beam epitaxy. Detailed structural characterization before and after implantation was performed by x-ray diffraction (XRD) and Rutherford backscattering/channeling spectrometry. A low concentration (<10%) of wurtzite phase inclusions was observed by XRD analysis in as-grown samples with their (0001) planes aligned with the (111) planes of the cubic lattice. Implantation of Eu causes an expansion of the lattice parameter in the implanted region similar to that observed for the c-lattice parameter of wurtzite GaN (W-GaN). For ZB-GaN:Eu, a large fraction of Eu ions is found on a high symmetry interstitial site aligned with the <110> direction, while a Ga substitutional site is observed for W-GaN:Eu. The implantation damage in ZB-GaN:Eu could partly be removed by thermal annealing, but an increase in the wurtzite phase fraction was observed at the same time. Cathodoluminescence, photoluminescence (PL), and PL excitation spectroscopy revealed several emission lines which can be attributed to distinct Eu-related optical centers in ZB-GaN and W-GaN inclusions.

  20. High quality electron beams for high quality FEL

    NASA Astrophysics Data System (ADS)

    Allaria, E.

    2017-05-01

    Thanks to the use of seeding, modern high gain FELs can now produce high power pulses with a longitudinal coherence much higher than normally available from SASE FELs. This possibility of fully coherent FEL pulses in the X-ray spectral range has several benefits for user's experiment and also it opens the door to new experimental possibilities such as coherent control experiments. The achievement of a full coherence in the FEL pulses does not only requires a coherent seed but also needs an electron beam whose properties does not change over the length of the final FEL pulse. For this reason, requirements for electron beam quality in seeded FELs are significantly higher than for SASE FEL. Starting from the FERMI experience we report in the talk examples of small electron beam perturbations that have a large impact on FEL properties.

  1. Structural, Optical and Electrical Properties of n-type GaN on Si (111) Grown by RF-plasma assisted Molecular Beam Epitaxy

    SciTech Connect

    Chin, C. W.; Hassan, Z.; Yam, F. K.

    2008-05-20

    In this paper, we present the study of the structural, optical and electrical of n-type GaN grown on silicon (111) by RF plasma-assisted molecular beam epitaxy (RF-MBE). X-ray diffraction (XRD) measurement reveals that the GaN was epitaxially grown on silicon. For the photoluminescence (PL) measurement, a sharp and intense peak at 364.5 nm indicates that the sample is of high optical quality. Hall effect measurement shows that the film has a carrier concentration of 3.28x10{sup 19} cm{sup -3}. The surface of the n-type GaN was smooth and no any cracks and pits.

  2. GaN membrane MSM ultraviolet photodetectors

    NASA Astrophysics Data System (ADS)

    Muller, A.; Konstantinidis, G.; Kostopoulos, A.; Dragoman, M.; Neculoiu, D.; Androulidaki, M.; Kayambaki, M.; Vasilache, D.; Buiculescu, C.; Petrini, I.

    2006-12-01

    GaN exhibits unique physical properties, which make this material very attractive for wide range of applications and among them ultraviolet detection. For the first time a MSM type UV photodetector structure was manufactured on a 2.2 μm. thick GaN membrane obtained using micromachining techniques. The low unintentionally doped GaN layer structure was grown by MOCVD on high resistivity (ρ>10kΩcm) <111> oriented silicon wafers, 500μm thick. The epitaxially grown layers include a thin AlN layer in order to reduce the stress in the GaN layer and avoid cracking. Conventional contact lithography, e-gun Ni/Au (10nm /200nm) evaporation and lift-off techniques were used to define the interdigitated Schottky metalization on the top of the wafer. Ten digits with a width of 1μm and a length of 100μm were defined for each electrode. The distance between the digits was also 1μm. After the backside lapping of the wafer to a thickness of approximately 150μm, a 400nm thick Al layer was patterned and deposited on the backside, to be used as mask for the selective reactive ion etching of silicon. The backside mask, for the membrane formation, was patterned using double side alignment techniques and silicon was etched down to the 2.2μm thin GaN layer using SF 6 plasma. A very low dark current (30ρA at 3V) was obtained. Optical responsivity measurements were performed at 1.5V. A maximum responsivity of 18mA/W was obtained at a wavelength of 370nm. This value is very good and can be further improved using transparent contacts for the interdigitated structure.

  3. Growth of freestanding GaN using pillar-epitaxial lateral overgrowth from GaN nanocolumns

    NASA Astrophysics Data System (ADS)

    Bougrioua, Z.; Gibart, P.; Calleja, E.; Jahn, U.; Trampert, A.; Ristic, J.; Utrera, M.; Nataf, G.

    2007-12-01

    Dislocation-free and strain-free GaN nanopillars, grown on Si by molecular beam epitaxy, were used as nanoseeds for a new form of epitaxial lateral overgrowth (ELO) by metalorganic vapour phase epitaxy (MOVPE) until full coalescence. Such overgrown GaN films are almost relaxed and were used as templates for producing thick GaN layers by halide vapour phase epitaxy (HVPE). The final GaN film is easily separated from the starting Si substrate. This is henceforth a new technology to produce freestanding GaN. The GaN crystal quality was assessed by transmission electron microscopy (TEM), photo- and cathodoluminescence (PL, CL). It was seen that the pillar-ELO is produced from a limited number of nanopillars. Some dislocations and basal stacking faults are formed during the coalescence. However, those that propagate parallel to the substrate do not replicate in the top layer and it is expected that the thickened material present a reduced defect density.

  4. Influence of post-deposition annealing on interfacial properties between GaN and ZrO{sub 2} grown by atomic layer deposition

    SciTech Connect

    Ye, Gang; Wang, Hong Arulkumaran, Subramaniam; Ng, Geok Ing; Li, Yang; Ang, Kian Siong; Geok Ng, Serene Lay; Ji, Rong; Liu, Zhi Hong

    2014-10-13

    Influence of post-deposition annealing on interfacial properties related to the formation/annihilation of interfacial GaO{sub x} layer of ZrO{sub 2} grown by atomic layer deposition (ALD) on GaN is studied. ZrO{sub 2} films were annealed in N{sub 2} atmospheres in temperature range of 300 °C to 700 °C and analyzed by X-ray photoelectron spectroscopy and high-resolution transmission electron microscopy. It has been found that Ga-O bond to Ga-N bond area ratio decreases in the samples annealed at temperatures lower than 500 °C, which could be attributed to the thinning of GaO{sub x} layer associated with low surface defect states due to “clean up” effect of ALD-ZrO{sub 2} on GaN. However, further increase in annealing temperature results in deterioration of interface quality, which is evidenced by increase in Ga-O bond to Ga-N bond area ratio and the reduction of Ga-N binding energy.

  5. High temperature stable W and WSi{sub x} ohmic contacts on GaN and InGaN

    SciTech Connect

    Pearton, S.J.; Abernathy, C.R.; Durbha, A.

    1996-06-01

    Conventional III-V metallizations chemes such as Au/Ge/Ni, Ti/Pt/Au, and Au/Be were found to display poor thermal stability on both GaN and InGaN, with extensive reaction and contact degradation at {le}500 C. By contrast, W was found to produce low contact resistance ({rho}{sub c}{similar_to}8x10{sup -5}{Omega}cm{sup 2}) to n-GaN. Ga outdiffusion to the surface of thin (500 A) W films was found after annealing at 1,100 C, but not at 1000 C. Interfacial abruptness increased by 300A after 1,100 C annealing. In the case of WSi{sub X} (X=0.45), Ga outdiffusion was absent even at 1,100 C, but again there was interfacial broadening and some phase changes in the WSi{sub X}. On In{sub 0.5}Ga{sub 0.5}N, a minimum specific contact resistivity of 1.5 x10{sup -5}{Omega}cm{sup 2} was obtained for WSi{sub X} annealed at 700 C. These contacts retained a smooth morphology and abrupt interfaces to 800 C. Graded In{sub X}Ga{sub 1-X}N layers have been employed on GaAs/AlGaAs HBTs (heterojunction bipolar transistors), replacing conventional In{sub X}Ga{sub 1-X}As layers. R{sub C} values of 5x10{sup -7}{Omega}cm{sup 2} were obtained for nonalloyed Ti/Pt/Au on the InGaN, and the morphologies were superior to those of InGaAs contact layers. This proves to have significant advantages for fabrication of sub-micron HBTs. Devices with emitter dimensions of 2x5{mu}m{sup 2} displayed gains of 35 for a base doping level of 7x10{sup 19}cm{sup -3} and stable long-term behavior.

  6. Radiation effects in GaN devices and materials (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Sun, Ke-Xun; Nelson, Ron; Yeamans, Charles

    2016-10-01

    Gallium Nitride (GaN) is a wide-bandgap semiconductor having excellent radiation properties. GaN crystal is ionic-covalent with significant iconicity resulting in stronger molecular bond strength, which in in turn leads to excellent radiation hardness. Further, GaN has ultrafast carrier relaxation time. GaN transistors are promising for high-frequency applications due to their large bandgap (3.9eV) and higher breakdown field (<5MV/cm). These exceptional characteristics make GaN suitable to operate in high radiation flux environment such as fusion plasma facilities, for ultrafast detection. The expected detector temporal response is faster than 0.01-1 ns. We have been systematically testing neutron radiation effects in GaN devices and materials at Los Alamos Neutron Science Center (LANSCE) with ever increased neutron fluence levels, and at National Ignition Facility (NIF) high foot, high yield shots. In 2013 LANSCE run cycle, we tested GaN UV LED devices at 3.1E11 neutrons/cm^2. In 2015-2016 LANSCE run cycles, we have been operating three neutron beam lines with fluence level 1.2E11, 1.5E13, and 1E15 neutrons/cm^2. The irradiated samples include GaN UV LEDs, GaN HEMTs, and GaN substrates. In the experiments up to 2015 run cycle, we have characterized electrical and optical performances of GaN device before and after neutron irradiation, including the device IV curve measurements monitored at over the three months neutron irradiation time, and device IV curve measurements before and after NIF high yield shot irradiation. We observed no substantial degradation. These experiments firmly established GaN devices as the radiation hard platform of the next generation fusion plasma diagnostic instruments.

  7. Growth and properties of bulk single crystals of GaN

    SciTech Connect

    Suski, T.; Perlin, P.; Leszczynski, M.

    1996-11-01

    In this paper the authors review recent developments in the growth of bulk GaN crystals by a high-pressure, high-temperature method. They also provide information on various physical properties of bulk GaN material. Then, some preliminary results on the homoepitaxial growth of GaN are given. In the second part of this paper the authors discuss the following problems: the possible origin of the large free electron concentration in undoped GaN material, the parasitic effect of yellow luminescence and the nature of Zn- and Mg-acceptors.

  8. Breakdown mechanisms in AlGaN/GaN high electron mobility transistors with different GaN channel thickness values

    NASA Astrophysics Data System (ADS)

    Ma, Xiao-Hua; Zhang, Ya-Man; Wang, Xin-Hua; Yuan, Ting-Ting; Pang, Lei; Chen, Wei-Wei; Liu, Xin-Yu

    2015-02-01

    In this paper, the off-state breakdown characteristics of two different AlGaN/GaN high electron mobility transistors (HEMTs), featuring a 50-nm and a 150-nm GaN thick channel layer, respectively, are compared. The HEMT with a thick channel exhibits a little larger pinch-off drain current but significantly enhanced off-state breakdown voltage (BVoff). Device simulation indicates that thickening the channel increases the drain-induced barrier lowering (DIBL) but reduces the lateral electric field in the channel and buffer underneath the gate. The increase of BVoff in the thick channel device is due to the reduction of the electric field. These results demonstrate that it is necessary to select an appropriate channel thickness to balance DIBL and BVoff in AlGaN/GaN HEMTs. Project supported by the Program for New Century Excellent Talents in University (Grant No. NCET-12-0915) and the National Natural Science Foundation of China (Grant Nos. 61334002 and 61204086).

  9. Interface control technologies for high-power GaN transistors: Self-stopping etching of p-GaN layers utilizing electrochemical reactions

    NASA Astrophysics Data System (ADS)

    Sato, Taketomo; Kumazaki, Yusuke; Edamoto, Masaaki; Akazawa, Masamichi; Hashizume, Tamotsu

    2016-02-01

    The selective and low-damaged etching of p-type GaN or AlGaN layer is inevitable process for AlGaN/GaN high-power transistors. We have investigated an electrochemical etching of p-GaN layer grown on AlGaN/GaN heterostructures, consisting of an anodic oxidation of p-GaN surface and a subsequent dissolution of the resulting oxide. The p-GaN layer was electrochemically etched by following the pattern of the SiO2 film that acted as an etching mask. Etching depth was linearly controlled by cycle number of triangular waveform at a rate of 25 nm/cycle. The AFM, TEM and μ-AES results showed that the top p-GaN layer was completely removed after 5 cycles applied, and the etching reaction was automatically sopped on the AlGaN surface. I-V and C-V measurements revealed that no significant damages were induced in the AlGaN/GaN heterostructures.

  10. Postprocessing annealing effects on direct current and microwave performance of AlGaN /GaN high electron mobility transistors

    NASA Astrophysics Data System (ADS)

    Lee, Jaesun; Liu, Dongmin; Kim, Hyeongnam; Lu, Wu

    2004-09-01

    The effects of postprocessing annealing on direct current, radio frequency small signal, and power performances of AlGaN /GaN high electron mobility transistors with a gate-length of 0.2μm were investigated. The postannealing technique can improve the device performance, especially, after 10min postannealing at 400°C, the gate-to-drain breakdown voltage of devices exhibits remarkable improvement from 25 to 187V. The maximum extrinsic transconductance increases from 223 to 233mS/mm at a drain bias of 10V after 10min annealing at 400°C. The maximum drain current at a gate bias of 1V increases from 823 to 956mA/mm. After annealing, the values of the unity current gain cut-off frequency and the maximum oscillation frequency increases from 24 and 80GHz to 55 and 150GHz, respectively. The output power and gain at 10GHz were improved from 16.4dBm and 11.4dB to 25.9dBm and 19dB, respectively.

  11. Insulating gallium oxide layer produced by thermal oxidation of gallium-polar GaN: Insulating gallium oxide layer produced by thermal oxidation of gallium-polar GaN

    SciTech Connect

    Hossain, T.; Wei, D.; Nepal, N.; Garces, N. Y.; Hite, J. K.; Meyer, H. M.; Eddy, C. R.; Baker, Troy; Mayo, Ashley; Schmitt, Jason; Edgar, J. H.

    2014-02-24

    We report the benefits of dry oxidation of n -GaN for the fabrication of metal-oxide-semiconductor structures. GaN thin films grown on sapphire by MOCVD were thermally oxidized for 30, 45 and 60 minutes in a pure oxygen atmosphere at 850 °C to produce thin, smooth GaOx layers. Moreover, the GaN sample oxidized for 30 minutes had the best properties. Its surface roughness (0.595 nm) as measured by atomic force microscopy (AFM) was the lowest. Capacitance-voltage measurements showed it had the best saturation in accumulation region and the sharpest transition from accumulation to depletion regions. Under gate voltage sweep, capacitance-voltage hysteresis was completely absent. The interface trap density was minimum (Dit = 2.75×1010 cm–2eV–1) for sample oxidized for 30 mins. These results demonstrate a high quality GaOx layer is beneficial for GaN MOSFETs.

  12. Wafer-scale epitaxial lift-off of optoelectronic grade GaN from a GaN substrate using a sacrificial ZnO interlayer

    NASA Astrophysics Data System (ADS)

    Rajan, Akhil; Rogers, David J.; Ton-That, Cuong; Zhu, Liangchen; Phillips, Matthew R.; Sundaram, Suresh; Gautier, Simon; Moudakir, Tarik; El-Gmili, Youssef; Ougazzaden, Abdallah; Sandana, Vinod E.; Teherani, Ferechteh H.; Bove, Philippe; Prior, Kevin A.; Djebbour, Zakaria; McClintock, Ryan; Razeghi, Manijeh

    2016-08-01

    Full 2 inch GaN epilayers were lifted off GaN and c-sapphire substrates by preferential chemical dissolution of sacrificial ZnO underlayers. Modification of the standard epitaxial lift-off (ELO) process by supporting the wax host with a glass substrate proved key in enabling full wafer scale-up. Scanning electron microscopy and x-ray diffraction confirmed that intact epitaxial GaN had been transferred to the glass host. Depth-resolved cathodoluminescence (CL) analysis of the bottom surface of the lifted-off GaN layer revealed strong near-band-edge (3.33 eV) emission indicating a superior optical quality for the GaN which was lifted off the GaN substrate. This modified ELO approach demonstrates that previous theories proposing that wax host curling was necessary to keep the ELO etch channel open do not apply to the GaN/ZnO system. The unprecedented full wafer transfer of epitaxial GaN to an alternative support by ELO offers the perspective of accelerating industrial adoption of the expensive GaN substrate through cost-reducing recycling.

  13. Effects of hydrogen etching on stress control in AlN interlayer inserted GaN MOVPE on Si

    NASA Astrophysics Data System (ADS)

    Liu, Cai; Kumamoto, Akihito; Suzuki, Michihiro; Wang, Hongbo; Sodabanlu, Hassanet; Sugiyama, Masakazu; Nakano, Yoshiaki

    2017-07-01

    Clarification and control of the hydrogen etching of GaN is essential to achieving high-quality GaN-on-Si virtual substrates and devices based on it produced by metalorganic vapor phase epitaxy. This phenomenon and its effects on GaN-on-Si stress control were studied in this work. Without deliberate protection, voids with lateral sizes on the micrometre level underneath AlN interlayers emerged in GaN. Such voids made stress balancing in GaN-on-Si systems by inserting AlN interlayers less efficient. By flowing a protective large flow rate of ammonia, voids were eliminated while GaN decomposition still happened, which led to AlGaN alloy in the interlayers. Interfaces of Ga incorporated AlN interlayers grown under large-scale varied conditions were characterised by scanning transmission electron microscopy and energy dispersive spectrometry. Higher growth temperatures caused more Ga in the interlayers and weakened their capacity to induce compressive stress in the overlying GaN.

  14. Thermodynamic theory of epitaxial alloys: first-principles mixed-basis cluster expansion of (In, Ga)N alloy film.

    PubMed

    Liu, Jefferson Zhe; Zunger, Alex

    2009-07-22

    Epitaxial growth of semiconductor alloys onto a fixed substrate has become the method of choice to make high quality crystals. In the coherent epitaxial growth, the lattice mismatch between the alloy film and the substrate induces a particular form of strain, adding a strain energy term into the free energy of the alloy system. Such epitaxial strain energy can alter the thermodynamics of the alloy, leading to a different phase diagram and different atomic microstructures. In this paper, we present a general-purpose mixed-basis cluster expansion method to describe the thermodynamics of an epitaxial alloy, where the formation energy of a structure is expressed in terms of pair and many-body interactions. With a finite number of first-principles calculation inputs, our method can predict the energies of various atomic structures with an accuracy comparable to that of first-principles calculations themselves. Epitaxial (In, Ga)N zinc-blende alloy grown on GaN(001) substrate is taken as an example to demonstrate the details of the method. Two (210) superlattice structures, (InN)(2)/(GaN)(2) (at x = 0.50) and (InN)(4)/(GaN)(1) (at x = 0.80), are identified as the ground state structures, in contrast to the phase-separation behavior of the bulk alloy.

  15. Semipolar (202{sup ¯}1) GaN and InGaN quantum wells on sapphire substrates

    SciTech Connect

    Leung, Benjamin; Wang, Dili; Kuo, Yu-Sheng; Xiong, Kanglin; Song, Jie; Chen, Danti; Park, Sung Hyun; Han, Jung; Hong, Su Yeon; Choi, Joo Won

    2014-06-30

    Here, we demonstrate a process to produce planar semipolar (202{sup ¯}1) GaN templates on sapphire substrates. We obtain (202{sup ¯}1) oriented GaN by inclined c-plane sidewall growth from etched sapphire, resulting in single crystal material with on-axis x-ray diffraction linewidth below 200 arc sec. The surface, composed of (101{sup ¯}1) and (101{sup ¯}0) facets, is planarized by the chemical-mechanical polishing of full 2 in. wafers, with a final surface root mean square roughness of <0.5 nm. We then analyze facet formation and roughening mechanisms on the (202{sup ¯}1) surface and establish a growth condition in N{sub 2} carrier gas to maintain a planar surface for further device layer growth. Finally, the capability of these semipolar (202{sup ¯}1) GaN templates to produce high quality device structures is verified by the growth and characterization of InGaN/GaN multiple quantum well structures. It is expected that the methods shown here can enable the benefits of using semipolar orientations in a scalable and practical process and can be readily extended to achieve devices on surfaces using any orientation of semipolar GaN on sapphire.

  16. Defect reduction in (112_O) a-plane GaN by two-stage epitaxiallateral overgrowth

    SciTech Connect

    Ni, X.; Ozgur, U.; Fu, Y.; Biyikli, N.; Xie, J.; Baski, A.A.; Morkoc, H.; Liliental-Weber, Z.

    2006-10-20

    In the epitaxial lateral overgrowth (ELO) of (11{bar 2}0) a-plane GaN, the uneven growth rates of two opposing wings, Ga- and N-wings, makes the coalescence of two neighboring wings more difficult than that in c-plane GaN. We report a two-stage growth method to get uniformly coalesced epitaxial lateral overgrown a-plane GaN using metalorganic chemical vapor deposition (MOCVD) by employing relatively lower growth temperature in the first step followed by enhanced lateral growth in the second. Using this method, the height differences between Ga-polar and N-polar wings at the coalescence front could be reduced, thereby making the coalescence of two wings much easier. Transmission electron microscopy (TEM) showed that the threading dislocation density in the wing areas was 1.0x10{sup 8}cm{sup -2}, more than two orders of magnitude lower than that in the window areas (4.2x10{sup 10}cm{sup -2}). However, high density of basal stacking faults of 1.2x104 cm-1 was still observed in the wing areas as compared to c-plane GaN. Atomic force microscopy and photoluminescence measurements on the coalesced ELO a-GaN sample also indicated improved material quality.

  17. Study of InN epitaxial films and nanorods grown on GaN template by RF-MOMBE

    PubMed Central

    2012-01-01

    This paper reports on high-quality InN materials prepared on a GaN template using radio-frequency metalorganic molecular beam epitaxy. We also discuss the structural and electro-optical properties of InN nanorods/films. The X-ray diffraction peaks of InN(0002) and InN(0004) were identified from their spectra, indicating that the (0001)-oriented hexagonal InN was epitaxially grown on the GaN template. Scanning electron microscopic images of the surface morphology revealed a two-dimensional growth at a rate of approximately 0.85 μm/h. Cross-sectional transmission electron microscopy images identified a sharp InN/GaN interface and a clear epitaxial orientation relationship of [0001]InN // [0001]GaN and ( 2¯110)InN // ( 2¯110)GaN. The optical properties of wurtzite InN nanorods were determined according to the photoluminescence, revealing a band gap of 0.77 eV. PMID:22908859

  18. Metal modulation epitaxy growth for extremely high hole concentrations above 10{sup 19} cm{sup -3} in GaN

    SciTech Connect

    Namkoong, Gon; Trybus, Elaissa; Lee, Kyung Keun; Moseley, Michael; Doolittle, W. Alan; Look, David C.

    2008-10-27

    The free hole carriers in GaN have been limited to concentrations in the low 10{sup 18} cm{sup -3} range due to the deep activation energy, lower solubility, and compensation from defects, therefore, limiting doping efficiency to about 1%. Herein, we report an enhanced doping efficiency up to {approx}10% in GaN by a periodic doping, metal modulation epitaxy growth technique. The hole concentrations grown by periodically modulating Ga atoms and Mg dopants were over {approx}1.5x10{sup 19} cm{sup -3}.

  19. Fabrication of a Lateral Polarity GaN MESFET: An Exploratory Study

    DTIC Science & Technology

    2007-06-27

    the sheet resistance between Ga- polar and mixed-polar GaN films. Highly resistive Ga-polar GaN is advantageous in optoelectronic and electronic device...re si st an ce [ M Ω /s q. ] 108642 2nd nitridation time [min] (b) Figure 5. Sheet resistance of GaN grown on AlN region for the first set of LT...AlN layers deposited for 4, 6, and 8 min. 2nd nitridation time after ex-situ process was kept at 950°C for 1 min. (b) Sheet resistance of GaN grown on

  20. Structural defects in GaN revealed by Transmission Electron Microscopy

    DOE PAGES

    Liliental-Weber, Zuzanna

    2014-09-08

    This paper reviews the various types of structural defects observed by Transmission Electron Microscopy in GaN heteroepitaxial layers grown on foreign substrates and homoepitaxial layers grown on bulk GaN substrates. The structural perfection of these layers is compared to the platelet self-standing crystals grown by High Nitrogen Pressure Solution. Defects in undoped and Mg doped GaN are discussed. Lastly, some models explaining the formation of inversion domains in heavily Mg doped layers that are possible defects responsible for the difficulties of p-doping in GaN are also reviewed.

  1. Si in GaN -- On the nature of the background donor

    SciTech Connect

    Wetzel, C.; Chen, A.L.; Suski, T.; Ager, J.W. III; Walukiewicz, W.

    1996-08-01

    A characterization of the Si impurity in GaN is performed by Raman spectroscopy. Applying hydrostatic pressure up to 25 GPa the authors study the behavior of the LO phonon-plasmon mode in a series of high mobility Si doped GaN films. In contrast to earlier results on unintentionally doped bulk GaN crystals no freeze out of the free carriers could be observed in Si doped samples. The authors find that Si is a shallow hydrogenic donor throughout the pressure range studied. This result positively excludes Si incorporation as a dominant source of free electrons in previously studied bulk GaN samples.

  2. Synthesis of p-type GaN nanowires.

    PubMed

    Kim, Sung Wook; Park, Youn Ho; Kim, Ilsoo; Park, Tae-Eon; Kwon, Byoung Wook; Choi, Won Kook; Choi, Heon-Jin

    2013-09-21

    GaN has been utilized in optoelectronics for two decades. However, p-type doping still remains crucial for realization of high performance GaN optoelectronics. Though Mg has been used as a p-dopant, its efficiency is low due to the formation of Mg-H complexes and/or structural defects in the course of doping. As a potential alternative p-type dopant, Cu has been recognized as an acceptor impurity for GaN. Herein, we report the fabrication of Cu-doped GaN nanowires (Cu:GaN NWs) and their p-type characteristics. The NWs were grown vertically via a vapor-liquid-solid (VLS) mechanism using a Au/Ni catalyst. Electrical characterization using a nanowire-field effect transistor (NW-FET) showed that the NWs exhibited n-type characteristics. However, with further annealing, the NWs showed p-type characteristics. A homo-junction structure (consisting of annealed Cu:GaN NW/n-type GaN thin film) exhibited p-n junction characteristics. A hybrid organic light emitting diode (OLED) employing the annealed Cu:GaN NWs as a hole injection layer (HIL) also demonstrated current injected luminescence. These results suggest that Cu can be used as a p-type dopant for GaN NWs.

  3. Infrared absorption of hydrogen-related defects in ammonothermal GaN

    SciTech Connect

    Suihkonen, Sami; Pimputkar, Siddha; Speck, James S.; Nakamura, Shuji

    2016-05-16

    Polarization controlled Fourier transform infrared (FTIR) absorption measurements were performed on a high quality m-plane ammonothermal GaN crystal grown using basic chemistry. The polarization dependence of characteristic absorption peaks of hydrogen-related defects at 3000–3500 cm{sup −1} was used to identify and determine the bond orientation of hydrogenated defect complexes in the GaN lattice. Majority of hydrogen was found to be bonded in gallium vacancy complexes decorated with one to three hydrogen atoms (V{sub Ga}-H{sub 1,2,3}) but also hydrogenated oxygen defect complexes, hydrogen in bond-center sites, and lattice direction independent absorption were observed. Absorption peak intensity was used to determine a total hydrogenated V{sub Ga} density of approximately 4 × 10{sup 18} cm{sup −3}, with main contribution from V{sub Ga}-H{sub 1,2}. Also, a significant concentration of electrically passive V{sub Ga}-H{sub 3} was detected. The high density of hydrogenated defects is expected to have a strong effect on the structural, optical, and electrical properties of ammonothermal GaN crystals.

  4. Modeling and Design of GaN High Electron Mobility Transistors and Hot Electron Transistors through Monte Carlo Particle-based Device Simulations

    NASA Astrophysics Data System (ADS)

    Soligo, Riccardo

    In this work, the insight provided by our sophisticated Full Band Monte Carlo simulator is used to analyze the behavior of state-of-art devices like GaN High Electron Mobility Transistors and Hot Electron Transistors. Chapter 1 is dedicated to the description of the simulation tool used to obtain the results shown in this work. Moreover, a separate section is dedicated the set up of a procedure to validate to the tunneling algorithm recently implemented in the simulator. Chapter 2 introduces High Electron Mobility Transistors (HEMTs), state-of-art devices characterized by highly non linear transport phenomena that require the use of advanced simulation methods. The techniques for device modeling are described applied to a recent GaN-HEMT, and they are validated with experimental measurements. The main techniques characterization techniques are also described, including the original contribution provided by this work. Chapter 3 focuses on a popular technique to enhance HEMTs performance: the down-scaling of the device dimensions. In particular, this chapter is dedicated to lateral scaling and the calculation of a limiting cutoff frequency for a device of vanishing length. Finally, Chapter 4 and Chapter 5 describe the modeling of Hot Electron Transistors (HETs). The simulation approach is validated by matching the current characteristics with the experimental one before variations of the layouts are proposed to increase the current gain to values suitable for amplification. The frequency response of these layouts is calculated, and modeled by a small signal circuit. For this purpose, a method to directly calculate the capacitance is developed which provides a graphical picture of the capacitative phenomena that limit the frequency response in devices. In Chapter 5 the properties of the hot electrons are investigated for different injection energies, which are obtained by changing the layout of the emitter barrier. Moreover, the large signal characterization of the

  5. Nanoselective area growth of GaN by metalorganic vapor phase epitaxy on 4H-SiC using epitaxial graphene as a mask

    NASA Astrophysics Data System (ADS)

    Puybaret, Renaud; Patriarche, Gilles; Jordan, Matthew B.; Sundaram, Suresh; El Gmili, Youssef; Salvestrini, Jean-Paul; Voss, Paul L.; de Heer, Walt A.; Berger, Claire; Ougazzaden, Abdallah

    2016-03-01

    We report the growth of high-quality triangular GaN nanomesas, 30-nm thick, on the C-face of 4H-SiC using nanoselective area growth (NSAG) with patterned epitaxial graphene grown on SiC as an embedded mask. NSAG alleviates the problems of defects in heteroepitaxy, and the high mobility graphene film could readily provide the back low-dissipative electrode in GaN-based optoelectronic devices. A 5-8 graphene-layer film is first grown on the C-face of 4H-SiC by confinement-controlled sublimation of silicon carbide. Graphene is then patterned and arrays of 75-nm-wide openings are etched in graphene revealing the SiC substrate. A 30-nm-thick GaN is subsequently grown by metal organic vapor phase epitaxy. GaN nanomesas grow epitaxially with perfect selectivity on SiC, in the openings patterned through graphene. The up-or-down orientation of the mesas on SiC, their triangular faceting, and cross-sectional scanning transmission electron microscopy show that they are biphasic. The core is a zinc blende monocrystal surrounded with single-crystal wurtzite. The GaN crystalline nanomesas have no threading dislocations or V-pits. This NSAG process potentially leads to integration of high-quality III-nitrides on the wafer scalable epitaxial graphene/silicon carbide platform.

  6. Direct growth of GaN layer on carbon nanotube-graphene hybrid structure and its application for light emitting diodes

    PubMed Central

    Seo, Tae Hoon; Park, Ah Hyun; Park, Sungchan; Kim, Yong Hwan; Lee, Gun Hee; Kim, Myung Jong; Jeong, Mun Seok; Lee, Young Hee; Hahn, Yoon-Bong; Suh, Eun-Kyung

    2015-01-01

    We report the growth of high-quality GaN layer on single-walled carbon nanotubes (SWCNTs) and graphene hybrid structure (CGH) as intermediate layer between GaN and sapphire substrate by metal-organic chemical vapor deposition (MOCVD) and fabrication of light emitting diodes (LEDs) using them. The SWCNTs on graphene act as nucleation seeds, resulting in the formation of kink bonds along SWCNTs with the basal plane of the substrate. In the x-ray diffraction, Raman and photoluminescence spectra, high crystalline quality of GaN layer grown on CGH/sapphire was observed due to the reduced threading dislocation and efficient relaxation of residual compressive strain caused by lateral overgrowth process. When applied to the LED structure, the current-voltage characteristics and electroluminescence (EL) performance exhibit that blue LEDs fabricated on CGH/sapphire well-operate at high injection currents and uniformly emit over the whole emission area. We expect that CGH can be applied for the epitaxial growth of GaN on various substrates such as Si and MgO, which can be a great advantage in electrical and thermal properties of optical devices fabricated on them. PMID:25597492

  7. Direct growth of GaN layer on carbon nanotube-graphene hybrid structure and its application for light emitting diodes

    NASA Astrophysics Data System (ADS)

    Seo, Tae Hoon; Park, Ah Hyun; Park, Sungchan; Kim, Yong Hwan; Lee, Gun Hee; Kim, Myung Jong; Jeong, Mun Seok; Lee, Young Hee; Hahn, Yoon-Bong; Suh, Eun-Kyung

    2015-01-01

    We report the growth of high-quality GaN layer on single-walled carbon nanotubes (SWCNTs) and graphene hybrid structure (CGH) as intermediate layer between GaN and sapphire substrate by metal-organic chemical vapor deposition (MOCVD) and fabrication of light emitting diodes (LEDs) using them. The SWCNTs on graphene act as nucleation seeds, resulting in the formation of kink bonds along SWCNTs with the basal plane of the substrate. In the x-ray diffraction, Raman and photoluminescence spectra, high crystalline quality of GaN layer grown on CGH/sapphire was observed due to the reduced threading dislocation and efficient relaxation of residual compressive strain caused by lateral overgrowth process. When applied to the LED structure, the current-voltage characteristics and electroluminescence (EL) performance exhibit that blue LEDs fabricated on CGH/sapphire well-operate at high injection currents and uniformly emit over the whole emission area. We expect that CGH can be applied for the epitaxial growth of GaN on various substrates such as Si and MgO, which can be a great advantage in electrical and thermal properties of optical devices fabricated on them.

  8. Nanoselective area growth of GaN by metalorganic vapor phase epitaxy on 4H-SiC using epitaxial graphene as a mask

    SciTech Connect

    Puybaret, Renaud; Jordan, Matthew B.; Voss, Paul L.; Ougazzaden, Abdallah; Patriarche, Gilles; Sundaram, Suresh; El Gmili, Youssef; Salvestrini, Jean-Paul; Heer, Walt A. de; Berger, Claire

    2016-03-07

    We report the growth of high-quality triangular GaN nanomesas, 30-nm thick, on the C-face of 4H-SiC using nanoselective area growth (NSAG) with patterned epitaxial graphene grown on SiC as an embedded mask. NSAG alleviates the problems of defects in heteroepitaxy, and the high mobility graphene film could readily provide the back low-dissipative electrode in GaN-based optoelectronic devices. A 5–8 graphene-layer film is first grown on the C-face of 4H-SiC by confinement-controlled sublimation of silicon carbide. Graphene is then patterned and arrays of 75-nm-wide openings are etched in graphene revealing the SiC substrate. A 30-nm-thick GaN is subsequently grown by metal organic vapor phase epitaxy. GaN nanomesas grow epitaxially with perfect selectivity on SiC, in the openings patterned through graphene. The up-or-down orientation of the mesas on SiC, their triangular faceting, and cross-sectional scanning transmission electron microscopy show that they are biphasic. The core is a zinc blende monocrystal surrounded with single-crystal wurtzite. The GaN crystalline nanomesas have no threading dislocations or V-pits. This NSAG process potentially leads to integration of high-quality III-nitrides on the wafer scalable epitaxial graphene/silicon carbide platform.

  9. Rare-Earth Doped Gallium Nitride (GaN)- An Innovative Path Toward Area-scalable Solid-state High Energy Lasers Without Thermal Distortion

    DTIC Science & Technology

    2009-04-01

    emission from GaN doped with europium (Eu), Er, praseodymium (Pr), thulium (Tm), ytterbium (Yb), Nd, and dysprosium (Dy) has been demonstrated by... thulium 12 TO transverse optical VSL variable stripe length XRC x-ray rocking curve XRD x-ray diffraction YAG yttrium aluminum garnet Yb

  10. Rare-earth Doped GaN - An Innovative Path Toward Area-scalable Solid-state High Energy Lasers Without Thermal Distortion (2nd year)

    DTIC Science & Technology

    2010-06-01

    substitutional occupation of the Ga site. Light emission from GaN doped with europium (Eu), Er, praseodymium (Pr), thulium (Tm), ytterbium (Yb), Nd, and...room temperature SES shifting excitation spot SIMS secondary ion mass spectrometry Tm thulium TO transverse optical VSL variable stripe

  11. Spontaneous nucleation and growth of GaN nanowires: the fundamental role of crystal polarity.

    PubMed

    Fernández-Garrido, Sergio; Kong, Xiang; Gotschke, Tobias; Calarco, Raffaella; Geelhaar, Lutz; Trampert, Achim; Brandt, Oliver

    2012-12-12

    We experimentally investigate whether crystal polarity affects the growth of GaN nanowires in plasma-assisted molecular beam epitaxy and whether their formation has to be induced by defects. For this purpose, we prepare smooth and coherently strained AlN layers on 6H-SiC(0001) and SiC(0001̅) substrates to ensure a well-defined polarity and an absence of structural and morphological defects. On N-polar AlN, a homogeneous and dense N-polar GaN nanowire array forms, evidencing that GaN nanowires form spontaneously in the absence of defects. On Al-polar AlN, we do not observe the formation of Ga-polar GaN NWs. Instead, sparse N-polar GaN nanowires grow embedded in a Ga-polar GaN layer. These N-polar GaN nanowires are shown to be accidental in that the necessary polarity inversion is induced by the formation of Si(x)N. The present findings thus demonstrate that spontaneously formed GaN nanowires are irrevocably N-polar. Due to the strong impact of the polarity on the properties of GaN-based devices, these results are not only essential to understand the spontaneous formation of GaN nanowires but also of high technological relevance.

  12. Single-crystal N-polar GaN p-n diodes by plasma-assisted molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Cho, YongJin; Hu, Zongyang; Nomoto, Kazuki; Xing, Huili Grace; Jena, Debdeep

    2017-06-01

    N-polar GaN p-n diodes are realized on single-crystal N-polar GaN bulk wafers by plasma-assisted molecular beam epitaxy growth. The current-voltage characteristics show high-quality rectification and electroluminescence characteristics with a high on currents ˜10 kA/cm2, low off currents <10-5 A/cm2, on/off current ratio of >109, and interband photon emission. The measured electroluminescence spectrum is dominated by a strong near-band edge emission, while deep level luminescence is greatly suppressed. A very low dislocation density leads to a high reverse breakdown electric field of ˜2.2 MV/cm without fields plates—the highest reported for N-polar epitaxial structures. The low leakage current N-polar diodes open up several potential applications in polarization-engineered photonic and electronic devices.

  13. Thermo-piezo-electro-mechanical simulation of AlGaN (aluminum gallium nitride) / GaN (gallium nitride) High Electron Mobility Transistors

    NASA Astrophysics Data System (ADS)

    Stevens, Lorin E.

    Due to the current public demand of faster, more powerful, and more reliable electronic devices, research is prolific these days in the area of high electron mobility transistor (HEMT) devices. This is because of their usefulness in RF (radio frequency) and microwave power amplifier applications including microwave vacuum tubes, cellular and personal communications services, and widespread broadband access. Although electrical transistor research has been ongoing since its inception in 1947, the transistor itself continues to evolve and improve much in part because of the many driven researchers and scientists throughout the world who are pushing the limits of what modern electronic devices can do. The purpose of the research outlined in this paper was to better understand the mechanical stresses and strains that are present in a hybrid AlGaN (Aluminum Gallium Nitride) / GaN (Gallium Nitride) HEMT, while under electrically-active conditions. One of the main issues currently being researched in these devices is their reliability, or their consistent ability to function properly, when subjected to high-power conditions. The researchers of this mechanical study have performed a static (i.e. frequency-independent) reliability analysis using powerful multiphysics computer modeling/simulation to get a better idea of what can cause failure in these devices. Because HEMT transistors are so small (micro/nano-sized), obtaining experimental measurements of stresses and strains during the active operation of these devices is extremely challenging. Physical mechanisms that cause stress/strain in these structures include thermo-structural phenomena due to mismatch in both coefficient of thermal expansion (CTE) and mechanical stiffness between different materials, as well as stress/strain caused by "piezoelectric" effects (i.e. mechanical deformation caused by an electric field, and conversely voltage induced by mechanical stress) in the AlGaN and GaN device portions (both

  14. GaN directional couplers for integrated quantum photonics

    SciTech Connect

    Zhang Yanfeng; McKnight, Loyd; Watson, Ian M.; Gu, Erdan; Calvez, Stephane; Dawson, Martin D.; Engin, Erman; Cryan, Martin J.; Thompson, Mark G.; O'Brien, Jeremy L.

    2011-10-17

    Large cross-section GaN waveguides are proposed as a suitable architecture to achieve integrated quantum photonic circuits. Directional couplers with this geometry have been designed with aid of the beam propagation method and fabricated using inductively coupled plasma etching. Scanning electron microscopy inspection shows high quality facets for end coupling and a well defined gap between rib pairs in the coupling region. Optical characterization at 800 nm shows single-mode operation and coupling-length-dependent splitting ratios. Two photon interference of degenerate photon pairs has been observed in the directional coupler by measurement of the Hong-Ou-Mandel dip [C. K. Hong, et al., Phys. Rev. Lett. 59, 2044 (1987)] with 96% visibility.

  15. TEM characterization of GaN nanowires

    SciTech Connect

    Liliental-Weber, Zuzanna; Gao, Y.H.; Bando, Y.

    2002-02-21

    Transmission electron microscopy was applied to study GaN nanowires grown on carbon nanotube surfaces by chemical reaction between Ga{sub 2}O and NH{sub 3} gas in a conventional furnace. These wires grew in two crystallographic directions, <2{und 11}0> and <01{und 1}0> (fast growth directions of GaN), in the form of whiskers covered by small elongated GaN platelets. The morphology of these platelets is similar to that observed during the growth of single crystals from a Ga melt at high temperatures under high nitrogen pressure. It is thought that growth of nanowires in two different crystallographic directions and the arrangement of the platelets to the central whisker may be influenced by the presence of Ga{sub 2}O{sub 3} (based on the observation of the energy dispersive x-ray spectra), the interplanar spacings in the wire, and the presence of defects on the interface between the central part of the nanowire and the platelets surrounding it.

  16. High-power direct green laser oscillation of 598 mW in Pr(3+)-doped waterproof fluoroaluminate glass fiber excited by two-polarization-combined GaN laser diodes.

    PubMed

    Nakanishi, Jun; Horiuchi, Yuya; Yamada, Tsuyoshi; Ishii, Osamu; Yamazaki, Masaaki; Yoshida, Minoru; Fujimoto, Yasushi

    2011-05-15

    We demonstrated a high-power and highly efficient Pr-doped waterproof fluoride glass fiber laser at 522.2 nm excited by two-polarization-combined GaN laser diodes and achieved a subwatt output power of 598 mW and slope efficiency of 43.0%. This system will enable us to make a vivid laser display, a photocoagulation laser for eye surgery, a color confocal scanning laser microscope, and an effective laser for material processing. Direct visible ultrashort pulse generation is also expected.

  17. Opportunities and challenges in GaN metal organic chemical vapor deposition for electron devices

    NASA Astrophysics Data System (ADS)

    Matsumoto, Koh; Yamaoka, Yuya; Ubukata, Akinori; Arimura, Tadanobu; Piao, Guanxi; Yano, Yoshiki; Tokunaga, Hiroki; Tabuchi, Toshiya

    2016-05-01

    The current situation and next challenge in GaN metal organic chemical vapor deposition (MOCVD) for electron devices of both GaN on Si and GaN on GaN are presented. We have examined the possibility of increasing the growth rate of GaN on 200-mm-diameter Si by using a multiwafer production MOCVD machine, in which the vapor phase parasitic reaction is well controlled. The impact of a high-growth-rate strained-layer-superlattice (SLS) buffer layer is presented in terms of material properties. An SLS growth rate of as high as 3.46 µm/h, which was 73% higher than the current optimum, was demonstrated. As a result, comparable material properties were obtained. Next, a typical result of GaN doped with Si of 1 × 1016 cm-3 grown at the growth rate of 3.7 µm/h is shown. For high-voltage application, we need a thick high-purity GaN drift layer with a low carbon concentration, of less than 1016 cm-3. It is shown that achieving a high growth rate by precise control of the vapor phase reaction is still challenge in GaN MOCVD.

  18. Nanoheteroepitaxy of GaN on AlN/Si(111) nanorods fabricated by nanosphere lithography

    NASA Astrophysics Data System (ADS)

    Lee, Donghyun; Shin, In-Su; Jin, Lu; Kim, Donghyun; Park, Yongjo; Yoon, Euijoon

    2016-06-01

    Nanoheteroepitaxy (NHE) of GaN on an AlN/Si(111) nanorod structure was investigated by metal-organic chemical vapor deposition. Silica nanosphere lithography was employed to fabricate a periodic hexagonal nanorod array with a narrow gap of 30 nm between the nanorods. We were successful in obtaining a fully coalesced GaN film on the AlN/Si(111) nanorod structure. Transmission electron microscopy revealed that threading dislocation (TD) bending and termination by stacking faults occurred near the interface between GaN and the AlN/Si(111) nanorods, resulting in the reduction of TD density for the NHE GaN layer. The full width at half-maximum of the X-ray rocking curve for (102) plane of the NHE GaN was found to decrease down to 728 arcsec from 1005 arcsec for the GaN layer on a planar AlN/Si(111) substrate, indicating that the crystalline quality of the NHE GaN was improved. Also, micro-Raman measurement showed that tensile stress in the NHE GaN layer was reduced significantly as much as 70% by introducing air voids between the nanorods.

  19. Probing defect states in polycrystalline GaN grown on Si(111) by sub-bandgap laser-excited scanning tunneling spectroscopy

    NASA Astrophysics Data System (ADS)

    Hsiao, F.-M.; Schnedler, M.; Portz, V.; Huang, Y.-C.; Huang, B.-C.; Shih, M.-C.; Chang, C.-W.; Tu, L.-W.; Eisele, H.; Dunin-Borkowski, R. E.; Ebert, Ph.; Chiu, Y.-P.

    2017-01-01

    We demonstrate the potential of sub-bandgap laser-excited cross-sectional scanning tunneling microscopy and spectroscopy to investigate the presence of defect states in semiconductors. The characterization method is illustrated on GaN layers grown on Si(111) substrates without intentional buffer layers. According to high-resolution transmission electron microscopy and cathodoluminescence spectroscopy, the GaN layers consist of nanoscale wurtzite and zincblende crystallites with varying crystal orientations and hence contain high defect state densities. In order to discriminate between band-to-band excitation and defect state excitations, we use sub-bandgap laser excitation. We probe a clear increase in the tunnel current at positive sample voltages during sub-bandgap laser illumination for the GaN layer with high defect density, but no effect is found for high quality GaN epitaxial layers. This demonstrates the excitation of free charge carriers at defect states. Thus, sub-bandgap laser-excited scanning tunneling spectroscopy is a powerful complimentary characterization tool for defect states.

  20. Polarization-resolved photoluminescence study of individual GaN nanowires grown by catalyst-free molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Schlager, John B.; Sanford, Norman A.; Bertness, Kris A.; Barker, Joy M.; Roshko, Alexana; Blanchard, Paul T.

    2006-05-01

    Polarization- and temperature-dependent photoluminescence (PL) measurements were performed on individual GaN nanowires. These were grown by catalyst-free molecular beam epitaxy on Si(111) substrates, ultrasonically removed, and subsequently dispersed on sapphire substrates. The wires were typically 5-10μm in length, c-axis oriented, and 30-100nm in diameter. Single wires produced sufficient emission intensity to enable high signal-to-noise PL data. Polarized PL spectra differed for the σ and π polarization cases, illustrating the polarization anisotropy of the exciton emission associated with high-quality wurtzite GaN. This anisotropy in PL emission persisted even up to room temperature (4-296K). Additionally, the nanowire PL varied with excitation intensity and with (325nm) pump exposure time.

  1. Molecular beam epitaxy of 2D-layered gallium selenide on GaN substrates

    NASA Astrophysics Data System (ADS)

    Lee, Choong Hee; Krishnamoorthy, Sriram; O'Hara, Dante J.; Brenner, Mark R.; Johnson, Jared M.; Jamison, John S.; Myers, Roberto C.; Kawakami, Roland K.; Hwang, Jinwoo; Rajan, Siddharth

    2017-03-01

    Large area epitaxy of two-dimensional (2D) layered materials with high material quality is a crucial step in realizing novel device applications based on 2D materials. In this work, we report high-quality, crystalline, large-area gallium selenide (GaSe) films grown on bulk substrates such as c-plane sapphire and gallium nitride (GaN) using a valved cracker source for Se. (002)-Oriented GaSe with random in-plane orientation of domains was grown on sapphire and GaN substrates at a substrate temperature of 350-450 °C with complete surface coverage. Higher growth temperature (575 °C) resulted in the formation of single-crystalline ɛ-GaSe triangular domains with six-fold symmetry confirmed by in-situ reflection high electron energy diffraction and off-axis x-ray diffraction. A two-step growth method involving high temperature nucleation of single crystalline domains and low temperature growth to enhance coalescence was adopted to obtain continuous (002)-oriented GaSe with an epitaxial relationship with the substrate. While six-fold symmetry was maintained in the two step growth, β-GaSe phase was observed in addition to the dominant ɛ-GaSe in cross-sectional scanning transmission electron microscopy images. This work demonstrates the potential of growing high quality 2D-layered materials using molecular beam epitaxy and can be extended to the growth of other transition metal chalcogenides.

  2. Controlling morphology and optical properties of self-catalyzed, mask-free GaN rods and nanorods by metal-organic vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Tessarek, C.; Bashouti, M.; Heilmann, M.; Dieker, C.; Knoke, I.; Spiecker, E.; Christiansen, S.

    2013-10-01

    A simple self-catalyzed and mask-free approach will be presented to grow GaN rods and nanorods based on the metal-organic vapor phase epitaxy technique. The growth parameter dependent adjustment of the morphology of the structures will be discussed. Rods and nanorods with diameters reaching from a few μm down to 100 nm, heights up to 48 μm, and densities up to 8ṡ107 cm-2 are all vertically aligned with respect to the sample surface and exhibiting a hexagonal shape with smooth sidewall facets. Optical properties of GaN nanorods were determined using cathodoluminescence. It will be shown that the optical properties can be improved just by reducing the Ga precursor flow. Furthermore, for regular hexagonal shaped rods and nanorods, whispering gallery modes with quality factors up to 500 were observed by cathodoluminescence pointing out high morphological quality of the structures. Structural investigations using transmission electron microscopy show that larger GaN nanorods (diameter > 500 nm) contain threading dislocations in the bottom part and vertical inversion domain boundaries, which separate a Ga-polar core from a N-polar shell. In contrast, small GaN nanorods (˜200 nm) are largely free of such extended defects. Finally, evidence for a self-catalyzed, Ga-induced vapor-liquid-solid growth will be discussed.

  3. MBE growth of GaN pn-junction photodetector on AlN/Si(1 1 1) substrate with Ni/Ag as ohmic contact

    NASA Astrophysics Data System (ADS)

    Mohd Yusoff, M. Z.; Baharin, A.; Hassan, Z.; Abu Hassan, H.; Abdullah, M. J.

    2013-04-01

    In this paper, we investigated the growth of GaN pn-junction layers on silicon (1 1 1) by plasma assisted molecular beam epitaxy (PA-MBE) system and the effect of thermal annealing of Ni/Ag contacts on the sample for photodetector applications. Si and Mg were used as n- and p-dopants, respectively. The reflection high energy electron diffraction images indicated a good surface morphology of GaN pn-junction layer. The full width at half maximum (FWHM) obtained from XRD measurement was 0.34°, indicating a good quality layer of sample. The pn-junctions sample has a good optical quality which is reflected by the photoluminescence system measurement. The structural evolution and temperature dependence of the current of Ni/Ag contacts on GaN pn-junction at various annealing were investigated by scanning electron microscopy (SEM) and current-voltage (I-V) measurements. The temperature dependence of the current may be attributed to changes of the surface morphology of Ni/Ag films on the surface. SEM results indicated the degradation of Ni/Ag contacts on GaN pn-junction above 800 °C.

  4. Prospects for the application of GaN power devices in hybrid electric vehicle drive systems

    NASA Astrophysics Data System (ADS)

    Su, Ming; Chen, Chingchi; Rajan, Siddharth

    2013-07-01

    GaN, a wide bandgap semiconductor successfully implemented in optical and high-speed electronic devices, has gained momentum in recent years for power electronics applications. Along with rapid progress in material and device processing technologies, high-voltage transistors over 600 V have been reported by a number of teams worldwide. These advances make GaN highly attractive for the growing market of electrified vehicles, which currently employ bipolar silicon devices in the 600-1200 V class for the traction inverter. However, to capture this billion-dollar power market, GaN has to compete with existing IGBT products and deliver higher performance at comparable or lower cost. This paper reviews key achievements made by the GaN semiconductor industry, requirements of the automotive electric drive system and remaining challenges for GaN power devices to fit in the inverter application of hybrid vehicles.

  5. Frequency response and design consideration of GaN SAM avalanche photodiodes

    NASA Astrophysics Data System (ADS)

    Xie, Feng; Yang, Guofeng; Zhou, Dong; Lu, Hai; Wang, Guosheng

    2016-11-01

    In this work, a method is developed for estimating the frequency response characteristics of GaN avalanche photodiodes (APDs) with separated absorption and multiplication regions (SAM). The method calculates the total diode current with varying frequency by solving transport equations analytically and uses a commercial device simulator as a supplement for determining the exact electrical field profile within the device. Due to the high carrier saturation velocity of GaN, a high-gain-bandwidth product over THz is found achievable for GaN SAM-APDs. The potential performances of GaN SAM-APDs with different structural designs are further compared through numerical studies. It is found that a close-to-reach-through design is attractive for simultaneously achieving both relatively low operation voltage and high working frequency. In addition, transit-time limit and RC-delay limit for the frequency response of GaN SAM-APDs are also discussed.

  6. Nearly 4-Inch-Diameter Free-Standing GaN Wafer Fabricated by Hydride Vapor Phase Epitaxy with Pit-Inducing Buffer Layer

    NASA Astrophysics Data System (ADS)

    Sato, Tadashige; Okano, Shinya; Goto, Takenari; Yao, Takafumi; Seto, Ritsu; Sato, Akira; Goto, Hideki

    2013-08-01

    A free-standing GaN wafer was fabricated by depositing a GaN buffer that induced the formation of pits (hereafter, pit-inducing GaN buffer) on a low-temperature-grown GaN buffer on the sapphire substrate. A high-temperature-grown GaN layer was grown on the pit-inducing GaN buffer that induced the formation of pits on the high-temperature-grown GaN layer. The pit-inducing buffer suppresses crack formation in the thick GaN film thereby releasing growth stress. Thermal stress in GaN on a sapphire system is also discussed on the basis of calculations utilizing a bilayer model. We have succeeded in the fabrication of a nearly 4-in.-diameter free-standing GaN thick wafer with a pit-inducing GaN buffer by one-stop hydride vapor phase epitaxy, which will lead to a low-cost fabrication of free-standing GaN wafers.

  7. New CVD-based method for the growth of high-quality crystalline zinc oxide layers

    NASA Astrophysics Data System (ADS)

    Huber, Florian; Madel, Manfred; Reiser, Anton; Bauer, Sebastian; Thonke, Klaus

    2016-07-01

    High-quality zinc oxide (ZnO) layers were grown using a new chemical vapour deposition (CVD)-based low-cost growth method. The process is characterized by total simplicity, high growth rates, and cheap, less hazardous precursors. To produce elementary zinc vapour, methane (CH4) is used to reduce a ZnO powder. By re-oxidizing the zinc with pure oxygen, highly crystalline ZnO layers were grown on gallium nitride (GaN) layers and on sapphire substrates with an aluminum nitride (AlN) nucleation layer. Using simple CH4 as precursor has the big advantage of good controllability and the avoidance of highly toxic gases like nitrogen oxides. In photoluminescence (PL) measurements the samples show a strong near-band-edge emission and a sharp line width at 5 K. The good crystal quality has been confirmed in high resolution X-ray diffraction (HRXRD) measurements. This new growth method has great potential for industrial large-scale production of high-quality single crystal ZnO layers.

  8. Physics Based Analysis of Gallium Nitride (GaN) High Electron Mobility Transistor (HEMT) for Radio Frequency (RF) Power and Gain Optimization

    DTIC Science & Technology

    2011-12-01

    in advanced RF systems. Towards this end, we have performed drift-diffusion-based simulations of a GaN HEMT operating as a class A amplifier . 2...reducing the burden, to Department of Defense, Washington Headquarters Services, Directorate for Information Operations and Reports (0704-0188...optimize device performance by determining which part of the device to modify for greatest impact. 15. SUBJECT TERMS Power amplifier , distortion 16

  9. High Dielectrics on High Carrier Mobility InGaAs Compound Semiconductors and GaN - Growth, Interfacial Structural Studies, and Surface Fermi Level Unpinning

    DTIC Science & Technology

    2010-02-19

    UHV- deposited Al2O3(3nm)/ Ga2O3 (Gd2O3)(8.5nm) on n- and p-In0.2Ga0.8As/GaAs. The results exhibit very high-quality interface and free-moving Fermi...κ Ga2O3 (Gd2O3) [GGO] and Gd2O3 on InGaAs, without an interfacial layer. InxGa1−xAs MOSFETs have been successfully demonstrated with excellent device... Ga2O3 (Gd2O3)/In0.2Ga0.8As and high temperature (850°C) stability Scaling high κ oxides to nanometer range as well as unpinning surface Fermi level

  10. Broadband nanophotonic waveguides and resonators based on epitaxial GaN thin films

    SciTech Connect

    Bruch, Alexander W.; Xiong, Chi; Leung, Benjamin; Poot, Menno; Han, Jung; Tang, Hong X.

    2015-10-05

    We demonstrate broadband, low loss optical waveguiding in single crystalline GaN grown epitaxially on c-plane sapphire wafers through a buffered metal-organic chemical vapor phase deposition process. High Q optical microring resonators are realized in near infrared, infrared, and near visible regimes with intrinsic quality factors exceeding 50 000 at all the wavelengths we studied. TEM analysis of etched waveguide reveals growth and etch-induced defects. Reduction of these defects through improved material and device processing could lead to even lower optical losses and enable a wideband photonic platform based on GaN-on-sapphire material system.

  11. Comprehensive study of the electronic and optical behavior of highly degenerate p-type Mg-doped GaN and AlGaN

    SciTech Connect

    Gunning, BP; Fabien, CAM; Merola, JJ; Clinton, EA; Doolittle, WA; Wang, S; Fischer, AM; Ponce, FA

    2015-01-28

    The bulk and 2-dimensional (2D) electrical transport properties of heavily Mg-doped p-type GaN films grown on AlN buffer layers by Metal Modulated Epitaxy are explored. Distinctions are made between three primary p-type conduction mechanisms: traditional valence band conduction, impurity band conduction, and 2D conduction within a 2D hole gas at a hetero-interface. The bulk and 2D contributions to the overall carrier transport are identified and the relative contributions are found to vary strongly with growth conditions. Films grown with III/V ratio less than 1.5 exhibit high hole concentrations exceeding 2 x 10(19) cm(-3) with effective acceptor activation energies of 51 meV. Films with III/V ratios greater than 1.5 exhibit lower overall hole concentrations and significant contributions from 2D transport at the hetero-interface. Films grown with III/V ratio of 1.2 and Mg concentrations exceeding 2 x 10(20) cm(-3) show no detectable inversion domains or Mg precipitation. Highly Mg-doped p-GaN and p-AlGaN with Al fractions up to 27% similarly exhibit hole concentrations exceeding 2 x 10(19) cm(-3). The p-GaN and p-Al0.11Ga0.89N films show broad ultraviolet (UV) photoluminescence peaks, which intercept the valence band, supporting the presence of a Mg acceptor band. Finally, a multi-quantum-well light-emitting diode (LED) and p-i-n diode are grown, both of which demonstrate rectifying behavior with turn-on voltages of 3-3.5V and series resistances of 6-10 Omega without the need for any post-metallization annealing. The LED exhibits violet-blue luminescence at 425 nm, while the p-i-n diode shows UV luminescence at 381 nm, and both devices still show substantial light emission even when submerged in liquid nitrogen at 77 K. (C) 2015 AIP Publishing LLC.

  12. Comprehensive study of the electronic and optical behavior of highly degenerate p-type Mg-doped GaN and AlGaN

    NASA Astrophysics Data System (ADS)

    Gunning, Brendan P.; Fabien, Chloe A. M.; Merola, Joseph J.; Clinton, Evan A.; Doolittle, W. Alan; Wang, Shuo; Fischer, Alec M.; Ponce, Fernando A.

    2015-01-01

    The bulk and 2-dimensional (2D) electrical transport properties of heavily Mg-doped p-type GaN films grown on AlN buffer layers by Metal Modulated Epitaxy are explored. Distinctions are made between three primary p-type conduction mechanisms: traditional valence band conduction, impurity band conduction, and 2D conduction within a 2D hole gas at a hetero-interface. The bulk and 2D contributions to the overall carrier transport are identified and the relative contributions are found to vary strongly with growth conditions. Films grown with III/V ratio less than 1.5 exhibit high hole concentrations exceeding 2 × 1019 cm-3 with effective acceptor activation energies of 51 meV. Films with III/V ratios greater than 1.5 exhibit lower overall hole concentrations and significant contributions from 2D transport at the hetero-interface. Films grown with III/V ratio of 1.2 and Mg concentrations exceeding 2 × 1020 cm-3 show no detectable inversion domains or Mg precipitation. Highly Mg-doped p-GaN and p-AlGaN with Al fractions up to 27% similarly exhibit hole concentrations exceeding 2 × 1019 cm-3. The p-GaN and p-Al0.11Ga0.89N films show broad ultraviolet (UV) photoluminescence peaks, which intercept the valence band, supporting the presence of a Mg acceptor band. Finally, a multi-quantum-well light-emitting diode (LED) and p-i-n diode are grown, both of which demonstrate rectifying behavior with turn-on voltages of 3-3.5 V and series resistances of 6-10 Ω without the need for any post-metallization annealing. The LED exhibits violet-blue luminescence at 425 nm, while the p-i-n diode shows UV luminescence at 381 nm, and both devices still show substantial light emission even when submerged in liquid nitrogen at 77 K.

  13. Comprehensive study of the electronic and optical behavior of highly degenerate p-type Mg-doped GaN and AlGaN

    SciTech Connect

    Gunning, Brendan P.; Fabien, Chloe A. M.; Merola, Joseph J.; Clinton, Evan A.; Doolittle, W. Alan; Wang, Shuo; Fischer, Alec M.; Ponce, Fernando A.

    2015-01-28

    The bulk and 2-dimensional (2D) electrical transport properties of heavily Mg-doped p-type GaN films grown on AlN buffer layers by Metal Modulated Epitaxy are explored. Distinctions are made between three primary p-type conduction mechanisms: traditional valence band conduction, impurity band conduction, and 2D conduction within a 2D hole gas at a hetero-interface. The bulk and 2D contributions to the overall carrier transport are identified and the relative contributions are found to vary strongly with growth conditions. Films grown with III/V ratio less than 1.5 exhibit high hole concentrations exceeding 2 × 10{sup 19} cm{sup −3} with effective acceptor activation energies of 51 meV. Films with III/V ratios greater than 1.5 exhibit lower overall hole concentrations and significant contributions from 2D transport at the hetero-interface. Films grown with III/V ratio of 1.2 and Mg concentrations exceeding 2 × 10{sup 20} cm{sup −3} show no detectable inversion domains or Mg precipitation. Highly Mg-doped p-GaN and p-AlGaN with Al fractions up to 27% similarly exhibit hole concentrations exceeding 2 × 10{sup 19} cm{sup −3}. The p-GaN and p-Al{sub 0.11}Ga{sub 0.89}N films show broad ultraviolet (UV) photoluminescence peaks, which intercept the valence band, supporting the presence of a Mg acceptor band. Finally, a multi-quantum-well light-emitting diode (LED) and p-i-n diode are grown, both of which demonstrate rectifying behavior with turn-on voltages of 3–3.5 V and series resistances of 6–10 Ω without the need for any post-metallization annealing. The LED exhibits violet-blue luminescence at 425 nm, while the p-i-n diode shows UV luminescence at 381 nm, and both devices still show substantial light emission even when submerged in liquid nitrogen at 77 K.

  14. HVPE GaN wafers with improved crystalline and electrical properties

    NASA Astrophysics Data System (ADS)

    Freitas, J. A.; Culbertson, J. C.; Mahadik, N. A.; Sochacki, T.; Iwinska, M.; Bockowski, M. S.

    2016-12-01

    The quest for low cost GaN substrates with optimized crystalline and electrical properties continues to fuel the search for a fast growth method to produce commercial wafers that will allow the fabrication of devices capable of achieving high performance at high power and/or high frequency. Thick films grown by hydride vapor phase epitaxy (HVPE) on Ammono substrates in addition to reproducing the high crystalline quality of those substrates show significant reduction in free carrier concentration. This work presents a detailed spectroscopic, X-ray diffraction, and Raman spectroscopy imaging investigation of thick freestanding HVPE GaN films deposited on HVPE/Ammono-GaN templates. The results demonstrate that they are stress-free, and have a nearly uniform and relatively lower residual background doping, in addition to high crystalline quality. This result is extremely important, because it demonstrates the usefulness of this new type of HVPE-GaN substrate to fabricate highly efficient optoelectronic and electronic devices.

  15. GaN nanowire tips for nanoscale atomic force microscopy.

    PubMed

    Behzadirad, Mahmoud; Nami, Mohsen; Rishinaramagalam, Ashwin; Feezell, Daniel; Busani, Tito

    2017-04-07

    Imaging of high-aspect-ratio nanostructures with sharp edges and straight walls in nanoscale metrology by Atomic Force Microscopy (AFM) has been challenging due to the mechanical properties and conical geometry of the majority of available commercial tips. Here we report on the fabrication of GaN probes for nanoscale metrology of high-aspect-ratio structures to enhance the resolution of AFM imaging and improve the durability of AFM tips. GaN nanowires (NWs) were fabricated using bottom-up and top-down techniques and bonded to Si cantilevers to scan vertical trenches on Si substrates. Over several scans, the GaN probes demonstrated excellent durability while scanning uneven structures and showed resolution enhancements in topography images, independent of scan direction, compared to commercial Si tips.

  16. Tailoring GaN semiconductor surfaces with biomolecules.

    PubMed

    Estephan, Elias; Larroque, Christian; Cuisinier, Frédéric J G; Bálint, Zoltán; Gergely, Csilla

    2008-07-24

    Functionalization of semiconductors constitutes a crucial step in using these materials for various electronic, photonic, biomedical, and sensing applications. Within the various possible approaches, selection of material-binding biomolecules from a random biological library, based on the natural recognition of proteins or peptides toward specific material, offers many advantages, most notably biocompatibility. Here we report on the selective functionalization of GaN, an important semiconductor that has found broad uses in the past decade due to its efficient electroluminescence and pronounced chemical stability. A 12-mer peptide ("GaN_probe") with specific recognition for GaN has evolved. The subtle interplay of mostly nonpolar hydrophobic and some polar amino acidic residues defines the high affinity adhesion properties of the peptide. The interaction forces between the peptide and GaN are quantified, and the hydrophobic domain of the GaN_probe is identified as primordial for the binding specificity. These nanosized binding blocks are further used for controlled placement of biotin-streptavidin complexes on the GaN surface. Thus, the controlled grow of a new, patterned inorganic-organic hybrid material is achieved. Tailoring of GaN by biological molecules can lead to a new class of nanostructured semiconductor-based devices.

  17. Native defects in GaN: a hybrid functional study

    NASA Astrophysics Data System (ADS)

    Diallo, Ibrahima Castillo; Demchenko, Denis

    Intrinsic defects play an important role in the performance of GaN-based devices. We present hybrid density functional calculations of the electronic and possible optical properties of interstitial N (Ni-Ni) , N antisite (NGa) , interstitial Ga (Gai) , Ga antisite (GaN) , Ga vacancy (VGa) , N vacancy (VN) and Ga-N divacancies (VGaVN) in GaN. Our results show that the vacancies display relatively low formation energies in certain samples, whereas antisites and interstitials are energetically less favorable. However, interstitials can be created by electron irradiation. For instance, in 2.5 MeV electron-irradiated GaN samples, a strong correlation between the frequently observed photoluminescence (PL) band centered around 0.85 eV accompanied with a rich phonon sideband of ~0.88 eV and the theoretical optical behavior of interstitial Ga is discussed. N vacancies are found to likely contribute to the experimentally obtained green luminescence band (GL2) peaking at 2.24 eV in high-resistivity undoped and Mg-doped GaN. National Science Foundation (DMR-1410125) and the Thomas F. and Kate Miller Jeffress Memorial Trust.

  18. Development of Partial-Charge Potential for GaN

    SciTech Connect

    Gao, Fei; Devanathan, Ram; Oda, Takuji; Weber, William J.

    2006-09-01

    Partial-charged potentials for GaN are systematically developed that describes a wide range of structural properties, where the reference data for fitting the potential parameters are taken from ab initial calculations or experiments. The present potential model provides a good fit to different structural geometries and high pressure phases of GaN. The high-pressure transition from wurtzite to rock-salt structure is correctly described yielding the phase transition pressure of about 55 GPa, and the calculated volume change at the transition is in good agreement with experimental data. The results are compared with those obtained by ab initio simulations.

  19. Growth and characterization of GaN thin films on Si(111) substrates using SiC intermediate layer

    SciTech Connect

    Lim, K.Y.; Lee, K.J.; Park, C.I.; Kim, K.C.; Choi, S.C.; Lee, W.H.; Suh, E.K.; Yang, G.M.; Nahm, K.S.

    2000-07-01

    GaN films have been grown atop Si-terminated 3C-SiC intermediate layer on Si(111) substrates using low pressure metalorganic chemical vapor deposition (LP-MOCVD). The SiC intermediate layer was grown by chemical vapor deposition (CVD) using tetramethylsilane (TMS) as the single source precursor. The Si terminated SiC surface was obtained by immediately flow of SiH{sub 4} gas after growth of SiC film. LP-MOCVD growth of GaN on 3C-SiC/Si(111) was carried out with trimethylgallium (TMG) and NH{sub 3}. Single crystalline hexagonal GaN layers can be grown on Si terminated SiC intermediate layer using an AlN or GaN buffer layer. Compared with GaN layers grown using a GaN buffer layer, the crystal qualities of GaN films with AlN buffer layers are extremely improved. The GaN films were characterized by x-ray diffraction (XRD), photoluminescence (PL) and scanning electron microscopy (SEM). Full width at half maximum (FWHM) of double crystal x-ray diffraction (DCXD) rocking curve for GaN (0002) on 3C-SiC/Si(111) was 890 arcsec. PL near band edge emission peak position and FWHM at room temperature are 3.38 eV and 79.35 meV, respectively.

  20. Improved emission efficiency of a-plane GaN light emitting diodes with silica nano-spheres integrated into a-plane GaN buffer layer

    NASA Astrophysics Data System (ADS)

    Park, S. H.; Park, J.; You, D.-J.; Joo, K.; Moon, D.; Jang, J.; Kim, D.-U.; Chang, H.; Moon, S.; Song, Y.-K.; Lee, G.-D.; Jeon, H.; Xu, J.; Nanishi, Y.; Yoon, E.

    2012-05-01

    A simple and inexpensive technique to improve the emission efficiency of nonpolar a-plane light emitting diodes (LEDs) is proposed. The 3-dimensional growth nature of a-plane GaN was utilized to form the regrowth template of a-plane GaN. Subsequently, the controlled integration of silica nano-spheres (CIS) into the regrowth template is performed to improve the crystal quality of a-plane GaN by epitaxial lateral overgrowth method. In addition, the CIS improves light extraction by the scattering process. The light output power from the CIS a-plane GaN LEDs showed 130%-150% increase compared to that of LED without silica nano-spheres.

  1. Vertical nonpolar growth templates for light emitting diodes formed with GaN nanosheets

    NASA Astrophysics Data System (ADS)

    Yeh, Ting-Wei; Lin, Yen-Ting; Ahn, Byungmin; Stewart, Lawrence S.; Daniel Dapkus, P.; Nutt, Steven R.

    2012-01-01

    We demonstrate that nonpolar m-plane surfaces can be generated on uniform GaN nanosheet arrays grown vertically from the (0001)-GaN bulk material. InGaN/GaN multiple quantum wells (MQWs) grown on the facets of these nanosheets are demonstrated by cross-sectional transmission electron microscopy. Owing to the high aspect ratio of the GaN nanosheet structure, the MQWs predominantly grow on nonpolar GaN planes. The results suggest that GaN nanosheets provide a conduction path for device fabrication and also a growth template to reduce the piezoelectric field inside the active region of InGaN-based light emitting diodes.

  2. Hole-induced d0 ferromagnetism enhanced by Na-doping in GaN

    NASA Astrophysics Data System (ADS)

    Zhang, Yong; Li, Feng

    2017-02-01

    The d0 ferromagnetism in wurtzite GaN is investigated by the first-principle calculations. It is found that spontaneous magnetization occurs if sufficient holes are injected in GaN. Both Ga vacancy and Na doping can introduce holes into GaN. However, Ga vacancy has a high formation energy, and is thus unlikely to occur in a significant concentration. In contrast, Na doping has relatively low formation energy. Under N-rich growth condition, Na doping with a sufficient concentration can be achieved, which can induce half-metallic ferromagnetism in GaN. Moreover, the estimated Curie temperature of Na-doped GaN is well above the room temperature.

  3. Excellence through High-Quality Individualization.

    ERIC Educational Resources Information Center

    Burns, Richard W.; Klingstedt, Joe Lars

    1988-01-01

    Proposes a strategy employing challenge, functionalism, high-order learning, and originality to achieve high-quality individualization in course work. Asserts that individualized instruction better prepares students to solve problems, make decisions, and produce original ideas. (MM)

  4. Two-domain formation during the epitaxial growth of GaN (0001) on c-plane Al{sub 2}O{sub 3} (0001) by high power impulse magnetron sputtering

    SciTech Connect

    Junaid, M.; Lundin, D.; Palisaitis, J.; Hsiao, C.-L.; Darakchieva, V.; Jensen, J.; Persson, P. O. A.; Sandstroem, P.; Helmersson, U.; Hultman, L.; Birch, J.; Lai, W.-J.; Chen, L.-C.; Chen, K.-H.

    2011-12-15

    We study the effect of high power pulses in reactive magnetron sputter epitaxy on the structural properties of GaN (0001) thin films grown directly on Al{sub 2}O{sub 3} (0001) substrates. The epilayers are grown by sputtering from a liquid Ga target, using a high power impulse magnetron sputtering power supply in a mixed N{sub 2}/Ar discharge. X-ray diffraction, micro-Raman, micro-photoluminescence, and transmission electron microscopy investigations show the formation of two distinct types of domains. One almost fully relaxed domain exhibits superior structural and optical properties as evidenced by rocking curves with a full width at half maximum of 885 arc sec and a low temperature band edge luminescence at 3.47 eV with the full width at half maximum of 10 meV. The other domain exhibits a 14 times higher isotropic strain component, which is due to the higher densities of the point and extended defects, resulting from the ion bombardment during growth. Voids form at the domain boundaries. Mechanisms for the formation of differently strained domains, along with voids during the epitaxial growth of GaN are discussed.

  5. Enhancement of ultraviolet detecting by coupling the photoconductive behavior of GaN nanowires and p-n junction.

    PubMed

    Liu, Nishuang; Tian, Weiwei; Zhang, Xianghui; Su, Jun; Zhang, Qi; Gao, Yihua

    2012-08-27

    The giant improvement of ultraviolet response behavior of a conventional GaN p-n film structured detector by the incorporation of slanted GaN nanowires is reported. The GaN nanowires/p-n film structure shows great photoresponse performance, exhibiting a short response time <0.1 s and a high sensitivity, being stable and reproducible with an on/off current contrast ratio as high as 1800 at zero bias under 365 nm ultraviolet light irradiation. Via carefully analyzing the experiment result and the band diagram of the device, the enhancement can be predominantly attributed to the photogenerated electrons in the slanted GaN nanowires.

  6. The Effect of Hachimi-Jio-Gan (Ba-Wei-Di-Huang-Wan) on the Quality of Life in Patients with Peripheral Arterial Disease - A Prospective Study Using Kampo Medicine.

    PubMed

    Kawago, Koji; Shindo, Shunya; Inoue, Hidenori; Akasaka, Junetsu; Motohashi, Shinya; Urabe, Go; Sato, Masahiro; Uchiyama, Hirotomo; Ogino, Hitoshi

    2016-01-01

    Objective: To assess whether Hachimi-jio-gan (HJG), a preparation of Kampo medicine (traditional Japanese medicine), improves quality of life (QOL) in patients with peripheral arterial disease (PAD). Materials and Methods: Among the patients with PAD being followed in the Department of Cardiovascular Surgery at Tokyo Medical University Hachioji Medical Center, those with intermittent claudication (IC) and in stable condition regarding PAD severity were registered. We registered the patients from April 2014 to March 2015. We administered HJG extract for 6 months to the patients. The primary endpoint was Walking Impairment Questionnaire (WIQ) score, which was approved as an indicator of QOL of the patient with PAD. We assessed WIQ score both before and after administration of the HJG. Results: We analyzed 14 patients. WIQ items of pain, distance, and speed improved significantly. Furthermore, the median of the total score of WIQ improved significantly from 162.5 points to 308.0 points. All patients showed improvement in the total score and 7 patients out of 14 patients (50%) showed a remarkably effective improvement in score of more than 100 points. Conclusion: HJG might improve the QOL in patients with IC due to PAD.

  7. The Effect of Hachimi-Jio-Gan (Ba-Wei-Di-Huang-Wan) on the Quality of Life in Patients with Peripheral Arterial Disease – A Prospective Study Using Kampo Medicine

    PubMed Central

    Shindo, Shunya; Inoue, Hidenori; Akasaka, Junetsu; Motohashi, Shinya; Urabe, Go; Sato, Masahiro; Uchiyama, Hirotomo; Ogino, Hitoshi

    2016-01-01

    Objective: To assess whether Hachimi-jio-gan (HJG), a preparation of Kampo medicine (traditional Japanese medicine), improves quality of life (QOL) in patients with peripheral arterial disease (PAD). Materials and Methods: Among the patients with PAD being followed in the Department of Cardiovascular Surgery at Tokyo Medical University Hachioji Medical Center, those with intermittent claudication (IC) and in stable condition regarding PAD severity were registered. We registered the patients from April 2014 to March 2015. We administered HJG extract for 6 months to the patients. The primary endpoint was Walking Impairment Questionnaire (WIQ) score, which was approved as an indicator of QOL of the patient with PAD. We assessed WIQ score both before and after administration of the HJG. Results: We analyzed 14 patients. WIQ items of pain, distance, and speed improved significantly. Furthermore, the median of the total score of WIQ improved significantly from 162.5 points to 308.0 points. All patients showed improvement in the total score and 7 patients out of 14 patients (50%) showed a remarkably effective improvement in score of more than 100 points. Conclusion: HJG might improve the QOL in patients with IC due to PAD. PMID:28018500

  8. Transient atomic behavior and surface kinetics of GaN

    NASA Astrophysics Data System (ADS)

    Moseley, Michael; Billingsley, Daniel; Henderson, Walter; Trybus, Elaissa; Doolittle, W. Alan

    2009-07-01

    An in-depth model for the transient behavior of metal atoms adsorbed on the surface of GaN is developed. This model is developed by qualitatively analyzing transient reflection high energy electron diffraction (RHEED) signals, which were recorded for a variety of growth conditions of GaN grown by molecular-beam epitaxy (MBE) using metal-modulated epitaxy (MME). Details such as the initial desorption of a nitrogen adlayer and the formation of the Ga monolayer, bilayer, and droplets are monitored using RHEED and related to Ga flux and shutter cycles. The suggested model increases the understanding of the surface kinetics of GaN, provides an indirect method of monitoring the kinetic evolution of these surfaces, and introduces a novel method of in situ growth rate determination.

  9. Electrical and structural degradation of GaN high electron mobility transistors under high-power and high-temperature Direct Current stress

    SciTech Connect

    Wu, Y. Alamo, J. A. del; Chen, C.-Y.

    2015-01-14

    We have stressed AlGaN/GaN HEMTs (High Electron Mobility Transistors) under high-power and high-temperature DC conditions that resulted in various levels of device degradation. Following electrical stress, we conducted a well-established three-step wet etching process to remove passivation, gate and ohmic contacts so that the device surface can be examined by SEM and AFM. We have found prominent pits and trenches that have formed under the gate edge on the drain side of the device. The width and depth of the pits under the gate edge correlate with the degree of drain current degradation. In addition, we also found visible erosion under the full extent of the gate. The depth of the eroded region averaged along the gate width under the gate correlated with channel resistance degradation. Both electrical and structural analysis results indicate that device degradation under high-power DC conditions is of a similar nature as in better understood high-voltage OFF-state conditions. The recognition of a unified degradation mechanism provides impetus to the development of a degradation model with lifetime predictive capabilities for a broad range of operating conditions spanning from OFF-state to ON-state.

  10. Growth and Characterization of N-Polar GaN Films on Si(111) by Plasma Assisted Molecular Beam Epitaxy

    NASA Astrophysics Data System (ADS)

    Dasgupta, Sansaptak; Nidhi; Wu, Feng; Speck, James S.; Mishra, Umesh K.

    2012-11-01

    Smooth N-polar GaN films were epitaxially grown by plasma assisted molecular beam epitaxy (PAMBE) on on-axis p-Si(111). The structural quality of the as-grown GaN films was further improved by insertion of AlGaN/GaN superlattice structures, resulting in reduced threading dislocation density and also efficient stress management in the GaN film to mitigate crack formation. The structural quality of these films was comparable to N-polar GaN grown on C-SiC by MBE. Convergent beam electron diffraction (CBED) imaging and KOH etch studies were performed to confirm the N-polarity of the sample. Room temperature photoluminescence measurements revealed strong GaN band-edge emission.

  11. Abnormal selective area growth of irregularly-shaped GaN structures on the apex of GaN pyramids and its application for wide spectral emission

    NASA Astrophysics Data System (ADS)

    Yu, Yeon Su; Lee, Jun Hyeong; Ahn, Hyung Soo; Yang, Min

    2014-12-01

    We report on the growth and the characterization of three-dimensional randomly-shaped InGaN/GaN structures selectively grown on the apex of GaN pyramids for the purpose of enlarging the emission spectral range. We found that the variations in the shape and the size of the three-dimensional GaN structures depend on the growth temperature and the surface area for selective growth under intentional turbulence in the gas stream. The selectively grown GaN structures grown at 1020 °C have irregular shape, while the samples grown at 1100 °C have rather uniform hexagonal pyramidal shapes. Irregularly shaped GaN structures were also obtained on the apex of GaN pyramids when the SiO2 mask was removed to 1/10 of the total height of the underlying GaN pyramid. When only 1/5 of the SiO2 mask was removed, however, the selectively grown GaN structures had similar hexagonal pyramidal shapes resembling those of the underlying GaN pyramids. The CL (Cathodoluminescence) spectra of the InGaN layers grown on the randomly shaped GaN structures showed a wide emission spectral range from 388 to 433 nm due to the non-uniform thickness and spatially inhomogeneous indium composition of the InGaN layers. This new selective growth method might have great potential for applications of non-phosphor white light emitting diodes (LEDs) with optimized growth conditions for InGaN active layers of high indium composition and with optimum process for fabrication of electrodes for electrical injection.

  12. GaN: Defect and Device Issues

    SciTech Connect

    Pearton, S.J.; Ren, F.; Shul, R.J.; Zolper, J.C.

    1998-11-09

    The role of extended and point defects, and key impurities such as C, O and H, on the electrical and optical properties of GaN is reviewed. Recent progress in the development of high reliability contacts, thermal processing, dry and wet etching techniques, implantation doping and isolation and gate insulator technology is detailed. Finally, the performance of GaN-based electronic and photonic devices such as field effect transistors, UV detectors, laser diodes and light-emitting diodes is covered, along with the influence of process-induced or grown-in defects and impurities on the device physics.

  13. Fabrication of microchannels in single-crystal GaN by wet-chemical-assisted femtosecond-laser ablation

    NASA Astrophysics Data System (ADS)

    Nakashima, Seisuke; Sugioka, Koji; Midorikawa, Katsumi

    2009-09-01

    We investigated micro- and nano-fabrication of wide band-gap semiconductor gallium nitride (GaN) using a femtosecond (fs) laser. Nanoscale craters were successfully formed by wet-chemical-assisted fs-laser ablation, in which the laser beam is focused onto a single-crystal GaN substrate in a hydrochloric acid (HCl) solution. This allows efficient removal of ablation debris produced by chemical reactions during ablation, resulting in high-quality ablation. However, a two-step processing method involving irradiation by a fs-laser beam in air followed by wet etching, distorts the shape of the crater because of residual debris. The threshold fluence for wet-chemical-assisted fs-laser ablation is lower than that for fs-laser ablation in air, which is advantageous for improving fabrication resolution since it reduces thermal effects. We have fabricated craters as small as 510 nm by using a high numerical aperture (NA) objective lens with an NA of 0.73. Furthermore, we have formed three-dimensional hollow microchannels in GaN by fs-laser direct-writing in HCl solution.

  14. Half Layer By Half Layer Growth of a Blue Phosphorene Monolayer on a GaN(001) Substrate

    NASA Astrophysics Data System (ADS)

    Zeng, Jiang; Cui, Ping; Zhang, Zhenyu

    2017-01-01

    Black phosphorene (BlackP), consisting of a vertically corrugated yet single layer of phosphorus atoms, is a latest member of the expanding two-dimensional (2D) materials family with high carrier mobility and immense application potentials. Blue phosphorene (BlueP), an allotrope of BlackP with appealing properties of its own, consists of a more flatly arranged layer of phosphorus atoms. To date, direct growth of either BlackP or BlueP remains a daunting challenge. Using first-principles approaches, here we establish a novel kinetic pathway for fabricating BlueP via epitaxial growth. Our systematic energetic studies reveal that both BlackP and BlueP monolayers can be readily stabilized on Cu(111), Au(111), and GaN(001) substrates. The semiconducting GaN(001) is further shown to be superior for fabricating BlueP, through an intriguing half-layer-by-half-layer (HLBHL) growth mechanism. Within this scheme, the GaN(001) surface is first preferentially covered by a half layer of phosphorus adatoms, followed by the addition of the other half. Once formed, such a BlueP monolayer is thermodynamically stable, as tested using ab initio molecular dynamics simulations. The HLBHL growth mechanism discovered here may enable mass production of high-quality BlueP, and could also be instrumental in achieving epitaxial growth of BlackP and other 2D materials.

  15. Ultraviolet GaN photodetectors on Si via oxide buffer heterostructures with integrated short period oxide-based distributed Bragg reflectors and leakage suppressing metal-oxide-semiconductor contacts

    SciTech Connect

    Szyszka, A. E-mail: adam.szyszka@pwr.wroc.pl; Haeberlen, M.; Storck, P.; Thapa, S. B.; Schroeder, T.

    2014-08-28

    Based on a novel double step oxide buffer heterostructure approach for GaN integration on Si, we present an optimized Metal-Semiconductor-Metal (MSM)-based Ultraviolet (UV) GaN photodetector system with integrated short-period (oxide/Si) Distributed Bragg Reflector (DBR) and leakage suppressing Metal-Oxide-Semiconductor (MOS) electrode contacts. In terms of structural properties, it is demonstrated by in-situ reflection high energy electron diffraction and transmission electron microscopy-energy dispersive x-ray studies that the DBR heterostructure layers grow with high thickness homogeneity and sharp interface structures sufficient for UV applications; only minor Si diffusion into the Y{sub 2}O{sub 3} films is detected under the applied thermal growth budget. As revealed by comparative high resolution x-ray diffraction studies on GaN/oxide buffer/Si systems with and without DBR systems, the final GaN layer structure quality is not significantly influenced by the growth of the integrated DBR heterostructure. In terms of optoelectronic properties, it is demonstrated that—with respect to the basic GaN/oxide/Si system without DBR—the insertion of (a) the DBR heterostructures and (b) dark current suppressing MOS contacts enhances the photoresponsivity below the GaN band-gap related UV cut-off energy by almost up to two orders of magnitude. Given the in-situ oxide passivation capability of grown GaN surfaces and the one order of magnitude lower number of superlattice layers in case of higher refractive index contrast (oxide/Si) systems with respect to classical III-N DBR superlattices, virtual GaN substrates on Si via functional oxide buffer systems are thus a promising robust approach for future GaN-based UV detector technologies.

  16. The process and mechanism of the GaN nanoparticles formed by nitridation of β-Ga2O3 crystal

    NASA Astrophysics Data System (ADS)

    Cui, Xiao-Jun; Wang, Liang-Ling

    2017-04-01

    The process of conversion from β-Ga2O3 single crystal to gallium nitride (GaN) in an atmosphere of NH3 by chemical vapor deposition is investigated. The surface morphology and microstructure of the GaN nanoparticles are observed by scanning electron microscope, which indicates that the growth of GaN is via the Volmer-Weber mechanism. The β-Ga2O3 is firstly evaporated at high temperature to form the porous layer, followed by the surface-defect induced GaN nucleation formation. The crystalline structure and epitaxial relationship of the GaN nanoparticles are investigated by X-ray diffraction (XRD) via ω-2𝜃, showing GaN (0002) and (0004) diffraction peaks in the XRD spectra. It is concluded that the polycrystalline GaN film with hexagonal structure has a strong c-axis preferential orientation.

  17. Study of 3D-growth conditions for selective area MOVPE of high aspect ratio GaN fins with non-polar vertical sidewalls

    NASA Astrophysics Data System (ADS)

    Hartmann, Jana; Steib, Frederik; Zhou, Hao; Ledig, Johannes; Nicolai, Lars; Fündling, Sönke; Schimpke, Tilman; Avramescu, Adrian; Varghese, Tansen; Trampert, Achim; Straßburg, Martin; Lugauer, Hans-Jürgen; Wehmann, Hergo-Heinrich; Waag, Andreas

    2017-10-01

    GaN fins are 3D architectures elongated in one direction parallel to the substrate surface. They have the geometry of walls with a large height to width ratio as well as small footprints. When appropriate symmetry directions of the GaN buffer are used, the sidewalls are formed by non-polar {1 1 -2 0} planes, making the fins particularly suitable for many device applications like LEDs, FETs, lasers, sensors or waveguides. The influence of growth parameters like temperature, pressure, V/III ratio and total precursor flow on the fin structures is analyzed. Based on these results, a 2-temperature-step-growth was developed, leading to fins with smooth side and top facets, fast vertical growth rates and good homogeneity along their length as well as over different mask patterns. For the core-shell growth of fin LED heterostructures, the 2-temperature-step-growth shows much smoother sidewalls and less crystal defects in the InGaN QW and p-GaN shell compared to structures with cores grown in just one step. Electroluminescence spectra of the 2-temperature-step-grown fin LED are demonstrated.

  18. ZnO nanorods/graphene/Ni/Au hybrid structures as transparent conductive layer in GaN LED for low work voltage and high light extraction

    NASA Astrophysics Data System (ADS)

    Xu, Kun; Xie, Yiyang; Ma, Huali; Du, Yinxiao; Zeng, Fanguang; Ding, Pei; Gao, Zhiyuan; Xu, Chen; Sun, Jie

    2016-12-01

    In this paper, by virtue of one-dimensional ZnO nanorods and two-dimensional graphene film hybrid structures, both the enhanced current spreading and enhanced light extraction were realized at the same time. A 1 nm/1 nm Ni/Au layer was used as an interlayer between graphene and pGaN to form ohmic contact, which makes the device have a good forward conduction properties. Through the comparison of the two groups of making ZnO nanorods or not, it was found that the 30% light extraction efficiency of the device was improved by using the ZnO nanorods. By analysis key parameters of two groups such as the turn-on voltage, work voltage and reverse leakage current, it was proved that the method for preparing surface nano structure by hydrothermal method self-organization growth ZnO nanorods applied in GaN LEDs has no influence to device's electrical properties. The hybrid structure application in GaN LED, make an achievement of a good ohmic contact, no use of ITO and enhancement of light extraction at the same time, meanwhile it does not change the device structure, introduce additional process, worsen the electrical properties.

  19. What Is High-Quality Instruction?

    ERIC Educational Resources Information Center

    Weiss, Iris R.; Pasley, Joan D.

    2004-01-01

    Schools of United States fall short of providing high quality mathematics and science education to all the students. The factors distinguishing the most effective lessons from the least effective ones are stated.

  20. Layer-transferred MoS2/GaN PN diodes

    NASA Astrophysics Data System (ADS)

    Lee, Edwin W.; Lee, Choong Hee; Paul, Pran K.; Ma, Lu; McCulloch, William D.; Krishnamoorthy, Sriram; Wu, Yiying; Arehart, Aaron R.; Rajan, Siddharth

    2015-09-01

    Electrical and optical characterization of two-dimensional/three-dimensional (2D/3D) p-molybdenum disulfide/n-gallium nitride (p-MoS2/n-GaN) heterojunction diodes are reported. Devices were fabricated on high-quality, large-area p-MoS2 grown by chemical vapor deposition on sapphire substrates. The processed devices were transferred onto GaN/sapphire substrates, and the transferred films were characterized by X-ray diffraction (XRD) and atomic force microscopy (AFM). On-axis XRD spectra and surface topology obtained from AFM scans were consistent with previously grown high-quality, continuous MoS2 films. Current-voltage measurements of these diodes exhibited excellent rectification, and capacitance-voltage measurements were used to extract a conduction band offset of 0.23 eV for the transferred MoS2/GaN heterojunction. This conduction band offset was confirmed by internal photoemission measurements. The energy band lineup of the MoS2/GaN heterojunction is proposed here. This work demonstrates the potential of 2D/3D heterojunctions for novel device applications.

  1. Layer-transferred MoS{sub 2}/GaN PN diodes

    SciTech Connect

    Lee, Edwin W.; Lee, Choong Hee; Paul, Pran K.; Krishnamoorthy, Sriram; Arehart, Aaron R.; Ma, Lu; McCulloch, William D.; Wu, Yiying; Rajan, Siddharth

    2015-09-07

    Electrical and optical characterization of two-dimensional/three-dimensional (2D/3D) p-molybdenum disulfide/n-gallium nitride (p-MoS{sub 2}/n-GaN) heterojunction diodes are reported. Devices were fabricated on high-quality, large-area p-MoS{sub 2} grown by chemical vapor deposition on sapphire substrates. The processed devices were transferred onto GaN/sapphire substrates, and the transferred films were characterized by X-ray diffraction (XRD) and atomic force microscopy (AFM). On-axis XRD spectra and surface topology obtained from AFM scans were consistent with previously grown high-quality, continuous MoS{sub 2} films. Current-voltage measurements of these diodes exhibited excellent rectification, and capacitance-voltage measurements were used to extract a conduction band offset of 0.23 eV for the transferred MoS{sub 2}/GaN heterojunction. This conduction band offset was confirmed by internal photoemission measurements. The energy band lineup of the MoS{sub 2}/GaN heterojunction is proposed here. This work demonstrates the potential of 2D/3D heterojunctions for novel device applications.

  2. Assuring quality in high-consequence engineering

    SciTech Connect

    Hoover, Marcey L.; Kolb, Rachel R.

    2014-03-01

    In high-consequence engineering organizations, such as Sandia, quality assurance may be heavily dependent on staff competency. Competency-dependent quality assurance models are at risk when the environment changes, as it has with increasing attrition rates, budget and schedule cuts, and competing program priorities. Risks in Sandia's competency-dependent culture can be mitigated through changes to hiring, training, and customer engagement approaches to manage people, partners, and products. Sandia's technical quality engineering organization has been able to mitigate corporate-level risks by driving changes that benefit all departments, and in doing so has assured Sandia's commitment to excellence in high-consequence engineering and national service.

  3. Assessment of GaN chips for culturing cerebellar granule neurons.

    PubMed

    Young, Tai-Horng; Chen, Chi-Ruei

    2006-06-01

    In this work, the behaviors of cerebellar granule neurons prepared from 7-day-old Wistar rats on gallium nitride (GaN) were investigated. We believe that this is the first time that the GaN has been used as a substrate for neuron cultures to examine its effect on cell response in vitro. The GaN surface structure and its relationship with cells were examined by atomic force microscopy (AFM), metallography microscopy, scanning electron microscopy (SEM), lactate dehydrogenase (LDH) release and Western blot analysis. GaN is a so-called III-V compound semiconductor material with a wide bandgap and a relatively high bandgap voltage. Compared with silicon used for most neural chips, neurons seeded on GaN were able to form an extensive neuritic network and expressed very high levels of GAP-43 coincident with the neurite outgrowth. Therefore, the GaN structure may spatially mediate cellular response that can promote neuronal cell attachment, differentiation and neuritic growth. The favorable biocompatibility characteristics of GaN can be used to measure electric signals from networks of neuronal cells in culture to make it a possible candidate for use in a microelectrode array.

  4. Current status and scope of gallium nitride-based vertical transistors for high-power electronics application

    NASA Astrophysics Data System (ADS)

    Chowdhury, Srabanti; Swenson, Brian L.; Hoi Wong, Man; Mishra, Umesh K.

    2013-07-01

    Gallium nitride (GaN) is becoming the material of choice for power electronics to enable the roadmap of increasing power density by simultaneously enabling high-power conversion efficiency and reduced form factor. This is because the low switching losses of GaN enable high-frequency operation which reduces bulky passive components with negligible change in efficiency. Commercialization of GaN-on-Si materials for power electronics has led to the entry of GaN devices into the medium-power market since the performance-over-cost of even first-generation products looks very attractive compared to today's mature Si-based solutions. On the other hand, the high-power market still remains unaddressed by lateral GaN devices. The current and voltage demand for high-power conversion application makes the chip area in a lateral topology so large that it becomes difficult to manufacture. Vertical GaN devices would play a big role alongside silicon carbide (SiC) to address the high-power conversion needs. In this paper vertical GaN devices are discussed with emphasis on current aperture vertical electron transistors (CAVETs) which have shown promising performance. The fabrication-related challenges and the future possibilities enabled by the availability of good-quality, cost-competitive bulk GaN material are also evaluated for CAVETs. This work was done at Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, USA.

  5. Control of ion content and nitrogen species using a mixed chemistry plasma for GaN grown at extremely high growth rates >9 μm/h by plasma-assisted molecular beam epitaxy

    SciTech Connect

    Gunning, Brendan P.; Clinton, Evan A.; Merola, Joseph J.; Doolittle, W. Alan; Bresnahan, Rich C.

    2015-10-21

    Utilizing a modified nitrogen plasma source, plasma assisted molecular beam epitaxy (PAMBE) has been used to achieve higher growth rates in GaN. A higher conductance aperture plate, combined with higher nitrogen flow and added pumping capacity, resulted in dramatically increased growth rates up to 8.4 μm/h using 34 sccm of N{sub 2} while still maintaining acceptably low operating pressure. It was further discovered that argon could be added to the plasma gas to enhance growth rates up to 9.8 μm/h, which was achieved using 20 sccm of N{sub 2} and 7.7 sccm Ar flows at 600 W radio frequency power, for which the standard deviation of thickness was just 2% over a full 2 in. diameter wafer. A remote Langmuir style probe employing the flux gauge was used to indirectly measure the relative ion content in the plasma. The use of argon dilution at low plasma pressures resulted in a dramatic reduction of the plasma ion current by more than half, while high plasma pressures suppressed ion content regardless of plasma gas chemistry. Moreover, different trends are apparent for the molecular and atomic nitrogen species generated by varying pressure and nitrogen composition in the plasma. Argon dilution resulted in nearly an order of magnitude achievable growth rate range from 1 μm/h to nearly 10 μm/h. Even for films grown at more than 6 μm/h, the surface morphology remained smooth showing clear atomic steps with root mean square roughness less than 1 nm. Due to the low vapor pressure of Si, Ge was explored as an alternative n-type dopant for high growth rate applications. Electron concentrations from 2.2 × 10{sup 16} to 3.8 × 10{sup 19} cm{sup −3} were achieved in GaN using Ge doping, and unintentionally doped GaN films exhibited low background electron concentrations of just 1–2 × 10{sup 15} cm{sup −3}. The highest growth rates resulted in macroscopic surface features due to Ga cell spitting, which is an engineering challenge still to be

  6. Development of GaN wafers for solid-state lighting via the ammonothermal method

    NASA Astrophysics Data System (ADS)

    Letts, Edward; Hashimoto, Tadao; Ikari, Masanori; Nojima, Yoshihiro

    2012-07-01

    In order for solid-state lighting to replace existing light bulbs, high power LEDs will be required to handle more current than conventional LEDs. When current densities in high power LEDs become comparable to that of Laser Diodes (LDs), GaN substrates will be critically useful for device reliability. Due to its significant scalability, the ammonothermal growth of bulk GaN could provide cost competitive wafers for high power LEDs. Our team has focused on developing the basic ammonothermal growth method in small 1” internal diameter prototype autoclaves capable of accommodating multiple crystals simultaneously. We have made considerable improvements in the crystal quality particularly in transparency and structural parameters. By optimizing the growth process we have improved the coloration and transparency of the crystals from a black/brown to semi-transparent yellow. We have improved the absorption coefficient at 450 nm from 30.5 cm-1 to 8 cm-1 yielding semi-transparent crystals. Currently, we can reliably achieve a full width half maximum (FWHM) of X-ray 002 reflection between 100 and 300 arcs. The crystals have a low dislocation density less than 10-6 cm-2 and are n-type with a resistivity of approximately ρ∼10-2 Ω cm. In this presentation we will discuss improvements that we have made to provide a more suitable substrate for future high power LEDs.

  7. Subjective sleep quality alterations at high altitude.

    PubMed

    Szymczak, Robert K; Sitek, Emilia J; Sławek, Jarosław W; Basiński, Andrzej; Siemiński, Mariusz; Wieczorek, Dariusz

    2009-01-01

    Sleep pattern at high altitude has been studied, mainly with the use of polysomnography. This study aimed to analyze subjective sleep quality at high altitude using the following standardized scales: the Pittsburgh Sleep Quality Index (PSQI) and the Athens Insomnia Scale (AIS-8). Thirty-two members of 2 expeditions--28 males and 4 females (mean age 31 years)--participated in this study conducted in Nepal, Himalayas (Lobuche East, 6119 m above sea level [masl]), Kyrgyzstan, Pamirs (Lenin Peak, 7134 masl), and Poland (sea level). The scales were administered twice, at high altitude (mean altitude 4524 masl) and at sea level. Both measures showed a decrease in sleep quality at high altitude (statistical significance, P < .001). Sleep problems affected general sleep quality and sleep induction. Sleep disturbances due to awakenings during the night, temperature-related discomfort, and breathing difficulties were reported. High altitude had no statistically significant effect on sleep duration or daytime dysfunction as measured by PSQI. The overall results of PSQI and AIS-8 confirm the data based on the climbers' subjective accounts and polysomnographic results reported in previous studies. The introduction of standardized methods of subjective sleep quality assessment might resolve the problem of being able to perform precise evaluations and research in the field of sleep disturbances at high altitude.

  8. Ga vacancy induced ferromagnetism enhancement and electronic structures of RE-doped GaN

    NASA Astrophysics Data System (ADS)

    Zhong, Guohua; Zhang, Kang; He, Fan; Ma, Xuhang; Lu, Lanlan; Liu, Zhuang; Yang, Chunlei

    2012-09-01

    Because of their possible applications in spintronic and optoelectronic devices, GaN dilute magnetic semiconductors (DMSs) doped by rare-earth (RE) elements have attracted much attention since the high Curie temperature was obtained in RE-doped GaN DMSs and a colossal magnetic moment was observed in the Gd-doped GaN thin film. We have systemically studied the GaN DMSs doped by RE elements (La, Ce-Yb) using the full-potential linearized augmented plane wave method within the framework of density functional theory and adding the considerations of the electronic correlation and the spin-orbital coupling effects. We have studied the electronic structures of DMSs, especially for the contribution from f electrons. The origin of magnetism, magnetic interaction and the possible mechanism of the colossal magnetic moment were explored. We found that, for materials containing f electrons, electronic correlation was usually strong and the spin-orbital coupling was sometimes crucial in determining the magnetic ground state. It was found that GaN doped by La was non-magnetic. GaN doped by Ce, Nd, Pm, Eu, Gd, Tb and Tm are stabilized at antiferromagnetic phase, while GaN doped by other RE elements show strong ferromagnetism which is suitable materials for spintronic devices. Moreover, we have identified that the observed large enhancement of magnetic moment in GaN is mainly caused by Ga vacancies (3.0μB per Ga vacancy), instead of the spin polarization by magnetic ions or originating from N vacancies. Various defects, such as substitutional Mg for Ga, O for N under the RE doping were found to bring a reduction of ferromagnetism. In addition, intermediate bands were observed in some systems of GaN:RE and GaN with intrinsic defects, which possibly opens the potential application of RE-doped semiconductors in the third generation high efficiency photovoltaic devices.

  9. Nanostructured N-polar GaN surfaces and their wetting behaviors

    NASA Astrophysics Data System (ADS)

    Jia, Ran; Zhao, Dongfang; Gao, Naikun; Yan, Weishan; Zhang, Ling; Liu, Duo

    2017-08-01

    We report here the wetting behaviors of nanostructured N-polar GaN wafers. The nanostructured GaN samples were obtained by wet photochemical etching under UV illumination. It is confirmed that the wetting behavior of the nanostructured N-polar GaN surfaces follows the Wenzel model. Both surface roughening and decoration with Au nanoparticles will reduce the contact angle (CA), while modification with lauric acid will increase hydrophobility with CAs that change from 42.1° to 129.5°. Besides, the nanostructured surface shows high contact angle hysteresis due to strong static friction that can reach ∼15 mJ/m2.

  10. Stress and Defect Control in GaN Using Low Temperature Interlayers

    SciTech Connect

    Akasaki, I.; Amano, H.; Chason, E.; Figiel, J.; Floro, J.A.; Han, J.; Hearne, S.; Iwaya, M.; Kashima, T.; Katsuragcawa, M.

    1998-12-04

    In organometallic vapor phase epitaxial growth of Gail on sapphire, the role of the low- temperature-deposited interlayers inserted between high-temperature-grown GaN layers was investigated by in situ stress measurement, X-ray diffraction, and transmission electron microscopy. Insertion of a series of low temperature GaN interlayers reduces the density of threading dislocations while simultaneously increasing the tensile stress during growth, ultimately resulting in cracking of the GaN film. Low temperature AIN interlayers were found to be effective in suppressing cracking by reducing tensile stress. The intedayer approach permits tailoring of the film stress to optimize film structure and properties.

  11. Study of the integrated growth of dielectric films on GaN semiconductor substrates.

    PubMed

    Li, Yanrong; Zhu, Jun; Luo, Wenbo

    2010-10-01

    Typical perovskite oxides SrTiO₃ (STO) and PbZr₀.₅₂Ti₀.₄₈O₃ (PZT) were fabricated on GaN semiconductor substrates by pulsed laser deposition. STO and PZT films were deposited on bare GaN, TiO₂, and MgO-buffered GaN. The effects of TiO₂ and MgO buffer-layers on the orientations and electric properties of the perovskite films were systematically studied. The crystalline properties were in situ monitored by reflective high energy electron diffraction and ex situ characterized by X-ray diffraction. It was found that the epitaxial temperature of STO and PZT was reduced by inserting a buffer layer. (111)-oriented films were obtained on bare and TiO₂-buffered GaN. However, the orientations of the perovskite films were changed to be (110) when deposited on MgO buffer layer. Furthermore, PZT films deposited on MgO- and TiO₂-buffered GaN show better electric performance compared with these films directly deposited on GaN. These results show that perovskite oxide could be epitaxially grown on GaN semiconductor substrates by inserting a proper buffer layer.

  12. Crystal field analysis of rare-earth ions energy levels in GaN

    NASA Astrophysics Data System (ADS)

    Stachowicz, M.; Kozanecki, A.; Ma, C.-G.; Brik, M. G.; Lin, J. Y.; Jiang, Hx; Zavada, J. M.

    2014-11-01

    Much effort has been put to achieve optoelectronic devices based on Er doped GaN, operating on the intra-4f-shell transitions of erbium. The key issue for good understanding of energy transfer mechanisms to Er and its luminescence properties is the position of Er3+ ions in the crystalline lattice of GaN. After doping, Er3+ ions are assumed to be placed in substitutional position for Ga3+ in GaN. Although Ga is positioned in high symmetry, tetrahedral [ErN4]9 - cluster, deviations from this after doping are impossible to avoid because of a large difference in ionic radii of Ga3+ (47 pm) and Er3+ (89 pm). In this work we report on crystal field analysis of Er ion energy levels in cubic and hexagonal GaN. It is shown that local symmetry of Er in cubic GaN is D2, whereas calculations reveal that in hexagonal GaN local symmetry is C3V. Some trends in crystal field parameters of trivalent lanthanides in hexagonal GaN are discussed.

  13. Fabrication of GaN nanotubular material using MOCVD with aluminum oxide membrane

    NASA Astrophysics Data System (ADS)

    Jung, Woo-Gwang; Jung, Se-Hyuck; Kung, Patrick; Razeghi, Manijeh

    2006-02-01

    GaN nanotubular material is fabricated with aluminum oxide membrane in MOCVD. SEM, XRD, TEM and PL are employed to characterize the fabricated GaN nanotubular material. An aluminum oxide membrane with ordered nano holes is used as template. Gallium nitride is deposited at the inner wall of the nano holes in aluminum oxide template, and the nanotubular material with high aspect ratio is synthesized using the precursors of TMG and ammonia gas. Optimal synthesis condition in MOCVD is obtained successfully for the gallium nitride nanotubular material in this research. The diameter of GaN nanotube fabricated is approximately 200 ~ 250 nm and the wall thickness is about 40 ~ 50 nm. GaN nanotubular material consists of numerous fine GaN particulates with sizes ranging 15 to 30 nm. The composition of gallium nitride is confirmed to be stoichiometrically 1:1 for Ga and N by EDS. XRD and TEM analyses indicate that grains in GaN nanotubular material have nano-crystalline structure. No blue shift is found in the PL spectrum on the GaN nanotubular material fabricated in aluminum oxide template.

  14. Fabrication of GaN nanotubular material using MOCVD with an aluminium oxide membrane

    NASA Astrophysics Data System (ADS)

    Jung, Woo-Gwang; Jung, Se-Hyuck; Kung, Patrick; Razeghi, Manijeh

    2006-01-01

    GaN nanotubular material is fabricated with an aluminium oxide membrane in MOCVD. SEM, XRD, TEM and PL are employed to characterize the fabricated GaN nanotubular material. An aluminium oxide membrane with ordered nanoholes is used as a template. Gallium nitride is deposited at the inner wall of the nanoholes in the aluminium oxide template, and the nanotubular material with high aspect ratio is synthesized using the precursors of TMG and ammonia gas. Optimal synthesis conditions in MOCVD are obtained successfully for the gallium nitride nanotubular material in this research. The diameter of the GaN nanotube fabricated is approximately 200-250 nm and the wall thickness is about 40-50 nm. GaN nanotubular material consists of numerous fine GaN particulates with size range 15-30 nm. The composition of gallium nitride is confirmed to be stoichiometrically 1:1 for Ga and N by EDS. XRD and TEM analyses indicate that the grains in GaN nanotubular material have a nano-crystalline structure. No blue shift is found in the PL spectrum on the GaN nanotubular material fabricated in an aluminium oxide template.

  15. Photoelectrochemical water splitting on nanoporous GaN thin films for energy conversion under visible light

    NASA Astrophysics Data System (ADS)

    Cao, Dezhong; Xiao, Hongdi; Fang, Jiacheng; Liu, Jianqiang; Gao, Qingxue; Liu, Xiangdong; Ma, Jin

    2017-01-01

    Nanoporous (NP) GaN thin films, which were fabricated by an electrochemical etching method at different voltages, were used as photoelectrodes during photoelectrochemical (PEC) water splitting in 1 M oxalic acid solution. Upon illumination at a power density of 100 mW cm-2 (AM 1.5), water splitting is observed in NP GaN thin films, presumably resulting from the valence band edge which is more positive than the redox potential of the oxidizing species. In comparison with NP GaN film fabricated at 8 V, NP GaN obtained at 18 V shows nearly twofold enhancement in photocurrent with the maximum photo-to-hydrogen conversion efficiency of 1.05% at ~0 V (versus Ag/AgCl). This enhancement could be explained with (i) the increase of surface area and surface states, and (ii) the decrease of resistances and carrier concentration in the NP GaN thin films. High stability of the NP GaN thin films during the PEC water splitting further confirms that the NP GaN thin film could be applied to the design of efficient solar cells and solar fuel devices.

  16. Air-bridged lateral epitaxial overgrowth of GaN thin films

    NASA Astrophysics Data System (ADS)

    Kidoguchi, Isao; Ishibashi, Akihiko; Sugahara, Gaku; Ban, Yuzaburoh

    2000-06-01

    A promising technique of selective lateral epitaxy, namely air-bridged lateral epitaxial overgrowth, is demonstrated in order to reduce the wing tilt as well as the threading dislocation density in GaN thin films. A seed GaN layer was etched to make ridge-stripe along <11¯00>GaN direction and a GaN material was regrown from the exposed (0001) top facet of the ridged GaN seed structures, whose sidewalls and etched bottoms were covered with silicon nitride mask, using low-pressure metalorganic vapor phase epitaxy. The density of dislocations in the wing region was reduced to be <107cm-2, which was at least two orders of magnitude lower than that of underlying GaN. The magnitude of the wing tilt was determined to be 0.08° by x-ray diffraction (XRD) measurements, which was smaller than other lateral epitaxial overgrown GaN thin films. The full width at half maximum of XRD for the wing region was 138 arc sec, indicating high uniformity of c-axis orientation.

  17. Zero lattice mismatch and twin-free single crystalline ScN buffer layers for GaN growth on silicon

    SciTech Connect

    Lupina, L.; Zoellner, M. H.; Dietrich, B.; Capellini, G.; Niermann, T.; Lehmann, M.; Thapa, S. B.; Haeberlen, M.; Storck, P.; Schroeder, T.

    2015-11-16

    We report the growth of thin ScN layers deposited by plasma-assisted molecular beam epitaxy on Sc{sub 2}O{sub 3}/Y{sub 2}O{sub 3}/Si(111) substrates. Using x-ray diffraction, Raman spectroscopy, and transmission electron microscopy, we find that ScN films grown at 600 °C are single crystalline, twin-free with rock-salt crystal structure, and exhibit a direct optical band gap of 2.2 eV. A high degree of crystalline perfection and a very good lattice matching between ScN and GaN (misfit < 0.1%) makes the ScN/Sc{sub 2}O{sub 3}/Y{sub 2}O{sub 3} buffer system a very promising template for the growth of high quality GaN layers on silicon.

  18. Above room-temperature ferromagnetism of Mn delta-doped GaN nanorods

    SciTech Connect

    Lin, Y. T.; Wadekar, P. V.; Kao, H. S.; Chen, T. H.; Chen, Q. Y.; Tu, L. W.; Huang, H. C.; Ho, N. J.

    2014-02-10

    One-dimensional nitride based diluted magnetic semiconductors were grown by plasma-assisted molecular beam epitaxy. Delta-doping technique was adopted to dope GaN nanorods with Mn. The structural and magnetic properties were investigated. The GaMnN nanorods with a single crystalline structure and with Ga sites substituted by Mn atoms were verified by high-resolution x-ray diffraction and Raman scattering, respectively. Secondary phases were not observed by high-resolution x-ray diffraction and high-resolution transmission electron microscopy. In addition, the magnetic hysteresis curves show that the Mn delta-doped GaN nanorods are ferromagnetic above room temperature. The magnetization with magnetic field perpendicular to GaN c-axis saturates easier than the one with field parallel to GaN c-axis.

  19. Effect of pressure on the semipolar GaN (10-11) growth mode on patterned Si substrates

    NASA Astrophysics Data System (ADS)

    Liu, Jian-Ming; Zhang, Jie; Lin, Wen-Yu; Ye, Meng-Xin; Feng, Xiang-Xu; Zhang, Dong-Yan; Steve, Ding; Xu, Chen-Ke; Liu, Bao-Lin

    2015-05-01

    In this paper, we investigate the effect of pressure on the growth mode of high quality (10-11) GaN using an epitaxial lateral over growth (ELO) technique by metal organic chemical vapor deposition (MOCVD). Two pressure growth conditions, high pressure (HP) 1013 mbar and low pressure growth (LP) 500 mbar, are employed during growth. In the high pressure growth conditions, the crystal quality is improved by decreasing the dislocation and stack fault density in the strip connection locations. The room temperature photoluminescence measurement also shows that the light emission intensity increases three times using the HP growth condition compared with that using the LP growth conditions. In the low temperature (77 K) photoluminescence, the defects-related peaks are very obvious in the low pressure growth samples. This result also indicates that the crystal quality is improved using the high pressure growth conditions. Project support by the National High Technology Research and Development Program of China (Green Laser).

  20. GaN MOSHEMT employing HfO2 as a gate dielectric with partially etched barrier

    NASA Astrophysics Data System (ADS)

    Han, Kefeng; Zhu, Lin

    2017-09-01

    In order to suppress the gate leakage current of a GaN high electron mobility transistor (GaN HEMT), a GaN metal-oxide-semiconductor high electron mobility transistor (MOSHEMT) is proposed, in which a metal-oxide-semiconductor gate with high-dielectric-constant HfO2 as an insulating dielectric is employed to replace the traditional GaN HEMT Schottky gate. A 0.5 μm gate length GaN MOSHEMT was fabricated based on the proposed structure, the {{{Al}}}0.28{{{Ga}}}0.72{{N}} barrier layer is partially etched to produce a higher transconductance without deteriorating the transport characteristics of the two-dimensional electron gas in the channel, the gate dielectric is HfO2 deposited by atomic layer deposition. Current-voltage characteristics and radio frequency characteristics are obtained after device preparation, the maximum current density of the device is 900 mA mm-1, the source-drain breakdown voltage is 75 V, gate current is significantly suppressed and the forward gate voltage swing range is about ten times higher than traditional GaN HEMTs, the GaN MOSHEMT also demonstrates radio frequency characteristics comparable to traditional GaN HEMTs with the same gate length.

  1. Ultradeep electron cyclotron resonance plasma etching of GaN

    DOE PAGES

    Harrison, Sara E.; Voss, Lars F.; Torres, Andrea M.; ...

    2017-07-25

    Here, ultradeep (≥5 μm) electron cyclotron resonance plasma etching of GaN micropillars was investigated. Parametric studies on the influence of the applied radio-frequency power, chlorine content in a Cl2/Ar etch plasma, and operating pressure on the etch depth, GaN-to-SiO2 selectivity, and surface morphology were performed. Etch depths of >10 μm were achieved over a wide range of parameters. Etch rates and sidewall roughness were found to be most sensitive to variations in RF power and % Cl2 in the etch plasma. Selectivities of >20:1 GaN:SiO2 were achieved under several chemically driven etch conditions where a maximum selectivity of ~39:1 wasmore » obtained using a 100% Cl2 plasma. The etch profile and (0001) surface morphology were significantly influenced by operating pressure and the chlorine content in the plasma. Optimized etch conditions yielded >10 μm tall micropillars with nanometer-scale sidewall roughness, high GaN:SiO2 selectivity, and nearly vertical etch profiles. These results provide a promising route for the fabrication of ultradeep GaN microstructures for use in electronic and optoelectronic device applications. In addition, dry etch induced preferential crystallographic etching in GaN microstructures is also demonstrated, which may be of great interest for applications requiring access to non- or semipolar GaN surfaces.« less

  2. Properties of H, O and C in GaN

    SciTech Connect

    Pearton, S.J.; Abernathy, C.R.; Lee, J.W.

    1996-04-01

    The electrical properties of the light ion impurities H, O and C in GaN have been examined in both as-grown and implanted material. H is found to efficiently passivate acceptors such as Mg, Ca and C. Reactivation occurs at {ge} 450 C and is enhanced by minority carrier injection. The hydrogen does not leave the GaN crystal until > 800 C, and its diffusivity is relatively high ({approximately} 10{sup {minus}11} cm{sup 2}/s) even at low temperatures (< 200 C) during injection by wet etching, boiling in water or plasma exposure. Oxygen shows a low donor activation efficiency when implanted into GaN, with an ionization level of 30--40 meV. It is essentially immobile up to 1,100 C. Carbon can produce low p-type levels (3 {times} 10{sup 17} cm{sup {minus}3}) in GaN during MOMBE, although there is some evidence it may also create n-type conduction in other nitrides.

  3. Luminescence properties of defects in GaN

    NASA Astrophysics Data System (ADS)

    Reshchikov, Michael A.; Morkoç, Hadis

    2005-03-01

    Gallium nitride (GaN) and its allied binaries InN and AIN as well as their ternary compounds have gained an unprecedented attention due to their wide-ranging applications encompassing green, blue, violet, and ultraviolet (UV) emitters and detectors (in photon ranges inaccessible by other semiconductors) and high-power amplifiers. However, even the best of the three binaries, GaN, contains many structural and point defects caused to a large extent by lattice and stacking mismatch with substrates. These defects notably affect the electrical and optical properties of the host material and can seriously degrade the performance and reliability of devices made based on these nitride semiconductors. Even though GaN broke the long-standing paradigm that high density of dislocations precludes acceptable device performance, point defects have taken the center stage as they exacerbate efforts to increase the efficiency of emitters, increase laser operation lifetime, and lead to anomalies in electronic devices. The point defects include native isolated defects (vacancies, interstitial, and antisites), intentional or unintentional impurities, as well as complexes involving different combinations of the isolated defects. Further improvements in device performance and longevity hinge on an in-depth understanding of point defects and their reduction. In this review a comprehensive and critical analysis of point defects in GaN, particularly their manifestation in luminescence, is presented. In addition to a comprehensive analysis of native point defects, the signatures of intentionally and unintentionally introduced impurities are addressed. The review discusses in detail the characteristics and the origin of the major luminescence bands including the ultraviolet, blue, green, yellow, and red bands in undoped GaN. The effects of important group-II impurities, such as Zn and Mg on the photoluminescence of GaN, are treated in detail. Similarly, but to a lesser extent, the effects of

  4. GaN Initiative for Grid Applications (GIGA)

    SciTech Connect

    Turner, George

    2015-07-03

    For nearly 4 ½ years, MIT Lincoln Laboratory (MIT/LL) led a very successful, DoE-funded team effort to develop GaN-on-Si materials and devices, targeting high-voltage (>1 kV), high-power, cost-effective electronics for grid applications. This effort, called the GaN Initiative for Grid Applications (GIGA) program, was initially made up of MIT/LL, the MIT campus group of Prof. Tomas Palacios (MIT), and the industrial partner M/A Com Technology Solutions (MTS). Later in the program a 4th team member was added (IQE MA) to provide commercial-scale GaN-on-Si epitaxial materials. A basic premise of the GIGA program was that power electronics, for ubiquitous utilization -even for grid applications - should be closer in cost structure to more conventional Si-based power electronics. For a number of reasons, more established GaN-on-SiC or even SiC-based power electronics are not likely to reach theses cost structures, even in higher manufacturing volumes. An additional premise of the GIGA program was that the technical focus would be on materials and devices suitable for operating at voltages > 1 kV, even though there is also significant commercial interest in developing lower voltage (< 1 kV), cost effective GaN-on-Si devices for higher volume applications, like consumer products. Remarkable technical progress was made during the course of this program. Advances in materials included the growth of high-quality, crack-free epitaxial GaN layers on large-diameter Si substrates with thicknesses up to ~5 μm, overcoming significant challenges in lattice mismatch and thermal expansion differences between Si and GaN in the actual epitaxial growth process. Such thick epilayers are crucial for high voltage operation of lateral geometry devices such as Schottky barrier (SB) diodes and high electron mobility transistors (HEMTs). New “Normally-Off” device architectures were demonstrated – for safe operation of power electronics circuits. The trade-offs between lateral and

  5. Depth dependence of defect density and stress in GaN grown on SiC

    SciTech Connect

    Faleev, N.; Temkin, H.; Ahmad, I.; Holtz, M.; Melnik, Yu.

    2005-12-15

    We report high resolution x-ray diffraction studies of the relaxation of elastic strain in GaN grown on SiC(0001). The GaN layers were grown with thickness ranging from 0.29 to 30 {mu}m. High level of residual elastic strain was found in thin (0.29 to 0.73 {mu}m thick) GaN layers. This correlates with low density of threading screw dislocations of 1-2x10{sup 7} cm{sup -2}, observed in a surface layer formed over a defective nucleation layer. Stress was found to be very close to what is expected from thermal expansion mismatch between the GaN and SiC. A model based on generation and diffusion of point defects accounts for these observations.

  6. Enhanced cell growth on nanotextured GaN surface treated by UV illumination and fibronectin adsorption.

    PubMed

    Li, Jingying; Han, Qiusen; Wang, Xinhuan; Yang, Rong; Wang, Chen

    2014-11-01

    Semiconductors are important materials used for the development of high-performance biomedical devices. Gallium nitride (GaN) is a well-known III-nitride semiconductor with excellent optoelectronic properties as well as high chemical stability and biocompatibility. The formation of tight interfaces between GaN substrates and cells would be crucial for GaN-based devices used for probing and manipulating biological processes of cells. Here we report a strategy to greatly enhance cell adhesion and survival on nanotextured GaN surface which was treated by UV illumination and fibronectin (FN) adsorption. Cell studies showed that the UV/FN treatment greatly enhanced cell adhesion and growth on nanotextured GaN surfaces. These observations suggest new opportunities for novel nanotextured GaN-based biomedical devices. Copyright © 2014 Elsevier B.V. All rights reserved.

  7. Thermal conductivity and large isotope effect in GaN from first principles.

    PubMed

    Lindsay, L; Broido, D A; Reinecke, T L

    2012-08-31

    We present atomistic first principles results for the lattice thermal conductivity of GaN and compare them to those for GaP, GaAs, and GaSb. In GaN we find a large increase to the thermal conductivity with isotopic enrichment, ~65% at room temperature. We show that both the high thermal conductivity and its enhancement with isotopic enrichment in GaN arise from the weak coupling of heat-carrying acoustic phonons with optic phonons. This weak scattering results from stiff atomic bonds and the large Ga to N mass ratio, which give phonons high frequencies and also a pronounced energy gap between acoustic and optic phonons compared to other materials. Rigorous understanding of these features in GaN gives important insights into the interplay between intrinsic phonon-phonon scattering and isotopic scattering in a range of materials.

  8. Thermal Conductivity and Large Isotope Effect in GaN from First Principles

    SciTech Connect

    Lindsay, L.; Broido, D. A.; Reinecke, T. L.

    2012-08-28

    We present atomistic first principles results for the lattice thermal conductivity of GaN and compare them to those for GaP, GaAs, and GaSb. In GaN we find a large increase to the thermal conductivity with isotopic enrichment, ~65% at room temperature. We show that both the high thermal conductivity and its enhancement with isotopic enrichment in GaN arise from the weak coupling of heat-carrying acoustic phonons with optic phonons. This weak scattering results from stiff atomic bonds and the large Ga to N mass ratio, which give phonons high frequencies and also a pronounced energy gap between acoustic and optic phonons compared to other materials. Rigorous understanding of these features in GaN gives important insights into the interplay between intrinsic phonon-phonon scattering and isotopic scattering in a range of materials.

  9. One-step fabrication of porous GaN crystal membrane and its application in energy storage

    PubMed Central

    Zhang, Lei; Wang, Shouzhi; Shao, Yongliang; Wu, Yongzhong; Sun, Changlong; Huo, Qin; Zhang, Baoguo; Hu, Haixiao; Hao, Xiaopeng

    2017-01-01

    Single-crystal gallium nitride (GaN) membranes have great potential for a variety of applications. However, fabrication of single-crystalline GaN membranes remains a challenge owing to its chemical inertness and mechanical hardness. This study prepares large-area, free-standing, and single-crystalline porous GaN membranes using a one-step high-temperature annealing technique for the first time. A promising separation model is proposed through a comprehensive study that combines thermodynamic theories analysis and experiments. Porous GaN crystal membrane is processed into supercapacitors, which exhibit stable cycling life, high-rate capability, and ultrahigh power density, to complete proof-of-concept demonstration of new energy storage application. Our results contribute to the study of GaN crystal membranes into a new stage related to the elelctrochemical energy storage application. PMID:28281562

  10. The depth-profiled carrier concentration and scattering mechanism in undoped GaN film grown on sapphire

    NASA Astrophysics Data System (ADS)

    Huang, Y.; Chen, X. D.; Fung, S.; Beling, C. D.; Ling, C. C.; Wei, Z. F.; Xu, S. J.; Zhi, C. Y.

    2004-07-01

    Temperature-dependent Hall (TDH) measurements and confocal micro-Raman spectroscopy have been used to study the free carrier spatial distribution and scattering mechanism in unintentionally doped GaN film grown on the sapphire substrate with the method of metalorganic chemical vapor deposition. Both the TDH data and the depth-profiled Raman spectra agreed with the existence of a nonuniform spatial distribution of free carriers in the GaN film with a highly conductive layer of ˜1 μm thickness near the GaN sapphire boundary. With the consideration of this parallel conduction channel adjacent to GaN sapphire boundary, detailed analysis of the TDH mobility data suggests that a relatively high concentration of nitrogen vacancies exists and nitrogen vacancy scattering has an important influence on limiting the electron mobility in the bulk film of the present GaN sample.

  11. One-step fabrication of porous GaN crystal membrane and its application in energy storage.

    PubMed

    Zhang, Lei; Wang, Shouzhi; Shao, Yongliang; Wu, Yongzhong; Sun, Changlong; Huo, Qin; Zhang, Baoguo; Hu, Haixiao; Hao, Xiaopeng

    2017-03-10

    Single-crystal gallium nitride (GaN) membranes have great potential for a variety of applications. However, fabrication of single-crystalline GaN membranes remains a challenge owing to its chemical inertness and mechanical hardness. This study prepares large-area, free-standing, and single-crystalline porous GaN membranes using a one-step high-temperature annealing technique for the first time. A promising separation model is proposed through a comprehensive study that combines thermodynamic theories analysis and experiments. Porous GaN crystal membrane is processed into supercapacitors, which exhibit stable cycling life, high-rate capability, and ultrahigh power density, to complete proof-of-concept demonstration of new energy storage application. Our results contribute to the study of GaN crystal membranes into a new stage related to the elelctrochemical energy storage application.

  12. One-step fabrication of porous GaN crystal membrane and its application in energy storage

    NASA Astrophysics Data System (ADS)

    Zhang, Lei; Wang, Shouzhi; Shao, Yongliang; Wu, Yongzhong; Sun, Changlong; Huo, Qin; Zhang, Baoguo; Hu, Haixiao; Hao, Xiaopeng

    2017-03-01

    Single-crystal gallium nitride (GaN) membranes have great potential for a variety of applications. However, fabrication of single-crystalline GaN membranes remains a challenge owing to its chemical inertness and mechanical hardness. This study prepares large-area, free-standing, and single-crystalline porous GaN membranes using a one-step high-temperature annealing technique for the first time. A promising separation model is proposed through a comprehensive study that combines thermodynamic theories analysis and experiments. Porous GaN crystal membrane is processed into supercapacitors, which exhibit stable cycling life, high-rate capability, and ultrahigh power density, to complete proof-of-concept demonstration of new energy storage application. Our results contribute to the study of GaN crystal membranes into a new stage related to the elelctrochemical energy storage application.

  13. Light-emitting diode based on mask- and catalyst-free grown N-polar GaN nanorods.

    PubMed

    Kunert, G; Freund, W; Aschenbrenner, T; Kruse, C; Figge, S; Schowalter, M; Rosenauer, A; Kalden, J; Sebald, K; Gutowski, J; Feneberg, M; Tischer, I; Fujan, K; Thonke, K; Hommel, D

    2011-07-01

    We report on the fabrication of a light-emitting diode based on GaN nanorods containing InGaN quantum wells. The unique system consists of tilted N-polar nanorods of high crystalline quality. Photoluminescence, electroluminescence, and spatially resolved cathodoluminescence investigations consistently show quantum well emission around 2.6 eV. Scanning transmission electron microscopy and energy-dispersive x-ray spectroscopy measurements reveal a truncated shape of the quantum wells with In contents of (15 ± 5)%.

  14. Epitaxial Growths of m-Plane AlGaN/GaN and AlInN/GaN Heterostructures Applicable for Normally-Off Mode High Power Field Effect Transistors on Freestanding GaN Substrates

    DTIC Science & Technology

    2011-08-17

    M. Iza, H. Zhong, S. Nakamura, and S. P. DenBaars, “Light-polarization characteristics of electroluminescence from InGaN /GaN light- emitting diodes...Nakamura, and S. P. DenBaars, “First- Moment Analysis of Polarized Light Emission from InGaN /GaN Light- Emitting Diodes Prepared on Semipolar Planes,” Jpn...S. Speck, and S. Nakamura, “Demonstration of a semipolar (10) InGaN /GaN green light emitting diode,” Appl. Phys. Lett. 87(23), 231110 (2005). 14

  15. Structural and magnetic properties of ultra-thin Fe films on metal-organic chemical vapour deposited GaN(0001)

    NASA Astrophysics Data System (ADS)

    Kim, Jun-Young; Ionescu, Adrian; Mansell, Rhodri; Farrer, Ian; Oehler, Fabrice; Kinane, Christy J.; Cooper, Joshaniel F. K.; Steinke, Nina-Juliane; Langridge, Sean; Stankiewicz, Romuald; Humphreys, Colin J.; Cowburn, Russell P.; Holmes, Stuart N.; Barnes, Crispin H. W.

    2017-01-01

    Structural and magnetic properties of 1-10 nm thick Fe films deposited on GaN(0001) were investigated. In-situ reflecting high energy electron diffraction images indicated a α-Fe(110)/GaN(0001) growth of the 3D Volmer-Weber type. The α-Fe(110) X-ray diffraction peak showed a 1° full-width at half-maximum, indicating ≈20 nm grain sizes. A significant reduction in Fe atomic moment from its bulk value was observed for films thinner than 4 nm. Both GaN/Fe interface roughness and Fe film coercivity increased with Fe thickness, indicating a possible deterioration of Fe crystalline quality. Magnetic anisotropy was mainly uniaxial for all films while hexagonal anisotropies appeared for thicknesses higher than 3.7 nm.

  16. Cross-stacked carbon nanotubes assisted self-separation of free-standing GaN substrates by hydride vapor phase epitaxy

    PubMed Central

    Wei, Tongbo; Yang, Jiankun; Wei, Yang; Huo, Ziqiang; Ji, Xiaoli; Zhang, Yun; Wang, Junxi; Li, Jinmin; Fan, Shoushan

    2016-01-01

    We report a novel method to fabricate high quality 2-inch freestanding GaN substrate grown on cross-stacked carbon nanotubes (CSCNTs) coated sapphire by hydride vapor phase epitaxy (HVPE). As nanoscale masks, these CSCNTs can help weaken the interface connection and release the compressive stress by forming voids during fast coalescence and also block the propagation of threading dislocations (TDs). During the cool-down process, thermal stress-induced cracks are initiated at the CSCNTs interface with the help of air voids and propagated all over the films which leads to full self-separation of FS-GaN substrate. Raman and photoluminescence spectra further reveal the stress relief and crystalline improvement of GaN with CSCNTs. It is expected that the efficient, low cost and mass-producible technique may enable new applications for CNTs in nitride optoelectronic fields. PMID:27340030

  17. Cross-stacked carbon nanotubes assisted self-separation of free-standing GaN substrates by hydride vapor phase epitaxy

    NASA Astrophysics Data System (ADS)

    Wei, Tongbo; Yang, Jiankun; Wei, Yang; Huo, Ziqiang; Ji, Xiaoli; Zhang, Yun; Wang, Junxi; Li, Jinmin; Fan, Shoushan

    2016-06-01

    We report a novel method to fabricate high quality 2-inch freestanding GaN substrate grown on cross-stacked carbon nanotubes (CSCNTs) coated sapphire by hydride vapor phase epitaxy (HVPE). As nanoscale masks, these CSCNTs can help weaken the interface connection and release the compressive stress by forming voids during fast coalescence and also block the propagation of threading dislocations (TDs). During the cool-down process, thermal stress-induced cracks are initiated at the CSCNTs interface with the help of air voids and propagated all over the films which leads to full self-separation of FS-GaN substrate. Raman and photoluminescence spectra further reveal the stress relief and crystalline improvement of GaN with CSCNTs. It is expected that the efficient, low cost and mass-producible technique may enable new applications for CNTs in nitride optoelectronic fields.

  18. Producing high-quality slash pine seeds

    Treesearch

    James Barnett; Sue Varela

    2003-01-01

    Slash pine is a desirable species. It serves many purposes and is well adapted to poorly drained flatwoods and seasonally flooded areas along the lower Coastal Plain of the Southeastern US. The use of high-quality seeds has been shown to produce uniform seedlings for outplanting, which is key to silvicultural success along the Coastal Plain and elsewhere. We present...

  19. Erbium Doped GaN Lasers by Optical Pumping

    DTIC Science & Technology

    2016-07-13

    P.O. Box 12211 Research Triangle Park, NC 27709-2211 Er doped GaN, gain medium, high energy laser, optical pump REPORT DOCUMENTATION PAGE 11. SPONSOR...Nanophotonics Center, Texas Tech University Lubbock, TX 79409-3102 jingyu.lin@ttu.edu; hx.jiang@ttu.edu I. Summary of Progress High energy and...emerging technologies. The optical gain medium is the heart of a high energy laser (HEL) system. Comparing with the presently dominant gain material

  20. High internal quantum efficiency ultraviolet to green luminescence peaks from pseudomorphic m-plane Al{sub 1−x}In{sub x}N epilayers grown on a low defect density m-plane freestanding GaN substrate

    SciTech Connect

    Chichibu, S. F. Hazu, K.; Furusawa, K.; Ishikawa, Y.; Onuma, T.; Ohtomo, T.; Ikeda, H.; Fujito, K.

    2014-12-07

    Structural and optical qualities of half-a-μm-thick m-plane Al{sub 1−x}In{sub x}N epilayers grown by metalorganic vapor phase epitaxy were remarkably improved via coherent growth on a low defect density m-plane freestanding GaN substrate prepared by hydride vapor phase epitaxy. All the epilayers unexceptionally suffer from uniaxial or biaxial anisotropic in-plane stress. However, full-width at half-maximum values of the x-ray ω-rocking curves were nearly unchanged as the underlayer values being 80 ∼ 150 arc sec for (101{sup ¯}0) and (101{sup ¯}2) diffractions with both 〈0001〉 and 〈112{sup ¯}0〉 azimuths, as long as pseudomorphic structure was maintained. Such Al{sub 1−x}In{sub x}N epilayers commonly exhibited a broad but predominant luminescence peak in ultraviolet (x ≤ 0.14) to green (x = 0.30) wavelengths. Its equivalent value of the internal quantum efficiency at room temperature was as high as 67% for x = 0.14 and 44% for x = 0.30. Because its high-energy cutoff commonly converged with the bandgap energy, the emission peak is assigned to originate from the extended near-band-edge states with strong carrier localization.

  1. Mass transport, faceting and behavior of dislocations in GaN

    SciTech Connect

    Nitta, S.; Kashima, T.; Kariya, M.; Yukawa, Y.; Yamaguchi, S.; Amano, H.; Akasaki, I.

    2000-07-01

    The behavior of threading dislocations during mass transport of GaN was investigated in detail by transmission electron microscopy. Mass transport occurred at the surface. Therefore, growing species are supplied from the in-plane direction. The behavior of threading dislocations was found to be strongly affected by the mass transport process as well as the high crystallographic anisotropy of the surface energy of the facets particular to GaN.

  2. Electronic-grade GaN(0001)/Al{sub 2}O{sub 3}(0001) grown by reactive DC-magnetron sputter epitaxy using a liquid Ga target

    SciTech Connect

    Junaid, M.; Hsiao, C.-L.; Palisaitis, J.; Jensen, J.; Persson, P. O. A.; Hultman, L.; Birch, J.

    2011-04-04

    Electronic-grade GaN (0001) epilayers have been grown directly on Al{sub 2}O{sub 3} (0001) substrates by reactive direct-current-magnetron sputter epitaxy (MSE) using a liquid Ga sputtering target in an Ar/N{sub 2} atmosphere. The as-grown GaN epitaxial films exhibit low threading dislocation density on the order of {<=}10{sup 10} cm{sup -2} determined by transmission electron microscopy and modified Williamson-Hall plot. X-ray rocking curve shows narrow full-width at half maximum (FWHM) of 1054 arc sec of the 0002 reflection. A sharp 4 K photoluminescence peak at 3.474 eV with a FWHM of 6.3 meV is attributed to intrinsic GaN band edge emission. The high structural and optical qualities indicate that MSE-grown GaN epilayers can be used for fabricating high-performance devices without the need of any buffer layer.

  3. Size dictated thermal conductivity of GaN

    SciTech Connect

    Thomas Edwin Beechem; McDonald, Anthony E.; Fuller, Elliot James; Talin, Albert Alec; Rost, Christina M.; Maria, Jon -Paul; Gaskins, John T.; Hopkins, Patrick E.; Allerman, Andrew A.

    2016-04-01

    The thermal conductivity on n- and p-type doped gallium nitride (GaN) epilayers having thickness of 3-4 μm was investigated using time domain thermoreflectance (TDTR). Despite possessing carrier concentrations ranging across 3 decades (1015 – 1018 cm–3), n-type layers exhibit a nearly constant thermal conductivity of 180 W/mK. The thermal conductivity of p-type epilayers, in contrast, reduces from 160 to 110 W/mK with increased doping. These trends–and their overall reduction relative to bulk–are explained leveraging established scattering models where it is shown that size effects play a primary role in limiting thermal conductivity for layers even tens of microns thick. GaN device layers, even of pristine quality, will therefore exhibit thermal conductivities less than the bulk value of 240 W/mK owing to their finite thickness.

  4. LEDs on HVPE grown GaN substrates: Influence of macroscopic surface features

    NASA Astrophysics Data System (ADS)

    Rahman, SK. S.; Leute, R. A. R.; Wang, J.; Meisch, T.; Klein, M.; Scholz, F.; Koyama, K.; Ishii, M.; Takeda, H.

    2014-07-01

    We demonstrate the strong influence of GaN substrate surface morphology on optical properties and performance of light emitting devices grown on freestanding GaN. As-grown freestanding HVPE GaN substrates show excellent AFM RMS and XRD FWHM values over the whole area, but distinctive features were observed on the surface, such as macro-pits, hillocks and facets extending over several millimeters. Electroluminescence measurements reveal a strong correlation of the performance and peak emission wavelength of LEDs with each of these observed surface features. This results in multiple peaks and non-uniform optical output power for LEDs on as-grown freestanding GaN substrates. Removal of these surface features by chemical mechanical polishing results in highly uniform peak wavelength and improved output power over the whole wafer area.

  5. Droplet heteroepitaxy of zinc-blende vs. wurtzite GaN quantum dots

    NASA Astrophysics Data System (ADS)

    Reese, C.; Jeon, S.; Hill, T.; Jones, C.; Shusterman, S.; Yacoby, Y.; Clarke, R.; Deng, H.; Goldman, Rs

    We have developed a GaN droplet heteroepitaxy process based upon plasma-assisted molecular-beam epitaxy. Using various surface treatments and Ga deposition parameters, we have demonstrated polycrystalline, zinc-blende (ZB), and wurtzite (WZ) GaN quantum dots (QDs) on Si(001), r-Al2O3, Si(111), and c-GaN substrates. For the polar substrates (i.e. Si(111) and c-GaN), high-resolution transmission electron microscopy and coherent Bragg rod analysis reveals the formation of coherent WZ GaN QDs with nitridation-temperature-dependent sizes and densities. For the non-polar substrates (i.e. Si(001) and r-Al2O3) , QDs with strong near-band photoluminescence emission are observed and ZB GaN QD growth on Si(001) is demonstrated for the first time.

  6. [Compound Huang Gan delays chronic renal failure after 5/6 nephrectomy in rats].

    PubMed

    Xiao, Xiaoyan; Mo, Liqian; Song, Shaolian; Qin, Min; Yang, Xixiao

    2014-11-01

    To observe the effect of compound Huang Gan in delaying chronic renal failure in rats after 5/6 nephrectomy and explore the possible mechanisms. High-performance liquid chromatography was used to was used identify the components of compound Huang Gan extract. Rat models of 5/6 nephrectomy received a 12-week treatment with intragastric administration of Niaoduqing, Cozaar, or compound Huang Gan at low, moderate or high doses (n=10). After the treatments, the rats were sacrificed for detecting Scr, BUN, Ucr and 24h UPr , pathological examination of the renal tissues, and determination of FN, MCP-1, and ICAM-1 expression levels in the renal tissues using RT-PCR and immunohistochemistry. The major chemical components of compound Huang Gan extract included glycyrrhizin (0.61%), paeonol (1.2%), aloe emodin (0.72%), rhein (0.85%), emodin (0.87%), chrysophanol (0.79%) and physcion (0.8%). Treatment with compound Huang Gan at low, moderate and high doses significantly reduced Scr, BUN, Ucr , Ccr and 24 h UPr levels (P(P<0.05), improved interstitial fibrosis and glomerulosclerosis, and reduced FN and ICAM-1 expressions (P(P<0.05) in rats following nephrectomy. Compound Huang Gan can improve the renal function and lessen glomerulosclerosis and renal interstitial fibrosis to delay the progression of chronic renal failure in rat models of 5/6 nephrectomy.

  7. Abbreviated epitaxial growth mode (AGM) method for reducing cost and improving quality of LEDs and lasers

    DOEpatents

    Tansu, Nelson; Chan, Helen M; Vinci, Richard P; Ee, Yik-Khoon; Biser, Jeffrey

    2013-09-24

    The use of an abbreviated GaN growth mode on nano-patterned AGOG sapphire substrates, which utilizes a process of using 15 nm low temperature GaN buffer and bypassing etch-back and recovery processes during epitaxy, enables the growth of high-quality GaN template on nano-patterned AGOG sapphire. The GaN template grown on nano-patterned AGOG sapphire by employing abbreviated growth mode has two orders of magnitude lower threading dislocation density than that of conventional GaN template grown on planar sapphire. The use of abbreviated growth mode also leads to significant reduction in cost of the epitaxy. The growths and characteristics of InGaN quantum wells (QWs) light emitting diodes (LEDs) on both templates were compared. The InGaN QWs LEDs grown on the nano-patterned AGOG sapphire demonstrated at least a 24% enhancement of output power enhancement over that of LEDs grown on conventional GaN templates.

  8. Growth and Characterization of Single Crystalline InN Grown on GaN by RF Sputtering for Robust Schottky Contacts

    NASA Astrophysics Data System (ADS)

    Harotoonian, Vache; Woodall, Jerry M.

    2016-12-01

    High-quality, single crystal wurtzite InN films were fabricated by radio-frequency magnetron reactive sputtering on GaN templates. The sputtered InN films in this study were about 100 nm thick. Atomic force microscopy analysis revealed the sputtered InN film had root-mean-square surface roughness of about 0.4 nm, which is comparable to the underlying GaN template. Coupled x-ray diffraction (XRD) measurements confirmed the (0001) preferred growth orientation and ω-rocking curve full-width-half-maximum (FWHM) = 0.85° for the symmetrical (0002) diffraction peak. The present InN film has the best crystal quality in terms of narrower FWHM of XRD rocking curve among reported sputtered InN thin films. In-plane and out-of-plane XRD measurements revealed a relaxed film. Room temperature Hall Effect measurements showed mobility of 110 cm2/V.s and electron concentration of 1-2 × 1020/cm3. The feasibility of utilizing a cost effective and productive method of sputtering to form robust Schottky contacts to GaN using InN, an immiscible and metallic-like semiconductor, was explored.

  9. Thermoelectric Properties of MOVPE Grown AlInN, Lattice-Matched to GaN

    NASA Astrophysics Data System (ADS)

    Zhang, Jing; Tong, Hua; Liu, Guangyu; Herbsommer, Juan; Huang, Gensheng; Tansu, Nelson

    2010-03-01

    In this work, we investigate experimentally the growth and thermoelectric properties, i.e., thermal conductivity, Seebeck coefficient, and electrical conductivity, of n-type wurtzite high quality AlxIn1-xN, grown on GaN template on sapphire substrate by MOVPE, in-plane lattice-matched to GaN. The thermal conductivity is measured by 3φ method differential technique for thin films. The thermal conductivity value of Al0.83In0.17N is measured as 5.7 W/(mK). The Seebeck coefficient is calculated as the ratio of measured voltage difference and temperature difference when a temperature gradient is created in the sample. The absolute Seebeck coefficient value of Al0.83In0.17N is measured as 6.2x10-4 V/K. The sheet resistivity of lattice-matched Al0.83In0.17N is measured using Van der Pauw scheme and the electric conductivity is acquired accordingly to be 2.9x10^4 /(φ.m). The Z*T value of Al0.83In0.17N obtained is above 0.2 at room temperature. The results indicate AlInN based alloys are good candidates for thermoelectric devices.

  10. Low temperature homoepitaxy of GaN structures by Vapor Liquid Solid transport

    NASA Astrophysics Data System (ADS)

    Jaud, Alexandre; Auvray, Laurent; Kahouli, Abdelkarim; Abi-Tannous, Tony; Linas, Sébastien; Ferro, Gabriel; Brylinski, Christian

    2017-06-01

    Low temperature (500-800 °C) homoepitaxy of not intentionally doped GaN structures on GaN(0 0 0 1)/Si(1 1 1) seed has been investigated by Vapor-Liquid-Solid (VLS) approach. The growth sequence consists in the metalorganic chemical vapor deposition of a network of submicrometric liquid Ga droplets, followed by their nitridation under flowing ammonia diluted either in H2 or Ar. When nitridation is performed under Ar carrier gas, GaN growth is very difficult to control due to too high N supersaturation within the droplets, despite very low NH3 flows. Nucleation and growth at the droplets periphery are always favored and, in most cases, high growth rates induce a crust-like growth, forming hollow GaN gangues. The use of H2 as carrier gas is detrimental to GaN (seed and grown material) stability, for nitridation temperatures ≥700 °C. But, compared to Ar atmosphere, a pronounced decrease of N supersaturation is demonstrated, allowing a better control of the growth mode. This is probably a consequence of a lower thermal decomposition efficiency of NH3 at the droplets surface. Optimal growth conditions are found at relatively low temperature (600 °C) and NH3 flow (20 sccm) for which a network of well-separated and faceted epitaxial GaN dots or rings is obtained. The growth mechanisms allowing these results are discussed.

  11. Carbon nanotube assisted Lift off of GaN layers on sapphire

    NASA Astrophysics Data System (ADS)

    Long, Hao; Feng, Xiaohui; Wei, Yang; Yu, Tongjun; Fan, Shoushan; Ying, Leiying; Zhang, Baoping

    2017-02-01

    Laser lift off (LLO) was one of the most essential processes in fabrication of vertical GaN-based LEDs. However, traditional laser lift off of GaN on sapphire substrates needed high laser energy threshold, which deteriorated the GaN crystal. In this paper, it was found that inserting carbon nanotube between GaN and sapphire could effectively reduce the laser energy threshold in GaN LLO, from 1.5 J /cm2 of conventional GaN/sapphire to 1.3 J /cm2 of CNT inserted GaN/sapphire. The temperature distributions at the GaN/sapphire interfaces with and without CNTs were simulated by the finite elements calculation under laser irradiation. It was found that, due to the higher laser absorption coefficient of CNT, the CNT played as a powerful heating wire, sending out the thermal outside to elevate the GaN's temperature, and thus reduce the laser threshold for LLO. Raman and photoluminescence measurements indicated that residual stress of GaN membranes was as small as 0.3 GPa by the carbon nanotube assisted LLO. This work not only opens new application of CNTs, but also demonstrates the potential of high performance blue and green LEDs.

  12. Uniform GaN thin films grown on (100) silicon by remote plasma atomic layer deposition

    NASA Astrophysics Data System (ADS)

    Shih, Huan-Yu; Lin, Ming-Chih; Chen, Liang-Yih; Chen, Miin-Jang

    2015-01-01

    The growth of uniform gallium nitride (GaN) thin films was reported on (100) Si substrate by remote plasma atomic layer deposition (RP-ALD) using triethylgallium (TEG) and NH3 as the precursors. The self-limiting growth of GaN was manifested by the saturation of the deposition rate with the doses of TEG and NH3. The increase in the growth temperature leads to the rise of nitrogen content and improved crystallinity of GaN thin films, from amorphous at a low deposition temperature of 200 °C to polycrystalline hexagonal structures at a high growth temperature of 500 °C. No melting-back etching was observed at the GaN/Si interface. The excellent uniformity and almost atomic flat surface of the GaN thin films also infer the surface control mode of the GaN thin films grown by the RP-ALD technique. The GaN thin films grown by RP-ALD will be further applied in the light-emitting diodes and high electron mobility transistors on (100) Si substrate.

  13. Influence of Annealing Conditions on Dopant Antirotation of Si+ and Mg+ Implanted GaN

    SciTech Connect

    Suvkhanov, A.; Parikh, N.; Usov, I.; Hunn, J.D.; Withrow, S.; Thomson, D.; Herke, T.; Davis, R.F.; Krasnobaev, L.

    1999-10-12

    This report reflects the results of heat treatment under various conditions on as-grown and ion implanted GaN. The PL spectrums of as-grown GaN and GaN with 400 A AlN cap were almost identical. This fact allows one to use PL analysis without AlN stripping. As-grown GaN and ion implanted with Mg and Si crystals were annealed at 1300 C for 10 minutes in three different conditions: in flowing argon gas; in flowing ultra high purity nitrogen; and in a quartz capsule sealed with nitrogen gas. The results of PL, RBS, SEM and TEM analysis show an advantage of GaN high temperature annealing in quartz capsules with nitrogen ambient as compared to annealing in argon and nitrogen gas flow. Encapsulation with nitrogen over-pressure prevents the decomposition of the GaN crystal and the AlN capping film, and allows one to achieve optical activation of implanted Mg and Si after 1300 C annealing.

  14. Decreased sleep quality in high myopia children

    PubMed Central

    Ayaki, Masahiko; Torii, Hidemasa; Tsubota, Kazuo; Negishi, Kazuno

    2016-01-01

    The aim of the present study was to evaluate sleep quality in myopic children and adults. This cross sectional study surveyed 486 participants aged from 10 to 59 years with refractive errors using a questionnaire containing the Pittsburgh Sleep Quality Index (PSQI) and Hospital Anxiety and Depression Scale (HADS). Children (< 20 years) in the high myopia group exhibited the poorest PSQI scores (P < 0.01), while the adults showed no such correlations. Subscales of PSQI and HADS in children disclosed that the high myopia groups had the shortest sleep duration (P < 0.01), worst subjective sleep scores (P < 0.001), and latest bedtime (P < 0.05). Regression analyses in children significantly correlated myopic errors with PSQI (P < 0.05), sleep duration (P < 0.01), and bedtime (P < 0.01). Sleep efficacy (P < 0.05) and daytime dysfunction (P < 0.05) were significantly better in contact-lens users compared to the respective non-user groups across all participants. In conclusion, sleep quality in children was significantly correlated with myopic error, with the high myopia group worst affected. PMID:27650408

  15. Room-Temperature Transport of Indirect Excitons in (Al ,Ga )N /GaN Quantum Wells

    NASA Astrophysics Data System (ADS)

    Fedichkin, F.; Guillet, T.; Valvin, P.; Jouault, B.; Brimont, C.; Bretagnon, T.; Lahourcade, L.; Grandjean, N.; Lefebvre, P.; Vladimirova, M.

    2016-07-01

    We report on the exciton propagation in polar (Al ,Ga )N /GaN quantum wells over several micrometers and up to room temperature. The key ingredient to achieve this result is the crystalline quality of GaN quantum wells grown on GaN substrate that limits nonradiative recombination. From the comparison of the spatial and temporal dynamics of photoluminescence, we conclude that the propagation of excitons under continuous-wave excitation is assisted by efficient screening of the in-plane disorder. Modeling within drift-diffusion formalism corroborates this conclusion and suggests that exciton propagation is still limited by the exciton scattering on defects rather than by exciton-exciton scattering so that improving interface quality can boost exciton transport further. Our results pave the way towards room-temperature excitonic devices based on gate-controlled exciton transport in wide-band-gap polar heterostructures.

  16. Photoluminescence characterization of Mg implanted GaN

    SciTech Connect

    Ronning, C.; Hofsaess, H.; Stoetzler, A.; Deicher, M.; Carlson, E.P.; Hartlieb, P.J.; Gehrke, T.; Rajagopal, P.; Davis, R.F.

    2000-07-01

    Single crystalline (0001) gallium nitride layers, capped with a thin epitaxial aluminum nitride layer, were implanted with magnesium and subsequently annealed in vacuum to 1150--1300 C for 10--60 minutes. Photoluminescence (PL) measurements showed the typical donor acceptor pair (DAP) transition at 3.25 eV after annealing at high temperatures, which is related to optically active Mg acceptors in GaN. After annealing at 1300 C a high degree of optical activation of the implanted Mg atoms was reached in the case of low implantation doses. Electrical measurements, performed after removing the AlN-cap and the deposition of Pd/Au contacts, showed no p-type behavior of the GaN samples due to the compensation of the Mg acceptors with native n-type defects.

  17. Fe-doped semi-insulating GaN with solid Fe source grown on (110) Si substrates by NH3 molecular beam epitaxy

    NASA Astrophysics Data System (ADS)

    Noh, Young Kyun; Lee, Sang Tae; Kim, Moon Deock; Oh, Jae Eung

    2017-02-01

    Iron doped GaN layers were grown on (110) Si substrates by ammonia molecular beam epitaxy (MBE) using solid elemental iron as a source. Specular films with concentrations up to 1×1020 cm-3, as determined by secondary ion mass spectroscopy, were grown, unlike a limited incorporation of Fe into GaN by metal-rich rf plasma MBE. The Fe concentration in the film showed an exponential dependence on the inverse of source temperature with an activation energy of 3.4 eV, which agrees well to the reported value for the sublimation of Fe. A 1.5 μm thick GaN film with a sheet resistance of 1 GΩ/sq. was obtained by compensating unintentional residual donors with a small Fe concentration of 1×1017 cm-3. X-ray diffraction rocking curves indicated high crystalline quality, very similar to an undoped film, showing that the Fe incorporation required to obtain the semi-insulating film properties did not affect the structural properties of the film. The low-temperature PL spectra of highly resistive and semi-insulating Fe:GaN in the range of 1017 1018 cm-3 show dominant exciton emissions and enhanced donor-acceptor-pair (DAP) emissions, implying that Fe ions contribute to the DAP transition between donor levels and Fe-related acceptor levels, possibly compensating the residual donors to achieve the semi-insulating electrical properties.

  18. Structural and morphological properties of GaN buffer layers grown by ammonia molecular beam epitaxy on SiC substrates for AlGaN/GaN high electron mobility transistors

    SciTech Connect

    Corrion, A. L.; Poblenz, C.; Wu, F.; Speck, J. S.

    2008-05-01

    The impact of growth conditions on the surface morphology and structural properties of ammonia molecular beam epitaxy GaN buffers layers on SiC substrates was investigated. The threading dislocation (TD) density was found to decrease with decreasing NH{sub 3}:Ga flux ratio, which corresponded to an increase in surface roughness and reduction in residual compressive lattice mismatch stress. Furthermore, the dislocation density and compressive stress decreased for increasing buffer thickness. TD inclination was proposed to account for these observations. Optimized surface morphologies were realized at high NH{sub 3}:Ga flux ratios and were characterized by monolayer-high steps, spiral hillocks, and pyramidal mounds, with rms roughness of {approx}1.0 nm over 2x2 {mu}m{sup 2} atomic force microscopy images. Smooth surface morphologies were realized over a large range of growth temperatures and fluxes, and growth rates of up to 1 {mu}m/h were achieved. TD densities in the buffers as low as 3x10{sup 9} cm{sup -2} were demonstrated. These buffers were highly insulating and were used in recently reported AlGaN/GaN HEMTs with power densities of >11 W/mm at 4 and 10 GHz.

  19. High quality factor indium oxide mechanical microresonators

    SciTech Connect

    Bartolomé, Javier Cremades, Ana; Piqueras, Javier

    2015-11-09

    The mechanical resonance behavior of as-grown In{sub 2}O{sub 3} microrods has been studied in this work by in-situ scanning electron microscopy (SEM) electrically induced mechanical oscillations. Indium oxide microrods grown by a vapor–solid method are naturally clamped to an aluminum oxide ceramic substrate, showing a high quality factor due to reduced energy losses during mechanical vibrations. Quality factors of more than 10{sup 5} and minimum detectable forces of the order of 10{sup −16} N/Hz{sup 1/2} demonstrate their potential as mechanical microresonators for real applications. Measurements at low-vacuum using the SEM environmental operation mode were performed to study the effect of extrinsic damping on the resonators behavior. The damping coefficient has been determined as a function of pressure.

  20. Zn-dopant dependent defect evolution in GaN nanowires

    NASA Astrophysics Data System (ADS)

    Yang, Bing; Liu, Baodan; Wang, Yujia; Zhuang, Hao; Liu, Qingyun; Yuan, Fang; Jiang, Xin

    2015-10-01

    Zn doped GaN nanowires with different doping levels (0, <1 at%, and 3-5 at%) have been synthesized through a chemical vapor deposition (CVD) process. The effect of Zn doping on the defect evolution, including stacking fault, dislocation, twin boundary and phase boundary, has been systematically investigated by transmission electron microscopy and first-principles calculations. Undoped GaN nanowires show a hexagonal wurtzite (WZ) structure with good crystallinity. Several kinds of twin boundaries, including (101&cmb.macr;3), (101&cmb.macr;1) and (202&cmb.macr;1), as well as Type I stacking faults (...ABABC&cmb.b.line;BCB...), are observed in the nanowires. The increasing Zn doping level (<1 at%) induces the formation of screw dislocations featuring a predominant screw component along the radial direction of the GaN nanowires. At high Zn doping level (3-5 at%), meta-stable cubic zinc blende (ZB) domains are generated in the WZ GaN nanowires. The WZ/ZB phase boundary (...ABABAC&cmb.b.line;BA...) can be identified as Type II stacking faults. The density of stacking faults (both Type I and Type II) increases with increasing the Zn doping levels, which in turn leads to a rough-surface morphology in the GaN nanowires. First-principles calculations reveal that Zn doping will reduce the formation energy of both Type I and Type II stacking faults, favoring their nucleation in GaN nanowires. An understanding of the effect of Zn doping on the defect evolution provides an important method to control the microstructure and the electrical properties of p-type GaN nanowires.Zn doped GaN nanowires with different doping levels (0, <1 at%, and 3-5 at%) have been synthesized through a chemical vapor deposition (CVD) process. The effect of Zn doping on the defect evolution, including stacking fault, dislocation, twin boundary and phase boundary, has been systematically investigated by transmission electron microscopy and first-principles calculations. Undoped GaN nanowires show a

  1. Fabrication of WS2/GaN p-n Junction by Wafer-Scale WS2 Thin Film Transfer

    PubMed Central

    Yu, Yang; Fong, Patrick W. K.; Wang, Shifeng; Surya, Charles

    2016-01-01

    High quality wafer-scale free-standing WS2 grown by van der Waals rheotaxy (vdWR) using Ni as a texture promoting layer is reported. The microstructure of vdWR grown WS2 was significantly modified from mixture of crystallites with their c-axes both parallel to (type I) and perpendicular to (type II) the substrate to large type II crystallites. Wafer-scale transfer of vdWR grown WS2 onto different substrates by an etching-free technique was demonstrated for the first time that utilized the hydrophobic property of WS2 and hydrophilic property of sapphire. Our results show that vdWR is a reliable technique to obtain type-II textured crystallites in WS2, which is the key factor for the wafer-scale etching-free transfer. The transferred films were found to be free of observable wrinkles, cracks, or polymer residues. High quality p-n junctions fabricated by room-temperature transfer of the p-type WS2 onto an n-type GaN was demonstrated with a small leakage current density of 29.6 μA/cm2 at −1 V which shows superior performances compared to the directly grown WS2/GaN heterojunctions. PMID:27897210

  2. Fabrication of WS2/GaN p-n Junction by Wafer-Scale WS2 Thin Film Transfer

    NASA Astrophysics Data System (ADS)

    Yu, Yang; Fong, Patrick W. K.; Wang, Shifeng; Surya, Charles

    2016-11-01

    High quality wafer-scale free-standing WS2 grown by van der Waals rheotaxy (vdWR) using Ni as a texture promoting layer is reported. The microstructure of vdWR grown WS2 was significantly modified from mixture of crystallites with their c-axes both parallel to (type I) and perpendicular to (type II) the substrate to large type II crystallites. Wafer-scale transfer of vdWR grown WS2 onto different substrates by an etching-free technique was demonstrated for the first time that utilized the hydrophobic property of WS2 and hydrophilic property of sapphire. Our results show that vdWR is a reliable technique to obtain type-II textured crystallites in WS2, which is the key factor for the wafer-scale etching-free transfer. The transferred films were found to be free of observable wrinkles, cracks, or polymer residues. High quality p-n junctions fabricated by room-temperature transfer of the p-type WS2 onto an n-type GaN was demonstrated with a small leakage current density of 29.6 μA/cm2 at ‑1 V which shows superior performances compared to the directly grown WS2/GaN heterojunctions.

  3. Self-terminated etching of GaN with a high selectivity over AlGaN under inductively coupled Cl2/N2/O2 plasma with a low-energy ion bombardment

    NASA Astrophysics Data System (ADS)

    Zhong, Yaozong; Zhou, Yu; Gao, Hongwei; Dai, Shujun; He, Junlei; Feng, Meixin; Sun, Qian; Zhang, Jijun; Zhao, Yanfei; DingSun, An; Yang, Hui

    2017-10-01

    Etching of GaN/AlGaN heterostructure by O-containing inductively coupled Cl2/N2 plasma with a low-energy ion bombardment can be self-terminated at the surface of the AlGaN layer. The estimated etching rates of GaN and AlGaN were 42 and 0.6 nm/min, respectively, giving a selective etching ratio of 70:1. To study the mechanism of the etching self-termination, detailed characterization and analyses were carried out, including X-ray photoelectron spectroscopy (XPS) and time-of-flight secondary ion mass spectroscopy (TOF-SIMS). It was found that in the presence of oxygen, the top surface of the AlGaN layer was converted into a thin film of (Al,Ga)Ox with a high bonding energy, which effectively prevented the underlying atoms from a further etching, resulting in a nearly self-terminated etching. This technique enables a uniform and reproducible fabrication process for enhancement-mode high electron mobility transistors with a p-GaN gate.

  4. Quality indicators for high acuity pediatric conditions.

    PubMed

    Stang, Antonia S; Straus, Sharon E; Crotts, Jennifer; Johnson, David W; Guttmann, Astrid

    2013-10-01

    Identifying gaps in care and improving outcomes for severely ill children requires the development of evidence-based performance measures. We used a systematic process involving multiple stakeholders to identify and develop evidence-based quality indicators for high acuity pediatric conditions relevant to any emergency department (ED) setting where children are seen. A prioritized list of clinical conditions was selected by an advisory panel. A systematic review of the literature was conducted to identify existing indicators, as well as guidelines and evidence that could be used to inform the creation of new indicators. A multiphase, Rand-modified Delphi method consisting of anonymous questionnaires and a face-to-face meeting of an expert panel was used for indicator selection. Measure specifications and evidence grading were created for each indicator, and the feasibility and reliability of measurement was assessed in a tertiary care pediatric ED. The conditions selected for indicator development were diabetic ketoacidosis, status asthmaticus, anaphylaxis, status epilepticus, severe head injury, and sepsis. The majority of the 62 selected indicators reflect ED processes (84%) with few indicators reflecting structures (11%) or outcomes (5%). Thirty-seven percent (n = 23) of the selected indicators are based on moderate or high quality evidence. Data were available and interrater reliability acceptable for the majority of indicators. A systematic process involving multiple stakeholders was used to develop evidence-based quality indicators for high acuity pediatric conditions. Future work will test the reliability and feasibility of data collection on these indicators across the spectrum of ED settings that provide care for children.

  5. Production of high quality hydrographic data

    NASA Astrophysics Data System (ADS)

    Charo, M.; Piola, A. R.

    2016-02-01

    The ocean is the dominant reservoir of heat and carbon in the climate system on time scales from years to centuries. Thus, historical ocean observations are essential to understand the processes that control the variability in environmental conditions and climate on these time scales. High quality observations are essential to address both regional and global problems. Because environmental changes involve a wide range of spatial and temporal scales, and given the high cost of oceanographic surveys, calibration protocols and widely documented procedures are necessary to ensure the highest possible data quality and to preserve the information for future use. Vertical quasi-continuous conductivity-temperature-depth (CTD) profiles have become the backbone of ocean hydrographic observations. Factory CTD sensor calibrations are not always easy to carry out. Especially in these cases, in situ discrete bottle data are of crucial importance as complementary information of the water column for the analysis of vertical changes in highly variable temperature-salinity structures. This work will address CTD data processing steps and describe the laboratory and field calibrations and the associated documentation required for future users.

  6. Steady-state and time-resolved photoluminescence from relaxed and strained GaN nanowires grown by catalyst-free molecular-beam epitaxy

    SciTech Connect

    Schlager, John B.; Bertness, Kris A.; Blanchard, Paul T.; Robins, Lawrence H.; Roshko, Alexana; Sanford, Norman A.

    2008-06-15

    We report steady-state and time-resolved photoluminescence (TRPL) measurements on individual GaN nanowires (6-20 {mu}m in length, 30-940 nm in diameter) grown by a nitrogen-plasma-assisted, catalyst-free molecular-beam epitaxy on Si(111) and dispersed onto fused quartz substrates. Induced tensile strain for nanowires bonded to fused silica and compressive strain for nanowires coated with atomic-layer-deposition alumina led to redshifts and blueshifts of the dominant steady-state PL emission peak, respectively. Unperturbed nanowires exhibited spectra associated with high-quality, strain-free material. The TRPL lifetimes, which were similar for both relaxed and strained nanowires of similar size, ranged from 200 ps to over 2 ns, compared well with those of low-defect bulk GaN, and depended linearly on nanowire diameter. The diameter-dependent lifetimes yielded a room-temperature surface recombination velocity S of 9x10{sup 3} cm/s for our silicon-doped GaN nanowires.

  7. Steady-state and time-resolved photoluminescence from relaxed and strained GaN nanowires grown by catalyst-free molecular-beam epitaxy

    NASA Astrophysics Data System (ADS)

    Schlager, John B.; Bertness, Kris A.; Blanchard, Paul T.; Robins, Lawrence H.; Roshko, Alexana; Sanford, Norman A.

    2008-06-01

    We report steady-state and time-resolved photoluminescence (TRPL) measurements on individual GaN nanowires (6-20 μm in length, 30-940 nm in diameter) grown by a nitrogen-plasma-assisted, catalyst-free molecular-beam epitaxy on Si(111) and dispersed onto fused quartz substrates. Induced tensile strain for nanowires bonded to fused silica and compressive strain for nanowires coated with atomic-layer-deposition alumina led to redshifts and blueshifts of the dominant steady-state PL emission peak, respectively. Unperturbed nanowires exhibited spectra associated with high-quality, strain-free material. The TRPL lifetimes, which were similar for both relaxed and strained nanowires of similar size, ranged from 200 ps to over 2 ns, compared well with those of low-defect bulk GaN, and depended linearly on nanowire diameter. The diameter-dependent lifetimes yielded a room-temperature surface recombination velocity S of 9×103 cm/s for our silicon-doped GaN nanowires.

  8. Synchrotron radiation x-ray topography and defect selective etching analysis of threading dislocations in GaN

    SciTech Connect

    Sintonen, Sakari Suihkonen, Sami; Jussila, Henri; Tuomi, Turkka O.; Lipsanen, Harri; Rudziński, Mariusz; Knetzger, Michael; Meissner, Elke; Danilewsky, Andreas

    2014-08-28

    The crystal quality of bulk GaN crystals is continuously improving due to advances in GaN growth techniques. Defect characterization of the GaN substrates by conventional methods is impeded by the very low dislocation density and a large scale defect analysis method is needed. White beam synchrotron radiation x-ray topography (SR-XRT) is a rapid and non-destructive technique for dislocation analysis on a large scale. In this study, the defect structure of an ammonothermal c-plane GaN substrate was recorded using SR-XRT and the image contrast caused by the dislocation induced microstrain was simulated. The simulations and experimental observations agree excellently and the SR-XRT image contrasts of mixed and screw dislocations were determined. Apart from a few exceptions, defect selective etching measurements were shown to correspond one to one with the SR-XRT results.

  9. Si Complies with GaN to Overcome Thermal Mismatches for the Heteroepitaxy of Thick GaN on Si.

    PubMed

    Tanaka, Atsunori; Choi, Woojin; Chen, Renjie; Dayeh, Shadi A

    2017-08-21

    Heteroepitaxial growth of lattice mismatched materials has advanced through the epitaxy of thin coherently strained layers, the strain sharing in virtual and nanoscale substrates, and the growth of thick films with intermediate strain-relaxed buffer layers. However, the thermal mismatch is not completely resolved in highly mismatched systems such as in GaN-on-Si. Here, geometrical effects and surface faceting to dilate thermal stresses at the surface of selectively grown epitaxial GaN layers on Si are exploited. The growth of thick (19 µm), crack-free, and pure GaN layers on Si with the lowest threading dislocation density of 1.1 × 10(7) cm(-2) achieved to date in GaN-on-Si is demonstrated. With these advances, the first vertical GaN metal-insulator-semiconductor field-effect transistors on Si substrates with low leakage currents and high on/off ratios paving the way for a cost-effective high power device paradigm on an Si CMOS platform are demonstrated. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  10. Estimation of free carrier concentrations in high-quality heavily doped GaN:Si micro-rods by photoluminescence and Raman spectroscopy

    NASA Astrophysics Data System (ADS)

    Mohajerani, M. S.; Khachadorian, S.; Nenstiel, C.; Schimpke, T.; Avramescu, A.; Strassburg, M.; Hoffmann, A.; Waag, A.

    2016-03-01

    The controlled growth of highly n-doped GaN micro rods is one of the major challenges in the fabrication of recently developed three-dimensional (3D) core-shell light emitting diodes (LEDs). In such structures with a large active area, higher electrical conductivity is needed to achieve higher current density. In this contribution, we introduce high quality heavily-doped GaN:Si micro-rods which are key elements of the newly developed 3D core-shell LEDs. These structures were grown by metal-organic vapor phase epitaxy (MOVPE) using selective area growth (SAG). We employed spatially resolved micro-Raman and micro-photoluminescence (PL) in order to directly determine a free-carrier concentration profile in individual GaN micro-rods. By Raman spectroscopy, we analyze the low-frequency branch of the longitudinal optical (LO)-phonon-plasmon coupled modes and estimate free carrier concentrations from ≍ 2.4 × 1019 cm-3 up to ≍ 1.5 × 1020 cm-3. Furthermore, free carrier concentrations are determined by estimating Fermi energy level from the near band edge emission measured by low-temperature PL. The results from both methods reveal a good consistency.

  11. Transport properties, specific heat and thermal conductivity of GaN nanocrystalline ceramic

    SciTech Connect

    Sulkowski, Czeslaw; ChuchmaLa, Andrzej; Zaleski, Andrzej J.; Matusiak, Marcin; Mucha, Jan; GLuchowski, PaweL; Strek, WiesLaw

    2010-10-15

    The structural and transport properties (resistivity, thermopower and Hall effect), specific heat and thermal conductivity have been measured for GaN nanocrystalline ceramic prepared by hot pressing. It was found that the temperature dependence of resistivity in temperature range 10-300 K shows the very low activation energy, which is ascribed to the shallow donor doping originating in amorphous phase of sample. The major charge carriers are electrons, what is indicated by negative sign of Hall constant and Seebeck coefficient. The thermopower attains large values (-58 {mu}V/K at 300 K) and was characterized by linear temperature dependence which suggests the diffusion as a major contribution to Seebeck effect. The high electron concentration of 1.3x10{sup 19} cm{sup -3} and high electronic specific heat coefficient determined to be 2.4 mJ/molK{sup 2} allow to conclude that GaN ceramic demonstrates the semimetallic-like behavior accompanied by very small mobility of electrons ({approx}0.1 cm{sup 2}/V s) which is responsible for its high resistivity. A low heat conductivity of GaN ceramics is associated with partial amorphous phase of GaN grains due to high pressure sintering. - Graphical Abstract: Thermal resistivity and thermopower measurements indicates the high phonon scattering and lack of phonon-drag contribution to thermopower in GaN nanoceramics pressed under 4 GPa at 800 {sup o}C.

  12. Highly reliable Ti-based ohmic contact to N-polar n-type GaN for vertical-geometry light-emitting diodes by using a Ta barrier layer.

    PubMed

    Park, Jae-Seong; Han, Jaecheon; Seong, Tae-Yeon

    2014-05-05

    The formation of thermally stable and low resistance Ti/Al-based ohmic contacts to N-polar n-GaN for high-power vertical light-emitting diodes (VLEDs) using a Ta diffusion barrier is presented. Before annealing, both Ti/Al/Au and Ti/Ta/Al/Au contacts reveal ohmic behavior with specific contact resistances of 2.4 × 10⁻⁴ and 1.2 × 10⁻⁴ Ωcm², respectively. However, unlike the Ti/Al/Au samples that are electrically degraded with increasing annealing time at 250 °C, the Ti/Ta/Al/Au samples remain thermally stable even after annealing for 600 min. LEDs fabricated with the Ti/Ta/Al/Au contacts yield 8.3% higher output power (at 300 mA) than LEDs with the Ti/Al/Au contact. X-ray photoemission spectroscopy results show that the Ta layer serves as an efficient barrier to the indiffusion of oxygen toward the GaN. On the basis of the XPS and electrical results, the annealing dependence of the electrical characteristics of Ti/Al-based contacts are described and discussed.

  13. Simulation of optimum parameters for GaN MSM UV photodetector

    SciTech Connect

    Alhelfi, Mohanad A. Ahmed, Naser M. Hashim, M. R. Hassan, Z.; Al-Rawi, Ali Amer

    2016-07-06

    In this study the optimum parameters of GaN M-S-M photodetector are discussed. The evaluation of the photodetector depends on many parameters, the most of the important parameters the quality of the GaN film and others depend on the geometry of the interdigited electrode. In this simulation work using MATLAB software with consideration of the reflection and absorption on the metal contacts, a detailed study involving various electrode spacings (S) and widths (W) reveals conclusive results in device design. The optimum interelectrode design for interdigitated MSM-PD has been specified and evaluated by effect on quantum efficiency and responsivity.

  14. Injection Laser Using Rare Earth Doped GaN Thin Films for Visible and Infrared Applications

    DTIC Science & Technology

    2010-05-01

    was firstly synthesized in 1937[3, 4]. In 1959 small GaN crystals was synthesized by hot gallium metals in ammonia gas ambient condition.[5] GaN...energy of 3.39eV and electron concentration above 1019cm-3. In 1971, Manasevit[7] utilized metal -organic chemical vapor deposition (MOCVD) to grow...quality of GaN thin films were obtained in 1986 by Amano and Akasaki[9] with the optimized “two-step growth” method in metal -organic vapor phase

  15. Simulation of optimum parameters for GaN MSM UV photodetector

    NASA Astrophysics Data System (ADS)

    Alhelfi, Mohanad A.; Ahmed, Naser M.; Hashim, M. R.; Al-Rawi, Ali Amer; Hassan, Z.

    2016-07-01

    In this study the optimum parameters of GaN M-S-M photodetector are discussed. The evaluation of the photodetector depends on many parameters, the most of the important parameters the quality of the GaN film and others depend on the geometry of the interdigited electrode. In this simulation work using MATLAB software with consideration of the reflection and absorption on the metal contacts, a detailed study involving various electrode spacings (S) and widths (W) reveals conclusive results in device design. The optimum interelectrode design for interdigitated MSM-PD has been specified and evaluated by effect on quantum efficiency and responsivity.

  16. [Quality management is associated with high quality services in health care].

    PubMed

    Nielsen, Tenna Hassert; Riis, Allan; Mainz, Jan; Jensen, Anne-Louise Degn

    2013-12-09

    In these years, quality management has been the focus in order to meet high quality services for the patients in Danish health care. This article provides information on quality management and quality improvement and it evaluates its effectiveness in achieving better organizational structures, processes and results in Danish health-care organizations. Our findings generally support that quality management is associated with high quality services in health care.

  17. GalaxyGAN: Generative Adversarial Networks for recovery of galaxy features

    NASA Astrophysics Data System (ADS)

    Schawinski, Kevin; Zhang, Ce; Zhang, Hantian; Fowler, Lucas; Krishnan Santhanam, Gokula

    2017-02-01

    GalaxyGAN uses Generative Adversarial Networks to reliably recover features in images of galaxies. The package uses machine learning to train on higher quality data and learns to recover detailed features such as galaxy morphology by effectively building priors. This method opens up the possibility of recovering more information from existing and future imaging data.

  18. Lattice-matched HfN buffer layers for epitaxy of GaN on Si

    SciTech Connect

    Armitage, Robert; Yang, Qing; Feick, Henning; Gebauer, Joerg; Weber, Eicke R.; Shinkai, Satoko; Sasaki, Katsutaka

    2002-05-08

    Gallium nitride is grown by plasma-assisted molecular-beam epitaxy on (111) and (001) silicon substrates using sputter-deposited hafnium nitride buffer layers. Wurtzite GaN epitaxial layers are obtained on both the (111) and (001) HfN/Si surfaces, with crack-free thickness up to 1.2 (mu)m. Initial results for GaN grown on the (111) surface show a photoluminescence peak width of 17 meV at 11 K, and an asymmetric x-ray rocking curve width of 20 arcmin. Wurtzite GaN on HfN/Si(001) shows reduced structural quality and peculiar low-temperature luminescence features. However, growth on the (001) surface results in nearly stress-free films, suggesting that much thicker crack-free layers could be obtained.

  19. Gallium desorption kinetics on (0001) GaN surface during the growth of GaN by molecular-beam epitaxy

    SciTech Connect

    He, L.; Moon, Y.T.; Xie, J.; Munoz, M.; Johnstone, D.; Morkoc, H.

    2006-02-13

    Gallium (Ga) surface desorption behavior was investigated using reflection high-energy electron diffraction during the GaN growth. It was found that the desorption of Ga atoms from the (0001) GaN surfaces under different III-V ratio dependents on the coverage of adsorbed atoms. Doing so led to desorption energies of 2.76 eV for Ga droplets, 1.24-1.89 eV for Ga under Ga-rich growth conditions, and 0.82 eV - 0.94 eV for Ga under stoichiometric growth conditions. Moreover, the variation of the GaN surface morphology under different III-V ratios on porous templates supports the conclusion that Ga desorption energy depends on the coverage, and the III/V ratio dominates the growth mode.

  20. Epitaxially-Grown GaN Junction Field Effect Transistors

    SciTech Connect

    Baca, A.G.; Chang, P.C.; Denbaars, S.P.; Lester, L.F.; Mishra, U.K.; Shul, R.J.; Willison, C.G.; Zhang, L.; Zolper, J.C.

    1999-05-19

    Junction field effect transistors (JFET) are fabricated on a GaN epitaxial structure grown by metal organic chemical vapor deposition (MOCVD). The DC and microwave characteristics of the device are presented. A junction breakdown voltage of 56 V is obtained corresponding to the theoretical limit of the breakdown field in GaN for the doping levels used. A maximum extrinsic transconductance (gm) of 48 mS/mm and a maximum source-drain current of 270 mA/mm are achieved on a 0.8 µ m gate JFET device at VGS= 1 V and VDS=15 V. The intrinsic transconductance, calculated from the measured gm and the source series resistance, is 81 mS/mm. The fT and fmax for these devices are 6 GHz and 12 GHz, respectively. These JFETs exhibit a significant current reduction after a high drain bias is applied, which is attributed to a partially depleted channel caused by trapped hot-electrons in the semi-insulating GaN buffer layer. A theoretical model describing the current collapse is described, and an estimate for the length of the trapped electron region is given.

  1. Theoretical investigation of GaN carbon doped

    NASA Astrophysics Data System (ADS)

    Espitia Rico, M. J.; Moreno Armenta, M. G.; Rodríguez, J. A.; Takeuchi, N.

    2016-02-01

    In this work we used first principles calculations in the frame of density functional theory (DFT) in order to study the structural and electronic properties of GaN doped with carbon. The computational calculations were carried out by a method based on plane waves pseudopotentials, as implemented in the Quantum Espresso code. In the wurtzite type GaN supercell the nitrogen atoms were replaced by carbon atoms (C by N) and then also the gallium atoms by carbon atoms (C by Ga). The carbon concentrations in the GaN volume was set as x=25, 50 y 75%. For each concentration x of carbon the formation energy was calculated for the substitutions C by N and CxGa. We found that it is more energetically favourable that the carbon atoms occupy the positions of the nitrogen atoms (C by N), because in all the x concentrations of carbon the formation energies were lower than that in the substitutions (C by Ga). It was found that the new compounds CxGaN1-x have higher bulk moduli. So they are very rigid. This property makes them good candidates for applications in hard coatings or devices for high power and temperatures. Analysis of the density of states show that the new CxGaN1-x ternary compound have metallic behaviour that comes essentially from the hybridization states N-p and C-p cross the Fermi level.

  2. Study of neutron irradiated structures of ammonothermal GaN

    NASA Astrophysics Data System (ADS)

    Gaubas, E.; Ceponis, T.; Deveikis, L.; Meskauskaite, D.; Miasojedovas, S.; Mickevicius, J.; Pavlov, J.; Pukas, K.; Vaitkus, J.; Velicka, M.; Zajac, M.; Kucharski, R.

    2017-04-01

    Study of the radiation damage in GaN-based materials becomes an important aspect for possible application of the GaN detectors in the harsh radiation environment at the Large Hadron Collider and at other particle acceleration facilities. Intentionally doped and semi-insulating bulk ammonothermal GaN materials were studied to reveal the dominant defects introduced by reactor neutron irradiations. These radiation defects have been identified by combining electron spin resonance and transmission spectroscopy techniques. Characteristics of carrier lifetime dependence on neutron irradiation fluence were examined. Variations of the response of the capacitor-type sensors with neutron irradiation fluence have been correlated with the carrier lifetime changes. The measurements of the photoconductivity and photoluminescence transients have been used to study the variation of the parameters of radiative and non-radiative recombination. The examined characteristics indicate that AT GaN as a particle sensing material is radiation hard up to high hadron fluences  ⩾1016 cm‑2.

  3. Nucleation conditions for catalyst-free GaN nanowires

    NASA Astrophysics Data System (ADS)

    Bertness, K. A.; Roshko, A.; Mansfield, L. M.; Harvey, T. E.; Sanford, N. A.

    2007-03-01

    We have examined the initial steps for catalyst-free growth of GaN nanowires by molecular beam epitaxy (MBE) on Si (1 1 1) substrates using AlN buffer layers. These wires form spontaneously under high N-to-Ga ratios for a growth temperature range of about 810-830 °C. Field emission scanning electron microscopy (FESEM) shows that part of the GaN forms a "matrix layer" that also grows with the [0 0 0 1] direction perpendicular to the substrate surface. This layer contains small, dense hexagonal pits in which the nanowires nucleate. Using both FESEM and atomic force microscopy (AFM), we identify the pit facets as {1 0 1¯ 2} planes. The nucleation studies show that the use of an AlN buffer layer is essential to the regular formation of the nanowires and matrix layers under our growth conditions. Our typical AlN buffer layer is 40-50 nm thick. We conclude that the nucleation mechanism for nanowires includes formation of nanocolumns in the AlN buffer layer. The propagation of the nanowires in GaN growth appears to be driven by differences in growth rates among crystallographic planes under N-rich conditions.

  4. MgCaO Dry Etching on GaN

    NASA Astrophysics Data System (ADS)

    Hlad, M.; Ren, F.

    2005-11-01

    MgCaO films grown by rf plasma-assisted Molecular Beam Epitaxy and capped with Sc2O3 are promising candidates as surface passivation layers and gate dielectrics on GaN-based high electron mobility transistors (HEMTs) and metal-oxide semiconductor HEMTs (MOS-HEMTs) respectively. Two different plasma chemistries were examined for etching these thin films on GaN. Inductively Coupled Plasmas of CH4/H2/Ar produced etch rates only in the range 20-70 å/min, comparable to the Ar sputter rates under the same conditions. Similarly slow MgCaO etch rates (˜100 å/min) were obtained with Cl2/Ar discharges under the same conditions, but GaN showed rates almost an order of magnitude higher. The MgCaO removal rates are limited by the low volatilities of the respective etch products. The CH4/H2/Ar plasma chemistry produced a selectivity of around 2 or etching the MgCaO with respect to GaN.

  5. Metal contacts on ZnSe and GaN

    SciTech Connect

    Duxstad, Kristin Joy

    1997-05-01

    Recently, considerable interest has been focused on the development of blue light emitting materials and devices. The focus has been on GaN and ZnSe, direct band gap semiconductors with bands gaps of 3.4 and 2.6 eV, respectively. To have efficient, reliable devices it is necessary to have thermally and electrically stable Ohmic contacts. This requires knowledge of the metal-semiconductor reaction behavior. To date few studies have investigated this behavior. Much information has accumulated over the years on the behavior of metals on Si and GaAs. This thesis provides new knowledge for the more ionic wide band gap semiconductors. The initial reaction temperatures, first phases formed, and phase stability of Pt, Pd, and Ni on both semiconductors were investigated. The reactions of these metals on ZnSe and GaN are discussed in detail and correlated with predicted behavior. In addition, comparisons are made between these highly ionic semiconductors and Si and GaAs. The trends observed here should also be applicable to other II-VI and III-Nitride semiconductor systems, while the information on phase formation and stability should be useful in the development of contacts for ZnSe and GaN devices.

  6. Transport mechanisms in Schottky diodes realized on GaN

    NASA Astrophysics Data System (ADS)

    Amor, Sarrah; Ahaitouf, Ali; Ahaitouf, Abdelaziz; Salvestrini, Jean Paul; Ougazzaden, Abdellah

    2017-03-01

    This work is focused on the conducted transport mechanisms involved on devices based in gallium nitride GaN and its alloys. With considering all conduction mechanisms of current, its possible to understanded these transport phenomena. Thanks to this methodology the current-voltage characteristics of structures with unusual behaviour are further understood and explain. Actually, the barrier height (SBH) is a complex problem since it depends on several parameters like the quality of the metal-semiconductor interface. This study is particularly interesting as solar cells are made on this material and their qualification is closely linked to their transport properties.

  7. Experimental and Theoretical Analysis of Strain Engineered Aluminium Nitride on Silicon for High Quality Aluminium(x)Indium(y)Gallium(1-x-y)Nitride Epitaxy

    NASA Astrophysics Data System (ADS)

    Tungare, Mihir

    III-Nitrides on Si are of great technological importance due to the availability of large area, epi ready Si substrates and the ability to heterointegrate with mature silicon micro and nanoelectronics. The major roadblock with realizing this is the large difference in thermal expansion coefficients and lattice constants between the two material systems. A novel technique developed in our research lab shows the potential of simultaneous and substantial reduction in dislocation and crack density in GaN on Si (111). Research undertaken in the current doctoral dissertation, validates the superior GaN quality on Si obtained using our technique and determines the factors responsible for its successful implementation. Detailed study of the stress evolution and dislocation reduction mechanism within overgrown GaN on as-grown and engineered AlN/Si substrates is carried out. Based on the conclusions obtained in this study, a pulsed metal-organic chemical vapor deposition (MOCVD) technique for the growth of AlN on Si (111) is developed to achieve a smoother AlN buffer with larger islands. A 14× reduction in surface pit density for overgrown GaN is attained on these AlN/Si substrates after substrate engineering. Deep green emission at 560 nm from InGaN/GaN MQWs with 10× increase in photoluminescence (PL) intensity is obtained on these templates. Molecular dynamics (MD) is used with an ultimate goal to theoretically understand the stress dilution mechanism and assist in improving the technique experimentally. Plausible models to accurately simulate wurtzite AlN (w-AlN) and AlN on Si (111) are developed. Motion of Si islands on Si (111) bulk substrate is examined to assess the required simulation conditions, their compliance with experimental set-up, and the limitations. Homoepitaxial growth of w-AlN is carried out to simulate epitaxial deposition as a starting point for heteroepitaxy of AlN on Si (111) and also to eventually build the entire complex film stack that closely

  8. The photocatalytic properties of hollow (GaN)1-x(ZnO)x composite nanofibers synthesized by electrospinning

    NASA Astrophysics Data System (ADS)

    Wang, Ding; Zhang, Minglu; Zhuang, Huaijuan; Chen, Xu; Wang, Xianying; Zheng, Xuejun; Yang, Junhe

    2017-02-01

    (GaN)1-x(ZnO)x composite nanofibers with hollow structure were prepared by initial electrospinning, and the subsequent calcination and nitridation. The structure and morphology characteristics of samples were investigated by X-ray diffraction (XRD), field-emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS) and transmission electron microscopy (TEM). The characterization results showed the phase transition from ZnGa2O4 to (GaN)1-x(ZnO)x solid-solution under ammonia atmosphere. The preparation conditions were explored and the optimum nitridation temperature and holding time are 750 °C and 2 h, respectively. The photocatalytic properties of (GaN)1-x(ZnO)x with different Ga:Zn atomic ratios were investigated by degrading Rhodamine B under the visible light irradiation. The photocatalytic activity sequence is (GaN)1-x(ZnO)x (Ga:Zn = 1:2) > (GaN)1-x(ZnO)x (Ga:Zn = 1:3) > ZnO nanofibers > (GaN)1-x(ZnO)x (Ga:Zn = 1:4) > (GaN)1-x(ZnO)x (Ga:Zn = 1:1). The photocatalytic mechanism of the (GaN)1-x(ZnO)x hollow nanofibers was further studied by UV-vis diffuse reflectance spectra. The excellent photocatalytic performance of (GaN)1-x(ZnO)x hollow nanofibers was attributed to the narrow band gap and high surface area of porous nanofibers with hollow structure.

  9. Method for synthesis of high quality graphene

    DOEpatents

    Lanzara, Alessandra [Piedmont, CA; Schmid, Andreas K [Berkeley, CA; Yu, Xiaozhu [Berkeley, CA; Hwang, Choonkyu [Albany, CA; Kohl, Annemarie [Beneditkbeuern, DE; Jozwiak, Chris M [Oakland, CA

    2012-03-27

    A method is described herein for the providing of high quality graphene layers on silicon carbide wafers in a thermal process. With two wafers facing each other in close proximity, in a first vacuum heating stage, while maintained at a vacuum of around 10.sup.-6 Torr, the wafer temperature is raised to about 1500.degree. C., whereby silicon evaporates from the wafer leaving a carbon rich surface, the evaporated silicon trapped in the gap between the wafers, such that the higher vapor pressure of silicon above each of the wafers suppresses further silicon evaporation. As the temperature of the wafers is raised to about 1530.degree. C. or more, the carbon atoms self assemble themselves into graphene.

  10. Spin and phase relaxation dynamics in GaN and GaN/AlGaN quantum wells (Presentation Recording)

    NASA Astrophysics Data System (ADS)

    Gallart, Mathieu; Ziegler, Marc; Hönerlage, Bernd H.; Gilliot, Pierre; Feltin, Eric; Carlin, Jean-François; Butté, Raphaël.; Grandjean, Nicolas

    2015-09-01

    By performing time-resolved optical non-degenerate pump-probe experiments, we study the relaxation dynamics of spin-polarized excitons in wurtzite epitaxial GaN and in nitride nanostructures. Those materials are indeed promising candidates for spintronic applications because of their weak spin-orbit coupling and large exciton binding energy (~ 17 meV and ~ 26meV in bulk GaN, respectively). In epilayers, we show that the high density of dislocations increases dramatically the spin relaxation of electrons and holes through the defect assisted Elliott-Yafet mechanism. That makes the exciton dephasing time very short. In high quality GaN/AlGaN quantum wells, both the exciton-spin lifetime S and the exciton dephasing-time T2 were determined via pump-probe spectroscopy using polarized laser pulses and time-resolved four wave-mixing experiments. The evolution of both quantities with temperature shows that spin relaxation occurs in the motional narrowing regime up to 80 K. Above this threshold, the thermal energy becomes large enough for excitons to escape from the QW. Such measurements demonstrate that GaN-based heterostructures can reach a very high degree of control that was previously mostly restricted to conventional III-V semiconductors and more specifically to the arsenide family.

  11. Investigation of cracks in GaN films grown by combined hydride and metal organic vapor-phase epitaxial method

    NASA Astrophysics Data System (ADS)

    Liu, Jianming; Liu, Xianlin; Li, Chengming; Wei, Hongyuan; Guo, Yan; Jiao, Chunmei; Li, Zhiwei; Xu, Xiaoqing; Song, Huaping; Yang, Shaoyan; Zhu, Qinsen; Wang, Zhanguo; Yang, Anli; Yang, Tieying; Wang, Huanhua

    2011-12-01

    Cracks appeared in GaN epitaxial layers which were grown by a novel method combining metal organic vapor-phase epitaxy (MOCVD) and hydride vapor-phase epitaxy (HVPE) in one chamber. The origin of cracks in a 22-μm thick GaN film was fully investigated by high-resolution X-ray diffraction (XRD), micro-Raman spectra, and scanning electron microscopy (SEM). Many cracks under the surface were first observed by SEM after etching for 10 min. By investigating the cross section of the sample with high-resolution micro-Raman spectra, the distribution of the stress along the depth was determined. From the interface of the film/substrate to the top surface of the film, several turnings were found. A large compressive stress existed at the interface. The stress went down as the detecting area was moved up from the interface to the overlayer, and it was maintained at a large value for a long depth area. Then it went down again, and it finally increased near the top surface. The cross-section of the film was observed after cleaving and etching for 2 min. It was found that the crystal quality of the healed part was nearly the same as the uncracked region. This indicated that cracking occurred in the growth, when the tensile stress accumulated and reached the critical value. Moreover, the cracks would heal because of high lateral growth rate.

  12. Piezo-generator integrating a vertical array of GaN nanowires.

    PubMed

    Jamond, N; Chrétien, P; Houzé, F; Lu, L; Largeau, L; Maugain, O; Travers, L; Harmand, J C; Glas, F; Lefeuvre, E; Tchernycheva, M; Gogneau, N

    2016-08-12

    We demonstrate the first piezo-generator integrating a vertical array of GaN nanowires (NWs). We perform a systematic multi-scale analysis, going from single wire properties to macroscopic device fabrication and characterization, which allows us to establish for GaN NWs the relationship between the material properties and the piezo-generation, and to propose an efficient piezo-generator design. The piezo-conversion of individual MBE-grown p-doped GaN NWs in a dense array is assessed by atomic force microscopy (AFM) equipped with a Resiscope module yielding an average output voltage of 228 ± 120 mV and a maximum value of 350 mV generated per NW. In the case of p-doped GaN NWs, the piezo-generation is achieved when a positive piezo-potential is created inside the nanostructures, i.e. when the NWs are submitted to compressive deformation. The understanding of the piezo-generation mechanism in our GaN NWs, gained from AFM analyses, is applied to design a piezo-generator operated under compressive strain. The device consists of NW arrays of several square millimeters in size embedded into spin-on glass with a Schottky contact for rectification and collection of piezo-generated carriers. The generator delivers a maximum power density of ∼12.7 mW cm(-3). This value sets the new state of the art for piezo-generators based on GaN NWs and more generally on nitride NWs, and offers promising prospects for the use of GaN NWs as high-efficiency ultra-compact energy harvesters.

  13. Piezo-generator integrating a vertical array of GaN nanowires

    NASA Astrophysics Data System (ADS)

    Jamond, N.; Chrétien, P.; Houzé, F.; Lu, L.; Largeau, L.; Maugain, O.; Travers, L.; Harmand, J. C.; Glas, F.; Lefeuvre, E.; Tchernycheva, M.; Gogneau, N.

    2016-08-01

    We demonstrate the first piezo-generator integrating a vertical array of GaN nanowires (NWs). We perform a systematic multi-scale analysis, going from single wire properties to macroscopic device fabrication and characterization, which allows us to establish for GaN NWs the relationship between the material properties and the piezo-generation, and to propose an efficient piezo-generator design. The piezo-conversion of individual MBE-grown p-doped GaN NWs in a dense array is assessed by atomic force microscopy (AFM) equipped with a Resiscope module yielding an average output voltage of 228 ± 120 mV and a maximum value of 350 mV generated per NW. In the case of p-doped GaN NWs, the piezo-generation is achieved when a positive piezo-potential is created inside the nanostructures, i.e. when the NWs are submitted to compressive deformation. The understanding of the piezo-generation mechanism in our GaN NWs, gained from AFM analyses, is applied to design a piezo-generator operated under compressive strain. The device consists of NW arrays of several square millimeters in size embedded into spin-on glass with a Schottky contact for rectification and collection of piezo-generated carriers. The generator delivers a maximum power density of ˜12.7 mW cm-3. This value sets the new state of the art for piezo-generators based on GaN NWs and more generally on nitride NWs, and offers promising prospects for the use of GaN NWs as high-efficiency ultra-compact energy harvesters.

  14. Multicycle rapid thermal annealing optimization of Mg-implanted GaN: Evolution of surface, optical, and structural properties

    NASA Astrophysics Data System (ADS)

    Greenlee, Jordan D.; Feigelson, Boris N.; Anderson, Travis J.; Tadjer, Marko J.; Hite, Jennifer K.; Mastro, Michael A.; Eddy, Charles R.; Hobart, Karl D.; Kub, Francis J.

    2014-08-01

    The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N2 overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E2 and A1 (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations.

  15. Multicycle rapid thermal annealing optimization of Mg-implanted GaN: Evolution of surface, optical, and structural properties

    SciTech Connect

    Greenlee, Jordan D.; Feigelson, Boris N.; Anderson, Travis J.; Hite, Jennifer K.; Mastro, Michael A.; Eddy, Charles R.; Hobart, Karl D.; Kub, Francis J.; Tadjer, Marko J.

    2014-08-14

    The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N{sub 2} overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E{sub 2} and A{sub 1} (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations.

  16. Nanostructural engineering of nitride nucleation layers for GaN substrate dislocation reduction.

    SciTech Connect

    Koleske, Daniel David; Lee, Stephen Roger; Lemp, Thomas Kerr; Coltrin, Michael Elliott; Cross, Karen Charlene; Thaler, Gerald

    2009-07-01

    With no lattice matched substrate available, sapphire continues as the substrate of choice for GaN growth, because of its reasonable cost and the extensive prior experience using it as a substrate for GaN. Surprisingly, the high dislocation density does not appear to limit UV and blue LED light intensity. However, dislocations may limit green LED light intensity and LED lifetime, especially as LEDs are pushed to higher current density for high end solid state lighting sources. To improve the performance for these higher current density LEDs, simple growth-enabled reductions in dislocation density would be highly prized. GaN nucleation layers (NLs) are not commonly thought of as an application of nano-structural engineering; yet, these layers evolve during the growth process to produce self-assembled, nanometer-scale structures. Continued growth on these nuclei ultimately leads to a fully coalesced film, and we show in this research program that their initial density is correlated to the GaN dislocation density. In this 18 month program, we developed MOCVD growth methods to reduce GaN dislocation densities on sapphire from 5 x 10{sup 8} cm{sup -2} using our standard delay recovery growth technique to 1 x 10{sup 8} cm{sup -2} using an ultra-low nucleation density technique. For this research, we firmly established a correlation between the GaN nucleation thickness, the resulting nucleation density after annealing, and dislocation density of full GaN films grown on these nucleation layers. We developed methods to reduce the nuclei density while still maintaining the ability to fully coalesce the GaN films. Ways were sought to improve the GaN nuclei orientation by improving the sapphire surface smoothness by annealing prior to the NL growth. Methods to eliminate the formation of additional nuclei once the majority of GaN nuclei were developed using a silicon nitride treatment prior to the deposition of the nucleation layer. Nucleation layer thickness was determined

  17. Growth of hierarchical GaN nanowires for optoelectronic device applications

    NASA Astrophysics Data System (ADS)

    Raj, Rishabh; Vignesh, Veeramuthu; Ra, Yong-Ho; Nirmala, Rajkumar; Lee, Cheul-Ro; Navamathavan, Rangaswamy

    2017-01-01

    Gallium nitride nanostructures have been receiving considerable attention as building blocks for nanophotonic technologies due to their unique high aspect ratios, promising the realization of photonic and biological nanodevices such as blue light emitting diodes (LEDs), short-wavelength ultraviolet nanolasers, and nanofluidic biochemical sensors. We report on the growth of hierarchical GaN nanowires (NWs) by dynamically adjusting the growth parameters using the pulsed flow metal-organic chemical vapor deposition technique. We carried out two step growth processes to grow hierarchical GaN NWs. In the first step, the GaN NWs were grown at 950°C, and in the second, we suitably decreased the growth temperature to 630°C and 710°C to grow the hierarchical structures. The surface morphology and optical characterization of the grown GaN NWs were studied by field-emission scanning electron microscopy, high-resolution transmission electron microscopy, photoluminescence, and cathodoluminescence measurements. These kinds of hierarchical GaN NWs are promising for allowing flat band quantum structures that are shown to improve the efficiency of LEDs.

  18. Spontaneously grown GaN and AlGaN nanowires

    NASA Astrophysics Data System (ADS)

    Bertness, K. A.; Roshko, A.; Sanford, N. A.; Barker, J. M.; Davydov, A. V.

    2006-01-01

    We have identified crystal growth conditions in gas-source molecular beam epitaxy (MBE) that lead to spontaneous formation of GaN nanowires with high aspect ratio on Si (1 1 1) substrates. The nanowires were oriented along the GaN c-axis and normal to the substrate surface. Unlike in many other reports of GaN nanowire growth, no metal catalysts were used. Low growth rates at substrate temperatures near 820 °C were combined with high nitrogen flux (partially dissociated with RF plasma excitation) to form well-separated GaN wires with diameters from 50 to 250 nm in diameter and lengths ranging from 2 to 7 μm. The nanowires grew out of an irregular matrix layer containing deep faceted holes. X-ray diffraction indicated that the wires were fully relaxed and aligned to the silicon substrate. The growth morphology was strongly affected by the presence of Al and Be. The changes suggest that surface diffusion is a primary driving force in the growth of GaN nanowires with MBE.

  19. A survey on GaN- based devices for terahertz photonics

    NASA Astrophysics Data System (ADS)

    Ahi, Kiarash; Anwar, Mehdi

    2016-09-01

    With fast growing of the photonics and power electronic systems, the need for high power- high frequency semiconductor devices is sensed tremendously. GaN provides the highest electron saturation velocity, breakdown voltage and operation temperature, and thus combined frequency-power performance among commonly used semiconductors. With achieving the first THz image in just two decades ago, generation and detection of terahertz (THz) radiation is one of the most emerging photonic areas. The industrial needs for compact, economical, high resolution and high power THz imaging and spectroscopy systems are fueling the utilization of GaN for the realizing of the next generation of THz systems. As it is reviewed in this paper, the mentioned characteristics of GaN together with its capabilities of providing high 2-dimentional election densities and large longitudinal-optical phonon of 90 meV, make it one of the most promising semiconductor materials for the future of the THz generation, detection, mixing, and frequency multiplication. GaN- based devices have shown capabilities of operating in the upper THz frequency band of 5- 12 THz with relatively high photon densities and in room temperature. As a result, THz imaging and spectroscopy systems with high resolutions and depths of penetrations can be realized via utilizing GaN- based devices. In this paper, a comprehensive review on the history and state of the art of the GaN- based electronic devices, including plasma HFETs, NDRs, HDSDs, IMPATTs, QCLs, HEMTs, Gunn diodes and TeraFETs together with their impact on the future of THz imaging and spectroscopy systems is provided.

  20. Principles for high-quality, high-value testing.

    PubMed

    Power, Michael; Fell, Greg; Wright, Michael

    2013-02-01

    A survey of doctors working in two large NHS hospitals identified over 120 laboratory tests, imaging investigations and investigational procedures that they considered not to be overused. A common suggestion in this survey was that more training was required. And, this prompted the development of a list of core principles for high-quality, high-value testing. The list can be used as a framework for training and as a reference source. The core principles are: (1) Base testing practices on the best available evidence. (2) Apply the evidence on test performance with careful judgement. (3) Test efficiently. (4) Consider the value (and affordability) of a test before requesting it. (5) Be aware of the downsides and drivers of overdiagnosis. (6) Confront uncertainties. (7) Be patient-centred in your approach. (8) Consider ethical issues. (9) Be aware of normal cognitive limitations and biases when testing. (10) Follow the 'knowledge journey' when teaching and learning these core principles.