Science.gov

Sample records for individual pixel readout

  1. Readout and DAQ for Pixel Detectors

    NASA Astrophysics Data System (ADS)

    Platkevic, Michal

    2010-01-01

    Data readout and acquisition control of pixel detectors demand the transfer of significantly a large amounts of bits between the detector and the computer. For this purpose dedicated interfaces are used which are designed with focus on features like speed, small dimensions or flexibility of use such as digital signal processors, field-programmable gate arrays (FPGA) and USB communication ports. This work summarizes the readout and DAQ system built for state-of-the-art pixel detectors of the Medipix family.

  2. Active pixel sensor array with multiresolution readout

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Kemeny, Sabrina E. (Inventor); Pain, Bedabrata (Inventor)

    1999-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node. There is also a readout circuit, part of which can be disposed at the bottom of each column of cells and be common to all the cells in the column. The imaging device can also include an electronic shutter formed on the substrate adjacent the photogate, and/or a storage section to allow for simultaneous integration. In addition, the imaging device can include a multiresolution imaging circuit to provide images of varying resolution. The multiresolution circuit could also be employed in an array where the photosensitive portion of each pixel cell is a photodiode. This latter embodiment could further be modified to facilitate low light imaging.

  3. FPIX2, the BTeV pixel readout chip

    SciTech Connect

    David C. Christian et al.

    2003-12-10

    A radiation tolerant pixel readout chip, FPIX2, has been developed at Fermilab for use by BTeV. Some of the requirements of the BTeV pixel readout chip are reviewed and contrasted with requirements for similar devices in LHC experiments. A description of the FPIX2 is given, and results of initial tests of its performance are presented, as is a summary of measurements planned for the coming year.

  4. Vertically integrated pixel readout chip for high energy physics

    SciTech Connect

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Khalid, Farah; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2011-01-01

    We report on the development of the vertex detector pixel readout chips based on multi-tier vertically integrated electronics for the International Linear Collider. Some testing results of the VIP2a prototype are presented. The chip is the second iteration of the silicon implementation of the prototype, data-pushed concept of the readout developed at Fermilab. The device was fabricated in the 3D MIT-LL 0.15 {micro}m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 {micro}m{sup 2} pixels, laid out in an array of 48 x 48 pixels.

  5. Improvement of Event Synchronization in the ATLAS Pixel Readout Development

    NASA Astrophysics Data System (ADS)

    Adams, Logan; Atlas Collaboration

    2017-01-01

    As the LHC continues in Run2, the B-Layer still uses the Atlas-SiROD Pixel readout system initially developed for Run 1. The higher luminosity occurring during Run 2 results in higher occupancy causing increased desynchronization errors in the Pixel Readout. In order to ensure lasting operation of the B-Layer until it is replaced after Run 3, changes were made to the firmware and software to add debug capabilities to identify when the errors are crossing certain thresholds and change the internal control logic accordingly. These features also allow for better debugging of the Event Counter Reset addition to the firmware. This talk will focus on the features implemented and measurements to demonstrate the positive impact on the Pixel DAQ system. A Pixel front-end chip emulator which can be used for readout system development beyond Run 3 will also be discussed. Presenter is Logan Adams, University of Washington.

  6. Readout of TPC Tracking Chambers with GEMs and Pixel Chip

    SciTech Connect

    Kadyk, John; Kim, T.; Freytsis, M.; Button-Shafer, J.; Kadyk, J.; Vahsen, S.E.; Wenzel, W.A.

    2007-12-21

    Two layers of GEMs and the ATLAS Pixel Chip, FEI3, have been combined and tested as a prototype for Time Projection Chamber (TPC) readout at the International Linear Collider (ILC). The double-layer GEM system amplifies charge with gain sufficient to detect all track ionization. The suitability of three gas mixtures for this application was investigated, and gain measurements are presented. A large sample of cosmic ray tracks was reconstructed in 3D by using the simultaneous timing and 2D spatial information from the pixel chip. The chip provides pixel charge measurement as well as timing. These results demonstrate that a double GEM and pixel combination, with a suitably modified pixel ASIC, could meet the stringent readout requirements of the ILC.

  7. Anode readout for pixellated CZT detectors

    NASA Astrophysics Data System (ADS)

    Narita, Tomohiko; Grindlay, Jonathan E.; Hong, Jaesub; Niestemski, Francis C.

    2004-02-01

    Determination of the photon interaction depth offers numerous advantages for an astronomical hard X-ray telescope. The interaction depth is typically derived from two signals: anode and cathode, or collecting and non-collecting electrodes. We present some preliminary results from our depth sensing detectors using only the anode pixel signals. By examining several anode pixel signals simultaneously, we find that we can estimate the interaction depth, and get sub-pixel 2-D position resolution. We discuss our findings and the requirements for future ASIC development.

  8. Detector apparatus having a hybrid pixel-waveform readout system

    DOEpatents

    Meng, Ling-Jian

    2014-10-21

    A gamma ray detector apparatus comprises a solid state detector that includes a plurality of anode pixels and at least one cathode. The solid state detector is configured for receiving gamma rays during an interaction and inducing a signal in an anode pixel and in a cathode. An anode pixel readout circuit is coupled to the plurality of anode pixels and is configured to read out and process the induced signal in the anode pixel and provide triggering and addressing information. A waveform sampling circuit is coupled to the at least one cathode and configured to read out and process the induced signal in the cathode and determine energy of the interaction, timing of the interaction, and depth of interaction.

  9. Sensor Development and Readout Prototyping for the STAR Pixel Detector

    SciTech Connect

    Greiner, L.; Anderssen, E.; Matis, H.S.; Ritter, H.G.; Stezelberger, T.; Szelezniak, M.; Sun, X.; Vu, C.; Wieman, H.

    2009-01-14

    The STAR experiment at the Relativistic Heavy Ion Collider (RHIC) is designing a new vertex detector. The purpose of this upgrade detector is to provide high resolution pointing to allow for the direct topological reconstruction of heavy flavor decays such as the D{sup 0} by finding vertices displaced from the collision vertex by greater than 60 microns. We are using Monolithic Active Pixel Sensor (MAPS) as the sensor technology and have a coupled sensor development and readout system plan that leads to a final detector with a <200 {micro}s integration time, 400 M pixels and a coverage of -1 < {eta} < 1. We present our coupled sensor and readout development plan and the status of the prototyping work that has been accomplished.

  10. Monolithic pixels on moderate resistivity substrate and sparsifying readout architecture

    NASA Astrophysics Data System (ADS)

    Giubilato, P.; Battaglia, M.; Bisello, D.; Caselle, M.; Chalmet, P.; Demaria, L.; Ikemoto, Y.; Kloukinas, K.; Mansuy, S. C.; Mattiazzo, S.; Marchioro, A.; Mugnier, H.; Pantano, D.; Potenza, A.; Rivetti, A.; Rousset, J.; Silvestrin, L.; Snoeys, W.

    2013-12-01

    The LePix projects aim realizing a new generation monolithic pixel detectors with improved performances at lesser cost with respect to both current state of the art monolithic and hybrid pixel sensors. The detector is built in a 90 nm CMOS process on a substrate of moderate resistivity. This allows charge collection by drift while maintaining the other advantages usually offered by MAPS, like having a single piece detector and using a standard CMOS production line. The collection by drift mechanism, coupled to the low capacitance design of the collecting node made possible by the monolithic approach, provides an excellent signal to noise ratio straight at the pixel cell together with a radiation tolerance far superior to conventional un-depleted MAPS. The excellent signal-to-noise performance is demonstrated by the device ability to separate the 6 keV 55Fe double peak at room temperature. To achieve high granularity (10-20 μm pitch pixels) over large detector areas maintaining high readout speed, a completely new compressing architecture has been devised. This architecture departs from the mainstream hybrid pixel sparsification approach, which uses in-pixel logic to reduce data, by using topological compression to minimize pixel area and power consumption.

  11. HEXITEC ASIC—a pixellated readout chip for CZT detectors

    NASA Astrophysics Data System (ADS)

    Jones, Lawrence; Seller, Paul; Wilson, Matthew; Hardie, Alec

    2009-06-01

    HEXITEC is a collaborative project with the aim of developing a new range of detectors for high-energy X-ray imaging. High-energy X-ray imaging has major advantages over current lower energy imaging for the life and physical sciences, including improved phase-contrast images on larger, higher density samples and with lower accumulated doses. However, at these energies conventional silicon-based devices cannot be used, hence, the requirement for a new range of high Z-detector materials. Underpinning the HEXITEC programme are the development of a pixellated Cadmium Zinc Telluride (CZT) detectors and a pixellated readout ASIC which will be bump-bonded to the detector. The HEXITEC ASIC is required to have low noise (20 electrons rms) and tolerate detector leakage currents. A prototype 20×20 pixel ASIC has been developed and manufactured on a standard 0.35 μm CMOS process.

  12. SPIDR, a general-purpose readout system for pixel ASICs

    NASA Astrophysics Data System (ADS)

    van der Heijden, B.; Visser, J.; van Beuzekom, M.; Boterenbrood, H.; Kulis, S.; Munneke, B.; Schreuder, F.

    2017-02-01

    The SPIDR (Speedy PIxel Detector Readout) system is a flexible general-purpose readout platform that can be easily adapted to test and characterize new and existing detector readout ASICs. It is originally designed for the readout of pixel ASICs from the Medipix/Timepix family, but other types of ASICs or front-end circuits can be read out as well. The SPIDR system consists of an FPGA board with memory and various communication interfaces, FPGA firmware, CPU subsystem and an API library on the PC . The FPGA firmware can be adapted to read out other ASICs by re-using IP blocks. The available IP blocks include a UDP packet builder, 1 and 10 Gigabit Ethernet MAC's and a "soft core" CPU . Currently the firmware is targeted at the Xilinx VC707 development board and at a custom board called Compact-SPIDR . The firmware can easily be ported to other Xilinx 7 series and ultra scale FPGAs. The gap between an ASIC and the data acquisition back-end is bridged by the SPIDR system. Using the high pin count VITA 57 FPGA Mezzanine Card (FMC) connector only a simple chip carrier PCB is required. A 1 and a 10 Gigabit Ethernet interface handle the connection to the back-end. These can be used simultaneously for high-speed data and configuration over separate channels. In addition to the FMC connector, configurable inputs and outputs are available for synchronization with other detectors. A high resolution (≈ 27 ps bin size) Time to Digital converter is provided for time stamping events in the detector. The SPIDR system is frequently used as readout for the Medipix3 and Timepix3 ASICs. Using the 10 Gigabit Ethernet interface it is possible to read out a single chip at full bandwidth or up to 12 chips at a reduced rate. Another recent application is the test-bed for the VeloPix ASIC, which is developed for the Vertex Detector of the LHCb experiment. In this case the SPIDR system processes the 20 Gbps scrambled data stream from the VeloPix and distributes it over four 10 Gigabit

  13. Characterization of the column-based priority logic readout of Topmetal-II‑ CMOS pixel direct charge sensor

    NASA Astrophysics Data System (ADS)

    An, M.; Zhang, W.; Xiao, L.; Gao, C.; Chen, C.; Han, M.; Huang, G.; Ji, R.; Li, X.; Liu, J.; Mei, Y.; Pei, H.; Sun, Q.; Sun, X.; Wang, K.; Yang, P.; Zhou, W.

    2017-03-01

    We present the detailed study of the digital readout of Topmetal-II- CMOS pixel direct charge sensor. Topmetal-II- is an integrated sensor with an array of 72×72 pixels each capable of directly collecting external charge through exposed metal electrodes in the topmost metal layer. In addition to the time-shared multiplexing readout of the analog output from Charge Sensitive Amplifiers in each pixel, hits are also generated through comparators in each pixel with individually adjustable thresholds. The hits are read out via a column-based priority logic structure, retaining both hit location and time information. The in-array column-based priority logic features with a full clock-less circuitry hence there is no continuously running clock distributed in the pixel and matrix logic. These characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments. We studied the detailed working behavior and performance of this readout, and demonstrated its functional validity and potential in imaging applications.

  14. A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout

    SciTech Connect

    Allman, M. S. Verma, V. B.; Stevens, M.; Gerrits, T.; Horansky, R. D.; Lita, A. E.; Mirin, R.; Nam, S. W.; Marsili, F.; Beyer, A.; Shaw, M. D.; Kumor, D.

    2015-05-11

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array as well as characterization measurements are discussed.

  15. A 2D 4×4 Channel Readout ASIC for Pixelated CdTe Detectors for Medical Imaging Applications

    PubMed Central

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Martínez, Ricardo; Puigdengoles, Carles

    2015-01-01

    We present a 16-channel readout integrated circuit (ROIC) with nanosecond-resolution time to digital converter (TDC) for pixelated Cadmium Telluride (CdTe) gamma-ray detectors. The 4 × 4 pixel array ROIC is the proof of concept of the 10 × 10 pixel array readout ASIC for positron-emission tomography (PET) scanner, positron-emission mammography (PEM) scanner, and Compton gamma camera. The electronics of each individual pixel integrates an analog front-end with switchable gain, an analog to digital converter (ADC), configuration registers, and a 4-state digital controller. For every detected photon, the pixel electronics provides the energy deposited in the detector with 10-bit resolution, and a fast trigger signal for time stamp. The ASIC contains the 16-pixel matrix electronics, a digital controller, five global voltage references, a TDC, a temperature sensor, and a band-gap based current reference. The ASIC has been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and occupies an area of 5.3 mm × 6.8 mm. The TDC shows a resolution of 95.5 ps, a precision of 600 ps at full width half maximum (FWHM), and a power consumption of 130 μW. In acquisition mode, the total power consumption of every pixel is 200 μW. An equivalent noise charge (ENC) of 160 e−RMS at maximum gain and negative polarity conditions has been measured at room temperature. PMID:26744545

  16. A 2D 4×4 Channel Readout ASIC for Pixelated CdTe Detectors for Medical Imaging Applications.

    PubMed

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Martínez, Ricardo; Puigdengoles, Carles

    2015-10-01

    We present a 16-channel readout integrated circuit (ROIC) with nanosecond-resolution time to digital converter (TDC) for pixelated Cadmium Telluride (CdTe) gamma-ray detectors. The 4 × 4 pixel array ROIC is the proof of concept of the 10 × 10 pixel array readout ASIC for positron-emission tomography (PET) scanner, positron-emission mammography (PEM) scanner, and Compton gamma camera. The electronics of each individual pixel integrates an analog front-end with switchable gain, an analog to digital converter (ADC), configuration registers, and a 4-state digital controller. For every detected photon, the pixel electronics provides the energy deposited in the detector with 10-bit resolution, and a fast trigger signal for time stamp. The ASIC contains the 16-pixel matrix electronics, a digital controller, five global voltage references, a TDC, a temperature sensor, and a band-gap based current reference. The ASIC has been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and occupies an area of 5.3 mm × 6.8 mm. The TDC shows a resolution of 95.5 ps, a precision of 600 ps at full width half maximum (FWHM), and a power consumption of 130 μW. In acquisition mode, the total power consumption of every pixel is 200 μW. An equivalent noise charge (ENC) of 160 e(-)RMS at maximum gain and negative polarity conditions has been measured at room temperature.

  17. A Triple-GEM Detector with Pixel Readout for High-Rate Beam Tracking in COMPASS

    NASA Astrophysics Data System (ADS)

    Nagel, T.; Austregesilo, A.; Haas, F.; Ketzer, B.; Konorov, I.; Krämer, M.; Mann, A.; Paul, S.

    2008-06-01

    For its physics program with a high-intensity hadron beam of 2 · 107 particles/s, the COMPASS experiment at CERN requires tracking of charged particles scattered by very small angles with respect to the incident beam direction. While good resolution in time and space is mandatory, the challenge is imposed by the high beam intensity, requiring radiation-hard detectors which add very little material to the beam path in order to minimise secondary interactions. To this end, a set of triple-GEM detectors with pixel readout in the beam region and 2-D strip readout in the periphery is currently being built. The pixel size has been chosen to be 1×1 mm2, which constitutes a compromise between the spatial resolution achievable and the number of readout channels. Surrounding the pixel area, a 2-D strip readout with a pitch of 400 μm has been realised on the same printed circuit foil. In total an active area of 10 × 10 cm2 is covered using 2048 readout channels. Analogue readout by the APV25 ASIC has been chosen in order to profit from amplitude measurements which help to improve the spatial resolution by clustering neighbouring hit strips or pixels. A detector prototype has been tested successfully in the 5 · 107 particles/s COMPASS muon beam, as well as in a focused hadron beam. The design of the detector and first results concerning its performance as a beam tracker will be presented.

  18. Radiation Tolerance Studies of BTeV Pixel Readout Chip Prototypes

    SciTech Connect

    Gabriele Chiodini et al.

    2001-09-11

    We report on several irradiation studies performed on BTeV preFPIX2 pixel readout chip prototypes exposed to a 200 MeV proton beam at the Indiana University Cyclotron Facility. The preFPIX2 pixel readout chip has been implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The tests confirmed the radiation tolerance of the chip design to proton total dose of 26 MRad. In addition, non destructive radiation-induced single event upsets have been observed in on-chip static registers and the single bit upset cross section has been measured.

  19. Small-Scale Readout System Prototype for the STAR PIXEL Detector

    SciTech Connect

    Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

    2008-10-10

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  20. 3D-FBK pixel sensors with CMS readout: First test results

    NASA Astrophysics Data System (ADS)

    Obertino, M.; Solano, A.; Vilela Pereira, A.; Alagoz, E.; Andresen, J.; Arndt, K.; Bolla, G.; Bortoletto, D.; Boscardin, M.; Brosius, R.; Bubna, M.; Dalla Betta, G.-F.; Jensen, F.; Krzywda, A.; Kumar, A.; Kwan, S.; Lei, C. M.; Menasce, D.; Moroni, L.; Ngadiuba, J.; Osipenkov, I.; Perera, L.; Povoli, M.; Prosser, A.; Rivera, R.; Shipsey, I.; Tan, P.; Terzo, S.; Uplegger, L.; Wagner, S.; Dinardo, M.

    2013-08-01

    Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate entirely in the detector bulk, perpendicularly to the surface. They are emerging as one of the most promising technologies for innermost layers of tracking devices for the foreseen upgrades of the LHC. Until recently, properties of 3D sensors have been investigated mostly with ATLAS readout electronics. 3D pixel sensors compatible with the CMS readout were first fabricated at SINTEF (Oslo, Norway), and more recently at FBK (Trento, Italy) and CNM (Barcelona, Spain). Several sensors with different electrode configurations, bump-bonded with the CMS pixel PSI46 readout chip, were characterized in laboratory and tested at Fermilab with a proton beam of 120 GeV/c. Preliminary results of the data analysis are presented.

  1. 18k Channels single photon counting readout circuit for hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e- and the equivalent noise charge is 168 e- rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  2. High-speed readout of high-Z pixel detectors with the LAMBDA detector

    NASA Astrophysics Data System (ADS)

    Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

    2014-12-01

    High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ``high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ``continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan.

  3. Fast Readout Architectures for Large Arrays of Digital Pixels: Examples and Applications

    PubMed Central

    Gabrielli, A.

    2014-01-01

    Modern pixel detectors, particularly those designed and constructed for applications and experiments for high-energy physics, are commonly built implementing general readout architectures, not specifically optimized in terms of speed. High-energy physics experiments use bidimensional matrices of sensitive elements located on a silicon die. Sensors are read out via other integrated circuits bump bonded over the sensor dies. The speed of the readout electronics can significantly increase the overall performance of the system, and so here novel forms of readout architectures are studied and described. These circuits have been investigated in terms of speed and are particularly suited for large monolithic, low-pitch pixel detectors. The idea is to have a small simple structure that may be expanded to fit large matrices without affecting the layout complexity of the chip, while maintaining a reasonably high readout speed. The solutions might be applied to devices for applications not only in physics but also to general-purpose pixel detectors whenever online fast data sparsification is required. The paper presents also simulations on the efficiencies of the systems as proof of concept for the proposed ideas. PMID:24778588

  4. FDM Readout Assembly with Flexible, Superconducting Connection to Cryogenic kilo-Pixel TES Detectors

    NASA Astrophysics Data System (ADS)

    Bruijn, M. P.; van der Linden, A. J.; Ridder, M. L.; van Weers, H. J.

    2016-07-01

    We describe a new fabrication process for a superconducting, flexible, and demountable connector to a kilo-pixel transition edge sensor. The demountable part contains planar coils for inductive coupling, in particular suited for AC-biased frequency domain multiplexed readout. A fixed connection to a chip with superconducting LC filters and SQUID readout is made by gold bump bonding with a connection resistance of 1.1 {× } 10^{-4} Ω . The Nb-based connecting lines on the flexible part show a superconducting transition around 7 K, which enables testing of connectors and LC filters in a simple L-He setup.

  5. The FE-I4 Pixel Readout Chip and the IBL Module

    SciTech Connect

    Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; Beccherle, Roberto; Darbo, Giovanni; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

    2012-05-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  6. Development of readout system for FE-I4 pixel module using SiTCP

    NASA Astrophysics Data System (ADS)

    Teoh, J. J.; Hanagaki, K.; Ikegami, Y.; Takubo, Y.; Terada, S.; Unno, Y.

    2013-12-01

    The ATLAS pixel detector will be replaced in the future High Luminosity-Large Hadron Collider (HL-LHC) upgrade to preserve or improve the detector performance at high luminosity environment. To meet the tight requirements of the upgrade, a new pixel Front-End (FE) Integrated Circuit (IC) called FE-I4 has been developed. We have then devised a readout system for the new FE IC. Our system incorporates Silicon Transmission Control Protocol (SiTCP) technology (Uchida, 2008 [1]) which utilizes the standard TCP/IP and UDP communication protocols. This technology allows direct data access and transfer between a readout hardware chain and PC via a high speed Ethernet. In addition, the communication protocols are small enough to be implemented in a single Field-Programable Gate Array (FPGA). Relying on this technology, we have been able to construct a very compact, versatile and fast readout system. We have developed a firmware and software together with the readout hardware chain. We also have established basic functionalities for reading out FE-I4.

  7. Radiation tolerance of prototype BTeV pixel detector readout chips

    SciTech Connect

    Gabriele Chiodini et al.

    2002-07-12

    High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is the state of the art technology able to meet these challenges. We report on irradiation studies performed on BTeV pixel readout chip prototypes exposed to a 200 MeV proton beam at Indiana University Cyclotron Facility. Prototype pixel readout chip preFPIX2 has been developed at Fermilab for collider experiments and implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The tests confirmed the radiation tolerance of the chip design to proton total dose up to 87 MRad. In addition, non destructive radiation-induced single event upsets have been observed in on-chip static registers and the single bit upset cross section has been extensively measured.

  8. A 128×96 Pixel Stack-Type Color Image Sensor: Stack of Individual Blue-, Green-, and Red-Sensitive Organic Photoconductive Films Integrated with a ZnO Thin Film Transistor Readout Circuit

    NASA Astrophysics Data System (ADS)

    Seo, Hokuto; Aihara, Satoshi; Watabe, Toshihisa; Ohtake, Hiroshi; Sakai, Toshikatsu; Kubota, Misao; Egami, Norifumi; Hiramatsu, Takahiro; Matsuda, Tokiyoshi; Furuta, Mamoru; Hirao, Takashi

    2011-02-01

    A color image was produced by a vertically stacked image sensor with blue (B)-, green (G)-, and red (R)-sensitive organic photoconductive films, each having a thin-film transistor (TFT) array that uses a zinc oxide (ZnO) channel to read out the signal generated in each organic film. The number of the pixels of the fabricated image sensor is 128×96 for each color, and the pixel size is 100×100 µm2. The current on/off ratio of the ZnO TFT is over 106, and the B-, G-, and R-sensitive organic photoconductive films show excellent wavelength selectivity. The stacked image sensor can produce a color image at 10 frames per second with a resolution corresponding to the pixel number. This result clearly shows that color separation is achieved without using any conventional color separation optical system such as a color filter array or a prism.

  9. Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

    NASA Technical Reports Server (NTRS)

    Rider, D.; Blavier, J-F.; Cunningham, T.; Hancock, B.; Key, R.; Pannell, Z.; Sander, S.; Seshadri, S.; Sun, C.; Wrigley, C.

    2011-01-01

    Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

  10. Development and simulation results of a sparsification and readout circuit for wide pixel matrices

    NASA Astrophysics Data System (ADS)

    Gabrielli, A.; Giorgi, F.; Morsani, F.; Villa, M.

    2011-06-01

    In future collider experiments, the increasing luminosity and centre of mass energy are rising challenging problems in the design of new inner tracking systems. In this context we develop high-efficiency readout architectures for large binary pixel matrices that are meant to cope with the high-stressing conditions foreseen in the innermost layers of a tracker [The SuperB Conceptual Design Report, INFN/AE-07/02, SLAC-R-856, LAL 07-15, Available online at: http://www.pi.infn.it/SuperB]. We model and design digital readout circuits to be integrated on VLSI ASICs. These architectures can be realized with different technology processes and sensors: they can be implemented on the same silicon sensor substrate of a CMOS MAPS devices (Monolithic Active Pixel Sensor), on the CMOS tier of a hybrid pixel sensor or in a 3D chip where the digital layer is stacked on the sensor and the analog layers [V. Re et al., Nuc. Instr. and Meth. in Phys. Res. A, doi:10.1016/j.nima.2010.05.039]. In the presented work, we consider a data-push architecture designed for a sensor matrix of an area of about 1.3 cm 2 with a pitch of 50 microns. The readout circuit tries to take great advantage of the high density of in-pixel digital logic allowed by vertical integration. We aim at sustaining a rate density of 100 Mtrack ṡ s -1 ṡ cm -2 with a temporal resolution below 1 μs. We show how this architecture can cope with these stressing conditions presenting the results of Monte Carlo simulations.

  11. Review of hybrid pixel detector readout ASICs for spectroscopic X-ray imaging

    NASA Astrophysics Data System (ADS)

    Ballabriga, R.; Alozy, J.; Campbell, M.; Frojdh, E.; Heijne, E. H. M.; Koenig, T.; Llopart, X.; Marchal, J.; Pennicard, D.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.; Zuber, M.

    2016-01-01

    Semiconductor detector readout chips with pulse processing electronics have made possible spectroscopic X-ray imaging, bringing an improvement in the overall image quality and, in the case of medical imaging, a reduction in the X-ray dose delivered to the patient. In this contribution we review the state of the art in semiconductor-detector readout ASICs for spectroscopic X-ray imaging with emphasis on hybrid pixel detector technology. We discuss how some of the key challenges of the technology (such as dealing with high fluxes, maintaining spectral fidelity, power consumption density) are addressed by the various ASICs. In order to understand the fundamental limits of the technology, the physics of the interaction of radiation with the semiconductor detector and the process of signal induction in the input electrodes of the readout circuit are described. Simulations of the process of signal induction are presented that reveal the importance of making use of the small pixel effect to minimize the impact of the slow motion of holes and hole trapping in the induced signal in high-Z sensor materials. This can contribute to preserve fidelity in the measured spectrum with relatively short values of the shaper peaking time. Simulations also show, on the other hand, the distortion in the energy spectrum due to charge sharing and fluorescence photons when the pixel pitch is decreased. However, using recent measurements from the Medipix3 ASIC, we demonstrate that the spectroscopic information contained in the incoming photon beam can be recovered by the implementation in hardware of an algorithm whereby the signal from a single photon is reconstructed and allocated to the pixel with the largest deposition.

  12. Prototype AEGIS: A Pixel-Array Readout Circuit for Gamma-Ray Imaging

    PubMed Central

    Barber, H. Bradford; Augustine, F. L.; Furenlid, L.; Ingram, C. M.; Grim, G. P.

    2015-01-01

    Semiconductor detector arrays made of CdTe/CdZnTe are expected to be the main components of future high-performance, clinical nuclear medicine imaging systems. Such systems will require small pixel-pitch and much larger numbers of pixels than are available in current semiconductor-detector cameras. We describe the motivation for developing a new readout integrated circuit, AEGIS, for use in hybrid semiconductor detector arrays, that may help spur the development of future cameras. A basic design for AEGIS is presented together with results of an HSPICE™ simulation of the performance of its unit cell. AEGIS will have a shaper-amplifier unit cell and neighbor pixel readout. Other features include the use of a single input power line with other biases generated on-board, a control register that allows digital control of all thresholds and chip configurations and an output approach that is compatible with list-mode data acquisition. An 8×8 prototype version of AEGIS is currently under development; the full AEGIS will be a 64×64 array with 300 μm pitch. PMID:26345126

  13. The NA62 Gigatracker: Detector properties and pixel read-out architectures

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Noy, M.; Petrucci, F.; Riedler, P.; Rivetti, A.; Tiuraniemi, S.

    2010-12-01

    The beam spectrometer of the NA62 experiment, named Gigatracker, has to perform single track reconstruction with unprecedented time resolution (150 ps rms) in a harsh radiation environment. To meet these requirements, and in order to reduce material budget to a minimum, three hybrid silicon pixel detector stations will be installed in vacuum. An adequate strategy to compensate for the discriminator time-walk must be implemented and R&D investigating two different options is ongoing. Two read-out chip prototypes have been designed in order to compare their performance: one approach is based on the use of a constant-fraction discriminator followed by an on-pixel TDC, while the other one is based on the use of a time-over-threshold circuit followed by a TDC shared by a group of pixels. This paper describes the Gigatracker system, presents the global architectures of both read-out ASICs and reviews the current status of the R&D project.

  14. Readout of a 176 pixel FDM system for SAFARI TES arrays

    NASA Astrophysics Data System (ADS)

    Hijmering, R. A.; den Hartog, R.; Ridder, M.; van der Linden, A. J.; van der Kuur, J.; Gao, J. R.; Jackson, B.

    2016-07-01

    In this paper we present the results of our 176-pixel prototype of the FDM readout system for SAFARI, a TES-based focal-plane instrument for the far-IR SPICA mission. We have implemented the knowledge obtained from the detailed study on electrical crosstalk reported previously. The effect of carrier leakage is reduced by a factor two, mutual impedance is reduced to below 1 nH and mutual inductance is removed. The pixels are connected in stages, one quarter of the array half of the array and the full array, to resolve intermediate technical issues. A semi-automated procedure was incorporated to find all optimal settings for all pixels. And as a final step the complete array has been connected and 132 pixels have been read out simultaneously within the frequency range of 1-3.8MHz with an average frequency separation of 16kHz. The noise was found to be detector limited and was not affected by reading out all pixels in a FDM mode. With this result the concept of using FDM for multiplexed bolometer read out for the SAFARI instrument has been demonstrated.

  15. Characterization of edgeless pixel detectors coupled to Medipix2 readout chip

    NASA Astrophysics Data System (ADS)

    Kalliopuska, Juha; Tlustos, Lukas; Eränen, Simo; Virolainen, Tuula

    2011-08-01

    VTT has developed a straightforward and fast process to fabricate four-side buttable (edgeless) microstrip and pixel detectors on 6 in. (150 mm) wafers. The process relies on advanced ion implantation to activate the edges of the detector instead of using polysilicon. The article characterizes 150 μm thick n-on-n edgeless pixel detector prototypes with a dead layer at the edge below 1 μm. Electrical and radiation response characterization of 1.4×1.4 cm2 n-on-n edgeless detectors has been done by coupling them to the Medipix2 readout chips. The distance of the detector's physical edge from the pixels was either 20 or 50 μm. The leakage current of flip-chip bonded edgeless Medipix2 detector assembles were measured to be ˜90 nA/cm2 and no breakdown was observed below 110 V. Radiation response characterization includes X-ray tube and radiation source responses. The characterization results show that the detector's response at the pixels close to the physical edge of the detector depend dramatically on the pixel-to-edge distance.

  16. FPIX2: A radiation-hard pixel readout chip for BTeV

    SciTech Connect

    David C. Christian et al.

    2000-12-11

    A radiation-hard pixel readout chip, FPIX2, is being developed at Fermilab for the recently approved BTeV experiment. Although designed for BTeV, this chip should also be appropriate for use by CDF and DZero. A short review of this development effort is presented. Particular attention is given to the circuit redesign which was made necessary by the decision to implement FPIX2 using a standard deep-submicron CMOS process rather than an explicitly radiation-hard CMOS technology, as originally planned. The results of initial tests of prototype 0.25{micro} CMOS devices are presented, as are plans for the balance of the development effort.

  17. AC Read-Out Circuits for Single Pixel Characterization of TES Microcalorimeters and Bolometers

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; van de Kuur, J.; Bandler, S.; Bruijn, M.; de Korte, P.; Gao, J. R.; den Hartog, R.; Hijmering, R. A.; Hoevers, H.; Koshropanah, P.; Kilbourne, C.; Lindemann, M. A.; Parra Borderias, M.; Ridder, M.

    2011-01-01

    SRON is developing Frequency Domain Multiplexing (FDM) for the read-out of transition edge sensor (TES) soft x-ray microcalorimeters for the XMS instrument of the International X-ray Observatory and far-infrared bolometers for the SAFARI instrument on the Japanese mission SPICA. In FDM the TESs are AC voltage biased at frequencies from 0.5 to 6 MHz in a superconducting LC resonant circuit and the signal is read-out by low noise and high dynamic range SQUIDs amplifiers. The TES works as an amplitude modulator. We report on several AC bias experiments performed on different detectors. In particular, we discuss the results on the characterization of Goddard Space Flight Center x-ray pixels and SRON bolometers. The paper focuses on the analysis of different read-out configurations developed to optimize the noise and the impedance matching between the detectors and the SQUID amplifier. A novel feedback network electronics has been developed to keep the SQUID in flux locked loop, when coupled to superconducting high Q circuits, and to optimally tune the resonant bias circuit. The achieved detector performances are discussed in view of the instrument requirement for the two space missions.

  18. A vertically integrated pixel readout device for the Vertex Detector at the International Linear Collider

    SciTech Connect

    Deptuch, Grzegorz; Christian, David; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2008-12-01

    3D-Integrated Circuit technology enables higher densities of electronic circuitry per unit area without the use of nanoscale processes. It is advantageous for mixed mode design with precise analog circuitry because processes with conservative feature sizes typically present lower process dispersions and tolerate higher power supply voltages, resulting in larger separation of a signal from the noise floor. Heterogeneous wafers (different foundries or different process families) may be combined with some 3D integration methods, leading to the optimization of each tier in the 3D stack. Tracking and vertexing in future High-Energy Physics (HEP) experiments involves construction of detectors composed of up to a few billions of channels. Readout electronics must record the position and time of each measurement with the highest achievable precision. This paper reviews a prototype of the first 3D readout chip for HEP, designed for a vertex detector at the International Linear Collider. The prototype features 20 x 20 {micro}m{sup 2} pixels, laid out in an array of 64 x 64 elements and was fabricated in a 3-tier 0.18 {micro}m Fully Depleted SOI CMOS process at MIT-Lincoln Laboratory. The tests showed correct functional operation of the structure. The chip performs a zero-suppressed readout. Successive submissions are planned in a commercial 3D bulk 0.13 {micro}m CMOS process to overcome some of the disadvantages of an FDSOI process.

  19. Method of acquiring an image from an optical structure having pixels with dedicated readout circuits

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2006-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  20. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    NASA Technical Reports Server (NTRS)

    Kimble, Randy A.; Pain, B.; Norton, T. J.; Haas, P.; Fisher, Richard R. (Technical Monitor)

    2001-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution for the readout while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest or by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  1. Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

    NASA Astrophysics Data System (ADS)

    Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P. L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C. A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.; Mugnier, H.; Musa, L.; Puggioni, C.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Siddhanta, S.; Usai, G.; van Hoorne, J. W.; Yi, J.

    2015-06-01

    Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

  2. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    NASA Technical Reports Server (NTRS)

    Kimble, Randy A.; Pain, Bedabrata; Norton, Timothy J.; Haas, J. Patrick; Oegerle, William R. (Technical Monitor)

    2002-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest of by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  3. A low power cryogenic 512 × 512-pixel infrared readout integrated circuit with modified MOS device model

    NASA Astrophysics Data System (ADS)

    Zhao, Hongliang; Liu, Xinghui; Xu, Chao

    2013-11-01

    A low power cryogenic readout integrated circuit (ROIC) for 512 × 512-pixel infrared focal plane array (IRFPA) image system, is presented. In order to improve the precision of the circuit simulation at cryogenic temperatures, a modified MOS device model is proposed. The model is based on BSIM3 model, and uses correction parameters to describe carrier freeze-out effect at low temperatures to improve the fitting accuracy for low temperature MOS device simulation. A capacitive trans-impedance amplifier (CTIA) with inherent correlated double sampling (CDS) configuration is employed to realize a high performance readout interfacing circuit in a pixel area of 30 × 30 μm2. Optimized column readout timing and structure are applied to reduce the power consumption. The experimental chip fabricated by a standard 0.35 μm 2P4M CMOS process shows more than 10 MHz readout rate with less than 70 mW power consumption under 3.3 V supply voltage at 77-150 K operated temperatures. And it occupies an area of 18 × 17 mm2.

  4. A prototype of a new generation readout ASIC in 65nm CMOS for pixel detectors at HL-LHC

    NASA Astrophysics Data System (ADS)

    Monteil, E.; Pacher, L.; Paternò, A.; Loddo, F.; Demaria, N.; Gaioni, L.; De Canio, F.; Traversi, G.; Re, V.; Ratti, L.; Rivetti, A.; Da Rocha Rolo, M.; Dellacasa, G.; Mazza, G.; Marzocca, C.; Licciulli, F.; Ciciriello, F.; Marconi, S.; Placidi, P.; Magazzù, G.; Stabile, A.; Mattiazzo, S.; Veri, C.

    2016-12-01

    This paper describes a readout ASIC prototype designed by CHIPIX65 project, part of RD53, for a pixel detector at HL-LHC . A 64 × 64 matrix of 50 × 50 μ m2 pixels is realised. A digital architecture has been developed, with particle efficiency above 99.9% at 3 GHz/cm2 pixel rate, 1 MHz trigger rate with 12.5 μ s latency. Two analog front end designs, one synchronous and one asynchronous, are implemented. Charge is measured with 5-bit precision and the analog dead-time is below 1%. IP-blocks (DAC, ADC, BandGap, SER, sLVS-TX/RX) and very front ends are silicon proven, irradiated to 600-800Mrad.

  5. A prototype of pixel readout ASIC in 65 nm CMOS technology for extreme hit rate detectors at HL-LHC

    NASA Astrophysics Data System (ADS)

    Paternò, A.; Pacher, L.; Monteil, E.; Loddo, F.; Demaria, N.; Gaioni, L.; De Canio, F.; Traversi, G.; Re, V.; Ratti, L.; Rivetti, A.; Da Rocha Rolo, M.; Dellacasa, G.; Mazza, G.; Marzocca, C.; Licciulli, F.; Ciciriello, F.; Marconi, S.; Placidi, P.; Magazzù, G.; Stabile, A.; Mattiazzo, S.; Veri, C.

    2017-02-01

    This paper describes a readout ASIC prototype designed by the CHIPIX65 project, part of RD53, for a pixel detector at HL-LHC . A 64×64 matrix of 50×50μm2 pixels is realised. A digital architecture has been developed, with particle efficiency above 99.5% at 3 GHz/cm2 pixel rate, trigger frequency of 1 MHz and 12.5μsec latency. Two analog front end designs, one synchronous and one asynchronous, are implemented. Charge is measured with 5-bit precision, analog dead-time below 1%. The chip integrates for the first time many of the components developed by the collaboration in the past, including the Digital-to-Analog converters, Bandgap reference, Serializer, sLVS drivers, and analog Front Ends. Irradiation tests on these components proved their reliability up to 600 Mrad.

  6. A compact 64-pixel CsI(T1)/Si PIN photodiode imaging module with IC readout

    SciTech Connect

    Gruber, Gregory J.; Choong, Woon-Seng; Moses, William W.; Derenzo, Stephen E.; Holland, Stephen E.; Pedrali-Noy, Marzio; Krieger, Brad; Mandelli, Emanuele; Meddeler, Gerrit; Wang, Nadine W.

    2001-08-09

    We characterize the performance of a complete 64-pixel compact gamma camera imaging module consisting of optically isolated 3 mm 3 mm 5 mm CsI(Tl) crystals coupled to a custom array of low-noise Si PIN photodiodes read out by a custom IC. At 50 V bias the custom 64-pixel photodiode arrays demonstrate an average leakage current of 28 pA per 3 mm 3 mm pixel, a 98.5 percent yield of pixels with <100 pA leakage, and a quantum efficiency of about 80 percent for 540 nm CsI(Tl) scintillation photons. The custom 64-channel readout IC uses low-noise preamplifiers, shaper amplifiers, and a winner-take-all (WTA) multiplexer. The IC demonstrates maximum gain of 120 mV / 1000 e-, the ability to select the largest input signal in less than 150 ns, and low electronic noise at 8 ms peaking time ranging from 25 e- rms (unloaded) to an estimated 180 e- rms (photodiode load of 3 pF, 50 pA). At room temperature a complete 64-pixel detector module employing a custom photodiode array and readout IC demonstrates an average energy resolution of 23.4 percent fwhm and an intrinsic spatial resolution of 3.3 mm fwhm for the 140 keV emissions of 99mTc. Construction of an array of such imaging modules is straightforward, hence this technology shows strong potential for numerous compact gamma camera applications, including scintimammography.

  7. Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

    NASA Astrophysics Data System (ADS)

    Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

    2015-05-01

    In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R&D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision.

  8. Method and apparatus of high dynamic range image sensor with individual pixel reset

    NASA Technical Reports Server (NTRS)

    Yadid-Pecht, Orly (Inventor); Pain, Bedabrata (Inventor); Fossum, Eric R. (Inventor)

    2001-01-01

    A wide dynamic range image sensor provides individual pixel reset to vary the integration time of individual pixels. The integration time of each pixel is controlled by column and row reset control signals which activate a logical reset transistor only when both signals coincide for a given pixel.

  9. Readout circuit with pixel-level analog-to-digital conversion

    NASA Astrophysics Data System (ADS)

    Gan, Wenxiang; Ding, Ruijun; Ni, Yunzhi

    2005-01-01

    Pixel level on-focal-plane analog to digital conversion(ADC) promises many advantages including high performance and low power consumption. In this paper we argue that CMOS technology scaling will make pixel level ADC increasingly popular. Then we introduce four existing techniques for pixel level ADC. The first is an over sampling technique which uses a one bit first order sigma delta modulator for each pixel to directly convert photo charge to bits, consists of an integrator, a one bit DAC and a clocked comparator. The second technique is Nyquist rate multi-channel-bit-serial(MCBS) ADC. The technique uses special successive comparisons to convert the pixel voltage to bits. The third technique bases on a simple and robust pulse frequency modulation(PFM) scheme that can convert the photocurrent of photodetectors to proportional pulse frequency. The fourth is a software-controlled ADC, which utilize a algorithm, takes a desired photocurrent quantization scale to output bits. Each pixel contains a programmable digital processing element which directly controls the behavior of the photo detector with software. These four techniques are analyzed and compared according to their advantages, disadvantages and suitable application area. Finally we mention our current and future works with one of these techniques.

  10. A 65 nm pixel readout ASIC with quick transverse momentum discrimination capabilities for the CMS Tracker at HL-LHC

    NASA Astrophysics Data System (ADS)

    Ceresa, D.; Kaplon, J.; Francisco, R.; Caratelli, A.; Kloukinas, K.; Marchioro, A.

    2016-01-01

    A readout ASIC for the hybrid pixel detector with the capability of performing quick recognition of particles with high transverse momentum has been designed for the requirements of the CMS Outer Tracker at the High Luminosity LHC . The particle momentum dicrimination capability represents the main challenge for this design together with the low power requirement: the constraint of low mass for the new tracker dictates a total power budget of less than 100 mW/cm2. The choice of a 65 nm CMOS technology has made it possible to satisfy this power requirement despite the fairly large amount of logic necessary to perform the momentum discrimination and the continuous operation at 40 MHz. Several techniques for low power have been used to implement this logic that performs cluster reduction, position offset correction and coordinate encoding. A prototype chip including a large part of the final functionality and the full front-end has been realized and comprises a matrix of 16 by 3 rectangular pixels of 100 μm × 1446 μm, providing 7.65 mm2 of segmented active area. Measurements of the analog front-end characteristics closely match the simulations and confirm the consumption of < 30 μA per pixel. Front-end characterization and irradiation results up to 150 MRad are also reported.

  11. Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs

    NASA Astrophysics Data System (ADS)

    Unno, Y.; Kamada, S.; Yamamura, K.; Yamamoto, H.; Hanagaki, K.; Hori, R.; Ikegami, Y.; Nakamura, K.; Takubo, Y.; Takashima, R.; Tojo, J.; Kono, T.; Nagai, R.; Saito, S.; Sugibayashi, K.; Hirose, M.; Jinnouchi, O.; Sato, S.; Sawai, H.; Hara, K.; Sato, Kz.; Sato, Kj.; Iwabuchi, S.; Suzuki, J.

    2017-01-01

    We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n+-in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in wafer. Variation in readout connection for the pixels at the boundary of ASICs is implemented in the design of quadsensors. Bump bonding technology is developed for four ASICs onto one quadsensor. Both sensors and ASICs are thinned to 150 μm before bump bonding, and are held flat with vacuum chucks. Using lead-free SnAg solder bumps, we encounter deficiency with large areas of disconnected bumps after thermal stress treatment, including irradiation. Surface oxidation of the solder bumps is identified as a critical source of this deficiency after bump bonding trials, using SnAg bumps with solder flux, indium bumps, and SnAg bumps with a newly-introduced hydrogen-reflow process. With hydrogen-reflow, we establish flux-less bump bonding technology with SnAg bumps, appropriate for mass production of the flip-chip modules with thin sensors and thin ASICs.

  12. A pixel unit-cell targeting 16 ns resolution and radiation hardness in a column read-out particle vertex detector

    SciTech Connect

    Wright, M.; Millaud, J.; Nygren, D.

    1992-10-01

    A pixel unit cell (PUC) circuit architecture, optimized for a column read out architecture, is reported. Each PUC contains an integrator, active filter, comparator, and optional analog store. The time-over-threshold (TOT) discriminator allows an all-digital interface to the array periphery readout while passing an analog measure of collected charge. Use of (existing) radiation hard processes, to build a detector bump-bonded to a pixel readout array, is targeted. Here, emphasis is on a qualitative explanation of how the unique circuit implementation benefits operation for Super Collider (SSC) detector application.

  13. Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors

    NASA Astrophysics Data System (ADS)

    Gaioni, Luigi; Manghisoni, Massimo; Ratti, Lodovico; Re, Valerio; Traversi, Gianluca

    2011-09-01

    In future high energy physics experiments (HEP), readout integrated circuits for vertexing and tracking applications will be implemented by means of CMOS devices belonging to processes with minimum feature size in the 100 nm span. In these nanoscale technologies the impact of new dielectric materials and processing techniques on the analog behavior of MOSFETs has to be carefully evaluated. This paper is concerned with the study of the analog properties, in particular in terms of noise performance and radiation hardness, of MOSFET devices belonging to a 65 nm CMOS low power technology. The behavior of the 1/ f and white noise terms is studied as a function of the main device parameters before and after exposure to 10 keV X-rays and 60Co γ-rays. A prototype chip designed in a 65 nm CMOS process including deep n-well MAPS structures and a fast front-end conceived for the readout of high-resistivity pixel sensors will be introduced.

  14. A silicon pixel readout ASIC with 100 ps time resolution for the NA62 experiment

    NASA Astrophysics Data System (ADS)

    Dellacasa, G.; Garbolino, S.; Marchetto, F.; Martoiu, S.; Mazza, G.; Rivetti, A.; Wheadon, R.

    2011-01-01

    The silicon tracker of the NA62 experiment requires the measurement of the particles arrival time with a resolution better than 200 ps rms and a spatial resolution of 300 μm. A time measurement technique based on a Time to Amplitude Converter has been implemented in an ASIC in order to prove the possibility to integrate a TDC with resolution better than 200 ps in a pixel cell. Time-walk problem has been addressed with the use of the Constant Fraction Discriminator technique. The ASIC has been designed in a CMOS 0.13 μm technology with single event upset protection of the digital logic.

  15. Toward VIP-PIX: A Low Noise Readout ASIC for Pixelated CdTe Gamma-Ray Detectors for Use in the Next Generation of PET Scanners.

    PubMed

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Puigdengoles, Carles; Lorenzo, Gianluca De; Martínez, Ricardo

    2013-08-01

    VIP-PIX will be a low noise and low power pixel readout electronics with digital output for pixelated Cadmium Telluride (CdTe) detectors. The proposed pixel will be part of a 2D pixel-array detector for various types of nuclear medicine imaging devices such as positron-emission tomography (PET) scanners, Compton gamma cameras, and positron-emission mammography (PEM) scanners. Each pixel will include a SAR ADC that provides the energy deposited with 10-bit resolution. Simultaneously, the self-triggered pixel which will be connected to a global time-to-digital converter (TDC) with 1 ns resolution will provide the event's time stamp. The analog part of the readout chain and the ADC have been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and characterized with an external test pulse. The power consumption of these parts is 200 μW from a 2.5 V supply. It offers 4 switchable gains from ±10 mV/fC to ±40 mV/fC and an input charge dynamic range of up to ±70 fC for the minimum gain for both polarities. Based on noise measurements, the expected equivalent noise charge (ENC) is 65 e(-) RMS at room temperature.

  16. Toward VIP-PIX: A Low Noise Readout ASIC for Pixelated CdTe Gamma-Ray Detectors for Use in the Next Generation of PET Scanners

    PubMed Central

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Puigdengoles, Carles; Lorenzo, Gianluca De; Martínez, Ricardo

    2013-01-01

    VIP-PIX will be a low noise and low power pixel readout electronics with digital output for pixelated Cadmium Telluride (CdTe) detectors. The proposed pixel will be part of a 2D pixel-array detector for various types of nuclear medicine imaging devices such as positron-emission tomography (PET) scanners, Compton gamma cameras, and positron-emission mammography (PEM) scanners. Each pixel will include a SAR ADC that provides the energy deposited with 10-bit resolution. Simultaneously, the self-triggered pixel which will be connected to a global time-to-digital converter (TDC) with 1 ns resolution will provide the event’s time stamp. The analog part of the readout chain and the ADC have been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and characterized with an external test pulse. The power consumption of these parts is 200 μW from a 2.5 V supply. It offers 4 switchable gains from ±10 mV/fC to ±40 mV/fC and an input charge dynamic range of up to ±70 fC for the minimum gain for both polarities. Based on noise measurements, the expected equivalent noise charge (ENC) is 65 e− RMS at room temperature. PMID:24187382

  17. The RD53 collaboration's SystemVerilog-UVM simulation framework and its general applicability to design of advanced pixel readout chips

    NASA Astrophysics Data System (ADS)

    Marconi, S.; Conti, E.; Placidi, P.; Christiansen, J.; Hemperek, T.

    2014-10-01

    The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). This work is focused on the implemented simulation and verification environment named VEPIX53, built using the SystemVerilog language and the Universal Verification Methodology (UVM) class library in the framework of the RD53 Collaboration. The environment supports pixel chips at different levels of description: its reusable components feature the generation of different classes of parameterized input hits to the pixel matrix, monitoring of pixel chip inputs and outputs, conformity checks between predicted and actual outputs and collection of statistics on system performance. The environment has been tested performing a study of shared architectures of the trigger latency buffering section of pixel chips. A fully shared architecture and a distributed one have been described at behavioral level and simulated; the resulting memory occupancy statistics and hit loss rates have subsequently been compared.

  18. A Pixel Readout Chip in 40 nm CMOS Process for High Count Rate Imaging Systems with Minimization of Charge Sharing Effects

    SciTech Connect

    Maj, Piotr; Grybos, P.; Szczgiel, R.; Kmon, P.; Drozd, A.; Deptuch, G.

    2013-11-07

    We present a prototype chip in 40 nm CMOS technology for readout of hybrid pixel detector. The prototype chip has a matrix of 18x24 pixels with a pixel pitch of 100 μm. It can operate both in single photon counting (SPC) mode and in C8P1 mode. In SPC the measured ENC is 84 erms (for the peaking time of 48 ns), while the effective offset spread is below 2 mV rms. In the C8P1 mode the chip reconstructs full charge deposited in the detector, even in the case of charge sharing, and it identifies a pixel with the largest charge deposition. The chip architecture and preliminary measurements are reported.

  19. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    PubMed Central

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W.; Szczygiel, Robert; Sandy, Alec

    2016-01-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. The potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed. PMID:27140146

  20. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    DOE PAGES

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; ...

    2016-01-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. As a result, the potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  1. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    SciTech Connect

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W.; Szczygiel, Robert; Sandy, Alec

    2016-01-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. As a result, the potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  2. Simulation of digital pixel readout chip architectures with the RD53 SystemVerilog-UVM verification environment using Monte Carlo physics data

    NASA Astrophysics Data System (ADS)

    Conti, E.; Marconi, S.; Christiansen, J.; Placidi, P.; Hemperek, T.

    2016-01-01

    The simulation and verification framework developed by the RD53 collaboration is a powerful tool for global architecture optimization and design verification of next generation hybrid pixel readout chips. In this paper the framework is used for studying digital pixel chip architectures at behavioral level. This is carried out by simulating a dedicated, highly parameterized pixel chip description, which makes it possible to investigate different grouping strategies between pixels and different latency buffering and arbitration schemes. The pixel hit information used as simulation input can be either generated internally in the framework or imported from external Monte Carlo detector simulation data. The latter have been provided by both the CMS and ATLAS experiments, featuring HL-LHC operating conditions and the specifications related to the Phase 2 upgrade. Pixel regions and double columns were simulated using such Monte Carlo data as inputs: the performance of different latency buffering architectures was compared and the compliance of different link speeds with the expected column data rate was verified.

  3. First functionality tests of a 64 × 64 pixel DSSC sensor module connected to the complete ladder readout

    NASA Astrophysics Data System (ADS)

    Donato, M.; Hansen, K.; Kalavakuru, P.; Kirchgessner, M.; Kuster, M.; Porro, M.; Reckleben, C.; Turcato, M.

    2017-03-01

    The European X-ray Free Electron Laser (XFEL.EU) will provide every 0.1 s a train of 2700 spatially coherent ultrashort X-ray pulses at 4.5 MHz repetition rate. The Small Quantum Systems (SQS) instrument and the Spectroscopy and Coherent Scattering instrument (SCS) operate with soft X-rays between 0.5 keV–6 keV. The DEPFET Sensor with Signal Compression (DSSC) detector is being developed to meet the requirements set by these two XFEL.EU instruments. The DSSC imager is a 1 mega-pixel camera able to store up to 800 single-pulse images per train. The so-called ladder is the basic unit of the DSSC detector. It is the single unit out of sixteen identical-units composing the DSSC-megapixel camera, containing all representative electronic components of the full-size system and allows testing the full electronic chain. Each DSSC ladder has a focal plane sensor with 128× 512 pixels. The read-out ASIC provides full-parallel readout of the sensor pixels. Every read-out channel contains an amplifier and an analog filter, an up-to 9 bit ADC and the digital memory. The ASIC amplifier have a double front-end to allow one to use either DEPFET sensors or Mini-SDD sensors. In the first case, the signal compression is a characteristic intrinsic of the sensor; in the second case, the compression is implemented at the first amplification stage. The goal of signal compression is to meet the requirement of single-photon detection capability and wide dynamic range. We present the first results of measurements obtained using a 64× 64 pixel DEPFET sensor attached to the full final electronic and data-acquisition chain.

  4. Uncooled digital IRFPA-family with 17μm pixel-pitch based on amorphous silicon with massively parallel Sigma-Delta-ADC readout

    NASA Astrophysics Data System (ADS)

    Weiler, D.; Hochschulz, F.; Würfel, D.; Lerch, R.; Geruschke, T.; Wall, S.; Heß, J.; Wang, Q.; Vogt, H.

    2014-06-01

    This paper presents the results of an advanced digital IRFPA-family developed by Fraunhofer IMS. The IRFPA-family compromises the two different optical resolutions VGA (640 ×480 pixel) and QVGA (320 × 240 pixel) by using a pin-compatible detector board. The uncooled IRFPAs are designed for thermal imaging applications in the LWIR (8 .. 14μm) range with a full-frame frequency of 30 Hz and a high thermal sensitivity. The microbolometer with a pixel-pitch of 17μm consists of amorphous silicon as the sensing layer. By scaling and optimizing our previous microbolometer technology with a pixel-pitch of 25μm we enhance the thermal sensitivity of the microbolometer. The microbolometers are read out by a novel readout architecture which utilizes massively parallel on-chip Sigma-Delta-ADCs. This results in a direct digital conversion of the resistance change of the microbolometer induced by incident infrared radiation. To reduce production costs a chip-scale-package is used as vacuum package. This vacuum package consists of an IR-transparent window with an antireflection coating and a soldering frame which is fixed by a wafer-to-chip process directly on top of the CMOS-substrate. The chip-scale-package is placed onto a detector board by a chip-on-board technique. The IRFPAs are completely fabricated at Fraunhofer IMS on 8" CMOS wafers with an additional surface micromachining process. In this paper the architecture of the readout electronics, the packaging, and the electro-optical performance characterization are presented.

  5. Monolithic integration of individually addressable light-emitting diode color pixels

    NASA Astrophysics Data System (ADS)

    Chung, Kunook; Sui, Jingyang; Demory, Brandon; Teng, Chu-Hsiang; Ku, Pei-Cheng

    2017-03-01

    Monolithic integration of individually addressable light-emitting diode (LED) color pixels is reported. The integration is enabled by local strain engineering. The use of a nanostructured active region comprising one or more nanopillars allows color tuning across the visible spectrum. In the current work, integration of amber, green, and blue pixels is demonstrated. The nanopillar LEDs exhibit an electrical performance comparable to that of a conventional thin-film LED fabricated on the same wafer. The proposed platform uses only standard epitaxy and a similar process flow as a conventional LED. It is also shown that the emission intensity can be linearly tuned without shifting the color coordinate of individual pixels.

  6. Experimental characterization of the 192 channel Clear-PEM frontend ASIC coupled to a multi-pixel APD readout of LYSO:Ce crystals

    NASA Astrophysics Data System (ADS)

    Albuquerque, Edgar; Bexiga, Vasco; Bugalho, Ricardo; Carriço, Bruno; Ferreira, Cláudia S.; Ferreira, Miguel; Godinho, Joaquim; Gonçalves, Fernando; Leong, Carlos; Lousã, Pedro; Machado, Pedro; Moura, Rui; Neves, Pedro; Ortigão, Catarina; Piedade, Fernando; Pinheiro, João F.; Rego, Joel; Rivetti, Angelo; Rodrigues, Pedro; Silva, José C.; Silva, Manuel M.; Teixeira, Isabel C.; Teixeira, João P.; Trindade, Andreia; Varela, João

    2009-01-01

    In the framework of the Clear-PEM project for the construction of a high-resolution scanner for breast cancer imaging, a very compact and dense frontend electronics system has been developed for readout of multi-pixel S8550 Hamamatsu APDs. The frontend electronics are instrumented with a mixed-signal Application-Specific Integrated Circuit (ASIC), which incorporates 192 low-noise charge pre-amplifiers, shapers, analog memory cells and digital control blocks. Pulses are continuously stored in memory cells at clock frequency. Channels above a common threshold voltage are readout for digitization by off-chip free-sampling ADCs. The ASIC has a size of 7.3×9.8 mm2 and was implemented in a AMS 0.35 μm CMOS technology. In this paper the experimental characterization of the Clear-PEM frontend ASIC, reading out multi-pixel APDs coupled to LYSO:Ce crystal matrices, is presented. The chips were mounted on a custom test board connected to six APD arrays and to the data acquisition system. Six 32-pixel LYSO:Ce crystal matrices coupled on both sides to APD arrays were readout by two test boards. All 384 channels were operational. The chip power consumption is 660 mW (3.4 mW per channel). A very stable behavior of the chip was observed, with an estimated ENC of 1200-1300e- at APD gain 100. The inter-channel noise dispersion and mean baseline variation is less than 8% and 0.5%, respectively. The spread in the gain between different channels is found to be 1.5%. Energy resolution of 16.5% at 511 keV and 12.8% at 662 keV has been measured. Timing measurements between the two APDs that readout the same crystal is extracted and compared with detailed Monte Carlo simulations. At 511 keV the measured single photon time RMS resolution is 1.30 ns, in very good agreement with the expected value of 1.34 ns.

  7. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Bindi, M.; Falchieri, D.; Gabrielli, A.; Travaglini, R.; Chen, S.-P.; Hsu, S.-C.; Hauck, S.; Kugel, A.

    2014-11-01

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer - the Insertable B-Layer or IBL - located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1.

  8. Photon counting readout pixel array in 0.18-μm CMOS technology for on-line gamma-ray imaging of 103palladium seeds for permanent breast seed implant (PBSI) brachytherapy

    NASA Astrophysics Data System (ADS)

    Goldan, A. H.; Karim, K. S.; Reznik, A.; Caldwell, C. B.; Rowlands, J. A.

    2008-03-01

    Permanent breast seed implant (PBSI) brachytherapy technique was recently introduced as an alternative to high dose rate (HDR) brachytherapy and involves the permanent implantation of radioactive 103Palladium seeds into the surgical cavity of the breast for cancer treatment. To enable accurate seed implantation, this research introduces a gamma camera based on a hybrid amorphous selenium detector and CMOS readout pixel architecture for real-time imaging of 103Palladium seeds during the PBSI procedure. A prototype chip was designed and fabricated in 0.18-μm n-well CMOS process. We present the experimental results obtained from this integrated photon counting readout pixel.

  9. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

    DOE PAGES

    Demaria, N.

    2016-12-21

    This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaborationmore » is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.« less

  10. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

    SciTech Connect

    Demaria, N.

    2016-12-21

    This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.

  11. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

    NASA Astrophysics Data System (ADS)

    Demaria, N.; Barbero, M. B.; Fougeron, D.; Gensolen, F.; Godiot, S.; Menouni, M.; Pangaud, P.; Rozanov, A.; Wang, A.; Bomben, M.; Calderini, G.; Crescioli, F.; Le Dortz, O.; Marchiori, G.; Dzahini, D.; Rarbi, F. E.; Gaglione, R.; Gonella, L.; Hemperek, T.; Huegging, F.; Karagounis, M.; Kishishita, T.; Krueger, H.; Rymaszewski, P.; Wermes, N.; Ciciriello, F.; Corsi, F.; Marzocca, C.; De Robertis, G.; Loddo, F.; Licciulli, F.; Andreazza, A.; Liberali, V.; Shojaii, S.; Stabile, A.; Bagatin, M.; Bisello, D.; Mattiazzo, S.; Ding, L.; Gerardin, S.; Giubilato, P.; Neviani, A.; Paccagnella, A.; Vogrig, D.; Wyss, J.; Bacchetta, N.; De Canio, F.; Gaioni, L.; Nodari, B.; Manghisoni, M.; Re, V.; Traversi, G.; Comotti, D.; Ratti, L.; Vacchi, C.; Beccherle, R.; Bellazzini, R.; Magazzu, G.; Minuti, M.; Morsani, F.; Palla, F.; Poulios, S.; Fanucci, L.; Rizzi, A.; Saponara, S.; Androsov, K.; Bilei, G. M.; Menichelli, M.; Conti, E.; Marconi, S.; Passeri, D.; Placidi, P.; Della Casa, G.; Mazza, G.; Rivetti, A.; Da Rocha Rolo, M. D.; Monteil, E.; Pacher, L.; Gajanana, D.; Gromov, V.; Hessey, N.; Kluit, R.; Zivkovic, V.; Havranek, M.; Janoska, Z.; Marcisovsky, M.; Neue, G.; Tomasek, L.; Kafka, V.; Sicho, P.; Vrba, V.; Vila, I.; Lopez-Morillo, E.; Aguirre, M. A.; Palomo, F. R.; Muñoz, F.; Abbaneo, D.; Christiansen, J.; Dannheim, D.; Dobos, D.; Linssen, L.; Pernegger, H.; Valerio, P.; Alipour Tehrani, N.; Bell, S.; Prydderch, M. L.; Thomas, S.; Christian, D. C.; Fahim, F.; Hoff, J.; Lipton, R.; Liu, T.; Zimmerman, T.; Garcia-Sciveres, M.; Gnani, D.; Mekkaoui, A.; Gorelov, I.; Hoeferkamp, M.; Seidel, S.; Toms, K.; De Witt, J. N.; Grillo, A.; Paternò, A.

    2016-12-01

    This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5-800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. The collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.

  12. ``The Read-Out Driver'' ROD card for the Insertable B-layer (IBL) detector of the ATLAS experiment: commissioning and upgrade studies for the Pixel Layers 1 and 2

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Gabrielli, A.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Morettini, P.; Travaglini, R.; Wensing, M.

    2014-01-01

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL). The IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered for testing with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this paper system setups and results will be described, as well as preliminary studies on changes needed to adopt the ROD for the ATLAS Pixel Layers 1 and 2.

  13. Quantum state readout of individual quantum dots by electrostatic force detection

    NASA Astrophysics Data System (ADS)

    Miyahara, Yoichi; Roy-Gobeil, Antoine; Grutter, Peter

    2017-02-01

    Electric charge detection by atomic force microscopy (AFM) with single-electron resolution (e-EFM) is a promising way to investigate the electronic level structure of individual quantum dots (QDs). The oscillating AFM tip modulates the energy of the QDs, causing single electrons to tunnel between QDs and an electrode. The resulting oscillating electrostatic force changes the resonant frequency and damping of the AFM cantilever, enabling electrometry with a single-electron sensitivity. Quantitative electronic level spectroscopy is possible by sweeping the bias voltage. Charge stability diagram can be obtained by scanning the AFM tip around the QD. e-EFM technique enables to investigate individual colloidal nanoparticles and self-assembled QDs without nanoscale electrodes. e-EFM is a quantum electromechanical system where the back-action of a tunneling electron is detected by AFM; it can also be considered as a mechanical analog of admittance spectroscopy with a radio frequency resonator, which is emerging as a promising tool for quantum state readout for quantum computing. In combination with the topography imaging capability of the AFM, e-EFM is a powerful tool for investigating new nanoscale material systems which can be used as quantum bits.

  14. Improvements of a digital 25 μm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massively parallel Sigma-Delta-ADC readout

    NASA Astrophysics Data System (ADS)

    Weiler, Dirk; Ruß, Marco; Würfel, Daniel; Lerch, Renee; Yang, Pin; Bauer, Jochen; Heß, Jennifer; Kropelnicki, Piotr; Vogt, Holger

    2011-06-01

    This paper presents the improvements of an advanced digital VGA-IRFPA developed by Fraunhofer-IMS. The uncooled IRFPA is designed for thermal imaging applications in the LWIR (8 .. 14 μm) range with a full-frame frequency of 30 Hz and a high sensitivity with NETD < 100 mK @ f/1. The microbolometer with a pixel-pitch of 25 μm consists of amorphous silicon as the sensing layer. The structure of the microbolometer has been optimized for a better performance compared to the 1st generation IRFPA1. The thermal isolation has been doubled by increasing the length and by decreasing the width of the legs. To increase the fill-factor the contact areas have been reduced. The microbolometers are read out by a novel readout architecture which utilizes massively parallel on-chip Sigma-Delta-ADCs. This results in a direct digital conversion of the resistance change of the microbolometer induced by incident infrared radiation. Two different solutions for the vacuum package have been developed. To reduce production costs a chip-scale-package is used. This vacuum package consists of an IR-transparent window with antireflection coating and a soldering frame which is fixed by a wafer-to-chip process directly on top of the read substrate. An alternative solution based on the use of a standard ceramic package is utilized as a vacuum package. This packaging solution is used for high performance applications. The IRFPAs are completely fabricated at Fraunhofer-IMS on 8" CMOS wafers with an additional surface micromachining process.

  15. Serial Pixel Analog-to-Digital Converter

    SciTech Connect

    Larson, E D

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and “one-hot” counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  16. Hit efficiency study of CMS prototype forward pixel detectors

    SciTech Connect

    Kim, Dongwook; /Johns Hopkins U.

    2006-01-01

    In this paper the author describes the measurement of the hit efficiency of a prototype pixel device for the CMS forward pixel detector. These pixel detectors were FM type sensors with PSI46V1 chip readout. The data were taken with the 120 GeV proton beam at Fermilab during the period of December 2004 to February 2005. The detectors proved to be highly efficient (99.27 {+-} 0.02%). The inefficiency was primarily located near the corners of the individual pixels.

  17. Test-beam results of a silicon pixel detector with Time-over-Threshold read-out having ultra-precise time resolution

    NASA Astrophysics Data System (ADS)

    Aglieri Rinella, G.; Cortina Gil, E.; Fiorini, M.; Kaplon, J.; Kluge, A.; Marchetto, F.; Albarran, M. E. Martin; Morel, M.; Noy, M.; Perktold, L.; Tiuraniem, S.; Velghe, B.

    2015-12-01

    A time-tagging hybrid silicon pixel detector developed for beam tracking in the NA62 experiment has been tested in a dedicated test-beam at CERN with 10 GeV/c hadrons. Measurements include time resolution, detection efficiency and charge sharing between pixels, as well as effects due to bias voltage variations. A time resolution of less than 150 ps has been measured with a 200 μm thick silicon sensor, using an on-pixel amplifier-discriminator and an end-of-column DLL-based time-to-digital converter.

  18. TES Detector Noise Limited Readout Using SQUID Multiplexers

    NASA Technical Reports Server (NTRS)

    Staguhn, J. G.; Benford, D. J.; Chervenak, J. A.; Khan, S. A.; Moseley, S. H.; Shafer, R. A.; Deiker, S.; Grossman, E. N.; Hilton, G. C.; Irwin, K. D.

    2004-01-01

    The availability of superconducting Transition Edge Sensors (TES) with large numbers of individual detector pixels requires multiplexers for efficient readout. The use of multiplexers reduces the number of wires needed between the cryogenic electronics and the room temperature electronics and cuts the number of required cryogenic amplifiers. We are using an 8 channel SQUID multiplexer to read out one-dimensional TES arrays which are used for submillimeter astronomical observations. We present results from test measurements which show that the low noise level of the SQUID multiplexers allows accurate measurements of the TES Johnson noise, and that in operation, the readout noise is dominated by the detector noise. Multiplexers for large number of channels require a large bandwidth for the multiplexed readout signal. We discuss the resulting implications for the noise performance of these multiplexers which will be used for the readout of two dimensional TES arrays in next generation instruments.

  19. Backside-illuminated, high-QE, 3e- RoN, fast 700fps, 1760x1680 pixels CMOS imager for AO with highly parallel readout

    NASA Astrophysics Data System (ADS)

    Downing, Mark; Kolb, Johann; Baade, Dietrich; Balard, Philippe; Dierickx, Bart; Defernez, Arnaud; Dupont, Benoit; Feautrier, Philippe; Finger, Gert; Fryer, Martin; Gach, Jean-Luc; Guillaume, Christian; Hubin, Norbert; Iwert, Olaf; Jerram, Paul; Jorden, Paul; Pike, Andrew; Pratlong, Jerome; Reyes, Javier; Stadler, Eric; Walker, Andrew

    2012-07-01

    The success of the next generation of instruments for 8 to 40-m class telescopes will depend upon improving the image quality (correcting the distortion caused by atmospheric turbulence) by exploiting sophisticated Adaptive Optics (AO) systems. One of the critical components of the AO systems for the E-ELT has been identified as the Laser/Natural Guide Star (LGS/NGS) WaveFront Sensing (WFS) detector. The combination of large format, 1760x1680 pixels to finely sample (84x84 sub-apertures) the wavefront and the spot elongation of laser guide stars, fast frame rate of 700 (up to 1000) frames per second, low read noise (< 3e-), and high QE (> 90%) makes the development of such a device extremely challenging. Design studies by industry concluded that a thinned and backside-illuminated CMOS Imager as the most promising technology. This paper describes the multi-phased development plan that will ensure devices are available on-time for E-ELT first-light AO systems; the different CMOS pixel architectures studied; measured results of technology demonstrators that have validated the CMOS Imager approach; the design explaining the approach of massive parallelism (70,000 ADCs) needed to achieve low noise at high pixel rates of ~3 Gpixel/s ; the 88 channel LVDS data interface; the restriction that stitching (required due to the 5x6cm size) posed on the design and the solutions found to overcome these limitations. Two generations of the CMOS Imager will be built: a pioneering quarter sized device of 880x840 pixels capable of meeting first light needs of the E-ELT called NGSD (Natural Guide Star Detector); followed by the full size device, the LGSD (Laser Guide Star Detector). Funding sources: OPTICON FP6 and FP7 from European Commission and ESO.

  20. Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2013-03-01

    The Insertable B-layer (IBL) is a fourth pixel layer that will be added inside the existing ATLAS pixel detector during the long LHC shutdown of 2013 and 2014. The new four layer pixel system will ensure excellent tracking, vertexing and b-tagging performance in the high luminosity pile-up conditions projected for the next LHC run. The peak luminosity is expected to reach 3·1034 cm-2s-1with an integrated luminosity over the IBL lifetime of 300 fb-1 corresponding to a design lifetime fluence of 5·1015 neqcm-2 and ionizing dose of 250 Mrad including safety factors. The production front-end electronics FE-I4B for the IBL has been fabricated at the end of 2011 and has been extensively characterized on diced ICs as well as at the wafer level. The production tests at the wafer level were performed during 2012. Selected results of the diced IC characterization are presented, including measurements of the on-chip voltage regulators. The IBL powering scheme, which was chosen based on these results, is described. Preliminary wafer to wafer distributions as well as yield calculations are given.

  1. Preliminary demonstration of an IonCCD as an alternative pixelated anode for direct MCP readout in a compact MS-based detector.

    PubMed

    Hadjar, Omar; Fowler, William K; Kibelka, Gottfried; Schnute, William C

    2012-02-01

    We report on the preliminary testing of a new position-sensitive detector (PSD) by combining a microchannel plate (MCP) and a charge-sensitive pixilated anode with a direct readout based on charge-coupled detector (CCD) technology, which will be referred to as IonCCD (Hadjar et al. J Am Soc Mass Spectrom 22(4):612-623, 2011; Johnson et al. J Am Soc Mass Spectrom 22(8):1388-1394, 2011; Hadjar et al. J Am Soc Mass Spectrom 22(10):1872-1884, 2011). This work exploits the recently discovered electron detection capability of the IonCCD (Hadjar et al. J Am Soc Mass Spectrom 22(4):612-623, 2011), allowing it to be used directly behind an MC. This MCP-IonCCD configuration potentially obviates the need for electro-optical ion detector systems (EOIDs), which typically feature a relatively difficult-to-implement 5-kV power source as well as a phosphorus screen behind the MCP for conversion of electrons to photons prior to signal generation in a photosensitive CCD. Thus, the new system (MCP-IonCCD) has the potential to be smaller, simpler, more robust, and more cost efficient than EOID-based technologies in many applications. The use of the IonCCD as direct MCP readout anode, as opposed to its direct use as an ion detector, will benefit from the instant three-to-four-order-of-magnitude gain of the MCP with virtually no additional noise. The signal/noise gain can be used for either sensitivity or speed enhancement of the detector. The speed enhancement may motivate the development of faster IonCCD readout speeds (currently at 2.7 ms) to achieve the 2 kHz frame rate for which the IonCCD chip was designed, a must for transient signal applications. The presented detector exhibits clear potential not only as a trace analysis detector in scan-free mass spectrometry and electron spectroscopy but also as a compact detector for photon and particle imaging applications.

  2. Advanced power analysis methodology targeted to the optimization of a digital pixel readout chip design and its critical serial powering system

    NASA Astrophysics Data System (ADS)

    Marconi, S.; Orfanelli, S.; Karagounis, M.; Hemperek, T.; Christiansen, J.; Placidi, P.

    2017-02-01

    A dedicated power analysis methodology, based on modern digital design tools and integrated with the VEPIX53 simulation framework developed within RD53 collaboration, is being used to guide vital choices for the design and optimization of the next generation ATLAS and CMS pixel chips and their critical serial powering circuit (shunt-LDO). Power consumption is studied at different stages of the design flow under different operating conditions. Significant effort is put into extensive investigations of dynamic power variations in relation with the decoupling seen by the powering network. Shunt-LDO simulations are also reported to prove the reliability at the system level.

  3. Serial pixel analog-to-digital converter (ADC)

    NASA Astrophysics Data System (ADS)

    Larson, Eric D.

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and "one-hot" counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  4. Detecting individual extracellular vesicles using a multicolor in situ proximity ligation assay with flow cytometric readout

    PubMed Central

    Löf, Liza; Ebai, Tonge; Dubois, Louise; Wik, Lotta; Ronquist, K. Göran; Nolander, Olivia; Lundin, Emma; Söderberg, Ola; Landegren, Ulf; Kamali-Moghaddam, Masood

    2016-01-01

    Flow cytometry is a powerful method for quantitative and qualitative analysis of individual cells. However, flow cytometric analysis of extracellular vesicles (EVs), and the proteins present on their surfaces has been hampered by the small size of the EVs – in particular for the smallest EVs, which can be as little as 40 nm in diameter, the limited number of antigens present, and their low refractive index. We addressed these limitations for detection and characterization of EV by flow cytometry through the use of multiplex and multicolor in situ proximity ligation assays (in situ PLA), allowing each detected EV to be easily recorded over background noise using a conventional flow cytometer. By targeting sets of proteins on the surface that are specific for distinct classes of EVs, the method allows for selective recognition of populations of EVs in samples containing more than one type of EVs. The method presented herein opens up for analyses of EVs using flow cytometry for their characterization and quantification. PMID:27681459

  5. High-flux ptychographic imaging using the new 55 µm-pixel detector ‘Lambda’ based on the Medipix3 readout chip

    PubMed Central

    Wilke, R. N.; Wallentin, J.; Osterhoff, M.; Pennicard, D.; Zozulya, A.; Sprung, M.; Salditt, T.

    2014-01-01

    Suitable detection systems that are capable of recording high photon count rates with single-photon detection are instrumental for coherent X-ray imaging. The new single-photon-counting pixel detector ‘Lambda’ has been tested in a ptychographic imaging experiment on solar-cell nanowires using Kirkpatrick–Baez-focused 13.8 keV X-rays. Taking advantage of the high count rate of the Lambda and dynamic range expansion by the semi-transparent central stop, a high-dynamic-range diffraction signal covering more than seven orders of magnitude has been recorded, which corresponds to a photon flux density of about 105 photons nm−2 s−1 or a flux of ∼1010 photons s−1 on the sample. By comparison with data taken without the semi-transparent central stop, an increase in resolution by a factor of 3–4 is determined: from about 125 nm to about 38 nm for the nanowire and from about 83 nm to about 21 nm for the illuminating wavefield.

  6. High-flux ptychographic imaging using the new 55 µm-pixel detector ‘Lambda’ based on the Medipix3 readout chip

    SciTech Connect

    Wilke, R. N. Wallentin, J.; Osterhoff, M.; Pennicard, D.; Zozulya, A.; Sprung, M.; Salditt, T.

    2014-11-01

    The Large Area Medipix-Based Detector Array (Lambda) has been used in a ptychographic imaging experiment on solar-cell nanowires. By using a semi-transparent central stop, the high flux density provided by nano-focusing Kirkpatrick–Baez mirrors can be fully exploited for high-resolution phase reconstructions. Suitable detection systems that are capable of recording high photon count rates with single-photon detection are instrumental for coherent X-ray imaging. The new single-photon-counting pixel detector ‘Lambda’ has been tested in a ptychographic imaging experiment on solar-cell nanowires using Kirkpatrick–Baez-focused 13.8 keV X-rays. Taking advantage of the high count rate of the Lambda and dynamic range expansion by the semi-transparent central stop, a high-dynamic-range diffraction signal covering more than seven orders of magnitude has been recorded, which corresponds to a photon flux density of about 10{sup 5} photons nm{sup −2} s{sup −1} or a flux of ∼10{sup 10} photons s{sup −1} on the sample. By comparison with data taken without the semi-transparent central stop, an increase in resolution by a factor of 3–4 is determined: from about 125 nm to about 38 nm for the nanowire and from about 83 nm to about 21 nm for the illuminating wavefield.

  7. In vivo readout of CFTR function: ratiometric measurement of CFTR-dependent secretion by individual, identifiable human sweat glands.

    PubMed

    Wine, Jeffrey J; Char, Jessica E; Chen, Jonathan; Cho, Hyung-Ju; Dunn, Colleen; Frisbee, Eric; Joo, Nam Soo; Milla, Carlos; Modlin, Sara E; Park, Il-Ho; Thomas, Ewart A C; Tran, Kim V; Verma, Rohan; Wolfe, Marlene H

    2013-01-01

    To assess CFTR function in vivo, we developed a bioassay that monitors and compares CFTR-dependent and CFTR-independent sweat secretion in parallel for multiple (~50) individual, identified glands in each subject. Sweating was stimulated by intradermally injected agonists and quantified by optically measuring spherical sweat bubbles in an oil-layer that contained dispersed, water soluble dye particles that partitioned into the sweat bubbles, making them highly visible. CFTR-independent secretion (M-sweat) was stimulated with methacholine, which binds to muscarinic receptors and elevates cytosolic calcium. CFTR-dependent secretion (C-sweat) was stimulated with a β-adrenergic cocktail that elevates cytosolic cAMP while blocking muscarinic receptors. A C-sweat/M-sweat ratio was determined on a gland-by-gland basis to compensate for differences unrelated to CFTR function, such as gland size. The average ratio provides an approximately linear readout of CFTR function: the heterozygote ratio is ~0.5 the control ratio and for CF subjects the ratio is zero. During assay development, we measured C/M ratios in 6 healthy controls, 4 CF heterozygotes, 18 CF subjects and 4 subjects with 'CFTR-related' conditions. The assay discriminated all groups clearly. It also revealed consistent differences in the C/M ratio among subjects within groups. We hypothesize that these differences reflect, at least in part, levels of CFTR expression, which are known to vary widely. When C-sweat rates become very low the C/M ratio also tended to decrease; we hypothesize that this nonlinearity reflects ductal fluid absorption. We also discovered that M-sweating potentiates the subsequent C-sweat response. We then used potentiation as a surrogate for drugs that can increase CFTR-dependent secretion. This bioassay provides an additional method for assessing CFTR function in vivo, and is well suited for within-subject tests of systemic, CFTR-directed therapeutics.

  8. PIXEL PUSHER

    NASA Technical Reports Server (NTRS)

    Stanfill, D. F.

    1994-01-01

    Pixel Pusher is a Macintosh application used for viewing and performing minor enhancements on imagery. It will read image files in JPL's two primary image formats- VICAR and PDS - as well as the Macintosh PICT format. VICAR (NPO-18076) handles an array of image processing capabilities which may be used for a variety of applications including biomedical image processing, cartography, earth resources, and geological exploration. Pixel Pusher can also import VICAR format color lookup tables for viewing images in pseudocolor (256 colors). This program currently supports only eight bit images but will work on monitors with any number of colors. Arbitrarily large image files may be viewed in a normal Macintosh window. Color and contrast enhancement can be performed with a graphical "stretch" editor (as in contrast stretch). In addition, VICAR images may be saved as Macintosh PICT files for exporting into other Macintosh programs, and individual pixels can be queried to determine their locations and actual data values. Pixel Pusher is written in Symantec's Think C and was developed for use on a Macintosh SE30, LC, or II series computer running System Software 6.0.3 or later and 32 bit QuickDraw. Pixel Pusher will only run on a Macintosh which supports color (whether a color monitor is being used or not). The standard distribution medium for this program is a set of three 3.5 inch Macintosh format diskettes. The program price includes documentation. Pixel Pusher was developed in 1991 and is a copyrighted work with all copyright vested in NASA. Think C is a trademark of Symantec Corporation. Macintosh is a registered trademark of Apple Computer, Inc.

  9. Readout of two-kilopixel transition-edge sensor arrays for Advanced ACTPol

    NASA Astrophysics Data System (ADS)

    Henderson, Shawn W.; Stevens, Jason R.; Amiri, Mandana; Austermann, Jason; Beall, James A.; Chaudhuri, Saptarshi; Cho, Hsiao-Mei; Choi, Steve K.; Cothard, Nicholas F.; Crowley, Kevin T.; Duff, Shannon M.; Fitzgerald, Colin P.; Gallardo, Patricio A.; Halpern, Mark; Hasselfield, Matthew; Hilton, Gene; Ho, Shuay-Pwu Patty; Hubmayr, Johannes; Irwin, Kent D.; Koopman, Brian J.; Li, Dale; Li, Yaqiong; McMahon, Jeff; Nati, Federico; Niemack, Michael; Reintsema, Carl D.; Salatino, Maria; Schillaci, Alessandro; Schmitt, Benjamin L.; Simon, Sara M.; Staggs, Suzanne T.; Vavagiakis, Eve M.; Ward, Jonathan T.

    2016-07-01

    Advanced ACTPol is an instrument upgrade for the six-meter Atacama Cosmology Telescope (ACT) designed to measure the cosmic microwave background (CMB) temperature and polarization with arcminute-scale angular resolution. To achieve its science goals, Advanced ACTPol utilizes a larger readout multiplexing factor than any previous CMB experiment to measure detector arrays with approximately two thousand transition-edge sensor (TES) bolometers in each 150 mm detector wafer. We present the implementation and testing of the Advanced ACTPol time-division multiplexing readout architecture with a 64-row multiplexing factor. This includes testing of individual multichroic detector pixels and superconducting quantum interference device (SQUID) multiplexing chips as well as testing and optimizing of the integrated readout electronics. In particular, we describe the new automated multiplexing SQUID tuning procedure developed to select and optimize the thousands of SQUID parameters required to readout each Advanced ACTPol array. The multichroic detector pixels in each array use separate channels for each polarization and each of the two frequencies, such that four TESes must be read out per pixel. Challenges addressed include doubling the number of detectors per multiplexed readout channel compared to ACTPol and optimizing the Nyquist inductance to minimize detector and SQUID noise aliasing.

  10. Improved Signal Chains for Readout of CMOS Imagers

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Hancock, Bruce; Cunningham, Thomas

    2009-01-01

    An improved generic design has been devised for implementing signal chains involved in readout from complementary metal oxide/semiconductor (CMOS) image sensors and for other readout integrated circuits (ICs) that perform equivalent functions. The design applies to any such IC in which output signal charges from the pixels in a given row are transferred simultaneously into sampling capacitors at the bottoms of the columns, then voltages representing individual pixel charges are read out in sequence by sequentially turning on column-selecting field-effect transistors (FETs) in synchronism with source-follower- or operational-amplifier-based amplifier circuits. The improved design affords the best features of prior source-follower-and operational- amplifier-based designs while overcoming the major limitations of those designs. The limitations can be summarized as follows: a) For a source-follower-based signal chain, the ohmic voltage drop associated with DC bias current flowing through the column-selection FET causes unacceptable voltage offset, nonlinearity, and reduced small-signal gain. b) For an operational-amplifier-based signal chain, the required bias current and the output noise increase superlinearly with size of the pixel array because of a corresponding increase in the effective capacitance of the row bus used to couple the sampled column charges to the operational amplifier. The effect of the bus capacitance is to simultaneously slow down the readout circuit and increase noise through the Miller effect.

  11. MONOLITHIC ACTIVE PIXEL MATRIX WITH BINARY COUNTERS IN AN SOI PROCESS.

    SciTech Connect

    DUPTUCH,G.; YAREMA, R.

    2007-06-07

    The design of a Prototype monolithic active pixel matrix, designed in a 0.15 {micro}m CMOS SOI Process, is presented. The process allowed connection between the electronics and the silicon volume under the layer of buried oxide (BOX). The small size vias traversing through the BOX and implantation of small p-type islands in the n-type bulk result in a monolithic imager. During the acquisition time, all pixels register individual radiation events incrementing the counters. The counting rate is up to 1 MHz per pixel. The contents of counters are shifted out during the readout phase. The designed prototype is an array of 64 x 64 pixels and the pixel size is 26 x 26 {micro}m{sup 2}.

  12. Nanosecond monolithic CMOS readout cell

    DOEpatents

    Souchkov, Vitali V.

    2004-08-24

    A pulse shaper is implemented in monolithic CMOS with a delay unit formed of a unity gain buffer. The shaper is formed of a difference amplifier having one input connected directly to an input signal and a second input connected to a delayed input signal through the buffer. An elementary cell is based on the pulse shaper and a timing circuit which gates the output of an integrator connected to the pulse shaper output. A detector readout system is formed of a plurality of elementary cells, each connected to a pixel of a pixel array, or to a microstrip of a plurality of microstrips, or to a detector segment.

  13. Simulation of charge transport in pixelated CdTe

    NASA Astrophysics Data System (ADS)

    Kolstein, M.; Ariño, G.; Chmeissani, M.; De Lorenzo, G.

    2014-12-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 106). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm3 using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points.

  14. Simulation of charge transport in pixelated CdTe

    PubMed Central

    Kolstein, M.; Ariño, G.; Chmeissani, M.; De Lorenzo, G.

    2014-01-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 106). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm3 using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points. PMID:25729404

  15. Simulation of charge transport in pixelated CdTe.

    PubMed

    Kolstein, M; Ariño, G; Chmeissani, M; De Lorenzo, G

    2014-12-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 10(6)). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm(3) using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points.

  16. Pixelated neutron image plates

    NASA Astrophysics Data System (ADS)

    Schlapp, M.; Conrad, H.; von Seggern, H.

    2004-09-01

    Neutron image plates (NIPs) have found widespread application as neutron detectors for single-crystal and powder diffraction, small-angle scattering and tomography. After neutron exposure, the image plate can be read out by scanning with a laser. Commercially available NIPs consist of a powder mixture of BaFBr : Eu2+ and Gd2O3 dispersed in a polymer matrix and supported by a flexible polymer sheet. Since BaFBr : Eu2+ is an excellent x-ray storage phosphor, these NIPs are particularly sensitive to ggr-radiation, which is always present as a background radiation in neutron experiments. In this work we present results on NIPs consisting of KCl : Eu2+ and LiF that were fabricated into ceramic image plates in which the alkali halides act as a self-supporting matrix without the necessity for using a polymeric binder. An advantage of this type of NIP is the significantly reduced ggr-sensitivity. However, the much lower neutron absorption cross section of LiF compared with Gd2O3 demands a thicker image plate for obtaining comparable neutron absorption. The greater thickness of the NIP inevitably leads to a loss in spatial resolution of the image plate. However, this reduction in resolution can be restricted by a novel image plate concept in which a ceramic structure with square cells (referred to as a 'honeycomb') is embedded in the NIP, resulting in a pixelated image plate. In such a NIP the read-out light is confined to the particular illuminated pixel, decoupling the spatial resolution from the optical properties of the image plate material and morphology. In this work, a comparison of experimentally determined and simulated spatial resolutions of pixelated and unstructured image plates for a fixed read-out laser intensity is presented, as well as simulations of the properties of these NIPs at higher laser powers.

  17. Readout of the upgraded ALICE-ITS

    NASA Astrophysics Data System (ADS)

    Szczepankiewicz, A.

    2016-07-01

    The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb-Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

  18. Multiport solid-state imager characterization at variable pixel rates

    SciTech Connect

    Yates, G.J.; Albright, K.A.; Turko, B.T.

    1993-08-01

    The imaging performance of an 8-port Full Frame Transfer Charge Coupled Device (FFT CCD) as a function of several parameters including pixel clock rate is presented. The device, model CCD- 13, manufactured by English Electric Valve (EEV) is a 512 {times} 512 pixel array designed with four individual programmable bidirectional serial registers and eight output amplifiers permitting simultaneous readout of eight segments (128 horizontal {times} 256 vertical pixels) of the array. The imager was evaluated in Los Alamos National Laboratory`s High-Speed Solid-State Imager Test Station at true pixel rates as high as 50 MHz for effective imager pixel rates approaching 400 MHz from multiporting. Key response characteristics measured include absolute responsivity, Charge-Transfer-Efficiency (CTE), dynamic range, resolution, signal-to-noise ratio, and electronic and optical crosstalk among the eight video channels. Preliminary test results and data obtained from the CCD-13 will be presented and the versatility/capabilities of the test station will be reviewed.

  19. Readout IC requirement trends based on a simplified parametric seeker model.

    SciTech Connect

    Osborn, Thor D.

    2010-03-01

    Modern space based optical sensors place substantial demands on the focal plane array readout integrated circuit. Active pixel readout designs offer direct access to individual pixel data but require analog to digital conversion at or near each pixel. Thus, circuit designers must create precise, fundamentally analog circuitry within tightly constrained areas on the integrated circuit. Rapidly changing phenomena necessitate tradeoffs between sampling and conversion speed, data precision, and heat generation adjacent the detector array, especially of concern for thermally sensitive space grade infrared detectors. A simplified parametric model is presented that illustrates seeker system performance and analog to digital conversion requirements trends in the visible through mid-wave infrared, for varying sample rate. Notional limiting-case Earth optical backgrounds were generated using MODTRAN4 with a range of cloud extremes and approximate practical albedo limits for typical surface features from a composite of the Mosart and Aster spectral albedo databases. The dynamic range requirements imposed by these background spectra are discussed in the context of optical band selection and readout design impacts.

  20. Prototype readout electronics for the upgraded ALICE Inner Tracking System

    NASA Astrophysics Data System (ADS)

    Sielewicz, K. M.; Aglieri Rinella, G.; Bonora, M.; Ferencei, J.; Giubilato, P.; Rossewij, M. J.; Schambach, J.; Vanat, T.

    2017-01-01

    The ALICE Collaboration is preparing a major upgrade to the experimental apparatus. A key element of the upgrade is the construction of a new silicon-based Inner Tracking System containing 12 Gpixels in an area of 10 m2. Its readout system consists of 192 readout units that control the pixel sensors and the power units, and deliver the sensor data to the counting room. A prototype readout board has been designed to test: the interface between the sensor modules and the readout electronics, the signal integrity and reliability of data transfer, the interface to the ALICE DAQ and trigger, and the susceptibility of the system to the expected radiation level.

  1. 3D, Flash, Induced Current Readout for Silicon Sensors

    SciTech Connect

    Parker, Sherwood I.

    2014-06-07

    A new method for silicon microstrip and pixel detector readout using (1) 65 nm-technology current amplifers which can, for the first time with silicon microstrop and pixel detectors, have response times far shorter than the charge collection time (2) 3D trench electrodes large enough to subtend a reasonable solid angle at most track locations and so have adequate sensitivity over a substantial volume of pixel, (3) induced signals in addition to, or in place of, collected charge

  2. XAMPS Detectors Readout ASIC for LCLS

    SciTech Connect

    Dragone, A; Pratte, J.F.; Rehak, P.; Carini, G.A.; Herbst, R.; O'Connor, P.; Siddons, D.P.; /BNL, NSLS

    2008-12-18

    An ASIC for the readout of signals from X-ray Active Matrix Pixel Sensor (XAMPS) detectors to be used at the Linac Coherent Light Source (LCLS) is presented. The X-ray Pump Probe (XPP) instrument, for which the ASIC has been designed, requires a large input dynamic range on the order of 104 photons at 8 keV with a resolution of half a photon FWHM. Due to the size of the pixel and the length of the readout line, large input capacitance is expected, leading to stringent requirement on the noise optimization. Furthermore, the large number of pixels needed for a good position resolution and the fixed LCLS beam period impose limitations on the time available for the single pixel readout. Considering the periodic nature of the LCLS beam, the ASIC developed for this application is a time-variant system providing low-noise charge integration, filtering and correlated double sampling. In order to cope with the large input dynamic range a charge pump scheme implementing a zero-balance measurement method has been introduced. It provides an on chip 3-bit coarse digital conversion of the integrated charge. The residual charge is sampled using correlated double sampling into analog memory and measured with the required resolution. The first 64 channel prototype of the ASIC has been fabricated in TSMC CMOS 0.25 {micro}m technology. In this paper, the ASIC architecture and performances are presented.

  3. A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion

    NASA Astrophysics Data System (ADS)

    Ratti, L.; Comotti, D.; Fabris, L.; Grassi, M.; Lodola, L.; Malcovati, P.; Manghisoni, M.; Re, V.; Traversi, G.; Vacchi, C.; Rizzo, G.; Batignani, G.; Bettarini, S.; Casarosa, G.; Forti, F.; Giorgi, M.; Morsani, F.; Paladino, A.; Paoloni, E.; Pancheri, L.; Dalla Betta, G.-F.; Mendicino, R.; Verzellesi, G.; Xu, H.; Benkechkache, M. A.

    2016-09-01

    A readout channel for applications to X-ray diffraction imaging at free electron lasers has been developed in a 65 nm CMOS technology. The analog front-end circuit can achieve an input dynamic range of 100 dB by leveraging a novel signal compression technique based on the non-linear features of MOS capacitors. Trapezoidal shaping is accomplished through a transconductor and a switched capacitor circuit, performing gated integration and correlated double sampling. A small area, low power 10 bit successive approximation register (SAR) ADC, operated in a time-interleaved fashion, is used for numerical conversion of the amplitude measurement. Operation at 5 MHz of the analog channel including the shaper was demonstrated. Also, the channel was found to be compliant with single 1 keV photon resolution at 1.25 MHz. The ADC provides a signal-to-noise ratio (SNR) of 56 dB, corresponding to an equivalent number of bits (ENOB) of 9 bits, and a differential non linearity DNL < 1 LSB at a sampling rate slightly larger than 1.8 MHz.

  4. Use of silicon pixel detectors in double electron capture experiments

    NASA Astrophysics Data System (ADS)

    Cermak, P.; Stekl, I.; Shitov, Yu A.; Mamedov, F.; Rukhadze, E. N.; Jose, J. M.; Cermak, J.; Rukhadze, N. I.; Brudanin, V. B.; Loaiza, P.

    2011-01-01

    A novel experimental approach to search for double electron capture (EC/EC) is discussed in this article. R&D for a new generation EC/EC spectrometer based on silicon pixel detectors (SPDs) has been conducted since 2009 for an upgrade of the TGV experiment. SPDs built on Timepix technology with a spectroscopic readout from each individual pixel are an effective tool to detect the 2νEC/EC signature of the two low energy X-rays hitting two separate pixels. The ability of SPDs to indentify α/β/γ particles and localize them precisely leads to effective background discrimination and thus considerable improvement of the signal-to-background ratio (S/B). A multi-SPD system, called a Silicon Pixel Telescope (SPT), is planned based on the experimental approach of the TGV calorimeter which measures thin foils of enriched EC/EC-isotope sandwiched between HPGe detectors working in coincidence mode. The sources of SPD internal background have been identified by measuring SPD radiopurity with a low-background HPGe detector as well as by long-term SPD background runs in the Modane underground laboratory (LSM, France), and results of these studies are presented.

  5. Proceedings of PIXEL98 -- International pixel detector workshop

    SciTech Connect

    Anderson, D.F.; Kwan, S.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  6. CMOS Active-Pixel Image Sensor With Simple Floating Gates

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Nakamura, Junichi; Kemeny, Sabrina E.

    1996-01-01

    Experimental complementary metal-oxide/semiconductor (CMOS) active-pixel image sensor integrated circuit features simple floating-gate structure, with metal-oxide/semiconductor field-effect transistor (MOSFET) as active circuit element in each pixel. Provides flexibility of readout modes, no kTC noise, and relatively simple structure suitable for high-density arrays. Features desirable for "smart sensor" applications.

  7. SNO+ Readout Electronics Upgrades

    NASA Astrophysics Data System (ADS)

    Bonventre, Richard; Shokair, Timothy; Knapik, Robert

    2012-03-01

    The SNO+ experiment is designed to explore several topics in neutrino physics including neutrinoless double beta decay, reactor antineutrinos, and low energy solar neutrinos. SNO+ uses the existing Sudbury Neutrino Observatory (SNO) detector, with the heavy water target replaced with liquid scintillator. The new target requires an upgrade to the command and control electronics to handle the higher rates expected with scintillation light as compared to Cherenkov light. The readout electronics have been upgraded to autonomously push data to a central data acquisition computer over ethernet from each of the 19 front end crates. The autonomous readout is achieved with a field programmable gate array (FPGA) with an embedded processor. Inside the FPGA fabric a state machine is configured to pull data across the VME-like bus of each crate. A small C program, making use of the open source Light Weight IP (LWIP) libraries, is run directly on the hardware (with no operating system) to push the data via TCP/IP. The hybrid combination of `high-level' C code and a `low-level' VHDL state machine is a cost effective and flexible solution for reading out individual front end crates.

  8. Pixel detectors in 3D technologies for high energy physics

    SciTech Connect

    Deptuch, G.; Demarteau, M.; Hoff, J.; Lipton, R.; Shenai, A.; Yarema, R.; Zimmerman, T.; /Fermilab

    2010-10-01

    This paper reports on the current status of the development of International Linear Collider vertex detector pixel readout chips based on multi-tier vertically integrated electronics. Initial testing results of the VIP2a prototype are presented. The chip is the second embodiment of the prototype data-pushed readout concept developed at Fermilab. The device was fabricated in the MIT-LL 0.15 {micro}m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 {micro}m{sup 2} pixels, laid out in an array of 48 x 48 pixels.

  9. High-voltage pixel sensors for ATLAS upgrade

    NASA Astrophysics Data System (ADS)

    Perić, I.; Kreidl, C.; Fischer, P.; Bompard, F.; Breugnon, P.; Clemens, J.-C.; Fougeron, D.; Liu, J.; Pangaud, P.; Rozanov, A.; Barbero, M.; Feigl, S.; Capeans, M.; Ferrere, D.; Pernegger, H.; Ristic, B.; Muenstermann, D.; Gonzalez Sevilla, S.; La Rosa, A.; Miucci, A.; Nessi, M.; Iacobucci, G.; Backhaus, M.; Hügging, Fabian; Krüger, H.; Hemperek, T.; Obermann, T.; Wermes, N.; Garcia-Sciveres, M.; Quadt, A.; Weingarten, J.; George, M.; Grosse-Knetter, J.; Rieger, J.; Bates, R.; Blue, A.; Buttar, C.; Hynds, D.

    2014-11-01

    The high-voltage (HV-) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex CMOS in-pixel electronics and the compatibility with commercial processes. The sensor element is a deep n-well diode in a p-type substrate. The n-well contains CMOS pixel electronics. The main charge collection mechanism is drift in a shallow, high field region, which leads to a fast charge collection and a high radiation tolerance. We are currently evaluating the use of the high-voltage detectors implemented in 180 nm HV-CMOS technology for the high-luminosity ATLAS upgrade. Our approach is replacing the existing pixel and strip sensors with the CMOS sensors while keeping the presently used readout ASICs. By intelligence we mean the ability of the sensor to recognize a particle hit and generate the address information. In this way we could benefit from the advantages of the HV sensor technology such as lower cost, lower mass, lower operating voltage, smaller pitch, smaller clusters at high incidence angles. Additionally we expect to achieve a radiation hardness necessary for ATLAS upgrade. In order to test the concept, we have designed two HV-CMOS prototypes that can be readout in two ways: using pixel and strip readout chips. In the case of the pixel readout, the connection between HV-CMOS sensor and the readout ASIC can be established capacitively.

  10. A radiation-tolerant electronic readout system for portal imaging

    NASA Astrophysics Data System (ADS)

    Östling, J.; Brahme, A.; Danielsson, M.; Iacobaeus, C.; Peskov, V.

    2004-06-01

    A new electronic portal imaging device, EPID, is under development at the Karolinska Institutet and the Royal Institute of Technology. Due to considerable demands on radiation tolerance in the radiotherapy environment, a dedicated electronic readout system has been designed. The most interesting aspect of the readout system is that it allows to read out ˜1000 pixels in parallel, with all electronics placed outside the radiation beam—making the detector more radiation resistant. In this work we are presenting the function of a small prototype (6×100 pixels) of the electronic readout board that has been tested. Tests were made with continuous X-rays (10-60 keV) and with α particles. The results show that, without using an optimised gas mixture and with an early prototype only, the electronic readout system still works very well.

  11. X-ray Characterization of a Multichannel Smart-Pixel Array Detector

    SciTech Connect

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A.; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 x 48 pixels, each 130 mu m x 130 mu m x 520 mu m thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements.

  12. MEMS Terahertz Focal Plane Array With Optical Readout

    DTIC Science & Technology

    2016-06-01

    THz sensing can be achieved by integrating a metamaterial absorber with bi-material legs to form a sensor . Moveable mirror- like surfaces on the...optical readout system. In this thesis, the construction of the optical readout system for characterization of sensor pixels as well as THz imaging is...THz sensing can be achieved by integrating a metamaterial absorber with bi-material legs to form a sensor . Moveable mirror-like surfaces on the

  13. Commissioning of the CMS Forward Pixel Detector

    SciTech Connect

    Kumar, Ashish; /SUNY, Buffalo

    2008-12-01

    The Compact Muon Solenoid (CMS) experiment is scheduled for physics data taking in summer 2009 after the commissioning of high energy proton-proton collisions at Large Hadron Collider (LHC). At the core of the CMS all-silicon tracker is the silicon pixel detector, comprising three barrel layers and two pixel disks in the forward and backward regions, accounting for a total of 66 million channels. The pixel detector will provide high-resolution, 3D tracking points, essential for pattern recognition and precise vertexing, while being embedded in a hostile radiation environment. The end disks of the pixel detector, known as the Forward Pixel detector, has been assembled and tested at Fermilab, USA. It has 18 million pixel cells with dimension 100 x 150 {micro}m{sup 2}. The complete forward pixel detector was shipped to CERN in December 2007, where it underwent extensive system tests for commissioning prior to the installation. The pixel system was put in its final place inside the CMS following the installation and bake out of the LHC beam pipe in July 2008. It has been integrated with other sub-detectors in the readout since September 2008 and participated in the cosmic data taking. This report covers the strategy and results from commissioning of CMS forward pixel detector at CERN.

  14. Design and characterization of high precision in-pixel discriminators for rolling shutter CMOS pixel sensors with full CMOS capability

    NASA Astrophysics Data System (ADS)

    Fu, Y.; Hu-Guo, C.; Dorokhov, A.; Pham, H.; Hu, Y.

    2013-07-01

    In order to exploit the ability to integrate a charge collecting electrode with analog and digital processing circuitry down to the pixel level, a new type of CMOS pixel sensors with full CMOS capability is presented in this paper. The pixel array is read out based on a column-parallel read-out architecture, where each pixel incorporates a diode, a preamplifier with a double sampling circuitry and a discriminator to completely eliminate analog read-out bottlenecks. The sensor featuring a pixel array of 8 rows and 32 columns with a pixel pitch of 80 μm×16 μm was fabricated in a 0.18 μm CMOS process. The behavior of each pixel-level discriminator isolated from the diode and the preamplifier was studied. The experimental results indicate that all in-pixel discriminators which are fully operational can provide significant improvements in the read-out speed and the power consumption of CMOS pixel sensors.

  15. Status of the CMS Phase I pixel detector upgrade

    NASA Astrophysics Data System (ADS)

    Spannagel, S.

    2016-09-01

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  16. Active pixel sensor pixel having a photodetector whose output is coupled to an output transistor gate

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Nakamura, Junichi (Inventor); Kemeny, Sabrina E. (Inventor)

    2005-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node. There is also a readout circuit, part of which can be disposed at the bottom of each column of cells and be common to all the cells in the column. A Simple Floating Gate (SFG) pixel structure could also be employed in the imager to provide a non-destructive readout and smaller pixel sizes.

  17. Massively Parallel Atomic Force Microscope with Digital Holographic Readout

    NASA Astrophysics Data System (ADS)

    Sache, L.; Kawakatsu, H.; Emery, Y.; Bleuler, H.

    2007-03-01

    Massively Parallel Scanning Probe Microscopy is an obvious path for data storage (E Grochowski, R F Hoyt, Future Trends in Hard disc Drives, IEEE Trans. Magn. 1996, 32, 1850- 1854; J L Griffin, S W Schlosser, G R Ganger and D F Nagle, Modeling and Performance of MEMS-Based Storage Devices, Proc. ACM SIGMETRICS, 2000). Current experimental systems still lay far behind Hard Disc Drive (HDD) or Digital Video Disk (DVD), be it in access speed, data throughput, storage density or cost per bit. This paper presents an entirely new approach with the promise to break several of these barriers. The key idea is readout of a Scanning Probes Microscope (SPM) array by Digital Holographic Microscopy (DHM). This technology directly gives phase information at each pixel of a CCD array. This means that no contact line to each individual SPM probes is needed. The data is directly available in parallel form. Moreover, the optical setup needs in principle no expensive components, optical (or, to a large extent, mechanical) imperfections being compensated in the signal processing, i.e. in electronics. This gives the system the potential for a low cost device with fast Terabit readout capability.

  18. Counting x-ray line detector with monolithically integrated readout circuits

    NASA Astrophysics Data System (ADS)

    Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Meyendorf, N.

    2013-05-01

    The developed direct converting X-ray line detectors offer a number of advantages in comparison to other X-ray sensor concepts. Direct converting X-ray detectors are based on absorption of X-rays in semiconductor material, which leads to a generation of charge carriers. By applying high bias voltage charge carriers can be separated and with this the arising current pulse can be assessed by suitable readout integrated circuits (ICs) subsequently. The X-ray absorber itself is implemented as a diode based on GaAs to use it in the reverse direction. It exhibits low dark currents and can therefore be used at room temperatures. The GaAs absorber has a structured top electrode designed on variable bonding and high breakdown voltages. The implemented GaAs absorber exhibits a pixel size of 100 μm while the readout IC features fast dead-time-free readout, energy discrimination by two individually adjustable thresholds with 20 bit deep counters and radiation-hard design on chip level. These properties guarantee the application as fast and thus sensitive line detector for imaging processes. Another advantage of the imaging line detector is the cascadability of several sensor modules with 1024 pixels each. This property ensures that the 102.4 mm long sensor modules can be concatenated virtually with arbitrary length gaplessly. The readout ICs hitting radiation dose can be further minimized by implementing constructive steps to ensure longer lifetime of the sensor module. Furthermore, first results using the introduced sensor module for solid state X-ray detection are discussed.

  19. Pixel Perfect

    SciTech Connect

    Perrine, Kenneth A.; Hopkins, Derek F.; Lamarche, Brian L.; Sowa, Marianne B.

    2005-09-01

    cubic warp. During image acquisitions, the cubic warp is evaluated by way of forward differencing. Unwanted pixelation artifacts are minimized by bilinear sampling. The resulting system is state-of-the-art for biological imaging. Precisely registered images enable the reliable use of FRET techniques. In addition, real-time image processing performance allows computed images to be fed back and displayed to scientists immediately, and the pipelined nature of the FPGA allows additional image processing algorithms to be incorporated into the system without slowing throughput.

  20. Back-Side Readout Silicon Photomultiplier.

    PubMed

    Choong, Woon-Seng; Holland, Stephen E

    2012-07-19

    We present a novel structure for the back-side readout silicon photomultipler (SiPM). Current SiPMs are front-illuminated structures with front-side readout, which have relatively small geometric fill factor leading to degradation in their photon detection efficiency (PDE). Back-side readout devices will provide an advantageous solution to achieve high PDE. We designed and investigated a novel structure that would allow back-side readout while creating a region of high electric field optimized for avalanche breakdown. In addition, this structure has relatively high fill factor and also allow direct coupling of individual micro-cell of the SiPM to application-specific integrated circuits. We will discuss the performance that can be attained with this structure through device simulation and the process flow that can be used to fabricate this structure through process simulation.

  1. Polycrystalline Mercuric Iodide Films on CMOS Readout Arrays

    PubMed Central

    Hartsough, Neal E.; Iwanczyk, Jan S.; Nygard, Einar; Malakhov, Nail; Barber, William C.; Gandhi, Thulasidharan

    2009-01-01

    We have created high-resolution x-ray imaging devices using polycrystalline mercuric iodide (HgI2) films grown directly onto CMOS readout chips using a thermal vapor transport process. Images from prototype 400×400 pixel HgI2-coated CMOS readout chips are presented, where the pixel grid is 30 μm × 30 μm. The devices exhibited sensitivity of 6.2 μC/Rcm2 with corresponding dark current of ∼2.7 nA/cm2, and a 80 μm FWHM planar image response to a 50 μm slit aperture. X-ray CT images demonstrate a point spread function sufficient to obtain a 50 μm spatial resolution in reconstructed CT images at a substantially reduced dose compared to phosphor-coated readouts. The use of CMOS technology allows for small pixels (30 μm), fast readout speeds (8 fps for a 3200×3200 pixel array), and future design flexibility due to the use of well-developed fabrication processes. PMID:20161098

  2. ATLAS Phase-II-Upgrade Pixel data transmission development

    NASA Astrophysics Data System (ADS)

    Wensing, M.

    2017-01-01

    The ATLAS tracking system will be replaced by an all-silicon detector in the course of the planned upgrade of the Large Hadron Collider around 2025. The readout of the new pixel system will be most challenging in terms of data rate and readout speed. Simulations of the on-detector electronics based on the currently foreseen trigger rate of 1 MHz indicate that a readout speed of up to 5 Gbit/s per data link is necessary. Due to radiation levels, the first part of transmission has to be implemented electrically. System simulation and test results of cable candidates will be presented.

  3. VeloPix: the pixel ASIC for the LHCb upgrade

    NASA Astrophysics Data System (ADS)

    Poikela, T.; De Gaspari, M.; Plosila, J.; Westerlund, T.; Ballabriga, R.; Buytaert, J.; Campbell, M.; Llopart, X.; Wyllie, K.; Gromov, V.; van Beuzekom, M.; Zivkovic, V.

    2015-01-01

    The LHCb Vertex Detector (VELO) will be upgraded in 2018 along with the other subsystems of LHCb in order to enable full readout at 40 MHz, with the data fed directly to the software triggering algorithms. The upgraded VELO is a lightweight hybrid pixel detector operating in vacuum in close proximity to the LHC beams. The readout will be provided by a dedicated front-end ASIC, dubbed VeloPix, matched to the LHCb readout requirements and the 55 × 55 μm VELO pixel dimensions. The chip is closely related to the Timepix3, from the Medipix family of ASICs. The principal challenge that the chip has to meet is a hit rate of up to 900 Mhits/s, resulting in a required output bandwidth of more than 16 Gbit/s. The occupancy across the chip is also very non-uniform, and the radiation levels reach an integrated 400 Mrad over the lifetime of the detector.VeloPix is a binary pixel readout chip with a data driven readout, designed in 130 nm CMOS technology. The pixels are combined into groups of 2 × 4 super pixels, enabling a shared logic and a reduction of bandwidth due to combined address and time stamp information. The pixel hits are combined with other simultaneous hits in the same super pixel, time stamped, and immediately driven off-chip. The analog front-end must be sufficiently fast to accurately time stamp the data, with a small enough dead time to minimize data loss in the most occupied regions of the chip. The data is driven off chip with a custom designed high speed serialiser. The current status of the ASIC design, the chip architecture and the simulations will be described.

  4. A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels

    NASA Astrophysics Data System (ADS)

    Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M. O.; Fritzsch, T.; Rothermund, M.; Graafsma, H.

    2014-12-01

    Hybrid pixel semiconductor detectors provide high performance through a combination of direct detection, a relatively small pixel size, fast readout and sophisticated signal processing circuitry in each pixel. For X-ray detection above 20 keV, high-Z sensor layers rather than silicon are needed to achieve high quantum efficiency, but many high-Z materials such as GaAs and CdTe often suffer from poor material properties or nonuniformities. Germanium is available in large wafers of extremely high quality, making it an appealing option for high-performance hybrid pixel X-ray detectors, but suitable technologies for finely pixelating and bump-bonding germanium have not previously been available. A finely-pixelated germanium photodiode sensor with a 256 by 256 array of 55μm pixels has been produced. The sensor has an n-on-p structure, with 700μm thickness. Using a low-temperature indium bump process, this sensor has been bonded to the Medipix3RX photoncounting readout chip. Tests with the LAMBDA readout system have shown that the detector works successfully, with a high bond yield and higher image uniformity than comparable high-Z systems. During cooling, the system is functional around -80°C (with warmer temperatures resulting in excessive leakage current), with -100°C sufficient for good performance.

  5. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    1995-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  6. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2003-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  7. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2004-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  8. Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

    SciTech Connect

    Fahim, Farah

    2014-10-31

    The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

  9. High-speed optical shutter coupled to fast-readout CCD camera

    NASA Astrophysics Data System (ADS)

    Yates, George J.; Pena, Claudine R.; McDonald, Thomas E., Jr.; Gallegos, Robert A.; Numkena, Dustin M.; Turko, Bojan T.; Ziska, George; Millaud, Jacques E.; Diaz, Rick; Buckley, John; Anthony, Glen; Araki, Takae; Larson, Eric D.

    1999-04-01

    A high frame rate optically shuttered CCD camera for radiometric imaging of transient optical phenomena has been designed and several prototypes fabricated, which are now in evaluation phase. the camera design incorporates stripline geometry image intensifiers for ultra fast image shutters capable of 200ps exposures. The intensifiers are fiber optically coupled to a multiport CCD capable of 75 MHz pixel clocking to achieve 4KHz frame rate for 512 X 512 pixels from simultaneous readout of 16 individual segments of the CCD array. The intensifier, Philips XX1412MH/E03 is generically a Generation II proximity-focused micro channel plate intensifier (MCPII) redesigned for high speed gating by Los Alamos National Laboratory and manufactured by Philips Components. The CCD is a Reticon HSO512 split storage with bi-direcitonal vertical readout architecture. The camera main frame is designed utilizing a multilayer motherboard for transporting CCD video signals and clocks via imbedded stripline buses designed for 100MHz operation. The MCPII gate duration and gain variables are controlled and measured in real time and up-dated for data logging each frame, with 10-bit resolution, selectable either locally or by computer. The camera provides both analog and 10-bit digital video. The camera's architecture, salient design characteristics, and current test data depicting resolution, dynamic range, shutter sequences, and image reconstruction will be presented and discussed.

  10. Towards spark-proof gaseous pixel detectors

    NASA Astrophysics Data System (ADS)

    Tsigaridas, S.; Beuzekom, M. v.; Chan, H. W.; Graaf, H. v. d.; Hartjes, F.; Heijhoff, K.; Hessey, N. P.; Prodanovic, V.

    2016-11-01

    The micro-pattern gaseous pixel detector, is a promising technology for imaging and particle tracking applications. It is a combination of a gas layer acting as detection medium and a CMOS pixelated readout-chip. As a prevention against discharges we deposit a protection layer on the chip and then integrate on top a micromegas-like amplification structure. With this technology we are able to reconstruct 3D track segments of particles passing through the gas thanks to the functionality of the chip. We have turned a Timepix3 chip into a gaseous pixel detector and tested it at the SPS at Cern. The preliminary results are promising and within the expectations. However, the spark protection layer needs further improvement to make reliable detectors. For this reason, we have created a setup for spark-testing. We present the first results obtained from the lab-measurements along with preliminary results from the testbeam.

  11. Readout electronics for LGAD sensors

    NASA Astrophysics Data System (ADS)

    Alonso, O.; Franch, N.; Canals, J.; Palacio, F.; López, M.; Vilà, A.; Diéguez, A.; Carulla, M.; Flores, D.; Hidalgo, S.; Merlos, A.; Pellegrini, G.; Quirion, D.

    2017-02-01

    In this paper, an ASIC fabricated in 180 nm CMOS technology from AMS with the very front-end electronics used to readout LGAD sensors is presented as well as its experimental results. The front-end has the typical architecture for Si-strip readout, i.e., preamplification stage with a Charge Sensitive Amplifier (CSA) followed by a CR-RC shaper. Both amplifiers are based on a folded cascode structure with a PMOS input transistor and the shaper only uses passive elements for the feedback stage. The CSA has programmable gain and a configurable input stage in order to adapt to the different input capacitance of the LGAD sensors (pixelated, short and long strips) and to the different input signal (depending on the gain of the LGAD). The fabricated prototype has an area of 0.865 mm × 0.965 mm and includes the biasing circuit for the CSA and the shaper, 4 analog channels (CSA+shaper) and programmable charge injection circuits included for testing purposes. Noise and power analysis performed during simulation fixed the size of the input transistor to W/L = 860 μm/0.2 μm. The shaping time is fixed by design at 1 us and, in this ASIC version, the feedback elements of the shaper are passive, which means that the area of the shaper can be reduced using active elements in future versions. Finally, the different gains of the CSA have been selected to maintain an ENC below 400 electrons for a detector capacitor of 20 pF, with a power consumption of 150 μ W per channel.

  12. EXCALIBUR: a small-pixel photon counting area detector for coherent X-ray diffraction - Front-end design, fabrication and characterisation

    NASA Astrophysics Data System (ADS)

    Marchal, J.; Horswell, I.; Willis, B.; Plackett, R.; Gimenez, E. N.; Spiers, J.; Ballard, D.; Booker, P.; Thompson, J. A.; Gibbons, P.; Burge, S. R.; Nicholls, T.; Lipp, J.; Tartoni, N.

    2013-03-01

    Coherent X-ray diffraction experiments on synchrotron X-ray beamlines require detectors with high spatial resolution and large detection area. The read-out chip developed by the MEDIPIX3 collaboration offers a small pixel size of 55 microns resulting in a very high spatial resolution when coupled to a direct X-ray conversion segmented silicon sensor. MEDIPIX3 assemblies present also the advantages of hybrid pixel detectors working in single photon counting mode: noiseless imaging, large dynamic range, extremely high frame rate. The EXCALIBUR detector is under development for the X-ray Coherence and Imaging Beamline I13 of the Diamond Light Source. This new detector consists of three modules, each with 16 MEDIPIX3 chips which can be read-out at 100 frames per second in continuous mode or 1000 frames per second in burst mode. In each module, the sensor is a large single silicon die covering 2 rows of 8 individual MEDIPIX3 read-out chips and provides a continuous active detection region within a module. Each module includes 1 million solder bumps connecting the 55 microns pixels of the silicon sensor to the 55 microns pixels of the 16 MEDIPIX3 read-out chips. The detection area of the 3-module EXCALIBUR detector is 115 mm × 100 mm with a small 6.8 mm wide inactive region between modules. Each detector module is connected to 2 FPGA read-out boards via a flexi-rigid circuit to allow a fully parallel read-out of the 16 MEDIPIX3 chips. The 6 FPGA read-out boards used in the EXCALIBUR detector are interfaced to 6 computing nodes via 10Gbit/s fibre-optic links to maintain the very high frame-rate capability. The standard suite of EPICS control software is used to operate the detector and to integrate it with the Diamond Light Source beamline software environment. This article describes the design, fabrication and characterisation of the MEDIPIX3-based modules composing the EXCALIBUR detector.

  13. Novel integrated CMOS pixel structures for vertex detectors

    SciTech Connect

    Kleinfelder, Stuart; Bieser, Fred; Chen, Yandong; Gareus, Robin; Matis, Howard S.; Oldenburg, Markus; Retiere, Fabrice; Ritter, Hans Georg; Wieman, Howard H.; Yamamoto, Eugene

    2003-10-29

    Novel CMOS active pixel structures for vertex detector applications have been designed and tested. The overriding goal of this work is to increase the signal to noise ratio of the sensors and readout circuits. A large-area native epitaxial silicon photogate was designed with the aim of increasing the charge collected per struck pixel and to reduce charge diffusion to neighboring pixels. The photogate then transfers the charge to a low capacitance readout node to maintain a high charge to voltage conversion gain. Two techniques for noise reduction are also presented. The first is a per-pixel kT/C noise reduction circuit that produces results similar to traditional correlated double sampling (CDS). It has the advantage of requiring only one read, as compared to two for CDS, and no external storage or subtraction is needed. The technique reduced input-referred temporal noise by a factor of 2.5, to 12.8 e{sup -}. Finally, a column-level active reset technique is explored that suppresses kT/C noise during pixel reset. In tests, noise was reduced by a factor of 7.6 times, to an estimated 5.1 e{sup -} input-referred noise. The technique also dramatically reduces fixed pattern (pedestal) noise, by up to a factor of 21 in our tests. The latter feature may possibly reduce pixel-by-pixel pedestal differences to levels low enough to permit sparse data scan without per-pixel offset corrections.

  14. Pixel detector system development at Diamond Light Source

    NASA Astrophysics Data System (ADS)

    Marchal, J.; Horswell, I.; Gimenez, E. N.; Tartoni, N.

    2010-10-01

    Hybrid pixel detectors consisting of an array of silicon photodiodes bump-bonded to CMOS read-out chips provide high signal-to-noise ratio and high dynamic range compared to CCD-based detectors and Image Plates. These detector features are important for SAXS experiments where a wide range of intensities are present in the images. For time resolved SAXS experiments, high frame rates are compulsory. The latest CMOS read-out chip developed by the MEDIPIX collaboration provides high frame rate and continuous acquisition mode. A read-out system for an array of MEDIPIX3 sensors is under development at Diamond Light Source. This system will support a full resolution frame rate of 1 kHz at a pixel counter depth of 12-bit and a frame rate of 30 kHz at a counter depth of 1 bit. Details concerning system design and MEDIPIX sensors characterization are presented.

  15. Design of the small pixel pitch ROIC

    NASA Astrophysics Data System (ADS)

    Liang, Qinghua; Jiang, Dazhao; Chen, Honglei; Zhai, Yongcheng; Gao, Lei; Ding, Ruijun

    2014-11-01

    Since the technology trend of the third generation IRFPA towards resolution enhancing has steadily progressed,the pixel pitch of IRFPA has been greatly reduced.A 640×512 readout integrated circuit(ROIC) of IRFPA with 15μm pixel pitch is presented in this paper.The 15μm pixel pitch ROIC design will face many challenges.As we all known,the integrating capacitor is a key performance parameter when considering pixel area,charge capacity and dynamic range,so we adopt the effective method of 2 by 2 pixels sharing an integrating capacitor to solve this problem.The input unit cell architecture will contain two paralleled sample and hold parts,which not only allow the FPA to be operated in full frame snapshot mode but also save relatively unit circuit area.Different applications need more matching input unit circuits. Because the dimension of 2×2 pixels is 30μm×30μm, an input stage based on direct injection (DI) which has medium injection ratio and small layout area is proved to be suitable for middle wave (MW) while BDI with three-transistor cascode amplifier for long wave(LW). By adopting the 0.35μm 2P4M mixed signal process, the circuit architecture can make the effective charge capacity of 7.8Me- per pixel with 2.2V output range for MW and 7.3 Me- per pixel with 2.6V output range for LW. According to the simulation results, this circuit works well under 5V power supply and achieves less than 0.1% nonlinearity.

  16. FastPixN, a new integrated pixel chip for a future fast version of the IRSN - recoil proton telescope.

    PubMed

    Kachel, M; Husson, D; Higueret, S; Taforeau, J; Lebreton, L

    2014-10-01

    A first prototype of recoil proton telescope (RPT) is currently working at the AMANDE facility, being developed as a collaboration between IPHC Strasbourg and the LNE-IRSN. The device, able to measure both energy and fluence of neutron fields in the range of 5-20 MeV, has to be improved further, in order to reduce the considerable inelastic background generated by the neutrons inside the RPT itself. To achieve faster running cycles, the present complementary metal-oxide-semiconductor pixels used for proton tracking are to be replaced by a new integrated chip, specially developed for this application. The authors present a first version of this new element, with individual pixels readout at a 200-MHz frequency, with a fast 4-bit ADC for each column of 64 pixels. The measured performances point to a complete frame treatment in only 12.6 µs. With a readout speed multiplied by a factor 400 over the existing device, the authors expect a considerable improvement of the telescope at AMANDE, with the potential to reach neutron fluence rates up to 10(7) n cm(-2) s(-1) or more.

  17. Studies of the possibility to use Gas Pixel Detector as a fast trigger tracking device

    NASA Astrophysics Data System (ADS)

    Sinev, N.; Bashindzhagyan, G.; Korotkova, N.; Romaniouk, A.; Tikhomirov, V.

    2016-02-01

    Gas Pixel Detector (GPD) technology offers new possibilities, which make them very attractive for application in existing and future accelerator experiments and beyond. GPDs combine advantages of silicon and gaseous detectors. They can be produced radiation hard and with low power consumption using relatively cheap technology. Low capacitance of the individual pixel channel allows us to obtain a large signal to noise ratio. Using a time projection method for GPD readout one obtains 3D track image with precise coordinate (31 µm) and angular information (0.40°). This feature would allow us to achieve performance of one GPD layer equal to a few layers of silicon detectors. Implementation of a fast readout and data processing at the front-end level allows one to reconstruct a track segment in less than 1 μs, and to use this information for the first level trigger generation. The relevant algorithms of data acquisition and analysis are described and the results of simulations are presented in this paper.

  18. Wire Bond Encapsulation for the CMS Forward Pixel Upgrade

    NASA Astrophysics Data System (ADS)

    Higginbotham, Sam; CMS Collaboration

    2015-04-01

    The Phase 1 upgrade of the pixel tracker for the CMS experiment will require the assembly of approximately 1000 modules consisting of pixel sensors bump bonded to readout chips. Electrical connections between the custom readout chips and support ASIC's that constitute the front-end of the pixel data acquisition system are made via wire bonds to a thin printed circuit board. Part of the assembly process carried out at Purdue University includes the partial encapsulation of the wire bonds for mechanical protection, prevention of electrolytic corrosion, and to damp oscillations due to Lorentz forces from transient current pulses in large magnetic fields. We present the details of the robotic assembly process which allows the deposition of the viscous encapsulant compound with 100 micron precision.

  19. Pixel architectures in a HV-CMOS process for the ATLAS inner detector upgrade

    NASA Astrophysics Data System (ADS)

    Degerli, Y.; Godiot, S.; Guilloux, F.; Hemperek, T.; Krüger, H.; Lachkar, M.; Liu, J.; Orsini, F.; Pangaud, P.; Rymaszewski, P.; Wang, T.

    2016-12-01

    In this paper, design details and simulation results of new pixel architectures designed in LFoundry 150 nm high voltage CMOS process in the framework of the ATLAS high luminosity inner detector upgrade are presented. These pixels can be connected to the FE-I4 readout chip via bump bonding or glue and some of them can also be tested without a readout chip. Negative high voltage is applied to the high resistivity (> 2 kΩ .cm) substrate in order to deplete the deep n-well charge collection diode, ensuring good charge collection and radiation tolerance. In these pixels, the front-end has been implemented inside the diode using both NMOS and PMOS transistors. The pixel pitch is 50 μm × 250 μm for all pixels. These pixels have been implemented in a demonstrator chip called LFCPIX.

  20. High accuracy injection circuit for the calibration of a large pixel sensor matrix

    NASA Astrophysics Data System (ADS)

    Quartieri, E.; Comotti, D.; Manghisoni, M.

    2013-08-01

    Semiconductor pixel detectors, for particle tracking and vertexing in high energy physics experiments as well as for X-ray imaging, in particular for synchrotron light sources and XFELs, require a large area sensor matrix. This work will discuss the design and the characterization of a high-linearity, low dispersion injection circuit to be used for pixel-level calibration of detector readout electronics in a large pixel sensor matrix. The circuit provides a useful tool for the characterization of the readout electronics of the pixel cell unit for both monolithic active pixel sensors and hybrid pixel detectors. In the latter case, the circuit allows for precise analogue test of the readout channel already at the chip level, when no sensor is connected. Moreover, it provides a simple means for calibration of readout electronics once the detector has been connected to the chip. Two injection techniques can be provided by the circuit: one for a charge sensitive amplification and the other for a transresistance readout channel. The aim of the paper is to describe the architecture and the design guidelines of the calibration circuit, which has been implemented in a 130 nm CMOS technology. Moreover, experimental results of the proposed injection circuit will be presented in terms of linearity and dispersion.

  1. ATLAS IBL Pixel Upgrade

    NASA Astrophysics Data System (ADS)

    La Rosa, A.; Atlas Ibl Collaboration

    2011-06-01

    The upgrade for ATLAS detector will undergo different phases towards super-LHC. The first upgrade for the Pixel detector will consist of the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (LHC phase-I upgrade). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 3.3 cm. The IBL will require the development of several new technologies to cope with increase of radiation or pixel occupancy and also to improve the physics performance which will be achieved by reducing the pixel size and of the material budget. Three different promising sensor technologies (planar-Si, 3D-Si and diamond) are currently under investigation for the pixel detector. An overview of the project with particular emphasis on the pixel module is presented in this paper.

  2. Progress on the design of a data push architecture for an array of optimized time tagging pixels

    NASA Astrophysics Data System (ADS)

    Shapiro, S.; Cords, D.; Mani, S.; Holbrook, B.; Atlas, E.

    1993-06-01

    A pixel array has been proposed which features a completely data driven architecture. A pixel cell has been designed that has been optimized for this readout. It retains the features of preceding designs which allow low noise operation, time stamping, analog signal processing, XY address recording, ghost elimination and sparse data transmission. The pixel design eliminates a number of problems inherent in previous designs, by the use of sampled data techniques, destructive readout, and current mode output drivers. This architecture and pixel design is directed at applications such as a forward spectrometer at the SSC, an e(sup +)e(sup -) B factory at SLAC, and fixed target experiments at FNAL.

  3. Fast Multiplexed Readout of Xmon Qubits Part I: Design

    NASA Astrophysics Data System (ADS)

    Sank, Daniel; Jeffrey, E.; Mutus, J. Y.; White, T. C.; Barends, R.; Kelly, J.; Chen, Y.; Roushan, P.; Campbell, B.; Chen, Z.; Chiaro, B.; Dunsworth, A.; Megrant, A.; Neill, C.; O'Malley, P.; Quintana, C.; Vainsencher, A.; Wenner, J.; Cleland, A. N.; Martinis, J. M.

    2014-03-01

    Realization of a surface code quantum computer requires fast scalable qubit readout. Previous systems have shown accurate readout in continuous wave mode. This neglects the transient response time which is crucial for the operation of the surface code and for measurement accuracy in the presence of finite qubit T1. We have designed a readout system, based on an integrated band pass filter, which achieves very fast transient response while maintaining long qubit T1. Our design uses separate readout resonators for each qubit. This allows individual qubit readout with frequency multiplexing while preventing correlated measurement errors. By connecting each resonator to a single filter the device requires zero additional on chip area and no extra control lines. We present design considerations, theory of operation, and physical layout of the device. With high fidelity gates this system forms the final element needed for a surface code cell.

  4. An innovative method to reduce count loss from pulse pile-up in a photon-counting pixel for high flux X-ray applications

    NASA Astrophysics Data System (ADS)

    Lee, D.; Lim, K.; Park, K.; Lee, C.; Alexander, S.; Cho, G.

    2017-03-01

    In this study, an innovative fast X-ray photon-counting pixel for high X-ray flux applications is proposed. A computed tomography system typically uses X-ray fluxes up to 108 photons/mm2/sec at the detector and thus a fast read-out is required in order to process individual X-ray photons. Otherwise, pulse pile-up can occur at the output of the signal processing unit. These superimposed signals can distort the number of incident X-ray photons leading to count loss. To minimize such losses, a cross detection method was implemented in the photon-counting pixel. A maximum count rate under X-ray tube voltage of 90 kV was acquired which reflect electrical test results of the proposed photon counting pixel. A maximum count of 780 kcps was achieved with a conventional photon-counting pixel at the pulse processing time of 500 ns, which is the time for a pulse to return to the baseline from the initial rise. In contrast, the maximum count of about 8.1 Mcps was achieved with the proposed photon-counting pixel. From these results, it was clear that the maximum count rate was increased by approximately a factor 10 times by adopting the cross detection method. Therefore, it is an innovative method to reduce count loss from pulse pile-up in a photon-counting pixel while maintaining the pulse processing time.

  5. The phase II ATLAS Pixel upgrade: the Inner Tracker (ITk)

    NASA Astrophysics Data System (ADS)

    Flick, T.

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the ITk (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. Several layout options are being investigated. All of these include a barrel part and ring-shaped supports in the endcap regions. All structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide. Different designs of planar, 3D, and CMOS sensors are being investigated to identify the optimal technology for the different pixel layers. While the RD53 Collaboration is developing the new readout chip, the pixel off-detector readout electronics will be implemented in the framework of the general ATLAS trigger and DAQ system. A readout speed of up to 5 Gbit/s per data link (FE-chip) will be needed in the innermost layers going down to 640 Mbit/s for the outermost. This paper presents an overview of the different components of the ITk and the current status of the developments.

  6. Bad pixel mapping

    NASA Astrophysics Data System (ADS)

    Smith, Roger M.; Hale, David; Wizinowich, Peter

    2014-07-01

    Bad pixels are generally treated as a loss of useable area and then excluded from averaged performance metrics. The definition and detection of "bad pixels" or "cosmetic defects" are seldom discussed, perhaps because they are considered self-evident or of minor consequence for any scientific grade detector, however the ramifications can be more serious than generally appreciated. While the definition of pixel performance is generally understood, the classification of pixels as useable is highly application-specific, as are the consequences of ignoring or interpolating over such pixels. CMOS sensors (including NIR detectors) exhibit less compact distributions of pixel properties than CCDs. The extended tails in these distributions result in a steeper increase in bad pixel counts as performance thresholds are tightened which comes as a surprise to many users. To illustrate how some applications are much more sensitive to bad pixels than others, we present a bad pixel mapping exercise for the Teledyne H2RG used as the NIR tip-tilt sensor in the Keck-1 Adaptive Optics system. We use this example to illustrate the wide range of metrics by which a pixel might be judged inadequate. These include pixel bump bond connectivity, vignetting, addressing faults in the mux, severe sensitivity deficiency of some pixels, non linearity, poor signal linearity, low full well, poor mean-variance linearity, excessive noise and high dark current. Some pixels appear bad by multiple metrics. We also discuss the importance of distinguishing true performance outliers from measurement errors. We note how the complexity of these issues has ramifications for sensor procurement and acceptance testing strategies.

  7. Sensor readout detector circuit

    DOEpatents

    Chu, D.D.; Thelen, D.C. Jr.

    1998-08-11

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems. 6 figs.

  8. Sensor readout detector circuit

    DOEpatents

    Chu, Dahlon D.; Thelen, Jr., Donald C.

    1998-01-01

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems.

  9. Pixel DAQ and trigger for HL-LHC

    NASA Astrophysics Data System (ADS)

    Morettini, P.

    2017-03-01

    The read-out is one of the challenges in the design of a pixel detector for the High Luminosity upgrade of the Large Hadron Collider (HL-LHC), that is expected to operate from 2026 at a leveled luminosity of 5 × 1034 cm‑2 s‑1. This is especially true if tracking information is needed in a low latency trigger system. The difficulties of a fast read-out will be reviewed, and possible strategies explained. The solutions that are being evaluated by the ATLAS and CMS collaborations for the upgrade of their trackers will be outlined and ideas on possible development beyond HL-LHC will be presented.

  10. PixelLearn

    NASA Technical Reports Server (NTRS)

    Mazzoni, Dominic; Wagstaff, Kiri; Bornstein, Benjamin; Tang, Nghia; Roden, Joseph

    2006-01-01

    PixelLearn is an integrated user-interface computer program for classifying pixels in scientific images. Heretofore, training a machine-learning algorithm to classify pixels in images has been tedious and difficult. PixelLearn provides a graphical user interface that makes it faster and more intuitive, leading to more interactive exploration of image data sets. PixelLearn also provides image-enhancement controls to make it easier to see subtle details in images. PixelLearn opens images or sets of images in a variety of common scientific file formats and enables the user to interact with several supervised or unsupervised machine-learning pixel-classifying algorithms while the user continues to browse through the images. The machinelearning algorithms in PixelLearn use advanced clustering and classification methods that enable accuracy much higher than is achievable by most other software previously available for this purpose. PixelLearn is written in portable C++ and runs natively on computers running Linux, Windows, or Mac OS X.

  11. Pixel telescope test in STAR at RHIC

    NASA Astrophysics Data System (ADS)

    Sun, Xiangming; Szelezniak, Michal; Greiner, Leo; Matis, Howard; Vu, Chinh; Stezelberger, Thorsten; Wieman, Howard

    2007-10-01

    The STAR experiment at RHIC is designing a new inner vertex detector called the Heavy Flavor Tracker (HFT). The HFT's innermost two layers is called the PIXEL detector which uses Monolithic Active Pixel Sensor technology (MAPS). To test the MAPS technology, we just constructed and tested a telescope. The telescope uses a stack of three MIMOSTAR2 chips, Each MIMOSTAR2 sensor, which was designed by IPHC, is an array of 132x128 pixels with a square pixel size of 30 μ. The readout of the telescope makes use of the ALICE DDL/SIU cards, which is compatible with the future STAR data acquisition system called DAQ1000. The telescope was first studied in a 1.2 GeV/c electron beam at LBNL's Advanced Light Source. Afterwards, the telescope was outside the STAR magnet, and then later inside it, 145 cm away from STAR's center. We will describe this first test of MAPS technology in a collider environment, and report on the occupancy, particle flux, and performance of the telescope.

  12. ALICE inner tracking system readout electronics prototype testing with the CERN ``Giga Bit Transceiver''

    NASA Astrophysics Data System (ADS)

    Schambach, J.; Rossewij, M. J.; Sielewicz, K. M.; Aglieri Rinella, G.; Bonora, M.; Ferencei, J.; Giubilato, P.; Vanat, T.

    2016-12-01

    The ALICE Collaboration is preparing a major detector upgrade for the LHC Run 3, which includes the construction of a new silicon pixel based Inner Tracking System (ITS). The ITS readout system consists of 192 readout boards to control the sensors and their power system, receive triggers, and deliver sensor data to the DAQ. To prototype various aspects of this readout system, an FPGA based carrier board and an associated FMC daughter card containing the CERN Gigabit Transceiver (GBT) chipset have been developed. This contribution describes laboratory and radiation testing results with this prototype board set.

  13. Silicon pixel R&D for CLIC

    NASA Astrophysics Data System (ADS)

    Munker, M.

    2017-01-01

    Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+ e‑ Compact Linear Collider (CLIC). A single point resolution of 3 μm for the vertex detector and 7 μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2% X0 per layer in the vertex detector and 1–2% X0 in the tracker. A fast time slicing of 10 ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25×25 μm2 and 55×55 μm2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin (50 μm–500 μm) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.

  14. Medipix2 parallel readout system

    NASA Astrophysics Data System (ADS)

    Fanti, V.; Marzeddu, R.; Randaccio, P.

    2003-08-01

    A fast parallel readout system based on a PCI board has been developed in the framework of the Medipix collaboration. The readout electronics consists of two boards: the motherboard directly interfacing the Medipix2 chip, and the PCI board with digital I/O ports 32 bits wide. The device driver and readout software have been developed at low level in Assembler to allow fast data transfer and image reconstruction. The parallel readout permits a transfer rate up to 64 Mbytes/s. http://medipix.web.cern ch/MEDIPIX/

  15. Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra K. (Inventor); Pain, Bedabrata (Inventor); Nixon, Robert H. (Inventor); Zhou, Zhimin (Inventor)

    2003-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

  16. Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra K. (Inventor); Pain, Bedabrata (Inventor); Nixon, Robert H. (Inventor); Zhou, Zhimin (Inventor)

    2000-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor Integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

  17. Integration of the ATLAS FE-I4 Pixel Chip in the Mini Time Projection Chamber

    NASA Astrophysics Data System (ADS)

    Lopez-Thibodeaux, Mayra; Garcia-Sciveres, Maurice; Kadyk, John; Oliver-Mallory, Kelsey

    2013-04-01

    This project deals with development of readout for a Time Projection Chamber (TPC) prototype. This is a type of detector proposed for direct detection of dark matter (WIMPS) with direction information. The TPC is a gaseous charged particle tracking detector composed of a field cage and a gas avalanche detector. The latter is made of two Gas Electron Multipliers in series, illuminating a pixel readout integrated circuit, which measures the distribution in position and time of the output charge. We are testing the TPC prototype, filled with ArCO2 gas, using a Fe-55 x-ray source and cosmic rays. The present prototype uses an FE-I3 chip for readout. This chip was developed about 10 years ago and is presently in use within the ATLAS pixel detector at the LHC. The aim of this work is to upgrade the TPC prototype to use an FE-I4 chip. The FE-I4 has an active area of 336 mm^2 and 26880 pixels, over nine times the number of pixels in the FE-I3 chip, and an active area about six times as much. The FE-I4 chip represents the state of the art of pixel detector readout, and is presently being used to build an upgrade of the ATLAS pixel detector.

  18. Measurements with MÖNCH, a 25 μm pixel pitch hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Ramilli, M.; Bergamaschi, A.; Andrae, M.; Brückner, M.; Cartier, S.; Dinapoli, R.; Fröjdh, E.; Greiffenberg, D.; Hutwelker, T.; Lopez-Cuenca, C.; Mezza, D.; Mozzanica, A.; Ruat, M.; Redford, S.; Schmitt, B.; Shi, X.; Tinti, G.; Zhang, J.

    2017-01-01

    MÖNCH is a hybrid silicon pixel detector based on charge integration and with analog readout, featuring a pixel size of 25×25 μm2. The latest working prototype consists of an array of 400×400 identical pixels for a total active area of 1×1 cm2. Its design is optimized for the single photon regime. An exhaustive characterization of this large area prototype has been carried out in the past months, and it confirms an ENC in the order of 35 electrons RMS and a dynamic range of ~4×12 keV photons in high gain mode, which increases to ~100×12 keV photons with the lowest gain setting. The low noise levels of MÖNCH make it a suitable candidate for X-ray detection at energies around 1 keV and below. Imaging applications in particular can benefit significantly from the use of MÖNCH: due to its extremely small pixel pitch, the detector intrinsically offers excellent position resolution. Moreover, in low flux conditions, charge sharing between neighboring pixels allows the use of position interpolation algorithms which grant a resolution at the micrometer-level. Its energy reconstruction and imaging capabilities have been tested for the first time at a low energy beamline at PSI, with photon energies between 1.75 keV and 3.5 keV, and results will be shown.

  19. Hybrid Pixel Detectors for gamma/X-ray imaging

    NASA Astrophysics Data System (ADS)

    Hatzistratis, D.; Theodoratos, G.; Zografos, V.; Kazas, I.; Loukas, D.; Lambropoulos, C. P.

    2015-09-01

    Hybrid pixel detectors are made by direct converting high-Z semi-insulating single crystalline material coupled to complementary-metal-oxide semiconductor (CMOS) readout electronics. They are attractive because direct conversion exterminates all the problems of spatial localization related to light diffusion, energy resolution, is far superior from the combination of scintillation crystals and photomultipliers and lithography can be used to pattern electrodes with very fine pitch. We are developing 2-D pixel CMOS ASICs, connect them to pixilated CdTe crystals with the flip chip and bump bonding method and characterize the hybrids. We have designed a series of circuits, whose latest member consists of a 50×25 pixel array with 400um pitch and an embedded controller. In every pixel a full spectroscopic channel with time tagging information has been implemented. The detectors are targeting Compton scatter imaging and they can be used for coded aperture imaging too. Hybridization using CMOS can overcome the limit put on pixel circuit complexity by the use of thin film transistors (TFT) in large flat panels. Hybrid active pixel sensors are used in dental imaging and other applications (e.g. industrial CT etc.). Thus X-ray imaging can benefit from the work done on dynamic range enhancement methods developed initially for visible and infrared CMOS pixel sensors. A 2-D CMOS ASIC with 100um pixel pitch to demonstrate the feasibility of such methods in the context of X-ray imaging has been designed.

  20. Imaging by photon counting with 256x256 pixel matrix

    NASA Astrophysics Data System (ADS)

    Tlustos, Lukas; Campbell, Michael; Heijne, Erik H. M.; Llopart, Xavier

    2004-09-01

    Using 0.25µm standard CMOS we have developed 2-D semiconductor matrix detectors with sophisticated functionality integrated inside each pixel of a hybrid sensor module. One of these sensor modules is a matrix of 256x256 square 55µm pixels intended for X-ray imaging. This device is called 'Medipix2' and features a fast amplifier and two-level discrimination for signals between 1000 and 100000 equivalent electrons, with overall signal noise ~150 e- rms. Signal polarity and comparator thresholds are programmable. A maximum count rate of nearly 1 MHz per pixel can be achieved, which corresponds to an average flux of 3x10exp10 photons per cm2. The selected signals can be accumulated in each pixel in a 13-bit register. The serial readout takes 5-10 ms. A parallel readout of ~300 µs could also be used. Housekeeping functions such as local dark current compensation, test pulse generation, silencing of noisy pixels and threshold tuning in each pixel contribute to the homogeneous response over a large sensor area. The sensor material can be adapted to the energy of the X-rays. Best results have been obtained with high-resistivity silicon detectors, but also CdTe and GaAs detectors have been used. The lowest detectable X-ray energy was about 4 keV. Background measurements have been made, as well as measurements of the uniformity of imaging by photon counting. Very low photon count rates are feasible and noise-free at room temperature. The readout matrix can be used also with visible photons if an energy or charge intensifier structure is interposed such as a gaseous amplification layer or a microchannel plate or acceleration field in vacuum.

  1. Large monolithic particle pixel-detector in high-voltage CMOS technology

    NASA Astrophysics Data System (ADS)

    Perić, I.; Takacs, C.

    2010-12-01

    A large monolithic particle pixel-detector implemented as system on a chip in a high-voltage 0.35 μm CMOS technology will be presented. The detector uses high-voltage n-well/p-substrate diodes as pixel-sensors. The diodes can be reversely biased with more than 60 V. In this way, depleted zones of about 10 μm thickness are formed, where the signal charges can be collected by drift. Due to fast charge collection in the strong electric-field zones, a higher radiation tolerance of the sensor is expected than in the case of the standard MAPS detectors. Simple pixel-readout electronics are implemented inside the n-wells. The readout is based on a source follower with one select- and two reset-transistors. Due to embedding of the pixel-readout electronics inside the collecting electrodes (n-wells) there are no insensitive zones within the pixel matrix. The detector chip contains a 128×128 matrix consisting of pixels of 21×21 μm2 -size. The diode voltages of one selected pixel-row are received at the bottom of the matrix by 128 eight-bit single-slope ADCs. All ADCs operate in parallel. The ADC codes are read out using eight LVDS 500 MBit/s output links. The readout electronics are designed to allow the readout of the whole pixel matrix in less than 50 μs. The total DC power consumption of the chip is 50 mW. All analog parts of the chip are implemented using radiation-hard layout techniques. Experimental results will be presented.

  2. Automatic readout micrometer

    DOEpatents

    Lauritzen, T.

    A measuring system is described for surveying and very accurately positioning objects with respect to a reference line. A principle use of this surveying system is for accurately aligning the electromagnets which direct a particle beam emitted from a particle accelerator. Prior art surveying systems require highly skilled surveyors. Prior art systems include, for example, optical surveying systems which are susceptible to operator reading errors, and celestial navigation-type surveying systems, with their inherent complexities. The present invention provides an automatic readout micrometer which can very accurately measure distances. The invention has a simplicity of operation which practically eliminates the possibilities of operator optical reading error, owning to the elimination of traditional optical alignments for making measurements. The invention has an extendable arm which carries a laser surveying target. The extendable arm can be continuously positioned over its entire length of travel by either a coarse of fine adjustment without having the fine adjustment outrun the coarse adjustment until a reference laser beam is centered on the target as indicated by a digital readout. The length of the micrometer can then be accurately and automatically read by a computer and compared with a standardized set of alignment measurements. Due to its construction, the micrometer eliminates any errors due to temperature changes when the system is operated within a standard operating temperature range.

  3. Automatic readout micrometer

    DOEpatents

    Lauritzen, Ted

    1982-01-01

    A measuring system is disclosed for surveying and very accurately positioning objects with respect to a reference line. A principal use of this surveying system is for accurately aligning the electromagnets which direct a particle beam emitted from a particle accelerator. Prior art surveying systems require highly skilled surveyors. Prior art systems include, for example, optical surveying systems which are susceptible to operator reading errors, and celestial navigation-type surveying systems, with their inherent complexities. The present invention provides an automatic readout micrometer which can very accurately measure distances. The invention has a simplicity of operation which practically eliminates the possibilities of operator optical reading error, owning to the elimination of traditional optical alignments for making measurements. The invention has an extendable arm which carries a laser surveying target. The extendable arm can be continuously positioned over its entire length of travel by either a coarse or fine adjustment without having the fine adjustment outrun the coarse adjustment until a reference laser beam is centered on the target as indicated by a digital readout. The length of the micrometer can then be accurately and automatically read by a computer and compared with a standardized set of alignment measurements. Due to its construction, the micrometer eliminates any errors due to temperature changes when the system is operated within a standard operating temperature range.

  4. Semiconductor detectors with proximity signal readout

    SciTech Connect

    Asztalos, Stephen J.

    2014-01-30

    Semiconductor-based radiation detectors are routinely used for the detection, imaging, and spectroscopy of x-rays, gamma rays, and charged particles for applications in the areas of nuclear and medical physics, astrophysics, environmental remediation, nuclear nonproliferation, and homeland security. Detectors used for imaging and particle tracking are more complex in that they typically must also measure the location of the radiation interaction in addition to the deposited energy. In such detectors, the position measurement is often achieved by dividing or segmenting the electrodes into many strips or pixels and then reading out the signals from all of the electrode segments. Fine electrode segmentation is problematic for many of the standard semiconductor detector technologies. Clearly there is a need for a semiconductor-based radiation detector technology that can achieve fine position resolution while maintaining the excellent energy resolution intrinsic to semiconductor detectors, can be fabricated through simple processes, does not require complex electrical interconnections to the detector, and can reduce the number of required channels of readout electronics. Proximity electrode signal readout (PESR), in which the electrodes are not in physical contact with the detector surface, satisfies this need.

  5. Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

    NASA Astrophysics Data System (ADS)

    Schneider, A.; Veale, M. C.; Duarte, D. D.; Bell, S. J.; Wilson, M. D.; Lipp, J. D.; Seller, P.

    2015-02-01

    In the last decade, the Detector Development Group at the Technology Department of the Science and Technology Facilities Council (STFC), U.K., established a variety of fabrication and bonding techniques to build pixelated X-ray and γ-ray detector systems such as the spectroscopic X-ray imaging detector HEXITEC [1]. The fabrication and bonding of such devices comprises a range of processes including material surface preparation, photolithography, stencil printing, flip-chip and wire bonding of detectors to application-specific integrated circuits (ASIC). This paper presents interconnect and bonding techniques used in the fabrication chain for pixelated detectors assembled at STFC. For this purpose, detector dies (~ 20× 20 mm2) of high quality, single crystal semiconductors, such as cadmium zinc telluride (CZT) are cut to the required thickness (up to 5mm). The die surfaces are lapped and polished to a mirror-finish and then individually processed by electroless gold deposition combined with photolithography to form 74× 74 arrays of 200 μ m × 200 μ m pixels with 250 μ m pitch. Owing to a lack of availability of CZT wafers, lithography is commonly carried out on individual detector dies which represents a significant technical challenge as the edge of the pixel array and the surrounding guard band lies close to the physical edge of the crystal. Further, such detector dies are flip-chip bonded to readout ASIC using low-temperature curing silver-loaded epoxy so that the stress between the bonded detector die and the ASIC is minimized. In addition, this reduces crystalline modifications of the detector die that occur at temperature greater than 150\\r{ }C and have adverse effects on the detector performance. To allow smaller pitch detectors to be bonded, STFC has also developed a compression cold-weld indium bump bonding technique utilising bumps formed by a photolithographic lift-off technique.

  6. Current progress on pixel level packaging for uncooled IRFPA

    NASA Astrophysics Data System (ADS)

    Dumont, G.; Rabaud, W.; Yon, J.-J.; Carle, L.; Goudon, V.; Vialle, C.; Becker, Sébastien; Hamelin, Antoine; Arnaud, A.

    2012-06-01

    Vacuum packaging is definitely a major cost driver for uncooled IRFPA and a technological breakthrough is still expected to comply with the very low cost infrared camera market. To address this key issue, CEA-LETI is developing a Pixel Level Packaging (PLP) technology which basically consists in capping each pixel under vacuum in the direct continuation of the wafer level bolometer process. Previous CEA-LETI works have yet shown the feasibility of PLP based microbolometers that exhibit the required thermal insulation and vacuum achievement. CEA-LETI is still pushing the technology which has been now applied for the first time on a CMOS readout circuit. The paper will report on the recent progress obtained on PLP technology with particular emphasis on the optical efficiency of the PLP arrangement compared to the traditional microbolometer packaging. Results including optical performances, aging studies and compatibility with CMOS readout circuit are extensively presented.

  7. High-dynamic-range pixel architectures for diagnostic medical imaging

    NASA Astrophysics Data System (ADS)

    Karim, Karim S.; Yin, Sherman; Nathan, Arokia; Rowlands, John A.

    2004-05-01

    One approach to increase pixel signal-to-noise ratio (SNR) in low noise digital fluoroscopy is to employ in-situ pixel amplification via current-mediated active pixel sensors (C-APS). Experiments reveal a reduction in readout noise and indicate that an a-Si C-APS, coupled together with an established X-ray detection technology such as amorphous selenium (a-Se), can meet the stringent requirements (of < 1000 noise electrons) for digital X-ray fluoroscopy. A challenge with the C-APS circuit is the presence of a small-signal input linearity constraint. While using such a pixel amplifier for real-time fluoroscopy (where the exposure level is small) is feasible, the voltage change at the amplifier input is much higher in chest radiography or mammography due to the larger X-ray exposure levels. The larger input voltage causes the C-APS output to be non-linear thus reducing the pixel dynamic range. In addition, the resulting larger pixel output current causes the external column amplifier to saturate further reducing the pixel dynamic range. In this research, we investigate two alternate amplified pixel architectures that exhibit higher dynamic range. The test pixels are designed and simulated using an a-Si TFT model implemented in Verilog-A and results indicate a linear performance, high dynamic range, and a programmable circuit gain via choice of supply voltage and sampling time. These high dynamic range pixel architectures have the potential to enable a large area, active matrix flat panel imager (AMFPI) to switch instantly between low exposure, fluoroscopic imaging and higher exposure radiographic imaging modes. Lastly, the high dynamic range pixel circuits are suitable for integration with on-panel multiplexers for both gate and data lines, which can further reduce circuit complexity.

  8. ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays

    NASA Technical Reports Server (NTRS)

    Vasile, Stefan; Lipson, Jerold

    2012-01-01

    The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.

  9. Thin hybrid pixel assembly fabrication development with backside compensation layer

    NASA Astrophysics Data System (ADS)

    Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

    2017-02-01

    The ATLAS and CMS experiments will both replace their entire tracking systems for operation at the HL-LHC in 2026. This will include a significantly larger pixel systems, for example, for ATLAS approximately 15 m2. To keep the tracker material budget low it is crucial to minimize the mass of the pixel modules via thinning both the sensor and readout chip to about 150 μm each. The bump yield of thin module assemblies using solder based bump bonding can be problematic due to wafer bowing during solder reflow at high temperature. A new bump-bonding process using backside compensation on the readout chip to address the issue of low yield will be presented. The objective is to compensate dynamically the stress of the front side stack by adding a compensating layer to the backside of the wafer. A SiN and Al:Si stack has been chosen for the backside layer. The bow reducing effect of applying a backside compensation layer will be demonstrated using the FE-I4 wafer. The world's first results from assemblies produced from readout wafers thinned to 100 μm with a stress compensation layer are presented with bond yields close to 100% measured using the FE-I4 readout chip.

  10. High density pixel array

    NASA Technical Reports Server (NTRS)

    Wiener-Avnear, Eliezer (Inventor); McFall, James Earl (Inventor)

    2004-01-01

    A pixel array device is fabricated by a laser micro-milling method under strict process control conditions. The device has an array of pixels bonded together with an adhesive filling the grooves between adjacent pixels. The array is fabricated by moving a substrate relative to a laser beam of predetermined intensity at a controlled, constant velocity along a predetermined path defining a set of grooves between adjacent pixels so that a predetermined laser flux per unit area is applied to the material, and repeating the movement for a plurality of passes of the laser beam until the grooves are ablated to a desired depth. The substrate is of an ultrasonic transducer material in one example for fabrication of a 2D ultrasonic phase array transducer. A substrate of phosphor material is used to fabricate an X-ray focal plane array detector.

  11. Development of the Continuous Acquisition Pixel (CAP) sensor for high luminosity lepton colliders

    NASA Astrophysics Data System (ADS)

    Varner, G.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Martin, E.; Mueller, J.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanič, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Yang, Q.; Yarema, R.

    2006-09-01

    A future higher luminosity B-factory detector and concept study detectors for the proposed International Linear Collider require precision vertex reconstruction while coping with high track densities and radiation exposures. Compared with current silicon strip and hybrid pixels, a significant reduction in the overall detector material thickness is needed to achieve the desired vertex resolution. Considerable progress in the development of thin CMOS-based Monolithic Active Pixel Sensors (MAPS) in recent years makes them a viable technology option and feasibility studies are being actively pursued. The most serious concerns are their radiation hardness and their readout speed. To address these, several prototypes denoted as the Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25 μm process with a 5-deep Correlated Double Sample (CDS) pair pipeline in each pixel. A setup with several CAP3 sensors is under evaluation to assess the performance of a full-scale pixel readout system running at realistic readout speed. Given the similarity in the occupancy numbers and hit throughput requirements, per unit area, between a Belle vertex detector upgradation and the requirements for a future ILC pixel detector, this effort can be considered a small-scale functioning prototype for such a future system. The results and plans for the next stages of R&D towards a full Belle Pixel Vertex Detector (PVD) are presented.

  12. Compensated digital readout family

    NASA Technical Reports Server (NTRS)

    Ludwig, David E.; Skow, Michael

    1991-01-01

    ISC has completed test on an IC which has 32 channels of amplifiers, low pass anti-aliasing filters, 13-bit analog-to-digital (A/D) converters with non-uniformity correction per channel and a digital multiplexer. The single slope class of A/D conversion is described, as are the unique variations required for incorporation of this technique for use with on-focal plane detector readout electronics. This paper describes the architecture used to implement the digital on-focal plane signal processing functions. Results from measured data on a test IC are presented for a circuit containing these functions operating at a sensor frame rate of 1000 hertz.

  13. Characterization of Silicon Detector Readout Electronics

    SciTech Connect

    Jones, M.

    2015-07-22

    Configuration and calibration of the front-end electronics typical of many silicon detector configurations were investigated in a lab activity based on a pair of strip sensors interfaced with FSSR2 read-out chips and an FPGA. This simple hardware configuration, originally developed for a telescope at the Fermilab Test Beam Facility, was used to measure thresholds and noise on individual readout channels and to study the influence that different configurations of the front-end electronics had on the observed levels of noise in the system. An understanding of the calibration and operation of this small detector system provided an opportunity to explore the architecture of larger systems such as those currently in use at LHC experiments.

  14. Pixel electronics for the ATLAS experiment

    NASA Astrophysics Data System (ADS)

    Fischer, P.

    2001-06-01

    The ATLAS experiment at LHC will use 3 barrel layers and 2×5 disks of silicon pixel detectors as the innermost elements of the semiconductor tracker. The basic building blocks are pixel modules with an active area of 16.4 mm×60.8 mm which include an n + on n-type silicon sensor and 16 VLSI front-end (FE) chips. Every FE chip contains a low power, high speed charge sensitive preamplifier, a fast discriminator, and a readout system which operates at the 40 MHz rate of LHC. The addresses of hit pixels (as well as a low resolution pulse height information) are stored on the FE chips until arrival of a level 1 trigger signal. Hits are then transferred to a module controller chip (MCC) which collects the data of all 16 FE chips, builds complete events and sends the data through two optical links to the data acquisition system. The MCC receives clock and data through an additional optical link and provides timing and configuration information for the FE chips. Two additional chips are used to amplify and decode the pin diode signal and to drive the VCSEL laser diodes of the optical links.

  15. Characterization of Pixelated Cadmium-Zinc-Telluride Detectors for Astrophysical Applications

    NASA Technical Reports Server (NTRS)

    Gaskin, Jessica; Sharma, Dharma; Ramsey, Brian; Seller, Paul

    2003-01-01

    Comparisons of charge sharing and charge loss measurements between two pixelated Cadmium-Zinc-Telluride (CdZnTe) detectors are discussed. These properties along with the detector geometry help to define the limiting energy resolution and spatial resolution of the detector in question. The first detector consists of a 1-mm-thick piece of CdZnTe sputtered with a 4x4 array of pixels with pixel pitch of 750 microns (inter-pixel gap is 100 microns). Signal readout is via discrete ultra-low-noise preamplifiers, one for each of the 16 pixels. The second detector consists of a 2-mm-thick piece of CdZnTe sputtered with a 16x16 array of pixels with a pixel pitch of 300 microns (inter-pixel gap is 50 microns). This crystal is bonded to a custom-built readout chip (ASIC) providing all front-end electronics to each of the 256 independent pixels. These detectors act as precursors to that which will be used at the focal plane of the High Energy Replicated Optics (HERO) telescope currently being developed at Marshall Space Flight Center. With a telescope focal length of 6 meters, the detector needs to have a spatial resolution of around 200 microns in order to take full advantage of the HERO angular resolution. We discuss to what degree charge sharing will degrade energy resolution but will improve our spatial resolution through position interpolation.

  16. A two-dimensional position sensitive gas chamber with scanned charge transfer readout

    NASA Astrophysics Data System (ADS)

    Gómez, F.; Iglesias, A.; Lobato, R.; Mosquera, J.; Pardo, J.; Pena, J.; Pazos, A.; Pombar, M.; Rodríguez, A.

    2003-10-01

    We have constructed and tested a two-dimensional position sensitive parallel-plate gas ionization chamber with scanned charge transfer readout. The scan readout method described here is based on the development of a new position-dependent charge transfer technique. It has been implemented by using gate strips perpendicularly oriented to the collector strips. This solution reduces considerably the number of electronic readout channels needed to cover large detector areas. The use of a 25 μm thick kapton etched circuit allows high charge transfer efficiency with a low gating voltage, consequently needing a very simple commutating circuit. The present prototype covers 8×8 cm2 with a pixel size of 1.27×1.27 mm2. Depending on the intended use and beam characteristics a smaller effective pixel is feasible and larger active areas are possible. This detector can be used for X-ray or other continuous beam intensity profile monitoring.

  17. Fiber pixelated image database

    NASA Astrophysics Data System (ADS)

    Shinde, Anant; Perinchery, Sandeep Menon; Matham, Murukeshan Vadakke

    2016-08-01

    Imaging of physically inaccessible parts of the body such as the colon at micron-level resolution is highly important in diagnostic medical imaging. Though flexible endoscopes based on the imaging fiber bundle are used for such diagnostic procedures, their inherent honeycomb-like structure creates fiber pixelation effects. This impedes the observer from perceiving the information from an image captured and hinders the direct use of image processing and machine intelligence techniques on the recorded signal. Significant efforts have been made by researchers in the recent past in the development and implementation of pixelation removal techniques. However, researchers have often used their own set of images without making source data available which subdued their usage and adaptability universally. A database of pixelated images is the current requirement to meet the growing diagnostic needs in the healthcare arena. An innovative fiber pixelated image database is presented, which consists of pixelated images that are synthetically generated and experimentally acquired. Sample space encompasses test patterns of different scales, sizes, and shapes. It is envisaged that this proposed database will alleviate the current limitations associated with relevant research and development and would be of great help for researchers working on comb structure removal algorithms.

  18. Phase 1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Saha, Anirban

    2017-02-01

    The pixel tracker of the Compact Muon Solenoid (CMS) experiment is the innermost sub-detector, located close to the collision point, and is used for reconstruction of the tracks and vertices of charged particles. The present pixel detector was designed to work efficiently with the maximum instantaneous luminosity of 1 × 1034 cm‑2 s‑1. In 2017 the Large Hadron Collider (LHC) is expected to deliver a peak luminosity reaching up to 2 × 1034 cm‑2 s‑1, increasing the mean number of primary vertices to 50. Due to the radiation damage and significant data losses due to high occupancy in the readout chip of the pixel detector, the present system must be replaced by a new one in an extended end-of-year shutdown during winter 2016/2017 in order to maintain the excellent tracking and other physics performances. The main new features of the upgraded pixel detector are a ultra-light mechanical design with four barrel layers and three end-cap disks, digital readout chip with higher rate capability and a new cooling system. In this document, we discuss the motivations for the upgrade, the design, and technological choices made, the status of the construction of the new detector and the future plans for the installation and commissioning.

  19. Fast, High-Precision Readout Circuit for Detector Arrays

    NASA Technical Reports Server (NTRS)

    Rider, David M.; Hancock, Bruce R.; Key, Richard W.; Cunningham, Thomas J.; Wrigley, Chris J.; Seshadri, Suresh; Sander, Stanley P.; Blavier, Jean-Francois L.

    2013-01-01

    The GEO-CAPE mission described in NASA's Earth Science and Applications Decadal Survey requires high spatial, temporal, and spectral resolution measurements to monitor and characterize the rapidly changing chemistry of the troposphere over North and South Americas. High-frame-rate focal plane arrays (FPAs) with many pixels are needed to enable such measurements. A high-throughput digital detector readout integrated circuit (ROIC) that meets the GEO-CAPE FPA needs has been developed, fabricated, and tested. The ROIC is based on an innovative charge integrating, fast, high-precision analog-to-digital circuit that is built into each pixel. The 128×128-pixel ROIC digitizes all 16,384 pixels simultaneously at frame rates up to 16 kHz to provide a completely digital output on a single integrated circuit at an unprecedented rate of 262 million pixels per second. The approach eliminates the need for off focal plane electronics, greatly reducing volume, mass, and power compared to conventional FPA implementations. A focal plane based on this ROIC will require less than 2 W of power on a 1×1-cm integrated circuit. The ROIC is fabricated of silicon using CMOS technology. It is designed to be indium bump bonded to a variety of detector materials including silicon PIN diodes, indium antimonide (InSb), indium gallium arsenide (In- GaAs), and mercury cadmium telluride (HgCdTe) detector arrays to provide coverage over a broad spectral range in the infrared, visible, and ultraviolet spectral ranges.

  20. The PAUCam readout electronics system

    NASA Astrophysics Data System (ADS)

    Jiménez, Jorge; Illa, José M.; Cardiel-Sas, Laia; de Vicente, Juan; Castilla, Javier; Casas, Ricard

    2016-08-01

    The PAUCam is an optical camera with a wide field of view of 1 deg x 1 deg and up to 46 narrow and broad band filters. The camera is already installed on the William Herschel Telescope (WHT) in the Canary Islands, Spain and successfully commissioned during the first period of 2015. The paper presents the main results from the readout electronics commissioning tests and include an overview of the whole readout electronics system, its configuration and current performance.

  1. Selecting Pixels for Kepler Downlink

    NASA Technical Reports Server (NTRS)

    Bryson, Stephen T.; Jenkins, Jon M.; Klaus, Todd C.; Cote, Miles T.; Quintana, Elisa V.; Hall, Jennifer R.; Ibrahim, Khadeejah; Chandrasekaran, Hema; Caldwell, Douglas A.; Van Cleve, Jeffrey E.; Haas, Michael R.

    2010-01-01

    The Kepler mission monitors > 100,000 stellar targets using 42 2200 1024 pixel CCDs. Bandwidth constraints prevent the downlink of all 96 million pixels per 30-minute cadence, so the Kepler spacecraft downlinks a specified collection of pixels for each target. These pixels are selected by considering the object brightness, background and the signal-to-noise of each pixel, and are optimized to maximize the signal-to-noise ratio of the target. This paper describes pixel selection, creation of spacecraft apertures that efficiently capture selected pixels, and aperture assignment to a target. Diagnostic apertures, short-cadence targets and custom specified shapes are discussed.

  2. CMOS VLSI Active-Pixel Sensor for Tracking

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Sun, Chao; Yang, Guang; Heynssens, Julie

    2004-01-01

    An architecture for a proposed active-pixel sensor (APS) and a design to implement the architecture in a complementary metal oxide semiconductor (CMOS) very-large-scale integrated (VLSI) circuit provide for some advanced features that are expected to be especially desirable for tracking pointlike features of stars. The architecture would also make this APS suitable for robotic- vision and general pointing and tracking applications. CMOS imagers in general are well suited for pointing and tracking because they can be configured for random access to selected pixels and to provide readout from windows of interest within their fields of view. However, until now, the architectures of CMOS imagers have not supported multiwindow operation or low-noise data collection. Moreover, smearing and motion artifacts in collected images have made prior CMOS imagers unsuitable for tracking applications. The proposed CMOS imager (see figure) would include an array of 1,024 by 1,024 pixels containing high-performance photodiode-based APS circuitry. The pixel pitch would be 9 m. The operations of the pixel circuits would be sequenced and otherwise controlled by an on-chip timing and control block, which would enable the collection of image data, during a single frame period, from either the full frame (that is, all 1,024 1,024 pixels) or from within as many as 8 different arbitrarily placed windows as large as 8 by 8 pixels each. A typical prior CMOS APS operates in a row-at-a-time ( grolling-shutter h) readout mode, which gives rise to exposure skew. In contrast, the proposed APS would operate in a sample-first/readlater mode, suppressing rolling-shutter effects. In this mode, the analog readout signals from the pixels corresponding to the windows of the interest (which windows, in the star-tracking application, would presumably contain guide stars) would be sampled rapidly by routing them through a programmable diagonal switch array to an on-chip parallel analog memory array. The

  3. Simple Bulk Readout of Digital Nucleic Acid Quantification Assays.

    PubMed

    Morinishi, Leanna S; Blainey, Paul

    2015-09-24

    Digital assays are powerful methods that enable detection of rare cells and counting of individual nucleic acid molecules. However, digital assays are still not routinely applied, due to the cost and specific equipment associated with commercially available methods. Here we present a simplified method for readout of digital droplet assays using a conventional real-time PCR instrument to measure bulk fluorescence of droplet-based digital assays. We characterize the performance of the bulk readout assay using synthetic droplet mixtures and a droplet digital multiple displacement amplification (MDA) assay. Quantitative MDA particularly benefits from a digital reaction format, but our new method applies to any digital assay. For established digital assay protocols such as digital PCR, this method serves to speed up and simplify assay readout. Our bulk readout methodology brings the advantages of partitioned assays without the need for specialized readout instrumentation. The principal limitations of the bulk readout methodology are reduced dynamic range compared with droplet-counting platforms and the need for a standard sample, although the requirements for this standard are less demanding than for a conventional real-time experiment. Quantitative whole genome amplification (WGA) is used to test for contaminants in WGA reactions and is the most sensitive way to detect the presence of DNA fragments with unknown sequences, giving the method great promise in diverse application areas including pharmaceutical quality control and astrobiology.

  4. PAUCam readout electronics assembly, integration and test (AIT)

    NASA Astrophysics Data System (ADS)

    Jiménez, Jorge; Illa, José M.; Cardiel-Sas, Laia; de Vicente, Juan; Castilla, Javier; Casas, Ricard

    2014-08-01

    The PAUCam is an optical camera with an array of 18 CCDs (Hamamatsu Photonics K.K.) and up to 45 narrow and broad band filters. The camera will be installed on the William Herschel Telescope (WHT) in the Canary Islands, Spain. In order to fulfill with the specifications for the camera readout system, it was necessary to test the different readout electronics subsystems individually before to integrate the final readout work package, which is composed of 4 MONSOON (NOAO) front-ends, 6 fan out boards (MIX), each one driving up to 5 CCDs signals and a pre-amplification stage (PREAMP) located inside the cryostat. To get the subsystems integration, it was built a small camera prototype using the same technology as used in the main camera: a carbon fiber cryostat refrigerated by a cryotiger cooling system but with capacity to allocate just 2 CCDs, which were readout and re-characterized to measure the electronics performance as conversion factor or gain, readout noise, stability, linearity, etc. while the cross-talk was measured by using a spot-light. The aim of this paper is to review the whole process of assembly, integration and test (AIT) of the readout electronics work package and present the main results to demonstrate the viability of the proposed systems to be use with the PAUCam camera.

  5. The Belle II DEPFET pixel detector

    NASA Astrophysics Data System (ADS)

    Moser, Hans-Günther

    2016-09-01

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55-60) μm in the first layer and between 50 μm×(70-85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the 'internal gate' modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X0). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO2 system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  6. Planar pixel sensors for the ATLAS upgrade: beam tests results

    NASA Astrophysics Data System (ADS)

    Weingarten, J.; Altenheiner, S.; Beimforde, M.; Benoit, M.; Bomben, M.; Calderini, G.; Gallrapp, C.; George, M.; Gibson, S.; Grinstein, S.; Janoska, Z.; Jentzsch, J.; Jinnouchi, O.; Kishida, T.; La Rosa, A.; Libov, V.; Macchiolo, A.; Marchiori, G.; Muenstermann, D.; Nagai, R.; Piacquadio, G.; Ristic, B.; Rubinskiy, I.; Rummler, A.; Takubo, Y.; Troska, G.; Tsiskaridtze, S.; Tsurin, I.; Unno, Y.; Weigell, P.; Wittig, T.

    2012-10-01

    The performance of planar silicon pixel sensors, in development for the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades, has been examined in a series of beam tests at the CERN SPS facilities since 2009. Salient results are reported on the key parameters, including the spatial resolution, the charge collection and the charge sharing between adjacent cells, for different bulk materials and sensor geometries. Measurements are presented for n+-in-n pixel sensors irradiated with a range of fluences and for p-type silicon sensors with various layouts from different vendors. All tested sensors were connected via bump-bonding to the ATLAS Pixel read-out chip. The tests reveal that both n-type and p-type planar sensors are able to collect significant charge even after the lifetime fluence expected at the HL-LHC.

  7. The Phase-1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Klein, Katja

    2017-02-01

    The CMS experiment features a pixel detector with three barrel layers and two discs per side, corresponding to an active silicon area of 1 m2. The detector delivered high-quality data during LHC Run 1. However, the CMS pixel detector was designed for the nominal instantaneous LHC luminosity of 1 ·1034cm-2s-1 . It is expected that the instantaneous luminosity will increase and reach twice the design value before Long Shutdown 3, scheduled for 2023. Under such conditions, the present readout chip would suffer from data loss due to buffer overflow, leading to significant inefficiencies of up to 16%. The CMS collaboration is presently constructing a new pixel detector to replace the present device during the winter shutdown 2016/2017. The design of this new detector will be outlined, the construction status summarized and the performance described.

  8. Silicon pixel detector prototyping in SOI CMOS technology

    NASA Astrophysics Data System (ADS)

    Dasgupta, Roma; Bugiel, Szymon; Idzik, Marek; Kapusta, Piotr; Kucewicz, Wojciech; Turala, Michal

    2016-12-01

    The Silicon-On-Insulator (SOI) CMOS is one of the most advanced and promising technology for monolithic pixel detectors design. The insulator layer that is implemented inside the silicon crystal allows to integrate sensors matrix and readout electronic on a single wafer. Moreover, the separation of electronic and substrate increases also the SOI circuits performance. The parasitic capacitances to substrate are significantly reduced, so the electronic systems are faster and consume much less power. The authors of this presentation are the members of international SOIPIX collaboration, that is developing SOI pixel detectors in 200 nm Lapis Fully-Depleted, Low-Leakage SOI CMOS. This work shows a set of advantages of SOI technology and presents possibilities for pixel detector design SOI CMOS. In particular, the preliminary results of a Cracow chip are presented.

  9. Tracking performance of a single-crystal and a polycrystalline diamond pixel-detector

    SciTech Connect

    Menasce, D.; et al.

    2013-06-01

    We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke$-$), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

  10. Recent progress in the development of a B-factory monolithic active pixel detector

    NASA Astrophysics Data System (ADS)

    Stanič, S.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Varner, G.; Yang, Q.

    2006-11-01

    Due to the need for precise vertexing at future higher luminosity B-factories with the expectedly increasing track densities and radiation exposures, upgrade of present silicon strip detectors with thin, radiation resistant pixel detectors is highly desired. Considerable progress in the technological development of thin CMOS based Monolithic Active Pixel Sensors (MAPS) in the last years makes them a realistic upgrade option and the feasibility studies of their application in Belle are actively pursued. The most serious concerns are their radiation hardness and their read-out speed. To address them, several prototypes denoted as Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25 μm process with a 5-deep sample pair pipeline in each pixel. A setup with several CAP3 sensors will be used to assess the performance of a full scale pixel read-out system running at realistic read-out speed. The results and plans for the next stages of R&D towards a full Pixel Vertex Detector (PVD) are presented.

  11. Review of results for the NA62 gigatracker read-out prototype

    NASA Astrophysics Data System (ADS)

    Martin, E.; Aglieri Rinella, G.; Carassiti, V.; Ceccucci, A.; Cortina Gil, E.; Cotta Ramusino, A.; Dellacasa, G.; Fiorini, M.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petagna, P.; Petrucci, F.; Perktold, L.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    2012-03-01

    The Gigatracker (GTK) is a hybrid silicon pixel detector developed for NA62, an experiment studying ultra-rare kaon decays at the CERN SPS. The main characteristics are a time-tagging resoluion of 150ps, with low material budget per station (0.5% X0) and a fluence comparable to the one expected for the inner trackers of LHC detectors in 10 years of operation. To compensate the time-walk, two read-out architectures have been designed and produced. The first architecture is based on a Constant Fraction Discriminator (CFD) followed by an on-pixel Time-to-Digital-Converter (TDC). The second architecture is based on a on-pixel group shared TDC. The GTK system developments are described: the integration steps (assembly and cooling) and the results obtained from the prototypes fabricated for the two read-out architectures.

  12. Challenges of small-pixel infrared detectors: a review

    NASA Astrophysics Data System (ADS)

    Rogalski, A.; Martyniuk, P.; Kopytko, M.

    2016-04-01

    In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology—HgCdTe material systems and III-V materials (mainly barrier detectors)—have been investigated.

  13. Fault tolerant photodiode and photogate active pixel sensors

    NASA Astrophysics Data System (ADS)

    Jung, Cory; Chapman, Glenn H.; La Haye, Michelle L.; Djaja, Sunjaya; Cheung, Desmond Y. H.; Lin, Henry; Loo, Edward; Audet, Yves R.

    2005-03-01

    As the pixel counts of digital imagers increase, the challenge of maintaining high yields and ensuring reliability over an imager"s lifetime increases. A fault tolerant active pixel sensor (APS) has been designed to meet this need by splitting an APS in half and operating both halves in parallel. The fault tolerant APS will perform normally in the no defect case and will produce approximately half the output for single defects. Thus, the entire signal can be recovered by multiplying the output by two. Since pixels containing multiple defects are rare, this design can correct for most defects allowing for higher production yields. Fault tolerant photodiode and photogate APS" were fabricated in 0.18-micron technology. Testing showed that the photodiode APS could correct for optically induced and electrically induced faults, within experimental error. The photogate APS was only tested for optically induced defects and also corrects for defects within experimental error. Further testing showed that the sensitivity of fault tolerant pixels was approximately 2-3 times more sensitive than the normal pixels. HSpice simulations of the fault tolerant APS circuit did not show increased sensitivity, however an equivalent normal APS circuit with twice width readout and row transistors was 1.90 times more sensitive than a normal pixel.

  14. Detection and Real Time Spectroscopy of Charged Particles with the TimePix Pixel Detector

    NASA Astrophysics Data System (ADS)

    Granja, Carlos; Jakubek, Jan; Platkevic, Michal; Pospisil, Stanislav; Vykydal, Zdenek

    2010-01-01

    We tested the position—, spectral— and time—resolution capability of the TimePix semiconductor detector together with the USB readout interface and Pixelman control and DAQ software tool for detection and visualization of particles. Event—by—event spectroscopy can be achieved by real time analysis of the characteristic tracks and specific response of different radiation in the pixel detector.

  15. Hybrid pixel-waveform CdTe/CZT detector for use in an ultrahigh resolution MRI compatible SPECT system

    NASA Astrophysics Data System (ADS)

    Cai, Liang; Meng, Ling-Jian

    2013-02-01

    In this paper, we will present a new small pixel CdTe/CZT detector for sub-500 μm resolution SPECT imaging application inside MR scanner based on a recently developed hybrid pixel-waveform (HPWF) readout circuitry. The HPWF readout system consists of a 2-D multi-pixel circuitry attached to the anode pixels to provide the X-Y positions of interactions, and a high-speed digitizer to read out the pulse-waveform induced on the cathode. The digitized cathode waveform could provide energy deposition information, precise timing and depth-of-interaction information for gamma ray interactions. Several attractive features with this HPWF detector system will be discussed in this paper. To demonstrate the performance, we constructed several prototype HPWF detectors with pixelated CZT and CdTe detectors of 2-5 mm thicknesses, connected to a prototype readout system consisting of energy-resolved photon-counting ASIC for readout anode pixels and an Agilent high-speed digitizer for digitizing the cathode signals. The performances of these detectors based on HPWF are discussed in this paper.

  16. Hybrid pixel-waveform CdTe/CZT detector for use in an ultrahigh resolution MRI compatible SPECT system.

    PubMed

    Cai, Liang; Meng, Ling-Jian

    2013-02-01

    In this paper, we will present a new small pixel CdTe/CZT detector for sub-500 μm resolution SPECT imaging application inside MR scanner based on a recently developed hybrid pixel-waveform (HPWF) readout circuitry. The HPWF readout system consists of a 2-D multi-pixel circuitry attached to the anode pixels to provide the X-Y positions of interactions, and a high-speed digitizer to read out the pulse-waveform induced on the cathode. The digitized cathode waveform could provide energy deposition information, precise timing and depth-of-interaction information for gamma ray interactions. Several attractive features with this HPWF detector system will be discussed in this paper. To demonstrate the performance, we constructed several prototype HPWF detectors with pixelated CZT and CdTe detectors of 2-5 mm thicknesses, connected to a prototype readout system consisting of energy-resolved photon-counting ASIC for readout anode pixels and an Agilent high-speed digitizer for digitizing the cathode signals. The performances of these detectors based on HPWF are discussed in this paper.

  17. Hybrid pixel-waveform CdTe/CZT detector for use in an ultrahigh resolution MRI compatible SPECT system

    PubMed Central

    Cai, Liang; Meng, Ling-Jian

    2013-01-01

    In this paper, we will present a new small pixel CdTe/CZT detector for sub-500 μm resolution SPECT imaging application inside MR scanner based on a recently developed hybrid pixel-waveform (HPWF) readout circuitry. The HPWF readout system consists of a 2-D multi-pixel circuitry attached to the anode pixels to provide the X–Y positions of interactions, and a high-speed digitizer to read out the pulse-waveform induced on the cathode. The digitized cathode waveform could provide energy deposition information, precise timing and depth-of-interaction information for gamma ray interactions. Several attractive features with this HPWF detector system will be discussed in this paper. To demonstrate the performance, we constructed several prototype HPWF detectors with pixelated CZT and CdTe detectors of 2–5 mm thicknesses, connected to a prototype readout system consisting of energy-resolved photon-counting ASIC for readout anode pixels and an Agilent high-speed digitizer for digitizing the cathode signals. The performances of these detectors based on HPWF are discussed in this paper. PMID:24371365

  18. High-Resolution Mammography Detector Employing Optical Switching Readout

    NASA Astrophysics Data System (ADS)

    Irisawa, Kaku; Kaneko, Yasuhisa; Yamane, Katsutoshi; Sendai, Tomonari; Hosoi, Yuichi

    Conceiving a new detector structure, FUJIFILM Corporation has successfully put its invention of an X-ray detector employing "Optical Switching" into practical use. Since Optical Switching Technology allows an electrode structure to be easily designed, both high resolution of pixel pitch and low electrical noise readout have been achieved, which have consequently realized the world's smallest pixel size of 50×50 μm2 from a Direct-conversion FPD system as well as high DQE. The digital mammography system equipped with this detector enables to acquire high definition images while maintaining granularity. Its outstanding feature is to be able to acquire high-precision images of microcalcifications which is an important index in breast examination.

  19. A novel JFET readout structure applicable for pinned and lateral drift-field photodiodes

    NASA Astrophysics Data System (ADS)

    Süss, Andreas; Hosticka, Bedrich J.

    2012-04-01

    Enhancement of the dynamic range of photodetectors used in advanced image sensors such as time-of-flight sensors or image sensors for automotive applications is a major research topic. In this paper an improved unipolar readout structure is presented, that is superior to the widely employed source follower readout implemented by enhancement MOSFETs. It yields a high output voltage swing and low noise, while requiring no additional processing steps. The readout structure is consisting of a low-noise JFET whose gates are formed by a floating diffusion, thus preserving in-pixel accumulation capability - which additionally improves noise performance. This structure outperforms a simple in-pixel implementation of a JFET and a photodetector in terms of the necessary area consumption, thus improving fill factor. For pixels with a pitch of several microns this readout structure is a good trade-off between area, output voltage swing and, most important, noise performance. Furthermore, since only a ground connection is needed for application, fill-factor and power-grid disturbances like DC-voltage drop can be additionally improved.

  20. Development of planar pixel modules for the ATLAS high luminosity LHC tracker upgrade

    NASA Astrophysics Data System (ADS)

    Allport, P. P.; Ashby, J.; Bates, R. L.; Blue, A.; Burdin, S.; Buttar, C. M.; Casse, G.; Dervan, P.; Doonan, K.; Forshaw, D.; Lipp, J.; McMullen, T.; Pater, J.; Stewart, A.; Tsurin, I.

    2014-11-01

    The high-luminosity LHC will present significant challenges for tracking systems. ATLAS is preparing to upgrade the entire tracking system, which will include a significantly larger pixel detector. This paper reports on the development of large area planar detectors for the outer pixel layers and the pixel endcaps. Large area sensors have been fabricated and mounted onto 4 FE-I4 readout ASICs, the so-called quad-modules, and their performance evaluated in the laboratory and testbeam. Results from characterisation of sensors prior to assembly, experience with module assembly, including bump-bonding and results from laboratory and testbeam studies are presented.

  1. Automated procedures for the assembly of the CMS Phase 1 upgrade pixel modules

    NASA Astrophysics Data System (ADS)

    Wade, Alex; CMS Collaboration

    2016-03-01

    The Phase 1 upgrade of the pixel tracker for the CMS experiment requires the assembly of approximately 1000 modules consisting of pixel sensors bump bonded to readout chips. The precision assembly of modules in this volume is made possible using several robotic processes for dispensing epoxy,positioning of sensor components, automatic wire-bonding and robotic deposition of elastomer for wire bond encapsulation. We will describe the these processes in detail, along with the measurements that quanitfy the quality of assembled modules, and describe the subsequent steps in which the sensor modules are used in the construction of the Phase 1 pixel tracker. With support from USCMS.

  2. The Phase1 CMS Pixel detector upgrade

    NASA Astrophysics Data System (ADS)

    Tavolaro, V. R.

    2016-12-01

    The pixel detector of the CMS experiment will be replaced in an extended end-of-year shutdown during winter 2016/2017 with an upgraded one able to cope with peak instantaneous luminosities beyond the nominal LHC instantaneous luminosity of 1 × 1034 cm-2 s-1. Under the conditions expected in the coming years, which will see an increase of a factor two in instantaneous luminosity, the present system would experience a dynamic inefficiency caused mainly by data losses due to buffer overflows. The Phase I upgrade of the CMS pixel detector, described in this paper, will operate at full efficiency at an instantaneous luminosity of 2 × 1034 cm-2 s-1 and beyond, thanks to a new readout chip. The new detector will feature one additional tracking point both in the barrel and in the forward regions, while reducing the material budget as a result of a new CO2 cooling system and optimised layout of the services. In this paper, the design and the technological choices of the Phase I detector will be reviewed and the status of the construction of the detector and the performance of its components will be discussed.

  3. Further applications for mosaic pixel FPA technology

    NASA Astrophysics Data System (ADS)

    Liddiard, Kevin C.

    2011-06-01

    In previous papers to this SPIE forum the development of novel technology for next generation PIR security sensors has been described. This technology combines the mosaic pixel FPA concept with low cost optics and purpose-designed readout electronics to provide a higher performance and affordable alternative to current PIR sensor technology, including an imaging capability. Progressive development has resulted in increased performance and transition from conventional microbolometer fabrication to manufacture on 8 or 12 inch CMOS/MEMS fabrication lines. A number of spin-off applications have been identified. In this paper two specific applications are highlighted: high performance imaging IRFPA design and forest fire detection. The former involves optional design for small pixel high performance imaging. The latter involves cheap expendable sensors which can detect approaching fire fronts and send alarms with positional data via mobile phone or satellite link. We also introduce to this SPIE forum the application of microbolometer IR sensor technology to IoT, the Internet of Things.

  4. GBT based readout in the CBM experiment

    NASA Astrophysics Data System (ADS)

    Lehnert, J.; Byszuk, A. P.; Emschermann, D.; Kasinski, K.; Müller, W. F. J.; Schmidt, C. J.; Szczygiel, R.; Zabolotny, W. M.

    2017-02-01

    The CBM experiment at FAIR will use GBTX and Versatile Link based readout systems for several of its subdetectors. The paper describes the GBT based readout concept in CBM, emphasizing the common features among systems. Particular choices and features of the readout are motivated mainly by the requirements in the readout of the silicon tracking system (STS). Common developments like a common CBM readout board are presented. The prototype board provides full GBT functionality for all systems, can be interfaced to various prototype readout chains and be refined for later detector specific versions.

  5. Focal plane infrared readout circuit

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor)

    2002-01-01

    An infrared imager, such as a spectrometer, includes multiple infrared photodetectors and readout circuits for reading out signals from the photodetectors. Each readout circuit includes a buffered direct injection input circuit including a differential amplifier with active feedback provided through an injection transistor. The differential amplifier includes a pair of input transistors, a pair of cascode transistors and a current mirror load. Photocurrent from a photodetector can be injected onto an integration capacitor in the readout circuit with high injection efficiency at high speed. A high speed, low noise, wide dynamic range linear infrared multiplexer array for reading out infrared detectors with large capacitances can be achieved even when short exposure times are used. The effect of image lag can be reduced.

  6. Side readout of long scintillation crystal elements with digital SiPM for TOF-DOI PET

    SciTech Connect

    Yeom, Jung Yeol E-mail: cslevin@stanford.edu; Vinke, Ruud; Levin, Craig S. E-mail: cslevin@stanford.edu

    2014-12-15

    Purpose: Side readout of scintillation light from crystal elements in positron emission tomography (PET) is an alternative to conventional end-readout configurations, with the benefit of being able to provide accurate depth-of-interaction (DOI) information and good energy resolution while achieving excellent timing resolution required for time-of-flight PET. This paper explores different readout geometries of scintillation crystal elements with the goal of achieving a detector that simultaneously achieves excellent timing resolution, energy resolution, spatial resolution, and photon sensitivity. Methods: The performance of discrete LYSO scintillation elements of different lengths read out from the end/side with digital silicon photomultipliers (dSiPMs) has been assessed. Results: Compared to 3 × 3 × 20 mm{sup 3} LYSO crystals read out from their ends with a coincidence resolving time (CRT) of 162 ± 6 ps FWHM and saturated energy spectra, a side-readout configuration achieved an excellent CRT of 144 ± 2 ps FWHM after correcting for timing skews within the dSiPM and an energy resolution of 11.8% ± 0.2% without requiring energy saturation correction. Using a maximum likelihood estimation method on individual dSiPM pixel response that corresponds to different 511 keV photon interaction positions, the DOI resolution of this 3 × 3 × 20 mm{sup 3} crystal side-readout configuration was computed to be 0.8 mm FWHM with negligible artifacts at the crystal ends. On the other hand, with smaller 3 × 3 × 5 mm{sup 3} LYSO crystals that can also be tiled/stacked to provide DOI information, a timing resolution of 134 ± 6 ps was attained but produced highly saturated energy spectra. Conclusions: The energy, timing, and DOI resolution information extracted from the side of long scintillation crystal elements coupled to dSiPM have been acquired for the first time. The authors conclude in this proof of concept study that such detector configuration has the potential to enable

  7. Side readout of long scintillation crystal elements with digital SiPM for TOF-DOI PET

    PubMed Central

    Yeom, Jung Yeol; Vinke, Ruud; Levin, Craig S.

    2014-01-01

    Purpose: Side readout of scintillation light from crystal elements in positron emission tomography (PET) is an alternative to conventional end-readout configurations, with the benefit of being able to provide accurate depth-of-interaction (DOI) information and good energy resolution while achieving excellent timing resolution required for time-of-flight PET. This paper explores different readout geometries of scintillation crystal elements with the goal of achieving a detector that simultaneously achieves excellent timing resolution, energy resolution, spatial resolution, and photon sensitivity. Methods: The performance of discrete LYSO scintillation elements of different lengths read out from the end/side with digital silicon photomultipliers (dSiPMs) has been assessed. Results: Compared to 3 × 3 × 20 mm3 LYSO crystals read out from their ends with a coincidence resolving time (CRT) of 162 ± 6 ps FWHM and saturated energy spectra, a side-readout configuration achieved an excellent CRT of 144 ± 2 ps FWHM after correcting for timing skews within the dSiPM and an energy resolution of 11.8% ± 0.2% without requiring energy saturation correction. Using a maximum likelihood estimation method on individual dSiPM pixel response that corresponds to different 511 keV photon interaction positions, the DOI resolution of this 3 × 3 × 20 mm3 crystal side-readout configuration was computed to be 0.8 mm FWHM with negligible artifacts at the crystal ends. On the other hand, with smaller 3 × 3 × 5 mm3 LYSO crystals that can also be tiled/stacked to provide DOI information, a timing resolution of 134 ± 6 ps was attained but produced highly saturated energy spectra. Conclusions: The energy, timing, and DOI resolution information extracted from the side of long scintillation crystal elements coupled to dSiPM have been acquired for the first time. The authors conclude in this proof of concept study that such detector configuration has the potential to enable outstanding

  8. Denoising Algorithm for the Pixel-Response Non-Uniformity Correction of a Scientific CMOS Under Low Light Conditions

    NASA Astrophysics Data System (ADS)

    Hu, Changmiao; Bai, Yang; Tang, Ping

    2016-06-01

    We present a denoising algorithm for the pixel-response non-uniformity correction of a scientific complementary metal-oxide-semiconductor (CMOS) image sensor, which captures images under extremely low-light conditions. By analyzing the integrating sphere experimental data, we present a pixel-by-pixel flat-field denoising algorithm to remove this fixed pattern noise, which occur in low-light conditions and high pixel response readouts. The response of the CMOS image sensor imaging system to the uniform radiance field shows a high level of spatial uniformity after the denoising algorithm has been applied.

  9. Thermopile detector radiation hard readout

    NASA Astrophysics Data System (ADS)

    Gaalema, Stephen; Van Duyne, Stephen; Gates, James L.; Foote, Marc C.

    2010-08-01

    The NASA Jupiter Europa Orbiter (JEO) conceptual payload contains a thermal instrument with six different spectral bands ranging from 8μm to 100μm. The thermal instrument is based on multiple linear arrays of thermopile detectors that are intrinsically radiation hard; however, the thermopile CMOS readout needs to be hardened to tolerate the radiation sources of the JEO mission. Black Forest Engineering is developing a thermopile readout to tolerate the JEO mission radiation sources. The thermal instrument and ROIC process/design techniques are described to meet the JEO mission requirements.

  10. Linear readout of object manifolds

    NASA Astrophysics Data System (ADS)

    Chung, SueYeon; Lee, Daniel D.; Sompolinsky, Haim

    2016-06-01

    Objects are represented in sensory systems by continuous manifolds due to sensitivity of neuronal responses to changes in physical features such as location, orientation, and intensity. What makes certain sensory representations better suited for invariant decoding of objects by downstream networks? We present a theory that characterizes the ability of a linear readout network, the perceptron, to classify objects from variable neural responses. We show how the readout perceptron capacity depends on the dimensionality, size, and shape of the object manifolds in its input neural representation.

  11. Spatial Pileup Considerations for Pixellated Gamma -ray Detectors

    PubMed Central

    Furenlid, L.R.; Clarkson, E.; Marks, D.G.; Barrett, H.H.

    2015-01-01

    High-spatial-resolution solid-state detectors being developed for gamma-ray applications benefit from having pixel dimensions substantially smaller than detector slab thickness. This leads to an enhanced possibility of charge partially spreading to neighboring pixels as a result of diffusion (and secondary photon emission) transverse to the drift direction. An undesirable consequence is the effective magnification of the event “size“ and the spatial overlap issues which result when two photons are absorbed in close proximity within the integration time of the detector/readout system. In this work, we develop the general statistics of spatial pileup in imaging systems and apply the results to detectors we are developing based on pixellated cadmium zinc telluride (CdZnTe) and a multiplexing application-specific integrated circuit (ASIC) readout. We consider the limitations imposed on total count rate capacity and explore in detail the consequences for the LISTMODE data-acquisition strategy. Algorithms are proposed for identifying and, where possible, resolving overlapping events by maximum-likelihood estimation. The efficacy and noise tolerance of these algorithms will be tested with a combination of simulated and experimental data in future work. PMID:26568675

  12. Orthogonal sequencing multiplexer for superconducting nanowire single-photon detectors with RSFQ electronics readout circuit.

    PubMed

    Hofherr, Matthias; Wetzstein, Olaf; Engert, Sonja; Ortlepp, Thomas; Berg, Benjamin; Ilin, Konstantin; Henrich, Dagmar; Stolz, Ronny; Toepfer, Hannes; Meyer, Hans-Georg; Siegel, Michael

    2012-12-17

    We propose an efficient multiplexing technique for superconducting nanowire single-photon detectors based on an orthogonal detector bias switching method enabling the extraction of the average count rate of a set of detectors by one readout line. We implemented a system prototype where the SNSPDs are connected to an integrated cryogenic readout and a pulse merger system based on rapid single flux quantum (RSFQ) electronics. We discuss the general scalability of this concept, analyze the environmental requirements which define the resolvability and the accuracy and demonstrate the feasibility of this approach with experimental results for a SNSPD array with four pixels.

  13. Development of Kilo-Pixel Arrays of Transition-Edge Sensors for X-Ray Spectroscopy

    NASA Technical Reports Server (NTRS)

    Adams, J. S.; Bandler, S. R.; Busch, S. E.; Chervenak, J. A.; Chiao, M. P.; Eckart, M. E.; Ewin, A. J.; Finkbeiner, F. M.; Kelley, R. L.; Kelly, D. P.; Kilbourne, C. A.; Leutenegger, M. A.; Porst, J.-P.; Porter, F. S.; Ray, C. A.; Sadleir, J. E.; Smith, S. J.; Wassell, E. J.; Doriese, W. B.; Fowler, J. W.; Hilton, G. C.; Irwin, K. D.; Reintsema, C. D.; Smith, D. R.; Swetz, D. S.

    2012-01-01

    We are developing kilo-pixel arrays of transition-edge sensor (TES) microcalorimeters for future X-ray astronomy observatories or for use in laboratory astrophysics applications. For example, Athena/XMS (currently under study by the european space agency) would require a close-packed 32x32 pixel array on a 250-micron pitch with < 3.0 eV full-width-half-maximum energy resolution at 6 keV and at count-rates of up to 50 counts/pixel/second. We present characterization of 32x32 arrays. These detectors will be readout using state of the art SQUID based time-domain multiplexing (TDM). We will also present the latest results in integrating these detectors and the TDM readout technology into a 16 row x N column field-able instrument.

  14. Pooled CRISPR screening with single-cell transcriptome readout.

    PubMed

    Datlinger, Paul; Rendeiro, André F; Schmidl, Christian; Krausgruber, Thomas; Traxler, Peter; Klughammer, Johanna; Schuster, Linda C; Kuchler, Amelie; Alpar, Donat; Bock, Christoph

    2017-03-01

    CRISPR-based genetic screens are accelerating biological discovery, but current methods have inherent limitations. Widely used pooled screens are restricted to simple readouts including cell proliferation and sortable marker proteins. Arrayed screens allow for comprehensive molecular readouts such as transcriptome profiling, but at much lower throughput. Here we combine pooled CRISPR screening with single-cell RNA sequencing into a broadly applicable workflow, directly linking guide RNA expression to transcriptome responses in thousands of individual cells. Our method for CRISPR droplet sequencing (CROP-seq) enables pooled CRISPR screens with single-cell transcriptome resolution, which will facilitate high-throughput functional dissection of complex regulatory mechanisms and heterogeneous cell populations.

  15. Demonstration of Time Domain Multiplexed Readout for Magnetically Coupled Calorimeters

    NASA Technical Reports Server (NTRS)

    Porst, J.-P.; Adams, J. S.; Balvin, M.; Bandler, S.; Beyer, J.; Busch, S. E.; Drung, D.; Seidel, G. M.; Smith, S. J.; Stevenson, T. R.

    2012-01-01

    Magnetically coupled calorimeters (MCC) have extremely high potential for x-ray applications due to the inherent high energy resolution capability and being non-dissipative. Although very high energy-resolution has been demonstrated, until now there has been no demonstration of multiplexed read-out. We report on the first realization of a time domain multiplexed (TDM) read-out. While this has many similarities with TDM of transition-edge-sensors (TES), for MGGs the energy resolution is limited by the SQUID read-out noise and requires the well established scheme to be altered in order to minimize degradation due to noise aliasing effects. In cur approach, each pixel is read out by a single first stage SQUID (SQ1) that is operated in open loop. The outputs of the SQ1 s are low-pass filtered with an array of low cross-talk inductors, then fed into a single-stage SQUID TD multiplexer. The multiplexer is addressed from room temperature and read out through a single amplifier channel. We present results achieved with a new detector platform. Noise performance is presented and compared to expectations. We have demonstrated multiplexed X-ray spectroscopy at 5.9keV with delta_FWHM=10eV. In an optimized setup, we show it is possible to multiplex 32 detectors without significantly degrading the Intrinsic detector resolution.

  16. Vivid, full-color aluminum plasmonic pixels

    PubMed Central

    Olson, Jana; Manjavacas, Alejandro; Liu, Lifei; Chang, Wei-Shun; Foerster, Benjamin; King, Nicholas S.; Knight, Mark W.; Nordlander, Peter; Halas, Naomi J.; Link, Stephan

    2014-01-01

    Aluminum is abundant, low in cost, compatible with complementary metal-oxide semiconductor manufacturing methods, and capable of supporting tunable plasmon resonance structures that span the entire visible spectrum. However, the use of Al for color displays has been limited by its intrinsically broad spectral features. Here we show that vivid, highly polarized, and broadly tunable color pixels can be produced from periodic patterns of oriented Al nanorods. Whereas the nanorod longitudinal plasmon resonance is largely responsible for pixel color, far-field diffractive coupling is used to narrow the plasmon linewidth, enabling monochromatic coloration and significantly enhancing the far-field scattering intensity of the individual nanorod elements. The bright coloration can be observed with p-polarized white light excitation, consistent with the use of this approach in display devices. The resulting color pixels are constructed with a simple design, are compatible with scalable fabrication methods, and provide contrast ratios exceeding 100:1. PMID:25225385

  17. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    NASA Astrophysics Data System (ADS)

    Dobos, Daniel

    2016-07-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to the surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer, a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. An overview of the refurbishing of the Pixel Detector and of the IBL project as well as early performance tests using cosmic rays and beam data will be presented.

  18. The ALICE Pixel Detector

    NASA Astrophysics Data System (ADS)

    Mercado-Perez, Jorge

    2002-07-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well.

  19. CMOS in-pixel optical pulse frequency modulator

    NASA Astrophysics Data System (ADS)

    Nel, Nicolaas E.; du Plessis, M.; Joubert, T.-H.

    2016-02-01

    This paper covers the design of a complementary metal oxide semiconductor (CMOS) pixel readout circuit with a built-in frequency conversion feature. The pixel contains a CMOS photo sensor along with all signal-to-frequency conversion circuitry. An 8×8 array of these pixels is also designed. Current imaging arrays often use analog-to-digital conversion (ADC) and digital signal processing (DSP) techniques that are off-chip1. The frequency modulation technique investigated in this paper is preferred over other ADC techniques due to its smaller size, and the possibility of a higher dynamic range. Careful considerations are made regarding the size of the components of the pixel, as various characteristics of CMOS devices are limited by decreasing the scale of the components2. The methodology used was the CMOS design cycle for integrated circuit design. All components of the pixel were designed from first principles to meet necessary requirements of a small pixel size (30×30 μm2) and an output resolution greater than that of an 8-bit ADC. For the photodetector, an n+-p+/p-substrate diode was designed with a parasitic capacitance of 3 fF. The analog front-end stage was designed around a Schmitt trigger circuit. The photo current is integrated on an integration capacitor of 200 fF, which is reset when the Schmitt trigger output voltage exceeds a preset threshold. The circuit schematic and layout were designed using Cadence Virtuoso and the process used was the AMS CMOS 350 nm process using a power supply of 5V. The simulation results were confirmed to comply with specifications, and the layout passed all verification checks. The dynamic range achieved is 58.828 dB per pixel, with the output frequencies ranging from 12.341kHz to 10.783 MHz. It is also confirmed that the output frequency has a linear relationship to the photocurrent generated by the photodiode.

  20. Position-Sensitive Nuclear Spectroscopy with Pixel Detectors

    SciTech Connect

    Granja, Carlos; Vykydal, Zdenek; Jakubek, Jan; Pospisil, Stanislav

    2007-10-26

    State-of-the-art hybrid semiconductor pixel detectors such as Medipix2 are suitable for energy- and position-sensitive nuclear spectroscopy. In addition to excellent energy- and spatial-resolution, these devices can operate in spectroscopic, single-quantum counting and/or on-line tracking mode. A devoted compact USB-readout interface provides functionality and ease of operation. The compact and versatile Medipix2/USB radiation camera provides visualization, vacuum and room-temperature operation as a real-time portable active nuclear emulsion.

  1. Thin hybrid pixel assembly with backside compensation layer on ROIC

    NASA Astrophysics Data System (ADS)

    Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Gray, C.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

    2017-01-01

    The entire ATLAS inner tracking system will be replaced for operation at the HL-LHC . This will include a significantly larger pixel detector of approximately 15 m2. For this project, it is critical to reduce the mass of the hybrid pixel modules and this requires thinning both the sensor and readout chips to about 150 micrometres each. The thinning of the silicon chips leads to low bump yield for SnAg bumps due to bad co-planarity of the two chips at the solder reflow stage creating dead zones within the pixel array. In the case of the ATLAS FEI4 pixel readout chip thinned to 100 micrometres, the chip is concave, with the front side in compression, with a bow of +100 micrometres at room temperature which varies to a bow of -175 micrometres at the SnAg solder reflow temperature, caused by the CTE mismatch between the materials in the CMOS stack and the silicon substrate. A new wafer level process to address the issue of low bump yield be controlling the chip bow has been developed. A back-side dielectric and metal stack of SiN and Al:Si has been deposited on the readout chip wafer to dynamically compensate the stress of the front side stack. In keeping with a 3D process the materials used are compatible with Through Silicon Via (TSV) technology with a TSV last approach which is under development for this chip. It is demonstrated that the amplitude of the correction can be manipulated by the deposition conditions and thickness of the SiN/Al:Si stack. The bow magnitude over the temperature range for the best sample to date is reduced by almost a factor of 4 and the sign of the bow (shape of the die) remains constant. Further development of the backside deposition conditions is on-going with the target of close to zero bow at the solder reflow temperature and a minimal bow magnitude throughout the temperature range. Assemblies produced from FEI4 readout wafers thinned to 100 micrometres with the backside compensation layer have been made for the first time and

  2. The TDCpix Readout ASIC: A 75 ps Resolution Timing Front-End for the Gigatrackerof theNA62 Experiment

    NASA Astrophysics Data System (ADS)

    Rinella, G. Aglieri; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

    NA62 is an experiment under development at the CERN Super Proton Synchrotron, aiming at measuring ultra rare kaon decays. The Gigatracker (GTK) detector shall combine on-beam tracking of individual particles with a time resolution of 150 ps rms. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm2 fora total rateof about 0.75 GHz.Ahybrid siliconpixel detectoris beingdevelopedto meet these requirements. The pixel chip for the Gigatracker (TDCpix) is under design. The TDCpix chip will feature 1800 square pixels of 300×300 μm2 arranged in a matrix of 45 rows × 40 columns. Bump-bonded to a silicon pixel sensor it shall perform time stamping of particle hits with a timing accuracybetter than 200 ps rms and a detection efficiencyabove 99%. The chosen architecture provides full separation of the sensitive analog amplifiers of the pixel matrix from the noisy digital circuits of the TDCs and of the readout blocks. Discriminated hit signals from each pixel are transmitted to the end of column region. An array ofTime to Digital Converters (TDC) is implemented at the bottom of the pixel array. The TDCs are based on time tagging the events with the fine time codes generated by Delay Locked Loops (DLL) and have a nominal time bin of ˜100 ps. Time stamps and time-over-threshold are recorded for each discriminated hit and the correction of the discriminator's time-walk is performed off-detector. Data are continuously transmitted on four 2.4 Gb/s serial output links. Adescription of the on-going design of the final TDCpix is given in this paper. Design choices and some technical implementation details are presented. Aprototype ASIC including thekeycomponents of this architecture has been manufactured. The achievement of specification figures such as a time resolution of the processing chain of 75 ps rms as well as charged particle time stampingwitha resolutionbetterthan200psrmswere demonstratedexperimentally.Asummaryoftheseresultsisalso presented in

  3. X-ray imaging using a 320 x 240 hybrid GaAs pixel detector

    SciTech Connect

    Irsigler, R.; Andersson, J.; Alverbro, J.

    1999-06-01

    The authors present room temperature measurements on 200 {micro}m thick GaAs pixel detectors, which were hybridized to silicon readout circuits. The whole detector array contains 320 x 240 square shaped pixel with a pitch of 38 {micro}m and is based on semi-insulating liquid-encapsulated Czochralski (LEC) GaAs material. After fabricating and dicing, the detector chips were indium bump flip chip bonded to CMOS readout circuits based on charge integration and finally evaluated. This readout chip was originally designed for the readout of flip chip bonded infrared detectors, but appears to be suitable for X-ray applications as well. A bias voltage between 50 V and 100 V was sufficient to operate the detector at room temperature. The detector array did respond to x-ray radiation by an increase in current due to production of electron hole pairs by the ionization processes. Images of various objects and slit patterns were acquired by using a standard X-ray source for dental imaging. The new X-ray hybrid detector was analyzed with respect to its imaging properties. Due to the high absorption coefficient for X-rays in GaAs and the small pixel size, the sensor shows a high modulation transfer function up to the Nyquist frequency.

  4. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Andricek, L.; Moser, H.-G.; Nisius, R.; Richter, R. H.; Terzo, S.; Weigell, P.

    2014-11-01

    We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5 ×1015neq /cm2. We will also report on the R&D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding.

  5. ACS/WFC Pixel Stability - Bringing the Pixels Back to the Science

    NASA Astrophysics Data System (ADS)

    Borncamp, David; Grogin, Norman A.; Bourque, Matthew; Ogaz, Sara

    2016-06-01

    Electrical current that has been trapped within the lattice structure of a Charged Coupled Device (CCD) can be present through multiple exposures, which will have an adverse effect on its science performance. The traditional way to correct for this extra charge is to take an image with the camera shutter closed periodically throughout the lifetime of the instrument. These images, generally referred to as dark images, allow for the characterization of the extra charge that is trapped within the CCD at the time of observation. This extra current can then be subtracted out of science images to correct for the extra charge that was there at this time. Pixels that have a charge above a certain threshold of current are marked as “hot” and flagged in the data quality array. However, these pixels may not be "bad" in the traditional sense that they cannot be reliably dark-subtracted. If these pixels are shown to be stable over an anneal period, the charge can be properly subtracted and the extra noise from this dark current can be taken into account. We present the results of a pixel history study that analyzes every pixel of ACS/WFC individually and allows pixels that were marked as bad to be brought back into the science image.

  6. CMS Pixel Detector design for HL-LHC

    NASA Astrophysics Data System (ADS)

    Migliore, E.

    2016-12-01

    The LHC machine is planning an upgrade program which will smoothly bring the luminosity to about 7.5×1034cm-2s-1 in 2028, to possibly reach an integrated luminosity of 3000 fb-1 by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges in higher data rates and increased radiation. In order to maintain its physics reach the CMS collaboration has undertaken a preparation program of the detector known as Phase-2 upgrade. The CMS Phase-2 Pixel upgrade will require a high bandwidth readout system and high radiation tolerance for sensors and on-detector ASICs. Several technologies for the upgrade sensors are being studied. Serial powering schemes are under consideration to accommodate significant constraints on the system. These prospective designs, as well as new layout geometries that include very forward pixel discs, will be presented together with performance estimation.

  7. Imaging properties of pixellated scintillators with deep pixels

    PubMed Central

    Barber, H. Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P.; Furenlid, Lars R.; Miller, Brian W.; Parkhurst, Philip; Nagarkar, Vivek V.

    2015-01-01

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10×10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm × 1mm × 20 mm pixels) made by Proteus, Inc. with similar 10×10 arrays of LSO:Ce and BGO (1mm × 1mm × 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10×10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of 176Lu in LSO:Ce and LYSO:Ce detectors. PMID:26236070

  8. Imaging properties of pixellated scintillators with deep pixels

    NASA Astrophysics Data System (ADS)

    Barber, H. Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P.; Furenlid, Lars R.; Miller, Brian W.; Parkhurst, Philip; Nagarkar, Vivek V.

    2014-09-01

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10x10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm x 1mm x 20 mm pixels) made by Proteus, Inc. with similar 10x10 arrays of LSO:Ce and BGO (1mm x 1mm x 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10x10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of 176Lu in LSO:Ce and LYSO:Ce detectors.

  9. Imaging properties of pixellated scintillators with deep pixels.

    PubMed

    Barber, H Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P; Furenlid, Lars R; Miller, Brian W; Parkhurst, Philip; Nagarkar, Vivek V

    2014-08-17

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10×10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm × 1mm × 20 mm pixels) made by Proteus, Inc. with similar 10×10 arrays of LSO:Ce and BGO (1mm × 1mm × 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10×10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of (176)Lu in LSO:Ce and LYSO:Ce detectors.

  10. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    PubMed Central

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T.; Gruner, Sol M.

    2016-01-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed. PMID:26917125

  11. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    DOE PAGES

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; ...

    2016-01-28

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses atmore » megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. Lastly, we detail the characteristics, operation, testing and application of the detector.« less

  12. Characterization of high resolution CMOS monolithic active pixel detector in SOI technology

    NASA Astrophysics Data System (ADS)

    Ahmed, M. I.; Arai, Y.; Glab, S.; Idzik, M.; Kapusta, P.; Miyoshi, T.; Takeda, A.; Turala, M.

    2015-05-01

    Novel CMOS monolithic pixel detectors designed at KEK and fabricated at Lapis Semiconductor in 0.2 μm Silicon-on-Insulator (SOI) technology are presented. A thin layer of silicon oxide separates high and low resistivity silicon layers, allowing for optimization of design of detector and readout parts. Shallow wells buried under the oxide in the detector part screen the entire pixel electronics from electrical field applied to the detector. Several integration type SOI pixel detectors have been developed with pixel sizes 8-20 μm. The general features of 14 × 14 μm2 detectors designed on different wafers (CZ-n, FZ-n and FZ-p) were measured and compared. The detector performance was studied under irradiation with visible and infra-red laser, and also X-ray ionizing source. Using X-rays from an Am-241 source the noise of readout electronics was measured at different working conditions, showing the ENC in the range of 88-120 e-. The pixel current was calculated from average DC pedestal shift while varying the pixel integration time. The operation of the detector was studied under partial and full depletion conditions. The effects of temperature and detector bias voltage on noise and leakage current were studied. Characteristics of an ADC integrated in the front-end chip are also presented.

  13. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    SciTech Connect

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T.; Gruner, Sol M.

    2016-01-28

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. Lastly, we detail the characteristics, operation, testing and application of the detector.

  14. Method for producing a hybridization of detector array and integrated circuit for readout

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Grunthaner, Frank J. (Inventor)

    1993-01-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  15. Readout circuit design of the retina-like CMOS image sensor

    NASA Astrophysics Data System (ADS)

    Cao, Fengmei; Song, Shengyu; Bai, Tingzhu; Cao, Nan

    2015-02-01

    Readout circuit is designed for a special retina-like CMOS image sensor. To realize the pixels timing drive and readout of the sensor, the Altera's Cyclone II FPGA is used as a control chip. The voltage of the sensor is supported by a voltage chip initialized by SPI with AVR MCU system. The analog image signal outputted by the sensor is converted to digital image data by 12-bits A/D converter ADS807 and the digital data is memorized in the SRAM. Using the Camera-link image grabber, the data stored in SRAM is transformed to image shown on PC. Experimental results show the circuit works well on retina-like CMOS timing drive and image readout and images can be displayed properly on the PC.

  16. Pixelated gamma detector

    SciTech Connect

    Dolinsky, Sergei Ivanovich; Yanoff, Brian David; Guida, Renato; Ivan, Adrian

    2016-12-27

    A pixelated gamma detector includes a scintillator column assembly having scintillator crystals and optical transparent elements alternating along a longitudinal axis, a collimator assembly having longitudinal walls separated by collimator septum, the collimator septum spaced apart to form collimator channels, the scintillator column assembly positioned adjacent to the collimator assembly so that the respective ones of the scintillator crystal are positioned adjacent to respective ones of the collimator channels, the respective ones of the optical transparent element are positioned adjacent to respective ones of the collimator septum, and a first photosensor and a second photosensor, the first and the second photosensor each connected to an opposing end of the scintillator column assembly. A system and a method for inspecting and/or detecting defects in an interior of an object are also disclosed.

  17. Pixelation Effects in Weak Lensing

    NASA Technical Reports Server (NTRS)

    High, F. William; Rhodes, Jason; Massey, Richard; Ellis, Richard

    2007-01-01

    Weak gravitational lensing can be used to investigate both dark matter and dark energy but requires accurate measurements of the shapes of faint, distant galaxies. Such measurements are hindered by the finite resolution and pixel scale of digital cameras. We investigate the optimum choice of pixel scale for a space-based mission, using the engineering model and survey strategy of the proposed Supernova Acceleration Probe as a baseline. We do this by simulating realistic astronomical images containing a known input shear signal and then attempting to recover the signal using the Rhodes, Refregier, and Groth algorithm. We find that the quality of shear measurement is always improved by smaller pixels. However, in practice, telescopes are usually limited to a finite number of pixels and operational life span, so the total area of a survey increases with pixel size. We therefore fix the survey lifetime and the number of pixels in the focal plane while varying the pixel scale, thereby effectively varying the survey size. In a pure trade-off for image resolution versus survey area, we find that measurements of the matter power spectrum would have minimum statistical error with a pixel scale of 0.09' for a 0.14' FWHM point-spread function (PSF). The pixel scale could be increased to 0.16' if images dithered by exactly half-pixel offsets were always available. Some of our results do depend on our adopted shape measurement method and should be regarded as an upper limit: future pipelines may require smaller pixels to overcome systematic floors not yet accessible, and, in certain circumstances, measuring the shape of the PSF might be more difficult than those of galaxies. However, the relative trends in our analysis are robust, especially those of the surface density of resolved galaxies. Our approach thus provides a snapshot of potential in available technology, and a practical counterpart to analytic studies of pixelation, which necessarily assume an idealized shape

  18. Module production for the Phase 1 upgrade of the CMS forward pixel detector

    NASA Astrophysics Data System (ADS)

    Siado Castaneda, Joaquin

    2017-01-01

    For Run 2 the Large Hadron Collider will run at a much higher instantaneous luminosity, which requires an upgrade of the CMS pixel detector. The detector consists of rectangular silicon sensors, segmented into 100 μm by 150 μm pixels, bonded to readout chips, with one sensor and a 8x2 array of readout chips forming a module. Due to its high granularity and good spatial resolution, about 10 μm for a single hit, the pixel detector is used for track reconstruction, pileup mitigation, and b-quark tagging in many physics analyses. Being the innermost sub-detector of CMS it receives the most radiation damage, and therefore needs to be replaced most often. For the phase 1 upgrade an additional disk in the forward region and increased buffer space in the readout chip will improve the pixel performance by increasing efficiency and reducing fake rates. The University of Nebraska-Lincoln is one of the two sites where modules are being assembled. This talk features the steps of the assembly process as well as challenges encountered and overcome during production of over 500 modules. The CMS Collaboration.

  19. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Nisius, R.; Savic, N.; Terzo, S.

    2016-09-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14 ×1015 neq /cm2 . The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50×50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80°) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.

  20. Development of a pixel sensor with fine space-time resolution based on SOI technology for the ILC vertex detector

    NASA Astrophysics Data System (ADS)

    Ono, Shun; Togawa, Manabu; Tsuji, Ryoji; Mori, Teppei; Yamada, Miho; Arai, Yasuo; Tsuboyama, Toru; Hanagaki, Kazunori

    2017-02-01

    We have been developing a new monolithic pixel sensor with silicon-on-insulator (SOI) technology for the International Linear Collider (ILC) vertex detector system. The SOI monolithic pixel detector is realized using standard CMOS circuits fabricated on a fully depleted sensor layer. The new SOI sensor SOFIST can store both the position and timing information of charged particles in each 20×20 μm2 pixel. The position resolution is further improved by the position weighted with the charges spread to multiple pixels. The pixel also records the hit timing with an embedded time-stamp circuit. The sensor chip has column-parallel analog-to-digital conversion (ADC) circuits and zero-suppression logic for high-speed data readout. We are designing and evaluating some prototype sensor chips for optimizing and minimizing the pixel circuit.

  1. A discrete component low-noise preamplifier readout for a linear (1×16) SiC photodiode array

    NASA Astrophysics Data System (ADS)

    Kahle, Duncan; Aslam, Shahid; Herrero, Federico A.; Waczynski, Augustyn

    2016-09-01

    A compact, low-noise and inexpensive preamplifier circuit has been designed and fabricated to optimally readout a common cathode (1×16) channel 4H-SiC Schottky photodiode array for use in ultraviolet experiments. The readout uses an operational amplifier with 10 pF capacitor in the feedback loop in parallel with a low leakage switch for each of the channels. This circuit configuration allows for reiterative sample, integrate and reset. A sampling technique is given to remove Johnson noise, enabling a femtoampere level readout noise performance. Commercial-off-the-shelf acquisition electronics are used to digitize the preamplifier analog signals. The data logging acquisition electronics has a different integration circuit, which allows the bandwidth and gain to be independently adjusted. Using this readout, photoresponse measurements across the array between spectral wavelengths 200 nm and 370 nm are made to establish the array pixels external quantum efficiency, current responsivity and noise equivalent power.

  2. Development of Frequency-Division Multiplexing Readout System for Large-Format TES X-ray Microcalorimeter Arrays

    NASA Astrophysics Data System (ADS)

    Sakai, K.; Yamamoto, R.; Takei, Y.; Mitsuda, K.; Yamasaki, N. Y.; Hidaka, M.; Nagasawa, S.; Kohjiro, S.; Miyazaki, T.

    2016-07-01

    We are developing the frequency-division multiplexing (FDM) readout system aimed to realize the 400-pixel transition edge sensor (TES) microcalorimeter array for the DIOS mission as well as large-format arrays with more than a thousand of TES for future space missions such as the ATHENA mission. The developed system consists of the low-power superconducting quantum interference device (SQUID), the digital FDM electronics, and the analog front-end to bridge the SQUID and the digital electronics. Using the developed readout system, we performed a TES readout experiment and succeeded to multiplex four TES signals with the single-staged cryogenic setup. We have experienced two issues during the experiment: an excess noise and crosstalk. The brief overview of the developed system and the details, results, and issues of the TES multiplexing readout experiment is discussed.

  3. Diamond pixel modules and the ATLAS beam conditions monitor

    NASA Astrophysics Data System (ADS)

    Dobos, D.; Pernegger, Heinz; RD42 Collaboration; ATLAS Diamond Pixel Upgrade Collaboration; ATLAS Beam Conditions Monitor Collaborations

    2011-02-01

    Chemical vapor deposition diamonds are considered among possible sensor materials for the next pixel upgrade in ATLAS. Full size diamond pixel modules have been constructed to the specification of the ATLAS Pixel Detector using poly-crystalline CVD diamond sensors to develop the production techniques required for industrial production. Those modules were tested in the lab and testbeam. Additionally we will present results of diamond pixel modules using single-crystal diamonds and results of proton irradiations up to 1.8 ×10 16 protons/cm 2. The ATLAS Beam Conditions Monitors (BCM) main purpose is to protect the experiments silicon tracker from beam incidents. In total 16 1×1 cm2 500 μm thick diamond pCVD sensors are used in eight positions around the LHC interaction point. They perform time difference measurements with sub nanosecond resolution to distinguish between particles from a collision and spray particles from a beam incident; an abundance of the latter can lead the BCM to provoke an abort of LHC beam. The BCM diamond detector modules, their readout system and the algorithms used to detect beam incidents are described. Results of the BCM operation with circulating LHC beams and its commissioning with first LHC collisions are reported.

  4. A Digital Readout System For The CSO Microwave Kinetic Inductance Camera

    NASA Astrophysics Data System (ADS)

    Max-Moerbeck, Walter; Mazin, B. A.; Zmuidzinas, J.

    2007-12-01

    Submillimeter galaxies are important to the understanding of galaxy formation and evolution. Determination of the spectral energy distribution in the millimeter and submillimeter regimes allows important and powerful diagnostics. Our group is developing a camera for the Caltech Submillimeter Observatory (CSO) using Microwave Kinetic Inductance Detectors (MKIDs). MKIDs are superconducting devices whose impedance changes with the absorption of photons. The camera will have 600 spatial pixels and 4 bands at 750 μm, 850 μm, 1.1 mm and 1.3 mm. For each spatial pixel of the camera the radiation is coupled to the MKIDs using phased-array antennas. This signal is split into 4 different bands using filters and detected using the superconductor as part of a MKID's resonant circuit. The detection process consists of measurement of the changes in the transmission through the resonator when it is illuminated. By designing resonant circuits to have different resonant frequencies and high transmission out resonance, MKIDs can be frequency-domain multiplexed. This allows the simultaneous readout of many detectors through a single coaxial cable. The readout system makes use of microwave IQ modulation and is based on commercial electronics components operating at room temperature. The basic readout has been demonstrated on the CSO. We are working on the implementation of an improved design to be tested on a prototype system with 6x6 pixels and 4 colors next April on the CSO.

  5. Fiber faceplate modulation readout in Bi-material micro-cantilever mirror array imaging system

    NASA Astrophysics Data System (ADS)

    Hui, Mei; Xia, Zhengzheng; Liu, Ming; Dong, Liquan; Liu, Xiaohua; Zhao, Yuejin

    2016-05-01

    Fiber faceplate modulation was applied to read out the precise actuation of silicon-based, surface micro-fabricated cantilever mirrors array in optical imaging system. The faceplate was made by ordered bundles consisting of as many as ten thousands fibers. The transmission loss of an individual fiber in the bundles was 0.35dB/cm and the cross talk between neighboring fibers in the faceplate was about 15%. Micro-cantilever mirrors array (Focal-Plane Array (FPA)) which composed of two-level bi-material pixels, absorb incident infrared flux and result in a temperature increase. The temperature distribution of incident flux transformed to the deformation distribution in FPA which has a very big difference in coefficients of thermal expansion. FPA plays the roles of target sensing and has the characteristics of high detection sensitivity. Instead of general filter such as knife edge or pinhole, fiber faceplate modulate the beam reflected by the units of FPA. An optical readout signal brings a visible spectrum into pattern recognition system, yielding a visible image on monitor. Thermal images at room temperature have been obtained. The proposed method permits optical axis compact and image noise suppression.

  6. A 128 pixel linear array for radiotherapy quality assurance

    NASA Astrophysics Data System (ADS)

    Franco, L.; Gómez, F.; Iglesias, A.; Lobato, R.; Marín, J.; Mosquera, J.; Pardo, J.; Pazos, A.; Pena, J.; Pombar, M.; Rodríguez, A.; Saavedra, D.; Sendón, J.; Yañez, A.

    2004-12-01

    New radiotherapy techniques require detectors able to verify and monitor the clinical beam with high spatial resolution and fast response. Room temperature organic liquid ionization detectors are becoming an alternative to standard air ionization chambers, due to their tissue equivalent behavior, their sensibility and small directional dependence. A liquid isooctane filled ionization linear array for radiotherapy quality assurance has been designed, built and tested. The detector consists of 128 pixels, each of them with an area of 1.7 mm×1.7 mm and a gap of 0.5 mm. The small pixel size makes the detector ideal for high gradient beam profiles like those present in Intensity Modulated Radiation Therapy. The gap and the polarization voltage have been chosen in order to guarantee a linear relationship between the dose rate and the readout signal at high dose rates. As readout electronics we use the X-ray Data Acquisition System with the Xchip developed by the CCLRC.In the first device tests we have confirmed linearity up to a 6.7 Gy/min dose rate with a deviation less than 1%. A profile with a signal-to-noise ratio around 500 can be obtained for a 4 Gy/min dose rate with a 10 ms integration time.

  7. THE KEPLER PIXEL RESPONSE FUNCTION

    SciTech Connect

    Bryson, Stephen T.; Haas, Michael R.; Dotson, Jessie L.; Koch, David G.; Borucki, William J.; Tenenbaum, Peter; Jenkins, Jon M.; Chandrasekaran, Hema; Caldwell, Douglas A.; Klaus, Todd; Gilliland, Ronald L.

    2010-04-20

    Kepler seeks to detect sequences of transits of Earth-size exoplanets orbiting solar-like stars. Such transit signals are on the order of 100 ppm. The high photometric precision demanded by Kepler requires detailed knowledge of how the Kepler pixels respond to starlight during a nominal observation. This information is provided by the Kepler pixel response function (PRF), defined as the composite of Kepler's optical point-spread function, integrated spacecraft pointing jitter during a nominal cadence and other systematic effects. To provide sub-pixel resolution, the PRF is represented as a piecewise-continuous polynomial on a sub-pixel mesh. This continuous representation allows the prediction of a star's flux value on any pixel given the star's pixel position. The advantages and difficulties of this polynomial representation are discussed, including characterization of spatial variation in the PRF and the smoothing of discontinuities between sub-pixel polynomial patches. On-orbit super-resolution measurements of the PRF across the Kepler field of view are described. Two uses of the PRF are presented: the selection of pixels for each star that maximizes the photometric signal-to-noise ratio for that star, and PRF-fitted centroids which provide robust and accurate stellar positions on the CCD, primarily used for attitude and plate scale tracking. Good knowledge of the PRF has been a critical component for the successful collection of high-precision photometry by Kepler.

  8. PIXELS: Using field-based learning to investigate students' concepts of pixels and sense of scale

    NASA Astrophysics Data System (ADS)

    Pope, A.; Tinigin, L.; Petcovic, H. L.; Ormand, C. J.; LaDue, N.

    2015-12-01

    Empirical work over the past decade supports the notion that a high level of spatial thinking skill is critical to success in the geosciences. Spatial thinking incorporates a host of sub-skills such as mentally rotating an object, imagining the inside of a 3D object based on outside patterns, unfolding a landscape, and disembedding critical patterns from background noise. In this study, we focus on sense of scale, which refers to how an individual quantified space, and is thought to develop through kinesthetic experiences. Remote sensing data are increasingly being used for wide-reaching and high impact research. A sense of scale is critical to many areas of the geosciences, including understanding and interpreting remotely sensed imagery. In this exploratory study, students (N=17) attending the Juneau Icefield Research Program participated in a 3-hour exercise designed to study how a field-based activity might impact their sense of scale and their conceptions of pixels in remotely sensed imagery. Prior to the activity, students had an introductory remote sensing lecture and completed the Sense of Scale inventory. Students walked and/or skied the perimeter of several pixel types, including a 1 m square (representing a WorldView sensor's pixel), a 30 m square (a Landsat pixel) and a 500 m square (a MODIS pixel). The group took reflectance measurements using a field radiometer as they physically traced out the pixel. The exercise was repeated in two different areas, one with homogenous reflectance, and another with heterogeneous reflectance. After the exercise, students again completed the Sense of Scale instrument and a demographic survey. This presentation will share the effects and efficacy of the field-based intervention to teach remote sensing concepts and to investigate potential relationships between students' concepts of pixels and sense of scale.

  9. Fully depleted CMOS pixel sensor development and potential applications

    SciTech Connect

    Baudot, J.; Kachel, M.

    2015-07-01

    low noise figure. Especially, an energy resolution of about 400 eV for 5 keV X-rays was obtained for single pixels. The prototypes have then been exposed to gradually increased fluences of neutrons, from 10{sup 13} to 5x10{sup 14} neq/cm{sup 2}. Again laboratory tests allowed to evaluate the signal over noise persistence on the different pixels implemented. Currently our development mostly targets the detection of soft X-rays, with the ambition to develop a pixel sensor matching counting rates as affordable with hybrid pixel sensors, but with an extended sensitivity to low energy and finer pixel about 25 x 25 μm{sup 2}. The original readout architecture proposed relies on a two tiers chip. The first tier consists of a sensor with a modest dynamic in order to insure low noise performances required by sensitivity. The interconnected second tier chip enhances the read-out speed by introducing massive parallelization. Performances reachable with this strategy combining counting and integration will be detailed. (authors)

  10. X-ray imaging characterization of active edge silicon pixel sensors

    NASA Astrophysics Data System (ADS)

    Ponchut, C.; Ruat, M.; Kalliopuska, J.

    2014-05-01

    The aim of this work was the experimental characterization of edge effects in active-edge silicon pixel sensors, in the frame of X-ray pixel detectors developments for synchrotron experiments. We produced a set of active edge pixel sensors with 300 to 500 μm thickness, edge widths ranging from 100 μm to 150 μm, and n or p pixel contact types. The sensors with 256 × 256 pixels and 55 × 55 μm2 pixel pitch were then bump-bonded to Timepix readout chips for X-ray imaging measurements. The reduced edge widths makes the edge pixels more sensitive to the electrical field distribution at the sensor boundaries. We characterized this effect by mapping the spatial response of the sensor edges with a finely focused X-ray synchrotron beam. One of the samples showed a distortion-free response on all four edges, whereas others showed variable degrees of distortions extending at maximum to 300 micron from the sensor edge. An application of active edge pixel sensors to coherent diffraction imaging with synchrotron beams is described.

  11. Planar pixel sensors for the ATLAS tracker upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Gallrapp, C.; Atlas Planar Pixel Sensor R&D Project

    2013-08-01

    The ATLAS Planar Pixel Sensor R&D Project is a collaboration of 17 institutes and more than 80 scientists. Their goal is to explore the operation of planar pixel sensors for the tracker upgrade at the High Luminosity-Large Hadron Collider (HL-LHC). This work will give a summary of the achievements on radiation studies with n-in-n and n-in-p pixel sensors, bump-bonded to ATLAS FE-I3 and FE-I4 read-out chips. The summary includes results from tests with radioactive sources and tracking efficiencies extracted from test beam measurements. Analysis results of 2 ×1016neqcm-2 and 1 ×1016neqcm-2 (1 MeV neutron equivalent) irradiated n-in-n and n-in-p modules confirm the operation of planar pixel sensors for future applications.

  12. Charge Transfer Efficiency modeling/measurements as function of CCD pixel rate

    SciTech Connect

    Yates, G.J.; Gallegos, R.; Pena, C.; Zagarino, P.

    1995-09-01

    We have developed a charge transport model for predicting the effects on Charge Transfer Efficiency (CTE) of Charge Coupled Devices (CCDs) as functions of number of transfers, pixel charge flow rate, and magnitude in the CCD`s vertical and horizontal charge transport mediums. The model uses carrier lifetime an mobility criteria to establish pixel speed arguments and limitations for various CCD architectures. The model is compared with experimental measurements obtained using strobed single pixel illumination and a variant of the deferred charge tail technique while independently varying the CCD pixel rates for both the vertical and horizontal readout phases. The generic model is discussed and applied to specific real CCDs. Agreement between predicted performance and actual measured performance is presented.

  13. Hardware solutions for the 65k pixel X-ray camera module of 75 μm pixel size

    NASA Astrophysics Data System (ADS)

    Kasinski, K.; Maj, P.; Grybos, P.; Koziol, A.

    2016-02-01

    We present three hardware solutions designed for a detector module built with a 2 cm × 2 cm hybrid pixel detector built from a single 320 or 450 μ m thick silicon sensor designed and fabricated by Hamamatsu and two UFXC32k readout integrated circuits (128 × 256 pixels with 75μ m pitch, designed in CMOS 130 nm at AGH-UST). The chips work in a single photon counting mode and provide ultra-fast X-ray imaging. The presented hardware modules are designed according to requirements of various tests and applications: ṡDevice A: a fast and flexible system for tests with various radiation sources. ṡDevice B: a standalone, all-in-one imaging device providing three standard interfaces (USB 2.0, Ethernet, Camera Link) and up to 640 MB/s bandwidth. ṡDevice C: a prototype large-area imaging system. The paper shows the readout system structure for each case with highlighted circuit board designs with details on power distribution and cooling on both FR4 and LTCC (low temperature co-fired ceramic) based circuits.

  14. From Pixels to Planets

    NASA Technical Reports Server (NTRS)

    Brownston, Lee; Jenkins, Jon M.

    2015-01-01

    The Kepler Mission was launched in 2009 as NASAs first mission capable of finding Earth-size planets in the habitable zone of Sun-like stars. Its telescope consists of a 1.5-m primary mirror and a 0.95-m aperture. The 42 charge-coupled devices in its focal plane are read out every half hour, compressed, and then downlinked monthly. After four years, the second of four reaction wheels failed, ending the original mission. Back on earth, the Science Operations Center developed the Science Pipeline to analyze about 200,000 target stars in Keplers field of view, looking for evidence of periodic dimming suggesting that one or more planets had crossed the face of its host star. The Pipeline comprises several steps, from pixel-level calibration, through noise and artifact removal, to detection of transit-like signals and the construction of a suite of diagnostic tests to guard against false positives. The Kepler Science Pipeline consists of a pipeline infrastructure written in the Java programming language, which marshals data input to and output from MATLAB applications that are executed as external processes. The pipeline modules, which underwent continuous development and refinement even after data started arriving, employ several analytic techniques, many developed for the Kepler Project. Because of the large number of targets, the large amount of data per target and the complexity of the pipeline algorithms, the processing demands are daunting. Some pipeline modules require days to weeks to process all of their targets, even when run on NASA's 128-node Pleiades supercomputer. The software developers are still seeking ways to increase the throughput. To date, the Kepler project has discovered more than 4000 planetary candidates, of which more than 1000 have been independently confirmed or validated to be exoplanets. Funding for this mission is provided by NASAs Science Mission Directorate.

  15. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors.

    PubMed

    El-Mohri, Youcef; Antonuk, Larry E; Koniczek, Martin; Zhao, Qihua; Li, Yixin; Street, Robert A; Lu, Jeng-Ping

    2009-07-01

    optical fill factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of approximately 560 e (rms) for PSI-3.

  16. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors

    PubMed Central

    El-Mohri, Youcef; Antonuk, Larry E.; Koniczek, Martin; Zhao, Qihua; Li, Yixin; Street, Robert A.; Lu, Jeng-Ping

    2009-01-01

    factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of ∼560 e (rms) for PSI-3. PMID:19673229

  17. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    NASA Astrophysics Data System (ADS)

    La Rosa, A.; Gallrapp, C.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.; Weigell, P.

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neq cm-2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  18. Design of an ultra low power CMOS pixel sensor for a future neutron personal dosimeter

    SciTech Connect

    Zhang, Y.; Hu-Guo, C.; Husson, D.; Hu, Y.

    2011-07-01

    Despite a continuously increasing demand, neutron electronic personal dosimeters (EPDs) are still far from being completely established because their development is a very difficult task. A low-noise, ultra low power consumption CMOS pixel sensor for a future neutron personal dosimeter has been implemented in a 0.35 {mu}m CMOS technology. The prototype is composed of a pixel array for detection of charged particles, and the readout electronics is integrated on the same substrate for signal processing. The excess electrons generated by an impinging particle are collected by the pixel array. The charge collection time and the efficiency are the crucial points of a CMOS detector. The 3-D device simulations using the commercially available Synopsys-SENTAURUS package address the detailed charge collection process. Within a time of 1.9 {mu}s, about 59% electrons created by the impact particle are collected in a cluster of 4 x 4 pixels with the pixel pitch of 80 {mu}m. A charge sensitive preamplifier (CSA) and a shaper are employed in the frond-end readout. The tests with electrical signals indicate that our prototype with a total active area of 2.56 x 2.56 mm{sup 2} performs an equivalent noise charge (ENC) of less than 400 e - and 314 {mu}W power consumption, leading to a promising prototype. (authors)

  19. A low-noise CMOS pixel direct charge sensor, Topmetal-II-

    NASA Astrophysics Data System (ADS)

    An, Mangmang; Chen, Chufeng; Gao, Chaosong; Han, Mikyung; Ji, Rong; Li, Xiaoting; Mei, Yuan; Sun, Quan; Sun, Xiangming; Wang, Kai; Xiao, Le; Yang, Ping; Zhou, Wei

    2016-02-01

    We report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35 μm CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly collect charge. Each pixel contains a low-noise charge-sensitive preamplifier to establish the analog signal and a discriminator with tunable threshold to generate hits. The analog signal from each pixel is accessible through time-shared multiplexing over the entire array. Hits are read out digitally through a column-based priority logic structure. Tests show that the sensor achieved a < 15e- analog noise and a 200e- minimum threshold for digital readout per pixel. The sensor is capable of detecting both electrons and ions drifting in gas. These characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments.

  20. Integration and testing of the DAQ system for the CMS Phase 1 pixel upgrade

    NASA Astrophysics Data System (ADS)

    Akgün, B.

    2017-02-01

    The CMS pixel detector phase 1 upgrade in 2017 requires an upgraded data acquisition (DAQ) system to accept higher data rates. A new DAQ system has been developed based on a combination of custom and standard μTCA parts. Custom mezzanines on FC7 AMCs [1] provide a front-end driver for readout, and a front-end controller for configuration, clock and trigger. The DAQ system is undergoing a series of integration tests including readout of the pilot pixel detector already installed in CMS, checkout of the phase 1 detector during its assembly, and testing with the CMS central DAQ. This paper describes the DAQ system, integration tests and results, and an outline of the activities up to commissioning the final system at CMS in 2017.

  1. High-Sensitivity X-ray Polarimetry with Amorphous Silicon Active-Matrix Pixel Proportional Counters

    NASA Technical Reports Server (NTRS)

    Black, J. K.; Deines-Jones, P.; Jahoda, K.; Ready, S. E.; Street, R. A.

    2003-01-01

    Photoelectric X-ray polarimeters based on pixel micropattern gas detectors (MPGDs) offer order-of-magnitude improvement in sensitivity over more traditional techniques based on X-ray scattering. This new technique places some of the most interesting astronomical observations within reach of even a small, dedicated mission. The most sensitive instrument would be a photoelectric polarimeter at the focus of 2 a very large mirror, such as the planned XEUS. Our efforts are focused on a smaller pathfinder mission, which would achieve its greatest sensitivity with large-area, low-background, collimated polarimeters. We have recently demonstrated a MPGD polarimeter using amorphous silicon thin-film transistor (TFT) readout suitable for the focal plane of an X-ray telescope. All the technologies used in the demonstration polarimeter are scalable to the areas required for a high-sensitivity collimated polarimeter. Leywords: X-ray polarimetry, particle tracking, proportional counter, GEM, pixel readout

  2. 4 pi direction sensitive gamma imager with RENA-3 readout ASIC

    NASA Astrophysics Data System (ADS)

    Du, Yanfeng; Li, Wen; Yanoff, Brian; Gordon, Jeffrey; Castleberry, Donald

    2007-09-01

    A 4π direction-sensitive gamma imager is presented, using a 1 cm 3 3D CZT detector from Yinnel Tech and the RENA-3 readout ASIC from NOVA R&D. The measured readout system electronic noise is around 4-5 keV FWHM for all anode channels. The measured timing resolution between two channels within a single ASIC is around 10 ns and the resolution is 30 ns between two separate ASIC chips. After 3D material non-uniformity and charge trapping corrections, the measured single-pixel-event energy resolution is around 1% for Cs-137 at 662 keV using a 1 cm 3 CZT detector from Yinnel Tech with an 8 x 8 anode pixel array at 1.15 mm pitch. The energy resolution for two pixel events is 2.9%. A 10 uCi Cs-137 point source was moved around the detector to test the image reconstruction algorithms and demonstrate the source direction detection capability. Accurate source locations were reconstructed with around 200 two-pixel events within a total energy window +/-10 keV around the 662 keV full energy peak. The angular resolution FWHM at four of the five positions tested was between 0.05-0.07 steradians.

  3. Event building for free-streaming readout in the CBM experiment

    NASA Astrophysics Data System (ADS)

    Korolko, I. E.; Prokudin, M. S.; Zaitsev, Yu M.

    2017-01-01

    CBM is the first experiment gaining advantage of free-streaming triggerless readout system. All readout channels of the detector going to work in self triggered mode. Dedicated methods are developed to extract individual events (collisions) from continuous information stream rejecting noise. Efficiency of the methods depends on projectile energy, masses of colliding nucleons, interaction and accelerator frequencies. Quality control of the algorithms and comparison of the methods require special efforts.

  4. CMOS Hybrid Pixel Detectors for Scientific, Industrial and Medical Applications

    NASA Astrophysics Data System (ADS)

    Broennimann, Christian

    2009-03-01

    Crystallography is the principal technique for determining macromolecular structures at atomic resolution and uses advantageously the high intensity of 3rd generation synchrotron X-ray sources . Macromolecular crystallography experiments benefit from excellent beamline equipment, recent software advances and modern X-ray detectors. However, the latter do not take full advantage of the brightness of modern synchrotron sources. CMOS Hybrid pixel array detectors, originally developed for high energy physics experiments, meet these requirements. X-rays are recorded in single photon counting mode and data thus are stored digitally at the earliest possible stage. This architecture leads to several advantages over current detectors: No detector noise is added to the signal. Readout time is reduced to a few milliseconds. The counting rates are matched to beam intensities at protein crystallography beamlines at 3rd generation synchrotrons. The detector is not sensitive to X-rays during readout; therefore no mechanical shutter is required. The detector has a very sharp point spread function (PSF) of one pixel, which allows better resolution of adjacent reflections. Low energy X-rays can be suppressed by the comparator At the Paul Scherrer Institute (PSI) in Switzerland the first and largest array based on this technology was constructed: The Pilatus 6M detector. The detector covers an area of 43.1 x 44.8 cm2 , has 6 million pixels and is read out noise free in 3.7 ms. Since June 2007 the detector is in routine operation at the beamline 6S of the Swiss Light Source (SLS). The company DETCRIS Ltd, has licensed the technology from PSI and is commercially offering the PILATUS detectors. Examples of the wide application range of the detectors will be shown.

  5. Stacked color image sensor using wavelength-selective organic photoconductive films with zinc-oxide thin film transistors as a signal readout circuit

    NASA Astrophysics Data System (ADS)

    Seo, Hokuto; Aihara, Satoshi; Namba, Masakazu; Watabe, Toshihisa; Ohtake, Hiroshi; Kubota, Misao; Egami, Norifumi; Hiramatsu, Takahiro; Matsuda, Tokiyoshi; Furuta, Mamoru; Nitta, Hiroshi; Hirao, Takashi

    2010-01-01

    Our group has been developing a new type of image sensor overlaid with three organic photoconductive films, which are individually sensitive to only one of the primary color components (blue (B), green (G), or red (R) light), with the aim of developing a compact, high resolution color camera without any color separation optical systems. In this paper, we firstly revealed the unique characteristics of organic photoconductive films. Only choosing organic materials can tune the photoconductive properties of the film, especially excellent wavelength selectivities which are good enough to divide the incident light into three primary colors. Color separation with vertically stacked organic films was also shown. In addition, the high-resolution of organic photoconductive films sufficient for high-definition television (HDTV) was confirmed in a shooting experiment using a camera tube. Secondly, as a step toward our goal, we fabricated a stacked organic image sensor with G- and R-sensitive organic photoconductive films, each of which had a zinc oxide (ZnO) thin film transistor (TFT) readout circuit, and demonstrated image pickup at a TV frame rate. A color image with a resolution corresponding to the pixel number of the ZnO TFT readout circuit was obtained from the stacked image sensor. These results show the potential for the development of high-resolution prism-less color cameras with stacked organic photoconductive films.

  6. Efficient readout electronics for multi-anode photomultiplier

    NASA Astrophysics Data System (ADS)

    Lerche, Christoph W.; Herrero-Bosch, Vicente; Ferrando-Jodar, Nestor; Gadea-Girones, Rafa; Sanchez-Martinez, Filomeno; Mora-Más, Francisco J.

    2010-08-01

    We present a novel active and analog readout and preprocessing topology for position sensitive photodetectors (PSPD) that allows to readout a large variety of PSPD devices with different pixel numbers. Additionally, the topology was designed to allow for a significant reduction of analog-to-digital conversion channels. The circuit topology replaces the common passive charge divider and consists of N input stages, N × M weighting stages and M analog adder stages, where N is the number of the input channels, i.e. the number of photodetector pixels and M is the number of outputs. The circuit performs the multiplication of a matrix (the weights) with a vector (signals). For this, the input stage makes M copies of each of the N input signals, the weighting stage multiplies these signal copies with N × M different weights and the output stage adds all weighted copies with the same copy index. For high flexibility, the weights are programmable and the topology allows to interconnect several identical circuits for larger N. Measurements with a first prototype ASIC show that the achieved energy and centroid resolutions equal the resolutions from detectors with passive charge division circuits. However, the presented topology presents important advantages such as scalability. As a first application, we used the prototype ASIC to correct the sensitivity inhomogeneity of position sensitive photomultiplier tubes. As a second application for the circuit, we present a Neural Network based positioning scheme for γ-ray imaging detectors with thick, monolithic scintillation crystals. This allows to correct the strong border artifacts of the center of gravity positioning scheme in monolithic scintillation crystals and thus enhances the spatial resolution of the γ-ray imaging detector.

  7. Readout architecture for sub-nanosecond resolution TDC

    NASA Astrophysics Data System (ADS)

    Marteau, J.; Carlus, B.; Gardien, S.; Girerd, C.; Ianigro, J.-C.; Montorio, J.-L.; Gibert, D.; Nicollin, F.

    2012-04-01

    The DIAPHANE project is pluri-disciplinary collaboration between particle physicists and geophysicists to perform the tomography of large geological structure mainly devoted to the study of active volcanoes. The detector used for this tomography, hereafter referred to as telescope, uses a standard, robust, cost-effective and well-known technology based on solid plastic scintillator readout by photomultiplier(s) (either multichannel pixelized PM or silicon PM). The electronics system is built on the concept of autonomous, triggerless, smart sensor directly connected on a standard fast Ethernet network. First radiographies have been performed on the Mont-Terri underground laboratory (St-Ursanne, Switzerland) and on the active volcano of La Soufrière (Guadeloupe, Lesser Antilles, France). We present an upgrade of the readout architecture allowing to embed a sub-nanosecond resolution TDC within the existing programmable logic to help in the background rejection (rear flux, random coincidences) and to improve the detection purity and the radiography quality. First results obtained are also presented and briefly discussed.

  8. FITPix data preprocessing pipeline for the Timepix single particle pixel detector

    NASA Astrophysics Data System (ADS)

    Kraus, V.; Holik, M.; Jakubek, J.; Georgiev, V.

    2012-04-01

    The semiconductor pixel detector Timepix contains an array of 256 × 256 square pixels with a pitch of 55 μm. The single quantum counting detector Timepix can also provide information about the energy or arrival time of a particle from every single pixel. This device is a powerful tool for radiation imaging and ionizing particle tracking. The Timepix device can be read-out via a serial or parallel interface enabling speeds of 100 fps or 3200 fps, respectively. The device can be connected to a PC via the USB 2.0 based interface FITPix, which currently supports the serial output of Timepix reaching a speed of 90 fps. FITPix supports adjustable clock frequency and hardware triggering which is a useful tool for the synchronized operation of multiple devices. The FITPix interface can handle up to 16 detectors in daisy chain. The complete system including the FITPix interface and Timepix detector is controlled from the PC by the Pixelman software package. A pipeline structure is now implemented in the new version of the readout interface of FITPix. This version also supports parallel Timepix readout. The pipeline architecture brings the possibility of data preprocessing directly in the hardware. The first pipeline stage converts the raw Timepix data into the form of a matrix or stream of pixel values. Another stage performs further data processing such as event thresholding and data compression. Complex data processing currently performed by Pixelman in the PC is significantly reduced in this way. The described architecture together with the parallel readout increases data throughput reaching a higher frame-rate and reducing the dead time. Significant data compression is performed directly in the hardware especially for sparse data sets from particle tracking applications. The data frame size is typically compressed by factor of 10-100.

  9. Single Pixel Characterization of X-Ray TES Microcalorimeter Under AC Bias at MHz Frequencies

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; Blandler, S. R.; Porter, F. S.; Sadleir, J. E.; Kilbourne, C. A.; Bailey, C. N.; Finkbeiner, F. M.; Chervenak, J. A.; Adams, J. S.; Eckart, M. E.; Kelley, R. L.; Smith, S. J.; Linden, T. V. D.; Hoevers, H.; Kuur, J. V. D.; Lindeman, M.; Bruijn, M.; Hortog, R. D.; Kiviranta, M.

    2012-01-01

    In this paper we present the progress made at SRON in the read-out of GSFC x-ray transition-edge sensor (TES) micro-calorimeters in the frequency domain. The experiments reported so far, whose aim was to demonstrate an energy resolution of 2eV at 6 keV with a TES acting as a modulator, were carried out at frequencies below 700 kHz using a standard flux locked loop (FLL) SQUID read-out scheme. The TES read-out suffered from the use of sub-optimal circuit components, large parasitic inductances, low quality factor resonators and poor magnetic field shielding. We have developed a novel experimental set-up, which allows us to test several read-out schemes in a single cryogenic run. In this set-up, the TES pixels are coupled via superconducting transformers to 18 high-Q lithographic LC filters with resonant frequencies ranging between 2 and 5 MHz. The signal is amplified by a two-stage SQUID current sensor and baseband feedback is used to overcome the limited SQUID dynamic range. We study the single pixel performance as a function of TES bias frequency, voltage and perpendicular magnetic field.

  10. Results from a prototype MAPS sensor telescope and readout system with zero suppression for the heavy flavor tracker at STAR

    NASA Astrophysics Data System (ADS)

    Greiner, L.; Matis, H. S.; Ritter, H. G.; Rose, A.; Stezelberger, T.; Sun, X.; Szelezniak, M.; Thomas, J.; Vu, C.; Wieman, H.

    2008-05-01

    We describe a three Mimostar-2 Monolithic Active Pixel Sensor (MAPS) sensor telescope prototype with an accompanying readout system incorporating on-the-fly data sparsification. The system has been characterized and we report on the measured performance of the sensor telescope and readout system in beam tests conducted both at the Advanced Light Source (ALS) at Lawrence Berkeley National Laboratory (LBNL) and in the STAR experiment at the Relativistic Heavy Ion Collider (RHIC). This effort is part of the development and prototyping work that will lead to a vertex detector for the STAR experiment.

  11. Multiple-gain-ranging readout method to extend the dynamic range of amorphous silicon flat-panel imagers

    NASA Astrophysics Data System (ADS)

    Roos, Pieter G.; Colbeth, Richard E.; Mollov, Ivan; Munro, Peter; Pavkovich, John; Seppi, Edward J.; Shapiro, Edward G.; Tognina, Carlo A.; Virshup, Gary F.; Yu, J. Micheal; Zentai, George; Kaissl, Wolfgang; Matsinos, Evangelos; Richters, Jeroen; Riem, Heinrich

    2004-05-01

    The dynamic range of many flat panel imaging systems are fundamentally limited by the dynamic range of the charge amplifier and readout signal processing. We developed two new flat panel readout methods that achieve extended dynamic range by changing the read out charge amplifier feedback capacitance dynamically and on a real-time basis. In one method, the feedback capacitor is selected automatically by a level sensing circuit, pixel-by-pixel, based on its exposure level. Alternatively, capacitor selection is driven externally, such that each pixel is read out two (or more) times, each time with increased feedback capacitance. Both methods allow the acquisition of X-ray image data with a dynamic range approaching the fundamental limits of flat panel pixels. Data with an equivalent bit depth of better than 16 bits are made available for further image processing. Successful implementation of these methods requires careful matching of selectable capacitor values and switching thresholds, with the imager noise and sensitivity characteristics, to insure X-ray quantum limited operation over the whole extended dynamic range. Successful implementation also depends on the use of new calibration methods and image reconstruction algorithms, to insure artifact free rebuilding of linear image data by the downstream image processing systems. The multiple gain ranging flat panel readout method extends the utility of flat panel imagers and paves the way to new flat panel applications, such as cone beam CT. We believe that this method will provide a valuable extension to the clinical application of flat panel imagers.

  12. On Certain New Methodology for Reducing Sensor and Readout Electronics Circuitry Noise in Digital Domain

    NASA Technical Reports Server (NTRS)

    Kizhner, Semion; Miko, Joseph; Bradley, Damon; Heinzen, Katherine

    2008-01-01

    NASA Hubble Space Telescope (HST) and upcoming cosmology science missions carry instruments with multiple focal planes populated with many large sensor detector arrays. These sensors are passively cooled to low temperatures for low-level light (L3) and near-infrared (NIR) signal detection, and the sensor readout electronics circuitry must perform at extremely low noise levels to enable new required science measurements. Because we are at the technological edge of enhanced performance for sensors and readout electronics circuitry, as determined by thermal noise level at given temperature in analog domain, we must find new ways of further compensating for the noise in the signal digital domain. To facilitate this new approach, state-of-the-art sensors are augmented at their array hardware boundaries by non-illuminated reference pixels, which can be used to reduce noise attributed to sensors. There are a few proposed methodologies of processing in the digital domain the information carried by reference pixels, as employed by the Hubble Space Telescope and the James Webb Space Telescope Projects. These methods involve using spatial and temporal statistical parameters derived from boundary reference pixel information to enhance the active (non-reference) pixel signals. To make a step beyond this heritage methodology, we apply the NASA-developed technology known as the Hilbert- Huang Transform Data Processing System (HHT-DPS) for reference pixel information processing and its utilization in reconfigurable hardware on-board a spaceflight instrument or post-processing on the ground. The methodology examines signal processing for a 2-D domain, in which high-variance components of the thermal noise are carried by both active and reference pixels, similar to that in processing of low-voltage differential signals and subtraction of a single analog reference pixel from all active pixels on the sensor. Heritage methods using the aforementioned statistical parameters in the

  13. A 130 nm ASIC prototype for the NA62 Gigatracker readout

    NASA Astrophysics Data System (ADS)

    Dellacasa, G.; Garbolino, S.; Marchetto, F.; Martoiu, S.; Mazza, G.; Rivetti, A.; Wheadon, R.

    2011-09-01

    One of the most challenging detectors of the NA62 experiment is the silicon tracker, called Gigatracker. It consists of three hybrid silicon pixel stations, each one covering an area of 27 mm×60 mm. While the maximum pixel size is fairly large, 300 μm×300 μm the system has to sustain a very high particle rate, 1.5 MHz/mm 2, which corresponds to 800 MHz for each station. To obtain an efficient tracking with such a high rate the required track timing resolution is 150 ps (rms). Therefore the front-end ASIC should provide for each pixel a 200 ps time measurement capability, thus leading to the requirement of time walk compensation and very compact TDCs. Moreover, Single Event Upset protection has to be implemented in order to protect the digital circuitry. An ASIC prototype has been realized in CMOS 130 nm technology, containing three pixel columns. The chip performs the time walk compensation by a Constant Fraction Discriminator circuit, while the time measurement is performed by a Time to Amplitude Converter based TDC, both of them implemented on each pixel cell. The End of Column circuit containing only digital logic is responsible for the data readout from the pixel cell. The whole chip works with a system clock of 160 MHz and the digital logic is SEU protected by the use of Hamming codes. The detailed architecture of the ASIC prototype and test results are presented.

  14. Local Pixel Bundles: Bringing the Pixels to the People

    NASA Astrophysics Data System (ADS)

    Anderson, Jay

    2014-12-01

    The automated galaxy-based alignment software package developed for the Frontier Fields program (hst2galign, see Anderson & Ogaz 2014 and http://www.stsci.edu/hst/campaigns/frontier-fields/) produces a direct mapping from the pixels of the flt frame of each science exposure into a common master frame. We can use these mappings to extract the flt-pixels in the vicinity of a source of interest and package them into a convenient "bundle". In addition to the pixels, this data bundle can also contain "meta" information that will allow users to transform positions from the flt pixels to the reference frame and vice-versa. Since the un-resampled pixels in the flt frames are the only true constraints we have on the astronomical scene, the ability to inter-relate these pixels will enable many high-precision studies, such as: point-source-fitting and deconvolution with accurate PSFs, easy exploration of different image-combining algorithms, and accurate faint-source finding and photometry. The data products introduced in this ISR are a very early attempt to provide the flt-level pixel constraints in a package that is accessible to more than the handful of experts in HST astrometry. The hope is that users in the community might begin using them and will provide feedback as to what information they might want to see in the bundles and what general analysis packages they might find useful. For that reason, this document is somewhat informally written, since I know that it will be modified and updated as the products and tools are optimized.

  15. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2016-09-01

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO2 based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

  16. Construction of the Phase I Forward Pixel Detector

    NASA Astrophysics Data System (ADS)

    Neylon, Ashton; Bartek, Rachel

    2017-01-01

    The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. The original CMS detector was designed for the nominal instantaneous LHC luminosity of 1 x 1034 cm-2s-1 . The LHC has already started to exceed this luminosity causing the CMS pixel detector to see a dynamic inefficiency caused by data losses due to buffer overflows. For this reason the CMS Collaboration has been building an upgraded pixel detector which is scheduled for installation during an extended year end technical stop during winter 2016/2017. The phase 1 upgrade includes four barrel layers and three forward disks, providing robust tracking and vertexing for LHC luminosities up to 2 x 1034 cm-2s-1 . The upgrade incorporates new readout chips, front-end electronics, DC-DC powering, and dual-phase CO2 cooling to achieve performance exceeding that of the present detector with a lower material budget. This contribution will review the design and technology choices of the Phase I detector and discuss the status of the detector. The challenges and difficulties encountered during the construction will also be presented, as well as the lessons learned for future upgrades. National Science Foundation.

  17. Testbeam and laboratory characterization of 3D CMS pixel sensors

    NASA Astrophysics Data System (ADS)

    Bubna, Mayur; Krzwyda, Alex; Alagoz, Enver; Bortoletto, Daniela

    2013-04-01

    Future generations of colliders, like High Luminosity Large Hadron Collider (HL-LHC) at CERN will deliver much higher radiation doses to the particle detectors, specifically those closer to the beam line. Inner tracker detectors will be the most affected part, causing increased occupancy and radiation damage to Silicon detectors. Planar Silicon sensors have not shown enough radiation hardness for the innermost layers where the radiation doses can reach values around 10^16 neq/cm^2. As a possible replacement of planar pixel sensors, 3D Silicon technology is under consideration as they show higher radiation hardness, and efficiencies comparable to planar sensors. Several 3D CMS pixel designs were fabricated at FBK, CNM, and SINTEF. They were bump bonded to the CMS pixel readout chip and characterized in the laboratory using radioactive source (Sr90), and at Fermilab MTEST beam test facility. Sensors were also irradiated with 800 MeV protons at Los Alamos National Lab to study post-irradiation behavior. In addition, several diodes and test structures from FBK were studied before and after irradiation. We report the laboratory and testbeam measurement results for the irradiated 3D devices.

  18. Characterization of CdTe sensors with Schottky contacts coupled to charge-integrating pixel array detectors for X-ray science

    NASA Astrophysics Data System (ADS)

    Becker, J.; Tate, M. W.; Shanks, K. S.; Philipp, H. T.; Weiss, J. T.; Purohit, P.; Chamberlain, D.; Ruff, J. P. C.; Gruner, S. M.

    2016-12-01

    Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray imaging requirements. Here we present characterizations of CdTe sensors hybridized with two different charge-integrating readout chips, the Keck PAD and the Mixed-Mode PAD (MM-PAD), both developed previously in our laboratory. The charge-integrating architecture of each of these PADs extends the instantaneous counting rate by many orders of magnitude beyond that obtainable with photon counting architectures. The Keck PAD chip consists of rapid, 8-frame, in-pixel storage elements with framing periods < 150 ns. The second detector, the MM-PAD, has an extended dynamic range by utilizing an in-pixel overflow counter coupled with charge removal circuitry activated at each overflow. This allows the recording of signals from the single-photon level to tens of millions of x-rays/pixel/frame while framing at 1 kHz. Both detector chips consist of a 128 × 128 pixel array with (150 μm)2 pixels.

  19. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Savic, N.; Bergbreiter, L.; Breuer, J.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Terzo, S.

    2017-02-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 μm. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 μm and a novel design with the optimized biasing structure and small pixel cells (50×50 and 25×100 μm2). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. To predict the performance of 50×50 μm2 pixels at high η, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle with respect to the short pixel direction. Results on cluster shapes, charge collection- and hit efficiency will be shown.

  20. Development of a super B-factory monolithic active pixel detector—the Continuous Acquisition Pixel (CAP) prototypes

    NASA Astrophysics Data System (ADS)

    Varner, G.; Barbero, M.; Bozek, A.; Browder, T.; Fang, F.; Hazumi, M.; Igarashi, A.; Iwaida, S.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanic, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.

    2005-04-01

    Over the last few years great progress has been made in the technological development of Monolithic Active Pixel Sensors (MAPS) such that upgrades to existing vertex detectors using this technology are now actively being considered. Future vertex detection at an upgraded KEK-B factory, already the highest luminosity collider in the world, will require a detector technology capable of withstanding the increased track densities and larger radiation exposures. Near the beam pipe the current silicon strip detectors have projected occupancies in excess of 100%. Deep sub-micron MAPS look very promising to address this problem. In the context of an upgrade to the Belle vertex detector, the major obstacles to realizing such a device have been concerns about radiation hardness and readout speed. Two prototypes implemented in the TSMC 0.35 μm process have been developed to address these issues. Denoted the Continuous Acquisition Pixel, or CAP, the two variants of this architecture are distinguished in that CAP2 includes an 8-deep sampling pipeline within each 22.5 μm 2 pixel. Preliminary test results and remaining R&D issues are presented.

  1. 3D reconstruction of nuclear reactions using GEM TPC with planar readout

    NASA Astrophysics Data System (ADS)

    Bihałowicz, Jan Stefan

    2015-02-01

    The research program of the Extreme Light Infrastructure - Nuclear Physics (ELI-NP) laboratory under construction in Magurele, Romania facilities the need of developing a gaseous active-target detector providing 3D reconstruction of charged products of nuclear reactions induced by gamma beam. The monoenergetic, high-energy (Eγ > 19 MeV) gamma beam of intensity 1013γ/s allows studying nuclear reactions in astrophysics. A Time Projection Chamber with crossed strip readout (eTPC) is proposed as one of the imaging detectors. The special feature of the readout electrode structure is a 2D reconstruction based on the information read out simultaneously from three arrays of strips that form virtual pixels. It is expected to reach similar spatial resolution as for pixel readout at largely reduced cost of electronics. The paper presents the current progress and first results of the small scale prototype TPC which is a one of implementation steps towards eTPC detector proposed in the Technical Design Report of Charged Particles Detection at ELI-NP.

  2. 3D reconstruction of nuclear reactions using GEM TPC with planar readout

    SciTech Connect

    Bihałowicz, Jan Stefan

    2015-02-24

    The research program of the Extreme Light Infrastructure – Nuclear Physics (ELI-NP) laboratory under construction in Magurele, Romania facilities the need of developing a gaseous active-target detector providing 3D reconstruction of charged products of nuclear reactions induced by gamma beam. The monoenergetic, high-energy (E{sub γ} > 19 MeV) gamma beam of intensity 10{sup 13}γ/s allows studying nuclear reactions in astrophysics. A Time Projection Chamber with crossed strip readout (eTPC) is proposed as one of the imaging detectors. The special feature of the readout electrode structure is a 2D reconstruction based on the information read out simultaneously from three arrays of strips that form virtual pixels. It is expected to reach similar spatial resolution as for pixel readout at largely reduced cost of electronics. The paper presents the current progress and first results of the small scale prototype TPC which is a one of implementation steps towards eTPC detector proposed in the Technical Design Report of Charged Particles Detection at ELI-NP.

  3. Calibration Scheme for Large Kinetic Inductance Detector Arrays Based on Readout Frequency Response

    NASA Astrophysics Data System (ADS)

    Bisigello, L.; Yates, S. J. C.; Murugesan, V.; Baselmans, J. J. A.; Baryshev, A. M.

    2016-07-01

    Microwave kinetic inductance detector (MKID) provides a way to build large ground-based sub-mm instruments such as NIKA and A-MKID. For such instruments, therefore, it is important to understand and characterize the response to ensure good linearity and calibration over a wide dynamic range. We propose to use the MKID readout frequency response to determine the MKID responsivity to an input optical source power. A signal can be measured in a KID as a change in the phase of the readout signal with respect to the KID resonant circle. Fundamentally, this phase change is due to a shift in the KID resonance frequency, in turn due to a radiation induced change in the quasiparticle number in the superconducting resonator. We show that the shift in resonant frequency can be determined from the phase shift by using KID phase versus frequency dependence using a previously measured resonant frequency. Working in this calculated resonant frequency, we gain near linearity and constant calibration to a constant optical signal applied in a wide range of operating points on the resonance and readout powers. This calibration method has three particular advantages: first, it is fast enough to be used to calibrate large arrays, with pixel counts in the thousands of pixels; second, it is based on data that are already necessary to determine KID positions; third, it can be done without applying any optical source in front of the array.

  4. CCD readout electronics for the Subaru Prime Focus Spectrograph

    NASA Astrophysics Data System (ADS)

    Hope, Stephen C.; Gunn, James E.; Loomis, Craig P.; Fitzgerald, Roger E.; Peacock, Grant O.

    2014-07-01

    The following paper details the design for the CCD readout electronics for the Subaru Telescope Prime Focus Spectrograph (PFS). PFS is designed to gather spectra from 2394 objects simultaneously, covering wavelengths that extend from 380 nm to 1260 nm. The spectrograph is comprised of four identical spectrograph modules, each collecting roughly 600 spectra. The spectrograph modules provide simultaneous wavelength coverage over the entire band through the use of three separate optical channels: blue, red, and near infrared (NIR). A camera in each channel images the multi-object spectra onto a 4k × 4k, 15 μm pixel, detector format. The two visible cameras use a pair of Hamamatsu 2k × 4k CCDs with readout provided by custom electronics, while the NIR camera uses a single Teledyne HgCdTe 4k × 4k detector and Teledyne's ASIC Sidecar to read the device. The CCD readout system is a custom design comprised of three electrical subsystems - the Back End Electronics (BEE), the Front End Electronics (FEE), and a Pre-amplifier. The BEE is an off-the-shelf PC104 computer, with an auxiliary Xilinx FPGA module. The computer serves as the main interface to the Subaru messaging hub and controls other peripheral devices associated with the camera, while the FPGA is used to generate the necessary clocks and transfer image data from the CCDs. The FEE board sets clock biases, substrate bias, and CDS offsets. It also monitors bias voltages, offset voltages, power rail voltage, substrate voltage and CCD temperature. The board translates LVDS clock signals to biased clocks and returns digitized analog data via LVDS. Monitoring and control messages are sent from the BEE to the FEE using a standard serial interface. The Pre-amplifier board resides behind the detectors and acts as an interface to the two Hamamatsu CCDs. The Pre-amplifier passes clocks and biases to the CCDs, and analog CCD data is buffered and amplified prior to being returned to the FEE. In this paper we describe the

  5. Overview of the BTeV Pixel Detector

    SciTech Connect

    Jeffrey A Appel

    2002-12-10

    BTeV is a new Fermilab beauty and charm experiment designed to operate in the CZero region of the Tevatron collider. Critical to the success of BTeV is its pixel detector. The unique features of this pixel detector include its proximity to the beam, its operation with a beam crossing time of 132 ns, and the need for the detector information to be read out quickly enough to be used for the lowest level trigger. This talk presents an overview of the pixel detector design, giving the motivations for the technical choices made. The status of the current R&D on detector components is also reviewed. Additional Pixel 2002 talks on the BTeV pixel detector are given by Dave Christian[1], Mayling Wong[2], and Sergio Zimmermann[3]. Table 1 gives a selection of pixel detector parameters for the ALICE, ATLAS, BTeV, and CMS experiments. Comparing the progression of this table, which I have been updating for the last several years, has shown a convergence of specifications. Nevertheless, significant differences endure. The BTeV data-driven readout, horizontal and vertical position resolution better than 9 {micro}m with the {+-} 300 mr forward acceptance, and positioning in vacuum and as close as 6 mm from the circulating beams remain unique. These features are driven by the physics goals of the BTeV experiment. Table 2 demonstrates that the vertex trigger performance made possible by these features is requisite for a very large fraction of the B meson decay physics which is so central to the motivation for BTeV. For most of the physics quantities of interest listed in the table, the vertex trigger is essential. The performance of the BTeV pixel detector may be summarized by looking at particular physics examples; e.g., the B{sub s} meson decay B{sub s} {yields} D{sub s}{sup -} K{sup +}. For that decay, studies using GEANT3 simulations provide quantitative measures of performance. For example, the separation between the B{sub s} decay point and the primary proton

  6. Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

    NASA Astrophysics Data System (ADS)

    Lehmann, N.; Karagounis, M.; Kersten, S.; Zeitnitz, C.

    2016-11-01

    The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

  7. Method of fabrication of display pixels driven by silicon thin film transistors

    DOEpatents

    Carey, Paul G.; Smith, Patrick M.

    1999-01-01

    Display pixels driven by silicon thin film transistors are fabricated on plastic substrates for use in active matrix displays, such as flat panel displays. The process for forming the pixels involves a prior method for forming individual silicon thin film transistors on low-temperature plastic substrates. Low-temperature substrates are generally considered as being incapable of withstanding sustained processing temperatures greater than about 200.degree. C. The pixel formation process results in a complete pixel and active matrix pixel array. A pixel (or picture element) in an active matrix display consists of a silicon thin film transistor (TFT) and a large electrode, which may control a liquid crystal light valve, an emissive material (such as a light emitting diode or LED), or some other light emitting or attenuating material. The pixels can be connected in arrays wherein rows of pixels contain common gate electrodes and columns of pixels contain common drain electrodes. The source electrode of each pixel TFT is connected to its pixel electrode, and is electrically isolated from every other circuit element in the pixel array.

  8. Buffer direct injection readout integrated circuit design for dual band infrared focal plane array detector

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Shieh, Hsiu-Li; Tang, Shiang-Feng; Lin, Wen-Jen

    2013-05-01

    This paper proposes dual-mode buffer direct injection (BDI) and direct injection (DI) readout circuit design. The DI readout circuit has the advantage of being a simple circuit, requiring a small layout area, and low power consumption. The internal resistance of the photodetector will affect the photocurrent injection efficiency. We used a buffer amplifier to design the BDI readout circuit since it would reduce the input impedance and raise the injection efficiency. This paper will discuss and analyze the power consumption, injection efficiency, layout area, and circuit noise. The circuit is simulated using a TSMC 0.35 um Mixed Signal 2P4M CMOS 5 V process. The dimension of the pixel area is 30×30 μm. We have designed a 10×8 array for the readout circuit of the interlaced columns. The input current ranges from 1 nA to 10 nA, when the measurement current is 10 pA to 10 nA. The integration time was varied. The circuit output swing was 2 V. The total root mean square noise voltage was 4.84 mV. The signal to noise ratio was 52 dB, and the full chip circuit power consumption was 9.94 mW.

  9. A Full Parallel Event Driven Readout Technique for Area Array SPAD FLIM Image Sensors

    PubMed Central

    Nie, Kaiming; Wang, Xinlei; Qiao, Jun; Xu, Jiangtao

    2016-01-01

    This paper presents a full parallel event driven readout method which is implemented in an area array single-photon avalanche diode (SPAD) image sensor for high-speed fluorescence lifetime imaging microscopy (FLIM). The sensor only records and reads out effective time and position information by adopting full parallel event driven readout method, aiming at reducing the amount of data. The image sensor includes four 8 × 8 pixel arrays. In each array, four time-to-digital converters (TDCs) are used to quantize the time of photons’ arrival, and two address record modules are used to record the column and row information. In this work, Monte Carlo simulations were performed in Matlab in terms of the pile-up effect induced by the readout method. The sensor’s resolution is 16 × 16. The time resolution of TDCs is 97.6 ps and the quantization range is 100 ns. The readout frame rate is 10 Mfps, and the maximum imaging frame rate is 100 fps. The chip’s output bandwidth is 720 MHz with an average power of 15 mW. The lifetime resolvability range is 5–20 ns, and the average error of estimated fluorescence lifetimes is below 1% by employing CMM to estimate lifetimes. PMID:26828490

  10. Code-division-multiplexed readout of large arrays of TES microcalorimeters

    NASA Astrophysics Data System (ADS)

    Morgan, K. M.; Alpert, B. K.; Bennett, D. A.; Denison, E. V.; Doriese, W. B.; Fowler, J. W.; Gard, J. D.; Hilton, G. C.; Irwin, K. D.; Joe, Y. I.; O'Neil, G. C.; Reintsema, C. D.; Schmidt, D. R.; Ullom, J. N.; Swetz, D. S.

    2016-09-01

    Code-division multiplexing (CDM) offers a path to reading out large arrays of transition edge sensor (TES) X-ray microcalorimeters with excellent energy and timing resolution. We demonstrate the readout of X-ray TESs with a 32-channel flux-summed code-division multiplexing circuit based on superconducting quantum interference device (SQUID) amplifiers. The best detector has energy resolution of 2.28 ± 0.12 eV FWHM at 5.9 keV and the array has mean energy resolution of 2.77 ± 0.02 eV over 30 working sensors. The readout channels are sampled sequentially at 160 ns/row, for an effective sampling rate of 5.12 μs/channel. The SQUID amplifiers have a measured flux noise of 0.17 μΦ0/√Hz (non-multiplexed, referred to the first stage SQUID). The multiplexed noise level and signal slew rate are sufficient to allow readout of more than 40 pixels per column, making CDM compatible with requirements outlined for future space missions. Additionally, because the modulated data from the 32 SQUID readout channels provide information on each X-ray event at the row rate, our CDM architecture allows determination of the arrival time of an X-ray event to within 275 ns FWHM with potential benefits in experiments that require detection of near-coincident events.

  11. The high performance readout chain for the DSSC 1Megapixel detector, designed for high throughput during pulsed operation mode

    NASA Astrophysics Data System (ADS)

    Kirchgessner, M.; Soldat, J.; Kugel, A.; Donato, M.; Porro, M.; Fischer, P.

    2015-01-01

    The readout chain of the DSSC 1M pixel detector currently built at DESY, Hamburg for the European X-Ray Free Electron Laser is described. The system operates in pulsed operation mode comparable to the new ILC. Each 0.1 seconds 800 images of 1M pixels are produced and readout by the DSSC DAQ electronics. The total data production rate of the system is about 134 Gbit/s. In order to deal with the high data rates, latest technology components like the Xilinx Kintex 7 FPGA are used to implement fast DDR3-1600 image buffers, high speed serial FPGA to FPGA communication and 10 GB Ethernet links concentrated in one 40 Gbit/s QSFP+ transceiver.

  12. R&D on a novel spectro-imaging polarimeter with Micromegas detectors and a Caliste readout system

    NASA Astrophysics Data System (ADS)

    Attié, D.; Blondel, C.; Boilevin-Kayl, L.; Desforges, D.; Ferrer-Ribas, E.; Giomataris, I.; Gevin, O.; Jeanneau, F.; Limousin, O.; Meuris, A.; Papaevangelou, T.; Peyaud, A.

    2015-07-01

    Micromegas detectors, part of the Micro-Pattern Gaseous Detectors (MPGD) family, are used in a very wide range of applications in the High Energy Physics community but also in astroparticle and neutrino physics. In most of the Micromegas applications the design of the detector vessel and the readout plane is extremely coupled. A way of dissociating these two components would be by separating the amplification structure and the detector volume from the readout plane and electronics. This is achieved with the so called piggyback Micromegas detectors. They open up new possibilities of applications in terms of adaptability to new electronics. In particular piggyback resistive Micromegas can be easily coupled to modern pixel array electronic ASICs. First tests have been carried out with a Medipix chip where the protection of the resistive layer has been proved. The results of very recent tests coupling piggyback Micromegas with the readout module of Caliste are presented. Caliste is a high performance spectro-imager with event time-tagging capability, able to detect photons between 2 keV and 250 keV in the context of a spatial micro spectro-imaging polarimetrer. In the current application, with the Piggyback Micromegas, we use the readout module only as the sensitive detector. We benefit of the good spatial resolution thanks to the high density readout pixels ( 600 μm pixel pitch), to the low noise, to the low power and to the radiation hard integrated front-end IDEF-X electronics. The advantage of such a device is to have a high gain, low noise, low threshold, and robust detector operating at room temperature. This would be very attractive for spatial applications, for instance X-ray polarisation.

  13. Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

    NASA Astrophysics Data System (ADS)

    Grenier, P.; Alimonti, G.; Barbero, M.; Bates, R.; Bolle, E.; Borri, M.; Boscardin, M.; Buttar, C.; Capua, M.; Cavalli-Sforza, M.; Cobal, M.; Cristofoli, A.; Dalla Betta, G.-F.; Darbo, G.; Da Vià, C.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dobos, D.; Einsweiler, K.; Esseni, D.; Fazio, S.; Fleta, C.; Freestone, J.; Gallrapp, C.; Garcia-Sciveres, M.; Gariano, G.; Gemme, C.; Giordani, M.-P.; Gjersdal, H.; Grinstein, S.; Hansen, T.; Hansen, T.-E.; Hansson, P.; Hasi, J.; Helle, K.; Hoeferkamp, M.; Hügging, F.; Jackson, P.; Jakobs, K.; Kalliopuska, J.; Karagounis, M.; Kenney, C.; Köhler, M.; Kocian, M.; Kok, A.; Kolya, S.; Korokolov, I.; Kostyukhin, V.; Krüger, H.; La Rosa, A.; Lai, C. H.; Lietaer, N.; Lozano, M.; Mastroberardino, A.; Micelli, A.; Nellist, C.; Oja, A.; Oshea, V.; Padilla, C.; Palestri, P.; Parker, S.; Parzefall, U.; Pater, J.; Pellegrini, G.; Pernegger, H.; Piemonte, C.; Pospisil, S.; Povoli, M.; Roe, S.; Rohne, O.; Ronchin, S.; Rovani, A.; Ruscino, E.; Sandaker, H.; Seidel, S.; Selmi, L.; Silverstein, D.; Sjøbæk, K.; Slavicek, T.; Stapnes, S.; Stugu, B.; Stupak, J.; Su, D.; Susinno, G.; Thompson, R.; Tsung, J.-W.; Tsybychev, D.; Watts, S. J.; Wermes, N.; Young, C.; Zorzi, N.

    2011-05-01

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  14. Study of indium and solder bumps for the BTeV Pixel Detector

    SciTech Connect

    Simon W Kwan et al.

    2003-11-05

    The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the strength of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposed to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing the responses of single-chip pixel detectors to an Sr{sup 90} source. We report the results from these studies and our plan to measure the effect of cryogenic temperatures on the bumps.

  15. Electron Pattern Recognition using trigger mode SOI pixel sensor for Advanced Compton Imaging

    NASA Astrophysics Data System (ADS)

    Shimazoe, K.; Yoshihara, Y.; Fairuz, A.; Koyama, A.; Takahashi, H.; Takeda, A.; Tsuru, T.; Arai, Y.

    2016-02-01

    Compton imaging is a useful method for localizing sub MeV to a few MeV gamma-rays and widely used for environmental and medical applications. The direction of recoiled electrons in Compton scattering process provides the additional information to limit the Compton cones and increases the sensitivity in the system. The capability of recoiled electron tracking using trigger-mode Silicon-On-Insulator (SOI) sensor is investigated with various radiation sources. The trigger-mode SOI sensor consists of 144 by 144 active pixels with 30 μm cells and the thickness of sensor is 500 μm. The sensor generates the digital output when it is hit by gamma-rays and 25 by 25 pixel pattern of surrounding the triggered pixel is readout to extract the recoiled electron track. The electron track is successfully observed for 60Co and 137Cs sources, which provides useful information for future electron tracking Compton camera.

  16. Common Bias Readout for TES Array on Scanning Transmission Electron Microscope

    NASA Astrophysics Data System (ADS)

    Yamamoto, R.; Sakai, K.; Maehisa, K.; Nagayoshi, K.; Hayashi, T.; Muramatsu, H.; Nakashima, Y.; Mitsuda, K.; Yamasaki, N. Y.; Takei, Y.; Hidaka, M.; Nagasawa, S.; Maehata, K.; Hara, T.

    2016-07-01

    A transition edge sensor (TES) microcalorimeter array as an X-ray sensor for a scanning transmission electron microscope system is being developed. The technical challenge of this system is a high count rate of ˜ 5000 counts/second/array. We adopted a 64 pixel array with a parallel readout. Common SQUID bias, and common TES bias are planned to reduce the number of wires and the resources of a room temperature circuit. The reduction rate of wires is 44 % when a 64 pixel array is read out by a common bias of 8 channels. The possible degradation of the energy resolution has been investigated by simulations and experiments. The bias fluctuation effects of a series connection are less than those of a parallel connection. Simple calculations expect that the fluctuations of the common SQUID bias and common TES bias in a series connection are 10^{-7} and 10^{-3}, respectively. We constructed 8 SQUIDs which are connected to 8 TES outputs and a room temperature circuit for common bias readout and evaluated experimentally. Our simulation of crosstalk indicates that at an X-ray event rate of 500 cps/pixel, crosstalk will broaden a monochromatic line by about 0.01 %, or about 1.5 eV at 15 keV. Thus, our design goal of 10 eV energy resolution across the 0.5-15 keV band should be achievable.

  17. The LHCb Vertex Locator (VELO) Pixel Detector Upgrade

    NASA Astrophysics Data System (ADS)

    Buchanan, E.

    2017-01-01

    The LHCb experiment is designed to perform high-precision measurements of CP violation and the decays of beauty and charm hadrons at the Large Hadron Collider (LHC) at CERN. There is a planned upgrade during Long Shutdown 2 (LS2), expected in 2019, which will allow the detector to run at higher luminosities by transforming the entire readout to a trigger-less system. This will include a substantial upgrade of the Vertex Locator (VELO), the silicon tracker that surrounds the LHCb interaction region. The VELO is moving from silicon strip technology to hybrid pixel sensors, where silicon sensors are bonded to VeloPix ASICs. Sensor prototypes have undergone rigorous testing using the Timepix3 Telescope at the SPS, CERN. The main components of the upgrade are summarised and testbeam results presented.

  18. Edge pixel response studies of edgeless silicon sensor technology for pixellated imaging detectors

    NASA Astrophysics Data System (ADS)

    Maneuski, D.; Bates, R.; Blue, A.; Buttar, C.; Doonan, K.; Eklund, L.; Gimenez, E. N.; Hynds, D.; Kachkanov, S.; Kalliopuska, J.; McMullen, T.; O'Shea, V.; Tartoni, N.; Plackett, R.; Vahanen, S.; Wraight, K.

    2015-03-01

    Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

  19. BESIII ETOF upgrade readout electronics commissioning

    NASA Astrophysics Data System (ADS)

    Wang, Xiao-Zhuang; Dai, Hong-Liang; Wu, Zhi; Heng, Yue-Kun; Zhang, Jie; Cao, Ping; Ji, Xiao-Lu; Li, Cheng; Sun, Wei-Jia; Wang, Si-Yu; Wang, Yun

    2017-01-01

    It is proposed to upgrade the endcap time-of-flight (ETOF) of the Beijing Spectrometer III (BESIII) with a multi-gap resistive plate chamber (MRPC), aiming at an overall time resolution of about 80 ps. After completing the entire readout electronics system, some experiments, such as heat radiation, radiation hardness and large-current beam tests, have been carried out to confirm the reliability and stability of the readout electronics. An on-detector test of the readout electronics has also been performed with the beam at the BEPCII E3 line. The test results indicate that the readout electronics system fulfills its design requirements. Supported by Chinese Academy of Sciences (1G201331231172010)

  20. Signal modeling of charge sharing effect in simple pixelated CdZnTe detector

    NASA Astrophysics Data System (ADS)

    Kim, Jae Cheon; Kaye, William R.; He, Zhong

    2014-05-01

    In order to study the energy resolution degradation in 3D position-sensitive pixelated CdZnTe (CZT) detectors, a detailed detector system modeling package has been developed and used to analyze the detector performance. A 20 × 20 × 15 mm3 CZT crystal with an 11 × 11 simple-pixel anode array and a 1.72 mm pixel pitch was modeled. The VAS UM/TAT4 Application Specific Integrated Circuitry (ASIC) was used for signal read-out. Components of the simulation package include gamma-ray interactions with the CZT crystal, charge induction, electronic noise, pulse shaping, and ASIC triggering procedures. The charge induction model considers charge drift, trapping, diffusion, and sharing between pixels. This system model is used to determine the effects of electron cloud sharing, weighting potential non-uniformity, and weighting potential cross-talk which produce non-uniform signal responses for different gamma-ray interaction positions and ultimately degrade energy resolution. The effect of the decreased weighting potential underneath the gap between pixels on the total pulse amplitude of events has been studied. The transient signals induced by electron clouds collected near the gap between pixels may generate false signals, and the measured amplitude can be even greater than the photopeak. As the number of pixels that collect charge increases, the probability of side-neighbor events due to charge sharing significantly increases. If side-neighbor events are not corrected appropriately, the energy resolution of pixelated CZT detectors in multiple-pixel events degrades rapidly.

  1. CMOS Integrated Lock-in Readout Circuit for FET Terahertz Detectors

    NASA Astrophysics Data System (ADS)

    Domingues, Suzana; Perenzoni, Daniele; Perenzoni, Matteo; Stoppa, David

    2017-02-01

    In this paper, a switched-capacitor readout circuit topology integrated with a THz antenna and field-effect transistor detector is analyzed, designed, and fabricated in a 0.13-μm standard CMOS technology. The main objective is to perform amplification and filtering of the signal, as well as subtraction of background in case of modulated source, in order to avoid the need for an external lock-in amplifier, in a compact implementation. A maximum responsivity of 139.7 kV/W, and a corresponding minimum NEP of 2.2 nW/√Hz, was obtained with a two-stage readout circuit at 1 kHz modulation frequency. The presented switched-capacitor circuit is suitable for implementation in pixel arrays due to its compact size and power consumption (0.014 mm2 and 36 μW).

  2. ERICA: an energy resolving photon counting readout ASIC for X-ray in-line cameras

    NASA Astrophysics Data System (ADS)

    Macias-Montero, J.-G.; Sarraj, M.; Chmeissani, M.; Moore, T.; Casanova, R.; Martinez, R.; Puigdengoles, C.; Prats, X.; Kolstein, M.

    2016-12-01

    We present ERICA (Energy Resolving Inline X-ray Camera) a photon-counting readout ASIC, with 6 energy bins. The ASIC is composed of a matrix of 8 × 20 pixels controlled by a global digital controller and biased with 7 independent digital to analog converters (DACs) and a band-gap current reference. The pixel analog front-end includes a charge sensitive amplifier with 16 mV/ke- gain and dynamic range of 45 ke-. ERICA has programmable pulse width, an adjustable constant current feedback resistor, a linear test pulse generator, and six discriminators with 6-bit local threshold adjustment. The pixel digital back-end includes the digital controller, 8 counters of 8-bit depth, half-full buffer flag for any of the 8 counters, a 74-bit shadow/shift register, a 74-bit configuration latch, and charge sharing compensation processing to perform the energy classification and counting operations of every detected photon in 1 μ s. The pixel size is 330 μm × 330 μm and its average consumption is 150 μW. Implemented in TSMC 0.25 μm CMOS process, the ASIC pixel's equivalent noise charge (ENC) is 90 e- RMS connected to a 1 mm thickness matching CdTe detector biased at -300 V with a total leakage current of 20 nA.

  3. Satellite Direct Readout: Opportunities for Science Education

    DTIC Science & Technology

    1994-02-01

    AD-A276 257 1UIIIIIlii 253860-1-X (R) SATELLITE DIRECT READOUT: OPPORTUNITIES FOR SCIENCE EDUCATION Thomas W. Wagner February 1994 C, Submitted to...Their Classroom ..................... 10 LIST OF TABLES 1. Summary Statement of Work .............................. 1 2. Science Education Goals and...with emphasis on newly emerging national Science Education Standards. Section 3 provides the specifications of the portable ERIM Direct Readout

  4. Crosstalk characterization of PMD pixels using the spatial response function at subpixel level

    NASA Astrophysics Data System (ADS)

    Heredia Conde, Miguel; Hartmann, Klaus; Loffeld, Otmar

    2015-03-01

    Time-of-Flight cameras have become one of the most widely-spread low-cost 3D-sensing devices. Most of them do not actually measure the time the light needs to hit an object and come back to the camera, but the difference of phase with respect to a reference signal. This requires special pixels with complex spatial structure, such as PMD pixels, able to sample the cross-correlation function between the incoming signal, reflected by the scene, and the reference signal. The complex structure, together with the presence of in-pixel electronics and the need for a compact readout circuitry for both pixel channels, suggests that systematic crosstalk effects will come up in this kind of devices. For the first time, we take profit of recent results on subpixel spatial responses of PMD pixels to detect and characterize crosstalk occurrences. Well-defined crosstalk patterns have been identified and quantitatively characterized through integration of the inter-pixel spatial response over each sensitive area. We cast the crosstalk problem into an image convolution and provide deconvolution kernels for cleaning PMD raw images from crosstalk. Experiments on real PMD raw images show that our results can be used to undo the lowpass filtering caused by crosstalk in high contrast image areas. The application of our kernels to undo crosstalk effects leads to reductions of the depth RMSE up to 50% in critical areas.

  5. All-passive pixel super-resolution of time-stretch imaging

    PubMed Central

    Chan, Antony C. S.; Ng, Ho-Cheung; Bogaraju, Sharat C. V.; So, Hayden K. H.; Lam, Edmund Y.; Tsia, Kevin K.

    2017-01-01

    Based on image encoding in a serial-temporal format, optical time-stretch imaging entails a stringent requirement of state-of-the-art fast data acquisition unit in order to preserve high image resolution at an ultrahigh frame rate — hampering the widespread utilities of such technology. Here, we propose a pixel super-resolution (pixel-SR) technique tailored for time-stretch imaging that preserves pixel resolution at a relaxed sampling rate. It harnesses the subpixel shifts between image frames inherently introduced by asynchronous digital sampling of the continuous time-stretch imaging process. Precise pixel registration is thus accomplished without any active opto-mechanical subpixel-shift control or other additional hardware. Here, we present the experimental pixel-SR image reconstruction pipeline that restores high-resolution time-stretch images of microparticles and biological cells (phytoplankton) at a relaxed sampling rate (≈2–5 GSa/s)—more than four times lower than the originally required readout rate (20 GSa/s) — is thus effective for high-throughput label-free, morphology-based cellular classification down to single-cell precision. Upon integration with the high-throughput image processing technology, this pixel-SR time-stretch imaging technique represents a cost-effective and practical solution for large scale cell-based phenotypic screening in biomedical diagnosis and machine vision for quality control in manufacturing. PMID:28303936

  6. All-passive pixel super-resolution of time-stretch imaging

    NASA Astrophysics Data System (ADS)

    Chan, Antony C. S.; Ng, Ho-Cheung; Bogaraju, Sharat C. V.; So, Hayden K. H.; Lam, Edmund Y.; Tsia, Kevin K.

    2017-03-01

    Based on image encoding in a serial-temporal format, optical time-stretch imaging entails a stringent requirement of state-of-the-art fast data acquisition unit in order to preserve high image resolution at an ultrahigh frame rate — hampering the widespread utilities of such technology. Here, we propose a pixel super-resolution (pixel-SR) technique tailored for time-stretch imaging that preserves pixel resolution at a relaxed sampling rate. It harnesses the subpixel shifts between image frames inherently introduced by asynchronous digital sampling of the continuous time-stretch imaging process. Precise pixel registration is thus accomplished without any active opto-mechanical subpixel-shift control or other additional hardware. Here, we present the experimental pixel-SR image reconstruction pipeline that restores high-resolution time-stretch images of microparticles and biological cells (phytoplankton) at a relaxed sampling rate (≈2–5 GSa/s)—more than four times lower than the originally required readout rate (20 GSa/s) — is thus effective for high-throughput label-free, morphology-based cellular classification down to single-cell precision. Upon integration with the high-throughput image processing technology, this pixel-SR time-stretch imaging technique represents a cost-effective and practical solution for large scale cell-based phenotypic screening in biomedical diagnosis and machine vision for quality control in manufacturing.

  7. WFC3 Pixel Area Maps

    NASA Astrophysics Data System (ADS)

    Kalirai, J. S.; Cox, C.; Dressel, L.; Fruchter, A.; Hack, W.; Kozhurina-Platais, V.; Mack, J.

    2010-04-01

    We present the pixel area maps (PAMs) for the WFC3/UVIS and WFC3/IR detectors, and discuss the normalization of these images. HST processed flt images suffer from geometric distortion and therefore have pixel areas that vary on the sky. The counts (electrons) measured for a source on these images depends on the position of the source on the detector, an effect that is implicitly corrected when these images are multidrizzled into drz files. The flt images can be multiplied by the PAMs to yield correct and uniform counts for a given source irrespective of its location on the image. To ensure consistency between the count rate measured for sources in drz images and near the center of flt images, we set the normalization of the PAMs to unity at a reference pixel near the center of the UVIS mosaic and IR detector, and set the SCALE in the IDCTAB equal to the square root of the area of this reference pixel. The implications of this choice for photometric measurements are discussed.

  8. Study of the spatial resolution for binary readout detectors

    NASA Astrophysics Data System (ADS)

    Yonamine, R.; Maerschalk, T.; Lentdecker, G. De

    2016-07-01

    Often the binary readout is proposed for high granularity detectors to reduce the generated data volume to be readout at the price of a somewhat reduced spatial resolution compared to an analogue readout. We have been studying single hit resolutions obtained with a binary readout using simulations as well as analytical approaches. In this note we show that the detector geometry could be optimized to offer an equivalent spatial resolution than with an analogue readout.

  9. A 65k pixel, 150k frames-per-second camera with global gating and micro-lenses suitable for fluorescence lifetime imaging

    NASA Astrophysics Data System (ADS)

    Burri, Samuel; Powolny, François; Bruschini, Claudio E.; Michalet, Xavier; Regazzoni, Francesco; Charbon, Edoardo

    2014-05-01

    This paper presents our work on a 65k pixel single-photon avalanche diode (SPAD) based imaging sensor realized in a 0.35μm standard CMOS process. At a resolution of 512 by 128 pixels the sensor is read out in 6.4μs to deliver over 150k monochrome frames per second. The individual pixel has a size of 24μm2 and contains the SPAD with a 12T quenching and gating circuitry along with a memory element. The gating signals are distributed across the chip through a balanced tree to minimize the signal skew between the pixels. The array of pixels is row-addressable and data is sent out of the chip on 128 lines in parallel at a frequency of 80MHz. The system is controlled by an FPGA which generates the gating and readout signals and can be used for arbitrary real-time computation on the frames from the sensor. The communication protocol between the camera and a conventional PC is USB2. The active area of the chip is 5% and can be significantly improved with the application of a micro-lens array. A micro-lens array, for use with collimated light, has been designed and its performance is reviewed in the paper. Among other high-speed phenomena the gating circuitry capable of generating illumination periods shorter than 5ns can be used for Fluorescence Lifetime Imaging (FLIM). In order to measure the lifetime of fluorophores excited by a picosecond laser, the sensor's illumination period is synchronized with the excitation laser pulses. A histogram of the photon arrival times relative to the excitation is then constructed by counting the photons arriving during the sensitive time for several positions of the illumination window. The histogram for each pixel is transferred afterwards to a computer where software routines extract the lifetime at each location with an accuracy better than 100ps. We show results for fluorescence lifetime measurements using different fluorophores with lifetimes ranging from 150ps to 5ns.

  10. Development of pixel sensors with 25 × 500 μm2 pitch for the ATLAS HL-LHC upgrade

    NASA Astrophysics Data System (ADS)

    Burdin, S.; Casse, G.; Dervan, P.; Forshaw, D.; Hayward, H.; Tsurin, I.; Wormald, M.

    2014-11-01

    Upgrade of the ATLAS tracker detector for high-luminosity LHC conditions requires novel approaches to the pixel sensor design. Tests of different pitch layouts represent significant part of the ATLAS upgrade program. Better momentum resolution and multiple track reconstruction in the r - ϕ plane could be achieved with finer ϕ-segmentation. Changing the pitch from 50 × 250 μm2 to 25 × 500 μm2 in the outer pixel modules would improve the tracking performance of the upgraded ATLAS detector. The pixel sensors with 25 × 500 μm2 readout by FE-I4 chips have been designed at the University of Liverpool. The sensors were measured in the laboratory and test-beam. Results of these tests will be presented together with geometry characteristics of other novel pixel layouts, compatible with the FE-I4 floor-plan, which have been designed and produced.

  11. HEPS-BPIX, a single photon counting pixel detector with a high frame rate for the HEPS project

    NASA Astrophysics Data System (ADS)

    Wei, Wei; Zhang, Jie; Ning, Zhe; Lu, Yunpeng; Fan, Lei; Li, Huaishen; Jiang, Xiaoshan; Lan, Allan K.; Ouyang, Qun; Wang, Zheng; Zhu, Kejun; Chen, Yuanbo; Liu, Peng

    2016-11-01

    China's next generation light source, named the High Energy Photon Source (HEPS), is currently under construction. HEPS-BPIX (HEPS-Beijing PIXel) is a dedicated pixel readout chip that operates in single photon counting mode for X-ray applications in HEPS. Designed using CMOS 0.13 μm technology, the chip contains a matrix of 104×72 pixels. Each pixel measures 150 μm×150 μm and has a counting depth of 20 bits. A bump-bonded prototyping detector module with a 300-μm thick silicon sensor was tested in the beamline of Beijing Synchrotron Radiation Facility. A fast stream of X-ray images was demonstrated, and a frame rate of 1.2 kHz was proven, with a negligible dead time. The test results showed an equivalent noise charge of 115 e- rms after bump bonding and a threshold dispersion of 55 e- rms after calibration.

  12. A 160 x 120 pixel uncooled TEC-less infrared radiation focal plane array on a standard ceramic package

    NASA Astrophysics Data System (ADS)

    Funaki, Hideyuki; Honda, Hiroto; Fujiwara, Ikuo; Yagi, Hitoshi; Ishii, Kouichi; Sasaki, Keita

    2009-05-01

    We have developed a 32 μm pitch and 160 × 120 pixel uncooled infrared radiation focal plane array (IRFPA) on SOI by 0.35 μm CMOS technology and bulk-micromachining. For IR detection, we use silicon single crystal series p-n junctions which can realize high uniformity of temperature coefficient and low voltage drift. We have also developed a low-noise CMOS readout circuit on the same SOI which can calibrate the substrate temperature variation in every frame period, comparing two types of pixels, a bulk-micromachined infrared detection pixel and a non-micromachined reference pixel. Then the FPA requires no thermo-electric cooler (TEC) and is mounted on a low-cost standard ceramic package for the consumer products market.

  13. THE CONTROLLED DRIFT DETECTOR : CHARACTERISATION OF THE READOUT MECHANISM AND OF THE CHARGE HANDLING CAPABILITY.

    SciTech Connect

    CASTOLDI,A.; GATTI,E.; GUAZZONI,C.; LONGONI,A.; REHAK,P.; STRUDER,L.

    1998-11-08

    A new position-sensing X-ray detector operated in integrate-readout mode has been recently designed and characterized. Due to the peculiar working principle of the new detector, the charge handling capability, that is the maximum charge that can be stored in a pixel, is related to the operating conditions of the device. In particular the amplitude of the barriers that confine the signal electrons during the integration phase depends on the applied drift field and on the field perturbation superposed to it. A detailed experimental characterization of the charge handling capability as a function of these parameters has been carried out.

  14. A low-noise and fast pre-amplifier and readout system for SiPMs

    NASA Astrophysics Data System (ADS)

    Biroth, M.; Achenbach, P.; Downie, E.; Thomas, A.

    2015-07-01

    To operate silicon photomultipliers (SiPMs) in a demanding environment with large temperature gradients, different amplifier concepts were characterized by analyzing SiPM pulse-shapes and charge distributions. A fully differential 4-wire SiPM pre-amplifier with separated tracks for the bias voltage and with good common-mode noise suppression was developed and successfully tested. To achieve highest single-pixel resolutions an online after-pulse and pile-up suppression was realized with fast readout electronics based on digital filters.

  15. Merlin: a fast versatile readout system for Medipix3

    NASA Astrophysics Data System (ADS)

    Plackett, R.; Horswell, I.; Gimenez, E. N.; Marchal, J.; Omar, D.; Tartoni, N.

    2013-01-01

    This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in `pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

  16. A CMOS Active Pixel Sensor for Charged Particle Detection

    SciTech Connect

    Matis, Howard S.; Bieser, Fred; Kleinfelder, Stuart; Rai, Gulshan; Retiere, Fabrice; Ritter, Hans George; Singh, Kunal; Wurzel, Samuel E.; Wieman, Howard; Yamamoto, Eugene

    2002-12-02

    Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 {micro}m. Each array is divided into sub-arrays in which different sensor structures (4 in the first version and 16 in the second) and/or readout circuits are employed. Measurements of several of these structures under Fe{sup 55} exposure are reported. The sensors have also been irradiated by 55 MeV protons to test for radiation damage. The radiation increased the noise and reduced the signal. The noise can be explained by shot noise from the increased leakage current and the reduction in signal is due to charge being trapped in the epi layer. Nevertheless, the radiation effect is small for the expected exposures at RHIC and RHIC II. Finally, we describe our concept for mechanically supporting a thin silicon wafer in an actual detector.

  17. Pixelated transmission-mode diamond X-ray detector.

    PubMed

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-11-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60-100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼ 1 kHz, which leads to an image sampling rate of ∼ 30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5-15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10(-2) to 90 W mm(-2). Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  18. Pixelated transmission-mode diamond X-ray detector

    SciTech Connect

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-09-29

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ~1 kHz, which leads to an image sampling rate of ~30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10-2to 90 W mm-2. Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  19. Pixel Hybridization Technologies for the HL-LHC

    NASA Astrophysics Data System (ADS)

    Alimonti, G.; Biasotti, M.; Ceriale, V.; Darbo, G.; Gariano, G.; Gaudiello, A.; Gemme, C.; Rossi, L.; Rovani, A.; Ruscino, E.

    2016-12-01

    During the 2024-2025 shut-down, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity up to 7×1034 cm-2s-1. This upgrade of the collider is called High-Luminosity LHC (HL-LHC). ATLAS and CMS detectors will be upgraded to meet the new challenges of HL-LHC: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000 fb-1 over ten years. In particular, the current trackers will be completely replaced. In HL-LHC the trackers should operate under high fluences (up to 1.4 × 1016 neq cm-2), with a correlated high radiation damage. The pixel detectors, the innermost part of the trackers, needed a completely new design in the readout electronics, sensors and interconnections. A new 65 nm front-end (FE) electronics is being developed by the RD53 collaboration compatible with smaller pixel sizes than the actual ones to cope with the high track densities. Consequently the bump density will increase up to 4 ·104 bumps/cm2. Preliminary results of two hybridization technologies study are presented in this paper. In particular, the on-going bump-bonding qualification program at Leonardo-Finmeccanica is discussed, together with alternative hybridization techniques, as the capacitive coupling for HV-CMOS detectors.

  20. Pixelated transmission-mode diamond X-ray detector

    PubMed Central

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-01-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼1 kHz, which leads to an image sampling rate of ∼30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10−2 to 90 W mm−2. Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%). PMID:26524304

  1. SAR Image Complex Pixel Representations

    SciTech Connect

    Doerry, Armin W.

    2015-03-01

    Complex pixel values for Synthetic Aperture Radar (SAR) images of uniform distributed clutter can be represented as either real/imaginary (also known as I/Q) values, or as Magnitude/Phase values. Generally, these component values are integers with limited number of bits. For clutter energy well below full-scale, Magnitude/Phase offers lower quantization noise than I/Q representation. Further improvement can be had with companding of the Magnitude value.

  2. Single-pixel hyperspectral imaging

    NASA Astrophysics Data System (ADS)

    Suo, Jinli; Wang, Yuwang; Bian, Liheng; Dai, Qionghai

    2016-10-01

    Conventional multispectral imaging methods detect photons of a 3D hyperspectral data cube separately either in the spatial or spectral dimension using array detectors, and are thus photon inefficient and spectrum range limited. Besides, they are usually bulky and highly expensive. To address these issues, this paper presents single-pixel multispectral imaging techniques, which are of high sensitivity, wide spectrum range, low cost and light weight. Two mechanisms are proposed, and experimental validation are also reported.

  3. Characterization of CMOS Active Pixel Sensors for particle detection: Beam test of the four-sensors RAPS03 stacked system

    NASA Astrophysics Data System (ADS)

    Passeri, Daniele; Servoli, Leonello; Biagetti, Daniele; Meroli, Stefano

    2010-05-01

    In this work, in order to check the suitability of CMOS Active Pixel Sensors (APS) detectors for vertexing/tracking applications, four stacked CMOS APS sensors featuring 256×256 pixels with 10×10 μm 2 size have been tested at the INFN Beam Test Facility (BFT), Frascati (Rome). For this purpose, a dedicated mechanical and electrical set-up has been devised and implemented, allowing for the simultaneous read-out of four sensors arranged in a stacked structure. A compact and fast system (up to 64 MHz read-out clock) based on external ADCs and FPGA allows for the PC communication through USB2.0. Preliminary results in terms of track reconstructions of electrons of different energies (up to 496 MeV) are presented. This work has been carried out within the framework of the SHARPS project, supported by INFN.

  4. CMOS digital pixel sensors: technology and applications

    NASA Astrophysics Data System (ADS)

    Skorka, Orit; Joseph, Dileepan

    2014-04-01

    CMOS active pixel sensor technology, which is widely used these days for digital imaging, is based on analog pixels. Transition to digital pixel sensors can boost signal-to-noise ratios and enhance image quality, but can increase pixel area to dimensions that are impractical for the high-volume market of consumer electronic devices. There are two main approaches to digital pixel design. The first uses digitization methods that largely rely on photodetector properties and so are unique to imaging. The second is based on adaptation of a classical analog-to-digital converter (ADC) for in-pixel data conversion. Imaging systems for medical, industrial, and security applications are emerging lower-volume markets that can benefit from these in-pixel ADCs. With these applications, larger pixels are typically acceptable, and imaging may be done in invisible spectral bands.

  5. Voltage injection and readout method for PCB (printed circuit board) testing

    NASA Astrophysics Data System (ADS)

    Zentai, G.

    2006-03-01

    The main objectives of PCB (Printed Circuit Board) testing are to find short and open circuits before attaching components to the PCB. An electrostatic imaging technique was described earlier by Zentai at al. in the SPIE-NDE 2003 conference and has been accepted as a US patent. The main goal of that application was to test the PCBs quickly and efficiently without attaching test probes to each of the traces. It was achieved with the proposed technique. However, we still had to use test probe matrix for generating test signals in the traces and the detected signal was greatly reduced in reference to the test signal because of capacitive sharing of charges caused by the insulator layer placed between the PCB and the TFT sensor array. A new idea has been developed for applying voltages to the traces with an addressing matrix, different from the pin addressing one. This matrix is similar to the readout matrix that the previous method referenced to, but instead of readout circuits, driver circuits are connected to the pixels to apply voltages to them. The printed circuit board is laid on top of the array, but rather than using an insulator foil, a directional conducting foam (rubber) layer can be applied between the excitation matrix (array) and the PCB. We get direct coupling of the matrix pixels to the PCB traces and no connection between neighboring pixels (traces) using the directional conductive layer, which conducts only in z direction and not in x (and y) direction. Therefore, by addressing each pixel separately, which is easy to do by software, we get an addressable voltage (pulse) injector matrix. The same directional conducting foam coupling can also be used for reading out the image of traces. Because the capacitive coupling is eliminated, the detected signal increases and so the sensitivity.

  6. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M (Inventor); Hancock, Bruce R. (Inventor)

    2013-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  7. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M. (Inventor); Hancock, Bruce R. (Inventor)

    2017-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  8. Prototypes and system test stands for the Phase 1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Hasegawa, S.

    2016-09-01

    The CMS pixel phase-1 upgrade project replaces the current pixel detector with an upgraded system with faster readout electronics during the extended year-end technical stop of 2016/2017. New electronics prototypes for the system have been developed, and tests in a realistic environment for a comprehensive evaluation are needed. A full readout test stand with either the same hardware as used in the current CMS pixel detector or the latest prototypes of upgrade electronics has been built. The setup enables the observation and investigation of a jitter increase in the data line associated with trigger rate increases. This effect is due to the way in which the clock and trigger distribution is implemented in CMS. A new prototype of the electronics with a PLL based on a voltage controlled quartz crystal oscillator (QPLL), which works as jitter filter, in the clock distribution path was produced. With the test stand, it was confirmed that the jitter increase is not seen with the prototype, and also good performance was confirmed at the expected detector operation temperature (-20 °C).

  9. Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging

    PubMed Central

    Resetar, Tomislav; De Munck, Koen; Haspeslagh, Luc; Rosmeulen, Maarten; Süss, Andreas; Puers, Robert; Van Hoof, Chris

    2016-01-01

    This work explores the benefits of linear-mode avalanche photodiodes (APDs) in high-speed CMOS imaging as compared to different approaches present in literature. Analysis of APDs biased below their breakdown voltage employed in single-photon counting mode is also discussed, showing a potentially interesting alternative to existing Geiger-mode APDs. An overview of the recently presented gated pinned avalanche photodiode pixel concept is provided, as well as the first experimental results on a 8 × 16 pixel test array. Full feasibility of the proposed pixel concept is not demonstrated; however, informative data is obtained from the sensor operating under −32 V substrate bias and clearly exhibiting wavelength-dependent gain in frontside illumination. The readout of the chip designed in standard 130 nm CMOS technology shows no dependence on the high-voltage bias. Readout noise level of 15 e- rms, full well capacity of 8000e-, and the conversion gain of 75 µV/e- are extracted from the photon-transfer measurements. The gain characteristics of the avalanche junction are characterized on separate test diodes showing a multiplication factor of 1.6 for red light in frontside illumination. PMID:27537882

  10. The BTeV pixel and microstrip detector

    SciTech Connect

    Simon W Kwan

    2003-06-04

    The BTeV pixel detector is one of the most crucial elements in the BTeV experiment. While the pixel detector is technically challenging, we have made great progress towards identifying viable solutions for individual components of the system. The forward silicon tracker is based on more mature technology and its design has benefited from the experience of other experiments. Nevertheless, we have started an R&D program on the forward silicon tracker and first results are expected some time next year.

  11. The DEPFET Sensor-Amplifier Structure: A Method to Beat 1/f Noise and Reach Sub-Electron Noise in Pixel Detectors

    PubMed Central

    Lutz, Gerhard; Porro, Matteo; Aschauer, Stefan; Wölfel, Stefan; Strüder, Lothar

    2016-01-01

    Depleted field effect transistors (DEPFET) are used to achieve very low noise signal charge readout with sub-electron measurement precision. This is accomplished by repeatedly reading an identical charge, thereby suppressing not only the white serial noise but also the usually constant 1/f noise. The repetitive non-destructive readout (RNDR) DEPFET is an ideal central element for an active pixel sensor (APS) pixel. The theory has been derived thoroughly and results have been verified on RNDR-DEPFET prototypes. A charge measurement precision of 0.18 electrons has been achieved. The device is well-suited for spectroscopic X-ray imaging and for optical photon counting in pixel sensors, even at high photon numbers in the same cell. PMID:27136549

  12. Preliminary test results of a new high-energy-resolution silicon and CdZnTe pixel detectors for application to x-ray astronomy

    NASA Astrophysics Data System (ADS)

    Sushkov, V. V.; Hamilton, William J.; Hurley, Kevin; Maeding, Dale G.; Ogelman, Hakki; Paulos, Robert J.; Puetter, Richard C.; Tumer, Tumay O.; Zweerink, Jeffrey

    1999-10-01

    New, high spatial resolution CdZnTe (CZT) and silicon (Si) pixel detectors are highly suitable for x-ray astronomy. These detectors are planned for use in wide field of view, imaging x-ray, and low energy gamma-ray all-sky monitor (AXGAM) in a future space mission. The high stopping power of CZT detectors combined with low-noise front-end readout makes possible an order of magnitude improvement in spatial and energy resolution in x-ray detection. The AXGAM instrument will be built in the form of a fine coded aperture placed over two-dimensional, high spatial resolution and low energy threshold CZT pixel detector array. The preliminary result of CZT and silicon pixel detector test with low-noise readout electronics system are presented. These detectors may also be used with or without modification for medical and industrial imaging.

  13. Trimming the threshold dispersion below 10 e-rms in a large area readout IC working in a single photon counting mode

    NASA Astrophysics Data System (ADS)

    Kmon, P.; Maj, P.; Gryboś, P.; Szczygieł, R.

    2016-01-01

    We present a new method of an in-pixel threshold dispersion correction implemented in a prototype readout integrated circuit (IC) operating in a single photon counting mode. The new threshold correction method was implemented in a readout IC of area 9.6× 14.9 mm2 containing 23552 square pixels with the pitch of 75 μm designed and fabricated in CMOS 130 nm technology. Each pixel of the IC consists of a charge sensitive amplifier, a shaper, two discriminators, two 14-bit counters and a low-area trim DACs for threshold correction. The user can either control the range of the trim DAC globally for all the pixels in the integrated circuit or modify the trim DACs characteristics locally in each pixel independently. Using a simulation tool based on the Monte-Carlo methods, we estimated how much we could improve the offset trimming by increasing the number of bits in the trim DACs or implementing additional bits in a pixel to modify the characteristics of the trim DACs. The measurements of our IC prototype show that it is possible to reduce the effective threshold dispersion in large-area single-photon counting chips below 10 electrons rms.

  14. A new generation of small pixel pitch/SWaP cooled infrared detectors

    NASA Astrophysics Data System (ADS)

    Espuno, L.; Pacaud, O.; Reibel, Y.; Rubaldo, L.; Kerlain, A.; Péré-Laperne, N.; Dariel, A.; Roumegoux, J.; Brunner, A.; Kessler, A.; Gravrand, O.; Castelein, P.

    2015-10-01

    Following clear technological trends, the cooled IR detectors market is now in demand for smaller, more efficient and higher performance products. This demand pushes products developments towards constant innovations on detectors, read-out circuits, proximity electronics boards, and coolers. Sofradir was first to show a 10μm focal plane array (FPA) at DSS 2012, and announced the DAPHNIS 10μm product line back in 2014. This pixel pitch is a key enabler for infrared detectors with increased resolution. Sofradir recently achieved outstanding products demonstrations at this pixel pitch, which clearly demonstrate the benefits of adopting 10μm pixel pitch focal plane array-based detectors. Both HD and XGA Daphnis 10μm products also benefit from a global video datapath efficiency improvement by transitioning to digital video interfaces. Moreover, innovative smart pixels functionalities drastically increase product versatility. In addition to this strong push towards a higher pixels density, Sofradir acknowledges the need for smaller and lower power cooled infrared detector. Together with straightforward system interfaces and better overall performances, latest technological advances on SWAP-C (Size, Weight, Power and Cost) Sofradir products enable the advent of a new generation of high performance portable and agile systems (handheld thermal imagers, unmanned aerial vehicles, light gimbals etc...). This paper focuses on those features and performances that can make an actual difference in the field.

  15. Direct charge sharing observation in single-photon-counting pixel detector

    NASA Astrophysics Data System (ADS)

    Pellegrini, G.; Maiorino, M.; Blanchot, G.; Chmeissani, M.; Garcia, J.; Lozano, M.; Martinez, R.; Puigdengoles, C.; Ullan, M.

    2007-04-01

    In photon-counting imaging devices, charge sharing can limit the detector spatial resolution and contrast, as multiple counts can be induced in adjacent pixels as a result of the spread of the charge cloud generated from a single X-ray photon of high energy in the detector bulk. Although debated for a long time, the full impact of charge sharing has not been completely assessed. In this work, the importance of charge sharing in pixellated CdTe and silicon detectors is studied by exposing imaging devices to different low activity sources. These devices are made of Si and CdTe pixel detector bump-bonded to Medipix2 single-photon-counting chips with a 55 μm pixel pitch. We will show how charge sharing affects the spatial detector resolution depending on incident particle type (alpha, beta and gamma), detector bias voltage and read-out chip threshold. This study will give an insight on the impact on the design and operation of pixel detectors coupled to photon-counting devices for imaging applications.

  16. Spectral contents readout of birefringent sensor

    NASA Technical Reports Server (NTRS)

    Redner, Alex S.

    1989-01-01

    The technical objective of this research program was to develop a birefringent sensor, capable of measuring strain/stress up to 2000 F and a readout system based on Spectral Contents analysis. As a result of the research work, a data acquisition system was developed, capable of measuring strain birefringence in a sensor at 2000 F, with multi-point static and dynamic capabilities. The system uses a dedicated spectral analyzer for evaluation of stress-birefringence and a PC-based readout. Several sensor methods were evaluated. Fused silica was found most satisfactory. In the final evaluation, measurements were performed up to 2000 F and the system performance exceeded expectations.

  17. Gravity Probe B gyroscope readout system

    NASA Astrophysics Data System (ADS)

    Muhlfelder, B.; Lockhart, J.; Aljabreen, H.; Clarke, B.; Gutt, G.; Luo, M.

    2015-11-01

    We describe the Gravity Probe B London-moment readout system successfully used on-orbit to measure two gyroscope spin axis drift rates predicted by general relativity. The system couples the magnetic signal of a spinning niobium-coated rotor into a low noise superconducting quantum interference device. We describe the multi-layered magnetic shield needed to attenuate external fields that would otherwise degrade readout performance. We discuss the ∼35 nrad/yr drift rate sensitivity that was achieved on-orbit.

  18. Central FPGA-based destination and load control in the LHCb MHz event readout

    NASA Astrophysics Data System (ADS)

    Jacobsson, R.

    2012-10-01

    The readout strategy of the LHCb experiment is based on complete event readout at 1 MHz. A set of 320 sub-detector readout boards transmit event fragments at total rate of 24.6 MHz at a bandwidth usage of up to 70 GB/s over a commercial switching network based on Gigabit Ethernet to a distributed event building and high-level trigger processing farm with 1470 individual multi-core computer nodes. In the original specifications, the readout was based on a pure push protocol. This paper describes the proposal, implementation, and experience of a non-conventional mixture of a push and a pull protocol, akin to credit-based flow control. An FPGA-based central master module, partly operating at the LHC bunch clock frequency of 40.08 MHz and partly at a double clock speed, is in charge of the entire trigger and readout control from the front-end electronics up to the high-level trigger farm. One FPGA is dedicated to controlling the event fragment packing in the readout boards, the assignment of the farm node destination for each event, and controls the farm load based on an asynchronous pull mechanism from each farm node. This dynamic readout scheme relies on generic event requests and the concept of node credit allowing load control and trigger rate regulation as a function of the global farm load. It also allows the vital task of fast central monitoring and automatic recovery in-flight of failing nodes while maintaining dead-time and event loss at a minimum. This paper demonstrates the strength and suitability of implementing this real-time task for a very large distributed system in an FPGA where no random delays are introduced, and where extreme reliability and accurate event accounting are fundamental requirements. It was in use during the entire commissioning phase of LHCb and has been in faultless operation during the first two years of physics luminosity data taking.

  19. Radiation hardness and timing studies of a monolithic TowerJazz pixel design for the new ATLAS Inner Tracker

    NASA Astrophysics Data System (ADS)

    Riegel, C.; Backhaus, M.; Van Hoorne, J. W.; Kugathasan, T.; Musa, L.; Pernegger, H.; Riedler, P.; Schaefer, D.; Snoeys, W.; Wagner, W.

    2017-01-01

    A part of the upcoming HL-LHC upgrade of the ATLAS Detector is the construction of a new Inner Tracker. This upgrade opens new possibilities, but also presents challenges in terms of occupancy and radiation tolerance. For the pixel detector inside the inner tracker, hybrid modules containing passive silicon sensors and connected readout chips are presently used, but require expensive assembly techniques like fine-pitch bump bonding. Silicon devices fabricated in standard commercial CMOS technologies, which include part or all of the readout chain, are also investigated offering a reduced cost as they are cheaper per unit area than traditional silicon detectors. If they contain the full readout chain, as for a fully monolithic approach, there is no need for the expensive flip-chip assembly, resulting in a further cost reduction and material savings. In the outer pixel layers of the ATLAS Inner Tracker, the pixel sensors must withstand non-ionising energy losses of up to 1015 n/cm2 and offer a timing resolution of 25 ns or less. This paper presents test results obtained on a monolithic test chip, the TowerJazz 180nm Investigator, towards these specifications. The presented program of radiation hardness and timing studies has been launched to investigate this technology's potential for the new ATLAS Inner Tracker.

  20. Spectroscopic performance of DEPFET active pixel sensor prototypes suitable for the high count rate Athena WFI detector

    NASA Astrophysics Data System (ADS)

    Müller-Seidlitz, Johannes; Andritschke, Robert; Bähr, Alexander; Meidinger, Norbert; Ott, Sabine; Richter, Rainer H.; Treberspurg, Wolfgang; Treis, Johannes

    2016-07-01

    The focal plane of the WFI of Athena consists of two sensors. One features a large field of view of 40' X 40' and one is forseen to be used for bright point like sources. Both parts base on DEPFET active pixel sensors. To fulfil the count rate requirement for the smaller sensor of less than 1% pile-up for a one Crab source it has to have a sufficient high frame rate. Since therefore the readout becomes a large fraction of the total photon integration time, the probability of measurements with incomplete signals increases. A shutter would solve the problem of these so called misfits but is not in agreement with the required high throughput of more than 80%. The Infinipix design has implemented a storage in addition to separate the collection and the readout of the charges without discarding them. Its working principle was successfully shown by Bähr et al.1 on single pixel level. For the further development three layout variants were tested on a 32 X 32 pixel array scale. The measurements of the spectroscopic performance show very promising results even for the intended readout speed for the Athena WFI of 2:5 μs per sensor row. Although, there are still layout and technology improvements necessary to ensure the reliability needed for space missions. In this paper we present the measurement results on the comparison of the three prototype layout variants.

  1. Characterisation of the NA62 GigaTracker end of column readout ASIC

    NASA Astrophysics Data System (ADS)

    Noy, M.; Aglieri Rinella, G.; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Perktold, L.; Riedler, P.

    2011-01-01

    The architecture and characterisation of the End Of Column demonstrator readout ASIC for the NA62 GigaTracker hybrid pixel detector is presented. This ASIC serves as a proof of principle for a pixel chip with 1800 pixels which must perform time stamping to better than 200 ps (RMS), provide 300 μm pitch position information and operate with a dead-time of 1% or less for 800 MHz-1 GHz beam rate. The demonstrator ASIC comprises a full test column with 45 pixels alongside other test structures. The timewalk correction mechanism employed is measurement of the time-over-threshold, coupled with an off-detector look-up table. The time to digital converter is a delay locked loop with 32 contributing delay cells fed with a 320 MHz to yield a nominal bin size of 97 ps. Recently, P-in-N sensors have been bump-bonded to the ASIC and characterisation of these assemblies has begun.

  2. Making a trillion pixels dance

    NASA Astrophysics Data System (ADS)

    Singh, Vivek; Hu, Bin; Toh, Kenny; Bollepalli, Srinivas; Wagner, Stephan; Borodovsky, Yan

    2008-03-01

    In June 2007, Intel announced a new pixelated mask technology. This technology was created to address the problem caused by the growing gap between the lithography wavelength and the feature sizes patterned with it. As this gap has increased, the quality of the image has deteriorated. About a decade ago, Optical Proximity Correction (OPC) was introduced to bridge this gap, but as this gap continued to increase, one could not rely on the same basic set of techniques to maintain image quality. The computational lithography group at Intel sought to alleviate this problem by experimenting with additional degrees of freedom within the mask. This paper describes the resulting pixelated mask technology, and some of the computational methods used to create it. The first key element of this technology is a thick mask model. We realized very early in the development that, unlike traditional OPC methods, the pixelated mask would require a very accurate thick mask model. Whereas in the traditional methods, one can use the relatively coarse approximations such as the boundary layer method, use of such techniques resulted not just in incorrect sizing of parts of the pattern, but in whole features missing. We built on top of previously published domain decomposition methods, and incorporated limitations of the mask manufacturing process, to create an accurate thick mask model. Several additional computational techniques were invoked to substantially increase the speed of this method to a point that it was feasible for full chip tapeout. A second key element of the computational scheme was the comprehension of mask manufacturability, including the vital issue of the number of colors in the mask. While it is obvious that use of three or more colors will give the best image, one has to be practical about projecting mask manufacturing capabilities for such a complex mask. To circumvent this serious issue, we eventually settled on a two color mask - comprising plain glass and etched

  3. Optimization of thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Beyer, J.; La Rosa, A.; Nisius, R.; Savic, N.

    2017-01-01

    The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system. Thin planar pixel sensors are promising candidates to instrument the innermost region of the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. The sensors of 50-150 μm thickness, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests. In particular active edge sensors have been investigated. The performance of two different versions of edge designs are compared: the first with a bias ring, and the second one where only a floating guard ring has been implemented. The hit efficiency at the edge has also been studied after irradiation at a fluence of 1015 neq/cm2. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50x50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angles with respect to the short pixel direction. Results on the hit efficiency in this configuration are discussed for different sensor thicknesses.

  4. Improved Design of Active Pixel CMOS Sensors for Charged Particle Detection

    SciTech Connect

    Deptuch, Grzegorz

    2007-11-12

    The Department of Energy (DOE) nuclear physics program requires developments in detector instrumentation electronics with improved energy, position and timing resolution, sensitivity, rate capability, stability, dynamic range, and background suppression. The current Phase-I project was focused on analysis of standard-CMOS photogate Active Pixel Sensors (APS) as an efficient solution to this challenge. The advantages of the CMOS APS over traditional hybrid approaches (i.e., separate detection regions bump-bonded to readout circuits) include greatly reduced cost, low power and the potential for vastly larger pixel counts and densities. However, challenges remain in terms of the signal-to-noise ratio (SNR) and readout speed (currently on the order of milliseconds), which is the major problem for this technology. Recent work has shown that the long readout time for photogate APS is due to the presence of (interface) traps at the semiconductor-oxide interface. This Phase-I work yielded useful results in two areas: (a) Advanced three-dimensional (3D) physics-based simulation models and simulation-based analysis of the impact of interface trap density on the transient charge collection characteristics of existing APS structures; and (b) Preliminary analysis of the feasibility of an improved photogate pixel structure (i.e., new APS design) with an induced electric field under the charge collecting electrode to enhance charge collection. Significant effort was dedicated in Phase-I to the critical task of implementing accurate interface trap models in CFDRC's NanoTCAD 3D semiconductor device-physics simulator. This resulted in validation of the new NanoTCAD models and simulation results against experimental (published) data, within the margin of uncertainty associated with obtaining device geometry, material properties, and experimentation details. Analyses of the new, proposed photogate APS design demonstrated several promising trends.

  5. TFT-Based Active Pixel Sensors for Large Area Thermal Neutron Detection

    NASA Astrophysics Data System (ADS)

    Kunnen, George

    Due to diminishing availability of 3He, which is the critical component of neutron detecting proportional counters, large area flexible arrays are being considered as a potential replacement for neutron detection. A large area flexible array, utilizing semiconductors for both charged particle detection and pixel readout, ensures a large detection surface area in a light weight rugged form. Such a neutron detector could be suitable for deployment at ports of entry. The specific approach used in this research, uses a neutron converter layer which captures incident thermal neutrons, and then emits ionizing charged particles. These ionizing particles cause electron-hole pair generation within a single pixel's integrated sensing diode. The resulting charge is then amplified via a low-noise amplifier. This document begins by discussing the current state of the art in neutron detection and the associated challenges. Then, for the purpose of resolving some of these issues, recent design and modeling efforts towards developing an improved neutron detection system are described. Also presented is a low-noise active pixel sensor (APS) design capable of being implemented in low temperature indium gallium zinc oxide (InGaZnO) or amorphous silicon (a-Si:H) thin film transistor process compatible with plastic substrates. The low gain and limited scalability of this design are improved upon by implementing a new multi-stage self-resetting APS. For each APS design, successful radiation measurements are also presented using PiN diodes for charged particle detection. Next, detection array readout methodologies are modeled and analyzed, and use of a matched filter readout circuit is described as well. Finally, this document discusses detection diode integration with the designed TFT-based APSs.

  6. Characterization of double modified internal gate pixel by 3D simulation study

    NASA Astrophysics Data System (ADS)

    Aurola, A.; Marochkin, V.; Tuuva, T.

    2015-01-01

    We have developed a novel detector concept based on Modified Internal Gate Field Effect Transistor (MIGFET) wherein a buried Modified Internal Gate (MIG) is implanted underneath a channel of a FET. In between the MIG and the channel of the FET there is a depleted semiconductor material forming a potential barrier between charges in the channel and similar type signal charges located in the MIG. The signal charges in the MIG have a measurable effect on the conductance of the channel. In this paper a double MIGFET pixel is investigated comprising two MIGFETs. By transferring the signal charges between the two MIGs Non-Destructive Correlated Double Sampling Readout (NDCDSR) is enabled. The proposed MIG radiation detector suits particularly well for low-light-level imaging, X-ray spectroscopy, as well as synchrotron and X-ray Free Electron Laser (XFEL) facilities. The reason for the excellent X-ray detection performance stems from the fact that interface related issues can be considerably mitigated since interface generated dark noise can be completely avoided and interface generated 1/f and Random Telegraph Signal (RTS) noise can be considerably reduced due to a deep buried channel readout configuration. Electrical parameters of the double MIGFET pixel have been evaluated by 3D TCAD simulation study. Simulation results show the absence of interface generated dark noise, significantly reduced interface generated 1/f and RTS noise, well performing NDCDSR operation, and blooming protection due to an inherent vertical anti-blooming structure. In addition, the backside illuminated thick fully depleted pixel design provides a homogeneous radiation entry window, low crosstalk due to lack of diffusion, and good quantum efficiency for low energy X-rays and NIR light. These facts result in excellent Signal-to-Noise Ratio (SNR) and very low crosstalk enabling thus excellent X-ray energy and spatial resolution. The simulation demonstrates the charge to current conversion gain for

  7. Improved Readout For Micromagnet/Hall-Effect Memories

    NASA Technical Reports Server (NTRS)

    Wu, Jiin-Chuan; Stadler, Henry L.; Katti, Romney R.

    1993-01-01

    Two improved readout circuits for micromagnet/Hall-effect random-access memories designed to eliminate current shunts introducing errors into outputs of older readout circuits. Incorporate additional switching transistors to isolate Hall sensors as needed.

  8. USB 3.0 readout and time-walk correction method for Timepix3 detector

    NASA Astrophysics Data System (ADS)

    Turecek, D.; Jakubek, J.; Soukup, P.

    2016-12-01

    The hybrid particle counting pixel detectors of Medipix family are well known. In this contribution we present new USB 3.0 based interface AdvaDAQ for Timepix3 detector. The AdvaDAQ interface is designed with a maximal emphasis to the flexibility. It is successor of FitPIX interface developed in IEAP CTU in Prague. Its modular architecture supports all Medipix/Timepix chips and all their different readout modes: Medipix2, Timepix (serial and parallel), Medipix3 and Timepix3. The high bandwidth of USB 3.0 permits readout of 1700 full frames per second with Timepix or 8 channel data acquisition from Timepix3 at frequency of 320 MHz. The control and data acquisition is integrated in a multiplatform PiXet software (MS Windows, Mac OS, Linux). In the second part of the publication a new method for correction of the time-walk effect in Timepix3 is described. Moreover, a fully spectroscopic X-ray imaging with Timepix3 detector operated in the ToT mode (Time-over-Threshold) is presented. It is shown that the AdvaDAQ's readout speed is sufficient to perform spectroscopic measurement at full intensity of radiographic setups equipped with nano- or micro-focus X-ray tubes.

  9. Validation of a highly integrated SiPM readout system with a TOF-PET demonstrator

    NASA Astrophysics Data System (ADS)

    Niknejad, T.; Setayeshi, S.; Tavernier, S.; Bugalho, R.; Ferramacho, L.; Di Francesco, A.; Leong, C.; Rolo, M. D.; Shamshirsaz, M.; Silva, J. C.; Silva, R.; Silveira, M.; Zorraquino, C.; Varela, J.

    2016-12-01

    We have developed a highly integrated, fast and compact readout electronics for Silicon Photomultiplier (SiPM) based Time of Flight Positron Emission Tomography (TOF-PET) scanners. The readout is based on the use of TOP-PET Application Specific Integrated Circuit (PETsys TOFPET1 ASIC) with 64 channels, each with its amplifier, discriminator, Time to Digital Converter (TDC) and amplitude determination using Time Over Threshold (TOT). The ASIC has 25 ps r.m.s. intrinsic time resolution and fully digital output. The system is optimised for high rates, good timing, low power consumption and low cost. For validating the readout electronics, we have built a technical PET scanner, hereafter called ``demonstrator'', with 2'048 SiPM channels. The PET demonstrator has 16 compact Detector Modules (DM). Each DM has two ASICs reading 128 SiPM pixels in one-to-one coupling to 128 Lutetium Yttrium Orthosilicate (LYSO) crystals measuring 3.1 × 3.1 × 15 mm3 each. The data acquisition system for the demonstrator has two Front End Boards type D (FEB/D), each collecting the data of 1'024 channels (8 DMs), and transmitting assembled data frames through a serial link (4.8 Gbps), to a single Data Acquisition (DAQ) board plugged into the Peripheral Component Interconnect Express (PCIe) bus of the data acquisition PC. Results obtained with this PET demonstrator are presented.

  10. Fully 3D-Integrated Pixel Detectors for X-Rays

    SciTech Connect

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; Grybos, Pawel; Holm, Scott; Lipton, Ronald; Maj, Piotr; Patti, Robert; Siddons, David Peter; Szczygiel, Robert; Yarema, Raymond

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch, yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.

  11. Implementation of pixel level digital TDI for scanning type LWIR FPAs

    NASA Astrophysics Data System (ADS)

    Ceylan, Omer; Kayahan, Huseyin; Yazici, Melik; Afridi, Sohaib; Shafique, Atia; Gurbuz, Yasar

    2014-07-01

    Implementation of a CMOS digital readout integrated circuit (DROIC) based on pixel level digital time delay integration (TDI) for scanning type LWIR focal plane arrays (FPAs) is presented. TDI is implemented on 8 pixels with over sampling rate of 3. Analog signal integrated on integration capacitor is converted to digital domain in pixel, and digital data is transferred to TDI summation counters, where contributions of 8 pixels are added. Output data is 16 bit, where 8 bits are allocated for most significant bits and 8 bits for least significant bits. Control block of the ROIC, which is responsible of generating timing diagram for switches controlling the pixels and summation counters, is realized with VerilogHDL. Summation counters and parallel-to-serial converter to convert 16 bit parallel output data to single bit output are also realized with Verilog HDL. Synthesized verilog netlists are placed&routed and combined with analog under-pixel part of the design. Quantization noise of analog-to-digital conversion is less than 500e-. Since analog signal is converted to digital domain in-pixel, inaccuracies due to analog signal routing over large chip area is eliminated. ROIC is fabricated with 0.18μm CMOS process and chip area is 10mm2. Post-layout simulation results of the implemented design are presented. ROIC is programmable through serial or parallel interface. Input referred noise of ROIC is less than 750 rms electron, while power consumption is less than 30mW. ROIC is designed to perform in cryogenic temperatures.

  12. Fully 3D-Integrated Pixel Detectors for X-Rays

    DOE PAGES

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; ...

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.« less

  13. A microstrip detector with delay line readout

    SciTech Connect

    Barbosa, A.F. , BP 220, 38043 Grenoble CNPq Riekel, C.; Wattecamps, P. , BP 220, 38043 Grenoble )

    1992-01-01

    Principal limitations of position sensitive gasfilled detectors for x-ray synchrotron radiation applications are the counting rate and the positional resolution. Improvements in both areas are expected with microstrip technology. First results of a linear position sensitive microstrip detector with delay line readout are shown, and the possibility to achieve two-dimensional localization is evaluated.

  14. Raman-based microarray readout: a review.

    PubMed

    Haisch, Christoph

    2016-07-01

    For a quarter of a century, microarrays have been part of the routine analytical toolbox. Label-based fluorescence detection is still the commonest optical readout strategy. Since the 1990s, a continuously increasing number of label-based as well as label-free experiments on Raman-based microarray readout concepts have been reported. This review summarizes the possible concepts and methods and their advantages and challenges. A common label-based strategy is based on the binding of selective receptors as well as Raman reporter molecules to plasmonic nanoparticles in a sandwich immunoassay, which results in surface-enhanced Raman scattering signals of the reporter molecule. Alternatively, capture of the analytes can be performed by receptors on a microarray surface. Addition of plasmonic nanoparticles again leads to a surface-enhanced Raman scattering signal, not of a label but directly of the analyte. This approach is mostly proposed for bacteria and cell detection. However, although many promising readout strategies have been discussed in numerous publications, rarely have any of them made the step from proof of concept to a practical application, let alone routine use. Graphical Abstract Possible realization of a SERS (Surface-Enhanced Raman Scattering) system for microarray readout.

  15. PANDA straw tube detectors and readout

    NASA Astrophysics Data System (ADS)

    Strzempek, P.

    2016-07-01

    PANDA is a detector under construction dedicated to studies of production and interaction of particles in the charmonium mass range using antiproton beams in the momentum range of 1.5 - 15 GeV/c at the Facility for Antiproton and Ion Research (FAIR) in Darmstadt. PANDA consists of two spectrometers: a Target Spectrometer with a superconducting solenoid and a Forward Spectrometer using a large dipole magnet and covering the most forward angles (Θ < 10 °). In both spectrometers, the particle's trajectories in the magnetic field are measured using self-supporting straw tube detectors. The expected high count rates, reaching up to 1 MHz/straw, are one of the main challenges for the detectors and associated readout electronics. The paper presents the readout chain of the tracking system and the results of tests performed with realistic prototype setups. The readout chain consists of a newly developed ASIC chip (PASTTREC < PANDASTTReadoutChip >) with amplification, signal shaping, tail cancellation, discriminator stages and Time Readout Boards as digitizer boards.

  16. Microwave multiplex readout for superconducting sensors

    NASA Astrophysics Data System (ADS)

    Ferri, E.; Becker, D.; Bennett, D.; Faverzani, M.; Fowler, J.; Gard, J.; Giachero, A.; Hays-Wehle, J.; Hilton, G.; Maino, M.; Mates, J.; Puiu, A.; Nucciotti, A.; Reintsema, C.; Schmidt, D.; Swetz, D.; Ullom, J.; Vale, L.

    2016-07-01

    The absolute neutrino mass scale is still an outstanding challenge in both particle physics and cosmology. The calorimetric measurement of the energy released in a nuclear beta decay is a powerful tool to determine the effective electron-neutrino mass. In the last years, the progress on low temperature detector technologies has allowed to design large scale experiments aiming at pushing down the sensitivity on the neutrino mass below 1 eV. Even with outstanding performances in both energy ( eV on keV) and time resolution ( 1 μs) on the single channel, a large number of detectors working in parallel is required to reach a sub-eV sensitivity. Microwave frequency domain readout is the best available technique to readout large array of low temperature detectors, such as Transition Edge Sensors (TESs) or Microwave Kinetic Inductance Detectors (MKIDs). In this way a multiplex factor of the order of thousands can be reached, limited only by the bandwidth of the available commercial fast digitizers. This microwave multiplexing system will be used to readout the HOLMES detectors, an array of 1000 microcalorimeters based on TES sensors in which the 163Ho will be implanted. HOLMES is a new experiment for measuring the electron neutrino mass by means of the electron capture (EC) decay of 163Ho. We present here the microwave frequency multiplex which will be used in the HOLMES experiment and the microwave frequency multiplex used to readout the MKID detectors developed in Milan as well.

  17. Daily weather direct readout microprocessor study

    NASA Technical Reports Server (NTRS)

    Davisson, L. D.; Davisson, J. B.

    1976-01-01

    The work completed included a study of the requirements and hardware and software implementation techniques for NIMBUS ESMR and TWERLE direct readout applications using microprocessors. Many microprocessors were studied for this application. Because of the available Interdata development capabilities, it was concluded that future implementations be on an Interdata microprocessor which was found adequate for the task.

  18. ATLAS pixel IBL modules construction experience and developments for future upgrade

    NASA Astrophysics Data System (ADS)

    Gaudiello, A.

    2015-10-01

    The first upgrade of the ATLAS Pixel Detector is the Insertable B-Layer (IBL), installed in May 2014 in the core of ATLAS. Two different silicon sensor technologies, planar n-in-n and 3D, are used. Sensors are connected with the new generation 130 nm IBM CMOS FE-I4 read-out chip via solder bump-bonds. Production quality control tests were set up to verify and rate the performance of the modules before integration into staves. An overview of module design and construction, the quality control results and production yield will be discussed, as well as future developments foreseen for future detector upgrades.

  19. Development of CMOS Active Pixel Image Sensors for Low Cost Commercial Applications

    NASA Technical Reports Server (NTRS)

    Gee, R.; Kemeny, S.; Kim, Q.; Mendis, S.; Nakamura, J.; Nixon, R.; Ortiz, M.; Pain, B.; Staller, C.; Zhou, Z; Fossum, E.

    1994-01-01

    JPL, under sponsorship from the NASA Office of Advanced Concepts and Technology, has been developing a second-generation solid-state image sensor technology. Charge-coupled devices (CCD) are a well-established first generation image sensor technology. For both commercial and NASA applications, CCDs have numerous shortcomings. In response, the active pixel sensor (APS) technology has been under research. The major advantages of APS technology are the ability to integrate on-chip timing, control, signal-processing and analog-to-digital converter functions, reduced sensitivity to radiation effects, low power operation, and random access readout.

  20. A fast embedded readout system for large-area Medipix and Timepix systems

    NASA Astrophysics Data System (ADS)

    Brogna, A. S.; Balzer, M.; Smale, S.; Hartmann, J.; Bormann, D.; Hamann, E.; Cecilia, A.; Zuber, M.; Koenig, T.; Zwerger, A.; Weber, M.; Fiederle, M.; Baumbach, T.

    2014-05-01

    In this work we present a novel readout electronics for an X-ray sensor based on a Si crystal bump-bonded to an array of 3 × 2 Medipix ASICs. The pixel size is 55 μm × 55 μm with a total number of ~ 400k pixels and a sensitive area of 42 mm × 28 mm. The readout electronics operate Medipix-2 MXR or Timepix ASICs with a clock speed of 125 MHz. The data acquisition system is centered around an FPGA and each of the six ASICs has a dedicated I/O port for simultaneous data acquisition. The settings of the auxiliary devices (ADCs and DACs) are also processed in the FPGA. Moreover, a high-resolution timer operates the electronic shutter to select the exposure time from 8 ns to several milliseconds. A sophisticated trigger is available in hardware and software to synchronize the acquisition with external electro-mechanical motors. The system includes a diagnostic subsystem to check the sensor temperature and to control the cooling Peltier cells and a programmable high-voltage generator to bias the crystal. A network cable transfers the data, encapsulated into the UDP protocol and streamed at 1 Gb/s. Therefore most notebooks or personal computers are able to process the data and to program the system without a dedicated interface. The data readout software is compatible with the well-known Pixelman 2.x running both on Windows and GNU/Linux. Furthermore the open architecture encourages users to write their own applications. With a low-level interface library which implements all the basic features, a MATLAB or Python script can be implemented for special manipulations of the raw data. In this paper we present selected images taken with a microfocus X-ray tube to demonstrate the capability to collect the data at rates up to 120 fps corresponding to 0.76 Gb/s.

  1. Reduction of cross-talks between circuit and sensor layer in the Kyoto's X-ray astronomy SOI pixel sensors with Double-SOI wafer

    NASA Astrophysics Data System (ADS)

    Ohmura, Shunichi; Tsuru, Takeshi Go; Tanaka, Takaaki; Uchida, Hiroyuki; Takeda, Ayaki; Matsumura, Hideaki; Ito, Makoto; Arai, Yasuo; Kurachi, Ikuo; Miyoshi, Toshinobu; Nakashima, Shinya; Mori, Koji; Nishioka, Yusuke; Takebayashi, Nobuaki; Noda, Koki; Kohmura, Takayoshi; Tamasawa, Kouki; Ozawa, Yusuke; Sato, Tadashi; Konno, Takahiro; Kawahito, Shoji; Kagawa, Keiichiro; Yasutomi, Keita; Kamehama, Hiroki; Shrestha, Sumeet; Hara, Kazuhiko; Honda, Shunsuke

    2016-09-01

    We have been developing silicon-on-insulator pixel sensors, "XRPIXs," for future X-ray astronomy satellites. XRPIXs are equipped with a function of "event-driven readout," with which we can read out only hit pixels by trigger signals and hence realize good time resolution reaching ∼ 10 μs . The current version of XRPIX suffers from a problem that the spectral performance degrades in the event-driven readout mode compared to the frame-readout mode, in which all the pixels are read out serially. Previous studies have clarified that one of the causes is capacitive coupling between the sense node and the trigger signal line in the circuit layer. In order to solve the problem, we adopt the Double SOI structure having a middle silicon layer between the circuit and the sensor layers. We expect the middle silicon layer to work as an electrostatic shield and reduces the capacitive coupling. In this paper, we report the spectroscopic performance of XRPIX with the middle silicon layer. We successfully reduce the capacitive coupling and the readout noise.

  2. Design and performance of a modular low-radioactivity readout system for cryogenic detectors in the CDMS experiment

    NASA Astrophysics Data System (ADS)

    Akerib, D. S.; Barnes, P. D., Jr.; Brink, P. L.; Cabrera, B.; Clarke, R. M.; Gaitskell, R. J.; Golwala, S. R.; Huber, M. E.; Kurylowicz, M.; Mandic, V.; Martinis, J. M.; Meunier, P.; Mirabolfathi, N.; Nam, S. W.; Perillo-Isaac, M.; Saab, T.; Sadoulet, B.; Schnee, R. W.; Seitz, D. N.; Shutt, T.; Smith, G. W.; Stockwell, W. K.; Sundqvist, K. M.; White, S.

    2008-07-01

    The Cryogenic Dark Matter Search (CDMS) experiment employs ultra-cold solid-state detectors to search for rare events resulting from WIMP-nucleus scattering. An innovative detector packaging and readout system has been developed to meet the unusual combination of requirements for: low temperature, low radioactivity, low energy threshold, and large channel count. Features include use of materials with low radioactivity such as multi-layer KAPTON laminates for circuit boards; immunity to microphonic noise via a vacuum coaxial wiring design, manufacturability, and modularity. The detector readout design had to accommodate various electronic components which have to be operated in close proximity to the detector as well maintaining separate individual temperatures (ranging from 600 mK to 150 K) in order to achieve optimal noise performance. The paper will describe the general electrical, thermal, and mechanical designs of the CDMS readout system, as well as presenting the theoretical and measured performance of the detector readout channels.

  3. Noise Reduction Effect of Multiple-Sampling-Based Signal-Readout Circuits for Ultra-Low Noise CMOS Image Sensors

    PubMed Central

    Kawahito, Shoji; Seo, Min-Woong

    2016-01-01

    This paper discusses the noise reduction effect of multiple-sampling-based signal readout circuits for implementing ultra-low-noise image sensors. The correlated multiple sampling (CMS) technique has recently become an important technology for high-gain column readout circuits in low-noise CMOS image sensors (CISs). This paper reveals how the column CMS circuits, together with a pixel having a high-conversion-gain charge detector and low-noise transistor, realizes deep sub-electron read noise levels based on the analysis of noise components in the signal readout chain from a pixel to the column analog-to-digital converter (ADC). The noise measurement results of experimental CISs are compared with the noise analysis and the effect of noise reduction to the sampling number is discussed at the deep sub-electron level. Images taken with three CMS gains of two, 16, and 128 show distinct advantage of image contrast for the gain of 128 (noise(median): 0.29 e−rms) when compared with the CMS gain of two (2.4 e−rms), or 16 (1.1 e−rms). PMID:27827972

  4. Noise Reduction Effect of Multiple-Sampling-Based Signal-Readout Circuits for Ultra-Low Noise CMOS Image Sensors.

    PubMed

    Kawahito, Shoji; Seo, Min-Woong

    2016-11-06

    This paper discusses the noise reduction effect of multiple-sampling-based signal readout circuits for implementing ultra-low-noise image sensors. The correlated multiple sampling (CMS) technique has recently become an important technology for high-gain column readout circuits in low-noise CMOS image sensors (CISs). This paper reveals how the column CMS circuits, together with a pixel having a high-conversion-gain charge detector and low-noise transistor, realizes deep sub-electron read noise levels based on the analysis of noise components in the signal readout chain from a pixel to the column analog-to-digital converter (ADC). The noise measurement results of experimental CISs are compared with the noise analysis and the effect of noise reduction to the sampling number is discussed at the deep sub-electron level. Images taken with three CMS gains of two, 16, and 128 show distinct advantage of image contrast for the gain of 128 (noise(median): 0.29 e(-)rms) when compared with the CMS gain of two (2.4 e(-)rms), or 16 (1.1 e(-)rms).

  5. Pixellated Cd(Zn)Te high-energy X-ray instrument

    NASA Astrophysics Data System (ADS)

    Seller, P.; Bell, S.; Cernik, R. J.; Christodoulou, C.; Egan, C. K.; Gaskin, J. A.; Jacques, S.; Pani, S.; Ramsey, B. D.; Reid, C.; Sellin, P. J.; Scuffham, J. W.; Speller, R. D.; Wilson, M. D.; Veale, M. C.

    2011-12-01

    We have developed a pixellated high energy X-ray detector instrument to be used in a variety of imaging applications. The instrument consists of either a Cadmium Zinc Telluride or Cadmium Telluride (Cd(Zn)Te) detector bump-bonded to a large area ASIC and packaged with a high performance data acquisition system. The 80 by 80 pixels each of 250 μm by 250 μm give better than 1 keV FWHM energy resolution at 59.5 keV and 1.5 keV FWHM at 141 keV, at the same time providing a high speed imaging performance. This system uses a relatively simple wire-bonded interconnection scheme but this is being upgraded to allow multiple modules to be used with very small dead space. The readout system and the novel interconnect technology is described and how the system is performing in several target applications.

  6. Development of 3D-DDTC pixel detectors for the ATLAS upgrade

    NASA Astrophysics Data System (ADS)

    Dalla Betta, Gian-Franco; Boscardin, Maurizio; Darbo, Giovanni; Gemme, Claudia; La Rosa, Alessandro; Pernegger, Heinz; Piemonte, Claudio; Povoli, Marco; Ronchin, Sabina; Zoboli, Andrea; Zorzi, Nicola

    2011-04-01

    We report on the development of n-on-p, 3D Double-Side Double Type Column (3D-DDTC) pixel detectors fabricated at FBK-irst (Trento, Italy) and oriented to the ATLAS upgrade. The considered fabrication technology is simpler than that required for full 3D detectors with active edge, but the detector efficiency and radiation hardness critically depend on the columnar electrode overlap and should be carefully evaluated. The first assemblies of these sensors (featuring 2, 3, or 4 columns per pixel) with the ATLAS FEI3 read-out chip have been tested in laboratory. Selected results from the electrical and functional characterization with radioactive sources are discussed here.

  7. Development of an X-ray imaging system with SOI pixel detectors

    NASA Astrophysics Data System (ADS)

    Nishimura, Ryutaro; Arai, Yasuo; Miyoshi, Toshinobu; Hirano, Keiichi; Kishimoto, Shunji; Hashimoto, Ryo

    2016-09-01

    An X-ray imaging system employing pixel sensors in silicon-on-insulator technology is currently under development. The system consists of an SOI pixel detector (INTPIX4) and a DAQ system based on a multi-purpose readout board (SEABAS2). To correct a bottleneck in the total throughput of the DAQ of the first prototype, parallel processing of the data taking and storing processes and a FIFO buffer were implemented for the new DAQ release. Due to these upgrades, the DAQ throughput was improved from 6 Hz (41 Mbps) to 90 Hz (613 Mbps). The first X-ray imaging system with the new DAQ software release was tested using 33.3 keV and 9.5 keV mono X-rays for three-dimensional computerized tomography. The results of these tests are presented.

  8. Pixellated Cd(Zn)Te high-energy X-ray instrument

    PubMed Central

    Seller, P.; Bell, S.; Cernik, R.J.; Christodoulou, C.; Egan, C.K.; Gaskin, J.A.; Jacques, S.; Pani, S.; Ramsey, B.D.; Reid, C.; Sellin, P.J.; Scuffham, J.W.; Speller, R.D.; Wilson, M.D.; Veale, M.C.

    2012-01-01

    We have developed a pixellated high energy X-ray detector instrument to be used in a variety of imaging applications. The instrument consists of either a Cadmium Zinc Telluride or Cadmium Telluride (Cd(Zn)Te) detector bump-bonded to a large area ASIC and packaged with a high performance data acquisition system. The 80 by 80 pixels each of 250 μm by 250 μm give better than 1 keV FWHM energy resolution at 59.5 keV and 1.5 keV FWHM at 141 keV, at the same time providing a high speed imaging performance. This system uses a relatively simple wire-bonded interconnection scheme but this is being upgraded to allow multiple modules to be used with very small dead space. The readout system and the novel interconnect technology is described and how the system is performing in several target applications. PMID:22737179

  9. Development of a multiplexed readout with high position resolution for positron emission tomography

    NASA Astrophysics Data System (ADS)

    Lee, Sangwon; Choi, Yong; Kang, Jihoon; Jung, Jin Ho

    2017-04-01

    Detector signals for positron emission tomography (PET) are commonly multiplexed to reduce the number of digital processing channels so that the system can remain cost effective while also maintaining imaging performance. In this work, a multiplexed readout combining Anger position estimation algorithm and position decoder circuit (PDC) was developed to reduce the number of readout channels by a factor of 24, 96-to-4. The data acquisition module consisted of a TDC (50 ps resolution), 4-channel ADCs (12 bit, 105 MHz sampling rate), 2 GB SDRAM and USB3.0. The performance of the multiplexed readout was assessed with a high-resolution PET detector block composed of 2×3 detector modules, each consisting of an 8×8 array of 1.52×1.52×6 mm3 LYSO, a 4×4 array of 3×3 mm2 silicon photomultiplier (SiPM) and 13.4×13.4 mm2 light guide with 0.7 mm thickness. The acquired flood histogram showed that all 384 crystals could be resolved. The average energy resolution at 511 keV was 13.7±1.6% full-width-at-half-maximum (FWHM) and the peak-to-valley ratios of the flood histogram on the horizontal and vertical lines were 18.8±0.8 and 22.8±1.3, respectively. The coincidence resolving time of a pair of detector blocks was 6.2 ns FWHM. The reconstructed phantom image showed that rods down to a diameter of 1.6 mm could be resolved. The results of this study indicate that the multiplexed readout would be useful in developing a PET with a spatial resolution less than the pixel size of the photosensor, such as a SiPM array.

  10. Recent results of the ATLAS upgrade planar pixel sensors R&D project

    NASA Astrophysics Data System (ADS)

    Weigell, Philipp

    2013-12-01

    To extend the physics reach of the LHC experiments, several upgrades to the accelerator complex are planned, culminating in the HL-LHC, which eventually leads to an increase of the peak luminosity by a factor of five to ten compared to the LHC design value. To cope with the higher occupancy and radiation damage also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) μm, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m2. To reach this goal the pixel productions are being transferred to 6 in production lines and more cost-efficient and industrialised interconnection techniques are investigated. Additionally, the n-in-p technology is employed, which requires less production steps since it relies on a single-sided process. An overview of the recent accomplishments obtained within the ATLAS Planar Pixel Sensor R&D Project is given. The performance in terms of charge collection and tracking efficiency, obtained with radioactive sources in the laboratory and at beam tests, is presented for devices built from sensors of different vendors connected to either the present ATLAS read-out chip FE-I3 or the new Insertable B-Layer read-out chip FE-I4. The devices, with a thickness varying between 75 μm and 300 μm, were irradiated to several fluences up to 2×1016 neq/cm2. Finally, the different approaches followed inside the collaboration to achieve slim or active edges for planar pixel sensors are presented.

  11. Infrared astronomy - Pixels to spare

    SciTech Connect

    Mccaughrean, M. )

    1991-07-01

    An infrared CCD camera containing an array with 311,040 pixels arranged in 486 rows of 640 each is tested. The array is a chip of platinum silicide (PtSi), sensitive to photons with wavelengths between 1 and 6 microns. Observations of the Hubble Space Telescope, Mars, Pluto and moon are reported. It is noted that the satellite's twin solar-cell arrays, at an apparent separation of about 1 1/4 arc second, are well resolved. Some two dozen video frames were stacked to make each presented image of Mars at 1.6 microns; at this wavelength Mars appears much as it does in visible light. A stack of 11 images at a wavelength of 1.6 microns is used for an image of Jupiter with its Great Red Spot and moons Io and Europa.

  12. Dead pixel replacement in LWIR microgrid polarimeters.

    PubMed

    Ratliff, Bradley M; Tyo, J Scott; Boger, James K; Black, Wiley T; Bowers, David L; Fetrow, Matthew P

    2007-06-11

    LWIR imaging arrays are often affected by nonresponsive pixels, or "dead pixels." These dead pixels can severely degrade the quality of imagery and often have to be replaced before subsequent image processing and display of the imagery data. For LWIR arrays that are integrated with arrays of micropolarizers, the problem of dead pixels is amplified. Conventional dead pixel replacement (DPR) strategies cannot be employed since neighboring pixels are of different polarizations. In this paper we present two DPR schemes. The first is a modified nearest-neighbor replacement method. The second is a method based on redundancy in the polarization measurements.We find that the redundancy-based DPR scheme provides an order-of-magnitude better performance for typical LWIR polarimetric data.

  13. Equivalence of a Bit Pixel Image to a Quantum Pixel Image

    NASA Astrophysics Data System (ADS)

    Ortega, Laurel Carlos; Dong, Shi-Hai; Cruz-Irisson, M.

    2015-11-01

    We propose a new method to transform a pixel image to the corresponding quantum-pixel using a qubit per pixel to represent each pixels classical weight in a quantum image matrix weight. All qubits are linear superposition, changing the coefficients level by level to the entire longitude of the gray scale with respect to the base states of the qubit. Classically, these states are just bytes represented in a binary matrix, having code combinations of 1 or 0 at all pixel locations. This method introduces a qubit-pixel image representation of images captured by classical optoelectronic methods. Supported partially by the project 20150964-SIP-IPN, Mexico

  14. Method for fabricating pixelated silicon device cells

    SciTech Connect

    Nielson, Gregory N.; Okandan, Murat; Cruz-Campa, Jose Luis; Nelson, Jeffrey S.; Anderson, Benjamin John

    2015-08-18

    A method, apparatus and system for flexible, ultra-thin, and high efficiency pixelated silicon or other semiconductor photovoltaic solar cell array fabrication is disclosed. A structure and method of creation for a pixelated silicon or other semiconductor photovoltaic solar cell array with interconnects is described using a manufacturing method that is simplified compared to previous versions of pixelated silicon photovoltaic cells that require more microfabrication steps.

  15. Preliminary validation results of an ASIC for the readout and control of near-infrared large array detectors

    NASA Astrophysics Data System (ADS)

    Pâhlsson, Philip; Meier, Dirk; Otnes Berge, Hans Kristian; Øya, Petter; Steenari, David; Olsen, Alf; Hasanbegovic, Amir; Altan, Mehmet A.; Najafiuchevler, Bahram; Talebi, Jahanzad; Azman, Suleyman; Gheorghe, Codin; Ackermann, Jörg; Mæhlum, Gunnar

    2015-06-01

    In this paper we present initial test results of the Near Infrared Readout and Controller ASIC (NIRCA), designed for large area image sensors under contract from the European Space Agency (ESA) and the Norwegian Space Center. The ASIC is designed to read out image sensors based on mercury cadmium telluride (HgCdTe, or MCT) operating down to 77 K. IDEAS has developed, designed and initiated testing of NIRCA with promising results, showing complete functionality of all ASIC sub-components. The ASIC generates programmable digital signals to clock out the contents of an image array and to amplify, digitize and transfer the resulting pixel charge. The digital signals can be programmed into the ASIC during run-time and allows for windowing and custom readout schemes. The clocked out voltages are amplified by programmable gain amplifiers and digitized by 12-bit, 3-Msps successive approximation register (SAR) analogue-to-digital converters (ADC). Digitized data is encoded using 8-bit to 10-bit encoding and transferred over LVDS to the readout system. The ASIC will give European researchers access to high spectral sensitivity, very low noise and radiation hardened readout electronics for astronomy and Earth observation missions operating at 77 K and room temperature. The versatility of the chip makes the architecture a possible candidate for other research areas, or defense or industrial applications that require analog and digital acquisition, voltage regulation, and digital signal generation.

  16. Implementation of TDI based digital pixel ROIC with 15μm pixel pitch

    NASA Astrophysics Data System (ADS)

    Ceylan, Omer; Shafique, Atia; Burak, A.; Caliskan, Can; Abbasi, Shahbaz; Yazici, Melik; Gurbuz, Yasar

    2016-05-01

    A 15um pixel pitch digital pixel for LWIR time delay integration (TDI) applications is implemented which occupies one fourth of pixel area compared to previous digital TDI implementation. TDI is implemented on 8 pixels with oversampling rate of 2. ROIC provides 16 bits output with 8 bits of MSB and 8 bits of LSB. Pixel can store 75 M electrons with a quantization noise of 500 electrons. Digital pixel TDI implementation is advantageous over analog counterparts considering power consumption, chip area and signal-to-noise ratio. Digital pixel TDI ROIC is fabricated with 0.18um CMOS process. In digital pixel TDI implementation photocurrent is integrated on a capacitor in pixel and converted to digital data in pixel. This digital data triggers the summation counters which implements TDI addition. After all pixels in a row contribute, the summed data is divided to the number of TDI pixels(N) to have the actual output which is square root of N improved version of a single pixel output in terms of signal-to-noise-ratio (SNR).

  17. 320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

    NASA Astrophysics Data System (ADS)

    Yon, J.-J.; Dumont, G.; Rabaud, W.; Becker, S.; Carle, L.; Goudon, V.; Vialle, C.; Hamelin, A.; Arnaud, A.

    2012-10-01

    Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum < 10-3 mbar, the authors have pushed forward the development of the technology on fully operational QVGA readout circuits CMOS base wafers (320 x 240 pixels). In this outlook, the article reports on the electro optical performance obtained from this preliminary PLP based QVGA demonstrator. Apart from the response, noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.

  18. New concept of a submillimetric pixellated Silicon detector for intracerebral application

    NASA Astrophysics Data System (ADS)

    Benoit, M.; Märk, J.; Weiss, P.; Benoit, D.; Clemens, J. C.; Fougeron, D.; Janvier, B.; Jevaud, M.; Karkar, S.; Menouni, M.; Pain, F.; Pinot, L.; Morel, C.; Laniece, P.

    2011-12-01

    A new beta+ radiosensitive microprobe implantable in rodent brain dedicated to in vivo and autonomous measurements of local time activity curves of beta radiotracers in a volume of brain tissue of a few mm3 has been developed recently. This project expands the concept of the previously designed beta microprobe, which has been validated extensively in neurobiological experiments performed on anesthetized animals. Due to its limitations considering recordings on awake and freely moving animals, we have proposed to develop a wireless setup that can be worn by an animal without constraining its movements. To that aim, we have chosen a highly beta sensitive Silicon-based detector to devise a compact pixellated probe. Miniaturized wireless electronics is used to read-out and transfer the measurement data. Initial Monte-Carlo simulations showed that high resistive Silicon pixels are appropriate for this purpose, with their dimensions to be adapted to our specific signals. More precisely, we demonstrated that 200 μm thick pixels with an area of 200 μm×500 μm are optimized in terms of beta+sensitivity versus relative transparency to the gamma background. Based on this theoretical study, we now present the development of the novel sensor, including the system simulations with technology computer-assisted design (TCAD) to investigate specific configurations of guard rings and their potential to increase the electrical isolation and stabilization of the pixel, as well as the corresponding physical tests to validate the particular geometries of this new sensor.

  19. H4RG Near-IR Detectors with 10 micron pixels for WFIRST and Space Astrophysics

    NASA Astrophysics Data System (ADS)

    Kruk, Jeffrey W.; Rauscher, B. J.

    2014-01-01

    Hybrid sensor chip assemblies (SCAs) employing HgCdTe photo-diode arrays integrated with CMOS read-out integrated circuits (ROICs) have become the detector of choice for many cutting-edge ground-based and space-based astronomical instruments operating at near infrared wavelengths. 2Kx2K arrays of 18-micron pixels are in use at many ground-based observatories and will fly on JWST and Euclid later this decade. The Wide-Field Infra-Red Survey Telescope (WFIRST) mission, which will survey large areas of the sky with reasonably-fine sampling, is extending these prior designs by developing 4Kx4K HgCdTe NIR hybrid detectors with 10 micron pixels. These will provide four times as many pixels as the current 2Kx2K detectors in a package that is only slightly larger. Four prototype 4Kx4K devices with conservative pixel designs were produced in 2011; these devices met many though not all WFIRST performance requirements. A Strategic Astrophysics Technology proposal was submitted to further the development of these detectors. This poster describes the technology development plan, progress made in the first year of the program, and plans for the future.

  20. 3D silicon pixel detectors for the High-Luminosity LHC

    NASA Astrophysics Data System (ADS)

    Lange, J.; Carulla Areste, M.; Cavallaro, E.; Förster, F.; Grinstein, S.; López Paz, I.; Manna, M.; Pellegrini, G.; Quirion, D.; Terzo, S.; Vázquez Furelos, D.

    2016-11-01

    3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50 × 250 μm2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12-15 mW/cm2 at a fluence of about 1016 neq/cm2, measured at -25°C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50 × 50 and 25 × 100 μm2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1-2 V before irradiation.

  1. Evaluation of testing strategies for the radiation tolerant ATLAS n +-in-n pixel sensor

    NASA Astrophysics Data System (ADS)

    Klaiber-Lodewigs, Jonas M.; Atlas Pixel Collaboration

    2003-10-01

    The development of particle tracker systems for high fluence environments in new high-energy physics experiments raises new challenges for the development, manufacturing and reliable testing of radiation tolerant components. The ATLAS pixel detector for use at the LHC, CERN, is designed to cover an active sensor area of 1.8 m2 with 1.1×10 8 read-out channels usable for a particle fluence up to 10 15 cm-2 ( 1 MeV neutron equivalent) and an ionization dose up to 500 kGy of mainly charged hadron radiation. To cope with such a harsh environment the ATLAS Pixel Collaboration has developed a radiation hard n +-in-n silicon pixel cell design with a standard cell size of 50×400 μm2. Using this design on an oxygenated silicon substrate, sensor production has started in 2001. This contribution describes results gained during the development of testing procedures of the ATLAS pixel sensor and evaluates quality assurance procedures regarding their relevance for detector operation in the ATLAS experiment. The specific set of tests discussed in detail measures sensor depletion, interface generation velocity, p-spray dose and biasing by punch-through mechanism and is designed to give insights into effects of irradiation with ionizing particles.

  2. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    NASA Astrophysics Data System (ADS)

    Gabrielli, A.; Backhaus, M.; Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Travaglini, R.; Wensing, M.

    2015-03-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014.

  3. 3D-FBK Pixel Sensors: Recent Beam Tests Results with Irradiated Devices

    SciTech Connect

    Micelli, A.; Helle, K.; Sandaker, H.; Stugu, B.; Barbero, M.; Hugging, F.; Karagounis, M.; Kostyukhin, V.; Kruger, H.; Tsung, J.W.; Wermes, N.; Capua, M.; Fazio, S.; Mastroberardino, A.; Susinno, G.; Gallrapp, C.; Di Girolamo, B.; Dobos, D.; La Rosa, A.; Pernegger, H.; Roe, S.; /CERN /Prague, Tech. U. /Prague, Tech. U. /Freiburg U. /Freiburg U. /Freiburg U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /Glasgow U. /Glasgow U. /Glasgow U. /Hawaii U. /Barcelona, IFAE /Barcelona, IFAE /LBL, Berkeley /Barcelona, IFAE /LBL, Berkeley /LBL, Berkeley /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /New Mexico U. /New Mexico U. /Oslo U. /Oslo U. /Oslo U. /Oslo U. /Oslo U. /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SUNY, Stony Brook /SUNY, Stony Brook /SUNY, Stony Brook /INFN, Trento /Trento U. /INFN, Trento /Trento U. /INFN, Trento /Trento U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /Barcelona, Inst. Microelectron. /Barcelona, Inst. Microelectron. /Barcelona, Inst. Microelectron. /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /SINTEF, Oslo /SINTEF, Oslo /SINTEF, Oslo /SINTEF, Oslo /VTT Electronics, Espoo /VTT Electronics, Espoo

    2012-04-30

    The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.

  4. Electrical and optical measurements on the first SCUBA-2 prototype 1280 pixel submillimeter superconducting bolometer array.

    PubMed

    Woodcraft, Adam L; Ade, Peter A R; Bintley, Dan; House, Julian S; Hunt, Cynthia L; Sudiwala, Rashmi V; Doriese, William B; Duncan, William D; Hilton, Gene C; Irwin, Kent D; Reintsema, Carl D; Ullom, Joel N; Audley, Michael D; Ellis, Maureen A; Holland, Wayne S; MacIntosh, Mike; Dunare, Camelia C; Parkes, William; Walton, Anthony J; Kycia, Jan B; Halpern, Mark; Schulte, Eric

    2007-02-01

    SCUBA-2 is a submillimeter camera being built for the James Clerk Maxwell Telescope in Hawaii. Bringing CCD style imaging to the submillimeter for the first time, with over 10000 pixels, it will provide a revolutionary improvement in sensitivity and mapping speed. We present results of the first tests on a prototype 1280 pixel SCUBA-2 subarray; the full instrument will be made up of eight such subarrays. The array is made up of transition edge sensor (TES) detectors, with Mo/Cu bilayers as the sensing element. To keep the number of wires reasonable, a multiplexed readout is used. Unlike previous TES arrays, an in-focal plane multiplexer configuration is used, in which the multiplexing elements are located beneath each pixel. To achieve the required performance, the detectors are operated at a temperature of approximately 120 mK. We describe the results of a basic electrical and optical characterization of the array, demonstrating that it is fully operational. Noise measurements were made on several pixels and gave a noise equivalent power below 2.5 x 10(-17) W HZ(-0.5), within the requirements for SCUBA-2. The construction of the testbed used to carry out these measurements is also described.

  5. Characterization of the CDMS Ionization Readout

    NASA Astrophysics Data System (ADS)

    Phipps, Arran

    2007-10-01

    Current cosmological models predict that a large portion of the total mass of the universe, about eighty percent, consists of putative dark matter. Theory predicts this dark matter may be in the form of particles constantly passing through the Earth. A class of these particles may interact with ordinary matter, earning the name weakly-interacting massive particles (WIMPs). The Cryogenic Dark Matter Search (CDMS) aims to directly detect the existence of WIMPs. CDMS has designed ZIP (Z-dependent Ionization & Phonon) detectors which measure phonon production and ionization of an interaction, making it possible to determine the interacting particle. The low-energy threshold of the ZIP detectors is determined by the signal-to-noise ratio of the ionization readout. A characterization of the signal-to-noise ratio of the ionization readout, along with possible modifications for improved sensitivity will be presented.

  6. Design of a ballistic fluxon qubit readout

    NASA Astrophysics Data System (ADS)

    Herr Kidiyarova-Shevchenko, Anna; Fedorov, Arkady; Shnirman, Alexander; Il'ichev, Evgeny; Schön, Gerd

    2007-11-01

    A detailed design is given for a flux qubit readout using ballistic fluxons. In this scheme, fluxons propagate through an underdamped Josephson transmission line (JTL) coupled to the qubit, whose state affects the fluxon propagation time. For strong qubit-JTL coupling, and far from the symmetry point, a qubit can be measured with fidelity greater than 99% and measurement time of 4 ns. The readout circuit requires additional rapid single flux quantum (RSFQ) interface circuitry to launch and receive the delayed flux solitons. The parameters of this driver and receiver have been optimized to produce low fluxon speed at launch and impedance matching at the receiver. The delayed solitons are compared to a reference line using a detector with time resolution of better than 16 ps. Both the JTL and RSFQ interface were designed for the Nb 30 A cm-2 process developed at VTT, Finland, with postdeposition of the Al qubit at IPHT, Germany.

  7. VCSELs for interferometric readout of MEMS sensors

    NASA Astrophysics Data System (ADS)

    Serkland, Darwin K.; Geib, Kent M.; Peake, Gregory M.; Keeler, Gordon A.; Shaw, Michael J.; Baker, Michael S.; Okandan, Murat

    2016-03-01

    We report on the development of single-frequency VCSELs (vertical-cavity surface-emitting lasers) for sensing the position of a moving MEMS (micro-electro-mechanical system) object with resolution much less than 1nm. Position measurement is the basis of many different types of MEMS sensors, including accelerometers, gyroscopes, and pressure sensors. Typically, by switching from a traditional capacitive electronic readout to an interferometric optical readout, the resolution can be improved by an order of magnitude with a corresponding improvement in MEMS sensor performance. Because the VCSEL wavelength determines the scale of the position measurement, laser wavelength (frequency) stability is desirable. This paper discusses the impact of VCSEL amplitude and frequency noise on the position measurement.

  8. Readout electrode assembly for measuring biological impedance

    NASA Technical Reports Server (NTRS)

    Montgomery, L. D.; Moody, D. L., Jr. (Inventor)

    1976-01-01

    The invention comprises of a pair of readout ring electrodes which are used in conjunction with apparatus for measuring the electrical impedance between different points in the body of a living animal to determine the amount of blood flow therebetween. The readout electrodes have independently adjustable diameters to permit attachment around different parts of the body between which it is desired to measure electric impedance. The axial spacing between the electrodes is adjusted by a pair of rods which have a first pair of ends fixedly attached to one electrode and a second pair of ends slidably attached to the other electrode. Indicia are provided on the outer surface of the ring electrodes and on the surface of the rods to permit measurement of the circumference and spacing between the ring electrodes.

  9. Characterisation of edgeless technologies for pixellated and strip silicon detectors with a micro-focused X-ray beam

    NASA Astrophysics Data System (ADS)

    Bates, R.; Blue, A.; Christophersen, M.; Eklund, L.; Ely, S.; Fadeyev, V.; Gimenez, E.; Kachkanov, V.; Kalliopuska, J.; Macchiolo, A.; Maneuski, D.; Phlips, B. F.; Sadrozinski, H. F.-W.; Stewart, G.; Tartoni, N.; Zain, R. M.

    2013-01-01

    Reduced edge or ``edgeless'' detector design offers seamless tileability of sensors for a wide range of applications from particle physics to synchrotron and free election laser (FEL) facilities and medical imaging. Combined with through-silicon-via (TSV) technology, this would allow reduced material trackers for particle physics and an increase in the active area for synchrotron and FEL pixel detector systems. In order to quantify the performance of different edgeless fabrication methods, 2 edgeless detectors were characterized at the Diamond Light Source using an 11 μm FWHM 15 keV micro-focused X-ray beam. The devices under test were: a 150 μm thick silicon active edge pixel sensor fabricated at VTT and bump-bonded to a Medipix2 ROIC; and a 300 μm thick silicon strip sensor fabricated at CIS with edge reduction performed by SCIPP and the NRL and wire bonded to an ALiBaVa readout system. Sub-pixel resolution of the 55 μm active edge pixels was achieved. Further scans showed no drop in charge collection recorded between the centre and edge pixels, with a maximum deviation of 5% in charge collection between scanned edge pixels. Scans across the cleaved and standard guard ring edges of the strip detector also show no reduction in charge collection. These results indicate techniques such as the scribe, cleave and passivate (SCP) and active edge processes offer real potential for reduced edge, tiled sensors for imaging detection applications.

  10. Characterization of a module with pixelated CdTe detectors for possible PET, PEM and compton camera applications

    NASA Astrophysics Data System (ADS)

    Ariño-Estrada, G.; Chmeissani, M.; de Lorenzo, G.; Puigdengoles, C.; Martínez, R.; Cabruja, E.

    2014-05-01

    We present the measurement of the energy resolution and the impact of charge sharing for a pixel CdTe detector. This detector will be used in a novel conceptual design for diagnostic systems in the field of nuclear medicine such as positron emission tomography (PET), positron emission mammography (PEM) and Compton camera. The detector dimensions are 10 mm × 10 mm × 2 mm and with a pixel pitch of 1 mm × 1 mm. The pixel CdTe detector is a Schottky diode and it was tested at a bias of -1000 V. The VATAGP7.1 frontend ASIC was used for the readout of the pixel detector and the corresponding single channel electronic noise was found to be σ < 2 keV for all the pixels. We have achieved an energy resolution, FWHM/Epeak, of 7.1%, 4.5% and 0.98% for 59.5, 122 and 511 keV respectively. The study of the charge sharing shows that 16% of the events deposit part of their energy in the adjacent pixel.

  11. LSST camera readout chip ASPIC: test tools

    NASA Astrophysics Data System (ADS)

    Antilogus, P.; Bailly, Ph; Jeglot, J.; Juramy, C.; Lebbolo, H.; Martin, D.; Moniez, M.; Tocut, V.; Wicek, F.

    2012-02-01

    The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

  12. Characterization of new hybrid pixel module concepts for the ATLAS Insertable B-Layer upgrade

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2012-01-01

    The ATLAS Insertable B-Layer (IBL) collaboration plans to insert a fourth pixel layer inside the present Pixel Detector to recover from eventual failures in the current pixel system, especially the b-layer. Additionally the IBL will ensure excellent tracking, vertexing and b-tagging performance during the LHC phase I and add robustness in tracking with high luminosity pile-up. The expected peak luminosity for IBL is 2 to 3·1034 cm-2s-1 and IBL is designed for an integrated luminosity of 700 fb-1. This corresponds to an expected fluence of 5·1015 1 MeV neqcm-2 and a total ionizing dose of 250 MRad. In order to cope with these requirements, two new module concepts are under investigation, both based on a new front end IC, called FE-I4. This IC was designed as readout chip for future ATLAS Pixel Detectors and its first application will be the IBL. The planar pixel sensor (PPS) based module concept benefits from its well understood design, which is kept as similar as possible to the design of the current ATLAS Pixel Detector sensor. The second approach of the new three dimensional (3D) silicon sensor technology benefits from the shorter charge carrier drift distance to the electrodes, which completely penetrate the sensor bulk. Prototype modules of both sensor concepts have been build and tested in laboratory and test beam environment before and after irradiation. Both concepts show very high performance even after irradiation to 5·1015 1 MeV neqcm-2 and meet the IBL specifications in terms of hit efficiency being larger than 97%. Lowest operational threshold studies have been effected and prove independent of the used sensor concept the excellent performance of FE-I4 based module concepts in terms of noise hit occupancy at low thresholds.

  13. Study of spacecraft direct readout meteorological systems

    NASA Technical Reports Server (NTRS)

    Bartlett, R.; Elam, W.; Hoedemaker, R.

    1973-01-01

    Characteristics are defined of the next generation direct readout meteorological satellite system with particular application to Tiros N. Both space and ground systems are included. The recommended space system is composed of four geosynchronous satellites and two low altitude satellites in sun-synchronous orbit. The goesynchronous satellites transmit to direct readout ground stations via a shared S-band link, relayed FOFAX satellite cloud cover pictures (visible and infrared) and weather charts (WEFAX). Basic sensor data is transmitted to regional Data Utilization Stations via the same S-band link. Basic sensor data consists of 0.5 n.m. sub-point resolution data in the 0.55 - 0.7 micron spectral region, and 4.0 n.m. resolution data in the 10.5 - 12.6 micron spectral region. The two low altitude satellites in sun-synchronous orbit provide data to direct readout ground stations via a 137 MHz link, a 400 Mhz link, and an S-band link.

  14. Cryogenic readout techniques for germanium detectors

    SciTech Connect

    Benato, G.; Cattadori, C.; Di Vacri, A.; Ferri, E.

    2015-07-01

    High Purity Germanium detectors are used in many applications, from nuclear and astro-particle physics, to homeland security or environment protection. Although quite standard configurations are often used, with cryostats, charge sensitive amplifiers and analog or digital acquisition systems all commercially available, it might be the case that a few specific applications, e.g. satellites, portable devices, cryogenic physics experiments, etc. also require the development of a few additional or complementary techniques. An interesting case is for sure GERDA, the Germanium Detector Array experiment, searching for neutrino-less double beta decay of {sup 76}Ge at the Gran Sasso National Laboratory of INFN - Italy. In GERDA the entire detector array, composed of semi-coaxial and BEGe naked crystals, is operated suspended inside a cryostat filled with liquid argon, that acts not only as cooling medium and but also as an active shield, thanks to its scintillation properties. These peculiar circumstances, together with the additional requirement of a very low radioactive background from all the materials adjacent to the detectors, clearly introduce significant constraints on the design of the Ge front-end readout electronics. All the Ge readout solutions developed within the framework of the GERDA collaboration, for both Phase I and Phase II, will be briefly reviewed, with their relative strength and weakness compared together and with respect to ideal Ge readout. Finally, the digital processing techniques developed by the GERDA collaboration for energy estimation of Ge detector signals will be recalled. (authors)

  15. Qubit readout with the Josephson Photomultiplier

    NASA Astrophysics Data System (ADS)

    Ribeill, Guilhem

    Recent demonstrations of error correction in many qubit circuits, as well as efforts to build a logical qubit, have shown the need for a simple and scalable superconducting quantum bit (qubit) readout. Current solutions based on heterodyne detection and cryogenic amplification of microwave readout tones may prove difficult to scale, while photon counting presents an attractive alternative. However, the development of counters operating at these frequencies has proved technically challenging. In this thesis, we describe the development of the Josephson Photomultiplier (JPM), a microwave photon counting circuit. We discuss the JPM theoretically, and describe the fabrication of the JPM using standard thin film lithography techniques. We measure its properties as a microwave photon counter using a qubit as an in-situ calibrated source of photons. We measure a JPM quantum efficiency at the few percent level. We then use the JPM to perform readout of a transmon qubit in both the dispersive and bright regimes. We observe raw measurement fidelities of 35% and 62% respectively. We discuss how the JPM and measurement protocol could be further optimized to achieve fidelities in excess of 90%.

  16. Results from the NA62 Gigatracker Prototype: A Low-Mass and sub-ns Time Resolution Silicon Pixel Detector

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Rinella, G. Aglieri; Carassiti, V.; Ceccucci, A.; Gil, E. Cortina; Ramusino, A. Cotta; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Martin, E.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petagna, P.; Petrucci, F.; Perktold, L.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    The Gigatracker (GTK) is a hybrid silicon pixel detector developed for NA62, the experiment aimed at studying ultra-rare kaon decays at the CERN SPS. Three GTK stations will provide precise momentum and angular measurements on every track of the high intensity NA62 hadron beam with a time-tagging resolution of 150 ps. Multiple scattering and hadronic interactions of beam particles in the GTK have to be minimized to keep background events at acceptable levels, hence the total material budget is fixed to 0.5% X0 per station. In addition the calculated fluence for 100 days of running is 2×1014 1 MeV neq/cm2, comparable to the one expected for the inner trackers of LHC detectors in 10 years of operation. These requirements pose challenges for the development of an efficient and low-mass cooling system, to be operated in vacuum, and on the thinning of read-out chips to 100 μm or less. The most challenging requirement is represented by the time resolution, which can be achieved by carefully compensating for the discriminator time-walk. For this purpose, two complementary read-out architectures have been designed and produced as small-scale prototypes: the first is based on the use of a Time-over-Threshold circuit followed by a TDC shared by a group of pixels, while the other uses a constant-fraction discriminator followed by an on-pixel TDC. The readout pixel ASICs are produced in 130 nm IBM CMOS technology and bump-bonded to 200 μm thick silicon sensors. The Gigatracker detector system is described with particular emphasis on recent experimental results obtained from laboratory and beam tests of prototype bump-bonded assemblies, which show a time resolution of less than 200 ps for single hits.

  17. Similarities and differences of recent hybrid pixel detectors for X-ray and high energy physics developed at the Paul Scherrer Institut

    NASA Astrophysics Data System (ADS)

    Tinti, G.; Bergamaschi, A.; Cartier, S.; Dinapoli, R.; Greiffenberg, D.; Horisberger, R.; Johnson, I.; Jungmann-Smith, J. H.; Mezza, D.; Mozzanica, A.; Schmitt, B.; Shi, X.

    2015-04-01

    Hybrid pixel detectors are being developed for both photon science and high energy physics. The article will cover similarities and differences in pixel detectors for both applications using two of the pixel detectors developed at the Paul Scherrer Institute (Switzerland) as examples: the EIGER photon counting detector and the psi46dig chip, which has been developed for the Compact Muon Solenoid (CMS) tracking pixel detector upgrade. EIGER is a single photon counting hybrid pixel detector for applications at synchrotron light sources in the energy range from a few to 25 keV. It is characterized by a small pixel size (75 × 75 μm2), high count rate capability (106 counts/pixel/s) and very high data rate, which reaches 6 Gb/s for a 256 × 256 pixel chip. The CMS pixel detector is designed to provide charge information from the pixels in the harsh radiation environment at the Large Hadron Collider. The short time between bunches of 25 ns and the high event rate at luminosity up to 2 × 1034cm-2s-1 require a detector with high hit efficiency, with good timing resolution and the ability to retain timestamp information for the hits. The readout architecture is based on the transfer of hits from the pixels to the periphery, where the trigger validation is performed before data transfer. The data rates of the digitized output reach 160 Mb/s for a 52×80 pixel chip.The specific timing and rate requirements for the detectors, the analog performances (minimum threshold and noise), the power consumption and the radiation hardness will be compared. An overview on future developments based on mutual learning and common solutions will be discussed.

  18. Characterization and performance of silicon n-in-p pixel detectors for the ATLAS upgrades

    NASA Astrophysics Data System (ADS)

    Weigell, P.; Beimforde, M.; Gallrapp, Ch.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.

    2011-12-01

    The existing ATLAS tracker will be at its functional limit for particle fluences of 10 15 neq/cm2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. n-in-p silicon devices are a promising candidate for tracking detectors to achieve these goals, since they are radiation hard, cost efficient and are not type inverted after irradiation. A n-in-p pixel production based on a MPP/HLL design and performed by CiS (Erfurt, Germany) on 300 μm thick Float-Zone material is characterised and the electrical properties of sensors and single chip modules (SCM) are presented, including noise, charge collection efficiencies, and measurements with MIPs as well as an 241Am source. The SCMs are built with sensors connected to the current ATLAS read-out chip FE-I3. The characterisation has been performed with the ATLAS pixel read-out systems, before and after irradiation with 24 GeV/ c protons. In addition preliminary testbeam results for the tracking efficiency and charge collection, obtained with a SCM, are discussed.

  19. A high speed, low power consumption LVDS interface for CMOS pixel sensors

    NASA Astrophysics Data System (ADS)

    Shi, Zhan; Tang, Zhenan; Tian, Yong; Pham, Hung; Valin, Isabelle; Jaaskelainen, Kimmo

    2015-01-01

    The use of CMOS Pixel Sensors (CPSs) offers a promising approach to the design of vertex detectors in High Energy Physics (HEP) experiments. As the CPS equipping the upgraded Solenoidal Tracker at RHIC (STAR) pixel detector, ULTIMATE perfectly illustrates the potential of CPSs for HEP applications. However, further development of CPSs with respect to readout speed is required to fulfill the readout time requirement of the next generation HEP detectors, such as the upgrade of A Large Ion Collider Experiment (ALICE) Inner Tracking System (ITS), the International Linear Collider (ILC), and the Compressed Baryonic Matter (CBM) vertex detectors. One actual limitation of CPSs is related to the speed of the Low-Voltage Differential Signaling (LVDS) circuitry implementing the interface between the sensor and the Data Acquisition (DAQ) system. To improve the transmission rate while keeping the power consumption at a low level, a source termination technique and a special current comparator were adopted for the LVDS driver and receiver, respectively. Moreover, hardening techniques are used. The circuitry was designed and submitted for fabrication in a 0.18-μm CMOS Image Sensor (CIS) process at the end of 2011. The test results indicated that the LVDS driver and receiver can operate properly at the data rate of 1.2 Gb/s with power consumption of 19.6 mW.

  20. A new data acquisition system for the CMS Phase 1 pixel detector

    NASA Astrophysics Data System (ADS)

    Kornmayer, A.

    2016-12-01

    A new pixel detector will be installed in the CMS experiment during the extended technical stop of the LHC at the beginning of 2017. The new pixel detector, built from four layers in the barrel region and three layers on each end of the forward region, is equipped with upgraded front-end readout electronics, specifically designed to handle the high particle hit rates created in the LHC environment. The DAQ back-end was entirely redesigned to handle the increased number of readout channels, the higher data rates per channel and the new digital data format. Based entirely on the microTCA standard, new front-end controller (FEC) and front-end driver (FED) cards have been developed, prototyped and produced with custom optical link mezzanines mounted on the FC7 AMC and custom firmware. At the same time as the new detector is being assembled, the DAQ system is set up and its integration into the CMS central DAQ system tested by running the pilot blade detector already installed in CMS. This work describes the DAQ system, integration tests and gives an outline for the activities up to commissioning the final system at CMS in 2017.

  1. Optimal fine ϕ-slicing for single-photon-counting pixel detectors

    PubMed Central

    Mueller, Marcus; Wang, Meitian; Schulze-Briese, Clemens

    2012-01-01

    The data-collection parameters used in a macromolecular diffraction experiment have a strong impact on data quality. A careful choice of parameters leads to better data and can make the difference between success and failure in phasing attempts, and will also result in a more accurate atomic model. The selection of parameters has to account for the application of the data in various phasing methods or high-resolution refinement. Furthermore, experimental factors such as crystal characteristics, available experiment time and the properties of the X-ray source and detector have to be considered. For many years, CCD detectors have been the prevalent type of detectors used in macromolecular crystallography. Recently, hybrid pixel X-ray detectors that operate in single-photon-counting mode have become available. These detectors have fundamentally different characteristics compared with CCD detectors and different data-collection strategies should be applied. Fine ϕ-slicing is a strategy that is particularly well suited to hybrid pixel detectors because of the fast readout time and the absence of readout noise. A large number of data sets were systematically collected from crystals of four different proteins in order to investigate the benefit of fine ϕ-­slicing on data quality with a noise-free detector. The results show that fine ϕ-slicing can substantially improve scaling statistics and anomalous signal provided that the rotation angle is comparable to half the crystal mosaicity. PMID:22194332

  2. Bilateral bad pixel and Stokes image reconstruction for microgrid polarimetric imagers

    NASA Astrophysics Data System (ADS)

    LeMaster, Daniel A.; Ratliff, Bradley M.

    2015-09-01

    Uncorrected or poorly corrected bad pixels reduce the effectiveness of polarimetric clutter suppression. In conventional microgrid processing, bad pixel correction is accomplished as a separate step from Stokes image reconstruction. Here, these two steps are combined to speed processing and provide better estimates of the entire image, including missing samples. A variation on the bilateral filter enables both edge preservation in the Stokes imagery and bad pixel suppression. Understanding the newly presented filter requires two key insights. First, the adaptive nature of the bilateral filter is extended to correct for bad pixels by simply incorporating a bad pixel mask. Second, the bilateral filter for Stokes estimation is the sum of the normalized bilateral filters for estimating each analyzer channel individually. This paper describes the new approach and compares it to our legacy method using simulated imagery.

  3. Active-Pixel Image Sensor With Analog-To-Digital Converters

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Mendis, Sunetra K.; Pain, Bedabrata; Nixon, Robert H.

    1995-01-01

    Proposed single-chip integrated-circuit image sensor contains 128 x 128 array of active pixel sensors at 50-micrometer pitch. Output terminals of all pixels in each given column connected to analog-to-digital (A/D) converter located at bottom of column. Pixels scanned in semiparallel fashion, one row at time; during time allocated to scanning row, outputs of all active pixel sensors in row fed to respective A/D converters. Design of chip based on complementary metal oxide semiconductor (CMOS) technology, and individual circuit elements fabricated according to 2-micrometer CMOS design rules. Active pixel sensors designed to operate at video rate of 30 frames/second, even at low light levels. A/D scheme based on first-order Sigma-Delta modulation.

  4. Maximal adaptive-decision speedups in quantum-state readout

    NASA Astrophysics Data System (ADS)

    D'Anjou, Benjamin; Kuret, Loutfi; Childress, Lilian; Coish, William A.

    The average time T required for high-fidelity readout of quantum states can be significantly reduced via a real-time adaptive decision rule. An adaptive decision rule stops the readout as soon as a desired level of confidence has been achieved, as opposed to setting a fixed readout time tf. The performance of the adaptive decision is characterized by the ``adaptive-decision speedup'', tf / T . In this work, we reformulate this readout problem in terms of the first-passage time of a particle undergoing stochastic motion. This formalism allows us to theoretically establish the maximum achievable adaptive-decision speedups for several physical two-state readout implementations. We show that for two common readout schemes (the Gaussian latching readout and a readout relying on state-dependent decay), the speedup is bounded by 4 and 2, respectively, in the limit of high single-shot readout fidelity. We experimentally study the achievable speedup in a real-world scenario by applying the adaptive decision rule to a readout of the nitrogen-vacancy-center (NV-center) charge state. We find a speedup of ~ 2 with our experimental parameters. Our results should lead to immediate improvements in nano-scale magnetometry based on spin-to-charge conversion of the NV-center spin. We acknowledge support from NSERC, INTRIQ, CIFAR and the Walter C. Sumner Foundation.

  5. High stroke pixel for a deformable mirror

    DOEpatents

    Miles, Robin R.; Papavasiliou, Alexandros P.

    2005-09-20

    A mirror pixel that can be fabricated using standard MEMS methods for a deformable mirror. The pixel is electrostatically actuated and is capable of the high deflections needed for spaced-based mirror applications. In one embodiment, the mirror comprises three layers, a top or mirror layer, a middle layer which consists of flexures, and a comb drive layer, with the flexures of the middle layer attached to the mirror layer and to the comb drive layer. The comb drives are attached to a frame via spring flexures. A number of these mirror pixels can be used to construct a large mirror assembly. The actuator for the mirror pixel may be configured as a crenellated beam with one end fixedly secured, or configured as a scissor jack. The mirror pixels may be used in various applications requiring high stroke adaptive optics.

  6. SAPHIRE (scintillator avalanche photoconductor with high resolution emitter readout) for low dose x-ray imaging: Spatial resolution

    SciTech Connect

    Li Dan; Zhao Wei

    2008-07-15

    An indirect flat panel imager (FPI) with programmable avalanche gain and field emitter array (FEA) readout is being investigated for low-dose and high resolution x-ray imaging. It is made by optically coupling a structured x-ray scintillator, e.g., thallium (Tl) doped cesium iodide (CsI), to an amorphous selenium (a-Se) avalanche photoconductor called high-gain avalanche rushing amorphous photoconductor (HARP). The charge image created by the scintillator/HARP (SHARP) combination is read out by the electron beams emitted from the FEA. The proposed detector is called scintillator avalanche photoconductor with high resolution emitter readout (SAPHIRE). The programmable avalanche gain of HARP can improve the low dose performance of indirect FPI while the FEA can be made with pixel sizes down to 50 {mu}m. Because of the avalanche gain, a high resolution type of CsI (Tl), which has not been widely used in indirect FPI due to its lower light output, can be used to improve the high spatial frequency performance. The purpose of the present article is to investigate the factors affecting the spatial resolution of SAPHIRE. Since the resolution performance of the SHARP combination has been well studied, the focus of the present work is on the inherent resolution of the FEA readout method. The lateral spread of the electron beam emitted from a 50 {mu}mx50 {mu}m pixel FEA was investigated with two different electron-optical designs: mesh-electrode-only and electrostatic focusing. Our results showed that electrostatic focusing can limit the lateral spread of electron beams to within the pixel size of down to 50 {mu}m. Since electrostatic focusing is essentially independent of signal intensity, it will provide excellent spatial uniformity.

  7. SAPHIRE (scintillator avalanche photoconductor with high resolution emitter readout) for low dose x-ray imaging: spatial resolution.

    PubMed

    Li, Dan; Zhao, Wei

    2008-07-01

    An indirect flat panel imager (FPI) with programmable avalanche gain and field emitter array (FEA) readout is being investigated for low-dose and high resolution x-ray imaging. It is made by optically coupling a structured x-ray scintillator, e.g., thallium (Tl) doped cesium iodide (CsI), to an amorphous selenium (a-Se) avalanche photoconductor called high-gain avalanche rushing amorphous photoconductor (HARP). The charge image created by the scintillator/HARP (SHARP) combination is read out by the electron beams emitted from the FEA. The proposed detector is called scintillator avalanche photoconductor with high resolution emitter readout (SAPHIRE). The programmable avalanche gain of HARP can improve the low dose performance of indirect FPI while the FEA can be made with pixel sizes down to 50 microm. Because of the avalanche gain, a high resolution type of CsI (Tl), which has not been widely used in indirect FPI due to its lower light output, can be used to improve the high spatial frequency performance. The purpose of the present article is to investigate the factors affecting the spatial resolution of SAPHIRE. Since the resolution performance of the SHARP combination has been well studied, the focus of the present work is on the inherent resolution of the FEA readout method. The lateral spread of the electron beam emitted from a 50 microm x 50 microm pixel FEA was investigated with two different electron-optical designs: mesh-electrode-only and electrostatic focusing. Our results showed that electrostatic focusing can limit the lateral spread of electron beams to within the pixel size of down to 50 microm. Since electrostatic focusing is essentially independent of signal intensity, it will provide excellent spatial uniformity.

  8. Improvement to the signaling interface for CMOS pixel sensors

    NASA Astrophysics Data System (ADS)

    Shi, Zhan; Tang, Zhenan; Feng, Chong; Cai, Hong

    2016-10-01

    The development of the readout speed of CMOS pixel sensors (CPS) is motivated by the demanding requirements of future high energy physics (HEP) experiments. As the interface between CPS and the data acquisition (DAQ) system, which inputs clock from the DAQ system and outputs data from CPS, the signaling interface should also be improved in terms of data rates. Meanwhile, the power consumption of the signaling interface should be maintained as low as possible. Consequently, a reduced swing differential signaling (RSDS) driver was adopted instead of a low-voltage differential signaling (LVDS) driver to transmit data from CPS to the DAQ system. In order to increase the capability of data rates, a serial source termination technique was employed. A LVDS/RSDS receiver was employed for transmitting clock from the DAQ system to CPS. A new method of generating hysteresis and a special current comparator were used to achieve a higher speed with lower power consumption. The signaling interface was designed and submitted for fabrication in a 0.18 μm CMOS image sensor (CIS) process. Measurement results indicate that the RSDS driver and the LVDS receiver can operate correctly at a data rate of 2 Gb/s with a power consumption of 19.1 mW.

  9. From vertex detectors to inner trackers with CMOS pixel sensors

    NASA Astrophysics Data System (ADS)

    Besson, A.; Pérez, A. Pérez; Spiriti, E.; Baudot, J.; Claus, G.; Goffe, M.; Winter, M.

    2017-02-01

    The use of CMOS Pixel Sensors (CPS) for high resolution and low material vertex detectors has been validated with the 2014 and 2015 physics runs of the STAR-PXL detector at RHIC/BNL. This opens the door to the use of CPS for inner tracking devices, with 10-100 times larger sensitive area, which require therefore a sensor design privileging power saving, response uniformity and robustness. The 350 nm CMOS technology used for the STAR-PXL sensors was considered as too poorly suited to upcoming applications like the upgraded ALICE Inner Tracking System (ITS), which requires sensors with one order of magnitude improvement on readout speed and improved radiation tolerance. This triggered the exploration of a deeper sub-micron CMOS technology, Tower-Jazz 180 nm, for the design of a CPS well adapted for the new ALICE-ITS running conditions. This paper reports the R & D results for the conception of a CPS well adapted for the ALICE-ITS.

  10. Compensation for radiation damage of SOI pixel detector via tunneling

    NASA Astrophysics Data System (ADS)

    Yamada, M.; Arai, Y.; Fujita, Y.; Hamasaki, R.; Ikegami, Y.; Kurachi, I.; Miyoshi, T.; Nishimura, R.; Tauchi, K.; Tsuboyama, T.

    2016-09-01

    We are developing a method for removing holes trapped in the oxide layer of a silicon-on-insulator (SOI) monolithic pixel detector after irradiation. Radiation that passes through the detector generates positive charge by trapped holes in the buried oxide layer (BOX) underneath the MOSFET. The positive potential caused by these trapped holes modifies the characteristics of the MOSFET of the signal readout circuit. In order to compensate for the effect of the positive potential, we tried to recombine the trapped holes with electrons via Fowler-Nordheim (FN) tunneling. By applying high voltage to the buried p-well (BPW) under the oxide layer with the MOSFET fixed at 0 V, electrons are injected into the BOX by FN tunneling. X-rays cause a negative shift in the threshold voltage Vth of the MOSFET. We can successfully recover Vth close to its pre-irradiation level after applying VBPW ≥ 120 V. However, the drain leakage current increased after applying VBPW; we find that this can be suppressed by applying a negative voltage to the BPW.

  11. Results from a Prototype MAPS Sensor Telescope and Readout Systemwith Zero Suppression for the Heavy Flavor Tracker at STAR

    SciTech Connect

    Greiner, Leo C.; Matis, Howard S.; Ritter, Hans G.; Rose, AndrewA.; Stezelberger, Thorsten; Sun, Xiangming; Szelezniak, Michal A.; Thomas, James H.; Vu, Chinh Q.; Wieman, Howard H.

    2008-02-11

    We describe a three Mimostar-2 Monolithic Active PixelSensor (MAPS) sensor telescope prototype with an accompanying readoutsystem incorporating on-the-fly data sparsification. The system has beencharacterized and we report on the measured performance of the sensortelescope and readout system in beam tests conducted both at the AdvancedLight Source (ALS) at Lawrence Berkeley National Laboratory (LBNL) and inthe STAR experiment at the Relativistic Heavy Ion Collider (RHIC). Thiseffort is part of the development and prototyping work that will lead toa vertex detector for the STAR experiment.

  12. Minimum Variance Approaches to Ultrasound Pixel-Based Beamforming.

    PubMed

    Nguyen, Nghia Q; Prager, Richard W

    2017-02-01

    We analyze the principles underlying minimum variance distortionless response (MVDR) beamforming in order to integrate it into a pixel-based algorithm. There is a challenge posed by the low echo signal-to-noise ratio (eSNR) when calculating beamformer contributions at pixels far away from the beam centreline. Together with the well-known scarcity of samples for covariance matrix estimation, this reduces the beamformer performance and degrades the image quality. To address this challenge, we implement the MVDR algorithm in two different ways. First, we develop the conventional minimum variance pixel-based (MVPB) beamformer that performs the MVDR after the pixel-based superposition step. This involves a combination of methods in the literature, extended over multiple transmits to increase the eSNR. Then we propose the coherent MVPB beamformer, where the MVDR is applied to data within individual transmits. Based on pressure field analysis, we develop new algorithms to improve the data alignment and matrix estimation, and hence overcome the low-eSNR issue. The methods are demonstrated on data acquired with an ultrasound open platform. The results show the coherent MVPB beamformer substantially outperforms the conventional MVPB in a series of experiments, including phantom and in vivo studies. Compared to the unified pixel-based beamformer, the newest delay-and-sum algorithm in [1], the coherent MVPB performs well on regions that conform to the diffuse scattering assumptions on which the minimum variance principles are based. It produces less good results for parts of the image that are dominated by specular reflections.

  13. Performance of n-in-p Pixel Detectors Irradiated at Fluences up to 5x1015 neq/cm2 for the Future ATLAS Upgrades

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Gallrapp, C.; La Rosa, A.; Nisius, R.; Pernegger, H.; Richter, R. H.; Weigell, P.

    We present the results of the characterization of novel n-in-p planar pixel detectors, designed for the future upgrades of the ATLAS pixel system. N-in-p silicon devices are a promising candidate to replace the n-in-n sensors thanks to their radiation hardness and cost effectiveness, that allow for enlarging the area instrumented with pixel detectors. The n-in-p modules presented here are composed of pixel sensors produced by CiS connected by bump-bonding to the ATLAS readout chip FE-I3. The characterization of these devices has been performed with the ATLAS pixel read-out systems, TurboDAQ and USBPIX, before and after irradiation with 25 MeV protons and neutrons up to a fluence of 5x1015 neq/cm2. The charge collection measurements carried out with radioactive sources have proven the feasibility of employing this kind of detectors up to these particle fluences. The collected charge has been measured to be for any fluence in excess of twice the value of the FE-I3 threshold, tuned to 3200 e. The first results from beam test data with 120 GeV pions at the CERN-SPS are also presented, demonstrating a high tracking efficiency before irradiation and a high collected charge for a device irradiated at 1015 neq/cm2. This work has been performed within the framework of the RD50 Collaboration.

  14. A low-noise 64-channel front-end readout ASIC for CdZnTe detectors aimed to hard X-ray imaging systems

    NASA Astrophysics Data System (ADS)

    Gan, B.; Wei, T.; Gao, W.; Liu, H.; Hu, Y.

    2016-04-01

    In this paper, we report on the recent development of a 64-channel low-noise front-end readout ASIC for CdZnTe detectors aimed to hard X-ray imaging systems. The readout channel is comprised of a charge sensitive amplifier, a leakage current compensation circuit, a CR-RC shaper, two S-K filters, an inverse proportional amplifier, a peak-detect-and-hold circuit, a discriminator and trigger logic, a time sequence control circuit and a driving buffer. The readout ASIC is implemented in TSMC 0.35 μm mixed-signal CMOS technology, the die size of the prototype chip is 2.7 mm×8.0 mm. The overall gain of the readout channel is 200 mV/fC, the power consumption is less than 8 mW/channel, the linearity error is less than 1%, the inconsistency among the channels is less than 2.86%, and the equivalent noise charge of a typical channel is 66 e- at zero farad plus 14 e- per picofarad. By connecting this readout ASIC to an 8×8 pixel CdZnTe detector, we obtained an energy spectrum, the energy resolution of which is 4.5% at the 59.5 keV line of 241Am source.

  15. Sub-pixel mapping of water boundaries using pixel swapping algorithm (case study: Tagliamento River, Italy)

    NASA Astrophysics Data System (ADS)

    Niroumand-Jadidi, Milad; Vitti, Alfonso

    2015-10-01

    Taking the advantages of remotely sensed data for mapping and monitoring of water boundaries is of particular importance in many different management and conservation activities. Imagery data are classified using automatic techniques to produce maps entering the water bodies' analysis chain in several and different points. Very commonly, medium or coarse spatial resolution imagery is used in studies of large water bodies. Data of this kind is affected by the presence of mixed pixels leading to very outstanding problems, in particular when dealing with boundary pixels. A considerable amount of uncertainty inescapably occurs when conventional hard classifiers (e.g., maximum likelihood) are applied on mixed pixels. In this study, Linear Spectral Mixture Model (LSMM) is used to estimate the proportion of water in boundary pixels. Firstly by applying an unsupervised clustering, the water body is identified approximately and a buffer area considered ensuring the selection of entire boundary pixels. Then LSMM is applied on this buffer region to estimate the fractional maps. However, resultant output of LSMM does not provide a sub-pixel map corresponding to water abundances. To tackle with this problem, Pixel Swapping (PS) algorithm is used to allocate sub-pixels within mixed pixels in such a way to maximize the spatial proximity of sub-pixels and pixels in the neighborhood. The water area of two segments of Tagliamento River (Italy) are mapped in sub-pixel resolution (10m) using a 30m Landsat image. To evaluate the proficiency of the proposed approach for sub-pixel boundary mapping, the image is also classified using a conventional hard classifier. A high resolution image of the same area is also classified and used as a reference for accuracy assessment. According to the results, sub-pixel map shows in average about 8 percent higher overall accuracy than hard classification and fits very well in the boundaries with the reference map.

  16. It's not the pixel count, you fool

    NASA Astrophysics Data System (ADS)

    Kriss, Michael A.

    2012-01-01

    The first thing a "marketing guy" asks the digital camera engineer is "how many pixels does it have, for we need as many mega pixels as possible since the other guys are killing us with their "umpteen" mega pixel pocket sized digital cameras. And so it goes until the pixels get smaller and smaller in order to inflate the pixel count in the never-ending pixel-wars. These small pixels just are not very good. The truth of the matter is that the most important feature of digital cameras in the last five years is the automatic motion control to stabilize the image on the sensor along with some very sophisticated image processing. All the rest has been hype and some "cool" design. What is the future for digital imaging and what will drive growth of camera sales (not counting the cell phone cameras which totally dominate the market in terms of camera sales) and more importantly after sales profits? Well sit in on the Dark Side of Color and find out what is being done to increase the after sales profits and don't be surprised if has been done long ago in some basement lab of a photographic company and of course, before its time.

  17. A Readout Mechanism for Latency Codes.

    PubMed

    Zohar, Oran; Shamir, Maoz

    2016-01-01

    Response latency has been suggested as a possible source of information in the central nervous system when fast decisions are required. The accuracy of latency codes was studied in the past using a simplified readout algorithm termed the temporal-winner-take-all (tWTA). The tWTA is a competitive readout algorithm in which populations of neurons with a similar decision preference compete, and the algorithm selects according to the preference of the population that reaches the decision threshold first. It has been shown that this algorithm can account for accurate decisions among a small number of alternatives during short biologically relevant time periods. However, one of the major points of criticism of latency codes has been that it is unclear how can such a readout be implemented by the central nervous system. Here we show that the solution to this long standing puzzle may be rather simple. We suggest a mechanism that is based on reciprocal inhibition architecture, similar to that of the conventional winner-take-all, and show that under a wide range of parameters this mechanism is sufficient to implement the tWTA algorithm. This is done by first analyzing a rate toy model, and demonstrating its ability to discriminate short latency differences between its inputs. We then study the sensitivity of this mechanism to fine-tuning of its initial conditions, and show that it is robust to wide range of noise levels in the initial conditions. These results are then generalized to a Hodgkin-Huxley type of neuron model, using numerical simulations. Latency codes have been criticized for requiring a reliable stimulus-onset detection mechanism as a reference for measuring latency. Here we show that this frequent assumption does not hold, and that, an additional onset estimator is not needed to trigger this simple tWTA mechanism.

  18. A Readout Mechanism for Latency Codes

    PubMed Central

    Zohar, Oran; Shamir, Maoz

    2016-01-01

    Response latency has been suggested as a possible source of information in the central nervous system when fast decisions are required. The accuracy of latency codes was studied in the past using a simplified readout algorithm termed the temporal-winner-take-all (tWTA). The tWTA is a competitive readout algorithm in which populations of neurons with a similar decision preference compete, and the algorithm selects according to the preference of the population that reaches the decision threshold first. It has been shown that this algorithm can account for accurate decisions among a small number of alternatives during short biologically relevant time periods. However, one of the major points of criticism of latency codes has been that it is unclear how can such a readout be implemented by the central nervous system. Here we show that the solution to this long standing puzzle may be rather simple. We suggest a mechanism that is based on reciprocal inhibition architecture, similar to that of the conventional winner-take-all, and show that under a wide range of parameters this mechanism is sufficient to implement the tWTA algorithm. This is done by first analyzing a rate toy model, and demonstrating its ability to discriminate short latency differences between its inputs. We then study the sensitivity of this mechanism to fine-tuning of its initial conditions, and show that it is robust to wide range of noise levels in the initial conditions. These results are then generalized to a Hodgkin-Huxley type of neuron model, using numerical simulations. Latency codes have been criticized for requiring a reliable stimulus-onset detection mechanism as a reference for measuring latency. Here we show that this frequent assumption does not hold, and that, an additional onset estimator is not needed to trigger this simple tWTA mechanism. PMID:27812332

  19. PS-module prototypes with MPA-light readout chip for the CMS Tracker Phase 2 Upgrade

    NASA Astrophysics Data System (ADS)

    Grossmann, J.

    2017-02-01

    During the HL-LHC era an instantaneous luminosity of 5×1034 cm‑2s‑1 will be reached and possibly 3000 fb‑1 integrated luminosity will be delivered. This results in the requirement for a major upgrade of the CMS Outer Tracker detector. This contribution briefly reviews the module types and the front end readout electronics foreseen in the preparation program known as phase 2 upgrade. R&D towards the construction of full module prototypes for the Pixel-Strip (PS) module is ongoing. The module combines a macro-pixel sensor and a strip sensor and has pT -discrimination capability at module level. The current experience from module construction with a demonstrator assembly and initial laboratory testing with an alternative module concept for the PS-module is shown. A possible calibration method is introduced.

  20. Scintillation counter with WLS fiber readout

    NASA Astrophysics Data System (ADS)

    Bukin, D. A.; Druzhinin, V. P.; Golubev, V. B.; Serednyakov, S. I.

    1997-02-01

    The parameters of a cylindrical scintillation counter of 126 mm in diameter and 370 mm in length with wavelength shifter (WLS) fiber readout are presented. The fibers are glued into machined grooves along the scintillator. Light from both ends of the WLS fibers is transmitted to separate photomultipliers by 1 m long clear optical fibers. The average total signal, collected from both sides of the counter is equivalent to 8 photoelectrons per minimum ionizing particle. The described cylindrical scintillation counter is a part of inner system of collider detector SND.

  1. Spin readout of trapped electron qubits

    NASA Astrophysics Data System (ADS)

    Peng, Pai; Matthiesen, Clemens; Häffner, Hartmut

    2017-01-01

    We propose a scheme to read out the spin of a single electron quantum bit in a surface Paul trap using oscillating magnetic-field gradients. The readout sequence is composed of cooling, driving, amplification, and detection of the electron's motion. We study the scheme in the presence of noise and trap anharmonicities at liquid-helium temperatures. An analysis of the four procedures shows short measurement times (25 μ s ) and high fidelities (99.7 % ) are achievable with realistic experimental parameters. Our scheme performs the function of fluorescence detection in ion trapping schemes, highlighting the potential to build all-electric quantum computers based on trapped electron-spin qubits.

  2. ARTICLES: Optoelectronic readout with an injection laser

    NASA Astrophysics Data System (ADS)

    Luc, Vu V.; Eliseev, P. G.; Man'ko, Margarita A.; Mikaelyan, T. T.; Okhotnikov, O. G.; Sokolov, S. N.

    1982-09-01

    An investigation was made of the possibility of utilizing an injection heterolaser in optical devices for data retrieval. An injection laser was used both as a source and detector of its own radiation reflected from a data carrier (optoelectronic readout). The influence of the reflected radiation was due to quasisteady modulation of the Q factor of the resonator, which was accompanied by modulation of the voltage across the laser diode. A study was made of the influence of the pump current on the useful signal and it was found that this current was related to the differential resistance of the laser diode.

  3. Mass-based readout for agglutination assays

    NASA Astrophysics Data System (ADS)

    Chunara, Rumi; Godin, Michel; Knudsen, Scott M.; Manalis, Scott R.

    2007-11-01

    We present a mass-based readout for agglutination assays. The suspended microchannel resonator (SMR) is used to classify monomers and dimers that are formed during early stage aggregation, and to relate the total count to the analyte concentration. Using a model system of streptavidin functionalized microspheres and biotinylated antibody as the analyte, we obtain a dose-response curve over a concentration range of 0.63-630nM and show that the results are comparable to what has been previously achieved by image analysis and conventional flow cytometry.

  4. LISe pixel detector for neutron imaging

    NASA Astrophysics Data System (ADS)

    Herrera, Elan; Hamm, Daniel; Wiggins, Brenden; Milburn, Rob; Burger, Arnold; Bilheux, Hassina; Santodonato, Louis; Chvala, Ondrej; Stowe, Ashley; Lukosi, Eric

    2016-10-01

    Semiconducting lithium indium diselenide, 6LiInSe2 or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of 6Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 μm pitch on a 5×5×0.56 mm3 LISe substrate. An experimentally verified spatial resolution of 300 μm was observed utilizing a super-sampling technique.

  5. Per-Pixel Lighting Data Analysis

    SciTech Connect

    Inanici, Mehlika

    2005-08-01

    This report presents a framework for per-pixel analysis of the qualitative and quantitative aspects of luminous environments. Recognizing the need for better lighting analysis capabilities and appreciating the new measurement abilities developed within the LBNL Lighting Measurement and Simulation Toolbox, ''Per-pixel Lighting Data Analysis'' project demonstrates several techniques for analyzing luminance distribution patterns, luminance ratios, adaptation luminance and glare assessment. The techniques are the syntheses of the current practices in lighting design and the unique practices that can be done with per-pixel data availability. Demonstrated analysis techniques are applicable to both computer-generated and digitally captured images (physically-based renderings and High Dynamic Range photographs).

  6. High rate particle tracking and ultra-fast timing with a thin hybrid silicon pixel detector

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Aglieri Rinella, G.; Carassiti, V.; Ceccucci, A.; Cortina Gil, E.; Cotta Ramusino, A.; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Martin, E.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Perktold, L.; Petagna, P.; Petrucci, F.; Poltorak, K.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    2013-08-01

    The Gigatracker (GTK) is a hybrid silicon pixel detector designed for the NA62 experiment at CERN. The beam spectrometer, made of three GTK stations, has to sustain high and non-uniform particle rate (∼ 1 GHz in total) and measure momentum and angles of each beam track with a combined time resolution of 150 ps. In order to reduce multiple scattering and hadronic interactions of beam particles, the material budget of a single GTK station has been fixed to 0.5% X0. The expected fluence for 100 days of running is 2 ×1014 1 MeV neq /cm2, comparable to the one foreseen in the inner trackers of LHC detectors during 10 years of operation. To comply with these requirements, an efficient and very low-mass (< 0.15 %X0) cooling system is being constructed, using a novel microchannel cooling silicon plate. Two complementary read-out architectures have been produced as small-scale prototypes: one is based on a Time-over-Threshold circuit followed by a TDC shared by a group of pixels, while the other makes use of a constant-fraction discriminator followed by an on-pixel TDC. The read-out ASICs are produced in 130 nm IBM CMOS technology and will be thinned down to 100 μm or less. An overview of the Gigatracker detector system will be presented. Experimental results from laboratory and beam tests of prototype bump-bonded assemblies will be described as well. These results show a time resolution of about 170 ps for single hits from minimum ionizing particles, using 200 μm thick silicon sensors.

  7. Performance of thin pixel sensors irradiated up to a fluence of 1016 neq cm-2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Andricek, L.; Beimforde, M.; Moser, H.-G.; Nisius, R.; Richter, R. H.; Weigell, P.

    2011-09-01

    A new pixel module concept is presented, where thin sensors and a novel vertical integration technique are combined. This R&D activity is carried out in view of the ATLAS pixel detector upgrades. A first set of n-in-p pixel sensors with active thicknesses of 75 and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut Halbleiterlabor (HLL). Charge Collection Efficiency measurements have been performed, yielding a higher CCE than expected from the present radiation damage models. The interconnection of thin n-in-p pixels to the FE-I3 ATLAS electronics is under way, exploiting the Solid Liquid Interdiffusion (SLID) technique developed by the Fraunhofer Institut EMFT. In addition, preliminary studies aimed at Inter-Chip-Vias (ICV) etching into the FE-I3 electronics are reported. ICVs will be used to route the signals vertically through the read-out chip, to newly created pads on the backside. This should serve as a proof of principle for future four-side tileable pixel assemblies, avoiding the cantilever presently needed in the chip for the wire bonding.

  8. First measurement of the in-pixel electron multiplying with a standard imaging CMOS technology: Study of the EMCMOS concept

    NASA Astrophysics Data System (ADS)

    Brugière, Timothée; Mayer, Fréderic; Fereyre, Pierre; Guérin, Cyrille; Dominjon, Agnés; Barbier, Rémi

    2015-07-01

    Scientific low light imaging devices benefit today from designs for pushing the mean noise to the single electron level. When readout noise reduction reaches its limit, signal-to-noise ratio improvement can be driven by an electron multiplication process, driven by impact ionization, before adding the readout noises. This concept already implemented in CCD structures using extra-pixel shift registers can today be integrated inside each pixel in CMOS technology. The EBCMOS group at IPNL is in charge of the characterization of new prototypes developed by E2V using this concept: the electron multiplying CMOS (EMCMOS). The CMOS technology enables electron multiplication inside the photodiode itself, and thus, an overlap of the charge integration and multiplication. A new modeling has been developed to describe the output signal mean and variance after the impact ionization process in such a case. In this paper the feasibility of impact ionization process inside a 8 μm-pitch pixel is demonstrated. The new modeling is also validated by data and a value of 0.32% is obtained for the impact ionization parameter α with an electric field intensity of 24 V / μm.

  9. The Gigatracker: An ultra-fast and low-mass silicon pixel detector for the NA62 experiment

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Mapelli, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petrucci, F.; Riedler, P.; Aglieri Rinella, G.; Rivetti, A.; Tiuraniemi, S.

    2011-02-01

    The Gigatracker is a hybrid silicon pixel detector developed to track the highly intense NA62 hadron beam with a time resolution of 150 ps (rms). The beam spectrometer of the experiment is composed of three Gigatracker stations installed in vacuum in order to precisely measure momentum, time and direction of every traversing particle. Precise tracking demands a very low mass of the detector assembly ( <0.5% X0 per station) in order to limit multiple scattering and beam hadronic interactions. The high rate and especially the high timing precision requirements are very demanding: two R&D options are ongoing and the corresponding prototype read-out chips have been recently designed and produced in 0.13 μm CMOS technology. One solution makes use of a constant fraction discriminator and on-pixel analogue-based time-to-digital-converter (TDC); the other comprises a delay-locked loop based TDC placed at the end of each pixel column and a time-over-threshold discriminator with time-walk correction technique. The current status of the R&D program is overviewed and results from the prototype read-out chips test are presented.

  10. Large area pixel detector WIDEPIX with full area sensitivity composed of 100 Timepix assemblies with edgeless sensors

    NASA Astrophysics Data System (ADS)

    Jakubek, J.; Jakubek, M.; Platkevic, M.; Soukup, P.; Turecek, D.; Sykora, V.; Vavrik, D.

    2014-04-01

    The superior properties of the single particle counting semiconductor pixel detectors in radiation imaging are well known. They are namely: very high dynamic range due to digital counting, absence of integration and read-out noise, high spatial resolution and energy sensitivity. The major disadvantage of current pixel devices preventing their broad exploitation has been their relatively small sensitive area of few cm2. This disadvantage is often solved using tiling method placing many detector units side by side forming a large matrix. The current tiling techniques require rather large gaps of few millimeters between tiles. These gaps stand as areas insensitive to radiation which is acceptable only in some applications such as diffraction imaging. However standard transmission radiography requires fully continuous area sensitivity. In this article we present the new large area device WIDEPIX composed of a matrix of 10 × 10 tiles of silicon pixel detectors Timepix (each of 256 × 256 pixels with pitch of 55 μm) having fully sensitive area of 14.3 × 14.3 cm2 without any gaps between the tiles. The device contains a total of 6.5 mega pixels. This achievement was reached thanks to new technology of edgeless semiconductor sensors together with precise alignment technique and multilevel architecture of readout electronics. The mechanical construction of the device is fully modular and scalable. This concept allows replacing any single detector tile which significantly improves production yield. The first results in the field of X-ray radiography and material sensitive X-ray radiography are presented in this article.

  11. 14C autoradiography with an energy-sensitive silicon pixel detector.

    PubMed

    Esposito, M; Mettivier, G; Russo, P

    2011-04-07

    The first performance tests are presented of a carbon-14 ((14)C) beta-particle digital autoradiography system with an energy-sensitive hybrid silicon pixel detector based on the Timepix readout circuit. Timepix was developed by the Medipix2 Collaboration and it is similar to the photon-counting Medipix2 circuit, except for an added time-based synchronization logic which allows derivation of energy information from the time-over-threshold signal. This feature permits direct energy measurements in each pixel of the detector array. Timepix is bump-bonded to a 300 µm thick silicon detector with 256 × 256 pixels of 55 µm pitch. Since an energetic beta-particle could release its kinetic energy in more than one detector pixel as it slows down in the semiconductor detector, an off-line image analysis procedure was adopted in which the single-particle cluster of hit pixels is recognized; its total energy is calculated and the position of interaction on the detector surface is attributed to the centre of the charge cluster. Measurements reported are detector sensitivity, (4.11 ± 0.03) × 10(-3) cps mm(-2) kBq(-1) g, background level, (3.59 ± 0.01) × 10(-5) cps mm(-2), and minimum detectable activity, 0.0077 Bq. The spatial resolution is 76.9 µm full-width at half-maximum. These figures are compared with several digital imaging detectors for (14)C beta-particle digital autoradiography.

  12. A 400 KHz line rate 2048-pixel stitched SWIR linear array

    NASA Astrophysics Data System (ADS)

    Anchlia, Ankur; Vinella, Rosa M.; Gielen, Daphne; Wouters, Kristof; Vervenne, Vincent; Hooylaerts, Peter; Deroo, Pieter; Ruythooren, Wouter; De Gaspari, Danny; Das, Jo; Merken, Patrick

    2016-05-01

    Xenics has developed a family of stitched SWIR long linear arrays that operate up to 400 KHz of line rate. These arrays serve medical and industrial applications that require high line rates as well as space applications that require long linear arrays. The arrays are based on a modular ROIC design concept: modules of 512 pixels are stitched during fabrication to achieve 512, 1024 and 2048 pixel arrays. Each 512-pixel module has its own on-chip digital sequencer, analog readout chain and 4 output buffers. This modular concept enables a long array to run at a high line rates irrespective of the array length, which limits the line rate in a traditional linear array. The ROIC is flip-chipped with InGaAs detector arrays. The FPA has a pixel pitch of 12.5μm and has two pixel flavors: square (12.5μm) and rectangular (250μm). The frontend circuit is based on Capacitive Trans-impedance Amplifier (CTIA) to attain stable detector bias, and good linearity and signal integrity, especially at high speeds. The CTIA has an input auto-zero mechanism that allows to have low detector bias (<20mV). An on-chip Correlated Double Sample (CDS) facilitates removal of CTIA KTC and 1/f noise, and other offsets, achieving low noise performance. There are five gain modes in the FPA giving the full well range from 85Ke- to 40Me-. The measured input referred noise is 35e-rms in the highest gain mode. The FPA operates in Integrate While Read mode and, at a master clock rate of 60MHz and a minimum integration time of 1.4μs, achieves the highest line rate of 400 KHz. In this paper, design details and measurements results are presented in order to demonstrate the array performance.

  13. Heavily irradiated N-in-p thin planar pixel sensors with and without active edges

    NASA Astrophysics Data System (ADS)

    Terzo, S.; Andricek, L.; Macchiolo, A.; Moser, H. G.; Nisius, R.; Richter, R. H.; Weigell, P.

    2014-05-01

    We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 μm, produced at MPP/HLL, and 100-200 μm thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. They are interconnected to the ATLAS FE-I3 and FE-I4 read-out chips. Moreover, the n-in-p technology only requires a single side processing and thereby it is a cost-effective alternative to the n-in-n pixel technology presently employed in the LHC experiments. High precision beam test measurements of the hit efficiency have been performed on these devices both at the CERN SpS and at DESY, Hamburg. We studied the behavior of these sensors at different bias voltages and different beam incident angles up to the maximum one expected for the new Insertable B-Layer of ATLAS and for HL-LHC detectors. Results obtained with 150 μm thin sensors, assembled with the new ATLAS FE-I4 chip and irradiated up to a fluence of 4 × 1015 neq/cm2, show that they are excellent candidates for larger radii of the silicon pixel tracker in the upgrade of the ATLAS detector at HL-LHC. In addition, the active edge technology of the VTT devices maximizes the active area of the sensor and reduces the material budget to suit the requirements for the innermost layers. The edge pixel performance of VTT modules has been investigated at beam test experiments and the analysis after irradiation up to a fluence of 5 × 1015 neq/cm2 has been performed using radioactive sources in the laboratory.

  14. Improvements to the image processing of HST NICMOS observationswith multiple readouts

    SciTech Connect

    Fadeyev, Vitaliy; Aldering, Gregory; Perlmutter, Saul

    2005-07-01

    We report on improvements made to the standard NICMOS processing pipeline. The calculation of the uncertainties on the signal accumulation rate has been modified to include the statistical correlations between the consecutive readouts. In order to correct a problem with the existing cosmic ray rejection algorithm, we have developed and implemented a joint fit procedure, where the accumulating signal is fit as linear functions of time with the same rate both before and after the cosmic ray (CR) impact. We also accounted for inter-pixel correlations in the CR-affected region. The new processing is most relevant for deep observations of faint targets, and for PSF fitting, for which unbiased measurements of accurate error estimates are important. We show examples of these improvements for deep NIC2 images of high-redshift supernova from the Supernova Cosmology Project.

  15. The proposed trigger-less TBit/s readout for the Mu3e experiment

    NASA Astrophysics Data System (ADS)

    Bachmann, S.; Berger, N.; Blondel, A.; Bravar, S.; Buniatyan, A.; Dissertori, G.; Eckert, P.; Fischer, P.; Grab, C.; Gredig, R.; Hildebrandt, M.; Kettle, P.-R.; Kiehn, M.; Papa, A.; Perić, I.; Pohl, M.; Ritt, S.; Robmann, P.; Schöning, A.; Schultz-Coulon, H.-C.; Shen, W.; Shresta, S.; Stoykov, A.; Straumann, U.; Wallny, R.; Wiedner, D.; Windelband, B.

    2014-01-01

    The Mu3e experiment searches for charged lepton flavor violation in the rare decay μ→eee with a projected sensitivity of 10-16. A precise measurement of the decay product momenta, decay vertex and time is necessary for background suppression at rates of 109 muons/s. This can be achieved by combining an ultra-lightweight pixel tracker based on HV-MAPS with two timing systems. The trigger-less readout of the detector with three stages of FPGA-boards over multi GBit/s optical links into a GPU filter farm is presented. In this scheme data from all sub-detectors is merged and distributed in time slices to the filter farm.

  16. A CMOS readout integrated circuit with automatic deselecting function for IRFPA

    NASA Astrophysics Data System (ADS)

    Liu, Shanshan; Ding, Ruijun; Pang, Yulin; Chen, Zhe

    2009-11-01

    In this paper, a readout integrated circuit (ROIC) is presented for improving the operability of the LWIR arrays by using a super-pixel detector format scheme, identifying and deselecting the bad elements automatically. This ROIC features an input stage based on buffered direct injection (BDI) structure, which uses a differential stage to provide the inverting gain to improve linearity and to provide tight control of the detector bias. The threshold voltage of bad element de-selection is adjustable and the circuit could de-select the bad element automatically. The simulation result show that the bad sub-element de-selection precision is up to nearly 0.2nA when the threshold current is about 590.8nA. We analyze the errors affecting the precision and the calculated precision is 2nA. Finally, we discuss the bad sub-element de-selection precision in different integrating time.

  17. Readout of a LaBr 3:Ce continuous crystal by a MPPC array: First results

    NASA Astrophysics Data System (ADS)

    Scafè, R.; Cinti, M. N.; Di Lorenzo, P.; Zambotti, A.; Sacco, D.; Pisacane, F.; Bennati, P.; Miscioscia, R.; Pellegrini, R.; Pani, R.

    2009-07-01

    In this work preliminary results of single-photon measurements made with a LaBr3:Ce continuous scintillation crystal (BrilLanCe 380™, by Saint-Gobain Crystals, FR) coupled to an array of Multi-Pixel Photon Counters (MPPC™, by Hamamatsu Photonics, JP) are presented. The array of 7 MPPCs was realized as the innermost element of the hexagonal Anger-like structure suitable for growing to larger areas by adding peripheral elements. The design of MPPC electronic readout for position determination was based on Anger logic. Wide-band amplifiers (by MITEQ®, US) were used for signals conditioning. Digitized traces of background, 57Co and 133Ba collimated irradiation were captured, characterized and stored by using the data-logging capabilities of a WaveMaster Oscilloscope (by LeCroy, US). Results are presented in terms of energy response, position sensing and signals fall and rise times.

  18. Avalanche current read-out circuit for low jitter parallel photon timing.

    PubMed

    Crotti, M; Rech, I; Gulinatti, A; Ghioni, M

    2013-08-01

    We propose a novel circuit for single photon avalanche diode (SPAD) current read-out, for photon timing applications. The circuit consists of a single transistor trans-impedance amplifier with a GHz bandwidth: the feedback loop fixes the SPAD anode voltage and allows us to obtain a high time resolution with a very high equivalent current threshold (almost 700 μA). The trans-impedance stage is followed by a low pass filter that reduces the crosstalk of other on-chip detectors and makes the designed structure suitable for multi-detector systems. The discrete components prototype presented in this letter achieves a state-of-art resolution of 34.4 ps FWHM, presents negligible crosstalk between the different pixels and opens the way for the development of an integrated structure with a large number of channels.

  19. A novel algorithm for bad pixel detection and correction to improve quality and stability of geometric measurements

    NASA Astrophysics Data System (ADS)

    Celestre, R.; Rosenberger, M.; Notni, G.

    2016-11-01

    An algorithm for detection and individually substitution of bad pixels for further restoration of an image in the presence of such outliers without altering overall image texture is presented. This work presents three phases concerning image processing: bad pixel identification and mapping by means of linear regression and the coefficient of determination of the pixel output as a function of exposure time, local correction of the linear and angular coefficients of the outlier pixels based on their neighbourhood and, finally, image restoration. Simulation and experimental data were used as means of code benchmarking, showing satisfactory results.

  20. Pixels, Imagers and Related Fabrication Methods

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor); Cunningham, Thomas J. (Inventor)

    2014-01-01

    Pixels, imagers and related fabrication methods are described. The described methods result in cross-talk reduction in imagers and related devices by generating depletion regions. The devices can also be used with electronic circuits for imaging applications.

  1. Pixels, Imagers and Related Fabrication Methods

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor); Cunningham, Thomas J. (Inventor)

    2016-01-01

    Pixels, imagers and related fabrication methods are described. The described methods result in cross-talk reduction in imagers and related devices by generating depletion regions. The devices can also be used with electronic circuits for imaging applications.

  2. Fiber and crystals dual readout calorimeters

    NASA Astrophysics Data System (ADS)

    Cascella, Michele; Franchino, Silvia; Lee, Sehwook

    2016-11-01

    The RD52 (DREAM) collaboration is performing R&D on dual readout calorimetry techniques with the aim of improving hadronic energy resolution for future high energy physics experiments. The simultaneous detection of Cherenkov and scintillation light enables us to measure the electromagnetic fraction of hadron shower event-by-event. As a result, we could eliminate the main fluctuation which prevented from achieving precision energy measurement for hadrons. We have tested the performance of the lead and copper fiber prototypes calorimeters with various energies of electromagnetic particles and hadrons. During the beam test, we investigated the energy resolutions for electrons and pions as well as the identification of those particles in a longitudinally unsegmented calorimeter. Measurements were also performed on pure and doped PbWO4 crystals, as well as BGO and BSO, with the aim of realizing a crystal based dual readout detector. We will describe our results, focusing on the more promising properties of homogeneous media for the technique. Guidelines for additional developments on crystals will be also given. Finally we discuss the construction techniques that we have used to assemble our prototypes and give an overview of the ones that could be industrialized for the construction of a full hermetic calorimeter.

  3. Maximal Adaptive-Decision Speedups in Quantum-State Readout

    NASA Astrophysics Data System (ADS)

    D'Anjou, B.; Kuret, L.; Childress, L.; Coish, W. A.

    2016-01-01

    The average time T required for high-fidelity readout of quantum states can be significantly reduced via a real-time adaptive decision rule. An adaptive decision rule stops the readout as soon as a desired level of confidence has been achieved, as opposed to setting a fixed readout time tf . The performance of the adaptive decision is characterized by the "adaptive-decision speedup," tf/T . In this work, we reformulate this readout problem in terms of the first-passage time of a particle undergoing stochastic motion. This formalism allows us to theoretically establish the maximum achievable adaptive-decision speedups for several physical two-state readout implementations. We show that for two common readout schemes (the Gaussian latching readout and a readout relying on state-dependent decay), the speedup is bounded by 4 and 2, respectively, in the limit of high single-shot readout fidelity. We experimentally study the achievable speedup in a real-world scenario by applying the adaptive decision rule to a readout of the nitrogen-vacancy-center (NV-center) charge state. We find a speedup of ≈2 with our experimental parameters. In addition, we propose a simple readout scheme for which the speedup can, in principle, be increased without bound as the fidelity is increased. Our results should lead to immediate improvements in nanoscale magnetometry based on spin-to-charge conversion of the NV-center spin, and provide a theoretical framework for further optimization of the bandwidth of quantum measurements.

  4. Toward Multispectral Imaging with Colloidal Metasurface Pixels.

    PubMed

    Stewart, Jon W; Akselrod, Gleb M; Smith, David R; Mikkelsen, Maiken H

    2017-02-01

    Multispectral colloidal metasurfaces are fabricated that exhibit greater than 85% absorption and ≈100 nm linewidths by patterning film-coupled nanocubes in pixels using a fusion of bottom-up and top-down fabrication techniques over wafer-scale areas. With this technique, the authors realize a multispectral pixel array consisting of six resonances between 580 and 1125 nm and reconstruct an RGB image with 9261 color combinations.

  5. Study of PET Detector Performance with Varying SiPM Parameters and Readout Schemes.

    PubMed

    Li, Xiaoli; Lockhart, Cate; Lewellen, Tom K; Miyaoka, Robert S

    2011-01-01

    The spatial resolution performance characteristics of a monolithic crystal PET detector utilizing a sensor on the entrance surface (SES) design is reported. To facilitate this design, we propose to utilize a 2D silicon photomultiplier (SiPM) array device. Using a multi-step simulation process, we investigated the performance of a monolithic crystal PET detector with different data readout schemes and different SiPM parameters. The detector simulated was a 49.2mm by 49.2mm by 15mm LYSO crystal readout by a 12 by 12 array of 3.8mm by 3.8mm SiPM elements. A statistics based positioning (SBP) method was used for event positioning and depth of interaction (DOI) decoding. Although individual channel readout provided better spatial resolution, row-column summing is proposed to reduce the number of readout channels. The SiPM parameters investigated include photon detection efficiency (PDE) and gain variability between different channels; PDE and gain instability; and dark count noise. Of the variables investigated, the PDE shift of -3.2±0.7% and gain shift of -4±0.9% between detector testing and detector calibration had the most obvious impact on the detector performance, since it not only degraded the spatial resolution but also led to bias in positioning, especially at the edges of the crystal. The dark count noise also had an impact on the intrinsic spatial resolution. No data normalization is required for PDE variability of up to 12% FWHM and gain variability of up to 15% FWHM between SiPM channels. Based upon these results, a row-column summing readout scheme without data normalization will be used. Further, we plan to cool our detectors below room temperature to reduce dark count noise and to actively control the temperature of the SiPMs to reduce drifts in PDE and gain.

  6. Belle2Link: A Global Data Readout and Transmission for Belle II Experiment at KEK

    NASA Astrophysics Data System (ADS)

    Sun, Dehui; Liua, Zhen'an.; Zhao, Jingzhou; Xu, Hao

    The Belle II experiment is an upgrade of the Belle experiment at KEK B-Factory, which will be also upgraded to SuperKEKB with a luminosity of 8 x 1035 cm-2 s-1. Belle II will be composed of new detector components: a new pixel vertex detector (PXD), a significantly larger silicon vertex detector (SVD), new design of central drift chamber (CDC), new particle identification (PID) detector, an improved electromagnetic calorimeter (ECL), higher rate KL and muon detector (KLM), and also a completely new trigger (TRG) and data acquisition systems (DAQ) to handle data produced in a 40 times higher rate. The collaboration has decided to use serial data transmission and unified readout techniques to reach simple, reliable connections between Front-End Electronics (FEE) and DAQ system with easy maintenance. A so-called Belle2Link - a unified readout and high speed data transmission has been designed for use both in the FEE of all sub-detector systems and in DAQ system. Proto-types of key modules for a HS link with 3.125Gbps line rate and <10-16 Bit Error Rate had been designed together with firmware development based on which a model system with CDC detector system had been setup. Overall test with CDC detector prototype and DAQ file server system showed that the present design satisfies the experiment requirement. This paper describes the techniques and also some test results.

  7. Radiopurity assessment of the tracking readout for the NEXT double beta decay experiment

    NASA Astrophysics Data System (ADS)

    Cebrián, S.; Pérez, J.; Bandac, I.; Labarga, L.; Álvarez, V.; Barrado, A. I.; Bettini, A.; Borges, F. I. G. M.; Camargo, M.; Cárcel, S.; Cervera, A.; Conde, C. A. N.; Conde, E.; Dafni, T.; Díaz, J.; Esteve, R.; Fernandes, L. M. P.; Fernández, M.; Ferrario, P.; Ferreira, A. L.; Freitas, E. D. C.; Gehman, V. M.; Goldschmidt, A.; Gómez-Cadenas, J. J.; González-Díaz, D.; Gutiérrez, R. M.; Hauptman, J.; Hernando Morata, J. A.; Herrera, D. C.; Irastorza, I. G.; Laing, A.; Liubarsky, I.; López-March, N.; Lorca, D.; Losada, M.; Luzón, G.; Marí, A.; Martín-Albo, J.; Martínez, A.; Martínez-Lema, G.; Miller, T.; Monrabal, F.; Monserrate, M.; Monteiro, C. M. B.; Mora, F. J.; Moutinho, L. M.; Muñoz Vidal, J.; Nebot-Guinot, M.; Nygren, D.; Oliveira, C. A. B.; Ortiz de Solórzano, A.; Pérez Aparicio, J. L.; Querol, M.; Renner, J.; Ripoll, L.; Rodríguez, J.; Santos, F. P.; dos Santos, J. M. F.; Serra, L.; Shuman, D.; Simón, A.; Sofka, C.; Sorel, M.; Toledo, J. F.; Torrent, J.; Tsamalaidze, Z.; Veloso, J. F. C. A.; Villar, J. A.; Webb, R. C.; White, J. T.; Yahlali, N.

    2015-05-01

    The ``Neutrino Experiment with a Xenon Time-Projection Chamber'' (NEXT) is intended to investigate the neutrinoless double beta decay of 136Xe, which requires a severe suppression of potential backgrounds; therefore, an extensive screening and selection process is underway to control the radiopurity levels of the materials to be used in the experimental set-up of NEXT. The detector design combines the measurement of the topological signature of the event for background discrimination with the energy resolution optimization. Separate energy and tracking readout planes are based on different sensors: photomultiplier tubes for calorimetry and silicon multi-pixel photon counters for tracking. The design of a radiopure tracking plane, in direct contact with the gas detector medium, was specially challenging since the needed components like printed circuit boards, connectors, sensors or capacitors have typically, according to available information in databases and in the literature, activities too large for experiments requiring ultra-low background conditions. Here, the radiopurity assessment of tracking readout components based on gamma-ray spectroscopy using ultra-low background germanium detectors at the Laboratorio Subterr&aposaneo de Canfranc (Spain) is described. According to the obtained results, radiopure enough printed circuit boards made of kapton and copper, silicon photomultipliers and other required components, fulfilling the requirement of an overall background level in the region of interest of at most 8×10-4 counts keV-1 kg-1 y-1, have been identified.

  8. Characterization of an ultraviolet imaging detector with high event rate ROIC (HEROIC) readout

    NASA Astrophysics Data System (ADS)

    Nell, Nicholas; France, Kevin; Harwit, Alex; Bradley, Scott; Franka, Steve; Freymiller, Ed; Ebbets, Dennis

    2016-07-01

    We present characterization results from a photon counting imaging detector consisting of one microchannel plate (MCP) and an array of two readout integrated circuits (ROIC) that record photon position. The ROICs used in the position readout are the high event rate ROIC (HEROIC) devices designed to handle event rates up to 1 MHz per pixel, recently developed by the Ball Aerospace and Technologies Corporation in collaboration with the University of Colorado. An opaque cesium iodide (CsI) photocathode sensitive in the far-ultraviolet (FUV; 122-200 nm), is deposited on the upper surface of the MCP. The detector is characterized in a chamber developed by CU Boulder that is capable of illumination with vacuum-ultraviolet (VUV) monochromatic light and measurement of absolute ux with a calibrated photodiode. Testing includes investigation of the effects of adjustment of internal settings of the HEROIC devices including charge threshold, gain, and amplifier bias. The detector response to high count rates is tested. We report initial results including background, uniformity, and quantum detection efficiency (QDE) as a function of wavelength.

  9. Performance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging

    NASA Astrophysics Data System (ADS)

    Esposito, M.; Anaxagoras, T.; Konstantinidis, A. C.; Zheng, Y.; Speller, R. D.; Evans, P. M.; Allinson, N. M.; Wells, K.

    2014-07-01

    Recently CMOS active pixels sensors (APSs) have become a valuable alternative to amorphous silicon and selenium flat panel imagers (FPIs) in bio-medical imaging applications. CMOS APSs can now be scaled up to the standard 20 cm diameter wafer size by means of a reticle stitching block process. However, despite wafer scale CMOS APS being monolithic, sources of non-uniformity of response and regional variations can persist representing a significant challenge for wafer scale sensor response. Non-uniformity of stitched sensors can arise from a number of factors related to the manufacturing process, including variation of amplification, variation between readout components, wafer defects and process variations across the wafer due to manufacturing processes. This paper reports on an investigation into the spatial non-uniformity and regional variations of a wafer scale stitched CMOS APS. For the first time a per-pixel analysis of the electro-optical performance of a wafer CMOS APS is presented, to address inhomogeneity issues arising from the stitching techniques used to manufacture wafer scale sensors. A complete model of the signal generation in the pixel array has been provided and proved capable of accounting for noise and gain variations across the pixel array. This novel analysis leads to readout noise and conversion gain being evaluated at pixel level, stitching block level and in regions of interest, resulting in a coefficient of variation ⩽1.9%. The uniformity of the image quality performance has been further investigated in a typical x-ray application, i.e. mammography, showing a uniformity in terms of CNR among the highest when compared with mammography detectors commonly used in clinical practice. Finally, in order to compare the detection capability of this novel APS with the technology currently used (i.e. FPIs), theoretical evaluation of the detection quantum efficiency (DQE) at zero-frequency has been performed, resulting in a higher DQE for this

  10. Performance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging.

    PubMed

    Esposito, M; Anaxagoras, T; Konstantinidis, A C; Zheng, Y; Speller, R D; Evans, P M; Allinson, N M; Wells, K

    2014-07-07

    Recently CMOS active pixels sensors (APSs) have become a valuable alternative to amorphous silicon and selenium flat panel imagers (FPIs) in bio-medical imaging applications. CMOS APSs can now be scaled up to the standard 20 cm diameter wafer size by means of a reticle stitching block process. However, despite wafer scale CMOS APS being monolithic, sources of non-uniformity of response and regional variations can persist representing a significant challenge for wafer scale sensor response. Non-uniformity of stitched sensors can arise from a number of factors related to the manufacturing process, including variation of amplification, variation between readout components, wafer defects and process variations across the wafer due to manufacturing processes. This paper reports on an investigation into the spatial non-uniformity and regional variations of a wafer scale stitched CMOS APS. For the first time a per-pixel analysis of the electro-optical performance of a wafer CMOS APS is presented, to address inhomogeneity issues arising from the stitching techniques used to manufacture wafer scale sensors. A complete model of the signal generation in the pixel array has been provided and proved capable of accounting for noise and gain variations across the pixel array. This novel analysis leads to readout noise and conversion gain being evaluated at pixel level, stitching block level and in regions of interest, resulting in a coefficient of variation ⩽1.9%. The uniformity of the image quality performance has been further investigated in a typical x-ray application, i.e. mammography, showing a uniformity in terms of CNR among the highest when compared with mammography detectors commonly used in clinical practice. Finally, in order to compare the detection capability of this novel APS with the technology currently used (i.e. FPIs), theoretical evaluation of the detection quantum efficiency (DQE) at zero-frequency has been performed, resulting in a higher DQE for this

  11. Holographic imaging with single pixel sensor

    NASA Astrophysics Data System (ADS)

    Leportier, Thibault; Lee, Young Tack; Hwang, Do Kyung; Park, Min-Chul

    2016-09-01

    Imaging techniques based on CCD sensors presenting very high number of pixels enable to record images with high resolution. However, the huge storage load and high bandwidth required to store and transmit digital holographic information are technical bottlenecks that should be overcome for the future of holographic display. Techniques to capture images with single pixel sensors have been greatly improved recently with the development of compressive sensing algorithm (CS). Since interference patterns may be considered sparse, the number of measurements required to recover the information with CS is lower than the number of pixels of the reconstructed image. In addition, this method does not need any scanning system. One other advantage of single pixel imaging is that the cost of recording system can be dramatically reduced since high-resolution cameras are expensive while compressive sensing exploits only one pixel. In this paper, we present an imaging system based on phase-shifting holography. First, simulations were performed to confirm that hologram could be reconstructed by compressive sensing even if the number of measurements was smaller than the number of pixels. Then, experimental set-up was realized. Several holograms with different phase shifts introduced by quarter and half wave plates in the reference beam were acquired. We demonstrated that our system enables the reconstruction of the object.

  12. Simulation study of pixel detector charge digitization

    NASA Astrophysics Data System (ADS)

    Wang, Fuyue; Nachman, Benjamin; Sciveres, Maurice; Lawrence Berkeley National Laboratory Team

    2017-01-01

    Reconstruction of tracks from nearly overlapping particles, called Tracking in Dense Environments (TIDE), is an increasingly important component of many physics analyses at the Large Hadron Collider as signatures involving highly boosted jets are investigated. TIDE makes use of the charge distribution inside a pixel cluster to resolve tracks that share one of more of their pixel detector hits. In practice, the pixel charge is discretized using the Time-over-Threshold (ToT) technique. More charge information is better for discrimination, but more challenging for designing and operating the detector. A model of the silicon pixels has been developed in order to study the impact of the precision of the digitized charge distribution on distinguishing multi-particle clusters. The output of the GEANT4-based simulation is used to train neutral networks that predict the multiplicity and location of particles depositing energy inside one cluster of pixels. By studying the multi-particle cluster identification efficiency and position resolution, we quantify the trade-off between the number of ToT bits and low-level tracking inputs. As both ATLAS and CMS are designing upgraded detectors, this work provides guidance for the pixel module designs to meet TIDE needs. Work funded by the China Scholarship Council and the Office of High Energy Physics of the U.S. Department of Energy under contract DE-AC02-05CH11231.

  13. Steganography based on pixel intensity value decomposition

    NASA Astrophysics Data System (ADS)

    Abdulla, Alan Anwar; Sellahewa, Harin; Jassim, Sabah A.

    2014-05-01

    This paper focuses on steganography based on pixel intensity value decomposition. A number of existing schemes such as binary, Fibonacci, Prime, Natural, Lucas, and Catalan-Fibonacci (CF) are evaluated in terms of payload capacity and stego quality. A new technique based on a specific representation is proposed to decompose pixel intensity values into 16 (virtual) bit-planes suitable for embedding purposes. The proposed decomposition has a desirable property whereby the sum of all bit-planes does not exceed the maximum pixel intensity value, i.e. 255. Experimental results demonstrate that the proposed technique offers an effective compromise between payload capacity and stego quality of existing embedding techniques based on pixel intensity value decomposition. Its capacity is equal to that of binary and Lucas, while it offers a higher capacity than Fibonacci, Prime, Natural, and CF when the secret bits are embedded in 1st Least Significant Bit (LSB). When the secret bits are embedded in higher bit-planes, i.e., 2nd LSB to 8th Most Significant Bit (MSB), the proposed scheme has more capacity than Natural numbers based embedding. However, from the 6th bit-plane onwards, the proposed scheme offers better stego quality. In general, the proposed decomposition scheme has less effect in terms of quality on pixel value when compared to most existing pixel intensity value decomposition techniques when embedding messages in higher bit-planes.

  14. Focal plane array with modular pixel array components for scalability

    SciTech Connect

    Kay, Randolph R; Campbell, David V; Shinde, Subhash L; Rienstra, Jeffrey L; Serkland, Darwin K; Holmes, Michael L

    2014-12-09

    A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

  15. Characterization of a pixelated CdTe Timepix detector operated in ToT mode

    NASA Astrophysics Data System (ADS)

    Billoud, T.; Leroy, C.; Papadatos, C.; Pichotka, M.; Pospisil, S.; Roux, J. S.

    2017-01-01

    A 1 mm thick CdTe sensor bump-bonded to a Timepix readout chip operating in Time-over-Threshold (ToT) mode has been characterized in view of possible applications in particle and medical physics. The CdTe sensor layer was segmented into 256 × 256 pixels, with a pixel pitch of 55 μm. This CdTe Timepix device, of ohmic contact type, has been exposed to alpha-particles and photons from an 241Am source, photons from a 137Cs source, and protons of different energies (0.8–10 MeV) delivered by the University of Montreal Tandem Accelerator. The device was irradiated on the negatively biased backside electrode. An X-ray per-pixel calibration commonly used for this type of detector was done and its accuracy and resolution were assessed and compared to those of a 300 μm thick silicon Timepix device. The electron mobility-lifetime product (μeτe) of CdTe for protons of low energy has been obtained from the Hecht equation. Possible polarization effects have been also investigated. Finally, information about the homogeneity of the detector was obtained from X-ray irradiation.

  16. Amplified pixel sensor architectures for low dose computed tomography using silicon thin film technology

    NASA Astrophysics Data System (ADS)

    Taghibakhsh, F.; Karim, K. S.

    2007-03-01

    Cone beam computed tomography (CBCT) has been recently reported using flat panel imagers (FPI). Here, detector technology capable of high speed imaging, high spatial resolution, large volume coverage, better contrast resolution and, in particular, lowered patient dose is required. Employing active matrix flat panel imagers (AMFPIs) as cone beam CT detectors has been proposed as a solution for improving volume coverage, contrast and resolution; however, clinical evaluations have shown that they suffer from low speed read out. Unlike passive pixel architecture which is currently the state-of-the-art technology for AMFPIs, our preliminary studies have shown that novel amplified pixel sensor (APS) architectures can overcome the low readout speed, and moreover, they provide gain which can be traded for higher frame rate and lower X-ray doses. Although APS architectures can meet the high dynamic range and low noise requirements of CT imaging, linearity and variations between pixel characteristics are major issues. In this study we will investigate novel APS architectures to address these concerns.

  17. The Belle-II Depfet Pixel Detector at the Superkekb Flavour Factory

    NASA Astrophysics Data System (ADS)

    Heindl, Stefan

    2012-08-01

    The ongoing upgrade of the asymmetric electron positron collider KEKB also requires extensive detector upgrades to cope with the new design luminosity of 8 · 1035 cm-2 · s-1 · Of critical importance is the new silicon pixel vertex tracker, which will significantly improve the decay vertex resolution, crucial for time dependent CP violation measurements. This new detector will consist of two layers of DEPFET pixel seii8ors very close to the interaction point. These sensors combine both particle detection and amplification of the signal by embedding a field effect transistor into a 75 μm thick fully depleted silicon substrate, providing very high signal to noise ratios and excellent spatial resolution. Using this technology satisfies the given requirements of extremely low material and high radiation tolerance at the new Belle II experiment. The power dissipation due to continuous readout at high rate and spatial constraints also give strict requirements for the mechanical support and cooling of the new detector. We will discuss the overall concept of the pixel vertex tracker, its expected performance and the challenging mechanical integration.

  18. The ALPIDE pixel sensor chip for the upgrade of the ALICE Inner Tracking System

    NASA Astrophysics Data System (ADS)

    Aglieri Rinella, Gianluca

    2017-02-01

    The ALPIDE chip is a CMOS Monolithic Active Pixel Sensor being developed for the Upgrade of the ITS of the ALICE experiment at the CERN Large Hadron Collider. The ALPIDE chip is implemented with a 180 nm CMOS Imaging Process and fabricated on substrates with a high-resistivity epitaxial layer. It measures 15 mm×30 mm and contains a matrix of 512×1024 pixels with in-pixel amplification, shaping, discrimination and multi-event buffering. The readout of the sensitive matrix is hit driven. There is no signaling activity over the matrix if there are no hits to read out and power consumption is proportional to the occupancy. The sensor meets the experimental requirements of detection efficiency above 99%, fake-hit probability below 10-5 and a spatial resolution of 5 μm. The capability to read out Pb-Pb interactions at 100 kHz is provided. The power density of the ALPIDE chip is projected to be less than 35 mW/cm2 for the application in the Inner Barrel Layers and below 20 mW/cm2 for the Outer Barrel Layers, where the occupancy is lower. This contribution describes the architecture and the main features of the final ALPIDE chip, planned for submission at the beginning of 2016. Early results from the experimental qualification of full scale prototype predecessors are also reported.

  19. Development of N+ in P pixel sensors for a high-luminosity large hadron collider

    NASA Astrophysics Data System (ADS)

    Kamada, Shintaro; Yamamura, Kazuhisa; Unno, Yoshinobu; Ikegami, Yoichi

    2014-11-01

    Hamamatsu Photonics K. K. is developing an N+ in a p planar pixel sensor with high radiation tolerance for the high-luminosity large hadron collider (HL-LHC). The N+ in the p planar pixel sensor is a candidate for the HL-LHC and offers the advantages of high radiation tolerance at a reasonable price compared with the N+ in an n planar sensor, the three-dimensional sensor, and the diamond sensor. However, the N+ in the p planar pixel sensor still presents some problems that need to be solved, such as its slim edge and the danger of sparks between the sensor and readout integrated circuit. We are now attempting to solve these problems with wafer-level processes, which is important for mass production. To date, we have obtained a 250-μm edge with an applied bias voltage of 1000 V. To protect against high-voltage sparks from the edge, we suggest some possible designs for the N+ edge.

  20. Response of a hybrid pixel detector (MEDIPIX3) to different radiation sources for medical applications

    NASA Astrophysics Data System (ADS)

    Chumacero, E. Miguel; De Celis Alonso, B.; Martínez Hernández, M. I.; Vargas, G.; Moreno Barbosa, F.; Moreno Barbosa, E.

    2014-11-01

    The development in semiconductor CMOS technology has enabled the creation of sensitive detectors for a wide range of ionizing radiation. These devices are suitable for photon counting and can be used in imaging and tomography X-ray diagnostics. The Medipix[1] radiation detection system is a hybrid silicon pixel chip developed for particle tracking applications in High Energy Physics. Its exceptional features (high spatial and energy resolution, embedded ultra fast readout, different operation modes, etc.) make the Medipix an attractive device for applications in medical imaging. In this work the energy characterization of a third-generation Medipix chip (Medipix3) coupled to a silicon sensor is presented. We used different radiation sources (strontium 90, iron 55 and americium 241) to obtain the response curve of the hybrid detector as a function of energy. We also studied the contrast of the Medipix as a measure of pixel noise. Finally we studied the response to fluorescence X rays from different target materials (In, Pd and Cd) for the two data acquisition modes of the chip; single pixel mode and charge summing mode.

  1. Response of a hybrid pixel detector (MEDIPIX3) to different radiation sources for medical applications

    SciTech Connect

    Chumacero, E. Miguel; De Celis Alonso, B.; Martínez Hernández, M. I.; Vargas, G.; Moreno Barbosa, E.; Moreno Barbosa, F.

    2014-11-07

    The development in semiconductor CMOS technology has enabled the creation of sensitive detectors for a wide range of ionizing radiation. These devices are suitable for photon counting and can be used in imaging and tomography X-ray diagnostics. The Medipix[1] radiation detection system is a hybrid silicon pixel chip developed for particle tracking applications in High Energy Physics. Its exceptional features (high spatial and energy resolution, embedded ultra fast readout, different operation modes, etc.) make the Medipix an attractive device for applications in medical imaging. In this work the energy characterization of a third-generation Medipix chip (Medipix3) coupled to a silicon sensor is presented. We used different radiation sources (strontium 90, iron 55 and americium 241) to obtain the response curve of the hybrid detector as a function of energy. We also studied the contrast of the Medipix as a measure of pixel noise. Finally we studied the response to fluorescence X rays from different target materials (In, Pd and Cd) for the two data acquisition modes of the chip; single pixel mode and charge summing mode.

  2. Investigation of Depth of Interaction Encoding for a Pixelated LSO Array with a Single Multi-Channel PMT

    PubMed Central

    Yang, Yongfeng; Wu, Yibao; Cherry, Simon R.

    2009-01-01

    A new approach to depth of interaction (DOI) encoding for a pixelated LSO array using a single multi-channel PMT was investigated. In this method the DOI information was estimated by taking advantage of optical crosstalk between LSO elements and examining the standard deviation (spread) of signals on all channels of the PMT. Unpolished and polished 6×6 LSO arrays with a crystal size of 1.3×1.3×20 mm3 were evaluated on a Hamamatsu H7546 64-channel PMT. The arrays were placed on the center of the PMT and the central 16 channels of the PMT were individually read out and digitized. For the unpolished array, all crystals were resolved in the flood histogram. An average DOI resolution of 8 mm was obtained. The energy resolution was ∼25% after the signal amplitude was corrected using the measured DOI information. For the polished array, the flood histogram was superior to the unpolished array, however no DOI information could be measured. Using unpolished crystals, this method could be a practical way to achieve limited DOI information in PET detectors. The standard deviation of all PMT channels can be readily obtained using a resistor network. Only five signals (four signals to determine the x-y position and one signal measuring the standard deviation) need to be digitized, and this method only requires a single photon detector to read out the array. Unlike phoswich detectors, the method does not require segmenting the scintillator array into layers. The measured DOI resolution was much worse than that obtained with the dual-ended readout method, however, it was similar to that obtained with a two-layer phoswich detector. PMID:20046796

  3. Investigation of Depth of Interaction Encoding for a Pixelated LSO Array with a Single Multi-Channel PMT.

    PubMed

    Yang, Yongfeng; Wu, Yibao; Cherry, Simon R

    2009-10-07

    A new approach to depth of interaction (DOI) encoding for a pixelated LSO array using a single multi-channel PMT was investigated. In this method the DOI information was estimated by taking advantage of optical crosstalk between LSO elements and examining the standard deviation (spread) of signals on all channels of the PMT. Unpolished and polished 6×6 LSO arrays with a crystal size of 1.3×1.3×20 mm(3) were evaluated on a Hamamatsu H7546 64-channel PMT. The arrays were placed on the center of the PMT and the central 16 channels of the PMT were individually read out and digitized. For the unpolished array, all crystals were resolved in the flood histogram. An average DOI resolution of 8 mm was obtained. The energy resolution was ∼25% after the signal amplitude was corrected using the measured DOI information. For the polished array, the flood histogram was superior to the unpolished array, however no DOI information could be measured. Using unpolished crystals, this method could be a practical way to achieve limited DOI information in PET detectors. The standard deviation of all PMT channels can be readily obtained using a resistor network. Only five signals (four signals to determine the x-y position and one signal measuring the standard deviation) need to be digitized, and this method only requires a single photon detector to read out the array. Unlike phoswich detectors, the method does not require segmenting the scintillator array into layers. The measured DOI resolution was much worse than that obtained with the dual-ended readout method, however, it was similar to that obtained with a two-layer phoswich detector.

  4. Read-out electronics for DC squid magnetic measurements

    DOEpatents

    Ganther, Jr., Kenneth R.; Snapp, Lowell D.

    2002-01-01

    Read-out electronics for DC SQUID sensor systems, the read-out electronics incorporating low Johnson noise radio-frequency flux-locked loop circuitry and digital signal processing algorithms in order to improve upon the prior art by a factor of at least ten, thereby alleviating problems caused by magnetic interference when operating DC SQUID sensor systems in magnetically unshielded environments.

  5. Some studies of avalanche photodiode readout of fast scintillators

    SciTech Connect

    Holl, I.; Lorenz, E.; Natkaniez, S.; Renker, D.; Schmelz, C. |; Schwartz, B.

    1995-08-01

    Photomultipliers (PMs) are the classical readout element for scintillation detectors in high energy particle physics, nuclear physics, medical physics, industrial radiation monitors etc. Here, large area avalanche photodiodes with high performance, narrow operation tolerances and high reliability have recently become available. The authors report on some tests of their performance in the readout of fast scintillators.

  6. 4K×4K format 10μm pixel pitch H4RG-10 hybrid CMOS silicon visible focal plane array for space astronomy

    NASA Astrophysics Data System (ADS)

    Bai, Yibin; Tennant, William; Anglin, Selmer; Wong, Andre; Farris, Mark; Xu, Min; Holland, Eric; Cooper, Donald; Hosack, Joseph; Ho, Kenneth; Sprafke, Thomas; Kopp, Robert; Starr, Brian; Blank, Richard; Beletic, James W.; Luppino, Gerard A.

    2012-07-01

    Teledyne’s silicon hybrid CMOS focal plane array technology has matured into a viable, high performance and high- TRL alternative to scientific CCD sensors for space-based applications in the UV-visible-NIR wavelengths. This paper presents the latest results from Teledyne’s low noise silicon hybrid CMOS visible focal place array produced in 4K×4K format with 10 μm pixel pitch. The H4RG-10 readout circuit retains all of the CMOS functionality (windowing, guide mode, reference pixels) and heritage of its highly successful predecessor (H2RG) developed for JWST, with additional features for improved performance. Combined with a silicon PIN detector layer, this technology is termed HyViSI™ (Hybrid Visible Silicon Imager). H4RG-10 HyViSI™ arrays achieve high pixel interconnectivity (<99.99%), low readout noise (<10 e- rms single CDS), low dark current (<0.5 e-/pixel/s at 193K), high quantum efficiency (<90% broadband), and large dynamic range (<13 bits). Pixel crosstalk and interpixel capacitance (IPC) have been predicted using detailed models of the hybrid structure and these predictions have been confirmed by measurements with Fe-55 Xray events and the single pixel reset technique. For a 100-micron thick detector, IPC of less than 3% and total pixel crosstalk of less than 7% have been achieved for the HyViSI™ H4RG-10. The H4RG-10 array is mounted on a lightweight silicon carbide (SiC) package and has been qualified to Technology Readiness Level 6 (TRL-6). As part of space qualification, the HyViSI™ H4RG-10 array passed radiation testing for low earth orbit (LEO) environment.

  7. Automatic Extraction of Closed Pixel Clusters for Target Cueing in Hyperspectral Images

    SciTech Connect

    Paglieroni, D W; Perkins, D E

    2001-06-05

    Traditional algorithms for automatic target cueing (ATC) in hyperspectral images, such as the RX algorithm, treat anomaly detection as a simple hypothesis testing problem. Each decision threshold gives rise to a different set of anomalous pixels. The clustered Rx algorithm generates target cues by grouping anomalous pixels into spatial clusters, and retaining only those clusters that satisfy target specific spatial constraints. It produces one set of target cues for each of several decision thresholds, and conservatively requires {Omicron}(K{sup 2}) operations per pixel, where K is the number of spectral bands (which varies from hundreds to thousands in hyperspectral images). A novel ATC algorithm, known as ''Pixel Cluster Cueing'' (PCC), is discussed. PCC groups pixels into clusters based on spectral similarity and spatial proximity, and then selects only those clusters that satisfy target-specific spatial constraints as target cues. PCC requires only {Omicron}(K) operations per pixel, and it produces only one set of target cues because it is not an anomaly detection algorithm, i.e., it does not use a decision threshold to classify individual pixels as anomalies. PCC is compared both computationally and statistically to the RX algorithm.

  8. Pixel CdTe semiconductor module to implement a sub-MeV imaging detector for astrophysics

    NASA Astrophysics Data System (ADS)

    Gálvez, J.-L.; Hernanz, M.; Álvarez, L.; Artigues, B.; Álvarez, J.-M.; Ullán, M.; Pellegrini, G.; Lozano, M.; Cabruja, E.; Martínez, R.; Chmeissani, M.; Puigdengoles, C.

    2017-03-01

    Stellar explosions are relevant and interesting astrophysical phenomena. Since long ago we have been working on the characterization of nova and supernova explosions in X and gamma rays, with the use of space missions such as INTEGRAL, XMM-Newton and Swift. We have been also involved in feasibility studies of future instruments in the energy range from several keV up to a few MeV, in collaboration with other research institutes, such as GRI, DUAL and e-ASTROGAM. High sensitivities are essential to perform detailed studies of cosmic explosions and cosmic accelerators, e.g., Supernovae, Classical Novae, Supernova Remnants (SNRs), Gamma-Ray Bursts (GRBs). In order to fulfil the combined requirement of high detection efficiency with good spatial and energy resolution, an initial module prototype based on CdTe pixel detectors is being developed. The detector dimensions are 12.5mm x 12.5mm x 2mm, with a pixel pitch of 1mm x 1mm. Each pixel is bump bonded to a fanout board made of Sapphire substrate and routed to the corresponding input channel of the readout ASIC, to measure pixel position and pulse height for each incident gamma-ray photon. An ohmic CdTe pixel detector has been characterised by means of 57Co, 133Ba and 22Na sources. Based on this, its spectroscopic performance and the influence of charge sharing is reported here. The pixel study is complemented by the simulation of the CdTe module performance using the GEANT 4 and MEGALIB tools, which will help us to optimise the pixel size selection.

  9. A novel readout system for wireless passive pressure sensors

    NASA Astrophysics Data System (ADS)

    Zhang, Huixin; Hong, Yingping; Ge, Binger; Liang, Ting; Xiong, Jijun

    2014-03-01

    This paper presents a novel readout system for wireless passive pressure sensors based on the inductively coupled inductor and cavity (LC) resonant circuits. The proposed system consists of a reader antenna inductively coupled to the sensor circuit, a readout circuit, and a personal computer (PC) post processing unit. The readout circuit generates a voltage signal representing the sensor's capacitance. The frequency of the reader antenna driving signal is a constant, which is equal to the sensor's resonant frequency at zero pressure. Based on mechanical and electrical modeling, the pressure sensor design based on the high temperature co-fired ceramic (HTCC) technology is conducted and discussed. The functionality and accuracy of the readout system are tested with a voltage-capacitance measurement system and demonstrated in a realistic pressure measurement environment, so that the overall performance and the feasibility of the readout system are proved.

  10. Demosaiced pixel super-resolution for multiplexed holographic color imaging

    NASA Astrophysics Data System (ADS)

    Wu, Yichen; Zhang, Yibo; Luo, Wei; Ozcan, Aydogan

    2016-06-01

    To synthesize a holographic color image, one can sequentially take three holograms at different wavelengths, e.g., at red (R), green (G) and blue (B) parts of the spectrum, and digitally merge them. To speed up the imaging process by a factor of three, a Bayer color sensor-chip can also be used to demultiplex three wavelengths that simultaneously illuminate the sample and digitally retrieve individual set of holograms using the known transmission spectra of the Bayer color filters. However, because the pixels of different channels (R, G, B) on a Bayer color sensor are not at the same physical location, conventional demosaicing techniques generate color artifacts in holographic imaging using simultaneous multi-wavelength illumination. Here we demonstrate that pixel super-resolution can be merged into the color de-multiplexing process to significantly suppress the artifacts in wavelength-multiplexed holographic color imaging. This new approach, termed Demosaiced Pixel Super-Resolution (D-PSR), generates color images that are similar in performance to sequential illumination at three wavelengths, and therefore improves the speed of holographic color imaging by 3-fold. D-PSR method is broadly applicable to holographic microscopy applications, where high-resolution imaging and multi-wavelength illumination are desired.

  11. First results from electrical qualification measurements on DEPFET pixel detector

    NASA Astrophysics Data System (ADS)

    Majewski, Petra; Andricek, Ladislav; Lauf, Thomas; Lechner, Peter; Lutz, Gerhard; Reiffers, Jonas; Richter, Rainer; Schaller, Gerhard; Schnecke, Martina; Schopper, Florian; Soltau, Heike; Stefanescu, Alexander; Strüder, Lothar; Treis, Johannes

    2010-07-01

    We report on the first results from a new setup for electrical qualification measurements of DEPFET pixel detector matrices. In order to measure the transistor properties of all pixels, the DEPFET device is placed into a benchtest setup and electrically contacted via a probecard. Using a switch matrix, each pixel of the detector array can be addressed individually for characterization. These measurements facilitate to pre-select the best DEPFET matrices as detector device prior to the mounting of the matrix and allow to investigate topics like the homogeneity of transistor parameters on device, wafer and batch level in order to learn about the stability and reproducibility of the production process. Especially with regard to the detector development for the IXO Wide Field Imager (WFI), this yield learning will be an important tool. The first electrical qualification measurements with this setup were done on DEPFET macropixel detector flight hardware, which will form the FPAs of the Mercury Imaging X-ray Spectrometer (MIXS) on board of the 5th ESA cornerstone mission BepiColombo. The DEPFET array consists of 64×64 macropixel for which the transfer, output and clear characteristics were measured.

  12. Demosaiced pixel super-resolution for multiplexed holographic color imaging

    PubMed Central

    Wu, Yichen; Zhang, Yibo; Luo, Wei; Ozcan, Aydogan

    2016-01-01

    To synthesize a holographic color image, one can sequentially take three holograms at different wavelengths, e.g., at red (R), green (G) and blue (B) parts of the spectrum, and digitally merge them. To speed up the imaging process by a factor of three, a Bayer color sensor-chip can also be used to demultiplex three wavelengths that simultaneously illuminate the sample and digitally retrieve individual set of holograms using the known transmission spectra of the Bayer color filters. However, because the pixels of different channels (R, G, B) on a Bayer color sensor are not at the same physical location, conventional demosaicing techniques generate color artifacts in holographic imaging using simultaneous multi-wavelength illumination. Here we demonstrate that pixel super-resolution can be merged into the color de-multiplexing process to significantly suppress the artifacts in wavelength-multiplexed holographic color imaging. This new approach, termed Demosaiced Pixel Super-Resolution (D-PSR), generates color images that are similar in performance to sequential illumination at three wavelengths, and therefore improves the speed of holographic color imaging by 3-fold. D-PSR method is broadly applicable to holographic microscopy applications, where high-resolution imaging and multi-wavelength illumination are desired. PMID:27353242

  13. Spatial clustering of pixels of a multispectral image

    DOEpatents

    Conger, James Lynn

    2014-08-19

    A method and system for clustering the pixels of a multispectral image is provided. A clustering system computes a maximum spectral similarity score for each pixel that indicates the similarity between that pixel and the most similar neighboring. To determine the maximum similarity score for a pixel, the clustering system generates a similarity score between that pixel and each of its neighboring pixels and then selects the similarity score that represents the highest similarity as the maximum similarity score. The clustering system may apply a filtering criterion based on the maximum similarity score so that pixels with similarity scores below a minimum threshold are not clustered. The clustering system changes the current pixel values of the pixels in a cluster based on an averaging of the original pixel values of the pixels in the cluster.

  14. A buffer direct injection and direct injection readout circuit with mode selection design for infrared focal plane arrays

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Kang, Lai-Li; Shieh, Hsiu-Li

    2014-03-01

    This paper proposes a solution to the excessive area penalty associated with traditional buffer direct injection (BDI) for single pixel. The proposed solution reduces the area and power consumption of BDI to combine the direct injection (DI) within a shared architecture, while a dual-mode readout circuit expands the functionality and performance of the array readout circuit of infrared sensor. An experimental array of 10 × 8 readout circuits was fabricated using TSMC 2P4M 0.35 μm 5 V technology. Measurements were obtained using a main clock with a frequency of 3 MHz and power consumption of 9.94 mW. The minimum input current was 119 pA in BDI and 1.85 pA in DI. The signal swing was 2 V, the root mean square noise voltage was 1.84 mV, and the signal-to-noise ratio was 60 dB. This approach is applicable to mid- and long-band sensors to increase injection efficiency and resolution.

  15. Digital readout integrated circuit (DROIC) implementing time delay and integration (TDI) for scanning type infrared focal plane arrays (IRFPAs)

    NASA Astrophysics Data System (ADS)

    Ceylan, Omer; Shafique, Atia; Burak, Abdurrahman; Caliskan, Can; Yazici, Melik; Abbasi, Shahbaz; Galioglu, Arman; Kayahan, Huseyin; Gurbuz, Yasar

    2016-11-01

    This paper presents a digital readout integrated circuit (DROIC) implementing time delay and integration (TDI) for scanning type infrared focal plane arrays (IRFPAs) with a charge handling capacity of 44.8 Me- while achieving quantization noise of 198 e- and power consumption of 14.35 mW. Conventional pulse frequency modulation (PFM) method is supported by a single slope ramp ADC technique to have a very low quantization noise together with a low power consumption. The proposed digital TDI ROIC converts the photocurrent into digital domain in two phases; in the first phase, most significant bits (MSBs) are generated by the conventional PFM technique in the charge domain, while in the second phase least significant bits (LSBs) are generated by a single slope ramp ADC in the time domain. A 90 × 8 prototype has been fabricated and verified, showing a significantly improved signal-to-noise ratio (SNR) of 51 dB for low illumination levels (280,000 collected electrons), which is attributed to the TDI implementation method and very low quantization noise due to the single slope ADC implemented for LSBs. Proposed digital TDI ROIC proves the benefit of digital readouts for scanning arrays enabling smaller pixel pitches, better SNR for the low illumination levels and lower power consumption compared to analog TDI readouts for scanning arrays.

  16. A Dynamic Range Enhanced Readout Technique with a Two-Step TDC for High Speed Linear CMOS Image Sensors.

    PubMed

    Gao, Zhiyuan; Yang, Congjie; Xu, Jiangtao; Nie, Kaiming

    2015-11-06

    This paper presents a dynamic range (DR) enhanced readout technique with a two-step time-to-digital converter (TDC) for high speed linear CMOS image sensors. A multi-capacitor and self-regulated capacitive trans-impedance amplifier (CTIA) structure is employed to extend the dynamic range. The gain of the CTIA is auto adjusted by switching different capacitors to the integration node asynchronously according to the output voltage. A column-parallel ADC based on a two-step TDC is utilized to improve the conversion rate. The conversion is divided into coarse phase and fine phase. An error calibration scheme is also proposed to correct quantization errors caused by propagation delay skew within -T(clk)~+T(clk). A linear CMOS image sensor pixel array is designed in the 0.13 μm CMOS process to verify this DR-enhanced high speed readout technique. The post simulation results indicate that the dynamic range of readout circuit is 99.02 dB and the ADC achieves 60.22 dB SNDR and 9.71 bit ENOB at a conversion rate of 2 MS/s after calibration, with 14.04 dB and 2.4 bit improvement, compared with SNDR and ENOB of that without calibration.

  17. Studies of Avalanche Photodiodes (APDS) as Readout Devices for Scintillating Fibers for High Energy Gamma-Ray Astronomy Telescopes

    NASA Technical Reports Server (NTRS)

    Vasile, Stefan; Shera, Suzanne; Shamo, Denis

    1998-01-01

    New gamma ray and charged particle telescope designs based on scintillating fiber arrays could provide low cost, high resolution, lightweight, very large area and multi radiation length instrumentation for planned NASA space exploration. The scintillating fibers low visible light output requires readout sensors with single photon detection sensitivity and low noise. The sensitivity of silicon Avalanche Photodiodes (APDS) matches well the spectral output of the scintillating fibers. Moreover, APDs have demonstrated single photon capability. The global aim of our work is to make available to NASA a novel optical detector concept to be used as scintillating fiber readouts and meeting the requirements of the new generations of space-borne gamma ray telescopes. We proposed to evaluate the feasibility of using RMD's small area APDs ((mu)APD) as scintillating fiber readouts and to study possible alternative (mu)APD array configurations for space borne readout scintillating fiber systems, requiring several hundred thousand to one million channels. The evaluation has been conducted in accordance with the task description and technical specifications detailed in the NASA solicitation "Studies of Avalanche Photodiodes (APD as readout devices for scintillating fibers for High Energy Gamma-Ray Astronomy Telescopes" (#8-W-7-ES-13672NAIS) posted on October 23, 1997. The feasibility study we propose builds on recent developments of silicon APD arrays and light concentrators advances at RMD, Inc. and on more than 5 years of expertise in scintillating fiber detectors. In a previous program we carried out the initial research to develop a high resolution, small pixel, solid-state, silicon APD array which exhibited very high sensitivity in the UV-VIS spectrum. This (mu)APD array is operated in Geiger mode and results in high gain (greater than 10(exp 8)), extremely low noise, single photon detection capability, low quiescent power (less than 10 (mu)W/pixel for 30 micrometers sensitive

  18. Fast readout of carbon nanotube mechanical resonators

    NASA Astrophysics Data System (ADS)

    Meerwaldt, Harold; Singh, Vibhor; Schneider, Ben; Schouten, Raymond; van der Zant, Herre; Steele, Gary

    2013-03-01

    We perform fast readout measurements of carbon nanotube mechanical resonators. Using an electronic mixing scheme, we can detect the amplitude of the mechanical motion with an intermediate frequency (IF) of 46 MHz and a timeconstant of 1 us, up to 5 orders of magnitude faster than before. Previous measurements suffered from a low bandwidth due to the combination of the high resistance of the carbon nanotube and a large stray capacitance. We have increased the bandwidth significantly by using a high-impedance, close-proximity HEMT amplifier. The increased bandwidth should allow us to observe the nanotube's thermal motion and its transient response, approaching the regime of real-time detection of the carbon nanotube's mechanical motion.

  19. An estimation error bound for pixelated sensing

    NASA Astrophysics Data System (ADS)

    Kreucher, Chris; Bell, Kristine

    2016-05-01

    This paper considers the ubiquitous problem of estimating the state (e.g., position) of an object based on a series of noisy measurements. The standard approach is to formulate this problem as one of measuring the state (or a function of the state) corrupted by additive Gaussian noise. This model assumes both (i) the sensor provides a measurement of the true target (or, alternatively, a separate signal processing step has eliminated false alarms), and (ii) The error source in the measurement is accurately described by a Gaussian model. In reality, however, sensor measurement are often formed on a grid of pixels - e.g., Ground Moving Target Indication (GMTI) measurements are formed for a discrete set of (angle, range, velocity) voxels, and EO imagery is made on (x, y) grids. When a target is present in a pixel, therefore, uncertainty is not Gaussian (instead it is a boxcar function) and unbiased estimation is not generally possible as the location of the target within the pixel defines the bias of the estimator. It turns out that this small modification to the measurement model makes traditional bounding approaches not applicable. This paper discusses pixelated sensing in more detail and derives the minimum mean squared error (MMSE) bound for estimation in the pixelated scenario. We then use this error calculation to investigate the utility of using non-thresholded measurements.

  20. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, S.; Cole, D. M.; Hancock, B. R.; Smith, R. M.

    2008-01-01

    Electronic coupling effects such as Inter-Pixel Capacitance (IPC) affect the quantitative interpretation of image data from CMOS, hybrid visible and infrared imagers alike. Existing methods of characterizing IPC do not provide a map of the spatial variation of IPC over all pixels. We demonstrate a deterministic method that provides a direct quantitative map of the crosstalk across an imager. The approach requires only the ability to reset single pixels to an arbitrary voltage, different from the rest of the imager. No illumination source is required. Mapping IPC independently for each pixel is also made practical by the greater S/N ratio achievable for an electrical stimulus than for an optical stimulus, which is subject to both Poisson statistics and diffusion effects of photo-generated charge. The data we present illustrates a more complex picture of IPC in Teledyne HgCdTe and HyViSi focal plane arrays than is presently understood, including the presence of a newly discovered, long range IPC in the HyViSi FPA that extends tens of pixels in distance, likely stemming from extended field effects in the fully depleted substrate. The sensitivity of the measurement approach has been shown to be good enough to distinguish spatial structure in IPC of the order of 0.1%.

  1. Design, simulation, fabrication, and preliminary tests of 3D CMS pixel detectors for the super-LHC

    SciTech Connect

    Koybasi, Ozhan; Bortoletto, Daniela; Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand; Bolla, Gino; Kwan, Simon Wing Lok; /Fermilab

    2010-01-01

    The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickness, are under investigation as a potential solution for the closest operation points to the beams, where the radiation fluence is estimated to reach 10{sup 16} n{sub eq}/cm{sup 2}. Two different 3D detector designs with CMS pixel readout electronics are being developed and evaluated for their advantages and drawbacks. The fabrication of full-3D active edge CMS pixel devices with p-type substrate has been successfully completed at SINTEF. In this paper, we study the expected post-irradiation behaviors of these devices with simulations and, after a brief description of their fabrication, we report the first leakage current measurement results as performed on wafer.

  2. iPadPix—A novel educational tool to visualise radioactivity measured by a hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Keller, O.; Schmeling, S.; Müller, A.; Benoit, M.

    2016-11-01

    With the ability to attribute signatures of ionising radiation to certain particle types, pixel detectors offer a unique advantage over the traditional use of Geiger-Müller tubes also in educational settings. We demonstrate in this work how a Timepix readout chip combined with a standard 300μm pixelated silicon sensor can be used to visualise radioactivity in real-time and by means of augmented reality. The chip family is the result of technology transfer from High Energy Physics at CERN and facilitated by the Medipix Collaboration. This article summarises the development of a prototype based on an iPad mini and open source software detailed in ref. [1]. Appropriate experimental activities that explore natural radioactivity and everyday objects are given to demonstrate the use of this new tool in educational settings.

  3. Performance of TES X-ray Microcalorimeters with AC Bias Read-Out at MHz Frequencies

    NASA Astrophysics Data System (ADS)

    Akamatsu, H.; Gottardi, L.; Adams, J.; Bandler, S.; Bruijn, M.; Chervenak, J.; Eckart, M.; Finkbeiner, F.; den Hartog, R.; Hoevers, H.; Kelley, R.; Kilbourne, C.; van der Kuur, J.; van den Linden, A. J.; Porter, F.; Sadleir, J.; Smith, S.; Kiviranta, M.

    2014-08-01

    At SRON we are developing Frequency Domain Multiplexing for the read-out of superconducting transition edge sensor microcalorimeters for future X-ray astrophysical missions. We will report on the performance of Goddard Space Flight Center pixels under AC bias in the MHz frequency range. Superconducting flux transformers are used to improve the impedance matching between the low ohmic TESs and the SQUID. We connected 5 pixels to the LC filters with resonant frequencies ranging between 1 and 5 MHz. For X-ray photons of 6 keV we measured a best X-ray energy resolution of 3.6 eV at 1.4 MHz, consistent with the integrated Noise Equivalent Power. In addition, we improved the electrical circuit by optimizing the coupling ratio of the impedance matching transformer. In addition, we improved electrical circuit for impedance matching; modified transformer coupling ratio. As a result, we got the integrated noise equivalent power resolution of 2.7 eV at 2.5 MHz. A characterization of the detector response as a function of the AC bias voltage, bias frequency and the applied magnetic field is presented.

  4. Resistive graphene humidity sensors with rapid and direct electrical readout

    NASA Astrophysics Data System (ADS)

    Smith, Anderson D.; Elgammal, Karim; Niklaus, Frank; Delin, Anna; Fischer, Andreas C.; Vaziri, Sam; Forsberg, Fredrik; Råsander, Mikael; Hugosson, Håkan; Bergqvist, Lars; Schröder, Stephan; Kataria, Satender; Östling, Mikael; Lemme, Max C.

    2015-11-01

    We demonstrate humidity sensing using a change of the electrical resistance of single-layer chemical vapor deposited (CVD) graphene that is placed on top of a SiO2 layer on a Si wafer. To investigate the selectivity of the sensor towards the most common constituents in air, its signal response was characterized individually for water vapor (H2O), nitrogen (N2), oxygen (O2), and argon (Ar). In order to assess the humidity sensing effect for a range from 1% relative humidity (RH) to 96% RH, the devices were characterized both in a vacuum chamber and in a humidity chamber at atmospheric pressure. The measured response and recovery times of the graphene humidity sensors are on the order of several hundred milliseconds. Density functional theory simulations are employed to further investigate the sensitivity of the graphene devices towards water vapor. The interaction between the electrostatic dipole moment of the water and the impurity bands in the SiO2 substrate leads to electrostatic doping of the graphene layer. The proposed graphene sensor provides rapid response direct electrical readout and is compatible with back end of the line (BEOL) integration on top of CMOS-based integrated circuits.We demonstrate humidity sensing using a change of the electrical resistance of single-layer chemical vapor deposited (CVD) graphene that is placed on top of a SiO2 layer on a Si wafer. To investigate the selectivity of the sensor towards the most common constituents in air, its signal response was characterized individually for water vapor (H2O), nitrogen (N2), oxygen (O2), and argon (Ar). In order to assess the humidity sensing effect for a range from 1% relative humidity (RH) to 96% RH, the devices were characterized both in a vacuum chamber and in a humidity chamber at atmospheric pressure. The measured response and recovery times of the graphene humidity sensors are on the order of several hundred milliseconds. Density functional theory simulations are employed to further

  5. Pixels, Blocks of Pixels, and Polygons: Choosing a Spatial Unit for Thematic Accuracy Assessment

    EPA Science Inventory

    Pixels, polygons, and blocks of pixels are all potentially viable spatial assessment units for conducting an accuracy assessment. We develop a statistical population-based framework to examine how the spatial unit chosen affects the outcome of an accuracy assessment. The populati...

  6. Radiation tolerance of CMOS monolithic active pixel sensors with self-biased pixels

    NASA Astrophysics Data System (ADS)

    Deveaux, M.; Amar-Youcef, S.; Besson, A.; Claus, G.; Colledani, C.; Dorokhov, M.; Dritsa, C.; Dulinski, W.; Fröhlich, I.; Goffe, M.; Grandjean, D.; Heini, S.; Himmi, A.; Hu, C.; Jaaskelainen, K.; Müntz, C.; Shabetai, A.; Stroth, J.; Szelezniak, M.; Valin, I.; Winter, M.

    2010-12-01

    CMOS monolithic active pixel sensors (MAPS) are proposed as a technology for various vertex detectors in nuclear and particle physics. We discuss the mechanisms of ionizing radiation damage on MAPS hosting the dead time free, so-called self bias pixel. Moreover, we introduce radiation hardened sensor designs which allow operating detectors after exposing them to irradiation doses above 1 Mrad.

  7. Gafchromic EBT3 film dosimetry in electron beams - energy dependence and improved film read-out.

    PubMed

    Sipilä, Petri; Ojala, Jarkko; Kaijaluoto, Sampsa; Jokelainen, Ilkka; Kosunen, Antti

    2016-01-01

    For megavoltage photon radiation, the fundamental dosimetry characteristics of Gafchromic EBT3 film were determined in  60Co gamma ray beam with addition of experimental and Monte Carlo (MC)-simulated energy dependence of the film for 6 MV photon beam and 6 MeV, 9 MeV, 12 MeV, and 16 MeV electron beams in water phantom. For the film read-out, two phase correction of scanner sensitivity was applied: a matrix correction for scanning area and dose-dependent correction by iterative procedure. With these corrections, the uniformity of response can be improved to be within ±50 pixel values (PVs). To improve the read-out accuracy, a procedure with flipped film orientations was established. With the method, scanner uniformity can be improved further and dust particles, scratches and/or dirt on scanner glass can be detected and eliminated. Responses from red and green channels were averaged for read-out, which decreased the effect of noise present in values from separate channels. Since the signal level with the blue channel is considerably lower than with other channels, the signal variation due to different perturbation effects increases the noise level so that the blue channel is not recommended to be used for dose determination. However, the blue channel can be used for the detection of emulsion thickness variations for film quality evaluations with unexposed films. With electron beams ranging from 6 MeV to 16 MeV and at reference measurement conditions in water, the energy dependence of the EBT3 film is uniform within 0.5%, with uncertainties close to 1.6% (k=2). Including 6 MV photon beam and the electron beams mentioned, the energy dependence is within 1.1%. No notable differences were found between the experimental and MC-simulated responses, indicating negligible change in intrinsic energy dependence of the EBT3 film for 6 MV photon beam and 6 MeV-16 MeV electron beams. Based on the dosimetric characteristics of the EBT3 film, the read-out procedure established

  8. Gafchromic EBT3 film dosimetry in electron beams - energy dependence and improved film read-out.

    PubMed

    Sipilä, Petri; Ojala, Jarkko; Kaijaluoto, Sampsa; Jokelainen, Ilkka; Kosunen, Antti

    2016-01-08

    For megavoltage photon radiation, the fundamental dosimetry characteristics of Gafchromic EBT3 film were determined in 60Co gamma ray beam with addition of experimental and Monte Carlo (MC)-simulated energy dependence of the film for 6 MV photon beam and 6 MeV, 9 MeV, 12 MeV, and 16 MeV electron beams in water phantom. For the film read-out, two phase correction of scanner sensitivity was applied: a matrix correction for scanning area and dose-dependent correction by iterative procedure. With these corrections, the uniformity of response can be improved to be within ± 50 pixel values (PVs). To improve the read-out accuracy, a procedure with flipped film orientations was established. With the method, scanner uniformity can be improved further and dust particles, scratches and/or dirt on scan-ner glass can be detected and eliminated. Responses from red and green channels were averaged for read-out, which decreased the effect of noise present in values from separate channels. Since the signal level with the blue channel is considerably lower than with other channels, the signal variation due to different perturbation effects increases the noise level so that the blue channel is not recommended to be used for dose determination. However, the blue channel can be used for the detection of emulsion thickness variations for film quality evaluations with unexposed films. With electron beams ranging from 6 MeV to 16 MeV and at reference measurement conditions in water, the energy dependence of the EBT3 film is uniform within 0.5%, with uncertainties close to 1.6% (k = 2). Including 6 MV photon beam and the electron beams mentioned, the energy dependence is within 1.1%. No notable differences were found between the experimental and MC-simulated responses, indicating negligible change in intrinsic energy dependence of the EBT3 film for 6 MV photon beam and 6 MeV-16 MeV electron beams. Based on the dosimetric characteristics of the EBT3 film, the read-out procedure established

  9. Active Pixel Sensors: Are CCD's Dinosaurs?

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.

    1993-01-01

    Charge-coupled devices (CCD's) are presently the technology of choice for most imaging applications. In the 23 years since their invention in 1970, they have evolved to a sophisticated level of performance. However, as with all technologies, we can be certain that they will be supplanted someday. In this paper, the Active Pixel Sensor (APS) technology is explored as a possible successor to the CCD. An active pixel is defined as a detector array technology that has at least one active transistor within the pixel unit cell. The APS eliminates the need for nearly perfect charge transfer -- the Achilles' heel of CCDs. This perfect charge transfer makes CCD's radiation 'soft,' difficult to use under low light conditions, difficult to manufacture in large array sizes, difficult to integrate with on-chip electronics, difficult to use at low temperatures, difficult to use at high frame rates, and difficult to manufacture in non-silicon materials that extend wavelength response.

  10. Pixel lensing observations towards globular clusters

    NASA Astrophysics Data System (ADS)

    Cardone, V. F.; Cantiello, M.

    2003-07-01

    It has been suggested that a monitoring program employing the pixel lensing method to search for microlensing events towards galactic globular clusters may increase the statistics and discriminate among different halo models. Stimulated by this proposal, we evaluate an upper limit to the pixel lensing event rate for such a survey. Four different dark halo models have been considered changing both the flattening and the slope of the mass density profile. The lens mass function has been modelled as a homogenous power - law for mu in (mul, muu) and both the mass limits and the slope of the mass function have been varied to investigate their effect on the rate. The target globular clusters have been selected in order to minimize the disk contribution to the event rate. We find that a pixel lensing survey towards globular clusters is unable to discriminate among different halo models since the number of detectable events is too small to allow any reliable statistical analysis.

  11. Illuminant spectrum estimation at a pixel.

    PubMed

    Ratnasingam, Sivalogeswaran; Hernández-Andrés, Javier

    2011-04-01

    In this paper, an algorithm is proposed to estimate the spectral power distribution of a light source at a pixel. The first step of the algorithm is forming a two-dimensional illuminant invariant chromaticity space. In estimating the illuminant spectrum, generalized inverse estimation and Wiener estimation methods were applied. The chromaticity space was divided into small grids and a weight matrix was used to estimate the illuminant spectrum illuminating the pixels that fall within a grid. The algorithm was tested using a different number of sensor responses to determine the optimum number of sensors for accurate colorimetric and spectral reproduction. To investigate the performance of the algorithm realistically, the responses were multiplied with Gaussian noise and then quantized to 10 bits. The algorithm was tested with standard and measured data. Based on the results presented, the algorithm can be used with six sensors to obtain a colorimetrically good estimate of the illuminant spectrum at a pixel.

  12. Modulation transfer function of a trapezoidal pixel array detector

    NASA Astrophysics Data System (ADS)

    Wang, Fan; Guo, Rongli; Ni, Jinping; Dong, Tao

    2016-01-01

    The modulation transfer function (MTF) is the tool most commonly used for quantifying the performance of an electro-optical imaging system. Recently, trapezoid-shaped pixels were designed and used in a retina-like sensor in place of rectangular-shaped pixels. The MTF of a detector with a trapezoidal pixel array is determined according to its definition. Additionally, the MTFs of detectors with differently shaped pixels, but the same pixel areas, are compared. The results show that the MTF values of the trapezoidal pixel array detector are obviously larger than those of rectangular and triangular pixel array detectors at the same frequencies.

  13. Hard x-ray response of pixellated CdZnTe detectors

    NASA Astrophysics Data System (ADS)

    Abbene, L.; Del Sordo, S.; Caroli, E.; Gerardi, G.; Raso, G.; Caccia, S.; Bertuccio, G.

    2009-06-01

    In recent years, the development of cadmium zinc telluride (CdZnTe) detectors for x-ray and gamma ray spectrometry has grown rapidly. The good room temperature performance and the high spatial resolution of pixellated CdZnTe detectors make them very attractive in space-borne x-ray astronomy, mainly as focal plane detectors for the new generation of hard x-ray focusing telescopes. In this work, we investigated on the spectroscopic performance of two pixellated CdZnTe detectors coupled with a custom low noise and low power readout application specific integrated circuit (ASIC). The detectors (10×10×1 and 10×10×2 mm3 single crystals) have an anode layout based on an array of 256 pixels with a geometric pitch of 0.5 mm. The ASIC, fabricated in 0.8 μm BiCMOS technology, is equipped with eight independent channels (preamplifier and shaper) and characterized by low power consumption (0.5 mW/channel) and low noise (150-500 electrons rms). The spectroscopic results point out the good energy resolution of both detectors at room temperature [5.8% full width at half maximum (FWHM) at 59.5 keV for the 1 mm thick detector; 5.5% FWHM at 59.5 keV for the 2 mm thick detector) and low tailing in the measured spectra, confirming the single charge carrier sensing properties of the CdZnTe detectors equipped with a pixellated anode layout. Temperature measurements show optimum performance of the system (detector and electronics) at T =10 °C and performance degradation at lower temperatures. The detectors and the ASIC were developed by our collaboration as two small focal plane detector prototypes for hard x-ray multilayer telescopes operating in the 20-70 keV energy range.

  14. Hard x-ray response of pixellated CdZnTe detectors

    SciTech Connect

    Abbene, L.; Caccia, S.; Bertuccio, G.

    2009-06-15

    In recent years, the development of cadmium zinc telluride (CdZnTe) detectors for x-ray and gamma ray spectrometry has grown rapidly. The good room temperature performance and the high spatial resolution of pixellated CdZnTe detectors make them very attractive in space-borne x-ray astronomy, mainly as focal plane detectors for the new generation of hard x-ray focusing telescopes. In this work, we investigated on the spectroscopic performance of two pixellated CdZnTe detectors coupled with a custom low noise and low power readout application specific integrated circuit (ASIC). The detectors (10x10x1 and 10x10x2 mm{sup 3} single crystals) have an anode layout based on an array of 256 pixels with a geometric pitch of 0.5 mm. The ASIC, fabricated in 0.8 mum BiCMOS technology, is equipped with eight independent channels (preamplifier and shaper) and characterized by low power consumption (0.5 mW/channel) and low noise (150-500 electrons rms). The spectroscopic results point out the good energy resolution of both detectors at room temperature [5.8% full width at half maximum (FWHM) at 59.5 keV for the 1 mm thick detector; 5.5% FWHM at 59.5 keV for the 2 mm thick detector) and low tailing in the measured spectra, confirming the single charge carrier sensing properties of the CdZnTe detectors equipped with a pixellated anode layout. Temperature measurements show optimum performance of the system (detector and electronics) at T=10 deg.C and performance degradation at lower temperatures. The detectors and the ASIC were developed by our collaboration as two small focal plane detector prototypes for hard x-ray multilayer telescopes operating in the 20-70 keV energy range.

  15. Calibration status and plans for the charge integrating JUNGFRAU pixel detector for SwissFEL

    NASA Astrophysics Data System (ADS)

    Redford, S.; Bergamaschi, A.; Brückner, M.; Cartier, S.; Dinapoli, R.; Ekinci, Y.; Fröjdh, E.; Greiffenberg, D.; Mayilyan, D.; Mezza, D.; Mozzanica, A.; Rajeev, R.; Ramilli, M.; Ruder, C.; Schädler, L.; Schmitt, B.; Shi, X.; Thattil, D.; Tinti, G.; Zhang, J.

    2016-11-01

    JUNGFRAU (adJUstiNg Gain detector FoR the Aramis User station) is a two-dimensional hybrid pixel detector under development for photon science applications at free electron laser and synchrotron facilities. In particular, JUNGFRAU detectors will equip the Aramis end stations of SwissFEL, an X-ray free electron laser currently under construction at the Paul Scherrer Institut in Villigen, Switzerland. JUNGFRAU has been designed specifically to meet the challenges of photon science at XFELs, including high frame rates, single photon sensitivity in combination with a high dynamic range, vacuum compatibility and tilable modules. This has resulted in a charge integrating detector with three dynamically adjusting gains, a low noise of 55 ENC RMS, readout speeds in excess of 2 kHz, single photon sensitivity down to 2 keV (with a signal to noise ratio of 10) and a dynamic range covering four orders of magnitude at 12 keV. Each JUNGFRAU module consists of eight chips of 256 × 256 pixels, each 75 × 75 μm2 in size. The chips are arranged in 2 × 4 formation and bump-bonded to a single silicon sensor 320 μm thick, resulting in an active area of approximately 4 × 8 cm2 per module. Multi-module vacuum compatible systems comprising up to 16 Mpixels (32 modules) will be used at SwissFEL. The design of SwissFEL and the JUNGFRAU system for the Aramis end station A will be introduced, together with results from early prototypes and a characterisation using the first batch of final JUNGFRAU modules. Plans and first results of the pixel-by-pixel calibration will also be shown. The vacuum compatibility of the JUNGFRAU module is demonstrated for the first time.

  16. Commissioning of the ATLAS pixel detector

    SciTech Connect

    ATLAS Collaboration; Golling, Tobias

    2008-09-01

    The ATLAS pixel detector is a high precision silicon tracking device located closest to the LHC interaction point. It belongs to the first generation of its kind in a hadron collider experiment. It will provide crucial pattern recognition information and will largely determine the ability of ATLAS to precisely track particle trajectories and find secondary vertices. It was the last detector to be installed in ATLAS in June 2007, has been fully connected and tested in-situ during spring and summer 2008, and is ready for the imminent LHC turn-on. The highlights of the past and future commissioning activities of the ATLAS pixel system are presented.

  17. Physics performance of the ATLAS pixel detector

    NASA Astrophysics Data System (ADS)

    Tsuno, S.

    2017-01-01

    In preparation for LHC Run-2 the ATLAS detector introduced a new pixel detector, the Insertable B-Layer (IBL). This detector is located between the beampipe and what was the innermost pixel layer. The tracking and vertex reconstruction are significantly improved and good performance is expected in high level objects such a b-quark jet tagging. This in turn, leads to better physics results. This note summarizes the impact of the IBL detector on physics results, especially focusing on the analyses using b-quark jets throughout 2016 summer physics program.

  18. ALPIDE: the Monolithic Active Pixel Sensor for the ALICE ITS upgrade

    NASA Astrophysics Data System (ADS)

    Šuljić, M.

    2016-11-01

    The upgrade of the ALICE vertex detector, the Inner Tracking System (ITS), is scheduled to be installed during the next long shutdown period (2019-2020) of the CERN Large Hadron Collider (LHC) . The current ITS will be replaced by seven concentric layers of Monolithic Active Pixel Sensors (MAPS) with total active surface of ~10 m2, thus making ALICE the first LHC experiment implementing MAPS detector technology on a large scale. The ALPIDE chip, based on TowerJazz 180 nm CMOS Imaging Process, is being developed for this purpose. A particular process feature, the deep p-well, is exploited so the full CMOS logic can be implemented over the active sensor area without impinging on the deposited charge collection. ALPIDE is implemented on silicon wafers with a high resistivity epitaxial layer. A single chip measures 15 mm by 30 mm and contains half a million pixels distributed in 512 rows and 1024 columns. In-pixel circuitry features amplification, shaping, discrimination and multi-event buffering. The readout is hit driven i.e. only addresses of hit pixels are sent to the periphery. The upgrade of the ITS presents two different sets of requirements for sensors of the inner and of the outer layers due to the significantly different track density, radiation level and active detector surface. The ALPIDE chip fulfils the stringent requirements in both cases. The detection efficiency is higher than 99%, fake-hit probability is orders of magnitude lower than the required 10-6 and spatial resolution within the required 5 μm. This performance is to be maintained even after a total ionising does (TID) of 2.7 Mrad and a non-ionising energy loss (NIEL) fluence of 1.7 × 1013 1 MeV neq/cm2, which is above what is expected during the detector lifetime. Readout rate of 100 kHz is provided and the power density of ALPIDE is less than 40 mW/cm2. This contribution will provide a summary of the ALPIDE features and main test results.

  19. Dependence of the appearance-based perception of criminality, suggestibility, and trustworthiness on the level of pixelation of facial images.

    PubMed

    Nurmoja, Merle; Eamets, Triin; Härma, Hanne-Loore; Bachmann, Talis

    2012-10-01

    While the dependence of face identification on the level of pixelation-transform of the images of faces has been well studied, similar research on face-based trait perception is underdeveloped. Because depiction formats used for hiding individual identity in visual media and evidential material recorded by surveillance cameras often consist of pixelized images, knowing the effects of pixelation on person perception has practical relevance. Here, the results of two experiments are presented showing the effect of facial image pixelation on the perception of criminality, trustworthiness, and suggestibility. It appears that individuals (N = 46, M age = 21.5 yr., SD = 3.1 for criminality ratings; N = 94, M age = 27.4 yr., SD = 10.1 for other ratings) have the ability to discriminate between facial cues ndicative of these perceived traits from the coarse level of image pixelation (10-12 pixels per face horizontally) and that the discriminability increases with a decrease in the coarseness of pixelation. Perceived criminality and trustworthiness appear to be better carried by the pixelized images than perceived suggestibility.

  20. Development of a low noise readout ASIC for CZT detectors for gamma-ray spectroscopy applications

    NASA Astrophysics Data System (ADS)

    Luo, J.; Deng, Z.; Wang, G.; Li, H.; Liu, Y.

    2012-08-01

    A multi-channel readout ASIC for pixelated CZT detectors has been developed for gamma-ray spectroscopy applications. Each channel consists of a low noise dual-stage charge sensitive amplifier (CSA), a CR-(RC)4 semi-Gaussian shaper and a class-AB output buffer. The equivalent noise charge (ENC) of input PMOS transistor is optimized for 5 pF input capacitance and 1 μs peaking time using gm/ID design methodology. The gain can be adjusted from 100 mV/fC to 400 mV/fC and the peaking time can be adjusted from 1 μs to 4 μs. A 16-channel chip has been designed and fabricated in 0.35 μm 2P4M CMOS technology. The test results show that the chip works well and fully satisfies the design specifications. The ENC was measured to be 72 e + 26 e/pF at 1 μs peaking time and 86 e + 20 e/pF at 4 μs peaking time. The non-uniformity of the channel gain and ENC was less than ±12% and ±11% respectively for 16 channels in one chip. The chip was also tested with a pixelated CZT detector at room temperature. The measured energy resolution at 59.5 keV photopeak of 241Am and 122 keV photopeak of 57Co were 4.5% FWHM and 2.8% FWHM for the central area pixels, respectively.