Science.gov

Sample records for individual pixel readout

  1. Readout and DAQ for Pixel Detectors

    NASA Astrophysics Data System (ADS)

    Platkevic, Michal

    2010-01-01

    Data readout and acquisition control of pixel detectors demand the transfer of significantly a large amounts of bits between the detector and the computer. For this purpose dedicated interfaces are used which are designed with focus on features like speed, small dimensions or flexibility of use such as digital signal processors, field-programmable gate arrays (FPGA) and USB communication ports. This work summarizes the readout and DAQ system built for state-of-the-art pixel detectors of the Medipix family.

  2. Active pixel sensor array with multiresolution readout

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Kemeny, Sabrina E. (Inventor); Pain, Bedabrata (Inventor)

    1999-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node. There is also a readout circuit, part of which can be disposed at the bottom of each column of cells and be common to all the cells in the column. The imaging device can also include an electronic shutter formed on the substrate adjacent the photogate, and/or a storage section to allow for simultaneous integration. In addition, the imaging device can include a multiresolution imaging circuit to provide images of varying resolution. The multiresolution circuit could also be employed in an array where the photosensitive portion of each pixel cell is a photodiode. This latter embodiment could further be modified to facilitate low light imaging.

  3. FPIX2, the BTeV pixel readout chip

    SciTech Connect

    David C. Christian et al.

    2003-12-10

    A radiation tolerant pixel readout chip, FPIX2, has been developed at Fermilab for use by BTeV. Some of the requirements of the BTeV pixel readout chip are reviewed and contrasted with requirements for similar devices in LHC experiments. A description of the FPIX2 is given, and results of initial tests of its performance are presented, as is a summary of measurements planned for the coming year.

  4. Vertically integrated pixel readout chip for high energy physics

    SciTech Connect

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Khalid, Farah; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2011-01-01

    We report on the development of the vertex detector pixel readout chips based on multi-tier vertically integrated electronics for the International Linear Collider. Some testing results of the VIP2a prototype are presented. The chip is the second iteration of the silicon implementation of the prototype, data-pushed concept of the readout developed at Fermilab. The device was fabricated in the 3D MIT-LL 0.15 {micro}m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 {micro}m{sup 2} pixels, laid out in an array of 48 x 48 pixels.

  5. Improvement of Event Synchronization in the ATLAS Pixel Readout Development

    NASA Astrophysics Data System (ADS)

    Adams, Logan; Atlas Collaboration

    2017-01-01

    As the LHC continues in Run2, the B-Layer still uses the Atlas-SiROD Pixel readout system initially developed for Run 1. The higher luminosity occurring during Run 2 results in higher occupancy causing increased desynchronization errors in the Pixel Readout. In order to ensure lasting operation of the B-Layer until it is replaced after Run 3, changes were made to the firmware and software to add debug capabilities to identify when the errors are crossing certain thresholds and change the internal control logic accordingly. These features also allow for better debugging of the Event Counter Reset addition to the firmware. This talk will focus on the features implemented and measurements to demonstrate the positive impact on the Pixel DAQ system. A Pixel front-end chip emulator which can be used for readout system development beyond Run 3 will also be discussed. Presenter is Logan Adams, University of Washington.

  6. Readout of TPC Tracking Chambers with GEMs and Pixel Chip

    SciTech Connect

    Kadyk, John; Kim, T.; Freytsis, M.; Button-Shafer, J.; Kadyk, J.; Vahsen, S.E.; Wenzel, W.A.

    2007-12-21

    Two layers of GEMs and the ATLAS Pixel Chip, FEI3, have been combined and tested as a prototype for Time Projection Chamber (TPC) readout at the International Linear Collider (ILC). The double-layer GEM system amplifies charge with gain sufficient to detect all track ionization. The suitability of three gas mixtures for this application was investigated, and gain measurements are presented. A large sample of cosmic ray tracks was reconstructed in 3D by using the simultaneous timing and 2D spatial information from the pixel chip. The chip provides pixel charge measurement as well as timing. These results demonstrate that a double GEM and pixel combination, with a suitably modified pixel ASIC, could meet the stringent readout requirements of the ILC.

  7. Anode readout for pixellated CZT detectors

    NASA Astrophysics Data System (ADS)

    Narita, Tomohiko; Grindlay, Jonathan E.; Hong, Jaesub; Niestemski, Francis C.

    2004-02-01

    Determination of the photon interaction depth offers numerous advantages for an astronomical hard X-ray telescope. The interaction depth is typically derived from two signals: anode and cathode, or collecting and non-collecting electrodes. We present some preliminary results from our depth sensing detectors using only the anode pixel signals. By examining several anode pixel signals simultaneously, we find that we can estimate the interaction depth, and get sub-pixel 2-D position resolution. We discuss our findings and the requirements for future ASIC development.

  8. Detector apparatus having a hybrid pixel-waveform readout system

    DOEpatents

    Meng, Ling-Jian

    2014-10-21

    A gamma ray detector apparatus comprises a solid state detector that includes a plurality of anode pixels and at least one cathode. The solid state detector is configured for receiving gamma rays during an interaction and inducing a signal in an anode pixel and in a cathode. An anode pixel readout circuit is coupled to the plurality of anode pixels and is configured to read out and process the induced signal in the anode pixel and provide triggering and addressing information. A waveform sampling circuit is coupled to the at least one cathode and configured to read out and process the induced signal in the cathode and determine energy of the interaction, timing of the interaction, and depth of interaction.

  9. A pixel read-out chip for the PILATUS project

    NASA Astrophysics Data System (ADS)

    Brönnimann, Ch.; Baur, R.; Eikenberry, E. F.; Kohout, S.; Lindner, M.; Schmitt, B.; Horisberger, R.

    2001-06-01

    For the protein crystallography beamlime of the Swiss Light Source (SLS), which will be operational in summer 2001, the PILATUS detector ( PIxe L Appara TUs for the SLS) is currently being built. The goal of the PILATUS project is a hybrid pixel system with a size of 40×40 cm 2 having 2000×2000 pixels. The detector will be operated in single photon counting mode for 12 keV X-rays. The prototype pixel read-out chip has a noise of 75 e- with sensor, a low threshold dispersion and a maximum count rate of 1 MHz/pixel. Due to the expected radiation dose in operation at the beamline, the chip is designed in radiation hard DMILL technology.

  10. Sensor Development and Readout Prototyping for the STAR Pixel Detector

    SciTech Connect

    Greiner, L.; Anderssen, E.; Matis, H.S.; Ritter, H.G.; Stezelberger, T.; Szelezniak, M.; Sun, X.; Vu, C.; Wieman, H.

    2009-01-14

    The STAR experiment at the Relativistic Heavy Ion Collider (RHIC) is designing a new vertex detector. The purpose of this upgrade detector is to provide high resolution pointing to allow for the direct topological reconstruction of heavy flavor decays such as the D{sup 0} by finding vertices displaced from the collision vertex by greater than 60 microns. We are using Monolithic Active Pixel Sensor (MAPS) as the sensor technology and have a coupled sensor development and readout system plan that leads to a final detector with a <200 {micro}s integration time, 400 M pixels and a coverage of -1 < {eta} < 1. We present our coupled sensor and readout development plan and the status of the prototyping work that has been accomplished.

  11. Monolithic pixels on moderate resistivity substrate and sparsifying readout architecture

    NASA Astrophysics Data System (ADS)

    Giubilato, P.; Battaglia, M.; Bisello, D.; Caselle, M.; Chalmet, P.; Demaria, L.; Ikemoto, Y.; Kloukinas, K.; Mansuy, S. C.; Mattiazzo, S.; Marchioro, A.; Mugnier, H.; Pantano, D.; Potenza, A.; Rivetti, A.; Rousset, J.; Silvestrin, L.; Snoeys, W.

    2013-12-01

    The LePix projects aim realizing a new generation monolithic pixel detectors with improved performances at lesser cost with respect to both current state of the art monolithic and hybrid pixel sensors. The detector is built in a 90 nm CMOS process on a substrate of moderate resistivity. This allows charge collection by drift while maintaining the other advantages usually offered by MAPS, like having a single piece detector and using a standard CMOS production line. The collection by drift mechanism, coupled to the low capacitance design of the collecting node made possible by the monolithic approach, provides an excellent signal to noise ratio straight at the pixel cell together with a radiation tolerance far superior to conventional un-depleted MAPS. The excellent signal-to-noise performance is demonstrated by the device ability to separate the 6 keV 55Fe double peak at room temperature. To achieve high granularity (10-20 μm pitch pixels) over large detector areas maintaining high readout speed, a completely new compressing architecture has been devised. This architecture departs from the mainstream hybrid pixel sparsification approach, which uses in-pixel logic to reduce data, by using topological compression to minimize pixel area and power consumption.

  12. HEXITEC ASIC—a pixellated readout chip for CZT detectors

    NASA Astrophysics Data System (ADS)

    Jones, Lawrence; Seller, Paul; Wilson, Matthew; Hardie, Alec

    2009-06-01

    HEXITEC is a collaborative project with the aim of developing a new range of detectors for high-energy X-ray imaging. High-energy X-ray imaging has major advantages over current lower energy imaging for the life and physical sciences, including improved phase-contrast images on larger, higher density samples and with lower accumulated doses. However, at these energies conventional silicon-based devices cannot be used, hence, the requirement for a new range of high Z-detector materials. Underpinning the HEXITEC programme are the development of a pixellated Cadmium Zinc Telluride (CZT) detectors and a pixellated readout ASIC which will be bump-bonded to the detector. The HEXITEC ASIC is required to have low noise (20 electrons rms) and tolerate detector leakage currents. A prototype 20×20 pixel ASIC has been developed and manufactured on a standard 0.35 μm CMOS process.

  13. Towards a new generation of pixel detector readout chips

    NASA Astrophysics Data System (ADS)

    Campbell, M.; Alozy, J.; Ballabriga, R.; Frojdh, E.; Heijne, E.; Llopart, X.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.

    2016-01-01

    The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile-ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.

  14. Small-Scale Readout Systems Prototype for the STAR PIXEL Detector

    SciTech Connect

    Szelezniak, Michal A.; Besson, Auguste; Colledani, Claude; Dorokhov, Andrei; Dulinski, Wojciech; Greiner, Leo C.; Himmi, Abdelkader; Hu, Christine; Matis, Howard S.; Ritter, Hans Georg; Rose, Andrew; Shabetai, Alexandre; Stezelberger, Thorsten; Sun, Xiangming; Thomas, Jim H.; Valin, Isabelle; Vu, Chinh Q.; Wieman, Howard H.; Winter, Marc

    2008-10-01

    A prototype readout system for the STAR PIXEL detector in the Heavy Flavor Tracker (HFT) vertex detector upgrade is presented. The PIXEL detector is a Monolithic Active Pixel Sensor (MAPS) based silicon pixel vertex detector fabricated in a commercial CMOS process that integrates the detector and front-end electronics layers in one silicon die. Two generations ofMAPS prototypes designed specifically for the PIXEL are discussed. We have constructed a prototype telescope system consisting of three small MAPS sensors arranged in three parallel and coaxial planes with a readout system based on the readout architecture for PIXEL. This proposed readout architecture is simple and scales to the size required to readout the final detector. The real-time hit finding algorithm necessary for data rate reduction in the 400 million pixel detector is described, and aspects of the PIXEL system integration into the existing STAR framework are addressed. The complete system has been recently tested and shown to be fully functional.

  15. SPIDR, a general-purpose readout system for pixel ASICs

    NASA Astrophysics Data System (ADS)

    van der Heijden, B.; Visser, J.; van Beuzekom, M.; Boterenbrood, H.; Kulis, S.; Munneke, B.; Schreuder, F.

    2017-02-01

    The SPIDR (Speedy PIxel Detector Readout) system is a flexible general-purpose readout platform that can be easily adapted to test and characterize new and existing detector readout ASICs. It is originally designed for the readout of pixel ASICs from the Medipix/Timepix family, but other types of ASICs or front-end circuits can be read out as well. The SPIDR system consists of an FPGA board with memory and various communication interfaces, FPGA firmware, CPU subsystem and an API library on the PC . The FPGA firmware can be adapted to read out other ASICs by re-using IP blocks. The available IP blocks include a UDP packet builder, 1 and 10 Gigabit Ethernet MAC's and a "soft core" CPU . Currently the firmware is targeted at the Xilinx VC707 development board and at a custom board called Compact-SPIDR . The firmware can easily be ported to other Xilinx 7 series and ultra scale FPGAs. The gap between an ASIC and the data acquisition back-end is bridged by the SPIDR system. Using the high pin count VITA 57 FPGA Mezzanine Card (FMC) connector only a simple chip carrier PCB is required. A 1 and a 10 Gigabit Ethernet interface handle the connection to the back-end. These can be used simultaneously for high-speed data and configuration over separate channels. In addition to the FMC connector, configurable inputs and outputs are available for synchronization with other detectors. A high resolution (≈ 27 ps bin size) Time to Digital converter is provided for time stamping events in the detector. The SPIDR system is frequently used as readout for the Medipix3 and Timepix3 ASICs. Using the 10 Gigabit Ethernet interface it is possible to read out a single chip at full bandwidth or up to 12 chips at a reduced rate. Another recent application is the test-bed for the VeloPix ASIC, which is developed for the Vertex Detector of the LHCb experiment. In this case the SPIDR system processes the 20 Gbps scrambled data stream from the VeloPix and distributes it over four 10 Gigabit

  16. Characterization of the column-based priority logic readout of Topmetal-II‑ CMOS pixel direct charge sensor

    NASA Astrophysics Data System (ADS)

    An, M.; Zhang, W.; Xiao, L.; Gao, C.; Chen, C.; Han, M.; Huang, G.; Ji, R.; Li, X.; Liu, J.; Mei, Y.; Pei, H.; Sun, Q.; Sun, X.; Wang, K.; Yang, P.; Zhou, W.

    2017-03-01

    We present the detailed study of the digital readout of Topmetal-II- CMOS pixel direct charge sensor. Topmetal-II- is an integrated sensor with an array of 72×72 pixels each capable of directly collecting external charge through exposed metal electrodes in the topmost metal layer. In addition to the time-shared multiplexing readout of the analog output from Charge Sensitive Amplifiers in each pixel, hits are also generated through comparators in each pixel with individually adjustable thresholds. The hits are read out via a column-based priority logic structure, retaining both hit location and time information. The in-array column-based priority logic features with a full clock-less circuitry hence there is no continuously running clock distributed in the pixel and matrix logic. These characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments. We studied the detailed working behavior and performance of this readout, and demonstrated its functional validity and potential in imaging applications.

  17. A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout

    SciTech Connect

    Allman, M. S. Verma, V. B.; Stevens, M.; Gerrits, T.; Horansky, R. D.; Lita, A. E.; Mirin, R.; Nam, S. W.; Marsili, F.; Beyer, A.; Shaw, M. D.; Kumor, D.

    2015-05-11

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array as well as characterization measurements are discussed.

  18. A 2D 4×4 Channel Readout ASIC for Pixelated CdTe Detectors for Medical Imaging Applications

    PubMed Central

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Martínez, Ricardo; Puigdengoles, Carles

    2015-01-01

    We present a 16-channel readout integrated circuit (ROIC) with nanosecond-resolution time to digital converter (TDC) for pixelated Cadmium Telluride (CdTe) gamma-ray detectors. The 4 × 4 pixel array ROIC is the proof of concept of the 10 × 10 pixel array readout ASIC for positron-emission tomography (PET) scanner, positron-emission mammography (PEM) scanner, and Compton gamma camera. The electronics of each individual pixel integrates an analog front-end with switchable gain, an analog to digital converter (ADC), configuration registers, and a 4-state digital controller. For every detected photon, the pixel electronics provides the energy deposited in the detector with 10-bit resolution, and a fast trigger signal for time stamp. The ASIC contains the 16-pixel matrix electronics, a digital controller, five global voltage references, a TDC, a temperature sensor, and a band-gap based current reference. The ASIC has been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and occupies an area of 5.3 mm × 6.8 mm. The TDC shows a resolution of 95.5 ps, a precision of 600 ps at full width half maximum (FWHM), and a power consumption of 130 μW. In acquisition mode, the total power consumption of every pixel is 200 μW. An equivalent noise charge (ENC) of 160 e−RMS at maximum gain and negative polarity conditions has been measured at room temperature. PMID:26744545

  19. A 2D 4×4 Channel Readout ASIC for Pixelated CdTe Detectors for Medical Imaging Applications.

    PubMed

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Martínez, Ricardo; Puigdengoles, Carles

    2015-10-01

    We present a 16-channel readout integrated circuit (ROIC) with nanosecond-resolution time to digital converter (TDC) for pixelated Cadmium Telluride (CdTe) gamma-ray detectors. The 4 × 4 pixel array ROIC is the proof of concept of the 10 × 10 pixel array readout ASIC for positron-emission tomography (PET) scanner, positron-emission mammography (PEM) scanner, and Compton gamma camera. The electronics of each individual pixel integrates an analog front-end with switchable gain, an analog to digital converter (ADC), configuration registers, and a 4-state digital controller. For every detected photon, the pixel electronics provides the energy deposited in the detector with 10-bit resolution, and a fast trigger signal for time stamp. The ASIC contains the 16-pixel matrix electronics, a digital controller, five global voltage references, a TDC, a temperature sensor, and a band-gap based current reference. The ASIC has been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and occupies an area of 5.3 mm × 6.8 mm. The TDC shows a resolution of 95.5 ps, a precision of 600 ps at full width half maximum (FWHM), and a power consumption of 130 μW. In acquisition mode, the total power consumption of every pixel is 200 μW. An equivalent noise charge (ENC) of 160 e(-)RMS at maximum gain and negative polarity conditions has been measured at room temperature.

  20. A Triple-GEM Detector with Pixel Readout for High-Rate Beam Tracking in COMPASS

    NASA Astrophysics Data System (ADS)

    Nagel, T.; Austregesilo, A.; Haas, F.; Ketzer, B.; Konorov, I.; Krämer, M.; Mann, A.; Paul, S.

    2008-06-01

    For its physics program with a high-intensity hadron beam of 2 · 107 particles/s, the COMPASS experiment at CERN requires tracking of charged particles scattered by very small angles with respect to the incident beam direction. While good resolution in time and space is mandatory, the challenge is imposed by the high beam intensity, requiring radiation-hard detectors which add very little material to the beam path in order to minimise secondary interactions. To this end, a set of triple-GEM detectors with pixel readout in the beam region and 2-D strip readout in the periphery is currently being built. The pixel size has been chosen to be 1×1 mm2, which constitutes a compromise between the spatial resolution achievable and the number of readout channels. Surrounding the pixel area, a 2-D strip readout with a pitch of 400 μm has been realised on the same printed circuit foil. In total an active area of 10 × 10 cm2 is covered using 2048 readout channels. Analogue readout by the APV25 ASIC has been chosen in order to profit from amplitude measurements which help to improve the spatial resolution by clustering neighbouring hit strips or pixels. A detector prototype has been tested successfully in the 5 · 107 particles/s COMPASS muon beam, as well as in a focused hadron beam. The design of the detector and first results concerning its performance as a beam tracker will be presented.

  1. Design of a pixel cell optimized for a data push architecture readout

    SciTech Connect

    Atlas, E.L. ); Shapiro, S.; Cords, D. )

    1992-12-01

    A pixel cell has been designed which has been optimized for a data push architecture readout. It retains the features of preceding designs which allow time stamping, analog signal processing, XY address recording, ghost elimination and sparse data transmission. It eliminates a number of problems inherent in previous designs by use of sampled data techniques, destructive readout sampled data techniques, and current mode output drivers. This document examines the motivation for this new pixel and covers the theory of operation of the various blocks. A discussion of the tradeoffs affecting speed, power, device size, and radiation stability is included as well.

  2. Radiation Tolerance Studies of BTeV Pixel Readout Chip Prototypes

    SciTech Connect

    Gabriele Chiodini et al.

    2001-09-11

    We report on several irradiation studies performed on BTeV preFPIX2 pixel readout chip prototypes exposed to a 200 MeV proton beam at the Indiana University Cyclotron Facility. The preFPIX2 pixel readout chip has been implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The tests confirmed the radiation tolerance of the chip design to proton total dose of 26 MRad. In addition, non destructive radiation-induced single event upsets have been observed in on-chip static registers and the single bit upset cross section has been measured.

  3. Small-Scale Readout System Prototype for the STAR PIXEL Detector

    SciTech Connect

    Szelezniak, Michal; Anderssen, Eric; Greiner, Leo; Matis, Howard; Ritter, Hans Georg; Stezelberger, Thorsten; Sun, Xiangming; Thomas, James; Vu, Chinh; Wieman, Howard

    2008-10-10

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  4. 3D-FBK pixel sensors with CMS readout: First test results

    NASA Astrophysics Data System (ADS)

    Obertino, M.; Solano, A.; Vilela Pereira, A.; Alagoz, E.; Andresen, J.; Arndt, K.; Bolla, G.; Bortoletto, D.; Boscardin, M.; Brosius, R.; Bubna, M.; Dalla Betta, G.-F.; Jensen, F.; Krzywda, A.; Kumar, A.; Kwan, S.; Lei, C. M.; Menasce, D.; Moroni, L.; Ngadiuba, J.; Osipenkov, I.; Perera, L.; Povoli, M.; Prosser, A.; Rivera, R.; Shipsey, I.; Tan, P.; Terzo, S.; Uplegger, L.; Wagner, S.; Dinardo, M.

    2013-08-01

    Silicon 3D detectors consist of an array of columnar electrodes of both doping types which penetrate entirely in the detector bulk, perpendicularly to the surface. They are emerging as one of the most promising technologies for innermost layers of tracking devices for the foreseen upgrades of the LHC. Until recently, properties of 3D sensors have been investigated mostly with ATLAS readout electronics. 3D pixel sensors compatible with the CMS readout were first fabricated at SINTEF (Oslo, Norway), and more recently at FBK (Trento, Italy) and CNM (Barcelona, Spain). Several sensors with different electrode configurations, bump-bonded with the CMS pixel PSI46 readout chip, were characterized in laboratory and tested at Fermilab with a proton beam of 120 GeV/c. Preliminary results of the data analysis are presented.

  5. 18k Channels single photon counting readout circuit for hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e- and the equivalent noise charge is 168 e- rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  6. An induced charge readout scheme incorporating image charge splitting on discrete pixels

    NASA Astrophysics Data System (ADS)

    Kataria, D. O.; Lapington, J. S.

    2003-11-01

    Top hat electrostatic analysers used in space plasma instruments typically use microchannel plates (MCPs) followed by discrete pixel anode readout for the angular definition of the incoming particles. Better angular definition requires more pixels/readout electronics channels but with stringent mass and power budgets common in space applications, the number of channels is restricted. We describe here a technique that improves the angular definition using induced charge and an interleaved anode pattern. The technique adopts the readout philosophy used on the CRRES and CLUSTER I instruments but has the advantages of the induced charge scheme and significantly reduced capacitance. Charge from the MCP collected by an anode pixel is inductively split onto discrete pixels whose geometry can be tailored to suit the scientific requirements of the instrument. For our application, the charge is induced over two pixels. One of them is used for a coarse angular definition but is read out by a single channel of electronics, allowing a higher rate handling. The other provides a finer angular definition but is interleaved and hence carries the expense of lower rate handling. Using the technique and adding four channels of electronics, a four-fold increase in the angular resolution is obtained. Details of the scheme and performance results are presented.

  7. Fast Readout Architectures for Large Arrays of Digital Pixels: Examples and Applications

    PubMed Central

    Gabrielli, A.

    2014-01-01

    Modern pixel detectors, particularly those designed and constructed for applications and experiments for high-energy physics, are commonly built implementing general readout architectures, not specifically optimized in terms of speed. High-energy physics experiments use bidimensional matrices of sensitive elements located on a silicon die. Sensors are read out via other integrated circuits bump bonded over the sensor dies. The speed of the readout electronics can significantly increase the overall performance of the system, and so here novel forms of readout architectures are studied and described. These circuits have been investigated in terms of speed and are particularly suited for large monolithic, low-pitch pixel detectors. The idea is to have a small simple structure that may be expanded to fit large matrices without affecting the layout complexity of the chip, while maintaining a reasonably high readout speed. The solutions might be applied to devices for applications not only in physics but also to general-purpose pixel detectors whenever online fast data sparsification is required. The paper presents also simulations on the efficiencies of the systems as proof of concept for the proposed ideas. PMID:24778588

  8. High-speed readout of high-Z pixel detectors with the LAMBDA detector

    NASA Astrophysics Data System (ADS)

    Pennicard, D.; Smoljanin, S.; Sheviakov, I.; Xia, Q.; Rothkirch, A.; Yu, Y.; Struth, B.; Hirsemann, H.; Graafsma, H.

    2014-12-01

    High-frame-rate X-ray pixel detectors make it possible to perform time-resolved experiments at synchrotron beamlines, and to make better use of these sources by shortening experiment times. LAMBDA is a photon-counting hybrid pixel detector based on the Medipix3 chip, designed to combine a small pixel size of 55 μm, a large tileable module design, high speed, and compatibility with ``high-Z'' sensors for hard X-ray detection. This technical paper focuses on LAMBDA's high-speed-readout functionality, which allows a frame rate of 2000 frames per second with no deadtime between successive images. This takes advantage of the Medipix3 chip's ``continuous read-write'' function and highly parallelised readout. The readout electronics serialise this data and send it back to a server PC over two 10 Gigabit Ethernet links. The server PC controls the detector and receives, processes and stores the data using software designed for the Tango control system. As a demonstration of high-speed readout of a high-Z sensor, a GaAs LAMBDA detector was used to make a high-speed X-ray video of a computer fan.

  9. FDM Readout Assembly with Flexible, Superconducting Connection to Cryogenic kilo-Pixel TES Detectors

    NASA Astrophysics Data System (ADS)

    Bruijn, M. P.; van der Linden, A. J.; Ridder, M. L.; van Weers, H. J.

    2016-07-01

    We describe a new fabrication process for a superconducting, flexible, and demountable connector to a kilo-pixel transition edge sensor. The demountable part contains planar coils for inductive coupling, in particular suited for AC-biased frequency domain multiplexed readout. A fixed connection to a chip with superconducting LC filters and SQUID readout is made by gold bump bonding with a connection resistance of 1.1 {× } 10^{-4} Ω . The Nb-based connecting lines on the flexible part show a superconducting transition around 7 K, which enables testing of connectors and LC filters in a simple L-He setup.

  10. The FE-I4 Pixel Readout Chip and the IBL Module

    SciTech Connect

    Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; Beccherle, Roberto; Darbo, Giovanni; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

    2012-05-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  11. Development of readout system for FE-I4 pixel module using SiTCP

    NASA Astrophysics Data System (ADS)

    Teoh, J. J.; Hanagaki, K.; Ikegami, Y.; Takubo, Y.; Terada, S.; Unno, Y.

    2013-12-01

    The ATLAS pixel detector will be replaced in the future High Luminosity-Large Hadron Collider (HL-LHC) upgrade to preserve or improve the detector performance at high luminosity environment. To meet the tight requirements of the upgrade, a new pixel Front-End (FE) Integrated Circuit (IC) called FE-I4 has been developed. We have then devised a readout system for the new FE IC. Our system incorporates Silicon Transmission Control Protocol (SiTCP) technology (Uchida, 2008 [1]) which utilizes the standard TCP/IP and UDP communication protocols. This technology allows direct data access and transfer between a readout hardware chain and PC via a high speed Ethernet. In addition, the communication protocols are small enough to be implemented in a single Field-Programable Gate Array (FPGA). Relying on this technology, we have been able to construct a very compact, versatile and fast readout system. We have developed a firmware and software together with the readout hardware chain. We also have established basic functionalities for reading out FE-I4.

  12. Radiation tolerance of prototype BTeV pixel detector readout chips

    SciTech Connect

    Gabriele Chiodini et al.

    2002-07-12

    High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is the state of the art technology able to meet these challenges. We report on irradiation studies performed on BTeV pixel readout chip prototypes exposed to a 200 MeV proton beam at Indiana University Cyclotron Facility. Prototype pixel readout chip preFPIX2 has been developed at Fermilab for collider experiments and implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The tests confirmed the radiation tolerance of the chip design to proton total dose up to 87 MRad. In addition, non destructive radiation-induced single event upsets have been observed in on-chip static registers and the single bit upset cross section has been extensively measured.

  13. Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

    NASA Technical Reports Server (NTRS)

    Rider, D.; Blavier, J-F.; Cunningham, T.; Hancock, B.; Key, R.; Pannell, Z.; Sander, S.; Seshadri, S.; Sun, C.; Wrigley, C.

    2011-01-01

    Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

  14. Review of hybrid pixel detector readout ASICs for spectroscopic X-ray imaging

    NASA Astrophysics Data System (ADS)

    Ballabriga, R.; Alozy, J.; Campbell, M.; Frojdh, E.; Heijne, E. H. M.; Koenig, T.; Llopart, X.; Marchal, J.; Pennicard, D.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.; Zuber, M.

    2016-01-01

    Semiconductor detector readout chips with pulse processing electronics have made possible spectroscopic X-ray imaging, bringing an improvement in the overall image quality and, in the case of medical imaging, a reduction in the X-ray dose delivered to the patient. In this contribution we review the state of the art in semiconductor-detector readout ASICs for spectroscopic X-ray imaging with emphasis on hybrid pixel detector technology. We discuss how some of the key challenges of the technology (such as dealing with high fluxes, maintaining spectral fidelity, power consumption density) are addressed by the various ASICs. In order to understand the fundamental limits of the technology, the physics of the interaction of radiation with the semiconductor detector and the process of signal induction in the input electrodes of the readout circuit are described. Simulations of the process of signal induction are presented that reveal the importance of making use of the small pixel effect to minimize the impact of the slow motion of holes and hole trapping in the induced signal in high-Z sensor materials. This can contribute to preserve fidelity in the measured spectrum with relatively short values of the shaper peaking time. Simulations also show, on the other hand, the distortion in the energy spectrum due to charge sharing and fluorescence photons when the pixel pitch is decreased. However, using recent measurements from the Medipix3 ASIC, we demonstrate that the spectroscopic information contained in the incoming photon beam can be recovered by the implementation in hardware of an algorithm whereby the signal from a single photon is reconstructed and allocated to the pixel with the largest deposition.

  15. Development and simulation results of a sparsification and readout circuit for wide pixel matrices

    NASA Astrophysics Data System (ADS)

    Gabrielli, A.; Giorgi, F.; Morsani, F.; Villa, M.

    2011-06-01

    In future collider experiments, the increasing luminosity and centre of mass energy are rising challenging problems in the design of new inner tracking systems. In this context we develop high-efficiency readout architectures for large binary pixel matrices that are meant to cope with the high-stressing conditions foreseen in the innermost layers of a tracker [The SuperB Conceptual Design Report, INFN/AE-07/02, SLAC-R-856, LAL 07-15, Available online at: http://www.pi.infn.it/SuperB]. We model and design digital readout circuits to be integrated on VLSI ASICs. These architectures can be realized with different technology processes and sensors: they can be implemented on the same silicon sensor substrate of a CMOS MAPS devices (Monolithic Active Pixel Sensor), on the CMOS tier of a hybrid pixel sensor or in a 3D chip where the digital layer is stacked on the sensor and the analog layers [V. Re et al., Nuc. Instr. and Meth. in Phys. Res. A, doi:10.1016/j.nima.2010.05.039]. In the presented work, we consider a data-push architecture designed for a sensor matrix of an area of about 1.3 cm 2 with a pitch of 50 microns. The readout circuit tries to take great advantage of the high density of in-pixel digital logic allowed by vertical integration. We aim at sustaining a rate density of 100 Mtrack ṡ s -1 ṡ cm -2 with a temporal resolution below 1 μs. We show how this architecture can cope with these stressing conditions presenting the results of Monte Carlo simulations.

  16. The pixel detector readout ASIC for the MicroVertex Detector of the PANDA experiment

    NASA Astrophysics Data System (ADS)

    Mazza, G.; Calvo, D.; De Remigis, P.; Kugathasan, T.; Mignone, M.; Rivetti, A.; Toscano, L.; Wheadon, R.

    2013-08-01

    The silicon pixel detector of the PANDA experiment is characterized by both high track density and the absence of a hardware trigger signal, thus leading to a huge amount of data to be acquired and transmitted to the DAQ. In order to cope with such challenging requirements, an ASIC based custom solution for the electronic readout has been chosen. The ASIC, named ToPiX, will provide the time position of each hit and a measure of the charge released with the Time over Threshold (ToT) technique. A reduced scale prototype in a CMOS 0.13 μm technology has been designed and tested. The prototype includes four columns made of 128 pixel cells, four columns of 32 cells and the end of column readout with a 32 cells deep FIFO for each double column. Each cell embeds a charge amplifier with constant current feedback capacitor discharge, a comparator with per cell adjustable threshold, 12-bits leading and trailing edge register for time and ToT measurement and an 8 bits configuration register. All the readout logic has been SEU-hardened by design using either Hamming encoding or triple modular redundancy. The chip has been tested both electrically via a test pulse input and connected to a detector in a beam test.

  17. Prototype AEGIS: A Pixel-Array Readout Circuit for Gamma-Ray Imaging

    PubMed Central

    Barber, H. Bradford; Augustine, F. L.; Furenlid, L.; Ingram, C. M.; Grim, G. P.

    2015-01-01

    Semiconductor detector arrays made of CdTe/CdZnTe are expected to be the main components of future high-performance, clinical nuclear medicine imaging systems. Such systems will require small pixel-pitch and much larger numbers of pixels than are available in current semiconductor-detector cameras. We describe the motivation for developing a new readout integrated circuit, AEGIS, for use in hybrid semiconductor detector arrays, that may help spur the development of future cameras. A basic design for AEGIS is presented together with results of an HSPICE™ simulation of the performance of its unit cell. AEGIS will have a shaper-amplifier unit cell and neighbor pixel readout. Other features include the use of a single input power line with other biases generated on-board, a control register that allows digital control of all thresholds and chip configurations and an output approach that is compatible with list-mode data acquisition. An 8×8 prototype version of AEGIS is currently under development; the full AEGIS will be a 64×64 array with 300 μm pitch. PMID:26345126

  18. The NA62 Gigatracker: Detector properties and pixel read-out architectures

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Noy, M.; Petrucci, F.; Riedler, P.; Rivetti, A.; Tiuraniemi, S.

    2010-12-01

    The beam spectrometer of the NA62 experiment, named Gigatracker, has to perform single track reconstruction with unprecedented time resolution (150 ps rms) in a harsh radiation environment. To meet these requirements, and in order to reduce material budget to a minimum, three hybrid silicon pixel detector stations will be installed in vacuum. An adequate strategy to compensate for the discriminator time-walk must be implemented and R&D investigating two different options is ongoing. Two read-out chip prototypes have been designed in order to compare their performance: one approach is based on the use of a constant-fraction discriminator followed by an on-pixel TDC, while the other one is based on the use of a time-over-threshold circuit followed by a TDC shared by a group of pixels. This paper describes the Gigatracker system, presents the global architectures of both read-out ASICs and reviews the current status of the R&D project.

  19. Readout of a 176 pixel FDM system for SAFARI TES arrays

    NASA Astrophysics Data System (ADS)

    Hijmering, R. A.; den Hartog, R.; Ridder, M.; van der Linden, A. J.; van der Kuur, J.; Gao, J. R.; Jackson, B.

    2016-07-01

    In this paper we present the results of our 176-pixel prototype of the FDM readout system for SAFARI, a TES-based focal-plane instrument for the far-IR SPICA mission. We have implemented the knowledge obtained from the detailed study on electrical crosstalk reported previously. The effect of carrier leakage is reduced by a factor two, mutual impedance is reduced to below 1 nH and mutual inductance is removed. The pixels are connected in stages, one quarter of the array half of the array and the full array, to resolve intermediate technical issues. A semi-automated procedure was incorporated to find all optimal settings for all pixels. And as a final step the complete array has been connected and 132 pixels have been read out simultaneously within the frequency range of 1-3.8MHz with an average frequency separation of 16kHz. The noise was found to be detector limited and was not affected by reading out all pixels in a FDM mode. With this result the concept of using FDM for multiplexed bolometer read out for the SAFARI instrument has been demonstrated.

  20. Characterization of edgeless pixel detectors coupled to Medipix2 readout chip

    NASA Astrophysics Data System (ADS)

    Kalliopuska, Juha; Tlustos, Lukas; Eränen, Simo; Virolainen, Tuula

    2011-08-01

    VTT has developed a straightforward and fast process to fabricate four-side buttable (edgeless) microstrip and pixel detectors on 6 in. (150 mm) wafers. The process relies on advanced ion implantation to activate the edges of the detector instead of using polysilicon. The article characterizes 150 μm thick n-on-n edgeless pixel detector prototypes with a dead layer at the edge below 1 μm. Electrical and radiation response characterization of 1.4×1.4 cm2 n-on-n edgeless detectors has been done by coupling them to the Medipix2 readout chips. The distance of the detector's physical edge from the pixels was either 20 or 50 μm. The leakage current of flip-chip bonded edgeless Medipix2 detector assembles were measured to be ˜90 nA/cm2 and no breakdown was observed below 110 V. Radiation response characterization includes X-ray tube and radiation source responses. The characterization results show that the detector's response at the pixels close to the physical edge of the detector depend dramatically on the pixel-to-edge distance.

  1. FPIX2: A radiation-hard pixel readout chip for BTeV

    SciTech Connect

    David C. Christian et al.

    2000-12-11

    A radiation-hard pixel readout chip, FPIX2, is being developed at Fermilab for the recently approved BTeV experiment. Although designed for BTeV, this chip should also be appropriate for use by CDF and DZero. A short review of this development effort is presented. Particular attention is given to the circuit redesign which was made necessary by the decision to implement FPIX2 using a standard deep-submicron CMOS process rather than an explicitly radiation-hard CMOS technology, as originally planned. The results of initial tests of prototype 0.25{micro} CMOS devices are presented, as are plans for the balance of the development effort.

  2. Amorphous silicon pixel radiation detectors and associated thin film transistor electronics readout

    SciTech Connect

    Perez-Mendez, V.; Drewery, J.; Hong, W.S.; Jing, T.; Kaplan, S.N.; Lee, H.; Mireshghi, A.

    1994-10-01

    We describe the characteristics of thin (1 {mu}m) and thick (>30 {mu}m) hydrogenated amorphous silicon p-i-n diodes which are optimized for detecting and recording the spatial distribution of charged particles, x-rays and {gamma} rays. For x-ray, {gamma} ray, and charged particle detection we can use thin p-i-n photosensitive diode arrays coupled to evaporated layers of suitable scintillators. For direct detection of charged particles with high resistance to radiation damage, we use the thick p-i-n diode arrays. Deposition techniques using helium dilution, which produce samples with low stress are described. Pixel arrays for flux exposures can be readout by transistor, single diode or two diode switches. Polysilicon charge sensitive pixel amplifiers for single event detection are described. Various applications in nuclear, particle physics, x-ray medical imaging, neutron crystallography, and radionuclide chromatography are discussed.

  3. A vertically integrated pixel readout device for the Vertex Detector at the International Linear Collider

    SciTech Connect

    Deptuch, Grzegorz; Christian, David; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2008-12-01

    3D-Integrated Circuit technology enables higher densities of electronic circuitry per unit area without the use of nanoscale processes. It is advantageous for mixed mode design with precise analog circuitry because processes with conservative feature sizes typically present lower process dispersions and tolerate higher power supply voltages, resulting in larger separation of a signal from the noise floor. Heterogeneous wafers (different foundries or different process families) may be combined with some 3D integration methods, leading to the optimization of each tier in the 3D stack. Tracking and vertexing in future High-Energy Physics (HEP) experiments involves construction of detectors composed of up to a few billions of channels. Readout electronics must record the position and time of each measurement with the highest achievable precision. This paper reviews a prototype of the first 3D readout chip for HEP, designed for a vertex detector at the International Linear Collider. The prototype features 20 x 20 {micro}m{sup 2} pixels, laid out in an array of 64 x 64 elements and was fabricated in a 3-tier 0.18 {micro}m Fully Depleted SOI CMOS process at MIT-Lincoln Laboratory. The tests showed correct functional operation of the structure. The chip performs a zero-suppressed readout. Successive submissions are planned in a commercial 3D bulk 0.13 {micro}m CMOS process to overcome some of the disadvantages of an FDSOI process.

  4. AC Read-Out Circuits for Single Pixel Characterization of TES Microcalorimeters and Bolometers

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; van de Kuur, J.; Bandler, S.; Bruijn, M.; de Korte, P.; Gao, J. R.; den Hartog, R.; Hijmering, R. A.; Hoevers, H.; Koshropanah, P.; hide

    2011-01-01

    SRON is developing Frequency Domain Multiplexing (FDM) for the read-out of transition edge sensor (TES) soft x-ray microcalorimeters for the XMS instrument of the International X-ray Observatory and far-infrared bolometers for the SAFARI instrument on the Japanese mission SPICA. In FDM the TESs are AC voltage biased at frequencies from 0.5 to 6 MHz in a superconducting LC resonant circuit and the signal is read-out by low noise and high dynamic range SQUIDs amplifiers. The TES works as an amplitude modulator. We report on several AC bias experiments performed on different detectors. In particular, we discuss the results on the characterization of Goddard Space Flight Center x-ray pixels and SRON bolometers. The paper focuses on the analysis of different read-out configurations developed to optimize the noise and the impedance matching between the detectors and the SQUID amplifier. A novel feedback network electronics has been developed to keep the SQUID in flux locked loop, when coupled to superconducting high Q circuits, and to optimally tune the resonant bias circuit. The achieved detector performances are discussed in view of the instrument requirement for the two space missions.

  5. AC Read-Out Circuits for Single Pixel Characterization of TES Microcalorimeters and Bolometers

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; van de Kuur, J.; Bandler, S.; Bruijn, M.; de Korte, P.; Gao, J. R.; den Hartog, R.; Hijmering, R. A.; Hoevers, H.; Koshropanah, P.; Kilbourne, C.; Lindemann, M. A.; Parra Borderias, M.; Ridder, M.

    2011-01-01

    SRON is developing Frequency Domain Multiplexing (FDM) for the read-out of transition edge sensor (TES) soft x-ray microcalorimeters for the XMS instrument of the International X-ray Observatory and far-infrared bolometers for the SAFARI instrument on the Japanese mission SPICA. In FDM the TESs are AC voltage biased at frequencies from 0.5 to 6 MHz in a superconducting LC resonant circuit and the signal is read-out by low noise and high dynamic range SQUIDs amplifiers. The TES works as an amplitude modulator. We report on several AC bias experiments performed on different detectors. In particular, we discuss the results on the characterization of Goddard Space Flight Center x-ray pixels and SRON bolometers. The paper focuses on the analysis of different read-out configurations developed to optimize the noise and the impedance matching between the detectors and the SQUID amplifier. A novel feedback network electronics has been developed to keep the SQUID in flux locked loop, when coupled to superconducting high Q circuits, and to optimally tune the resonant bias circuit. The achieved detector performances are discussed in view of the instrument requirement for the two space missions.

  6. Design of the low area monotonic trim DAC in 40 nm CMOS technology for pixel readout chips

    NASA Astrophysics Data System (ADS)

    Drozd, A.; Szczygiel, R.; Maj, P.; Satlawa, T.; Grybos, P.

    2014-12-01

    The recent research in hybrid pixel detectors working in single photon counting mode focuses on nanometer or 3D technologies which allow making pixels smaller and implementing more complex solutions in each of the pixels. Usually single pixel in readout electronics for X-ray detection comprises of charge amplifier, shaper and discriminator that allow classification of events occurring at the detector as true or false hits by comparing amplitude of the signal obtained with threshold voltage, which minimizes the influence of noise effects. However, making the pixel size smaller often causes problems with pixel to pixel uniformity and additional effects like charge sharing become more visible. To improve channel-to-channel uniformity or implement an algorithm for charge sharing effect minimization, small area trimming DACs working in each pixel independently are necessary. However, meeting the requirement of small area often results in poor linearity and even non-monotonicity. In this paper we present a novel low-area thermometer coded 6-bit DAC implemented in 40 nm CMOS technology. Monte Carlo simulations were performed on the described design proving that under all conditions designed DAC is inherently monotonic. Presented DAC was implemented in the prototype readout chip with 432 pixels working in single photon counting mode, with two trimming DACs in each pixel. Each DAC occupies the area of 8 μm × 18.5 μm. Measurements and chips' tests were performed to obtain reliable statistical results.

  7. Gated Geiger mode avalanche photodiode pixels with integrated readout electronics for low noise photon detection

    NASA Astrophysics Data System (ADS)

    Vilella, E.; Comerma, A.; Alonso, O.; Gascon, D.; Diéguez, A.

    2012-12-01

    Avalanche photodiodes operated in the Geiger mode offer a high intrinsic gain as well as an excellent timing accuracy. These qualities make the sensor specially suitable for those applications where detectors with high sensitivity and low timing uncertainty are required. Moreover, they are compatible with standard CMOS technologies, allowing sensor and front-end electronics integration within the pixel cell. However, the sensor suffers from high levels of intrinsic noise, which may lead to erroneous results and limit the range of detectable signals. They also increase the amount of data that has to be stored. In this work, we present a pixel based on a Geiger-mode avalanche photodiode operated in the gated mode to reduce the probability to detect noise counts interfering with photon arrival events. The readout circuit is based on a two grounds scheme to enable low reverse bias overvoltages and consequently lessen the dark count rate. Experimental characterization of the fabricated pixel with the HV-AMS 0.35 μm standard technology is also presented in this article.

  8. Amorphous silicon pixel radiation detectors and associated thin film transistor electronics readout

    SciTech Connect

    Perez-Mendez, V.; Cho, G.; Drewery, J.; Jing, T.; Kaplan, S.N.; Mireshghi, A.; Wildermuth, D. ); Goodman, C. ); Fujieda, I. )

    1992-07-01

    We describe the characteristics of thin (1 {mu}m) and thick (> 30 {mu}m) hydrogenated amorphous silicon p-i-n diodes which are optimized for detecting and recording the spatial distribution of charged particles, x-ray, {gamma} rays and thermal neutrons. For x-ray, {gamma} ray, and charged particle detection we can use thin p-i-n photosensitive diode arrays coupled to evaporated layers of suitable scintillators. For thermal neutron detection we use thin (2{approximately}5 {mu}m) gadolinium converters on 30 {mu}m thick a-Si:H diodes. For direct detection of minimum ionizing particles and others with high resistance to radiation damage, we use the thick p-i-n diode arrays. Diode and amorphous silicon readouts as well as polysilicon pixel amplifiers are described.

  9. Method of acquiring an image from an optical structure having pixels with dedicated readout circuits

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2006-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  10. Readout characteristics of integrated monolithic InGaAs active pixel sensor array

    NASA Astrophysics Data System (ADS)

    Kim, Quiesup; Cunningham, Thomas J.; Pain, Bedabrata; Lange, Michael J.; Olsen, Gregory H.

    1997-12-01

    A newly fabricated monolithic InGaAs active pixel image sensor is presented, and its readout characteristics are described. The sensor is fabricated from InGaAs epitaxially deposited on an InP substrate. It consists of an InGaAs photodiode connected to InP depletion-mode junction field effect transistors (JFETs) for signal buffering, selection and reset. The monolithic sensor eliminates the need for hybridization with a silicon multiplexer, and in addition, allows the sensor to be front illuminated, making it sensitive to visible as well as IR radiation. With further development, the sensor is ideal for dual band (visible/IR) applications, including optical communication. It is also well suited to applications requiring near room temperature, broad band response such as for atmospheric gas sensing and target identification. Two different types of small 4 by 1 test arrays have been fabricated. One is a source follower per detector architecture. Here the signal charge is integrated on the photodiode capacitance. The photodiode is connected to a gate of a JFET configured as a source-follower, which buffers the photodiode voltage. The other test circuit uses a capacitive transimpedance amplifier. This circuit contains an invertor using an input JFET with a passive JFET load. The photodiode is connected to the JFET gate. A feedback capacitor causes the circuit to act as an integrator, while keeping the diode input bias relatively constant. Both circuits also contain JFET switches for reset and selection. Selection connects the output of the chosen cell onto a common output bus. In this exploratory development effort, the effectiveness of these two different readout circuits will be discussed in terms of leakage, operating frequency, and temperature. These results then will guide for the second phase demonstration of integrated two dimensional monolithic active pixel sensor arrays for application in transportable shipboard surveillance, night vision and emission

  11. Frequency-multiplexed bias and readout of a 16-pixel superconducting nanowire single-photon detector array

    NASA Astrophysics Data System (ADS)

    Doerner, S.; Kuzmin, A.; Wuensch, S.; Charaev, I.; Boes, F.; Zwick, T.; Siegel, M.

    2017-07-01

    We demonstrate a 16-pixel array of microwave-current driven superconducting nanowire single-photon detectors with an integrated and scalable frequency-division multiplexing architecture, which reduces the required number of bias and readout lines to a single microwave feed line. The electrical behavior of the photon-sensitive nanowires, embedded in a resonant circuit, as well as the optical performance and timing jitter of the single detectors is discussed. Besides the single pixel measurements, we also demonstrate the operation of a 16-pixel array with a temporal, spatial, and photon-number resolution.

  12. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    NASA Technical Reports Server (NTRS)

    Kimble, Randy A.; Pain, B.; Norton, T. J.; Haas, P.; Fisher, Richard R. (Technical Monitor)

    2001-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution for the readout while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest or by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  13. Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

    NASA Astrophysics Data System (ADS)

    Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P. L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C. A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.; Mugnier, H.; Musa, L.; Puggioni, C.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Siddhanta, S.; Usai, G.; van Hoorne, J. W.; Yi, J.

    2015-06-01

    Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

  14. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    NASA Technical Reports Server (NTRS)

    Kimble, Randy A.; Pain, Bedabrata; Norton, Timothy J.; Haas, J. Patrick; Oegerle, William R. (Technical Monitor)

    2002-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest of by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  15. A low power cryogenic 512 × 512-pixel infrared readout integrated circuit with modified MOS device model

    NASA Astrophysics Data System (ADS)

    Zhao, Hongliang; Liu, Xinghui; Xu, Chao

    2013-11-01

    A low power cryogenic readout integrated circuit (ROIC) for 512 × 512-pixel infrared focal plane array (IRFPA) image system, is presented. In order to improve the precision of the circuit simulation at cryogenic temperatures, a modified MOS device model is proposed. The model is based on BSIM3 model, and uses correction parameters to describe carrier freeze-out effect at low temperatures to improve the fitting accuracy for low temperature MOS device simulation. A capacitive trans-impedance amplifier (CTIA) with inherent correlated double sampling (CDS) configuration is employed to realize a high performance readout interfacing circuit in a pixel area of 30 × 30 μm2. Optimized column readout timing and structure are applied to reduce the power consumption. The experimental chip fabricated by a standard 0.35 μm 2P4M CMOS process shows more than 10 MHz readout rate with less than 70 mW power consumption under 3.3 V supply voltage at 77-150 K operated temperatures. And it occupies an area of 18 × 17 mm2.

  16. A pixel read-out architecture implementing a two-stage token ring, zero suppression and compression

    NASA Astrophysics Data System (ADS)

    Heuvelmans, S.; Boerrigter, M.

    2011-01-01

    Increasing luminosity in high energy physics experiments leads to new challenges in the design of data acquisition systems for pixel detectors. With the upgrade of the LHCb experiment, the data processing will be changed; hit data from every collision will be transported off the pixel chip, without any trigger selection. A read-out architecture is proposed which is able to obtain low hit data loss on limited silicon area by using the logic beneath the pixels as a data buffer. Zero suppression and redundancy reduction ensure that the data rate off chip is minimized. A C++ model has been created for simulation of functionality and data loss, and for system development. A VHDL implementation has been derived from this model.

  17. A prototype of a new generation readout ASIC in 65nm CMOS for pixel detectors at HL-LHC

    NASA Astrophysics Data System (ADS)

    Monteil, E.; Pacher, L.; Paternò, A.; Loddo, F.; Demaria, N.; Gaioni, L.; De Canio, F.; Traversi, G.; Re, V.; Ratti, L.; Rivetti, A.; Da Rocha Rolo, M.; Dellacasa, G.; Mazza, G.; Marzocca, C.; Licciulli, F.; Ciciriello, F.; Marconi, S.; Placidi, P.; Magazzù, G.; Stabile, A.; Mattiazzo, S.; Veri, C.

    2016-12-01

    This paper describes a readout ASIC prototype designed by CHIPIX65 project, part of RD53, for a pixel detector at HL-LHC . A 64 × 64 matrix of 50 × 50 μ m2 pixels is realised. A digital architecture has been developed, with particle efficiency above 99.9% at 3 GHz/cm2 pixel rate, 1 MHz trigger rate with 12.5 μ s latency. Two analog front end designs, one synchronous and one asynchronous, are implemented. Charge is measured with 5-bit precision and the analog dead-time is below 1%. IP-blocks (DAC, ADC, BandGap, SER, sLVS-TX/RX) and very front ends are silicon proven, irradiated to 600-800Mrad.

  18. A prototype of pixel readout ASIC in 65 nm CMOS technology for extreme hit rate detectors at HL-LHC

    NASA Astrophysics Data System (ADS)

    Paternò, A.; Pacher, L.; Monteil, E.; Loddo, F.; Demaria, N.; Gaioni, L.; De Canio, F.; Traversi, G.; Re, V.; Ratti, L.; Rivetti, A.; Da Rocha Rolo, M.; Dellacasa, G.; Mazza, G.; Marzocca, C.; Licciulli, F.; Ciciriello, F.; Marconi, S.; Placidi, P.; Magazzù, G.; Stabile, A.; Mattiazzo, S.; Veri, C.

    2017-02-01

    This paper describes a readout ASIC prototype designed by the CHIPIX65 project, part of RD53, for a pixel detector at HL-LHC . A 64×64 matrix of 50×50μm2 pixels is realised. A digital architecture has been developed, with particle efficiency above 99.5% at 3 GHz/cm2 pixel rate, trigger frequency of 1 MHz and 12.5μsec latency. Two analog front end designs, one synchronous and one asynchronous, are implemented. Charge is measured with 5-bit precision, analog dead-time below 1%. The chip integrates for the first time many of the components developed by the collaboration in the past, including the Digital-to-Analog converters, Bandgap reference, Serializer, sLVS drivers, and analog Front Ends. Irradiation tests on these components proved their reliability up to 600 Mrad.

  19. A compact 64-pixel CsI(T1)/Si PIN photodiode imaging module with IC readout

    SciTech Connect

    Gruber, Gregory J.; Choong, Woon-Seng; Moses, William W.; Derenzo, Stephen E.; Holland, Stephen E.; Pedrali-Noy, Marzio; Krieger, Brad; Mandelli, Emanuele; Meddeler, Gerrit; Wang, Nadine W.

    2001-08-09

    We characterize the performance of a complete 64-pixel compact gamma camera imaging module consisting of optically isolated 3 mm 3 mm 5 mm CsI(Tl) crystals coupled to a custom array of low-noise Si PIN photodiodes read out by a custom IC. At 50 V bias the custom 64-pixel photodiode arrays demonstrate an average leakage current of 28 pA per 3 mm 3 mm pixel, a 98.5 percent yield of pixels with <100 pA leakage, and a quantum efficiency of about 80 percent for 540 nm CsI(Tl) scintillation photons. The custom 64-channel readout IC uses low-noise preamplifiers, shaper amplifiers, and a winner-take-all (WTA) multiplexer. The IC demonstrates maximum gain of 120 mV / 1000 e-, the ability to select the largest input signal in less than 150 ns, and low electronic noise at 8 ms peaking time ranging from 25 e- rms (unloaded) to an estimated 180 e- rms (photodiode load of 3 pF, 50 pA). At room temperature a complete 64-pixel detector module employing a custom photodiode array and readout IC demonstrates an average energy resolution of 23.4 percent fwhm and an intrinsic spatial resolution of 3.3 mm fwhm for the 140 keV emissions of 99mTc. Construction of an array of such imaging modules is straightforward, hence this technology shows strong potential for numerous compact gamma camera applications, including scintimammography.

  20. Development and characterization of high-resolution neutron pixel detectors based on Timepix read-out chips

    NASA Astrophysics Data System (ADS)

    Krejci, F.; Zemlicka, J.; Jakubek, J.; Dudak, J.; Vavrik, D.; Köster, U.; Atkins, D.; Kaestner, A.; Soltes, J.; Viererbl, L.; Vacik, J.; Tomandl, I.

    2016-12-01

    Using a suitable isotope such as 6Li and 10B semiconductor hybrid pixel detectors can be successfully adapted for position sensitive detection of thermal and cold neutrons via conversion into energetic light ions. The adapted devices then typically provides spatial resolution at the level comparable to the pixel pitch (55 μm) and sensitive area of about few cm2. In this contribution, we describe further progress in neutron imaging performance based on the development of a large-area hybrid pixel detector providing practically continuous neutron sensitive area of 71 × 57 mm2. The measurements characterising the detector performance at the cold neutron imaging instrument ICON at PSI and high-flux imaging beam-line Neutrograph at ILL are presented. At both facilities, high-resolution high-contrast neutron radiography with the newly developed detector has been successfully applied for objects which imaging were previously difficult with hybrid pixel technology (such as various composite materials, objects of cultural heritage etc.). Further, a significant improvement in the spatial resolution of neutron radiography with hybrid semiconductor pixel detector based on the fast read-out Timepix-based detector is presented. The system is equipped with a thin planar 6LiF convertor operated effectively in the event-by-event mode enabling position sensitive detection with spatial resolution better than 10 μm.

  1. The ToPiX v4 prototype for the triggerless readout of the PANDA silicon pixel detector

    NASA Astrophysics Data System (ADS)

    Mazza, G.; Calvo, D.; De Remigis, P.; Mignone, M.; Olave, J.; Rivetti, A.; Wheadon, R.; Zotti, L.

    2015-01-01

    ToPiX v4 is the prototype for the readout of the silicon pixel sensors for the Micro Vertex Detector of the PANDA experiment. ToPiX provides position, time and energy measurement of the incoming particles and is designed for the triggerless environment foreseen in PANDA. The prototype includes 640 pixels with a size of 100 × 100 μm2, a 160 MHz time stamp distribution circuit to measure both particle arrival time and released energy (via ToT technique) and the full control logic. The ASIC is designed in a 0.13 μm CMOS technology with SEU protection techniques for the digital parts.

  2. Development of a radiation-hardened SRAM with EDAC algorithm for fast readout CMOS pixel sensors for charged particle tracking

    NASA Astrophysics Data System (ADS)

    Wei, X.; Li, B.; Chen, N.; Wang, J.; Zheng, R.; Gao, W.; Wei, T.; Gao, D.; Hu, Y.

    2014-08-01

    CMOS pixel sensors (CPS) are attractive for use in the innermost particle detectors for charged particle tracking due to their good trade-off between spatial resolution, material budget, radiation hardness, and readout speed. With the requirements of high readout speed and high radiation hardness to total ionizing dose (TID) for particle tracking, fast readout CPS are composed by integrating a data compression block and two SRAM IP cores. However, the radiation hardness of the SRAM IP cores is not as high as that of the other parts in CPS, and thus the radiation hardness of the whole CPS chip is lowered. Especially, when CPS are migrated into 0.18-μm processes, the single event upset (SEU) effects should be also considered besides TID and single event latchup (SEL) effects. This paper presents a radiation-hardened SRAM with enhanced radiation hardness to SEU. An error detection and correction (EDAC) algorithm and a bit-interleaving storage strategy are adopted in the design. The prototype design has been fabricated in a 0.18-μm process. The area of the new SRAM is increased 1.6 times as compared with a non-radiation-hardened SRAM due to the integration of EDAC algorithm and the adoption of radiation hardened layout. The access time is increased from 5 ns to 8 ns due to the integration of EDAC algorithm. The test results indicate that the design satisfy requirements of CPS for charged particle tracking.

  3. Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

    NASA Astrophysics Data System (ADS)

    Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

    2015-05-01

    In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R&D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision.

  4. Readout circuit with pixel-level analog-to-digital conversion

    NASA Astrophysics Data System (ADS)

    Gan, Wenxiang; Ding, Ruijun; Ni, Yunzhi

    2005-01-01

    Pixel level on-focal-plane analog to digital conversion(ADC) promises many advantages including high performance and low power consumption. In this paper we argue that CMOS technology scaling will make pixel level ADC increasingly popular. Then we introduce four existing techniques for pixel level ADC. The first is an over sampling technique which uses a one bit first order sigma delta modulator for each pixel to directly convert photo charge to bits, consists of an integrator, a one bit DAC and a clocked comparator. The second technique is Nyquist rate multi-channel-bit-serial(MCBS) ADC. The technique uses special successive comparisons to convert the pixel voltage to bits. The third technique bases on a simple and robust pulse frequency modulation(PFM) scheme that can convert the photocurrent of photodetectors to proportional pulse frequency. The fourth is a software-controlled ADC, which utilize a algorithm, takes a desired photocurrent quantization scale to output bits. Each pixel contains a programmable digital processing element which directly controls the behavior of the photo detector with software. These four techniques are analyzed and compared according to their advantages, disadvantages and suitable application area. Finally we mention our current and future works with one of these techniques.

  5. A 65 nm pixel readout ASIC with quick transverse momentum discrimination capabilities for the CMS Tracker at HL-LHC

    NASA Astrophysics Data System (ADS)

    Ceresa, D.; Kaplon, J.; Francisco, R.; Caratelli, A.; Kloukinas, K.; Marchioro, A.

    2016-01-01

    A readout ASIC for the hybrid pixel detector with the capability of performing quick recognition of particles with high transverse momentum has been designed for the requirements of the CMS Outer Tracker at the High Luminosity LHC . The particle momentum dicrimination capability represents the main challenge for this design together with the low power requirement: the constraint of low mass for the new tracker dictates a total power budget of less than 100 mW/cm2. The choice of a 65 nm CMOS technology has made it possible to satisfy this power requirement despite the fairly large amount of logic necessary to perform the momentum discrimination and the continuous operation at 40 MHz. Several techniques for low power have been used to implement this logic that performs cluster reduction, position offset correction and coordinate encoding. A prototype chip including a large part of the final functionality and the full front-end has been realized and comprises a matrix of 16 by 3 rectangular pixels of 100 μm × 1446 μm, providing 7.65 mm2 of segmented active area. Measurements of the analog front-end characteristics closely match the simulations and confirm the consumption of < 30 μA per pixel. Front-end characterization and irradiation results up to 150 MRad are also reported.

  6. Development of n+-in-p planar pixel quadsensor flip-chipped with FE-I4 readout ASICs

    NASA Astrophysics Data System (ADS)

    Unno, Y.; Kamada, S.; Yamamura, K.; Yamamoto, H.; Hanagaki, K.; Hori, R.; Ikegami, Y.; Nakamura, K.; Takubo, Y.; Takashima, R.; Tojo, J.; Kono, T.; Nagai, R.; Saito, S.; Sugibayashi, K.; Hirose, M.; Jinnouchi, O.; Sato, S.; Sawai, H.; Hara, K.; Sato, Kz.; Sato, Kj.; Iwabuchi, S.; Suzuki, J.

    2017-01-01

    We have developed flip-chip modules applicable to the pixel detector for the HL-LHC. New radiation-tolerant n+-in-p planar pixel sensors of a size of four FE-I4 application-specific integrated circuits (ASICs) are laid out in a 6-in wafer. Variation in readout connection for the pixels at the boundary of ASICs is implemented in the design of quadsensors. Bump bonding technology is developed for four ASICs onto one quadsensor. Both sensors and ASICs are thinned to 150 μm before bump bonding, and are held flat with vacuum chucks. Using lead-free SnAg solder bumps, we encounter deficiency with large areas of disconnected bumps after thermal stress treatment, including irradiation. Surface oxidation of the solder bumps is identified as a critical source of this deficiency after bump bonding trials, using SnAg bumps with solder flux, indium bumps, and SnAg bumps with a newly-introduced hydrogen-reflow process. With hydrogen-reflow, we establish flux-less bump bonding technology with SnAg bumps, appropriate for mass production of the flip-chip modules with thin sensors and thin ASICs.

  7. A pixel unit-cell targeting 16 ns resolution and radiation hardness in a column read-out particle vertex detector

    SciTech Connect

    Wright, M.; Millaud, J.; Nygren, D.

    1992-10-01

    A pixel unit cell (PUC) circuit architecture, optimized for a column read out architecture, is reported. Each PUC contains an integrator, active filter, comparator, and optional analog store. The time-over-threshold (TOT) discriminator allows an all-digital interface to the array periphery readout while passing an analog measure of collected charge. Use of (existing) radiation hard processes, to build a detector bump-bonded to a pixel readout array, is targeted. Here, emphasis is on a qualitative explanation of how the unique circuit implementation benefits operation for Super Collider (SSC) detector application.

  8. Front-end electronics in a 65 nm CMOS process for high density readout of pixel sensors

    NASA Astrophysics Data System (ADS)

    Gaioni, Luigi; Manghisoni, Massimo; Ratti, Lodovico; Re, Valerio; Traversi, Gianluca

    2011-09-01

    In future high energy physics experiments (HEP), readout integrated circuits for vertexing and tracking applications will be implemented by means of CMOS devices belonging to processes with minimum feature size in the 100 nm span. In these nanoscale technologies the impact of new dielectric materials and processing techniques on the analog behavior of MOSFETs has to be carefully evaluated. This paper is concerned with the study of the analog properties, in particular in terms of noise performance and radiation hardness, of MOSFET devices belonging to a 65 nm CMOS low power technology. The behavior of the 1/ f and white noise terms is studied as a function of the main device parameters before and after exposure to 10 keV X-rays and 60Co γ-rays. A prototype chip designed in a 65 nm CMOS process including deep n-well MAPS structures and a fast front-end conceived for the readout of high-resistivity pixel sensors will be introduced.

  9. Method and apparatus of high dynamic range image sensor with individual pixel reset

    NASA Technical Reports Server (NTRS)

    Yadid-Pecht, Orly (Inventor); Pain, Bedabrata (Inventor); Fossum, Eric R. (Inventor)

    2001-01-01

    A wide dynamic range image sensor provides individual pixel reset to vary the integration time of individual pixels. The integration time of each pixel is controlled by column and row reset control signals which activate a logical reset transistor only when both signals coincide for a given pixel.

  10. Readout cross-talk for alpha-particle measurements in a pixelated sensor system

    NASA Astrophysics Data System (ADS)

    Norlin, B.; Reza, S.; Krapohl, D.; Fröjdh, E.; Thungström, G.

    2015-05-01

    Simulations in Medici are performed to quantify crosstalk and charge sharing in a hybrid pixelated silicon detector. Crosstalk and charge sharing degrades the spatial and spectral resolution of single photon processing X-ray imaging systems. For typical medical X-ray imaging applications, the process is dominated by charge sharing between the pixels in the sensor. For heavier particles each impact generates a large amount of charge and the simulation seems to over predict the charge collection efficiency. This indicates that some type of non modelled degradation of the charge transport efficiency exists, like the plasma effect where the plasma might shield the generated charges from the electric field and hence distorts the charge transport process. Based on the simulations it can be reasoned that saturation of the amplifiers in the Timepix system might generate crosstalk that increases the charge spread measured from ion impact on the sensor.

  11. Multi-pixel Geiger-mode avalanche photodiode and wavelength-shifting fibre-optics readout of plastic scintillator counters for the EMMA underground experiment

    NASA Astrophysics Data System (ADS)

    Akhrameev, E. V.; Bezrukov, L. B.; Dzaparova, I. M.; Davitashvili, I. Sh.; Enqvist, T.; Fynbo, H.; Guliev, Zh. Sh.; Inzhechik, L. V.; Izmaylov, A. O.; Joutsenvaara, J.; Khabibullin, M. M.; Khotjantsev, A. N.; Kudenko, Yu. G.; Kuusiniemi, P.; Lubsandorzhiev, B. K.; Mineev, O. V.; Olanterä, L.; Petkov, V. B.; Poleshuk, R. V.; Räihä, T.; Shaibonov, B. A. J.; Sarkamo, J.; Shaykhiev, A. T.; Trzaska, W.; Volchenko, V. I.; Volchenko, G. V.; Yanin, A. F.; Yershov, N. V.

    2009-10-01

    The results of a development of a scintillator counter with wavelength shifting (WLS) fibre and a multi-pixel Geiger-mode avalanche photodiode readout are presented. The photodiode has a metal-resistor-semiconductor layered structure and operates in the limited Geiger mode. The scintillator counter has been developed for the EMMA underground cosmic ay experiment.

  12. A silicon pixel readout ASIC with 100 ps time resolution for the NA62 experiment

    NASA Astrophysics Data System (ADS)

    Dellacasa, G.; Garbolino, S.; Marchetto, F.; Martoiu, S.; Mazza, G.; Rivetti, A.; Wheadon, R.

    2011-01-01

    The silicon tracker of the NA62 experiment requires the measurement of the particles arrival time with a resolution better than 200 ps rms and a spatial resolution of 300 μm. A time measurement technique based on a Time to Amplitude Converter has been implemented in an ASIC in order to prove the possibility to integrate a TDC with resolution better than 200 ps in a pixel cell. Time-walk problem has been addressed with the use of the Constant Fraction Discriminator technique. The ASIC has been designed in a CMOS 0.13 μm technology with single event upset protection of the digital logic.

  13. Toward VIP-PIX: A Low Noise Readout ASIC for Pixelated CdTe Gamma-Ray Detectors for Use in the Next Generation of PET Scanners.

    PubMed

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Puigdengoles, Carles; Lorenzo, Gianluca De; Martínez, Ricardo

    2013-08-01

    VIP-PIX will be a low noise and low power pixel readout electronics with digital output for pixelated Cadmium Telluride (CdTe) detectors. The proposed pixel will be part of a 2D pixel-array detector for various types of nuclear medicine imaging devices such as positron-emission tomography (PET) scanners, Compton gamma cameras, and positron-emission mammography (PEM) scanners. Each pixel will include a SAR ADC that provides the energy deposited with 10-bit resolution. Simultaneously, the self-triggered pixel which will be connected to a global time-to-digital converter (TDC) with 1 ns resolution will provide the event's time stamp. The analog part of the readout chain and the ADC have been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and characterized with an external test pulse. The power consumption of these parts is 200 μW from a 2.5 V supply. It offers 4 switchable gains from ±10 mV/fC to ±40 mV/fC and an input charge dynamic range of up to ±70 fC for the minimum gain for both polarities. Based on noise measurements, the expected equivalent noise charge (ENC) is 65 e(-) RMS at room temperature.

  14. Toward VIP-PIX: A Low Noise Readout ASIC for Pixelated CdTe Gamma-Ray Detectors for Use in the Next Generation of PET Scanners

    PubMed Central

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Puigdengoles, Carles; Lorenzo, Gianluca De; Martínez, Ricardo

    2013-01-01

    VIP-PIX will be a low noise and low power pixel readout electronics with digital output for pixelated Cadmium Telluride (CdTe) detectors. The proposed pixel will be part of a 2D pixel-array detector for various types of nuclear medicine imaging devices such as positron-emission tomography (PET) scanners, Compton gamma cameras, and positron-emission mammography (PEM) scanners. Each pixel will include a SAR ADC that provides the energy deposited with 10-bit resolution. Simultaneously, the self-triggered pixel which will be connected to a global time-to-digital converter (TDC) with 1 ns resolution will provide the event’s time stamp. The analog part of the readout chain and the ADC have been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and characterized with an external test pulse. The power consumption of these parts is 200 μW from a 2.5 V supply. It offers 4 switchable gains from ±10 mV/fC to ±40 mV/fC and an input charge dynamic range of up to ±70 fC for the minimum gain for both polarities. Based on noise measurements, the expected equivalent noise charge (ENC) is 65 e− RMS at room temperature. PMID:24187382

  15. The RD53 collaboration's SystemVerilog-UVM simulation framework and its general applicability to design of advanced pixel readout chips

    NASA Astrophysics Data System (ADS)

    Marconi, S.; Conti, E.; Placidi, P.; Christiansen, J.; Hemperek, T.

    2014-10-01

    The foreseen Phase 2 pixel upgrades at the LHC have very challenging requirements for the design of hybrid pixel readout chips. A versatile pixel simulation platform is as an essential development tool for the design, verification and optimization of both the system architecture and the pixel chip building blocks (Intellectual Properties, IPs). This work is focused on the implemented simulation and verification environment named VEPIX53, built using the SystemVerilog language and the Universal Verification Methodology (UVM) class library in the framework of the RD53 Collaboration. The environment supports pixel chips at different levels of description: its reusable components feature the generation of different classes of parameterized input hits to the pixel matrix, monitoring of pixel chip inputs and outputs, conformity checks between predicted and actual outputs and collection of statistics on system performance. The environment has been tested performing a study of shared architectures of the trigger latency buffering section of pixel chips. A fully shared architecture and a distributed one have been described at behavioral level and simulated; the resulting memory occupancy statistics and hit loss rates have subsequently been compared.

  16. A Pixel Readout Chip in 40 nm CMOS Process for High Count Rate Imaging Systems with Minimization of Charge Sharing Effects

    SciTech Connect

    Maj, Piotr; Grybos, P.; Szczgiel, R.; Kmon, P.; Drozd, A.; Deptuch, G.

    2013-11-07

    We present a prototype chip in 40 nm CMOS technology for readout of hybrid pixel detector. The prototype chip has a matrix of 18x24 pixels with a pixel pitch of 100 μm. It can operate both in single photon counting (SPC) mode and in C8P1 mode. In SPC the measured ENC is 84 erms (for the peaking time of 48 ns), while the effective offset spread is below 2 mV rms. In the C8P1 mode the chip reconstructs full charge deposited in the detector, even in the case of charge sharing, and it identifies a pixel with the largest charge deposition. The chip architecture and preliminary measurements are reported.

  17. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    DOE PAGES

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; ...

    2016-01-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. As a result, the potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  18. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    PubMed Central

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W.; Szczygiel, Robert; Sandy, Alec

    2016-01-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. The potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed. PMID:27140146

  19. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time.

    PubMed

    Zhang, Qingteng; Dufresne, Eric M; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W; Szczygiel, Robert; Sandy, Alec

    2016-05-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. The potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  20. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    SciTech Connect

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W.; Szczygiel, Robert; Sandy, Alec

    2016-01-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. As a result, the potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  1. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    DOE PAGES

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; ...

    2016-04-19

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. Lastly, the potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  2. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time

    SciTech Connect

    Zhang, Qingteng; Dufresne, Eric M.; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W.; Szczygiel, Robert; Sandy, Alec

    2016-04-19

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. Lastly, the potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  3. Simulation of digital pixel readout chip architectures with the RD53 SystemVerilog-UVM verification environment using Monte Carlo physics data

    NASA Astrophysics Data System (ADS)

    Conti, E.; Marconi, S.; Christiansen, J.; Placidi, P.; Hemperek, T.

    2016-01-01

    The simulation and verification framework developed by the RD53 collaboration is a powerful tool for global architecture optimization and design verification of next generation hybrid pixel readout chips. In this paper the framework is used for studying digital pixel chip architectures at behavioral level. This is carried out by simulating a dedicated, highly parameterized pixel chip description, which makes it possible to investigate different grouping strategies between pixels and different latency buffering and arbitration schemes. The pixel hit information used as simulation input can be either generated internally in the framework or imported from external Monte Carlo detector simulation data. The latter have been provided by both the CMS and ATLAS experiments, featuring HL-LHC operating conditions and the specifications related to the Phase 2 upgrade. Pixel regions and double columns were simulated using such Monte Carlo data as inputs: the performance of different latency buffering architectures was compared and the compliance of different link speeds with the expected column data rate was verified.

  4. First functionality tests of a 64 × 64 pixel DSSC sensor module connected to the complete ladder readout

    NASA Astrophysics Data System (ADS)

    Donato, M.; Hansen, K.; Kalavakuru, P.; Kirchgessner, M.; Kuster, M.; Porro, M.; Reckleben, C.; Turcato, M.

    2017-03-01

    The European X-ray Free Electron Laser (XFEL.EU) will provide every 0.1 s a train of 2700 spatially coherent ultrashort X-ray pulses at 4.5 MHz repetition rate. The Small Quantum Systems (SQS) instrument and the Spectroscopy and Coherent Scattering instrument (SCS) operate with soft X-rays between 0.5 keV–6 keV. The DEPFET Sensor with Signal Compression (DSSC) detector is being developed to meet the requirements set by these two XFEL.EU instruments. The DSSC imager is a 1 mega-pixel camera able to store up to 800 single-pulse images per train. The so-called ladder is the basic unit of the DSSC detector. It is the single unit out of sixteen identical-units composing the DSSC-megapixel camera, containing all representative electronic components of the full-size system and allows testing the full electronic chain. Each DSSC ladder has a focal plane sensor with 128× 512 pixels. The read-out ASIC provides full-parallel readout of the sensor pixels. Every read-out channel contains an amplifier and an analog filter, an up-to 9 bit ADC and the digital memory. The ASIC amplifier have a double front-end to allow one to use either DEPFET sensors or Mini-SDD sensors. In the first case, the signal compression is a characteristic intrinsic of the sensor; in the second case, the compression is implemented at the first amplification stage. The goal of signal compression is to meet the requirement of single-photon detection capability and wide dynamic range. We present the first results of measurements obtained using a 64× 64 pixel DEPFET sensor attached to the full final electronic and data-acquisition chain.

  5. Characterisation of individual pixel efficiency in the PILATUS II sensor

    NASA Astrophysics Data System (ADS)

    Schubert, A.; O'Keefe, G. J.; Sobott, B. A.; Kirby, N. M.; Rassool, R. P.

    2010-11-01

    Synchrotron applications such as protein crystallography and small-angle X-ray scattering (SAXS) demand precise knowledge of detector pixel efficiency for data corrections. Current techniques used to determine detector efficiency are only applicable for the specific set-up for which the calibration is performed. Here the effect of comparator thresholding on pixel efficiency for PILATUS is presented for standard amplifier and shaper gain settings, allowing users to make necessary corrections to their intensity data for various threshold settings without requiring repeated empirical calibrations. A three-dimensional TCAD simulation of the sensor is also presented and is used to confirm the experimental result.

  6. Uncooled digital IRFPA-family with 17μm pixel-pitch based on amorphous silicon with massively parallel Sigma-Delta-ADC readout

    NASA Astrophysics Data System (ADS)

    Weiler, D.; Hochschulz, F.; Würfel, D.; Lerch, R.; Geruschke, T.; Wall, S.; Heß, J.; Wang, Q.; Vogt, H.

    2014-06-01

    This paper presents the results of an advanced digital IRFPA-family developed by Fraunhofer IMS. The IRFPA-family compromises the two different optical resolutions VGA (640 ×480 pixel) and QVGA (320 × 240 pixel) by using a pin-compatible detector board. The uncooled IRFPAs are designed for thermal imaging applications in the LWIR (8 .. 14μm) range with a full-frame frequency of 30 Hz and a high thermal sensitivity. The microbolometer with a pixel-pitch of 17μm consists of amorphous silicon as the sensing layer. By scaling and optimizing our previous microbolometer technology with a pixel-pitch of 25μm we enhance the thermal sensitivity of the microbolometer. The microbolometers are read out by a novel readout architecture which utilizes massively parallel on-chip Sigma-Delta-ADCs. This results in a direct digital conversion of the resistance change of the microbolometer induced by incident infrared radiation. To reduce production costs a chip-scale-package is used as vacuum package. This vacuum package consists of an IR-transparent window with an antireflection coating and a soldering frame which is fixed by a wafer-to-chip process directly on top of the CMOS-substrate. The chip-scale-package is placed onto a detector board by a chip-on-board technique. The IRFPAs are completely fabricated at Fraunhofer IMS on 8" CMOS wafers with an additional surface micromachining process. In this paper the architecture of the readout electronics, the packaging, and the electro-optical performance characterization are presented.

  7. Experimental characterization of the 192 channel Clear-PEM frontend ASIC coupled to a multi-pixel APD readout of LYSO:Ce crystals

    NASA Astrophysics Data System (ADS)

    Albuquerque, Edgar; Bexiga, Vasco; Bugalho, Ricardo; Carriço, Bruno; Ferreira, Cláudia S.; Ferreira, Miguel; Godinho, Joaquim; Gonçalves, Fernando; Leong, Carlos; Lousã, Pedro; Machado, Pedro; Moura, Rui; Neves, Pedro; Ortigão, Catarina; Piedade, Fernando; Pinheiro, João F.; Rego, Joel; Rivetti, Angelo; Rodrigues, Pedro; Silva, José C.; Silva, Manuel M.; Teixeira, Isabel C.; Teixeira, João P.; Trindade, Andreia; Varela, João

    2009-01-01

    In the framework of the Clear-PEM project for the construction of a high-resolution scanner for breast cancer imaging, a very compact and dense frontend electronics system has been developed for readout of multi-pixel S8550 Hamamatsu APDs. The frontend electronics are instrumented with a mixed-signal Application-Specific Integrated Circuit (ASIC), which incorporates 192 low-noise charge pre-amplifiers, shapers, analog memory cells and digital control blocks. Pulses are continuously stored in memory cells at clock frequency. Channels above a common threshold voltage are readout for digitization by off-chip free-sampling ADCs. The ASIC has a size of 7.3×9.8 mm2 and was implemented in a AMS 0.35 μm CMOS technology. In this paper the experimental characterization of the Clear-PEM frontend ASIC, reading out multi-pixel APDs coupled to LYSO:Ce crystal matrices, is presented. The chips were mounted on a custom test board connected to six APD arrays and to the data acquisition system. Six 32-pixel LYSO:Ce crystal matrices coupled on both sides to APD arrays were readout by two test boards. All 384 channels were operational. The chip power consumption is 660 mW (3.4 mW per channel). A very stable behavior of the chip was observed, with an estimated ENC of 1200-1300e- at APD gain 100. The inter-channel noise dispersion and mean baseline variation is less than 8% and 0.5%, respectively. The spread in the gain between different channels is found to be 1.5%. Energy resolution of 16.5% at 511 keV and 12.8% at 662 keV has been measured. Timing measurements between the two APDs that readout the same crystal is extracted and compared with detailed Monte Carlo simulations. At 511 keV the measured single photon time RMS resolution is 1.30 ns, in very good agreement with the expected value of 1.34 ns.

  8. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Bindi, M.; Falchieri, D.; Gabrielli, A.; Travaglini, R.; Chen, S.-P.; Hsu, S.-C.; Hauck, S.; Kugel, A.

    2014-11-01

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer - the Insertable B-Layer or IBL - located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1.

  9. Monolithic integration of individually addressable light-emitting diode color pixels

    NASA Astrophysics Data System (ADS)

    Chung, Kunook; Sui, Jingyang; Demory, Brandon; Teng, Chu-Hsiang; Ku, Pei-Cheng

    2017-03-01

    Monolithic integration of individually addressable light-emitting diode (LED) color pixels is reported. The integration is enabled by local strain engineering. The use of a nanostructured active region comprising one or more nanopillars allows color tuning across the visible spectrum. In the current work, integration of amber, green, and blue pixels is demonstrated. The nanopillar LEDs exhibit an electrical performance comparable to that of a conventional thin-film LED fabricated on the same wafer. The proposed platform uses only standard epitaxy and a similar process flow as a conventional LED. It is also shown that the emission intensity can be linearly tuned without shifting the color coordinate of individual pixels.

  10. Photon counting readout pixel array in 0.18-μm CMOS technology for on-line gamma-ray imaging of 103palladium seeds for permanent breast seed implant (PBSI) brachytherapy

    NASA Astrophysics Data System (ADS)

    Goldan, A. H.; Karim, K. S.; Reznik, A.; Caldwell, C. B.; Rowlands, J. A.

    2008-03-01

    Permanent breast seed implant (PBSI) brachytherapy technique was recently introduced as an alternative to high dose rate (HDR) brachytherapy and involves the permanent implantation of radioactive 103Palladium seeds into the surgical cavity of the breast for cancer treatment. To enable accurate seed implantation, this research introduces a gamma camera based on a hybrid amorphous selenium detector and CMOS readout pixel architecture for real-time imaging of 103Palladium seeds during the PBSI procedure. A prototype chip was designed and fabricated in 0.18-μm n-well CMOS process. We present the experimental results obtained from this integrated photon counting readout pixel.

  11. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

    NASA Astrophysics Data System (ADS)

    Demaria, N.; Barbero, M. B.; Fougeron, D.; Gensolen, F.; Godiot, S.; Menouni, M.; Pangaud, P.; Rozanov, A.; Wang, A.; Bomben, M.; Calderini, G.; Crescioli, F.; Le Dortz, O.; Marchiori, G.; Dzahini, D.; Rarbi, F. E.; Gaglione, R.; Gonella, L.; Hemperek, T.; Huegging, F.; Karagounis, M.; Kishishita, T.; Krueger, H.; Rymaszewski, P.; Wermes, N.; Ciciriello, F.; Corsi, F.; Marzocca, C.; De Robertis, G.; Loddo, F.; Licciulli, F.; Andreazza, A.; Liberali, V.; Shojaii, S.; Stabile, A.; Bagatin, M.; Bisello, D.; Mattiazzo, S.; Ding, L.; Gerardin, S.; Giubilato, P.; Neviani, A.; Paccagnella, A.; Vogrig, D.; Wyss, J.; Bacchetta, N.; De Canio, F.; Gaioni, L.; Nodari, B.; Manghisoni, M.; Re, V.; Traversi, G.; Comotti, D.; Ratti, L.; Vacchi, C.; Beccherle, R.; Bellazzini, R.; Magazzu, G.; Minuti, M.; Morsani, F.; Palla, F.; Poulios, S.; Fanucci, L.; Rizzi, A.; Saponara, S.; Androsov, K.; Bilei, G. M.; Menichelli, M.; Conti, E.; Marconi, S.; Passeri, D.; Placidi, P.; Della Casa, G.; Mazza, G.; Rivetti, A.; Da Rocha Rolo, M. D.; Monteil, E.; Pacher, L.; Gajanana, D.; Gromov, V.; Hessey, N.; Kluit, R.; Zivkovic, V.; Havranek, M.; Janoska, Z.; Marcisovsky, M.; Neue, G.; Tomasek, L.; Kafka, V.; Sicho, P.; Vrba, V.; Vila, I.; Lopez-Morillo, E.; Aguirre, M. A.; Palomo, F. R.; Muñoz, F.; Abbaneo, D.; Christiansen, J.; Dannheim, D.; Dobos, D.; Linssen, L.; Pernegger, H.; Valerio, P.; Alipour Tehrani, N.; Bell, S.; Prydderch, M. L.; Thomas, S.; Christian, D. C.; Fahim, F.; Hoff, J.; Lipton, R.; Liu, T.; Zimmerman, T.; Garcia-Sciveres, M.; Gnani, D.; Mekkaoui, A.; Gorelov, I.; Hoeferkamp, M.; Seidel, S.; Toms, K.; De Witt, J. N.; Grillo, A.; Paternò, A.

    2016-12-01

    This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5-800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. The collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.

  12. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

    DOE PAGES

    Demaria, N.

    2016-12-21

    This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaborationmore » is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.« less

  13. Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

    SciTech Connect

    Demaria, N.

    2016-12-21

    This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.

  14. ``The Read-Out Driver'' ROD card for the Insertable B-layer (IBL) detector of the ATLAS experiment: commissioning and upgrade studies for the Pixel Layers 1 and 2

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Gabrielli, A.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Morettini, P.; Travaglini, R.; Wensing, M.

    2014-01-01

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL). The IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered for testing with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this paper system setups and results will be described, as well as preliminary studies on changes needed to adopt the ROD for the ATLAS Pixel Layers 1 and 2.

  15. Quantum state readout of individual quantum dots by electrostatic force detection

    NASA Astrophysics Data System (ADS)

    Miyahara, Yoichi; Roy-Gobeil, Antoine; Grutter, Peter

    2017-02-01

    Electric charge detection by atomic force microscopy (AFM) with single-electron resolution (e-EFM) is a promising way to investigate the electronic level structure of individual quantum dots (QDs). The oscillating AFM tip modulates the energy of the QDs, causing single electrons to tunnel between QDs and an electrode. The resulting oscillating electrostatic force changes the resonant frequency and damping of the AFM cantilever, enabling electrometry with a single-electron sensitivity. Quantitative electronic level spectroscopy is possible by sweeping the bias voltage. Charge stability diagram can be obtained by scanning the AFM tip around the QD. e-EFM technique enables to investigate individual colloidal nanoparticles and self-assembled QDs without nanoscale electrodes. e-EFM is a quantum electromechanical system where the back-action of a tunneling electron is detected by AFM; it can also be considered as a mechanical analog of admittance spectroscopy with a radio frequency resonator, which is emerging as a promising tool for quantum state readout for quantum computing. In combination with the topography imaging capability of the AFM, e-EFM is a powerful tool for investigating new nanoscale material systems which can be used as quantum bits.

  16. Improvements of a digital 25 μm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massively parallel Sigma-Delta-ADC readout

    NASA Astrophysics Data System (ADS)

    Weiler, Dirk; Ruß, Marco; Würfel, Daniel; Lerch, Renee; Yang, Pin; Bauer, Jochen; Heß, Jennifer; Kropelnicki, Piotr; Vogt, Holger

    2011-06-01

    This paper presents the improvements of an advanced digital VGA-IRFPA developed by Fraunhofer-IMS. The uncooled IRFPA is designed for thermal imaging applications in the LWIR (8 .. 14 μm) range with a full-frame frequency of 30 Hz and a high sensitivity with NETD < 100 mK @ f/1. The microbolometer with a pixel-pitch of 25 μm consists of amorphous silicon as the sensing layer. The structure of the microbolometer has been optimized for a better performance compared to the 1st generation IRFPA1. The thermal isolation has been doubled by increasing the length and by decreasing the width of the legs. To increase the fill-factor the contact areas have been reduced. The microbolometers are read out by a novel readout architecture which utilizes massively parallel on-chip Sigma-Delta-ADCs. This results in a direct digital conversion of the resistance change of the microbolometer induced by incident infrared radiation. Two different solutions for the vacuum package have been developed. To reduce production costs a chip-scale-package is used. This vacuum package consists of an IR-transparent window with antireflection coating and a soldering frame which is fixed by a wafer-to-chip process directly on top of the read substrate. An alternative solution based on the use of a standard ceramic package is utilized as a vacuum package. This packaging solution is used for high performance applications. The IRFPAs are completely fabricated at Fraunhofer-IMS on 8" CMOS wafers with an additional surface micromachining process.

  17. Serial Pixel Analog-to-Digital Converter

    SciTech Connect

    Larson, E D

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and “one-hot” counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  18. Hit efficiency study of CMS prototype forward pixel detectors

    SciTech Connect

    Kim, Dongwook; /Johns Hopkins U.

    2006-01-01

    In this paper the author describes the measurement of the hit efficiency of a prototype pixel device for the CMS forward pixel detector. These pixel detectors were FM type sensors with PSI46V1 chip readout. The data were taken with the 120 GeV proton beam at Fermilab during the period of December 2004 to February 2005. The detectors proved to be highly efficient (99.27 {+-} 0.02%). The inefficiency was primarily located near the corners of the individual pixels.

  19. Test-beam results of a silicon pixel detector with Time-over-Threshold read-out having ultra-precise time resolution

    NASA Astrophysics Data System (ADS)

    Aglieri Rinella, G.; Cortina Gil, E.; Fiorini, M.; Kaplon, J.; Kluge, A.; Marchetto, F.; Albarran, M. E. Martin; Morel, M.; Noy, M.; Perktold, L.; Tiuraniem, S.; Velghe, B.

    2015-12-01

    A time-tagging hybrid silicon pixel detector developed for beam tracking in the NA62 experiment has been tested in a dedicated test-beam at CERN with 10 GeV/c hadrons. Measurements include time resolution, detection efficiency and charge sharing between pixels, as well as effects due to bias voltage variations. A time resolution of less than 150 ps has been measured with a 200 μm thick silicon sensor, using an on-pixel amplifier-discriminator and an end-of-column DLL-based time-to-digital converter.

  20. TES Detector Noise Limited Readout Using SQUID Multiplexers

    NASA Technical Reports Server (NTRS)

    Staguhn, J. G.; Benford, D. J.; Chervenak, J. A.; Khan, S. A.; Moseley, S. H.; Shafer, R. A.; Deiker, S.; Grossman, E. N.; Hilton, G. C.; Irwin, K. D.

    2004-01-01

    The availability of superconducting Transition Edge Sensors (TES) with large numbers of individual detector pixels requires multiplexers for efficient readout. The use of multiplexers reduces the number of wires needed between the cryogenic electronics and the room temperature electronics and cuts the number of required cryogenic amplifiers. We are using an 8 channel SQUID multiplexer to read out one-dimensional TES arrays which are used for submillimeter astronomical observations. We present results from test measurements which show that the low noise level of the SQUID multiplexers allows accurate measurements of the TES Johnson noise, and that in operation, the readout noise is dominated by the detector noise. Multiplexers for large number of channels require a large bandwidth for the multiplexed readout signal. We discuss the resulting implications for the noise performance of these multiplexers which will be used for the readout of two dimensional TES arrays in next generation instruments.

  1. Backside-illuminated, high-QE, 3e- RoN, fast 700fps, 1760x1680 pixels CMOS imager for AO with highly parallel readout

    NASA Astrophysics Data System (ADS)

    Downing, Mark; Kolb, Johann; Baade, Dietrich; Balard, Philippe; Dierickx, Bart; Defernez, Arnaud; Dupont, Benoit; Feautrier, Philippe; Finger, Gert; Fryer, Martin; Gach, Jean-Luc; Guillaume, Christian; Hubin, Norbert; Iwert, Olaf; Jerram, Paul; Jorden, Paul; Pike, Andrew; Pratlong, Jerome; Reyes, Javier; Stadler, Eric; Walker, Andrew

    2012-07-01

    The success of the next generation of instruments for 8 to 40-m class telescopes will depend upon improving the image quality (correcting the distortion caused by atmospheric turbulence) by exploiting sophisticated Adaptive Optics (AO) systems. One of the critical components of the AO systems for the E-ELT has been identified as the Laser/Natural Guide Star (LGS/NGS) WaveFront Sensing (WFS) detector. The combination of large format, 1760x1680 pixels to finely sample (84x84 sub-apertures) the wavefront and the spot elongation of laser guide stars, fast frame rate of 700 (up to 1000) frames per second, low read noise (< 3e-), and high QE (> 90%) makes the development of such a device extremely challenging. Design studies by industry concluded that a thinned and backside-illuminated CMOS Imager as the most promising technology. This paper describes the multi-phased development plan that will ensure devices are available on-time for E-ELT first-light AO systems; the different CMOS pixel architectures studied; measured results of technology demonstrators that have validated the CMOS Imager approach; the design explaining the approach of massive parallelism (70,000 ADCs) needed to achieve low noise at high pixel rates of ~3 Gpixel/s ; the 88 channel LVDS data interface; the restriction that stitching (required due to the 5x6cm size) posed on the design and the solutions found to overcome these limitations. Two generations of the CMOS Imager will be built: a pioneering quarter sized device of 880x840 pixels capable of meeting first light needs of the E-ELT called NGSD (Natural Guide Star Detector); followed by the full size device, the LGSD (Laser Guide Star Detector). Funding sources: OPTICON FP6 and FP7 from European Commission and ESO.

  2. Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2013-03-01

    The Insertable B-layer (IBL) is a fourth pixel layer that will be added inside the existing ATLAS pixel detector during the long LHC shutdown of 2013 and 2014. The new four layer pixel system will ensure excellent tracking, vertexing and b-tagging performance in the high luminosity pile-up conditions projected for the next LHC run. The peak luminosity is expected to reach 3·1034 cm-2s-1with an integrated luminosity over the IBL lifetime of 300 fb-1 corresponding to a design lifetime fluence of 5·1015 neqcm-2 and ionizing dose of 250 Mrad including safety factors. The production front-end electronics FE-I4B for the IBL has been fabricated at the end of 2011 and has been extensively characterized on diced ICs as well as at the wafer level. The production tests at the wafer level were performed during 2012. Selected results of the diced IC characterization are presented, including measurements of the on-chip voltage regulators. The IBL powering scheme, which was chosen based on these results, is described. Preliminary wafer to wafer distributions as well as yield calculations are given.

  3. Preliminary demonstration of an IonCCD as an alternative pixelated anode for direct MCP readout in a compact MS-based detector.

    PubMed

    Hadjar, Omar; Fowler, William K; Kibelka, Gottfried; Schnute, William C

    2012-02-01

    We report on the preliminary testing of a new position-sensitive detector (PSD) by combining a microchannel plate (MCP) and a charge-sensitive pixilated anode with a direct readout based on charge-coupled detector (CCD) technology, which will be referred to as IonCCD (Hadjar et al. J Am Soc Mass Spectrom 22(4):612-623, 2011; Johnson et al. J Am Soc Mass Spectrom 22(8):1388-1394, 2011; Hadjar et al. J Am Soc Mass Spectrom 22(10):1872-1884, 2011). This work exploits the recently discovered electron detection capability of the IonCCD (Hadjar et al. J Am Soc Mass Spectrom 22(4):612-623, 2011), allowing it to be used directly behind an MC. This MCP-IonCCD configuration potentially obviates the need for electro-optical ion detector systems (EOIDs), which typically feature a relatively difficult-to-implement 5-kV power source as well as a phosphorus screen behind the MCP for conversion of electrons to photons prior to signal generation in a photosensitive CCD. Thus, the new system (MCP-IonCCD) has the potential to be smaller, simpler, more robust, and more cost efficient than EOID-based technologies in many applications. The use of the IonCCD as direct MCP readout anode, as opposed to its direct use as an ion detector, will benefit from the instant three-to-four-order-of-magnitude gain of the MCP with virtually no additional noise. The signal/noise gain can be used for either sensitivity or speed enhancement of the detector. The speed enhancement may motivate the development of faster IonCCD readout speeds (currently at 2.7 ms) to achieve the 2 kHz frame rate for which the IonCCD chip was designed, a must for transient signal applications. The presented detector exhibits clear potential not only as a trace analysis detector in scan-free mass spectrometry and electron spectroscopy but also as a compact detector for photon and particle imaging applications.

  4. Advanced power analysis methodology targeted to the optimization of a digital pixel readout chip design and its critical serial powering system

    NASA Astrophysics Data System (ADS)

    Marconi, S.; Orfanelli, S.; Karagounis, M.; Hemperek, T.; Christiansen, J.; Placidi, P.

    2017-02-01

    A dedicated power analysis methodology, based on modern digital design tools and integrated with the VEPIX53 simulation framework developed within RD53 collaboration, is being used to guide vital choices for the design and optimization of the next generation ATLAS and CMS pixel chips and their critical serial powering circuit (shunt-LDO). Power consumption is studied at different stages of the design flow under different operating conditions. Significant effort is put into extensive investigations of dynamic power variations in relation with the decoupling seen by the powering network. Shunt-LDO simulations are also reported to prove the reliability at the system level.

  5. Serial pixel analog-to-digital converter (ADC)

    NASA Astrophysics Data System (ADS)

    Larson, Eric D.

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and "one-hot" counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  6. High-flux ptychographic imaging using the new 55 µm-pixel detector ‘Lambda’ based on the Medipix3 readout chip

    SciTech Connect

    Wilke, R. N. Wallentin, J.; Osterhoff, M.; Pennicard, D.; Zozulya, A.; Sprung, M.; Salditt, T.

    2014-11-01

    The Large Area Medipix-Based Detector Array (Lambda) has been used in a ptychographic imaging experiment on solar-cell nanowires. By using a semi-transparent central stop, the high flux density provided by nano-focusing Kirkpatrick–Baez mirrors can be fully exploited for high-resolution phase reconstructions. Suitable detection systems that are capable of recording high photon count rates with single-photon detection are instrumental for coherent X-ray imaging. The new single-photon-counting pixel detector ‘Lambda’ has been tested in a ptychographic imaging experiment on solar-cell nanowires using Kirkpatrick–Baez-focused 13.8 keV X-rays. Taking advantage of the high count rate of the Lambda and dynamic range expansion by the semi-transparent central stop, a high-dynamic-range diffraction signal covering more than seven orders of magnitude has been recorded, which corresponds to a photon flux density of about 10{sup 5} photons nm{sup −2} s{sup −1} or a flux of ∼10{sup 10} photons s{sup −1} on the sample. By comparison with data taken without the semi-transparent central stop, an increase in resolution by a factor of 3–4 is determined: from about 125 nm to about 38 nm for the nanowire and from about 83 nm to about 21 nm for the illuminating wavefield.

  7. High-flux ptychographic imaging using the new 55 µm-pixel detector ‘Lambda’ based on the Medipix3 readout chip

    PubMed Central

    Wilke, R. N.; Wallentin, J.; Osterhoff, M.; Pennicard, D.; Zozulya, A.; Sprung, M.; Salditt, T.

    2014-01-01

    Suitable detection systems that are capable of recording high photon count rates with single-photon detection are instrumental for coherent X-ray imaging. The new single-photon-counting pixel detector ‘Lambda’ has been tested in a ptychographic imaging experiment on solar-cell nanowires using Kirkpatrick–Baez-focused 13.8 keV X-rays. Taking advantage of the high count rate of the Lambda and dynamic range expansion by the semi-transparent central stop, a high-dynamic-range diffraction signal covering more than seven orders of magnitude has been recorded, which corresponds to a photon flux density of about 105 photons nm−2 s−1 or a flux of ∼1010 photons s−1 on the sample. By comparison with data taken without the semi-transparent central stop, an increase in resolution by a factor of 3–4 is determined: from about 125 nm to about 38 nm for the nanowire and from about 83 nm to about 21 nm for the illuminating wavefield.

  8. Detecting individual extracellular vesicles using a multicolor in situ proximity ligation assay with flow cytometric readout

    PubMed Central

    Löf, Liza; Ebai, Tonge; Dubois, Louise; Wik, Lotta; Ronquist, K. Göran; Nolander, Olivia; Lundin, Emma; Söderberg, Ola; Landegren, Ulf; Kamali-Moghaddam, Masood

    2016-01-01

    Flow cytometry is a powerful method for quantitative and qualitative analysis of individual cells. However, flow cytometric analysis of extracellular vesicles (EVs), and the proteins present on their surfaces has been hampered by the small size of the EVs – in particular for the smallest EVs, which can be as little as 40 nm in diameter, the limited number of antigens present, and their low refractive index. We addressed these limitations for detection and characterization of EV by flow cytometry through the use of multiplex and multicolor in situ proximity ligation assays (in situ PLA), allowing each detected EV to be easily recorded over background noise using a conventional flow cytometer. By targeting sets of proteins on the surface that are specific for distinct classes of EVs, the method allows for selective recognition of populations of EVs in samples containing more than one type of EVs. The method presented herein opens up for analyses of EVs using flow cytometry for their characterization and quantification. PMID:27681459

  9. In vivo readout of CFTR function: ratiometric measurement of CFTR-dependent secretion by individual, identifiable human sweat glands.

    PubMed

    Wine, Jeffrey J; Char, Jessica E; Chen, Jonathan; Cho, Hyung-Ju; Dunn, Colleen; Frisbee, Eric; Joo, Nam Soo; Milla, Carlos; Modlin, Sara E; Park, Il-Ho; Thomas, Ewart A C; Tran, Kim V; Verma, Rohan; Wolfe, Marlene H

    2013-01-01

    To assess CFTR function in vivo, we developed a bioassay that monitors and compares CFTR-dependent and CFTR-independent sweat secretion in parallel for multiple (~50) individual, identified glands in each subject. Sweating was stimulated by intradermally injected agonists and quantified by optically measuring spherical sweat bubbles in an oil-layer that contained dispersed, water soluble dye particles that partitioned into the sweat bubbles, making them highly visible. CFTR-independent secretion (M-sweat) was stimulated with methacholine, which binds to muscarinic receptors and elevates cytosolic calcium. CFTR-dependent secretion (C-sweat) was stimulated with a β-adrenergic cocktail that elevates cytosolic cAMP while blocking muscarinic receptors. A C-sweat/M-sweat ratio was determined on a gland-by-gland basis to compensate for differences unrelated to CFTR function, such as gland size. The average ratio provides an approximately linear readout of CFTR function: the heterozygote ratio is ~0.5 the control ratio and for CF subjects the ratio is zero. During assay development, we measured C/M ratios in 6 healthy controls, 4 CF heterozygotes, 18 CF subjects and 4 subjects with 'CFTR-related' conditions. The assay discriminated all groups clearly. It also revealed consistent differences in the C/M ratio among subjects within groups. We hypothesize that these differences reflect, at least in part, levels of CFTR expression, which are known to vary widely. When C-sweat rates become very low the C/M ratio also tended to decrease; we hypothesize that this nonlinearity reflects ductal fluid absorption. We also discovered that M-sweating potentiates the subsequent C-sweat response. We then used potentiation as a surrogate for drugs that can increase CFTR-dependent secretion. This bioassay provides an additional method for assessing CFTR function in vivo, and is well suited for within-subject tests of systemic, CFTR-directed therapeutics.

  10. PIXEL PUSHER

    NASA Technical Reports Server (NTRS)

    Stanfill, D. F.

    1994-01-01

    Pixel Pusher is a Macintosh application used for viewing and performing minor enhancements on imagery. It will read image files in JPL's two primary image formats- VICAR and PDS - as well as the Macintosh PICT format. VICAR (NPO-18076) handles an array of image processing capabilities which may be used for a variety of applications including biomedical image processing, cartography, earth resources, and geological exploration. Pixel Pusher can also import VICAR format color lookup tables for viewing images in pseudocolor (256 colors). This program currently supports only eight bit images but will work on monitors with any number of colors. Arbitrarily large image files may be viewed in a normal Macintosh window. Color and contrast enhancement can be performed with a graphical "stretch" editor (as in contrast stretch). In addition, VICAR images may be saved as Macintosh PICT files for exporting into other Macintosh programs, and individual pixels can be queried to determine their locations and actual data values. Pixel Pusher is written in Symantec's Think C and was developed for use on a Macintosh SE30, LC, or II series computer running System Software 6.0.3 or later and 32 bit QuickDraw. Pixel Pusher will only run on a Macintosh which supports color (whether a color monitor is being used or not). The standard distribution medium for this program is a set of three 3.5 inch Macintosh format diskettes. The program price includes documentation. Pixel Pusher was developed in 1991 and is a copyrighted work with all copyright vested in NASA. Think C is a trademark of Symantec Corporation. Macintosh is a registered trademark of Apple Computer, Inc.

  11. PIXEL PUSHER

    NASA Technical Reports Server (NTRS)

    Stanfill, D. F.

    1994-01-01

    Pixel Pusher is a Macintosh application used for viewing and performing minor enhancements on imagery. It will read image files in JPL's two primary image formats- VICAR and PDS - as well as the Macintosh PICT format. VICAR (NPO-18076) handles an array of image processing capabilities which may be used for a variety of applications including biomedical image processing, cartography, earth resources, and geological exploration. Pixel Pusher can also import VICAR format color lookup tables for viewing images in pseudocolor (256 colors). This program currently supports only eight bit images but will work on monitors with any number of colors. Arbitrarily large image files may be viewed in a normal Macintosh window. Color and contrast enhancement can be performed with a graphical "stretch" editor (as in contrast stretch). In addition, VICAR images may be saved as Macintosh PICT files for exporting into other Macintosh programs, and individual pixels can be queried to determine their locations and actual data values. Pixel Pusher is written in Symantec's Think C and was developed for use on a Macintosh SE30, LC, or II series computer running System Software 6.0.3 or later and 32 bit QuickDraw. Pixel Pusher will only run on a Macintosh which supports color (whether a color monitor is being used or not). The standard distribution medium for this program is a set of three 3.5 inch Macintosh format diskettes. The program price includes documentation. Pixel Pusher was developed in 1991 and is a copyrighted work with all copyright vested in NASA. Think C is a trademark of Symantec Corporation. Macintosh is a registered trademark of Apple Computer, Inc.

  12. Readout of two-kilopixel transition-edge sensor arrays for Advanced ACTPol

    NASA Astrophysics Data System (ADS)

    Henderson, Shawn W.; Stevens, Jason R.; Amiri, Mandana; Austermann, Jason; Beall, James A.; Chaudhuri, Saptarshi; Cho, Hsiao-Mei; Choi, Steve K.; Cothard, Nicholas F.; Crowley, Kevin T.; Duff, Shannon M.; Fitzgerald, Colin P.; Gallardo, Patricio A.; Halpern, Mark; Hasselfield, Matthew; Hilton, Gene; Ho, Shuay-Pwu Patty; Hubmayr, Johannes; Irwin, Kent D.; Koopman, Brian J.; Li, Dale; Li, Yaqiong; McMahon, Jeff; Nati, Federico; Niemack, Michael; Reintsema, Carl D.; Salatino, Maria; Schillaci, Alessandro; Schmitt, Benjamin L.; Simon, Sara M.; Staggs, Suzanne T.; Vavagiakis, Eve M.; Ward, Jonathan T.

    2016-07-01

    Advanced ACTPol is an instrument upgrade for the six-meter Atacama Cosmology Telescope (ACT) designed to measure the cosmic microwave background (CMB) temperature and polarization with arcminute-scale angular resolution. To achieve its science goals, Advanced ACTPol utilizes a larger readout multiplexing factor than any previous CMB experiment to measure detector arrays with approximately two thousand transition-edge sensor (TES) bolometers in each 150 mm detector wafer. We present the implementation and testing of the Advanced ACTPol time-division multiplexing readout architecture with a 64-row multiplexing factor. This includes testing of individual multichroic detector pixels and superconducting quantum interference device (SQUID) multiplexing chips as well as testing and optimizing of the integrated readout electronics. In particular, we describe the new automated multiplexing SQUID tuning procedure developed to select and optimize the thousands of SQUID parameters required to readout each Advanced ACTPol array. The multichroic detector pixels in each array use separate channels for each polarization and each of the two frequencies, such that four TESes must be read out per pixel. Challenges addressed include doubling the number of detectors per multiplexed readout channel compared to ACTPol and optimizing the Nyquist inductance to minimize detector and SQUID noise aliasing.

  13. Improved Signal Chains for Readout of CMOS Imagers

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Hancock, Bruce; Cunningham, Thomas

    2009-01-01

    An improved generic design has been devised for implementing signal chains involved in readout from complementary metal oxide/semiconductor (CMOS) image sensors and for other readout integrated circuits (ICs) that perform equivalent functions. The design applies to any such IC in which output signal charges from the pixels in a given row are transferred simultaneously into sampling capacitors at the bottoms of the columns, then voltages representing individual pixel charges are read out in sequence by sequentially turning on column-selecting field-effect transistors (FETs) in synchronism with source-follower- or operational-amplifier-based amplifier circuits. The improved design affords the best features of prior source-follower-and operational- amplifier-based designs while overcoming the major limitations of those designs. The limitations can be summarized as follows: a) For a source-follower-based signal chain, the ohmic voltage drop associated with DC bias current flowing through the column-selection FET causes unacceptable voltage offset, nonlinearity, and reduced small-signal gain. b) For an operational-amplifier-based signal chain, the required bias current and the output noise increase superlinearly with size of the pixel array because of a corresponding increase in the effective capacitance of the row bus used to couple the sampled column charges to the operational amplifier. The effect of the bus capacitance is to simultaneously slow down the readout circuit and increase noise through the Miller effect.

  14. Gallium arsenide pixel detectors

    NASA Astrophysics Data System (ADS)

    Bates, R.; Campbell, M.; Cantatore, E.; D'Auria, S.; da Vià, C.; del Papa, C.; Heijne, E. M.; Middelkamp, P.; O'Shea, V.; Raine, C.; Ropotar, I.; Scharfetter, L.; Smith, K.; Snoeys, W.

    1998-02-01

    GaAs detectors can be fabricated with bidimensional single-sided electrode segmentation. They have been successfully bonded using flip-chip technology to the Omega-3 silicon read-out chip. We present here the design features of the GaAs pixel detectors and results from a test performed at the CERN SpS with a 120 GeV π- beam. The detection efficiency was 99.2% with a nominal threshold of 5000 e -.

  15. Design of the ATLAS IBL Readout System

    NASA Astrophysics Data System (ADS)

    Polini, Alessandro; Bruni, Graziano; Bruschi, Marco; D'Antone, Ignazio; Dopke, Jens; Falchieri, Davide; Flick, Tobias; Gabrielli, Alessandro; Grosse-Knetter, Joern; Joseph, John; Krieger, Nina; Kugel, Andreas; Morettini, Paolo; Rizzi, Matteo; Schroer, Nicolai; Travaglini, Riccardo; Zannoli, Samuele; Zoccoli, Antonio

    An Insertable B-Layer is planned for the upgrade of the ATLAS detector and will add a fourth and innermost pixel layer to the existing Pixel Detector. 12 million pixels attached to new FE-I4 readout ASICs will require new off-detector electronics which is currently realized with two VME-based boards: a Back Of Crate module implementing optical I/O functionality and a Readout Driver module for data processing. This paper illustrates the new readout chain, focusing on the design of the new Readout Driver Card, which, with a fourfold integration with respect to the previous design, builds up the detector data, controls the calibration procedures and interacts via Gigabit links with a novel calibration farm. Future prospects and back compatibility to the existing system are also addressed.

  16. Silicon-Gas Pixel Detector

    NASA Astrophysics Data System (ADS)

    Bashindzhagyan, G.; Korotkova, N.; Romaniouk, A.; Sinev, N.; Tikhomirov, V.

    2017-01-01

    The proposed Silicon-Gas Pixel Detector (SGPD) combines the advantages of Silicon and Gas-pixel detectors (GPD). 7 micron space resolution and down to 0.2 degree both angles measurements are inside 10 mm thick and very low material detector. Silicon pixels implemented directly into electronic chip structure allow to know exact time when particle crossed the detector and to use SGPD as a completely self-triggered device. Binary readout, advanced data collection and analysis on hardware level allow to obtain all the information in less than 1 microsecond and to use SGPD for the fast trigger generation.

  17. Nanosecond monolithic CMOS readout cell

    DOEpatents

    Souchkov, Vitali V.

    2004-08-24

    A pulse shaper is implemented in monolithic CMOS with a delay unit formed of a unity gain buffer. The shaper is formed of a difference amplifier having one input connected directly to an input signal and a second input connected to a delayed input signal through the buffer. An elementary cell is based on the pulse shaper and a timing circuit which gates the output of an integrator connected to the pulse shaper output. A detector readout system is formed of a plurality of elementary cells, each connected to a pixel of a pixel array, or to a microstrip of a plurality of microstrips, or to a detector segment.

  18. MONOLITHIC ACTIVE PIXEL MATRIX WITH BINARY COUNTERS IN AN SOI PROCESS.

    SciTech Connect

    DUPTUCH,G.; YAREMA, R.

    2007-06-07

    The design of a Prototype monolithic active pixel matrix, designed in a 0.15 {micro}m CMOS SOI Process, is presented. The process allowed connection between the electronics and the silicon volume under the layer of buried oxide (BOX). The small size vias traversing through the BOX and implantation of small p-type islands in the n-type bulk result in a monolithic imager. During the acquisition time, all pixels register individual radiation events incrementing the counters. The counting rate is up to 1 MHz per pixel. The contents of counters are shifted out during the readout phase. The designed prototype is an array of 64 x 64 pixels and the pixel size is 26 x 26 {micro}m{sup 2}.

  19. Readout of the upgraded ALICE-ITS

    NASA Astrophysics Data System (ADS)

    Szczepankiewicz, A.

    2016-07-01

    The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb-Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

  20. Pixelated neutron image plates

    NASA Astrophysics Data System (ADS)

    Schlapp, M.; Conrad, H.; von Seggern, H.

    2004-09-01

    Neutron image plates (NIPs) have found widespread application as neutron detectors for single-crystal and powder diffraction, small-angle scattering and tomography. After neutron exposure, the image plate can be read out by scanning with a laser. Commercially available NIPs consist of a powder mixture of BaFBr : Eu2+ and Gd2O3 dispersed in a polymer matrix and supported by a flexible polymer sheet. Since BaFBr : Eu2+ is an excellent x-ray storage phosphor, these NIPs are particularly sensitive to ggr-radiation, which is always present as a background radiation in neutron experiments. In this work we present results on NIPs consisting of KCl : Eu2+ and LiF that were fabricated into ceramic image plates in which the alkali halides act as a self-supporting matrix without the necessity for using a polymeric binder. An advantage of this type of NIP is the significantly reduced ggr-sensitivity. However, the much lower neutron absorption cross section of LiF compared with Gd2O3 demands a thicker image plate for obtaining comparable neutron absorption. The greater thickness of the NIP inevitably leads to a loss in spatial resolution of the image plate. However, this reduction in resolution can be restricted by a novel image plate concept in which a ceramic structure with square cells (referred to as a 'honeycomb') is embedded in the NIP, resulting in a pixelated image plate. In such a NIP the read-out light is confined to the particular illuminated pixel, decoupling the spatial resolution from the optical properties of the image plate material and morphology. In this work, a comparison of experimentally determined and simulated spatial resolutions of pixelated and unstructured image plates for a fixed read-out laser intensity is presented, as well as simulations of the properties of these NIPs at higher laser powers.

  1. Simulation of charge transport in pixelated CdTe

    PubMed Central

    Kolstein, M.; Ariño, G.; Chmeissani, M.; De Lorenzo, G.

    2014-01-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 106). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm3 using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points. PMID:25729404

  2. Simulation of charge transport in pixelated CdTe.

    PubMed

    Kolstein, M; Ariño, G; Chmeissani, M; De Lorenzo, G

    2014-12-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 10(6)). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm(3) using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points.

  3. Simulation of charge transport in pixelated CdTe

    NASA Astrophysics Data System (ADS)

    Kolstein, M.; Ariño, G.; Chmeissani, M.; De Lorenzo, G.

    2014-12-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 106). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm3 using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points.

  4. Readout IC requirement trends based on a simplified parametric seeker model.

    SciTech Connect

    Osborn, Thor D.

    2010-03-01

    Modern space based optical sensors place substantial demands on the focal plane array readout integrated circuit. Active pixel readout designs offer direct access to individual pixel data but require analog to digital conversion at or near each pixel. Thus, circuit designers must create precise, fundamentally analog circuitry within tightly constrained areas on the integrated circuit. Rapidly changing phenomena necessitate tradeoffs between sampling and conversion speed, data precision, and heat generation adjacent the detector array, especially of concern for thermally sensitive space grade infrared detectors. A simplified parametric model is presented that illustrates seeker system performance and analog to digital conversion requirements trends in the visible through mid-wave infrared, for varying sample rate. Notional limiting-case Earth optical backgrounds were generated using MODTRAN4 with a range of cloud extremes and approximate practical albedo limits for typical surface features from a composite of the Mosart and Aster spectral albedo databases. The dynamic range requirements imposed by these background spectra are discussed in the context of optical band selection and readout design impacts.

  5. Multiport solid-state imager characterization at variable pixel rates

    SciTech Connect

    Yates, G.J.; Albright, K.A.; Turko, B.T.

    1993-08-01

    The imaging performance of an 8-port Full Frame Transfer Charge Coupled Device (FFT CCD) as a function of several parameters including pixel clock rate is presented. The device, model CCD- 13, manufactured by English Electric Valve (EEV) is a 512 {times} 512 pixel array designed with four individual programmable bidirectional serial registers and eight output amplifiers permitting simultaneous readout of eight segments (128 horizontal {times} 256 vertical pixels) of the array. The imager was evaluated in Los Alamos National Laboratory`s High-Speed Solid-State Imager Test Station at true pixel rates as high as 50 MHz for effective imager pixel rates approaching 400 MHz from multiporting. Key response characteristics measured include absolute responsivity, Charge-Transfer-Efficiency (CTE), dynamic range, resolution, signal-to-noise ratio, and electronic and optical crosstalk among the eight video channels. Preliminary test results and data obtained from the CCD-13 will be presented and the versatility/capabilities of the test station will be reviewed.

  6. Prototype readout electronics for the upgraded ALICE Inner Tracking System

    NASA Astrophysics Data System (ADS)

    Sielewicz, K. M.; Aglieri Rinella, G.; Bonora, M.; Ferencei, J.; Giubilato, P.; Rossewij, M. J.; Schambach, J.; Vanat, T.

    2017-01-01

    The ALICE Collaboration is preparing a major upgrade to the experimental apparatus. A key element of the upgrade is the construction of a new silicon-based Inner Tracking System containing 12 Gpixels in an area of 10 m2. Its readout system consists of 192 readout units that control the pixel sensors and the power units, and deliver the sensor data to the counting room. A prototype readout board has been designed to test: the interface between the sensor modules and the readout electronics, the signal integrity and reliability of data transfer, the interface to the ALICE DAQ and trigger, and the susceptibility of the system to the expected radiation level.

  7. 3D, Flash, Induced Current Readout for Silicon Sensors

    SciTech Connect

    Parker, Sherwood I.

    2014-06-07

    A new method for silicon microstrip and pixel detector readout using (1) 65 nm-technology current amplifers which can, for the first time with silicon microstrop and pixel detectors, have response times far shorter than the charge collection time (2) 3D trench electrodes large enough to subtend a reasonable solid angle at most track locations and so have adequate sensitivity over a substantial volume of pixel, (3) induced signals in addition to, or in place of, collected charge

  8. Electronic readout systems for microchannel plates

    NASA Technical Reports Server (NTRS)

    Timothy, J. G.

    1985-01-01

    The modes of operation of position-sensitive electronic readout systems which use high-gain microchannel plate (MCP) electron multipliers are described, and their performance characteristics, along with those of the MCP, are compared. Among the structures presented are the wedge-and-strip, Codacon, and multilayer coincidence-anode MAMA (Multimode Microchannel Array) arrays. Spatial resolution of 25 x 25 sq microns (coincidence anode arrays) is achieved with an array format of 256 x 1024 pixels. On the basis of the performance data it is concluded that the readout systems using only conducting electrodes offer the best performance characteristics.

  9. XAMPS Detectors Readout ASIC for LCLS

    SciTech Connect

    Dragone, A; Pratte, J.F.; Rehak, P.; Carini, G.A.; Herbst, R.; O'Connor, P.; Siddons, D.P.; /BNL, NSLS

    2008-12-18

    An ASIC for the readout of signals from X-ray Active Matrix Pixel Sensor (XAMPS) detectors to be used at the Linac Coherent Light Source (LCLS) is presented. The X-ray Pump Probe (XPP) instrument, for which the ASIC has been designed, requires a large input dynamic range on the order of 104 photons at 8 keV with a resolution of half a photon FWHM. Due to the size of the pixel and the length of the readout line, large input capacitance is expected, leading to stringent requirement on the noise optimization. Furthermore, the large number of pixels needed for a good position resolution and the fixed LCLS beam period impose limitations on the time available for the single pixel readout. Considering the periodic nature of the LCLS beam, the ASIC developed for this application is a time-variant system providing low-noise charge integration, filtering and correlated double sampling. In order to cope with the large input dynamic range a charge pump scheme implementing a zero-balance measurement method has been introduced. It provides an on chip 3-bit coarse digital conversion of the integrated charge. The residual charge is sampled using correlated double sampling into analog memory and measured with the required resolution. The first 64 channel prototype of the ASIC has been fabricated in TSMC CMOS 0.25 {micro}m technology. In this paper, the ASIC architecture and performances are presented.

  10. A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion

    NASA Astrophysics Data System (ADS)

    Ratti, L.; Comotti, D.; Fabris, L.; Grassi, M.; Lodola, L.; Malcovati, P.; Manghisoni, M.; Re, V.; Traversi, G.; Vacchi, C.; Rizzo, G.; Batignani, G.; Bettarini, S.; Casarosa, G.; Forti, F.; Giorgi, M.; Morsani, F.; Paladino, A.; Paoloni, E.; Pancheri, L.; Dalla Betta, G.-F.; Mendicino, R.; Verzellesi, G.; Xu, H.; Benkechkache, M. A.

    2016-09-01

    A readout channel for applications to X-ray diffraction imaging at free electron lasers has been developed in a 65 nm CMOS technology. The analog front-end circuit can achieve an input dynamic range of 100 dB by leveraging a novel signal compression technique based on the non-linear features of MOS capacitors. Trapezoidal shaping is accomplished through a transconductor and a switched capacitor circuit, performing gated integration and correlated double sampling. A small area, low power 10 bit successive approximation register (SAR) ADC, operated in a time-interleaved fashion, is used for numerical conversion of the amplitude measurement. Operation at 5 MHz of the analog channel including the shaper was demonstrated. Also, the channel was found to be compliant with single 1 keV photon resolution at 1.25 MHz. The ADC provides a signal-to-noise ratio (SNR) of 56 dB, corresponding to an equivalent number of bits (ENOB) of 9 bits, and a differential non linearity DNL < 1 LSB at a sampling rate slightly larger than 1.8 MHz.

  11. JPL CMOS Active Pixel Sensor Technology

    NASA Technical Reports Server (NTRS)

    Fossum, E. R.

    1995-01-01

    This paper will present the JPL-developed complementary metal- oxide-semiconductor (CMOS) active pixel sensor (APS) technology. The CMOS APS has achieved performance comparable to charge coupled devices, yet features ultra low power operation, random access readout, on-chip timing and control, and on-chip analog to digital conversion. Previously published open literature will be reviewed.

  12. Use of silicon pixel detectors in double electron capture experiments

    NASA Astrophysics Data System (ADS)

    Cermak, P.; Stekl, I.; Shitov, Yu A.; Mamedov, F.; Rukhadze, E. N.; Jose, J. M.; Cermak, J.; Rukhadze, N. I.; Brudanin, V. B.; Loaiza, P.

    2011-01-01

    A novel experimental approach to search for double electron capture (EC/EC) is discussed in this article. R&D for a new generation EC/EC spectrometer based on silicon pixel detectors (SPDs) has been conducted since 2009 for an upgrade of the TGV experiment. SPDs built on Timepix technology with a spectroscopic readout from each individual pixel are an effective tool to detect the 2νEC/EC signature of the two low energy X-rays hitting two separate pixels. The ability of SPDs to indentify α/β/γ particles and localize them precisely leads to effective background discrimination and thus considerable improvement of the signal-to-background ratio (S/B). A multi-SPD system, called a Silicon Pixel Telescope (SPT), is planned based on the experimental approach of the TGV calorimeter which measures thin foils of enriched EC/EC-isotope sandwiched between HPGe detectors working in coincidence mode. The sources of SPD internal background have been identified by measuring SPD radiopurity with a low-background HPGe detector as well as by long-term SPD background runs in the Modane underground laboratory (LSM, France), and results of these studies are presented.

  13. Self-adjusting threshold mechanism for pixel detectors

    NASA Astrophysics Data System (ADS)

    Heim, Timon; Garcia-Sciveres, Maurice

    2017-09-01

    Readout chips of hybrid pixel detectors use a low power amplifier and threshold discrimination to process charge deposited in semiconductor sensors. Due to transistor mismatch each pixel circuit needs to be calibrated individually to achieve response uniformity. Traditionally this is addressed by programmable threshold trimming in each pixel, but requires robustness against radiation effects, temperature, and time. In this paper a self-adjusting threshold mechanism is presented, which corrects the threshold for both spatial inequality and time variation and maintains a constant response. It exploits the electrical noise as relative measure for the threshold and automatically adjust the threshold of each pixel to always achieve a uniform frequency of noise hits. A digital implementation of the method in the form of an up/down counter and combinatorial logic filter is presented. The behavior of this circuit has been simulated to evaluate its performance and compare it to traditional calibration results. The simulation results show that this mechanism can perform equally well, but eliminates instability over time and is immune to single event upsets.

  14. SNO+ Readout Electronics Upgrades

    NASA Astrophysics Data System (ADS)

    Bonventre, Richard; Shokair, Timothy; Knapik, Robert

    2012-03-01

    The SNO+ experiment is designed to explore several topics in neutrino physics including neutrinoless double beta decay, reactor antineutrinos, and low energy solar neutrinos. SNO+ uses the existing Sudbury Neutrino Observatory (SNO) detector, with the heavy water target replaced with liquid scintillator. The new target requires an upgrade to the command and control electronics to handle the higher rates expected with scintillation light as compared to Cherenkov light. The readout electronics have been upgraded to autonomously push data to a central data acquisition computer over ethernet from each of the 19 front end crates. The autonomous readout is achieved with a field programmable gate array (FPGA) with an embedded processor. Inside the FPGA fabric a state machine is configured to pull data across the VME-like bus of each crate. A small C program, making use of the open source Light Weight IP (LWIP) libraries, is run directly on the hardware (with no operating system) to push the data via TCP/IP. The hybrid combination of `high-level' C code and a `low-level' VHDL state machine is a cost effective and flexible solution for reading out individual front end crates.

  15. Proceedings of PIXEL98 -- International pixel detector workshop

    SciTech Connect

    Anderson, D.F.; Kwan, S.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  16. CMOS Active-Pixel Image Sensor With Simple Floating Gates

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Nakamura, Junichi; Kemeny, Sabrina E.

    1996-01-01

    Experimental complementary metal-oxide/semiconductor (CMOS) active-pixel image sensor integrated circuit features simple floating-gate structure, with metal-oxide/semiconductor field-effect transistor (MOSFET) as active circuit element in each pixel. Provides flexibility of readout modes, no kTC noise, and relatively simple structure suitable for high-density arrays. Features desirable for "smart sensor" applications.

  17. CMOS Active-Pixel Image Sensor With Simple Floating Gates

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Nakamura, Junichi; Kemeny, Sabrina E.

    1996-01-01

    Experimental complementary metal-oxide/semiconductor (CMOS) active-pixel image sensor integrated circuit features simple floating-gate structure, with metal-oxide/semiconductor field-effect transistor (MOSFET) as active circuit element in each pixel. Provides flexibility of readout modes, no kTC noise, and relatively simple structure suitable for high-density arrays. Features desirable for "smart sensor" applications.

  18. High-voltage pixel sensors for ATLAS upgrade

    NASA Astrophysics Data System (ADS)

    Perić, I.; Kreidl, C.; Fischer, P.; Bompard, F.; Breugnon, P.; Clemens, J.-C.; Fougeron, D.; Liu, J.; Pangaud, P.; Rozanov, A.; Barbero, M.; Feigl, S.; Capeans, M.; Ferrere, D.; Pernegger, H.; Ristic, B.; Muenstermann, D.; Gonzalez Sevilla, S.; La Rosa, A.; Miucci, A.; Nessi, M.; Iacobucci, G.; Backhaus, M.; Hügging, Fabian; Krüger, H.; Hemperek, T.; Obermann, T.; Wermes, N.; Garcia-Sciveres, M.; Quadt, A.; Weingarten, J.; George, M.; Grosse-Knetter, J.; Rieger, J.; Bates, R.; Blue, A.; Buttar, C.; Hynds, D.

    2014-11-01

    The high-voltage (HV-) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex CMOS in-pixel electronics and the compatibility with commercial processes. The sensor element is a deep n-well diode in a p-type substrate. The n-well contains CMOS pixel electronics. The main charge collection mechanism is drift in a shallow, high field region, which leads to a fast charge collection and a high radiation tolerance. We are currently evaluating the use of the high-voltage detectors implemented in 180 nm HV-CMOS technology for the high-luminosity ATLAS upgrade. Our approach is replacing the existing pixel and strip sensors with the CMOS sensors while keeping the presently used readout ASICs. By intelligence we mean the ability of the sensor to recognize a particle hit and generate the address information. In this way we could benefit from the advantages of the HV sensor technology such as lower cost, lower mass, lower operating voltage, smaller pitch, smaller clusters at high incidence angles. Additionally we expect to achieve a radiation hardness necessary for ATLAS upgrade. In order to test the concept, we have designed two HV-CMOS prototypes that can be readout in two ways: using pixel and strip readout chips. In the case of the pixel readout, the connection between HV-CMOS sensor and the readout ASIC can be established capacitively.

  19. A radiation-tolerant electronic readout system for portal imaging

    NASA Astrophysics Data System (ADS)

    Östling, J.; Brahme, A.; Danielsson, M.; Iacobaeus, C.; Peskov, V.

    2004-06-01

    A new electronic portal imaging device, EPID, is under development at the Karolinska Institutet and the Royal Institute of Technology. Due to considerable demands on radiation tolerance in the radiotherapy environment, a dedicated electronic readout system has been designed. The most interesting aspect of the readout system is that it allows to read out ˜1000 pixels in parallel, with all electronics placed outside the radiation beam—making the detector more radiation resistant. In this work we are presenting the function of a small prototype (6×100 pixels) of the electronic readout board that has been tested. Tests were made with continuous X-rays (10-60 keV) and with α particles. The results show that, without using an optimised gas mixture and with an early prototype only, the electronic readout system still works very well.

  20. Pixel detectors in 3D technologies for high energy physics

    SciTech Connect

    Deptuch, G.; Demarteau, M.; Hoff, J.; Lipton, R.; Shenai, A.; Yarema, R.; Zimmerman, T.; /Fermilab

    2010-10-01

    This paper reports on the current status of the development of International Linear Collider vertex detector pixel readout chips based on multi-tier vertically integrated electronics. Initial testing results of the VIP2a prototype are presented. The chip is the second embodiment of the prototype data-pushed readout concept developed at Fermilab. The device was fabricated in the MIT-LL 0.15 {micro}m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 {micro}m{sup 2} pixels, laid out in an array of 48 x 48 pixels.

  1. Characterization of a three side abuttable CMOS pixel sensor with digital pixel and data compression for charged particle tracking

    NASA Astrophysics Data System (ADS)

    Guilloux, F.; Değerli, Y.; Flouzat, C.; Lachkar, M.; Monmarthe, E.; Orsini, F.; Venault, P.

    2016-02-01

    CMOS monolithic pixel sensor technology has been chosen to equip the new ALICE trackers for HL-LHC . PIXAM is the final prototype from an R&D program specific to the Muon Forward Tracker which intends to push significantly forward the performances of the mature rolling shutter architecture. By implementing a digital pixel allowing to readout of a group of rows in parallel, the PIXAM sensor increases the rolling shutter readout speed while keeping the same power consumption as that of analogue pixel sensors. This paper will describe shortly the ASIC architecture and will focus on the analogue and digital performances of the sensor, obtained from laboratory measurements.

  2. X-ray characterization of a multichannel smart-pixel array detector.

    PubMed

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 × 48 pixels, each 130 µm × 130 µm × 520 µm thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements.

  3. X-ray Characterization of a Multichannel Smart-Pixel Array Detector

    SciTech Connect

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A.; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 x 48 pixels, each 130 mu m x 130 mu m x 520 mu m thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements.

  4. Commissioning of the CMS Forward Pixel Detector

    SciTech Connect

    Kumar, Ashish; /SUNY, Buffalo

    2008-12-01

    The Compact Muon Solenoid (CMS) experiment is scheduled for physics data taking in summer 2009 after the commissioning of high energy proton-proton collisions at Large Hadron Collider (LHC). At the core of the CMS all-silicon tracker is the silicon pixel detector, comprising three barrel layers and two pixel disks in the forward and backward regions, accounting for a total of 66 million channels. The pixel detector will provide high-resolution, 3D tracking points, essential for pattern recognition and precise vertexing, while being embedded in a hostile radiation environment. The end disks of the pixel detector, known as the Forward Pixel detector, has been assembled and tested at Fermilab, USA. It has 18 million pixel cells with dimension 100 x 150 {micro}m{sup 2}. The complete forward pixel detector was shipped to CERN in December 2007, where it underwent extensive system tests for commissioning prior to the installation. The pixel system was put in its final place inside the CMS following the installation and bake out of the LHC beam pipe in July 2008. It has been integrated with other sub-detectors in the readout since September 2008 and participated in the cosmic data taking. This report covers the strategy and results from commissioning of CMS forward pixel detector at CERN.

  5. Design and characterization of high precision in-pixel discriminators for rolling shutter CMOS pixel sensors with full CMOS capability

    NASA Astrophysics Data System (ADS)

    Fu, Y.; Hu-Guo, C.; Dorokhov, A.; Pham, H.; Hu, Y.

    2013-07-01

    In order to exploit the ability to integrate a charge collecting electrode with analog and digital processing circuitry down to the pixel level, a new type of CMOS pixel sensors with full CMOS capability is presented in this paper. The pixel array is read out based on a column-parallel read-out architecture, where each pixel incorporates a diode, a preamplifier with a double sampling circuitry and a discriminator to completely eliminate analog read-out bottlenecks. The sensor featuring a pixel array of 8 rows and 32 columns with a pixel pitch of 80 μm×16 μm was fabricated in a 0.18 μm CMOS process. The behavior of each pixel-level discriminator isolated from the diode and the preamplifier was studied. The experimental results indicate that all in-pixel discriminators which are fully operational can provide significant improvements in the read-out speed and the power consumption of CMOS pixel sensors.

  6. A new 9T global shutter pixel with CDS technique

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Ma, Cheng; Zhou, Quan; Wang, Xinyang

    2015-04-01

    Benefiting from motion blur free, Global shutter pixel is very widely used in the design of CMOS image sensors for high speed applications such as motion vision, scientifically inspection, etc. In global shutter sensors, all pixel signal information needs to be stored in the pixel first and then waiting for readout. For higher frame rate, we need very fast operation of the pixel array. There are basically two ways for the in pixel signal storage, one is in charge domain, such as the one shown in [1], this needs complicated process during the pixel fabrication. The other one is in voltage domain, one example is the one in [2], this pixel is based on the 4T PPD technology and normally the driving of the high capacitive transfer gate limits the speed of the array operation. In this paper we report a new 9T global shutter pixel based on 3-T partially pinned photodiode (PPPD) technology. It incorporates three in-pixel storage capacitors allowing for correlated double sampling (CDS) and pipeline operation of the array (pixel exposure during the readout of the array). Only two control pulses are needed for all the pixels at the end of exposure which allows high speed exposure control.

  7. Massively Parallel Atomic Force Microscope with Digital Holographic Readout

    NASA Astrophysics Data System (ADS)

    Sache, L.; Kawakatsu, H.; Emery, Y.; Bleuler, H.

    2007-03-01

    Massively Parallel Scanning Probe Microscopy is an obvious path for data storage (E Grochowski, R F Hoyt, Future Trends in Hard disc Drives, IEEE Trans. Magn. 1996, 32, 1850- 1854; J L Griffin, S W Schlosser, G R Ganger and D F Nagle, Modeling and Performance of MEMS-Based Storage Devices, Proc. ACM SIGMETRICS, 2000). Current experimental systems still lay far behind Hard Disc Drive (HDD) or Digital Video Disk (DVD), be it in access speed, data throughput, storage density or cost per bit. This paper presents an entirely new approach with the promise to break several of these barriers. The key idea is readout of a Scanning Probes Microscope (SPM) array by Digital Holographic Microscopy (DHM). This technology directly gives phase information at each pixel of a CCD array. This means that no contact line to each individual SPM probes is needed. The data is directly available in parallel form. Moreover, the optical setup needs in principle no expensive components, optical (or, to a large extent, mechanical) imperfections being compensated in the signal processing, i.e. in electronics. This gives the system the potential for a low cost device with fast Terabit readout capability.

  8. Status of the CMS Phase I pixel detector upgrade

    NASA Astrophysics Data System (ADS)

    Spannagel, S.

    2016-09-01

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  9. Single photon counting pixel detectors for synchrotron radiation experiments

    NASA Astrophysics Data System (ADS)

    Toyokawa, H.; Broennimann, Ch.; Eikenberry, E. F.; Henrich, B.; Kawase, M.; Kobas, M.; Kraft, P.; Sato, M.; Schmitt, B.; Suzuki, M.; Tanida, H.; Uruga, T.

    2010-11-01

    At the Paul Scherrer Institute PSI an X-ray single photon counting pixel detector (PILATUS) based on the hybrid-pixel detector technology was developed in collaboration with SPring-8. The detection element is a 320 or 450 μm thick silicon sensor forming pixelated pn-diodes with a pitch of 172 μm×172 μm. An array of 2×8 custom CMOS readout chips are indium bump-bonded to the sensor, which leads to 33.5 mm×83.8 mm detective area. Each pixel contains a charge-sensitive amplifier, a single level discriminator and a 20 bit counter. This design realizes a high dynamic range, short readout time of less than 3 ms, a high framing rate of over 200 images per second and an excellent point-spread function. The maximum counting rate achieves more than 2×106 X-rays/s/pixel.

  10. Counting x-ray line detector with monolithically integrated readout circuits

    NASA Astrophysics Data System (ADS)

    Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Meyendorf, N.

    2013-05-01

    The developed direct converting X-ray line detectors offer a number of advantages in comparison to other X-ray sensor concepts. Direct converting X-ray detectors are based on absorption of X-rays in semiconductor material, which leads to a generation of charge carriers. By applying high bias voltage charge carriers can be separated and with this the arising current pulse can be assessed by suitable readout integrated circuits (ICs) subsequently. The X-ray absorber itself is implemented as a diode based on GaAs to use it in the reverse direction. It exhibits low dark currents and can therefore be used at room temperatures. The GaAs absorber has a structured top electrode designed on variable bonding and high breakdown voltages. The implemented GaAs absorber exhibits a pixel size of 100 μm while the readout IC features fast dead-time-free readout, energy discrimination by two individually adjustable thresholds with 20 bit deep counters and radiation-hard design on chip level. These properties guarantee the application as fast and thus sensitive line detector for imaging processes. Another advantage of the imaging line detector is the cascadability of several sensor modules with 1024 pixels each. This property ensures that the 102.4 mm long sensor modules can be concatenated virtually with arbitrary length gaplessly. The readout ICs hitting radiation dose can be further minimized by implementing constructive steps to ensure longer lifetime of the sensor module. Furthermore, first results using the introduced sensor module for solid state X-ray detection are discussed.

  11. Active pixel sensor pixel having a photodetector whose output is coupled to an output transistor gate

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Nakamura, Junichi (Inventor); Kemeny, Sabrina E. (Inventor)

    2005-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node. There is also a readout circuit, part of which can be disposed at the bottom of each column of cells and be common to all the cells in the column. A Simple Floating Gate (SFG) pixel structure could also be employed in the imager to provide a non-destructive readout and smaller pixel sizes.

  12. Back-Side Readout Silicon Photomultiplier

    PubMed Central

    Choong, Woon-Seng; Holland, Stephen E.

    2012-01-01

    We present a novel structure for the back-side readout silicon photomultipler (SiPM). Current SiPMs are front-illuminated structures with front-side readout, which have relatively small geometric fill factor leading to degradation in their photon detection efficiency (PDE). Back-side readout devices will provide an advantageous solution to achieve high PDE. We designed and investigated a novel structure that would allow back-side readout while creating a region of high electric field optimized for avalanche breakdown. In addition, this structure has relatively high fill factor and also allow direct coupling of individual micro-cell of the SiPM to application-specific integrated circuits. We will discuss the performance that can be attained with this structure through device simulation and the process flow that can be used to fabricate this structure through process simulation. PMID:23564969

  13. Back-Side Readout Silicon Photomultiplier.

    PubMed

    Choong, Woon-Seng; Holland, Stephen E

    2012-07-19

    We present a novel structure for the back-side readout silicon photomultipler (SiPM). Current SiPMs are front-illuminated structures with front-side readout, which have relatively small geometric fill factor leading to degradation in their photon detection efficiency (PDE). Back-side readout devices will provide an advantageous solution to achieve high PDE. We designed and investigated a novel structure that would allow back-side readout while creating a region of high electric field optimized for avalanche breakdown. In addition, this structure has relatively high fill factor and also allow direct coupling of individual micro-cell of the SiPM to application-specific integrated circuits. We will discuss the performance that can be attained with this structure through device simulation and the process flow that can be used to fabricate this structure through process simulation.

  14. Monolithic pixel detectors for high energy physics

    NASA Astrophysics Data System (ADS)

    Snoeys, W.

    2013-12-01

    Monolithic pixel detectors integrating sensor matrix and readout in one piece of silicon have revolutionized imaging for consumer applications, but despite years of research they have not yet been widely adopted for high energy physics. Two major requirements for this application, radiation tolerance and low power consumption, require charge collection by drift for the most extreme radiation levels and an optimization of the collected signal charge over input capacitance ratio (Q/C). It is shown that monolithic detectors can achieve Q/C for low analog power consumption and even carryout the promise to practically eliminate analog power consumption, but combining sufficient Q/C, collection by drift, and integration of readout circuitry within the pixel remains a challenge. An overview is given of different approaches to address this challenge, with possible advantages and disadvantages.

  15. Polycrystalline Mercuric Iodide Films on CMOS Readout Arrays

    PubMed Central

    Hartsough, Neal E.; Iwanczyk, Jan S.; Nygard, Einar; Malakhov, Nail; Barber, William C.; Gandhi, Thulasidharan

    2009-01-01

    We have created high-resolution x-ray imaging devices using polycrystalline mercuric iodide (HgI2) films grown directly onto CMOS readout chips using a thermal vapor transport process. Images from prototype 400×400 pixel HgI2-coated CMOS readout chips are presented, where the pixel grid is 30 μm × 30 μm. The devices exhibited sensitivity of 6.2 μC/Rcm2 with corresponding dark current of ∼2.7 nA/cm2, and a 80 μm FWHM planar image response to a 50 μm slit aperture. X-ray CT images demonstrate a point spread function sufficient to obtain a 50 μm spatial resolution in reconstructed CT images at a substantially reduced dose compared to phosphor-coated readouts. The use of CMOS technology allows for small pixels (30 μm), fast readout speeds (8 fps for a 3200×3200 pixel array), and future design flexibility due to the use of well-developed fabrication processes. PMID:20161098

  16. Pixel Perfect

    SciTech Connect

    Perrine, Kenneth A.; Hopkins, Derek F.; Lamarche, Brian L.; Sowa, Marianne B.

    2005-09-01

    cubic warp. During image acquisitions, the cubic warp is evaluated by way of forward differencing. Unwanted pixelation artifacts are minimized by bilinear sampling. The resulting system is state-of-the-art for biological imaging. Precisely registered images enable the reliable use of FRET techniques. In addition, real-time image processing performance allows computed images to be fed back and displayed to scientists immediately, and the pipelined nature of the FPGA allows additional image processing algorithms to be incorporated into the system without slowing throughput.

  17. Pixel multichip module design for a high energy physics experiment

    SciTech Connect

    Guilherme Cardoso et al.

    2003-11-05

    At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

  18. Development of a high density pixel multichip module at Fermilab

    SciTech Connect

    Sergio Zimmermann et al.

    2001-09-11

    At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

  19. ATLAS Phase-II-Upgrade Pixel data transmission development

    NASA Astrophysics Data System (ADS)

    Wensing, M.

    2017-01-01

    The ATLAS tracking system will be replaced by an all-silicon detector in the course of the planned upgrade of the Large Hadron Collider around 2025. The readout of the new pixel system will be most challenging in terms of data rate and readout speed. Simulations of the on-detector electronics based on the currently foreseen trigger rate of 1 MHz indicate that a readout speed of up to 5 Gbit/s per data link is necessary. Due to radiation levels, the first part of transmission has to be implemented electrically. System simulation and test results of cable candidates will be presented.

  20. VeloPix: the pixel ASIC for the LHCb upgrade

    NASA Astrophysics Data System (ADS)

    Poikela, T.; De Gaspari, M.; Plosila, J.; Westerlund, T.; Ballabriga, R.; Buytaert, J.; Campbell, M.; Llopart, X.; Wyllie, K.; Gromov, V.; van Beuzekom, M.; Zivkovic, V.

    2015-01-01

    The LHCb Vertex Detector (VELO) will be upgraded in 2018 along with the other subsystems of LHCb in order to enable full readout at 40 MHz, with the data fed directly to the software triggering algorithms. The upgraded VELO is a lightweight hybrid pixel detector operating in vacuum in close proximity to the LHC beams. The readout will be provided by a dedicated front-end ASIC, dubbed VeloPix, matched to the LHCb readout requirements and the 55 × 55 μm VELO pixel dimensions. The chip is closely related to the Timepix3, from the Medipix family of ASICs. The principal challenge that the chip has to meet is a hit rate of up to 900 Mhits/s, resulting in a required output bandwidth of more than 16 Gbit/s. The occupancy across the chip is also very non-uniform, and the radiation levels reach an integrated 400 Mrad over the lifetime of the detector.VeloPix is a binary pixel readout chip with a data driven readout, designed in 130 nm CMOS technology. The pixels are combined into groups of 2 × 4 super pixels, enabling a shared logic and a reduction of bandwidth due to combined address and time stamp information. The pixel hits are combined with other simultaneous hits in the same super pixel, time stamped, and immediately driven off-chip. The analog front-end must be sufficiently fast to accurately time stamp the data, with a small enough dead time to minimize data loss in the most occupied regions of the chip. The data is driven off chip with a custom designed high speed serialiser. The current status of the ASIC design, the chip architecture and the simulations will be described.

  1. A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels

    NASA Astrophysics Data System (ADS)

    Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M. O.; Fritzsch, T.; Rothermund, M.; Graafsma, H.

    2014-12-01

    Hybrid pixel semiconductor detectors provide high performance through a combination of direct detection, a relatively small pixel size, fast readout and sophisticated signal processing circuitry in each pixel. For X-ray detection above 20 keV, high-Z sensor layers rather than silicon are needed to achieve high quantum efficiency, but many high-Z materials such as GaAs and CdTe often suffer from poor material properties or nonuniformities. Germanium is available in large wafers of extremely high quality, making it an appealing option for high-performance hybrid pixel X-ray detectors, but suitable technologies for finely pixelating and bump-bonding germanium have not previously been available. A finely-pixelated germanium photodiode sensor with a 256 by 256 array of 55μm pixels has been produced. The sensor has an n-on-p structure, with 700μm thickness. Using a low-temperature indium bump process, this sensor has been bonded to the Medipix3RX photoncounting readout chip. Tests with the LAMBDA readout system have shown that the detector works successfully, with a high bond yield and higher image uniformity than comparable high-Z systems. During cooling, the system is functional around -80°C (with warmer temperatures resulting in excessive leakage current), with -100°C sufficient for good performance.

  2. STAR Vertex Detector Upgrade-HFT Pixel Development

    SciTech Connect

    Szelezniak, Michal; Greiner, Leo C.; Matis, Howard S.; Ritter, Hans Georg; Sun Xiangming; Thomas, James H.; Wieman, Howard H.; Anderssen, Eric; Stezelberger, Thorsten; Vu, Chinh Q.

    2009-03-10

    Development and prototyping efforts directed towards construction of a new vertex detector for the STAR experiment at the RHIC accelerator at BNL are presented. This new detector will extend the physics range of STAR by allowing for precision measurements of yields and spectra of particles containing heavy quarks. The innermost central part of the new detector is a high resolution pixel-type detector (PIXEL). PIXEL requirements are discussed as well as a conceptual mechanical design, a sensor development path, and a detector readout architecture. Selected progress with sensor prototypes dedicated to the PIXEL detector is summarized and the approach chosen for the readout system architecture validated in tests of hardware prototypes is discussed.

  3. Readout electronics for LGAD sensors

    NASA Astrophysics Data System (ADS)

    Alonso, O.; Franch, N.; Canals, J.; Palacio, F.; López, M.; Vilà, A.; Diéguez, A.; Carulla, M.; Flores, D.; Hidalgo, S.; Merlos, A.; Pellegrini, G.; Quirion, D.

    2017-02-01

    In this paper, an ASIC fabricated in 180 nm CMOS technology from AMS with the very front-end electronics used to readout LGAD sensors is presented as well as its experimental results. The front-end has the typical architecture for Si-strip readout, i.e., preamplification stage with a Charge Sensitive Amplifier (CSA) followed by a CR-RC shaper. Both amplifiers are based on a folded cascode structure with a PMOS input transistor and the shaper only uses passive elements for the feedback stage. The CSA has programmable gain and a configurable input stage in order to adapt to the different input capacitance of the LGAD sensors (pixelated, short and long strips) and to the different input signal (depending on the gain of the LGAD). The fabricated prototype has an area of 0.865 mm × 0.965 mm and includes the biasing circuit for the CSA and the shaper, 4 analog channels (CSA+shaper) and programmable charge injection circuits included for testing purposes. Noise and power analysis performed during simulation fixed the size of the input transistor to W/L = 860 μm/0.2 μm. The shaping time is fixed by design at 1 us and, in this ASIC version, the feedback elements of the shaper are passive, which means that the area of the shaper can be reduced using active elements in future versions. Finally, the different gains of the CSA have been selected to maintain an ENC below 400 electrons for a detector capacitor of 20 pF, with a power consumption of 150 μ W per channel.

  4. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2004-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  5. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    1995-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  6. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2003-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  7. High-speed optical shutter coupled to fast-readout CCD camera

    NASA Astrophysics Data System (ADS)

    Yates, George J.; Pena, Claudine R.; McDonald, Thomas E., Jr.; Gallegos, Robert A.; Numkena, Dustin M.; Turko, Bojan T.; Ziska, George; Millaud, Jacques E.; Diaz, Rick; Buckley, John; Anthony, Glen; Araki, Takae; Larson, Eric D.

    1999-04-01

    A high frame rate optically shuttered CCD camera for radiometric imaging of transient optical phenomena has been designed and several prototypes fabricated, which are now in evaluation phase. the camera design incorporates stripline geometry image intensifiers for ultra fast image shutters capable of 200ps exposures. The intensifiers are fiber optically coupled to a multiport CCD capable of 75 MHz pixel clocking to achieve 4KHz frame rate for 512 X 512 pixels from simultaneous readout of 16 individual segments of the CCD array. The intensifier, Philips XX1412MH/E03 is generically a Generation II proximity-focused micro channel plate intensifier (MCPII) redesigned for high speed gating by Los Alamos National Laboratory and manufactured by Philips Components. The CCD is a Reticon HSO512 split storage with bi-direcitonal vertical readout architecture. The camera main frame is designed utilizing a multilayer motherboard for transporting CCD video signals and clocks via imbedded stripline buses designed for 100MHz operation. The MCPII gate duration and gain variables are controlled and measured in real time and up-dated for data logging each frame, with 10-bit resolution, selectable either locally or by computer. The camera provides both analog and 10-bit digital video. The camera's architecture, salient design characteristics, and current test data depicting resolution, dynamic range, shutter sequences, and image reconstruction will be presented and discussed.

  8. Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

    SciTech Connect

    Fahim, Farah

    2014-10-31

    The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

  9. Power Studies for the CMS Pixel Tracker

    SciTech Connect

    Todri, A.; Turqueti, M.; Rivera, R.; Kwan, S.; /Fermilab

    2009-01-01

    The Electronic Systems Engineering Department of the Computing Division at the Fermi National Accelerator Laboratory is carrying out R&D investigations for the upgrade of the power distribution system of the Compact Muon Solenoid (CMS) Pixel Tracker at the Large Hadron Collider (LHC). Among the goals of this effort is that of analyzing the feasibility of alternative powering schemes for the forward tracker, including DC to DC voltage conversion techniques using commercially available and custom switching regulator circuits. Tests of these approaches are performed using the PSI46 pixel readout chip currently in use at the CMS Tracker. Performance measures of the detector electronics will include pixel noise and threshold dispersion results. Issues related to susceptibility to switching noise will be studied and presented. In this paper, we describe the current power distribution network of the CMS Tracker, study the implications of the proposed upgrade with DC-DC converters powering scheme and perform noise susceptibility analysis.

  10. Towards spark-proof gaseous pixel detectors

    NASA Astrophysics Data System (ADS)

    Tsigaridas, S.; Beuzekom, M. v.; Chan, H. W.; Graaf, H. v. d.; Hartjes, F.; Heijhoff, K.; Hessey, N. P.; Prodanovic, V.

    2016-11-01

    The micro-pattern gaseous pixel detector, is a promising technology for imaging and particle tracking applications. It is a combination of a gas layer acting as detection medium and a CMOS pixelated readout-chip. As a prevention against discharges we deposit a protection layer on the chip and then integrate on top a micromegas-like amplification structure. With this technology we are able to reconstruct 3D track segments of particles passing through the gas thanks to the functionality of the chip. We have turned a Timepix3 chip into a gaseous pixel detector and tested it at the SPS at Cern. The preliminary results are promising and within the expectations. However, the spark protection layer needs further improvement to make reliable detectors. For this reason, we have created a setup for spark-testing. We present the first results obtained from the lab-measurements along with preliminary results from the testbeam.

  11. EXCALIBUR: a small-pixel photon counting area detector for coherent X-ray diffraction - Front-end design, fabrication and characterisation

    NASA Astrophysics Data System (ADS)

    Marchal, J.; Horswell, I.; Willis, B.; Plackett, R.; Gimenez, E. N.; Spiers, J.; Ballard, D.; Booker, P.; Thompson, J. A.; Gibbons, P.; Burge, S. R.; Nicholls, T.; Lipp, J.; Tartoni, N.

    2013-03-01

    Coherent X-ray diffraction experiments on synchrotron X-ray beamlines require detectors with high spatial resolution and large detection area. The read-out chip developed by the MEDIPIX3 collaboration offers a small pixel size of 55 microns resulting in a very high spatial resolution when coupled to a direct X-ray conversion segmented silicon sensor. MEDIPIX3 assemblies present also the advantages of hybrid pixel detectors working in single photon counting mode: noiseless imaging, large dynamic range, extremely high frame rate. The EXCALIBUR detector is under development for the X-ray Coherence and Imaging Beamline I13 of the Diamond Light Source. This new detector consists of three modules, each with 16 MEDIPIX3 chips which can be read-out at 100 frames per second in continuous mode or 1000 frames per second in burst mode. In each module, the sensor is a large single silicon die covering 2 rows of 8 individual MEDIPIX3 read-out chips and provides a continuous active detection region within a module. Each module includes 1 million solder bumps connecting the 55 microns pixels of the silicon sensor to the 55 microns pixels of the 16 MEDIPIX3 read-out chips. The detection area of the 3-module EXCALIBUR detector is 115 mm × 100 mm with a small 6.8 mm wide inactive region between modules. Each detector module is connected to 2 FPGA read-out boards via a flexi-rigid circuit to allow a fully parallel read-out of the 16 MEDIPIX3 chips. The 6 FPGA read-out boards used in the EXCALIBUR detector are interfaced to 6 computing nodes via 10Gbit/s fibre-optic links to maintain the very high frame-rate capability. The standard suite of EPICS control software is used to operate the detector and to integrate it with the Diamond Light Source beamline software environment. This article describes the design, fabrication and characterisation of the MEDIPIX3-based modules composing the EXCALIBUR detector.

  12. Novel integrated CMOS pixel structures for vertex detectors

    SciTech Connect

    Kleinfelder, Stuart; Bieser, Fred; Chen, Yandong; Gareus, Robin; Matis, Howard S.; Oldenburg, Markus; Retiere, Fabrice; Ritter, Hans Georg; Wieman, Howard H.; Yamamoto, Eugene

    2003-10-29

    Novel CMOS active pixel structures for vertex detector applications have been designed and tested. The overriding goal of this work is to increase the signal to noise ratio of the sensors and readout circuits. A large-area native epitaxial silicon photogate was designed with the aim of increasing the charge collected per struck pixel and to reduce charge diffusion to neighboring pixels. The photogate then transfers the charge to a low capacitance readout node to maintain a high charge to voltage conversion gain. Two techniques for noise reduction are also presented. The first is a per-pixel kT/C noise reduction circuit that produces results similar to traditional correlated double sampling (CDS). It has the advantage of requiring only one read, as compared to two for CDS, and no external storage or subtraction is needed. The technique reduced input-referred temporal noise by a factor of 2.5, to 12.8 e{sup -}. Finally, a column-level active reset technique is explored that suppresses kT/C noise during pixel reset. In tests, noise was reduced by a factor of 7.6 times, to an estimated 5.1 e{sup -} input-referred noise. The technique also dramatically reduces fixed pattern (pedestal) noise, by up to a factor of 21 in our tests. The latter feature may possibly reduce pixel-by-pixel pedestal differences to levels low enough to permit sparse data scan without per-pixel offset corrections.

  13. Development and characterization of 16-channel silicon photomultiplier prototype with sub-mm pixels for high-resolution PET system

    NASA Astrophysics Data System (ADS)

    Shimazoe, K.; Lipovec, A.; Takahashi, H.; Wiest, F.; Iskra, P.; Ganka, T.; Kamada, K.

    2014-11-01

    Silicon photomultipliers (SiPMs) are one of the most promising photodetectors for high-resolution PET systems because of their high gain and fast rise time. The resolution of a modern animal PET scanner is now in the sub-mm range; it has also been reported that an individual readout for pixels is necessary in order to achieve the theoretically best resolution. For achieving sub-mm resolution, a detector with pixelated crystals individually coupled to the photodetector is ideal. To this end, a prototype 16-channel SiPM with a pitch of 500μm was designed and fabricated, and its characteristics were studied. Several parameters, such as dark count rate (DCR), gain, crosstalk, and photon detection efficiency (PDE) are characterized in this study. The developed SiPM shows the performance required for future PET detector application.

  14. Pixel detector system development at Diamond Light Source

    NASA Astrophysics Data System (ADS)

    Marchal, J.; Horswell, I.; Gimenez, E. N.; Tartoni, N.

    2010-10-01

    Hybrid pixel detectors consisting of an array of silicon photodiodes bump-bonded to CMOS read-out chips provide high signal-to-noise ratio and high dynamic range compared to CCD-based detectors and Image Plates. These detector features are important for SAXS experiments where a wide range of intensities are present in the images. For time resolved SAXS experiments, high frame rates are compulsory. The latest CMOS read-out chip developed by the MEDIPIX collaboration provides high frame rate and continuous acquisition mode. A read-out system for an array of MEDIPIX3 sensors is under development at Diamond Light Source. This system will support a full resolution frame rate of 1 kHz at a pixel counter depth of 12-bit and a frame rate of 30 kHz at a counter depth of 1 bit. Details concerning system design and MEDIPIX sensors characterization are presented.

  15. Design of the small pixel pitch ROIC

    NASA Astrophysics Data System (ADS)

    Liang, Qinghua; Jiang, Dazhao; Chen, Honglei; Zhai, Yongcheng; Gao, Lei; Ding, Ruijun

    2014-11-01

    Since the technology trend of the third generation IRFPA towards resolution enhancing has steadily progressed,the pixel pitch of IRFPA has been greatly reduced.A 640×512 readout integrated circuit(ROIC) of IRFPA with 15μm pixel pitch is presented in this paper.The 15μm pixel pitch ROIC design will face many challenges.As we all known,the integrating capacitor is a key performance parameter when considering pixel area,charge capacity and dynamic range,so we adopt the effective method of 2 by 2 pixels sharing an integrating capacitor to solve this problem.The input unit cell architecture will contain two paralleled sample and hold parts,which not only allow the FPA to be operated in full frame snapshot mode but also save relatively unit circuit area.Different applications need more matching input unit circuits. Because the dimension of 2×2 pixels is 30μm×30μm, an input stage based on direct injection (DI) which has medium injection ratio and small layout area is proved to be suitable for middle wave (MW) while BDI with three-transistor cascode amplifier for long wave(LW). By adopting the 0.35μm 2P4M mixed signal process, the circuit architecture can make the effective charge capacity of 7.8Me- per pixel with 2.2V output range for MW and 7.3 Me- per pixel with 2.6V output range for LW. According to the simulation results, this circuit works well under 5V power supply and achieves less than 0.1% nonlinearity.

  16. FastPixN, a new integrated pixel chip for a future fast version of the IRSN - recoil proton telescope.

    PubMed

    Kachel, M; Husson, D; Higueret, S; Taforeau, J; Lebreton, L

    2014-10-01

    A first prototype of recoil proton telescope (RPT) is currently working at the AMANDE facility, being developed as a collaboration between IPHC Strasbourg and the LNE-IRSN. The device, able to measure both energy and fluence of neutron fields in the range of 5-20 MeV, has to be improved further, in order to reduce the considerable inelastic background generated by the neutrons inside the RPT itself. To achieve faster running cycles, the present complementary metal-oxide-semiconductor pixels used for proton tracking are to be replaced by a new integrated chip, specially developed for this application. The authors present a first version of this new element, with individual pixels readout at a 200-MHz frequency, with a fast 4-bit ADC for each column of 64 pixels. The measured performances point to a complete frame treatment in only 12.6 µs. With a readout speed multiplied by a factor 400 over the existing device, the authors expect a considerable improvement of the telescope at AMANDE, with the potential to reach neutron fluence rates up to 10(7) n cm(-2) s(-1) or more. © The Author 2013. Published by Oxford University Press. All rights reserved. For Permissions, please email: journals.permissions@oup.com.

  17. Studies of the possibility to use Gas Pixel Detector as a fast trigger tracking device

    NASA Astrophysics Data System (ADS)

    Sinev, N.; Bashindzhagyan, G.; Korotkova, N.; Romaniouk, A.; Tikhomirov, V.

    2016-02-01

    Gas Pixel Detector (GPD) technology offers new possibilities, which make them very attractive for application in existing and future accelerator experiments and beyond. GPDs combine advantages of silicon and gaseous detectors. They can be produced radiation hard and with low power consumption using relatively cheap technology. Low capacitance of the individual pixel channel allows us to obtain a large signal to noise ratio. Using a time projection method for GPD readout one obtains 3D track image with precise coordinate (31 µm) and angular information (0.40°). This feature would allow us to achieve performance of one GPD layer equal to a few layers of silicon detectors. Implementation of a fast readout and data processing at the front-end level allows one to reconstruct a track segment in less than 1 μs, and to use this information for the first level trigger generation. The relevant algorithms of data acquisition and analysis are described and the results of simulations are presented in this paper.

  18. Wire Bond Encapsulation for the CMS Forward Pixel Upgrade

    NASA Astrophysics Data System (ADS)

    Higginbotham, Sam; CMS Collaboration

    2015-04-01

    The Phase 1 upgrade of the pixel tracker for the CMS experiment will require the assembly of approximately 1000 modules consisting of pixel sensors bump bonded to readout chips. Electrical connections between the custom readout chips and support ASIC's that constitute the front-end of the pixel data acquisition system are made via wire bonds to a thin printed circuit board. Part of the assembly process carried out at Purdue University includes the partial encapsulation of the wire bonds for mechanical protection, prevention of electrolytic corrosion, and to damp oscillations due to Lorentz forces from transient current pulses in large magnetic fields. We present the details of the robotic assembly process which allows the deposition of the viscous encapsulant compound with 100 micron precision.

  19. TFT active image sensor with current-mode readout circuit for digital x-ray fluoroscopy

    NASA Astrophysics Data System (ADS)

    Safavian, Nader; Chaji, G. R.; Nathan, A.; Rowlands, J. A.

    2005-09-01

    In this paper, an innovative current-programmed, current-output active TFT image sensor suitable for real time x-ray imaging (fluoroscopy) using hydrogenated amorphous silicon (a-Si:H) thin film transistor (TFT) technology coupled with a transimpedance feedback column amplifier for pixel signal readout is presented. Simulation results show that this new TFT circuit can successfully compensate for variations in a-Si:H TFT characteristics under prolonged gate voltage stress. The readout is fast enough to fulfill the timing requirements of digital fluoroscopy. Dynamic effects such as charge injection, charge feed-through and drain-source voltage variation as well as additive noise of the pixel TFTs induce error on the output current of the pixel. To explore the dependence of this error on pixel parameters, concise analytical expressions are derived which can be used to reduce the amount of the output current error by proper pixel design.

  20. Pixel architectures in a HV-CMOS process for the ATLAS inner detector upgrade

    NASA Astrophysics Data System (ADS)

    Degerli, Y.; Godiot, S.; Guilloux, F.; Hemperek, T.; Krüger, H.; Lachkar, M.; Liu, J.; Orsini, F.; Pangaud, P.; Rymaszewski, P.; Wang, T.

    2016-12-01

    In this paper, design details and simulation results of new pixel architectures designed in LFoundry 150 nm high voltage CMOS process in the framework of the ATLAS high luminosity inner detector upgrade are presented. These pixels can be connected to the FE-I4 readout chip via bump bonding or glue and some of them can also be tested without a readout chip. Negative high voltage is applied to the high resistivity (> 2 kΩ .cm) substrate in order to deplete the deep n-well charge collection diode, ensuring good charge collection and radiation tolerance. In these pixels, the front-end has been implemented inside the diode using both NMOS and PMOS transistors. The pixel pitch is 50 μm × 250 μm for all pixels. These pixels have been implemented in a demonstrator chip called LFCPIX.

  1. High accuracy injection circuit for the calibration of a large pixel sensor matrix

    NASA Astrophysics Data System (ADS)

    Quartieri, E.; Comotti, D.; Manghisoni, M.

    2013-08-01

    Semiconductor pixel detectors, for particle tracking and vertexing in high energy physics experiments as well as for X-ray imaging, in particular for synchrotron light sources and XFELs, require a large area sensor matrix. This work will discuss the design and the characterization of a high-linearity, low dispersion injection circuit to be used for pixel-level calibration of detector readout electronics in a large pixel sensor matrix. The circuit provides a useful tool for the characterization of the readout electronics of the pixel cell unit for both monolithic active pixel sensors and hybrid pixel detectors. In the latter case, the circuit allows for precise analogue test of the readout channel already at the chip level, when no sensor is connected. Moreover, it provides a simple means for calibration of readout electronics once the detector has been connected to the chip. Two injection techniques can be provided by the circuit: one for a charge sensitive amplification and the other for a transresistance readout channel. The aim of the paper is to describe the architecture and the design guidelines of the calibration circuit, which has been implemented in a 130 nm CMOS technology. Moreover, experimental results of the proposed injection circuit will be presented in terms of linearity and dispersion.

  2. Using a pulsed laser beam to investigate the feasibility of sub-pixel position resolution with time-correlated transient signals in 3D pixelated CdZnTe detectors

    DOE PAGES

    Giraldo, L. Ocampo; Bolotnikov, A. E.; Camarda, G. S.; ...

    2017-04-20

    For this study, we evaluated the X-Y position resolution achievable in 3D pixelated detectors by processing the signal waveforms readout from neighboring pixels. In these measurements we used a focused light beam, down to 10 μm, generated by a ~1 mW pulsed laser (650 nm) to carry out raster scans over selected 3×3 pixel areas, while recording the charge signals from the 9 pixels and the cathode using two synchronized digital oscilloscopes.

  3. Using a pulsed laser beam to investigate the feasibility of sub-pixel position resolution with time-correlated transient signals in 3D pixelated CdZnTe detectors

    NASA Astrophysics Data System (ADS)

    Giraldo, L. Ocampo; Bolotnikov, A. E.; Camarda, G. S.; Cheng, S.; De Geronimo, G.; McGilloway, A.; Fried, J.; Hodges, D.; Hossain, A.; Ünlü, K.; Petryk, M.; Vidal, V.; Vernon, E.; Yang, G.; James, R. B.

    2017-09-01

    We evaluated the X-Y position resolution achievable in 3D pixelated detectors by processing the signal waveforms readout from neighboring pixels. In these measurements we used a focused light beam, down to 10 μm, generated by a 1 mW pulsed laser (650 nm) to carry out raster scans over selected 3×3 pixel areas, while recording the charge signals from the 9 pixels and the cathode using two synchronized digital oscilloscopes.

  4. Operational characteristics of Wedge and Strip image readout systems

    NASA Technical Reports Server (NTRS)

    Siegmund, O. H. W.; Lampton, M.; Bixler, J.; Bowyer, S.; Malina, R. F.

    1986-01-01

    Application of the Wedge and Strip readout system in microchannel plate detectors for the Extreme Ultraviolet Explorer and FAUST space astronomy programs is discussed. Anode designs with high resolution (greater than 600 x 600 pixels) in imaging and spectroscopy applications have been developed. Extension of these designs to larger formats (100 mm) with higher resolution (3000 x 3000 pixels) are considered. It is shown that the resolution and imaging are highly stable, and that the flat field performance is essentially limited by photon statistics. Very high speed event response has also been achieved with output pulses having durations of less than 10 nanoseconds.

  5. The STAR Heavy Flavor Tracker PXL detector readout electronics

    NASA Astrophysics Data System (ADS)

    Schambach, J.; Contin, G.; Greiner, L.; Stezelberger, T.; Sun, X.; Szelezniak, M.; Vu, C.

    2016-01-01

    The Heavy Flavor Tracker (HFT) is a recently installed micro-vertex detector upgrade to the STAR experiment at RHIC, consisting of three subsystems with various technologies of silicon sensors arranged in 4 concentric cylinders. The two innermost layers of the HFT close to the beam pipe, the Pixel ("PXL") subsystem, employ CMOS Monolithic Active Pixel Sensor (MAPS) technology that integrate the sensor, front-end electronics, and zero-suppression circuitry in one silicon die. This paper presents selected characteristics of the PXL detector part of the HFT and the hardware, firmware and software associated with the readout system for this detector.

  6. Hybridization of detector array and integrated circuit for readout

    NASA Astrophysics Data System (ADS)

    Fossum, Eric R.; Grunthaner, Frank J.

    1992-04-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  7. Sensor readout detector circuit

    DOEpatents

    Chu, Dahlon D.; Thelen, Jr., Donald C.

    1998-01-01

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems.

  8. Sensor readout detector circuit

    DOEpatents

    Chu, D.D.; Thelen, D.C. Jr.

    1998-08-11

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems. 6 figs.

  9. Progress on the design of a data push architecture for an array of optimized time tagging pixels

    NASA Astrophysics Data System (ADS)

    Shapiro, S.; Cords, D.; Mani, S.; Holbrook, B.; Atlas, E.

    1993-06-01

    A pixel array has been proposed which features a completely data driven architecture. A pixel cell has been designed that has been optimized for this readout. It retains the features of preceding designs which allow low noise operation, time stamping, analog signal processing, XY address recording, ghost elimination and sparse data transmission. The pixel design eliminates a number of problems inherent in previous designs, by the use of sampled data techniques, destructive readout, and current mode output drivers. This architecture and pixel design is directed at applications such as a forward spectrometer at the SSC, an e(sup +)e(sup -) B factory at SLAC, and fixed target experiments at FNAL.

  10. Fast Multiplexed Readout of Xmon Qubits Part I: Design

    NASA Astrophysics Data System (ADS)

    Sank, Daniel; Jeffrey, E.; Mutus, J. Y.; White, T. C.; Barends, R.; Kelly, J.; Chen, Y.; Roushan, P.; Campbell, B.; Chen, Z.; Chiaro, B.; Dunsworth, A.; Megrant, A.; Neill, C.; O'Malley, P.; Quintana, C.; Vainsencher, A.; Wenner, J.; Cleland, A. N.; Martinis, J. M.

    2014-03-01

    Realization of a surface code quantum computer requires fast scalable qubit readout. Previous systems have shown accurate readout in continuous wave mode. This neglects the transient response time which is crucial for the operation of the surface code and for measurement accuracy in the presence of finite qubit T1. We have designed a readout system, based on an integrated band pass filter, which achieves very fast transient response while maintaining long qubit T1. Our design uses separate readout resonators for each qubit. This allows individual qubit readout with frequency multiplexing while preventing correlated measurement errors. By connecting each resonator to a single filter the device requires zero additional on chip area and no extra control lines. We present design considerations, theory of operation, and physical layout of the device. With high fidelity gates this system forms the final element needed for a surface code cell.

  11. ATLAS IBL Pixel Upgrade

    NASA Astrophysics Data System (ADS)

    La Rosa, A.; Atlas Ibl Collaboration

    2011-06-01

    The upgrade for ATLAS detector will undergo different phases towards super-LHC. The first upgrade for the Pixel detector will consist of the construction of a new pixel layer which will be installed during the first shutdown of the LHC machine (LHC phase-I upgrade). The new detector, called Insertable B-Layer (IBL), will be inserted between the existing pixel detector and a new (smaller radius) beam-pipe at a radius of 3.3 cm. The IBL will require the development of several new technologies to cope with increase of radiation or pixel occupancy and also to improve the physics performance which will be achieved by reducing the pixel size and of the material budget. Three different promising sensor technologies (planar-Si, 3D-Si and diamond) are currently under investigation for the pixel detector. An overview of the project with particular emphasis on the pixel module is presented in this paper.

  12. Uncooled infrared detectors toward smaller pixel pitch with newly proposed pixel structure

    NASA Astrophysics Data System (ADS)

    Tohyama, Shigeru; Sasaki, Tokuhito; Endoh, Tsutomu; Sano, Masahiko; Kato, Koji; Kurashina, Seiji; Miyoshi, Masaru; Yamazaki, Takao; Ueno, Munetaka; Katayama, Haruyoshi; Imai, Tadashi

    2013-12-01

    An uncooled infrared (IR) focal plane array (FPA) with 23.5 μm pixel pitch has been successfully demonstrated and has found wide commercial applications in the areas of thermography, security cameras, and other applications. One of the key issues for uncooled IRFPA technology is to shrink the pixel pitch because the size of the pixel pitch determines the overall size of the FPA, which, in turn, determines the cost of the IR camera products. This paper proposes an innovative pixel structure with a diaphragm and beams placed in different levels to realize an uncooled IRFPA with smaller pixel pitch (≦17 μm). The upper level consists of a diaphragm with VOx bolometer and IR absorber layers, while the lower level consists of the two beams, which are designed to be placed on the adjacent pixels. The test devices of this pixel design with 12, 15, and 17 μm pitch have been fabricated on the Si read-out integrated circuit (ROIC) of quarter video graphics array (QVGA) (320×240) with 23.5 μm pitch. Their performances are nearly equal to those of the IRFPA with 23.5 μm pitch. For example, a noise equivalent temperature difference of 12 μm pixel is 63.1 mK for F/1 optics with the thermal time constant of 14.5 ms. Then, the proposed structure is shown to be effective for the existing IRFPA with 23.5 μm pitch because of the improvements in IR sensitivity. Furthermore, the advanced pixel structure that has the beams composed of two levels are demonstrated to be realizable.

  13. The phase II ATLAS Pixel upgrade: the Inner Tracker (ITk)

    NASA Astrophysics Data System (ADS)

    Flick, T.

    2017-01-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase II shutdown (foreseen to take place around 2025) by an all-silicon detector called the ITk (Inner Tracker). The pixel detector will comprise the five innermost layers, and will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation. Several layout options are being investigated. All of these include a barrel part and ring-shaped supports in the endcap regions. All structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide. Different designs of planar, 3D, and CMOS sensors are being investigated to identify the optimal technology for the different pixel layers. While the RD53 Collaboration is developing the new readout chip, the pixel off-detector readout electronics will be implemented in the framework of the general ATLAS trigger and DAQ system. A readout speed of up to 5 Gbit/s per data link (FE-chip) will be needed in the innermost layers going down to 640 Mbit/s for the outermost. This paper presents an overview of the different components of the ITk and the current status of the developments.

  14. Bad pixel mapping

    NASA Astrophysics Data System (ADS)

    Smith, Roger M.; Hale, David; Wizinowich, Peter

    2014-07-01

    Bad pixels are generally treated as a loss of useable area and then excluded from averaged performance metrics. The definition and detection of "bad pixels" or "cosmetic defects" are seldom discussed, perhaps because they are considered self-evident or of minor consequence for any scientific grade detector, however the ramifications can be more serious than generally appreciated. While the definition of pixel performance is generally understood, the classification of pixels as useable is highly application-specific, as are the consequences of ignoring or interpolating over such pixels. CMOS sensors (including NIR detectors) exhibit less compact distributions of pixel properties than CCDs. The extended tails in these distributions result in a steeper increase in bad pixel counts as performance thresholds are tightened which comes as a surprise to many users. To illustrate how some applications are much more sensitive to bad pixels than others, we present a bad pixel mapping exercise for the Teledyne H2RG used as the NIR tip-tilt sensor in the Keck-1 Adaptive Optics system. We use this example to illustrate the wide range of metrics by which a pixel might be judged inadequate. These include pixel bump bond connectivity, vignetting, addressing faults in the mux, severe sensitivity deficiency of some pixels, non linearity, poor signal linearity, low full well, poor mean-variance linearity, excessive noise and high dark current. Some pixels appear bad by multiple metrics. We also discuss the importance of distinguishing true performance outliers from measurement errors. We note how the complexity of these issues has ramifications for sensor procurement and acceptance testing strategies.

  15. An innovative method to reduce count loss from pulse pile-up in a photon-counting pixel for high flux X-ray applications

    NASA Astrophysics Data System (ADS)

    Lee, D.; Lim, K.; Park, K.; Lee, C.; Alexander, S.; Cho, G.

    2017-03-01

    In this study, an innovative fast X-ray photon-counting pixel for high X-ray flux applications is proposed. A computed tomography system typically uses X-ray fluxes up to 108 photons/mm2/sec at the detector and thus a fast read-out is required in order to process individual X-ray photons. Otherwise, pulse pile-up can occur at the output of the signal processing unit. These superimposed signals can distort the number of incident X-ray photons leading to count loss. To minimize such losses, a cross detection method was implemented in the photon-counting pixel. A maximum count rate under X-ray tube voltage of 90 kV was acquired which reflect electrical test results of the proposed photon counting pixel. A maximum count of 780 kcps was achieved with a conventional photon-counting pixel at the pulse processing time of 500 ns, which is the time for a pulse to return to the baseline from the initial rise. In contrast, the maximum count of about 8.1 Mcps was achieved with the proposed photon-counting pixel. From these results, it was clear that the maximum count rate was increased by approximately a factor 10 times by adopting the cross detection method. Therefore, it is an innovative method to reduce count loss from pulse pile-up in a photon-counting pixel while maintaining the pulse processing time.

  16. Pixel DAQ and trigger for HL-LHC

    NASA Astrophysics Data System (ADS)

    Morettini, P.

    2017-03-01

    The read-out is one of the challenges in the design of a pixel detector for the High Luminosity upgrade of the Large Hadron Collider (HL-LHC), that is expected to operate from 2026 at a leveled luminosity of 5 × 1034 cm‑2 s‑1. This is especially true if tracking information is needed in a low latency trigger system. The difficulties of a fast read-out will be reviewed, and possible strategies explained. The solutions that are being evaluated by the ATLAS and CMS collaborations for the upgrade of their trackers will be outlined and ideas on possible development beyond HL-LHC will be presented.

  17. Medipix2 parallel readout system

    NASA Astrophysics Data System (ADS)

    Fanti, V.; Marzeddu, R.; Randaccio, P.

    2003-08-01

    A fast parallel readout system based on a PCI board has been developed in the framework of the Medipix collaboration. The readout electronics consists of two boards: the motherboard directly interfacing the Medipix2 chip, and the PCI board with digital I/O ports 32 bits wide. The device driver and readout software have been developed at low level in Assembler to allow fast data transfer and image reconstruction. The parallel readout permits a transfer rate up to 64 Mbytes/s. http://medipix.web.cern ch/MEDIPIX/

  18. Integration of the Omega-3 readout chip into a high energy physics experimental data acquisition system

    NASA Astrophysics Data System (ADS)

    Beker, H.; Chesi, E.; Martinengo, P.

    1997-02-01

    The Omega-3 readout chip is presented in detail elsewhere in the same proceedings. We here describe the integration of the chip into present and future experiments describing both hardware and software aspects. We cover preliminary tests in the laboratory and on the beam. The WA97 experiment has already used a pixel telescope in the past and intends to upgrade to the Omega-3 chip. A newly proposed experiment at CERN studying strangeness production in heavy ion collisions also plans to use a similar telescope. Finally, we give an outlook on the ongoing developments in the pixel readout architecture in the context of ALICE, the heavy ion experiment at the LHC collider.

  19. ALICE inner tracking system readout electronics prototype testing with the CERN ``Giga Bit Transceiver''

    NASA Astrophysics Data System (ADS)

    Schambach, J.; Rossewij, M. J.; Sielewicz, K. M.; Aglieri Rinella, G.; Bonora, M.; Ferencei, J.; Giubilato, P.; Vanat, T.

    2016-12-01

    The ALICE Collaboration is preparing a major detector upgrade for the LHC Run 3, which includes the construction of a new silicon pixel based Inner Tracking System (ITS). The ITS readout system consists of 192 readout boards to control the sensors and their power system, receive triggers, and deliver sensor data to the DAQ. To prototype various aspects of this readout system, an FPGA based carrier board and an associated FMC daughter card containing the CERN Gigabit Transceiver (GBT) chipset have been developed. This contribution describes laboratory and radiation testing results with this prototype board set.

  20. PixelLearn

    NASA Technical Reports Server (NTRS)

    Mazzoni, Dominic; Wagstaff, Kiri; Bornstein, Benjamin; Tang, Nghia; Roden, Joseph

    2006-01-01

    PixelLearn is an integrated user-interface computer program for classifying pixels in scientific images. Heretofore, training a machine-learning algorithm to classify pixels in images has been tedious and difficult. PixelLearn provides a graphical user interface that makes it faster and more intuitive, leading to more interactive exploration of image data sets. PixelLearn also provides image-enhancement controls to make it easier to see subtle details in images. PixelLearn opens images or sets of images in a variety of common scientific file formats and enables the user to interact with several supervised or unsupervised machine-learning pixel-classifying algorithms while the user continues to browse through the images. The machinelearning algorithms in PixelLearn use advanced clustering and classification methods that enable accuracy much higher than is achievable by most other software previously available for this purpose. PixelLearn is written in portable C++ and runs natively on computers running Linux, Windows, or Mac OS X.

  1. Pixel telescope test in STAR at RHIC

    NASA Astrophysics Data System (ADS)

    Sun, Xiangming; Szelezniak, Michal; Greiner, Leo; Matis, Howard; Vu, Chinh; Stezelberger, Thorsten; Wieman, Howard

    2007-10-01

    The STAR experiment at RHIC is designing a new inner vertex detector called the Heavy Flavor Tracker (HFT). The HFT's innermost two layers is called the PIXEL detector which uses Monolithic Active Pixel Sensor technology (MAPS). To test the MAPS technology, we just constructed and tested a telescope. The telescope uses a stack of three MIMOSTAR2 chips, Each MIMOSTAR2 sensor, which was designed by IPHC, is an array of 132x128 pixels with a square pixel size of 30 μ. The readout of the telescope makes use of the ALICE DDL/SIU cards, which is compatible with the future STAR data acquisition system called DAQ1000. The telescope was first studied in a 1.2 GeV/c electron beam at LBNL's Advanced Light Source. Afterwards, the telescope was outside the STAR magnet, and then later inside it, 145 cm away from STAR's center. We will describe this first test of MAPS technology in a collider environment, and report on the occupancy, particle flux, and performance of the telescope.

  2. Automatic readout micrometer

    DOEpatents

    Lauritzen, Ted

    1982-01-01

    A measuring system is disclosed for surveying and very accurately positioning objects with respect to a reference line. A principal use of this surveying system is for accurately aligning the electromagnets which direct a particle beam emitted from a particle accelerator. Prior art surveying systems require highly skilled surveyors. Prior art systems include, for example, optical surveying systems which are susceptible to operator reading errors, and celestial navigation-type surveying systems, with their inherent complexities. The present invention provides an automatic readout micrometer which can very accurately measure distances. The invention has a simplicity of operation which practically eliminates the possibilities of operator optical reading error, owning to the elimination of traditional optical alignments for making measurements. The invention has an extendable arm which carries a laser surveying target. The extendable arm can be continuously positioned over its entire length of travel by either a coarse or fine adjustment without having the fine adjustment outrun the coarse adjustment until a reference laser beam is centered on the target as indicated by a digital readout. The length of the micrometer can then be accurately and automatically read by a computer and compared with a standardized set of alignment measurements. Due to its construction, the micrometer eliminates any errors due to temperature changes when the system is operated within a standard operating temperature range.

  3. Automatic readout micrometer

    DOEpatents

    Lauritzen, T.

    A measuring system is described for surveying and very accurately positioning objects with respect to a reference line. A principle use of this surveying system is for accurately aligning the electromagnets which direct a particle beam emitted from a particle accelerator. Prior art surveying systems require highly skilled surveyors. Prior art systems include, for example, optical surveying systems which are susceptible to operator reading errors, and celestial navigation-type surveying systems, with their inherent complexities. The present invention provides an automatic readout micrometer which can very accurately measure distances. The invention has a simplicity of operation which practically eliminates the possibilities of operator optical reading error, owning to the elimination of traditional optical alignments for making measurements. The invention has an extendable arm which carries a laser surveying target. The extendable arm can be continuously positioned over its entire length of travel by either a coarse of fine adjustment without having the fine adjustment outrun the coarse adjustment until a reference laser beam is centered on the target as indicated by a digital readout. The length of the micrometer can then be accurately and automatically read by a computer and compared with a standardized set of alignment measurements. Due to its construction, the micrometer eliminates any errors due to temperature changes when the system is operated within a standard operating temperature range.

  4. Silicon pixel R&D for CLIC

    NASA Astrophysics Data System (ADS)

    Munker, M.

    2017-01-01

    Challenging detector requirements are imposed by the physics goals at the future multi-TeV e+ e‑ Compact Linear Collider (CLIC). A single point resolution of 3 μm for the vertex detector and 7 μm for the tracker is required. Moreover, the CLIC vertex detector and tracker need to be extremely light weighted with a material budget of 0.2% X0 per layer in the vertex detector and 1–2% X0 in the tracker. A fast time slicing of 10 ns is further required to suppress background from beam-beam interactions. A wide range of sensor and readout ASIC technologies are investigated within the CLIC silicon pixel R&D effort. Various hybrid planar sensor assemblies with a pixel size of 25×25 μm2 and 55×55 μm2 have been produced and characterised by laboratory measurements and during test-beam campaigns. Experimental and simulation results for thin (50 μm–500 μm) slim edge and active-edge planar, and High-Voltage CMOS sensors hybridised to various readout ASICs (Timepix, Timepix3, CLICpix) are presented.

  5. Semiconductor detectors with proximity signal readout

    SciTech Connect

    Asztalos, Stephen J.

    2014-01-30

    Semiconductor-based radiation detectors are routinely used for the detection, imaging, and spectroscopy of x-rays, gamma rays, and charged particles for applications in the areas of nuclear and medical physics, astrophysics, environmental remediation, nuclear nonproliferation, and homeland security. Detectors used for imaging and particle tracking are more complex in that they typically must also measure the location of the radiation interaction in addition to the deposited energy. In such detectors, the position measurement is often achieved by dividing or segmenting the electrodes into many strips or pixels and then reading out the signals from all of the electrode segments. Fine electrode segmentation is problematic for many of the standard semiconductor detector technologies. Clearly there is a need for a semiconductor-based radiation detector technology that can achieve fine position resolution while maintaining the excellent energy resolution intrinsic to semiconductor detectors, can be fabricated through simple processes, does not require complex electrical interconnections to the detector, and can reduce the number of required channels of readout electronics. Proximity electrode signal readout (PESR), in which the electrodes are not in physical contact with the detector surface, satisfies this need.

  6. Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra K. (Inventor); Pain, Bedabrata (Inventor); Nixon, Robert H. (Inventor); Zhou, Zhimin (Inventor)

    2003-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

  7. Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra K. (Inventor); Pain, Bedabrata (Inventor); Nixon, Robert H. (Inventor); Zhou, Zhimin (Inventor)

    2000-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor Integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

  8. Integration of the ATLAS FE-I4 Pixel Chip in the Mini Time Projection Chamber

    NASA Astrophysics Data System (ADS)

    Lopez-Thibodeaux, Mayra; Garcia-Sciveres, Maurice; Kadyk, John; Oliver-Mallory, Kelsey

    2013-04-01

    This project deals with development of readout for a Time Projection Chamber (TPC) prototype. This is a type of detector proposed for direct detection of dark matter (WIMPS) with direction information. The TPC is a gaseous charged particle tracking detector composed of a field cage and a gas avalanche detector. The latter is made of two Gas Electron Multipliers in series, illuminating a pixel readout integrated circuit, which measures the distribution in position and time of the output charge. We are testing the TPC prototype, filled with ArCO2 gas, using a Fe-55 x-ray source and cosmic rays. The present prototype uses an FE-I3 chip for readout. This chip was developed about 10 years ago and is presently in use within the ATLAS pixel detector at the LHC. The aim of this work is to upgrade the TPC prototype to use an FE-I4 chip. The FE-I4 has an active area of 336 mm^2 and 26880 pixels, over nine times the number of pixels in the FE-I3 chip, and an active area about six times as much. The FE-I4 chip represents the state of the art of pixel detector readout, and is presently being used to build an upgrade of the ATLAS pixel detector.

  9. Measurements with MÖNCH, a 25 μm pixel pitch hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Ramilli, M.; Bergamaschi, A.; Andrae, M.; Brückner, M.; Cartier, S.; Dinapoli, R.; Fröjdh, E.; Greiffenberg, D.; Hutwelker, T.; Lopez-Cuenca, C.; Mezza, D.; Mozzanica, A.; Ruat, M.; Redford, S.; Schmitt, B.; Shi, X.; Tinti, G.; Zhang, J.

    2017-01-01

    MÖNCH is a hybrid silicon pixel detector based on charge integration and with analog readout, featuring a pixel size of 25×25 μm2. The latest working prototype consists of an array of 400×400 identical pixels for a total active area of 1×1 cm2. Its design is optimized for the single photon regime. An exhaustive characterization of this large area prototype has been carried out in the past months, and it confirms an ENC in the order of 35 electrons RMS and a dynamic range of ~4×12 keV photons in high gain mode, which increases to ~100×12 keV photons with the lowest gain setting. The low noise levels of MÖNCH make it a suitable candidate for X-ray detection at energies around 1 keV and below. Imaging applications in particular can benefit significantly from the use of MÖNCH: due to its extremely small pixel pitch, the detector intrinsically offers excellent position resolution. Moreover, in low flux conditions, charge sharing between neighboring pixels allows the use of position interpolation algorithms which grant a resolution at the micrometer-level. Its energy reconstruction and imaging capabilities have been tested for the first time at a low energy beamline at PSI, with photon energies between 1.75 keV and 3.5 keV, and results will be shown.

  10. Hybrid Pixel Detectors for gamma/X-ray imaging

    NASA Astrophysics Data System (ADS)

    Hatzistratis, D.; Theodoratos, G.; Zografos, V.; Kazas, I.; Loukas, D.; Lambropoulos, C. P.

    2015-09-01

    Hybrid pixel detectors are made by direct converting high-Z semi-insulating single crystalline material coupled to complementary-metal-oxide semiconductor (CMOS) readout electronics. They are attractive because direct conversion exterminates all the problems of spatial localization related to light diffusion, energy resolution, is far superior from the combination of scintillation crystals and photomultipliers and lithography can be used to pattern electrodes with very fine pitch. We are developing 2-D pixel CMOS ASICs, connect them to pixilated CdTe crystals with the flip chip and bump bonding method and characterize the hybrids. We have designed a series of circuits, whose latest member consists of a 50×25 pixel array with 400um pitch and an embedded controller. In every pixel a full spectroscopic channel with time tagging information has been implemented. The detectors are targeting Compton scatter imaging and they can be used for coded aperture imaging too. Hybridization using CMOS can overcome the limit put on pixel circuit complexity by the use of thin film transistors (TFT) in large flat panels. Hybrid active pixel sensors are used in dental imaging and other applications (e.g. industrial CT etc.). Thus X-ray imaging can benefit from the work done on dynamic range enhancement methods developed initially for visible and infrared CMOS pixel sensors. A 2-D CMOS ASIC with 100um pixel pitch to demonstrate the feasibility of such methods in the context of X-ray imaging has been designed.

  11. The Phase-1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Lipinski, M.

    2017-07-01

    The innermost tracking device of the CMS experiment is a silicon pixel detector. It has to cope with high particle fluxes and radiation damage, and was built to withstand the LHC design luminosity of 1×1034 cm-2s-1. This luminosity was already exceeded in 2016 and it is foreseen that it will increase further, potentially reaching two times the design value before 2018. Under such conditions the inefficiencies due to a limited readout bandwidth will increase by as much as 16% in the innermost layer. To maintain high tracking efficiency, the CMS collaboration has built a new pixel detector that was installed in March 2017. In this paper, the design of this so-called Phase-1 pixel detector is summarised, the production and the qualification of the pixel modules is described and the current status of the project is reported.

  12. Pixel Detectors For Diffraction Experiments At The Swiss Light Source

    SciTech Connect

    Huelsen, G.; Eikenberry, E.F.; Schmitt, B.; Schulze-Briese, C.; Tomizaki, T.; Stampanoni, M.; Willmott, P.; Patterson, B.; Broennimann, Ch.; Horisberger, R.; Toyokawa, H.; Borchert, G. L.

    2004-05-12

    The PILATUS detector (Pixel Apparatus for the SLS) is a large, quantum-limited area X-ray detector for protein crystallography which is currently under construction. Its basic units are modules with 16 CMOS chips bump-bonded to a large, continuously sensitive silicon sensor with 157x366 pixels of 217x217 {mu}m2, leading to an active area of 34x80 mm2. With a counting circuit in each pixel, X-rays are detected in single photon counting mode, leading to excellent, noise-free data. The main properties of the detector are an energy range of 6 to 30 keV, no back-ground due to leakage current or readout-noise, fast read-out time of 6.7 ms, a rate/pixel >104/s and a PSF of one pixel. PILATUS detectors are installed at the SLS X06SA protein crystallography beamline, and at both the surface diffraction (SD) station and the radiography and tomography (XTM) station of beamline X04SA. The detectors are operated at room temperature and thus are very easy to use. Experiments benefit from the ability to detect very weak diffraction spots with high precision. At the SD station and at the XTM station, which is equipped with a Bragg magnifier, diffraction, radiography and tomography experiments showed promising results. At beamline X06SA, a three-module array (1120x157 pixels) with a readout time of 6.7 ms was tested. This system was used to collect fine phi-sliced protein crystal data in continuous sample rotation mode in which the crystal was continuously rotated with a slow angular velocity of 0.04 deg./s without any shutter operation. Exposure time per frame ranged from 100 ms to a few seconds, depending on the crystal. These initial experiments show the potential of this method.

  13. Pixel Detectors For Diffraction Experiments At The Swiss Light Source

    NASA Astrophysics Data System (ADS)

    Hülsen, G.; Eikenberry, E. F.; Horisberger, R.; Schmitt, B.; Schulze-Briese, C.; Tomizaki, T.; Toyokawa, H.; Stampanoni, M.; Borchert, G. L.; Willmott, P.; Patterson, B.; Brönnimann, Ch.

    2004-05-01

    The PILATUS detector (Pixel Apparatus for the SLS) is a large, quantum-limited area X-ray detector for protein crystallography which is currently under construction. Its basic units are modules with 16 CMOS chips bump-bonded to a large, continuously sensitive silicon sensor with 157×366 pixels of 217×217 μm2, leading to an active area of 34×80 mm2. With a counting circuit in each pixel, X-rays are detected in single photon counting mode, leading to excellent, noise-free data. The main properties of the detector are an energy range of 6 to 30 keV, no back-ground due to leakage current or readout-noise, fast read-out time of 6.7 ms, a rate/pixel >104/s and a PSF of one pixel. PILATUS detectors are installed at the SLS X06SA protein crystallography beamline, and at both the surface diffraction (SD) station and the radiography and tomography (XTM) station of beamline X04SA. The detectors are operated at room temperature and thus are very easy to use. Experiments benefit from the ability to detect very weak diffraction spots with high precision. At the SD station and at the XTM station, which is equipped with a Bragg magnifier, diffraction, radiography and tomography experiments showed promising results. At beamline X06SA, a three-module array (1120×157 pixels) with a readout time of 6.7 ms was tested. This system was used to collect fine phi-sliced protein crystal data in continuous sample rotation mode in which the crystal was continuously rotated with a slow angular velocity of 0.04 °/s without any shutter operation. Exposure time per frame ranged from 100 ms to a few seconds, depending on the crystal. These initial experiments show the potential of this method.

  14. Imaging by photon counting with 256x256 pixel matrix

    NASA Astrophysics Data System (ADS)

    Tlustos, Lukas; Campbell, Michael; Heijne, Erik H. M.; Llopart, Xavier

    2004-09-01

    Using 0.25µm standard CMOS we have developed 2-D semiconductor matrix detectors with sophisticated functionality integrated inside each pixel of a hybrid sensor module. One of these sensor modules is a matrix of 256x256 square 55µm pixels intended for X-ray imaging. This device is called 'Medipix2' and features a fast amplifier and two-level discrimination for signals between 1000 and 100000 equivalent electrons, with overall signal noise ~150 e- rms. Signal polarity and comparator thresholds are programmable. A maximum count rate of nearly 1 MHz per pixel can be achieved, which corresponds to an average flux of 3x10exp10 photons per cm2. The selected signals can be accumulated in each pixel in a 13-bit register. The serial readout takes 5-10 ms. A parallel readout of ~300 µs could also be used. Housekeeping functions such as local dark current compensation, test pulse generation, silencing of noisy pixels and threshold tuning in each pixel contribute to the homogeneous response over a large sensor area. The sensor material can be adapted to the energy of the X-rays. Best results have been obtained with high-resistivity silicon detectors, but also CdTe and GaAs detectors have been used. The lowest detectable X-ray energy was about 4 keV. Background measurements have been made, as well as measurements of the uniformity of imaging by photon counting. Very low photon count rates are feasible and noise-free at room temperature. The readout matrix can be used also with visible photons if an energy or charge intensifier structure is interposed such as a gaseous amplification layer or a microchannel plate or acceleration field in vacuum.

  15. Large monolithic particle pixel-detector in high-voltage CMOS technology

    NASA Astrophysics Data System (ADS)

    Perić, I.; Takacs, C.

    2010-12-01

    A large monolithic particle pixel-detector implemented as system on a chip in a high-voltage 0.35 μm CMOS technology will be presented. The detector uses high-voltage n-well/p-substrate diodes as pixel-sensors. The diodes can be reversely biased with more than 60 V. In this way, depleted zones of about 10 μm thickness are formed, where the signal charges can be collected by drift. Due to fast charge collection in the strong electric-field zones, a higher radiation tolerance of the sensor is expected than in the case of the standard MAPS detectors. Simple pixel-readout electronics are implemented inside the n-wells. The readout is based on a source follower with one select- and two reset-transistors. Due to embedding of the pixel-readout electronics inside the collecting electrodes (n-wells) there are no insensitive zones within the pixel matrix. The detector chip contains a 128×128 matrix consisting of pixels of 21×21 μm2 -size. The diode voltages of one selected pixel-row are received at the bottom of the matrix by 128 eight-bit single-slope ADCs. All ADCs operate in parallel. The ADC codes are read out using eight LVDS 500 MBit/s output links. The readout electronics are designed to allow the readout of the whole pixel matrix in less than 50 μs. The total DC power consumption of the chip is 50 mW. All analog parts of the chip are implemented using radiation-hard layout techniques. Experimental results will be presented.

  16. ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays

    NASA Technical Reports Server (NTRS)

    Vasile, Stefan; Lipson, Jerold

    2012-01-01

    The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.

  17. Compensated digital readout family

    NASA Technical Reports Server (NTRS)

    Ludwig, David E.; Skow, Michael

    1991-01-01

    ISC has completed test on an IC which has 32 channels of amplifiers, low pass anti-aliasing filters, 13-bit analog-to-digital (A/D) converters with non-uniformity correction per channel and a digital multiplexer. The single slope class of A/D conversion is described, as are the unique variations required for incorporation of this technique for use with on-focal plane detector readout electronics. This paper describes the architecture used to implement the digital on-focal plane signal processing functions. Results from measured data on a test IC are presented for a circuit containing these functions operating at a sensor frame rate of 1000 hertz.

  18. Current progress on pixel level packaging for uncooled IRFPA

    NASA Astrophysics Data System (ADS)

    Dumont, G.; Rabaud, W.; Yon, J.-J.; Carle, L.; Goudon, V.; Vialle, C.; Becker, Sébastien; Hamelin, Antoine; Arnaud, A.

    2012-06-01

    Vacuum packaging is definitely a major cost driver for uncooled IRFPA and a technological breakthrough is still expected to comply with the very low cost infrared camera market. To address this key issue, CEA-LETI is developing a Pixel Level Packaging (PLP) technology which basically consists in capping each pixel under vacuum in the direct continuation of the wafer level bolometer process. Previous CEA-LETI works have yet shown the feasibility of PLP based microbolometers that exhibit the required thermal insulation and vacuum achievement. CEA-LETI is still pushing the technology which has been now applied for the first time on a CMOS readout circuit. The paper will report on the recent progress obtained on PLP technology with particular emphasis on the optical efficiency of the PLP arrangement compared to the traditional microbolometer packaging. Results including optical performances, aging studies and compatibility with CMOS readout circuit are extensively presented.

  19. Methodological Study of a Single Photon Counting Pixel Detector at SPring-8

    SciTech Connect

    Toyokawa, H.; Suzuki, M.; Broennimann, Ch.; Eikenberry, E. F.; Henrich, B.; Huelsen, G.; Kraft, P.

    2007-01-19

    PILATUS (Pixel Apparatus for the SLS) is a challenging project to develop a large area single photon counting pixel detector for synchrotron radiation experiments. SPring-8 examined the PLATUS single module detectors in collaboration with the Paul Scherrer Institute. The PILATUS-II single module detector has a desired performance with almost zero defective pixels and a fast frame rate up to 100 Hz using a newly developed PCI readout system on a Linux-PC. The maximum counting rate achieves more than 2 x 106 X-rays/s/pixel.

  20. Methodological Study of a Single Photon Counting Pixel Detector at SPring-8

    NASA Astrophysics Data System (ADS)

    Toyokawa, H.; Suzuki, M.; Brönnimann, Ch.; Eikenberry, E. F.; Henrich, B.; Hülsen, G.; Kraft, P.

    2007-01-01

    PILATUS (Pixel Apparatus for the SLS) is a challenging project to develop a large area single photon counting pixel detector for synchrotron radiation experiments. SPring-8 examined the PLATUS single module detectors in collaboration with the Paul Scherrer Institute. The PILATUS-II single module detector has a desired performance with almost zero defective pixels and a fast frame rate up to 100 Hz using a newly developed PCI readout system on a Linux-PC. The maximum counting rate achieves more than 2 × 106 X-rays/s/pixel.

  1. High-dynamic-range pixel architectures for diagnostic medical imaging

    NASA Astrophysics Data System (ADS)

    Karim, Karim S.; Yin, Sherman; Nathan, Arokia; Rowlands, John A.

    2004-05-01

    One approach to increase pixel signal-to-noise ratio (SNR) in low noise digital fluoroscopy is to employ in-situ pixel amplification via current-mediated active pixel sensors (C-APS). Experiments reveal a reduction in readout noise and indicate that an a-Si C-APS, coupled together with an established X-ray detection technology such as amorphous selenium (a-Se), can meet the stringent requirements (of < 1000 noise electrons) for digital X-ray fluoroscopy. A challenge with the C-APS circuit is the presence of a small-signal input linearity constraint. While using such a pixel amplifier for real-time fluoroscopy (where the exposure level is small) is feasible, the voltage change at the amplifier input is much higher in chest radiography or mammography due to the larger X-ray exposure levels. The larger input voltage causes the C-APS output to be non-linear thus reducing the pixel dynamic range. In addition, the resulting larger pixel output current causes the external column amplifier to saturate further reducing the pixel dynamic range. In this research, we investigate two alternate amplified pixel architectures that exhibit higher dynamic range. The test pixels are designed and simulated using an a-Si TFT model implemented in Verilog-A and results indicate a linear performance, high dynamic range, and a programmable circuit gain via choice of supply voltage and sampling time. These high dynamic range pixel architectures have the potential to enable a large area, active matrix flat panel imager (AMFPI) to switch instantly between low exposure, fluoroscopic imaging and higher exposure radiographic imaging modes. Lastly, the high dynamic range pixel circuits are suitable for integration with on-panel multiplexers for both gate and data lines, which can further reduce circuit complexity.

  2. Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

    NASA Astrophysics Data System (ADS)

    Schneider, A.; Veale, M. C.; Duarte, D. D.; Bell, S. J.; Wilson, M. D.; Lipp, J. D.; Seller, P.

    2015-02-01

    In the last decade, the Detector Development Group at the Technology Department of the Science and Technology Facilities Council (STFC), U.K., established a variety of fabrication and bonding techniques to build pixelated X-ray and γ-ray detector systems such as the spectroscopic X-ray imaging detector HEXITEC [1]. The fabrication and bonding of such devices comprises a range of processes including material surface preparation, photolithography, stencil printing, flip-chip and wire bonding of detectors to application-specific integrated circuits (ASIC). This paper presents interconnect and bonding techniques used in the fabrication chain for pixelated detectors assembled at STFC. For this purpose, detector dies (~ 20× 20 mm2) of high quality, single crystal semiconductors, such as cadmium zinc telluride (CZT) are cut to the required thickness (up to 5mm). The die surfaces are lapped and polished to a mirror-finish and then individually processed by electroless gold deposition combined with photolithography to form 74× 74 arrays of 200 μ m × 200 μ m pixels with 250 μ m pitch. Owing to a lack of availability of CZT wafers, lithography is commonly carried out on individual detector dies which represents a significant technical challenge as the edge of the pixel array and the surrounding guard band lies close to the physical edge of the crystal. Further, such detector dies are flip-chip bonded to readout ASIC using low-temperature curing silver-loaded epoxy so that the stress between the bonded detector die and the ASIC is minimized. In addition, this reduces crystalline modifications of the detector die that occur at temperature greater than 150\\r{ }C and have adverse effects on the detector performance. To allow smaller pitch detectors to be bonded, STFC has also developed a compression cold-weld indium bump bonding technique utilising bumps formed by a photolithographic lift-off technique.

  3. Characterization of Silicon Detector Readout Electronics

    SciTech Connect

    Jones, M.

    2015-07-22

    Configuration and calibration of the front-end electronics typical of many silicon detector configurations were investigated in a lab activity based on a pair of strip sensors interfaced with FSSR2 read-out chips and an FPGA. This simple hardware configuration, originally developed for a telescope at the Fermilab Test Beam Facility, was used to measure thresholds and noise on individual readout channels and to study the influence that different configurations of the front-end electronics had on the observed levels of noise in the system. An understanding of the calibration and operation of this small detector system provided an opportunity to explore the architecture of larger systems such as those currently in use at LHC experiments.

  4. Thin hybrid pixel assembly fabrication development with backside compensation layer

    NASA Astrophysics Data System (ADS)

    Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

    2017-02-01

    The ATLAS and CMS experiments will both replace their entire tracking systems for operation at the HL-LHC in 2026. This will include a significantly larger pixel systems, for example, for ATLAS approximately 15 m2. To keep the tracker material budget low it is crucial to minimize the mass of the pixel modules via thinning both the sensor and readout chip to about 150 μm each. The bump yield of thin module assemblies using solder based bump bonding can be problematic due to wafer bowing during solder reflow at high temperature. A new bump-bonding process using backside compensation on the readout chip to address the issue of low yield will be presented. The objective is to compensate dynamically the stress of the front side stack by adding a compensating layer to the backside of the wafer. A SiN and Al:Si stack has been chosen for the backside layer. The bow reducing effect of applying a backside compensation layer will be demonstrated using the FE-I4 wafer. The world's first results from assemblies produced from readout wafers thinned to 100 μm with a stress compensation layer are presented with bond yields close to 100% measured using the FE-I4 readout chip.

  5. Gallium arsenide pixel detectors for medical imaging

    NASA Astrophysics Data System (ADS)

    Da Via, C.; Bates, R.; Bertolucci, E.; Bottigli, U.; Campbell, M.; Chesi, E.; Conti, M.; D'Auria, S.; DelPapa, C.; Fantacci, M. E.; Grossi, G.; Heijne, E.; Mancini, E.; Middelkamp, P.; Raine, C.; Russo, P.; O'Shea, V.; Scharfetter, L.; Smith, K.; Snoeys, W.; Stefanini, A.

    1997-08-01

    Gallium arsenide pixel detectors processed on a 200 μm Semi-Insulating (SI) Hitachi substrate were bump-bonded to the Omega3 electronics developed at CERN for high energy physics [1]. The pixel dimensions are 50 μm × 500 μm for a total of 2048 cells and an active area of ˜0.5 cm 2. Our aim is to use this system for medical imaging. We report the results obtained after irradiation of the detector with different X-ray sources on phantoms with different contrasts. The system showed good sensitivity to X-rays from 241Am (60 keV) and 109Cd (22.1 keV). It is also sensitive to β- particles from 90Sr as well as from 32P which is used as a tracer for autoradiography applications. The inherent high absorption efficiency of GaAs associated with the self-triggering capabilities of the pixel readout system reduced considerably the acquisition time compared with traditional systems based on silicon or emulsions. The present configuration is not optimised for X-ray imaging. The reduction of the pixel dimensions to 200 μm × 200 μm together with the integration of a counter in the pixel electronics would make the detector competitive for applications like mammography or dental radiology. For certain applications in biochemistry, such as DNA sequencing, where good spatial resolution is required only in one direction, the present setup should allow the best spatial resolution available up to now with respect to other digital autoradiographic systems. DNA sequencing tests are now under way.

  6. Hybrid Pixel-Waveform (HPWF) Enabled CdTe Detectors for Small Animal Gamma-Ray Imaging Applications

    PubMed Central

    Groll, A.; Kim, K.; Bhatia, H.; Zhang, J. C.; Wang, J. H.; Shen, Z. M.; Cai, L.; Dutta, J.; Li, Q.; Meng, L. J.

    2016-01-01

    This paper presents the design and preliminary evaluation of small-pixel CdTe gamma ray detectors equipped with a hybrid pixel-waveform (HPWF) readout system for gamma ray imaging applications with additional discussion on CZT due to its similarity. The HPWF readout system utilizes a pixelated anode readout circuitry which is designed to only provide the pixel address. This readout circuitry works in coincidence with a high-speed digitizer to sample the cathode waveform which provides the energy, timing, and depth-of-interaction (DOI) information. This work focuses on the developed and experimentally evaluated prototype HPWF-CdTe detectors with a custom CMOS pixel-ASIC to readout small anode pixels of 350 μm in size, and a discrete waveform sampling circuitry to digitize the signal waveform induced on the large cathode. The intrinsic timing, energy, and spatial resolution were experimentally evaluated in this paper in conjunction with methods for depth of interaction (DOI) partitioning of the CdTe crystal. While the experimental studies discussed in this paper are primarily for evaluating HPWF detectors for small animal PET imaging, these detectors could find their applications for ultrahigh-resolution SPECT and other imaging modalities. PMID:28516169

  7. Development of the Continuous Acquisition Pixel (CAP) sensor for high luminosity lepton colliders

    NASA Astrophysics Data System (ADS)

    Varner, G.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Martin, E.; Mueller, J.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanič, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Yang, Q.; Yarema, R.

    2006-09-01

    A future higher luminosity B-factory detector and concept study detectors for the proposed International Linear Collider require precision vertex reconstruction while coping with high track densities and radiation exposures. Compared with current silicon strip and hybrid pixels, a significant reduction in the overall detector material thickness is needed to achieve the desired vertex resolution. Considerable progress in the development of thin CMOS-based Monolithic Active Pixel Sensors (MAPS) in recent years makes them a viable technology option and feasibility studies are being actively pursued. The most serious concerns are their radiation hardness and their readout speed. To address these, several prototypes denoted as the Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25 μm process with a 5-deep Correlated Double Sample (CDS) pair pipeline in each pixel. A setup with several CAP3 sensors is under evaluation to assess the performance of a full-scale pixel readout system running at realistic readout speed. Given the similarity in the occupancy numbers and hit throughput requirements, per unit area, between a Belle vertex detector upgradation and the requirements for a future ILC pixel detector, this effort can be considered a small-scale functioning prototype for such a future system. The results and plans for the next stages of R&D towards a full Belle Pixel Vertex Detector (PVD) are presented.

  8. High density pixel array

    NASA Technical Reports Server (NTRS)

    Wiener-Avnear, Eliezer (Inventor); McFall, James Earl (Inventor)

    2004-01-01

    A pixel array device is fabricated by a laser micro-milling method under strict process control conditions. The device has an array of pixels bonded together with an adhesive filling the grooves between adjacent pixels. The array is fabricated by moving a substrate relative to a laser beam of predetermined intensity at a controlled, constant velocity along a predetermined path defining a set of grooves between adjacent pixels so that a predetermined laser flux per unit area is applied to the material, and repeating the movement for a plurality of passes of the laser beam until the grooves are ablated to a desired depth. The substrate is of an ultrasonic transducer material in one example for fabrication of a 2D ultrasonic phase array transducer. A substrate of phosphor material is used to fabricate an X-ray focal plane array detector.

  9. Advances in on-focal-plane A/D with low-power optical readout

    NASA Astrophysics Data System (ADS)

    Mandl, William J.

    1998-07-01

    Development of per pixel analog to digital conversion technology for staring focal plane arrays has resulted in improvements in well capacity, power consumption, linearity and signal to noise performance compared to present analog readout approaches. This new digital approach has also allowed the application of alternative on focal readout approaches. These include passive optical devices for readout as well as current mode switching wired output. Test results and design considerations of a recently completed 128 X 128 staring array are presented. The design was based on MOSAD, Multiplexed OverSample A/D, which places a filtering A/D modulator at each pixel. This readout has been linked on focal plane to passive reflective optical modulators providing high data rate digital outputs as an alternative to wired interconnect. A comparative study of current mode wired switching verses optical mode readout was completed. These results will also be presented. Both the optical readout and focal plane array designs were developed with funding from the U.S. Army Night Vision and Electronic Sensors Directorate.

  10. Pixel electronics for the ATLAS experiment

    NASA Astrophysics Data System (ADS)

    Fischer, P.

    2001-06-01

    The ATLAS experiment at LHC will use 3 barrel layers and 2×5 disks of silicon pixel detectors as the innermost elements of the semiconductor tracker. The basic building blocks are pixel modules with an active area of 16.4 mm×60.8 mm which include an n + on n-type silicon sensor and 16 VLSI front-end (FE) chips. Every FE chip contains a low power, high speed charge sensitive preamplifier, a fast discriminator, and a readout system which operates at the 40 MHz rate of LHC. The addresses of hit pixels (as well as a low resolution pulse height information) are stored on the FE chips until arrival of a level 1 trigger signal. Hits are then transferred to a module controller chip (MCC) which collects the data of all 16 FE chips, builds complete events and sends the data through two optical links to the data acquisition system. The MCC receives clock and data through an additional optical link and provides timing and configuration information for the FE chips. Two additional chips are used to amplify and decode the pin diode signal and to drive the VCSEL laser diodes of the optical links.

  11. A two-dimensional position sensitive gas chamber with scanned charge transfer readout

    NASA Astrophysics Data System (ADS)

    Gómez, F.; Iglesias, A.; Lobato, R.; Mosquera, J.; Pardo, J.; Pena, J.; Pazos, A.; Pombar, M.; Rodríguez, A.

    2003-10-01

    We have constructed and tested a two-dimensional position sensitive parallel-plate gas ionization chamber with scanned charge transfer readout. The scan readout method described here is based on the development of a new position-dependent charge transfer technique. It has been implemented by using gate strips perpendicularly oriented to the collector strips. This solution reduces considerably the number of electronic readout channels needed to cover large detector areas. The use of a 25 μm thick kapton etched circuit allows high charge transfer efficiency with a low gating voltage, consequently needing a very simple commutating circuit. The present prototype covers 8×8 cm2 with a pixel size of 1.27×1.27 mm2. Depending on the intended use and beam characteristics a smaller effective pixel is feasible and larger active areas are possible. This detector can be used for X-ray or other continuous beam intensity profile monitoring.

  12. New Subarray Readout Patterns for the ACS Wide Field Channel

    NASA Astrophysics Data System (ADS)

    Golimowski, D.; Anderson, J.; Arslanian, S.; Chiaberge, M.; Grogin, N.; Lim, Pey Lian; Lupie, O.; McMaster, M.; Reinhart, M.; Schiffer, F.; Serrano, B.; Van Marshall, M.; Welty, A.

    2017-04-01

    At the start of Cycle 24, the original CCD-readout timing patterns used to generate ACS Wide Field Channel (WFC) subarray images were replaced with new patterns adapted from the four-quadrant readout pattern used to generate full-frame WFC images. The primary motivation for this replacement was a substantial reduction of observatory and staff resources needed to support WFC subarray bias calibration, which became a new and challenging obligation after the installation of the ACS CCD Electronics Box Replacement during Servicing Mission 4. The new readout patterns also improve the overall efficiency of observing with WFC subarrays and enable the processing of subarray images through stages of the ACS data calibration pipeline (calacs) that were previously restricted to full-frame WFC images. The new readout patterns replace the original 512×512, 1024×1024, and 2048×2046-pixel subarrays with subarrays having 2048 columns and 512, 1024, and 2048 rows, respectively. Whereas the original square subarrays were limited to certain WFC quadrants, the new rectangular subarrays are available in all four quadrants. The underlying bias structure of the new subarrays now conforms with those of the corresponding regions of the full-frame image, which allows raw frames in all image formats to be calibrated using one contemporaneous full-frame "superbias" reference image. The original subarrays remain available for scientific use, but calibration of these image formats is no longer supported by STScI.

  13. Characterization of Pixelated Cadmium-Zinc-Telluride Detectors for Astrophysical Applications

    NASA Technical Reports Server (NTRS)

    Gaskin, Jessica; Sharma, Dharma; Ramsey, Brian; Seller, Paul

    2003-01-01

    Comparisons of charge sharing and charge loss measurements between two pixelated Cadmium-Zinc-Telluride (CdZnTe) detectors are discussed. These properties along with the detector geometry help to define the limiting energy resolution and spatial resolution of the detector in question. The first detector consists of a 1-mm-thick piece of CdZnTe sputtered with a 4x4 array of pixels with pixel pitch of 750 microns (inter-pixel gap is 100 microns). Signal readout is via discrete ultra-low-noise preamplifiers, one for each of the 16 pixels. The second detector consists of a 2-mm-thick piece of CdZnTe sputtered with a 16x16 array of pixels with a pixel pitch of 300 microns (inter-pixel gap is 50 microns). This crystal is bonded to a custom-built readout chip (ASIC) providing all front-end electronics to each of the 256 independent pixels. These detectors act as precursors to that which will be used at the focal plane of the High Energy Replicated Optics (HERO) telescope currently being developed at Marshall Space Flight Center. With a telescope focal length of 6 meters, the detector needs to have a spatial resolution of around 200 microns in order to take full advantage of the HERO angular resolution. We discuss to what degree charge sharing will degrade energy resolution but will improve our spatial resolution through position interpolation.

  14. Characterization of Pixelated Cadmium-Zinc-Telluride Detectors for Astrophysical Applications

    NASA Technical Reports Server (NTRS)

    Gaskin, Jessica; Sharma, Dharma; Ramsey, Brian; Seller, Paul

    2003-01-01

    Comparisons of charge sharing and charge loss measurements between two pixelated Cadmium-Zinc-Telluride (CdZnTe) detectors are discussed. These properties along with the detector geometry help to define the limiting energy resolution and spatial resolution of the detector in question. The first detector consists of a 1-mm-thick piece of CdZnTe sputtered with a 4x4 array of pixels with pixel pitch of 750 microns (inter-pixel gap is 100 microns). Signal readout is via discrete ultra-low-noise preamplifiers, one for each of the 16 pixels. The second detector consists of a 2-mm-thick piece of CdZnTe sputtered with a 16x16 array of pixels with a pixel pitch of 300 microns (inter-pixel gap is 50 microns). This crystal is bonded to a custom-built readout chip (ASIC) providing all front-end electronics to each of the 256 independent pixels. These detectors act as precursors to that which will be used at the focal plane of the High Energy Replicated Optics (HERO) telescope currently being developed at Marshall Space Flight Center. With a telescope focal length of 6 meters, the detector needs to have a spatial resolution of around 200 microns in order to take full advantage of the HERO angular resolution. We discuss to what degree charge sharing will degrade energy resolution but will improve our spatial resolution through position interpolation.

  15. Readout method for stored information

    NASA Technical Reports Server (NTRS)

    Lewicki, G. W.

    1976-01-01

    Readout technique increases density of stored information for projection onto facsimile reproduction. Data stored on line structures is scanned at 90 deg. angle over area larger than recorded format to ensure complete recovery of information.

  16. The PAUCam readout electronics system

    NASA Astrophysics Data System (ADS)

    Jiménez, Jorge; Illa, José M.; Cardiel-Sas, Laia; de Vicente, Juan; Castilla, Javier; Casas, Ricard

    2016-08-01

    The PAUCam is an optical camera with a wide field of view of 1 deg x 1 deg and up to 46 narrow and broad band filters. The camera is already installed on the William Herschel Telescope (WHT) in the Canary Islands, Spain and successfully commissioned during the first period of 2015. The paper presents the main results from the readout electronics commissioning tests and include an overview of the whole readout electronics system, its configuration and current performance.

  17. Uncooled MEMS IR imagers with optical readout and image processing

    NASA Astrophysics Data System (ADS)

    Lavrik, Nickolay; Archibald, Rick; Grbovic, Dragoslav; Rajic, Slo; Datskos, Panos

    2007-04-01

    MEMS thermal transducers offer a promising technological platform for uncooled IR imaging. We report on the fabrication and performance of a 256x256 MEMS IR FPA based on bimaterial microcantilever. The FPA readout is performed using a simple and efficient optical readout scheme. The response time of the bimaterial microcantilever was <15 ms and the thermal isolation was calculated to be < 4x10 -7 W/K. Using these FPAs we obtained IR images of room temperature objects. Image quality is improved by automatic post-processing of artifacts arising from noise and non-responsive pixels. An iterative Curvelet denoising and inpainting procedure is successfully applied to image output. We present our results and discuss the factors that determine the ultimate performance of the FPA. One of the unique advantages of the present approach is the scalability to larger imaging arrays.

  18. Fast, High-Precision Readout Circuit for Detector Arrays

    NASA Technical Reports Server (NTRS)

    Rider, David M.; Hancock, Bruce R.; Key, Richard W.; Cunningham, Thomas J.; Wrigley, Chris J.; Seshadri, Suresh; Sander, Stanley P.; Blavier, Jean-Francois L.

    2013-01-01

    The GEO-CAPE mission described in NASA's Earth Science and Applications Decadal Survey requires high spatial, temporal, and spectral resolution measurements to monitor and characterize the rapidly changing chemistry of the troposphere over North and South Americas. High-frame-rate focal plane arrays (FPAs) with many pixels are needed to enable such measurements. A high-throughput digital detector readout integrated circuit (ROIC) that meets the GEO-CAPE FPA needs has been developed, fabricated, and tested. The ROIC is based on an innovative charge integrating, fast, high-precision analog-to-digital circuit that is built into each pixel. The 128×128-pixel ROIC digitizes all 16,384 pixels simultaneously at frame rates up to 16 kHz to provide a completely digital output on a single integrated circuit at an unprecedented rate of 262 million pixels per second. The approach eliminates the need for off focal plane electronics, greatly reducing volume, mass, and power compared to conventional FPA implementations. A focal plane based on this ROIC will require less than 2 W of power on a 1×1-cm integrated circuit. The ROIC is fabricated of silicon using CMOS technology. It is designed to be indium bump bonded to a variety of detector materials including silicon PIN diodes, indium antimonide (InSb), indium gallium arsenide (In- GaAs), and mercury cadmium telluride (HgCdTe) detector arrays to provide coverage over a broad spectral range in the infrared, visible, and ultraviolet spectral ranges.

  19. Simple Bulk Readout of Digital Nucleic Acid Quantification Assays.

    PubMed

    Morinishi, Leanna S; Blainey, Paul

    2015-09-24

    Digital assays are powerful methods that enable detection of rare cells and counting of individual nucleic acid molecules. However, digital assays are still not routinely applied, due to the cost and specific equipment associated with commercially available methods. Here we present a simplified method for readout of digital droplet assays using a conventional real-time PCR instrument to measure bulk fluorescence of droplet-based digital assays. We characterize the performance of the bulk readout assay using synthetic droplet mixtures and a droplet digital multiple displacement amplification (MDA) assay. Quantitative MDA particularly benefits from a digital reaction format, but our new method applies to any digital assay. For established digital assay protocols such as digital PCR, this method serves to speed up and simplify assay readout. Our bulk readout methodology brings the advantages of partitioned assays without the need for specialized readout instrumentation. The principal limitations of the bulk readout methodology are reduced dynamic range compared with droplet-counting platforms and the need for a standard sample, although the requirements for this standard are less demanding than for a conventional real-time experiment. Quantitative whole genome amplification (WGA) is used to test for contaminants in WGA reactions and is the most sensitive way to detect the presence of DNA fragments with unknown sequences, giving the method great promise in diverse application areas including pharmaceutical quality control and astrobiology.

  20. PAUCam readout electronics assembly, integration and test (AIT)

    NASA Astrophysics Data System (ADS)

    Jiménez, Jorge; Illa, José M.; Cardiel-Sas, Laia; de Vicente, Juan; Castilla, Javier; Casas, Ricard

    2014-08-01

    The PAUCam is an optical camera with an array of 18 CCDs (Hamamatsu Photonics K.K.) and up to 45 narrow and broad band filters. The camera will be installed on the William Herschel Telescope (WHT) in the Canary Islands, Spain. In order to fulfill with the specifications for the camera readout system, it was necessary to test the different readout electronics subsystems individually before to integrate the final readout work package, which is composed of 4 MONSOON (NOAO) front-ends, 6 fan out boards (MIX), each one driving up to 5 CCDs signals and a pre-amplification stage (PREAMP) located inside the cryostat. To get the subsystems integration, it was built a small camera prototype using the same technology as used in the main camera: a carbon fiber cryostat refrigerated by a cryotiger cooling system but with capacity to allocate just 2 CCDs, which were readout and re-characterized to measure the electronics performance as conversion factor or gain, readout noise, stability, linearity, etc. while the cross-talk was measured by using a spot-light. The aim of this paper is to review the whole process of assembly, integration and test (AIT) of the readout electronics work package and present the main results to demonstrate the viability of the proposed systems to be use with the PAUCam camera.

  1. Fiber pixelated image database

    NASA Astrophysics Data System (ADS)

    Shinde, Anant; Perinchery, Sandeep Menon; Matham, Murukeshan Vadakke

    2016-08-01

    Imaging of physically inaccessible parts of the body such as the colon at micron-level resolution is highly important in diagnostic medical imaging. Though flexible endoscopes based on the imaging fiber bundle are used for such diagnostic procedures, their inherent honeycomb-like structure creates fiber pixelation effects. This impedes the observer from perceiving the information from an image captured and hinders the direct use of image processing and machine intelligence techniques on the recorded signal. Significant efforts have been made by researchers in the recent past in the development and implementation of pixelation removal techniques. However, researchers have often used their own set of images without making source data available which subdued their usage and adaptability universally. A database of pixelated images is the current requirement to meet the growing diagnostic needs in the healthcare arena. An innovative fiber pixelated image database is presented, which consists of pixelated images that are synthetically generated and experimentally acquired. Sample space encompasses test patterns of different scales, sizes, and shapes. It is envisaged that this proposed database will alleviate the current limitations associated with relevant research and development and would be of great help for researchers working on comb structure removal algorithms.

  2. CMOS monolithic active pixel sensors for high energy physics

    NASA Astrophysics Data System (ADS)

    Snoeys, W.

    2014-11-01

    Monolithic pixel detectors integrating sensor matrix and readout in one piece of silicon are only now starting to make their way into high energy physics. Two major requirements are radiation tolerance and low power consumption. For the most extreme radiation levels, signal charge has to be collected by drift from a depletion layer onto a designated collection electrode without losing the signal charge elsewhere in the in-pixel circuit. Low power consumption requires an optimization of Q/C, the ratio of the collected signal charge over the input capacitance [1]. Some solutions to combine sufficient Q/C and collection by drift require exotic fabrication steps. More conventional solutions up to now require a simple in-pixel readout circuit. Both high voltage CMOS technologies and Monolithic Active Pixel Sensors (MAPS) technologies with high resistivity epitaxial layers offer high voltage diodes. The choice between the two is not fundamental but more a question of how much depletion can be reached and also of availability and cost. This paper tries to give an overview.

  3. Electron imaging with Medipix2 hybrid pixel detector.

    PubMed

    McMullan, G; Cattermole, D M; Chen, S; Henderson, R; Llopart, X; Summerfield, C; Tlustos, L; Faruqi, A R

    2007-01-01

    The electron imaging performance of Medipix2 is described. Medipix2 is a hybrid pixel detector composed of two layers. It has a sensor layer and a layer of readout electronics, in which each 55 microm x 55 microm pixel has upper and lower energy discrimination and MHz rate counting. The sensor layer consists of a 300 microm slab of pixellated monolithic silicon and this is bonded to the readout chip. Experimental measurement of the detective quantum efficiency, DQE(0) at 120 keV shows that it can reach approximately 85% independent of electron exposure, since the detector has zero noise, and the DQE(Nyquist) can reach approximately 35% of that expected for a perfect detector (4/pi(2)). Experimental measurement of the modulation transfer function (MTF) at Nyquist resolution for 120 keV electrons using a 60 keV lower energy threshold, yields a value that is 50% of that expected for a perfect detector (2/pi). Finally, Monte Carlo simulations of electron tracks and energy deposited in adjacent pixels have been performed and used to calculate expected values for the MTF and DQE as a function of the threshold energy. The good agreement between theory and experiment allows suggestions for further improvements to be made with confidence. The present detector is already very useful for experiments that require a high DQE at very low doses.

  4. Phase 1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Saha, Anirban

    2017-02-01

    The pixel tracker of the Compact Muon Solenoid (CMS) experiment is the innermost sub-detector, located close to the collision point, and is used for reconstruction of the tracks and vertices of charged particles. The present pixel detector was designed to work efficiently with the maximum instantaneous luminosity of 1 × 1034 cm‑2 s‑1. In 2017 the Large Hadron Collider (LHC) is expected to deliver a peak luminosity reaching up to 2 × 1034 cm‑2 s‑1, increasing the mean number of primary vertices to 50. Due to the radiation damage and significant data losses due to high occupancy in the readout chip of the pixel detector, the present system must be replaced by a new one in an extended end-of-year shutdown during winter 2016/2017 in order to maintain the excellent tracking and other physics performances. The main new features of the upgraded pixel detector are a ultra-light mechanical design with four barrel layers and three end-cap disks, digital readout chip with higher rate capability and a new cooling system. In this document, we discuss the motivations for the upgrade, the design, and technological choices made, the status of the construction of the new detector and the future plans for the installation and commissioning.

  5. Review of results for the NA62 gigatracker read-out prototype

    NASA Astrophysics Data System (ADS)

    Martin, E.; Aglieri Rinella, G.; Carassiti, V.; Ceccucci, A.; Cortina Gil, E.; Cotta Ramusino, A.; Dellacasa, G.; Fiorini, M.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petagna, P.; Petrucci, F.; Perktold, L.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    2012-03-01

    The Gigatracker (GTK) is a hybrid silicon pixel detector developed for NA62, an experiment studying ultra-rare kaon decays at the CERN SPS. The main characteristics are a time-tagging resoluion of 150ps, with low material budget per station (0.5% X0) and a fluence comparable to the one expected for the inner trackers of LHC detectors in 10 years of operation. To compensate the time-walk, two read-out architectures have been designed and produced. The first architecture is based on a Constant Fraction Discriminator (CFD) followed by an on-pixel Time-to-Digital-Converter (TDC). The second architecture is based on a on-pixel group shared TDC. The GTK system developments are described: the integration steps (assembly and cooling) and the results obtained from the prototypes fabricated for the two read-out architectures.

  6. CMOS VLSI Active-Pixel Sensor for Tracking

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Sun, Chao; Yang, Guang; Heynssens, Julie

    2004-01-01

    An architecture for a proposed active-pixel sensor (APS) and a design to implement the architecture in a complementary metal oxide semiconductor (CMOS) very-large-scale integrated (VLSI) circuit provide for some advanced features that are expected to be especially desirable for tracking pointlike features of stars. The architecture would also make this APS suitable for robotic- vision and general pointing and tracking applications. CMOS imagers in general are well suited for pointing and tracking because they can be configured for random access to selected pixels and to provide readout from windows of interest within their fields of view. However, until now, the architectures of CMOS imagers have not supported multiwindow operation or low-noise data collection. Moreover, smearing and motion artifacts in collected images have made prior CMOS imagers unsuitable for tracking applications. The proposed CMOS imager (see figure) would include an array of 1,024 by 1,024 pixels containing high-performance photodiode-based APS circuitry. The pixel pitch would be 9 m. The operations of the pixel circuits would be sequenced and otherwise controlled by an on-chip timing and control block, which would enable the collection of image data, during a single frame period, from either the full frame (that is, all 1,024 1,024 pixels) or from within as many as 8 different arbitrarily placed windows as large as 8 by 8 pixels each. A typical prior CMOS APS operates in a row-at-a-time ( grolling-shutter h) readout mode, which gives rise to exposure skew. In contrast, the proposed APS would operate in a sample-first/readlater mode, suppressing rolling-shutter effects. In this mode, the analog readout signals from the pixels corresponding to the windows of the interest (which windows, in the star-tracking application, would presumably contain guide stars) would be sampled rapidly by routing them through a programmable diagonal switch array to an on-chip parallel analog memory array. The

  7. Selecting Pixels for Kepler Downlink

    NASA Technical Reports Server (NTRS)

    Bryson, Stephen T.; Jenkins, Jon M.; Klaus, Todd C.; Cote, Miles T.; Quintana, Elisa V.; Hall, Jennifer R.; Ibrahim, Khadeejah; Chandrasekaran, Hema; Caldwell, Douglas A.; Van Cleve, Jeffrey E.; hide

    2010-01-01

    The Kepler mission monitors > 100,000 stellar targets using 42 2200 1024 pixel CCDs. Bandwidth constraints prevent the downlink of all 96 million pixels per 30-minute cadence, so the Kepler spacecraft downlinks a specified collection of pixels for each target. These pixels are selected by considering the object brightness, background and the signal-to-noise of each pixel, and are optimized to maximize the signal-to-noise ratio of the target. This paper describes pixel selection, creation of spacecraft apertures that efficiently capture selected pixels, and aperture assignment to a target. Diagnostic apertures, short-cadence targets and custom specified shapes are discussed.

  8. The Belle II DEPFET pixel detector

    NASA Astrophysics Data System (ADS)

    Moser, Hans-Günther

    2016-09-01

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55-60) μm in the first layer and between 50 μm×(70-85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the 'internal gate' modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X0). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO2 system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  9. Tracking performance of a single-crystal and a polycrystalline diamond pixel-detector

    SciTech Connect

    Menasce, D.; et al.

    2013-06-01

    We present a comparative characterization of the performance of a single-crystal and a polycrystalline diamond pixel-detector employing the standard CMS pixel readout chips. Measurements were carried out at the Fermilab Test Beam Facility, FTBF, using protons of momentum 120 GeV/c tracked by a high-resolution pixel telescope. Particular attention was directed to the study of the charge-collection, the charge-sharing among adjacent pixels and the achievable position resolution. The performance of the single-crystal detector was excellent and comparable to the best available silicon pixel-detectors. The measured average detection-efficiency was near unity, ε = 0.99860±0.00006, and the position-resolution for shared hits was about 6 μm. On the other hand, the performance of the polycrystalline detector was hampered by its lower charge collection distance and the readout chip threshold. A new readout chip, capable of operating at much lower threshold (around 1 ke$-$), would be required to fully exploit the potential performance of the polycrystalline diamond pixel-detector.

  10. Recent progress in the development of a B-factory monolithic active pixel detector

    NASA Astrophysics Data System (ADS)

    Stanič, S.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Varner, G.; Yang, Q.

    2006-11-01

    Due to the need for precise vertexing at future higher luminosity B-factories with the expectedly increasing track densities and radiation exposures, upgrade of present silicon strip detectors with thin, radiation resistant pixel detectors is highly desired. Considerable progress in the technological development of thin CMOS based Monolithic Active Pixel Sensors (MAPS) in the last years makes them a realistic upgrade option and the feasibility studies of their application in Belle are actively pursued. The most serious concerns are their radiation hardness and their read-out speed. To address them, several prototypes denoted as Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25 μm process with a 5-deep sample pair pipeline in each pixel. A setup with several CAP3 sensors will be used to assess the performance of a full scale pixel read-out system running at realistic read-out speed. The results and plans for the next stages of R&D towards a full Pixel Vertex Detector (PVD) are presented.

  11. Silicon pixel detector prototyping in SOI CMOS technology

    NASA Astrophysics Data System (ADS)

    Dasgupta, Roma; Bugiel, Szymon; Idzik, Marek; Kapusta, Piotr; Kucewicz, Wojciech; Turala, Michal

    2016-12-01

    The Silicon-On-Insulator (SOI) CMOS is one of the most advanced and promising technology for monolithic pixel detectors design. The insulator layer that is implemented inside the silicon crystal allows to integrate sensors matrix and readout electronic on a single wafer. Moreover, the separation of electronic and substrate increases also the SOI circuits performance. The parasitic capacitances to substrate are significantly reduced, so the electronic systems are faster and consume much less power. The authors of this presentation are the members of international SOIPIX collaboration, that is developing SOI pixel detectors in 200 nm Lapis Fully-Depleted, Low-Leakage SOI CMOS. This work shows a set of advantages of SOI technology and presents possibilities for pixel detector design SOI CMOS. In particular, the preliminary results of a Cracow chip are presented.

  12. Planar pixel sensors for the ATLAS upgrade: beam tests results

    NASA Astrophysics Data System (ADS)

    Weingarten, J.; Altenheiner, S.; Beimforde, M.; Benoit, M.; Bomben, M.; Calderini, G.; Gallrapp, C.; George, M.; Gibson, S.; Grinstein, S.; Janoska, Z.; Jentzsch, J.; Jinnouchi, O.; Kishida, T.; La Rosa, A.; Libov, V.; Macchiolo, A.; Marchiori, G.; Muenstermann, D.; Nagai, R.; Piacquadio, G.; Ristic, B.; Rubinskiy, I.; Rummler, A.; Takubo, Y.; Troska, G.; Tsiskaridtze, S.; Tsurin, I.; Unno, Y.; Weigell, P.; Wittig, T.

    2012-10-01

    The performance of planar silicon pixel sensors, in development for the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades, has been examined in a series of beam tests at the CERN SPS facilities since 2009. Salient results are reported on the key parameters, including the spatial resolution, the charge collection and the charge sharing between adjacent cells, for different bulk materials and sensor geometries. Measurements are presented for n+-in-n pixel sensors irradiated with a range of fluences and for p-type silicon sensors with various layouts from different vendors. All tested sensors were connected via bump-bonding to the ATLAS Pixel read-out chip. The tests reveal that both n-type and p-type planar sensors are able to collect significant charge even after the lifetime fluence expected at the HL-LHC.

  13. The Phase-1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Klein, Katja

    2017-02-01

    The CMS experiment features a pixel detector with three barrel layers and two discs per side, corresponding to an active silicon area of 1 m2. The detector delivered high-quality data during LHC Run 1. However, the CMS pixel detector was designed for the nominal instantaneous LHC luminosity of 1 ·1034cm-2s-1 . It is expected that the instantaneous luminosity will increase and reach twice the design value before Long Shutdown 3, scheduled for 2023. Under such conditions, the present readout chip would suffer from data loss due to buffer overflow, leading to significant inefficiencies of up to 16%. The CMS collaboration is presently constructing a new pixel detector to replace the present device during the winter shutdown 2016/2017. The design of this new detector will be outlined, the construction status summarized and the performance described.

  14. Status and Plan for The Upgrade of The CMS Pixel Detector

    NASA Astrophysics Data System (ADS)

    Lu, Rong-Shyang; CMS Collaboration

    2016-04-01

    The silicon pixel detector is the innermost component of the CMS tracking system and plays a crucial role in the all-silicon CMS tracker. While the current pixel tracker is designed for and performing well at an instantaneous luminosity of up to 1 ×1034cm-2s-1, it can no longer be operated efficiently at significantly higher values. Based on the strong performance of the LHC accelerator, it is anticipated that peak luminosities of two times the design luminosity are likely to be reached before 2018 and perhaps significantly exceeded in the running period until 2022, referred to as LHC Run 3. Therefore, an upgraded pixel detector, referred to as the phase 1 upgrade, is planned for the year-end technical stop in 2016. With a new pixel readout chip (ROC), an additional fourth layer, two additional endcap disks, and a significantly reduced material budget the upgraded pixel detector will be able to sustain the efficiency of the pixel tracker at the increased requirements imposed by high luminosities and pile-up. The main new features of the upgraded pixel detector will be an ultra-light mechanical design, a digital readout chip with higher rate capability and a new cooling system. These and other design improvements, along with results of Monte Carlo simulation studies for the expected performance of the new pixel detector, will be discussed and compared to those of the current CMS detector.

  15. Challenges of small-pixel infrared detectors: a review

    NASA Astrophysics Data System (ADS)

    Rogalski, A.; Martyniuk, P.; Kopytko, M.

    2016-04-01

    In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology—HgCdTe material systems and III-V materials (mainly barrier detectors)—have been investigated.

  16. Fault tolerant photodiode and photogate active pixel sensors

    NASA Astrophysics Data System (ADS)

    Jung, Cory; Chapman, Glenn H.; La Haye, Michelle L.; Djaja, Sunjaya; Cheung, Desmond Y. H.; Lin, Henry; Loo, Edward; Audet, Yves R.

    2005-03-01

    As the pixel counts of digital imagers increase, the challenge of maintaining high yields and ensuring reliability over an imager"s lifetime increases. A fault tolerant active pixel sensor (APS) has been designed to meet this need by splitting an APS in half and operating both halves in parallel. The fault tolerant APS will perform normally in the no defect case and will produce approximately half the output for single defects. Thus, the entire signal can be recovered by multiplying the output by two. Since pixels containing multiple defects are rare, this design can correct for most defects allowing for higher production yields. Fault tolerant photodiode and photogate APS" were fabricated in 0.18-micron technology. Testing showed that the photodiode APS could correct for optically induced and electrically induced faults, within experimental error. The photogate APS was only tested for optically induced defects and also corrects for defects within experimental error. Further testing showed that the sensitivity of fault tolerant pixels was approximately 2-3 times more sensitive than the normal pixels. HSpice simulations of the fault tolerant APS circuit did not show increased sensitivity, however an equivalent normal APS circuit with twice width readout and row transistors was 1.90 times more sensitive than a normal pixel.

  17. Scintillator avalanche photoconductor with high resolution emitter readout for low dose x-ray imaging: lag.

    PubMed

    Lia, Dan; Zhao, Wei; Nanba, Masakazu; Egami, Norifomi

    2009-09-01

    procedure can be implemented by turning on all the FEA pixels simultaneously between subsequent frames without negative impact of readout speed. For large-area SAPHIRE, the bias electrode for the HARP needs to be divided into strips to allow parallel readout. With typical cardiac detector parameters, SAPHIRE with 128 parallel strips can provide real-time readout (30 frames/s) with first frame lag of -4%. The investigation of lag in SAPHIRE shows that the angular distribution of emitted electrons from FEA can result in substantial lag if the readout was performed pixel by pixel. Effective strategies for reducing lag include dividing the bias electrode into multiple strips to allow parallel readout and the incorporation of rapid charge clearance procedure between subsequent frames or rows.

  18. High-Resolution Mammography Detector Employing Optical Switching Readout

    NASA Astrophysics Data System (ADS)

    Irisawa, Kaku; Kaneko, Yasuhisa; Yamane, Katsutoshi; Sendai, Tomonari; Hosoi, Yuichi

    Conceiving a new detector structure, FUJIFILM Corporation has successfully put its invention of an X-ray detector employing "Optical Switching" into practical use. Since Optical Switching Technology allows an electrode structure to be easily designed, both high resolution of pixel pitch and low electrical noise readout have been achieved, which have consequently realized the world's smallest pixel size of 50×50 μm2 from a Direct-conversion FPD system as well as high DQE. The digital mammography system equipped with this detector enables to acquire high definition images while maintaining granularity. Its outstanding feature is to be able to acquire high-precision images of microcalcifications which is an important index in breast examination.

  19. Toward the Pixel-TPC: Construction and Operation of a Large Area GridPix Detector

    NASA Astrophysics Data System (ADS)

    Lupberger, Michael; Bilevych, Yevgen; Blank, Hubert; Danilov, Daniel; Desch, Klaus; Hamann, Alexander; Kaminski, Jochen; Ockenfels, Walter; Tomtschak, Johann; Zigann-Wack, Susanne

    2017-05-01

    We report on the construction of the largest GridPix detector to date and its successful operation as readout of a time projection chamber (TPC). By combining a charge sensitive pixelized readout chip with a micropattern gaseous detector, the GridPix features a high granularity with single electron detection and integrated signal processing. The readout structure consists of 160 GridPixes with a total of 10.5 million pixels, each of a size of 55 × 55 μm2. With a sensitive area of 320 cm2, it is a factor 20 larger than previously operated systems. We report on the integration of such a large number of GridPixes into a single compact detector, including cooling, readout electronics, and low-voltage and high-voltage power supply, and on the performance during a two weeks test beam campaign at DESY. The large area pixelated readout for gaseous detectors can be applied for different detectors. In our developments, we focused on an application for a TPC.

  20. GBT based readout in the CBM experiment

    NASA Astrophysics Data System (ADS)

    Lehnert, J.; Byszuk, A. P.; Emschermann, D.; Kasinski, K.; Müller, W. F. J.; Schmidt, C. J.; Szczygiel, R.; Zabolotny, W. M.

    2017-02-01

    The CBM experiment at FAIR will use GBTX and Versatile Link based readout systems for several of its subdetectors. The paper describes the GBT based readout concept in CBM, emphasizing the common features among systems. Particular choices and features of the readout are motivated mainly by the requirements in the readout of the silicon tracking system (STS). Common developments like a common CBM readout board are presented. The prototype board provides full GBT functionality for all systems, can be interfaced to various prototype readout chains and be refined for later detector specific versions.

  1. Focal plane infrared readout circuit

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor)

    2002-01-01

    An infrared imager, such as a spectrometer, includes multiple infrared photodetectors and readout circuits for reading out signals from the photodetectors. Each readout circuit includes a buffered direct injection input circuit including a differential amplifier with active feedback provided through an injection transistor. The differential amplifier includes a pair of input transistors, a pair of cascode transistors and a current mirror load. Photocurrent from a photodetector can be injected onto an integration capacitor in the readout circuit with high injection efficiency at high speed. A high speed, low noise, wide dynamic range linear infrared multiplexer array for reading out infrared detectors with large capacitances can be achieved even when short exposure times are used. The effect of image lag can be reduced.

  2. A novel JFET readout structure applicable for pinned and lateral drift-field photodiodes

    NASA Astrophysics Data System (ADS)

    Süss, Andreas; Hosticka, Bedrich J.

    2012-04-01

    Enhancement of the dynamic range of photodetectors used in advanced image sensors such as time-of-flight sensors or image sensors for automotive applications is a major research topic. In this paper an improved unipolar readout structure is presented, that is superior to the widely employed source follower readout implemented by enhancement MOSFETs. It yields a high output voltage swing and low noise, while requiring no additional processing steps. The readout structure is consisting of a low-noise JFET whose gates are formed by a floating diffusion, thus preserving in-pixel accumulation capability - which additionally improves noise performance. This structure outperforms a simple in-pixel implementation of a JFET and a photodetector in terms of the necessary area consumption, thus improving fill factor. For pixels with a pitch of several microns this readout structure is a good trade-off between area, output voltage swing and, most important, noise performance. Furthermore, since only a ground connection is needed for application, fill-factor and power-grid disturbances like DC-voltage drop can be additionally improved.

  3. Detection and Real Time Spectroscopy of Charged Particles with the TimePix Pixel Detector

    NASA Astrophysics Data System (ADS)

    Granja, Carlos; Jakubek, Jan; Platkevic, Michal; Pospisil, Stanislav; Vykydal, Zdenek

    2010-01-01

    We tested the position—, spectral— and time—resolution capability of the TimePix semiconductor detector together with the USB readout interface and Pixelman control and DAQ software tool for detection and visualization of particles. Event—by—event spectroscopy can be achieved by real time analysis of the characteristic tracks and specific response of different radiation in the pixel detector.

  4. Hybrid pixel-waveform CdTe/CZT detector for use in an ultrahigh resolution MRI compatible SPECT system.

    PubMed

    Cai, Liang; Meng, Ling-Jian

    2013-02-01

    In this paper, we will present a new small pixel CdTe/CZT detector for sub-500 μm resolution SPECT imaging application inside MR scanner based on a recently developed hybrid pixel-waveform (HPWF) readout circuitry. The HPWF readout system consists of a 2-D multi-pixel circuitry attached to the anode pixels to provide the X-Y positions of interactions, and a high-speed digitizer to read out the pulse-waveform induced on the cathode. The digitized cathode waveform could provide energy deposition information, precise timing and depth-of-interaction information for gamma ray interactions. Several attractive features with this HPWF detector system will be discussed in this paper. To demonstrate the performance, we constructed several prototype HPWF detectors with pixelated CZT and CdTe detectors of 2-5 mm thicknesses, connected to a prototype readout system consisting of energy-resolved photon-counting ASIC for readout anode pixels and an Agilent high-speed digitizer for digitizing the cathode signals. The performances of these detectors based on HPWF are discussed in this paper.

  5. Hybrid pixel-waveform CdTe/CZT detector for use in an ultrahigh resolution MRI compatible SPECT system

    PubMed Central

    Cai, Liang; Meng, Ling-Jian

    2013-01-01

    In this paper, we will present a new small pixel CdTe/CZT detector for sub-500 μm resolution SPECT imaging application inside MR scanner based on a recently developed hybrid pixel-waveform (HPWF) readout circuitry. The HPWF readout system consists of a 2-D multi-pixel circuitry attached to the anode pixels to provide the X–Y positions of interactions, and a high-speed digitizer to read out the pulse-waveform induced on the cathode. The digitized cathode waveform could provide energy deposition information, precise timing and depth-of-interaction information for gamma ray interactions. Several attractive features with this HPWF detector system will be discussed in this paper. To demonstrate the performance, we constructed several prototype HPWF detectors with pixelated CZT and CdTe detectors of 2–5 mm thicknesses, connected to a prototype readout system consisting of energy-resolved photon-counting ASIC for readout anode pixels and an Agilent high-speed digitizer for digitizing the cathode signals. The performances of these detectors based on HPWF are discussed in this paper. PMID:24371365

  6. Hybrid pixel-waveform CdTe/CZT detector for use in an ultrahigh resolution MRI compatible SPECT system

    NASA Astrophysics Data System (ADS)

    Cai, Liang; Meng, Ling-Jian

    2013-02-01

    In this paper, we will present a new small pixel CdTe/CZT detector for sub-500 μm resolution SPECT imaging application inside MR scanner based on a recently developed hybrid pixel-waveform (HPWF) readout circuitry. The HPWF readout system consists of a 2-D multi-pixel circuitry attached to the anode pixels to provide the X-Y positions of interactions, and a high-speed digitizer to read out the pulse-waveform induced on the cathode. The digitized cathode waveform could provide energy deposition information, precise timing and depth-of-interaction information for gamma ray interactions. Several attractive features with this HPWF detector system will be discussed in this paper. To demonstrate the performance, we constructed several prototype HPWF detectors with pixelated CZT and CdTe detectors of 2-5 mm thicknesses, connected to a prototype readout system consisting of energy-resolved photon-counting ASIC for readout anode pixels and an Agilent high-speed digitizer for digitizing the cathode signals. The performances of these detectors based on HPWF are discussed in this paper.

  7. Thermopile detector radiation hard readout

    NASA Astrophysics Data System (ADS)

    Gaalema, Stephen; Van Duyne, Stephen; Gates, James L.; Foote, Marc C.

    2010-08-01

    The NASA Jupiter Europa Orbiter (JEO) conceptual payload contains a thermal instrument with six different spectral bands ranging from 8μm to 100μm. The thermal instrument is based on multiple linear arrays of thermopile detectors that are intrinsically radiation hard; however, the thermopile CMOS readout needs to be hardened to tolerate the radiation sources of the JEO mission. Black Forest Engineering is developing a thermopile readout to tolerate the JEO mission radiation sources. The thermal instrument and ROIC process/design techniques are described to meet the JEO mission requirements.

  8. Linear readout of object manifolds

    NASA Astrophysics Data System (ADS)

    Chung, SueYeon; Lee, Daniel D.; Sompolinsky, Haim

    2016-06-01

    Objects are represented in sensory systems by continuous manifolds due to sensitivity of neuronal responses to changes in physical features such as location, orientation, and intensity. What makes certain sensory representations better suited for invariant decoding of objects by downstream networks? We present a theory that characterizes the ability of a linear readout network, the perceptron, to classify objects from variable neural responses. We show how the readout perceptron capacity depends on the dimensionality, size, and shape of the object manifolds in its input neural representation.

  9. Tests of CMS Phase 1 Pixel Upgrade Back-End Electronics

    NASA Astrophysics Data System (ADS)

    Kilpatrick, Matthew

    2016-03-01

    The CMS detector will be upgraded so that it can handle the higher instantaneous luminosity of the 13-14 TeV collisions. The Phase 1 Pixel detector will experience a higher density of particle interactions requiring new front-end and read-out electronics. A front-end pixel data emulator was developed to validate the back-end readout electronics prior to installation and operation. A FPGA-based design emulates 400 Mbps data patterns from the front-end read-out chips and will be used to confirm that each Front End Driver (FED) can correctly decode and process the expected data patterns and error conditions. A FED test bench using the emulator can produce LHC-like conditions for stress testing FED hardware, firmware and online software. The design of the emulator and initial test results will be reported.

  10. Side readout of long scintillation crystal elements with digital SiPM for TOF-DOI PET

    PubMed Central

    Yeom, Jung Yeol; Vinke, Ruud; Levin, Craig S.

    2014-01-01

    Purpose: Side readout of scintillation light from crystal elements in positron emission tomography (PET) is an alternative to conventional end-readout configurations, with the benefit of being able to provide accurate depth-of-interaction (DOI) information and good energy resolution while achieving excellent timing resolution required for time-of-flight PET. This paper explores different readout geometries of scintillation crystal elements with the goal of achieving a detector that simultaneously achieves excellent timing resolution, energy resolution, spatial resolution, and photon sensitivity. Methods: The performance of discrete LYSO scintillation elements of different lengths read out from the end/side with digital silicon photomultipliers (dSiPMs) has been assessed. Results: Compared to 3 × 3 × 20 mm3 LYSO crystals read out from their ends with a coincidence resolving time (CRT) of 162 ± 6 ps FWHM and saturated energy spectra, a side-readout configuration achieved an excellent CRT of 144 ± 2 ps FWHM after correcting for timing skews within the dSiPM and an energy resolution of 11.8% ± 0.2% without requiring energy saturation correction. Using a maximum likelihood estimation method on individual dSiPM pixel response that corresponds to different 511 keV photon interaction positions, the DOI resolution of this 3 × 3 × 20 mm3 crystal side-readout configuration was computed to be 0.8 mm FWHM with negligible artifacts at the crystal ends. On the other hand, with smaller 3 × 3 × 5 mm3 LYSO crystals that can also be tiled/stacked to provide DOI information, a timing resolution of 134 ± 6 ps was attained but produced highly saturated energy spectra. Conclusions: The energy, timing, and DOI resolution information extracted from the side of long scintillation crystal elements coupled to dSiPM have been acquired for the first time. The authors conclude in this proof of concept study that such detector configuration has the potential to enable outstanding

  11. Side readout of long scintillation crystal elements with digital SiPM for TOF-DOI PET.

    PubMed

    Yeom, Jung Yeol; Vinke, Ruud; Levin, Craig S

    2014-12-01

    Side readout of scintillation light from crystal elements in positron emission tomography (PET) is an alternative to conventional end-readout configurations, with the benefit of being able to provide accurate depth-of-interaction (DOI) information and good energy resolution while achieving excellent timing resolution required for time-of-flight PET. This paper explores different readout geometries of scintillation crystal elements with the goal of achieving a detector that simultaneously achieves excellent timing resolution, energy resolution, spatial resolution, and photon sensitivity. The performance of discrete LYSO scintillation elements of different lengths read out from the end/side with digital silicon photomultipliers (dSiPMs) has been assessed. Compared to 3 × 3 × 20 mm(3) LYSO crystals read out from their ends with a coincidence resolving time (CRT) of 162 ± 6 ps FWHM and saturated energy spectra, a side-readout configuration achieved an excellent CRT of 144 ± 2 ps FWHM after correcting for timing skews within the dSiPM and an energy resolution of 11.8% ± 0.2% without requiring energy saturation correction. Using a maximum likelihood estimation method on individual dSiPM pixel response that corresponds to different 511 keV photon interaction positions, the DOI resolution of this 3 × 3 × 20 mm(3) crystal side-readout configuration was computed to be 0.8 mm FWHM with negligible artifacts at the crystal ends. On the other hand, with smaller 3 × 3 × 5 mm(3) LYSO crystals that can also be tiled/stacked to provide DOI information, a timing resolution of 134 ± 6 ps was attained but produced highly saturated energy spectra. The energy, timing, and DOI resolution information extracted from the side of long scintillation crystal elements coupled to dSiPM have been acquired for the first time. The authors conclude in this proof of concept study that such detector configuration has the potential to enable outstanding detector performance in terms of timing

  12. Automated procedures for the assembly of the CMS Phase 1 upgrade pixel modules

    NASA Astrophysics Data System (ADS)

    Wade, Alex; CMS Collaboration

    2016-03-01

    The Phase 1 upgrade of the pixel tracker for the CMS experiment requires the assembly of approximately 1000 modules consisting of pixel sensors bump bonded to readout chips. The precision assembly of modules in this volume is made possible using several robotic processes for dispensing epoxy,positioning of sensor components, automatic wire-bonding and robotic deposition of elastomer for wire bond encapsulation. We will describe the these processes in detail, along with the measurements that quanitfy the quality of assembled modules, and describe the subsequent steps in which the sensor modules are used in the construction of the Phase 1 pixel tracker. With support from USCMS.

  13. Development of planar pixel modules for the ATLAS high luminosity LHC tracker upgrade

    NASA Astrophysics Data System (ADS)

    Allport, P. P.; Ashby, J.; Bates, R. L.; Blue, A.; Burdin, S.; Buttar, C. M.; Casse, G.; Dervan, P.; Doonan, K.; Forshaw, D.; Lipp, J.; McMullen, T.; Pater, J.; Stewart, A.; Tsurin, I.

    2014-11-01

    The high-luminosity LHC will present significant challenges for tracking systems. ATLAS is preparing to upgrade the entire tracking system, which will include a significantly larger pixel detector. This paper reports on the development of large area planar detectors for the outer pixel layers and the pixel endcaps. Large area sensors have been fabricated and mounted onto 4 FE-I4 readout ASICs, the so-called quad-modules, and their performance evaluated in the laboratory and testbeam. Results from characterisation of sensors prior to assembly, experience with module assembly, including bump-bonding and results from laboratory and testbeam studies are presented.

  14. Low-noise readout circuit for SWIR focal plane arrays

    NASA Astrophysics Data System (ADS)

    Altun, Oguz; Tasdemir, Ferhat; Nuzumlali, Omer Lutfi; Kepenek, Reha; Inceturkmen, Ercihan; Akyurek, Fatih; Tunca, Can; Akbulut, Mehmet

    2017-02-01

    This paper reports a 640x512 SWIR ROIC with 15um pixel pitch that is designed and fabricated using 0.18um CMOS process. Main challenge of SWIR ROIC design is related to input circuit due to pixel area and noise limitations. In this design, CTIA with single stage amplifier is utilized as input stage. The pixel design has three pixel gain options; High Gain (HG), Medium Gain (MG), and Low Gain (LG) with corresponding Full-Well-Capacities of 18.7ké, 190ké and 1.56Mé, respectively. According to extracted simulation results, 5.9é noise is achieved at HG mode and 200é is achieved at LG mode of operation. The ROIC can be programmed through an SPI interface. It supports 1, 2 and 4 output modes which enables the user to configure the detector to work at 30, 60 and 120fps frame rates. In the 4 output mode, the total power consumption of the ROIC is less than 120mW. The ROIC is powered from a 3.3V analog supply and allows for an output swing range in excess of 2V. Anti-blooming feature is added to prevent any unwanted blooming effect during readout.

  15. A PFM-based MWIR DROIC employing off-pixel fine conversion of photocharge to digital using integrated column ADCs

    NASA Astrophysics Data System (ADS)

    Abbasi, S.; Galioglu, A.; Shafique, A.; Ceylan, O.; Yazici, M.; Gurbuz, Y.

    2017-02-01

    A 32x32 prototype of a digital readout IC (DROIC) for medium-wave infrared focal plane arrays (MWIR IR-FPAs) is presented. The DROIC employs in-pixel photocurrent to digital conversion based on a pulse frequency modulation (PFM) loop and boasts a novel feature of off-pixel residue conversion using 10-bit column SAR ADCs. The remaining charge at the end of integration in typical PFM based digital pixel sensors is usually wasted. Previous works employing in-pixel extended counting methods make use of extra memory and counters to convert this left-over charge to digital, thereby performing fine conversion of the incident photocurrent. This results in a low quantization noise and hence keeps the readout noise low. However, focal plane arrays (FPAs) with small pixel pitch are constrained in pixel area, which makes it difficult to benefit from in-pixel extended counting circuitry. Thus, in this work, a novel approach to measure the residue outside the pixel using column -parallel SAR ADCs has been proposed. Moreover, a modified version of the conventional PFM based pixel has been designed to help hold the residue charge and buffer it to the column ADC. In addition to the 2D array of pixels, the prototype consists of 32 SAR ADCs, a timing controller block and a memory block to buffer the residue data coming out of the ADCs. The prototype has been designed and fabricated in 90nm CMOS.

  16. Further applications for mosaic pixel FPA technology

    NASA Astrophysics Data System (ADS)

    Liddiard, Kevin C.

    2011-06-01

    In previous papers to this SPIE forum the development of novel technology for next generation PIR security sensors has been described. This technology combines the mosaic pixel FPA concept with low cost optics and purpose-designed readout electronics to provide a higher performance and affordable alternative to current PIR sensor technology, including an imaging capability. Progressive development has resulted in increased performance and transition from conventional microbolometer fabrication to manufacture on 8 or 12 inch CMOS/MEMS fabrication lines. A number of spin-off applications have been identified. In this paper two specific applications are highlighted: high performance imaging IRFPA design and forest fire detection. The former involves optional design for small pixel high performance imaging. The latter involves cheap expendable sensors which can detect approaching fire fronts and send alarms with positional data via mobile phone or satellite link. We also introduce to this SPIE forum the application of microbolometer IR sensor technology to IoT, the Internet of Things.

  17. The Phase1 CMS Pixel detector upgrade

    NASA Astrophysics Data System (ADS)

    Tavolaro, V. R.

    2016-12-01

    The pixel detector of the CMS experiment will be replaced in an extended end-of-year shutdown during winter 2016/2017 with an upgraded one able to cope with peak instantaneous luminosities beyond the nominal LHC instantaneous luminosity of 1 × 1034 cm-2 s-1. Under the conditions expected in the coming years, which will see an increase of a factor two in instantaneous luminosity, the present system would experience a dynamic inefficiency caused mainly by data losses due to buffer overflows. The Phase I upgrade of the CMS pixel detector, described in this paper, will operate at full efficiency at an instantaneous luminosity of 2 × 1034 cm-2 s-1 and beyond, thanks to a new readout chip. The new detector will feature one additional tracking point both in the barrel and in the forward regions, while reducing the material budget as a result of a new CO2 cooling system and optimised layout of the services. In this paper, the design and the technological choices of the Phase I detector will be reviewed and the status of the construction of the detector and the performance of its components will be discussed.

  18. Impact of defective pixels in AMLCDs on the perception of medical images

    NASA Astrophysics Data System (ADS)

    Kimpe, Tom; Sneyders, Yuri

    2006-03-01

    With LCD displays, each pixel has its own individual transistor that controls the transmittance of that pixel. Occasionally, these individual transistors will short or alternatively malfunction, resulting in a defective pixel that always shows the same brightness. With ever increasing resolution of displays the number of defect pixels per display increases accordingly. State of the art processes are capable of producing displays with no more than one faulty transistor out of 3 million. A five Mega Pixel medical LCD panel contains 15 million individual sub pixels (3 sub pixels per pixel), each having an individual transistor. This means that a five Mega Pixel display on average will have 5 failing pixels. This paper investigates the visibility of defective pixels and analyzes the possible impact of defective pixels on the perception of medical images. JND simulations were done to study the effect of defective pixels on medical images. Our results indicate that defective LCD pixels can mask subtle features in medical images in an unexpectedly broad area around the defect and therefore may reduce the quality of diagnosis for specific high-demanding areas such as mammography. As a second contribution an innovative solution is proposed. A specialized image processing algorithm can make defective pixels completely invisible and moreover can also recover the information of the defect so that the radiologist perceives the medical image correctly. This correction algorithm has been validated with both JND simulations and psycho visual tests.

  19. Orthogonal sequencing multiplexer for superconducting nanowire single-photon detectors with RSFQ electronics readout circuit.

    PubMed

    Hofherr, Matthias; Wetzstein, Olaf; Engert, Sonja; Ortlepp, Thomas; Berg, Benjamin; Ilin, Konstantin; Henrich, Dagmar; Stolz, Ronny; Toepfer, Hannes; Meyer, Hans-Georg; Siegel, Michael

    2012-12-17

    We propose an efficient multiplexing technique for superconducting nanowire single-photon detectors based on an orthogonal detector bias switching method enabling the extraction of the average count rate of a set of detectors by one readout line. We implemented a system prototype where the SNSPDs are connected to an integrated cryogenic readout and a pulse merger system based on rapid single flux quantum (RSFQ) electronics. We discuss the general scalability of this concept, analyze the environmental requirements which define the resolvability and the accuracy and demonstrate the feasibility of this approach with experimental results for a SNSPD array with four pixels.

  20. Pixel-to-Pixel Flat Field Changes on the WFC

    NASA Astrophysics Data System (ADS)

    Gilliland, R. L.; Bohlin, R.

    2007-01-01

    The pixel-to-pixel flat field changes noted by Bohlin and Mack (2005) for the WFC are further quantified. During each period between anneals, a population of pixels with lowered sensitivity develops which is largely reset by the next anneal. The sensitivity deficits are twice as large in the blue as in the red. The pixels with lowered sensitivity appear to be a unique set each anneal cycle, rather than a subset that ‘telegraph’ on and off. The low QE pixels recover 90% of their losses on a time scale of a few monthly anneals, but never return fully. Some evidence for spontaneous recovery of the low QE pixels between anneal cycles is developed, but is not conclusive. The number of low pixels would become a large source of error in the absence of performing anneals on a frequent basis. Prior to cooldown in July 2006, the flat field changes that arise continuously within anneal cycles are larger than cumulative persistent changes in the pixel-to-pixel flats. The pre-cooldown reference flat field remained excellent. Post-cooldown, the number of persistent deviant pixels, although still modest in number, may have reached a level justifying delivery of new pixel-to-pixel flats, although providing such will require acquisition of further data.

  1. Nonlinear Pixel Replacement Estimation.

    DTIC Science & Technology

    1986-04-01

    Systems Command _________ _______________________ _____ 6e ADDRESS IC,,, Sra,. and ZIP Co~ de , 10 SOURCE Of FUNDING NUMBERS% RORMELEMENT NO PROJECT NO... de - scribed, this method does not replace array elements with computed values, but rather replaces them with one of the nine original pixel values. The...8217, gmx . NOISE PStd dev=’. sd call exit end include ’mathfunc For/nolist’ C-9 c biweighted 3xZ3 filter compute weighted mean from input iara subroutine

  2. Pooled CRISPR screening with single-cell transcriptome readout.

    PubMed

    Datlinger, Paul; Rendeiro, André F; Schmidl, Christian; Krausgruber, Thomas; Traxler, Peter; Klughammer, Johanna; Schuster, Linda C; Kuchler, Amelie; Alpar, Donat; Bock, Christoph

    2017-03-01

    CRISPR-based genetic screens are accelerating biological discovery, but current methods have inherent limitations. Widely used pooled screens are restricted to simple readouts including cell proliferation and sortable marker proteins. Arrayed screens allow for comprehensive molecular readouts such as transcriptome profiling, but at much lower throughput. Here we combine pooled CRISPR screening with single-cell RNA sequencing into a broadly applicable workflow, directly linking guide RNA expression to transcriptome responses in thousands of individual cells. Our method for CRISPR droplet sequencing (CROP-seq) enables pooled CRISPR screens with single-cell transcriptome resolution, which will facilitate high-throughput functional dissection of complex regulatory mechanisms and heterogeneous cell populations.

  3. Demonstration of Time Domain Multiplexed Readout for Magnetically Coupled Calorimeters

    NASA Technical Reports Server (NTRS)

    Porst, J.-P.; Adams, J. S.; Balvin, M.; Bandler, S.; Beyer, J.; Busch, S. E.; Drung, D.; Seidel, G. M.; Smith, S. J.; Stevenson, T. R.

    2012-01-01

    Magnetically coupled calorimeters (MCC) have extremely high potential for x-ray applications due to the inherent high energy resolution capability and being non-dissipative. Although very high energy-resolution has been demonstrated, until now there has been no demonstration of multiplexed read-out. We report on the first realization of a time domain multiplexed (TDM) read-out. While this has many similarities with TDM of transition-edge-sensors (TES), for MGGs the energy resolution is limited by the SQUID read-out noise and requires the well established scheme to be altered in order to minimize degradation due to noise aliasing effects. In cur approach, each pixel is read out by a single first stage SQUID (SQ1) that is operated in open loop. The outputs of the SQ1 s are low-pass filtered with an array of low cross-talk inductors, then fed into a single-stage SQUID TD multiplexer. The multiplexer is addressed from room temperature and read out through a single amplifier channel. We present results achieved with a new detector platform. Noise performance is presented and compared to expectations. We have demonstrated multiplexed X-ray spectroscopy at 5.9keV with delta_FWHM=10eV. In an optimized setup, we show it is possible to multiplex 32 detectors without significantly degrading the Intrinsic detector resolution.

  4. Denoising Algorithm for the Pixel-Response Non-Uniformity Correction of a Scientific CMOS Under Low Light Conditions

    NASA Astrophysics Data System (ADS)

    Hu, Changmiao; Bai, Yang; Tang, Ping

    2016-06-01

    We present a denoising algorithm for the pixel-response non-uniformity correction of a scientific complementary metal-oxide-semiconductor (CMOS) image sensor, which captures images under extremely low-light conditions. By analyzing the integrating sphere experimental data, we present a pixel-by-pixel flat-field denoising algorithm to remove this fixed pattern noise, which occur in low-light conditions and high pixel response readouts. The response of the CMOS image sensor imaging system to the uniform radiance field shows a high level of spatial uniformity after the denoising algorithm has been applied.

  5. Spatial Pileup Considerations for Pixellated Gamma -ray Detectors

    PubMed Central

    Furenlid, L.R.; Clarkson, E.; Marks, D.G.; Barrett, H.H.

    2015-01-01

    High-spatial-resolution solid-state detectors being developed for gamma-ray applications benefit from having pixel dimensions substantially smaller than detector slab thickness. This leads to an enhanced possibility of charge partially spreading to neighboring pixels as a result of diffusion (and secondary photon emission) transverse to the drift direction. An undesirable consequence is the effective magnification of the event “size“ and the spatial overlap issues which result when two photons are absorbed in close proximity within the integration time of the detector/readout system. In this work, we develop the general statistics of spatial pileup in imaging systems and apply the results to detectors we are developing based on pixellated cadmium zinc telluride (CdZnTe) and a multiplexing application-specific integrated circuit (ASIC) readout. We consider the limitations imposed on total count rate capacity and explore in detail the consequences for the LISTMODE data-acquisition strategy. Algorithms are proposed for identifying and, where possible, resolving overlapping events by maximum-likelihood estimation. The efficacy and noise tolerance of these algorithms will be tested with a combination of simulated and experimental data in future work. PMID:26568675

  6. Development of Kilo-Pixel Arrays of Transition-Edge Sensors for X-Ray Spectroscopy

    NASA Technical Reports Server (NTRS)

    Adams, J. S.; Bandler, S. R.; Busch, S. E.; Chervenak, J. A.; Chiao, M. P.; Eckart, M. E.; Ewin, A. J.; Finkbeiner, F. M.; Kelley, R. L.; Kelly, D. P.; hide

    2012-01-01

    We are developing kilo-pixel arrays of transition-edge sensor (TES) microcalorimeters for future X-ray astronomy observatories or for use in laboratory astrophysics applications. For example, Athena/XMS (currently under study by the european space agency) would require a close-packed 32x32 pixel array on a 250-micron pitch with < 3.0 eV full-width-half-maximum energy resolution at 6 keV and at count-rates of up to 50 counts/pixel/second. We present characterization of 32x32 arrays. These detectors will be readout using state of the art SQUID based time-domain multiplexing (TDM). We will also present the latest results in integrating these detectors and the TDM readout technology into a 16 row x N column field-able instrument.

  7. High Dynamic Range X-Ray Detector Pixel Architectures Utilizing Charge Removal

    NASA Astrophysics Data System (ADS)

    Weiss, Joel T.; Shanks, Katherine S.; Philipp, Hugh T.; Becker, Julian; Chamberlain, Darol; Purohit, Prafull; Tate, Mark W.; Gruner, Sol M.

    2017-04-01

    Several charge integrating CMOS pixel front-ends utilizing charge removal techniques have been fabricated to extend dynamic range for x-ray diffraction applications at synchrotron sources and x-ray free electron lasers (XFELs). The pixels described herein build on the Mixed Mode Pixel Array Detector (MM-PAD) framework, developed previously by our group to perform high dynamic range imaging. These new pixels boast several orders of magnitude improvement in maximum flux over the MM-PAD, which is capable of measuring a sustained flux in excess of 10$^{8}$ x-rays/pixel/second while maintaining sensitivity to smaller signals, down to single x-rays. To extend dynamic range, charge is removed from the integration node of the front-end amplifier without interrupting integration. The number of times this process occurs is recorded by a digital counter in the pixel. The parameter limiting full well is thereby shifted from the size of an integration capacitor to the depth of a digital counter. The result is similar to that achieved by counting pixel array detectors, but the integrators presented here are designed to tolerate a sustained flux >10$^{11}$ x-rays/pixel/second. Pixel front-end linearity was evaluated by direct current injection and results are presented. A small-scale readout ASIC utilizing these pixel architectures has been fabricated and the use of these architectures to increase single x-ray pulse dynamic range at XFELs is discussed briefly.

  8. Software Implementation for the Characterization of Silicon Pixel Detectors

    NASA Astrophysics Data System (ADS)

    Miller, Kyle; Eusebi, Ricardo

    2011-10-01

    Pixel and Silicon-strip detectors are now a fundamental component for the detection, identification, and characterization of particles in nuclear and particle physics. They are used for beam diagnostics, for measurements of energy lost by electrons, for full-energy measurements of alphas and protons and heavy nuclei. The pixel and strip detectors are usually the most complex, sensitive, and expensive system in multi-million dollar detectors such as the ones in the Relativistic Heavy Ion Collider at Brookhaven. This poster describes the development of a characterization station for pixel and strip detectors in clean room at Texas A&M University. As a first step we describe the quantities to be measured for a full characterization of the pixel sensor, the identification of the needed electronic circuitry and the logic behind the control and readout of the system as a whole. The second stage shows the analysis of the obtained results from a set of next-generation radiation-hard pixel sensors. REU student from Florida A&M University.

  9. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    NASA Astrophysics Data System (ADS)

    Dobos, Daniel

    2016-07-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to the surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer, a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. An overview of the refurbishing of the Pixel Detector and of the IBL project as well as early performance tests using cosmic rays and beam data will be presented.

  10. Vivid, full-color aluminum plasmonic pixels

    PubMed Central

    Olson, Jana; Manjavacas, Alejandro; Liu, Lifei; Chang, Wei-Shun; Foerster, Benjamin; King, Nicholas S.; Knight, Mark W.; Nordlander, Peter; Halas, Naomi J.; Link, Stephan

    2014-01-01

    Aluminum is abundant, low in cost, compatible with complementary metal-oxide semiconductor manufacturing methods, and capable of supporting tunable plasmon resonance structures that span the entire visible spectrum. However, the use of Al for color displays has been limited by its intrinsically broad spectral features. Here we show that vivid, highly polarized, and broadly tunable color pixels can be produced from periodic patterns of oriented Al nanorods. Whereas the nanorod longitudinal plasmon resonance is largely responsible for pixel color, far-field diffractive coupling is used to narrow the plasmon linewidth, enabling monochromatic coloration and significantly enhancing the far-field scattering intensity of the individual nanorod elements. The bright coloration can be observed with p-polarized white light excitation, consistent with the use of this approach in display devices. The resulting color pixels are constructed with a simple design, are compatible with scalable fabrication methods, and provide contrast ratios exceeding 100:1. PMID:25225385

  11. The ALICE Pixel Detector

    NASA Astrophysics Data System (ADS)

    Mercado-Perez, Jorge

    2002-07-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well.

  12. The TDCpix Readout ASIC: A 75 ps Resolution Timing Front-End for the Gigatrackerof theNA62 Experiment

    NASA Astrophysics Data System (ADS)

    Rinella, G. Aglieri; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

    NA62 is an experiment under development at the CERN Super Proton Synchrotron, aiming at measuring ultra rare kaon decays. The Gigatracker (GTK) detector shall combine on-beam tracking of individual particles with a time resolution of 150 ps rms. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm2 fora total rateof about 0.75 GHz.Ahybrid siliconpixel detectoris beingdevelopedto meet these requirements. The pixel chip for the Gigatracker (TDCpix) is under design. The TDCpix chip will feature 1800 square pixels of 300×300 μm2 arranged in a matrix of 45 rows × 40 columns. Bump-bonded to a silicon pixel sensor it shall perform time stamping of particle hits with a timing accuracybetter than 200 ps rms and a detection efficiencyabove 99%. The chosen architecture provides full separation of the sensitive analog amplifiers of the pixel matrix from the noisy digital circuits of the TDCs and of the readout blocks. Discriminated hit signals from each pixel are transmitted to the end of column region. An array ofTime to Digital Converters (TDC) is implemented at the bottom of the pixel array. The TDCs are based on time tagging the events with the fine time codes generated by Delay Locked Loops (DLL) and have a nominal time bin of ˜100 ps. Time stamps and time-over-threshold are recorded for each discriminated hit and the correction of the discriminator's time-walk is performed off-detector. Data are continuously transmitted on four 2.4 Gb/s serial output links. Adescription of the on-going design of the final TDCpix is given in this paper. Design choices and some technical implementation details are presented. Aprototype ASIC including thekeycomponents of this architecture has been manufactured. The achievement of specification figures such as a time resolution of the processing chain of 75 ps rms as well as charged particle time stampingwitha resolutionbetterthan200psrmswere demonstratedexperimentally.Asummaryoftheseresultsisalso presented in

  13. Smart pixel imaging with computational-imaging arrays

    NASA Astrophysics Data System (ADS)

    Fernandez-Cull, Christy; Tyrrell, Brian M.; D'Onofrio, Richard; Bolstad, Andrew; Lin, Joseph; Little, Jeffrey W.; Blackwell, Megan; Renzi, Matthew; Kelly, Mike

    2014-07-01

    Smart pixel imaging with computational-imaging arrays (SPICA) transfers image plane coding typically realized in the optical architecture to the digital domain of the focal plane array, thereby minimizing signal-to-noise losses associated with static filters or apertures and inherent diffraction concerns. MIT Lincoln Laboratory has been developing digitalpixel focal plane array (DFPA) devices for many years. In this work, we leverage legacy designs modified with new features to realize a computational imaging array (CIA) with advanced pixel-processing capabilities. We briefly review the use of DFPAs for on-chip background removal and image plane filtering. We focus on two digital readout integrated circuits (DROICS) as CIAs for two-dimensional (2D) transient target tracking and three-dimensional (3D) transient target estimation using per-pixel coded-apertures or flutter shutters. This paper describes two DROICs - a SWIR pixelprocessing imager (SWIR-PPI) and a Visible CIA (VISCIA). SWIR-PPI is a DROIC with a 1 kHz global frame rate with a maximum per-pixel shuttering rate of 100 MHz, such that each pixel can be modulated by a time-varying, pseudorandom, and duo-binary signal (+1,-1,0). Combining per-pixel time-domain coding and processing enables 3D (x,y,t) target estimation with limited loss of spatial resolution. We evaluate structured and pseudo-random encoding strategies and employ linear inversion and non-linear inversion using total-variation minimization to estimate a 3D data cube from a single 2D temporally-encoded measurement. The VISCIA DROIC, while low-resolution, has a 6 kHz global frame rate and simultaneously encodes eight periodic or aperiodic transient target signatures at a maximum rate of 50 MHz using eight 8-bit counters. By transferring pixel-based image plane coding to the DROIC and utilizing sophisticated processing, our CIAs enable on-chip temporal super-resolution.

  14. CMOS in-pixel optical pulse frequency modulator

    NASA Astrophysics Data System (ADS)

    Nel, Nicolaas E.; du Plessis, M.; Joubert, T.-H.

    2016-02-01

    This paper covers the design of a complementary metal oxide semiconductor (CMOS) pixel readout circuit with a built-in frequency conversion feature. The pixel contains a CMOS photo sensor along with all signal-to-frequency conversion circuitry. An 8×8 array of these pixels is also designed. Current imaging arrays often use analog-to-digital conversion (ADC) and digital signal processing (DSP) techniques that are off-chip1. The frequency modulation technique investigated in this paper is preferred over other ADC techniques due to its smaller size, and the possibility of a higher dynamic range. Careful considerations are made regarding the size of the components of the pixel, as various characteristics of CMOS devices are limited by decreasing the scale of the components2. The methodology used was the CMOS design cycle for integrated circuit design. All components of the pixel were designed from first principles to meet necessary requirements of a small pixel size (30×30 μm2) and an output resolution greater than that of an 8-bit ADC. For the photodetector, an n+-p+/p-substrate diode was designed with a parasitic capacitance of 3 fF. The analog front-end stage was designed around a Schmitt trigger circuit. The photo current is integrated on an integration capacitor of 200 fF, which is reset when the Schmitt trigger output voltage exceeds a preset threshold. The circuit schematic and layout were designed using Cadence Virtuoso and the process used was the AMS CMOS 350 nm process using a power supply of 5V. The simulation results were confirmed to comply with specifications, and the layout passed all verification checks. The dynamic range achieved is 58.828 dB per pixel, with the output frequencies ranging from 12.341kHz to 10.783 MHz. It is also confirmed that the output frequency has a linear relationship to the photocurrent generated by the photodiode.

  15. Thin hybrid pixel assembly with backside compensation layer on ROIC

    NASA Astrophysics Data System (ADS)

    Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Gray, C.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

    2017-01-01

    The entire ATLAS inner tracking system will be replaced for operation at the HL-LHC . This will include a significantly larger pixel detector of approximately 15 m2. For this project, it is critical to reduce the mass of the hybrid pixel modules and this requires thinning both the sensor and readout chips to about 150 micrometres each. The thinning of the silicon chips leads to low bump yield for SnAg bumps due to bad co-planarity of the two chips at the solder reflow stage creating dead zones within the pixel array. In the case of the ATLAS FEI4 pixel readout chip thinned to 100 micrometres, the chip is concave, with the front side in compression, with a bow of +100 micrometres at room temperature which varies to a bow of -175 micrometres at the SnAg solder reflow temperature, caused by the CTE mismatch between the materials in the CMOS stack and the silicon substrate. A new wafer level process to address the issue of low bump yield be controlling the chip bow has been developed. A back-side dielectric and metal stack of SiN and Al:Si has been deposited on the readout chip wafer to dynamically compensate the stress of the front side stack. In keeping with a 3D process the materials used are compatible with Through Silicon Via (TSV) technology with a TSV last approach which is under development for this chip. It is demonstrated that the amplitude of the correction can be manipulated by the deposition conditions and thickness of the SiN/Al:Si stack. The bow magnitude over the temperature range for the best sample to date is reduced by almost a factor of 4 and the sign of the bow (shape of the die) remains constant. Further development of the backside deposition conditions is on-going with the target of close to zero bow at the solder reflow temperature and a minimal bow magnitude throughout the temperature range. Assemblies produced from FEI4 readout wafers thinned to 100 micrometres with the backside compensation layer have been made for the first time and

  16. The Phase-II ATLAS ITk pixel upgrade

    NASA Astrophysics Data System (ADS)

    Terzo, S.

    2017-07-01

    The entire tracking system of the ATLAS experiment will be replaced during the LHC Phase-II shutdown (foreseen to take place around 2025) by an all-silicon detector called the ``ITk'' (Inner Tracker). The innermost portion of ITk will consist of a pixel detector with five layers in the barrel region and ring-shaped supports in the end-cap regions. It will be instrumented with new sensor and readout electronics technologies to improve the tracking performance and cope with the HL-LHC environment, which will be severe in terms of occupancy and radiation levels. The new pixel system could include up to 14 m2 of silicon, depending on the final layout, which is expected to be decided in 2017. Several layout options are being investigated at the moment, including some with novel inclined support structures in the barrel end-cap overlap region and others with very long innermost barrel layers. Forward coverage could be as high as |eta| <4. Supporting structures will be based on low mass, highly stable and highly thermally conductive carbon-based materials cooled by evaporative carbon dioxide circulated in thin-walled titanium pipes embedded in the structures. Planar, 3D, and CMOS sensors are being investigated to identify the optimal technology, which may be different for the various layers. The RD53 Collaboration is developing the new readout chip. The pixel off-detector readout electronics will be implemented in the framework of the general ATLAS trigger and DAQ system. A readout speed of up to 5 Gb/s per data link will be needed in the innermost layers going down to 640 Mb/s for the outermost. Because of the very high radiation level inside the detector, the first part of the transmission has to be implemented electrically, with signals converted for optical transmission at larger radii. Extensive tests are being carried out to prove the feasibility of implementing serial powering, which has been chosen as the baseline for the ITk pixel system due to the reduced

  17. Position-Sensitive Nuclear Spectroscopy with Pixel Detectors

    SciTech Connect

    Granja, Carlos; Vykydal, Zdenek; Jakubek, Jan; Pospisil, Stanislav

    2007-10-26

    State-of-the-art hybrid semiconductor pixel detectors such as Medipix2 are suitable for energy- and position-sensitive nuclear spectroscopy. In addition to excellent energy- and spatial-resolution, these devices can operate in spectroscopic, single-quantum counting and/or on-line tracking mode. A devoted compact USB-readout interface provides functionality and ease of operation. The compact and versatile Medipix2/USB radiation camera provides visualization, vacuum and room-temperature operation as a real-time portable active nuclear emulsion.

  18. Analog pixel array detectors.

    PubMed

    Ercan, A; Tate, M W; Gruner, S M

    2006-03-01

    X-ray pixel array detectors (PADs) are generally thought of as either digital photon counters (DPADs) or X-ray analog-integrating pixel array detectors (APADs). Experiences with APADs, which are especially well suited for X-ray imaging experiments where transient or high instantaneous flux events must be recorded, are reported. The design, characterization and experimental applications of several APAD designs developed at Cornell University are discussed. The simplest design is a ;flash' architecture, wherein successive integrated X-ray images, as short as several hundred nanoseconds in duration, are stored in the detector chips for later off-chip digitization. Radiography experiments using a prototype flash APAD are summarized. Another design has been implemented that combines flash capability with the ability to continuously stream X-ray images at slower (e.g. milliseconds) rates. Progress is described towards radiation-hardened APADs that can be tiled to cover a large area. A mixed-mode PAD, design by combining many of the attractive features of both APADs and DPADs, is also described.

  19. Design and Optimization of Multi-Pixel Transition-Edge Sensors for X-Ray Astronomy Applications

    NASA Technical Reports Server (NTRS)

    Smith, Stephen J.; Adams, Joseph S.; Bandler, Simon R.; Chervenak, James A.; Datesman, Aaron Michael; Eckart, Megan E.; Ewin, Audrey J.; Finkbeiner, Fred M.; Kelley, Richard L.; Kilbourne, Caroline A.; hide

    2017-01-01

    Multi-pixel transition-edge sensors (TESs), commonly referred to as 'hydras', are a type of position sensitive micro-calorimeter that enables very large format arrays to be designed without commensurate increase in the number of readout channels and associated wiring. In the hydra design, a single TES is coupled to discrete absorbers via varied thermal links. The links act as low pass thermal filters that are tuned to give a different characteristic pulse shape for x-ray photons absorbed in each of the hydra sub pixels. In this contribution we report on the experimental results from hydras consisting of up to 20 pixels per TES. We discuss the design trade-offs between energy resolution, position discrimination and number of pixels and investigate future design optimizations specifically targeted at meeting the readout technology considered for Lynx.

  20. Method for producing a hybridization of detector array and integrated circuit for readout

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Grunthaner, Frank J. (Inventor)

    1993-01-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  1. Readout circuit design of the retina-like CMOS image sensor

    NASA Astrophysics Data System (ADS)

    Cao, Fengmei; Song, Shengyu; Bai, Tingzhu; Cao, Nan

    2015-02-01

    Readout circuit is designed for a special retina-like CMOS image sensor. To realize the pixels timing drive and readout of the sensor, the Altera's Cyclone II FPGA is used as a control chip. The voltage of the sensor is supported by a voltage chip initialized by SPI with AVR MCU system. The analog image signal outputted by the sensor is converted to digital image data by 12-bits A/D converter ADS807 and the digital data is memorized in the SRAM. Using the Camera-link image grabber, the data stored in SRAM is transformed to image shown on PC. Experimental results show the circuit works well on retina-like CMOS timing drive and image readout and images can be displayed properly on the PC.

  2. Method for producing a hybridization of detector array and integrated circuit for readout

    NASA Astrophysics Data System (ADS)

    Fossum, Eric R.; Grunthaner, Frank J.

    1993-08-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  3. X-ray imaging using a 320 x 240 hybrid GaAs pixel detector

    SciTech Connect

    Irsigler, R.; Andersson, J.; Alverbro, J.

    1999-06-01

    The authors present room temperature measurements on 200 {micro}m thick GaAs pixel detectors, which were hybridized to silicon readout circuits. The whole detector array contains 320 x 240 square shaped pixel with a pitch of 38 {micro}m and is based on semi-insulating liquid-encapsulated Czochralski (LEC) GaAs material. After fabricating and dicing, the detector chips were indium bump flip chip bonded to CMOS readout circuits based on charge integration and finally evaluated. This readout chip was originally designed for the readout of flip chip bonded infrared detectors, but appears to be suitable for X-ray applications as well. A bias voltage between 50 V and 100 V was sufficient to operate the detector at room temperature. The detector array did respond to x-ray radiation by an increase in current due to production of electron hole pairs by the ionization processes. Images of various objects and slit patterns were acquired by using a standard X-ray source for dental imaging. The new X-ray hybrid detector was analyzed with respect to its imaging properties. Due to the high absorption coefficient for X-rays in GaAs and the small pixel size, the sensor shows a high modulation transfer function up to the Nyquist frequency.

  4. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Andricek, L.; Moser, H.-G.; Nisius, R.; Richter, R. H.; Terzo, S.; Weigell, P.

    2014-11-01

    We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5 ×1015neq /cm2. We will also report on the R&D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding.

  5. Bonding techniques for hybrid active pixel sensors (HAPS)

    NASA Astrophysics Data System (ADS)

    Bigas, M.; Cabruja, E.; Lozano, M.

    2007-05-01

    A hybrid active pixel sensor (HAPS) consists of an array of sensing elements which is connected to an electronic read-out unit. The most used way to connect these two different devices is bump bonding. This interconnection technique is very suitable for these systems because it allows a very fine pitch and a high number of I/Os. However, there are other interconnection techniques available such as direct bonding. This paper, as a continuation of a review [M. Lozano, E. Cabruja, A. Collado, J. Santander, M. Ullan, Nucl. Instr. and Meth. A 473 (1-2) (2001) 95-101] published in 2001, presents an update of the different advanced bonding techniques available for manufacturing a hybrid active pixel detector.

  6. CMS Pixel Detector design for HL-LHC

    NASA Astrophysics Data System (ADS)

    Migliore, E.

    2016-12-01

    The LHC machine is planning an upgrade program which will smoothly bring the luminosity to about 7.5×1034cm-2s-1 in 2028, to possibly reach an integrated luminosity of 3000 fb-1 by the end of 2037. This High Luminosity scenario, HL-LHC, will present new challenges in higher data rates and increased radiation. In order to maintain its physics reach the CMS collaboration has undertaken a preparation program of the detector known as Phase-2 upgrade. The CMS Phase-2 Pixel upgrade will require a high bandwidth readout system and high radiation tolerance for sensors and on-detector ASICs. Several technologies for the upgrade sensors are being studied. Serial powering schemes are under consideration to accommodate significant constraints on the system. These prospective designs, as well as new layout geometries that include very forward pixel discs, will be presented together with performance estimation.

  7. Increased space-bandwidth product in pixel super-resolved lensfree on-chip microscopy

    NASA Astrophysics Data System (ADS)

    Greenbaum, Alon; Luo, Wei; Khademhosseinieh, Bahar; Su, Ting-Wei; Coskun, Ahmet F.; Ozcan, Aydogan

    2013-04-01

    Pixel-size limitation of lensfree on-chip microscopy can be circumvented by utilizing pixel-super-resolution techniques to synthesize a smaller effective pixel, improving the resolution. Here we report that by using the two-dimensional pixel-function of an image sensor-array as an input to lensfree image reconstruction, pixel-super-resolution can improve the numerical aperture of the reconstructed image by ~3 fold compared to a raw lensfree image. This improvement was confirmed using two different sensor-arrays that significantly vary in their pixel-sizes, circuit architectures and digital/optical readout mechanisms, empirically pointing to roughly the same space-bandwidth improvement factor regardless of the sensor-array employed in our set-up. Furthermore, such a pixel-count increase also renders our on-chip microscope into a Giga-pixel imager, where an effective pixel count of ~1.6-2.5 billion can be obtained with different sensors. Finally, using an ultra-violet light-emitting-diode, this platform resolves 225 nm grating lines and can be useful for wide-field on-chip imaging of nano-scale objects, e.g., multi-walled-carbon-nanotubes.

  8. Imaging properties of pixellated scintillators with deep pixels

    PubMed Central

    Barber, H. Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P.; Furenlid, Lars R.; Miller, Brian W.; Parkhurst, Philip; Nagarkar, Vivek V.

    2015-01-01

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10×10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm × 1mm × 20 mm pixels) made by Proteus, Inc. with similar 10×10 arrays of LSO:Ce and BGO (1mm × 1mm × 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10×10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of 176Lu in LSO:Ce and LYSO:Ce detectors. PMID:26236070

  9. Imaging properties of pixellated scintillators with deep pixels

    NASA Astrophysics Data System (ADS)

    Barber, H. Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P.; Furenlid, Lars R.; Miller, Brian W.; Parkhurst, Philip; Nagarkar, Vivek V.

    2014-09-01

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10x10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm x 1mm x 20 mm pixels) made by Proteus, Inc. with similar 10x10 arrays of LSO:Ce and BGO (1mm x 1mm x 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10x10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of 176Lu in LSO:Ce and LYSO:Ce detectors.

  10. Imaging properties of pixellated scintillators with deep pixels.

    PubMed

    Barber, H Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P; Furenlid, Lars R; Miller, Brian W; Parkhurst, Philip; Nagarkar, Vivek V

    2014-08-17

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10×10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm × 1mm × 20 mm pixels) made by Proteus, Inc. with similar 10×10 arrays of LSO:Ce and BGO (1mm × 1mm × 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10×10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of (176)Lu in LSO:Ce and LYSO:Ce detectors.

  11. A kilo-pixel imaging system for future space based far-infrared observatories using microwave kinetic inductance detectors

    NASA Astrophysics Data System (ADS)

    Baselmans, J. J. A.; Bueno, J.; Yates, S. J. C.; Yurduseven, O.; Llombart, N.; Karatsu, K.; Baryshev, A. M.; Ferrari, L.; Endo, A.; Thoen, D. J.; de Visser, P. J.; Janssen, R. M. J.; Murugesan, V.; Driessen, E. F. C.; Coiffard, G.; Martin-Pintado, J.; Hargrave, P.; Griffin, M.

    2017-05-01

    Aims: Future astrophysics and cosmic microwave background space missions operating in the far-infrared to millimetre part of the spectrum will require very large arrays of ultra-sensitive detectors in combination with high multiplexing factors and efficient low-noise and low-power readout systems. We have developed a demonstrator system suitable for such applications. Methods: The system combines a 961 pixel imaging array based upon Microwave Kinetic Inductance Detectors (MKIDs) with a readout system capable of reading out all pixels simultaneously with only one readout cable pair and a single cryogenic amplifier. We evaluate, in a representative environment, the system performance in terms of sensitivity, dynamic range, optical efficiency, cosmic ray rejection, pixel-pixel crosstalk and overall yield at an observation centre frequency of 850 GHz and 20% fractional bandwidth. Results: The overall system has an excellent sensitivity, with an average detector sensitivity < NEPdet> =3×10-19 WHz measured using a thermal calibration source. At a loading power per pixel of 50 fW we demonstrate white, photon noise limited detector noise down to 300 mHz. The dynamic range would allow the detection of 1 Jy bright sources within the field of view without tuning the readout of the detectors. The expected dead time due to cosmic ray interactions, when operated in an L2 or a similar far-Earth orbit, is found to be <4%. Additionally, the achieved pixel yield is 83% and the crosstalk between the pixels is <-30 dB. Conclusions: This demonstrates that MKID technology can provide multiplexing ratios on the order of a 1000 with state-of-the-art single pixel performance, and that the technology is now mature enough to be considered for future space based observatories and experiments.

  12. ACS/WFC Pixel Stability - Bringing the Pixels Back to the Science

    NASA Astrophysics Data System (ADS)

    Borncamp, David; Grogin, Norman A.; Bourque, Matthew; Ogaz, Sara

    2016-06-01

    Electrical current that has been trapped within the lattice structure of a Charged Coupled Device (CCD) can be present through multiple exposures, which will have an adverse effect on its science performance. The traditional way to correct for this extra charge is to take an image with the camera shutter closed periodically throughout the lifetime of the instrument. These images, generally referred to as dark images, allow for the characterization of the extra charge that is trapped within the CCD at the time of observation. This extra current can then be subtracted out of science images to correct for the extra charge that was there at this time. Pixels that have a charge above a certain threshold of current are marked as “hot” and flagged in the data quality array. However, these pixels may not be "bad" in the traditional sense that they cannot be reliably dark-subtracted. If these pixels are shown to be stable over an anneal period, the charge can be properly subtracted and the extra noise from this dark current can be taken into account. We present the results of a pixel history study that analyzes every pixel of ACS/WFC individually and allows pixels that were marked as bad to be brought back into the science image.

  13. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    SciTech Connect

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T.; Gruner, Sol M.

    2016-01-28

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. Lastly, we detail the characteristics, operation, testing and application of the detector.

  14. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    DOE PAGES

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; ...

    2016-01-28

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses atmore » megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. Lastly, we detail the characteristics, operation, testing and application of the detector.« less

  15. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation.

    PubMed

    Philipp, Hugh T; Tate, Mark W; Purohit, Prafull; Shanks, Katherine S; Weiss, Joel T; Gruner, Sol M

    2016-03-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8-12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10-100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.

  16. Characterization of high resolution CMOS monolithic active pixel detector in SOI technology

    NASA Astrophysics Data System (ADS)

    Ahmed, M. I.; Arai, Y.; Glab, S.; Idzik, M.; Kapusta, P.; Miyoshi, T.; Takeda, A.; Turala, M.

    2015-05-01

    Novel CMOS monolithic pixel detectors designed at KEK and fabricated at Lapis Semiconductor in 0.2 μm Silicon-on-Insulator (SOI) technology are presented. A thin layer of silicon oxide separates high and low resistivity silicon layers, allowing for optimization of design of detector and readout parts. Shallow wells buried under the oxide in the detector part screen the entire pixel electronics from electrical field applied to the detector. Several integration type SOI pixel detectors have been developed with pixel sizes 8-20 μm. The general features of 14 × 14 μm2 detectors designed on different wafers (CZ-n, FZ-n and FZ-p) were measured and compared. The detector performance was studied under irradiation with visible and infra-red laser, and also X-ray ionizing source. Using X-rays from an Am-241 source the noise of readout electronics was measured at different working conditions, showing the ENC in the range of 88-120 e-. The pixel current was calculated from average DC pedestal shift while varying the pixel integration time. The operation of the detector was studied under partial and full depletion conditions. The effects of temperature and detector bias voltage on noise and leakage current were studied. Characteristics of an ADC integrated in the front-end chip are also presented.

  17. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    PubMed Central

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T.; Gruner, Sol M.

    2016-01-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed. PMID:26917125

  18. A discrete component low-noise preamplifier readout for a linear (1×16) SiC photodiode array

    NASA Astrophysics Data System (ADS)

    Kahle, Duncan; Aslam, Shahid; Herrero, Federico A.; Waczynski, Augustyn

    2016-09-01

    A compact, low-noise and inexpensive preamplifier circuit has been designed and fabricated to optimally readout a common cathode (1×16) channel 4H-SiC Schottky photodiode array for use in ultraviolet experiments. The readout uses an operational amplifier with 10 pF capacitor in the feedback loop in parallel with a low leakage switch for each of the channels. This circuit configuration allows for reiterative sample, integrate and reset. A sampling technique is given to remove Johnson noise, enabling a femtoampere level readout noise performance. Commercial-off-the-shelf acquisition electronics are used to digitize the preamplifier analog signals. The data logging acquisition electronics has a different integration circuit, which allows the bandwidth and gain to be independently adjusted. Using this readout, photoresponse measurements across the array between spectral wavelengths 200 nm and 370 nm are made to establish the array pixels external quantum efficiency, current responsivity and noise equivalent power.

  19. Development of Frequency-Division Multiplexing Readout System for Large-Format TES X-ray Microcalorimeter Arrays

    NASA Astrophysics Data System (ADS)

    Sakai, K.; Yamamoto, R.; Takei, Y.; Mitsuda, K.; Yamasaki, N. Y.; Hidaka, M.; Nagasawa, S.; Kohjiro, S.; Miyazaki, T.

    2016-07-01

    We are developing the frequency-division multiplexing (FDM) readout system aimed to realize the 400-pixel transition edge sensor (TES) microcalorimeter array for the DIOS mission as well as large-format arrays with more than a thousand of TES for future space missions such as the ATHENA mission. The developed system consists of the low-power superconducting quantum interference device (SQUID), the digital FDM electronics, and the analog front-end to bridge the SQUID and the digital electronics. Using the developed readout system, we performed a TES readout experiment and succeeded to multiplex four TES signals with the single-staged cryogenic setup. We have experienced two issues during the experiment: an excess noise and crosstalk. The brief overview of the developed system and the details, results, and issues of the TES multiplexing readout experiment is discussed.

  20. Architecture of PAU survey camera readout electronics

    NASA Astrophysics Data System (ADS)

    Castilla, Javier; Cardiel-Sas, Laia; De Vicente, Juan; Illa, Joseph; Jimenez, Jorge; Maiorino, Marino; Martinez, Gustavo

    2012-07-01

    PAUCam is a new camera for studying the physics of the accelerating universe. The camera will consist of eighteen 2Kx4K HPK CCDs: sixteen for science and two for guiding. The camera will be installed at the prime focus of the WHT (William Herschel Telescope). In this contribution, the architecture of the readout electronics system is presented. Back- End and Front-End electronics are described. Back-End consists of clock, bias and video processing boards, mounted on Monsoon crates. The Front-End is based on patch panel boards. These boards are plugged outside the camera feed-through panel for signal distribution. Inside the camera, individual preamplifier boards plus kapton cable completes the path to connect to each CCD. The overall signal distribution and grounding scheme is shown in this paper.

  1. Pixelated gamma detector

    SciTech Connect

    Dolinsky, Sergei Ivanovich; Yanoff, Brian David; Guida, Renato; Ivan, Adrian

    2016-12-27

    A pixelated gamma detector includes a scintillator column assembly having scintillator crystals and optical transparent elements alternating along a longitudinal axis, a collimator assembly having longitudinal walls separated by collimator septum, the collimator septum spaced apart to form collimator channels, the scintillator column assembly positioned adjacent to the collimator assembly so that the respective ones of the scintillator crystal are positioned adjacent to respective ones of the collimator channels, the respective ones of the optical transparent element are positioned adjacent to respective ones of the collimator septum, and a first photosensor and a second photosensor, the first and the second photosensor each connected to an opposing end of the scintillator column assembly. A system and a method for inspecting and/or detecting defects in an interior of an object are also disclosed.

  2. X-ray Polarimetry with an Active-Matrix Pixel Proportional Counter

    NASA Technical Reports Server (NTRS)

    Black, J. K.; Deines-Jones, P.; Ready, S. E.; Street, R. A.

    2003-01-01

    We report the first results from an X-ray polarimeter with a micropattern gas proportional counter using an amorphous silicon active matrix readout. With 100% polarized X-rays at 4.5 keV, we obtain a modulation factor of 0.33+/- 0.03, confirming previous reports of the high polarization sensitivity of a finely segmented pixel proportional counter. The detector described here has a geometry suitable for the focal plane of an astronomical X-ray telescope. Amorphous silicon readout technology will enable additional extensions and improvements.

  3. A Digital Readout System For The CSO Microwave Kinetic Inductance Camera

    NASA Astrophysics Data System (ADS)

    Max-Moerbeck, Walter; Mazin, B. A.; Zmuidzinas, J.

    2007-12-01

    Submillimeter galaxies are important to the understanding of galaxy formation and evolution. Determination of the spectral energy distribution in the millimeter and submillimeter regimes allows important and powerful diagnostics. Our group is developing a camera for the Caltech Submillimeter Observatory (CSO) using Microwave Kinetic Inductance Detectors (MKIDs). MKIDs are superconducting devices whose impedance changes with the absorption of photons. The camera will have 600 spatial pixels and 4 bands at 750 μm, 850 μm, 1.1 mm and 1.3 mm. For each spatial pixel of the camera the radiation is coupled to the MKIDs using phased-array antennas. This signal is split into 4 different bands using filters and detected using the superconductor as part of a MKID's resonant circuit. The detection process consists of measurement of the changes in the transmission through the resonator when it is illuminated. By designing resonant circuits to have different resonant frequencies and high transmission out resonance, MKIDs can be frequency-domain multiplexed. This allows the simultaneous readout of many detectors through a single coaxial cable. The readout system makes use of microwave IQ modulation and is based on commercial electronics components operating at room temperature. The basic readout has been demonstrated on the CSO. We are working on the implementation of an improved design to be tested on a prototype system with 6x6 pixels and 4 colors next April on the CSO.

  4. Module production for the Phase 1 upgrade of the CMS forward pixel detector

    NASA Astrophysics Data System (ADS)

    Siado Castaneda, Joaquin

    2017-01-01

    For Run 2 the Large Hadron Collider will run at a much higher instantaneous luminosity, which requires an upgrade of the CMS pixel detector. The detector consists of rectangular silicon sensors, segmented into 100 μm by 150 μm pixels, bonded to readout chips, with one sensor and a 8x2 array of readout chips forming a module. Due to its high granularity and good spatial resolution, about 10 μm for a single hit, the pixel detector is used for track reconstruction, pileup mitigation, and b-quark tagging in many physics analyses. Being the innermost sub-detector of CMS it receives the most radiation damage, and therefore needs to be replaced most often. For the phase 1 upgrade an additional disk in the forward region and increased buffer space in the readout chip will improve the pixel performance by increasing efficiency and reducing fake rates. The University of Nebraska-Lincoln is one of the two sites where modules are being assembled. This talk features the steps of the assembly process as well as challenges encountered and overcome during production of over 500 modules. The CMS Collaboration.

  5. Pixelation Effects in Weak Lensing

    NASA Technical Reports Server (NTRS)

    High, F. William; Rhodes, Jason; Massey, Richard; Ellis, Richard

    2007-01-01

    Weak gravitational lensing can be used to investigate both dark matter and dark energy but requires accurate measurements of the shapes of faint, distant galaxies. Such measurements are hindered by the finite resolution and pixel scale of digital cameras. We investigate the optimum choice of pixel scale for a space-based mission, using the engineering model and survey strategy of the proposed Supernova Acceleration Probe as a baseline. We do this by simulating realistic astronomical images containing a known input shear signal and then attempting to recover the signal using the Rhodes, Refregier, and Groth algorithm. We find that the quality of shear measurement is always improved by smaller pixels. However, in practice, telescopes are usually limited to a finite number of pixels and operational life span, so the total area of a survey increases with pixel size. We therefore fix the survey lifetime and the number of pixels in the focal plane while varying the pixel scale, thereby effectively varying the survey size. In a pure trade-off for image resolution versus survey area, we find that measurements of the matter power spectrum would have minimum statistical error with a pixel scale of 0.09' for a 0.14' FWHM point-spread function (PSF). The pixel scale could be increased to 0.16' if images dithered by exactly half-pixel offsets were always available. Some of our results do depend on our adopted shape measurement method and should be regarded as an upper limit: future pipelines may require smaller pixels to overcome systematic floors not yet accessible, and, in certain circumstances, measuring the shape of the PSF might be more difficult than those of galaxies. However, the relative trends in our analysis are robust, especially those of the surface density of resolved galaxies. Our approach thus provides a snapshot of potential in available technology, and a practical counterpart to analytic studies of pixelation, which necessarily assume an idealized shape

  6. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Nisius, R.; Savic, N.; Terzo, S.

    2016-09-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14 ×1015 neq /cm2 . The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50×50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80°) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.

  7. Development of a pixel sensor with fine space-time resolution based on SOI technology for the ILC vertex detector

    NASA Astrophysics Data System (ADS)

    Ono, Shun; Togawa, Manabu; Tsuji, Ryoji; Mori, Teppei; Yamada, Miho; Arai, Yasuo; Tsuboyama, Toru; Hanagaki, Kazunori

    2017-02-01

    We have been developing a new monolithic pixel sensor with silicon-on-insulator (SOI) technology for the International Linear Collider (ILC) vertex detector system. The SOI monolithic pixel detector is realized using standard CMOS circuits fabricated on a fully depleted sensor layer. The new SOI sensor SOFIST can store both the position and timing information of charged particles in each 20×20 μm2 pixel. The position resolution is further improved by the position weighted with the charges spread to multiple pixels. The pixel also records the hit timing with an embedded time-stamp circuit. The sensor chip has column-parallel analog-to-digital conversion (ADC) circuits and zero-suppression logic for high-speed data readout. We are designing and evaluating some prototype sensor chips for optimizing and minimizing the pixel circuit.

  8. Pixel Stability in HST Advanced Camera for Surveys Images

    NASA Astrophysics Data System (ADS)

    Borncamp, David; Grogin, Norman A.; Bourque, Matthew; Ogaz, Sara

    2017-06-01

    Excess thermal energy present in a Charged Coupled Device (CCD) can result in additional electrical current that is propagated into individual pixels in an exposure. This excess signal from the CCD itself can be persistently existent through multiple exposures and can have an adverse effect on the detectors science performance unless properly flagged and corrected for. The traditional way to correct for this extra charge is to take occasional long-exposure images with the camera shutter closed to map the location of these pixels. These images, generally referred to as “dark” images, allow for the measurement of the thermal-electron contamination present in each pixel of the CCD lattice. This "dark current" can then be subtracted from the science images by re-scaling the dark to the science exposure times. Pixels that have signal above a certain threshold are traditionally marked as “hot” and flagged in the data quality array. Many users will discard these pixels as being bad because of this extra current. However, these pixels may not be "bad" in the traditional sense that they cannot be reliably dark-subtracted. If these pixels are shown to be stable over an anneal period, the charge can be properly subtracted and the extra Poisson noise from this hot pixel’s dark current can be taken into account. Here we present the results of a pixel history study that analyzes every individual pixel of the Hubble Space Telescope's (HST) Advanced Camera for Surveys (ACS) Wide Field Channel (WFC) CCDs over time and allows pixels that were previously marked as bad to be brought back into the science image as a reliable pixel.

  9. Fiber faceplate modulation readout in Bi-material micro-cantilever mirror array imaging system

    NASA Astrophysics Data System (ADS)

    Hui, Mei; Xia, Zhengzheng; Liu, Ming; Dong, Liquan; Liu, Xiaohua; Zhao, Yuejin

    2016-05-01

    Fiber faceplate modulation was applied to read out the precise actuation of silicon-based, surface micro-fabricated cantilever mirrors array in optical imaging system. The faceplate was made by ordered bundles consisting of as many as ten thousands fibers. The transmission loss of an individual fiber in the bundles was 0.35dB/cm and the cross talk between neighboring fibers in the faceplate was about 15%. Micro-cantilever mirrors array (Focal-Plane Array (FPA)) which composed of two-level bi-material pixels, absorb incident infrared flux and result in a temperature increase. The temperature distribution of incident flux transformed to the deformation distribution in FPA which has a very big difference in coefficients of thermal expansion. FPA plays the roles of target sensing and has the characteristics of high detection sensitivity. Instead of general filter such as knife edge or pinhole, fiber faceplate modulate the beam reflected by the units of FPA. An optical readout signal brings a visible spectrum into pattern recognition system, yielding a visible image on monitor. Thermal images at room temperature have been obtained. The proposed method permits optical axis compact and image noise suppression.

  10. Diamond pixel modules and the ATLAS beam conditions monitor

    NASA Astrophysics Data System (ADS)

    Dobos, D.; Pernegger, Heinz; RD42 Collaboration; ATLAS Diamond Pixel Upgrade Collaboration; ATLAS Beam Conditions Monitor Collaborations

    2011-02-01

    Chemical vapor deposition diamonds are considered among possible sensor materials for the next pixel upgrade in ATLAS. Full size diamond pixel modules have been constructed to the specification of the ATLAS Pixel Detector using poly-crystalline CVD diamond sensors to develop the production techniques required for industrial production. Those modules were tested in the lab and testbeam. Additionally we will present results of diamond pixel modules using single-crystal diamonds and results of proton irradiations up to 1.8 ×10 16 protons/cm 2. The ATLAS Beam Conditions Monitors (BCM) main purpose is to protect the experiments silicon tracker from beam incidents. In total 16 1×1 cm2 500 μm thick diamond pCVD sensors are used in eight positions around the LHC interaction point. They perform time difference measurements with sub nanosecond resolution to distinguish between particles from a collision and spray particles from a beam incident; an abundance of the latter can lead the BCM to provoke an abort of LHC beam. The BCM diamond detector modules, their readout system and the algorithms used to detect beam incidents are described. Results of the BCM operation with circulating LHC beams and its commissioning with first LHC collisions are reported.

  11. A low noise readout integrated circuit for Nb5N6 microbolometer array detector

    NASA Astrophysics Data System (ADS)

    Jiang, Zhou; Wan, Chao; Xiao, Peng; Jiang, Chengtao; Tu, Xuecou; Jia, Xiaoqing; Kang, Lin; Chen, Jian; Wu, Peiheng

    2017-02-01

    We present a readout circuit for 1 × 64 Nb5N6 microbolometer array detector. The intrinsic average responsivity of the detectors in the array is 650 V/W, and the corresponding noise equivalent power (NEP) is 17 pW/√Hz. Due to the low noise of the detector, we design a low noise readout circuit with 64 channels. The readout integrated circuit (ROIC) is fabricated under CMOS process with 0.18μm design rule, which has built-in bias and adjustable numerical-controlled output current. Differential structure is used for each pixel to boost capacity of resisting disturbance. A multiplexer and the second stage amplifier is followed after the ROIC. It is shown that the ROIC achieves an average gain of 47dB and a voltage noise spectral density of 9.34nV/√Hz at 10KHz. The performance of this readout circuit nearly fulfills the requirements for THz array detector. This readout circuit is fit for the detector, which indicates a good way to develop efficient and low-cost THz detector system.

  12. A data readout approach for physics experiments

    NASA Astrophysics Data System (ADS)

    Huang, Xi-Ru; Cao, Ping; Gao, Li-Wei; Zheng, Jia-Jun

    2015-07-01

    With increasing physical event rates and the number of electronic channels, traditional readout schemes meet the challenge of improving readout speed caused by the limited bandwidth of the crate backplane. In this paper, a high-speed data readout method based on the Ethernet is presented to make each readout module capable of transmitting data to the DAQ. Features of explicitly parallel data transmitting and distributed network architecture give the readout system the advantage of adapting varying requirements of particle physics experiments. Furthermore, to guarantee the readout performance and flexibility, a standalone embedded CPU system is utilized for network protocol stack processing. To receive the customized data format and protocol from front-end electronics, a field programmable gate array (FPGA) is used for logic reconfiguration. To optimize the interface and to improve the data throughput between CPU and FPGA, a sophisticated method based on SRAM is presented in this paper. For the purpose of evaluating this high-speed readout method, a simplified readout module is designed and implemented. Test results show that this module can support up to 70 Mbps data throughput from the readout module to DAQ. Supported by National Natural Science Foundation of China (11005107) and Independent Projects of State Key Laboratory of Particle Detection and Electronics (201301)

  13. The pixel detector for the CMS phase-II upgrade

    NASA Astrophysics Data System (ADS)

    Dinardo, M. E.

    2015-04-01

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb-1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R&D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R&D effort are presented and discussed in this article.

  14. A 128 pixel linear array for radiotherapy quality assurance

    NASA Astrophysics Data System (ADS)

    Franco, L.; Gómez, F.; Iglesias, A.; Lobato, R.; Marín, J.; Mosquera, J.; Pardo, J.; Pazos, A.; Pena, J.; Pombar, M.; Rodríguez, A.; Saavedra, D.; Sendón, J.; Yañez, A.

    2004-12-01

    New radiotherapy techniques require detectors able to verify and monitor the clinical beam with high spatial resolution and fast response. Room temperature organic liquid ionization detectors are becoming an alternative to standard air ionization chambers, due to their tissue equivalent behavior, their sensibility and small directional dependence. A liquid isooctane filled ionization linear array for radiotherapy quality assurance has been designed, built and tested. The detector consists of 128 pixels, each of them with an area of 1.7 mm×1.7 mm and a gap of 0.5 mm. The small pixel size makes the detector ideal for high gradient beam profiles like those present in Intensity Modulated Radiation Therapy. The gap and the polarization voltage have been chosen in order to guarantee a linear relationship between the dose rate and the readout signal at high dose rates. As readout electronics we use the X-ray Data Acquisition System with the Xchip developed by the CCLRC.In the first device tests we have confirmed linearity up to a 6.7 Gy/min dose rate with a deviation less than 1%. A profile with a signal-to-noise ratio around 500 can be obtained for a 4 Gy/min dose rate with a 10 ms integration time.

  15. THE KEPLER PIXEL RESPONSE FUNCTION

    SciTech Connect

    Bryson, Stephen T.; Haas, Michael R.; Dotson, Jessie L.; Koch, David G.; Borucki, William J.; Tenenbaum, Peter; Jenkins, Jon M.; Chandrasekaran, Hema; Caldwell, Douglas A.; Klaus, Todd; Gilliland, Ronald L.

    2010-04-20

    Kepler seeks to detect sequences of transits of Earth-size exoplanets orbiting solar-like stars. Such transit signals are on the order of 100 ppm. The high photometric precision demanded by Kepler requires detailed knowledge of how the Kepler pixels respond to starlight during a nominal observation. This information is provided by the Kepler pixel response function (PRF), defined as the composite of Kepler's optical point-spread function, integrated spacecraft pointing jitter during a nominal cadence and other systematic effects. To provide sub-pixel resolution, the PRF is represented as a piecewise-continuous polynomial on a sub-pixel mesh. This continuous representation allows the prediction of a star's flux value on any pixel given the star's pixel position. The advantages and difficulties of this polynomial representation are discussed, including characterization of spatial variation in the PRF and the smoothing of discontinuities between sub-pixel polynomial patches. On-orbit super-resolution measurements of the PRF across the Kepler field of view are described. Two uses of the PRF are presented: the selection of pixels for each star that maximizes the photometric signal-to-noise ratio for that star, and PRF-fitted centroids which provide robust and accurate stellar positions on the CCD, primarily used for attitude and plate scale tracking. Good knowledge of the PRF has been a critical component for the successful collection of high-precision photometry by Kepler.

  16. Fully depleted CMOS pixel sensor development and potential applications

    SciTech Connect

    Baudot, J.; Kachel, M.

    2015-07-01

    low noise figure. Especially, an energy resolution of about 400 eV for 5 keV X-rays was obtained for single pixels. The prototypes have then been exposed to gradually increased fluences of neutrons, from 10{sup 13} to 5x10{sup 14} neq/cm{sup 2}. Again laboratory tests allowed to evaluate the signal over noise persistence on the different pixels implemented. Currently our development mostly targets the detection of soft X-rays, with the ambition to develop a pixel sensor matching counting rates as affordable with hybrid pixel sensors, but with an extended sensitivity to low energy and finer pixel about 25 x 25 μm{sup 2}. The original readout architecture proposed relies on a two tiers chip. The first tier consists of a sensor with a modest dynamic in order to insure low noise performances required by sensitivity. The interconnected second tier chip enhances the read-out speed by introducing massive parallelization. Performances reachable with this strategy combining counting and integration will be detailed. (authors)

  17. Small pixel infrared sensor technology

    NASA Astrophysics Data System (ADS)

    Caulfield, John; Curzan, Jon

    2017-02-01

    We report on product maturation of small pixel high definition high charge capacity 2.4 Mpixel MWIR Infrared Focal Plane Arrays. This high definition (HD) FPA utilizes a small 5 um pitch pixel size which enables near Nyquist limited sampling with by the optical system of many IR lenses. These smaller sub diffraction pitch pixels enable improved sensitivity and resolution resulting in clear, crisp high contrast imaging with excellent IFOVs even with small focal length lenses. The small pixel IR sensor allows the designer to trade off field of view, MTF, optics F/# to obtain a more compact and high performance IR sensor. This enables lower size, power and weight reductions of the entire IR Sensor System. The highly sensitive MWIR small pixel HD FPA has the capability to detect dimmer signals at longer ranges than previously demonstrated.

  18. The Pixel Detector of the ATLAS Experiment for the Run 2 at the Large Hadron Collider

    NASA Astrophysics Data System (ADS)

    Mandelli, B.; ATLAS Collaboration

    2016-04-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). The IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of the pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. The IBL construction and installation in the ATLAS experiment has been completed very successfully. The IBL qualification has shown outstanding detector performance with less then 0.09% of bad pixels. The final commissioning is now on-going and the ATLAS Pixel Detector is ready to join the LHC Run 2 with an improved configuration and a new pixel layer.

  19. X-ray imaging characterization of active edge silicon pixel sensors

    NASA Astrophysics Data System (ADS)

    Ponchut, C.; Ruat, M.; Kalliopuska, J.

    2014-05-01

    The aim of this work was the experimental characterization of edge effects in active-edge silicon pixel sensors, in the frame of X-ray pixel detectors developments for synchrotron experiments. We produced a set of active edge pixel sensors with 300 to 500 μm thickness, edge widths ranging from 100 μm to 150 μm, and n or p pixel contact types. The sensors with 256 × 256 pixels and 55 × 55 μm2 pixel pitch were then bump-bonded to Timepix readout chips for X-ray imaging measurements. The reduced edge widths makes the edge pixels more sensitive to the electrical field distribution at the sensor boundaries. We characterized this effect by mapping the spatial response of the sensor edges with a finely focused X-ray synchrotron beam. One of the samples showed a distortion-free response on all four edges, whereas others showed variable degrees of distortions extending at maximum to 300 micron from the sensor edge. An application of active edge pixel sensors to coherent diffraction imaging with synchrotron beams is described.

  20. Charge Transfer Efficiency modeling/measurements as function of CCD pixel rate

    SciTech Connect

    Yates, G.J.; Gallegos, R.; Pena, C.; Zagarino, P.

    1995-09-01

    We have developed a charge transport model for predicting the effects on Charge Transfer Efficiency (CTE) of Charge Coupled Devices (CCDs) as functions of number of transfers, pixel charge flow rate, and magnitude in the CCD`s vertical and horizontal charge transport mediums. The model uses carrier lifetime an mobility criteria to establish pixel speed arguments and limitations for various CCD architectures. The model is compared with experimental measurements obtained using strobed single pixel illumination and a variant of the deferred charge tail technique while independently varying the CCD pixel rates for both the vertical and horizontal readout phases. The generic model is discussed and applied to specific real CCDs. Agreement between predicted performance and actual measured performance is presented.

  1. Planar pixel sensors for the ATLAS tracker upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Gallrapp, C.; Atlas Planar Pixel Sensor R&D Project

    2013-08-01

    The ATLAS Planar Pixel Sensor R&D Project is a collaboration of 17 institutes and more than 80 scientists. Their goal is to explore the operation of planar pixel sensors for the tracker upgrade at the High Luminosity-Large Hadron Collider (HL-LHC). This work will give a summary of the achievements on radiation studies with n-in-n and n-in-p pixel sensors, bump-bonded to ATLAS FE-I3 and FE-I4 read-out chips. The summary includes results from tests with radioactive sources and tracking efficiencies extracted from test beam measurements. Analysis results of 2 ×1016neqcm-2 and 1 ×1016neqcm-2 (1 MeV neutron equivalent) irradiated n-in-n and n-in-p modules confirm the operation of planar pixel sensors for future applications.

  2. Pixel detectors in double beta decay experiments, a new approach for background reduction

    SciTech Connect

    Jose, J. M.; Čermák, P.; Štekl, I.; Rukhadze, E. N.; Rukhadze, N. I.; Brudanin, V. B.; Fiederle, M.; Fauler, A.; Loaiza, P.

    2013-08-08

    Double beta decay (ββ) experiments are challenging frontiers in contemporary physics. These experiments have the potential to investigate more about neutrinos (eg. nature and mass). The main challenge for these experiments is the reduction of background. The group at IEAP, CTU in Prague is investigating a new approach using pixel detectors Timepix. Pixel detector offer background reduction capabilities with its ability to identify the particle interaction (from the 2D signature it generates). However, use of pixel detectors has some challenges such as the presence of readout electronics near the sensing medium and heat dissipation. Different aspects of pixel setup (identification of radio-impurities, selection of radio-pure materials) and proposed experimental setup are presented. Also, results of preliminary background measurements (performed on the surface and in the underground laboratories) using the prototype setups are presented.

  3. Silicon pixel-detector R&D for CLIC

    NASA Astrophysics Data System (ADS)

    Nürnberg, A.

    2016-11-01

    The physics aims at the future CLIC high-energy linear e+e- collider set very high precision requirements on the performance of the vertex and tracking detectors. Moreover, these detectors have to be well adapted to the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of a few μm, ultra-low mass (~ 0.2%X0 per layer for the vertex region and ~ 1%X0 per layer for the outer tracker), very low power dissipation (compatible with air-flow cooling in the inner vertex region) and pulsed power operation, complemented with ~ 10 ns time stamping capabilities. A highly granular all-silicon vertex and tracking detector system is under development, following an integrated approach addressing simultaneously the physics requirements and engineering constraints. For the vertex-detector region, hybrid pixel detectors with small pitch (25 μm) and analog readout are explored. For the outer tracking region, both hybrid concepts and fully integrated CMOS sensors are under consideration. The feasibility of ultra-thin sensor layers is validated with Timepix3 readout ASICs bump bonded to active edge planar sensors with 50 μm to 150 μm thickness. Prototypes of CLICpix readout ASICs implemented in 6525 nm CMOS technology with 25 μm pixel pitch have been produced. Hybridisation concepts have been developed for interconnecting these chips either through capacitive coupling to active HV-CMOS sensors or through bump-bonding to planar sensors. Recent R&D achievements include results from beam tests with all types of hybrid assemblies. Simulations based on Geant4 and TCAD are used to validate the experimental results and to assess and optimise the performance of various detector designs.

  4. Hardware solutions for the 65k pixel X-ray camera module of 75 μm pixel size

    NASA Astrophysics Data System (ADS)

    Kasinski, K.; Maj, P.; Grybos, P.; Koziol, A.

    2016-02-01

    We present three hardware solutions designed for a detector module built with a 2 cm × 2 cm hybrid pixel detector built from a single 320 or 450 μ m thick silicon sensor designed and fabricated by Hamamatsu and two UFXC32k readout integrated circuits (128 × 256 pixels with 75μ m pitch, designed in CMOS 130 nm at AGH-UST). The chips work in a single photon counting mode and provide ultra-fast X-ray imaging. The presented hardware modules are designed according to requirements of various tests and applications: ṡDevice A: a fast and flexible system for tests with various radiation sources. ṡDevice B: a standalone, all-in-one imaging device providing three standard interfaces (USB 2.0, Ethernet, Camera Link) and up to 640 MB/s bandwidth. ṡDevice C: a prototype large-area imaging system. The paper shows the readout system structure for each case with highlighted circuit board designs with details on power distribution and cooling on both FR4 and LTCC (low temperature co-fired ceramic) based circuits.

  5. PIXELS: Using field-based learning to investigate students' concepts of pixels and sense of scale

    NASA Astrophysics Data System (ADS)

    Pope, A.; Tinigin, L.; Petcovic, H. L.; Ormand, C. J.; LaDue, N.

    2015-12-01

    Empirical work over the past decade supports the notion that a high level of spatial thinking skill is critical to success in the geosciences. Spatial thinking incorporates a host of sub-skills such as mentally rotating an object, imagining the inside of a 3D object based on outside patterns, unfolding a landscape, and disembedding critical patterns from background noise. In this study, we focus on sense of scale, which refers to how an individual quantified space, and is thought to develop through kinesthetic experiences. Remote sensing data are increasingly being used for wide-reaching and high impact research. A sense of scale is critical to many areas of the geosciences, including understanding and interpreting remotely sensed imagery. In this exploratory study, students (N=17) attending the Juneau Icefield Research Program participated in a 3-hour exercise designed to study how a field-based activity might impact their sense of scale and their conceptions of pixels in remotely sensed imagery. Prior to the activity, students had an introductory remote sensing lecture and completed the Sense of Scale inventory. Students walked and/or skied the perimeter of several pixel types, including a 1 m square (representing a WorldView sensor's pixel), a 30 m square (a Landsat pixel) and a 500 m square (a MODIS pixel). The group took reflectance measurements using a field radiometer as they physically traced out the pixel. The exercise was repeated in two different areas, one with homogenous reflectance, and another with heterogeneous reflectance. After the exercise, students again completed the Sense of Scale instrument and a demographic survey. This presentation will share the effects and efficacy of the field-based intervention to teach remote sensing concepts and to investigate potential relationships between students' concepts of pixels and sense of scale.

  6. 4 pi direction sensitive gamma imager with RENA-3 readout ASIC

    NASA Astrophysics Data System (ADS)

    Du, Yanfeng; Li, Wen; Yanoff, Brian; Gordon, Jeffrey; Castleberry, Donald

    2007-09-01

    A 4π direction-sensitive gamma imager is presented, using a 1 cm 3 3D CZT detector from Yinnel Tech and the RENA-3 readout ASIC from NOVA R&D. The measured readout system electronic noise is around 4-5 keV FWHM for all anode channels. The measured timing resolution between two channels within a single ASIC is around 10 ns and the resolution is 30 ns between two separate ASIC chips. After 3D material non-uniformity and charge trapping corrections, the measured single-pixel-event energy resolution is around 1% for Cs-137 at 662 keV using a 1 cm 3 CZT detector from Yinnel Tech with an 8 x 8 anode pixel array at 1.15 mm pitch. The energy resolution for two pixel events is 2.9%. A 10 uCi Cs-137 point source was moved around the detector to test the image reconstruction algorithms and demonstrate the source direction detection capability. Accurate source locations were reconstructed with around 200 two-pixel events within a total energy window +/-10 keV around the 662 keV full energy peak. The angular resolution FWHM at four of the five positions tested was between 0.05-0.07 steradians.

  7. Efficient readout electronics for multi-anode photomultiplier

    NASA Astrophysics Data System (ADS)

    Lerche, Christoph W.; Herrero-Bosch, Vicente; Ferrando-Jodar, Nestor; Gadea-Girones, Rafa; Sanchez-Martinez, Filomeno; Mora-Más, Francisco J.

    2010-08-01

    We present a novel active and analog readout and preprocessing topology for position sensitive photodetectors (PSPD) that allows to readout a large variety of PSPD devices with different pixel numbers. Additionally, the topology was designed to allow for a significant reduction of analog-to-digital conversion channels. The circuit topology replaces the common passive charge divider and consists of N input stages, N × M weighting stages and M analog adder stages, where N is the number of the input channels, i.e. the number of photodetector pixels and M is the number of outputs. The circuit performs the multiplication of a matrix (the weights) with a vector (signals). For this, the input stage makes M copies of each of the N input signals, the weighting stage multiplies these signal copies with N × M different weights and the output stage adds all weighted copies with the same copy index. For high flexibility, the weights are programmable and the topology allows to interconnect several identical circuits for larger N. Measurements with a first prototype ASIC show that the achieved energy and centroid resolutions equal the resolutions from detectors with passive charge division circuits. However, the presented topology presents important advantages such as scalability. As a first application, we used the prototype ASIC to correct the sensitivity inhomogeneity of position sensitive photomultiplier tubes. As a second application for the circuit, we present a Neural Network based positioning scheme for γ-ray imaging detectors with thick, monolithic scintillation crystals. This allows to correct the strong border artifacts of the center of gravity positioning scheme in monolithic scintillation crystals and thus enhances the spatial resolution of the γ-ray imaging detector.

  8. Readout architecture for sub-nanosecond resolution TDC

    NASA Astrophysics Data System (ADS)

    Marteau, J.; Carlus, B.; Gardien, S.; Girerd, C.; Ianigro, J.-C.; Montorio, J.-L.; Gibert, D.; Nicollin, F.

    2012-04-01

    The DIAPHANE project is pluri-disciplinary collaboration between particle physicists and geophysicists to perform the tomography of large geological structure mainly devoted to the study of active volcanoes. The detector used for this tomography, hereafter referred to as telescope, uses a standard, robust, cost-effective and well-known technology based on solid plastic scintillator readout by photomultiplier(s) (either multichannel pixelized PM or silicon PM). The electronics system is built on the concept of autonomous, triggerless, smart sensor directly connected on a standard fast Ethernet network. First radiographies have been performed on the Mont-Terri underground laboratory (St-Ursanne, Switzerland) and on the active volcano of La Soufrière (Guadeloupe, Lesser Antilles, France). We present an upgrade of the readout architecture allowing to embed a sub-nanosecond resolution TDC within the existing programmable logic to help in the background rejection (rear flux, random coincidences) and to improve the detection purity and the radiography quality. First results obtained are also presented and briefly discussed.

  9. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors

    PubMed Central

    El-Mohri, Youcef; Antonuk, Larry E.; Koniczek, Martin; Zhao, Qihua; Li, Yixin; Street, Robert A.; Lu, Jeng-Ping

    2009-01-01

    factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of ∼560 e (rms) for PSI-3. PMID:19673229

  10. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors.

    PubMed

    El-Mohri, Youcef; Antonuk, Larry E; Koniczek, Martin; Zhao, Qihua; Li, Yixin; Street, Robert A; Lu, Jeng-Ping

    2009-07-01

    optical fill factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of approximately 560 e (rms) for PSI-3.

  11. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors

    SciTech Connect

    El-Mohri, Youcef; Antonuk, Larry E.; Koniczek, Martin; Zhao Qihua; Li Yixin; Street, Robert A.; Lu Jengping

    2009-07-15

    fill factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of {approx}560 e (rms) for PSI-3.

  12. From Pixels to Planets

    NASA Technical Reports Server (NTRS)

    Brownston, Lee; Jenkins, Jon M.

    2015-01-01

    The Kepler Mission was launched in 2009 as NASAs first mission capable of finding Earth-size planets in the habitable zone of Sun-like stars. Its telescope consists of a 1.5-m primary mirror and a 0.95-m aperture. The 42 charge-coupled devices in its focal plane are read out every half hour, compressed, and then downlinked monthly. After four years, the second of four reaction wheels failed, ending the original mission. Back on earth, the Science Operations Center developed the Science Pipeline to analyze about 200,000 target stars in Keplers field of view, looking for evidence of periodic dimming suggesting that one or more planets had crossed the face of its host star. The Pipeline comprises several steps, from pixel-level calibration, through noise and artifact removal, to detection of transit-like signals and the construction of a suite of diagnostic tests to guard against false positives. The Kepler Science Pipeline consists of a pipeline infrastructure written in the Java programming language, which marshals data input to and output from MATLAB applications that are executed as external processes. The pipeline modules, which underwent continuous development and refinement even after data started arriving, employ several analytic techniques, many developed for the Kepler Project. Because of the large number of targets, the large amount of data per target and the complexity of the pipeline algorithms, the processing demands are daunting. Some pipeline modules require days to weeks to process all of their targets, even when run on NASA's 128-node Pleiades supercomputer. The software developers are still seeking ways to increase the throughput. To date, the Kepler project has discovered more than 4000 planetary candidates, of which more than 1000 have been independently confirmed or validated to be exoplanets. Funding for this mission is provided by NASAs Science Mission Directorate.

  13. Beam test characterization of CMS silicon pixel detectors for the phase-1 upgrade

    NASA Astrophysics Data System (ADS)

    Korol, I.

    2015-10-01

    The Silicon Pixel Detector forms the innermost part of the CMS tracking system and is critical to track and vertex reconstruction. Being in close proximity to the beam interaction point, it is exposed to the highest radiation levels in the silicon tracker. In order to preserve the tracking performance with the LHC luminosity increase which is foreseen for the next years, the CMS collaboration has decided to build a new pixel detector with four barrel layers mounted around a reduced diameter beam pipe, as compared to the present three layer pixel detector in the central region. A new digital version of the front-end readout chip has been designed and tested; it has increased data buffering and readout link speed to maintain high efficiency at increasing occupancy. In addition, it offers lower charge thresholds that will improve the tracking efficiency and position resolution. Single chip modules have been evaluated in the DESY electron test beam in terms of charge collection, noise, tracking efficiency and position resolution before and after irradiation with 24 GeV protons from the CERN Proton Synchroton equivalent to the fluence expected after 500 fb-1 of integrated luminosity in the fourth layer of the pixel tracker. High efficiency and an excellent position resolution have been observed which are well maintained even after the proton irradiation. The results are well described by the CMS pixel detector simulation.

  14. Design of an ultra low power CMOS pixel sensor for a future neutron personal dosimeter

    SciTech Connect

    Zhang, Y.; Hu-Guo, C.; Husson, D.; Hu, Y.

    2011-07-01

    Despite a continuously increasing demand, neutron electronic personal dosimeters (EPDs) are still far from being completely established because their development is a very difficult task. A low-noise, ultra low power consumption CMOS pixel sensor for a future neutron personal dosimeter has been implemented in a 0.35 {mu}m CMOS technology. The prototype is composed of a pixel array for detection of charged particles, and the readout electronics is integrated on the same substrate for signal processing. The excess electrons generated by an impinging particle are collected by the pixel array. The charge collection time and the efficiency are the crucial points of a CMOS detector. The 3-D device simulations using the commercially available Synopsys-SENTAURUS package address the detailed charge collection process. Within a time of 1.9 {mu}s, about 59% electrons created by the impact particle are collected in a cluster of 4 x 4 pixels with the pixel pitch of 80 {mu}m. A charge sensitive preamplifier (CSA) and a shaper are employed in the frond-end readout. The tests with electrical signals indicate that our prototype with a total active area of 2.56 x 2.56 mm{sup 2} performs an equivalent noise charge (ENC) of less than 400 e - and 314 {mu}W power consumption, leading to a promising prototype. (authors)

  15. A low-noise CMOS pixel direct charge sensor, Topmetal-II-

    NASA Astrophysics Data System (ADS)

    An, Mangmang; Chen, Chufeng; Gao, Chaosong; Han, Mikyung; Ji, Rong; Li, Xiaoting; Mei, Yuan; Sun, Quan; Sun, Xiangming; Wang, Kai; Xiao, Le; Yang, Ping; Zhou, Wei

    2016-02-01

    We report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35 μm CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly collect charge. Each pixel contains a low-noise charge-sensitive preamplifier to establish the analog signal and a discriminator with tunable threshold to generate hits. The analog signal from each pixel is accessible through time-shared multiplexing over the entire array. Hits are read out digitally through a column-based priority logic structure. Tests show that the sensor achieved a < 15e- analog noise and a 200e- minimum threshold for digital readout per pixel. The sensor is capable of detecting both electrons and ions drifting in gas. These characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments.

  16. A low-noise CMOS pixel direct charge sensor, Topmetal-II-

    DOE PAGES

    An, Mangmang; Chen, Chufeng; Gao, Chaosong; ...

    2015-12-12

    In this paper, we report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35 μm CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly collect charge. Each pixel contains a low-noise charge-sensitive preamplifier to establish the analog signal and a discriminator with tunable threshold to generate hits. The analog signal from each pixel is accessible through time-shared multiplexing over the entire array. Hits are read out digitally through a column-based priority logic structure. Tests show that the sensor achieved a <15e- analog noise andmore » a 200e- minimum threshold for digital readout per pixel. The sensor is capable of detecting both electrons and ions drifting in gas. Lastly, these characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments.« less

  17. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    NASA Astrophysics Data System (ADS)

    La Rosa, A.; Gallrapp, C.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.; Weigell, P.

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neq cm-2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  18. A low-noise CMOS pixel direct charge sensor, Topmetal-II-

    SciTech Connect

    An, Mangmang; Chen, Chufeng; Gao, Chaosong; Han, Mikyung; Ji, Rong; Li, Xiaoting; Mei, Yuan; Sun, Quan; Sun, Xiangming; Wang, Kai; Xiao, Le; Yang, Ping; Zhou, Wei

    2015-12-12

    In this paper, we report the design and characterization of a CMOS pixel direct charge sensor, Topmetal-II-, fabricated in a standard 0.35 μm CMOS Integrated Circuit process. The sensor utilizes exposed metal patches on top of each pixel to directly collect charge. Each pixel contains a low-noise charge-sensitive preamplifier to establish the analog signal and a discriminator with tunable threshold to generate hits. The analog signal from each pixel is accessible through time-shared multiplexing over the entire array. Hits are read out digitally through a column-based priority logic structure. Tests show that the sensor achieved a <15e- analog noise and a 200e- minimum threshold for digital readout per pixel. The sensor is capable of detecting both electrons and ions drifting in gas. Lastly, these characteristics enable its use as the charge readout device in future Time Projection Chambers without gaseous gain mechanism, which has unique advantages in low background and low rate-density experiments.

  19. Event building for free-streaming readout in the CBM experiment

    NASA Astrophysics Data System (ADS)

    Korolko, I. E.; Prokudin, M. S.; Zaitsev, Yu M.

    2017-01-01

    CBM is the first experiment gaining advantage of free-streaming triggerless readout system. All readout channels of the detector going to work in self triggered mode. Dedicated methods are developed to extract individual events (collisions) from continuous information stream rejecting noise. Efficiency of the methods depends on projectile energy, masses of colliding nucleons, interaction and accelerator frequencies. Quality control of the algorithms and comparison of the methods require special efforts.

  20. Integration and testing of the DAQ system for the CMS Phase 1 pixel upgrade

    NASA Astrophysics Data System (ADS)

    Akgün, B.

    2017-02-01

    The CMS pixel detector phase 1 upgrade in 2017 requires an upgraded data acquisition (DAQ) system to accept higher data rates. A new DAQ system has been developed based on a combination of custom and standard μTCA parts. Custom mezzanines on FC7 AMCs [1] provide a front-end driver for readout, and a front-end controller for configuration, clock and trigger. The DAQ system is undergoing a series of integration tests including readout of the pilot pixel detector already installed in CMS, checkout of the phase 1 detector during its assembly, and testing with the CMS central DAQ. This paper describes the DAQ system, integration tests and results, and an outline of the activities up to commissioning the final system at CMS in 2017.

  1. High-Sensitivity X-ray Polarimetry with Amorphous Silicon Active-Matrix Pixel Proportional Counters

    NASA Technical Reports Server (NTRS)

    Black, J. K.; Deines-Jones, P.; Jahoda, K.; Ready, S. E.; Street, R. A.

    2003-01-01

    Photoelectric X-ray polarimeters based on pixel micropattern gas detectors (MPGDs) offer order-of-magnitude improvement in sensitivity over more traditional techniques based on X-ray scattering. This new technique places some of the most interesting astronomical observations within reach of even a small, dedicated mission. The most sensitive instrument would be a photoelectric polarimeter at the focus of 2 a very large mirror, such as the planned XEUS. Our efforts are focused on a smaller pathfinder mission, which would achieve its greatest sensitivity with large-area, low-background, collimated polarimeters. We have recently demonstrated a MPGD polarimeter using amorphous silicon thin-film transistor (TFT) readout suitable for the focal plane of an X-ray telescope. All the technologies used in the demonstration polarimeter are scalable to the areas required for a high-sensitivity collimated polarimeter. Leywords: X-ray polarimetry, particle tracking, proportional counter, GEM, pixel readout

  2. ATLAS Pixel Detector ROD card from IBL towards Layers 2 and 1

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Falchieri, D.; Gabrielli, A.; Lama, L.; Giangiacomi, N.; Travaglini, R.

    2016-01-01

    The incoming and future upgrades of LHC will require better performance by the data acquisition system, especially in terms of throughput due to the higher luminosity that is expected. For this reason, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector has been equipped with a fourth layer— the Insertable B-Layer or IBL—located at a radius smaller than the present three layers. To read out the new layer of pixels, with a smaller pixel size with respect to the other outer layers, a front end ASIC (FE-I4) was designed as well as a new off-detector read-out chain. The latter, accordingly to the structure of the other layers of pixels, is composed mainly of two 9U-VME read-out off-detector cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Another production of 15 ROD cards was done in Fall 2013, and commissioning was completed in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards were produced for a total initial batch of 20 boards. This paper describes some integration tests that were performed and our plan to install the new DAQ chain for the layer 2, which is the outermost, and layer 1, which is external to the B-layer. This latter is the only layer that will not be upgraded to a higher readout speed. Rather, it will be switched off in the near future as it has too many damaged sensors that were not possible to rework. To do that, slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. Thus, this contribution reports also how the adoption of the IBL ROD for ATLAS Pixel

  3. An ac bridge readout for bolometric detectors

    NASA Technical Reports Server (NTRS)

    Rieke, F. M.; Lange, A. E.; Beeman, J. W.; Haller, E. E.

    1989-01-01

    The authors have developed a bolometer readout circuit which greatly improves the low-frequency stability of bolometric detectors. The circuit uses an ac bias voltage and two matched bolometers and allows stable dc bolometer operation for integration times greater than 10 s. In astronomical applications the readout allows for qualitatively different observation modes (e.g. staring or slow-drift scanning) which are particularly well suited for space observations and for the use of arrays. In many applications the readout can increase sensitivity. The authors present noise spectra for 4He temperature bolometers with no excess noise at frequencies greater than 0.1 Hz. The measured optical responsivity of a bolometer operated with the present readout is the same as that of a bolometer operated with a conventional readout.

  4. Results from a prototype MAPS sensor telescope and readout system with zero suppression for the heavy flavor tracker at STAR

    NASA Astrophysics Data System (ADS)

    Greiner, L.; Matis, H. S.; Ritter, H. G.; Rose, A.; Stezelberger, T.; Sun, X.; Szelezniak, M.; Thomas, J.; Vu, C.; Wieman, H.

    2008-05-01

    We describe a three Mimostar-2 Monolithic Active Pixel Sensor (MAPS) sensor telescope prototype with an accompanying readout system incorporating on-the-fly data sparsification. The system has been characterized and we report on the measured performance of the sensor telescope and readout system in beam tests conducted both at the Advanced Light Source (ALS) at Lawrence Berkeley National Laboratory (LBNL) and in the STAR experiment at the Relativistic Heavy Ion Collider (RHIC). This effort is part of the development and prototyping work that will lead to a vertex detector for the STAR experiment.

  5. CMOS Hybrid Pixel Detectors for Scientific, Industrial and Medical Applications

    NASA Astrophysics Data System (ADS)

    Broennimann, Christian

    2009-03-01

    Crystallography is the principal technique for determining macromolecular structures at atomic resolution and uses advantageously the high intensity of 3rd generation synchrotron X-ray sources . Macromolecular crystallography experiments benefit from excellent beamline equipment, recent software advances and modern X-ray detectors. However, the latter do not take full advantage of the brightness of modern synchrotron sources. CMOS Hybrid pixel array detectors, originally developed for high energy physics experiments, meet these requirements. X-rays are recorded in single photon counting mode and data thus are stored digitally at the earliest possible stage. This architecture leads to several advantages over current detectors: No detector noise is added to the signal. Readout time is reduced to a few milliseconds. The counting rates are matched to beam intensities at protein crystallography beamlines at 3rd generation synchrotrons. The detector is not sensitive to X-rays during readout; therefore no mechanical shutter is required. The detector has a very sharp point spread function (PSF) of one pixel, which allows better resolution of adjacent reflections. Low energy X-rays can be suppressed by the comparator At the Paul Scherrer Institute (PSI) in Switzerland the first and largest array based on this technology was constructed: The Pilatus 6M detector. The detector covers an area of 43.1 x 44.8 cm2 , has 6 million pixels and is read out noise free in 3.7 ms. Since June 2007 the detector is in routine operation at the beamline 6S of the Swiss Light Source (SLS). The company DETCRIS Ltd, has licensed the technology from PSI and is commercially offering the PILATUS detectors. Examples of the wide application range of the detectors will be shown.

  6. Multiple-gain-ranging readout method to extend the dynamic range of amorphous silicon flat-panel imagers

    NASA Astrophysics Data System (ADS)

    Roos, Pieter G.; Colbeth, Richard E.; Mollov, Ivan; Munro, Peter; Pavkovich, John; Seppi, Edward J.; Shapiro, Edward G.; Tognina, Carlo A.; Virshup, Gary F.; Yu, J. Micheal; Zentai, George; Kaissl, Wolfgang; Matsinos, Evangelos; Richters, Jeroen; Riem, Heinrich

    2004-05-01

    The dynamic range of many flat panel imaging systems are fundamentally limited by the dynamic range of the charge amplifier and readout signal processing. We developed two new flat panel readout methods that achieve extended dynamic range by changing the read out charge amplifier feedback capacitance dynamically and on a real-time basis. In one method, the feedback capacitor is selected automatically by a level sensing circuit, pixel-by-pixel, based on its exposure level. Alternatively, capacitor selection is driven externally, such that each pixel is read out two (or more) times, each time with increased feedback capacitance. Both methods allow the acquisition of X-ray image data with a dynamic range approaching the fundamental limits of flat panel pixels. Data with an equivalent bit depth of better than 16 bits are made available for further image processing. Successful implementation of these methods requires careful matching of selectable capacitor values and switching thresholds, with the imager noise and sensitivity characteristics, to insure X-ray quantum limited operation over the whole extended dynamic range. Successful implementation also depends on the use of new calibration methods and image reconstruction algorithms, to insure artifact free rebuilding of linear image data by the downstream image processing systems. The multiple gain ranging flat panel readout method extends the utility of flat panel imagers and paves the way to new flat panel applications, such as cone beam CT. We believe that this method will provide a valuable extension to the clinical application of flat panel imagers.

  7. Timepix3: first measurements and characterization of a hybrid-pixel detector working in event driven mode

    NASA Astrophysics Data System (ADS)

    Frojdh, E.; Campbell, M.; De Gaspari, M.; Kulis, S.; Llopart, X.; Poikela, T.; Tlustos, L.

    2015-01-01

    Timepix3 is a hybrid pixel detector readout chip. It features a data driven readout mode where the chip sends out a data packet containing pixel coordinate, time over threshold and time of arrival immediately after the hit is processed by the pixel. The maximum hit rate is 40 Mhits/cm2/s with a minimum time step in the arrival time measurement of 1.56 ns. The pixel matrix consist of 256 × 256 square pixels at a 55 μm pitch and the pixel front end noise is 61 e- RMS. In this paper we present the first radiation measurements with Timepix3 bump bonded to a 300 μm thick silicon sensor. The chip is calibrated per pixel, using internal test pulses and the calibration is verified using X-ray fluorescence. The energy resolution, threshold dispersion and gain dispersion is measured. The energy resolution in time over threshold mode under normal operation conditions is 4.07 keV FWHM at 59.5 keV. At 10.5 keV an energy resolution of 0.72 keV FWHM was achieved in photon counting mode and in time over threshold mode, by optimizing the energy response, we achieved a 1.38 keV FWHM. We also investigate the time walk and present first results on using the time information for track reconstruction.

  8. FITPix data preprocessing pipeline for the Timepix single particle pixel detector

    NASA Astrophysics Data System (ADS)

    Kraus, V.; Holik, M.; Jakubek, J.; Georgiev, V.

    2012-04-01

    The semiconductor pixel detector Timepix contains an array of 256 × 256 square pixels with a pitch of 55 μm. The single quantum counting detector Timepix can also provide information about the energy or arrival time of a particle from every single pixel. This device is a powerful tool for radiation imaging and ionizing particle tracking. The Timepix device can be read-out via a serial or parallel interface enabling speeds of 100 fps or 3200 fps, respectively. The device can be connected to a PC via the USB 2.0 based interface FITPix, which currently supports the serial output of Timepix reaching a speed of 90 fps. FITPix supports adjustable clock frequency and hardware triggering which is a useful tool for the synchronized operation of multiple devices. The FITPix interface can handle up to 16 detectors in daisy chain. The complete system including the FITPix interface and Timepix detector is controlled from the PC by the Pixelman software package. A pipeline structure is now implemented in the new version of the readout interface of FITPix. This version also supports parallel Timepix readout. The pipeline architecture brings the possibility of data preprocessing directly in the hardware. The first pipeline stage converts the raw Timepix data into the form of a matrix or stream of pixel values. Another stage performs further data processing such as event thresholding and data compression. Complex data processing currently performed by Pixelman in the PC is significantly reduced in this way. The described architecture together with the parallel readout increases data throughput reaching a higher frame-rate and reducing the dead time. Significant data compression is performed directly in the hardware especially for sparse data sets from particle tracking applications. The data frame size is typically compressed by factor of 10-100.

  9. On Certain New Methodology for Reducing Sensor and Readout Electronics Circuitry Noise in Digital Domain

    NASA Technical Reports Server (NTRS)

    Kizhner, Semion; Miko, Joseph; Bradley, Damon; Heinzen, Katherine

    2008-01-01

    NASA Hubble Space Telescope (HST) and upcoming cosmology science missions carry instruments with multiple focal planes populated with many large sensor detector arrays. These sensors are passively cooled to low temperatures for low-level light (L3) and near-infrared (NIR) signal detection, and the sensor readout electronics circuitry must perform at extremely low noise levels to enable new required science measurements. Because we are at the technological edge of enhanced performance for sensors and readout electronics circuitry, as determined by thermal noise level at given temperature in analog domain, we must find new ways of further compensating for the noise in the signal digital domain. To facilitate this new approach, state-of-the-art sensors are augmented at their array hardware boundaries by non-illuminated reference pixels, which can be used to reduce noise attributed to sensors. There are a few proposed methodologies of processing in the digital domain the information carried by reference pixels, as employed by the Hubble Space Telescope and the James Webb Space Telescope Projects. These methods involve using spatial and temporal statistical parameters derived from boundary reference pixel information to enhance the active (non-reference) pixel signals. To make a step beyond this heritage methodology, we apply the NASA-developed technology known as the Hilbert- Huang Transform Data Processing System (HHT-DPS) for reference pixel information processing and its utilization in reconfigurable hardware on-board a spaceflight instrument or post-processing on the ground. The methodology examines signal processing for a 2-D domain, in which high-variance components of the thermal noise are carried by both active and reference pixels, similar to that in processing of low-voltage differential signals and subtraction of a single analog reference pixel from all active pixels on the sensor. Heritage methods using the aforementioned statistical parameters in the

  10. Direct read-out CMOS camera with applications to full-field optical coherence tomography

    NASA Astrophysics Data System (ADS)

    Egan, Patrick; Lakestani, Fereydoun; Whelan, Maurice P.; Connelly, Michael J.

    2005-06-01

    A comprehensive characterisation of a complementary metal-oxide semiconductor (CMOS) and digital signal processor (DSP) camera, used typically in machine vision applications, is presented in this paper. The camera consists of a direct read-out CMOS sensor, each pixel giving a direct analogue voltage output related to light intensity, with an analogue-to-digital converter and digital signal processor on the back-end. The camera operates as a stand-alone device using a VGA display; code being pre-programmed to the onboard random access memory of the DSP. High detection rates (kHz) on multiple pixels were achieved, and the relationship between pixel response time and light intensity was quantified. The CMOS sensor, with 1024x1024 pixels randomly addressable in space and time, demonstrated a dynamic logarithmic light intensity sensitivity range of 120dB. Integrating the CMOS camera with a low coherence Michelson interferometer, optical coherence tomography (OCT) axial depth scans have been acquired. The intended application is an imaging device for simple yet functional full-field optical coherence tomography. The advantages of the CMOS sensor are the potential for carrier-based detection, through the very fast pixel response with under-sampling, and the elimination of the electromechanical lateral scanning of conventional OCT by replacing it with electronic pixel scanning.

  11. A 130 nm ASIC prototype for the NA62 Gigatracker readout

    NASA Astrophysics Data System (ADS)

    Dellacasa, G.; Garbolino, S.; Marchetto, F.; Martoiu, S.; Mazza, G.; Rivetti, A.; Wheadon, R.

    2011-09-01

    One of the most challenging detectors of the NA62 experiment is the silicon tracker, called Gigatracker. It consists of three hybrid silicon pixel stations, each one covering an area of 27 mm×60 mm. While the maximum pixel size is fairly large, 300 μm×300 μm the system has to sustain a very high particle rate, 1.5 MHz/mm 2, which corresponds to 800 MHz for each station. To obtain an efficient tracking with such a high rate the required track timing resolution is 150 ps (rms). Therefore the front-end ASIC should provide for each pixel a 200 ps time measurement capability, thus leading to the requirement of time walk compensation and very compact TDCs. Moreover, Single Event Upset protection has to be implemented in order to protect the digital circuitry. An ASIC prototype has been realized in CMOS 130 nm technology, containing three pixel columns. The chip performs the time walk compensation by a Constant Fraction Discriminator circuit, while the time measurement is performed by a Time to Amplitude Converter based TDC, both of them implemented on each pixel cell. The End of Column circuit containing only digital logic is responsible for the data readout from the pixel cell. The whole chip works with a system clock of 160 MHz and the digital logic is SEU protected by the use of Hamming codes. The detailed architecture of the ASIC prototype and test results are presented.

  12. Single Pixel Characterization of X-Ray TES Microcalorimeter Under AC Bias at MHz Frequencies

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; Blandler, S. R.; Porter, F. S.; Sadleir, J. E.; Kilbourne, C. A.; Bailey, C. N.; Finkbeiner, F. M.; Chervenak, J. A.; Adams, J. S.; Eckart, M. E.; hide

    2012-01-01

    In this paper we present the progress made at SRON in the read-out of GSFC x-ray transition-edge sensor (TES) micro-calorimeters in the frequency domain. The experiments reported so far, whose aim was to demonstrate an energy resolution of 2eV at 6 keV with a TES acting as a modulator, were carried out at frequencies below 700 kHz using a standard flux locked loop (FLL) SQUID read-out scheme. The TES read-out suffered from the use of sub-optimal circuit components, large parasitic inductances, low quality factor resonators and poor magnetic field shielding. We have developed a novel experimental set-up, which allows us to test several read-out schemes in a single cryogenic run. In this set-up, the TES pixels are coupled via superconducting transformers to 18 high-Q lithographic LC filters with resonant frequencies ranging between 2 and 5 MHz. The signal is amplified by a two-stage SQUID current sensor and baseband feedback is used to overcome the limited SQUID dynamic range. We study the single pixel performance as a function of TES bias frequency, voltage and perpendicular magnetic field.

  13. On the accuracy of pixel relaxation labeling

    NASA Technical Reports Server (NTRS)

    Richards, J. A.; Landgrebe, D. A.; Swain, P. H.

    1981-01-01

    An analysis of pixel labeling by probabilistic relaxation techniques is presented to demonstrate that these labeling procedures degenerate to weighted averages in the vicinity of fixed points. A consequence of this is that undesired label conversions can occur, leading to a deterioration of labeling accuracy at a stage after an improvement has already been achieved. Means for overcoming the accuracy deterioration are suggested and used as the basis for a possible design strategy for using probabilistic relaxation procedures. The results obtained are illustrated using simple data sets in which labeling on individual pixels can be examined and also using Landsat imagery to show application to data typical of that encountered in remote sensing applications.

  14. Integrator Based Readout in Tile Calorimeter of the ATLAS Experiment

    NASA Astrophysics Data System (ADS)

    González Parra, Garoé; ATLAS Collaboration

    TileCal is the Barrel hadronic calorimeter of the ATLAS experiment at LHC/CERN. To equalize the response of individual TileCal cells with a precision better than 1% and to monitor the response of each cell over time, a calibration and monitoring system based on a Cs137 radioactive source driven through the calorimeter volume by liquid flow has been implemented. This calibration system relies on a dedicated readout chain based on slow integrators that read currents from the TileCal photomultipliers integrating over milliseconds during the calibration runs. Moreover, during the LHC collisions the TileCal integrator based readout provides the signal coming from inelastic proton-proton collisions at low momentum transfer. This is used to monitor in ATLAS the instantaneous luminosity as well as the response of all calorimeter cells during data-taking.

  15. Local Pixel Bundles: Bringing the Pixels to the People

    NASA Astrophysics Data System (ADS)

    Anderson, Jay

    2014-12-01

    The automated galaxy-based alignment software package developed for the Frontier Fields program (hst2galign, see Anderson & Ogaz 2014 and http://www.stsci.edu/hst/campaigns/frontier-fields/) produces a direct mapping from the pixels of the flt frame of each science exposure into a common master frame. We can use these mappings to extract the flt-pixels in the vicinity of a source of interest and package them into a convenient "bundle". In addition to the pixels, this data bundle can also contain "meta" information that will allow users to transform positions from the flt pixels to the reference frame and vice-versa. Since the un-resampled pixels in the flt frames are the only true constraints we have on the astronomical scene, the ability to inter-relate these pixels will enable many high-precision studies, such as: point-source-fitting and deconvolution with accurate PSFs, easy exploration of different image-combining algorithms, and accurate faint-source finding and photometry. The data products introduced in this ISR are a very early attempt to provide the flt-level pixel constraints in a package that is accessible to more than the handful of experts in HST astrometry. The hope is that users in the community might begin using them and will provide feedback as to what information they might want to see in the bundles and what general analysis packages they might find useful. For that reason, this document is somewhat informally written, since I know that it will be modified and updated as the products and tools are optimized.

  16. CCD readout electronics for the Subaru Prime Focus Spectrograph

    NASA Astrophysics Data System (ADS)

    Hope, Stephen C.; Gunn, James E.; Loomis, Craig P.; Fitzgerald, Roger E.; Peacock, Grant O.

    2014-07-01

    The following paper details the design for the CCD readout electronics for the Subaru Telescope Prime Focus Spectrograph (PFS). PFS is designed to gather spectra from 2394 objects simultaneously, covering wavelengths that extend from 380 nm to 1260 nm. The spectrograph is comprised of four identical spectrograph modules, each collecting roughly 600 spectra. The spectrograph modules provide simultaneous wavelength coverage over the entire band through the use of three separate optical channels: blue, red, and near infrared (NIR). A camera in each channel images the multi-object spectra onto a 4k × 4k, 15 μm pixel, detector format. The two visible cameras use a pair of Hamamatsu 2k × 4k CCDs with readout provided by custom electronics, while the NIR camera uses a single Teledyne HgCdTe 4k × 4k detector and Teledyne's ASIC Sidecar to read the device. The CCD readout system is a custom design comprised of three electrical subsystems - the Back End Electronics (BEE), the Front End Electronics (FEE), and a Pre-amplifier. The BEE is an off-the-shelf PC104 computer, with an auxiliary Xilinx FPGA module. The computer serves as the main interface to the Subaru messaging hub and controls other peripheral devices associated with the camera, while the FPGA is used to generate the necessary clocks and transfer image data from the CCDs. The FEE board sets clock biases, substrate bias, and CDS offsets. It also monitors bias voltages, offset voltages, power rail voltage, substrate voltage and CCD temperature. The board translates LVDS clock signals to biased clocks and returns digitized analog data via LVDS. Monitoring and control messages are sent from the BEE to the FEE using a standard serial interface. The Pre-amplifier board resides behind the detectors and acts as an interface to the two Hamamatsu CCDs. The Pre-amplifier passes clocks and biases to the CCDs, and analog CCD data is buffered and amplified prior to being returned to the FEE. In this paper we describe the

  17. Optical readout of uncooled thermal detectors

    NASA Astrophysics Data System (ADS)

    Datskos, Panos G.; Rajic, Slobodan; Senesac, Larry R.; Earl, Dennis D.; Evans, Boyd M., III; Corbeil, James L.; Datskou, Irene

    2000-12-01

    We investigated microposition sensing of micro-electro- mechanical systems (MEMS) that is based on optical readout techniques. We determined the parameters that affect or limit the performance of optical readout techniques especially as they apply to detection of infrared radiation. Such microposition sensing schemes are very important as readout mechanisms for large arrays of microstructures which are required for imaging. In addition, we explored the performance of uncooled micromechanical IR sensors using Fresnel zone plates (FZP). This type of diffractive feature diffracts along the optical axis and not perpendicular to that axis. We found that temperature fluctuation noise and background fluctuation noise, are currently the limits to the performance of uncooled micromechanical IR detectors. The noise at the output of the optical readout includes amplified noise from the micromechanical structures and noise added by the optical readout itself. However, the added noise is negligible compared to the amplified temperature fluctuation noise inherent in the microstructures. In this context an optical readout is nearly an ideal, noiseless readout method.

  18. 3D track reconstruction capability of a silicon hybrid active pixel detector

    NASA Astrophysics Data System (ADS)

    Bergmann, Benedikt; Pichotka, Martin; Pospisil, Stanislav; Vycpalek, Jiri; Burian, Petr; Broulim, Pavel; Jakubek, Jan

    2017-06-01

    Timepix3 detectors are the latest generation of hybrid active pixel detectors of the Medipix/Timepix family. Such detectors consist of an active sensor layer which is connected to the readout ASIC (application specific integrated circuit), segmenting the detector into a square matrix of 256 × 256 pixels (pixel pitch 55 μm). Particles interacting in the active sensor material create charge carriers, which drift towards the pixelated electrode, where they are collected. In each pixel, the time of the interaction (time resolution 1.56 ns) and the amount of created charge carriers are measured. Such a device was employed in an experiment in a 120 GeV/c pion beam. It is demonstrated, how the drift time information can be used for "4D" particle tracking, with the three spatial dimensions and the energy losses along the particle trajectory (dE/dx). Since the coordinates in the detector plane are given by the pixelation ( x, y), the x- and y-resolution is determined by the pixel pitch (55 μm). A z-resolution of 50.4 μm could be achieved (for a 500 μm thick silicon sensor at 130 V bias), whereby the drift time model independent z-resolution was found to be 28.5 μm.

  19. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2016-09-01

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO2 based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

  20. Testbeam and laboratory characterization of 3D CMS pixel sensors

    NASA Astrophysics Data System (ADS)

    Bubna, Mayur; Krzwyda, Alex; Alagoz, Enver; Bortoletto, Daniela

    2013-04-01

    Future generations of colliders, like High Luminosity Large Hadron Collider (HL-LHC) at CERN will deliver much higher radiation doses to the particle detectors, specifically those closer to the beam line. Inner tracker detectors will be the most affected part, causing increased occupancy and radiation damage to Silicon detectors. Planar Silicon sensors have not shown enough radiation hardness for the innermost layers where the radiation doses can reach values around 10^16 neq/cm^2. As a possible replacement of planar pixel sensors, 3D Silicon technology is under consideration as they show higher radiation hardness, and efficiencies comparable to planar sensors. Several 3D CMS pixel designs were fabricated at FBK, CNM, and SINTEF. They were bump bonded to the CMS pixel readout chip and characterized in the laboratory using radioactive source (Sr90), and at Fermilab MTEST beam test facility. Sensors were also irradiated with 800 MeV protons at Los Alamos National Lab to study post-irradiation behavior. In addition, several diodes and test structures from FBK were studied before and after irradiation. We report the laboratory and testbeam measurement results for the irradiated 3D devices.

  1. Construction of the Phase I Forward Pixel Detector

    NASA Astrophysics Data System (ADS)

    Neylon, Ashton; Bartek, Rachel

    2017-01-01

    The silicon pixel detector is the innermost component of the CMS tracking system, providing high precision space point measurements of charged particle trajectories. The original CMS detector was designed for the nominal instantaneous LHC luminosity of 1 x 1034 cm-2s-1 . The LHC has already started to exceed this luminosity causing the CMS pixel detector to see a dynamic inefficiency caused by data losses due to buffer overflows. For this reason the CMS Collaboration has been building an upgraded pixel detector which is scheduled for installation during an extended year end technical stop during winter 2016/2017. The phase 1 upgrade includes four barrel layers and three forward disks, providing robust tracking and vertexing for LHC luminosities up to 2 x 1034 cm-2s-1 . The upgrade incorporates new readout chips, front-end electronics, DC-DC powering, and dual-phase CO2 cooling to achieve performance exceeding that of the present detector with a lower material budget. This contribution will review the design and technology choices of the Phase I detector and discuss the status of the detector. The challenges and difficulties encountered during the construction will also be presented, as well as the lessons learned for future upgrades. National Science Foundation.

  2. Calibration Scheme for Large Kinetic Inductance Detector Arrays Based on Readout Frequency Response

    NASA Astrophysics Data System (ADS)

    Bisigello, L.; Yates, S. J. C.; Murugesan, V.; Baselmans, J. J. A.; Baryshev, A. M.

    2016-07-01

    Microwave kinetic inductance detector (MKID) provides a way to build large ground-based sub-mm instruments such as NIKA and A-MKID. For such instruments, therefore, it is important to understand and characterize the response to ensure good linearity and calibration over a wide dynamic range. We propose to use the MKID readout frequency response to determine the MKID responsivity to an input optical source power. A signal can be measured in a KID as a change in the phase of the readout signal with respect to the KID resonant circle. Fundamentally, this phase change is due to a shift in the KID resonance frequency, in turn due to a radiation induced change in the quasiparticle number in the superconducting resonator. We show that the shift in resonant frequency can be determined from the phase shift by using KID phase versus frequency dependence using a previously measured resonant frequency. Working in this calculated resonant frequency, we gain near linearity and constant calibration to a constant optical signal applied in a wide range of operating points on the resonance and readout powers. This calibration method has three particular advantages: first, it is fast enough to be used to calibrate large arrays, with pixel counts in the thousands of pixels; second, it is based on data that are already necessary to determine KID positions; third, it can be done without applying any optical source in front of the array.

  3. 3D reconstruction of nuclear reactions using GEM TPC with planar readout

    NASA Astrophysics Data System (ADS)

    Bihałowicz, Jan Stefan

    2015-02-01

    The research program of the Extreme Light Infrastructure - Nuclear Physics (ELI-NP) laboratory under construction in Magurele, Romania facilities the need of developing a gaseous active-target detector providing 3D reconstruction of charged products of nuclear reactions induced by gamma beam. The monoenergetic, high-energy (Eγ > 19 MeV) gamma beam of intensity 1013γ/s allows studying nuclear reactions in astrophysics. A Time Projection Chamber with crossed strip readout (eTPC) is proposed as one of the imaging detectors. The special feature of the readout electrode structure is a 2D reconstruction based on the information read out simultaneously from three arrays of strips that form virtual pixels. It is expected to reach similar spatial resolution as for pixel readout at largely reduced cost of electronics. The paper presents the current progress and first results of the small scale prototype TPC which is a one of implementation steps towards eTPC detector proposed in the Technical Design Report of Charged Particles Detection at ELI-NP.

  4. 3D reconstruction of nuclear reactions using GEM TPC with planar readout

    SciTech Connect

    Bihałowicz, Jan Stefan

    2015-02-24

    The research program of the Extreme Light Infrastructure – Nuclear Physics (ELI-NP) laboratory under construction in Magurele, Romania facilities the need of developing a gaseous active-target detector providing 3D reconstruction of charged products of nuclear reactions induced by gamma beam. The monoenergetic, high-energy (E{sub γ} > 19 MeV) gamma beam of intensity 10{sup 13}γ/s allows studying nuclear reactions in astrophysics. A Time Projection Chamber with crossed strip readout (eTPC) is proposed as one of the imaging detectors. The special feature of the readout electrode structure is a 2D reconstruction based on the information read out simultaneously from three arrays of strips that form virtual pixels. It is expected to reach similar spatial resolution as for pixel readout at largely reduced cost of electronics. The paper presents the current progress and first results of the small scale prototype TPC which is a one of implementation steps towards eTPC detector proposed in the Technical Design Report of Charged Particles Detection at ELI-NP.

  5. High-speed imaging at high x-ray energy: CdTe sensors coupled to charge-integrating pixel array detectors

    SciTech Connect

    Becker, Julian; Tate, Mark W.; Shanks, Katherine S.; Philipp, Hugh T.; Weiss, Joel T.; Purohit, Prafull; Chamberlain, Darol; Gruner, Sol M.

    2016-07-27

    Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray imaging requirements. Here we describe the hybridization of CdTe sensors to two different charge-integrating readout chips, the Keck PAD and the Mixed-Mode PAD (MM-PAD), both developed previously in our laboratory. The charge-integrating architecture of each of these PADs extends the instantaneous counting rate by many orders of magnitude beyond that obtainable with photon counting architectures. The Keck PAD chip consists of rapid, 8-frame, in-pixel storage elements with framing periods <150 ns. The second detector, the MM-PAD, has an extended dynamic range by utilizing an in-pixel overflow counter coupled with charge removal circuitry activated at each overflow. This allows the recording of signals from the single-photon level to tens of millions of x-rays/pixel/frame while framing at 1 kHz. Both detector chips consist of a 128×128 pixel array with (150 µm){sup 2} pixels.

  6. Characterization of CdTe sensors with Schottky contacts coupled to charge-integrating pixel array detectors for X-ray science

    NASA Astrophysics Data System (ADS)

    Becker, J.; Tate, M. W.; Shanks, K. S.; Philipp, H. T.; Weiss, J. T.; Purohit, P.; Chamberlain, D.; Ruff, J. P. C.; Gruner, S. M.

    2016-12-01

    Pixel Array Detectors (PADs) consist of an x-ray sensor layer bonded pixel-by-pixel to an underlying readout chip. This approach allows both the sensor and the custom pixel electronics to be tailored independently to best match the x-ray imaging requirements. Here we present characterizations of CdTe sensors hybridized with two different charge-integrating readout chips, the Keck PAD and the Mixed-Mode PAD (MM-PAD), both developed previously in our laboratory. The charge-integrating architecture of each of these PADs extends the instantaneous counting rate by many orders of magnitude beyond that obtainable with photon counting architectures. The Keck PAD chip consists of rapid, 8-frame, in-pixel storage elements with framing periods < 150 ns. The second detector, the MM-PAD, has an extended dynamic range by utilizing an in-pixel overflow counter coupled with charge removal circuitry activated at each overflow. This allows the recording of signals from the single-photon level to tens of millions of x-rays/pixel/frame while framing at 1 kHz. Both detector chips consist of a 128 × 128 pixel array with (150 μm)2 pixels.

  7. The readout system for the ArTeMis camera

    NASA Astrophysics Data System (ADS)

    Doumayrou, E.; Lortholary, M.; Dumaye, L.; Hamon, G.

    2014-07-01

    During ArTeMiS observations at the APEX telescope (Chajnantor, Chile), 5760 bolometric pixels from 20 arrays at 300mK, corresponding to 3 submillimeter focal planes at 450μm, 350μm and 200μm, have to be read out simultaneously at 40Hz. The read out system, made of electronics and software, is the full chain from the cryostat to the telescope. The readout electronics consists of cryogenic buffers at 4K (NABU), based on CMOS technology, and of warm electronic acquisition systems called BOLERO. The bolometric signal given by each pixel has to be amplified, sampled, converted, time stamped and formatted in data packets by the BOLERO electronics. The time stamping is obtained by the decoding of an IRIG-B signal given by APEX and is key to ensure the synchronization of the data with the telescope. Specifically developed for ArTeMiS, BOLERO is an assembly of analogue and digital FPGA boards connected directly on the top of the cryostat. Two detectors arrays (18*16 pixels), one NABU and one BOLERO interconnected by ribbon cables constitute the unit of the electronic architecture of ArTeMiS. In total, the 20 detectors for the tree focal planes are read by 10 BOLEROs. The software is working on a Linux operating system, it runs on 2 back-end computers (called BEAR) which are small and robust PCs with solid state disks. They gather the 10 BOLEROs data fluxes, and reconstruct the focal planes images. When the telescope scans the sky, the acquisitions are triggered thanks to a specific network protocol. This interface with APEX enables to synchronize the acquisition with the observations on sky: the time stamped data packets are sent during the scans to the APEX software that builds the observation FITS files. A graphical user interface enables the setting of the camera and the real time display of the focal plane images, which is essential in laboratory and commissioning phases. The software is a set of C++, Labview and Python, the qualities of which are respectively used

  8. Design and characterization of novel monolithic pixel sensors for the ALICE ITS upgrade

    NASA Astrophysics Data System (ADS)

    Cavicchioli, C.; Chalmet, P. L.; Giubilato, P.; Hillemanns, H.; Junique, A.; Kugathasan, T.; Mager, M.; Marin Tobon, C. A.; Martinengo, P.; Mattiazzo, S.; Mugnier, H.; Musa, L.; Pantano, D.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Van Hoorne, J. W.; Yang, P.

    2014-11-01

    Within the R&D activities for the upgrade of the ALICE Inner Tracking System (ITS), Monolithic Active Pixel Sensors (MAPS) are being developed and studied, due to their lower material budget ( 0.3 %X0 in total for each inner layer) and higher granularity ( 20 μm × 20 μm pixels) with respect to the present pixel detector. This paper presents the design and characterization results of the Explorer0 chip, manufactured in the TowerJazz 180 nm CMOS Imaging Sensor process, based on a wafer with high-resistivity (ρ > 1 kΩ cm) and 18 μm thick epitaxial layer. The chip is organized in two sub-matrices with different pixel pitches (20 μm and 30 μm), each of them containing several pixel designs. The collection electrode size and shape, as well as the distance between the electrode and the surrounding electronics, are varied; the chip also offers the possibility to decouple the charge integration time from the readout time, and to change the sensor bias. The charge collection properties of the different pixel variants implemented in Explorer0 have been studied using a 55Fe X-ray source and 1-5 GeV/c electrons and positrons. The sensor capacitance has been estimated, and the effect of the sensor bias has also been examined in detail. A second version of the Explorer0 chip (called Explorer1) has been submitted for production in March 2013, together with a novel circuit with in-pixel discrimination and a sparsified readout. Results from these submissions are also presented.

  9. Thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Savic, N.; Bergbreiter, L.; Breuer, J.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Terzo, S.

    2017-02-01

    The ATLAS experiment will undergo a major upgrade of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) foreseen to start around 2025. Thin planar pixel modules are promising candidates to instrument the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. New designs of the pixel cells, with an optimized biasing structure, have been implemented in n-in-p planar pixel productions with sensor thicknesses of 270 μm. Using beam tests, the gain in hit efficiency is investigated as a function of the received irradiation fluence. The outlook for future thin planar pixel sensor productions will be discussed, with a focus on thin sensors with a thickness of 100 and 150 μm and a novel design with the optimized biasing structure and small pixel cells (50×50 and 25×100 μm2). These dimensions are foreseen for the new ATLAS read-out chip in 65 nm CMOS technology and the fine segmentation will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. To predict the performance of 50×50 μm2 pixels at high η, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle with respect to the short pixel direction. Results on cluster shapes, charge collection- and hit efficiency will be shown.

  10. Development of a super B-factory monolithic active pixel detector—the Continuous Acquisition Pixel (CAP) prototypes

    NASA Astrophysics Data System (ADS)

    Varner, G.; Barbero, M.; Bozek, A.; Browder, T.; Fang, F.; Hazumi, M.; Igarashi, A.; Iwaida, S.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Stanic, S.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.

    2005-04-01

    Over the last few years great progress has been made in the technological development of Monolithic Active Pixel Sensors (MAPS) such that upgrades to existing vertex detectors using this technology are now actively being considered. Future vertex detection at an upgraded KEK-B factory, already the highest luminosity collider in the world, will require a detector technology capable of withstanding the increased track densities and larger radiation exposures. Near the beam pipe the current silicon strip detectors have projected occupancies in excess of 100%. Deep sub-micron MAPS look very promising to address this problem. In the context of an upgrade to the Belle vertex detector, the major obstacles to realizing such a device have been concerns about radiation hardness and readout speed. Two prototypes implemented in the TSMC 0.35 μm process have been developed to address these issues. Denoted the Continuous Acquisition Pixel, or CAP, the two variants of this architecture are distinguished in that CAP2 includes an 8-deep sampling pipeline within each 22.5 μm 2 pixel. Preliminary test results and remaining R&D issues are presented.

  11. Baryon Acoustic Oscillations reconstruction with pixels

    NASA Astrophysics Data System (ADS)

    Obuljen, Andrej; Villaescusa-Navarro, Francisco; Castorina, Emanuele; Viel, Matteo

    2017-09-01

    Gravitational non-linear evolution induces a shift in the position of the baryon acoustic oscillations (BAO) peak together with a damping and broadening of its shape that bias and degrades the accuracy with which the position of the peak can be determined. BAO reconstruction is a technique developed to undo part of the effect of non-linearities. We present and analyse a reconstruction method that consists of displacing pixels instead of galaxies and whose implementation is easier than the standard reconstruction method. We show that this method is equivalent to the standard reconstruction technique in the limit where the number of pixels becomes very large. This method is particularly useful in surveys where individual galaxies are not resolved, as in 21cm intensity mapping observations. We validate this method by reconstructing mock pixelated maps, that we build from the distribution of matter and halos in real- and redshift-space, from a large set of numerical simulations. We find that this method is able to decrease the uncertainty in the BAO peak position by 30-50% over the typical angular resolution scales of 21 cm intensity mapping experiments.

  12. Improvement of spectroscopic performance using a charge-sensitive amplifier circuit for an X-ray astronomical SOI pixel detector

    NASA Astrophysics Data System (ADS)

    Takeda, A.; Tsuru, T. G.; Tanaka, T.; Uchida, H.; Matsumura, H.; Arai, Y.; Mori, K.; Nishioka, Y.; Takenaka, R.; Kohmura, T.; Nakashima, S.; Kawahito, S.; Kagawa, K.; Yasutomi, K.; Kamehama, H.; Shrestha, S.

    2015-06-01

    We have been developing monolithic active pixel sensors series, named ``XRPIX'', based on the silicon-on-insulator (SOI) pixel technology, for future X-ray astronomical satellites. The XRPIX series offers high coincidence time resolution (~ 1 μs), superior readout time (~ 10 μs), and a wide energy range (0.5-40 keV) . In the previous study, we successfully demonstrated X-ray detection by event-driven readout of XRPIX2b. We here report recent improvements in spectroscopic performance. We successfully increased the gain and reduced the readout noise in XRPIX2b by decreasing the parasitic capacitance of the sense-node originated in the buried p-well (BPW) . On the other hand, we found significant tail structures in the spectral response due to the loss of the charge collection efficiency when a small BPW is employed. Thus, we increased the gain in XRPIX3b by introducing in-pixel charge sensitive amplifiers instead of having even smaller BPW . We finally achieved the readout noise of 35 e- (rms) and the energy resolution of 320 eV (FWHM) at 6 keV without significant loss of the charge collection efficiency.

  13. A Full Parallel Event Driven Readout Technique for Area Array SPAD FLIM Image Sensors

    PubMed Central

    Nie, Kaiming; Wang, Xinlei; Qiao, Jun; Xu, Jiangtao

    2016-01-01

    This paper presents a full parallel event driven readout method which is implemented in an area array single-photon avalanche diode (SPAD) image sensor for high-speed fluorescence lifetime imaging microscopy (FLIM). The sensor only records and reads out effective time and position information by adopting full parallel event driven readout method, aiming at reducing the amount of data. The image sensor includes four 8 × 8 pixel arrays. In each array, four time-to-digital converters (TDCs) are used to quantize the time of photons’ arrival, and two address record modules are used to record the column and row information. In this work, Monte Carlo simulations were performed in Matlab in terms of the pile-up effect induced by the readout method. The sensor’s resolution is 16 × 16. The time resolution of TDCs is 97.6 ps and the quantization range is 100 ns. The readout frame rate is 10 Mfps, and the maximum imaging frame rate is 100 fps. The chip’s output bandwidth is 720 MHz with an average power of 15 mW. The lifetime resolvability range is 5–20 ns, and the average error of estimated fluorescence lifetimes is below 1% by employing CMM to estimate lifetimes. PMID:26828490

  14. Code-division-multiplexed readout of large arrays of TES microcalorimeters

    NASA Astrophysics Data System (ADS)

    Morgan, K. M.; Alpert, B. K.; Bennett, D. A.; Denison, E. V.; Doriese, W. B.; Fowler, J. W.; Gard, J. D.; Hilton, G. C.; Irwin, K. D.; Joe, Y. I.; O'Neil, G. C.; Reintsema, C. D.; Schmidt, D. R.; Ullom, J. N.; Swetz, D. S.

    2016-09-01

    Code-division multiplexing (CDM) offers a path to reading out large arrays of transition edge sensor (TES) X-ray microcalorimeters with excellent energy and timing resolution. We demonstrate the readout of X-ray TESs with a 32-channel flux-summed code-division multiplexing circuit based on superconducting quantum interference device (SQUID) amplifiers. The best detector has energy resolution of 2.28 ± 0.12 eV FWHM at 5.9 keV and the array has mean energy resolution of 2.77 ± 0.02 eV over 30 working sensors. The readout channels are sampled sequentially at 160 ns/row, for an effective sampling rate of 5.12 μs/channel. The SQUID amplifiers have a measured flux noise of 0.17 μΦ0/√Hz (non-multiplexed, referred to the first stage SQUID). The multiplexed noise level and signal slew rate are sufficient to allow readout of more than 40 pixels per column, making CDM compatible with requirements outlined for future space missions. Additionally, because the modulated data from the 32 SQUID readout channels provide information on each X-ray event at the row rate, our CDM architecture allows determination of the arrival time of an X-ray event to within 275 ns FWHM with potential benefits in experiments that require detection of near-coincident events.

  15. Buffer direct injection readout integrated circuit design for dual band infrared focal plane array detector

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Shieh, Hsiu-Li; Tang, Shiang-Feng; Lin, Wen-Jen

    2013-05-01

    This paper proposes dual-mode buffer direct injection (BDI) and direct injection (DI) readout circuit design. The DI readout circuit has the advantage of being a simple circuit, requiring a small layout area, and low power consumption. The internal resistance of the photodetector will affect the photocurrent injection efficiency. We used a buffer amplifier to design the BDI readout circuit since it would reduce the input impedance and raise the injection efficiency. This paper will discuss and analyze the power consumption, injection efficiency, layout area, and circuit noise. The circuit is simulated using a TSMC 0.35 um Mixed Signal 2P4M CMOS 5 V process. The dimension of the pixel area is 30×30 μm. We have designed a 10×8 array for the readout circuit of the interlaced columns. The input current ranges from 1 nA to 10 nA, when the measurement current is 10 pA to 10 nA. The integration time was varied. The circuit output swing was 2 V. The total root mean square noise voltage was 4.84 mV. The signal to noise ratio was 52 dB, and the full chip circuit power consumption was 9.94 mW.

  16. Overview of the BTeV Pixel Detector

    SciTech Connect

    Jeffrey A Appel

    2002-12-10

    BTeV is a new Fermilab beauty and charm experiment designed to operate in the CZero region of the Tevatron collider. Critical to the success of BTeV is its pixel detector. The unique features of this pixel detector include its proximity to the beam, its operation with a beam crossing time of 132 ns, and the need for the detector information to be read out quickly enough to be used for the lowest level trigger. This talk presents an overview of the pixel detector design, giving the motivations for the technical choices made. The status of the current R&D on detector components is also reviewed. Additional Pixel 2002 talks on the BTeV pixel detector are given by Dave Christian[1], Mayling Wong[2], and Sergio Zimmermann[3]. Table 1 gives a selection of pixel detector parameters for the ALICE, ATLAS, BTeV, and CMS experiments. Comparing the progression of this table, which I have been updating for the last several years, has shown a convergence of specifications. Nevertheless, significant differences endure. The BTeV data-driven readout, horizontal and vertical position resolution better than 9 {micro}m with the {+-} 300 mr forward acceptance, and positioning in vacuum and as close as 6 mm from the circulating beams remain unique. These features are driven by the physics goals of the BTeV experiment. Table 2 demonstrates that the vertex trigger performance made possible by these features is requisite for a very large fraction of the B meson decay physics which is so central to the motivation for BTeV. For most of the physics quantities of interest listed in the table, the vertex trigger is essential. The performance of the BTeV pixel detector may be summarized by looking at particular physics examples; e.g., the B{sub s} meson decay B{sub s} {yields} D{sub s}{sup -} K{sup +}. For that decay, studies using GEANT3 simulations provide quantitative measures of performance. For example, the separation between the B{sub s} decay point and the primary proton

  17. BESIII ETOF upgrade readout electronics commissioning

    NASA Astrophysics Data System (ADS)

    Wang, Xiao-Zhuang; Dai, Hong-Liang; Wu, Zhi; Heng, Yue-Kun; Zhang, Jie; Cao, Ping; Ji, Xiao-Lu; Li, Cheng; Sun, Wei-Jia; Wang, Si-Yu; Wang, Yun

    2017-01-01

    It is proposed to upgrade the endcap time-of-flight (ETOF) of the Beijing Spectrometer III (BESIII) with a multi-gap resistive plate chamber (MRPC), aiming at an overall time resolution of about 80 ps. After completing the entire readout electronics system, some experiments, such as heat radiation, radiation hardness and large-current beam tests, have been carried out to confirm the reliability and stability of the readout electronics. An on-detector test of the readout electronics has also been performed with the beam at the BEPCII E3 line. The test results indicate that the readout electronics system fulfills its design requirements. Supported by Chinese Academy of Sciences (1G201331231172010)

  18. The high performance readout chain for the DSSC 1Megapixel detector, designed for high throughput during pulsed operation mode

    NASA Astrophysics Data System (ADS)

    Kirchgessner, M.; Soldat, J.; Kugel, A.; Donato, M.; Porro, M.; Fischer, P.

    2015-01-01

    The readout chain of the DSSC 1M pixel detector currently built at DESY, Hamburg for the European X-Ray Free Electron Laser is described. The system operates in pulsed operation mode comparable to the new ILC. Each 0.1 seconds 800 images of 1M pixels are produced and readout by the DSSC DAQ electronics. The total data production rate of the system is about 134 Gbit/s. In order to deal with the high data rates, latest technology components like the Xilinx Kintex 7 FPGA are used to implement fast DDR3-1600 image buffers, high speed serial FPGA to FPGA communication and 10 GB Ethernet links concentrated in one 40 Gbit/s QSFP+ transceiver.

  19. R&D on a novel spectro-imaging polarimeter with Micromegas detectors and a Caliste readout system

    NASA Astrophysics Data System (ADS)

    Attié, D.; Blondel, C.; Boilevin-Kayl, L.; Desforges, D.; Ferrer-Ribas, E.; Giomataris, I.; Gevin, O.; Jeanneau, F.; Limousin, O.; Meuris, A.; Papaevangelou, T.; Peyaud, A.

    2015-07-01

    Micromegas detectors, part of the Micro-Pattern Gaseous Detectors (MPGD) family, are used in a very wide range of applications in the High Energy Physics community but also in astroparticle and neutrino physics. In most of the Micromegas applications the design of the detector vessel and the readout plane is extremely coupled. A way of dissociating these two components would be by separating the amplification structure and the detector volume from the readout plane and electronics. This is achieved with the so called piggyback Micromegas detectors. They open up new possibilities of applications in terms of adaptability to new electronics. In particular piggyback resistive Micromegas can be easily coupled to modern pixel array electronic ASICs. First tests have been carried out with a Medipix chip where the protection of the resistive layer has been proved. The results of very recent tests coupling piggyback Micromegas with the readout module of Caliste are presented. Caliste is a high performance spectro-imager with event time-tagging capability, able to detect photons between 2 keV and 250 keV in the context of a spatial micro spectro-imaging polarimetrer. In the current application, with the Piggyback Micromegas, we use the readout module only as the sensitive detector. We benefit of the good spatial resolution thanks to the high density readout pixels ( 600 μm pixel pitch), to the low noise, to the low power and to the radiation hard integrated front-end IDEF-X electronics. The advantage of such a device is to have a high gain, low noise, low threshold, and robust detector operating at room temperature. This would be very attractive for spatial applications, for instance X-ray polarisation.

  20. Common Bias Readout for TES Array on Scanning Transmission Electron Microscope

    NASA Astrophysics Data System (ADS)

    Yamamoto, R.; Sakai, K.; Maehisa, K.; Nagayoshi, K.; Hayashi, T.; Muramatsu, H.; Nakashima, Y.; Mitsuda, K.; Yamasaki, N. Y.; Takei, Y.; Hidaka, M.; Nagasawa, S.; Maehata, K.; Hara, T.

    2016-07-01

    A transition edge sensor (TES) microcalorimeter array as an X-ray sensor for a scanning transmission electron microscope system is being developed. The technical challenge of this system is a high count rate of ˜ 5000 counts/second/array. We adopted a 64 pixel array with a parallel readout. Common SQUID bias, and common TES bias are planned to reduce the number of wires and the resources of a room temperature circuit. The reduction rate of wires is 44 % when a 64 pixel array is read out by a common bias of 8 channels. The possible degradation of the energy resolution has been investigated by simulations and experiments. The bias fluctuation effects of a series connection are less than those of a parallel connection. Simple calculations expect that the fluctuations of the common SQUID bias and common TES bias in a series connection are 10^{-7} and 10^{-3}, respectively. We constructed 8 SQUIDs which are connected to 8 TES outputs and a room temperature circuit for common bias readout and evaluated experimentally. Our simulation of crosstalk indicates that at an X-ray event rate of 500 cps/pixel, crosstalk will broaden a monochromatic line by about 0.01 %, or about 1.5 eV at 15 keV. Thus, our design goal of 10 eV energy resolution across the 0.5-15 keV band should be achievable.

  1. Development of a Detector Control System for the ATLAS Pixel detector in the HL-LHC

    NASA Astrophysics Data System (ADS)

    Lehmann, N.; Karagounis, M.; Kersten, S.; Zeitnitz, C.

    2016-11-01

    The upgrade of the LHC to the HL-LHC requires a new ITk detector. The innermost part of this new tracker is a pixel detector. The University of Wuppertal is developing a new DCS to monitor and control this new pixel detector. The current concept envisions three parallel paths of the DCS. The first path, called security path, is hardwired and provides an interlock system to guarantee the safety of the detector and human beings. The second path is a control path. This path is used to supervise the entire detector. The control path has its own communication lines independent from the regular data readout for reliable operation. The third path is for diagnostics and provides information on demand. It is merged with the regular data readout and provides the highest granularity and most detailed information. To reduce the material budget, a serial power scheme is the baseline for the pixel modules. A new ASIC used in the control path is in development at Wuppertal for this serial power chain. A prototype exists already and a proof of principle was demonstrated. Development and research is ongoing to guarantee the correct operation of the new ASIC in the harsh environment of the HL-LHC. The concept for the new DCS will be presented in this paper. A focus will be made on the development of the DCS chip, used for monitoring and control of pixel modules in a serial power chain.

  2. Satellite Direct Readout: Opportunities for Science Education

    DTIC Science & Technology

    1994-02-01

    AD-A276 257 1UIIIIIlii 253860-1-X (R) SATELLITE DIRECT READOUT: OPPORTUNITIES FOR SCIENCE EDUCATION Thomas W. Wagner February 1994 C, Submitted to...Their Classroom ..................... 10 LIST OF TABLES 1. Summary Statement of Work .............................. 1 2. Science Education Goals and...with emphasis on newly emerging national Science Education Standards. Section 3 provides the specifications of the portable ERIM Direct Readout

  3. Ultracompact Microwatt CMOS Current Readout With Picoampere Noise and Kilohertz Bandwidth for Biosensor Arrays.

    PubMed

    Li, Haitao; Parsnejad, Sina; Ashoori, Ehsan; Thompson, Cort; Purcell, Erin K; Mason, Andrew J

    2017-10-05

    High-density on-chip electrochemical biosensor arrays are advancing toward a crucial role in health monitoring and development of new medicines and medical treatments. Nanopore and ion channel based sensors especially have great potential but present demanding resolution/speed/power/area requirements on instrumentation circuits. This paper presents a pixel-level current readout circuit and new group-cluster architecture to address the circuit challenges in high-performance biosensor arrays. Fabricated in 0.5 μm CMOS, this electrochemical voltammetry circuit achieves 7.2 pA[Formula: see text] noise in an 11.5-kHz bandwidth and only consumes 21-μW power and 0.06 mm2 area per readout channel. Cyclic voltammetry experiments in a potassium ferricyanide solution and patch-clamp whole-cell experiments were performed to validate the circuit's feasibility for electrochemical biosensor applications.

  4. Demonstration of digital readout circuit for superconducting nanowire single photon detector.

    PubMed

    Ortlepp, T; Hofherr, M; Fritzsch, L; Engert, S; Ilin, K; Rall, D; Toepfer, H; Meyer, H-G; Siegel, M

    2011-09-12

    We demonstrate the transfer of single photon triggered electrical pulses from a superconducting nanowire single photon detector (SNSPD) to a single flux quantum (SFQ) pulse. We describe design and test of a digital SFQ based SNSPD readout circuit and demonstrate its correct operation. Both circuits (SNSPD and SFQ) operate under the same cryogenic conditions and are directly connected by wire bonds. A future integration of the present multi-chip configuration seems feasible because both fabrication process and materials are very similar. In contrast to commonly used semiconductor amplifiers, SFQ circuits combine very low power dissipation (a few microwatts) with very high operation speed, thus enabling count-rates of several gigahertz. The SFQ interface circuit simplifies the SNSPD readout and enables large numbers of detectors for future compact multi-pixel systems with single photon counting resolution. The demonstrated circuit has great potential for scaling the present interface solution to 1,000 detectors by using a single SFQ chip.

  5. CMOS Integrated Lock-in Readout Circuit for FET Terahertz Detectors

    NASA Astrophysics Data System (ADS)

    Domingues, Suzana; Perenzoni, Daniele; Perenzoni, Matteo; Stoppa, David

    2017-02-01

    In this paper, a switched-capacitor readout circuit topology integrated with a THz antenna and field-effect transistor detector is analyzed, designed, and fabricated in a 0.13-μm standard CMOS technology. The main objective is to perform amplification and filtering of the signal, as well as subtraction of background in case of modulated source, in order to avoid the need for an external lock-in amplifier, in a compact implementation. A maximum responsivity of 139.7 kV/W, and a corresponding minimum NEP of 2.2 nW/√Hz, was obtained with a two-stage readout circuit at 1 kHz modulation frequency. The presented switched-capacitor circuit is suitable for implementation in pixel arrays due to its compact size and power consumption (0.014 mm2 and 36 μW).

  6. ERICA: an energy resolving photon counting readout ASIC for X-ray in-line cameras

    NASA Astrophysics Data System (ADS)

    Macias-Montero, J.-G.; Sarraj, M.; Chmeissani, M.; Moore, T.; Casanova, R.; Martinez, R.; Puigdengoles, C.; Prats, X.; Kolstein, M.

    2016-12-01

    We present ERICA (Energy Resolving Inline X-ray Camera) a photon-counting readout ASIC, with 6 energy bins. The ASIC is composed of a matrix of 8 × 20 pixels controlled by a global digital controller and biased with 7 independent digital to analog converters (DACs) and a band-gap current reference. The pixel analog front-end includes a charge sensitive amplifier with 16 mV/ke- gain and dynamic range of 45 ke-. ERICA has programmable pulse width, an adjustable constant current feedback resistor, a linear test pulse generator, and six discriminators with 6-bit local threshold adjustment. The pixel digital back-end includes the digital controller, 8 counters of 8-bit depth, half-full buffer flag for any of the 8 counters, a 74-bit shadow/shift register, a 74-bit configuration latch, and charge sharing compensation processing to perform the energy classification and counting operations of every detected photon in 1 μ s. The pixel size is 330 μm × 330 μm and its average consumption is 150 μW. Implemented in TSMC 0.25 μm CMOS process, the ASIC pixel's equivalent noise charge (ENC) is 90 e- RMS connected to a 1 mm thickness matching CdTe detector biased at -300 V with a total leakage current of 20 nA.

  7. Beam Test Studies of 3D Pixel Sensors Irradiated Non-Uniformly for the ATLAS Forward Physics Detector

    DTIC Science & Technology

    2013-02-21

    configuration consists of two n-type readout electrodes connected at the wafer surface along the 250 µm long pixel di- rection, surrounded by six p-type...passivation step uses dielectric material that depends on the bulk type of the silicon. For p-type wafers used in this study, a dielectric with negative...region by applying the SCP technology, from the original 1 mm to 50 − 100µm. The devices were returned to Barcelona to be bump -bonded to FE-I3 readout

  8. Sink Pixels in ACS/WFC

    NASA Astrophysics Data System (ADS)

    Ryon, J. E.; Grogin, N.

    2017-02-01

    We investigate the properties of sink pixels in the Advanced Camera for Surveys (ACS) Wide Field Channel (WFC) detector. These pixels likely contain extra charge traps and therefore appear anomalously low in images with relatively high backgrounds. We identify sink pixels in the average short (0.5-second) dark image from each monthly anneal cycle, which, since January 2015, have been post-flashed to a background of about 60 e-. Sink pixels can affect the pixels immediately above and below them in the same column, resulting in high downstream pixels and low trails of upstream pixels. We determine typical trail lengths for sink pixels of different depths at various background levels. We create a reference image, one for each anneal cycle since January 2015, that will be used to flag sink pixels and the adjacent affected pixels in science images.

  9. Study of the spatial resolution for binary readout detectors

    NASA Astrophysics Data System (ADS)

    Yonamine, R.; Maerschalk, T.; Lentdecker, G. De

    2016-07-01

    Often the binary readout is proposed for high granularity detectors to reduce the generated data volume to be readout at the price of a somewhat reduced spatial resolution compared to an analogue readout. We have been studying single hit resolutions obtained with a binary readout using simulations as well as analytical approaches. In this note we show that the detector geometry could be optimized to offer an equivalent spatial resolution than with an analogue readout.

  10. Method of fabrication of display pixels driven by silicon thin film transistors

    DOEpatents

    Carey, Paul G.; Smith, Patrick M.

    1999-01-01

    Display pixels driven by silicon thin film transistors are fabricated on plastic substrates for use in active matrix displays, such as flat panel displays. The process for forming the pixels involves a prior method for forming individual silicon thin film transistors on low-temperature plastic substrates. Low-temperature substrates are generally considered as being incapable of withstanding sustained processing temperatures greater than about 200.degree. C. The pixel formation process results in a complete pixel and active matrix pixel array. A pixel (or picture element) in an active matrix display consists of a silicon thin film transistor (TFT) and a large electrode, which may control a liquid crystal light valve, an emissive material (such as a light emitting diode or LED), or some other light emitting or attenuating material. The pixels can be connected in arrays wherein rows of pixels contain common gate electrodes and columns of pixels contain common drain electrodes. The source electrode of each pixel TFT is connected to its pixel electrode, and is electrically isolated from every other circuit element in the pixel array.

  11. Studies for an upgrade of ALICE Inner Tracking System: Pixel chip characterization

    NASA Astrophysics Data System (ADS)

    Park, Jonghan

    2017-04-01

    Inner Tracking System (ITS) of ALICE is used for vertex determination and tracking. Future heavy-ion program at the LHC aims to run with high luminosity. To address this challenge, upgrade program of ITS is underway, which aims at better position resolution (factor of 3), high detection efficiency (>99%), high-rate readout capabilities (100 kHz for Pb-Pb) and moderate radiation hardness (> 700 krad). The new ITS will be composed with 7 layers of silicon pixel chip based on Monolithic Active Pixel Sensor (MAPS) technology. The characterization test of various version of prototype chips at different phases of development has been performed. This contribution will provide the main characterization results obtained from the measurements performed at laboratories and using test beam for finalizing the pixel chip specification.

  12. Si and CdTe pixel detector developments at SPring-8

    NASA Astrophysics Data System (ADS)

    Toyokawa, H.; Furukawa, Y.; Hirono, T.; Ikeda, H.; Kajiwara, K.; Kawase, M.; Ohata, T.; Sato, G.; Sato, M.; Takahashi, T.; Tanida, H.; Uruga, T.; Watanabe, S.

    2011-04-01

    Single X-ray photon counting pixel detectors have become the most advanced detector technology in synchrotron radiation experiments recently. In particular, the PILATUS detector based on a silicon sensor has reached a very mature state and represents the world’s largest detector in this field. This paper first reports on threshold energy calibrations and the capability of applying an energy-resolved X-ray imaging with PILATUS. Second the design of a cadmium telluride (CdTe) pixel detector is described. A high density and high-atomic number sensor material is required in high energy X-ray applications available at SPring-8. For this purpose we are developing a CdTe pixel detector with the SP8-01 readout ASIC covering a wide dynamic range between 10 and 100 keV and containing lower and upper discriminators.

  13. Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

    NASA Astrophysics Data System (ADS)

    Grenier, P.; Alimonti, G.; Barbero, M.; Bates, R.; Bolle, E.; Borri, M.; Boscardin, M.; Buttar, C.; Capua, M.; Cavalli-Sforza, M.; Cobal, M.; Cristofoli, A.; Dalla Betta, G.-F.; Darbo, G.; Da Vià, C.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dobos, D.; Einsweiler, K.; Esseni, D.; Fazio, S.; Fleta, C.; Freestone, J.; Gallrapp, C.; Garcia-Sciveres, M.; Gariano, G.; Gemme, C.; Giordani, M.-P.; Gjersdal, H.; Grinstein, S.; Hansen, T.; Hansen, T.-E.; Hansson, P.; Hasi, J.; Helle, K.; Hoeferkamp, M.; Hügging, F.; Jackson, P.; Jakobs, K.; Kalliopuska, J.; Karagounis, M.; Kenney, C.; Köhler, M.; Kocian, M.; Kok, A.; Kolya, S.; Korokolov, I.; Kostyukhin, V.; Krüger, H.; La Rosa, A.; Lai, C. H.; Lietaer, N.; Lozano, M.; Mastroberardino, A.; Micelli, A.; Nellist, C.; Oja, A.; Oshea, V.; Padilla, C.; Palestri, P.; Parker, S.; Parzefall, U.; Pater, J.; Pellegrini, G.; Pernegger, H.; Piemonte, C.; Pospisil, S.; Povoli, M.; Roe, S.; Rohne, O.; Ronchin, S.; Rovani, A.; Ruscino, E.; Sandaker, H.; Seidel, S.; Selmi, L.; Silverstein, D.; Sjøbæk, K.; Slavicek, T.; Stapnes, S.; Stugu, B.; Stupak, J.; Su, D.; Susinno, G.; Thompson, R.; Tsung, J.-W.; Tsybychev, D.; Watts, S. J.; Wermes, N.; Young, C.; Zorzi, N.

    2011-05-01

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

  14. Study of indium and solder bumps for the BTeV Pixel Detector

    SciTech Connect

    Simon W Kwan et al.

    2003-11-05

    The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the strength of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposed to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing the responses of single-chip pixel detectors to an Sr{sup 90} source. We report the results from these studies and our plan to measure the effect of cryogenic temperatures on the bumps.

  15. Development of radiation hard CMOS active pixel sensors for HL-LHC

    NASA Astrophysics Data System (ADS)

    Pernegger, Heinz

    2016-07-01

    New pixel detectors, based on commercial high voltage and/or high resistivity full CMOS processes, hold promise as next-generation active pixel sensors for inner and intermediate layers of the upgraded ATLAS tracker. The use of commercial CMOS processes allow cost-effective detector construction and simpler hybridisation techniques. The paper gives an overview of the results obtained on AMS-produced CMOS sensors coupled to the ATLAS Pixel FE-I4 readout chips. The SOI (silicon-on-insulator) produced sensors by XFAB hold great promise as radiation hard SOI-CMOS sensors due to their combination of partially depleted SOI transistors reducing back-gate effects. The test results include pre-/post-irradiation comparison, measurements of charge collection regions as well as test beam results.

  16. Electron Pattern Recognition using trigger mode SOI pixel sensor for Advanced Compton Imaging

    NASA Astrophysics Data System (ADS)

    Shimazoe, K.; Yoshihara, Y.; Fairuz, A.; Koyama, A.; Takahashi, H.; Takeda, A.; Tsuru, T.; Arai, Y.

    2016-02-01

    Compton imaging is a useful method for localizing sub MeV to a few MeV gamma-rays and widely used for environmental and medical applications. The direction of recoiled electrons in Compton scattering process provides the additional information to limit the Compton cones and increases the sensitivity in the system. The capability of recoiled electron tracking using trigger-mode Silicon-On-Insulator (SOI) sensor is investigated with various radiation sources. The trigger-mode SOI sensor consists of 144 by 144 active pixels with 30 μm cells and the thickness of sensor is 500 μm. The sensor generates the digital output when it is hit by gamma-rays and 25 by 25 pixel pattern of surrounding the triggered pixel is readout to extract the recoiled electron track. The electron track is successfully observed for 60Co and 137Cs sources, which provides useful information for future electron tracking Compton camera.

  17. The LHCb Vertex Locator (VELO) Pixel Detector Upgrade

    NASA Astrophysics Data System (ADS)

    Buchanan, E.

    2017-01-01

    The LHCb experiment is designed to perform high-precision measurements of CP violation and the decays of beauty and charm hadrons at the Large Hadron Collider (LHC) at CERN. There is a planned upgrade during Long Shutdown 2 (LS2), expected in 2019, which will allow the detector to run at higher luminosities by transforming the entire readout to a trigger-less system. This will include a substantial upgrade of the Vertex Locator (VELO), the silicon tracker that surrounds the LHCb interaction region. The VELO is moving from silicon strip technology to hybrid pixel sensors, where silicon sensors are bonded to VeloPix ASICs. Sensor prototypes have undergone rigorous testing using the Timepix3 Telescope at the SPS, CERN. The main components of the upgrade are summarised and testbeam results presented.

  18. Signal modeling of charge sharing effect in simple pixelated CdZnTe detector

    NASA Astrophysics Data System (ADS)

    Kim, Jae Cheon; Kaye, William R.; He, Zhong

    2014-05-01

    In order to study the energy resolution degradation in 3D position-sensitive pixelated CdZnTe (CZT) detectors, a detailed detector system modeling package has been developed and used to analyze the detector performance. A 20 × 20 × 15 mm3 CZT crystal with an 11 × 11 simple-pixel anode array and a 1.72 mm pixel pitch was modeled. The VAS UM/TAT4 Application Specific Integrated Circuitry (ASIC) was used for signal read-out. Components of the simulation package include gamma-ray interactions with the CZT crystal, charge induction, electronic noise, pulse shaping, and ASIC triggering procedures. The charge induction model considers charge drift, trapping, diffusion, and sharing between pixels. This system model is used to determine the effects of electron cloud sharing, weighting potential non-uniformity, and weighting potential cross-talk which produce non-uniform signal responses for different gamma-ray interaction positions and ultimately degrade energy resolution. The effect of the decreased weighting potential underneath the gap between pixels on the total pulse amplitude of events has been studied. The transient signals induced by electron clouds collected near the gap between pixels may generate false signals, and the measured amplitude can be even greater than the photopeak. As the number of pixels that collect charge increases, the probability of side-neighbor events due to charge sharing significantly increases. If side-neighbor events are not corrected appropriately, the energy resolution of pixelated CZT detectors in multiple-pixel events degrades rapidly.

  19. MOSAD IR focal plane per pixel A/D development

    NASA Astrophysics Data System (ADS)

    Mandl, William J.; Kennedy, James J.; Chu, Muren

    1996-06-01

    An on focal plane digital readout development suggested by the Army Night Vision & Electronics Sensors Directorate is proceeding under a combined program with the development of two color HCT detector arrays. The on focal plane A/D process is based on the Amain patented multiplexed oversample A/D, MOSAD, technology. In the first year of the program, prototype on focal plane analog to digital converters for both staring arrays and scanning arrays were built and demonstrated. The prototypes included a 2 loop double ended switched MOSAD and a 1 loop single ended MOSAD. Results from the original experimental prototypes showed conclusively that better than 14 bits could be achieved and that well capacity could be increased to support high background HCT needs approaching 10(superscript 9) electrons. In the second year, a 64 X 64 staring array for HCT LWIR detectors, 50 micron centers, was built based on these original prototype designs. The layout of the per pixel MOSAD A/D staring array used Orbit 1.2 micron CMOS process and achieved a pixel size of 40 microns with a well capacity of 1.9 X 10(superscript 8) electrons. Integration capacitors were built using Orbit's normal double poly capacitors with a standard buffered direct inject TIA detector interface configuration. Preliminary testing has been completed indicating complete functionality. Fermionics LWIR HCT detectors with cutoff at 9 microns have been built for attachment to the readout but indium bumping was not completed in time to report system level testing results. However, some noise tests have been performed using on array current mirrors. These tests indicate that better than 12 bits has been achieved, but lower noise current sources will be required for a more accurate measurement.

  20. Edge pixel response studies of edgeless silicon sensor technology for pixellated imaging detectors

    NASA Astrophysics Data System (ADS)

    Maneuski, D.; Bates, R.; Blue, A.; Buttar, C.; Doonan, K.; Eklund, L.; Gimenez, E. N.; Hynds, D.; Kachkanov, S.; Kalliopuska, J.; McMullen, T.; O'Shea, V.; Tartoni, N.; Plackett, R.; Vahanen, S.; Wraight, K.

    2015-03-01

    Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

  1. Small-angle solution scattering using the mixed-mode pixel array detector.

    PubMed

    Koerner, Lucas J; Gillilan, Richard E; Green, Katherine S; Wang, Suntao; Gruner, Sol M

    2011-03-01

    Solution small-angle X-ray scattering (SAXS) measurements were obtained using a 128 × 128 pixel X-ray mixed-mode pixel array detector (MMPAD) with an 860 µs readout time. The MMPAD offers advantages for SAXS experiments: a pixel full-well of >2 × 10(7) 10 keV X-rays, a maximum flux rate of 10(8) X-rays pixel(-1) s(-1), and a sub-pixel point-spread function. Data from the MMPAD were quantitatively compared with data from a charge-coupled device (CCD) fiber-optically coupled to a phosphor screen. MMPAD solution SAXS data from lysozyme solutions were of equal or better quality than data captured by the CCD. The read-noise (normalized by pixel area) of the MMPAD was less than that of the CCD by an average factor of 3.0. Short sample-to-detector distances were required owing to the small MMPAD area (19.2 mm × 19.2 mm), and were revealed to be advantageous with respect to detector read-noise. As predicted by the Shannon sampling theory and confirmed by the acquisition of lysozyme solution SAXS curves, the MMPAD at short distances is capable of sufficiently sampling a solution SAXS curve for protein shape analysis. The readout speed of the MMPAD was demonstrated by continuously monitoring lysozyme sample evolution as radiation damage accumulated. These experiments prove that a small suitably configured MMPAD is appropriate for time-resolved solution scattering measurements.

  2. The high dynamic range pixel array detector (HDR-PAD): Concept and design

    SciTech Connect

    Shanks, Katherine S.; Philipp, Hugh T.; Weiss, Joel T.; Becker, Julian; Tate, Mark W.; Gruner, Sol M.

    2016-07-27

    Experiments at storage ring light sources as well as at next-generation light sources increasingly require detectors capable of high dynamic range operation, combining low-noise detection of single photons with large pixel well depth. XFEL sources in particular provide pulse intensities sufficiently high that a purely photon-counting approach is impractical. The High Dynamic Range Pixel Array Detector (HDR-PAD) project aims to provide a dynamic range extending from single-photon sensitivity to 10{sup 6} photons/pixel in a single XFEL pulse while maintaining the ability to tolerate a sustained flux of 10{sup 11} ph/s/pixel at a storage ring source. Achieving these goals involves the development of fast pixel front-end electronics as well as, in the XFEL case, leveraging the delayed charge collection due to plasma effects in the sensor. A first prototype of essential electronic components of the HDR-PAD readout ASIC, exploring different options for the pixel front-end, has been fabricated. Here, the HDR-PAD concept and preliminary design will be described.

  3. Fast pixelated quantum-well-based sensor for multi-wavelength photon detection

    NASA Astrophysics Data System (ADS)

    Antonelli, M.; Ganbold, T.; Menk, R. H.; Cautero, G.; Jark, W. H.; Eichert, D. M.; Biasiol, G.

    2014-05-01

    In order to cover a wide range of experimental applications, the opportunity to use InGaAs/InAlAs quantum well (QW) devices as fast pixelated photon detectors has been investigated. QW structures are planar objects in which electrons are confined in one dimension. Devices with several combinations of barrier and well materials can be fabricated by using compound semiconductors; in the case of InGaAs/InAlAs QWs this allows to tune the energy band gap down to 0.6 eV. Thanks to their direct, low-energy gap such devices operated at room temperature may be used as detectors for photon energies ranging from visible to hard X-ray. Internal charge amplification mechanism can be applied for very low signal levels, while the high carrier mobility allows the design of very fast photon detectors with sub-nanosecond response times. QW devices grown with molecular beam epitaxy have been pixelated by using standard photolithographic techniques. In order to fit commercially available readout chips, a pixelated sensor with pixel size of 172 × 172 μm2 is currently under development. A small-scale version of the pixelated QW sensor has been preliminarily tested with synchrotron radiation, conventional X-rays and UV laser light. The reported results indicate that these devices show fair charge sharing in the clearances between the pixels and feature very short response times to 100-fs-wide laser pulses.

  4. Crosstalk characterization of PMD pixels using the spatial response function at subpixel level

    NASA Astrophysics Data System (ADS)

    Heredia Conde, Miguel; Hartmann, Klaus; Loffeld, Otmar

    2015-03-01

    Time-of-Flight cameras have become one of the most widely-spread low-cost 3D-sensing devices. Most of them do not actually measure the time the light needs to hit an object and come back to the camera, but the difference of phase with respect to a reference signal. This requires special pixels with complex spatial structure, such as PMD pixels, able to sample the cross-correlation function between the incoming signal, reflected by the scene, and the reference signal. The complex structure, together with the presence of in-pixel electronics and the need for a compact readout circuitry for both pixel channels, suggests that systematic crosstalk effects will come up in this kind of devices. For the first time, we take profit of recent results on subpixel spatial responses of PMD pixels to detect and characterize crosstalk occurrences. Well-defined crosstalk patterns have been identified and quantitatively characterized through integration of the inter-pixel spatial response over each sensitive area. We cast the crosstalk problem into an image convolution and provide deconvolution kernels for cleaning PMD raw images from crosstalk. Experiments on real PMD raw images show that our results can be used to undo the lowpass filtering caused by crosstalk in high contrast image areas. The application of our kernels to undo crosstalk effects leads to reductions of the depth RMSE up to 50% in critical areas.

  5. All-passive pixel super-resolution of time-stretch imaging

    NASA Astrophysics Data System (ADS)

    Chan, Antony C. S.; Ng, Ho-Cheung; Bogaraju, Sharat C. V.; So, Hayden K. H.; Lam, Edmund Y.; Tsia, Kevin K.

    2017-03-01

    Based on image encoding in a serial-temporal format, optical time-stretch imaging entails a stringent requirement of state-of-the-art fast data acquisition unit in order to preserve high image resolution at an ultrahigh frame rate — hampering the widespread utilities of such technology. Here, we propose a pixel super-resolution (pixel-SR) technique tailored for time-stretch imaging that preserves pixel resolution at a relaxed sampling rate. It harnesses the subpixel shifts between image frames inherently introduced by asynchronous digital sampling of the continuous time-stretch imaging process. Precise pixel registration is thus accomplished without any active opto-mechanical subpixel-shift control or other additional hardware. Here, we present the experimental pixel-SR image reconstruction pipeline that restores high-resolution time-stretch images of microparticles and biological cells (phytoplankton) at a relaxed sampling rate (≈2-5 GSa/s)—more than four times lower than the originally required readout rate (20 GSa/s) — is thus effective for high-throughput label-free, morphology-based cellular classification down to single-cell precision. Upon integration with the high-throughput image processing technology, this pixel-SR time-stretch imaging technique represents a cost-effective and practical solution for large scale cell-based phenotypic screening in biomedical diagnosis and machine vision for quality control in manufacturing.

  6. All-passive pixel super-resolution of time-stretch imaging

    PubMed Central

    Chan, Antony C. S.; Ng, Ho-Cheung; Bogaraju, Sharat C. V.; So, Hayden K. H.; Lam, Edmund Y.; Tsia, Kevin K.

    2017-01-01

    Based on image encoding in a serial-temporal format, optical time-stretch imaging entails a stringent requirement of state-of-the-art fast data acquisition unit in order to preserve high image resolution at an ultrahigh frame rate — hampering the widespread utilities of such technology. Here, we propose a pixel super-resolution (pixel-SR) technique tailored for time-stretch imaging that preserves pixel resolution at a relaxed sampling rate. It harnesses the subpixel shifts between image frames inherently introduced by asynchronous digital sampling of the continuous time-stretch imaging process. Precise pixel registration is thus accomplished without any active opto-mechanical subpixel-shift control or other additional hardware. Here, we present the experimental pixel-SR image reconstruction pipeline that restores high-resolution time-stretch images of microparticles and biological cells (phytoplankton) at a relaxed sampling rate (≈2–5 GSa/s)—more than four times lower than the originally required readout rate (20 GSa/s) — is thus effective for high-throughput label-free, morphology-based cellular classification down to single-cell precision. Upon integration with the high-throughput image processing technology, this pixel-SR time-stretch imaging technique represents a cost-effective and practical solution for large scale cell-based phenotypic screening in biomedical diagnosis and machine vision for quality control in manufacturing. PMID:28303936

  7. WFC3 Pixel Area Maps

    NASA Astrophysics Data System (ADS)

    Kalirai, J. S.; Cox, C.; Dressel, L.; Fruchter, A.; Hack, W.; Kozhurina-Platais, V.; Mack, J.

    2010-04-01

    We present the pixel area maps (PAMs) for the WFC3/UVIS and WFC3/IR detectors, and discuss the normalization of these images. HST processed flt images suffer from geometric distortion and therefore have pixel areas that vary on the sky. The counts (electrons) measured for a source on these images depends on the position of the source on the detector, an effect that is implicitly corrected when these images are multidrizzled into drz files. The flt images can be multiplied by the PAMs to yield correct and uniform counts for a given source irrespective of its location on the image. To ensure consistency between the count rate measured for sources in drz images and near the center of flt images, we set the normalization of the PAMs to unity at a reference pixel near the center of the UVIS mosaic and IR detector, and set the SCALE in the IDCTAB equal to the square root of the area of this reference pixel. The implications of this choice for photometric measurements are discussed.

  8. THE CONTROLLED DRIFT DETECTOR : CHARACTERISATION OF THE READOUT MECHANISM AND OF THE CHARGE HANDLING CAPABILITY.

    SciTech Connect

    CASTOLDI,A.; GATTI,E.; GUAZZONI,C.; LONGONI,A.; REHAK,P.; STRUDER,L.

    1998-11-08

    A new position-sensing X-ray detector operated in integrate-readout mode has been recently designed and characterized. Due to the peculiar working principle of the new detector, the charge handling capability, that is the maximum charge that can be stored in a pixel, is related to the operating conditions of the device. In particular the amplitude of the barriers that confine the signal electrons during the integration phase depends on the applied drift field and on the field perturbation superposed to it. A detailed experimental characterization of the charge handling capability as a function of these parameters has been carried out.

  9. A low-noise and fast pre-amplifier and readout system for SiPMs

    NASA Astrophysics Data System (ADS)

    Biroth, M.; Achenbach, P.; Downie, E.; Thomas, A.

    2015-07-01

    To operate silicon photomultipliers (SiPMs) in a demanding environment with large temperature gradients, different amplifier concepts were characterized by analyzing SiPM pulse-shapes and charge distributions. A fully differential 4-wire SiPM pre-amplifier with separated tracks for the bias voltage and with good common-mode noise suppression was developed and successfully tested. To achieve highest single-pixel resolutions an online after-pulse and pile-up suppression was realized with fast readout electronics based on digital filters.

  10. Merlin: a fast versatile readout system for Medipix3

    NASA Astrophysics Data System (ADS)

    Plackett, R.; Horswell, I.; Gimenez, E. N.; Marchal, J.; Omar, D.; Tartoni, N.

    2013-01-01

    This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in `pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

  11. A 65k pixel, 150k frames-per-second camera with global gating and micro-lenses suitable for fluorescence lifetime imaging.

    PubMed

    Burri, Samuel; Powolny, François; Bruschini, Claudio; Michalet, Xavier; Regazzoni, Francesco; Charbon, Edoardo

    2014-04-14

    This paper presents our work on a 65k pixel single-photon avalanche diode (SPAD) based imaging sensor realized in a 0.35μm standard CMOS process. At a resolution of 512 by 128 pixels the sensor is read out in 6.4μs to deliver over 150k monochrome frames per second. The individual pixel has a size of 24μm(2) and contains the SPAD with a 12T quenching and gating circuitry along with a memory element. The gating signals are distributed across the chip through a balanced tree to minimize the signal skew between the pixels. The array of pixels is row-addressable and data is sent out of the chip on 128 lines in parallel at a frequency of 80MHz. The system is controlled by an FPGA which generates the gating and readout signals and can be used for arbitrary real-time computation on the frames from the sensor. The communication protocol between the camera and a conventional PC is USB2. The active area of the chip is 5% and can be significantly improved with the application of a micro-lens array. A micro-lens array, for use with collimated light, has been designed and its performance is reviewed in the paper. Among other high-speed phenomena the gating circuitry capable of generating illumination periods shorter than 5ns can be used for Fluorescence Lifetime Imaging (FLIM). In order to measure the lifetime of fluorophores excited by a picosecond laser, the sensor's illumination period is synchronized with the excitation laser pulses. A histogram of the photon arrival times relative to the excitation is then constructed by counting the photons arriving during the sensitive time for several positions of the illumination window. The histogram for each pixel is transferred afterwards to a computer where software routines extract the lifetime at each location with an accuracy better than 100ps. We show results for fluorescence lifetime measurements using different fluorophores with lifetimes ranging from 150ps to 5ns.

  12. A 65k pixel, 150k frames-per-second camera with global gating and micro-lenses suitable for fluorescence lifetime imaging

    NASA Astrophysics Data System (ADS)

    Burri, Samuel; Powolny, François; Bruschini, Claudio E.; Michalet, Xavier; Regazzoni, Francesco; Charbon, Edoardo

    2014-05-01

    This paper presents our work on a 65k pixel single-photon avalanche diode (SPAD) based imaging sensor realized in a 0.35μm standard CMOS process. At a resolution of 512 by 128 pixels the sensor is read out in 6.4μs to deliver over 150k monochrome frames per second. The individual pixel has a size of 24μm2 and contains the SPAD with a 12T quenching and gating circuitry along with a memory element. The gating signals are distributed across the chip through a balanced tree to minimize the signal skew between the pixels. The array of pixels is row-addressable and data is sent out of the chip on 128 lines in parallel at a frequency of 80MHz. The system is controlled by an FPGA which generates the gating and readout signals and can be used for arbitrary real-time computation on the frames from the sensor. The communication protocol between the camera and a conventional PC is USB2. The active area of the chip is 5% and can be significantly improved with the application of a micro-lens array. A micro-lens array, for use with collimated light, has been designed and its performance is reviewed in the paper. Among other high-speed phenomena the gating circuitry capable of generating illumination periods shorter than 5ns can be used for Fluorescence Lifetime Imaging (FLIM). In order to measure the lifetime of fluorophores excited by a picosecond laser, the sensor's illumination period is synchronized with the excitation laser pulses. A histogram of the photon arrival times relative to the excitation is then constructed by counting the photons arriving during the sensitive time for several positions of the illumination window. The histogram for each pixel is transferred afterwards to a computer where software routines extract the lifetime at each location with an accuracy better than 100ps. We show results for fluorescence lifetime measurements using different fluorophores with lifetimes ranging from 150ps to 5ns.

  13. Per-pixel energy calibration of photon counting detectors

    NASA Astrophysics Data System (ADS)

    Atharifard, A.; Healy, J. L.; Goulter, B. P.; Ramyar, M.; Vanden Broeke, L.; Walsh, M. F.; Onyema, C. C.; Panta, R. K.; Aamir, R.; Smithies, D. J.; Doesburg, R.; Anjomrouz, M.; Shamshad, M.; Bheesette, S.; Rajendran, K.; de Ruiter, N. J. A.; Knight, D.; Chernoglazov, A.; Mandalika, H.; Bell, S. T.; Bateman, C. J.; Butler, A. P. H.; Butler, P. H.

    2017-03-01

    Energy resolving performance of spectral CT systems is influenced by the accuracy of the detector's energy calibration. Global energy calibration maps a given threshold to the average energy response of all pixels of the detector. Variations arising from CMOS manufacturing processes and properties of the sensor cause different pixels to respond differently to photons of the same energy. Threshold dispersion adversely affects spectral imaging by degrading energy resolution, which contributes to blurring of the energy information. In this paper, we present a technique for per-pixel energy calibration of photon-counting x-ray detectors (PCXDs) that quantifies the energy response of individual pixels relative to the average response. This technique takes advantage of the measurements made by an equalized chip. It uses a known global energy map to quantify the effect of threshold dispersion on the energy response of the detector pixels across an energy range of interest. The proposed technique was assessed using a MARS scanner with an equalized Medipix3RX chip flip-bonded to 2 mm thick CdTe semiconductor crystal at a pitch of 110 μ m. Measurements were made of characteristic x-rays of a molybdenum foil. Results were compared between the case that the global calibration was used on its own and the case of using it in conjunction with our per-pixel calibration technique. The proposed technique quantified up to 1.87 keV error in energy response of 100 pixels of a selected region of interest (ROI). It made an improvement of 28.3% in average FWHM. The additional information provided by this per-pixel calibration technique can be used to improve spectral reconstruction.

  14. Pixel History for Advanced Camera for Surveys Wide Field Channel

    NASA Astrophysics Data System (ADS)

    Borncamp, D.; Grogin, N.; Bourque, M.; Ogaz, S.

    2017-06-01

    Excess thermal energy present in a Charged Coupled Device (CCD) can result in additional electrical current. This excess charge is trapped within the silicon lattice structure of the CCD electronics. It can persist through multiple exposures and have an adverse effect on science performance of the detectors unless properly flagged and corrected for. The traditional way to correct for this extra charge is to take occasional long-exposure images with the camera shutter closed. These images, generally referred to as "dark" images, allow for the measurement of the thermal-electron contamination present in each pixel of the CCD lattice. This so-called "dark current" can then be subtracted from the science images by re-scaling the dark to the corresponding exposure times. Pixels that have signal above a certain threshold are traditionally marked as "hot" and flagged in the data quality array. Many users will discard these because of the extra current. However, these pixels may not be unusable because of an unreliable dark subtraction; if we find these pixels to be stable over an anneal period, we can properly subtract the charge and the extra Poisson noise from this dark current will be propagated into the error arrays. Here we present the results of a pixel history study that analyzes every individual pixel of the Hubble Space Telescope's (HST) Advanced Camera for Surveys (ACS) Wide Field Channel (WFC) CCDs over time and allows pixels that were previously flagged as unusable to be brought back into the science image as a reliable pixel.

  15. HEPS-BPIX, a single photon counting pixel detector with a high frame rate for the HEPS project

    NASA Astrophysics Data System (ADS)

    Wei, Wei; Zhang, Jie; Ning, Zhe; Lu, Yunpeng; Fan, Lei; Li, Huaishen; Jiang, Xiaoshan; Lan, Allan K.; Ouyang, Qun; Wang, Zheng; Zhu, Kejun; Chen, Yuanbo; Liu, Peng

    2016-11-01

    China's next generation light source, named the High Energy Photon Source (HEPS), is currently under construction. HEPS-BPIX (HEPS-Beijing PIXel) is a dedicated pixel readout chip that operates in single photon counting mode for X-ray applications in HEPS. Designed using CMOS 0.13 μm technology, the chip contains a matrix of 104×72 pixels. Each pixel measures 150 μm×150 μm and has a counting depth of 20 bits. A bump-bonded prototyping detector module with a 300-μm thick silicon sensor was tested in the beamline of Beijing Synchrotron Radiation Facility. A fast stream of X-ray images was demonstrated, and a frame rate of 1.2 kHz was proven, with a negligible dead time. The test results showed an equivalent noise charge of 115 e- rms after bump bonding and a threshold dispersion of 55 e- rms after calibration.

  16. Development of pixel sensors with 25 × 500 μm2 pitch for the ATLAS HL-LHC upgrade

    NASA Astrophysics Data System (ADS)

    Burdin, S.; Casse, G.; Dervan, P.; Forshaw, D.; Hayward, H.; Tsurin, I.; Wormald, M.

    2014-11-01

    Upgrade of the ATLAS tracker detector for high-luminosity LHC conditions requires novel approaches to the pixel sensor design. Tests of different pitch layouts represent significant part of the ATLAS upgrade program. Better momentum resolution and multiple track reconstruction in the r - ϕ plane could be achieved with finer ϕ-segmentation. Changing the pitch from 50 × 250 μm2 to 25 × 500 μm2 in the outer pixel modules would improve the tracking performance of the upgraded ATLAS detector. The pixel sensors with 25 × 500 μm2 readout by FE-I4 chips have been designed at the University of Liverpool. The sensors were measured in the laboratory and test-beam. Results of these tests will be presented together with geometry characteristics of other novel pixel layouts, compatible with the FE-I4 floor-plan, which have been designed and produced.

  17. 10×10-pixel 606kS/s multi-point fluorescence correlation spectroscopy CMOS image sensor

    NASA Astrophysics Data System (ADS)

    Kagawa, Keiichiro; Takasawa, Taishi; Bo, Zhang; Seo, Min-Woong; Imai, Kaita; Yamamoto, Jotaro; Kinjo, Masataka; Terakawa, Susumu; Yasutomi, Keita; Kawahito, Shoji

    2014-03-01

    To observe molecular transport in a living cell, a high-speed CMOS image sensor for multi-point fluorescence correlation spectroscopy is developed. To achieve low-noise and high-speed simultaneously, a prototype CMOS image sensor is designed based on a complete pixel-parallel architecture and multi-channel pipelined pixel readout. The prototype chip with 10×10 effective pixels is fabricated in 0.18-μm CMOS image sensor technology. The pixel pitch and the photosensitive area are 56μm and 10μm in diameter without a microlens, respectively. In the experiment, the total sampling rate of 606kS/s is achieved. The measured average random noise is 24.9LSB, which is equivalent to about 2.5 electrons in average.

  18. A 160 x 120 pixel uncooled TEC-less infrared radiation focal plane array on a standard ceramic package

    NASA Astrophysics Data System (ADS)

    Funaki, Hideyuki; Honda, Hiroto; Fujiwara, Ikuo; Yagi, Hitoshi; Ishii, Kouichi; Sasaki, Keita

    2009-05-01

    We have developed a 32 μm pitch and 160 × 120 pixel uncooled infrared radiation focal plane array (IRFPA) on SOI by 0.35 μm CMOS technology and bulk-micromachining. For IR detection, we use silicon single crystal series p-n junctions which can realize high uniformity of temperature coefficient and low voltage drift. We have also developed a low-noise CMOS readout circuit on the same SOI which can calibrate the substrate temperature variation in every frame period, comparing two types of pixels, a bulk-micromachined infrared detection pixel and a non-micromachined reference pixel. Then the FPA requires no thermo-electric cooler (TEC) and is mounted on a low-cost standard ceramic package for the consumer products market.

  19. Development and performance of Kyoto's x-ray astronomical SOI pixel (SOIPIX) sensor

    NASA Astrophysics Data System (ADS)

    Tsuru, Takeshi G.; Matsumura, Hideaki; Takeda, Ayaki; Tanaka, Takaaki; Nakashima, Shinya; Arai, Yasuo; Mori, Koji; Takenaka, Ryota; Nishioka, Yusuke; Kohmura, Takayoshi; Hatsui, Takaki; Kameshima, Takashi; Ozaki, Kyosuke; Kohmura, Yoshiki; Wagai, Tatsuya; Takei, Dai; Kawahito, Shoji; Kagawa, Keiichiro; Yasutomi, Keita; Kamehama, Hiroki

    2014-08-01

    We have been developing monolithic active pixel sensors, known as Kyoto's X-ray SOIPIXs, based on the CMOS SOI (silicon-on-insulator) technology for next-generation X-ray astronomy satellites. The event trigger output function implemented in each pixel offers microsecond time resolution and enables reduction of the non-X-ray background that dominates the high X-ray energy band above 5-10 keV. A fully depleted SOI with a thick depletion layer and back illumination offers wide band coverage of 0.3-40 keV. Here, we report recent progress in the X-ray SOIPIX development. In this study, we achieved an energy resolution of 300 eV (FWHM) at 6 keV and a read-out noise of 33 e- (rms) in the frame readout mode, which allows us to clearly resolve Mn-Kα and Kβ. Moreover, we produced a fully depleted layer with a thickness of 500 μm. The event-driven readout mode has already been successfully demonstrated.

  20. Breath analysis system based on phase-shifting interferometric microscopy readout of microcantilever arrays.

    PubMed

    Kelling, S; Huang, J; Capener, M J; Elliott, S R

    2011-09-01

    Microcantilever (MC) sensors can provide ultrasensitive bio-chemical detection. Monitoring the bending response of large arrays of MC sensors coated with a library of receptors will produce a characteristic 'breath-print' corresponding to the breath composition; this promises to be suitable for non-invasive medical diagnostics. While MC arrays with hundreds of individual sensors can be produced readily, conventional MC readout methods are not suitable for the parallel readout of tens or hundreds of individual sensors. We have developed a MC sensor-array readout method based on phase-shifting interferometric microscopy (PSIM) which allows for the simultaneous monitoring of the response of all MCs within the field of view of the readout microscope optics. Based on this sensor technology, we have built an exhaled breath-analysis research instrument for the Point of Care Diagnostics Development Unit at the University of Leicester, UK. In this paper, we describe the PSIM readout system and the breath-analysis instrument that will be used to test sensor surface coatings and develop sensor sets with response patterns suitable for clear correlation to patients' health condition.

  1. Effect of Pixel's Spatial Characteristics on Recognition of Isolated Pixelized Chinese Character.

    PubMed

    Yang, Kun; Liu, Shuang; Wang, Hong; Liu, Wei; Wu, Yaowei

    2015-01-01

    The influence of pixel's spatial characteristics on recognition of isolated Chinese character was investigated using simulated prosthestic vision. The accuracy of Chinese character recognition with 4 kinds of pixel number (6*6, 8*8, 10*10, and 12*12 pixel array) and 3 kinds of pixel shape (Square, Dot and Gaussian) and different pixel spacing were tested through head-mounted display (HMD). A captured image of Chinese characters in font style of Hei were pixelized with Square, Dot and Gaussian pixel. Results showed that pixel number was the most important factor which could affect the recognition of isolated pixelized Chinese Chartars and the accuracy of recognition increased with the addition of pixel number. 10*10 pixel array could provide enough information for people to recognize an isolated Chinese character. At low resolution (6*6 and 8*8 pixel array), there were little difference of recognition accuracy between different pixel shape and different pixel spacing. While as for high resolution (10*10 and 12*12 pixel array), the fluctuation of pixel shape and pixel spacing could not affect the performance of recognition of isolated pixelized Chinese Character.

  2. Voltage injection and readout method for PCB (printed circuit board) testing

    NASA Astrophysics Data System (ADS)

    Zentai, G.

    2006-03-01

    The main objectives of PCB (Printed Circuit Board) testing are to find short and open circuits before attaching components to the PCB. An electrostatic imaging technique was described earlier by Zentai at al. in the SPIE-NDE 2003 conference and has been accepted as a US patent. The main goal of that application was to test the PCBs quickly and efficiently without attaching test probes to each of the traces. It was achieved with the proposed technique. However, we still had to use test probe matrix for generating test signals in the traces and the detected signal was greatly reduced in reference to the test signal because of capacitive sharing of charges caused by the insulator layer placed between the PCB and the TFT sensor array. A new idea has been developed for applying voltages to the traces with an addressing matrix, different from the pin addressing one. This matrix is similar to the readout matrix that the previous method referenced to, but instead of readout circuits, driver circuits are connected to the pixels to apply voltages to them. The printed circuit board is laid on top of the array, but rather than using an insulator foil, a directional conducting foam (rubber) layer can be applied between the excitation matrix (array) and the PCB. We get direct coupling of the matrix pixels to the PCB traces and no connection between neighboring pixels (traces) using the directional conductive layer, which conducts only in z direction and not in x (and y) direction. Therefore, by addressing each pixel separately, which is easy to do by software, we get an addressable voltage (pulse) injector matrix. The same directional conducting foam coupling can also be used for reading out the image of traces. Because the capacitive coupling is eliminated, the detected signal increases and so the sensitivity.

  3. A CMOS Active Pixel Sensor for Charged Particle Detection

    SciTech Connect

    Matis, Howard S.; Bieser, Fred; Kleinfelder, Stuart; Rai, Gulshan; Retiere, Fabrice; Ritter, Hans George; Singh, Kunal; Wurzel, Samuel E.; Wieman, Howard; Yamamoto, Eugene

    2002-12-02

    Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 {micro}m. Each array is divided into sub-arrays in which different sensor structures (4 in the first version and 16 in the second) and/or readout circuits are employed. Measurements of several of these structures under Fe{sup 55} exposure are reported. The sensors have also been irradiated by 55 MeV protons to test for radiation damage. The radiation increased the noise and reduced the signal. The noise can be explained by shot noise from the increased leakage current and the reduction in signal is due to charge being trapped in the epi layer. Nevertheless, the radiation effect is small for the expected exposures at RHIC and RHIC II. Finally, we describe our concept for mechanically supporting a thin silicon wafer in an actual detector.

  4. Pixelated transmission-mode diamond X-ray detector

    PubMed Central

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-01-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼1 kHz, which leads to an image sampling rate of ∼30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10−2 to 90 W mm−2. Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%). PMID:26524304

  5. Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

    NASA Astrophysics Data System (ADS)

    Tehrani, N. Alipour; Arfaoui, S.; Benoit, M.; Dannheim, D.; Dette, K.; Hynds, D.; Kulis, S.; Perić, I.; Petrič, M.; Redford, S.; Sicking, E.; Valerio, P.

    2016-07-01

    The vertex detector at the proposed CLIC multi-TeV linear e+e- collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor, where efficiencies of greater than 99% have been achieved at -60 V substrate bias, with a single hit resolution of 6.1 μm . Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.

  6. Pixelated transmission-mode diamond X-ray detector.

    PubMed

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-11-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60-100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼ 1 kHz, which leads to an image sampling rate of ∼ 30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5-15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10(-2) to 90 W mm(-2). Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  7. Pixelated transmission-mode diamond X-ray detector

    SciTech Connect

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-09-29

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ~1 kHz, which leads to an image sampling rate of ~30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10-2to 90 W mm-2. Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  8. Pixel Hybridization Technologies for the HL-LHC

    NASA Astrophysics Data System (ADS)

    Alimonti, G.; Biasotti, M.; Ceriale, V.; Darbo, G.; Gariano, G.; Gaudiello, A.; Gemme, C.; Rossi, L.; Rovani, A.; Ruscino, E.

    2016-12-01

    During the 2024-2025 shut-down, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity up to 7×1034 cm-2s-1. This upgrade of the collider is called High-Luminosity LHC (HL-LHC). ATLAS and CMS detectors will be upgraded to meet the new challenges of HL-LHC: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000 fb-1 over ten years. In particular, the current trackers will be completely replaced. In HL-LHC the trackers should operate under high fluences (up to 1.4 × 1016 neq cm-2), with a correlated high radiation damage. The pixel detectors, the innermost part of the trackers, needed a completely new design in the readout electronics, sensors and interconnections. A new 65 nm front-end (FE) electronics is being developed by the RD53 collaboration compatible with smaller pixel sizes than the actual ones to cope with the high track densities. Consequently the bump density will increase up to 4 ·104 bumps/cm2. Preliminary results of two hybridization technologies study are presented in this paper. In particular, the on-going bump-bonding qualification program at Leonardo-Finmeccanica is discussed, together with alternative hybridization techniques, as the capacitive coupling for HV-CMOS detectors.

  9. Pixelated transmission-mode diamond X-ray detector

    SciTech Connect

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-09-29

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ~1 kHz, which leads to an image sampling rate of ~30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10-2 to 90 W mm-2. Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  10. Characterization of CMOS Active Pixel Sensors for particle detection: Beam test of the four-sensors RAPS03 stacked system

    NASA Astrophysics Data System (ADS)

    Passeri, Daniele; Servoli, Leonello; Biagetti, Daniele; Meroli, Stefano

    2010-05-01

    In this work, in order to check the suitability of CMOS Active Pixel Sensors (APS) detectors for vertexing/tracking applications, four stacked CMOS APS sensors featuring 256×256 pixels with 10×10 μm 2 size have been tested at the INFN Beam Test Facility (BFT), Frascati (Rome). For this purpose, a dedicated mechanical and electrical set-up has been devised and implemented, allowing for the simultaneous read-out of four sensors arranged in a stacked structure. A compact and fast system (up to 64 MHz read-out clock) based on external ADCs and FPGA allows for the PC communication through USB2.0. Preliminary results in terms of track reconstructions of electrons of different energies (up to 496 MeV) are presented. This work has been carried out within the framework of the SHARPS project, supported by INFN.

  11. Single-pixel hyperspectral imaging

    NASA Astrophysics Data System (ADS)

    Suo, Jinli; Wang, Yuwang; Bian, Liheng; Dai, Qionghai

    2016-10-01

    Conventional multispectral imaging methods detect photons of a 3D hyperspectral data cube separately either in the spatial or spectral dimension using array detectors, and are thus photon inefficient and spectrum range limited. Besides, they are usually bulky and highly expensive. To address these issues, this paper presents single-pixel multispectral imaging techniques, which are of high sensitivity, wide spectrum range, low cost and light weight. Two mechanisms are proposed, and experimental validation are also reported.

  12. SAR Image Complex Pixel Representations

    SciTech Connect

    Doerry, Armin W.

    2015-03-01

    Complex pixel values for Synthetic Aperture Radar (SAR) images of uniform distributed clutter can be represented as either real/imaginary (also known as I/Q) values, or as Magnitude/Phase values. Generally, these component values are integers with limited number of bits. For clutter energy well below full-scale, Magnitude/Phase offers lower quantization noise than I/Q representation. Further improvement can be had with companding of the Magnitude value.

  13. Demountable readout technologies for optical image intensifiers

    NASA Astrophysics Data System (ADS)

    Lapington, J. S.; Howorth, J. R.; Milnes, J. S.

    2007-04-01

    We describe a generic microchannel plate intensifier design for use with a variety of demountable readout devices manufactured using standard multi-layer PCB techniques. We present results obtained using a 50 Ω multi-element design optimized for high speed operation and a four electrode multi-layer device developed from the wedge and strip anode with enhanced image resolution. The benefits of this intensifier design are discussed and a project to develop a detector system for bio-medical applications using a demountable readout device with integrated multi-channel ASIC-based electronics is announced.

  14. Spectral contents readout of birefringent sensor

    NASA Technical Reports Server (NTRS)

    Redner, Alex S.

    1989-01-01

    The technical objective of this research program was to develop a birefringent sensor, capable of measuring strain/stress up to 2000 F and a readout system based on Spectral Contents analysis. As a result of the research work, a data acquisition system was developed, capable of measuring strain birefringence in a sensor at 2000 F, with multi-point static and dynamic capabilities. The system uses a dedicated spectral analyzer for evaluation of stress-birefringence and a PC-based readout. Several sensor methods were evaluated. Fused silica was found most satisfactory. In the final evaluation, measurements were performed up to 2000 F and the system performance exceeded expectations.

  15. Gravity Probe B gyroscope readout system

    NASA Astrophysics Data System (ADS)

    Muhlfelder, B.; Lockhart, J.; Aljabreen, H.; Clarke, B.; Gutt, G.; Luo, M.

    2015-11-01

    We describe the Gravity Probe B London-moment readout system successfully used on-orbit to measure two gyroscope spin axis drift rates predicted by general relativity. The system couples the magnetic signal of a spinning niobium-coated rotor into a low noise superconducting quantum interference device. We describe the multi-layered magnetic shield needed to attenuate external fields that would otherwise degrade readout performance. We discuss the ∼35 nrad/yr drift rate sensitivity that was achieved on-orbit.

  16. CMOS digital pixel sensors: technology and applications

    NASA Astrophysics Data System (ADS)

    Skorka, Orit; Joseph, Dileepan

    2014-04-01

    CMOS active pixel sensor technology, which is widely used these days for digital imaging, is based on analog pixels. Transition to digital pixel sensors can boost signal-to-noise ratios and enhance image quality, but can increase pixel area to dimensions that are impractical for the high-volume market of consumer electronic devices. There are two main approaches to digital pixel design. The first uses digitization methods that largely rely on photodetector properties and so are unique to imaging. The second is based on adaptation of a classical analog-to-digital converter (ADC) for in-pixel data conversion. Imaging systems for medical, industrial, and security applications are emerging lower-volume markets that can benefit from these in-pixel ADCs. With these applications, larger pixels are typically acceptable, and imaging may be done in invisible spectral bands.

  17. Trimming the threshold dispersion below 10 e-rms in a large area readout IC working in a single photon counting mode

    NASA Astrophysics Data System (ADS)

    Kmon, P.; Maj, P.; Gryboś, P.; Szczygieł, R.

    2016-01-01

    We present a new method of an in-pixel threshold dispersion correction implemented in a prototype readout integrated circuit (IC) operating in a single photon counting mode. The new threshold correction method was implemented in a readout IC of area 9.6× 14.9 mm2 containing 23552 square pixels with the pitch of 75 μm designed and fabricated in CMOS 130 nm technology. Each pixel of the IC consists of a charge sensitive amplifier, a shaper, two discriminators, two 14-bit counters and a low-area trim DACs for threshold correction. The user can either control the range of the trim DAC globally for all the pixels in the integrated circuit or modify the trim DACs characteristics locally in each pixel independently. Using a simulation tool based on the Monte-Carlo methods, we estimated how much we could improve the offset trimming by increasing the number of bits in the trim DACs or implementing additional bits in a pixel to modify the characteristics of the trim DACs. The measurements of our IC prototype show that it is possible to reduce the effective threshold dispersion in large-area single-photon counting chips below 10 electrons rms.

  18. Central FPGA-based destination and load control in the LHCb MHz event readout

    NASA Astrophysics Data System (ADS)

    Jacobsson, R.

    2012-10-01

    The readout strategy of the LHCb experiment is based on complete event readout at 1 MHz. A set of 320 sub-detector readout boards transmit event fragments at total rate of 24.6 MHz at a bandwidth usage of up to 70 GB/s over a commercial switching network based on Gigabit Ethernet to a distributed event building and high-level trigger processing farm with 1470 individual multi-core computer nodes. In the original specifications, the readout was based on a pure push protocol. This paper describes the proposal, implementation, and experience of a non-conventional mixture of a push and a pull protocol, akin to credit-based flow control. An FPGA-based central master module, partly operating at the LHC bunch clock frequency of 40.08 MHz and partly at a double clock speed, is in charge of the entire trigger and readout control from the front-end electronics up to the high-level trigger farm. One FPGA is dedicated to controlling the event fragment packing in the readout boards, the assignment of the farm node destination for each event, and controls the farm load based on an asynchronous pull mechanism from each farm node. This dynamic readout scheme relies on generic event requests and the concept of node credit allowing load control and trigger rate regulation as a function of the global farm load. It also allows the vital task of fast central monitoring and automatic recovery in-flight of failing nodes while maintaining dead-time and event loss at a minimum. This paper demonstrates the strength and suitability of implementing this real-time task for a very large distributed system in an FPGA where no random delays are introduced, and where extreme reliability and accurate event accounting are fundamental requirements. It was in use during the entire commissioning phase of LHCb and has been in faultless operation during the first two years of physics luminosity data taking.

  19. Conception and characterization of a virtual coplanar grid for a 11×11 pixelated CZT detector

    NASA Astrophysics Data System (ADS)

    Espagnet, Romain; Frezza, Andrea; Martin, Jean-Pierre; Hamel, Louis-André; Després, Philippe

    2017-07-01

    Due to the low mobility of holes in CZT, commercially available detectors with a relatively large volume typically use a pixelated anode structure. They are mostly used in imaging applications and often require a dense electronic readout scheme. These large volume detectors are also interesting for high-sensitivity applications and a CZT-based blood gamma counter was developed from a 20×20×15 mm3 crystal available commercially and having a 11×11 pixelated readout scheme. A method is proposed here to reduce the number of channels required to use the crystal in a high-sensitivity counting application, dedicated to pharmacokinetic modelling in PET and SPECT. Inspired by a classic coplanar anode, an implementation of a virtual coplanar grid was done by connecting the 121 pixels of the detector to form intercalated bands. The layout, the front-end electronics and the characterization of the detector in this 2-channel anode geometry is presented. The coefficients required to compensate for electron trapping in CZT were determined experimentally to improve the performance. The resulting virtual coplanar detector has an intrinsic efficiency of 34% and an energy resolution of 8% at 662 keV. The detector's response was linear between 80 keV and 1372 keV. This suggests that large CZT crystals offer an excellent alternative to scintillation detectors for some applications, especially those where high-sensitivity and compactness are required.

  20. Prototypes and system test stands for the Phase 1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Hasegawa, S.

    2016-09-01

    The CMS pixel phase-1 upgrade project replaces the current pixel detector with an upgraded system with faster readout electronics during the extended year-end technical stop of 2016/2017. New electronics prototypes for the system have been developed, and tests in a realistic environment for a comprehensive evaluation are needed. A full readout test stand with either the same hardware as used in the current CMS pixel detector or the latest prototypes of upgrade electronics has been built. The setup enables the observation and investigation of a jitter increase in the data line associated with trigger rate increases. This effect is due to the way in which the clock and trigger distribution is implemented in CMS. A new prototype of the electronics with a PLL based on a voltage controlled quartz crystal oscillator (QPLL), which works as jitter filter, in the clock distribution path was produced. With the test stand, it was confirmed that the jitter increase is not seen with the prototype, and also good performance was confirmed at the expected detector operation temperature (-20 °C).

  1. Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging

    PubMed Central

    Resetar, Tomislav; De Munck, Koen; Haspeslagh, Luc; Rosmeulen, Maarten; Süss, Andreas; Puers, Robert; Van Hoof, Chris

    2016-01-01

    This work explores the benefits of linear-mode avalanche photodiodes (APDs) in high-speed CMOS imaging as compared to different approaches present in literature. Analysis of APDs biased below their breakdown voltage employed in single-photon counting mode is also discussed, showing a potentially interesting alternative to existing Geiger-mode APDs. An overview of the recently presented gated pinned avalanche photodiode pixel concept is provided, as well as the first experimental results on a 8 × 16 pixel test array. Full feasibility of the proposed pixel concept is not demonstrated; however, informative data is obtained from the sensor operating under −32 V substrate bias and clearly exhibiting wavelength-dependent gain in frontside illumination. The readout of the chip designed in standard 130 nm CMOS technology shows no dependence on the high-voltage bias. Readout noise level of 15 e- rms, full well capacity of 8000e-, and the conversion gain of 75 µV/e- are extracted from the photon-transfer measurements. The gain characteristics of the avalanche junction are characterized on separate test diodes showing a multiplication factor of 1.6 for red light in frontside illumination. PMID:27537882

  2. Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging.

    PubMed

    Resetar, Tomislav; De Munck, Koen; Haspeslagh, Luc; Rosmeulen, Maarten; Süss, Andreas; Puers, Robert; Van Hoof, Chris

    2016-08-15

    This work explores the benefits of linear-mode avalanche photodiodes (APDs) in high-speed CMOS imaging as compared to different approaches present in literature. Analysis of APDs biased below their breakdown voltage employed in single-photon counting mode is also discussed, showing a potentially interesting alternative to existing Geiger-mode APDs. An overview of the recently presented gated pinned avalanche photodiode pixel concept is provided, as well as the first experimental results on a 8 × 16 pixel test array. Full feasibility of the proposed pixel concept is not demonstrated; however, informative data is obtained from the sensor operating under -32 V substrate bias and clearly exhibiting wavelength-dependent gain in frontside illumination. The readout of the chip designed in standard 130 nm CMOS technology shows no dependence on the high-voltage bias. Readout noise level of 15 e - rms, full well capacity of 8000 e - , and the conversion gain of 75 µV / e - are extracted from the photon-transfer measurements. The gain characteristics of the avalanche junction are characterized on separate test diodes showing a multiplication factor of 1.6 for red light in frontside illumination.

  3. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M (Inventor); Hancock, Bruce R. (Inventor)

    2013-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  4. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M. (Inventor); Hancock, Bruce R. (Inventor)

    2017-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  5. Characterisation of the NA62 GigaTracker end of column readout ASIC

    NASA Astrophysics Data System (ADS)

    Noy, M.; Aglieri Rinella, G.; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Perktold, L.; Riedler, P.

    2011-01-01

    The architecture and characterisation of the End Of Column demonstrator readout ASIC for the NA62 GigaTracker hybrid pixel detector is presented. This ASIC serves as a proof of principle for a pixel chip with 1800 pixels which must perform time stamping to better than 200 ps (RMS), provide 300 μm pitch position information and operate with a dead-time of 1% or less for 800 MHz-1 GHz beam rate. The demonstrator ASIC comprises a full test column with 45 pixels alongside other test structures. The timewalk correction mechanism employed is measurement of the time-over-threshold, coupled with an off-detector look-up table. The time to digital converter is a delay locked loop with 32 contributing delay cells fed with a 320 MHz to yield a nominal bin size of 97 ps. Recently, P-in-N sensors have been bump-bonded to the ASIC and characterisation of these assemblies has begun.

  6. Small-angle solution scattering using the mixed-mode pixel array detector

    PubMed Central

    Koerner, Lucas J.; Gillilan, Richard E.; Green, Katherine S.; Wang, Suntao; Gruner, Sol M.

    2011-01-01

    Solution small-angle X-ray scattering (SAXS) measurements were obtained using a 128 × 128 pixel X-ray mixed-mode pixel array detector (MMPAD) with an 860 µs readout time. The MMPAD offers advantages for SAXS experiments: a pixel full-well of >2 × 107 10 keV X-rays, a maximum flux rate of 108 X-rays pixel−1 s−1, and a sub-pixel point-spread function. Data from the MMPAD were quantitatively compared with data from a charge-coupled device (CCD) fiber-optically coupled to a phosphor screen. MMPAD solution SAXS data from lysozyme solutions were of equal or better quality than data captured by the CCD. The read-noise (normalized by pixel area) of the MMPAD was less than that of the CCD by an average factor of 3.0. Short sample-to-detector distances were required owing to the small MMPAD area (19.2 mm × 19.2 mm), and were revealed to be advantageous with respect to detector read-noise. As predicted by the Shannon sampling theory and confirmed by the acquisition of lysozyme solution SAXS curves, the MMPAD at short distances is capable of sufficiently sampling a solution SAXS curve for protein shape analysis. The readout speed of the MMPAD was demonstrated by continuously monitoring lysozyme sample evolution as radiation damage accumulated. These experiments prove that a small suitably configured MMPAD is appropriate for time-resolved solution scattering measurements. PMID:21335900

  7. The DEPFET Sensor-Amplifier Structure: A Method to Beat 1/f Noise and Reach Sub-Electron Noise in Pixel Detectors.

    PubMed

    Lutz, Gerhard; Porro, Matteo; Aschauer, Stefan; Wölfel, Stefan; Strüder, Lothar

    2016-04-28

    Depleted field effect transistors (DEPFET) are used to achieve very low noise signal charge readout with sub-electron measurement precision. This is accomplished by repeatedly reading an identical charge, thereby suppressing not only the white serial noise but also the usually constant 1/f noise. The repetitive non-destructive readout (RNDR) DEPFET is an ideal central element for an active pixel sensor (APS) pixel. The theory has been derived thoroughly and results have been verified on RNDR-DEPFET prototypes. A charge measurement precision of 0.18 electrons has been achieved. The device is well-suited for spectroscopic X-ray imaging and for optical photon counting in pixel sensors, even at high photon numbers in the same cell.

  8. The DEPFET Sensor-Amplifier Structure: A Method to Beat 1/f Noise and Reach Sub-Electron Noise in Pixel Detectors

    PubMed Central

    Lutz, Gerhard; Porro, Matteo; Aschauer, Stefan; Wölfel, Stefan; Strüder, Lothar

    2016-01-01

    Depleted field effect transistors (DEPFET) are used to achieve very low noise signal charge readout with sub-electron measurement precision. This is accomplished by repeatedly reading an identical charge, thereby suppressing not only the white serial noise but also the usually constant 1/f noise. The repetitive non-destructive readout (RNDR) DEPFET is an ideal central element for an active pixel sensor (APS) pixel. The theory has been derived thoroughly and results have been verified on RNDR-DEPFET prototypes. A charge measurement precision of 0.18 electrons has been achieved. The device is well-suited for spectroscopic X-ray imaging and for optical photon counting in pixel sensors, even at high photon numbers in the same cell. PMID:27136549

  9. Preliminary test results of a new high-energy-resolution silicon and CdZnTe pixel detectors for application to x-ray astronomy

    NASA Astrophysics Data System (ADS)

    Sushkov, V. V.; Hamilton, William J.; Hurley, Kevin; Maeding, Dale G.; Ogelman, Hakki; Paulos, Robert J.; Puetter, Richard C.; Tumer, Tumay O.; Zweerink, Jeffrey

    1999-10-01

    New, high spatial resolution CdZnTe (CZT) and silicon (Si) pixel detectors are highly suitable for x-ray astronomy. These detectors are planned for use in wide field of view, imaging x-ray, and low energy gamma-ray all-sky monitor (AXGAM) in a future space mission. The high stopping power of CZT detectors combined with low-noise front-end readout makes possible an order of magnitude improvement in spatial and energy resolution in x-ray detection. The AXGAM instrument will be built in the form of a fine coded aperture placed over two-dimensional, high spatial resolution and low energy threshold CZT pixel detector array. The preliminary result of CZT and silicon pixel detector test with low-noise readout electronics system are presented. These detectors may also be used with or without modification for medical and industrial imaging.

  10. Sensitivity of landscape metrics to pixel size

    Treesearch

    J. D. Wickham; K. H. Riitters

    1995-01-01

    Analysis of diversity and evenness metrics using land cover data are becoming formalized in landscape ecology. Diversity and evenness metrics are dependent on the pixel size (scale) over which the data are collected. Aerial photography was interpreted for land cover and converted into four raster data sets with 4, 12, 28, and 80 m pixel sizes, representing pixel sizes...

  11. Improved Readout For Micromagnet/Hall-Effect Memories

    NASA Technical Reports Server (NTRS)

    Wu, Jiin-Chuan; Stadler, Henry L.; Katti, Romney R.

    1993-01-01

    Two improved readout circuits for micromagnet/Hall-effect random-access memories designed to eliminate current shunts introducing errors into outputs of older readout circuits. Incorporate additional switching transistors to isolate Hall sensors as needed.

  12. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    SciTech Connect

    Grenier, P.; Alimonti, G.; Barbero, M.; Bates, R.; Bolle, E.; Borri, M.; Boscardin, M.; Buttar, C.; Capua, M.; Cavalli-Sforza, M.; Cobal, M.; Cristofoli, A.; Dalla Betta, G.F.; Darbo, G.; Da Via, C.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dobos, D.; Einsweiler, K.; Esseni, D.; /Udine U. /INFN, Udine /Calabria U. /INFN, Cosenza /Barcelona, Inst. Microelectron. /Manchester U. /CERN /LBL, Berkeley /INFN, Genoa /INFN, Genoa /Udine U. /INFN, Udine /Oslo U. /ICREA, Barcelona /Barcelona, IFAE /SINTEF, Oslo /SINTEF, Oslo /SLAC /SLAC /Bergen U. /New Mexico U. /Bonn U. /SLAC /Freiburg U. /VTT Electronics, Espoo /Bonn U. /SLAC /Freiburg U. /SLAC /SINTEF, Oslo /Manchester U. /Barcelona, IFAE /Bonn U. /Bonn U. /CERN /Manchester U. /SINTEF, Oslo /Barcelona, Inst. Microelectron. /Calabria U. /INFN, Cosenza /Udine U. /INFN, Udine /Manchester U. /VTT Electronics, Espoo /Glasgow U. /Barcelona, IFAE /Udine U. /INFN, Udine /Hawaii U. /Freiburg U. /Manchester U. /Barcelona, Inst. Microelectron. /CERN /Fond. Bruno Kessler, Povo /Prague, Tech. U. /Trento U. /INFN, Trento /CERN /Oslo U. /Fond. Bruno Kessler, Povo /INFN, Genoa /INFN, Genoa /Bergen U. /New Mexico U. /Udine U. /INFN, Udine /SLAC /Oslo U. /Prague, Tech. U. /Oslo U. /Bergen U. /SUNY, Stony Brook /SLAC /Calabria U. /INFN, Cosenza /Manchester U. /Bonn U. /SUNY, Stony Brook /Manchester U. /Bonn U. /SLAC /Fond. Bruno Kessler, Povo

    2011-08-19

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance. Full and partial 3D pixel detectors have been tested, with and without a 1.6T magnetic field, in high energy pion beams at the CERN SPS North Area in 2009. Sensors characteristics have been measured as a function of the beam incident angle and compared to a regular planar pixel device. Overall full and partial 3D devices have similar behavior. Magnetic field has no sizeable effect on 3D performances. Due to electrode inefficiency 3D devices exhibit some loss of tracking efficiency for normal incident tracks but recover full efficiency with tilted tracks. As expected due to the electric field configuration 3D sensors have little charge sharing between cells.

  13. First images of a digital autoradiography system based on a Medipix2 hybrid silicon pixel detector.

    PubMed

    Mettivier, Giovanni; Montesi, Maria Cristina; Russo, Paolo

    2003-06-21

    We present the first images of beta autoradiography obtained with the high-resolution hybrid pixel detector consisting of the Medipix2 single photon counting read-out chip bump-bonded to a 300 microm thick silicon pixel detector. This room temperature system has 256 x 256 square pixels of 55 microm pitch (total sensitive area of 14 x 14 mm2), with a double threshold discriminator and a 13-bit counter in each pixel. It is read out via a dedicated electronic interface and control software, also developed in the framework of the European Medipix2 Collaboration. Digital beta autoradiograms of 14C microscale standard strips (containing separate bands of increasing specific activity in the range 0.0038-32.9 kBq g(-1)) indicate system linearity down to a total background noise of 1.8 x 10(-3) counts mm(-2) s(-1). The minimum detectable activity is estimated to be 0.012 Bq for 36,000 s exposure and 0.023 Bq for 10,800 s exposure. The measured minimum detection threshold is less than 1600 electrons (equivalent to about 6 keV Si). This real-time system for beta autoradiography offers lower pixel pitch and higher sensitive area than the previous Medipix1-based system. It has a 14C sensitivity better than that of micro channel plate based systems, which, however, shows higher spatial resolution and sensitive area.

  14. A new generation of small pixel pitch/SWaP cooled infrared detectors

    NASA Astrophysics Data System (ADS)

    Espuno, L.; Pacaud, O.; Reibel, Y.; Rubaldo, L.; Kerlain, A.; Péré-Laperne, N.; Dariel, A.; Roumegoux, J.; Brunner, A.; Kessler, A.; Gravrand, O.; Castelein, P.

    2015-10-01

    Following clear technological trends, the cooled IR detectors market is now in demand for smaller, more efficient and higher performance products. This demand pushes products developments towards constant innovations on detectors, read-out circuits, proximity electronics boards, and coolers. Sofradir was first to show a 10μm focal plane array (FPA) at DSS 2012, and announced the DAPHNIS 10μm product line back in 2014. This pixel pitch is a key enabler for infrared detectors with increased resolution. Sofradir recently achieved outstanding products demonstrations at this pixel pitch, which clearly demonstrate the benefits of adopting 10μm pixel pitch focal plane array-based detectors. Both HD and XGA Daphnis 10μm products also benefit from a global video datapath efficiency improvement by transitioning to digital video interfaces. Moreover, innovative smart pixels functionalities drastically increase product versatility. In addition to this strong push towards a higher pixels density, Sofradir acknowledges the need for smaller and lower power cooled infrared detector. Together with straightforward system interfaces and better overall performances, latest technological advances on SWAP-C (Size, Weight, Power and Cost) Sofradir products enable the advent of a new generation of high performance portable and agile systems (handheld thermal imagers, unmanned aerial vehicles, light gimbals etc...). This paper focuses on those features and performances that can make an actual difference in the field.

  15. Direct charge sharing observation in single-photon-counting pixel detector

    NASA Astrophysics Data System (ADS)

    Pellegrini, G.; Maiorino, M.; Blanchot, G.; Chmeissani, M.; Garcia, J.; Lozano, M.; Martinez, R.; Puigdengoles, C.; Ullan, M.

    2007-04-01

    In photon-counting imaging devices, charge sharing can limit the detector spatial resolution and contrast, as multiple counts can be induced in adjacent pixels as a result of the spread of the charge cloud generated from a single X-ray photon of high energy in the detector bulk. Although debated for a long time, the full impact of charge sharing has not been completely assessed. In this work, the importance of charge sharing in pixellated CdTe and silicon detectors is studied by exposing imaging devices to different low activity sources. These devices are made of Si and CdTe pixel detector bump-bonded to Medipix2 single-photon-counting chips with a 55 μm pixel pitch. We will show how charge sharing affects the spatial detector resolution depending on incident particle type (alpha, beta and gamma), detector bias voltage and read-out chip threshold. This study will give an insight on the impact on the design and operation of pixel detectors coupled to photon-counting devices for imaging applications.

  16. Characterization of pixelated cadmium-zinc-telluride detectors for astrophysical application

    NASA Astrophysics Data System (ADS)

    Gaskin, Jessica A.; Sharma, Dharma P.; Ramsey, Brian D.; Mitchell, Shannon; Seller, Paul

    2004-02-01

    Charge sharing and charge loss measurements for a many-pixel, Cadmium-Zinc-Telluride (CdZnTe) detector are discussed. These properties that are set by the material characteristics and the detector geometry help to define the limiting energy resolution and spatial resolution of the detector in question. The detector consists of a 1-mm-thick piece of CdZnTe sputtered with a 16x16 array of pixels with a 300 micron pixel pitch (inter-pixel gap is 50 microns). This crystal is bonded to a custom-built readout chip (ASIC) providing all front-end electronics to each of the 256 independent pixels. These types of detectors act as precursors to that which will be used at the focal plane of the High Energy Replicated Optics (HERO) telescope currently being developed at Marshall Space Flight Center. With a telescope focal length of 6 meters, the detector needs to have a spatial resolution of around 200 microns in order to take full advantage of the HERO angular resolution. We discuss to what degree charge sharing degrades energy resolution through charge loss and improves spatial resolution through position interpolation.

  17. Radiation hardness and timing studies of a monolithic TowerJazz pixel design for the new ATLAS Inner Tracker

    NASA Astrophysics Data System (ADS)

    Riegel, C.; Backhaus, M.; Van Hoorne, J. W.; Kugathasan, T.; Musa, L.; Pernegger, H.; Riedler, P.; Schaefer, D.; Snoeys, W.; Wagner, W.

    2017-01-01

    A part of the upcoming HL-LHC upgrade of the ATLAS Detector is the construction of a new Inner Tracker. This upgrade opens new possibilities, but also presents challenges in terms of occupancy and radiation tolerance. For the pixel detector inside the inner tracker, hybrid modules containing passive silicon sensors and connected readout chips are presently used, but require expensive assembly techniques like fine-pitch bump bonding. Silicon devices fabricated in standard commercial CMOS technologies, which include part or all of the readout chain, are also investigated offering a reduced cost as they are cheaper per unit area than traditional silicon detectors. If they contain the full readout chain, as for a fully monolithic approach, there is no need for the expensive flip-chip assembly, resulting in a further cost reduction and material savings. In the outer pixel layers of the ATLAS Inner Tracker, the pixel sensors must withstand non-ionising energy losses of up to 1015 n/cm2 and offer a timing resolution of 25 ns or less. This paper presents test results obtained on a monolithic test chip, the TowerJazz 180nm Investigator, towards these specifications. The presented program of radiation hardness and timing studies has been launched to investigate this technology's potential for the new ATLAS Inner Tracker.

  18. The BTeV pixel and microstrip detector

    SciTech Connect

    Simon W Kwan

    2003-06-04

    The BTeV pixel detector is one of the most crucial elements in the BTeV experiment. While the pixel detector is technically challenging, we have made great progress towards identifying viable solutions for individual components of the system. The forward silicon tracker is based on more mature technology and its design has benefited from the experience of other experiments. Nevertheless, we have started an R&D program on the forward silicon tracker and first results are expected some time next year.

  19. PANDA straw tube detectors and readout

    NASA Astrophysics Data System (ADS)

    Strzempek, P.

    2016-07-01

    PANDA is a detector under construction dedicated to studies of production and interaction of particles in the charmonium mass range using antiproton beams in the momentum range of 1.5 - 15 GeV/c at the Facility for Antiproton and Ion Research (FAIR) in Darmstadt. PANDA consists of two spectrometers: a Target Spectrometer with a superconducting solenoid and a Forward Spectrometer using a large dipole magnet and covering the most forward angles (Θ < 10 °). In both spectrometers, the particle's trajectories in the magnetic field are measured using self-supporting straw tube detectors. The expected high count rates, reaching up to 1 MHz/straw, are one of the main challenges for the detectors and associated readout electronics. The paper presents the readout chain of the tracking system and the results of tests performed with realistic prototype setups. The readout chain consists of a newly developed ASIC chip (PASTTREC < PANDASTTReadoutChip >) with amplification, signal shaping, tail cancellation, discriminator stages and Time Readout Boards as digitizer boards.

  20. Raman-based microarray readout: a review.

    PubMed

    Haisch, Christoph

    2016-07-01

    For a quarter of a century, microarrays have been part of the routine analytical toolbox. Label-based fluorescence detection is still the commonest optical readout strategy. Since the 1990s, a continuously increasing number of label-based as well as label-free experiments on Raman-based microarray readout concepts have been reported. This review summarizes the possible concepts and methods and their advantages and challenges. A common label-based strategy is based on the binding of selective receptors as well as Raman reporter molecules to plasmonic nanoparticles in a sandwich immunoassay, which results in surface-enhanced Raman scattering signals of the reporter molecule. Alternatively, capture of the analytes can be performed by receptors on a microarray surface. Addition of plasmonic nanoparticles again leads to a surface-enhanced Raman scattering signal, not of a label but directly of the analyte. This approach is mostly proposed for bacteria and cell detection. However, although many promising readout strategies have been discussed in numerous publications, rarely have any of them made the step from proof of concept to a practical application, let alone routine use. Graphical Abstract Possible realization of a SERS (Surface-Enhanced Raman Scattering) system for microarray readout.

  1. Microwave multiplex readout for superconducting sensors

    NASA Astrophysics Data System (ADS)

    Ferri, E.; Becker, D.; Bennett, D.; Faverzani, M.; Fowler, J.; Gard, J.; Giachero, A.; Hays-Wehle, J.; Hilton, G.; Maino, M.; Mates, J.; Puiu, A.; Nucciotti, A.; Reintsema, C.; Schmidt, D.; Swetz, D.; Ullom, J.; Vale, L.

    2016-07-01

    The absolute neutrino mass scale is still an outstanding challenge in both particle physics and cosmology. The calorimetric measurement of the energy released in a nuclear beta decay is a powerful tool to determine the effective electron-neutrino mass. In the last years, the progress on low temperature detector technologies has allowed to design large scale experiments aiming at pushing down the sensitivity on the neutrino mass below 1 eV. Even with outstanding performances in both energy ( eV on keV) and time resolution ( 1 μs) on the single channel, a large number of detectors working in parallel is required to reach a sub-eV sensitivity. Microwave frequency domain readout is the best available technique to readout large array of low temperature detectors, such as Transition Edge Sensors (TESs) or Microwave Kinetic Inductance Detectors (MKIDs). In this way a multiplex factor of the order of thousands can be reached, limited only by the bandwidth of the available commercial fast digitizers. This microwave multiplexing system will be used to readout the HOLMES detectors, an array of 1000 microcalorimeters based on TES sensors in which the 163Ho will be implanted. HOLMES is a new experiment for measuring the electron neutrino mass by means of the electron capture (EC) decay of 163Ho. We present here the microwave frequency multiplex which will be used in the HOLMES experiment and the microwave frequency multiplex used to readout the MKID detectors developed in Milan as well.

  2. A microstrip detector with delay line readout

    SciTech Connect

    Barbosa, A.F. , BP 220, 38043 Grenoble CNPq Riekel, C.; Wattecamps, P. , BP 220, 38043 Grenoble )

    1992-01-01

    Principal limitations of position sensitive gasfilled detectors for x-ray synchrotron radiation applications are the counting rate and the positional resolution. Improvements in both areas are expected with microstrip technology. First results of a linear position sensitive microstrip detector with delay line readout are shown, and the possibility to achieve two-dimensional localization is evaluated.

  3. Daily weather direct readout microprocessor study

    NASA Technical Reports Server (NTRS)

    Davisson, L. D.; Davisson, J. B.

    1976-01-01

    The work completed included a study of the requirements and hardware and software implementation techniques for NIMBUS ESMR and TWERLE direct readout applications using microprocessors. Many microprocessors were studied for this application. Because of the available Interdata development capabilities, it was concluded that future implementations be on an Interdata microprocessor which was found adequate for the task.

  4. A Review of Infrared Readout Electronics for Space Science Sensors

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Fossum, Eric R.

    1993-01-01

    A review of infrared readout electornics for space science sensors is presented. General requirements for scientific IR FPA readout are discussed. Specific approaches to the unit cell electronics are described with respect to operation, complexity, noise and other operating parameters. Recent achievements in IR FPA readout electronics are reviewed. Implementation technologies for realization of IR FPA readout electronics are discussed. Future directions for addressing NASA and other scientific users' needs are suggested.

  5. SiPM based readout system for PbWO4 crystals

    NASA Astrophysics Data System (ADS)

    Berra, A.; Bolognini, D.; Bonfanti, S.; Bonvicini, V.; Lietti, D.; Penzo, A.; Prest, M.; Stoppani, L.; Vallazza, E.

    2013-08-01

    Silicon PhotoMultipliers (SiPMs) consist of a matrix of small passively quenched silicon avalanche photodiodes operated in limited Geiger-mode (GM-APDs) and read out in parallel from a common output node. Each pixel (with a typical size in the 20-100 μm range) gives the same current response when hit by a photon; the SiPM output signal is the sum of the signals of all the pixels, which depends on the light intensity. The main advantages of SiPMs with respect to photomultiplier tubes (PMTs) are essentially the small dimensions, the insensitivity to magnetic fields and a low bias voltage. This contribution presents the performance of a SiPM based readout system for crystal calorimeters developed in the framework of the FACTOR/TWICE collaboration. The SiPM used for the test is a new device produced by FBK-irst which consists in a matrix of four sensors embedded in the same silicon substrate, called QUAD. The SiPM has been coupled to a lead tungstate crystal, an early-prototype version of the crystals developed for the electromagnetic calorimeter of the CMS experiment. New tests are foreseen using a complete module consisting of nine crystals, each one readout by two QUADs.

  6. Dedicated multichannel readout ASIC coupled with single crystal diamond for dosimeter application

    NASA Astrophysics Data System (ADS)

    Fabbri, A.; Falco, M. D.; De Notaristefani, F.; Galasso, M.; Marinelli, M.; Orsolini Cencelli, V.; Tortora, L.; Verona, C.; Verona Rinati, G.

    2013-02-01

    This paper reports on the tests of a low-noise, multi-channel readout integrated circuit used as a readout electronic front-end for a diamond multi-pixel dosimeter. The system is developed for dose distribution measurement in radiotherapy applications. The first 10-channel prototype chip was designed and fabricated in a 0.18 um CMOS process. Every channel includes a charge integrator with a 10 pF capacitor and a double slope A/D converter. The diamond multi-pixel detector, based on CVD synthetic single crystal diamond Schottky diodes, is made by a 3 × 3 sensor matrix. The overall device has been tested under irradiation with 6 MeV radio therapeutic photon beams at the Policlinico ``Tor Vergata'' (PTV) hospital. Measurements show a 20 fA RMS leakage current from the front-end input stage and a negligible dark current from the diamond detector, a stable temporal response and a good linear behaviour as a function of both dose and dose rate. These characteristics were common to each tested channel.

  7. USB 3.0 readout and time-walk correction method for Timepix3 detector

    NASA Astrophysics Data System (ADS)

    Turecek, D.; Jakubek, J.; Soukup, P.

    2016-12-01

    The hybrid particle counting pixel detectors of Medipix family are well known. In this contribution we present new USB 3.0 based interface AdvaDAQ for Timepix3 detector. The AdvaDAQ interface is designed with a maximal emphasis to the flexibility. It is successor of FitPIX interface developed in IEAP CTU in Prague. Its modular architecture supports all Medipix/Timepix chips and all their different readout modes: Medipix2, Timepix (serial and parallel), Medipix3 and Timepix3. The high bandwidth of USB 3.0 permits readout of 1700 full frames per second with Timepix or 8 channel data acquisition from Timepix3 at frequency of 320 MHz. The control and data acquisition is integrated in a multiplatform PiXet software (MS Windows, Mac OS, Linux). In the second part of the publication a new method for correction of the time-walk effect in Timepix3 is described. Moreover, a fully spectroscopic X-ray imaging with Timepix3 detector operated in the ToT mode (Time-over-Threshold) is presented. It is shown that the AdvaDAQ's readout speed is sufficient to perform spectroscopic measurement at full intensity of radiographic setups equipped with nano- or micro-focus X-ray tubes.

  8. Validation of a highly integrated SiPM readout system with a TOF-PET demonstrator

    NASA Astrophysics Data System (ADS)

    Niknejad, T.; Setayeshi, S.; Tavernier, S.; Bugalho, R.; Ferramacho, L.; Di Francesco, A.; Leong, C.; Rolo, M. D.; Shamshirsaz, M.; Silva, J. C.; Silva, R.; Silveira, M.; Zorraquino, C.; Varela, J.

    2016-12-01

    We have developed a highly integrated, fast and compact readout electronics for Silicon Photomultiplier (SiPM) based Time of Flight Positron Emission Tomography (TOF-PET) scanners. The readout is based on the use of TOP-PET Application Specific Integrated Circuit (PETsys TOFPET1 ASIC) with 64 channels, each with its amplifier, discriminator, Time to Digital Converter (TDC) and amplitude determination using Time Over Threshold (TOT). The ASIC has 25 ps r.m.s. intrinsic time resolution and fully digital output. The system is optimised for high rates, good timing, low power consumption and low cost. For validating the readout electronics, we have built a technical PET scanner, hereafter called ``demonstrator'', with 2'048 SiPM channels. The PET demonstrator has 16 compact Detector Modules (DM). Each DM has two ASICs reading 128 SiPM pixels in one-to-one coupling to 128 Lutetium Yttrium Orthosilicate (LYSO) crystals measuring 3.1 × 3.1 × 15 mm3 each. The data acquisition system for the demonstrator has two Front End Boards type D (FEB/D), each collecting the data of 1'024 channels (8 DMs), and transmitting assembled data frames through a serial link (4.8 Gbps), to a single Data Acquisition (DAQ) board plugged into the Peripheral Component Interconnect Express (PCIe) bus of the data acquisition PC. Results obtained with this PET demonstrator are presented.

  9. Achieving subpixel resolution with time-correlated transient signals in pixelated CdZnTe gamma-ray sensors using a focused laser beam (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Ocampo Giraldo, Luis A.; Bolotnikov, Aleksey E.; Camarda, Giuseppe S.; Cui, Yonggang; De Geronimo, Gianluigi; Gul, Rubi; Fried, Jack; Hossain, Anwar; Unlu, Kenan; Vernon, Emerson; Yang, Ge; James, Ralph B.

    2017-05-01

    High-resolution position-sensitive detectors have been proposed to correct response non-uniformities in Cadmium Zinc Telluride (CZT) crystals by virtually subdividing the detectors area into small voxels and equalizing responses from each voxel. 3D pixelated detectors coupled with multichannel readout electronics are the most advanced type of CZT devices offering many options in signal processing and enhancing detector performance. One recent innovation proposed for pixelated detectors is to use the induced (transient) signals from neighboring pixels to achieve high sub-pixel position resolution while keeping large pixel sizes. The main hurdle in achieving this goal is the relatively low signal induced on the neighboring pixels because of the electrostatic shielding effect caused by the collecting pixel. In addition, to achieve high position sensitivity one should rely on time-correlated transient signals, which means that digitized output signals must be used. We present the results of our studies to measure the amplitude of the pixel signals so that these can be used to measure positions of the interaction points. This is done with the processing of digitized correlated time signals measured from several adjacent pixels taking into account rise-time and charge-sharing effects. In these measurements we used a focused pulsed laser to generate a 10-micron beam at one milliwatt (650-nm wavelength) over the detector surface while the collecting pixel was moved in cardinal directions. The results include measurements that present the benefits of combining conventional pixel geometry with digital pulse processing for the best approach in achieving sub-pixel position resolution with the pixel dimensions of approximately 2 mm. We also present the sub-pixel resolution measurements at comparable energies from various gamma emitting isotopes.

  10. Making a trillion pixels dance

    NASA Astrophysics Data System (ADS)

    Singh, Vivek; Hu, Bin; Toh, Kenny; Bollepalli, Srinivas; Wagner, Stephan; Borodovsky, Yan

    2008-03-01

    In June 2007, Intel announced a new pixelated mask technology. This technology was created to address the problem caused by the growing gap between the lithography wavelength and the feature sizes patterned with it. As this gap has increased, the quality of the image has deteriorated. About a decade ago, Optical Proximity Correction (OPC) was introduced to bridge this gap, but as this gap continued to increase, one could not rely on the same basic set of techniques to maintain image quality. The computational lithography group at Intel sought to alleviate this problem by experimenting with additional degrees of freedom within the mask. This paper describes the resulting pixelated mask technology, and some of the computational methods used to create it. The first key element of this technology is a thick mask model. We realized very early in the development that, unlike traditional OPC methods, the pixelated mask would require a very accurate thick mask model. Whereas in the traditional methods, one can use the relatively coarse approximations such as the boundary layer method, use of such techniques resulted not just in incorrect sizing of parts of the pattern, but in whole features missing. We built on top of previously published domain decomposition methods, and incorporated limitations of the mask manufacturing process, to create an accurate thick mask model. Several additional computational techniques were invoked to substantially increase the speed of this method to a point that it was feasible for full chip tapeout. A second key element of the computational scheme was the comprehension of mask manufacturability, including the vital issue of the number of colors in the mask. While it is obvious that use of three or more colors will give the best image, one has to be practical about projecting mask manufacturing capabilities for such a complex mask. To circumvent this serious issue, we eventually settled on a two color mask - comprising plain glass and etched

  11. Optimization of thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Beyer, J.; La Rosa, A.; Nisius, R.; Savic, N.

    2017-01-01

    The ATLAS experiment will undergo around the year 2025 a replacement of the tracker system in view of the high luminosity phase of the LHC (HL-LHC) with a new 5-layer pixel system. Thin planar pixel sensors are promising candidates to instrument the innermost region of the new pixel system, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. The sensors of 50-150 μm thickness, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests. In particular active edge sensors have been investigated. The performance of two different versions of edge designs are compared: the first with a bias ring, and the second one where only a floating guard ring has been implemented. The hit efficiency at the edge has also been studied after irradiation at a fluence of 1015 neq/cm2. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50x50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angles with respect to the short pixel direction. Results on the hit efficiency in this configuration are discussed for different sensor thicknesses.

  12. Characterization of double modified internal gate pixel by 3D simulation study

    NASA Astrophysics Data System (ADS)

    Aurola, A.; Marochkin, V.; Tuuva, T.

    2015-01-01

    We have developed a novel detector concept based on Modified Internal Gate Field Effect Transistor (MIGFET) wherein a buried Modified Internal Gate (MIG) is implanted underneath a channel of a FET. In between the MIG and the channel of the FET there is a depleted semiconductor material forming a potential barrier between charges in the channel and similar type signal charges located in the MIG. The signal charges in the MIG have a measurable effect on the conductance of the channel. In this paper a double MIGFET pixel is investigated comprising two MIGFETs. By transferring the signal charges between the two MIGs Non-Destructive Correlated Double Sampling Readout (NDCDSR) is enabled. The proposed MIG radiation detector suits particularly well for low-light-level imaging, X-ray spectroscopy, as well as synchrotron and X-ray Free Electron Laser (XFEL) facilities. The reason for the excellent X-ray detection performance stems from the fact that interface related issues can be considerably mitigated since interface generated dark noise can be completely avoided and interface generated 1/f and Random Telegraph Signal (RTS) noise can be considerably reduced due to a deep buried channel readout configuration. Electrical parameters of the double MIGFET pixel have been evaluated by 3D TCAD simulation study. Simulation results show the absence of interface generated dark noise, significantly reduced interface generated 1/f and RTS noise, well performing NDCDSR operation, and blooming protection due to an inherent vertical anti-blooming structure. In addition, the backside illuminated thick fully depleted pixel design provides a homogeneous radiation entry window, low crosstalk due to lack of diffusion, and good quantum efficiency for low energy X-rays and NIR light. These facts result in excellent Signal-to-Noise Ratio (SNR) and very low crosstalk enabling thus excellent X-ray energy and spatial resolution. The simulation demonstrates the charge to current conversion gain for

  13. Improved Design of Active Pixel CMOS Sensors for Charged Particle Detection

    SciTech Connect

    Deptuch, Grzegorz

    2007-11-12

    The Department of Energy (DOE) nuclear physics program requires developments in detector instrumentation electronics with improved energy, position and timing resolution, sensitivity, rate capability, stability, dynamic range, and background suppression. The current Phase-I project was focused on analysis of standard-CMOS photogate Active Pixel Sensors (APS) as an efficient solution to this challenge. The advantages of the CMOS APS over traditional hybrid approaches (i.e., separate detection regions bump-bonded to readout circuits) include greatly reduced cost, low power and the potential for vastly larger pixel counts and densities. However, challenges remain in terms of the signal-to-noise ratio (SNR) and readout speed (currently on the order of milliseconds), which is the major problem for this technology. Recent work has shown that the long readout time for photogate APS is due to the presence of (interface) traps at the semiconductor-oxide interface. This Phase-I work yielded useful results in two areas: (a) Advanced three-dimensional (3D) physics-based simulation models and simulation-based analysis of the impact of interface trap density on the transient charge collection characteristics of existing APS structures; and (b) Preliminary analysis of the feasibility of an improved photogate pixel structure (i.e., new APS design) with an induced electric field under the charge collecting electrode to enhance charge collection. Significant effort was dedicated in Phase-I to the critical task of implementing accurate interface trap models in CFDRC's NanoTCAD 3D semiconductor device-physics simulator. This resulted in validation of the new NanoTCAD models and simulation results against experimental (published) data, within the margin of uncertainty associated with obtaining device geometry, material properties, and experimentation details. Analyses of the new, proposed photogate APS design demonstrated several promising trends.

  14. TFT-Based Active Pixel Sensors for Large Area Thermal Neutron Detection

    NASA Astrophysics Data System (ADS)

    Kunnen, George

    Due to diminishing availability of 3He, which is the critical component of neutron detecting proportional counters, large area flexible arrays are being considered as a potential replacement for neutron detection. A large area flexible array, utilizing semiconductors for both charged particle detection and pixel readout, ensures a large detection surface area in a light weight rugged form. Such a neutron detector could be suitable for deployment at ports of entry. The specific approach used in this research, uses a neutron converter layer which captures incident thermal neutrons, and then emits ionizing charged particles. These ionizing particles cause electron-hole pair generation within a single pixel's integrated sensing diode. The resulting charge is then amplified via a low-noise amplifier. This document begins by discussing the current state of the art in neutron detection and the associated challenges. Then, for the purpose of resolving some of these issues, recent design and modeling efforts towards developing an improved neutron detection system are described. Also presented is a low-noise active pixel sensor (APS) design capable of being implemented in low temperature indium gallium zinc oxide (InGaZnO) or amorphous silicon (a-Si:H) thin film transistor process compatible with plastic substrates. The low gain and limited scalability of this design are improved upon by implementing a new multi-stage self-resetting APS. For each APS design, successful radiation measurements are also presented using PiN diodes for charged particle detection. Next, detection array readout methodologies are modeled and analyzed, and use of a matched filter readout circuit is described as well. Finally, this document discusses detection diode integration with the designed TFT-based APSs.

  15. A fast embedded readout system for large-area Medipix and Timepix systems

    NASA Astrophysics Data System (ADS)

    Brogna, A. S.; Balzer, M.; Smale, S.; Hartmann, J.; Bormann, D.; Hamann, E.; Cecilia, A.; Zuber, M.; Koenig, T.; Zwerger, A.; Weber, M.; Fiederle, M.; Baumbach, T.

    2014-05-01

    In this work we present a novel readout electronics for an X-ray sensor based on a Si crystal bump-bonded to an array of 3 × 2 Medipix ASICs. The pixel size is 55 μm × 55 μm with a total number of ~ 400k pixels and a sensitive area of 42 mm × 28 mm. The readout electronics operate Medipix-2 MXR or Timepix ASICs with a clock speed of 125 MHz. The data acquisition system is centered around an FPGA and each of the six ASICs has a dedicated I/O port for simultaneous data acquisition. The settings of the auxiliary devices (ADCs and DACs) are also processed in the FPGA. Moreover, a high-resolution timer operates the electronic shutter to select the exposure time from 8 ns to several milliseconds. A sophisticated trigger is available in hardware and software to synchronize the acquisition with external electro-mechanical motors. The system includes a diagnostic subsystem to check the sensor temperature and to control the cooling Peltier cells and a programmable high-voltage generator to bias the crystal. A network cable transfers the data, encapsulated into the UDP protocol and streamed at 1 Gb/s. Therefore most notebooks or personal computers are able to process the data and to program the system without a dedicated interface. The data readout software is compatible with the well-known Pixelman 2.x running both on Windows and GNU/Linux. Furthermore the open architecture encourages users to write their own applications. With a low-level interface library which implements all the basic features, a MATLAB or Python script can be implemented for special manipulations of the raw data. In this paper we present selected images taken with a microfocus X-ray tube to demonstrate the capability to collect the data at rates up to 120 fps corresponding to 0.76 Gb/s.

  16. Application of pixel array detectors at x-ray synchrotrons.

    SciTech Connect

    Miceli, N.; X-Ray Science Division

    2009-03-01

    Pixel array detectors have only recently been seriously used at x-ray synchrotrons. We describe the application of a digital pixel array detector (Pilatus100k) to a variety of synchrotron experiments at the Advanced Photon Source at Argonne National Laboratory. The Pilatus100k was developed at the Paul Scherrer Institut (PSI). It has been commercialized by a PSI spinoff (Dectrics Ltd.) This is the first commercially available pixel array detector for x-ray synchrotron applications. The APS synchrotron provides tunable x-ray pulses with duration of {approx}80 ps and a repetition period of 153 ns (24-bunch mode). The Pilatus100k is a direct detection x-ray detector where each 172 micron pixel counts individual x-ray pulses above a lower threshold. It consists of {approx}100k pixels each of which is capable of single-photon counting (>3 keV) at count rates up to {approx}1 MHz. In addition, the Pilatus100k is an electronically gateable detector. We present data showing that the Pilatus100k is capable of isolating a single x-ray bunch at the APS in 24 bunch mode. We will also present a variety of different experiments exploiting the unique capabilities of the Pilatus100k.

  17. Performance of a prototype 32×32 pixel indirect x-ray imager based on a lateral selenium passive pixel sensor

    NASA Astrophysics Data System (ADS)

    Keshavarzi, Rasoul; Wang, Kai; Yazdandoost, Mohammad Y.; Shin, Kyung-Wook; Chen, Feng; Majid, Shaikh Hasibul; Abbaszadeh, Shiva; Karim, Karim S.

    2012-03-01

    An interface has been developed to capture frames taken by X-ray array imagers up to 64×64 pixels. An application specific integrated circuit (ASIC) designed solely for X-ray flat panel imaging readout circuitry, manufactured by FLIR® called Indigo (also known as ISC9717), was used as part of charge-amplifier block. An Altera Cyclone II FPGA is used to serve three purposes: Create pulses required for gate-driver block, Receive fast-stream data coming from the Indigo chip, and Send data through RS-232 protocol over a serial cable to a personal computer. Initial results for a 32×32 passive pixel sensor (PPS) with lateral amorphous Selenium metal-semiconductor-metal (MSM) photodetector were presented in [1]. This work focuses more on methods used to improve the images obtained from the array. Sharper images produced in sync with the light source are presented. In addition, insight into array readout circuitry and capturing a frame from an array is discussed.

  18. A pixel detector-based single photon-counting system as fast spectrometer for diagnostic X-ray beams.

    PubMed

    Carpentieri, C; Bisogni, M G; Del Guerra, A; Delogu, P; Fantacci, M E; Fogli, J; Marchi, A; Marzulli, V; Rosso, V; Stefanini, A; Tofani, A

    2008-01-01

    Recent advances in semiconductor pixel detectors and read-out electronics allowed to build the first prototypes of single photon-counting imaging systems that represent the last frontier of digital radiography. Among the advantages with respect to commercially available digital imaging systems, there are direct conversion of photon energy into electrical charge and the effective rejection of electronic noise by means of a thresholding process. These features allow the photon-counting systems to achieve high imaging performances in terms of spatial and contrast resolution. Moreover, the now available deep integration techniques allow the reduction of the pixel size and the improvement of the functionality of the single cell and the read-out speed so as to cope with the high fluxes found in diagnostic radiology. In particular, the single photon-counting system presented in this paper is based on a 300-microm thick silicon pixel detector bump-bonded to the Medipix2 read-out chip to form an assembly of 256 x 256 square pixels at a pitch of 55 microm. Each cell comprises a low-noise preamplifier, two pulse height discriminators and a 14-bit counter. The maximum counting rate per pixel is 1 MHz. The chip can operate in two modalities: it records the events with energy above a threshold (single mode) or between two energy thresholds (window mode). Exploiting this latter feature, a possible application of such a system as a fast spectrometer is presented to study the energy spectrum of diagnostic beams produced by X-ray tubes.

  19. Room temperature 1040fps, 1 megapixel photon-counting image sensor with 1.1um pixel pitch

    NASA Astrophysics Data System (ADS)

    Masoodian, S.; Ma, J.; Starkey, D.; Wang, T. J.; Yamashita, Y.; Fossum, E. R.

    2017-05-01

    A 1Mjot single-bit quanta image sensor (QIS) implemented in a stacked backside-illuminated (BSI) process is presented. This is the first work to report a megapixel photon-counting CMOS-type image sensor to the best of our knowledge. A QIS with 1.1μm pitch tapered-pump-gate jots is implemented with cluster-parallel readout, where each cluster of jots is associated with its own dedicated readout electronics stacked under the cluster. Power dissipation is reduced with this cluster readout because of the reduced column bus parasitic capacitance, which is important for the development of 1Gjot arrays. The QIS functions at 1040fps with binary readout and dissipates only 17.6mW, including I/O pads. The readout signal chain uses a fully differential charge-transfer amplifier (CTA) gain stage before a 1b-ADC to achieve an energy/bit FOM of 16.1pJ/b and 6.9pJ/b for the whole sensor and gain stage+ADC, respectively. Analog outputs with on-chip gain are implemented for pixel characterization purposes.

  20. Fully 3D-Integrated Pixel Detectors for X-Rays

    DOE PAGES

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; ...

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.« less