Science.gov

Sample records for individual pixel readout

  1. Development of a pixel readout chip for BTeV

    SciTech Connect

    D.C. Christian et al.

    1998-11-01

    A description is given of the R&D program underway at Fermilab to develop a pixel readout ASIC appropriate for use at the Tevatron collider. Results are presentetd frOm tests performed on the first prototype pixel readout chip deigned at Fermilab, and a new readout architecture is described.

  2. Data encoding efficiency in pixel detector readout with charge information

    NASA Astrophysics Data System (ADS)

    Garcia-Sciveres, Maurice; Wang, Xinkang

    2016-04-01

    The average minimum number of bits needed for lossless readout of a pixel detector is calculated, in the regime of interest for particle physics where only a small fraction of pixels have a non-zero value per frame. This permits a systematic comparison of the readout efficiency of different encoding implementations. The calculation is compared to the number of bits used by the FE-I4 pixel readout chip of the ATLAS experiment.

  3. Active pixel sensor array with multiresolution readout

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Kemeny, Sabrina E. (Inventor); Pain, Bedabrata (Inventor)

    1999-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node. There is also a readout circuit, part of which can be disposed at the bottom of each column of cells and be common to all the cells in the column. The imaging device can also include an electronic shutter formed on the substrate adjacent the photogate, and/or a storage section to allow for simultaneous integration. In addition, the imaging device can include a multiresolution imaging circuit to provide images of varying resolution. The multiresolution circuit could also be employed in an array where the photosensitive portion of each pixel cell is a photodiode. This latter embodiment could further be modified to facilitate low light imaging.

  4. Pixel readout electronics for LHC and biomedical applications

    NASA Astrophysics Data System (ADS)

    Blanquart, L.; Bonzom, V.; Comes, G.; Delpierre, P.; Fischer, P.; Hausmann, J.; Keil, M.; Lindner, M.; Meuser, S.; Wermes, N.

    2000-01-01

    The demanding requirements for pixel readout electronics for high-energy physics experiments and biomedical applications are reviewed. Some examples of the measured analog performance of prototype chips are given. The readout architectures of the PIxel Readout for the ATlas Experiment (PIRATE) chip suited for LHC experiments and of the Multi Picture Element Counter (MPEC) counting chip targeted for biomedical applications are presented. First results with complete chip-sensor assemblies are also shown.

  5. FPIX2, the BTeV pixel readout chip

    SciTech Connect

    David C. Christian et al.

    2003-12-10

    A radiation tolerant pixel readout chip, FPIX2, has been developed at Fermilab for use by BTeV. Some of the requirements of the BTeV pixel readout chip are reviewed and contrasted with requirements for similar devices in LHC experiments. A description of the FPIX2 is given, and results of initial tests of its performance are presented, as is a summary of measurements planned for the coming year.

  6. Vertically integrated pixel readout chip for high energy physics

    SciTech Connect

    Deptuch, Grzegorz; Demarteau, Marcel; Hoff, James; Khalid, Farah; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2011-01-01

    We report on the development of the vertex detector pixel readout chips based on multi-tier vertically integrated electronics for the International Linear Collider. Some testing results of the VIP2a prototype are presented. The chip is the second iteration of the silicon implementation of the prototype, data-pushed concept of the readout developed at Fermilab. The device was fabricated in the 3D MIT-LL 0.15 {micro}m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 {micro}m{sup 2} pixels, laid out in an array of 48 x 48 pixels.

  7. Readout of TPC Tracking Chambers with GEMs and Pixel Chip

    SciTech Connect

    Kadyk, John; Kim, T.; Freytsis, M.; Button-Shafer, J.; Kadyk, J.; Vahsen, S.E.; Wenzel, W.A.

    2007-12-21

    Two layers of GEMs and the ATLAS Pixel Chip, FEI3, have been combined and tested as a prototype for Time Projection Chamber (TPC) readout at the International Linear Collider (ILC). The double-layer GEM system amplifies charge with gain sufficient to detect all track ionization. The suitability of three gas mixtures for this application was investigated, and gain measurements are presented. A large sample of cosmic ray tracks was reconstructed in 3D by using the simultaneous timing and 2D spatial information from the pixel chip. The chip provides pixel charge measurement as well as timing. These results demonstrate that a double GEM and pixel combination, with a suitably modified pixel ASIC, could meet the stringent readout requirements of the ILC.

  8. High frame rate measurements of semiconductor pixel detector readout IC

    NASA Astrophysics Data System (ADS)

    Szczygiel, R.; Grybos, P.; Maj, P.

    2012-07-01

    We report on high count rate and high frame rate measurements of a prototype IC named FPDR90, designed for readouts of hybrid pixel semiconductor detectors used for X-ray imaging applications. The FPDR90 is constructed in 90 nm CMOS technology and has dimensions of 4 mm×4 mm. Its main part is a matrix of 40×32 pixels with 100 μm×100 μm pixel size. The chip works in the single photon counting mode with two discriminators and two 16-bit ripple counters per pixel. The count rate per pixel depends on the effective CSA feedback resistance and can be set up to 6 Mcps. The FPDR90 can operate in the continuous readout mode, with zero dead time. Due to the architecture of digital blocks in pixel, one can select the number of bits read out from each counter from 1 to 16. Because in the FPDR90 prototype only one data output is available, the frame rate is 9 kfps and 72 kfps for 16 bits and 1 bit readout, respectively (with nominal clock frequency of 200 MHz).

  9. Performance of Pixel-Readout Micro-Pixel Chamber with Analog-Readout System Used as X-ray Polarimeter

    NASA Astrophysics Data System (ADS)

    Katagiri, Hideaki; Ono, Kenichi; Uchiyama, Hideki; Tsuru, Takeshi Go; Matsumoto, Hironori; Hyodo, Yoshiaki; Kubo, Hidetoshi; Miuchi, Kentaro; Tanimori, Toru

    2007-12-01

    We developed an analog-readout system for a pixel-readout micro-pixel chamber (μ-PIC) to be used as an astronomical X-ray polarimeter, and demonstrated that the sensitivity of the new system reached up to that predicted by a simulation. A pixel-readout μ-PIC is a micro-pattern gaseous detector with a fine position resolution and good stability at sufficient gain operation, and is suited for astronomical X-ray polarimetry. However, as shown by Katagiri et al. (2007), the sensitivity to X-ray polarization was found to be statistically lower by a significant amount than that expected from the simulation of Ueno et al. [Nucl. Instrum. Methods Phys. Res., Sect. A 525 (2004) 28] because of the readout system and background produced by the scattering of the X-ray beam in air. We therefore developed a new readout system and carried out a beam test with aluminum tubes that reduced the background. As a result, we demonstrated that for collimated beams, the modulation factors, which are indicators of the sensitivity to X-ray polarization, were 0.24± 0.08 at 8 keV and 0.18± 0.07 at 15 keV in a neon-based gas mixture, and 0.18± 0.04 at 15 keV in an argon-based mixture. These values are consistent with those predicted by the simulation within errors.

  10. Detector apparatus having a hybrid pixel-waveform readout system

    DOEpatents

    Meng, Ling-Jian

    2014-10-21

    A gamma ray detector apparatus comprises a solid state detector that includes a plurality of anode pixels and at least one cathode. The solid state detector is configured for receiving gamma rays during an interaction and inducing a signal in an anode pixel and in a cathode. An anode pixel readout circuit is coupled to the plurality of anode pixels and is configured to read out and process the induced signal in the anode pixel and provide triggering and addressing information. A waveform sampling circuit is coupled to the at least one cathode and configured to read out and process the induced signal in the cathode and determine energy of the interaction, timing of the interaction, and depth of interaction.

  11. A generic readout environment for prototype pixel detectors

    NASA Astrophysics Data System (ADS)

    Turqueti, Marcos; Rivera, Ryan; Prosser, Alan; Kwan, Simon

    2010-11-01

    Pixel detectors for experimental particle physics research have been implemented with a variety of readout formats and potentially generate massive amounts of data. Examples include the PSI46 device for the Compact Muon Solenoid (CMS) experiment which implements an analog readout, the Fermilab FPIX2.1 device with a digital readout, and the Fermilab Vertically Integrated Pixel device. The Electronic Systems Engineering Department of the Computing Division at the Fermi National Accelerator Laboratory has developed a data acquisition system flexible and powerful enough to meet the various needs of these devices to support laboratory test bench as well as test beam applications. The system is called CAPTAN (Compact And Programmable daTa Acquisition Node) and is characterized by its flexibility, versatility and scalability by virtue of several key architectural features. These include a vertical bus that permits the user to stack multiple boards, a gigabit Ethernet link that permits high speed communications to the system and a core group of boards that provide specific processing and readout capabilities for the system. System software based on distributed computing techniques supports an expandable network of CAPTANs. In this paper, we describe the system architecture and give an overview of its capabilities.

  12. Monolithic pixels on moderate resistivity substrate and sparsifying readout architecture

    NASA Astrophysics Data System (ADS)

    Giubilato, P.; Battaglia, M.; Bisello, D.; Caselle, M.; Chalmet, P.; Demaria, L.; Ikemoto, Y.; Kloukinas, K.; Mansuy, S. C.; Mattiazzo, S.; Marchioro, A.; Mugnier, H.; Pantano, D.; Potenza, A.; Rivetti, A.; Rousset, J.; Silvestrin, L.; Snoeys, W.

    2013-12-01

    The LePix projects aim realizing a new generation monolithic pixel detectors with improved performances at lesser cost with respect to both current state of the art monolithic and hybrid pixel sensors. The detector is built in a 90 nm CMOS process on a substrate of moderate resistivity. This allows charge collection by drift while maintaining the other advantages usually offered by MAPS, like having a single piece detector and using a standard CMOS production line. The collection by drift mechanism, coupled to the low capacitance design of the collecting node made possible by the monolithic approach, provides an excellent signal to noise ratio straight at the pixel cell together with a radiation tolerance far superior to conventional un-depleted MAPS. The excellent signal-to-noise performance is demonstrated by the device ability to separate the 6 keV 55Fe double peak at room temperature. To achieve high granularity (10-20 μm pitch pixels) over large detector areas maintaining high readout speed, a completely new compressing architecture has been devised. This architecture departs from the mainstream hybrid pixel sparsification approach, which uses in-pixel logic to reduce data, by using topological compression to minimize pixel area and power consumption.

  13. Transversal-readout CMOS active pixel image sensor

    NASA Astrophysics Data System (ADS)

    Miyatake, Shigehiro; Ishida, Kouichi; Morimoto, Takashi; Masaki, Yasuo; Tanabe, Hideki

    2001-05-01

    This paper presents a CMOS active pixel image sensor (APS) with a transversal readout architecture that eliminates the vertically striped fixed pattern noise (FPN). There are two kinds of FPNs for CMOS APSs. One originates form the pixel- to-pixel variation in dark current and source-follower threshold voltage, and the other from the column-to-column variation in column readout structures. The former may become invisible in the future due to process improvements. However, the latter, which result sin a vertically striped FPN, is and will be conspicuous without some subtraction because of the correlation in the vertical direction. The pixel consists of a photodiode, a row- and a column-reset transistor, a source follower input transistor, and a column-select transistor instead of the row-select transistor in conventional CMOS APSs. The column-select transistor is connected to a signal line, which runs horizontally instead of vertically. Every horizontal signal line is merged into a single vertical signal line via a row- select transistor, which can be made large enough to make its on-resistence variation negligible because of its low driving frequency. Therefore, the sensor has neither a vertical nor horizontal stripe FPN.

  14. Development of a novel pixel-level signal processing chain for fast readout 3D integrated CMOS pixel sensors

    NASA Astrophysics Data System (ADS)

    Fu, Y.; Torheim, O.; Hu-Guo, C.; Degerli, Y.; Hu, Y.

    2013-03-01

    In order to resolve the inherent readout speed limitation of traditional 2D CMOS pixel sensors, operated in rolling shutter readout, a parallel readout architecture has been developed by taking advantage of 3D integration technologies. Since the rows of the pixel array are zero-suppressed simultaneously instead of sequentially, a frame readout time of a few microseconds is expected for coping with high hit rates foreseen in future collider experiments. In order to demonstrate the pixel readout functionality of such a pixel sensor, a 2D proof-of-concept chip including a novel pixel-level signal processing chain was designed and fabricated in a 0.13 μm CMOS technology. The functionalities of this chip have been verified through experimental characterization.

  15. Small-Scale Readout Systems Prototype for the STAR PIXEL Detector

    SciTech Connect

    Szelezniak, Michal A.; Besson, Auguste; Colledani, Claude; Dorokhov, Andrei; Dulinski, Wojciech; Greiner, Leo C.; Himmi, Abdelkader; Hu, Christine; Matis, Howard S.; Ritter, Hans Georg; Rose, Andrew; Shabetai, Alexandre; Stezelberger, Thorsten; Sun, Xiangming; Thomas, Jim H.; Valin, Isabelle; Vu, Chinh Q.; Wieman, Howard H.; Winter, Marc

    2008-10-01

    A prototype readout system for the STAR PIXEL detector in the Heavy Flavor Tracker (HFT) vertex detector upgrade is presented. The PIXEL detector is a Monolithic Active Pixel Sensor (MAPS) based silicon pixel vertex detector fabricated in a commercial CMOS process that integrates the detector and front-end electronics layers in one silicon die. Two generations ofMAPS prototypes designed specifically for the PIXEL are discussed. We have constructed a prototype telescope system consisting of three small MAPS sensors arranged in three parallel and coaxial planes with a readout system based on the readout architecture for PIXEL. This proposed readout architecture is simple and scales to the size required to readout the final detector. The real-time hit finding algorithm necessary for data rate reduction in the 400 million pixel detector is described, and aspects of the PIXEL system integration into the existing STAR framework are addressed. The complete system has been recently tested and shown to be fully functional.

  16. Digital pixel readout integrated circuit architectures for LWIR

    NASA Astrophysics Data System (ADS)

    Shafique, Atia; Yazici, Melik; Kayahan, Huseyin; Ceylan, Omer; Gurbuz, Yasar

    2015-06-01

    This paper presents and discusses digital pixel readout integrated circuit architectures for long wavelength infrared (LWIR) in CMOS technology. Presented architectures are designed for scanning and staring arrays type detectors respectively. For scanning arrays, digital time delay integration (TDI) is implemented on 8 pixels with sampling rate up to 3 using CMOS 180nm technology. Input referred noise of ROIC is below 750 rms electron meanwhile power dissipation is appreciably under 30mW. ROIC design is optimized to perform at room as well as cryogenic temperatures. For staring type arrays, a digital pixel architecture relying on coarse quantization with pulse frequency modulation (PFM) and novel approach of extended integration is presented. It can achieve extreme charge handling capacity of 2.04Ge- with 20 bit output resolution and power dissipation below 350 nW in CMOS 90nm technology. Efficient mechanism of measuring the time to estimate the remaining charge on integration capacitor in order to achieve low SNR has employed.

  17. Timepix3: a 65K channel hybrid pixel readout chip with simultaneous ToA/ToT and sparse readout

    NASA Astrophysics Data System (ADS)

    Poikela, T.; Plosila, J.; Westerlund, T.; Campbell, M.; De Gaspari, M.; Llopart, X.; Gromov, V.; Kluit, R.; van Beuzekom, M.; Zappon, F.; Zivkovic, V.; Brezina, C.; Desch, K.; Fu, Y.; Kruth, A.

    2014-05-01

    The Timepix3, hybrid pixel detector (HPD) readout chip, a successor to the Timepix \\cite{timepix2007} chip, can record time-of-arrival (ToA) and time-over-threshold (ToT) simultaneously in each pixel. ToA information is recorded in a 14-bit register at 40 MHz and can be refined by a further 4 bits with a nominal resolution of 1.5625 ns (640 MHz). ToT is recorded in a 10-bit overflow controlled counter at 40 MHz. Pixels can be programmed to record 14 bits of integral ToT and 10 bits of event counting, both at 40 MHz. The chip is designed in 130 nm CMOS and contains 256 × 256 pixel channels (55 × 55 μm2). The chip, which has more than 170 M transistors, has been conceived as a general-purpose readout chip for HPDs used in a wide range of applications. Common requirements of these applications are operation without a trigger signal, and sparse readout where only pixels containing event information are read out. A new architecture has been designed for sparse readout and can achieve a throughput of up to 40 Mhits/s/cm2. The flexible architecture offers readout schemes ranging from serial (one link) readout (40 Mbps) to faster parallel (up to 8 links) readout of 5.12 Gbps. In the ToA/ToT operation mode, readout is simultaneous with data acquisition thus keeping pixels sensitive at all times. The pixel matrix is formed by super pixel (SP) structures of 2 × 4 pixels. This optimizes resources by sharing the pixel readout logic which transports data from SPs to End-of-Column (EoC) using a 2-phase handshake protocol. To reduce power consumption in applications with a low duty cycle, an on-chip power pulsing scheme has been implemented. The logic switches bias currents of the analog front-ends in a sequential manner, and all front-ends can be switched in 800 ns. The digital design uses a mixture of commercial and custom standard cell libraries and was verified using Open Verification Methodology (OVM) and commercial timing analysis tools. The analog front-end and a

  18. A programmable, low noise, multichannel asic for readout of pixelated amorphous silicon arrays

    SciTech Connect

    Yarema, R. J.

    1998-08-01

    Pixelated amorphous silicon arrays used for detecting X-rays have a number of special requirements for the readout electronics. Because the pixel detector is a high density array, custom integrated circuits are very desirable for reading out the column signals and addressing the rows of pixels to be read out. In practice, separate chips are used for readout and addressing. This paper discusses a custom integrated circuit for processing the analog column signals. The chip has 32 channels of low noise integrators followed by sample and hold circuits which perform a correlated double sample. The chip has several programmable features including gain, bandwidth, and readout configuration.

  19. Optical readout in a multi-module system test for the ATLAS pixel detector

    NASA Astrophysics Data System (ADS)

    Flick, Tobias; Becks, Karl-Heinz; Gerlach, Peter; Kersten, Susanne; Mättig, Peter; Nderitu Kirichu, Simon; Reeves, Kendall; Richter, Jennifer; Schultes, Joachim

    2006-09-01

    The innermost part of the ATLAS experiment at the LHC, CERN, will be a pixel detector, which is presently under construction. The command messages and the readout data of the detector are transmitted over an optical data path. The readout chain consists of many components which are produced at several locations around the world, and must work together in the pixel detector. To verify that these parts are working together as expected a system test has been built up. It consists of detector modules, optoboards, optical fibres, Back of Crate cards, Readout Drivers, and control computers. In this paper, the system test setup and the operation of the readout chain are described. Also, some results of tests using the final pixel detector readout chain are given.

  20. ASICs in nanometer and 3D technologies for readout of hybrid pixel detectors

    NASA Astrophysics Data System (ADS)

    Maj, Piotr; Grybos, Pawel; Kmon, Piotr; Szczygiel, Robert

    2013-07-01

    Hybrid pixel detectors working in a single photon counting mode are very attractive solutions for material science and medical X-ray imaging applications. Readout electronics of these detectors has to match the geometry of pixel detectors with an area of readout channel of 100 μm × 100 μm (or even less) and very small power consumption (a few tens of μW). New solutions of readout ASICs are going into directions of better spatial resolutions, higher data throughput and more advanced functionality. We report on the design and measurement results of two pixel prototype ASICs in nanometer technology and 3D technology which offer fast signal processing, low noise performance and advanced functionality per single readout pixel cell.

  1. A near-infrared 64-pixel superconducting nanowire single photon detector array with integrated multiplexed readout

    SciTech Connect

    Allman, M. S. Verma, V. B.; Stevens, M.; Gerrits, T.; Horansky, R. D.; Lita, A. E.; Mirin, R.; Nam, S. W.; Marsili, F.; Beyer, A.; Shaw, M. D.; Kumor, D.

    2015-05-11

    We demonstrate a 64-pixel free-space-coupled array of superconducting nanowire single photon detectors optimized for high detection efficiency in the near-infrared range. An integrated, readily scalable, multiplexed readout scheme is employed to reduce the number of readout lines to 16. The cryogenic, optical, and electronic packaging to read out the array as well as characterization measurements are discussed.

  2. A 2D 4×4 Channel Readout ASIC for Pixelated CdTe Detectors for Medical Imaging Applications

    PubMed Central

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Martínez, Ricardo; Puigdengoles, Carles

    2015-01-01

    We present a 16-channel readout integrated circuit (ROIC) with nanosecond-resolution time to digital converter (TDC) for pixelated Cadmium Telluride (CdTe) gamma-ray detectors. The 4 × 4 pixel array ROIC is the proof of concept of the 10 × 10 pixel array readout ASIC for positron-emission tomography (PET) scanner, positron-emission mammography (PEM) scanner, and Compton gamma camera. The electronics of each individual pixel integrates an analog front-end with switchable gain, an analog to digital converter (ADC), configuration registers, and a 4-state digital controller. For every detected photon, the pixel electronics provides the energy deposited in the detector with 10-bit resolution, and a fast trigger signal for time stamp. The ASIC contains the 16-pixel matrix electronics, a digital controller, five global voltage references, a TDC, a temperature sensor, and a band-gap based current reference. The ASIC has been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and occupies an area of 5.3 mm × 6.8 mm. The TDC shows a resolution of 95.5 ps, a precision of 600 ps at full width half maximum (FWHM), and a power consumption of 130 μW. In acquisition mode, the total power consumption of every pixel is 200 μW. An equivalent noise charge (ENC) of 160 e−RMS at maximum gain and negative polarity conditions has been measured at room temperature. PMID:26744545

  3. XPAD3-S: A fast hybrid pixel readout chip for X-ray synchrotron facilities

    NASA Astrophysics Data System (ADS)

    Pangaud, Patrick; Basolo, Stephanie; Boudet, Nathalie; Berar, Jean-François; Chantepie, Benoît; Clemens, Jean-Claude; Delpierre, Pierre; Dinkespiler, Bernard; Medjoubi, Kadda; Hustache, Stephanie; Menouni, Mohsine; Morel, Christian

    2008-06-01

    At X-ray synchrotron facilities, scattering experiments require detectors with a large sensitive surface, an high count rate capability, a large counter dynamics, a fast readout system and an adjustable energy threshold. X-ray pixel chip with adaptable dynamics (XPAD3) is a new pixellized photon detector based on hybrid pixel technology, which provides low noise data readout at high speed. It is designed in 0.25 μm IBM technology and contains 9600 pixels (130 μm×130 μm) distributed into 80 columns of 120 elements each. Its features have been optimized to fulfill a count rate capability up to 10 +6 photons/pixel/s, an high dynamic range over 35 keV, a very low noise of 130e -, and a threshold adjustment well below 4 keV. Fast data readout below 2 ms/frame is expected. To meet these requirements, an innovative architecture has been designed that makes possible the readout the circuit during acquisition while preserving the precise setting of the thresholds all over the pixel array. The XPAD3 circuit can be bump-bonded with Si, CdTe, or GaAs sensors to optimize its detection efficiency at high X-ray energies. XPAD3 detector modules will be tiled together to form the XPIX detector with a 8 cm×12 cm sensitive area. We present first results obtained using a single-chip prototype of the XPAD3 detector.

  4. Radiation Tolerance Studies of BTeV Pixel Readout Chip Prototypes

    SciTech Connect

    Gabriele Chiodini et al.

    2001-09-11

    We report on several irradiation studies performed on BTeV preFPIX2 pixel readout chip prototypes exposed to a 200 MeV proton beam at the Indiana University Cyclotron Facility. The preFPIX2 pixel readout chip has been implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The tests confirmed the radiation tolerance of the chip design to proton total dose of 26 MRad. In addition, non destructive radiation-induced single event upsets have been observed in on-chip static registers and the single bit upset cross section has been measured.

  5. 18k Channels single photon counting readout circuit for hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Maj, P.; Grybos, P.; Szczygiel, R.; Zoladz, M.; Sakumura, T.; Tsuji, Y.

    2013-01-01

    We have performed measurements of an integrated circuit named PXD18k designed for hybrid pixel semiconductor detectors used in X-ray imaging applications. The PXD18k integrated circuit, fabricated in CMOS 180 nm technology, has dimensions of 9.64 mm×20 mm and contains approximately 26 million transistors. The core of the IC is a matrix of 96×192 pixels with 100 μm×100 μm pixel size. Each pixel works in a single photon counting mode. A single pixel contains two charge sensitive amplifiers with Krummenacher feedback scheme, two shapers, two discriminators (with independent thresholds A and B) and two 16-bit ripple counters. The data are read out via eight low voltage differential signaling (LVDS) outputs with 100 Mbps rate. The power consumption is dominated by analog blocks and it is about 23 μW/pixel. The effective peaking time at the discriminator input is 30 ns and is mainly determined by the time constants of the charge sensitive amplifier (CSA). The gain is equal to 42.5 μV/e- and the equivalent noise charge is 168 e- rms (with bump-bonded silicon pixel detector). Thanks to the use of trim DACs in each pixel, the effective threshold spread at the discriminator input is only 1.79 mV. The dead time of the front end electronics for a standard setting is 172 ns (paralyzable model). In the standard readout mode (when the data collection time is separated from the time necessary to readout data from the chip) the PXD18k IC works with two energy thresholds per pixel. The PXD18k can also be operated in the continuous readout mode (with a zero dead time) where one can select the number of bits readout from each pixel to optimize the PXD18k frame rate. For example, for reading out 16 bits/pixel the frame rate is 2.7 kHz and for 4 bits/pixel it rises to 7.1 kHz.

  6. An induced charge readout scheme incorporating image charge splitting on discrete pixels

    NASA Astrophysics Data System (ADS)

    Kataria, D. O.; Lapington, J. S.

    2003-11-01

    Top hat electrostatic analysers used in space plasma instruments typically use microchannel plates (MCPs) followed by discrete pixel anode readout for the angular definition of the incoming particles. Better angular definition requires more pixels/readout electronics channels but with stringent mass and power budgets common in space applications, the number of channels is restricted. We describe here a technique that improves the angular definition using induced charge and an interleaved anode pattern. The technique adopts the readout philosophy used on the CRRES and CLUSTER I instruments but has the advantages of the induced charge scheme and significantly reduced capacitance. Charge from the MCP collected by an anode pixel is inductively split onto discrete pixels whose geometry can be tailored to suit the scientific requirements of the instrument. For our application, the charge is induced over two pixels. One of them is used for a coarse angular definition but is read out by a single channel of electronics, allowing a higher rate handling. The other provides a finer angular definition but is interleaved and hence carries the expense of lower rate handling. Using the technique and adding four channels of electronics, a four-fold increase in the angular resolution is obtained. Details of the scheme and performance results are presented.

  7. Fast readout architectures for large arrays of digital pixels: examples and applications.

    PubMed

    Gabrielli, A

    2014-01-01

    Modern pixel detectors, particularly those designed and constructed for applications and experiments for high-energy physics, are commonly built implementing general readout architectures, not specifically optimized in terms of speed. High-energy physics experiments use bidimensional matrices of sensitive elements located on a silicon die. Sensors are read out via other integrated circuits bump bonded over the sensor dies. The speed of the readout electronics can significantly increase the overall performance of the system, and so here novel forms of readout architectures are studied and described. These circuits have been investigated in terms of speed and are particularly suited for large monolithic, low-pitch pixel detectors. The idea is to have a small simple structure that may be expanded to fit large matrices without affecting the layout complexity of the chip, while maintaining a reasonably high readout speed. The solutions might be applied to devices for applications not only in physics but also to general-purpose pixel detectors whenever online fast data sparsification is required. The paper presents also simulations on the efficiencies of the systems as proof of concept for the proposed ideas.

  8. Fast Readout Architectures for Large Arrays of Digital Pixels: Examples and Applications

    PubMed Central

    Gabrielli, A.

    2014-01-01

    Modern pixel detectors, particularly those designed and constructed for applications and experiments for high-energy physics, are commonly built implementing general readout architectures, not specifically optimized in terms of speed. High-energy physics experiments use bidimensional matrices of sensitive elements located on a silicon die. Sensors are read out via other integrated circuits bump bonded over the sensor dies. The speed of the readout electronics can significantly increase the overall performance of the system, and so here novel forms of readout architectures are studied and described. These circuits have been investigated in terms of speed and are particularly suited for large monolithic, low-pitch pixel detectors. The idea is to have a small simple structure that may be expanded to fit large matrices without affecting the layout complexity of the chip, while maintaining a reasonably high readout speed. The solutions might be applied to devices for applications not only in physics but also to general-purpose pixel detectors whenever online fast data sparsification is required. The paper presents also simulations on the efficiencies of the systems as proof of concept for the proposed ideas. PMID:24778588

  9. Test beam campaigns for the CMS Phase I Upgrade pixel readout chip

    NASA Astrophysics Data System (ADS)

    Spannagel, S.; CMS Collaboration

    2014-12-01

    The current CMS silicon pixel detector as the innermost component of the CMS experiment is performing well at LHC design luminosity, but would be subject to severe inefficiencies at LHC peak luminosities of 2 × 1034 cm-2 s-1. Therefore, an upgrade of the CMS pixel detector is planned, including a new readout chip. The chip design comprises additional on-chip buffer cells as well as high-speed data links and low-threshold comparators in the pixel cells. With these changes the upgraded pixel detector will be able to maintain or even improve the efficiency of the current detector at the increased requirements imposed by high luminosities and pile-up. The effects of these design changes on e.g. position resolution and charge collection efficiency were studied in detail using a precision tracking telescope at the DESY test beam facilities. The high telescope track resolution enables precise studies of tracking efficiency, charge sharing and collection even within single pixel cells of the device under test. This publication focuses on the improved performance and capabilities of the new pixel readout chip and summarizes results from test beam campaigns with both unirradiated and irradiated devices. The functionality of the chip design with its improved charge threshold, redesigned data transmission and buffering scheme has been verified.

  10. FDM Readout Assembly with Flexible, Superconducting Connection to Cryogenic kilo-Pixel TES Detectors

    NASA Astrophysics Data System (ADS)

    Bruijn, M. P.; van der Linden, A. J.; Ridder, M. L.; van Weers, H. J.

    2016-07-01

    We describe a new fabrication process for a superconducting, flexible, and demountable connector to a kilo-pixel transition edge sensor. The demountable part contains planar coils for inductive coupling, in particular suited for AC-biased frequency domain multiplexed readout. A fixed connection to a chip with superconducting LC filters and SQUID readout is made by gold bump bonding with a connection resistance of 1.1 {× } 10^{-4} Ω . The Nb-based connecting lines on the flexible part show a superconducting transition around 7 K, which enables testing of connectors and LC filters in a simple L-He setup.

  11. A digital readout system for the CMS Phase I Pixel Upgrade

    NASA Astrophysics Data System (ADS)

    Stringer, R.

    2015-04-01

    The Phase I Upgrade to the CMS Pixel Detector at the LHC features a new 400 Mb/s digital readout system. This new system utilizes upgraded custom ASICs, PSI46digv2.1 Read Out Chips and Token Bit Manager for data packaging, new optical links and changes to the Front End Drivers. We are reporting on the new architecture of the full readout chain, the new schema for data encoding/transmission, and the results of preliminary testing of the new optical components.

  12. Characterization of M-π-n CdTe pixel detectors coupled to HEXITEC readout chip

    NASA Astrophysics Data System (ADS)

    Veale, M. C.; Kalliopuska, J.; Pohjonen, H.; Andersson, H.; Nenonen, S.; Seller, P.; Wilson, M. D.

    2012-01-01

    Segmentation of the anode-side of an M-π-n CdTe diode, where the pn-junction is diffused into the detector bulk, produces large improvements in the spatial and energy resolution of CdTe pixel detectors. It has been shown that this fabrication technique produces very high inter-pixel resistance and low leakage currents are obtained by physical isolation of the pixels of M-π-n CdTe detectors. In this paper the results from M-π-n CdTe detectors stud bonded to a spectroscopic readout ASIC are reported. The CdTe pixel detectors have 250 μm pitch and an area of 5 × 5 mm2 with thicknesses of 1 and 2 mm. The polarization and energy resolution dependence of the M-π-n CdTe detectors as a function of detector thickness are discussed.

  13. The FE-I4 Pixel Readout Chip and the IBL Module

    SciTech Connect

    Barbero, Marlon; Arutinov, David; Backhaus, Malte; Fang, Xiao-Chao; Gonella, Laura; Hemperek, Tomasz; Karagounis, Michael; Hans, Kruger; Kruth, Andre; Wermes, Norbert; Breugnon, Patrick; Fougeron, Denis; Gensolen, Fabrice; Menouni, Mohsine; Rozanov, Alexander; Beccherle, Roberto; Darbo, Giovanni; Caminada, Lea; Dube, Sourabh; Fleury, Julien; Gnani, Dario; /LBL, Berkeley /NIKHEF, Amsterdam /Gottingen U. /SLAC

    2012-05-01

    FE-I4 is the new ATLAS pixel readout chip for the upgraded ATLAS pixel detector. Designed in a CMOS 130 nm feature size process, the IC is able to withstand higher radiation levels compared to the present generation of ATLAS pixel Front-End FE-I3, and can also cope with higher hit rate. It is thus suitable for intermediate radii pixel detector layers in the High Luminosity LHC environment, but also for the inserted layer at 3.3 cm known as the 'Insertable B-Layer' project (IBL), at a shorter timescale. In this paper, an introduction to the FE-I4 will be given, focusing on test results from the first full size FE-I4A prototype which has been available since fall 2010. The IBL project will be introduced, with particular emphasis on the FE-I4-based module concept.

  14. Development of readout system for FE-I4 pixel module using SiTCP

    NASA Astrophysics Data System (ADS)

    Teoh, J. J.; Hanagaki, K.; Ikegami, Y.; Takubo, Y.; Terada, S.; Unno, Y.

    2013-12-01

    The ATLAS pixel detector will be replaced in the future High Luminosity-Large Hadron Collider (HL-LHC) upgrade to preserve or improve the detector performance at high luminosity environment. To meet the tight requirements of the upgrade, a new pixel Front-End (FE) Integrated Circuit (IC) called FE-I4 has been developed. We have then devised a readout system for the new FE IC. Our system incorporates Silicon Transmission Control Protocol (SiTCP) technology (Uchida, 2008 [1]) which utilizes the standard TCP/IP and UDP communication protocols. This technology allows direct data access and transfer between a readout hardware chain and PC via a high speed Ethernet. In addition, the communication protocols are small enough to be implemented in a single Field-Programable Gate Array (FPGA). Relying on this technology, we have been able to construct a very compact, versatile and fast readout system. We have developed a firmware and software together with the readout hardware chain. We also have established basic functionalities for reading out FE-I4.

  15. Radiation tolerance of prototype BTeV pixel detector readout chips

    SciTech Connect

    Gabriele Chiodini et al.

    2002-07-12

    High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is the state of the art technology able to meet these challenges. We report on irradiation studies performed on BTeV pixel readout chip prototypes exposed to a 200 MeV proton beam at Indiana University Cyclotron Facility. Prototype pixel readout chip preFPIX2 has been developed at Fermilab for collider experiments and implemented in standard 0.25 micron CMOS technology following radiation tolerant design rules. The tests confirmed the radiation tolerance of the chip design to proton total dose up to 87 MRad. In addition, non destructive radiation-induced single event upsets have been observed in on-chip static registers and the single bit upset cross section has been extensively measured.

  16. The TDCpix readout ASIC: A 75 ps resolution timing front-end for the NA62 Gigatracker hybrid pixel detector

    NASA Astrophysics Data System (ADS)

    Kluge, A.; Aglieri Rinella, G.; Bonacini, S.; Jarron, P.; Kaplon, J.; Morel, M.; Noy, M.; Perktold, L.; Poltorak, K.

    2013-12-01

    The TDCpix is a novel pixel readout ASIC for the NA62 Gigatracker detector. NA62 is a new experiment being installed at the CERN Super Proton Synchrotron. Its Gigatracker detector shall provide on-beam tracking and time stamping of individual particles with a time resolution of 150 ps rms. It will consist of three tracking stations, each with one hybrid pixel sensor. The peak flow of particles crossing the detector modules reaches 1.27 MHz/mm2 for a total rate of about 0.75 GHz. Ten TDCpix chips will be bump-bonded to every silicon pixel sensor. Each chip shall perform time stamping of 100 M particle hits per second with a detection efficiency above 99% and a timing accuracy better than 200 ps rms for an overall three-station-setup time resolution of better than 150 ps. The TDCpix chip has been designed in a 130 nm CMOS technology. It will feature 45×40 square pixels of 300×300 μm2 and a complex End of Column peripheral region including an array of TDCs based on DLLs, four high speed serializers, a low-jitter PLL, readout and control circuits. This contribution will describe the complete design of the final TDCpix ASIC. It will discuss design choices, the challenges faced and some of the lessons learned. Furthermore, experimental results from the testing of circuit prototypes will be presented. These demonstrate the achievement of key performance figures such as a time resolution of the processing chain of 75 ps rms with a laser sent to the center of the pixel and the capability of time stamping charged particles with an overall resolution below 200 ps rms.

  17. Fast Imaging Detector Readout Circuits with In-Pixel ADCs for Fourier Transform Imaging Spectrometers

    NASA Technical Reports Server (NTRS)

    Rider, D.; Blavier, J-F.; Cunningham, T.; Hancock, B.; Key, R.; Pannell, Z.; Sander, S.; Seshadri, S.; Sun, C.; Wrigley, C.

    2011-01-01

    Focal plane arrays (FPAs) with high frame rates and many pixels benefit several upcoming Earth science missions including GEO-CAPE, GACM, and ACE by enabling broader spatial coverage and higher spectral resolution. FPAs for the PanFTS, a high spatial resolution Fourier transform spectrometer and a candidate instrument for the GEO-CAPE mission are the focus of the developments reported here, but this FPA technology has the potential to enable a variety of future measurements and instruments. The ESTO ACT Program funded the developed of a fast readout integrated circuit (ROIC) based on an innovative in-pixel analog-to-digital converter (ADC). The 128 X 128 pixel ROIC features 60 ?m pixels, a 14-bit ADC in each pixel and operates at a continuous frame rate of 14 kHz consuming only 1.1 W of power. The ROIC outputs digitized data completely eliminating the bulky, power consuming signal chains needed by conventional FPAs. The 128 X 128 pixel ROIC has been fabricated in CMOS and tested at the Jet Propulsion Laboratory. The current version is designed to be hybridized with PIN photodiode arrays via indium bump bonding for light detection in the visible and ultraviolet spectral regions. However, the ROIC design incorporates a small photodiode in each cell to permit detailed characterization of the ROICperformance without the need for hybridization. We will describe the essential features of the ROIC design and present results of ROIC performance measurements.

  18. Review of hybrid pixel detector readout ASICs for spectroscopic X-ray imaging

    NASA Astrophysics Data System (ADS)

    Ballabriga, R.; Alozy, J.; Campbell, M.; Frojdh, E.; Heijne, E. H. M.; Koenig, T.; Llopart, X.; Marchal, J.; Pennicard, D.; Poikela, T.; Tlustos, L.; Valerio, P.; Wong, W.; Zuber, M.

    2016-01-01

    Semiconductor detector readout chips with pulse processing electronics have made possible spectroscopic X-ray imaging, bringing an improvement in the overall image quality and, in the case of medical imaging, a reduction in the X-ray dose delivered to the patient. In this contribution we review the state of the art in semiconductor-detector readout ASICs for spectroscopic X-ray imaging with emphasis on hybrid pixel detector technology. We discuss how some of the key challenges of the technology (such as dealing with high fluxes, maintaining spectral fidelity, power consumption density) are addressed by the various ASICs. In order to understand the fundamental limits of the technology, the physics of the interaction of radiation with the semiconductor detector and the process of signal induction in the input electrodes of the readout circuit are described. Simulations of the process of signal induction are presented that reveal the importance of making use of the small pixel effect to minimize the impact of the slow motion of holes and hole trapping in the induced signal in high-Z sensor materials. This can contribute to preserve fidelity in the measured spectrum with relatively short values of the shaper peaking time. Simulations also show, on the other hand, the distortion in the energy spectrum due to charge sharing and fluorescence photons when the pixel pitch is decreased. However, using recent measurements from the Medipix3 ASIC, we demonstrate that the spectroscopic information contained in the incoming photon beam can be recovered by the implementation in hardware of an algorithm whereby the signal from a single photon is reconstructed and allocated to the pixel with the largest deposition.

  19. An interpolating 2D pixel readout structure for synchrotron X-ray diffraction in protein crystallography

    NASA Astrophysics Data System (ADS)

    Besch, H. J.; Junk, M.; Meißner, W.; Sarvestani, A.; Stiehler, R.; Walenta, A. H.

    1997-02-01

    The high rates available now at synchrotron beam lines ask for detectors allowing online measurements with good spatial resolution and a precise intensity measurement. For this purpose gaseous detectors operating in the single photon counting mode are well suited. An interpolating 2D pixel readout structure will be presented. It has been tested as backplane of a MSGC or a CAT-detector (recently developed by the group of M. Lemonnier at LURE), and it operates on the principle of resistive charge partition, allowing asynchronous readout. A resolution of 200 μm is reached. Under similar conditions the energy resolution from the signals of the readout structure presented is nearly the same as that of standard readout. In combination with a CAT an energy resolution of 20% is reached. A prototype of 64 channels with a sensitive area of 14 mm × 14 mm was tested at the synchrotron at LURE (Orsay). Diffraction patterns from a collagenase protein crystal were measured and rocking curves were obtained with an angular resolution of 1.5 × 10 -5.

  20. Prototype AEGIS: A Pixel-Array Readout Circuit for Gamma-Ray Imaging

    PubMed Central

    Barber, H. Bradford; Augustine, F. L.; Furenlid, L.; Ingram, C. M.; Grim, G. P.

    2015-01-01

    Semiconductor detector arrays made of CdTe/CdZnTe are expected to be the main components of future high-performance, clinical nuclear medicine imaging systems. Such systems will require small pixel-pitch and much larger numbers of pixels than are available in current semiconductor-detector cameras. We describe the motivation for developing a new readout integrated circuit, AEGIS, for use in hybrid semiconductor detector arrays, that may help spur the development of future cameras. A basic design for AEGIS is presented together with results of an HSPICE™ simulation of the performance of its unit cell. AEGIS will have a shaper-amplifier unit cell and neighbor pixel readout. Other features include the use of a single input power line with other biases generated on-board, a control register that allows digital control of all thresholds and chip configurations and an output approach that is compatible with list-mode data acquisition. An 8×8 prototype version of AEGIS is currently under development; the full AEGIS will be a 64×64 array with 300 μm pitch. PMID:26345126

  1. Characterization of edgeless pixel detectors coupled to Medipix2 readout chip

    NASA Astrophysics Data System (ADS)

    Kalliopuska, Juha; Tlustos, Lukas; Eränen, Simo; Virolainen, Tuula

    2011-08-01

    VTT has developed a straightforward and fast process to fabricate four-side buttable (edgeless) microstrip and pixel detectors on 6 in. (150 mm) wafers. The process relies on advanced ion implantation to activate the edges of the detector instead of using polysilicon. The article characterizes 150 μm thick n-on-n edgeless pixel detector prototypes with a dead layer at the edge below 1 μm. Electrical and radiation response characterization of 1.4×1.4 cm2 n-on-n edgeless detectors has been done by coupling them to the Medipix2 readout chips. The distance of the detector's physical edge from the pixels was either 20 or 50 μm. The leakage current of flip-chip bonded edgeless Medipix2 detector assembles were measured to be ˜90 nA/cm2 and no breakdown was observed below 110 V. Radiation response characterization includes X-ray tube and radiation source responses. The characterization results show that the detector's response at the pixels close to the physical edge of the detector depend dramatically on the pixel-to-edge distance.

  2. Cryogenic measurements of a digital pixel readout integrated circuit for LWIR

    NASA Astrophysics Data System (ADS)

    Shafique, Atia; Yazici, Melik; Kayahan, Huseyin; Ceylan, Omer; Gurbuz, Yasar

    2015-06-01

    This paper presents and discusses the cryogenic temperature (77K) measurement results of a digital readout integrated circuit (DROIC) for a 32x32 long wavelength infrared pixel sensor array designed in 90nm CMOS process. The chip achieves a signal-to-noise ratio (SNR) of 58dB with a charge handling capacity of 2.03Ge- at cryogenic temperature with 1.3mW of power dissipation. The performance of the readout is discussed in terms of power dissipation, charge handling capacity and SNR considering the fact that the process library models are not optimized for cryogenic temperature operation of the Metal-Oxide-Semiconductor (MOS) devices. These results provide an insight to foresee the design confrontations due to non-optimized device models for cryogenic temperatures particularly for short channel devices

  3. A 15 × 15 single photon avalanche diode sensor featuring breakdown pixels extraction architecture for efficient data readout

    NASA Astrophysics Data System (ADS)

    Yang, Xiao; Zhu, Hongbo; Nakura, Toru; Iizuka, Tetsuya; Asada, Kunihiro

    2016-04-01

    This paper proposes a breakdown pixels extraction architecture for single photon avalanche diode (SPAD) based faint light detection systems. The proposed extraction circuit detects the breakdown pixels and only their addresses are readout. Therefore, under the faint light environment, this SPAD-based sensor significantly improves the data readout efficiency. In addition, since the readout sequence is 4× faster than that of the conventional architecture in the dark condition, the proposed system does not need an independent on-chip event detection circuit that consumes additional area and power. A test-of-concept chip with a 15 × 15 SPAD pixels array was fabricated in a 0.18 µm 1P5M standard CMOS process and pinhole diffraction patterns were successfully captured thanks to the high sensitivity of the SPAD sensor. Under the faint light condition, a high-speed readout is verified by measurement and the robustness of the proposed architecture is successfully demonstrated.

  4. Development of a readout technique for the high data rate BTeV pixel detector at Fermilab

    SciTech Connect

    Bradley K Hall et al.

    2001-11-05

    The pixel detector for the BTeV experiment at Fermilab provides digitized data from approximately 22 million silicon pixel channels. Portions of the detector are six millimeters from the beam providing a substantial hit rate and high radiation dose. The pixel detector data will be employed by the lowest level trigger system for track reconstruction every beam crossing. These requirements impose a considerable constraint on the readout scheme. This paper presents a readout technique that provides the bandwidth that is adequate for high hit rates, minimizes the number of radiation hard components, and satisfies all other design constraints.

  5. FPIX2: A radiation-hard pixel readout chip for BTeV

    SciTech Connect

    David C. Christian et al.

    2000-12-11

    A radiation-hard pixel readout chip, FPIX2, is being developed at Fermilab for the recently approved BTeV experiment. Although designed for BTeV, this chip should also be appropriate for use by CDF and DZero. A short review of this development effort is presented. Particular attention is given to the circuit redesign which was made necessary by the decision to implement FPIX2 using a standard deep-submicron CMOS process rather than an explicitly radiation-hard CMOS technology, as originally planned. The results of initial tests of prototype 0.25{micro} CMOS devices are presented, as are plans for the balance of the development effort.

  6. The cryogenic readout system with GaAs JFETs for multi-pixel cameras

    NASA Astrophysics Data System (ADS)

    Hibi, Y.; Matsuo, H.; Nagata, H.; Ikeda, H.; Fujiwara, M.

    2010-11-01

    Our purpose is to realize a multi-pixel sub-millimeter/terahertz camera with the superconductor - insulator - superconductor photon detectors. These detectors must be cooled below 1 K. Since these detectors have high impedance, signal amplifiers of each pixel must be setting aside of them for precise signal readout. Therefore, it is desirable that the readout system work well even in cryogenic temperature. We selected the n-type GaAs JFETs as cryogenic circuit elements. From our previous studies, the n-type GaAs JFETs have good cryogenic properties even when those power dissipations are low. We have designed several kinds of integration circuits (ICs) and demonstrated their performance at cryogenic temperature. Contents of ICs are following; AC coupled trans-impedance amplifiers, voltage distributors for suppressing input offset voltage of AC coupled CTIAs, multiplexers with sample-and holds, and shift-registers for controlling multiplex timing. The power dissipation of each circuit is 0.5 to 3 micro watts per channel. We also have designed and manufactured 32-channel multi-chip-modules with these ICs. These modules can make 32- channel input photo current signals into one or two serial output voltage signal(s). Size of these is 40mm x 30mm x 2mm and estimated total power dissipation is around 400 micro watts.

  7. AC Read-Out Circuits for Single Pixel Characterization of TES Microcalorimeters and Bolometers

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; van de Kuur, J.; Bandler, S.; Bruijn, M.; de Korte, P.; Gao, J. R.; den Hartog, R.; Hijmering, R. A.; Hoevers, H.; Koshropanah, P.; Kilbourne, C.; Lindemann, M. A.; Parra Borderias, M.; Ridder, M.

    2011-01-01

    SRON is developing Frequency Domain Multiplexing (FDM) for the read-out of transition edge sensor (TES) soft x-ray microcalorimeters for the XMS instrument of the International X-ray Observatory and far-infrared bolometers for the SAFARI instrument on the Japanese mission SPICA. In FDM the TESs are AC voltage biased at frequencies from 0.5 to 6 MHz in a superconducting LC resonant circuit and the signal is read-out by low noise and high dynamic range SQUIDs amplifiers. The TES works as an amplitude modulator. We report on several AC bias experiments performed on different detectors. In particular, we discuss the results on the characterization of Goddard Space Flight Center x-ray pixels and SRON bolometers. The paper focuses on the analysis of different read-out configurations developed to optimize the noise and the impedance matching between the detectors and the SQUID amplifier. A novel feedback network electronics has been developed to keep the SQUID in flux locked loop, when coupled to superconducting high Q circuits, and to optimally tune the resonant bias circuit. The achieved detector performances are discussed in view of the instrument requirement for the two space missions.

  8. A vertically integrated pixel readout device for the Vertex Detector at the International Linear Collider

    SciTech Connect

    Deptuch, Grzegorz; Christian, David; Hoff, James; Lipton, Ronald; Shenai, Alpana; Trimpl, Marcel; Yarema, Raymond; Zimmerman, Tom; /Fermilab

    2008-12-01

    3D-Integrated Circuit technology enables higher densities of electronic circuitry per unit area without the use of nanoscale processes. It is advantageous for mixed mode design with precise analog circuitry because processes with conservative feature sizes typically present lower process dispersions and tolerate higher power supply voltages, resulting in larger separation of a signal from the noise floor. Heterogeneous wafers (different foundries or different process families) may be combined with some 3D integration methods, leading to the optimization of each tier in the 3D stack. Tracking and vertexing in future High-Energy Physics (HEP) experiments involves construction of detectors composed of up to a few billions of channels. Readout electronics must record the position and time of each measurement with the highest achievable precision. This paper reviews a prototype of the first 3D readout chip for HEP, designed for a vertex detector at the International Linear Collider. The prototype features 20 x 20 {micro}m{sup 2} pixels, laid out in an array of 64 x 64 elements and was fabricated in a 3-tier 0.18 {micro}m Fully Depleted SOI CMOS process at MIT-Lincoln Laboratory. The tests showed correct functional operation of the structure. The chip performs a zero-suppressed readout. Successive submissions are planned in a commercial 3D bulk 0.13 {micro}m CMOS process to overcome some of the disadvantages of an FDSOI process.

  9. Design of the low area monotonic trim DAC in 40 nm CMOS technology for pixel readout chips

    NASA Astrophysics Data System (ADS)

    Drozd, A.; Szczygiel, R.; Maj, P.; Satlawa, T.; Grybos, P.

    2014-12-01

    The recent research in hybrid pixel detectors working in single photon counting mode focuses on nanometer or 3D technologies which allow making pixels smaller and implementing more complex solutions in each of the pixels. Usually single pixel in readout electronics for X-ray detection comprises of charge amplifier, shaper and discriminator that allow classification of events occurring at the detector as true or false hits by comparing amplitude of the signal obtained with threshold voltage, which minimizes the influence of noise effects. However, making the pixel size smaller often causes problems with pixel to pixel uniformity and additional effects like charge sharing become more visible. To improve channel-to-channel uniformity or implement an algorithm for charge sharing effect minimization, small area trimming DACs working in each pixel independently are necessary. However, meeting the requirement of small area often results in poor linearity and even non-monotonicity. In this paper we present a novel low-area thermometer coded 6-bit DAC implemented in 40 nm CMOS technology. Monte Carlo simulations were performed on the described design proving that under all conditions designed DAC is inherently monotonic. Presented DAC was implemented in the prototype readout chip with 432 pixels working in single photon counting mode, with two trimming DACs in each pixel. Each DAC occupies the area of 8 μm × 18.5 μm. Measurements and chips' tests were performed to obtain reliable statistical results.

  10. Method of acquiring an image from an optical structure having pixels with dedicated readout circuits

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2006-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  11. A parallel plate chamber with pixel read-out for very high data rate

    SciTech Connect

    Angelini, F.; Bellazzini, R.; Brez, A.; Massai, M.; Torquati, M.R.

    1989-02-01

    The authors report the preliminary test results on the performance of a device specially designed for the imaging of X rays at a very high data rate. A prototype having 256 read-out channels has been built and tested in our lab. The detector is a two step parallel plate chamber. The anode is made up of a chess-board of pads, onto which a thin germanium layer is evaporated to restore the electrical continuity. Each individual pad can be read out independently on the back of the board.

  12. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    NASA Technical Reports Server (NTRS)

    Kimble, Randy A.; Pain, B.; Norton, T. J.; Haas, P.; Fisher, Richard R. (Technical Monitor)

    2001-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution for the readout while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest or by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  13. Low-power priority Address-Encoder and Reset-Decoder data-driven readout for Monolithic Active Pixel Sensors for tracker system

    NASA Astrophysics Data System (ADS)

    Yang, P.; Aglieri, G.; Cavicchioli, C.; Chalmet, P. L.; Chanlek, N.; Collu, A.; Gao, C.; Hillemanns, H.; Junique, A.; Kofarago, M.; Keil, M.; Kugathasan, T.; Kim, D.; Kim, J.; Lattuca, A.; Marin Tobon, C. A.; Marras, D.; Mager, M.; Martinengo, P.; Mazza, G.; Mugnier, H.; Musa, L.; Puggioni, C.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Siddhanta, S.; Usai, G.; van Hoorne, J. W.; Yi, J.

    2015-06-01

    Active Pixel Sensors used in High Energy Particle Physics require low power consumption to reduce the detector material budget, low integration time to reduce the possibilities of pile-up and fast readout to improve the detector data capability. To satisfy these requirements, a novel Address-Encoder and Reset-Decoder (AERD) asynchronous circuit for a fast readout of a pixel matrix has been developed. The AERD data-driven readout architecture operates the address encoding and reset decoding based on an arbitration tree, and allows us to readout only the hit pixels. Compared to the traditional readout structure of the rolling shutter scheme in Monolithic Active Pixel Sensors (MAPS), AERD can achieve a low readout time and a low power consumption especially for low hit occupancies. The readout is controlled at the chip periphery with a signal synchronous with the clock, allows a good digital and analogue signal separation in the matrix and a reduction of the power consumption. The AERD circuit has been implemented in the TowerJazz 180 nm CMOS Imaging Sensor (CIS) process with full complementary CMOS logic in the pixel. It works at 10 MHz with a matrix height of 15 mm. The energy consumed to read out one pixel is around 72 pJ. A scheme to boost the readout speed to 40 MHz is also discussed. The sensor chip equipped with AERD has been produced and characterised. Test results including electrical beam measurement are presented.

  14. First test results from a high-resolution CdZnTe pixel detector with VLSI readout

    NASA Astrophysics Data System (ADS)

    Cook, Walter R.; Boggs, Steven E.; Bolotnikov, Aleksey E.; Burnham, Jill A.; Harrison, Fiona A.; Kecman, Branislav; Matthews, Brian; Schindler, Steven M.; Fitzsimmons, Michael

    1999-10-01

    We are developing a CdZnTe pixel detector with a custom low- noise analog VLSI readout for use in the High-Energy Focusing Telescope balloon experiment, as well as for future space astronomy applications. The goal of the program is to achieve good energy resolution (< 1 keV FWHM at 60 keV) and low threshold in a sensor with approximately 500 micrometers pixels. We have fabricated several prototype detector assemblies with 2 mm thick, 680 by 650 micrometers pitch CdZnTe pixel sensors indium bump bonded a VLSI readout chip developed at Caltech. Each readout circuit in the 8 X 8 prototype is matched to the detector pixel size, and contains a preamplifier, shaping amplifiers, and a peak stretcher/discriminator. In the first 8 X 8 prototype, we have demonstrated the low-noise preamplifier by routing the output signals off-chip for shaping and pulse-height analysis. Pulse height spectra obtained using a 241Am source, collimated to illuminate a single pixel, show excellent energy resolution of 1.1 keV FWHM for the 60 keV line at room temperature. Line profiles are approximately Gaussian and dominated by electronic noise, however a small low energy tail is evident for the 60 keV line. We obtained slightly improved resolution of 0.9 keV FWHM at 60 keV by cooling the detector to 5 degree(s)C, near the expected balloon- flight operating temperature. Pulse height spectra obtained with the collimated source positioned between pixels show the effect of signal sharing for events occurring near the boundary. We are able to model the observed spectra using a Monte-Carlo simulation that includes the effects of photon interaction, charge transport and diffusion, pixel and collimator geometry, and electronic noise. By using the model to simulate the detector response to uncollimated radiation (including the effect of finite trigger threshold for reconstruction of the total energy of multi-pixel events), we find the energy resolution to be degraded by only 10% for full

  15. The detection of single electrons using a Micromegas gas amplification and a MediPix2 CMOS pixel readout

    NASA Astrophysics Data System (ADS)

    Fornaini, A.; Campbell, M.; Chefdeville, M.; Colas, P.; Colijn, A. P.; van der Graaf, H.; Giomataris, Y.; Heijne, E. H. M.; Kluit, P.; Llopart, X.; Schmitz, J.; Timmermans, J.; Visschers, J. L.

    2005-07-01

    By placing a Micromegas gas gain grid on top of a CMOS pixel readout circuit (MediPix2), we developed a device which acts as a pixel-segmented direct anode in gas-filled detectors. With a He/Isobutane 80/20 mixture (capable of achieving gas gain factors up to 20×103) and employing a drift length of 15 mm, signals from radioactive sources and cosmic radiation were measured. Single primary electrons originating from the passage of cosmic muons through the gas volume were detected with an efficiency higher than 90%.

  16. A High-Speed, Event-Driven, Active Pixel Sensor Readout for Photon-Counting Microchannel Plate Detectors

    NASA Technical Reports Server (NTRS)

    Kimble, Randy A.; Pain, Bedabrata; Norton, Timothy J.; Haas, J. Patrick; Oegerle, William R. (Technical Monitor)

    2002-01-01

    Silicon array readouts for microchannel plate intensifiers offer several attractive features. In this class of detector, the electron cloud output of the MCP intensifier is converted to visible light by a phosphor; that light is then fiber-optically coupled to the silicon array. In photon-counting mode, the resulting light splashes on the silicon array are recognized and centroided to fractional pixel accuracy by off-chip electronics. This process can result in very high (MCP-limited) spatial resolution while operating at a modest MCP gain (desirable for dynamic range and long term stability). The principal limitation of intensified CCD systems of this type is their severely limited local dynamic range, as accurate photon counting is achieved only if there are not overlapping event splashes within the frame time of the device. This problem can be ameliorated somewhat by processing events only in pre-selected windows of interest of by using an addressable charge injection device (CID) for the readout array. We are currently pursuing the development of an intriguing alternative readout concept based on using an event-driven CMOS Active Pixel Sensor. APS technology permits the incorporation of discriminator circuitry within each pixel. When coupled with suitable CMOS logic outside the array area, the discriminator circuitry can be used to trigger the readout of small sub-array windows only when and where an event splash has been detected, completely eliminating the local dynamic range problem, while achieving a high global count rate capability and maintaining high spatial resolution. We elaborate on this concept and present our progress toward implementing an event-driven APS readout.

  17. A new digital readout integrated circuit (DROIC) with pixel parallel A/D conversion with reduced quantization noise

    NASA Astrophysics Data System (ADS)

    Kayahan, Huseyin; Ceylan, Ömer; Yazici, Melik; Gurbuz, Yasar

    2014-06-01

    This paper presents a digital ROIC for staring type arrays with extending counting method to realize very low quantization noise while achieving a very high charge handling capacity. Current state of the art has shown that digital readouts with pulse frequency method can achieve charge handling capacities higher than 3Ge- with quantization noise higher than 1000e-. Even if the integration capacitance is reduced, it cannot be lower than 1-3 fF due to the parasitic capacitance of the comparator. For achieving a very low quantization noise of 161 electrons in a power efficient way, a new method based on measuring the time to measure the remaining charge on the integration capacitor is proposed. With this approach SNR of low flux pixels are significantly increased while large flux pixels can store electrons as high as 2.33Ge-. A prototype array of 32×32 pixels with 30μm pitch is implemented in 90nm CMOS process technology for verification. Measurement results are given for complete readout.

  18. A compact 64-pixel CsI(T1)/Si PIN photodiode imaging module with IC readout

    SciTech Connect

    Gruber, Gregory J.; Choong, Woon-Seng; Moses, William W.; Derenzo, Stephen E.; Holland, Stephen E.; Pedrali-Noy, Marzio; Krieger, Brad; Mandelli, Emanuele; Meddeler, Gerrit; Wang, Nadine W.

    2001-08-09

    We characterize the performance of a complete 64-pixel compact gamma camera imaging module consisting of optically isolated 3 mm 3 mm 5 mm CsI(Tl) crystals coupled to a custom array of low-noise Si PIN photodiodes read out by a custom IC. At 50 V bias the custom 64-pixel photodiode arrays demonstrate an average leakage current of 28 pA per 3 mm 3 mm pixel, a 98.5 percent yield of pixels with <100 pA leakage, and a quantum efficiency of about 80 percent for 540 nm CsI(Tl) scintillation photons. The custom 64-channel readout IC uses low-noise preamplifiers, shaper amplifiers, and a winner-take-all (WTA) multiplexer. The IC demonstrates maximum gain of 120 mV / 1000 e-, the ability to select the largest input signal in less than 150 ns, and low electronic noise at 8 ms peaking time ranging from 25 e- rms (unloaded) to an estimated 180 e- rms (photodiode load of 3 pF, 50 pA). At room temperature a complete 64-pixel detector module employing a custom photodiode array and readout IC demonstrates an average energy resolution of 23.4 percent fwhm and an intrinsic spatial resolution of 3.3 mm fwhm for the 140 keV emissions of 99mTc. Construction of an array of such imaging modules is straightforward, hence this technology shows strong potential for numerous compact gamma camera applications, including scintimammography.

  19. The ToPiX v4 prototype for the triggerless readout of the PANDA silicon pixel detector

    NASA Astrophysics Data System (ADS)

    Mazza, G.; Calvo, D.; De Remigis, P.; Mignone, M.; Olave, J.; Rivetti, A.; Wheadon, R.; Zotti, L.

    2015-01-01

    ToPiX v4 is the prototype for the readout of the silicon pixel sensors for the Micro Vertex Detector of the PANDA experiment. ToPiX provides position, time and energy measurement of the incoming particles and is designed for the triggerless environment foreseen in PANDA. The prototype includes 640 pixels with a size of 100 × 100 μm2, a 160 MHz time stamp distribution circuit to measure both particle arrival time and released energy (via ToT technique) and the full control logic. The ASIC is designed in a 0.13 μm CMOS technology with SEU protection techniques for the digital parts.

  20. Development of a radiation-hardened SRAM with EDAC algorithm for fast readout CMOS pixel sensors for charged particle tracking

    NASA Astrophysics Data System (ADS)

    Wei, X.; Li, B.; Chen, N.; Wang, J.; Zheng, R.; Gao, W.; Wei, T.; Gao, D.; Hu, Y.

    2014-08-01

    CMOS pixel sensors (CPS) are attractive for use in the innermost particle detectors for charged particle tracking due to their good trade-off between spatial resolution, material budget, radiation hardness, and readout speed. With the requirements of high readout speed and high radiation hardness to total ionizing dose (TID) for particle tracking, fast readout CPS are composed by integrating a data compression block and two SRAM IP cores. However, the radiation hardness of the SRAM IP cores is not as high as that of the other parts in CPS, and thus the radiation hardness of the whole CPS chip is lowered. Especially, when CPS are migrated into 0.18-μm processes, the single event upset (SEU) effects should be also considered besides TID and single event latchup (SEL) effects. This paper presents a radiation-hardened SRAM with enhanced radiation hardness to SEU. An error detection and correction (EDAC) algorithm and a bit-interleaving storage strategy are adopted in the design. The prototype design has been fabricated in a 0.18-μm process. The area of the new SRAM is increased 1.6 times as compared with a non-radiation-hardened SRAM due to the integration of EDAC algorithm and the adoption of radiation hardened layout. The access time is increased from 5 ns to 8 ns due to the integration of EDAC algorithm. The test results indicate that the design satisfy requirements of CPS for charged particle tracking.

  1. Method and apparatus of high dynamic range image sensor with individual pixel reset

    NASA Technical Reports Server (NTRS)

    Yadid-Pecht, Orly (Inventor); Pain, Bedabrata (Inventor); Fossum, Eric R. (Inventor)

    2001-01-01

    A wide dynamic range image sensor provides individual pixel reset to vary the integration time of individual pixels. The integration time of each pixel is controlled by column and row reset control signals which activate a logical reset transistor only when both signals coincide for a given pixel.

  2. Zero suppression logic of the ALICE muon forward tracker pixel chip prototype PIXAM and associated readout electronics development

    NASA Astrophysics Data System (ADS)

    Flouzat, C.; Değerli, Y.; Guilloux, F.; Orsini, F.; Venault, P.

    2015-05-01

    In the framework of the ALICE experiment upgrade at HL-LHC, a new forward tracking detector, the Muon Forward Tracker (MFT), is foreseen to overcome the intrinsic limitations of the present Muon Spectrometer and will perform new measurements of general interest for the whole ALICE physics. To fulfill the new detector requirements, CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive trade-off between readout speed, spatial resolution, radiation hardness, granularity, power consumption and material budget. This technology has been chosen to equip the Muon Forward Tracker and also the vertex detector: the Inner Tracking System (ITS). Since few years, an intensive R&D program has been performed on the design of MAPS in the 0.18 μ m CMOS Image Sensor (CIS) process. In order to avoid pile up effects in the experiment, the classical rolling shutter readout system of MAPS has been improved to overcome the readout speed limitation. A zero suppression algorithm, based on a 3 by 3 cluster finding (position and data), has been chosen for the MFT. This algorithm allows adequate data compression for the sensor. This paper presents the large size prototype PIXAM, which represents 1/3 of the final chip, and will focus specially on the zero suppression block architecture. This chip is designed and under fabrication in the 0.18 μ m CIS process. Finally, the readout electronics principle to send out the compressed data flow is also presented taking into account the cluster occupancy per MFT plane for a single central Pb-Pb collision.

  3. A pixel unit-cell targeting 16 ns resolution and radiation hardness in a column read-out particle vertex detector

    SciTech Connect

    Wright, M.; Millaud, J.; Nygren, D.

    1992-10-01

    A pixel unit cell (PUC) circuit architecture, optimized for a column read out architecture, is reported. Each PUC contains an integrator, active filter, comparator, and optional analog store. The time-over-threshold (TOT) discriminator allows an all-digital interface to the array periphery readout while passing an analog measure of collected charge. Use of (existing) radiation hard processes, to build a detector bump-bonded to a pixel readout array, is targeted. Here, emphasis is on a qualitative explanation of how the unique circuit implementation benefits operation for Super Collider (SSC) detector application.

  4. Single-event upset tests on the readout electronics for the pixel detectors of the PANDA experiment

    NASA Astrophysics Data System (ADS)

    Mazza, G.; Balossino, I.; Calvo, D.; De Mori, F.; De Remigis, P.; Filippi, A.; Marcello, S.; Mignone, M.; Wheadon, R.; Zotti, L.; Candelori, A.; Mattiazzo, S.; Silvestrin, L.

    2014-01-01

    The Silicon Pixel Detector (SPD) of the future PANDA experiment is the closest one to the interaction point and therefore the sensor and its electronics are the most exposed to radiation. The Total Ionizing Dose (TID) issue has been addressed by the use of a deep-submicron technology (CMOS 0.13 μm) for the readout ASICs. While this technology is very effective in reducing radiation induced oxide damage, it is also more sensitive to Single Event Upset (SEU) effects due to their extremely reduced dimensions. This problem has to be addressed at the circuit level and generally leads to an area penalty. Several techniques have been proposed in literature with different trade-off between level of protection and cell size. A subset of these techniques has been implemented in the PANDA SPD ToPiX readout ASIC prototypes, ranging from DICE cells to triple redundancy. Two prototypes have been tested with different ion beams at the INFN-LNL facility in order to measure the SEU cross section. Comparative results of the SEU test will be shown, together with an analysis of the SEU tolerance of the various protection schemes and future plans for the SEU protection strategy which will be implemented in the next ToPiX prototype.

  5. Low-Power CMOS Laser Doppler Imaging Using Non-CDS Pixel Readout and 13.6-bit SAR ADC.

    PubMed

    Chen, Denis Guangyin; Law, Man-Kay; Lian, Yong; Bermak, Amine

    2016-02-01

    Laser Doppler imaging (LDI) measures particle flows such as blood perfusion by sensing their Doppler shift. This paper is the first of its kind in analyzing the effect of circuit noise on LDI precision which is distinctively different from conventional imaging. Based on this result, it presents a non-correlated-double-sampling (non-CDS) pixel readout scheme along with a high-resolution successive-approximation-register (SAR) analog-to-digital-converter (ADC) with 13.6b effective resolution (ER). Measurement results from the prototype chip in 0.18 μm technology confirm the theoretical analysis and show that the two techniques improve LDI sensing precision by 6.9 dB and 4.4 dB (compared to a 10b ADC) respectively without analog pre-amplification. The sensor's ADC occupies 518 μm×84 μm and is suitable for fast column parallel readout. Its differential non-linearity (DNL), integral non-linearity (INL), and input referred noise are +3.0/-2.8 LSB, +24/-17 LSB, and 110 μVrms respectively, leading to a Figure-of-Merit (FoM) of 23 fJ/state which makes it one of the most energy efficient image sensor ADCs and an order of magnitude better than the best reported LDI system using commercial high-speed image sensors.

  6. Low-Power CMOS Laser Doppler Imaging Using Non-CDS Pixel Readout and 13.6-bit SAR ADC.

    PubMed

    Chen, Denis Guangyin; Law, Man-Kay; Lian, Yong; Bermak, Amine

    2016-02-01

    Laser Doppler imaging (LDI) measures particle flows such as blood perfusion by sensing their Doppler shift. This paper is the first of its kind in analyzing the effect of circuit noise on LDI precision which is distinctively different from conventional imaging. Based on this result, it presents a non-correlated-double-sampling (non-CDS) pixel readout scheme along with a high-resolution successive-approximation-register (SAR) analog-to-digital-converter (ADC) with 13.6b effective resolution (ER). Measurement results from the prototype chip in 0.18 μm technology confirm the theoretical analysis and show that the two techniques improve LDI sensing precision by 6.9 dB and 4.4 dB (compared to a 10b ADC) respectively without analog pre-amplification. The sensor's ADC occupies 518 μm×84 μm and is suitable for fast column parallel readout. Its differential non-linearity (DNL), integral non-linearity (INL), and input referred noise are +3.0/-2.8 LSB, +24/-17 LSB, and 110 μVrms respectively, leading to a Figure-of-Merit (FoM) of 23 fJ/state which makes it one of the most energy efficient image sensor ADCs and an order of magnitude better than the best reported LDI system using commercial high-speed image sensors. PMID:25532189

  7. Readout cross-talk for alpha-particle measurements in a pixelated sensor system

    NASA Astrophysics Data System (ADS)

    Norlin, B.; Reza, S.; Krapohl, D.; Fröjdh, E.; Thungström, G.

    2015-05-01

    Simulations in Medici are performed to quantify crosstalk and charge sharing in a hybrid pixelated silicon detector. Crosstalk and charge sharing degrades the spatial and spectral resolution of single photon processing X-ray imaging systems. For typical medical X-ray imaging applications, the process is dominated by charge sharing between the pixels in the sensor. For heavier particles each impact generates a large amount of charge and the simulation seems to over predict the charge collection efficiency. This indicates that some type of non modelled degradation of the charge transport efficiency exists, like the plasma effect where the plasma might shield the generated charges from the electric field and hence distorts the charge transport process. Based on the simulations it can be reasoned that saturation of the amplifiers in the Timepix system might generate crosstalk that increases the charge spread measured from ion impact on the sensor.

  8. Development of high data readout rate pixel module and detector hybridization at Fermilab

    SciTech Connect

    Sergio Zimmermann et al.

    2001-03-20

    This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is proven to be capable of successful fabrication at 50 micron pitch on real detectors. For solder bumps at 50 micron pitch, much better results have been obtained with the fluxless PADS processed detectors. The results are adequate for our needs and our tests have validated it as a viable technology.

  9. First look at the beam test results of the FPIX2 readout chip for the BTeV silicon pixel detector

    SciTech Connect

    Uplegger, L.; Appel, J.A.; Artuso, M.; Cardoso, G.; Cease, H.P.; Chiodini, G.; Christian, D.C.; Cinabro, D.A.; Coluccia, R.; Hoff, J.; Kwan, S.; Magni, S.; Mekkaoui, A.; Menasce, D.; Newsom, C.; Papavassiliou, V.; Schreiner, A.; Turqueti, M.A.; Yarema, R.; Wang, J.C.; /Fermilab /Syracuse U. /INFN, Lecce /Wayne State U. /INFN, Milan /Iowa U. /New Mexico State U.

    2004-11-01

    High energy and nuclear physics experiments need tracking devices with excellent spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (arrays of silicon diodes bump bonded to arrays of front-end electronic cells) is a technology able to meet these challenges. We report the first results of the BTeV silicon pixel detector beam test carried out at Fermilab in summer 2004. Tests were performed using a 120 GeV/c proton beam incident on a 6 planes pixel detector telescope. The last prototype developed for the BTeV experiment (FPIX2) is tested in the middle of the telescope. There is no external trigger and events were built using the time-stamp information provided by the readout chips.

  10. Tests of gases in a mini-TPC with pixel chip readout

    NASA Astrophysics Data System (ADS)

    Vahsen, S.; Oliver-Mallory, K.; Lopez-Thibodeaux, M.; Kadyk, J.; Garcia-Sciveres, M.

    2014-02-01

    Gases for potential use as targets for directional dark matter detection were tested in a prototype detector using two sequential Gas Electron Multipliers, or GEMs. The sensitive volume consists of a mini-TPC of 12 cm length and 7.5 cm diameter. An FEI3 pixel chip, developed for the ATLAS experiment, was used to produce spatial measurements with high resolution. An Fe55 source produced photoelectrons by X-ray conversions in the sensitive volume, and images of these were recorded by the chip. Spatial resolution plots are shown for the gases, which include the practical electron range of the photoelectrons and the effects of diffusion in the mini-TPC. Avalanche gain and gain resolution measurements were made for the four gases tested, at atmospheric and sub-atmospheric pressures: Ar(70)/CO2(30), CF4, He(80)/CF4(20) and He(80)/isobutane(20).

  11. Toward VIP-PIX: A Low Noise Readout ASIC for Pixelated CdTe Gamma-Ray Detectors for Use in the Next Generation of PET Scanners

    PubMed Central

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Puigdengoles, Carles; Lorenzo, Gianluca De; Martínez, Ricardo

    2013-01-01

    VIP-PIX will be a low noise and low power pixel readout electronics with digital output for pixelated Cadmium Telluride (CdTe) detectors. The proposed pixel will be part of a 2D pixel-array detector for various types of nuclear medicine imaging devices such as positron-emission tomography (PET) scanners, Compton gamma cameras, and positron-emission mammography (PEM) scanners. Each pixel will include a SAR ADC that provides the energy deposited with 10-bit resolution. Simultaneously, the self-triggered pixel which will be connected to a global time-to-digital converter (TDC) with 1 ns resolution will provide the event’s time stamp. The analog part of the readout chain and the ADC have been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and characterized with an external test pulse. The power consumption of these parts is 200 μW from a 2.5 V supply. It offers 4 switchable gains from ±10 mV/fC to ±40 mV/fC and an input charge dynamic range of up to ±70 fC for the minimum gain for both polarities. Based on noise measurements, the expected equivalent noise charge (ENC) is 65 e− RMS at room temperature. PMID:24187382

  12. Toward VIP-PIX: A Low Noise Readout ASIC for Pixelated CdTe Gamma-Ray Detectors for Use in the Next Generation of PET Scanners.

    PubMed

    Macias-Montero, Jose-Gabriel; Sarraj, Maher; Chmeissani, Mokhtar; Puigdengoles, Carles; Lorenzo, Gianluca De; Martínez, Ricardo

    2013-08-01

    VIP-PIX will be a low noise and low power pixel readout electronics with digital output for pixelated Cadmium Telluride (CdTe) detectors. The proposed pixel will be part of a 2D pixel-array detector for various types of nuclear medicine imaging devices such as positron-emission tomography (PET) scanners, Compton gamma cameras, and positron-emission mammography (PEM) scanners. Each pixel will include a SAR ADC that provides the energy deposited with 10-bit resolution. Simultaneously, the self-triggered pixel which will be connected to a global time-to-digital converter (TDC) with 1 ns resolution will provide the event's time stamp. The analog part of the readout chain and the ADC have been fabricated with TSMC 0.25 μm mixed-signal CMOS technology and characterized with an external test pulse. The power consumption of these parts is 200 μW from a 2.5 V supply. It offers 4 switchable gains from ±10 mV/fC to ±40 mV/fC and an input charge dynamic range of up to ±70 fC for the minimum gain for both polarities. Based on noise measurements, the expected equivalent noise charge (ENC) is 65 e(-) RMS at room temperature.

  13. A Pixel Readout Chip in 40 nm CMOS Process for High Count Rate Imaging Systems with Minimization of Charge Sharing Effects

    SciTech Connect

    Maj, Piotr; Grybos, P.; Szczgiel, R.; Kmon, P.; Drozd, A.; Deptuch, G.

    2013-11-07

    We present a prototype chip in 40 nm CMOS technology for readout of hybrid pixel detector. The prototype chip has a matrix of 18x24 pixels with a pixel pitch of 100 m. It can operate both in single photon counting (SPC) mode and in C8P1 mode. In SPC the measured ENC is 84 e rms (for the peaking time of 48 ns), while the effective offset spread is below 2 mV rms. In the C8P1 mode the chip reconstructs full charge deposited in the detector, even in the case of charge sharing, and it identifies a pixel with the largest charge deposition. The chip architecture and preliminary measurements are reported.

  14. Submillisecond X-ray photon correlation spectroscopy from a pixel array detector with fast dual gating and no readout dead-time.

    PubMed

    Zhang, Qingteng; Dufresne, Eric M; Grybos, Pawel; Kmon, Piotr; Maj, Piotr; Narayanan, Suresh; Deptuch, Grzegorz W; Szczygiel, Robert; Sandy, Alec

    2016-05-01

    Small-angle scattering X-ray photon correlation spectroscopy (XPCS) studies were performed using a novel photon-counting pixel array detector with dual counters for each pixel. Each counter can be read out independently from the other to ensure there is no readout dead-time between the neighboring frames. A maximum frame rate of 11.8 kHz was achieved. Results on test samples show good agreement with simple diffusion. The potential of extending the time resolution of XPCS beyond the limit set by the detector frame rate using dual counters is also discussed.

  15. A digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massive parallel Sigma-Delta-ADC readout

    NASA Astrophysics Data System (ADS)

    Weiler, Dirk; Russ, Marco; Würfel, Daniel; Lerch, Renee; Yang, Pin; Bauer, Jochen; Vogt, Holger

    2010-04-01

    This paper presents an advanced 640 x 480 (VGA) IRFPA based on uncooled microbolometers with a pixel-pitch of 25μm developed by Fraunhofer-IMS. The IRFPA is designed for thermal imaging applications in the LWIR (8 .. 14μm) range with a full-frame frequency of 30 Hz and a high sensitivity with NETD < 100 mK @ f/1. A novel readout architecture which utilizes massively parallel on-chip Sigma-Delta-ADCs located under the microbolometer array results in a high performance digital readout. Sigma-Delta-ADCs are inherently linear. A high resolution of 16 bit for a secondorder Sigma-Delta-modulator followed by a third-order digital sinc-filter can be obtained. In addition to several thousand Sigma-Delta-ADCs the readout circuit consists of a configurable sequencer for controlling the readout clocking signals and a temperature sensor for measuring the temperature of the IRFPA. Since packaging is a significant part of IRFPA's price Fraunhofer-IMS uses a chip-scaled package consisting of an IR-transparent window with antireflection coating and a soldering frame for maintaining the vacuum. The IRFPAs are completely fabricated at Fraunhofer-IMS on 8" CMOS wafers with an additional surface micromachining process. In this paper the architecture of the readout electronics, the packaging, and the electro-optical performance characterization are presented.

  16. Simulation of digital pixel readout chip architectures with the RD53 SystemVerilog-UVM verification environment using Monte Carlo physics data

    NASA Astrophysics Data System (ADS)

    Conti, E.; Marconi, S.; Christiansen, J.; Placidi, P.; Hemperek, T.

    2016-01-01

    The simulation and verification framework developed by the RD53 collaboration is a powerful tool for global architecture optimization and design verification of next generation hybrid pixel readout chips. In this paper the framework is used for studying digital pixel chip architectures at behavioral level. This is carried out by simulating a dedicated, highly parameterized pixel chip description, which makes it possible to investigate different grouping strategies between pixels and different latency buffering and arbitration schemes. The pixel hit information used as simulation input can be either generated internally in the framework or imported from external Monte Carlo detector simulation data. The latter have been provided by both the CMS and ATLAS experiments, featuring HL-LHC operating conditions and the specifications related to the Phase 2 upgrade. Pixel regions and double columns were simulated using such Monte Carlo data as inputs: the performance of different latency buffering architectures was compared and the compliance of different link speeds with the expected column data rate was verified.

  17. Commissioning of the read-out driver (ROD) card for the ATLAS IBL detector and upgrade studies for the pixel Layers 1 and 2

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Bindi, M.; Falchieri, D.; Gabrielli, A.; Travaglini, R.; Chen, S.-P.; Hsu, S.-C.; Hauck, S.; Kugel, A.

    2014-11-01

    The higher luminosity that is expected for the LHC after future upgrades will require better performance by the data acquisition system, especially in terms of throughput. In particular, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector will be equipped with a fourth layer - the Insertable B-Layer or IBL - located at a radius smaller than the present three layers. Consequently, a new front end ASIC (FE-I4) was designed as well as a new off-detector chain. The latter is composed mainly of two 9U-VME cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Actual production of another 15 ROD cards is ongoing in Fall 2013, and commissioning is scheduled in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards will be produced for a total of 20 boards. This paper describes some integration tests that were performed and our plan to test the production of the ROD cards. Slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. This contribution will report also one view on the possible adoption of the IBL ROD for ATLAS Pixel Detector Layer 2 (firstly) and, possibly, in the future, for Layer 1.

  18. An integrated readout system for drift chambers: the application of monolithic CMOS pixel sensors as segmented direct anode

    NASA Astrophysics Data System (ADS)

    Campbell, M.; Heijne, E. H. M.; Llopart, X.; Chefdeville, M.; Colas, P.; Giomataris, Y.; Colijn, A. P.; Fornaini, A.; van der Graaf, H.; Kluit, P.; Timmermans, J.; Visschers, J. L.; Schmitz, J.

    2006-01-01

    A small TPC has been read out by means of a MediPix2 readout chip as direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/Isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. We recorded many frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays.

  19. Detection of single electrons by means of a Micromegas-covered MediPix2 pixel CMOS readout circuit

    NASA Astrophysics Data System (ADS)

    Campbell, M.; Chefdeville, M.; Colas, P.; Colijn, A. P.; Fornaini, A.; Giomataris, Y.; van der Graaf, H.; Heijne, E. H. M.; Kluit, P.; Llopart, X.; Schmitz, J.; Timmermans, J.; Visschers, J. L.

    2005-03-01

    A small drift chamber was read out by means of a MediPix2 readout chip as a direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. We recorded many frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays.

  20. GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

    NASA Astrophysics Data System (ADS)

    Campbell, M.; Heijne, E. H. M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A. P.; Fornaini, A.; van der Graaf, H.; Kluit, P.; Timmermans, J.; Visschers, J. L.; Schmitz, J.

    2006-05-01

    A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1 mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

  1. X-ray tests of a microchannel plate detector and amorphous silicon pixel array readout for neutron radiography

    NASA Astrophysics Data System (ADS)

    Ambrosi, R. M.; Street, R.; Feller, B.; Fraser, G. W.; Watterson, J. I. W.; Lanza, R. C.; Dowson, J.; Ross, D.; Martindale, A.; Abbey, A. F.; Vernon, D.

    2007-03-01

    High-performance large area imaging detectors for fast neutrons in the 5-14 MeV energy range do not exist at present. The aim of this project is to combine microchannel plates or MCPs (or similar electron multiplication structures) traditionally used in image intensifiers and X-ray detectors with amorphous silicon (a-Si) pixel arrays to produce a composite converter and intensifier position sensitive imaging system. This detector will provide an order of magnitude improvement in image resolution when compared with current millimetre resolution limits obtained using phosphor or scintillator-based hydrogen rich converters. In this study we present the results of the initial experimental evaluation of the prototype system. This study was carried out using a medical X-ray source for the proof of concept tests, the next phase will involve neutron imaging tests. The hybrid detector described in this study is a unique development and paves the way for large area position sensitive detectors consisting of MCP or microsphere plate detectors and a-Si or polysilicon pixel arrays. Applications include neutron and X-ray imaging for terrestrial applications. The technology could be extended to space instrumentation for X-ray astronomy.

  2. Application Of A 1024X1024 Pixel Digital Image Store, With Pulsed Progressive Readout Camera, For Gastro-Intestinal Radiology

    NASA Astrophysics Data System (ADS)

    Edmonds, E. W.; Rowlands, J. A.; Hynes, D. M.; Toth, B. D.; Porter, A. J.

    1986-06-01

    We discuss the applicability of intensified x-ray television systems for general digital radiography and the requirements necessary for physician acceptance. Television systems for videofluorography when limited to conventional fluoroscopic exposure rates (25uR/s to x-ray intensifier), with particular application to the gastro-intestinal system, all suffer from three problems which tend to degrade the image: (a) lack of resolution, (b) noise, and (c) patient movement. The system to be described in this paper addresses each of these problems. Resolution is that provided by the use of a 1024 x 1024 pixel frame store combined with a 1024 line video camera and a 10"/6" x-ray image intensifier. Problems of noise and sensitivity to patient movement are overcome by using a short but intense burst of radiation to produce the latent image, which is then read off the video camera in a progressive fashion and placed in the digital store. Hard copy is produced from a high resolution multiformat camera, or a high resolution digital laser camera. It is intended that this PPR system will replace the 100mm spot film camera in present use, and will provide information in digital form for further processing and eventual digital archiving.

  3. ``The Read-Out Driver'' ROD card for the Insertable B-layer (IBL) detector of the ATLAS experiment: commissioning and upgrade studies for the Pixel Layers 1 and 2

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Gabrielli, A.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Morettini, P.; Travaglini, R.; Wensing, M.

    2014-01-01

    The upgrade of the ATLAS experiment at LHC foresees the insertion of an innermost silicon layer, called the Insertable B-layer (IBL). The IBL read-out system will be equipped with new electronics. The Readout-Driver card (ROD) is a VME board devoted to data processing, configuration and control. A pre-production batch has been delivered for testing with instrumented slices of the overall acquisition chain, aiming to finalize strategies for system commissioning. In this paper system setups and results will be described, as well as preliminary studies on changes needed to adopt the ROD for the ATLAS Pixel Layers 1 and 2.

  4. Back-side-illuminated 1.4μm pixel with a vertically pinned photodiode based on hole collection, PMOS readout chain and active side-wall passivation

    NASA Astrophysics Data System (ADS)

    Mamdy, Bastien; Roy, François; Ahmed, Nayera; Lu, Guo-Neng

    2015-10-01

    To further improve the characteristics of CMOS image sensors (CIS), we propose a back-side illuminated pixel integrating a vertically pinned and P-type photodiode (which collects holes) and PMOS readout circuitry. It has been designed in a 1.4μm-pitch, a two-transistor (2T) shared readout architecture and fabricated in a combined 65nm and 90nm technology. The vertically pinned photodiode takes up almost the entire volume of the pixel, allowing a full well capacity (FWC) exceeding 7000h+. With a conversion factor around 120μV/h+, the output swing approaching 1V is achieved on the column voltage. The pixel also integrates capacitive deep trench isolation (CDTI) to tackle electrical and optical crosstalk issues. The effective passivation of trench interface by CDTI bias control is demonstrated for a hole-based pixel. As expected, PMOS transistors have much lower trapping noise compared to NMOS counterparts. The PMOS source follower has an average temporal noise of 195μV, mainly dominated by thermal noise contribution.

  5. Compact all-CMOS spatiotemporal compressive sensing video camera with pixel-wise coded exposure.

    PubMed

    Zhang, Jie; Xiong, Tao; Tran, Trac; Chin, Sang; Etienne-Cummings, Ralph

    2016-04-18

    We present a low power all-CMOS implementation of temporal compressive sensing with pixel-wise coded exposure. This image sensor can increase video pixel resolution and frame rate simultaneously while reducing data readout speed. Compared to previous architectures, this system modulates pixel exposure at the individual photo-diode electronically without external optical components. Thus, the system provides reduction in size and power compare to previous optics based implementations. The prototype image sensor (127 × 90 pixels) can reconstruct 100 fps videos from coded images sampled at 5 fps. With 20× reduction in readout speed, our CMOS image sensor only consumes 14μW to provide 100 fps videos.

  6. Serial Pixel Analog-to-Digital Converter

    SciTech Connect

    Larson, E D

    2010-02-01

    This method reduces the data path from the counter to the pixel register of the analog-to-digital converter (ADC) from as many as 10 bits to a single bit. The reduction in data path width is accomplished by using a coded serial data stream similar to a pseudo random number (PRN) generator. The resulting encoded pixel data is then decoded into a standard hexadecimal format before storage. The high-speed serial pixel ADC concept is based on the single-slope integrating pixel ADC architecture. Previous work has described a massively parallel pixel readout of a similar architecture. The serial ADC connection is similar to the state-of-the art method with the exception that the pixel ADC register is a shift register and the data path is a single bit. A state-of-the-art individual-pixel ADC uses a single-slope charge integration converter architecture with integral registers and “one-hot” counters. This implies that parallel data bits are routed among the counter and the individual on-chip pixel ADC registers. The data path bit-width to the pixel is therefore equivalent to the pixel ADC bit resolution.

  7. Hit efficiency study of CMS prototype forward pixel detectors

    SciTech Connect

    Kim, Dongwook; /Johns Hopkins U.

    2006-01-01

    In this paper the author describes the measurement of the hit efficiency of a prototype pixel device for the CMS forward pixel detector. These pixel detectors were FM type sensors with PSI46V1 chip readout. The data were taken with the 120 GeV proton beam at Fermilab during the period of December 2004 to February 2005. The detectors proved to be highly efficient (99.27 {+-} 0.02%). The inefficiency was primarily located near the corners of the individual pixels.

  8. Demonstration of a low-voltage three-transistor-per-pixel CMOS imager based on a pulse-width-modulation readout scheme employed with a one-transistor in-pixel comparator

    NASA Astrophysics Data System (ADS)

    Shishido, S.; Nagahata, I.; Sasaki, T.; Kagawa, K.; Nunoshita, M.; Ohta, J.

    2007-02-01

    To realize a low-voltage CMOS imager with a small pixel size, we have proposed a new pixel structure composed of only three transistors without any circuit sharing technique. The pixel has a gate-common transistor that compares a photodiode voltage on the gate node with a ramp signal on the source node to perform a single-slope A/D conversion based on a pulse-width-modulation pixel-reading scheme. The large gain of the in-pixel comparator contribute to the small input-referred noise and surpress column-to-column fixed-pattern-noise (FPN). Pixel-to-pixel FPN is suppressed by a feedback reset. Our CMOS imager can lower the operating voltage with less degradation of the dynamic range than that of ordinary active pixel sensors. We have fabricated a 128×96-pixel prototype sensor with an on-chip ramp generator and bootstrap circuits in a 0.35-μm CMOS technology, and successfully demonstrated its operations with a 1.5-V single power-supply voltage.

  9. TES Detector Noise Limited Readout Using SQUID Multiplexers

    NASA Technical Reports Server (NTRS)

    Staguhn, J. G.; Benford, D. J.; Chervenak, J. A.; Khan, S. A.; Moseley, S. H.; Shafer, R. A.; Deiker, S.; Grossman, E. N.; Hilton, G. C.; Irwin, K. D.

    2004-01-01

    The availability of superconducting Transition Edge Sensors (TES) with large numbers of individual detector pixels requires multiplexers for efficient readout. The use of multiplexers reduces the number of wires needed between the cryogenic electronics and the room temperature electronics and cuts the number of required cryogenic amplifiers. We are using an 8 channel SQUID multiplexer to read out one-dimensional TES arrays which are used for submillimeter astronomical observations. We present results from test measurements which show that the low noise level of the SQUID multiplexers allows accurate measurements of the TES Johnson noise, and that in operation, the readout noise is dominated by the detector noise. Multiplexers for large number of channels require a large bandwidth for the multiplexed readout signal. We discuss the resulting implications for the noise performance of these multiplexers which will be used for the readout of two dimensional TES arrays in next generation instruments.

  10. Characterization of the FE-I4B pixel readout chip production run for the ATLAS Insertable B-layer upgrade

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2013-03-01

    The Insertable B-layer (IBL) is a fourth pixel layer that will be added inside the existing ATLAS pixel detector during the long LHC shutdown of 2013 and 2014. The new four layer pixel system will ensure excellent tracking, vertexing and b-tagging performance in the high luminosity pile-up conditions projected for the next LHC run. The peak luminosity is expected to reach 3·1034 cm-2s-1with an integrated luminosity over the IBL lifetime of 300 fb-1 corresponding to a design lifetime fluence of 5·1015 neqcm-2 and ionizing dose of 250 Mrad including safety factors. The production front-end electronics FE-I4B for the IBL has been fabricated at the end of 2011 and has been extensively characterized on diced ICs as well as at the wafer level. The production tests at the wafer level were performed during 2012. Selected results of the diced IC characterization are presented, including measurements of the on-chip voltage regulators. The IBL powering scheme, which was chosen based on these results, is described. Preliminary wafer to wafer distributions as well as yield calculations are given.

  11. Preliminary demonstration of an IonCCD as an alternative pixelated anode for direct MCP readout in a compact MS-based detector.

    PubMed

    Hadjar, Omar; Fowler, William K; Kibelka, Gottfried; Schnute, William C

    2012-02-01

    We report on the preliminary testing of a new position-sensitive detector (PSD) by combining a microchannel plate (MCP) and a charge-sensitive pixilated anode with a direct readout based on charge-coupled detector (CCD) technology, which will be referred to as IonCCD (Hadjar et al. J Am Soc Mass Spectrom 22(4):612-623, 2011; Johnson et al. J Am Soc Mass Spectrom 22(8):1388-1394, 2011; Hadjar et al. J Am Soc Mass Spectrom 22(10):1872-1884, 2011). This work exploits the recently discovered electron detection capability of the IonCCD (Hadjar et al. J Am Soc Mass Spectrom 22(4):612-623, 2011), allowing it to be used directly behind an MC. This MCP-IonCCD configuration potentially obviates the need for electro-optical ion detector systems (EOIDs), which typically feature a relatively difficult-to-implement 5-kV power source as well as a phosphorus screen behind the MCP for conversion of electrons to photons prior to signal generation in a photosensitive CCD. Thus, the new system (MCP-IonCCD) has the potential to be smaller, simpler, more robust, and more cost efficient than EOID-based technologies in many applications. The use of the IonCCD as direct MCP readout anode, as opposed to its direct use as an ion detector, will benefit from the instant three-to-four-order-of-magnitude gain of the MCP with virtually no additional noise. The signal/noise gain can be used for either sensitivity or speed enhancement of the detector. The speed enhancement may motivate the development of faster IonCCD readout speeds (currently at 2.7 ms) to achieve the 2 kHz frame rate for which the IonCCD chip was designed, a must for transient signal applications. The presented detector exhibits clear potential not only as a trace analysis detector in scan-free mass spectrometry and electron spectroscopy but also as a compact detector for photon and particle imaging applications.

  12. Detecting individual extracellular vesicles using a multicolor in situ proximity ligation assay with flow cytometric readout

    PubMed Central

    Löf, Liza; Ebai, Tonge; Dubois, Louise; Wik, Lotta; Ronquist, K. Göran; Nolander, Olivia; Lundin, Emma; Söderberg, Ola; Landegren, Ulf; Kamali-Moghaddam, Masood

    2016-01-01

    Flow cytometry is a powerful method for quantitative and qualitative analysis of individual cells. However, flow cytometric analysis of extracellular vesicles (EVs), and the proteins present on their surfaces has been hampered by the small size of the EVs – in particular for the smallest EVs, which can be as little as 40 nm in diameter, the limited number of antigens present, and their low refractive index. We addressed these limitations for detection and characterization of EV by flow cytometry through the use of multiplex and multicolor in situ proximity ligation assays (in situ PLA), allowing each detected EV to be easily recorded over background noise using a conventional flow cytometer. By targeting sets of proteins on the surface that are specific for distinct classes of EVs, the method allows for selective recognition of populations of EVs in samples containing more than one type of EVs. The method presented herein opens up for analyses of EVs using flow cytometry for their characterization and quantification. PMID:27681459

  13. High-flux ptychographic imaging using the new 55 µm-pixel detector ‘Lambda’ based on the Medipix3 readout chip

    SciTech Connect

    Wilke, R. N. Wallentin, J.; Osterhoff, M.; Pennicard, D.; Zozulya, A.; Sprung, M.; Salditt, T.

    2014-11-01

    The Large Area Medipix-Based Detector Array (Lambda) has been used in a ptychographic imaging experiment on solar-cell nanowires. By using a semi-transparent central stop, the high flux density provided by nano-focusing Kirkpatrick–Baez mirrors can be fully exploited for high-resolution phase reconstructions. Suitable detection systems that are capable of recording high photon count rates with single-photon detection are instrumental for coherent X-ray imaging. The new single-photon-counting pixel detector ‘Lambda’ has been tested in a ptychographic imaging experiment on solar-cell nanowires using Kirkpatrick–Baez-focused 13.8 keV X-rays. Taking advantage of the high count rate of the Lambda and dynamic range expansion by the semi-transparent central stop, a high-dynamic-range diffraction signal covering more than seven orders of magnitude has been recorded, which corresponds to a photon flux density of about 10{sup 5} photons nm{sup −2} s{sup −1} or a flux of ∼10{sup 10} photons s{sup −1} on the sample. By comparison with data taken without the semi-transparent central stop, an increase in resolution by a factor of 3–4 is determined: from about 125 nm to about 38 nm for the nanowire and from about 83 nm to about 21 nm for the illuminating wavefield.

  14. Large area CMOS bio-pixel array for compact high sensitive multiplex biosensing.

    PubMed

    Sandeau, Laure; Vuillaume, Cassandre; Contié, Sylvain; Grinenval, Eva; Belloni, Federico; Rigneault, Hervé; Owens, Roisin M; Fournet, Margaret Brennan

    2015-02-01

    A novel CMOS bio-pixel array which integrates assay substrate and assay readout is demonstrated for multiplex and multireplicate detection of a triplicate of cytokines with single digit pg ml(-1) sensitivities. Uniquely designed large area bio-pixels enable individual assays to be dedicated to and addressed by single pixels. A capability to simultaneously measure a large number of targets is provided by the 128 available pixels. Chemiluminescent assays are carried out directly on the pixel surface which also detects the emitted chemiluminescent photons, facilitating a highly compact sensor and reader format. The high sensitivity of the bio-pixel array is enabled by the high refractive index of silicon based pixels. This in turn generates a strong supercritical angle luminescence response significantly increasing the efficiency of the photon collection over conventional farfield modalities. PMID:25490928

  15. PIXEL PUSHER

    NASA Technical Reports Server (NTRS)

    Stanfill, D. F.

    1994-01-01

    Pixel Pusher is a Macintosh application used for viewing and performing minor enhancements on imagery. It will read image files in JPL's two primary image formats- VICAR and PDS - as well as the Macintosh PICT format. VICAR (NPO-18076) handles an array of image processing capabilities which may be used for a variety of applications including biomedical image processing, cartography, earth resources, and geological exploration. Pixel Pusher can also import VICAR format color lookup tables for viewing images in pseudocolor (256 colors). This program currently supports only eight bit images but will work on monitors with any number of colors. Arbitrarily large image files may be viewed in a normal Macintosh window. Color and contrast enhancement can be performed with a graphical "stretch" editor (as in contrast stretch). In addition, VICAR images may be saved as Macintosh PICT files for exporting into other Macintosh programs, and individual pixels can be queried to determine their locations and actual data values. Pixel Pusher is written in Symantec's Think C and was developed for use on a Macintosh SE30, LC, or II series computer running System Software 6.0.3 or later and 32 bit QuickDraw. Pixel Pusher will only run on a Macintosh which supports color (whether a color monitor is being used or not). The standard distribution medium for this program is a set of three 3.5 inch Macintosh format diskettes. The program price includes documentation. Pixel Pusher was developed in 1991 and is a copyrighted work with all copyright vested in NASA. Think C is a trademark of Symantec Corporation. Macintosh is a registered trademark of Apple Computer, Inc.

  16. Compact all-CMOS spatiotemporal compressive sensing video camera with pixel-wise coded exposure.

    PubMed

    Zhang, Jie; Xiong, Tao; Tran, Trac; Chin, Sang; Etienne-Cummings, Ralph

    2016-04-18

    We present a low power all-CMOS implementation of temporal compressive sensing with pixel-wise coded exposure. This image sensor can increase video pixel resolution and frame rate simultaneously while reducing data readout speed. Compared to previous architectures, this system modulates pixel exposure at the individual photo-diode electronically without external optical components. Thus, the system provides reduction in size and power compare to previous optics based implementations. The prototype image sensor (127 × 90 pixels) can reconstruct 100 fps videos from coded images sampled at 5 fps. With 20× reduction in readout speed, our CMOS image sensor only consumes 14μW to provide 100 fps videos. PMID:27137331

  17. Improved Signal Chains for Readout of CMOS Imagers

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Hancock, Bruce; Cunningham, Thomas

    2009-01-01

    An improved generic design has been devised for implementing signal chains involved in readout from complementary metal oxide/semiconductor (CMOS) image sensors and for other readout integrated circuits (ICs) that perform equivalent functions. The design applies to any such IC in which output signal charges from the pixels in a given row are transferred simultaneously into sampling capacitors at the bottoms of the columns, then voltages representing individual pixel charges are read out in sequence by sequentially turning on column-selecting field-effect transistors (FETs) in synchronism with source-follower- or operational-amplifier-based amplifier circuits. The improved design affords the best features of prior source-follower-and operational- amplifier-based designs while overcoming the major limitations of those designs. The limitations can be summarized as follows: a) For a source-follower-based signal chain, the ohmic voltage drop associated with DC bias current flowing through the column-selection FET causes unacceptable voltage offset, nonlinearity, and reduced small-signal gain. b) For an operational-amplifier-based signal chain, the required bias current and the output noise increase superlinearly with size of the pixel array because of a corresponding increase in the effective capacitance of the row bus used to couple the sampled column charges to the operational amplifier. The effect of the bus capacitance is to simultaneously slow down the readout circuit and increase noise through the Miller effect.

  18. MONOLITHIC ACTIVE PIXEL MATRIX WITH BINARY COUNTERS IN AN SOI PROCESS.

    SciTech Connect

    DUPTUCH,G.; YAREMA, R.

    2007-06-07

    The design of a Prototype monolithic active pixel matrix, designed in a 0.15 {micro}m CMOS SOI Process, is presented. The process allowed connection between the electronics and the silicon volume under the layer of buried oxide (BOX). The small size vias traversing through the BOX and implantation of small p-type islands in the n-type bulk result in a monolithic imager. During the acquisition time, all pixels register individual radiation events incrementing the counters. The counting rate is up to 1 MHz per pixel. The contents of counters are shifted out during the readout phase. The designed prototype is an array of 64 x 64 pixels and the pixel size is 26 x 26 {micro}m{sup 2}.

  19. Precision tracking with a single gaseous pixel detector

    NASA Astrophysics Data System (ADS)

    Tsigaridas, S.; van Bakel, N.; Bilevych, Y.; Gromov, V.; Hartjes, F.; Hessey, N. P.; de Jong, P.; Kluit, R.

    2015-09-01

    The importance of micro-pattern gaseous detectors has grown over the past few years after successful usage in a large number of applications in physics experiments and medicine. We develop gaseous pixel detectors using micromegas-based amplification structures on top of CMOS pixel readout chips. Using wafer post-processing we add a spark-protection layer and a grid to create an amplification region above the chip, allowing individual electrons released above the grid by the passage of ionising radiation to be recorded. The electron creation point is measured in 3D, using the pixel position for (x, y) and the drift time for z. The track can be reconstructed by fitting a straight line to these points. In this work we have used a pixel-readout-chip which is a small-scale prototype of Timepix3 chip (designed for both silicon and gaseous detection media). This prototype chip has several advantages over the existing Timepix chip, including a faster front-end (pre-amplifier and discriminator) and a faster TDC which reduce timewalk's contribution to the z position error. Although the chip is very small (sensitive area of 0.88 × 0.88mm2), we have built it into a detector with a short drift gap (1.3 mm), and measured its tracking performance in an electron beam at DESY. We present the results obtained, which lead to a significant improvement for the resolutions with respect to Timepix-based detectors.

  20. Reading a GEM with a VLSI pixel ASIC used as a direct charge collecting anode

    NASA Astrophysics Data System (ADS)

    Bellazzini, R.; Angelini, F.; Baldini, L.; Bitti, F.; Brez, A.; Ceccanti, M.; Latronico, L.; Massai, M. M.; Minuti, M.; Omodei, N.; Razzano, M.; Sgro, C.; Spandre, G.; Costa, E.; Soffitta, P.

    2004-12-01

    In MicroPattern Gas Detectors (MPGD) when the pixel size is below 100 micron and the number of pixels is large (above 1000) it is virtually impossible to use the conventional PCB read-out approach to bring the signal charge from the individual pixel to the external electronics chain. For this reason a custom CMOS array of 2101 active pixels with 80 micron pitch, directly used as the charge collecting anode of a GEM amplifying structure, has been developed and built. Each charge collecting pad, hexagonally shaped, realized using the top metal layer of a deep submicron VLSI technology is individually connected to a full electronics chain (pre-amplifier, shaping-amplifier, sample and hold, multiplexer) which is built immediately below it by using the remaining five active layers. The GEM and the drift electrode window are assembled directly over the chip so the ASIC itself becomes the pixelized anode of a MicroPattern Gas Detector. With this approach, for the first time, gas detectors have reached the level of integration and resolution typical of solid state pixel detectors. Results from the first tests of this new read-out concept are presented. An Astronomical X-Ray Polarimetry application is also discussed.

  1. Nanosecond monolithic CMOS readout cell

    DOEpatents

    Souchkov, Vitali V.

    2004-08-24

    A pulse shaper is implemented in monolithic CMOS with a delay unit formed of a unity gain buffer. The shaper is formed of a difference amplifier having one input connected directly to an input signal and a second input connected to a delayed input signal through the buffer. An elementary cell is based on the pulse shaper and a timing circuit which gates the output of an integrator connected to the pulse shaper output. A detector readout system is formed of a plurality of elementary cells, each connected to a pixel of a pixel array, or to a microstrip of a plurality of microstrips, or to a detector segment.

  2. DAQ hardware and software development for the ATLAS Pixel Detector

    NASA Astrophysics Data System (ADS)

    Stramaglia, Maria Elena

    2016-07-01

    In 2014, the Pixel Detector of the ATLAS experiment has been extended by about 12 million pixels thanks to the installation of the Insertable B-Layer (IBL). Data-taking and tuning procedures have been implemented along with newly designed readout hardware to support high bandwidth for data readout and calibration. The hardware is supported by an embedded software stack running on the readout boards. The same boards will be used to upgrade the readout bandwidth for the two outermost barrel layers of the ATLAS Pixel Detector. We present the IBL readout hardware and the supporting software architecture used to calibrate and operate the 4-layer ATLAS Pixel Detector. We discuss the technical implementations and status for data taking, validation of the DAQ system in recent cosmic ray data taking, in-situ calibrations, and results from additional tests in preparation for Run 2 at the LHC.

  3. Report of the sensor readout electronics panel

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.; Carson, J.; Kleinhans, W.; Kosonocky, W.; Kozlowski, L.; Pecsalski, A.; Silver, A.; Spieler, H.; Woolaway, J.

    1991-01-01

    The findings of the Sensor Readout Electronics Panel are summarized in regard to technology assessment and recommended development plans. In addition to two specific readout issues, cryogenic readouts and sub-electron noise, the panel considered three advanced technology areas that impact the ability to achieve large format sensor arrays. These are mega-pixel focal plane packaging issues, focal plane to data processing module interfaces, and event driven readout architectures. Development in each of these five areas was judged to have significant impact in enabling the sensor performance desired for the Astrotech 21 mission set. Other readout issues, such as focal plane signal processing or other high volume data acquisition applications important for Eos-type mapping, were determined not to be relevant for astrophysics science goals.

  4. Millisecond readout CCD camera

    NASA Astrophysics Data System (ADS)

    Prokop, Mark; McCurnin, Thomas W.; Stradling, Gary L.

    1993-01-01

    We have developed a prototype of a fast-scanning CCD readout system to record a 1024 X 256 pixel image and transport the image to a recording station within 1 ms of the experimental event. The system is designed to have a dynamic range of greater than 1000 with adequate sensitivity to read single-electron excitations of a CRT phosphor when amplified by a microchannel plate image intensifier. This readout camera is intended for recording images from oscilloscopes, streak, and framing cameras. The sensor is a custom CCD chip, designed by LORAL Aeroneutronics. This CCD chip is designed with 16 parallel output ports to supply the necessary image transfer speed. The CCD is designed as an interline structure to allow fast clearing of the image and on-chip fast sputtering. Special antiblooming provisions are also included. The camera is designed to be modular and to allow CCD chips of other sizes to be used with minimal reengineering of the camera head.

  5. Millisecond readout CCD camera

    NASA Astrophysics Data System (ADS)

    Prokop, M.; McCurnin, T. W.; Stradling, G.

    We have developed a prototype of a fast-scanning CCD readout system to record a 1024 x 256 pixel image and transport the image to a recording station within 1 ms of the experimental event. The system is designed to have a dynamic range of greater than 1000 with adequate sensitivity to read single-electron excitations of a CRT phosphor when amplified by a microchannel plate image intensifier. This readout camera is intended for recording images from oscilloscopes, streak, and framing cameras. The sensor is a custom CCD chip, designed by LORAL Aeroneutronics. This CCD chip is designed with 16 parallel output ports to supply the necessary image transfer speed. The CCD is designed as an interline structure to allow fast clearing of the image and on-chip fast shuttering. Special antiblooming provisions are also included. The camera is designed to be modular and to allow CCD chips of other sizes to be used with minimal reengineering of the camera head.

  6. Direct readout of gaseous detectors with tiled CMOS circuits

    NASA Astrophysics Data System (ADS)

    Visschers, J. L.; Blanco Carballo, V.; Chefdeville, M.; Colas, P.; van der Graaf, H.; Schmitz, J.; Smits, S.; Timmermans, J.

    2007-03-01

    A coordinated design effort is underway, exploring the three-dimensional direct readout of gaseous detectors by an anode plate equipped with a tiled array of many CMOS pixel readout ASICs, having amplification grids integrated on their topsides and being contacted on their backside.

  7. Simulation of charge transport in pixelated CdTe

    NASA Astrophysics Data System (ADS)

    Kolstein, M.; Ariño, G.; Chmeissani, M.; De Lorenzo, G.

    2014-12-01

    The Voxel Imaging PET (VIP) Pathfinder project intends to show the advantages of using pixelated semiconductor technology for nuclear medicine applications to achieve an improved image reconstruction without efficiency loss. It proposes designs for Positron Emission Tomography (PET), Positron Emission Mammography (PEM) and Compton gamma camera detectors with a large number of signal channels (of the order of 106). The design is based on the use of a pixelated CdTe Schottky detector to have optimal energy and spatial resolution. An individual read-out channel is dedicated for each detector voxel of size 1 × 1 × 2 mm3 using an application-specific integrated circuit (ASIC) which the VIP project has designed, developed and is currently evaluating experimentally. The behaviour of the signal charge carriers in CdTe should be well understood because it has an impact on the performance of the readout channels. For this purpose the Finite Element Method (FEM) Multiphysics COMSOL software package has been used to simulate the behaviour of signal charge carriers in CdTe and extract values for the expected charge sharing depending on the impact point and bias voltage. The results on charge sharing obtained with COMSOL are combined with GAMOS, a Geant based particle tracking Monte Carlo software package, to get a full evaluation of the amount of charge sharing in pixelated CdTe for different gamma impact points.

  8. Multiport solid-state imager characterization at variable pixel rates

    SciTech Connect

    Yates, G.J.; Albright, K.A.; Turko, B.T.

    1993-08-01

    The imaging performance of an 8-port Full Frame Transfer Charge Coupled Device (FFT CCD) as a function of several parameters including pixel clock rate is presented. The device, model CCD- 13, manufactured by English Electric Valve (EEV) is a 512 {times} 512 pixel array designed with four individual programmable bidirectional serial registers and eight output amplifiers permitting simultaneous readout of eight segments (128 horizontal {times} 256 vertical pixels) of the array. The imager was evaluated in Los Alamos National Laboratory`s High-Speed Solid-State Imager Test Station at true pixel rates as high as 50 MHz for effective imager pixel rates approaching 400 MHz from multiporting. Key response characteristics measured include absolute responsivity, Charge-Transfer-Efficiency (CTE), dynamic range, resolution, signal-to-noise ratio, and electronic and optical crosstalk among the eight video channels. Preliminary test results and data obtained from the CCD-13 will be presented and the versatility/capabilities of the test station will be reviewed.

  9. Readout of the upgraded ALICE-ITS

    NASA Astrophysics Data System (ADS)

    Szczepankiewicz, A.

    2016-07-01

    The ALICE experiment will undergo a major upgrade during the second long shutdown of the CERN LHC. As part of this program, the present Inner Tracking System (ITS), which employs different layers of hybrid pixels, silicon drift and strip detectors, will be replaced by a completely new tracker composed of seven layers of monolithic active pixel sensors. The upgraded ITS will have more than twelve billion pixels in total, producing 300 Gbit/s of data when tracking 50 kHz Pb-Pb events. Two families of pixel chips realized with the TowerJazz CMOS imaging process have been developed as candidate sensors: the ALPIDE, which uses a proprietary readout and sparsification mechanism and the MISTRAL-O, based on a proven rolling shutter architecture. Both chips can operate in continuous mode, with the ALPIDE also supporting triggered operations. As the communication IP blocks are shared among the two chip families, it has been possible to develop a common Readout Electronics. All the sensor components (analog stages, state machines, buffers, FIFOs, etc.) have been modelled in a system level simulation, which has been extensively used to optimize both the sensor and the whole readout chain design in an iterative process. This contribution covers the progress of the R&D efforts and the overall expected performance of the ALICE-ITS readout system.

  10. Readout IC requirement trends based on a simplified parametric seeker model.

    SciTech Connect

    Osborn, Thor D.

    2010-03-01

    Modern space based optical sensors place substantial demands on the focal plane array readout integrated circuit. Active pixel readout designs offer direct access to individual pixel data but require analog to digital conversion at or near each pixel. Thus, circuit designers must create precise, fundamentally analog circuitry within tightly constrained areas on the integrated circuit. Rapidly changing phenomena necessitate tradeoffs between sampling and conversion speed, data precision, and heat generation adjacent the detector array, especially of concern for thermally sensitive space grade infrared detectors. A simplified parametric model is presented that illustrates seeker system performance and analog to digital conversion requirements trends in the visible through mid-wave infrared, for varying sample rate. Notional limiting-case Earth optical backgrounds were generated using MODTRAN4 with a range of cloud extremes and approximate practical albedo limits for typical surface features from a composite of the Mosart and Aster spectral albedo databases. The dynamic range requirements imposed by these background spectra are discussed in the context of optical band selection and readout design impacts.

  11. Smart pixels

    NASA Astrophysics Data System (ADS)

    Seitz, Peter

    2004-09-01

    Semiconductor technology progresses at a relentless pace, making it possible to provide image sensors and each pixel with an increasing amount of custom analog and digital functionality. As experience with such photosensor functionality grows, an increasing variety of modular building blocks become available for smart pixels, single-chip digital cameras and functional image sensors. Examples include a non-linear pixel response circuit for high-dynamic range imaging with a dynamic range exceeding 180 dB, low-noise amplifiers and avalanche-effect pixels for high-sensitivity detection performance approaching single-photoelectron resolution, lock-in pixels for optical time-of-flight range cameras with sub-centimeter distance resolution and in-pixel demodulation circuits for optical coherence tomography imaging. The future is seen in system-on-a-chip machine vision cameras ("seeing chips"), post-processing with non-silicon materials for the extension of the detection range to the X-ray, ultraviolet and infrared spectrum, the use of organic semiconductors for low-cost large-area photonic microsystems, as well as imaging of fields other than electromagnetic radiation.

  12. CMOS Active Pixel Sensors as energy-range detectors for proton Computed Tomography

    NASA Astrophysics Data System (ADS)

    Esposito, M.; Anaxagoras, T.; Evans, P. M.; Green, S.; Manolopoulos, S.; Nieto-Camero, J.; Parker, D. J.; Poludniowski, G.; Price, T.; Waltham, C.; Allinson, N. M.

    2015-06-01

    Since the first proof of concept in the early 70s, a number of technologies has been proposed to perform proton CT (pCT), as a means of mapping tissue stopping power for accurate treatment planning in proton therapy. Previous prototypes of energy-range detectors for pCT have been mainly based on the use of scintillator-based calorimeters, to measure proton residual energy after passing through the patient. However, such an approach is limited by the need for only a single proton passing through the energy-range detector in a read-out cycle. A novel approach to this problem could be the use of pixelated detectors, where the independent read-out of each pixel allows to measure simultaneously the residual energy of a number of protons in the same read-out cycle, facilitating a faster and more efficient pCT scan. This paper investigates the suitability of CMOS Active Pixel Sensors (APSs) to track individual protons as they go through a number of CMOS layers, forming an energy-range telescope. Measurements performed at the iThemba Laboratories will be presented and analysed in terms of correlation, to confirm capability of proton tracking for CMOS APSs.

  13. 3D, Flash, Induced Current Readout for Silicon Sensors

    SciTech Connect

    Parker, Sherwood I.

    2014-06-07

    A new method for silicon microstrip and pixel detector readout using (1) 65 nm-technology current amplifers which can, for the first time with silicon microstrop and pixel detectors, have response times far shorter than the charge collection time (2) 3D trench electrodes large enough to subtend a reasonable solid angle at most track locations and so have adequate sensitivity over a substantial volume of pixel, (3) induced signals in addition to, or in place of, collected charge

  14. Pixel Paradise

    NASA Technical Reports Server (NTRS)

    1998-01-01

    PixelVision, Inc., has developed a series of integrated imaging engines capable of high-resolution image capture at dynamic speeds. This technology was used originally at Jet Propulsion Laboratory in a series of imaging engines for a NASA mission to Pluto. By producing this integrated package, Charge-Coupled Device (CCD) technology has been made accessible to a wide range of users.

  15. Digital-pixel focal plane array development

    NASA Astrophysics Data System (ADS)

    Brown, Matthew G.; Baker, Justin; Colonero, Curtis; Costa, Joe; Gardner, Tom; Kelly, Mike; Schultz, Ken; Tyrrell, Brian; Wey, Jim

    2010-01-01

    Since 2006, MIT Lincoln Laboratory has been developing Digital-pixel Focal Plane Array (DFPA) readout integrated circuits (ROICs). To date, four 256 × 256 30 μm pitch DFPA designs with in-pixel analog to digital conversion have been fabricated using IBM 90 nm CMOS processes. The DFPA ROICs are compatible with a wide range of detector materials and cutoff wavelengths; HgCdTe, QWIP, and InGaAs photo-detectors with cutoff wavelengths ranging from 1.6 to 14.5 μm have been hybridized to the same digital-pixel readout. The digital-pixel readout architecture offers high dynamic range, A/C or D/C coupled integration, and on-chip image processing with low power orthogonal transfer operations. The newest ROIC designs support two-color operation with a single Indium bump connection. Development and characterization of the two-color DFPA designs is presented along with applications for this new digital readout technology.

  16. XAMPS Detectors Readout ASIC for LCLS

    SciTech Connect

    Dragone, A; Pratte, J.F.; Rehak, P.; Carini, G.A.; Herbst, R.; O'Connor, P.; Siddons, D.P.; /BNL, NSLS

    2008-12-18

    An ASIC for the readout of signals from X-ray Active Matrix Pixel Sensor (XAMPS) detectors to be used at the Linac Coherent Light Source (LCLS) is presented. The X-ray Pump Probe (XPP) instrument, for which the ASIC has been designed, requires a large input dynamic range on the order of 104 photons at 8 keV with a resolution of half a photon FWHM. Due to the size of the pixel and the length of the readout line, large input capacitance is expected, leading to stringent requirement on the noise optimization. Furthermore, the large number of pixels needed for a good position resolution and the fixed LCLS beam period impose limitations on the time available for the single pixel readout. Considering the periodic nature of the LCLS beam, the ASIC developed for this application is a time-variant system providing low-noise charge integration, filtering and correlated double sampling. In order to cope with the large input dynamic range a charge pump scheme implementing a zero-balance measurement method has been introduced. It provides an on chip 3-bit coarse digital conversion of the integrated charge. The residual charge is sampled using correlated double sampling into analog memory and measured with the required resolution. The first 64 channel prototype of the ASIC has been fabricated in TSMC CMOS 0.25 {micro}m technology. In this paper, the ASIC architecture and performances are presented.

  17. Prototype pixel optohybrid for the CMS phase 1 upgraded pixel detector

    NASA Astrophysics Data System (ADS)

    Troska, J.; Detraz, S.; El Nasr-Storey, S. S.; Stejskal, P.; Sigaud, C.; Soos, C.; Vasey, F.

    2012-01-01

    The CMS Pixel detector phase 1 upgrade calls for an optical readout system operating digitally at or above 320 Mb/s. Since the re-use of the existing link components as installed is excluded, we have designed a new Pixel Optohybrid (POH) for use within this system. We report on the design and choice of components as well as their measured performance. In particular, we have studied the impact upon error-free link operation of the way the data are encoded before being transmitted over the link. We have thus demonstrated the feasibility of operating the new POH within the upgraded readout system.

  18. Low-background direct readout array performance

    NASA Technical Reports Server (NTRS)

    Goebel, J. H.; Mckelvey, M. E.; Mccreight, C. R.; Anderson, G. M.

    1986-01-01

    The development and evaluation of an integrated array of antimony-doped silicon detectors is described. The spectral range of extrinsic silicon-integrated arrays useful for low-background IR astronomical applications is extended to about 31 microns with this development. The 58 x 62-element array is accessed by a direct readout multiplexer. The device is evaluated with a flexible microcomputer-based drive and readout electronics system in a low-background test dewar. Acceptance testing indicates single-pixel NEPs in the mid-10 to the -18th W/sq rt Hz range, and good global uniformity statistics.

  19. A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion

    NASA Astrophysics Data System (ADS)

    Ratti, L.; Comotti, D.; Fabris, L.; Grassi, M.; Lodola, L.; Malcovati, P.; Manghisoni, M.; Re, V.; Traversi, G.; Vacchi, C.; Rizzo, G.; Batignani, G.; Bettarini, S.; Casarosa, G.; Forti, F.; Giorgi, M.; Morsani, F.; Paladino, A.; Paoloni, E.; Pancheri, L.; Dalla Betta, G.-F.; Mendicino, R.; Verzellesi, G.; Xu, H.; Benkechkache, M. A.

    2016-09-01

    A readout channel for applications to X-ray diffraction imaging at free electron lasers has been developed in a 65 nm CMOS technology. The analog front-end circuit can achieve an input dynamic range of 100 dB by leveraging a novel signal compression technique based on the non-linear features of MOS capacitors. Trapezoidal shaping is accomplished through a transconductor and a switched capacitor circuit, performing gated integration and correlated double sampling. A small area, low power 10 bit successive approximation register (SAR) ADC, operated in a time-interleaved fashion, is used for numerical conversion of the amplitude measurement. Operation at 5 MHz of the analog channel including the shaper was demonstrated. Also, the channel was found to be compliant with single 1 keV photon resolution at 1.25 MHz. The ADC provides a signal-to-noise ratio (SNR) of 56 dB, corresponding to an equivalent number of bits (ENOB) of 9 bits, and a differential non linearity DNL < 1 LSB at a sampling rate slightly larger than 1.8 MHz.

  20. Proceedings of PIXEL98 -- International pixel detector workshop

    SciTech Connect

    Anderson, D.F.; Kwan, S.

    1998-08-01

    Experiments around the globe face new challenges of more precision in the face of higher interaction rates, greater track densities, and higher radiation doses, as they look for rarer and rarer processes, leading many to incorporate pixelated solid-state detectors into their plans. The highest-readout rate devices require new technologies for implementation. This workshop reviewed recent, significant progress in meeting these technical challenges. Participants presented many new results; many of them from the weeks--even days--just before the workshop. Brand new at this workshop were results on cryogenic operation of radiation-damaged silicon detectors (dubbed the Lazarus effect). Other new work included a diamond sensor with 280-micron collection distance; new results on breakdown in p-type silicon detectors; testing of the latest versions of read-out chip and interconnection designs; and the radiation hardness of deep-submicron processes.

  1. Pixel multichip module development at Fermilab

    SciTech Connect

    Turqueti, M A; Cardoso, G; Andresen, J; Appel, J A; Christian, D C; Kwan, S W; Prosser, A; Uplegger, L

    2005-10-01

    At Fermilab, there is an ongoing pixel detector R&D effort for High Energy Physics with the objective of developing high performance vertex detectors suitable for the next generation of HEP experiments. The pixel module presented here is a direct result of work undertaken for the canceled BTeV experiment. It is a very mature piece of hardware, having many characteristics of high performance, low mass and radiation hardness driven by the requirements of the BTeV experiment. The detector presented in this paper consists of three basic devices; the readout integrated circuit (IC) FPIX2A [2][5], the pixel sensor (TESLA p-spray) [6] and the high density interconnect (HDI) flex circuit [1][3] that is capable of supporting eight readout ICs. The characterization of the pixel multichip module prototype as well as the baseline design of the eight chip pixel module and its capabilities are presented. These prototypes were characterized for threshold and noise dispersion. The bump-bonds of the pixel module were examined using an X-ray inspection system. Furthermore, the connectivity of the bump-bonds was tested using a radioactive source ({sup 90}Sr), while the absolute calibration of the modules was achieved using an X-ray source. This paper provides a view of the integration of the three components that together comprise the pixel multichip module.

  2. COLIBRI: partial camera readout and sliding trigger for the Cherenkov Telescope Array CTA

    NASA Astrophysics Data System (ADS)

    Naumann, C. L.; Tejedor, L. A.; Martínez, G.

    2013-06-01

    Plans for the future Cherenkov telescope array CTA include replacing the monolithic camera designs used in H.E.S.S. and MAGIC-I by one that is built up from a number of identical segments. These so-called clusters will be relatively autonomous, each containing its own triggering and readout hardware. While this choice was made for reasons of flexibility and ease of manufacture and maintenance, such a concept with semi-independent sub-units lends itself quite naturally to the possibility of new, and more flexible, readout modes. In all previously-used concepts, triggering and readout of the camera is centralised, with a single camera trigger per event that starts the readout of all pixels in the camera at the same time and within the same integration time window. The limitations of such a trigger system can reduce the performance of a large array such as CTA, due to the huge amount of useless data created by night-sky background if trigger thresholds are set low enough to achieve the desired 20 GeV energy threshold, and to image losses at high energies due to the rigid readout window. In this study, an alternative concept (``COLIBRI'' = Concept for an Optimised Local Image Building and Readout Infrastructure) is presented, where only those parts of the camera which are likely to actually contain image data (usually a small percentage of the total pixels) are read out. This leads to a significant reduction of the expected data rate and the dead-times incurred in the camera. Furthermore, the quasi-independence of the individual clusters can be used to read different parts of the camera at slightly different times, thus allowing the readout to follow the slow development of the shower image across the camera field of view. This concept of flexible, partial camera readout is presented in the following, together with a description of Monte-Carlo studies performed to evaluate its performance as well as a hardware implementation proposed for CTA.

  3. Optical links for the ATLAS Pixel Detector

    NASA Astrophysics Data System (ADS)

    Stucci, Stefania

    2016-07-01

    With the expected increase in the instantaneous luminosity of the LHC in the next few years, the off-detector optical read-out system of the outer two layers of the Pixel Detector of the ATLAS experiment will reach its bandwidth limits. The bandwidth will be increased with new optical receivers, which had to be redesigned since commercial solutions could not be used. The new design allows for a wider operational range in terms of data frequency and input optical power to match the on-detector transmitters of the present Pixel Detector. We report on the design and testing of prototypes of these components and the plans for the installation in the Pixel Detector read-out chain in 2015.

  4. Development of pixel detectors for SSC vertex tracking

    SciTech Connect

    Kramer, G. . Electro-Optical and Data Systems Group); Atlas, E.L.; Augustine, F.; Barken, O.; Collins, T.; Marking, W.L.; Worley, S.; Yacoub, G.Y. ) Shapiro, S.L. ); Arens, J.F.; Jernigan, J.G. . Space Sciences Lab.); Nygren,

    1991-04-01

    A description of hybrid PIN diode arrays and a readout architecture for their use as a vertex detector in the SSC environment is presented. Test results obtained with arrays having 256 {times} 256 pixels, each 30 {mu}m square, are also presented. The development of a custom readout for the SSC will be discussed, which supports a mechanism for time stamping hit pixels, storing their xy coordinates, and storing the analog information within the pixel. The peripheral logic located on the array, permits the selection of those pixels containing interesting data and their coordinates to be selectively read out. This same logic also resolves ambiguous pixel ghost locations and controls the pixel neighbor read out necessary to achieve high spatial resolution. The thermal design of the vertex tracker and the proposed signal processing architecture will also be discussed. 5 refs., 13 figs., 3 tabs.

  5. Pixel detectors in 3D technologies for high energy physics

    SciTech Connect

    Deptuch, G.; Demarteau, M.; Hoff, J.; Lipton, R.; Shenai, A.; Yarema, R.; Zimmerman, T.; /Fermilab

    2010-10-01

    This paper reports on the current status of the development of International Linear Collider vertex detector pixel readout chips based on multi-tier vertically integrated electronics. Initial testing results of the VIP2a prototype are presented. The chip is the second embodiment of the prototype data-pushed readout concept developed at Fermilab. The device was fabricated in the MIT-LL 0.15 {micro}m fully depleted SOI process. The prototype is a three-tier design, featuring 30 x 30 {micro}m{sup 2} pixels, laid out in an array of 48 x 48 pixels.

  6. High-voltage pixel sensors for ATLAS upgrade

    NASA Astrophysics Data System (ADS)

    Perić, I.; Kreidl, C.; Fischer, P.; Bompard, F.; Breugnon, P.; Clemens, J.-C.; Fougeron, D.; Liu, J.; Pangaud, P.; Rozanov, A.; Barbero, M.; Feigl, S.; Capeans, M.; Ferrere, D.; Pernegger, H.; Ristic, B.; Muenstermann, D.; Gonzalez Sevilla, S.; La Rosa, A.; Miucci, A.; Nessi, M.; Iacobucci, G.; Backhaus, M.; Hügging, Fabian; Krüger, H.; Hemperek, T.; Obermann, T.; Wermes, N.; Garcia-Sciveres, M.; Quadt, A.; Weingarten, J.; George, M.; Grosse-Knetter, J.; Rieger, J.; Bates, R.; Blue, A.; Buttar, C.; Hynds, D.

    2014-11-01

    The high-voltage (HV-) CMOS pixel sensors offer several good properties: a fast charge collection by drift, the possibility to implement relatively complex CMOS in-pixel electronics and the compatibility with commercial processes. The sensor element is a deep n-well diode in a p-type substrate. The n-well contains CMOS pixel electronics. The main charge collection mechanism is drift in a shallow, high field region, which leads to a fast charge collection and a high radiation tolerance. We are currently evaluating the use of the high-voltage detectors implemented in 180 nm HV-CMOS technology for the high-luminosity ATLAS upgrade. Our approach is replacing the existing pixel and strip sensors with the CMOS sensors while keeping the presently used readout ASICs. By intelligence we mean the ability of the sensor to recognize a particle hit and generate the address information. In this way we could benefit from the advantages of the HV sensor technology such as lower cost, lower mass, lower operating voltage, smaller pitch, smaller clusters at high incidence angles. Additionally we expect to achieve a radiation hardness necessary for ATLAS upgrade. In order to test the concept, we have designed two HV-CMOS prototypes that can be readout in two ways: using pixel and strip readout chips. In the case of the pixel readout, the connection between HV-CMOS sensor and the readout ASIC can be established capacitively.

  7. SNO+ Readout Electronics Upgrades

    NASA Astrophysics Data System (ADS)

    Bonventre, Richard; Shokair, Timothy; Knapik, Robert

    2012-03-01

    The SNO+ experiment is designed to explore several topics in neutrino physics including neutrinoless double beta decay, reactor antineutrinos, and low energy solar neutrinos. SNO+ uses the existing Sudbury Neutrino Observatory (SNO) detector, with the heavy water target replaced with liquid scintillator. The new target requires an upgrade to the command and control electronics to handle the higher rates expected with scintillation light as compared to Cherenkov light. The readout electronics have been upgraded to autonomously push data to a central data acquisition computer over ethernet from each of the 19 front end crates. The autonomous readout is achieved with a field programmable gate array (FPGA) with an embedded processor. Inside the FPGA fabric a state machine is configured to pull data across the VME-like bus of each crate. A small C program, making use of the open source Light Weight IP (LWIP) libraries, is run directly on the hardware (with no operating system) to push the data via TCP/IP. The hybrid combination of `high-level' C code and a `low-level' VHDL state machine is a cost effective and flexible solution for reading out individual front end crates.

  8. Characterization of a three side abuttable CMOS pixel sensor with digital pixel and data compression for charged particle tracking

    NASA Astrophysics Data System (ADS)

    Guilloux, F.; Değerli, Y.; Flouzat, C.; Lachkar, M.; Monmarthe, E.; Orsini, F.; Venault, P.

    2016-02-01

    CMOS monolithic pixel sensor technology has been chosen to equip the new ALICE trackers for HL-LHC . PIXAM is the final prototype from an R&D program specific to the Muon Forward Tracker which intends to push significantly forward the performances of the mature rolling shutter architecture. By implementing a digital pixel allowing to readout of a group of rows in parallel, the PIXAM sensor increases the rolling shutter readout speed while keeping the same power consumption as that of analogue pixel sensors. This paper will describe shortly the ASIC architecture and will focus on the analogue and digital performances of the sensor, obtained from laboratory measurements.

  9. X-ray characterization of a multichannel smart-pixel array detector.

    PubMed

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 × 48 pixels, each 130 µm × 130 µm × 520 µm thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements. PMID:26698064

  10. X-ray Characterization of a Multichannel Smart-Pixel Array Detector

    SciTech Connect

    Ross, Steve; Haji-Sheikh, Michael; Huntington, Andrew; Kline, David; Lee, Adam; Li, Yuelin; Rhee, Jehyuk; Tarpley, Mary; Walko, Donald A.; Westberg, Gregg; Williams, George; Zou, Haifeng; Landahl, Eric

    2016-01-01

    The Voxtel VX-798 is a prototype X-ray pixel array detector (PAD) featuring a silicon sensor photodiode array of 48 x 48 pixels, each 130 mu m x 130 mu m x 520 mu m thick, coupled to a CMOS readout application specific integrated circuit (ASIC). The first synchrotron X-ray characterization of this detector is presented, and its ability to selectively count individual X-rays within two independent arrival time windows, a programmable energy range, and localized to a single pixel is demonstrated. During our first trial run at Argonne National Laboratory's Advance Photon Source, the detector achieved a 60 ns gating time and 700 eV full width at half-maximum energy resolution in agreement with design parameters. Each pixel of the PAD holds two independent digital counters, and the discriminator for X-ray energy features both an upper and lower threshold to window the energy of interest discarding unwanted background. This smart-pixel technology allows energy and time resolution to be set and optimized in software. It is found that the detector linearity follows an isolated dead-time model, implying that megahertz count rates should be possible in each pixel. Measurement of the line and point spread functions showed negligible spatial blurring. When combined with the timing structure of the synchrotron storage ring, it is demonstrated that the area detector can perform both picosecond time-resolved X-ray diffraction and fluorescence spectroscopy measurements.

  11. Study on 512×128 pixels InGaAs near infrared focal plane arrays

    NASA Astrophysics Data System (ADS)

    Li, Xue; Tang, Hengjing; Huang, Songlei; Shao, Xiumei; Li, Tao; Huang, Zhangcheng; Gong, Haimei

    2014-10-01

    It is well known that In0.53Ga0.47As epitaxial material is lattice-matched to InP substrate corresponding to the wavelength from 0.9μm to 1.7μm, which results to high quality material and good device characteristics at room temperature. In order to develop the near infrared multi-spectral imaging, 512×128 pixels InGaAs Near Infrared Focal Plane Arrays (FPAs) were studied. The n-InP/i-InGaAs/n-InP double hereto-structure epitaxial material was grown by MBE. The 512×128 back-illuminated planar InGaAs detector arrays were fabricated, including the improvement of passivation film, by grooving the diffusion masking layer, the P type electrode layer, In bump condition and so on. The photo-sensitive region has the diffusion area of 23×23μm2 and pixel pitch of 30×30μm2 . The 512×128 detector arrays were individually hybridized on readout integrated circuit(ROIC) by Indium bump based on flip-chip process to make focal plane arrays (FPAs). The ROIC is based on a capacitive trans-impedance amplifier with correlated double sampling and integrated while readout (IWR) mode with high readout velocity of every pixel resulting in low readout noise and high frame frequency. The average peak detectivity and the response non-uniformity of the FPAs are 1.63×1012 cmHz1/2/W and 5.9%, respectively. The power dissipation and frame frequency of the FPAs are about 180mW and 400Hz, respectively.

  12. Commissioning of the CMS Forward Pixel Detector

    SciTech Connect

    Kumar, Ashish; /SUNY, Buffalo

    2008-12-01

    The Compact Muon Solenoid (CMS) experiment is scheduled for physics data taking in summer 2009 after the commissioning of high energy proton-proton collisions at Large Hadron Collider (LHC). At the core of the CMS all-silicon tracker is the silicon pixel detector, comprising three barrel layers and two pixel disks in the forward and backward regions, accounting for a total of 66 million channels. The pixel detector will provide high-resolution, 3D tracking points, essential for pattern recognition and precise vertexing, while being embedded in a hostile radiation environment. The end disks of the pixel detector, known as the Forward Pixel detector, has been assembled and tested at Fermilab, USA. It has 18 million pixel cells with dimension 100 x 150 {micro}m{sup 2}. The complete forward pixel detector was shipped to CERN in December 2007, where it underwent extensive system tests for commissioning prior to the installation. The pixel system was put in its final place inside the CMS following the installation and bake out of the LHC beam pipe in July 2008. It has been integrated with other sub-detectors in the readout since September 2008 and participated in the cosmic data taking. This report covers the strategy and results from commissioning of CMS forward pixel detector at CERN.

  13. Design and characterization of high precision in-pixel discriminators for rolling shutter CMOS pixel sensors with full CMOS capability

    NASA Astrophysics Data System (ADS)

    Fu, Y.; Hu-Guo, C.; Dorokhov, A.; Pham, H.; Hu, Y.

    2013-07-01

    In order to exploit the ability to integrate a charge collecting electrode with analog and digital processing circuitry down to the pixel level, a new type of CMOS pixel sensors with full CMOS capability is presented in this paper. The pixel array is read out based on a column-parallel read-out architecture, where each pixel incorporates a diode, a preamplifier with a double sampling circuitry and a discriminator to completely eliminate analog read-out bottlenecks. The sensor featuring a pixel array of 8 rows and 32 columns with a pixel pitch of 80 μm×16 μm was fabricated in a 0.18 μm CMOS process. The behavior of each pixel-level discriminator isolated from the diode and the preamplifier was studied. The experimental results indicate that all in-pixel discriminators which are fully operational can provide significant improvements in the read-out speed and the power consumption of CMOS pixel sensors.

  14. A new 9T global shutter pixel with CDS technique

    NASA Astrophysics Data System (ADS)

    Liu, Yang; Ma, Cheng; Zhou, Quan; Wang, Xinyang

    2015-04-01

    Benefiting from motion blur free, Global shutter pixel is very widely used in the design of CMOS image sensors for high speed applications such as motion vision, scientifically inspection, etc. In global shutter sensors, all pixel signal information needs to be stored in the pixel first and then waiting for readout. For higher frame rate, we need very fast operation of the pixel array. There are basically two ways for the in pixel signal storage, one is in charge domain, such as the one shown in [1], this needs complicated process during the pixel fabrication. The other one is in voltage domain, one example is the one in [2], this pixel is based on the 4T PPD technology and normally the driving of the high capacitive transfer gate limits the speed of the array operation. In this paper we report a new 9T global shutter pixel based on 3-T partially pinned photodiode (PPPD) technology. It incorporates three in-pixel storage capacitors allowing for correlated double sampling (CDS) and pipeline operation of the array (pixel exposure during the readout of the array). Only two control pulses are needed for all the pixels at the end of exposure which allows high speed exposure control.

  15. Status of the CMS Phase I pixel detector upgrade

    NASA Astrophysics Data System (ADS)

    Spannagel, S.

    2016-09-01

    A new pixel detector for the CMS experiment is being built, owing to the instantaneous luminosities anticipated for the Phase I Upgrade of the LHC. The new CMS pixel detector provides four-hit tracking while featuring a significantly reduced material budget as well as new cooling and powering schemes. A new front-end readout chip mitigates buffering and bandwidth limitations, and comprises a low-threshold comparator. These improvements allow the new pixel detector to sustain and improve the efficiency of the current pixel tracker at the increased requirements imposed by high luminosities and pile-up. This contribution gives an overview of the design of the upgraded pixel detector and the status of the upgrade project, and presents test beam performance measurements of the production read-out chip.

  16. Single photon counting pixel detectors for synchrotron radiation experiments

    NASA Astrophysics Data System (ADS)

    Toyokawa, H.; Broennimann, Ch.; Eikenberry, E. F.; Henrich, B.; Kawase, M.; Kobas, M.; Kraft, P.; Sato, M.; Schmitt, B.; Suzuki, M.; Tanida, H.; Uruga, T.

    2010-11-01

    At the Paul Scherrer Institute PSI an X-ray single photon counting pixel detector (PILATUS) based on the hybrid-pixel detector technology was developed in collaboration with SPring-8. The detection element is a 320 or 450 μm thick silicon sensor forming pixelated pn-diodes with a pitch of 172 μm×172 μm. An array of 2×8 custom CMOS readout chips are indium bump-bonded to the sensor, which leads to 33.5 mm×83.8 mm detective area. Each pixel contains a charge-sensitive amplifier, a single level discriminator and a 20 bit counter. This design realizes a high dynamic range, short readout time of less than 3 ms, a high framing rate of over 200 images per second and an excellent point-spread function. The maximum counting rate achieves more than 2×10 6 X-rays/s/pixel.

  17. Active pixel sensor pixel having a photodetector whose output is coupled to an output transistor gate

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Nakamura, Junichi (Inventor); Kemeny, Sabrina E. (Inventor)

    2005-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node. There is also a readout circuit, part of which can be disposed at the bottom of each column of cells and be common to all the cells in the column. A Simple Floating Gate (SFG) pixel structure could also be employed in the imager to provide a non-destructive readout and smaller pixel sizes.

  18. Massively Parallel Atomic Force Microscope with Digital Holographic Readout

    NASA Astrophysics Data System (ADS)

    Sache, L.; Kawakatsu, H.; Emery, Y.; Bleuler, H.

    2007-03-01

    Massively Parallel Scanning Probe Microscopy is an obvious path for data storage (E Grochowski, R F Hoyt, Future Trends in Hard disc Drives, IEEE Trans. Magn. 1996, 32, 1850- 1854; J L Griffin, S W Schlosser, G R Ganger and D F Nagle, Modeling and Performance of MEMS-Based Storage Devices, Proc. ACM SIGMETRICS, 2000). Current experimental systems still lay far behind Hard Disc Drive (HDD) or Digital Video Disk (DVD), be it in access speed, data throughput, storage density or cost per bit. This paper presents an entirely new approach with the promise to break several of these barriers. The key idea is readout of a Scanning Probes Microscope (SPM) array by Digital Holographic Microscopy (DHM). This technology directly gives phase information at each pixel of a CCD array. This means that no contact line to each individual SPM probes is needed. The data is directly available in parallel form. Moreover, the optical setup needs in principle no expensive components, optical (or, to a large extent, mechanical) imperfections being compensated in the signal processing, i.e. in electronics. This gives the system the potential for a low cost device with fast Terabit readout capability.

  19. Development of CMOS Pixel Sensors with digital pixel dedicated to future particle physics experiments

    NASA Astrophysics Data System (ADS)

    Zhao, W.; Wang, T.; Pham, H.; Hu-Guo, C.; Dorokhov, A.; Hu, Y.

    2014-02-01

    Two prototypes of CMOS pixel sensor with in-pixel analog to digital conversion have been developed in a 0.18 μm CIS process. The first design integrates a discriminator into each pixel within an area of 22 × 33 μm2 in order to meet the requirements of the ALICE inner tracking system (ALICE-ITS) upgrade. The second design features 3-bit charge encoding inside a 35 × 35 μm2 pixel which is motivated by the specifications of the outer layers of the ILD vertex detector (ILD-VXD). This work aims to validate the concept of in-pixel digitization which offers higher readout speed, lower power consumption and less dead zone compared with the column-level charge encoding.

  20. Counting x-ray line detector with monolithically integrated readout circuits

    NASA Astrophysics Data System (ADS)

    Lohse, T.; Krüger, P.; Heuer, H.; Oppermann, M.; Torlee, H.; Meyendorf, N.

    2013-05-01

    The developed direct converting X-ray line detectors offer a number of advantages in comparison to other X-ray sensor concepts. Direct converting X-ray detectors are based on absorption of X-rays in semiconductor material, which leads to a generation of charge carriers. By applying high bias voltage charge carriers can be separated and with this the arising current pulse can be assessed by suitable readout integrated circuits (ICs) subsequently. The X-ray absorber itself is implemented as a diode based on GaAs to use it in the reverse direction. It exhibits low dark currents and can therefore be used at room temperatures. The GaAs absorber has a structured top electrode designed on variable bonding and high breakdown voltages. The implemented GaAs absorber exhibits a pixel size of 100 μm while the readout IC features fast dead-time-free readout, energy discrimination by two individually adjustable thresholds with 20 bit deep counters and radiation-hard design on chip level. These properties guarantee the application as fast and thus sensitive line detector for imaging processes. Another advantage of the imaging line detector is the cascadability of several sensor modules with 1024 pixels each. This property ensures that the 102.4 mm long sensor modules can be concatenated virtually with arbitrary length gaplessly. The readout ICs hitting radiation dose can be further minimized by implementing constructive steps to ensure longer lifetime of the sensor module. Furthermore, first results using the introduced sensor module for solid state X-ray detection are discussed.

  1. Pixel Perfect

    SciTech Connect

    Perrine, Kenneth A.; Hopkins, Derek F.; Lamarche, Brian L.; Sowa, Marianne B.

    2005-09-01

    cubic warp. During image acquisitions, the cubic warp is evaluated by way of forward differencing. Unwanted pixelation artifacts are minimized by bilinear sampling. The resulting system is state-of-the-art for biological imaging. Precisely registered images enable the reliable use of FRET techniques. In addition, real-time image processing performance allows computed images to be fed back and displayed to scientists immediately, and the pipelined nature of the FPGA allows additional image processing algorithms to be incorporated into the system without slowing throughput.

  2. Development of silicon micropattern pixel detectors

    NASA Astrophysics Data System (ADS)

    Heijne, E. H. M.; Antinori, F.; Beker, H.; Batignani, G.; Beusch, W.; Bonvicini, V.; Bosisio, L.; Boutonnet, C.; Burger, P.; Campbell, M.; Cantoni, P.; Catanesi, M. G.; Chesi, E.; Claeys, C.; Clemens, J. C.; Cohen Solal, M.; Darbo, G.; Da Via, C.; Debusschere, I.; Delpierre, P.; Di Bari, D.; Di Liberto, S.; Dierickx, B.; Enz, C. C.; Focardi, E.; Forti, F.; Gally, Y.; Glaser, M.; Gys, T.; Habrard, M. C.; Hallewell, G.; Hermans, L.; Heuser, J.; Hurst, R.; Inzani, P.; Jæger, J. J.; Jarron, P.; Karttaavi, T.; Kersten, S.; Krummenacher, F.; Leitner, R.; Lemeilleur, F.; Lenti, V.; Letheren, M.; Lokajicek, M.; Loukas, D.; Macdermott, M.; Maggi, G.; Manzari, V.; Martinengo, P.; Meddeler, G.; Meddi, F.; Mekkaoui, A.; Menetrey, A.; Middelkamp, P.; Morando, M.; Munns, A.; Musico, P.; Nava, P.; Navach, F.; Neyer, C.; Pellegrini, F.; Pengg, F.; Perego, R.; Pindo, M.; Pospisil, S.; Potheau, R.; Quercigh, E.; Redaelli, N.; Ridky, J.; Rossi, L.; Sauvage, D.; Segato, G.; Simone, S.; Sopko, B.; Stefanini, G.; Strakos, V.; Tempesta, P.; Tonelli, G.; Vegni, G.; Verweij, H.; Viertel, G. M.; Vrba, V.; Waisbard, J.; CERN RD19 Collaboration

    1994-09-01

    Successive versions of high speed, active silicon pixel detectors with integrated readout electronics have been developed for particle physics experiments using monolithic and hybrid technologies. Various matrices with binary output as well as a linear detector with analog output have been made. The hybrid binary matrix with 1024 cells (dimension 75 μm×500 μm) can capture events at ˜5 MHz and a selected event can then be read out in < 10 μs. In different beam tests at CERN a precision of 25 μm has been achieved and the efficiency was better than 99.2%. Detector thicknesses of 300 μm and 150 μm of silicon have been used. In a test with a 109Cd source a noise level of 170 e - r.m.s. (1.4 keV fwhm) has been measured with a threshold non-uniformity of 750 e - r.m.s. Objectives of the development work are the increase of the size of detecting area without loss of efficiency, the design of an appropriate readout architecture for collider operation, the reduction of material thickness in the detector, understanding of the threshold non-uniformity, study of the sensitivity of the pixel matrices to light and low energy electrons for scintillating fiber detector readout and last but not least, the optimization of cost and yield of the pixel detectors in production.

  3. Back-Side Readout Silicon Photomultiplier

    PubMed Central

    Choong, Woon-Seng; Holland, Stephen E.

    2012-01-01

    We present a novel structure for the back-side readout silicon photomultipler (SiPM). Current SiPMs are front-illuminated structures with front-side readout, which have relatively small geometric fill factor leading to degradation in their photon detection efficiency (PDE). Back-side readout devices will provide an advantageous solution to achieve high PDE. We designed and investigated a novel structure that would allow back-side readout while creating a region of high electric field optimized for avalanche breakdown. In addition, this structure has relatively high fill factor and also allow direct coupling of individual micro-cell of the SiPM to application-specific integrated circuits. We will discuss the performance that can be attained with this structure through device simulation and the process flow that can be used to fabricate this structure through process simulation. PMID:23564969

  4. Pixel multichip module design for a high energy physics experiment

    SciTech Connect

    Guilherme Cardoso et al.

    2003-11-05

    At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

  5. Development of a high density pixel multichip module at Fermilab

    SciTech Connect

    Sergio Zimmermann et al.

    2001-09-11

    At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

  6. VeloPix: the pixel ASIC for the LHCb upgrade

    NASA Astrophysics Data System (ADS)

    Poikela, T.; De Gaspari, M.; Plosila, J.; Westerlund, T.; Ballabriga, R.; Buytaert, J.; Campbell, M.; Llopart, X.; Wyllie, K.; Gromov, V.; van Beuzekom, M.; Zivkovic, V.

    2015-01-01

    The LHCb Vertex Detector (VELO) will be upgraded in 2018 along with the other subsystems of LHCb in order to enable full readout at 40 MHz, with the data fed directly to the software triggering algorithms. The upgraded VELO is a lightweight hybrid pixel detector operating in vacuum in close proximity to the LHC beams. The readout will be provided by a dedicated front-end ASIC, dubbed VeloPix, matched to the LHCb readout requirements and the 55 × 55 μm VELO pixel dimensions. The chip is closely related to the Timepix3, from the Medipix family of ASICs. The principal challenge that the chip has to meet is a hit rate of up to 900 Mhits/s, resulting in a required output bandwidth of more than 16 Gbit/s. The occupancy across the chip is also very non-uniform, and the radiation levels reach an integrated 400 Mrad over the lifetime of the detector.VeloPix is a binary pixel readout chip with a data driven readout, designed in 130 nm CMOS technology. The pixels are combined into groups of 2 × 4 super pixels, enabling a shared logic and a reduction of bandwidth due to combined address and time stamp information. The pixel hits are combined with other simultaneous hits in the same super pixel, time stamped, and immediately driven off-chip. The analog front-end must be sufficiently fast to accurately time stamp the data, with a small enough dead time to minimize data loss in the most occupied regions of the chip. The data is driven off chip with a custom designed high speed serialiser. The current status of the ASIC design, the chip architecture and the simulations will be described.

  7. A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels

    NASA Astrophysics Data System (ADS)

    Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M. O.; Fritzsch, T.; Rothermund, M.; Graafsma, H.

    2014-12-01

    Hybrid pixel semiconductor detectors provide high performance through a combination of direct detection, a relatively small pixel size, fast readout and sophisticated signal processing circuitry in each pixel. For X-ray detection above 20 keV, high-Z sensor layers rather than silicon are needed to achieve high quantum efficiency, but many high-Z materials such as GaAs and CdTe often suffer from poor material properties or nonuniformities. Germanium is available in large wafers of extremely high quality, making it an appealing option for high-performance hybrid pixel X-ray detectors, but suitable technologies for finely pixelating and bump-bonding germanium have not previously been available. A finely-pixelated germanium photodiode sensor with a 256 by 256 array of 55μm pixels has been produced. The sensor has an n-on-p structure, with 700μm thickness. Using a low-temperature indium bump process, this sensor has been bonded to the Medipix3RX photoncounting readout chip. Tests with the LAMBDA readout system have shown that the detector works successfully, with a high bond yield and higher image uniformity than comparable high-Z systems. During cooling, the system is functional around -80°C (with warmer temperatures resulting in excessive leakage current), with -100°C sufficient for good performance.

  8. Digital radiography using amorphous selenium: photoconductively activated switch (PAS) readout system.

    PubMed

    Reznik, Nikita; Komljenovic, Philip T; Germann, Stephen; Rowlands, John A

    2008-03-01

    A new amorphous selenium (a-Se) digital radiography detector is introduced. The proposed detector generates a charge image in the a-Se layer in a conventional manner, which is stored on electrode pixels at the surface of the a-Se layer. A novel method, called photoconductively activated switch (PAS), is used to read out the latent x-ray charge image. The PAS readout method uses lateral photoconduction at the a-Se surface which is a revolutionary modification of the bulk photoinduced discharge (PID) methods. The PAS method addresses and eliminates the fundamental weaknesses of the PID methods--long readout times and high readout noise--while maintaining the structural simplicity and high resolution for which PID optical readout systems are noted. The photoconduction properties of the a-Se surface were investigated and the geometrical design for the electrode pixels for a PAS radiography system was determined. This design was implemented in a single pixel PAS evaluation system. The results show that the PAS x-ray induced output charge signal was reproducible and depended linearly on the x-ray exposure in the diagnostic exposure range. Furthermore, the readout was reasonably rapid (10 ms for pixel discharge). The proposed detector allows readout of half a pixel row at a time (odd pixels followed by even pixels), thus permitting the readout of a complete image in 30 s for a 40 cm x 40 cm detector with the potential of reducing that time by using greater readout light intensity. This demonstrates that a-Se based x-ray detectors using photoconductively activated switches could form a basis for a practical integrated digital radiography system. PMID:18404939

  9. Evaluation of a photon-counting hybrid pixel detector array with a synchrotron X-ray source

    NASA Astrophysics Data System (ADS)

    Ponchut, C.; Visschers, J. L.; Fornaini, A.; Graafsma, H.; Maiorino, M.; Mettivier, G.; Calvet, D.

    2002-05-01

    A photon-counting hybrid pixel detector (Medipix-1) has been characterized using a synchrotron X-ray source. The detector consists of a readout ASIC with 64×64 independent photon-counting cells of 170×170 μm 2 pitch, bump-bonded to a 300 μm thick silicon sensor, read out by a PCIbus-based electronics, and a graphical user interface (GUI) software. The intensity and the energy tunability of the X-ray source allow characterization of the detector in the time, space, and energy domains. The system can be read out on external trigger at a frame rate of 100 Hz with 3 ms exposure time per frame. The detector response is tested up to more than 7×10 5 detected events/pixel/s. The point-spread response shows <2% crosstalk between neighboring pixels. Fine scanning of the detector surface with a 10 μm beam reveals no loss in sensitivity between adjacent pixels as could result from charge sharing in the silicon sensor. Photons down to 6 keV can be detected after equalization of the thresholds of individual pixels. The obtained results demonstrate the advantages of photon-counting hybrid pixel detectors and particularly of the Medipix-1 chip for a wide range of X-ray imaging applications, including those using synchrotron X-ray beams.

  10. The fine grained detector readout electronics

    NASA Astrophysics Data System (ADS)

    Retière, F.; T2K/FGD Collaboration

    2010-11-01

    The Fine Grained Detector (FGD) readout electronics was designed to record a snapshot of the detector activity before, during and after the neutrino beam spill produced by the J-PARC accelerator complex in Tokai, Japan. The FGD is a key element of T2K near detector currently being constructed. It will act as an active target detecting charged particles produced within its scintillator bars. The original feature of the FGD electronics is to readout Multi-Pixel Photon Counters by recording waveforms using Switch Capacitor Array chips (AFTER ASIC) designed for T2K Time Projection Chamber. In these proceedings, we describe the architecture of the FGD electronics. Beam results show that the physics requirements are met or exceeded. The relatively slow sampling frequency of the AFTER ASIC does not impair the timing resolution significantly. In addition, the very good efficiency of the system for detecting Michel electrons produced by pions or muons decay has been demonstrated.

  11. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2004-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  12. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    2003-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  13. Active pixel sensor with intra-pixel charge transfer

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra (Inventor); Kemeny, Sabrina E. (Inventor)

    1995-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node.

  14. Single-Readout High-Density Memristor Crossbar

    NASA Astrophysics Data System (ADS)

    Zidan, M. A.; Omran, H.; Naous, R.; Sultan, A.; Fahmy, H. A. H.; Lu, W. D.; Salama, K. N.

    2016-01-01

    High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques.

  15. Single-Readout High-Density Memristor Crossbar

    PubMed Central

    Zidan, M. A.; Omran, H.; Naous, R.; Sultan, A.; Fahmy, H. A. H.; Lu, W. D.; Salama, K. N.

    2016-01-01

    High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques. PMID:26738564

  16. Single-Readout High-Density Memristor Crossbar.

    PubMed

    Zidan, M A; Omran, H; Naous, R; Sultan, A; Fahmy, H A H; Lu, W D; Salama, K N

    2016-01-07

    High-density memristor-crossbar architecture is a very promising technology for future computing systems. The simplicity of the gateless-crossbar structure is both its principal advantage and the source of undesired sneak-paths of current. This parasitic current could consume an enormous amount of energy and ruin the readout process. We introduce new adaptive-threshold readout techniques that utilize the locality and hierarchy properties of the computer-memory system to address the sneak-paths problem. The proposed methods require a single memory access per pixel for an array readout. Besides, the memristive crossbar consumes an order of magnitude less power than state-of-the-art readout techniques.

  17. Design Methodology: ASICs with complex in-pixel processing for Pixel Detectors

    SciTech Connect

    Fahim, Farah

    2014-10-31

    The development of Application Specific Integrated Circuits (ASIC) for pixel detectors with complex in-pixel processing using Computer Aided Design (CAD) tools that are, themselves, mainly developed for the design of conventional digital circuits requires a specialized approach. Mixed signal pixels often require parasitically aware detailed analog front-ends and extremely compact digital back-ends with more than 1000 transistors in small areas below 100μm x 100μm. These pixels are tiled to create large arrays, which have the same clock distribution and data readout speed constraints as in, for example, micro-processors. The methodology uses a modified mixed-mode on-top digital implementation flow to not only harness the tool efficiency for timing and floor-planning but also to maintain designer control over compact parasitically aware layout.

  18. Power Studies for the CMS Pixel Tracker

    SciTech Connect

    Todri, A.; Turqueti, M.; Rivera, R.; Kwan, S.; /Fermilab

    2009-01-01

    The Electronic Systems Engineering Department of the Computing Division at the Fermi National Accelerator Laboratory is carrying out R&D investigations for the upgrade of the power distribution system of the Compact Muon Solenoid (CMS) Pixel Tracker at the Large Hadron Collider (LHC). Among the goals of this effort is that of analyzing the feasibility of alternative powering schemes for the forward tracker, including DC to DC voltage conversion techniques using commercially available and custom switching regulator circuits. Tests of these approaches are performed using the PSI46 pixel readout chip currently in use at the CMS Tracker. Performance measures of the detector electronics will include pixel noise and threshold dispersion results. Issues related to susceptibility to switching noise will be studied and presented. In this paper, we describe the current power distribution network of the CMS Tracker, study the implications of the proposed upgrade with DC-DC converters powering scheme and perform noise susceptibility analysis.

  19. High-speed optical shutter coupled to fast-readout CCD camera

    NASA Astrophysics Data System (ADS)

    Yates, George J.; Pena, Claudine R.; McDonald, Thomas E., Jr.; Gallegos, Robert A.; Numkena, Dustin M.; Turko, Bojan T.; Ziska, George; Millaud, Jacques E.; Diaz, Rick; Buckley, John; Anthony, Glen; Araki, Takae; Larson, Eric D.

    1999-04-01

    A high frame rate optically shuttered CCD camera for radiometric imaging of transient optical phenomena has been designed and several prototypes fabricated, which are now in evaluation phase. the camera design incorporates stripline geometry image intensifiers for ultra fast image shutters capable of 200ps exposures. The intensifiers are fiber optically coupled to a multiport CCD capable of 75 MHz pixel clocking to achieve 4KHz frame rate for 512 X 512 pixels from simultaneous readout of 16 individual segments of the CCD array. The intensifier, Philips XX1412MH/E03 is generically a Generation II proximity-focused micro channel plate intensifier (MCPII) redesigned for high speed gating by Los Alamos National Laboratory and manufactured by Philips Components. The CCD is a Reticon HSO512 split storage with bi-direcitonal vertical readout architecture. The camera main frame is designed utilizing a multilayer motherboard for transporting CCD video signals and clocks via imbedded stripline buses designed for 100MHz operation. The MCPII gate duration and gain variables are controlled and measured in real time and up-dated for data logging each frame, with 10-bit resolution, selectable either locally or by computer. The camera provides both analog and 10-bit digital video. The camera's architecture, salient design characteristics, and current test data depicting resolution, dynamic range, shutter sequences, and image reconstruction will be presented and discussed.

  20. EXCALIBUR: a small-pixel photon counting area detector for coherent X-ray diffraction - Front-end design, fabrication and characterisation

    NASA Astrophysics Data System (ADS)

    Marchal, J.; Horswell, I.; Willis, B.; Plackett, R.; Gimenez, E. N.; Spiers, J.; Ballard, D.; Booker, P.; Thompson, J. A.; Gibbons, P.; Burge, S. R.; Nicholls, T.; Lipp, J.; Tartoni, N.

    2013-03-01

    Coherent X-ray diffraction experiments on synchrotron X-ray beamlines require detectors with high spatial resolution and large detection area. The read-out chip developed by the MEDIPIX3 collaboration offers a small pixel size of 55 microns resulting in a very high spatial resolution when coupled to a direct X-ray conversion segmented silicon sensor. MEDIPIX3 assemblies present also the advantages of hybrid pixel detectors working in single photon counting mode: noiseless imaging, large dynamic range, extremely high frame rate. The EXCALIBUR detector is under development for the X-ray Coherence and Imaging Beamline I13 of the Diamond Light Source. This new detector consists of three modules, each with 16 MEDIPIX3 chips which can be read-out at 100 frames per second in continuous mode or 1000 frames per second in burst mode. In each module, the sensor is a large single silicon die covering 2 rows of 8 individual MEDIPIX3 read-out chips and provides a continuous active detection region within a module. Each module includes 1 million solder bumps connecting the 55 microns pixels of the silicon sensor to the 55 microns pixels of the 16 MEDIPIX3 read-out chips. The detection area of the 3-module EXCALIBUR detector is 115 mm × 100 mm with a small 6.8 mm wide inactive region between modules. Each detector module is connected to 2 FPGA read-out boards via a flexi-rigid circuit to allow a fully parallel read-out of the 16 MEDIPIX3 chips. The 6 FPGA read-out boards used in the EXCALIBUR detector are interfaced to 6 computing nodes via 10Gbit/s fibre-optic links to maintain the very high frame-rate capability. The standard suite of EPICS control software is used to operate the detector and to integrate it with the Diamond Light Source beamline software environment. This article describes the design, fabrication and characterisation of the MEDIPIX3-based modules composing the EXCALIBUR detector.

  1. Novel integrated CMOS pixel structures for vertex detectors

    SciTech Connect

    Kleinfelder, Stuart; Bieser, Fred; Chen, Yandong; Gareus, Robin; Matis, Howard S.; Oldenburg, Markus; Retiere, Fabrice; Ritter, Hans Georg; Wieman, Howard H.; Yamamoto, Eugene

    2003-10-29

    Novel CMOS active pixel structures for vertex detector applications have been designed and tested. The overriding goal of this work is to increase the signal to noise ratio of the sensors and readout circuits. A large-area native epitaxial silicon photogate was designed with the aim of increasing the charge collected per struck pixel and to reduce charge diffusion to neighboring pixels. The photogate then transfers the charge to a low capacitance readout node to maintain a high charge to voltage conversion gain. Two techniques for noise reduction are also presented. The first is a per-pixel kT/C noise reduction circuit that produces results similar to traditional correlated double sampling (CDS). It has the advantage of requiring only one read, as compared to two for CDS, and no external storage or subtraction is needed. The technique reduced input-referred temporal noise by a factor of 2.5, to 12.8 e{sup -}. Finally, a column-level active reset technique is explored that suppresses kT/C noise during pixel reset. In tests, noise was reduced by a factor of 7.6 times, to an estimated 5.1 e{sup -} input-referred noise. The technique also dramatically reduces fixed pattern (pedestal) noise, by up to a factor of 21 in our tests. The latter feature may possibly reduce pixel-by-pixel pedestal differences to levels low enough to permit sparse data scan without per-pixel offset corrections.

  2. Sensor development for the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Bolla, G.; Bortoletto, D.; Horisberger, R.; Kaufmann, R.; Rohe, T.; Roy, A.

    2002-06-01

    The CMS experiment which is currently under construction at the Large Hadron Collider (LHC) at CERN (Geneva, Switzerland) will contain a pixel detector which provides in its final configuration three space points per track close to the interaction point of the colliding beams. Because of the harsh radiation environment of the LHC, the technical realization of the pixel detector is extremely challenging. The readout chip as the most damageable part of the system is believed to survive a particle fluence of 6×10 14 neq/ cm2 (All fluences are normalized to 1 MeV neutrons and therefore all components of the hybrid pixel detector have to perform well up to at least this fluence. As this requires a partially depleted operation of the silicon sensors after irradiation-induced type inversion of the substrate, an "n in n" concept has been chosen. In order to perform IV-tests on wafer level and to hold accidentally unconnected pixels close to ground potential, a resistive path between the pixels has been implemented by the openings in the p-stop implants surrounding every pixel cell. A prototype of such sensors has been produced by two different companies and especially the properties of these resistors have extensively been tested before and after irradiation.

  3. Development of prototype pixellated PIN CdZnTe detectors

    NASA Astrophysics Data System (ADS)

    Narita, Tomohiko; Bloser, Peter F.; Grindlay, Jonathan E.; Sudharsanan, R.; Reiche, C.; Stenstrom, Claudia

    1998-07-01

    We report initial results from the design and evaluation of two pixellated PIN Cadmium Zinc Telluride detectors and an ASIC-based readout system. The prototype imaging PIN detectors consist of 4 X 4 1.5 mm square indium anode contacts with 0.2 mm spacing and a solid cathode plane on 10 X 10 mm CdZnTe substrates of thickness 2 mm and 5 mm. The detector readout system, based on low noise preamplifier ASICs, allows for parallel readout of all channels upon cathode trigger. This prototype is under development for use in future astrophysical hard X-ray imagers with 10 - 600 keV energy response. Measurements of the detector uniformity, spatial resolution, and spectral resolution will be discussed and compared with a similar pixellated MSM detector. Finally, a prototype design for a large imaging array is outlined.

  4. Novel concept of TDI readout circuit for LWIR detector

    NASA Astrophysics Data System (ADS)

    Kim, Byunghyuck; Yoon, Nanyoung; Lee, Hee Chul; Kim, Choong-Ki

    2000-07-01

    Noise property is the prime consideration in readout circuit design. The output noise caused by the photon noise, which dominates total noise in BLIP detectors, is limited by the integration time that an element looks at a specific point in the scene. Large integration time leads to a low noise performance. Time-delay integration (TDI) is used to effectively increase the integration time and reduce the photon noise. However, it increases the number of dead pixels and requires large integration capacitors and low noise output stage of the readout circuit. In this paper, to solve these problems, we propose a new concept of readout circuit, which performs background suppression, cell-to-cell background current non-uniformity compensation, and dead pixel correction using memory, ADC, DAC, and current copier cell. In simulation results, comparing with the conventional TDI readout circuit, the integration capacitor size can be reduced to 1/5 and trans-impedance gain can be increased by five times. Therefore, the new TDI readout circuit does not require large area and low noise output stage. And the error of skimming current is less than 2%, and the fixed pattern noise induced by cell-to-cell background current variation is reduced to less than 1%.

  5. Design of the small pixel pitch ROIC

    NASA Astrophysics Data System (ADS)

    Liang, Qinghua; Jiang, Dazhao; Chen, Honglei; Zhai, Yongcheng; Gao, Lei; Ding, Ruijun

    2014-11-01

    Since the technology trend of the third generation IRFPA towards resolution enhancing has steadily progressed,the pixel pitch of IRFPA has been greatly reduced.A 640×512 readout integrated circuit(ROIC) of IRFPA with 15μm pixel pitch is presented in this paper.The 15μm pixel pitch ROIC design will face many challenges.As we all known,the integrating capacitor is a key performance parameter when considering pixel area,charge capacity and dynamic range,so we adopt the effective method of 2 by 2 pixels sharing an integrating capacitor to solve this problem.The input unit cell architecture will contain two paralleled sample and hold parts,which not only allow the FPA to be operated in full frame snapshot mode but also save relatively unit circuit area.Different applications need more matching input unit circuits. Because the dimension of 2×2 pixels is 30μm×30μm, an input stage based on direct injection (DI) which has medium injection ratio and small layout area is proved to be suitable for middle wave (MW) while BDI with three-transistor cascode amplifier for long wave(LW). By adopting the 0.35μm 2P4M mixed signal process, the circuit architecture can make the effective charge capacity of 7.8Me- per pixel with 2.2V output range for MW and 7.3 Me- per pixel with 2.6V output range for LW. According to the simulation results, this circuit works well under 5V power supply and achieves less than 0.1% nonlinearity.

  6. Beam test results for the BTeV silicon pixel detector

    SciTech Connect

    Jeffrey A. Appel, G. Chiodini et al.

    2000-09-28

    The authors report the results of the BTeV silicon pixel detector tests carried out in the MTest beam at Fermilab in 1999--2000. The pixel detector spatial resolution has been studied as a function of track inclination, sensor bias, and readout threshold.

  7. FastPixN, a new integrated pixel chip for a future fast version of the IRSN - recoil proton telescope.

    PubMed

    Kachel, M; Husson, D; Higueret, S; Taforeau, J; Lebreton, L

    2014-10-01

    A first prototype of recoil proton telescope (RPT) is currently working at the AMANDE facility, being developed as a collaboration between IPHC Strasbourg and the LNE-IRSN. The device, able to measure both energy and fluence of neutron fields in the range of 5-20 MeV, has to be improved further, in order to reduce the considerable inelastic background generated by the neutrons inside the RPT itself. To achieve faster running cycles, the present complementary metal-oxide-semiconductor pixels used for proton tracking are to be replaced by a new integrated chip, specially developed for this application. The authors present a first version of this new element, with individual pixels readout at a 200-MHz frequency, with a fast 4-bit ADC for each column of 64 pixels. The measured performances point to a complete frame treatment in only 12.6 µs. With a readout speed multiplied by a factor 400 over the existing device, the authors expect a considerable improvement of the telescope at AMANDE, with the potential to reach neutron fluence rates up to 10(7) n cm(-2) s(-1) or more.

  8. Optimizing rejection readouts in a corneal allograft transplantation model

    PubMed Central

    Hildebrand, Antonia; Böhringer, Daniel; Betancor, Paola Kammrath; Schlunck, Günther; Reinhard, Thomas

    2016-01-01

    Purpose To evaluate the feasibility of anterior segment spectral domain optic coherence tomography (ASOCT) as rejection readout in a keratoplasty mouse model and to compare ASOCT against the current standard (i.e., a clinical score system). Furthermore, to compare both approaches with respect to intra- and inter-individual observer variability and to calculate a critical point that distinguishes between rejection and non-rejection in ASOCT analysis. Methods Allogeneic penetrating keratoplasties (PKs) were performed using C3H/He donor mice and BALB/c recipient mice; syngeneic transplantations served as controls using BALB/c donors and recipients. Corneal graft rejection was determined with a clinical score. ASOCT was used to determine the central thickness of the corneal grafts in the same animals. The rejection status was corroborated with histopathological examination. Results The median survival time (MST) of the corneal allografts in the wild-type BALB/c mice was 12 days. Allogeneic transplantation led to a 100% rejection rate, whereas signs of rejection after syngeneic transplantation appeared in up to 20% of the mice. Central corneal thickness (CCT) determination via customized software revealed a direct correlation with the clinical score. Receiver operating curve (ROC) analysis confirmed CCT as a valid surrogate for rejection. Calculation of the area under the curve (AUC) revealed a value of 0.88 with an optimal cut-off at 267 pixels. Conclusions An increase in the CCT during acute allogeneic corneal graft rejection significantly correlated with the clinical surrogate parameter “corneal opacity.” ASOCT not only generates source data, but also analysis of the ASOCT data shows lower readout variability and fewer interpreter variations than the clinical score commonly used to define the time point of graft rejection in mice. PMID:27777504

  9. Progress on the design of a data push architecture for an array of optimized time tagging pixels

    SciTech Connect

    Shapiro, S.; Cords, D.; Mani, S.; Holbrook, B.; Atlas, E.

    1993-06-01

    A pixel array has been proposed which features a completely data driven architecture. A pixel cell has been designed that has been optimized for this readout. It retains the features of preceding designs which allow low noise operation, time stamping, analog signal processing, XY address recording, ghost elimination and sparse data transmission. The pixel design eliminates a number of problems inherent in previous designs, by the use of sampled data techniques, destructive readout, and current mode output drivers. This architecture and pixel design is directed at applications such as a forward spectrometer at the SSC, an e{sup +}e{sup {minus}} B factory at SLAC, and fixed target experiments at FNAL.

  10. Uncooled infrared detectors toward smaller pixel pitch with newly proposed pixel structure

    NASA Astrophysics Data System (ADS)

    Tohyama, Shigeru; Sasaki, Tokuhito; Endoh, Tsutomu; Sano, Masahiko; Kato, Koji; Kurashina, Seiji; Miyoshi, Masaru; Yamazaki, Takao; Ueno, Munetaka; Katayama, Haruyoshi; Imai, Tadashi

    2013-12-01

    An uncooled infrared (IR) focal plane array (FPA) with 23.5 μm pixel pitch has been successfully demonstrated and has found wide commercial applications in the areas of thermography, security cameras, and other applications. One of the key issues for uncooled IRFPA technology is to shrink the pixel pitch because the size of the pixel pitch determines the overall size of the FPA, which, in turn, determines the cost of the IR camera products. This paper proposes an innovative pixel structure with a diaphragm and beams placed in different levels to realize an uncooled IRFPA with smaller pixel pitch (≦17 μm). The upper level consists of a diaphragm with VOx bolometer and IR absorber layers, while the lower level consists of the two beams, which are designed to be placed on the adjacent pixels. The test devices of this pixel design with 12, 15, and 17 μm pitch have been fabricated on the Si read-out integrated circuit (ROIC) of quarter video graphics array (QVGA) (320×240) with 23.5 μm pitch. Their performances are nearly equal to those of the IRFPA with 23.5 μm pitch. For example, a noise equivalent temperature difference of 12 μm pixel is 63.1 mK for F/1 optics with the thermal time constant of 14.5 ms. Then, the proposed structure is shown to be effective for the existing IRFPA with 23.5 μm pitch because of the improvements in IR sensitivity. Furthermore, the advanced pixel structure that has the beams composed of two levels are demonstrated to be realizable.

  11. Research of infrared image optimization algorithm in optical read-out IR imaging

    NASA Astrophysics Data System (ADS)

    Wu, Jianxiong; Cheng, Teng; Zhang, Qingchuan; Gao, Jie; Wu, Xiaoping

    2014-09-01

    Different from traditional electrical readout infrared imaging, optical readout infrared imaging system readout the thermo-mechanical response of focal plane array via visible light. Due to the different parameters of the optical system, usually,the infrared thermal image pixel corresponding to the thermal element of focal plane array is not consistent. And the substrate-free focal plane array brings thermal crosstalk, the image blur. This manuscript analyzes the optical readout infrared imaging principle, proposes an one to one correspondence method between the infrared thermal image pixel and the thermal element of focal plane array, optimizes the digital infrared image by the thermal crosstalk on substrate-free focal plane array. Simulation and experiments show that the algorithm can effectively enhance the contours of the infrared image detail, enhancing image quality.

  12. CMOS Active Pixel Sensor (APS) Imager for Scientific Applications

    NASA Astrophysics Data System (ADS)

    Ay, Suat U.; Lesser, Michael P.; Fossum, Eric R.

    2002-12-01

    A 512×512 CMOS Active Pixel Sensor (APS) imager has been designed, fabricate, and tested for frontside illumination suitable for use in astronomy specifically in telescope guider systems as a replacement of CCD chips. The imager features a high-speed differential analog readout, 15 μm pixel pitch, 75 % fill factor (FF), 62 dB dynamic range, 315Ke- pixel capacity, less than 0.25% fixed pattern noise (FPN), 45 dB signal to noise ratio (SNR) and frame rate of up to 40 FPS. Design was implemented in a standard 0.5 μm CMOS process technology consuming less than 200mWatts on a single 5 Volt power supply. CMOS Active Pixel Sensor (APS) imager was developed with pixel structure suitable for both frontside and backside illumination holding large number of electron in relatively small pixel pitch of 15 μm. High-speed readout and signal processing circuits were designed to achieve low fixed pattern noise (FPN) and non-uniformity to provide CCD-like analog outputs. Target spectrum range of operation for the imager is in near ultraviolet (300-400 nm) with high quantum efficiency. This device is going to be used as a test vehicle to develop backside-thinning process.

  13. A Cherenkov camera with integrated electronics based on the ``Smart Pixel'' concept

    NASA Astrophysics Data System (ADS)

    Bulian, Norbert; Hirsch, Thomas; Hofmann, Werner; Kihm, Thomas; Kohnle, Antje; Panter, Michael; Stein, Michael

    2000-06-01

    An option for the cameras of the HESS telescopes, the concept of a modular camera based on ``Smart Pixels'' was developed. A Smart Pixel contains the photomultiplier, the high voltage supply for the photomultiplier, a dual-gain sample-and-hold circuit with a 14 bit dynamic range, a time-to-voltage converter, a trigger discriminator, trigger logic to detect a coincidence of X=1...7 neighboring pixels, and an analog ratemeter. The Smart Pixels plug into a common backplane which provides power, communicates trigger signals between neighboring pixels, and holds a digital control bus as well as an analog bus for multiplexed readout of pixel signals. The performance of the Smart Pixels has been studied using a 19-pixel test camera. .

  14. Sensor readout detector circuit

    DOEpatents

    Chu, D.D.; Thelen, D.C. Jr.

    1998-08-11

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems. 6 figs.

  15. Sensor readout detector circuit

    DOEpatents

    Chu, Dahlon D.; Thelen, Jr., Donald C.

    1998-01-01

    A sensor readout detector circuit is disclosed that is capable of detecting sensor signals down to a few nanoamperes or less in a high (microampere) background noise level. The circuit operates at a very low standby power level and is triggerable by a sensor event signal that is above a predetermined threshold level. A plurality of sensor readout detector circuits can be formed on a substrate as an integrated circuit (IC). These circuits can operate to process data from an array of sensors in parallel, with only data from active sensors being processed for digitization and analysis. This allows the IC to operate at a low power level with a high data throughput for the active sensors. The circuit may be used with many different types of sensors, including photodetectors, capacitance sensors, chemically-sensitive sensors or combinations thereof to provide a capability for recording transient events or for recording data for a predetermined period of time following an event trigger. The sensor readout detector circuit has applications for portable or satellite-based sensor systems.

  16. PixelLearn

    NASA Technical Reports Server (NTRS)

    Mazzoni, Dominic; Wagstaff, Kiri; Bornstein, Benjamin; Tang, Nghia; Roden, Joseph

    2006-01-01

    PixelLearn is an integrated user-interface computer program for classifying pixels in scientific images. Heretofore, training a machine-learning algorithm to classify pixels in images has been tedious and difficult. PixelLearn provides a graphical user interface that makes it faster and more intuitive, leading to more interactive exploration of image data sets. PixelLearn also provides image-enhancement controls to make it easier to see subtle details in images. PixelLearn opens images or sets of images in a variety of common scientific file formats and enables the user to interact with several supervised or unsupervised machine-learning pixel-classifying algorithms while the user continues to browse through the images. The machinelearning algorithms in PixelLearn use advanced clustering and classification methods that enable accuracy much higher than is achievable by most other software previously available for this purpose. PixelLearn is written in portable C++ and runs natively on computers running Linux, Windows, or Mac OS X.

  17. Characterization results of the JUNGFRAU full scale readout ASIC

    NASA Astrophysics Data System (ADS)

    Mozzanica, A.; Bergamaschi, A.; Brueckner, M.; Cartier, S.; Dinapoli, R.; Greiffenberg, D.; Jungmann-Smith, J.; Maliakal, D.; Mezza, D.; Ramilli, M.; Ruder, C.; Schaedler, L.; Schmitt, B.; Shi, X.; Tinti, G.

    2016-02-01

    The two-dimensional pixel detector JUNGFRAU is designed for high performance photon science applications at free electron lasers and synchrotron light sources. It is developed for the SwissFEL currently under construction at the Paul Scherrer Institut, Switzerland. The detector is a hybrid pixel detector with a charge integration readout ASIC characterized by single photon sensitivity and a low noise performance over a dynamic range of 104 12 keV photons. Geometrically, a JUNGFRAU readout chip consists of 256×256 pixels of 75×75 μm2. The chips are bump bonded to 320 μm thick silicon sensors. Arrays of 2×4 chips are tiled to form modules of 4×8 cm2 area. Several multi-module systems with up to 16 Mpixels per system will be delivered to the two end stations at SwissFEL. The JUNGFRAU full scale readout ASIC and module design are presented along with characterization results of the first systems. Experiments from fluorescence X-ray, visible light illumination, and synchrotron irradiation are shown. The results include an electronic noise of ~50 electrons r.m.s., which enables single photon detection energies below 2 keV and a noise well below the Poisson statistical limit over the entire dynamic range. First imaging experiments are also shown.

  18. New smart readout technique performing edge detection designed to control vision sensors dataflow

    NASA Astrophysics Data System (ADS)

    Amhaz, Hawraa; Sicard, Gilles

    2012-03-01

    In this paper, a new readout strategy for CMOS image sensors is presented. It aims to overcome the excessive output dataflow bottleneck; this challenge is becoming more and more crucial along with the technology miniaturization. This strategy is based on the spatial redundancies suppression. It leads the sensor to perform edge detection and eventually provide binary image. One of the main advantages of this readout technique compared to other techniques, existing in the literature, is that it does not affect the in-pixel circuitry. This means that all the analogue processing circuitry is implemented outside the pixel, which keeps the pixel area and Fill Factor unchanged. The main analogue block used in this technique is an event detector developed and designed in the CMOS 0.35μm technology from Austria Micro Systems. The simulation results of this block as well as the simulation results of a test bench composed of several pixels and column amplifiers using this readout mode show the capability of this readout mode to reduce dataflow by controlling the ADCs. We must mention that this readout strategy is applicable on sensors that use a linear operating pixel element as well as for those based on logarithmic operating pixels. This readout technique is emulated by a MATLAB model which gives an idea about the expected functionalities and dataflow reduction rates (DRR). Emulation results are shown lately by giving the pre and post processed images as well as the DRR. This last cited does not have a fix value since it depends on the spatial frequency of the filmed scenes and the chosen threshold value.

  19. Semiconductor arrays with multiplexer readout for gamma-ray imaging: results for a 48 × 48 Ge array

    NASA Astrophysics Data System (ADS)

    Barber, H. B.; Augustine, F. L.; Barrett, H. H.; Dereniak, E. L.; Matherson, K. L.; Meyers, T. J.; Perry, D. L.; Venzon, J. E.; Woolfenden, J. M.; Young, E. T.

    1994-12-01

    We are developing a new kind of gamma-ray imaging device that has sub-millimeter spatial resolution and excellent energy resolution. The device is composed of a slab of semiconductor detector partitioned into an array of detector cells by photolithography and connected to a monolithic circuit chip called a multiplexer (MUX) for readout. Our application is for an ultra-high-resolution SPECT system for functional brain imaging using an injected radiotracer. We report here on results obtained with a Hughes 48 × 48 Ge PIN-photodiode array with MUX readout, originally developed as an infrared focal-plane-array imaging sensor. The device functions as an array of individual gamma-ray detectors with minimal interpixel crosstalk. Linearity of energy response is excellent up to at least 140 keV. The array exhibits excellent energy resolution, ˜ 2 keV at ≤ 140 keV or 1.5% FWHM at 140 keV. The energy resolution is dominated by MUX readout noise and so should improve with MUX optimization for gamma-ray detection. The spatial resolution of the 48 × 48 Ge array is essentially the same as the pixel spacing, 125 μm. The quantum efficiency is limited by the thin Ge detector (0.25 mm), but this approach is readily applicable to thicker Ge detectors and room-temperature semiconductor detectors such as CdTe, HgI 2 and CdZnTe.

  20. High-speed position readout for microchannel plate-based space plasma instruments

    NASA Astrophysics Data System (ADS)

    Kataria, D. O.; Chaudery, Rahil; Rees, Kerrin

    2007-04-01

    Position sensitive micro-channel plate (MPC) detectors are attractive for space plasma instruments but have a number of limitations. Most of the techniques have limited global rate handling and require the MCP to run at high gain with MCP lifetime implications. In addition, available mass and power resources limit the number of channels of readout electronics. A fast position sensing technique was developed that is well suited for MCP-based space plasma applications. The output charge from the MCP falling on an anode pixel is capacitively split into two separate channels of readout electronics. Choosing an appropriate readout pattern, the charge is forced to split unequally, introducing a time walk between the signals from the following leading edge discriminator. Identifying the active channels and the order of their arrival time provides unique identification of the position of the incoming event. The pixels are interleaved so that each readout channel can be connected to several pixels, reducing the total number of readout channels. The timing logic and signal processing is carried out within an FPGA with additional processor/spacecraft interfaces also built in. The system dead time within the FPGA has been simulated and found to be less than 100 ns. The performance of the system can be optimised depending on the resolution, rate handling and lifetime requirements of the instrument. Details of the readout technique and its implementation in a space plasma analyser are presented.

  1. Readout Techniques for Drift and Low Frequency Noise Rejection in Infrared Arrays

    NASA Astrophysics Data System (ADS)

    Finger, G.; Dorn, R. J.; Hoffman, A. W.; Mehrgan, H.; Meyer, M.; Moorwood, A. F. M.; Steigmeier, J.

    Three different methods are presented to subtract thermal drifts and low-frequency noise from the signal of infrared array. The first is dead pixels with open Indium bumps, the second is reference output as implemented on the Hawaii2 multiplexer, and the third is dark pixels to emulate reference cells having a capacity connected to the gate of the unit cell field-effect transistor (FET). The third method is the most effective and yields a reduction in readout noise from 15.4-9.4 erms. A novel method will be described to extend this readout technique to the Aladdin 1Kx1K InSb array.

  2. Thin active region, type II superlattice photodiode arrays: Single-pixel and focal plane array characterization

    NASA Astrophysics Data System (ADS)

    Little, J. W.; Svensson, S. P.; Beck, W. A.; Goldberg, A. C.; Kennerly, S. W.; Hongsmatip, T.; Winn, M.; Uppal, P.

    2007-02-01

    We have measured the radiometric properties of two midwave infrared photodiode arrays (320×256pixel2 format) fabricated from the same wafer comprising a thin (0.24μm), not intentionally doped InAs /GaSb superlattice between a p-doped GaSb layer and a n-doped InAs layer. One of the arrays was indium bump bonded to a silicon fanout chip to allow for the measurement of properties of individual pixels, and one was bonded to a readout integrated circuit to enable array-scale measurements and infrared imaging. The superlattice layer is thin enough that it is fully depleted at zero bias, and the collection efficiency of photogenerated carriers in the intrinsic region is close to unity. This simplifies the interpretation of photocurrent data as compared with previous measurements made on thick superlattices with complex doping profiles. Superlattice absorption coefficient curves, obtained from measurements of the external quantum efficiency using two different assumptions for optical coupling into the chip, bracket values calculated using an eight-band k •p model. Measurements of the quantum efficiency map of the focal plane array were in good agreement with the single-pixel measurements. Imagery obtained with this focal plane array demonstrates the high uniformity and crystal quality of the type II superlattice material.

  3. Hybrid Pixel Detectors for gamma/X-ray imaging

    NASA Astrophysics Data System (ADS)

    Hatzistratis, D.; Theodoratos, G.; Zografos, V.; Kazas, I.; Loukas, D.; Lambropoulos, C. P.

    2015-09-01

    Hybrid pixel detectors are made by direct converting high-Z semi-insulating single crystalline material coupled to complementary-metal-oxide semiconductor (CMOS) readout electronics. They are attractive because direct conversion exterminates all the problems of spatial localization related to light diffusion, energy resolution, is far superior from the combination of scintillation crystals and photomultipliers and lithography can be used to pattern electrodes with very fine pitch. We are developing 2-D pixel CMOS ASICs, connect them to pixilated CdTe crystals with the flip chip and bump bonding method and characterize the hybrids. We have designed a series of circuits, whose latest member consists of a 50×25 pixel array with 400um pitch and an embedded controller. In every pixel a full spectroscopic channel with time tagging information has been implemented. The detectors are targeting Compton scatter imaging and they can be used for coded aperture imaging too. Hybridization using CMOS can overcome the limit put on pixel circuit complexity by the use of thin film transistors (TFT) in large flat panels. Hybrid active pixel sensors are used in dental imaging and other applications (e.g. industrial CT etc.). Thus X-ray imaging can benefit from the work done on dynamic range enhancement methods developed initially for visible and infrared CMOS pixel sensors. A 2-D CMOS ASIC with 100um pixel pitch to demonstrate the feasibility of such methods in the context of X-ray imaging has been designed.

  4. Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra K. (Inventor); Pain, Bedabrata (Inventor); Nixon, Robert H. (Inventor); Zhou, Zhimin (Inventor)

    2003-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

  5. Active pixel sensor having intra-pixel charge transfer with analog-to-digital converter

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Mendis, Sunetra K. (Inventor); Pain, Bedabrata (Inventor); Nixon, Robert H. (Inventor); Zhou, Zhimin (Inventor)

    2000-01-01

    An imaging device formed as a monolithic complementary metal oxide semiconductor Integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells including a photogate overlying the substrate for accumulating photo-generated charge in an underlying portion of the substrate, a readout circuit including at least an output field effect transistor formed in the substrate, and a charge coupled device section formed on the substrate adjacent the photogate having a sensing node connected to the output transistor and at least one charge coupled device stage for transferring charge from the underlying portion of the substrate to the sensing node and an analog-to-digital converter formed in the substrate connected to the output of the readout circuit.

  6. Two-dimensional pixel array image sensor for protein crystallography

    SciTech Connect

    Beuville, E.; Beche, J.-F.; Cork, C.

    1996-07-01

    A 2D pixel array image sensor module has been designed for time resolved Protein Crystallography. This smart pixels detector significantly enhances time resolved Laue Protein crystallography by two to three orders of magnitude compared to existing sensors like films or phosphor screens coupled to CCDs. The resolution in time and dynamic range of this type of detector will allow one to study the evolution of structural changes that occur within the protein as a function of time. This detector will also considerably accelerate data collection in static Laue or monochromatic crystallography and make better use of the intense beam delivered by synchrotron light sources. The event driven pixel array detectors, based on the column Architecture, can provide multiparameter information (energy discrimination, time), with sparse and frameless readout without significant dead time. The prototype module consists of a 16x16 pixel diode array bump-bonded to the integrated circuit. The detection area is 150x150 square microns.

  7. Medipix2 parallel readout system

    NASA Astrophysics Data System (ADS)

    Fanti, V.; Marzeddu, R.; Randaccio, P.

    2003-08-01

    A fast parallel readout system based on a PCI board has been developed in the framework of the Medipix collaboration. The readout electronics consists of two boards: the motherboard directly interfacing the Medipix2 chip, and the PCI board with digital I/O ports 32 bits wide. The device driver and readout software have been developed at low level in Assembler to allow fast data transfer and image reconstruction. The parallel readout permits a transfer rate up to 64 Mbytes/s. http://medipix.web.cern ch/MEDIPIX/

  8. Imaging by photon counting with 256x256 pixel matrix

    NASA Astrophysics Data System (ADS)

    Tlustos, Lukas; Campbell, Michael; Heijne, Erik H. M.; Llopart, Xavier

    2004-09-01

    Using 0.25µm standard CMOS we have developed 2-D semiconductor matrix detectors with sophisticated functionality integrated inside each pixel of a hybrid sensor module. One of these sensor modules is a matrix of 256x256 square 55µm pixels intended for X-ray imaging. This device is called 'Medipix2' and features a fast amplifier and two-level discrimination for signals between 1000 and 100000 equivalent electrons, with overall signal noise ~150 e- rms. Signal polarity and comparator thresholds are programmable. A maximum count rate of nearly 1 MHz per pixel can be achieved, which corresponds to an average flux of 3x10exp10 photons per cm2. The selected signals can be accumulated in each pixel in a 13-bit register. The serial readout takes 5-10 ms. A parallel readout of ~300 µs could also be used. Housekeeping functions such as local dark current compensation, test pulse generation, silencing of noisy pixels and threshold tuning in each pixel contribute to the homogeneous response over a large sensor area. The sensor material can be adapted to the energy of the X-rays. Best results have been obtained with high-resistivity silicon detectors, but also CdTe and GaAs detectors have been used. The lowest detectable X-ray energy was about 4 keV. Background measurements have been made, as well as measurements of the uniformity of imaging by photon counting. Very low photon count rates are feasible and noise-free at room temperature. The readout matrix can be used also with visible photons if an energy or charge intensifier structure is interposed such as a gaseous amplification layer or a microchannel plate or acceleration field in vacuum.

  9. Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

    NASA Astrophysics Data System (ADS)

    Schneider, A.; Veale, M. C.; Duarte, D. D.; Bell, S. J.; Wilson, M. D.; Lipp, J. D.; Seller, P.

    2015-02-01

    In the last decade, the Detector Development Group at the Technology Department of the Science and Technology Facilities Council (STFC), U.K., established a variety of fabrication and bonding techniques to build pixelated X-ray and γ-ray detector systems such as the spectroscopic X-ray imaging detector HEXITEC [1]. The fabrication and bonding of such devices comprises a range of processes including material surface preparation, photolithography, stencil printing, flip-chip and wire bonding of detectors to application-specific integrated circuits (ASIC). This paper presents interconnect and bonding techniques used in the fabrication chain for pixelated detectors assembled at STFC. For this purpose, detector dies (~ 20× 20 mm2) of high quality, single crystal semiconductors, such as cadmium zinc telluride (CZT) are cut to the required thickness (up to 5mm). The die surfaces are lapped and polished to a mirror-finish and then individually processed by electroless gold deposition combined with photolithography to form 74× 74 arrays of 200 μ m × 200 μ m pixels with 250 μ m pitch. Owing to a lack of availability of CZT wafers, lithography is commonly carried out on individual detector dies which represents a significant technical challenge as the edge of the pixel array and the surrounding guard band lies close to the physical edge of the crystal. Further, such detector dies are flip-chip bonded to readout ASIC using low-temperature curing silver-loaded epoxy so that the stress between the bonded detector die and the ASIC is minimized. In addition, this reduces crystalline modifications of the detector die that occur at temperature greater than 150\\r{ }C and have adverse effects on the detector performance. To allow smaller pitch detectors to be bonded, STFC has also developed a compression cold-weld indium bump bonding technique utilising bumps formed by a photolithographic lift-off technique.

  10. Development of a high density pixel multichip module at Fermilab

    SciTech Connect

    Cardoso, G.

    2001-03-08

    At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two together. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance results of the first prototype and detector hybridization.

  11. Current progress on pixel level packaging for uncooled IRFPA

    NASA Astrophysics Data System (ADS)

    Dumont, G.; Rabaud, W.; Yon, J.-J.; Carle, L.; Goudon, V.; Vialle, C.; Becker, Sébastien; Hamelin, Antoine; Arnaud, A.

    2012-06-01

    Vacuum packaging is definitely a major cost driver for uncooled IRFPA and a technological breakthrough is still expected to comply with the very low cost infrared camera market. To address this key issue, CEA-LETI is developing a Pixel Level Packaging (PLP) technology which basically consists in capping each pixel under vacuum in the direct continuation of the wafer level bolometer process. Previous CEA-LETI works have yet shown the feasibility of PLP based microbolometers that exhibit the required thermal insulation and vacuum achievement. CEA-LETI is still pushing the technology which has been now applied for the first time on a CMOS readout circuit. The paper will report on the recent progress obtained on PLP technology with particular emphasis on the optical efficiency of the PLP arrangement compared to the traditional microbolometer packaging. Results including optical performances, aging studies and compatibility with CMOS readout circuit are extensively presented.

  12. Automatic readout micrometer

    DOEpatents

    Lauritzen, T.

    A measuring system is described for surveying and very accurately positioning objects with respect to a reference line. A principle use of this surveying system is for accurately aligning the electromagnets which direct a particle beam emitted from a particle accelerator. Prior art surveying systems require highly skilled surveyors. Prior art systems include, for example, optical surveying systems which are susceptible to operator reading errors, and celestial navigation-type surveying systems, with their inherent complexities. The present invention provides an automatic readout micrometer which can very accurately measure distances. The invention has a simplicity of operation which practically eliminates the possibilities of operator optical reading error, owning to the elimination of traditional optical alignments for making measurements. The invention has an extendable arm which carries a laser surveying target. The extendable arm can be continuously positioned over its entire length of travel by either a coarse of fine adjustment without having the fine adjustment outrun the coarse adjustment until a reference laser beam is centered on the target as indicated by a digital readout. The length of the micrometer can then be accurately and automatically read by a computer and compared with a standardized set of alignment measurements. Due to its construction, the micrometer eliminates any errors due to temperature changes when the system is operated within a standard operating temperature range.

  13. Automatic readout micrometer

    DOEpatents

    Lauritzen, Ted

    1982-01-01

    A measuring system is disclosed for surveying and very accurately positioning objects with respect to a reference line. A principal use of this surveying system is for accurately aligning the electromagnets which direct a particle beam emitted from a particle accelerator. Prior art surveying systems require highly skilled surveyors. Prior art systems include, for example, optical surveying systems which are susceptible to operator reading errors, and celestial navigation-type surveying systems, with their inherent complexities. The present invention provides an automatic readout micrometer which can very accurately measure distances. The invention has a simplicity of operation which practically eliminates the possibilities of operator optical reading error, owning to the elimination of traditional optical alignments for making measurements. The invention has an extendable arm which carries a laser surveying target. The extendable arm can be continuously positioned over its entire length of travel by either a coarse or fine adjustment without having the fine adjustment outrun the coarse adjustment until a reference laser beam is centered on the target as indicated by a digital readout. The length of the micrometer can then be accurately and automatically read by a computer and compared with a standardized set of alignment measurements. Due to its construction, the micrometer eliminates any errors due to temperature changes when the system is operated within a standard operating temperature range.

  14. Semiconductor detectors with proximity signal readout

    SciTech Connect

    Asztalos, Stephen J.

    2014-01-30

    Semiconductor-based radiation detectors are routinely used for the detection, imaging, and spectroscopy of x-rays, gamma rays, and charged particles for applications in the areas of nuclear and medical physics, astrophysics, environmental remediation, nuclear nonproliferation, and homeland security. Detectors used for imaging and particle tracking are more complex in that they typically must also measure the location of the radiation interaction in addition to the deposited energy. In such detectors, the position measurement is often achieved by dividing or segmenting the electrodes into many strips or pixels and then reading out the signals from all of the electrode segments. Fine electrode segmentation is problematic for many of the standard semiconductor detector technologies. Clearly there is a need for a semiconductor-based radiation detector technology that can achieve fine position resolution while maintaining the excellent energy resolution intrinsic to semiconductor detectors, can be fabricated through simple processes, does not require complex electrical interconnections to the detector, and can reduce the number of required channels of readout electronics. Proximity electrode signal readout (PESR), in which the electrodes are not in physical contact with the detector surface, satisfies this need.

  15. A 70μm × 70μm CMOS digital active pixel sensor for digital mammography and X-ray imaging

    NASA Astrophysics Data System (ADS)

    Sabadell, J.; Figueras, R.; Margarit, J. M.; Martín, E.; Terès, L.; Serra-Graells, F.

    2011-03-01

    This work presents an architecture for CMOS active pixel sensors (APS) based on a novel lossless charge integration method, proposed for X-ray imagers in general but specifically optimized for full-field digital mammography. The objective is to provide all the required functionality inside the pixel, so to use full digital control and read-out signals only, therefore avoiding crosstalk between analog lines over large pixel arrays. It includes a novel lossless A/D conversion scheme besides a self-calibrating dark current cancellation circuit, a self-biasing circuitry, biphasic current sensing for the collection of electrons (e-) or holes (h+) and built-in test. Furthermore, FPN compensation is available by individually addressing the pixel's internal DAC controlling the gain. Implemented in a 0.18μm 1P6M CMOS technology with MiM capacitors, everything fits into a 70μm by 70μm due to the extensive reuse of available blocks and aggressive layout techniques. Also, thanks to the MOSFET subthreshold operation, the average power consumption is as low as 8μW/pixel.

  16. ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays

    NASA Technical Reports Server (NTRS)

    Vasile, Stefan; Lipson, Jerold

    2012-01-01

    The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.

  17. High density pixel array

    NASA Technical Reports Server (NTRS)

    Wiener-Avnear, Eliezer (Inventor); McFall, James Earl (Inventor)

    2004-01-01

    A pixel array device is fabricated by a laser micro-milling method under strict process control conditions. The device has an array of pixels bonded together with an adhesive filling the grooves between adjacent pixels. The array is fabricated by moving a substrate relative to a laser beam of predetermined intensity at a controlled, constant velocity along a predetermined path defining a set of grooves between adjacent pixels so that a predetermined laser flux per unit area is applied to the material, and repeating the movement for a plurality of passes of the laser beam until the grooves are ablated to a desired depth. The substrate is of an ultrasonic transducer material in one example for fabrication of a 2D ultrasonic phase array transducer. A substrate of phosphor material is used to fabricate an X-ray focal plane array detector.

  18. Compensated digital readout family

    NASA Technical Reports Server (NTRS)

    Ludwig, David E.; Skow, Michael

    1991-01-01

    ISC has completed test on an IC which has 32 channels of amplifiers, low pass anti-aliasing filters, 13-bit analog-to-digital (A/D) converters with non-uniformity correction per channel and a digital multiplexer. The single slope class of A/D conversion is described, as are the unique variations required for incorporation of this technique for use with on-focal plane detector readout electronics. This paper describes the architecture used to implement the digital on-focal plane signal processing functions. Results from measured data on a test IC are presented for a circuit containing these functions operating at a sensor frame rate of 1000 hertz.

  19. Characterization of Pixelated Cadmium-Zinc-Telluride Detectors for Astrophysical Applications

    NASA Technical Reports Server (NTRS)

    Gaskin, Jessica; Sharma, Dharma; Ramsey, Brian; Seller, Paul

    2003-01-01

    Comparisons of charge sharing and charge loss measurements between two pixelated Cadmium-Zinc-Telluride (CdZnTe) detectors are discussed. These properties along with the detector geometry help to define the limiting energy resolution and spatial resolution of the detector in question. The first detector consists of a 1-mm-thick piece of CdZnTe sputtered with a 4x4 array of pixels with pixel pitch of 750 microns (inter-pixel gap is 100 microns). Signal readout is via discrete ultra-low-noise preamplifiers, one for each of the 16 pixels. The second detector consists of a 2-mm-thick piece of CdZnTe sputtered with a 16x16 array of pixels with a pixel pitch of 300 microns (inter-pixel gap is 50 microns). This crystal is bonded to a custom-built readout chip (ASIC) providing all front-end electronics to each of the 256 independent pixels. These detectors act as precursors to that which will be used at the focal plane of the High Energy Replicated Optics (HERO) telescope currently being developed at Marshall Space Flight Center. With a telescope focal length of 6 meters, the detector needs to have a spatial resolution of around 200 microns in order to take full advantage of the HERO angular resolution. We discuss to what degree charge sharing will degrade energy resolution but will improve our spatial resolution through position interpolation.

  20. Characterization of Silicon Detector Readout Electronics

    SciTech Connect

    Jones, M.

    2015-07-22

    Configuration and calibration of the front-end electronics typical of many silicon detector configurations were investigated in a lab activity based on a pair of strip sensors interfaced with FSSR2 read-out chips and an FPGA. This simple hardware configuration, originally developed for a telescope at the Fermilab Test Beam Facility, was used to measure thresholds and noise on individual readout channels and to study the influence that different configurations of the front-end electronics had on the observed levels of noise in the system. An understanding of the calibration and operation of this small detector system provided an opportunity to explore the architecture of larger systems such as those currently in use at LHC experiments.

  1. A new method to improve multiplication factor in micro-pixel avalanche photodiodes with high pixel density

    NASA Astrophysics Data System (ADS)

    Sadygov, Z.; Ahmadov, F.; Khorev, S.; Sadigov, A.; Suleymanov, S.; Madatov, R.; Mehdiyeva, R.; Zerrouk, F.

    2016-07-01

    Presented is a new model describing development of the avalanche process in time, taking into account the dynamics of electric field within the depleted region of the diode and the effect of parasitic capacitance shunting individual quenching micro-resistors on device parameters. Simulations show that the effective capacitance of a single pixel, which defines the multiplication factor, is the sum of the pixel capacitance and a parasitic capacitance shunting its quenching micro-resistor. Conclusions obtained as a result of modeling open possibilities of improving the pixel gain in micropixel avalanche photodiodes with high pixel density (or low pixel capacitance).

  2. Selecting Pixels for Kepler Downlink

    NASA Technical Reports Server (NTRS)

    Bryson, Stephen T.; Jenkins, Jon M.; Klaus, Todd C.; Cote, Miles T.; Quintana, Elisa V.; Hall, Jennifer R.; Ibrahim, Khadeejah; Chandrasekaran, Hema; Caldwell, Douglas A.; Van Cleve, Jeffrey E.; Haas, Michael R.

    2010-01-01

    The Kepler mission monitors > 100,000 stellar targets using 42 2200 1024 pixel CCDs. Bandwidth constraints prevent the downlink of all 96 million pixels per 30-minute cadence, so the Kepler spacecraft downlinks a specified collection of pixels for each target. These pixels are selected by considering the object brightness, background and the signal-to-noise of each pixel, and are optimized to maximize the signal-to-noise ratio of the target. This paper describes pixel selection, creation of spacecraft apertures that efficiently capture selected pixels, and aperture assignment to a target. Diagnostic apertures, short-cadence targets and custom specified shapes are discussed.

  3. CMOS VLSI Active-Pixel Sensor for Tracking

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata; Sun, Chao; Yang, Guang; Heynssens, Julie

    2004-01-01

    An architecture for a proposed active-pixel sensor (APS) and a design to implement the architecture in a complementary metal oxide semiconductor (CMOS) very-large-scale integrated (VLSI) circuit provide for some advanced features that are expected to be especially desirable for tracking pointlike features of stars. The architecture would also make this APS suitable for robotic- vision and general pointing and tracking applications. CMOS imagers in general are well suited for pointing and tracking because they can be configured for random access to selected pixels and to provide readout from windows of interest within their fields of view. However, until now, the architectures of CMOS imagers have not supported multiwindow operation or low-noise data collection. Moreover, smearing and motion artifacts in collected images have made prior CMOS imagers unsuitable for tracking applications. The proposed CMOS imager (see figure) would include an array of 1,024 by 1,024 pixels containing high-performance photodiode-based APS circuitry. The pixel pitch would be 9 m. The operations of the pixel circuits would be sequenced and otherwise controlled by an on-chip timing and control block, which would enable the collection of image data, during a single frame period, from either the full frame (that is, all 1,024 1,024 pixels) or from within as many as 8 different arbitrarily placed windows as large as 8 by 8 pixels each. A typical prior CMOS APS operates in a row-at-a-time ( grolling-shutter h) readout mode, which gives rise to exposure skew. In contrast, the proposed APS would operate in a sample-first/readlater mode, suppressing rolling-shutter effects. In this mode, the analog readout signals from the pixels corresponding to the windows of the interest (which windows, in the star-tracking application, would presumably contain guide stars) would be sampled rapidly by routing them through a programmable diagonal switch array to an on-chip parallel analog memory array. The

  4. Fast, High-Precision Readout Circuit for Detector Arrays

    NASA Technical Reports Server (NTRS)

    Rider, David M.; Hancock, Bruce R.; Key, Richard W.; Cunningham, Thomas J.; Wrigley, Chris J.; Seshadri, Suresh; Sander, Stanley P.; Blavier, Jean-Francois L.

    2013-01-01

    The GEO-CAPE mission described in NASA's Earth Science and Applications Decadal Survey requires high spatial, temporal, and spectral resolution measurements to monitor and characterize the rapidly changing chemistry of the troposphere over North and South Americas. High-frame-rate focal plane arrays (FPAs) with many pixels are needed to enable such measurements. A high-throughput digital detector readout integrated circuit (ROIC) that meets the GEO-CAPE FPA needs has been developed, fabricated, and tested. The ROIC is based on an innovative charge integrating, fast, high-precision analog-to-digital circuit that is built into each pixel. The 128×128-pixel ROIC digitizes all 16,384 pixels simultaneously at frame rates up to 16 kHz to provide a completely digital output on a single integrated circuit at an unprecedented rate of 262 million pixels per second. The approach eliminates the need for off focal plane electronics, greatly reducing volume, mass, and power compared to conventional FPA implementations. A focal plane based on this ROIC will require less than 2 W of power on a 1×1-cm integrated circuit. The ROIC is fabricated of silicon using CMOS technology. It is designed to be indium bump bonded to a variety of detector materials including silicon PIN diodes, indium antimonide (InSb), indium gallium arsenide (In- GaAs), and mercury cadmium telluride (HgCdTe) detector arrays to provide coverage over a broad spectral range in the infrared, visible, and ultraviolet spectral ranges.

  5. Embedded controller for GEM detector readout system

    NASA Astrophysics Data System (ADS)

    Zabołotny, Wojciech M.; Byszuk, Adrian; Chernyshova, Maryna; Cieszewski, Radosław; Czarski, Tomasz; Dominik, Wojciech; Jakubowska, Katarzyna L.; Kasprowicz, Grzegorz; Poźniak, Krzysztof; Rzadkiewicz, Jacek; Scholz, Marek

    2013-10-01

    This paper describes the embedded controller used for the multichannel readout system for the GEM detector. The controller is based on the embedded Mini ITX mainboard, running the GNU/Linux operating system. The controller offers two interfaces to communicate with the FPGA based readout system. FPGA configuration and diagnostics is controlled via low speed USB based interface, while high-speed setup of the readout parameters and reception of the measured data is handled by the PCI Express (PCIe) interface. Hardware access is synchronized by the dedicated server written in C. Multiple clients may connect to this server via TCP/IP network, and different priority is assigned to individual clients. Specialized protocols have been implemented both for low level access on register level and for high level access with transfer of structured data with "msgpack" protocol. High level functionalities have been split between multiple TCP/IP servers for parallel operation. Status of the system may be checked, and basic maintenance may be performed via web interface, while the expert access is possible via SSH server. System was designed with reliability and flexibility in mind.

  6. The Belle II DEPFET pixel detector

    NASA Astrophysics Data System (ADS)

    Moser, Hans-Günther

    2016-09-01

    The Belle II experiment at KEK (Tsukuba, Japan) will explore heavy flavour physics (B, charm and tau) at the starting of 2018 with unprecedented precision. Charged particles are tracked by a two-layer DEPFET pixel device (PXD), a four-layer silicon strip detector (SVD) and the central drift chamber (CDC). The PXD will consist of two layers at radii of 14 mm and 22 mm with 8 and 12 ladders, respectively. The pixel sizes will vary, between 50 μm×(55-60) μm in the first layer and between 50 μm×(70-85) μm in the second layer, to optimize the charge sharing efficiency. These innermost layers have to cope with high background occupancy, high radiation and must have minimal material to reduce multiple scattering. These challenges are met using the DEPFET technology. Each pixel is a FET integrated on a fully depleted silicon bulk. The signal charge collected in the 'internal gate' modulates the FET current resulting in a first stage amplification and therefore very low noise. This allows very thin sensors (75 μm) reducing the overall material budget of the detector (0.21% X0). Four fold multiplexing of the column parallel readout allows read out a full frame of the pixel matrix in only 20 μs while keeping the power consumption low enough for air cooling. Only the active electronics outside the detector acceptance has to be cooled actively with a two phase CO2 system. Furthermore the DEPFET technology offers the unique feature of an electronic shutter which allows the detector to operate efficiently in the continuous injection mode of superKEKB.

  7. Planar pixel sensors for the ATLAS upgrade: beam tests results

    NASA Astrophysics Data System (ADS)

    Weingarten, J.; Altenheiner, S.; Beimforde, M.; Benoit, M.; Bomben, M.; Calderini, G.; Gallrapp, C.; George, M.; Gibson, S.; Grinstein, S.; Janoska, Z.; Jentzsch, J.; Jinnouchi, O.; Kishida, T.; La Rosa, A.; Libov, V.; Macchiolo, A.; Marchiori, G.; Muenstermann, D.; Nagai, R.; Piacquadio, G.; Ristic, B.; Rubinskiy, I.; Rummler, A.; Takubo, Y.; Troska, G.; Tsiskaridtze, S.; Tsurin, I.; Unno, Y.; Weigell, P.; Wittig, T.

    2012-10-01

    The performance of planar silicon pixel sensors, in development for the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades, has been examined in a series of beam tests at the CERN SPS facilities since 2009. Salient results are reported on the key parameters, including the spatial resolution, the charge collection and the charge sharing between adjacent cells, for different bulk materials and sensor geometries. Measurements are presented for n+-in-n pixel sensors irradiated with a range of fluences and for p-type silicon sensors with various layouts from different vendors. All tested sensors were connected via bump-bonding to the ATLAS Pixel read-out chip. The tests reveal that both n-type and p-type planar sensors are able to collect significant charge even after the lifetime fluence expected at the HL-LHC.

  8. Recent progress in the development of a B-factory monolithic active pixel detector

    NASA Astrophysics Data System (ADS)

    Stanič, S.; Aihara, H.; Barbero, M.; Bozek, A.; Browder, T.; Hazumi, M.; Kennedy, J.; Kent, N.; Olsen, S.; Palka, H.; Rosen, M.; Ruckman, L.; Trabelsi, K.; Tsuboyama, T.; Uchida, K.; Varner, G.; Yang, Q.

    2006-11-01

    Due to the need for precise vertexing at future higher luminosity B-factories with the expectedly increasing track densities and radiation exposures, upgrade of present silicon strip detectors with thin, radiation resistant pixel detectors is highly desired. Considerable progress in the technological development of thin CMOS based Monolithic Active Pixel Sensors (MAPS) in the last years makes them a realistic upgrade option and the feasibility studies of their application in Belle are actively pursued. The most serious concerns are their radiation hardness and their read-out speed. To address them, several prototypes denoted as Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25 μm process with a 5-deep sample pair pipeline in each pixel. A setup with several CAP3 sensors will be used to assess the performance of a full scale pixel read-out system running at realistic read-out speed. The results and plans for the next stages of R&D towards a full Pixel Vertex Detector (PVD) are presented.

  9. Hodoscope readout system

    DOEpatents

    Lee, L.Y.

    1973-12-01

    A readout system has been provided for reading out a radiation multidetector device with a reduced number of signal sensors. A radiation hodoscope, such as an array of scintillation counters, multiwire proportional counter array, or a set of multidetectors which do not receive signals simultaneously, is divided into equal numbered groups. A first group of signal terminals is connected to the equal numbered groups of detectors so that a signal from any one of the detectors of a group will be fed to one of the first group of terminals. A second group of signal terminals is connected to the detector groups so that a signal from a particular numbered detector of each of the detector groups is connected to one of the second group of terminals. Both groups of signal terminals are, in turn, coupled to signal sensors so that when a signal is simultaneously observed in one of the first group of terminals and one of the second group of tenniinals the specific detector detecting a radiation event is determined. The sensors are arranged in such a manner that a binary code is developed from their outputs which can be stored in a digital storage means according to the location of the event in the multidetector device. (Official Gazette)

  10. Superconducting THz Camera with GaAs-JFET Cryogenic Readout Electronics

    NASA Astrophysics Data System (ADS)

    Matsuo, Hiroshi; Hibi, Yasunori; Suzuki, Toyoaki; Naruse, Masato; Noguchi, Takashi; Sekimoto, Yutaro; Uzawa, Yoshinori; Nagata, Hirohisa; Ikeda, Hirokazu; Ariyoshi, Seiichiro; Otani, Chiko; Nitta, Tom; Qi-jun, Yao, Fujiwara, Mikio

    2009-12-01

    We describe the development of large format array of superconducting tunnel junction detectors that is readout by SONY GaAs-JFET cryogenic integrated circuits. High quality SIS photon detectors have high dynamic impedance that can be readout by low gate leakage GaAs-JFET circuits. Our imaging array design, with niobium SIS photon detectors and GaAs-JFET cryogenics electronics, uses integrating amplifiers, multiplexers and shift-registers to readout large number of pixels that is similar to CMOS digital cameras. We have designed and fabricated GaAs-JFET cryogenic integrated circuits, such as AC-coupled capacitive trans-impedance amplifier, multiplexers with sample-and-holds and shift-registers, for 32-channel readout module. The Advanced Technology Center of National Astronomical Observatory of Japan have started extensive development program for large format array of SIS photon detectors.

  11. Simple Bulk Readout of Digital Nucleic Acid Quantification Assays.

    PubMed

    Morinishi, Leanna S; Blainey, Paul

    2015-01-01

    Digital assays are powerful methods that enable detection of rare cells and counting of individual nucleic acid molecules. However, digital assays are still not routinely applied, due to the cost and specific equipment associated with commercially available methods. Here we present a simplified method for readout of digital droplet assays using a conventional real-time PCR instrument to measure bulk fluorescence of droplet-based digital assays. We characterize the performance of the bulk readout assay using synthetic droplet mixtures and a droplet digital multiple displacement amplification (MDA) assay. Quantitative MDA particularly benefits from a digital reaction format, but our new method applies to any digital assay. For established digital assay protocols such as digital PCR, this method serves to speed up and simplify assay readout. Our bulk readout methodology brings the advantages of partitioned assays without the need for specialized readout instrumentation. The principal limitations of the bulk readout methodology are reduced dynamic range compared with droplet-counting platforms and the need for a standard sample, although the requirements for this standard are less demanding than for a conventional real-time experiment. Quantitative whole genome amplification (WGA) is used to test for contaminants in WGA reactions and is the most sensitive way to detect the presence of DNA fragments with unknown sequences, giving the method great promise in diverse application areas including pharmaceutical quality control and astrobiology. PMID:26436576

  12. Review of results for the NA62 gigatracker read-out prototype

    NASA Astrophysics Data System (ADS)

    Martin, E.; Aglieri Rinella, G.; Carassiti, V.; Ceccucci, A.; Cortina Gil, E.; Cotta Ramusino, A.; Dellacasa, G.; Fiorini, M.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petagna, P.; Petrucci, F.; Perktold, L.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    2012-03-01

    The Gigatracker (GTK) is a hybrid silicon pixel detector developed for NA62, an experiment studying ultra-rare kaon decays at the CERN SPS. The main characteristics are a time-tagging resoluion of 150ps, with low material budget per station (0.5% X0) and a fluence comparable to the one expected for the inner trackers of LHC detectors in 10 years of operation. To compensate the time-walk, two read-out architectures have been designed and produced. The first architecture is based on a Constant Fraction Discriminator (CFD) followed by an on-pixel Time-to-Digital-Converter (TDC). The second architecture is based on a on-pixel group shared TDC. The GTK system developments are described: the integration steps (assembly and cooling) and the results obtained from the prototypes fabricated for the two read-out architectures.

  13. Challenges of small-pixel infrared detectors: a review

    NASA Astrophysics Data System (ADS)

    Rogalski, A.; Martyniuk, P.; Kopytko, M.

    2016-04-01

    In the last two decades, several new concepts for improving the performance of infrared detectors have been proposed. These new concepts particularly address the drive towards the so-called high operating temperature focal plane arrays (FPAs), aiming to increase detector operating temperatures, and as a consequence reduce the cost of infrared systems. In imaging systems with the above megapixel formats, pixel dimension plays a crucial role in determining critical system attributes such as system size, weight and power consumption (SWaP). The advent of smaller pixels has also resulted in the superior spatial and temperature resolution of these systems. Optimum pixel dimensions are limited by diffraction effects from the aperture, and are in turn wavelength-dependent. In this paper, the key challenges in realizing optimum pixel dimensions in FPA design including dark current, pixel hybridization, pixel delineation, and unit cell readout capacity are outlined to achieve a sufficiently adequate modulation transfer function for the ultra-small pitches involved. Both photon and thermal detectors have been considered. Concerning infrared photon detectors, the trade-offs between two types of competing technology—HgCdTe material systems and III-V materials (mainly barrier detectors)—have been investigated.

  14. FITPix COMBO—Timepix detector with integrated analog signal spectrometric readout

    NASA Astrophysics Data System (ADS)

    Holik, M.; Kraus, V.; Georgiev, V.; Granja, C.

    2016-02-01

    The hybrid semiconductor pixel detector Timepix has proven a powerful tool in radiation detection and imaging. Energy loss and directional sensitivity as well as particle type resolving power are possible by high resolution particle tracking and per-pixel energy and quantum-counting capability. The spectrometric resolving power of the detector can be further enhanced by analyzing the analog signal of the detector common sensor electrode (also called back-side pulse). In this work we present a new compact readout interface, based on the FITPix readout architecture, extended with integrated analog electronics for the detector's common sensor signal. Integrating simultaneous operation of the digital per-pixel information with the common sensor (called also back-side electrode) analog pulse processing circuitry into one device enhances the detector capabilities and opens new applications. Thanks to noise suppression and built-in electromagnetic interference shielding the common hardware platform enables parallel analog signal spectroscopy on the back side pulse signal with full operation and read-out of the pixelated digital part, the noise level is 600 keV and spectrometric resolution around 100 keV for 5.5 MeV alpha particles. Self-triggering is implemented with delay of few tens of ns making use of adjustable low-energy threshold of the particle analog signal amplitude. The digital pixelated full frame can be thus triggered and recorded together with the common sensor analog signal. The waveform, which is sampled with frequency 100 MHz, can be recorded in adjustable time window including time prior to the trigger level. An integrated software tool provides control, on-line display and read-out of both analog and digital channels. Both the pixelated digital record and the analog waveform are synchronized and written out by common time stamp.

  15. Hiding an image with a light-scattering medium and use of a contrast-discrimination method for readout.

    PubMed

    Hayasaki, Yoshio; Matsuba, Yoshiaki; Nagaoka, Atsushi; Yamamoto, Hirotsugu; Nishida, Nobuo

    2004-03-01

    Hiding image data with a material such as a light-scattering medium is useful as an initial stage of data protection, because the hidden image can be detected only by observation with a specific technique. A light-scattering medium is used to hide the image data, and a low-temporal-coherence interferometer performs the readout processing. A new readout method for detecting pixel values of the image is proposed to overcome spatial variation of the light intensity and distortion of the interference fringes. The introduction of spatial coding further improves the performance by overcoming spatial variations of the light-scattering medium and variations in the reflectance of given pixels.

  16. VERITAS 2.0 a multi-channel readout ASIC suitable for the DEPFET arrays of the WFI for Athena

    NASA Astrophysics Data System (ADS)

    Porro, Matteo; Bianchi, Davide; De Vita, Giulio; Herrmann, Sven; Wassatsch, Andreas; Bähr, Alexander; Bergbauer, Bettina; Meidinger, Norbert; Ott, Sabine; Treis, Johannes

    2014-07-01

    VERITAS 2.0 is a multi-channel readout ASIC for pnCCDs and DEPFET arrays. The main chip application is the readout of the DEPFET pixel arrays of the Wide Field Imager for the Athena mission. Every readout channel implements a trapezoidal weighting function and it is based on a fully differential architecture. VERITAS 2.0 is the first ASIC able to readout the DEPFETs both in source follower mode and in drain current mode. The drain readout should make it possible to achieve a processing time of about 2-3 μs/line with an electronics noise <= 5 electrons r.m.s.. The main concept and first measurements are presented.

  17. STIS CCD Hot Pixel Annealing

    NASA Astrophysics Data System (ADS)

    Hernandez, Svea

    2013-10-01

    This purpose of this activity is to repair radiation induced hot pixel damage to theSTIS CCD by warming the CCD to the ambient instrument temperature and annealing radiation damaged pixels. Radiation damage creates hot pixels in the STIS CCD Detector. Many of these hot pixels can be repaired by warming the CCD from its normal operating temperature near-83 C to the ambient instrument temperature { +5 C} for several hours. The number of hot pixels repaired is a function of annealing temperature. The effectiveness of the CCD hot pixel annealing process is assessed by measuring the dark current behavior before and after annealing and by searching for any window contamination effects.

  18. Tests of CMS Phase 1 Pixel Upgrade Back-End Electronics

    NASA Astrophysics Data System (ADS)

    Kilpatrick, Matthew

    2016-03-01

    The CMS detector will be upgraded so that it can handle the higher instantaneous luminosity of the 13-14 TeV collisions. The Phase 1 Pixel detector will experience a higher density of particle interactions requiring new front-end and read-out electronics. A front-end pixel data emulator was developed to validate the back-end readout electronics prior to installation and operation. A FPGA-based design emulates 400 Mbps data patterns from the front-end read-out chips and will be used to confirm that each Front End Driver (FED) can correctly decode and process the expected data patterns and error conditions. A FED test bench using the emulator can produce LHC-like conditions for stress testing FED hardware, firmware and online software. The design of the emulator and initial test results will be reported.

  19. High-Resolution Mammography Detector Employing Optical Switching Readout

    NASA Astrophysics Data System (ADS)

    Irisawa, Kaku; Kaneko, Yasuhisa; Yamane, Katsutoshi; Sendai, Tomonari; Hosoi, Yuichi

    Conceiving a new detector structure, FUJIFILM Corporation has successfully put its invention of an X-ray detector employing "Optical Switching" into practical use. Since Optical Switching Technology allows an electrode structure to be easily designed, both high resolution of pixel pitch and low electrical noise readout have been achieved, which have consequently realized the world's smallest pixel size of 50×50 μm2 from a Direct-conversion FPD system as well as high DQE. The digital mammography system equipped with this detector enables to acquire high definition images while maintaining granularity. Its outstanding feature is to be able to acquire high-precision images of microcalcifications which is an important index in breast examination.

  20. Beam test results of the BTeV silicon pixel detector

    SciTech Connect

    Gabriele Chiodini et al.

    2000-09-28

    The authors have described the results of the BTeV silicon pixel detector beam test. The pixel detectors under test used samples of the first two generations of Fermilab pixel readout chips, FPIX0 and FPIX1, (indium bump-bonded to ATLAS sensor prototypes). The spatial resolution achieved using analog charge information is excellent for a large range of track inclination. The resolution is still very good using only 2-bit charge information. A relatively small dependence of the resolution on bias voltage is observed. The resolution is observed to depend dramatically on the discriminator threshold, and it deteriorates rapidly for threshold above 4000e{sup {minus}}.

  1. Low-power clock distribution circuits for the Macro Pixel ASIC

    NASA Astrophysics Data System (ADS)

    Gaioni, L.; De Canio, F.; Manghisoni, M.; Ratti, L.; Re, V.; Traversi, G.; Marchioro, A.; Kloukinas, K.

    2015-01-01

    Clock distribution circuits account for a significant fraction of the power dissipation of the Macro Pixel ASIC (MPA), designed for the pixel layer readout of the so-called Pixel-Strip module in the innermost part of the CMS tracker at the HL-LHC. This work reviews different CMOS circuit architectures envisioned for low power clock distribution in the MPA. Two main topologies will be discussed, based on standard supply voltage and on auxiliary, reduced supply. Circuit performance, in terms of power consumption and speed, is evaluated for each of the proposed solutions and compared with that relevant to standard CMOS drivers.

  2. Automated procedures for the assembly of the CMS Phase 1 upgrade pixel modules

    NASA Astrophysics Data System (ADS)

    Wade, Alex; CMS Collaboration

    2016-03-01

    The Phase 1 upgrade of the pixel tracker for the CMS experiment requires the assembly of approximately 1000 modules consisting of pixel sensors bump bonded to readout chips. The precision assembly of modules in this volume is made possible using several robotic processes for dispensing epoxy,positioning of sensor components, automatic wire-bonding and robotic deposition of elastomer for wire bond encapsulation. We will describe the these processes in detail, along with the measurements that quanitfy the quality of assembled modules, and describe the subsequent steps in which the sensor modules are used in the construction of the Phase 1 pixel tracker. With support from USCMS.

  3. Design and test of clock distribution circuits for the Macro Pixel ASIC

    NASA Astrophysics Data System (ADS)

    Gaioni, L.; De Canio, F.; Manghisoni, M.; Ratti, L.; Re, V.; Traversi, G.

    2016-07-01

    Clock distribution circuits account for a significant fraction of the power dissipation of the Macro Pixel ASIC (MPA), designed for the pixel layer readout of the so-called Pixel-Strip module in the innermost part of the CMS tracker at the High Luminosity LHC. A test chip including low power clock distribution circuits of the MPA has been designed in a 65 nm CMOS technology and thoroughly tested. This work summarizes the experimental results relevant to the prototype chip, focusing particularly on the power and speed performance and compares such results with those coming from circuit simulations.

  4. Further applications for mosaic pixel FPA technology

    NASA Astrophysics Data System (ADS)

    Liddiard, Kevin C.

    2011-06-01

    In previous papers to this SPIE forum the development of novel technology for next generation PIR security sensors has been described. This technology combines the mosaic pixel FPA concept with low cost optics and purpose-designed readout electronics to provide a higher performance and affordable alternative to current PIR sensor technology, including an imaging capability. Progressive development has resulted in increased performance and transition from conventional microbolometer fabrication to manufacture on 8 or 12 inch CMOS/MEMS fabrication lines. A number of spin-off applications have been identified. In this paper two specific applications are highlighted: high performance imaging IRFPA design and forest fire detection. The former involves optional design for small pixel high performance imaging. The latter involves cheap expendable sensors which can detect approaching fire fronts and send alarms with positional data via mobile phone or satellite link. We also introduce to this SPIE forum the application of microbolometer IR sensor technology to IoT, the Internet of Things.

  5. A data parallel digitizer for a time-based simulation of CMOS Monolithic Active Pixel Sensors with FairRoot

    NASA Astrophysics Data System (ADS)

    Sitzmann, P.; Amar-Youcef, S.; Doering, D.; Deveaux, M.; Fröhlich, I.; Koziel, M.; Krebs, E.; Linnik, B.; Michel, J.; Milanovic, B.; Müntz, C.; Li, Q.; Stroth, J.; Tischler, T.

    2014-06-01

    CMOS Monolithic Active Pixel Sensors (MAPS) demonstrated excellent performances in the field of charged particle tracking. They feature an excellent single point resolution of few μm, a light material budget of 0.05% Xo in combination with a good radiation tolerance and time resolution. This makes the sensors a valuable technology for micro vertex detectors (MVD) of various experiments in heavy ion and particle physics like STAR and CBM. State of the art MAPS are equipped with a rolling shutter readout. Therefore, the data of one individual event is typically found in more than one data train generated by the sensor. This paper presents a concept to introduce this feature in both simulation and data analysis, taking profit of the sensor topology of the MVD. This topology allows to use for massive parallel data streaming and handling strategies within the FairRoot framework.

  6. Side readout of long scintillation crystal elements with digital SiPM for TOF-DOI PET

    SciTech Connect

    Yeom, Jung Yeol E-mail: cslevin@stanford.edu; Vinke, Ruud; Levin, Craig S. E-mail: cslevin@stanford.edu

    2014-12-15

    Purpose: Side readout of scintillation light from crystal elements in positron emission tomography (PET) is an alternative to conventional end-readout configurations, with the benefit of being able to provide accurate depth-of-interaction (DOI) information and good energy resolution while achieving excellent timing resolution required for time-of-flight PET. This paper explores different readout geometries of scintillation crystal elements with the goal of achieving a detector that simultaneously achieves excellent timing resolution, energy resolution, spatial resolution, and photon sensitivity. Methods: The performance of discrete LYSO scintillation elements of different lengths read out from the end/side with digital silicon photomultipliers (dSiPMs) has been assessed. Results: Compared to 3 × 3 × 20 mm{sup 3} LYSO crystals read out from their ends with a coincidence resolving time (CRT) of 162 ± 6 ps FWHM and saturated energy spectra, a side-readout configuration achieved an excellent CRT of 144 ± 2 ps FWHM after correcting for timing skews within the dSiPM and an energy resolution of 11.8% ± 0.2% without requiring energy saturation correction. Using a maximum likelihood estimation method on individual dSiPM pixel response that corresponds to different 511 keV photon interaction positions, the DOI resolution of this 3 × 3 × 20 mm{sup 3} crystal side-readout configuration was computed to be 0.8 mm FWHM with negligible artifacts at the crystal ends. On the other hand, with smaller 3 × 3 × 5 mm{sup 3} LYSO crystals that can also be tiled/stacked to provide DOI information, a timing resolution of 134 ± 6 ps was attained but produced highly saturated energy spectra. Conclusions: The energy, timing, and DOI resolution information extracted from the side of long scintillation crystal elements coupled to dSiPM have been acquired for the first time. The authors conclude in this proof of concept study that such detector configuration has the potential to enable

  7. Focal plane infrared readout circuit

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor)

    2002-01-01

    An infrared imager, such as a spectrometer, includes multiple infrared photodetectors and readout circuits for reading out signals from the photodetectors. Each readout circuit includes a buffered direct injection input circuit including a differential amplifier with active feedback provided through an injection transistor. The differential amplifier includes a pair of input transistors, a pair of cascode transistors and a current mirror load. Photocurrent from a photodetector can be injected onto an integration capacitor in the readout circuit with high injection efficiency at high speed. A high speed, low noise, wide dynamic range linear infrared multiplexer array for reading out infrared detectors with large capacitances can be achieved even when short exposure times are used. The effect of image lag can be reduced.

  8. Beam test results of pixel triggerless prototypes for the PbarANDA MVD

    NASA Astrophysics Data System (ADS)

    Calvo, Daniela; De Remigis, Paolo; Filippi, Alessandra; Mazza, Giovanni; Rivetti, Angelo; Wheadon, Richard; De Mori, Francesca; Marcello, Simonetta; Zotti, Laura; Bianco, Simone; Zaunick, Hans-Georg; Brinkmann, Kai-Thomas; Quagli, Tommaso; Schnell, Robert

    2013-12-01

    Hybrid pixel and double sided silicon microstrip devices will equip the Micro Vertex Detector of the PbarANDA experiment. The most challenging request of the experiment is the continuous readout at the rate of 2×107 interactions/s. The detector is in an advanced R&D phase and pixel assemblies, composed of thinned epitaxial sensor read out by the custom chip prototype ToPix, developed in the 130 nm CMOS technology, were produced. The triggerless ASIC implements readout channels that are able to detect signals and transmit the information with a precise timestamp. It performs the energy loss measurement using the Time over Threshold technique, in the input range to about 50 fC. A dedicated testing bench allows the control and the readout of each single chip assembly. Two experimental setups were assembled for testing these first single chip prototypes with pions at CERN, T9, in August 2012. The first one is based on a pixel assembly positioned in the middle of a telescope composed of double sided silicon strips sensors. A 50 MHz clock signal synchronizes these two systems, the triggerless pixels and the strip detectors triggered by scintillation detectors. The second experimental setup is a tracking station housing four pixel assemblies. First results will be reported.

  9. A 2D smart pixel detector for time-resolved protein crystallography

    SciTech Connect

    Beuville, E.; Cork, C.; Earnest, T.

    1995-10-01

    A smart pixel detector is being developed for Time Resolved Crystallography for biological and material science applications. Using the Pixel detector presented here, the Laue method will enable the study of the evolution of structural changes that occur within the protein as a function of time. The x-ray pixellated detector is assembled to the integrated circuit through a bump bonding process. Within a pixel size of 150 x 150 {mu}m{sup 2}, a low noise preamplifier-shaper, a discriminator, a 3 bit counter and the readout logic are integrated. The readout, based on the Column Architecture principle, will accept hit rates above 5x10{sup 8}/cm{sup 2}/s with a maximum hit rate per pixel of 1 MHz. This detector will allow time resolved Laue crystallography to be performed in a frameless operation mode, without dead time. Target specifications, architecture, and preliminary results on the 8 x 8 front-end prototype and column readout are presented.

  10. Development of Kilo-Pixel Arrays of Transition-Edge Sensors for X-Ray Spectroscopy

    NASA Technical Reports Server (NTRS)

    Adams, J. S.; Bandler, S. R.; Busch, S. E.; Chervenak, J. A.; Chiao, M. P.; Eckart, M. E.; Ewin, A. J.; Finkbeiner, F. M.; Kelley, R. L.; Kelly, D. P.; Kilbourne, C. A.; Leutenegger, M. A.; Porst, J.-P.; Porter, F. S.; Ray, C. A.; Sadleir, J. E.; Smith, S. J.; Wassell, E. J.; Doriese, W. B.; Fowler, J. W.; Hilton, G. C.; Irwin, K. D.; Reintsema, C. D.; Smith, D. R.; Swetz, D. S.

    2012-01-01

    We are developing kilo-pixel arrays of transition-edge sensor (TES) microcalorimeters for future X-ray astronomy observatories or for use in laboratory astrophysics applications. For example, Athena/XMS (currently under study by the european space agency) would require a close-packed 32x32 pixel array on a 250-micron pitch with < 3.0 eV full-width-half-maximum energy resolution at 6 keV and at count-rates of up to 50 counts/pixel/second. We present characterization of 32x32 arrays. These detectors will be readout using state of the art SQUID based time-domain multiplexing (TDM). We will also present the latest results in integrating these detectors and the TDM readout technology into a 16 row x N column field-able instrument.

  11. Linear readout of object manifolds

    NASA Astrophysics Data System (ADS)

    Chung, SueYeon; Lee, Daniel D.; Sompolinsky, Haim

    2016-06-01

    Objects are represented in sensory systems by continuous manifolds due to sensitivity of neuronal responses to changes in physical features such as location, orientation, and intensity. What makes certain sensory representations better suited for invariant decoding of objects by downstream networks? We present a theory that characterizes the ability of a linear readout network, the perceptron, to classify objects from variable neural responses. We show how the readout perceptron capacity depends on the dimensionality, size, and shape of the object manifolds in its input neural representation.

  12. High-speed readout solution for single-photon counting ASICs

    NASA Astrophysics Data System (ADS)

    Kmon, P.; Szczygiel, R.; Maj, P.; Grybos, P.; Kleczek, R.

    2016-02-01

    We report on the analysis, simulations and measurements of both noise and high-count rate performance of a single photon counting integrated circuit called UFXC32k designed for hybrid pixel detectors for various applications in X-ray imaging. The dimensions of the UFCX32k designed in CMOS 130 nm technology are 9.63 mm × 20.15 mm. The integrated circuit core is a matrix of 128 × 256 squared readout pixels with a pitch of 75 μm. Each readout pixel contains a charge sensitive amplifier (CSA), a shaper, two discriminators and two 14-bit ripple counters. The UFXC32k was bump-bonded to a silicon pixel detector with the thickness of 320 μm and characterized with the X-ray radiation source. The CSA feedback based on the Krummenacher circuit determines both the count rate performance and the noise of the readout front-end electronics. For the default setting of the CSA feedback, the measured front-end electronics dead time is 232 ns (paralyzable model) and the equivalent noise charge (ENC) is equal to 123 el. rms. For the high count rate setting of the CSA feedback, the dead time is only 101 ns and the ENC is equal to 163 el. rms.

  13. PIXSCAN: Pixel detector CT-scanner for small animal imaging

    NASA Astrophysics Data System (ADS)

    Delpierre, P.; Debarbieux, F.; Basolo, S.; Berar, J. F.; Bonissent, A.; Boudet, N.; Breugnon, P.; Caillot, B.; Cassol Brunner, F.; Chantepie, B.; Clemens, J. C.; Dinkespiler, B.; Khouri, R.; Koudobine, I.; Mararazzo, V.; Meessen, C.; Menouni, M.; Morel, C.; Mouget, C.; Pangaud, P.; Peyrin, F.; Rougon, G.; Sappey-Marinier, D.; Valton, S.; Vigeolas, E.

    2007-02-01

    The PIXSCAN is a small animal CT-scanner based on hybrid pixel detectors. These detectors provide very large dynamic range of photons counting at very low detector noise. They also provide high counting rates with fast image readout. Detection efficiency can be optimized by selecting the sensor medium according to the working energy range. Indeed, the use of CdTe allows a detection efficiency of 100% up to 50 keV. Altogether these characteristics are expected to improve the contrast of the CT-scanner, especially for soft tissues, and to reduce both the scan duration and the absorbed dose. A proof of principle has been performed by assembling into a PIXSCAN-XPAD2 prototype the photon counting pixel detector initially built for detection of X-ray synchrotron radiations. Despite the relatively large pixel size of this detector (330×330 μm 2), we can present three-dimensional tomographic reconstruction of mice at good contrast and spatial resolution. A new photon counting chip (XPAD3) is designed in sub-micronique technology to achieve 130×130 μm 2 pixels. This improved circuit has been equipped with an energy selection circuit to act as a band-pass emission filter. Furthermore, the PIXSCAN-XPAD3 hybrid pixel detectors will be combined with the Lausanne ClearPET scanner demonstrator. CT image reconstruction in this non-conventional geometry is under study for this purpose.

  14. Vivid, full-color aluminum plasmonic pixels

    PubMed Central

    Olson, Jana; Manjavacas, Alejandro; Liu, Lifei; Chang, Wei-Shun; Foerster, Benjamin; King, Nicholas S.; Knight, Mark W.; Nordlander, Peter; Halas, Naomi J.; Link, Stephan

    2014-01-01

    Aluminum is abundant, low in cost, compatible with complementary metal-oxide semiconductor manufacturing methods, and capable of supporting tunable plasmon resonance structures that span the entire visible spectrum. However, the use of Al for color displays has been limited by its intrinsically broad spectral features. Here we show that vivid, highly polarized, and broadly tunable color pixels can be produced from periodic patterns of oriented Al nanorods. Whereas the nanorod longitudinal plasmon resonance is largely responsible for pixel color, far-field diffractive coupling is used to narrow the plasmon linewidth, enabling monochromatic coloration and significantly enhancing the far-field scattering intensity of the individual nanorod elements. The bright coloration can be observed with p-polarized white light excitation, consistent with the use of this approach in display devices. The resulting color pixels are constructed with a simple design, are compatible with scalable fabrication methods, and provide contrast ratios exceeding 100:1. PMID:25225385

  15. Commissioning of the upgraded ATLAS Pixel Detector for Run2 at LHC

    NASA Astrophysics Data System (ADS)

    Dobos, Daniel

    2016-07-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long showdown, the detector was extracted from the experiment and brought to the surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer, a fourth layer of pixel detectors, installed in May 2014 between the existing Pixel Detector and a new smaller radius beam-pipe at a radius of 3.3 cm. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. An overview of the refurbishing of the Pixel Detector and of the IBL project as well as early performance tests using cosmic rays and beam data will be presented.

  16. Demonstration of Time Domain Multiplexed Readout for Magnetically Coupled Calorimeters

    NASA Technical Reports Server (NTRS)

    Porst, J.-P.; Adams, J. S.; Balvin, M.; Bandler, S.; Beyer, J.; Busch, S. E.; Drung, D.; Seidel, G. M.; Smith, S. J.; Stevenson, T. R.

    2012-01-01

    Magnetically coupled calorimeters (MCC) have extremely high potential for x-ray applications due to the inherent high energy resolution capability and being non-dissipative. Although very high energy-resolution has been demonstrated, until now there has been no demonstration of multiplexed read-out. We report on the first realization of a time domain multiplexed (TDM) read-out. While this has many similarities with TDM of transition-edge-sensors (TES), for MGGs the energy resolution is limited by the SQUID read-out noise and requires the well established scheme to be altered in order to minimize degradation due to noise aliasing effects. In cur approach, each pixel is read out by a single first stage SQUID (SQ1) that is operated in open loop. The outputs of the SQ1 s are low-pass filtered with an array of low cross-talk inductors, then fed into a single-stage SQUID TD multiplexer. The multiplexer is addressed from room temperature and read out through a single amplifier channel. We present results achieved with a new detector platform. Noise performance is presented and compared to expectations. We have demonstrated multiplexed X-ray spectroscopy at 5.9keV with delta_FWHM=10eV. In an optimized setup, we show it is possible to multiplex 32 detectors without significantly degrading the Intrinsic detector resolution.

  17. The ALICE Pixel Detector

    NASA Astrophysics Data System (ADS)

    Mercado-Perez, Jorge

    2002-07-01

    The present document is a brief summary of the performed activities during the 2001 Summer Student Programme at CERN under the Scientific Summer at Foreign Laboratories Program organized by the Particles and Fields Division of the Mexican Physical Society (Sociedad Mexicana de Fisica). In this case, the activities were related with the ALICE Pixel Group of the EP-AIT Division, under the supervision of Jeroen van Hunen, research fellow in this group. First, I give an introduction and overview to the ALICE experiment; followed by a description of wafer probing. A brief summary of the test beam that we had from July 13th to July 25th is given as well.

  18. Proposal for a shift register approach to RPC calorimeter readout for test beam, cosmics, and sources.

    SciTech Connect

    Underwood, D. G.

    2004-09-28

    Resistive Plate Chambers for Hadronic Particle-Flow calorimetry will have a large number of pixels. We present tests of a system for readout with parallel vertical shift registers, somewhat like that used in CCD imaging. In our case we discriminate on the signal immediately after amplification and shaping, and only shift single bits. We discuss the issues involved in a particular model for using off-the-shelf commercial chips for readout on a moderate scale. We have a 32 channel prototype in operation on an RPC, and we describe tests with the amplifiers etc leading up to this. The prototype is an example of a layout for the chips to be mounted on the readout pad for an RPC to make a thin assembly. Comparisons to other systems are made for cost scaling, modes of operation, etc. This particular implementation uses analog delay instead of a digital pipeline, and has no clock on the board during detector live time. This RPC readout system could be implemented quickly. Production of this system should have minimal start-up costs and minimal start-up times. One advantage of the present system would be to provide readout of large numbers of channels on a short development time scale at low cost. This would allow initial tuning of the reconstruction and analysis software in a test beam before other readout systems are ready. It also provides risk management by development of another technology at small additional cost.

  19. Super-framing technique based on digital readout for infrared thermal image systems

    NASA Astrophysics Data System (ADS)

    Yao, Libin

    2014-11-01

    Photo current integration is the key to improve the performance of a thermal imaging system. By integrating the photo current in the capacitance, the signal-to-noise ratio of the system is greatly improved. Theoretically, the maximum integration time of a thermal imaging system is the frame time of the system. However, due to the low well capacity of the readout integrated circuit, the integration time of the photo current is often shorter than the frame time of the system. To increase the well capacity of the readout circuit is one of the main research topics in thermal imaging system. The super-framing technique can overcome the restriction by reading-out the detector signal in a rate higher than the frame rate and then integrating the signal outside the IRFPA. As the signal integration is carried out outside the pixel, the integration time is no longer restricted. The key of the super-framing technique is the transmission of the signal in high readout rate. The digital readout circuit by integrating the analog-to-digital converter (ADC) array on the readout circuit chip becomes more and more popular with the development of CMOS technologies. Since the digital signal can be transferred outside the chip in a GS/s rate without any concern on noise and distortion, the super-framing technique based on digital readout circuit is advantageous over the analog solution.

  20. Smart pixel imaging with computational-imaging arrays

    NASA Astrophysics Data System (ADS)

    Fernandez-Cull, Christy; Tyrrell, Brian M.; D'Onofrio, Richard; Bolstad, Andrew; Lin, Joseph; Little, Jeffrey W.; Blackwell, Megan; Renzi, Matthew; Kelly, Mike

    2014-07-01

    Smart pixel imaging with computational-imaging arrays (SPICA) transfers image plane coding typically realized in the optical architecture to the digital domain of the focal plane array, thereby minimizing signal-to-noise losses associated with static filters or apertures and inherent diffraction concerns. MIT Lincoln Laboratory has been developing digitalpixel focal plane array (DFPA) devices for many years. In this work, we leverage legacy designs modified with new features to realize a computational imaging array (CIA) with advanced pixel-processing capabilities. We briefly review the use of DFPAs for on-chip background removal and image plane filtering. We focus on two digital readout integrated circuits (DROICS) as CIAs for two-dimensional (2D) transient target tracking and three-dimensional (3D) transient target estimation using per-pixel coded-apertures or flutter shutters. This paper describes two DROICs - a SWIR pixelprocessing imager (SWIR-PPI) and a Visible CIA (VISCIA). SWIR-PPI is a DROIC with a 1 kHz global frame rate with a maximum per-pixel shuttering rate of 100 MHz, such that each pixel can be modulated by a time-varying, pseudorandom, and duo-binary signal (+1,-1,0). Combining per-pixel time-domain coding and processing enables 3D (x,y,t) target estimation with limited loss of spatial resolution. We evaluate structured and pseudo-random encoding strategies and employ linear inversion and non-linear inversion using total-variation minimization to estimate a 3D data cube from a single 2D temporally-encoded measurement. The VISCIA DROIC, while low-resolution, has a 6 kHz global frame rate and simultaneously encodes eight periodic or aperiodic transient target signatures at a maximum rate of 50 MHz using eight 8-bit counters. By transferring pixel-based image plane coding to the DROIC and utilizing sophisticated processing, our CIAs enable on-chip temporal super-resolution.

  1. Position-Sensitive Nuclear Spectroscopy with Pixel Detectors

    SciTech Connect

    Granja, Carlos; Vykydal, Zdenek; Jakubek, Jan; Pospisil, Stanislav

    2007-10-26

    State-of-the-art hybrid semiconductor pixel detectors such as Medipix2 are suitable for energy- and position-sensitive nuclear spectroscopy. In addition to excellent energy- and spatial-resolution, these devices can operate in spectroscopic, single-quantum counting and/or on-line tracking mode. A devoted compact USB-readout interface provides functionality and ease of operation. The compact and versatile Medipix2/USB radiation camera provides visualization, vacuum and room-temperature operation as a real-time portable active nuclear emulsion.

  2. A Telescope Using CMS PSI46 Pixels and the CAPTAN for Acquisition and Control over Gigabit Ethernet

    SciTech Connect

    Rivera, Ryan A.; Turqueti, Marcos; Uplegger, Lorenzo; /Fermilab

    2009-01-01

    The Electronic Systems Engineering department of the Computing Division at the Fermi National Accelerator Laboratory has assembled a pixel test beam telescope for high energy physics detector research and development. The telescope features CMS PSI46 readout chips and a data acquisition and control system known as the Compact And Programmable daTa Acquisition Node or CAPTAN. The CAPTAN is a flexible and powerful system that meets the readout and control demands of a variety of pixel and strip detectors for high energy physics applications. The CAPTAN functions in a gigabit Ethernet network, which facilitates the coordination of the multiple pixel planes of the telescope. Through the use of the CAPTAN hardware, a unified telescope system is attained encompassing both the CMS PSI46 pixel components and adevice under test. This paper discusses results from the telescope project including mechanical design, alignment procedure, and attainble precision.

  3. ACS/WFC Pixel Stability - Bringing the Pixels Back to the Science

    NASA Astrophysics Data System (ADS)

    Borncamp, David; Grogin, Norman A.; Bourque, Matthew; Ogaz, Sara

    2016-06-01

    Electrical current that has been trapped within the lattice structure of a Charged Coupled Device (CCD) can be present through multiple exposures, which will have an adverse effect on its science performance. The traditional way to correct for this extra charge is to take an image with the camera shutter closed periodically throughout the lifetime of the instrument. These images, generally referred to as dark images, allow for the characterization of the extra charge that is trapped within the CCD at the time of observation. This extra current can then be subtracted out of science images to correct for the extra charge that was there at this time. Pixels that have a charge above a certain threshold of current are marked as “hot” and flagged in the data quality array. However, these pixels may not be "bad" in the traditional sense that they cannot be reliably dark-subtracted. If these pixels are shown to be stable over an anneal period, the charge can be properly subtracted and the extra noise from this dark current can be taken into account. We present the results of a pixel history study that analyzes every pixel of ACS/WFC individually and allows pixels that were marked as bad to be brought back into the science image.

  4. X-ray imaging using a 320 x 240 hybrid GaAs pixel detector

    SciTech Connect

    Irsigler, R.; Andersson, J.; Alverbro, J.

    1999-06-01

    The authors present room temperature measurements on 200 {micro}m thick GaAs pixel detectors, which were hybridized to silicon readout circuits. The whole detector array contains 320 x 240 square shaped pixel with a pitch of 38 {micro}m and is based on semi-insulating liquid-encapsulated Czochralski (LEC) GaAs material. After fabricating and dicing, the detector chips were indium bump flip chip bonded to CMOS readout circuits based on charge integration and finally evaluated. This readout chip was originally designed for the readout of flip chip bonded infrared detectors, but appears to be suitable for X-ray applications as well. A bias voltage between 50 V and 100 V was sufficient to operate the detector at room temperature. The detector array did respond to x-ray radiation by an increase in current due to production of electron hole pairs by the ionization processes. Images of various objects and slit patterns were acquired by using a standard X-ray source for dental imaging. The new X-ray hybrid detector was analyzed with respect to its imaging properties. Due to the high absorption coefficient for X-rays in GaAs and the small pixel size, the sensor shows a high modulation transfer function up to the Nyquist frequency.

  5. Development of active edge pixel sensors and four-side buttable modules using vertical integration technologies

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Andricek, L.; Moser, H.-G.; Nisius, R.; Richter, R. H.; Terzo, S.; Weigell, P.

    2014-11-01

    We present an R&D activity focused on the development of novel modules for the upgrade of the ATLAS pixel system at the High Luminosity LHC (HL-LHC). The modules consist of n-in-p pixel sensors, 100 or 200 μm thick, produced at VTT (Finland) with an active edge technology, which considerably reduces the dead area at the periphery of the device. The sensors are interconnected with solder bump-bonding to the ATLAS FE-I3 and FE-I4 read-out chips, and characterised with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements will be discussed for devices before and after irradiation up to a fluence of 5 ×1015neq /cm2. We will also report on the R&D activity to obtain Inter Chip Vias (ICVs) on the ATLAS read-out chip in collaboration with the Fraunhofer Institute EMFT. This step is meant to prove the feasibility of the signal transport to the newly created readout pads on the backside of the chips allowing for four side buttable devices without the presently used cantilever for wire bonding. The read-out chips with ICVs will be interconnected to thin pixel sensors, 75 μm and 150 μm thick, with the Solid Liquid Interdiffusion (SLID) technology, which is an alternative to the standard solder bump-bonding.

  6. Increased space-bandwidth product in pixel super-resolved lensfree on-chip microscopy

    PubMed Central

    Greenbaum, Alon; Luo, Wei; Khademhosseinieh, Bahar; Su, Ting-Wei; Coskun, Ahmet F.; Ozcan, Aydogan

    2013-01-01

    Pixel-size limitation of lensfree on-chip microscopy can be circumvented by utilizing pixel-super-resolution techniques to synthesize a smaller effective pixel, improving the resolution. Here we report that by using the two-dimensional pixel-function of an image sensor-array as an input to lensfree image reconstruction, pixel-super-resolution can improve the numerical aperture of the reconstructed image by ~3 fold compared to a raw lensfree image. This improvement was confirmed using two different sensor-arrays that significantly vary in their pixel-sizes, circuit architectures and digital/optical readout mechanisms, empirically pointing to roughly the same space-bandwidth improvement factor regardless of the sensor-array employed in our set-up. Furthermore, such a pixel-count increase also renders our on-chip microscope into a Giga-pixel imager, where an effective pixel count of ~1.6–2.5 billion can be obtained with different sensors. Finally, using an ultra-violet light-emitting-diode, this platform resolves 225 nm grating lines and can be useful for wide-field on-chip imaging of nano-scale objects, e.g., multi-walled-carbon-nanotubes.

  7. Imaging properties of pixellated scintillators with deep pixels

    NASA Astrophysics Data System (ADS)

    Barber, H. Bradford; Fastje, David; Lemieux, Daniel; Grim, Gary P.; Furenlid, Lars R.; Miller, Brian W.; Parkhurst, Philip; Nagarkar, Vivek V.

    2014-09-01

    We have investigated the light-transport properties of scintillator arrays with long, thin pixels (deep pixels) for use in high-energy gamma-ray imaging. We compared 10x10 pixel arrays of YSO:Ce, LYSO:Ce and BGO (1mm x 1mm x 20 mm pixels) made by Proteus, Inc. with similar 10x10 arrays of LSO:Ce and BGO (1mm x 1mm x 15mm pixels) loaned to us by Saint-Gobain. The imaging and spectroscopic behaviors of these scintillator arrays are strongly affected by the choice of a reflector used as an inter-pixel spacer (3M ESR in the case of the Proteus arrays and white, diffuse-reflector for the Saint-Gobain arrays). We have constructed a 3700-pixel LYSO:Ce Prototype NIF Gamma-Ray Imager for use in diagnosing target compression in inertial confinement fusion. This system was tested at the OMEGA Laser and exhibited significant optical, inter-pixel cross-talk that was traced to the use of a single-layer of ESR film as an inter-pixel spacer. We show how the optical cross-talk can be mapped, and discuss correction procedures. We demonstrate a 10x10 YSO:Ce array as part of an iQID (formerly BazookaSPECT) imager and discuss issues related to the internal activity of 176Lu in LSO:Ce and LYSO:Ce detectors.

  8. Bonding techniques for hybrid active pixel sensors (HAPS)

    NASA Astrophysics Data System (ADS)

    Bigas, M.; Cabruja, E.; Lozano, M.

    2007-05-01

    A hybrid active pixel sensor (HAPS) consists of an array of sensing elements which is connected to an electronic read-out unit. The most used way to connect these two different devices is bump bonding. This interconnection technique is very suitable for these systems because it allows a very fine pitch and a high number of I/Os. However, there are other interconnection techniques available such as direct bonding. This paper, as a continuation of a review [M. Lozano, E. Cabruja, A. Collado, J. Santander, M. Ullan, Nucl. Instr. and Meth. A 473 (1-2) (2001) 95-101] published in 2001, presents an update of the different advanced bonding techniques available for manufacturing a hybrid active pixel detector.

  9. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation.

    PubMed

    Philipp, Hugh T; Tate, Mark W; Purohit, Prafull; Shanks, Katherine S; Weiss, Joel T; Gruner, Sol M

    2016-03-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8-12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10-100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed. PMID:26917125

  10. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation.

    PubMed

    Philipp, Hugh T; Tate, Mark W; Purohit, Prafull; Shanks, Katherine S; Weiss, Joel T; Gruner, Sol M

    2016-03-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8-12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10-100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed.

  11. High-speed X-ray imaging pixel array detector for synchrotron bunch isolation

    PubMed Central

    Philipp, Hugh T.; Tate, Mark W.; Purohit, Prafull; Shanks, Katherine S.; Weiss, Joel T.; Gruner, Sol M.

    2016-01-01

    A wide-dynamic-range imaging X-ray detector designed for recording successive frames at rates up to 10 MHz is described. X-ray imaging with frame rates of up to 6.5 MHz have been experimentally verified. The pixel design allows for up to 8–12 frames to be stored internally at high speed before readout, which occurs at a 1 kHz frame rate. An additional mode of operation allows the integration capacitors to be re-addressed repeatedly before readout which can enhance the signal-to-noise ratio of cyclical processes. This detector, along with modern storage ring sources which provide short (10–100 ps) and intense X-ray pulses at megahertz rates, opens new avenues for the study of rapid structural changes in materials. The detector consists of hybridized modules, each of which is comprised of a 500 µm-thick silicon X-ray sensor solder bump-bonded, pixel by pixel, to an application-specific integrated circuit. The format of each module is 128 × 128 pixels with a pixel pitch of 150 µm. In the prototype detector described here, the three-side buttable modules are tiled in a 3 × 2 array with a full format of 256 × 384 pixels. The characteristics, operation, testing and application of the detector are detailed. PMID:26917125

  12. Readout Techniques for Drift and Low Frequency Noise Rejection in Infrared Arrays

    NASA Astrophysics Data System (ADS)

    Finger, Gert; Dorn, Reinhold J.; Hoffman, Alan W.; Mehrgan, Hamid; Meyer, Manfred; Moorwood, Alan F. M.; Stegmeier, Joerg

    2002-10-01

    Three different methods are presentedto subtract thermal drifts and low-frequency noise from thesignal of infrared array. The first is dead pixels with openIndium bumps, the second is reference output as implemented onthe Hawaii2 multiplexer, and the third is dark pixels to emulatereference cells having a capacity connected to the gate of theunit cell field-effect transistor (FET). The third method is themost effective and yields a reduction in readout noise from15.4 9.4 erms. A novel method will be described to extend this readouttechnique to the Aladdin 1 K × 1 K InSb array.

  13. Readout circuit design of the retina-like CMOS image sensor

    NASA Astrophysics Data System (ADS)

    Cao, Fengmei; Song, Shengyu; Bai, Tingzhu; Cao, Nan

    2015-02-01

    Readout circuit is designed for a special retina-like CMOS image sensor. To realize the pixels timing drive and readout of the sensor, the Altera's Cyclone II FPGA is used as a control chip. The voltage of the sensor is supported by a voltage chip initialized by SPI with AVR MCU system. The analog image signal outputted by the sensor is converted to digital image data by 12-bits A/D converter ADS807 and the digital data is memorized in the SRAM. Using the Camera-link image grabber, the data stored in SRAM is transformed to image shown on PC. Experimental results show the circuit works well on retina-like CMOS timing drive and image readout and images can be displayed properly on the PC.

  14. Method for producing a hybridization of detector array and integrated circuit for readout

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R. (Inventor); Grunthaner, Frank J. (Inventor)

    1993-01-01

    A process is explained for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface on the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.

  15. Pixelation Effects in Weak Lensing

    NASA Astrophysics Data System (ADS)

    High, F. William; Rhodes, Jason; Massey, Richard; Ellis, Richard

    2007-11-01

    Weak gravitational lensing can be used to investigate both dark matter and dark energy but requires accurate measurements of the shapes of faint, distant galaxies. Such measurements are hindered by the finite resolution and pixel scale of digital cameras. We investigate the optimum choice of pixel scale for a space-based mission, using the engineering model and survey strategy of the proposed Supernova Acceleration Probe as a baseline. We do this by simulating realistic astronomical images containing a known input shear signal and then attempting to recover the signal using the Rhodes, Refregier, & Groth algorithm. We find that the quality of shear measurement is always improved by smaller pixels. However, in practice, telescopes are usually limited to a finite number of pixels and operational life span, so the total area of a survey increases with pixel size. We therefore fix the survey lifetime and the number of pixels in the focal plane while varying the pixel scale, thereby effectively varying the survey size. In a pure trade-off for image resolution versus survey area, we find that measurements of the matter power spectrum would have minimum statistical error with a pixel scale of 0.09" for a 0.14" FWHM point-spread function (PSF). The pixel scale could be increased to ~0.16" if images dithered by exactly half-pixel offsets were always available. Some of our results do depend on our adopted shape measurement method and should be regarded as an upper limit: future pipelines may require smaller pixels to overcome systematic floors not yet accessible, and, in certain circumstances, measuring the shape of the PSF might be more difficult than those of galaxies. However, the relative trends in our analysis are robust, especially those of the surface density of resolved galaxies. Our approach thus provides a snapshot of potential in available technology, and a practical counterpart to analytic studies of pixelation, which necessarily assume an idealized shape

  16. Spectral characterisation and noise performance of Vanilla—an active pixel sensor

    NASA Astrophysics Data System (ADS)

    Blue, Andrew; Bates, R.; Bohndiek, S. E.; Clark, A.; Arvanitis, Costas D.; Greenshaw, T.; Laing, A.; Maneuski, D.; Turchetta, R.; O'Shea, V.

    2008-06-01

    This work will report on the characterisation of a new active pixel sensor, Vanilla. The Vanilla comprises of 512×512 (25μm 2) pixels. The sensor has a 12 bit digital output for full-frame mode, although it can also be readout in analogue mode, whereby it can also be read in a fully programmable region-of-interest (ROI) mode. In full frame, the sensor can operate at a readout rate of more than 100 frames per second (fps), while in ROI mode, the speed depends on the size, shape and number of ROIs. For example, an ROI of 6×6 pixels can be read at 20,000 fps in analogue mode. Using photon transfer curve (PTC) measurements allowed for the calculation of the read noise, shot noise, full-well capacity and camera gain constant of the sensor. Spectral response measurements detailed the quantum efficiency (QE) of the detector through the UV and visible region. Analysis of the ROI readout mode was also performed. Such measurements suggest that the Vanilla APS (active pixel sensor) will be suitable for a wide range of applications including particle physics and medical imaging.

  17. 65 nm CMOS analog front-end for pixel detectors at the HL-LHC

    NASA Astrophysics Data System (ADS)

    Gaioni, L.; De Canio, F.; Manghisoni, M.; Ratti, L.; Re, V.; Traversi, G.

    2016-02-01

    This work is concerned with the design and the experimental characterization of analog front-end electronics conceived for experiments with unprecedented particle rates and radiation levels at future high-energy physics colliders. A prototype chip integrating different test structures has been submitted in the framework of the CHIPIX65 project. These structures are standalone channels for the readout of hybrid pixels, featuring a charge sensitive preamplifier as the first stage of the readout chain, a high-speed comparator and a circuit for fine threshold tuning. The paper thoroughly discusses the results, mainly focused on the charge sensitive amplifier, coming from the characterization of the submitted test structures.

  18. Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Nisius, R.; Savic, N.; Terzo, S.

    2016-09-01

    Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14 ×1015 neq /cm2 . The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50×50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80°) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.

  19. Silicon avalanche pixel sensor for high precision tracking

    NASA Astrophysics Data System (ADS)

    D'Ascenzo, N.; Marrocchesi, P. S.; Moon, C. S.; Morsani, F.; Ratti, L.; Saveliev, V.; Savoy Navarro, A.; Xie, Q.

    2014-03-01

    The development of an innovative position sensitive pixelated sensor to detect and measure with high precision the coordinates of the ionizing particles is proposed. The silicon avalanche pixel sensors (APiX) is based on the vertical integration of avalanche pixels connected in pairs and operated in coincidence in fully digital mode and with the processing electronics embedded on the chip. The APiX sensor addresses the need to minimize the material budget and related multiple scattering effects in tracking systems requiring a high spatial resolution in the presence of the large track occupancy. The expected operation of the new sensor features: low noise, low power consumption and suitable radiation tolerance. The APiX device provides on-chip digital information on the position of the coordinate of the impinging charged particle and can be seen as the building block of a modular system of pixelated arrays, implementing a sparsified readout. The technological challenges are the 3D integration of the device under CMOS processes and integration of processing electronics.

  20. A discrete component low-noise preamplifier readout for a linear (1×16) SiC photodiode array

    NASA Astrophysics Data System (ADS)

    Kahle, Duncan; Aslam, Shahid; Herrero, Federico A.; Waczynski, Augustyn

    2016-09-01

    A compact, low-noise and inexpensive preamplifier circuit has been designed and fabricated to optimally readout a common cathode (1×16) channel 4H-SiC Schottky photodiode array for use in ultraviolet experiments. The readout uses an operational amplifier with 10 pF capacitor in the feedback loop in parallel with a low leakage switch for each of the channels. This circuit configuration allows for reiterative sample, integrate and reset. A sampling technique is given to remove Johnson noise, enabling a femtoampere level readout noise performance. Commercial-off-the-shelf acquisition electronics are used to digitize the preamplifier analog signals. The data logging acquisition electronics has a different integration circuit, which allows the bandwidth and gain to be independently adjusted. Using this readout, photoresponse measurements across the array between spectral wavelengths 200 nm and 370 nm are made to establish the array pixels external quantum efficiency, current responsivity and noise equivalent power.

  1. Development of Frequency-Division Multiplexing Readout System for Large-Format TES X-ray Microcalorimeter Arrays

    NASA Astrophysics Data System (ADS)

    Sakai, K.; Yamamoto, R.; Takei, Y.; Mitsuda, K.; Yamasaki, N. Y.; Hidaka, M.; Nagasawa, S.; Kohjiro, S.; Miyazaki, T.

    2016-07-01

    We are developing the frequency-division multiplexing (FDM) readout system aimed to realize the 400-pixel transition edge sensor (TES) microcalorimeter array for the DIOS mission as well as large-format arrays with more than a thousand of TES for future space missions such as the ATHENA mission. The developed system consists of the low-power superconducting quantum interference device (SQUID), the digital FDM electronics, and the analog front-end to bridge the SQUID and the digital electronics. Using the developed readout system, we performed a TES readout experiment and succeeded to multiplex four TES signals with the single-staged cryogenic setup. We have experienced two issues during the experiment: an excess noise and crosstalk. The brief overview of the developed system and the details, results, and issues of the TES multiplexing readout experiment is discussed.

  2. A Digital Readout System For The CSO Microwave Kinetic Inductance Camera

    NASA Astrophysics Data System (ADS)

    Max-Moerbeck, Walter; Mazin, B. A.; Zmuidzinas, J.

    2007-12-01

    Submillimeter galaxies are important to the understanding of galaxy formation and evolution. Determination of the spectral energy distribution in the millimeter and submillimeter regimes allows important and powerful diagnostics. Our group is developing a camera for the Caltech Submillimeter Observatory (CSO) using Microwave Kinetic Inductance Detectors (MKIDs). MKIDs are superconducting devices whose impedance changes with the absorption of photons. The camera will have 600 spatial pixels and 4 bands at 750 μm, 850 μm, 1.1 mm and 1.3 mm. For each spatial pixel of the camera the radiation is coupled to the MKIDs using phased-array antennas. This signal is split into 4 different bands using filters and detected using the superconductor as part of a MKID's resonant circuit. The detection process consists of measurement of the changes in the transmission through the resonator when it is illuminated. By designing resonant circuits to have different resonant frequencies and high transmission out resonance, MKIDs can be frequency-domain multiplexed. This allows the simultaneous readout of many detectors through a single coaxial cable. The readout system makes use of microwave IQ modulation and is based on commercial electronics components operating at room temperature. The basic readout has been demonstrated on the CSO. We are working on the implementation of an improved design to be tested on a prototype system with 6x6 pixels and 4 colors next April on the CSO.

  3. Integrated multi-crate FERA readout system

    SciTech Connect

    Kistryn, S.; Bee, C.P.; Eberhardt, P.

    1997-12-31

    We discuss a moderate-size readout system based entirely on FERA compatible units. The implementation of a specially developed FERA Extender module is presented, whose main feature is the ability to distribute the system over many CAMAC crates. This provides a convenient way of splitting the FERA bus into several virtually independent sub-systems driven by individual gate signals. Tagging of the event fragments from each sub-system with an event number incremented on the arrival of each master gate, provides a convenient means of reconstructing the full event at a later stage. An example of the external supplementary FERA control logic required for a complex multi-crate and multi-gate system controlled by a single FERA Manager, is also discussed together with some remarks on the system performance.

  4. Fiber faceplate modulation readout in Bi-material micro-cantilever mirror array imaging system

    NASA Astrophysics Data System (ADS)

    Hui, Mei; Xia, Zhengzheng; Liu, Ming; Dong, Liquan; Liu, Xiaohua; Zhao, Yuejin

    2016-05-01

    Fiber faceplate modulation was applied to read out the precise actuation of silicon-based, surface micro-fabricated cantilever mirrors array in optical imaging system. The faceplate was made by ordered bundles consisting of as many as ten thousands fibers. The transmission loss of an individual fiber in the bundles was 0.35dB/cm and the cross talk between neighboring fibers in the faceplate was about 15%. Micro-cantilever mirrors array (Focal-Plane Array (FPA)) which composed of two-level bi-material pixels, absorb incident infrared flux and result in a temperature increase. The temperature distribution of incident flux transformed to the deformation distribution in FPA which has a very big difference in coefficients of thermal expansion. FPA plays the roles of target sensing and has the characteristics of high detection sensitivity. Instead of general filter such as knife edge or pinhole, fiber faceplate modulate the beam reflected by the units of FPA. An optical readout signal brings a visible spectrum into pattern recognition system, yielding a visible image on monitor. Thermal images at room temperature have been obtained. The proposed method permits optical axis compact and image noise suppression.

  5. A 48x48 CdZnTe array with multiplexer readout

    SciTech Connect

    Marks, D.G.; Barber, H.B.; Barrett, H.H.

    1996-06-01

    The authors report results of gamma-ray imaging and energy-resolution tests of a 48x48 CdZnTe array. The detectors have 125 {micro}m square pixel electrodes produced by photolithography and are indium-bump-bonded to a multiplexer readout circuit. Using a collimated beam of 140 keV gamma rays of 120 {micro}m diameter centered on one pixel, they found that the majority of events produced significant charge deposition in nearby pixels. Charge and energy are transported out of the pixel by charge diffusion, photoelectron range, Compton scattering, and escape of K x-rays. These effects also distort single-pixel spectra, although photopeaks are still discernible at 140 keV. When signals from neighboring pixels are summed together to correct for this charge spreading, an energy resolution of 10 keV is obtained at 140 keV. Corrections will be simpler and energy resolution should be better for the 380 {micro}m pixels of the 64x64 CdZnTe arrays the authors are constructing for an ultra-high-resolution brain imager.

  6. The pixel detector for the CMS phase-II upgrade

    NASA Astrophysics Data System (ADS)

    Dinardo, M. E.

    2015-04-01

    The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation. The target integrated luminosity of 3000 fb-1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2×1016 1 MeV eq.n. / cm2, or equivalently 10 MGy of radiation dose in silicon, at about 3 cm from the interaction region where the first layer of the pixel detector could be located. The CMS collaboration has undertaken two baseline sensor R&D programs on thin n-on-p planar and 3D silicon sensor technologies. Together with the ATLAS collaboration it has also been established a common R&D effort for the development of the readout chip in the 65 nm CMOS technology. Status, progresses, and prospects of the CMS R&D effort are presented and discussed in this article.

  7. THE KEPLER PIXEL RESPONSE FUNCTION

    SciTech Connect

    Bryson, Stephen T.; Haas, Michael R.; Dotson, Jessie L.; Koch, David G.; Borucki, William J.; Tenenbaum, Peter; Jenkins, Jon M.; Chandrasekaran, Hema; Caldwell, Douglas A.; Klaus, Todd; Gilliland, Ronald L.

    2010-04-20

    Kepler seeks to detect sequences of transits of Earth-size exoplanets orbiting solar-like stars. Such transit signals are on the order of 100 ppm. The high photometric precision demanded by Kepler requires detailed knowledge of how the Kepler pixels respond to starlight during a nominal observation. This information is provided by the Kepler pixel response function (PRF), defined as the composite of Kepler's optical point-spread function, integrated spacecraft pointing jitter during a nominal cadence and other systematic effects. To provide sub-pixel resolution, the PRF is represented as a piecewise-continuous polynomial on a sub-pixel mesh. This continuous representation allows the prediction of a star's flux value on any pixel given the star's pixel position. The advantages and difficulties of this polynomial representation are discussed, including characterization of spatial variation in the PRF and the smoothing of discontinuities between sub-pixel polynomial patches. On-orbit super-resolution measurements of the PRF across the Kepler field of view are described. Two uses of the PRF are presented: the selection of pixels for each star that maximizes the photometric signal-to-noise ratio for that star, and PRF-fitted centroids which provide robust and accurate stellar positions on the CCD, primarily used for attitude and plate scale tracking. Good knowledge of the PRF has been a critical component for the successful collection of high-precision photometry by Kepler.

  8. PIXELS: Using field-based learning to investigate students' concepts of pixels and sense of scale

    NASA Astrophysics Data System (ADS)

    Pope, A.; Tinigin, L.; Petcovic, H. L.; Ormand, C. J.; LaDue, N.

    2015-12-01

    Empirical work over the past decade supports the notion that a high level of spatial thinking skill is critical to success in the geosciences. Spatial thinking incorporates a host of sub-skills such as mentally rotating an object, imagining the inside of a 3D object based on outside patterns, unfolding a landscape, and disembedding critical patterns from background noise. In this study, we focus on sense of scale, which refers to how an individual quantified space, and is thought to develop through kinesthetic experiences. Remote sensing data are increasingly being used for wide-reaching and high impact research. A sense of scale is critical to many areas of the geosciences, including understanding and interpreting remotely sensed imagery. In this exploratory study, students (N=17) attending the Juneau Icefield Research Program participated in a 3-hour exercise designed to study how a field-based activity might impact their sense of scale and their conceptions of pixels in remotely sensed imagery. Prior to the activity, students had an introductory remote sensing lecture and completed the Sense of Scale inventory. Students walked and/or skied the perimeter of several pixel types, including a 1 m square (representing a WorldView sensor's pixel), a 30 m square (a Landsat pixel) and a 500 m square (a MODIS pixel). The group took reflectance measurements using a field radiometer as they physically traced out the pixel. The exercise was repeated in two different areas, one with homogenous reflectance, and another with heterogeneous reflectance. After the exercise, students again completed the Sense of Scale instrument and a demographic survey. This presentation will share the effects and efficacy of the field-based intervention to teach remote sensing concepts and to investigate potential relationships between students' concepts of pixels and sense of scale.

  9. Pixel detectors in double beta decay experiments, a new approach for background reduction

    SciTech Connect

    Jose, J. M.; Čermák, P.; Štekl, I.; Rukhadze, E. N.; Rukhadze, N. I.; Brudanin, V. B.; Fiederle, M.; Fauler, A.; Loaiza, P.

    2013-08-08

    Double beta decay (ββ) experiments are challenging frontiers in contemporary physics. These experiments have the potential to investigate more about neutrinos (eg. nature and mass). The main challenge for these experiments is the reduction of background. The group at IEAP, CTU in Prague is investigating a new approach using pixel detectors Timepix. Pixel detector offer background reduction capabilities with its ability to identify the particle interaction (from the 2D signature it generates). However, use of pixel detectors has some challenges such as the presence of readout electronics near the sensing medium and heat dissipation. Different aspects of pixel setup (identification of radio-impurities, selection of radio-pure materials) and proposed experimental setup are presented. Also, results of preliminary background measurements (performed on the surface and in the underground laboratories) using the prototype setups are presented.

  10. The DC-DC conversion power system of the CMS Phase-1 pixel upgrade

    NASA Astrophysics Data System (ADS)

    Feld, L.; Karpinski, W.; Klein, K.; Lipinski, M.; Preuten, M.; Rauch, M.; Schmitz, St.; Wlochal, M.

    2015-01-01

    The pixel detector of the CMS experiment will be exchanged during the year-end technical stop in 2016/2017, as part of the experiment's Phase-1 upgrade. The new device will feature approximately twice the number of readout channels, and consequently the power consumption will be doubled. By moving to a DC-DC conversion powering scheme, it is possible to power the new pixel detector with the existing power supplies and cable plant. The power system of the Phase-1 pixel detector is described and the performance of the new components, including DC-DC converters, DC-DC converter motherboards and various power distribution boards, is detailed. The outcome of system tests in terms of electrical behaviour, thermal management and pixel module performance is discussed.

  11. Pre- and post-irradiation performance of FBK 3D silicon pixel detectors for CMS

    NASA Astrophysics Data System (ADS)

    Krzywda, A.; Alagoz, E.; Bubna, M.; Obertino, M.; Solano, A.; Arndt, K.; Uplegger, L.; Betta, G. F. Dalla; Boscardin, M.; Ngadiuba, J.; Rivera, R.; Menasce, D.; Moroni, L.; Terzo, S.; Bortoletto, D.; Prosser, A.; Adreson, J.; Kwan, S.; Osipenkov, I.; Bolla, G.; Lei, C. M.; Shipsey, I.; Tan, P.; Tran, N.; Chramowicz, J.; Cumalat, J.; Perera, L.; Povoli, M.; Mendicino, R.; Pereira, A. Vilela; Brosius, R.; Kumar, A.; Wagner, S.; Jensen, F.; Bose, S.; Tentindo, S.

    2014-11-01

    In preparation for the tenfold luminosity upgrade of the Large Hadron Collider (the HL-LHC) around 2020, three-dimensional (3D) silicon pixel sensors are being developed as a radiation-hard candidate to replace the planar ones currently being used in the CMS pixel detector. This study examines an early batch of FBK sensors (named ATLAS08) of three 3D pixel geometries: 1E, 2E, and 4E, which respectively contain one, two, and four readout electrodes for each pixel, passing completely through the bulk. We present electrical characteristics and beam test performance results for each detector before and after irradiation. The maximum fluence applied is 3.5×1015 n eq/cm2.

  12. The readout of a GEM or Micromegas-equipped TPC by means of the Medipix2 CMOS sensor as direct anode

    NASA Astrophysics Data System (ADS)

    Colas, P.; Colijn, A. P.; Fornaini, A.; Giomataris, Y.; van der Graaf, H.; Heijne, E. H. M.; Llopart, X.; Schmitz, J.; Timmermans, J.; Visschers, J. L.

    2004-12-01

    We have applied the Medipix2 pixel CMOS chip as direct anode readout for a TPC. For the gas amplification two options have been investigated: (i) a three-stage GEM system and (ii) a Micromegas mesh. The structure of the cloud of primary electrons, left after interactions of 55Fe quanta with the gas is visible with unprecedented precision. This proof-of-principle is an essential step in our project to realize a monolithic pixel sensor with integrated Micromegas, to be developed specially for the readout of TPCs, and applicable for drift chambers in general.

  13. Hardware solutions for the 65k pixel X-ray camera module of 75 μm pixel size

    NASA Astrophysics Data System (ADS)

    Kasinski, K.; Maj, P.; Grybos, P.; Koziol, A.

    2016-02-01

    We present three hardware solutions designed for a detector module built with a 2 cm × 2 cm hybrid pixel detector built from a single 320 or 450 μ m thick silicon sensor designed and fabricated by Hamamatsu and two UFXC32k readout integrated circuits (128 × 256 pixels with 75μ m pitch, designed in CMOS 130 nm at AGH-UST). The chips work in a single photon counting mode and provide ultra-fast X-ray imaging. The presented hardware modules are designed according to requirements of various tests and applications: ṡDevice A: a fast and flexible system for tests with various radiation sources. ṡDevice B: a standalone, all-in-one imaging device providing three standard interfaces (USB 2.0, Ethernet, Camera Link) and up to 640 MB/s bandwidth. ṡDevice C: a prototype large-area imaging system. The paper shows the readout system structure for each case with highlighted circuit board designs with details on power distribution and cooling on both FR4 and LTCC (low temperature co-fired ceramic) based circuits.

  14. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors.

    PubMed

    El-Mohri, Youcef; Antonuk, Larry E; Koniczek, Martin; Zhao, Qihua; Li, Yixin; Street, Robert A; Lu, Jeng-Ping

    2009-07-01

    optical fill factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of approximately 560 e (rms) for PSI-3.

  15. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors

    SciTech Connect

    El-Mohri, Youcef; Antonuk, Larry E.; Koniczek, Martin; Zhao Qihua; Li Yixin; Street, Robert A.; Lu Jengping

    2009-07-15

    fill factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of {approx}560 e (rms) for PSI-3.

  16. Active pixel imagers incorporating pixel-level amplifiers based on polycrystalline-silicon thin-film transistors

    PubMed Central

    El-Mohri, Youcef; Antonuk, Larry E.; Koniczek, Martin; Zhao, Qihua; Li, Yixin; Street, Robert A.; Lu, Jeng-Ping

    2009-01-01

    factors that are close to unity. In addition, the greater complexity of PSI-2 and PSI-3 pixel circuits, compared to that of PSI-1, has no observable effect on spatial resolution. Both PSI-2 and PSI-3 exhibit high levels of additive noise, resulting in no net improvement in the signal-to-noise performance of these early prototypes compared to conventional AMFPIs. However, faster readout rates, coupled with implementation of multiple sampling protocols allowed by the nondestructive nature of pixel readout, resulted in a significantly lower noise level of ∼560 e (rms) for PSI-3. PMID:19673229

  17. From Pixels to Planets

    NASA Technical Reports Server (NTRS)

    Brownston, Lee; Jenkins, Jon M.

    2015-01-01

    The Kepler Mission was launched in 2009 as NASAs first mission capable of finding Earth-size planets in the habitable zone of Sun-like stars. Its telescope consists of a 1.5-m primary mirror and a 0.95-m aperture. The 42 charge-coupled devices in its focal plane are read out every half hour, compressed, and then downlinked monthly. After four years, the second of four reaction wheels failed, ending the original mission. Back on earth, the Science Operations Center developed the Science Pipeline to analyze about 200,000 target stars in Keplers field of view, looking for evidence of periodic dimming suggesting that one or more planets had crossed the face of its host star. The Pipeline comprises several steps, from pixel-level calibration, through noise and artifact removal, to detection of transit-like signals and the construction of a suite of diagnostic tests to guard against false positives. The Kepler Science Pipeline consists of a pipeline infrastructure written in the Java programming language, which marshals data input to and output from MATLAB applications that are executed as external processes. The pipeline modules, which underwent continuous development and refinement even after data started arriving, employ several analytic techniques, many developed for the Kepler Project. Because of the large number of targets, the large amount of data per target and the complexity of the pipeline algorithms, the processing demands are daunting. Some pipeline modules require days to weeks to process all of their targets, even when run on NASA's 128-node Pleiades supercomputer. The software developers are still seeking ways to increase the throughput. To date, the Kepler project has discovered more than 4000 planetary candidates, of which more than 1000 have been independently confirmed or validated to be exoplanets. Funding for this mission is provided by NASAs Science Mission Directorate.

  18. Beam test characterization of CMS silicon pixel detectors for the phase-1 upgrade

    NASA Astrophysics Data System (ADS)

    Korol, I.

    2015-10-01

    The Silicon Pixel Detector forms the innermost part of the CMS tracking system and is critical to track and vertex reconstruction. Being in close proximity to the beam interaction point, it is exposed to the highest radiation levels in the silicon tracker. In order to preserve the tracking performance with the LHC luminosity increase which is foreseen for the next years, the CMS collaboration has decided to build a new pixel detector with four barrel layers mounted around a reduced diameter beam pipe, as compared to the present three layer pixel detector in the central region. A new digital version of the front-end readout chip has been designed and tested; it has increased data buffering and readout link speed to maintain high efficiency at increasing occupancy. In addition, it offers lower charge thresholds that will improve the tracking efficiency and position resolution. Single chip modules have been evaluated in the DESY electron test beam in terms of charge collection, noise, tracking efficiency and position resolution before and after irradiation with 24 GeV protons from the CERN Proton Synchroton equivalent to the fluence expected after 500 fb-1 of integrated luminosity in the fourth layer of the pixel tracker. High efficiency and an excellent position resolution have been observed which are well maintained even after the proton irradiation. The results are well described by the CMS pixel detector simulation.

  19. Novel silicon n-in-p pixel sensors for the future ATLAS upgrades

    NASA Astrophysics Data System (ADS)

    La Rosa, A.; Gallrapp, C.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.; Weigell, P.

    2013-08-01

    In view of the LHC upgrade phases towards HL-LHC the ATLAS experiment plans to upgrade the inner detector with an all silicon system. The n-in-p silicon technology is a promising candidate for the pixel upgrade thanks to its radiation hardness and cost effectiveness that allow for enlarging the area instrumented with pixel detectors. We present the characterization and performance of novel n-in-p planar pixel sensors produced by CiS (Germany) connected by bump bonding to the ATLAS readout chip FE-I3. These results are obtained before and after irradiation up to a fluence of 10161-MeV neq cm-2, and prove the operability of this kind of sensors in the harsh radiation environment foreseen for the pixel system at HL-LHC. We also present an overview of the new pixel production, which is on-going at CiS for sensors compatible with the new ATLAS readout chip FE-I4.

  20. Design of an ultra low power CMOS pixel sensor for a future neutron personal dosimeter

    SciTech Connect

    Zhang, Y.; Hu-Guo, C.; Husson, D.; Hu, Y.

    2011-07-01

    Despite a continuously increasing demand, neutron electronic personal dosimeters (EPDs) are still far from being completely established because their development is a very difficult task. A low-noise, ultra low power consumption CMOS pixel sensor for a future neutron personal dosimeter has been implemented in a 0.35 {mu}m CMOS technology. The prototype is composed of a pixel array for detection of charged particles, and the readout electronics is integrated on the same substrate for signal processing. The excess electrons generated by an impinging particle are collected by the pixel array. The charge collection time and the efficiency are the crucial points of a CMOS detector. The 3-D device simulations using the commercially available Synopsys-SENTAURUS package address the detailed charge collection process. Within a time of 1.9 {mu}s, about 59% electrons created by the impact particle are collected in a cluster of 4 x 4 pixels with the pixel pitch of 80 {mu}m. A charge sensitive preamplifier (CSA) and a shaper are employed in the frond-end readout. The tests with electrical signals indicate that our prototype with a total active area of 2.56 x 2.56 mm{sup 2} performs an equivalent noise charge (ENC) of less than 400 e - and 314 {mu}W power consumption, leading to a promising prototype. (authors)

  1. Characterisation of Vanilla—A novel active pixel sensor for radiation detection

    NASA Astrophysics Data System (ADS)

    Blue, A.; Bates, R.; Laing, A.; Maneuski, D.; O'Shea, V.; Clark, A.; Prydderch, M.; Turchetta, R.; Arvanitis, C.; Bohndiek, S.

    2007-10-01

    Novel features of a new monolithic active pixel sensor, Vanilla, with 520×520 pixels ( 25 μm square) has been characterised for the first time. Optimisation of the sensor operation was made through variation of frame rates, integration times and on-chip biases and voltages. Features such as flushed reset operation, ROI capturing and readout modes have been fully tested. Stability measurements were performed to test its suitablility for long-term applications. These results suggest the Vanilla sensor—along with bio-medical and space applications—is suitable for use in particle physics experiments.

  2. Interpixel crosstalk in a 3D-integrated active pixel sensor for x-ray detection

    NASA Astrophysics Data System (ADS)

    LaMarr, Beverly; Bautz, Mark; Foster, Rick; Kissel, Steve; Prigozhin, Gregory; Suntharalingam, Vyshnavi

    2010-07-01

    MIT Lincoln Laboratories and MIT Kavli Institute for Astrophysics and Space Research have developed an active pixel sensor for use as a photon counting device for imaging spectroscopy in the soft X-ray band. A silicon-on-insulator (SOI) readout circuit was integrated with a high-resistivity silicon diode detector array using a per-pixel 3D integration technique developed at Lincoln Laboratory. We have tested these devices at 5.9 keV and 1.5 keV. Here we examine the interpixel cross-talk measured with 5.9 keV X-rays.

  3. A data readout approach for physics experiments

    NASA Astrophysics Data System (ADS)

    Huang, Xi-Ru; Cao, Ping; Gao, Li-Wei; Zheng, Jia-Jun

    2015-07-01

    With increasing physical event rates and the number of electronic channels, traditional readout schemes meet the challenge of improving readout speed caused by the limited bandwidth of the crate backplane. In this paper, a high-speed data readout method based on the Ethernet is presented to make each readout module capable of transmitting data to the DAQ. Features of explicitly parallel data transmitting and distributed network architecture give the readout system the advantage of adapting varying requirements of particle physics experiments. Furthermore, to guarantee the readout performance and flexibility, a standalone embedded CPU system is utilized for network protocol stack processing. To receive the customized data format and protocol from front-end electronics, a field programmable gate array (FPGA) is used for logic reconfiguration. To optimize the interface and to improve the data throughput between CPU and FPGA, a sophisticated method based on SRAM is presented in this paper. For the purpose of evaluating this high-speed readout method, a simplified readout module is designed and implemented. Test results show that this module can support up to 70 Mbps data throughput from the readout module to DAQ. Supported by National Natural Science Foundation of China (11005107) and Independent Projects of State Key Laboratory of Particle Detection and Electronics (201301)

  4. Electrical characterization of a radiation-hardened silicon pixel design for CMS

    NASA Astrophysics Data System (ADS)

    Xie, X. B.; Cho, H. S.; Liang, G. W.; Huang, W.; Li, Z.; Chien, C. Y.

    2002-01-01

    We have summarized our R&D on the radiation hardening and handling of high operating voltage for the CMS forward pixel detectors. More radiation-hardened silicon pixel sensors of configuration n +/n/p + with single-sided multi-guard ring structures have been developed and tested under the radiation environment expected at LHC. In the design, no guard ring is required on the n + side and guard rings on the p + side are always kept active before and after type inversion. The whole n + side is grounded and connected to readout-chip, which greatly simplifies detectors assembling and improves the stability of bump-bonded readout chip on the n + side. Samples had been irradiated to high fluence neutron and proton radiations to study the radiation hardness effects. Electrical characteristics such as leakage current, potential distributions over guard rings and full depletion voltage were measured under different temperatures.

  5. High-Sensitivity X-ray Polarimetry with Amorphous Silicon Active-Matrix Pixel Proportional Counters

    NASA Technical Reports Server (NTRS)

    Black, J. K.; Deines-Jones, P.; Jahoda, K.; Ready, S. E.; Street, R. A.

    2003-01-01

    Photoelectric X-ray polarimeters based on pixel micropattern gas detectors (MPGDs) offer order-of-magnitude improvement in sensitivity over more traditional techniques based on X-ray scattering. This new technique places some of the most interesting astronomical observations within reach of even a small, dedicated mission. The most sensitive instrument would be a photoelectric polarimeter at the focus of 2 a very large mirror, such as the planned XEUS. Our efforts are focused on a smaller pathfinder mission, which would achieve its greatest sensitivity with large-area, low-background, collimated polarimeters. We have recently demonstrated a MPGD polarimeter using amorphous silicon thin-film transistor (TFT) readout suitable for the focal plane of an X-ray telescope. All the technologies used in the demonstration polarimeter are scalable to the areas required for a high-sensitivity collimated polarimeter. Leywords: X-ray polarimetry, particle tracking, proportional counter, GEM, pixel readout

  6. ATLAS Pixel Detector ROD card from IBL towards Layers 2 and 1

    NASA Astrophysics Data System (ADS)

    Balbi, G.; Falchieri, D.; Gabrielli, A.; Lama, L.; Giangiacomi, N.; Travaglini, R.

    2016-01-01

    The incoming and future upgrades of LHC will require better performance by the data acquisition system, especially in terms of throughput due to the higher luminosity that is expected. For this reason, during the first shutdown of the LHC collider in 2013/14, the ATLAS Pixel Detector has been equipped with a fourth layer— the Insertable B-Layer or IBL—located at a radius smaller than the present three layers. To read out the new layer of pixels, with a smaller pixel size with respect to the other outer layers, a front end ASIC (FE-I4) was designed as well as a new off-detector read-out chain. The latter, accordingly to the structure of the other layers of pixels, is composed mainly of two 9U-VME read-out off-detector cards called the Back-Of-Crate (BOC) and Read-Out Driver (ROD). The ROD is used for data and event formatting and for configuration and control of the overall read-out electronics. After some prototyping samples were completed, a pre-production batch of 5 ROD cards was delivered with the final layout. Another production of 15 ROD cards was done in Fall 2013, and commissioning was completed in 2014. Altogether 14 cards are necessary for the 14 staves of the IBL detector, one additional card is required by the Diamond Beam Monitor (DBM), and additional spare ROD cards were produced for a total initial batch of 20 boards. This paper describes some integration tests that were performed and our plan to install the new DAQ chain for the layer 2, which is the outermost, and layer 1, which is external to the B-layer. This latter is the only layer that will not be upgraded to a higher readout speed. Rather, it will be switched off in the near future as it has too many damaged sensors that were not possible to rework. To do that, slices of the IBL read-out chain have been instrumented, and ROD performance is verified on a test bench mimicking a small-sized final setup. Thus, this contribution reports also how the adoption of the IBL ROD for ATLAS Pixel

  7. Signal and noise of diamond pixel detectors at high radiation fluences

    NASA Astrophysics Data System (ADS)

    Tsung, J.-W.; Havranek, M.; Hügging, F.; Kagan, H.; Krüger, H.; Wermes, N.

    2012-09-01

    CVD diamond is an attractive material option for LHC vertex detectors mainly because of its strong radiation-hardness causal to its large band gap and strong lattice. In particular, pixel detectors operating close to the interaction point profit from tiny leakage currents and small pixel capacitances of diamond resulting in low noise figures when compared to silicon. On the other hand, the charge signal from traversing high energy particles is smaller in diamond than in silicon by a factor of about 2.2. Therefore, a quantitative determination of the signal-to-noise ratio (S/N) of diamond in comparison with silicon at fluences in excess of 1015 neq cm-2, which are expected for the LHC upgrade, is important. Based on measurements of irradiated diamond sensors and the FE-I4 pixel readout chip design and performance, we determine the signal and the noise of diamond pixel detectors irradiated with high particle fluences. To characterize the effect of the radiation damage on the materials and the signal decrease, the change of the mean free path λe/h of the charge carriers is determined as a function of irradiation fluence. We make use of the FE-I4 pixel chip developed for ATLAS upgrades to realistically estimate the expected noise figures: the expected leakage current at a given fluence is taken from calibrated calculations and the pixel capacitance is measured using a purposely developed chip (PixCap). We compare the resulting S/N figures with those for planar silicon pixel detectors using published charge loss measurements and the same extrapolation methods as for diamond. It is shown that the expected S/N of a diamond pixel detector with pixel pitches typical for LHC, exceeds that of planar silicon pixels at fluences beyond 1015 particles cm-2, the exact value only depending on the maximum operation voltage assumed for irradiated silicon pixel detectors.

  8. Deployment of the CMS Tracker AMC as backend for the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Auzinger, G.

    2016-01-01

    The silicon pixel detector of the CMS experiment at CERN will be replaced with an upgraded version at the beginning of 2017 with the new detector featuring an additional barrel- and end-cap layer resulting in an increased number of fully digital read-out links running at 400 Mbps. New versions of the PSI46 Read-Out Chip and Token Bit Manager have been developed to operate at higher rates and reduce data loss. Front-End Controller and Front-End Driver boards, based on the μTCA compatible CMS Tracker AMC, a variant of the FC7 card, are being developed using different mezzanines to host the optical links for the digital read-out and control system. An overview of the system architecture is presented, with details on the implementation, and first results obtained from test systems.

  9. Fast imaging readout and electronics—a novel high-speed imaging system for micro-channel plates

    NASA Astrophysics Data System (ADS)

    Lapington, J. S.; Rees, K.

    2002-01-01

    The band-width of charge division readout anodes used with micro-channel plates (MCP) is usually limited by the speed of the acquisition electronics. We present a novel charge division anode that does not require analogue to digital conversion. The Fast Imaging Readout and Electronics is a new concept in high-speed imaging using an MCP detector. The imaging system described comprises an MCP intensifier coupled to a charge division image readout using high-speed, multichannel electronics. It has a projected spatial resolution of up to 128×128 pixels, though the image format is inherently flexible, and the potential for rates up to 100 million events per second with nanosecond timing resolution. The readout pattern has a planar electrode structure and the collected charge from each event is shared amongst all electrodes, grouped in pairs. The unique design of the readout obviates the need for charge measurement, usually the dominant process determining the event-processing deadtime. Instead, high-speed signal comparators, each of which act on the signals from an electrode pair, are used to define a binary code from which the position co-ordinate is directly mapped. We describe a proof of the concept of prototype anode and associated electronics using a novel application of very high-speed digital circuitry. We present preliminary results showing signal waveforms measured using a one-dimensional 16-pixel anode pattern.

  10. CMOS Hybrid Pixel Detectors for Scientific, Industrial and Medical Applications

    NASA Astrophysics Data System (ADS)

    Broennimann, Christian

    2009-03-01

    Crystallography is the principal technique for determining macromolecular structures at atomic resolution and uses advantageously the high intensity of 3rd generation synchrotron X-ray sources . Macromolecular crystallography experiments benefit from excellent beamline equipment, recent software advances and modern X-ray detectors. However, the latter do not take full advantage of the brightness of modern synchrotron sources. CMOS Hybrid pixel array detectors, originally developed for high energy physics experiments, meet these requirements. X-rays are recorded in single photon counting mode and data thus are stored digitally at the earliest possible stage. This architecture leads to several advantages over current detectors: No detector noise is added to the signal. Readout time is reduced to a few milliseconds. The counting rates are matched to beam intensities at protein crystallography beamlines at 3rd generation synchrotrons. The detector is not sensitive to X-rays during readout; therefore no mechanical shutter is required. The detector has a very sharp point spread function (PSF) of one pixel, which allows better resolution of adjacent reflections. Low energy X-rays can be suppressed by the comparator At the Paul Scherrer Institute (PSI) in Switzerland the first and largest array based on this technology was constructed: The Pilatus 6M detector. The detector covers an area of 43.1 x 44.8 cm2 , has 6 million pixels and is read out noise free in 3.7 ms. Since June 2007 the detector is in routine operation at the beamline 6S of the Swiss Light Source (SLS). The company DETCRIS Ltd, has licensed the technology from PSI and is commercially offering the PILATUS detectors. Examples of the wide application range of the detectors will be shown.

  11. FITPix data preprocessing pipeline for the Timepix single particle pixel detector

    NASA Astrophysics Data System (ADS)

    Kraus, V.; Holik, M.; Jakubek, J.; Georgiev, V.

    2012-04-01

    The semiconductor pixel detector Timepix contains an array of 256 × 256 square pixels with a pitch of 55 μm. The single quantum counting detector Timepix can also provide information about the energy or arrival time of a particle from every single pixel. This device is a powerful tool for radiation imaging and ionizing particle tracking. The Timepix device can be read-out via a serial or parallel interface enabling speeds of 100 fps or 3200 fps, respectively. The device can be connected to a PC via the USB 2.0 based interface FITPix, which currently supports the serial output of Timepix reaching a speed of 90 fps. FITPix supports adjustable clock frequency and hardware triggering which is a useful tool for the synchronized operation of multiple devices. The FITPix interface can handle up to 16 detectors in daisy chain. The complete system including the FITPix interface and Timepix detector is controlled from the PC by the Pixelman software package. A pipeline structure is now implemented in the new version of the readout interface of FITPix. This version also supports parallel Timepix readout. The pipeline architecture brings the possibility of data preprocessing directly in the hardware. The first pipeline stage converts the raw Timepix data into the form of a matrix or stream of pixel values. Another stage performs further data processing such as event thresholding and data compression. Complex data processing currently performed by Pixelman in the PC is significantly reduced in this way. The described architecture together with the parallel readout increases data throughput reaching a higher frame-rate and reducing the dead time. Significant data compression is performed directly in the hardware especially for sparse data sets from particle tracking applications. The data frame size is typically compressed by factor of 10-100.

  12. Monolithic active pixel sensors (MAPS) in a VLSI CMOS technology

    NASA Astrophysics Data System (ADS)

    Turchetta, R.; French, M.; Manolopoulos, S.; Tyndel, M.; Allport, P.; Bates, R.; O'Shea, V.; Hall, G.; Raymond, M.

    2003-03-01

    Monolithic Active Pixel Sensors (MAPS) designed in a standard VLSI CMOS technology have recently been proposed as a compact pixel detector for the detection of high-energy charged particle in vertex/tracking applications. MAPS, also named CMOS sensors, are already extensively used in visible light applications. With respect to other competing imaging technologies, CMOS sensors have several potential advantages in terms of low cost, low power, lower noise at higher speed, random access of pixels which allows windowing of region of interest, ability to integrate several functions on the same chip. This brings altogether to the concept of 'camera-on-a-chip'. In this paper, we review the use of CMOS sensors for particle physics and we analyse their performances in term of the efficiency (fill factor), signal generation, noise, readout speed and sensor area. In most of high-energy physics applications, data reduction is needed in the sensor at an early stage of the data processing before transfer of the data to tape. Because of the large number of pixels, data reduction is needed on the sensor itself or just outside. This brings in stringent requirements on the temporal noise as well as to the sensor uniformity, expressed as a Fixed Pattern Noise (FPN). A pixel architecture with an additional transistor is proposed. This architecture, coupled to correlated double sampling of the signal will allow cancellation of the two dominant noise sources, namely the reset or kTC noise and the FPN. A prototype has been designed in a standard 0.25 μm CMOS technology. It has also a structure for electrical calibration of the sensor. The prototype is functional and detailed tests are under way.

  13. Pixelated spectral filter for integrated focal plane array in the long-wave IR

    NASA Astrophysics Data System (ADS)

    Kemme, S. A.; Boye, R. R.; Cruz-Cabrera, A. A.; Briggs, R. D.; Carter, T. R.; Samora, S.

    2010-04-01

    We present the design, fabrication, and characterization of a pixelated, hyperspectral arrayed component for Focal Plane Array (FPA) integration in the Long-Wave IR. This device contains tens of pixels within a single super-pixel which is tiled across the extent of the FPA. Each spectral pixel maps to a single FPA pixel with a spectral FWHM of 200nm. With this arrayed approach, remote sensing data may be accumulated with a non-scanning, "snapshot" imaging system. This technology is flexible with respect to individual pixel center wavelength and to pixel position within the array. Moreover, the entire pixel area has a single wavelength response, not the integrated linear response of a graded cavity thickness design. These requirements bar tilted, linear array technologies where the cavity length monotonically increases across the device.

  14. Single Pixel Characterization of X-Ray TES Microcalorimeter Under AC Bias at MHz Frequencies

    NASA Technical Reports Server (NTRS)

    Gottardi, L.; Blandler, S. R.; Porter, F. S.; Sadleir, J. E.; Kilbourne, C. A.; Bailey, C. N.; Finkbeiner, F. M.; Chervenak, J. A.; Adams, J. S.; Eckart, M. E.; Kelley, R. L.; Smith, S. J.; Linden, T. V. D.; Hoevers, H.; Kuur, J. V. D.; Lindeman, M.; Bruijn, M.; Hortog, R. D.; Kiviranta, M.

    2012-01-01

    In this paper we present the progress made at SRON in the read-out of GSFC x-ray transition-edge sensor (TES) micro-calorimeters in the frequency domain. The experiments reported so far, whose aim was to demonstrate an energy resolution of 2eV at 6 keV with a TES acting as a modulator, were carried out at frequencies below 700 kHz using a standard flux locked loop (FLL) SQUID read-out scheme. The TES read-out suffered from the use of sub-optimal circuit components, large parasitic inductances, low quality factor resonators and poor magnetic field shielding. We have developed a novel experimental set-up, which allows us to test several read-out schemes in a single cryogenic run. In this set-up, the TES pixels are coupled via superconducting transformers to 18 high-Q lithographic LC filters with resonant frequencies ranging between 2 and 5 MHz. The signal is amplified by a two-stage SQUID current sensor and baseband feedback is used to overcome the limited SQUID dynamic range. We study the single pixel performance as a function of TES bias frequency, voltage and perpendicular magnetic field.

  15. Readout architecture for sub-nanosecond resolution TDC

    NASA Astrophysics Data System (ADS)

    Marteau, J.; Carlus, B.; Gardien, S.; Girerd, C.; Ianigro, J.-C.; Montorio, J.-L.; Gibert, D.; Nicollin, F.

    2012-04-01

    The DIAPHANE project is pluri-disciplinary collaboration between particle physicists and geophysicists to perform the tomography of large geological structure mainly devoted to the study of active volcanoes. The detector used for this tomography, hereafter referred to as telescope, uses a standard, robust, cost-effective and well-known technology based on solid plastic scintillator readout by photomultiplier(s) (either multichannel pixelized PM or silicon PM). The electronics system is built on the concept of autonomous, triggerless, smart sensor directly connected on a standard fast Ethernet network. First radiographies have been performed on the Mont-Terri underground laboratory (St-Ursanne, Switzerland) and on the active volcano of La Soufrière (Guadeloupe, Lesser Antilles, France). We present an upgrade of the readout architecture allowing to embed a sub-nanosecond resolution TDC within the existing programmable logic to help in the background rejection (rear flux, random coincidences) and to improve the detection purity and the radiography quality. First results obtained are also presented and briefly discussed.

  16. CMS Pixel Data Quality Monitoring

    NASA Astrophysics Data System (ADS)

    Merkel, Petra

    2010-05-01

    We present the CMS Pixel Data Quality Monitoring (DQM) system. The concept and architecture are discussed. The monitored quantities are introduced, and the methods on how to ensure that the detector takes high-quality data with large efficiency are explained. Finally we describe the automated data certification scheme, which is used to certify and classify the data from the Pixel detector for physics analyses.

  17. Dynamic X-ray direct conversion detector using a CdTe polycrystalline layer coupled to a CMOS readout chip

    NASA Astrophysics Data System (ADS)

    Arques, Marc; Renet, Sébastien; Brambilla, Andréa; Feuillet, Guy; Gasse, Adrien; Billon-Pierron, Nicolas; Jolliot, Muriel; Mathieu, Lydie; Rohr, Pierre

    2011-05-01

    A direct detection X-ray imager is presented. It uses polycrystalline cadmium telluride (CdTe) grown by close space sublimation technique for the X-ray photoconductor. A 15 mm×15 mm CdTe layer is connected to a 200×200 pixel readout CMOS by indium bumping. X-ray performance at 16 frames/s rate is measured. In particular a readout noise of 0.5 X-ray, an MTF of 50% at 4 lp/mm and a DQE of 20% at 4 lp/mm are obtained.

  18. On Certain New Methodology for Reducing Sensor and Readout Electronics Circuitry Noise in Digital Domain

    NASA Technical Reports Server (NTRS)

    Kizhner, Semion; Miko, Joseph; Bradley, Damon; Heinzen, Katherine

    2008-01-01

    NASA Hubble Space Telescope (HST) and upcoming cosmology science missions carry instruments with multiple focal planes populated with many large sensor detector arrays. These sensors are passively cooled to low temperatures for low-level light (L3) and near-infrared (NIR) signal detection, and the sensor readout electronics circuitry must perform at extremely low noise levels to enable new required science measurements. Because we are at the technological edge of enhanced performance for sensors and readout electronics circuitry, as determined by thermal noise level at given temperature in analog domain, we must find new ways of further compensating for the noise in the signal digital domain. To facilitate this new approach, state-of-the-art sensors are augmented at their array hardware boundaries by non-illuminated reference pixels, which can be used to reduce noise attributed to sensors. There are a few proposed methodologies of processing in the digital domain the information carried by reference pixels, as employed by the Hubble Space Telescope and the James Webb Space Telescope Projects. These methods involve using spatial and temporal statistical parameters derived from boundary reference pixel information to enhance the active (non-reference) pixel signals. To make a step beyond this heritage methodology, we apply the NASA-developed technology known as the Hilbert- Huang Transform Data Processing System (HHT-DPS) for reference pixel information processing and its utilization in reconfigurable hardware on-board a spaceflight instrument or post-processing on the ground. The methodology examines signal processing for a 2-D domain, in which high-variance components of the thermal noise are carried by both active and reference pixels, similar to that in processing of low-voltage differential signals and subtraction of a single analog reference pixel from all active pixels on the sensor. Heritage methods using the aforementioned statistical parameters in the

  19. Local Pixel Bundles: Bringing the Pixels to the People

    NASA Astrophysics Data System (ADS)

    Anderson, Jay

    2014-12-01

    The automated galaxy-based alignment software package developed for the Frontier Fields program (hst2galign, see Anderson & Ogaz 2014 and http://www.stsci.edu/hst/campaigns/frontier-fields/) produces a direct mapping from the pixels of the flt frame of each science exposure into a common master frame. We can use these mappings to extract the flt-pixels in the vicinity of a source of interest and package them into a convenient "bundle". In addition to the pixels, this data bundle can also contain "meta" information that will allow users to transform positions from the flt pixels to the reference frame and vice-versa. Since the un-resampled pixels in the flt frames are the only true constraints we have on the astronomical scene, the ability to inter-relate these pixels will enable many high-precision studies, such as: point-source-fitting and deconvolution with accurate PSFs, easy exploration of different image-combining algorithms, and accurate faint-source finding and photometry. The data products introduced in this ISR are a very early attempt to provide the flt-level pixel constraints in a package that is accessible to more than the handful of experts in HST astrometry. The hope is that users in the community might begin using them and will provide feedback as to what information they might want to see in the bundles and what general analysis packages they might find useful. For that reason, this document is somewhat informally written, since I know that it will be modified and updated as the products and tools are optimized.

  20. The upgraded Pixel Detector of the ATLAS Experiment for Run 2 at the Large Hadron Collider

    NASA Astrophysics Data System (ADS)

    Backhaus, M.

    2016-09-01

    During Run 1 of the Large Hadron Collider (LHC), the ATLAS Pixel Detector has shown excellent performance. The ATLAS collaboration took advantage of the first long shutdown of the LHC during 2013 and 2014 and extracted the ATLAS Pixel Detector from the experiment, brought it to surface and maintained the services. This included the installation of new service quarter panels, the repair of cables, and the installation of the new Diamond Beam Monitor (DBM). Additionally, a completely new innermost pixel detector layer, the Insertable B-Layer (IBL), was constructed and installed in May 2014 between a new smaller beam pipe and the existing Pixel Detector. With a radius of 3.3 cm the IBL is located extremely close to the interaction point. Therefore, a new readout chip and two new sensor technologies (planar and 3D) are used in the IBL. In order to achieve best possible physics performance the material budget was improved with respect to the existing Pixel Detector. This is realized using lightweight staves for mechanical support and a CO2 based cooling system. This paper describes the improvements achieved during the maintenance of the existing Pixel Detector as well as the performance of the IBL during the construction and commissioning phase. Additionally, first results obtained during the LHC Run 2 demonstrating the distinguished tracking performance of the new Four Layer ATLAS Pixel Detector are presented.

  1. Development of thin edgeless silicon pixel sensors on epitaxial wafers

    NASA Astrophysics Data System (ADS)

    Boscardin, M.; Bosisio, L.; Contin, G.; Giacomini, G.; Manzari, V.; Orzan, G.; Rashevskaya, I.; Ronchin, S.; Zorzi, N.

    2014-09-01

    The paper reports on the development of novel p-on-n thin edgeless planar pixel sensors, compatible with ALICE front-end electronics, fabricated by FBK on epitaxial material. The focus of the activity is the minimization of the material budget required for hybrid pixel detectors. This goal has been addressed in two different stages. In the first one, planar pixel detectors fabricated on epitaxial wafers have been thinned and bonded to the readout chips. The second stage is described by the present paper: the `active edge' concept has been studied for the reduction of the dead area at the periphery of the devices. An overview of the key technological steps and of the electrical characterization of the fabricated sensors is given. In addition, the preliminary results on the static behavior of test sensors after neutron irradiation at different fluences (up to 2.5 × 1015 1 MeV-neq/cm2) are reported. The results demonstrate that these kinds of devices are a viable solution for the reduction of the material budget while maintaining the typical electrical characteristics expected from radiation silicon sensors.

  2. Pixel diamond detectors for excimer laser beam diagnostics

    NASA Astrophysics Data System (ADS)

    Girolami, M.; Allegrini, P.; Conte, G.; Salvatori, S.

    2011-05-01

    Laser beam profiling technology in the UV spectrum of light is evolving with the increase of excimer lasers and lamps applications, that span from lithography for VLSI circuits to eye surgery. The development of a beam-profiler, able to capture the excimer laser single pulse and process the acquired pixel current signals in the time period between each pulse, is mandatory for such applications. 1D and 2D array detectors have been realized on polycrystalline CVD diamond specimens. The fast diamond photoresponse, in the ns time regime, suggests the suitability of such devices for fine tuning feedback of high-power pulsed-laser cavities, whereas solar-blindness guarantees high performance in UV beam diagnostics, also under high intensity background illumination. Offering unique properties in terms of thermal conductivity and visible-light transparency, diamond represents one of the most suitable candidate for the detection of high-power UV laser emission. The relatively high resistivity of diamond in the dark has allowed the fabrication of photoconductive vertical pixel-detectors. A semitransparent light-receiving back-side contact has been used for detector biasing. Each pixel signal has been conditioned by a multi-channel read-out electronics made up of a high-sensitive integrator and a Σ-Δ A/D converter. The 500 μs conversion time has allowed a data acquisition rate up to 2 kSPS (Sample Per Second).

  3. Design and characterization of novel monolithic pixel sensors for the ALICE ITS upgrade

    NASA Astrophysics Data System (ADS)

    Cavicchioli, C.; Chalmet, P. L.; Giubilato, P.; Hillemanns, H.; Junique, A.; Kugathasan, T.; Mager, M.; Marin Tobon, C. A.; Martinengo, P.; Mattiazzo, S.; Mugnier, H.; Musa, L.; Pantano, D.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Van Hoorne, J. W.; Yang, P.

    2014-11-01

    Within the R&D activities for the upgrade of the ALICE Inner Tracking System (ITS), Monolithic Active Pixel Sensors (MAPS) are being developed and studied, due to their lower material budget (~ 0.3 %X0 in total for each inner layer) and higher granularity (~ 20 μm × 20 μm pixels) with respect to the present pixel detector. This paper presents the design and characterization results of the Explorer0 chip, manufactured in the TowerJazz 180 nm CMOS Imaging Sensor process, based on a wafer with high-resistivity (ρ > 1 kΩ cm) and 18 μm thick epitaxial layer. The chip is organized in two sub-matrices with different pixel pitches (20 μm and 30 μm), each of them containing several pixel designs. The collection electrode size and shape, as well as the distance between the electrode and the surrounding electronics, are varied; the chip also offers the possibility to decouple the charge integration time from the readout time, and to change the sensor bias. The charge collection properties of the different pixel variants implemented in Explorer0 have been studied using a 55Fe X-ray source and 1-5 GeV/c electrons and positrons. The sensor capacitance has been estimated, and the effect of the sensor bias has also been examined in detail. A second version of the Explorer0 chip (called Explorer1) has been submitted for production in March 2013, together with a novel circuit with in-pixel discrimination and a sparsified readout. Results from these submissions are also presented.

  4. Overview of the BTeV Pixel Detector

    SciTech Connect

    Jeffrey A Appel

    2002-12-10

    BTeV is a new Fermilab beauty and charm experiment designed to operate in the CZero region of the Tevatron collider. Critical to the success of BTeV is its pixel detector. The unique features of this pixel detector include its proximity to the beam, its operation with a beam crossing time of 132 ns, and the need for the detector information to be read out quickly enough to be used for the lowest level trigger. This talk presents an overview of the pixel detector design, giving the motivations for the technical choices made. The status of the current R&D on detector components is also reviewed. Additional Pixel 2002 talks on the BTeV pixel detector are given by Dave Christian[1], Mayling Wong[2], and Sergio Zimmermann[3]. Table 1 gives a selection of pixel detector parameters for the ALICE, ATLAS, BTeV, and CMS experiments. Comparing the progression of this table, which I have been updating for the last several years, has shown a convergence of specifications. Nevertheless, significant differences endure. The BTeV data-driven readout, horizontal and vertical position resolution better than 9 {micro}m with the {+-} 300 mr forward acceptance, and positioning in vacuum and as close as 6 mm from the circulating beams remain unique. These features are driven by the physics goals of the BTeV experiment. Table 2 demonstrates that the vertex trigger performance made possible by these features is requisite for a very large fraction of the B meson decay physics which is so central to the motivation for BTeV. For most of the physics quantities of interest listed in the table, the vertex trigger is essential. The performance of the BTeV pixel detector may be summarized by looking at particular physics examples; e.g., the B{sub s} meson decay B{sub s} {yields} D{sub s}{sup -} K{sup +}. For that decay, studies using GEANT3 simulations provide quantitative measures of performance. For example, the separation between the B{sub s} decay point and the primary proton

  5. Calibration Scheme for Large Kinetic Inductance Detector Arrays Based on Readout Frequency Response

    NASA Astrophysics Data System (ADS)

    Bisigello, L.; Yates, S. J. C.; Murugesan, V.; Baselmans, J. J. A.; Baryshev, A. M.

    2016-07-01

    Microwave kinetic inductance detector (MKID) provides a way to build large ground-based sub-mm instruments such as NIKA and A-MKID. For such instruments, therefore, it is important to understand and characterize the response to ensure good linearity and calibration over a wide dynamic range. We propose to use the MKID readout frequency response to determine the MKID responsivity to an input optical source power. A signal can be measured in a KID as a change in the phase of the readout signal with respect to the KID resonant circle. Fundamentally, this phase change is due to a shift in the KID resonance frequency, in turn due to a radiation induced change in the quasiparticle number in the superconducting resonator. We show that the shift in resonant frequency can be determined from the phase shift by using KID phase versus frequency dependence using a previously measured resonant frequency. Working in this calculated resonant frequency, we gain near linearity and constant calibration to a constant optical signal applied in a wide range of operating points on the resonance and readout powers. This calibration method has three particular advantages: first, it is fast enough to be used to calibrate large arrays, with pixel counts in the thousands of pixels; second, it is based on data that are already necessary to determine KID positions; third, it can be done without applying any optical source in front of the array.

  6. 3D reconstruction of nuclear reactions using GEM TPC with planar readout

    SciTech Connect

    Bihałowicz, Jan Stefan

    2015-02-24

    The research program of the Extreme Light Infrastructure – Nuclear Physics (ELI-NP) laboratory under construction in Magurele, Romania facilities the need of developing a gaseous active-target detector providing 3D reconstruction of charged products of nuclear reactions induced by gamma beam. The monoenergetic, high-energy (E{sub γ} > 19 MeV) gamma beam of intensity 10{sup 13}γ/s allows studying nuclear reactions in astrophysics. A Time Projection Chamber with crossed strip readout (eTPC) is proposed as one of the imaging detectors. The special feature of the readout electrode structure is a 2D reconstruction based on the information read out simultaneously from three arrays of strips that form virtual pixels. It is expected to reach similar spatial resolution as for pixel readout at largely reduced cost of electronics. The paper presents the current progress and first results of the small scale prototype TPC which is a one of implementation steps towards eTPC detector proposed in the Technical Design Report of Charged Particles Detection at ELI-NP.

  7. CCD readout electronics for the Subaru Prime Focus Spectrograph

    NASA Astrophysics Data System (ADS)

    Hope, Stephen C.; Gunn, James E.; Loomis, Craig P.; Fitzgerald, Roger E.; Peacock, Grant O.

    2014-07-01

    The following paper details the design for the CCD readout electronics for the Subaru Telescope Prime Focus Spectrograph (PFS). PFS is designed to gather spectra from 2394 objects simultaneously, covering wavelengths that extend from 380 nm to 1260 nm. The spectrograph is comprised of four identical spectrograph modules, each collecting roughly 600 spectra. The spectrograph modules provide simultaneous wavelength coverage over the entire band through the use of three separate optical channels: blue, red, and near infrared (NIR). A camera in each channel images the multi-object spectra onto a 4k × 4k, 15 μm pixel, detector format. The two visible cameras use a pair of Hamamatsu 2k × 4k CCDs with readout provided by custom electronics, while the NIR camera uses a single Teledyne HgCdTe 4k × 4k detector and Teledyne's ASIC Sidecar to read the device. The CCD readout system is a custom design comprised of three electrical subsystems - the Back End Electronics (BEE), the Front End Electronics (FEE), and a Pre-amplifier. The BEE is an off-the-shelf PC104 computer, with an auxiliary Xilinx FPGA module. The computer serves as the main interface to the Subaru messaging hub and controls other peripheral devices associated with the camera, while the FPGA is used to generate the necessary clocks and transfer image data from the CCDs. The FEE board sets clock biases, substrate bias, and CDS offsets. It also monitors bias voltages, offset voltages, power rail voltage, substrate voltage and CCD temperature. The board translates LVDS clock signals to biased clocks and returns digitized analog data via LVDS. Monitoring and control messages are sent from the BEE to the FEE using a standard serial interface. The Pre-amplifier board resides behind the detectors and acts as an interface to the two Hamamatsu CCDs. The Pre-amplifier passes clocks and biases to the CCDs, and analog CCD data is buffered and amplified prior to being returned to the FEE. In this paper we describe the

  8. The readout system for the ArTeMis camera

    NASA Astrophysics Data System (ADS)

    Doumayrou, E.; Lortholary, M.; Dumaye, L.; Hamon, G.

    2014-07-01

    During ArTeMiS observations at the APEX telescope (Chajnantor, Chile), 5760 bolometric pixels from 20 arrays at 300mK, corresponding to 3 submillimeter focal planes at 450μm, 350μm and 200μm, have to be read out simultaneously at 40Hz. The read out system, made of electronics and software, is the full chain from the cryostat to the telescope. The readout electronics consists of cryogenic buffers at 4K (NABU), based on CMOS technology, and of warm electronic acquisition systems called BOLERO. The bolometric signal given by each pixel has to be amplified, sampled, converted, time stamped and formatted in data packets by the BOLERO electronics. The time stamping is obtained by the decoding of an IRIG-B signal given by APEX and is key to ensure the synchronization of the data with the telescope. Specifically developed for ArTeMiS, BOLERO is an assembly of analogue and digital FPGA boards connected directly on the top of the cryostat. Two detectors arrays (18*16 pixels), one NABU and one BOLERO interconnected by ribbon cables constitute the unit of the electronic architecture of ArTeMiS. In total, the 20 detectors for the tree focal planes are read by 10 BOLEROs. The software is working on a Linux operating system, it runs on 2 back-end computers (called BEAR) which are small and robust PCs with solid state disks. They gather the 10 BOLEROs data fluxes, and reconstruct the focal planes images. When the telescope scans the sky, the acquisitions are triggered thanks to a specific network protocol. This interface with APEX enables to synchronize the acquisition with the observations on sky: the time stamped data packets are sent during the scans to the APEX software that builds the observation FITS files. A graphical user interface enables the setting of the camera and the real time display of the focal plane images, which is essential in laboratory and commissioning phases. The software is a set of C++, Labview and Python, the qualities of which are respectively used

  9. Method of fabrication of display pixels driven by silicon thin film transistors

    DOEpatents

    Carey, Paul G.; Smith, Patrick M.

    1999-01-01

    Display pixels driven by silicon thin film transistors are fabricated on plastic substrates for use in active matrix displays, such as flat panel displays. The process for forming the pixels involves a prior method for forming individual silicon thin film transistors on low-temperature plastic substrates. Low-temperature substrates are generally considered as being incapable of withstanding sustained processing temperatures greater than about 200.degree. C. The pixel formation process results in a complete pixel and active matrix pixel array. A pixel (or picture element) in an active matrix display consists of a silicon thin film transistor (TFT) and a large electrode, which may control a liquid crystal light valve, an emissive material (such as a light emitting diode or LED), or some other light emitting or attenuating material. The pixels can be connected in arrays wherein rows of pixels contain common gate electrodes and columns of pixels contain common drain electrodes. The source electrode of each pixel TFT is connected to its pixel electrode, and is electrically isolated from every other circuit element in the pixel array.

  10. The LAMBDA photon-counting pixel detector and high-Z sensor development

    NASA Astrophysics Data System (ADS)

    Pennicard, D.; Smoljanin, S.; Struth, B.; Hirsemann, H.; Fauler, A.; Fiederle, M.; Tolbanov, O.; Zarubin, A.; Tyazhev, A.; Shelkov, G.; Graafsma, H.

    2014-12-01

    Many X-ray experiments at third-generation synchrotrons benefit from using single-photon-counting detectors, due to their high signal-to-noise ratio and potential for high-speed measurements. LAMBDA (Large Area Medipix3-Based Detector Array) is a pixel detector system based on the Medipix3 readout chip. It combines the features of Medipix3, such as a small pixel size of 55 μm and flexible functionality, with a large tileable module design consisting of 12 chips (1536 × 512 pixels) and a high-speed readout system capable of running at 2000 frames per second. To enable high-speed experiments with hard X-rays, the LAMBDA system has been combined with different high-Z sensor materials. Room-temperature systems using GaAs and CdTe systems have been produced and tested with X-ray tubes and at synchrotron beamlines. Both detector materials show nonuniformities in their raw image response, but the pixel yield is high and the uniformity can be improved by flat-field correction, particularly in the case of GaAs. High-frame-rate experiments show that useful information can be gained on millisecond timescales in synchrotron experiments with these sensors.

  11. Depleted Monolithic Active Pixel Sensors (DMAPS) implemented in LF-150 nm CMOS technology

    NASA Astrophysics Data System (ADS)

    Kishishita, T.; Hemperek, T.; Krüger, H.; Wermes, N.

    2015-03-01

    We present the recent development of Depleted Monolithic Active Pixel Sensors (DMAPS), implemented with an LFoundry (LF) 150 nm CMOS process. MAPS detectors based on an epi-layer have been matured in recent years and have attractive features in terms of reducing material budget and handling cost compared to conventional hybrid pixel detectors. However, the obtained signal is relatively small (~1000 e-) due to the thin epi-layer, and charge collection time is relatively slow, e.g., in the order of 100 ns, because charges are mainly collected by diffusion. Modern commercial CMOS technology, however, offers advanced process options to overcome such difficulties and enable truly monolithic devices as an alternative to hybrid pixel sensors and charge coupled devices. Unlike in the case of the standard MAPS technologies with epi-layers, the LF process provides a high-resistivity substrate that enables large signal and fast charge collection by drift in a ~50 μm thick depleted layer. Since this process also enables the use of deep n- and p-wells to isolate the collection electrode from the thin active device layer, PMOS and NMOS transistors are available for the readout electronics in each pixel cell. In order to evaluate the sensor and transistor characteristics, several collection electrodes variants and readout architectures have been implemented. In this report, we focus on its design aspect of the LF-DMAPS prototype chip.

  12. The CMS pixel luminosity telescope

    NASA Astrophysics Data System (ADS)

    Kornmayer, A.

    2016-07-01

    The Pixel Luminosity Telescope (PLT) is a new complement to the CMS detector for the LHC Run II data taking period. It consists of eight 3-layer telescopes based on silicon pixel detectors that are placed around the beam pipe on each end of CMS viewing the interaction point at small angle. A fast 3-fold coincidence of the pixel planes in each telescope will provide a bunch-by-bunch measurement of the luminosity. Particle tracking allows collision products to be distinguished from beam background, provides a self-alignment of the detectors, and a continuous in-time monitoring of the efficiency of each telescope plane. The PLT is an independent luminometer, essential to enhance the robustness on the measurement of the delivered luminosity and to reduce its systematic uncertainties. This will allow to determine production cross-sections, and hence couplings, with high precision and to set more stringent limits on new particle production.

  13. Stellar photometry with big pixels

    SciTech Connect

    Buonanno, R.; Iannicola, G.; European Southern Observatory, Garching )

    1989-03-01

    A new software for stellar photometry in crowded fields is presented. This software overcomes the limitations present in a traditional package like ROMAFOT when the pixel size of the detector is comparable to the scale length of point images. This is the case, for instance, with the Hubble Space Telescope-Wide Field Camera and, partially, with the Planetary Camera. The numerical solution presented here is compared to the technical solution of obtaining more exposures of the same field, each shifted by a fraction of pixel. This software will be available in MIDAS. 11 refs.

  14. The phase 1 upgrade of the CMS Pixel Front-End Driver

    NASA Astrophysics Data System (ADS)

    Friedl, M.; Pernicka, M.; Steininger, H.

    2010-12-01

    The pixel detector of the CMS experiment at the LHC is read out by analog optical links, sending the data to 9U VME Front-End Driver (FED) boards located in the electronics cavern. There are plans for the phase 1 upgrade of the pixel detector (2016) to add one more layer, while significantly cutting down the overall material budget. At the same time, the optical data transmission will be replaced by a serialized digital scheme. A plug-in board solution with a high-speed digital optical receiver has been developed for the Pixel-FED readout boards and will be presented along with first tests of the future optical link.

  15. Electron Pattern Recognition using trigger mode SOI pixel sensor for Advanced Compton Imaging

    NASA Astrophysics Data System (ADS)

    Shimazoe, K.; Yoshihara, Y.; Fairuz, A.; Koyama, A.; Takahashi, H.; Takeda, A.; Tsuru, T.; Arai, Y.

    2016-02-01

    Compton imaging is a useful method for localizing sub MeV to a few MeV gamma-rays and widely used for environmental and medical applications. The direction of recoiled electrons in Compton scattering process provides the additional information to limit the Compton cones and increases the sensitivity in the system. The capability of recoiled electron tracking using trigger-mode Silicon-On-Insulator (SOI) sensor is investigated with various radiation sources. The trigger-mode SOI sensor consists of 144 by 144 active pixels with 30 μm cells and the thickness of sensor is 500 μm. The sensor generates the digital output when it is hit by gamma-rays and 25 by 25 pixel pattern of surrounding the triggered pixel is readout to extract the recoiled electron track. The electron track is successfully observed for 60Co and 137Cs sources, which provides useful information for future electron tracking Compton camera.

  16. Development of radiation hard CMOS active pixel sensors for HL-LHC

    NASA Astrophysics Data System (ADS)

    Pernegger, Heinz

    2016-07-01

    New pixel detectors, based on commercial high voltage and/or high resistivity full CMOS processes, hold promise as next-generation active pixel sensors for inner and intermediate layers of the upgraded ATLAS tracker. The use of commercial CMOS processes allow cost-effective detector construction and simpler hybridisation techniques. The paper gives an overview of the results obtained on AMS-produced CMOS sensors coupled to the ATLAS Pixel FE-I4 readout chips. The SOI (silicon-on-insulator) produced sensors by XFAB hold great promise as radiation hard SOI-CMOS sensors due to their combination of partially depleted SOI transistors reducing back-gate effects. The test results include pre-/post-irradiation comparison, measurements of charge collection regions as well as test beam results.

  17. Study of indium and solder bumps for the BTeV Pixel Detector

    SciTech Connect

    Simon W Kwan et al.

    2003-11-05

    The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the strength of the bumps by visual inspection of the bumps bonding silicon sensor modules to dummy chips made out of glass. The studies were done before and after thermal cycles, exposed to intense irradiation, and with the assemblies glued to a graphite substrate. We have also carried out studies on effects of temperature changes on both types of bump bonds by observing the responses of single-chip pixel detectors to an Sr{sup 90} source. We report the results from these studies and our plan to measure the effect of cryogenic temperatures on the bumps.

  18. Code-division-multiplexed readout of large arrays of TES microcalorimeters

    NASA Astrophysics Data System (ADS)

    Morgan, K. M.; Alpert, B. K.; Bennett, D. A.; Denison, E. V.; Doriese, W. B.; Fowler, J. W.; Gard, J. D.; Hilton, G. C.; Irwin, K. D.; Joe, Y. I.; O'Neil, G. C.; Reintsema, C. D.; Schmidt, D. R.; Ullom, J. N.; Swetz, D. S.

    2016-09-01

    Code-division multiplexing (CDM) offers a path to reading out large arrays of transition edge sensor (TES) X-ray microcalorimeters with excellent energy and timing resolution. We demonstrate the readout of X-ray TESs with a 32-channel flux-summed code-division multiplexing circuit based on superconducting quantum interference device (SQUID) amplifiers. The best detector has energy resolution of 2.28 ± 0.12 eV FWHM at 5.9 keV and the array has mean energy resolution of 2.77 ± 0.02 eV over 30 working sensors. The readout channels are sampled sequentially at 160 ns/row, for an effective sampling rate of 5.12 μs/channel. The SQUID amplifiers have a measured flux noise of 0.17 μΦ0/√Hz (non-multiplexed, referred to the first stage SQUID). The multiplexed noise level and signal slew rate are sufficient to allow readout of more than 40 pixels per column, making CDM compatible with requirements outlined for future space missions. Additionally, because the modulated data from the 32 SQUID readout channels provide information on each X-ray event at the row rate, our CDM architecture allows determination of the arrival time of an X-ray event to within 275 ns FWHM with potential benefits in experiments that require detection of near-coincident events.

  19. A Full Parallel Event Driven Readout Technique for Area Array SPAD FLIM Image Sensors

    PubMed Central

    Nie, Kaiming; Wang, Xinlei; Qiao, Jun; Xu, Jiangtao

    2016-01-01

    This paper presents a full parallel event driven readout method which is implemented in an area array single-photon avalanche diode (SPAD) image sensor for high-speed fluorescence lifetime imaging microscopy (FLIM). The sensor only records and reads out effective time and position information by adopting full parallel event driven readout method, aiming at reducing the amount of data. The image sensor includes four 8 × 8 pixel arrays. In each array, four time-to-digital converters (TDCs) are used to quantize the time of photons’ arrival, and two address record modules are used to record the column and row information. In this work, Monte Carlo simulations were performed in Matlab in terms of the pile-up effect induced by the readout method. The sensor’s resolution is 16 × 16. The time resolution of TDCs is 97.6 ps and the quantization range is 100 ns. The readout frame rate is 10 Mfps, and the maximum imaging frame rate is 100 fps. The chip’s output bandwidth is 720 MHz with an average power of 15 mW. The lifetime resolvability range is 5–20 ns, and the average error of estimated fluorescence lifetimes is below 1% by employing CMM to estimate lifetimes. PMID:26828490

  20. Buffer direct injection readout integrated circuit design for dual band infrared focal plane array detector

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Shieh, Hsiu-Li; Tang, Shiang-Feng; Lin, Wen-Jen

    2013-05-01

    This paper proposes dual-mode buffer direct injection (BDI) and direct injection (DI) readout circuit design. The DI readout circuit has the advantage of being a simple circuit, requiring a small layout area, and low power consumption. The internal resistance of the photodetector will affect the photocurrent injection efficiency. We used a buffer amplifier to design the BDI readout circuit since it would reduce the input impedance and raise the injection efficiency. This paper will discuss and analyze the power consumption, injection efficiency, layout area, and circuit noise. The circuit is simulated using a TSMC 0.35 um Mixed Signal 2P4M CMOS 5 V process. The dimension of the pixel area is 30×30 μm. We have designed a 10×8 array for the readout circuit of the interlaced columns. The input current ranges from 1 nA to 10 nA, when the measurement current is 10 pA to 10 nA. The integration time was varied. The circuit output swing was 2 V. The total root mean square noise voltage was 4.84 mV. The signal to noise ratio was 52 dB, and the full chip circuit power consumption was 9.94 mW.

  1. Edge pixel response studies of edgeless silicon sensor technology for pixellated imaging detectors

    NASA Astrophysics Data System (ADS)

    Maneuski, D.; Bates, R.; Blue, A.; Buttar, C.; Doonan, K.; Eklund, L.; Gimenez, E. N.; Hynds, D.; Kachkanov, S.; Kalliopuska, J.; McMullen, T.; O'Shea, V.; Tartoni, N.; Plackett, R.; Vahanen, S.; Wraight, K.

    2015-03-01

    Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μ m thick sensors, with the last pixel-to-edge distance of either 50 or 100 μ m. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μ m, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μ m) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μ m thick n-on-p sensors is affected only for the last two pixels (up to 110 μ m) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.

  2. Simulation of the dynamic inefficiency of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Bartók, M.

    2015-05-01

    The Pixel Detector is the innermost part of the CMS Tracker. It therefore has to prevail in the harshest environment in terms of particle fluence and radiation. There are several mechanisms that may decrease the efficiency of the detector. These are mainly caused by data acquisition (DAQ) problems and/or Single Event Upsets (SEU). Any remaining efficiency loss is referred to as the dynamic inefficiency. It is caused by various mechanisms inside the Readout Chip (ROC) and depends strongly on the data occupancy. In the 2012 data, at high values of instantaneous luminosity the inefficiency reached 2% (in the region closest to the interaction point) which is not negligible. In the 2015 run higher instantaneous luminosity is expected, which will result in lower efficiencies; therefore this effect needs to be understood and simulated. A data-driven method has been developed to simulate dynamic inefficiency, which has been shown to successfully simulate the effects.

  3. Common Bias Readout for TES Array on Scanning Transmission Electron Microscope

    NASA Astrophysics Data System (ADS)

    Yamamoto, R.; Sakai, K.; Maehisa, K.; Nagayoshi, K.; Hayashi, T.; Muramatsu, H.; Nakashima, Y.; Mitsuda, K.; Yamasaki, N. Y.; Takei, Y.; Hidaka, M.; Nagasawa, S.; Maehata, K.; Hara, T.

    2016-07-01

    A transition edge sensor (TES) microcalorimeter array as an X-ray sensor for a scanning transmission electron microscope system is being developed. The technical challenge of this system is a high count rate of ˜ 5000 counts/second/array. We adopted a 64 pixel array with a parallel readout. Common SQUID bias, and common TES bias are planned to reduce the number of wires and the resources of a room temperature circuit. The reduction rate of wires is 44 % when a 64 pixel array is read out by a common bias of 8 channels. The possible degradation of the energy resolution has been investigated by simulations and experiments. The bias fluctuation effects of a series connection are less than those of a parallel connection. Simple calculations expect that the fluctuations of the common SQUID bias and common TES bias in a series connection are 10^{-7} and 10^{-3}, respectively. We constructed 8 SQUIDs which are connected to 8 TES outputs and a room temperature circuit for common bias readout and evaluated experimentally. Our simulation of crosstalk indicates that at an X-ray event rate of 500 cps/pixel, crosstalk will broaden a monochromatic line by about 0.01 %, or about 1.5 eV at 15 keV. Thus, our design goal of 10 eV energy resolution across the 0.5-15 keV band should be achievable.

  4. A fully digital readout employing extended counting method to achieve very low quantization noise

    NASA Astrophysics Data System (ADS)

    Kayahan, Huseyin; Ceylan, Ömer; Yazici, Melik; Gurbuz, Yasar

    2013-06-01

    This paper presents a digital ROIC for staring type arrays with extending counting method to realize very low quantization noise while achieving a very high charge handling capacity. Current state of the art has shown that digital readouts with pulse frequency method can achieve charge handling capacities higher than 3Ge- with quantization noise higher than 1000e-. Even if the integration capacitance is reduced, it cannot be lower than 1-3 fF due to the parasitic capacitance of the comparator. For achieving a very low quantization noise of 200 electrons in a power efficient way, a new method based on measuring the time to measure the remaining charge on the integration capacitor is proposed. With this approach SNR of low flux pixels are significantly increased while large flux pixels can store electrons as high as 2.33Ge-. A prototype array of 32x32 pixels with 30μm pitch is implemented in 90nm CMOS process technology for verification. Simulation results are given for complete readout.

  5. R&D on a novel spectro-imaging polarimeter with Micromegas detectors and a Caliste readout system

    NASA Astrophysics Data System (ADS)

    Attié, D.; Blondel, C.; Boilevin-Kayl, L.; Desforges, D.; Ferrer-Ribas, E.; Giomataris, I.; Gevin, O.; Jeanneau, F.; Limousin, O.; Meuris, A.; Papaevangelou, T.; Peyaud, A.

    2015-07-01

    Micromegas detectors, part of the Micro-Pattern Gaseous Detectors (MPGD) family, are used in a very wide range of applications in the High Energy Physics community but also in astroparticle and neutrino physics. In most of the Micromegas applications the design of the detector vessel and the readout plane is extremely coupled. A way of dissociating these two components would be by separating the amplification structure and the detector volume from the readout plane and electronics. This is achieved with the so called piggyback Micromegas detectors. They open up new possibilities of applications in terms of adaptability to new electronics. In particular piggyback resistive Micromegas can be easily coupled to modern pixel array electronic ASICs. First tests have been carried out with a Medipix chip where the protection of the resistive layer has been proved. The results of very recent tests coupling piggyback Micromegas with the readout module of Caliste are presented. Caliste is a high performance spectro-imager with event time-tagging capability, able to detect photons between 2 keV and 250 keV in the context of a spatial micro spectro-imaging polarimetrer. In the current application, with the Piggyback Micromegas, we use the readout module only as the sensitive detector. We benefit of the good spatial resolution thanks to the high density readout pixels (~600 μm pixel pitch), to the low noise, to the low power and to the radiation hard integrated front-end IDEF-X electronics. The advantage of such a device is to have a high gain, low noise, low threshold, and robust detector operating at room temperature. This would be very attractive for spatial applications, for instance X-ray polarisation.

  6. A fast readout and processing electronics for photon counting intensified charge-coupled device

    NASA Astrophysics Data System (ADS)

    Bergamini, P.; Bonelli, G.; Tanzi, E. G.; Uslenghi, M.; Poletto, L.; Tondello, G.

    2000-04-01

    The design features and the performances of a prototype photon counting imaging detector, being developed for the international ultraviolet (UV) space mission Spectrum UV, are presented. The photon counter is an intensified charge coupled device (ICCD) in which photon events, generating an electron cascade through a high gain microchannel plate (MCP) stack, are transduced, via a phosphor screen and a fiber optics reducer, into a 3×3 pixel2, quasi-Gaussian charge distributions on a 15×15 μm2,512×512 pixel2 format CCD matrix. The CCD is read out in the frame-transfer mode at a pixel rate of 19.75 MHz, and its output data flow is acquired serially as to generate a 3×3 pixel2 event sash that sweeps dynamically the CCD matrix at the 50.6 ns rate of the readout clock. Each and every event sash is searched for the presence of events whose charge content lie within proper limits and satisfy a given set of morphological rules, i.e., a single peak charge profile. The centroid coordinates of identified events are determined with subpixel accuracy (up to a 210 bin/pixel) and subsequently stored as photon list coordinate pairs. The data acquisition and processing system is based on field programmable gate array technology and is capable of satisfying the requirements of real-time operation. The modular construction of the data acquisition and processing electronics provides a great deal of flexibility for supporting advancements in CCD readout techniques (multiple output and higher clocking speed) and of MCPs (larger formats, smaller pore, and higher dynamic range). The results of the performance verification of the data acquisition and processing system integrated with a laboratory ICCD prototype are presented and discussed.

  7. A DC-DC conversion powering scheme for the CMS Phase-1 pixel upgrade

    NASA Astrophysics Data System (ADS)

    Feld, L.; Fleck, M.; Friedrichs, M.; Hensch, R.; Karpinski, W.; Klein, K.; Sammet, J.; Wlochal, M.

    2013-02-01

    The CMS pixel detector was designed for a nominal instantaneous LHC luminosity of 1ṡ1034 cm-2s-1. During Phase-1 of the LHC upgrade, the instantaneous luminosity will be increased to about twice this value. To preserve the excellent performance of the pixel detector despite the increase in particle rates and track densities, the CMS Collaboration foresees the exchange of its pixel detector in the shutdown 2016/2017. The new pixel detector will be improved in many respects, and will comprise twice the number of readout channels. A powering scheme based on DC-DC conversion will be adopted, which will enable the provision of the required power with the present cable plant. The powering scheme of the CMS pixel detector will be described, and the performance of prototype DC-DC buck converters will be presented, including power efficiency, system tests with DC-DC converters and pixel modules, thermal management, reliability at low temperature, and studies of potential frequency locking between DC-DC converters.

  8. Prototype characterization of the JUNGFRAU pixel detector for SwissFEL

    NASA Astrophysics Data System (ADS)

    Mozzanica, A.; Bergamaschi, A.; Cartier, S.; Dinapoli, R.; Greiffenberg, D.; Johnson, I.; Jungmann, J.; Maliakal, D.; Mezza, D.; Ruder, C.; Schaedler, L.; Schmitt, B.; Shi, X.; Tinti, G.

    2014-05-01

    The SwissFEL, a free electron laser (FEL) based next generation X-ray source, is being built at PSI. An XFEL poses several challenges to the detector development: in particular the single photon counting readout, a successful scheme in case of synchrotron sources, can not be used. At the same time the data quality of photon counting systems, i.e. the low noise and the high dynamic range, is essential from an experimental point of view. Detectors with these features are under development for the EU-XFEL in Hamburg, with the PSI SLS Detector group being involved in one of these efforts (AGIPD). The pulse train time structure of the EU-XFEL machine forces the need of in pixel image storage, resulting in pixel pitches in the 200 μm range. Since the SwissFEL is a 100 Hz repetition rate machine, this constrain is relaxed. For this reason, PSI is developing a 75 μm pitch pixel detector that, thanks to its automatic gain switching technique, will achieve single photon resolution and a high dynamic range. The detector is modular, with each module consisting of a 4 × 8 cm2 active sensor bump bonded to 8 readout ASICs (Application Specific Integrated Circuit), connected to a single printed circuit readout board with 10GbE link capabilities for data download. We have designed and tested a 48 × 48 pixel prototype produced in UMC110 nm technology. In this paper we present the general detector and ASIC design as well as the results of the prototype characterization measurements.

  9. A 65k pixel, 150k frames-per-second camera with global gating and micro-lenses suitable for fluorescence lifetime imaging

    NASA Astrophysics Data System (ADS)

    Burri, Samuel; Powolny, François; Bruschini, Claudio E.; Michalet, Xavier; Regazzoni, Francesco; Charbon, Edoardo

    2014-05-01

    This paper presents our work on a 65k pixel single-photon avalanche diode (SPAD) based imaging sensor realized in a 0.35μm standard CMOS process. At a resolution of 512 by 128 pixels the sensor is read out in 6.4μs to deliver over 150k monochrome frames per second. The individual pixel has a size of 24μm2 and contains the SPAD with a 12T quenching and gating circuitry along with a memory element. The gating signals are distributed across the chip through a balanced tree to minimize the signal skew between the pixels. The array of pixels is row-addressable and data is sent out of the chip on 128 lines in parallel at a frequency of 80MHz. The system is controlled by an FPGA which generates the gating and readout signals and can be used for arbitrary real-time computation on the frames from the sensor. The communication protocol between the camera and a conventional PC is USB2. The active area of the chip is 5% and can be significantly improved with the application of a micro-lens array. A micro-lens array, for use with collimated light, has been designed and its performance is reviewed in the paper. Among other high-speed phenomena the gating circuitry capable of generating illumination periods shorter than 5ns can be used for Fluorescence Lifetime Imaging (FLIM). In order to measure the lifetime of fluorophores excited by a picosecond laser, the sensor's illumination period is synchronized with the excitation laser pulses. A histogram of the photon arrival times relative to the excitation is then constructed by counting the photons arriving during the sensitive time for several positions of the illumination window. The histogram for each pixel is transferred afterwards to a computer where software routines extract the lifetime at each location with an accuracy better than 100ps. We show results for fluorescence lifetime measurements using different fluorophores with lifetimes ranging from 150ps to 5ns.

  10. Study of the spatial resolution for binary readout detectors

    NASA Astrophysics Data System (ADS)

    Yonamine, R.; Maerschalk, T.; Lentdecker, G. De

    2016-07-01

    Often the binary readout is proposed for high granularity detectors to reduce the generated data volume to be readout at the price of a somewhat reduced spatial resolution compared to an analogue readout. We have been studying single hit resolutions obtained with a binary readout using simulations as well as analytical approaches. In this note we show that the detector geometry could be optimized to offer an equivalent spatial resolution than with an analogue readout.

  11. HEPS-BPIX, a single photon counting pixel detector with a high frame rate for the HEPS project

    NASA Astrophysics Data System (ADS)

    Wei, Wei; Zhang, Jie; Ning, Zhe; Lu, Yunpeng; Fan, Lei; Li, Huaishen; Jiang, Xiaoshan; Lan, Allan K.; Ouyang, Qun; Wang, Zheng; Zhu, Kejun; Chen, Yuanbo; Liu, Peng

    2016-11-01

    China's next generation light source, named the High Energy Photon Source (HEPS), is currently under construction. HEPS-BPIX (HEPS-Beijing PIXel) is a dedicated pixel readout chip that operates in single photon counting mode for X-ray applications in HEPS. Designed using CMOS 0.13 μm technology, the chip contains a matrix of 104×72 pixels. Each pixel measures 150 μm×150 μm and has a counting depth of 20 bits. A bump-bonded prototyping detector module with a 300-μm thick silicon sensor was tested in the beamline of Beijing Synchrotron Radiation Facility. A fast stream of X-ray images was demonstrated, and a frame rate of 1.2 kHz was proven, with a negligible dead time. The test results showed an equivalent noise charge of 115 e- rms after bump bonding and a threshold dispersion of 55 e- rms after calibration.

  12. Development and performance of Kyoto's x-ray astronomical SOI pixel (SOIPIX) sensor

    NASA Astrophysics Data System (ADS)

    Tsuru, Takeshi G.; Matsumura, Hideaki; Takeda, Ayaki; Tanaka, Takaaki; Nakashima, Shinya; Arai, Yasuo; Mori, Koji; Takenaka, Ryota; Nishioka, Yusuke; Kohmura, Takayoshi; Hatsui, Takaki; Kameshima, Takashi; Ozaki, Kyosuke; Kohmura, Yoshiki; Wagai, Tatsuya; Takei, Dai; Kawahito, Shoji; Kagawa, Keiichiro; Yasutomi, Keita; Kamehama, Hiroki

    2014-08-01

    We have been developing monolithic active pixel sensors, known as Kyoto's X-ray SOIPIXs, based on the CMOS SOI (silicon-on-insulator) technology for next-generation X-ray astronomy satellites. The event trigger output function implemented in each pixel offers microsecond time resolution and enables reduction of the non-X-ray background that dominates the high X-ray energy band above 5-10 keV. A fully depleted SOI with a thick depletion layer and back illumination offers wide band coverage of 0.3-40 keV. Here, we report recent progress in the X-ray SOIPIX development. In this study, we achieved an energy resolution of 300 eV (FWHM) at 6 keV and a read-out noise of 33 e- (rms) in the frame readout mode, which allows us to clearly resolve Mn-Kα and Kβ. Moreover, we produced a fully depleted layer with a thickness of 500 μm. The event-driven readout mode has already been successfully demonstrated.

  13. A CMOS Active Pixel Sensor for Charged Particle Detection

    SciTech Connect

    Matis, Howard S.; Bieser, Fred; Kleinfelder, Stuart; Rai, Gulshan; Retiere, Fabrice; Ritter, Hans George; Singh, Kunal; Wurzel, Samuel E.; Wieman, Howard; Yamamoto, Eugene

    2002-12-02

    Active Pixel Sensor (APS) technology has shown promise for next-generation vertex detectors. This paper discusses the design and testing of two generations of APS chips. Both are arrays of 128 by 128 pixels, each 20 by 20 {micro}m. Each array is divided into sub-arrays in which different sensor structures (4 in the first version and 16 in the second) and/or readout circuits are employed. Measurements of several of these structures under Fe{sup 55} exposure are reported. The sensors have also been irradiated by 55 MeV protons to test for radiation damage. The radiation increased the noise and reduced the signal. The noise can be explained by shot noise from the increased leakage current and the reduction in signal is due to charge being trapped in the epi layer. Nevertheless, the radiation effect is small for the expected exposures at RHIC and RHIC II. Finally, we describe our concept for mechanically supporting a thin silicon wafer in an actual detector.

  14. Pixelated transmission-mode diamond X-ray detector

    PubMed Central

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-01-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60–100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼1 kHz, which leads to an image sampling rate of ∼30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5–15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10−2 to 90 W mm−2. Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%). PMID:26524304

  15. Pixelated transmission-mode diamond X-ray detector.

    PubMed

    Zhou, Tianyi; Ding, Wenxiang; Gaowei, Mengjia; De Geronimo, Gianluigi; Bohon, Jen; Smedley, John; Muller, Erik

    2015-11-01

    Fabrication and testing of a prototype transmission-mode pixelated diamond X-ray detector (pitch size 60-100 µm), designed to simultaneously measure the flux, position and morphology of an X-ray beam in real time, are described. The pixel density is achieved by lithographically patterning vertical stripes on the front and horizontal stripes on the back of an electronic-grade chemical vapor deposition single-crystal diamond. The bias is rotated through the back horizontal stripes and the current is read out on the front vertical stripes at a rate of ∼ 1 kHz, which leads to an image sampling rate of ∼ 30 Hz. This novel signal readout scheme was tested at beamline X28C at the National Synchrotron Light Source (white beam, 5-15 keV) and at beamline G3 at the Cornell High Energy Synchrotron Source (monochromatic beam, 11.3 keV) with incident beam flux ranges from 1.8 × 10(-2) to 90 W mm(-2). Test results show that the novel detector provides precise beam position (positional noise within 1%) and morphology information (error within 2%), with an additional software-controlled single channel mode providing accurate flux measurement (fluctuation within 1%).

  16. Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector

    NASA Astrophysics Data System (ADS)

    Tehrani, N. Alipour; Arfaoui, S.; Benoit, M.; Dannheim, D.; Dette, K.; Hynds, D.; Kulis, S.; Perić, I.; Petrič, M.; Redford, S.; Sicking, E.; Valerio, P.

    2016-07-01

    The vertex detector at the proposed CLIC multi-TeV linear e+e- collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. A prototype of such an assembly, using two custom designed chips (CCPDv3 as active sensor glued to a CLICpix readout chip), has been characterised both in the lab and in beam tests at the CERN SPS using 120 GeV/c positively charged hadrons. Results of these characterisation studies are presented both for single and dual amplification stages in the active sensor, where efficiencies of greater than 99% have been achieved at -60 V substrate bias, with a single hit resolution of 6.1 μm . Pixel cross-coupling results are also presented, showing the sensitivity to placement precision and planarity of the glue layer.

  17. MISTRAL & ASTRAL: two CMOS Pixel Sensor architectures suited to the Inner Tracking System of the ALICE experiment

    NASA Astrophysics Data System (ADS)

    Morel, F.; Hu-Guo, C.; Bertolone, G.; Claus, G.; Colledani, C.; Dorokhov, A.; Dozière, G.; Dulinski, W.; Fang, X.; Goffe, M.; Himmi, A.; Jaaskelainen, K.; Senyukov, S.; Specht, M.; Szelezniak, M.; Pham, H.; Valin, I.; Wang, T.; Winter, M.

    2014-01-01

    A detector, equipped with 50 μm thin CMOS Pixel Sensors (CPS), is being designed for the upgrade of the Inner Tracking System (ITS) of the ALICE experiment at LHC. Two CPS flavours, MISTRAL and ASTRAL, are being developed at IPHC aiming to meet the requirements of the ITS upgrade. The first is derived from the MIMOSA28 sensor designed for the STAR-PXL detector. The second integrates a discriminator in each pixel to improve the readout speed and power consumption. This paper will describe in details the sensor development and show some preliminary test results.

  18. Single-pixel polarimetric imaging.

    PubMed

    Durán, Vicente; Clemente, Pere; Fernández-Alonso, Mercedes; Tajahuerce, Enrique; Lancis, Jesús

    2012-03-01

    We present an optical system that performs Stokes polarimetric imaging with a single-pixel detector. This fact is possible by applying the theory of compressive sampling to the data acquired by a commercial polarimeter without spatial resolution. The measurement process is governed by a spatial light modulator, which sequentially generates a set of preprogrammed light intensity patterns. Experimental results are presented and discussed for an object that provides an inhomogeneous polarization distribution. PMID:22378406

  19. Representing SAR complex image pixels

    NASA Astrophysics Data System (ADS)

    Doerry, A. W.

    2016-05-01

    Synthetic Aperture Radar (SAR) images are often complex-valued to facilitate specific exploitation modes. Furthermore, these pixel values are typically represented with either real/imaginary (also known as I/Q) values, or as Magnitude/Phase values, with constituent components comprised of integers with limited number of bits. For clutter energy well below full-scale, Magnitude/Phase offers lower quantization noise than I/Q representation. Further improvement can be had with companding of the Magnitude value.

  20. SAR Image Complex Pixel Representations

    SciTech Connect

    Doerry, Armin W.

    2015-03-01

    Complex pixel values for Synthetic Aperture Radar (SAR) images of uniform distributed clutter can be represented as either real/imaginary (also known as I/Q) values, or as Magnitude/Phase values. Generally, these component values are integers with limited number of bits. For clutter energy well below full-scale, Magnitude/Phase offers lower quantization noise than I/Q representation. Further improvement can be had with companding of the Magnitude value.

  1. Merlin: a fast versatile readout system for Medipix3

    NASA Astrophysics Data System (ADS)

    Plackett, R.; Horswell, I.; Gimenez, E. N.; Marchal, J.; Omar, D.; Tartoni, N.

    2013-01-01

    This contribution reports on the development of a new high rate readout system for the Medipix3 hybrid pixel ASIC developed by the Detector Group at Diamond Light Source. It details the current functionality of the system and initial results from tests on Diamond's B16 beamline. The Merlin system is based on a National Instruments PXI/FlexRIO system running a Xilinx Virtex5 FPGA. It is capable of recording Medipix3 256 by 256 by 12 bit data frames at over 1 kHz in bursts of 1200 frames and running at over 100 Hz continuously to disk or over a TCP/IP link. It is compatible with the standard Medipix3 single chipboards developed at CERN and is capable of driving them over cable lengths of up to 10 m depending on the data rate required. In addition to a standalone graphical interface, a system of remote TCP/IP control and data transfer has been developed to allow easy integration with third party control systems and scripting languages. Two Merlin systems are being deployed on the B16 and I16 beamlines at Diamond and the system has been integrated with the EPICS/GDA control systems used. Results from trigger synchronisation, fast burst and high rate tests made on B16 in March are reported and demonstrate an encouraging reliability and timing accuracy. In addition to normal high resolution imaging applications of Medipix3, the results indicate the system could profitably be used in `pump and probe' style experiments, where a very accurate, high frame rate is especially beneficial. In addition to these two systems, Merlin is being used by the Detector Group to test the Excalibur 16 chip hybrid modules, and by the LHCb VELO Pixel Upgrade group in their forthcoming testbeams. Additionally the contribution looks forward to further developments and improvements in the system, including full rate quad chip readout capability, multi-FPGA support, long distance optical communication and further functionality enhancements built on the capabilities of the Medipix3 chips.

  2. CMOS digital pixel sensors: technology and applications

    NASA Astrophysics Data System (ADS)

    Skorka, Orit; Joseph, Dileepan

    2014-04-01

    CMOS active pixel sensor technology, which is widely used these days for digital imaging, is based on analog pixels. Transition to digital pixel sensors can boost signal-to-noise ratios and enhance image quality, but can increase pixel area to dimensions that are impractical for the high-volume market of consumer electronic devices. There are two main approaches to digital pixel design. The first uses digitization methods that largely rely on photodetector properties and so are unique to imaging. The second is based on adaptation of a classical analog-to-digital converter (ADC) for in-pixel data conversion. Imaging systems for medical, industrial, and security applications are emerging lower-volume markets that can benefit from these in-pixel ADCs. With these applications, larger pixels are typically acceptable, and imaging may be done in invisible spectral bands.

  3. Optical readout of a triple-GEM detector by means of a CMOS sensor

    NASA Astrophysics Data System (ADS)

    Marafini, M.; Patera, V.; Pinci, D.; Sarti, A.; Sciubba, A.; Spiriti, E.

    2016-07-01

    In last years, the development of optical sensors has produced objects able to provide very interesting performance. Large granularity is offered along with a very high sensitivity. CMOS sensors with millions of pixels able to detect as few as two or three photons per pixel are commercially available and can be used to read-out the optical signals provided by tracking particle detectors. In this work the results obtained by optically reading-out a triple-GEM detector by a commercial CMOS sensor will be presented. A standard detector was assembled with a transparent window below the third GEM allowing the light to get out. The detector is supplied with an Ar/CF4 based gas mixture producing 650 nm wavelength photons matching the maximum quantum efficiency of the sensor.

  4. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, Suresh (Inventor); Cole, David (Inventor); Smith, Roger M (Inventor); Hancock, Bruce R. (Inventor)

    2013-01-01

    The effects of inter pixel capacitance in a pixilated array may be measured by first resetting all pixels in the array to a first voltage, where a first image is read out, followed by resetting only a subset of pixels in the array to a second voltage, where a second image is read out, where the difference in the first and second images provide information about the inter pixel capacitance. Other embodiments are described and claimed.

  5. The BTeV pixel and microstrip detector

    SciTech Connect

    Simon W Kwan

    2003-06-04

    The BTeV pixel detector is one of the most crucial elements in the BTeV experiment. While the pixel detector is technically challenging, we have made great progress towards identifying viable solutions for individual components of the system. The forward silicon tracker is based on more mature technology and its design has benefited from the experience of other experiments. Nevertheless, we have started an R&D program on the forward silicon tracker and first results are expected some time next year.

  6. Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging.

    PubMed

    Resetar, Tomislav; De Munck, Koen; Haspeslagh, Luc; Rosmeulen, Maarten; Süss, Andreas; Puers, Robert; Van Hoof, Chris

    2016-01-01

    This work explores the benefits of linear-mode avalanche photodiodes (APDs) in high-speed CMOS imaging as compared to different approaches present in literature. Analysis of APDs biased below their breakdown voltage employed in single-photon counting mode is also discussed, showing a potentially interesting alternative to existing Geiger-mode APDs. An overview of the recently presented gated pinned avalanche photodiode pixel concept is provided, as well as the first experimental results on a 8 × 16 pixel test array. Full feasibility of the proposed pixel concept is not demonstrated; however, informative data is obtained from the sensor operating under -32 V substrate bias and clearly exhibiting wavelength-dependent gain in frontside illumination. The readout of the chip designed in standard 130 nm CMOS technology shows no dependence on the high-voltage bias. Readout noise level of 15 e - rms, full well capacity of 8000 e - , and the conversion gain of 75 µV / e - are extracted from the photon-transfer measurements. The gain characteristics of the avalanche junction are characterized on separate test diodes showing a multiplication factor of 1.6 for red light in frontside illumination. PMID:27537882

  7. Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging

    PubMed Central

    Resetar, Tomislav; De Munck, Koen; Haspeslagh, Luc; Rosmeulen, Maarten; Süss, Andreas; Puers, Robert; Van Hoof, Chris

    2016-01-01

    This work explores the benefits of linear-mode avalanche photodiodes (APDs) in high-speed CMOS imaging as compared to different approaches present in literature. Analysis of APDs biased below their breakdown voltage employed in single-photon counting mode is also discussed, showing a potentially interesting alternative to existing Geiger-mode APDs. An overview of the recently presented gated pinned avalanche photodiode pixel concept is provided, as well as the first experimental results on a 8 × 16 pixel test array. Full feasibility of the proposed pixel concept is not demonstrated; however, informative data is obtained from the sensor operating under −32 V substrate bias and clearly exhibiting wavelength-dependent gain in frontside illumination. The readout of the chip designed in standard 130 nm CMOS technology shows no dependence on the high-voltage bias. Readout noise level of 15 e- rms, full well capacity of 8000e-, and the conversion gain of 75 µV/e- are extracted from the photon-transfer measurements. The gain characteristics of the avalanche junction are characterized on separate test diodes showing a multiplication factor of 1.6 for red light in frontside illumination. PMID:27537882

  8. Prototypes and system test stands for the Phase 1 upgrade of the CMS pixel detector

    NASA Astrophysics Data System (ADS)

    Hasegawa, S.

    2016-09-01

    The CMS pixel phase-1 upgrade project replaces the current pixel detector with an upgraded system with faster readout electronics during the extended year-end technical stop of 2016/2017. New electronics prototypes for the system have been developed, and tests in a realistic environment for a comprehensive evaluation are needed. A full readout test stand with either the same hardware as used in the current CMS pixel detector or the latest prototypes of upgrade electronics has been built. The setup enables the observation and investigation of a jitter increase in the data line associated with trigger rate increases. This effect is due to the way in which the clock and trigger distribution is implemented in CMS. A new prototype of the electronics with a PLL based on a voltage controlled quartz crystal oscillator (QPLL), which works as jitter filter, in the clock distribution path was produced. With the test stand, it was confirmed that the jitter increase is not seen with the prototype, and also good performance was confirmed at the expected detector operation temperature (-20 °C).

  9. Characterization of Depleted Monolithic Active Pixel detectors implemented with a high-resistive CMOS technology

    NASA Astrophysics Data System (ADS)

    Kishishita, T.; Hemperek, T.; Rymaszewski, P.; Hirono, T.; Krüger, H.; Wermes, N.

    2016-07-01

    We present the recent development of DMAPS (Depleted Monolithic Active Pixel Sensor), implemented with a Toshiba 130 nm CMOS process. Unlike in the case of standard MAPS technologies which are based on an epi-layer, this process provides a high-resistive substrate that enables larger signal and faster charge collection by drift in a 50 - 300 μm thick depleted layer. Since this process also enables the use of deep n-wells to isolate the collection electrodes from the thin active device layer, NMOS and PMOS transistors are available for the readout electronics in each pixel cell. In order to characterize the technology, we implemented a simple three transistor readout with a variety of pixel pitches and input FET sizes. This layout variety gives us a clue on sensor characteristics for future optimization, such as the input detector capacitance or leakage current. In the initial measurement, the radiation spectra were obtained from 55Fe with an energy resolution of 770 eV (FWHM) and 90Sr with the MVP of 4165 e-.

  10. Development of Gated Pinned Avalanche Photodiode Pixels for High-Speed Low-Light Imaging.

    PubMed

    Resetar, Tomislav; De Munck, Koen; Haspeslagh, Luc; Rosmeulen, Maarten; Süss, Andreas; Puers, Robert; Van Hoof, Chris

    2016-08-15

    This work explores the benefits of linear-mode avalanche photodiodes (APDs) in high-speed CMOS imaging as compared to different approaches present in literature. Analysis of APDs biased below their breakdown voltage employed in single-photon counting mode is also discussed, showing a potentially interesting alternative to existing Geiger-mode APDs. An overview of the recently presented gated pinned avalanche photodiode pixel concept is provided, as well as the first experimental results on a 8 × 16 pixel test array. Full feasibility of the proposed pixel concept is not demonstrated; however, informative data is obtained from the sensor operating under -32 V substrate bias and clearly exhibiting wavelength-dependent gain in frontside illumination. The readout of the chip designed in standard 130 nm CMOS technology shows no dependence on the high-voltage bias. Readout noise level of 15 e - rms, full well capacity of 8000 e - , and the conversion gain of 75 µV / e - are extracted from the photon-transfer measurements. The gain characteristics of the avalanche junction are characterized on separate test diodes showing a multiplication factor of 1.6 for red light in frontside illumination.

  11. VO II-based microbolometer uncooled infrared focal plane arrays with CMOS readout integrated circuit

    NASA Astrophysics Data System (ADS)

    Chen, Xiqu; Yi, Xinjian

    2005-11-01

    Thin films of vanadium dioxide (VO II) were selected for microbolometers. The thin films were fabricated with a novel method mainly including ion-sputtering and annealing. It is found that the electrical properties of these thin films can be controlled by adjusting the time of ion-sputtering and annealing. A standard microbolometer pixel structure of micro-bridge has been applied. Two-dimensional arrays of microbolometers have been fabricated on silicon integrated circuit wafers using a surface micromachining technique. A new type of on-chip readout integrated circuit (ROIC) for 32×32 pixel bolometric detector arrays has been designed and fabricated using a 1.5μm double metal poly complementary metal oxide semiconductor (CMOS) processing. The readout circuit consists of three stages, which provides low noise, a highly stable detector bias, high photon current injection efficiency, high gain, and high speed. Several prototypes of 32×32 pixel bolometric detector arrays have been designed and fabricated. These arrays consist of detectors with lateral dimensions of 50μm 50μm, and each bolometric detector is on a 100μm pitch. The results of measurement show that the fabricated uncooled infrared focal plane arrays (UIRFPAs) have excellent performance. The frame rate is 50Hz, the pixel operability is above 96%, the responsivity (R) @ f/1 value is up to 15000V/W, the noise equivalent temperature difference (NETD) @ f/1 and 30Hz is about 50mK, and the average power dissipation is only 24.7mW. The results indicate that the technology of fabricating these 32×32 UIRFPAs has potential to be utilized for fabricating low cost and large-scale UIRFPAs.

  12. 3 mega-pixel InSb detector with 10μm pitch

    NASA Astrophysics Data System (ADS)

    Gershon, G.; Albo, A.; Eylon, M.; Cohen, O.; Calahorra, Z.; Brumer, M.; Nitzani, M.; Avnon, E.; Aghion, Y.; Kogan, I.; Ilan, E.; Shkedy, L.

    2013-06-01

    SCD has developed a new 1920x1536 / 10 μm digital Infrared detector for the MWIR window named Blackbird. The Blackbird detector features a Focal Plane Array (FPA) that incorporates two technological building blocks developed over the past few years. The first one is a 10 μm InSb pixel based on the matured planar technology. The second building block is an innovative 10 μm ReadOut Integrated Circuit (ROIC) pixel. The InSb and the ROIC arrays are connected using Flip-Chip technology by means of indium bumps. The digital ROIC consists a matrix of 1920x1536 pixels and has an analog to digital (A/D) converter per-channel (total of 1920x2 A/Ds). It allows for full frame readout at a high frame rate of up to 120 Hz. Such an on-chip A/D conversion eliminates the need for several A/D converters with fairly high power consumption at the system level. The ROIC power consumption at maximum bandwidth is less than 400 mW. It features a wide range of pixel-level functionality such as several conversion gain options and a 2x2 pixel binning. The ROIC design makes use of the advanced and matured CMOS technology, 0.18 μm, which allows for high functionality and relatively low power consumption. The FPA is mounted on a Cold-Finger by a specially designed ceramic substrate. The whole assembly is housed in a stiffened Dewar that withstands harsh environmental conditions while minimizing the environment heat load contribution to the heat load of the detector. The design enables a 3-megapixel detector with overall low size, weight, and power (SWaP) with respect to comparable large format detectors. In this work we present in detail the characteristic performance of the new Blackbird detector.

  13. Charge amplitude distribution of the Gossip gaseous pixel detector

    NASA Astrophysics Data System (ADS)

    Blanco Carballo, V. M.; Chefdeville, M.; Colas, P.; Giomataris, Y.; van der Graaf, H.; Gromov, V.; Hartjes, F.; Kluit, R.; Koffeman, E.; Salm, C.; Schmitz, J.; Smits, S. M.; Timmermans, J.; Visschers, J. L.

    2007-12-01

    The Gossip gaseous pixel detector is being developed for the detection of charged particles in extreme high radiation environments as foreseen close to the interaction point of the proposed super LHC. The detecting medium is a thin layer of gas. Because of the low density of this medium, only a few primary electron/ion pairs are created by the traversing particle. To get a detectable signal, the electrons drift towards a perforated metal foil (Micromegas) whereafter they are multiplied in a gas avalanche to provide a detectable signal. The gas avalanche occurs in the high field between the Micromegas and the pixel readout chip (ROC). Compared to a silicon pixel detector, Gossip features a low material budget and a low cooling power. An experiment using X-rays has indicated a possible high radiation tolerance exceeding 10 16 hadrons/cm 2. The amplified charge signal has a broad amplitude distribution due to the limited statistics of the primary ionization and the statistical variation of the gas amplification. Therefore, some degree of inefficiency is inevitable. This study presents experimental results on the charge amplitude distribution for CO 2/DME (dimethyl-ether) and Ar/iC 4H 10 mixtures. The measured curves were fitted with the outcome of a theoretical model. In the model, the physical Landau distribution is approximated by a Poisson distribution that is convoluted with the variation of the gas gain and the electronic noise. The value for the fraction of pedestal events is used for a direct calculation of the cluster density. For some gases, the measured cluster density is considerably lower than given in literature.

  14. The DEPFET Sensor-Amplifier Structure: A Method to Beat 1/f Noise and Reach Sub-Electron Noise in Pixel Detectors.

    PubMed

    Lutz, Gerhard; Porro, Matteo; Aschauer, Stefan; Wölfel, Stefan; Strüder, Lothar

    2016-01-01

    Depleted field effect transistors (DEPFET) are used to achieve very low noise signal charge readout with sub-electron measurement precision. This is accomplished by repeatedly reading an identical charge, thereby suppressing not only the white serial noise but also the usually constant 1/f noise. The repetitive non-destructive readout (RNDR) DEPFET is an ideal central element for an active pixel sensor (APS) pixel. The theory has been derived thoroughly and results have been verified on RNDR-DEPFET prototypes. A charge measurement precision of 0.18 electrons has been achieved. The device is well-suited for spectroscopic X-ray imaging and for optical photon counting in pixel sensors, even at high photon numbers in the same cell. PMID:27136549

  15. The DEPFET Sensor-Amplifier Structure: A Method to Beat 1/f Noise and Reach Sub-Electron Noise in Pixel Detectors

    PubMed Central

    Lutz, Gerhard; Porro, Matteo; Aschauer, Stefan; Wölfel, Stefan; Strüder, Lothar

    2016-01-01

    Depleted field effect transistors (DEPFET) are used to achieve very low noise signal charge readout with sub-electron measurement precision. This is accomplished by repeatedly reading an identical charge, thereby suppressing not only the white serial noise but also the usually constant 1/f noise. The repetitive non-destructive readout (RNDR) DEPFET is an ideal central element for an active pixel sensor (APS) pixel. The theory has been derived thoroughly and results have been verified on RNDR-DEPFET prototypes. A charge measurement precision of 0.18 electrons has been achieved. The device is well-suited for spectroscopic X-ray imaging and for optical photon counting in pixel sensors, even at high photon numbers in the same cell. PMID:27136549

  16. Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade

    SciTech Connect

    Grenier, P.; Alimonti, G.; Barbero, M.; Bates, R.; Bolle, E.; Borri, M.; Boscardin, M.; Buttar, C.; Capua, M.; Cavalli-Sforza, M.; Cobal, M.; Cristofoli, A.; Dalla Betta, G.F.; Darbo, G.; Da Via, C.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dobos, D.; Einsweiler, K.; Esseni, D.; /Udine U. /INFN, Udine /Calabria U. /INFN, Cosenza /Barcelona, Inst. Microelectron. /Manchester U. /CERN /LBL, Berkeley /INFN, Genoa /INFN, Genoa /Udine U. /INFN, Udine /Oslo U. /ICREA, Barcelona /Barcelona, IFAE /SINTEF, Oslo /SINTEF, Oslo /SLAC /SLAC /Bergen U. /New Mexico U. /Bonn U. /SLAC /Freiburg U. /VTT Electronics, Espoo /Bonn U. /SLAC /Freiburg U. /SLAC /SINTEF, Oslo /Manchester U. /Barcelona, IFAE /Bonn U. /Bonn U. /CERN /Manchester U. /SINTEF, Oslo /Barcelona, Inst. Microelectron. /Calabria U. /INFN, Cosenza /Udine U. /INFN, Udine /Manchester U. /VTT Electronics, Espoo /Glasgow U. /Barcelona, IFAE /Udine U. /INFN, Udine /Hawaii U. /Freiburg U. /Manchester U. /Barcelona, Inst. Microelectron. /CERN /Fond. Bruno Kessler, Povo /Prague, Tech. U. /Trento U. /INFN, Trento /CERN /Oslo U. /Fond. Bruno Kessler, Povo /INFN, Genoa /INFN, Genoa /Bergen U. /New Mexico U. /Udine U. /INFN, Udine /SLAC /Oslo U. /Prague, Tech. U. /Oslo U. /Bergen U. /SUNY, Stony Brook /SLAC /Calabria U. /INFN, Cosenza /Manchester U. /Bonn U. /SUNY, Stony Brook /Manchester U. /Bonn U. /SLAC /Fond. Bruno Kessler, Povo

    2011-08-19

    Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance. Full and partial 3D pixel detectors have been tested, with and without a 1.6T magnetic field, in high energy pion beams at the CERN SPS North Area in 2009. Sensors characteristics have been measured as a function of the beam incident angle and compared to a regular planar pixel device. Overall full and partial 3D devices have similar behavior. Magnetic field has no sizeable effect on 3D performances. Due to electrode inefficiency 3D devices exhibit some loss of tracking efficiency for normal incident tracks but recover full efficiency with tilted tracks. As expected due to the electric field configuration 3D sensors have little charge sharing between cells.

  17. The Pixel Detector of the ATLAS experiment for Run 2 of the Large Hadron Collider

    NASA Astrophysics Data System (ADS)

    Oide, H.

    2014-12-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run 1 of the LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface in order to equip it with new service quarter panels, to repair modules, and to ease installation of the Insertable B-Layer (IBL). The IBL is the fourth layer of the Run 2 Pixel Detector, and it was installed at a radius of 3.3 cm in May 2014 between the existing Pixel Detector and the new smaller-radius beam pipe. To cope with the high radiation and pixel occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance is expected to improve through the reduction of pixel size. As well, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system were adopted. An overview of the IBL project as well as the experience in its construction is presented, focusing on adopted technologies, module and staves production, qualification of assembly procedure, integration of staves around the beam pipe, and commissioning of the detector.

  18. The Pixel Detector of the ATLAS experiment for LHC Run-2

    NASA Astrophysics Data System (ADS)

    Pernegger, H.

    2015-06-01

    The Pixel Detector of the ATLAS experiment has shown excellent performance during the whole Run-1 of LHC. Taking advantage of the long shutdown, the detector was extracted from the experiment and brought to surface, to equip it with new service quarter panels, to repair modules and to ease installation of the Insertable B-Layer (IBL). IBL is a fourth layer of pixel detectors, and has been installed in May 2014 between the existing Pixel Detector and a new smaller beam pipe at a radius of 3.3 cm. To cope with the high radiation and hit occupancy due to the proximity to the interaction point, a new read-out chip and two different silicon sensor technologies (planar and 3D) have been developed. Furthermore, the physics performance will be improved through the reduction of pixel size while, targeting for a low material budget, a new mechanical support using lightweight staves and a CO2 based cooling system have been adopted. An overview of the refurbishing of the Pixel Detector and of the IBL project as well as the experience in its construction will be presented, focusing on adopted technologies, module and staves production, qualification of assembly procedure, integration of staves around the beam pipe and commissioning of the detector.

  19. Phase 1 Upgrade of the CMS Pixel Detector: Module Assembly and Testing

    NASA Astrophysics Data System (ADS)

    Kumar, Ashish

    2014-03-01

    The CMS pixel detector is the innermost component of the all-silicon tracking system located closest to the interaction point and thus operates in a high-occupancy/high-radiation environment created by particle collisions. The performance of the current pixel detector has been excellent during Run 1 of the LHC. However, the foreseen increases of the instantaneous and integrated luminosities at the LHC necessitate an upgrade of the pixel detector in order to maintain the excellent tracking and physics performance of the CMS detector. The new pixel detector is expected to be installed during the extended end-of-year shutdown in 2016/17. The main new features of the upgraded pixel detector would be ultra-light mechanical design with four barrel layers and three end-caps on either side of the interaction point, digital readout chip with higher rate capability and new cooling system. These and other design improvements, along with the current status on module assembly and testing, will be discussed.

  20. A new generation of small pixel pitch/SWaP cooled infrared detectors

    NASA Astrophysics Data System (ADS)

    Espuno, L.; Pacaud, O.; Reibel, Y.; Rubaldo, L.; Kerlain, A.; Péré-Laperne, N.; Dariel, A.; Roumegoux, J.; Brunner, A.; Kessler, A.; Gravrand, O.; Castelein, P.

    2015-10-01

    Following clear technological trends, the cooled IR detectors market is now in demand for smaller, more efficient and higher performance products. This demand pushes products developments towards constant innovations on detectors, read-out circuits, proximity electronics boards, and coolers. Sofradir was first to show a 10μm focal plane array (FPA) at DSS 2012, and announced the DAPHNIS 10μm product line back in 2014. This pixel pitch is a key enabler for infrared detectors with increased resolution. Sofradir recently achieved outstanding products demonstrations at this pixel pitch, which clearly demonstrate the benefits of adopting 10μm pixel pitch focal plane array-based detectors. Both HD and XGA Daphnis 10μm products also benefit from a global video datapath efficiency improvement by transitioning to digital video interfaces. Moreover, innovative smart pixels functionalities drastically increase product versatility. In addition to this strong push towards a higher pixels density, Sofradir acknowledges the need for smaller and lower power cooled infrared detector. Together with straightforward system interfaces and better overall performances, latest technological advances on SWAP-C (Size, Weight, Power and Cost) Sofradir products enable the advent of a new generation of high performance portable and agile systems (handheld thermal imagers, unmanned aerial vehicles, light gimbals etc...). This paper focuses on those features and performances that can make an actual difference in the field.

  1. Trimming the threshold dispersion below 10 e-rms in a large area readout IC working in a single photon counting mode

    NASA Astrophysics Data System (ADS)

    Kmon, P.; Maj, P.; Gryboś, P.; Szczygieł, R.

    2016-01-01

    We present a new method of an in-pixel threshold dispersion correction implemented in a prototype readout integrated circuit (IC) operating in a single photon counting mode. The new threshold correction method was implemented in a readout IC of area 9.6× 14.9 mm2 containing 23552 square pixels with the pitch of 75 μm designed and fabricated in CMOS 130 nm technology. Each pixel of the IC consists of a charge sensitive amplifier, a shaper, two discriminators, two 14-bit counters and a low-area trim DACs for threshold correction. The user can either control the range of the trim DAC globally for all the pixels in the integrated circuit or modify the trim DACs characteristics locally in each pixel independently. Using a simulation tool based on the Monte-Carlo methods, we estimated how much we could improve the offset trimming by increasing the number of bits in the trim DACs or implementing additional bits in a pixel to modify the characteristics of the trim DACs. The measurements of our IC prototype show that it is possible to reduce the effective threshold dispersion in large-area single-photon counting chips below 10 electrons rms.

  2. Hyper Suprime-Cam: CCD readout electronics

    NASA Astrophysics Data System (ADS)

    Nakaya, Hidehiko; Uchida, Tomohisa; Miyatake, Hironao; Aihara, Hiroaki; Doi, Yoshiyuki; Furusawa, Hisanori; Karoji, Hiroshi; Kamata, Yukiko; Kawanomoto, Satoshi; Komiyama, Yutaka; Miyazaki, Satoshi; Morokuma, Tomoki; Tanaka, Manobu; Tanaka, Yoko

    2008-07-01

    Hyper Suprime-Cam is planned to employ about 120 2k×4k fully-depleted CCDs with 4 signal outputs for each. The data size of an image becomes larger than 2Gbytes. All of the CCDs are designed to be readout parallel within 20 seconds, and the readout noise is expected to be 5e. The frontend electronics will be mounted in a vacuumed cryostat, and connected to the backend electronics mounted on the outside of the cryostat. The frontend electronics includes entire analog circuits for CCD including CCD drivers, preamplifiers and ADC. The backend electronics consists of newly developed gigabit Ethernet modules combined with 2Gbytes memory modules, and several supporting boards. We will present the current status of the CCD readout electronics developments for HSC.

  3. D-Zero muon readout electronics design

    SciTech Connect

    Baldin, B.; Hansen, S.; Los, S.; Matveev, M.; Vaniev, V.

    1996-11-01

    The readout electronics designed for the D{null} Muon Upgrade are described. These electronics serve three detector subsystems and one trigger system. The front-ends and readout hardware are synchronized by means of timing signals broadcast from the D{null} Trigger Framework. The front-end electronics have continuously running digitizers and two levels of buffering resulting in nearly deadtimeless operation. The raw data is corrected and formatted by 16- bit fixed point DSP processors. These processors also perform control of the data buffering. The data transfer from the front-end electronics located on the detector platform is performed by serial links running at 160 Mbit/s. The design and test results of the subsystem readout electronics and system interface are discussed.

  4. Characterisation of the NA62 GigaTracker end of column readout ASIC

    NASA Astrophysics Data System (ADS)

    Noy, M.; Aglieri Rinella, G.; Fiorini, M.; Jarron, P.; Kaplon, J.; Kluge, A.; Martin, E.; Morel, M.; Perktold, L.; Riedler, P.

    2011-01-01

    The architecture and characterisation of the End Of Column demonstrator readout ASIC for the NA62 GigaTracker hybrid pixel detector is presented. This ASIC serves as a proof of principle for a pixel chip with 1800 pixels which must perform time stamping to better than 200 ps (RMS), provide 300 μm pitch position information and operate with a dead-time of 1% or less for 800 MHz-1 GHz beam rate. The demonstrator ASIC comprises a full test column with 45 pixels alongside other test structures. The timewalk correction mechanism employed is measurement of the time-over-threshold, coupled with an off-detector look-up table. The time to digital converter is a delay locked loop with 32 contributing delay cells fed with a 320 MHz to yield a nominal bin size of 97 ps. Recently, P-in-N sensors have been bump-bonded to the ASIC and characterisation of these assemblies has begun.

  5. Demountable readout technologies for optical image intensifiers

    NASA Astrophysics Data System (ADS)

    Lapington, J. S.; Howorth, J. R.; Milnes, J. S.

    2007-04-01

    We describe a generic microchannel plate intensifier design for use with a variety of demountable readout devices manufactured using standard multi-layer PCB techniques. We present results obtained using a 50 Ω multi-element design optimized for high speed operation and a four electrode multi-layer device developed from the wedge and strip anode with enhanced image resolution. The benefits of this intensifier design are discussed and a project to develop a detector system for bio-medical applications using a demountable readout device with integrated multi-channel ASIC-based electronics is announced.

  6. Spectral contents readout of birefringent sensor

    NASA Technical Reports Server (NTRS)

    Redner, Alex S.

    1989-01-01

    The technical objective of this research program was to develop a birefringent sensor, capable of measuring strain/stress up to 2000 F and a readout system based on Spectral Contents analysis. As a result of the research work, a data acquisition system was developed, capable of measuring strain birefringence in a sensor at 2000 F, with multi-point static and dynamic capabilities. The system uses a dedicated spectral analyzer for evaluation of stress-birefringence and a PC-based readout. Several sensor methods were evaluated. Fused silica was found most satisfactory. In the final evaluation, measurements were performed up to 2000 F and the system performance exceeded expectations.

  7. Central FPGA-based destination and load control in the LHCb MHz event readout

    NASA Astrophysics Data System (ADS)

    Jacobsson, R.

    2012-10-01

    The readout strategy of the LHCb experiment is based on complete event readout at 1 MHz. A set of 320 sub-detector readout boards transmit event fragments at total rate of 24.6 MHz at a bandwidth usage of up to 70 GB/s over a commercial switching network based on Gigabit Ethernet to a distributed event building and high-level trigger processing farm with 1470 individual multi-core computer nodes. In the original specifications, the readout was based on a pure push protocol. This paper describes the proposal, implementation, and experience of a non-conventional mixture of a push and a pull protocol, akin to credit-based flow control. An FPGA-based central master module, partly operating at the LHC bunch clock frequency of 40.08 MHz and partly at a double clock speed, is in charge of the entire trigger and readout control from the front-end electronics up to the high-level trigger farm. One FPGA is dedicated to controlling the event fragment packing in the readout boards, the assignment of the farm node destination for each event, and controls the farm load based on an asynchronous pull mechanism from each farm node. This dynamic readout scheme relies on generic event requests and the concept of node credit allowing load control and trigger rate regulation as a function of the global farm load. It also allows the vital task of fast central monitoring and automatic recovery in-flight of failing nodes while maintaining dead-time and event loss at a minimum. This paper demonstrates the strength and suitability of implementing this real-time task for a very large distributed system in an FPGA where no random delays are introduced, and where extreme reliability and accurate event accounting are fundamental requirements. It was in use during the entire commissioning phase of LHCb and has been in faultless operation during the first two years of physics luminosity data taking.

  8. Pixelated filters for spatial imaging

    NASA Astrophysics Data System (ADS)

    Mathieu, Karine; Lequime, Michel; Lumeau, Julien; Abel-Tiberini, Laetitia; Savin De Larclause, Isabelle; Berthon, Jacques

    2015-10-01

    Small satellites are often used by spatial agencies to meet scientific spatial mission requirements. Their payloads are composed of various instruments collecting an increasing amount of data, as well as respecting the growing constraints relative to volume and mass; So small-sized integrated camera have taken a favored place among these instruments. To ensure scene specific color information sensing, pixelated filters seem to be more attractive than filter wheels. The work presented here, in collaboration with Institut Fresnel, deals with the manufacturing of this kind of component, based on thin film technologies and photolithography processes. CCD detectors with a pixel pitch about 30 μm were considered. In the configuration where the matrix filters are positioned the closest to the detector, the matrix filters are composed of 2x2 macro pixels (e.g. 4 filters). These 4 filters have a bandwidth about 40 nm and are respectively centered at 550, 700, 770 and 840 nm with a specific rejection rate defined on the visible spectral range [500 - 900 nm]. After an intense design step, 4 thin-film structures have been elaborated with a maximum thickness of 5 μm. A run of tests has allowed us to choose the optimal micro-structuration parameters. The 100x100 matrix filters prototypes have been successfully manufactured with lift-off and ion assisted deposition processes. High spatial and spectral characterization, with a dedicated metrology bench, showed that initial specifications and simulations were globally met. These excellent performances knock down the technological barriers for high-end integrated specific multi spectral imaging.

  9. Improved Design of Active Pixel CMOS Sensors for Charged Particle Detection

    SciTech Connect

    Deptuch, Grzegorz

    2007-11-12

    The Department of Energy (DOE) nuclear physics program requires developments in detector instrumentation electronics with improved energy, position and timing resolution, sensitivity, rate capability, stability, dynamic range, and background suppression. The current Phase-I project was focused on analysis of standard-CMOS photogate Active Pixel Sensors (APS) as an efficient solution to this challenge. The advantages of the CMOS APS over traditional hybrid approaches (i.e., separate detection regions bump-bonded to readout circuits) include greatly reduced cost, low power and the potential for vastly larger pixel counts and densities. However, challenges remain in terms of the signal-to-noise ratio (SNR) and readout speed (currently on the order of milliseconds), which is the major problem for this technology. Recent work has shown that the long readout time for photogate APS is due to the presence of (interface) traps at the semiconductor-oxide interface. This Phase-I work yielded useful results in two areas: (a) Advanced three-dimensional (3D) physics-based simulation models and simulation-based analysis of the impact of interface trap density on the transient charge collection characteristics of existing APS structures; and (b) Preliminary analysis of the feasibility of an improved photogate pixel structure (i.e., new APS design) with an induced electric field under the charge collecting electrode to enhance charge collection. Significant effort was dedicated in Phase-I to the critical task of implementing accurate interface trap models in CFDRC's NanoTCAD 3D semiconductor device-physics simulator. This resulted in validation of the new NanoTCAD models and simulation results against experimental (published) data, within the margin of uncertainty associated with obtaining device geometry, material properties, and experimentation details. Analyses of the new, proposed photogate APS design demonstrated several promising trends.

  10. Characterization of double modified internal gate pixel by 3D simulation study

    NASA Astrophysics Data System (ADS)

    Aurola, A.; Marochkin, V.; Tuuva, T.

    2015-01-01

    We have developed a novel detector concept based on Modified Internal Gate Field Effect Transistor (MIGFET) wherein a buried Modified Internal Gate (MIG) is implanted underneath a channel of a FET. In between the MIG and the channel of the FET there is a depleted semiconductor material forming a potential barrier between charges in the channel and similar type signal charges located in the MIG. The signal charges in the MIG have a measurable effect on the conductance of the channel. In this paper a double MIGFET pixel is investigated comprising two MIGFETs. By transferring the signal charges between the two MIGs Non-Destructive Correlated Double Sampling Readout (NDCDSR) is enabled. The proposed MIG radiation detector suits particularly well for low-light-level imaging, X-ray spectroscopy, as well as synchrotron and X-ray Free Electron Laser (XFEL) facilities. The reason for the excellent X-ray detection performance stems from the fact that interface related issues can be considerably mitigated since interface generated dark noise can be completely avoided and interface generated 1/f and Random Telegraph Signal (RTS) noise can be considerably reduced due to a deep buried channel readout configuration. Electrical parameters of the double MIGFET pixel have been evaluated by 3D TCAD simulation study. Simulation results show the absence of interface generated dark noise, significantly reduced interface generated 1/f and RTS noise, well performing NDCDSR operation, and blooming protection due to an inherent vertical anti-blooming structure. In addition, the backside illuminated thick fully depleted pixel design provides a homogeneous radiation entry window, low crosstalk due to lack of diffusion, and good quantum efficiency for low energy X-rays and NIR light. These facts result in excellent Signal-to-Noise Ratio (SNR) and very low crosstalk enabling thus excellent X-ray energy and spatial resolution. The simulation demonstrates the charge to current conversion gain for

  11. TFT-Based Active Pixel Sensors for Large Area Thermal Neutron Detection

    NASA Astrophysics Data System (ADS)

    Kunnen, George

    Due to diminishing availability of 3He, which is the critical component of neutron detecting proportional counters, large area flexible arrays are being considered as a potential replacement for neutron detection. A large area flexible array, utilizing semiconductors for both charged particle detection and pixel readout, ensures a large detection surface area in a light weight rugged form. Such a neutron detector could be suitable for deployment at ports of entry. The specific approach used in this research, uses a neutron converter layer which captures incident thermal neutrons, and then emits ionizing charged particles. These ionizing particles cause electron-hole pair generation within a single pixel's integrated sensing diode. The resulting charge is then amplified via a low-noise amplifier. This document begins by discussing the current state of the art in neutron detection and the associated challenges. Then, for the purpose of resolving some of these issues, recent design and modeling efforts towards developing an improved neutron detection system are described. Also presented is a low-noise active pixel sensor (APS) design capable of being implemented in low temperature indium gallium zinc oxide (InGaZnO) or amorphous silicon (a-Si:H) thin film transistor process compatible with plastic substrates. The low gain and limited scalability of this design are improved upon by implementing a new multi-stage self-resetting APS. For each APS design, successful radiation measurements are also presented using PiN diodes for charged particle detection. Next, detection array readout methodologies are modeled and analyzed, and use of a matched filter readout circuit is described as well. Finally, this document discusses detection diode integration with the designed TFT-based APSs.

  12. Subpixel centroid position error analysis in particle tracking velocimetry induced by the CCD pixel binning

    NASA Astrophysics Data System (ADS)

    Kholmatov, A.; Akselli, B.; Nasibov, A.; Nasibov, H.

    2010-05-01

    Particle tracking velocimetry (PTV) is a non-invasive, full field optical measuring technique that has become one of the dominant tools for obtaining velocity information in fluid motion. In PTV experiments, the fluid of interest is seeded with fluorescent tracer particles, where measurement of individual particle displacements, recorded by means of digital camera at two instances of time, is further used to ascertain overall flow motion. Upper limit of a flow speed a PTV system can measure is bound by the frame rate of a camera used, and the system's accuracy is limited by the accuracy of the particle centroid estimation. In order to increase the upper limit, we investigated the use of CCD binning option, which doubles camera frame rate, preserves effective field of view, suppresses photon and readout noise of CCD at the expense of loss in spatial resolution. This study provides quantitative assessment of tradeoff between aforementioned advantages of binning over the loss in spatial resolution, which can increase uncertainty in particle centroid estimation. We carried our experiments using scientific grade PixeFly camera and analyzed 1μm and 1.9μm size red fluorescence polystyrene microspheres, placed on a quartz glass plate, by the Hirox variable zoom lens (1-10x) conjugated with a OL- 700II objective. For each binning mode (horizontal, vertical and composite), we investigated and reported estimation errors of various cross-correlation and center of mass based centroid localization methods, using more than 100.000 particle image pairs. We found that, performing vertical binning in the context of laminar flows doubled measurable flow rate, while caused only a negligible estimation error in the order of hundredth of a pixel.

  13. Fully 3D-Integrated Pixel Detectors for X-Rays

    SciTech Connect

    Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; Grybos, Pawel; Holm, Scott; Lipton, Ronald; Maj, Piotr; Patti, Robert; Siddons, David Peter; Szczygiel, Robert; Yarema, Raymond

    2016-01-01

    The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch, yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e- rms and a conversion gain of 69.5 μV/e- with 2.6 e- rms and 2.7 μV/e- rms pixel-to-pixel variations, respectively, were measured.

  14. Implementation of pixel level digital TDI for scanning type LWIR FPAs

    NASA Astrophysics Data System (ADS)

    Ceylan, Omer; Kayahan, Huseyin; Yazici, Melik; Afridi, Sohaib; Shafique, Atia; Gurbuz, Yasar

    2014-07-01

    Implementation of a CMOS digital readout integrated circuit (DROIC) based on pixel level digital time delay integration (TDI) for scanning type LWIR focal plane arrays (FPAs) is presented. TDI is implemented on 8 pixels with over sampling rate of 3. Analog signal integrated on integration capacitor is converted to digital domain in pixel, and digital data is transferred to TDI summation counters, where contributions of 8 pixels are added. Output data is 16 bit, where 8 bits are allocated for most significant bits and 8 bits for least significant bits. Control block of the ROIC, which is responsible of generating timing diagram for switches controlling the pixels and summation counters, is realized with VerilogHDL. Summation counters and parallel-to-serial converter to convert 16 bit parallel output data to single bit output are also realized with Verilog HDL. Synthesized verilog netlists are placed&routed and combined with analog under-pixel part of the design. Quantization noise of analog-to-digital conversion is less than 500e-. Since analog signal is converted to digital domain in-pixel, inaccuracies due to analog signal routing over large chip area is eliminated. ROIC is fabricated with 0.18μm CMOS process and chip area is 10mm2. Post-layout simulation results of the implemented design are presented. ROIC is programmable through serial or parallel interface. Input referred noise of ROIC is less than 750 rms electron, while power consumption is less than 30mW. ROIC is designed to perform in cryogenic temperatures.

  15. CZT detectors with 3D readout for gamma-ray spectroscopy and imaging

    NASA Astrophysics Data System (ADS)

    Matteson, James L.; Pelling, Michael R.; Skelton, Robert T.

    2003-01-01

    We are developing 10 mm thick CZT detectors with 3-D readout for ~100 keV to ~1.5 MeV gamma-rays. Multiple-site gamma-ray interactions are fully measured, i.e., the energy and 3-D position of each site are determined. Spatial resolution is 1 mm FWHM. Anode pixel readout with 1 mm pitch is used for x- and y-positions and charge drift times for z-positions. Drift time measurements are triggered by the cathode signal and end when each interaction site's charge cloud reaches an anode pixel. Post-event processing corrects for signal loss due to charge trapping and accurately determines gamma-ray energies, with a goal of 1% energy resolution at 662 keV. Compton kinematic analysis can identify the initial interaction site in most cases as well as constrain the incident gamma-ray direction. Tests were made with a prototype detector, measuring 10 x 10 x 10 mm3 and operated at 1000 V bias. The measured drift time resolution of 25 nsec FWHM at 662 keV and 60 nsec at 122 keV corresponds to z-position resolution of 0.25 and 0.60 mm FWHM, respectively. The technique is described and results of modeling and tests are presented.

  16. SiPM based readout system for PbWO4 crystals

    NASA Astrophysics Data System (ADS)

    Berra, A.; Bolognini, D.; Bonfanti, S.; Bonvicini, V.; Lietti, D.; Penzo, A.; Prest, M.; Stoppani, L.; Vallazza, E.

    2013-08-01

    Silicon PhotoMultipliers (SiPMs) consist of a matrix of small passively quenched silicon avalanche photodiodes operated in limited Geiger-mode (GM-APDs) and read out in parallel from a common output node. Each pixel (with a typical size in the 20-100 μm range) gives the same current response when hit by a photon; the SiPM output signal is the sum of the signals of all the pixels, which depends on the light intensity. The main advantages of SiPMs with respect to photomultiplier tubes (PMTs) are essentially the small dimensions, the insensitivity to magnetic fields and a low bias voltage. This contribution presents the performance of a SiPM based readout system for crystal calorimeters developed in the framework of the FACTOR/TWICE collaboration. The SiPM used for the test is a new device produced by FBK-irst which consists in a matrix of four sensors embedded in the same silicon substrate, called QUAD. The SiPM has been coupled to a lead tungstate crystal, an early-prototype version of the crystals developed for the electromagnetic calorimeter of the CMS experiment. New tests are foreseen using a complete module consisting of nine crystals, each one readout by two QUADs.

  17. Dedicated multichannel readout ASIC coupled with single crystal diamond for dosimeter application

    NASA Astrophysics Data System (ADS)

    Fabbri, A.; Falco, M. D.; De Notaristefani, F.; Galasso, M.; Marinelli, M.; Orsolini Cencelli, V.; Tortora, L.; Verona, C.; Verona Rinati, G.

    2013-02-01

    This paper reports on the tests of a low-noise, multi-channel readout integrated circuit used as a readout electronic front-end for a diamond multi-pixel dosimeter. The system is developed for dose distribution measurement in radiotherapy applications. The first 10-channel prototype chip was designed and fabricated in a 0.18 um CMOS process. Every channel includes a charge integrator with a 10 pF capacitor and a double slope A/D converter. The diamond multi-pixel detector, based on CVD synthetic single crystal diamond Schottky diodes, is made by a 3 × 3 sensor matrix. The overall device has been tested under irradiation with 6 MeV radio therapeutic photon beams at the Policlinico ``Tor Vergata'' (PTV) hospital. Measurements show a 20 fA RMS leakage current from the front-end input stage and a negligible dark current from the diamond detector, a stable temporal response and a good linear behaviour as a function of both dose and dose rate. These characteristics were common to each tested channel.

  18. Design and characterization of a readout circuit for FET-based THz imaging

    NASA Astrophysics Data System (ADS)

    Domingues, Suzana; Perenzoni, Daniele; Perenzoni, Matteo; Stoppa, David

    2014-05-01

    A switched-capacitor integrator readout circuit for FET-based terahertz (THz) detectors was fabricated in a 0.13 μm standard CMOS technology. The designed readout circuit is suitable for implementation in pixel arrays due to its compact size and power consumption. In order to find the optimum bias point of the FET detector, responsivity, noise equivalent power (NEP) and signal-to-noise ratio (SNR) curves in function of the FET gate voltage (VG) have been measured for an arbitrary number of 10 accumulation cycles and two different operating clock frequencies. A responsivity peak of 1.8 kV/W was obtained with a clock frequency of 200 kHz, and of 1.3 kV/W at 400 kHz. A minimum NEP of 7.3 nW/√Hz was obtained with a 400 kHz clock frequency, while at 200 kHz the NEP is 8.5 nW/√Hz. The presented THz measurements with 100 accumulation cycles at 200 kHz and 400 kHz clock frequencies show a SNR improvement after each operation cycle, which means 500 and 1000 measurements per second with on-off modulation of the source, respectively. A test structure containing only a FET detector and a bowtie THz antenna was used to evaluate the impact of the readout circuit in the FET THz detection.

  19. Improved Readout For Micromagnet/Hall-Effect Memories

    NASA Technical Reports Server (NTRS)

    Wu, Jiin-Chuan; Stadler, Henry L.; Katti, Romney R.

    1993-01-01

    Two improved readout circuits for micromagnet/Hall-effect random-access memories designed to eliminate current shunts introducing errors into outputs of older readout circuits. Incorporate additional switching transistors to isolate Hall sensors as needed.

  20. Development of CMOS Active Pixel Image Sensors for Low Cost Commercial Applications

    NASA Technical Reports Server (NTRS)

    Gee, R.; Kemeny, S.; Kim, Q.; Mendis, S.; Nakamura, J.; Nixon, R.; Ortiz, M.; Pain, B.; Staller, C.; Zhou, Z; Fossum, E.

    1994-01-01

    JPL, under sponsorship from the NASA Office of Advanced Concepts and Technology, has been developing a second-generation solid-state image sensor technology. Charge-coupled devices (CCD) are a well-established first generation image sensor technology. For both commercial and NASA applications, CCDs have numerous shortcomings. In response, the active pixel sensor (APS) technology has been under research. The major advantages of APS technology are the ability to integrate on-chip timing, control, signal-processing and analog-to-digital converter functions, reduced sensitivity to radiation effects, low power operation, and random access readout.

  1. PANDA straw tube detectors and readout

    NASA Astrophysics Data System (ADS)

    Strzempek, P.

    2016-07-01

    PANDA is a detector under construction dedicated to studies of production and interaction of particles in the charmonium mass range using antiproton beams in the momentum range of 1.5 - 15 GeV/c at the Facility for Antiproton and Ion Research (FAIR) in Darmstadt. PANDA consists of two spectrometers: a Target Spectrometer with a superconducting solenoid and a Forward Spectrometer using a large dipole magnet and covering the most forward angles (Θ < 10 °). In both spectrometers, the particle's trajectories in the magnetic field are measured using self-supporting straw tube detectors. The expected high count rates, reaching up to 1 MHz/straw, are one of the main challenges for the detectors and associated readout electronics. The paper presents the readout chain of the tracking system and the results of tests performed with realistic prototype setups. The readout chain consists of a newly developed ASIC chip (PASTTREC < PANDASTTReadoutChip >) with amplification, signal shaping, tail cancellation, discriminator stages and Time Readout Boards as digitizer boards.

  2. Microwave multiplex readout for superconducting sensors

    NASA Astrophysics Data System (ADS)

    Ferri, E.; Becker, D.; Bennett, D.; Faverzani, M.; Fowler, J.; Gard, J.; Giachero, A.; Hays-Wehle, J.; Hilton, G.; Maino, M.; Mates, J.; Puiu, A.; Nucciotti, A.; Reintsema, C.; Schmidt, D.; Swetz, D.; Ullom, J.; Vale, L.

    2016-07-01

    The absolute neutrino mass scale is still an outstanding challenge in both particle physics and cosmology. The calorimetric measurement of the energy released in a nuclear beta decay is a powerful tool to determine the effective electron-neutrino mass. In the last years, the progress on low temperature detector technologies has allowed to design large scale experiments aiming at pushing down the sensitivity on the neutrino mass below 1 eV. Even with outstanding performances in both energy (~ eV on keV) and time resolution (~ 1 μs) on the single channel, a large number of detectors working in parallel is required to reach a sub-eV sensitivity. Microwave frequency domain readout is the best available technique to readout large array of low temperature detectors, such as Transition Edge Sensors (TESs) or Microwave Kinetic Inductance Detectors (MKIDs). In this way a multiplex factor of the order of thousands can be reached, limited only by the bandwidth of the available commercial fast digitizers. This microwave multiplexing system will be used to readout the HOLMES detectors, an array of 1000 microcalorimeters based on TES sensors in which the 163Ho will be implanted. HOLMES is a new experiment for measuring the electron neutrino mass by means of the electron capture (EC) decay of 163Ho. We present here the microwave frequency multiplex which will be used in the HOLMES experiment and the microwave frequency multiplex used to readout the MKID detectors developed in Milan as well.

  3. Raman-based microarray readout: a review.

    PubMed

    Haisch, Christoph

    2016-07-01

    For a quarter of a century, microarrays have been part of the routine analytical toolbox. Label-based fluorescence detection is still the commonest optical readout strategy. Since the 1990s, a continuously increasing number of label-based as well as label-free experiments on Raman-based microarray readout concepts have been reported. This review summarizes the possible concepts and methods and their advantages and challenges. A common label-based strategy is based on the binding of selective receptors as well as Raman reporter molecules to plasmonic nanoparticles in a sandwich immunoassay, which results in surface-enhanced Raman scattering signals of the reporter molecule. Alternatively, capture of the analytes can be performed by receptors on a microarray surface. Addition of plasmonic nanoparticles again leads to a surface-enhanced Raman scattering signal, not of a label but directly of the analyte. This approach is mostly proposed for bacteria and cell detection. However, although many promising readout strategies have been discussed in numerous publications, rarely have any of them made the step from proof of concept to a practical application, let alone routine use. Graphical Abstract Possible realization of a SERS (Surface-Enhanced Raman Scattering) system for microarray readout. PMID:26973235

  4. Reduction of cross-talks between circuit and sensor layer in the Kyoto's X-ray astronomy SOI pixel sensors with Double-SOI wafer

    NASA Astrophysics Data System (ADS)

    Ohmura, Shunichi; Tsuru, Takeshi Go; Tanaka, Takaaki; Uchida, Hiroyuki; Takeda, Ayaki; Matsumura, Hideaki; Ito, Makoto; Arai, Yasuo; Kurachi, Ikuo; Miyoshi, Toshinobu; Nakashima, Shinya; Mori, Koji; Nishioka, Yusuke; Takebayashi, Nobuaki; Noda, Koki; Kohmura, Takayoshi; Tamasawa, Kouki; Ozawa, Yusuke; Sato, Tadashi; Konno, Takahiro; Kawahito, Shoji; Kagawa, Keiichiro; Yasutomi, Keita; Kamehama, Hiroki; Shrestha, Sumeet; Hara, Kazuhiko; Honda, Shunsuke

    2016-09-01

    We have been developing silicon-on-insulator pixel sensors, "XRPIXs," for future X-ray astronomy satellites. XRPIXs are equipped with a function of "event-driven readout," with which we can read out only hit pixels by trigger signals and hence realize good time resolution reaching ∼ 10 μs . The current version of XRPIX suffers from a problem that the spectral performance degrades in the event-driven readout mode compared to the frame-readout mode, in which all the pixels are read out serially. Previous studies have clarified that one of the causes is capacitive coupling between the sense node and the trigger signal line in the circuit layer. In order to solve the problem, we adopt the Double SOI structure having a middle silicon layer between the circuit and the sensor layers. We expect the middle silicon layer to work as an electrostatic shield and reduces the capacitive coupling. In this paper, we report the spectroscopic performance of XRPIX with the middle silicon layer. We successfully reduce the capacitive coupling and the readout noise.

  5. A fast embedded readout system for large-area Medipix and Timepix systems

    NASA Astrophysics Data System (ADS)

    Brogna, A. S.; Balzer, M.; Smale, S.; Hartmann, J.; Bormann, D.; Hamann, E.; Cecilia, A.; Zuber, M.; Koenig, T.; Zwerger, A.; Weber, M.; Fiederle, M.; Baumbach, T.

    2014-05-01

    In this work we present a novel readout electronics for an X-ray sensor based on a Si crystal bump-bonded to an array of 3 × 2 Medipix ASICs. The pixel size is 55 μm × 55 μm with a total number of ~ 400k pixels and a sensitive area of 42 mm × 28 mm. The readout electronics operate Medipix-2 MXR or Timepix ASICs with a clock speed of 125 MHz. The data acquisition system is centered around an FPGA and each of the six ASICs has a dedicated I/O port for simultaneous data acquisition. The settings of the auxiliary devices (ADCs and DACs) are also processed in the FPGA. Moreover, a high-resolution timer operates the electronic shutter to select the exposure time from 8 ns to several milliseconds. A sophisticated trigger is available in hardware and software to synchronize the acquisition with external electro-mechanical motors. The system includes a diagnostic subsystem to check the sensor temperature and to control the cooling Peltier cells and a programmable high-voltage generator to bias the crystal. A network cable transfers the data, encapsulated into the UDP protocol and streamed at 1 Gb/s. Therefore most notebooks or personal computers are able to process the data and to program the system without a dedicated interface. The data readout software is compatible with the well-known Pixelman 2.x running both on Windows and GNU/Linux. Furthermore the open architecture encourages users to write their own applications. With a low-level interface library which implements all the basic features, a MATLAB or Python script can be implemented for special manipulations of the raw data. In this paper we present selected images taken with a microfocus X-ray tube to demonstrate the capability to collect the data at rates up to 120 fps corresponding to 0.76 Gb/s.

  6. Development of an X-ray imaging system with SOI pixel detectors

    NASA Astrophysics Data System (ADS)

    Nishimura, Ryutaro; Arai, Yasuo; Miyoshi, Toshinobu; Hirano, Keiichi; Kishimoto, Shunji; Hashimoto, Ryo

    2016-09-01

    An X-ray imaging system employing pixel sensors in silicon-on-insulator technology is currently under development. The system consists of an SOI pixel detector (INTPIX4) and a DAQ system based on a multi-purpose readout board (SEABAS2). To correct a bottleneck in the total throughput of the DAQ of the first prototype, parallel processing of the data taking and storing processes and a FIFO buffer were implemented for the new DAQ release. Due to these upgrades, the DAQ throughput was improved from 6 Hz (41 Mbps) to 90 Hz (613 Mbps). The first X-ray imaging system with the new DAQ software release was tested using 33.3 keV and 9.5 keV mono X-rays for three-dimensional computerized tomography. The results of these tests are presented.

  7. Optimization of CMOS pixel sensors for high performance vertexing and tracking

    NASA Astrophysics Data System (ADS)

    Baudot, Jérôme; Besson, Auguste; Claus, Gilles; Dulinski, Wojciech; Dorokhov, Andrei; Goffe, Mathieu; Hu-Guo, Christine; Molnar, Levente; Sanchez-Castro, Xitzel; Senyukov, Serhiy; Winter, Marc

    2013-12-01

    CMOS Pixel Sensors tend to become relevant for a growing spectrum of charged particle detection instruments. This comes mainly from their high granularity and low material budget. However, several potential applications require a higher read-out speed and radiation tolerance than those achieved with the available devices based on a 0.35 μm feature size technology. This paper shows preliminary test results of new prototype sensors manufactured in a 0.18 μm process based on a high resistivity epitaxial layer of sizeable thickness. Grounded on these observed performances, we discuss a development strategy over the coming years to reach a full scale sensor matching the specifications of the upgraded version of the Inner Tracking System (ITS) of the ALICE experiment at CERN, for which a sensitive area of up to ∼10 m2 may be equipped with pixel sensors.

  8. Pixellated Cd(Zn)Te high-energy X-ray instrument

    NASA Astrophysics Data System (ADS)

    Seller, P.; Bell, S.; Cernik, R. J.; Christodoulou, C.; Egan, C. K.; Gaskin, J. A.; Jacques, S.; Pani, S.; Ramsey, B. D.; Reid, C.; Sellin, P. J.; Scuffham, J. W.; Speller, R. D.; Wilson, M. D.; Veale, M. C.

    2011-12-01

    We have developed a pixellated high energy X-ray detector instrument to be used in a variety of imaging applications. The instrument consists of either a Cadmium Zinc Telluride or Cadmium Telluride (Cd(Zn)Te) detector bump-bonded to a large area ASIC and packaged with a high performance data acquisition system. The 80 by 80 pixels each of 250 μm by 250 μm give better than 1 keV FWHM energy resolution at 59.5 keV and 1.5 keV FWHM at 141 keV, at the same time providing a high speed imaging performance. This system uses a relatively simple wire-bonded interconnection scheme but this is being upgraded to allow multiple modules to be used with very small dead space. The readout system and the novel interconnect technology is described and how the system is performing in several target applications.

  9. Pixellated Cd(Zn)Te high-energy X-ray instrument

    PubMed Central

    Seller, P.; Bell, S.; Cernik, R.J.; Christodoulou, C.; Egan, C.K.; Gaskin, J.A.; Jacques, S.; Pani, S.; Ramsey, B.D.; Reid, C.; Sellin, P.J.; Scuffham, J.W.; Speller, R.D.; Wilson, M.D.; Veale, M.C.

    2012-01-01

    We have developed a pixellated high energy X-ray detector instrument to be used in a variety of imaging applications. The instrument consists of either a Cadmium Zinc Telluride or Cadmium Telluride (Cd(Zn)Te) detector bump-bonded to a large area ASIC and packaged with a high performance data acquisition system. The 80 by 80 pixels each of 250 μm by 250 μm give better than 1 keV FWHM energy resolution at 59.5 keV and 1.5 keV FWHM at 141 keV, at the same time providing a high speed imaging performance. This system uses a relatively simple wire-bonded interconnection scheme but this is being upgraded to allow multiple modules to be used with very small dead space. The readout system and the novel interconnect technology is described and how the system is performing in several target applications. PMID:22737179

  10. An Empirical Pixel-Based CTE Correction for ACS/WFC

    NASA Astrophysics Data System (ADS)

    Anderson, Jay

    2010-07-01

    This presentation summarizes a paper that has been recently published in PASP, Anderson & Bedin (2010). The paper describes our pixel-based approach to correcting ACS data for imperfect CTE (charge-transfer efficiency). We developed the approach by characterizing the size and profiles of trails behind warm pixels in dark exposures. We found an algorithm that simulates the way imperfect CTE impacts the readout process. To correct images for imperfect CTE, we use a forwardmodeling procedure to determine the likely original distribution of charge, given the distribution that was read out. We applied this CTE-reconstruction algorithm to science images and found that the fluxes, positions and shapes of stars were restored to high fidelity. The ACS team is currently working to make this correction available to the public; they are also running tests to determine whether and how best to implement it in the pipeline.

  11. Reliability and performance studies of DC-DC conversion powering scheme for the CMS pixel tracker at SLHC

    NASA Astrophysics Data System (ADS)

    Todri, A.; Perera, L.; Rivera, R.; Kwan, S.

    2010-12-01

    The upgrades of the Large Hadron Collider (LHC) introduce a significant challenge to the power distribution of the detectors. DC-DC conversion is the preferred powering scheme proposed to be integrated for the CMS tracker to deliver high input voltage levels and performing a step-down conversion nearby the detector modules. In this work, we propose a step-up/step-down powering scheme by performing voltage step up at the CAEN supply unit and voltage step down near the detector. We designed step-up converters and investigate the pixel performance and power loss on the FPIX power distribution system. Tests are performed using the PSI46 pixel readout chips on a forward pixel panel module and the DC-DC converters developed at CERN and Fermilab. Reliability studies include the voltage drop measurements on the readout chips and the power supply noise generated from the converter. Performance studies include pixel noise and threshold dispersion results. Comparison between step-down only and step-up/step-down conversion powering schemes are provided.

  12. Recent results of the ATLAS upgrade planar pixel sensors R&D project

    NASA Astrophysics Data System (ADS)

    Weigell, Philipp

    2013-12-01

    To extend the physics reach of the LHC experiments, several upgrades to the accelerator complex are planned, culminating in the HL-LHC, which eventually leads to an increase of the peak luminosity by a factor of five to ten compared to the LHC design value. To cope with the higher occupancy and radiation damage also the LHC experiments will be upgraded. The ATLAS Planar Pixel Sensor R&D Project is an international collaboration of 17 institutions and more than 80 scientists, exploring the feasibility of employing planar pixel sensors for this scenario. Depending on the radius, different pixel concepts are investigated using laboratory and beam test measurements. At small radii the extreme radiation environment and strong space constraints are addressed with very thin pixel sensors active thickness in the range of (75-150) μm, and the development of slim as well as active edges. At larger radii the main challenge is the cost reduction to allow for instrumenting the large area of (7-10) m2. To reach this goal the pixel productions are being transferred to 6 in production lines and more cost-efficient and industrialised interconnection techniques are investigated. Additionally, the n-in-p technology is employed, which requires less production steps since it relies on a single-sided process. An overview of the recent accomplishments obtained within the ATLAS Planar Pixel Sensor R&D Project is given. The performance in terms of charge collection and tracking efficiency, obtained with radioactive sources in the laboratory and at beam tests, is presented for devices built from sensors of different vendors connected to either the present ATLAS read-out chip FE-I3 or the new Insertable B-Layer read-out chip FE-I4. The devices, with a thickness varying between 75 μm and 300 μm, were irradiated to several fluences up to 2×1016 neq/cm2. Finally, the different approaches followed inside the collaboration to achieve slim or active edges for planar pixel sensors are presented.

  13. Penrose Pixels for Super-Resolution.

    PubMed

    Ben-Ezra, M; Lin, Zhouchen; Wilburn, Bennett; Zhang, Wei

    2011-07-01

    We present a novel approach to reconstruction-based super-resolution that uses aperiodic pixel tilings, such as a Penrose tiling or a biological retina, for improved performance. To this aim, we develop a new variant of the well-known error back projection super-resolution algorithm that makes use of the exact detector model in its back projection operator for better accuracy. Pixels in our model can vary in shape and size, and there may be gaps between adjacent pixels. The algorithm applies equally well to periodic or aperiodic pixel tilings. We present analysis and extensive tests using synthetic and real images to show that our approach using aperiodic layouts substantially outperforms existing reconstruction-based algorithms for regular pixel arrays. We close with a discussion of the feasibility of manufacturing CMOS or CCD chips with pixels arranged in Penrose tilings.

  14. Dead pixel replacement in LWIR microgrid polarimeters.

    PubMed

    Ratliff, Bradley M; Tyo, J Scott; Boger, James K; Black, Wiley T; Bowers, David L; Fetrow, Matthew P

    2007-06-11

    LWIR imaging arrays are often affected by nonresponsive pixels, or "dead pixels." These dead pixels can severely degrade the quality of imagery and often have to be replaced before subsequent image processing and display of the imagery data. For LWIR arrays that are integrated with arrays of micropolarizers, the problem of dead pixels is amplified. Conventional dead pixel replacement (DPR) strategies cannot be employed since neighboring pixels are of different polarizations. In this paper we present two DPR schemes. The first is a modified nearest-neighbor replacement method. The second is a method based on redundancy in the polarization measurements.We find that the redundancy-based DPR scheme provides an order-of-magnitude better performance for typical LWIR polarimetric data. PMID:19547086

  15. Equivalence of a Bit Pixel Image to a Quantum Pixel Image

    NASA Astrophysics Data System (ADS)

    Ortega, Laurel Carlos; Dong, Shi-Hai; Cruz-Irisson, M.

    2015-11-01

    We propose a new method to transform a pixel image to the corresponding quantum-pixel using a qubit per pixel to represent each pixels classical weight in a quantum image matrix weight. All qubits are linear superposition, changing the coefficients level by level to the entire longitude of the gray scale with respect to the base states of the qubit. Classically, these states are just bytes represented in a binary matrix, having code combinations of 1 or 0 at all pixel locations. This method introduces a qubit-pixel image representation of images captured by classical optoelectronic methods. Supported partially by the project 20150964-SIP-IPN, Mexico

  16. [Hadamard transform spectrometer mixed pixels' unmixing method].

    PubMed

    Yan, Peng; Hu, Bing-Liang; Liu, Xue-Bin; Sun, Wei; Li, Li-Bo; Feng, Yu-Tao; Liu, Yong-Zheng

    2011-10-01

    Hadamard transform imaging spectrometer is a multi-channel digital transform spectrometer detection technology, this paper based on digital micromirror array device (DMD) of the Hadamard transform spectrometer working principle and instrument structure, obtained by the imaging sensor mixed pixel were analyzed, theory derived the solution of pixel aliasing hybrid method, simulation results show that the method is simple and effective to improve the accuracy of mixed pixel spectrum more than 10% recovery. PMID:22250574

  17. Method for fabricating pixelated silicon device cells

    SciTech Connect

    Nielson, Gregory N.; Okandan, Murat; Cruz-Campa, Jose Luis; Nelson, Jeffrey S.; Anderson, Benjamin John

    2015-08-18

    A method, apparatus and system for flexible, ultra-thin, and high efficiency pixelated silicon or other semiconductor photovoltaic solar cell array fabrication is disclosed. A structure and method of creation for a pixelated silicon or other semiconductor photovoltaic solar cell array with interconnects is described using a manufacturing method that is simplified compared to previous versions of pixelated silicon photovoltaic cells that require more microfabrication steps.

  18. SemiSPECT: A Small-animal Imaging System Based on Eight CdZnTe Pixel Detectors

    PubMed Central

    Peterson, Todd E.; Kim, Hyunki; Crawford, Michael J.; Gershman, Benjamin M.; Hunter, William C.J.; Barber, H. Bradford; Furenlid, Lars R.; Wilson, Donald W.; Woolfenden, James M.; Barrett, Harrison H.

    2015-01-01

    We have constructed a SPECT system for small animals that utilizes eight CdZnTe pixel detectors. The eight detectors are arranged in a single octagonal ring, where each views the object to be imaged through a single pinhole. Additional projections are obtained via rotation of the animal. Each CdZnTe detector is approximately 2 mm in thickness and is patterned on one surface into a 64×64 array of pixels with 380 micron pitch. We have designed an electronic readout system capable of collecting data from the eight detectors in listmode. In this scheme each event entry for a gamma-ray hit includes the pulse height of the pixel with the largest signal and the pulse height for each of its eight nearest neighbors. We present details of the overall design, the electronics, and system performance. PMID:26568674

  19. Implementation of TDI based digital pixel ROIC with 15μm pixel pitch

    NASA Astrophysics Data System (ADS)

    Ceylan, Omer; Shafique, Atia; Burak, A.; Caliskan, Can; Abbasi, Shahbaz; Yazici, Melik; Gurbuz, Yasar

    2016-05-01

    A 15um pixel pitch digital pixel for LWIR time delay integration (TDI) applications is implemented which occupies one fourth of pixel area compared to previous digital TDI implementation. TDI is implemented on 8 pixels with oversampling rate of 2. ROIC provides 16 bits output with 8 bits of MSB and 8 bits of LSB. Pixel can store 75 M electrons with a quantization noise of 500 electrons. Digital pixel TDI implementation is advantageous over analog counterparts considering power consumption, chip area and signal-to-noise ratio. Digital pixel TDI ROIC is fabricated with 0.18um CMOS process. In digital pixel TDI implementation photocurrent is integrated on a capacitor in pixel and converted to digital data in pixel. This digital data triggers the summation counters which implements TDI addition. After all pixels in a row contribute, the summed data is divided to the number of TDI pixels(N) to have the actual output which is square root of N improved version of a single pixel output in terms of signal-to-noise-ratio (SNR).

  20. Design of readout integrated circuit structure for single and dual band infrared detector with variable integration time

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Shieh, Hsiu-Li; Shiu, Shiuan-Shuo; Liu, Yi-Ting; Tang, Shiang-Feng; Lin, Wen-Jen

    2011-08-01

    This paper proposes two kinds of readout integrated circuits for column and row interlaced dual-band infrared detectors. The experiments were simulated using TSMC 0.35μm Mixed Signal 2P4M CMOS process and operated at 3MHz clock rate. The pixel dimensions for two kinds of readout integrated circuits were also 30×30μm. The mid-wave and long-wave sense current was set from 1nA to 2nA and 6nA to 8nA, respectively. We designed a 40x16 array for the columns interlace readout circuit. The output voltage swing was 2.8V. The frame rate was 4.68kFPS. The total power consumption was less than 17.6mW. We also designed a 20x32 array for the row interlace readout circuit. The output voltage swing was 2.8V. The frame rate was 2.67kFPS. The total power consumption was less than 11.4mW. The power consumption increased when the column interlace frame rate reached the row interlace frame rate. The row interlace can decrease the layout area by sharing the column stage circuit, but the frame rate will drop to half of the single band frame rate.

  1. Preliminary validation results of an ASIC for the readout and control of near-infrared large array detectors

    NASA Astrophysics Data System (ADS)

    Pâhlsson, Philip; Meier, Dirk; Otnes Berge, Hans Kristian; Øya, Petter; Steenari, David; Olsen, Alf; Hasanbegovic, Amir; Altan, Mehmet A.; Najafiuchevler, Bahram; Talebi, Jahanzad; Azman, Suleyman; Gheorghe, Codin; Ackermann, Jörg; Mæhlum, Gunnar

    2015-06-01

    In this paper we present initial test results of the Near Infrared Readout and Controller ASIC (NIRCA), designed for large area image sensors under contract from the European Space Agency (ESA) and the Norwegian Space Center. The ASIC is designed to read out image sensors based on mercury cadmium telluride (HgCdTe, or MCT) operating down to 77 K. IDEAS has developed, designed and initiated testing of NIRCA with promising results, showing complete functionality of all ASIC sub-components. The ASIC generates programmable digital signals to clock out the contents of an image array and to amplify, digitize and transfer the resulting pixel charge. The digital signals can be programmed into the ASIC during run-time and allows for windowing and custom readout schemes. The clocked out voltages are amplified by programmable gain amplifiers and digitized by 12-bit, 3-Msps successive approximation register (SAR) analogue-to-digital converters (ADC). Digitized data is encoded using 8-bit to 10-bit encoding and transferred over LVDS to the readout system. The ASIC will give European researchers access to high spectral sensitivity, very low noise and radiation hardened readout electronics for astronomy and Earth observation missions operating at 77 K and room temperature. The versatility of the chip makes the architecture a possible candidate for other research areas, or defense or industrial applications that require analog and digital acquisition, voltage regulation, and digital signal generation.

  2. Low-noise custom VLSI for CdZnTe pixel detectors

    NASA Astrophysics Data System (ADS)

    Cook, Walter R.; Burnham, Jill A.; Harrison, Fiona A.

    1998-11-01

    A custom analog VLSI chip is being developed for the readout of pixelated CdZnTe detectors in the focal plane of an astronomical hard x-ray telescope. The chip is intended for indium bump bonding to a pixel detector having pitch near 0.5 mm. A complete precision analog signal processing chain, including charge sensitive preamplifier, shaping amplifiers and peak detect and hold circuit, is provided for each pixel. Here we describe the circuitry and discus the performance of a functional prototype fabricated in a 1.2 micrometers CMOS process at Orbit Semiconductor. Dynamic performance is found to be close to SPICE model predictions over a self-triggering range extending from 1 to 50 keV. Integral non-linearity and noise while acceptable ar not as god as predicted. Power consumption is only 250 uW per pixel. Layout and design techniques are discussed which permit successful self-triggering operation at the low 1 keV threshold.

  3. Evaluation of testing strategies for the radiation tolerant ATLAS n +-in-n pixel sensor

    NASA Astrophysics Data System (ADS)

    Klaiber-Lodewigs, Jonas M.; Atlas Pixel Collaboration

    2003-10-01

    The development of particle tracker systems for high fluence environments in new high-energy physics experiments raises new challenges for the development, manufacturing and reliable testing of radiation tolerant components. The ATLAS pixel detector for use at the LHC, CERN, is designed to cover an active sensor area of 1.8 m2 with 1.1×10 8 read-out channels usable for a particle fluence up to 10 15 cm-2 ( 1 MeV neutron equivalent) and an ionization dose up to 500 kGy of mainly charged hadron radiation. To cope with such a harsh environment the ATLAS Pixel Collaboration has developed a radiation hard n +-in-n silicon pixel cell design with a standard cell size of 50×400 μm2. Using this design on an oxygenated silicon substrate, sensor production has started in 2001. This contribution describes results gained during the development of testing procedures of the ATLAS pixel sensor and evaluates quality assurance procedures regarding their relevance for detector operation in the ATLAS experiment. The specific set of tests discussed in detail measures sensor depletion, interface generation velocity, p-spray dose and biasing by punch-through mechanism and is designed to give insights into effects of irradiation with ionizing particles.

  4. New concept of a submillimetric pixellated Silicon detector for intracerebral application

    NASA Astrophysics Data System (ADS)

    Benoit, M.; Märk, J.; Weiss, P.; Benoit, D.; Clemens, J. C.; Fougeron, D.; Janvier, B.; Jevaud, M.; Karkar, S.; Menouni, M.; Pain, F.; Pinot, L.; Morel, C.; Laniece, P.

    2011-12-01

    A new beta+ radiosensitive microprobe implantable in rodent brain dedicated to in vivo and autonomous measurements of local time activity curves of beta radiotracers in a volume of brain tissue of a few mm3 has been developed recently. This project expands the concept of the previously designed beta microprobe, which has been validated extensively in neurobiological experiments performed on anesthetized animals. Due to its limitations considering recordings on awake and freely moving animals, we have proposed to develop a wireless setup that can be worn by an animal without constraining its movements. To that aim, we have chosen a highly beta sensitive Silicon-based detector to devise a compact pixellated probe. Miniaturized wireless electronics is used to read-out and transfer the measurement data. Initial Monte-Carlo simulations showed that high resistive Silicon pixels are appropriate for this purpose, with their dimensions to be adapted to our specific signals. More precisely, we demonstrated that 200 μm thick pixels with an area of 200 μm×500 μm are optimized in terms of beta+sensitivity versus relative transparency to the gamma background. Based on this theoretical study, we now present the development of the novel sensor, including the system simulations with technology computer-assisted design (TCAD) to investigate specific configurations of guard rings and their potential to increase the electrical isolation and stabilization of the pixel, as well as the corresponding physical tests to validate the particular geometries of this new sensor.

  5. Electrical and optical measurements on the first SCUBA-2 prototype 1280 pixel submillimeter superconducting bolometer array.

    PubMed

    Woodcraft, Adam L; Ade, Peter A R; Bintley, Dan; House, Julian S; Hunt, Cynthia L; Sudiwala, Rashmi V; Doriese, William B; Duncan, William D; Hilton, Gene C; Irwin, Kent D; Reintsema, Carl D; Ullom, Joel N; Audley, Michael D; Ellis, Maureen A; Holland, Wayne S; MacIntosh, Mike; Dunare, Camelia C; Parkes, William; Walton, Anthony J; Kycia, Jan B; Halpern, Mark; Schulte, Eric

    2007-02-01

    SCUBA-2 is a submillimeter camera being built for the James Clerk Maxwell Telescope in Hawaii. Bringing CCD style imaging to the submillimeter for the first time, with over 10000 pixels, it will provide a revolutionary improvement in sensitivity and mapping speed. We present results of the first tests on a prototype 1280 pixel SCUBA-2 subarray; the full instrument will be made up of eight such subarrays. The array is made up of transition edge sensor (TES) detectors, with Mo/Cu bilayers as the sensing element. To keep the number of wires reasonable, a multiplexed readout is used. Unlike previous TES arrays, an in-focal plane multiplexer configuration is used, in which the multiplexing elements are located beneath each pixel. To achieve the required performance, the detectors are operated at a temperature of approximately 120 mK. We describe the results of a basic electrical and optical characterization of the array, demonstrating that it is fully operational. Noise measurements were made on several pixels and gave a noise equivalent power below 2.5 x 10(-17) W HZ(-0.5), within the requirements for SCUBA-2. The construction of the testbed used to carry out these measurements is also described.

  6. An Empirical Pixel-Based Correction for Imperfect CTE. I. HST's Advanced Camera for Surveys

    NASA Astrophysics Data System (ADS)

    Anderson, Jay; Bedin, Luigi

    2010-09-01

    We use an empirical approach to characterize the effect of charge-transfer efficiency (CTE) losses in images taken with the Wide-Field Channel of the Advanced Camera for Surveys (ACS). The study is based on profiles of warm pixels in 168 dark exposures taken between 2009 September and October. The dark exposures allow us to explore charge traps that affect electrons when the background is extremely low. We develop a model for the readout process that reproduces the observed trails out to 70 pixels. We then invert the model to convert the observed pixel values in an image into an estimate of the original pixel values. We find that when we apply this image-restoration process to science images with a variety of stars on a variety of background levels, it restores flux, position, and shape. This means that the observed trails contain essentially all of the flux lost to inefficient CTE. The Space Telescope Science Institute is currently evaluating this algorithm with the aim of optimizing it and eventually providing enhanced data products. The empirical procedure presented here should also work for other epochs (e.g., pre-SM4), though the parameters may have to be recomputed for the time when ACS was operated at a higher temperature than the current -81°C. Finally, this empirical approach may also hold promise for other instruments, such as WFPC2, STIS, the ASC's HRC, and even WFC3/UVIS.

  7. Firmware development and testing of the ATLAS Pixel Detector / IBL ROD card

    NASA Astrophysics Data System (ADS)

    Gabrielli, A.; Backhaus, M.; Balbi, G.; Bindi, M.; Chen, S. P.; Falchieri, D.; Flick, T.; Hauck, S.; Hsu, S. C.; Kretz, M.; Kugel, A.; Lama, L.; Travaglini, R.; Wensing, M.

    2015-03-01

    The ATLAS Experiment is reworking and upgrading systems during the current LHC shut down. In particular, the Pixel detector has inserted an additional inner layer called the Insertable B-Layer (IBL). The Readout-Driver card (ROD), the Back-of-Crate card (BOC), and the S-Link together form the essential frontend data path of the IBL's off-detector DAQ system. The strategy for IBL ROD firmware development was three-fold: keeping as much of the Pixel ROD datapath firmware logic as possible, employing a complete new scheme of steering and calibration firmware, and designing the overall system to prepare for a future unified code version integrating IBL and Pixel layers. Essential features such as data formatting, frontend-specific error handling, and calibration are added to the ROD data path. An IBL DAQ test bench using a realistic front-end chip model was created to serve as an initial framework for full offline electronic system simulation. In this document, major firmware achievements concerning the IBL ROD data path implementation, test on the test bench and ROD prototypes, will be reported. Recent Pixel collaboration efforts focus on finalizing hardware and firmware tests for the IBL. The plan is to approach a complete IBL DAQ hardware-software installation by the end of 2014.

  8. 3D-FBK Pixel Sensors: Recent Beam Tests Results with Irradiated Devices

    SciTech Connect

    Micelli, A.; Helle, K.; Sandaker, H.; Stugu, B.; Barbero, M.; Hugging, F.; Karagounis, M.; Kostyukhin, V.; Kruger, H.; Tsung, J.W.; Wermes, N.; Capua, M.; Fazio, S.; Mastroberardino, A.; Susinno, G.; Gallrapp, C.; Di Girolamo, B.; Dobos, D.; La Rosa, A.; Pernegger, H.; Roe, S.; /CERN /Prague, Tech. U. /Prague, Tech. U. /Freiburg U. /Freiburg U. /Freiburg U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /INFN, Genoa /Genoa U. /Glasgow U. /Glasgow U. /Glasgow U. /Hawaii U. /Barcelona, IFAE /Barcelona, IFAE /LBL, Berkeley /Barcelona, IFAE /LBL, Berkeley /LBL, Berkeley /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /Manchester U. /New Mexico U. /New Mexico U. /Oslo U. /Oslo U. /Oslo U. /Oslo U. /Oslo U. /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SLAC /SUNY, Stony Brook /SUNY, Stony Brook /SUNY, Stony Brook /INFN, Trento /Trento U. /INFN, Trento /Trento U. /INFN, Trento /Trento U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /INFN, Trieste /Udine U. /Barcelona, Inst. Microelectron. /Barcelona, Inst. Microelectron. /Barcelona, Inst. Microelectron. /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /Fond. Bruno Kessler, Trento /SINTEF, Oslo /SINTEF, Oslo /SINTEF, Oslo /SINTEF, Oslo /VTT Electronics, Espoo /VTT Electronics, Espoo

    2012-04-30

    The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.

  9. 320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

    NASA Astrophysics Data System (ADS)

    Yon, J.-J.; Dumont, G.; Rabaud, W.; Becker, S.; Carle, L.; Goudon, V.; Vialle, C.; Hamelin, A.; Arnaud, A.

    2012-10-01

    Silicon based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) as required by the promising mass market for very low cost IR applications, such as automotive driving assistance, energy loss monitoring in buildings, motion sensors… Among the various approaches studied worldwide, the CEA, LETI is developing a unique technology where each bolometer pixel is sealed under vacuum at the wafer level, using an IR transparent thin film deposition. This technology referred to as PLP (Pixel Level Packaging), leads to an array of hermetic micro-caps each containing a single microbolometer. Since the successful demonstration that the PLP technology, when applied on a single microbolometer pixel, can provide the required vacuum < 10-3 mbar, the authors have pushed forward the development of the technology on fully operational QVGA readout circuits CMOS base wafers (320 x 240 pixels). In this outlook, the article reports on the electro optical performance obtained from this preliminary PLP based QVGA demonstrator. Apart from the response, noise and NETD distributions, the paper also puts emphasis on additional key features such as thermal time constant, image quality, and ageing properties.

  10. Characterisation of edgeless technologies for pixellated and strip silicon detectors with a micro-focused X-ray beam

    NASA Astrophysics Data System (ADS)

    Bates, R.; Blue, A.; Christophersen, M.; Eklund, L.; Ely, S.; Fadeyev, V.; Gimenez, E.; Kachkanov, V.; Kalliopuska, J.; Macchiolo, A.; Maneuski, D.; Phlips, B. F.; Sadrozinski, H. F.-W.; Stewart, G.; Tartoni, N.; Zain, R. M.

    2013-01-01

    Reduced edge or ``edgeless'' detector design offers seamless tileability of sensors for a wide range of applications from particle physics to synchrotron and free election laser (FEL) facilities and medical imaging. Combined with through-silicon-via (TSV) technology, this would allow reduced material trackers for particle physics and an increase in the active area for synchrotron and FEL pixel detector systems. In order to quantify the performance of different edgeless fabrication methods, 2 edgeless detectors were characterized at the Diamond Light Source using an 11 μm FWHM 15 keV micro-focused X-ray beam. The devices under test were: a 150 μm thick silicon active edge pixel sensor fabricated at VTT and bump-bonded to a Medipix2 ROIC; and a 300 μm thick silicon strip sensor fabricated at CIS with edge reduction performed by SCIPP and the NRL and wire bonded to an ALiBaVa readout system. Sub-pixel resolution of the 55 μm active edge pixels was achieved. Further scans showed no drop in charge collection recorded between the centre and edge pixels, with a maximum deviation of 5% in charge collection between scanned edge pixels. Scans across the cleaved and standard guard ring edges of the strip detector also show no reduction in charge collection. These results indicate techniques such as the scribe, cleave and passivate (SCP) and active edge processes offer real potential for reduced edge, tiled sensors for imaging detection applications.

  11. Digital performance improvements of a CdTe pixel detector for high flux energy-resolved X-ray imaging

    NASA Astrophysics Data System (ADS)

    Abbene, L.; Gerardi, G.; Principato, F.

    2015-03-01

    Photon counting detectors with energy resolving capabilities are desired for high flux X-ray imaging. In this work, we present the performance of a pixelated Schottky Al/p-CdTe/Pt detector (4×4) coupled to a custom-designed digital readout electronics for high flux measurements. The detector (4×4×2 mm3) has an anode layout based on an array of 16 pixels with a geometric pitch of 1 mm (pixel size of 0.6 mm). The 4-channel readout electronics is able to continuously digitize and process the signals from each pixel, performing multi-parameter analysis (event arrival time, pulse shape, pulse height, pulse time width, etc.) even at high fluxes and at different throughput and energy resolution conditions. The spectroscopic response of the system to monochromatic X-ray sources, at both low and high rates, is presented with particular attention to the mitigation of some typical spectral distortions (pile-up, baseline shifts and charge sharing). At a photon counting rate of 520 kcps/pixel, the system exhibits an energy resolution (FWHM at 59.5 keV) of 4.6%, 7.1% and 9% at throughputs of 0.9%, 16% and 82%, respectively. Measurements of Ag-target X-ray spectra also show the ability of the system to perform accurate estimation of the input counting rate up to 1.1 Mcps/pixel. The aim of this work is to point out, beside the appealing properties of CdTe detectors, the benefits of the digital approach in the development of high-performance energy resolved photon counting (ERPC) systems for high flux X-ray imaging.

  12. MÖNCH, a small pitch, integrating hybrid pixel detector for X-ray applications

    NASA Astrophysics Data System (ADS)

    Dinapoli, R.; Bergamaschi, A.; Cartier, S.; Greiffenberg, D.; Johnson, I.; Jungmann, J. H.; Mezza, D.; Mozzanica, A.; Schmitt, B.; Shi, X.; Tinti, G.

    2014-05-01

    PSI is developing several new detector families based on charge integration and analog readout (CI) to respond to the needs of X-ray free electron lasers (XFELs), where a signal up to ~ 104 photons impinging simultaneously on a pixel make single photon counting detectors unusable. MÖNCH is a novel hybrid silicon pixel detector where CI is combined with a challengingly small pixel size of 25 × 25 μm2. CI enables the detector to process several incoming photon simultaneously in XFEL applications. Moreover, due to the small pixel size, the charge produced by an impinging photon is often shared. In low flux experiments the analog information provided by single photons can be used either to obtain spectral information or to improve the position resolution by interpolation. Possible applications are resonant and non-resonant inelastic X-ray scattering or X-ray tomography with X-ray tubes. Two prototype ASICs were designed in UMC 110 nm technology. MÖNCH01 contains only some test cells used to assess technology performance and make basic design choices. MÖNCH02 is a fully functional, small scale prototype of 4 × 4 mm2, containing an array of 160 × 160 pixels. This array is subdivided in five blocks, each featuring a different pixel architecture. Two blocks have statically selectable preamplifier gains and target synchrotron applications. In low gain mode they should provide single photon sensitivity (at 6-12 keV) as well as a reasonable dynamic range for such a small area ( > 120 photons). In high gain they target high resolution, low flux experiments where charge sharing can be exploited to reach μm resolution. Three other architectures address possible uses at XFELs and implement automatic switching between two gains to increase the dynamic range, as well as input overvoltage control. The paper presents the MÖNCH project and first results obtained with the MÖNCH02 prototype.

  13. Similarities and differences of recent hybrid pixel detectors for X-ray and high energy physics developed at the Paul Scherrer Institut

    NASA Astrophysics Data System (ADS)

    Tinti, G.; Bergamaschi, A.; Cartier, S.; Dinapoli, R.; Greiffenberg, D.; Horisberger, R.; Johnson, I.; Jungmann-Smith, J. H.; Mezza, D.; Mozzanica, A.; Schmitt, B.; Shi, X.

    2015-04-01

    Hybrid pixel detectors are being developed for both photon science and high energy physics. The article will cover similarities and differences in pixel detectors for both applications using two of the pixel detectors developed at the Paul Scherrer Institute (Switzerland) as examples: the EIGER photon counting detector and the psi46dig chip, which has been developed for the Compact Muon Solenoid (CMS) tracking pixel detector upgrade. EIGER is a single photon counting hybrid pixel detector for applications at synchrotron light sources in the energy range from a few to 25 keV. It is characterized by a small pixel size (75 × 75 μm2), high count rate capability (106 counts/pixel/s) and very high data rate, which reaches 6 Gb/s for a 256 × 256 pixel chip. The CMS pixel detector is designed to provide charge information from the pixels in the harsh radiation environment at the Large Hadron Collider. The short time between bunches of 25 ns and the high event rate at luminosity up to 2 × 1034cm-2s-1 require a detector with high hit efficiency, with good timing resolution and the ability to retain timestamp information for the hits. The readout architecture is based on the transfer of hits from the pixels to the periphery, where the trigger validation is performed before data transfer. The data rates of the digitized output reach 160 Mb/s for a 52×80 pixel chip.The specific timing and rate requirements for the detectors, the analog performances (minimum threshold and noise), the power consumption and the radiation hardness will be compared. An overview on future developments based on mutual learning and common solutions will be discussed.

  14. VCSELs for interferometric readout of MEMS sensors

    NASA Astrophysics Data System (ADS)

    Serkland, Darwin K.; Geib, Kent M.; Peake, Gregory M.; Keeler, Gordon A.; Shaw, Michael J.; Baker, Michael S.; Okandan, Murat

    2016-03-01

    We report on the development of single-frequency VCSELs (vertical-cavity surface-emitting lasers) for sensing the position of a moving MEMS (micro-electro-mechanical system) object with resolution much less than 1nm. Position measurement is the basis of many different types of MEMS sensors, including accelerometers, gyroscopes, and pressure sensors. Typically, by switching from a traditional capacitive electronic readout to an interferometric optical readout, the resolution can be improved by an order of magnitude with a corresponding improvement in MEMS sensor performance. Because the VCSEL wavelength determines the scale of the position measurement, laser wavelength (frequency) stability is desirable. This paper discusses the impact of VCSEL amplitude and frequency noise on the position measurement.

  15. Vector diffraction analysis of optical disk readout.

    PubMed

    Cheng, X; Jia, H; Xu, D

    2000-12-01

    The optical disk readout signals from ROM disks are presented by use of a rigorous three-dimensional vector diffraction method. The optical disk is modeled as a crossed metal grating without restriction on the form of the information marks, and the permittivity of the metal is taken into account. The diffracted field from the disk is obtained by means of decomposing the focused incident beam into a spectrum of plane waves and then calculating the diffracted plane waves for each respective incident component. The readout signal is obtained by integration of the energy-flux density of the diffracted field according to the detection scheme of the optical disk system. A typical digital versatile disk (DVD) system is applied with this theory, and the result is far from that of scalar diffraction theory. PMID:18354657

  16. Results from the NA62 Gigatracker Prototype: A Low-Mass and sub-ns Time Resolution Silicon Pixel Detector

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Rinella, G. Aglieri; Carassiti, V.; Ceccucci, A.; Gil, E. Cortina; Ramusino, A. Cotta; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Martin, E.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petagna, P.; Petrucci, F.; Perktold, L.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    The Gigatracker (GTK) is a hybrid silicon pixel detector developed for NA62, the experiment aimed at studying ultra-rare kaon decays at the CERN SPS. Three GTK stations will provide precise momentum and angular measurements on every track of the high intensity NA62 hadron beam with a time-tagging resolution of 150 ps. Multiple scattering and hadronic interactions of beam particles in the GTK have to be minimized to keep background events at acceptable levels, hence the total material budget is fixed to 0.5% X0 per station. In addition the calculated fluence for 100 days of running is 2×1014 1 MeV neq/cm2, comparable to the one expected for the inner trackers of LHC detectors in 10 years of operation. These requirements pose challenges for the development of an efficient and low-mass cooling system, to be operated in vacuum, and on the thinning of read-out chips to 100 μm or less. The most challenging requirement is represented by the time resolution, which can be achieved by carefully compensating for the discriminator time-walk. For this purpose, two complementary read-out architectures have been designed and produced as small-scale prototypes: the first is based on the use of a Time-over-Threshold circuit followed by a TDC shared by a group of pixels, while the other uses a constant-fraction discriminator followed by an on-pixel TDC. The readout pixel ASICs are produced in 130 nm IBM CMOS technology and bump-bonded to 200 μm thick silicon sensors. The Gigatracker detector system is described with particular emphasis on recent experimental results obtained from laboratory and beam tests of prototype bump-bonded assemblies, which show a time resolution of less than 200 ps for single hits.

  17. Signal processing for distributed readout using TESs

    NASA Astrophysics Data System (ADS)

    Smith, Stephen J.; Whitford, Chris H.; Fraser, George W.

    2006-04-01

    We describe optimal filtering algorithms for determining energy and position resolution in position-sensitive Transition Edge Sensor (TES) Distributed Read-Out Imaging Devices (DROIDs). Improved algorithms, developed using a small-signal finite-element model, are based on least-squares minimisation of the total noise power in the correlated dual TES DROID. Through numerical simulations we show that significant improvements in energy and position resolution are theoretically possible over existing methods.

  18. LSST camera readout chip ASPIC: test tools

    NASA Astrophysics Data System (ADS)

    Antilogus, P.; Bailly, Ph; Jeglot, J.; Juramy, C.; Lebbolo, H.; Martin, D.; Moniez, M.; Tocut, V.; Wicek, F.

    2012-02-01

    The LSST camera will have more than 3000 video-processing channels. The readout of this large focal plane requires a very compact readout chain. The correlated ''Double Sampling technique'', which is generally used for the signal readout of CCDs, is also adopted for this application and implemented with the so called ''Dual Slope integrator'' method. We have designed and implemented an ASIC for LSST: the Analog Signal Processing asIC (ASPIC). The goal is to amplify the signal close to the output, in order to maximize signal to noise ratio, and to send differential outputs to the digitization. Others requirements are that each chip should process the output of half a CCD, that is 8 channels and should operate at 173 K. A specific Back End board has been designed especially for lab test purposes. It manages the clock signals, digitizes the analog differentials outputs of ASPIC and stores data into a memory. It contains 8 ADCs (18 bits), 512 kwords memory and an USB interface. An FPGA manages all signals from/to all components on board and generates the timing sequence for ASPIC. Its firmware is written in Verilog and VHDL languages. Internals registers permit to define various tests parameters of the ASPIC. A Labview GUI allows to load or update these registers and to check a proper operation. Several series of tests, including linearity, noise and crosstalk, have been performed over the past year to characterize the ASPIC at room and cold temperature. At present, the ASPIC, Back-End board and CCD detectors are being integrated to perform a characterization of the whole readout chain.

  19. Bilateral bad pixel and Stokes image reconstruction for microgrid polarimetric imagers

    NASA Astrophysics Data System (ADS)

    LeMaster, Daniel A.; Ratliff, Bradley M.

    2015-09-01

    Uncorrected or poorly corrected bad pixels reduce the effectiveness of polarimetric clutter suppression. In conventional microgrid processing, bad pixel correction is accomplished as a separate step from Stokes image reconstruction. Here, these two steps are combined to speed processing and provide better estimates of the entire image, including missing samples. A variation on the bilateral filter enables both edge preservation in the Stokes imagery and bad pixel suppression. Understanding the newly presented filter requires two key insights. First, the adaptive nature of the bilateral filter is extended to correct for bad pixels by simply incorporating a bad pixel mask. Second, the bilateral filter for Stokes estimation is the sum of the normalized bilateral filters for estimating each analyzer channel individually. This paper describes the new approach and compares it to our legacy method using simulated imagery.

  20. A high speed, low power consumption LVDS interface for CMOS pixel sensors

    NASA Astrophysics Data System (ADS)

    Shi, Zhan; Tang, Zhenan; Tian, Yong; Pham, Hung; Valin, Isabelle; Jaaskelainen, Kimmo

    2015-01-01

    The use of CMOS Pixel Sensors (CPSs) offers a promising approach to the design of vertex detectors in High Energy Physics (HEP) experiments. As the CPS equipping the upgraded Solenoidal Tracker at RHIC (STAR) pixel detector, ULTIMATE perfectly illustrates the potential of CPSs for HEP applications. However, further development of CPSs with respect to readout speed is required to fulfill the readout time requirement of the next generation HEP detectors, such as the upgrade of A Large Ion Collider Experiment (ALICE) Inner Tracking System (ITS), the International Linear Collider (ILC), and the Compressed Baryonic Matter (CBM) vertex detectors. One actual limitation of CPSs is related to the speed of the Low-Voltage Differential Signaling (LVDS) circuitry implementing the interface between the sensor and the Data Acquisition (DAQ) system. To improve the transmission rate while keeping the power consumption at a low level, a source termination technique and a special current comparator were adopted for the LVDS driver and receiver, respectively. Moreover, hardening techniques are used. The circuitry was designed and submitted for fabrication in a 0.18-μm CMOS Image Sensor (CIS) process at the end of 2011. The test results indicated that the LVDS driver and receiver can operate properly at the data rate of 1.2 Gb/s with power consumption of 19.6 mW.

  1. Characterization and performance of silicon n-in-p pixel detectors for the ATLAS upgrades

    NASA Astrophysics Data System (ADS)

    Weigell, P.; Beimforde, M.; Gallrapp, Ch.; La Rosa, A.; Macchiolo, A.; Nisius, R.; Pernegger, H.; Richter, R. H.

    2011-12-01

    The existing ATLAS tracker will be at its functional limit for particle fluences of 10 15 neq/cm2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. n-in-p silicon devices are a promising candidate for tracking detectors to achieve these goals, since they are radiation hard, cost efficient and are not type inverted after irradiation. A n-in-p pixel production based on a MPP/HLL design and performed by CiS (Erfurt, Germany) on 300 μm thick Float-Zone material is characterised and the electrical properties of sensors and single chip modules (SCM) are presented, including noise, charge collection efficiencies, and measurements with MIPs as well as an 241Am source. The SCMs are built with sensors connected to the current ATLAS read-out chip FE-I3. The characterisation has been performed with the ATLAS pixel read-out systems, before and after irradiation with 24 GeV/ c protons. In addition preliminary testbeam results for the tracking efficiency and charge collection, obtained with a SCM, are discussed.

  2. Readout Electronics for Hyper Suprime-Cam

    NASA Astrophysics Data System (ADS)

    Miyatake, Hironao; Aihara, Hiroaki; Fujimori, Hiroki; Mineo, Sogo; Miyazaki, Satoshi; Nakaya, Hidehiko; Uchida, Tomohisa

    Hyper Suprime-Cam(HSC)isa1GigapixelCCD camerafora wide-fieldgalaxy surveyatthe Subaru8-mTelescope. It will be mounted on the prime focus of the SubaruTelescope and is scheduled to receive its first light in 2012. The primary science is to conduct a weak lensing survey over ∼ 2,000 square degrees. The HSC has a 1.5-degree-diameter fieldofview, 7timeslarger than thatofits predecessor Suprime-Cam.It consistsofalarge corrector lens systemand afocalplane equippedwith116piecesof2kx4kfully depletedCCDs. Combinedwiththesuperbimagequalityand large aperture of the Subaru telescope, the surveyusing HSC can cover a cosmological volume and reach the limiting magnitude of at least one magnitudefainter than the other surveys conducted using 4-m class telescopes. The readout electronics of the HSC consist of two parts: one is the analog front-end electronics (FEE) and the other is the digital back-end electronics (BEE). The FEE is placed in a vacuum dewar together with the CCDs, and processes the analog CCD signal into 16-bit digital data. The BEE is small and light enough to be integrated into the camera unit, and employs three linksofGigabit Ethernetto readouta 2.3-GByte singleexposure within10 secondsatfast readout operation. The readout noise from the electronics is smaller than that from CCDs.

  3. EMIR high-dynamic range readout modes

    NASA Astrophysics Data System (ADS)

    Nuñez, Miguel; Gago, Fernando; Garzón, Francisco; Díaz, José J.; Barreto, Mary; Patrón, Jesús; González-Fenández, Carlos; Hammersley, Peter L.; López, Luis; Castro, Nieves

    2012-07-01

    EMIR is the NIR imager and multiobject spectrograph being built as a common user instrument for the GTC and it is currently entering in the integration and verification phase at system level. EMIR is being built by a Consortium of Spanish and French institutes led by the IAC. In this paper we describe the readout modes of EMIR detector, a Hawaii2 FPA, after two full calibrations campaigns. Besides the standard set of modes (reset-read, CDS, Fowler, Follow-up the ramp), the modified SDSU-III hardware and home made software will also offer high dynamic range readout modes, which will improve the ability of the instrument to sound densely populated areas which often are made of objects with large differences in brightness. These new high dynamic range modes are: single readout with very short integration time, window mode and combination of both. The results show that the new modes behave linearly with different exposition times, improve the maximum frame rate and increase the saturation limit in image mode for EMIR instrument.

  4. Study of spacecraft direct readout meteorological systems

    NASA Technical Reports Server (NTRS)

    Bartlett, R.; Elam, W.; Hoedemaker, R.

    1973-01-01

    Characteristics are defined of the next generation direct readout meteorological satellite system with particular application to Tiros N. Both space and ground systems are included. The recommended space system is composed of four geosynchronous satellites and two low altitude satellites in sun-synchronous orbit. The goesynchronous satellites transmit to direct readout ground stations via a shared S-band link, relayed FOFAX satellite cloud cover pictures (visible and infrared) and weather charts (WEFAX). Basic sensor data is transmitted to regional Data Utilization Stations via the same S-band link. Basic sensor data consists of 0.5 n.m. sub-point resolution data in the 0.55 - 0.7 micron spectral region, and 4.0 n.m. resolution data in the 10.5 - 12.6 micron spectral region. The two low altitude satellites in sun-synchronous orbit provide data to direct readout ground stations via a 137 MHz link, a 400 Mhz link, and an S-band link.

  5. Qubit readout with the Josephson Photomultiplier

    NASA Astrophysics Data System (ADS)

    Ribeill, Guilhem

    Recent demonstrations of error correction in many qubit circuits, as well as efforts to build a logical qubit, have shown the need for a simple and scalable superconducting quantum bit (qubit) readout. Current solutions based on heterodyne detection and cryogenic amplification of microwave readout tones may prove difficult to scale, while photon counting presents an attractive alternative. However, the development of counters operating at these frequencies has proved technically challenging. In this thesis, we describe the development of the Josephson Photomultiplier (JPM), a microwave photon counting circuit. We discuss the JPM theoretically, and describe the fabrication of the JPM using standard thin film lithography techniques. We measure its properties as a microwave photon counter using a qubit as an in-situ calibrated source of photons. We measure a JPM quantum efficiency at the few percent level. We then use the JPM to perform readout of a transmon qubit in both the dispersive and bright regimes. We observe raw measurement fidelities of 35% and 62% respectively. We discuss how the JPM and measurement protocol could be further optimized to achieve fidelities in excess of 90%.

  6. Design of integrated readout circuit with enhanced capacitance mechanism for dual-band infrared detector

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Shieh, Hsiu-Li; Shiu, Shiuan-Shuo; Liu, Yi-Ting; Tang, Shiang-Feng; Lin, Wen-Jen

    2011-10-01

    This study proposes a solution for an excessive dark current by a sharing capacitor, which avoids output signal distortion due to integration voltage saturation. Integration capacitance can be changed by adding a switch in the pixel circuit, which will increase the capacitance by two times the original. This circuit also provides output functions of either single-band or dual-band by switching to different sensor. This integrated readout circuit design adopts the TSMC 0.35um 2P4M CMOS 5V process, run on a 5V power supply and operated at a 3MHz clock rate. The dual-band pixel circuit uses an interlace structure, the pixel circuit areas of the two wavelengths are both 30um x 30um. The mid-wave and long-wave sensor currents are from 1nA to 2nA and 6nA to 8nA, respectively, and output swing is 2.8V.

  7. High stroke pixel for a deformable mirror

    DOEpatents

    Miles, Robin R.; Papavasiliou, Alexandros P.

    2005-09-20

    A mirror pixel that can be fabricated using standard MEMS methods for a deformable mirror. The pixel is electrostatically actuated and is capable of the high deflections needed for spaced-based mirror applications. In one embodiment, the mirror comprises three layers, a top or mirror layer, a middle layer which consists of flexures, and a comb drive layer, with the flexures of the middle layer attached to the mirror layer and to the comb drive layer. The comb drives are attached to a frame via spring flexures. A number of these mirror pixels can be used to construct a large mirror assembly. The actuator for the mirror pixel may be configured as a crenellated beam with one end fixedly secured, or configured as a scissor jack. The mirror pixels may be used in various applications requiring high stroke adaptive optics.

  8. Readout and data acquisition for KM3NeT

    NASA Astrophysics Data System (ADS)

    Belias, Anastasios; Manolopoulos, Konstantinos

    2013-05-01

    In the KM3NeT neutrino telescope design the readout concept is based on a point-to-point network connecting tenthousands of optical modules in the deep sea through a photonic network with the shore station. The time-over-threshold data from each Photo Multiplier Tube (PMT) of each optical module will be send to shore over fibres using dedicated wavelengths. Nanosecond timing accuracy will be schieved using a clock signal embedded in the data stream and measuring the roundtrip time from the shore to each optical module individually. The DAQ software architecture based on the Internet Communications Engine (ICE) will provide a common and uniform software framework for the control of each optical module and the data acquisition of the whole neutrino telescope.

  9. SAPHIRE (scintillator avalanche photoconductor with high resolution emitter readout) for low dose x-ray imaging: Spatial resolution

    SciTech Connect

    Li Dan; Zhao Wei

    2008-07-15

    An indirect flat panel imager (FPI) with programmable avalanche gain and field emitter array (FEA) readout is being investigated for low-dose and high resolution x-ray imaging. It is made by optically coupling a structured x-ray scintillator, e.g., thallium (Tl) doped cesium iodide (CsI), to an amorphous selenium (a-Se) avalanche photoconductor called high-gain avalanche rushing amorphous photoconductor (HARP). The charge image created by the scintillator/HARP (SHARP) combination is read out by the electron beams emitted from the FEA. The proposed detector is called scintillator avalanche photoconductor with high resolution emitter readout (SAPHIRE). The programmable avalanche gain of HARP can improve the low dose performance of indirect FPI while the FEA can be made with pixel sizes down to 50 {mu}m. Because of the avalanche gain, a high resolution type of CsI (Tl), which has not been widely used in indirect FPI due to its lower light output, can be used to improve the high spatial frequency performance. The purpose of the present article is to investigate the factors affecting the spatial resolution of SAPHIRE. Since the resolution performance of the SHARP combination has been well studied, the focus of the present work is on the inherent resolution of the FEA readout method. The lateral spread of the electron beam emitted from a 50 {mu}mx50 {mu}m pixel FEA was investigated with two different electron-optical designs: mesh-electrode-only and electrostatic focusing. Our results showed that electrostatic focusing can limit the lateral spread of electron beams to within the pixel size of down to 50 {mu}m. Since electrostatic focusing is essentially independent of signal intensity, it will provide excellent spatial uniformity.

  10. Fluoroscopic x-ray demonstrator using a CdTe polycrystalline layer coupled to a CMOS readout chip

    NASA Astrophysics Data System (ADS)

    Arques, M.; Renet, S.; Brambilla, A.; Feuillet, G.; Gasse, A.; Billon-Pierron, N.; Jolliot, M.; Mathieu, L.; Rohr, P.

    2010-04-01

    Dynamic X-ray imagers require large surface, fast and highly sensitive X-ray absorbers and dedicated readout electronics. Monocrystalline photoconductors offer the sensitivity, speed, and MTF performances. Polycristalline photoconductors offer the large surface at a moderate cost. The challenge for them is to maintain the first performances at a compatible level with the medical applications requirements. This work has been focused on polycristalline CdTe grown by Close Space Sublimation (CSS) technique. This technique offers the possibility to grow large layers with a high material evaporation yield. This paper presents the results obtained with an image demonstrator using 350μm thick CdTe_css layers coupled to a CMOS readout circuit with Indium bumping. The present demonstrator has 200 x 200 pixels, with a pixel pitch of 75μm ×75μm. A total image surface of 15mm × 15mm has then been obtained. The ASIC works in an integration mode, i.e. each pixel accumulates the charges coming from the CdTe layer on a capacitor, converting them to a voltage. Single images as well as video sequences have been obtained. X-ray performance at 16 frames per second rate is measured. In particular a readout noise of 0.5 X ray, an MTF of 50% at 4 lp/mm and a DQE of 20% at 4lp/mm and 600 nGy are obtained. Although present demonstrator surface is moderate, it demonstrates that high performance can be expected from this assembly concept and its interest for medical applications.

  11. Compensation for radiation damage of SOI pixel detector via tunneling

    NASA Astrophysics Data System (ADS)

    Yamada, M.; Arai, Y.; Fujita, Y.; Hamasaki, R.; Ikegami, Y.; Kurachi, I.; Miyoshi, T.; Nishimura, R.; Tauchi, K.; Tsuboyama, T.

    2016-09-01

    We are developing a method for removing holes trapped in the oxide layer of a silicon-on-insulator (SOI) monolithic pixel detector after irradiation. Radiation that passes through the detector generates positive charge by trapped holes in the buried oxide layer (BOX) underneath the MOSFET. The positive potential caused by these trapped holes modifies the characteristics of the MOSFET of the signal readout circuit. In order to compensate for the effect of the positive potential, we tried to recombine the trapped holes with electrons via Fowler-Nordheim (FN) tunneling. By applying high voltage to the buried p-well (BPW) under the oxide layer with the MOSFET fixed at 0 V, electrons are injected into the BOX by FN tunneling. X-rays cause a negative shift in the threshold voltage Vth of the MOSFET. We can successfully recover Vth close to its pre-irradiation level after applying VBPW ≥ 120 V. However, the drain leakage current increased after applying VBPW; we find that this can be suppressed by applying a negative voltage to the BPW.

  12. Improvement to the signaling interface for CMOS pixel sensors

    NASA Astrophysics Data System (ADS)

    Shi, Zhan; Tang, Zhenan; Feng, Chong; Cai, Hong

    2016-10-01

    The development of the readout speed of CMOS pixel sensors (CPS) is motivated by the demanding requirements of future high energy physics (HEP) experiments. As the interface between CPS and the data acquisition (DAQ) system, which inputs clock from the DAQ system and outputs data from CPS, the signaling interface should also be improved in terms of data rates. Meanwhile, the power consumption of the signaling interface should be maintained as low as possible. Consequently, a reduced swing differential signaling (RSDS) driver was adopted instead of a low-voltage differential signaling (LVDS) driver to transmit data from CPS to the DAQ system. In order to increase the capability of data rates, a serial source termination technique was employed. A LVDS/RSDS receiver was employed for transmitting clock from the DAQ system to CPS. A new method of generating hysteresis and a special current comparator were used to achieve a higher speed with lower power consumption. The signaling interface was designed and submitted for fabrication in a 0.18 μm CMOS image sensor (CIS) process. Measurement results indicate that the RSDS driver and the LVDS receiver can operate correctly at a data rate of 2 Gb/s with a power consumption of 19.1 mW.

  13. Results from a Prototype MAPS Sensor Telescope and Readout Systemwith Zero Suppression for the Heavy Flavor Tracker at STAR

    SciTech Connect

    Greiner, Leo C.; Matis, Howard S.; Ritter, Hans G.; Rose, AndrewA.; Stezelberger, Thorsten; Sun, Xiangming; Szelezniak, Michal A.; Thomas, James H.; Vu, Chinh Q.; Wieman, Howard H.

    2008-02-11

    We describe a three Mimostar-2 Monolithic Active PixelSensor (MAPS) sensor telescope prototype with an accompanying readoutsystem incorporating on-the-fly data sparsification. The system has beencharacterized and we report on the measured performance of the sensortelescope and readout system in beam tests conducted both at the AdvancedLight Source (ALS) at Lawrence Berkeley National Laboratory (LBNL) and inthe STAR experiment at the Relativistic Heavy Ion Collider (RHIC). Thiseffort is part of the development and prototyping work that will lead toa vertex detector for the STAR experiment.

  14. KLauS: a low power Silicon Photomultiplier charge readout ASIC in 0.18 UMC CMOS

    NASA Astrophysics Data System (ADS)

    Briggl, K.; Chen, H.; Schimansky, D.; Shen, W.; Stankova, V.; Schultz-Coulon, H. C.

    2016-03-01

    We present the development of a low power Silicon Photomultiplier charge readout ASIC for an imaging calorimeter at a future linear collider. The analog front-end is designed to achieve sufficient signal-to-noise ratio for single pixel signals using low gain SiPMs, while allowing charge measurements over the full dynamic range of the sensors. The front-end consists of an input stage, two charge measurement branches and a fast comparator. A SAR ADC with a resolution of 10 bit digitizes the pulse height information. An additional pipelined SAR stage allows to increase the quantization resolution to 12 bit for calibration measurements.

  15. Sub-pixel mapping of water boundaries using pixel swapping algorithm (case study: Tagliamento River, Italy)

    NASA Astrophysics Data System (ADS)

    Niroumand-Jadidi, Milad; Vitti, Alfonso

    2015-10-01

    Taking the advantages of remotely sensed data for mapping and monitoring of water boundaries is of particular importance in many different management and conservation activities. Imagery data are classified using automatic techniques to produce maps entering the water bodies' analysis chain in several and different points. Very commonly, medium or coarse spatial resolution imagery is used in studies of large water bodies. Data of this kind is affected by the presence of mixed pixels leading to very outstanding problems, in particular when dealing with boundary pixels. A considerable amount of uncertainty inescapably occurs when conventional hard classifiers (e.g., maximum likelihood) are applied on mixed pixels. In this study, Linear Spectral Mixture Model (LSMM) is used to estimate the proportion of water in boundary pixels. Firstly by applying an unsupervised clustering, the water body is identified approximately and a buffer area considered ensuring the selection of entire boundary pixels. Then LSMM is applied on this buffer region to estimate the fractional maps. However, resultant output of LSMM does not provide a sub-pixel map corresponding to water abundances. To tackle with this problem, Pixel Swapping (PS) algorithm is used to allocate sub-pixels within mixed pixels in such a way to maximize the spatial proximity of sub-pixels and pixels in the neighborhood. The water area of two segments of Tagliamento River (Italy) are mapped in sub-pixel resolution (10m) using a 30m Landsat image. To evaluate the proficiency of the proposed approach for sub-pixel boundary mapping, the image is also classified using a conventional hard classifier. A high resolution image of the same area is also classified and used as a reference for accuracy assessment. According to the results, sub-pixel map shows in average about 8 percent higher overall accuracy than hard classification and fits very well in the boundaries with the reference map.

  16. Micro-Pixel Image Position Sensing Testbed

    NASA Technical Reports Server (NTRS)

    Nemati, Bijan; Shao, Michael; Zhai, Chengxing; Erlig, Hernan; Wang, Xu; Goullioud, Renaud

    2011-01-01

    The search for Earth-mass planets in the habitable zones of nearby Sun-like stars is an important goal of astrophysics. This search is not feasible with the current slate of astronomical instruments. We propose a new concept for microarcsecond astrometry which uses a simplified instrument and hence promises to be low cost. The concept employs a telescope with only a primary, laser metrology applied to the focal plane array, and new algorithms for measuring image position and displacement on the focal plane. The required level of accuracy in both the metrology and image position sensing is at a few micro-pixels. We have begun a detailed investigation of the feasibility of our approach using simulations and a micro-pixel image position sensing testbed called MCT. So far we have been able to demonstrate that the pixel-to-pixel distances in a focal plane can be measured with a precision of 20 micro-pixels and image-to-image distances with a precision of 30 micro-pixels. We have also shown using simulations that our image position algorithm can achieve accuracy of 4 micro-pixels in the presence of lambda/20 wavefront errors.

  17. It's not the pixel count, you fool

    NASA Astrophysics Data System (ADS)

    Kriss, Michael A.

    2012-01-01

    The first thing a "marketing guy" asks the digital camera engineer is "how many pixels does it have, for we need as many mega pixels as possible since the other guys are killing us with their "umpteen" mega pixel pocket sized digital cameras. And so it goes until the pixels get smaller and smaller in order to inflate the pixel count in the never-ending pixel-wars. These small pixels just are not very good. The truth of the matter is that the most important feature of digital cameras in the last five years is the automatic motion control to stabilize the image on the sensor along with some very sophisticated image processing. All the rest has been hype and some "cool" design. What is the future for digital imaging and what will drive growth of camera sales (not counting the cell phone cameras which totally dominate the market in terms of camera sales) and more importantly after sales profits? Well sit in on the Dark Side of Color and find out what is being done to increase the after sales profits and don't be surprised if has been done long ago in some basement lab of a photographic company and of course, before its time.

  18. A low-noise 64-channel front-end readout ASIC for CdZnTe detectors aimed to hard X-ray imaging systems

    NASA Astrophysics Data System (ADS)

    Gan, B.; Wei, T.; Gao, W.; Liu, H.; Hu, Y.

    2016-04-01

    In this paper, we report on the recent development of a 64-channel low-noise front-end readout ASIC for CdZnTe detectors aimed to hard X-ray imaging systems. The readout channel is comprised of a charge sensitive amplifier, a leakage current compensation circuit, a CR-RC shaper, two S-K filters, an inverse proportional amplifier, a peak-detect-and-hold circuit, a discriminator and trigger logic, a time sequence control circuit and a driving buffer. The readout ASIC is implemented in TSMC 0.35 μm mixed-signal CMOS technology, the die size of the prototype chip is 2.7 mm×8.0 mm. The overall gain of the readout channel is 200 mV/fC, the power consumption is less than 8 mW/channel, the linearity error is less than 1%, the inconsistency among the channels is less than 2.86%, and the equivalent noise charge of a typical channel is 66 e- at zero farad plus 14 e- per picofarad. By connecting this readout ASIC to an 8×8 pixel CdZnTe detector, we obtained an energy spectrum, the energy resolution of which is 4.5% at the 59.5 keV line of 241Am source.

  19. LISe pixel detector for neutron imaging

    NASA Astrophysics Data System (ADS)

    Herrera, Elan; Hamm, Daniel; Wiggins, Brenden; Milburn, Rob; Burger, Arnold; Bilheux, Hassina; Santodonato, Louis; Chvala, Ondrej; Stowe, Ashley; Lukosi, Eric

    2016-10-01

    Semiconducting lithium indium diselenide, 6LiInSe2 or LISe, has promising characteristics for neutron detection applications. The 95% isotopic enrichment of 6Li results in a highly efficient thermal neutron-sensitive material. In this study, we report on a proof-of-principle investigation of a semiconducting LISe pixel detector to demonstrate its potential as an efficient neutron imager. The LISe pixel detector had a 4×4 of pixels with a 550 μm pitch on a 5×5×0.56 mm3 LISe substrate. An experimentally verified spatial resolution of 300 μm was observed utilizing a super-sampling technique.

  20. Per-Pixel Lighting Data Analysis

    SciTech Connect

    Inanici, Mehlika

    2005-08-01

    This report presents a framework for per-pixel analysis of the qualitative and quantitative aspects of luminous environments. Recognizing the need for better lighting analysis capabilities and appreciating the new measurement abilities developed within the LBNL Lighting Measurement and Simulation Toolbox, ''Per-pixel Lighting Data Analysis'' project demonstrates several techniques for analyzing luminance distribution patterns, luminance ratios, adaptation luminance and glare assessment. The techniques are the syntheses of the current practices in lighting design and the unique practices that can be done with per-pixel data availability. Demonstrated analysis techniques are applicable to both computer-generated and digitally captured images (physically-based renderings and High Dynamic Range photographs).

  1. High rate particle tracking and ultra-fast timing with a thin hybrid silicon pixel detector

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Aglieri Rinella, G.; Carassiti, V.; Ceccucci, A.; Cortina Gil, E.; Cotta Ramusino, A.; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Marchetto, F.; Mapelli, A.; Martin, E.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Perktold, L.; Petagna, P.; Petrucci, F.; Poltorak, K.; Riedler, P.; Rivetti, A.; Statera, M.; Velghe, B.

    2013-08-01

    The Gigatracker (GTK) is a hybrid silicon pixel detector designed for the NA62 experiment at CERN. The beam spectrometer, made of three GTK stations, has to sustain high and non-uniform particle rate (∼ 1 GHz in total) and measure momentum and angles of each beam track with a combined time resolution of 150 ps. In order to reduce multiple scattering and hadronic interactions of beam particles, the material budget of a single GTK station has been fixed to 0.5% X0. The expected fluence for 100 days of running is 2 ×1014 1 MeV neq /cm2, comparable to the one foreseen in the inner trackers of LHC detectors during 10 years of operation. To comply with these requirements, an efficient and very low-mass (< 0.15 %X0) cooling system is being constructed, using a novel microchannel cooling silicon plate. Two complementary read-out architectures have been produced as small-scale prototypes: one is based on a Time-over-Threshold circuit followed by a TDC shared by a group of pixels, while the other makes use of a constant-fraction discriminator followed by an on-pixel TDC. The read-out ASICs are produced in 130 nm IBM CMOS technology and will be thinned down to 100 μm or less. An overview of the Gigatracker detector system will be presented. Experimental results from laboratory and beam tests of prototype bump-bonded assemblies will be described as well. These results show a time resolution of about 170 ps for single hits from minimum ionizing particles, using 200 μm thick silicon sensors.

  2. Performance of thin pixel sensors irradiated up to a fluence of 1016 neq cm-2 and development of a new interconnection technology for the upgrade of the ATLAS pixel system

    NASA Astrophysics Data System (ADS)

    Macchiolo, A.; Andricek, L.; Beimforde, M.; Moser, H.-G.; Nisius, R.; Richter, R. H.; Weigell, P.

    2011-09-01

    A new pixel module concept is presented, where thin sensors and a novel vertical integration technique are combined. This R&D activity is carried out in view of the ATLAS pixel detector upgrades. A first set of n-in-p pixel sensors with active thicknesses of 75 and 150 μm has been produced using a thinning technique developed at the Max-Planck-Institut Halbleiterlabor (HLL). Charge Collection Efficiency measurements have been performed, yielding a higher CCE than expected from the present radiation damage models. The interconnection of thin n-in-p pixels to the FE-I3 ATLAS electronics is under way, exploiting the Solid Liquid Interdiffusion (SLID) technique developed by the Fraunhofer Institut EMFT. In addition, preliminary studies aimed at Inter-Chip-Vias (ICV) etching into the FE-I3 electronics are reported. ICVs will be used to route the signals vertically through the read-out chip, to newly created pads on the backside. This should serve as a proof of principle for future four-side tileable pixel assemblies, avoiding the cantilever presently needed in the chip for the wire bonding.

  3. The Gigatracker: An ultra-fast and low-mass silicon pixel detector for the NA62 experiment

    NASA Astrophysics Data System (ADS)

    Fiorini, M.; Carassiti, V.; Ceccucci, A.; Cortina, E.; Cotta Ramusino, A.; Dellacasa, G.; Garbolino, S.; Jarron, P.; Kaplon, J.; Kluge, A.; Mapelli, A.; Marchetto, F.; Martin, E.; Martoiu, S.; Mazza, G.; Morel, M.; Noy, M.; Nuessle, G.; Petrucci, F.; Riedler, P.; Aglieri Rinella, G.; Rivetti, A.; Tiuraniemi, S.

    2011-02-01

    The Gigatracker is a hybrid silicon pixel detector developed to track the highly intense NA62 hadron beam with a time resolution of 150 ps (rms). The beam spectrometer of the experiment is composed of three Gigatracker stations installed in vacuum in order to precisely measure momentum, time and direction of every traversing particle. Precise tracking demands a very low mass of the detector assembly ( <0.5% X0 per station) in order to limit multiple scattering and beam hadronic interactions. The high rate and especially the high timing precision requirements are very demanding: two R&D options are ongoing and the corresponding prototype read-out chips have been recently designed and produced in 0.13 μm CMOS technology. One solution makes use of a constant fraction discriminator and on-pixel analogue-based time-to-digital-converter (TDC); the other comprises a delay-locked loop based TDC placed at the end of each pixel column and a time-over-threshold discriminator with time-walk correction technique. The current status of the R&D program is overviewed and results from the prototype read-out chips test are presented.

  4. First measurement of the in-pixel electron multiplying with a standard imaging CMOS technology: Study of the EMCMOS concept

    NASA Astrophysics Data System (ADS)

    Brugière, Timothée; Mayer, Fréderic; Fereyre, Pierre; Guérin, Cyrille; Dominjon, Agnés; Barbier, Rémi

    2015-07-01

    Scientific low light imaging devices benefit today from designs for pushing the mean noise to the single electron level. When readout noise reduction reaches its limit, signal-to-noise ratio improvement can be driven by an electron multiplication process, driven by impact ionization, before adding the readout noises. This concept already implemented in CCD structures using extra-pixel shift registers can today be integrated inside each pixel in CMOS technology. The EBCMOS group at IPNL is in charge of the characterization of new prototypes developed by E2V using this concept: the electron multiplying CMOS (EMCMOS). The CMOS technology enables electron multiplication inside the photodiode itself, and thus, an overlap of the charge integration and multiplication. A new modeling has been developed to describe the output signal mean and variance after the impact ionization process in such a case. In this paper the feasibility of impact ionization process inside a 8 μm-pitch pixel is demonstrated. The new modeling is also validated by data and a value of 0.32% is obtained for the impact ionization parameter α with an electric field intensity of 24 V / μm.

  5. Development of a novel high-rate gaseous pixel detector for time-resolved x-ray diffraction applications

    NASA Astrophysics Data System (ADS)

    Sarvestani, Amir; Besch, Hans-Juergen; Menk, Ralf-Hendrik; Pavel, Nicolaie A.; Walenta, Albert H.

    1999-10-01

    Modern X-ray diffraction applications demand for imaging detectors with large pixel number, high intensity precision, high rate capability and dead time free operation. Detailed studies with a simulation program, which has been developed to investigate the performance of different detector types, show that a large area gaseous single photon counter is very well suited to meet the aforementioned requirements. The prototype detector, which has been built according to the specification profile from the simulations, belongs to a new generation of gaseous detectors using novel technologies for both gas amplification (using a MicroCAT) and position encoding (using 2D resistive charge division). This local interpolation method combines the advantages of a pure pixel read-out (high local and global rate capability) with those of a projecting read-out (small number of channels). The current prototype system has an active area of 28 X 28 mm2 with effectively 140 X 140 pixels. Various test measurements at synchrotron light sources with biological samples have been performed demonstrating the good spatial resolution (around 300 micrometers FWHM), the high intensity precision (only Poisson limited) and the high rate capability (exceeding 1 MHz spot rate). Moreover, time resolved measurements in the microsecond domain have been performed, and fine angular slicing has been applied to protein crystallography experiments. The detector has a high reliability and robustness, particularly when compared to conventional gaseous detectors, and the extension of the technology used to larger active areas is feasible.

  6. A Readout Mechanism for Latency Codes

    PubMed Central

    Zohar, Oran; Shamir, Maoz

    2016-01-01

    Response latency has been suggested as a possible source of information in the central nervous system when fast decisions are required. The accuracy of latency codes was studied in the past using a simplified readout algorithm termed the temporal-winner-take-all (tWTA). The tWTA is a competitive readout algorithm in which populations of neurons with a similar decision preference compete, and the algorithm selects according to the preference of the population that reaches the decision threshold first. It has been shown that this algorithm can account for accurate decisions among a small number of alternatives during short biologically relevant time periods. However, one of the major points of criticism of latency codes has been that it is unclear how can such a readout be implemented by the central nervous system. Here we show that the solution to this long standing puzzle may be rather simple. We suggest a mechanism that is based on reciprocal inhibition architecture, similar to that of the conventional winner-take-all, and show that under a wide range of parameters this mechanism is sufficient to implement the tWTA algorithm. This is done by first analyzing a rate toy model, and demonstrating its ability to discriminate short latency differences between its inputs. We then study the sensitivity of this mechanism to fine-tuning of its initial conditions, and show that it is robust to wide range of noise levels in the initial conditions. These results are then generalized to a Hodgkin-Huxley type of neuron model, using numerical simulations. Latency codes have been criticized for requiring a reliable stimulus-onset detection mechanism as a reference for measuring latency. Here we show that this frequent assumption does not hold, and that, an additional onset estimator is not needed to trigger this simple tWTA mechanism. PMID:27812332

  7. Heavily irradiated N-in-p thin planar pixel sensors with and without active edges

    NASA Astrophysics Data System (ADS)

    Terzo, S.; Andricek, L.; Macchiolo, A.; Moser, H. G.; Nisius, R.; Richter, R. H.; Weigell, P.

    2014-05-01

    We present the results of the characterization of silicon pixel modules employing n-in-p planar sensors with an active thickness of 150 μm, produced at MPP/HLL, and 100-200 μm thin active edge sensor devices, produced at VTT in Finland. These thin sensors are designed as candidates for the ATLAS pixel detector upgrade to be operated at the HL-LHC, as they ensure radiation hardness at high fluences. They are interconnected to the ATLAS FE-I3 and FE-I4 read-out chips. Moreover, the n-in-p technology only requires a single side processing and thereby it is a cost-effective alternative to the n-in-n pixel technology presently employed in the LHC experiments. High precision beam test measurements of the hit efficiency have been performed on these devices both at the CERN SpS and at DESY, Hamburg. We studied the behavior of these sensors at different bias voltages and different beam incident angles up to the maximum one expected for the new Insertable B-Layer of ATLAS and for HL-LHC detectors. Results obtained with 150 μm thin sensors, assembled with the new ATLAS FE-I4 chip and irradiated up to a fluence of 4 × 1015 neq/cm2, show that they are excellent candidates for larger radii of the silicon pixel tracker in the upgrade of the ATLAS detector at HL-LHC. In addition, the active edge technology of the VTT devices maximizes the active area of the sensor and reduces the material budget to suit the requirements for the innermost layers. The edge pixel performance of VTT modules has been investigated at beam test experiments and the analysis after irradiation up to a fluence of 5 × 1015 neq/cm2 has been performed using radioactive sources in the laboratory.

  8. 14C autoradiography with an energy-sensitive silicon pixel detector.

    PubMed

    Esposito, M; Mettivier, G; Russo, P

    2011-04-01

    The first performance tests are presented of a carbon-14 ((14)C) beta-particle digital autoradiography system with an energy-sensitive hybrid silicon pixel detector based on the Timepix readout circuit. Timepix was developed by the Medipix2 Collaboration and it is similar to the photon-counting Medipix2 circuit, except for an added time-based synchronization logic which allows derivation of energy information from the time-over-threshold signal. This feature permits direct energy measurements in each pixel of the detector array. Timepix is bump-bonded to a 300 µm thick silicon detector with 256 × 256 pixels of 55 µm pitch. Since an energetic beta-particle could release its kinetic energy in more than one detector pixel as it slows down in the semiconductor detector, an off-line image analysis procedure was adopted in which the single-particle cluster of hit pixels is recognized; its total energy is calculated and the position of interaction on the detector surface is attributed to the centre of the charge cluster. Measurements reported are detector sensitivity, (4.11 ± 0.03) × 10(-3) cps mm(-2) kBq(-1) g, background level, (3.59 ± 0.01) × 10(-5) cps mm(-2), and minimum detectable activity, 0.0077 Bq. The spatial resolution is 76.9 µm full-width at half-maximum. These figures are compared with several digital imaging detectors for (14)C beta-particle digital autoradiography.

  9. A 400 KHz line rate 2048-pixel stitched SWIR linear array

    NASA Astrophysics Data System (ADS)

    Anchlia, Ankur; Vinella, Rosa M.; Gielen, Daphne; Wouters, Kristof; Vervenne, Vincent; Hooylaerts, Peter; Deroo, Pieter; Ruythooren, Wouter; De Gaspari, Danny; Das, Jo; Merken, Patrick

    2016-05-01

    Xenics has developed a family of stitched SWIR long linear arrays that operate up to 400 KHz of line rate. These arrays serve medical and industrial applications that require high line rates as well as space applications that require long linear arrays. The arrays are based on a modular ROIC design concept: modules of 512 pixels are stitched during fabrication to achieve 512, 1024 and 2048 pixel arrays. Each 512-pixel module has its own on-chip digital sequencer, analog readout chain and 4 output buffers. This modular concept enables a long array to run at a high line rates irrespective of the array length, which limits the line rate in a traditional linear array. The ROIC is flip-chipped with InGaAs detector arrays. The FPA has a pixel pitch of 12.5μm and has two pixel flavors: square (12.5μm) and rectangular (250μm). The frontend circuit is based on Capacitive Trans-impedance Amplifier (CTIA) to attain stable detector bias, and good linearity and signal integrity, especially at high speeds. The CTIA has an input auto-zero mechanism that allows to have low detector bias (<20mV). An on-chip Correlated Double Sample (CDS) facilitates removal of CTIA KTC and 1/f noise, and other offsets, achieving low noise performance. There are five gain modes in the FPA giving the full well range from 85Ke- to 40Me-. The measured input referred noise is 35e-rms in the highest gain mode. The FPA operates in Integrate While Read mode and, at a master clock rate of 60MHz and a minimum integration time of 1.4μs, achieves the highest line rate of 400 KHz. In this paper, design details and measurements results are presented in order to demonstrate the array performance.

  10. Asynchronous data readout system for multichannel ASIC

    NASA Astrophysics Data System (ADS)

    Ivanov, P. Y.; Atkin, E. V.

    2016-02-01

    The data readout system of multichannel data-driven ASIC, requiring high-speed (320 Mb/s) output data serialization is described. Its structure, based on a limited number of FIFO blocks, provides a lossless data transfer. The solution has been realized as a separate test IP block in the prototyped 8 channel ASIC, intended for the muon chamber of CBM experiment at FAIR. The block was developed for the UMC 0.18 μm MMRF CMOS process and prototyped via Europractice. Main parameters of the chip are given.

  11. NOTE: First images of a digital autoradiography system based on a Medipix2 hybrid silicon pixel detector

    NASA Astrophysics Data System (ADS)

    Mettivier, Giovanni; Montesi, Maria Cristina; Russo, Paolo

    2003-06-01

    We present the first images of beta autoradiography obtained with the high-resolution hybrid pixel detector consisting of the Medipix2 single photon counting read-out chip bump-bonded to a 300 µm thick silicon pixel detector. This room temperature system has 256 × 256 square pixels of 55 µm pitch (total sensitive area of 14 × 14 mm2), with a double threshold discriminator and a 13-bit counter in each pixel. It is read out via a dedicated electronic interface and control software, also developed in the framework of the European Medipix2 Collaboration. Digital beta autoradiograms of 14C microscale standard strips (containing separate bands of increasing specific activity in the range 0.0038-32.9 kBq g-1) indicate system linearity down to a total background noise of 1.8 × 10-3 counts mm-2 s-1. The minimum detectable activity is estimated to be 0.012 Bq for 36 000 s exposure and 0.023 Bq for 10 800 s exposure. The measured minimum detection threshold is less than 1600 electrons (equivalent to about 6 keV Si). This real-time system for beta autoradiography offers lower pixel pitch and higher sensitive area than the previous Medipix1-based system. It has a 14C sensitivity better than that of micro channel plate based systems, which, however, shows higher spatial resolution and sensitive area.

  12. Development of n-in-p silicon planar pixel sensors and flip-chip modules for very high radiation environments

    NASA Astrophysics Data System (ADS)

    Unno, Y.; Ikegami, Y.; Terada, S.; Mitsui, S.; Jinnouchi, O.; Kamada, S.; Yamamura, K.; Ishida, A.; Ishihara, M.; Inuzuka, T.; Hanagaki, K.; Hara, K.; Kondo, T.; Kimura, N.; Nakano, I.; Nagai, K.; Takashima, R.; Tojo, J.; Yorita, K.

    2011-09-01

    In this paper we present R&D of n-in-p pixel sensors, aiming for a very high radiation environment up to a fluence of 10 16 n eq/cm 2. To fabricate these sensors, two batches with different mask sets were employed: the first resulted in pixel sensors compatible with the ATLAS pixel readout frontend chip called FE-I3, and the second in FE-I3 and a new frontend chip, FE-I4, compatible sensors; small diodes were employed to investigate the width from the active diode to the dicing edge and the guard rings. Tests involving the diodes showed that the strong increase of leakage current was attributed to the edge current when the lateral depletion zone reaches the dicing edge and the lateral depletion along the silicon surface was correlated with the 'field' width. The onset was observed at a voltage of 1000 V when the width was equal to ˜400 μm. The pixel sensors that were diced at a width of 450 μm could successfully maintain a bias voltage of 1000 V. Hybrid flip-chip pixel modules with dummy and real chips were also fabricated. Lead (PbSn) solder bump bonding proved to be successful. However, lead-free (SnAg) solder bump bonding requires further optimization.

  13. Pixels, Imagers and Related Fabrication Methods

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor); Cunningham, Thomas J. (Inventor)

    2016-01-01

    Pixels, imagers and related fabrication methods are described. The described methods result in cross-talk reduction in imagers and related devices by generating depletion regions. The devices can also be used with electronic circuits for imaging applications.

  14. Pixels, Imagers and Related Fabrication Methods

    NASA Technical Reports Server (NTRS)

    Pain, Bedabrata (Inventor); Cunningham, Thomas J. (Inventor)

    2014-01-01

    Pixels, imagers and related fabrication methods are described. The described methods result in cross-talk reduction in imagers and related devices by generating depletion regions. The devices can also be used with electronic circuits for imaging applications.

  15. Metallic Magnetic Calorimeters with On-Chip dc-SQUID Readout

    NASA Astrophysics Data System (ADS)

    Kempf, S.; Ferring, A.; Fleischmann, A.; Wegner, M.; Enss, C.

    2016-07-01

    Metallic magnetic calorimeters (MMCs) are low-temperature particle detectors that are typically read out by using superconducting quantum interference devices (SQUIDs). But since MMCs are sensitive to the input circuitry and the noise performance of the SQUID, the energy resolution of MMCs have not yet reached their fundamental limit. A possible solution to overcome present limits is to maximize the flux coupling by minimizing parasitic inductance in the input circuit. To show the suitability of this approach, we realized a 64 pixel MMC detector array with integrated dc-SQUID readout, i.e., detector and SQUID are on the same chip. We observed an influence of the power dissipation of the SQUID on the detector temperature. We achieved a baseline energy resolution of Δ E_mathrm {FWHM} = 25 mathrm {eV} and Δ E_mathrm {FWHM} = 30 mathrm {eV} for X-rays with energies up to 6 mathrm {keV}.

  16. Avalanche current read-out circuit for low jitter parallel photon timing.

    PubMed

    Crotti, M; Rech, I; Gulinatti, A; Ghioni, M

    2013-08-01

    We propose a novel circuit for single photon avalanche diode (SPAD) current read-out, for photon timing applications. The circuit consists of a single transistor trans-impedance amplifier with a GHz bandwidth: the feedback loop fixes the SPAD anode voltage and allows us to obtain a high time resolution with a very high equivalent current threshold (almost 700 μA). The trans-impedance stage is followed by a low pass filter that reduces the crosstalk of other on-chip detectors and makes the designed structure suitable for multi-detector systems. The discrete components prototype presented in this letter achieves a state-of-art resolution of 34.4 ps FWHM, presents negligible crosstalk between the different pixels and opens the way for the development of an integrated structure with a large number of channels.

  17. Improvements to the image processing of HST NICMOS observationswith multiple readouts

    SciTech Connect

    Fadeyev, Vitaliy; Aldering, Gregory; Perlmutter, Saul

    2005-07-01

    We report on improvements made to the standard NICMOS processing pipeline. The calculation of the uncertainties on the signal accumulation rate has been modified to include the statistical correlations between the consecutive readouts. In order to correct a problem with the existing cosmic ray rejection algorithm, we have developed and implemented a joint fit procedure, where the accumulating signal is fit as linear functions of time with the same rate both before and after the cosmic ray (CR) impact. We also accounted for inter-pixel correlations in the CR-affected region. The new processing is most relevant for deep observations of faint targets, and for PSF fitting, for which unbiased measurements of accurate error estimates are important. We show examples of these improvements for deep NIC2 images of high-redshift supernova from the Supernova Cosmology Project.

  18. Readout of a LaBr 3:Ce continuous crystal by a MPPC array: First results

    NASA Astrophysics Data System (ADS)

    Scafè, R.; Cinti, M. N.; Di Lorenzo, P.; Zambotti, A.; Sacco, D.; Pisacane, F.; Bennati, P.; Miscioscia, R.; Pellegrini, R.; Pani, R.

    2009-07-01

    In this work preliminary results of single-photon measurements made with a LaBr3:Ce continuous scintillation crystal (BrilLanCe 380™, by Saint-Gobain Crystals, FR) coupled to an array of Multi-Pixel Photon Counters (MPPC™, by Hamamatsu Photonics, JP) are presented. The array of 7 MPPCs was realized as the innermost element of the hexagonal Anger-like structure suitable for growing to larger areas by adding peripheral elements. The design of MPPC electronic readout for position determination was based on Anger logic. Wide-band amplifiers (by MITEQ®, US) were used for signals conditioning. Digitized traces of background, 57Co and 133Ba collimated irradiation were captured, characterized and stored by using the data-logging capabilities of a WaveMaster Oscilloscope (by LeCroy, US). Results are presented in terms of energy response, position sensing and signals fall and rise times.

  19. Investigation of Surface Roughness Effect on Transition Edge Sensor Microcalorimeters Using Multilayer Readout Wiring

    NASA Astrophysics Data System (ADS)

    Kuromaru, G.; Kuwabara, K.; Miyazaki, N.; Suzuki, S.; Hosoya, S.; Koizumi, Y.; Ohashi, T.; Ishisaki, Y.; Ezoe, Y.; Yamada, S.; Mitsuda, K.; Hidaka, M.; Satoh, T.

    2016-07-01

    We are developing a transition edge sensor (TES) using multilayer readout wiring for future X-ray astronomy satellites. Although we fabricated a first full 20 × 20 pixels TES array, we could not confirm transition of the TES. Considering possible causes, we focused on surface roughness of the TES film. We checked the fabrication process steps that can influence the surface roughness step by step, and changed wiring material (Al to Nb) and also a process condition of an ion milling. As a result, we succeeded to reduce the surface roughness from 4.5 to 2.5 nm rms at 1 \\upmu m scale. However, the transition was not observed probably because the TES films in our samples with surface roughness more than {˜ }1 nm rms tend not to show the transition. Therefore, to suppress the surface roughness even more, we discuss possible process effects and mitigations.

  20. Performance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging.

    PubMed

    Esposito, M; Anaxagoras, T; Konstantinidis, A C; Zheng, Y; Speller, R D; Evans, P M; Allinson, N M; Wells, K

    2014-07-01

    Recently CMOS active pixels sensors (APSs) have become a valuable alternative to amorphous silicon and selenium flat panel imagers (FPIs) in bio-medical imaging applications. CMOS APSs can now be scaled up to the standard 20 cm diameter wafer size by means of a reticle stitching block process. However, despite wafer scale CMOS APS being monolithic, sources of non-uniformity of response and regional variations can persist representing a significant challenge for wafer scale sensor response. Non-uniformity of stitched sensors can arise from a number of factors related to the manufacturing process, including variation of amplification, variation between readout components, wafer defects and process variations across the wafer due to manufacturing processes. This paper reports on an investigation into the spatial non-uniformity and regional variations of a wafer scale stitched CMOS APS. For the first time a per-pixel analysis of the electro-optical performance of a wafer CMOS APS is presented, to address inhomogeneity issues arising from the stitching techniques used to manufacture wafer scale sensors. A complete model of the signal generation in the pixel array has been provided and proved capable of accounting for noise and gain variations across the pixel array. This novel analysis leads to readout noise and conversion gain being evaluated at pixel level, stitching block level and in regions of interest, resulting in a coefficient of variation ⩽1.9%. The uniformity of the image quality performance has been further investigated in a typical x-ray application, i.e. mammography, showing a uniformity in terms of CNR among the highest when compared with mammography detectors commonly used in clinical practice. Finally, in order to compare the detection capability of this novel APS with the technology currently used (i.e. FPIs), theoretical evaluation of the detection quantum efficiency (DQE) at zero-frequency has been performed, resulting in a higher DQE for this

  1. Performance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging

    NASA Astrophysics Data System (ADS)

    Esposito, M.; Anaxagoras, T.; Konstantinidis, A. C.; Zheng, Y.; Speller, R. D.; Evans, P. M.; Allinson, N. M.; Wells, K.

    2014-07-01

    Recently CMOS active pixels sensors (APSs) have become a valuable alternative to amorphous silicon and selenium flat panel imagers (FPIs) in bio-medical imaging applications. CMOS APSs can now be scaled up to the standard 20 cm diameter wafer size by means of a reticle stitching block process. However, despite wafer scale CMOS APS being monolithic, sources of non-uniformity of response and regional variations can persist representing a significant challenge for wafer scale sensor response. Non-uniformity of stitched sensors can arise from a number of factors related to the manufacturing process, including variation of amplification, variation between readout components, wafer defects and process variations across the wafer due to manufacturing processes. This paper reports on an investigation into the spatial non-uniformity and regional variations of a wafer scale stitched CMOS APS. For the first time a per-pixel analysis of the electro-optical performance of a wafer CMOS APS is presented, to address inhomogeneity issues arising from the stitching techniques used to manufacture wafer scale sensors. A complete model of the signal generation in the pixel array has been provided and proved capable of accounting for noise and gain variations across the pixel array. This novel analysis leads to readout noise and conversion gain being evaluated at pixel level, stitching block level and in regions of interest, resulting in a coefficient of variation ⩽1.9%. The uniformity of the image quality performance has been further investigated in a typical x-ray application, i.e. mammography, showing a uniformity in terms of CNR among the highest when compared with mammography detectors commonly used in clinical practice. Finally, in order to compare the detection capability of this novel APS with the technology currently used (i.e. FPIs), theoretical evaluation of the detection quantum efficiency (DQE) at zero-frequency has been performed, resulting in a higher DQE for this

  2. Steganography based on pixel intensity value decomposition

    NASA Astrophysics Data System (ADS)

    Abdulla, Alan Anwar; Sellahewa, Harin; Jassim, Sabah A.

    2014-05-01

    This paper focuses on steganography based on pixel intensity value decomposition. A number of existing schemes such as binary, Fibonacci, Prime, Natural, Lucas, and Catalan-Fibonacci (CF) are evaluated in terms of payload capacity and stego quality. A new technique based on a specific representation is proposed to decompose pixel intensity values into 16 (virtual) bit-planes suitable for embedding purposes. The proposed decomposition has a desirable property whereby the sum of all bit-planes does not exceed the maximum pixel intensity value, i.e. 255. Experimental results demonstrate that the proposed technique offers an effective compromise between payload capacity and stego quality of existing embedding techniques based on pixel intensity value decomposition. Its capacity is equal to that of binary and Lucas, while it offers a higher capacity than Fibonacci, Prime, Natural, and CF when the secret bits are embedded in 1st Least Significant Bit (LSB). When the secret bits are embedded in higher bit-planes, i.e., 2nd LSB to 8th Most Significant Bit (MSB), the proposed scheme has more capacity than Natural numbers based embedding. However, from the 6th bit-plane onwards, the proposed scheme offers better stego quality. In general, the proposed decomposition scheme has less effect in terms of quality on pixel value when compared to most existing pixel intensity value decomposition techniques when embedding messages in higher bit-planes.

  3. Small pixel oversampled IR focal plane arrays

    NASA Astrophysics Data System (ADS)

    Caulfield, John; Curzan, Jon; Lewis, Jay; Dhar, Nibir

    2015-06-01

    We report on a new high definition high charge capacity 2.1 Mpixel MWIR Infrared Focal Plane Array. This high definition (HD) FPA utilizes a small 5 um pitch pixel size which is below the Nyquist limit imposed by the optical systems Point Spread Function (PSF). These smaller sub diffraction limited pixels allow spatial oversampling of the image. We show that oversampling IRFPAs enables improved fidelity in imaging including resolution improvements, advanced pixel correlation processing to reduce false alarm rates, improved detection ranges, and an improved ability to track closely spaced objects. Small pixel HD arrays are viewed as the key component enabling lower size, power and weight of the IR Sensor System. Small pixels enables a reduction in the size of the systems components from the smaller detector and ROIC array, the reduced optics focal length and overall lens size, resulting in an overall compactness in the sensor package, cooling and associated electronics. The highly sensitive MWIR small pixel HD FPA has the capability to detect dimmer signals at longer ranges than previously demonstrated.

  4. Design and testing of an all-digital readout integrated circuit for infrared focal plane arrays

    NASA Astrophysics Data System (ADS)

    Kelly, Michael; Berger, Robert; Colonero, Curtis; Gregg, Mark; Model, Joshua; Mooney, Daniel; Ringdahl, Eric

    2005-08-01

    The digital focal plane array (DFPA) project demonstrates the enabling technologies necessary to build readout integrated circuits for very large infrared focal plane arrays (IR FPAs). Large and fast FPAs are needed for a new class of spectrally diverse sensors. Because of the requirement for high-resolution (low noise) sampling, and because of the sample rate needed for rapid acquisition of high-resolution spectra, it is highly desirable to perform analog-to-digital (A/D) conversion right at the pixel level. A dedicated A/D converter located under every pixel in a one-million-plus element array, and all-digital readout integrated circuits will enable multi- and hyper-spectral imaging systems with unprecedented spatial and spectral resolution and wide area coverage. DFPAs provide similar benefits to standard IR imaging systems as well. We have addressed the key enabling technologies for realizing the DFPA architecture in this work. Our effort concentrated on demonstrating a 60-micron footprint, 14-bit A/D converter and 2.5 Gbps, 16:1 digital multiplexer, the most basic components of the sensor. The silicon test chip was fabricated in a 0.18-micron CMOS process, and was designed to operate with HgxCd1-xTe detectors at cryogenic temperatures. Two A/D designs, one using static logic and one using dynamic logic, were built and tested for performance and power dissipation. Structures for evaluating the bit-error-rate of the multiplexer on-chip and through a differential output driver were implemented for a complete performance assessment. A unique IC probe card with fixtures to mount into an evacuated, closed-cycle helium dewar were also designed for testing up to 2.5 Gbps at temperatures as low as 50 K.

  5. Focal plane array with modular pixel array components for scalability

    DOEpatents

    Kay, Randolph R; Campbell, David V; Shinde, Subhash L; Rienstra, Jeffrey L; Serkland, Darwin K; Holmes, Michael L

    2014-12-09

    A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

  6. Simultaneous parallel inclined readout image technique.

    PubMed

    Paley, Martyn N J; Lee, Kuan J; Wild, James M; Griffiths, Paul D; Whitby, Elspeth H

    2006-06-01

    Sensitivity-encoded phase undersampling has been combined with simultaneous slice excitation to produce a parallel MRI method with a high volumetric acquisition acceleration factor without the need for auxiliary stepped field coils. Dual-slice excitation was produced by modulating both spin and gradient echo sequences at +/-6 kHz. Frequency aliasing of simultaneously excited slices was prevented by using an additional gradient applied along the slice axis during data acquisition. Data were acquired using a four-channel receiver array and x4 sensitivity encoding on a 1.5 T MR system. The simultaneous parallel inclined readout image technique has been successfully demonstrated in both phantoms and volunteers. A multiplicative image acquisition acceleration factor of up to x8 was achieved. Image SNR and resolution was dependent on the ratio of the readout gradient to the additional slice gradient. A ratio of approximately 2:1 produced acceptable image quality. Use of RF pulses with additional excitation bands should enable the technique to be extended to volumetric acquisition acceleration factors in the range of x16-24 without the SNR limitations of pure partially parallel phase reduction methods.

  7. Readout integrated circuit for microbolometer with an analog non-uniformity correction

    NASA Astrophysics Data System (ADS)

    Hwang, C. H.; Woo, D. H.; Lee, Y. S.; Lee, H. C.

    2005-10-01

    We have developed a microbolometer readout integrated circuit (ROIC) that corrects the non-uniformity in analog operation and acts in both normal mode and edge detection mode. A capacitive transimpedance amplifier (CTIA) has been employed as the input circuit of the microbolometer. Generally, when fabricating microbolometer focal plane arrays (FPAs), offset-error and gain-error in the inter-microbolometer are induced by fabrication error. They are shown as fixed pattern noise (FPN) in the infrared image. In the present study, a circuit correcting the offset-error and the gain-error in the normal mode by controlling the bias and the integration capacitance of the CTIA is proposed. This circuit does not require an additional DSP chip, and the non-uniformity is corrected before the analog to digital conversion (ADC). Thus, it can utilize 3-4 bits lower ADC compared to the conventional readout circuit. In the edge detection mode, after correcting the gain-error in two adjacent pixels, edge detection can be realized by subtracting their signal without the DSP. We have designed the suggested circuit to output a 10bit level effective infrared signal using 0.35um 2-poly 3-metal CMOS technology.

  8. Radiopurity assessment of the tracking readout for the NEXT double beta decay experiment

    NASA Astrophysics Data System (ADS)

    Cebrián, S.; Pérez, J.; Bandac, I.; Labarga, L.; Álvarez, V.; Barrado, A. I.; Bettini, A.; Borges, F. I. G. M.; Camargo, M.; Cárcel, S.; Cervera, A.; Conde, C. A. N.; Conde, E.; Dafni, T.; Díaz, J.; Esteve, R.; Fernandes, L. M. P.; Fernández, M.; Ferrario, P.; Ferreira, A. L.; Freitas, E. D. C.; Gehman, V. M.; Goldschmidt, A.; Gómez-Cadenas, J. J.; González-Díaz, D.; Gutiérrez, R. M.; Hauptman, J.; Hernando Morata, J. A.; Herrera, D. C.; Irastorza, I. G.; Laing, A.; Liubarsky, I.; López-March, N.; Lorca, D.; Losada, M.; Luzón, G.; Marí, A.; Martín-Albo, J.; Martínez, A.; Martínez-Lema, G.; Miller, T.; Monrabal, F.; Monserrate, M.; Monteiro, C. M. B.; Mora, F. J.; Moutinho, L. M.; Muñoz Vidal, J.; Nebot-Guinot, M.; Nygren, D.; Oliveira, C. A. B.; Ortiz de Solórzano, A.; Pérez Aparicio, J. L.; Querol, M.; Renner, J.; Ripoll, L.; Rodríguez, J.; Santos, F. P.; dos Santos, J. M. F.; Serra, L.; Shuman, D.; Simón, A.; Sofka, C.; Sorel, M.; Toledo, J. F.; Torrent, J.; Tsamalaidze, Z.; Veloso, J. F. C. A.; Villar, J. A.; Webb, R. C.; White, J. T.; Yahlali, N.

    2015-05-01

    The ``Neutrino Experiment with a Xenon Time-Projection Chamber'' (NEXT) is intended to investigate the neutrinoless double beta decay of 136Xe, which requires a severe suppression of potential backgrounds; therefore, an extensive screening and selection process is underway to control the radiopurity levels of the materials to be used in the experimental set-up of NEXT. The detector design combines the measurement of the topological signature of the event for background discrimination with the energy resolution optimization. Separate energy and tracking readout planes are based on different sensors: photomultiplier tubes for calorimetry and silicon multi-pixel photon counters for tracking. The design of a radiopure tracking plane, in direct contact with the gas detector medium, was specially challenging since the needed components like printed circuit boards, connectors, sensors or capacitors have typically, according to available information in databases and in the literature, activities too large for experiments requiring ultra-low background conditions. Here, the radiopurity assessment of tracking readout components based on gamma-ray spectroscopy using ultra-low background germanium detectors at the Laboratorio Subterr&aposaneo de Canfranc (Spain) is described. According to the obtained results, radiopure enough printed circuit boards made of kapton and copper, silicon photomultipliers and other required components, fulfilling the requirement of an overall background level in the region of interest of at most 8×10-4 counts keV-1 kg-1 y-1, have been identified.

  9. Sensitivity enhancement of grating interferometer based two-dimensional sensor arrays using two-wavelength readout

    SciTech Connect

    Ferhanoglu, Onur; Urey, Hakan

    2011-07-01

    Diffraction gratings integrated with microelectromechanical systems (MEMS) sensors offer displacement measurements with subnanometer sensitivity. However, the sensitivity of the interferometric readout may drop significantly based on the gap between the grating and the reference surface. A two-wavelength (2-{lambda}) readout method was previously tested using a single MEMS sensor for illustrating increased displacement measurement capability. This work demonstrates sensitivity enhancement on a sensor array with large scale parallelization ({approx}20,000 sensors). The statistical representation, which is developed to model sensitivity enhancement within a grating based sensor array, is supported by experimental results using a thermal sensor array. In the experiments, two lasers at different wavelengths (633 and 650 nm) illuminate the thermal sensor array from the backside, time-sequentially. The diffracted first order light from the array is imaged onto a single CCD camera. The target scene is reconstructed by observing the change in the first diffracted order diffraction intensity for both wavelengths. Merging of the data from two measurements with two lasers was performed by taking the larger of the two CCD measurements with respect to the reference image for each sensor. {approx}30% increase in the average sensitivity was demonstrated for a 160x120 pixel IR sensor array. Proposed architecture is also applicable to a variety of sensing applications, such as parallel biosensing and atomic force microscopy, for improved displacement measurements and enhanced sensitivity.

  10. SVX4: A New Deep-Submicron Readout IC for the Tevatron Collider at Fermilab

    SciTech Connect

    Krieger, B.; Alfonsi, S.; Bacchetta, N.; Centro, S.; Christofek, L.; Garcia-Sciveres, M.; Haber, C.; Hanagaki, K.; Hoff, J.; Johnson, M.; vonderLippe, H.; Lujan, P.; Mandelli, E.; Meng, G.; Nomerotski, A.; Pellet, D.; Rapidis, P.; Utes, M.; Walder, J.-P.; Weber, M.; Wester, W.; /LBL, Berkeley /Padua U. /INFN, Padua /Kansas U. /Fermilab /UC, Davis

    2003-10-01

    SVX4 is the new silicon strip readout IC designed to meet the increased radiation tolerance requirements for Run IIb at the Tevatron collider. Devices have been fabricated, tested, and approved for production. The SVX4 design is a technology migration of the SVX3D design currently in use by CDF. Whereas SVX3D was fabricated in a 0.8 {micro}m radiation-hard process, SVX4 was fabricated in a standard 0.25 {micro}m mixed-signal CMOS technology using the ''radiation tolerant by design'' transistor topologies devised by the RD-49 collaboration. The specific cell layouts include digital cells developed by the ATLAS Pixel group, and full-custom analog blocks. Unlike its predecessors, the new design also includes the necessary features required for generic use by both the CDF and D0 experiments at Fermilab. Performance of the IC includes >20 MRad total dose tolerance, and {approx}2000 e-rms equivalent input noise charge with 40 pF input capacitance, when sampled at 132 ns period with an 80 ns preamp risetime. At the nominal digitize/readout rate of 106/53 MHz, the 9 mm x 6.3 mm die dissipates {approx}2 mW/channel average at 2.5 V. A review of typical operation, details of the design conversion process, and performance measurements are covered.

  11. Response of a hybrid pixel detector (MEDIPIX3) to different radiation sources for medical applications

    SciTech Connect

    Chumacero, E. Miguel; De Celis Alonso, B.; Martínez Hernández, M. I.; Vargas, G.; Moreno Barbosa, E.; Moreno Barbosa, F.

    2014-11-07

    The development in semiconductor CMOS technology has enabled the creation of sensitive detectors for a wide range of ionizing radiation. These devices are suitable for photon counting and can be used in imaging and tomography X-ray diagnostics. The Medipix[1] radiation detection system is a hybrid silicon pixel chip developed for particle tracking applications in High Energy Physics. Its exceptional features (high spatial and energy resolution, embedded ultra fast readout, different operation modes, etc.) make the Medipix an attractive device for applications in medical imaging. In this work the energy characterization of a third-generation Medipix chip (Medipix3) coupled to a silicon sensor is presented. We used different radiation sources (strontium 90, iron 55 and americium 241) to obtain the response curve of the hybrid detector as a function of energy. We also studied the contrast of the Medipix as a measure of pixel noise. Finally we studied the response to fluorescence X rays from different target materials (In, Pd and Cd) for the two data acquisition modes of the chip; single pixel mode and charge summing mode.

  12. Response of a hybrid pixel detector (MEDIPIX3) to different radiation sources for medical applications

    NASA Astrophysics Data System (ADS)

    Chumacero, E. Miguel; De Celis Alonso, B.; Martínez Hernández, M. I.; Vargas, G.; Moreno Barbosa, F.; Moreno Barbosa, E.

    2014-11-01

    The development in semiconductor CMOS technology has enabled the creation of sensitive detectors for a wide range of ionizing radiation. These devices are suitable for photon counting and can be used in imaging and tomography X-ray diagnostics. The Medipix[1] radiation detection system is a hybrid silicon pixel chip developed for particle tracking applications in High Energy Physics. Its exceptional features (high spatial and energy resolution, embedded ultra fast readout, different operation modes, etc.) make the Medipix an attractive device for applications in medical imaging. In this work the energy characterization of a third-generation Medipix chip (Medipix3) coupled to a silicon sensor is presented. We used different radiation sources (strontium 90, iron 55 and americium 241) to obtain the response curve of the hybrid detector as a function of energy. We also studied the contrast of the Medipix as a measure of pixel noise. Finally we studied the response to fluorescence X rays from different target materials (In, Pd and Cd) for the two data acquisition modes of the chip; single pixel mode and charge summing mode.

  13. XPAD X-ray hybrid pixel detector for charge density quality diffracted intensities on laboratory equipment.

    PubMed

    Wenger, Emmanuel; Dahaoui, Slimane; Alle, Paul; Parois, Pascal; Palin, Cyril; Lecomte, Claude; Schaniel, Dominik

    2014-10-01

    The new generation of X-ray detectors, the hybrid pixel area detectors or `pixel detectors', is based on direct detection and single-photon counting processes. A large linearity range, high dynamic and extremely low noise leading to an unprecedented high signal-to-noise ratio, fast readout time (high frame rates) and an electronic shutter are among their intrinsic characteristics which render them very attractive. First used on synchrotron beamlines, these detectors are also promising in the laboratory, in particular for pump-probe or quasi-static experiments and accurate electron density measurements, as explained in this paper. An original laboratory diffractometer made from a Nonius Mach3 goniometer equipped with an Incoatec Mo microsource and an XPAD pixel area detector has been developed at the CRM2 laboratory. Mo Kα accurate charge density quality data up to 1.21 Å(-1) resolution have been collected on a sodium nitroprusside crystal using this home-made diffractometer. Data quality for charge density analysis based on multipolar modelling are discussed in this paper. Deformation electron densities are compared to those already published (based on data collected with CCD APEXII and CAD4 diffractometers). PMID:25274511

  14. Test results on the silicon pixel detector for the TTF-FEL beam trajectory monitor

    NASA Astrophysics Data System (ADS)

    Hillert, S.; Ischebeck, R.; Müller, U. C.; Roth, S.; Hansen, K.; Holl, P.; Karstensen, S.; Kemmer, J.; Klanner, R.; Lechner, P.; Leenen, M.; Ng, J. S. T.; Schmüser, P.; Strüder, L.

    2001-02-01

    Test measurements on the silicon pixel detector for the beam trajectory monitor at the free-electron laser of the TESLA test facility are presented. To determine the electronic noise of the detector and the read-out electronics and to calibrate the signal amplitude of different pixels, the 6 keV photons of the manganese K α/K β line are used. Two different methods determine the spatial accuracy of the detector: in one setup a laser beam is focused to a straight line and moves across the pixel structure. In the other, the detector is scanned using a low-intensity electron beam of an electron microscope. Both methods show that the symmetry axis of the detector defines a straight line within 0.4 μm. The sensitivity of the detector to low-energy X-rays is measured using a vacuum ultraviolet beam at the synchrotron light source HASYLAB. Additionally, the electron microscope is used to study the radiation hardness of the detector.

  15. The detection of minimum ionizing particles with scintillating fibers using multi-pixel hybrid photodiodes

    SciTech Connect

    Datema, C.P.; Meng, L.J.; Ramsden, D.

    1998-06-01

    Recent measurements of the performance of the newly available multi-pixel Hybrid Photodiode (M-HPD) have demonstrated their particular value in the detection of very low light-level signals in the visible region. The single and multiple photo-electron response characteristics of these devices is unmatched by any other room-temperature device. This characteristic, coupled with their speed of response and the availability of an internally-generated trigger signal when one or more of the pixels detect an event, makes them particularly interesting as possible photo-detectors for fast plastic scintillators and, in particular, as detectors for reading out scintillating fibers. The results of tests made when Minimum Ionizing Particles (MIPs) pass through single and multi-clad plastic scintillating fibers have confirmed the usefulness of these devices in particle-tracking applications. The technique used to read-out 61 channels of data is described along with a way to view as many as 2,000 fibers with just two 61-pixel M-HPDs.

  16. Position algorithm for monolithic scintillation crystals based on charge projection readout

    NASA Astrophysics Data System (ADS)

    Pani, R.; Bettiol, M.; Preziosi, E.; Cinti, M. N.; Borrazzo, C.; Pellegrini, R.; Di Castro, E.; Fabbri, A.

    2016-01-01

    Nuclear medicine imaging devices commonly use multi-element photo detection systems, composed of an array of N × N elements, each one providing an individual signal. Many strategies have been developed to reduce the number of readout channels, one of the main approaches is the Rows and Columns (R/C) projection logic. In this paper we proposed a modified version of Raised To the Power (RTP) algorithm adapted to R/C logic. In order to validate its efficiency a linear scanning irradiation on two 49× 49 mm2 LaBr3:Ce (0.5%) crystals with different thickness (4 mm and 10 mm) was carried out. Imaging performance analysis was made in terms of position linearity, Field-of-View (FoV) enlargement and spatial resolution. Imaging results from Anger Logic, RTP algorithm based on single element readout and RTP algorithm based on R/C readout were compared. A notable advantage of using RTP algorithms instead of Anger Logic was found: the FoV widens from about 30% to more than 70% of the detector area whereas the spatial resolution is highly improved, especially for off-center interactions, both for 4 mm-thick and 10 mm-thick crystals. Furthermore, imaging performance with the R/C readout is just slightly different from the single element one (FoV reduction less than 7% and SR worsening less than 10%). The R/C adapted RTP algorithm opens doors to high imaging performance with a substantial reduction of complexity and cost in the readout electronics.

  17. 4K×4K format 10μm pixel pitch H4RG-10 hybrid CMOS silicon visible focal plane array for space astronomy

    NASA Astrophysics Data System (ADS)

    Bai, Yibin; Tennant, William; Anglin, Selmer; Wong, Andre; Farris, Mark; Xu, Min; Holland, Eric; Cooper, Donald; Hosack, Joseph; Ho, Kenneth; Sprafke, Thomas; Kopp, Robert; Starr, Brian; Blank, Richard; Beletic, James W.; Luppino, Gerard A.

    2012-07-01

    Teledyne’s silicon hybrid CMOS focal plane array technology has matured into a viable, high performance and high- TRL alternative to scientific CCD sensors for space-based applications in the UV-visible-NIR wavelengths. This paper presents the latest results from Teledyne’s low noise silicon hybrid CMOS visible focal place array produced in 4K×4K format with 10 μm pixel pitch. The H4RG-10 readout circuit retains all of the CMOS functionality (windowing, guide mode, reference pixels) and heritage of its highly successful predecessor (H2RG) developed for JWST, with additional features for improved performance. Combined with a silicon PIN detector layer, this technology is termed HyViSI™ (Hybrid Visible Silicon Imager). H4RG-10 HyViSI™ arrays achieve high pixel interconnectivity (<99.99%), low readout noise (<10 e- rms single CDS), low dark current (<0.5 e-/pixel/s at 193K), high quantum efficiency (<90% broadband), and large dynamic range (<13 bits). Pixel crosstalk and interpixel capacitance (IPC) have been predicted using detailed models of the hybrid structure and these predictions have been confirmed by measurements with Fe-55 Xray events and the single pixel reset technique. For a 100-micron thick detector, IPC of less than 3% and total pixel crosstalk of less than 7% have been achieved for the HyViSI™ H4RG-10. The H4RG-10 array is mounted on a lightweight silicon carbide (SiC) package and has been qualified to Technology Readiness Level 6 (TRL-6). As part of space qualification, the HyViSI™ H4RG-10 array passed radiation testing for low earth orbit (LEO) environment.

  18. Automatic Extraction of Closed Pixel Clusters for Target Cueing in Hyperspectral Images

    SciTech Connect

    Paglieroni, D W; Perkins, D E

    2001-06-05

    Traditional algorithms for automatic target cueing (ATC) in hyperspectral images, such as the RX algorithm, treat anomaly detection as a simple hypothesis testing problem. Each decision threshold gives rise to a different set of anomalous pixels. The clustered Rx algorithm generates target cues by grouping anomalous pixels into spatial clusters, and retaining only those clusters that satisfy target specific spatial constraints. It produces one set of target cues for each of several decision thresholds, and conservatively requires {Omicron}(K{sup 2}) operations per pixel, where K is the number of spectral bands (which varies from hundreds to thousands in hyperspectral images). A novel ATC algorithm, known as ''Pixel Cluster Cueing'' (PCC), is discussed. PCC groups pixels into clusters based on spectral similarity and spatial proximity, and then selects only those clusters that satisfy target-specific spatial constraints as target cues. PCC requires only {Omicron}(K) operations per pixel, and it produces only one set of target cues because it is not an anomaly detection algorithm, i.e., it does not use a decision threshold to classify individual pixels as anomalies. PCC is compared both computationally and statistically to the RX algorithm.

  19. Demosaiced pixel super-resolution for multiplexed holographic color imaging.

    PubMed

    Wu, Yichen; Zhang, Yibo; Luo, Wei; Ozcan, Aydogan

    2016-01-01

    To synthesize a holographic color image, one can sequentially take three holograms at different wavelengths, e.g., at red (R), green (G) and blue (B) parts of the spectrum, and digitally merge them. To speed up the imaging process by a factor of three, a Bayer color sensor-chip can also be used to demultiplex three wavelengths that simultaneously illuminate the sample and digitally retrieve individual set of holograms using the known transmission spectra of the Bayer color filters. However, because the pixels of different channels (R, G, B) on a Bayer color sensor are not at the same physical location, conventional demosaicing techniques generate color artifacts in holographic imaging using simultaneous multi-wavelength illumination. Here we demonstrate that pixel super-resolution can be merged into the color de-multiplexing process to significantly suppress the artifacts in wavelength-multiplexed holographic color imaging. This new approach, termed Demosaiced Pixel Super-Resolution (D-PSR), generates color images that are similar in performance to sequential illumination at three wavelengths, and therefore improves the speed of holographic color imaging by 3-fold. D-PSR method is broadly applicable to holographic microscopy applications, where high-resolution imaging and multi-wavelength illumination are desired. PMID:27353242

  20. Demosaiced pixel super-resolution for multiplexed holographic color imaging

    PubMed Central

    Wu, Yichen; Zhang, Yibo; Luo, Wei; Ozcan, Aydogan

    2016-01-01

    To synthesize a holographic color image, one can sequentially take three holograms at different wavelengths, e.g., at red (R), green (G) and blue (B) parts of the spectrum, and digitally merge them. To speed up the imaging process by a factor of three, a Bayer color sensor-chip can also be used to demultiplex three wavelengths that simultaneously illuminate the sample and digitally retrieve individual set of holograms using the known transmission spectra of the Bayer color filters. However, because the pixels of different channels (R, G, B) on a Bayer color sensor are not at the same physical location, conventional demosaicing techniques generate color artifacts in holographic imaging using simultaneous multi-wavelength illumination. Here we demonstrate that pixel super-resolution can be merged into the color de-multiplexing process to significantly suppress the artifacts in wavelength-multiplexed holographic color imaging. This new approach, termed Demosaiced Pixel Super-Resolution (D-PSR), generates color images that are similar in performance to sequential illumination at three wavelengths, and therefore improves the speed of holographic color imaging by 3-fold. D-PSR method is broadly applicable to holographic microscopy applications, where high-resolution imaging and multi-wavelength illumination are desired. PMID:27353242

  1. Demosaiced pixel super-resolution for multiplexed holographic color imaging

    NASA Astrophysics Data System (ADS)

    Wu, Yichen; Zhang, Yibo; Luo, Wei; Ozcan, Aydogan

    2016-06-01

    To synthesize a holographic color image, one can sequentially take three holograms at different wavelengths, e.g., at red (R), green (G) and blue (B) parts of the spectrum, and digitally merge them. To speed up the imaging process by a factor of three, a Bayer color sensor-chip can also be used to demultiplex three wavelengths that simultaneously illuminate the sample and digitally retrieve individual set of holograms using the known transmission spectra of the Bayer color filters. However, because the pixels of different channels (R, G, B) on a Bayer color sensor are not at the same physical location, conventional demosaicing techniques generate color artifacts in holographic imaging using simultaneous multi-wavelength illumination. Here we demonstrate that pixel super-resolution can be merged into the color de-multiplexing process to significantly suppress the artifacts in wavelength-multiplexed holographic color imaging. This new approach, termed Demosaiced Pixel Super-Resolution (D-PSR), generates color images that are similar in performance to sequential illumination at three wavelengths, and therefore improves the speed of holographic color imaging by 3-fold. D-PSR method is broadly applicable to holographic microscopy applications, where high-resolution imaging and multi-wavelength illumination are desired.

  2. Demosaiced pixel super-resolution for multiplexed holographic color imaging.

    PubMed

    Wu, Yichen; Zhang, Yibo; Luo, Wei; Ozcan, Aydogan

    2016-06-29

    To synthesize a holographic color image, one can sequentially take three holograms at different wavelengths, e.g., at red (R), green (G) and blue (B) parts of the spectrum, and digitally merge them. To speed up the imaging process by a factor of three, a Bayer color sensor-chip can also be used to demultiplex three wavelengths that simultaneously illuminate the sample and digitally retrieve individual set of holograms using the known transmission spectra of the Bayer color filters. However, because the pixels of different channels (R, G, B) on a Bayer color sensor are not at the same physical location, conventional demosaicing techniques generate color artifacts in holographic imaging using simultaneous multi-wavelength illumination. Here we demonstrate that pixel super-resolution can be merged into the color de-multiplexing process to significantly suppress the artifacts in wavelength-multiplexed holographic color imaging. This new approach, termed Demosaiced Pixel Super-Resolution (D-PSR), generates color images that are similar in performance to sequential illumination at three wavelengths, and therefore improves the speed of holographic color imaging by 3-fold. D-PSR method is broadly applicable to holographic microscopy applications, where high-resolution imaging and multi-wavelength illumination are desired.

  3. Spatial clustering of pixels of a multispectral image

    SciTech Connect

    Conger, James Lynn

    2014-08-19

    A method and system for clustering the pixels of a multispectral image is provided. A clustering system computes a maximum spectral similarity score for each pixel that indicates the similarity between that pixel and the most similar neighboring. To determine the maximum similarity score for a pixel, the clustering system generates a similarity score between that pixel and each of its neighboring pixels and then selects the similarity score that represents the highest similarity as the maximum similarity score. The clustering system may apply a filtering criterion based on the maximum similarity score so that pixels with similarity scores below a minimum threshold are not clustered. The clustering system changes the current pixel values of the pixels in a cluster based on an averaging of the original pixel values of the pixels in the cluster.

  4. A reconfigurable image tube using an external electronic image readout

    NASA Astrophysics Data System (ADS)

    Lapington, J. S.; Howorth, J. R.; Milnes, J. S.

    2005-08-01

    We have designed and built a sealed tube microchannel plate (MCP) intensifier for optical/NUV photon counting applications suitable for 18, 25 and 40 mm diameter formats. The intensifier uses an electronic image readout to provide direct conversion of event position into electronic signals, without the drawbacks associated with phosphor screens and subsequent optical detection. The Image Charge technique is used to remove the readout from the intensifier vacuum enclosure, obviating the requirement for additional electrical vacuum feedthroughs and for the readout pattern to be UHV compatible. The charge signal from an MCP intensifier is capacitively coupled via a thin dielectric vacuum window to the electronic image readout, which is external to the sealed intensifier tube. The readout pattern is a separate item held in proximity to the dielectric window and can be easily detached, making the system easily reconfigurable. Since the readout pattern detects induced charge and is external to the tube, it can be constructed as a multilayer, eliminating the requirement for narrow insulator gaps and allowing it to be constructed using standard PCB manufacturing tolerances. We describe two readout patterns, the tetra wedge anode (TWA), an optimized 4 electrode device similar to the wedge and strip anode (WSA) but with a factor 2 improvement in resolution, and an 8 channel high speed 50 ohm device, both manufactured as multilayer PCBs. We present results of the detector imaging performance, image resolution, linearity and stability, and discuss the development of an integrated readout and electronics device based on these designs.

  5. Read-out electronics for DC squid magnetic measurements

    DOEpatents

    Ganther, Jr., Kenneth R.; Snapp, Lowell D.

    2002-01-01

    Read-out electronics for DC SQUID sensor systems, the read-out electronics incorporating low Johnson noise radio-frequency flux-locked loop circuitry and digital signal processing algorithms in order to improve upon the prior art by a factor of at least ten, thereby alleviating problems caused by magnetic interference when operating DC SQUID sensor systems in magnetically unshielded environments.

  6. A Dynamic Range Enhanced Readout Technique with a Two-Step TDC for High Speed Linear CMOS Image Sensors

    PubMed Central

    Gao, Zhiyuan; Yang, Congjie; Xu, Jiangtao; Nie, Kaiming

    2015-01-01

    This paper presents a dynamic range (DR) enhanced readout technique with a two-step time-to-digital converter (TDC) for high speed linear CMOS image sensors. A multi-capacitor and self-regulated capacitive trans-impedance amplifier (CTIA) structure is employed to extend the dynamic range. The gain of the CTIA is auto adjusted by switching different capacitors to the integration node asynchronously according to the output voltage. A column-parallel ADC based on a two-step TDC is utilized to improve the conversion rate. The conversion is divided into coarse phase and fine phase. An error calibration scheme is also proposed to correct quantization errors caused by propagation delay skew within −Tclk~+Tclk. A linear CMOS image sensor pixel array is designed in the 0.13 μm CMOS process to verify this DR-enhanced high speed readout technique. The post simulation results indicate that the dynamic range of readout circuit is 99.02 dB and the ADC achieves 60.22 dB SNDR and 9.71 bit ENOB at a conversion rate of 2 MS/s after calibration, with 14.04 dB and 2.4 bit improvement, compared with SNDR and ENOB of that without calibration. PMID:26561819

  7. A buffer direct injection and direct injection readout circuit with mode selection design for infrared focal plane arrays

    NASA Astrophysics Data System (ADS)

    Sun, Tai-Ping; Lu, Yi-Chuan; Kang, Lai-Li; Shieh, Hsiu-Li

    2014-03-01

    This paper proposes a solution to the excessive area penalty associated with traditional buffer direct injection (BDI) for single pixel. The proposed solution reduces the area and power consumption of BDI to combine the direct injection (DI) within a shared architecture, while a dual-mode readout circuit expands the functionality and performance of the array readout circuit of infrared sensor. An experimental array of 10 × 8 readout circuits was fabricated using TSMC 2P4M 0.35 μm 5 V technology. Measurements were obtained using a main clock with a frequency of 3 MHz and power consumption of 9.94 mW. The minimum input current was 119 pA in BDI and 1.85 pA in DI. The signal swing was 2 V, the root mean square noise voltage was 1.84 mV, and the signal-to-noise ratio was 60 dB. This approach is applicable to mid- and long-band sensors to increase injection efficiency and resolution.

  8. A low noise high readout speed 512×128 ROIC for shortwave InGaAs FPA

    NASA Astrophysics Data System (ADS)

    Huang, SongLei; Huang, Zhangcheng; Chen, Yu; Tang, Hengjing; Fang, Jiaxiong

    2015-03-01

    A low noise high readout speed 512×128 readout Integrated circuit (ROIC) based on capacitance trans-impedance amplifier (CTIA) is designed in this paper. The ROIC is flip-chip bonded with Indium bumps to InGaAs detectors which cutoff wavelength is 1.7μm, as a hybrid structure (InGaAs FPA). The ROIC with 30μm pixel pitch and 50fF integrated capacitance, is fabricated in 0.5μm DPTM CMOS process. The results show that output noise is about 3.0E-4V which equivalent readout noise is 95e-, output voltage swing is better than 2.5V; the dynamic range of InGaAs FPA reaches 69.7dB@2ms, and the power dissipation is about 175mw. The peak detectivity of InGaAs FPA reaches 2E12cmHz1/2w-1 at 300K without TEC cooling.

  9. Studies of Avalanche Photodiodes (APDS) as Readout Devices for Scintillating Fibers for High Energy Gamma-Ray Astronomy Telescopes

    NASA Technical Reports Server (NTRS)

    Vasile, Stefan; Shera, Suzanne; Shamo, Denis

    1998-01-01

    New gamma ray and charged particle telescope designs based on scintillating fiber arrays could provide low cost, high resolution, lightweight, very large area and multi radiation length instrumentation for planned NASA space exploration. The scintillating fibers low visible light output requires readout sensors with single photon detection sensitivity and low noise. The sensitivity of silicon Avalanche Photodiodes (APDS) matches well the spectral output of the scintillating fibers. Moreover, APDs have demonstrated single photon capability. The global aim of our work is to make available to NASA a novel optical detector concept to be used as scintillating fiber readouts and meeting the requirements of the new generations of space-borne gamma ray telescopes. We proposed to evaluate the feasibility of using RMD's small area APDs ((mu)APD) as scintillating fiber readouts and to study possible alternative (mu)APD array configurations for space borne readout scintillating fiber systems, requiring several hundred thousand to one million channels. The evaluation has been conducted in accordance with the task description and technical specifications detailed in the NASA solicitation "Studies of Avalanche Photodiodes (APD as readout devices for scintillating fibers for High Energy Gamma-Ray Astronomy Telescopes" (#8-W-7-ES-13672NAIS) posted on October 23, 1997. The feasibility study we propose builds on recent developments of silicon APD arrays and light concentrators advances at RMD, Inc. and on more than 5 years of expertise in scintillating fiber detectors. In a previous program we carried out the initial research to develop a high resolution, small pixel, solid-state, silicon APD array which exhibited very high sensitivity in the UV-VIS spectrum. This (mu)APD array is operated in Geiger mode and results in high gain (greater than 10(exp 8)), extremely low noise, single photon detection capability, low quiescent power (less than 10 (mu)W/pixel for 30 micrometers sensitive

  10. Pixel Dynamics Analysis of Photospheric Spectral Data

    NASA Astrophysics Data System (ADS)

    Rasca, Anthony P.; Chen, James; Pevtsov, Alexei A.

    2015-04-01

    Recent advances in solar observations have led to higher-resolution surface (photosphere) images that reveal bipolar magnetic features operating near the resolution limit during emerging flux events. Further improvements in resolution are expected to reveal even smaller dynamic features. Such photospheric features provide observable indications of what is happening before, during, and after flux emergence, eruptions in the corona, and other phenomena. Visible changes in photospheric active regions also play a major role in predicting eruptions that are responsible for geomagnetic plasma disturbances. A new method has been developed to extract physical information from photospheric data (e.g., SOLIS Stokes parameters) based on the statistics of pixel-by-pixel variations in spectral (absorption or emission) line quantities such as line profile Doppler shift, width, asymmetry, and flatness. Such properties are determined by the last interaction between detected photons and optically thick photospheric plasmas, and may contain extractable information on local plasma properties at sub-pixel scales. Applying the method to photospheric data with high spectral resolution, our pixel-by-pixel analysis is performed for various regions on the solar disk, ranging from quiet-Sun regions to active regions exhibiting eruptions, characterizing photospheric dynamics using spectral profiles. In particular, the method quantitatively characterizes the time profile of changes in spectral properties in photospheric features and provides improved physical constraints on observed quantities.

  11. Mapping Electrical Crosstalk in Pixelated Sensor Arrays

    NASA Technical Reports Server (NTRS)

    Seshadri, S.; Cole, D. M.; Hancock, B. R.; Smith, R. M.

    2008-01-01

    Electronic coupling effects such as Inter-Pixel Capacitance (IPC) affect the quantitative interpretation of image data from CMOS, hybrid visible and infrared imagers alike. Existing methods of characterizing IPC do not provide a map of the spatial variation of IPC over all pixels. We demonstrate a deterministic method that provides a direct quantitative map of the crosstalk across an imager. The approach requires only the ability to reset single pixels to an arbitrary voltage, different from the rest of the imager. No illumination source is required. Mapping IPC independently for each pixel is also made practical by the greater S/N ratio achievable for an electrical stimulus than for an optical stimulus, which is subject to both Poisson statistics and diffusion effects of photo-generated charge. The data we present illustrates a more complex picture of IPC in Teledyne HgCdTe and HyViSi focal plane arrays than is presently understood, including the presence of a newly discovered, long range IPC in the HyViSi FPA that extends tens of pixels in distance, likely stemming from extended field effects in the fully depleted substrate. The sensitivity of the measurement approach has been shown to be good enough to distinguish spatial structure in IPC of the order of 0.1%.

  12. Design, simulation, fabrication, and preliminary tests of 3D CMS pixel detectors for the super-LHC

    SciTech Connect

    Koybasi, Ozhan; Bortoletto, Daniela; Hansen, Thor-Erik; Kok, Angela; Hansen, Trond Andreas; Lietaer, Nicolas; Jensen, Geir Uri; Summanwar, Anand; Bolla, Gino; Kwan, Simon Wing Lok; /Fermilab

    2010-01-01

    The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickness, are under investigation as a potential solution for the closest operation points to the beams, where the radiation fluence is estimated to reach 10{sup 16} n{sub eq}/cm{sup 2}. Two different 3D detector designs with CMS pixel readout electronics are being developed and evaluated for their advantages and drawbacks. The fabrication of full-3D active edge CMS pixel devices with p-type substrate has been successfully completed at SINTEF. In this paper, we study the expected post-irradiation behaviors of these devices with simulations and, after a brief description of their fabrication, we report the first leakage current measurement results as performed on wafer.

  13. Fast readout of carbon nanotube mechanical resonators

    NASA Astrophysics Data System (ADS)

    Meerwaldt, Harold; Singh, Vibhor; Schneider, Ben; Schouten, Raymond; van der Zant, Herre; Steele, Gary

    2013-03-01

    We perform fast readout measurements of carbon nanotube mechanical resonators. Using an electronic mixing scheme, we can detect the amplitude of the mechanical motion with an intermediate frequency (IF) of 46 MHz and a timeconstant of 1 us, up to 5 orders of magnitude faster than before. Previous measurements suffered from a low bandwidth due to the combination of the high resistance of the carbon nanotube and a large stray capacitance. We have increased the bandwidth significantly by using a high-impedance, close-proximity HEMT amplifier. The increased bandwidth should allow us to observe the nanotube's thermal motion and its transient response, approaching the regime of real-time detection of the carbon nanotube's mechanical motion.

  14. Pixels, Blocks of Pixels, and Polygons: Choosing a Spatial Unit for Thematic Accuracy Assessment

    EPA Science Inventory

    Pixels, polygons, and blocks of pixels are all potentially viable spatial assessment units for conducting an accuracy assessment. We develop a statistical population-based framework to examine how the spatial unit chosen affects the outcome of an accuracy assessment. The populati...

  15. Uncooled infrared detectors toward smaller pixel pitch with newly proposed pixel structure

    NASA Astrophysics Data System (ADS)

    Tohyama, Shigeru; Sasaki, Tokuhito; Endoh, Tsutomu; Sano, Masahiko; Katoh, Kouji; Kurashina, Seiji; Miyoshi, Masaru; Yamazaki, Takao; Ueno, Munetaka; Katayama, Haruyoshi; Imai, Tadashi

    2011-06-01

    Since authors have successfully demonstrated uncooled infrared (IR) focal plane array (FPA) with 23.5 um pixel pitch, it has been widely utilized for commercial applications such as thermography, security camera and so on. One of the key issues for uncooled IR detector technology is to shrink the pixel size. The smaller the pixel pitch, the more the IR camera products become compact and the less cost. This paper proposes a new pixel structure with a diaphragm and beams which are placed in different level, to realize an uncooled IRFPA with smaller pixel pitch )<=17 μm). The upper level consists of diaphragm with VOx bolometer and IR absorber layers, while the lower level consists of the two beams, which are designed to place on the adjacent pixels. The test devices of this pixel design with 12 um, 15 um and 17 um pitch have been fabricated on the Si ROIC of QVGA (320 × 240) with 23.5 um pitch. Their performances reveal nearly equal to the IRFPA with 23.5 um pitch. For example, noise equivalent temperature difference (NETD) of 12 μm pixel is 63.1 mK with thermal time constant of 14.5 msec. In addition, this new structure is expected to be more effective for the existing IRFPA with 23.5 um pitch in order to improve the IR responsivity.

  16. Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

    NASA Astrophysics Data System (ADS)

    Miller, Timothy M.; Costen, Nick; Allen, Christine

    2008-04-01

    In our effort to develop large format kilo-pixel arrays of transition edge sensors, we are working toward demonstrating electrical connectivity of a hybridized 32×40 element detector to a NIST multiplexer. The geometry of large-scale arrays that attempt to maintain a high filling factor does not allow for typical fan-out wiring, thus the detector array is hybridized directly to the readout multiplexer. The two parts are bonded together with 10 micron tall indium bumps, which complete the electrical path and also provide mechanical strength. The indium hybridization was developed and performed at the Goddard Space Flight Center and has been shown to withstand tensile loading up to 0.26 gram-force per indium bump. A cavity is deep etched behind each pixel prior to bonding, leaving only 30 micron support walls, which maintains a high filling fraction. Electrical continuity has been shown through the indium path in room temperature measurements. We report on the fabrication process used to hybridize the parts and the subsequent electrical performance.

  17. Active Pixel Sensors: Are CCD's Dinosaurs?

    NASA Technical Reports Server (NTRS)

    Fossum, Eric R.

    1993-01-01

    Charge-coupled devices (CCD's) are presently the technology of choice for most imaging applications. In the 23 years since their invention in 1970, they have evolved to a sophisticated level of performance. However, as with all technologies, we can be certain that they will be supplanted someday. In this paper, the Active Pixel Sensor (APS) technology is explored as a possible successor to the CCD. An active pixel is defined as a detector array technology that has at least one active transistor within the pixel unit cell. The APS eliminates the need for nearly perfect charge transfer -- the Achilles' heel of CCDs. This perfect charge transfer makes CCD's radiation 'soft,' difficult to use under low light conditions, difficult to manufacture in large array sizes, difficult to integrate with on-chip electronics, difficult to use at low temperatures, difficult to use at high frame rates, and difficult to manufacture in non-silicon materials that extend wavelength response.

  18. Resistive graphene humidity sensors with rapid and direct electrical readout

    NASA Astrophysics Data System (ADS)

    Smith, Anderson D.; Elgammal, Karim; Niklaus, Frank; Delin, Anna; Fischer, Andreas C.; Vaziri, Sam; Forsberg, Fredrik; Råsander, Mikael; Hugosson, Håkan; Bergqvist, Lars; Schröder, Stephan; Kataria, Satender; Östling, Mikael; Lemme, Max C.

    2015-11-01

    We demonstrate humidity sensing using a change of the electrical resistance of single-layer chemical vapor deposited (CVD) graphene that is placed on top of a SiO2 layer on a Si wafer. To investigate the selectivity of the sensor towards the most common constituents in air, its signal response was characterized individually for water vapor (H2O), nitrogen (N2), oxygen (O2), and argon (Ar). In order to assess the humidity sensing effect for a range from 1% relative humidity (RH) to 96% RH, the devices were characterized both in a vacuum chamber and in a humidity chamber at atmospheric pressure. The measured response and recovery times of the graphene humidity sensors are on the order of several hundred milliseconds. Density functional theory simulations are employed to further investigate the sensitivity of the graphene devices towards water vapor. The interaction between the electrostatic dipole moment of the water and the impurity bands in the SiO2 substrate leads to electrostatic doping of the graphene layer. The proposed graphene sensor provides rapid response direct electrical readout and is compatible with back end of the line (BEOL) integration on top of CMOS-based integrated circuits.We demonstrate humidity sensing using a change of the electrical resistance of single-layer chemical vapor deposited (CVD) graphene that is placed on top of a SiO2 layer on a Si wafer. To investigate the selectivity of the sensor towards the most common constituents in air, its signal response was characterized individually for water vapor (H2O), nitrogen (N2), oxygen (O2), and argon (Ar). In order to assess the humidity sensing effect for a range from 1% relative humidity (RH) to 96% RH, the devices were characterized both in a vacuum chamber and in a humidity chamber at atmospheric pressure. The measured response and recovery times of the graphene humidity sensors are on the order of several hundred milliseconds. Density functional theory simulations are employed to further

  19. Gafchromic EBT3 film dosimetry in electron beams - energy dependence and improved film read-out.

    PubMed

    Sipilä, Petri; Ojala, Jarkko; Kaijaluoto, Sampsa; Jokelainen, Ilkka; Kosunen, Antti

    2016-01-01

    For megavoltage photon radiation, the fundamental dosimetry characteristics of Gafchromic EBT3 film were determined in 60Co gamma ray beam with addition of experimental and Monte Carlo (MC)-simulated energy dependence of the film for 6 MV photon beam and 6 MeV, 9 MeV, 12 MeV, and 16 MeV electron beams in water phantom. For the film read-out, two phase correction of scanner sensitivity was applied: a matrix correction for scanning area and dose-dependent correction by iterative procedure. With these corrections, the uniformity of response can be improved to be within ± 50 pixel values (PVs). To improve the read-out accuracy, a procedure with flipped film orientations was established. With the method, scanner uniformity can be improved further and dust particles, scratches and/or dirt on scan-ner glass can be detected and eliminated. Responses from red and green channels were averaged for read-out, which decreased the effect of noise present in values from separate channels. Since the signal level with the blue channel is considerably lower than with other channels, the signal variation due to different perturbation effects increases the noise level so that the blue channel is not recommended to be used for dose determination. However, the blue channel can be used for the detection of emulsion thickness variations for film quality evaluations with unexposed films. With electron beams ranging from 6 MeV to 16 MeV and at reference measurement conditions in water, the energy dependence of the EBT3 film is uniform within 0.5%, with uncertainties close to 1.6% (k = 2). Including 6 MV photon beam and the electron beams mentioned, the energy dependence is within 1.1%. No notable differences were found between the experimental and MC-simulated responses, indicating negligible change in intrinsic energy dependence of the EBT3 film for 6 MV photon beam and 6 MeV-16 MeV electron beams. Based on the dosimetric characteristics of the EBT3 film, the read-out procedure established

  20. Dependence of the appearance-based perception of criminality, suggestibility, and trustworthiness on the level of pixelation of facial images.

    PubMed

    Nurmoja, Merle; Eamets, Triin; Härma, Hanne-Loore; Bachmann, Talis

    2012-10-01

    While the dependence of face identification on the level of pixelation-transform of the images of faces has been well studied, similar research on face-based trait perception is underdeveloped. Because depiction formats used for hiding individual identity in visual media and evidential material recorded by surveillance cameras often consist of pixelized images, knowing the effects of pixelation on person perception has practical relevance. Here, the results of two experiments are presented showing the effect of facial image pixelation on the perception of criminality, trustworthiness, and suggestibility. It appears that individuals (N = 46, M age = 21.5 yr., SD = 3.1 for criminality ratings; N = 94, M age = 27.4 yr., SD = 10.1 for other ratings) have the ability to discriminate between facial cues ndicative of these perceived traits from the coarse level of image pixelation (10-12 pixels per face horizontally) and that the discriminability increases with a decrease in the coarseness of pixelation. Perceived criminality and trustworthiness appear to be better carried by the pixelized images than perceived suggestibility.