Sample records for integrated surface micromachining

  1. A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (1 1 1) Si for MOEMS

    NASA Astrophysics Data System (ADS)

    Wu, Mingching; Fang, Weileun

    2006-02-01

    This work attempts to integrate poly-Si thin film and single-crystal-silicon (SCS) structures in a monolithic process. The process integrated multi-depth DRIE (deep reactive ion etching), trench-refilled molding, a two poly-Si MUMPs process and (1 1 1) Si bulk micromachining to accomplish multi-thickness and multi-depth structures for superior micro-optical devices. In application, a SCS scanning mirror driven by self-aligned vertical comb-drive actuators was demonstrated. The stiffness of the mirror was significantly increased by thick SCS structures. The thin poly-Si film served as flexible torsional springs and electrical routings. The depth difference of the vertical comb electrodes was tuned by DRIE to increase the devices' stroke. Finally, a large moving space was available after the bulk Si etching. In summary, the present fabrication process, named (1 1 1) MOSBE (molded surface-micromachining and bulk etching release on (1 1 1) Si substrate), can further integrate with the MUMPs devices to establish a more powerful platform.

  2. MEMS: A new approach to micro-optics

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Sniegowski, J.J.

    1997-12-31

    MicroElectroMechanical Systems (MEMS) and their fabrication technologies provide great opportunities for application to micro-optical systems (MOEMS). Implementing MOEMS technology ranges from simple, passive components to complicated, active systems. Here, an overview of polysilicon surface micromachining MEMS combined with optics is presented. Recent advancements to the technology, which may enhance its appeal for micro-optics applications are emphasized. Of all the MEMS fabrication technologies, polysilicon surface micromachining technology has the greatest basis in and leverages the most the infrastructure for silicon integrated circuit fabrication. In that respect, it provides the potential for very large volume, inexpensive production of MOEMS. This paper highlightsmore » polysilicon surface micromachining technology in regards to its capability to provide both passive and active mechanical elements with quality optical elements.« less

  3. Method of drying passivated micromachines by dewetting from a liquid-based process

    DOEpatents

    Houston, Michael R.; Howe, Roger T.; Maboudian, Roya; Srinivasan, Uthara

    2000-01-01

    A method of fabricating a micromachine includes the step of constructing a low surface energy film on the micromachine. The micromachine is then rinsed with a rinse liquid that has a high surface energy, relative to the low surface energy film, to produce a contact angle of greater than 90.degree. between the low surface energy film and the rinse liquid. This relatively large contact angle causes any rinse liquid on the micromachine to be displaced from the micromachine when the micromachine is removed from the rinse liquid. In other words, the micromachine is dried by dewetting from a liquid-based process. Thus, a separate evaporative drying step is not required, as the micromachine is removed from the liquid-based process in a dry state. The relatively large contact angle also operates to prevent attractive capillary forces between micromachine components, thereby preventing contact and adhesion between adjacent microstructure surfaces. The low surface energy film may be constructed with a fluorinated self-assembled monolayer film. The processing of the invention avoids the use of environmentally harmful, health-hazardous chemicals.

  4. Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes

    PubMed Central

    Schiavone, Giuseppe; Murray, Jeremy; Perry, Richard; Mount, Andrew R.; Desmulliez, Marc P. Y.; Walton, Anthony J.

    2017-01-01

    This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used, respectively, as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS. PMID:28772683

  5. Micro-machined resonator

    DOEpatents

    Godshall, N.A.; Koehler, D.R.; Liang, A.Y.; Smith, B.K.

    1993-03-30

    A micro-machined resonator, typically quartz, with upper and lower micro-machinable support members, or covers, having etched wells which may be lined with conductive electrode material, between the support members is a quartz resonator having an energy trapping quartz mesa capacitively coupled to the electrode through a diaphragm; the quartz resonator is supported by either micro-machined cantilever springs or by thin layers extending over the surfaces of the support. If the diaphragm is rigid, clock applications are available, and if the diaphragm is resilient, then transducer applications can be achieved. Either the thin support layers or the conductive electrode material can be integral with the diaphragm. In any event, the covers are bonded to form a hermetic seal and the interior volume may be filled with a gas or may be evacuated. In addition, one or both of the covers may include oscillator and interface circuitry for the resonator.

  6. Micro-machined resonator

    DOEpatents

    Godshall, Ned A.; Koehler, Dale R.; Liang, Alan Y.; Smith, Bradley K.

    1993-01-01

    A micro-machined resonator, typically quartz, with upper and lower micro-machinable support members, or covers, having etched wells which may be lined with conductive electrode material, between the support members is a quartz resonator having an energy trapping quartz mesa capacitively coupled to the electrode through a diaphragm; the quartz resonator is supported by either micro-machined cantilever springs or by thin layers extending over the surfaces of the support. If the diaphragm is rigid, clock applications are available, and if the diaphragm is resilient, then transducer applications can be achieved. Either the thin support layers or the conductive electrode material can be integral with the diaphragm. In any event, the covers are bonded to form a hermetic seal and the interior volume may be filled with a gas or may be evacuated. In addition, one or both of the covers may include oscillator and interface circuitry for the resonator.

  7. Micromachined pressure sensors: Review and recent developments

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Eaton, W.P.; Smith, J.H.

    1997-03-01

    Since the discovery of piezoresistivity in silicon in the mid 1950s, silicon-based pressure sensors have been widely produced. Micromachining technology has greatly benefited from the success of the integrated circuits industry, burrowing materials, processes, and toolsets. Because of this, microelectromechanical systems (MEMS) are now poised to capture large segments of existing sensor markets and to catalyze the development of new markets. Given the emerging importance of MEMS, it is instructive to review the history of micromachined pressure sensors, and to examine new developments in the field. Pressure sensors will be the focus of this paper, starting from metal diaphragm sensorsmore » with bonded silicon strain gauges, and moving to present developments of surface-micromachined, optical, resonant, and smart pressure sensors. Considerations for diaphragm design will be discussed in detail, as well as additional considerations for capacitive and piezoresistive devices.« less

  8. Microfabricated ion trap array

    DOEpatents

    Blain, Matthew G [Albuquerque, NM; Fleming, James G [Albuquerque, NM

    2006-12-26

    A microfabricated ion trap array, comprising a plurality of ion traps having an inner radius of order one micron, can be fabricated using surface micromachining techniques and materials known to the integrated circuits manufacturing and microelectromechanical systems industries. Micromachining methods enable batch fabrication, reduced manufacturing costs, dimensional and positional precision, and monolithic integration of massive arrays of ion traps with microscale ion generation and detection devices. Massive arraying enables the microscale ion traps to retain the resolution, sensitivity, and mass range advantages necessary for high chemical selectivity. The reduced electrode voltage enables integration of the microfabricated ion trap array with on-chip circuit-based rf operation and detection electronics (i.e., cell phone electronics). Therefore, the full performance advantages of the microfabricated ion trap array can be realized in truly field portable, handheld microanalysis systems.

  9. Tool calibration system for micromachining system

    DOEpatents

    Miller, Donald M.

    1979-03-06

    A tool calibration system including a tool calibration fixture and a tool height and offset calibration insert for calibrating the position of a tool bit in a micromachining tool system. The tool calibration fixture comprises a yokelike structure having a triangular head, a cavity in the triangular head, and a port which communicates a side of the triangular head with the cavity. Yoke arms integral with the triangular head extend along each side of a tool bar and a tool head of the micromachining tool system. The yoke arms are secured to the tool bar to place the cavity around a tool bit which may be mounted to the end of the tool head. Three linear variable differential transformer's (LVDT) are adjustably mounted in the triangular head along an X axis, a Y axis, and a Z axis. The calibration insert comprises a main base which can be mounted in the tool head of the micromachining tool system in place of a tool holder and a reference projection extending from a front surface of the main base. Reference surfaces of the calibration insert and a reference surface on a tool bar standard length are used to set the three LVDT's of the calibration fixture to the tool reference position. These positions are transferred permanently to a mastering station. The tool calibration fixture is then used to transfer the tool reference position of the mastering station to the tool bit.

  10. Photolithographic surface micromachining of polydimethylsiloxane (PDMS).

    PubMed

    Chen, Weiqiang; Lam, Raymond H W; Fu, Jianping

    2012-01-21

    A major technical hurdle in microfluidics is the difficulty in achieving high fidelity lithographic patterning on polydimethylsiloxane (PDMS). Here, we report a simple yet highly precise and repeatable PDMS surface micromachining method using direct photolithography followed by reactive ion etching (RIE). Our method to achieve surface patterning of PDMS applied an O(2) plasma treatment to PDMS to activate its surface to overcome the challenge of poor photoresist adhesion on PDMS for photolithography. Our photolithographic PDMS surface micromachining technique is compatible with conventional soft lithography techniques and other silicon-based surface and bulk micromachining methods. To illustrate the general application of our method, we demonstrated fabrication of large microfiltration membranes and free-standing beam structures in PDMS.

  11. Photolithographic surface micromachining of polydimethylsiloxane (PDMS)

    PubMed Central

    Chen, Weiqiang; Lam, Raymond H. W.

    2014-01-01

    A major technical hurdle in microfluidics is the difficulty in achieving high fidelity lithographic patterning on polydimethylsiloxane (PDMS). Here, we report a simple yet highly precise and repeatable PDMS surface micromachining method using direct photolithography followed by reactive ion etching (RIE). Our method to achieve surface patterning of PDMS applied an O2 plasma treatment to PDMS to activate its surface to overcome the challenge of poor photoresist adhesion on PDMS for photolithography. Our photolithographic PDMS surface micromachining technique is compatible with conventional soft lithography techniques and other silicon-based surface and bulk micromachining methods. To illustrate the general application of our method, we demonstrated fabrications of large microfiltration membranes and free-standing beam structures in PDMS. PMID:22089984

  12. Packaging of electro-microfluidic devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

    2003-04-15

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  13. Packaging of electro-microfluidic devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Watson, Robert D.

    2002-01-01

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  14. Wafer scale micromachine assembly method

    DOEpatents

    Christenson, Todd R.

    2001-01-01

    A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

  15. A cochlear implant fabricated using a bulk silicon-surface micromachining process

    NASA Astrophysics Data System (ADS)

    Bell, Tracy Elizabeth

    1999-11-01

    This dissertation presents the design and fabrication of two generations of a silicon microelectrode array for use in a cochlear implant. A cochlear implant is a device that is inserted into the inner ear and uses electrical stimulation to provide sound sensations to the profoundly deaf. The first-generation silicon cochlear implant is a passive device fabricated using silicon microprobe technology developed at the University of Michigan. It contains twenty-two iridium oxide (IrO) stimulating sites that are 250 mum in diameter and spaced at 750 mum intervals. In-vivo recordings were made in guinea pig auditory cortex in response to electrical stimulation with this device, verifying its ability to electrically evoke an auditory response. Auditory thresholds as low as 78 muA were recorded. The second-generation implant is a thirty-two site, four-channel device with on-chip CMOS site-selection circuitry and integrated position sensing. It was fabricated using a novel bulk silicon surface micromachining process which was developed as a part of this dissertation work. While the use of semiconductor technology offers many advantages in fabricating cochlear implants over the methods currently used, it was felt that even further advantages could be gained by developing a new micromachining process which would allow circuitry to be distributed along the full length of the cochlear implant substrate. The new process uses electropolishing of an n+ bulk silicon sacrificial layer to undercut and release n- epitaxial silicon structures from the wafer. An extremely abrupt etch-stop between the n+ and n- silicon is obtained, with no electropolishing taking place in the n-type silicon that is doped lower than 1 x 1017 cm-3 in concentration. Lateral electropolishing rates of up to 50 mum/min were measured using this technique, allowing one millimeter-wide structures to be fully undercut in as little as 10 minutes. The new micromachining process was integrated with a standard p-well CMOS integrated circuit process to fabricate the second-generation active silicon cochlear implants.

  16. Multiple Optical Traps with a Single-Beam Optical Tweezer Utilizing Surface Micromachined Planar Curved Grating

    NASA Astrophysics Data System (ADS)

    Kuo, Ju-Nan; Chen, Kuan-Yu

    2010-11-01

    In this paper, we present a single-beam optical tweezer integrated with a planar curved diffraction grating for microbead manipulation. Various curvatures of the surface micromachined planar curved grating are systematically investigated. The planar curved grating was fabricated using multiuser micro-electro-mechanical-system (MEMS) processes (MUMPs). The angular separation and the number of diffracted orders were determined. Experimental results indicate that the diffraction patterns and curvature of the planar curved grating are closely related. As the curvature of the planar curved grating increases, the vertical diffraction angle increases, resulting in the strip patterns of the planar curved grating. A single-beam optical tweezer integrated with a planar curved diffraction grating was developed. We demonstrate a technique for creating multiple optical traps from a single laser beam using the developed planar curved grating. The strip patterns of the planar curved grating that resulted from diffraction were used to trap one row of polystyrene beads.

  17. Ultrasonic actuation for MEMS dormancy-related stiction reduction

    NASA Astrophysics Data System (ADS)

    Kaajakari, Ville; Kan, Shyi-Herng; Lin, Li-Jen; Lal, Amit; Rodgers, M. Steven

    2000-08-01

    The use of ultrasonic pulses incident on surface micromachines has been shown to reduce dormancy-related failure. We applied ultrasonic pulses from the backside of a silicon substrate carrying SUMMiT processed surface micromachined rotors, used earlier as ultrasonic motors. The amplitude of the pulses was less than what is required to actuate the rotor (sub-threshold actuation). By controlling the ultrasonic pulse exposure time it was found that pulsed samples had smaller actuation voltages as compared to non-pulsed samples after twelve-hour dormancy. This result indicates that the micromachine stiction to surfaces during dormant period can be effectively eliminated, resulting in long-term stability of surface micromachines in critical applications.

  18. Method Of Packaging And Assembling Electro-Microfluidic Devices

    DOEpatents

    Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.

    2004-11-23

    A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.

  19. Design, Fabrication and Levitation Experiments of a Micromachined Electrostatically Suspended Six-Axis Accelerometer

    PubMed Central

    Cui, Feng; Liu, Wu; Chen, Wenyuan; Zhang, Weiping; Wu, Xiaosheng

    2011-01-01

    A micromachined electrostatically suspended six-axis accelerometer, with a square plate as proof mass housed by a top stator and bottom stator, is presented. The device structure and related techniques concerning its operating principles, such as calculation of capacitances and electrostatic forces/moments, detection and levitation control of the proof mass, acceleration measurement, and structural parameters design, are described. Hybrid MEMS manufacturing techniques, including surface micromachining fabrication of thin film electrodes and interconnections, integration fabrication of thick nickel structures about 500 μm using UV-LIGA by successful removal of SU-8 photoresist mold, DRIE of silicon proof mass in thickness of 450 μm, microassembly and solder bonding, were employed to fabricate this prototype microdevice. A levitation experiment system for the fabricated microaccelerometer chip is introduced, and levitation results show that fast initial levitation within 10 ms and stable full suspension of the proof mass have been successfully demonstrated. PMID:22247662

  20. Microfabricated cylindrical ion trap

    DOEpatents

    Blain, Matthew G.

    2005-03-22

    A microscale cylindrical ion trap, having an inner radius of order one micron, can be fabricated using surface micromachining techniques and materials known to the integrated circuits manufacturing and microelectromechanical systems industries. Micromachining methods enable batch fabrication, reduced manufacturing costs, dimensional and positional precision, and monolithic integration of massive arrays of ion traps with microscale ion generation and detection devices. Massive arraying enables the microscale cylindrical ion trap to retain the resolution, sensitivity, and mass range advantages necessary for high chemical selectivity. The microscale CIT has a reduced ion mean free path, allowing operation at higher pressures with less expensive and less bulky vacuum pumping system, and with lower battery power than conventional- and miniature-sized ion traps. The reduced electrode voltage enables integration of the microscale cylindrical ion trap with on-chip integrated circuit-based rf operation and detection electronics (i.e., cell phone electronics). Therefore, the full performance advantages of microscale cylindrical ion traps can be realized in truly field portable, handheld microanalysis systems.

  1. Integrated Multiple Device CMOS-MEMS IMU Systems and RF MEMS Applications

    DTIC Science & Technology

    2002-12-17

    microstructures [7]~[9]. The success of the surface-micromachined electrostatic micromotor in the late 80’s [10] stimulated the industry and government...processed electrostatic synchronous micromotors ,” Sensors Actuators, vol. 20, pp. 48-56, 1989. [11] “ADXL05-monolithic accelerometer with signal

  2. Surface micromachined microengine as the driver for micromechanical gears

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Garcia, E.J.; Sniegowski, J.J.

    1995-05-01

    The transmission of mechanical power is often accomplished through the use of gearing. The recently developed surface micromachined microengine provides us with an actuator which is suitable for driving surface micromachined geared systems. In this paper we will present aspects of the microengine as they relate to the driving of geared mechanisms, issues relating to the design of micro gear mechanisms, and details of a design of a microengine-driven geared shutter mechanism.

  3. Surface-micromachined chain for use in microelectromechanical structures

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Vernon, Sr., George E.

    2001-01-01

    A surface-micromachined chain and a microelectromechanical (MEM) structure incorporating such a chain are disclosed. The surface-micromachined chain can be fabricated in place on a substrate (e.g. a silicon substrate) by depositing and patterning a plurality of alternating layers of a chain-forming material (e.g. polycrystalline silicon) and a sacrificial material (e.g. silicon dioxide or a silicate glass). The sacrificial material is then removed by etching to release the chain for movement. The chain has applications for forming various types of MEM devices which include a microengine (e.g. an electrostatic motor) connected to rotate a drive sprocket, with the surface-micromachined chain beingmore » connected between the drive sprocket and one or more driven sprockets.« less

  4. High definition surface micromachining of LiNbO 3 by ion implantation

    NASA Astrophysics Data System (ADS)

    Chiarini, M.; Bentini, G. G.; Bianconi, M.; De Nicola, P.

    2010-10-01

    High Energy Ion Implantation (HEII) of both medium and light mass ions has been successfully applied for the surface micromachining of single crystal LiNbO 3 (LN) substrates. It has been demonstrated that the ion implantation process generates high differential etch rates in the LN implanted areas, when suitable implantation parameters, such as ion species, fluence and energy, are chosen. In particular, when traditional LN etching solutions are applied to suitably ion implanted regions, etch rates values up to three orders of magnitude higher than the typical etching rates of the virgin material, are registered. Further, the enhancement in the etching rate has been observed on x, y and z-cut single crystalline material, and, due to the physical nature of the implantation process, it is expected that it can be equivalently applied also to substrates with different crystallographic orientations. This technique, associated with standard photolithographic technologies, allows to generate in a fast and accurate way very high aspect ratio relief micrometric structures on LN single crystal surface. In this work a description of the developed technology is reported together with some examples of produced micromachined structures: in particular very precisely defined self sustaining suspended structures, such as beams and membranes, generated on LN substrates, are presented. The developed technology opens the way to actual three dimensional micromachining of LN single crystals substrates and, due to the peculiar properties characterising this material, (pyroelectric, electro-optic, acousto-optic, etc.), it allows the design and the production of complex integrated elements, characterised by micrometric features and suitable for the generation of advanced Micro Electro Optical Systems (MEOS).

  5. Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

    NASA Astrophysics Data System (ADS)

    Laconte, Jean; Flandre, D.; Raskin, Jean-Pierre

    Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution.

  6. Gage for micromachining system

    DOEpatents

    Miller, Donald M.

    1979-02-27

    A gage for measuring the contour of the surface of an element of a micromachining tool system and of a work piece machined by the micromachining tool system. The gage comprises a glass plate containing two electrical contacts and supporting a steel ball resting against the contacts. As the element or workpiece is moved against the steel ball, the very slight contact pressure causes an extremely small movement of the steel ball which breaks the electrical circuit between the two contacts. The contour information is supplied to a dedicated computer controlling the micromachining tool so that the computer knows the contour of the element and the work piece to an accuracy of .+-. 25 nm. The micromachining tool system with X- and omega-axes is used to machine spherical, aspherical, and irregular surfaces with a maximum contour error of 100 nanometers (nm) and surface waviness of no more than 0.8 nm RMS.

  7. Micromachined spinneret

    DOEpatents

    Okandan, Murat; Galambos, Paul

    2007-11-06

    A micromachined spinneret is disclosed which has one or more orifices through which a fiber-forming material can be extruded to form a fiber. Each orifice is surrounded by a concentric annular orifice which allows the fiber to be temporarily or permanently coated with a co-extrudable material. The micromachined spinneret can be formed by a combination of surface and bulk micromachining.

  8. Surface-micromachined and high-aspect ratio electrostatic actuators for aeronautic and space applications: design and lifetime considerations

    NASA Astrophysics Data System (ADS)

    Vescovo, P.; Joseph, E.; Bourbon, G.; Le Moal, P.; Minotti, P.; Hibert, C.; Pont, G.

    2003-09-01

    This paper focuses on recent advances in the field of MEMS-based actuators and distributed microelectromechanical systems (MEMS). IC-processed actuators (e.g. actuators that are machined using integrated circuit batch processes) are expected to open a wide range of industrial applications on the near term. The most promising investigations deal with high-aspect ratio electric field driven microactuators suitable for use in numerous technical fields such as aeronautics and space industry. Because the silicon micromachining technology have the potential to integrate both mechanical components and control circuits within a single process, MEMS-based active control of microscopic and macroscopic structures appears to be one of the most promising challenges for the next decade. As a first step towards new generations of MEMS-based smart structures, recent investigations dealing with silicon mechanisms involving MEMS-based actuators are briefly discussed in this paper.

  9. Emerging leadership of surface micromachined MEMS for wavelength switching in telecommunications systems

    NASA Astrophysics Data System (ADS)

    Staple, Bevan D.; Muller, Lilac; Miller, David C.

    2003-01-01

    We introduce the Network Photonics" CrossWave as the first commercially-available, MEMS-based wavelength selective switch. The CrossWave combines the functionality of signal de-multiplexing, switching and re-multiplexing in a single all-optical operation using a dispersive element and 1-D MEMS. 1-D MEMS, where micromirrors are configured in a single array with a single mirror per wavelength, are fabricated in a standard surface micromachining process. In this paper we present three generations of micromirror designs. With proper design optimization and process improvements we have demonstrated exceptional mirror flatness (<16.2m-1 curvature), surface error (

  10. Surface-Micromachined Microfiltration Membranes for Efficient Isolation and Functional Immunophenotyping of Subpopulations of Immune Cells

    PubMed Central

    Oh, Boram; Lam, Raymond H. W.; Fan, Rong; Cornell, Timothy T.; Shanley, Thomas P.; Kurabayashi, Katsuo; Fu, Jianping

    2015-01-01

    An accurate measurement of the immune status in patients with immune system disorders is critical in evaluating the stage of diseases and tailoring drug treatments. The functional cellular immunity test is a promising method to establish the diagnosis of immune dysfunctions. The conventional functional cellular immunity test involves measurements of the capacity of peripheral blood mononuclear cells to produce pro-inflammatory cytokines when stimulated ex vivo. However, this “bulk” assay measures the overall reactivity of a population of lymphocytes and monocytes, making it difficult to pinpoint the phenotype or real identity of the reactive immune cells involved. In this research, we develop a large surface micromachined polydimethylsiloxane (PDMS) microfiltration membrane (PMM) with high porosity, which is integrated in a microfluidic microfiltration platform. Using the PMM with functionalized microbeads conjugated with antibodies against specific cell surface proteins, we demonstrated rapid, efficient and high-throughput on-chip isolation, enrichment, and stimulation of subpopulations of immune cells from blood specimens. Furthermore, the PMM-integrated microfiltration platform, coupled with a no-wash homogeneous chemiluminescence assay (“AlphaLISA”), enables us to demonstrate rapid and sensitive on-chip immunophenotyping assays for subpopulations of immune cells isolated directly from minute quantities of blood samples. PMID:23335389

  11. The Development of Micromachined Gyroscope Structure and Circuitry Technology

    PubMed Central

    Xia, Dunzhu; Yu, Cheng; Kong, Lun

    2014-01-01

    This review surveys micromachined gyroscope structure and circuitry technology. The principle of micromachined gyroscopes is first introduced. Then, different kinds of MEMS gyroscope structures, materials and fabrication technologies are illustrated. Micromachined gyroscopes are mainly categorized into micromachined vibrating gyroscopes (MVGs), piezoelectric vibrating gyroscopes (PVGs), surface acoustic wave (SAW) gyroscopes, bulk acoustic wave (BAW) gyroscopes, micromachined electrostatically suspended gyroscopes (MESGs), magnetically suspended gyroscopes (MSGs), micro fiber optic gyroscopes (MFOGs), micro fluid gyroscopes (MFGs), micro atom gyroscopes (MAGs), and special micromachined gyroscopes. Next, the control electronics of micromachined gyroscopes are analyzed. The control circuits are categorized into typical circuitry and special circuitry technologies. The typical circuitry technologies include typical analog circuitry and digital circuitry, while the special circuitry consists of sigma delta, mode matching, temperature/quadrature compensation and novel special technologies. Finally, the characteristics of various typical gyroscopes and their development tendency are discussed and investigated in detail. PMID:24424468

  12. Single neuronal recordings using surface micromachined polysilicon microelectrodes.

    PubMed

    Muthuswamy, Jit; Okandan, Murat; Jackson, Nathan

    2005-03-15

    Bulk micromachining techniques of silicon have been used successfully in the past several years to microfabricate microelectrodes for monitoring single neurons in acute and chronic experiments. In this study we report for the first time a novel surface micromachining technique to microfabricate a very thin polysilicon microelectrode that can be used for monitoring single-unit activity in the central nervous system. The microelectrodes are 3 mm long and 50 microm x 3.75 microm in cross-section. Excellent signal to noise ratios in the order of 25-35 dB were obtained while recording neuronal action potentials. The microelectrodes successfully penetrated the brains after a microincision of the dura mater. Chronic implantation of the microprobe for up to 33 days produced only minor gliosis. Since the polysilicon shank acts as a conductor, additional processing steps involved in laying conductor lines on silicon substrates are avoided. Further, surface micromachining allows for fabricating extremely thin microelectrodes which could result in decreased inflammatory responses. We conclude that the polysilicon microelectrode reported here could be a complementary approach to bulk-micromachined silicon microelectrodes for chronic monitoring of single neurons in the central nervous system.

  13. The application of micromachined sensors to manned space systems

    NASA Technical Reports Server (NTRS)

    Bordano, Aldo; Havey, Gary; Wald, Jerry; Nasr, Hatem

    1993-01-01

    Micromachined sensors promise significant system advantages to manned space vehicles. Vehicle Health Monitoring (VHM) is a critical need for most future space systems. Micromachined sensors play a significant role in advancing the application of VHM in future space vehicles. This paper addresses the requirements that future VHM systems place on micromachined sensors such as: system integration, performance, size, weight, power, redundancy, reliability and fault tolerance. Current uses of micromachined sensors in commercial, military and space systems are used to document advantages that are gained and lessons learned. Based on these successes, the future use of micromachined sensors in space programs is discussed in terms of future directions and issues that need to be addressed such as how commercial and military sensors can meet future space system requirements.

  14. Surface-micromachined 2D optical scanners with optically flat single-crystalline silicon micromirrors

    NASA Astrophysics Data System (ADS)

    Su, John G.; Patterson, Pamela R.; Wu, Ming C.

    2001-05-01

    We have developed a novel wafer-scale single-crystalline silicon micromirror bonding process to fabricate optically flat micromirrors on polysilicon surface-micromachined 2D scanners. The electrostatically actuated 2D scanner has a mirror area of 450 micrometers x 450 micrometers and an optical scan angle of +/- +/-7.5 degree(s). Compared to micromirrors made with a standard polysilicon surface-micromachining process, the radius of curvature of the micromirror has been improved by 1 50 times from 1.8 cm to 265 cm, with surface roughness < 10 nm. Besides, single-crystalline honeycomb micromirrors derived from silicon on insulator (SOI) have been developed to reduce the mass of the bonded mirror.

  15. A micro-machined piezoelectric flexural-mode hydrophone with air backing: a hydrostatic pressure-balancing mechanism for integrity preservation.

    PubMed

    Choi, Sungjoon; Lee, Haksue; Moon, Wonkyu

    2010-09-01

    Although an air-backed thin plate is an effective sound receiver structure, it is easily damaged via pressure unbalance caused by external hydrostatic pressure. To overcome this difficulty, a simple pressure-balancing module is proposed. Despite its small size and relative simplicity, with proper design and operation, micro-channel structure provides a solution to the pressure-balancing problem. If the channel size is sufficiently small, the gas-liquid interface may move back and forth without breach by the hydrostatic pressure since the surface tension can retain the interface surface continuously. One input port of the device is opened to an intermediate liquid, while the other port is connected to the air-backing chamber. As the hydrostatic pressure increases, the liquid in the micro-channel compresses the air, and the pressure in the backing chamber is then equalized to match the external hydrostatic pressure. To validate the performance of the proposed mechanism, a micro-channel prototype is designed and integrated with the piezoelectric micro-machined flexural sensor developed in our previous work. The working principle of the mechanism is experimentally verified. In addition, the effect of hydrostatic pressure on receiving sensitivity is evaluated and compared with predicted behavior.

  16. Computation of Static Shapes and Voltages for Micromachined Deformable Mirrors with Nonlinear Electrostatic Actuators

    NASA Technical Reports Server (NTRS)

    Wang, P. K. C.; Hadaegh, F. Y.

    1996-01-01

    In modeling micromachined deformable mirrors with electrostatic actuators whose gap spacings are of the same order of magnitude as those of the surface deformations, it is necessary to use nonlinear models for the actuators. In this paper, we consider micromachined deformable mirrors modeled by a membrane or plate equation with nonlinear electrostatic actuator characteristics. Numerical methods for computing the mirror deformation due to given actuator voltages and the actuator voltages required for producing the desired deformations at the actuator locations are presented. The application of the proposed methods to circular deformable mirrors whose surfaces are modeled by elastic membranes is discussed in detail. Numerical results are obtained for a typical circular micromachined mirror with electrostatic actuators.

  17. Contact-lens type of micromachined hydrogenated amorphous Si fluorescence detector coupled with microfluidic electrophoresis devices

    NASA Astrophysics Data System (ADS)

    Kamei, Toshihiro; Wada, Takehito

    2006-09-01

    A 5.8-μm-thick SiO2/Ta2O5 multilayer optical interference filter was monolithically integrated and micromachined on a hydrogenated amorphous Si (a-Si :H) pin photodiode to form a fluorescence detector. A microfluidic electrophoresis device was mounted on a detection platform comprising a fluorescence-collecting half-ball lens and the micromachined fluorescence detector. The central aperture of the fluorescence detector allows semiconductor laser light to pass up through the detector and to irradiate an electrophoretic separation channel. The limit of detection is as low as 7nM of the fluorescein solution, and high-speed DNA fragment sizing can be achieved with high separation efficiency. The micromachined a-Si :H fluorescence detector exhibits high sensitivity for practical fluorescent labeling dyes as well as integration flexibility on various substances, making it ideal for application to portable microfluidic bioanalysis devices.

  18. Surface-micromachined magnetic undulator with period length between 10μm and 1 mm for advanced light sources

    NASA Astrophysics Data System (ADS)

    Harrison, Jere; Joshi, Abhijeet; Lake, Jonathan; Candler, Rob; Musumeci, Pietro

    2012-07-01

    A technological gap exists between the μm-scale wiggling periods achieved using electromagnetic waves of high intensity laser pulses and the mm scale of permanent-magnet and superconducting undulators. In the sub-mm range, surface-micromachined soft-magnetic micro-electro-mechanical system inductors with integrated solenoidal coils have already experimentally demonstrated 100 to 500 mT field amplitude across air gaps as large as 15μm. Simulations indicate that magnetic fields as large as 1.5 T across 50μm inductor gaps are feasible. A simple rearranging of the yoke and pole geometry allows for fabrication of 10+ cm long undulator structures with period lengths between 12.5μm and 1 mm. Such undulators find application both in high average power spontaneous emission sources and, if used in combination with ultrahigh-brightness electron beams, could lead to the realization of low energy compact free-electron lasers. Challenges include electron energy broadening due to wakefields and Joule heating in the electromagnet.

  19. Integrated Arrays on Silicon at Terahertz Frequencies

    NASA Technical Reports Server (NTRS)

    Chattopadhayay, Goutam; Lee, Choonsup; Jung, Cecil; Lin, Robert; Peralta, Alessandro; Mehdi, Imran; Llombert, Nuria; Thomas, Bertrand

    2011-01-01

    In this paper we explore various receiver font-end and antenna architecture for use in integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies and use of novel integrated antennas with silicon micromachining are reported. We report novel stacking of micromachined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages which easily leads to the development of 2- dimensioanl multi-pixel receiver front-ends in the terahertz frequency range. We also report an integrated micro-lens antenna that goes with the silicon micro-machined front-end. The micro-lens antenna is fed by a waveguide that excites a silicon lens antenna through a leaky-wave or electromagnetic band gap (EBG) resonant cavity. We utilized advanced semiconductor nanofabrication techniques to design, fabricate, and demonstrate a super-compact, low-mass submillimeter-wave heterodyne frontend. When the micro-lens antenna is integrated with the receiver front-end we will be able to assemble integrated heterodyne array receivers for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

  20. Microfabrication Techniques for Plastic Microelectromechanical Systems (MEMS)

    DTIC Science & Technology

    2003-07-01

    micromachining techniques were investigated. Surface micromachining techniques include deposition of thin and thick polymer films using vacuum and spin ...1 2.0 Introduction ...100 4.3.1 Nozzle-diffuser pumps theory

  1. Lab-on-CMOS Integration of Microfluidics and Electrochemical Sensors

    PubMed Central

    Huang, Yue; Mason, Andrew J.

    2013-01-01

    This paper introduces a CMOS-microfluidics integration scheme for electrochemical microsystems. A CMOS chip was embedded into a micro-machined silicon carrier. By leveling the CMOS chip and carrier surface to within 100 nm, an expanded obstacle-free surface suitable for photolithography was achieved. Thin film metal planar interconnects were microfabricated to bridge CMOS pads to the perimeter of the carrier, leaving a flat and smooth surface for integrating microfluidic structures. A model device containing SU-8 microfluidic mixers and detection channels crossing over microelectrodes on a CMOS integrated circuit was constructed using the chip-carrier assembly scheme. Functional integrity of microfluidic structures and on-CMOS electrodes was verified by a simultaneous sample dilution and electrochemical detection experiment within multi-channel microfluidics. This lab-on-CMOS integration process is capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms. PMID:23939616

  2. Lab-on-CMOS integration of microfluidics and electrochemical sensors.

    PubMed

    Huang, Yue; Mason, Andrew J

    2013-10-07

    This paper introduces a CMOS-microfluidics integration scheme for electrochemical microsystems. A CMOS chip was embedded into a micro-machined silicon carrier. By leveling the CMOS chip and carrier surface to within 100 nm, an expanded obstacle-free surface suitable for photolithography was achieved. Thin film metal planar interconnects were microfabricated to bridge CMOS pads to the perimeter of the carrier, leaving a flat and smooth surface for integrating microfluidic structures. A model device containing SU-8 microfluidic mixers and detection channels crossing over microelectrodes on a CMOS integrated circuit was constructed using the chip-carrier assembly scheme. Functional integrity of microfluidic structures and on-CMOS electrodes was verified by a simultaneous sample dilution and electrochemical detection experiment within multi-channel microfluidics. This lab-on-CMOS integration process is capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms.

  3. Micromachined electrical cauterizer

    DOEpatents

    Lee, Abraham P.; Krulevitch, Peter A.; Northrup, M. Allen

    1999-01-01

    A micromachined electrical cauterizer. Microstructures are combined with microelectrodes for highly localized electro cauterization. Using boron etch stops and surface micromachining, microneedles with very smooth surfaces are made. Micromachining also allows for precision placement of electrodes by photolithography with micron sized gaps to allow for concentrated electric fields. A microcauterizer is fabricated by bulk etching silicon to form knife edges, then parallelly placed microelectrodes with gaps as small as 5 .mu.m are patterned and aligned adjacent the knife edges to provide homeostasis while cutting tissue. While most of the microelectrode lines are electrically insulated from the atmosphere by depositing and patterning silicon dioxide on the electric feedthrough portions, a window is opened in the silicon dioxide to expose the parallel microelectrode portion. This helps reduce power loss and assist in focusing the power locally for more efficient and safer procedures.

  4. Micromachined electrical cauterizer

    DOEpatents

    Lee, A.P.; Krulevitch, P.A.; Northrup, M.A.

    1999-08-31

    A micromachined electrical cauterizer is disclosed. Microstructures are combined with microelectrodes for highly localized electro cauterization. Using boron etch stops and surface micromachining, microneedles with very smooth surfaces are made. Micromachining also allows for precision placement of electrodes by photolithography with micron sized gaps to allow for concentrated electric fields. A microcauterizer is fabricated by bulk etching silicon to form knife edges, then parallelly placed microelectrodes with gaps as small as 5 {mu}m are patterned and aligned adjacent the knife edges to provide homeostasis while cutting tissue. While most of the microelectrode lines are electrically insulated from the atmosphere by depositing and patterning silicon dioxide on the electric feedthrough portions, a window is opened in the silicon dioxide to expose the parallel microelectrode portion. This helps reduce power loss and assist in focusing the power locally for more efficient and safer procedures. 7 figs.

  5. A simultaneous deep micromachining and surface passivation method suitable for silicon-based devices

    NASA Astrophysics Data System (ADS)

    Babaei, E.; Gharooni, M.; Mohajerzadeh, S.; Soleimani, E. A.

    2018-07-01

    Three novel methods for simultaneous micromachining and surface passivation of silicon are reported. A thin passivation layer is achieved using continuous and sequential plasma processes based on SF6, H2 and O2 gases. Reducing the recombination by surface passivation is crucial for the realization of high-performance nanosized optoelectronic devices. The passivation of the surface as an important step, is feasible by plasma processing based on hydrogen pulses in proper time-slots or using a mixture of H2 and O2, and SF6 gases. The passivation layer which is formed in situ during the micromachining process obviates a separate passivation step needed in conventional methods. By adjusting the plasma parameters such as power, duration, and flows of gases, the process can be controlled for the best results and acceptable under-etching at the same time. Moreover, the pseudo-oxide layer which is formed during the micromachining processes will also improve the electrical characteristics of the surface, which can be used as an add-on for micro and nanowire applications. To quantify the effect of surface passivation in our method, ellipsometry, lifetime measurements, x-ray photoelectron spectroscopy, current–voltage and capacitance–voltage measurements and solar cell testing have been employed.

  6. Micromachined Fluid Inertial Sensors

    PubMed Central

    Liu, Shiqiang; Zhu, Rong

    2017-01-01

    Micromachined fluid inertial sensors are an important class of inertial sensors, which mainly includes thermal accelerometers and fluid gyroscopes, which have now been developed since the end of the last century for about 20 years. Compared with conventional silicon or quartz inertial sensors, the fluid inertial sensors use a fluid instead of a solid proof mass as the moving and sensitive element, and thus offer advantages of simple structures, low cost, high shock resistance, and large measurement ranges while the sensitivity and bandwidth are not competitive. Many studies and various designs have been reported in the past two decades. This review firstly introduces the working principles of fluid inertial sensors, followed by the relevant research developments. The micromachined thermal accelerometers based on thermal convection have developed maturely and become commercialized. However, the micromachined fluid gyroscopes, which are based on jet flow or thermal flow, are less mature. The key issues and technologies of the thermal accelerometers, mainly including bandwidth, temperature compensation, monolithic integration of tri-axis accelerometers and strategies for high production yields are also summarized and discussed. For the micromachined fluid gyroscopes, improving integration and sensitivity, reducing thermal errors and cross coupling errors are the issues of most concern. PMID:28216569

  7. NASA Tech Briefs, May 2003

    NASA Technical Reports Server (NTRS)

    2003-01-01

    Topics covered include: Using Diffusion Bonding in Making Piezoelectric Actuators; Wireless Temperature-Monitoring System; Analog Binaural Circuits for Detecting and Locating Leaks; Mirrors Containing Biomimetic Shape-Control Actuators; Surface-Micromachined Planar Arrays of Thermopiles; Cascade Back-Propagation Learning in Neural Networks; Perovskite Superlattices as Tunable Microwave Devices; Rollable Thin-Shell Nanolaminate Mirrors; Flight Tests of a Ministick Controller in an F/A-18 Airplane; Piezoelectrically Actuated Shutter for High Vacuum; Bio-Inspired Engineering of Exploration Systems; Microscope Cells Containing Multiple Micromachined Wells; Electrophoretic Deposition for Fabricating Microbatteries; Integrated Arrays of Ion-Sensitive Electrodes; Model of Fluidized Bed Containing Reacting Solids and Gases; Membrane Mirrors With Bimorph Shape Actuators; Using Fractional Clock-Period Delays in Telemetry Arraying; Developing Generic Software for Spacecraft Avionics; Numerical Study of Pyrolysis of Biomass in Fluidized Beds; and Assessment of Models of Chemically Reacting Granular Flows.

  8. Micromachined magnetohydrodynamic actuators and sensors

    DOEpatents

    Lee, Abraham P.; Lemoff, Asuncion V.

    2000-01-01

    A magnetohydrodynamic (MHD) micropump and microsensor which utilizes micromachining to integrate the electrodes with microchannels and includes a magnet for producing magnetic fields perpendicular to both the electrical current direction and the fluid flow direction. The magnet can also be micromachined and integrated with the micropump using existing technology. The MHD micropump, for example, can generate continuous, reversible flow, with readily controllable flow rates. The flow can be reversed by either reversing the electrical current flow or reversing the magnetic field. By mismatching the electrodes, a swirling vortex flow can be generated for potential mixing applications. No moving parts are necessary and the dead volume is minimal. The micropumps can be placed at any position in a fluidic circuit and a combination of micropumps can generate fluidic plugs and valves.

  9. Micro benchtop optics by bulk silicon micromachining

    DOEpatents

    Lee, Abraham P.; Pocha, Michael D.; McConaghy, Charles F.; Deri, Robert J.

    2000-01-01

    Micromachining of bulk silicon utilizing the parallel etching characteristics of bulk silicon and integrating the parallel etch planes of silicon with silicon wafer bonding and impurity doping, enables the fabrication of on-chip optics with in situ aligned etched grooves for optical fibers, micro-lenses, photodiodes, and laser diodes. Other optical components that can be microfabricated and integrated include semi-transparent beam splitters, micro-optical scanners, pinholes, optical gratings, micro-optical filters, etc. Micromachining of bulk silicon utilizing the parallel etching characteristics thereof can be utilized to develop miniaturization of bio-instrumentation such as wavelength monitoring by fluorescence spectrometers, and other miniaturized optical systems such as Fabry-Perot interferometry for filtering of wavelengths, tunable cavity lasers, micro-holography modules, and wavelength splitters for optical communication systems.

  10. Fabrication of an integrated high-quality-factor (high-Q) optofluidic sensor by femtosecond laser micromachining.

    PubMed

    Song, Jiangxin; Lin, Jintian; Tang, Jialei; Liao, Yang; He, Fei; Wang, Zhaohui; Qiao, Lingling; Sugioka, Koji; Cheng, Ya

    2014-06-16

    We report on fabrication of a microtoroid resonator of a high-quality factor (i.e., Q-factor of ~3.24 × 10(6) measured under the critical coupling condition) integrated in a microfluidic channel using femtosecond laser three-dimensional (3D) micromachining. Coupling of light into and out of the microresonator has been realized with a fiber taper that is reliably assembled with the microtoroid. The assembly of the fiber to the microtoroid is achieved by welding the fiber taper onto the sidewall of the microtoroid using CO2 laser irradiation. The integrated microresonator maintains a high Q-factor of 3.21 × 10(5) as measured in air, which should still be sufficient for many sensing applications. We test the functionality of the integrated optofluidic sensor by performing bulk refractive index sensing of purified water doped with tiny amount of salt. It is shown that a detection limit of ~1.2 × 10(-4) refractive index unit can be achieved. Our result showcases the capability of integration of high-Q microresonators with complex microfluidic systems using femtosecond laser 3D micromachining.

  11. Laser Micromachining Fabrication of THz Components

    NASA Technical Reports Server (NTRS)

    DrouetdAubigny, C.; Walker, C.; Jones, B.; Groppi, C.; Papapolymerou, J.; Tavenier, C.

    2001-01-01

    Laser micromachining techniques can be used to fabricate high-quality waveguide structures and quasi-optical components to micrometer accuracies. Successful GHz designs can be directly scaled to THz frequencies. We expect this promising technology to allow the construction of the first fully integrated THz heterodyne imaging arrays. At the University of Arizona, construction of the first laser micromachining system designed for THz waveguide components fabrication has been completed. Once tested and characterized our system will be used to construct prototype THz lx4 focal plane mixer arrays, magic tees, AR coated silicon lenses, local oscillator source phase gratings, filters and more. Our system can micro-machine structures down to a few microns accuracy and up to 6 inches across in a short time. This paper discusses the design and performance of our micromachining system, and illustrates the type, range and performance of components this exciting new technology will make accessible to the THz community.

  12. Development of a Novel Transparent Flexible Capacitive Micromachined Ultrasonic Transducer

    PubMed Central

    Pang, Da-Chen; Chang, Cheng-Min

    2017-01-01

    This paper presents the world’s first transparent flexible capacitive micromachined ultrasonic transducer (CMUT) that was fabricated through a roll-lamination technique. This polymer-based CMUT has advantages of transparency, flexibility, and non-contacting detection which provide unique functions in display panel applications. Comprising an indium tin oxide-polyethylene terephthalate (ITO-PET) substrate, SU-8 sidewall and vibrating membranes, and silver nanowire transparent electrode, the transducer has visible-light transmittance exceeding 80% and can operate on curved surfaces with a 40 mm radius of curvature. Unlike the traditional silicon-based high temperature process, the CMUT can be fabricated on a flexible substrate at a temperature below 100 °C to reduce residual stress introduced at high temperature. The CMUT on the curved surfaces can detect a flat target and finger at distances up to 50 mm and 40 mm, respectively. The transparent flexible CMUT provides a better human-machine interface than existing touch panels because it can be integrated with a display panel for non-contacting control in a health conscious environment and the flexible feature is critical for curved display and wearable electronics. PMID:28632157

  13. Silicon sample holder for molecular beam epitaxy on pre-fabricated integrated circuits

    NASA Technical Reports Server (NTRS)

    Hoenk, Michael E. (Inventor); Grunthaner, Paula J. (Inventor); Grunthaner, Frank J. (Inventor)

    1994-01-01

    The sample holder of the invention is formed of the same semiconductor crystal as the integrated circuit on which the molecular beam expitaxial process is to be performed. In the preferred embodiment, the sample holder comprises three stacked micro-machined silicon wafers: a silicon base wafer having a square micro-machined center opening corresponding in size and shape to the active area of a CCD imager chip, a silicon center wafer micro-machined as an annulus having radially inwardly pointing fingers whose ends abut the edges of and center the CCD imager chip within the annulus, and a silicon top wafer micro-machined as an annulus having cantilevered membranes which extend over the top of the CCD imager chip. The micro-machined silicon wafers are stacked in the order given above with the CCD imager chip centered in the center wafer and sandwiched between the base and top wafers. The thickness of the center wafer is about 20% less than the thickness of the CCD imager chip. Preferably, four titanium wires, each grasping the edges of the top and base wafers, compress all three wafers together, flexing the cantilever fingers of the top wafer to accommodate the thickness of the CCD imager chip, acting as a spring holding the CCD imager chip in place.

  14. Surface--micromachined rotatable member having a low-contact-area hub

    DOEpatents

    Rodgers, M. Steven; Sniegowski, Jeffry J.

    2002-01-01

    A surface-micromachined rotatable member formed on a substrate and a method for manufacturing thereof are disclosed. The surface-micromachined rotatable member, which can be a gear or a rotary stage, has a central hub, and an annulus connected to the central hub by an overarching bridge. The hub includes a stationary axle support attached to the substrate and surrounding an axle. The axle is retained within the axle support with an air-gap spacing therebetween of generally 0.3 .mu.m or less. The rotatable member can be formed by alternately depositing and patterning layers of a semiconductor (e.g. polysilicon or a silicon-germanium alloy) and a sacrificial material and then removing the sacrificial material, at least in part. The present invention has applications for forming micromechanical or microelectromechanical devices requiring lower actuation forces, and providing improved reliability.

  15. Surface-micromachined rotatable member having a low-contact-area hub

    DOEpatents

    Rodgers, M. Steven; Sniegowski, Jeffry J.; Krygowski, Thomas W.

    2003-11-18

    A surface-micromachined rotatable member formed on a substrate and a method for manufacturing thereof are disclosed. The surface-micromachined rotatable member, which can be a gear or a rotary stage, has a central hub, and an annulus connected to the central hub by an overarching bridge. The hub includes a stationary axle support attached to the substrate and surrounding an axle. The axle is retained within the axle support with an air-gap spacing therebetween of generally 0.3 .mu.m or less. The rotatable member can be formed by alternately depositing and patterning layers of a semiconductor (e.g. polysilicon or a silicon-germanium alloy) and a sacrificial material and then removing the sacrificial material, at least in part. The present invention has applications for forming micromechanical or microelectromechanical devices requiring lower actuation forces, and providing improved reliability.

  16. Micromachined microfluidic chemiluminescent system for explosives detection

    NASA Astrophysics Data System (ADS)

    Park, Yoon; Neikirk, Dean P.; Anslyn, Eric V.

    2007-04-01

    Results will be reported from efforts to develop a self-contained micromachined microfluidic detection system for the presence of specific target analytes under the US Office of Naval Research Counter IED Basic Research Program. Our efforts include improving/optimizing a dedicated micromachined sensor array with integrated photodetectors and the synthesis of chemiluminescent receptors for nitramine residues. Our strategy for developing chemiluminescent synthetic receptors is to use quenched peroxyoxalate chemiluminescence; the presence of the target analyte would then trigger chemiluminescence. Preliminary results are encouraging as we have been able to measure large photo-currents from the reaction. We have also fabricated and demonstrated the feasibility of integrating photodiodes within an array of micromachined silicon pyramidal cavities. One particular advantage of such approach over a conventional planar photodiode would be its collection efficiency without the use of external optical components. Unlike the case of a normal photodetector coupled to a focused or collimated light source, the photodetector for such a purpose must couple to an emitting source that is approximately hemispherical; hence, using the full sidewalls of the bead's confining cavity as the detector allows the entire structure to act as its own integrating sphere. At the present time, our efforts are concentrating on improving the signal-to-noise ratio by reducing the leakage current by optimizing the fabrication sequence and the design.

  17. Characterization and optimization of polycrystalline Si70%Ge30% for surface micromachined thermopiles in human body applications

    NASA Astrophysics Data System (ADS)

    Wang, Ziyang; Fiorini, Paolo; Leonov, Vladimir; Van Hoof, Chris

    2009-09-01

    This paper presents the material characterization methods, characterization results and the optimization scheme for polycrystalline Si70%Ge30% (poly-SiGe) from the perspective of its application in a surface micromachined thermopile. Due to its comparative advantages, such as lower thermal conductivity and ease of processing, over other materials, poly-SiGe is chosen to fabricate a surface micromachined thermopile and eventually a wearable thermoelectric generator (TEG) to be used on a human body. To enable optimal design of advanced thermocouple microstructures, poly-SiGe sample materials prepared by two different techniques, namely low-pressure chemical vapor deposition (LPCVD) with in situ doping and rapid thermal chemical vapor deposition (RTCVD) with ion implantation, have been characterized. Relevant material properties, including electrical resistivity, Seebeck coefficient, thermal conductivity and specific contact resistance, have been reported. For the determination of thermal conductivity, a novel surface-micromachined test structure based on the Seebeck effect is designed, fabricated and measured. Compared to the traditional test structures, it is more advantageous for sample materials with a relatively large Seebeck coefficient, such as poly-SiGe. Based on the characterization results, a further optimization scheme is suggested to allow independent respective optimization of the figure of merit and the specific contact resistance.

  18. Micromachined integrated quantum circuit containing a superconducting qubit

    NASA Astrophysics Data System (ADS)

    Brecht, Teresa; Chu, Yiwen; Axline, Christopher; Pfaff, Wolfgang; Blumoff, Jacob; Chou, Kevin; Krayzman, Lev; Frunzio, Luigi; Schoelkopf, Robert

    We demonstrate a functional multilayer microwave integrated quantum circuit (MMIQC). This novel hardware architecture combines the high coherence and isolation of three-dimensional structures with the advantages of integrated circuits made with lithographic techniques. We present fabrication and measurement of a two-cavity/one-qubit prototype, including a transmon coupled to a three-dimensional microwave cavity micromachined in a silicon wafer. It comprises a simple MMIQC with competitive lifetimes and the ability to perform circuit QED operations in the strong dispersive regime. Furthermore, the design and fabrication techniques that we have developed are extensible to more complex quantum information processing devices.

  19. Surface-Micromachined Planar Arrays of Thermopiles

    NASA Technical Reports Server (NTRS)

    Foote, Marc C.

    2003-01-01

    Planar two-dimensional arrays of thermopiles intended for use as thermal-imaging detectors are to be fabricated by a process that includes surface micromachining. These thermopile arrays are designed to perform better than do prior two-dimensional thermopile arrays. The lower performance of prior two-dimensional thermopile arrays is attributed to the following causes: The thermopiles are made from low-performance thermoelectric materials. The devices contain dielectric supporting structures, the thermal conductances of which give rise to parasitic losses of heat from detectors to substrates. The bulk-micromachining processes sometimes used to remove substrate material under the pixels, making it difficult to incorporate low-noise readout electronic circuitry. The thermoelectric lines are on the same level as the infrared absorbers, thereby reducing fill factor. The improved pixel design of a thermopile array of the type under development is expected to afford enhanced performance by virtue of the following combination of features: Surface-micromachined detectors are thermally isolated through suspension above readout circuitry. The thermopiles are made of such high-performance thermoelectric materials as Bi-Te and Bi-Sb-Te alloys. Pixel structures are supported only by the thermoelectric materials: there are no supporting dielectric structures that could leak heat by conduction to the substrate.

  20. Modelling of micromachining of human tooth enamel by erbium laser radiation

    NASA Astrophysics Data System (ADS)

    Belikov, A. V.; Skrypnik, A. V.; Shatilova, K. V.

    2014-08-01

    We consider a 3D cellular model of human tooth enamel and a photomechanical cellular model of enamel ablation by erbium laser radiation, taking into account the structural peculiarities of enamel, energy distribution in the laser beam cross section and attenuation of laser energy in biological tissue. The surface area of the texture in enamel is calculated after its micromachining by erbium laser radiation. The influence of the surface area on the bond strength of enamel with dental filling materials is discussed. A good correlation between the computer simulation of the total work of adhesion and experimentally measured bond strength between the dental filling material and the tooth enamel after its micromachining by means of YAG : Er laser radiation is attained.

  1. Micromachined Millimeter- and Submillimeter-Wave SIS Heterodyne Receivers for Remote Sensing

    NASA Technical Reports Server (NTRS)

    Hu, Qing

    1998-01-01

    A heterodyne mixer with a micromachined horn antenna and a superconductor -insulator-superconductor (SIS) tunnel junction as mixing element is tested in the W-band (75-115 GHz) frequency range. Micromachined integrated horn antennas consist of a dipole antenna suspended on a thin Si3N4 dielectric membrane inside a pyramidal cavity etched in silicon. The mixer performance is optimized by using a backing plane behind the dipole antenna to tune out the capacitance of the tunnel junction. The lowest receiver noise temperature of 30+/-3 K without any correction) is measured at 106 GHz with a 3-dB bandwidth of 8 GHz. This sensitivity is comparable to the state-of-the-art waveguide and quasi-optical SIS receivers, showing the potential use of micromachined horn antennas in imaging arrays.

  2. Optical wireless communications for micromachines

    NASA Astrophysics Data System (ADS)

    O'Brien, Dominic C.; Yuan, Wei Wen; Liu, Jing Jing; Faulkner, Grahame E.; Elston, Steve J.; Collins, Steve; Parry-Jones, Lesley A.

    2006-08-01

    A key challenge for wireless sensor networks is minimizing the energy required for network nodes to communicate with each other, and this becomes acute for self-powered devices such as 'smart dust'. Optical communications is a potentially attractive solution for such devices. The University of Oxford is currently involved in a project to build optical wireless links to smart dust. Retro-reflectors combined with liquid crystal modulators can be integrated with the micro-machine to create a low power transceiver. When illuminated from a base station a modulated beam is returned, transmitting data. Data from the base station can be transmitted using modulation of the illuminating beam and a receiver at the micro-machine. In this paper we outline the energy consumption and link budget considerations in the design of such micro-machines, and report preliminary experimental results.

  3. Systematic analysis of CMOS-micromachined inductors with application to mixer matching circuits

    NASA Astrophysics Data System (ADS)

    Wu, Jerry Chun-Li

    The growing demand for consumer voice and data communication systems and military communication applications has created a need for low-power, low-cost, high-performance radio-frequency (RF) front-end. To achieve this goal, bringing passive components, especially inductors, to silicon is imperative. On-chip passive components such as inductors and capacitors generally enhance the reliability and efficiency of silicon-integrated RF cells. They can provide circuit solutions with superior performance and contribute to a higher level of integration. With passive components on chip, there is a great opportunity to have transformers, filters, and matching networks on chip. However, inductors on silicon have a low quality factor (Q) due to both substrate and metal loss. This dissertation demonstrates the systematic analysis of inductors fabricated using standard complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) system technologies. We report system-on-chip inductor modeling, simulation, and measurements of effective inductance and quality factors. In this analysis methodology, a number of systematic simulations are performed on regular and micromachined inductors with different parameters such as spiral topology, number of turns, outer diameter, thickness, and percentage of substrate removed by using micromachining technologies. Three different novel support structures of the micromachined spiral inductor are proposed, analyzed, and implemented for larger size suspended inductors. The sensitivity of the structure support and different degree of substrate etching by post-processing is illustrated. The results provide guidelines for the selection of inductor parameters, post-processing methodologies, and its spiral supports to meet the RF design specifications and the stability requirements for mobile communication. The proposed CMOS-micromachined inductor is used in a low cost-effective double-balanced Gilbert mixer with on-chip matching network. The integrated mixer inductor was implemented and tested to prove the concept.

  4. Modelling of micromachining of human tooth enamel by erbium laser radiation

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Belikov, A V; Skrypnik, A V; Shatilova, K V

    We consider a 3D cellular model of human tooth enamel and a photomechanical cellular model of enamel ablation by erbium laser radiation, taking into account the structural peculiarities of enamel, energy distribution in the laser beam cross section and attenuation of laser energy in biological tissue. The surface area of the texture in enamel is calculated after its micromachining by erbium laser radiation. The influence of the surface area on the bond strength of enamel with dental filling materials is discussed. A good correlation between the computer simulation of the total work of adhesion and experimentally measured bond strength betweenmore » the dental filling material and the tooth enamel after its micromachining by means of YAG : Er laser radiation is attained. (laser biophotonics)« less

  5. A Low-noise Micromachined Millimeter-Wave Heterodyne Mixer using Nb Superconducting Tunnel Junctions

    NASA Technical Reports Server (NTRS)

    DeLange, Gert; Jacobson, Brian R.; Hu, Qing

    1996-01-01

    A heterodyne mixer with a micromachined horn antenna and a superconductor-insulator-superconductor (SIS) tunnel junction as mixing element is tested in the W-band (75-115 GHz) frequency range. Micromachined integrated horn antennas consist of a dipole antenna suspended on a thin Si3N4 dielectric membrane inside a pyramidal cavity etched in silicon. The mixer performance is optimized by using a backing plane behind the dipole antenna to tune out the capacitance of the tunnel junction. The lowest receiver noise temperature of 30 +/- 3 K (without any correction) is measured at 106 GHz with a 3-dB bandwidth of 8 GHz. This sensitivity is comparable to the state-of-the-art waveguide and quasi-optical SIS receivers, showing the potential use of micromachined horn antennas in imaging arrays.

  6. Optical properties of micromachined polysilicon reflective surfaces with etching holes

    NASA Astrophysics Data System (ADS)

    Zou, Jun; Byrne, Colin; Liu, Chang; Brady, David J.

    1998-08-01

    MUMPS (Multi-User MEMS Process) is receiving increasingly wide use in micro optics. We have investigated the optical properties of the polysilicon reflective surface in a typical MUMPS chip within the visible light spectrum. The effect of etching holes on the reflected laser beam is studied. The reflectivity and diffraction patterns at five different wavelengths have been measured. The optical properties of the polysilicon reflective surface are greatly affected by the surface roughness, the etching holes, as well as the material. The etching holes contribute to diffraction and reduction of reflectivity. This study provides a basis for optimal design of micromachined free-space optical systems.

  7. Use of chemical mechanical polishing in micromachining

    DOEpatents

    Nasby, Robert D.; Hetherington, Dale L.; Sniegowski, Jeffry J.; McWhorter, Paul J.; Apblett, Christopher A.

    1998-01-01

    A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.

  8. Advanced RF Front End Technology

    NASA Technical Reports Server (NTRS)

    Herman, M. I.; Valas, S.; Katehi, L. P. B.

    2001-01-01

    The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

  9. Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents

    NASA Astrophysics Data System (ADS)

    Stolyarova, Sara; Shemesh, Ariel; Aharon, Oren; Cohen, Omer; Gal, Lior; Eichen, Yoav; Nemirovsky, Yael

    This study focuses on arrays of cantilevers made of crystalline silicon (c-Si), using SOI wafers as the starting material and using bulk micromachining. The arrays are subsequently transformed into composite porous silicon-crystalline silicon cantilevers, using a unique vapor phase process tailored for providing a thin surface layer of porous silicon on one side only. This results in asymmetric cantilever arrays, with one side providing nano-structured porous large surface, which can be further coated with polymers, thus providing additional sensing capabilities and enhanced sensing. The c-Si cantilevers are vertically integrated with a bottom silicon die with electrodes allowing electrostatic actuation. Flip Chip bonding is used for the vertical integration. The readout is provided by a sensitive Capacitance to Digital Converter. The fabrication, processing and characterization results are reported. The reported study is aimed towards achieving miniature cantilever chips with integrated readout for sensing explosives and chemical warfare agents in the field.

  10. Vibration measurement by atomic force microscopy with laser readout

    NASA Astrophysics Data System (ADS)

    Snitka, Valentinas J.; Mizariene, Vida; Kalinauskas, Margiris; Lucinskas, Paulius

    1998-06-01

    Micromachined cantilever beams are widely used for different microengineering and nanotechnology actuators and sensors applications. The micromechanical cantilever tip-based data storage devices with reading real data at the rates exceeding 1Mbit/s have been demonstrated. The vibrational noise spectrum of a cantilever limits the data storage resolution. Therefore the possibility to measure the microvibrations and acoustic fields in different micromachined devices are of great interest. We describe a method to study a micromechanical cantilever and surface vibrations based on laser beam deflection measurements. The influence of piezoelectric plate vibrations and the tip- surface contact condition on the cantilever vibrations were investigated in the frequency range of 1-200 kHz. The experiments were performed using the measurement results. The V-shaped cantilevers exited by the normal vibrations due to the non-linearity at the tip-surface contact vibrates with a complex motion and has a lateral vibration mode coupled with normal vibration mode. The possibility to use laser deflection technique for the vibration measurements in micromachined structures with nano resolution is shown.

  11. Microtensile Test of AN Ordered-Reinforced Electrophoretic Polymer Matrix Composite Fabricated by Surface Micromachining

    NASA Astrophysics Data System (ADS)

    Yang, Zhuoqing; Wang, Hong; Zhang, Zhenjie; Ding, Guifu; Zhao, Xiaolin

    A novel ordered-reinforced microscale polymer matrix composite based on electrophoresis and surface micromachining technologies has been proposed in the present work. The braid angle, volume content and width of the reinforcement in the composite has been designed and simulated by ANSYS finite element software. Based on the simulation and optimization, the Ni fibers reinforced polymer matrix composite sample (3 mm length × 0.6 mm width × 0.04 mm thickness) was successfully fabricated utilizing the surface micromachining process. The fabricated samples were characterized by microtensile test on the dynamic mechanical analysis (DMA) equipment. It is indicated that the tested tensile strength and Young's modulus are 285 MPa and 6.8 GPa, respectively. In addition, the fracture section of the composite sample has been observed by scanning electron microscope (SEM) and the corresponding fracture process was also explained and analyzed in detail. The new presented composite is promising for hot embossing mold in microfluidic chip and several transducers used in accurately controlled biomedical systems.

  12. Fabrication of low-loss ridge waveguides in z-cut lithium niobate by combination of ion implantation and UV picosecond laser micromachining

    NASA Astrophysics Data System (ADS)

    Stolze, M.; Herrmann, T.; L'huillier, J. A.

    2016-03-01

    Ridge waveguides in ferroelectric materials like LiNbO3 attended great interest for highly efficient integrated optical devices, for instance, electro-optic modulators, frequency converters and ring resonators. The main challenges are the realization of high index barrier towards the substrate and the processing of smooth ridges for minimized scattering losses. For fabricating ridges a variety of techniques, like chemical and wet etching as well as optical grade dicing, have been investigated in detail. Among them, laser micromachining offers a versatile and flexible processing technology, but up to now only a limited side wall roughness has been achieved by this technique. Here we report on laser micromachining of smooth ridges for low-loss optical waveguides in LiNbO3. The ridges with a top width of 7 µm were fabricated in z-cut LiNbO3 by a combination of UV picosecond micromachining and thermal annealing. The laser processing parameters show a strong influence on the achievable sidewall roughness of the ridges and were systematically investigated and optimized. Finally, the surface quality is further improved by an optimized thermal post-processing. The roughness of the ridges were analysed with confocal microscopy and the scattering losses were measured at an optical characterization wavelength of 632.8 nm by using the end-fire coupling method. In these investigations the index barrier was formed by multi-energy low dose oxygen ion implantation technology in a depth of 2.7 μm. With optimized laser processing parameters and thermal post-processing a scattering loss as low as 0.1 dB/cm has been demonstrated.

  13. Understanding the electrical characteristics of micromotors

    NASA Astrophysics Data System (ADS)

    Emadi, Ali; Irudayaraj, Sujay S.

    2005-06-01

    This paper presents a comprehensive list of issues related to the electrical characteristics of both electrostatic and electromagnetic micromotors and aims at understanding the behavior of the micromotor from the electrical standpoint. The paper takes the step-by-step approach by first presenting an overview of the laws of electrostatics and electromagnetism for micromachines, their applicability, features and limitations, and then progresses to independently analyze some of the important machine related quantities like electromotive torque, force-output, angular frequencies, supply conditions and requirements, for different types of electrostatic and electromagnetic micromotor constructions. A thorough study on the electric machine parameters that affect the performance of the micromotor need to be performed, since it would serve as a useful link in integrating the micromachine output performance with the fabrication process and challenges associated with it. Achieving such integration would then determine the optimized working condition for the micromotor. The main reason for this study is that although significant advancements have fostered the growth of micromotors in the recent past which has led to the establishment of the micromotor as quite a remarkable machine for powering micromechanical devices, and also as an industrial requirement for various applications, there has always been a concern about the optimal performance of the micromotor, since there is more than just one technology that is being incorporated to realize the micromotor. With fields ranging from surface engineering and chemistry to material science engineering exerting influence on the micromotor design, it becomes very important to completely comprehend the electrophysics of the micromachine that would in turn interact with the science of fabrication to result in the development of better micromotors with considerably less functional complexity.

  14. Micromachined peristaltic pumps

    NASA Technical Reports Server (NTRS)

    Hartley, Frank T. (Inventor)

    1999-01-01

    Micromachined pumps including a channel formed between a first membrane and a substrate or between first and second flexible membranes. A series of electrically conductive strips is applied to a surface of the substrate or one of the membranes. Application of a sequential voltage to the series of strips causes a region of closure to progress down the channel to achieve a pumping action.

  15. Monolithic CMUT on CMOS Integration for Intravascular Ultrasound Applications

    PubMed Central

    Zahorian, Jaime; Hochman, Michael; Xu, Toby; Satir, Sarp; Gurun, Gokce; Karaman, Mustafa; Degertekin, F. Levent

    2012-01-01

    One of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter based volumetric imaging arrays where the elements need to be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom designed CMOS receiver electronics from a commercial IC foundry. The CMUT on CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT to CMOS interconnection. This CMUT to CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire bonding method. Characterization experiments indicate that the CMUT on CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Experiments on a 1.6 mm diameter dual-ring CMUT array with a 15 MHz center frequency show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging CTOs located 1 cm away from the CMUT array. PMID:23443701

  16. Use of chemical mechanical polishing in micromachining

    DOEpatents

    Nasby, R.D.; Hetherington, D.L.; Sniegowski, J.J.; McWhorter, P.J.; Apblett, C.A.

    1998-09-08

    A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface. 4 figs.

  17. Operating principles of an electrothermal vibrometer for optical switching applications

    NASA Astrophysics Data System (ADS)

    Pai, Min-fan; Tien, Norman C.

    1999-09-01

    A compact polysilicon surface-micromachined microactuator designed for optical switching applications is described. This actuator is fabricated using the foundry MUMPs process provided by Cronos Integrated Microsystems Inc. Actuated electrothermally, the microactuator allows fast switching speeds and can be operated with a low voltage square-wave signal. The design, operation mechanisms for this long-range and high frequency thermal actuation are described. A vertical micromirror integrated with this actuator can be operated with a 10.5 V, 20 kHz 15% duty-cycle pulse signal, achieving a lateral moving speed higher than 15.6 mm/sec. The optical switch has been operated to frequencies as high as 30 kHz.

  18. Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer

    NASA Astrophysics Data System (ADS)

    Wang, Wei-Shan; Lullin, Justine; Froemel, Joerg; Wiemer, Maik; Bargiel, Sylwester; Passilly, Nicolas; Gorecki, Christophe; Gessner, Thomas

    2015-02-01

    The paper presents the multi-wafer bonding technology as well as the integration of electrical connection to the zscanner wafer of the micromachined array-type Mirau interferometer. A Mirau interferometer, which is a key-component of optical coherence tomography (OCT) microsystem, consists of a microlens doublet, a MOEMS Z-scanner, a focusadjustment spacer and a beam splitter plate. For the integration of this MOEMS device heterogeneous bonding of Si, glass and SOI wafers is necessary. Previously, most of the existing methods for multilayer wafer bonding require annealing at high temperature, i.e., 1100°C. To be compatible with MEMS devices, bonding of different material stacks at temperatures lower than 400°C has also been investigated. However, if more components are involved, it becomes less effective due to the alignment accuracy or degradation of surface quality of the not-bonded side after each bonding operation. The proposed technology focuses on 3D integration of heterogeneous building blocks, where the assembly process is compatible with the materials of each wafer stack and with position accuracy which fits optical requirement. A demonstrator with up to 5 wafers bonded lower than 400°C is presented and bond interfaces are evaluated. To avoid the complexity of through wafer vias, a design which creates electrical connections along vertical direction by mounting a wafer stack on a flip chip PCB is proposed. The approach, which adopts vertically-stacked wafers along with electrical connection functionality, provides not only a space-effective integration of MOEMS device but also a design where the Mirau stack can be further integrated with other components of the OCT microsystem easily.

  19. Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit

    NASA Astrophysics Data System (ADS)

    Brecht, T.; Chu, Y.; Axline, C.; Pfaff, W.; Blumoff, J. Z.; Chou, K.; Krayzman, L.; Frunzio, L.; Schoelkopf, R. J.

    2017-04-01

    We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave-integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric-field picture and a circuit model, and obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage-cavity lifetime of 34.3 μ s , corresponding to a quality factor of 2 ×106 at single-photon energies. The transmon coherence times are T1=6.4 μ s , and T2echo=11.7 μ s . We measure qubit-cavity dispersive coupling with a rate χq μ/2 π =-1.17 MHz , constituting a Jaynes-Cummings system with an interaction strength g /2 π =49 MHz . With these parameters we are able to demonstrate circuit-QED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.

  20. Polyimide as a versatile enabling material for microsystems fabrication: surface micromachining and electrodeposited nanowires integration

    NASA Astrophysics Data System (ADS)

    Walewyns, Thomas; Reckinger, Nicolas; Ryelandt, Sophie; Pardoen, Thomas; Raskin, Jean-Pierre; Francis, Laurent A.

    2013-09-01

    The interest of using polyimide as a sacrificial and anchoring layer is demonstrated for post-processing surface micromachining and for the incorporation of metallic nanowires into microsystems. In addition to properties like a high planarization factor, a good resistance to most non-oxidizing acids and bases, and CMOS compatibility, polyimide can also be used as a mold for nanostructures after ion track-etching. Moreover, specific polyimide grades, such as PI-2611 from HD Microsystems™, involve a thermal expansion coefficient similar to silicon and low internal stress. The process developed in this study permits higher gaps compared to the state-of-the-art, limits stiction problems with the substrate and is adapted to various top-layer materials. Most metals, semiconductors or ceramics will not be affected by the oxygen plasma required for polyimide etching. Released structures with vertical gaps from one to several tens of μm have been obtained, possibly using multiple layers of polyimide. Furthermore, patterned freestanding nanowires have been synthesized with diameters from 20 to 60 nm and up to 3 μm in length. These results have been applied to the fabrication of two specific devices: a generic nanomechanical testing lab-on-chip platform and a miniaturized ionization sensor.

  1. Influence of the initial surface texture on the resulting surface roughness and waviness for micro-machining with ultra-short laser pulses (Conference Presentation)

    NASA Astrophysics Data System (ADS)

    Remund, Stefan M.; Jaeggi, Beat; Kramer, Thorsten; Neuenschwander, Beat

    2017-03-01

    The resulting surface roughness and waviness after processing with ultra-short pulsed laser radiation depend on the laser parameters as well as on the machining strategy and the scanning system. However the results depend on the material and its initial surface quality and finishing as well. The improvement of surface finishing represents effort and produces additional costs. For industrial applications it is important to reduce the preparation of a workpiece for laser micro-machining to optimize quality and reduce costs. The effects of the ablation process and the influence of the machining strategy and scanning system onto the surface roughness and waviness can be differenced due to their separate manner. By using the optimal laser parameters on an initially perfect surface, the ablation process mainly increases the roughness to a certain value for most metallic materials. However, imperfections in the scanning system causing a slight variation in the scanning speed lead to a raise of the waviness on the sample surface. For a basic understanding of the influence of grinding marks, the sample surfaces were initially furnished with regular grooves of different depths and spatial frequencies to gain a homogenous and well-defined original surface. On these surfaces the effect of different beam waists and machining strategy are investigated and the results are compared with a simulation of the process. Furthermore the behaviors of common surface finishes used in industrial applications for laser micro-machining are studied and the relation onto the resulting surface roughness and waviness is presented.

  2. Modeling and experimental study on characterization of micromachined thermal gas inertial sensors.

    PubMed

    Zhu, Rong; Ding, Henggao; Su, Yan; Yang, Yongjun

    2010-01-01

    Micromachined thermal gas inertial sensors based on heat convection are novel devices that compared with conventional micromachined inertial sensors offer the advantages of simple structures, easy fabrication, high shock resistance and good reliability by virtue of using a gaseous medium instead of a mechanical proof mass as key moving and sensing elements. This paper presents an analytical modeling for a micromachined thermal gas gyroscope integrated with signal conditioning. A simplified spring-damping model is utilized to characterize the behavior of the sensor. The model relies on the use of the fluid mechanics and heat transfer fundamentals and is validated using experimental data obtained from a test-device and simulation. Furthermore, the nonideal issues of the sensor are addressed from both the theoretical and experimental points of view. The nonlinear behavior demonstrated in experimental measurements is analyzed based on the model. It is concluded that the sources of nonlinearity are mainly attributable to the variable stiffness of the sensor system and the structural asymmetry due to nonideal fabrication.

  3. Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices.

    PubMed

    Alapan, Yunus; Hasan, Muhammad Noman; Shen, Richang; Gurkan, Umut A

    2015-05-01

    Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing.

  4. Three-Dimensional Printing Based Hybrid Manufacturing of Microfluidic Devices

    PubMed Central

    Shen, Richang; Gurkan, Umut A.

    2016-01-01

    Microfluidic platforms offer revolutionary and practical solutions to challenging problems in biology and medicine. Even though traditional micro/nanofabrication technologies expedited the emergence of the microfluidics field, recent advances in advanced additive manufacturing hold significant potential for single-step, stand-alone microfluidic device fabrication. One such technology, which holds a significant promise for next generation microsystem fabrication is three-dimensional (3D) printing. Presently, building 3D printed stand-alone microfluidic devices with fully embedded microchannels for applications in biology and medicine has the following challenges: (i) limitations in achievable design complexity, (ii) need for a wider variety of transparent materials, (iii) limited z-resolution, (iv) absence of extremely smooth surface finish, and (v) limitations in precision fabrication of hollow and void sections with extremely high surface area to volume ratio. We developed a new way to fabricate stand-alone microfluidic devices with integrated manifolds and embedded microchannels by utilizing a 3D printing and laser micromachined lamination based hybrid manufacturing approach. In this new fabrication method, we exploit the minimized fabrication steps enabled by 3D printing, and reduced assembly complexities facilitated by laser micromachined lamination method. The new hybrid fabrication method enables key features for advanced microfluidic system architecture: (i) increased design complexity in 3D, (ii) improved control over microflow behavior in all three directions and in multiple layers, (iii) transverse multilayer flow and precisely integrated flow distribution, and (iv) enhanced transparency for high resolution imaging and analysis. Hybrid manufacturing approaches hold great potential in advancing microfluidic device fabrication in terms of standardization, fast production, and user-independent manufacturing. PMID:27512530

  5. Monolithic CMUT-on-CMOS integration for intravascular ultrasound applications.

    PubMed

    Zahorian, Jaime; Hochman, Michael; Xu, Toby; Satir, Sarp; Gurun, Gokce; Karaman, Mustafa; Degertekin, F Levent

    2011-12-01

    One of the most important promises of capacitive micromachined ultrasonic transducer (CMUT) technology is integration with electronics. This approach is required to minimize the parasitic capacitances in the receive mode, especially in catheter-based volumetric imaging arrays, for which the elements must be small. Furthermore, optimization of the available silicon area and minimized number of connections occurs when the CMUTs are fabricated directly above the associated electronics. Here, we describe successful fabrication and performance evaluation of CMUT arrays for intravascular imaging on custom-designed CMOS receiver electronics from a commercial IC foundry. The CMUT-on-CMOS process starts with surface isolation and mechanical planarization of the CMOS electronics to reduce topography. The rest of the CMUT fabrication is achieved by modifying a low-temperature micromachining process through the addition of a single mask and developing a dry etching step to produce sloped sidewalls for simple and reliable CMUT-to-CMOS interconnection. This CMUT-to-CMOS interconnect method reduced the parasitic capacitance by a factor of 200 when compared with a standard wire-bonding method. Characterization experiments indicate that the CMUT-on-CMOS elements are uniform in frequency response and are similar to CMUTs simultaneously fabricated on standard silicon wafers without electronics integration. Ex- periments on a 1.6-mm-diameter dual-ring CMUT array with a center frequency of 15 MHz show that both the CMUTs and the integrated CMOS electronics are fully functional. The SNR measurements indicate that the performance is adequate for imaging chronic total occlusions located 1 cm from the CMUT array.

  6. Capacitive micromachined ultrasonic transducers for medical imaging and therapy.

    PubMed

    Khuri-Yakub, Butrus T; Oralkan, Omer

    2011-05-01

    Capacitive micromachined ultrasonic transducers (CMUTs) have been subject to extensive research for the last two decades. Although they were initially developed for air-coupled applications, today their main application space is medical imaging and therapy. This paper first presents a brief description of CMUTs, their basic structure, and operating principles. Our progression of developing several generations of fabrication processes is discussed with an emphasis on the advantages and disadvantages of each process. Monolithic and hybrid approaches for integrating CMUTs with supporting integrated circuits are surveyed. Several prototype transducer arrays with integrated frontend electronic circuits we developed and their use for 2-D and 3-D, anatomical and functional imaging, and ablative therapies are described. The presented results prove the CMUT as a MEMS technology for many medical diagnostic and therapeutic applications.

  7. Capacitive micromachined ultrasonic transducers for medical imaging and therapy

    PubMed Central

    Khuri-Yakub, Butrus T.; Oralkan, Ömer

    2011-01-01

    Capacitive micromachined ultrasonic transducers (CMUTs) have been subject to extensive research for the last two decades. Although they were initially developed for air-coupled applications, today their main application space is medical imaging and therapy. This paper first presents a brief description of CMUTs, their basic structure, and operating principles. Our progression of developing several generations of fabrication processes is discussed with an emphasis on the advantages and disadvantages of each process. Monolithic and hybrid approaches for integrating CMUTs with supporting integrated circuits are surveyed. Several prototype transducer arrays with integrated frontend electronic circuits we developed and their use for 2-D and 3-D, anatomical and functional imaging, and ablative therapies are described. The presented results prove the CMUT as a MEMS technology for many medical diagnostic and therapeutic applications. PMID:21860542

  8. Monolithic Micromachined Quartz Resonator based Infrared Focal Plane Arrays

    DTIC Science & Technology

    2012-05-05

    following categories: PaperReceived Ping Kao, Srinivas Tadigadapa. Micromachined quartz resonator based infrared detector array, Sensors and...0. doi: 10.1088/0957-0233/20/12/124007 2012/05/08 19:47:37 6 S Tadigadapa, K Mateti. Piezoelectric MEMS sensors : state-of-the-art and perspectives...Ping Kao, David L. Allara, Srinivas Tadigadapa. Study of Adsorption of Globular Proteins on Hydrophobic Surfaces, IEEE Sensors Journal, (11 2011): 0

  9. Nanosecond pulsed laser micromachining for experimental fatigue life study of Ti-3Al-2.5V tubes

    NASA Astrophysics Data System (ADS)

    Lin, Yaomin; Gupta, Mool C.; Taylor, Robert E.; Lei, Charles; Stone, William; Spidel, Tom; Yu, Michael; Williams, Reanne

    2009-01-01

    Defects on external surface of in-service hydraulic tubes can reduce total life cycles for operation. Evaluation of fatigue life of the tubes with damage is thus critical for safety reasons. A methodology of generating defects in the Ti-3Al-2.5V tube—a widely used pipeline in hydraulic systems of aircrafts—using nanosecond pulsed laser for experimental fatigue life study is described in this paper. Straight tubes of five different sizes were laser micromachined to generate notches of given length and depths on the outside surface. Approaches were developed to precisely control the notch dimensions. The laser-notched tubes were tested with cyclic internal impulse pressure and fatigue life was measured. The laser notches and fatigue cracks were characterized after the test. It is concluded that laser micromachining generated consistent notches, and the influence of notch depth on fatigue life of the tube is significant. Based on the experimental test results, the relationship between the fatigue life of the Ti-3Al-2.5V tube and the notch depth was revealed. The research demonstrated that laser micromachining is applicable for experimental fatigue life study of titanium tubes. The presented test data are useful for estimating the damage limits of the titanium tubes in service environment and for further theoretical studies.

  10. Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

    NASA Astrophysics Data System (ADS)

    Wu, Mingching; Fang, Weileun

    2005-03-01

    This work integrates multi-depth DRIE etching, trench-refilled molding, two poly-Si layers MUMPs and bulk releasing to improve the variety and performance of MEMS devices. In summary, the present fabrication process, named MOSBE II, has three merits. First, this process can monolithically fabricate and integrate poly-Si thin-film structures with different thicknesses and stiffnesses, such as the flexible spring and the stiff mirror plate. Second, multi-depth structures, such as vertical comb electrodes, are available from the DRIE processes. Third, a cavity under the micromachined device is provided by the bulk silicon etching process, so that a large out-of-plane motion is allowed. In application, an optical scanner driven by the self-aligned vertical comb actuator was demonstrated. The poly-Si micromachined components fabricated by MOSBE II can further integrate with the MUMPs devices to establish a more powerful MOEMS platform.

  11. Micromachined silicon cantilevers with integrated high-frequency magnetoimpedance sensors for simultaneous strain and magnetic field detection

    NASA Astrophysics Data System (ADS)

    Buettel, G.; Joppich, J.; Hartmann, U.

    2017-12-01

    Giant magnetoimpedance (GMI) measurements in the high-frequency regime utilizing a coplanar waveguide with an integrated Permalloy multilayer and micromachined on a silicon cantilever are reported. The fabrication process is described in detail. The aspect ratio of the magnetic multilayer in the magnetoresistive and magnetostrictive device was varied. Tensile strain and compressive strain were applied. Vector network analyzer measurements in the range from the skin effect to ferromagnetic resonance confirm the technological potential of GMI-based micro-electro-mechanical devices for strain and magnetic field sensing applications. The strain-impedance gauge factor was quantified by finite element strain calculations and reaches a maximum value of almost 200.

  12. MEMS testing and applications in automotive and aerospace industries

    NASA Astrophysics Data System (ADS)

    Ma, Zhichun; Chen, Xuyuan

    2009-05-01

    MEMS technology combines micromachining and integrated circuit fabrication technologies to produce highly reliable MEMS transducers. This paper presents an overview of MEMS transducers applications, particularly in automotive and aerospace industries, which includes inertia sensors for safety, navigation, and guidance control, thermal anemometer for temperature and heat-flux sensors in engine applications, MEMS atomizers for fuel injection, and micromachined actuators for flow control applications. Design examples for the devices in above mentioned applications are also presented and test results are given.

  13. Integration of a UV curable polymer lens and MUMPs structures on a SOI optical bench

    NASA Astrophysics Data System (ADS)

    Hsieh, Jerwei; Hsiao, Sheng-Yi; Lai, Chun-Feng; Fang, Weileun

    2007-08-01

    This work presents the design concept of integrating a polymer lens, poly-Si MUMPs and single-crystal-silicon HARM structures on a SOI wafer to form a silicon optical bench. This approach enables the monolithic integration of various optical components on the wafer so as to improve the design flexibility of the silicon optical bench. Fabrication processes, including surface and bulk micromachining on the SOI wafer, have been established to realize bi-convex spherical polymer lenses with in-plane as well as out-of-plane optical axes. In addition, a micro device consisting of an in-plane polymer lens, a thick fiber holder and a mechanical shutter driven by an electrothermal actuator is also demonstrated using the present approach. In summary, this study significantly improves the design flexibility as well as the functions of SiOBs.

  14. Surface-micromachined microfluidic devices

    DOEpatents

    Galambos, Paul C.; Okandan, Murat; Montague, Stephen; Smith, James H.; Paul, Phillip H.; Krygowski, Thomas W.; Allen, James J.; Nichols, Christopher A.; Jakubczak, II, Jerome F.

    2003-01-01

    Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators.

  15. Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology

    NASA Astrophysics Data System (ADS)

    Smith, James H.; Rodgers, M. Steven; Sniegowski, Jeffry J.; Miller, Samuel L.; Hetherington, Dale L.; McWhorter, Paul J.; Warren, Mial E.

    1998-09-01

    We recently reported on the development of a 5-level polysilicon surface micromachine fabrication process consisting of four levels of mechanical poly plus an electrical interconnect layer and its application to complex mechanical systems. This paper describes the application of this technology to create micro-optical systems-on-a-chip. These are demonstration systems, which show that give levels of polysilicon provide greater performance, reliability, and significantly increased functionality. This new technology makes it possible to realize levels of system complexity that have so far only existed on paper, while simultaneously adding to the robustness of many of the individual subassemblies.

  16. Applications of picosecond lasers and pulse-bursts in precision manufacturing

    NASA Astrophysics Data System (ADS)

    Knappe, Ralf

    2012-03-01

    Just as CW and quasi-CW lasers have revolutionized the materials processing world, picosecond lasers are poised to change the world of micromachining, where lasers outperform mechanical tools due to their flexibility, reliability, reproducibility, ease of programming, and lack of mechanical force or contamination to the part. Picosecond lasers are established as powerful tools for micromachining. Industrial processes like micro drilling, surface structuring and thin film ablation benefit from a process, which provides highest precision and minimal thermal impact for all materials. Applications such as microelectronics, semiconductor, and photovoltaic industries use picosecond lasers for maximum quality, flexibility, and cost efficiency. The range of parts, manufactured with ps lasers spans from microscopic diamond tools over large printing cylinders with square feet of structured surface. Cutting glass for display and PV is a large application, as well. With a smart distribution of energy into groups of ps-pulses at ns-scale separation (known as burst mode) ablation rates can be increased by one order of magnitude or more for some materials, also providing a better surface quality under certain conditions. The paper reports on the latest results of the laser technology, scaling of ablation rates, and various applications in ps-laser micromachining.

  17. Omega-X micromachining system

    DOEpatents

    Miller, Donald M.

    1978-01-01

    A micromachining tool system with X- and omega-axes is used to machine spherical, aspherical, and irregular surfaces with a maximum contour error of 100 nonometers (nm) and surface waviness of no more than 0.8 nm RMS. The omega axis, named for the angular measurement of the rotation of an eccentric mechanism supporting one end of a tool bar, enables the pulse increments of the tool toward the workpiece to be as little as 0 to 4.4 nm. A dedicated computer coordinates motion in the two axes to produce the workpiece contour. Inertia is reduced by reducing the mass pulsed toward the workpiece to about one-fifth of its former value. The tool system includes calibration instruments to calibrate the micromachining tool system. Backlash is reduced and flexing decreased by using a rotary table and servomotor to pulse the tool in the omega-axis instead of a ball screw mechanism. A thermally-stabilized spindle rotates the workpiece and is driven by a motor not mounted on the micromachining tool base through a torque-smoothing pulley and vibrationless rotary coupling. Abbe offset errors are almost eliminated by tool setting and calibration at spindle center height. Tool contour and workpiece contour are gaged on the machine; this enables the source of machining errors to be determined more readily, because the workpiece is gaged before its shape can be changed by removal from the machine.

  18. CMOS-micromachined, two-dimenisional transistor arrays for neural recording and stimulation.

    PubMed

    Lin, J S; Chang, S R; Chang, C H; Lu, S C; Chen, H

    2007-01-01

    In-plane microelectrode arrays have proven to be useful tools for studying the connectivities and the functions of neural tissues. However, seldom microelectrode arrays are monolithically-integrated with signal-processing circuits, without which the maximum number of electrodes is limited by the compromise with routing complexity and interferences. This paper proposes a CMOS-compatible, two-dimensional array of oxide-semiconductor field-effect transistors(OSFETs), capable of both recording and stimulating neuronal activities. The fabrication of the OSFETs not only requires simply die-level, post-CMOS micromachining process, but also retains metal layers for monolithic integration with signal-processing circuits. A CMOS microsystem containing the OSFET arrays and gain-programmable recording circuits has been fabricated and tested. The preliminary testing results are presented and discussed.

  19. Damping control of micromachined lowpass mechanical vibration isolation filters using electrostatic actuation with electronic signal processing

    NASA Astrophysics Data System (ADS)

    Dean, Robert; Flowers, George; Sanders, Nicole; MacAllister, Ken; Horvath, Roland; Hodel, A. S.; Johnson, Wayne; Kranz, Michael; Whitley, Michael

    2005-05-01

    Some harsh environments, such as those encountered by aerospace vehicles and various types of industrial machinery, contain high frequency/amplitude mechanical vibrations. Unfortunately, some very useful components are sensitive to these high frequency mechanical vibrations. Examples include MEMS gyroscopes and resonators, oscillators and some micro optics. Exposure of these components to high frequency mechanical vibrations present in the operating environment can result in problems ranging from an increased noise floor to component failure. Passive micromachined silicon lowpass filter structures (spring-mass-damper) have been demonstrated in recent years. However, the performance of these filter structures is typically limited by low damping (especially if operated in near-vacuum environments) and a lack of tunability after fabrication. Active filter topologies, such as piezoelectric, electrostrictive-polymer-film and SMA have also been investigated in recent years. Electrostatic actuators, however, are utilized in many micromachined silicon devices to generate mechanical motion. They offer a number of advantages, including low power, fast response time, compatibility with silicon micromachining, capacitive position measurement and relative simplicity of fabrication. This paper presents an approach for realizing active micromachined mechanical lowpass vibration isolation filters by integrating an electrostatic actuator with the micromachined passive filter structure to realize an active mechanical lowpass filter. Although the electrostatic actuator can be used to adjust the filter resonant frequency, the primary application is for increasing the damping to an acceptable level. The physical size of these active filters is suitable for use in or as packaging for sensitive electronic and MEMS devices, such as MEMS vibratory gyroscope chips.

  20. Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography

    NASA Astrophysics Data System (ADS)

    Varadan, Vijay K.; Xie, Jining

    2003-04-01

    Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to look for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalised nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalised by oxidation. The UV curable polymer was prepared from toluene diisocyantae (TDI), functionalised nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalised nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.

  1. Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography

    NASA Astrophysics Data System (ADS)

    Varadan, Vijay K.; Xie, Jining

    2002-11-01

    Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important numberof layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polyers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-sity polumerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery engines, pump coolants and refrigerants for local cooling of electronic components.

  2. Three-dimensional polymer MEMS with functionalized carbon nanotubes by microstereolithography

    NASA Astrophysics Data System (ADS)

    Varadan, Vijay K.; Xie, Jining

    2003-01-01

    Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to look for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2 hydroxyethyl methacrylate (HEMA). The chemical bonds between NCO groups of TDI and OH, COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.

  3. Microstereolithography for polymer-based based MEMS

    NASA Astrophysics Data System (ADS)

    Varadan, Vijay K.; Xie, Jining

    2003-07-01

    Microfabrication techniques such as bulk micromachining and surface micromachining currently employed to conceive MEMS are largely derived from the standard IC and microelectronics technology. Even though many MEMS devices with integrated electronics have been achieved by using the traditional micromachining techniques, some limitations have nevertheless to be underlined: 1) these techniques are very expensive and need specific installations as well as a cleanroom environment, 2) the materials that can be used up to now are restricted to silicon and metals, 3) the manufacture of 3D parts having curved surfaces or an important number of layers is not possible. Moreover, for some biological applications, the materials used for sensors must be compatible with human body and the actuators need to have high strain and displacement which the current silicon based MEMS do not provide. It is thus natural for the researchers to 'look' for alternative methods such as Microstereolithography (MSL) to make 3D sensors and actuators using polymeric based materials. For MSL techniques to be successful as their silicon counterparts, one has to come up with multifunctional polymers with electrical properties comparable to silicon. These multifunctional polymers should not only have a high sensing capability but also a high strain and actuation performance. A novel UV-curable polymer uniformly bonded with functionalized nanotubes was synthesized via a modified three-step in-situ polymerization. Purified multi-walled nanotubes, gained from the microwave chemical vapor deposition method, were functionalized by oxidation. The UV curable polymer was prepared from toluene diisocyanate (TDI), functionalized nanotubes, and 2-hydroxyethyl methacrylate (HEMA). The chemical bonds between -NCO groups of TDI and -OH, -COOH groups of functionalized nanotubes help for conceiving polymeric based MEMS devices. A cost effective fabrication techniques was presented using Micro Stereo Lithography and an example of a micropump was also described. The wireless concept of the device has many applications including implanted medical delivery systems, chemical and biological instruments, fluid delivery in engines, pump coolants and refrigerants for local cooling of electronic components.

  4. Piezoelectric Micromachined Ultrasound Transducer (PMUT) Arrays for Integrated Sensing, Actuation and Imaging

    PubMed Central

    Qiu, Yongqiang; Gigliotti, James V.; Wallace, Margeaux; Griggio, Flavio; Demore, Christine E. M.; Cochran, Sandy; Trolier-McKinstry, Susan

    2015-01-01

    Many applications of ultrasound for sensing, actuation and imaging require miniaturized and low power transducers and transducer arrays integrated with electronic systems. Piezoelectric micromachined ultrasound transducers (PMUTs), diaphragm-like thin film flexural transducers typically formed on silicon substrates, are a potential solution for integrated transducer arrays. This paper presents an overview of the current development status of PMUTs and a discussion of their suitability for miniaturized and integrated devices. The thin film piezoelectric materials required to functionalize these devices are discussed, followed by the microfabrication techniques used to create PMUT elements and the constraints the fabrication imposes on device design. Approaches for electrical interconnection and integration with on-chip electronics are discussed. Electrical and acoustic measurements from fabricated PMUT arrays with up to 320 diaphragm elements are presented. The PMUTs are shown to be broadband devices with an operating frequency which is tunable by tailoring the lateral dimensions of the flexural membrane or the thicknesses of the constituent layers. Finally, the outlook for future development of PMUT technology and the potential applications made feasible by integrated PMUT devices are discussed. PMID:25855038

  5. Piezoelectric micromachined ultrasound transducer (PMUT) arrays for integrated sensing, actuation and imaging.

    PubMed

    Qiu, Yongqiang; Gigliotti, James V; Wallace, Margeaux; Griggio, Flavio; Demore, Christine E M; Cochran, Sandy; Trolier-McKinstry, Susan

    2015-04-03

    Many applications of ultrasound for sensing, actuation and imaging require miniaturized and low power transducers and transducer arrays integrated with electronic systems. Piezoelectric micromachined ultrasound transducers (PMUTs), diaphragm-like thin film flexural transducers typically formed on silicon substrates, are a potential solution for integrated transducer arrays. This paper presents an overview of the current development status of PMUTs and a discussion of their suitability for miniaturized and integrated devices. The thin film piezoelectric materials required to functionalize these devices are discussed, followed by the microfabrication techniques used to create PMUT elements and the constraints the fabrication imposes on device design. Approaches for electrical interconnection and integration with on-chip electronics are discussed. Electrical and acoustic measurements from fabricated PMUT arrays with up to 320 diaphragm elements are presented. The PMUTs are shown to be broadband devices with an operating frequency which is tunable by tailoring the lateral dimensions of the flexural membrane or the thicknesses of the constituent layers. Finally, the outlook for future development of PMUT technology and the potential applications made feasible by integrated PMUT devices are discussed.

  6. Separation and Detection of Toxic Gases with a Silicon Micromachined Gas Chromatography System

    NASA Technical Reports Server (NTRS)

    Kolesar, Edward S.; Reston, Rocky R.

    1995-01-01

    A miniature gas chromatography (GC) system was designed and fabricated using silicon micromachining and integrated circuit (IC) processing techniques. The silicon micromachined gas chromatography system (SMGCS) is composed of a miniature sample injector that incorporates a 10 microliter sample loop; a 0.9 meter long, rectangular shaped (300 micrometer width and 10 micrometer height) capillary column coated with a 0.2 micrometer thick copper phthalocyanine (CuPc) stationary phase; and a dual detector scheme based upon a CuPc-coated chemiresistor and a commercially available 125 micrometer diameter thermal conductivity detector (TCD) bead. Silicon micromachining was employed to fabricate the interface between the sample injector and the GC column, the column itself, and the dual detector cavity. A novel IC thin-film processing technique was developed to sublime the CuPc stationary phase coating on the column walls that were micromachined in the host silicon wafer substrate and Pyrex (r) cover plate, which were then electrostatically bonded together. The SMGCS can separate binary gas mixtures composed of parts-per-million (ppm) concentrations of ammonia (NH3) and nitrogen dioxide (NO2) when isothermally operated (55-80 degrees C). With a helium carrier gas and nitrogen diluent, a 10 microliter sample volume containing ammonia and nitrogen dioxide injected at 40 psi ((2.8 x 10(exp 5)Pa)) can be separated in less than 30 minutes.

  7. An Integrated 520-600 GHz Sub-Harmonic Mixer and Tripler Combination Based on GaAs MMIC Membrane Planar Schottky Diodes

    NASA Technical Reports Server (NTRS)

    Thomas, B.; Gill, J.; Maestrini, A.; Lee, C.; Lin, R.; Sin, S.; Peralta, A.; Mehdi, I.

    2011-01-01

    We present here the design, development and test of an integrated sub-millimeter front-end featuring a 520-600 GHz sub-harmonic mixer and a 260-300 GHz frequency tripler in a single cavity. Both devices used GaAs MMIC membrane planar Schottky diode technology. The sub-harmonic mixer/tripler circuit has been tested using conventional machined as well as silicon micro-machined blocks. Measurement results on the metal block give best DSB mixer noise temperature of 2360 K and conversion losses of 7.7 dB at 520 GHz. Preliminary results on the silicon micro-machined blocks give a DSB mixer noise temperature of 4860 K and conversion losses of 12.16 dB at 540 GHz. The LO input power required to pump the integrated tripler/sub-harmonic mixer for both packages is between 30 and 50 mW

  8. An Integrated 520-600 GHz Sub-Harmonic Mixer and Tripler Combination Based on GaAs MMIC Membrane Planar Schottky Diodes

    NASA Technical Reports Server (NTRS)

    Thomas, B.; Gill, J.; Maestrini, A.; Lee, C.; Lin, R.; Sin, S.; Peralta, A.; Mehdi, I.

    2010-01-01

    We present here the design, development and test of an integrated sub-millimeter front-end featuring a 520-600 GHz sub-harmonic mixer and a 260-300 GHz frequency tripler in a single cavity. Both devices used GaAs MMIC membrane planar Schottky diode technology. The sub-harmonic mixer/tripler circuit has been tested using conventional machined as well as silicon micro-machined blocks. Measurement results on the metal block give best DSB mixer noise temperature of 2360 K and conversion losses of 7.7 dB at 520 GHz. Preliminary results on the silicon micro-machined blocks give a DSB mixer noise temperature of 4860 K and conversion losses of 12.16 dB at 540 GHz. The LO input power required to pump the integrated tripler/sub-harmonic mixer for both packages is between 30 and 50 mW.

  9. Optical Micromachining

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Under an SBIR (Small Business Innovative Research) with Marshall Space Flight Center, Potomac Photonics, Inc., constructed and demonstrated a unique tool that fills a need in the area of diffractive and refractive micro-optics. It is an integrated computer-aided design and computer-aided micro-machining workstation that will extend the benefits of diffractive and micro-optic technology to optical designers. Applications of diffractive optics include sensors and monitoring equipment, analytical instruments, and fiber optic distribution and communication. The company has been making diffractive elements with the system as a commercial service for the last year.

  10. Micromachined Precision Inertial Instruments

    DTIC Science & Technology

    2003-11-01

    vol. 40, pp. 903-908, 1993. [9] J. D. Zook, D. W. Burns, H. Guckel, J. J. Sniegowski, R . L. Engelstad, and Z. Feng, "Characteristics of polysilicon...285-288, 2000. [14] B. E. Boser and R . T. Howe, "Surface micromachined accelerometers," IEEE Journal of Solid-State Circuits, vol. 31, pp. 366-375...pp. 81-84, 2003. [23] I. O. Inc., "Si-Flex 1500-ULND Evaluation Board, Single Channel Digital Output," 2003. [24] H. Luo, G. K. Fedder, and L. R

  11. The Mathematical Modeling and Computer Simulation of Electrochemical Micromachining Using Ultrashort Pulses

    NASA Astrophysics Data System (ADS)

    Kozak, J.; Gulbinowicz, D.; Gulbinowicz, Z.

    2009-05-01

    The need for complex and accurate three dimensional (3-D) microcomponents is increasing rapidly for many industrial and consumer products. Electrochemical machining process (ECM) has the potential of generating desired crack-free and stress-free surfaces of microcomponents. This paper reports a study of pulse electrochemical micromachining (PECMM) using ultrashort (nanoseconds) pulses for generating complex 3-D microstructures of high accuracy. A mathematical model of the microshaping process with taking into consideration unsteady phenomena in electrical double layer has been developed. The software for computer simulation of PECM has been developed and the effects of machining parameters on anodic localization and final shape of machined surface are presented.

  12. The influence of ArF excimer laser micromachining on physicochemical properties of bioresorbable poly(L-lactide)

    NASA Astrophysics Data System (ADS)

    Stepak, Bogusz D.; Antończak, Arkadiusz J.; Szustakiewicz, Konrad; Pezowicz, Celina; Abramski, Krzysztof M.

    2016-03-01

    The main advantage of laser processing is a non-contact character of material removal and high precision attainable thanks to low laser beam dimensions. This technique enables forming a complex, submillimeter geometrical shapes such as vascular stents which cannot be manufactured using traditional techniques e.g. injection moulding or mechanical treatment. In the domain of nanosecond laser sources, an ArF excimer laser appears as a good candidate for laser micromachining of bioresorbable polymers such as poly(L-lactide). Due to long pulse duration, however, there is a risk of heat diffusion and accumulation in the material. In addition, due to short wavelength (193 nm) photochemical process can modify the chemical composition of ablated surfaces. The motivation for this research was to evaluate the influence of laser micromachining on physicochemical properties of poly(L-lactide). We performed calorimetric analysis of laser machined samples by using differential scanning calorimetry (DSC). It allowed us to find the optimal process parameters for heat affected zone (HAZ) reduction. The chemical composition of the ablated surface was investigated by FTIR in attenuated total reflectance (ATR) mode.

  13. Stress-induced curvature engineering in surface-micromachined devices

    NASA Astrophysics Data System (ADS)

    Aksyuk, Vladimir A.; Pardo, Flavio; Bishop, David J.

    1999-03-01

    Residual stress and stress gradients play an important role in determining equilibrium shape and behavior of various Si surface-micromachined devices under applied loads. This is particularly true for system having large-area plates and long beams where curvature resulting from stress can lead to significant deviations from stress-free shape. To gain better understanding of these properties, we have measured the equilibrium shapes of various structures built on the MCNC MUMPs using an interferometric profiler. The structures were square plates and long beams composed of various combinations of polysilicon an oxide layers. Some of the structures had additional MUMPs metal layer on top, while on others in-house chromium-gold stacks of varying thickness have been deposited. Temperature dependence of the curvature was measured for some plates. We have used these data in conjunction with simple models to significantly improve the performance of our micromachined devices. While for some structures such as large area reflectors the curvature had to be minimized, it could be advantageously exploited by others, for example vertical actuators for self-assembly.

  14. Process for laser machining and surface treatment

    DOEpatents

    Neil, George R.; Shinn, Michelle D.

    2004-10-26

    An improved method and apparatus increasing the accuracy and reducing the time required to machine materials, surface treat materials, and allow better control of defects such as particulates in pulsed laser deposition. The speed and quality of machining is improved by combining an ultrashort pulsed laser at high average power with a continuous wave laser. The ultrashort pulsed laser provides an initial ultrashort pulse, on the order of several hundred femtoseconds, to stimulate an electron avalanche in the target material. Coincident with the ultrashort pulse or shortly after it, a pulse from a continuous wave laser is applied to the target. The micromachining method and apparatus creates an initial ultrashort laser pulse to ignite the ablation followed by a longer laser pulse to sustain and enlarge on the ablation effect launched in the initial pulse. The pulse pairs are repeated at a high pulse repetition frequency and as often as desired to produce the desired micromachining effect. The micromachining method enables a lower threshold for ablation, provides more deterministic damage, minimizes the heat affected zone, minimizes cracking or melting, and reduces the time involved to create the desired machining effect.

  15. Vascular tissue engineering by computer-aided laser micromachining.

    PubMed

    Doraiswamy, Anand; Narayan, Roger J

    2010-04-28

    Many conventional technologies for fabricating tissue engineering scaffolds are not suitable for fabricating scaffolds with patient-specific attributes. For example, many conventional technologies for fabricating tissue engineering scaffolds do not provide control over overall scaffold geometry or over cell position within the scaffold. In this study, the use of computer-aided laser micromachining to create scaffolds for vascular tissue networks was investigated. Computer-aided laser micromachining was used to construct patterned surfaces in agarose or in silicon, which were used for differential adherence and growth of cells into vascular tissue networks. Concentric three-ring structures were fabricated on agarose hydrogel substrates, in which the inner ring contained human aortic endothelial cells, the middle ring contained HA587 human elastin and the outer ring contained human aortic vascular smooth muscle cells. Basement membrane matrix containing vascular endothelial growth factor and heparin was to promote proliferation of human aortic endothelial cells within the vascular tissue networks. Computer-aided laser micromachining provides a unique approach to fabricate small-diameter blood vessels for bypass surgery as well as other artificial tissues with complex geometries.

  16. Enhancement of structural stiffness in MEMS structures

    NASA Astrophysics Data System (ADS)

    Ilias, Samir; Picard, Francis; Topart, Patrice; Larouche, Carl; Jerominek, Hubert

    2006-01-01

    Many optical applications require smooth micromirror reflective surfaces with large radius of curvature. Usually when using surface micromachining technology and as a result of residual stress and stress gradient in thin films, the control of residual curvature is a difficult task. In this work, two engineering approaches were developed to enhance structural stiffness of micromirrors. 1) By integrating stiffening structures and thermal annealing. The stiffening structures consist of U-shaped profiles integrated with the mirror (dimension 200×300 μm2). 2) By combining selective electroplating and flip-chip based technologies. Nickel was used as electroplated material with optimal stress values around +/-10 MPa for layer thicknesses of about 10 μm. With the former approach, typical curvature radii of about 1.5 cm and 0.6 cm along mirror width and length were obtained, respectively. With the latter approach, an important improvement in the micromirror planarity and flatness was achieved with curvature radius up to 23 cm and roughness lower than 5 nm rms for typical 1000×1000 μm2 micromirrors.

  17. Surface-Micromachined Microfluidic Devices

    DOEpatents

    Galambos, Paul C.; Okandan, Murat; Montague, Stephen; Smith, James H.; Paul, Phillip H.; Krygowski, Thomas W.; Allen, James J.; Nichols, Christopher A.; Jakubczak, II, Jerome F.

    2004-09-28

    Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators. Microfluidic devices are disclosed which can be manufactured using surface-micromachining. These devices utilize an electroosmotic force or an electromagnetic field to generate a flow of a fluid in a microchannel that is lined, at least in part, with silicon nitride. Additional electrodes can be provided within or about the microchannel for separating particular constituents in the fluid during the flow based on charge state or magnetic moment. The fluid can also be pressurized in the channel. The present invention has many different applications including electrokinetic pumping, chemical and biochemical analysis (e.g. based on electrophoresis or chromatography), conducting chemical reactions on a microscopic scale, and forming hydraulic actuators.

  18. A broad-band microseismometer for planetary operations

    NASA Technical Reports Server (NTRS)

    Banerdt, W. B.; Vanzandt, T.; Kaiser, W. J.; Kenny, T. W.

    1993-01-01

    There has recently been renewed interest in the development of instrumentation for making measurements on the surface of Mars. This is due to the Mars Environmental Survey (MESUR) Mission, for which approximately 16 small, long-lived (2-10 years), relatively inexpensive surface stations will be deployed in a planet-wide network. This will allow the investigation of processes (such as seismology and meteorology) which require the simultaneous measurement of phenomena at many widely spaced locations on the surface over a considerable length of time. Due to the large number of vehicles involved, the mass, power, and cost of the payload will be severely constrained. A seismometer has been identified as one of the highest priority instruments in the MESUR straw-man payload. The requirements for an effective seismic experiment on Mars place a number of constraints on any viable sensor design. First, a large number of sensors must be deployed in a long-lived global network in order to be able to locate many events reliably, provide good spatial sampling of the interior, and increase the probability of seismic detection in the event of localized seismicity and/or high attenuation. From a practical standpoint, this means that individual surface stations will necessarily be constrained in terms of cost, mass, and power. Landing and thermal control systems will probably be simple, in order to minimize cost, resulting in large impact accelerations and wide daily and seasonal thermal swings. The level of seismic noise will determine the maximum usable sensitivity for seismometer. Unfortunately, the ambient seismic noise level for Mars is not well known. However lunar seismic noise levels are several orders of magnitude below that of the Earth. Sensitivities on the order of 10(exp -11)g over a bandwidth of .04 to 20 Hz are thought to be necessary to fulfill the science objectives for a seimometer placed on the Martian surface. Silicon micromachined sensor technology offers techniques for the fabrication of monolithic, robust, compact, lower power and mass accelerometers. Conventional micro-machined accelerometers have been developed and are commercially available for high frequency and large acceleration measurements. The new seismometer we are developing incorporates certain principles of conventional silicon micromachined accelerometer technology. However, currently available silicon micromachined sensors offer inadequate sensitivity and bandwidth for the Mars seismometer application. Our implementation of an advanced silicon micromachined seismometer is based on principles recently developed at JPL for high-sensitivity position sensor technology.

  19. Air Bearings Machined On Ultra Precision, Hydrostatic CNC-Lathe

    NASA Astrophysics Data System (ADS)

    Knol, Pierre H.; Szepesi, Denis; Deurwaarder, Jan M.

    1987-01-01

    Micromachining of precision elements requires an adequate machine concept to meet the high demand of surface finish, dimensional and shape accuracy. The Hembrug ultra precision lathes have been exclusively designed with hydrostatic principles for main spindle and guideways. This concept is to be explained with some major advantages of hydrostatics compared with aerostatics at universal micromachining applications. Hembrug has originally developed the conventional Mikroturn ultra precision facing lathes, for diamond turning of computer memory discs. This first generation of machines was followed by the advanced computer numerically controlled types for machining of complex precision workpieces. One of these parts, an aerostatic bearing component has been succesfully machined on the Super-Mikroturn CNC. A case study of airbearing machining confirms the statement that a good result of the micromachining does not depend on machine performance alone, but also on the technology applied.

  20. Micromachined patch-clamp apparatus

    DOEpatents

    Okandan, Murat

    2012-12-04

    A micromachined patch-clamp apparatus is disclosed for holding one or more cells and providing electrical, chemical, or mechanical stimulation to the cells during analysis with the patch-clamp technique for studying ion channels in cell membranes. The apparatus formed on a silicon substrate utilizes a lower chamber formed from silicon nitride using surface micromachining and an upper chamber formed from a molded polymer material. An opening in a common wall between the chambers is used to trap and hold a cell for analysis using the patch-clamp technique with sensing electrodes on each side of the cell. Some embodiments of the present invention utilize one or more electrostatic actuators formed on the substrate to provide mechanical stimulation to the cell being analyzed, or to provide information about mechanical movement of the cell in response to electrical or chemical stimulation.

  1. Conformal and embedded IDT microsensors for health monitoring of structures

    NASA Astrophysics Data System (ADS)

    Varadan, Vijay K.; Varadan, Vasundara V.

    2000-06-01

    MEMS are currently being applied to the structural health monitoring of critical aircraft components and composites. The approach integrates acoustic emission, strain gauges, MEMS accelerometers and vibration monitoring aircraft components with a known history of catastrophic failure due to fracture. Recently a combination of the need for safety in the air and the desire to control costs is encouraging the use of in-flight monitoring of aircraft components and systems using light-weight, wireless and cost effective microsensors and MEMS. An in-situ aircraft structural health monitoring system, with sensors embedded in the composite structure or surface-mounted on the structure, would permit the timely detection of damage in aircraft. Micromachining offers the potential for fabricating a range of microsensor and MEMS for structural applications including load, vibration and acoustics characterization and monitoring. Such microsensors are extremely small; they can be embedded into structural materials, can be mass-produced and are therefore potentially cheap. The smart sensors are being developed using the standard microelectronics and micromachining in conjunction with novel Penn State wireless communication systems suitable for condition monitoring of aircraft structures in-flight. The main application areas of this investigation include continuos monitoring of a) structural integrity of aging aircraft, b) fatigue cracking, c) corrosion, d) deflection and strain of aircraft structures, wings, and rotorblades, e) impact damage, f) delamination and g) location and propagation of cracks. In this paper we give an overview of wireless programmable microsensors and MEMS and their associated driving electronics for such applications.

  2. Femtosecond laser micromachining of polylactic acid/graphene composites for designing interdigitated microelectrodes for sensor applications

    NASA Astrophysics Data System (ADS)

    Paula, Kelly T.; Gaál, Gabriel; Almeida, G. F. B.; Andrade, M. B.; Facure, Murilo H. M.; Correa, Daniel S.; Riul, Antonio; Rodrigues, Varlei; Mendonça, Cleber R.

    2018-05-01

    There is an increasing interest in the last years towards electronic applications of graphene-based materials and devices fabricated from patterning techniques, with the ultimate goal of high performance and temporal resolution. Laser micromachining using femtosecond pulses is an attractive methodology to integrate graphene-based materials into functional devices as it allows changes to the focal volume with a submicrometer spatial resolution due to the efficient nonlinear nature of the absorption, yielding rapid prototyping for innovative applications. We present here the patterning of PLA-graphene films spin-coated on a glass substrate using a fs-laser at moderate pulse energies to fabricate interdigitated electrodes having a minimum spatial resolution of 5 μm. Raman spectroscopy of the PLA-graphene films indicated the presence of multilayered graphene fibers. Subsequently, the PLA-graphene films were micromachined using a femtosecond laser oscillator delivering 50-fs pulses and 800 nm, where the pulse energy and scanning speed was varied in order to determine the optimum irradiation parameters (16 nJ and 100 μm/s) to the fabrication of microstructures. The micromachined patterns were characterized by optical microscopy and submitted to electrical measurements in liquid samples, clearly distinguishing all tastes tested. Our results confirm the femtosecond laser micromachining technique as an interesting approach to efficiently pattern PLA-graphene filaments with high precision and minimal mechanical defects, allowing the easy fabrication of interdigitated structures and an alternative method to those produced by conventional photolithography.

  3. Silicon Micromachined Microlens Array for THz Antennas

    NASA Technical Reports Server (NTRS)

    Lee, Choonsup; Chattopadhyay, Goutam; Mehdi, IImran; Gill, John J.; Jung-Kubiak, Cecile D.; Llombart, Nuria

    2013-01-01

    5 5 silicon microlens array was developed using a silicon micromachining technique for a silicon-based THz antenna array. The feature of the silicon micromachining technique enables one to microfabricate an unlimited number of microlens arrays at one time with good uniformity on a silicon wafer. This technique will resolve one of the key issues in building a THz camera, which is to integrate antennas in a detector array. The conventional approach of building single-pixel receivers and stacking them to form a multi-pixel receiver is not suited at THz because a single-pixel receiver already has difficulty fitting into mass, volume, and power budgets, especially in space applications. In this proposed technique, one has controllability on both diameter and curvature of a silicon microlens. First of all, the diameter of microlens depends on how thick photoresist one could coat and pattern. So far, the diameter of a 6- mm photoresist microlens with 400 m in height has been successfully microfabricated. Based on current researchers experiences, a diameter larger than 1-cm photoresist microlens array would be feasible. In order to control the curvature of the microlens, the following process variables could be used: 1. Amount of photoresist: It determines the curvature of the photoresist microlens. Since the photoresist lens is transferred onto the silicon substrate, it will directly control the curvature of the silicon microlens. 2. Etching selectivity between photoresist and silicon: The photoresist microlens is formed by thermal reflow. In order to transfer the exact photoresist curvature onto silicon, there needs to be etching selectivity of 1:1 between silicon and photoresist. However, by varying the etching selectivity, one could control the curvature of the silicon microlens. The figure shows the microfabricated silicon microlens 5 x5 array. The diameter of the microlens located in the center is about 2.5 mm. The measured 3-D profile of the microlens surface has a smooth curvature. The measured height of the silicon microlens is about 280 microns. In this case, the original height of the photoresist was 210 microns. The change was due to the etching selectivity of 1.33 between photoresist and silicon. The measured surface roughness of the silicon microlens shows the peak-to-peak surface roughness of less than 0.5 microns, which is adequate in THz frequency. For example, the surface roughness should be less than 7 microns at 600 GHz range. The SEM (scanning electron microscope) image of the microlens confirms the smooth surface. The beam pattern at 550 GHz shows good directivity.

  4. Micromachine friction test apparatus

    DOEpatents

    deBoer, Maarten P.; Redmond, James M.; Michalske, Terry A.

    2002-01-01

    A microelectromechanical (MEM) friction test apparatus is disclosed for determining static or dynamic friction in MEM devices. The friction test apparatus, formed by surface micromachining, is based on a friction pad supported at one end of a cantilevered beam, with the friction pad overlying a contact pad formed on the substrate. A first electrostatic actuator can be used to bring a lower surface of the friction pad into contact with an upper surface of the contact pad with a controlled and adjustable force of contact. A second electrostatic actuator can then be used to bend the cantilevered beam, thereby shortening its length and generating a relative motion between the two contacting surfaces. The displacement of the cantilevered beam can be measured optically and used to determine the static or dynamic friction, including frictional losses and the coefficient of friction between the surfaces. The test apparatus can also be used to assess the reliability of rubbing surfaces in MEM devices by producing and measuring wear of those surfaces. Finally, the friction test apparatus, which is small in size, can be used as an in situ process quality tool for improving the fabrication of MEM devices.

  5. Nanofluidic interfaces in microfluidic networks

    DOE PAGES

    Millet, Larry J.; Doktycz, Mitchel John; Retterer, Scott T.

    2015-09-24

    The integration of nano- and microfluidic technologies enables the construction of tunable interfaces to physical and biological systems across relevant length scales. The ability to perform chemical manipulations of miniscule sample volumes is greatly enhanced through these technologies and extends the ability to manipulate and sample the local fluidic environments at subcellular, cellular and community or tissue scales. Here we describe the development of a flexible surface micromachining process for the creation of nanofluidic channel arrays integrated within SU-8 microfluidic networks. The use of a semi-porous, silicon rich, silicon nitride structural layer allows rapid release of the sacrificial silicon dioxidemore » during the nanochannel fabrication. Nanochannel openings that form the interface to biological samples are customized using focused ion beam milling. The compatibility of these interfaces with on-chip microbial culture is demonstrated.« less

  6. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Galambos, Paul C.

    This is the latest in a series of LDRD's that we have been conducting with Florida State University/Florida A&M University (FSU/FAMU) under the campus executive program. This research builds on the earlier projects; ''Development of Highly Integrated Magnetically and Electrostatically Actuated Micropumps'' (SAND2003-4674) and ''Development of Magnetically and Electrostatically Driven Surface Micromachined Pumps'' (SAND2002-0704P). In this year's LDRD we designed 2nd generation of surface micromachined (SMM) gear and viscous pumps. Two SUMMiT{trademark} modules full of design variations of these pumps were fabricated and one SwIFT{trademark} module is still in fabrication. The SwIFT{trademark} fabrication process results in a transparent pump housingmore » cover that will enable visualization inside the pumps. Since the SwIFT{trademark} pumps have not been tested as they are still in fabrication, this report will focus on the 2nd generation SUMMiT{trademark} designs. Pump testing (pressure vs. flow) was conducted on several of the SUMMiT{trademark} designs resulting in the first pump curve for this class of SMM pumps. A pump curve was generated for the higher torque 2nd generation gear pump designed by Jason Hendrix of FSU. The pump maximum flow rate at zero head was 6.5 nl/s for a 30V, 30 Hz square wave signal. This level of flow rate would be more than adequate for our typical SMM SUMMiT{trademark} or SwIFT{trademark} channels which have typical volumes on the order of 50 pl.« less

  7. A multi-scale PDMS fabrication strategy to bridge the size mismatch between integrated circuits and microfluidics†

    PubMed Central

    Muluneh, Melaku

    2015-01-01

    In recent years there has been great progress harnessing the small-feature size and programmability of integrated circuits (ICs) for biological applications, by building microfluidics directly on top of ICs. However, a major hurdle to the further development of this technology is the inherent size-mismatch between ICs (~mm) and microfluidic chips (~cm). Increasing the area of the ICs to match the size of the microfluidic chip, as has often been done in previous studies, leads to a waste of valuable space on the IC and an increase in fabrication cost (>100×). To address this challenge, we have developed a three dimensional PDMS chip that can straddle multiple length scales of hybrid IC/microfluidic chips. This approach allows millimeter-scale ICs, with no post-processing, to be integrated into a centimeter-sized PDMS chip. To fabricate this PDMS chip we use a combination of soft-lithography and laser micromachining. Soft lithography was used to define micrometer-scale fluid channels directly on the surface of the IC, allowing fluid to be controlled with high accuracy and brought into close proximity to sensors for highly sensitive measurements. Laser micromachining was used to create ~50 μm vias to connect these molded PDMS channels to a larger PDMS chip, which can connect multiple ICs and house fluid connections to the outside world. To demonstrate the utility of this approach, we built and demonstrated an in-flow magnetic cytometer that consisted of a 5 × 5 cm2 microfluidic chip that incorporated a commercial 565 × 1145 μm2 IC with a GMR sensing circuit. We additionally demonstrated the modularity of this approach by building a chip that incorporated two of these GMR chips connected in series. PMID:25284502

  8. A multi-scale PDMS fabrication strategy to bridge the size mismatch between integrated circuits and microfluidics.

    PubMed

    Muluneh, Melaku; Issadore, David

    2014-12-07

    In recent years there has been great progress harnessing the small-feature size and programmability of integrated circuits (ICs) for biological applications, by building microfluidics directly on top of ICs. However, a major hurdle to the further development of this technology is the inherent size-mismatch between ICs (~mm) and microfluidic chips (~cm). Increasing the area of the ICs to match the size of the microfluidic chip, as has often been done in previous studies, leads to a waste of valuable space on the IC and an increase in fabrication cost (>100×). To address this challenge, we have developed a three dimensional PDMS chip that can straddle multiple length scales of hybrid IC/microfluidic chips. This approach allows millimeter-scale ICs, with no post-processing, to be integrated into a centimeter-sized PDMS chip. To fabricate this PDMS chip we use a combination of soft-lithography and laser micromachining. Soft lithography was used to define micrometer-scale fluid channels directly on the surface of the IC, allowing fluid to be controlled with high accuracy and brought into close proximity to sensors for highly sensitive measurements. Laser micromachining was used to create ~50 μm vias to connect these molded PDMS channels to a larger PDMS chip, which can connect multiple ICs and house fluid connections to the outside world. To demonstrate the utility of this approach, we built and demonstrated an in-flow magnetic cytometer that consisted of a 5 × 5 cm(2) microfluidic chip that incorporated a commercial 565 × 1145 μm(2) IC with a GMR sensing circuit. We additionally demonstrated the modularity of this approach by building a chip that incorporated two of these GMR chips connected in series.

  9. Fabrication of a Silicon Backshort Assembly for Waveguide-Coupled Superconducting Detectors

    NASA Technical Reports Server (NTRS)

    Crowe, Erik J.; Bennett, Charles L.; Chuss, David T.; Denis, Kevin L.; Eimer, Joseph; Lourie, Nathan; Marriage, Tobias; Moseley, Samuel H.; Rostem, Karwan; Stevenson, Thomas R.; hide

    2012-01-01

    The Cosmology Large Angular Scale Surveyor (CLASS) is a ground-based instrument that will measure the polarization of the cosmic microwave background to search for evidence for gravitational waves from a posited epoch of inflation early in the Universe s history. This measurement will require integration of superconducting transition-edge sensors with microwave waveguide inputs with excellent control of systematic errors, such as unwanted coupling to stray signals at frequencies outside of a precisely defined microwave band. To address these needs we present work on the fabrication of micromachined silicon, producing conductive quarter-wave backshort assemblies for the CLASS 40 GHz focal plane. Each 40 GHz backshort assembly consists of three degeneratively doped silicon wafers. Two spacer wafers are micromachined with through-wafer vias to provide a 2.04 mm long square waveguide delay section. The third wafer terminates the waveguide delay in a short. The three wafers are bonded at the wafer level by Au-Au thermal compression bonding then aligned and flip chip bonded to the CLASS detector at the chip level. The micromachining techniques used have been optimized to create high aspect ratio waveguides, silicon pillars, and relief trenches with the goal of providing improved out of band signal rejection. We will discuss the fabrication of integrated CLASS superconducting detector chips with the quarter-wave backshort assemblies.

  10. Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking.

    PubMed

    Uddin, Ashfaque; Milaninia, Kaveh; Chen, Chin-Hsuan; Theogarajan, Luke

    2011-12-01

    This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers that are at most 5 µm larger than the chip on each side. The chip and the large area substrate are bonded onto a carrier such that the top surfaces of the two components are flush. The unique features of this technique enable the integration of macroscale components, such as leads and microfluidics. Furthermore, the integration process allows for MEMS micromachining after CMOS die-wafer integration. To demonstrate the capabilities of the proposed technology, a low-power integrated potentiostat chip for biosensing implemented in the AMI 0.5 µm CMOS technology is integrated in a silicon substrate. The horizontal gap and the vertical displacement between the chip and the large area substrate measured after the integration were 4 µm and 0.5 µm, respectively. A number of 104 interconnects are patterned with high-precision alignment. Electrical measurements have shown that the functionality of the chip is not affected by the integration process.

  11. A micromachined calorimetric gas sensor: an application of electrodeposited nanostructured palladium for the detection of combustible gases.

    PubMed

    Bartlett, Philip N; Guerin, Samuel

    2003-01-01

    Palladium films with regular nanoarchitectures were electrochemically deposited from the hexagonal (H1) lyotropic liquid crystalline phase of the nonionic surfactant octaethyleneglycol monohexadecyl ether (C16EO8) onto micromachined silicon hotplate structures. The H1-e Pd films were shown to have high surface areas (approximately 28 m2 g(-1)) and to act as effective and stable catalysts for the detection of methane in air on heating to 500 degrees C. The response of the H1-e Pd-coated planar pellistors was found to be linearly proportional to the concentration of methane between 0 and 2.5% in air with a detection limit below 0.125%. Our results show that the electrochemical deposition of nanostructured metal films offers a promising approach to the fabrication of micromachined calorimetric gas sensors for combustible gases.

  12. High peak power solid-state laser for micromachining of hard materials

    NASA Astrophysics Data System (ADS)

    Herbst, Ludolf; Quitter, John P.; Ray, Gregory M.; Kuntze, Thomas; Wiessner, Alexander O.; Govorkov, Sergei V.; Heglin, Mike

    2003-06-01

    Laser micromachining has become a key enabling technology in the ever-continuing trend of miniaturization in microelectronics, micro-optics, and micromechanics. New applications have become commercially viable due to the emergence of innovative laser sources, such as diode pumped solid-state lasers (DPSSL), and the progress in processing technology. Examples of industrial applications are laser-drilled micro-injection nozzles for highly efficient automobile engines, or manufacturing of complex spinnerets for production of synthetic fibers. The unique advantages of laser-based techniques stem from their ability to produce high aspect ratio holes, while yielding low heat affected zones with exceptional surface quality, roundness and taper tolerances. Additionally, the ability to drill blind holes and slots in very hard materials such as diamond, silicon, sapphire, ceramics and steel is of great interest for many applications in microelectronics, semiconductor and automotive industry. This kind of high quality, high aspect ratio micromachining requires high peak power and short pulse durations.

  13. Utilization of the UV laser with picosecond pulses for the formation of surface microstructures on elastomeric plastics

    NASA Astrophysics Data System (ADS)

    Antoszewski, B.; Tofil, S.; Scendo, M.; Tarelnik, W.

    2017-08-01

    Elastomeric plastics belong to a wide range of polymeric materials with special properties. They are used as construction material for seals and other components in many branches of industry and, in particular, in the biomedical industry, mechatronics, electronics and chemical equipment. The micromachining of surfaces of these materials can be used to build micro-flow, insulating, dispensing systems and chemical and biological reactors. The paper presents results of research on the effects of micro-machining of selected elastomeric plastics using a UV laser emitting picosecond pulses. The authors see the prospective application of the developed technology in the sealing technique in particular to shaping the sealing pieces co-operating with the surface of the element. The result of the study is meant to show parameters of the UV laser’s performance when producing typical components such as grooves, recesses for optimum ablation in terms of quality and productivity.

  14. Microelectromechanical Systems for Aerodynamics Applications

    NASA Technical Reports Server (NTRS)

    Mehregany, Mehran; DeAnna, Russell G.; Reshotko, Eli

    1996-01-01

    Microelectromechanical systems (MEMS) embody the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including micro-sensors and micro-actuators, are attractive because they can be made small (characteristic dimension about microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. MEMS pressure sensors, wall-shear-stress sensors, and micromachined hot-wires are nearing application in aeronautics. MEMS actuators face a tougher challenge since they have to be scaled (up) to the physical phenomena that are being controlled. MEMS actuators are proposed, for example, for controlling the small structures in a turbulent boundary layer, for aircraft control, for cooling, and for mixing enhancement. Data acquisition or control logistics require integration of electronics along with the transducer elements with appropriate consideration of analog-to-digital conversion, multiplexing, and telemetry. Altogether, MEMS technology offers exciting opportunities for aerodynamics applications both in wind tunnels and in flight

  15. Integrated micro-electro-mechanical sensor development for inertial applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Allen, J.J.; Kinney, R.D.; Sarsfield, J.

    Electronic sensing circuitry and micro electro mechanical sense elements can be integrated to produce inertial instruments for applications unheard of a few years ago. This paper will describe the Sandia M3EMS fabrication process, inertial instruments that have been fabricated, and the results of initial characterization tests of micro-machined accelerometers.

  16. An investigation of vibration-induced protein desorption mechanism using a micromachined membrane and PZT plate.

    PubMed

    Yeh, Po Ying; Le, Yevgeniya; Kizhakkedathu, Jayachandran N; Chiao, Mu

    2008-10-01

    A micromachined vibrating membrane is used to remove adsorbed proteins on a surface. A lead zirconate titanate (PZT) composite (3 x 1 x 0.5 mm) is attached to a silicon membrane (2,000 x 500 x 3 microm) and vibrates in a flexural plate wave (FPW) mode with wavelength of 4,000/3 microm at a resonant frequency of 308 kHz. The surface charge on the membrane and fluid shear stress contribute in minimizing the protein adsorption on the SiO(2) surface. In vitro characterization shows that 57 +/- 10% of the adsorbed bovine serum albumin (BSA), 47 +/- 13% of the immunoglobulin G (IgG), and 55.3~59.2 +/- 8% of the proteins from blood plasma are effectively removed from the vibrating surface. A simulation study of the vibration-frequency spectrum and vibrating amplitude distribution matches well with the experimental data. Potentially, a microelectromechanical system (MEMS)-based vibrating membrane could be the tool to minimize biofouling of in vivo MEMS devices.

  17. Microelectromechanical gyroscope

    DOEpatents

    Garcia, Ernest J.

    1999-01-01

    A gyroscope powered by an engine, all fabricated on a common substrate in the form of an integrated circuit. Preferably, both the gyroscope and the engine are fabricated in the micrometer domain, although in some embodiments of the present invention, the gyroscope can be fabricated in the millimeter domain. The engine disclosed herein provides torque to the gyroscope rotor for continuous rotation at varying speeds and direction. The present invention is preferably fabricated of polysilicon or other suitable materials on a single wafer using surface micromachining batch fabrication techniques or millimachining techniques that are well known in the art. Fabrication of the present invention is preferably accomplished without the need for assembly of multiple wafers which require alignment and bonding, and without piece-part assembly.

  18. Micromachined capacitive ultrasonic immersion transducer array

    NASA Astrophysics Data System (ADS)

    Jin, Xuecheng

    Capacitive micromachined ultrasonic transducers (cMUTs) have emerged as an attractive alternative to conventional piezoelectric ultrasonic transducers. They offer performance advantages of wide bandwidth and sensitivity that have heretofore been attainable. In addition, micromachining technology, which has benefited from the fast-growing microelectronics industry, enables cMUT array fabrication and electronics integration. This thesis describes the design and fabrication of micromachined capacitive ultrasonic immersion transducer arrays. The basic transducer electrical equivalent circuit is derived from Mason's theory. The effects of Lamb waves and Stoneley waves on cross coupling and acoustic losses are discussed. Electrical parasitics such as series resistance and shunt capacitance are also included in the model of the transducer. Transducer fabrication technology is systematically studied. Device dimension control in both vertical and horizontal directions, process alternatives and variations in membrane formation, via etch and cavity sealing, and metalization as well as their impact on transducer performance are summarized. Both 64 and 128 element 1-D array transducers are fabricated. Transducers are characterized in terms of electrical input impedance, bandwidth, sensitivity, dynamic range, impulse response and angular response, and their performance is compared with theoretical simulation. Various schemes for cross coupling reduction is analyzed, implemented, and verified with both experiments and theory. Preliminary results of immersion imaging are presented using 64 elements 1-D array transducers for active source imaging.

  19. Fabrication and characterization of piezoelectric micromachined ultrasonic transducers with thick composite PZT films.

    PubMed

    Wang, Zhihong; Zhu, Weiguang; Zhu, Hong; Miao, Jianmin; Chao, Chen; Zhao, Changlei; Tan, Ooi Kiang

    2005-12-01

    Ferroelectric microelectromechanical systems (MEMS) has been a growing area of research in past decades, in which ferroelectric films are combined with silicon technology for a variety of applications, such as piezo-electric micromachined ultrasonic transducers (pMUTs), which represent a new approach to ultrasound detection and generation. For ultrasound-radiating applications, thicker PZT films are preferred because generative force and response speed of the diaphragm-type transducers increase with increasing film thickness. However, integration of 4- to 20-microm thick PZT films on silicon wafer, either the deposition or the patterning, is still a bottleneck in the micromachining process. This paper reports on a diaphragm-type pMUT. A composite coating technique based on chemical solution deposition and high-energy ball milled powder has been used to fabricate thick PZT films. Micromachining of the pMUTs using such thick films has been investigated. The fabricated pMUT with crack-free PZT films up to 7-microm thick was evaluated as an ultrasonic transmitter. The generated sound pressure level of up to 120 dB indicates that the fabricated pMUT has very good ultrasound-radiating performance and, therefore, can be used to compose pMUT arrays for generating ultrasound beam with high directivity in numerous applications. The pMUT arrays also have been demonstrated.

  20. Integrated MEMS-tunable VCSELs for reconfigurable optical interconnects

    NASA Astrophysics Data System (ADS)

    Kögel, Benjamin; Debernardi, Pierluigi; Westbergh, Petter; Gustavsson, Johan S.; Haglund, Åsa; Haglund, Erik; Bengtsson, Jörgen; Larsson, Anders

    2012-03-01

    A simple and low-cost technology for tunable vertical-cavity surface-emitting lasers (VCSELs) with curved movable micromirror is presented. The micro-electro-mechanical system (MEMS) is integrated with the active optical component (so-called half-VCSEL) by means of surface-micromachining using a reflown photoresist droplet as sacrificial layer. The technology is demonstrated for electrically pumped, short-wavelength (850 nm) tunable VCSELs. Fabricated devices with 10 μm oxide aperture are singlemode with sidemode suppression >35 dB, tunable over 24 nm with output power up to 0.5mW, and have a beam divergence angle <6 °. An improved high-speed design with reduced parasitic capacitance enables direct modulation with 3dB-bandwidths up to 6GHz and error-free data transmission at 5Gbit/s. The modulation response of the MEMS under electrothermal actuation has a bandwidth of 400 Hz corresponding to switching times of about 10ms. The thermal crosstalk between MEMS and half-VCSEL is negligible and not degrading the device performance. With these characteristics the integrated MEMS-tunable VCSELs are basically suitable for use in reconfigurable optical interconnects and ready for test in a prototype system. Schemes for improving output power, tuning speed, and modulation bandwidth are briefly discussed.

  1. Passive tire pressure sensor and method

    DOEpatents

    Pfeifer, Kent Bryant; Williams, Robert Leslie; Waldschmidt, Robert Lee; Morgan, Catherine Hook

    2006-08-29

    A surface acoustic wave device includes a micro-machined pressure transducer for monitoring tire pressure. The device is configured having a micro-machined cavity that is sealed with a flexible conductive membrane. When an external tire pressure equivalent to the cavity pressure is detected, the membrane makes contact with ridges on the backside of the surface acoustic wave device. The ridges are electrically connected to conductive fingers of the device. When the detected pressure is correct, selected fingers on the device will be grounded producing patterned acoustic reflections to an impulse RF signal. When the external tire pressure is less than the cavity reference pressure, a reduced reflected signal to the receiver results. The sensor may further be constructed so as to identify itself by a unique reflected identification pulse series.

  2. Passive tire pressure sensor and method

    DOEpatents

    Pfeifer, Kent Bryant; Williams, Robert Leslie; Waldschmidt, Robert Lee; Morgan, Catherine Hook

    2007-09-04

    A surface acoustic wave device includes a micro-machined pressure transducer for monitoring tire pressure. The device is configured having a micro-machined cavity that is sealed with a flexible conductive membrane. When an external tire pressure equivalent to the cavity pressure is detected, the membrane makes contact with ridges on the backside of the surface acoustic wave device. The ridges are electrically connected to conductive fingers of the device. When the detected pressure is correct, selected fingers on the device will be grounded producing patterned acoustic reflections to an impulse RF signal. When the external tire pressure is less than the cavity reference pressure, a reduced reflected signal to the receiver results. The sensor may further be constructed so as to identify itself by a unique reflected identification pulse series.

  3. Micro-machined resonator oscillator

    DOEpatents

    Koehler, Dale R.; Sniegowski, Jeffry J.; Bivens, Hugh M.; Wessendorf, Kurt O.

    1994-01-01

    A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a "telemetered sensor beacon" that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20-100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available.

  4. Micromachined Millimeter- and Submillimeter-wave SIS Heterodyne Receivers for Remote Sensing

    NASA Technical Reports Server (NTRS)

    Hu, Qing

    1997-01-01

    This is a progress report for the second year of a NASA-sponsored project. The report discusses the design and fabrication of micromachined Superconductor Insulator Superconductor (SIS) heterodyne receivers with integrated tuning elements. These receivers tune out the functional capacitance at desired frequencies, resulting in less noise, lower temperatures and broader bandwidths. The report also discusses the design and fabrication of the first monolithic 3x3 focal-plane arrays for a frequency range of 170-210 GHz. Also addressed is the construction of a 9-channel bias and read-out system, as well as the redesign of the IF connections to reduce cross talk between SIS junctions, which become significant a frequency of 1.5 GHz IF. Uniformity of the junction arrays were measured and antenna beam patterns of several array elements under operating conditions also were measured. Finally, video and heterodyne responses of our focal-plane arrays were measured as well. Attached is a paper on: 'Development of a 170-210 GHz 3x3 micromachined SIS imaging array'.

  5. Precision Control Module For UV Laser 3D Micromachining

    NASA Astrophysics Data System (ADS)

    Wu, Wen-Hong; Hung, Min-Wei; Chang, Chun-Li

    2011-01-01

    UV laser has been widely used in various micromachining such as micro-scribing or patterning processing. At present, most of the semiconductors, LEDs, photovoltaic solar panels and touch panels industries need the UV laser processing system. However, most of the UV laser processing applications in the industries utilize two dimensional (2D) plane processing. And there are tremendous business opportunities that can be developed, such as three dimensional (3D) structures of micro-electromechanical (MEMS) sensor or the precision depth control of indium tin oxide (ITO) thin films edge insulation in touch panels. This research aims to develop a UV laser 3D micromachining module that can create the novel applications for industries. By special designed beam expender in optical system, the focal point of UV laser can be adjusted quickly and accurately through the optical path control lens of laser beam expender optical system. Furthermore, the integrated software for galvanometric scanner and focal point adjustment mechanism is developed as well, so as to carry out the precise 3D microstructure machining.

  6. Micromechanical Signal Processors

    NASA Astrophysics Data System (ADS)

    Nguyen, Clark Tu-Cuong

    Completely monolithic high-Q micromechanical signal processors constructed of polycrystalline silicon and integrated with CMOS electronics are described. The signal processors implemented include an oscillator, a bandpass filter, and a mixer + filter--all of which are components commonly required for up- and down-conversion in communication transmitters and receivers, and all of which take full advantage of the high Q of micromechanical resonators. Each signal processor is designed, fabricated, then studied with particular attention to the performance consequences associated with miniaturization of the high-Q element. The fabrication technology which realizes these components merges planar integrated circuit CMOS technologies with those of polysilicon surface micromachining. The technologies are merged in a modular fashion, where the CMOS is processed in the first module, the microstructures in a following separate module, and at no point in the process sequence are steps from each module intermixed. Although the advantages of such modularity include flexibility in accommodating new module technologies, the developed process constrained the CMOS metallization to a high temperature refractory metal (tungsten metallization with TiSi _2 contact barriers) and constrained the micromachining process to long-term temperatures below 835^circC. Rapid-thermal annealing (RTA) was used to relieve residual stress in the mechanical structures. To reduce the complexity involved with developing this merged process, capacitively transduced resonators are utilized. High-Q single resonator and spring-coupled micromechanical resonator filters are also investigated, with particular attention to noise performance, bandwidth control, and termination design. The noise in micromechanical filters is found to be fairly high due to poor electromechanical coupling on the micro-scale with present-day technologies. Solutions to this high series resistance problem are suggested, including smaller electrode-to-resonator gaps to increase the coupling capacitance. Active Q-control techniques are demonstrated which control the bandwidth of micromechanical filters and simulate filter terminations with little passband distortion. Noise analysis shows that these active techniques are relatively quiet when compared with other resistive techniques. Modulation techniques are investigated whereby a single resonator or a filter constructed from several such resonators can provide both a mixing and a filtering function, or a filtering and amplitude modulation function. These techniques center around the placement of a carrier signal on the micromechanical resonator. Finally, micro oven stabilization is investigated in an attempt to null the temperature coefficient of a polysilicon micromechanical resonator. Here, surface micromachining procedures are utilized to fabricate a polysilicon resonator on a microplatform--two levels of suspension--equipped with heater and temperature sensing resistors, which are then imbedded in a feedback loop to control the platform (and resonator) temperature. (Abstract shortened by UMI.).

  7. Laser-induced patterns on metals and polymers for biomimetic surface engineering

    NASA Astrophysics Data System (ADS)

    Kietzig, Anne-Marie; Lehr, Jorge; Matus, Luke; Liang, Fang

    2014-03-01

    One common feature of many functional surfaces found in nature is their modular composition often exhibiting several length scales. Prominent natural examples for extreme behaviors can be named in various plant leaf (rose, peanut, lotus) or animal toe surfaces (Gecko, tree frog). Influence factors of interest are the surface's chemical composition, its microstructure, its organized or random roughness and hence the resulting surface wetting and adhesion character. Femtosecond (fs) laser micromachining offers a possibility to render all these factors in one single processing step on metallic and polymeric surfaces. Exemplarily, studies on Titanium and PTFE are shown, where the dependence of the resulting feature sizes on lasing intensity is investigated. While Ti surfaces show rigid surface patterns of micrometer scaled features with superimposed nanostructures, PTFE exhibits elastic hairy structures of nanometric diameter, which upon a certain threshold tend to bundle to larger features. Both surface patterns can be adjusted to mimic specific wetting and flow behaviour as seen on natural examples. Therefore, fs-laser micromachining is suggested as an interesting industrially scalable technique to pattern and fine-tune the surface wettability of a surface to the desired extends in one process step. Possible applications can be seen with surfaces, which require specific wetting, fouling, icing, friction or cell adhesion behaviour.

  8. Integrated model reference adaptive control and time-varying angular rate estimation for micro-machined gyroscopes

    NASA Astrophysics Data System (ADS)

    Tsai, Nan-Chyuan; Sue, Chung-Yang

    2010-02-01

    Owing to the imposed but undesired accelerations such as quadrature error and cross-axis perturbation, the micro-machined gyroscope would not be unconditionally retained at resonant mode. Once the preset resonance is not sustained, the performance of the micro-gyroscope is accordingly degraded. In this article, a direct model reference adaptive control loop which is integrated with a modified disturbance estimating observer (MDEO) is proposed to guarantee the resonant oscillations at drive mode and counterbalance the undesired disturbance mainly caused by quadrature error and cross-axis perturbation. The parameters of controller are on-line innovated by the dynamic error between the MDEO output and expected response. In addition, Lyapunov stability theory is employed to examine the stability of the closed-loop control system. Finally, the efficacy of numerical evaluation on the exerted time-varying angular rate, which is to be detected and measured by the gyroscope, is verified by intensive simulations.

  9. Wireless microsensors for health monitoring of aircraft structures

    NASA Astrophysics Data System (ADS)

    Varadan, Vijay K.

    2003-01-01

    The integration of MEMS, IDTs (interdigital transducers) and required microelectronics and conformal antennas to realize programmable, robust and low cost passive microsensors suitable for many military structures and systems including aircraft, missiles and munitions is presented in this paper. The technology is currently being applied to the structural health monitoring of critical aircraft components. The approach integrates acoustic emission, strain gauges, MEMS accelerometers, gyroscopes and vibration monitoring devices with signal processing electronics to provide real-time indicators of incipient failure of aircraft components with a known history of catastrophic failure due to fracture. Recently a combination of the need for safety in the air and the desire to control costs is encouraging the use of in-flight monitoring of aircraft components and systems using light-weight, wireless and cost effective microsensors and MEMS. An in-situ Aircraft structural health monitoring (ASHM) system, with sensors embedded in the composite structure or surface-mounted on the structure, would permit the timely detection of damage in aircraft. Micromachining offers the potential for fabricating a range of microsensors and MEMS for structural applications including load, vibration and acoustics characterization and monitoring. Such microsensors are extremely small; they can be embedded into structural materials, can be mass-produced and are therefore potentially cheap. Additionally a range of sensor types can be integrated onto a single chip with built-in electronics and ASIC (Application Specific Integrated Circuit), providing a low power Microsystems. The smart sensors are being developed using the standard microelectronics and micromachining in conjunction with novel Penn State smart electronics or wireless communication systems suitable for condition monitoring of aircraft structures in-flight. A hybrid accelerometer and gyroscope in a single chip suitable for inertial navigation system and other microsensors for health monitoring and condition-based maintenance of structures, drag sensing and control of aircraft, strain and deflection of structures and systems, ice sensing on aircraft, remote temperature and humidity measurement of propellant in munitions, chemical sensing, etc. are discussed.

  10. Micro-patterning of resin-bonded NdFeB magnet for a fully integrated electromagnetic actuator

    NASA Astrophysics Data System (ADS)

    Tao, Kai; Wu, Jin; Kottapalli, Ajay Giri Prakash; Chen, Di; Yang, Zhuoqing; Ding, Guifu; Lye, Sun Woh; Miao, Jianmin

    2017-12-01

    This paper reports a fully-integrated, batch-fabricated electromagnetic actuator which features micro-patterned NdFeB magnets. The entire actuator is fabricated through MEMS-compatible laminated surface micromachining technology, eliminating the requirement for further component assembly processes. The fabrication strategy allowed the entire volume of the actuator to be reduced to a small size of 2.5 × 2.5 × 2 mm3, which is one of the smallest NdFeB-based electromagnetic actuators demonstrated to date. The magnetic properties of NdFeB thin films are further investigated and optimized using different types of lithographically-defined micromolds. By altering the direction of the input current, actuating displacements of approximately ±10 μm are achieved during both the attraction and the repulsion operations. This work demonstrates the viability and compatibility of using polymer-bonded magnets for magnetic MEMS applications.

  11. CROSS-DISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY: Surface Micromachined Adjustable Micro-Concave Mirror for Bio-Detection Applications

    NASA Astrophysics Data System (ADS)

    Kuo, Ju-Nan; Chen, Wei-Lun; Jywe, Wen-Yuh

    2009-08-01

    We present a bio-detection system integrated with an adjustable micro-concave mirror. The bio-detection system consists of an adjustable micro-concave mirror, micro flow cytometer chip and optical detection module. The adjustable micro-concave mirror can be fabricated with ease using commercially available MEMS foundry services (such as multiuser MEMS processes, MUMPs) and its curvature can be controlled utilizing thermal or electrical effects. Experimental results show that focal lengths of the micro-concave mirror ranging from 313.5 to 2275.0 μm are achieved. The adjustable micro-concave mirror can be used to increase the efficiency of optical detection and provide a high signal-to-noise ratio. The developed micro-concave mirror is integrated with a micro flow cytometer for cell counting applications. Successful counting of fluorescent-labeled beads is demonstrated using the developed method.

  12. Wideband monolithically integrated front-end subsystems and components

    NASA Astrophysics Data System (ADS)

    Mruk, Joseph Rene

    This thesis presents the analysis, design, and measurements of passive, monolithically integrated, wideband recta-coax and printed circuit board front-end components. Monolithic fabrication of antennas, impedance transformers, filters, and transitions lowers manufacturing costs by reducing assembly time and enhances performance by removing connectors and cabling between the devices. Computational design, fabrication, and measurements are used to demonstrate the capabilities of these front-end assemblies. Two-arm wideband planar log-periodic antennas fed using a horizontal feed that allows for filters and impedance transformers to be readily fabricated within the radiating region of the antenna are demonstrated. At microwave frequencies, low-cost printed circuit board processes are typically used to produce planar devices. A 1.8 to 11 GHz two-arm planar log-periodic antenna is designed with a monolithically integrated impedance transformer. Band rejection methods based on modifying the antenna aperture, use of an integrated filter, and the application of both methods are investigated with realized gain suppressions of over 25 dB achieved. The ability of standard circuit board technology to fabricate millimeter-wave devices up to 110 GHz is severely limited. Thin dielectrics are required to prevent the excitation of higher order modes in the microstrip substrate. Fabricating the thin line widths required for the antenna aperture also becomes prohibitively challenging. Surface micro-machining typically used in the fabrication of MEMS devices is capable of producing the extremely small features that can be used to fabricate antennas extending through W-band. A directly RF fed 18 to 110 GHz planar log-periodic antenna is developed. The antenna is fabricated with an integrated impedance transformer and additional transitions for measurement characterization. Singly terminated low-loss wideband millimeter-wave filters operating over V- and W- band are developed. High quality performance of an 18 to 100 GHz front-end is realized by dividing the single instantaneous antenna into two apertures operating from 18 to 50 and 50 to 100 GHz. Each channel features an impedance transformer, low-pass (low-frequency) or band-pass (high-frequency) filter, and grounded CPW launch. This dual-aperture front-end demonstrates that micromachining technology is now capable of fabricating broadband millimeter-wave components with a high degree of integration.

  13. Miniaturized ultrasound imaging probes enabled by CMUT arrays with integrated frontend electronic circuits.

    PubMed

    Khuri-Yakub, B T; Oralkan, Omer; Nikoozadeh, Amin; Wygant, Ira O; Zhuang, Steve; Gencel, Mustafa; Choe, Jung Woo; Stephens, Douglas N; de la Rama, Alan; Chen, Peter; Lin, Feng; Dentinger, Aaron; Wildes, Douglas; Thomenius, Kai; Shivkumar, Kalyanam; Mahajan, Aman; Seo, Chi Hyung; O'Donnell, Matthew; Truong, Uyen; Sahn, David J

    2010-01-01

    Capacitive micromachined ultrasonic transducer (CMUT) arrays are conveniently integrated with frontend integrated circuits either monolithically or in a hybrid multichip form. This integration helps with reducing the number of active data processing channels for 2D arrays. This approach also preserves the signal integrity for arrays with small elements. Therefore CMUT arrays integrated with electronic circuits are most suitable to implement miniaturized probes required for many intravascular, intracardiac, and endoscopic applications. This paper presents examples of miniaturized CMUT probes utilizing 1D, 2D, and ring arrays with integrated electronics.

  14. MEMS high-speed angular-position sensing system with rf wireless transmission

    NASA Astrophysics Data System (ADS)

    Sun, Winston; Li, Wen J.

    2001-08-01

    A novel surface-micromachined non-contact high-speed angular-position sensor with total surface area under 4mm2 was developed using the Multi-User MEMS Processes (MUMPs) and integrated with a commercial RF transmitter at 433MHz carrier frequency for wireless signal detection. Currently, a 2.3 MHz internal clock of our data acquisition system and a sensor design with a 13mg seismic mass is sufficient to provide visual observation of a clear sinusoidal response wirelessly generated by the piezoresistive angular-position sensing system within speed range of 180 rpm to around 1000 rpm. Experimental results showed that the oscillation frequency and amplitude are related to the input angular frequency of the rotation disk and the tilt angle of the rotation axis, respectively. These important results could provide groundwork for MEMS researchers to estimate how gravity influences structural properties of MEMS devices under different circumstances.

  15. Optical network of silicon micromachined sensors

    NASA Astrophysics Data System (ADS)

    Wilson, Mark L.; Burns, David W.; Zook, J. David

    1996-03-01

    The Honeywell Technology Center, in collaboration with the University of Wisconsin and the Mobil Corporation, and under funding from this ARPA sponsored program, are developing a new type of `hybrid' micromachined silicon/fiber optic sensor that utilizes the best attributes of each technology. Fiber optics provide a noise free method to read out the sensor without electrical power required at the measurement point. Micromachined silicon sensor techniques provide a method to design many different types of sensors such as temperature, pressure, acceleration, or magnetic field strength and report the sensor data using FDM methods. Our polysilicon resonant microbeam structures have a built in Fabry-Perot interferometer that offers significant advantages over other configurations described in the literature. Because the interferometer is an integral part of the structure, the placement of the fiber becomes non- critical, and packaging issues become considerably simpler. The interferometer spacing are determined by the thin-film fabrication processes and therefore can be extremely well controlled. The main advantage, however, is the integral vacuum cavity that ensures high Q values. Testing results have demonstrated relaxed alignment tolerances in packaging these devices, with an excellent Signal to Noise Ratio. Networks of 16 or more sensors are currently being developed. STORM (Strain Transduction by Optomechanical Resonant Microbeams) sensors can also provide functionality and self calibration information which can be used to improve the overall system reliability. Details of the sensor and network design, as well as test results, are presented.

  16. Fabricating micro-instruments in surface-micromachined polycrystalline silicon

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Comtois, J.H.; Michalicek, M.A.; Barron, C.C.

    1997-04-01

    Smaller, lighter instruments can be fabricated as Micro-Electro-Mechanical Systems (MEMS), having micron scale moving parts packaged together with associated control and measurement electronics. Batch fabrication of these devices will make economical applications such as condition-based machine maintenance and remote sensing. The choice of instrumentation is limited only by the designer`s imagination. This paper presents one genre of MEMS fabrication, surface-micromachined polycrystalline silicon (polysilicon). Two currently available but slightly different polysilicon processes are presented. One is the ARPA-sponsored ``Multi-User MEMS ProcesS`` (MUMPS), available commercially through MCNC; the other is the Sandia National Laboratories ``Sandia Ultra-planar Multilevel MEMS Technology`` (SUMMiT). Example componentsmore » created in both processes will be presented, with an emphasis on actuators, actuator force testing instruments, and incorporating actuators into larger instruments.« less

  17. Material removal effect of microchannel processing by femtosecond laser

    NASA Astrophysics Data System (ADS)

    Zhang, Pan; Chen, Lei; Chen, Jianxiong; Tu, Yiliu

    2017-11-01

    Material processing using ultra-short-pulse laser is widely used in the field of micromachining, especially for the precision processing of hard and brittle materials. This paper reports a theoretical and experimental study of the ablation characteristics of a silicon wafer under micromachining using a femtosecond laser. The ablation morphology of the silicon wafer surface is surveyed by a detection test with an optical microscope. First, according to the relationship between the diameter of the ablation holes and the incident laser power, the ablation threshold of the silicon wafer is found to be 0.227 J/cm2. Second, the influence of various laser parameters on the size of the ablation microstructure is studied and the ablation morphology is analyzed. Furthermore, a mathematical model is proposed that can calculate the ablation depth per time for a given laser fluence and scanning velocity. Finally, a microchannel milling test is carried out on the micromachining center. The effectiveness and accuracy of the proposed models are verified by comparing the estimated depth to the actual measured results.

  18. MEMS reliability: The challenge and the promise

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Miller, W.M.; Tanner, D.M.; Miller, S.L.

    1998-05-01

    MicroElectroMechanical Systems (MEMS) that think, sense, act and communicate will open up a broad new array of cost effective solutions only if they prove to be sufficiently reliable. A valid reliability assessment of MEMS has three prerequisites: (1) statistical significance; (2) a technique for accelerating fundamental failure mechanisms, and (3) valid physical models to allow prediction of failures during actual use. These already exist for the microelectronics portion of such integrated systems. The challenge lies in the less well understood micromachine portions and its synergistic effects with microelectronics. This paper presents a methodology addressing these prerequisites and a description ofmore » the underlying physics of reliability for micromachines.« less

  19. Far-field emission characteristics and linewidth measurements of surface micro-machined MEMS tunable VCSELs

    NASA Astrophysics Data System (ADS)

    Paul, Sujoy; Gierl, Christian; Gründl, Tobias; Zogal, Karolina; Meissner, Peter; Amann, Markus-Christian; Küppers, Franko

    2013-03-01

    In this paper, we demonstrate for the first time the far-field experimental results and the linewidth characteris- tics for widely tunable surface-micromachined micro-electro-mechanical system (MEMS) vertical-cavity surface- emitting lasers (VCSELs) operating at 1550 nm. The fundamental Gaussian mode emission is confirmed by optimizing the radius of curvature of top distributed Bragg reflector (DBR) membrane and by choosing an ap- propriate diameter of circular buried tunnel junctions (BTJs) so that only the fundamental Gaussian mode can sustain. For these VCSELs, a mode-hop free continuous tuning over 100 nm has already been demonstrated, which is achieved by electro-thermal tuning of the MEMS mirror. The fiber-coupled optical power of 2mW over the entire tuning range has been reported. The singlemode laser emission has more than 40 dB of side-mode suppression ratio (SMSR). The smallest linewidth achieved with these of MEMS tunable VCSELs is 98MHz which is one order of magnitude higher than that of fixed-wavelength VCSELs.

  20. Acceleration sensitivity of micromachined pressure sensors

    NASA Astrophysics Data System (ADS)

    August, Richard; Maudie, Theresa; Miller, Todd F.; Thompson, Erik

    1999-08-01

    Pressure sensors serve a variety of automotive applications, some which may experience high levels of acceleration such as tire pressure monitoring. To design pressure sensors for high acceleration environments it is important to understand their sensitivity to acceleration especially if thick encapsulation layers are used to isolate the device from the hostile environment in which they reside. This paper describes a modeling approach to determine their sensitivity to acceleration that is very general and is applicable to different device designs and configurations. It also describes the results of device testing of a capacitive surface micromachined pressure sensor at constant acceleration levels from 500 to 2000 g's.

  1. pMUT+ASIC integrated platform for wide range ultrasonic imaging

    NASA Astrophysics Data System (ADS)

    Tillak, J.; Saeed, N.; Khazaaleh, S.; Viegas, J.; Yoo, J.

    2017-03-01

    We propose an integrated platform of Aluminum Nitrate (AlN) based Piezoelectric Micromachined Ultrasonic Transducer (pMUT) phased array with Application Specific Integrated Circuit (ASIC) for medical imaging and industrial diagnosis. The ASIC provides wide driving range for frequencies between 100 kHz and 5 MHz and channelscalable, programmable application adaptive transmitting beamformer. The system supports operation in various media, including gasses, liquids and biological tissue. The scan resolution for 5 MHz operation is 68 μm in air. The beamformer covers a test volume from -30° to +30° with a step of 3° and scan depth of 10 cm. The ASIC system features low noise receiver electronics, power saving transmission circuitry, and high-voltage drive of large capacitance transducer (up to 500 pF). Integrated pMUT phased array consists of 4 channels of single-membrane ultrasonic transducer of 400 nm deflection and 20 pF feed-thru capacitance, which produce 15 Pa pressure at 500 μm distance from the surface of the transducers. The active area of the ASIC is (700×1490) μm2, which includes channel scalable TX, 8-channale low noise RX, digital back end with autonomous beamformer and power management unit. The system is battery powered with 3.3V-5V standard supply, representing a truly portable solution for ultrasonic applications. Given the CMOS-compatible fabrication process for the AlN pMUTs, dense, miniaturized arrays are possible. Furthermore the smooth surface of dielectric AlN renders optical quality MEMS surfaces for integration in miniaturized photonic + ultrasound microsystems.

  2. Long-Term Outdoor Reliability Assessment of a Wireless Unit for Air-Quality Monitoring Based on Nanostructured Films Integrated on Micromachined Platforms

    PubMed Central

    Leccardi, Matteo; Decarli, Massimiliano; Lorenzelli, Leandro; Milani, Paolo; Mettala, Petteri; Orava, Risto; Barborini, Emanuele

    2012-01-01

    We have fabricated and tested in long-term field operating conditions a wireless unit for outdoor air quality monitoring. The unit is equipped with two multiparametric sensors, one miniaturized thermo-hygrometer, front-end analogical and digital electronics, and an IEEE 802.15.4 based module for wireless data transmission. Micromachined platforms were functionalized with nanoporous metal-oxides to obtain multiparametric sensors, hosting gas-sensitive, anemometric and temperature transducers. Nanoporous metal-oxide layer was directly deposited on gas sensing regions of micromachined platform batches by hard-mask patterned supersonic cluster beam deposition. An outdoor, roadside experiment was arranged in downtown Milan (Italy), where one wireless sensing unit was continuously operated side by side with standard gas chromatographic instrumentation for air quality measurements. By means of a router PC, data from sensing unit and other instrumentation were collected, merged, and sent to a remote data storage server, through an UMTS device. The whole-system robustness as well as sensor dataset characteristics were continuously characterized over a run-time period of 18 months. PMID:22969394

  3. Micro-machined resonator oscillator

    DOEpatents

    Koehler, D.R.; Sniegowski, J.J.; Bivens, H.M.; Wessendorf, K.O.

    1994-08-16

    A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a telemetered sensor beacon'' that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20--100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available. 21 figs.

  4. Dual-beam focused ion beam/electron microscopy processing and metrology of redeposition during ion-surface 3D interactions, from micromachining to self-organized picostructures.

    PubMed

    Moberlychan, Warren J

    2009-06-03

    Focused ion beam (FIB) tools have become a mainstay for processing and metrology of small structures. In order to expand the understanding of an ion impinging a surface (Sigmund sputtering theory) to our processing of small structures, the significance of 3D boundary conditions must be realized. We consider ion erosion for patterning/lithography, and optimize yields using the angle of incidence and chemical enhancement, but we find that the critical 3D parameters are aspect ratio and redeposition. We consider focused ion beam sputtering for micromachining small holes through membranes, but we find that the critical 3D considerations are implantation and redeposition. We consider ion beam self-assembly of nanostructures, but we find that control of the redeposition by ion and/or electron beams enables the growth of nanostructures and picostructures.

  5. Surface micromachined counter-meshing gears discrimination device

    DOEpatents

    Polosky, Marc A.; Garcia, Ernest J.; Allen, James J.

    2000-12-12

    A surface micromachined Counter-Meshing Gears (CMG) discrimination device which functions as a mechanically coded lock. Each of two CMG has a first portion of its perimeter devoted to continuous driving teeth that mesh with respective pinion gears. Each EMG also has a second portion of its perimeter devoted to regularly spaced discrimination gear teeth that extend outwardly on at least one of three levels of the CMG. The discrimination gear teeth are designed so as to pass each other without interference only if the correct sequence of partial rotations of the CMG occurs in response to a coded series of rotations from the pinion gears. A 24 bit code is normally input to unlock the device. Once unlocked, the device provides a path for an energy or information signal to pass through the device. The device is designed to immediately lock up if any portion of the 24 bit code is incorrect.

  6. Fabrication of micromachined focusing mirrors with seamless reflective surface

    NASA Astrophysics Data System (ADS)

    Hou, Max Ti-Kuang; Liao, Ke-Min; Yeh, Hong-Zhen; Cheng, Bo-Wen; Hong, Pei-Yuan; Chen, Rongshun

    2003-01-01

    A surface-micromachined focusing mirror with variable focal length, which is controlled by adjusting the mirror"s curvature, is fabricated and characterized. The bowl-shaped micromirror, which is fabricated from the micro bilayer circular plate, focuses light beam through thermal actuation of the external heat source. Both the initial and operational curvatures are manipulated by the residual stresses in two layers of the mirror. Improper stresses would lead to the failure of the bowl-shaped structure. We analyze and design geometrical dimensions for simultaneously avoiding the structure failure and increasing the tuning range of the focal length. The interferometer has been used to measure the focal length and the focusing ability. Mirrors with nominal focal lengths approximately 730 μm, and tuning ranges of about 50 microns were demonstrated. The measurement directly through optical approach has also been tried, but requires further investigation, because the laser beam affects the focusing of the micromirror seriously.

  7. Biasing of Capacitive Micromachined Ultrasonic Transducers.

    PubMed

    Caliano, Giosue; Matrone, Giulia; Savoia, Alessandro Stuart

    2017-02-01

    Capacitive micromachined ultrasonic transducers (CMUTs) represent an effective alternative to piezoelectric transducers for medical ultrasound imaging applications. They are microelectromechanical devices fabricated using silicon micromachining techniques, developed in the last two decades in many laboratories. The interest for this novel transducer technology relies on its full compatibility with standard integrated circuit technology that makes it possible to integrate on the same chip the transducers and the electronics, thus enabling the realization of extremely low-cost and high-performance devices, including both 1-D or 2-D arrays. Being capacitive transducers, CMUTs require a high bias voltage to be properly operated in pulse-echo imaging applications. The typical bias supply residual ripple of high-quality high-voltage (HV) generators is in the millivolt range, which is comparable with the amplitude of the received echo signals, and it is particularly difficult to minimize. The aim of this paper is to analyze the classical CMUT biasing circuits, highlighting the features of each one, and to propose two novel HV generator architectures optimized for CMUT biasing applications. The first circuit proposed is an ultralow-residual ripple (<5 [Formula: see text]) HV generator that uses an extremely stable sinusoidal power oscillator topology. The second circuit employs a commercially available integrated step-up converter characterized by a particularly efficient switching topology. The circuit is used to bias the CMUT by charging a buffer capacitor synchronously with the pulsing sequence, thus reducing the impact of the switching noise on the received echo signals. The small area of the circuit (about 1.5 cm 2 ) makes it possible to generate the bias voltage inside the probe, very close to the CMUT, making the proposed solution attractive for portable applications. Measurements and experiments are shown to demonstrate the effectiveness of the new approaches presented.

  8. Laser-assisted electrochemical micromachining of mould cavity on the stainless steel surface

    NASA Astrophysics Data System (ADS)

    Li, Xiaohai; Wang, Shuming; Wang, Dong; Tong, Han

    2018-02-01

    In order to fabricate the micro mould cavities with complex structures on 304 stainless steel, laser-assisted electrochemical micromachining (EMM) based on surface modification by fiber laser masking was studied,and a new device of laser-assisted EMM was developed. Laser marking on the surface of 304 stainless steel can first be realized by fiber laser heating scanning. Through analysis of X ray diffraction analysis (XRD), metal oxide layer with predefined pattern can be formed by laser marking, and phase transformation can also occur on the 304 stainless steel surface, which produce the laser masking layer with corrosion resistance. The stainless steel surface with laser masking layer is subsequently etched by EMM, the laser masking layer severs as the temporary protective layer without relying on lithography mask, the fabrication of formed electrodes is also avoided, so micro pattern cavities can fast be fabricated. The impacts on machining accuracy during EMM with laser masking were discussed to optimize machining parameters, such as machining voltage, electrolyte concentration, duty cycle of pulse power supply and electrode gap size, the typical mould cavities 23μm deep were fabricated under the optimized parameters.

  9. Miniaturized Ultrasound Imaging Probes Enabled by CMUT Arrays with Integrated Frontend Electronic Circuits

    PubMed Central

    Khuri-Yakub, B. (Pierre) T.; Oralkan, Ömer; Nikoozadeh, Amin; Wygant, Ira O.; Zhuang, Steve; Gencel, Mustafa; Choe, Jung Woo; Stephens, Douglas N.; de la Rama, Alan; Chen, Peter; Lin, Feng; Dentinger, Aaron; Wildes, Douglas; Thomenius, Kai; Shivkumar, Kalyanam; Mahajan, Aman; Seo, Chi Hyung; O’Donnell, Matthew; Truong, Uyen; Sahn, David J.

    2010-01-01

    Capacitive micromachined ultrasonic transducer (CMUT) arrays are conveniently integrated with frontend integrated circuits either monolithically or in a hybrid multichip form. This integration helps with reducing the number of active data processing channels for 2D arrays. This approach also preserves the signal integrity for arrays with small elements. Therefore CMUT arrays integrated with electronic circuits are most suitable to implement miniaturized probes required for many intravascular, intracardiac, and endoscopic applications. This paper presents examples of miniaturized CMUT probes utilizing 1D, 2D, and ring arrays with integrated electronics. PMID:21097106

  10. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Albert G. Baca; Edwin J. Heller; Gregory C. Frye-Mason

    High sensitivity acoustic wave chemical microsensors are being developed on GaAs substrates. These devices take advantage of the piezoelectric properties of GaAs as well as its mature microelectronics fabrication technology and nascent micromachining technology. The design, fabrication, and response of GaAs SAW chemical microsensors are reported. Functional integrated GaAs SAW oscillators, suitable for chemical sensing, have been produced. The integrated oscillator requires 20 mA at 3 VK, operates at frequencies up to 500 MHz, and occupies approximately 2 mmz. Discrete GaAs sensor components, including IC amplifiers, SAW delay lines, and IC phase comparators have been fabricated and tested. A temperaturemore » compensation scheme has been developed that overcomes the large temperature dependence of GaAs acoustic wave devices. Packaging issues related to bonding miniature flow channels directly to the GaAs substrates have been resolved. Micromachining techniques for fabricating FPW and TSM microsensors on thin GaAs membranes are presented and GaAs FPW delay line performance is described. These devices have potentially higher sensitivity than existing GaAs and quartz SAW sensors.« less

  11. A miniature Joule-Thomson cooler for optical detectors in space.

    PubMed

    Derking, J H; Holland, H J; Tirolien, T; ter Brake, H J M

    2012-04-01

    The utilization of single-stage micromachined Joule-Thomson (JT) coolers for cooling small optical detectors is investigated. A design of a micromachined JT cold stage-detector system is made that focuses on the interface between a JT cold stage and detector, and on the wiring of the detector. Among various techniques, adhesive bonding is selected as most suitable technique for integrating the detector with the JT cold stage. Also, the optimum wiring of the detector is discussed. In this respect, it is important to minimize the heat conduction through the wiring. Therefore, each wire should be optimized in terms of acceptable impedance and thermal heat load. It is shown that, given a certain impedance, the conductive heat load of electrically bad conducting materials is about twice as high as that of electrically good conducting materials. A micromachined JT cold stage is designed and integrated with a dummy detector. The JT cold stage is operated at 100 K with nitrogen as the working fluid and at 140 K with methane. Net cooling powers of 143 mW and 117 mW are measured, respectively. Taking into account a radiative heat load of 40 mW, these measured values make the JT cold stage suitable for cooling a photon detector with a power dissipation up to 50 mW, allowing for another 27 to 53 mW heat load arising from the electrical leads. © 2012 American Institute of Physics

  12. Micromachined ultrasound transducers with improved coupling factors from a CMOS compatible process

    PubMed

    Eccardt; Niederer

    2000-03-01

    For medical high frequency acoustic imaging purposes the reduction in size of a single transducer element for one-dimensional and even more for two-dimensional arrays is more and more limited by fabrication and cabling technology. In the fields of industrial distance measurement and simple object recognition low cost phased arrays are lacking. Both problems can be solved with micromachined ultrasound transducers (MUTs). A single transducer is made of a large number of microscopic elements. Because of the array structure of these transducers, groups of elements can be built up and used as a phased array. By integrating parts of the sensor electronics on chip, the cabling effort for arrays can be reduced markedly. In contrast to standard ultrasonic technology, which is based on massive thickness resonators, vibrating membranes are the radiating elements of the MUTs. New micromachining technologies have emerged, allowing a highly reproducible fabrication of electrostatically driven membranes with gap heights below 500 nm. A microelectronic BiCMOS process was extended for surface micromechanics (T. Scheiter et al., Proceedings 11th European Conference on Solid-State Transducers, Warsaw, Vol. 3, 1997, pp. 1595-1598). Additional process steps were included for the realization of the membranes which form sealed cavities with the underlying substrate. Membrane and substrate are the opposite electrodes of a capacitive transducer. The transducers can be integrated monolithically on one chip together with the driving, preamplifying and multiplexing circuitry, thus reducing parasitic capacities and noise level significantly. Owing to their low mass the transducers are very well matched to fluid loads, resulting in a very high bandwidth of 50-100% (C. Eccardt et al., Proceedings Ultrasonics Symposium, San Antonio, Vol. 2, 1996, pp. 959-962; P.C. Eccardt et al., Proceedings of the 1997 Ultrasonics Symposium, Toronto, Vol. 2, 1997, pp. 1609-1618). In the following it is shown how the BiCMOS process has been modified to meet the demands for ultrasound generation and reception. Bias and driving voltages have been reduced down to the 10 V range. The electromechanical coupling is now almost comparable with that for piezoelectric transducers. The measurements exhibit sound pressures and bandwidths that are at least comparable with those of conventional piezoelectric transducer arrays.

  13. Physics-based signal processing algorithms for micromachined cantilever arrays

    DOEpatents

    Candy, James V; Clague, David S; Lee, Christopher L; Rudd, Robert E; Burnham, Alan K; Tringe, Joseph W

    2013-11-19

    A method of using physics-based signal processing algorithms for micromachined cantilever arrays. The methods utilize deflection of a micromachined cantilever that represents the chemical, biological, or physical element being detected. One embodiment of the method comprises the steps of modeling the deflection of the micromachined cantilever producing a deflection model, sensing the deflection of the micromachined cantilever and producing a signal representing the deflection, and comparing the signal representing the deflection with the deflection model.

  14. Microelectromechanical reciprocating-tooth indexing apparatus

    DOEpatents

    Allen, James J.

    1999-01-01

    An indexing apparatus is disclosed that can be used to rotate a gear or move a rack in a precise, controllable manner. The indexing apparatus, based on a reciprocating shuttle driven by one or more actuators, can be formed either as a micromachine, or as a millimachine. The reciprocating shuttle of the indexing apparatus can be driven by a thermal, electrostatic or electromagnetic actuator, with one or more wedge-shaped drive teeth of the shuttle being moveable to engage and slide against indexing teeth on the gear or rack, thereby moving the gear or rack. The indexing apparatus can be formed by either surface micromachining processes or LIGA processes, depending on the size of the apparatus that is to be formed.

  15. Silicon microfabricated beam expander

    NASA Astrophysics Data System (ADS)

    Othman, A.; Ibrahim, M. N.; Hamzah, I. H.; Sulaiman, A. A.; Ain, M. F.

    2015-03-01

    The feasibility design and development methods of silicon microfabricated beam expander are described. Silicon bulk micromachining fabrication technology is used in producing features of the structure. A high-precision complex 3-D shape of the expander can be formed by exploiting the predictable anisotropic wet etching characteristics of single-crystal silicon in aqueous Potassium-Hydroxide (KOH) solution. The beam-expander consist of two elements, a micromachined silicon reflector chamber and micro-Fresnel zone plate. The micro-Fresnel element is patterned using lithographic methods. The reflector chamber element has a depth of 40 µm, a diameter of 15 mm and gold-coated surfaces. The impact on the depth, diameter of the chamber and absorption for improved performance are discussed.

  16. Development of Silicon Micromirrors for the Next Generation Space Telescope

    NASA Astrophysics Data System (ADS)

    Garcia, E. J.; Polosky, M. A.; Sleefe, G. E.; Habbit, R.; Zamora, J. C.; Greenhouse, M. A.

    2001-12-01

    This paper describes how advanced surface micromachining (SMM) technology is being used to develop prototype cryogenic micromirror arrays for evaluation as an instrument optical component for the NGST. When used as a spectrograph reflective slit mask, these arrays can yield a factor of 1000 reduction in mass and power over, traditional motor-driven slit wheels used on HST instruments. The advantage of micromirrors as a new approach to instrument aperture control is particularly apparent when it is coupled with new large format focal plane arrays to enable multi-object spectroscopy. In this application, the micromirror-enabled capability goes beyond mass and power reduction to offer increased observing efficiency (targets/hour). In the case of NGST, a factor of 100 improvement in efficiency relative to traditional instrument designs has been estimated. Surface micromachining uses fabrication processes adapted from integrated circuit manufacturing to build microscopic-sized electromechanical devices from polycrystalline silicon. Because these devices can be batch fabricated thousands or even millions of devices can be constructed on a single wafer at costs several orders of magnitude less than conventionally fabricated devices. This paper will describe the design and operation of prototype mirror devices that are currently under development. We have recently demonstrated the feasibility of operating micromirrors at cryogenic temperatures. A packaged unit with its associated interconnects has been successfully operated at temperatures less than 30 K. The ability to function at the cryogenic temperatures encountered in certain space applications is a major milestone for microsystems. This work is funded by NASA Goddard Space Flight Center. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Dept. of Energy under Contract DE-AC04-94AL85000.

  17. Proceedings of the International Conference on Integrated Micro/Nanotechnology for Space Applications

    NASA Technical Reports Server (NTRS)

    1995-01-01

    The recent evolution of microelectronic technologies coupled with the growth of micro-electro-mechanical systems (MEMS) has had significant impact in the commercial sector. The focus of this conference was to anticipate and extend the incorporation of nano-electronics and MEMS into application specific integrated microinstruments (ASIM's) in space systems. Presentations ranged from mission application of nano-satellites to silicon micromachining for photonic applications.

  18. Vascular stents with submicrometer-scale surface patterning realized via titanium deep reactive ion etching

    NASA Astrophysics Data System (ADS)

    Gott, Shannon C.; Jabola, Benjamin A.; Rao, Masaru P.

    2015-08-01

    Herein, we report progress towards realization of vascular stents that will eventually provide opportunity for evaluating cellular response to rationally-designed, submicrometer-scale surface patterning in physiologically-relevant contexts, i.e. those that provide exposure to the complex multicellular milieu, flow-induced shear, and tissue-device interactions present in vivo. Specifically, using our novel titanium deep reactive ion etching technique (Ti DRIE), we discuss recent advances that have enabled: (a) fabrication of precisely-defined, grating-based surface patterns on planar Ti foils with minimum feature sizes as small as 0.15 μm (b) creation of cylindrical stents from micromachined planar Ti foils; and (c) integration of these processes to produce the first submicrometer-scale surface-patterned Ti stents that are compatible with conventional balloon catheter deployment techniques. We also discuss results from elastoplastic finite element simulations and preliminary mechanical testing of these devices to assess their mechanical performance. These efforts represent key steps towards our long-term goal of developing a new paradigm in stenting, where rationally-designed surface patterning provides a physical means for facilitating healing, and thus, improving outcomes in vascular intervention applications.

  19. An electromechanical material testing system for in situ electron microscopy and applications.

    PubMed

    Zhu, Yong; Espinosa, Horacio D

    2005-10-11

    We report the development of a material testing system for in situ electron microscopy (EM) mechanical testing of nanostructures. The testing system consists of an actuator and a load sensor fabricated by means of surface micromachining. This previously undescribed nanoscale material testing system makes possible continuous observation of the specimen deformation and failure with subnanometer resolution, while simultaneously measuring the applied load electronically with nanonewton resolution. This achievement was made possible by the integration of electromechanical and thermomechanical components based on microelectromechanical system technology. The system capabilities are demonstrated by the in situ EM testing of free-standing polysilicon films, metallic nanowires, and carbon nanotubes. In particular, a previously undescribed real-time instrumented in situ transmission EM observation of carbon nanotubes failure under tensile load is presented here.

  20. Microelectromechanical timer

    DOEpatents

    Polosky, Marc A.; Garcia, Ernest J.; Plummer, David W.

    2001-01-01

    A microminiature timer having an optical readout is disclosed. The timer can be formed by surface micromachining or LIGA processes on a silicon substrate. The timer includes an integral motor (e.g. an electrostatic motor) that can intermittently wind a mainspring to store mechanical energy for driving a train of meshed timing gears at a rate that is regulated by a verge escapement. Each timing gear contains an optical encoder that can be read out with one or more light beams (e.g. from a laser or light-emitting diode) to recover timing information. In the event that electrical power to the timer is temporarily interrupted, the mechanical clock formed by the meshed timing gears and verge escapement can continue to operate, generating accurate timing information that can be read out when the power is restored.

  1. Review on the importance of measurement technique in micromachine technology

    NASA Astrophysics Data System (ADS)

    Umeda, Akira

    1996-09-01

    In the beginning stage of MITI micromachine project, the committee on the standardization established in Micromachine Center recognized the importance of measurement technique for the promotion and the systemization of the micromachine technology. Micromachine Center is the organizing body for private sectors working in the MITI micromachine project which started in 1991. MITI stands for Ministry of International Trade and Industry in Japan. In order to known the requirements on the measurement technologies, the questionnaire was organized by the measurement working group in the committee. This talk covers the questionnaire and its results, and some research results obtained at National Research Laboratory of Metrology working as a member in the project.

  2. Repulsive force actuated rotary micromirror

    NASA Astrophysics Data System (ADS)

    He, Siyuan; Ben Mrad, Ridha

    2004-09-01

    In this paper, a novel repulsive force based rotary micromirror is proposed. A repulsive force is produced in the rotary micromirror and the mirror plate is pushed up and away from the substrate. Therefore the rotation angle of the micromirror is not limited to the space underneath the mirror plate and thus the "pull-in" effect is completely circumvented. The novel rotary micromirror can achieve a large rotation angle with a large mirror plate. In addition the novel micromirror has a very simple structure and can be fabricated by standard surface micromachining technology. Numerical simulation is used to verify the working principle of the novel micromirror. A prototype of the novel rotary micromirror is fabricated by a commercially available surface microfabrication process called MUMPs. The prototype has a mirror size of 300μm x 300μm. The experimental measurements show that the prototype can achieve a mechanical rotation of 2.25 degrees (an optical angle of 4.5 degrees) at a driving voltage of 170 volts. A conventional surface micromachined attractive force based rotary micromirror of the same size can only achieve an angle of 0.1~0.2 degree.

  3. Silicon micromachined waveguides for millimeter and submillimeter wavelengths

    NASA Technical Reports Server (NTRS)

    Yap, Markus; Tai, Yu-Chong; Mcgrath, William R.; Walker, Christopher

    1992-01-01

    The majority of radio receivers, transmitters, and components operating at millimeter and submillimeter wavelengths utilize rectangular waveguides in some form. However, conventional machining techniques for waveguides operating above a few hundred GHz are complicated and costly. This paper reports on the development of silicon micromachining techniques to create silicon-based waveguide circuits which can operate at millimeter and submillimeter wavelengths. As a first step, rectangular WR-10 waveguide structures have been fabricated from (110) silicon wafers using micromachining techniques. The waveguide is split along the broad wall. Each half is formed by first etching a channel completely through a wafer. Potassium hydroxide is used to etch smooth mirror-like vertical walls and LPCVD silicon nitride is used as a masking layer. This wafer is then bonded to another flat wafer using a polyimide bonding technique and diced into the U-shaped half wavelengths. Finally, a gold layer is applied to the waveguide walls. Insertion loss measurements show losses comparable to those of standard metal waveguides. It is suggested that active devices and planar circuits can be integrated with the waveguides, solving the traditional mounting problems. Potential applications in terahertz instrumentation technology are further discussed.

  4. Hybrid micromachining using a nanosecond pulsed laser and micro EDM

    NASA Astrophysics Data System (ADS)

    Kim, Sanha; Kim, Bo Hyun; Chung, Do Kwan; Shin, Hong Shik; Chu, Chong Nam

    2010-01-01

    Micro electrical discharge machining (micro EDM) is a well-known precise machining process that achieves micro structures of excellent quality for any conductive material. However, the slow machining speed and high tool wear are main drawbacks of this process. Though the use of deionized water instead of kerosene as a dielectric fluid can reduce the tool wear and increase the machine speed, the material removal rate (MRR) is still low. In contrast, laser ablation using a nanosecond pulsed laser is a fast and non-wear machining process but achieves micro figures of rather low quality. Therefore, the integration of these two processes can overcome the respective disadvantages. This paper reports a hybrid process of a nanosecond pulsed laser and micro EDM for micromachining. A novel hybrid micromachining system that combines the two discrete machining processes is introduced. Then, the feasibility and characteristics of the hybrid machining process are investigated compared to conventional EDM and laser ablation. It is verified experimentally that the machining time can be effectively reduced in both EDM drilling and milling by rapid laser pre-machining prior to micro EDM. Finally, some examples of complicated 3D micro structures fabricated by the hybrid process are shown.

  5. Bio-Inspired Stretchable Absolute Pressure Sensor Network

    PubMed Central

    Guo, Yue; Li, Yu-Hung; Guo, Zhiqiang; Kim, Kyunglok; Chang, Fu-Kuo; Wang, Shan X.

    2016-01-01

    A bio-inspired absolute pressure sensor network has been developed. Absolute pressure sensors, distributed on multiple silicon islands, are connected as a network by stretchable polyimide wires. This sensor network, made on a 4’’ wafer, has 77 nodes and can be mounted on various curved surfaces to cover an area up to 0.64 m × 0.64 m, which is 100 times larger than its original size. Due to Micro Electro-Mechanical system (MEMS) surface micromachining technology, ultrathin sensing nodes can be realized with thicknesses of less than 100 µm. Additionally, good linearity and high sensitivity (~14 mV/V/bar) have been achieved. Since the MEMS sensor process has also been well integrated with a flexible polymer substrate process, the entire sensor network can be fabricated in a time-efficient and cost-effective manner. Moreover, an accurate pressure contour can be obtained from the sensor network. Therefore, this absolute pressure sensor network holds significant promise for smart vehicle applications, especially for unmanned aerial vehicles. PMID:26729134

  6. Fiber laser micromachining of magnesium alloy tubes for biocompatible and biodegradable cardiovascular stents

    NASA Astrophysics Data System (ADS)

    Demir, Ali Gökhan; Previtali, Barbara; Colombo, Daniele; Ge, Qiang; Vedani, Maurizio; Petrini, Lorenza; Wu, Wei; Biffi, Carlo Alberto

    2012-02-01

    Magnesium alloys constitute an attractive solution for cardiovascular stent applications due to their intrinsic properties of biocompatibility and relatively low corrosion resistance in human-body fluids, which results in as a less intrusive treatment. Laser micromachining is the conventional process used to cut the stent mesh, which plays the key role for the accurate reproduction of the mesh design and the surface quality of the produced stent that are important factors in ensuring the mechanical and corrosion resistance properties of such a kind of devices. Traditionally continuous or pulsed laser systems working in microsecond pulse regime are employed for stent manufacturing. Pulsed fiber lasers on the other hand, are a relatively new solution which could balance productivity and quality aspects with shorter ns pulse durations and pulse energies in the order of mJ. This work reports the study of laser micromachining and of AZ31 magnesium alloy for the manufacturing of cardiovascular stents with a novel mesh design. A pulsed active fiber laser system operating in nanosecond pulse regime was employed for the micromachining. Laser parameters were studied for tubular cutting on a common stent material, AISI 316L tubes with 2 mm in diameter and 0.2 mm in thickness and on AZ31 tubes with 2.5 mm in diameter and 0.2 in thickness. In both cases process parameters conditions were examined for reactive and inert gas cutting solutions and the final stent quality is compared.

  7. Review: Semiconductor Piezoresistance for Microsystems.

    PubMed

    Barlian, A Alvin; Park, Woo-Tae; Mallon, Joseph R; Rastegar, Ali J; Pruitt, Beth L

    2009-01-01

    Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS). The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers.

  8. A micromachined carbon nanotube film cantilever-based energy cell

    NASA Astrophysics Data System (ADS)

    Gong, Zhongcheng; He, Yuan; Tseng, Yi-Hsuan; O'Neal, Chad; Que, Long

    2012-08-01

    This paper reports a new type of energy cell based on micromachined carbon nanotube film (CNF)-lead zirconate titanate cantilevers that is fabricated on silicon substrates. Measurements found that this type of micro-energy cell generates both AC voltages due to the self-reciprocation of the microcantilevers and DC voltages due to the thermoelectric effect upon exposure to light and thermal radiation, resulting from the unique optical and thermal properties of the CNF. Typically the measured power density of the micro-energy cell can be from 4 to 300 μW cm-2 when it is exposed to sunlight under different operational conditions. It is anticipated that hundreds of integrated micro-energy cells can generate power in the range of milliwatts, paving the way for the construction of self-powered micro- or nanosystems.

  9. Non-contact thermoacoustic detection of embedded targets using airborne-capacitive micromachined ultrasonic transducers

    NASA Astrophysics Data System (ADS)

    Nan, Hao; Boyle, Kevin C.; Apte, Nikhil; Aliroteh, Miaad S.; Bhuyan, Anshuman; Nikoozadeh, Amin; Khuri-Yakub, Butrus T.; Arbabian, Amin

    2015-02-01

    A radio frequency (RF)/ultrasound hybrid imaging system using airborne capacitive micromachined ultrasonic transducers (CMUTs) is proposed for the remote detection of embedded objects in highly dispersive media (e.g., water, soil, and tissue). RF excitation provides permittivity contrast, and ultra-sensitive airborne-ultrasound detection measures thermoacoustic-generated acoustic waves that initiate at the boundaries of the embedded target, go through the medium-air interface, and finally reach the transducer. Vented wideband CMUTs interface to 0.18 μm CMOS low-noise amplifiers to provide displacement detection sensitivity of 1.3 pm at the transducer surface. The carefully designed vented CMUT structure provides a fractional bandwidth of 3.5% utilizing the squeeze-film damping of the air in the cavity.

  10. Micromachined single-level nonplanar polycrystalline SiGe thermal microemitters for infrared dynamic scene projection

    NASA Astrophysics Data System (ADS)

    Malyutenko, V. K.; Malyutenko, O. Yu.; Leonov, V.; Van Hoof, C.

    2009-05-01

    The technology for self-supported membraneless polycrystalline SiGe thermal microemitters, their design, and performance are presented. The 128-element arrays with a fill factor of 88% and a 2.5-μm-thick resonant cavity have been grown by low-pressure chemical vapor deposition and fabricated using surface micromachining technology. The 200-nm-thick 60×60 μm2 emitting pixels enforced with a U-shape profile pattern demonstrate a thermal time constant of 2-7 ms and an apparent temperature of 700 K in the 3-5 and 8-12 μm atmospheric transparency windows. The application of the devices to the infrared dynamic scene simulation and their benefit over conventional planar membrane-supported emitters are discussed.

  11. Micromachined electrode array

    DOEpatents

    Okandan, Murat; Wessendorf, Kurt O.

    2007-12-11

    An electrode array is disclosed which has applications for neural stimulation and sensing. The electrode array, in certain embodiments, can include a plurality of electrodes each of which is flexibly attached to a common substrate using a plurality of springs to allow the electrodes to move independently. In other embodiments of the electrode array, the electrodes can be fixed to the substrate. The electrode array can be formed from a combination of bulk and surface micromachining, and can include electrode tips having an electroplated metal (e.g. platinum, iridium, gold or titanium) or a metal oxide (e.g. iridium oxide) for biocompatibility. The electrode array can be used to form a part of a neural prosthesis, and is particularly well adapted for use in an implantable retinal prosthesis.

  12. Micromachined electron tunneling infrared sensors

    NASA Technical Reports Server (NTRS)

    Kenny, T. W.; Kaiser, W. J.; Podosek, J. A.; Rockstad, H. K.; Reynolds, J. K.

    1993-01-01

    The development of an improved Golay cell is reported. This new sensor is constructed entirely from micromachined silicon components. A silicon oxynitride (SiO(x)N(y)) membrane is deflected by the thermal expansion of a small volume of trapped gas. To detect the motion of the membrane, an electron tunneling transducer is used. This sensor detects electrons which tunnel through the classically forbidden barrier between a tip and a surface; the electron current is exponentially dependent on the separation between the tip and the surface. The sensitivity of tunneling transducers constructed was typically better than 10(exp -3) A/square root of Hz. Through use of the electron tunneling transducer, the scaling laws which have prevented the miniaturization of the Golay cell are avoided. This detector potentially offers low cost fabrication, compatibility with silicon readout electronics, and operation without cooling. Most importantly, this detector may offer better sensitivity than any other uncooled infrared sensor, with the exception of the original Golay cell.

  13. Integrated Optical Interferometers with Micromachined Diaphragms for Pressure Sensing

    NASA Technical Reports Server (NTRS)

    DeBrabander, Gregory N.; Boyd, Joseph T.

    1996-01-01

    Optical pressure sensors have been fabricated which use an integrated optical channel waveguide that is part of an interferometer to measure the pressure-induced strain in a micromachined silicon diaphragm. A silicon substrate is etched from the back of the wafer leaving a rectangular diaphragm. On the opposite side of the wafer, ring resonator and Mach-Zehnder interferometers are formed with optical channel waveguides made from a low pressure chemical vapor deposited film of silicon oxynitride. The interferometer's phase is altered by pressure-induced stress in a channel segment positioned over the long edge of the diaphragm. The phase change in the ring resonator is monitored using a link-insensitive swept frequency laser diode, while in the Mach-Zehnder it is determined using a broad band super luminescent diode with subsequent wavelength separation. The ring resonator was found to be highly temperature sensitive, while the Mach-Zehnder, which had a smaller optical path length difference, was proportionally less so. The quasi-TM mode was more sensitive to pressure, in accord with calculations. Waveguide and sensor theory, sensitivity calculations, a fabrication sequence, and experimental results are presented.

  14. A micromachined membrane-based active probe for biomolecular mechanics measurement

    NASA Astrophysics Data System (ADS)

    Torun, H.; Sutanto, J.; Sarangapani, K. K.; Joseph, P.; Degertekin, F. L.; Zhu, C.

    2007-04-01

    A novel micromachined, membrane-based probe has been developed and fabricated as assays to enable parallel measurements. Each probe in the array can be individually actuated, and the membrane displacement can be measured with high resolution using an integrated diffraction-based optical interferometer. To illustrate its application in single-molecule mechanics experiments, this membrane probe was used to measure unbinding forces between L-selectin reconstituted in a polymer-cushioned lipid bilayer on the probe membrane and an antibody adsorbed on an atomic force microscope cantilever. Piconewton range forces between single pairs of interacting molecules were measured from the cantilever bending while using the membrane probe as an actuator. The integrated diffraction-based optical interferometer of the probe was demonstrated to have <10 fm Hz-1/2 noise floor for frequencies as low as 3 Hz with a differential readout scheme. With soft probe membranes, this low noise level would be suitable for direct force measurements without the need for a cantilever. Furthermore, the probe membranes were shown to have 0.5 µm actuation range with a flat response up to 100 kHz, enabling measurements at fast speeds.

  15. Silicon Alignment Pins: An Easy Way to Realize a Wafer-to-Wafer Alignment

    NASA Technical Reports Server (NTRS)

    Jung-Kubiak, Cecile; Reck, Theodore J.; Lin, Robert H.; Peralta, Alejandro; Gill, John J.; Lee, Choonsup; Siles, Jose; Toda, Risaku; Chattopadhyay, Goutam; Cooper, Ken B.; hide

    2013-01-01

    Submillimeter heterodyne instruments play a critical role in addressing fundamental questions regarding the evolution of galaxies as well as being a crucial tool in planetary science. To make these instruments compatible with small platforms, especially for the study of the outer planets, or to enable the development of multi-pixel arrays, it is essential to reduce the mass, power, and volume of the existing single-pixel heterodyne receivers. Silicon micromachining technology is naturally suited for making these submillimeter and terahertz components, where precision and accuracy are essential. Waveguide and channel cavities are etched in a silicon bulk material using deep reactive ion etching (DRIE) techniques. Power amplifiers, multiplier and mixer chips are then integrated and the silicon pieces are stacked together to form a supercompact receiver front end. By using silicon micromachined packages for these components, instrument mass can be reduced and higher levels of integration can be achieved. A method is needed to assemble accurately these silicon pieces together, and a technique was developed here using etched pockets and silicon pins to align two wafers together.

  16. Sorting Rotating Micromachines by Variations in Their Magnetic Properties

    NASA Astrophysics Data System (ADS)

    Howell, Taylor A.; Osting, Braxton; Abbott, Jake J.

    2018-05-01

    We consider sorting for the broad class of micromachines (also known as microswimmers, microrobots, micropropellers, etc.) propelled by rotating magnetic fields. We present a control policy that capitalizes on the variation in magnetic properties between otherwise-homogeneous micromachines to enable the sorting of a select fraction of a group from the remainder and prescribe its net relative movement, using a uniform magnetic field that is applied equally to all micromachines. The method enables us to accomplish this sorting task using open-loop control, without relying on a structured environment or localization information of individual micromachines. With our method, the control time to perform the sort is invariant to the number of micromachines. The method is verified through simulations and scaled experiments. Finally, we include an extended discussion about the limitations of the method and address open questions related to its practical application.

  17. Optimization of Neutral Atom Imagers

    NASA Technical Reports Server (NTRS)

    Shappirio, M.; Coplan, M.; Balsamo, E.; Chornay, D.; Collier, M.; Hughes, P.; Keller, J.; Ogilvie, K.; Williams, E.

    2008-01-01

    The interactions between plasma structures and neutral atom populations in interplanetary space can be effectively studied with energetic neutral atom imagers. For neutral atoms with energies less than 1 keV, the most efficient detection method that preserves direction and energy information is conversion to negative ions on surfaces. We have examined a variety of surface materials and conversion geometries in order to identify the factors that determine conversion efficiency. For chemically and physically stable surfaces smoothness is of primary importance while properties such as work function have no obvious correlation to conversion efficiency. For the noble metals, tungsten, silicon, and graphite with comparable smoothness, conversion efficiency varies by a factor of two to three. We have also examined the way in which surface conversion efficiency varies with the angle of incidence of the neutral atom and have found that the highest efficiencies are obtained at angles of incidence greater then 80deg. The conversion efficiency of silicon, tungsten and graphite were examined most closely and the energy dependent variation of conversion efficiency measured over a range of incident angles. We have also developed methods for micromachining silicon in order to reduce the volume to surface area over that of a single flat surface and have been able to reduce volume to surface area ratios by up to a factor of 60. With smooth micro-machined surfaces of the optimum geometry, conversion efficiencies can be increased by an order of magnitude over instruments like LENA on the IMAGE spacecraft without increase the instruments mass or volume.

  18. Investigation on micromachining technologies for the realization of LTCC devices and systems

    NASA Astrophysics Data System (ADS)

    Haas, T.; Zeilmann, C.; Bittner, A.; Schmid, U.

    2011-06-01

    Low temperature co-fired ceramics (LTCC) has established as a widespread platform for advanced functional ceramic devices in different applications, such as in the space and aviation sector, for micro machined sensors as well as in micro fluidics. This is due to high reliability, excellent physical properties, especially in the high frequency range, and the possibility to integrate passive components in the monolithic LTCC body, offering the potential for a high degree of miniaturisation. However, for further improvement of this technology and for an ongoing increase of the integration level, the realization of miniaturized structures is of utmost importance. Therefore, novel techniques for micro-machining are required providing channel structures and cavities inside the glass-ceramic body, enabling for further application scenarios. Those techniques are punching, laser cutting and embossing. One of the most limitations of LTCC is the poor thermal conductivity. Hence, the possibility to integrate channels enables innovative active cooling approaches using fluidic media for heat critical devices. Doing so, a by far better cooling effect can be achieved than by passive devices as heat spreaders or heat sinks. Furthermore, the realization of mechanic devices as integrated pressure sensors for operation under harsh environmental conditions can be realized by integrating the membrane directly into the ceramic body. Finally, for high power devices substantial improvement can be provided by filling those channel structures with electrical conductive material, so that the resistivity can be decreased drastically without affecting the topography of the ceramics.

  19. Development of amorphous SiC for MEMS-based microbridges

    NASA Astrophysics Data System (ADS)

    Summers, James B.; Scardelletti, Maximilian; Parro, Rocco; Zorman, Christian A.

    2007-02-01

    This paper reports our effort to develop amorphous hydrogenated silicon carbide (a-SiC:H) films specifically designed for MEMS-based microbridges using methane and silane as the precursor gases. In our work, the a-SiC:H films were deposited in a simple, commercial PECVD system at a fixed temperature of 300°C. Films with thicknesses from 100 nm to 1000 nm, a typical range for many MEMS applications, were deposited. Deposition parameters such as deposition pressure and methane-to-silane ratio were varied in order to obtain films with suitable residual stresses. Average residual stress in the as-deposited films selected for device fabrication was found by wafer curvature measurements to be -658 +/- 22 MPa, which could be converted to 177 +/- 40 MPa after thermal annealing at 450°C, making them suitable for micromachined bridges, membranes and other anchored structures. Bulk micromachined membranes were constructed to determine the Young's modulus of the annealed films, which was found to be 205 +/- 6 GPa. Chemical inertness was tested in aggressive solutions such as KOH and HF. Prototype microbridge actuators were fabricated using a simple surface micromachining process to assess the potential of the a-SiC:H films as structural layers for MEMS applications.

  20. Influence of micromachined targets on laser accelerated proton beam profiles

    NASA Astrophysics Data System (ADS)

    Dalui, Malay; Permogorov, Alexander; Pahl, Hannes; Persson, Anders; Wahlström, Claes-Göran

    2018-03-01

    High intensity laser-driven proton acceleration from micromachined targets is studied experimentally in the target-normal-sheath-acceleration regime. Conical pits are created on the front surface of flat aluminium foils of initial thickness 12.5 and 3 μm using series of low energy pulses (0.5-2.5 μJ). Proton acceleration from such micromachined targets is compared with flat foils of equivalent thickness at a laser intensity of 7 × 1019 W cm-2. The maximum proton energy obtained from targets machined from 12.5 μm thick foils is found to be slightly lower than that of flat foils of equivalent remaining thickness, and the angular divergence of the proton beam is observed to increase as the depth of the pit approaches the foil thickness. Targets machined from 3 μm thick foils, on the other hand, show evidence of increasing the maximum proton energy when the depths of the structures are small. Furthermore, shallow pits on 3 μm thick foils are found to be efficient in reducing the proton beam divergence by a factor of up to three compared to that obtained from flat foils, while maintaining the maximum proton energy.

  1. Review: Semiconductor Piezoresistance for Microsystems

    PubMed Central

    Barlian, A. Alvin; Park, Woo-Tae; Mallon, Joseph R.; Rastegar, Ali J.; Pruitt, Beth L.

    2010-01-01

    Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS). The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers. PMID:20198118

  2. Fabrication and characterization of a micromachined swirl-shaped ionic polymer metal composite actuator with electrodes exhibiting asymmetric resistance.

    PubMed

    Feng, Guo-Hua; Liu, Kim-Min

    2014-05-12

    This paper presents a swirl-shaped microfeatured ionic polymer-metal composite (IPMC) actuator. A novel micromachining process was developed to fabricate an array of IPMC actuators on a glass substrate and to ensure that no shortcircuits occur between the electrodes of the actuator. We demonstrated a microfluidic scheme in which surface tension was used to construct swirl-shaped planar IPMC devices of microfeature size and investigated the flow velocity of Nafion solutions, which formed the backbone polymer of the actuator, within the microchannel. The unique fabrication process yielded top and bottom electrodes that exhibited asymmetric surface resistance. A tool for measuring surface resistance was developed and used to characterize the resistances of the electrodes for the fabricated IPMC device. The actuator, which featured asymmetric electrode resistance, caused a nonzero-bias current when the device was driven using a zero-bias square wave, and we propose a circuit model to describe this phenomenon. Moreover, we discovered and characterized a bending and rotating motion when the IPMC actuator was driven using a square wave. We observed a strain rate of 14.6% and a displacement of 700 μm in the direction perpendicular to the electrode surfaces during 4.5-V actuation.

  3. Fabrication and Characterization of a Micromachined Swirl-Shaped Ionic Polymer Metal Composite Actuator with Electrodes Exhibiting Asymmetric Resistance

    PubMed Central

    Feng, Guo-Hua; Liu, Kim-Min

    2014-01-01

    This paper presents a swirl-shaped microfeatured ionic polymer-metal composite (IPMC) actuator. A novel micromachining process was developed to fabricate an array of IPMC actuators on a glass substrate and to ensure that no shortcircuits occur between the electrodes of the actuator. We demonstrated a microfluidic scheme in which surface tension was used to construct swirl-shaped planar IPMC devices of microfeature size and investigated the flow velocity of Nafion solutions, which formed the backbone polymer of the actuator, within the microchannel. The unique fabrication process yielded top and bottom electrodes that exhibited asymmetric surface resistance. A tool for measuring surface resistance was developed and used to characterize the resistances of the electrodes for the fabricated IPMC device. The actuator, which featured asymmetric electrode resistance, caused a nonzero-bias current when the device was driven using a zero-bias square wave, and we propose a circuit model to describe this phenomenon. Moreover, we discovered and characterized a bending and rotating motion when the IPMC actuator was driven using a square wave. We observed a strain rate of 14.6% and a displacement of 700 μm in the direction perpendicular to the electrode surfaces during 4.5-V actuation. PMID:24824370

  4. Method for forming precision clockplate with pivot pins

    DOEpatents

    Wild, Ronald L [Albuquerque, NM

    2010-06-01

    Methods are disclosed for producing a precision clockplate with rotational bearing surfaces (e.g. pivot pins). The methods comprise providing an electrically conductive blank, conventionally machining oversize features comprising bearing surfaces into the blank, optionally machining of a relief on non-bearing surfaces, providing wire accesses adjacent to bearing surfaces, threading the wire of an electrical discharge machine through the accesses and finishing the bearing surfaces by wire electrical discharge machining. The methods have been shown to produce bearing surfaces of comparable dimension and tolerances as those produced by micro-machining methods such as LIGA, at reduced cost and complexity.

  5. Formation of porous networks on polymeric surfaces by femtosecond laser micromachining

    NASA Astrophysics Data System (ADS)

    Assaf, Youssef; Kietzig, Anne-Marie

    2017-02-01

    In this study, porous network structures were successfully created on various polymer surfaces by femtosecond laser micromachining. Six different polymers (poly(tetrafluoroethylene) (PTFE), poly(methyl methacrylate) (PMMA), high density poly(ethylene) (HDPE), poly(lactic acid) (PLA), poly(carbonate) (PC), and poly(ethylene terephthalate) (PET)) were machined at different fluences and pulse numbers, and the resulting structures were identified and compared by lacunarity analysis. At low fluence and pulse numbers, porous networks were confirmed to form on all materials except PLA. Furthermore, all networks except for PMMA were shown to bundle up at high fluence and pulse numbers. In the case of PC, a complete breakdown of the structure at such conditions was observed. Operation slightly above threshold fluence and at low pulse numbers is therefore recommended for porous network formation. Finally, the thickness over which these structures formed was measured and compared to two intrinsic material dependent parameters: the single pulse threshold fluence and the incubation coefficient. Results indicate that a lower threshold fluence at operating conditions favors material removal over structure formation and is hence detrimental to porous network formation. Favorable machining conditions and material-dependent parameters for the formation of porous networks on polymer surfaces have thus been identified.

  6. A mechanical analysis of woodpecker drumming and its application to shock-absorbing systems.

    PubMed

    Yoon, Sang-Hee; Park, Sungmin

    2011-03-01

    A woodpecker is known to drum the hard woody surface of a tree at a rate of 18 to 22 times per second with a deceleration of 1200 g, yet with no sign of blackout or brain damage. As a model in nature, a woodpecker is studied to find clues to develop a shock-absorbing system for micromachined devices. Its advanced shock-absorbing mechanism, which cannot be explained merely by allometric scaling, is analyzed in terms of endoskeletal structures. In this analysis, the head structures (beak, hyoid, spongy bone, and skull bone with cerebrospinal fluid) of the golden-fronted woodpecker, Melanerpes aurifrons, are explored with x-ray computed tomography images, and their shock-absorbing mechanism is analyzed with a mechanical vibration model and an empirical method. Based on these analyses, a new shock-absorbing system is designed to protect commercial micromachined devices from unwanted high-g and high-frequency mechanical excitations. The new shock-absorbing system consists of close-packed microglasses within two metal enclosures and a viscoelastic layer fastened by steel bolts, which are biologically inspired from a spongy bone contained within a skull bone encompassed with the hyoid of a woodpecker. In the experimental characterizations using a 60 mm smoothbore air-gun, this bio-inspired shock-absorbing system shows a failure rate of 0.7% for the commercial micromachined devices at 60 000 g, whereas a conventional hard-resin method yields a failure rate of 26.4%, thus verifying remarkable improvement in the g-force tolerance of the commercial micromachined devices.

  7. Post-CMOS Micromachining of Surface and Bulk Structures

    DTIC Science & Technology

    2002-05-06

    Structures iii Acknowledgements I would like to thank my advisors, Professor Gary K. Fedder and Professor Dave W. Greve, for their continuing support...Donnelly, Plasma Chem. Plasma Process, vol. 1, pp. 37, 1981. [54] J. L. Mauer, J. S. Logan, L. B. Zielinski , and G. S. Schwartz, J. Vac. Sci. Technol

  8. A flexible ultrasound transducer array with micro-machined bulk PZT.

    PubMed

    Wang, Zhe; Xue, Qing-Tang; Chen, Yuan-Quan; Shu, Yi; Tian, He; Yang, Yi; Xie, Dan; Luo, Jian-Wen; Ren, Tian-Ling

    2015-01-23

    This paper proposes a novel flexible piezoelectric micro-machined ultrasound transducer, which is based on PZT and a polyimide substrate. The transducer is made on the polyimide substrate and packaged with medical polydimethylsiloxane. Instead of etching the PZT ceramic, this paper proposes a method of putting diced PZT blocks into holes on the polyimide which are pre-etched. The device works in d31 mode and the electromechanical coupling factor is 22.25%. Its flexibility, good conformal contacting with skin surfaces and proper resonant frequency make the device suitable for heart imaging. The flexible packaging ultrasound transducer also has a good waterproof performance after hundreds of ultrasonic electric tests in water. It is a promising ultrasound transducer and will be an effective supplementary ultrasound imaging method in the practical applications.

  9. The Cooling and Lubrication Performance of Graphene Platelets in Micro-Machining Environments

    NASA Astrophysics Data System (ADS)

    Chu, Bryan

    The research presented in this thesis is aimed at investigating the use of graphene platelets (GPL) to address the challenges of excessive tool wear, reduced part quality, and high specific power consumption encountered in micro-machining processes. There are two viable methods of introducing GPL into micro-machining environments, viz., the embedded delivery method, where the platelets are embedded into the part being machined, and the external delivery method, where graphene is carried into the cutting zone by jetting or atomizing a carrier fluid. The study involving the embedded delivery method is focused on the micro-machining performance of hierarchical graphene composites. The results of this study show that the presence of graphene in the epoxy matrix improves the machinability of the composite. In general, the tool wear, cutting forces, surface roughness, and extent of delamination are all seen to be lower for the hierarchical composite when compared to the conventional two-phase glass fiber composite. These improvements are attributed to the fact that graphene platelets improve the thermal conductivity of the matrix, provide lubrication at the tool-chip interface and also improve the interface strength between the glass fibers and the matrix. The benefits of graphene are seen to also carry over to the external delivery method. The platelets provide improved cooling and lubrication performance to both environmentally-benign cutting fluids as well as to semi-synthetic cutting fluids used in micro-machining. The cutting performance is seen to be a function of the geometry (i.e., lateral size and thickness) and extent of oxygen-functionalization of the platelet. Ultrasonically exfoliated platelets (with 2--3 graphene layers and lowest in-solution characteristic lateral length of 120 nm) appear to be the most favorable for micro-machining applications. Even at the lowest concentration of 0.1 wt%, they are capable of providing a 51% reduction in the cutting temperature and a 25% reduction in the surface roughness value over that of the baseline semi-synthetic cutting fluid. For the thermally-reduced platelets (with 4--8 graphene layers and in-solution characteristic lateral length of 562--2780 nm), a concentration of 0.2 wt% appears to be optimal. An investigation into the impingement dynamics of the graphene-laden colloidal solutions on a heated substrate reveals that the most important criterion dictating their machining performance is their ability to form uniform, submicron thick films of the platelets upon evaporation of the carrier fluid. As such, the characterization of the residual platelet film left behind on a heated substrate may be an effective technique for evaluating different graphene colloidal solutions for cutting fluids applications in micromachining. Graphene platelets have also recently been shown to reduce the aggressive chemical wear of diamond tools during the machining of transition metal alloys. However, the specific mechanisms responsible for this improvement are currently unknown. The modeling work presented in this thesis uses molecular dynamics techniques to shed light on the wear mitigation mechanisms that are active during the diamond cutting of steel when in the presence of graphene platelets. The dual mechanisms responsible for graphene-induced chemical wear mitigation are: 1) The formation of a physical barrier between the metal and tool atoms, preventing graphitization; and 2) The preferential transfer of carbon from the graphene platelet rather than from the diamond tool. The results of the simulations also provide new insight into the behavior of the 2D graphene platelets in the cutting zone, specifically illustrating the mechanisms of cleaving and interlayer sliding in graphene platelets under the high pressures in cutting zones.

  10. Realize multiple hermetic chamber pressures for system-on-chip process by using the capping wafer with diverse cavity depths

    NASA Astrophysics Data System (ADS)

    Cheng, Shyh-Wei; Weng, Jui-Chun; Liang, Kai-Chih; Sun, Yi-Chiang; Fang, Weileun

    2018-04-01

    Many mechanical and thermal characteristics, for example the air damping, of suspended micromachined structures are sensitive to the ambient pressure. Thus, micromachined devices such as the gyroscope and accelerometer have different ambient pressure requirements. Commercially available process platforms could be used to fabricate and integrate devices of various functions to reduce the chip size. However, it remains a challenge to offer different ambient pressures for micromachined devices after sealing them by wafer level capping (WLC). This study exploits the outgassing characteristics of the CMOS chip to fabricate chambers of various pressures after the WLC of the Si-above-CMOS (TSMC 0.18 µm 1P5M CMOS process) MEMS process platform. The pressure of the sealed chamber can be modulated by the chamber volume after the outgassing. In other words, the pressure of hermetic sealed chambers can be easily and properly defined by the etching depth of the cavity on an Si capping wafer. In applications, devices sealed with different cavity depths are implemented using the Si-above-CMOS (TSMC 0.18 µm 1P5M CMOS process) MEMS process platform to demonstrate the present approach. Measurements show the feasibility of this simple chamber pressure modulation approach on eight-inch wafers.

  11. Micromachined optical microphone structures with low thermal-mechanical noise levels.

    PubMed

    Hall, Neal A; Okandan, Murat; Littrell, Robert; Bicen, Baris; Degertekin, F Levent

    2007-10-01

    Micromachined microphones with diffraction-based optical displacement detection have been introduced previously [Hall et al., J. Acoust. Soc. Am. 118, 3000-3009 (2005)]. The approach has the advantage of providing high displacement detection resolution of the microphone diaphragm independent of device size and capacitance-creating an unconstrained design space for the mechanical structure itself. Micromachined microphone structures with 1.5-mm-diam polysilicon diaphragms and monolithically integrated diffraction grating electrodes are presented in this work with backplate architectures that deviate substantially from traditional perforated plate designs. These structures have been designed for broadband frequency response and low thermal mechanical noise levels. Rigorous experimental characterization indicates a diaphragm displacement detection resolution of 20 fm radicalHz and a thermal mechanical induced diaphragm displacement noise density of 60 fm radicalHz, corresponding to an A-weighted sound pressure level detection limit of 24 dB(A) for these structures. Measured thermal mechanical displacement noise spectra are in excellent agreement with simulations based on system parameters derived from dynamic frequency response characterization measurements, which show a diaphragm resonance limited bandwidth of approximately 20 kHz. These designs are substantial improvements over initial prototypes presented previously. The high performance-to-size ratio achievable with this technology is expected to have an impact on a variety of instrumentation and hearing applications.

  12. Acoustic backing in 3-D integration of CMUT with front-end electronics.

    PubMed

    Berg, Sigrid; Rønnekleiv, Arne

    2012-07-01

    Capacitive micromachined ultrasonic transducers (CMUTs) have shown promising qualities for medical imaging. However, there are still some problems to be investigated, and some challenges to overcome. Acoustic backing is necessary to prevent SAWs excited in the surface of the silicon substrate from affecting the transmit pattern from the array. In addition, echoes resulting from bulk waves in the substrate must be removed. There is growing interest in integrating electronic circuits to do some of the beamforming directly below the transducer array. This may be easier to achieve for CMUTs than for traditional piezoelectric transducers. We will present simulations showing that the thickness of the silicon substrate and thicknesses and acoustic properties of the bonding material must be considered, especially when designing highfrequency transducers. Through simulations, we compare the acoustic properties of 3-D stacks bonded with three different bonding techniques; solid-liquid interdiffusion (SLID) bonding, direct fusion bonding, and anisotropic conductive adhesives (ACA). We look at a CMUT array with a center frequency of 30 MHz and three silicon wafers underneath, having a total silicon thickness of 100 μm. We find that fusion bonding is most beneficial if we want to prevent surface waves from damaging the array response, but SLID and ACA are also promising if bonding layer thicknesses can be reduced.

  13. High-power visible laser effect on a Boston Micromachines' MEMS deformable mirror

    NASA Astrophysics Data System (ADS)

    Norton, Andrew; Gavel, Donald; Dillon, Daren; Cornelissen, Steven

    2010-07-01

    Continuous-facesheet and segmented Boston Micromachines Corporations' (BMC) Micro-Electrical Mechanical Systems (MEMS) Deformable Mirrors (DM) have been tested for their response to high-power visible-wavelength laser light. The deformable mirrors, coated with either protected silver or bare aluminum, were subjected to a maximum of 2 Watt laser-light at a wavelength of 532 nanometers. The laser light was incident on a ~ 3.5×3.5 cm area for time periods from minutes to 7 continuous hours. Spot heating from the laser-light is measured to induce a local bulge in the surface of each DM. For the aluminum-coated continuous facesheet DM, the induced spot heating changes the surface figure by 16 nm rms. The silver-coated continuous-facesheet and segmented (spatial light modulator) DMs experience a 6 and 8 nm surface rms change in surface quality with the laser at 2 Watts. For spatial frequencies less than the actuator spacing (300 mm), the laser induced surface bulge is shown to be removable, as the DMs continued to be fully functional during and after their exposure. Over the full 10 mm aperture one could expect the same results with a 15 Watt laser guide star (LGS). These results are very promising for use of the MEMS DM to pre-correct the outgoing laser light in the Laboratory for Adaptive Optics' (LAO) laser uplink application.

  14. Magnetic Induction Machines Integrated into Bulk-Micromachined Silicon

    DTIC Science & Technology

    2006-04-01

    Actuator Workshop (Hilton Head 2000), pp. 43–7, Jun. 2000. [5] H. Guckel et al., “A first functional current excited planar rotational magnetic micromotor ...in Proc. IEEE Micro Electro Mechanical Sys- tems (MEMS’93), Feb. 1993, pp. 7–11. [6] , “Planar rotational magnetic micromotors ,” Int. J. Appl... micromotor with fully integrated stator and coils,” J. Micro- electromech. Syst., vol. 2, no. 4, pp. 165–73, Dec. 1993. [8] B. Wagner, M. Kreutzer, and W

  15. SiGe/Si Monolithically Integrated Amplifier Circuits

    NASA Technical Reports Server (NTRS)

    Katehi, Linda P. B.; Bhattacharya, Pallab

    1998-01-01

    With recent advance in the epitaxial growth of silicon-germanium heterojunction, Si/SiGe HBTs with high f(sub max) and f(sub T) have received great attention in MMIC applications. In the past year, technologies for mesa-type Si/SiGe HBTs and other lumped passive components with high resonant frequencies have been developed and well characterized for circuit applications. By integrating the micromachined lumped passive elements into HBT fabrication, multi-stage amplifiers operating at 20 GHz have been designed and fabricated.

  16. Design of electrostatically levitated micromachined rotational gyroscope based on UV-LIGA technology

    NASA Astrophysics Data System (ADS)

    Cui, Feng; Chen, Wenyuan; Su, Yufeng; Zhang, Weiping; Zhao, Xiaolin

    2004-12-01

    The prevailing micromachined vibratory gyroscope typically has a proof mass connected to the substrate by a mechanical suspension system, which makes it face a tough challenge to achieve tactical or inertial grade performance levels. With a levitated rotor as the proof mass, a micromachined rotational gyroscope will potentially have higher performance than vibratory gyroscope. Besides working as a moment rebalance dual-axis gyroscope, the micromachined rotational gyroscope based on a levitated rotor can simultaneously work as a force balance tri-axis accelerometer. Micromachined rotational gyroscope based on an electrostatically levitated silicon micromachined rotor has been notably developed. In this paper, factors in designing a rotational gyro/accelerometer based on an electrostatically levitated disc-like rotor, including gyroscopic action of micro rotor, methods of stable levitation, micro displacement detection and control, rotation drive and speed control, vacuum packaging and microfabrication, are comprehensively considered. Hence a design of rotational gyro/accelerometer with an electroforming nickel rotor employing low cost UV-LIGA technology is presented. In this design, a wheel-like flat rotor is proposed and its basic dimensions, diameter and thickness, are estimated according to the required loading capability. Finally, its micromachining methods based on UV-LIGA technology and assembly technology are discussed.

  17. Passive front-ends for wideband millimeter wave electronic warfare

    NASA Astrophysics Data System (ADS)

    Jastram, Nathan Joseph

    This thesis presents the analysis, design and measurements of novel passive front ends of interest to millimeter wave electronic warfare systems. However, emerging threats in the millimeter waves (18 GHz and above) has led to a push for new systems capable of addressing these threats. At these frequencies, traditional techniques of design and fabrication are challenging due to small size, limited bandwidth and losses. The use of surface micromachining technology for wideband direction finding with multiple element antenna arrays for electronic support is demonstrated. A wideband tapered slot antenna is first designed and measured as an array element for the subsequent arrays. Both 18--36 GHz and 75--110 GHz amplitude only and amplitude/phase two element direction finding front ends are designed and measured. The design of arrays using Butler matrix and Rotman lens beamformers for greater than two element direction finding over W band and beyond using is also presented. The design of a dual polarized high power capable front end for electronic attack over an 18--45 GHz band is presented. To combine two polarizations into the same radiating aperture, an orthomode transducer (OMT) based upon a new double ridge waveguide cross section is developed. To provide greater flexibility in needed performance characteristics, several different turnstile junction matching sections are tested. A modular horn section is proposed to address flexible and ever changing operational requirements, and is designed for performance criteria such as constant gain, beamwidth, etc. A multi-section branch guide coupler and low loss Rotman lens based upon the proposed cross section are also developed. Prototyping methods for the herein designed millimeter wave electronic warfare front ends are investigated. Specifically, both printed circuit board (PCB) prototyping of micromachined systems and 3D printing of conventionally machined horns are presented. A 4--8 GHz two element array with integrated beamformer fabricated using the stacking of PCB boards is shown, and measured results compare favorably with the micromachined front ends. A 3D printed small aperture horn is compared with a conventionally machined horn, and measured results show similar performance with a ten-fold reduction in cost and weight.

  18. Gas-driven microturbine

    DOEpatents

    Sniegowski, Jeffrey J.; Rodgers, Murray S.; McWhorter, Paul J.; Aeschliman, Daniel P.; Miller, William M.

    2002-01-01

    A microturbine fabricated by a three-level semiconductor batch-fabrication process based on polysilicon surface-micromachining. The microturbine comprises microelectromechanical elements formed from three polysilicon multi-layer surfaces applied to a silicon substrate. Interleaving sacrificial oxide layers provides electrical and physical isolation, and selective etching of both the sacrificial layers and the polysilicon layers allows formation of individual mechanical and electrical elements as well as the required space for necessary movement of rotating turbine parts and linear elements.

  19. Microactuateur electrothermique bistable: Etude d'implementation avec une technologie standard CMOS

    NASA Astrophysics Data System (ADS)

    Ressejac, Isabelle

    The general objective of this Ph.D. thesis was to study the implementation of a new type of eletrothermal microactuator. This actuator presents the advantages to be bistable and fabricated in a standard CMOS process, allowing the integration of a microelectronics addressing circuit on the same substrate. Experimental research work, presented in this thesis, relate to the different steps carried out in order to implement this CMOS MEMS device: its theoretical conception, its fabrication with a standard CMOS technology, its micromachining as a post-process, its characterization and its electro-thermo-mechanical modeling. The device was designed and fabricated by using Mitel 1,5 mum CMOS technology and the Can-MEMS service which are both available via the Canadian Microelectronics Corporation. Fabricated monolithically within a standard CMOS process, our microactuator is suitable for large-scale integration due to its small dimensions (length ˜1000 mum and width ˜150 mum). It constitutes the basic component of a N by N matrix controlled by a microelectronic addressing system built on the same substrate. Initially, only one micromachining technique (involving TMAH) was used, and long etching times (>9 h) were requires} in order to release the microstructures. However, the passivation layer from the CMOS process could protect the underlying metal from the TMAH for a sufficient time (only ˜1--2 h). Consequently, we had to develop a micromachining strategy with shorter etching times to allow the complete release of the microstructures without damaging them. Post-processing begins with deposition (by sputtering) of a platinum layer intended to protect the abutment from subsequent etching. Our micromachining strategy is mainly based on the use of a hybrid etching process starting with a first anisotropic TMAH etching followed by a XeF2 isotropic etching. After micromachining, the released microactuator has a significant initial deflection with its tip reaching a height up to a hundred times higher than its thickness. This natural deflection results from the relaxation of internal stresses inside the thin films which are part of the microactuator. These internal stresses are intrinsics to the host CMOS process. We have developed a model of the microactuator's initial deflection using mechanical properties of thin films and dimensions of the structure. Actuation experiments were performed in order to characterize the deflection of the microactuator with respect to the heating of the bilayers (separately and together). We have developed a thermal actuation analytical model for an n-layers multimorph structure, which takes into account the initial deflection resulting from the relaxation of stresses as well as the deflection due to the temperature increase during the electrothermal activation of the bilayers. (Abstract shortened by UMI.)

  20. Wireless health monitoring of cracks in structures with MEMS-IDT sensors

    NASA Astrophysics Data System (ADS)

    Kim, Jae-Sung; Vinoy, K. J.; Varadan, Vijay K.

    2002-07-01

    The integration of MEMS, IDTs and required microelectronics and conformal antennas to realize programmable, robust and low cost passive microsensors suitable for many military structures and systems including aircraft, missiles and munitions is presented in this paper. The technology is currently being applied to the structural health monitoring of accelerometers, gyroscopes and vibration monitoring devices with signal processing electronics to provide real- time indicators of incipient failure of aircraft components with a known history of catastrophic failure due to fracture. Recently a combination of the need for safety in the air and the desire to control costs is encouraging the use of in-flight monitoring of aircraft components and systems using light-weight, wireless and cost effective microsensors and MEMS. An in-situ Aircraft structural health monitoring system, with sensors embedded in the composite structure or surface-mounted on the structure, would permit the timely detection of damage in aircraft. Micromachining offers the potential for fabricating a range of microsensors and MEMS for structural applications including load, vibration and acoustics characteristics and monitoring. Such microsensors are extremely small; they can be embedded into structural materials, can be mass-produced and are therefore potentially cheap. Additionally a range of sensor types can be integrated onto a single chip with built-in electronics and ASIC, providing a low power microsystem. The smart sensors are being developed using the standard microelectronics and micromachining in conjunction with novel Penn State smart electronics or wireless communication systems suitable for condition monitoring of aircraft structures in-flight. A hybrid accelerometer and gyroscope in a single chip suitable for inertial navigation system and other microsensors for health monitoring and condition-based maintenance of structures, drag sensing and control of aircraft, strain and deflection of structures and systems, ice sensing on aircraft, remote temperature and humidity measurement of propellant in munitions, chemical sensing, etc. are discussed.

  1. Evolution from MEMS-based Linear Drives to Bio-based Nano Drives

    NASA Astrophysics Data System (ADS)

    Fujita, Hiroyuki

    The successful extension of semiconductor technology to fabricate mechanical parts of the sizes from 10 to 100 micrometers opened wide ranges of possibilities for micromechanical devices and systems. The fabrication technique is called micromachining. Micromachining processes are based on silicon integrated circuits (IC) technology and used to build three-dimensional structures and movable parts by the combination of lithography, etching, film deposition, and wafer bonding. Microactuators are the key devices allowing MEMS to perform physical functions. Some of them are driven by electric, magnetic, and fluidic forces. Some others utilize actuator materials including piezoelectric (PZT, ZnO, quartz) and magnetostrictive materials (TbFe), shape memory alloy (TiNi) and bio molecular motors. This paper deals with the development of MEMS based microactuators, especially linear drives, following my own research experience. They include an electrostatic actuator, a superconductive levitated actuator, arrayed actuators, and a bio-motor-driven actuator.

  2. Fabrication of Cantilever-Bump Type Si Probe Card

    NASA Astrophysics Data System (ADS)

    Park, Jeong-Yong; Lee, Dong-Seok; Kim, Dong-Kwon; Lee, Jong-Hyun

    2000-12-01

    Probe card is most important part in the test system which selects the good or bad chip of integrated circuit (IC) chips. Silicon vertical probe card is able to test multiple semiconductor chips simultaneously. We presented cantilever-bump type vertical probe card. It was fabricated by dry etching using RIE(reactive ion etching) technique and porous silicon micromachining using silicon direct bonded (SDB) wafer. Cantilevers and bumps were fabricated by isotropic etching using RIE@. 3-dimensional structures were formed by porous silicon micromachining technique using SDB wafer. Contact resistance of fabricated probe card was less than 2 Ω and its life time was more than 200,000 turns. The process used in this work is very simple and reproducible, which has good controllability in the tip dimension and spacing. It is expected that the fabricated probe card can reduce testing time, can promote productivity and enables burn-in test.

  3. Compact Micromachined Bandpass Filters for Infrared Planetary Spectroscopy

    NASA Technical Reports Server (NTRS)

    Brown, Ari D.; Aslam, Shahid; Chervenak, James A.; Huang, Wei-Chung; Merrell, Willie; Quijada, Manuel

    2011-01-01

    The thermal instrument strawman payload of the Jupiter Europa Orbiter on the Europa Jupiter Science Mission will map out thermal anomalies, the structure, and atmospheric conditions of Europa and Jupiter within the 7-100 micron spectral range. One key requirement for the payload is that the mass cannot exceed 3.7 kg. Consequently, a new generation of light-weight miniaturized spectrometers needs to be developed. On the path toward developing these spectrometers is development of ancillary miniaturized spectroscopic components. In this paper, we present a strategy for making radiation hard and low mass FIR band pass metal mesh filters. Our strategy involves using MEMS-based fabrication techniques, which will permit the quasi-optical filter structures to be made with micron-scale precision. This will enable us to achieve tight control over both the pass band of the filter and the micromachined silicon support structure architecture, which will facilitate integration of the filters for a variety of applications.

  4. AlN-based piezoelectric micromachined ultrasonic transducer for photoacoustic imaging

    NASA Astrophysics Data System (ADS)

    Chen, Bingzhang; Chu, Futong; Liu, Xingzhao; Li, Yanrong; Rong, Jian; Jiang, Huabei

    2013-07-01

    We report on the fabrication of a piezoelectric micromachined ultrasonic transducer (pMUT) and its application to photoacoustic imaging. With c-axis orientation, AlN was grown on a 300 nm-thick SiO2 film and a 200 nm-thick bottom electrode at room temperature. The device consists of SiO2, bottom electrode, AlN films, upper electrode, and polyimide protective layer. An area ratio of 0.45 was used between the upper electrode and the vibration area of the pMUT to provide an optimal sensitivity of transducer. Its resonant frequency was measured to be 2.885 MHz, and the coupling coefficient in the range of 2.38%-3.71%. The fabricated pMUT was integrated with a photoacoustic imaging system and photoacoustic image of a phantom was obtained. The resolution of the system was measured to be about 240 μm.

  5. Deep Tissue Photoacoustic Imaging Using a Miniaturized 2-D Capacitive Micromachined Ultrasonic Transducer Array

    PubMed Central

    Kothapalli, Sri-Rajasekhar; Ma, Te-Jen; Vaithilingam, Srikant; Oralkan, Ömer

    2014-01-01

    In this paper, we demonstrate 3-D photoacoustic imaging (PAI) of light absorbing objects embedded as deep as 5 cm inside strong optically scattering phantoms using a miniaturized (4 mm × 4 mm × 500 µm), 2-D capacitive micromachined ultrasonic transducer (CMUT) array of 16 × 16 elements with a center frequency of 5.5 MHz. Two-dimensional tomographic images and 3-D volumetric images of the objects placed at different depths are presented. In addition, we studied the sensitivity of CMUT-based PAI to the concentration of indocyanine green dye at 5 cm depth inside the phantom. Under optimized experimental conditions, the objects at 5 cm depth can be imaged with SNR of about 35 dB and a spatial resolution of approximately 500 µm. Results demonstrate that CMUTs with integrated front-end amplifier circuits are an attractive choice for achieving relatively high depth sensitivity for PAI. PMID:22249594

  6. Evaluation of microfabricated deformable mirror systems

    NASA Astrophysics Data System (ADS)

    Cowan, William D.; Lee, Max K.; Bright, Victor M.; Welsh, Byron M.

    1998-09-01

    This paper presents recent result for aberration correction and beam steering experiments using polysilicon surface micromachined piston micromirror arrays. Microfabricated deformable mirrors offer a substantial cost reduction for adaptive optic systems. In addition to the reduced mirror cost, microfabricated mirrors typically require low control voltages, thus eliminating high voltage amplifiers. The greatly reduced cost per channel of adaptive optic systems employing microfabricated deformable mirrors promise high order aberration correction at low cost. Arrays of piston micromirrors with 128 active elements were tested. Mirror elements are on a 203 micrometers 12 by 12 square grid. The overall array size is 2.4 mm square. The arrays were fabricated in the commercially available DARPA supported MUMPs surface micromachining foundry process. The cost per mirror array in this prototyping process is less than 200 dollars. Experimental results are presented for a hybrid correcting element comprised of a lenslet array and piston micromirror array, and for a piston micromirror array only. Also presented is a novel digital deflection micromirror which requires no digital to analog converters, further reducing the cost of adaptive optics system.

  7. Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications

    NASA Technical Reports Server (NTRS)

    DeAnna, Russell G.

    1998-01-01

    A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.

  8. Effect of CO2 laser micromachining on physicochemical properties of poly(L-lactide)

    NASA Astrophysics Data System (ADS)

    Antończak, Arkadiusz J.; Stepak, Bogusz; Szustakiewicz, Konrad; Wójcik, Michał; Kozioł, Paweł E.; Łazarek, Łukasz; Abramski, Krzysztof M.

    2014-08-01

    In this paper, we present some examples of micromachining of poly(L-lactide) with a CO2 laser and an analysis of changes in material properties in the heat affected HAZ induced by the fluence well above the ablation threshold. The complexity of the processes of decomposition implies the need for simultaneous use of many selective analytical techniques which complement each other to give a full image of the changes. Introduced changes were characterized using Differential Scanning Calorimetry (DSC), Gel Permeation Chromatography (GPC), X-ray Photoelectron Spectroscopy (XPS) and Attenuated Total Reflectance Fourier Transform Infrared spectroscopy (ATR-FTIR). It turns out that CO2 laser processing of poly(L-lactide) mainly induces surface changes. However, oxidation of the surface was not observed. We recorded a bimodal distribution and some reduction in the molecular weight. Infrared spectroscopy in turn revealed the existence of absorption bands, characteristic for the vinyl groups (RCH=CH2). The appearance of these bands indicates that the decomposition of the polymer occurred, among others, by means of the cis-elimination reaction.

  9. Chemical-mechanical polishing of recessed microelectromechanical devices

    DOEpatents

    Barron, Carole C.; Hetherington, Dale L.; Montague, Stephen

    1999-01-01

    A method is disclosed for micromachining recessed layers (e.g. sacrificial layers) of a microelectromechanical system (MEMS) device formed in a cavity etched into a semiconductor substrate. The method uses chemical-mechanical polishing (CMP) with a resilient polishing pad to locally planarize one or more of the recessed layers within the substrate cavity. Such local planarization using the method of the present invention is advantageous for improving the patterning of subsequently deposited layers, for eliminating mechanical interferences between functional elements (e.g. linkages) of the MEMS device, and for eliminating the formation of stringers. After the local planarization of one or more of the recessed layers, another CMP step can be provided for globally planarizing the semiconductor substrate to form a recessed MEMS device which can be integrated with electronic circuitry (e.g. CMOS, BiCMOS or bipolar circuitry) formed on the surface of the substrate.

  10. Chemical-mechanical polishing of recessed microelectromechanical devices

    DOEpatents

    Barron, C.C.; Hetherington, D.L.; Montague, S.

    1999-07-06

    A method is disclosed for micromachining recessed layers (e.g. sacrificial layers) of a microelectromechanical system (MEMS) device formed in a cavity etched into a semiconductor substrate. The method uses chemical-mechanical polishing (CMP) with a resilient polishing pad to locally planarize one or more of the recessed layers within the substrate cavity. Such local planarization using the method of the present invention is advantageous for improving the patterning of subsequently deposited layers, for eliminating mechanical interferences between functional elements (e.g. linkages) of the MEMS device, and for eliminating the formation of stringers. After the local planarization of one or more of the recessed layers, another CMP step can be provided for globally planarizing the semiconductor substrate to form a recessed MEMS device which can be integrated with electronic circuitry (e.g., CMOS, BiCMOS or bipolar circuitry) formed on the surface of the substrate. 23 figs.

  11. Electrostatically operated optical microshutter array for a miniature integrated optical spectrometer

    NASA Astrophysics Data System (ADS)

    Ilias, Samir; Picard, Francis; Larouche, Carl; Kruzelecky, Roman; Jamroz, Wes

    2017-11-01

    16x1 programmable microshutter arrays allowing control of the light transmitted through a transparent substrate supporting the array were successfully fabricated using surface micromachining technology. Each microshutter is basically an electrostatic zipping actuator having a curved shape induced by a stress gradient through the actuator thickness. When a sufficient voltage is applied between the microshutter and the actuation electrode surrounding the associated microslit area, the generated electrostatic force pulls the actuator down to the substrate which closes the microslit. Opening the slit relies on the restoring force. High light transmission through the slit area is obtained with the actuator in the open position and excellent light blocking is observed when the shutter is closed. Static and dynamic responses of the device were determined. The pull-in voltage to close the microslit was about 110 V and the response times to close and open the microslit were about 2 ms and 7 ms, respectively.

  12. Apparatus and method for transforming living cells

    DOEpatents

    Okandan, Murat; Galambos, Paul C.

    2003-11-11

    An apparatus and method are disclosed for in vitro transformation of living cells. The apparatus, which is formed as a microelectromechanical device by surface micromachining, can be used to temporarily disrupt the cell walls or membrane of host cells one at a time so that a particular substance (e.g. a molecular tag, nucleic acid, bacteria, virus etc.) can be introduced into the cell. Disruption of the integrity of the host cells (i.e. poration) can be performed mechanically or electrically, or by both while the host cells are contained within a flow channel. Mechanical poration is possible using a moveable member which has a pointed or serrated edge and which is driven by an electrostatic actuator to abrade, impact or penetrate the host cell. Electroporation is produced by generating a relatively high electric field across the host cell when the host cell is located in the flow channel between a pair of electrodes having a voltage applied therebetween.

  13. Ultrasonic fingerprint sensor using a piezoelectric micromachined ultrasonic transducer array integrated with complementary metal oxide semiconductor electronics

    NASA Astrophysics Data System (ADS)

    Lu, Y.; Tang, H.; Fung, S.; Wang, Q.; Tsai, J. M.; Daneman, M.; Boser, B. E.; Horsley, D. A.

    2015-06-01

    This paper presents an ultrasonic fingerprint sensor based on a 24 × 8 array of 22 MHz piezoelectric micromachined ultrasonic transducers (PMUTs) with 100 μm pitch, fully integrated with 180 nm complementary metal oxide semiconductor (CMOS) circuitry through eutectic wafer bonding. Each PMUT is directly bonded to a dedicated CMOS receive amplifier, minimizing electrical parasitics and eliminating the need for through-silicon vias. The array frequency response and vibration mode-shape were characterized using laser Doppler vibrometry and verified via finite element method simulation. The array's acoustic output was measured using a hydrophone to be ˜14 kPa with a 28 V input, in reasonable agreement with predication from analytical calculation. Pulse-echo imaging of a 1D steel grating is demonstrated using electronic scanning of a 20 × 8 sub-array, resulting in 300 mV maximum received amplitude and 5:1 contrast ratio. Because the small size of this array limits the maximum image size, mechanical scanning was used to image a 2D polydimethylsiloxane fingerprint phantom (10 mm × 8 mm) at a 1.2 mm distance from the array.

  14. Soft-Matter Printed Circuit Board with UV Laser Micropatterning.

    PubMed

    Lu, Tong; Markvicka, Eric J; Jin, Yichu; Majidi, Carmel

    2017-07-05

    When encapsulated in elastomer, micropatterned traces of Ga-based liquid metal (LM) can function as elastically deformable circuit wiring that provides mechanically robust electrical connectivity between solid-state elements (e.g., transistors, processors, and sensor nodes). However, LM-microelectronics integration is currently limited by challenges in rapid fabrication of LM circuits and the creation of vias between circuit terminals and the I/O pins of packaged electronics. In this study, we address both with a unique layup for soft-matter electronics in which traces of liquid-phase Ga-In eutectic (EGaIn) are patterned with UV laser micromachining (UVLM). The terminals of the elastomer-sealed LM circuit connect to the surface mounted chips through vertically aligned columns of EGaIn-coated Ag-Fe 2 O 3 microparticles that are embedded within an interfacial elastomer layer. The processing technique is compatible with conventional UVLM printed circuit board (PCB) prototyping and exploits the photophysical ablation of EGaIn on an elastomer substrate. Potential applications to wearable computing and biosensing are demonstrated with functional implementations in which soft-matter PCBs are populated with surface-mounted microelectronics.

  15. Microfabricated teeter-totter resonator

    DOEpatents

    Adkins, Douglas Ray; Heller, Edwin J.; Shul, Randy J.

    2004-11-23

    A microfabricated teeter-totter resonator comprises a frame, a paddle pivotably anchored to the frame by pivot arms that define an axis of rotation, a current conductor line on a surface of the paddle, means for applying a static magnetic field substantially perpendicular to the rotational axis and in the plane of the paddle, and means for energizing the current conductor line with an alternating current. A Lorentz force is generated by the interaction of the magnetic field with the current flowing in the conductor line, causing the paddle to oscillate about the axis of rotation. The teeter-totter resonator can be fabricated with micromachining techniques with materials used in the integrated circuits manufacturing industry. The microfabricated teeter-totter resonator has many varied applications, both as an actuation device and as a sensor. When used as a chemical sensor, a chemically sensitive coating can be disposed on one or both surfaces of the paddle to enhance the absorption of chemical analytes from a fluid stream. The resulting mass change can be detected as a change in the resonant frequency or phase of the oscillatory motion of the paddle.

  16. Materials Development for Auxiliary Components for Large Compact Mo/Au TES Arrays

    NASA Technical Reports Server (NTRS)

    Finkbeiner, F. m.; Chervenak, J. A.; Bandler, S. R.; Brekosky, R.; Brown, A. D.; Figueroa-Feliciano, E.; Iyomoto, N.; Kelley, R. L.; Kilbourne, C. A.; Porter, F. S.; hide

    2007-01-01

    We describe our current fabrication process for arrays of superconducting transition edge sensor microcalorimeters, which incorporates superconducting Mo/Au bilayers and micromachined silicon structures. We focus on materials and integration methods for array heatsinking with our bilayer and micromachining processes. The thin superconducting molybdenum bottom layer strongly influences the superconducting behavior and overall film characteristics of our molybdenum/gold transition-edge sensors (TES). Concurrent with our successful TES microcalorimeter array development, we have started to investigate the thin film properties of molybdenum monolayers within a given phase space of several important process parameters. The monolayers are sputtered or electron-beam deposited exclusively on LPCVD silicon nitride coated silicon wafers. In our current bilayer process, molybdenum is electron-beam deposited at high wafer temperatures in excess of 500 degrees C. Identifying process parameters that yield high quality bilayers at a significantly lower temperature will increase options for incorporating process-sensitive auxiliary array components (AAC) such as array heat sinking and electrical interconnects into our overall device process. We are currently developing two competing technical approaches for heat sinking large compact TES microcalorimeter arrays. Our efforts to improve array heat sinking and mitigate thermal cross-talk between pixels include copper backside deposition on completed device chips and copper-filled micro-trenches surface-machined into wafers. In addition, we fabricated prototypes of copper through-wafer microvias as a potential way to read out the arrays. We present an overview on the results of our molybdenum monolayer study and its implications concerning our device fabrication. We discuss the design, fabrication process, and recent test results of our AAC development.

  17. A micro-machined source transducer for a parametric array in air.

    PubMed

    Lee, Haksue; Kang, Daesil; Moon, Wonkyu

    2009-04-01

    Parametric array applications in air, such as highly directional parametric loudspeaker systems, usually rely on large radiators to generate the high-intensity primary beams required for nonlinear interactions. However, a conventional transducer, as a primary wave projector, requires a great deal of electrical power because its electroacoustic efficiency is very low due to the large characteristic mechanical impedance in air. The feasibility of a micro-machined ultrasonic transducer as an efficient finite-amplitude wave projector was studied. A piezoelectric micro-machined ultrasonic transducer array consisting of lead zirconate titanate uni-morph elements was designed and fabricated for this purpose. Theoretical and experimental evaluations showed that a micro-machined ultrasonic transducer array can be used as an efficient source transducer for a parametric array in air. The beam patterns and propagation curves of the difference frequency wave and the primary wave generated by the micro-machined ultrasonic transducer array were measured. Although the theoretical results were based on ideal parametric array models, the theoretical data explained the experimental results reasonably well. These experiments demonstrated the potential of micro-machined primary wave projector.

  18. Soft micromachines with programmable motility and morphology

    PubMed Central

    Huang, Hen-Wei; Sakar, Mahmut Selman; Petruska, Andrew J.; Pané, Salvador; Nelson, Bradley J.

    2016-01-01

    Nature provides a wide range of inspiration for building mobile micromachines that can navigate through confined heterogenous environments and perform minimally invasive environmental and biomedical operations. For example, microstructures fabricated in the form of bacterial or eukaryotic flagella can act as artificial microswimmers. Due to limitations in their design and material properties, these simple micromachines lack multifunctionality, effective addressability and manoeuvrability in complex environments. Here we develop an origami-inspired rapid prototyping process for building self-folding, magnetically powered micromachines with complex body plans, reconfigurable shape and controllable motility. Selective reprogramming of the mechanical design and magnetic anisotropy of body parts dynamically modulates the swimming characteristics of the micromachines. We find that tail and body morphologies together determine swimming efficiency and, unlike for rigid swimmers, the choice of magnetic field can subtly change the motility of soft microswimmers. PMID:27447088

  19. Soft micromachines with programmable motility and morphology.

    PubMed

    Huang, Hen-Wei; Sakar, Mahmut Selman; Petruska, Andrew J; Pané, Salvador; Nelson, Bradley J

    2016-07-22

    Nature provides a wide range of inspiration for building mobile micromachines that can navigate through confined heterogenous environments and perform minimally invasive environmental and biomedical operations. For example, microstructures fabricated in the form of bacterial or eukaryotic flagella can act as artificial microswimmers. Due to limitations in their design and material properties, these simple micromachines lack multifunctionality, effective addressability and manoeuvrability in complex environments. Here we develop an origami-inspired rapid prototyping process for building self-folding, magnetically powered micromachines with complex body plans, reconfigurable shape and controllable motility. Selective reprogramming of the mechanical design and magnetic anisotropy of body parts dynamically modulates the swimming characteristics of the micromachines. We find that tail and body morphologies together determine swimming efficiency and, unlike for rigid swimmers, the choice of magnetic field can subtly change the motility of soft microswimmers.

  20. Improved Electromechanical Infrared Sensor

    NASA Technical Reports Server (NTRS)

    Kenny, Thomas W.; Kaiser, William J.

    1994-01-01

    Proposed electromechanical infrared detector improved version of device described in "Micromachined Electron-Tunneling Infrared Detectors" (NPO-18413). Fabrication easier, and undesired sensitivity to acceleration reduced. In devices, diaphragms and other components made of micromachined silicon, and displacements of diaphragms measured by electron tunneling displacement transducer {see "Micromachined Tunneling Accelerometer" (NPO-18513)}. Improved version offers enhanced frequency response and less spurious response to acceleration.

  1. Wideband Feedback Circuit For Tunneling Sensor

    NASA Technical Reports Server (NTRS)

    Kaiser, William J.; Kenny, Thomas W.; Rockstad, Howard K.; Reynolds, Joseph K.

    1994-01-01

    Improved feedback circuit designed for use in controlling tunneling displacement transducer. Features include stability and nearly flat frequency response up to 50 kHz. Transducer could be that in scanning tunneling microscope, or any of micromachined electromechanical transducers described in "Micromachined Electron-Tunneling Infrared Detectors" (NPO-18413), "Micromachined Tunneling Accelerometer" (NPO-18513), and "Improved Electromechanical Infrared Sensor" (NPO-18560).

  2. Microscale out-of-plane anemometer

    NASA Technical Reports Server (NTRS)

    Liu, Chang (Inventor); Chen, Jack (Inventor)

    2005-01-01

    A microscale out-of-plane thermal sensor. A resistive heater is suspended over a substrate by supports raised with respect to the substrate to provide a clearance underneath the resistive heater for fluid flow. A preferred fabrication process for the thermal sensor uses surface micromachining and a three-dimensional assembly to raise the supports and lift the resistive heater over the substrate.

  3. Reducing Stiffness and Electrical Losses of High Channel Hybrid Nerve Cuff Electrodes

    DTIC Science & Technology

    2001-10-25

    Electrodes were developed. These electrodes consisted of a micromachined polyimide -based thin-film structure with integrated electrode contacts and...electrodes, mechanical properties were enhanced by changing the method of joining silicone and polyimide from using one part silicone adhesive to...gold, platinum, platinum black, polyimide , silicone, polymer bonding I. INTRODUCTION Cuff-type electrodes are probably the most commonly used neural

  4. Fabrication of Thermoelectric Devices Using Additive-Subtractive Manufacturing Techniques: Application to Waste-Heat Energy Harvesting

    NASA Astrophysics Data System (ADS)

    Tewolde, Mahder

    Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are well suited for waste-heat energy harvesting applications as opposed to primary energy generation. Commercially available thermoelectric modules are flat, inflexible and have limited sizes available. State-of-art manufacturing of TEG devices relies on assembling prefabricated parts with soldering, epoxy bonding, and mechanical clamping. Furthermore, efforts to incorporate them onto curved surfaces such as exhaust pipes, pump housings, steam lines, mixing containers, reaction chambers, etc. require custom-built heat exchangers. This is costly and labor-intensive, in addition to presenting challenges in terms of space, thermal coupling, added weight and long-term reliability. Additive manufacturing technologies are beginning to address many of these issues by reducing part count in complex designs and the elimination of sub-assembly requirements. This work investigates the feasibility of utilizing such novel manufacturing routes for improving the manufacturing process of thermoelectric devices. Much of the research in thermoelectricity is primarily focused on improving thermoelectric material properties by developing of novel materials or finding ways to improve existing ones. Secondary to material development is improving the manufacturing process of TEGs to provide significant cost benefits. To improve the device fabrication process, this work explores additive manufacturing technologies to provide an integrated and scalable approach for TE device manufacturing directly onto engineering component surfaces. Additive manufacturing techniques like thermal spray and ink-dispenser printing are developed with the aim of improving the manufacturing process of TEGs. Subtractive manufacturing techniques like laser micromachining are also studied in detail. This includes the laser processing parameters for cutting the thermal spray materials efficiently by optimizing cutting speed and power while maintaining surface quality and interface properties. Key parameters are obtained from these experiments and used to develop a process that can be used to fabricate a working TEG directly onto the waste-heat component surface. A TEG module has been fabricated for the first time entirely by using thermal spray technology and laser micromachining. The target applications include automotive exhaust systems and other high-volume industrial waste heat sources. The application of TEGs for thermoelectrically powered sensors for Small Modular Reactors (SMRs) is presented. In conclusion, more ways to improve the fabrication process of TEGs are suggested.

  5. Micromachined fragment capturer for biomedical applications.

    PubMed

    Choi, Young-Soo; Lee, Dong-Weon

    2011-11-01

    Due to changes in modern diet, a form of heart disease called chronic total occlusion has become a serious disease to be treated as an emergency. In this study, we propose a micromachined capturer that is designed and fabricated to collect plaque fragments generated during surgery to remove the thrombus. The fragment capturer consists of a plastic body made by rapid prototyping, SU-8 mesh structures using MEMS techniques, and ionic polymer metal composite (IPMC) actuators. An array of IPMC actuators combined with the SU-8 net structure was optimized to effectively collect plaque fragments. The evaporation of solvent through the actuator's surface was prevented using a coating of SU-8 and polydimethylsiloxane thin film on the actuator. This approach improved the available operating time of the IPMC, which primarily depends on solvent loss. Our preliminary results demonstrate the possibility of using the capturer for biomedical applications. © 2011 American Institute of Physics

  6. Micro thrust and heat generator

    DOEpatents

    Garcia, Ernest J.

    1998-01-01

    A micro thrust and heat generator has a means for providing a combustion fuel source to an ignition chamber of the micro thrust and heat generator. The fuel is ignited by a ignition means within the micro thrust and heat generator's ignition chamber where it burns and creates a pressure. A nozzle formed from the combustion chamber extends outward from the combustion chamber and tappers down to a narrow diameter and then opens into a wider diameter where the nozzle then terminates outside of said combustion chamber. The pressure created within the combustion chamber accelerates as it leaves the chamber through the nozzle resulting in pressure and heat escaping from the nozzle to the atmosphere outside the micro thrust and heat generator. The micro thrust and heat generator can be microfabricated from a variety of materials, e.g., of polysilicon, on one wafer using surface micromachining batch fabrication techniques or high aspect ratio micromachining techniques (LIGA).

  7. Micro thrust and heat generator

    DOEpatents

    Garcia, E.J.

    1998-11-17

    A micro thrust and heat generator have a means for providing a combustion fuel source to an ignition chamber of the micro thrust and heat generator. The fuel is ignited by a ignition means within the micro thrust and heat generator`s ignition chamber where it burns and creates a pressure. A nozzle formed from the combustion chamber extends outward from the combustion chamber and tappers down to a narrow diameter and then opens into a wider diameter where the nozzle then terminates outside of said combustion chamber. The pressure created within the combustion chamber accelerates as it leaves the chamber through the nozzle resulting in pressure and heat escaping from the nozzle to the atmosphere outside the micro thrust and heat generator. The micro thrust and heat generator can be microfabricated from a variety of materials, e.g., of polysilicon, on one wafer using surface micromachining batch fabrication techniques or high aspect ratio micromachining techniques (LIGA). 30 figs.

  8. Fabrication of a novel quartz micromachined gyroscope

    NASA Astrophysics Data System (ADS)

    Xie, Liqiang; Xing, Jianchun; Wang, Haoxu; Wu, Xuezhong

    2015-04-01

    A novel quartz micromachined gyroscope is proposed in this paper. The novel gyroscope is realized by quartz anisotropic wet etching and 3-dimensional electrodes deposition. In the quartz wet etching process, the quality of Cr/Au mask films affecting the process are studied by experiment. An excellent mask film with 100 Å Cr and 2000 Å Au is achieved by optimization of experimental parameters. Crystal facets after etching seriously affect the following sidewall electrodes deposition process and the structure's mechanical behaviours. Removal of crystal facets is successfully implemented by increasing etching time based on etching rate ratios between facets and crystal planes. In the electrodes deposition process, an aperture mask evaporation method is employed to prepare electrodes on 3-dimensional surfaces of the gyroscope structure. The alignments among the aperture masks are realized by the ABM™ Mask Aligner System. Based on the processes described above, a z-axis quartz gyroscope is fabricated successfully.

  9. Micromachined ultrasonic transducers: 11.4 MHz transmission in air and more

    NASA Astrophysics Data System (ADS)

    Ladabaum, Igal; Khuri-Yakub, B. T.; Spoliansky, Dimitri

    1996-01-01

    The fabrication and modeling of novel, capacitive, ultrasonic air transducers is reported. Transmission experiments in air at 11.4, 9.2, and 3.1 MHz are shown to correspond with theory. The transducers are made using surface micromachining techniques, which enable the realization of center frequencies ranging from 1.8 to 11.6 MHz. The bandwidth of the transducers ranges from 5% to 20%, depending on processing parameters. Custom circuitry is able to detect 10 MHz capacitance fluctuations as small as 10-18 F, which correspond to displacements on the order of 10-3 Å, in a bandwidth of 2 MHz with a signal to noise ratio of 20 dB. Such detection sensitivity is shown to yield air transducer systems capable of withstanding over 100 dB of signal attenuation, a figure of merit that has significant implications for ultrasonic imaging, nondestructive evaluation, gas flow and composition measurements, and range sensing.

  10. A 5 meter range non-planar CMUT array for Automotive Collision Avoidance

    NASA Astrophysics Data System (ADS)

    Hernandez Aguirre, Jonathan

    A discretized hyperbolic paraboloid geometry capacitive micromachined ultrasonic transducer (CMUT) array has been designed and fabricated for automotive collision avoidance. The array is designed to operate at 40 kHz, beamwidth of 40° with a maximum sidelobe intensity of -10dB. An SOI based fabrication technology has been used for the 5x5 array with 5 sensing surfaces along each x and y axis and 7 elevation levels. An assembly and packaging technique has been developed to realize the non-planar geometry in a PGA-68 package. A highly accurate mathematical method has been presented for analytical characterization of capacitive micromachined ultrasonic transducers (CMUTs) built with square diaphragms. The method uses a new two-dimensional polynomial function to more accurately predict the deflection curve of a multilayer square diaphragm subject to both mechanical and electrostatic pressure and a new capacitance model that takes into account the contribution of the fringing field capacitances.

  11. Low-loss LIGA-micromachined conductor-backed coplanar waveguide.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Forman, Michael A.

    2004-12-01

    A mesoscale low-loss LIGA-micromachined conductor-backed coplanar waveguide is presented. The 517 {micro}m lines are the tallest uniplanar LIGA-fabricated microwave transmission lines to date, as well as the first to be constructed of copper rather than nickel. The conductor-backed micromachined CPW on quartz achieves a measured attenuation of 0.064 dB/cm at 15.5 GHz.

  12. Micro-machined thermo-conductivity detector

    DOEpatents

    Yu, Conrad

    2003-01-01

    A micro-machined thermal conductivity detector for a portable gas chromatograph. The detector is highly sensitive and has fast response time to enable detection of the small size gas samples in a portable gas chromatograph which are in the order of nanoliters. The high sensitivity and fast response time are achieved through micro-machined devices composed of a nickel wire, for example, on a silicon nitride window formed in a silicon member and about a millimeter square in size. In addition to operating as a thermal conductivity detector, the silicon nitride window with a micro-machined wire therein of the device can be utilized for a fast response heater for PCR applications.

  13. Hybrid membrane-microfluidic components using a novel ceramic MEMS technology

    NASA Astrophysics Data System (ADS)

    Lutz, Brent J.; Polyakov, Oleg; Rinaldo, Chris

    2012-03-01

    A novel hybrid nano/microfabrication technology has been employed to produce unique MEMS and microfluidic components that integrate nanoporous membranes. The components are made by micromachining a self-organized nanostructured ceramic material that is biocompatible and amenable to surface chemistry modification. Microfluidic structures, such as channels and wells, can be made with a precision of <2 microns. Thin-film membranes can be integrated into the bottom of these structures, featuring a wide range of possible thicknesses, from 100 micron to <50 nm. Additionally, these membranes may be non-porous or porous (with controllable pore sizes from 200 nm to <5 nm), for sophisticated size-based separations. With previous and current support from the NIH SBIR program, we have built several unique devices, and demonstrated improved separations, cell culturing, and imaging (optical and electron microscopy) versus standard products. Being ceramic, the material is much more robust to demanding environments (e.g. high and low temperatures and organic solvents), compared to polymer-based devices. Additionally, we have applied multiple surface modification techniques, including atomic layer deposition, to manipulate properties such as electrical conductivity. This microfabrication technology is highly scaleable, and thus can yield low-cost, reliable, disposable microcomponents and devices. Specific applications that can benefit from this technology includes cell culturing and assays, imaging by cryo-electron tomography, environmental sample processing, as well as many others.

  14. Rough surface adhesion in the presence of capillary condensation

    DOE PAGES

    DelRio, Frank W.; Dunn, Martin L.; Phinney, Leslie M.; ...

    2007-04-17

    Capillary condensation of water can have a significant effect on rough surface adhesion. Here, to explore this phenomenon between micromachined surfaces, the authors perform microcantilever experiments as a function of surface roughness and relative humidity (RH). Below a threshold RH, the adhesion is mainly due to van der Waals forces across extensive noncontacting areas. Above the threshold RH, the adhesion jumps due to capillary condensation and increases towards the upper limit of Γ=144mJ/m 2. Lastly, a detailed model based on the measured surface topography qualitatively agrees with the experimental data only when the topographic correlations between the upper and lowermore » surfaces are considered.« less

  15. ELECTRICALLY ACTUATED, PRESSURE-DRIVEN LIQUID CHROMATOGRAPHY SEPARATIONS IN MICROFABRICATED DEVICES

    PubMed Central

    Fuentes, Hernan V.; Woolley, Adam T.

    2012-01-01

    Electrolysis-based micropumps integrated with microfluidic channels in micromachined glass substrates are presented. Photolithography combined with wet chemical etching and thermal bonding enabled the fabrication of multi-layer devices containing electrically actuated micropumps interfaced with sample and mobile phase reservoirs. A stationary phase was deposited on the microchannel walls by coating with 10% (w/w) chlorodimethyloctadecylsilane in toluene. Pressure-balanced injection was implemented by controlling the electrolysis time and voltage applied in the two independent micropumps. Current fluctuations in the micropumps due to the stochastic formation of bubbles on the electrode surfaces were determined to be the main cause of variation between separations. On-chip electrochemical pumping enabled the loading of pL samples with no dead volume between injection and separation. A mobile phase composed of 70% acetonitrile and 30% 50 mM acetate buffer (pH 5.45) was used for the chromatographic separation of three fluorescently labeled amino acids in <40 s with an efficiency of >3000 theoretical plates in a 2.5-cm-long channel. Our results demonstrate the potential of electrochemical micropumps integrated with microchannels to perform rapid chromatographic separations in a microfabricated platform. Importantly, these devices represent a significant step toward the development of miniaturized and fully integrated liquid chromatography systems. PMID:17960281

  16. Electrically actuated, pressure-driven liquid chromatography separations in microfabricated devices.

    PubMed

    Fuentes, Hernan V; Woolley, Adam T

    2007-11-01

    Electrolysis-based micropumps integrated with microfluidic channels in micromachined glass substrates are presented. Photolithography combined with wet chemical etching and thermal bonding enabled the fabrication of multi-layer devices containing electrically actuated micropumps interfaced with sample and mobile phase reservoirs. A stationary phase was deposited on the microchannel walls by coating with 10% (w/w) chlorodimethyloctadecylsilane in toluene. Pressure-balanced injection was implemented by controlling the electrolysis time and voltage applied in the two independent micropumps. Current fluctuations in the micropumps due to the stochastic formation of bubbles on the electrode surfaces were determined to be the main cause of variation between separations. On-chip electrochemical pumping enabled the loading of pL samples with no dead volume between injection and separation. A mobile phase composed of 70% acetonitrile and 30% 50 mM acetate buffer (pH 5.45) was used for the chromatographic separation of three fluorescently labeled amino acids in <40 s with an efficiency of >3000 theoretical plates in a 2.5 cm-long channel. Our results demonstrate the potential of electrochemical micropumps integrated with microchannels to perform rapid chromatographic separations in a microfabricated platform. Importantly, these devices represent a significant step toward the development of miniaturized and fully integrated liquid chromatography systems.

  17. A Novel Silicon Micromachined Integrated MCM Thermal Management System

    NASA Technical Reports Server (NTRS)

    Kazmierczak, M. J.; Henderson, H. T.; Gerner, F. M.

    1997-01-01

    "Micromachining" is a chemical means of etching three-dimensional structures, typically in single- crystalline silicon. These techniques are leading toward what is coming to be referred to as MEMS (Micro Electro Mechanical Systems), where in addition to the ordinary two-dimensional (planar) microelectronics, it is possible to build three-dimensional n-ticromotors, electrically- actuated raicrovalves, hydraulic systems and much more on the same microchip. These techniques become possible because of differential etching rates of various crystallographic planes and materials used for semiconductor n-ticrofabfication. The University of Cincinnati group in collaboration with Karl Baker at NASA Lewis were the first to form micro heat pipes in silicon by the above techniques. Current work now in progress using MEMS technology is now directed towards the development of the next generation in MCM (Multi Chip Module) packaging. Here we propose to develop a complete electronic thermal management system which will allow densifica6on in chip stacking by perhaps two orders of magnitude. Furthermore the proposed technique will allow ordinary conu-nercial integrated chips to be utilized. Basically, the new technique involves etching square holes into a silicon substrate and then inserting and bonding commercially available integrated chips into these holes. For example, over a 100 1/4 in. by 1 /4 in. integrated chips can be placed on a 4 in. by 4 in. silicon substrate to form a Multi-Chip Module (MCM). Placing these MCM's in-line within an integrated rack then allows for three-diniensional stacking. Increased miniaturization of microelectronic circuits will lead to very high local heat fluxes. A high performance thermal management system will be specifically designed to remove the generated energy. More specifically, a compact heat exchanger with milli / microchannels will be developed and tested to remove the heat through the back side of this MCM assembly for moderate and high heat flux applications, respectively. The high heat load application of particular interest in mind is the motor controller developed by Martin Marietta for Nasa to control the thruster's directional actuators on space vechicles. Work is also proposed to develop highly advanced and improved porous wick structures for use in advanced heat loops. The porous wick will be micromachined from silicon using MEMS technology, thus permitting far superior control of pore size and pore distribution (over wicks made from sintered n-ietals), which in turn is expected to led to significantly improved heat loop performance.

  18. Fibroblast adhesion and activation onto micro-machined titanium surfaces.

    PubMed

    Guillem-Marti, J; Delgado, L; Godoy-Gallardo, M; Pegueroles, M; Herrero, M; Gil, F J

    2013-07-01

    Surface modifications performed at the neck of dental implants, in the manner of micro-grooved surfaces, can reduce fibrous tissue encapsulation and prevent bacterial colonization, thereby improving fibrointegration and the formation of a biological seal. However, the applied procedures are technically complex and/or time consuming methods. The aim of this study was to analyse the fibroblast behaviour on modified titanium surfaces obtained, applying a simple and low-cost method. An array of titanium surfaces was obtained using a commercial computerized numerical control lathe, modifying the feed rate and the cutting depth. To elucidate the potential ability of the generated surfaces to activate connective tissue cells, a thorough gene (by real time - qPCR) and protein (by western blot or zymography) expression and cellular response characterization (cell morphology, cell adhesion and cell activation by secreting extracellular matrix (ECM) components and their enzyme regulators) was performed. Micro-grooved surfaces have statistically significant differences in the groove's width (approximately 10, 50 and 100 μm) depending on the applied advancing fixed speed. Field emission scanning electron microscopy images showed that fibroblasts oriented along the generated grooves, but they were only entirely accommodated on the wider grooves (≥50 μm). Micro-grooved surfaces exhibited an earlier cell attachment and activation, as seen by collagen Iα1 and fibronectin deposition and activation of ECM remodelling enzymes, compared with the other surfaces. However, fibroblasts could remain in an activated state on narrower surfaces (<50 μm) at later stages. The use of micro-grooved surfaces could improve implant integration at the gingival site with respect to polished surfaces. Micro-grooved surfaces enhance early fibroblast adhesion and activation, which could be critical for the formation of a biological seal and finally promote tissue integration. Surfaces with wider grooves (≥50 μm) seem to be more appropriate than surfaces with narrow grooves (<50 μm), as fibroblasts could persist in an activated state on narrower grooved surfaces, increasing the probability of producing a fibrotic response. © 2012 John Wiley & Sons A/S.

  19. Hybrid Micro-Electro-Mechanical Tunable Filter

    DTIC Science & Technology

    2007-09-01

    Figure 2.10), one can see the developers have used surface micromachining techniques to build the micromirror structure over the CMOS addressing...DBRs, microcavity composition, initial air gap, contact layers, substrate Dispersion Data Curve -fit dispersion data or generate dispersion function...measurements • Curve -fit the dispersion data or generate a continuous, wavelength-dependent, representation of material dispersion • Manually design the

  20. Tunable Patch Antennas Using Microelectromechanical Systems

    DTIC Science & Technology

    2011-05-11

    Figure 28, was selected as most suitable to this application. MetalMUMPs is a surface micromachining process with polysilicon , silicon nitride, nickel...yields. MEMS Variable Capacitor Design The MEMS capacitors reported here were an original design that features nickel and polysilicon layers as...the movable plates of a variable parallel plate capacitor. The polysilicon layer was embedded in silicon nitride for electrical isolation and suspended

  1. Design and simulation of a tactile display based on a CMUT array

    NASA Astrophysics Data System (ADS)

    Chouvardas, Vasilios G.; Hatalis, Miltiadis K.; Miliou, Amalia N.

    2012-10-01

    In this article, we present the design of a tactile display based on a CMUT-phased array. The array implements a 'pixel' of the display and is used to focus airborne ultrasound energy on the skin surface. The pressure field, generated by the focused ultrasound waves, is used to excite the mechanoreceptors under the skin and transmit tactile information. The results of Finite Element Analysis (FEA) of the Capacitive Micromachined Ultrasonic Transducer (CMUT) and the CMUT-phased array for ultrasound emission are presented. The 3D models of the device and the array were developed using a commercial FEA package. Modelling and simulations were performed using the parameters from the POLYMUMPS surface micromachining technology from MEMSCAP. During the analysis of the phased array, several parameters were studied in order to determine their importance in the design of the tactile display. The output of the array is compared with the acoustic intensity thresholds in order to prove the feasibility of the design. Taking into account the density of the mechanoreceptors in the skin, we conclude that there should be at least one receptor under the excitation area formed on the skin.

  2. Freeze-tolerant condenser for a closed-loop heat-transfer system

    NASA Technical Reports Server (NTRS)

    Crowley, Christopher J. (Inventor); Elkouh, Nabil A. (Inventor)

    2002-01-01

    A freeze tolerant condenser (106) for a two-phase heat transfer system is disclosed. The condenser includes an enclosure (110) and a porous artery (112) located within and extending along the length of the enclosure. A vapor space (116) is defined between the enclosure and the artery, and a liquid space (114) is defined by a central passageway within the artery. The artery includes a plurality of laser-micromachined capillaries (130) extending from the outer surface of the artery to its inner surface such that the vapor space is in fluid communication with the liquid space. In one embodiment of the invention, the capillaries (130) are cylindrical holes having a diameter of no greater than 50 microns. In another embodiment, the capillaries (130') are slots having widths of no greater than 50 microns. A method of making an artery in accordance with the present invention is also disclosed. The method includes providing a solid-walled tube and laser-micromachining a plurality of capillaries into the tube along a longitudinal axis, wherein each capillary has at least one cross-sectional dimension transverse to the longitudinal axis of less than 50 microns.

  3. Linkage design effect on the reliability of surface-micromachined microengines driving a load

    NASA Astrophysics Data System (ADS)

    Tanner, Danelle M.; Peterson, Kenneth A.; Irwin, Lloyd W.; Tangyunyong, Paiboon; Miller, William M.; Eaton, William P.; Smith, Norman F.; Rodgers, M. Steven

    1998-09-01

    The reliability of microengines is a function of the design of the mechanical linkage used to connect the electrostatic actuator to the drive. We have completed a series of reliability stress tests on surface micromachined microengines driving an inertial load. In these experiments, we used microengines that had pin mechanisms with guides connecting the drive arms to the electrostatic actuators. Comparing this data to previous results using flexure linkages revealed that the pin linkage design was less reliable. The devices were stressed to failure at eight frequencies, both above and below the measured resonance frequency of the microengine. Significant amounts of wear debris were observed both around the hub and pin joint of the drive gear. Additionally, wear tracks were observed in the area where the moving shuttle rubbed against the guides of the pin linkage. At each frequency, we analyzed the statistical data yielding a lifetime (t50) for median cycles to failure and (sigma) , the shape parameter of the distribution. A model was developed to describe the failure data based on fundamental wear mechanisms and forces exhibited in mechanical resonant systems. The comparison to the model will be discussed.

  4. Differential surface stress sensor for detection of chemical and biological species

    NASA Astrophysics Data System (ADS)

    Kang, K.; Nilsen-Hamilton, M.; Shrotriya, P.

    2008-10-01

    We report a sensor consisting of two micromachined cantilevers (a sensing/reference pair) that is suitable for detection of chemical and biological species. The sensing strategy involves coating the sensing cantilever with receptors that have high affinities for the analyte. The presence of analyte is detected by determining the differential surface stress associated with its adsorption/absorption to the sensing cantilever. An interferometric technique is utilized to measure the differential bending of the sensing cantilever with respect to reference. Surface stress associated with hybridization of single stranded DNA is measured to demonstrate the unique advantages of the sensor.

  5. Etching characteristics of Si{110} in 20 wt% KOH with addition of hydroxylamine for the fabrication of bulk micromachined MEMS

    NASA Astrophysics Data System (ADS)

    Rao, A. V. Narasimha; Swarnalatha, V.; Pal, P.

    2017-12-01

    Anisotropic wet etching is a most widely employed for the fabrication of MEMS/NEMS structures using silicon bulk micromachining. The use of Si{110} in MEMS is inevitable when a microstructure with vertical sidewall is to be fabricated using wet anisotropic etching. In most commonly employed etchants (i.e. TMAH and KOH), potassium hydroxide (KOH) exhibits higher etch rate and provides improved anisotropy between Si{111} and Si{110} planes. In the manufacturing company, high etch rate is demanded to increase the productivity that eventually reduces the cost of end product. In order to modify the etching characteristics of KOH for the micromachining of Si{110}, we have investigated the effect of hydroxylamine (NH2OH) in 20 wt% KOH solution. The concentration of NH2OH is varied from 0 to 20% and the etching is carried out at 75 °C. The etching characteristics which are studied in this work includes the etch rates of Si{110} and silicon dioxide, etched surface morphology, and undercutting at convex corners. The etch rate of Si{110} in 20 wt% KOH + 15% NH2OH solution is measured to be four times more than that of pure 20 wt% KOH. Moreover, the addition of NH2OH increases the undercutting at convex corners and enhances the etch selectivity between Si and SiO2.

  6. Silicon Micromachining for Terahertz Component Development

    NASA Technical Reports Server (NTRS)

    Chattopadhyay, Goutam; Reck, Theodore J.; Jung-Kubiak, Cecile; Siles, Jose V.; Lee, Choonsup; Lin, Robert; Mehdi, Imran

    2013-01-01

    Waveguide component technology at terahertz frequencies has come of age in recent years. Essential components such as ortho-mode transducers (OMT), quadrature hybrids, filters, and others for high performance system development were either impossible to build or too difficult to fabricate with traditional machining techniques. With micromachining of silicon wafers coated with sputtered gold it is now possible to fabricate and test these waveguide components. Using a highly optimized Deep Reactive Ion Etching (DRIE) process, we are now able to fabricate silicon micromachined waveguide structures working beyond 1 THz. In this paper, we describe in detail our approach of design, fabrication, and measurement of silicon micromachined waveguide components and report the results of a 1 THz canonical E-plane filter.

  7. MEMS Applications in Aerodynamic Measurement Technology

    NASA Technical Reports Server (NTRS)

    Reshotko, E.; Mehregany, M.; Bang, C.

    1998-01-01

    Microelectromechanical systems (MEMS) embodies the integration of sensors, actuators, and electronics on a single substrate using integrated circuit fabrication techniques and compatible bulk and surface micromachining processes. Silicon and its derivatives form the material base for the MEMS technology. MEMS devices, including microsensors and microactuators, are attractive because they can be made small (characteristic dimension about 100 microns), be produced in large numbers with uniform performance, include electronics for high performance and sophisticated functionality, and be inexpensive. For aerodynamic measurements, it is preferred that sensors be small so as to approximate measurement at a point, and in fact, MEMS pressure sensors, wall shear-stress sensors, heat flux sensors and micromachined hot wires are nearing application. For the envisioned application to wind tunnel models, MEMS sensors can be placed on the surface or in very shallow grooves. MEMS devices have often been fabricated on stiff, flat silicon substrates, about 0.5 mm thick, and therefore were not easily mounted on curved surfaces. However, flexible substrates are now available and heat-flux sensor arrays have been wrapped around a curved turbine blade. Electrical leads can also be built into the flexible substrate. Thus MEMS instrumented wind tunnel models do not require deep spanwise grooves for tubes and leads that compromise the strength of conventionally instrumented models. With MEMS, even the electrical leads can potentially be eliminated if telemetry of the signals to an appropriate receiver can be implemented. While semiconductor silicon is well known for its electronic properties, it is also an excellent mechanical material for MEMS applications. However, silicon electronics are limited to operations below about 200 C, and silicon's mechanical properties start to diminish above 400 C. In recent years, silicon carbide (SiC) has emerged as the leading material candidate for applications in high temperature environments and can be used for high-temperature MEMS applications. With SiC, diodes and more complex electronics have been shown to operate to about 600 C, while the mechanical properties of SiC are maintained to much higher temperatures. Even when MEMS devices show benefits in the laboratory, there are many packaging challenges for any aeronautics application. Incorporating MEMS into these applications requires new approaches to packaging that goes beyond traditional integrated circuit (IC) packaging technologies. MEMS must interact mechanically, as well as electrically with their environment, making most traditional chip packaging and mounting techniques inadequate. Wind tunnels operate over wide temperature ranges in an environment that is far from being a 'clean-room.' In flight, aircraft are exposed to natural elements (e.g. rain, sun, ice, insects and dirt) and operational interferences(e.g. cleaning and deicing fluids, and maintenance crews). In propulsion systems applications, MEMS devices will have to operate in environments containing gases with very high temperatures, abrasive particles and combustion products. Hence deployment and packaging that maintains the integrity of the MEMS system is crucial. This paper presents an overview of MEMS fabrication and materials, descriptions of available sensors with more details on those being developed in our laboratories, and a discussion of sensor deployment options for wind tunnel and flight applications.

  8. A sensitive optical micro-machined ultrasound sensor (OMUS) based on a silicon photonic ring resonator on an acoustical membrane.

    PubMed

    Leinders, S M; Westerveld, W J; Pozo, J; van Neer, P L M J; Snyder, B; O'Brien, P; Urbach, H P; de Jong, N; Verweij, M D

    2015-09-22

    With the increasing use of ultrasonography, especially in medical imaging, novel fabrication techniques together with novel sensor designs are needed to meet the requirements for future applications like three-dimensional intercardiac and intravascular imaging. These applications require arrays of many small elements to selectively record the sound waves coming from a certain direction. Here we present proof of concept of an optical micro-machined ultrasound sensor (OMUS) fabricated with a semi-industrial CMOS fabrication line. The sensor is based on integrated photonics, which allows for elements with small spatial footprint. We demonstrate that the first prototype is already capable of detecting pressures of 0.4 Pa, which matches the performance of the state of the art piezo-electric transducers while having a 65 times smaller spatial footprint. The sensor is compatible with MRI due to the lack of electronical wiring. Another important benefit of the use of integrated photonics is the easy interrogation of an array of elements. Hence, in future designs only two optical fibers are needed to interrogate an entire array, which minimizes the amount of connections of smart catheters. The demonstrated OMUS has potential applications in medical ultrasound imaging, non destructive testing as well as in flow sensing.

  9. Ultrasonic fingerprint sensor using a piezoelectric micromachined ultrasonic transducer array integrated with complementary metal oxide semiconductor electronics

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Lu, Y.; Fung, S.; Wang, Q.

    2015-06-29

    This paper presents an ultrasonic fingerprint sensor based on a 24 × 8 array of 22 MHz piezoelectric micromachined ultrasonic transducers (PMUTs) with 100 μm pitch, fully integrated with 180 nm complementary metal oxide semiconductor (CMOS) circuitry through eutectic wafer bonding. Each PMUT is directly bonded to a dedicated CMOS receive amplifier, minimizing electrical parasitics and eliminating the need for through-silicon vias. The array frequency response and vibration mode-shape were characterized using laser Doppler vibrometry and verified via finite element method simulation. The array's acoustic output was measured using a hydrophone to be ∼14 kPa with a 28 V input, in reasonable agreement with predication from analyticalmore » calculation. Pulse-echo imaging of a 1D steel grating is demonstrated using electronic scanning of a 20 × 8 sub-array, resulting in 300 mV maximum received amplitude and 5:1 contrast ratio. Because the small size of this array limits the maximum image size, mechanical scanning was used to image a 2D polydimethylsiloxane fingerprint phantom (10 mm × 8 mm) at a 1.2 mm distance from the array.« less

  10. Fabrication of Silicon Backshorts with Improved Out-of-Band Rejection for Waveguide-Coupled Superconducting Detectors

    NASA Technical Reports Server (NTRS)

    Crowe, Erik J.; Bennett, Charles L.; Chuss, David T.; Denis, Kevin L.; Eimer, Joseph; Lourie, Nathan; Marriage, Tobias; Moseley, Samuel H.; Rostem, Karwan; Stevenson, Thomas R.; hide

    2012-01-01

    The Cosmology Large Angular Scale Surveyor (CLASS) is a ground-based instrument that will measure the polarization of the cosmic microqave background to search for gravitational waves form a posited epoch of inflation early in the universe's history. This measurement will require integration of superconducting transition-edge sensors with microwave waveguide inputs with good conrol of systematic errors, such as unwanted coupling to stray signals at frequencies outside of a precisely defined microwave band. To address these needs we will present work on the fabrication of silicon quarter-wave backshorts for the CLASS 40GHz focal plane. The 40GHz backshort consists of three degeneratively doped silicon wafers. Two spacer wafers are micromachined with through wafer vins to provide a 2.0mm long square waveguide. The third wafer acts as the backshort cap. The three wafers are bonded at the wafer level by Au-Au thermal compression bonding then aligned and flip chip bonded to the CLASS detector at the chip level. The micromachining techniques used have been optimized to create high aspect ratio waveguides, silicon pillars, and relief trenches with the goal of providing improved out of band signal rejection. We will discuss the fabrication of integrated CLASS superconducting detectors with silicon quarter wave backshorts and present current measurement results.

  11. Hadamard spectrometer for passive LWIR standoff surveillance

    NASA Astrophysics Data System (ADS)

    Kruzelecky, Roman V.; Wong, Brian; Zou, Jing; Mohammad, Najeeb; Jamroz, Wes; Soltani, Mohammed; Chaker, Mohamed; Haddad, Emile; Laou, Philips; Paradis, Suzanne

    2007-06-01

    Based on the principle of the Integrated Optical Spectrometer (IOSPEC), a waveguide-based, longwave infrared (LWIR) dispersive spectrometer with multiple input slits for Hadamard spectroscopy was designed and built intended for passive standoff chemical agent detection in 8 to 12μm spectral range. This prototype unit equips with a three-inch input telescope providing a field-of-view of 1.2 degrees, a 16-microslit array (each slit 60 μm by 1.8 mm) module for Hadamard binary coding, a 2-mm core ZnS/ZnSe/ZnS slab waveguide with a 2 by 2 mm2 optical input and micro-machined integrated optical output condensor, a Si micro-machined blazing grating, a customized 128-pixel LWIR mercury-cadmium-telluride (MCT) LN2 cooled detector array, proprietary signal processing technique, software and electronics. According to the current configuration, it was estimated that the total system weight to be ~4 kg, spectral resolution <4cm -1 and Noise Equivalent Spectral Radiance (NESR) <10 -8 Wcm -2 sr -1cm -1 in 8 to 12 μm. System design and preliminary test results of some components will be presented. Upon the arrival of the MCT detector array, the prototype unit will be further tested and its performance validated in fall of 2007.

  12. Micromachined evaporators for AMTEC cells

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Izenson, M.G.; Crowley, C.J.

    1996-12-31

    To achieve high cell efficiency and reliability, the capillary pumping system for Alkali Metal Thermal to Electric Conversion (AMTEC) must have three key characteristics: (1) very small pores to achieve a high capillary pumping head, (2) high permeability for the flow of liquid sodium to minimize internal losses, and (3) be made from a material that is exceptionally stable at high temperatures in a sodium environment. The authors have developed micromachining techniques to manufacture high performance evaporators for AMTEC cells. The evaporators have been fabricated from stainless steel, molybdenum, and a niobium alloy (Nb-1Zr). The regular, micromachined structure leads tomore » very high capillary pumping head with high permeability for liquid flow. Data from tests performed with common fluids at room temperature characterize the capillary pumping head and permeability of these structures. Three micromachined evaporators have been built into AMTEC cells and operated at temperatures up to 1,100 K. Results from these tests confirm the excellent pumping capabilities of the micromachined evaporators.« less

  13. Apparatus to collect, classify, concentrate, and characterize gas-borne particles

    DOEpatents

    Rader, Daniel J.; Torczynski, John R.; Wally, Karl; Brockmann, John E.

    2002-01-01

    An aerosol lab-on-a-chip (ALOC) integrates one or more of a variety of aerosol collection, classification, concentration (enrichment), and characterization processes onto a single substrate or layered stack of such substrates. By taking advantage of modern micro-machining capabilities, an entire suite of discrete laboratory aerosol handling and characterization techniques can be combined in a single portable device that can provide a wealth of data on the aerosol being sampled. The ALOC offers parallel characterization techniques and close proximity of the various characterization modules helps ensure that the same aerosol is available to all devices (dramatically reducing sampling and transport errors). Micro-machine fabrication of the ALOC significantly reduces unit costs relative to existing technology, and enables the fabrication of small, portable ALOC devices, as well as the potential for rugged design to allow operation in harsh environments. Miniaturization also offers the potential of working with smaller particle sizes and lower pressure drops (leading to reduction of power consumption).

  14. Dual-beam optical trapping of cells in an optofluidic device fabricated by femtosecond lasers

    NASA Astrophysics Data System (ADS)

    Bellini, N.; Bragheri, F.; Vishnubhatla, K. C.; Ferrara, L.; Minzioni, P.; Cerullo, G.; Ramponi, R.; Cristiani, I.; Osellame, R.

    2010-02-01

    We present design and optimization of an optofluidic monolithic chip, able to provide optical trapping and controlled stretching of single cells. The chip is fabricated in a fused silica glass substrate by femtosecond laser micromachining, which can produce both optical waveguides and microfluidic channels with great accuracy. Versatility and three-dimensional capabilities of this fabrication technology provide the possibility to fabricate circular cross-section channels with enlarged access holes for an easy connection with an external fluidic circuit. Moreover, a new fabrication procedure adopted allows the demonstration of microchannels with a square cross-section, thus guaranteeing an improved quality of the trapped cell images. Optical trapping and stretching of single red blood cells are demonstrated, thus proving the effectiveness of the proposed device as a monolithic optical stretcher. We believe that femtosecond laser micromachining represents a promising technique for the development of multifunctional integrated biophotonic devices that can be easily coupled to a microscope platform, thus enabling a complete characterization of the cells under test.

  15. Ultrasonic Fingerprint Sensor With Transmit Beamforming Based on a PMUT Array Bonded to CMOS Circuitry.

    PubMed

    Jiang, Xiaoyue; Tang, Hao-Yen; Lu, Yipeng; Ng, Eldwin J; Tsai, Julius M; Boser, Bernhard E; Horsley, David A

    2017-09-01

    In this paper, we present a single-chip 65 ×42 element ultrasonic pulse-echo fingerprint sensor with transmit (TX) beamforming based on piezoelectric micromachined ultrasonic transducers directly bonded to a CMOS readout application-specific integrated circuit (ASIC). The readout ASIC was realized in a standard 180-nm CMOS process with a 24-V high-voltage transistor option. Pulse-echo measurements are performed column-by-column in sequence using either one column or five columns to TX the ultrasonic pulse at 20 MHz. TX beamforming is used to focus the ultrasonic beam at the imaging plane where the finger is located, increasing the ultrasonic pressure and narrowing the 3-dB beamwidth to [Formula: see text], a factor of 6.4 narrower than nonbeamformed measurements. The surface of the sensor is coated with a poly-dimethylsiloxane (PDMS) layer to provide good acoustic impedance matching to skin. Scanning laser Doppler vibrometry of the PDMS surface was used to map the ultrasonic pressure field at the imaging surface, demonstrating the expected increase in pressure, and reduction in beamwidth. Imaging experiments were conducted using both PDMS phantoms and real fingerprints. The average image contrast is increased by a factor of 1.5 when beamforming is used.

  16. A Novel Silicon Micromachined Integrated MCM Thermal Management System

    NASA Technical Reports Server (NTRS)

    Kazmierczak, M. J.; Henderson, H. T.; Gerner, F. M.

    1999-01-01

    This research concerned the development of a novel porous wick, fabricated totally out of silicon, using state-of-the-art MEMS technology. A comprehensive summary of results, as well as additional fabrication details, can be found in the following three documents located in the attached Appendices: A) Selected pages and excerpts from Year 2 progress report of the principal NASA Grant awarded from NASA Lewis Research Center, Grant Number NAG3-1706 entitled "A Novel Silicon Nficromachined Integrated MCM Thermal Management System" submitted to NASA LRC on 4/4/98. B) Selected viewgraphs from the joint NASA, TEES, and UC meeting held at the University of Cincinnati on April 24, 1998. C) Pre-print of the paper entitled "Coherent Macro Porous Silicon as a Wick Structure in an Integrated Nficrofluidic Two-Phase Cooling System" to be presented September 20-25, 1998 at the SPIE conference held in Santa Clara, Ca. To summarize,. nearly all of the proposed work was successfully accomplished (albeit a 3-month time extension was required), proving that micromachining can indeed be used to fabricate porous silicon wick structures with precise hole sizes and patterning control, thus permitting a substantial improvement in future wick designs. In addition, the appropriate range of thermal conductivities of the porous samples were theoretically predicted (see Appendix A). Although not part of the scope of work, the permeability of the test samples were measured (see results sections of Appendices B and C).

  17. Micromachined mirrors for raster-scanning displays and optical fiber switches

    NASA Astrophysics Data System (ADS)

    Hagelin, Paul Merritt

    Micromachines and micro-optics have the potential to shrink the size and cost of free-space optical systems, enabling a new generation of high-performance, compact projection displays and telecommunications equipment. In raster-scanning displays and optical fiber switches, a free-space optical beam can interact with multiple tilt- up micromirrors fabricated on a single substrate. The size, rotation angle, and flatness of the mirror surfaces determine the number of pixels in a raster-display or ports in an optical switch. Single-chip and two-chip optical raster display systems demonstrate static mirror curvature correction, an integrated electronic driver board, and dynamic micromirror performance. Correction for curvature caused by a stress gradient in the micromirror leads to resolution of 102 by 119 pixels in the single-chip display. The optical design of the two-chip display features in-situ mirror curvature measurement and adjustable image magnification with a single output lens. An electronic driver board synchronizes modulation of the optical source with micromirror actuation for the display of images. Dynamic off-axis mirror motion is shown to have minimal influence on resolution. The confocal switch, a free-space optical fiber cross- connect, incorporates micromirrors having a design similar to the image-refresh scanner. Two micromirror arrays redirect optical beams from an input fiber array to the output fibers. The switch architecture supports simultaneous switching of multiple wavelength channels. A 2x2 switch configuration, using single-mode optical fiber at 1550 mn, is demonstrated with insertion loss of -4.2 dB and cross-talk of -50.5 dB. The micromirrors have sufficient size and angular range for scaling to a 32x32 cross-connect switch that has low insertion-loss and low cross-talk.

  18. Predictive modeling, simulation, and optimization of laser processing techniques: UV nanosecond-pulsed laser micromachining of polymers and selective laser melting of powder metals

    NASA Astrophysics Data System (ADS)

    Criales Escobar, Luis Ernesto

    One of the most frequently evolving areas of research is the utilization of lasers for micro-manufacturing and additive manufacturing purposes. The use of laser beam as a tool for manufacturing arises from the need for flexible and rapid manufacturing at a low-to-mid cost. Laser micro-machining provides an advantage over mechanical micro-machining due to the faster production times of large batch sizes and the high costs associated with specific tools. Laser based additive manufacturing enables processing of powder metals for direct and rapid fabrication of products. Therefore, laser processing can be viewed as a fast, flexible, and cost-effective approach compared to traditional manufacturing processes. Two types of laser processing techniques are studied: laser ablation of polymers for micro-channel fabrication and selective laser melting of metal powders. Initially, a feasibility study for laser-based micro-channel fabrication of poly(dimethylsiloxane) (PDMS) via experimentation is presented. In particular, the effectiveness of utilizing a nanosecond-pulsed laser as the energy source for laser ablation is studied. The results are analyzed statistically and a relationship between process parameters and micro-channel dimensions is established. Additionally, a process model is introduced for predicting channel depth. Model outputs are compared and analyzed to experimental results. The second part of this research focuses on a physics-based FEM approach for predicting the temperature profile and melt pool geometry in selective laser melting (SLM) of metal powders. Temperature profiles are calculated for a moving laser heat source to understand the temperature rise due to heating during SLM. Based on the predicted temperature distributions, melt pool geometry, i.e. the locations at which melting of the powder material occurs, is determined. Simulation results are compared against data obtained from experimental Inconel 625 test coupons fabricated at the National Institute for Standards & Technology via response surface methodology techniques. The main goal of this research is to develop a comprehensive predictive model with which the effect of powder material properties and laser process parameters on the built quality and integrity of SLM-produced parts can be better understood. By optimizing process parameters, SLM as an additive manufacturing technique is not only possible, but also practical and reproducible.

  19. Through-wafer optical probe characterization for microelectromechanical systems positional state monitoring and feedback control

    NASA Astrophysics Data System (ADS)

    Dawson, Jeremy M.; Chen, Jingdong; Brown, Kolin S.; Famouri, Parviz F.; Hornak, Lawrence A.

    2000-12-01

    Implementation of closed-loop microelectromechanical system (MEMS) control enables mechanical microsystems to adapt to the demands of the environment that they are actuating, opening a broad range of new opportunities for future MEMS applications. Integrated optical microsystems have the potential to enable continuous in situ optical interrogation of MEMS microstructure position fully decoupled from the means of mechanical actuation that is necessary for realization of feedback control. We present the results of initial research evaluating through-wafer optical microprobes for surface micromachined MEMS integrated optical position monitoring. Results from the through-wafer free-space optical probe of a lateral comb resonator fabricated using the multiuser MEMS process service (MUMPS) indicate significant positional information content with an achievable return probe signal dynamic range of up to 80% arising from film transmission contrast. Static and dynamic deflection analysis and experimental results indicate a through-wafer probe positional signal sensitivity of 40 mV/micrometers for the present setup or 10% signal change per micrometer. A simulation of the application of nonlinear sliding control is presented illustrating position control of the lateral comb resonator structure given the availability of positional state information.

  20. Method and apparatus for precision laser micromachining

    DOEpatents

    Chang, Jim; Warner, Bruce E.; Dragon, Ernest P.

    2000-05-02

    A method and apparatus for micromachining and microdrilling which results in a machined part of superior surface quality is provided. The system uses a near diffraction limited, high repetition rate, short pulse length, visible wavelength laser. The laser is combined with a high speed precision tilting mirror and suitable beam shaping optics, thus allowing a large amount of energy to be accurately positioned and scanned on the workpiece. As a result of this system, complicated, high resolution machining patterns can be achieved. A cover plate may be temporarily attached to the workpiece. Then as the workpiece material is vaporized during the machining process, the vapors condense on the cover plate rather than the surface of the workpiece. In order to eliminate cutting rate variations as the cutting direction is varied, a randomly polarized laser beam is utilized. A rotating half-wave plate is used to achieve the random polarization. In order to correctly locate the focus at the desired location within the workpiece, the position of the focus is first determined by monitoring the speckle size while varying the distance between the workpiece and the focussing optics. When the speckle size reaches a maximum, the focus is located at the first surface of the workpiece. After the location of the focus has been determined, it is repositioned to the desired location within the workpiece, thus optimizing the quality of the machined area.

  1. Dual axis operation of a micromachined rate gyroscope

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Juneau, T.; Pisano, A.P.; Smith, J.

    Since micromachining technology has raised the prospect of fabricating high performance sensors without the associated high cost and large size, many researchers have investigated micromachined rate gyroscopes. The vast majority of research has focused on single input axis rate gyroscopes, but this paper presents work on a dual input axis micromachined rate gyroscope. The key to successful simultaneous dual axis operation is the quad symmetry of the circular oscillating rotor design. Untuned gyroscopes with mismatched modes yielded random walk as low as 10{degrees}/{radical}hour with cross sensitivity ranging from 6% to 16%. Mode frequency matching via electrostatic tuning allowed performance bettermore » than 2{degrees}/{radical}hour, but at the expense of excessive cross sensitivity.« less

  2. The laser micro-machining system for diamond anvil cell experiments and general precision machining applications at the High Pressure Collaborative Access Team

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Hrubiak, Rostislav; Sinogeikin, Stanislav; Rod, Eric

    We have designed and constructed a new system for micro-machining parts and sample assemblies used for diamond anvil cells and general user operations at the High Pressure Collaborative Access Team, sector 16 of the Advanced Photon Source. The new micro-machining system uses a pulsed laser of 400 ps pulse duration, ablating various materials without thermal melting, thus leaving a clean edge. With optics designed for a tight focus, the system can machine holes any size larger than 3 μm in diameter. Unlike a standard electrical discharge machining drill, the new laser system allows micro-machining of non-conductive materials such as: amorphousmore » boron and silicon carbide gaskets, diamond, oxides, and other materials including organic materials such as polyimide films (i.e., Kapton). An important feature of the new system is the use of gas-tight or gas-flow environmental chambers which allow the laser micro-machining to be done in a controlled (e.g., inert gas) atmosphere to prevent oxidation and other chemical reactions in air sensitive materials. The gas-tight workpiece enclosure is also useful for machining materials with known health risks (e.g., beryllium). Specialized control software with a graphical interface enables micro-machining of custom 2D and 3D shapes. The laser-machining system was designed in a Class 1 laser enclosure, i.e., it includes laser safety interlocks and computer controls and allows for routine operation. Though initially designed mainly for machining of the diamond anvil cell gaskets, the laser-machining system has since found many other micro-machining applications, several of which are presented here.« less

  3. Technical Digest of the 1998 Summer Topical Meeting on Organic Optics and Optoelectronics

    DTIC Science & Technology

    1998-07-01

    substantially larger voltages (~2x), however, signal distortion and inter- symbol interference due to multiple RF reflections limit their...technology as data page composers. Texas Instrument’s DMD 0-7803-4953-9/98$10.00©1998 IEEE system has already been used in this capacity in several... lithography for fabricating and integrating the heads and sliders. The application of MEMS components and micromachined optical bench packaging techniques

  4. A comparative study of MOEM pressure sensors using MZI, DC, and racetrack resonator IO structures

    NASA Astrophysics Data System (ADS)

    Selvarajan, A.; Pattnaik, Prasant Kumar; Badrinarayana, T.; Srinivas, T.

    2006-03-01

    In recent years micro-electro-mechanical system (MEMS) sensors have drawn considerable attention due to their attraction in terms of miniaturization, batch fabrication and ease of integration with the required electronics circuitry. Micro-opto-electro-mechanical (MOEM) devices and systems, based on the principles of integrated optics and micromachining technology on silicon have immense potential for sensor applications. Employing optical techniques have important advantages such as functionality, large bandwidth and higher sensitivity. Pressure sensing is currently the most lucrative market for solid-state micro sensors. Pressure sensing using micromachined structures utilize the changes induced in either the resistive or capacitive properties of the electro-mechanical structure by the impressed pressure. Integrated optical pressure sensors can utilize the changes to the amplitude, phase, refractive index profile, optical path length, or polarization of the lightwave by the external pressure. In this paper we compare the performance characteristics of three types of MOEM pressure sensors based on Mach-Zehnder Interferometer (MZI), Directional Coupler (DC) and racetrack resonator (RR) integrated optical geometries. The first two configurations measure the pressure changes through a change in optical intensity while the third one measures the same in terms of frequency or wavelength change. The analysis of each sensors has been carried out in terms of mechanical and optical models and their interrelationship through optomechanical coupling. For a typical diaphragm of size 2mm × 1mm × 20 μm, normalized pressure sensitivity of 18.35 μW/mW/kPa, 29.37 μW/mW/kPa and 2.26 pm/kPa in case of MZI, DC and RR devices have been obtained respectively. The noise performance of these devices are also presented.

  5. A batch process micromachined thermoelectric energy harvester: fabrication and characterization

    NASA Astrophysics Data System (ADS)

    Su, J.; Leonov, V.; Goedbloed, M.; van Andel, Y.; de Nooijer, M. C.; Elfrink, R.; Wang, Z.; Vullers, R. J. M.

    2010-10-01

    Micromachined thermopiles are considered as a cost-effective solution for energy harvesters working at a small temperature difference and weak heat flows typical for, e.g., the human body. They can be used for powering autonomous wireless sensor nodes in a body area network. In this paper, a micromachined thermoelectric energy harvester with 6 µm high polycrystalline silicon germanium (poly-SiGe) thermocouples fabricated on a 6 inch wafer is presented. An open circuit voltage of 1.49 V and an output power of 0.4 µW can be generated with 3.5 K temperature difference in a model of a wearable micromachined energy harvester of the discussed design, which has a die size of 1.0 mm × 2.5 mm inside a watch-size generator.

  6. EDITORIAL: The Fourth International Workshop on Microfactories (IWMF'04)

    NASA Astrophysics Data System (ADS)

    Chu, Jiaru; Maeda, Ryutaro

    2005-10-01

    This special section of Journal of Micromechanics and Microengineering is devoted to the fourth International Workshop on Microfactories. After the first three successful Workshops, which took place in Tsukuba, Japan in 1998, Fribourg, Switzerland in 2000 and Minneapolis, USA in 2002, the fourth (IWMF'04) was held in Shanghai, China on 15-17 October 2004. The concept of the `microfactory' and miniaturized production systems was first proposed by the Mechanical Engineering Laboratory in Japan who demonstrated the feasibility of downsizing energy-saving, distributed and eventually environmentally conscious manufacturing systems. There is incredible potential in reducing the physical scale of numerous processes related to the manufacture of many forms of future dense `mechatronic' products and in the manipulation of microscopic and nanoscopic objects and materials for the benefit of mankind. Small systems capable of these operations can be referred to as `microfactories'. A worldwide effort is currently underway to bring such microfactories to fruition. MEMS, MST and micromachines are regarded as synonyms, but they do not necessarily have the same meaning. In particular, differences can be found in their technological approaches. Roughly speaking, research and development in the USA is based primarily on surface or bulk silicon micromachining processes, and the ideal realization of MEMS seems to be the monolithic device. The European approach also focuses on integration between electronics and mechanics but, especially in connection with the development of `µTAS', it also demands the integration of non-mechanical components into the system. In Japan the approaches for MST are said to be rather less focused. Besides the above-mentioned `classical' microsystem technologies, down-scaling of conventional manufacturing methods, or non-silicon based device processing within this field, completely new technological methods are also considered as `microsystem technologies'. Out of more than 150 submitted abstracts, 138 papers were accepted for presentation at the workshop. Of these, a selection of seven high-quality papers have been chosen for presentation in this special section. We would like to express our appreciation of the outstanding efforts made by all involved in the workshop, especially the local committee for all the detailed planning required to make it an interesting meeting.

  7. Silicon micromachined vibrating gyroscopes

    NASA Astrophysics Data System (ADS)

    Voss, Ralf

    1997-09-01

    This work gives an overview of silicon micromachined vibrating gyroscopes. Market perspectives and fields of application are pointed out. The advantage of using silicon micromachining is discussed and estimations of the desired performance, especially for automobiles are given. The general principle of vibrating gyroscopes is explained. Vibrating silicon gyroscopes can be divided into seven classes. for each class the characteristic principle is presented and examples are given. Finally a specific sensor, based on a tuning fork for automotive applications with a sensitivity of 250(mu) V/degrees is described in detail.

  8. Solid polymer electrolyte composite membrane comprising laser micromachined porous support

    DOEpatents

    Liu, Han [Waltham, MA; LaConti, Anthony B [Lynnfield, MA; Mittelsteadt, Cortney K [Natick, MA; McCallum, Thomas J [Ashland, MA

    2011-01-11

    A solid polymer electrolyte composite membrane and method of manufacturing the same. According to one embodiment, the composite membrane comprises a rigid, non-electrically-conducting support, the support preferably being a sheet of polyimide having a thickness of about 7.5 to 15 microns. The support has a plurality of cylindrical pores extending perpendicularly between opposing top and bottom surfaces of the support. The pores, which preferably have a diameter of about 5 microns, are made by laser micromachining and preferably are arranged in a defined pattern, for example, with fewer pores located in areas of high membrane stress and more pores located in areas of low membrane stress. The pores are filled with a first solid polymer electrolyte, such as a perfluorosulfonic acid (PFSA) polymer. A second solid polymer electrolyte, which may be the same as or different than the first solid polymer electrolyte, may be deposited over the top and/or bottom of the first solid polymer electrolyte.

  9. Frontside-micromachined planar piezoresistive vibration sensor: Evaluating performance in the low frequency test range

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Zhang, Lan; Lu, Jian, E-mail: jian-lu@aist.go.jp; Takagi, Hideki

    2014-01-15

    Using a surface piezoresistor diffusion method and front-side only micromachining process, a planar piezoresistive vibration sensor was successfully developed with a simple structure, lower processing cost and fewer packaging difficulties. The vibration sensor had a large sector proof mass attached to a narrow flexure. Optimization of the boron diffusion piezoresistor placed on the edge of the narrow flexure greatly improved the sensitivity. Planar vibration sensors were fabricated and measured in order to analyze the effects of the sensor dimensions on performance, including the values of flexure width and the included angle of the sector. Sensitivities of fabricated planar sensors ofmore » 0.09–0.46 mV/V/g were measured up to a test frequency of 60 Hz. The sensor functioned at low voltages (<3 V) and currents (<1 mA) with a high sensitivity and low drift. At low background noise levels, the sensor had performance comparable to a commercial device.« less

  10. Some aspects of precise laser machining - Part 2: Experimental

    NASA Astrophysics Data System (ADS)

    Grabowski, Marcin; Wyszynski, Dominik; Ostrowski, Robert

    2018-05-01

    The paper describes the role of laser beam polarization on quality of laser beam machined cutting tool edge. In micromachining the preparation of the cutting tools in play a key role on dimensional accuracy, sharpness and the quality of the cutting edges. In order to assure quality and dimensional accuracy of the cutting tool edge it is necessary to apply laser polarization control. In the research diode pumped Nd:YAG 532nm pulse laser was applied. Laser beam polarization used in the research was linear (horizontal, vertical). The goal of the carried out research was to describe impact of laser beam polarization on efficiency of the cutting process and quality of machined parts (edge, surface) made of polycrystalline diamond (PCD) and cubic boron nitride (cBN). Application of precise cutting tool in micromachining has significant impact on the minimum uncut chip thickness and quality of the parts. The research was carried within the INNOLOT program funded by the National Centre for Research and Development.

  11. Arrays of Carbon Nanotubes as RF Filters in Waveguides

    NASA Technical Reports Server (NTRS)

    Hoppe, Daniel; Hunt, Brian; Hoenk, Michael; Noca, Flavio; Xu, Jimmy

    2003-01-01

    Brushlike arrays of carbon nanotubes embedded in microstrip waveguides provide highly efficient (high-Q) mechanical resonators that will enable ultraminiature radio-frequency (RF) integrated circuits. In its basic form, this invention is an RF filter based on a carbon nanotube array embedded in a microstrip (or coplanar) waveguide, as shown in Figure 1. In addition, arrays of these nanotube-based RF filters can be used as an RF filter bank. Applications of this new nanotube array device include a variety of communications and signal-processing technologies. High-Q resonators are essential for stable, low-noise communications, and radar applications. Mechanical oscillators can exhibit orders of magnitude higher Qs than electronic resonant circuits, which are limited by resistive losses. This has motivated the development of a variety of mechanical resonators, including bulk acoustic wave (BAW) resonators, surface acoustic wave (SAW) resonators, and Si and SiC micromachined resonators (known as microelectromechanical systems or MEMS). There is also a strong push to extend the resonant frequencies of these oscillators into the GHz regime of state-of-the-art electronics. Unfortunately, the BAW and SAW devices tend to be large and are not easily integrated into electronic circuits. MEMS structures have been integrated into circuits, but efforts to extend MEMS resonant frequencies into the GHz regime have been difficult because of scaling problems with the capacitively-coupled drive and readout. In contrast, the proposed devices would be much smaller and hence could be more readily incorporated into advanced RF (more specifically, microwave) integrated circuits.

  12. Micromachined silicon electrostatic chuck

    DOEpatents

    Anderson, R.A.; Seager, C.H.

    1996-12-10

    An electrostatic chuck is faced with a patterned silicon plate, created by micromachining a silicon wafer, which is attached to a metallic base plate. Direct electrical contact between the chuck face (patterned silicon plate`s surface) and the silicon wafer it is intended to hold is prevented by a pattern of flat-topped silicon dioxide islands that protrude less than 5 micrometers from the otherwise flat surface of the chuck face. The islands may be formed in any shape. Islands may be about 10 micrometers in diameter or width and spaced about 100 micrometers apart. One or more concentric rings formed around the periphery of the area between the chuck face and wafer contain a low-pressure helium thermal-contact gas used to assist heat removal during plasma etching of a silicon wafer held by the chuck. The islands are tall enough and close enough together to prevent silicon-to-silicon electrical contact in the space between the islands, and the islands occupy only a small fraction of the total area of the chuck face, typically 0.5 to 5 percent. The pattern of the islands, together with at least one hole bored through the silicon veneer into the base plate, will provide sufficient gas-flow space to allow the distribution of the helium thermal-contact gas. 6 figs.

  13. Method for forming suspended micromechanical structures

    DOEpatents

    Fleming, James G.

    2000-01-01

    A micromachining method is disclosed for forming a suspended micromechanical structure from {111} crystalline silicon. The micromachining method is based on the use of anisotropic dry etching to define lateral features of the structure which are etched down into a {111}-silicon substrate to a first etch depth, thereby forming sidewalls of the structure. The sidewalls are then coated with a protection layer, and the substrate is dry etched to a second etch depth to define a spacing of the structure from the substrate. A selective anisotropic wet etchant (e.g. KOH, EDP, TMAH, NaOH or CsOH) is used to laterally undercut the structure between the first and second etch depths, thereby forming a substantially planar lower surface of the structure along a {111} crystal plane that is parallel to an upper surface of the structure. The lateral extent of undercutting by the wet etchant is controlled and effectively terminated by either timing the etching, by the location of angled {111}-silicon planes or by the locations of preformed etch-stops. This present method allows the formation of suspended micromechanical structures having large vertical dimensions and large masses while allowing for detailed lateral features which can be provided by dry etch definition. Additionally, the method of the present invention is compatible with the formation of electronic circuitry on the substrate.

  14. Micromachined cutting blade formed from {211}-oriented silicon

    DOEpatents

    Fleming, James G.; Sniegowski, Jeffry J.; Montague, Stephen

    2003-09-09

    A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle .theta. of 19.5.degree.. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

  15. Micromachined cutting blade formed from {211}-oriented silicon

    DOEpatents

    Fleming, James G [Albuquerque, NM; Fleming, legal representative, Carol; Sniegowski, Jeffry J [Tijeras, NM; Montague, Stephen [Albuquerque, NM

    2011-08-09

    A cutting blade is disclosed fabricated of micromachined silicon. The cutting blade utilizes a monocrystalline silicon substrate having a {211} crystalline orientation to form one or more cutting edges that are defined by the intersection of {211} crystalline planes of silicon with {111} crystalline planes of silicon. This results in a cutting blade which has a shallow cutting-edge angle .theta. of 19.5.degree.. The micromachined cutting blade can be formed using an anisotropic wet etching process which substantially terminates etching upon reaching the {111} crystalline planes of silicon. This allows multiple blades to be batch fabricated on a common substrate and separated for packaging and use. The micromachined cutting blade, which can be mounted to a handle in tension and optionally coated for increased wear resistance and biocompatibility, has multiple applications including eye surgery (LASIK procedure).

  16. Techniques For Mass Production Of Tunneling Electrodes

    NASA Technical Reports Server (NTRS)

    Kenny, Thomas W.; Podosek, Judith A.; Reynolds, Joseph K.; Rockstad, Howard K.; Vote, Erika C.; Kaiser, William J.

    1993-01-01

    Techniques for mass production of tunneling electrodes developed from silicon-micromachining, lithographic patterning, and related microfabrication processes. Tunneling electrodes named because electrons travel between them by quantum-mechanical tunneling; tunneling electrodes integral parts of tunneling transducer/sensors, which act in conjunction with feedback circuitry to stabilize tunneling currents by maintaining electrode separations of order of 10 Angstrom. Essential parts of scanning tunneling microscopes and related instruments, and used as force and position transducers in novel microscopic accelerometers and infrared detectors.

  17. A Si/Glass Bulk-Micromachined Cryogenic Heat Exchanger for High Heat Loads: Fabrication, Test, and Application Results.

    PubMed

    Zhu, Weibin; White, Michael J; Nellis, Gregory F; Klein, Sanford A; Gianchandani, Yogesh B

    2010-02-01

    This paper reports on a micromachined Si/glass stack recuperative heat exchanger with in situ temperature sensors. Numerous high-conductivity silicon plates with integrated platinum resistance temperature detectors (Pt RTDs) are stacked, alternating with low-conductivity Pyrex spacers. The device has a 1 x 1-cm(2) footprint and a length of up to 3.5 cm. It is intended for use in Joule-Thomson (J-T) coolers and can sustain pressure exceeding 1 MPa. Tests at cold-end inlet temperatures of 237 K-252 K show that the heat exchanger effectiveness is 0.9 with 0.039-g/s helium mass flow rate. The integrated Pt RTDs present a linear response of 0.26%-0.30%/K over an operational range of 205 K-296 K but remain usable at lower temperatures. In self-cooling tests with ethane as the working fluid, a J-T system with the heat exchanger drops 76.1 K below the inlet temperature, achieving 218.7 K for a pressure of 835.8 kPa. The system reaches 200 K in transient state; further cooling is limited by impurities that freeze within the flow stream. In J-T self-cooling tests with an external heat load, the system reaches 239 K while providing 1 W of cooling. In all cases, there is an additional parasitic heat load estimated at 300-500 mW.

  18. A novel electron tunneling infrared detector

    NASA Technical Reports Server (NTRS)

    Kenny, T. W.; Waltman, S. B.; Reynolds, J. K.; Kaiser, W. J.

    1990-01-01

    The pneumatic infrared detector, originally developed by Golay in the late 1940s, uses the thermal expansion of one cm(exp 3) of xenon at room temperature to detect the heat deposited by infrared radiation. This detector was limited by thermal fluctuations within a 10 Hz bandwidth, but suffered from long thermal time constants and a fragile structure. Nevertheless, it represents the most sensitive room temperature detector currently available in the long wavelength infrared (LWIR). Fabrication of this type of detector on smaller scales has been limited by the lack of a suitably sensitive transducer. Researchers designed a detector based on this principle, but which is constructed entirely from micromachined silicon, and uses a vacuum tunneling transducer to detect the expansion of the trapped gas. Because this detector is fabricated using micromachining techniques, miniaturization and integration into one and two-dimensional arrays is feasible. The extreme sensitivity of vacuum tunneling to changes in electrode separation will allow a prototype of this detector to operate in the limit of thermal fluctuations over a 10 kHz bandwidth. A calculation of the predicted response and noise of the prototype is presented with the general formalism of thermal detectors. At present, most of the components of the prototype have been fabricated and tested independently. In particular, a characterization of the micromachined electron tunneling transducer has been carried out. The measured noise in the tunnel current is within a decade of the limit imposed by shot noise, and well below the requirements for the operation of an infrared detector with the predicted sensitivity. Assembly and characterization of the prototype infrared detector will be carried out promptly.

  19. A Micromachined Capacitive Pressure Sensor Using a Cavity-Less Structure with Bulk-Metal/Elastomer Layers and Its Wireless Telemetry Application

    PubMed Central

    Takahata, Kenichi; Gianchandani, Yogesh B.

    2008-01-01

    This paper reports a micromachined capacitive pressure sensor intended for applications that require mechanical robustness. The device is constructed with two micromachined metal plates and an intermediate polymer layer that is soft enough to deform in a target pressure range. The plates are formed of micromachined stainless steel fabricated by batch-compatible micro-electro-discharge machining. A polyurethane room-temperature-vulcanizing liquid rubber of 38-μm thickness is used as the deformable material. This structure eliminates both the vacuum cavity and the associated lead transfer challenges common to micromachined capacitive pressure sensors. For frequency-based interrogation of the capacitance, passive inductor-capacitor tanks are fabricated by combining the capacitive sensor with an inductive coil. The coil has 40 turns of a 127-μm-diameter copper wire. Wireless sensing is demonstrated in liquid by monitoring the variation in the resonant frequency of the tank via an external coil that is magnetically coupled with the tank. The sensitivity at room temperature is measured to be 23-33 ppm/KPa over a dynamic range of 340 KPa, which is shown to match a theoretical estimation. Temperature dependence of the tank is experimentally evaluated. PMID:27879824

  20. 31-mode piezoelectric micromachined ultrasonic transducer with PZT thick film by granule spraying in vacuum process

    NASA Astrophysics Data System (ADS)

    Jung, Joontaek; Annapureddy, Venkateswarlu; Hwang, Geon-Tae; Song, Youngsup; Lee, Wonjun; Kang, Woojin; Ryu, Jungho; Choi, Hongsoo

    2017-05-01

    A piezoelectric micromachined ultrasonic transducer (pMUT) is an ideal device for portable medical diagnosis systems, intravascular ultrasound systems, and ultrasonic cameras because of its favorable characteristics including small size, acoustic impedance matching with the body, low power consumption, and simple integration with the systems. Despite these advantages, practical applications are limited because of insufficient acoustic pressure of the pMUT caused by the thin active piezoelectric layer. Here, we report the fabrication of a thick piezoelectric Pb(Zr,Ti)O3 (PZT) film-based pMUT device having high deflection at low driving voltage using the granule spraying in vacuum (GSV) process. Pre-patterned high-density thick (exceeding 8 μm) PZT films were grown on 6-inch-diameter Si/SiO2/Ti/Pt silicon-on-insulator wafers at room temperature at a high deposition rate of ˜5 μm min-1. The fabrication process using the proposed GSV process was simple and fast, and the deflection of the pMUT exhibited a high value of 0.8 μm.

  1. Laser micromachining as a metallization tool for microfluidic polymer stacks

    NASA Astrophysics Data System (ADS)

    Brettschneider, T.; Dorrer, C.; Czurratis, D.; Zengerle, R.; Daub, M.

    2013-03-01

    A novel assembly approach for the integration of metal structures into polymeric microfluidic systems is described. The presented production process is completely based on a single solid-state laser source, which is used to incorporate metal foils into a polymeric multi-layer stack by laser bonding and ablation processes. Chemical reagents or glues are not required. The polymer stack contains a flexible membrane which can be used for realizing microfluidic valves and pumps. The metal-to-polymer bond was investigated for different metal foils and plasma treatments, yielding a maximum peel strength of Rps = 1.33 N mm-1. A minimum structure size of 10 µm was determined by 3D microscopy of the laser cut line. As an example application, two different metal foils were used in combination to micromachine a standardized type-T thermocouple on a polymer substrate. An additional laser process was developed which allows metal-to-metal welding in close vicinity to the polymer substrate. With this process step, the reliability of the electrical contact could be increased to survive at least 400 PCR temperature cycles at very low contact resistances.

  2. Thermal Switch for Satellite Temperature Control

    NASA Technical Reports Server (NTRS)

    Ziad, H.; Slater, T.; vanGerwen, P.; Masure, E.; Preudhomme, F.; Baert, K.

    1995-01-01

    An active radiator tile (ART) thermal valve has been fabricated using silicon micromachining. Intended for orbital satellite heat control applications, the operational principal of the ART is to control heat flow between two thermally isolated surfaces by bring the surfaces into intimate mechanical contact using electrostatic actuation. Prototype devices have been tested in a vacuum and demonstrate thermal actuation voltages as low as 40 volts, very good thermal insulation in the OFF state, and a large increase in radiative heat flow in the ON state. Thin, anodized aluminum was developed as a coating for high infrared emissivity and high solar reflectance.

  3. Micromachined electrostatic vertical actuator

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Lee, Abraham P.; Sommargren, Gary E.; McConaghy, Charles F.

    A micromachined vertical actuator utilizing a levitational force, such as in electrostatic comb drives, provides vertical actuation that is relatively linear in actuation for control, and can be readily combined with parallel plate capacitive position sensing for position control. The micromachined electrostatic vertical actuator provides accurate movement in the sub-micron to micron ranges which is desirable in the phase modulation instrument, such as optical phase shifting. For example, compact, inexpensive, and position controllable micromirrors utilizing an electrostatic vertical actuator can replace the large, expensive, and difficult-to-maintain piezoelectric actuators. A thirty pound piezoelectric actuator with corner cube reflectors, as utilized inmore » a phase shifting diffraction interferometer can be replaced with a micromirror and a lens. For any very precise and small amplitudes of motion` micromachined electrostatic actuation may be used because it is the most compact in size, with low power consumption and has more straightforward sensing and control options.« less

  4. Micromachined electrostatic vertical actuator

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Lee, A.P.; Sommargren, G.E.; McConaghy, C.F.

    A micromachined vertical actuator utilizing a levitational force, such as in electrostatic comb drives, provides vertical actuation that is relatively linear in actuation for control, and can be readily combined with parallel plate capacitive position sensing for position control. The micromachined electrostatic vertical actuator provides accurate movement in the sub-micron to micron ranges which is desirable in the phase modulation instrument, such as optical phase shifting. For example, compact, inexpensive, and position controllable micromirrors utilizing an electrostatic vertical actuator can replace the large, expensive, and difficult-to-maintain piezoelectric actuators. A thirty pound piezoelectric actuator with corner cube reflectors, as utilized inmore » a phase shifting diffraction interferometer can be replaced with a micromirror and a lens. For any very precise and small amplitudes of motion, micromachined electrostatic actuation may be used because it is the most compact in size, with low power consumption and has more straightforward sensing and control options.« less

  5. Estimation of tool wear compensation during micro-electro-discharge machining of silicon using process simulation

    NASA Astrophysics Data System (ADS)

    Muralidhara, .; Vasa, Nilesh J.; Singaperumal, M.

    2010-02-01

    A micro-electro-discharge machine (Micro EDM) was developed incorporating a piezoactuated direct drive tool feed mechanism for micromachining of Silicon using a copper tool. Tool and workpiece materials are removed during Micro EDM process which demand for a tool wear compensation technique to reach the specified depth of machining on the workpiece. An in-situ axial tool wear and machining depth measurement system is developed to investigate axial wear ratio variations with machining depth. Stepwise micromachining experiments on silicon wafer were performed to investigate the variations in the silicon removal and tool wear depths with increase in tool feed. Based on these experimental data, a tool wear compensation method is proposed to reach the desired depth of micromachining on silicon using copper tool. Micromachining experiments are performed with the proposed tool wear compensation method and a maximum workpiece machining depth variation of 6% was observed.

  6. The Laser MicroJet (LMJ): a multi-solution technology for high quality micro-machining

    NASA Astrophysics Data System (ADS)

    Mai, Tuan Anh; Richerzhagen, Bernold; Snowdon, Paul C.; Wood, David; Maropoulos, Paul G.

    2007-02-01

    The field of laser micromachining is highly diverse. There are many different types of lasers available in the market. Due to their differences in irradiating wavelength, output power and pulse characteristic they can be selected for different applications depending on material and feature size [1]. The main issues by using these lasers are heat damages, contamination and low ablation rates. This report examines on the application of the Laser MicroJet(R) (LMJ), a unique combination of a laser beam with a hair-thin water jet as a universal tool for micro-machining of MEMS substrates, as well as ferrous and non-ferrous materials. The materials include gallium arsenide (GaAs) & silicon wafers, steel, tantalum and alumina ceramic. A Nd:YAG laser operating at 1064 nm (infra red) and frequency doubled 532 nm (green) were employed for the micro-machining of these materials.

  7. Wear-reducing Surface Functionalization of Implant Materials Using Ultrashort Laser Pulses

    NASA Astrophysics Data System (ADS)

    Oldorf, P.; Peters, R.; Reichel, S.; Schulz, A.-P.; Wendlandt, R.

    The aim of the project called "EndoLas" is the development of a reproducible and reliable method for a functionalization of articulating surfaces on hip joint endoprostheses due to a reduction of abrasion and wear by the generation of micro structures using ultrashort laser pulses. On the one hand, the microstructures shall ensure the capture of abraded particles, which cause third-body wear and thereby increase aseptic loosening. On the other hand, the structures shall improve or maintain the tribologically important lubricating film. Thereby, the cavities serve as a reservoir for the body's own synovial fluid. The dry friction, which promotes abrasion and is a part of the mixed friction in the joint, shall therefore be reduced. In experimental setups it was shown, that the abrasive wear can be reduced significantly due to micro-structuring the articulating implant surfaces. To shape the fine and deterministic cavities on the surfaces, an ultra-short pulsed laser, which is integrated in a high-precision, 5-axes micro-machining system, was used. The laser system, based on an Yb:YAG thin-disk regenerative amplifier, has an average output power of 50 W at the fundamental wavelength of 1030 nm, a maximum repetition rate of 400 kHz and a pulse duration of 6 ps. Due to this, a maximum pulse energy of 125 μJ is achievable. Furthermore external second and third harmonic generation enables the usage of wavelengths in the green and violet spectral range.

  8. Effect of Axial Force on the Performance of Micromachined Vibratory Rate Gyroscopes

    PubMed Central

    Hou, Zhanqiang; Xiao, Dingbang; Wu, Xuezhong; Dong, Peitao; Chen, Zhihua; Niu, Zhengyi; Zhang, Xu

    2011-01-01

    It is reported in the published literature that the resonant frequency of a silicon micromachined gyroscope decreases linearly with increasing temperature. However, when the axial force is considerable, the resonant frequency might increase as the temperature increases. The axial force is mainly induced by thermal stress due to the mismatch between the thermal expansion coefficients of the structure and substrate. In this paper, two types of micromachined suspended vibratory gyroscopes with slanted beams were proposed to evaluate the effect of the axial force. One type was suspended with a clamped-free (C-F) beam and the other one was suspended with a clamped-clamped (C-C) beam. Their drive modes are the bending of the slanted beam, and their sense modes are the torsion of the slanted beam. The relationships between the resonant frequencies of the two types were developed. The prototypes were packaged by vacuum under 0.1 mbar and an analytical solution for the axial force effect on the resonant frequency was obtained. The temperature dependent performances of the operated mode responses of the micromachined gyroscopes were measured. The experimental values of the temperature coefficients of resonant frequencies (TCF) due to axial force were 101.5 ppm/°C for the drive mode and 21.6 ppm/°C for the sense mode. The axial force has a great influence on the modal frequency of the micromachined gyroscopes suspended with a C-C beam, especially for the flexure mode. The quality factors of the operated modes decreased with increasing temperature, and changed drastically when the micromachined gyroscopes worked at higher temperatures. PMID:22346578

  9. Design and Analysis of a Micromechanical Three-Component Force Sensor for Characterizing and Quantifying Surface Roughness

    NASA Astrophysics Data System (ADS)

    Liang, Q.; Wu, W.; Zhang, D.; Wei, B.; Sun, W.; Wang, Y.; Ge, Y.

    2015-10-01

    Roughness, which can represent the trade-off between manufacturing cost and performance of mechanical components, is a critical predictor of cracks, corrosion and fatigue damage. In order to measure polished or super-finished surfaces, a novel touch probe based on three-component force sensor for characterizing and quantifying surface roughness is proposed by using silicon micromachining technology. The sensor design is based on a cross-beam structure, which ensures that the system possesses high sensitivity and low coupling. The results show that the proposed sensor possesses high sensitivity, low coupling error, and temperature compensation function. The proposed system can be used to investigate micromechanical structures with nanometer accuracy.

  10. Waveguide device and method for making same

    DOEpatents

    Forman, Michael A [San Francisco, CA

    2007-08-14

    A monolithic micromachined waveguide device or devices with low-loss, high-power handling, and near-optical frequency ranges is set forth. The waveguide and integrated devices are capable of transmitting near-optical frequencies due to optical-quality sidewall roughness. The device or devices are fabricated in parallel, may be mass produced using a LIGA manufacturing process, and may include a passive component such as a diplexer and/or an active capping layer capable of particularized signal processing of the waveforms propagated by the waveguide.

  11. Analytical Performance of a Venturi-assisted Array of Micromachined UltraSonic Electrosprays (AMUSE) Coupled to Ion Trap Mass Spectrometry for the Analysis of Peptides and Proteins

    PubMed Central

    Hampton, Christina Y.; Forbes, Thomas P.; Varady, Mark J.; Meacham, J. Mark; Fedorov, Andrei G.; Degertekin, F. Levent; Fernández, Facundo M.

    2008-01-01

    The analytical characterization of a novel ion source for mass spectrometry named Array of Micromachined UltraSonic Electrosprays (AMUSE) is presented here. This is a fundamentally different type of ion generation device, consisting of three major components: 1) a piezoelectric transducer that creates ultrasonic waves at one of the resonant frequencies of the sample-filled device, 2) an array of pyramidally-shaped nozzles micromachined on a silicon wafer, and 3) a spacer which prevents contact between the array and transducer ensuring the transfer of acoustic energy to the sample. A high pressure gradient generated at the apices of the nozzle pyramids forces the periodic ejection of multiple droplet streams from the device. With this device, the processes of droplet formation and droplet charging are separated, hence, the limitations of conventional electrospray-type ion sources, including the need for high charging potentials and the addition of organic solvent to decrease surface tension can be avoided. In this work, a Venturi device is coupled with AMUSE in order to increase desolvation, droplet focusing, and signal stability. Results show that ionization of model peptides and small tuning molecules is possible with DC charging potentials of 100 VDC or less. Ionization in RF-only mode (without DC biasing) was also possible. It was observed that, when combined with AMUSE, the Venturi device provides a 10-fold gain in signal-to-noise ratio for 90% aqueous sample solutions. Further reduction in the diameter of the orifices of the micromachined arrays, led to an additional signal gain of at least 3 orders of magnitude, a 2- to 10-fold gain in the signal-to-noise ratio, and an improvement in signal stability from 47% to 8.5% RSD. The effectiveness of this device for the soft ionization of model proteins in aqueous media, such as cytochrome C was also examined, yielding spectra with an average charge state of 8.8 when analyzed with a 100 VDC charging potential. Ionization of model proteins was also possible in RF-only mode. PMID:17914864

  12. Miniature silicon electronic biological assay chip and applications for rapid battlefield diagnostics

    NASA Astrophysics Data System (ADS)

    Cunningham, Brian T.; Regan, Robert A.; Clapp, Christopher; Hildebrant, Eric; Weinberg, Marc S.; Williams, John

    1999-07-01

    Assessing the medical condition of battlefield personnel requires the development of rapid, portable biological diagnostic assays for a wide variety of antigens and enzymes. Ideally, such an assay would be inexpensive, small, and require no added reagents while maintaining the sensitivity and accuracy of laboratory-based assays. In this work, a microelectromechanical (MEMS) based biological assay sensor is presented which is expected to meet the above requirements. The sensor is a thin silicon membrane resonator (SMR) which registers a decrease in resonant frequency when mass is adsorbed onto its surface. By coating the sensor surface with a monolayer of antibody, for example, we have detected the corresponding antigen with a detection resolution of 0.25 ng/ml in phosphate buffer solution. Micromachining techniques are being used to integrate many (64 elements on the first test chip) identical SMR sensors into a single silicon chip which would be capable of simultaneously performing a wide variety of biomedical assays. The sensors require only a small printed circuit board and 8V power supply to operate and provide a readout. The presentation will describe the operation of the SMR sensor, the fabrication of the sensor array, and initial test results using commercially available animal immunoglobulins in laboratory-prepared test solutions.

  13. Microfluidic systems with embedded materials and structures and method thereof

    DOEpatents

    Morse, Jeffrey D [Martinez, CA; Rose, Klint A [Boston, MA; Maghribi, Mariam [Livermore, CA; Benett, William [Livermore, CA; Krulevitch, Peter [Pleasanton, CA; Hamilton, Julie [Tracy, CA; Graff, Robert T [Modesto, CA; Jankowski, Alan [Livermore, CA

    2007-03-06

    Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.

  14. Development of a novel translation micromirror for adaptive optics

    NASA Astrophysics Data System (ADS)

    He, Siyuan; Ben Mrad, Ridha

    2003-10-01

    Conventional translation micromirrors for adaptive optics use attractive electrostatic force and therefore have two limitations: 1) the stroke is limited to less than one third of the initial gap distance between the mirror plate and the substrate. Normally the stroke is in the range of submicrometers; 2) stiction happens during operation. A novel translation micromirror, which uses a repulsive electrostatic force, is presented in this paper. This novel translation micromirror completely overcomes the limitations associated with conventional translation micromirrors and its stroke is not limited by the initial gap distance between the mirror plate and the substrate and therefore is able to achieve a much larger vertical stroke to modulate lights over a wider spectrum than that achieved by conventional translation micromirrors. The novel translation micromirror has no stiction problem and is highly compatible with mature surface micromachining technology. An analytical model is derived for the novel translation micromirror and prototypes are fabricated. The prototype of the novel translation micromirror, which is deliberately not optimized so it could be fabricated using MUMPS, achieved a vertical stroke of 1.75μm using a driving voltage of 50 volts, which is three times the stroke of conventional MUMPS translation micromirrors. It is expected that if standard surface micromachining is used instead of MUMPs, the design of the novel translation micromirror can be optimized and a much larger vertical stroke can be achieved.

  15. Functionalised polyurethane for efficient laser micromachining

    NASA Astrophysics Data System (ADS)

    Brodie, G. W. J.; Kang, H.; MacMillan, F. J.; Jin, J.; Simpson, M. C.

    2017-02-01

    Pulsed laser ablation is a valuable tool that offers a much cleaner and more flexible etching process than conventional lithographic techniques. Although much research has been undertaken on commercially available polymers, many challenges still remain, including contamination by debris on the surface, a rough etched appearance and high ablation thresholds. Functionalizing polymers with a photosensitive group is a novel way and effective way to improve the efficiency of laser micromachining. In this study, several polyurethane films grafted with different concentrations of the chromophore anthracene have been synthesized which are specifically designed for 248 nm KrF excimer laser ablation. A series of lines etched with a changing number of pulses and fluences by the nanosecond laser were applied to each polyurethane film. The resultant ablation behaviours were studied through optical interference tomography and Scanning Electron Microscopy. The anthracene grafted polyurethanes showed a vast improvement in both edge quality and the presence of debris compared with the unmodified polyurethane. Under the same laser fluence and number of pulses the spots etched in the anthracene contained polyurethane show sharp depth profiles and smooth surfaces, whereas the spots etched in polyurethane without anthracene group grafted present rough cavities with debris according to the SEM images. The addition of a small amount of anthracene (1.47%) shows a reduction in ablation threshold from unmodified polyurethane showing that the desired effect can be achieved with very little modification to the polymer.

  16. Underwater femtosecond laser micromachining of thin nitinol tubes for medical coronary stent manufacture

    NASA Astrophysics Data System (ADS)

    Muhammad, Noorhafiza; Li, Lin

    2012-06-01

    Microprofiling of medical coronary stents has been dominated by the use of Nd:YAG lasers with pulse lengths in the range of a few milliseconds, and material removal is based on the melt ejection with a high-pressure gas. As a result, recast and heat-affected zones are produced, and various post-processing procedures are required to remove these defects. This paper reports a new approach of machining stents in submerged conditions using a 100-fs pulsed laser. A comparison is given of dry and underwater femtosecond laser micromachining techniques of nickel-titanium alloy (nitinol) typically used as the material for coronary stents. The characteristics of laser interactions with the material have been studied. A femtosecond Ti:sapphire laser system (wavelength of 800 nm, pulse duration of 100 fs, repetition rate of 1 kHz) was used to perform the cutting process. It is observed that machining under a thin water film resulted in no presence of heat-affected zone, debris, spatter or recast with fine-cut surface quality. At the optimum parameters, the results obtained with dry cutting showed nearly the same cut surface quality as with cutting under water. However, debris and recast formation still appeared on the dry cut, which is based on material vaporization. Physical processes involved during the cutting process in a thin water film, i.e. bubble formation and shock waves, are discussed.

  17. Micromachined silicon electrostatic chuck

    DOEpatents

    Anderson, Robert A.; Seager, Carleton H.

    1996-01-01

    An electrostatic chuck is faced with a patterned silicon plate 11, created y micromachining a silicon wafer, which is attached to a metallic base plate 13. Direct electrical contact between the chuck face 15 (patterned silicon plate's surface) and the silicon wafer 17 it is intended to hold is prevented by a pattern of flat-topped silicon dioxide islands 19 that protrude less than 5 micrometers from the otherwise flat surface of the chuck face 15. The islands 19 may be formed in any shape. Islands may be about 10 micrometers in diameter or width and spaced about 100 micrometers apart. One or more concentric rings formed around the periphery of the area between the chuck face 15 and wafer 17 contain a low-pressure helium thermal-contact gas used to assist heat removal during plasma etching of a silicon wafer held by the chuck. The islands 19 are tall enough and close enough together to prevent silicon-to-silicon electrical contact in the space between the islands, and the islands occupy only a small fraction of the total area of the chuck face 15, typically 0.5 to 5 percent. The pattern of the islands 19, together with at least one hole 12 bored through the silicon veneer into the base plate, will provide sufficient gas-flow space to allow the distribution of the helium thermal-contact gas.

  18. Curve micromachining on the edges of nitinol biliary stent by ultrashort pulses laser

    NASA Astrophysics Data System (ADS)

    Hung, Chia-Hung; Chang, Fuh-Yu

    2017-05-01

    In this study, a curve micromaching process on the edges of nitinol biliary stent was proposed by a femtosecond laser system with a galvano-mirror scanner. Furthermore, the outer diameter of nitinol tube was 5.116 mm, its inner diameter was 4.648 mm, and its length was 100 mm. The initial fabricated results of nitinol biliary stent represented that the edges of nitinol biliary stent were steep and squared by femtosecond laser. However, the results also indicated that if the laser movement path was precisely programmed by utilizing the unique characteristic of Gaussian beam of femtosecond laser with aligning the edges of stent, the radius of edges enhanced significantly from 9 μm to 42.5 μm. As a result, the edges of nitinol biliary stent can be successfully fabricated from squared edges to rounded-shaped edges with precise dimension, clean surface morphology, and minimal heat-affected zone remained. Hence, the nitinol biliary stent, after femtosecond laser micromachining, would not need any further post-process to remove heat-affected zone and the squared edges.

  19. Plastic Deformation of Micromachined Silicon Diaphragms with a Sealed Cavity at High Temperatures

    PubMed Central

    Ren, Juan; Ward, Michael; Kinnell, Peter; Craddock, Russell; Wei, Xueyong

    2016-01-01

    Single crystal silicon (SCS) diaphragms are widely used as pressure sensitive elements in micromachined pressure sensors. However, for harsh environments applications, pure silicon diaphragms are hardly used because of the deterioration of SCS in both electrical and mechanical properties. To survive at the elevated temperature, the silicon structures must work in combination with other advanced materials, such as silicon carbide (SiC) or silicon on insulator (SOI), for improved performance and reduced cost. Hence, in order to extend the operating temperatures of existing SCS microstructures, this work investigates the mechanical behavior of pressurized SCS diaphragms at high temperatures. A model was developed to predict the plastic deformation of SCS diaphragms and was verified by the experiments. The evolution of the deformation was obtained by studying the surface profiles at different anneal stages. The slow continuous deformation was considered as creep for the diaphragms with a radius of 2.5 mm at 600 °C. The occurrence of plastic deformation was successfully predicted by the model and was observed at the operating temperature of 800 °C and 900 °C, respectively. PMID:26861332

  20. Parallel-plate submicron gap formed by micromachined low-density pillars for near-field radiative heat transfer

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ito, Kota, E-mail: kotaito@mosk.tytlabs.co.jp; Research Center for Advanced Science and Technology; Miura, Atsushi

    Near-field radiative heat transfer has been a subject of great interest due to the applicability to thermal management and energy conversion. In this letter, a submicron gap between a pair of diced fused quartz substrates is formed by using micromachined low-density pillars to obtain both the parallelism and small parasitic heat conduction. The gap uniformity is validated by the optical interferometry at four corners of the substrates. The heat flux across the gap is measured in a steady-state and is no greater than twice of theoretically predicted radiative heat flux, which indicates that the parasitic heat conduction is suppressed tomore » the level of the radiative heat transfer or less. The heat conduction through the pillars is modeled, and it is found to be limited by the thermal contact resistance between the pillar top and the opposing substrate surface. The methodology to form and evaluate the gap promotes the near-field radiative heat transfer to various applications such as thermal rectification, thermal modulation, and thermophotovoltaics.« less

  1. Hypersonic force measurements using internal balance based on optical micromachined Fabry-Perot interferometry.

    PubMed

    Qiu, Huacheng; Min, Fu; Zhong, Shaolong; Song, Xin; Yang, Yanguang

    2018-03-01

    Force measurements using wind tunnel balance are necessary for determining a variety of aerodynamic performance parameters, while the harsh environment in hypersonic flows requires that the measurement instrument should be reliable and robust, in against strong electromagnetic interference, high vacuum, or metal (oxide) dusts. In this paper, we demonstrated a three-component internal balance for hypersonic aerodynamic force measurements, using novel optical micromachined Fabry-Perot interferometric (FPI) strain gauges as sensing elements. The FPI gauges were fabricated using Micro-Opto-Electro-Mechanical Systems (MOEMS) surface and bulk fabrication techniques. High-reflectivity coatings are used to form a high-finesse Fabry-Perot cavity, which benefits a high resolution. Antireflective and passivation coatings are used to reduce unwanted interferences. The FPI strain gauge based balance has been calibrated and evaluated in a Mach 5 hypersonic flow. The results are compared with the traditional technique using the foil resistive strain gauge balance, indicating that the proposed balance based on the MOEMS FPI strain gauge is reliable and robust and is potentially suitable for the hypersonic wind tunnel harsh environment.

  2. Apparatus for precision micromachining with lasers

    DOEpatents

    Chang, J.J.; Dragon, E.P.; Warner, B.E.

    1998-04-28

    A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.

  3. Hypersonic force measurements using internal balance based on optical micromachined Fabry-Perot interferometry

    NASA Astrophysics Data System (ADS)

    Qiu, Huacheng; Min, Fu; Zhong, Shaolong; Song, Xin; Yang, Yanguang

    2018-03-01

    Force measurements using wind tunnel balance are necessary for determining a variety of aerodynamic performance parameters, while the harsh environment in hypersonic flows requires that the measurement instrument should be reliable and robust, in against strong electromagnetic interference, high vacuum, or metal (oxide) dusts. In this paper, we demonstrated a three-component internal balance for hypersonic aerodynamic force measurements, using novel optical micromachined Fabry-Perot interferometric (FPI) strain gauges as sensing elements. The FPI gauges were fabricated using Micro-Opto-Electro-Mechanical Systems (MOEMS) surface and bulk fabrication techniques. High-reflectivity coatings are used to form a high-finesse Fabry-Perot cavity, which benefits a high resolution. Antireflective and passivation coatings are used to reduce unwanted interferences. The FPI strain gauge based balance has been calibrated and evaluated in a Mach 5 hypersonic flow. The results are compared with the traditional technique using the foil resistive strain gauge balance, indicating that the proposed balance based on the MOEMS FPI strain gauge is reliable and robust and is potentially suitable for the hypersonic wind tunnel harsh environment.

  4. Apparatus for precision micromachining with lasers

    DOEpatents

    Chang, Jim J.; Dragon, Ernest P.; Warner, Bruce E.

    1998-01-01

    A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialogroaphic sections of machined parts show little (submicron scale) recast layer and heat affected zone.

  5. Zero dead volume tube to surface seal

    DOEpatents

    Benett, William J.; Folta, James A.

    2000-01-01

    A method and apparatus for connecting a tube to a surface that creates a dead volume seal. The apparatus is composed of three components, a body, a ferrule, and a threaded fitting. The ferrule is compressed onto a tube and a seal is formed between the tube and a device retained in the body by threading the fitting into the body which provides pressure that seals the face of the ferrule to a mating surface on the device. This seal can be used at elevated temperatures depending on the materials used. While the invention has been developed for use with micro-machined silicon wafers used in Capillary Gas Chromatograph (GC), it can be utilized anywhere for making a gas or fluid face seal to the surface of a device that has near zero dead volume.

  6. A Si/Glass Bulk-Micromachined Cryogenic Heat Exchanger for High Heat Loads: Fabrication, Test, and Application Results

    PubMed Central

    Zhu, Weibin; White, Michael J.; Nellis, Gregory F.; Klein, Sanford A.; Gianchandani, Yogesh B.

    2010-01-01

    This paper reports on a micromachined Si/glass stack recuperative heat exchanger with in situ temperature sensors. Numerous high-conductivity silicon plates with integrated platinum resistance temperature detectors (Pt RTDs) are stacked, alternating with low-conductivity Pyrex spacers. The device has a 1 × 1-cm2 footprint and a length of up to 3.5 cm. It is intended for use in Joule–Thomson (J–T) coolers and can sustain pressure exceeding 1 MPa. Tests at cold-end inlet temperatures of 237 K–252 K show that the heat exchanger effectiveness is 0.9 with 0.039-g/s helium mass flow rate. The integrated Pt RTDs present a linear response of 0.26%–0.30%/K over an operational range of 205 K–296 K but remain usable at lower temperatures. In self-cooling tests with ethane as the working fluid, a J–T system with the heat exchanger drops 76.1 K below the inlet temperature, achieving 218.7 K for a pressure of 835.8 kPa. The system reaches 200 K in transient state; further cooling is limited by impurities that freeze within the flow stream. In J–T self-cooling tests with an external heat load, the system reaches 239 K while providing 1 W of cooling. In all cases, there is an additional parasitic heat load estimated at 300–500 mW. PMID:20490284

  7. Performance and characterization of new micromachined high-frequency linear arrays.

    PubMed

    Lukacs, Marc; Yin, Jianhua; Pang, Guofeng; Garcia, Richard C; Cherin, Emmanuel; Williams, Ross; Mehi, Jim; Foster, F Stuart

    2006-10-01

    A new approach for fabricating high frequency (> 20 MHz) linear array transducers, based on laser micromachining, has been developed. A 30 MHz, 64-element, 74-microm pitch, linear array design is presented. The performance of the device is demonstrated by comparing electrical and acoustic measurements with analytical, equivalent circuit, and finite-element analysis (FEA) simulations. All FEA results for array performance have been generated using one global set of material parameters. Each fabricated array has been integrated onto a flex circuit for ease of handling, and the flex has been integrated onto a custom printed circuit board test card for ease of testing. For a fully assembled array, with an acoustic lens, the center frequency was 28.7 MHz with a one-way -3 dB and -6 dB bandwidth of 59% and 83%, respectively, and a -20 dB pulse width of -99 ns. The per-element peak acoustic power, for a +/- 30 V single cycle pulse, measured at the 10 mm focal length of the lens was 590 kPa with a -6 dB directivity span of about 30 degrees. The worst-case total cross talk of the combined array and flex assembly is for nearest neighboring elements and was measured to have an average level -40 dB across the -6 dB bandwidth of the device. Any significant deviation from simulation can be explained through limitations in apparatus calibration and in device packaging.

  8. Construction and evaluation of a capillary array DNA sequencer based on a micromachined sheath-flow cuvette.

    PubMed

    Crabtree, H J; Bay, S J; Lewis, D F; Zhang, J; Coulson, L D; Fitzpatrick, G A; Delinger, S L; Harrison, D J; Dovichi, N J

    2000-04-01

    A capillary array electrophoresis DNA sequencer is reported based on a micromachined sheath-flow cuvette as the detection chamber. This cuvette is equipped with a set of micromachined features that hold the capillaries in precise registration to ensure uniform spacing between the capillaries, in order to generate uniform hydrodynamic flow in the cuvette. A laser beam excites all of the samples simultaneously, and a microscope objective images fluorescence onto a set of avalanche photodiodes, which operate in the analog mode. A high-gain transimpedance amplifier is used for each photodiode, providing high duty-cycle detection of fluorescence.

  9. A silicon micromachined resonant pressure sensor

    NASA Astrophysics Data System (ADS)

    Tang, Zhangyang; Fan, Shangchun; Cai, Chenguang

    2009-09-01

    This paper describes the design, fabrication and test of a silicon micromachined resonant pressure sensor. A square membrane and a doubly clamped resonant beam constitute a compound structure. The former senses the pressure directly, while the latter changes its resonant frequency according to deformation of the membrane. The final output relation between the resonant frequency and the applied pressure is deducted according to the structure mechanical properties. Sensors are fabricated by micromachining technology, and then sealed in vaccum. These sensors are tested by open-loop and close-loop system designed on purpose. The experiment results demonstrate that the sensor has a sensitivity of 49.8Hz/kPa and repeatability of 0.08%.

  10. Modeling topology formation during laser ablation

    NASA Astrophysics Data System (ADS)

    Hodapp, T. W.; Fleming, P. R.

    1998-07-01

    Micromachining high aspect-ratio structures can be accomplished through ablation of surfaces with high-powered lasers. Industrial manufacturers now use these methods to form complex and regular surfaces at the 10-1000 μm feature size range. Despite its increasingly wide acceptance on the manufacturing floor, the underlying photochemistry of the ablation mechanism, and hence the dynamics of the machining process, is still a question of considerable debate. We have constructed a computer model to investigate and predict the topological formation of ablated structures. Qualitative as well as quantitative agreement with excimer-laser machined polyimide substrates has been demonstrated. This model provides insights into the drilling process for high-aspect-ratio holes.

  11. Micromachined Artificial Haircell

    NASA Technical Reports Server (NTRS)

    Liu, Chang (Inventor); Engel, Jonathan (Inventor); Chen, Nannan (Inventor); Chen, Jack (Inventor)

    2010-01-01

    A micromachined artificial sensor comprises a support coupled to and movable with respect to a substrate. A polymer, high-aspect ratio cilia-like structure is disposed on and extends out-of-plane from the support. A strain detector is disposed with respect to the support to detect movement of the support.

  12. New optoelectronic methodology for nondestructive evaluation of MEMS at the wafer level

    NASA Astrophysics Data System (ADS)

    Furlong, Cosme; Ferguson, Curtis F.; Melson, Michael J.

    2004-02-01

    One of the approaches to fabrication of MEMS involves surface micromachining to define dies on single crystal silicon wafers, dicing of the wafers to separate the dies, and electronic packaging of the individual dies. Dicing and packaging of MEMS accounts for a large fraction of the fabrication costs, therefore, nondestructive evaluation at the wafer level, before dicing, can have significant implications on improving production yield and costs. In this paper, advances in development of optoelectronic holography (OEH) techniques for nondestructive, noninvasive, full-field of view evaluation of MEMS at the wafer level are described. With OEH techniques, quantitative measurements of shape and deformation of MEMS, as related to their performance and integrity, are obtained with sub-micrometer spatial resolution and nanometer measuring accuracy. To inspect an entire wafer with OEH methodologies, measurements of overlapping regions of interest (ROI) on a wafer are recorded and adjacent ROIs are stitched together through efficient 3D correlation analysis algorithms. Capabilities of the OEH techniques are illustrated with representative applications, including determination of optimal inspection conditions to minimize inspection time while achieving sufficient levels of accuracy and resolution.

  13. Electrothermal piezoresistive cantilever resonators for personal measurements of nanoparticles in workplace exposure

    NASA Astrophysics Data System (ADS)

    Wasisto, Hutomo Suryo; Wu, Wenze; Uhde, Erik; Waag, Andreas; Peiner, Erwin

    2015-05-01

    Low-cost and low-power piezoresistive cantilever resonators with integrated electrothermal heaters are developed to support the sensing module enhancement of the second generation of handheld cantilever-based airborne nanoparticle (NP) detector (CANTOR-2). These sensors are used for direct-reading of exposure to carbon engineered nanoparticles (ENPs) at indoor workplaces. The cantilever structures having various shapes of free ends are created using silicon bulk micromachining technologies (i.e, rectangular, hammer-head, triangular, and U-shaped cantilevers). For a complete wearable CANTOR-2, all components of the proposed detector can be grouped into two main units depending on their packaging placements (i.e., the NP sampler head and the electronics mounted in a handy-format housing). In the NP sampler head, a miniaturized electrophoretic aerosol sampler and a resonant silicon cantilever mass sensor are employed to collect the ENPs from the air stream to the cantilever surfaces and measuring their mass concentration, respectively. After calibration, the detected ENP mass concentrations of CANTOR-2 show a standard deviation from fast mobility particle sizer (FMPS, TSI 3091) of 8-14%.

  14. Shrinking the apparatus size for DNA analysis

    NASA Astrophysics Data System (ADS)

    Zimmer, Klaus-Peter; Braun, Alexander; Kostrzewa, M.

    2001-03-01

    Miniaturization of chemical and/or biological analytical systems requires an innovative design and new manufacturing methods. This includes the fabrication of components or structures, the assembly of these parts, and a testing strategy. The separation of an entire device into a disposable microfluidic system and a multi-use supply unit and housing allows an easy fabrication as well as low cost of operation. A simple, replicated, micro-sized, and disposable unit guarantees the same initial conditions for every analytic cycle, whereas, on the other hand all microfluidic actuators and other key elements can remain outside of the microsystem. In order to drive the implemented passive elements of the microfluidic system by external forces of the base unit, elasticity is a crucial material property. Thus silicone was used as material for the microsystem. A microfluidic system intended for use in DNA analysis employing the principles of the polymerase chain reaction (PCR) is presented. All functional units have been integrated into a complex module using a CAD-program. The 3D-drawing was converted into several machining layers for a direct laser writing CNC-code. A focussed excimer laser beam was used in order to micromachine the negative channel and reservoir system in a polycarbonate slab employing ablative photo-decomposition. Excimer laser micromachining proofed to be an ideal prototyping technique for this purpose with sufficient lateral and depth control. Its rather low throughput was bypassed with an additional hot embossed intermediate positive polyethylene master which, in turn, replicated produces the negative fluidic system in the target material PDMS (polydimethylsiloxane) as an elastomeric material. The components of the fluidic systems have been sealed with flat slabs or other microsystem parts of either PDMS or glass. In either case both parts were exposed to a plasma discharge for some seconds in order to clean, oxidize and activate the surface. This enabled an irreversible seal when two oxidized

  15. New Effective Material Couple--Oxide Ceramic and Carbon Nanotube-- Developed for Aerospace Microsystem and Micromachine Technologies

    NASA Technical Reports Server (NTRS)

    Miyoshi, Kazuhisa; VanderWal, Randall L.; Tomasek, Aaron J.; Sayir, Ali; Farmer, Serene C.

    2004-01-01

    The prime driving force for using microsystem and micromachine technologies in transport vehicles, such as spacecraft, aircraft, and automobiles, is to reduce the weight, power consumption, and volume of components and systems to lower costs and increase affordability and reliability. However, a number of specific issues need to be addressed with respect to using microsystems and micromachines in aerospace applications--such as the lack of understanding of material characteristics; methods for producing and testing the materials in small batches; the limited proven durability and lifetime of current microcomponents, packaging, and interconnections; a cultural change with respect to system designs; and the use of embedded software, which will require new product assurance guidelines. In regards to material characteristics, there are significant adhesion, friction, and wear issues in using microdevices. Because these issues are directly related to surface phenomena, they cannot be scaled down linearly and they become increasingly important as the devices become smaller. When microsystems have contacting surfaces in relative motion, the adhesion and friction affect performance, energy consumption, wear damage, maintenance, lifetime and catastrophic failure, and reliability. Ceramics, for the most part, do not have inherently good friction and wear properties. For example, coefficients of friction in excess of 0.7 have been reported for ceramics and ceramic composite materials. Under Alternate Fuels Foundation Technologies funding, two-phase oxide ceramics developed for superior high-temperature wear resistance in NASA's High Operating Temperature Propulsion Components (HOTPC) project and new two-layered carbon nanotube (CNT) coatings (CNT topcoat/iron bondcoat/quartz substrate) developed in NASA's Revolutionary Aeropropulsion Concepts (RAC) project have been chosen as a materials couple for aerospace applications, including micromachines, in the nanotechnology lubrication task because of their potential for superior friction and wearf properties in air and in an ultrahigh vacuum, spacelike environment. At the NASA Glenn Research Center, two-phase oxide ceramic eutectics, Al2O3/ZrO2(Y2O3), were directionally solidified using the laser-float-zone process, and carbon nanotubes were synthesized within a high-temperature tube furnace at 800 C. Physical vapor deposition was used to coat all quartz substrates with 5-nm-thick iron as catalyst and bondcoat, which formed iron islands resembling droplets and serving as catalyst particles on the quartz. A series of scanning electron micrographs showing multiwalled carbon nanotubes directionally grown as aligned "nanograss" on quartz is presented. Unidirectional sliding friction eperiments were conducted at Glenn with the two-layered CNT coatings in contact with the two-phase Al2O3/ZrO2(Y2O3) eutectics in air and in ultrachigh vacuum. The main criteria for judging the performance of the materials couple for solid lubrication and antistick applications in a space environment were the coefficient of friction and the wear resistance (reciprocal of wear rate), which had to be less than 0.2 and greater than 10(exp 5) N(raised dot)/cubic millimetes, respectively, in ultrahigh vacuum. In air, the coefficient of friction for the CNT coatings in contact with Al2O3/ZrO2 (Y2O3) eutectics was 0.04, one-fourth of that for quartz. In an ultrahigh vacuum, the coefficient of friction for CNT coatings in contact with Al2O3/ZrO2 (Y2O3) was one-third of that for quartz. The two-phase Al2O3/ZrO2 (Y2O3) eutectic coupled with the two-layered CNT coating met the coefficient of friction and wear resistance criteria both in air and in an ultrahigh vacuum, spacelike environment. This material's couple can dramatically improve the stiction (or adhesion), friction, and wear resistance of the contacting surfaces, which are major issues for microdevices and micromachines.

  16. Fabrication and characterization of SU-8-based capacitive micromachined ultrasonic transducer for airborne applications

    NASA Astrophysics Data System (ADS)

    Joseph, Jose; Singh, Shiv Govind; Vanjari, Siva Rama Krishna

    2018-01-01

    We present a successful fabrication and characterization of a capacitive micromachined ultrasonic transducer (CMUT) with SU-8 as the membrane material. The goal of this research is to develop a post-CMOS compatible CMUT that can be monolithically integrated with the CMOS circuitry. The fabrication is based on a simple, three mask process, with all wet etching steps involved so that the device can be realized with minimal laboratory conditions. The maximum temperature involved in the whole process flow was 140°C, and hence, it is post-CMOS compatible. The fabricated device exhibited a resonant frequency of 835 kHz with bandwidth 62 kHz, when characterized in air. The pull-in and snapback characteristics of the device were analyzed. The influence of membrane radius on the center frequency and bandwidth was also experimentally evaluated by fabricating CMUTs with membrane radius varying from 30 to 54 μm with an interval of 4 μm. These devices were vibrating at frequencies from 5.2 to 1.8 MHz with an average Q-factor of 23.41. Acoustic characterization of the fabricated devices was performed in air, demonstrating the applicability of SU-8 CMUTs in airborne applications.

  17. Silicon Micromachining in RF and Photonic Applications

    NASA Technical Reports Server (NTRS)

    Lin, Tsen-Hwang; Congdon, Phil; Magel, Gregory; Pang, Lily; Goldsmith, Chuck; Randall, John; Ho, Nguyen

    1995-01-01

    Texas Instruments (TI) has developed membrane and micromirror devices since the late 1970s. An eggcrate space membrane was used as the spatial light modulator in the early years. Discrete micromirrors supported by cantilever beams created a new era for micromirror devices. Torsional micromirror and flexure-beam micromirror devices were promising for mass production because of their stable supports. TI's digital torsional micromirror device is an amplitude modulator (known as the digital micromirror device (DMD) and is in production development, discussed elsewhere. We also use a torsional device for a 4 x 4 fiber-optic crossbar switch in a 2 cm x 2 cm package. The flexure-beam micromirror device is an analog phase modulator and is considered more efficient than amplitude modulators for use in optical processing systems. TI also developed millimeter-sized membranes for integrated optical switches for telecommunication and network applications. Using a member in radio frequency (RF) switch applications is a rapidly growing area because of the micromechanical device performance in microsecond-switching characteristics. Our preliminary membrane RF switch test structure results indicate promising speed and RF switching performance. TI collaborated with MIT for modeling of metal-based micromachining.

  18. Micromachined devices for interfacing neurons

    NASA Astrophysics Data System (ADS)

    Stieglitz, Thomas; Beutel, Hansjoerg; Blau, Cornelia; Meyer, Joerg-Uwe

    1998-07-01

    Micromachining technologies were established to fabricate microelectrode arrays and devices for interfacing parts of the central or peripheral nervous system. The devices were part of a neural prosthesis that allows simultaneous multichannel recording and multisite stimulation of neurons. Overcoming the brittle mechanics of silicon devices and challenging housing demands close to the nerve we established a process technology to fabricate light-weighted and highly flexible polyimide based devices. Platinum and iridium thin-film electrodes were embedded in the polyimide. With reactive ion etching we got the possibility to simply integrate interconnections and to form nearly arbitrary outer shapes of the devices. We designed multichannel devices with up to 24 electrodes in the shape of plates, hooks and cuffs for different applications. In vitro tests exhibited stable electrode properties and no cytotoxicity of the materials and the devices. Sieve electrodes were chronically implanted in rats to interface the regenerating sciatic nerve. After six months, recordings and stimulation of the nerve via electrodes on the micro-device proved functional reinnervation of the limb. Concentric circular structures were designed for a retina implant for the blind. In preliminary studies in rabbits, evoked potentials in the visual cortex corresponded to stimulation sites of the implant.

  19. Micro-scale heat-exchangers for Joule-Thomson cooling.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Gross, Andrew John

    2014-01-01

    This project focused on developing a micro-scale counter flow heat exchangers for Joule-Thomson cooling with the potential for both chip and wafer scale integration. This project is differentiated from previous work by focusing on planar, thin film micromachining instead of bulk materials. A process will be developed for fabricating all the devices mentioned above, allowing for highly integrated micro heat exchangers. The use of thin film dielectrics provides thermal isolation, increasing efficiency of the coolers compared to designs based on bulk materials, and it will allow for wafer-scale fabrication and integration. The process is intended to implement a CFHX asmore » part of a Joule-Thomson cooling system for applications with heat loads less than 1mW. This report presents simulation results and investigation of a fabrication process for such devices.« less

  20. Microfluidic fuel cell systems with embedded materials and structures and method thereof

    DOEpatents

    Morse, Jeffrey D.; Rose, Klint A; Maghribi, Mariam; Benett, William; Krulevitch, Peter; Hamilton, Julie; Graff, Robert T.; Jankowski, Alan

    2005-07-26

    Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.

  1. Micromachined TWTs for THz Radiation Sources

    NASA Technical Reports Server (NTRS)

    Booske, John H.; vanderWeide, Daniel W.; Kory, Carol L.; Limbach, S.; Downey, Alan (Technical Monitor)

    2001-01-01

    The Terahertz (THz) region of the electromagnetic spectrum (about 300 - 3000 GHz in frequency or about 0.1 - 1 mm free space wavelength) has enormous potential for high-data-rate communications, spectroscopy, astronomy, space research, medicine, biology, surveillance, remote sensing, industrial process control, etc. It has been characterized as the most scientifically rich, yet under-utilized, region of the electromagnetic spectrum. The most critical roadblock to full exploitation of the THz band is lack of coherent radiation sources that are powerful (0.001 - 1.0 W continuous wave), efficient (> 1%), frequency agile (instantaneously tunable over 1% bandwidths or more), reliable, and comparatively inexpensive. To develop vacuum electron device (VED) radiation sources satisfying these requirements, fabrication and packaging approaches must be heavily considered to minimize costs, in addition to the basic interaction physics and circuit design. To minimize size of the prime power supply, beam voltage must be minimized, preferably 10 kV. Solid state sources satisfy the low voltage requirement, but are many orders of magnitude below power, efficiency, and bandwidth requirements. On the other hand, typical fast-wave VED sources in this regime (e.g., gyrotrons, FELs) tend to be large, expensive, high voltage and very high power devices unsuitable for most of the applications cited above. VEDs based on grating or inter-digital (ID) circuits have been researched and developed. However, achieving forward-wave amplifier operation with instantaneous fractional bandwidths > 1% is problematic for these devices with low-energy (< 15 kV) electron beams. Moreover, the interaction impedance is quite low unless the beam-circuit spacing is kept particularly narrow, often leading to significant beam interception. One solution to satisfy the THz source requirements mentioned above is to develop micromachined VEDs, or "micro-VEDs". Among other benefits, micro-machining technologies provide superior high frequency wall conductivity as a result of superior surface smoothness compared with conventional mechanical or electric discharge machining approaches. Micro-VED technologies are already being applied to the development of millimeter-wave klystrons at Stanford Linear Accelerator Center and submillimeter-wave klystrons at the University of Leeds. We are investigating the use of micro-machining technologies to develop THz regime TWTs, with emphasis on folded-waveguide TWTs. The folded-waveguide TWT (FW-TWT) has several features that make it attractive for THz-regime micro-VED applications. It is a relatively simple circuit to design and fabricate, it is amenable to precision pattern replication by micro-machining, and it is has been demonstrated capable of forward-wave amplification with appreciable bandwidth. We are conducting experimental and computational studies of micro-VED FW-TWTs to examine their feasibility for applications at frequencies from 200 - 1000 GHz.

  2. Novel technique for fabrication of multi-layered microcoils in microelectromechanical systems (MEMS) applications

    NASA Astrophysics Data System (ADS)

    Chang, Hung-Pin; Qian, Jiangyuan; Bachman, Mark; Congdon, Philip; Li, Guann-pyng

    2002-07-01

    A novel planarization technique, compressive molding planarization (CMP) is developed for implementation of a multi-layered micro coil device. Applying CMP and other micromachining techniques, a multi-layered micro coil device has been designed and fabricated, and its use in the magnetic micro actuators for hard disk drive applications has been demonstrated, showing that it can produce milli-Newton of magnetic force suitable for driving a micro actuator. The novel CMP technique can be equally applicable in other MEMS devices fabrication to ease the process integration for the complicated structure.

  3. The Constellation-X Focal Plane Microcalorimeter Array: An NTD-Germanium Solution

    NASA Technical Reports Server (NTRS)

    Beeman, J.; Silver, E.; Bandler, S.; Schnopper, H.; Murray, S.; Madden, N.; Landis, D.; Haller, E. E.; Barbera, M.

    2001-01-01

    The hallmarks of Neutron Transmutation Doped (NTD) germanium cryogenic thermistors include high reliability, reproducibility, and long term stability of bulk carrier transport properties. Using micro-machined NTD Ge thermistors with integral 'flying' leads, we can now fabricate two-dimensional arrays that are built up from a series of stacked linear arrays. We believe that this modular approach of building, assembling, and perhaps replacing individual modules of detectors is essential to the successful fabrication and testing of large multi-element instruments. Details of construction are presented.

  4. Application of Silicon Micromachining to Thermal Dissipation Issues in Wafer Scale Integrated Circuits

    DTIC Science & Technology

    1991-12-01

    the cartesian coordinate system, ( hkl ) is the general mathematical representation for a crystal plane. The planar densities of a crystal and the...furnace’s temperature was pre-equilibrated to the pre- set oxidation temperature of 1075 °C. Oxygen was bubbled through DIW at 95 °C to promote the growth...to the pre-set oxidation temperature of 1075 °C. An oxygen flow was initiated at 1 liter per minute to realize a high quality, dry SiO 2 thin-film on

  5. Low cost, patterning of human hNT brain cells on parylene-C with UV & IR laser machining.

    PubMed

    Raos, Brad J; Unsworth, C P; Costa, J L; Rohde, C A; Doyle, C S; Delivopoulos, E; Murray, A F; Dickinson, M E; Simpson, M C; Graham, E S; Bunting, A S

    2013-01-01

    This paper describes the use of 800nm femtosecond infrared (IR) and 248nm nanosecond ultraviolet (UV) laser radiation in performing ablative micromachining of parylene-C on SiO2 substrates for the patterning of human hNT astrocytes. Results are presented that support the validity of using IR laser ablative micromachining for patterning human hNT astrocytes cells while UV laser radiation produces photo-oxidation of the parylene-C and destroys cell patterning. The findings demonstrate how IR laser ablative micromachining of parylene-C on SiO2 substrates can offer a low cost, accessible alternative for rapid prototyping, high yield cell patterning.

  6. Micromachined peristaltic pump

    NASA Technical Reports Server (NTRS)

    Hartley, Frank T. (Inventor)

    1998-01-01

    A micromachined pump including a channel formed in a semiconductor substrate by conventional processes such as chemical etching. A number of insulating barriers are established in the substrate parallel to one another and transverse to the channel. The barriers separate a series of electrically conductive strips. An overlying flexible conductive membrane is applied over the channel and conductive strips with an insulating layer separating the conductive strips from the conductive membrane. Application of a sequential voltage to the series of strips pulls the membrane into the channel portion of each successive strip to achieve a pumping action. A particularly desirable arrangement employs a micromachined push-pull dual channel cavity employing two substrates with a single membrane sandwiched between them.

  7. Optimization of design parameters for bulk micromachined silicon membranes for piezoresistive pressure sensing application

    NASA Astrophysics Data System (ADS)

    Belwanshi, Vinod; Topkar, Anita

    2016-05-01

    Finite element analysis study has been carried out to optimize the design parameters for bulk micro-machined silicon membranes for piezoresistive pressure sensing applications. The design is targeted for measurement of pressure up to 200 bar for nuclear reactor applications. The mechanical behavior of bulk micro-machined silicon membranes in terms of deflection and stress generation has been simulated. Based on the simulation results, optimization of the membrane design parameters in terms of length, width and thickness has been carried out. Subsequent to optimization of membrane geometrical parameters, the dimensions and location of the high stress concentration region for implantation of piezoresistors have been obtained for sensing of pressure using piezoresistive sensing technique.

  8. Micro-sensors for in-situ meteorological measurements

    NASA Technical Reports Server (NTRS)

    Crisp, David; Kaiser, William J.; Vanzandt, Thomas R.; Tillman, James E.

    1993-01-01

    Improved in-situ meteorological measurements are needed for monitoring the weather and climate of the terrestrial and Martian atmospheres. We have initiated a program to assess the feasibility and utility of micro-sensors for precise in-situ meteorological measurements in these environments. Sensors are being developed for measuring pressure, temperature, wind velocity, humidity, and aerosol amounts. Silicon micro-machining and large scale integration technologies are being used to make sensors that are small, rugged, lightweight, and require very little power. Our long-term goal is to develop very accurate miniaturized sensors that can be incorporated into complete instrument packages or 'micro weather stations,' and deployed on a variety of platforms. If conventional commercially available silicon production techniques can be used to fabricate these sensor packages, it will eventually be possible to mass-produce them at low cost. For studies of the Earth's troposphere and stratosphere, they could be deployed on aircraft, dropsondes, radiosondes, or autonomous surface stations at remote sites. Improved sensor accuracy and reduced sensor cost are the primary challenges for these applications. For studies of the Martian atmosphere, these sensor packages could be incorporated into the small entry probes and surface landers that are being planned for the Mars Environmental SURvey (MESUR) Mission. That decade-long program will deploy a global network of small stations on the Martian surface for monitoring meteorological and geological processes. Low mass, low power, durability, large dynamic range and calibration stability are the principal challenges for this application. Our progress on each of these sensor types is presented.

  9. Terahertz Array Receivers with Integrated Antennas

    NASA Technical Reports Server (NTRS)

    Chattopadhyay, Goutam; Llombart, Nuria; Lee, Choonsup; Jung, Cecile; Lin, Robert; Cooper, Ken B.; Reck, Theodore; Siles, Jose; Schlecht, Erich; Peralta, Alessandro; hide

    2011-01-01

    Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

  10. VIEW OF MICROMACHINING, HIGH PRECISION EQUIPMENT USED TO CUSTOM MAKE ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    VIEW OF MICRO-MACHINING, HIGH PRECISION EQUIPMENT USED TO CUSTOM MAKE SMALL PARTS. LUMPS OF CLAY; SHOWN IN THE PHOTOGRAPH, WERE USED TO STABILIZE PARTS BEING MACHINED. (11/1/87) - Rocky Flats Plant, Stainless Steel & Non-Nuclear Components Manufacturing, Southeast corner of intersection of Cottonwood & Third Avenues, Golden, Jefferson County, CO

  11. Microsystem strategies for sample preparation in biological detection.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    James, Conrad D.; Galambos, Paul C.; Bennett, Dawn Jonita

    2005-03-01

    The objective of this LDRD was to develop microdevice strategies for dealing with samples to be examined in biological detection systems. This includes three sub-components: namely, microdevice fabrication, sample delivery to the microdevice, and sample processing within the microdevice. The first component of this work focused on utilizing Sandia's surface micromachining technology to fabricate small volume (nanoliter) fluidic systems for processing small quantities of biological samples. The next component was to develop interfaces for the surface-micromachined silicon devices. We partnered with Micronics, a commercial company, to produce fluidic manifolds for sample delivery to our silicon devices. Pressure testing was completedmore » to examine the strength of the bond between the pressure-sensitive adhesive layer and the silicon chip. We are also pursuing several other methods, both in house and external, to develop polymer-based fluidic manifolds for packaging silicon-based microfluidic devices. The second component, sample processing, is divided into two sub-tasks: cell collection and cell lysis. Cell collection was achieved using dielectrophoresis, which employs AC fields to collect cells at energized microelectrodes, while rejecting non-cellular particles. Both live and dead Staph. aureus bacteria have been collected using RF frequency dielectrophoresis. Bacteria have been separated from polystyrene microspheres using frequency-shifting dielectrophoresis. Computational modeling was performed to optimize device separation performance, and to predict particle response to the dielectrophoretic traps. Cell lysis is continuing to be pursued using microactuators to mechanically disrupt cell membranes. Novel thermal actuators, which can generate larger forces than previously tested electrostatic actuators, have been incorporated with and tested with cell lysis devices. Significant cell membrane distortion has been observed, but more experiments need to be conducted to determine the effects of the observed distortion on membrane integrity and cell viability. Finally, we are using a commercial PCR DNA amplification system to determine the limits of detectable sample size, and to examine the amplification of DNA bound to microspheres. Our objective is to use microspheres as capture-and-carry chaperones for small molecules such as DNA and proteins, enabling the capture and concentration of the small molecules using dielectrophoresis. Current tests demonstrated amplification of DNA bound to micron-sized polystyrene microspheres using 20-50 microliter volume size reactions.« less

  12. A dual-reflective electrothermal MEMS micromirror for full circumferential scanning endoscopic imaging

    NASA Astrophysics Data System (ADS)

    Wu, Lei; Xie, Huikai

    2008-02-01

    This paper reports the design, fabrication and measurements of a dual-reflective, single-crystal silicon based micromirror that can perform full circumferential scanning (FCS) for endoscopic optical coherence tomography (EOCT). In the proposed FCS-EOCT probe, two optical fibers are used to deliver light beams to either surface of the micromirror, which can rotate +/-45° (or 90°) and thus a 180° optical scanning is obtained from each mirror surface, resulting in full circumferential scans. A novel surface- and bulk-combined micromachining process based on SOI wafers is developed for fabricating the dual reflective micromirror. The single-crystal-silicon device layer of SOI wafers is used for mirror flatness, and Al is coated on both sides for high reflectivity. With one light beam delivered to each mirror surface, full 360° scans have been observed. Other measured data include the resonant frequency: 328Hz, radius of curvatures: - 124 mm (front surface) and 127 mm (back surface), and the reflectances: 81.3% (front surface) and 79.0% (back surface).

  13. Underwater superoleophobicity, anti-oil and ultra-broadband enhanced absorption of metallic surfaces produced by a femtosecond laser inspired by fish and chameleons

    NASA Astrophysics Data System (ADS)

    Yin, K.; Song, Y. X.; Dong, X. R.; Wang, C.; Duan, J. A.

    2016-11-01

    Reported here is the bio-inspired and robust function of underwater superoleophobic, anti-oil metallic surfaces with ultra-broadband enhanced optical absorption obtained through femtosecond laser micromachining. Three distinct surface structures are fabricated using a wide variety of processing parameters. Underwater superoleophobic and anti-oil surfaces containing coral-like microstructures with nanoparticles and mount-like microstructures are achieved. These properties of the as-prepared surfaces exhibit good chemical stability when exposed to various types of oils and when immersed in water with a wide range of pH values. Moreover, coral-like microstructures with nanoparticle surfaces show strongly enhanced optical absorption over a broadband wavelength range from 0.2-25 μm. The potential mechanism for the excellent performance of the coral-like microstructures with a nanoparticle surface is also discussed. This multifunctional surface has potential applications in military submarines, amphibious military aircraft and tanks, and underwater anti-oil optical counter-reconnaissance devices.

  14. Advancing MEMS Technology Usage through the MUMPS (Multi-User MEMS Processes) Program

    NASA Technical Reports Server (NTRS)

    Koester, D. A.; Markus, K. W.; Dhuler, V.; Mahadevan, R.; Cowen, A.

    1995-01-01

    In order to help provide access to advanced micro-electro-mechanical systems (MEMS) technologies and lower the barriers for both industry and academia, the Microelectronic Center of North Carolina (MCNC) and ARPA have developed a program which provides users with access to both MEMS processes and advanced electronic integration techniques. The four distinct aspects of this program, the multi-user MEMS processes (MUMP's), the consolidated micro-mechanical element library, smart MEMS, and the MEMS technology network are described in this paper. MUMP's is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. It is both a proof-of-concept and educational tool that aids in the development of MEMS in the domestic community. MUMP's technologies currently include a 3-layer poly-silicon surface micromachining process and LIGA (lithography, electroforming, and injection molding) processes that provide reasonable design flexibility within set guidelines. The consolidated micromechanical element library (CaMEL) is a library of active and passive MEMS structures that can be downloaded by the MEMS community via the internet. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology. The MEMS technology network (TechNet) is a menu of standard substrates and MEMS fabrication processes that can be purchased and combined to create unique process flows. TechNet provides the MEMS community greater flexibility and enhanced technology accessibility.

  15. Monolithic composite “pressure + acceleration + temperature + infrared” sensor using a versatile single-sided “SiN/Poly-Si/Al” process-module.

    PubMed

    Ni, Zao; Yang, Chen; Xu, Dehui; Zhou, Hong; Zhou, Wei; Li, Tie; Xiong, Bin; Li, Xinxin

    2013-01-16

    We report a newly developed design/fabrication module with low-cost single-sided "low-stress-silicon-nitride (LS-SiN)/polysilicon (poly-Si)/Al" process for monolithic integration of composite sensors for sensing-network-node applications. A front-side surface-/bulk-micromachining process on a conventional Si-substrate is developed, featuring a multifunctional SiN/poly-Si/Al layer design for diverse sensing functions. The first "pressure + acceleration + temperature + infrared" (PATIR) composite sensor with the chip size of 2.5 mm × 2.5 mm is demonstrated. Systematic theoretical design and analysis methods are developed. The diverse sensing components include a piezoresistive absolute-pressure sensor (up to 700 kPa, with a sensitivity of 49 mV/MPa under 3.3 V supplied voltage), a piezoresistive accelerometer (±10 g, with a sensitivity of 66 μV/g under 3.3 V and a -3 dB bandwidth of 780 Hz), a thermoelectric infrared detector (with a responsivity of 45 V/W and detectivity of 3.6 × 107 cm·Hz1/2/W) and a thermistor (-25-120 °C). This design/fabrication module concept enables a low-cost monolithically-integrated "multifunctional-library" technique. It can be utilized as a customizable tool for versatile application-specific requirements, which is very useful for small-size, low-cost, large-scale sensing-network node developments.

  16. Surface micromachined MEMS deformable mirror based on hexagonal parallel-plate electrostatic actuator

    NASA Astrophysics Data System (ADS)

    Ma, Wenying; Ma, Changwei; Wang, Weimin

    2018-03-01

    Deformable mirrors (DM) based on microelectromechanical system (MEMS) technology are being applied in adaptive optics (AO) system for astronomical telescopes and human eyes more and more. In this paper a MEMS DM with hexagonal actuator is proposed and designed. The relationship between structural design and performance parameters, mainly actuator coupling, is analyzed carefully and calculated. The optimum value of actuator coupling is obtained. A 7-element DM prototype is fabricated using a commercial available standard three-layer polysilicon surface multi-user-MEMS-processes (PolyMUMPs). Some key performances, including surface figure and voltage-displacement curve, are measured through a 3D white light profiler. The measured performances are very consistent with the theoretical values. The proposed DM will benefit the miniaturization of AO systems and lower their cost.

  17. Micromachined force-balance feedback accelerometer with optical displacement detection

    DOEpatents

    Nielson, Gregory N.; Langlois, Eric; Baker, Michael; Okandan, Murat; Anderson, Robert

    2014-07-22

    An accelerometer includes a proof mass and a frame that are formed in a handle layer of a silicon-on-an-insulator (SOI). The proof mass is separated from the frame by a back-side trench that defines a boundary of the proof mass. The accelerometer also includes a reflector coupled to a top surface of the proof mass. An optical detector is located above the reflector at the device side. The accelerometer further includes at least one suspension spring. The suspension spring has a handle anchor that extends downwards from the device side to the handle layer to mechanically support upward and downward movement of the proof mass relative to a top surface of the proof mass.

  18. Micromachined nanocalorimetric sensor for ultra-low-volume cell-based assays.

    PubMed

    Johannessen, Erik A; Weaver, John M R; Bourova, Lenka; Svoboda, Petr; Cobbold, Peter H; Cooper, Jonathan M

    2002-05-01

    Current strategies for cell-based screening generally focus on the development of highly specific assays, which require an understanding of the nature of the signaling molecules and cellular pathways involved. In contrast, changes in temperature of cells provides a measure of altered cellular metabolism that is not stimulus specific and hence could have widespread applications in cell-based screening of receptor agonists and antagonists, as well as in the assessment of toxicity of new lead compounds. Consequently, we have developed a micromachined nanocalorimetric biological sensor using a small number of isolated living cells integrated within a subnanoliter format, which is capable of detecting 13 nW of generated power from the cells, upon exposure to a chemical or pharmaceutical stimulus. The sensor comprises a 10-junction gold and nickel thermopile, integrated on a silicon chip which was back-etched to span a 800-nm-thick membrane of silicon nitride. The thin-film membrane, which supported the sensing junctions of the thermoelectric transducer, gave the system a temperature resolution of 0.125 mK, a low heat capacity of 1.2 nJ mK(-1), and a rapid (unfiltered) response time of 12 ms. The application of the system in ultra-low-volume cell-based assays could provide a rapid endogenous screen. It offers important additional advantages over existing methods in that it is generic in nature, it does not require the use of recombinant cell lines or of detailed assay development, and finally, it can enable the use of primary cell lines or tissue biopsies.

  19. Femtosecond Laser Microfabrication of an Integrated Device for Optical Release and Sensing of Bioactive Compounds.

    PubMed

    Ghezzi, Diego; Vazquez, Rebeca Martinez; Osellame, Roberto; Valtorta, Flavia; Pedrocchi, Alessandra; Valle, Giuseppe Della; Ramponi, Roberta; Ferrigno, Giancarlo; Cerullo, Giulio

    2008-10-23

    Flash photolysis of caged compounds is one of the most powerful approaches to investigate the dynamic response of living cells. Monolithically integrated devices suitable for optical uncaging are in great demand since they greatly simplify the experiments and allow their automation. Here we demonstrate the fabrication of an integrated bio-photonic device for the optical release of caged compounds. Such a device is fabricated using femtosecond laser micromachining of a glass substrate. More in detail, femtosecond lasers are used both to cut the substrate in order to create a pit for cell growth and to inscribe optical waveguides for spatially selective uncaging of the compounds present in the culture medium. The operation of this monolithic bio-photonic device is tested using both free and caged fluorescent compounds to probe its capability of multipoint release and optical sensing. Application of this device to the study of neuronal network activity can be envisaged.

  20. Experimental Performance of a Micromachined Heat Flux Sensor

    NASA Technical Reports Server (NTRS)

    Stefanescu, S.; DeAnna, R. G.; Mehregany, M.

    1998-01-01

    Steady-state and frequency response calibration of a microfabricated heat-flux sensor have been completed. This sensor is batch fabricated using standard, micromachining techniques, allowing both miniaturization and the ability to create arrays of sensors and their corresponding interconnects. Both high-frequency and spatial response is desired, so the sensors are both thin and of small cross-sectional area. Thin-film, temperature-sensitive resistors are used as the active gauge elements. Two sensor configurations are investigated: (1) a Wheatstone-bridge using four resistors; and (2) a simple, two-resistor design. In each design, one resistor (or pair) is covered by a thin layer (5000 A) thermal barrier; the other resistor (or pair) is covered by a thick (5 microns) thermal barrier. The active area of a single resistor is 360 microns by 360 microns; the total gauge area is 1.5 mm square. The resistors are made of 2000 A-thick metal; and the entire gauge is fabricated on a 25 microns-thick flexible, polyimide substrate. Heat flux through the surface changes the temperature of the resistors and produces a corresponding change in resistance. Sensors were calibrated using two radiation heat sources: (1) a furnace for steady-state, and (2) a light and chopper for frequency response.

  1. Recent progress in preparation and application of microfluidic chip electrophoresis

    NASA Astrophysics Data System (ADS)

    Cong, Hailin; Xu, Xiaodan; Yu, Bing; Yuan, Hua; Peng, Qiaohong; Tian, Chao

    2015-05-01

    Since its discovery in 1990, microfluidic chip electrophoresis (MCE) has allowed the development of applications with small size, fast analysis, low cost, high integration density and automatic level, which are easy to carry and have made commercialization efficient. MCE has been widely used in the areas of environmental protection, biochemistry, medicine and health, clinical testing, judicial expertise, food sanitation, pharmaceutical checking, drug testing, agrochemistry, biomedical engineering and life science. As one of the foremost fields in the research of capillary electrophoresis, MCE is the ultimate frontier to develop the miniaturized, integrated, automated all-in-one instruments needed in modern analytical chemistry. By adopting the advanced technologies of micro-machining, lasers and microelectronics, and the latest research achievements in analytical chemistry and biochemistry, the sampling, separation and detection systems of commonly used capillary electrophoresis are integrated with high densities onto glass, quartz, silicon or polymer wafers to form the MCE, which can finish the analysis of multi-step operations such as injection, enrichment, reaction, derivatization, separation, and collection of samples in a portable, efficient and super high speed manner. With reference to the different technological achievements in this area, the latest developments in MCE are reviewed in this article. The preparation mechanisms, surface modifications, and properties of different materials in MCE are compared, and the different sampling, separation and detection systems in MCE are summarized. The performance of MCE in analysis of fluorescent substance, metallic ion, sugar, medicine, nucleic acid, DNA, amino acid, polypeptide and protein is discussed, and the future direction of development is forecast.

  2. Development of a femtosecond micromachining workstation by use of spectral interferometry.

    PubMed

    Bera, Sudipta; Sabbah, A J; Durfee, Charles G; Squier, Jeff A

    2005-02-15

    A workstation that permits real-time measurement of ablation depth while micromachining with femtosecond laser pulses is demonstrated. This method incorporates the unamplified pulse train that is available in a chirped-pulse amplification system as the probe in an arrangement that uses spectral interferometry to measure the ablation depth while cutting with the amplified pulse in thin metal films.

  3. High speed micromachining with high power UV laser

    NASA Astrophysics Data System (ADS)

    Patel, Rajesh S.; Bovatsek, James M.

    2013-03-01

    Increasing demand for creating fine features with high accuracy in manufacturing of electronic mobile devices has fueled growth for lasers in manufacturing. High power, high repetition rate ultraviolet (UV) lasers provide an opportunity to implement a cost effective high quality, high throughput micromachining process in a 24/7 manufacturing environment. The energy available per pulse and the pulse repetition frequency (PRF) of diode pumped solid state (DPSS) nanosecond UV lasers have increased steadily over the years. Efficient use of the available energy from a laser is important to generate accurate fine features at a high speed with high quality. To achieve maximum material removal and minimal thermal damage for any laser micromachining application, use of the optimal process parameters including energy density or fluence (J/cm2), pulse width, and repetition rate is important. In this study we present a new high power, high PRF QuasarR 355-40 laser from Spectra-Physics with TimeShiftTM technology for unique software adjustable pulse width, pulse splitting, and pulse shaping capabilities. The benefits of these features for micromachining include improved throughput and quality. Specific example and results of silicon scribing are described to demonstrate the processing benefits of the Quasar's available power, PRF, and TimeShift technology.

  4. An integrated MEMS infrastructure for fuel processing: hydrogen generation and separation for portable power generation

    NASA Astrophysics Data System (ADS)

    Varady, M. J.; McLeod, L.; Meacham, J. M.; Degertekin, F. L.; Fedorov, A. G.

    2007-09-01

    Portable fuel cells are an enabling technology for high efficiency and ultra-high density distributed power generation, which is essential for many terrestrial and aerospace applications. A key element of fuel cell power sources is the fuel processor, which should have the capability to efficiently reform liquid fuels and produce high purity hydrogen that is consumed by the fuel cells. To this end, we are reporting on the development of two novel MEMS hydrogen generators with improved functionality achieved through an innovative process organization and system integration approach that exploits the advantages of transport and catalysis on the micro/nano scale. One fuel processor design utilizes transient, reverse-flow operation of an autothermal MEMS microreactor with an intimately integrated, micromachined ultrasonic fuel atomizer and a Pd/Ag membrane for in situ hydrogen separation from the product stream. The other design features a simpler, more compact planar structure with the atomized fuel ejected directly onto the catalyst layer, which is coupled to an integrated hydrogen selective membrane.

  5. Development of advanced second-generation micromirror devices fabricated in a four-level planarized surface-micromachined polycrystalline silicon process

    NASA Astrophysics Data System (ADS)

    Michalicek, M. Adrian; Comtois, John H.; Schriner, Heather K.

    1998-04-01

    This paper describes the design and characterization of several types of micromirror devices to include process capabilities, device modeling, and test data resulting in deflection versus applied potential curves and surface contour measurements. These devices are the first to be fabricated in the state-of-the-art four-level planarized polysilicon process available at Sandia National Laboratories known as the Sandia Ultra-planar Multi-level MEMS Technology. This enabling process permits the development of micromirror devices with near-ideal characteristics which have previously been unrealizable in standard three-layer polysilicon processes. This paper describes such characteristics which have previously been unrealizable in standard three-layer polysilicon processes. This paper describes such characteristics as elevated address electrodes, various address wiring techniques, planarized mirror surfaces suing Chemical Mechanical Polishing, unique post-process metallization, and the best active surface area to date.

  6. Concepts for compact mid-IR spectroscopy in photochemistry

    NASA Astrophysics Data System (ADS)

    Cu-Nguyen, Phuong-Ha; Wang, Ziyu; Zappe, Hans

    2016-11-01

    Mid-infrared (IR) spectroscopy, typically 3 to 5 µm, is often the technology of choice to monitor the interaction between and concentration of molecules during photochemical reactions. However, classical mid-IR spectrometers are bulky, complex and expensive, making them unsuitable for use in the miniaturized microreactors increasingly being employed for chemical synthesis. We present here the concept for an ultra-miniaturized mid-IR spectrometer directly integrated onto a chemical microreactor to monitor the chemical reaction. The spectrometer is based on micro-machined Fabry-Perot resonator filters realized using pairs of Bragg mirrors to achieve a high spectral resolution. The fabrication of the optical filters is outlined and the measurement of transmittance spectra in the mid-IR range show a good agreement with theory and are thus promising candidates for a fully integrated system.

  7. A review of micromachined thermal accelerometers

    NASA Astrophysics Data System (ADS)

    Mukherjee, Rahul; Basu, Joydeep; Mandal, Pradip; Guha, Prasanta Kumar

    2017-12-01

    A thermal convection based micro-electromechanical accelerometer is a relatively new kind of acceleration sensor that does not require a solid proof mass, yielding unique benefits like high shock survival rating, low production cost, and integrability with CMOS integrated circuit technology. This article provides a comprehensive survey of the research, development, and current trends in the field of thermal acceleration sensors, with detailed enumeration on the theory, operation, modeling, and numerical simulation of such devices. Different reported varieties and structures of thermal accelerometers have been reviewed highlighting key design, implementation, and performance aspects. Materials and technologies used for fabrication of such sensors have also been discussed. Further, the advantages and challenges for thermal accelerometers vis-à-vis other prominent accelerometer types have been presented, followed by an overview of associated signal conditioning circuitry and potential applications.

  8. Nanoelectrospray ion generation for high-throughput mass spectrometry using a micromachined ultrasonic ejector array

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Aderogba, S.; Meacham, J.M.; Degertekin, F.L.

    2005-05-16

    Ultrasonic electrospray ionization (ESI) for high-throughput mass spectrometry is demonstrated using a silicon micromachined microarray. The device uses a micromachined ultrasonic atomizer operating in the 900 kHz-2.5 MHz range for droplet generation and a metal electrode in the fluid cavity for ionization. Since the atomization and ionization processes are separated, the ultrasonic ESI source shows the potential for operation at low voltages with a wide range of solvents in contrast with conventional capillary ESI technology. This is demonstrated using the ultrasonic ESI microarray to obtain the mass spectrum of a 10 {mu}M reserpine sample on a time of flight massmore » spectrometer with 197:1 signal-to-noise ratio at an ionization potential of 200 V.« less

  9. UV laser-assisted wire stripping and micro-machining

    NASA Astrophysics Data System (ADS)

    Martyniuk, Jerry

    1994-02-01

    Results are reported for the use of a 266 nm frequency quadrupled Nd:YAG ultraviolet laser in the areas of wire stripping of small coaxial type transmission lines and for micro-machining of various materials including copper, glass, polyimide and DuPont TEFLONTM. This new laser is typically run with a 2 KHz repetition rate, 40 ns FWHM pulse and a fluence of about 50 joules/cm2 which makes it possible to micro-machine metals, polymers, glasses and ceramics. The high fluence of this laser allows shielding structures such as Al-MylarTM, Al-KaptonTM or the plated copper used in small coaxial cables to be precisely cut. Cut rates are reported for the above materials as well as results and photos of wire stripping and micro- machining.

  10. Cost-effective MEMS piezoresistive cantilever-based sensor fabrication for gait movement analysis

    NASA Astrophysics Data System (ADS)

    Saadon, Salem; Anuar, A. F. M.; Wahab, Yufridin

    2017-03-01

    The conventional photolithography of crystalline silicon technique is limited to two-dimensional and structure scaling. It's also requiring a lot of time and chemical involves for the whole process. These problems can be overcome by using laser micromachining technique, that capable to produce three-dimensional structure and simultaneously avoiding the photo mask needs. In this paper, we reported on the RapidX-250 Excimer laser micromachining with 248 nm KrF to create in-time mask design and assisting in the fabrication process of piezo-resistive micro cantilever structures. Firstly, laser micromachining parameters have been investigated in order to fabricate the acceleration sensor to analyzing human gait movement. Preliminary result shows that the fabricated sensor able to define the movement difference of human motion regarding the electrical characteristic of piezo-resistor.

  11. Optical micromachined ultrasound transducers (OMUT)--a new approach for high-frequency transducers.

    PubMed

    Tadayon, Mohammad Amin; Ashkenazi, Shai

    2013-09-01

    The sensitivity and reliability of piezoelectric ultrasound transducers severely degrade in applications requiring high frequency and small element size. Alternative technologies such as capacitive micromachined ultrasound transducers (CMUT) and optical sensing and generation of ultrasound have been proposed and studied for several decades. In this paper, we present a new type of device based on optical micromachined ultrasound transducer (OMUT) technology. OMUTs rely on microfabrication techniques to construct micrometerscale air cavities capped by an elastic membrane. A modified photoresist bonding process has been developed to facilitate the fabrication of these devices. We will describe the design, fabrication, and testing of prototype OMUT devices which implement a receive-only function. Future design modifications are proposed for incorporating complete transmit¿receive functionality in a single element.

  12. A Micromachined Geometric Moire Interferometric Floating-Element Shear Stress Sensor

    NASA Technical Reports Server (NTRS)

    Horowitz, S.; Chen, T.; Chandrasekaran, V.; Tedjojuwono, K.; Nishida, T.; Cattafesta, L.; Sheplak, M.

    2004-01-01

    This paper presents the development of a floating-element shear stress sensor that permits the direct measurement of skin friction based on geometric Moir interferometry. The sensor was fabricated using an aligned wafer-bond/thin-back process producing optical gratings on the backside of a floating element and on the top surface of the support wafer. Experimental characterization indicates a static sensitivity of 0.26 microns/Pa, a resonant frequency of 1.7 kHz, and a noise floor of 6.2 mPa/(square root)Hz.

  13. Microminiature thermionic converters

    DOEpatents

    King, Donald B.; Sadwick, Laurence P.; Wernsman, Bernard R.

    2001-09-25

    Microminiature thermionic converts (MTCs) having high energy-conversion efficiencies and variable operating temperatures. Methods of manufacturing those converters using semiconductor integrated circuit fabrication and micromachine manufacturing techniques are also disclosed. The MTCs of the invention incorporate cathode to anode spacing of about 1 micron or less and use cathode and anode materials having work functions ranging from about 1 eV to about 3 eV. Existing prior art thermionic converter technology has energy conversion efficiencies ranging from 5-15%. The MTCs of the present invention have maximum efficiencies of just under 30%, and thousands of the devices can be fabricated at modest costs.

  14. Research on the effect of coverage rate on the surface quality in laser direct writing process

    NASA Astrophysics Data System (ADS)

    Pan, Xuetao; Tu, Dawei

    2017-07-01

    Direct writing technique is usually used in femtosecond laser two-photon micromachining. The size of the scanning step is an important factor affecting the surface quality and machining efficiency of micro devices. According to the mechanism of two-photon polymerization, combining the distribution function of light intensity and the free radical concentration theory, we establish the mathematical model of coverage of solidification unit, then analyze the effect of coverage on the machining quality and efficiency. Using the principle of exposure equivalence, we also obtained the analytic expressions of the relationship among the surface quality characteristic parameters of microdevices and the scanning step, and carried out the numerical simulation and experiment. The results show that the scanning step has little influence on the surface quality of the line when it is much smaller than the size of the solidification unit. However, with increasing scanning step, the smoothness of line surface is reduced rapidly, and the surface quality becomes much worse.

  15. Benzocyclobutene-based electric micromachines supported on microball bearings: Design, fabrication, and characterization

    NASA Astrophysics Data System (ADS)

    Modafe, Alireza

    This dissertation summarizes the research activities that led to the development of the first microball-bearing-supported linear electrostatic micromotor with benzocyclobutene (BCB) low-k polymer insulating layers. The primary application of this device is long-range, high-speed linear micropositioning. The future generations of this device include rotary electrostatic micromotors and microgenerators. The development of the first generation of microball-bearing-supported micromachines, including device theory, design, and modeling, material characterization, process development, device fabrication, and device test and characterization is presented. The first generation of these devices is based on a 6-phase, bottom-drive, linear, variable-capacitance micromotor (B-LVCM). The design of the electrical and mechanical components of the micromotor, lumped-circuit modeling of the device and electromechanical characteristics, including variable capacitance, force, power, and speed are presented. Electrical characterization of BCB polymers, characterization of BCB chemical mechanical planarization (CMP), development of embedded BCB in silicon (EBiS) process, and integration of device components using microfabrication techniques are also presented. The micromotor consists of a silicon stator, a silicon slider, and four stainless-steel microballs. The aligning force profile of the micromotor was extracted from simulated and measured capacitances of all phases. An average total aligning force of 0.27 mN with a maximum of 0.41 mN, assuming a 100 V peak-to-peak square-wave voltage, was measured. The operation of the micromotor was verified by applying square-wave voltages and characterizing the slider motion. An average slider speed of 7.32 mm/s when excited by a 40 Hz, 120 V square-wave voltage was reached without losing the synchronization. This research has a pivotal impact in the field of power microelectromechanical systems (MEMS). It establishes the foundation for the development of more reliable, efficient electrostatic micromachines with variety of applications such as micropropulsion, high-speed micropumping, microfluid delivery, and microsystem power generation.

  16. Electronic circuitry development in a micropyrotechnic system for micropropulsion applications

    NASA Astrophysics Data System (ADS)

    Puig-Vidal, Manuel; Lopez, Jaime; Miribel, Pere; Montane, Enric; Lopez-Villegas, Jose M.; Samitier, Josep; Rossi, Carole; Camps, Thierry; Dumonteuil, Maxime

    2003-04-01

    An electronic circuitry is proposed and implemented to optimize the ignition process and the robustness of a microthruster. The principle is based on the integration of propellant material within a micromachined system. The operational concept is simply based on the combustion of an energetic propellant stored in a micromachined chamber. Each thruster contains three parts (heater, chamber, nozzle). Due to the one shot characteristic, microthrusters are fabricated in 2D array configuration. For the functioning of this kind of system, one critical point is the optimization of the ignition process as a function of the power schedule delivered by electronic devices. One particular attention has been paid on the design and implementation of an electronic chip to control and optimize the system ignition. Ignition process is triggered by electrical power delivered to a polysilicon resistance in contact with the propellant. The resistance is used to sense the temperature on the propellant which is in contact. Temperature of the microthruster node before the ignition is monitored via the electronic circuitry. A pre-heating process before ignition seems to be a good methodology to optimize the ignition process. Pre-heating temperature and pre-heating time are critical parameters to be adjusted. Simulation and experimental results will deeply contribute to improve the micropyrotechnic system. This paper will discuss all these point.

  17. Receive-Noise Analysis of Capacitive Micromachined Ultrasonic Transducers.

    PubMed

    Bozkurt, Ayhan; Yaralioglu, G Goksenin

    2016-11-01

    This paper presents an analysis of thermal (Johnson) noise received from the radiation medium by otherwise noiseless capacitive micromachined ultrasonic transducer (CMUT) membranes operating in their fundamental resonance mode. Determination of thermal noise received by multiple numbers of transducers or a transducer array requires the assessment of cross-coupling through the radiation medium, as well as the self-radiation impedance of the individual transducer. We show that the total thermal noise received by the cells of a CMUT has insignificant correlation, and is independent of the radiation impedance, but is only determined by the mass of each membrane and the electromechanical transformer ratio. The proof is based on the analytical derivations for a simple transducer with two cells, and extended to transducers with numerous cells using circuit simulators. We used a first-order model, which incorporates the fundamental resonance of the CMUT. Noise power is calculated by integrating over the entire spectrum; hence, the presented figures are an upper bound for the noise. The presented analyses are valid for a transimpedance amplifier in the receive path. We use the analysis results to calculate the minimum detectable pressure of a CMUT. We also provide an analysis based on the experimental data to show that output noise power is limited by and comparable to the theoretical upper limit.

  18. Micromachined piezoresistive inclinometer with oscillator-based integrated interface circuit and temperature readout

    NASA Astrophysics Data System (ADS)

    Dalola, Simone; Ferrari, Vittorio; Marioli, Daniele

    2012-03-01

    In this paper a dual-chip system for inclination measurement is presented. It consists of a MEMS (microelectromechanical system) piezoresistive accelerometer manufactured in silicon bulk micromachining and a CMOS (complementary metal oxide semiconductor) ASIC (application specific integrated circuit) interface designed for resistive-bridge sensors. The sensor is composed of a seismic mass symmetrically suspended by means of four flexure beams that integrate two piezoresistors each to detect the applied static acceleration, which is related to inclination with respect to the gravity vector. The ASIC interface is based on a relaxation oscillator where the frequency and the duty cycle of a rectangular-wave output signal are related to the fractional bridge imbalance and the overall bridge resistance of the sensor, respectively. The latter is a function of temperature; therefore the sensing element itself can be advantageously used to derive information for its own thermal compensation. DC current excitation of the sensor makes the configuration unaffected by wire resistances and parasitic capacitances. Therefore, a modular system results where the sensor can be placed remotely from the electronics without suffering accuracy degradation. The inclination measurement system has been characterized as a function of the applied inclination angle at different temperatures. At room temperature, the experimental sensitivity of the system results in about 148 Hz/g, which corresponds to an angular sensitivity around zero inclination angle of about 2.58 Hz deg-1. This is in agreement with finite element method simulations. The measured output fluctuations at constant temperature determine an equivalent resolution of about 0.1° at midrange. In the temperature range of 25-65 °C the system sensitivity decreases by about 10%, which is less than the variation due to the microsensor alone thanks to thermal compensation provided by the current excitation of the bridge and the positive temperature coefficient of resistance of the piezoresistors.

  19. Optimization of micromachined membrane switches

    NASA Astrophysics Data System (ADS)

    Hiltmann, Kai; Lang, Walter

    1997-09-01

    We have determined the minimum dimensions for micromachined membrane switches in several experiments, both regarding the strength of the membranes themselves and the elongations required for safe switching performance. Based on these data, pressure switches for voltages of 10 - 100 V were made as single and multiple elements and tested. Test results, with scatter of pressure threshold data in the ten per cent range, prove very encouraging for further development.

  20. Micromachined Parts Advance Medicine, Astrophysics, and More

    NASA Technical Reports Server (NTRS)

    2015-01-01

    In the mid-1990s, Marshall Space Flight Center awarded two SBIR contracts to Potomac Photonics, now based in Baltimore, for the development of computerized workstations capable of mass-producing tiny, intricate, diffractive optical elements. While the company has since discontinued the workstations, those contracts set the stage for Potomac Photonics to be a leader in the micromachining industry, where NASA remains one of its clients.

  1. 3-D laser patterning process utilizing horizontal and vertical patterning

    DOEpatents

    Malba, Vincent; Bernhardt, Anthony F.

    2000-01-01

    A process which vastly improves the 3-D patterning capability of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photoresist (EDPR) to pattern 3-D surfaces. The EDPR covers the surface of a metal layer conformally, coating the vertical as well as horizontal surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR. The metal layer thereunder is now exposed in the trench areas and masked in others, and thereafter can be etched to form the desired pattern (subtractive process), or can be plated with metal (additive process), followed by a resist stripping, and removal of the remaining field metal (additive process). This improved laser pantograph process is simpler, faster, move manufacturable, and requires no micro-machining.

  2. Introduction to Micro/Nanofabrication

    NASA Astrophysics Data System (ADS)

    Ziaie, Babak; Baldi, Antonio; Atashbar, Massood

    This chapter outlines and discusses important micro- and nanofabrication techniques. We start with the most basic methods borrowed from the integrated circuit (IC) industry, such as thin film deposition, lithography and etching, and then move on to look at MEMS and nanofabrication technologies. We cover a broad range of dimensions, from the micron to the nanometer scale. Although most of the current research is geared towards the nanodomain, a good understanding of top-down methods for fabricating micron-sized objects can aid our understanding of this research. Due to space constraints, we have focused here on the most important technologies; in the microdomain these include surface, bulk and high aspect ratio micromachining; in the nanodomain we concentrate on e-beam lithography, epitaxial growth, template manufacturing and self-assembly. MEMS technology is maturing rapidly, with some new technologies displacing older ones that have proven to be unsuited to manufacture on a commercial scale. However, the jury is still out on methods used in the nanodomain, although it appears that bottom-up methods are the most feasible, and these will have a major impact in a variety of application areas such as biology, medicine, environmental monitoring and nanoelectronics.

  3. Alignment Jig for the Precise Measurement of THz Radiation

    NASA Technical Reports Server (NTRS)

    Javadi, Hamid H.

    2009-01-01

    A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

  4. GPS/MEMS IMU/Microprocessor Board for Navigation

    NASA Technical Reports Server (NTRS)

    Gender, Thomas K.; Chow, James; Ott, William E.

    2009-01-01

    A miniaturized instrumentation package comprising a (1) Global Positioning System (GPS) receiver, (2) an inertial measurement unit (IMU) consisting largely of surface-micromachined sensors of the microelectromechanical systems (MEMS) type, and (3) a microprocessor, all residing on a single circuit board, is part of the navigation system of a compact robotic spacecraft intended to be released from a larger spacecraft [e.g., the International Space Station (ISS)] for exterior visual inspection of the larger spacecraft. Variants of the package may also be useful in terrestrial collision-detection and -avoidance applications. The navigation solution obtained by integrating the IMU outputs is fed back to a correlator in the GPS receiver to aid in tracking GPS signals. The raw GPS and IMU data are blended in a Kalman filter to obtain an optimal navigation solution, which can be supplemented by range and velocity data obtained by use of (l) a stereoscopic pair of electronic cameras aboard the robotic spacecraft and/or (2) a laser dynamic range imager aboard the ISS. The novelty of the package lies mostly in those aspects of the design of the MEMS IMU that pertain to controlling mechanical resonances and stabilizing scale factors and biases.

  5. Addressable microshutter array for a high-performance infrared miniature dispersive spectrometer

    NASA Astrophysics Data System (ADS)

    Ilias, S.; Picard, F.; Larouche, C.; Kruzelecky, R.; Jamroz, W.

    2009-02-01

    Programmable microshutter arrays were designed to improve the attainable signal to noise ratio (SNR) of a miniature dispersive spectrometer developed for space applications. Integration of a microshutter array to this instrument provides advantages such as the addition of a binary coded optical input operation mode for the miniature spectrometer which results in SNR benefits without spectral resolution loss. These arrays were successfully fabricated using surface micromachining technology. Each microshutter is basically an electrostatic zipping actuator having a curved shape. Applying critical voltage to one microshutter pulls the actuator down to the substrate and closes the associated slit. Opening of the microslits relies on the restoring force generated within the actuated zippers. High light transmission is obtained with the actuator in the open position and excellent light blocking is observed when the shutter is closed. The pull-in voltage to close the microslits was about 110 V and the response times to close and open the microslits were about 2 ms and 7 ms, respectively. Selected array dies were mounted in modified off-the-shelf ceramic packages and electrically connected to package pins. The packages were hermetically sealed with AR coated sapphire windows. This last packaging step was performed in a dry nitrogen controlled atmosphere.

  6. Precision laser processing for micro electronics and fiber optic manufacturing

    NASA Astrophysics Data System (ADS)

    Webb, Andrew; Osborne, Mike; Foster-Turner, Gideon; Dinkel, Duane W.

    2008-02-01

    The application of laser based materials processing for precision micro scale manufacturing in the electronics and fiber optic industry is becoming increasingly widespread and accepted. This presentation will review latest laser technologies available and discuss the issues to be considered in choosing the most appropriate laser and processing parameters. High repetition rate, short duration pulsed lasers have improved rapidly in recent years in terms of both performance and reliability enabling flexible, cost effective processing of many material types including metal, silicon, plastic, ceramic and glass. Demonstrating the relevance of laser micromachining, application examples where laser processing is in use for production will be presented, including miniaturization of surface mount capacitors by applying a laser technique for demetalization of tracks in the capacitor manufacturing process and high quality laser machining of fiber optics including stripping, cleaving and lensing, resulting in optical quality finishes without the need for traditional polishing. Applications include telecoms, biomedical and sensing. OpTek Systems was formed in 2000 and provide fully integrated systems and sub contract services for laser processes. They are headquartered in the UK and are establishing a presence in North America through a laser processing facility in South Carolina and sales office in the North East.

  7. Investigation on the Mechanical and Electrical Behavior of a Tuning Fork-Shaped Ionic Polymer Metal Composite Actuator with a Continuous Water Supply Mechanism

    PubMed Central

    Feng, Guo-Hua; Huang, Wei-Lun

    2016-01-01

    This paper presents an innovative tuning fork-shaped ionic polymer metal composite (IPMC) actuator. With an integrated soft strain gauge and water supply mechanism (WSM), the surface strain of the actuator can be sensed in situ, and providing a continuous water supply maintains the water content inside the IPMC for long-term operation in air. The actuator was fabricated using a micromachining technique and plated with a nickel electrode. The device performance was experimentally characterized and compared with an actuator without a WSM. A large displacement of 1.5 mm was achieved for a 6 mm-long prong with 7-V dc actuation applied for 30 s. The measured current was analyzed using an electrochemical model. The results revealed that the faradaic current plays a crucial role during operation, particularly after 10 s. The measured strain confirms both the bending and axial strain generation during the open-and-close motion of the actuator prongs. Most of the water loss during device operation was due to evaporation rather than hydrolysis. The constructed WSM effectively maintained the water content inside the IPMC for long-term continuous operation. PMID:27023549

  8. Investigation on the Mechanical and Electrical Behavior of a Tuning Fork-Shaped Ionic Polymer Metal Composite Actuator with a Continuous Water Supply Mechanism.

    PubMed

    Feng, Guo-Hua; Huang, Wei-Lun

    2016-03-25

    This paper presents an innovative tuning fork-shaped ionic polymer metal composite (IPMC) actuator. With an integrated soft strain gauge and water supply mechanism (WSM), the surface strain of the actuator can be sensed in situ, and providing a continuous water supply maintains the water content inside the IPMC for long-term operation in air. The actuator was fabricated using a micromachining technique and plated with a nickel electrode. The device performance was experimentally characterized and compared with an actuator without a WSM. A large displacement of 1.5 mm was achieved for a 6 mm-long prong with 7-V dc actuation applied for 30 s. The measured current was analyzed using an electrochemical model. The results revealed that the faradaic current plays a crucial role during operation, particularly after 10 s. The measured strain confirms both the bending and axial strain generation during the open-and-close motion of the actuator prongs. Most of the water loss during device operation was due to evaporation rather than hydrolysis. The constructed WSM effectively maintained the water content inside the IPMC for long-term continuous operation.

  9. Recent advances in particle and droplet manipulation for lab-on-a-chip devices based on surface acoustic waves.

    PubMed

    Wang, Zhuochen; Zhe, Jiang

    2011-04-07

    Manipulation of microscale particles and fluid liquid droplets is an important task for lab-on-a-chip devices for numerous biological researches and applications, such as cell detection and tissue engineering. Particle manipulation techniques based on surface acoustic waves (SAWs) appear effective for lab-on-a-chip devices because they are non-invasive, compatible with soft lithography micromachining, have high energy density, and work for nearly any type of microscale particles. Here we review the most recent research and development of the past two years in SAW based particle and liquid droplet manipulation for lab-on-a-chip devices including particle focusing and separation, particle alignment and patterning, particle directing, and liquid droplet delivery.

  10. Weaves as an Interconnection Fabric for ASIM's and Nanosatellites

    NASA Technical Reports Server (NTRS)

    Gorlick, Michael M.

    1995-01-01

    Many of the micromachines under consideration require computer support, indeed, one of the appeals of this technology is the ability to intermix mechanical, optical, analog, and digital devices on the same substrate. The amount of computer power is rarely an issue, the sticking point is the complexity of the software required to make effective use of these devices. Micromachines are the nano-technologist's equivalent of 'golden screws'. In other words, they will be piece parts in larger assemblages. For example, a nano-satellite may be composed of stacked silicon wafers where each wafer contains hundreds to thousands of micromachines, digital controllers, general purpose computers, memories, and high-speed bus interconnects. Comparatively few of these devices will be custom designed, most will be stock parts selected from libraries and catalogs. The novelty will lie in the interconnections. For example, a digital accelerometer may be a component part in an adaptive suspension, a monitoring element embedded in the wrapper of a package, or a portion of the smart skin of a launch vehicle. In each case, this device must inter-operate with other devices and probes for the purposes of command, control, and communication. We propose a software technology called 'weaves' that will permit large collections of micromachines and their attendant computers to freely intercommunicate while preserving modularity, transparency, and flexibility. Weaves are composed of networks of communicating software components. The network, and the components comprising it, may be changed even while the software, and the devices it controls, are executing. This unusual degree of software plasticity permits micromachines to dynamically adapt the software to changing conditions and allows system engineers to rapidly and inexpensively develop special purpose software by assembling stock software components in custom configurations.

  11. Micromachined ultrasonic droplet generator based on a liquid horn structure

    NASA Astrophysics Data System (ADS)

    Meacham, J. M.; Ejimofor, C.; Kumar, S.; Degertekin, F. L.; Fedorov, A. G.

    2004-05-01

    A micromachined ultrasonic droplet generator is developed and demonstrated for drop-on-demand fluid atomization. The droplet generator comprises a bulk ceramic piezoelectric transducer for ultrasound generation, a reservoir for the ejection fluid, and a silicon micromachined liquid horn structure as the nozzle. The nozzles are formed using a simple batch microfabrication process that involves wet etching of (100) silicon in potassium hydroxide solution. Device operation is demonstrated by droplet ejection of water through 30 μm orifices at 1.49 and 2.30 MHz. The finite-element simulations of the acoustic fields in the cavity and electrical impedance of the device are in agreement with the measurements and indicate that the device utilizes cavity resonances in the 1-5 MHz range in conjunction with acoustic wave focusing by the pyramidally shaped nozzles to achieve low power operation.

  12. 3D packaging of a microfluidic system with sensory applications

    NASA Astrophysics Data System (ADS)

    Morrissey, Anthony; Kelly, Gerard; Alderman, John C.

    1997-09-01

    Among the main benefits of microsystem technology are its contributions to cost reductio, reliability and improved performance. however, the packaging of microsystems, and particularly microsensor, has proven to be one of the biggest limitations to their commercialization and the packaging of silicon sensor devices can be the most costly part of their fabrication. This paper describes the integration of 3D packaging of a microsystem. Central to the operation of the 3D demonstrator is a micromachined silicon membrane pump to supply fluids to a sensing chamber constructed about the active area of a sensor chip. This chip carries ISFET based chemical sensors, pressure sensors and thermal sensors. The electronics required for controlling and regulating the activity of the various sensors ar also available on this chip and as other chips in the 3D assembly. The demonstrator also contains a power supply module with optical fiber interconnections. All of these modules are integrated into a single plastic- encapsulated 3D vertical multichip module. The reliability of such a structure, initially proposed by Val was demonstrated by Barrett et al. An additional module available for inclusion in some of our assemblies is a test chip capable of measuring the packaging-induced stress experienced during and after assembly. The packaging process described produces a module with very high density and utilizes standard off-the-shelf components to minimize costs. As the sensor chip and micropump include micromachined silicon membranes and microvalves, the packaging of such structures has to allow consideration for the minimization of the packaging-induced stresses. With this in mind, low stress techniques, including the use of soft glob-top materials, were employed.

  13. 3D Printed Microtransporters: Compound Micromachines for Spatiotemporally Controlled Delivery of Therapeutic Agents.

    PubMed

    Huang, Tian-Yun; Sakar, Mahmut Selman; Mao, Angelo; Petruska, Andrew J; Qiu, Famin; Chen, Xue-Bo; Kennedy, Stephen; Mooney, David; Nelson, Bradley J

    2015-11-01

    Functional compound micromachines are fabricated by a design methodology using 3D direct laser writing and selective physical vapor deposition of magnetic materials. Microtransporters with a wirelessly controlled Archimedes screw pumping mechanism are engineered. Spatiotemporally controlled collection, transport, and delivery of micro particles, as well as magnetic nanohelices inside microfluidic channels are demonstrated. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  14. OSA Trends in Optics and Photonics Series, Volume 14 Spatial Light Modulators

    DTIC Science & Technology

    1998-05-26

    Extreme Ultraviolet Lithography Glenn D. Kubiak andDon R. Kania, eds. Vol. 5 Optical Amplifiers and Their Applications (1996) Edited by...micromirror device ( DMD ), and photorefractive crystal. Note that other devices not discussed in this article have been developed, such as the charge...earlier. DMDs are fabricated by micromachining a silicon wafer.7 Tiny (16 um X 16 um) suspended mirrors are micromachined on cantilevers. The

  15. Phase-sensitive techniques applied to a micromachined vacuum sensor

    NASA Astrophysics Data System (ADS)

    Chapman, Glenn H.; Sawadsky, N.; Juneja, P. P.

    1996-09-01

    Phase sensitive AC measurement techniques are particularly applicable to micromachined sensors detecting temperature changes at a sensor caused by a microheater. The small mass produces rapid thermal response to AC signals which are easily detectable with lock-in amplifiers. Phase sensitive measurements were applied to a CMOS compatible micromachined pressure sensor consisting a polysilicon sense line, 760 microns long, on an oxide microbridge separated by 6 microns on each horizontal side from similar polysilicon heaters, all over a micromachined cavity. Sinusoidal heater signals at 32 Hz induced temperature caused sense line resistance changes at 64 Hz. The lock-in detected this as a first harmonic sense resistor voltage from a DC constant sense current. By observing the first harmonic the lock-in rejects all AC coupling of noise by capacitance or inductance, by measuring only those signals at the 64 Hz frequency and with a fixed phase relationship to the heater driver signals. This sensor produces large signals near atmospheric pressure, declining to 7 (mu) V below 0.1 mTorr. Phase measurements between 760 and 100 Torr where the air's thermal conductivity changes little, combined with amplitude changes at low pressure generate a pressure measurement accurate at 5 percent from 760 Torr to 10 mTorr, sensing of induced temperature changes of 0.001 degree C.

  16. Measurement of phase difference for micromachined gyros driven by rotating aircraft.

    PubMed

    Zhang, Zengping; Zhang, Fuxue; Zhang, Wei

    2013-08-21

    This paper presents an approach for realizing a phase difference measurement of a new gyro. A silicon micromachined gyro was mounted on rotating aircraft for aircraft attitude control. Aircraft spin drives the silicon pendulum of a gyro rotating at a high speed so that it can sense the transverse angular velocity of the rotating aircraft based on the gyroscopic precession principle when the aircraft has transverse rotation. In applications of the rotating aircraft single channel control system, such as damping in the attitude stabilization loop, the gyro signal must be kept in sync with the control signal. Therefore, the phase difference between both signals needs to be measured accurately. Considering that phase difference is mainly produced by both the micromachined part and the signal conditioning circuit, a mathematical model has been established and analyzed to determine the gyro's phase frequency characteristics. On the basis of theoretical analysis, a dynamic simulation has been done for a case where the spin frequency is 15 Hz. Experimental results with the proposed measurement method applied to a silicon micromachined gyro driven by a rotating aircraft demonstrate that it is effective in practical applications. Measured curve and numerical analysis of phase frequency characteristic are in accordance, and the error between measurement and simulation is only 5.3%.

  17. Fabrication of an Absorber-Coupled MKID Detector

    NASA Technical Reports Server (NTRS)

    Brown, Ari; Hsieh, Wen-Ting; Moseley, Samuel; Stevenson, Thomas; U-Yen, Kongpop; Wollack, Edward

    2012-01-01

    Absorber-coupled microwave kinetic inductance detector (MKID) arrays were developed for submillimeter and far-infrared astronomy. These sensors comprise arrays of lambda/2 stepped microwave impedance resonators patterned on a 1.5-mm-thick silicon membrane, which is optimized for optical coupling. The detector elements are supported on a 380-mm-thick micro-machined silicon wafer. The resonators consist of parallel plate aluminum transmission lines coupled to low-impedance Nb microstrip traces of variable length, which set the resonant frequency of each resonator. This allows for multiplexed microwave readout and, consequently, good spatial discrimination between pixels in the array. The transmission lines simultaneously act to absorb optical power and employ an appropriate surface impedance and effective filling fraction. The fabrication techniques demonstrate high-fabrication yield of MKID arrays on large, single-crystal membranes and sub-micron front-to-back alignment of the micro strip circuit. An MKID is a detector that operates upon the principle that a superconducting material s kinetic inductance and surface resistance will change in response to being exposed to radiation with a power density sufficient to break its Cooper pairs. When integrated as part of a resonant circuit, the change in surface impedance will result in a shift in its resonance frequency and a decrease of its quality factor. In this approach, incident power creates quasiparticles inside a superconducting resonator, which is configured to match the impedance of free space in order to absorb the radiation being detected. For this reason MKIDs are attractive for use in large-format focal plane arrays, because they are easily multiplexed in the frequency domain and their fabrication is straightforward. The fabrication process can be summarized in seven steps: (1) Alignment marks are lithographically patterned and etched all the way through a silicon on insulator (SOI) wafer, which consists of a thin silicon membrane bonded to a thick silicon handle wafer. (2) The metal microwave circuitry on the front of the membrane is patterned and etched. (3) The wafer is then temporarily bonded with wafer wax to a Pyrex wafer, with the SOI side abutting the Pyrex. (4) The silicon handle component of the SOI wafer is subsequently etched away so as to expose the membrane backside. (5) The wafer is flipped over, and metal microwave circuitry is patterned and etched on the membrane backside. Furthermore, cuts in the membrane are made so as to define the individual detector array chips. (6) Silicon frames are micromachined and glued to the silicon membrane. (7) The membranes, which are now attached to the frames, are released from the Pyrex wafer via dissolution of the wafer wax in acetone.

  18. Planar rotational magnetic micromotors with integrated shaft encoder and magnetic rotor levitation

    NASA Technical Reports Server (NTRS)

    Guckel, Henry; Christenson, T. R.; Skrobis, K. J.; Klein, J.; Karnowsky, M.

    1994-01-01

    Deep x-ray lithography and electroplating may be combined to form a fabrication tool for micromechanical devices with large structural heights, to 500 micron, and extreme edge acuities, less than 0.1 micron-run-out per 100 micron of height. This process concept which originated in Germany as LIGA may be further extended by adding surface micromachining. This extension permits the fabrication of precision metal and plastic parts which may be assembled into three-dimensional micromechanical components and systems. The processing tool may be used to fabricate devices from ferromagnetic material such as nickel and nickel-iron alloys. These materials when properly heat treated exhibit acceptable magnetic behavior for current to flux conversion and marginal behavior for permanent magnet applications. The tool and materials have been tested via planar, magnetic, rotational micromotor fabrication. Three phase reluctance machines of the 6:4 configuration with 280 micron diameter rotors have been tested and analyzed. Stable rotational speeds to 34,000 rpm with output torques above 10 x 10(exp -9) N-m have been obtained. The behavior is monitored with integrated shaft encoders which are photodiodes which measure the rotor response. Magnetic levitation of the rotor via reluctance forces has been achieved and has reduced frictional torque losses to less than 1 percent of the available torque. The results indicate that high speed limits of these actuators are related to torque ripple. Hysteresis motors with magnetic bearings are under consideration and will produce high speed rotational machines with excellent sensor application potential.

  19. Monolithic Composite “Pressure + Acceleration + Temperature + Infrared” Sensor Using a Versatile Single-Sided “SiN/Poly-Si/Al” Process-Module

    PubMed Central

    Ni, Zao; Yang, Chen; Xu, Dehui; Zhou, Hong; Zhou, Wei; Li, Tie; Xiong, Bin; Li, Xinxin

    2013-01-01

    We report a newly developed design/fabrication module with low-cost single-sided “low-stress-silicon-nitride (LS-SiN)/polysilicon (poly-Si)/Al” process for monolithic integration of composite sensors for sensing-network-node applications. A front-side surface-/bulk-micromachining process on a conventional Si-substrate is developed, featuring a multifunctional SiN/poly-Si/Al layer design for diverse sensing functions. The first “pressure + acceleration + temperature + infrared” (PATIR) composite sensor with the chip size of 2.5 mm × 2.5 mm is demonstrated. Systematic theoretical design and analysis methods are developed. The diverse sensing components include a piezoresistive absolute-pressure sensor (up to 700 kPa, with a sensitivity of 49 mV/MPa under 3.3 V supplied voltage), a piezoresistive accelerometer (±10 g, with a sensitivity of 66 μV/g under 3.3 V and a −3 dB bandwidth of 780 Hz), a thermoelectric infrared detector (with a responsivity of 45 V/W and detectivity of 3.6 × 107 cm·Hz1/2/W) and a thermistor (−25–120 °C). This design/fabrication module concept enables a low-cost monolithically-integrated “multifunctional-library” technique. It can be utilized as a customizable tool for versatile application-specific requirements, which is very useful for small-size, low-cost, large-scale sensing-network node developments. PMID:23325169

  20. Flight Qualified Micro Sun Sensor

    NASA Technical Reports Server (NTRS)

    Liebe, Carl Christian; Mobasser, Sohrab; Wrigley, Chris; Schroeder, Jeffrey; Bae, Youngsam; Naegle, James; Katanyoutanant, Sunant; Jerebets, Sergei; Schatzel, Donald; Lee, Choonsup

    2007-01-01

    A prototype small, lightweight micro Sun sensor (MSS) has been flight qualified as part of the attitude-determination system of a spacecraft or for Mars surface operations. The MSS has previously been reported at a very early stage of development in NASA Tech Briefs, Vol. 28, No. 1 (January 2004). An MSS is essentially a miniature multiple-pinhole electronic camera combined with digital processing electronics that functions analogously to a sundial. A micromachined mask containing a number of microscopic pinholes is mounted in front of an active-pixel sensor (APS). Electronic circuits for controlling the operation of the APS, readout from the pixel photodetectors, and analog-to-digital conversion are all integrated onto the same chip along with the APS. The digital processing includes computation of the centroids of the pinhole Sun images on the APS. The spacecraft computer has the task of converting the Sun centroids into Sun angles utilizing a calibration polynomial. The micromachined mask comprises a 500-micron-thick silicon wafer, onto which is deposited a 57-nm-thick chromium adhesion- promotion layer followed by a 200-nm-thick gold light-absorption layer. The pinholes, 50 microns in diameter, are formed in the gold layer by photolithography. The chromium layer is thin enough to be penetrable by an amount of Sunlight adequate to form measurable pinhole images. A spacer frame between the mask and the APS maintains a gap of .1 mm between the pinhole plane and the photodetector plane of the APS. To minimize data volume, mass, and power consumption, the digital processing of the APS readouts takes place in a single field-programmable gate array (FPGA). The particular FPGA is a radiation- tolerant unit that contains .32,000 gates. No external memory is used so the FPGA calculates the centroids in real time as pixels are read off the APS with minimal internal memory. To enable the MSS to fit into a small package, the APS, the FPGA, and other components are mounted on a single two-sided board following chip-on-board design practices

  1. A high-frequency transimpedance amplifier for CMOS integrated 2D CMUT array towards 3D ultrasound imaging.

    PubMed

    Huang, Xiwei; Cheong, Jia Hao; Cha, Hyouk-Kyu; Yu, Hongbin; Je, Minkyu; Yu, Hao

    2013-01-01

    One transimpedance amplifier based CMOS analog front-end (AFE) receiver is integrated with capacitive micromachined ultrasound transducers (CMUTs) towards high frequency 3D ultrasound imaging. Considering device specifications from CMUTs, the TIA is designed to amplify received signals from 17.5MHz to 52.5MHz with center frequency at 35MHz; and is fabricated in Global Foundry 0.18-µm 30-V high-voltage (HV) Bipolar/CMOS/DMOS (BCD) process. The measurement results show that the TIA with power-supply 6V can reach transimpedance gain of 61dBΩ and operating frequency from 17.5MHz to 100MHz. The measured input referred noise is 27.5pA/√Hz. Acoustic pulse-echo testing is conducted to demonstrate the receiving functionality of the designed 3D ultrasound imaging system.

  2. Thermoelectric Device Fabrication Using Thermal Spray and Laser Micromachining

    NASA Astrophysics Data System (ADS)

    Tewolde, Mahder; Fu, Gaosheng; Hwang, David J.; Zuo, Lei; Sampath, Sanjay; Longtin, Jon P.

    2016-02-01

    Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are used in many engineering applications such as vehicle and industrial waste-heat recovery systems to provide electrical power, improve operating efficiency and reduce costs. State-of-art TEG manufacturing is based on prefabricated materials and a labor-intensive process involving soldering, epoxy bonding, and mechanical clamping for assembly. This reduces their durability and raises costs. Additive manufacturing technologies, such as thermal spray, present opportunities to overcome these challenges. In this work, TEGs have been fabricated for the first time using thermal spray technology and laser micromachining. The TEGs are fabricated directly onto engineering component surfaces. First, current fabrication techniques of TEGs are presented. Next, the steps required to fabricate a thermal spray-based TEG module, including the formation of the metallic interconnect layers and the thermoelectric legs are presented. A technique for bridging the air gap between two adjacent thermoelectric elements for the top layer using a sacrificial filler material is also demonstrated. A flat 50.8 mm × 50.8 mm TEG module is fabricated using this method and its performance is experimentally characterized and found to be in agreement with expected values of open-circuit voltage based on the materials used.

  3. Metal Alloy ICF Capsules Created by Electrodeposition

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

    Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

  4. Picosecond laser micromachining prior to FIB milling for electronic microscopy sample preparation

    NASA Astrophysics Data System (ADS)

    Sikora, Aurélien; Fares, Lahouari; Adrian, Jérôme; Goubier, Vincent; Delobbe, Anne; Corbin, Antoine; Sentis, Marc; Sarnet, Thierry

    2017-10-01

    In order to check the manufacturing quality of electronic components using electron microscopy, the area of interest must be exposed. This requires the removal of a large quantity of matter without damaging the surrounding area. This step can be accomplished using ion milling but the processing can last a few hours. In order to accelerate the preparation of the samples, picosecond laser micromachining prior to Focused Ion Beam polishing is envisioned. Laser ablation allows the fast removal of matter but induces damages around the ablated area. Therefore the process has to be optimized in order to limit the size of both the heat affected zone and induced dislocation zone. For this purpose, cavities have been engraved in silicon and in electronic components, using a linearly polarized picosecond laser (∼50 ps) at three different wavelengths (343, 515 and 1030 nm). Results showed that the cross sectional shapes and the surface topologies can be tuned by the laser fluence and the number of pulses. Clear cross sections of bumps and cavity openings, exposing multilayer interfaces, are demonstrated. The silicon removal rates, tuned by the applied energy density, have been measured. Removal rates achieved at 200 kHz were typically hundred times higher than those achieved by ion milling and the best efficiency was obtained at 343 nm.

  5. MEMS deformable mirror embedded wavefront sensing and control system

    NASA Astrophysics Data System (ADS)

    Owens, Donald; Schoen, Michael; Bush, Keith

    2006-01-01

    Electrostatic Membrane Deformable Mirror (MDM) technology developed using silicon bulk micro-machining techniques offers the potential of providing low-cost, compact wavefront control systems for diverse optical system applications. Electrostatic mirror construction using bulk micro-machining allows for custom designs to satisfy wavefront control requirements for most optical systems. An electrostatic MDM consists of a thin membrane, generally with a thin metal or multi-layer high-reflectivity coating, suspended over an actuator pad array that is connected to a high-voltage driver. Voltages applied to the array elements deflect the membrane to provide an optical surface capable of correcting for measured optical aberrations in a given system. Electrostatic membrane DM designs are derived from well-known principles of membrane mechanics and electrostatics, the desired optical wavefront control requirements, and the current limitations of mirror fabrication and actuator drive electronics. MDM performance is strongly dependent on mirror diameter and air damping in meeting desired spatial and temporal frequency requirements. In this paper, we present wavefront control results from an embedded wavefront control system developed around a commercially available high-speed camera and an AgilOptics Unifi MDM driver using USB 2.0 communications and the Linux development environment. This new product, ClariFast TM, combines our previous Clarifi TM product offering into a faster more streamlined version dedicated strictly to Hartmann Wavefront sensing.

  6. Metal Alloy ICF Capsules Created by Electrodeposition

    DOE PAGES

    Horwood, Corie; Stadermann, Michael; Bunn, Thomas L.

    2017-12-04

    Electrochemical deposition is an attractive alternative to physical vapor deposition and micromachining to produce metal capsules for inertial confinement fusion (ICF). Electrochemical deposition (also referred to as electrodeposition or plating) is expected to produce full-density metal capsules without seams or inclusions of unwanted atomic constituents, the current shortcomings of micromachine and physical vapor deposition, respectively. In this paper, we discuss new cathode designs that allow for the rapid electrodeposition of gold and copper alloys on spherical mandrels by making transient contact with the constantly moving spheres. Electrodeposition of pure gold, copper, platinum, and alloys of gold-copper and gold-silver are demonstrated,more » with nonporous coatings of >40 µm achieved in only a few hours of plating. The surface roughness of the spheres after electrodeposition is comparable to the starting mandrel, and the coatings appear to be fully dense with no inclusions. A detailed understanding of the electrodeposition conditions that result in different alloy compositions and plating rates will allow for the electrodeposition of graded alloys on spheres in the near future. Finally, this report on the electrodeposition of metals on spherical mandrels is an important first step toward the fabrication of graded-density metal capsules for ICF experiments at the National Ignition Facility.« less

  7. Micromachining of silicon carbide on silicon fabricated by low-pressure chemical vapour deposition

    NASA Astrophysics Data System (ADS)

    Behrens, Ingo; Peiner, Erwin; Bakin, Andrey S.; Schlachetzki, Andreas

    2002-07-01

    We describe the fabrication of silicon carbide layers for micromechanical applications using low-pressure metal-organic chemical vapour deposition at temperatures below 1000 °C. The layers can be structured by lift-off using silicon dioxide as a sacrificial layer. A large selectivity with respect to silicon can be exploited for bulk micromachining. Thin membranes are fabricated which exhibit high mechanical quality, as necessary for applications in harsh environments.

  8. Micromachined Tunable Fabry-Perot Filters for Infrared Astronomy

    NASA Technical Reports Server (NTRS)

    Barclay, Richard; Bier, Alexander; Chen, Tina; DiCamillo, Barbara; Deming, Drake; Greenhouse, Matthew; Henry, Ross; Hewagama, Tilak; Jacobson, Mindy; Loughlin, James; hide

    2002-01-01

    Micromachined Fabry-Perot tunable filters with a large clear aperture (12.5 to 40 mm) are being developed as an optical component for wide-field imaging 1:1 spectroscopy. This program applies silicon micromachining fabrication techniques to miniaturize Fabry-Perot filters for astronomical science instruments. The filter assembly consists of a stationary etalon plate mated to a plate in which the etalon is free to move along the optical axis on silicon springs attached to a stiff silicon support ring. The moving etalon is actuated electrostatically by electrode pairs on the fixed and moving etalons. To reduce mass, both etalons are fabricated by applying optical coatings to a thin freestanding silicon nitride film held flat in drumhead tension rather than to a thick optical substrate. The design, electro-mechanical modeling, fabrication, and initial results will be discussed. The potential application of the miniature Fabry-Perot filters will be briefly discussed with emphasis on the detection of extra-solar planets.

  9. Experimental determination of micromachined discrete and continuous device spring constants using nanoindentation method

    NASA Astrophysics Data System (ADS)

    Chan, M. L.; Tay, Francis E.; Logeeswaran, V. J.; Zeng, Kaiyang; Shen, Lu; Chau, Fook S.

    2002-04-01

    A rapid and accurate static and quasi-static method for determining the out-of-plane spring constraints of cantilevers and a micromachined vibratory sensor is presented. In the past, much of the effort in nanoindentation application was to investigate the thin-film mechanical properties. In this paper, we have utilized the nanoindentation method to measure directly some micromachined device (e.g. microgyroscope) spring constants. The cantilevers and devices tested were fabricated using the MUMPS process and an SOI process (patent pending). Spring constants are determined using a commercial nanoindentation apparatus UMIS-2000 configured with both Berkovich and spherical indenter tip that can be placed onto the device with high accuracy. Typical load resolution is 20micrometers N to 0.5N and a displacement resolution of 0.05nm. Information was deduced from the penetration depth versus load curves during both loading and unloading.

  10. Femtosecond laser micromachining of compound parabolic concentrator fiber tipped glucose sensors.

    PubMed

    Hassan, Hafeez Ul; Lacraz, Amédée; Kalli, Kyriacos; Bang, Ole

    2017-03-01

    We report on highly accurate femtosecond (fs) laser micromachining of a compound parabolic concentrator (CPC) fiber tip on a polymer optical fiber (POF). The accuracy is reflected in an unprecedented correspondence between the numerically predicted and experimentally found improvement in fluorescence pickup efficiency of a Förster resonance energy transfer-based POF glucose sensor. A Zemax model of the CPC-tipped sensor predicts an optimal improvement of a factor of 3.96 compared to the sensor with a plane-cut fiber tip. The fs laser micromachined CPC tip showed an increase of a factor of 3.5, which is only 11.6% from the predicted value. Earlier state-of-the-art fabrication of the CPC-shaped tip by fiber tapering was of so poor quality that the actual improvement was 43% lower than the predicted improvement of the ideal CPC shape.

  11. Femtosecond laser micromachining of compound parabolic concentrator fiber tipped glucose sensors

    NASA Astrophysics Data System (ADS)

    Hassan, Hafeez Ul; Lacraz, Amédée; Kalli, Kyriacos; Bang, Ole

    2017-03-01

    We report on highly accurate femtosecond (fs) laser micromachining of a compound parabolic concentrator (CPC) fiber tip on a polymer optical fiber (POF). The accuracy is reflected in an unprecedented correspondence between the numerically predicted and experimentally found improvement in fluorescence pickup efficiency of a Förster resonance energy transfer-based POF glucose sensor. A Zemax model of the CPC-tipped sensor predicts an optimal improvement of a factor of 3.96 compared to the sensor with a plane-cut fiber tip. The fs laser micromachined CPC tip showed an increase of a factor of 3.5, which is only 11.6% from the predicted value. Earlier state-of-the-art fabrication of the CPC-shaped tip by fiber tapering was of so poor quality that the actual improvement was 43% lower than the predicted improvement of the ideal CPC shape.

  12. Biomimetic wall-shaped hierarchical microstructure for gecko-like attachment.

    PubMed

    Kasem, Haytam; Tsipenyuk, Alexey; Varenberg, Michael

    2015-04-21

    Most biological hairy adhesive systems involved in locomotion rely on spatula-shaped terminal elements, whose operation has been actively studied during the last decade. However, though functional principles underlying their amazing performance are now well understood, due to technical difficulties in manufacturing the complex structure of hierarchical spatulate systems, a biomimetic surface structure featuring true shear-induced dynamic attachment still remains elusive. To try bridging this gap, a novel method of manufacturing gecko-like attachment surfaces is devised based on a laser-micromachining technology. This method overcomes the inherent disadvantages of photolithography techniques and opens wide perspectives for future production of gecko-like attachment systems. Advanced smart-performance surfaces featuring thin-film-based hierarchical shear-activated elements are fabricated and found capable of generating friction force of several tens of times the contact load, which makes a significant step forward towards a true gecko-like adhesive.

  13. Modeling of solid-state and excimer laser processes for 3D micromachining

    NASA Astrophysics Data System (ADS)

    Holmes, Andrew S.; Onischenko, Alexander I.; George, David S.; Pedder, James E.

    2005-04-01

    An efficient simulation method has recently been developed for multi-pulse ablation processes. This is based on pulse-by-pulse propagation of the machined surface according to one of several phenomenological models for the laser-material interaction. The technique allows quantitative predictions to be made about the surface shapes of complex machined parts, given only a minimal set of input data for parameter calibration. In the case of direct-write machining of polymers or glasses with ns-duration pulses, this data set can typically be limited to the surface profiles of a small number of standard test patterns. The use of phenomenological models for the laser-material interaction, calibrated by experimental feedback, allows fast simulation, and can achieve a high degree of accuracy for certain combinations of material, laser and geometry. In this paper, the capabilities and limitations of the approach are discussed, and recent results are presented for structures machined in SU8 photoresist.

  14. Mechanical memory

    DOEpatents

    Gilkey, Jeffrey C [Albuquerque, NM; Duesterhaus, Michelle A [Albuquerque, NM; Peter, Frank J [Albuquerque, NM; Renn, Rosemarie A [Alburquerque, NM; Baker, Michael S [Albuquerque, NM

    2006-08-15

    A first-in-first-out (FIFO) microelectromechanical memory apparatus (also termed a mechanical memory) is disclosed. The mechanical memory utilizes a plurality of memory cells, with each memory cell having a beam which can be bowed in either of two directions of curvature to indicate two different logic states for that memory cell. The memory cells can be arranged around a wheel which operates as a clocking actuator to serially shift data from one memory cell to the next. The mechanical memory can be formed using conventional surface micromachining, and can be formed as either a nonvolatile memory or as a volatile memory.

  15. Mechanical memory

    DOEpatents

    Gilkey, Jeffrey C [Albuquerque, NM; Duesterhaus, Michelle A [Albuquerque, NM; Peter, Frank J [Albuquerque, NM; Renn, Rosemarie A [Albuquerque, NM; Baker, Michael S [Albuquerque, NM

    2006-05-16

    A first-in-first-out (FIFO) microelectromechanical memory apparatus (also termed a mechanical memory) is disclosed. The mechanical memory utilizes a plurality of memory cells, with each memory cell having a beam which can be bowed in either of two directions of curvature to indicate two different logic states for that memory cell. The memory cells can be arranged around a wheel which operates as a clocking actuator to serially shift data from one memory cell to the next. The mechanical memory can be formed using conventional surface micromachining, and can be formed as either a nonvolatile memory or as a volatile memory.

  16. Fiber-optical switch using cam-micromotor driven by scratch drive actuators

    NASA Astrophysics Data System (ADS)

    Kanamori, Y.; Aoki, Y.; Sasaki, M.; Hosoya, H.; Wada, A.; Hane, K.

    2005-01-01

    We fabricated a 1 × 1 fiber-optic switch using a cam-micromotor driven by scratch drive actuators (SDAs). Using the cam-micromotor, mechanical translation and precise positioning of an optical fiber were performed. An optical fiber of diameter 50 µm was bent and pushed out with a cam-mechanism driven by the SDAs fabricated by surface micromachining. The maximum rotation speed of the cam-micromotor was 7.5 rpm at a driving frequency of 1.5 kHz. The transient time of the switch to attenuate coupling efficiency less than -40 dB was around 10 ms.

  17. Electrically-programmable diffraction grating

    DOEpatents

    Ricco, Antonio J.; Butler, Michael A.; Sinclair, Michael B.; Senturia, Stephen D.

    1998-01-01

    An electrically-programmable diffraction grating. The programmable grating includes a substrate having a plurality of electrodes formed thereon and a moveable grating element above each of the electrodes. The grating elements are electrostatically programmable to form a diffraction grating for diffracting an incident beam of light as it is reflected from the upper surfaces of the grating elements. The programmable diffraction grating, formed by a micromachining process, has applications for optical information processing (e.g. optical correlators and computers), for multiplexing and demultiplexing a plurality of light beams of different wavelengths (e.g. for optical fiber communications), and for forming spectrometers (e.g. correlation and scanning spectrometers).

  18. Femtosecond laser micromachining of waveguides in silicone-based hydrogel polymers.

    PubMed

    Ding, Li; Blackwell, Richard I; Künzler, Jay F; Knox, Wayne H

    2008-06-10

    By tightly focusing 27 fs laser pulses from a Ti:sapphire oscillator with 1.3 nJ pulse energy at 93 MHz repetition rate, we are able to fabricate optical waveguides inside hydrogel polymers containing approximately 36% water by weight. A tapered lensed fiber is used to couple laser light at a wavelength of 632.8 nm into these waveguides within a water environment. Strong waveguiding is observed due to large refractive index changes. A large waveguide propagation loss is found, and we show that this is caused by surface roughness which can be reduced by optimizing the waveguides.

  19. Three-dimensional micro electromechanical system piezoelectric ultrasound transducer

    NASA Astrophysics Data System (ADS)

    Hajati, Arman; Latev, Dimitre; Gardner, Deane; Hajati, Azadeh; Imai, Darren; Torrey, Marc; Schoeppler, Martin

    2012-12-01

    Here we present the design and experimental acoustic test data for an ultrasound transducer technology based on a combination of micromachined dome-shaped piezoelectric resonators arranged in a flexible architecture. Our high performance niobium-doped lead zirconate titanate film is implemented in three-dimensional dome-shaped structures, which form the basic resonating cells. Adjustable frequency response is realized by mixing these basic cells and modifying their dimensions by lithography. Improved characteristics such as high sensitivity, adjustable wide-bandwidth frequency response, low transmit voltage compatible with ordinary integrated circuitry, low electrical impedance well matched to coaxial cabling, and intrinsic acoustic impedance match to water are demonstrated.

  20. Passive ultrasonics using sub-Nyquist sampling of high-frequency thermal-mechanical noise.

    PubMed

    Sabra, Karim G; Romberg, Justin; Lani, Shane; Degertekin, F Levent

    2014-06-01

    Monolithic integration of capacitive micromachined ultrasonic transducer arrays with low noise complementary metal oxide semiconductor electronics minimizes interconnect parasitics thus allowing the measurement of thermal-mechanical (TM) noise. This enables passive ultrasonics based on cross-correlations of diffuse TM noise to extract coherent ultrasonic waves propagating between receivers. However, synchronous recording of high-frequency TM noise puts stringent requirements on the analog to digital converter's sampling rate. To alleviate this restriction, high-frequency TM noise cross-correlations (12-25 MHz) were estimated instead using compressed measurements of TM noise which could be digitized at a sampling frequency lower than the Nyquist frequency.

  1. An optical microsystem based on vertical silicon-air Bragg mirror for liquid substances monitoring

    NASA Astrophysics Data System (ADS)

    De Stefano, Luca; Rendina, Ivo; Rea, Ilaria; Rotiroti, Lucia; De Tommasi, Edoardo; Barillaro, Giuseppe

    2007-05-01

    In this work, an integrated optical microsystems for the continuous detection of flammable liquids has been fabricated and characterized. The proposed system is composed of a the transducer element, which is a vertical silicon/air Bragg mirror fabricated by silicon electrochemical micromachining, sealed with a cover glass anodically bonded on its top. The device has been optically characterized in presence of liquid substances of environmental interest, such as ethanol and isopropanol. The preliminary experimental results are in good agreement with the theoretical calculations and show the possibility to use the device as an optical sensor based on the change of its reflectivity spectrum.

  2. Integrated HIFU Drive System on a Chip for CMUT-Based Catheter Ablation System.

    PubMed

    Farhanieh, Omid; Sahafi, Ali; Bardhan Roy, Rupak; Ergun, Arif Sanli; Bozkurt, Ayhan

    2017-06-01

    Conventional High Intensity Focused Ultrasound (HIFU) is a therapeutic modality which is extracorporeally administered. In applications where a relatively small HIFU lesion is required, an intravascular HIFU probe can be deployed to the ablation site. In this paper, we demonstrate the design and implementation a fully integrated HIFU drive system on a chip to be placed on a 6 Fr catheter probe. An 8-element capacitive micromachined ultrasound transducer (CMUT) ring array of 2 mm diameter has been used as the ultrasound source. The driver chip is fabricated in 0.35 μm AMS high-voltage CMOS technology and comprises eight continuous-wave (CW) high-voltage CMUT drivers (10.9 ns and 9.4 ns rise and fall times at 20 V pp output into a 15 pF), an eight-channel digital beamformer (8-12 MHz output frequency with 11.25 ° phase accuracy) and a phase locked loop with an integrated VCO as a tunable clock source (128-192 MHz). The chip occupies 1.85 × 1.8 mm 2 area including input and output (I/O) pads. When the transducer array is immersed in sunflower oil and driven by the IC with eight 20 V pp CW pulses at 10 MHz, real-time thermal images of the HIFU beam indicate that the focal temperature rises by 16.8  ° C in 11 seconds. Each HV driver consumes around 67 mW of power when driving the CMUT array at 10 MHz, which adds up to 560 mW for the whole chip. FEM based analysis reveals that the outer surface temperature of the catheter is expected to remain below the 42  ° C tissue damage limit during therapy.

  3. Femtosecond Laser Microfabrication of an Integrated Device for Optical Release and Sensing of Bioactive Compounds

    PubMed Central

    Ghezzi, Diego; Vazquez, Rebeca Martinez; Osellame, Roberto; Valtorta, Flavia; Pedrocchi, Alessandra; Valle, Giuseppe Della; Ramponi, Roberta; Ferrigno, Giancarlo; Cerullo, Giulio

    2008-01-01

    Flash photolysis of caged compounds is one of the most powerful approaches to investigate the dynamic response of living cells. Monolithically integrated devices suitable for optical uncaging are in great demand since they greatly simplify the experiments and allow their automation. Here we demonstrate the fabrication of an integrated bio-photonic device for the optical release of caged compounds. Such a device is fabricated using femtosecond laser micromachining of a glass substrate. More in detail, femtosecond lasers are used both to cut the substrate in order to create a pit for cell growth and to inscribe optical waveguides for spatially selective uncaging of the compounds present in the culture medium. The operation of this monolithic bio-photonic device is tested using both free and caged fluorescent compounds to probe its capability of multipoint release and optical sensing. Application of this device to the study of neuronal network activity can be envisaged. PMID:27873888

  4. An implantable integrated low-power amplifier-microelectrode array for Brain-Machine Interfaces.

    PubMed

    Patrick, Erin; Sankar, Viswanath; Rowe, William; Sanchez, Justin C; Nishida, Toshikazu

    2010-01-01

    One of the important challenges in designing Brain-Machine Interfaces (BMI) is to build implantable systems that have the ability to reliably process the activity of large ensembles of cortical neurons. In this paper, we report the design, fabrication, and testing of a polyimide-based microelectrode array integrated with a low-power amplifier as part of the Florida Wireless Integrated Recording Electrode (FWIRE) project at the University of Florida developing a fully implantable neural recording system for BMI applications. The electrode array was fabricated using planar micromachining MEMS processes and hybrid packaged with the amplifier die using a flip-chip bonding technique. The system was tested both on bench and in-vivo. Acute and chronic neural recordings were obtained from a rodent for a period of 42 days. The electrode-amplifier performance was analyzed over the chronic recording period with the observation of a noise floor of 4.5 microVrms, and an average signal-to-noise ratio of 3.8.

  5. Micromachined devices: the impact of controlled geometry from cell-targeting to bioavailability.

    PubMed

    Tao, Sarah L; Desai, Tejal A

    2005-12-05

    Advances in microelectomechanical systems (MEMS) have allowed the microfabrication of polymeric substrates and the development of a novel class of controlled delivery devices. These vehicles have specifically tailored three-dimensional physical and chemical features which, together, provide the capacity to target cells, promote unidirectional controlled release, and enhance permeation across the intestinal epithelial barrier. Examining the biological response at the microdevice biointerface may provide insight into the benefits of customized surface chemistry and structure in terms of complex drug delivery vehicle design. Therefore, the aim of this work was to determine the interfacial effects of selective surface chemistry and architecture of tomato lectin (TL)-modified poly(methyl methacrylate) (PMMA) drug delivery microdevices on the Caco-2 cell line, a model of the gastrointestinal tract.

  6. A high-average-power FEL for industrial applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Dylla, H.F.; Benson, S.; Bisognano, J.

    1995-12-31

    CEBAF has developed a comprehensive conceptual design of an industrial user facility based on a kilowatt UV (150-1000 nm) and IR (2-25 micron) FEL driven by a recirculating, energy-recovering 200 MeV superconducting radio-frequency (SRF) accelerator. FEL users{endash}CEBAF`s partners in the Laser Processing Consortium, including AT&T, DuPont, IBM, Northrop-Grumman, 3M, and Xerox{endash}plan to develop applications such as polymer surface processing, metals and ceramics micromachining, and metal surface processing, with the overall effort leading to later scale-up to industrial systems at 50-100 kW. Representative applications are described. The proposed high-average-power FEL overcomes limitations of conventional laser sources in available power, cost-effectiveness, tunabilitymore » and pulse structure. 4 refs., 3 figs., 2 tabs.« less

  7. Chip-scale sensor system integration for portable health monitoring.

    PubMed

    Jokerst, Nan M; Brooke, Martin A; Cho, Sang-Yeon; Shang, Allan B

    2007-12-01

    The revolution in integrated circuits over the past 50 yr has produced inexpensive computing and communications systems that are powerful and portable. The technologies for these integrated chip-scale sensing systems, which will be miniature, lightweight, and portable, are emerging with the integration of sensors with electronics, optical systems, micromachines, microfluidics, and the integration of chemical and biological materials (soft/wet material integration with traditional dry/hard semiconductor materials). Hence, we stand at a threshold for health monitoring technology that promises to provide wearable biochemical sensing systems that are comfortable, inauspicious, wireless, and battery-operated, yet that continuously monitor health status, and can transmit compressed data signals at regular intervals, or alarm conditions immediately. In this paper, we explore recent results in chip-scale sensor integration technology for health monitoring. The development of inexpensive chip-scale biochemical optical sensors, such as microresonators, that are customizable for high sensitivity coupled with rapid prototyping will be discussed. Ground-breaking work in the integration of chip-scale optical systems to support these optical sensors will be highlighted, and the development of inexpensive Si complementary metal-oxide semiconductor circuitry (which makes up the vast majority of computational systems today) for signal processing and wireless communication with local receivers that lie directly on the chip-scale sensor head itself will be examined.

  8. Terahertz-Regime, Micro-VEDs: Evaluation of Micromachined TWT Conceptual Designs

    NASA Technical Reports Server (NTRS)

    Booske, John H.; Kory, Carol L.; Gallagher, D.; van der Weide, Daniel W.; Limbach, S; Gustafson, P; Lee, W.-J.; Gallagher, S.; Jain, K.

    2001-01-01

    Summary form only given. The Terahertz (THz) region of the electromagnetic spectrum (approx.300-3000 GHz) has enormous potential for high-data-rate communications, spectroscopy, astronomy, space research, medicine, biology, surveillance, remote sensing, industrial process control, etc. The most critical roadblock to full exploitation of the THz band is lack of coherent radiation sources that are powerful (0.01-10.0 W continuous wave), efficient (>1 %), frequency agile (instantaneously tunable over 1% bandwidths or more), reliable, and relatively inexpensive. Micro-machined Vacuum Electron Devices (micro-VEDs) represent a promising solution. We describe prospects for miniature, THz-regime TWTs fabricated using micromachining techniques. Several approx.600 GHz conceptual designs are compared. Their expected performance has been analyzed using SD, 2.51), and 3D TWT codes. A folded waveguide (FWG) TWT forward-wave amplifier design is presented based on a Northrop Grumman (NGC) optimized design procedure. This conceptual device is compared to the simulated performance of a novel, micro-VED helix TWT. Conceptual FWG TWT backward-wave amplifiers and oscillators are also discussed. A scaled (100 GHz) FWG TWT operating at a relatively low voltage (-12 kV) is under development at NGC. Also, actual-size micromachining experiments are planned to evaluate the feasibility of arrays of micro-VED TWTs. Progress and results of these efforts are described. This work was supported, in part by AFOSR, ONR, and NSF.

  9. Micromachined High Frequency PMN-PT/Epoxy 1-3 Composite Ultrasonic Annular Array

    PubMed Central

    Liu, Changgeng; Djuth, Frank; Li, Xiang; Chen, Ruimin; Zhou, Qifa; Shung, K. Kirk

    2013-01-01

    This paper reports the design, fabrication, and performance of miniature micromachined high frequency PMN-PT/epoxy 1-3 composite ultrasonic annular arrays. The PMN-PT single crystal 1-3 composites were made with micromachining techniques. The area of a single crystal pillar was 9 μm × 9 μm. The width of the kerf among pillars was ~ 5 μm and the kerfs were filled with a polymer. The composite thickness was 25 μm. A six-element annular transducer of equal element area of 0.2 mm2 with 16 μm kerf widths between annuli was produced. The aperture size the array transducer is about 1.5 mm in diameter. A novel electrical interconnection strategy for high density array elements was implemented. After the transducer was attached to the electric connection board and packaged, the array transducer was tested in a pulse/echo arrangement, whereby the center frequency, bandwidth, two-way insertion loss (IL), and cross talk between adjacent elements were measured for each annulus. The center frequency was 50 MHz and -6 dB bandwidth was 90%. The average insertion loss was 19.5 dB at 50 MHz and the crosstalk between adjacent elements was about -35 dB. The micromachining techniques described in this paper are promising for the fabrication of other types of high frequency transducers e.g. 1D and 2D arrays. PMID:22119324

  10. Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays.

    PubMed

    Ciçek, Ihsan; Bozkurt, Ayhan; Karaman, Mustafa

    2005-12-01

    Integration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 X 4 array of the designed circuit cells, each cell occupying a 200 X 200 microm2 area, was formed for the initial test studies and scheduled for fabrication in 0.8 microm, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.

  11. Fabrication of multi-scale periodic surface structures on Ti-6Al-4V by direct laser writing and direct laser interference patterning for modified wettability applications

    NASA Astrophysics Data System (ADS)

    Huerta-Murillo, D.; Aguilar-Morales, A. I.; Alamri, S.; Cardoso, J. T.; Jagdheesh, R.; Lasagni, A. F.; Ocaña, J. L.

    2017-11-01

    In this work, hierarchical surface patterns fabricated on Ti-6Al-4V alloy combining two laser micro-machining techniques are presented. The used technologies are based on nanosecond Direct Laser Writing and picosecond Direct Laser Interference Patterning. Squared shape micro-cells with different hatch distances were produced by Direct Laser Writing with depths values in the micro-scale, forming a well-defined closed packet. Subsequently, cross-like periodic patterns were fabricated by means of Direct Laser Interference Patterning using a two-beam configuration, generating a dual-scale periodic surface structure in both micro- and nano-scale due to the formation of Laser-Induced Periodic Surface Structure after the picosecond process. As a result a triple hierarchical periodic surface structure was generated. The surface morphology of the irradiated area was characterized with scanning electron microscopy and confocal microscopy. Additionally, static contact angle measurements were made to analyze the wettability behavior of the structures, showing a hydrophobic behavior for the hierarchical structures.

  12. Review of piezoelectric micromachined ultrasonic transducers and their applications

    NASA Astrophysics Data System (ADS)

    Jung, Joontaek; Lee, Wonjun; Kang, Woojin; Shin, Eunjung; Ryu, Jungho; Choi, Hongsoo

    2017-11-01

    In recent decades, micromachined ultrasonic transducers (MUTs) have been investigated as an alternative to conventional piezocomposite ultrasonic transducers, primarily due to the advantages that microelectromechanical systems provide. Miniaturized ultrasonic systems require ultrasonic transducers integrated with complementary metal-oxide-semiconductor circuits. Hence, piezoelectric MUTs (pMUTs) and capacitive MUTs (cMUTs) have been developed as the most favorable solutions. This paper reviews the basic equations to understand the characteristics of thin-film-based piezoelectric devices and presents recent research on pMUTs, including current approaches and limitations. Methods to improve the coupling coefficient of pMUTs are also investigated, such as device structure, materials, and fabrication techniques. The device structure improvements include multielectrode pMUTs, partially clamped boundary conditions, and 3D pMUTs (curved and domed types), where the latter can provide an electromechanical coupling coefficient of up to 45%. The piezoelectric coefficient (e 31) can be increased by controlling the crystal texture (seed layer of γ-Al2O3), using single-crystal (PMN-PT) materials, or control of residual stresses (using SiO2 layer). Arrays of pMUTs can be implemented for various applications including intravascular ultrasound, fingerprint sensors, rangefinders in air, and wireless power supply systems. pMUTs are expected to be an ideal solution for applications such as mobile biometric security (fingerprint sensors) and rangefinders due to their superior power efficiency and compact size.

  13. Development of micromachined preconcentrators and gas chromatographic separation columns by an electroless gold plating technology

    NASA Astrophysics Data System (ADS)

    Kuo, C.-Y.; Chen, P.-S.; Chen, H.-T.; Lu, C.-J.; Tian, W.-C.

    2017-03-01

    In this study, a simple process for fabricating a novel micromachined preconcentrator (μPCT) and a gas chromatographic separation column (μSC) for use in a micro gas chromatograph (μGC) using one photomask is described. By electroless gold plating, a high-surface-area gold layer was deposited on the surface of channels inside the μPCT and μSC. For this process, (3-aminopropyl) trimethoxysilane (APTMS) was used as a promoter for attaching gold nanoparticles on a silicon substrate to create a seed layer. For this purpose, a gold sodium sulfite solution was used as reagent for depositing gold to form heating structures. The microchannels of the μPCT and μSC were coated with the adsorbent and stationary phase, Tenax-TA and polydimethylsiloxane (DB-1), respectively. μPCTs were heated at temperatures greater than 280 °C under an applied electrical power of 24 W and a heating rate of 75 °C s-1. Repeatable thermal heating responses for μPCTs were achieved; good linearity (R 2  >  0.9997) was attained at three heating rates for the temperature programme for the μSC (0.2, 0.5 and 1 °C s-1). The volatile organic compounds (VOCs) toluene and m-xylene were concentrated over the μPCT by rapid thermal desorption (peak width of half height (PWHH)  <1.5 s) preconcentration factors for both VOCs are  >7900. The VOCs acetone, benzene, toluene, m-xylene and 1,3,5-trimethylbenzene were also separated on the μSC as evidenced by their different retention times (47-184 s).

  14. Micromachined modulator arrays for use in free-space optical communication systems

    NASA Astrophysics Data System (ADS)

    Lewis, Keith L.; Ridley, Kevin D.; McNie, Mark E.; Smith, Gilbert W.; Scott, Andrew M.

    2004-12-01

    A summary is presented of some of the design criteria relevant to the realisation of silicon micromachined modulator arrays for use in free-space optical communication systems. Theoretical performance levels achievable are compared with values measured on experimental devices produced using a modified Multi-User MEMS Process (MUMPS). Devices capable of realising modulation rates in excess of 300 kHz are described and their optical characteristics compared with published data on devices based on multiple quantum well technology.

  15. Sensors and Micromachined Devices for the Automotive and New Markets: The Delphi Delco Electronics MEMS Story.

    NASA Astrophysics Data System (ADS)

    Logsdon, James

    2002-03-01

    This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.

  16. A Broadband Micro-Machined Far-Infrared Absorber

    NASA Technical Reports Server (NTRS)

    Wollack, E. J.; Datesman, A. M.; Jhabvala, C. A.; Miller, K. H.; Quijada, M. A.

    2016-01-01

    The experimental investigation of a broadband far-infrared meta-material absorber is described. The observed absorptance is greater than 0.95 from 1 to 20 terahertz (300-15 microns) over a temperature range spanning 5-300 degrees Kelvin. The meta-material, realized from an array of tapers approximately 100 microns in length, is largely insensitive to the detailed geometry of these elements and is cryogenically compatible with silicon-based micro-machined technologies. The electromagnetic response is in general agreement with a physically motivated transmission line model.

  17. Project: Micromachined High-Frequency Circuits For Sub-mm-wave Sensors

    NASA Technical Reports Server (NTRS)

    Papapolymerou, Ioannis John

    2004-01-01

    A novel micromachined resonator at 45 GHz based on a defect in a periodic electromagnetic bandgap structure (EBG) and a two-pole Tchebysbev filter with 1.4% 0.15 dB equiripple bandwidth and 2.3 dB loss employing this resonator are presented in this letter. The periodic bandgap structure is realized on a 400 micron thick high-resistivity silicon wafer using deep reactive ion etching techniques. The resonator and filter can be accessed via coplanar waveguide feeds.

  18. Microfabricated injectable drug delivery system

    DOEpatents

    Krulevitch, Peter A.; Wang, Amy W.

    2002-01-01

    A microfabricated, fully integrated drug delivery system capable of secreting controlled dosages of multiple drugs over long periods of time (up to a year). The device includes a long and narrow shaped implant with a sharp leading edge for implantation under the skin of a human in a manner analogous to a sliver. The implant includes: 1) one or more micromachined, integrated, zero power, high and constant pressure generating osmotic engine; 2) low power addressable one-shot shape memory polymer (SMP) valves for switching on the osmotic engine, and for opening drug outlet ports; 3) microfabricated polymer pistons for isolating the pressure source from drug-filled microchannels; 4) multiple drug/multiple dosage capacity, and 5) anisotropically-etched, atomically-sharp silicon leading edge for penetrating the skin during implantation. The device includes an externally mounted controller for controlling on-board electronics which activates the SMP microvalves, etc. of the implant.

  19. Pneumatically Actuated Miniature Peristaltic Vacuum Pumps

    NASA Technical Reports Server (NTRS)

    Feldman, Sabrina; Feldman, Jason; Svehla, Danielle

    2003-01-01

    Pneumatically actuated miniature peristaltic vacuum pumps have been proposed for incorporation into advanced miniature versions of scientific instruments that depend on vacuum for proper operation. These pumps are expected to be capable of reaching vacuum-side pressures in the torr to millitorr range (from .133 down to .0.13 Pa). Vacuum pumps that operate in this range are often denoted roughing pumps. In comparison with previously available roughing pumps, these pumps are expected to be an order of magnitude less massive and less power-hungry. In addition, they would be extremely robust, and would operate with little or no maintenance and without need for oil or other lubricants. Portable mass spectrometers are typical examples of instruments that could incorporate the proposed pumps. In addition, the proposed pumps could be used as roughing pumps in general laboratory applications in which low pumping rates could be tolerated. The proposed pumps could be designed and fabricated in conventionally machined and micromachined versions. A typical micromachined version (see figure) would include a rigid glass, metal, or plastic substrate and two layers of silicone rubber. The bottom silicone layer would contain shallow pump channels covered by silicone arches that could be pushed down pneumatically to block the channels. The bottom silicone layer would be covered with a thin layer of material with very low gas permeability, and would be bonded to the substrate everywhere except in the channel areas. The top silicone layer would be attached to the bottom silicone layer and would contain pneumatic- actuation channels that would lie crosswise to the pump channels. This version is said to be micromachined because the two silicone layers containing the channels would be fabricated by casting silicone rubber on micromachined silicon molds. The pneumatic-actuation channels would be alternately connected to a compressed gas and (depending on pump design) either to atmospheric pressure or to a partial vacuum source. The design would be such that the higher pneumatic pressure would be sufficient to push the silicone arches down onto the substrates, blocking the channels. Thus, by connecting pneumatic- actuation channels to the two pneumatic sources in spatial and temporal alternation, waves of opening and closing, equivalent to peristalsis, could be made to move along the pump channels. A pump according to this concept could be manufactured inexpensively. Pneumatic sources (compressors and partial vacuum sources) similar those needed for actuation are commercially available; they typically have masses of .100 g and power demands of the order of several W. In a design-optimization effort, it should be possible to reduce masses and power demands below even these low levels and to integrate pneumatic sources along with the proposed pumps into miniature units with overall dimensions of no more than a few centimeters per side.

  20. Ultrasonic Microtransport

    NASA Astrophysics Data System (ADS)

    Moroney, Richard Morgan, III

    We have observed numerous kinetic effects using ultrasonic flexural plate waves (FPWs) in 4mu -thick composite plates of low-stress silicon nitride, piezoelectric zinc oxide and aluminum. The wavelength is typically 100 mum, and the area 3 x 8 mm^2. A successful new surface micromachining fabrication process is presented here for the first time. FPWs have been used to move liquids and gasses with motion typically indicated by polysilicon blocks in air and polystyrene spheres in water; the velocity in air is 4.5 mm/s (with a zero-to-peak input of 3 V), and in water it is 100 mum/s (with an input of 7.8 V). Other observations include pumping of a liquid dye, and mixing near the FPW surface. All quantitative observations demonstrate that the kinetic effects of FPWs are proportional to the square of the wave amplitude. The amplitude for a typical device is 250 A at 9 V input; the power in a typical FPW is about 2 mW. The amplitude can be accurately measured using a laser diffraction technique. Experimental error is about +/-10%, and many of the results agree well with a simple theory to predict the FPW amplitude; extensions of the theory model the fluid loading of FPW devices, but experiment and theory disagree by about 15%. Pumping by flexural plate waves is an example of the phenomenon known as acoustic streaming. A common solution approach is the method of successive approximations, where the nonlinear equations are first linearized and solved. This "first-order" solution is then used to determine the inhomogeneous source terms in the linearized, "second -order" equations of motion. Theoretical predictions of streaming theory are in excellent agreement with experiment in the case where the FPW device contacts a half-space of fluid; predictions for flow in small channels encourage the development of integrated micropumps. Applications for microflow include thermal redistribution in integrated circuits and liquid movement in analytical instruments--particularly where a small dead volume is required. Capabilities of this technology and further applications are discussed. Microflow systems that integrate transport of fluids and solids with sensing, mixing and other useful tasks may become a new market-leading application for the sensor and actuator field.

  1. Mitigating intrinsic defects and laser damage using pulsetrain-burst (>100 MHz) ultrafast laser processing

    NASA Astrophysics Data System (ADS)

    McKinney, Luke; Frank, Felix; Graper, David; Dean, Jesse; Forrester, Paul; Rioblanc, Maxence; Nantel, Marc; Marjoribanks, Robin

    2005-09-01

    Ultrafast-laser micromachining has promise as an approach to trimming and 'healing' small laser-produced damage sites in laser-system optics--a common experience in state-of-the-art high-power laser systems. More-conventional approaches currently include mechanical micromachining, chemical modification, and treatment using cw and long-pulse lasers. Laser-optics materials of interest include fused silica, multilayer dielectric stacks for anti-reflection coatings or high-reflectivity mirrors, and inorganic crystals such as KD*P, used for Pockels cells and frequency-doubling. We report on novel efforts using ultrafast-laser pulsetrain-burst processing (microsecond bursts at 133 MHz) to mitigate damage in fused silica, dielectric coatings, and KD*P crystals. We have established the characteristics of pulsetrain-burst micromachining in fused silica, multilayer mirrors, and KD*P, and determined the etch rates and morphology under different conditions of fluence-delivery. From all of these, we have begun to identify new means to optimize the laser-repair of optics defects and damage.

  2. A micromachined device describing over a hundred orders of parametric resonance

    NASA Astrophysics Data System (ADS)

    Jia, Yu; Du, Sijun; Arroyo, Emmanuelle; Seshia, Ashwin A.

    2018-04-01

    Parametric resonance in mechanical oscillators can onset from the periodic modulation of at least one of the system parameters, and the behaviour of the principal (1st order) parametric resonance has long been well established. However, the theoretically predicted higher orders of parametric resonance, in excess of the first few orders, have mostly been experimentally elusive due to the fast diminishing instability intervals. A recent paper experimentally reported up to 28 orders in a micromachined membrane oscillator. This paper reports the design and characterisation of a micromachined membrane oscillator with a segmented proof mass topology, in an attempt to amplify the inherent nonlinearities within the membrane layer. The resultant oscillator device exhibited up to over a hundred orders of parametric resonance, thus experimentally validating these ultra-high orders as well as overlapping instability transitions between these higher orders. This research introduces design possibilities for the transducer and dynamic communities, by exploiting the behaviour of these previously elusive higher order resonant regimes.

  3. GaAs micromachining in the 1 H2SO4:1 H2O2:8 H2O system. From anisotropy to simulation

    NASA Astrophysics Data System (ADS)

    Tellier, C. R.

    2011-02-01

    The bulk micromachining on (010), (110) and (111)A GaAs substrates in the 1 H2SO4:1 H2O2:8 H2O system is investigated. Focus is placed on anisotropy of 3D etching shapes with a special emphasis on convex and concave undercuts which are of prime importance in the wet micromachining of mechanical structures. Etched structures exhibit curved contours and more and less rounded sidewalls showing that the anisotropy is of type 2. This anisotropy can be conveniently described by a kinematic and tensorial model. Hence, a database composed of dissolution constants is further determined from experiments. A self-elaborated simulator which works with the proposed database is used to derive theoretical 3D shapes. Simulated shapes agree well with observed shapes of microstructures. The successful simulations open up two important applications for MEMS: CAD of mask patterns and meshing of simulated shapes for FEM simulation tools.

  4. Micromachined Thermoelectric Sensors and Arrays and Process for Producing

    NASA Technical Reports Server (NTRS)

    Foote, Marc C. (Inventor); Jones, Eric W. (Inventor); Caillat, Thierry (Inventor)

    2000-01-01

    Linear arrays with up to 63 micromachined thermopile infrared detectors on silicon substrates have been constructed and tested. Each detector consists of a suspended silicon nitride membrane with 11 thermocouples of sputtered Bi-Te and Bi-Sb-Te thermoelectric elements films. At room temperature and under vacuum these detectors exhibit response times of 99 ms, zero frequency D* values of 1.4 x 10(exp 9) cmHz(exp 1/2)/W and responsivity values of 1100 V/W when viewing a 1000 K blackbody source. The only measured source of noise above 20 mHz is Johnson noise from the detector resistance. These results represent the best performance reported to date for an array of thermopile detectors. The arrays are well suited for uncooled dispersive point spectrometers. In another embodiment, also with Bi-Te and Bi-Sb-Te thermoelectric materials on micromachined silicon nitride membranes, detector arrays have been produced with D* values as high as 2.2 x 10(exp 9) cm Hz(exp 1/2)/W for 83 ms response times.

  5. Simple and inexpensive micromachined aluminum microfluidic devices for acoustic focusing of particles and cells.

    PubMed

    Gautam, Gayatri P; Burger, Tobias; Wilcox, Andrew; Cumbo, Michael J; Graves, Steven W; Piyasena, Menake E

    2018-05-01

    We introduce a new method to construct microfluidic devices especially useful for bulk acoustic wave (BAW)-based manipulation of cells and microparticles. To obtain efficient acoustic focusing, BAW devices require materials that have high acoustic impedance mismatch relative to the medium in which the cells/microparticles are suspended and materials with a high-quality factor. To date, silicon and glass have been the materials of choice for BAW-based acoustofluidic channel fabrication. Silicon- and glass-based fabrication is typically performed in clean room facilities, generates hazardous waste, and can take several hours to complete the microfabrication. To address some of the drawbacks in fabricating conventional BAW devices, we explored a new approach by micromachining microfluidic channels in aluminum substrates. Additionally, we demonstrate plasma bonding of poly(dimethylsiloxane) (PDMS) onto micromachined aluminum substrates. Our goal was to achieve an approach that is both low cost and effective in BAW applications. To this end, we micromachined aluminum 6061 plates and enclosed the systems with a thin PDMS cover layer. These aluminum/PDMS hybrid microfluidic devices use inexpensive materials and are simply constructed outside a clean room environment. Moreover, these devices demonstrate effectiveness in BAW applications as demonstrated by efficient acoustic focusing of polystyrene microspheres, bovine red blood cells, and Jurkat cells and the generation of multiple focused streams in flow-through systems. Graphical abstract The aluminum acoustofluidic device and the generation of multinode focusing of particles.

  6. A micromachined electrochemical sensor for free chlorine monitoring in drinking water.

    PubMed

    Mehta, A; Shekhar, H; Hyun, S H; Hong, S; Cho, H J

    2006-01-01

    In this work, we designed, fabricated and tested a disposable, flow-through amperometric sensor for free chlorine determination in water. The sensor is based on the principle of an electrochemical cell. The substrate, as well as the top microfluidic layer, is made up of a polymer material. The advantages include; (a) disposability from low cost; (b) stable operation range from three-electrode design; (c) fluidic interconnections that provide on line testing capabilities; and (d) transparent substrate which provides for future integration of on-chip optics. The sensor showed a good response and linearity in the chlorine concentration ranging from 0.3 to 1.6 ppm, which applies to common chlorination process for drinking water purification.

  7. Recent Advances in High-Resolution MEMS DM Fabrication and Integration

    NASA Astrophysics Data System (ADS)

    Bifano, T.; Cornelissen, S.; Bierden, P.

    2010-09-01

    Deformable mirrors fabricated using microelectromechanical systems technology (MEMS-DMs) have been studied at Boston University (BU) and developed/commercialized by Boston Micromachines Corporation (BMC) over the past decade. Recent advances that might have an impact on surveillance telescopes include demonstration of 4092 actuator DMs with continuous mirror face-sheets, and segmented DMs capable of frame rates of greater than 20kHz for devices with up to 1020 independent segments. The 4092 actuator DM, developed by BMC for the Gemini Planet Imaging GPI instrument, was recently delivered to the GPI instrument development team. Its packaging and platform development are described, and the performance results for the latest prototype devices are presented.

  8. Carbon Nanotube Vacuum Gauges Utilizing Long, Dissipative Tubes

    NASA Technical Reports Server (NTRS)

    Kaul, Anupama B.; Manohara, Harish M.

    2008-01-01

    CNT Vacuum Gauges: a) have a broad range of pressure response from 760 - 10(exp -6) Torr. b) have current changes approx. 100's nA in high vacuum regime (10(exp -6) Torr) and sensitivity increases with power and substrate removal. c) have a negative dR/dT (TCR negative) where a thermal hopping energy E(sub a) was determined to be approx. 40 meV. d) have compatible fabrication requirements for their integration with micromachined structures. e) can be operated at low power (nW - micro-W). f) have an active device region footprint of < 10 sq microns. g) are non-intrusive due to small size and passive operation.

  9. Magnetohydrodynamic pump with a system for promoting flow of fluid in one direction

    DOEpatents

    Lemoff, Asuncion V [Union City, CA; Lee, Abraham P [Irvine, CA

    2010-07-13

    A magnetohydrodynamic pump for pumping a fluid. The pump includes a microfluidic channel for channeling the fluid, a MHD electrode/magnet system operatively connected to the microfluidic channel, and a system for promoting flow of the fluid in one direction in the microfluidic channel. The pump has uses in the medical and biotechnology industries for blood-cell-separation equipment, biochemical assays, chemical synthesis, genetic analysis, drug screening, an array of antigen-antibody reactions, combinatorial chemistry, drug testing, medical and biological diagnostics, and combinatorial chemistry. The pump also has uses in electrochromatography, surface micromachining, laser ablation, inkjet printers, and mechanical micromilling.

  10. Microfabricated microengine with constant rotation rate

    DOEpatents

    Romero, Louis A.; Dickey, Fred M.

    1999-01-01

    A microengine uses two synchronized linear actuators as a power source and converts oscillatory motion from the actuators into constant rotational motion via direct linkage connection to an output gear or wheel. The microengine provides output in the form of a continuously rotating output gear that is capable of delivering drive torque at a constant rotation to a micromechanism. The output gear can have gear teeth on its outer perimeter for directly contacting a micromechanism requiring mechanical power. The gear is retained by a retaining means which allows said gear to rotate freely. The microengine is microfabricated of polysilicon on one wafer using surface micromachining batch fabrication.

  11. Microelectromechanical ratcheting apparatus

    DOEpatents

    Barnes, Stephen M.; Miller, Samuel L.; Jensen, Brian D.; Rodgers, M. Steven; Burg, Michael S.

    2001-01-01

    A microelectromechanical (MEM) ratcheting apparatus is disclosed which includes an electrostatic or thermal actuator that drives a moveable member in the form of a ring gear, stage, or rack. Motion is effected by one or more reciprocating pawls driven by the actuator in a direction that is parallel to, in line with, or tangential to the path. The reciprocating pawls engage indexing elements (e.g. teeth or pins) on the moveable member to incrementally move the member along a curved or straight path with the ability to precisely control and determine the position of the moveable member. The MEM apparatus can be formed on a silicon substrate by conventional surface micromachining methods.

  12. Electrically-programmable diffraction grating

    DOEpatents

    Ricco, A.J.; Butler, M.A.; Sinclair, M.B.; Senturia, S.D.

    1998-05-26

    An electrically-programmable diffraction grating is disclosed. The programmable grating includes a substrate having a plurality of electrodes formed thereon and a moveable grating element above each of the electrodes. The grating elements are electrostatically programmable to form a diffraction grating for diffracting an incident beam of light as it is reflected from the upper surfaces of the grating elements. The programmable diffraction grating, formed by a micromachining process, has applications for optical information processing (e.g. optical correlators and computers), for multiplexing and demultiplexing a plurality of light beams of different wavelengths (e.g. for optical fiber communications), and for forming spectrometers (e.g. correlation and scanning spectrometers). 14 figs.

  13. Compact Focal Plane Assembly for Planetary Science

    NASA Technical Reports Server (NTRS)

    Brown, Ari; Aslam, Shahid; Huang, Wei-Chung; Steptoe-Jackson, Rosalind

    2013-01-01

    A compact radiometric focal plane assembly (FPA) has been designed in which the filters are individually co-registered over compact thermopile pixels. This allows for construction of an ultralightweight and compact radiometric instrument. The FPA also incorporates micromachined baffles in order to mitigate crosstalk and low-pass filter windows in order to eliminate high-frequency radiation. Compact metal mesh bandpass filters were fabricated for the far infrared (FIR) spectral range (17 to 100 microns), a game-changing technology for future planetary FIR instruments. This fabrication approach allows the dimensions of individual metal mesh filters to be tailored with better than 10- micron precision. In contrast, conventional compact filters employed in recent missions and in near-term instruments consist of large filter sheets manually cut into much smaller pieces, which is a much less precise and much more labor-intensive, expensive, and difficult process. Filter performance was validated by integrating them with thermopile arrays. Demonstration of the FPA will require the integration of two technologies. The first technology is compact, lightweight, robust against cryogenic thermal cycling, and radiation-hard micromachined bandpass filters. They consist of a copper mesh supported on a deep reactive ion-etched silicon frame. This design architecture is advantageous when constructing a lightweight and compact instrument because (1) the frame acts like a jig and facilitates filter integration with the FPA, (2) the frame can be designed so as to maximize the FPA field of view, (3) the frame can be simultaneously used as a baffle for mitigating crosstalk, and (4) micron-scale alignment features can be patterned so as to permit high-precision filter stacking and, consequently, increase the filter bandwidth and sharpen the out-of-band rolloff. The second technology consists of leveraging, from another project, compact and lightweight Bi0.87Sb0.13/Sb arrayed thermopiles. These detectors consist of 30-layer thermopiles deposited in series upon a silicon nitride membrane. At 300 K, the thermopile arrays are highly linear over many orders of magnitude of incident IR power, and have a reported specific detectivity that exceeds the requirements imposed on future mission concepts. The bandpass filter array board is integrated with a thermopile array board by mounting both boards on a machined aluminum jig.

  14. Micro-machined calorimetric biosensors

    DOEpatents

    Doktycz, Mitchel J.; Britton, Jr., Charles L.; Smith, Stephen F.; Oden, Patrick I.; Bryan, William L.; Moore, James A.; Thundat, Thomas G.; Warmack, Robert J.

    2002-01-01

    A method and apparatus are provided for detecting and monitoring micro-volumetric enthalpic changes caused by molecular reactions. Micro-machining techniques are used to create very small thermally isolated masses incorporating temperature-sensitive circuitry. The thermally isolated masses are provided with a molecular layer or coating, and the temperature-sensitive circuitry provides an indication when the molecules of the coating are involved in an enthalpic reaction. The thermally isolated masses may be provided singly or in arrays and, in the latter case, the molecular coatings may differ to provide qualitative and/or quantitative assays of a substance.

  15. Fabricating and using a micromachined magnetostatic relay or switch

    NASA Technical Reports Server (NTRS)

    Tai, Yu-Chong (Inventor); Wright, John A. (Inventor)

    2001-01-01

    A micromachined magnetostatic relay or switch includes a springing beam on which a magnetic actuation plate is formed. The springing beam also includes an electrically conductive contact. In the presence of a magnetic field, the magnetic material causes the springing beam to bend, moving the electrically conductive contact either toward or away from another contact, and thus creating either an electrical short-circuit or an electrical open-circuit. The switch is fabricated from silicon substrates and is particularly useful in forming a MEMs commutation and control circuit for a miniaturized DC motor.

  16. Micromachined microphone array on a chip for turbulent boundary layer measurements

    NASA Astrophysics Data System (ADS)

    Krause, Joshua Steven

    A surface micromachined microphone array on a single chip has been successfully designed, fabricated, characterized, and tested for aeroacoustic purposes. The microphone was designed to have venting through the diaphragm, 64 elements (8x8) on the chip, and used a capacitive transduction scheme. The microphone was fabricated using the MEMSCAP PolyMUMPs process (a foundry polysilicon surface micromachining process) along with facilities at Tufts Micro and Nano Fabrication Facility (TMNF) where a Parylene-C passivation layer deposition and release of the microstructures were performed. The devices are packaged with low profile interconnects, presenting a maximum of 100 mum of surface topology. The design of an individual microphone was completed through the use of a lumped element model (LEM) to determine the theoretical performance of the microphone. Off-chip electronics were created to allow the microphone array outputs to be redirected to one of two channels, allowing dynamic reconfiguration of the effective transducer shape in software and provide 80 dB off isolation. The characterization was completed through the use of laser Doppler vibrometry (LDV), acoustic plane wave tube and free-field calibration, and electrical noise floor testing in a Faraday cage. Measured microphone sensitivity is 0.15 mV/Pa for an individual microphone and 8.7 mV/Pa for the entire array, in close agreement with model predictions. The microphones and electronics operate over the 200--40 000 Hz band. The dynamic range extends from 60 dB SPL in a 1 Hz band to greater than 150 dB SPL. Element variability was +/-0.05 mV/Pa in sensitivity with an array yield of 95%. Wind tunnel testing at flow rates of up to 205.8 m/s indicates that the devices continue to operate in flow without damage, and can be successfully reconfigured on the fly. Care has been taken to systematically remove contaminating signals (acoustic, vibration, and noise floor) from the wind tunnel data to determine actual turbulent pressure fluctuations beneath the turbulent boundary layer to an uncertainty level of 1 dB. Analysis of measured boundary layer pressure spectra at six flow rates from 34.3 m/s to 205.8 m/s indicate single point wall spectral measurements in close agreement to the empirical models of Goody, Chase-Howe, and Efimtsov above Mach 0.4. The MEMS data more closely resembles the magnitude of the Efimtsov model at higher frequencies (25% higher above 3 kHz for the Mach 0.6 case); however, the shape of the spectral model is closer to the model of Goody (50% lower for the Mach 0.6 case for all frequencies). The Chase-Howe model does fall directly on the MEMS data starting at 6 kHz, but has a sharper slope and does not resemble the data at below 6 kHz.

  17. Modifying Surface Chemistry of Metal Oxides for Boosting Dissolution Kinetics in Water by Liquid Cell Electron Microscopy.

    PubMed

    Lu, Yue; Geng, Jiguo; Wang, Kuan; Zhang, Wei; Ding, Wenqiang; Zhang, Zhenhua; Xie, Shaohua; Dai, Hongxing; Chen, Fu-Rong; Sui, Manling

    2017-08-22

    Dissolution of metal oxides is fundamentally important for understanding mineral evolution and micromachining oxide functional materials. In general, dissolution of metal oxides is a slow and inefficient chemical reaction. Here, by introducing oxygen deficiencies to modify the surface chemistry of oxides, we can boost the dissolution kinetics of metal oxides in water, as in situ demonstrated in a liquid environmental transmission electron microscope (LETEM). The dissolution rate constant significantly increases by 16-19 orders of magnitude, equivalent to a reduction of 0.97-1.11 eV in activation energy, as compared with the normal dissolution in acid. It is evidenced from the high-resolution TEM imaging, electron energy loss spectra, and first-principle calculations where the dissolution route of metal oxides is dynamically changed by local interoperability between altered water chemistry and surface oxygen deficiencies via electron radiolysis. This discovery inspires the development of a highly efficient electron lithography method for metal oxide films in ecofriendly water, which offers an advanced technique for nanodevice fabrication.

  18. Laser induced periodic surface structuring on Si by temporal shaped femtosecond pulses.

    PubMed

    Almeida, G F B; Martins, R J; Otuka, A J G; Siqueira, J P; Mendonca, C R

    2015-10-19

    We investigated the effect of temporal shaped femtosecond pulses on silicon laser micromachining. By using sinusoidal spectral phases, pulse trains composed of sub-pulses with distinct temporal separations were generated and applied to the silicon surface to produce Laser Induced Periodic Surface Structures (LIPSS). The LIPSS obtained with different sub-pulse separation were analyzed by comparing the intensity of the two-dimensional fast Fourier Transform (2D-FFT) of the AFM images of the ripples (LIPSS). It was observed that LIPSS amplitude is more emphasized for the pulse train with sub-pulses separation of 128 fs, even when compared with the Fourier transform limited pulse. By estimating the carrier density achieved at the end of each pulse train, we have been able to interpret our results with the Sipe-Drude model, that predicts that LIPSS efficacy is higher for a specific induced carrier density. Hence, our results indicate that temporal shaping of the excitation pulse, performed by spectral phase modulation, can be explored in fs-laser microstructuring.

  19. Effect of sandblasting intensity on microstructures and properties of pure titanium micro-arc oxidation coatings in an optimized composite technique

    NASA Astrophysics Data System (ADS)

    Wang, Hong-Yuan; Zhu, Rui-Fu; Lu, Yu-Peng; Xiao, Gui-Yong; He, Kun; Yuan, Y. F.; Ma, Xiao-Ni; Li, Ying

    2014-02-01

    Sandblasting is one of the most effective methods to modify a metal surface and improve its properties for application. Micro-arc oxidation (MAO) could produce a ceramic coating on a dental implant, facilitating cellular differentiation and osseocomposite on it. This study aims to deposit bioceramic Ca- and P-containing coatings on sandblasted commercially pure titanium by an optimum composite technique to improve the bioactive performance. The effect of sandblasting intensity on microstructures and properties of the implant coatings is examined, and the modified surfaces are characterized in terms of their topography, phase, chemical composition, mechanical properties and hydroxyapatite (HA)-inducing ability. The results show that a moderate sandblasting micromachines the substrate in favorable combination of rough and residual stresses; its MAO coating deposits nano-hydroxyapatite after immersion in simulated body fluid (SBF) for 5 days exhibiting better bioactivity. The further improvement of the implant surface performance is attributed to an optimized composite technique.

  20. A Latin-cross-shaped integrated resonant cantilever with second torsion-mode resonance for ultra-resoluble bio-mass sensing

    NASA Astrophysics Data System (ADS)

    Xia, Xiaoyuan; Zhang, Zhixiang; Li, Xinxin

    2008-03-01

    Second torsion-mode resonance is proposed for microcantilever biosensors for ultra-high mass-weighing sensitivity and resolution. By increasing both the resonant frequency and Q-factor, the higher mode torsional resonance is favorable for improving the mass-sensing performance. For the first time, a Latin-cross-shaped second-mode resonant cantilever is constructed and optimally designed for both signal-readout and resonance-exciting elements. The cantilever sensor is fabricated by using silicon micromachining techniques. The transverse piezoresistive sensing element and the specific-shaped resonance-exciting loop are successfully integrated in the cantilever. Alpha-fetoprotein (AFP) antibody-antigen specific binding is implemented for the sensing experiment. The proposed cantilever sensor is designed with significantly superior sensitivity to the previously reported first torsion-mode one. After analysis with an Allan variance algorithm, which can be easily embedded in the sensing system, the Latin-cross-shaped second torsion-mode resonant cantilever is evaluated with ultra-high mass resolution. Therefore, the high-performance integrated micro-sensor is promising for on-the-spot bio-molecule detection.

  1. Smart integration of silicon nanowire arrays in all-silicon thermoelectric micro-nanogenerators

    NASA Astrophysics Data System (ADS)

    Fonseca, Luis; Santos, Jose-Domingo; Roncaglia, Alberto; Narducci, Dario; Calaza, Carlos; Salleras, Marc; Donmez, Inci; Tarancon, Albert; Morata, Alex; Gadea, Gerard; Belsito, Luca; Zulian, Laura

    2016-08-01

    Micro and nanotechnologies are called to play a key role in the fabrication of small and low cost sensors with excellent performance enabling new continuous monitoring scenarios and distributed intelligence paradigms (Internet of Things, Trillion Sensors). Harvesting devices providing energy autonomy to those large numbers of microsensors will be essential. In those scenarios where waste heat sources are present, thermoelectricity will be the obvious choice. However, miniaturization of state of the art thermoelectric modules is not easy with the current technologies used for their fabrication. Micro and nanotechnologies offer an interesting alternative considering that silicon in nanowire form is a material with a promising thermoelectric figure of merit. This paper presents two approaches for the integration of large numbers of silicon nanowires in a cost-effective and practical way using only micromachining and thin-film processes compatible with silicon technologies. Both approaches lead to automated physical and electrical integration of medium-high density stacked arrays of crystalline or polycrystalline silicon nanowires with arbitrary length (tens to hundreds microns) and diameters below 100 nm.

  2. Micro Dot Patterning on the Light Guide Panel Using Powder Blasting.

    PubMed

    Jang, Ho Su; Cho, Myeong Woo; Park, Dong Sam

    2008-02-08

    This study is to develop a micromachining technology for a light guidepanel(LGP) mold, whereby micro dot patterns are formed on a LGP surface by a singleinjection process instead of existing screen printing processes. The micro powder blastingtechnique is applied to form micro dot patterns on the LGP mold surface. The optimalconditions for masking, laminating, exposure, and developing processes to form the microdot patterns are first experimentally investigated. A LGP mold with masked micro patternsis then machined using the micro powder blasting method and the machinability of themicro dot patterns is verified. A prototype LGP is test- injected using the developed LGPmold and a shape analysis of the patterns and performance testing of the injected LGP arecarried out. As an additional approach, matte finishing, a special surface treatment method,is applied to the mold surface to improve the light diffusion characteristics, uniformity andbrightness of the LGP. The results of this study show that the applied powder blastingmethod can be successfully used to manufacture LGPs with micro patterns by just singleinjection using the developed mold and thereby replace existing screen printing methods.

  3. Laser micromachining of biofactory-on-a-chip devices

    NASA Astrophysics Data System (ADS)

    Burt, Julian P.; Goater, Andrew D.; Hayden, Christopher J.; Tame, John A.

    2002-06-01

    Excimer laser micromachining provides a flexible means for the manufacture and rapid prototyping of miniaturized systems such as Biofactory-on-a-Chip devices. Biofactories are miniaturized diagnostic devices capable of characterizing, manipulating, separating and sorting suspension of particles such as biological cells. Such systems operate by exploiting the electrical properties of microparticles and controlling particle movement in AC non- uniform stationary and moving electric fields. Applications of Biofactory devices are diverse and include, among others, the healthcare, pharmaceutical, chemical processing, environmental monitoring and food diagnostic markets. To achieve such characterization and separation, Biofactory devices employ laboratory-on-a-chip type components such as complex multilayer microelectrode arrays, microfluidic channels, manifold systems and on-chip detection systems. Here we discuss the manufacturing requirements of Biofactory devices and describe the use of different excimer laser micromachined methods both in stand-alone processes and also in conjunction with conventional fabrication processes such as photolithography and thermal molding. Particular attention is given to the production of large area multilayer microelectrode arrays and the manufacture of complex cross-section microfluidic channel systems for use in simple distribution and device interfacing.

  4. ZnO thin film piezoelectric micromachined microphone with symmetric composite vibrating diaphragm

    NASA Astrophysics Data System (ADS)

    Li, Junhong; Wang, Chenghao; Ren, Wei; Ma, Jun

    2017-05-01

    Residual stress is an important factor affecting the sensitivity of piezoelectric micromachined microphone. A symmetric composite vibrating diaphragm was adopted in the micro electro mechanical systems piezoelectric microphone to decrease the residual stress and improve the sensitivity of microphone in this paper. The ZnO film was selected as piezoelectric materials of microphone for its higher piezoelectric coefficient d 31 and lower relative dielectric constant. The thickness optimization of piezoelectric film on square diaphragm is difficult to be fulfilled by analytic method. To optimize the thickness of ZnO films, the stress distribution in ZnO film was analyzed by finite element method and the average stress in different thickness of ZnO films was given. The ZnO films deposited using dc magnetron sputtering exhibits a densely packed structure with columnar crystallites preferentially oriented along (002) plane. The diaphragm of microphone fabricated by micromachining techniques is flat and no wrinkling at corners, and the sensitivity of microphone is higher than 1 mV Pa-1. These results indicate the diaphragm has lower residual stress.

  5. A novel integrated multifunction micro-sensor for three-dimensional micro-force measurements.

    PubMed

    Wang, Weizhong; Zhao, Yulong; Qin, Yafei

    2012-01-01

    An integrated multifunction micro-sensor for three-dimensional micro-force precision measurement under different pressure and temperature conditions is introduced in this paper. The integrated sensor consists of three kinds of sensors: a three-dimensional micro-force sensor, an absolute pressure sensor and a temperature sensor. The integrated multifunction micro-sensor is fabricated on silicon wafers by micromachining technology. Different doping doses of boron ion, placement and structure of resistors are tested for the force sensor, pressure sensor and temperature sensor to minimize the cross interference and optimize the properties. A glass optical fiber, with a ladder structure and sharp tip etched by buffer oxide etch solution, is glued on the micro-force sensor chip as the tactile probe. Experimental results show that the minimum force that can be detected by the force sensor is 300 nN; the lateral sensitivity of the force sensor is 0.4582 mV/μN; the probe length is linearly proportional to sensitivity of the micro-force sensor in lateral; the sensitivity of the pressure sensor is 0.11 mv/KPa; the sensitivity of the temperature sensor is 5.836 × 10(-3) KΩ/°C. Thus it is a cost-effective method to fabricate integrated multifunction micro-sensors with different measurement ranges that could be used in many fields.

  6. Multifunctional-layered materials for creating membrane-restricted nanodomains and nanoscale imaging

    NASA Astrophysics Data System (ADS)

    Srinivasan, P.

    2016-01-01

    Experimental platform that allows precise spatial positioning of biomolecules with an exquisite control at nanometer length scales is a valuable tool to study the molecular mechanisms of membrane bound signaling. Using micromachined thin film gold (Au) in layered architecture, it is possible to add both optical and biochemical functionalities in in vitro. Towards this goal, here, I show that docking of complementary DNA tethered giant phospholiposomes on Au surface can create membrane-restricted nanodomains. These nanodomains are critical features to dissect molecular choreography of membrane signaling complexes. The excited surface plasmon resonance modes of Au allow label-free imaging at diffraction-limited resolution of stably docked DNA tethered phospholiposomes, and lipid-detergent bicelle structures. Such multifunctional building block enables realizing rigorously controlled in vitro set-up to model membrane anchored biological signaling, besides serving as an optical tool for nanoscale imaging.

  7. Apparatus and method for sensing motion in a microelectro-mechanical system

    DOEpatents

    Dickey, Fred M.; Holswade, Scott C.

    1999-01-01

    An apparatus and method are disclosed for optically sensing motion in a microelectromechanical system (also termed a MEMS device) formed by surface micromachining or LIGA. The apparatus operates by reflecting or scattering a light beam off a corrugated surface (e.g. gear teeth or a reference feature) of a moveable member (e.g. a gear, rack or linkage) within the MEMS device and detecting the reflected or scattered light. The apparatus can be used to characterize a MEMS device, measuring one or more performance characteristic such as spring and damping coefficients, torque and friction, or uniformity of motion of the moveable member. The apparatus can also be used to determine the direction and extent of motion of the moveable member; or to determine a particular mechanical state that a MEMS device is in. Finally, the apparatus and method can be used for providing feedback to the MEMS device to improve performance and reliability.

  8. An experimental analysis of process parameters to manufacture micro-channels in AISI H13 tempered steel by laser micro-milling

    NASA Astrophysics Data System (ADS)

    Teixidor, D.; Ferrer, I.; Ciurana, J.

    2012-04-01

    This paper reports the characterization of laser machining (milling) process to manufacture micro-channels in order to understand the incidence of process parameters on the final features. Selection of process operational parameters is highly critical for successful laser micromachining. A set of designed experiments is carried out in a pulsed Nd:YAG laser system using AISI H13 hardened tool steel as work material. Several micro-channels have been manufactured as micro-mold cavities varying parameters such as scanning speed (SS), pulse intensity (PI) and pulse frequency (PF). Results are obtained by evaluating the dimensions and the surface finish of the micro-channel. The dimensions and shape of the micro-channels produced with laser-micro-milling process exhibit variations. In general the use of low scanning speeds increases the quality of the feature in both surface finishing and dimensional.

  9. Micromachined piconewton force sensor for biophysics investigations

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Koch, Steven J.; Thayer, Gayle E.; Corwin, Alex D.

    2006-10-23

    We describe a micromachined force sensor that is able to measure forces as small as 1 pN in both air and water. First, we measured the force field produced by an electromagnet on individual 2.8 {mu}m magnetic beads glued to the sensor. By repeating with 11 different beads, we measured a 9% standard deviation in saturation magnetization. We next demonstrated that the sensor was fully functional when immersed in physiological buffer. These results show that the force sensors can be useful for magnetic force calibration and also for measurement of biophysical forces on chip.

  10. Clogging in micromachined Joule-Thomson coolers: Mechanism and preventive measures

    NASA Astrophysics Data System (ADS)

    Cao, H. S.; Vanapalli, S.; Holland, H. J.; Vermeer, C. H.; ter Brake, H. J. M.

    2013-07-01

    Micromachined Joule-Thomson coolers can be used for cooling small electronic devices. However, a critical issue for long-term operation of these microcoolers is the clogging caused by the deposition of water that is present as impurity in the working fluid. We present a model that describes the deposition process considering diffusion and kinetics of water molecules. In addition, the deposition and sublimation process was imaged, and the experimental observation fits well to the modeling predictions. By changing the temperature profile along the microcooler, the operating time of the microcooler under test at 105 K extends from 11 to 52 h.

  11. Using laser technological unit ALTI "Karavella" for precision components of IEP production

    NASA Astrophysics Data System (ADS)

    Labin, N. A.; Chursin, A. D.; Paramonov, V. S.; Klimenko, V. I.; Paramonova, G. M.; Kolokolov, I. S.; Vinogradov, K. Y.; Betina, L. L.; Bulychev, N. A.; Dyakov, Yu. A.; Zakharyan, R. A.; Kazaryan, M. A.; Koshelev, K. K.; Kosheleva, O. K.; Grigoryants, A. G.; Shiganov, I. N.; Krasovskii, V. I.; Sachkov, V. I.; Plyaka, P. S.; Feofanov, I. N.; Chen, C.

    2015-12-01

    The paper revealed the using of industrial production equipment ALTI "Karavella-1", "Karavella-1M", "Karavella-2" and "Karavella-2M" precision components of IEP production [1-4]. The basis for the ALTI using in the IEP have become the positive results of research and development of technologies of foil (0.01-0.2 mm) and thin sheets (0.3-1 mm) materials micromachining by pulsed radiation CVL [5, 6]. To assess the micromachining quality and precision the measuring optical microscope (UHL VMM200), projection microscope (Mitutoyo PV5100) and Carl Zeiss microscope were used.

  12. Micromachined needles and lancets with design adjustable bevel angles

    NASA Astrophysics Data System (ADS)

    Sparks, Douglas; Hubbard, Timothy

    2004-08-01

    A new method of micromachining hollow needles and two-dimensional needle arrays from single crystal silicon is described. The process involves a combination of fusion bonding, photolithography and anisotropic plasma etching. The cannula produced with this process can have design adjustable bevel angles, wall thickness and channel dimensions. A subset of processing steps can be employed to produce silicon blades and lancets with design adjustable bevel angles and shaft dimensions. Applications for this technology include painless drug infusion, blood diagnosis, glucose monitoring, cellular injection and the manufacture of microkeratomes for ocular, vascular and neural microsurgery.

  13. Micromachined cascade virtual impactor with a flow rate distributor for wide range airborne particle classification

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kim, Yong-Ho; Maeng, Jwa-Young; Park, Dongho

    2007-07-23

    This letter reports a module for airborne particle classification, which consists of a micromachined three-stage virtual impactor for classifying airborne particles according to their size and a flow rate distributor for supplying the required flow rate to the virtual impactor. Dioctyl sebacate particles, 100-600 nm in diameter, and carbon particles, 0.6-10 {mu}m in diameter, were used for particle classification. The collection efficiency and cutoff diameter were examined. The measured cutoff diameters of the first, second, and third stages were 135 nm, 1.9 {mu}m, and 4.8 {mu}m, respectively.

  14. Chronic behavior evaluation of a micro-machined neural implant with optimized design based on an experimentally derived model.

    PubMed

    Andrei, Alexandru; Welkenhuysen, Marleen; Ameye, Lieveke; Nuttin, Bart; Eberle, Wolfgang

    2011-01-01

    Understanding the mechanical interactions between implants and the surrounding tissue is known to have an important role for improving the bio-compatibility of such devices. Using a recently developed model, a particular micro-machined neural implant design aiming the reduction of insertion forces dependence on the insertion speed was optimized. Implantations with 10 and 100 μm/s insertion speeds showed excellent agreement with the predicted behavior. Lesion size, gliosis (GFAP), inflammation (ED1) and neuronal cells density (NeuN) was evaluated after 6 week of chronic implantation showing no insertion speed dependence.

  15. 193nm high power lasers for the wide bandgap material processing

    NASA Astrophysics Data System (ADS)

    Fujimoto, Junichi; Kobayashi, Masakazu; Kakizaki, Koji; Oizumi, Hiroaki; Mimura, Toshio; Matsunaga, Takashi; Mizoguchi, Hakaru

    2017-02-01

    Recently infrared laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer Level Package (FO-WLP) and Through Glass Via hole (TGV) which are hard to process with less defect. In this study, we investigated ablation rate with deep ultra violet excimer laser to explore its possibilities of micromachining on organic and glass interposers. These results were observed with a laser microscopy and Scanning Electron Microscope (SEM). As the ablation rates of both materials were quite affordable value, excimer laser is expected to be put in practical use for mass production.

  16. High-power ultrashort fiber laser for solar cells micromachining

    NASA Astrophysics Data System (ADS)

    Lecourt, J.-B.; Duterte, C.; Liegeois, F.; Lekime, D.; Hernandez, Y.; Giannone, D.

    2012-02-01

    We report on a high-power ultra-short fiber laser for thin film solar cells micromachining. The laser is based on Chirped Pulse Amplification (CPA) scheme. The pulses are stretched to hundreds of picoseconds prior to amplification and can be compressed down to picosecond at high energy. The repetition rate is adjustable from 100 kHz to 1 MHz and the optical average output power is close to 13 W (before compression). The whole setup is fully fibred, except the compressor achieved with bulk gratings, resulting on a compact and reliable solution for cold ablation.

  17. Fabrication of microchannels in fused silica using femtosecond Bessel beams

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yashunin, D. A., E-mail: yashuninda@yandex.ru; Nizhny Novgorod State Technical University, 24 Minin St., Nizhny Novgorod 603950; Malkov, Yu. A.

    Extended birefringent waveguiding microchannels up to 15 mm long were created inside fused silica by single-pulse irradiation with femtosecond Bessel beams. The birefringent refractive index change of 2–4 × 10{sup −4} is attributed to residual mechanical stress. The microchannels were chemically etched in KOH solution to produce 15 mm long microcapillaries with smooth walls and a high aspect ratio of 1:250. Bessel beams provide higher speed of material processing compared to conventional multipulse femtosecond laser micromachining techniques and permit simple control of the optical axis direction of the birefringent waveguides, which is important for practical applications [Corrielli et al., “Rotated waveplates inmore » integrated waveguide optics,” Nat. Commun. 5, 4249 (2014)].« less

  18. Measurement of optical scattered power from laser-induced shallow pits on silica

    DOE PAGES

    Feigenbaum, Eyal; Nielsen, Norman; Matthews, Manyalibo J.

    2015-10-01

    We describe a model for far-field scattered power and irradiance by a silica glass slab with a shallow-pitted exit surface and is experimentally validated. The comparison to the model is performed using a precisely micromachined ensemble of ~11 μm wide laser ablated shallow pits producing 1% of the incident beam scatter in a 10 mrad angle. This series of samples with damage initiations and laser-induced shallow pits resulting from 351 nm, 5 ns pulsed laser cleaning of metal microparticles at different fluences between 2 J/cm 2 and 11 J/cm 2 are characterized as well and found in good agreement withmore » model predictions.« less

  19. Enhanced electrochemical etching of ion irradiated silicon by localized amorphization

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Dang, Z. Y.; Breese, M. B. H.; Lin, Y.

    2014-05-12

    A tailored distribution of ion induced defects in p-type silicon allows subsequent electrochemical anodization to be modified in various ways. Here we describe how a low level of lattice amorphization induced by ion irradiation influences anodization. First, it superposes a chemical etching effect, which is observable at high fluences as a reduced height of a micromachined component. Second, at lower fluences, it greatly enhances electrochemical anodization by allowing a hole diffusion current to flow to the exposed surface. We present an anodization model, which explains all observed effects produced by light ions such as helium and heavy ions such asmore » cesium over a wide range of fluences and irradiation geometries.« less

  20. A Label-Free Detection of Biomolecules Using Micromechanical Biosensors

    NASA Astrophysics Data System (ADS)

    Meisam, Omidi; A. Malakoutian, M.; Mohammadmehdi, Choolaei; Oroojalian, F.; Haghiralsadat, F.; Yazdian, F.

    2013-06-01

    A Microcantilevers resonator is used to detect a protein biomarker called prostate specific antigen (PSA), which is associated with prostate cancer. Different concentrations of PSA in a buffer solution are detected as a function of deflection of the beams. For this purpose, we use a surface micromachined, antibody-coated polycrystalline silicon micromechanical cantilever beam. Cantilevers have mass sensitivities of the order of 10-17 g/Hz, which result from their small mass. This matter allows them to detect an immobilized antibody monolayer corresponding to a mass of about 70 fg. With these devices, concentrations as low as 150 fg/mL, or 4.5 fM, could be detected from the realistic samples.

  1. Fabrication of spherical mitigation pit on KH2PO4 crystal by micro-milling and modeling of its induced light intensification.

    PubMed

    Cheng, Jian; Chen, Mingjun; Liao, Wei; Wang, Haijun; Xiao, Yong; Li, Mingquan

    2013-07-15

    Micro-machining is the most promising method for KH(2)PO(4) crystal to mitigate the surface damage growth in high power laser system. In this work, spherical mitigation pit is fabricated by micro-milling with an efficient machining procedure. The light intensification caused by rear surface features before and after mitigation is numerically modeled based on the finite-difference time-domain method. The results indicate that the occurrence of total internal reflections should be responsible for the largest light intensification inside the crystal. For spherical pits after mitigation, the light intensification can be greatly alleviated by preventing the occurrence of total internal reflections. The light intensification caused by spherical mitigation pit is strongly dependent on the width-depth ratio and it is suggested that the width-depth ratio of spherical mitigation pit must be devised to be larger than 5.0 to achieve the minimal light intensification for the mitigation of surface damage growth. Laser damage tests for KH(2)PO(4) crystal validate that the laser damage resistance of initially damaged surface can be retrieved to near the level of ideal surface by replacing initial damage site with predesigned mitigation pit.

  2. Superior Robust Ultrathin Single-Crystalline Silicon Carbide Membrane as a Versatile Platform for Biological Applications.

    PubMed

    Nguyen, Tuan-Khoa; Phan, Hoang-Phuong; Kamble, Harshad; Vadivelu, Raja; Dinh, Toan; Iacopi, Alan; Walker, Glenn; Hold, Leonie; Nguyen, Nam-Trung; Dao, Dzung Viet

    2017-12-06

    Micromachined membranes are promising platforms for cell culture thanks to their miniaturization and integration capabilities. Possessing chemical inertness, biocompatibility, and integration, silicon carbide (SiC) membranes have attracted great interest toward biological applications. In this paper, we present the batch fabrication, mechanical characterizations, and cell culture demonstration of robust ultrathin epitaxial deposited SiC membranes. The as-fabricated ultrathin SiC membranes, with an ultrahigh aspect ratio (length/thickness) of up to 20 000, possess high a fracture strength up to 2.95 GPa and deformation up to 50 μm. A high optical transmittance of above 80% at visible wavelengths was obtained for 50 nm membranes. The as-fabricated membranes were experimentally demonstrated as an excellent substrate platform for bio-MEMS/NEMS cell culture with the cell viability rate of more than 92% after 72 h. The ultrathin SiC membrane is promising for in vitro observations/imaging of bio-objects with an extremely short optical access.

  3. A three-dimensional optical photonic crystal with designed point defects

    NASA Astrophysics Data System (ADS)

    Qi, Minghao; Lidorikis, Elefterios; Rakich, Peter T.; Johnson, Steven G.; Joannopoulos, J. D.; Ippen, Erich P.; Smith, Henry I.

    2004-06-01

    Photonic crystals offer unprecedented opportunities for miniaturization and integration of optical devices. They also exhibit a variety of new physical phenomena, including suppression or enhancement of spontaneous emission, low-threshold lasing, and quantum information processing. Various techniques for the fabrication of three-dimensional (3D) photonic crystals-such as silicon micromachining, wafer fusion bonding, holographic lithography, self-assembly, angled-etching, micromanipulation, glancing-angle deposition and auto-cloning-have been proposed and demonstrated with different levels of success. However, a critical step towards the fabrication of functional 3D devices, that is, the incorporation of microcavities or waveguides in a controllable way, has not been achieved at optical wavelengths. Here we present the fabrication of 3D photonic crystals that are particularly suited for optical device integration using a lithographic layer-by-layer approach. Point-defect microcavities are introduced during the fabrication process and optical measurements show they have resonant signatures around telecommunications wavelengths (1.3-1.5µm). Measurements of reflectance and transmittance at near-infrared are in good agreement with numerical simulations.

  4. Integrated wide-angle scanner based on translating a curved mirror of acylindrical shape.

    PubMed

    Sabry, Yasser M; Khalil, Diaa; Saadany, Bassam; Bourouina, Tarik

    2013-06-17

    A wide angle microscanning architecture is presented in which the angular deflection is achieved by displacing the principle axis of a curved silicon micromirror of acylindrical shape, with respect to the incident beam optical axis. The micromirror curvature is designed to overcome the possible deformation of the scanned beam spot size during scanning. In the presented architecture, the optical axis of the beam lays in-plane with respect to the substrate opening the door for a completely integrated and self-aligned miniaturized scanner. A micro-optical bench scanning device, based on translating a 200 μm focal length micromirror by an electrostatic comb-drive actuator, is implemented on a silicon chip. The microelectromechanical system has a resonance frequency of 329 Hz and a quality factor of 22. A single-mode optical fiber is used as the optical source and inserted into a micromachined groove fabricated and lithographically aligned with the microbench. Optical deflection angles up to 110 degrees are demonstrated.

  5. A CMOS micromachined capacitive tactile sensor with integrated readout circuits and compensation of process variations.

    PubMed

    Tsai, Tsung-Heng; Tsai, Hao-Cheng; Wu, Tien-Keng

    2014-10-01

    This paper presents a capacitive tactile sensor fabricated in a standard CMOS process. Both of the sensor and readout circuits are integrated on a single chip by a TSMC 0.35 μm CMOS MEMS technology. In order to improve the sensitivity, a T-shaped protrusion is proposed and implemented. This sensor comprises the metal layer and the dielectric layer without extra thin film deposition, and can be completed with few post-processing steps. By a nano-indenter, the measured spring constant of the T-shaped structure is 2.19 kNewton/m. Fully differential correlated double sampling capacitor-to-voltage converter (CDS-CVC) and reference capacitor correction are utilized to compensate process variations and improve the accuracy of the readout circuits. The measured displacement-to-voltage transductance is 7.15 mV/nm, and the sensitivity is 3.26 mV/μNewton. The overall power dissipation is 132.8 μW.

  6. Femtosecond-laser fabrication of cyclic structures in the bulk of transparent dielectrics

    NASA Astrophysics Data System (ADS)

    Vartapetov, S. K.; Ganin, D. V.; Lapshin, K. E.; Obidin, A. Z.

    2015-08-01

    We report the results of the experiments on developing precision micromachining technology, obtained under the conditions of focusing the pulses of a femtosecond (FS) laser into the volume of a transparent material, which is important, particularly, in the processing of biomaterials in ophthalmology. The implementation conditions and some characteristic features of the special regime of micromachining are determined, when at a definite relation between the sample scanning velocity and the repetition rate of FS pulses the region, destroyed by the laser radiation, is shifted along the optical axis towards the objective and back, forming cyclic patterns inside the sample. It is supposed that the main causes of the damage region shift are the induced modification of the refractive index and the reduction of the damage threshold due to the change in the material density and structure in the microscopic domain, adjacent to the boundary of the cavity produced by the previous pulse. The results of the performed study with the above regime taken into account were used in the technology of precision cutting of crystals, glasses and polymers. The best quality of the cut surface is achieved under the conditions, eliminating the appearance of the cyclic regime. In the samples of polycarbonate, polymethyl methacrylate and fused silica the cylindrical cavities were obtained with the aspect ratio higher than 200, directed along the laser beam, and microcapillaries with the diameter 1 - 2 μm in the direction, perpendicular to this beam.

  7. Possibilities of using pulsed lasers and copper-vapour laser system (CVL and CVLS) in modern technological equipment

    NASA Astrophysics Data System (ADS)

    Labin, N. A.; Bulychev, N. A.; Kazaryan, M. A.; Grigoryants, A. G.; Shiganov, I. N.; Krasovskii, V. I.; Sachkov, V. I.; Plyaka, P. S.; Feofanov, I. N.

    2015-12-01

    Research on CVL installations with an average power of 20-25 W of cutting and drilling has shown wide range of applications of these lasers for micromachining of metals and a wide range of non-metallic materials up to 1-2 mm. From the analysis indicated that peak power density in the focused light spot of 10-30 μm diameter must be 109 -1012 W/cm2 the productivity and quality micromachining, when the treatment material is preferably in the evaporative mode micro explosions, followed by the expansion of the superheated vapor and the liquid. To achieve such levels of power density, a minimum heat affected zone (5- 10 μm) and a minimum surface roughness of the cut (1-2 μm), the quality of the output beam of radiation should be as high. Ideally, to ensure the quality of the radiation, the structure of CVL output beam must be single-beam, diffraction divergence and have at duration pulses τi = 20-40 ns. The pulse energy should have low values of 0.1-1 mJ at pulse repetition rates of 10-20 kHz. Axis of the radiation beam instability of the pattern to be three orders of magnitude smaller than the diffraction limit of the divergence. The spot of the focused radiation beam must have a circular shape with clear boundary, and a Gaussian intensity distribution.

  8. Development of micromachine tool prototypes for microfactories

    NASA Astrophysics Data System (ADS)

    Kussul, E.; Baidyk, T.; Ruiz-Huerta, L.; Caballero-Ruiz, A.; Velasco, G.; Kasatkina, L.

    2002-11-01

    At present, many areas of industry have strong tendencies towards miniaturization of products. Mechanical components of these products as a rule are manufactured using conventional large-scale equipment or micromechanical equipment based on microelectronic technology (MEMS). The first method has some drawbacks because conventional large-scale equipment consumes much energy, space and material. The second method seems to be more advanced but has some limitations, for example, two-dimensional (2D) or 2.5-dimensional shapes of components and materials compatible with silicon technology. In this paper, we consider an alternative technology of micromechanical device production. This technology is based on micromachine tools (MMT) and microassembly devices, which can be produced as sequential generations of microequipment. The first generation can be produced by conventional large-scale equipment. The machine tools of this generation can have overall sizes of 100-200 mm. Using microequipment of this generation, second generation microequipment having smaller overall sizes can be produced. This process can be repeated to produce generations of micromachine tools having overall sizes of some millimetres. In this paper we describe the efforts and some results of first generation microequipment prototyping. A micromachining centre having an overall size of 130 × 160 × 85 mm3 was produced and characterized. This centre has allowed us to manufacture micromechanical details having sizes from 50 µm to 5 mm. These details have complex three-dimensional shapes (for example, screw, gear, graduated shaft, conic details, etc), and are made from different materials, such as brass, steel, different plastics etc. We have started to investigate and to make prototypes of the assembly microdevices controlled by a computer vision system. In this paper we also describe an example of the applications (microfilters) for the proposed technology.

  9. An evaluation of a combined scanning probe and optical microscope for lunar regolith studies

    NASA Astrophysics Data System (ADS)

    Yang, S.; Pike, W. T.; Staufer, U.; Claus, D.; Rodenburg, J. M.

    2011-12-01

    The microscopic properties of the lunar regolith such as the shape, the surface texture and the size distribution are required for an understanding of both past surface processes and potential hazards for future human exploration [1]. To reveal the particle morphology at the sub micrometer scale, scanning-probe microscopy (SPM), first used on the 2008 Phoenix mission [1], is a proven approach; however, there are two main challenges for the measurement of lunar particles. Firstly, the SPM tip is liable to move particles during scanning, even when using the lower contact forces of the dynamic-mode imaging. Hence the particles need to be stabilised during imaging. Secondly, typically the AFM tip extends about 10 μm from its cantilever, so larger particles protruding more than this height above their substrates cannot be scanned completely. To immobilize particles and eliminate large particles during SPM scanning, micromachined Si substrates, which have been successfully applied in the Phoenix project for Mars investigation in 2008 [2], have been investigated for lunar analogue material. On these substrates micrometer pits are patterned and serve as traps to enhance the stability of the AFM scanning by grasping the particles. In addition, the diameter of pits can determine the size of dusts to be captured and reduce the adhesion for the larger dust and so eliminate the oversized particles. To extend the imaging range and assist in selecting scan areas for the SPM, we use a type of lensless optical imaging (LOM) which uses ptychographic diffractive imaging [3] to eliminate the restrictions and performance limitations of conventional focusing devices. As a reference, scanning electron microscopy (SEM) which minimizes particle-probe interactions and has the advantage of an extended depth of field, is employed to image the same particle fields at resolutions covering both the SPM and LOM. By comparing the differences and the similarities between SEM and LOM images, the ability of LOM for illuminating the details about the lunar particles sample, is demonstrated. The analysis of SEM and SPM images of the same particles of JSC-LunarA analogue soil reveals the potential of the SPM to obtain reliable microscopic images of lunar dusts including detailed morphology with the help of the micromachined Si substrates. [1] J. D. Carpenter, O. Angerer, M. Durante, D. Linnarson, W. T. Pike, "Life Sciences Investigations for ESA's First Lunar Lander," Earth, Moon, and Planets, Vol.107, pp. 11-23, 2010. [2] S. Vijendran, H.Sykulska, and W. T. Pike, "AFM investigation of Martian soil simulant on micromachined Si substrates," Journal of Microscopy, Vol.227, pp.236-245, Sep. 2007. [3] J.M. Rodenburg, "Ptychography and related diffractive imaging techniques," Advances in Imaging and Electron Physics, Vol.150, pp. 87-184, 2008

  10. Micromachined sensor for stress measurement and micromechanical study of free-standing thin films for MEMS applications

    NASA Astrophysics Data System (ADS)

    Zhang, Ping

    Microelectromechanical systems (MEMS) have a wide range of applications. In the field of wireless and microwave technology, considerable attention has been given to the development and integration of MEMS-based RF (radio frequency) components. An RF MEMS switch requires low insertion loss, high isolation, and low actuation voltage - electrical aspects that have been extensively studied. The mechanical requirements of the switch, such as low sensitivity to built-in stress and high reliability, greatly depend on the micromechanical properties of the switch materials, and have not been thoroughly explored. RF MEMS switches are typically in the form of a free-standing thin film structure. Large stress gradients and across-wafer stress variations developed during fabrication severely degrade their electrical performance. A micromachined stress measurement sensor has been developed that can potentially be employed for in-situ monitoring of stress evolution and stress variation. The sensors were micromachined using five masks on two wafer levels, each measuring 5x3x1 mm. They function by means of an electron tunneling mechanism, where a 2x2 mm silicon nitride membrane elastically deflects under an applied deflection voltage via an external feedback circuitry. For the current design, the sensors are capable of measuring tensile stresses up to the GPa range under deflection voltages of 50--100 V. Sensor functionality was studied by finite element modeling and a theoretical analysis of square membrane deflection. While the mechanical properties of thin films on substrates have been extensively studied, studies of free-standing thin films have been limited due to the practical difficulties in sample handling and testing. Free-standing Al and Al-Ti thin films specimens have been successfully fabricated and microtensile and stress relaxation tests have been performed using a custom-designed micromechanical testing apparatus. A dedicated TEM (transmission electron microscopy) sample preparation technique allows the investigation of the microstructures of these thin films both before and after mechanical testing to correlate the microstructural findings with the mechanical behavior. Major studies include grain boundary strengthening in pure Al, plastic deformation in pure Al by inhomogeneous deformation and localized grain thinning, solid solution and precipitate strengthening in Al-Ti alloys, and stress relaxation of Al and Al-Ti.

  11. Ex-vivo HIFU experiments using a 32 × 32-element CMUT array

    PubMed Central

    Yoon, Hyo-Seon; Chang, Chienliu; Jang, Ji Hoon; Bhuyan, Anshuman; Choe, Jung Woo; Nikoozadeh, Amin; Watkins, Ronald D.; Stephens, Douglas N.; Pauly, Kim Butts; Khuri-Yakub, Butrus T.

    2016-01-01

    High-intensity focused ultrasound (HIFU) has been used as noninvasive treatment for various diseases. For these therapeutic applications, capacitive micromachined ultrasonic transducers (CMUTs) have advantages that make them potentially preferred transducers over traditional piezoelectric transducers. In this paper, we present the design and the fabrication process of an 8 × 8-mm2, 32 × 32-element 2-D CMUT array for HIFU applications. To reduce the system complexity for addressing the 1024 transducer elements, we propose to group the CMUT array elements into eight HIFU channels based on the phase delay from the CMUT element to the targeted focal point. Designed to focus at an 8-mm depth with a 5-MHz exciting frequency, this grouping scheme was realized using a custom application-specific integrated circuit (ASIC). With a 40-V DC bias and a 60-V peak-to-peak AC excitation, the surface pressure was measured 1.2 MPa peak-to-peak and stayed stable for a long enough time to create a lesion. With this DC and AC voltage combination, the measured peak-to-peak output pressure at the focus was 8.5 MPa, which is expected to generate a lesion in a minute according to the temperature simulation. Following ex-vivo tissue experiments successfully demonstrated its capability to make lesions in both bovine muscle and liver tissue. PMID:27913330

  12. Uncooled IR imager with 5-mK NEDT

    NASA Astrophysics Data System (ADS)

    Amantea, Robert; Knoedler, C. M.; Pantuso, Francis P.; Patel, Vipulkumar; Sauer, Donald J.; Tower, John R.

    1997-08-01

    The bi-material concept for room-temperature infrared imaging has the potential of reaching an NE(Delta) T approaching the theoretical limit because of its high responsivity and low noise. The approach, which is 100% compatible with silicon IC foundry processing, utilizes a novel combination of surface micromachining and conventional integrated circuits to produce a bimaterial thermally sensitive element that controls the position of a capacitive plate coupled to the input of a low noise MOS amplifier. This approach can achieve the high sensitivity, the low weight, and the low cost necessary for equipment such as helmet mounted IR viewers and IR rifle sights. The pixel design has the following benefits: (1) an order of magnitude improvement in NE(Delta) T due to extremely high sensitivity and low noise, (2) low cost due to 100% silicon IC compatibility, (3) high image quality and increased yield due to ability to do offset and sensitivity corrections on the imager, pixel-by-pixel; (4) no cryogenic cooler and no high vacuum processing; and (5) commercial applications such as law enforcement, home security, and transportation safety. Two designs are presented. One is a 50 micrometer pixel using silicon nitride as the thermal isolation element that can achieve 5 mK NE(Delta) T; the other is a 29 micrometer pixel using silicon carbide that provides much higher thermal isolation and can achieve 10 mK NE(Delta) T.

  13. Direct glass bonded high specific power silicon solar cells for space applications

    NASA Technical Reports Server (NTRS)

    Dinetta, L. C.; Rand, J. A.; Cummings, J. R.; Lampo, S. M.; Shreve, K. P.; Barnett, Allen M.

    1991-01-01

    A lightweight, radiation hard, high performance, ultra-thin silicon solar cell is described that incorporates light trapping and a cover glass as an integral part of the device. The manufacturing feasibility of high specific power, radiation insensitive, thin silicon solar cells was demonstrated experimentally and with a model. Ultra-thin, light trapping structures were fabricated and the light trapping demonstrated experimentally. The design uses a micro-machined, grooved back surface to increase the optical path length by a factor of 20. This silicon solar cell will be highly tolerant to radiation because the base width is less than 25 microns making it insensitive to reduction in minority carrier lifetime. Since the silicon is bonded without silicone adhesives, this solar cell will also be insensitive to UV degradation. These solar cells are designed as a form, fit, and function replacement for existing state of the art silicon solar cells with the effect of simultaneously increasing specific power, power/area, and power supply life. Using a 3-mil thick cover glass and a 0.3 g/sq cm supporting Al honeycomb, a specific power for the solar cell plus cover glass and honeycomb of 80.2 W/Kg is projected. The development of this technology can result in a revolutionary improvement in high survivability silicon solar cell products for space with the potential to displace all existing solar cell technologies for single junction space applications.

  14. Graphene-polydimethylsiloxane/chromium bilayer-based flexible, reversible, and large bendable photomechanical actuators

    NASA Astrophysics Data System (ADS)

    Leeladhar; Raturi, Parul; Kumar, Ajeet; Singh, J. P.

    2017-09-01

    We demonstrate the fabrication of highly versatile photomechanical actuators based on graphene-polymer/metal bilayers that offers fast, low-cost fabrication, large deflection, reversible actuation under zero applied pre-strain, and wavelength-selective response. The photomechanical actuator consists of a graphene nanoplatelet (GNP)-polydimethylsiloxane (PDMS) nanocomposite with a thin chromium metal coating of 35 nm thickness on the backside of the structure. The photomechanical response of the GNP-PDMS/Cr photomechanical actuator was measured by recording the variation of the bending angle upon infrared (IR) light illumination. The bending in the bilayer actuator is caused by the generation of thermal stress due to the large mismatch (the ratio being 1/20) of the thermal expansion coefficient between the two layers as a result of IR absorption by GNPs and a subsequent increase in the local temperature. The maximum bending angle was found to be about 40 degrees with a corresponding large deflection value of about 6-7 mm within 6 s for IR illumination with an intensity of 550 mW cm-2. The corresponding actuation response and relaxation times were about 1 and 3 s, respectively. The GNP-PDMS/Cr bilayer combination when integrated with the standard surface micromachining technique of micro-electromechanical system fabrication can find useful applications in the realization of micro soft-robotics, controlled drug delivery, and light-driven micro switches i.e. micro-optomechanical systems.

  15. Next-Generation Microshutter Arrays for Large-Format Imaging and Spectroscopy

    NASA Technical Reports Server (NTRS)

    Moseley, Samuel; Kutyrev, Alexander; Brown, Ari; Li, Mary

    2012-01-01

    A next-generation microshutter array, LArge Microshutter Array (LAMA), was developed as a multi-object field selector. LAMA consists of small-scaled microshutter arrays that can be combined to form large-scale microshutter array mosaics. Microshutter actuation is accomplished via electrostatic attraction between the shutter and a counter electrode, and 2D addressing can be accomplished by applying an electrostatic potential between a row of shutters and a column, orthogonal to the row, of counter electrodes. Microelectromechanical system (MEMS) technology is used to fabricate the microshutter arrays. The main feature of the microshutter device is to use a set of standard surface micromachining processes for device fabrication. Electrostatic actuation is used to eliminate the need for macromechanical magnet actuating components. A simplified electrostatic actuation with no macro components (e.g. moving magnets) required for actuation and latching of the shutters will make the microshutter arrays robust and less prone to mechanical failure. Smaller-size individual arrays will help to increase the yield and thus reduce the cost and improve robustness of the fabrication process. Reducing the size of the individual shutter array to about one square inch and building the large-scale mosaics by tiling these smaller-size arrays would further help to reduce the cost of the device due to the higher yield of smaller devices. The LAMA development is based on prior experience acquired while developing microshutter arrays for the James Webb Space Telescope (JWST), but it will have different features. The LAMA modular design permits large-format mosaicking to cover a field of view at least 50 times larger than JWST MSA. The LAMA electrostatic, instead of magnetic, actuation enables operation cycles at least 100 times faster and a mass significantly smaller compared to JWST MSA. Also, standard surface micromachining technology will simplify the fabrication process, increasing yield and reducing cost.

  16. Response of capacitive micromachined ultrasonic transducers

    NASA Astrophysics Data System (ADS)

    Ge, Lifeng

    2008-10-01

    Capacitive micromachined ultrasonic transducers (CMUTs) have been developed for airborne ultrasonic applications, acoustic imaging, and chemical and biological detections. Much attention is also paid how to optimize their performance, so that the accurate simulation of the transmitting response of the CMUTs becomes extremely significant. This paper focuses on determining the total input mechanical impedance accountings for damping, and its resistance part is obtained by the calculated natural frequency and equivalent lumped parameters, and the typical 3-dB bandwidth. Thus, the transmitting response can be calculated by using the input mechanical impedance. Moreover, the equivalent electrical circuit can be also established by the determined lumped parameters.

  17. Micromachined microwave signal control device and method for making same

    DOEpatents

    Forman, Michael A [San Francisco, CA

    2008-09-02

    A method for fabricating a signal controller, e.g., a filter or a switch, for a coplanar waveguide during the LIGA fabrication process of the waveguide. Both patterns for the waveguide and patterns for the signal controllers are created on a mask. Radiation travels through the mask and reaches a photoresist layer on a substrate. The irradiated portions are removed and channels are formed on the substrate. A metal is filled into the channels to form the conductors of the waveguide and the signal controllers. Micromachined quasi-lumped elements are used alone or together as filters. The switch includes a comb drive, a spring, a metal plunger, and anchors.

  18. Micromachined actuators/sensors for intratubular positioning/steering

    DOEpatents

    Lee, Abraham P.; Krulevitch, Peter A.; Northrup, M. Allen; Trevino, Jimmy C.

    1998-01-01

    Micromachined thin film cantilever actuators having means for individually controlling the deflection of the cantilevers, valve members, and rudders for steering same through blood vessels, or positioning same within a blood vessel, for example. Such cantilever actuators include tactile sensor arrays mounted on a catheter or guide wire tip for navigation and tissues identification, shape-memory alloy film based catheter/guide wire steering mechanisms, and rudder-based steering devices that allow the selective actuation of rudders that use the flowing blood itself to help direct the catheter direction through the blood vessel. While particularly adapted for medical applications, these cantilever actuators can be used for steering through piping and tubing systems.

  19. A low-power, high-sensitivity micromachined optical magnetometer

    NASA Astrophysics Data System (ADS)

    Mhaskar, R.; Knappe, S.; Kitching, J.

    2012-12-01

    We demonstrate an optical magnetometer based on a microfabricated 87Rb vapor cell in a micromachined silicon sensor head. The alkali atom density in the vapor cell is increased by heating the cell with light brought to the sensor through an optical fiber, and absorbed by colored filters attached to the cell windows. A second fiber-optically coupled beam optically pumps and interrogates the atoms. The magnetometer operates on 140 mW of heating power and achieves a sensitivity below 20 fT/√Hz throughout most of the frequency band from 15 Hz to 100 Hz. Such a sensor can measure magnetic fields from the human heart and brain.

  20. Active micromachines: Microfluidics powered by mesoscale turbulence

    PubMed Central

    Thampi, Sumesh P.; Doostmohammadi, Amin; Shendruk, Tyler N.; Golestanian, Ramin; Yeomans, Julia M.

    2016-01-01

    Dense active matter, from bacterial suspensions and microtubule bundles driven by motor proteins to cellular monolayers and synthetic Janus particles, is characterized by mesoscale turbulence, which is the emergence of chaotic flow structures. By immersing an ordered array of symmetric rotors in an active fluid, we introduce a microfluidic system that exploits spontaneous symmetry breaking in mesoscale turbulence to generate work. The lattice of rotors self-organizes into a spin state where neighboring discs continuously rotate in permanent alternating directions due to combined hydrodynamic and elastic effects. Our virtual prototype demonstrates a new research direction for the design of micromachines powered by the nematohydrodynamic properties of active turbulence. PMID:27419229

Top