Open Systems Interconnection.

ERIC Educational Resources Information Center

Denenberg, Ray

1985-01-01

Discusses the need for standards allowing computer-to-computer communication and gives examples of technical issues. The seven-layer framework of the Open Systems Interconnection (OSI) Reference Model is explained and illustrated. Sidebars feature public data networks and Recommendation X.25, OSI standards, OSI layer functions, and a glossary.…

The designing and implementation of PE teaching information resource database based on broadband network

NASA Astrophysics Data System (ADS)

Wang, Jian

2017-01-01

In order to change traditional PE teaching mode and realize the interconnection, interworking and sharing of PE teaching resources, a distance PE teaching platform based on broadband network is designed and PE teaching information resource database is set up. The designing of PE teaching information resource database takes Windows NT 4/2000Server as operating system platform, Microsoft SQL Server 7.0 as RDBMS, and takes NAS technology for data storage and flow technology for video service. The analysis of system designing and implementation shows that the dynamic PE teaching information resource sharing platform based on Web Service can realize loose coupling collaboration, realize dynamic integration and active integration and has good integration, openness and encapsulation. The distance PE teaching platform based on Web Service and the design scheme of PE teaching information resource database can effectively solve and realize the interconnection, interworking and sharing of PE teaching resources and adapt to the informatization development demands of PE teaching.

Next Generation Space Interconnect Standard (NGSIS): a modular open standards approach for high performance interconnects for space

NASA Astrophysics Data System (ADS)

Collier, Charles Patrick

2017-04-01

The Next Generation Space Interconnect Standard (NGSIS) effort is a Government-Industry collaboration effort to define a set of standards for interconnects between space system components with the goal of cost effectively removing bandwidth as a constraint for future space systems. The NGSIS team has selected the ANSI/VITA 65 OpenVPXTM standard family for the physical baseline. The RapidIO protocol has been selected as the basis for the digital data transport. The NGSIS standards are developed to provide sufficient flexibility to enable users to implement a variety of system configurations, while meeting goals for interoperability and robustness for space. The NGSIS approach and effort represents a radical departure from past approaches to achieve a Modular Open System Architecture (MOSA) for space systems and serves as an exemplar for the civil, commercial, and military Space communities as well as a broader high reliability terrestrial market.

Next generation space interconnect research and development in space communications

NASA Astrophysics Data System (ADS)

Collier, Charles Patrick

2017-11-01

Interconnect or "bus" is one of the critical technologies in design of spacecraft avionics systems that dictates its architecture and complexity. MIL-STD-1553B has long been used as the avionics backbone technology. As avionics systems become more and more capable and complex, however, limitations of MIL-STD-1553B such as insufficient 1 Mbps bandwidth and separability have forced current avionics architects and designers to use combination of different interconnect technologies in order to meet various requirements: CompactPCI is used for backplane interconnect; LVDS or RS422 is used for low and high-speed direct point-to-point interconnect; and some proprietary interconnect standards are designed for custom interfaces. This results in a very complicated system that consumes significant spacecraft mass and power and requires extensive resources in design, integration and testing of spacecraft systems.

WDM package enabling high-bandwidth optical intrasystem interconnects for high-performance computer systems

NASA Astrophysics Data System (ADS)

Schrage, J.; Soenmez, Y.; Happel, T.; Gubler, U.; Lukowicz, P.; Mrozynski, G.

2006-02-01

From long haul, metro access and intersystem links the trend goes to applying optical interconnection technology at increasingly shorter distances. Intrasystem interconnects such as data busses between microprocessors and memory blocks are still based on copper interconnects today. This causes a bottleneck in computer systems since the achievable bandwidth of electrical interconnects is limited through the underlying physical properties. Approaches to solve this problem by embedding optical multimode polymer waveguides into the board (electro-optical circuit board technology, EOCB) have been reported earlier. The principle feasibility of optical interconnection technology in chip-to-chip applications has been validated in a number of projects. For reasons of cost considerations waveguides with large cross sections are used in order to relax alignment requirements and to allow automatic placement and assembly without any active alignment of components necessary. On the other hand the bandwidth of these highly multimodal waveguides is restricted due to mode dispersion. The advance of WDM technology towards intrasystem applications will provide sufficiently high bandwidth which is required for future high-performance computer systems: Assuming that, for example, 8 wavelength-channels with 12Gbps (SDR1) each are given, then optical on-board interconnects with data rates a magnitude higher than the data rates of electrical interconnects for distances typically found at today's computer boards and backplanes can be realized. The data rate will be twice as much, if DDR2 technology is considered towards the optical signals as well. In this paper we discuss an approach for a hybrid integrated optoelectronic WDM package which might enable the application of WDM technology to EOCB.

Synthesis of three-dimensionally interconnected sulfur-rich polymers for cathode materials of high-rate lithium-sulfur batteries

NASA Astrophysics Data System (ADS)

Kim, Hoon; Lee, Joungphil; Ahn, Hyungmin; Kim, Onnuri; Park, Moon Jeong

2015-06-01

Elemental sulfur is one of the most attractive cathode active materials in lithium batteries because of its high theoretical specific capacity. Despite the positive aspect, lithium-sulfur batteries have suffered from severe capacity fading and limited rate capability. Here we report facile large-scale synthesis of a class of organosulfur compounds that could open a new chapter in designing cathode materials to advance lithium-sulfur battery technologies. Porous trithiocyanuric acid crystals are synthesized for use as a soft template, where the ring-opening polymerization of elemental sulfur takes place along the thiol surfaces to create three-dimensionally interconnected sulfur-rich phases. Our lithium-sulfur cells display discharge capacity of 945 mAh g-1 after 100 cycles at 0.2 C with high-capacity retention of 92%, as well as lifetimes of 450 cycles. Particularly, the organized amine groups in the crystals increase Li+-ion transfer rate, affording a rate performance of 1210, mAh g-1 at 0.1 C and 730 mAh g-1 at 5 C.

Synthesis of three-dimensionally interconnected sulfur-rich polymers for cathode materials of high-rate lithium–sulfur batteries

PubMed Central

Kim, Hoon; Lee, Joungphil; Ahn, Hyungmin; Kim, Onnuri; Park, Moon Jeong

2015-01-01

Elemental sulfur is one of the most attractive cathode active materials in lithium batteries because of its high theoretical specific capacity. Despite the positive aspect, lithium–sulfur batteries have suffered from severe capacity fading and limited rate capability. Here we report facile large-scale synthesis of a class of organosulfur compounds that could open a new chapter in designing cathode materials to advance lithium–sulfur battery technologies. Porous trithiocyanuric acid crystals are synthesized for use as a soft template, where the ring-opening polymerization of elemental sulfur takes place along the thiol surfaces to create three-dimensionally interconnected sulfur-rich phases. Our lithium–sulfur cells display discharge capacity of 945 mAh g−1 after 100 cycles at 0.2 C with high-capacity retention of 92%, as well as lifetimes of 450 cycles. Particularly, the organized amine groups in the crystals increase Li+-ion transfer rate, affording a rate performance of 1210, mAh g−1 at 0.1 C and 730 mAh g−1 at 5 C. PMID:26065407

Scaling induced performance challenges/limitations of on-chip metal interconnects and comparisons with optical interconnects

NASA Astrophysics Data System (ADS)

Kapur, Pawan

The miniaturization paradigm for silicon integrated circuits has resulted in a tremendous cost and performance advantage. Aggressive shrinking of devices provides faster transistors and a greater functionality for circuit design. However, scaling induced smaller wire cross-sections coupled with longer lengths owing to larger chip areas, result in a steady deterioration of interconnects. This degradation in interconnect trends threatens to slow down the rapid growth along Moore's law. This work predicts that the situation is worse than anticipated. It shows that in the light of technology and reliability constraints, scaling induced increase in electron surface scattering, fractional cross section area occupied by the highly resistive barrier, and realistic interconnect operation temperature will lead to a significant rise in effective resistivity of modern copper based interconnects. We start by discussing various technology factors affecting copper resistivity. We, next, develop simulation tools to model these effects. Using these tools, we quantify the increase in realistic copper resistivity as a function of future technology nodes, under various technology assumptions. Subsequently, we evaluate the impact of these technology effects on delay and power dissipation of global signaling interconnects. Modern long on-chip wires use repeaters, which dramatically improves their delay and bandwidth. We quantify the repeated wire delays and power dissipation using realistic resistance trends at future nodes. With the motivation of reducing power, we formalize a methodology, which trades power with delay very efficiently for repeated wires. Using this method, we find that although the repeater power comes down, the total power dissipation due to wires is still found to be very large at future nodes. Finally, we explore optical interconnects as a possible substitute, for specific interconnect applications. We model an optical receiver and waveguides. Using this we assess future optical system performance. Finally, we compare the delay and power of future metal interconnects with that of optical interconnects for global signaling application. We also compare the power dissipation of the two approaches for an upper level clock distribution application. We find that for long on-chip communication links, optical interconnects have lower latencies than future metal interconnects at comparable levels of power dissipation.

Panel C report: Standards needed for the use of ISO Open Systems Interconnection - basic reference model

NASA Technical Reports Server (NTRS)

1981-01-01

The use of an International Standards Organization (ISO) Open Systems Interconnection (OSI) Reference Model and its relevance to interconnecting an Applications Data Service (ADS) pilot program for data sharing is discussed. A top level mapping between the conjectured ADS requirements and identified layers within the OSI Reference Model was performed. It was concluded that the OSI model represents an orderly architecture for the ADS networking planning and that the protocols being developed by the National Bureau of Standards offer the best available implementation approach.

OSI and TCP/IP

NASA Technical Reports Server (NTRS)

Randolph, Lynwood P.

1994-01-01

The Open Systems Interconnection Transmission Control Protocol/Internet Protocol (OSI TCP/IP) and the Government Open Systems Interconnection Profile (GOSIP) are compared and described in terms of Federal internetworking. The organization and functions of the Federal Internetworking Requirements Panel (FIRP) are discussed and the panel's conclusions and recommendations with respect to the standards and implementation of the National Information Infrastructure (NII) are presented.

Diametral compression behavior of biomedical titanium scaffolds with open, interconnected pores prepared with the space holder method.

PubMed

Arifvianto, B; Leeflang, M A; Zhou, J

2017-04-01

Scaffolds with open, interconnected pores and appropriate mechanical properties are required to provide mechanical support and to guide the formation and development of new tissue in bone tissue engineering. Since the mechanical properties of the scaffold tend to decrease with increasing porosity, a balance must be sought in order to meet these two conflicting requirements. In this research, open, interconnected pores and mechanical properties of biomedical titanium scaffolds prepared by using the space holder method were characterized. Micro-computed tomography (micro-CT) and permeability analysis were carried out to quantify the porous structures and ascertain the presence of open, interconnected pores in the scaffolds fabricated. Diametral compression (DC) tests were performed to generate stress-strain diagrams that could be used to determine the elastic moduli and yield strengths of the scaffolds. Deformation and failure mechanisms involved in the DC tests of the titanium scaffolds were examined. The results of micro-CT and permeability analyses confirmed the presence of open, interconnected pores in the titanium scaffolds with porosity over a range of 31-61%. Among these scaffolds, a maximum specific surface area could be achieved in the scaffold with a total porosity of 5-55%. DC tests showed that the titanium scaffolds with elastic moduli and yield strengths of 0.64-3.47GPa and 28.67-80MPa, respectively, could be achieved. By comprehensive consideration of specific surface area, permeability and mechanical properties, the titanium scaffolds with porosities in a range of 50-55% were recommended to be used in cancellous bone tissue engineering. Copyright © 2017 Elsevier Ltd. All rights reserved.

Deep Proton Writing for the rapid prototyping of polymer micro-components for optical interconnects and optofluidics

NASA Astrophysics Data System (ADS)

Van Erps, Jürgen; Vervaeke, Michael; Ottevaere, Heidi; Hermanne, Alex; Thienpont, Hugo

2013-07-01

The use of photonics in data communication and numerous other industrial applications brought plenty of prospects for innovation and opened up different unexplored market opportunities. This is a major driving force for the fabrication of micro-optical and micro-mechanical structures and their accurate alignment and integration into opto-mechanical modules and systems. To this end, we present Deep Proton Writing (DPW) as a powerful rapid prototyping technology for such micro-components. The DPW process consists of bombarding polymer samples (PMMA or SU-8) with swift protons, which results after chemical processing steps in high-quality micro-optical components. One of the strengths of the DPW micro-fabrication technology is the ability to fabricate monolithic building blocks that include micro-optical and mechanical functionalities which can be precisely integrated into more complex photonic systems. In this paper we comment on how we shifted from using 8.3 to 16.5 MeV protons for DPW and give some examples of micro-optical and micro-mechanical components recently fabricated through DPW, targeting applications in optical interconnections and in optofluidics.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tooker, Angela C.; Felix, Sarah H.; Pannu, Satinderpall S.

A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.

Bandwidth Management in Resource Constrained Networks

DTIC Science & Technology

2012-03-01

Postgraduate School OSI Open Systems Interconnection QoS Quality of Service TCP Transmission Control Protocol/Internet Protocol TCP/IP Transmission...filtering. B. NORMAL TCP/IP COMMUNICATIONS The Internet is a “complex network WAN that connects LANs and clients around the globe” (Dean, 2009...of the Open Systems Interconnection ( OSI ) model allowing them to route traffic based on MAC address (Kurose & Ross, 2009). While switching

Novel Highly Parallel and Systolic Architectures Using Quantum Dot-Based Hardware

NASA Technical Reports Server (NTRS)

Fijany, Amir; Toomarian, Benny N.; Spotnitz, Matthew

1997-01-01

VLSI technology has made possible the integration of massive number of components (processors, memory, etc.) into a single chip. In VLSI design, memory and processing power are relatively cheap and the main emphasis of the design is on reducing the overall interconnection complexity since data routing costs dominate the power, time, and area required to implement a computation. Communication is costly because wires occupy the most space on a circuit and it can also degrade clock time. In fact, much of the complexity (and hence the cost) of VLSI design results from minimization of data routing. The main difficulty in VLSI routing is due to the fact that crossing of the lines carrying data, instruction, control, etc. is not possible in a plane. Thus, in order to meet this constraint, the VLSI design aims at keeping the architecture highly regular with local and short interconnection. As a result, while the high level of integration has opened the way for massively parallel computation, practical and full exploitation of such a capability in many applications of interest has been hindered by the constraints on interconnection pattern. More precisely. the use of only localized communication significantly simplifies the design of interconnection architecture but at the expense of somewhat restricted class of applications. For example, there are currently commercially available products integrating; hundreds of simple processor elements within a single chip. However, the lack of adequate interconnection pattern among these processing elements make them inefficient for exploiting a large degree of parallelism in many applications.

Novel optical interconnect devices applying mask-transfer self-written method

NASA Astrophysics Data System (ADS)

Ishizawa, Nobuhiko; Matsuzawa, Yusuke; Tokiwa, Yu; Nakama, Kenichi; Mikami, Osamu

2012-01-01

The introduction of optical interconnect technology is expected to solve problems of conventional electric wiring. One of the promising technologies realizing optical interconnect is the self-written waveguide (SWW) technology with lightcurable resin. We have developed a new technology of the "Mask-Transfer Self-Written (MTSW)" method. This new method enables fabrication of arrayed M x N optical channels at one shot of UV-light. Using this technology, several new optical interconnect devices and connection technologies have been proposed and investigated. In this paper, first, we introduce MTSW method briefly. Next, we show plug-in alignment approach using optical waveguide plugs (OWP) and a micro-hole array (MHA) which are made of the light-curable resin. Easy and high efficiency plug-in alignment between fibers and an optoelectronic-printed wiring board (OE-PWB), between a fiber and a VCSEL, so on will be feasible. Then, we propose a new three-dimensional (3D) branch waveguide. By controlling the irradiating angle through the photomask aperture, it will be possible to fabricate 2-branch and 4-branch waveguides with a certain branch angle. The 3D branch waveguide will be very promising in the future optical interconnects and coupler devices of the multicore optical fiber.

Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

NASA Astrophysics Data System (ADS)

Yoshida, Yasunori; Wada, Hikaru; Izumi, Konami; Tokito, Shizuo

2017-05-01

In this work, we demonstrate that highly conductive metal interconnects can be fabricated on the surface of three-dimensional objects using “omnidirectional ink jet” (OIJ) printing technology. OIJ printing technology makes it possible to perform ink jet printing in all directions by combining the motion of a 6-axis vertically articulated robot with precise positioning and a thermal drying process, which allows for the printing of stacked layers. By using OIJ technology, we were the first to successfully fabricate printed interconnect layers having a very low electrical resistance of 12 mΩ over a 10 mm length. Moreover, the results of the high-current test demonstrated that the printed interconnects can withstand high-current-flow of 5 A for 30 min or more.

Architecture for Survivable System Processing (ASSP)

NASA Astrophysics Data System (ADS)

Wood, Richard J.

1991-11-01

The Architecture for Survivable System Processing (ASSP) Program is a multi-phase effort to implement Department of Defense (DOD) and commercially developed high-tech hardware, software, and architectures for reliable space avionics and ground based systems. System configuration options provide processing capabilities to address Time Dependent Processing (TDP), Object Dependent Processing (ODP), and Mission Dependent Processing (MDP) requirements through Open System Architecture (OSA) alternatives that allow for the enhancement, incorporation, and capitalization of a broad range of development assets. High technology developments in hardware, software, and networking models, address technology challenges of long processor life times, fault tolerance, reliability, throughput, memories, radiation hardening, size, weight, power (SWAP) and security. Hardware and software design, development, and implementation focus on the interconnectivity/interoperability of an open system architecture and is being developed to apply new technology into practical OSA components. To insure for widely acceptable architecture capable of interfacing with various commercial and military components, this program provides for regular interactions with standardization working groups (e.g.) the International Standards Organization (ISO), American National Standards Institute (ANSI), Society of Automotive Engineers (SAE), and Institute of Electrical and Electronic Engineers (IEEE). Selection of a viable open architecture is based on the widely accepted standards that implement the ISO/OSI Reference Model.

Architecture for Survivable System Processing (ASSP)

NASA Technical Reports Server (NTRS)

Wood, Richard J.

1991-01-01

The Architecture for Survivable System Processing (ASSP) Program is a multi-phase effort to implement Department of Defense (DOD) and commercially developed high-tech hardware, software, and architectures for reliable space avionics and ground based systems. System configuration options provide processing capabilities to address Time Dependent Processing (TDP), Object Dependent Processing (ODP), and Mission Dependent Processing (MDP) requirements through Open System Architecture (OSA) alternatives that allow for the enhancement, incorporation, and capitalization of a broad range of development assets. High technology developments in hardware, software, and networking models, address technology challenges of long processor life times, fault tolerance, reliability, throughput, memories, radiation hardening, size, weight, power (SWAP) and security. Hardware and software design, development, and implementation focus on the interconnectivity/interoperability of an open system architecture and is being developed to apply new technology into practical OSA components. To insure for widely acceptable architecture capable of interfacing with various commercial and military components, this program provides for regular interactions with standardization working groups (e.g.) the International Standards Organization (ISO), American National Standards Institute (ANSI), Society of Automotive Engineers (SAE), and Institute of Electrical and Electronic Engineers (IEEE). Selection of a viable open architecture is based on the widely accepted standards that implement the ISO/OSI Reference Model.

Open architectures for formal reasoning and deductive technologies for software development

NASA Technical Reports Server (NTRS)

Mccarthy, John; Manna, Zohar; Mason, Ian; Pnueli, Amir; Talcott, Carolyn; Waldinger, Richard

1994-01-01

The objective of this project is to develop an open architecture for formal reasoning systems. One goal is to provide a framework with a clear semantic basis for specification and instantiation of generic components; construction of complex systems by interconnecting components; and for making incremental improvements and tailoring to specific applications. Another goal is to develop methods for specifying component interfaces and interactions to facilitate use of existing and newly built systems as 'off the shelf' components, thus helping bridge the gap between producers and consumers of reasoning systems. In this report we summarize results in several areas: our data base of reasoning systems; a theory of binding structures; a theory of components of open systems; a framework for specifying components of open reasoning system; and an analysis of the integration of rewriting and linear arithmetic modules in Boyer-Moore using the above framework.

PICSiP: new system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems

NASA Astrophysics Data System (ADS)

Tekin, Tolga; Töpper, Michael; Reichl, Herbert

2009-05-01

Technological frontiers between semiconductor technology, packaging, and system design are disappearing. Scaling down geometries [1] alone does not provide improvement of performance, less power, smaller size, and lower cost. It will require "More than Moore" [2] through the tighter integration of system level components at the package level. System-in-Package (SiP) will deliver the efficient use of three dimensions (3D) through innovation in packaging and interconnect technology. A key bottleneck to the implementation of high-performance microelectronic systems, including SiP, is the lack of lowlatency, high-bandwidth, and high density off-chip interconnects. Some of the challenges in achieving high-bandwidth chip-to-chip communication using electrical interconnects include the high losses in the substrate dielectric, reflections and impedance discontinuities, and susceptibility to crosstalk [3]. Obviously, the incentive for the use of photonics to overcome the challenges and leverage low-latency and highbandwidth communication will enable the vision of optical computing within next generation architectures. Supercomputers of today offer sustained performance of more than petaflops, which can be increased by utilizing optical interconnects. Next generation computing architectures are needed with ultra low power consumption; ultra high performance with novel interconnection technologies. In this paper we will discuss a CMOS compatible underlying technology to enable next generation optical computing architectures. By introducing a new optical layer within the 3D SiP, the development of converged microsystems, deployment for next generation optical computing architecture will be leveraged.

Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections

NASA Astrophysics Data System (ADS)

Lee, Sang-Hoon; Kim, Tae-Wan; Suk, Kyung-Lim; Paik, Kyung-Wook

2015-11-01

Nanofiber anisotropic conductive films (ACF) were invented, by adapting nanofiber technology to ACF materials, to overcome the limitations of ultra-fine-pitch interconnection packaging, i.e. shorts and open circuits as a result of the narrow space between bumps and electrodes. For nanofiber ACF, poly(vinylidene fluoride) (PVDF) and poly(butylene succinate) (PBS) polymers were used as nanofiber polymer materials. For PVDF and PBS nanofiber ACF, conductive particles of diameter 3.5 μm were incorporated into nanofibers by electrospinning. In ultra-fine-pitch chip-on-glass assembly, insulation was significantly improved by using nanofiber ACF, because nanofibers inside the ACF suppressed the mobility of conductive particles, preventing them from flowing out during the bonding process. Capture of conductive particles was increased from 31% (conventional ACF) to 65%, and stable electrical properties and reliability were achieved by use of nanofiber ACF.

Experience with abstract notation one

NASA Technical Reports Server (NTRS)

Harvey, James D.; Weaver, Alfred C.

1990-01-01

The development of computer science has produced a vast number of machine architectures, programming languages, and compiler technologies. The cross product of these three characteristics defines the spectrum of previous and present data representation methodologies. With regard to computer networks, the uniqueness of these methodologies presents an obstacle when disparate host environments are to be interconnected. Interoperability within a heterogeneous network relies upon the establishment of data representation commonality. The International Standards Organization (ISO) is currently developing the abstract syntax notation one standard (ASN.1) and the basic encoding rules standard (BER) that collectively address this problem. When used within the presentation layer of the open systems interconnection reference model, these two standards provide the data representation commonality required to facilitate interoperability. The details of a compiler that was built to automate the use of ASN.1 and BER are described. From this experience, insights into both standards are given and potential problems relating to this development effort are discussed.

VCSEL-based optical transceiver module for high-speed short-reach interconnect

NASA Astrophysics Data System (ADS)

Yagisawa, Takatoshi; Oku, Hideki; Mori, Tatsuhiro; Tsudome, Rie; Tanaka, Kazuhiro; Daikuhara, Osamu; Komiyama, Takeshi; Ide, Satoshi

2017-02-01

Interconnects have been more important in high-performance computing systems and high-end servers beside its improvements in computing capability. Recently, active optical cables (AOCs) have started being used for this purpose instead of conventionally used copper cables. The AOC enables to extend the transmission distance of the high-speed signals dramatically by its broadband characteristics, however, it tend to increase the cost. In this paper, we report our developed quad small form-factor pluggable (QSFP) AOC utilizing cost-effective optical-module technologies. These are a unique structure using generally used flexible printed circuit (FPC) in combination with an optical waveguide that enables low-cost high-precision assembly with passive alignment, a lens-integrated ferrule that improves productivity by eliminating a polishing process for physical contact of standard PMT connector for the optical waveguide, and an overdrive technology that enables 100 Gb/s (25 Gb/s × 4-channel) operation with low-cost 14 Gb/s vertical-cavity surfaceemitting laser (VCSEL) array. The QSFP AOC demonstrated clear eye opening and error-free operation at 100 Gb/s with high yield rate even though the 14 Gb/s VCSEL was used thanks to the low-coupling loss resulting from the highprecision alignment of optical devices and the over-drive technology.

Government Open Systems Interconnection Profile (GOSIP) transition strategy

NASA Astrophysics Data System (ADS)

Laxen, Mark R.

1993-09-01

This thesis analyzes the Government Open Systems Interconnection Profile (GOSIP) and the requirements of the Federal Information Processing Standard (FIPS) Publication 146-1. It begins by examining the International Organization for Standardization (ISO) Open Systems Interconnection (OSI) architecture and protocol suites and the distinctions between GOSIP version one and two. Additionally, it explores some of the GOSIP protocol details and discusses the process by which standards organizations have developed their recommendations. Implementation considerations from both government and vendor perspectives illustrate the barriers and requirements faced by information systems managers, as well as basic transition strategies. The result of this thesis is to show a transition strategy through an extended and coordinated period of coexistence due to extensive legacy systems and GOSIP product unavailability. Recommendations for GOSIP protocol standards to include capabilities outside the OSI model are also presented.

Flexible neural interfaces with integrated stiffening shank

DOEpatents

Tooker, Angela C.; Felix, Sarah H.; Pannu, Satinderpall S.; Shah, Kedar G.; Sheth, Heeral; Tolosa, Vanessa

2016-07-26

A neural interface includes a first dielectric material having at least one first opening for a first electrical conducting material, a first electrical conducting material in the first opening, and at least one first interconnection trace electrical conducting material connected to the first electrical conducting material. A stiffening shank material is located adjacent the first dielectric material, the first electrical conducting material, and the first interconnection trace electrical conducting material.

Manifesto of computational social science

NASA Astrophysics Data System (ADS)

Conte, R.; Gilbert, N.; Bonelli, G.; Cioffi-Revilla, C.; Deffuant, G.; Kertesz, J.; Loreto, V.; Moat, S.; Nadal, J.-P.; Sanchez, A.; Nowak, A.; Flache, A.; San Miguel, M.; Helbing, D.

2012-11-01

The increasing integration of technology into our lives has created unprecedented volumes of data on society's everyday behaviour. Such data opens up exciting new opportunities to work towards a quantitative understanding of our complex social systems, within the realms of a new discipline known as Computational Social Science. Against a background of financial crises, riots and international epidemics, the urgent need for a greater comprehension of the complexity of our interconnected global society and an ability to apply such insights in policy decisions is clear. This manifesto outlines the objectives of this new scientific direction, considering the challenges involved in it, and the extensive impact on science, technology and society that the success of this endeavour is likely to bring about.

Optical interconnection and packaging technologies for advanced avionics systems

NASA Astrophysics Data System (ADS)

Schroeder, J. E.; Christian, N. L.; Cotti, B.

1992-09-01

An optical backplane developed to demonstrate the advantages of high-performance optical interconnections and supporting technologies and designed to be compatible with standard avionics racks is described. The hardware demonstrates the three basic components of optical interconnects: optical sources, an optical signal distribution network, and optical receivers. Results from characterization and environmental tests, including a demonstration of the reliable transmission of serial data at a 1 Gb/s, are reported.

Advanced Flip Chips in Extreme Temperature Environments

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni

2010-01-01

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sheaffer, P.; Lemar, P.; Honton, E. J.

The Universal Interconnection Technology (UIT) Workshop - sponsored by the U.S. Department of Energy, Distributed Energy and Electric Reliability (DEER) Program, and Distribution and Interconnection R&D - was held July 25-26, 2002, in Chicago, Ill., to: (1) Examine the need for a modular universal interconnection technology; (2) Identify UIT functional and technical requirements; (3) Assess the feasibility of and potential roadblocks to UIT; (4) Create an action plan for UIT development. These proceedings begin with an overview of the workshop. The body of the proceedings provides a series of industry representative-prepared papers on UIT functions and features, present interconnection technology,more » approaches to modularization and expandability, and technical issues in UIT development as well as detailed summaries of group discussions. Presentations, a list of participants, a copy of the agenda, and contact information are provided in the appendices of this document.« less

The Open System Interconnection as a building block in a health sciences information network.

PubMed Central

Boss, R W

1985-01-01

The interconnection of integrated health sciences library systems with other health sciences computer systems to achieve information networks will require either custom linkages among specific devices or the adoption of standards that all systems support. The most appropriate standards appear to be those being developed under the Open System Interconnection (OSI) reference model, which specifies a set of rules and functions that computers must follow to exchange information. The protocols have been modularized into seven different layers. The lowest three layers are generally available as off-the-shelf interfacing products. The higher layers require special development for particular applications. This paper describes the OSI, its application in health sciences networks, and specific tasks that remain to be undertaken. PMID:4052672

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

39 CFR 255.2 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... technology” and any equipment or interconnected system or subsystem of equipment that is used in the creation... embedded information technology that is used as an integral part of the product, but the principal function... an impairment. (f) Information technology means any equipment, or interconnected system or subsystem...

Manufacturing and quality control of interconnecting wire harnesses, Volume 2

NASA Technical Reports Server (NTRS)

1972-01-01

Interconnecting wire harnesses defined in the design standard are considered, including type 4, open bundle (not enclosed). Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into the document.

3D-Printing: an emerging and a revolutionary technology in pharmaceuticals.

PubMed

Singhvi, Gautam; Patil, Shalini; Girdhar, Vishal; Chellappan, Dinesh K; Gupta, Gaurav; Dua, Kamal

2018-06-01

One of the novel and progressive technology employed in pharmaceutical manufacturing, design of medical device and tissue engineering is threedimensional (3D) printing. 3D printing technologies provide great advantages in 3D scaffolds fabrication over traditional methods in the control of pore size, porosity, and interconnectivity. Various techniques of 3Dprinting include powder bed fusion, fused deposition modeling, binder deposition, inkjet printing, photopolymerization and many others which are still evolving. 3Dprinting technique been employed in developing immediate release products, various systems to deliver multiple release modalities etc. 3D printing has opened the door for new generation of customized drug delivery with builtin flexibility for safer and effective therapy. Our minireview provides a quick snapshot on an overview of 3D printing, various techniques employed, applications and its advancements in pharmaceutical sciences.

Microwave interconnection

NASA Astrophysics Data System (ADS)

Fry, P. E.

1993-06-01

A limited evaluation was made of two commonly found microwave interconnections: microstrip-to-microstrip and coaxial-to-microstrip. The evaluation attempted to select the interconnection technique which worked best for the particular interface type. Short ribbon wires worked best for the microstrip-to-microstrip interconnection. A published method of compensating the microstrip conductor had the best performance for the coaxial-to-microstrip interconnection. The work was conducted under the Microwave Technology Process Capability Assurance Program at Allied-Signal Inc., Kansas City Division.

NREL Leadership Contributes to Revision of Key Energy Integration Standard,

Science.gov Websites

interconnection standard for distributed energy resource technologies, including rooftop solar panels. The , which establishes uniform requirements for interconnection of distributed energy resources (DERs), such foundation for integrating clean renewable energy technologies as well as other distributed generation and

Initial results for the silicon monolithically interconnected solar cell product

NASA Technical Reports Server (NTRS)

Dinetta, L. C.; Shreve, K. P.; Cotter, J. E.; Barnett, A. M.

1995-01-01

This proprietary technology is based on AstroPower's electrostatic bonding and innovative silicon solar cell processing techniques. Electrostatic bonding allows silicon wafers to be permanently attached to a thermally matched glass superstrate and then thinned to final thicknesses less than 25 micron. These devices are based on the features of a thin, light-trapping silicon solar cell: high voltage, high current, light weight (high specific power) and high radiation resistance. Monolithic interconnection allows the fabrication costs on a per watt basis to be roughly independent of the array size, power or voltage, therefore, the cost effectiveness to manufacture solar cell arrays with output powers ranging from milliwatts up to four watts and output voltages ranging from 5 to 500 volts will be similar. This compares favorably to conventionally manufactured, commercial solar cell arrays, where handling of small parts is very labor intensive and costly. In this way, a wide variety of product specifications can be met using the same fabrication techniques. Prototype solar cells have demonstrated efficiencies greater than 11%. An open-circuit voltage of 5.4 volts, fill factor of 65%, and short-circuit current density of 28 mA/sq cm at AM1.5 illumination are typical. Future efforts are being directed to optimization of the solar cell operating characteristics as well as production processing. The monolithic approach has a number of inherent advantages, including reduced cost per interconnect and increased reliability of array connections. These features make this proprietary technology an excellent candidate for a large number of consumer products.

High-performance parallel processors based on star-coupled wavelength division multiplexing optical interconnects

DOEpatents

Deri, Robert J.; DeGroot, Anthony J.; Haigh, Ronald E.

2002-01-01

As the performance of individual elements within parallel processing systems increases, increased communication capability between distributed processor and memory elements is required. There is great interest in using fiber optics to improve interconnect communication beyond that attainable using electronic technology. Several groups have considered WDM, star-coupled optical interconnects. The invention uses a fiber optic transceiver to provide low latency, high bandwidth channels for such interconnects using a robust multimode fiber technology. Instruction-level simulation is used to quantify the bandwidth, latency, and concurrency required for such interconnects to scale to 256 nodes, each operating at 1 GFLOPS performance. Performance scales have been shown to .apprxeq.100 GFLOPS for scientific application kernels using a small number of wavelengths (8 to 32), only one wavelength received per node, and achievable optoelectronic bandwidth and latency.

OSI Upper Layers Support for Applications.

ERIC Educational Resources Information Center

Davison, Wayne

1990-01-01

Discusses how various Open Systems Interconnection (OSI) application layer protocols can be used together, along with the Presentation and Session protocols, to support the interconnection requirements of applications. Application layer protocol standards that are currently available or under development are reviewed, and the File, Transfer,…

Novel optical interconnect devices and coupling methods applying self-written waveguide technology

NASA Astrophysics Data System (ADS)

Nakama, Kenichi; Mikami, Osamu

2011-05-01

For the use in cost-effective optical interconnection of opt-electronic printed wiring boards (OE-PWBs), we have developed novel optical interconnect devices and coupling methods simplifying board to board optical interconnect. All these are based on the self-written waveguide (SWW) technology by the mask-transfer method with light-curable resin. This method enables fabrication of arrayed M × N optical channels at one shot of UV light. Very precise patterns, as an example, optical rod with diameters of 50μm to 500μm, can be easily fabricated. The length of the fabricated patterns ,, typically up to about 1000μm , can be controlled by a spacer placed between the photomask and the substrate. Using these technologies, several new optical interfaces have been demonstrated. These are a chip VCSEL with an optical output rod and new coupling methods of "plug-in" alignment and "optical socket" based on SWW.

Policy issues in interconnecting networks

NASA Technical Reports Server (NTRS)

Leiner, Barry M.

1989-01-01

To support the activities of the Federal Research Coordinating Committee (FRICC) in creating an interconnected set of networks to serve the research community, two workshops were held to address the technical support of policy issues that arise when interconnecting such networks. The workshops addressed the required and feasible technologies and architectures that could be used to satisfy the desired policies for interconnection. The results of the workshop are documented.

Self-assembled three dimensional network designs for soft electronics

PubMed Central

Jang, Kyung-In; Li, Kan; Chung, Ha Uk; Xu, Sheng; Jung, Han Na; Yang, Yiyuan; Kwak, Jean Won; Jung, Han Hee; Song, Juwon; Yang, Ce; Wang, Ao; Liu, Zhuangjian; Lee, Jong Yoon; Kim, Bong Hoon; Kim, Jae-Hwan; Lee, Jungyup; Yu, Yongjoon; Kim, Bum Jun; Jang, Hokyung; Yu, Ki Jun; Kim, Jeonghyun; Lee, Jung Woo; Jeong, Jae-Woong; Song, Young Min; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

2017-01-01

Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors. PMID:28635956

Self-assembled three dimensional network designs for soft electronics

NASA Astrophysics Data System (ADS)

Jang, Kyung-In; Li, Kan; Chung, Ha Uk; Xu, Sheng; Jung, Han Na; Yang, Yiyuan; Kwak, Jean Won; Jung, Han Hee; Song, Juwon; Yang, Ce; Wang, Ao; Liu, Zhuangjian; Lee, Jong Yoon; Kim, Bong Hoon; Kim, Jae-Hwan; Lee, Jungyup; Yu, Yongjoon; Kim, Bum Jun; Jang, Hokyung; Yu, Ki Jun; Kim, Jeonghyun; Lee, Jung Woo; Jeong, Jae-Woong; Song, Young Min; Huang, Yonggang; Zhang, Yihui; Rogers, John A.

2017-06-01

Low modulus, compliant systems of sensors, circuits and radios designed to intimately interface with the soft tissues of the human body are of growing interest, due to their emerging applications in continuous, clinical-quality health monitors and advanced, bioelectronic therapeutics. Although recent research establishes various materials and mechanics concepts for such technologies, all existing approaches involve simple, two-dimensional (2D) layouts in the constituent micro-components and interconnects. Here we introduce concepts in three-dimensional (3D) architectures that bypass important engineering constraints and performance limitations set by traditional, 2D designs. Specifically, open-mesh, 3D interconnect networks of helical microcoils formed by deterministic compressive buckling establish the basis for systems that can offer exceptional low modulus, elastic mechanics, in compact geometries, with active components and sophisticated levels of functionality. Coupled mechanical and electrical design approaches enable layout optimization, assembly processes and encapsulation schemes to yield 3D configurations that satisfy requirements in demanding, complex systems, such as wireless, skin-compatible electronic sensors.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

Open System Interconnection - NASA program communications of the future. [developed by International aorganization for Standardization

NASA Technical Reports Server (NTRS)

Brady, Charles D.

1987-01-01

Open Systems Interconnection (OSI) standards are being developed by the ISO and the Consultative Committee on International Telephone and Telegraph with the support of industry. These standards are being developed to allow the interconnecting of computer systems and the interworking of applications such that the applications can be independent of any equipment manufacturer. Significant progress has been made, and the establishment of government OSI standards is being considered. There is considerable interest within NASA in the potential benefits of OSI and in communications standards in general. The OSI standards are being considered for possible application in the Space Station onboard data management system. The OSI standards have reached a high level of maturity, and it is now imperative that NASA plan for future migration to OSI where appropriate.

Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers.

PubMed

Jahanshahi, Amir; Salvo, Pietro; Vanfleteren, Jan

2012-01-01

Stretchable and curvilinear electronics has been used recently for the fabrication of micro systems interacting with the human body. The applications range from different kinds of implantable sensors inside the body to conformable electrodes and artificial skins. One of the key parameters in biocompatible stretchable electronics is the fabrication of reliable electrical interconnects. Although very recent literature has reported on the reliability of stretchable interconnects by cyclic loading, work still needs to be done on the integration of electrical circuitry composed of rigid components and stretchable interconnects in a biological environment. In this work, the feasibility of a developed technology to fabricate simple electrical circuits with meander shaped stretchable interconnects is presented. Stretchable interconnects are 200 nm thin Au layer supported with polyimide (PI). A stretchable array of light emitting diodes (LEDs) is embedded in biocompatible elastomer using this technology platform and it features a 50% total elongation.

Final Technical Report for Automated Manufacturing of Innovative CPV/PV Modules

DOE Office of Scientific and Technical Information (OSTI.GOV)

Okawa, David

Cogenra’s Dense Cell Interconnect system was designed to use traditional front-contact cells and string them together into high efficiency and high reliability “supercells”. This novel stringer allows one to take advantage of the ~100 GW/year of existing cell production capacity and create a solar product for the customer that will produce more power and last longer than traditional PV products. The goal for this program was for Cogenra Solar to design and develop a first-of-kind automated solar manufacturing line that produces strings of overlapping cells or “supercells” based on Cogenra’s Dense Cell Interconnect (DCI) technology for their Low Concentration Photovoltaicmore » (LCPV) systems. This will enable the commercialization of DCI technology to improve the efficiency, reliability and economics for their Low Concentration Photovoltaic systems. In this program, Cogenra Solar very successfully designed, developed, built, installed, and started up the ground-breaking manufacturing tools required to assemble supercells. Cogenra then successfully demonstrated operation of the integrated line at high yield and throughput far exceeding expectations. The development of a supercell production line represents a critical step toward a high volume and low cost Low Concentration Photovoltaic Module with Dense Cell Interconnect technology and has enabled the evaluation of the technology for reliability and yield. Unfortunately, performance and cost headwinds on Low Concentration Photovoltaics systems including lack of diffuse capture (10-15% hit) and more expensive tracker requirements resulted in a move away from LCPV technology. Fortunately, the versatility of Dense Cell Interconnect technology allows for application to flat plate module technology as well and Cogenra has worked with the DOE to utilize the learning from this grant to commercialize DCI technology for the solar market through the on-going grant: Catalyzing PV Manufacturing in the US With Cogenra Solar’s Next-Generation Dense Cell Interconnect PV Module Manufacturing Technology. This program is now very successfully building off of this work and commercializing the technology to enable increased solar adoption.« less

Open data models for smart health interconnected applications: the example of openEHR.

PubMed

Demski, Hans; Garde, Sebastian; Hildebrand, Claudia

2016-10-22

Smart Health is known as a concept that enhances networking, intelligent data processing and combining patient data with other parameters. Open data models can play an important role in creating a framework for providing interoperable data services that support the development of innovative Smart Health applications profiting from data fusion and sharing. This article describes a model-driven engineering approach based on standardized clinical information models and explores its application for the development of interoperable electronic health record systems. The following possible model-driven procedures were considered: provision of data schemes for data exchange, automated generation of artefacts for application development and native platforms that directly execute the models. The applicability of the approach in practice was examined using the openEHR framework as an example. A comprehensive infrastructure for model-driven engineering of electronic health records is presented using the example of the openEHR framework. It is shown that data schema definitions to be used in common practice software development processes can be derived from domain models. The capabilities for automatic creation of implementation artefacts (e.g., data entry forms) are demonstrated. Complementary programming libraries and frameworks that foster the use of open data models are introduced. Several compatible health data platforms are listed. They provide standard based interfaces for interconnecting with further applications. Open data models help build a framework for interoperable data services that support the development of innovative Smart Health applications. Related tools for model-driven application development foster semantic interoperability and interconnected innovative applications.

A survey of tools and resources for the next generation analyst

NASA Astrophysics Data System (ADS)

Hall, David L.; Graham, Jake; Catherman, Emily

2015-05-01

We have previously argued that a combination of trends in information technology (IT) and changing habits of people using IT provide opportunities for the emergence of a new generation of analysts that can perform effective intelligence, surveillance and reconnaissance (ISR) on a "do it yourself" (DIY) or "armchair" approach (see D.L. Hall and J. Llinas (2014)). Key technology advances include: i) new sensing capabilities including the use of micro-scale sensors and ad hoc deployment platforms such as commercial drones, ii) advanced computing capabilities in mobile devices that allow advanced signal and image processing and modeling, iii) intelligent interconnections due to advances in "web N" capabilities, and iv) global interconnectivity and increasing bandwidth. In addition, the changing habits of the digital natives reflect new ways of collecting and reporting information, sharing information, and collaborating in dynamic teams. This paper provides a survey and assessment of tools and resources to support this emerging analysis approach. The tools range from large-scale commercial tools such as IBM i2 Analyst Notebook, Palantir, and GeoSuite to emerging open source tools such as GeoViz and DECIDE from university research centers. The tools include geospatial visualization tools, social network analysis tools and decision aids. A summary of tools is provided along with links to web sites for tool access.

High-efficiency photovoltaic technology including thermoelectric generation

NASA Astrophysics Data System (ADS)

Fisac, Miguel; Villasevil, Francesc X.; López, Antonio M.

2014-04-01

Nowadays, photovoltaic solar energy is a clean and reliable source for producing electric power. Most photovoltaic systems have been designed and built up for use in applications with low power requirements. The efficiency of solar cells is quite low, obtaining best results in monocrystalline silicon structures, with an efficiency of about 18%. When temperature rises, photovoltaic cell efficiency decreases, given that the short-circuit current is slightly increased, and the open-circuit voltage, fill factor and power output are reduced. To ensure that this does not affect performance, this paper describes how to interconnect photovoltaic and thermoelectric technology into a single structure. The temperature gradient in the solar panel is used to supply thermoelectric cells, which generate electricity, achieving a positive contribution to the total balance of the complete system.

Ge-Photodetectors for Si-Based Optoelectronic Integration

PubMed Central

Wang, Jian; Lee, Sungjoo

2011-01-01

High speed photodetectors are a key building block, which allow a large wavelength range of detection from 850 nm to telecommunication standards at optical fiber band passes of 1.3–1.55 μm. Such devices are key components in several applications such as local area networks, board to board, chip to chip and intrachip interconnects. Recent technological achievements in growth of high quality SiGe/Ge films on Si wafers have opened up the possibility of low cost Ge-based photodetectors for near infrared communication bands and high resolution spectral imaging with high quantum efficiencies. In this review article, the recent progress in the development and integration of Ge-photodetectors on Si-based photonics will be comprehensively reviewed, along with remaining technological issues to be overcome and future research trends. PMID:22346598

Micro-fluidic interconnect

DOEpatents

Okandan, Murat [Albuquerque, NM; Galambos, Paul C [Albuquerque, NM; Benavides, Gilbert L [Los Ranchos, NM; Hetherington, Dale L [Albuquerque, NM

2006-02-28

An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm.times.6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.

"This is my way": reimagining disability, in/dependence and interconnectedness of persons and assistive technologies.

PubMed

Gibson, Barbara E; Carnevale, Franco A; King, Gillian

2012-01-01

Postmodernism provides a radical alternative to the dominant discourses of Western societies that emphasize autonomy and independence. It suggests a reimagining of the relationship between the self and the body and the increasingly blurred boundaries between biology and machine. The purpose of this article is to explore in/dependence through a discussion of interconnectedness of persons and assistive technologies. Drawing on postmodern theories, we discuss the interconnections inherent in disability experiences through the case example of Mimi, an adolescent girl with severe physical disabilities. We consider how Mimi, her assistive technologies and her parents can be viewed as assemblages of bodies/technologies/subjectivities that together achieve a set of practices. An examination of these various couplings suggests different understandings of disability that open up possibilities for multiple connections and reimagines dependencies as connectivities. Connectivity can be embraced to explore multiple ways of being-in-the-world for all persons and problematizes the goals of independence inherent in rehabilitation practices.

Rapid thermal cycling of new technology solar array blanket coupons

NASA Technical Reports Server (NTRS)

Scheiman, David A.; Smith, Bryan K.; Kurland, Richard M.; Mesch, Hans G.

1990-01-01

NASA Lewis Research Center is conducting thermal cycle testing of a new solar array blanket technologies. These technologies include test coupons for Space Station Freedom (SSF) and the advanced photovoltaic solar array (APSA). The objective of this testing is to demonstrate the durability or operational lifetime of the solar array interconnect design and blanket technology within a low earth orbit (LEO) or geosynchronous earth orbit (GEO) thermal cycling environment. Both the SSF and the APSA array survived all rapid thermal cycling with little or no degradation in peak performance. This testing includes an equivalent of 15 years in LEO for SSF test coupons and 30 years of GEO plus ten years of LEO for the APSA test coupon. It is concluded that both the parallel gap welding of the SSF interconnects and the soldering of the APSA interconnects are adequately designed to handle the thermal stresses of space environment temperature extremes.

Embedded optical interconnect technology in data storage systems

NASA Astrophysics Data System (ADS)

Pitwon, Richard C. A.; Hopkins, Ken; Milward, Dave; Muggeridge, Malcolm

2010-05-01

As both data storage interconnect speeds increase and form factors in hard disk drive technologies continue to shrink, the density of printed channels on the storage array midplane goes up. The dominant interconnect protocol on storage array midplanes is expected to increase to 12 Gb/s by 2012 thereby exacerbating the performance bottleneck in future digital data storage systems. The design challenges inherent to modern data storage systems are discussed and an embedded optical infrastructure proposed to mitigate this bottleneck. The proposed solution is based on the deployment of an electro-optical printed circuit board and active interconnect technology. The connection architecture adopted would allow for electronic line cards with active optical edge connectors to be plugged into and unplugged from a passive electro-optical midplane with embedded polymeric waveguides. A demonstration platform has been developed to assess the viability of embedded electro-optical midplane technology in dense data storage systems and successfully demonstrated at 10.3 Gb/s. Active connectors incorporate optical transceiver interfaces operating at 850 nm and are connected in an in-plane coupling configuration to the embedded waveguides in the midplane. In addition a novel method of passively aligning and assembling passive optical devices to embedded polymer waveguide arrays has also been demonstrated.

75 FR 32937 - Combined Notice of Filings #1

Federal Register 2010, 2011, 2012, 2013, 2014

2010-06-10

... proposed amendments to its Open Access Transmission, Energy and Operating Reserve Markets Tariff. Filed... Interconnection, LLC submits the revised Open Access Tariff. Filed Date: 05/27/2010. Accession Number: 20100527... proposed revisions to its FERC Open Access Transmission Tariff to be effective 6/1/10. Filed Date: 05/27...

Multiband Radio Frequency Interconnect (MRFI) Technology For Next Generation Mobile/Airborne Computing Systems

DTIC Science & Technology

2017-02-01

enable high scalability and reconfigurability for inter-CPU/Memory communications with an increased number of communication channels in frequency ...interconnect technology (MRFI) to enable high scalability and re-configurability for inter-CPU/Memory communications with an increased number of communication ...testing in the University of California, Los Angeles (UCLA) Center for High Frequency Electronics, and Dr. Afshin Momtaz at Broadcom Corporation for

A Lossless Network for Data Acquisition

NASA Astrophysics Data System (ADS)

Jereczek, Grzegorz; Lehmann Miotto, Giovanna; Malone, David; Walukiewicz, Miroslaw

2017-06-01

The bursty many-to-one communication pattern, typical for data acquisition systems, is particularly demanding for commodity TCP/IP and Ethernet technologies. We expand the study of lossless switching in software running on commercial off-the-shelf servers, using the ATLAS experiment as a case study. In this paper, we extend the popular software switch, Open vSwitch, with a dedicated, throughput-oriented buffering mechanism for data acquisition. We compare the performance under heavy congestion on typical Ethernet switches to a commodity server acting as a switch. Our results indicate that software switches with large buffers perform significantly better. Next, we evaluate the scalability of the system when building a larger topology of interconnected software switches, exploiting the integration with software-defined networking technologies. We build an IP-only leaf-spine network consisting of eight software switches running on distinct physical servers as a demonstrator.

Open magnetic fields in active regions

NASA Technical Reports Server (NTRS)

Svestka, Z.; Solodyna, C. V.; Howard, R.; Levine, R. H.

1977-01-01

Soft X-ray images and magnetograms of several active regions and coronal holes are examined which support the interpretation that some of the dark X-ray gaps seen between interconnecting loops and inner cores of active regions are foot points of open field lines inside the active regions. Characteristics of the investigated dark gaps are summarized. All the active regions with dark X-ray gaps at the proper place and with the correct polarity predicted by global potential extrapolation of photospheric magnetic fields are shown to be old active regions, indicating that field opening is accomplished only in a late phase of active-region development. It is noted that some of the observed dark gaps probably have nothing in common with open fields, but are either due to the decreased temperature in low-lying portions of interconnecting loops or are the roots of higher and less dense or cooler loops.

A nonsingular model of the open magnetosphere

NASA Technical Reports Server (NTRS)

Toffoletto, F. R.; Hill, T. W.

1993-01-01

We present a modified version of the Toffoletto and Hill (1989) open magnetosphere model that incorporates a tail-like interconection field with a discontinuity 10 represent the slow-mode expansion fan that defines the high-latitude tail magnetopause. (The interconnection field is defined as the perturbation on an initially closed magnetosphere model to make it open.) The expansion fan controls the open field line region in the tail, and the intersection of the fan with the tail current sheet is, by design, the x line. The new interconnection field allows greater control of the tail field structure; in particular, it enables us to eliminate the nightside mapping singularity that occurs in previous models when the interplanetary magnetic field is nonsouthward. Also, in contrast to earlier models, the far tail x line extends farther downstream on the flanks than in the center of the tail, consistent with observations.

A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects

DTIC Science & Technology

2014-05-19

their acceptable thermal stability, Polyimides have established as a conventional substrate material for flexible interconnects, which can be...of the silver flake ink for the screen-printed interconnects, the assembled unit fulfills biocompatibility requirements in a limited manner ([29...30]). Even though biocompatibility of substrate [31] is fulfilled, toxicity of the insulating mask [32] and encapsulation need to be considered

Type practical application in spectral analysis, combining Labview and open source software

NASA Astrophysics Data System (ADS)

Chioncel, C. P.; Anghel Drugarin, C. V.

2018-01-01

The paper presents the interconnection possibility of LabVIEW with his different opportunities and Scilab, one of the successful free MatLAB clones. The interconnection between those was made possible through the LabVIEW to Scilab gateway. This tool can be applied in virtual as well as in real laboratories, representing a true assistance for self-learning, too.

Interconnected Porous Polymers with Tunable Pore Throat Size Prepared via Pickering High Internal Phase Emulsions.

PubMed

Xu, Hongyun; Zheng, Xianhua; Huang, Yifei; Wang, Haitao; Du, Qiangguo

2016-01-12

Interconnected macroporous polymers were prepared by copolymerizing methyl acrylate (MA) via Pickering high internal phase emulsion (HIPE) templates with modified silica particles. The pore structure of the obtained polymer foams was observed by field-emission scanning electron microscopy (FE-SEM). Gas permeability was characterized to evaluate the interconnectivity of macroporous polymers. The polymerization shrinkage of continuous phase tends to form open pores while the solid particles surrounding the droplets act as barriers to produce closed pores. These two conflicting factors are crucial in determining the interconnectivity of macroporous polymers. Thus, poly-Pickering HIPEs with high permeability and well-defined pore structure can be achieved by tuning the MA content, the internal phase fraction, and the content of modified silica particles.

Object Management Group object transaction service based on an X/Open and International Organization for Standardization open systems interconnection transaction processing kernel

NASA Astrophysics Data System (ADS)

Liang, J.; Sédillot, S.; Traverson, B.

1997-09-01

This paper addresses federation of a transactional object standard - Object Management Group (OMG) object transaction service (OTS) - with the X/Open distributed transaction processing (DTP) model and International Organization for Standardization (ISO) open systems interconnection (OSI) transaction processing (TP) communication protocol. The two-phase commit propagation rules within a distributed transaction tree are similar in the X/Open, ISO and OMG models. Building an OTS on an OSI TP protocol machine is possible because the two specifications are somewhat complementary. OTS defines a set of external interfaces without specific internal protocol machine, while OSI TP specifies an internal protocol machine without any application programming interface. Given these observations, and having already implemented an X/Open two-phase commit transaction toolkit based on an OSI TP protocol machine, we analyse the feasibility of using this implementation as a transaction service provider for OMG interfaces. Based on the favourable result of this feasibility study, we are implementing an OTS compliant system, which, by initiating the extensibility and openness strengths of OSI TP, is able to provide interoperability between X/Open DTP and OMG OTS models.

Challenges in the implementation of dense wavelength division multiplexed (DWDM) optical interconnects using resonant silicon photonics (invited)

DOE PAGES

Lentine, Anthony L.; DeRose, Christopher T.

2016-02-12

In this study, small silicon photonics micro-resonator modulators and filters hold the promise for multi-terabit per-second interconnects at energy consumptions well below 1 pJ/bit. To date, no products exist and little known commercial development is occurring using this technology. Why? In this talk, we review the many challenges that remain to be overcome in bringing this technology from the research labs to the field where they can overcome important commercial, industrial, and national security limitations of existing photonic technologies.

Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors

NASA Astrophysics Data System (ADS)

Riggs, William R.

1994-05-01

SHARP is a Navy wide logistics technology development effort aimed at reducing the acquisition costs, support costs, and risks of military electronic weapon systems while increasing the performance capability, reliability, maintainability, and readiness of these systems. Lower life cycle costs for electronic hardware are achieved through technology transition, standardization, and reliability enhancement to improve system affordability and availability as well as enhancing fleet modernization. Advanced technology is transferred into the fleet through hardware specifications for weapon system building blocks of standard electronic modules, standard power systems, and standard electronic systems. The product lines are all defined with respect to their size, weight, I/O, environmental performance, and operational performance. This method of defining the standard is very conducive to inserting new technologies into systems using the standard hardware. This is the approach taken thus far in inserting photonic technologies into SHARP hardware. All of the efforts have been related to module packaging; i.e. interconnects, component packaging, and module developments. Fiber optic interconnects are discussed in this paper.

Analysis of the influencing factors of global energy interconnection development

NASA Astrophysics Data System (ADS)

Zhang, Yi; He, Yongxiu; Ge, Sifan; Liu, Lin

2018-04-01

Under the background of building global energy interconnection and achieving green and low-carbon development, this paper grasps a new round of energy restructuring and the trend of energy technology change, based on the present situation of global and China's global energy interconnection development, established the index system of the impact of global energy interconnection development factors. A subjective and objective weight analysis of the factors affecting the development of the global energy interconnection was conducted separately by network level analysis and entropy method, and the weights are summed up by the method of additive integration, which gives the comprehensive weight of the influencing factors and the ranking of their influence.

Stretchable multilayer self-aligned interconnects fabricated using excimer laser photoablation and in situ masking

NASA Astrophysics Data System (ADS)

Lin, Kevin L.; Jain, Kanti

2009-02-01

Stretchable interconnects are essential to large-area flexible circuits and large-area sensor array systems, and they play an important role towards the realization of the realm of systems which include wearable electronics, sensor arrays for structural health monitoring, and sensor skins for tactile feedback. These interconnects must be reliable and robust for viability, and must be flexible, stretchable, and conformable to non-planar surfaces. This research describes the design, modeling, fabrication, and testing of stretchable interconnects on polymer substrates using metal patterns both as functional interconnect layers and as in-situ masks for excimer laser photoablation. Excimer laser photoablation is often used for patterning of polymers and thin-film metals. The fluences for photoablation of polymers are generally much lower than the threshold fluence for removal or damage of high-thermallyconductive metals; thus, metal thin films can be used as in-situ masks for polymers if the proper fluence is used. Selfaligned single-layer and multi-layer interconnects of various designs (rectilinear and 'meandering') have been fabricated, and certain 'meandering' interconnect designs can be stretched up to 50% uniaxially while maintaining good electrical conductivity and structural integrity. These results are compared with Finite Element Analysis (FEA) models and are observed to be in good accordance with them. This fabrication approach eliminates masks and microfabrication processing steps as compared to traditional fabrication approaches; furthermore, this technology is scalable for large-area sensor arrays and electronic circuits, adaptable for a variety of materials and interconnects designs, and compatible with MEMS-based capacitive sensor technology.

Globalization and advances in information and communication technologies: the impact on nursing and health.

PubMed

Abbott, Patricia A; Coenen, Amy

2008-01-01

Globalization and information and communication technology (ICT) continue to change us and the world we live in. Nursing stands at an opportunity intersection where challenging global health issues, an international workforce shortage, and massive growth of ICT combine to create a very unique space for nursing leadership and nursing intervention. Learning from prior successes in the field can assist nurse leaders in planning and advancing strategies for global health using ICT. Attention to lessons learned will assist in combating the technological apartheid that is already present in many areas of the globe and will highlight opportunities for innovative applications in health. ICT has opened new channels of communication, creating the beginnings of a global information society that will facilitate access to isolated areas where health needs are extreme and where nursing can contribute significantly to the achievement of "Health for All." The purpose of this article is to discuss the relationships between globalization, health, and ICT, and to illuminate opportunities for nursing in this flattening and increasingly interconnected world.

NASA 2009 Body of Knowledge (BoK) Through-Slicon Via Technology

NASA Technical Reports Server (NTRS)

Gerke, David

2009-01-01

Through-silicon via (TSV) is the latest in a progression of technologies for stacking silicon devices in three dimensions (3D). Driven by the need for improved performance, methods to use short vertical interconnects to replace the long interconnects found in 2D structures have been developed. The industry is moving past the feasibility (research and development [R and D]) phase for TSV technology into the commercialization phase where economic realities will determine which technologies are adopted. Low-cost fine via hole formation and highly reliable via filling technologies have been demonstrated; process equipment and materials are available. Even though design, thermal, and test issues remain, much progress has been made.

Sense and nonsense of logic-level optical interconnect: reflections on an experiment

NASA Astrophysics Data System (ADS)

Van Campenhout, Jan M.; Brunfaut, Marnik; Meeus, Wim; Dambre, Joni; De Wilde, Michiel

2001-12-01

Centimeter-range high-density optical interconnect between chips is coming into reach with current optical interconnect technology. Many theoretical studies have identified several good reasons why to use such types of interconnect as a replacement of various layers of the traditional electronic interconnect hierarchy. However, the true feasibility and usefulness of optical interconnects can only be established by actually building and evaluating them in a real system setting. This contribution reports on our experience in using short-range high-density optical inter-chip interconnects. It is based on the design and construction of a fully functional optoelectronic demonstrator system. We discuss the rationale for building the demonstrator in the first place, the implications of using many low-level optical interconnections in electronic systems, and the degree to which our expectations have been fulfilled by the demonstrator. The detailed description of the architecture, design and implementation of the demonstrator is not presented here, but can be found elsewhere in this issue.

The potential of space exploration for education

NASA Technical Reports Server (NTRS)

Shair, Fredrick H.

1993-01-01

Space exploration and observations from space offer unique opportunities with respect to education. Recent technical advances have significantly increased the width and sensitivity of the electromagnetic spectrum window through which we are able to 'see' the universe. Observations from space have forced a realization that the earth is a beautiful, complex, and interconnected system. Space astronomy and the remote sensing of objects throughout our solar system have the potential of providing unique educational opportunities. Modern technologies have significantly reduced the cost of collecting, transmitting and processing data. Consequently, we are entering an age where it is possible to open up the process of discovery to almost everyone - and especially to young people throughout the world.

A Health Collaborative Network Focus on Self-care Processes in Personal Assistant Practice

NASA Astrophysics Data System (ADS)

de La Fuente, Ma Victoria; Ros, Lorenzo

Public health is oriented to the management of an adequate health atmosphere which acts directly on health, as well as health education work and the supervision of environmental health threats. The work presented in this paper aims to reduce inequality, and give disabled people the tools to be integrated more effectively, reducing social exclusion, removing obstacles and barriers, and facilitating mobility and the use of technology. The work is planned to design a special healthcare collaborative network as the best solution for addressing the needs of the disabled self-care and health care community through the creation and implementation of an interconnected, electronic information infrastructure and adoption of open data standards.

Oxidation Resistant, Cr Retaining, Electrically Conductive Coatings on Metallic Alloys for SOFC Interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vladimir Gorokhovsky

2008-03-31

This report describes significant results from an on-going, collaborative effort to enable the use of inexpensive metallic alloys as interconnects in planar solid oxide fuel cells (SOFCs) through the use of advanced coating technologies. Arcomac Surface Engineering, LLC, under the leadership of Dr. Vladimir Gorokhovsky, is investigating filtered-arc and filtered-arc plasma-assisted hybrid coating deposition technologies to promote oxidation resistance, eliminate Cr volatility, and stabilize the electrical conductivity of both standard and specialty steel alloys of interest for SOFC metallic interconnect (IC) applications. Arcomac has successfully developed technologies and processes to deposit coatings with excellent adhesion, which have demonstrated a substantialmore » increase in high temperature oxidation resistance, stabilization of low Area Specific Resistance values and significantly decrease Cr volatility. An extensive matrix of deposition processes, coating compositions and architectures was evaluated. Technical performance of coated and uncoated sample coupons during exposures to SOFC interconnect-relevant conditions is discussed, and promising future directions are considered. Cost analyses have been prepared based on assessment of plasma processing parameters, which demonstrate the feasibility of the proposed surface engineering process for SOFC metallic IC applications.« less

Feasibility of optically interconnected parallel processors using wavelength division multiplexing

DOE Office of Scientific and Technical Information (OSTI.GOV)

Deri, R.J.; De Groot, A.J.; Haigh, R.E.

1996-03-01

New national security demands require enhanced computing systems for nearly ab initio simulations of extremely complex systems and analyzing unprecedented quantities of remote sensing data. This computational performance is being sought using parallel processing systems, in which many less powerful processors are ganged together to achieve high aggregate performance. Such systems require increased capability to communicate information between individual processor and memory elements. As it is likely that the limited performance of today`s electronic interconnects will prevent the system from achieving its ultimate performance, there is great interest in using fiber optic technology to improve interconnect communication. However, little informationmore » is available to quantify the requirements on fiber optical hardware technology for this application. Furthermore, we have sought to explore interconnect architectures that use the complete communication richness of the optical domain rather than using optics as a simple replacement for electronic interconnects. These considerations have led us to study the performance of a moderate size parallel processor with optical interconnects using multiple optical wavelengths. We quantify the bandwidth, latency, and concurrency requirements which allow a bus-type interconnect to achieve scalable computing performance using up to 256 nodes, each operating at GFLOP performance. Our key conclusion is that scalable performance, to {approx}150 GFLOPS, is achievable for several scientific codes using an optical bus with a small number of WDM channels (8 to 32), only one WDM channel received per node, and achievable optoelectronic bandwidth and latency requirements. 21 refs. , 10 figs.« less

Helium Ion Secondary Electron Mode Microscopy For Interconnect Material Imaging

NASA Astrophysics Data System (ADS)

Ogawa, Shinichi; Thompson, William; Stern, Lewis; Scipioni, Larry; Notte, John; Farkas, Lou; Barriss, Louise

2010-04-01

The recently developed helium ion microscope (HIM) is now capable of 0.35 nm secondary electron (SE) mode image resolution. When low-k dielectrics or copper interconnects in ultra large scale integrated circuits (ULSI) interconnect structures were imaged in this mode, it was found that unique pattern dimension and fidelity information at sub-nanometer resolution was available for the first time. This paper will discuss the helium ion microscope architecture and the SE imaging techniques that make the HIM observation method of particular value to the low-k dielectric and dual damascene copper interconnect technologies.

Surface-tension driven open microfluidic platform for hanging droplet culture

PubMed Central

de Groot, T. E.; Veserat, K. S.; Berthier, E.; Beebe, D. J.; Theberge, A. B.

2015-01-01

The hanging droplet technique for three-dimensional tissue culture has been used for decades in biology labs, with the core technology remaining relatively unchanged. Recently microscale approaches have expanded the capabilities of the hanging droplet method, making it more user-friendly. We present a spontaneously driven, open hanging droplet culture platform to address many limitations of current platforms. Our platform makes use of two interconnected hanging droplet wells, a larger well where cells are cultured and a smaller well for user interface via a pipette. The two-well system results in lower shear stress in the culture well during fluid exchange, enabling shear sensitive or non-adherent cells to be cultured in a droplet. The ability to perform fluid exchanges in-droplet enables long-term culture, treatment, and characterization without disruption of the culture. The open well format of the platform was utilized to perform time-dependent coculture, enabling culture configurations with bone tissue scaffolds and cells grown in suspension. The open nature of the system allowed the direct addition or removal of tissue over the course of an experiment, manipulations that would be impractical in other microfluidic or hanging droplet culture platforms. PMID:26660268

Next-generation optical wireless communications for data centers

NASA Astrophysics Data System (ADS)

Arnon, Shlomi

2015-01-01

Data centers collect and process information with a capacity that has been increasing from year to year at an almost exponential pace. Traditional fiber/cable data center network interconnections suffer from bandwidth overload, as well as flexibility and scalability issues. Therefore, a technology-shift from the fiber and cable to wireless has already been initiated in order to meet the required data-rate, flexibility and scalability demands for next-generation data center network interconnects. In addition, the shift to wireless reduces the volume allocated to the cabling/fiber and increases the cooling efficiency. Optical wireless communication (OWC), or free space optics (FSO), is one of the most effective wireless technologies that could be used in future data centers and could provide ultra-high capacity, very high cyber security and minimum latency, due to the low index of refraction of air in comparison to fiber technologies. In this paper we review the main concepts and configurations for next generation OWC for data centers. Two families of technologies are reviewed: the first technology regards interconnects between rack units in the same rack and the second technology regards the data center network that connects the server top of rack (TOR) to the switch. A comparison between different network technologies is presented.

The Highly Robust Electrical Interconnects and Ultrasensitive Biosensors Based on Embedded Carbon Nanotube Arrays

NASA Technical Reports Server (NTRS)

Li, Jun; Cassell, Alan; Koehne, Jessica; Chen, Hua; Ng, Hou Tee; Ye, Qi; Stevens, Ramsey; Han, Jie; Meyyappan, M.

2003-01-01

We report on our recent breakthroughs in two different applications using well-aligned carbon nanotube (CNT) arrays on Si chips, including (1) a novel processing solution for highly robust electrical interconnects in integrated circuit manufacturing, and (2) the development of ultrasensitive electrochemical DNA sensors. Both of them rely on the invention of a bottom-up fabrication scheme which includes six steps, including: (a) lithographic patterning, (b) depositing bottom conducting contacts, (c) depositing metal catalysts, (d) CNT growth by plasma enhanced chemical vapor deposition (PECVD), (e) dielectric gap-filling, and (f) chemical mechanical polishing (CMP). Such processes produce a stable planarized surface with only the open end of CNTs exposed, whch can be further processed or modified for different applications. By depositing patterned top contacts, the CNT can serve as vertical interconnects between the two conducting layers. This method is fundamentally different fiom current damascene processes and avoids problems associated with etching and filling of high aspect ratio holes at nanoscales. In addition, multiwalled CNTs (MWCNTs) are highly robust and can carry a current density of 10(exp 9) A/square centimeters without degradation. It has great potential to help extending the current Si technology. The embedded MWCNT array without the top contact layer can be also used as a nanoelectrode array in electrochemical biosensors. The cell time-constant and sensitivity can be dramatically improved. By functionalizing the tube ends with specific oligonucleotide probes, specific DNA targets can be detected with electrochemical methods down to subattomoles.

High-speed and low-power repeater for VLSI interconnects

NASA Astrophysics Data System (ADS)

Karthikeyan, A.; Mallick, P. S.

2017-10-01

This paper proposes a repeater for boosting the speed of interconnects with low power dissipation. We have designed and implemented at 45 and 32 nm technology nodes. Delay and power dissipation performances are analyzed for various voltage levels at these technology nodes using Spice simulations. A significant reduction in delay and power dissipation are observed compared to a conventional repeater. The results show that the proposed high-speed low-power repeater has a reduced delay for higher load capacitance. The proposed repeater is also compared with LPTG CMOS repeater, and the results shows that the proposed repeater has reduced delay. The proposed repeater can be suitable for high-speed global interconnects and has the capacity to drive large loads.

Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices

PubMed Central

Sutanto, Jemmy; Anand, Sindhu; Patel, Chetan; Muthuswamy, Jit

2013-01-01

Flip-chip packaging is desirable for microelectro-mechanical systems (MEMS) devices because it reduces the overall package size and allows scaling up the number of MEMS chips through 3-D stacks. In this report, we demonstrate three novel techniques to create first-level interconnect (FLI) on MEMS: 1) Dip and attach technology for Ag epoxy; 2) Dispense technology for solder paste; 3) Dispense, pull, and attach technology (DPAT) for solder paste. The above techniques required no additional microfabrication steps, produced no visible surface contamination on the MEMS active structures, and generated high-aspect-ratio interconnects. The developed FLIs were successfully tested on MEMS moveable microelectrodes microfabricated by SUMMiTVTM process producing no apparent detrimental effect due to outgassing. The bumping processes were successfully applied on Al-deposited bond pads of 100 μm × 100 μm with an average bump height of 101.3 μm for Ag and 184.8 μm for solder (63Sn, 37Pb). DPAT for solder paste produced bumps with the aspect ratio of 1.8 or more. The average shear strengths of Ag and solder bumps were 78 MPa and 689 kPa, respectively. The electrical test on Ag bumps at 794 A/cm2 demonstrated reliable electrical interconnects with negligible resistance. These scalable FLI technologies are potentially useful for MEMS flip-chip packaging and 3-D stacking. PMID:24504168

Computing in Hydraulic Engineering Education

NASA Astrophysics Data System (ADS)

Duan, J. G.

2011-12-01

Civil engineers, pioneers of our civilization, are rarely perceived as leaders and innovators in modern society because of retardations in technology innovation. This crisis has resulted in the decline of the prestige of civil engineering profession, reduction of federal funding on deteriorating infrastructures, and problems with attracting the most talented high-school students. Infusion of cutting-edge computer technology and stimulating creativity and innovation therefore are the critical challenge to civil engineering education. To better prepare our graduates to innovate, this paper discussed the adaption of problem-based collaborative learning technique and integration of civil engineering computing into a traditional civil engineering curriculum. Three interconnected courses: Open Channel Flow, Computational Hydraulics, and Sedimentation Engineering, were developed with emphasis on computational simulations. In Open Channel flow, the focuses are principles of free surface flow and the application of computational models. This prepares students to the 2nd course, Computational Hydraulics, that introduce the fundamental principles of computational hydraulics, including finite difference and finite element methods. This course complements the Open Channel Flow class to provide students with in-depth understandings of computational methods. The 3rd course, Sedimentation Engineering, covers the fundamentals of sediment transport and river engineering, so students can apply the knowledge and programming skills gained from previous courses to develop computational models for simulating sediment transport. These courses effectively equipped students with important skills and knowledge to complete thesis and dissertation research.

Optical interconnection networks for high-performance computing systems

NASA Astrophysics Data System (ADS)

Biberman, Aleksandr; Bergman, Keren

2012-04-01

Enabled by silicon photonic technology, optical interconnection networks have the potential to be a key disruptive technology in computing and communication industries. The enduring pursuit of performance gains in computing, combined with stringent power constraints, has fostered the ever-growing computational parallelism associated with chip multiprocessors, memory systems, high-performance computing systems and data centers. Sustaining these parallelism growths introduces unique challenges for on- and off-chip communications, shifting the focus toward novel and fundamentally different communication approaches. Chip-scale photonic interconnection networks, enabled by high-performance silicon photonic devices, offer unprecedented bandwidth scalability with reduced power consumption. We demonstrate that the silicon photonic platforms have already produced all the high-performance photonic devices required to realize these types of networks. Through extensive empirical characterization in much of our work, we demonstrate such feasibility of waveguides, modulators, switches and photodetectors. We also demonstrate systems that simultaneously combine many functionalities to achieve more complex building blocks. We propose novel silicon photonic devices, subsystems, network topologies and architectures to enable unprecedented performance of these photonic interconnection networks. Furthermore, the advantages of photonic interconnection networks extend far beyond the chip, offering advanced communication environments for memory systems, high-performance computing systems, and data centers.

WDM mid-board optics for chip-to-chip wavelength routing interconnects in the H2020 ICT-STREAMS

NASA Astrophysics Data System (ADS)

Kanellos, G. T.; Pleros, N.

2017-02-01

Multi-socket server boards have emerged to increase the processing power density on the board level and further flatten the data center networks beyond leaf-spine architectures. Scaling however the number of processors per board puts current electronic technologies into challenge, as it requires high bandwidth interconnects and high throughput switches with increased number of ports that are currently unavailable. On-board optical interconnection has proved the potential to efficiently satisfy the bandwidth needs, but their use has been limited to parallel links without performing any smart routing functionality. With CWDM optical interconnects already a commodity, cyclical wavelength routing proposed to fit the datacom for rack-to-rack and board-to-board communication now becomes a promising on-board routing platform. ICT-STREAMS is a European research project that aims to combine WDM parallel on-board transceivers with a cyclical AWGR, in order to create a new board-level, chip-to-chip interconnection paradigm that will leverage WDM parallel transmission to a powerful wavelength routing platform capable to interconnect multiple processors with unprecedented bandwidth and throughput capacity. Direct, any-to-any, on-board interconnection of multiple processors will significantly contribute to further flatten the data centers and facilitate east-west communication. In the present communication, we present ICT-STREAMS on-board wavelength routing architecture for multiple chip-to-chip interconnections and evaluate the overall system performance in terms of throughput and latency for several schemes and traffic profiles. We also review recent advances of the ICT-STREAMS platform key-enabling technologies that span from Si in-plane lasers and polymer based electro-optical circuit boards to silicon photonics transceivers and photonic-crystal amplifiers.

Methods for Trustworthy Design of On-Chip Bus Interconnect for General-Purpose Processors

DTIC Science & Technology

2012-03-01

Technology Andrew Huang, was able to test the security properties of HyperTransport bus protocol on an Xbox [20]. In his research, he was able to...TRUSTWORTHY DESIGN OF ON -CHIP BUS INTERCONNECT FOR GENERAL-PURPOSE PROCESSORS by Jay F. Elson March 2012 Thesis Advisor: Ted Huffmire Second...AND DATES COVERED Master’s Thesis 4. TITLE AND SUBTITLE Methods for Trustworthy Design of On -Chip Bus Interconnect for General-Purpose Processors 5

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain

PubMed Central

Jackson, Nathan; Muthuswamy, Jit

2009-01-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15–20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices. PMID:20160981

Pulse thermal energy transport/storage system

DOEpatents

Weislogel, Mark M.

1992-07-07

A pulse-thermal pump having a novel fluid flow wherein heat admitted to a closed system raises the pressure in a closed evaporator chamber while another interconnected evaporator chamber remains open. This creates a large pressure differential, and at a predetermined pressure the closed evaporator is opened and the opened evaporator is closed. This difference in pressure initiates fluid flow in the system.

Optical Interconnections for VLSI Computational Systems Using Computer-Generated Holography.

NASA Astrophysics Data System (ADS)

Feldman, Michael Robert

Optical interconnects for VLSI computational systems using computer generated holograms are evaluated in theory and experiment. It is shown that by replacing particular electronic connections with free-space optical communication paths, connection of devices on a single chip or wafer and between chips or modules can be improved. Optical and electrical interconnects are compared in terms of power dissipation, communication bandwidth, and connection density. Conditions are determined for which optical interconnects are advantageous. Based on this analysis, it is shown that by applying computer generated holographic optical interconnects to wafer scale fine grain parallel processing systems, dramatic increases in system performance can be expected. Some new interconnection networks, designed to take full advantage of optical interconnect technology, have been developed. Experimental Computer Generated Holograms (CGH's) have been designed, fabricated and subsequently tested in prototype optical interconnected computational systems. Several new CGH encoding methods have been developed to provide efficient high performance CGH's. One CGH was used to decrease the access time of a 1 kilobit CMOS RAM chip. Another was produced to implement the inter-processor communication paths in a shared memory SIMD parallel processor array.

High-Penetration Photovoltaic Planning Methodologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gao, David Wenzhong; Muljadi, Eduard; Tian, Tian

The main objective of this report is to provide an overview of select U.S. utility methodologies for performing high-penetration photovoltaic (HPPV) system planning and impact studies. This report covers the Federal Energy Regulatory Commission's orders related to photovoltaic (PV) power system interconnection, particularly the interconnection processes for the Large Generation Interconnection Procedures and Small Generation Interconnection Procedures. In addition, it includes U.S. state interconnection standards and procedures. The procedures used by these regulatory bodies consider the impacts of HPPV power plants on the networks. Technical interconnection requirements for HPPV voltage regulation include aspects of power monitoring, grounding, synchronization, connection tomore » the overall distribution system, back-feeds, disconnecting means, abnormal operating conditions, and power quality. This report provides a summary of mitigation strategies to minimize the impact of HPPV. Recommendations and revisions to the standards may take place as the penetration level of renewables on the grid increases and new technologies develop in future years.« less

Clad metals, roll bonding and their applications for SOFC interconnects

NASA Astrophysics Data System (ADS)

Chen, Lichun; Yang, Zhenguo; Jha, Bijendra; Xia, Guanguang; Stevenson, Jeffry W.

Metallic interconnects have been becoming an increasingly interesting topic in the development in intermediate temperature solid oxide fuel cells (SOFC). High temperature oxidation resistant alloys are currently considered as candidate materials. Among these alloys however, different groups of alloys demonstrate different advantages and disadvantages, and few if any can completely satisfy the stringent requirements for the application. To integrate the advantages and avoid the disadvantages of different groups of alloys, clad metal has been proposed for SOFC interconnect applications and interconnect structures. This paper gives a brief overview of the cladding approach and its applications, and discuss the viability of this technology to fabricate the metallic layered-structure interconnects. To examine the feasibility of this approach, the austenitic Ni-base alloy Haynes 230 and the ferritic stainless steel AL 453 were selected as examples and manufactured into a clad metal. Its suitability as an interconnect construction material was investigated.

Lightweight solar array blanket tooling, laser welding and cover process technology

NASA Technical Reports Server (NTRS)

Dillard, P. A.

1983-01-01

A two phase technology investigation was performed to demonstrate effective methods for integrating 50 micrometer thin solar cells into ultralightweight module designs. During the first phase, innovative tooling was developed which allows lightweight blankets to be fabricated in a manufacturing environment with acceptable yields. During the second phase, the tooling was improved and the feasibility of laser processing of lightweight arrays was confirmed. The development of the cell/interconnect registration tool and interconnect bonding by laser welding is described.

Silicon photonic IC embedded optical-PCB for high-speed interconnect application

NASA Astrophysics Data System (ADS)

Kallega, Rakshitha; Nambiar, Siddharth; Kumar, Abhai; Ranganath, Praveen; Selvaraja, Shankar Kumar

2018-02-01

Optical-Printed Circuit Board (PCB) is an emerging optical interconnect technology to bridge the gap between the board edge and the processing module. The technology so far has been used as a broadband transmitter using polymer waveguides in the PCB. In this paper, we report a Silicon Nitride based photonic IC embedded in the PCB along with the polymers as waveguides in the PCB. The motivation for such integration is to bring routing capability and to reduce the power loss due to broadcasting mode.

29 CFR 1615.103 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... COMMISSION AND IN ACCESSIBILITY OF COMMISSION ELECTRONIC AND INFORMATION TECHNOLOGY § 1615.103 Definitions.... Electronic and Information technology. Includes information technology and any equipment or interconnected... information. The term electronic and information technology includes, but is not limited to...

Conformable wearable systems comprising organic electronics on foil for well being and healthcare (presentation video)

NASA Astrophysics Data System (ADS)

de Kok, Margreet M.

2014-10-01

Integration of electronics into materials and objects that have not been functionalized with electronics before, open up extensive possibilities to support mankind. By adding intelligence and/or operating power to materials in close skin contact like clothing, furniture or bandages the health of people can be monitored or even improved. Foil based electronics are interesting components to be integrated as they are thin, large area and cost effective available components Our developed technology of printed electronic structures to which components are reliably bonded, fulfills the promise. We have integrated these components into textiles and built wearable encapsulated products with foil based electronics. Foil components with organic and inorganic LEDs are interconnected and laminated onto electronic textiles by using conductive adhesives to bond the contact pads of the component to conductive yarns in the textile. Modelling and reliability testing under dynamic circumstances provided important insights in order to optimise the technology. The design of the interconnection and choice of conductive adhesive / underfill and lamination contributed to the durability of the system. Transition zones from laminated foil to textile are engineered to withstand dynamic use. As an example of a product, we have realized an electronic wristband that is encapsulated in rubber and has a number of sensor functionalities integrated on stretchable electronic circuits based on Cu and Ag. The encapsulation with silicone or polyurethanes was performed such, that charging and sensor/skin contacts are possible while simultaneously protecting the electronics from mechanical and environmental stresses.

NASA STI Program Coordinating Council Twelfth Meeting: Standards

NASA Technical Reports Server (NTRS)

1994-01-01

The theme of this NASA Scientific and Technical Information Program Coordinating Council Meeting was standards and their formation and application. Topics covered included scientific and technical information architecture, the Open Systems Interconnection Transmission Control Protocol/Internet Protocol, Machine-Readable Cataloging (MARC) open system environment procurement, and the Government Information Locator Service.

Digital optical interconnects for photonic computing

NASA Astrophysics Data System (ADS)

Guilfoyle, Peter S.; Stone, Richard V.; Zeise, Frederick F.

1994-05-01

A 32-bit digital optical computer (DOC II) has been implemented in hardware utilizing 8,192 free-space optical interconnects. The architecture exploits parallel interconnect technology by implementing microcode at the primitive level. A burst mode of 0.8192 X 1012 binary operations per sec has been reliably demonstrated. The prototype has been successful in demonstrating general purpose computation. In addition to emulating the RISC instruction set within the UNIX operating environment, relational database text search operations have been implemented on DOC II.

NREL: U.S.-China Renewable Energy Partnership Publications

Science.gov Websites

storage or to solar photovoltaic (PV) technology, including higher energy value, ancillary services value Partnership (USCREP) activities. 2017 Comparative Analysis and Considerations for PV Interconnection Standards main objectives of this report are to evaluate China's photovoltaic (PV) interconnection standards and

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coddington, M.; Fox, K.; Stanfield, S.

Federal and state regulators are faced with the challenge of keeping interconnection procedures updated against a backdrop of evolving technology, new codes and standards, and considerably transformed market conditions. This report is intended to educate policymakers and stakeholders on beneficial reforms that will keep interconnection processes efficient and cost-effective while maintaining a safe and reliable power system.

Low-cost fabrication of optical waveguides, interconnects and sensing structures on all-polymer-based thin foils

NASA Astrophysics Data System (ADS)

Rezem, Maher; Kelb, Christian; Günther, Axel; Rahlves, Maik; Reithmeier, Eduard; Roth, Bernhard

2016-03-01

Micro-optical sensors based on optical waveguides are widely used to measure temperature, force and strain but also to detect biological and chemical substances such as explosives or toxins. While optical micro-sensors based on silicon technology require complex and expensive process technologies, a new generation of sensors based completely on polymers offer advantages especially in terms of low-cost and fast production techniques. We have developed a process to integrate micro-optical components such as embedded waveguides and optical interconnects into polymer foils with a thickness well below one millimeter. To enable high throughput production, we employ hot embossing technology, which is capable of reel-to-reel fabrication with a surface roughness in the optical range. For the waveguide fabrication, we used the thermoplastic polymethylmethacrylate (PMMA) as cladding and several optical adhesives as core materials. The waveguides are characterized with respect to refractive indices and propagation losses. We achieved propagation losses are as low as 0.3 dB/cm. Furthermore, we demonstrate coupling structures and their fabrication especially suited to integrate various light sources such as vertical-cavity surface-emitting lasers (VCSEL) and organic light emitting diodes (OLED) into thin polymer foils. Also, we present a concept of an all-polymer and waveguide based deformation sensor based on intensity modulation, which can be fabricated by utilizing our process. For future application, we aim at a low-cost and high-throughput reel-to-reel production process enabling the fabrication of large sensor arrays or disposable single-use sensing structures, which will open optical sensing to a large variety of application fields ranging from medical diagnosis to automotive sensing.

National Offshore Wind Energy Grid Interconnection Study

DOE Office of Scientific and Technical Information (OSTI.GOV)

Daniel, John P.; Liu, Shu; Ibanez, Eduardo

2014-07-30

The National Offshore Wind Energy Grid Interconnection Study (NOWEGIS) considers the availability and potential impacts of interconnecting large amounts of offshore wind energy into the transmission system of the lower 48 contiguous United States. A total of 54GW of offshore wind was assumed to be the target for the analyses conducted. A variety of issues are considered including: the anticipated staging of offshore wind; the offshore wind resource availability; offshore wind energy power production profiles; offshore wind variability; present and potential technologies for collection and delivery of offshore wind energy to the onshore grid; potential impacts to existing utility systemsmore » most likely to receive large amounts of offshore wind; and regulatory influences on offshore wind development. The technologies considered the reliability of various high-voltage ac (HVAC) and high-voltage dc (HVDC) technology options and configurations. The utility system impacts of GW-scale integration of offshore wind are considered from an operational steady-state perspective and from a regional and national production cost perspective.« less

A Vision of China-Arab Interconnection Transmission Network Planning with UHVDC Technology

NASA Astrophysics Data System (ADS)

Wu, Dan; Liu, Yujun; Yin, Hongyuan; Xu, Qingshan; Xu, Xiaohui; Ding, Maosheng

2017-05-01

Developments in ultra-high-voltage (UHV) power systems and clean energy technologies are paving the way towards unprecedented energy market globalization. In accordance with the international community’s enthusiasm for building up the Global Energy Internet, this paper focuses on the feasibility of transmitting large-size electricity from northwest China to Arab world through a long-distance transnational power interconnection. The complete investigations on the grids of both the sending-end and receiving-end is firstly presented. Then system configuration of the transmission scheme and corridor route planning is proposed with UHVDC technology. Based on transmission costs’ investigation about similar transmission projects worldwide, the costs of the proposed transmission scheme are estimated through adjustment factors which represent differences in latitude, topography and economy. The proposed China-Arab transmission line sheds light on the prospects of power cooperation and resource sharing between China and Arab states, and appeals for more emphasis on green energy concentrated power interconnections from a global perspective.

Novel Vertical Interconnects With 180 Degree Phase Shift for Amplifiers, Filters, and Integrated Antennas

NASA Technical Reports Server (NTRS)

Goverdhanam, Kavita; Simons, Rainee N.; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)

2001-01-01

In this paper, novel low loss, wide-band coplanar stripline technology for RF/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semiconductor devices and microelectromechanical systems (MEMS).

Monolithically mode division multiplexing photonic integrated circuit for large-capacity optical interconnection.

PubMed

Chen, Guanyu; Yu, Yu; Zhang, Xinliang

2016-08-01

We propose and fabricate an on-chip mode division multiplexed (MDM) photonic interconnection system. Such a monolithically photonic integrated circuit (PIC) is composed of a grating coupler, two micro-ring modulators, mode multiplexer/demultiplexer, and two germanium photodetectors. The signals' generation, multiplexing, transmission, demultiplexing, and detection are successfully demonstrated on the same chip. Twenty Gb/s MDM signals are successfully processed with clear and open eye diagrams, validating the feasibility of the proposed circuit. The measured power penalties show a good performance of the MDM link. The proposed on-chip MDM system can be potentially used for large-capacity optical interconnection in future high-performance computers and big data centers.

The Linked System Project : a network interconnection project between three major bibliographic utilities and LC

NASA Astrophysics Data System (ADS)

Kurihara, Shin'ichi

The Linked Systems Project (LSP) is the first network project based on the Open Systems Interconnection (OSI) in the world. The purpose of the project is to interconnect between three major bibliographic utilities and LC, and to perform as one system on the whole. The first application developed for the LSP is the sharing of name authority data based on the Name Authority Cooperative (NACO) Project. In 1985, LC began to send name authority records to RLG/RLIN. Since 1987, RLG/RLIN and OCLC send name authority records to LC. Bibliographic records will be sent mutually between three major bibliographic utilities and LC near future.

Integrating radiology information systems with healthcare delivery environments using DICOM and HL7 standards.

PubMed

Blazona, Bojan; Koncar, Miroslav

2006-01-01

Integration based on open standards, in order to achieve communication and information interoperability, is one of the key aspects of modern health care information systems. Interoperability presents data and communication layer interchange. In this context we identified the HL7 standard as the world's leading medical Information and communication technology (ICT) standard for the business layer in healthcare information systems and we tried to explore the ability to exchange clinical documents with minimal integrated healthcare information systems (IHCIS) change. We explored HL7 Clinical Document Architecture (CDA) abilities to achieve radiology information system integration (DICOM) to IHCIS (HL7). We introduced the use of WADO service interconnection to IHCIS and finally CDA rendering in widely used Internet explorers.

Process for 3D chip stacking

DOEpatents

Malba, V.

1998-11-10

A manufacturable process for fabricating electrical interconnects which extend from a top surface of an integrated circuit chip to a sidewall of the chip using laser pantography to pattern three dimensional interconnects. The electrical interconnects may be of an L-connect or L-shaped type. The process implements three dimensional (3D) stacking by moving the conventional bond or interface pads on a chip to the sidewall of the chip. Implementation of the process includes: (1) holding individual chips for batch processing, (2) depositing a dielectric passivation layer on the top and sidewalls of the chips, (3) opening vias in the dielectric, (4) forming the interconnects by laser pantography, and (5) removing the chips from the holding means. The process enables low cost manufacturing of chips with bond pads on the sidewalls, which enables stacking for increased performance, reduced space, and higher functional per unit volume. 3 figs.

Process for 3D chip stacking

DOEpatents

Malba, Vincent

1998-01-01

A manufacturable process for fabricating electrical interconnects which extend from a top surface of an integrated circuit chip to a sidewall of the chip using laser pantography to pattern three dimensional interconnects. The electrical interconnects may be of an L-connect or L-shaped type. The process implements three dimensional (3D) stacking by moving the conventional bond or interface pads on a chip to the sidewall of the chip. Implementation of the process includes: 1) holding individual chips for batch processing, 2) depositing a dielectric passivation layer on the top and sidewalls of the chips, 3) opening vias in the dielectric, 4) forming the interconnects by laser pantography, and 5) removing the chips from the holding means. The process enables low cost manufacturing of chips with bond pads on the sidewalls, which enables stacking for increased performance, reduced space, and higher functional per unit volume.

Flexible Chip Scale Package and Interconnect for Implantable MEMS Movable Microelectrodes for the Brain.

PubMed

Jackson, Nathan; Muthuswamy, Jit

2009-04-01

We report here a novel approach called MEMS microflex interconnect (MMFI) technology for packaging a new generation of Bio-MEMS devices that involve movable microelectrodes implanted in brain tissue. MMFI addresses the need for (i) operating space for movable parts and (ii) flexible interconnects for mechanical isolation. We fabricated a thin polyimide substrate with embedded bond-pads, vias, and conducting traces for the interconnect with a backside dry etch, so that the flexible substrate can act as a thin-film cap for the MEMS package. A double gold stud bump rivet bonding mechanism was used to form electrical connections to the chip and also to provide a spacing of approximately 15-20 µm for the movable parts. The MMFI approach achieved a chip scale package (CSP) that is lightweight, biocompatible, having flexible interconnects, without an underfill. Reliability tests demonstrated minimal increases of 0.35 mΩ, 0.23 mΩ and 0.15 mΩ in mean contact resistances under high humidity, thermal cycling, and thermal shock conditions respectively. High temperature tests resulted in an increase in resistance of > 90 mΩ when aluminum bond pads were used, but an increase of ~ 4.2 mΩ with gold bond pads. The mean-time-to-failure (MTTF) was estimated to be at least one year under physiological conditions. We conclude that MMFI technology is a feasible and reliable approach for packaging and interconnecting Bio-MEMS devices.

Evaluation of aquifer interconnection from aquifer characteristics computed by using specific capacity data within the vicinity of the Tremont Barrel Fill site, Clark County, Ohio

USGS Publications Warehouse

Gahala, Amy M.

2015-01-01

The results of the hydraulic analysis from 127 wells open to either the sand and gravel or the limestone aquifer indicate that the transmissivity of these aquifers is within one order of magnitude and horizontal hydraulic conductivity is within two orders of magnitude. As such, on the basis of the applied ranking system the two aquifers can be considered hydraulically interconnected.

Clad metals by roll bonding for SOFC interconnects

NASA Astrophysics Data System (ADS)

Chen, L.; Jha, B.; Yang, Zhenguo; Xia, Guang-Guang; Stevenson, Jeffry W.; Singh, Prabhakar

2006-08-01

High-temperature oxidation-resistant alloys are currently considered as a candidate material for construction of interconnects in intermediate-temperature solid oxide fuel cells. Among these alloys, however, different groups of alloys demonstrate different advantages and disadvantages, and few, if any, can completely satisfy the stringent requirements for the application. To integrate the advantages and avoid the disadvantages of different groups of alloys, cladding has been proposed as one approach in fabricating metallic layered interconnect structures. To examine the feasibility of this approach, the austenitic Ni-base alloy Haynes 230 and the ferritic stainless steel AL 453 were selected as examples and manufactured into a clad metal. Its suitability as an interconnect construction material was investigated. This paper provides a brief overview of the cladding approach and discusses the viability of this technology to fabricate the metallic layered-structure interconnects.

Lightwave technology in microwave systems

NASA Astrophysics Data System (ADS)

Popa, A. E.; Gee, C. M.; Yen, H. W.

1986-01-01

Many advanced microwave system concepts such as active aperture phased array antennas use distributed topologies in which lightwave circuits are being proposed to interconnect both the analog and digital modules of the system. Lightwave components designed to implement these interconnects are reviewed and their performance analyzed. The impact of trends in component development are discussed.

Home page | prc.gatech.edu | Georgia Institute of Technology | Atlanta, GA

Science.gov Websites

Interconnections & Assembly Low Cost Glass Interposers & Packages MEMS and Sensors GRA Opportunities addressing electrical, mechanical and thermal barriers. Low-cost Glass Interposer and Package Panel-based ultra-thin glass as a high performance, high I/O density, and low cost platform. Interconnections and

Project demonstration of wind-turbine electricity: Interconnecting a northern Michigan fruit farm with a major utility

NASA Astrophysics Data System (ADS)

Amon, D. M.

Progress is reviewed in a project to test the economic feasibility of wind turbine technology for generating electricity. The use of wind generating electricity on a commercial fruit farm interconnecting a commercial fruit farm with a major utility to sell power are the find project goals.

75 FR 67321 - Wireless E911 Location Accuracy Requirements; E911 Requirements for IP-Enabled Service Providers

Federal Register 2010, 2011, 2012, 2013, 2014

2010-11-02

...'s CMRS E911 location requirements without ensuring that time is taken to study location technologies... accuracy requirements on interconnected VoIP service without further study.'' A number of commenters... study the technical, operational and economic issues related to the provision of ALI for interconnected...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2014 CFR

2014-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2012 CFR

2012-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2013 CFR

2013-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

77 FR 52766 - Technology and Trading Roundtable

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-30

... SECURITIES AND EXCHANGE COMMISSION [Release No. 34-67725; File No. 4-652] Technology and Trading... ``Technology and Trading: Promoting Stability in Today's Markets'' to discuss ways to promote stability in..., implement, and manage complex and inter-connected trading technologies. The roundtable discussion will be...

Fabrication of a novel gigabit/second free-space optical interconnect - photodetector characterization and testing and system development

NASA Technical Reports Server (NTRS)

Savich, Gregory R.

2004-01-01

The time when computing power is limited by the copper wire inherent in the computer system and not the speed of the microprocessor is rapidly approaching. With constant advances in computer technology, many researchers believe that in only a few years, optical interconnects will begin to replace copper wires in your Central Processing Unit (CPU). On a more macroscopic scale, the telecommunications industry has already made the switch to optical data transmission as, to date, fiber optic technology is the only reasonable method of reliable, long range data transmission. Within the span of a decade, we will see optical technologies move from the macroscopic world of the telecommunications industry to the microscopic world of the computer chip. Already, the communications industry is marketing commercially available optical links to connect two personal computers, thereby eliminating the need for standard and comparatively slow wired and wireless Ethernet transfers and greatly increasing the distance the computers can be separated. As processing demands continue to increase, the realm of optical communications will continue to move closer to the microprocessor and quite possibly onto the microprocessor itself. A day may come when copper connections are used only to supply power, not transfer data. This summer s work marks some of the beginning stages of a 5 to 10 year, long-term research project to create and study a free-space, 1 Gigabit/sec optical interconnect. The research will result in a novel fabricated, chip-to-chip interconnect consisting of a Vertical Cavity Surface Emitting Laser (VCSEL) Diode linked through free space to a Metal- Semiconductor-Metal (MSM) Photodetector with the possible integration of microlenses for signal focusing and Micro-Electromechanical Systems (MEMS) devices for optical signal steering. The advantages, disadvantages, and practicality of incorporating flip-chip mounting technologies will also be addressed. My work began with the design and construction of a test setup for the experiment and then appropriate characterization of the test system. Specifically, I am involved in the characterization of a commercially available 1550nm wavelength, 5mW diode laser and a study of its modulation bandwidth. Commercially produced photodetectors as well as the incorporation of microwave technology, in the form of RF input and output, are used in the characterization procedure. The next stage involves the use of a probe station and network analyzer to characterize and test a series of photodetectors fabricated on a 2 inch, Indium Gallium Arsenide (InGaAs) wafer in the Branch s microlithography lab. Other project responsibilities include, but are not limited to the incorporation of a transimpedance amplifier to the photodetector circuit; a study of VCSEL technology; bit error rate analysis of an optical interconnect system; and analysis of free space divergence of the VCSEL, optical path length of the interconnect; and any other pertinent optical properties of the one gigabit per second interconnect for fabrication and testing.

How Clusters Work

EPA Pesticide Factsheets

Technology innovation clusters are geographic concentrations of interconnected companies, universities, and other organizations with a focus on environmental technology. They play a key role in addressing the nation’s pressing environmental problems.

Origin of high photoconductive gain in fully transparent heterojunction nanocrystalline oxide image sensors and interconnects.

PubMed

Jeon, Sanghun; Song, Ihun; Lee, Sungsik; Ryu, Byungki; Ahn, Seung-Eon; Lee, Eunha; Kim, Young; Nathan, Arokia; Robertson, John; Chung, U-In

2014-11-05

A technique for invisible image capture using a photosensor array based on transparent conducting oxide semiconductor thin-film transistors and transparent interconnection technologies is presented. A transparent conducting layer is employed for the sensor electrodes as well as interconnection in the array, providing about 80% transmittance at visible-light wavelengths. The phototransistor is a Hf-In-Zn-O/In-Zn-O heterostructure yielding a high quantum-efficiency in the visible range. © 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

A Survey on M2M Systems for mHealth: A Wireless Communications Perspective

PubMed Central

Kartsakli, Elli; Lalos, Aris S.; Antonopoulos, Angelos; Tennina, Stefano; Di Renzo, Marco; Alonso, Luis; Verikoukis, Christos

2014-01-01

In the new era of connectivity, marked by the explosive number of wireless electronic devices and the need for smart and pervasive applications, Machine-to-Machine (M2M) communications are an emerging technology that enables the seamless device interconnection without the need of human interaction. The use of M2M technology can bring to life a wide range of mHealth applications, with considerable benefits for both patients and healthcare providers. Many technological challenges have to be met, however, to ensure the widespread adoption of mHealth solutions in the future. In this context, we aim to provide a comprehensive survey on M2M systems for mHealth applications from a wireless communication perspective. An end-to-end holistic approach is adopted, focusing on different communication aspects of the M2M architecture. Hence, we first provide a systematic review of Wireless Body Area Networks (WBANs), which constitute the enabling technology at the patient's side, and then discuss end-to-end solutions that involve the design and implementation of practical mHealth applications. We close the survey by identifying challenges and open research issues, thus paving the way for future research opportunities. PMID:25264958

Single-mode glass waveguide technology for optical interchip communication on board level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

Reactome graph database: Efficient access to complex pathway data

PubMed Central

Korninger, Florian; Viteri, Guilherme; Marin-Garcia, Pablo; Ping, Peipei; Wu, Guanming; Stein, Lincoln; D’Eustachio, Peter

2018-01-01

Reactome is a free, open-source, open-data, curated and peer-reviewed knowledgebase of biomolecular pathways. One of its main priorities is to provide easy and efficient access to its high quality curated data. At present, biological pathway databases typically store their contents in relational databases. This limits access efficiency because there are performance issues associated with queries traversing highly interconnected data. The same data in a graph database can be queried more efficiently. Here we present the rationale behind the adoption of a graph database (Neo4j) as well as the new ContentService (REST API) that provides access to these data. The Neo4j graph database and its query language, Cypher, provide efficient access to the complex Reactome data model, facilitating easy traversal and knowledge discovery. The adoption of this technology greatly improved query efficiency, reducing the average query time by 93%. The web service built on top of the graph database provides programmatic access to Reactome data by object oriented queries, but also supports more complex queries that take advantage of the new underlying graph-based data storage. By adopting graph database technology we are providing a high performance pathway data resource to the community. The Reactome graph database use case shows the power of NoSQL database engines for complex biological data types. PMID:29377902

Reactome graph database: Efficient access to complex pathway data.

PubMed

Fabregat, Antonio; Korninger, Florian; Viteri, Guilherme; Sidiropoulos, Konstantinos; Marin-Garcia, Pablo; Ping, Peipei; Wu, Guanming; Stein, Lincoln; D'Eustachio, Peter; Hermjakob, Henning

2018-01-01

Reactome is a free, open-source, open-data, curated and peer-reviewed knowledgebase of biomolecular pathways. One of its main priorities is to provide easy and efficient access to its high quality curated data. At present, biological pathway databases typically store their contents in relational databases. This limits access efficiency because there are performance issues associated with queries traversing highly interconnected data. The same data in a graph database can be queried more efficiently. Here we present the rationale behind the adoption of a graph database (Neo4j) as well as the new ContentService (REST API) that provides access to these data. The Neo4j graph database and its query language, Cypher, provide efficient access to the complex Reactome data model, facilitating easy traversal and knowledge discovery. The adoption of this technology greatly improved query efficiency, reducing the average query time by 93%. The web service built on top of the graph database provides programmatic access to Reactome data by object oriented queries, but also supports more complex queries that take advantage of the new underlying graph-based data storage. By adopting graph database technology we are providing a high performance pathway data resource to the community. The Reactome graph database use case shows the power of NoSQL database engines for complex biological data types.

Joint Services Electronics Program.

DTIC Science & Technology

1993-03-05

Mary- land, June 1992. Interconnection Network Design Based on Packaging Considerations Professor Abhiram Ranade with M. T. Raghunath A central...characterized by our abstract models of packaging technology. JSEP Publications [1] M.T. Raghunath and Abhiram Ranade, "Customizing Interconnection...94720, January 1993. [21 M.T. Raghunath and Abhiram Ranade, "Fault-Tolerant Routing in Partitioned Butterfly Networks," submitted to the 1993

Advanced Platform for Development and Evaluation of Grid Interconnection Systems Using Hardware-in-the-Loop: Part III -- Grid Interconnection System Evaluator: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lundstrom, B.; Shirazi, M.; Coddington, M.

2013-01-01

This paper, presented at the IEEE Green Technologies Conference 2013, describes a Grid Interconnection System Evaluator (GISE) that leverages hardware-in-the-loop (HIL) simulation techniques to rapidly evaluate the grid interconnection standard conformance of an ICS according to the procedures in IEEE Std 1547.1 (TM). The architecture and test sequencing of this evaluation tool, along with a set of representative ICS test results from three different photovoltaic (PV) inverters, are presented. The GISE adds to the National Renewable Energy Laboratory's (NREL) evaluation platform that now allows for rapid development of ICS control algorithms using controller HIL (CHIL) techniques, the ability to testmore » the dc input characteristics of PV-based ICSs through the use of a PV simulator capable of simulating real-world dynamics using power HIL (PHIL), and evaluation of ICS grid interconnection conformance.« less

Trust and Reputation Management for Critical Infrastructure Protection

NASA Astrophysics Data System (ADS)

Caldeira, Filipe; Monteiro, Edmundo; Simões, Paulo

Today's Critical Infrastructures (CI) depend of Information and Communication Technologies (ICT) to deliver their services with the required level of quality and availability. ICT security plays a major role in CI protection and risk prevention for single and also for interconnected CIs were cascading effects might occur because of the interdependencies that exist among different CIs. This paper addresses the problem of ICT security in interconnected CIs. Trust and reputation management using the Policy Based Management paradigm is the proposed solution to be applied at the CI interconnection points for information exchange. The proposed solution is being applied to the Security Mediation Gateway being developed in the European FP7 MICIE project, to allow for information exchange among interconnected CIs.

Reconfigurable microfluidic hanging drop network for multi-tissue interaction and analysis.

PubMed

Frey, Olivier; Misun, Patrick M; Fluri, David A; Hengstler, Jan G; Hierlemann, Andreas

2014-06-30

Integration of multiple three-dimensional microtissues into microfluidic networks enables new insights in how different organs or tissues of an organism interact. Here, we present a platform that extends the hanging-drop technology, used for multi-cellular spheroid formation, to multifunctional complex microfluidic networks. Engineered as completely open, 'hanging' microfluidic system at the bottom of a substrate, the platform features high flexibility in microtissue arrangements and interconnections, while fabrication is simple and operation robust. Multiple spheroids of different cell types are formed in parallel on the same platform; the different tissues are then connected in physiological order for multi-tissue experiments through reconfiguration of the fluidic network. Liquid flow is precisely controlled through the hanging drops, which enable nutrient supply, substance dosage and inter-organ metabolic communication. The possibility to perform parallelized microtissue formation on the same chip that is subsequently used for complex multi-tissue experiments renders the developed platform a promising technology for 'body-on-a-chip'-related research.

Packet Traffic Dynamics Near Onset of Congestion in Data Communication Network Model

NASA Astrophysics Data System (ADS)

Lawniczak, A. T.; Tang, X.

2006-05-01

The dominant technology of data communication networks is the Packet Switching Network (PSN). It is a complex technology organized as various hierarchical layers according to the International Standard Organization (ISO) Open Systems Interconnect (OSI) Reference Model. The Network Layer of the ISO OSI Reference Model is responsible for delivering packets from their sources to their destinations and for dealing with congestion if it arises in a network. Thus, we focus on this layer and present an abstraction of the Network Layer of the ISO OSI Reference Model. Using this abstraction we investigate how onset of traffic congestion is affected for various routing algorithms by changes in network connection topology. We study how aggregate measures of network performance depend on network connection topology and routing. We explore packets traffic spatio-temporal dynamics near the phase transition point from free flow to congestion for various network connection topologies and routing algorithms. We consider static and adaptive routings. We present selected simulation results.

On-board processing satellite network architecture and control study

NASA Technical Reports Server (NTRS)

Campanella, S. Joseph; Pontano, Benjamin A.; Chalmers, Harvey

1987-01-01

The market for telecommunications services needs to be segmented into user classes having similar transmission requirements and hence similar network architectures. Use of the following transmission architecture was considered: satellite switched TDMA; TDMA up, TDM down; scanning (hopping) beam TDMA; FDMA up, TDM down; satellite switched MF/TDMA; and switching Hub earth stations with double hop transmission. A candidate network architecture will be selected that: comprises multiple access subnetworks optimized for each user; interconnects the subnetworks by means of a baseband processor; and optimizes the marriage of interconnection and access techniques. An overall network control architecture will be provided that will serve the needs of the baseband and satellite switched RF interconnected subnetworks. The results of the studies shall be used to identify elements of network architecture and control that require the greatest degree of technology development to realize an operational system. This will be specified in terms of: requirements of the enabling technology; difference from the current available technology; and estimate of the development requirements needed to achieve an operational system. The results obtained for each of these tasks are presented.

Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards

NASA Astrophysics Data System (ADS)

Yee, Chang Fei; Jambek, Asral Bahari; Al-Hadi, Azremi Abdullah

2016-06-01

This paper provides a brief introduction to high-density interconnect (HDI) technology and its implementation on printed circuit boards (PCBs). The advantages and challenges of implementing 10-Gbps signal transmission on high-density interconnect boards are discussed in detail. The advantages (e.g., smaller via dimension and via stub removal) and challenges (e.g., crosstalk due to smaller interpair separation) of HDI are studied by analyzing the S-parameter, time-domain reflectometry (TDR), and transmission-line eye diagrams obtained by three-dimensional electromagnetic modeling (3DEM) and two-dimensional electromagnetic modeling (2DEM) using Mentor Graphics HyperLynx and Keysight Advanced Design System (ADS) electronic computer-aided design (ECAD) software. HDI outperforms conventional PCB technology in terms of signal integrity, but proper routing topology should be applied to overcome the challenge posed by crosstalk due to the tight spacing between traces.

SEMICONDUCTOR TECHNOLOGY Development of spin-on-glass process for triple metal interconnects

NASA Astrophysics Data System (ADS)

Li, Peng; Wenbin, Zhao; Guozhang, Wang; Zongguang, Yu

2010-12-01

Spin-on-glass (SOG), an interlayer dielectric material applied in liquid form to fill narrow gaps in the sub-dielectric surface and thus conducive to planarization, is an alternative to silicon dioxide (SiO2) deposited using PECVD processes. However, its inability to adhere to metal and problems such as cracking prevent the easy application of SOG technology to provide an interlayer dielectric in multilevel metal interconnect circuits, particularly in university processing labs. This paper will show that a thin layer of CVD SiO2 and a curing temperature below the sintering temperature of the metal interconnect layer will promote adhesion, reduce gaps, and prevent cracking. Electron scanning microscope analysis has been used to demonstrate the success of the improved technique. This optimized process has been used in batches of double-poly, triple-metal CMOS wafer fabrication to date.

Optical interconnect technologies for high-bandwidth ICT systems

NASA Astrophysics Data System (ADS)

Chujo, Norio; Takai, Toshiaki; Mizushima, Akiko; Arimoto, Hideo; Matsuoka, Yasunobu; Yamashita, Hiroki; Matsushima, Naoki

2016-03-01

The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach more than 10 Tb/s. However, an electrical interconnect cannot achieve such bandwidth because of its density limits. To solve this problem, we propose two types of high-density optical fiber wiring for backplanes and circuit boards such as interface boards and switch boards. One type uses routed ribbon fiber in a circuit board because it has the ability to be formed into complex shapes to avoid interfering with the LSI and electrical components on the board. The backplane is required to exhibit high density and flexibility, so the second type uses loose fiber. We developed a 9.6-Tb/s optical interconnect demonstration system using embedded optical modules, optical backplane, and optical connector in a network apparatus chassis. We achieved 25-Gb/s transmission between FPGAs via the optical backplane.

Systems thinking for assistive technology: a commentary on the GREAT summit.

PubMed

MacLachlan, Malcolm; Scherer, Marcia J

2018-07-01

The area of assistive technology has a long history of technological ingenuity and innovation. In order to ensure that the benefits of assistive technology are equitably distributed across the population and life course, it is necessary to adopt a systemic approach to the area. We describe examples of systems thinking and non-systems thinking across 10 Ps. These Ps are People (or users, as the primary beneficiaries of assistive technology), Policy, Products, Personnel, Provision (as key strategic drivers at systems level); and Procurement, Place, Pace, Promotion and Partnership (as key situational factors for systems). Together these Ps should constitute a framework for an "open" system that can evolve and adapt, that empowers users, inter-connects key components and locates these in the reality of differing contexts. The adoption of a stronger systems thinking perspective within the assistive technology field should allow for more equitable, more resilient and more sustainable assistive technology across high, middle- and low-income contexts and countries. Implications for Rehabilitation The progress of assistive technology provison has been hampered by disconnected initiatives and activities and this needs to be corrected. Systems thinking is a way of thinking about the connections between things and how these are influenced by contextual and other factors. By encouraging the providers and users of assitive technology to think more systemically we can provide a more cohesive and resilient systems. The user experience is the central component of systems thinking in assistive technologies.

Mathematics Teacher TPACK Standards and Development Model

ERIC Educational Resources Information Center

Niess, Margaret L.; Ronau, Robert N.; Shafer, Kathryn G.; Driskell, Shannon O.; Harper, Suzanne R.; Johnston, Christopher; Browning, Christine; Ozgun-Koca, S. Asli; Kersaint, Gladis

2009-01-01

What knowledge is needed to teach mathematics with digital technologies? The overarching construct, called technology, pedagogy, and content knowledge (TPACK), has been proposed as the interconnection and intersection of technology, pedagogy, and content knowledge. Mathematics Teacher TPACK Standards offer guidelines for thinking about this…

75 FR 62299 - National Cybersecurity Awareness Month, 2010

Federal Register 2010, 2011, 2012, 2013, 2014

2010-10-08

..., government efficiency, and national security. We stand at a transformational moment in history, when our technologically interconnected world presents both immense promise and potential risks. The same technology that... efforts to defend our Nation's information technology and communications infrastructure. We must continue...

Photonic quantum state transfer between a cold atomic gas and a crystal.

PubMed

Maring, Nicolas; Farrera, Pau; Kutluer, Kutlu; Mazzera, Margherita; Heinze, Georg; de Riedmatten, Hugues

2017-11-22

Interfacing fundamentally different quantum systems is key to building future hybrid quantum networks. Such heterogeneous networks offer capabilities superior to those of their homogeneous counterparts, as they merge the individual advantages of disparate quantum nodes in a single network architecture. However, few investigations of optical hybrid interconnections have been carried out, owing to fundamental and technological challenges such as wavelength and bandwidth matching of the interfacing photons. Here we report optical quantum interconnection of two disparate matter quantum systems with photon storage capabilities. We show that a quantum state can be transferred faithfully between a cold atomic ensemble and a rare-earth-doped crystal by means of a single photon at 1,552  nanometre telecommunication wavelength, using cascaded quantum frequency conversion. We demonstrate that quantum correlations between a photon and a single collective spin excitation in the cold atomic ensemble can be transferred to the solid-state system. We also show that single-photon time-bin qubits generated in the cold atomic ensemble can be converted, stored and retrieved from the crystal with a conditional qubit fidelity of more than 85 per cent. Our results open up the prospect of optically connecting quantum nodes with different capabilities and represent an important step towards the realization of large-scale hybrid quantum networks.

Biotea: RDFizing PubMed Central in support for the paper as an interface to the Web of Data

PubMed Central

2013-01-01

Background The World Wide Web has become a dissemination platform for scientific and non-scientific publications. However, most of the information remains locked up in discrete documents that are not always interconnected or machine-readable. The connectivity tissue provided by RDF technology has not yet been widely used to support the generation of self-describing, machine-readable documents. Results In this paper, we present our approach to the generation of self-describing machine-readable scholarly documents. We understand the scientific document as an entry point and interface to the Web of Data. We have semantically processed the full-text, open-access subset of PubMed Central. Our RDF model and resulting dataset make extensive use of existing ontologies and semantic enrichment services. We expose our model, services, prototype, and datasets at http://biotea.idiginfo.org/ Conclusions The semantic processing of biomedical literature presented in this paper embeds documents within the Web of Data and facilitates the execution of concept-based queries against the entire digital library. Our approach delivers a flexible and adaptable set of tools for metadata enrichment and semantic processing of biomedical documents. Our model delivers a semantically rich and highly interconnected dataset with self-describing content so that software can make effective use of it. PMID:23734622

Al-Si-Cu/TiN multilayer interconnection and Al-Ge reflow sputtering technologies for quarter-micron devices

NASA Astrophysics Data System (ADS)

Kikkawa, Takamaro; Kikuta, Kuniko

1993-05-01

Issues of interconnection technologies for quarter-micron devices are the reliability of metal lines with quarter-micron feature sizes and the formation of contact-hole-plugs with high aspect ratios. This paper describes a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer conductor structure as a quarter-micron interconnection technology and aluminum-germanium (Al-Ge) reflow sputtering as a contact-hole filling technology. The TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti multilayer conductor structure could suppress stress-induced voiding and improve the electromigration mean-time to failure. These improvements are attributed to the fact that the grain boundaries for the Al-Si-Cu film and the interfaces between the Al-Si-Cu and the TiN films are strengthened by the rigid intermetallic compound, TiAl3. The Al-Ge alloy reflow sputtering is a candidate for contact- and via-hole filling technologies in terms of reducing fabrication costs. The Al-Ge reflow sputtering achieved low temperature contact hole filling at 300 degree(s)C. Contact holes with a diameter of 0.25 micrometers and aspect ratio of 4 could be filled. This is attributed to the low eutectic temperature for Al-Ge (424 degree(s)C) and the effect of thin polysilicon underlayer on the enhancement of Al-Ge reflow.

Power System Study for Renewable Energy Interconnection in Malaysia

NASA Astrophysics Data System (ADS)

Askar, O. F.; Ramachandaramurthy, V. K.

2013-06-01

The renewable energy (RE) sector has grown exponentially in Malaysia with the introduction of the Feed-In-Tariff (FIT) by the Ministry of Energy, Green Technology and Water. Photovoltaic, biogas, biomass and mini hydro are among the renewable energy sources which offer a lucrative tariff to incite developers in taking the green technology route. In order to receive the FIT, a developer is required by the utility company to perform a power system analysis which will determine the technical feasibility of an RE interconnection to the utility company's existing grid system. There are a number of aspects which the analysis looks at, the most important being the load flow and fault levels in the network after the introduction of an RE source. The analysis is done by modelling the utility company's existing network and simulating the network with the interconnection of an RE source. The results are then compared to the values before an interconnection is made as well as ensuring the voltage rise or the increase in fault levels do not violate any pre-existing regulations set by the utility company. This paper will delve into the mechanics of performing a load flow analysis and examining the results obtained.

Stretchable interconnections for flexible electronic systems.

PubMed

Jianhui, Lin; Bing, Yan; Xiaoming, Wu; Tianling, Ren; Litian, Liu

2009-01-01

Sensors, actuators and integrated circuits (IC) can be encapsulated together on an elastic substrate, which makes a flexible electronic system. In this system, electrical interconnections that can sustain large and reversible stretching are in great need. This paper is devoted to the fabrication of highly stretchable metal interconnections. Transfer printing technology is utilized, which mainly involves the transfer of 100-nm-thick gold ribbons from silicon wafers to pre-stretched elastic substrates. After the elastic substrates relax from the pre-strain, the gold ribbons buckle and form wavy geometries. These wavy geometries change in shapes to accommodate the applied strain and can be reversely stretched without cracks or fractures occurring, which will greatly raise the stretchability of the gold ribbons. As an application example, some of these wavy ribbons can accommodate high levels of stretching (up to 100%) and bending (with curvature radius down to 1.20 mm). Moreover, the efficiency and reliability of the transfer, especially for slender ribbons, have been increased due to the improvement of the technology. All the characteristics above will permit making stretchable gold conductors as interconnections for flexible electronic systems such as implantable medical systems and smart clothes.

Integral manifolding structure for fuel cell core having parallel gas flow

DOEpatents

Herceg, Joseph E.

1984-01-01

Disclosed herein are manifolding means for directing the fuel and oxidant gases to parallel flow passageways in a fuel cell core. Each core passageway is defined by electrolyte and interconnect walls. Each electrolyte and interconnect wall consists respectively of anode and cathode materials layered on the opposite sides of electrolyte material, or on the opposite sides of interconnect material. A core wall projects beyond the open ends of the defined core passageways and is disposed approximately midway between and parallel to the adjacent overlaying and underlying interconnect walls to define manifold chambers therebetween on opposite sides of the wall. Each electrolyte wall defining the flow passageways is shaped to blend into and be connected to this wall in order to redirect the corresponding fuel and oxidant passageways to the respective manifold chambers either above or below this intermediate wall. Inlet and outlet connections are made to these separate manifold chambers respectively, for carrying the fuel and oxidant gases to the core, and for carrying their reaction products away from the core.

Integral manifolding structure for fuel cell core having parallel gas flow

DOEpatents

Herceg, J.E.

1983-10-12

Disclosed herein are manifolding means for directing the fuel and oxidant gases to parallel flow passageways in a fuel cell core. Each core passageway is defined by electrolyte and interconnect walls. Each electrolyte and interconnect wall consists respectively of anode and cathode materials layered on the opposite sides of electrolyte material, or on the opposite sides of interconnect material. A core wall projects beyond the open ends of the defined core passageways and is disposed approximately midway between and parallel to the adjacent overlaying and underlying interconnect walls to define manifold chambers therebetween on opposite sides of the wall. Each electrolyte wall defining the flow passageways is shaped to blend into and be connected to this wall in order to redirect the corresponding fuel and oxidant passageways to the respective manifold chambers either above or below this intermediate wall. Inlet and outlet connections are made to these separate manifold chambers respectively, for carrying the fuel and oxidant gases to the core, and for carrying their reaction products away from the core.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Thomas, H. P.; Basso, T. S.; Kroposki, B.

The Department of Energy (DOE) Distributed Power Program (DPP) is conducting work to complete, validate in the field, and support the development of a national interconnection standard for distributed energy resources (DER), and to address the institutional and regulatory barriers slowing the commercial adoption of DER systems. This work includes support for the IEEE standards, including P1547 Standard for Interconnecting Distributed Resources with Electric Power Systems, P1589 Standard for Conformance Test Procedures for Equipment Interconnecting Distributed Resources with Electric Power Systems, and the P1608 Application Guide. Work is also in progress on system integration research and development (R&D) on themore » interface and control of DER with local energy systems. Additional efforts are supporting high-reliability power for industry, evaluating innovative concepts for DER applications, and exploring plug-and-play interface and control technologies for intelligent autonomous interconnection systems. This paper summarizes (1) the current status of the IEEE interconnection standards and application guides in support of DER, and (2) the R&D in progress at the National Renewable Energy Laboratory (NREL) for interconnection and system integration and application of distributed energy resources.« less

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nair, Aswathi; Raghunandan, Karthik; Yaswant, Vaddi

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10 μm/s with healed route havingmore » mean resistance of 8 kΩ across a 200 micron gap and depending on the materials and concentrations used.« less

Exploration of operator method digital optical computers for application to NASA

NASA Technical Reports Server (NTRS)

1990-01-01

Digital optical computer design has been focused primarily towards parallel (single point-to-point interconnection) implementation. This architecture is compared to currently developing VHSIC systems. Using demonstrated multichannel acousto-optic devices, a figure of merit can be formulated. The focus is on a figure of merit termed Gate Interconnect Bandwidth Product (GIBP). Conventional parallel optical digital computer architecture demonstrates only marginal competitiveness at best when compared to projected semiconductor implements. Global, analog global, quasi-digital, and full digital interconnects are briefly examined as alternative to parallel digital computer architecture. Digital optical computing is becoming a very tough competitor to semiconductor technology since it can support a very high degree of three dimensional interconnect density and high degrees of Fan-In without capacitive loading effects at very low power consumption levels.

A reference model for space data system interconnection services

NASA Astrophysics Data System (ADS)

Pietras, John; Theis, Gerhard

1993-03-01

The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

A reference model for space data system interconnection services

NASA Technical Reports Server (NTRS)

Pietras, John; Theis, Gerhard

1993-01-01

The widespread adoption of standard packet-based data communication protocols and services for spaceflight missions provides the foundation for other standard space data handling services. These space data handling services can be defined as increasingly sophisticated processing of data or information received from lower-level services, using a layering approach made famous in the International Organization for Standardization (ISO) Open System Interconnection Reference Model (OSI-RM). The Space Data System Interconnection Reference Model (SDSI-RM) incorporates the conventions of the OSIRM to provide a framework within which a complete set of space data handling services can be defined. The use of the SDSI-RM is illustrated through its application to data handling services and protocols that have been defined by, or are under consideration by, the Consultative Committee for Space Data Systems (CCSDS).

Fiber optic interconnect and optoelectronic packaging challenges for future generation avionics

NASA Astrophysics Data System (ADS)

Beranek, Mark W.

2007-02-01

Forecasting avionics industry fiber optic interconnect and optoelectronic packaging challenges that lie ahead first requires an assumption that military avionics architectures will evolve from today's centralized/unified concept based on gigabit laser, optical-to-electrical-to-optical switching and optical backplane technology, to a future federated/distributed or centralized/unified concept based on gigabit tunable laser, electro-optical switch and add-drop wavelength division multiplexing (WDM) technology. The requirement to incorporate avionics optical built-in test (BIT) in military avionics fiber optic systems is also assumed to be correct. Taking these assumptions further indicates that future avionics systems engineering will use WDM technology combined with photonic circuit integration and advanced packaging to form the technical basis of the next generation military avionics onboard local area network (LAN). Following this theme, fiber optic cable plants will evolve from today's multimode interconnect solution to a single mode interconnect solution that is highly installable, maintainable, reliable and supportable. Ultimately optical BIT for fiber optic fault detection and isolation will be incorporated as an integral part of a total WDM-based avionics LAN solution. Cost-efficient single mode active and passive photonic component integration and packaging integration is needed to enable reliable operation in the harsh military avionics application environment. Rugged multimode fiber-based transmitters and receivers (transceivers) with in-package optical BIT capability are also needed to enable fully BIT capable single-wavelength fiber optic links on both legacy and future aerospace platforms.

Virginia Offshore Wind Technology Advancement Project (VOWTAP) DOE EE0005985 Final Technical Report Rev 1a

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pietryk, Steven

The primary purpose of the VOWTAP was to advance the offshore wind industry in the United States (U.S.) by demonstrating innovative technologies and process solutions that would establish offshore wind as a cost-effective renewable energy resource. The VOWTAP Team proposed to design, construct, and operate a 12 megawatt (MW) offshore wind facility located approximately 27 statute miles (mi) (24 nautical miles [nm], 43 kilometers [km]) off the coast of Virginia. The proposed Project would consist of two Alstom Haliade™ 150-6 MW turbines mounted on inward battered guide structures (IBGS), a 34.5-kilovolt (kV) alternating current (AC) submarine cable interconnecting the WTGsmore » (inter-array cable), a 34.5-kV AC submarine transmission cable (export cable), and a 34.5 kV underground cable (onshore interconnection cable) that would connect the Project with existing Dominion infrastructure located in Virginia Beach, Virginia (Figure 1). Interconnection with the existing Dominion infrastructure would also require an onshore switch cabinet, a fiber optic cable, and new interconnection station to be located entirely within the boundaries of the Camp Pendleton State Military Reservation (Camp Pendleton). The VOWTAP balanced technology innovation with commercial readiness such that turbine operations were anticipated to commence by 2018. Dominion, as the leaseholder of the Virginia Wind Energy Area (WEA), anticipated leveraging lessons learned through the VOWTAP, and applying them to future commercial-scale offshore wind development.« less

Silicone substrate with in situ strain relief for stretchable thin-film transistors

NASA Astrophysics Data System (ADS)

Graz, Ingrid M.; Cotton, Darryl P. J.; Robinson, Adam; Lacour, Stéphanie P.

2011-03-01

We have manufactured stretchable thin-film transistors and interconnects directly onto an engineered silicone matrix with localized and graded mechanical compliance. The fabrication only involves planar and standard processing. Brittle active device materials are patterned on non deformable elastomer regions (strain <1% at all times) while interconnects run smoothly from "stiff" to "soft" elastomer. Pentacene thin-film transistors sustain applied strain up to 13% without electrical degradation and mechanical fracture. This integrated approach opens promising options for the manufacture of physically adaptable and transformable circuitry.

Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)

NASA Astrophysics Data System (ADS)

Roslan, M. F.; Shaffiar, N. M.; Khairusshima, M. K. N.; Sharifah, I. S. S.

2018-01-01

Over the years, the technology of electronic industry has growth tremendously. Open ended research on how to make a better concept of electronic circuit is ongoing especially on the stretchable electronic devices. There are many designs to achieve stretchability in electronic circuits. The problem occurs when deformation applied to the stretchable electronic circuit, it cannot maintain its functionality. Fracture may happen on the conductor. In this research, the study on deformation of stretchable electronic interconnects substrate using Polydimethlysiloxanes is carried out. The purpose of this research are to study the axial deformation occur, to determine the optimum shape of the conductor designs (horseshoe, rectangular and u-shape design) for the stretchable electronic interconnect and to compare the mechanical properties of Polydimethlysiloxanes (PDMS) with Polyurethane (PU) using Finite Element Analysis (FEA). The simulation was done on the FE model of the stretchable circuit with dimension of 2.4 X 2.4 X 0.5 mm. The stretching of the FE model was simulated with the range of elongation at 10, 20 and 30 percent from its original length in order to find the strain value for all three of the conductor designs. The best conductor design is used to simulate with different types of substrate (PDMS and PU). From the simulation result, Horseshoe design record the lowest strain value for each elongation, followed by rectangular and U-shape design. Thus, Horseshoe is considered as the optimum design for the conductor compared to the other two designs. From the result also, it shows that PDMS substrate will offer more maximum allowable stretchability compared to PU substrates. Thus PDMS is considered as a better substrate compare to PU. PDMS is a good material to replace PU since it can perform under tension much better mechanically.

Integration of e-Management, e-Development and e-Learning Technologies for Blended Course Delivery

ERIC Educational Resources Information Center

Johnson, Lynn E.; Tang, Michael

2005-01-01

This paper describes and assesses a pre-engineering curriculum development project called Foundations of Engineering, Science and Technology (FEST). FEST integrates web-based technologies into an inter-connected system to enable delivery of a blended program at multiple institutions. Tools and systems described include 1) technologies to deliver…

U.S. Laws and Regulations for Renewable Energy Grid Interconnections

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chernyakhovskiy, Ilya; Tian, Tian; McLaren, Joyce

Rapidly declining costs of wind and solar energy technologies, increasing concerns about the environmental and climate change impacts of fossil fuels, and sustained investment in renewable energy projects all point to a not-so-distant future in which renewable energy plays a pivotal role in the electric power system of the 21st century. In light of public pressures and market factors that hasten the transition towards a low-carbon system, power system planners and regulators are preparing to integrate higher levels of variable renewable generation into the grid. Updating the regulations that govern generator interconnections and operations is crucial to ensure system reliabilitymore » while creating an enabling environment for renewable energy development. This report presents a chronological review of energy laws and regulations concerning grid interconnection procedures in the United States, highlighting the consequences of policies for renewable energy interconnections. Where appropriate, this report places interconnection policies and their impacts on renewable energy within the broader context of power market reform.« less

A nanostructure based on metasurfaces for optical interconnects

NASA Astrophysics Data System (ADS)

Lin, Shulang; Gu, Huarong

2017-08-01

Optical-electronic Integrated Neural Co-processor takes vital part in optical neural network, which is mainly realized by optical interconnects. Because of the accuracy requirement and long-term goal of integration, optical interconnects should be effective and pint-size. In traditional solutions of optical interconnects, holography built on crystalloid or law of Fresnel diffraction exploited on zone plate was used. However, holographic method cannot meet the efficiency requirement and zone plate is too bulk to make the optical neural unit miniaturization. Thus, this paper aims to find a way to replace holographic method or zone plate with enough diffraction efficiency and smaller size. Metasurfaces are composed of subwavelength-spaced phase shifters at an interface of medium. Metasurfaces allow for unprecedented control of light properties. They also have advanced optical technology of enabling versatile functionalities in a planar structure. In this paper, a nanostructure is presented for optical interconnects. The comparisons of light splitting ability and simulated crosstalk between nanostructure and zone plate are also made.

The potential benefits of photonics in the computing platform

NASA Astrophysics Data System (ADS)

Bautista, Jerry

2005-03-01

The increase in computational requirements for real-time image processing, complex computational fluid dynamics, very large scale data mining in the health industry/Internet, and predictive models for financial markets are driving computer architects to consider new paradigms that rely upon very high speed interconnects within and between computing elements. Further challenges result from reduced power requirements, reduced transmission latency, and greater interconnect density. Optical interconnects may solve many of these problems with the added benefit extended reach. In addition, photonic interconnects provide relative EMI immunity which is becoming an increasing issue with a greater dependence on wireless connectivity. However, to be truly functional, the optical interconnect mesh should be able to support arbitration, addressing, etc. completely in the optical domain with a BER that is more stringent than "traditional" communication requirements. Outlined are challenges in the advanced computing environment, some possible optical architectures and relevant platform technologies, as well roughly sizing these opportunities which are quite large relative to the more "traditional" optical markets.

Grid Application Meta-Repository System: Repository Interconnectivity and Cross-domain Application Usage in Distributed Computing Environments

NASA Astrophysics Data System (ADS)

Tudose, Alexandru; Terstyansky, Gabor; Kacsuk, Peter; Winter, Stephen

Grid Application Repositories vary greatly in terms of access interface, security system, implementation technology, communication protocols and repository model. This diversity has become a significant limitation in terms of interoperability and inter-repository access. This paper presents the Grid Application Meta-Repository System (GAMRS) as a solution that offers better options for the management of Grid applications. GAMRS proposes a generic repository architecture, which allows any Grid Application Repository (GAR) to be connected to the system independent of their underlying technology. It also presents applications in a uniform manner and makes applications from all connected repositories visible to web search engines, OGSI/WSRF Grid Services and other OAI (Open Archive Initiative)-compliant repositories. GAMRS can also function as a repository in its own right and can store applications under a new repository model. With the help of this model, applications can be presented as embedded in virtual machines (VM) and therefore they can be run in their native environments and can easily be deployed on virtualized infrastructures allowing interoperability with new generation technologies such as cloud computing, application-on-demand, automatic service/application deployments and automatic VM generation.

Semantic Web meets Integrative Biology: a survey.

PubMed

Chen, Huajun; Yu, Tong; Chen, Jake Y

2013-01-01

Integrative Biology (IB) uses experimental or computational quantitative technologies to characterize biological systems at the molecular, cellular, tissue and population levels. IB typically involves the integration of the data, knowledge and capabilities across disciplinary boundaries in order to solve complex problems. We identify a series of bioinformatics problems posed by interdisciplinary integration: (i) data integration that interconnects structured data across related biomedical domains; (ii) ontology integration that brings jargons, terminologies and taxonomies from various disciplines into a unified network of ontologies; (iii) knowledge integration that integrates disparate knowledge elements from multiple sources; (iv) service integration that build applications out of services provided by different vendors. We argue that IB can benefit significantly from the integration solutions enabled by Semantic Web (SW) technologies. The SW enables scientists to share content beyond the boundaries of applications and websites, resulting into a web of data that is meaningful and understandable to any computers. In this review, we provide insight into how SW technologies can be used to build open, standardized and interoperable solutions for interdisciplinary integration on a global basis. We present a rich set of case studies in system biology, integrative neuroscience, bio-pharmaceutics and translational medicine, to highlight the technical features and benefits of SW applications in IB.

In the year 2525, if x ray is still alive, if lithography can survive, they may find...

NASA Astrophysics Data System (ADS)

Nistler, John L.; Michael, Mark; Hause, Fred N.; Edwards, Richard D.

1998-12-01

Data and discussions will be presented on the NTRM, National Technology Roadmap, for reticles based on a Process Integration perception. Specifically two layers are considered for this paper, the gate layer which is primarily a chrome geometry mask with a lot of open glass and a local interconnect layer which is primarily a chrome plate using clear geometries. Information from other sources is used where appropriate and actual in-house data is used to illustrate specific points. Realizing that demands from different customers for specific types of features tend to drive specific mask makers and their decisions on equipment purchases and processes. We attempt to help predict where Integration approaches have either caused a lag in technology pushes or have actually speeded up certain requirements. Discussions of integration requirements, which tend to push maskmakers, will be presented. Along with typical design approaches in OPC and PSM which either will push technology or actually slow down the trend towards smaller geometries. In addition, data will be presented showing how specific stepper characteristics may actually drive the customer's criteria, thus changing the requirements from customer to customer.

Reflow-oven-processing of pressureless sintered-silver interconnects

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significantmore » because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.« less

Reflow-oven-processing of pressureless sintered-silver interconnects

DOE PAGES

Wereszczak, Andrew A.; Chen, Branndon R.; Oistad, Brian A.

2018-01-04

Here, a method was developed to pressurelessly fabricate strong and consistent sinterable-silver joints or interconnects using reflow oven heating. Circular sinterable-silver interconnects, having nominal diameter of 5 mm and 0.1 mm thickness were stencil printed, contact-dried, and then pressurelessly sinter-bonded to Au-plated direct copper bonded ceramic substrates at 250 °C in ambient air. That sintering was done in either a reflow oven or a convective oven (latter being a conventional heating source for processing sinterable-silver). Consistently strong (>40 MPa) interconnects were produced with reflow oven heating and were as strong as those produced with convective oven heating. This is significantmore » because reflow oven technology affords better potential for continuous mass production and it was shown that strong sintered-silver bonds can indeed be achieved with its use.« less

Technology Solutions | Distributed Generation Interconnection Collaborative

Science.gov Websites

technologies, both hardware and software, can support the wider adoption of distributed generation on the grid . As the penetration of distributed-generation photovoltaics (DGPV) has risen rapidly in recent years posed by high penetrations of distributed PV. Other promising technologies include new utility software

Telemedical applications and grid technology

NASA Astrophysics Data System (ADS)

Graschew, Georgi; Roelofs, Theo A.; Rakowsky, Stefan; Schlag, Peter M.; Kaiser, Silvan; Albayrak, Sahin

2005-11-01

Due to the experience in the exploitation of previous European telemedicine projects an open Euro-Mediterranean consortium proposes the Virtual Euro-Mediterranean Hospital (VEMH) initiative. The provision of the same advanced technologies to the European and Mediterranean Countries should contribute to their better dialogue for integration. VEMH aims to facilitate the interconnection of various services through real integration which must take into account the social, human and cultural dimensions. VEMH will provide a platform consisting of a satellite and terrestrial link for the application of medical e-learning, real-time telemedicine and medical assistance. The methodologies for the VEMH are medical-needs-driven instead of technology-driven. They supply new management tools for virtual medical communities and allow management of clinical outcomes for implementation of evidence-based medicine. Due to the distributed character of the VEMH Grid technology becomes inevitable for successful deployment of the services. Existing Grid Engines provide basic computing power needed by today's medical analysis tasks but lack other capabilities needed for communication and knowledge sharing services envisioned. When it comes to heterogeneous systems to be shared by different institutions especially the high level system management areas are still unsupported. Therefore a Metagrid Engine is needed that provides a superset of functionalities across different Grid Engines and manages strong privacy and Quality of Service constraints at this comprehensive level.

Aviation Frontiers: On-Demand Aircraft

NASA Technical Reports Server (NTRS)

Moore, Mark D.

2010-01-01

Throughout the 20th Century, NASA has defined the forefront of aeronautical technology, and the aviation industry owes much of its prosperity to this knowledge and technology. In recent decades, centralized aeronautics has become a mature discipline, which raises questions concerning the future aviation innovation frontiers. Three transformational aviation capabilities, bounded together by the development of a Free Flight airspace management system, have the potential to transform 21st Century society as profoundly as civil aviation transformed the 20th Century. These mobility breakthroughs will re-establish environmental sustainable centralized aviation, while opening up latent markets for civil distributed sensing and on-demand rural and regional transportation. Of these three transformations, on-demand aviation has the potential to have the largest market and productivity improvement to society. The information system revolution over the past 20 years shows that vehicles lead, and the interconnecting infrastructure to make them more effective follows; that is, unless on-demand aircraft are pioneered, a distributed Air Traffic Control system will likely never be established. There is no single technology long-pole that will enable on-demand vehicle solutions. However, fully digital aircraft that include electric propulsion has the potential to be a multi-disciplinary initiator of solid state technologies that can provide order of magnitude improvements in the ease of use, safety/reliability, community and environmental friendliness, and affordability.

Mobile Communication Via Satellite

NASA Technical Reports Server (NTRS)

Yan, Tsun-Yee; Naderi, Firouz M.

1988-01-01

System mixes real-time and delayed-transmission channels. Combination of L-band and SHF links connect fixed and mobile equipment on ground to satellite relay. Software and hardware architecture conforms structure of open-system-interconnection model suggested by International Standards Organization.

Phase Two of the Array Automated Assembly Task for the Low Cost Solar Array Project

NASA Technical Reports Server (NTRS)

Campbell, R. B.; Page, D. J.; Rai-Choudhury, P.; Seman, E. J.; Hanes, M. H.; Rohatgi, A.; Davis, J. R.

1979-01-01

Various top contact metal systems were studied. Only Ti Pd Cu approaches baseline (Ti Pd Ag) quality, but this system shows a lack of long term stability. Aluminum back surface field structures were fabricated and thicknesses of p superscript + material of up to 7.0 microns were achieved with open circuit voltages of 0.59V. A general purpose ultrasonic welder was purchased and tests using various metal foils are under way. During fabrication of the demonstration module, several cells became cracked. Due to redundancy of interconnections, the module was not open circuited but the efficiency was reduced to 8.8%. The broken cell was interconnected with a strap across the back and the efficiency was increased to 11.5%. A cost analysis was made and the results indicate a selling price of $0.56/watt peak (in 1986 with 1975 dollars).

Technology as "A Human Practice with Social Meaning:" A New Scenery for Engineering Education

ERIC Educational Resources Information Center

Gana, Maria Teresa Santander; Fuentes, Luis Antonio Trejo

2006-01-01

In a world sustained and interconnected by technology, people make choices. Therefore, they have to consider that technology is subject to analysis and interpretation because it is designed by humans with varied histories, experiences and cultures. To generate an understanding of the technological phenomenon, this article proposes to view the…

High-rate serial interconnections for embedded and distributed systems with power and resource constraints

NASA Astrophysics Data System (ADS)

Sheynin, Yuriy; Shutenko, Felix; Suvorova, Elena; Yablokov, Evgenej

2008-04-01

High rate interconnections are important subsystems in modern data processing and control systems of many classes. They are especially important in prospective embedded and on-board systems that used to be multicomponent systems with parallel or distributed architecture, [1]. Modular architecture systems of previous generations were based on parallel busses that were widely used and standardised: VME, PCI, CompactPCI, etc. Busses evolution went in improvement of bus protocol efficiency (burst transactions, split transactions, etc.) and increasing operation frequencies. However, due to multi-drop bus nature and multi-wire skew problems the parallel bussing speedup became more and more limited. For embedded and on-board systems additional reason for this trend was in weight, size and power constraints of an interconnection and its components. Parallel interfaces have become technologically more challenging as their respective clock frequencies have increased to keep pace with the bandwidth requirements of their attached storage devices. Since each interface uses a data clock to gate and validate the parallel data (which is normally 8 bits or 16 bits wide), the clock frequency need only be equivalent to the byte rate or word rate being transmitted. In other words, for a given transmission frequency, the wider the data bus, the slower the clock. As the clock frequency increases, more high frequency energy is available in each of the data lines, and a portion of this energy is dissipated in radiation. Each data line not only transmits this energy but also receives some from its neighbours. This form of mutual interference is commonly called "cross-talk," and the signal distortion it produces can become another major contributor to loss of data integrity unless compensated by appropriate cable designs. Other transmission problems such as frequency-dependent attenuation and signal reflections, while also applicable to serial interfaces, are more troublesome in parallel interfaces due to the number of additional cable conductors involved. In order to compensate for these drawbacks, higher quality cables, shorter cable runs and fewer devices on the bus have been the norm. Finally, the physical bulk of the parallel cables makes them more difficult to route inside an enclosure, hinders cooling airflow and is incompatible with the trend toward smaller form-factor devices. Parallel busses worked in systems during the past 20 years, but the accumulated problems dictate the need for change and the technology is available to spur the transition. The general trend in high-rate interconnections turned from parallel bussing to scalable interconnections with a network architecture and high-rate point-to-point links. Analysis showed that data links with serial information transfer could achieve higher throughput and efficiency and it was confirmed in various research and practical design. Serial interfaces offer an improvement over older parallel interfaces: better performance, better scalability, and also better reliability as the parallel interfaces are at their limits of speed with reliable data transfers and others. The trend was implemented in major standards' families evolution: e.g. from PCI/PCI-X parallel bussing to PCIExpress interconnection architecture with serial lines, from CompactPCI parallel bus to ATCA (Advanced Telecommunications Architecture) specification with serial links and network topologies of an interconnection, etc. In the article we consider a general set of characteristics and features of serial interconnections, give a brief overview of serial interconnections specifications. In more details we present the SpaceWire interconnection technology. Have been developed for space on-board systems applications the SpaceWire has important features and characteristics that make it a prospective interconnection for wide range of embedded systems.

Authentication in Virtual Organizations: A Reputation Based PKI Interconnection Model

NASA Astrophysics Data System (ADS)

Wazan, Ahmad Samer; Laborde, Romain; Barrere, Francois; Benzekri, Abdelmalek

Authentication mechanism constitutes a central part of the virtual organization work. The PKI technology is used to provide the authentication in each organization involved in the virtual organization. Different trust models are proposed to interconnect the different PKIs in order to propagate the trust between them. While the existing trust models contain many drawbacks, we propose a new trust model based on the reputation of PKIs.

A proposed holistic approach to on-chip, off-chip, test, and package interconnections

NASA Astrophysics Data System (ADS)

Bartelink, Dirk J.

1998-11-01

The term interconnection has traditionally implied a `robust' connection from a transistor or a group of transistors in an IC to the outside world, usually a PC board. Optimum system utilization is done from outside the IC. As an alternative, this paper addresses `unimpeded' transistor-to-transistor interconnection aimed at reaching the high circuit densities and computational capabilities of neighboring IC's. In this view, interconnections are not made to some human-centric place outside the IC world requiring robustness—except for system input and output connections. This unimpeded interconnect style is currently available only through intra-chip signal traces in `system-on-a-chip' implementations, as exemplified by embedded DRAMs. Because the traditional off-chip penalty in performance and wiring density is so large, a merging of complex process technologies is the only option today. It is suggested that, for system integration to move forward, the traditional robustness requirement inherited from conventional packaging interconnect and IC manufacturing test must be discarded. Traditional system assembly from vendor parts requires robustness under shipping, inspection and assembly. The trend toward systems on a chip signifies willingness by semiconductor companies to design and fabricate whole systems in house, so that `in-house' chip-to-chip assembly is not beyond reach. In this scenario, bare chips never leave the controlled environment of the IC fabricator while the two major contributors to off-chip signal penalty, ESD protection and the need to source a 50-ohm test head, are avoided. With in-house assembly, ESD protection can be eliminated with the precautions already familiar in plasma etching. Test interconnection impacts the fundamentals of IC manufacturing, particularly with clock speeds approaching 1GHz, and cannot be an afterthought. It should be an integral part of the chip-to-chip interconnection bandwidth optimization, because—as we must recognize—test is also performed using IC's. A system interconnection is proposed using multiple chips fabricated with conventional silicon processes, including MEMS technology. The system resembles an MCM that can be joined without committing to final assembly to perform at-speed testing. 50-Ohm test probes never load the circuit; only intended neighboring chips are ever connected. A `back-plane' chip provides the connection layers for both inter- and intra-chip signals and also serves as the probe card, in analogy with membrane probes now used for single-chip testing. Intra-chip connections, which require complicated connections during test that exactly match the product, are then properly made and all waveforms and loading conditions under test will be identical to those of the product. The major benefit is that all front-end chip technologies can be merged—logic, memory, RF, even passives. ESD protection is required only on external system connections. Manufacturing test information will accurately characterize process faults and thus avoid the Known-Good-Die problem that has slowed the arrival of conventional MCM's.

The Study on the Communication Network of Wide Area Measurement System in Electricity Grid

NASA Astrophysics Data System (ADS)

Xiaorong, Cheng; Ying, Wang; Yangdan, Ni

Wide area measurement system(WAMS) is a fundamental part of security defense in Smart Grid, and the communication system of WAMS is an important part of Electric power communication network. For a large regional network is concerned, the real-time data which is transferred in the communication network of WAMS will affect the safe operation of the power grid directly. Therefore, WAMS raised higher requirements for real-time, reliability and security to its communication network. In this paper, the architecture of WASM communication network was studied according to the seven layers model of the open systems interconnection(OSI), and the network architecture was researched from all levels. We explored the media of WAMS communication network, the network communication protocol and network technology. Finally, the delay of the network were analyzed.

Additively manufactured porous tantalum implants.

PubMed

Wauthle, Ruben; van der Stok, Johan; Amin Yavari, Saber; Van Humbeeck, Jan; Kruth, Jean-Pierre; Zadpoor, Amir Abbas; Weinans, Harrie; Mulier, Michiel; Schrooten, Jan

2015-03-01

The medical device industry's interest in open porous, metallic biomaterials has increased in response to additive manufacturing techniques enabling the production of complex shapes that cannot be produced with conventional techniques. Tantalum is an important metal for medical devices because of its good biocompatibility. In this study selective laser melting technology was used for the first time to manufacture highly porous pure tantalum implants with fully interconnected open pores. The architecture of the porous structure in combination with the material properties of tantalum result in mechanical properties close to those of human bone and allow for bone ingrowth. The bone regeneration performance of the porous tantalum was evaluated in vivo using an orthotopic load-bearing bone defect model in the rat femur. After 12 weeks, substantial bone ingrowth, good quality of the regenerated bone and a strong, functional implant-bone interface connection were observed. Compared to identical porous Ti-6Al-4V structures, laser-melted tantalum shows excellent osteoconductive properties, has a higher normalized fatigue strength and allows for more plastic deformation due to its high ductility. It is therefore concluded that this is a first step towards a new generation of open porous tantalum implants manufactured using selective laser melting. Copyright © 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Wicked problems in space technology development at NASA

NASA Astrophysics Data System (ADS)

Balint, Tibor S.; Stevens, John

2016-01-01

Technological innovation is key to enable future space exploration missions at NASA. Technology development, however, is not only driven by performance and resource considerations, but also by a broad range of directly or loosely interconnected factors. These include, among others, strategy, policy and politics at various levels, tactics and programmatics, interactions between stakeholders, resource requirements, performance goals from component to system level, mission infusion targets, portfolio execution and tracking, and technology push or mission pull. Furthermore, at NASA, these influences occur on varying timescales and at diverse geographic locations. Such a complex and interconnected system could impede space technology innovation in this examined segment of the government environment. Hence, understanding the process through NASA's Planning, Programming, Budget and Execution cycle could benefit strategic thinking, planning and execution. Insights could be gained through suitable models, for example assessing the key drivers against the framework of Wicked Problems. This paper discusses NASA specific space technology innovation and innovation barriers in the government environment through the characteristics of Wicked Problems; that is, they do not have right or wrong solutions, only improved outcomes that can be reached through authoritative, competitive, or collaborative means. We will also augment the Wicked Problems model to account for the temporally and spatially coupled, and cyclical nature of this NASA specific case, and propose how appropriate models could improve understanding of the key influencing factors. In turn, such understanding may subsequently lead to reducing innovation barriers, and stimulating technology innovation at NASA. Furthermore, our approach can be adopted for other government-directed environments to gain insights into their structures, hierarchies, operational flow, and interconnections to facilitate circular dialogs towards preferred outcomes.

OSI Conformance Testing for Bibliographic Applications.

ERIC Educational Resources Information Center

Arbez, Gilbert; Swain, Leigh

1990-01-01

Describes the development of Open Systems Interconnection (OSI) conformance testing sites, conformance testing tools, and conformance testing services. Discusses related topics such as interoperability testing, arbitration testing, and international harmonization of conformance testing. A glossary is included. (24 references) (SD)

Building a Unified Information Network.

ERIC Educational Resources Information Center

Avram, Henriette D.

1988-01-01

Discusses cooperative efforts between research organizations and libraries to create a national information network. Topics discussed include the Linked System Project (LSP); technical processing versus reference and research functions; Open Systems Interconnection (OSI) Reference Model; the National Science Foundation Network (NSFNET); and…

47 CFR 54.706 - Contributions.

Code of Federal Regulations, 2011 CFR

2011-10-01

...; (12) Telex; (13) Telegraph; (14) Video services; (15) Satellite service; (16) Resale of interstate services; (17) Payphone services; and (18) Interconnected VoIP services. (19) Prepaid calling card... telecommunications services. (d) Entities providing open video systems (OVS), cable leased access, or direct...

47 CFR 54.706 - Contributions.

Code of Federal Regulations, 2012 CFR

2012-10-01

...; (12) Telex; (13) Telegraph; (14) Video services; (15) Satellite service; (16) Resale of interstate services; (17) Payphone services; and (18) Interconnected VoIP services. (19) Prepaid calling card... telecommunications services. (d) Entities providing open video systems (OVS), cable leased access, or direct...

47 CFR 54.706 - Contributions.

Code of Federal Regulations, 2014 CFR

2014-10-01

...; (12) Telex; (13) Telegraph; (14) Video services; (15) Satellite service; (16) Resale of interstate services; (17) Payphone services; and (18) Interconnected VoIP services. (19) Prepaid calling card... telecommunications services. (d) Entities providing open video systems (OVS), cable leased access, or direct...

47 CFR 54.706 - Contributions.

Code of Federal Regulations, 2013 CFR

2013-10-01

...; (12) Telex; (13) Telegraph; (14) Video services; (15) Satellite service; (16) Resale of interstate services; (17) Payphone services; and (18) Interconnected VoIP services. (19) Prepaid calling card... telecommunications services. (d) Entities providing open video systems (OVS), cable leased access, or direct...

47 CFR 54.706 - Contributions.

Code of Federal Regulations, 2010 CFR

2010-10-01

...; (12) Telex; (13) Telegraph; (14) Video services; (15) Satellite service; (16) Resale of interstate services; (17) Payphone services; and (18) Interconnected VoIP services. (19) Prepaid calling card... telecommunications services. (d) Entities providing open video systems (OVS), cable leased access, or direct...

77 FR 41481 - Integration of Variable Energy Resources

Federal Register 2010, 2011, 2012, 2013, 2014

2012-07-13

...The Federal Energy Regulatory Commission is amending the pro forma Open Access Transmission Tariff to remove unduly discriminatory practices and to ensure just and reasonable rates for Commission- jurisdictional services. Specifically, this Final Rule removes barriers to the integration of variable energy resources by requiring each public utility transmission provider to: offer intra-hourly transmission scheduling; and, incorporate provisions into the pro forma Large Generator Interconnection Agreement requiring interconnection customers whose generating facilities are variable energy resources to provide meteorological and forced outage data to the public utility transmission provider for the purpose of power production forecasting.

Revealing Long-Range Interconnected Hubs in Human Chromatin Interaction Data Using Graph Theory

NASA Astrophysics Data System (ADS)

Boulos, R. E.; Arneodo, A.; Jensen, P.; Audit, B.

2013-09-01

We use graph theory to analyze chromatin interaction (Hi-C) data in the human genome. We show that a key functional feature of the genome—“master” replication origins—corresponds to DNA loci of maximal network centrality. These loci form a set of interconnected hubs both within chromosomes and between different chromosomes. Our results open the way to a fruitful use of graph theory concepts to decipher DNA structural organization in relation to genome functions such as replication and transcription. This quantitative information should prove useful to discriminate between possible polymer models of nuclear organization.

System architecture for an advanced Canadian communications satellite demonstration mission

NASA Astrophysics Data System (ADS)

Takats, P.; Irani, S.

1992-03-01

An advanced communications satellite system that provides single hop interconnectivity and interworking for both a personal communications network and an advanced private business network in the Ka and Ku bands respectively, is presented. An overall network perspective is discussed that studies the interface of such an advanced satellite communication system to the terrestrial network in the context of the Open Systems Interconnection model. It is shown that this proposed satellite system can dynamically establish links and efficiently allocate the satellite resource amongst the user terminal population for a mix of data and voice traffic.

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

NASA Technical Reports Server (NTRS)

Mandal, R. P.

1976-01-01

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Lift/cruise fan V/STOL technology aircraft design definition study. Volume 2: Propulsion transmission system design

NASA Technical Reports Server (NTRS)

Obrien, W. J.

1976-01-01

Two types of lift/cruise fan technology aircraft were conceptually designed. One aircraft used turbotip fans pneumatically interconnected to three gas generators, and the other aircraft used variable pitch fans mechanically interconnected to three turboshaft engines. The components of each propulsion transmission system were analyzed and designed to the depth necessary to determine areas of risk, development methods, performance, weights and costs. The types of materials and manufacturing processes were identified to show that the designs followed a low cost approach. The lift/cruise fan thrust vectoring hoods, which are applicable to either aircraft configuration, were also evaluated to assure a low cost/low risk approach.

Selection and Evaluation of Priority Domains in Global Energy Internet Standard Development Based on Technology Foresight

NASA Astrophysics Data System (ADS)

Jin, Yang; Ciwei, Gao; Jing, Zhang; Min, Sun; Jie, Yu

2017-05-01

The selection and evaluation of priority domains in Global Energy Internet standard development will help to break through limits of national investment, thus priority will be given to standardizing technical areas with highest urgency and feasibility. Therefore, in this paper, the process of Delphi survey based on technology foresight is put forward, the evaluation index system of priority domains is established, and the index calculation method is determined. Afterwards, statistical method is used to evaluate the alternative domains. Finally the top four priority domains are determined as follows: Interconnected Network Planning and Simulation Analysis, Interconnected Network Safety Control and Protection, Intelligent Power Transmission and Transformation, and Internet of Things.

Development of technologies for welding interconnects to fifty-micron thick silicon solar cells

NASA Technical Reports Server (NTRS)

Patterson, R. E.

1982-01-01

A program was conducted to develop technologies for welding interconnects to 50 microns thick, 2 by 2 cm solar cells. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 C to -180 C) were performed on 16 cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48 cell modules (one for each cell type) were assembled with 50 microns thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

Simultaneous material flow analysis of nickel, chromium, and molybdenum used in alloy steel by means of input-output analysis.

PubMed

Nakajima, Kenichi; Ohno, Hajime; Kondo, Yasushi; Matsubae, Kazuyo; Takeda, Osamu; Miki, Takahiro; Nakamura, Shinichiro; Nagasaka, Tetsuya

2013-05-07

Steel is not elemental iron but rather a group of iron-based alloys containing many elements, especially chromium, nickel, and molybdenum. Steel recycling is expected to promote efficient resource use. However, open-loop recycling of steel could result in quality loss of nickel and molybdenum and/or material loss of chromium. Knowledge about alloying element substance flow is needed to avoid such losses. Material flow analyses (MFAs) indicate the importance of steel recycling to recovery of alloying elements. Flows of nickel, chromium, and molybdenum are interconnected, but MFAs have paid little attention to the interconnected flow of materials/substances in supply chains. This study combined a waste input-output material flow model and physical unit input-output analysis to perform a simultaneous MFA for nickel, chromium, and molybdenum in the Japanese economy in 2000. Results indicated the importance of recovery of these elements in recycling policies for end-of-life (EoL) vehicles and constructions. Improvement in EoL sorting technologies and implementation of designs for recycling/disassembly at the manufacturing phase are needed. Possible solutions include development of sorting processes for steel scrap and introduction of easier methods for identifying the composition of secondary resources. Recovery of steel scrap with a high alloy content will reduce primary inputs of alloying elements and contribute to more efficient resource use.

OR.NET: a service-oriented architecture for safe and dynamic medical device interoperability.

PubMed

Kasparick, Martin; Schmitz, Malte; Andersen, Björn; Rockstroh, Max; Franke, Stefan; Schlichting, Stefan; Golatowski, Frank; Timmermann, Dirk

2018-02-23

Modern surgical departments are characterized by a high degree of automation supporting complex procedures. It recently became apparent that integrated operating rooms can improve the quality of care, simplify clinical workflows, and mitigate equipment-related incidents and human errors. Particularly using computer assistance based on data from integrated surgical devices is a promising opportunity. However, the lack of manufacturer-independent interoperability often prevents the deployment of collaborative assistive systems. The German flagship project OR.NET has therefore developed, implemented, validated, and standardized concepts for open medical device interoperability. This paper describes the universal OR.NET interoperability concept enabling a safe and dynamic manufacturer-independent interconnection of point-of-care (PoC) medical devices in the operating room and the whole clinic. It is based on a protocol specifically addressing the requirements of device-to-device communication, yet also provides solutions for connecting the clinical information technology (IT) infrastructure. We present the concept of a service-oriented medical device architecture (SOMDA) as well as an introduction to the technical specification implementing the SOMDA paradigm, currently being standardized within the IEEE 11073 service-oriented device connectivity (SDC) series. In addition, the Session concept is introduced as a key enabler for safe device interconnection in highly dynamic ensembles of networked medical devices; and finally, some security aspects of a SOMDA are discussed.

Board-to-board optical interconnection using novel optical plug and slot

NASA Astrophysics Data System (ADS)

Cho, In K.; Yoon, Keun Byoung; Ahn, Seong H.; Kim, Jin Tae; Lee, Woo Jin; Shin, Kyoung Up; Heo, Young Un; Park, Hyo Hoon

2004-10-01

A novel optical PCB with transmitter/receiver system boards and optical bakcplane was prepared, which is board-to-board interconnection by optical plug and slot. We report an 8Gb/s PRBS NRZ data transmission between transmitter system board and optical backplane embedded multimode polymeric waveguide arrays. The basic concept of ETRI's optical PCB is as follows; 1) Metal optical bench is integrated with optoelectronic devices, driver and receiver circuits, polymeric waveguide and access line PCB module. 2) Multimode polymeric waveguide inside an optical backplane, which is embedded into PCB. 3) Optical slot and plug for high-density(channel pitch : 500um) board-to-board interconnection. The polymeric waveguide technology can be used for transmission of data on transmitter/ receiver system boards and for backplane interconnections. The main components are low-loss tapered polymeric waveguides and a novel optical plug and slot for board-to-board interconnections, respectively. The optical PCB is characteristic of low coupling loss, easy insertion/extraction of the boards and, especially, reliable optical coupling unaffected from external environment after board insertion.

Data Communications and OSI.

ERIC Educational Resources Information Center

Denenberg, Ray

1990-01-01

Describes the layered model of Open Systems Interconnection (OSI); summarizes the three upper and lower layers; and discusses data communications standards associated with specific layers. Architectural concepts are explored, including hierarchy and abstraction, levels of dialogue, internetworking, and end-to-end communication. OSI is compared…

X.400: The Standard for Message Handling Systems.

ERIC Educational Resources Information Center

Swain, Leigh; Tallim, Paula

1990-01-01

Profiles X.400, the Open Systems Interconnection (OSI) Application layer standard that supports interpersonal electronic mail services, facsimile transfer, electronic data interchange, electronic funds transfer, electronic publishing, and electronic invoicing. Also discussed are an electronic directory to support message handling, compatibility…

Integration of micro-/nano-/quantum-scale photonic devices: scientific and technological considerations

NASA Astrophysics Data System (ADS)

Lee, El-Hang; Lee, Seung-Gol; O, Beom Hoan; Park, Se Geun

2004-08-01

Scientific and technological issues and considerations regarding the integration of miniaturized microphotonic devices, circuits and systems in micron, submicron, and quantum scale, are presented. First, we examine the issues regarding the miniaturization of photonic devices including the size effect, proximity effect, energy confinement effect, microcavity effect, optical and quantum interference effect, high field effect, nonlinear effect, noise effect, quantum optical effect, and chaotic effect. Secondly, we examine the issues regarding the interconnection including the optical alignment, minimizing the interconnection losses, and maintaining optical modes. Thirdly, we address the issues regarding the two-dimensional or three-dimensional integration either in a hybrid format or in a monolithic format between active devices and passive devices of varying functions. We find that the concept of optical printed circuit board (O-PCB) that we propose is highly attractive as a platform for micro/nano/quantum-scale photonic integration. We examine the technological issues to be addressed in the process of fabrication, characterization, and packaging for actual implementation of the miniaturization, interconnection and integration. Devices that we have used for our study include: mode conversion schemes, micro-ring and micro-racetrack resonator devices, multimode interference devices, lasers, vertical cavity surface emitting microlasers, and their arrays. Future prospects are also discussed.

Grain-size considerations for optoelectronic multistage interconnection networks.

PubMed

Krishnamoorthy, A V; Marchand, P J; Kiamilev, F E; Esener, S C

1992-09-10

This paper investigates, at the system level, the performance-cost trade-off between optical and electronic interconnects in an optoelectronic interconnection network. The specific system considered is a packet-switched, free-space optoelectronic shuffle-exchange multistage interconnection network (MIN). System bandwidth is used as the performance measure, while system area, system power, and system volume constitute the cost measures. A detailed design and analysis of a two-dimensional (2-D) optoelectronic shuffle-exchange routing network with variable grain size K is presented. The architecture permits the conventional 2 x 2 switches or grains to be generalized to larger K x K grain sizes by replacing optical interconnects with electronic wires without affecting the functionality of the system. Thus the system consists of log(k) N optoelectronic stages interconnected with free-space K-shuffles. When K = N, the MIN consists of a single electronic stage with optical input-output. The system design use an effi ient 2-D VLSI layout and a single diffractive optical element between stages to provide the 2-D K-shuffle interconnection. Results indicate that there is an optimum range of grain sizes that provides the best performance per cost. For the specific VLSI/GaAs multiple quantum well technology and system architecture considered, grain sizes larger than 256 x 256 result in a reduced performance, while grain sizes smaller than 16 x 16 have a high cost. For a network with 4096 channels, the useful range of grain sizes corresponds to approximately 250-400 electronic transistors per optical input-output channel. The effect of varying certain technology parameters such as the number of hologram phase levels, the modulator driving voltage, the minimum detectable power, and VLSI minimum feature size on the optimum grain-size system is studied. For instance, results show that using four phase levels for the interconnection hologram is a good compromise for the cost functions mentioned above. As VLSI minimum feature sizes decrease, the optimum grain size increases, whereas, if optical interconnect performance in terms of the detector power or modulator driving voltage requirements improves, the optimum grain size may be reduced. Finally, several architectural modifications to the system, such as K x K contention-free switches and sorting networks, are investigated and optimized for grain size. Results indicate that system bandwidth can be increased, but at the price of reduced performance/cost. The optoelectronic MIN architectures considered thus provide a broad range of performance/cost alternatives and offer a superior performance over purely electronic MIN's.

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

NASA Technical Reports Server (NTRS)

Ramesham, Rajeshuni; Ghaffarian, Reza; Shapiro, Andrew; Napala, Phil A.; Martin, Patrick A.

2005-01-01

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

The Perceptions of U.S.-Based IT Security Professionals about the Effectiveness of IT Security Frameworks: A Quantitative Study

ERIC Educational Resources Information Center

Warfield, Douglas L.

2011-01-01

The evolution of information technology has included new methodologies that use information technology to control and manage various industries and government activities. Information Technology has also evolved as its own industry with global networks of interconnectivity, such as the Internet, and frameworks, models, and methodologies to control…

NASA EEE Parts and Advanced Interconnect Program (AIP)

NASA Technical Reports Server (NTRS)

Gindorf, T.; Garrison, A.

1996-01-01

none given From Program Objectives: I. Accelerate the readiness of new technologies through development of validation, assessment and test method/tools II. Provide NASA Projects infusion paths for emerging technologies III. Provide NASA Projects technology selection, application and validation guidelines for harware and processes IV. Disseminate quality assurance, reliability, validation, tools and availability information to the NASA community.

STEM Comes to Preschool

ERIC Educational Resources Information Center

Moomaw, Sally; Davis, Jaumall A.

2010-01-01

Math and science and the related technology and engineering are natural pairings. These four disciplines form the acronym STEM (Science, Technology, Engineering, and Math) and can be readily combined into an integrated curriculum for early childhood classrooms. Many educators believe that children learn best when disciplines are interconnected. An…

MARC and Relational Databases.

ERIC Educational Resources Information Center

Llorens, Jose; Trenor, Asuncion

1993-01-01

Discusses the use of MARC format in relational databases and addresses problems of incompatibilities. A solution is presented that is in accordance with Open Systems Interconnection (OSI) standards and is based on experiences at the library of the Universidad Politecnica de Valencia (Spain). (four references) (EA)

OSI: Will It Ever See the Light of Day?

ERIC Educational Resources Information Center

Moloney, Peter

1997-01-01

Examines issues of viability and necessity regarding the Open System Interconnections (OSI) reference service model with a view on future developments. Discusses problems with the standards; conformance testing; OSI bureaucracy; standardized communications; security; the transport level; applications; the stakeholders (communications providers,…

32 x 16 CMOS smart pixel array for optical interconnects

NASA Astrophysics Data System (ADS)

Kim, Jongwoo; Guilfoyle, Peter S.; Stone, Richard V.; Hessenbruch, John M.; Choquette, Kent D.; Kiamilev, Fouad E.

2000-05-01

Free space optical interconnects can increase throughput capacities and eliminate much of the energy consumption required for `all electronic' systems. High speed optical interconnects can be achieved by integrating optoelectronic devices with conventional electronics. Smart pixel arrays have been developed which use optical interconnects. An individual smart pixel cell is composed of a vertical cavity surface emitting laser (VCSEL), a photodetector, an optical receiver, a laser driver, and digital logic circuitry. Oxide-confined VCSELs are being developed to operate at 850 nm with a threshold current of approximately 1 mA. Multiple quantum well photodetectors are being fabricated from AlGaAs for use with the 850 nm VCSELs. The VCSELs and photodetectors are being integrated with complementary metal oxide semiconductor (CMOS) circuitry using flip-chip bonding. CMOS circuitry is being integrated with a 32 X 16 smart pixel array. The 512 smart pixels are serially linked. Thus, an entire data stream may be clocked through the chip and output electrically by the last pixel. Electrical testing is being performed on the CMOS smart pixel array. Using an on-chip pseudo random number generator, a digital data sequence was cycled through the chip verifying operation of the digital circuitry. Although, the prototype chip was fabricated in 1.2 micrometers technology, simulations have demonstrated that the array can operate at 1 Gb/s per pixel using 0.5 micrometers technology.

Accelerated Metastable Solid-liquid Interdiffusion Bonding with High Thermal Stability and Power Handling

NASA Astrophysics Data System (ADS)

Huang, Ting-Chia; Smet, Vanessa; Kawamoto, Satomi; Pulugurtha, Markondeya R.; Tummala, Rao R.

2018-01-01

Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system integration with increasing performance and reliability requirements for off-chip interconnections. Solid-liquid interdiffusion (SLID) bonding resulting in all-intermetallic joints has been proposed to extend the applicability of solders, but faces fundamental and manufacturing challenges hindering its wide adoption. This paper introduces a Cu-Sn SLID interconnection technology, aiming at stabilization of the microstructure in the Cu6Sn5 metastable phase rather than the usual stable Cu3Sn phase. This enables formation of a void-free interface yielding higher mechanical strength than standard SLID bonding, as well as significantly reducing the transition time. The metastable SLID technology retains the benefits of standard SLID with superior I/O pitch scalability, thermal stability and current handling capability, while advancing assembly manufacturability. In the proposed concept, the interfacial reaction is controlled by introducing Ni(P) diffusion barrier layers, designed to effectively isolate the metastable Cu6Sn5 phase preventing any further transformation. Theoretical diffusion and kinetic models were applied to design the Ni-Cu-Sn interconnection stack to achieve the targeted joint composition. A daisy chain test vehicle was used to demonstrate this technology as a first proof of concept. Full transition to Cu6Sn5 was successfully achieved within a minute at 260°C as confirmed by scanning electron microscope (SEM) and x-ray energy dispersive spectroscopy (XEDS) analysis. The joint composition was stable through 10× reflow, with outstanding bond strength averaging 90 MPa. The metastable SLID interconnections also showed excellent electromigration performance, surviving 500 h of current stressing at 105 A/cm2 at 150°C.

Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.

PubMed

Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng

2018-08-01

In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

Towards a definition of life.

PubMed

Macklem, Peter T; Seely, Andrew

2010-01-01

This article offers a new definition of life as a "self-contained, self-regulating, self-organizing, self-reproducing, interconnected, open thermodynamic network of component parts which performs work, existing in a complex regime which combines stability and adaptability in the phase transition between order and chaos, as a plant, animal, fungus, or microbe." Open thermodynamic networks, which create and maintain order and are used by all organisms to perform work, import energy from and export entropy into the environment. Intra- and extracellular interconnected networks also confer order. Although life obeys the laws of physics and chemistry, the design of living organisms is not determined by these laws, but by Darwinian selection of the fittest designs. Over a short range of normalized energy consumption, open thermodynamic systems change from deeply ordered to chaotic, and life is found in this phase transition, where a dynamic balance between stability and adaptability allows for homeokinesis. Organisms and cells move within the phase transition with changes in metabolic rate. Seeds, spores and cryo-preserved tissue are well within the ordered regime, while health probably cannot be maintained with displacements into the chaotic regime. Understanding life in these terms may provide new insights into what constitutes health and lead to new theories of disease.

Pu Anion Exchange Process Intensification

DOE Office of Scientific and Technical Information (OSTI.GOV)

Taylor-Pashow, Kathryn M. L.

This research is focused on improving the efficiency of the anion exchange process for purifying plutonium. While initially focused on plutonium, the technology could also be applied to other ion-exchange processes. Work in FY17 focused on the improvement and optimization of porous foam columns that were initially developed in FY16. These foam columns were surface functionalized with poly(4-vinylpyridine) (PVP) to provide the Pu specific anion-exchange sites. Two different polymerization methods were explored for maximizing the surface functionalization with the PVP. The open-celled polymeric foams have large open pores and large surface areas available for sorption. The fluid passes through themore » large open pores of this material, allowing convection to be the dominant mechanism by which mass transport takes place. These materials generally have very low densities, open-celled structures with high cell interconnectivity, small cell sizes, uniform cell size distributions, and high structural integrity. These porous foam columns provide advantages over the typical porous resin beads by eliminating the slow diffusion through resin beads, making the anion-exchange sites easily accessible on the foam surfaces. The best performing samples exceeded the Pu capacity of the commercially available resin, and also offered the advantage of sharper elution profiles, resulting in a more concentrated product, with less loss of material to the dilute heads and tails cuts. An alternate approach to improving the efficiency of this process was also explored through the development of a microchannel array system for performing the anion exchange.« less

Manufacturability of the X Architecture at the 90-nm technology node

NASA Astrophysics Data System (ADS)

Smayling, Michael C.; Sarma, Robin C.; Nagata, Toshiyuki; Arora, Narain; Duane, Michael P.; Oemardani, Shiany; Shah, Santosh

2004-05-01

In this paper, we discuss the results from a test chip that demonstrate the manufacturability and integration-worthiness of the X Architecture at the 90-nm technology node. We discuss how a collaborative effort between the design and chip making communities used the current generation of mask, lithography, wafer processing, inspection and metrology equipment to create 45 degree wires in typical metal pitches for the upper layers on a 90-nm device in a production environment. Cadence Design Systems created the test structure design and chip validation tools for the project. Canon"s KrF ES3 and ArF AS2 scanners were used for the lithography. Applied Materials used its interconnect fabrication technologies to produce the multilayer copper, low-k interconnect on 300-mm wafers. The results were confirmed for critical dimension and defect levels using Applied Materials" wafer inspection and metrology systems.

A 30 GHz monolithic receive module technology assessment

NASA Technical Reports Server (NTRS)

Geddes, J.; Sokolov, V.; Bauhahn, P.; Contolatis, T.

1988-01-01

This report is a technology assessment relevant to the 30 GHz Monolithic Receive Module development. It is based on results obtained on the present NASA Contract (NAS3-23356) as well as on information gathered from literature and other industry sources. To date the on-going Honeywell program has concentrated on demonstrating the so-called interconnected receive module which consists of four monolithic chips - the low noise front-end amplifier (LNA), the five bit phase shifter (PS), the gain control amplifier (GC), and the RF to IF downconverter (RF/IF). Results on all four individual chips have been obtained and interconnection of the first three functions has been accomplished. Future work on this contract is aimed at a higher level of integration, i.e., integration of the first three functions (LNA + PS + GC) on a single GaAs chip. The report presents the status of this technology and projections of its future directions.

Emerging Communication Technologies (ECT) Phase 4 Report

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Marin, Jose A.; Nelson, Richard A.

2005-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Crew Exploration Vehicle (CEV), Advanced Range Technology Working Group (ARTWG), and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures on a 24/7 basis. ECT is a continuation of the Range Information System Management (RISM) task started in 2002. This is the fourth year of the project.

Low power laser driver design in 28nm CMOS for on-chip and chip-to-chip optical interconnect

NASA Astrophysics Data System (ADS)

Belfiore, Guido; Szilagyi, Laszlo; Henker, Ronny; Ellinger, Frank

2015-09-01

This paper discusses the challenges and the trade-offs in the design of laser drivers for very-short distance optical communications. A prototype integrated circuit is designed and fabricated in 28 nm super-low-power CMOS technology. The power consumption of the transmitter is 17.2 mW excluding the VCSEL that in our test has a DC power consumption of 10 mW. The active area of the driver is only 0.0045 mm2. The driver can achieve an error-free (BER < 10 -12) electrical data-rate of 25 Gbit/s using a pseudo random bit sequence of 27 -1. When the driver is connected to the VCSEL module an open optical eye is reported at 15 Gbit/s. In the tested bias point the VCSEL module has a measured bandwidth of 10.7 GHz.

GLOBECOM '84 - Global Telecommunications Conference, Atlanta, GA, November 26-29, 1984, Conference Record. Volume 1

NASA Astrophysics Data System (ADS)

The subjects discussed are related to LSI/VLSI based subscriber transmission and customer access for the Integrated Services Digital Network (ISDN), special applications of fiber optics, ISDN and competitive telecommunication services, technical preparations for the Geostationary-Satellite Orbit Conference, high-capacity statistical switching fabrics, networking and distributed systems software, adaptive arrays and cancelers, synchronization and tracking, speech processing, advances in communication terminals, full-color videotex, and a performance analysis of protocols. Advances in data communications are considered along with transmission network plans and progress, direct broadcast satellite systems, packet radio system aspects, radio-new and developing technologies and applications, the management of software quality, and Open Systems Interconnection (OSI) aspects of telematic services. Attention is given to personal computers and OSI, the role of software reliability measurement in information systems, and an active array antenna for the next-generation direct broadcast satellite.

High Resolution Fabrication of Interconnection Lines Using Picosecond Laser and Controlled Deposition of Gold Nanoparticles

NASA Astrophysics Data System (ADS)

Shahmoon, Asaf; Strauß, Johnnes; Zafri, Hadar; Schmidt, Michael; Zalevsky, Zeev

In this paper we present the fabrication procedure as well as the preliminary experimental results of a novel method for construction of high resolution nanometric interconnection lines. The fabrication procedure relies on a self-assembly process of gold nanoparticles at specific predetermined nanostructures. The nanostructures for the self-assembly process are based on the focused ion beam (FIB) or scanning electron beam (SEM) technology. The assembled nanoparticles are being illuminated using a picosecond laser with a wavelength of 532 nm. Different pulse energies have been investigated. The paper aimed at developing a novel and reliable process for fabrication of interconnection lines encompass three different disciplines, self-assembly of nanometric particles, optics and microelectronic.

Wearables and the Internet of Things for Health: Wearable, Interconnected Devices Promise More Efficient and Comprehensive Health Care.

PubMed

Metcalf, David; Milliard, Sharlin T J; Gomez, Melinda; Schwartz, Michael

2016-01-01

In our recent book Health-e Everything: Wearables and the Internet of Things for Health, we capture in an interactive e-book format some global thought-leader perspectives as well as early examples of case studies and novel innovations that are driving this emerging technology domain. Here, we provide a brief snapshot of key findings related to these novel technologies and use cases, which are driving both health care practitioners and health consumers (patients). As technologists, having a firm understanding of customer-driven innovation and the actual user benefits of interconnective devices for health will help us engineer better solutions that are more targeted to the triple aim of better, faster, and cheaper health solutions.

It Is Risky Business: Three Essays on Ensuring Reliability, Security and Privacy in Technology-Mediated Settings

ERIC Educational Resources Information Center

Anderson, Catherine L.

2010-01-01

Today's interconnected technical environment creates unprecedented opportunities while simultaneously introducing risks. With economic, social and personal interactions increasingly occurring in technology-mediated settings new vulnerabilities are continually being introduced. This dissertation seeks to improve extant understanding of how…

Network Framing of Pest Management Knowledge and Practice

ERIC Educational Resources Information Center

Moore, Keith M.

2008-01-01

Conventional technology transfer is based on the assumption that autonomous individuals independently make behavioral decisions. In contrast, Actor-Network Theory (ANT) suggests that people and technologies are interconnected in ways that reinforce and reproduce some types of knowledge and consequent behavioral practices, but not others. Research…

Supporting Teachers Learning through the Collaborative Design of Technology-Enhanced Science Lessons

ERIC Educational Resources Information Center

Kafyulilo, Ayoub C.; Fisser, Petra; Voogt, Joke

2015-01-01

This study used the Interconnected Model of Professional Growth (Clarke & Hollingsworth in "Teaching and Teacher Education," 18, 947-967, 2002) to unravel how science teachers' technology integration knowledge and skills developed in a professional development arrangement. The professional development arrangement used Technological…

76 FR 6775 - Combined Notice of Filings #1

Federal Register 2010, 2011, 2012, 2013, 2014

2011-02-08

... Services Corporation; Fowler Ridge II Wind Farm LLC. Description: Notice of Non-Material Change in Status... Open Access Transmission Tariff, a Small Generator Interconnection Agreement Facilities Maintenance..., Inc.; Atlantic Renewable Projects II LLC; Barton Windpower LLC; Big Horn Wind Project LLC; Big Horn II...

"Deviance, Selves and Others" Revisited.

ERIC Educational Resources Information Center

Stryker, Sheldon; Craft, Elizabeth A.

1982-01-01

Criticizes conceptual underpinnings of a 1970 study by Schwartz and Stryker. Proposes a framework more sensitive to interconnections between social structure and self-image and argues for a dimension of openness (to the impact of new relationships and experiences) that speaks to the modifiability of self-images. (CMG)

Robust Operation of Soft Open Points in Active Distribution Networks with High Penetration of Photovoltaic Integration

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ding, Fei; Ji, Haoran; Wang, Chengshan

Distributed generators (DGs) including photovoltaic panels (PVs) have been integrated dramatically in active distribution networks (ADNs). Due to the strong volatility and uncertainty, the high penetration of PV generation immensely exacerbates the conditions of voltage violation in ADNs. However, the emerging flexible interconnection technology based on soft open points (SOPs) provides increased controllability and flexibility to the system operation. For fully exploiting the regulation ability of SOPs to address the problems caused by PV, this paper proposes a robust optimization method to achieve the robust optimal operation of SOPs in ADNs. A two-stage adjustable robust optimization model is built tomore » tackle the uncertainties of PV outputs, in which robust operation strategies of SOPs are generated to eliminate the voltage violations and reduce the power losses of ADNs. A column-and-constraint generation (C&CG) algorithm is developed to solve the proposed robust optimization model, which are formulated as second-order cone program (SOCP) to facilitate the accuracy and computation efficiency. Case studies on the modified IEEE 33-node system and comparisons with the deterministic optimization approach are conducted to verify the effectiveness and robustness of the proposed method.« less

Optoelectronic Technology Consortium: Precompetitive Consortium for Optoelectronic Interconnect Technology

DTIC Science & Technology

1992-09-01

demonstrating the producibility of optoelectronic components for high-density/high-data-rate processors and accelerating the insertion of this technology...technology development stage, OETC will advance the development of optical components, produce links for a multiboard processor testbed demonstration, and...components that are affordable, initially at <$100 per line, and reliable, with a li~e BER᝺-15 and MTTF >10 6 hours. Under the OETC program, Honeywell will

Technique for Determination of Rational Boundaries in Combining Construction and Installation Processes Based on Quantitative Estimation of Technological Connections

NASA Astrophysics Data System (ADS)

Gusev, E. V.; Mukhametzyanov, Z. R.; Razyapov, R. V.

2017-11-01

The problems of the existing methods for the determination of combining and technologically interlinked construction processes and activities are considered under the modern construction conditions of various facilities. The necessity to identify common parameters that characterize the interaction nature of all the technology-related construction and installation processes and activities is shown. The research of the technologies of construction and installation processes for buildings and structures with the goal of determining a common parameter for evaluating the relationship between technologically interconnected processes and construction works are conducted. The result of this research was to identify the quantitative evaluation of interaction construction and installation processes and activities in a minimum technologically necessary volume of the previous process allowing one to plan and organize the execution of a subsequent technologically interconnected process. The quantitative evaluation is used as the basis for the calculation of the optimum range of the combination of processes and activities. The calculation method is based on the use of the graph theory. The authors applied a generic characterization parameter to reveal the technological links between construction and installation processes, and the proposed technique has adaptive properties which are key for wide use in organizational decisions forming. The article provides a written practical significance of the developed technique.

IR-drop analysis for validating power grids and standard cell architectures in sub-10nm node designs

NASA Astrophysics Data System (ADS)

Ban, Yongchan; Wang, Chenchen; Zeng, Jia; Kye, Jongwook

2017-03-01

Since chip performance and power are highly dependent on the operating voltage, the robust power distribution network (PDN) is of utmost importance in designs to provide with the reliable voltage without voltage (IR)-drop. However, rapid increase of parasitic resistance and capacitance (RC) in interconnects makes IR-drop much worse with technology scaling. This paper shows various IR-drop analyses in sub 10nm designs. The major objectives are to validate standard cell architectures, where different sizes of power/ground and metal tracks are validated, and to validate PDN architecture, where types of power hook-up approaches are evaluated with IR-drop calculation. To estimate IR-drops in 10nm and below technologies, we first prepare physically routed designs given standard cell libraries, where we use open RISC RTL, synthesize the CPU, and apply placement & routing with process-design kits (PDK). Then, static and dynamic IR-drop flows are set up with commercial tools. Using the IR-drop flow, we compare standard cell architectures, and analysis impacts on performance, power, and area (PPA) with the previous technology-node designs. With this IR-drop flow, we can optimize the best PDN structure against IR-drops as well as types of standard cell library.

Semiconductor lasers for versatile applications from global communications to on-chip interconnects

NASA Astrophysics Data System (ADS)

Arai, Shigehisa

2015-01-01

Since semiconductor lasers were realized in 1962, various efforts have been made to enrich human life thorough novel equipments and services. Among them optical fiber communications in global communications have brought out marvelous information technology age represented by the internet. In this paper, emerging topics made on GaInAsP/InP based long-wavelength lasers toward ultra-low power consumption semiconductor lasers for optical interconnects in supercomputers as well as in future LSIs are presented.

Development of low cost custom hybrid microcircuit technology

NASA Technical Reports Server (NTRS)

Perkins, K. L.; Licari, J. J.

1981-01-01

Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation.

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

A Course on Energy Technology and Policy

ERIC Educational Resources Information Center

Edgar, Thomas F.

2007-01-01

The emerging energy situation in the United States puts chemical engineering at the forefront of the large research and education effort that will need to be undertaken during the next 20 years. Chemical engineering undergraduates and graduate students will need to be literate on energy alternatives and the interconnection of technology,…

Embedded 100 Gbps Photonic Components

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kuznia, Charlie

This innovation to fiber optic component technology increases the performance, reduces the size and reduces the power consumption of optical communications within dense network systems, such as advanced distributed computing systems and data centers. VCSEL technology is enabling short-reach (< 100 m) and >100 Gbps optical interconnections over multi-mode fiber in commercial applications.

Multi-gigabit optical interconnects for next-generation on-board digital equipment

NASA Astrophysics Data System (ADS)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2017-11-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

Multi-gigabit optical interconnects for next-generation on-board digital equipment

NASA Astrophysics Data System (ADS)

Venet, Norbert; Favaro, Henri; Sotom, Michel; Maignan, Michel; Berthon, Jacques

2004-06-01

Parallel optical interconnects are experimentally assessed as a technology that may offer the high-throughput data communication capabilities required to the next-generation on-board digital processing units. An optical backplane interconnect was breadboarded, on the basis of a digital transparent processor that provides flexible connectivity and variable bandwidth in telecom missions with multi-beam antenna coverage. The unit selected for the demonstration required that more than tens of Gbit/s be supported by the backplane. The demonstration made use of commercial parallel optical link modules at 850 nm wavelength, with 12 channels running at up to 2.5 Gbit/s. A flexible optical fibre circuit was developed so as to route board-to-board connections. It was plugged to the optical transmitter and receiver modules through 12-fibre MPO connectors. BER below 10-14 and optical link budgets in excess of 12 dB were measured, which would enable to integrate broadcasting. Integration of the optical backplane interconnect was successfully demonstrated by validating the overall digital processor functionality.

Additive manufacturing and analysis of high frequency interconnects for microwave devices

NASA Astrophysics Data System (ADS)

Harper, Elicia K.

Wire bond interconnects have been the main approach to interconnecting microelectronic devices within a package. Conventional wirebonding however offers little control of the impedance of the interconnect and also introduces parasitic inductance that can degrade performance at microwave frequencies. The size and compactness of microchips is often an issue when it comes to attaching wirebonds to the microchip or other components within a microwave module. This work demonstrates the use of additive manufacturing for printing interconnects directly between bare die microchips and other components within a microwave module. A test structure was developed consisting of a GaAs microchip sandwiched between two alumina blocks patterned with coplanar waveguides (CPW). A printed dielectric ink is used to fill the gap between the alumina CPW blocks and the GaAs chip. Conductive interconnects are printed on top of the dielectric bridge material to connect the CPW traces to the bonding pads on the GaAs microchip. Simulations of these structures were modeled in the electromagnetics simulation tool by ANSYS, high frequency structure simulation (HFSS), to optimize the printed interconnects at 1-40 GHz (ANSYS Inc., Canonsburg, PA). The dielectric constant and loss tangent of the simulated dielectric was varied along with the dimensions of the conductive interconnects. The best combination of dielectric properties and interconnect dimensions was chosen for impedance matching by analyzing the insertion losses and return losses. A dielectric ink, which was chosen based on the simulated results, was experimentally printed between the two CPW blocks and the GaAs chip and subsequently cured. The conductive interconnects were then printed with an aerosol jet printer, connecting the CPW traces to the bonding pads on the GaAs microchip. The experimental prototype was then measured with a network analyzer and the measured data were compared to simulations. Results show good agreement between the simulated and measured S-parameters. This work demonstrates the potential for using additive manufacturing technology to create impedance- matched interconnects between high frequency ICs and other module components such as high frequency CPW transmission lines.

Energy Systems Integration News - September 2016 | Energy Systems

Science.gov Websites

, Smarter Grid Solutions demonstrated a new distributed energy resources (DER) software control platform utility interconnections require distributed generation (DG) devices to disconnect from the grid during OpenFMB distributed applications on the microgrid test site to locally optimize renewable energy resources

77 FR 24646 - Open Access and Priority Rights on Interconnection Facilities

Federal Register 2010, 2011, 2012, 2013, 2014

2012-04-25

... multiple generation facilities to transmit power from the generation facility to the integrated... power flows toward the network grid, with no electrical loads between the generation facilities and the... generator expansion plans with milestones for construction of generation facilities and can demonstrate that...

10 CFR 960.2 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-01-01

... which there is recurrent movement, which is usually indicated by small, periodic displacements or... of fluids, expressed as the ratio of the volume of interconnected pores and openings to the volume of... displacement of the side relative to one another parallel to the fracture or zone of fractures. Faulting means...

10 CFR 960.2 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-01-01

... which there is recurrent movement, which is usually indicated by small, periodic displacements or... of fluids, expressed as the ratio of the volume of interconnected pores and openings to the volume of... displacement of the side relative to one another parallel to the fracture or zone of fractures. Faulting means...

10 CFR 960.2 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-01-01

... which there is recurrent movement, which is usually indicated by small, periodic displacements or... of fluids, expressed as the ratio of the volume of interconnected pores and openings to the volume of... displacement of the side relative to one another parallel to the fracture or zone of fractures. Faulting means...

10 CFR 960.2 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-01-01

... which there is recurrent movement, which is usually indicated by small, periodic displacements or... of fluids, expressed as the ratio of the volume of interconnected pores and openings to the volume of... displacement of the side relative to one another parallel to the fracture or zone of fractures. Faulting means...

Chemistry without borders: An overview

USDA-ARS?s Scientific Manuscript database

As chemistry becomes more globalized, it is important for an organization to be interconnected and adaptable, and for an individual to keep up with changes and latest scientific findings and keep options open. Many of the challenges and the opportunities of globalization are in the areas of jobs, re...

White beam analysis of coupling between precipitation and plasticdeformation during electromigration in a passivated Al(0.5wt. percent Cu)interconnect

DOE Office of Scientific and Technical Information (OSTI.GOV)

Barabash, R.I.; Ice, G.E.; Tamura, N.

2005-09-01

The scaling of device dimensions with a simultaneous increase in functional density imposes a challenge to materials technology and reliability of interconnects. White beam X-ray microdiffraction is particularly well suited for the in situ study of electromigration. M.A. Krivoglaz theory was applied for the interpretation of white beam diffraction. The technique was used to probe microstructure in interconnects and has recently been able to monitor the onset of plastic deformation induced by mass transport during electromigration in Al(Cu) lines even before any macroscopic damage became visible. In the present paper, we demonstrate that the evolution of the dislocation structure duringmore » electromigration is highly inhomogeneous and results in the formation of unpaired randomly distributed geometrically necessary dislocations as well as geometrically necessary dislocation boundaries. When almost all unpaired dislocations and dislocation walls with the density n+ are parallel (as in the case of Al-based interconnects), the anisotropy in the scattering properties of the material becomes important, and the electrical properties of the interconnect depend strongly on the direction of the electric current relative to the orientation of the dislocation network. A coupling between the dissolution, growth and reprecipitation of Al2Cu precipitates and the electromigration-induced plastic deformation of grains in interconnects is observed.« less

Nano-Nucleation Characteristic of Cu-Ag Alloy Directly Electrodeposited on W Diffusion Barrier for Microelectronic Device Interconnect.

PubMed

Kim, Kang O; Kim, Sunjung

2016-05-01

Cu-Ag alloy interconnect is promising for ultra-large-scale integration (ULSI) microelectronic system of which device dimension keeps shrinking. In this study, seedless electrodeposition of Cu-Ag alloy directly on W diffusion barrier as interconnect technology is presented in respect of nano-nucleation control. Chemical equilibrium state of electrolyte was fundamentally investigated according to the pH of electrolyte because direct nano-nucleation of Cu-Ag alloy on W surface is challenging. Chelation behavior of Cu2+ and Ag+ ions with citrate (Cit) and ammonia ligands was dependent on the pH of electrolyte. The amount and kind of Cu- and Ag-based complexes determine the deposition rate, size, elemental composition, and surface morphology of Cu-Ag alloy nano-nuclei formed on W surface.

Micro-combs: A novel generation of optical sources

NASA Astrophysics Data System (ADS)

Pasquazi, Alessia; Peccianti, Marco; Razzari, Luca; Moss, David J.; Coen, Stéphane; Erkintalo, Miro; Chembo, Yanne K.; Hansson, Tobias; Wabnitz, Stefan; Del'Haye, Pascal; Xue, Xiaoxiao; Weiner, Andrew M.; Morandotti, Roberto

2018-01-01

The quest towards the integration of ultra-fast, high-precision optical clocks is reflected in the large number of high-impact papers on the topic published in the last few years. This interest has been catalysed by the impact that high-precision optical frequency combs (OFCs) have had on metrology and spectroscopy in the last decade [1-5]. OFCs are often referred to as optical rulers: their spectra consist of a precise sequence of discrete and equally-spaced spectral lines that represent precise marks in frequency. Their importance was recognised worldwide with the 2005 Nobel Prize being awarded to T.W. Hänsch and J. Hall for their breakthrough in OFC science [5]. They demonstrated that a coherent OFC source with a large spectrum - covering at least one octave - can be stabilised with a self-referenced approach, where the frequency and the phase do not vary and are completely determined by the source physical parameters. These fully stabilised OFCs solved the challenge of directly measuring optical frequencies and are now exploited as the most accurate time references available, ready to replace the current standard for time. Very recent advancements in the fabrication technology of optical micro-cavities [6] are contributing to the development of OFC sources. These efforts may open up the way to realise ultra-fast and stable optical clocks and pulsed sources with extremely high repetition-rates, in the form of compact and integrated devices. Indeed, the fabrication of high-quality factor (high-Q) micro-resonators, capable of dramatically amplifying the optical field, can be considered a photonics breakthrough that has boosted not only the scientific investigation of OFC sources [7-13] but also of optical sensors and compact light modulators [6,14]. In this framework, the demonstration of planar high-Q resonators, compatible with silicon technology [10-14], has opened up a unique opportunity for these devices to provide entirely new capabilities for photonic-integrated technologies. Indeed, it is well acknowledged by the electronics industry that future generations of computer processing chips will inevitably require an extremely high density of copper-based interconnections, significantly increasing the chip power dissipation to beyond practical levels [15-17]; hence, conventional approaches to chip design must undergo radical changes. On-chip optical networks, or optical interconnects, can offer high speed and low energy per-transferred-bit, and micro-resonators are widely seen as a key component to interface the electronic world with photonics. Many information technology industries have recently focused on the development of integrated ring resonators to be employed for electrically-controlled light modulators [14-17], greatly advancing the maturity of micro-resonator technology as a whole. Recently [11-13], the demonstration of OFC sources in micro-resonators fabricated in electronic (i.e. in complementary metal oxide semiconductor (CMOS)) compatible platforms has given micro-cavities an additional appeal, with the possibility of exploiting them as light sources in microchips. This scenario is creating fierce competition in developing highly efficient OFC generators based on micro-cavities which can radically change the nature of information transport and processing. Even in telecommunications, perhaps a more conventional environment for optical technologies, novel time-division multiplexed optical systems will require extremely stable optical clocks at ultra-high pulse repetition-rates towards the THz scale. Furthermore, arbitrary pulse generators based on OFC [18,19] are seen as one of the most promising solutions for this next generation of high-capacity optical coherent communication systems. This review will summarise the recent exciting achievements in the field of micro-combs, namely optical frequency combs based on high-Q micro-resonators, with a perspective on both the potential of this technology, as well as the open questions and challenges that remain.

Optimal condition sampling of infrastructure networks.

DOT National Transportation Integrated Search

2009-10-15

Transportation infrastructure systems consist of spatially extensive and longlived sets of interconnected : facilities. Over the past two decades, several new nondestructive inspection technologies have been : developed and applied in collectin...

Electricity exchange and the valuation of transnational transmission access: A case study of intra-regional integration of the electric industries of Argentina and Chile

NASA Astrophysics Data System (ADS)

Brereton, Beverly Ann

The interconnection of neighboring electricity networks provides opportunities for the realization of synergies between electricity systems. Examples of the synergies to be realized are the rationalized management of the electricity networks whose fuel source domination differs, and the exploitation of non-coincident system peak demands. These factors allow technology diversity in the satisfaction of electricity demand, the coordination of planning and maintenance schedules between the networks by exploiting the cost differences in the pool of generation assets and the load configuration differences in the neighboring locations. The interconnection decision studied in this dissertation focused on the electricity networks of Argentina and Chile whose electricity systems operate in isolation at the current time. The cooperative game-theoretic framework was applied in the analysis of the decision facing the two countries and the net surplus to be derived from interconnection was evaluated. Measurement of the net gains from interconnection used in this study were reflected in changes in generating costs under the assumption that demand is fixed under all scenarios. With the demand for electricity assumed perfectly inelastic, passive or aggressive bidding strategies were considered under the scenarios for the generators in the two countries. The interconnection decision was modeled using a linear power flow model which utilizes linear programming techniques to reflect dispatch procedures based on generation bids. Results of the study indicate that the current interconnection project between Argentina and Chile will not result in positive net surplus under a variety of scenarios. Only under significantly reduced interconnection cost will the venture prove attractive. Possible sharing mechanisms were also explored in the research and a symmetric distribution of the net surplus to be derived under the reduced interconnection cost scenario was recommended to preserve equity in the allocation of the interconnection gains.

Generational Theory: Implications for Recruiting the Millennials

DTIC Science & Technology

2006-03-10

basic forces of influence on an individual considering military service: Parents, technology , the New economy, education, and the media.72 Some of...affect this generation specifically. These five forces are all interconnected. For example, the rise in technology is driving the new economy...Parents are demanding more from education. Both technology and the new economy are requiring students who are better educated. And so on. When looking

Cu Pillar Low Temperature Bonding and Interconnection Technology of for 3D RF Microsystem

NASA Astrophysics Data System (ADS)

Shi, G. X.; Qian, K. Q.; Huang, M.; Yu, Y. W.; Zhu, J.

2018-03-01

In this paper 3D interconnects technologies used Cu pillars are discussed with respect to RF microsystem. While 2.5D Si interposer and 3D packaging seem to rely to cu pillars for the coming years, RF microsystem used the heterogeneous chip such as GaAs integration with Si interposers should be at low temperature. The pillars were constituted by Cu (2 micron) -Ni (2 micron) -Cu (3 micron) -Sn (1 micron) multilayer metal and total height is 8 micron on the front-side of the wafer by using electroplating. The wafer backside Cu pillar is obtained by temporary bonding, thinning and silicon surface etching. The RF interposers are stacked by Cu-Sn eutectic bonding at 260 °C. Analyzed the reliability of different pillar bonding structure.

3D interconnect metrology in CMS/ITRI

NASA Astrophysics Data System (ADS)

Ku, Y. S.; Shyu, D. M.; Hsu, W. T.; Chang, P. Y.; Chen, Y. C.; Pang, H. L.

2011-05-01

Semiconductor device packaging technology is rapidly advancing, in response to the demand for thinner and smaller electronic devices. Three-dimensional chip/wafer stacking that uses through-silicon vias (TSV) is a key technical focus area, and the continuous development of this novel technology has created a need for non-contact characterization. Many of these challenges are novel to the industry due to the relatively large variety of via sizes and density, and new processes such as wafer thinning and stacked wafer bonding. This paper summarizes the developing metrology that has been used during via-middle & via-last TSV process development at EOL/ITRI. While there is a variety of metrology and inspection applications for 3D interconnect processing, the main topics covered here are via CD/depth measurement, thinned wafer inspection and wafer warpage measurement.

Polymer waveguides for electro-optical integration in data centers and high-performance computers.

PubMed

Dangel, Roger; Hofrichter, Jens; Horst, Folkert; Jubin, Daniel; La Porta, Antonio; Meier, Norbert; Soganci, Ibrahim Murat; Weiss, Jonas; Offrein, Bert Jan

2015-02-23

To satisfy the intra- and inter-system bandwidth requirements of future data centers and high-performance computers, low-cost low-power high-throughput optical interconnects will become a key enabling technology. To tightly integrate optics with the computing hardware, particularly in the context of CMOS-compatible silicon photonics, optical printed circuit boards using polymer waveguides are considered as a formidable platform. IBM Research has already demonstrated the essential silicon photonics and interconnection building blocks. A remaining challenge is electro-optical packaging, i.e., the connection of the silicon photonics chips with the system. In this paper, we present a new single-mode polymer waveguide technology and a scalable method for building the optical interface between silicon photonics chips and single-mode polymer waveguides.

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

2016-01-01

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over 1-m scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Chen, Liang-Yu; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.; Krasowski, Michael J.; Prokop, Norman F.

2016-01-01

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over approximately 1-micrometer scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

Strategic siting and regional grid interconnections key to low-carbon futures in African countries

PubMed Central

Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M.; Callaway, Duncan S.

2017-01-01

Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental–impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation. PMID:28348209

Strategic siting and regional grid interconnections key to low-carbon futures in African countries

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wu, Grace C.; Deshmukh, Ranjit; Ndhlukula, Kudakwashe

2017-03-27

Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental– impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quicklymore » served with “no-regrets” options—or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6–20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. In conclusion, the overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.« less

Strategic siting and regional grid interconnections key to low-carbon futures in African countries.

PubMed

Wu, Grace C; Deshmukh, Ranjit; Ndhlukula, Kudakwashe; Radojicic, Tijana; Reilly-Moman, Jessica; Phadke, Amol; Kammen, Daniel M; Callaway, Duncan S

2017-04-11

Recent forecasts suggest that African countries must triple their current electricity generation by 2030. Our multicriteria assessment of wind and solar potential for large regions of Africa shows how economically competitive and low-environmental-impact renewable resources can significantly contribute to meeting this demand. We created the Multicriteria Analysis for Planning Renewable Energy (MapRE) framework to map and characterize solar and wind energy zones in 21 countries in the Southern African Power Pool (SAPP) and the Eastern Africa Power Pool (EAPP) and find that potential is several times greater than demand in many countries. Significant fractions of demand can be quickly served with "no-regrets" options-or zones that are low-cost, low-environmental impact, and highly accessible. Because no-regrets options are spatially heterogeneous, international interconnections are necessary to help achieve low-carbon development for the region as a whole, and interconnections that support the best renewable options may differ from those planned for hydropower expansion. Additionally, interconnections and selecting wind sites to match demand reduce the need for SAPP-wide conventional generation capacity by 9.5% in a high-wind scenario, resulting in a 6-20% cost savings, depending on the avoided conventional technology. Strategic selection of low-impact and accessible zones is more cost effective with interconnections compared with solutions without interconnections. Overall results are robust to multiple load growth scenarios. Together, results show that multicriteria site selection and deliberate planning of interconnections may significantly increase the economic and environmental competitiveness of renewable alternatives relative to conventional generation.

Air Force Research Initiation Program 1986 Technical Report Volume 1

DTIC Science & Technology

1988-04-01

inaccuracy of meteoroligical measurements. For the convenience of this study, the first two oi these will be further grouped together as ’ modelO ...communication protocol is a set of rules governing the exchange of data between entities forming the network, and is the focus of this research. 1.2.1 The OSI ...This model, termed Open Systems Interconnection ( OSI ), presents standards for the exchange of information among systems that are "open" to one 25-5

78 FR 28218 - Sunshine Act Meeting; Deletion of Agenda Item From May 9, 2013 Open Meeting

Federal Register 2010, 2011, 2012, 2013, 2014

2013-05-14

... TITLE: Facilitating HOMELAND the Deployment of SECURITY. Text-to-911 and Other Next Generation 911... Commission will consider a Report and Order requiring CMRS providers and providers of interconnected text... text 911 where that capability is unavailable. Federal Communications Commission. Marlene H. Dortch...

78 FR 39617 - Data Practices, Computer III Further Remand: BOC Provision of Enhanced Services

Federal Register 2010, 2011, 2012, 2013, 2014

2013-07-02

... Docket No. 10-132; FCC 13-69] Data Practices, Computer III Further Remand: BOC Provision of Enhanced... eliminates comparably efficient interconnection (CEI) and open network architecture (ONA) narrowband... disseminates data, including by altering or eliminating collections that are no longer useful or necessary to...

29 CFR 1915.163 - Ship's piping systems.

Code of Federal Regulations, 2010 CFR

2010-07-01

... are taken: (1) The isolation and shutoff valves connecting the dead system with the live system or.... Where valves are welded instead of bolted at least two isolation and shutoff valves connecting the dead... atmosphere on all of the dead interconnecting systems shall be opened for visual observation of drainage. [47...

29 CFR 1915.163 - Ship's piping systems.

Code of Federal Regulations, 2011 CFR

2011-07-01

... are taken: (1) The isolation and shutoff valves connecting the dead system with the live system or.... Where valves are welded instead of bolted at least two isolation and shutoff valves connecting the dead... atmosphere on all of the dead interconnecting systems shall be opened for visual observation of drainage. [47...

29 CFR 1915.163 - Ship's piping systems.

Code of Federal Regulations, 2013 CFR

2013-07-01

... are taken: (1) The isolation and shutoff valves connecting the dead system with the live system or... welded instead of bolted, at least two isolation and shutoff valves connecting the dead system with the...) Drain connections to the atmosphere on all of the dead interconnecting systems shall be opened for...

29 CFR 1915.163 - Ship's piping systems.

Code of Federal Regulations, 2014 CFR

2014-07-01

... are taken: (1) The isolation and shutoff valves connecting the dead system with the live system or... welded instead of bolted, at least two isolation and shutoff valves connecting the dead system with the...) Drain connections to the atmosphere on all of the dead interconnecting systems shall be opened for...

29 CFR 1915.163 - Ship's piping systems.

Code of Federal Regulations, 2012 CFR

2012-07-01

... are taken: (1) The isolation and shutoff valves connecting the dead system with the live system or... welded instead of bolted, at least two isolation and shutoff valves connecting the dead system with the...) Drain connections to the atmosphere on all of the dead interconnecting systems shall be opened for...

How a clogged canal impacts ecological health in a tropical urban wetland ecosystem

EPA Science Inventory

The coastal city of San Juan, Puerto Rico is a tropical urban ecosystem interwoven among a series of interconnected bays, lagoons, canals, and mangrove wetlands. As the city has expanded, infilling and urban encroachment on what was previously mangrove wetland and open estuarine ...

X-ray source safety shutter

DOEpatents

Robinet, McLouis

1977-05-31

An apparatus is provided for controlling the activation of a high energy radiation source having a shutter. The apparatus includes magnets and magnetically responsive switches appropriately placed and interconnected so that only with the shutter and other parts of the source in proper position can safe emission of radiation out an open shutter occur.

How a clogged canal effects ecological and human health in a tropical urban wetland ecosystem

EPA Science Inventory

The coastal city of San Juan, Puerto Rico is a tropical urban ecosystem interwoven among a series of interconnected bays, lagoons, canals, and mangrove wetlands. As the city has expanded, infilling and urban encroachment on what was previously mangrove wetland and open estuarine ...

Probabilistic immortality of Cu damascene interconnects

NASA Astrophysics Data System (ADS)

Hau-Riege, Stefan P.

2002-02-01

We have studied electromigration short-line effects in Cu damascene interconnects through experiments on lines of various lengths L, stressed at a variety of current densities j, and embedded in different dielectric materials. We observed two modes of resistance evolution: Either the resistance of the lines remains constant for the duration of the test, so that the lines are considered immortal, or the lines fail due to abrupt open-circuit failure. The resistance was not observed to gradually increase and then saturate, as commonly observed in Al-based interconnects, because the barrier is too thin and resistive to serve as a redundant current path should voiding occur. The critical stress for void nucleation was found to be smaller than 41 MPa, since voiding occurred even under the mildest test conditions of j=2 MA/cm2 and L=10.5 μm at 300 °C. A small fraction of short Cu lines failed even at low current densities, which deems necessary a concept of probabilistic immortality rather than deterministic immortality. Experiments and modeling suggest that the probability of immortality is described by (jL2/B), where B is the effective elastic modulus of the metallization scheme. By contrast, the immortality of Al-based interconnects with shunt layers is described by (jL) if no voids nucleate, and (jL/B) if voids do nucleate. Even though the phenomenology of short-line effects differs for Al- and Cu-based interconnects, the immortality of interconnects of either materials system can be explained by the phenomena of nucleation barriers for void formation and void-growth saturation. The differences are due solely to the absence of a shunt layer and the low critical stress for void nucleation in the case of Cu.

Thermal conductivity on stud bump interconnection of high power COB LED

NASA Astrophysics Data System (ADS)

Sarukunaselan, K.; Ong, N. R.; Sauli, Z.; Mahmed, N.; Kirtsaeng, S.; Sakuntasathien, S.; Suppiah, S.; Alcain, J. B.; Retnasamy, V.

2017-09-01

In this paper, the impacts of bump dimensions and material conductivity on the thermal performances of a high power chip on board (COB) LED package were investigated using open source software, Elmer. The stud bump acted as interconnection join which has an extra role in dissipating heat generated by the chip to the ambience. Simulation data showed that for a bump with a fixed contact length of 1mm, the most suitable height was 171 µm with material conductivity of 238W/mK or 319W/mK. Materials with thermal conductivity of lower than 20W/mK, had the poorest heat dissipation irrespective of the height.

Combination nickel foam expanded nickel screen electrical connection supports for solid oxide fuel cells

DOEpatents

Draper, Robert; Prevish, Thomas; Bronson, Angela; George, Raymond A.

2007-01-02

A solid oxide fuel assembly is made, wherein rows (14, 25) of fuel cells (17, 19, 21, 27, 29, 31), each having an outer interconnection (20) and an outer electrode (32), are disposed next to each other with corrugated, electrically conducting expanded metal mesh member (22) between each row of cells, the corrugated mesh (22) having top crown portions and bottom portions, where the top crown portion (40) have a top bonded open cell nickel foam (51) which contacts outer interconnections (20) of the fuel cells, said mesh and nickel foam electrically connecting each row of fuel cells, and where there are no more metal felt connections between any fuel cells.

Immortality of Cu damascene interconnects

NASA Astrophysics Data System (ADS)

Hau-Riege, Stefan P.

2002-04-01

We have studied short-line effects in fully-integrated Cu damascene interconnects through electromigration experiments on lines of various lengths and embedded in different dielectric materials. We compare these results with results from analogous experiments on subtractively-etched Al-based interconnects. It is known that Al-based interconnects exhibit three different behaviors, depending on the magnitude of the product of current density, j, and line length, L: For small values of (jL), no void nucleation occurs, and the line is immortal. For intermediate values, voids nucleate, but the line does not fail because the current can flow through the higher-resistivity refractory-metal-based shunt layers. Here, the resistance of the line increases but eventually saturates, and the relative resistance increase is proportional to (jL/B), where B is the effective elastic modulus of the metallization system. For large values of (jL/B), voiding leads to an unacceptably high resistance increase, and the line is considered failed. By contrast, we observed only two regimes for Cu-based interconnects: Either the resistance of the line stays constant during the duration of the experiment, and the line is considered immortal, or the line fails due to an abrupt open-circuit failure. The absence of an intermediate regime in which the resistance saturates is due to the absence of a shunt layer that is able to support a large amount of current once voiding occurs. Since voids nucleate much more easily in Cu- than in Al-based interconnects, a small fraction of short Cu lines fails even at low current densities. It is therefore more appropriate to consider the probability of immortality in the case of Cu rather than assuming a sharp boundary between mortality and immortality. The probability of immortality decreases with increasing amount of material depleted from the cathode, which is proportional to (jL2/B) at steady state. By contrast, the immortality of Al-based interconnects is described by (jL) if no voids nucleate, and (jL/B) if voids nucleate.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liss, W.; Dybel, M.; West, R.

This report covers the first year's work performed by the Gas Technology Institute and Encorp Inc. under subcontract to the National Renewable Energy Laboratory. The objective of this three-year contract is to develop innovative grid interconnection and control systems. This supports the advancement of distributed generation in the marketplace by making installations more cost-effective and compatible across the electric power and energy management systems. Specifically, the goals are: (1) To develop and demonstrate cost-effective distributed power grid interconnection products and software and communication solutions applicable to improving the economics of a broad range of distributed power systems, including existing, emerging,more » and other power generation technologies. (2) To enhance the features and capabilities of distributed power products to integrate, interact, and provide operational benefits to the electric power and advanced energy management systems. This includes features and capabilities for participating in resource planning, the provision of ancillary services, and energy management. Specific topics of this report include the development of an advanced controller, a power sensing board, expanded communication capabilities, a revenue-grade meter interface, and a case study of an interconnection distributed power system application that is a model for demonstrating the functionalities of the design of the advanced controller.« less

Implementation and Integration of Regional Health Care Data Networks in the Hellenic National Health Service

PubMed Central

Vidalis, Ioannis; Papanikolaou, Christos; Vagelatos, Aristides

2002-01-01

Background Modern health care is provided with close cooperation among many different institutions and professionals, using their specialized expertise in a common effort to deliver best-quality and, at the same time, cost-effective services. Within this context of the growing need for information exchange, the demand for realization of data networks interconnecting various health care institutions at a regional level, as well as a national level, has become a practical necessity. Objectives To present the technical solution that is under consideration for implementing and interconnecting regional health care data networks in the Hellenic National Health System. Methods The most critical requirements for deploying such a regional health care data network were identified as: fast implementation, security, quality of service, availability, performance, and technical support. Results The solution proposed is the use of proper virtual private network technologies for implementing functionally-interconnected regional health care data networks. Conclusions The regional health care data network is considered to be a critical infrastructure for further development and penetration of information and communication technologies in the Hellenic National Health System. Therefore, a technical approach was planned, in order to have a fast cost-effective implementation, conforming to certain specifications. PMID:12554551

Implementation and integration of regional health care data networks in the Hellenic National Health Service.

PubMed

Lampsas, Petros; Vidalis, Ioannis; Papanikolaou, Christos; Vagelatos, Aristides

2002-12-01

Modern health care is provided with close cooperation among many different institutions and professionals, using their specialized expertise in a common effort to deliver best-quality and, at the same time, cost-effective services. Within this context of the growing need for information exchange, the demand for realization of data networks interconnecting various health care institutions at a regional level, as well as a national level, has become a practical necessity. To present the technical solution that is under consideration for implementing and interconnecting regional health care data networks in the Hellenic National Health System. The most critical requirements for deploying such a regional health care data network were identified as: fast implementation, security, quality of service, availability, performance, and technical support. The solution proposed is the use of proper virtual private network technologies for implementing functionally-interconnected regional health care data networks. The regional health care data network is considered to be a critical infrastructure for further development and penetration of information and communication technologies in the Hellenic National Health System. Therefore, a technical approach was planned, in order to have a fast cost-effective implementation, conforming to certain specifications.

Integrated Avionics System (IAS), Integrating 3-D Technology On A Spacecraft Panel

NASA Technical Reports Server (NTRS)

Hunter, Don J.; Halpert, Gerald

1999-01-01

As spacecraft designs converge toward miniaturization, and with the volumetric and mass challenges placed on avionics, programs will continue to advance the "state of the art" in spacecraft system development with new challenges to reduce power, mass and volume. Traditionally, the trend is to focus on high-density 3-D packaging technologies. Industry has made significant progress in 3-D technologies, and other related internal and external interconnection schemes. Although new technologies have improved packaging densities, a system packaging architecture is required that not only reduces spacecraft volume and mass budgets, but increase integration efficiencies, provide modularity and flexibility to accommodate multiple missions while maintaining a low recurring cost. With these challenges in mind, a novel system packaging approach incorporates solutions that provide broader environmental applications, more flexible system interconnectivity, scalability, and simplified assembly test and integration schemes. The Integrated Avionics System (IAS) provides for a low-mass, modular distributed or centralized packaging architecture which combines ridged-flex technologies, high-density COTS hardware and a new 3-D mechanical packaging approach, Horizontal Mounted Cube (HMC). This paper will describe the fundamental elements of the IAS, HMC hardware design, system integration and environmental test results.

From WSN towards WoT: Open API Scheme Based on oneM2M Platforms.

PubMed

Kim, Jaeho; Choi, Sung-Chan; Ahn, Il-Yeup; Sung, Nak-Myoung; Yun, Jaeseok

2016-10-06

Conventional computing systems have been able to be integrated into daily objects and connected to each other due to advances in computing and network technologies, such as wireless sensor networks (WSNs), forming a global network infrastructure, called the Internet of Things (IoT). To support the interconnection and interoperability between heterogeneous IoT systems, the availability of standardized, open application programming interfaces (APIs) is one of the key features of common software platforms for IoT devices, gateways, and servers. In this paper, we present a standardized way of extending previously-existing WSNs towards IoT systems, building the world of the Web of Things (WoT). Based on the oneM2M software platforms developed in the previous project, we introduce a well-designed open API scheme and device-specific thing adaptation software (TAS) enabling WSN elements, such as a wireless sensor node, to be accessed in a standardized way on a global scale. Three pilot services are implemented (i.e., a WiFi-enabled smart flowerpot, voice-based control for ZigBee-connected home appliances, and WiFi-connected AR.Drone control) to demonstrate the practical usability of the open API scheme and TAS modules. Full details on the method of integrating WSN elements into three example systems are described at the programming code level, which is expected to help future researchers in integrating their WSN systems in IoT platforms, such as oneM2M. We hope that the flexibly-deployable, easily-reusable common open API scheme and TAS-based integration method working with the oneM2M platforms will help the conventional WSNs in diverse industries evolve into the emerging WoT solutions.

From WSN towards WoT: Open API Scheme Based on oneM2M Platforms

PubMed Central

Kim, Jaeho; Choi, Sung-Chan; Ahn, Il-Yeup; Sung, Nak-Myoung; Yun, Jaeseok

2016-01-01

Conventional computing systems have been able to be integrated into daily objects and connected to each other due to advances in computing and network technologies, such as wireless sensor networks (WSNs), forming a global network infrastructure, called the Internet of Things (IoT). To support the interconnection and interoperability between heterogeneous IoT systems, the availability of standardized, open application programming interfaces (APIs) is one of the key features of common software platforms for IoT devices, gateways, and servers. In this paper, we present a standardized way of extending previously-existing WSNs towards IoT systems, building the world of the Web of Things (WoT). Based on the oneM2M software platforms developed in the previous project, we introduce a well-designed open API scheme and device-specific thing adaptation software (TAS) enabling WSN elements, such as a wireless sensor node, to be accessed in a standardized way on a global scale. Three pilot services are implemented (i.e., a WiFi-enabled smart flowerpot, voice-based control for ZigBee-connected home appliances, and WiFi-connected AR.Drone control) to demonstrate the practical usability of the open API scheme and TAS modules. Full details on the method of integrating WSN elements into three example systems are described at the programming code level, which is expected to help future researchers in integrating their WSN systems in IoT platforms, such as oneM2M. We hope that the flexibly-deployable, easily-reusable common open API scheme and TAS-based integration method working with the oneM2M platforms will help the conventional WSNs in diverse industries evolve into the emerging WoT solutions. PMID:27782058

Meeting at the crossroads: collaboration between information technology departments and health sciences libraries

PubMed Central

King, Samuel; Cataldi-Roberts, Erica; Wentz, Erin

2017-01-01

Objective The purposes of this survey were to determine the nature and extent of collaboration between health sciences libraries and their information technology (IT) departments, to identify strengths and issues connected to this relationship, and to provide examples demonstrating exceptional collaborative success. Methods A fourteen-question survey was sent to a broad selection of health care and academic libraries through a variety of email discussion lists and was limited to one response per institution. Convenience sampling was used to collect the responses. Results An overwhelming majority of libraries described the relationship with their IT departments as good or excellent, and there were a variety of creative joint initiatives underway. Opportunities exist for continued and expanded library/IT collaboration. Conclusions Good quality relationships between libraries and their IT departments are essential due to the interconnected nature of their services, and fortunately, this appears to be the norm at a variety of institutions. Mutual respect, open communication, realization of each department’s mission, and responsiveness to each other’s needs are part of what makes these relationships successful, which in turn leads to successful collaborative ventures that bode well for the future of both services. PMID:28096743

Meeting at the crossroads: collaboration between information technology departments and health sciences libraries.

PubMed

King, Samuel; Cataldi-Roberts, Erica; Wentz, Erin

2017-01-01

The purposes of this survey were to determine the nature and extent of collaboration between health sciences libraries and their information technology (IT) departments, to identify strengths and issues connected to this relationship, and to provide examples demonstrating exceptional collaborative success. A fourteen-question survey was sent to a broad selection of health care and academic libraries through a variety of email discussion lists and was limited to one response per institution. Convenience sampling was used to collect the responses. An overwhelming majority of libraries described the relationship with their IT departments as good or excellent, and there were a variety of creative joint initiatives underway. Opportunities exist for continued and expanded library/IT collaboration. Good quality relationships between libraries and their IT departments are essential due to the interconnected nature of their services, and fortunately, this appears to be the norm at a variety of institutions. Mutual respect, open communication, realization of each department's mission, and responsiveness to each other's needs are part of what makes these relationships successful, which in turn leads to successful collaborative ventures that bode well for the future of both services.

Advanced optical network architecture for integrated digital avionics

NASA Astrophysics Data System (ADS)

Morgan, D. Reed

1996-12-01

For the first time in the history of avionics, the network designer now has a choice in selecting the media that interconnects the sources and sinks of digital data on aircraft. Electrical designs are already giving way to photonics in application areas where the data rate times distance product is large or where special design requirements such as low weight or EMI considerations are critical. Future digital avionic architectures will increasingly favor the use of photonic interconnects as network data rates of one gigabit/second and higher are needed to support real-time operation of high-speed integrated digital processing. As the cost of optical network building blocks is reduced and as temperature-rugged laser sources are matured, metal interconnects will be forced to retreat to applications spanning shorter and shorter distances. Although the trend is already underway, the widespread use of digital optics will first occur at the system level, where gigabit/second, real-time interconnects between sensors, processors, mass memories and displays separated by a least of few meters will be required. The application of photonic interconnects for inter-printed wiring board signalling across the backplane will eventually find application for gigabit/second applications since signal degradation over copper traces occurs before one gigabit/second and 0.5 meters are reached. For the foreseeable future however, metal interconnects will continue to be used to interconnect devices on printed wiring boards since 5 gigabit/second signals can be sent over metal up to around 15 centimeters. Current-day applications of optical interconnects at the system level are described and a projection of how advanced optical interconnect technology will be driven by the use of high speed integrated digital processing on future aircraft is presented. The recommended advanced network for application in the 2010 time frame is a fiber-based system with a signalling speed of around 2-3 gigabits per second. This switch-based unified network will interconnect sensors, displays, mass memory and controls and displays to computer modules within the processing complex. The characteristics of required building blocks needed for the future are described. These building blocks include the fiber, an optical switch, a laser-based transceiver, blind-mate connectors and an optical backplane.

High density circuit technology, part 1

NASA Technical Reports Server (NTRS)

Wade, T. E.

1982-01-01

The metal (or dielectric) lift-off processes used in the semiconductor industry to fabricate high density very large scale integration (VLSI) systems were reviewed. The lift-off process consists of depositing the light-sensitive material onto the wafer and patterning first in such a manner as to form a stencil for the interconnection material. Then the interconnection layer is deposited and unwanted areas are lifted off by removing the underlying stencil. Several of these lift-off techniques were examined experimentally. The use of an auxiliary layer of polyimide to form a lift-off stencil offers considerable promise.

Technology achievements and projections for communication satellites of the future

NASA Technical Reports Server (NTRS)

Bagwell, J. W.

1986-01-01

Multibeam systems of the future using monolithic microwave integrated circuits to provide phase control and power gain are contrasted with discrete microwave power amplifiers from 10 to 75 W and their associated waveguide feeds, phase shifters and power splitters. Challenging new enabling technology areas include advanced electrooptical control and signal feeds. Large scale MMIC's will be used incorporating on chip control interfaces, latching, and phase and amplitude control with power levels of a few watts each. Beam forming algorithms for 80 to 90 deg. wide angle scanning and precise beam forming under wide ranging environments will be required. Satelllite systems using these dynamically reconfigured multibeam antenna systems will demand greater degrees of beam interconnectivity. Multiband and multiservice users will be interconnected through the same space platform. Monolithic switching arrays operating over a wide range of RF and IF frequencies are contrasted with current IF switch technology implemented discretely. Size, weight, and performance improvements by an order of magnitude are projected.

Generic three-dimensional wavelength routers based on cross connects of multilayer diffractive elements

NASA Astrophysics Data System (ADS)

Deng, Xuegong; Chen, Ray T.

2001-05-01

We report a generic method to construct 3D wavelength routers by adapting a novel design for multi-optical wavelength interconnects (MOWI's). Optical wavelength- selective (WS) interconnections are realized by resorting to layered diffractive phase elements. Besides, we simultaneously carry out several other integrated operations on the incident beams according to their wavelengths. We demonstrate an 4 X 4 inline 3D WS optical crossconnect and a 1D 1 X 8 WS perfect shuffler. The devices are well feasible for mass production by using current standard microelectronics technologies. It is plausible that the proposed WS MOWI scenario will find critical applications in module-to-module and board-to-board optical interconnect systems, as well as in other devices for short-link multi- wavelength networks that would benefit from function integration.

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

NASA Technical Reports Server (NTRS)

Peckinpaugh, C. J.

1974-01-01

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David E.; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as a means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper provides definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies are discussed.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

Highly Efficient Perovskite Solar Modules by Scalable Fabrication and Interconnection Optimization

DOE PAGES

Yang, Mengjin; Kim, Dong Hoe; Klein, Talysa R.; ...

2018-01-02

To push perovskite solar cell (PSC) technology toward practical applications, large-area perovskite solar modules with multiple subcells need to be developed by fully scalable deposition approaches. Here, we demonstrate a deposition scheme for perovskite module fabrication with spray coating of a TiO2 electron transport layer (ETL) and blade coating of both a perovskite absorber layer and a spiro-OMeTAD-based hole transport layer (HTL). The TiO2 ETL remaining in the interconnection between subcells significantly affects the module performance. Reducing the TiO2 thickness changes the interconnection contact from a Schottky diode to ohmic behavior. Owing to interconnection resistance reduction, the perovskite modules withmore » a 10 nm TiO2 layer show enhanced performance mainly associated with an improved fill factor. Finally, we demonstrate a four-cell MA0.7FA0.3PbI3 perovskite module with a stabilized power conversion efficiency (PCE) of 15.6% measured from an aperture area of ~10.36 cm2, corresponding to an active-area module PCE of 17.9% with a geometric fill factor of ~87.3%.« less

Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface under temperature gradient

NASA Astrophysics Data System (ADS)

Zhong, Y.; Zhao, N.; Liu, C. Y.; Dong, W.; Qiao, Y. Y.; Wang, Y. P.; Ma, H. T.

2017-11-01

As the diameter of solder interconnects in three-dimensional integrated circuits (3D ICs) downsizes to several microns, how to achieve a uniform microstructure with thousands of interconnects on stacking chips becomes a critical issue in 3D IC manufacturing. We report a promising way for fabricating fully intermetallic interconnects with a regular grain morphology and a strong texture feature by soldering single crystal (111) Cu/Sn/polycrystalline Cu interconnects under the temperature gradient. Continuous epitaxial growth of η-Cu6Sn5 at cold end liquid-Sn/(111)Cu interfaces has been demonstrated. The resultant η-Cu6Sn5 grains show faceted prism textures with an intersecting angle of 60° and highly preferred orientation with their ⟨ 11 2 ¯ 0 ⟩ directions nearly paralleling to the direction of the temperature gradient. These desirable textures are maintained even after soldering for 120 min. The results pave the way for controlling the morphology and orientation of interfacial intermetallics in 3D packaging technologies.

Highly Efficient Perovskite Solar Modules by Scalable Fabrication and Interconnection Optimization

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, Mengjin; Kim, Dong Hoe; Klein, Talysa R.

To push perovskite solar cell (PSC) technology toward practical applications, large-area perovskite solar modules with multiple subcells need to be developed by fully scalable deposition approaches. Here, we demonstrate a deposition scheme for perovskite module fabrication with spray coating of a TiO2 electron transport layer (ETL) and blade coating of both a perovskite absorber layer and a spiro-OMeTAD-based hole transport layer (HTL). The TiO2 ETL remaining in the interconnection between subcells significantly affects the module performance. Reducing the TiO2 thickness changes the interconnection contact from a Schottky diode to ohmic behavior. Owing to interconnection resistance reduction, the perovskite modules withmore » a 10 nm TiO2 layer show enhanced performance mainly associated with an improved fill factor. Finally, we demonstrate a four-cell MA0.7FA0.3PbI3 perovskite module with a stabilized power conversion efficiency (PCE) of 15.6% measured from an aperture area of ~10.36 cm2, corresponding to an active-area module PCE of 17.9% with a geometric fill factor of ~87.3%.« less

Final analysis of cost, value, and risk.

DOT National Transportation Integrated Search

2009-03-05

USDOT understands that access to emergency services provided by 9-1-1 in todays world of evolving : technology will ultimately occur within a broader array of interconnected networks comprehensively : supporting emergency servicesfrom public ac...

Wireless Internet Gateways (WINGS)

DTIC Science & Technology

1997-01-01

WIRELESS INTERNET GATEWAYS (WINGS) J.J. Garcia-Luna-Aceves, Chane L. Fullmer, Ewerton Madruga Computer Engineering Department University of...rooftop.com Abstract— Today’s internetwork technology has been extremely success- ful in linking huge numbers of computers and users. However, to date...this technology has been oriented to computer interconnection in relatively stable operational environments, and thus cannot adequately support many of

Automated solar cell assembly team process research

NASA Astrophysics Data System (ADS)

Nowlan, M. J.; Hogan, S. J.; Darkazalli, G.; Breen, W. F.; Murach, J. M.; Sutherland, S. F.; Patterson, J. S.

1994-06-01

This report describes work done under the Photovoltaic Manufacturing Technology (PVMaT) project, Phase 3A, which addresses problems that are generic to the photovoltaic (PV) industry. Spire's objective during Phase 3A was to use its light soldering technology and experience to design and fabricate solar cell tabbing and interconnecting equipment to develop new, high-yield, high-throughput, fully automated processes for tabbing and interconnecting thin cells. Areas that were addressed include processing rates, process control, yield, throughput, material utilization efficiency, and increased use of automation. Spire teamed with Solec International, a PV module manufacturer, and the University of Massachusetts at Lowell's Center for Productivity Enhancement (CPE), automation specialists, who are lower-tier subcontractors. A number of other PV manufacturers, including Siemens Solar, Mobil Solar, Solar Web, and Texas instruments, agreed to evaluate the processes developed under this program.

Data processing and optimization system to study prospective interstate power interconnections

NASA Astrophysics Data System (ADS)

Podkovalnikov, Sergei; Trofimov, Ivan; Trofimov, Leonid

2018-01-01

The paper presents Data processing and optimization system for studying and making rational decisions on the formation of interstate electric power interconnections, with aim to increasing effectiveness of their functioning and expansion. The technologies for building and integrating a Data processing and optimization system including an object-oriented database and a predictive mathematical model for optimizing the expansion of electric power systems ORIRES, are described. The technology of collection and pre-processing of non-structured data collected from various sources and its loading to the object-oriented database, as well as processing and presentation of information in the GIS system are described. One of the approaches of graphical visualization of the results of optimization model is considered on the example of calculating the option for expansion of the South Korean electric power grid.

The ISO Edi Conceptual Model Activity and Its Relationship to OSI.

ERIC Educational Resources Information Center

Fincher, Judith A.

1990-01-01

The edi conceptual model is being developed to define common structures, services, and processes that syntax-specific standards like X12 and EDIFACT could adopt. Open Systems Interconnection (OSI) is of interest to edi because of its potential to help enable global interoperability across Electronic Data Interchange (EDI) functional groups. A…

The Interlibrary Loan Protocol: An OSI Solution to ILL Messaging.

ERIC Educational Resources Information Center

Turner, Fay

1990-01-01

Discusses the interlibrary loan (ILL) protocol, a standard based on the principles of the Open Systems Interconnection (OSI) Reference Model. Benefits derived from protocol use are described, the status of the protocol as an international standard is reviewed, and steps taken by the National Library of Canada to facilitate migration to an ILL…

76 FR 11407 - Review of Wireline Competition Bureau Data Practices, Computer III Further Remand Proceedings...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-03-02

... removal of the narrowband comparably efficient interconnection (CEI) and open network architecture (ONA... and copying during normal business hours in the FCC Reference Information Center, Portals II, 445 12th... addition, pursuant to the Small Business Paperwork Relief Act of 2002, we will seek specific comment on how...

Status of the Consolidation of the LHC Superconducting Magnets and Circuits

NASA Astrophysics Data System (ADS)

Tock, J. Ph; Atieh, S.; Bodart, D.; Bordry, F.; Bourcey, N.; Cruikshank, P.; Dahlerup-Petersen, K.; Dalin, J. M.; Garion, C.; Musso, A.; Ostojic, R.; Perin, A.; Pojer, M.; Savary, F.; Scheuerlein, C.

2014-05-01

The first LHC long shutdown (LS1) started in February 2013. It was triggered by the need to consolidate the 13 kA splices between the superconducting magnets to allow the LHC to reach safely its design energy of 14 TeV center of mass. The final design of the consolidated splices is recalled. 1695 interconnections containing 10 170 splices have to be opened. In addition to the work on the 13 kA splices, the other interventions performed during the first long shut-down on all the superconducting circuits are described. All this work has been structured in a project, gathering about 280 persons. The opening of the interconnections started in April 2013 and consolidation works are planned to be completed by August 2014. This paper describes first the preparation phase with the building of the teams and the detailed planning of the operation. Then, it gives feedback from the worksite, namely lessons learnt and adaptations that were implemented, both from the technical and organizational points of view. Finally, perspectives for the completion of this consolidation campaign are given.

High Resolution Aerospace Applications using the NASA Columbia Supercomputer

NASA Technical Reports Server (NTRS)

Mavriplis, Dimitri J.; Aftosmis, Michael J.; Berger, Marsha

2005-01-01

This paper focuses on the parallel performance of two high-performance aerodynamic simulation packages on the newly installed NASA Columbia supercomputer. These packages include both a high-fidelity, unstructured, Reynolds-averaged Navier-Stokes solver, and a fully-automated inviscid flow package for cut-cell Cartesian grids. The complementary combination of these two simulation codes enables high-fidelity characterization of aerospace vehicle design performance over the entire flight envelope through extensive parametric analysis and detailed simulation of critical regions of the flight envelope. Both packages. are industrial-level codes designed for complex geometry and incorpor.ats. CuStomized multigrid solution algorithms. The performance of these codes on Columbia is examined using both MPI and OpenMP and using both the NUMAlink and InfiniBand interconnect fabrics. Numerical results demonstrate good scalability on up to 2016 CPUs using the NUMAIink4 interconnect, with measured computational rates in the vicinity of 3 TFLOP/s, while InfiniBand showed some performance degradation at high CPU counts, particularly with multigrid. Nonetheless, the results are encouraging enough to indicate that larger test cases using combined MPI/OpenMP communication should scale well on even more processors.

Chip-scale integrated optical interconnects: a key enabler for future high-performance computing

NASA Astrophysics Data System (ADS)

Haney, Michael; Nair, Rohit; Gu, Tian

2012-01-01

High Performance Computing (HPC) systems are putting ever-increasing demands on the throughput efficiency of their interconnection fabrics. In this paper, the limits of conventional metal trace-based inter-chip interconnect fabrics are examined in the context of state-of-the-art HPC systems, which currently operate near the 1 GFLOPS/W level. The analysis suggests that conventional metal trace interconnects will limit performance to approximately 6 GFLOPS/W in larger HPC systems that require many computer chips to be interconnected in parallel processing architectures. As the HPC communications bottlenecks push closer to the processing chips, integrated Optical Interconnect (OI) technology may provide the ultra-high bandwidths needed at the inter- and intra-chip levels. With inter-chip photonic link energies projected to be less than 1 pJ/bit, integrated OI is projected to enable HPC architecture scaling to the 50 GFLOPS/W level and beyond - providing a path to Peta-FLOPS-level HPC within a single rack, and potentially even Exa-FLOPSlevel HPC for large systems. A new hybrid integrated chip-scale OI approach is described and evaluated. The concept integrates a high-density polymer waveguide fabric directly on top of a multiple quantum well (MQW) modulator array that is area-bonded to the Silicon computing chip. Grayscale lithography is used to fabricate 5 μm x 5 μm polymer waveguides and associated novel small-footprint total internal reflection-based vertical input/output couplers directly onto a layer containing an array of GaAs MQW devices configured to be either absorption modulators or photodetectors. An external continuous wave optical "power supply" is coupled into the waveguide links. Contrast ratios were measured using a test rider chip in place of a Silicon processing chip. The results suggest that sub-pJ/b chip-scale communication is achievable with this concept. When integrated into high-density integrated optical interconnect fabrics, it could provide a seamless interconnect fabric spanning the intra-

Smart City Energy Interconnection Technology Framework Preliminary Research

NASA Astrophysics Data System (ADS)

Zheng, Guotai; Zhao, Baoguo; Zhao, Xin; Li, Hao; Huo, Xianxu; Li, Wen; Xia, Yu

2018-01-01

to improve urban energy efficiency, improve the absorptive ratio of new energy resources and renewable energy sources, and reduce environmental pollution and other energy supply and consumption technology framework matched with future energy restriction conditions and applied technology level are required to be studied. Relative to traditional energy supply system, advanced information technology-based “Energy Internet” technical framework may give play to energy integrated application and load side interactive technology advantages, as a whole optimize energy supply and consumption and improve the overall utilization efficiency of energy.

Chemical-assisted femtosecond laser writing of lab-in-fibers.

PubMed

Haque, Moez; Lee, Kenneth K C; Ho, Stephen; Fernandes, Luís A; Herman, Peter R

2014-10-07

The lab-on-chip (LOC) platform has presented a powerful opportunity to improve functionalization, parallelization, and miniaturization on planar or multilevel geometries that has not been possible with fiber optic technology. A migration of such LOC devices into the optical fiber platform would therefore open the revolutionary prospect of creating novel lab-in-fiber (LIF) systems on the basis of an efficient optical transport highway for multifunctional sensing. For the LIF, the core optical waveguide inherently offers a facile means to interconnect numerous types of sensing elements along the optical fiber, presenting a radical opportunity for optimizing the packaging and densification of diverse components in convenient geometries beyond that available with conventional LOCs. In this paper, three-dimensional patterning inside the optical fiber by femtosecond laser writing, together with selective chemical etching, is presented as a powerful tool to form refractive index structures such as optical waveguides and gratings as well as to open buried microfluidic channels and optical resonators inside the flexible and robust glass fiber. In this approach, optically smooth surfaces (~12 nm rms) are introduced for the first time inside the fiber cladding that precisely conform to planar nanograting structures when formed by aberration-free focusing with an oil-immersion lens across the cylindrical fiber wall. This process has enabled optofluidic components to be precisely embedded within the fiber to be probed by either the single-mode fiber core waveguide or the laser-formed optical circuits. We establish cladding waveguides, X-couplers, fiber Bragg gratings, microholes, mirrors, optofluidic resonators, and microfluidic reservoirs that define the building blocks for facile interconnection of inline core-waveguide devices with cladding optofluidics. With these components, more advanced, integrated, and multiplexed fiber microsystems are presented demonstrating fluorescence detection, Fabry-Perot interferometric refractometry, and simultaneous sensing of refractive index, temperature, and bending strain. The flexible writing technique and multiplexed sensors described here open powerful prospects to migrate the benefits of LOCs into a more flexible and miniature LIF platform for highly functional and distributed sensing capabilities. The waveguide backbone of the LIF inherently provides an efficient exchange of information, combining sensing data that are attractive in telecom networks, smart catheters for medical procedures, compact sensors for security and defense, shape sensors, and low-cost health care products.

Preliminary analysis of cost, value, and risk.

DOT National Transportation Integrated Search

2008-02-12

The U.S. Department of Transportation (USDOT) understands that access to emergency services provided by 9-1-1 in todays world of evolving technology will ultimately occur within a broader array of interconnected networks comprehensively supporting...

Universal cell frame for high-pressure water electrolyzer and electrolyzer including the same

DOEpatents

Schmitt, Edwin W.; Norman, Timothy J.

2013-01-08

Universal cell frame generic for use as an anode frame and as a cathode frame in a water electrolyzer. According to one embodiment, the universal cell frame includes a unitary annular member having a central opening. Four trios of transverse openings are provided in the annular member, each trio being spaced apart by about 90 degrees. A plurality of internal radial passageways fluidly interconnect the central opening and each of the transverse openings of two diametrically-opposed trios of openings, the other two trios of openings lacking corresponding radial passageways. Sealing ribs are provided on the top and bottom surfaces of the annular member. The present invention is also directed at a water electrolyzer that includes two such cell frames, one being used as the anode frame and the other being used as the cathode frame, the cathode frame being rotated 90 degrees relative to the anode frame.

Breaking open the set top box

NASA Astrophysics Data System (ADS)

Banks, David; Wiley, Anthony; Catania, Nicolas; Coles, Alastair N.; Smith, Duncan; Baynham, Simon; Deliot, Eric; Chidzey, Rod

1998-02-01

In this paper we describe the work being done at HP Labs Bristol in the area of home networks and gateways. This work is based on the idea of breaking open the set top box by physically separating the access network specific functions from the application specific functions. The access network specific functions reside in an access network gateway that can be shared by many end user devices. The first section of the paper present the philosophy behind this approach. The end user devices and the access network gateways must be interconnected by a high bandwidth network which can offer a bounded delay service for delay sensitive traffic. We are advocating the use of IEEE 1394 for this network, and the next section of the paper gives a brief introduction to this technology. We then describe a prototype digital video broadcasting satellite compliant gateway that we have built. This gateway could be used, for example, by a PC for receiving a data service or by a digital TV for receiving an MPEG-2 video service. A control architecture is the presented which uses a PC application to provide a web based user interface to the system. Finally, we provide details of our work on extending the reach of IEEE 1394 and its standardization status.

New IEEE 11073 Standards for interoperable, networked Point-of-Care Medical Devices.

PubMed

Kasparick, Martin; Schlichting, Stefan; Golatowski, Frank; Timmermann, Dirk

2015-08-01

Surgical procedures become more and more complex and the number of medical devices in an operating room (OR) increases continuously. Today's vendor-dependent solutions for integrated ORs are not able to handle this complexity. They can only form isolated solutions. Furthermore, high costs are a result of vendor-dependent approaches. Thus we present a service-oriented device communication for distributed medical systems that enables the integration and interconnection between medical devices among each other and to (medical) information systems, including plug-and-play functionality. This system will improve patient's safety by making technical complexity of a comprehensive integration manageable. It will be available as open standards that are part of the IEEE 11073 family of standards. The solution consists of a service-oriented communication technology, the so called Medical Devices Profile for Web Services (MDPWS), a Domain Information & Service Model, and a binding between the first two mechanisms. A proof of this concept has been done with demonstrators of real world OR devices.

The use of hybrid integrated circuit techniques in biotelemetry applications

NASA Technical Reports Server (NTRS)

Fryer, T. B.

1977-01-01

A review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.

Femtosecond laser inscription of asymmetric directional couplers for in-fiber optical taps and fiber cladding photonics.

PubMed

Grenier, Jason R; Fernandes, Luís A; Herman, Peter R

2015-06-29

Precise alignment of femtosecond laser tracks in standard single mode optical fiber is shown to enable controllable optical tapping of the fiber core waveguide light with fiber cladding photonic circuits. Asymmetric directional couplers are presented with tunable coupling ratios up to 62% and bandwidths up to 300 nm at telecommunication wavelengths. Real-time fiber monitoring during laser writing permitted a means of controlling the coupler length to compensate for micron-scale alignment errors and to facilitate tailored design of coupling ratio, spectral bandwidth and polarization properties. Laser induced waveguide birefringence was harnessed for polarization dependent coupling that led to the formation of in-fiber polarization-selective taps with 32 dB extinction ratio. This technology enables the interconnection of light propagating in pre-existing waveguides with laser-formed devices, thereby opening a new practical direction for the three-dimensional integration of optical devices in the cladding of optical fibers and planar lightwave circuits.

Process development for automated solar cell and module production. Task 4: Automated array assembly

NASA Technical Reports Server (NTRS)

1980-01-01

A process sequence which can be used in conjunction with automated equipment for the mass production of solar cell modules for terrestrial use was developed. The process sequence was then critically analyzed from a technical and economic standpoint to determine the technological readiness of certain process steps for implementation. The steps receiving analysis were: back contact metallization, automated cell array layup/interconnect, and module edge sealing. For automated layup/interconnect, both hard automation and programmable automation (using an industrial robot) were studied. The programmable automation system was then selected for actual hardware development.

UNISIST Working Group on Technology of Systems Interconnection. Meeting (3rd, Quezon City, Philippines, October 17-20, 1983).

ERIC Educational Resources Information Center

United Nations Educational, Scientific and Cultural Organization, Paris (France). General Information Programme.

Participants in the meeting summarized in this report advised and made recommendations on appropriate activities and programs conducive to the development of cooperative networks and the exchange of information and experience in science and technology in the Asia Pacific Region. Invited in their personal capacity as experts, the 14 participants…

Leveraging Simulation Against the F-16 Flying Training Gap

DTIC Science & Technology

2005-11-01

must leverage emerging simulation technology into combined flight training to counter mission employment complexity created by technology itself...two or more of these stand-alone simulators creates a mission training center (MTC), which when further networked create distributed mission...operations (DMO). Ultimately, the grand operational vision of DMO is to interconnect non-collocated users creating a “virtual” joint training environment

Information engineering

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hunt, D.N.

1997-02-01

The Information Engineering thrust area develops information technology to support the programmatic needs of Lawrence Livermore National Laboratory`s Engineering Directorate. Progress in five programmatic areas are described in separate reports contained herein. These are entitled Three-dimensional Object Creation, Manipulation, and Transport, Zephyr:A Secure Internet-Based Process to Streamline Engineering Procurements, Subcarrier Multiplexing: Optical Network Demonstrations, Parallel Optical Interconnect Technology Demonstration, and Intelligent Automation Architecture.

Hexagonal boron nitride intercalated multi-layer graphene: a possible ultimate solution to ultra-scaled interconnect technology

NASA Astrophysics Data System (ADS)

Li, Yong-Jun; Sun, Qing-Qing; Chen, Lin; Zhou, Peng; Wang, Peng-Fei; Ding, Shi-Jin; Zhang, David Wei

2012-03-01

We proposed intercalation of hexagonal boron nitride (hBN) in multilayer graphene to improve its performance in ultra-scaled interconnects for integrated circuit. The effect of intercalated hBN layer in bilayer graphene is investigated using non-equilibrium Green's functions. We find the hBN intercalated bilayer graphene exhibit enhanced transport properties compared with pristine bilayer ones, and the improvement is attributed to suppression of interlayer scattering and good planar bonding condition of inbetween hBN layer. Based on these results, we proposed a via structure that not only benefits from suppressed interlayer scattering between multilayer graphene, but also sustains the unique electrical properties of graphene when many graphene layers are stacking together. The ideal current density across the structure can be as high as 4.6×109 A/cm2 at 1V, which is very promising for the future high-performance interconnect.

Accurate Modeling Method for Cu Interconnect

NASA Astrophysics Data System (ADS)

Yamada, Kenta; Kitahara, Hiroshi; Asai, Yoshihiko; Sakamoto, Hideo; Okada, Norio; Yasuda, Makoto; Oda, Noriaki; Sakurai, Michio; Hiroi, Masayuki; Takewaki, Toshiyuki; Ohnishi, Sadayuki; Iguchi, Manabu; Minda, Hiroyasu; Suzuki, Mieko

This paper proposes an accurate modeling method of the copper interconnect cross-section in which the width and thickness dependence on layout patterns and density caused by processes (CMP, etching, sputtering, lithography, and so on) are fully, incorporated and universally expressed. In addition, we have developed specific test patterns for the model parameters extraction, and an efficient extraction flow. We have extracted the model parameters for 0.15μm CMOS using this method and confirmed that 10%τpd error normally observed with conventional LPE (Layout Parameters Extraction) was completely dissolved. Moreover, it is verified that the model can be applied to more advanced technologies (90nm, 65nm and 55nm CMOS). Since the interconnect delay variations due to the processes constitute a significant part of what have conventionally been treated as random variations, use of the proposed model could enable one to greatly narrow the guardbands required to guarantee a desired yield, thereby facilitating design closure.

Device and circuit-level performance of carbon nanotube field-effect transistor with benchmarking against a nano-MOSFET.

PubMed

Tan, Michael Loong Peng; Lentaris, Georgios; Amaratunga Aj, Gehan

2012-08-19

The performance of a semiconducting carbon nanotube (CNT) is assessed and tabulated for parameters against those of a metal-oxide-semiconductor field-effect transistor (MOSFET). Both CNT and MOSFET models considered agree well with the trends in the available experimental data. The results obtained show that nanotubes can significantly reduce the drain-induced barrier lowering effect and subthreshold swing in silicon channel replacement while sustaining smaller channel area at higher current density. Performance metrics of both devices such as current drive strength, current on-off ratio (Ion/Ioff), energy-delay product, and power-delay product for logic gates, namely NAND and NOR, are presented. Design rules used for carbon nanotube field-effect transistors (CNTFETs) are compatible with the 45-nm MOSFET technology. The parasitics associated with interconnects are also incorporated in the model. Interconnects can affect the propagation delay in a CNTFET. Smaller length interconnects result in higher cutoff frequency.

Interconnecting astronomical networks: evolving from single networks to meta-networks

NASA Astrophysics Data System (ADS)

White, R. R.; Allan, A.; Evans, S.; Vestrand, W. T.; Wren, J.; Wozniak, P.

2006-06-01

Over the past four years we have seen continued advancement in network technology and how those technologies are beginning to enable astronomical science. Even though some sociological aspects are hindering full cooperation between most observatories and telescopes outside of their academic or institutional connections, an unprecedented step during the summer of 2005 was taken towards creating a world-wide interconnection of astronomical assets. The Telescope Alert Operations Network System (TALONS), a centralized server/client bi-directional network developed and operated by Los Alamos National Laboratory, integrated one of its network nodes with a node from the eScience Telescopes for Astronomical Research (eSTAR), a peer-to-peer agent based network developed and operated by The University of Exeter. Each network can act independently, providing support for their direct clients, and by interconnection provide local clients with access to; outside telescope systems, software tools unavailable locally, and the ability to utilize assets far more efficiently, thereby enabling science on a world-wide scale. In this paper we will look at the evolution of these independent networks into the worlds first heterogeneous telescope network and where this may take astronomy in the future. We will also examine those key elements necessary to providing universal communication between diverse astronomical networks.

Si photonics technology for future optical interconnection

NASA Astrophysics Data System (ADS)

Zheng, Xuezhe; Krishnamoorthy, Ashok V.

2011-12-01

Scaling of computing systems require ultra-efficient interconnects with large bandwidth density. Silicon photonics offers a disruptive solution with advantages in reach, energy efficiency and bandwidth density. We review our progress in developing building blocks for ultra-efficient WDM silicon photonic links. Employing microsolder based hybrid integration with low parasitics and high density, we optimize photonic devices on SOI platforms and VLSI circuits on more advanced bulk CMOS technology nodes independently. Progressively, we successfully demonstrated single channel hybrid silicon photonic transceivers at 5 Gbps and 10 Gbps, and 80 Gbps arrayed WDM silicon photonic transceiver using reverse biased depletion ring modulators and Ge waveguide photo detectors. Record-high energy efficiency of less than 100fJ/bit and 385 fJ/bit were achieved for the hybrid integrated transmitter and receiver, respectively. Waveguide grating based optical proximity couplers were developed with low loss and large optical bandwidth to enable multi-layer intra/inter-chip optical interconnects. Thermal engineering of WDM devices by selective substrate removal, together with WDM link using synthetic wavelength comb, we significantly improved the device tuning efficiency and reduced the tuning range. Using these innovative techniques, two orders of magnitude tuning power reduction was achieved. And tuning cost of only a few 10s of fJ/bit is expected for high data rate WDM silicon photonic links.

Optical interconnects based on VCSELs and low-loss silicon photonics

NASA Astrophysics Data System (ADS)

Aalto, Timo; Harjanne, Mikko; Karppinen, Mikko; Cherchi, Matteo; Sitomaniemi, Aila; Ollila, Jyrki; Malacarne, Antonio; Neumeyr, Christian

2018-02-01

Silicon photonics with micron-scale Si waveguides offers most of the benefits of submicron SOI technology while avoiding most of its limitations. In particular, thick silicon-on-insulator (SOI) waveguides offer 0.1 dB/cm propagation loss, polarization independency, broadband single-mode (SM) operation from 1.2 to >4 µm wavelength and ability to transmit high optical powers (>1 W). Here we describe the feasibility of Thick-SOI technology for advanced optical interconnects. With 12 μm SOI waveguides we demonstrate efficient coupling between standard single-mode fibers, vertical-cavity surface-emitting lasers (VCSELs) and photodetectors (PDs), as well as wavelength multiplexing in small footprint. Discrete VCSELs and PDs already support 28 Gb/s on-off keying (OOK), which shows a path towards 50-100 Gb/s bandwidth per wavelength by using more advanced modulation formats like PAM4. Directly modulated VCSELs enable very power-efficient optical interconnects for up to 40 km distance. Furthermore, with 3 μm SOI waveguides we demonstrate extremely dense and low-loss integration of numerous optical functions, such as multiplexers, filters, switches and delay lines. Also polarization independent and athermal operation is demonstrated. The latter is achieved by using short polymer waveguides to compensate for the thermo-optic effect in silicon. New concepts for isolator integration and polarization rotation are also explained.

Machinima and Video-Based Soft-Skills Training for Frontline Healthcare Workers.

PubMed

Conkey, Curtis A; Bowers, Clint; Cannon-Bowers, Janis; Sanchez, Alicia

2013-02-01

Multimedia training methods have traditionally relied heavily on video-based technologies, and significant research has shown these to be very effective training tools. However, production of video is time and resource intensive. Machinima technologies are based on videogaming technology. Machinima technology allows videogame technology to be manipulated into unique scenarios based on entertainment or training and practice applications. Machinima is the converting of these unique scenarios into video vignettes that tell a story. These vignettes can be interconnected with branching points in much the same way that education videos are interconnected as vignettes between decision points. This study addressed the effectiveness of machinima-based soft-skills education using avatar actors versus the traditional video teaching application using human actors in the training of frontline healthcare workers. This research also investigated the difference between presence reactions when using avatar actor-produced video vignettes as compared with human actor-produced video vignettes. Results indicated that the difference in training and/or practice effectiveness is statistically insignificant for presence, interactivity, quality, and the skill of assertiveness. The skill of active listening presented a mixed result indicating the need for careful attention to detail in situations where body language and facial expressions are critical to communication. This study demonstrates that a significant opportunity exists for the exploitation of avatar actors in video-based instruction.

Adaptive Code Division Multiple Access Protocol for Wireless Network-on-Chip Architectures

NASA Astrophysics Data System (ADS)

Vijayakumaran, Vineeth

Massive levels of integration following Moore's Law ushered in a paradigm shift in the way on-chip interconnections were designed. With higher and higher number of cores on the same die traditional bus based interconnections are no longer a scalable communication infrastructure. On-chip networks were proposed enabled a scalable plug-and-play mechanism for interconnecting hundreds of cores on the same chip. Wired interconnects between the cores in a traditional Network-on-Chip (NoC) system, becomes a bottleneck with increase in the number of cores thereby increasing the latency and energy to transmit signals over them. Hence, there has been many alternative emerging interconnect technologies proposed, namely, 3D, photonic and multi-band RF interconnects. Although they provide better connectivity, higher speed and higher bandwidth compared to wired interconnects; they also face challenges with heat dissipation and manufacturing difficulties. On-chip wireless interconnects is one other alternative proposed which doesn't need physical interconnection layout as data travels over the wireless medium. They are integrated into a hybrid NOC architecture consisting of both wired and wireless links, which provides higher bandwidth, lower latency, lesser area overhead and reduced energy dissipation in communication. However, as the bandwidth of the wireless channels is limited, an efficient media access control (MAC) scheme is required to enhance the utilization of the available bandwidth. This thesis proposes using a multiple access mechanism such as Code Division Multiple Access (CDMA) to enable multiple transmitter-receiver pairs to send data over the wireless channel simultaneously. It will be shown that such a hybrid wireless NoC with an efficient CDMA based MAC protocol can significantly increase the performance of the system while lowering the energy dissipation in data transfer. In this work it is shown that the wireless NoC with the proposed CDMA based MAC protocol outperformed the wired counterparts and several other wireless architectures proposed in literature in terms of bandwidth and packet energy dissipation. Significant gains were observed in packet energy dissipation and bandwidth even with scaling the system to higher number of cores. Non-uniform traffic simulations showed that the proposed CDMA-WiNoC was consistent in bandwidth across all traffic patterns. It is also shown that the CDMA based MAC scheme does not introduce additional reliability concerns in data transfer over the on-chip wireless interconnects.

High-bandwidth and low-loss multimode polymer waveguides and waveguide components for high-speed board-level optical interconnects

NASA Astrophysics Data System (ADS)

Bamiedakis, N.; Chen, J.; Penty, R. V.; White, I. H.

2016-03-01

Multimode polymer waveguides are being increasingly considered for use in short-reach board-level optical interconnects as they exhibit favourable optical properties and allow direct integration onto standard PCBs with conventional methods of the electronics industry. Siloxane-based multimode waveguides have been demonstrated with excellent optical transmission performance, while a wide range of passive waveguide components that offer routing flexibility and enable the implementation of complex on-board interconnection architectures has been reported. In recent work, we have demonstrated that these polymer waveguides can exhibit very high bandwidth-length products in excess of 30 GHz×m despite their highly-multimoded nature, while it has been shown that even larger values of > 60 GHz×m can be achieved by adjusting their refractive index profile. Furthermore, the combination of refractive index engineering and launch conditioning schemes can ensure high bandwidth (> 100 GHz×m) and high coupling efficiency (<1 dB) with standard multimode fibre inputs with relatively large alignment tolerances (~17×15 μm2). In the work presented here, we investigate the effects of refractive index engineering on the performance of passive waveguide components (crossings, bends) and provide suitable design rules for their on-board use. It is shown that, depending on the interconnection layout and link requirements, appropriate choice of refractive index profile can provide enhanced component performance, ensuring low loss interconnection and adequate link bandwidth. The results highlight the strong potential of this versatile optical technology for the formation of high-performance board-level optical interconnects with high routing flexibility.

76 FR 40729 - Sunshine Act Meeting; Open Commission Meeting; Tuesday, July 12, 2011

Federal Register 2010, 2011, 2012, 2013, 2014

2011-07-11

... Requirements (PS Docket Bureau. No. 07-114); E911 Requirements for IP-Enabled Service Providers (WC Docket No. 05-196); and Amending the Definition of Interconnected VoIP Service in Section 9.3 of the Commission..., including Voice over Internet Protocol (VoIP). Reforms to certain of the Commission's procedural rules took...

The Governance in the Development of Public Universities in China

ERIC Educational Resources Information Center

Liu, Xu

2017-01-01

This paper examines institutional governance of the public university in China, investigating the extent to which government has sponsored the autonomy of universities since the inception of the opening up reforms of 1978. The paper sets out to explain how the party governance system of China is interconnected with aspects of the university's…

77 FR 790 - FirstEnergy Solutions Corp., Allegheny Energy Supply Company, LLC v. PJM Interconnection, L.L.C...

Federal Register 2010, 2011, 2012, 2013, 2014

2012-01-06

... eliminate the references to the real-time market in the calculation of congestion charges that FTR holders receive and direct the Respondent to allocate incremental real-time transmission congestion charges to all... of The Respondent's Open Access Transmission Tariff and Operating Agreement (OA), as related to the...

The Insider Threat Security Architecture: An Integrated, Inseparable, and Uninterrupted Self-Protection Autonomic Framework

ERIC Educational Resources Information Center

Jabbour, Ghassan

2010-01-01

The increasing proliferation of globally interconnected complex information systems has elevated the magnitude of attacks and the level of damage that they inflict on such systems. This open environment of intertwined financial, medical, defense, and other systems has attracted hackers to increase their malicious activities to cause harm or to…

Preparing Global-Ready Teachers

ERIC Educational Resources Information Center

Larson, Lotta; Brown, Jennifer S.

2017-01-01

To produce global-ready students who can thrive and compete in an interconnected world, we must prepare global-ready teachers. This article shares how one teacher preparation program focuses on literacy, technology, and globalization, while offering relevant K-12 applications.

VCSEL Applications and Simulation

NASA Technical Reports Server (NTRS)

Cheung, Samson; Goorjian, Peter; Ning, Cun-Zheng; Li, Jian-Zhong

2000-01-01

This viewgraph presentation gives an overview of Vertical Cavity Surface Emitting Laser (VCSEL) simulation and its applications. Details are given on the optical interconnection in information technology of VCSEL, the formulation of the simulation, its numeric algorithm, and the computational results.

Development and production integration of a planarized AlCu interconnect process for submicron CMOS

NASA Astrophysics Data System (ADS)

Brown, Kevin C.; Hill, Rodney; Reddy, Krishna; Gadepally, Kamesh

1995-09-01

A planarized aluminum alloy interconnect has been developed as an alternative to tungsten plugs for a 0.65 (mu) CMOS technology. Contact resistance can increase with either an inadequate RF sputter clean or titanium that is too thin to reduce the native oxide. Diffusion barrier results show that a minimum amount of titanium nitride, whether deposited conventionally or with collimation, is necessary for low junction leakage and good sort yield. Stacked contacts and vias are supported while via resistance and defect density are improved. Electrical bridging due to silicon residues from AlSiCu can be minimized with metal overetching, but not to the extent of AlCu. Sidewall pitting was observed to be due to galvanic corrosion from copper precipitate formation. Overall yield has been improved along with decreased wafer cost compared to conventional tungsten plug technology.

Progress in developing ultrathin solar cell blanket technology

NASA Technical Reports Server (NTRS)

Patterson, R. E.; Mesch, H. G.; Scott-Monck, J.

1984-01-01

A program was conducted to develop technologies for welding interconnects to three types of 50-micron-thick, 2 by 2-cm solar cells. Parallel-gap resistance welding was used for interconnect attachment. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Six 48-cell modules were assembled with 50-micron (nominal) thick cells, frosted fused-silica covers, silver-plated Invar interconnectors, and four different substrate designs. Three modules (one for each cell type) have single-layer Kapton (50-micron-thick) substrates. The other three modules each have a different substrate (Kapton-Kevlar-Kapton, Kapton-graphite-Kapton, and Kapton-graphite-aluminum honeycomb-graphite). All six modules were subjected to 4112 thermal cycles from -175 to 65 C (corresponding to over 40 years of simulated geosynchronous orbit thermal cycling) and experienced only negligible electrical degradation (1.1 percent average of six 48-cell modules).

Capillary Flows Along Open Channel Conduits: The Open-Star Section

NASA Technical Reports Server (NTRS)

Weislogel, Mark; Geile, John; Chen, Yongkang; Nguyen, Thanh Tung; Callahan, Michael

2014-01-01

Capillary rise in tubes, channels, and grooves has received significant attention in the literature for over 100 years. In yet another incremental extension of such work, a transient capillary rise problem is solved for spontaneous flow along an interconnected array of open channels forming what is referred to as an 'open-star' section. This geometry possesses several attractive characteristics including passive phase separations and high diffusive gas transport. Despite the complex geometry, novel and convenient approximations for capillary pressure and viscous resistance enable closed form predictions of the flow. As part of the solution, a combined scaling approach is applied that identifies unsteady-inertial-capillary, convective-inertial-capillary, and visco-capillary transient regimes in a single parameter. Drop tower experiments are performed employing 3-D printed conduits to corroborate all findings.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lentine, Anthony L.; DeRose, Christopher T.

In this study, small silicon photonics micro-resonator modulators and filters hold the promise for multi-terabit per-second interconnects at energy consumptions well below 1 pJ/bit. To date, no products exist and little known commercial development is occurring using this technology. Why? In this talk, we review the many challenges that remain to be overcome in bringing this technology from the research labs to the field where they can overcome important commercial, industrial, and national security limitations of existing photonic technologies.

Antenna-coupled unbiased detectors for LW-IR regime

NASA Astrophysics Data System (ADS)

Tiwari, Badri Nath

At room temperature (300K), the electromagnetic (EM) radiation emitted by humans and other living beings peaks mostly in the long-wavelength infrared (LW-IR) regime. And since the atmosphere shows relatively little absorption in this band, applications such as target detection, tracking, active homing, and navigation in autonomous vehicles extensively use the LW-IR frequency range. The present research work is focused on developing antenna-based, uncooled, and unbiased detectors for the LW-IR regime. In the first part of this research, antenna-coupled metal-oxide-metal diodes (ACMOMD) are investigated. In response to the EM radiation, high-frequency antenna currents are induced in the antenna. An asymmetric-barrier Al-Al2O3-Pt MOM diode rectifies the antenna currents. Two different types of fabrication processes have been developed for ACMOMDs namely one-step lithography and two-step lithography. The major drawbacks of MOM-based devices include hard-to-control fabrication processes, generally very high zero-biased resistances, and vulnerability to electrostatic discharges, leading to unstable electrical characteristics. The second part of this research focuses on the development of unbiased LW-IR sensors based on the Seebeck effect. If two different metals are joined together at one end and their other ends are open-circuited, and if a non-zero temperature difference exists between the joined end and the open ends, then a non-zero open-circuit voltage can be measured between the open ends of the wires. Based on this effect, we have developed antenna-coupled nano-thermocouples (ACNTs) in which radiation-induced antenna currents produce polarization-dependent heating of the joined end of the two metals whereas the open ends remain at substrate temperature. This polarization-dependent heating induces polarization-dependent temperature difference between the joined end and the open ends of the metals leading to a polarization-dependent open-circuit voltage between the open ends of the metals. A CW CO2 laser tuned at 10.6 mum wavelength has been used for infrared characterization of these sensors. For these sensors, average responsivity of 22.7 mV/W, signal-to-noise (SNR) ratio of 29 dB, noise equivalent power (NEP) of 1.55 nW, and specific detectivity (D*) of 1.77x105 cm. Hz .W--1 were measured. ACNTs are expected to operate at frequencies much beyond 400 KHz. The third part of this research focuses on the effect of DC read-out interconnects on polarization characteristics of the planar dipole antennas. Different geometries of the interconnects present different electromagnetic boundary conditions to the antenna, and thus affect the far-field polarization characteristics of the antenna. Four designs of DC read-out interconnects are fabricated and their polarization-dependent IR responses are experimentally measured. The High Frequency Structure Simulator (HFSS) from ANSYS is used to simulate the polarization characteristics of the antenna with different read-out geometries.

Interconnect patterns for printed organic thermoelectric devices with large fill factors

NASA Astrophysics Data System (ADS)

Gordiz, Kiarash; Menon, Akanksha K.; Yee, Shannon K.

2017-09-01

Organic materials can be printed into thermoelectric (TE) devices for low temperature energy harvesting applications. The output voltage of printed devices is often limited by (i) small temperature differences across the active materials attributed to small leg lengths and (ii) the lower Seebeck coefficient of organic materials compared to their inorganic counterparts. To increase the voltage, a large number of p- and n-type leg pairs is required for organic TEs; this, however, results in an increased interconnect resistance, which then limits the device output power. In this work, we discuss practical concepts to address this problem by positioning TE legs in a hexagonal closed-packed layout. This helps achieve higher fill factors (˜91%) than conventional inorganic devices (˜25%), which ultimately results in higher voltages and power densities due to lower interconnect resistances. In addition, wiring the legs following a Hilbert spacing-filling pattern allows for facile load matching to each application. This is made possible by leveraging the fractal nature of the Hilbert interconnect pattern, which results in identical sub-modules. Using the Hilbert design, sub-modules can better accommodate non-uniform temperature distributions because they naturally self-localize. These device design concepts open new avenues for roll-to-roll printing and custom TE module shapes, thereby enabling organic TE modules for self-powered sensors and wearable electronic applications.

A metallic interconnect for a solid oxide fuel cell stack

NASA Astrophysics Data System (ADS)

England, Diane Mildred

A solid oxide fuel cell (SOFC) electrochemically converts the chemical energy of reaction into electrical energy. The commercial success of planar, SOFC stack technology has a number of challenges, one of which is the interconnect that electrically and physically connects the cathode of one cell to the anode of an adjacent cell in the SOFC stack and in addition, separates the anodic and cathodic gases. An SOFC stack operating at intermediate temperatures, between 600°C and 800°C, can utilize a metallic alloy as an interconnect material. Since the interconnect of an SOFC stack must operate in both air and fuel environments, the oxidation kinetics, adherence and electronic resistance of the oxide scales formed on commercial alloys were investigated in air and wet hydrogen under thermal cycling conditions to 800°C. The alloy, Haynes 230, exhibited the slowest oxidation kinetics and the lowest area-specific resistance as a function of oxidation time of all the alloys in air at 800°C. However, the area-specific resistance of the oxide scale formed on Haynes 230 in wet hydrogen was unacceptably high after only 500 hours of oxidation, which was attributed to the high resistivity of Cr2O3 in a reducing atmosphere. A study of the electrical conductivity of the minor phase manganese chromite, MnXCr3-XO4, in the oxide scale of Haynes 230, revealed that a composition closer to Mn2CrO4 had significantly higher electrical conductivity than that closer to MnCr 2O4. Haynes 230 was coated with Mn to form a phase closer to the Mn2CrO4 composition for application on the fuel side of the interconnect. U.S. Patent No. 6,054,231 is pending. Although coating a metallic alloy is inexpensive, the stringent economic requirements of SOFC stack technology required an alloy without coating for production applications. As no commercially available alloy, among the 41 alloys investigated, performed to the specifications required, a new alloy was created and designated DME-A2. The oxide scale formed on DME-A2 at 800°C exhibited extremely high electrical conductivity with respect to the commercially available alloys studied. This new alloy shows great promise for use as an interconnect material for a planar SOFC stack operating at intermediate temperatures.

Stochastic Lotka-Volterra equations: A model of lagged diffusion of technology in an interconnected world

NASA Astrophysics Data System (ADS)

Chakrabarti, Anindya S.

2016-01-01

We present a model of technological evolution due to interaction between multiple countries and the resultant effects on the corresponding macro variables. The world consists of a set of economies where some countries are leaders and some are followers in the technology ladder. All of them potentially gain from technological breakthroughs. Applying Lotka-Volterra (LV) equations to model evolution of the technology frontier, we show that the way technology diffuses creates repercussions in the partner economies. This process captures the spill-over effects on major macro variables seen in the current highly globalized world due to trickle-down effects of technology.

Computation for Electromigration in Interconnects of Microelectronic Devices

NASA Astrophysics Data System (ADS)

Averbuch, Amir; Israeli, Moshe; Ravve, Igor; Yavneh, Irad

2001-03-01

Reliability and performance of microelectronic devices depend to a large extent on the resistance of interconnect lines. Voids and cracks may occur in the interconnects, causing a severe increase in the total resistance and even open circuits. In this work we analyze void motion and evolution due to surface diffusion effects and applied external voltage. The interconnects under consideration are three-dimensional (sandwich) constructs made of a very thin metal film of possibly variable thickness attached to a substrate of nonvanishing conductance. A two-dimensional level set approach was applied to study the dynamics of the moving (assumed one-dimensional) boundary of a void in the metal film. The level set formulation of an electromigration and diffusion model results in a fourth-order nonlinear (two-dimensional) time-dependent PDE. This equation was discretized by finite differences on a regular grid in space and a Runge-Kutta integration scheme in time, and solved simultaneously with a second-order static elliptic PDE describing the electric potential distribution throughout the interconnect line. The well-posed three-dimensional problem for the potential was approximated via singular perturbations, in the limit of small aspect ratio, by a two-dimensional elliptic equation with variable coefficients describing the combined local conductivity of metal and substrate (which is allowed to vary in time and space). The difference scheme for the elliptic PDE was solved by a multigrid technique at each time step. Motion of voids in both weak and strong electric fields was examined, and different initial void configurations were considered, including circles, ellipses, polygons with rounded corners, a butterfly, and long grooves. Analysis of the void behavior and its influence on the resistance gives the circuit designer a tool for choosing the proper parameters of an interconnect (width-to-length ratio, properties of the line material, conductivity of the underlayer, etc.).

Fiber bundle probes for interconnecting miniaturized medical imaging devices

NASA Astrophysics Data System (ADS)

Zamora, Vanessa; Hofmann, Jens; Marx, Sebastian; Herter, Jonas; Nguyen, Dennis; Arndt-Staufenbiel, Norbert; Schröder, Henning

2017-02-01

Miniaturization of medical imaging devices will significantly improve the workflow of physicians in hospitals. Photonic integrated circuit (PIC) technologies offer a high level of miniaturization. However, they need fiber optic interconnection solutions for their functional integration. As part of European funded project (InSPECT) we investigate fiber bundle probes (FBPs) to be used as multi-mode (MM) to single-mode (SM) interconnections for PIC modules. The FBP consists of a set of four or seven SM fibers hexagonally distributed and assembled into a holder that defines a multicore connection. Such a connection can be used to connect MM fibers, while each SM fiber is attached to the PIC module. The manufacturing of these probes is explored by using well-established fiber fusion, epoxy adhesive, innovative adhesive and polishing techniques in order to achieve reliable, low-cost and reproducible samples. An innovative hydrofluoric acid-free fiber etching technology has been recently investigated. The preliminary results show that the reduction of the fiber diameter shows a linear behavior as a function of etching time. Different etch rate values from 0.55 μm/min to 2.3 μm/min were found. Several FBPs with three different type of fibers have been optically interrogated at wavelengths of 630nm and 1550nm. Optical losses are found of approx. 35dB at 1550nm for FBPs composed by 80μm fibers. Although FBPs present moderate optical losses, they might be integrated using different optical fibers, covering a broad spectral range required for imaging applications. Finally, we show the use of FBPs as promising MM-to-SM interconnects for real-world interfacing to PIC's.

Proceedings of a Conference on Telecommunication Technologies, Networkings and Libraries

NASA Astrophysics Data System (ADS)

Knight, N. K.

1981-12-01

Current and developing technologies for digital transmission of image data likely to have an impact on the operations of libraries and information centers or provide support for information networking are reviewed. Technologies reviewed include slow scan television, teleconferencing, and videodisc technology and standards development for computer network interconnection through hardware and software, particularly packet switched networks computer network protocols for library and information service applications, the structure of a national bibliographic telecommunications network; and the major policy issues involved in the regulation or deregulation of the common communications carriers industry.

NEXUS Scalable and Distributed Next-Generation Avionics Bus for Space Missions

NASA Technical Reports Server (NTRS)

He, Yutao; Shalom, Eddy; Chau, Savio N.; Some, Raphael R.; Bolotin, Gary S.

2011-01-01

A paper discusses NEXUS, a common, next-generation avionics interconnect that is transparently compatible with wired, fiber-optic, and RF physical layers; provides a flexible, scalable, packet switched topology; is fault-tolerant with sub-microsecond detection/recovery latency; has scalable bandwidth from 1 Kbps to 10 Gbps; has guaranteed real-time determinism with sub-microsecond latency/jitter; has built-in testability; features low power consumption (< 100 mW per Gbps); is lightweight with about a 5,000-logic-gate footprint; and is implemented in a small Bus Interface Unit (BIU) with reconfigurable back-end providing interface to legacy subsystems. NEXUS enhances a commercial interconnect standard, Serial RapidIO, to meet avionics interconnect requirements without breaking the standard. This unified interconnect technology can be used to meet performance, power, size, and reliability requirements of all ranges of equipment, sensors, and actuators at chip-to-chip, board-to-board, or box-to-box boundary. Early results from in-house modeling activity of Serial RapidIO using VisualSim indicate that the use of a switched, high-performance avionics network will provide a quantum leap in spacecraft onboard science and autonomy capability for science and exploration missions.

Security for a Smarter Planet

NASA Astrophysics Data System (ADS)

Nagaratnam, Nataraj

Bit by bit, our planet is getting smarter. By this, we mean the systems that run, the way we live and work as a society. Three things have brought this about - the world is becoming instrumented, interconnected and intelligent. Given the planet is becoming instrumented and interconnected, this opens up more risks that need to be managed. Escalating security and privacy concerns along with a renewed focus on organizational oversight are driving governance, risk management and compliance (GRC) to the forefront of the business. Compliance regulations have increasingly played a larger role by attempting to establish processes and controls that mitigate the internal and external risks organizations have today. To effectively meet the requirements of GRC, companies must prove that they have strong and consistent controls over who has access to critical applications and data.

Electrode and method of interconnection sintering on an electrode of an electrochemical cell

DOEpatents

Ruka, R.J.; Kuo, L.J.H.

1994-01-11

An electrode structure is made by applying a base layer of doped LaCrO[sub 3] particles on a portion of an electrode and then coating the particles with a top layer composition such as CaO+Al[sub 2]O[sub 3], SrO+Al[sub 2]O[sub 3], or BaO+Al[sub 2]O[sub 3], and then heating the composition for a time effective to melt the composition and allow it to fill any open porosity in the base layer of doped LaCrO[sub 3] to form an interconnection, after which solid oxide electrolyte can be applied to the remaining portion of the electrode and the electrolyte can be covered with a cermet exterior electrode. 2 figures.

A packet switched communications system for GRO

NASA Astrophysics Data System (ADS)

Husain, Shabu; Yang, Wen-Hsing; Vadlamudi, Rani; Valenti, Joseph

1993-11-01

This paper describes the packet switched Instrumenters Communication System (ICS) that was developed for the Command Management Facility at GSFC to support the Gamma Ray Observatory (GRO) spacecraft. The GRO ICS serves as a vital science data acquisition link to the GRO scientists to initiate commands for their spacecraft instruments. The system is ready to send and receive messages at any time, 24 hours a day and seven days a week. The system is based on X.25 and the International Standard Organization's (ISO) 7-layer Open Systems Interconnection (OSI) protocol model and has client and server components. The components of the GRO ICS are discussed along with how the Communications Subsystem for Interconnection (CSFI) and Network Control Program Packet Switching Interface (NPSI) software are used in the system.

Electrode and method of interconnection sintering on an electrode of an electrochemical cell

DOEpatents

Ruka, Roswell J.; Kuo, Lewis J. H.

1994-01-01

An electrode structure (10) is made by applying a base layer of doped LaCrO.sub.3 particles on a portion of an electrode (16) and then coating the particles with a top layer composition such as CaO+Al.sub.2 O.sub.3, SrO+Al.sub.2 O.sub.3, or BaO+Al.sub.2 O.sub.3, and then heating the composition for a time effective to melt the composition and allow it to fill any open porosity in the base layer of doped LaCrO.sub.3 to form an interconnection (26), after which solid oxide electrolyte (18) can be applied to the remaining portion of the electrode (16) and the electrolyte (18) can be covered with a cermet exterior electrode (20).

Contextualizing Technology in the Classroom via Remote Access: Using Space Exploration Themes and Scanning Electron Microscopy as Tools to Promote Engagement in Geology/Chemistry Experiments

ERIC Educational Resources Information Center

Rodriguez, Brandon; Jaramillo, Veronica; Wolf, Vanessa; Bautista, Esteban; Portillo, Jennifer; Brouke, Alexandra; Min, Ashley; Melendez, Andrea; Amann, Joseph; Pena-Francesch, Abdon; Ashcroft, Jared

2018-01-01

A multidisciplinary science experiment was performed in K-12 classrooms focusing on the interconnection between technology with geology and chemistry. The engagement and passion for science of over eight hundred students across twenty-one classrooms, utilizing a combination of hands-on activities using relationships between Earth and space rock…

Common pressure vessel development for the nickel hydrogen technology

NASA Technical Reports Server (NTRS)

Holleck, G.

1981-01-01

The design of a pressure vessel nickel hydrogen cell is described. The cell has the following key features: it eliminates electrolyte bridging; provides for independent electrolyte management for each unit stack; provides for independent oxygen management for each unit stack; has good heat dissipation; has a mechanically sound and practical interconnection; and has the maximum in common with state of the art individual pressure vessel technology.

Vertical cavity surface emitting lasers based on InP and related compounds -- Bottleneck and corkscrew

DOE Office of Scientific and Technical Information (OSTI.GOV)

Iga, K.

1996-12-31

Vertical optical interconnects of LSI chips and circuit boards and multiple fiber systems may be the most interesting field related to SE lasers. From this point of view, the device should be small as possible. The future process technology for it including epitaxy and etching will drastically change the situation of SE lasers. Dome optical technologies are already introduced in various subsystems, but the arrayed microoptic technology would be very helpful for advanced systems.

Thermoelectric Device Fabrication Using Thermal Spray and Laser Micromachining

NASA Astrophysics Data System (ADS)

Tewolde, Mahder; Fu, Gaosheng; Hwang, David J.; Zuo, Lei; Sampath, Sanjay; Longtin, Jon P.

2016-02-01

Thermoelectric generators (TEGs) are solid-state devices that convert heat directly into electricity. They are used in many engineering applications such as vehicle and industrial waste-heat recovery systems to provide electrical power, improve operating efficiency and reduce costs. State-of-art TEG manufacturing is based on prefabricated materials and a labor-intensive process involving soldering, epoxy bonding, and mechanical clamping for assembly. This reduces their durability and raises costs. Additive manufacturing technologies, such as thermal spray, present opportunities to overcome these challenges. In this work, TEGs have been fabricated for the first time using thermal spray technology and laser micromachining. The TEGs are fabricated directly onto engineering component surfaces. First, current fabrication techniques of TEGs are presented. Next, the steps required to fabricate a thermal spray-based TEG module, including the formation of the metallic interconnect layers and the thermoelectric legs are presented. A technique for bridging the air gap between two adjacent thermoelectric elements for the top layer using a sacrificial filler material is also demonstrated. A flat 50.8 mm × 50.8 mm TEG module is fabricated using this method and its performance is experimentally characterized and found to be in agreement with expected values of open-circuit voltage based on the materials used.

From STEM to STEAM: Toward a Human-Centered Education

NASA Technical Reports Server (NTRS)

Boy, Guy A.

2013-01-01

The 20th century was based on local linear engineering of complicated systems. We made cars, airplanes and chemical plants for example. The 21st century has opened a new basis for holistic non-linear design of complex systems, such as the Internet, air traffic management and nanotechnologies. Complexity, interconnectivity, interaction and communication are major attributes of our evolving society. But, more interestingly, we have started to understand that chaos theories may be more important than reductionism, to better understand and thrive on our planet. Systems need to be investigated and tested as wholes, which requires a cross-disciplinary approach and new conceptual principles and tools. Consequently, schools cannot continue to teach isolated disciplines based on simple reductionism. Science; Technology, Engineering, and Mathematics (STEM) should be integrated together with the Arts1 to promote creativity together with rationalization, and move to STEAM (with an "A" for Arts). This new concept emphasizes the possibility of longer-term socio-technical futures instead of short-term financial predictions that currently lead to uncontrolled economies. Human-centered design (HCD) can contribute to improving STEAM education technologies, systems and practices. HCD not only provides tools and techniques to build useful and usable things, but also an integrated approach to learning by doing, expressing and critiquing, exploring possible futures, and understanding complex systems.

Ontobee: A linked ontology data server to support ontology term dereferencing, linkage, query and integration

PubMed Central

Ong, Edison; Xiang, Zuoshuang; Zhao, Bin; Liu, Yue; Lin, Yu; Zheng, Jie; Mungall, Chris; Courtot, Mélanie; Ruttenberg, Alan; He, Yongqun

2017-01-01

Linked Data (LD) aims to achieve interconnected data by representing entities using Unified Resource Identifiers (URIs), and sharing information using Resource Description Frameworks (RDFs) and HTTP. Ontologies, which logically represent entities and relations in specific domains, are the basis of LD. Ontobee (http://www.ontobee.org/) is a linked ontology data server that stores ontology information using RDF triple store technology and supports query, visualization and linkage of ontology terms. Ontobee is also the default linked data server for publishing and browsing biomedical ontologies in the Open Biological Ontology (OBO) Foundry (http://obofoundry.org) library. Ontobee currently hosts more than 180 ontologies (including 131 OBO Foundry Library ontologies) with over four million terms. Ontobee provides a user-friendly web interface for querying and visualizing the details and hierarchy of a specific ontology term. Using the eXtensible Stylesheet Language Transformation (XSLT) technology, Ontobee is able to dereference a single ontology term URI, and then output RDF/eXtensible Markup Language (XML) for computer processing or display the HTML information on a web browser for human users. Statistics and detailed information are generated and displayed for each ontology listed in Ontobee. In addition, a SPARQL web interface is provided for custom advanced SPARQL queries of one or multiple ontologies. PMID:27733503

NSI customer service representatives and user support office: NASA Science Internet

NASA Technical Reports Server (NTRS)

1991-01-01

The NASA Science Internet, (NSI) was established in 1987 to provide NASA's Offices of Space Science and Applications (OSSA) missions with transparent wide-area data connectivity to NASA's researchers, computational resources, and databases. The NSI Office at NASA/Ames Research Center has the lead responsibility for implementing a total, open networking program to serve the OSSA community. NSI is a full-service communications provider whose services include science network planning, network engineering, applications development, network operations, and network information center/user support services. NSI's mission is to provide reliable high-speed communications to the NASA science community. To this end, the NSI Office manages and operates the NASA Science Internet, a multiprotocol network currently supporting both DECnet and TCP/IP protocols. NSI utilizes state-of-the-art network technology to meet its customers' requirements. THe NASA Science Internet interconnects with other national networks including the National Science Foundation's NSFNET, the Department of Energy's ESnet, and the Department of Defense's MILNET. NSI also has international connections to Japan, Australia, New Zealand, Chile, and several European countries. NSI cooperates with other government agencies as well as academic and commercial organizations to implement networking technologies which foster interoperability, improve reliability and performance, increase security and control, and expedite migration to the OSI protocols.

Symmetric miniaturized heating system for active microelectronic devices.

PubMed

McCracken, Michael; Mayer, Michael; Jourard, Isaac; Moon, Jeong-Tak; Persic, John

2010-07-01

To qualify interconnect technologies such as microelectronic fine wire bonds for mass production of integrated circuit (IC) packages, it is necessary to perform accelerated aging tests, e.g., to age a device at an elevated temperature or to subject the device to thermal cycling and measure the decrease of interconnect quality. There are downsides to using conventional ovens for this as they are relatively large and have relatively slow temperature change rates, and if electrical connections are required between monitoring equipment and the device being heated, they must be located inside the oven and may be aged by the high temperatures. Addressing these downsides, a miniaturized heating system (minioven) is presented, which can heat individual IC packages containing the interconnects to be tested. The core of this system is a piece of copper cut from a square shaped tube with high resistance heating wire looped around it. Ceramic dual in-line packages are clamped against either open end of the core. One package contains a Pt100 temperature sensor and the other package contains the device to be aged placed in symmetry to the temperature sensor. According to the temperature detected by the Pt100, a proportional-integral-derivative controller adjusts the power supplied to the heating wire. The system maintains a dynamic temperature balance with the core hot and the two symmetric sides with electrical connections to the device under test at a cooler temperature. Only the face of the package containing the device is heated, while the socket holding it remains below 75 degrees C when the oven operates at 200 degrees C. The minioven can heat packages from room temperature up to 200 degrees C in less than 5 min and maintain this temperature at 28 W power. During long term aging, a temperature of 200 degrees C was maintained for 1120 h with negligible resistance change of the heating wires after 900 h (heating wire resistance increased 0.2% over the final 220 h). The device is also subjected to 5700 thermal cycles between 55 and 195 degrees C, demonstrating reliability under thermal cycling.

Cultural Legacy and Shared Musical Heritage: Past, Present, and Future of a Musicological and Pedagogical Research Project for Teacher Training

ERIC Educational Resources Information Center

Barrios Manzano, Pilar

2016-01-01

This article presents a research project that began three decades ago in the Faculty of Teacher Training on the Cáceres Campus of the University of Extremadura (Spain) and that continues opening new prospects through new interconnected approaches. Many researchers from different universities throughout Spain and Latin America have joined this…

Infrared-enhanced TV for fire detection

NASA Technical Reports Server (NTRS)

Hall, J. R.

1978-01-01

Closed-circuit television is superior to conventional smoke or heat sensors for detecting fires in large open spaces. Single TV camera scans entire area, whereas many conventional sensors and maze of interconnecting wiring might be required to get same coverage. Camera is monitored by person who would trip alarm if fire were detected, or electronic circuitry could process camera signal for fully-automatic alarm system.

Application Level Protocol Development for Library and Information Science Applications. Volume 1: Service Definition. Volume 2: Protocol Specification. Report No. TG.1.5; TG.50.

ERIC Educational Resources Information Center

Aagaard, James S.; And Others

This two-volume document specifies a protocol that was developed using the Reference Model for Open Systems Interconnection (OSI), which provides a framework for communications within a heterogeneous network environment. The protocol implements the features necessary for bibliographic searching, record maintenance, and mail transfer between…

SCSI Communication Test Bus

NASA Technical Reports Server (NTRS)

Hua, Chanh V.; D'Ambrose, John J.; Jaworski, Richard C.; Halula, Elaine M.; Thornton, David N.; Heligman, Robert L.; Turner, Michael R.

1990-01-01

Small Computer System Interface (SCSI) communication test bus provides high-data-rate, standard interconnection enabling communication among International Business Machines (IBM) Personal System/2 Micro Channel, other devices connected to Micro Channel, test equipment, and host computer. Serves primarily as nonintrusive input/output attachment to PS/2 Micro Channel bus, providing rapid communication for debugger. Opens up possibility of using debugger in real-time applications.

Dynamics on Networks of Manifolds

NASA Astrophysics Data System (ADS)

DeVille, Lee; Lerman, Eugene

2015-03-01

We propose a precise definition of a continuous time dynamical system made up of interacting open subsystems. The interconnections of subsystems are coded by directed graphs. We prove that the appropriate maps of graphs called graph fibrations give rise to maps of dynamical systems. Consequently surjective graph fibrations give rise to invariant subsystems and injective graph fibrations give rise to projections of dynamical systems.

Heterogeniety and Heterarchy: How far can network analyses in Earth and space sciences?

NASA Astrophysics Data System (ADS)

Prabhu, A.; Fox, P. A.; Eleish, A.; Li, C.; Pan, F.; Zhong, H.

2017-12-01

The vast majority of explorations of Earth systems are limited in their ability to effectively explore the most important (often most difficult) problems because they are forced to interconnect at the data-element, or syntactic, level rather than at a higher scientific, or conceptual/ semantic, level. Recent successes in the application of complex network theory and algorithms to minerology, fossils and proteins over billions of years of Earth's history, raise expectations that more general graph-based approaches offer the opportunity for new discoveries = needles instead of haystacks. In the past 10 years in the natural sciences there has substantial progress in providing both specialists and non-specialists the ability to describe in machine readable form, geophysical quantities and relations among them in meaningful and natural ways, effectively breaking the prior syntax barrier. The corresponding open-world semantics and reasoning provide higher-level interconnections. That is, semantics provided around the data structures, using open-source tools, allow for discovery at the knowledge level. This presentation will cover the fundamentals of data-rich network analyses for geosciences, provide illustrative examples in mineral evolution and offer future paths for consideration.

Network Payload Integration for the Scan-Eagle UAV

DTIC Science & Technology

2007-12-01

With the increasing maturity of MESH network technology, it is inevitable that we exploit the synergistic capabilities in networking of autonomous ... vehicles . The interconnectivity enables the sharing or dissemination of information between various nodes and has the capability to enhance

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2010 CFR

2010-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2011 CFR

2011-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

36 CFR § 1194.4 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-07-01

... description. Assistive technology. Any item, piece of equipment, or system, whether acquired commercially... equipment or interconnected system or subsystem of equipment, that is used in the creation, conversion, or... information. For example, HVAC (heating, ventilation, and air conditioning) equipment such as thermostats or...

36 CFR 1194.4 - Definitions.

Code of Federal Regulations, 2012 CFR

2012-07-01

... technology. Any item, piece of equipment, or system, whether acquired commercially, modified, or customized... interconnected system or subsystem of equipment, that is used in the creation, conversion, or duplication of data..., display, switching, interchange, transmission, or reception of data or information. For example, HVAC...

12 CFR 1072.103 - Definitions.

Code of Federal Regulations, 2014 CFR

2014-01-01

... means information technology and any equipment or interconnected system or subsystem of equipment that... data or information. For example, HVAC (heating, ventilation, and air conditioning) equipment such as... of major bodily functions of the immune system, special sense organs and skin, normal cell growth...

12 CFR 1072.103 - Definitions.

Code of Federal Regulations, 2013 CFR

2013-01-01

... means information technology and any equipment or interconnected system or subsystem of equipment that... data or information. For example, HVAC (heating, ventilation, and air conditioning) equipment such as... of major bodily functions of the immune system, special sense organs and skin, normal cell growth...

Note: cryogenic microstripline-on-Kapton microwave interconnects.

PubMed

Harris, A I; Sieth, M; Lau, J M; Church, S E; Samoska, L A; Cleary, K

2012-08-01

Simple broadband microwave interconnects are needed for increasing the size of focal plane heterodyne radiometer arrays. We have measured loss and crosstalk for arrays of microstrip transmission lines in flex circuit technology at 297 and 77 K, finding good performance to at least 20 GHz. The dielectric constant of Kapton substrates changes very little from 297 to 77 K, and the electrical loss drops. The small cross-sectional area of metal in a printed circuit structure yields overall thermal conductivities similar to stainless steel coaxial cable. Operationally, the main performance tradeoffs are between crosstalk and thermal conductivity. We tested a patterned ground plane to reduce heat flux.

Interconnected magnetic tunnel junctions for spin-logic applications

NASA Astrophysics Data System (ADS)

Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Zografos, Odysseas; Souriau, Laurent; Gavan, Khashayar Babaei; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, Morin; Sayan, Safak; Nikonov, Dmitri E.; Manipatruni, Sasikanth; Young, Ian A.; Mocuta, Dan; Radu, Iuliana P.

2018-05-01

With the rapid progress of spintronic devices, spin-logic concepts hold promises of energy-delay conscious computation for efficient logic gate operations. We report on the electrical characterization of domain walls in interconnected magnetic tunnel junctions. By means of spin-transfer torque effect, domains walls are produced at the common free layer and its propagation towards the output pillar sensed by tunneling magneto-resistance. Domain pinning conditions are studied quasi-statically showing a strong dependence on pillar size, ferromagnetic free layer width and inter-pillar distance. Addressing pinning conditions are detrimental for cascading and fan-out of domain walls across nodes, enabling the realization of domain-wall-based logic technology.

Direct generation of event-timing equations for generalized flow shop systems

NASA Astrophysics Data System (ADS)

Doustmohammadi, Ali; Kamen, Edward W.

1995-11-01

Flow shop production lines are very common in manufacturing systems such as car assemblies, manufacturing of electronic circuits, etc. In this paper, a systematic procedure is given for generating event-timing equations directly from the machine interconnections for a generalized flow shop system. The events considered here correspond to completion times of machine operations. It is assumed that the scheduling policy is cyclic (periodic). For a given flow shop system, the open connection dynamics of the machines are derived first. Then interconnection matrices characterizing the routing of parts in the system are obtained from the given system configuration. The open connection dynamics of the machines and the interconnection matrices are then combined together to obtain the overall system dynamics given by an equation of the form X(k+1) equals A(k)X(k) B(k)V(k+1) defined over the max-plus algebra. Here the state X(k) is the vector of completion times and V(k+1) is an external input vector consisting of the arrival times of parts. It is shown that if the machines are numbered in an appropriate way and the states are selected according to certain rules, the matrix A(k) will be in a special (canonical) form. The model obtained here is useful or the analysis of system behavior and for carrying out simulations. In particular, the canonical form of A(k) enables one to study system bottlenecks and the minimal cycle time during steady-state operation. The approach presented in this paper is believed to be more straightforward compared to existing max-plus algebra formulations of flow shop systems. In particular, three advantages of the proposed approach are: (1) it yields timing equations directly from the system configuration and hence there is no need to first derive a Petri net or a digraph equivalent of the system; (2) a change in the system configuration only affects the interconnection matrices and hence does not require rederiving the entire set of equations; (3) the system model is easily put into code using existing software packages such as MATLAB.

Duct closure

DOEpatents

Vowell, Kennison L.

1987-01-01

A closure for an inclined duct having an open upper end and defining downwardly extending passageway. The closure includes a cap for sealing engagement with the open upper end of the duct. Associated with the cap are an array of vertically aligned plug members, each of which has a cross-sectional area substantially conforming to the cross-sectional area of the passageway at least adjacent the upper end of the passageway. The plug members are interconnected in a manner to provide for free movement only in the plane in which the duct is inclined. The uppermost plug member is attached to the cap means and the cap means is in turn connected to a hoist means which is located directly over the open end of the duct.

Interconnects for intermediate temperature solid oxide fuel cells

NASA Astrophysics Data System (ADS)

Huang, Wenhua

Presently, one of the principal goals of solid oxide fuel cells (SOFCs) research is to reduce the stack operating temperature to between 600 and 800°C. However, one of the principal technological barriers is the non-availability of a suitable material satisfying all of the stability requirements for the interconnect. In this work two approaches for intermediate temperature SOFC interconnects have been explored. The first approach comprises an interconnect consisting of a bi-layer structure, a p-type oxide (La0.96Sr0.08MnO 2.001/LSM) layer exposed to a cathodic environment, and an n-type oxide (Y0.08Sr0.88Ti0.95Al0.05O 3-delta/YSTA) layer exposed to anodic conditions. Theoretical analysis based on the bi-layer structure has established design criteria to implement this approach. The analysis shows that the interfacial oxygen partial pressure, which determines the interconnect stability, is independent of the electronic conductivities of both layers but dependent on the oxygen ion layer interconnects, the oxygen ion conductivities of LSM and YSTA were measured as a function of temperature and oxygen partial pressure. Based on the measured data, it has been determined that if the thickness of YSTA layer is around 0.1cm, the thickness of LSM layer should be around 0.6 mum in order to maintain the stability of LSM. In a second approach, a less expensive stainless steel interconnect has been studied. However, one of the major concerns associated with the use of metallic interconnects is the development of a semi-conducting or insulating oxide scale and chromium volatility during extended exposure to the SOFC operating environment. Dense and well adhered Mn-Cu spinet oxide coatings were successfully deposited on stainless steel by an electrophoretic deposition (EPD) technique. It was found that the Mn-Cu-O coating significantly reduced the oxidation rate of the stainless steel and the volatility of chromium. The area specific resistance (ASR) of coated Crofer 22 APU is expected to he around 1.2x10 -2Ocm2 after exposure to air at 800°C for 50000 hours. This demonstrates that Crofer 22 APU with CuMn1.8O 4 coating deposited by EPD is suitable for application as interconnects in intermediate temperature SOFCs.

Integrated optical circuit engineering V; Proceedings of the Meeting, San Diego, CA, Aug. 17-20, 1987

NASA Astrophysics Data System (ADS)

Mentzer, Mark A.

Recent advances in the theoretical and practical design and applications of optoelectronic devices and optical circuits are examined in reviews and reports. Topics discussed include system and market considerations, guided-wave phenomena, waveguide devices, processing technology, lithium niobate devices, and coupling problems. Consideration is given to testing and measurement, integrated optics for fiber-optic systems, optical interconnect technology, and optical computing.

Emerging Communication Technologies (ECT) Phase 3 Final Report

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Bates, Lakesha D.; Nelson, Richard A.

2004-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB.

Slab edge insulating form system and methods

DOEpatents

Lee, Brain E [Corral de Tierra, CA; Barsun, Stephan K [Davis, CA; Bourne, Richard C [Davis, CA; Hoeschele, Marc A [Davis, CA; Springer, David A [Winters, CA

2009-10-06

A method of forming an insulated concrete foundation is provided comprising constructing a foundation frame, the frame comprising an insulating form having an opening, inserting a pocket former into the opening; placing concrete inside the foundation frame; and removing the pocket former after the placed concrete has set, wherein the concrete forms a pocket in the placed concrete that is accessible through the opening. The method may further comprise sealing the opening by placing a sealing plug or sealing material in the opening. A system for forming an insulated concrete foundation is provided comprising a plurality of interconnected insulating forms, the insulating forms having a rigid outer member protecting and encasing an insulating material, and at least one gripping lip extending outwardly from the outer member to provide a pest barrier. At least one insulating form has an opening into which a removable pocket former is inserted. The system may also provide a tension anchor positioned in the pocket former and a tendon connected to the tension anchor.

Technology-Supported Inquiry for Learning about Aquatic Ecosystems

ERIC Educational Resources Information Center

Hmelo-Silver, Cindy E.; Eberbach, Catherine; Jordan, Rebecca

2014-01-01

Understanding ecosystems is challenging, but important for becoming environmentally-literate citizens of today's society. People have difficulty considering how different components, mechanisms, and phenomena, both visible and invisible, are interconnected within ecosystems. This research presents both the design and initial testing of an…

Investigation of ball bond integrity for 0.8 mil (20 microns) diameter gold bonding wire on low k die in wire bonding technology

NASA Astrophysics Data System (ADS)

Kudtarkar, Santosh Anil

Microelectronics technology has been undergoing continuous scaling to accommodate customer driven demand for smaller, faster and cheaper products. This demand has been satisfied by using novel materials, design techniques and processes. This results in challenges for the chip connection technology and also the package technology. The focus of this research endeavor was restricted to wire bond interconnect technology using gold bonding wires. Wire bond technology is often regarded as a simple first level interconnection technique. In reality, however, this is a complex process that requires a thorough understanding of the interactions between the design, material and process variables, and their impact on the reliability of the bond formed during this process. This research endeavor primarily focused on low diameter, 0.8 mil thick (20 mum) diameter gold bonding wire. Within the scope of this research, the integrity of the ball bond formed by 1.0 mil (25 mum) and 0.8 mil (20 mum) diameter wires was compared. This was followed by the evaluation of bonds formed on bond pads having doped SiO2 (low k) as underlying structures. In addition, the effect of varying the percentage of the wire dopant, palladium and bonding process parameters (bonding force, bond time, ultrasonic energy) for 0.8 mil (20 mum) bonding wire was also evaluated. Finally, a degradation empirical model was developed to understand the decrease in the wire strength. This research effort helped to develop a fundamental understanding of the various factors affecting the reliability of a ball bond from a design (low diameter bonding wire), material (low k and bonding wire dopants), and process (wire bonding process parameters) perspective for a first level interconnection technique, namely wire bonding. The significance of this research endeavor was the systematic investigation of the ball bonds formed using 0.8 mil (20 microm) gold bonding wire within the wire bonding arena. This research addressed low k structures on 90 nm silicon technology, bonding wires with different percentage of doping element (palladium), and different levels of bonding process parameters. An empirical model to understand the high temperature effects for bonds formed using the low diameter wire was also developed.

Plastic straw: future of high-speed signaling

NASA Astrophysics Data System (ADS)

Song, Ha Il; Jin, Huxian; Bae, Hyeon-Min

2015-11-01

The ever-increasing demand for bandwidth triggered by mobile and video Internet traffic requires advanced interconnect solutions satisfying functional and economic constraints. A new interconnect called E-TUBE is proposed as a cost-and-power-effective all-electrical-domain wideband waveguide solution for high-speed high-volume short-reach communication links. The E-TUBE achieves an unprecedented level of performance in terms of bandwidth-per-carrier frequency, power, and density without requiring a precision manufacturing process unlike conventional optical/waveguide solutions. The E-TUBE exhibits a frequency-independent loss-profile of 4 dB/m and has nearly 20-GHz bandwidth over the V band. A single-sideband signal transmission enabled by the inherent frequency response of the E-TUBE renders two-times data throughput without any physical overhead compared to conventional radio frequency communication technologies. This new interconnect scheme would be attractive to parties interested in high throughput links, including but not limited to, 100/400 Gbps chip-to-chip communications.

Towards energy aware optical networks and interconnects

NASA Astrophysics Data System (ADS)

Glesk, Ivan; Osadola, Tolulope; Idris, Siti

2013-10-01

In a today's world, information technology has been identified as one of the major factors driving economic prosperity. Datacenters businesses have been growing significantly in the past few years. The equipments in these datacenters need to be efficiently connected to each other and also to the outside world in order to enable effective exchange of information. This is why there is need for highly scalable, energy savvy and reliable network connectivity infrastructure that is capable of accommodating the large volume of data being exchanged at any time within the datacenter network and the outside network in general. These devices that can ensure such effective connectivity currently require large amount of energy in order to meet up with these increasing demands. In this paper, an overview of works being done towards realizing energy aware optical networks and interconnects for datacenters is presented. Also an OCDMA approach is discussed as potential multiple access technique for future optical network interconnections. We also presented some challenges that might inhibit effective implementation of the OCDMA multiplexing scheme.

Ballistic One-Dimensional InAs Nanowire Cross-Junction Interconnects.

PubMed

Gooth, Johannes; Borg, Mattias; Schmid, Heinz; Schaller, Vanessa; Wirths, Stephan; Moselund, Kirsten; Luisier, Mathieu; Karg, Siegfried; Riel, Heike

2017-04-12

Coherent interconnection of quantum bits remains an ongoing challenge in quantum information technology. Envisioned hardware to achieve this goal is based on semiconductor nanowire (NW) circuits, comprising individual NW devices that are linked through ballistic interconnects. However, maintaining the sensitive ballistic conduction and confinement conditions across NW intersections is a nontrivial problem. Here, we go beyond the characterization of a single NW device and demonstrate ballistic one-dimensional (1D) quantum transport in InAs NW cross-junctions, monolithically integrated on Si. Characteristic 1D conductance plateaus are resolved in field-effect measurements across up to four NW-junctions in series. The 1D ballistic transport and sub-band splitting is preserved for both crossing-directions. We show that the 1D modes of a single injection terminal can be distributed into multiple NW branches. We believe that NW cross-junctions are well-suited as cross-directional communication links for the reliable transfer of quantum information as required for quantum computational systems.

Cybersecurity through Real-Time Distributed Control Systems

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kisner, Roger A; Manges, Wayne W; MacIntyre, Lawrence Paul

2010-04-01

Critical infrastructure sites and facilities are becoming increasingly dependent on interconnected physical and cyber-based real-time distributed control systems (RTDCSs). A mounting cybersecurity threat results from the nature of these ubiquitous and sometimes unrestrained communications interconnections. Much work is under way in numerous organizations to characterize the cyber threat, determine means to minimize risk, and develop mitigation strategies to address potential consequences. While it seems natural that a simple application of cyber-protection methods derived from corporate business information technology (IT) domain would lead to an acceptable solution, the reality is that the characteristics of RTDCSs make many of those methods inadequatemore » and unsatisfactory or even harmful. A solution lies in developing a defense-in-depth approach that ranges from protection at communications interconnect levels ultimately to the control system s functional characteristics that are designed to maintain control in the face of malicious intrusion. This paper summarizes the nature of RTDCSs from a cybersecurity perspec tive and discusses issues, vulnerabilities, candidate mitigation approaches, and metrics.« less

The Unification of Space Qualified Integrated Circuits by Example of International Space Project GAMMA-400

NASA Astrophysics Data System (ADS)

Bobkov, S. G.; Serdin, O. V.; Arkhangelskiy, A. I.; Arkhangelskaja, I. V.; Suchkov, S. I.; Topchiev, N. P.

The problem of electronic component unification at the different levels (circuits, interfaces, hardware and software) used in space industry is considered. The task of computer systems for space purposes developing is discussed by example of scientific data acquisition system for space project GAMMA-400. The basic characteristics of high reliable and fault tolerant chips developed by SRISA RAS for space applicable computational systems are given. To reduce power consumption and enhance data reliability, embedded system interconnect made hierarchical: upper level is Serial RapidIO 1x or 4x with rate transfer 1.25 Gbaud; next level - SpaceWire with rate transfer up to 400 Mbaud and lower level - MIL-STD-1553B and RS232/RS485. The Ethernet 10/100 is technology interface and provided connection with the previously released modules too. Systems interconnection allows creating different redundancy systems. Designers can develop heterogeneous systems that employ the peer-to-peer networking performance of Serial RapidIO using multiprocessor clusters interconnected by SpaceWire.

Device and circuit-level performance of carbon nanotube field-effect transistor with benchmarking against a nano-MOSFET

PubMed Central

2012-01-01

The performance of a semiconducting carbon nanotube (CNT) is assessed and tabulated for parameters against those of a metal-oxide-semiconductor field-effect transistor (MOSFET). Both CNT and MOSFET models considered agree well with the trends in the available experimental data. The results obtained show that nanotubes can significantly reduce the drain-induced barrier lowering effect and subthreshold swing in silicon channel replacement while sustaining smaller channel area at higher current density. Performance metrics of both devices such as current drive strength, current on-off ratio (Ion/Ioff), energy-delay product, and power-delay product for logic gates, namely NAND and NOR, are presented. Design rules used for carbon nanotube field-effect transistors (CNTFETs) are compatible with the 45-nm MOSFET technology. The parasitics associated with interconnects are also incorporated in the model. Interconnects can affect the propagation delay in a CNTFET. Smaller length interconnects result in higher cutoff frequency. PMID:22901374

Performance evaluation of time-aware enhanced software defined networking (TeSDN) for elastic data center optical interconnection.

PubMed

Yang, Hui; Zhang, Jie; Zhao, Yongli; Ji, Yuefeng; Li, Hui; Lin, Yi; Li, Gang; Han, Jianrui; Lee, Young; Ma, Teng

2014-07-28

Data center interconnection with elastic optical networks is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. We previously implemented enhanced software defined networking over elastic optical network for data center application [Opt. Express 21, 26990 (2013)]. On the basis of it, this study extends to consider the time-aware data center service scheduling with elastic service time and service bandwidth according to the various time sensitivity requirements. A novel time-aware enhanced software defined networking (TeSDN) architecture for elastic data center optical interconnection has been proposed in this paper, by introducing a time-aware resources scheduling (TaRS) scheme. The TeSDN can accommodate the data center services with required QoS considering the time dimensionality, and enhance cross stratum optimization of application and elastic optical network stratums resources based on spectrum elasticity, application elasticity and time elasticity. The overall feasibility and efficiency of the proposed architecture is experimentally verified on our OpenFlow-based testbed. The performance of TaRS scheme under heavy traffic load scenario is also quantitatively evaluated based on TeSDN architecture in terms of blocking probability and resource occupation rate.

Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress

NASA Astrophysics Data System (ADS)

Chen, Po-Ying; Kung, Heng-Yu; Lai, Yi-Shao; Hsiung Tsai, Ming; Yeh, Wen-Kuan

2008-02-01

In this work, we present a novel approach and method for elucidating the characteristics of wafer-level chip-scale packages (WLCSPs) for electromigration (EM) tests. The die in WLCSP was directly attached to the substrate via a soldered interconnect. The shrinking of the area of the die that is available for power, and the solder bump also shrinks the volume and increases the density of electrons for interconnect efficiency. The bump current density now approaches to 106 A/cm2, at which point the EM becomes a significant reliability issue. As known, the EM failure depends on numerous factors, including the working temperature and the under bump metallization (UBM) thickness. A new interconnection geometry is adopted extensively with moderate success in overcoming larger mismatches between the displacements of components during current and temperature changes. Both environments and testing parameters for WLCSP are increasingly demanded. Although failure mechanisms are considered to have been eliminated or at least made manageable, new package technologies are again challenging its process, integrity and reliability. WLCSP technology was developed to eliminate the need for encapsulation to ensure compatibility with smart-mount technology (SMT). The package has good handing properties but is now facing serious reliability problems. In this work, we investigated the reliability of a WLCSP subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 °C. A very strong correlation exists between the mean time to failure (MTTF) of the WLCSP test vehicle and the mean current density that is carried by a solder joint. A series of current densities were applied to the WLCSP architecture; Black's power law was employed in a failure mode simulation. Additionally, scanning electron microscopy (SEM) was adopted to determine the differences existing between high- and low-current-density failure modes.

Government Open Systems Interconnection Profile (GOSIP) Transition Strategy

DTIC Science & Technology

1993-09-01

it explores some of the GOSIP protocol details and discusses the process by which standards organizations have developed their...version 1 and 2. Additionally, it explores some of the GOSIP protocol details and discusses the process by which standards organizations have developed ...ORGANIZATION OF STUDY 1. The Standards Process Chapter II describes the process whereby standards are developed and adopted by the ISO and how the

Network Modeling and Simulation Environment (NEMSE)

DTIC Science & Technology

2012-07-01

the NEMSE program investigated complex emulation techniques and selected compatible emulation techniques for all OSI network stack layers. Other...EMULAB; 2) Completed the selection of compatible emulation techniques that allows working with all layers of the Open System Interconnect ( OSI ...elements table, Figure 3, reconciles the various elements of NEMSE against the OSI stack and other functions. OSI Layer or Function EM UL AB NS 2

Foam For Filtering

NASA Technical Reports Server (NTRS)

1978-01-01

Like nature's honeycomb, foam is a structure of many-sided cells, apparently solid but actually only three percent material and 97 percent air. Foam is made by a heat-producing chemical reaction which expands a plastic material in a manner somewhat akin to the heat-induced rising of a loaf of bread. The resulting structure of interconnected cells is flexible yet strong and extremely versatile in applicati6n. Foam can, for example, be a sound absorber in one form, while in another it allows sound to pass through it. It can be a very soft powder puff material and at the same time a highly abrasive scrubber. A sampling of foam uses includes stereo speaker grilles, applying postage meter ink, filtering lawnmower carburetor air; deadening noise in trucks and tractors, applying cosmetics, releasing fabric softener and antistatic agents in home clothes dryers, painting, filtering factory heating and ventilating systems, shining shoes, polishing cars, sponge-mopping floors, acting as pre-operative surgical scrubbers-the list is virtually limitless. The process by which foam is made produces "windows," thin plastic membranes connecting the cell walls. Windowed foam is used in many applications but for certain others-filtering, for example-it is desirable to have a completely open network. Scott Paper Company's Foam Division, Chester, Pennsylvania, improved a patented method of "removing the windows," to create an open structure that affords special utility in filtering applications. NASA technology contributed to Scott's improvement.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Emerging Communication Technologies (ECT) Phase 2 Report. Volume 3; Ultra Wideband (UWB) Technology

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Chiodini, Robert; Nelson, Richard A.; Huang, PoTien; Kruhm, David A.

2003-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB

Development of a Thin Film Solar Cell Interconnect for the Powersphere Concept

NASA Technical Reports Server (NTRS)

Simburger, Edward J.; Matsumoto, James H.; Giants, Thomas W.; Garcia, Alexander, III; Liu, Simon; Rawal, Suraj P.; Perry, Alan R.; Marshall, Craig H.; Lin, John K.; Scarborough, Stephen

2003-01-01

Progressive development of microsatellite technologies has resulted in increased demand for lightweight electrical power subsystems including solar arrays. The use of thin film photovoltaics has been recognized as a key solution to meet the power needs. The lightweight cells can generate sufficient power and still meet critical mass requirements. Commercially available solar cells produced on lightweight substrates are being studied as an option to fulfill the power needs. The commercially available solar cells are relatively inexpensive and have a high payoff potential. Commercially available thin film solar cells are primarily being produced for terrestrial applications. The need to convert the solar cell from a terrestrial to a space compatible application is the primary challenge. Solar cell contacts, grids and interconnects need to be designed to be atomic oxygen resistant and withstand rapid thermal cycling environments. A mechanically robust solar cell interconnect is also required in order to withstand handling during fabrication and survive during launch. The need to produce the solar cell interconnects has been identified as a primary goal of the Powersphere program and is the topic of this paper. Details of the trade study leading to the final design involving the solar cell wrap around contact, flex blanket, welding process, and frame will be presented at the conference.

RapidIO as a multi-purpose interconnect

NASA Astrophysics Data System (ADS)

Baymani, Simaolhoda; Alexopoulos, Konstantinos; Valat, Sébastien

2017-10-01

RapidIO (http://rapidio.org/) technology is a packet-switched high-performance fabric, which has been under active development since 1997. Originally meant to be a front side bus, it developed into a system level interconnect which is today used in all 4G/LTE base stations world wide. RapidIO is often used in embedded systems that require high reliability, low latency and scalability in a heterogeneous environment - features that are highly interesting for several use cases, such as data analytics and data acquisition (DAQ) networks. We will present the results of evaluating RapidIO in a data analytics environment, from setup to benchmark. Specifically, we will share the experience of running ROOT and Hadoop on top of RapidIO. To demonstrate the multi-purpose characteristics of RapidIO, we will also present the results of investigating RapidIO as a technology for high-speed DAQ networks using a generic multi-protocol event-building emulation tool. In addition we will present lessons learned from implementing native ports of CERN applications to RapidIO.

X-ray photoemission spectromicroscopy of titanium silicide formation in patterned microstructures

DOE Office of Scientific and Technical Information (OSTI.GOV)

Singh, S.; Solak, H.; Cerrina, F.

1997-04-01

Titanium silicide has the lowest resistivity of all the refractory metal silicides and has good thermal stability as well as excellent compatibility with Al metallization. It is used as an intermediate buffer layer between W vias and the Si substrate to provide good electrical contact in ULSI technology, whose submicron patterned features form the basis of the integrated circuits of today and tomorrow, in the self aligned silicide (salicide) formation process. TiSi{sub 2} exists in two phases: a metastable C49 base-centered orthorhombic phase with specific resistivity of 60-90 {mu}{Omega}-cm that is formed at a lower temperature (formation anneal) and themore » stable 12-15 {mu}{Omega}-cm resistivity face-centered orthorhombic C54 phase into which C49 is transformed with a higher temperature (conversion anneal) step. C54 is clearly the target for low resistivity VLSI interconnects. However, it has been observed that when dimensions shrink below 1/mic (or when the Ti thickness drops below several hundred angstroms), the transformation of C49 into C54 is inhibited and agglomeration often occurs in fine lines at high temperatures. This results in a rise in resistivity due to incomplete transformation to C54 and because of discontinuities in the interconnect line resulting from agglomeration. Spectromicroscopy is an appropriate tool to study the evolution of the TiSi2 formation process because of its high resolution chemical imaging ability which can detect bonding changes even in the absence of changes in the relative amounts of species and because of the capability of studying thick {open_quotes}as is{close_quotes} industrial samples.« less

An active locking mechanism for assembling 3D micro structures

NASA Astrophysics Data System (ADS)

Zhang, Ping; Mayyas, Mohammad; Lee, Woo Ho; Popa, Dan; Shiakolas, Panos; Stephanou, Harry; Chiao, J. C.

2007-01-01

Microassembly is an enabling technology to build 3D microsystems consisting of microparts made of different materials and processes. Multiple microparts can be connected together to construct complicated in-plane and out-of-plane microsystems by using compliant mechanical structures such as micro hinges and snap fasteners. This paper presents design, fabrication, and assembly of an active locking mechanism that provides mechanical and electrical interconnections between mating microparts. The active locking mechanism is composed of thermally actuated Chevron beams and sockets. Assembly by means of an active locking mechanism offers more flexibility in designing microgrippers as it reduces or minimizes mating force, which is one of the main reasons causing fractures in a microgripper during microassembly operation. Microgrippers, microparts, and active locking mechanisms were fabricated on a silicon substrate using the deep reactive ion etching (DRIE) processes with 100-um thick silicon on insulator (SOI) wafers. A precision robotic assembly platform with a dual microscope vision system was used to automate the manipulation and assembly processes of microparts. The assembly sequence includes (1) tether breaking and picking up of a micropart by using an electrothermally actuated microgripper, (2) opening of a socket area for zero-force insertion, (3) a series of translation and rotation of a mating micropart to align it onto the socket, (4) insertion of a micropart into the socket, and (5) deactivation and releasing of locking fingers. As a result, the micropart was held vertically to the substrate and locked by the compliance of Chevron beams. Microparts were successfully assembled using the active locking mechanism and the measured normal angle was 89.2°. This active locking mechanism provides mechanical and electrical interconnections, and it can potentially be used to implement a reconfigurable microrobot that requires complex assembly of multiple links and joints.

Strategy of Irrigation Branch in Russia

NASA Astrophysics Data System (ADS)

Zeyliger, A.; Ermolaeva, O.

2012-04-01

At this moment, at the starting time of the program on restoration of a large irrigation in Russia till 2020, the scientific and technical community of irrigation branch does not have clear vision on how to promote a development of irrigated agriculture and without repeating of mistakes having a place in the past. In many respects absence of a vision is connected to serious backlog of a scientific and technical and informational and technological level of development of domestic irrigation branch from advanced one. Namely such level of development is necessary for the resolving of new problems in new conditions of managing, and also for adequate answers to new challenges from climate and degradation of ground & water resources, as well as a rigorous requirement from an environment. In such important situation for irrigation branch when it is necessary quickly generate a scientific and technical politics for the current decade for maintenance of translation of irrigated agriculture in the Russian Federation on a new highly effective level of development, in our opinion, it is required to carry out open discussion of needs and requirements as well as a research for a adequate solutions. From political point of view a framework organized in FP6 DESIRE 037046 project is an example of good practice that can serve as methodical approach how to organize and develop such processes. From technical point of view a technology of operational management of irrigation at large scale presents a prospective alternative to the current type of management based on planning. From point of view ICT operational management demands creation of a new platform for the professional environment of activity. This platform should allow to perceive processes in real time, at their partial predictability on signals of a straight line and a feedback, within the framework of variability of decision making scenarious, at high resolution and the big ex-awning of sensor controls and the gauges supervising parameters of system, fast proper response to changes in behaviour of controlled system, and all this on a firm support on the creative professional approach of the staff to execution of the professional duties. Development of such professional environment cannot be solved for a short time interval and within the framework of several projects, and will demand the interconnected and purposeful actions directed on extensive information - technological development of administrative and operational segments of irrigation branch. For this purpose it is necessary to develop, create and use the interconnected elements of information - technological developments shown by us in four directions and entitled: 1) Technologies; 2) Infrastructure; 3) Staff; 4) Tools. These four elements will be discussed in a contribution.

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV).

PubMed

Shen, Wen-Wei; Chen, Kuan-Neng

2017-12-01

3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration system. TSV fabrication steps, such as etching, isolation, metallization processes, and related failure modes, as well as other characterizations are discussed in this invited review paper.

Moodle 2.0 Web Services Layer and Its New Application Contexts

NASA Astrophysics Data System (ADS)

Conde, Miguel Ángel; Aguilar, Diego Alonso Gómez; Del Pozo de Dios, Alberto; Peñalvo, Francisco José García

Owing to the intrinsic relation among actual education and new technologies, it results essential the fact to found the new ways to satisfy both sides of the modern eLearning platforms, the needs of students and tutors and the enough technologies to support it. Consequently, the possibility to interconnect the LMS with other external applications to enrich and strengthen the comprehension of learning process is one of the principal paths to follow.

Interconnected or disconnected? Promotion of mental health and prevention of mental disorder in the digital age

PubMed Central

Hayes, Joseph F; Maughan, Daniel L; Grant-Peterkin, Hugh

2016-01-01

Summary To date there have been few peer-reviewed studies on the feasibility, acceptability and effectiveness of digital technologies for mental health promotion and disorder prevention. Any evaluation of these evolving technologies is complicated by a lack of understanding about the specific risks and possible benefits of the many forms of internet use on mental health. In order to adequately meet the mental health needs of today’s society, psychiatry must engage in rigorous assessment of the impact of digital technologies. PMID:26932479

Capacity Expansion Modeling for Storage Technologies

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hale, Elaine; Stoll, Brady; Mai, Trieu

2017-04-03

The Resource Planning Model (RPM) is a capacity expansion model designed for regional power systems and high levels of renewable generation. Recent extensions capture value-stacking for storage technologies, including batteries and concentrating solar power with storage. After estimating per-unit capacity value and curtailment reduction potential, RPM co-optimizes investment decisions and reduced-form dispatch, accounting for planning reserves; energy value, including arbitrage and curtailment reduction; and three types of operating reserves. Multiple technology cost scenarios are analyzed to determine level of deployment in the Western Interconnection under various conditions.

Interconnected or disconnected? Promotion of mental health and prevention of mental disorder in the digital age.

PubMed

Hayes, Joseph F; Maughan, Daniel L; Grant-Peterkin, Hugh

2016-03-01

To date there have been few peer-reviewed studies on the feasibility, acceptability and effectiveness of digital technologies for mental health promotion and disorder prevention. Any evaluation of these evolving technologies is complicated by a lack of understanding about the specific risks and possible benefits of the many forms of internet use on mental health. To adequately meet the mental health needs of today's society, psychiatry must engage in rigorous assessment of the impact of digital technologies. © The Royal College of Psychiatrists 2016.

Welding interconnects to 50-micron silicon solar cells

NASA Technical Reports Server (NTRS)

Patterson, R. E.; Mesch, H. G.

1983-01-01

A program was conducted to develop technologies for welding interconnects to 50-micron thick, 2 by 2 cm solar cells obtained from three suppliers. The cells were characterized with respect to electrical performance, cell thickness, silver contact thickness, contact waviness, bowing, and fracture strength. Weld schedules were independently developed for each of the three cell types and were coincidentally identical. Thermal shock tests (100 cycles from 100 deg to -180 deg C) were performed on 16-cell coupons for each cell type without any weld joint failures or electrical degradation. Three 48-cell modules (one for each cell type) were assembled with 50-micron thick cells, frosted fused silica covers, silver clad Invar interconnectors, and Kapton substrates.

IEEE 1547 Standards Advancing Grid Modernization

DOE Office of Scientific and Technical Information (OSTI.GOV)

Basso, Thomas; Chakraborty, Sudipta; Hoke, Andy

Technology advances including development of advanced distributed energy resources (DER) and grid-integrated operations and controls functionalities have surpassed the requirements in current standards and codes for DER interconnection with the distribution grid. The full revision of IEEE Standards 1547 (requirements for DER-grid interconnection and interoperability) and 1547.1 (test procedures for conformance to 1547) are establishing requirements and best practices for state-of-the-art DER including variable renewable energy sources. The revised standards will also address challenges associated with interoperability and transmission-level effects, in addition to strictly addressing the distribution grid needs. This paper provides the status and future direction of the ongoingmore » development focus for the 1547 standards.« less

Depth-dependent groundwater quality sampling at City of Tallahassee test well 32, Leon County, Florida, 2013

USGS Publications Warehouse

McBride, W. Scott; Wacker, Michael A.

2015-01-01

A test well was drilled by the City of Tallahassee to assess the suitability of the site for the installation of a new well for public water supply. The test well is in Leon County in north-central Florida. The U.S. Geological Survey delineated high-permeability zones in the Upper Floridan aquifer, using borehole-geophysical data collected from the open interval of the test well. A composite water sample was collected from the open interval during high-flow conditions, and three discrete water samples were collected from specified depth intervals within the test well during low-flow conditions. Water-quality, source tracer, and age-dating results indicate that the open interval of the test well produces water of consistently high quality throughout its length. The cavernous nature of the open interval makes it likely that the highly permeable zones are interconnected in the aquifer by secondary porosity features.

Search for supporting methodologies - Or how to support SEI for 35 years

NASA Technical Reports Server (NTRS)

Handley, Thomas H., Jr.; Masline, Richard C.

1991-01-01

Concepts relevant to the development of an evolvable information management system are examined in terms of support for the Space Exploration Initiative. The issues of interoperability within NASA and industry initiatives are studied including the Open Systems Interconnection standard and the operating system of the Open Software Foundation. The requirements of partitioning functionality into separate areas are determined with attention given to the infrastructure required to ensure system-wide compliance. The need for a decision-making context is a key to the distributed implementation of the program, and this environment is concluded to be next step in developing an evolvable, interoperable, and securable support network.

Emerging Communication Technologies (ECT) Phase 2 Report. Volume 2; Appendices

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Chiodini, Robert; Nelson, Richard A.; Huang, PoTien; Kruhm, David A.

2003-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB

Emerging Communication Technologies (ECT) Phase 2 Report. Volume 1; Main Report

NASA Technical Reports Server (NTRS)

Bastin, Gary L.; Harris, William G.; Chiodini, Robert; Nelson, Richard A.; Huang, PoTien; Kruhm, David A.

2003-01-01

The Emerging Communication Technology (ECT) project investigated three First Mile communication technologies in support of NASA s Second Generation Reusable Launch Vehicle (2nd Gen RLV), Orbital Space Plane, Advanced Range Technology Working Group (ARTWG) and the Advanced Spaceport Technology Working Group (ASTWG). These First Mile technologies have the purpose of interconnecting mobile users with existing Range Communication infrastructures. ECT was a continuation of the Range Information System Management (RISM) task started in 2002. RISM identified the three advance communication technologies investigated under ECT. These were Wireless Ethernet (Wi-Fi), Free Space Optics (FSO), and Ultra Wideband (UWB). Due to the report s size, it has been broken into three volumes: 1) Main Report 2) Appendices 3) UWB.

From Seurat to Snapshots: What the Visual Arts Could Contribute to Education.

ERIC Educational Resources Information Center

Duncum, Paul

1996-01-01

Advocates reconceptualizing visual arts as a core subject embodying key elements of experiential learning and critical thinking through an interdisciplinary approach. Illustrates this approach with a discussion of the interconnected issues surrounding family snapshots (social history, aesthetics, technological advancement). Discusses issues of…

Model for Infusing a Global Perspective into the Curriculum.

ERIC Educational Resources Information Center

Thorne, Bonnie Baker, Comp.; And Others

Global education is an approach to learning that transcends national boundaries and involves the interconnection of cultural, ecological, economic, political and technological systems. This perspective promotes multicultural sensitivity that enables young people to see more clearly their own responsibilities and opportunities in today's world.…

Educating Digital Citizens

ERIC Educational Resources Information Center

Tan, Thomas

2011-01-01

Digital citizenship is how educators, citizens, and parents can teach where the lines of cyber safety and ethics are in the interconnected online world their students will inhabit. Aside from keeping technology users safe, digital citizenship also prepares students to survive and thrive in an environment embedded with information, communication,…

Interarea Oscillation Damping Control Using High Voltage DC Transmission: a Survey

DOE Office of Scientific and Technical Information (OSTI.GOV)

Elizondo, Marcelo Anibal; Fan, Rui; Kirkham, Harold

High-voltage, direct current (HVDC) transmission lines are increasingly being installed in power systems around the world, and this trend is expected to continue with advancements in power electronics technology. These advancements are also bringing multi-terminal direct current (MTDC) systems closer to practical application. In addition, the continued deployment of phasor measurement units (PMUs) makes dynamic information about a large power system readily available for highly controllable components, such as HVDC lines. All these trends have increased the appeal of modulating HVDC lines and MTDC systems to provide grid services in addition to bulk power transfers. This paper provides a literaturemore » survey of HVDC and MTDC damping controllers for interarea oscillations in large interconnected power systems. The literature shows a progression from theoretical research to practical applications. Finally, there are already practical implementations of HVDC modulation for lines in point-to-point configuration, although the modulation of MTDC systems is still in the research stage. As a conclusion, this paper identifies and summarizes open questions that remain to be tackled by researchers and engineers.« less

Interarea Oscillation Damping Control Using High Voltage DC Transmission: a Survey

DOE PAGES

Elizondo, Marcelo Anibal; Fan, Rui; Kirkham, Harold; ...

2018-05-02

High-voltage, direct current (HVDC) transmission lines are increasingly being installed in power systems around the world, and this trend is expected to continue with advancements in power electronics technology. These advancements are also bringing multi-terminal direct current (MTDC) systems closer to practical application. In addition, the continued deployment of phasor measurement units (PMUs) makes dynamic information about a large power system readily available for highly controllable components, such as HVDC lines. All these trends have increased the appeal of modulating HVDC lines and MTDC systems to provide grid services in addition to bulk power transfers. This paper provides a literaturemore » survey of HVDC and MTDC damping controllers for interarea oscillations in large interconnected power systems. The literature shows a progression from theoretical research to practical applications. Finally, there are already practical implementations of HVDC modulation for lines in point-to-point configuration, although the modulation of MTDC systems is still in the research stage. As a conclusion, this paper identifies and summarizes open questions that remain to be tackled by researchers and engineers.« less

Protocol standards and implementation within the digital engineering laboratory computer network (DELNET) using the universal network interface device (UNID). Part 2

NASA Astrophysics Data System (ADS)

Phister, P. W., Jr.

1983-12-01

Development of the Air Force Institute of Technology's Digital Engineering Laboratory Network (DELNET) was continued with the development of an initial draft of a protocol standard for all seven layers as specified by the International Standards Organization's (ISO) Reference Model for Open Systems Interconnections. This effort centered on the restructuring of the Network Layer to perform Datagram routing and to conform to the developed protocol standards and actual software module development of the upper four protocol layers residing within the DELNET Monitor (Zilog MCZ 1/25 Computer System). Within the guidelines of the ISO Reference Model the Transport Layer was developed utilizing the Internet Header Format (IHF) combined with the Transport Control Protocol (TCP) to create a 128-byte Datagram. Also a limited Application Layer was created to pass the Gettysburg Address through the DELNET. This study formulated a first draft for the DELNET Protocol Standard and designed, implemented, and tested the Network, Transport, and Application Layers to conform to these protocol standards.

Detection of Short-Waved Spin Waves in Individual Microscopic Spin-Wave Waveguides Using the Inverse Spin Hall Effect.

PubMed

Brächer, T; Fabre, M; Meyer, T; Fischer, T; Auffret, S; Boulle, O; Ebels, U; Pirro, P; Gaudin, G

2017-12-13

The miniaturization of complementary metal-oxide-semiconductor (CMOS) devices becomes increasingly difficult due to fundamental limitations and the increase of leakage currents. Large research efforts are devoted to find alternative concepts that allow for a larger data-density and lower power consumption than conventional semiconductor approaches. Spin waves have been identified as a potential technology that can complement and outperform CMOS in complex logic applications, profiting from the fact that these waves enable wave computing on the nanoscale. The practical application of spin waves, however, requires the demonstration of scalable, CMOS compatible spin-wave detection schemes in material systems compatible with standard spintronics as well as semiconductor circuitry. Here, we report on the wave-vector independent detection of short-waved spin waves with wavelengths down to 150 nm by the inverse spin Hall effect in spin-wave waveguides made from ultrathin Ta/Co 8 Fe 72 B 20 /MgO. These findings open up the path for miniaturized scalable interconnects between spin waves and CMOS and the use of ultrathin films made from standard spintronic materials in magnonics.

Hot Chips and Hot Interconnects for High End Computing Systems

NASA Technical Reports Server (NTRS)

Saini, Subhash

2005-01-01

I will discuss several processors: 1. The Cray proprietary processor used in the Cray X1; 2. The IBM Power 3 and Power 4 used in an IBM SP 3 and IBM SP 4 systems; 3. The Intel Itanium and Xeon, used in the SGI Altix systems and clusters respectively; 4. IBM System-on-a-Chip used in IBM BlueGene/L; 5. HP Alpha EV68 processor used in DOE ASCI Q cluster; 6. SPARC64 V processor, which is used in the Fujitsu PRIMEPOWER HPC2500; 7. An NEC proprietary processor, which is used in NEC SX-6/7; 8. Power 4+ processor, which is used in Hitachi SR11000; 9. NEC proprietary processor, which is used in Earth Simulator. The IBM POWER5 and Red Storm Computing Systems will also be discussed. The architectures of these processors will first be presented, followed by interconnection networks and a description of high-end computer systems based on these processors and networks. The performance of various hardware/programming model combinations will then be compared, based on latest NAS Parallel Benchmark results (MPI, OpenMP/HPF and hybrid (MPI + OpenMP). The tutorial will conclude with a discussion of general trends in the field of high performance computing, (quantum computing, DNA computing, cellular engineering, and neural networks).

Research on Optical Transmitter and Receiver Module Used for High-Speed Interconnection between CPU and Memory

NASA Astrophysics Data System (ADS)

He, Huimin; Liu, Fengman; Li, Baoxia; Xue, Haiyun; Wang, Haidong; Qiu, Delong; Zhou, Yunyan; Cao, Liqiang

2016-11-01

With the development of the multicore processor, the bandwidth and capacity of the memory, rather than the memory area, are the key factors in server performance. At present, however, the new architectures, such as fully buffered DIMM (FBDIMM), hybrid memory cube (HMC), and high bandwidth memory (HBM), cannot be commercially applied in the server. Therefore, a new architecture for the server is proposed. CPU and memory are separated onto different boards, and optical interconnection is used for the communication between them. Each optical module corresponds to each dual inline memory module (DIMM) with 64 channels. Compared to the previous technology, not only can the architecture realize high-capacity and wide-bandwidth memory, it also can reduce power consumption and cost, and be compatible with the existing dynamic random access memory (DRAM). In this article, the proposed module with system-in-package (SiP) integration is demonstrated. In the optical module, the silicon photonic chip is included, which is a promising technology to be applied in the next-generation data exchanging centers. And due to the bandwidth-distance performance of the optical interconnection, SerDes chips are introduced to convert the 64-bit data at 800 Mbps from/to 4-channel data at 12.8 Gbps after/before they are transmitted though optical fiber. All the devices are packaged on cheap organic substrates. To ensure the performance of the whole system, several optimization efforts have been performed on the two modules. High-speed interconnection traces have been designed and simulated with electromagnetic simulation software. Steady-state thermal characteristics of the transceiver module have been evaluated by ANSYS APLD based on finite-element methodology (FEM). Heat sinks are placed at the hotspot area to ensure the reliability of all working chips. Finally, this transceiver system based on silicon photonics is measured, and the eye diagrams of data and clock signals are verified.

Improvement of multiprocessing performance by using optical centralized shared bus

NASA Astrophysics Data System (ADS)

Han, Xuliang; Chen, Ray T.

2004-06-01

With the ever-increasing need to solve larger and more complex problems, multiprocessing is attracting more and more research efforts. One of the challenges facing the multiprocessor designers is to fulfill in an effective manner the communications among the processes running in parallel on multiple multiprocessors. The conventional electrical backplane bus provides narrow bandwidth as restricted by the physical limitations of electrical interconnects. In the electrical domain, in order to operate at high frequency, the backplane topology has been changed from the simple shared bus to the complicated switched medium. However, the switched medium is an indirect network. It cannot support multicast/broadcast as effectively as the shared bus. Besides the additional latency of going through the intermediate switching nodes, signal routing introduces substantial delay and considerable system complexity. Alternatively, optics has been well known for its interconnect capability. Therefore, it has become imperative to investigate how to improve multiprocessing performance by utilizing optical interconnects. From the implementation standpoint, the existing optical technologies still cannot fulfill the intelligent functions that a switch fabric should provide as effectively as their electronic counterparts. Thus, an innovative optical technology that can provide sufficient bandwidth capacity, while at the same time, retaining the essential merits of the shared bus topology, is highly desirable for the multiprocessing performance improvement. In this paper, the optical centralized shared bus is proposed for use in the multiprocessing systems. This novel optical interconnect architecture not only utilizes the beneficial characteristics of optics, but also retains the desirable properties of the shared bus topology. Meanwhile, from the architecture standpoint, it fits well in the centralized shared-memory multiprocessing scheme. Therefore, a smooth migration with substantial multiprocessing performance improvement is expected. To prove the technical feasibility from the architecture standpoint, a conceptual emulation of the centralized shared-memory multiprocessing scheme is demonstrated on a generic PCI subsystem with an optical centralized shared bus.

[Security specifications for electronic medical records on the Internet].

PubMed

Mocanu, Mihai; Mocanu, Carmen

2007-01-01

The extension for the Web applications of the Electronic Medical Record seems both interesting and promising. Correlated with the expansion of Internet in our country, it allows the interconnection of physicians of different specialties and their collaboration for better treatment of patients. In this respect, the ophthalmologic medical applications consider the increased possibilities for monitoring chronic ocular diseases and for the identification of some elements for early diagnosis and risk factors supervision. We emphasize in this survey some possible solutions to the problems of interconnecting medical information systems to the Internet: the achievement of interoperability within medical organizations through the use of open standards, the automated input and processing for ocular imaging, the use of data reduction techniques in order to increase the speed of image retrieval in large databases, and, last but not least, the resolution of security and confidentiality problems in medical databases.

Ion traps fabricated in a CMOS foundry

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mehta, K. K.; Ram, R. J.; Eltony, A. M.

2014-07-28

We demonstrate trapping in a surface-electrode ion trap fabricated in a 90-nm CMOS (complementary metal-oxide-semiconductor) foundry process utilizing the top metal layer of the process for the trap electrodes. The process includes doped active regions and metal interconnect layers, allowing for co-fabrication of standard CMOS circuitry as well as devices for optical control and measurement. With one of the interconnect layers defining a ground plane between the trap electrode layer and the p-type doped silicon substrate, ion loading is robust and trapping is stable. We measure a motional heating rate comparable to those seen in surface-electrode traps of similar size.more » This demonstration of scalable quantum computing hardware utilizing a commercial CMOS process opens the door to integration and co-fabrication of electronics and photonics for large-scale quantum processing in trapped-ion arrays.« less

The Future of Mobile Information and Communication Technology in Austere Environments: A Command and Control Technology Integration Perspective

DTIC Science & Technology

2013-03-01

within the Global information Grid ( GiG ) (AFDD6-0, 2011). JP 1-02 describes the GiG : 10 The GIG is the globally interconnected, end-to-end set of...to warfighters, policy makers, and support personnel. The GIG includes all owned and leased communications and computing systems and services...software (including applications), data, security services, and other 19 associated services necessary to achieve information superiority. The GIG

Technology Description Sheets form the AMC 1990 Technology Expo Held in Aberdeen Proving Ground, Maryland on 1-4 October 1990

DTIC Science & Technology

1990-10-04

emission signals) " Compactness (can be hand-held). The ISOPADS was demonstrated to troop units at the Army Training Command, Grafenwoehr , West...To be controlled, the microwave chips and modules must be interconnected with remotely located components and subsystems. Utilizing metallic cables...forward observer systcm being developed for use in situations too dangerous for soldiers. such as nuclear- contaminated areas or in support of a minefield

Local network assessment

NASA Astrophysics Data System (ADS)

Glen, D. V.

1985-04-01

Local networks, related standards activities of the Institute of Electrical and Electronics Engineers the American National Standards Institute and other elements are presented. These elements include: (1) technology choices such as topology, transmission media, and access protocols; (2) descriptions of standards for the 802 local area networks (LAN's); high speed local networks (HSLN's) and military specification local networks; and (3) intra- and internetworking using bridges and gateways with protocols Interconnection (OSI) reference model. The convergence of LAN/PBX technology is also described.

High density circuit technology, part 2

NASA Technical Reports Server (NTRS)

Wade, T. E.

1982-01-01

A multilevel metal interconnection system for very large scale integration (VLSI) systems utilizing polyimides as the interlayer dielectric material is described. A complete characterization of polyimide materials is given as well as experimental methods accomplished using a double level metal test pattern. A low temperature, double exposure polyimide patterning procedure is also presented.

The Five Central Psychological Challenges Facing Effective Mobile Learning

ERIC Educational Resources Information Center

Terras, Melody M.; Ramsay, Judith

2012-01-01

Web 2.0 technology not only offers the opportunity of massively parallel interconnected networks that support the provision of information and communication anytime and anywhere but also offers immense opportunities for collaboration and sharing of user-generated content. This information-rich environment may support both formal and informal…

Laser Processing for Interconnect Technology

DTIC Science & Technology

1992-02-27

2.1 0.0002 - available in film ethylene- - insoluble propylene (FEP) Perfluoroalkoxy ( PFA ) Teflon AF Amorphous DuPont 1.9 0.0002 - soluble form...t,) where the pulse is sorption coefficient, hv is the photon energy, and f is the a maximum at the surface at time t0. The distance marker fraction

IT and Multimedia in Technical and Vocational Education in Malaysia.

ERIC Educational Resources Information Center

Mustapha, Ramlee B.

Development of information technology (IT) and the Multimedia Super Corridor (MSC) project has placed Malaysia within the global interconnectivity along with other developed nations. Types of IT applications are e-learning, e-mail, discussion group mailing lists, bulletin board systems, chat mode, newsgroups, Internet, tutorial, hypermedia, and…

Cross-Cultural Training in the Community College Curriculum.

ERIC Educational Resources Information Center

Coller, Richard W.; Summers, John Mark

While technological advances have transformed man's social and cultural environment and increased the interconnection between individuals and cultures, they have not in themselves led to a deeper understanding of other cultures. Educational programs can play an important role in remedying this defect and in developing students' sensitivity to…

Computer Electromagnetics and Supercomputer Architecture

NASA Technical Reports Server (NTRS)

Cwik, Tom

1993-01-01

The dramatic increase in performance over the last decade for microporcessor computations is compared with that for the supercomputer computations. This performance, the projected performance, and a number of other issues such as cost and the inherent pysical limitations in curent supercomputer technology have naturally led to parallel supercomputers and ensemble of interconnected microprocessors.

Understanding Integrated STEM Science Instruction through Experiences of Teachers and Students

ERIC Educational Resources Information Center

Gardner, Margery

2017-01-01

Integrated STEM education comprises an exploration of the interconnections between science, technology, engineering and mathematics in order to reflect on how each discipline operates within real world contexts. Students benefit from the integrated STEM approach because it values students' real-life experiences and hands-on applications that…

Developing a National STEM Workforce Strategy: A Workshop Summary

ERIC Educational Resources Information Center

Alper, Joe

2016-01-01

The future competitiveness of the United States in an increasingly interconnected global economy depends on the nation fostering a workforce with strong capabilities and skills in science, technology, engineering, and mathematics (STEM). STEM knowledge and skills enable both individual opportunity and national competitiveness, and the nation needs…

A Mediated Discourse Analysis (MDA) Approach to Multimodal Data

ERIC Educational Resources Information Center

Dooly, Melinda

2017-01-01

Just as research in language learning is moving beyond the four walls of the classroom, there is a growing awareness that language use (and simultaneous learning) takes place in increasingly complex and interconnected ways, in particular through the use of technology. This chapter summarizes an investigation into multimodal communicative…

Teaching and Learning in the Global Village: Connect, Create, Collaborate, and Communicate

ERIC Educational Resources Information Center

Dwyer, Bernadette

2016-01-01

The world is increasingly interconnected through technology. In order to live and work in a global village our students need to develop global literacy. Global literacy incorporates a range of overlapping concepts including an advocacy dimension, global citizenship responsibility, and cultural and linguistic awareness. Further, global literacy…

The Teaching Revolution: RTI, Technology, and Differentiation Transform Teaching for the 21st Century

ERIC Educational Resources Information Center

Bender, William N.; Waller, Laura

2011-01-01

"The Teaching Revolution" challenges educators to imagine schools the way they should be, with a "big picture" vision that includes student-driven curricula, interconnectivity, and targeted responsiveness to students' individual needs. The authors provide a futuristic and provocative discussion on combining three major instructional…

Factors Influencing Adoption of Ubiquitous Internet amongst Students

ERIC Educational Resources Information Center

Juned, Mohammad; Adil, Mohd

2015-01-01

Weiser's (1991) conceptualisation of a world wherein human's interaction with computer technology would no longer be limited to conventional input and output devices, has now been translated into a reality with human's constant interaction with multiple interconnected computers and sensors embedded in rooms, furniture, clothes, tools, and other…

On- and off-grid operation of hybrid renewable power plants: When are the economics favorable?

NASA Astrophysics Data System (ADS)

Petrakopoulou, F.; Santana, D.

2016-12-01

Hybrid renewable energy conversion systems offer a good alternative to conventional systems in locations where the extension of the electrical grid is difficult or not economical or where the cost of electricity is high. However, stand-alone operation implies net energy output restrictions (limited to exclusively serve the energy demand of a region), capacity oversizing and large storage facilities. In interconnected areas, on the other hand, the operational restrictions of the power stations change significantly and the efficiencies and costs of renewable technologies become more favorable. In this paper, the operation of three main renewable technologies (CSP, PV and wind) is studied assuming both hybrid and individual operation for both autonomous and inter-connected operation. The case study used is a Mediterranean island of ca. 3,000 inhabitants. Each system is optimized to fully cover the energy demand of the community. In addition, in the on-grid operation cases, it is required that the annual energy generated from the renewable sources is net positive (i.e., the island generates at least as much energy as it uses). It is found that when connected to the grid, hybridization of more than one technology is not required to satisfy the energy demand, as expected. Each of the renewable technologies investigated can satisfy the annual energy demand individually, without significant complications. In addition, the cost of electricity generated with the three studied technologies drops significantly for on-grid applications, when compared to off-grid operation. However, when compared to business-as-usual scenarios in both the on- and off-grid cases, both investigated hybrid and single-technology renewable scenarios are found to be economically viable. A sensitivity analysis reveals the limits of the acceptable costs that make the technologies favorable when compared to conventional alternatives.

Ontobee: A linked ontology data server to support ontology term dereferencing, linkage, query and integration.

PubMed

Ong, Edison; Xiang, Zuoshuang; Zhao, Bin; Liu, Yue; Lin, Yu; Zheng, Jie; Mungall, Chris; Courtot, Mélanie; Ruttenberg, Alan; He, Yongqun

2017-01-04

Linked Data (LD) aims to achieve interconnected data by representing entities using Unified Resource Identifiers (URIs), and sharing information using Resource Description Frameworks (RDFs) and HTTP. Ontologies, which logically represent entities and relations in specific domains, are the basis of LD. Ontobee (http://www.ontobee.org/) is a linked ontology data server that stores ontology information using RDF triple store technology and supports query, visualization and linkage of ontology terms. Ontobee is also the default linked data server for publishing and browsing biomedical ontologies in the Open Biological Ontology (OBO) Foundry (http://obofoundry.org) library. Ontobee currently hosts more than 180 ontologies (including 131 OBO Foundry Library ontologies) with over four million terms. Ontobee provides a user-friendly web interface for querying and visualizing the details and hierarchy of a specific ontology term. Using the eXtensible Stylesheet Language Transformation (XSLT) technology, Ontobee is able to dereference a single ontology term URI, and then output RDF/eXtensible Markup Language (XML) for computer processing or display the HTML information on a web browser for human users. Statistics and detailed information are generated and displayed for each ontology listed in Ontobee. In addition, a SPARQL web interface is provided for custom advanced SPARQL queries of one or multiple ontologies. © The Author(s) 2016. Published by Oxford University Press on behalf of Nucleic Acids Research.

Performance evaluation of multi-stratum resources integrated resilience for software defined inter-data center interconnect.

PubMed

Yang, Hui; Zhang, Jie; Zhao, Yongli; Ji, Yuefeng; Wu, Jialin; Lin, Yi; Han, Jianrui; Lee, Young

2015-05-18

Inter-data center interconnect with IP over elastic optical network (EON) is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resources integration among IP networks, optical networks and application stratums resources that allows to accommodate data center services. In view of this, this study extends to consider the service resilience in case of edge optical node failure. We propose a novel multi-stratum resources integrated resilience (MSRIR) architecture for the services in software defined inter-data center interconnect based on IP over EON. A global resources integrated resilience (GRIR) algorithm is introduced based on the proposed architecture. The MSRIR can enable cross stratum optimization and provide resilience using the multiple stratums resources, and enhance the data center service resilience responsiveness to the dynamic end-to-end service demands. The overall feasibility and efficiency of the proposed architecture is experimentally verified on the control plane of our OpenFlow-based enhanced SDN (eSDN) testbed. The performance of GRIR algorithm under heavy traffic load scenario is also quantitatively evaluated based on MSRIR architecture in terms of path blocking probability, resilience latency and resource utilization, compared with other resilience algorithms.

Stretchable All-Gel-State Fiber-Shaped Supercapacitors Enabled by Macromolecularly Interconnected 3D Graphene/Nanostructured Conductive Polymer Hydrogels.

PubMed

Li, Panpan; Jin, Zhaoyu; Peng, Lele; Zhao, Fei; Xiao, Dan; Jin, Yong; Yu, Guihua

2018-05-01

Nanostructured conductive polymer hydrogels (CPHs) have been extensively applied in energy storage owing to their advantageous features, such as excellent electrochemical activity and relatively high electrical conductivity, yet the fabrication of self-standing and flexible electrode-based CPHs is still hampered by their limited mechanical properties. Herein, macromolecularly interconnected 3D graphene/nanostructured CPH is synthesized via self-assembly of CPHs and graphene oxide macrostructures. The 3D hybrid hydrogel shows uniform interconnectivity and enhanced mechanical properties due to the strong macromolecular interaction between the CPHs and graphene, thus greatly reducing aggregation in the fiber-shaping process. A proof-of-concept all-gel-state fibrous supercapacitor based on the 3D polyaniline/graphene hydrogel is fabricated to demonstrate the outstanding flexibility and mouldability, as well as superior electrochemical properties enabled by this 3D hybrid hydrogel design. The proposed device can achieve a large strain (up to ≈40%), and deliver a remarkable volumetric energy density of 8.80 mWh cm -3 (at power density of 30.77 mW cm -3 ), outperforming many fiber-shaped supercapacitors reported previously. The all-hydrogel design opens up opportunities in the fabrication of next-generation wearable and portable electronics. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Performance evaluation of multi-stratum resources integration based on network function virtualization in software defined elastic data center optical interconnect.

PubMed

Yang, Hui; Zhang, Jie; Ji, Yuefeng; Tian, Rui; Han, Jianrui; Lee, Young

2015-11-30

Data center interconnect with elastic optical network is a promising scenario to meet the high burstiness and high-bandwidth requirements of data center services. In our previous work, we implemented multi-stratum resilience between IP and elastic optical networks that allows to accommodate data center services. In view of this, this study extends to consider the resource integration by breaking the limit of network device, which can enhance the resource utilization. We propose a novel multi-stratum resources integration (MSRI) architecture based on network function virtualization in software defined elastic data center optical interconnect. A resource integrated mapping (RIM) scheme for MSRI is introduced in the proposed architecture. The MSRI can accommodate the data center services with resources integration when the single function or resource is relatively scarce to provision the services, and enhance globally integrated optimization of optical network and application resources. The overall feasibility and efficiency of the proposed architecture are experimentally verified on the control plane of OpenFlow-based enhanced software defined networking (eSDN) testbed. The performance of RIM scheme under heavy traffic load scenario is also quantitatively evaluated based on MSRI architecture in terms of path blocking probability, provisioning latency and resource utilization, compared with other provisioning schemes.

Monolithically interconnected silicon-film™ module technology

NASA Astrophysics Data System (ADS)

DelleDonne, E. J.; Ford, D. H.; Hall, R. B.; Ingram, A. E.; Rand, J. A.; Barnett, A. M.

1999-03-01

AstroPower is developing an advanced thin-silicon-based, photovoltaic module product. A low-cost monolithic interconnected device is being integrated into a module that combines the design and process features of advanced light trapped, thin-silicon solar cells. This advanced product incorporates a low-cost substrate, a nominally 50-μm thick grown silicon layer with minority carrier diffusion lengths exceeding the active layer thickness, light trapping due to back-surface reflection, and back-surface passivation. The thin silicon layer enables high solar cell performance and can lead to a module conversion efficiency as high as 19%. These performance design features, combined with low-cost manufacturing using relatively low-cost capital equipment, continuous processing and a low-cost substrate, will lead to high-performance, low-cost photovoltaic panels.

Design process of a photonics network for military platforms

NASA Astrophysics Data System (ADS)

Nelson, George F.; Rao, Nagarajan M.; Krawczak, John A.; Stevens, Rick C.

1999-02-01

Technology development in photonics is rapidly progressing. The concept of a Unified Network will provide re- configurable network access to platform sensors, Vehicle Management Systems, Stores and avionics. The re-configurable taps into the network will accommodate present interface standards and provide scaleability for the insertion of future interfaces. Significant to this development is the design and test of the Optical Backplane Interconnect System funded by Naval Air Systems Command and developed by Lockheed Martin Tactical Defense Systems - Eagan. OBIS results in the merging of the electrical backplane and the optical backplane, with interconnect fabric and card edge connectors finally providing adequate electrical and optical card access. Presently OBIS will support 1.2 Gb/s per fiber over multiples of 12 fibers per ribbon cable.

Systems Integration Fact Sheet

DOE Office of Scientific and Technical Information (OSTI.GOV)

None

2016-06-01

This fact sheet is an overview of the Systems Integration subprogram at the U.S. Department of Energy SunShot Initiative. The Systems Integration subprogram enables the widespread deployment of safe, reliable, and cost-effective solar energy technologies by addressing the associated technical and non-technical challenges. These include timely and cost-effective interconnection procedures, optimal system planning, accurate prediction of solar resources, monitoring and control of solar power, maintaining grid reliability and stability, and many more. To address the challenges associated with interconnecting and integrating hundreds of gigawatts of solar power onto the electricity grid, the Systems Integration program funds research, development, and demonstrationmore » projects in four broad, interrelated focus areas: grid performance and reliability, dispatchability, power electronics, and communications.« less

Network integration of distributed power generation

NASA Astrophysics Data System (ADS)

Dondi, Peter; Bayoumi, Deia; Haederli, Christoph; Julian, Danny; Suter, Marco

The world-wide move to deregulation of the electricity and other energy markets, concerns about the environment, and advances in renewable and high efficiency technologies has led to major emphasis being placed on the use of small power generation units in a variety of forms. The paper reviews the position of distributed generation (DG, as these small units are called in comparison with central power plants) with respect to the installation and interconnection of such units with the classical grid infrastructure. In particular, the status of technical standards both in Europe and USA, possible ways to improve the interconnection situation, and also the need for decisions that provide a satisfactory position for the network operator (who remains responsible for the grid, its operation, maintenance and investment plans) are addressed.

Fabrication of Low Temperature Carbon Nanotube Vertical Interconnects Compatible with Semiconductor Technology

PubMed Central

Vollebregt, Sten; Ishihara, Ryoichi

2015-01-01

We demonstrate a method for the low temperature growth (350 °C) of vertically-aligned carbon nanotubes (CNT) bundles on electrically conductive thin-films. Due to the low growth temperature, the process allows integration with modern low-κ dielectrics and some flexible substrates. The process is compatible with standard semiconductor fabrication, and a method for the fabrication of electrical 4-point probe test structures for vertical interconnect test structures is presented. Using scanning electron microscopy the morphology of the CNT bundles is investigated, which demonstrates vertical alignment of the CNT and can be used to tune the CNT growth time. With Raman spectroscopy the crystallinity of the CNT is investigated. It was found that the CNT have many defects, due to the low growth temperature. The electrical current-voltage measurements of the test vertical interconnects displays a linear response, indicating good ohmic contact was achieved between the CNT bundle and the top and bottom metal electrodes. The obtained resistivities of the CNT bundle are among the average values in the literature, while a record-low CNT growth temperature was used. PMID:26709530

Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect

NASA Astrophysics Data System (ADS)

Zhao, N.; Zhong, Y.; Dong, W.; Huang, M. L.; Ma, H. T.; Wong, C. P.

2017-02-01

β-Sn grain orientation and configuration are becoming crucial factors to dominate the lifetime of solder interconnects in three-dimensional integrated circuit packaging. In this paper, we found that a temperature gradient during solidification significantly dominated the orientation and configuration of the final β-Sn grains in Cu/SnAgCu/Cu micro interconnects. Being different from the random orientations and growth fronts meeting or cyclic twin boundary forming near the center after homogeneous temperature bonding, the β-Sn grains solidified under a certain temperature gradient were observed to follow a highly preferred orientation with their c-axis departing from the direction of temperature gradient by about 45°-88°. Meanwhile, these preferred oriented β-Sn grains consisted of low angle grain boundary structures with misorientation in the range of 0°-15°. The mechanism was explained in terms of the anisotropy and directional growth of β-Sn grains. The results pave the way for grain orientation control in 3D packaging technology.

Motions, efforts and actuations in constrained dynamic systems: a multi-link open-chain example

NASA Astrophysics Data System (ADS)

Duke Perreira, N.

1999-08-01

The effort-motion method, which describes the dynamics of open- and closed-chain topologies of rigid bodies interconnected with revolute and prismatic pairs, is interpreted geometrically. Systems are identified for which the simultaneous control of forces and velocities is desirable, and a representative open-chain system is selected for use in the ensuing analysis. Gauge invariant transformations are used to recast the commonly used kinetic and kinematic equations into a dimensional gauge invariant form. Constraint elimination techniques based on singular value decompositions then recast the invariant equations into orthogonal and reciprocal sets of motion and effort equations written in state variable form. The ideal actuation is found that simultaneously achieves the obtainable portions of the desired constraining efforts and motions. The performance is then evaluated of using the actuation closest to the ideal actuation.

Compact planar microwave blocking filters

NASA Technical Reports Server (NTRS)

U-Yen, Kongpop (Inventor); Wollack, Edward J. (Inventor)

2012-01-01

A compact planar microwave blocking filter includes a dielectric substrate and a plurality of filter unit elements disposed on the substrate. The filter unit elements are interconnected in a symmetrical series cascade with filter unit elements being organized in the series based on physical size. In the filter, a first filter unit element of the plurality of filter unit elements includes a low impedance open-ended line configured to reduce the shunt capacitance of the filter.

Using Shock Waves to Improve the Acoustic Properties of Closed-Cell Foams

NASA Astrophysics Data System (ADS)

Brouillette, M.; Hébert, C.; Atalla, N.; Doutres, O.

Foam microstructure can be seen as a collection of interlinked struts forming a packing of cells interconnected to others through pores. Materials with a totality of pores closed by thin membranes are called closed-cell foams. The filtration and acoustic efficiency of closed-cell foams is poor compared to open-cell foams since it is very difficult for the fluid or the acoustic waves to penetrate inside the material.

One Approach for Transitioning the iNET Standards into the IRIG 106 Telemetry Standards

DTIC Science & Technology

2015-05-26

Protocol Suite. Figure 1 illustrates the Open Systems Interconnection ( OSI ) Model, the corresponding TCP/IP Model, and the major components of the TCP...IP Protocol Suite. Figure 2 represents the iNET-specific protocols layered onto the TCP/IP Model. Figure 1. OSI and TCP/IP Model with TCP/IP...Protocol Suite TCP/IP Protocol Suite Major Components IPv4 IPv6 TCP/IP Model OSI Model Application Presentation

CTS digital video college curriculum-sharing experiment. [Communications Technology Satellite

NASA Technical Reports Server (NTRS)

Lumb, D. R.; Sites, M. J.

1974-01-01

NASA-Ames Research Center, Stanford University, and Carleton University, Ottawa, Canada, are participating in a joint experiment to evaluate the feasibility and effectiveness of college curriculum sharing using compressed digital television and the Communications Technology Satellite (CTS). Each university will offer televised courses to the other during the 1976-1977 academic year via CTS, a joint program by NASA and the Canadian Department of Communications. The video compression techniques to be demonstrated will enable economical interconnection of educational institutions using existing and planned domestic satellites.

Design definition study of a lift/cruise fan technology V/STOL airplane: Summary

NASA Technical Reports Server (NTRS)

Zabinsky, J. M.; Higgins, H. C.

1975-01-01

A two-engine three-fan V/STOL airplane was designed to fulfill naval operational requirements. A multimission airplane was developed from study of specific point designs. Based on the multimission concept, airplanes were designed to demonstrate and develop the technology and operational procedures for this class of aircraft. Use of interconnected variable pitch fans led to a good balance between high thrust with responsive control and efficient thrust at cruise speeds. The airplanes and their characteristics are presented.

Liquid Rocket Lines, Bellows, Flexible Hoses, and Filters

NASA Technical Reports Server (NTRS)

1977-01-01

Fluid-flow components in a liquid propellant rocket engine and the rocket vehicle which it propels are interconnected by lines, bellows, and flexible hoses. Elements involved in the successful design of these components are identified and current technologies pertaining to these elements are reviewed, assessed, and summarized to provide a technology base for a checklist of rules to be followed by project managers in guiding a design or assessing its adequacy. Recommended procedures for satisfying each of the design criteria are included.

Classification of Patient Care Complexity: Cloud Technology.

PubMed

de Oliveira Riboldi, Caren; Macedo, Andrea Barcellos Teixeira; Mergen, Thiane; Dias, Vera Lúcia Mendes; da Costa, Diovane Ghignatti; Malvezzi, Maria Luiza Falsarella; Magalhães, Ana Maria Muller; Silveira, Denise Tolfo

2016-01-01

Presentation of the computerized structure to implement, in a university hospital in the South of Brazil, the Patients Classification System of Perroca, which categorizes patients according to the care complexity. This solution also aims to corroborate a recent study at the hospital, which evidenced that the increasing workload presents a direct relation with the institutional quality indicators. The tools used were the Google applications with high productivity interconnecting the topic knowledge on behalf of the nursing professionals and information technology professionals.

National Assessment of Energy Storage for Grid Balancing and Arbitrage: Phase 1, WECC

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kintner-Meyer, Michael CW; Balducci, Patrick J.; Colella, Whitney G.

2012-06-01

To examine the role that energy storage could play in mitigating the impacts of the stochastic variability of wind generation on regional grid operation, the Pacific Northwest National Laboratory (PNNL) examined a hypothetical 2020 grid scenario in which additional wind generation capacity is built to meet renewable portfolio standard targets in the Western Interconnection. PNNL developed a stochastic model for estimating the balancing requirements using historical wind statistics and forecasting error, a detailed engineering model to analyze the dispatch of energy storage and fast-ramping generation devices for estimating size requirements of energy storage and generation systems for meeting new balancingmore » requirements, and financial models for estimating the life-cycle cost of storage and generation systems in addressing the future balancing requirements for sub-regions in the Western Interconnection. Evaluated technologies include combustion turbines, sodium sulfur (Na-S) batteries, lithium ion batteries, pumped-hydro energy storage, compressed air energy storage, flywheels, redox flow batteries, and demand response. Distinct power and energy capacity requirements were estimated for each technology option, and battery size was optimized to minimize costs. Modeling results indicate that in a future power grid with high-penetration of renewables, the most cost competitive technologies for meeting balancing requirements include Na-S batteries and flywheels.« less

Managing Nigerian Secondary School Reforms to Enhance Equity and Globalization

ERIC Educational Resources Information Center

Peretomode, V. F.; Ikoya, P. O.

2010-01-01

The world is in a state of flux occasioned by profound natural forces, social, economic, and political changes and rapid scientific and technological advancement. The nations of the world, of which Nigeria is a part, are also becoming more interconnected and interdependent. To avoid possible "future shock" nations must respond quickly,…

Hybrid PV HgCdTe Detectors: Technology Reliability and Failure Physics Program

DTIC Science & Technology

1988-01-01

interconnect reliability. 3-1 8912-16 SECTION 4 ACKNOWLEDGEMENTS The authors would like to thank Dr. Marion Reine, Dr. Andrei Szilagyi , Nancy Hartle... Szilagyi , Mat. Res. Soc. Syrnp. Proc. 69, 257, (1986) 9. Private communications with Andrei Szilagy. 10. R.J. Briggs, J.W. Marciniec, P.H. Zimmermann and

Status of High Power Technology for Educational Satellites.

ERIC Educational Resources Information Center

Kuhns, Perry W.

The increasing desire to answer the educational needs of all segments of the population will necessitate a broader based communications system such as one based on satellites. The new system will require additional terminals, more interconnections, and more frequencies than are presently in use. To accomplish these goals, we need to use higher…

Integrated Collaborative E-Learning for the Global Management Education in the 21st Century

ERIC Educational Resources Information Center

Son, Barbara W. K.

2017-01-01

Rapidly growing information and communications technology and a more interconnected global world offer benefits and challenges to global business organizations. While exploring benefits from global workforce and global production, they must successfully adapt to their local market conditions and manage their multicultural resources. How can we…

Ethical and Privacy Principles for Learning Analytics

ERIC Educational Resources Information Center

Pardo, Abelardo; Siemens, George

2014-01-01

The massive adoption of technology in learning processes comes with an equally large capacity to track learners. Learning analytics aims at using the collected information to understand and improve the quality of a learning experience. The privacy and ethical issues that emerge in this context are tightly interconnected with other aspects such as…

An Example-Centric Tool for Context-Driven Design of Biomedical Devices

ERIC Educational Resources Information Center

Dzombak, Rachel; Mehta, Khanjan; Butler, Peter

2015-01-01

Engineering is one of the most global professions, with design teams developing technologies for an increasingly interconnected and borderless world. In order for engineering students to be proficient in creating viable solutions to the challenges faced by diverse populations, they must receive an expe­riential education in rigorous engineering…

Education on the Electronic Frontier: Teleapprentices in Globally Distributed Educational Contexts. Interactive Technology Laboratory Report #14.

ERIC Educational Resources Information Center

Levin, James A.; And Others

1987-01-01

The instructional media created by microcomputers interconnected by modems to form long-distance networks present some powerful new opportunities for education. While other uses of computers in education have been built on conventional instructional models of classroom interaction, instructional electronic networks facilitate a wider use of…

Digital Practices and Literacy Identities: Preservice Teachers Negotiating Contradictory Discourses of Innovation

ERIC Educational Resources Information Center

Ortega, Leticia

2013-01-01

This paper presents the results of a research study on preservice English teachers' understandings of the interconnection of literacy and technology in relation to their teaching practices. The study was conducted in an English education program among preservice teachers enrolled in a year-long internship. The data analyzed consisted of interview…

NASA Blue Team: Determining Operational Security Posture of Critical Systems and Networks

NASA Technical Reports Server (NTRS)

Alley, Adam David

2016-01-01

Emergence of Cybersecurity has increased the focus on security risks to Information Technology (IT) assets going beyond traditional Information Assurance (IA) concerns: More sophisticated threats have emerged from increasing sources as advanced hacker tools and techniques have emerged and proliferated to broaden the attack surface available across globally interconnected networks.

Globalization and Education: Exploring Pedagogical and Curricular Issues and Implications. Introductory Essay.

ERIC Educational Resources Information Center

Smits, Hans

2000-01-01

A continuation of colonialism, globalization's narrow focus on economics and free-market thinking reinforces modernist rationality and individualism and discounts how deeply all life is interconnected. Its effects on education are reflected in high stakes testing, emphasis on information technologies, and a discounting of non-Western cultures.…

Attention, and Other 21st-Century Social Media Literacies

ERIC Educational Resources Information Center

Rheingold, Howard

2010-01-01

If educators want to discover how they can engage students as well as themselves in the 21st century, they must move beyond skills and technologies. They must explore the interconnected social media literacies of (1) attention; (2) participation; (3) cooperation; (4) network awareness; and (5) critical consumption. In this article, the author…

Breaking Stereotypes: Constructing Geographic Literacy and Cultural Awareness through Technology

ERIC Educational Resources Information Center

Carano, Kenneth T.; Berson, Michael J.

2007-01-01

Youths in the United States are less geographically and culturally literate than are youths in many other industrialized countries. In an time in which the world is becoming increasingly interconnected, it is pertinent that American youths study geography, evaluate stereotypes, and understand how individuals are perceived by others. The authors…

Silicon Carbide Integrated Circuit Chip

NASA Image and Video Library

2015-02-17

A multilevel interconnect silicon carbide integrated circuit chip with co-fired ceramic package and circuit board recently developed at the NASA GRC Smart Sensors and Electronics Systems Branch for high temperature applications. High temperature silicon carbide electronics and compatible packaging technologies are elements of instrumentation for aerospace engine control and long term inner-solar planet explorations.

Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Lang, Günter; Schröder, Henning

2011-01-01

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrates. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.

Biography of a technology: North America's power grid through the twentieth century

NASA Astrophysics Data System (ADS)

Cohn, Julie A.

North Americans are among the world's most intense consumers of electricity. The vast majority in the United States and Canada access power from a network of transmission lines that stretch from the East Coast to the West Coast and from Canada to the Mexican Baja. This network, known as the largest interconnected machine in the world, evolved during the first two thirds of the twentieth century. With the very first link-ups occurring at the end of the 1890s, a wide variety of public and private utilities extended power lines to reach markets, access and manage energy resources, balance loads, realize economies of scale, provide backup power, and achieve economic stability. In 1967, utility managers and the Bureau of Reclamation connected the expansive eastern and western power pools to create the North American grid. Unlike other power grids around the world, built by single, centrally controlled entities, this large technological system emerged as the result of multiple decisions across eighty-five years of development, and negotiations for control at the economic, political, and technological levels. This dissertation describes the process of building the North American grid and the paradoxes the resulting system represents. While the grid functions as a single machine moving electricity across the continent, it is owned by many independent entities. Smooth operations suggest that the grid is a unified system; however, it operates under shared management and divided authority. In addition, although a single power network seems the logical outcome of electrification, in fact it was assembled through aggregation, not planning. Interconnections intentionally increase the robustness of individual sub-networks, yet the system itself is fragile, as demonstrated by major cascading power outages. Finally, the transmission network facilitates increased use of energy resources and consumption of power, but at certain points in the past, it also served as a technology of conservation. While this project explores the history of how and why North America has a huge interconnected power system, it also offers insights into the challenges the grid poses for our energy future.

Exascale Hardware Architectures Working Group

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hemmert, S; Ang, J; Chiang, P

2011-03-15

The ASC Exascale Hardware Architecture working group is challenged to provide input on the following areas impacting the future use and usability of potential exascale computer systems: processor, memory, and interconnect architectures, as well as the power and resilience of these systems. Going forward, there are many challenging issues that will need to be addressed. First, power constraints in processor technologies will lead to steady increases in parallelism within a socket. Additionally, all cores may not be fully independent nor fully general purpose. Second, there is a clear trend toward less balanced machines, in terms of compute capability compared tomore » memory and interconnect performance. In order to mitigate the memory issues, memory technologies will introduce 3D stacking, eventually moving on-socket and likely on-die, providing greatly increased bandwidth but unfortunately also likely providing smaller memory capacity per core. Off-socket memory, possibly in the form of non-volatile memory, will create a complex memory hierarchy. Third, communication energy will dominate the energy required to compute, such that interconnect power and bandwidth will have a significant impact. All of the above changes are driven by the need for greatly increased energy efficiency, as current technology will prove unsuitable for exascale, due to unsustainable power requirements of such a system. These changes will have the most significant impact on programming models and algorithms, but they will be felt across all layers of the machine. There is clear need to engage all ASC working groups in planning for how to deal with technological changes of this magnitude. The primary function of the Hardware Architecture Working Group is to facilitate codesign with hardware vendors to ensure future exascale platforms are capable of efficiently supporting the ASC applications, which in turn need to meet the mission needs of the NNSA Stockpile Stewardship Program. This issue is relatively immediate, as there is only a small window of opportunity to influence hardware design for 2018 machines. Given the short timeline a firm co-design methodology with vendors is of prime importance.« less

Graphene Ink Laminate Structures on Poly(vinylidene difluoride) (PVDF) for Pyroelectric Thermal Energy Harvesting and Waste Heat Recovery.

PubMed

Zabek, Daniel; Seunarine, Kris; Spacie, Chris; Bowen, Chris

2017-03-15

Thermal energy can be effectively converted into electricity using pyroelectrics, which act as small scale power generator and energy harvesters providing nanowatts to milliwatts of electrical power. In this paper, a novel pyroelectric harvester based on free-standing poly(vinylidene difluoride) (PVDF) was manufactured that exploits the high thermal radiation absorbance of a screen printed graphene ink electrode structure to facilitate the conversion of the available thermal radiation energy into electrical energy. The use of interconnected graphene nanoplatelets (GNPs) as an electrode enable high thermal radiation absorbance and high electrical conductivity along with the ease of deposition using a screen print technique. For the asymmetric structure, the pyroelectric open-circuit voltage and closed-circuit current were measured, and the harvested electrical energy was stored in an external capacitor. For the graphene ink/PVDF/aluminum system the closed circuit pyroelectric current improves by 7.5 times, the open circuit voltage by 3.4 times, and the harvested energy by 25 times compared to a standard aluminum/PVDF/aluminum system electrode design, with a peak energy density of 1.13 μJ/cm 3 . For the pyroelectric device employed in this work, a complete manufacturing process and device characterization of these structures are reported along with the thermal conductivity of the graphene ink. The material combination presented here provides a new approach for delivering smart materials and structures, wireless technologies, and Internet of Things (IoT) devices.

Novel Low Loss Wide-Band Multi-Port Integrated Circuit Technology for RF/Microwave Applications

NASA Technical Reports Server (NTRS)

Simons, Rainee N.; Goverdhanam, Kavita; Katehi, Linda P. B.; Burke, Thomas P. (Technical Monitor)

2001-01-01

In this paper, novel low loss, wide-band coplanar stripline technology for radio frequency (RF)/microwave integrated circuits is demonstrated on high resistivity silicon wafer. In particular, the fabrication process for the deposition of spin-on-glass (SOG) as a dielectric layer, the etching of microvias for the vertical interconnects, the design methodology for the multiport circuits and their measured/simulated characteristics are graphically illustrated. The study shows that circuits with very low loss, large bandwidth, and compact size are feasible using this technology. This multilayer planar technology has potential to significantly enhance RF/microwave IC performance when combined with semi-conductor devices and microelectromechanical systems (MEMS).

Designing your office for technology.

PubMed

Unthank, Michael

2004-10-01

To practice efficiently, dentists need to consider the successful integration of technologies, which can benefit their practice of dentistry. The physical environment of the office must be developed to accommodate not only the appropriate placement of computer hardware and high-tech dental devices, but their interconnectivity, as well. Dentists need to make appropriate decisions regarding the types of technology they choose to integrate into their offices, and they need to understand how the technology will be installed and integrated. An office designed to optimize the use of technology will produce ongoing benefits for dentists, their staff members and their patients throughout the lives of their practices. A dentist's practice must be planned to accommodate networks of systems hidden below floors, above ceilings and within walls, as well as to support and connect diverse technology items throughout the office.

Water supply as a constraint on transmission expansion planning in the Western interconnection

NASA Astrophysics Data System (ADS)

Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.; Moreland, Barbara D.

2016-12-01

Consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development of new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water availability constraint) and indirectly (technology or policy constraints) related to future thermoelectric water demand, as well as, the careful selection of scenarios that adequately bound the potential dimensions of water impact.

Water supply as a constraint on transmission expansion planning in the Western interconnection

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.

Here, consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development ofmore » new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water availability constraint) and indirectly (technology or policy constraints) related to future thermoelectric water demand, as well as, the careful selection of scenarios that adequately bound the potential dimensions of water impact.« less

Water supply as a constraint on transmission expansion planning in the Western interconnection

DOE PAGES

Tidwell, Vincent C.; Bailey, Michael; Zemlick, Katie M.; ...

2016-11-21

Here, consideration of water supply in transmission expansion planning (TEP) provides a valuable means of managing impacts of thermoelectric generation on limited water resources. Toward this opportunity, thermoelectric water intensity factors and water supply availability (fresh and non-fresh sources) were incorporated into a recent TEP exercise conducted for the electric interconnection in the Western United States. The goal was to inform the placement of new thermoelectric generation so as to minimize issues related to water availability. Although freshwater availability is limited in the West, few instances across five TEP planning scenarios were encountered where water availability impacted the development ofmore » new generation. This unexpected result was related to planning decisions that favored the development of low water use generation that was geographically dispersed across the West. These planning decisions were not made because of their favorable influence on thermoelectric water demand; rather, on the basis of assumed future fuel and technology costs, policy drivers and the topology of electricity demand. Results also projected that interconnection-wide thermoelectric water consumption would increase by 31% under the business-as-usual case, while consumption would decrease by 42% under a scenario assuming a low-carbon future. Except in a few instances, new thermoelectric water consumption could be accommodated with less than 10% of the local available water supply; however, limited freshwater supplies and state-level policies could increase use of non-fresh water sources for new thermoelectric generation. Results could have been considerably different if scenarios favoring higher-intensity water use generation technology or potential impacts of climate change had been explored. Conduct of this exercise highlighted the importance of integrating water into all phases of TEP, particularly joint management of decisions that are both directly (e.g., water availability constraint) and indirectly (technology or policy constraints) related to future thermoelectric water demand, as well as, the careful selection of scenarios that adequately bound the potential dimensions of water impact.« less

Cyber security challenges in Smart Cities: Safety, security and privacy.

PubMed

Elmaghraby, Adel S; Losavio, Michael M

2014-07-01

The world is experiencing an evolution of Smart Cities. These emerge from innovations in information technology that, while they create new economic and social opportunities, pose challenges to our security and expectations of privacy. Humans are already interconnected via smart phones and gadgets. Smart energy meters, security devices and smart appliances are being used in many cities. Homes, cars, public venues and other social systems are now on their path to the full connectivity known as the "Internet of Things." Standards are evolving for all of these potentially connected systems. They will lead to unprecedented improvements in the quality of life. To benefit from them, city infrastructures and services are changing with new interconnected systems for monitoring, control and automation. Intelligent transportation, public and private, will access a web of interconnected data from GPS location to weather and traffic updates. Integrated systems will aid public safety, emergency responders and in disaster recovery. We examine two important and entangled challenges: security and privacy. Security includes illegal access to information and attacks causing physical disruptions in service availability. As digital citizens are more and more instrumented with data available about their location and activities, privacy seems to disappear. Privacy protecting systems that gather data and trigger emergency response when needed are technological challenges that go hand-in-hand with the continuous security challenges. Their implementation is essential for a Smart City in which we would wish to live. We also present a model representing the interactions between person, servers and things. Those are the major element in the Smart City and their interactions are what we need to protect.

VCSELs for exascale computing, computer farms, and green photonics

NASA Astrophysics Data System (ADS)

Hofmann, Werner; Moser, Philip; Wolf, Philip; Larisch, Gunter; Li, Hui; Li, Wei; Lott, James; Bimberg, Dieter

2012-11-01

The bandwidth-induced communication bottleneck due to the intrinsic limitations of metal interconnects is inhibiting the performance and environmental friendliness of todaýs supercomputers, data centers, and in fact all other modern electrically interconnected and interoperable networks such as data farms and "cloud" fabrics. The same is true for systems of optical interconnects (OIs), where even when the metal interconnects are replaced with OIs the systems remain limited by bandwidth, physical size, and most critically the power consumption and lifecycle operating costs. Vertical-cavity surface-emitting lasers (VCSELs) are ideally suited to solve this dilemma. Global communication providers like Google Inc., Intel Inc., HP Inc., and IBM Inc. are now producing optical interconnects based on VCSELs. The optimal bandwidth per link may be analyzed by by using Amdahĺs Law and depends on the architecture of the data center and the performance of the servers within the data center. According to Google Inc., a bandwidth of 40 Gb/s has to be accommodated in the future. IBM Inc. demands 80 Tbps interconnects between solitary server chips in 2020. We recently realized ultrahigh bit rate VCSELs up to 49 Gb/s suited for such optical interconnects emitting at 980 nm. These devices show error-free transmission at temperatures up to 155°C and operate beyond 200°C. Single channel data-rates of 40 Gb/s were achieved up to 75°C. Record high energy efficiencies close to 50 fJ/bit were demonstrated for VCSELs emitting at 850 nm. Our devices are fabricated using a full three-inch wafer process, and the apertures were formed by in-situ controlled selective wet oxidation using stainless steel-based vacuum equipment of our own design. assembly, and operation. All device data are measured, recorded, and evaluated by our proprietary fully automated wafer mapping probe station. The bandwidth density of our present devices is expected to be scalable from about 100 Gbps/mm² to a physical limit of roughly 15 Tbps/mm² based on the current 12.5 Gb/s VCSEL technology. Still more energy-efficient and smaller volume laser diode devices dissipating less heat are mandatory for further up scaling of the bandwidth. Novel metal-clad VCSELs enable a reduction of the device's footprint for potentially ultrashort range interconnects by 1 to 2 orders of magnitude compared to conventional VCSELs thus enabling a similar increase of device density and bandwidth.

The Privacy and Security Implications of Open Data in Healthcare.

PubMed

Kobayashi, Shinji; Kane, Thomas B; Paton, Chris

2018-04-22

 The International Medical Informatics Association (IMIA) Open Source Working Group (OSWG) initiated a group discussion to discuss current privacy and security issues in the open data movement in the healthcare domain from the perspective of the OSWG membership.  Working group members independently reviewed the recent academic and grey literature and sampled a number of current large-scale open data projects to inform the working group discussion.  This paper presents an overview of open data repositories and a series of short case reports to highlight relevant issues present in the recent literature concerning the adoption of open approaches to sharing healthcare datasets. Important themes that emerged included data standardisation, the inter-connected nature of the open source and open data movements, and how publishing open data can impact on the ethics, security, and privacy of informatics projects.  The open data and open source movements in healthcare share many common philosophies and approaches including developing international collaborations across multiple organisations and domains of expertise. Both movements aim to reduce the costs of advancing scientific research and improving healthcare provision for people around the world by adopting open intellectual property licence agreements and codes of practice. Implications of the increased adoption of open data in healthcare include the need to balance the security and privacy challenges of opening data sources with the potential benefits of open data for improving research and healthcare delivery. Georg Thieme Verlag KG Stuttgart.

Microstructural characterization of ultra thin copper interconnects

NASA Astrophysics Data System (ADS)

Yang, Hee-Dong

The present study investigates the defects related to reliability issues, such as physical failures developed during processing and end use. In the first part of this study, kinetic analysis using the Johnson-Mehl-Avrami (JMA) model demonstrates that a self-annealing mechanism in electroplated Cu films depends on the film properties, such as thickness and the amount of crystal defects in an as-deposited state. In order to obtain the evidence of such defects, the microstructural characterization of defects in ultra thin copper interconnects using transmission electron microscopy (TEM) is presented. Examination of the defects using TEM reveals that voids filled with gas form as a lens shape along the {110} habit planes of the copper matrix. In the second part of this study, methodology and results of an electro-thermal-fatigue (ETF) testing, designed for early detection of process defects, are presented. Such ETF testing combines high-density current electrical stressing and thermal cycling to accelerate the evolution of defects in Cu interconnects. In ETF testing, the evolution of defects provides the nucleation sites for voids which open or close during thermal cycling. Then, the accumulation of voids creates the change in resistance when they reach a critical size. As a result of voids evolution, the high current density and high joule heating create a transient resistance increase. ETF testing reveals two failure modes, and the mode-I failure has the importance in detecting defects. The number of cycles to failure in ETF testing decreases with higher current density, but the rate of thermal cycling has no effect. Results from this investigation suggest that impurities in the copper electrodeposition process must be carefully controlled to achieve reliable ultra thin copper interconnects.

Evaluating Continuing Nursing Education: A Qualitative Study of Intention to Change Practice and Perceived Barriers to Knowledge Translation.

PubMed

Wellings, Cynthea A; Gendek, Marilyn A; Gallagher, Silvia E

Evaluating the effectiveness of continuing nursing education does not always include behavioral change and patient health outcomes. A qualitative analysis of open-ended evaluation questions from continuing nursing education activities was conducted. The aim was to evaluate learners' intentions to change their practice resulting from their learning and their perceived barriers to implementing practice changes. Results revealed the multiple, interconnected challenges involved in translating new learning into practice.

A Unified Access Model for Interconnecting Heterogeneous Wireless Networks

DTIC Science & Technology

2015-05-01

Defined Networking, OpenFlow, WiFi, LTE 16. SECURITY CLASSIFICATION OF: 17. LIMITATION OF ABSTRACT UU 18. NUMBER OF PAGES 18 19a. NAME OF...Machine Configurations with WiFi and LTE 4 2.3 Three Virtual Machine Configurations with WiFi and LTE 5 3. Results and Discussion 5 4. Summary and...WiFi and long-term evolution ( LTE ), and created a communication pathway between them via a central controller node. Our simulation serves as a

Forming electrical interconnections through semiconductor wafers

NASA Technical Reports Server (NTRS)

Anthony, T. R.

1981-01-01

An information processing system based on CMOS/SOS technology is being developed by NASA to process digital image data collected by satellites. An array of holes is laser drilled in a semiconductor wafer, and a conductor is formed in the holes to fabricate electrical interconnections through the wafers. Six techniques are used to form conductors in the silicon-on-sapphire (SOS) wafers, including capillary wetting, wedge extrusion, wire intersection, electroless plating, electroforming, double-sided sputtering and through-hole electroplating. The respective strengths and weaknesses of these techniques are discussed and compared, with double-sided sputtering and the through-hole plating method achieving best results. In addition, hollow conductors provided by the technique are available for solder refill, providing a natural way of forming an electrically connected stack of SOS wafers.

Programmable multi-node quantum network design and simulation

NASA Astrophysics Data System (ADS)

Dasari, Venkat R.; Sadlier, Ronald J.; Prout, Ryan; Williams, Brian P.; Humble, Travis S.

2016-05-01

Software-defined networking offers a device-agnostic programmable framework to encode new network functions. Externally centralized control plane intelligence allows programmers to write network applications and to build functional network designs. OpenFlow is a key protocol widely adopted to build programmable networks because of its programmability, flexibility and ability to interconnect heterogeneous network devices. We simulate the functional topology of a multi-node quantum network that uses programmable network principles to manage quantum metadata for protocols such as teleportation, superdense coding, and quantum key distribution. We first show how the OpenFlow protocol can manage the quantum metadata needed to control the quantum channel. We then use numerical simulation to demonstrate robust programmability of a quantum switch via the OpenFlow network controller while executing an application of superdense coding. We describe the software framework implemented to carry out these simulations and we discuss near-term efforts to realize these applications.