Sample records for joints bond wires

  1. 49 CFR 234.271 - Insulated rail joints, bond wires, and track connections.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Insulated rail joints, bond wires, and track connections. 234.271 Section 234.271 Transportation Other Regulations Relating to Transportation (Continued... joints, bond wires, and track connections. Insulated rail joints, bond wires, and track connections shall...

  2. 49 CFR 234.271 - Insulated rail joints, bond wires, and track connections.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Insulated rail joints, bond wires, and track connections. 234.271 Section 234.271 Transportation Other Regulations Relating to Transportation (Continued... joints, bond wires, and track connections. Insulated rail joints, bond wires, and track connections shall...

  3. Investigation of ball bond integrity for 0.8 mil (20 microns) diameter gold bonding wire on low k die in wire bonding technology

    NASA Astrophysics Data System (ADS)

    Kudtarkar, Santosh Anil

    Microelectronics technology has been undergoing continuous scaling to accommodate customer driven demand for smaller, faster and cheaper products. This demand has been satisfied by using novel materials, design techniques and processes. This results in challenges for the chip connection technology and also the package technology. The focus of this research endeavor was restricted to wire bond interconnect technology using gold bonding wires. Wire bond technology is often regarded as a simple first level interconnection technique. In reality, however, this is a complex process that requires a thorough understanding of the interactions between the design, material and process variables, and their impact on the reliability of the bond formed during this process. This research endeavor primarily focused on low diameter, 0.8 mil thick (20 mum) diameter gold bonding wire. Within the scope of this research, the integrity of the ball bond formed by 1.0 mil (25 mum) and 0.8 mil (20 mum) diameter wires was compared. This was followed by the evaluation of bonds formed on bond pads having doped SiO2 (low k) as underlying structures. In addition, the effect of varying the percentage of the wire dopant, palladium and bonding process parameters (bonding force, bond time, ultrasonic energy) for 0.8 mil (20 mum) bonding wire was also evaluated. Finally, a degradation empirical model was developed to understand the decrease in the wire strength. This research effort helped to develop a fundamental understanding of the various factors affecting the reliability of a ball bond from a design (low diameter bonding wire), material (low k and bonding wire dopants), and process (wire bonding process parameters) perspective for a first level interconnection technique, namely wire bonding. The significance of this research endeavor was the systematic investigation of the ball bonds formed using 0.8 mil (20 microm) gold bonding wire within the wire bonding arena. This research addressed low k

  4. 1 mil gold bond wire study.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Huff, Johnathon; McLean, Michael B.; Jenkins, Mark W.

    2013-05-01

    In microcircuit fabrication, the diameter and length of a bond wire have been shown to both affect the current versus fusing time ratio of a bond wire as well as the gap length of the fused wire. This study investigated the impact of current level on the time-to-open and gap length of 1 mil by 60 mil gold bond wires. During the experiments, constant current was provided for a control set of bond wires for 250ms, 410ms and until the wire fused; non-destructively pull-tested wires for 250ms; and notched wires. The key findings were that as the current increases, themore » gap length increases and 73% of the bond wires will fuse at 1.8A, and 100% of the wires fuse at 1.9A within 60ms. Due to the limited scope of experiments and limited data analyzed, further investigation is encouraged to confirm these observations.« less

  5. Body of Knowledge (BOK) for Copper Wire Bonds

    NASA Technical Reports Server (NTRS)

    Rutkowski, E.; Sampson, M. J.

    2015-01-01

    Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications

  6. Reliability Criteria for Thick Bonding Wire.

    PubMed

    Dagdelen, Turker; Abdel-Rahman, Eihab; Yavuz, Mustafa

    2018-04-17

    Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

  7. Reliability Criteria for Thick Bonding Wire

    PubMed Central

    Yavuz, Mustafa

    2018-01-01

    Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. PMID:29673194

  8. Hot wire anemometer measurements in the unheated air flow tests of the SRB nozzle-to-case joint

    NASA Technical Reports Server (NTRS)

    Ramachandran, N.

    1988-01-01

    Hot-Wire Anemometer measurements made in the Solid Rocket Booster (SRB) nozzle-to-case joint are discussed. The study was undertaken to glean additional information on the circumferential flow induced in the SRB nozzle joint and the effect of this flow on the insulation bonding flaws. The tests were conducted on a full-scale, 2-D representation of a 65-in long segment of the SRB nozzle joint, with unheated air as the working fluid. Both the flight Mach number and Reynolds number were matched simultaneously and different pressure gradients imposed along the joint face were investigated. Hot-wire anemometers were used to obtain velocity data for different joint gaps and debond configurations. The procedure adopted for hot-wire calibration and use is outlined and the results from the tests summarized.

  9. Reliability improvement of wire bonds subjected to fatigue stresses.

    NASA Technical Reports Server (NTRS)

    Ravi, K. V.; Philofsky, E. M.

    1972-01-01

    The failure of wire bonds due to repeated flexure when semiconductor devices are operated in an on-off mode has been investigated. An accelerated fatigue testing apparatus was constructed and the major fatigue variables, aluminum alloy composition, and bonding mechanism, were tested. The data showed Al-1% Mg wires to exhibit superior fatigue characteristics compared to Al-1% Cu or Al-1% Si and ultrasonic bonding to be better than thermocompression bonding for fatigue resistance. Based on these results highly reliable devices were fabricated using Al-1% Mg wire with ultrasonic bonding which withstood 120,000 power cycles with no failures.

  10. High reliability bond program using small diameter aluminum wire

    NASA Technical Reports Server (NTRS)

    Macha, M.; Thiel, R. A.

    1975-01-01

    The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

  11. Comparison of three different orthodontic wires for bonded lingual retainer fabrication

    PubMed Central

    Uysal, Tancan; Gul, Nisa; Alan, Melike Busra; Ramoglu, Sabri Ilhan

    2012-01-01

    Objective We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. Methods We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), 0.016 × 0.022-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III). To test detachment force, deformation, and fracture mode, we embedded 94 lower incisor teeth in acrylic blocks in pairs. Retainer wires were bonded to the teeth and vertically directed force was applied to the wire. To test pull-out force, wires were embedded in composite that was placed in a hole at the center of an acrylic block. Tensile force was applied along the long axis of the wire. Results Detachment force and mode of fracture were not different between groups. Deformation was significantly higher in groups II and III than in group I (p < 0.001). Mean pull-out force was significantly higher for group I compared to groups II and III (p < 0.001). Conclusions Detachment force and fracture mode were similar for all wires, but greater deformations were seen in dead-soft wires. Wire pull-out force was significantly higher for five-stranded coaxial wire than for the other wires tested. Five-stranded coaxial wires are suggested for use in bonded lingual retainers. PMID:23112930

  12. Ultrasonic friction power during Al wire wedge-wedge bonding

    NASA Astrophysics Data System (ADS)

    Shah, A.; Gaul, H.; Schneider-Ramelow, M.; Reichl, H.; Mayer, M.; Zhou, Y.

    2009-07-01

    Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits. The bonding wire used is a 25μm diameter AlSi1 wire. A friction power model is used to derive the ultrasonic friction power during Al wire bonding. Auxiliary measurements include the current delivered to the ultrasonic transducer, the vibration amplitude of the bonding tool tip in free air, and the ultrasonic force acting on the bonding pad during the bond process. The ultrasonic force measurement is like a signature of the bond as it allows for a detailed insight into mechanisms during various phases of the process. It is measured using piezoresistive force microsensors integrated close to the Al bonding pad (Al-Al process) on a custom made test chip. A clear break-off in the force signal is observed, which is followed by a relatively constant force for a short duration. A large second harmonic content is observed, describing a nonsymmetric deviation of the signal wave form from the sinusoidal shape. This deviation might be due to the reduced geometrical symmetry of the wedge tool. For bonds made with typical process parameters, several characteristic values used in the friction power model are determined. The ultrasonic compliance of the bonding system is 2.66μm/N. A typical maximum value of the relative interfacial amplitude of ultrasonic friction is at least 222nm. The maximum interfacial friction power is at least 11.5mW, which is only about 4.8% of the total electrical power delivered to the ultrasonic generator.

  13. Shear bond strength of different retainer wires and bonding adhesives in consideration of the pretreatment process.

    PubMed

    Reicheneder, Claudia; Hofrichter, Bernd; Faltermeier, Andreas; Proff, Peter; Lippold, Carsten; Kirschneck, Christian

    2014-11-28

    We aimed to compare the shear bond strength (SBS) of three different retainer wires and three different bonding adhesives in consideration of the pretreatment process of enamel surface sandblasting. 400 extracted bovine incisors were divided into 10 groups of 20 paired specimens each. 10 specimens of each group were pretreated by enamel sandblasting. The retainer wires Bond-A-Braid™, GAC-Wildcat®-Twistflex and everStick®ORTHO were bonded to the teeth with the adhesives Transbond™-LR, Tetric-EvoFlow™ and Stick®FLOW and then debonded measuring the SBS. While sandblasting generally increased SBS for all tested combinations, the retainer wires bonded with Transbond™-LR showed the highest SBS both with and without prior sandblasting. Significantly lower SBS were found for Tetric-EvoFlow™ that were comparable to those for everStick®ORTHO. Pretreatment of enamel surfaces by sandblasting increased the SBS of all retainer-wires. Transbond™-LR showed the best results compared to Tetric-EvoFlow™ and everStick®ORTHO, while all combinations used provided sufficient bonding strengths for clinical use.

  14. Reliability improvement of 1 mil aluminum wire bonds for semiconductors, technical performance summary

    NASA Technical Reports Server (NTRS)

    1971-01-01

    The reliability of semiconductor devices as influenced by the reliability of wire bonds used in the assembly of the devices is investigated. The specific type of failure dealt with involves fracture of wire bonds as a result of repeated flexure of the wire at the heel of the bond when the devices are operated in an on-off mode. The mechanism of failure is one of induced fracture of the wire. To improve the reliability of a chosen transistor, one-mil diameter wires of aluminum with various alloy additions were studied using an accelerated fatigue testing machine. In addition, the electroprobe was used to study the metallurgy of the wires as to microstructure and kinetics of the growth of insoluble phases. Thermocompression and ultrasonic bonding techniques were also investigated.

  15. K-wire and tension band wire fixation in treating sternoclavicular joint dislocation.

    PubMed

    Chen, Qing-yu; Cheng, Shao-wen; Wang, Wei; Lin, Zhong-qin; Zhang, Wei; Kou, Dong-quan; Shen, Yue; Ying, Xiao-zhou; Cheng, Xiao-jie; Lv, Chuan-zhu; Peng, Lei

    2011-02-01

    To evaluate the feasibility and therapeutic effect of treating sternoclavicular joint dislocation by K-wire and tension band wire fixation, and to improve the safety and stability of this technique. This study consisted of 9 cases, 6 males and 3 females with the mean age of 25 years (range, 9-62 years). The causes were traffic accident in 7 cases, falling in 1 case and fight in 1 case. The duration from injury to operation was 2 hours to 7 days. There were 5 left dislocations and 4 right dislocations; 8 anterior dislocations and 1 posterior dislocation, including one combined with left scapular fracture and one with left olecranon fracture. Open reduction and internal fixation using K-wires and tension band wires were performed to treat dislocations. All patients were followed up for 6 to 24 months, 10 months on average. According to Rockwood's rating scale on postoperative sternoclavicular joint, 8 cases achieved excellent outcomes with an average score of 13.88, and the rest case achieved a good outcome with the score of 12. Anatomical reduction was obtained in all cases. There were no such postoperative complications as severe infection, injury to blood vessel and nerve, failure of fixation, etc. Patients were all satisfied with the anatomical reduction and functional recovery. The technique of K-wire and tension band wire fixation is safe, simple, effective, less invasive and has been successfully used in orthopedic surgery. It is effective in treating sternoclavicular joint dislocation though it has some disadvantages.

  16. Reliability of copper wire bonds on a novel over-pad metallization

    NASA Astrophysics Data System (ADS)

    Kawashiro, Fumiyoshi; Itoh, Satoshi; Maeda, Takehiko; Hirose, Tetsuya; Yajima, Akira; Etoh, Takaki; Nishikawa, Hiroshi

    2015-05-01

    Wire bonding technology is used in most semiconductor products. Recently, high gold prices have forced semiconductor manufacturers to replace Au wires with Cu wires. Because Cu wire bonds are vulnerable to high temperature and humidity, they remain unpopular in automotive and industrial applications with narrow-bond-pad pitches and small deformed ball diameters. To avoid forming the corrosive Cu-rich intermetallic compound Cu9Al4, the use of a Ni/Pd(/Au) over-pad metallization (OPM) structure produced by electroless plating on the Al metallization has been proposed. However, certain technical issues must be overcome, such as variations in the purity and thickness of the plating. To tackle these issues, a novel OPM structure produced by physical vapor deposition is proposed and evaluated in this study.

  17. Splicing Wires Permanently With Explosives

    NASA Technical Reports Server (NTRS)

    Bement, Laurence J.; Kushnick, Anne C.

    1990-01-01

    Explosive joining process developed to splice wires by enclosing and metallurgically bonding wires within copper sheets. Joints exhibit many desirable characteristics, 100-percent conductivity and strength, no heat-induced annealing, no susceptibility to corrosion in contacts between dissimilar metals, and stability at high temperature. Used to join wires to terminals, as well as to splice wires. Applicable to telecommunications industry, in which millions of small wires spliced annually.

  18. Fine pitch thermosonic wire bonding: analysis of state-of-the-art manufacturing capability

    NASA Astrophysics Data System (ADS)

    Cavasin, Daniel

    1995-09-01

    A comprehensive process characterization was performed at the Motorola plastic package assembly site in Selangor, Malaysia, to document the current fine pitch wire bond process capability, using state-of-the-art equipment, in an actual manufacturing environment. Two machines, representing the latest technology from two separate manufacturers, were operated one shift per day for five days, bonding a 132 lead Plastic Quad Flat Pack. Using a test device specifically designed for fine pitch wire bonding, the bonding programs were alternated between 107 micrometers and 92 micrometers pad pitch, running each pitch for a total of 1600 units per machine. Wire, capillary type, and related materials were standardized and commercially available. A video metrology measurement system, with a demonstrated six sigma repeatability band width of 0.51 micrometers , was utilized to measure the bonded units for bond dimensions and placement. Standard Quality Assurance (QA) metrics were also performed. Results indicate that state-of-the-art thermosonic wire bonding can achieve acceptable assembly yields at these fine pad pitches.

  19. High-frequency ultrasonic wire bonding systems

    PubMed

    Tsujino; Yoshihara; Sano; Ihara

    2000-03-01

    The vibration characteristics of longitudinal-complex transverse vibration systems with multiple resonance frequencies of 350-980 kHz for ultrasonic wire bonding of IC, LSI or electronic devices were studied. The complex vibration systems can be applied for direct welding of semiconductor tips (face-down bonding, flip-chip bonding) and packaging of electronic devices. A longitudinal-complex transverse vibration bonding system consists of a complex transverse vibration rod, two driving longitudinal transducers 7.0 mm in diameter and a transverse vibration welding tip. The vibration distributions along ceramic and stainless-steel welding tips were measured at up to 980 kHz. A high-frequency vibration system with a height of 20.7 mm and a weight of less than 15 g was obtained.

  20. Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres

    PubMed Central

    Cao, Siyang; Pyatt, Simon; Anthony, Carl J.; Kubba, Ammar I.; Kubba, Ali E.; Olatunbosun, Oluremi

    2016-01-01

    The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology. PMID:27338402

  1. Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres.

    PubMed

    Cao, Siyang; Pyatt, Simon; Anthony, Carl J; Kubba, Ammar I; Kubba, Ali E; Olatunbosun, Oluremi

    2016-06-21

    The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology.

  2. Development of explosively bonded TZM wire reinforced Columbian sheet composites

    NASA Technical Reports Server (NTRS)

    Otto, H. E.; Carpenter, S. H.

    1972-01-01

    Methods of producing TZM molybdenum wire reinforced C129Y columbium alloy composites by explosive welding were studied. Layers of TZM molybdenum wire were wound on frames with alternate layers of C129Y columbium alloy foil between the wire layers. The frames held both the wire and foils in place for the explosive bonding process. A goal of 33 volume percent molybdenum wire was achieved for some of the composites. Variables included wire diameter, foil thickness, wire separation, standoff distance between foils and types and amounts of explosive. The program was divided into two phases: (1) development of basic welding parameters using 5 x 10-inch composites, and (2) scaleup to 10 x 20-inch composites.

  3. Finite Element Bond Modeling for Indented Wires in Pretensioned Concrete Crossties

    DOT National Transportation Integrated Search

    2016-04-12

    Indented wires have been increasingly employed by : concrete crosstie manufacturers to improve the bond between : prestressing steel reinforcements and concrete, as bond can : affect several critical performance measures, including transfer : length,...

  4. Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode.

    PubMed

    Wu, Bulong; Luo, Xiaobing; Zheng, Huai; Liu, Sheng

    2011-11-21

    Gold wire bonding is an important packaging process of lighting emitting diode (LED). In this work, we studied the effect of gold wire bonding on the angular uniformity of correlated color temperature (CCT) in white LEDs whose phosphor layers were coated by freely dispersed coating process. Experimental study indicated that different gold wire bonding impacts the geometry of phosphor layer, and it results in different fluctuation trends of angular CCT at different spatial planes in one LED sample. It also results in various fluctuating amplitudes of angular CCT distributions at the same spatial plane for samples with different wire bonding angles. The gold wire bonding process has important impact on angular uniformity of CCT in LED package. © 2011 Optical Society of America

  5. 49 CFR 236.711 - Bond, rail joint.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Bond, rail joint. 236.711 Section 236.711 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION... Bond, rail joint. A metallic connection attached to adjoining rails to insure electrical conductivity. ...

  6. Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film

    NASA Technical Reports Server (NTRS)

    Iwata, S.; Ishizaka, A.; Yamamoto, H.

    1984-01-01

    The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis.

  7. Welding Wires To Thin Thermocouple Films

    NASA Technical Reports Server (NTRS)

    Holanda, Raymond; Kim, Walter S.; Danzey, Gerald A.; Pencil, Eric; Wadel, Mary

    1993-01-01

    Parallel-gap resistance welding yields joints surviving temperatures of about 1,000 degrees C. Much faster than thermocompression bonding. Also exceeds conductive-paste bonding and sputtering thin films through porous flame-sprayed insulation on prewelded lead wires. Introduces no foreign material into thermocouple circuit and does not require careful control of thickness of flame-sprayed material.

  8. Failure of dissimilar material bonded joints

    NASA Astrophysics Data System (ADS)

    Konstantakopoulou, M.; Deligianni, A.; Kotsikos, G.

    2016-03-01

    Joining of materials in structural design has always been a challenge for engineers. Bolting and riveting has been used for many years, until the emergence of fusion welding which revolutionised construction in areas such as shipbuilding, automotive, infrastructure and consumer goods. Extensive research in the past 50 years has resulted in better understanding of the process and minimised the occurrence of failures associated with fusion welding such as, residual stress cracking, stress corrosion and corrosion fatigue cracking, localised reduction in mechanical properties due to microstructural changes (heat affected zone) etc. Bonding has been a technique that has been proposed as an alternative because it eliminates several of the problems associated with fusion welding. But, despite some applications it has not seen wide use. There is however a renewed interest in adhesively bonded joints, as designers look for ever more efficient structures which inevitably leads to the use and consequently joining of combinations of lightweight materials, often with fundamentally different mechanical and physical properties. This chapter provides a review of adhesively bonded joints and reports on improvements to bonded joint strength through the introduction of carbon nanotubes at the bond interface. Results from various workers in the field are reported as well as the findings of the authors in this area of research. It is obvious that there are several challenges that need to be addressed to further enhance the strength of bonded joints and worldwide research is currently underway to address those shortcomings and build confidence in the implementation of these new techniques.

  9. Progressive Damage Analysis of Bonded Composite Joints

    NASA Technical Reports Server (NTRS)

    Leone, Frank A., Jr.; Girolamo, Donato; Davila, Carlos G.

    2012-01-01

    The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented durable redundant joint. Both designs involve honeycomb sandwich structures with carbon/epoxy facesheets joined using adhesively bonded doublers.Progressive damage modeling allows for the prediction of the initiation and evolution of damage within a structure. For structures that include multiple material systems, such as the joint designs under consideration, the number of potential failure mechanisms that must be accounted for drastically increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, intraply matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The bonded joints were modeled using highly parametric, explicitly solved finite element models, with damage modeling implemented via custom user-written subroutines. Each ply was discretely meshed using three-dimensional solid elements. Layers of cohesive elements were included between each ply to account for the possibility of delaminations and were used to model the adhesive layers forming the joint. Good correlation with experimental results was achieved both in terms of load-displacement history and the predicted failure mechanism(s).

  10. Deployable robotic woven wire structures and joints for space applications

    NASA Technical Reports Server (NTRS)

    Shahinpoor, MO; Smith, Bradford

    1991-01-01

    Deployable robotic structures are basically expandable and contractable structures that may be transported or launched to space in a compact form. These structures may then be intelligently deployed by suitable actuators. The deployment may also be done by means of either airbag or spring-loaded typed mechanisms. The actuators may be pneumatic, hydraulic, ball-screw type, or electromagnetic. The means to trigger actuation may be on-board EPROMS, programmable logic controllers (PLCs) that trigger actuation based on some input caused by the placement of the structure in the space environment. The actuation may also be performed remotely by suitable remote triggering devices. Several deployable woven wire structures are examined. These woven wire structures possess a unique form of joint, the woven wire joint, which is capable of moving and changing its position and orientation with respect to the structure itself. Due to the highly dynamic and articulate nature of these joints the 3-D structures built using them are uniquely and highly expandable, deployable, and dynamic. The 3-D structure naturally gives rise to a new generation of deployable three-dimensional spatial structures.

  11. Adhesive Bonding Characterization of Composite Joints for Cryogenic Usage

    NASA Technical Reports Server (NTRS)

    Graf, Neil A.; Schieleit, Gregory F.; Biggs, Robert

    2000-01-01

    The development of polymer composite cryogenic tanks is a critical step in creating the next generation of launch vehicles. Future reusable launch vehicles need to minimize the gross liftoff weight (GLOW). This weight reduction is possible due to the large reduction in weight that composite materials can provide over current aluminum technology. In addition to composite technology, adhesively bonded joints potentially have several benefits over mechanically fastened joints, such as weight savings and cryogenic fluid containment. Adhesively bonded joints may be used in several areas of these cryogenic tanks, such as in lobe-to-lobe joints (in a multi-lobe concept), skirt-to-tank joint, strut-to-tank joint, and for attaching stringers and ring frames. The bonds, and the tanks themselves, must be able to withstand liquid cryogenic fuel temperatures that they contain. However, the use of adhesively bonded composite joints at liquid oxygen and hydrogen temperatures is largely unknown and must be characterized. Lockheed Martin Space Systems Company, Michoud Operations performed coupon-level tests to determine effects of material selection, cure process parameters, substrate surface preparation, and other factors on the strength of these composite joints at cryogenic temperatures. This led to the selection of a material and process that would be suitable for a cryogenic tank. KEY WORDS: Composites, Adhesive Bonding, Cryogenics

  12. Comparison of joint designs for laser welding of cast metal plates and wrought wires.

    PubMed

    Takayama, Yasuko; Nomoto, Rie; Nakajima, Hiroyuki; Ohkubo, Chikahiro

    2013-01-01

    The purpose of the present study was to compare joint designs for the laser welding of cast metal plates and wrought wire, and to evaluate the welded area internally using X-ray micro-focus computerized tomography (micro-CT). Cast metal plates (Ti, Co-Cr) and wrought wires (Ti, Co-Cr) were welded using similar metals. The specimens were welded using four joint designs in which the wrought wires and the parent metals were welded directly (two designs) or the wrought wires were welded to the groove of the parent metal from one or both sides (n = 5). The porosity and gap in the welded area were evaluated by micro-CT, and the maximum tensile load of the welded specimens was measured with a universal testing machine. An element analysis was conducted using an electron probe X-ray microanalyzer. The statistical analysis of the results was performed using Bonferroni's multiple comparisons (α = 0.05). The results included that all the specimens fractured at the wrought wire when subjected to tensile testing, although there were specimens that exhibited gaps due to the joint design. The wrought wires were affected by laser irradiation and observed to melt together and onto the filler metal. Both Mo and Sn elements found in the wrought wire were detected in the filler metal of the Ti specimens, and Ni was detected in the filler metal of the Co-Cr specimens. The four joint designs simulating the designs used clinically were confirmed to have adequate joint strength provided by laser welding.

  13. Hybrid FSWeld-bonded joint fatigue behaviour

    NASA Astrophysics Data System (ADS)

    Lertora, Enrico; Mandolfino, Chiara; Gambaro, Carla; Pizzorni, Marco

    2018-05-01

    Aluminium alloys, widely used in aeronautics, are increasingly involved in the automotive industry due to the good relationship between mechanical strength and specific weight. The lightening of the structures is the first objective, which allows the decreasing in the weight in motion. The use of aluminium alloys has also seen the introduction of the Friction Stir Welding (FSW) technique for the production of structural overlapping joints. FSW allows us to weld overlap joints free from defects, but with the presence of a structural notch further aggravated by the presence of a "hook" defect near the edge of the weld. Furthermore, FSW presents a weld penetration area connected to the tool geometry and penetration. The experimental activity will be focused on the combination of two different joining techniques, which can synergistically improve the final joint resistance. In particular, the welding and bonding process most commonly known as weld-bonding is defined as a hybrid process, as it combines two different junction processes. In this paper we analyse FSWelded AA6082 aluminium alloy overlapped joint with the aim of quantitatively evaluating the improvement provided by the presence of an epoxy adhesive between the plates. After optimising the weld-bonding process, the mechanical behaviour of welded joints will be analysed by static and dynamic tests. The presence of the adhesive should limit the negative effect of the structural notch inevitable in a FSW overlapped joint.

  14. New design for a rotatory joint actuator made with shape memory alloy contractile wire

    NASA Astrophysics Data System (ADS)

    Wang, Guoping; Shahinpoor, Mohsen

    1996-05-01

    A design approach for a rotatory joint actuator using a contractile shape memory alloy (SMA) wire is presented and an example design is followed. In this example, the output torque of the actuator is 18 Newton-meters, and its angular range is 30 degrees. Compared with a SMA spring type actuating component, a SMA wire type actuating component uses less SMA material and uses less electrical energy when it is electrically powered. On the other hand, a SMA wire type actuating component must have a large SMA wire length to produce a required amount of angular rotation of the joint. When pulleys are used to arrange a lengthy SMA wire in a small space, the friction between pulleys and pins is introduced and the performance of the joint actuator is degenerated to some degree. The investigated joint actuator provides a good chance for developing powered orthoses with SMA actuators for disabled individuals. It can relieve the weight concern with hydraulic and motor-powered orthoses and the safety concern with motor-powered orthoses. When electrically powered, a SMA actuator has the disadvantage of low energy efficiency.

  15. Adhesive-bonded scarf and stepped-lap joints

    NASA Technical Reports Server (NTRS)

    Hart-Smith, L. J.

    1973-01-01

    Continuum mechanics solutions are derived for the static load-carrying capacity of scarf and stepped-lap adhesive-bonded joints. The analyses account for adhesive plasticity and adherend stiffness imbalance and thermal mismatch. The scarf joint solutions include a simple algebraic formula which serves as a close lower bound, within a small fraction of a per cent of the true answer for most practical geometries and materials. Digital computer programs were developed and, for the stepped-lap joints, the critical adherend and adhesive stresses are computed for each step. The scarf joint solutions exhibit grossly different behavior from that for double-lap joints for long overlaps inasmuch as that the potential bond shear strength continues to increase with indefinitely long overlaps on the scarf joints. The stepped-lap joint solutions exhibit some characteristics of both the scarf and double-lap joints. The stepped-lap computer program handles arbitrary (different) step lengths and thickness and the solutions obtained have clarified potentially weak design details and the remedies. The program has been used effectively to optimize the joint proportions.

  16. Design and fabrication of realistic adhesively bonded joints

    NASA Technical Reports Server (NTRS)

    Shyprykevich, P.

    1983-01-01

    Eighteen bonded joint test specimens representing three different designs of a composite wing chordwise bonded splice were designed and fabricated using current aircraft industry practices. Three types of joints (full wing laminate penetration, two side stepped; midthickness penetration, one side stepped; and partial penetration, scarfed) were analyzed using state of the art elastic joint analysis modified for plastic behavior of the adhesive. The static tensile fail load at room temperature was predicted to be: (1) 1026 kN/m (5860 1b/in) for the two side stepped joint; (2) 925 kN/m (5287 1b/in) for the one side stepped joint; and (3) 1330 kN/m (7600 1b/in) for the scarfed joint. All joints were designed to fail in the adhesive.

  17. Attaching Copper Wires to Magnetic-Reed-Switch Leads

    NASA Technical Reports Server (NTRS)

    Kamila, Rudolf

    1987-01-01

    Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

  18. Research regarding stiffness optimization of wires used for joints actuation from an elephant's trunk robotic arm

    NASA Astrophysics Data System (ADS)

    Ciofu, C.; Stan, G.

    2016-11-01

    Elephant's trunk robotic arms driven by wires and pulley mechanisms have issues with wires stiffness because of the entailed elastic deformations that is causing errors of positioning. Static and dynamic loads from each joint of the robotic arm affect the stiffness of driving wires and precision positioning. The influence of wires elastic deformation on precision positioning decreases with the increasing of wires stiffness by using different pre-tensioning devices. In this paper, we analyze the variation of driving wires stiffness particularly to each wire driven joint. We obtain optimum wires stiffness variation by using an analytical method that highlights the efficiency of pre-tensioning mechanism. The analysis of driving wires stiffness is necessary for taking appropriate optimization measures of robotic arm dynamic behavior and, thus, for decreasing positioning errors of the elephant's trunk robotic arm with inner actuation through wires/cables.

  19. Dual resin bonded joints in polyetheretherketone (PEEK) matrix composites

    NASA Astrophysics Data System (ADS)

    Zelenak, Steve; Radford, Donald W.; Dean, Michael W.

    1993-04-01

    The paper describes applications of the dual resin (miscible polymer) bonding technique (Smiley, 1989) developed as an alternative to traditional bonding approaches to joining thermoplastic matrix composite subassemblies into structures. In the experiments, the performance of joint geometries, such as those that could be used to assemble large truss structures in space, are investigated using truss joint models consisting of woven carbon fiber/PEEK tubes of about 1 mm wall thickness. Specific process conditions and hand-held hardware used to apply heat and pressure were chosen to simulate a field asembly technique. Results are presented on tube/cruciform double lap shear tests, pinned-pinned tube compression tests, and single lap shear bond tests of joints obtained using the dual resin bonding technique.

  20. Nondestructive Evaluation of Adhesively Bonded Joints

    NASA Technical Reports Server (NTRS)

    Nayeb-Hashemi, Hamid; Rossettos, J. N.

    1997-01-01

    The final report consists of 5 published papers in referred journals and a technical letter to the technical monitor. These papers include the following: (1) Comparison of the effects of debonds and voids in adhesive; (2) On the peak shear stresses in adhesive joints with voids; (3) Nondestructive evaluation of adhesively bonded joints by acousto-ultrasonic technique and acoustic emission; (4) Multiaxial fatigue life evaluation of tubular adhesively bonded joints; (5) Theoretical and experimental evaluation of the bond strength under peeling loads. The letter outlines the progress of the research. Also included is preliminary information on the study of nondestructive evaluation of composite materials subjected to localized heat damage. The investigators studied the effects of localized heat on unidirectional fiber glass epoxy composite panels. Specimens of the fiber glass epoxy composites were subjected to 400 C heat for varying lengths of time. The specimens were subjected to nondestructive tests. The specimens were then pulled to their failure and acoustic emission of these specimens were measured. The analysis of the data was continuing as of the writing of the letter, and includes a finite element stress analysis of the problem.

  1. Failure mechanisms in wood joints bonded with urea-formaldehyde adhesives

    Treesearch

    B.H. River; R.O. Ebewele; G.E. Myers

    1994-01-01

    Wood joints bonded with urea-formaldehyde (UF) are weakened by cyclic swelling and shrinking. To study the failure mechanisms in UF-bonded joints, specimens were bonded with unmodified, modified (amine), or phenol formaldehyde adhesive and subjected to accelerated aging. Modification of the adhesive properties increased the cleavage fracture toughness and shear...

  2. Progressive Damage Modeling of Durable Bonded Joint Technology

    NASA Technical Reports Server (NTRS)

    Leone, Frank A.; Davila, Carlos G.; Lin, Shih-Yung; Smeltzer, Stan; Girolamo, Donato; Ghose, Sayata; Guzman, Juan C.; McCarville, Duglas A.

    2013-01-01

    The development of durable bonded joint technology for assembling composite structures for launch vehicles is being pursued for the U.S. Space Launch System. The present work is related to the development and application of progressive damage modeling techniques to bonded joint technology applicable to a wide range of sandwich structures for a Heavy Lift Launch Vehicle. The joint designs studied in this work include a conventional composite splice joint and a NASA-patented Durable Redundant Joint. Both designs involve a honeycomb sandwich with carbon/epoxy facesheets joined with adhesively bonded doublers. Progressive damage modeling allows for the prediction of the initiation and evolution of damage. For structures that include multiple materials, the number of potential failure mechanisms that must be considered increases the complexity of the analyses. Potential failure mechanisms include fiber fracture, matrix cracking, delamination, core crushing, adhesive failure, and their interactions. The joints were modeled using Abaqus parametric finite element models, in which damage was modeled with user-written subroutines. Each ply was meshed discretely, and layers of cohesive elements were used to account for delaminations and to model the adhesive layers. Good correlation with experimental results was achieved both in terms of load-displacement history and predicted failure mechanisms.

  3. Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates

    NASA Astrophysics Data System (ADS)

    Fischer, A. C.; Gradin, H.; Schröder, S.; Braun, S.; Stemme, G.; van der Wijngaart, W.; Niklaus, F.

    2012-05-01

    This paper reports on a novel technique for the integration of NiTi shape memory alloy wires and other non-bondable wire materials into silicon-based microelectromechanical system structures using a standard wire-bonding tool. The efficient placement and alignment functions of the wire-bonding tool are used to mechanically attach the wire to deep-etched silicon anchoring and clamping structures. This approach enables a reliable and accurate integration of wire materials that cannot be wire bonded by traditional means.

  4. Bonded joint and method. [for reducing peak shear stress in adhesive bonds

    NASA Technical Reports Server (NTRS)

    Sainsbury-Carter, J. B. (Inventor)

    1974-01-01

    An improved joint is described for reducing the peak shear stress in adhesive bonds when adhesives are used to bond two materials which are in a lapped relationship and which differ in value of modulus of elasticity. An insert placed between the adhesive and one of the two materials acts to cushion the discontinuity of material stiffness thereby reducing the peak shear stress in the adhesive bond.

  5. Improvement of modulation bandwidth in electroabsorption-modulated laser by utilizing the resonance property in bonding wire.

    PubMed

    Kwon, Oh Kee; Han, Young Tak; Baek, Yong Soon; Chung, Yun C

    2012-05-21

    We present and demonstrate a simple and cost-effective technique for improving the modulation bandwidth of electroabsorption-modulated laser (EML). This technique utilizes the RF resonance caused by the EML chip (i.e., junction capacitance) and bonding wire (i.e, wire inductance). We analyze the effects of the lengths of the bonding wires on the frequency responses of EML by using an equivalent circuit model. To verify this analysis, we package a lumped EML chip on the sub-mount and measure its frequency responses. The results show that, by using the proposed technique, we can increase the modulation bandwidth of EML from ~16 GHz to ~28 GHz.

  6. Time- and temperature-dependent failures of a bonded joint

    NASA Astrophysics Data System (ADS)

    Sihn, Sangwook

    This dissertation summarizes my study of time- and temperature-dependent behavior of a tubular lap bonded joint to provide a design methodology for windmill blade structures. The bonded joint is between a cast-iron rod and a GFRP composite pipe. The adhesive material is an epoxy containing chopped glass fibers. We proposed a new fabrication method to make concentric and void-less specimens of the tubular joint with a thick adhesive bondline to stimulate the root bond of a blade. The thick bondline facilitates the joint assembly of actual blades. For a better understanding of the behavior of the bonded joint, we studied viscoelastic behavior of the adhesive materials by measuring creep compliance at several temperatures during loading period. We observed that the creep compliance depends highly on the period of loading and the temperature. We applied time-temperature equivalence to the creep compliance of the adhesive material to obtain time-temperature shift factors. We also performed constant-rate of monotonically increased uniaxial tensile tests to measure static strength of the tubular lap joint at several temperatures and different strain-rates. We observed two failure modes from load-deflection curves and failed specimens. One is the brittle mode, which was caused by weakness of the interfacial strength occurring at low temperature and short period of loading. The other is the ductile mode, which was caused by weakness of the adhesive material at high temperature and long period of loading. Transition from the brittle to the ductile mode appeared as the temperature or the loading period increased. We also performed tests under uniaxial tensile-tensile cyclic loadings to measure fatigue strength of the bonded joint at several temperatures, frequencies and stress ratios. The fatigue data are analyzed statistically by applying the residual strength degradation model to calculate statistical distribution of the fatigue life. Combining the time

  7. The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging

    NASA Astrophysics Data System (ADS)

    Ismail, Roslina; Omar, Ghazali; Jalar, Azman; Majlis, Burhanuddin Yeop

    2015-07-01

    Wire bonding processes has been widely adopted in micro-electromechanical systems (MEMS) packaging especially in biomedical devices for the integration of components. In the first process sequence in wire bonding, the zone along the wire near the melted tips is called the heat-affected zone (HAZ). The HAZ plays an important factor that influenced the looping profiles of wire bonding process. This paper investigates the effect of dopants on microstructures in the HAZ. One precent palladium (Pd) was added to the as-drawn 4N gold wire and annealed at 600°C. The addition of Pd was able to moderate the grain growth in the HAZ by retarding the heat propagation to the wire. In the formation of the looping profile, the first bending point of the looping is highly associated with the length of the HAZ. The alloyed gold wire (2N gold) has a sharp angle at a distance of about 30 m from the neck of the wire with a measured bending radius of about 40 mm and bending angle of about 40° clockwise from vertical axis, while the 4N gold wire bends at a longer distance. It also shows that the HAZ for 4N gold is longer than 2N gold wire.

  8. Finite element bond models for seven-wire prestressing strands in concrete crossties.

    DOT National Transportation Integrated Search

    2015-03-23

    Seven-wire strands are commonly used in pretensioned : concrete ties, but its bonding mechanism with concrete needs : further examination to provide a better understanding of some : concrete tie failure modes. As a key component in the finite : eleme...

  9. Global-Local Finite Element Analysis of Bonded Single-Lap Joints

    NASA Technical Reports Server (NTRS)

    Kilic, Bahattin; Madenci, Erdogan; Ambur, Damodar R.

    2004-01-01

    Adhesively bonded lap joints involve dissimilar material junctions and sharp changes in geometry, possibly leading to premature failure. Although the finite element method is well suited to model the bonded lap joints, traditional finite elements are incapable of correctly resolving the stress state at junctions of dissimilar materials because of the unbounded nature of the stresses. In order to facilitate the use of bonded lap joints in future structures, this study presents a finite element technique utilizing a global (special) element coupled with traditional elements. The global element includes the singular behavior at the junction of dissimilar materials with or without traction-free surfaces.

  10. [The effects of different welding wires on the mechanical properties of laser welding joints].

    PubMed

    Huang, Qing-feng; Zhang, Jian-zhong; Jiang, Wei-dong; Li, Quan; Yu, Jin-xing

    2006-08-01

    To evaluate the mechanical properties and microstructure of laser-welded joints with different welding wires for clinical use of welding wire. The standard tensile test and three-point bending test rods were made from Co-Cr and Ni-Cr alloy, and were laser-welded with different welding wire (commercially welding wire and casting wire). Then the tensile rods were tested for the ultimate tensile strength (UTS), and the bending rods for the ultimate bending strength (UBS). The results was analyzed by one-way ANOVA. The tensile fracture surface were examined by scanning electron microscopy (SEM). Metallurgical analysis were also performed on polished longitudinal sectioned samples. For Co-Cr alloy, the UTS of casting wire group and commercially welding wire group was respectively (606.40+/-82.53)MPa and (693.61+/-47.68)MPa; the UBS was respectively (997.95+/-88.89)MPa and (1160.76+/-91.59)MPa. ANOVA showed a significant difference of UTS and UBS between the two groups at the 0.05 level (P<0.05). For Ni-Cr alloy, the UTS of casting wire group and commercially welding wire group was respectively (558.14+/-46.75)MPa and (582.32+/-35.43)MPa; the UBS was respectively (1084.75+/-46.02)MPa and (1078.29+/-36.25)MPa. There was no significant difference between the two groups (P>0.05). SEM and metallurgical examination showed the welded zone exhibiting more cracks in the casting wire group than in the commercially welding wire group. It would be advisable to work with commercially welding wire for the joints that need better strength.

  11. The Analysis of Adhesively Bonded Advanced Composite Joints Using Joint Finite Elements

    NASA Technical Reports Server (NTRS)

    Stapleton, Scott E.; Waas, Anthony M.

    2012-01-01

    The design and sizing of adhesively bonded joints has always been a major bottleneck in the design of composite vehicles. Dense finite element (FE) meshes are required to capture the full behavior of a joint numerically, but these dense meshes are impractical in vehicle-scale models where a course mesh is more desirable to make quick assessments and comparisons of different joint geometries. Analytical models are often helpful in sizing, but difficulties arise in coupling these models with full-vehicle FE models. Therefore, a joint FE was created which can be used within structural FE models to make quick assessments of bonded composite joints. The shape functions of the joint FE were found by solving the governing equations for a structural model for a joint. By analytically determining the shape functions of the joint FE, the complex joint behavior can be captured with very few elements. This joint FE was modified and used to consider adhesives with functionally graded material properties to reduce the peel stress concentrations located near adherend discontinuities. Several practical concerns impede the actual use of such adhesives. These include increased manufacturing complications, alterations to the grading due to adhesive flow during manufacturing, and whether changing the loading conditions significantly impact the effectiveness of the grading. An analytical study is conducted to address these three concerns. Furthermore, proof-of-concept testing is conducted to show the potential advantages of functionally graded adhesives. In this study, grading is achieved by strategically placing glass beads within the adhesive layer at different densities along the joint. Furthermore, the capability to model non-linear adhesive constitutive behavior with large rotations was developed, and progressive failure of the adhesive was modeled by re-meshing the joint as the adhesive fails. Results predicted using the joint FE was compared with experimental results for various

  12. Design/Analysis of the JWST ISIM Bonded Joints for Survivability at Cryogenic Temperatures

    NASA Technical Reports Server (NTRS)

    Bartoszyk, Andrew; Johnston, John; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz; Rodini,Benjamin; Young, Daniel

    1990-01-01

    A major design and analysis challenge for the JWST ISIM structure is thermal survivability of metal/composite bonded joints below the cryogenic temperature of 30K (-405 F). Current bonded joint concepts include internal invar plug fittings, external saddle titanium/invar fittings and composite gusset/clip joints all bonded to M55J/954-6 and T300/954-6 hybrid composite tubes (75mm square). Analytical experience and design work done on metal/composite bonded joints at temperatures below that of liquid nitrogen are limited and important analysis tools, material properties, and failure criteria for composites at cryogenic temperatures are sparse in the literature. Increasing this challenge is the difficulty in testing for these required tools and properties at cryogenic temperatures. To gain confidence in analyzing and designing the ISIM joints, a comprehensive joint development test program has been planned and is currently running. The test program is designed to produce required analytical tools and develop a composite failure criterion for bonded joint strengths at cryogenic temperatures. Finite element analysis is used to design simple test coupons that simulate anticipated stress states in the flight joints; subsequently the test results are used to correlate the analysis technique for the final design of the bonded joints. In this work, we present an overview of the analysis and test methodology, current results, and working joint designs based on developed techniques and properties.

  13. Automation Tools for Finite Element Analysis of Adhesively Bonded Joints

    NASA Technical Reports Server (NTRS)

    Tahmasebi, Farhad; Brodeur, Stephen J. (Technical Monitor)

    2002-01-01

    This article presents two new automation creation tools that obtain stresses and strains (Shear and peel) in adhesively bonded joints. For a given adhesively bonded joint Finite Element model, in which the adhesive is characterised using springs, these automation tools read the corresponding input and output files, use the spring forces and deformations to obtain the adhesive stresses and strains, sort the stresses and strains in descending order, and generate plot files for 3D visualisation of the stress and strain fields. Grids (nodes) and elements can be numbered in any order that is convenient for the user. Using the automation tools, trade-off studies, which are needed for design of adhesively bonded joints, can be performed very quickly.

  14. Design/analysis of the JWST ISIM bonded joints for survivability at cryogenic temperatures

    NASA Astrophysics Data System (ADS)

    Bartoszyk, Andrew; Johnston, John; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz; Rodini, Benjamin; Young, Daniel

    2005-08-01

    A major design and analysis challenge for the JWST ISIM structure is thermal survivability of metal/composite adhesively bonded joints at the cryogenic temperature of 30K (-405°F). Current bonded joint concepts include internal invar plug fittings, external saddle titanium/invar fittings and composite gusset/clip joints all bonded to hybrid composite tubes (75mm square) made with M55J/954-6 and T300/954-6 prepregs. Analytical experience and design work done on metal/composite bonded joints at temperatures below that of liquid nitrogen are limited and important analysis tools, material properties, and failure criteria for composites at cryogenic temperatures are sparse in the literature. Increasing this challenge is the difficulty in testing for these required tools and properties at cryogenic temperatures. To gain confidence in analyzing and designing the ISIM joints, a comprehensive joint development test program has been planned and is currently running. The test program is designed to produce required analytical tools and develop a composite failure criterion for bonded joint strengths at cryogenic temperatures. Finite element analysis is used to design simple test coupons that simulate anticipated stress states in the flight joints; subsequently, the test results are used to correlate the analysis technique for the final design of the bonded joints. In this work, we present an overview of the analysis and test methodology, current results, and working joint designs based on developed techniques and properties.

  15. Broken Pieces of Circlage Wire Lying in Soft Tissue Envelope Around Knee Joint: A Case Report and Review of Literature

    PubMed Central

    Kalia, Anoop; Khatri, Kavin; Singh, Jagdeep; Bansal, Kapil; Sagy, Mohammed

    2016-01-01

    Introduction: The migration of circlage wires used in tension band wiring construct of patella fractures in the posterior soft tissue envelope surrounding the knee joint has been rarely reported. Case Presentation: A 60-year-old woman presented to us with pain over medial aspect of right knee joint. She underwent open reduction and internal fixation for a patellar fracture which she sustained 4 years back and subsequently underwent kirschner wire(k wire) removal for the same around 2 years back. X-rays of the knee joint shows that the circlage wire used in tension band construct which was left in place had broken into multiple pieces and was lying in the soft tissue envelope surrounding the knee joint and one piece migrate to the popliteal fossa. On examination patient did not had distal neuro-vascular deficit. The pain of the patient was due to the osteo-arthritic changes in her medial side of knee joint rather than broken wire pieces. Patient was advised to undergo total knee replacement along with subsequent removal of broken wires but patient refused for any type of surgery and is kept on regular follow up Conclusion: This case report summarizes a rare complication resulting from hardware failure used for fixing patella fractures and throws a light on potential unwarned complications due to broken wires along with early recogonition and removal of broken hardware by surgeons. PMID:28116277

  16. Design/Analysis of the JWST ISIM Bonded Joints for Survivability at Cryogenic Temperatures

    NASA Technical Reports Server (NTRS)

    Bartoszyk, Andrew; Johnston, John; Kaprielian, Charles; Kuhn, Jonathan; Kunt, Cengiz; Rodini, Benjamin; Young, Daniel

    2005-01-01

    Contents include the following: JWST/ISIM introduction. Design and analysis challenges for ISIM bonded joints. JWST/ISIM joint designs. Bonded joint analysis. Finite element modeling. Failure criteria and margin calculation. Analysis/test correlation procedure. Example of test data and analysis.

  17. A comparative evaluation of the tensile strength of silver soldered joints of stainless steel and cobalt chromium orthodontic wires with band material--an in vitro study.

    PubMed

    Dua, R; Nandlal, B

    2004-03-01

    The present study was conducted to compare and evaluate the tensile strength of silver soldered joints of stainless steel and cobalt-chromium orthodontic wires with band material. An attempt was made to observe the effect of joint site preparation by incorporation of tack welding and increasing metal to metal surface contact area by flattening an end of the wire prior to soldering along with the regularly used round wires without tack welding. A total of 180 wire specimens were soldered to 180 band specimens. Fifteen samples according to joint site preparation were included for each of the wire groups i.e. Gloria (S.S.), Remanium (S.S.) and Remaloy (Co-Cr) wires of 0.036" in diameter. The findings of the study were suggestive that all three wires may be used for preparing silver soldered joints irrespective of the quality of the wire. However, when subjecting the wire to joint site preparation, Gloria (S.S.) wire showed less tensile strength as compared to Remanium and Remaloy.

  18. Viscoelastic study of an adhesively bonded joint

    NASA Technical Reports Server (NTRS)

    Joseph, P. F.

    1983-01-01

    The plane strain problem of two dissimilar orthotropic plates bonded with an isotropic, linearly viscoelastic adhesive is considered. Both the shear and the normal stresses in the adhesive are calculated for various geometries and loading conditions. Transverse shear deformations of the adherends are taken into account, and their effect on the solution is shown in the results. All three inplane strains of the adhesive are included. Attention is given to the effect of temperature, both in the adhesive joint problem and to the heat generation in a viscoelastic material under cyclic loading. This separate study is included because heat generation and or spatially varying temperature are at present too difficult to account for in the analytical solution of the bonded joint, but whose effect can not be ignored in design.

  19. Push-off tests and strength evaluation of joints combining shrink fitting with bonding

    NASA Astrophysics Data System (ADS)

    Yoneno, Masahiro; Sawa, Toshiyuki; Shimotakahara, Ken; Motegi, Yoichi

    1997-03-01

    Shrink fitted joints have been used in mechanical structures. Recently, joints combining shrink fitting with anaerobic adhesives bonded between the shrink fitted surfaces have been appeared in order to increase the joint strength. In this paper, push-off test was carried out on strength of joints combining shrink fitting with bonding by material testing machine. In addition, the push-off strength of shrink fitting joints without an anaerobic adhesive was also measured. In the experiments, the effects of the shrinking allowance and the outer diameter of the rings on the joint strength are examined. The interface stress distribution in bonded shrink fitted joints subjected to a push-off load is analyzed using axisymmetrical theory of elasticity as a four-body contact problem. Using the interface stress distribution, a method for estimating joint strength is proposed. The experimental results are in a fairly good agreement with the numerical results. It is found that the strength of combination joints is greater than that of shrink fitted joints.

  20. Experimental investigation of reinforced bonded joints for composite laminates.

    PubMed

    Bisagni, Chiara; Furfari, Domenico; Pacchione, Marco

    2018-02-01

    An experimental study has been carried out to investigate the behaviour of co-bonded carbon fibre reinforced plastics joints with a novel design incorporating a through the thickness local reinforcement. Different specimens were manufactured to investigate static and fatigue behaviour, as well as delamination size after impact and damage tolerance characteristics. The mechanical performances of the specimens with local reinforcement, consisting of the insertion of spiked thin metal sheets between co-bonded laminates, were compared with those ones obtained from specimens with purely co-bonded joints. This novel design demonstrated by tests that damage progression under cycling load results significantly delayed by the reinforcements. A significant number of experimental results were obtained that can be used to define preliminary design guidelines.

  1. Experimental investigation of reinforced bonded joints for composite laminates

    PubMed Central

    Bisagni, Chiara; Furfari, Domenico; Pacchione, Marco

    2017-01-01

    An experimental study has been carried out to investigate the behaviour of co-bonded carbon fibre reinforced plastics joints with a novel design incorporating a through the thickness local reinforcement. Different specimens were manufactured to investigate static and fatigue behaviour, as well as delamination size after impact and damage tolerance characteristics. The mechanical performances of the specimens with local reinforcement, consisting of the insertion of spiked thin metal sheets between co-bonded laminates, were compared with those ones obtained from specimens with purely co-bonded joints. This novel design demonstrated by tests that damage progression under cycling load results significantly delayed by the reinforcements. A significant number of experimental results were obtained that can be used to define preliminary design guidelines. PMID:29568127

  2. Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials.

    PubMed

    Jongsma, Marije A; Pelser, Floris D H; van der Mei, Henny C; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J; Ren, Yijin

    2013-05-01

    Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on different wires used for bonded retainers and the susceptibility of in vitro biofilms to oral antimicrobials. Orthodontic wires were exposed to saliva, and in vitro biofilm formation was evaluated using plate counting and live/dead staining, together with effects of exposure to toothpaste slurry alone or followed by antimicrobial mouthrinse application. Wires were also placed intra-orally for 72 h in human volunteers and undisturbed biofilm formation was compared by plate counting and live/dead staining, as well as by denaturing gradient gel electrophoresis for compositional differences in biofilms. Single-strand wires attracted only slightly less biofilm in vitro than multi-strand wires. Biofilms on stainless steel single-strand wires however, were much more susceptible to antimicrobials from toothpaste slurries and mouthrinses than on single-strand gold wires and biofilms on multi-strand wires. Also, in vivo significantly less biofilm was found on single-strand than on multi-strand wires. Microbial composition of biofilms was more dependent on the volunteer involved than on wire type. Biofilms on single-strand stainless steel wires attract less biofilm in vitro and are more susceptible to antimicrobials than on multi-strand wires. Also in vivo, single-strand wires attract less biofilm than multi-strand ones. Use of single-strand wires is preferred over multi-strand wires, not because they attract less biofilm, but because biofilms on single-strand wires are not protected against antimicrobials as in crevices and niches as on multi-strand wires.

  3. Viscoelastic analysis of adhesively bonded joints

    NASA Technical Reports Server (NTRS)

    Delale, F.; Erdogan, F.

    1980-01-01

    An adhesively bonded lap joint is analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. After formulating the general problem a specific example for two identical adherends bonded through a three parameter viscoelastic solid adhesive is considered. The standard Laplace transform technique is used to solve the problem. The stress distribution in the adhesive layer is calculated for three different external loads, namely, membrane loading, bending, and transverse shear loading. The results indicate that the peak value of the normal stress in the adhesive is not only consistently higher than the corresponding shear stress but also decays slower.

  4. Laser Indirect Shock Welding of Fine Wire to Metal Sheet

    PubMed Central

    Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

    2017-01-01

    The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent. PMID:28895900

  5. Laser Indirect Shock Welding of Fine Wire to Metal Sheet.

    PubMed

    Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

    2017-09-12

    The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent.

  6. Nonlinear Analysis of Bonded Composite Tubular Lap Joints

    NASA Technical Reports Server (NTRS)

    Oterkus, E.; Madenci, E.; Smeltzer, S. S., III; Ambur, D. R.

    2005-01-01

    The present study describes a semi-analytical solution method for predicting the geometrically nonlinear response of a bonded composite tubular single-lap joint subjected to general loading conditions. The transverse shear and normal stresses in the adhesive as well as membrane stress resultants and bending moments in the adherends are determined using this method. The method utilizes the principle of virtual work in conjunction with nonlinear thin-shell theory to model the adherends and a cylindrical shear lag model to represent the kinematics of the thin adhesive layer between the adherends. The kinematic boundary conditions are imposed by employing the Lagrange multiplier method. In the solution procedure, the displacement components for the tubular joint are approximated in terms of non-periodic and periodic B-Spline functions in the longitudinal and circumferential directions, respectively. The approach presented herein represents a rapid-solution alternative to the finite element method. The solution method was validated by comparison against a previously considered tubular single-lap joint. The steep variation of both peeling and shearing stresses near the adhesive edges was successfully captured. The applicability of the present method was also demonstrated by considering tubular bonded lap-joints subjected to pure bending and torsion.

  7. A Novel Multiscale Design of Interfaces for Polymeric Composites and Bonded Joints using Additive Manufacturing

    DTIC Science & Technology

    2016-09-13

    AFRL-AFOSR-VA-TR-2016-0317 A Novel Multiscale Design of Interfaces for Polymeric Composites and Bonded Joints using Additive Manufacturing Pavana...Composites and Bonded Joints using Additive Manufacturing AWARD NO.: FA9550-15-1-0216 AGENCY NAME: The Air Force Office of Scientific Research (AFOSR), Ar...20 3 Additive Manufacturing for Bonded Composite Joints 21 3.1 Introduction

  8. Viscoelastic analysis of adhesively bonded joints

    NASA Technical Reports Server (NTRS)

    Delale, F.; Erdogan, F.

    1981-01-01

    In this paper an adhesively bonded lap joint is analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. After formulating the general problem a specific example for two identical adherends bonded through a three parameter viscoelastic solid adhesive is considered. The standard Laplace transform technique is used to solve the problem. The stress distribution in the adhesive layer is calculated for three different external loads namely, membrane loading, bending, and transverse shear loading. The results indicate that the peak value of the normal stress in the adhesive is not only consistently higher than the corresponding shear stress but also decays slower.

  9. Non-classical adhesive-bonded joints in practical aerospace construction

    NASA Technical Reports Server (NTRS)

    Hart-Smith, L. J.

    1973-01-01

    Solutions are derived for adhesive-bonded joints of non-classical geometries. Particular attention is given to bonded doublers and to selective reinforcement by unidirectional composites. Non-dimensionalized charts are presented for the efficiency limit imposed on the skin as the result of the eccentricity in the load path through the doubler. It is desirable to employ a relativly large doubler to minimize the effective eccentricity in the load path. The transfer stresses associated with selective reinforcement of metal structures by advanced composites are analyzed. Reinforcement of bolt holes in composites by bonded metal doublers is covered quantitatively. Also included is the adhesive joint analysis for shear flow in a multi-cell torque box, in which the bond on one angle becomes more critical sooner than those on the others, thereby restricting the strength to less than the total of each maximum strength when acting alone. Adhesive plasticity and adherend stiffness and thermal imbalances are included. A simple analysis/design technique of solution in terms of upper and lower bounds on an all-plastic adhesive analysis is introduced.

  10. Prediction of fracture toughness and durability of adhesively bonded composite joints with undesirable bonding conditions

    NASA Astrophysics Data System (ADS)

    Musaramthota, Vishal

    Advanced composite materials have enabled the conventional aircraft structures to reduce weight, improve fuel efficiency and offer superior mechanical properties. In the past, materials such as aluminum, steel or titanium have been used to manufacture aircraft structures for support of heavy loads. Within the last decade or so, demand for advanced composite materials have been emerging that offer significant advantages over the traditional metallic materials. Of particular interest in the recent years, there has been an upsurge in scientific significance in the usage of adhesively bonded composite joints (ABCJ's). ABCJ's negate the introduction of stress risers that are associated with riveting or other classical techniques. In today's aircraft transportation market, there is a push to increase structural efficiency by promoting adhesive bonding to primary joining of aircraft structures. This research is focused on the issues associated with the durability and related failures in bonded composite joints that continue to be a critical hindrance to the universal acceptance of ABCJ's. Of particular interest are the short term strength, contamination and long term durability of ABCJ's. One of the factors that influence bond performance is contamination and in this study the influence of contamination on composite-adhesive bond quality was investigated through the development of a repeatable and scalable surface contamination procedure. Results showed an increase in the contaminant coverage area decreases the overall bond strength significantly. A direct correlation between the contaminant coverage area and the fracture toughness of the bonded joint was established. Another factor that influences bond performance during an aircraft's service life is its long term strength upon exposure to harsh environmental conditions or when subjected to severe mechanical loading. A test procedure was successfully developed in order to evaluate durability of ABCJ's comprising severe

  11. Comparative evaluation of microleakage of lingual retainer wires bonded with three different lingual retainer composites: an in vitro study.

    PubMed

    Nimbalkar-Patil, Smita; Vaz, Anna; Patil, Pravinkumar G

    2014-11-01

    To evaluate microleakage when two types of retainer wires were bonded with two light cured and a self cured lingual retainer composites. Total 120 freshly extracted human mandibular incisor teeth were collected and separated into six subgroups of 20 teeth each. Two different wires, a 0.036 inch hard round stainless steel (HRSS) wire sandblasted at the ends and 0.0175 inch multistranded wire bonded onto the lingual surfaces of the incisors with three different types of composite resins of 3M company; Concise Orthodontic (self-cure), Transbond XT (light-cure) and Transbond LR (light-cure). Specimens were further sealed with a nail varnish, stained with 0.5% basic fuchsine for 24 hours, sectioned and examined under a stereomicroscope, and scored for microleakage for the enamel-composite and wire-composite interfaces. Statistical analysis was performed by Kruskal-Wallis and Mann-Whitney U-tests. For HRSS wire, at the enamel-composite interface, the microleakage was least with Transbond LR followed by Concise Orthodontic and greatest for Transbond XT (p<0.05). At the wire composite interface too, the microleakage was in order of Transbond LRwire, at the enamel-composite interface, the microleakage was least with Transbond LR followed by Concise Orthodontic and Transbond XT (p<0.05). At the wire composite interface too, it was seen that microleakage was the least with Transbond LR followed by Concise Orthodontic and Transbond XT. Transbond LR in combination with 0.0175 inch multistranded wire showed least microleakage amongst the groups studied.

  12. Analysis of Bonded Joints Between the Facesheet and Flange of Corrugated Composite Panels

    NASA Technical Reports Server (NTRS)

    Yarrington, Phillip W.; Collier, Craig S.; Bednarcyk, Brett A.

    2008-01-01

    This paper outlines a method for the stress analysis of bonded composite corrugated panel facesheet to flange joints. The method relies on the existing HyperSizer Joints software, which analyzes the bonded joint, along with a beam analogy model that provides the necessary boundary loading conditions to the joint analysis. The method is capable of predicting the full multiaxial stress and strain fields within the flange to facesheet joint and thus can determine ply-level margins and evaluate delamination. Results comparing the method to NASTRAN finite element model stress fields are provided illustrating the accuracy of the method.

  13. Global-Local Finite Element Analysis for Thermo-Mechanical Stresses in Bonded Joints

    NASA Technical Reports Server (NTRS)

    Shkarayev, S.; Madenci, Erdogan; Camarda, C. J.

    1997-01-01

    An analysis of adhesively bonded joints using conventional finite elements does not capture the singular behavior of the stress field in regions where two or three dissimilar materials form a junction with or without free edges. However, these regions are characteristic of the bonded joints and are prone to failure initiation. This study presents a method to capture the singular stress field arising from the geometric and material discontinuities in bonded composites. It is achieved by coupling the local (conventional) elements with global (special) elements whose interpolation functions are constructed from the asymptotic solution.

  14. Effect of confining pressure due to external jacket of steel plate or shape memory alloy wire on bond behavior between concrete and steel reinforcing bars.

    PubMed

    Choi, Eunsoo; Kim, Dongkyun; Park, Kyoungsoo

    2014-12-01

    For external jackets of reinforced concrete columns, shape memory alloy (SMA) wires are easy to install, and they provide active and passive confining pressure; steel plates, on the other hand, only provide passive confining pressure, and their installation on concrete is not convenient because of the requirement of a special device. To investigate how SMA wires distinctly impact bond behavior compared with steel plates, this study conducted push-out bond tests of steel reinforcing bars embedded in concrete confined by SMA wires or steel plates. For this purpose, concrete cylinders were prepared with dimensions of 100 mm x 200 mm, and D-22 reinforcing bars were embedded at the center of the concrete cylinders. External jackets of 1.0 mm and 1.5 mm thickness steel plates were used to wrap the concrete cylinders. Additionally, NiTiNb SMA wire with a diameter of 1.0 mm was wound around the concrete cylinders. Slip of the reinforcing bars due to pushing force was measured by using a displacement transducer, while the circumferential deformation of specimens was obtained by using an extensometer. The circumferential deformation was used to calculate the circumferential strains of the specimens. This study assessed the radial confining pressure due to the external jackets on the reinforcing bars at bond strength from bond stress-slip curves and bond stress-circumferential strain curves. Then, the effects of the radial confining pressure on the bond behavior of concrete are investigated, and an equation is suggested to estimate bond strength using the radial confining pressure. Finally, this study focused on how active confining pressure due to recovery stress of the SMA wires influences bond behavior.

  15. Screening Adhesively Bonded Single-Lap-Joint Testing Results Using Nonlinear Calculation Parameters

    DTIC Science & Technology

    2012-03-01

    versus displacement response for single-lap-joints bonded with damage-tolerant adhe- sives, such the polyurea adhesive plotted in Figure 2, is much...displacement response for a single-lap-joint bonded with a polyurea adhesive. Complex x-y plots are commonly fitted using the Levenberg-Marquardt...expected decrease in maximum strength for the polyurea in compar- ison to the epoxy, which could have been obtained using a traditional analysis approach

  16. Modeling Progressive Failure of Bonded Joints Using a Single Joint Finite Element

    NASA Technical Reports Server (NTRS)

    Stapleton, Scott E.; Waas, Anthony M.; Bednarcyk, Brett A.

    2010-01-01

    Enhanced finite elements are elements with an embedded analytical solution which can capture detailed local fields, enabling more efficient, mesh-independent finite element analysis. In the present study, an enhanced finite element is applied to generate a general framework capable of modeling an array of joint types. The joint field equations are derived using the principle of minimum potential energy, and the resulting solutions for the displacement fields are used to generate shape functions and a stiffness matrix for a single joint finite element. This single finite element thus captures the detailed stress and strain fields within the bonded joint, but it can function within a broader structural finite element model. The costs associated with a fine mesh of the joint can thus be avoided while still obtaining a detailed solution for the joint. Additionally, the capability to model non-linear adhesive constitutive behavior has been included within the method, and progressive failure of the adhesive can be modeled by using a strain-based failure criteria and re-sizing the joint as the adhesive fails. Results of the model compare favorably with experimental and finite element results.

  17. Ultrasonic guided wave monitoring of composite wing skin-to-spar bonded joints in aerospace structures

    NASA Astrophysics Data System (ADS)

    Matt, Howard; Bartoli, Ivan; Lanza di Scalea, Francesco

    2005-10-01

    The monitoring of adhesively bonded joints by ultrasonic guided waves is the general topic of this paper. Specifically, composite-to-composite joints representative of the wing skin-to-spar bonds of unmanned aerial vehicles (UAVs) are examined. This research is the first step towards the development of an on-board structural health monitoring system for UAV wings based on integrated ultrasonic sensors. The study investigates two different lay-ups for the wing skin and two different types of bond defects, namely poorly cured adhesive and disbonded interfaces. The assessment of bond state is based on monitoring the strength of transmission through the joints of selected guided modes. The wave propagation problem is studied numerically by a semi-analytical finite element method that accounts for viscoelastic damping, and experimentally by ultrasonic testing that uses small PZT disks preferably exciting and detecting the single-plate s0 mode. Both the models and the experiments confirm that the ultrasonic energy transmission through the joint is highly dependent on the bond conditions, with defected bonds resulting in increased transmission strength. Large sensitivity to the bond conditions is found at mode coupling points, as a result of the large interlayer energy transfer.

  18. Nonlinear analysis of bonded joints with thermal effects

    NASA Technical Reports Server (NTRS)

    Humphreys, E. A.; Herakovich, C. T.

    1977-01-01

    Nonlinear results are presented for adhesive bonded joints. It is shown that adhesive nonlinearities are only significant in the predicted adhesive shear stresses. Adherend nonlinearities and temperature dependent properties are shown to have little effect upon the adhesive stress predictions under mechanical and thermal loadings.

  19. Adhesive-bonded double-lap joints. [analytical solutions for static load carrying capacity

    NASA Technical Reports Server (NTRS)

    Hart-Smith, L. J.

    1973-01-01

    Explicit analytical solutions are derived for the static load carrying capacity of double-lap adhesive-bonded joints. The analyses extend the elastic solution Volkersen and cover adhesive plasticity, adherend stiffness imbalance and thermal mismatch between the adherends. Both elastic-plastic and bi-elastic adhesive representations lead to the explicit result that the influence of the adhesive on the maximum potential bond strength is defined uniquely by the strain energy in shear per unit area of bond. Failures induced by peel stresses at the ends of the joint are examined. This failure mode is particularly important for composite adherends. The explicit solutions are sufficiently simple to be used for design purposes

  20. Time-temperature effect in adhesively bonded joints

    NASA Technical Reports Server (NTRS)

    Delale, F.; Erdogan, F.

    1981-01-01

    The viscoelastic analysis of an adhesively bonded lap joint was reconsidered. The adherends are approximated by essentially Reissner plates and the adhesive is linearly viscoelastic. The hereditary integrals are used to model the adhesive. A linear integral differential equations system for the shear and the tensile stress in the adhesive is applied. The equations have constant coefficients and are solved by using Laplace transforms. It is shown that if the temperature variation in time can be approximated by a piecewise constant function, then the method of Laplace transforms can be used to solve the problem. A numerical example is given for a single lap joint under various loading conditions.

  1. Corrosion resistance of a laser spot-welded joint of NiTi wire in simulated human body fluids.

    PubMed

    Yan, Xiao-Jun; Yang, Da-Zhi

    2006-04-01

    The purpose of this study was to investigate corrosion resistance of a laser spot-welded joint of NiTi alloy wires using potentiodynamic tests in Hank's solution at different PH values and the PH 7.4 NaCl solution for different Cl- concentrations. Scanning electron microscope observations were carried out before and after potentiodynamic tests. The composition of a laser spot-welded joint and base metal were characterized by using an electron probe microanalyzer. The results of potentiodynamic tests showed that corrosion resistance of a laser spot-welded joint of NiTi alloy wire was better than that of base metal, which exhibited a little higher breakdown potential and passive range, and a little lower passive current density. Corrosion resistances of a laser spot-welded joint and base metal decreased with increasing of the Cl- concentration and PH value. The improvement of corrosion resistance of the laser spot-welded joint was due to the decrease of the surface defects and the increase of the Ti/Ni ratio. (c) 2005 Wiley Periodicals, Inc.

  2. Analysis of bonded joints. [shear stress and stress-strain diagrams

    NASA Technical Reports Server (NTRS)

    Srinivas, S.

    1975-01-01

    A refined elastic analysis of bonded joints which accounts for transverse shear deformation and transverse normal stress was developed to obtain the stresses and displacements in the adherends and in the bond. The displacements were expanded in terms of polynomials in the thicknesswise coordinate; the coefficients of these polynomials were functions of the axial coordinate. The stress distribution was obtained in terms of these coefficients by using strain-displacement and stress-strain relations. The governing differential equations were obtained by integrating the equations of equilibrium, and were solved. The boundary conditions (interface or support) were satisfied to complete the analysis. Single-lap, flush, and double-lap joints were analyzed, along with the effects of adhesive properties, plate thicknesses, material properties, and plate taper on maximum peel and shear stresses in the bond. The results obtained by using the thin-beam analysis available in the literature were compared with the results obtained by using the refined analysis. In general, thin-beam analysis yielded reasonably accurate results, but in certain cases the errors were high. Numerical investigations showed that the maximum peel and shear stresses in the bond can be reduced by (1) using a combination of flexible and stiff bonds, (2) using stiffer lap plates, and (3) tapering the plates.

  3. Characterization of Nitinol Laser-Weld Joints by Nondestructive Testing

    NASA Astrophysics Data System (ADS)

    Wohlschlögel, Markus; Gläßel, Gunter; Sanchez, Daniela; Schüßler, Andreas; Dillenz, Alexander; Saal, David; Mayr, Peter

    2015-12-01

    Joining technology is an integral part of today's Nitinol medical device manufacturing. Besides crimping and riveting, laser welding is often applied to join components made from Nitinol to Nitinol, as well as Nitinol components to dissimilar materials. Other Nitinol joining techniques include adhesive bonding, soldering, and brazing. Typically, the performance of joints is assessed by destructive mechanical testing, on a process validation base. In this study, a nondestructive testing method—photothermal radiometry—is applied to characterize small Nitinol laser-weld joints used to connect two wire ends via a sleeve. Two different wire diameters are investigated. Effective joint connection cross sections are visualized using metallography techniques. Results of the nondestructive testing are correlated to data from destructive torsion testing, where the maximum torque at fracture is evaluated for the same joints and criteria for the differentiation of good and poor laser-welding quality by nondestructive testing are established.

  4. Microstructure and Properties of Lap Joint Between Aluminum Alloy and Galvanized Steel by CMT

    NASA Astrophysics Data System (ADS)

    Niu, Song; Chen, Su; Dong, Honggang; Zhao, Dongsheng; Zhang, Xiaosheng; Guo, Xin; Wang, Guoqiang

    2016-05-01

    Lap joining of 1-mm-thick Novelist AC 170 PX aluminum alloy to 1.2-mm-thick ST06 Z galvanized steel sheets for automotive applications was conducted by cold metal transfer advanced welding process with ER4043 and ER4047 filler wires. Under the optimized welding parameters with ER4043 filler wire, the tensile shear strength of joint was 189 MPa, reaching 89% of the aluminum alloy base metal. Microstructure and elemental distribution were characterized by optical metalloscope and electron probe microanalysis. The lap joints with ER4043 filler wire had smaller wetting angle and longer bonded line length with better wettability than with ER4047 filler wire during welding with same parameters. The needle-like Al-Fe-Si intermetallic compounds (IMCs) were spalled into the weld and brought negative effect to the tensile strength of joints. With increasing welding current, the needle-like IMCs grew longer and spread further into the weld, which would deteriorate the tensile shear strength.

  5. Fatigue life prediction of bonded primary joints

    NASA Technical Reports Server (NTRS)

    Knauss, J. F.

    1979-01-01

    The validation of a proposed fatigue life prediction methodology was sought through the use of aluminum butt and scarf joint and graphite/epoxy butt joint specimens in a constant amplitude fatigue environment. The structural properties of the HYSOL 9313 adhesive system were obtained by mechanical test of molded heat adhesive specimens. Aluminum contoured double cantilever beam specimens were used to generate crack velocity versus stress intensity factor data. The specific objectives were: (1) to ascertain the feasibility of predicting fatigue failure of an adhesive in a primary bonded composite structure by incorporating linear elastic crack growth behavior; and (2) to ascertain if acoustic emission and/or compliance measurement techniques can be used to detect flaws.

  6. Correlating PMC-MMC Bonded Joint 3D FEA with Test

    NASA Technical Reports Server (NTRS)

    Jacobson, Mindy; Rodini, Benjamin; Chen, Wayne C.; Flom, Yury A.; Posey, Alan J.

    2005-01-01

    A viewgraph presentation on the correlation of Polymer Matrix Composites (PMC) and Metal Matrix Composites (MMC) bonded joints using three dimensional finite element analyses with materials tests is shown.

  7. Development of a persistent superconducting joint between Bi-2212/Ag-alloy multifilamentary round wires

    NASA Astrophysics Data System (ADS)

    Chen, Peng; Trociewitz, Ulf P.; Davis, Daniel S.; Bosque, Ernesto S.; Hilton, David K.; Kim, Youngjae; Abraimov, Dmytro V.; Starch, William L.; Jiang, Jianyi; Hellstrom, Eric E.; Larbalestier, David C.

    2017-02-01

    Superconducting joints are one of the key components needed to make Ag-alloy clad Bi2Sr2CaCu2O8+x (Bi-2212) superconducting round wire (RW) successful for high-field, high-homogeneity magnet applications, especially for nuclear magnetic resonance magnets in which persistent current mode operation is highly desired. In this study, a procedure for fabricating superconducting joints between Bi-2212 RWs during coil reaction was developed. Melting temperatures of Bi-2212 powder with different amounts of Ag addition were investigated by differential thermal analysis so as to provide information for selecting the proper joint matrix. Test joints of 1.3 mm dia. wires heat treated in 1 bar flowing oxygen using the typical partial melt Bi-2212 heat treatment (HT) had transport critical currents I c of ˜900 A at 4.2 K and self-field, decreasing to ˜480 A at 14 T evaluated at 0.1 μV cm-1 at 4.2 K. Compared to the I c of the open-ended short conductor samples with identical 1 bar HT, the I c values of the superconducting joint are ˜20% smaller than that of conductor samples measured in parallel field but ˜20% larger than conductor samples measured in perpendicular field. Microstructures examined by scanning electron microscopy clearly showed the formation of a superconducting Bi-2212 interface between the two Bi-2212 RWs. Furthermore, a Bi-2212 RW closed-loop solenoid with a superconducting joint heat treated in 1 bar flowing oxygen showed an estimated joint resistance below 5 × 10-12 Ω based on its field decay rate. This value is sufficiently low to demonstrate the potential for persistent operation of large inductance Bi-2212 coils.

  8. Test and analysis of Celion 3000/PMR-15, graphite/polyimide bonded composite joints: Data report

    NASA Technical Reports Server (NTRS)

    Cushman, J. B.; Mccleskey, S. F.; Ward, S. H.

    1982-01-01

    Standard single lap, double lap and symmetric step lap bonded joints of Celion 3000/PMR-15 graphite/polyimide composite were evaluated. Composite to composite and composite to titanium joints were tested at 116 K (-250 F), 294 K (70 F) and 561 K (550 F). Joint parameters evaluated are lap length, adherend thickness, adherend axial stiffness, lamina stacking sequence and adherend tapering. Advanced joint concepts were examined to establish the change in performance of preformed adherends, scalloped adherends and hybrid systems. The material properties of the high temperature adhesive, designated A7F, used for bonding were established. The bonded joint tests resulted in interlaminar shear or peel failures of the composite and there were very few adhesive failures. Average test results agree with expected performance trends for the various test parameters. Results of finite element analyses and of test/analysis correlations are also presented.

  9. Bond between smooth prestressing wires and concrete : finite element model and transfer length analysis for pretensioned concrete crossties.

    DOT National Transportation Integrated Search

    2014-04-03

    Pretensioned concrete ties are increasingly employed in railroad high speed : and heavy haul applications. The bond between prestressing wires or strands and : concrete plays an important role in determining the transfer length of pretensioned : conc...

  10. Disassembly Properties of Cementitious Finish Joints Using an Induction Heating Method

    PubMed Central

    Ahn, Jaecheol; Noguchi, Takafumi; Kitagaki, Ryoma

    2015-01-01

    Efficient maintenance and upgrading of a building during its lifecycle are difficult because a cementitious finish uses materials and parts with low disassembly properties. Additionally, the reuse and recycling processes during building demolition also present numerous problems from the perspective of environmental technology. In this study, an induction heating (IH) method was used to disassemble cementitious finish joints, which are widely used to join building members and materials. The IH rapidly and selectively heated and weakened these joints. The temperature elevation characteristics of the cementitious joint materials were measured as a function of several resistor types, including wire meshes and punching metals, which are usually used for cementitious finishing. The disassembly properties were evaluated through various tests using conductive resistors in cementitious joints such as mortar. When steel fiber, punching metal, and wire mesh were used as conductive resistors, the cementitious modifiers could be weakened within 30 s. Cementitious joints with conductive resistors also showed complete disassembly with little residual bond strength.

  11. Aging Aircraft 2005, The Joint NASA/FAA/DOD Conference on Aging Aircraft, Decision algorithms for Electrical Wiring Interconnect Systems (EWIS)Fault Detection

    DTIC Science & Technology

    2005-02-03

    Aging Aircraft 2005 The 8th Joint NASA /FAA/DOD Conference on Aging Aircraft Decision Algorithms for Electrical Wiring Interconnect Systems (EWIS...SUBTITLE Aging Aircraft 2005, The 8th Joint NASA /FAA/DOD Conference on Aging Aircraft, Decision algorithms for Electrical Wiring Interconnect...UNIT NUMBER 7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES) NASA Langley Research Center, 8W. Taylor St., M/S 190 Hampton, VA 23681 and NAVAIR

  12. Bond strength evaluation in adhesive joints using NDE and DIC methods

    NASA Astrophysics Data System (ADS)

    Poudel, Anish

    Adhesive bonding of graphite epoxy composite laminates to itself or traditional metal alloys in modern aerospace and aircraft structural applications offers an excellent opportunity to use the most efficient and intelligent combination of materials available thus providing an attractive package for efficient structural designs. However, one of the major issues of adhesive bonding is the occasional formation of interfacial defects such as kissing or weak bonds in the bondline interface. Also, there are shortcomings of existing non-destructive evaluation (NDE) methods to non-destructively detect/characterize these interfacial defects and reliably predicting the bond shear strength. As a result, adhesive bonding technology is still not solely implemented in primary structures of an aircraft. Therefore, there is a greater demand for a novel NDE tool that can meet the existing aerospace requirement for adhesive bondline characterization. This research implemented a novel Acoustography ultrasonic imaging and digital image correlation (DIC) technique to detect and characterize interfacial defects in the bondline and determine bond shear strength in adhesively bonded composite-metal joints. Adhesively bonded Carbon Fiber Reinforced Plastic (CFRP) laminate and 2024-T3 Aluminum single lap shear panels subjected to various implanted kissing/weak bond defects were the primary focus of this study. Kissing/weak bonds were prepared by controlled surface contamination in the composite bonding surface and also by improperly mixing the adhesive constituent. SEM analyses were also conducted to understand the surface morphology of substrates and their interaction with the contaminants. Morphological changes were observed in the microscopic scale and the chemical analysis confirmed the stability of the contaminant at or very close to the interface. In addition, it was also demonstrated that contaminants migrated during the curing of the adhesive from CFRP substrate which caused a

  13. A Single-Lap Joint Adhesive Bonding Optimization Method Using Gradient and Genetic Algorithms

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III; Finckenor, Jeffrey L.

    1999-01-01

    A natural process for any engineer, scientist, educator, etc. is to seek the most efficient method for accomplishing a given task. In the case of structural design, an area that has a significant impact on the structural efficiency is joint design. Unless the structure is machined from a solid block of material, the individual components which compose the overall structure must be joined together. The method for joining a structure varies depending on the applied loads, material, assembly and disassembly requirements, service life, environment, etc. Using both metallic and fiber reinforced plastic materials limits the user to two methods or a combination of these methods for joining the components into one structure. The first is mechanical fastening and the second is adhesive bonding. Mechanical fastening is by far the most popular joining technique; however, in terms of structural efficiency, adhesive bonding provides a superior joint since the load is distributed uniformly across the joint. The purpose of this paper is to develop a method for optimizing single-lap joint adhesive bonded structures using both gradient and genetic algorithms and comparing the solution process for each method. The goal of the single-lap joint optimization is to find the most efficient structure that meets the imposed requirements while still remaining as lightweight, economical, and reliable as possible. For the single-lap joint, an optimum joint is determined by minimizing the weight of the overall joint based on constraints from adhesive strengths as well as empirically derived rules. The analytical solution of the sin-le-lap joint is determined using the classical Goland-Reissner technique for case 2 type adhesive joints. Joint weight minimization is achieved using a commercially available routine, Design Optimization Tool (DOT), for the gradient solution while an author developed method is used for the genetic algorithm solution. Results illustrate the critical design variables

  14. Microstructure and mechanical properties of diffusion bonded W/steel joint using V/Ni composite interlayer

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Liu, W.S.; Cai, Q.S., E-mail: cai2009pm@163.com; Ma, Y.Z.

    2013-12-15

    Diffusion bonding between W and steel using V/Ni composite interlayer was carried out in vacuum at 1050 °C and 10 MPa for 1 h. The microstructural examination and mechanical property evaluation of the joints show that the bonding of W to steel was successful. No intermetallic compound was observed at the steel/Ni and V/W interfaces for the joints bonded. The electron probe microanalysis and X-ray diffraction analysis revealed that Ni{sub 3}V, Ni{sub 2}V, Ni{sub 2}V{sub 3} and NiV{sub 3} were formed at the Ni/V interface. The tensile strength of about 362 MPa was obtained for as-bonded W/steel joint and themore » failure occurred at W near the V/W interface. The nano-indentation test across the joining interfaces demonstrated the effect of solid solution strengthening and intermetallic compound formation in the diffusion zone. - Highlights: • Diffusion bonding of W to steel was realized using V/Ni composite interlayer. • The interfacial microstructure of the joint was clarified. • Several V–Ni intermetallic compounds were formed in the interface region. • The application of V/Ni composite interlayer improved the joining quality.« less

  15. Making Superconducting Welds between Superconducting Wires

    NASA Technical Reports Server (NTRS)

    Penanen, Konstantin I.; Eom, Byeong Ho

    2008-01-01

    A technique for making superconducting joints between wires made of dissimilar superconducting metals has been devised. The technique is especially suitable for fabrication of superconducting circuits needed to support persistent electric currents in electromagnets in diverse cryogenic applications. Examples of such electromagnets include those in nuclear magnetic resonance (NMR) and magnetic resonance imaging (MRI) systems and in superconducting quantum interference devices (SQUIDs). Sometimes, it is desirable to fabricate different parts of a persistent-current-supporting superconducting loop from different metals. For example, a sensory coil in a SQUID might be made of Pb, a Pb/Sn alloy, or a Cu wire plated with Pb/Sn, while the connections to the sensory coil might be made via Nb or Nb/Ti wires. Conventional wire-bonding techniques, including resistance spot welding and pressed contact, are not workable because of large differences between the hardnesses and melting temperatures of the different metals. The present technique is not subject to this limitation. The present technique involves the use (1) of a cheap, miniature, easy-to-operate, capacitor-discharging welding apparatus that has an Nb or Nb/Ti tip and operates with a continuous local flow of gaseous helium and (2) preparation of a joint in a special spark-discharge welding geometry. In a typical application, a piece of Nb foil about 25 m thick is rolled to form a tube, into which is inserted a wire that one seeks to weld to the tube (see figure). The tube can be slightly crimped for mechanical stability. Then a spark weld is made by use of the aforementioned apparatus with energy and time settings chosen to melt a small section of the niobium foil. The energy setting corresponds to the setting of a voltage to which the capacitor is charged. In an experiment, the technique was used to weld an Nb foil to a copper wire coated with a Pb/Sn soft solder, which is superconducting. The joint was evaluated as

  16. Size effects in tin-based lead-free solder joints: Kinetics of bond formation and mechanical characteristics

    NASA Astrophysics Data System (ADS)

    Abdelhadi, Ousama Mohamed Omer

    Continuous miniaturization of microelectronic interconnects demands smaller joints with comparable microstructural and structural sizes. As the size of joints become smaller, the volume of intermetallics (IMCs) becomes comparable with the joint size. As a result, the kinetics of bond formation changes and the types and thicknesses of IMC phases that form within the constrained region of the bond varies. This dissertation focuses on investigating combination effects of process parameters and size on kinetics of bond formation, resulting microstructure and the mechanical properties of joints that are formed under structurally constrained conditions. An experiment is designed where several process parameters such as time of bonding, temperature, and pressure, and bond thickness as structural chracteristic, are varied at multiple levels. The experiment is then implemented on the process. Scanning electron microscope (SEM) is then utilized to determine the bond thickness, IMC phases and their thicknesses, and morphology of the bonds. Electron backscatter diffraction (EBSD) is used to determine the grain size in different regions, including the bulk solder, and different IMC phases. Physics-based analytical models have been developed for growth kinetics of IMC compounds and are verified using the experimental results. Nanoindentation is used to determine the mechanical behavior of IMC phases in joints in different scales. Four-point bending notched multilayer specimen and four-point bending technique were used to determine fracture toughness of the bonds containing IMCs. Analytical modeling of peeling and shear stresses and fracture toughness in tri-layer four-point bend specimen containing intermetallic layer was developed and was verified and validated using finite element simulation and experimental results. The experiment is used in conjunction with the model to calculate and verify the fracture toughness of Cu6Sn5 IMC materials. As expected two different IMC phases

  17. Investigation of displacement, strain and stress in single step transversely isotropic elastic bonded joint

    NASA Astrophysics Data System (ADS)

    Apu, Md. Jakaria; Islam, Md. Shahidul

    2016-07-01

    Bi-material joint is often used in many advanced materials and structures. Determination of the bonding strength at the interface is very difficult because of the presence of the stress singularity. In this paper, the displacement and stress fields of a transversely isotropic bi-material joint around an interface edge are determined. Autodesk Simulation Mechanical 2015 is used to carry out the numerical computations. Stress and displacement fields demonstrate that the values near the edge of joint where the stress singularity occurs are larger than that at the inner portion. From the numerical results, it is suggested that de-bonding of the interface may occur at the interface edge of the joint due to the higher stress concentration at the free edge.

  18. Microstructure and mechanical properties of China low activation martensitic steel joint by TIG multi-pass welding with a new filler wire

    NASA Astrophysics Data System (ADS)

    Huang, Bo; Zhang, Junyu; Wu, Qingsheng

    2017-07-01

    Tungsten Inner Gas (TIG) welding is employed for joining of China low activation martensitic (CLAM) steel. A new filler wire was proposed, and the investigation on welding with various heat input and welding passes were conducted to lower the tendency towards the residual of δ ferrite in the joint. With the optimized welding parameters, a butt joint by multi-pass welding with the new filler wire was prepared to investigate the microstructure and mechanical properties. The microstructure of the joint was observed by optical microscope (OM) and scanning electron microscope (SEM). The hardness, Charpy impact and tensile tests of the joint were implemented at room temperature (25 °C). The results revealed that almost full martensite free from ferrite in the joints were obtained by multipass welding with the heat input of 2.26 kJ/mm. A certain degree of softening occurred at the heat affected zone of the joint according to the results of tensile and hardness tests. The as welded joints showed brittle fracture in the impact tests. However, the joints showed toughness fracture after tempering and relatively better comprehensive performance were achieved when the joints were tempered at 740 °C for 2 h.

  19. Design/Analysis of Metal/Composite Bonded Joints for Survivability at Cryogenic Temperatures

    NASA Technical Reports Server (NTRS)

    Bartoszyk, Andrew E.

    2004-01-01

    A major design and analysis challenge for the JWST ISM structure is the metal/composite bonded joints that will be required to survive down to an operational ultra-low temperature of 30K (-405 F). The initial and current baseline design for the plug-type joint consists of a titanium thin walled fitting (1-3mm thick) bonded to the interior surface of an M555/954-6 composite truss square tube with an axially stiff biased lay-up. Metallic fittings are required at various nodes of the truss structure to accommodate instrument and lift-point bolted interfaces. Analytical experience and design work done on metal/composite bonded joints at temperatures below liquid nitrogen are limited and important analysis tools, material properties, and failure criteria for composites at cryogenic temperatures are virtually nonexistent. Increasing the challenge is the difficulty in testing for these required tools and parameters at 30K. A preliminary finite element analysis shows that failure due to CTE mismatch between the biased composite and titanium or aluminum is likely. Failure is less likely with Invar, however an initial mass estimate of Invar fittings demonstrates that Invar is not an automatic alternative. In order to gain confidence in analyzing and designing the ISM joints, a comprehensive joint development testing program has been planned and is currently running. The test program is designed for the correlation of the analysis methodology, including tuning finite element model parameters, and developing a composite failure criterion for the effect of multi-axial composite stresses on the strength of a bonded joint at 30K. The testing program will also consider stress mitigation using compliant composite layers and potential strength degradation due to multiple thermal cycles. Not only will the finite element analysis be correlated to the test data, but the FEA will be used to guide the design of the test. The first phase of the test program has been completed and the

  20. The effect of prior sandblasting of the wire on the shear bond strength of two different types of lingual retainers.

    PubMed

    Kilinç, Delal Dara; Sayar, Gülşilay

    2018-04-07

    The aim of this study was to evaluate the effect of total surface sandblasting on the shear bond strength of two different retainer wires. The null hypothesis was that there is no difference in the bond strength of the two types of lingual retainer wires when they are sandblasted. One hundred and sixty human premolar teeth were equally divided into four groups (n=40). A pair of teeth was embedded in self-curing acrylic resin and polished. Retainer wires were applied on the etched and rinsed surfaces of the teeth. Four retainers were used: group 1: braided retainer (0.010×0.028″, Ortho Technology); group 2: sandblasted braided retainer (0.010×0.028″, Ortho Technology); group 3: coaxial retainer (0.0215″ Coaxial, 3M) and group 4: sandblasted coaxial retainer (0.0215″ Coaxial, 3M). The specimens were tested using a universal test machine in shear mode with a crosshead speed of one mm/min. One-way analysis of variance (Anova) was used to determine the significant differences among the groups. There was no significant difference (P=0.117) among the groups according to this test. The null hypothesis was accepted. There was no statistically significant difference among the shear bond strength values of the four groups. Copyright © 2018 CEO. Published by Elsevier Masson SAS. All rights reserved.

  1. Durability of polyimide adhesives and their bonded joints for high-temperature applications

    NASA Astrophysics Data System (ADS)

    Parvatareddy, Hari

    The objective of this study was to evaluate and develop an understanding of durability of an adhesive bonded system, for application in a future high speed civil transport (HSCT) aircraft structure. The system under study was comprised of Ti-6Al-4V metal adherends and a thermosetting polyimide adhesive, designated as FM-5, supplied by Cytec Engineered Materials, Inc. An approach based on fracture mechanics was employed to assess Ti-6Al-4V/FM-5 bond durability. Initially, wedge tests were utilized to find a durable surface pretreatment for the titanium adherends. Based on an extensive screening study, chromic acid anodization (CAA) was chosen as the standard pretreatment for this research project. Double cantilever beam specimens (DCB) were then made and aged at 150sp°C, 177sp°C, and 204sp°C in three different environments; ambient atmospheric air (14.7 psia), and reduced air pressures of 2 psia (13.8 KPa) and 0.2 psia (1.38 KPa). Joints were aged for up to 18 months (including several intermediate aging times) in the above environments. The strain energy release rate (G) of the adhesive joints was monitored as a function of exposure time in the different environments. A 40% drop in fracture toughness was noted over the 18 month period, with the greatest degradation observed in samples aged at 204sp°C in ambient atmospheric air pressure. The loss in adhesive bond performance with time was attributable to a combination of physical and chemical aging phenomena in the FM-5 resin, and possible degradation of the metal-adhesive interface(s). Several mechanical and material tests, performed on the bonded joints and neat FM-5 resin specimens, confirmed the above statement. It was also noted that physical aging could be "erased" by thermal rejuvenation, partially restoring the toughness of the FM-5 adhesive material. The FM-5 adhesive material displayed good chemical resistance towards organic solvents and other aircraft fluids such as jet fuel and hydraulic fluid. The

  2. Next Generation Wiring

    NASA Technical Reports Server (NTRS)

    Medelius, Petro; Jolley, Scott; Fitzpatrick, Lilliana; Vinje, Rubiela; Williams, Martha; Clayton, LaNetra; Roberson, Luke; Smith, Trent; Santiago-Maldonado, Edgardo

    2007-01-01

    Wiring is a major operational component on aerospace hardware that accounts for substantial weight and volumetric space. Over time wire insulation can age and fail, often leading to catastrophic events such as system failure or fire. The next generation of wiring must be reliable and sustainable over long periods of time. These features will be achieved by the development of a wire insulation capable of autonomous self-healing that mitigates failure before it reaches a catastrophic level. In order to develop a self-healing insulation material, three steps must occur. First, methods of bonding similar materials must be developed that are capable of being initiated autonomously. This process will lead to the development of a manual repair system for polyimide wire insulation. Second, ways to initiate these bonding methods that lead to materials that are similar to the primary insulation must be developed. Finally, steps one and two must be integrated to produce a material that has no residues from the process that degrades the insulating properties of the final repaired insulation. The self-healing technology, teamed with the ability to identify and locate damage, will greatly improve reliability and safety of electrical wiring of critical systems. This paper will address these topics, discuss the results of preliminary testing, and remaining development issues related to self-healing wire insulation.

  3. Delamination failure of multilaminated adhesively bonded joints at low temperatures

    NASA Astrophysics Data System (ADS)

    Lee, Chi-Seung; Chun, Min-Sung; Kim, Myung-Hyun; Lee, Jae-Myung

    2011-08-01

    A series of experimental investigations of multilaminated joints adhesively bonded by epoxy/polyurethane (PU) glue were conducted in order to examine the delamination failure characteristics under in-plane shear loading at low temperatures. In order to observe these phenomena, a series of lap-shear tests were carried out at various low temperatures (20 °C, -110 °C and -163 °C) and various adhesion areas (15 mm × 50 mm, 30 mm × 50 mm, 50 mm × 50 mm, 75 mm × 50 mm and 100 mm × 50 mm). The test results were used to investigate the delamination and material characteristics, as well as the material properties, e.g., ultimate shear stress and shear elongation. Furthermore, the dependencies of the characteristics of multilaminated adhesively bonded joints (MABJs) on temperature and adhesion area was analyzed using the stress-strain relationship, and closed form formulas that are functions of the dependent parameters are proposed.

  4. [Treatment of ulnar collateral ligament avulsion fracture of thumb metacarpophalangeal joint using a combination of Kirschner wire and silk tension band].

    PubMed

    Gao, Shunhong; Feng, Shiming; Jiao, Cheng

    2012-12-01

    To investigate the effectiveness of Kirschner wire combined with silk tension band in the treatment of ulnar collateral ligament avulsion fracture of the thumb metacarpophalangeal joint. Between September 2008 and October 2011, 14 patients with ulnar collateral ligament avulsion fracture of the thumb metacarpophalangeal joint were treated using a combination of Kirschner wire and silk tension band. There were 8 males and 6 females, aged 23-55 years (mean, 40.8 years). The causes of injury were machinery twist injury in 5 cases, manual twist injury in 4 cases, falling in 4 cases, sports injury in 1 case. The time from injury to operation was 2 hours-14 days. All the patients presented pain over the ulnar aspect of the metacarpophalangeal joint of the thumb, limitation of motion, and joint instability with pinch and grip. The lateral stress testing of the metacarpophalangeal joint was positive. Function training was given at 2 weeks after operation. All incisions healed by first intention. The lateral stress testing of the metacarpophalangeal joint was negative. All the patients were followed up 6-18 months (mean, 13.1 months). The X-ray films showed good fracture reduction and healing with an average time of 7 weeks (range, 4-10 weeks). At last follow-up, the thumbs had stable flexion and extension of the metacarpophalangeal joint, normal opposition function and grip and pinch strengths. According to Saetta et al. criteria for functional assessment, the results were excellent in 11 cases and good in 3 cases; the excellent and good rate was 100%. It is an easy and simple method to treat ulnar collateral ligament avulsion fracture of the thumb metacarpophalangeal joint using Kirschner wire combined with silk tension band, which can meet the good finger function.

  5. Porous coatings from wire mesh for bone implants

    DOEpatents

    Sump, Kenneth R.

    1986-01-01

    A method of coating areas of bone implant elements and the resulting implant having a porous coating are described. Preselected surface areas are covered by a preform made from continuous woven lengths of wire. The preform is compressed and heated to assure that diffusion bonding occurs between the wire surfaces and between the surface boundaries of the implant element and the wire surfaces in contact with it. Porosity is achieved by control of the resulting voids between the bonded wire portions.

  6. Adhesive Characterization and Progressive Damage Analysis of Bonded Composite Joints

    NASA Technical Reports Server (NTRS)

    Girolamo, Donato; Davila, Carlos G.; Leone, Frank A.; Lin, Shih-Yung

    2014-01-01

    The results of an experimental/numerical campaign aimed to develop progressive damage analysis (PDA) tools for predicting the strength of a composite bonded joint under tensile loads are presented. The PDA is based on continuum damage mechanics (CDM) to account for intralaminar damage, and cohesive laws to account for interlaminar and adhesive damage. The adhesive response is characterized using standard fracture specimens and digital image correlation (DIC). The displacement fields measured by DIC are used to calculate the J-integrals, from which the associated cohesive laws of the structural adhesive can be derived. A finite element model of a sandwich conventional splice joint (CSJ) under tensile loads was developed. The simulations indicate that the model is capable of predicting the interactions of damage modes that lead to the failure of the joint.

  7. Stresses in adhesively bonded joints - A closed-form solution

    NASA Technical Reports Server (NTRS)

    Delale, F.; Erdogan, F.; Aydinoglu, M. N.

    1981-01-01

    The general plane strain problem of adhesively bonded structures consisting of two different, orthotropic adherends is considered, under the assumption that adherend thicknesses are constant and small in relation to the lateral dimensions of the bonded region, so that they may be treated as plates. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form, with a single lap joint and a stiffened plate under various loading conditions being considered as examples. It is found that the plate theory used in the analysis not only predicts the correct trend for adhesive stresses but gives surprisingly accurate results, the solution being obtained by assuming linear stress-strain relations for the adhesive.

  8. Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental and Workflow Protocols

    DTIC Science & Technology

    2016-06-01

    unlimited. v List of Tables Table 1 Single-lap-joint experimental parameters ..............................................7 Table 2 Survey ...Joints: Experimental and Workflow Protocols by Robert E Jensen, Daniel C DeSchepper, and David P Flanagan Approved for...TR-7696 ● JUNE 2016 US Army Research Laboratory Multivariate Analysis of High Through-Put Adhesively Bonded Single Lap Joints: Experimental

  9. Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator

    NASA Astrophysics Data System (ADS)

    Feng, Wuwei; Meng, Qingfeng; Xie, Youbo; Fan, Hong

    2011-04-01

    In this paper, a technique for on-line quality detection of ultrasonic wire bonding is developed. The electrical signals from the ultrasonic generator supply, namely, voltage and current, are picked up by a measuring circuit and transformed into digital signals by a data acquisition system. A new feature extraction method is presented to characterize the transient property of the electrical signals and further evaluate the bond quality. The method includes three steps. First, the captured voltage and current are filtered by digital bandpass filter banks to obtain the corresponding subband signals such as fundamental signal, second harmonic, and third harmonic. Second, each subband envelope is obtained using the Hilbert transform for further feature extraction. Third, the subband envelopes are, respectively, separated into three phases, namely, envelope rising, stable, and damping phases, to extract the tiny waveform changes. The different waveform features are extracted from each phase of these subband envelopes. The principal components analysis (PCA) method is used for the feature selection in order to remove the relevant information and reduce the dimension of original feature variables. Using the selected features as inputs, an artificial neural network (ANN) is constructed to identify the complex bond fault pattern. By analyzing experimental data with the proposed feature extraction method and neural network, the results demonstrate the advantages of the proposed feature extraction method and the constructed artificial neural network in detecting and identifying bond quality.

  10. Experimental investigation on frequency shifting of imperfect adhesively bonded pipe joints

    NASA Astrophysics Data System (ADS)

    Haiyam, F. N.; Hilmy, I.; Sulaeman, E.; Firdaus, T.; Adesta, E. Y. T.

    2018-01-01

    Inspection tests for any manufactured structure are compulsory in order to detect the existence of damage.It is to ensure the product integrity, reliability and to avoid further catastrophic failure. In this research, modal analysis was utilized to detect structural damage as one of the Non Destructive Testing (NDT) methods. Comparing the vibration signal of a healthy structure with a non-healthy signal was performed. A modal analysis of an adhesively bonded pipe joint was investigated with a healthy joint as a reference. The damage joint was engineered by inserting a nylon fiber, which act as an impurity at adhesive region. The impact test using hammer was utilized in this research. Identification of shifting frequency of a free supported and clamped pipe joint was performed.It was found that shifting frequency occurred to the lower side by 5%.

  11. [Separate vertical wiring combined with tension band and Kirschner-wire plus cerclage wire in the treatment of displaced inferior pole fractures of the patella].

    PubMed

    Zhang, J; Jiang, X Y; Huang, X W

    2016-06-18

    To investigate the clinical efficacy and outcomes of two separate vertical wiring combined with tension band and Kirschner-wire plus cerclage wire in the treatment of displaced inferior pole fractures of the patella. From January 2013 to January 2015, 15 consecutive patients (mean age 54.5 years) with inferior pole fractures of the patella were retrospectively included in this study. All the patients underwent open reduction and internal fixation by separate vertical wiring combined with tension band and Kirschner-wire plus cerclage wire through longitudinal incision, 4.5 d (range: 3.1-5.9 d) after initial injury. A safety check for early knee range of motion was performed before wound closure. The complications including infection, nonunion, loss of fixation and any wire breakage or irritation from implant were recorded. Anteroposterior and lateral views of the knee joint obtained during the follow-up were used to assess bony union based on the time when the fracture line disappeared. At the time of the final outpatient follow up, functional evaluation of the knee joint was conducted by Bostman system. The follow-up time was 13.1 months (range: 12-19 months) after surgery on average, immediate motion without immobilization in all the cases was allowed and there was no case of reduction loss of the fracture and wire breakage. There was no case of irritation from the implant. At the final follow-up, the average range of motion (ROM) arc was 126.7° (range: 115°-140°), the average ROM lag versus contralateral healthy leg was 10.3° (range: 0°-35°). The mean Bostman score at the last follow-up was 28.9 (range: 27-30), and graded excellent in most cases. Two separate vertical wiring is an easy and effective method to reduce the displaced inferior pole fracture of patella. Augmentation of separate vertical wiring with tension band and Kirschner-wire plus cerclage wire in these patients provides enough strength to protected the early exercise of the knee joint and

  12. ZnO nanorod arrays and direct wire bonding on GaN surfaces for rapid fabrication of antireflective, high-temperature ultraviolet sensors

    NASA Astrophysics Data System (ADS)

    So, Hongyun; Senesky, Debbie G.

    2016-11-01

    Rapid, cost-effective, and simple fabrication/packaging of microscale gallium nitride (GaN) ultraviolet (UV) sensors are demonstrated using zinc oxide nanorod arrays (ZnO NRAs) as an antireflective layer and direct bonding of aluminum wires to the GaN surface. The presence of the ZnO NRAs on the GaN surface significantly reduced the reflectance to less than 1% in the UV and 4% in the visible light region. As a result, the devices fabricated with ZnO NRAs and mechanically stable aluminum bonding wires (pull strength of 3-5 gf) showed higher sensitivity (136.3% at room temperature and 148.2% increase at 250 °C) when compared with devices with bare (uncoated) GaN surfaces. In addition, the devices demonstrated reliable operation at high temperatures up to 300 °C, supporting the feasibility of simple and cost-effective UV sensors operating with higher sensitivity in high-temperature conditions, such as in combustion, downhole, and space exploration applications.

  13. Transfer impedance measurements of the space shuttle Solid Rocket Motor (SRM) joints, wire meshes and a carbon graphite motor case

    NASA Technical Reports Server (NTRS)

    Papazian, Peter B.; Perala, Rodney A.; Curry, John D.; Lankford, Alan B.; Keller, J. David

    1988-01-01

    Using three different current injection methods and a simple voltage probe, transfer impedances for Solid Rocket Motor (SRM) joints, wire meshes, aluminum foil, Thorstrand and a graphite composite motor case were measured. In all cases, the surface current distribution for the particular current injection device was calculated analytically or by finite difference methods. The results of these calculations were used to generate a geometric factor which was the ratio of total injected current to surface current density. The results were validated in several ways. For wire mesh measurements, results showed good agreement with calculated results for a 14 by 18 Al screen. SRM joint impedances were independently verified. The filiment wound case measurement results were validated only to the extent that their curve shape agrees with the expected form of transfer impedance for a homogeneous slab excited by a plane wave source.

  14. Dual wire welding torch and method

    DOEpatents

    Diez, Fernando Martinez; Stump, Kevin S.; Ludewig, Howard W.; Kilty, Alan L.; Robinson, Matthew M.; Egland, Keith M.

    2009-04-28

    A welding torch includes a nozzle with a first welding wire guide configured to orient a first welding wire in a first welding wire orientation, and a second welding wire guide configured to orient a second welding wire in a second welding wire orientation that is non-coplanar and divergent with respect to the first welding wire orientation. A method of welding includes moving a welding torch with respect to a workpiece joint to be welded. During moving the welding torch, a first welding wire is fed through a first welding wire guide defining a first welding wire orientation and a second welding wire is fed through a second welding wire guide defining a second welding wire orientation that is divergent and non-coplanar with respect to the first welding wire orientation.

  15. Development and Status of Cu Ball/Wedge Bonding in 2012

    NASA Astrophysics Data System (ADS)

    Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard

    2013-03-01

    Starting in the 1980s and continuing right into the last decade, a great deal of research has been published on Cu ball/wedge (Cu B/W) wire bonding. Despite this, the technology has not been established in industrial manufacturing to any meaningful extent. Only spikes in the price of Au, improvements in equipment and techniques, and better understanding of the Cu wire-bonding process have seen Cu B/W bonding become more widespread—initially primarily for consumer goods manufacturing. Cu wire bonding is now expected to soon be used for at least 20% of all ball/wedge-bonded components, and its utilization in more sophisticated applications is around the corner. In light of this progress, the present paper comprehensively reviews the existing literature on this topic and discusses wire-bonding materials, equipment, and tools in the ongoing development of Cu B/W bonding technology. Key bonding techniques, such as flame-off, how to prevent damage to the chip (cratering), and bond formation on various common chip and substrate finishes are also described. Furthermore, apart from discussing quality assessment of Cu wire bonds in the initial state, the paper also provides an overview of Cu bonding reliability, in particular regarding Cu balls on Al metalization at high temperatures and in humidity (including under the influence of halide ions).

  16. Bonded composite to metal scarf joint performance in an aircraft landing gear drag strut. [for Boeing 747 aircraft

    NASA Technical Reports Server (NTRS)

    Howell, W. E.

    1974-01-01

    The structural performance of a boron-epoxy reinforced titanium drag strut, which contains a bonded scarf joint and was designed to the criteria of the Boeing 747 transport, was evaluated. An experimental and analytical investigation was conducted. The strut was exposed to two lifetimes of spectrum loading and was statically loaded to the tensile and compressive design ultimate loads. Throughout the test program no evidence of any damage in the drag strut was detected by strain gage measurements, ultrasonic inspection, or visual observation. An analytical study of the bonded joint was made using the NASA structural analysis computer program NASTRAN. A comparison of the strains predicted by the NASTRAN computer program with the experimentally determined values shows excellent agreement. The NASTRAN computer program is a viable tool for studying, in detail, the stresses and strains induced in a bonded joint.

  17. Study of mechanical joint strength of aluminum alloy 7075-T6 and dual phase steel 980 welded by friction bit joining and weld-bonding under corrosion medium

    DOE PAGES

    Lim, Yong Chae; Squires, Lile; Pan, Tsung-Yu; ...

    2014-12-30

    We have employed a unique solid-sate joining process, called friction bit joining (FBJ), to spot weld aluminum alloy (AA) 7075-T6 and dual phase (DP) 980 steel. Static joint strength was studied in the lap shear tension configuration. In addition, weld-bonding (adhesive + FBJ) joints were studied in order to evaluate the ability of adhesive to mitigate the impact of corrosion on joint properties. Accelerated laboratory cyclic corrosion tests were carried out for both FBJ only and weld-bonding joints. Furthermore, the FBJ only joints that emerged from corrosion testing had lap shear failure loads that were significantly lower than freshly preparedmore » joints. However, weld-bonding specimens retained more than 80% of the lap shear failure load of the freshly prepared weld-bonding specimens. Moreover, examination of joint cross sections confirmed that the presence of adhesive in the weld-bonding joints mitigated the effect of the corrosion environment, compared to FBJ only joints.« less

  18. Lingual straight wire method.

    PubMed

    Takemoto, Kyoto; Scuzzo, Giuseppe; Lombardo, L U C A; Takemoto, Y U I

    2009-12-01

    The mushroom arch-wire is mainly used in lingual orthodontic treatment but the complicated wire bending it requires affects both the treatment results and the time spent at the chair. The author proposes a new lingual straight wire method (LSW) in order to facilitate arch coordination and simplify the mechanics. The attention paid to the set-up model and bracket positioning and bonding plus the use of the new LSW method will also improve patient comfort. Copyright 2009 Collège Européen d'Orthodontie. Published by Elsevier Masson SAS.. All rights reserved.

  19. Mixed-mode cyclic debonding of adhesively bonded composite joints. M.S. Thesis

    NASA Technical Reports Server (NTRS)

    Rezaizadeh, M. A.; Mall, S.

    1985-01-01

    A combined experimental-analytical investigation to characterize the cyclic failure mechanism of a simple composite-to-composite bonded joint is conducted. The cracked lap shear (CLS) specimens of graphite/epoxy adherend bonded with EC-3445 adhesive are tested under combined mode 1 and 2 loading. In all specimens tested, fatigue failure occurs in the form of cyclic debonding. The cyclic debond growth rates are measured. The finite element analysis is employed to compute the mode 1, mode 2, and total strain energy release rates (i.e., GI, GII, and GT). A wide range of mixed-mode loading, i.e., GI/GII ranging from 0.03 to 0.38, is obtained. The total strain energy release rate, G sub T, appeared to be the driving parameter for cyclic debonding in the tested composite bonded system.

  20. Mechanical and Functional Properties of Nickel Titanium Adhesively Bonded Joints

    NASA Astrophysics Data System (ADS)

    Niccoli, F.; Alfano, M.; Bruno, L.; Furgiuele, F.; Maletta, C.

    2014-07-01

    In this study, adhesive joints made up of commercial NiTi sheets with shape memory capabilities are analyzed. Suitable surface pre-treatments, i.e., degreasing, sandblasting, and chemical etching, are preliminary compared in terms of surface roughness, surface energy, and substrate thinning. Results indicate that chemical etching induces marked substrate thinning without substantial gains in terms of surface roughness and free energy. Therefore, adhesive joints with degreased and sandblasted substrates are prepared and tested under both static and cyclic conditions, and damage development within the adhesive layer is monitored in situ using a CCD camera. Sandblasted specimens have a significantly higher mechanical static strength with respect to degreased ones, although they essentially fail in similar fashion, i.e., formation of microcracks followed by decohesion along the adhesive/substrate interface. In addition, the joints show a good functional response with almost complete shape memory recovery after thermo-mechanical cycling, i.e., a small accumulation of residual deformations occurs. The present results show that adhesive bonding is a viable joining technique for NiTi alloys.

  1. Thermoelectric Mechanism and Interface Characteristics of Cyanide-Free Nanogold-Coated Silver Wire

    NASA Astrophysics Data System (ADS)

    Tseng, Yi-Wei; Hung, Fei-Yi; Lui, Truan-Sheng

    2016-01-01

    Traditional bath-plated gold contains a cyanide complex, which is an environmental hazard. In response, our study used a green plating process to produce cyanide-free gold-coated silver (cyanide-free ACA) bonding wire that has been proven to be a feasible alternative to gold bonding wire in semiconductor packaging. In this work, ACA wire annealed at 550°C was found to have stable microstructure and superior mechanical properties. Intermetallic compounds Ag2Al and AuAl2 grew from Ag-Au balls and Al pads after aging at 175°C for 500 h. After current testing, ACA wire was found to have improved electrical properties due to equiaxed grain growth. The gold nanolayer on the Ag surface increased the oxidation resistance. These results provide insights regarding the reliability of ACA wire in advanced bonding processes.

  2. Interfacial Microstructure and Mechanical Strength of 93W/Ta Diffusion-Bonded Joints with Ni Interlayer

    NASA Astrophysics Data System (ADS)

    Luo, Guoqiang; Zhang, Jian; Li, Meijuan; Wei, Qinqin; Shen, Qiang; Zhang, Lianmeng

    2013-02-01

    93W alloy and Ta metal were successfully diffusion bonded using a Ni interlayer. Ni4W was found at the W-Ni interface, and Ni3Ta and Ni2Ta were formed at the Ni-Ta interface. The shear strength of the joints increases with increasing holding time, reaching a value of 202 MPa for a joint prepared using a 90-minute holding time at 1103 K (830 °C) and 20 MPa. The fracture of this joint occurred within the Ni/Ta interface.

  3. Tensile test and interface retention forces between wires and composites in lingual fixed retainers.

    PubMed

    Paolone, Maria Giacinta; Kaitsas, Roberto; Obach, Patricia; Kaitsas, Vasilios; Benedicenti, Stefano; Sorrenti, Eugenio; Barberi, Fabrizio

    2015-06-01

    In daily orthodontic clinical practice retention is very important, and lingual retainers are part of this challenge. The failure of lingual retainers may be due to many factors. The aim of this study was to assess the retention forces and mechanical behavior of different types of wires matched with different kinds of composites in lingual retainers. A tensile test was performed on cylindrical composite test specimens bonded to orthodontic wires. The specimens were constructed using four different wires: a straight wire (Remanium .016×.022″ Dentaurum), two round twisted wires (Penta One .0215″ Masel, Gold Penta Twisted .0215″ Gold N'braces) and a rectangular braided wire (D-Rect .016×.022″ Ormco); and three composites: two micro-hybrids (Micro-Hybrid Enamel Plus HFO Micerium, and Micro-Hybrid SDR U Dentsply) and a micro-nano-filled composite (Micro-Nano-Filled Transbond LR 3M). The test was performed at a speed of 10mm/min on an Inström device. The wire was fixed with a clamp. The results showed that the bonding between wires and composites in lingual fixed retainers seemed to be lowest for rectangular smooth wires and increased in round twisted and rectangular twisted wires where the bonding was so strong that the maximum tension/bond strength was greater than the ultimate tensile strength of the wire. The highest values were in rectangular twisted wires. Concerning the composites, hybrid composites had the lowest interface bonding values and broke very quickly, while the nano- and micro-composites tolerated stronger forces and displayed higher bonding values. The best results were observed with the golden twisted wire and reached 21.46 MPa with the Transbond composite. With the rectangular braided wire the retention forces were so high that the Enamel Plus composite fractured when the load exceeded 154.6 N/MPa. When the same wire was combined with the Transbond LR either the wire or the composite broke when the force exceeded 240 N. The results of this

  4. Wiring design for the control of electromagnetic interference (EMI)

    NASA Technical Reports Server (NTRS)

    Kopasakis, George

    1995-01-01

    Wiring design is only one important aspect of EMI control. Other important areas for EMI are: circuit design, filtering, grounding, bonding, shielding, lighting, electrostatic discharge (ESD), transient suppression, and electromagnetic pulse (EMP). Topics covered include: wire magnetic field emissions at low frequencies; wire radiated magnetic field emissions at frequencies; wire design guidelines for EMI control; wire design guidelines for EMI control; high frequency emissions from cables; and pulse frequency spectra.

  5. Ultrasonics Equipped Crimp Tool: A New Technology for Aircraft Wiring Safety

    NASA Technical Reports Server (NTRS)

    Yost, William T.; Perey, Daniel F.; Cramer, Elliott

    2006-01-01

    We report on the development of a new measurement technique to quantitatively assess the condition of wire crimp connections. This ultrasonic (UT) method transmits high frequency sound waves through the joint under inspection. The wire-crimp region filters and scatters the ultrasonic energy as it passes through the crimp and wire. The resulting output (both time and frequency domains) provides a quantitative measure of the joint quality that is independent and unaffected by current. Crimps of poor mechanical and electrical quality will result in low temporal output and will distort the spectrum into unique and predictable patterns, depending on crimp "quality". This inexpensive, real-time measurement system can provide certification of crimps as they are made and recertification of existing wire crimps currently in service. The measurements for re-certification do not require that the wire be disconnected from its circuit. No other technology exists to measure in-situ the condition of wire joints (no electrical currents through the crimp are used in this analytical technique). We discuss the signals obtained from this instrument, and correlate these signals with destructive wire pull tests.

  6. Semiconductor measurement technology: Microelectronic ultrasonic bonding

    NASA Technical Reports Server (NTRS)

    Harman, G. G. (Editor)

    1974-01-01

    Information for making high quality ultrasonic wire bonds is presented as well as data to provide a basic understanding of the ultrasonic systems used. The work emphasizes problems and methods of solving them. The required measurement equipment is first introduced. This is followed by procedures and techniques used in setting up a bonding machine, and then various machine- or operator-induced reliability problems are discussed. The characterization of the ultrasonic system and its problems are followed by in-process bonding studies and work on the ultrasonic bonding (welding) mechanism. The report concludes with a discussion of various effects of bond geometry and wire metallurgical characteristics. Where appropriate, the latest, most accurate value of a particular measurement has been substituted for an earlier reported one.

  7. Explosive bonding of metal-matrix composites

    NASA Technical Reports Server (NTRS)

    Reece, O. Y.

    1969-01-01

    Explosive bonding process produces sheet composites of aluminum alloy reinforced by high-strength stainless steel wires. The bonds are excellent metallurgically, no external heat is required, various metals can be bonded, and the process is inexpensive.

  8. Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

    PubMed Central

    Chong Leong, Gan; Uda, Hashim

    2013-01-01

    This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do) under various aging conditions of different bonding wires. Wire pull and ball bond shear strengths have been analyzed and we found smaller variation in Pd-doped Cu wire compared to Au and Pd-doped Cu wire. Au bonds were identified to have faster IMC formation, compared to slower IMC growth of Cu. The obtained weibull slope, β of three bonding wires are greater than 1.0 and belong to wearout reliability data point. Pd-doped Cu wire exhibits larger time-to-failure and cycles-to-failure in both wearout reliability tests in Highly Accelerated Temperature and Humidity (HAST) and Temperature Cycling (TC) tests. This proves Pd-doped Cu wire has a greater potential and higher reliability margin compared to Au and Pd-coated Cu wires. PMID:24244344

  9. Effects of surface preparation on the long-term durability of adhesively bonded composite joints

    NASA Astrophysics Data System (ADS)

    Bardis, Jason Dante

    The long-term durability of adhesively bonded composite joints is critical to modern aircraft structures, which are increasingly adopting bonding as an alternative option to mechanical fastening. The effects of the surface preparation of the adherends are critical, affecting initial strength, long-term durability, fracture toughness, and failure modes of bonded joints. In this study, several potential factors are evaluated, with focus on the following: (1) Effects of possible chemical contamination from release fabrics, release films, and peel plies during adherend cure. (2) Chemical and mechanical effects of abrasion on the fracture toughness and failure mode. (3) Characterization of paste and film adhesives. There are several standard test methods used to evaluate specimen fracture, but the majority concentrate on bonded metals and interlaminar composite fracture. Testing concentrated on mode I tests; a custom double cantilever beam specimen was devised and utilized, and two forms of a wedge crack test (traveling and static) were also used. Additionally, single lap shear tests were run to contrast the mode I tests. Non-destructive testing included X-ray photography of crack fronts, energy dispersive spectroscopy and X-ray photoelectron spectroscopy surface chemistry analyses, and scanning electron microscope imaging of prepared surfaces. All mode I test methods tended to be in agreement in the ranking of different surface preparation methods. Test results revealed that release agents deposited on adherend surfaces during their cure cycle prevented proper adhesion. While mechanical abrasion did improve their fracture toughness and lower their contamination greatly, the test values did not reach the levels of samples that were not contaminated before bonding, and the interfacial modes of failure did not always change to desirable modes.

  10. Adjustable Bracket For Entry Of Welding Wire

    NASA Technical Reports Server (NTRS)

    Gilbert, Jeffrey L.; Gutow, David A.

    1993-01-01

    Wire-entry bracket on welding torch in robotic welding system provides for adjustment of angle of entry of welding wire over range of plus or minus 30 degrees from nominal entry angle. Wire positioned so it does not hide weld joint in view of through-the-torch computer-vision system part of robot-controlling and -monitoring system. Swiveling bracket also used on nonvision torch on which wire-feed-through tube interferes with workpiece. Angle simply changed to one giving sufficient clearance.

  11. Analytical and Numerical Results for an Adhesively Bonded Joint Subjected to Pure Bending

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III; Lundgren, Eric

    2006-01-01

    A one-dimensional, semi-analytical methodology that was previously developed for evaluating adhesively bonded joints composed of anisotropic adherends and adhesives that exhibit inelastic material behavior is further verified in the present paper. A summary of the first-order differential equations and applied joint loading used to determine the adhesive response from the methodology are also presented. The method was previously verified against a variety of single-lap joint configurations from the literature that subjected the joints to cases of axial tension and pure bending. Using the same joint configuration and applied bending load presented in a study by Yang, the finite element analysis software ABAQUS was used to further verify the semi-analytical method. Linear static ABAQUS results are presented for two models, one with a coarse and one with a fine element meshing, that were used to verify convergence of the finite element analyses. Close agreement between the finite element results and the semi-analytical methodology were determined for both the shear and normal stress responses of the adhesive bondline. Thus, the semi-analytical methodology was successfully verified using the ABAQUS finite element software and a single-lap joint configuration subjected to pure bending.

  12. Direct mapping of electrical noise sources in molecular wire-based devices

    NASA Astrophysics Data System (ADS)

    Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

    2017-02-01

    We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices.

  13. Direct mapping of electrical noise sources in molecular wire-based devices

    PubMed Central

    Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

    2017-01-01

    We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices. PMID:28233821

  14. Numerical and Experimental Characterization of a Composite Secondary Bonded Adhesive Lap Joint Using the Ultrasonics method

    NASA Astrophysics Data System (ADS)

    Kumar, M. R.; Ghosh, A.; Karuppannan, D.

    2018-05-01

    The construction of aircraft using advanced composites have become very popular during the past two decades, in which many innovative manufacturing processes, such as cocuring, cobonding, and secondary bonding processes, have been adopted. The secondary bonding process has become less popular than the other two ones because of nonavailability of process database and certification issues. In this article, an attempt is made to classify the quality of bonding using nondestructive ultrasonic inspection methods. Specimens were prepared and tested using the nondestructive ultrasonic Through Transmission (TT), Pulse Echo (PE), and air coupled guided wave techniques. It is concluded that the ultrasonic pulse echo technique is the best one for inspecting composite secondary bonded adhesive joints.

  15. Microstructure and Mechanical Properties of Reaction-Formed Joints in Reaction Bonded Silicon Carbide Ceramics

    NASA Technical Reports Server (NTRS)

    Singh, M.

    1998-01-01

    A reaction-bonded silicon carbide (RB-SiC) ceramic material (Carborundum's Cerastar RB-SIC) has been joined using a reaction forming approach. Microstructure and mechanical properties of three types of reaction-formed joints (350 micron, 50-55 micron, and 20-25 micron thick) have been evaluated. Thick (approximately 350 micron) joints consist mainly of silicon with a small amount of silicon carbide. The flexural strength of thick joints is about 44 plus or minus 2 MPa, and fracture always occurs at the joints. The microscopic examination of fracture surfaces of specimens with thick joints tested at room temperature revealed the failure mode to be typically brittle. Thin joints (<50-55 micron) consist of silicon carbide and silicon phases. The room and high temperature flexural strengths of thin (<50-55 micron) reaction-formed joints have been found to be at least equal to that of the bulk Cerastar RB-SIC materials because the flexure bars fracture away from the joint regions. In this case, the fracture origins appear to be inhomogeneities inside the parent material. This was always found to be the case for thin joints tested at temperatures up to 1350C in air. This observation suggests that the strength of Cerastar RB-SIC material containing a thin joint is not limited by the joint strength but by the strength of the bulk (parent) materials.

  16. Composite Bus Structure for the SMEX/WIRE Satellite

    NASA Technical Reports Server (NTRS)

    Rosanova, Giulio G.

    1998-01-01

    In an effort to reduce the weight and optimize the structural design of the Small Explorer (SMEX) Wide-Field Infrared Explorer (WIRE) spacecraft, it has become desirable to change the material and construction from mechanically fastened aluminum structure to a fully bonded fiber-reinforced composite (FRC) structure. GSFC has developed the WIRE spacecraft structural bus design concept, including the instrument and launch vehicle requirements. The WIRE Satellite is the fifth of a series of SMEX satellites to be launched once per year. GSFC has chosen Composite Optics Inc. (COI) as the prime contractor for the development and procurement of the WIRE composite structure. The detailed design of the fully bonded FRC structure is based on COI's Short Notice Accelerated Production SATellite ("SNAPSAT") approach. SNAPSAT is a state of the art design and manufacturing technology for advanced composite materials which utilizes flat-stock detail parts bonded together to produce a final structural assembly. The structural design approach adopted for the WIRE structure provides a very viable alternative to both traditional aluminum construction as well as high tech. molded type composite structures. This approach to composite structure design is much less costly than molded or honeycomb sandwich type composite construction, but may cost slightly more than conventional aluminum construction on the subsystem level. However on the overall program level the weight saving achieved is very cost effective, since the primary objective is to allocate more mass for science payloads.

  17. Research regarding the influence of driving-wires length change on positioning precision of a robotic arm

    NASA Astrophysics Data System (ADS)

    Ciofu, C.; Stan, G.

    2016-08-01

    The paper emphasise positioning precision of an elephant's trunk robotic arm which has joints driven by wires with variable length while operating The considered 5 degrees of freedom robotic arm has a particular structure of joint that makes possible inner actuation with wire-driven mechanism. We analyse solely the length change of wires as a consequence due inner winding and unwinding on joints for certain values of rotational angles. Variations in wires length entail joint angular displacements. We analyse positioning precision by taking into consideration equations from inverse kinematics of the elephant's trunk robotic arm. The angular displacements of joints are considered into computational method after partial derivation of positioning equations. We obtain variations of wires length at about tenths of micrometers. These variations employ angular displacements which are about minutes of sexagesimal degree and, thus, define positioning precision of elephant's trunk robotic arms. The analytical method is used for determining aftermath design structure of an elephant's trunk robotic arm with inner actuation through wires on positioning precision. Thus, designers could take suitable decisions on accuracy specifications limits of the robotic arm.

  18. Effect of Bonding Temperature on Interfacial Reaction and Mechanical Properties of Diffusion-Bonded Joint Between Ti-6Al-4V and 304 Stainless Steel Using Nickel as an Intermediate Material

    NASA Astrophysics Data System (ADS)

    Thirunavukarasu, Gopinath; Kundu, Sukumar; Mishra, Brajendra; Chatterjee, Subrata

    2014-04-01

    An investigation was carried out on the solid-state diffusion bonding between Ti-6Al-4V (TiA) and 304 stainless steel (SS) using pure nickel (Ni) of 200- μm thickness as an intermediate material prepared in vacuum in the temperature range from 973 K to 1073 K (700 °C to 800 °C) in steps of 298 K (25 °C) using uniaxial compressive pressure of 3 MPa and 60 minutes as bonding time. Scanning electron microscopy images, in backscattered electron mode, had revealed existence of layerwise Ti-Ni-based intermetallics such as either Ni3Ti or both Ni3Ti and NiTi at titanium alloy-nickel (TiA/Ni) interface, whereas nickel-stainless steel (Ni/SS) diffusion zone was free from intermetallic phases for all joints processed. Chemical composition of the reaction layers was determined in atomic percentage by energy dispersive spectroscopy and confirmed by X-ray diffraction study. Room-temperature properties of the bonded joints were characterized using microhardness evaluation and tensile testing. The maximum hardness value of ~800 HV was observed at TiA/Ni interface for the bond processed at 1073 K (800 °C). The hardness value at Ni/SS interface for all the bonds was found to be ~330 HV. Maximum tensile strength of ~206 MPa along with ~2.9 pct ductility was obtained for the joint processed at 1023 K (750 °C). It was observed from the activation study that the diffusion rate at TiA/Ni interface is lesser than that at the Ni/SS interface. From microhardness profile, fractured surfaces and fracture path, it was demonstrated that failure of the joints was initiated and propagated apparently at the TiA/Ni interface near Ni3Ti intermetallic phase.

  19. New technique of skin embedded wire double-sided laser beam welding

    NASA Astrophysics Data System (ADS)

    Han, Bing; Tao, Wang; Chen, Yanbin

    2017-06-01

    In the aircraft industry, double-sided laser beam welding is an approved method for producing skin-stringer T-joints on aircraft fuselage panels. As for the welding of new generation aluminum-lithium alloys, however, this technique is limited because of high hot cracking susceptibility and strengthening elements' uneven distributions within weld. In the present study, a new technique of skin embedded wire double-sided laser beam welding (LBW) has been developed to fabricate T-joints consisting of 2.0 mm thick 2060-T8/2099-T83 aluminum-lithium alloys using eutectic alloy AA4047 filler wire. Necessary dimension parameters of the novel groove were reasonably designed for achieving crack-free welds. Comparisons were made between the new technique welded T-joint and conventional T-joint mainly on microstructure, hot crack, elements distribution features and mechanical properties within weld. Excellent crack-free microstructure, uniform distribution of silicon and superior tensile properties within weld were found in the new skin embedded wire double-sided LBW T-joints.

  20. Handling fixture for soldering round wires to FCC

    NASA Technical Reports Server (NTRS)

    Loggins, R.; Martineck, H. G.

    1971-01-01

    Fixture holds flat conductor cable and wires in position until after soldering of contacting conductor ends and potting of junctions. Device provides for proper spacing of wires and adequate access for soldered joints during fabrication, and positions mold halves during potting operation.

  1. Weld bonding of titanium with polyimide adhesives

    NASA Technical Reports Server (NTRS)

    Vaughan, R. W.; Sheppard, C. H.; Orell, M. K.

    1975-01-01

    A conductive adhesive primer and a capillary flow adhesive were developed for weld bonding titanium alloy joints. Both formulations contained ingredients considered to be non-carcinogenic. Lap-shear joint test specimens and stringer-stiffened panels were weld bonded using a capillary flow process to apply the adhesive. Static property information was generated for weld bonded joints over the temperature range of 219K (-65 F) to 561K (550 F). The capillary flow process was demonstrated to produce weld bonded joints of equal strength to the weld through weld bonding process developed previously.

  2. Mössbauer characterization of joints of steel pieces in transient liquid phase bonding experiences

    NASA Astrophysics Data System (ADS)

    di Luozzo, N.; Martínez Stenger, P. F.; Canal, J. P.; Fontana, M. R.; Arcondo, B.

    2011-11-01

    Joining of seamless, low carbon, steel tubes were performed by means of Transient Liquid Phase Bonding process employing a foil of Fe-Si-B metallic glass as filler material. The influence of the main parameters of the process was evaluated: temperature, holding time, pressure and post weld heat treatment. Powder samples were obtained from the joint of tubes and characterized employing Mössbauer Spectroscopy in transmission geometry. The sampling was performed both in tubes successfully welded and in those which show joint defects. The results obtained are correlated with the obtained microstructure and the diffusion of Si and B during the process.

  3. Development of Bonded Joint Technology for a Rigidizable-Inflatable Deployable Truss

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III

    2006-01-01

    Microwave and Synthetic Aperture Radar antenna systems have been developed as instrument systems using truss structures as their primary support and deployment mechanism for over a decade. NASA Langley Research Center has been investigating fabrication, modular assembly, and deployment methods of lightweight rigidizable/inflatable linear truss structures during that time for large spacecraft systems. The primary goal of the research at Langley Research Center is to advance these existing state-of-the-art joining and deployment concepts to achieve prototype system performance in a relevant space environment. During 2005, the development, fabrication, and testing of a 6.7 meter multi-bay, deployable linear truss was conducted at Langley Research Center to demonstrate functional and precision metrics of a rigidizable/inflatable truss structure. The present paper is intended to summarize aspects of bonded joint technology developed for the 6.7 meter deployable linear truss structure while providing a brief overview of the entire truss fabrication, assembly, and deployment methodology. A description of the basic joint design, surface preparation investigations, and experimental joint testing of component joint test articles will be described. Specifically, the performance of two room temperature adhesives were investigated to obtain qualitative data related to tube folding testing and quantitative data related to tensile shear strength testing. It was determined from the testing that a polyurethane-based adhesive best met the rigidizable/inflatable truss project requirements.

  4. Nonlinear Analysis of Bonded Composite Single-LAP Joints

    NASA Technical Reports Server (NTRS)

    Oterkus, E.; Barut, A.; Madenci, E.; Smeltzer, S. S.; Ambur, D. R.

    2004-01-01

    This study presents a semi-analytical solution method to analyze the geometrically nonlinear response of bonded composite single-lap joints with tapered adherend edges under uniaxial tension. The solution method provides the transverse shear and normal stresses in the adhesive and in-plane stress resultants and bending moments in the adherends. The method utilizes the principle of virtual work in conjunction with von Karman s nonlinear plate theory to model the adherends and the shear lag model to represent the kinematics of the thin adhesive layer between the adherends. Furthermore, the method accounts for the bilinear elastic material behavior of the adhesive while maintaining a linear stress-strain relationship in the adherends. In order to account for the stiffness changes due to thickness variation of the adherends along the tapered edges, their in-plane and bending stiffness matrices are varied as a function of thickness along the tapered region. The combination of these complexities results in a system of nonlinear governing equilibrium equations. This approach represents a computationally efficient alternative to finite element method. Comparisons are made with corresponding results obtained from finite-element analysis. The results confirm the validity of the solution method. The numerical results present the effects of taper angle, adherend overlap length, and the bilinear adhesive material on the stress fields in the adherends, as well as the adhesive, of a single-lap joint

  5. Methods for Using Durable Adhesively Bonded Joints for Sandwich Structures

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III (Inventor); Lundgren, Eric C. (Inventor)

    2016-01-01

    Systems, methods, and apparatus for increasing durability of adhesively bonded joints in a sandwich structure. Such systems, methods, and apparatus includes an first face sheet and an second face sheet as well as an insert structure, the insert structure having a first insert face sheet, a second insert face sheet, and an insert core material. In addition, sandwich core material is arranged between the first face sheet and the second face sheet. A primary bondline may be coupled to the face sheet(s) and the splice. Further, systems, methods, and apparatus of the present disclosure advantageously reduce the load, provide a redundant path, reduce structural fatigue, and/or increase fatigue life.

  6. Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kropka, Jamie Michael; Adolf, Douglas Brian; Spangler, Scott Wilmer

    The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted formore » by the glass transition temperature, T g, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, T ref, by the same amount as the T g depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive T g depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.« less

  7. Mechanisms of degradation in adhesive joint strength: Glassy polymer thermoset bond in a humid environment

    DOE PAGES

    Kropka, Jamie Michael; Adolf, Douglas Brian; Spangler, Scott Wilmer; ...

    2015-08-06

    The degradation in the strength of napkin-ring (NR) joints bonded with an epoxy thermoset is evaluated in a humid environment. While adherend composition (stainless steel and aluminum) and surface preparation (polished, grit blasted, primed, coupling agent coated) do not affect virgin (time=0) joint strength, they can significantly affect the role of moisture on the strength of the joint. Adherend surface abrasion and corrosion processes are found to be key factors in determining the reliability of joint strength in humid environments. In cases where surface specific joint strength degradation processes are not active, decreases in joint strength can be accounted formore » by the glass transition temperature, T g, depression of the adhesive associated with water sorption. Under these conditions, joint strength can be rejuvenated to virgin strength by drying. In addition, the decrease in joint strength associated with water sorption can be predicted by the Simplified Potential Energy Clock (SPEC) model by shifting the adhesive reference temperature, T ref, by the same amount as the T g depression. When surface specific degradation mechanisms are active, they can reduce joint strength below that associated with adhesive T g depression, and joint strength is not recoverable by drying. Furthermore, a critical relative humidity (or, potentially, critical water sorption concentration), below which the surface specific degradation does not occur, appears to exist for the polished stainless steel joints.« less

  8. Stresses in adhesively bonded joints: A closed form solution. [plate theory

    NASA Technical Reports Server (NTRS)

    Delale, F.; Erdogan, F.; Aydinoglu, M. N.

    1980-01-01

    The plane strain of adhesively bonded structures which consist of two different orthotropic adherents is considered. Assuming that the thicknesses of the adherends are constant and are small in relation to the lateral dimensions of the bonded region, the adherends are treated as plates. The transverse shear effects in the adherends and the in-plane normal strain in the adhesive are taken into account. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form. A single lap joint and a stiffened plate under various loading conditions are considered as examples. To verify the basic trend of the solutions obtained from the plate theory a sample problem is solved by using the finite element method and by treating the adherends and the adhesive as elastic continua. The plate theory not only predicts the correct trend for the adhesive stresses but also gives rather surprisingly accurate results.

  9. Length-dependent structural stability of linear monatomic Cu wires

    NASA Astrophysics Data System (ADS)

    Singh, Gurvinder; Kumar, Krishan; Singh, Baljinder; Moudgil, R. K.

    2018-05-01

    We present first-principle calculations based on density functional theory for the finite-length monatomic Cu atom linear wires. The structure and its stability with increasing wire length in terms of number of atoms (N) is determined. Interestingly, the bond length is found to exhibit an oscillatory structure (the so-called magic length phenomenon), with a qualitative change in oscillatory behavior as one moves from even N wire to odd N wire. The even N wires follow simple even-odd oscillations whereas odd N wires show a phase change at the half length of the wires. The stability of the wire structure, determined in terms of the wire formation energy, also contains even-odd oscillation as a function of wire length. However, the oscillations in formation energy reverse its phase after the wire length is increased beyond N=12. Our findings are seen to be qualitatively consistent with recent simulations for a similar class finite-length metal atom wires.

  10. Evaluation of mechanical properties in metal wire mesh supported selective catalytic reduction (SCR) catalyst structures

    NASA Astrophysics Data System (ADS)

    Rajath, S.; Siddaraju, C.; Nandakishora, Y.; Roy, Sukumar

    2018-04-01

    The objective of this research is to evaluate certain specific mechanical properties of certain stainless steel wire mesh supported Selective catalytic reduction catalysts structures wherein the physical properties of the metal wire mesh and also its surface treatments played vital role thereby influencing the mechanical properties. As the adhesion between the stainless steel wire mesh and the catalyst material determines the bond strength and the erosion resistance of catalyst structures, surface modifications of the metal- wire mesh structure in order to facilitate the interface bonding is therefore very important to realize enhanced level of mechanical properties. One way to enhance such adhesion properties, the stainless steel wire mesh is treated with the various acids, i.e., chromic acid, phosphoric acid including certain mineral acids and combination of all those in various molar ratios that could generate surface active groups on metal surface that promotes good interface structure between the metal- wire mesh and metal oxide-based catalyst material and then the stainless steel wire mesh is dipped in the glass powder slurry containing some amount of organic binder. As a result of which the said catalyst material adheres to the metal-wire mesh surface more effectively that improves the erosion profile of supported catalysts structure including bond strength.

  11. Influence of interface ply orientation on fatigue damage of adhesively bonded composite joints

    NASA Technical Reports Server (NTRS)

    Johnson, W. S.; Mall, S.

    1985-01-01

    An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg nd 45 deg interface plies. Damage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.

  12. Influence of interface ply orientation on fatigue damage of adhesively bonded composite joints

    NASA Technical Reports Server (NTRS)

    Johnson, W. S.; Mall, S.

    1986-01-01

    An experimental study of cracked-lap-shear specimens was conducted to determine the influence of adherend stacking sequence on debond initiation and damage growth in a composite-to-composite bonded joint. Specimens consisted of quasi-isotropic graphite/epoxy adherends bonded together with either FM-300 or EC 3445 adhesives. The stacking sequence of the adherends was varied such that 0 deg, 45 deg, or 90 deg plies were present at the adherend-adhesive interfaces. Fatigue damage initiated in the adhesive layer in those specimens with 0 deg and 45 deg interface plies. Damaage initiated in the form of ply cracking in the strap adherend for the specimens with 90 deg interface plies. The fatigue-damage growth was in the form of delamination within the composite adherends for specimens with the 90 deg and 45 deg plies next to the adhesive, while debonding in the adhesive resulted for the specimens with 0 deg plies next to the adhesive. Those joints with the 0 deg and 45 deg plies next to either adhesive has essentially the same fatigue-damage-initiation stress levels. These stress levels were 13 and 71 percent higher, respectively, than those for specimens with 90 deg plies next to the EC 3445 and FM-300 adhesives.

  13. Effects of different overlap lengths and composite adherend thicknesses on the performance of adhesively-bonded joints under tensile and bending loadings

    NASA Astrophysics Data System (ADS)

    Kadioglu, F.; Avil, E.; Ercan, M. E.; Aydogan, T.

    2018-05-01

    Fiber-reinforced polymer composites are being used in an increasingly wide range of products. They are particularly popular in automotive and aerospace sectors because they offer an attractive combination of stiffness, strength and low mass. Adhesively-bonded joints of such materials are preferred by many designers due to their assembling advantages over other traditional mechanical joining systems, such as bolted and riveted joints. In this study, some experimental works have been carried out on adhesively-bonded adherends manufactured from a woven carbon fiber-reinforced polymer matrix composite (Hexply 8552S/A280-5H, produced by Hexcel), by using a film adhesive (AF163-2K produced by 3 M). The bonded specimens were prepared in the Single Lap Joint (SLJ) configuration, and tested in tensile and also in four-point bending loading. In order to assess the joint performance, three different overlap lengths, 15 mm, 25 mm and 40 mm, and two different thicknesses of the composite adherends, 2 mm and 3 mm, were used. The results shown that the parameters are controlled by the loading modes; while the overlap length increases the joint performance significantly in tensile loading, the opposite was the case for those in bending loading, which was affected mainly by the adherend thicknesses. The results were related to the mechanisms of joint failures; while the joints in the tensile failed in the adhesive layer with some exceptions, those in the bending mainly failed in the plies adjacent to the layer. The current study indicates that one of the important factors affecting the joint strength of the adherends manufactured from the laminated composites is the local failure of the plies. It is thought more focused-studies would be needed to lessen such problems, which would be possible via in-depth numerical analysis.

  14. Effect of Bonding Time on Interfacial Reaction and Mechanical Properties of Diffusion-Bonded Joint Between Ti-6Al-4V and 304 Stainless Steel Using Nickel as an Intermediate Material

    NASA Astrophysics Data System (ADS)

    Thirunavukarasu, Gopinath; Kundu, Sukumar; Mishra, Brajendra; Chatterjee, Subrata

    2014-04-01

    In the current study, solid-state diffusion bonding between Ti-6Al-4V (TiA) and 304 stainless steel (SS) using pure nickel (Ni) of 200- μm thickness as an intermediate material was carried out in vacuum. Uniaxial compressive pressure and temperature were kept at 4 MPa and 1023 K (750 °C), respectively, and the bonding time was varied from 30 to 120 minutes in steps of 15 minutes. Scanning electron microscopy images, in backscattered electron mode, revealed the layerwise Ti-Ni-based intermetallics like either Ni3Ti or both Ni3Ti and NiTi at titanium alloy-nickel (TiA/Ni) interface, whereas nickel-stainless steel (Ni/SS) interface was free from intermetallic phases for all the joints. Chemical composition of the reaction layers was determined by energy dispersive spectroscopy (SEM-EDS) and confirmed by X-ray diffraction study. Maximum tensile strength of ~382 MPa along with ~3.7 pct ductility was observed for the joints processed for 60 minutes. It was found that the extent of diffusion zone at Ni/SS interface was greater than that of TiA/Ni interface. From the microhardness profile, fractured surfaces, and fracture path, it was demonstrated that the failure of the joints was initiated and propagated apparently at TiA/Ni interface near Ni3Ti intermetallic for bonding time less than 90 minutes, and through Ni for bonding time 90 minutes and greater.

  15. Butt Welding Joint of Aluminum Alloy by Space GHTA Welding Process in Vacuum

    NASA Astrophysics Data System (ADS)

    Suita, Yoshikazu; Shinike, Shuhei; Ekuni, Tomohide; Terajima, Noboru; Tsukuda, Yoshiyuki; Imagawa, Kichiro

    Aluminum alloys have been used widely in constructing various space structures including the International Space Station (ISS) and launch vehicles. For space applications, welding experiments on aluminum alloy were performed using the GHTA (Gas Hollow Tungsten Arc) welding process using a filler wire feeder in a vacuum. We investigated the melting phenomenon of the base metal and filler wire, bead formation, and the effects of wire feed speed on melting characteristics. The melting mechanism in the base metal during the bead on a plate with wire feed was similar to that for the melt run without wire feed. We clarified the effects of wire feed speed on bead sizes and configurations. Furthermore, the butt welded joint welded using the optimum wire feed speed, and the joint tensile strengths were evaluated. The tensile strength of the square butt joint welded by the pulsed DC GHTA welding with wire feed in a vacuum is nearly equal to that of the same joint welded by conventional GTA (Gas Tungsten Arc) welding in air.

  16. Flowable composites for bonding orthodontic retainers.

    PubMed

    Tabrizi, Sama; Salemis, Elio; Usumez, Serdar

    2010-01-01

    To test the null hypothesis that there are no statistically significant differences between flowables and an orthodontic adhesive tested in terms of shear bond strength (SBS) and pullout resistance. To test the SBS of Light Bond, FlowTain, Filtek Supreme, and Tetric Flow were applied to the enamel surfaces of 15 teeth. Using matrices for application, each composite material was cured for 40 seconds and subjected to SBS testing. To test pullout resistance, 15 samples were prepared for each composite in which a wire was embedded; then the composite was cured for 40 seconds. Later, the ends of the wire were drawn up and tensile stress was applied until the resin failed. Findings were analyzed using an ANOVA and a Tukey HSD test. The SBS values for Light Bond, FlowTain, Filtek Supreme, and Tetric Flow were 19.0 +/- 10.9, 14.7 +/- 9.3, 22.4 +/- 16.3, and 16.8 +/- 11.8 MPa, respectively, and mean pullout values were 42.2 +/- 13.0, 24.0 +/- 6.9, 26.3 +/- 9.4, and 33.8 +/- 18.0 N, respectively. No statistically significant differences were found among the groups in terms of SBS (P > .05). On the other hand, Light Bond yielded significantly higher pullout values compared with the flowables Filtek Supreme and Flow-Tain (P < .01). However, there were no significant differences among the pullout values of flowables, nor between Light Bond and Tetric Flow (P > .05). The hypothesis is rejected. Light Bond yielded significantly higher pullout values compared with the flowables Filtek Supreme and FlowTain. However, flowable composites provided satisfactory SBS and wire pullout values, comparable to a standard orthodontic resin, and therefore can be used as an alternative for direct bonding of lingual retainers.

  17. Cohesive Laws and Progressive Damage Analysis of Composite Bonded Joints, a Combined Numerical/Experimental Approach

    NASA Technical Reports Server (NTRS)

    Girolamo, Donato; Davila, Carlos G.; Leone, Frank A.; Lin, Shih-Yung

    2015-01-01

    The results of an experimental/numerical campaign aimed to develop progressive damage analysis (PDA) tools for predicting the strength of a composite bonded joint under tensile loads are presented. The PDA is based on continuum damage mechanics (CDM) to account for intralaminar damage, and cohesive laws to account for interlaminar and adhesive damage. The adhesive response is characterized using standard fracture specimens and digital image correlation (DIC). The displacement fields measured by DIC are used to calculate the J-integrals, from which the associated cohesive laws of the structural adhesive can be derived. A finite element model of a sandwich conventional splice joint (CSJ) under tensile loads was developed. The simulations, in agreement with experimental tests, indicate that the model is capable of predicting the interactions of damage modes that lead to the failure of the joint.

  18. Transducer Joint for Kidney-Stone Ultrasonics

    NASA Technical Reports Server (NTRS)

    Angulo, E. D.

    1983-01-01

    Ultrasonic therapy for kidney stones improved by new way of connecting wire-probe ultrasonic waveguide to transducer. Improved mounting allows joint to last long enough for effective treatment. Sheath and rubber dampers constrain lateral vibration of wire waveguide. Combination of V-shaped mounting groove, sheath, and rubber dampers increases life expectancy of wire 15 times or more.

  19. Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.

    PubMed

    Gan, C L; Hashim, U

    2013-06-01

    Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the influence of wire type on the wearout reliability performance of Au and PdCu wire used in fine pitch BGA package after HTSL stress at various aging temperatures. Failure analysis has been conducted to identify the failure mechanism after HTSL wearout conditions for Au and PdCu ball bonds. Apparent activation energies (Eaa) of both wire types are investigated after HTSL test at 150 °C, 175 °C and 200 °C aging temperatures. Arrhenius plot has been plotted for each ball bond types and the calculated Eaa of PdCu ball bond is 0.85 eV and 1.10 eV for Au ball bond in 110 nm semiconductor device. Obviously Au ball bond is identified with faster IMC formation rate with IMC Kirkendall voiding while PdCu wire exhibits equivalent wearout and or better wearout reliability margin compare to conventional Au wirebond. Lognormal plots have been established and its mean to failure (t 50 ) have been discussed in this paper.

  20. FE analysis of SMA-based bio-inspired bone-joint system

    NASA Astrophysics Data System (ADS)

    Yang, S.; Seelecke, S.

    2009-10-01

    This paper presents the finite element (FE) analysis of a bio-inspired bone-joint system. Motivated by the BATMAV project, which aims at the development of a micro-air-vehicle platform that implements bat-like flapping flight capabilities, we study the actuation of a typical elbow joint, using shape memory alloy (SMA) in a dual manner. Micro-scale martensitic SMA wires are used as 'metal muscles' to actuate a system of humerus, elbow joint and radius, in concert with austenitic wires, which operate as flexible joints due to their superelastic character. For the FE analysis, the humerus and radius are modeled as standard elastic beams, while the elbow joint and muscle wires use the Achenbach-Muller-Seelecke SMA model as beams and cable elements, respectively. The particular focus of the paper is on the implementation of the above SMA model in COMSOL.

  1. Pulse-echo NDT of adhesively bonded joints in automotive assemblies.

    PubMed

    Titov, Sergey A; Maev, Roman Gr; Bogachenkov, Alexey N

    2008-11-01

    A new method for the detection of void-disbonds at the interfaces of adhesively bonded joins is considered. Based on a simple plane wave model, the output waveform is presented as a sum of two responses associated with the reflection of the ultrasonic wave at the first metal-adhesive interface and the second metal-adhesive interface, respectively. The strong response produced by the wave reverberating in the first metal sheet is eliminated through comparison between the pulse-echo signal measured at the area under the test and reference waveform recorded for the bare first metal sheet outside of the joint. The developed decomposition algorithm has been applied to the study of steel and aluminum samples having various adhesive layer thicknesses in a range of 0.1-1mm.

  2. Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding.

    PubMed

    Huang, Yan; Shah, Aashish; Mayer, Michael; Zhou, Norman Y; Persic, John

    2010-01-01

    Microelectronic wire bonding is an essential step in today's microchip production. It is used to weld (bond) microwires to metallized pads of integrated circuits using ultrasound with hundreds of thousands of vibration cycles. Thermosonic ball bonding is the most popular variant of the wire bonding process and frequently investigated using finite element (FE) models that simplify the ultrasonic dynamics of the process with static or quasistatic boundary conditions. In this study, the ultrasonic dynamics of the bonding tool (capillary), made from Al(2)O(3), is included in a FE model. For more accuracy of the FE model, the main material parameters are measured. The density of the capillary was measured to be rho(cap) = 3552 +/- 100 kg/m(3). The elastic modulus of the capillary, E(cap) = 389 +/- 11 GPa, is found by comparing an auxiliary FE model of the free vibrating capillary with measured values. A capillary "nodding effect" is identified and found to be essential when describing the ultrasonic vibration shape. A main FE model builds on these results and adds bonded ball, pad, chip, and die attach components. There is excellent agreement between the main model and the ultrasonic force measured at the interface on a test chip with stress microsensors. Bonded ball and underpad stress results are reported. When adjusted to the same ultrasonic force, a simplified model without ultrasonic dynamics and with an infinitely stiff capillary tip is substantially off target by -40% for the maximum underpad stress. The compliance of the capillary causes a substantial inclination effect at the bonding interface between wire and pad. This oscillating inclination effect massively influences the stress fields under the pad and is studied in more detail. For more accurate results, it is therefore recommended to include ultrasonic dynamics of the bonding tool in mechanical FE models of wire bonding.

  3. Microstructure of arc brazed and diffusion bonded joints of stainless steel and SiC reinforced aluminum matrix composite

    NASA Astrophysics Data System (ADS)

    Elßner, M.; Weis, S.; Grund, T.; Wagner, G.; Habisch, S.; Mayr, P.

    2016-03-01

    Joint interfaces of aluminum and stainless steel often exhibit intermetallics of Al-Fe, which limit the joint strength. In order to reduce these brittle phases in joints of aluminum matrix composites (AMC) and stainless steel, diffusion bonding and arc brazing are used. Due to the absence of a liquid phase, diffusion welding can reduce the formation of these critical in- termetallics. For this joining technique, the influence of surface treatments and adjusted time- temperature-surface-pressure-regimes is investigated. On the other hand, arc brazing offers the advantage to combine a localized heat input with the application of a low melting filler and was conducted using the system Al-Ag-Cu. Results of the joining tests using both approaches are described and discussed with regard to the microstructure of the joints and the interfaces.

  4. Analytical and experimental study of the vibration of bonded beams with a lap joint

    NASA Technical Reports Server (NTRS)

    Rao, M. D.; Crocker, M. J.

    1990-01-01

    A theoretical model to study the flexural vibration of a bonded lap joint system is described in this paper. First, equations of motion at the joint region are derived using a differential element approach. The transverse displacements of the upper and lower beam are considered to be different. The adhesive is assumed to be linearly viscoelastic and the widely used Kelvin-Voight model is used to represent the viscoelastic behavior of the adhesive. The shear force at the interface between the adhesive and the beam is obtained from the simple bending motion equations of the two beams. The resulting equations of motion are combined with the equations of transverse vibration of the beams in the unjointed regions. These are later solved as a boundary value problem to obtain the eigenvalues and eigenvectors of the system. The model can be used to predict the natural frequencies, modal damping ratios, and mode shapes of the system for free vibration. Good agreement between numerical and experimental results was obtained for a system of graphite epoxy beams lap-jointed by an epoxy adhesive.

  5. Permanent wire splicing by an explosive joining process

    NASA Technical Reports Server (NTRS)

    Bement, Laurence J. (Inventor); Kushnick, Anne C. (Inventor)

    1991-01-01

    The invention is an apparatus and method for wire splicing using an explosive joining process. The apparatus consists of a prebent, U-shaped strap of metal that slides over prepositioned wires. A standoff means separates the wires from the strap before joining. An adhesive means holds two ribbon explosives in position centered over the U-shaped strap. A detonating means connects to the ribbon explosives. The process involves spreading strands of each wire to be joined into a flat plane. The process then requires alternating each strand in alignment to form a mesh-like arrangement with an overlapped area. The strap slides over the strands of the wires, and the standoff means is positioned between the two surfaces. The detonating means then initiates the ribbon explosives that drive the strap to accomplish a high velocity, angular collision between the mating surfaces. This collision creates surface melts and collision bonding results in electron sharing linkups.

  6. Comparison of fatigue crack growth of riveted and bonded aircraft lap joints made of Aluminium alloy 2024-T3 substrates - A numerical study

    NASA Astrophysics Data System (ADS)

    Pitta, S.; Rojas, J. I.; Crespo, D.

    2017-05-01

    Aircraft lap joints play an important role in minimizing the operational cost of airlines. Hence, airlines pay more attention to these technologies to improve efficiency. Namely, a major time consuming and costly process is maintenance of aircraft between the flights, for instance, to detect early formation of cracks, monitoring crack growth, and fixing the corresponding parts with joints, if necessary. This work is focused on the study of repairs of cracked aluminium alloy (AA) 2024-T3 plates to regain their original strength; particularly, cracked AA 2024-T3 substrate plates repaired with doublers of AA 2024-T3 with two configurations (riveted and with adhesive bonding) are analysed. The fatigue life of the substrate plates with cracks of 1, 2, 5, 10 and 12.7mm is computed using Fracture Analysis 3D (FRANC3D) tool. The stress intensity factors for the repaired AA 2024-T3 plates are computed for different crack lengths and compared using commercial FEA tool ABAQUS. The results for the bonded repairs showed significantly lower stress intensity factors compared with the riveted repairs. This improves the overall fatigue life of the bonded joint.

  7. High-speed receiver based on waveguide germanium photodetector wire-bonded to 90nm SOI CMOS amplifier.

    PubMed

    Pan, Huapu; Assefa, Solomon; Green, William M J; Kuchta, Daniel M; Schow, Clint L; Rylyakov, Alexander V; Lee, Benjamin G; Baks, Christian W; Shank, Steven M; Vlasov, Yurii A

    2012-07-30

    The performance of a receiver based on a CMOS amplifier circuit designed with 90nm ground rules wire-bonded to a waveguide germanium photodetector is characterized at data rates up to 40Gbps. Both chips were fabricated through the IBM Silicon CMOS Integrated Nanophotonics process on specialty photonics-enabled SOI wafers. At the data rate of 28Gbps which is relevant to the new generation of optical interconnects, a sensitivity of -7.3dBm average optical power is demonstrated with 3.4pJ/bit power-efficiency and 0.6UI horizontal eye opening at a bit-error-rate of 10(-12). The receiver operates error-free (bit-error-rate < 10(-12)) up to 40Gbps with optimized power supply settings demonstrating an energy efficiency of 1.4pJ/bit and 4pJ/bit at data rates of 32Gbps and 40Gbps, respectively, with an average optical power of -0.8dBm.

  8. Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications

    NASA Astrophysics Data System (ADS)

    Lee, Byung-Suk; Yoon, Jeong-Won

    2018-01-01

    Cu-Sn solid-liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu6Sn5 and Cu3Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu3Sn SLID-bonded joint was superior to the conventional solder and the Cu6Sn5 SLID-bonded joints.

  9. Percutaneous Kirschner Wire Versus Commercial Implant for Hammertoe Repair: A Cost-Effectiveness Analysis.

    PubMed

    Albright, Rachel H; Waverly, Brett J; Klein, Erin; Weil, Lowell; Weil, Lowell S; Fleischer, Adam E

    Hammertoe deformities are one of the most common foot deformities, affecting up to one third of the general population. Fusion of the joint can be achieved with various devices, with the current focus on percutaneous Kirschner (K)-wire fixation or commercial intramedullary implant devices. The purpose of the present study was to determine whether surgical intervention with percutaneous K-wire fixation versus commercial intramedullary implant is more cost effective for proximal interphalangeal joint arthrodesis in hammertoe surgery. A formal cost-effectiveness analysis using a decision analytic tree model was conducted to investigate the healthcare costs and outcomes associated with either K-wire or commercial intramedullary implant fixation. The outcomes assessed included long-term costs, quality-adjusted life-years (QALYs), and incremental cost per QALY gained. Costs were evaluated from the healthcare system perspective and are expressed in U.S. dollars at a 2017 price base. Our results found that commercial implants were minimally more effective than K-wires but carried significantly higher costs. The total cost for treatment with percutaneous K-wire fixation was $5041 with an effectiveness of 0.82 QALY compared with a commercial implant cost of $6059 with an effectiveness of 0.83 QALY. The incremental cost-effectiveness ratio of commercial implants was $146,667. With an incremental cost-effectiveness ratio of >$50,000, commercial implants failed to justify their proposed benefits to outweigh their cost compared to percutaneous K-wire fixation. In conclusion, percutaneous K-wire fixation would be preferred for arthrodesis of the proximal interphalangeal joint for hammertoes from a healthcare system perspective. Copyright © 2017 The American College of Foot and Ankle Surgeons. Published by Elsevier Inc. All rights reserved.

  10. LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System

    NASA Astrophysics Data System (ADS)

    Tang, Y. K.; Hsu, Y. C.; Lin, E. J.; Hu, Y. J.; Liu, C. Y.

    2016-12-01

    In this study, light emitting diode (LED) chips were die-bonded on a Ag/Cu substrate by a Sn-BixZn-Sn bonding system. A high die-bonding strength is successfully achieved by using a Sn-BixZn-Sn ternary system. At the bonding interface, there is observed a Bi-segregation phenomenon. This Bi-segregation phenomenon solves the problems of the brittle layer-type Bi at the joint interface. Our shear test results show that the bonding interface with Bi-segregation enhances the shear strength of the LED die-bonding joints. The Bi-0.3Zn and Bi-0.5Zn die-bonding cases have the best shear strength among all die-bonding systems. In addition, we investigate the atomic depth profile of the deposited Bi-xZn layer by evaporating Bi-xZn E-gun alloy sources. The initial Zn content of the deposited Bi-Zn alloy layers are much higher than the average Zn content in the deposited Bi-Zn layers.

  11. [Individual indirect bonding technique (IIBT) using set-up model].

    PubMed

    Kyung, H M

    1989-01-01

    There has been much progress in Edgewise Appliance since E.H. Angle. One of the most important procedures in edgewise appliance is correct bracket position. Not only conventional edgewise appliance but also straight wire appliance & lingual appliance cannot be used more effectively unless the bracket position is accurate. Improper bracket positioning may reveal much problems during treatment, especially in finishing state. It may require either rebonding after the removal of the malpositioned bracket or the greater number of arch wire and the more complex wire bending, causing much difficulty in performing effective treatments. This made me invent Individual Indirect Bonding Technique with the use of multi-purpose set-up model in order to determine a correct and objective bracket position according to individual patients. This technique is more accurate than former indirect bonding techniques in bracket positioning, because it decides the bracket position on a set-up model which has produced to have the occlusal relationship the clinician desired. This technique is especially effective in straight wire appliance and lingual appliance in which the correct bracket positioning is indispensible.

  12. Strength and Performance Enhancement of Bonded Joints by Spatial Tailoring of Adhesive Compliance via 3D Printing.

    PubMed

    Kumar, S; Wardle, Brian L; Arif, Muhamad F

    2017-01-11

    Adhesive bonding continues to emerge as a preferred route for joining materials with broad applications including advanced structures, microelectronics, biomedical systems, and consumer goods. Here, we study the mechanics of deformation and failure of tensile-loaded single-lap joints with a compliance-tailored adhesive. Tailoring of the adhesive compliance redistributes stresses and strains to reduce both shear and peel concentrations at the ends of the adhesive that determine failure of the joint. Utilizing 3D printing, the modulus of the adhesive is spatially varied along the bondlength. Experimental strength testing, including optical strain mapping, reveals that the strain redistribution results in a greater than 100% increase in strength and toughness concomitant with a 50% increase in strain-to-break while maintaining joint stiffness. The tailoring demonstrated here is immediately realizable in a broad array of 3D printing applications, and the level of performance enhancement suggests that compliance tailoring of the adhesive is a generalizable route for achieving superior performance of joints in other applications, such as advanced structural composites.

  13. Systems, Apparatuses, and Methods for Using Durable Adhesively Bonded Joints for Sandwich Structures

    NASA Technical Reports Server (NTRS)

    Smeltzer, III, Stanley S. (Inventor); Lundgren, Eric C. (Inventor)

    2014-01-01

    Systems, methods, and apparatus for increasing durability of adhesively bonded joints in a sandwich structure. Such systems, methods, and apparatus includes an first face sheet and an second face sheet as well as an insert structure, the insert structure having a first insert face sheet, a second insert face sheet, and an insert core material. In addition, sandwich core material is arranged between the first face sheet and the second face sheet. A primary bondline may be coupled to the face sheet(s) and the splice. Further, systems, methods, and apparatus of the present disclosure advantageously reduce the load, provide a redundant path, reduce structural fatigue, and/or increase fatigue life.

  14. Deflection load characteristics of laser-welded orthodontic wires.

    PubMed

    Watanabe, Etsuko; Stigall, Garrett; Elshahawy, Waleed; Watanabe, Ikuya

    2012-07-01

    To compare the deflection load characteristics of homogeneous and heterogeneous joints made by laser welding using various types of orthodontic wires. Four kinds of straight orthodontic rectangular wires (0.017 inch × 0.025 inch) were used: stainless-steel (SS), cobalt-chromium-nickel (Co-Cr-Ni), beta-titanium alloy (β-Ti), and nickel-titanium (Ni-Ti). Homogeneous and heterogeneous end-to-end joints (12 mm long each) were made by Nd:YAG laser welding. Two types of welding methods were used: two-point welding and four-point welding. Nonwelded wires were also used as a control. Deflection load (N) was measured by conducting the three-point bending test. The data (n  =  5) were statistically analyzed using analysis of variance/Tukey test (P < .05). The deflection loads for control wires measured were as follows: SS: 21.7 ± 0.8 N; Co-Cr-Ni: 20.0 ± 0.3 N; β-Ti: 13.9 ± 1.3 N; and Ni-Ti: 6.6 ± 0.4 N. All of the homogeneously welded specimens showed lower deflection loads compared to corresponding control wires and exhibited higher deflection loads compared to heterogeneously welded combinations. For homogeneous combinations, Co-Cr-Ni/Co-Cr-Ni showed a significantly (P < .05) higher deflection load than those of the remaining homogeneously welded groups. In heterogeneous combinations, SS/Co-Cr-Ni and β-Ti/Ni-Ti showed higher deflection loads than those of the remaining heterogeneously welded combinations (significantly higher for SS/Co-Cr-Ni). Significance (P < .01) was shown for the interaction between the two factors (materials combination and welding method). However, no significant difference in deflection load was found between four-point and two-point welding in each homogeneous or heterogeneous combination. Heterogeneously laser-welded SS/Co-Cr-Ni and β-Ti/Ni-Ti wires provide a deflection load that is comparable to that of homogeneously welded orthodontic wires.

  15. Kirschner-wire fixation for postburn flexion contracture deformity and consequences on articular surface.

    PubMed

    Sungur, Nezih; Ulusoy, Mustafa Gürhan; Boyacgil, Süreyya; Ortaparmak, Hülya; Akyüz, Mihriban; Ortak, Turgut; Koçer, Uğur; Sensöz, Omer

    2006-02-01

    Kirschner-wire (K-wire) fixation for 3-6 weeks is an approved method for stabilization of the fingers after the release of flexion contracture deformity. On the other hand, articular surface damage in small joints due to pin fixation is still a topic of debate. Reports claiming permanent joint destruction due to this procedure exist in the literature. To clarify this doubt, a prospective study was carried out in 72 patients with flexion contracture of the hand fingers. After the surgical release of the deformity, immobilization of the interphalangeal (IP) and metacarpophalangeal (MCP) joints was carried out with K-wire fixation for 3 weeks. Clinical evaluation of the patients was accomplished with total active motion (TAM), grip, and pinch force measurements, whereas magnetic resonance (MR) and radionuclide imaging were used as radiodiagnostic tools. Mean follow-up period of the patients was 32 months. Satisfactory results were obtained in terms of functional and esthetic aspects. Evaluation of the data derived from the clinical and radiologic measurements revealed no permanent articular surface damage. K-wire fixation was documented to be an invaluable therapeutic approach not only to prevent recurrence of the contracture deformity but also to stabilize the skin graft effectively. This technique was concluded to provide effective immobilization without permanent articular damage.

  16. Influence of Filler Wire Feed Rate in Laser-Arc Hybrid Welding of T-butt Joint in Shipbuilding Steel with Different Optical Setups

    NASA Astrophysics Data System (ADS)

    Unt, Anna; Poutiainen, Ilkka; Salminen, Antti

    In this paper, a study of laser-arc hybrid welding featuring three different process fibres was conducted to build knowledge about process behaviour and discuss potential benefits for improving the weld properties. The welding parameters affect the weld geometry considerably, as an example the increase in welding speed usually decreases the penetration and a larger beam diameter usually widens the weld. The laser hybrid welding system equipped with process fibres with 200, 300 and 600 μm core diameter were used to produce fillet welds. Shipbuilding steel AH36 plates with 8 mm thickness were welded with Hybrid-Laser-Arc-Welding (HLAW) in inversed T configuration, the effects of the filler wire feed rate and the beam positioning distance from the joint plane were investigated. Based on the metallographic cross-sections, the effect of process parameters on the joint geometry was studied. Joints with optimized properties (full penetration, soundness, smooth transition from bead to base material) were produced with 200 μm and 600 μm process fibres, while fiber with 300 μm core diameter produced welds with unacceptable levels of porosity.

  17. Quick-connect threaded attachment joint

    NASA Technical Reports Server (NTRS)

    Lucy, M. H.; Messick, W. R.; Vasquez, P.

    1979-01-01

    Joint is self-aligning and tightens with only sixty-five degrees of rotation for quick connects and disconnects. Made of injection-molded plastics or cast or machined aluminum, joint can carry wires, tubes, liquids, or gases. When two parts of joint are brought together, their shapes align them. Small projections on male section and slots on female section further aid alignment; slight rotation of male form engages projections in slots. At this point, threads engage and male section is rotated until joint is fully engaged.

  18. Correlation between extension-block K-wire insertion angle and postoperative extension loss in mallet finger fracture.

    PubMed

    Lee, S K; Kim, Y H; Moon, K H; Choy, W S

    2018-02-01

    Extension-block pinning represents a simple and reliable surgical technique. Although this procedure is commonly performed successfully, some patients develop postoperative extension loss. To date, the relationship between extension-block Kirschner wire (K-wire) insertion angle and postoperative extension loss in mallet finger fracture remains unclear. We aimed to clarify this relationship and further evaluate how various operative and non-operative factors affect postoperative extension loss after extension-block pinning for mallet finger fracture. A retrospective study was conducted to investigate a relationship between extension block K-wire insertion angle and postoperative extension loss. The inclusion criteria were: (1) a dorsal intra-articular fracture fragment involving 30% of the base of the distal phalanx with or without volar subluxation of the distal phalanx; and (2) <3 weeks delay from the injury without treatment. Extension-block K-wire insertion angle and fixation angle of the distal interphalangeal (DIP) joint were assessed using lateral radiograph at immediate postoperative time. Postoperative extension loss was assessed by using lateral radiograph at latest follow-up. Extension-block K-wire insertion angle was defined as the acute angle between extension block K-wire and longitudinal axis of middle phalangeal head. DIP joint fixation angle was defined as the acute angle between the distal phalanx and middle phalanx longitudinal axes. Seventy-five patients were included. The correlation analysis revealed that extension-block K-wire insertion angle had a negative correlation with postoperative extension loss, whereas fracture size and time to operation had a positive correlation (correlation coefficient for extension block K-wire angle: -0.66, facture size: +0.67, time to operation: +0.60). When stratifying patients in terms of negative and positive fixation angle of the DIP joint, the independent t-test showed that mean postoperative extension

  19. Application of Bionic Design to FRP T-Joints

    NASA Astrophysics Data System (ADS)

    Luo, Guang-Min; Kuo, Chia-Hung

    2017-09-01

    We applied the concepts of bionics to enhance the mechanical strength of fiberglass reinforced plastic T-joints. The failure modes of the designed arthrosis-like and gum-like joints were determined using three-point bending tests and numerical simulations and compared with those of normal T-joints bonded using structural adhesives. In the simulation, we used cohesive elements to simulate the adhesive interface of the structural adhesive. The experimental and simulation results show that the arthrosis-like joint can effectively delay the failure progress and enhance the bonding strength of T-joints, thus confirming that an appropriate bionic design can effectively control the bonding properties of structural adhesives.

  20. Silver flip chip interconnect technology and solid state bonding

    NASA Astrophysics Data System (ADS)

    Sha, Chu-Hsuan

    In this dissertation, fluxless transient liquid phase (TLP) bonding and solid state bonding between thermal expansion mismatch materials have been developed using Ag-In binary systems, pure Au, Ag, and Cu-Ag composite. In contrast to the conventional soldering process, fluxless bonding technique eliminates any corrosion and contamination problems caused by flux. Without flux, it is possible to fabricate high quality joints in large bonding areas where the flux is difficult to clean entirely. High quality joints are crucial to bonding thermal expansion mismatch materials since shear stress develops in the bonded pair. Stress concentration at voids in joints could increases breakage probability. In addition, intermetallic compound (IMC) formation between solder and underbump metallurgy (UBM) is essential for interconnect joint formation in conventional soldering process. However, the interface between IMC and solder is shown to be the weak interface that tends to break first during thermal cycling and drop tests. In our solid state bonding technique, there is no IMC involved in the bonding between Au to Au, Ag and Cu, and Ag and Au. All the reliability issues related to IMC or IMC growth is not our concern. To sum up, ductile bonding media, such as Ag or Au, and proper metallic layered structure are utilized in this research to produce high quality joints. The research starts with developing a low temperature fluxless bonding process using electroplated Ag/In/Ag multilayer structures between Si chip and 304 stainless steel (304SS) substrate. Because the outer thin Ag layer effectively protects inner In layer from oxidation, In layer dissolves Ag layer and joints to Ag layer on the to-be-bonded Si chip when temperature reaches the reflow temperature of 166ºC. Joints consist of mainly Ag-rich Ag-In solid solution and Ag2In. Using this fluxless bonding technique, two 304SS substrates can be bonded together as well. From the high magnification SEM images taken at cross

  1. Structural Properties of Single-Strand Orthodontic Wires from a Proposed Alternative Standard Flexure Test.

    DTIC Science & Technology

    1984-01-01

    structural system the orthodontic appliance consists intraorally of bands or bonded pads and the attached brackets , the arch wires, the ligatures, and any...RD-Ali5B 994 STRUCTURAL PROPERTIES OF SINGLE-STRAND ORTHODONTIC i/i WIRES FROM A PROPOSED__(U) AIR FORCE INST OF TECH WRIGHT-PATTERSON RFB OH M L... Orthodontic Wires From A Proposed Alternative - Standard Flexure Test 6. PERPOMING o1. REPORT NUMBER AUTNOR(e) I. CONTRACT O& GRANT NUMUER(a) Marion L

  2. The role of oxide structure on copper wire to the rubber adhesion

    NASA Astrophysics Data System (ADS)

    Su, Yea-Yang; Shemenski, Robert M.

    2000-07-01

    Most metals have an oxide layer on the surface. However, the structure of the oxide varies with the matrix composition, and depends upon the environmental conditions. A bronze coating, nominal composition of 98.5% Cu and balance of Sn, is applied to steel wire for reinforcing pneumatic tire beads and to provide adhesion to rubber. This work studied the influence of copper oxides on the bronze coating on adhesion during vulcanization. To emphasize the oxide structures, electrolytic tough pitch (ETP) copper wire was used instead of the traditional bronze-coated tire bead wire. Experimental results confirmed the hypothesis that cuprous oxide (Cu 2O) could significantly improve bonding between copper wire and rubber, and demonstrated that the interaction between rubber and oxide layer on wire is an electrochemical reaction.

  3. Loading Analysis of Composite Wind Turbine Blade for Fatigue Life Prediction of Adhesively Bonded Root Joint

    NASA Astrophysics Data System (ADS)

    Salimi-Majd, Davood; Azimzadeh, Vahid; Mohammadi, Bijan

    2015-06-01

    Nowadays wind energy is widely used as a non-polluting cost-effective renewable energy resource. During the lifetime of a composite wind turbine which is about 20 years, the rotor blades are subjected to different cyclic loads such as aerodynamics, centrifugal and gravitational forces. These loading conditions, cause to fatigue failure of the blade at the adhesively bonded root joint, where the highest bending moments will occur and consequently, is the most critical zone of the blade. So it is important to estimate the fatigue life of the root joint. The cohesive zone model is one of the best methods for prediction of initiation and propagation of debonding at the root joint. The advantage of this method is the possibility of modeling the debonding without any requirement to the remeshing. However in order to use this approach, it is necessary to analyze the cyclic loading condition at the root joint. For this purpose after implementing a cohesive interface element in the Ansys finite element software, one blade of a horizontal axis wind turbine with 46 m rotor diameter was modelled in full scale. Then after applying loads on the blade under different condition of the blade in a full rotation, the critical condition of the blade is obtained based on the delamination index and also the load ratio on the root joint in fatigue cycles is calculated. These data are the inputs for fatigue damage growth analysis of the root joint by using CZM approach that will be investigated in future work.

  4. Thermoelectric performance of various benzo-difuran wires

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Péterfalvi, Csaba G.; Grace, Iain; Manrique, Dávid Zs.

    2014-05-07

    Using a first principles approach to electron transport, we calculate the electrical and thermoelectrical transport properties of a series of molecular wires containing benzo-difuran subunits. We demonstrate that the side groups introduce Fano resonances, the energy of which is changing with the electronegativity of selected atoms in it. We also study the relative effect of single, double, or triple bonds along the molecular backbone and find that single bonds yield the highest thermopower, approximately 22 μV/K at room temperature, which is comparable with the highest measured values for single-molecule thermopower reported to date.

  5. A tool for measuring the bending length in thin wires

    NASA Astrophysics Data System (ADS)

    Lorenzini, M.; Cagnoli, G.; Cesarini, E.; Losurdo, G.; Martelli, F.; Piergiovanni, F.; Vetrano, F.; Viceré, A.

    2013-03-01

    Great effort is currently being put into the development and construction of the second generation, advanced gravitational wave detectors, Advanced Virgo and Advanced LIGO. The development of new low thermal noise suspensions of mirrors, based on the experience gained in the previous experiments, is part of this task. Quasi-monolithic suspensions with fused silica wires avoid the problem of rubbing friction introduced by steel cradle arrangements by directly welding the wires to silica blocks bonded to the mirror. Moreover, the mechanical loss level introduced by silica (ϕfs ˜ 10-7 in thin fused silica wires) is by far less than the one associated with steel. The low frequency dynamical behaviour of the suspension can be computed and optimized, provided that the wire bending shape under pendulum motion is known. Due to the production process, fused silica wires are thicker near the two ends (necks), so that analytical bending computations are very complicated. We developed a tool to directly measure the low frequency bending parameters of fused silica wires, and we tested it on the wires produced for the Virgo+ monolithic suspensions. The working principle and a set of test measurements are presented and explained.

  6. A tool for measuring the bending length in thin wires.

    PubMed

    Lorenzini, M; Cagnoli, G; Cesarini, E; Losurdo, G; Martelli, F; Piergiovanni, F; Vetrano, F; Viceré, A

    2013-03-01

    Great effort is currently being put into the development and construction of the second generation, advanced gravitational wave detectors, Advanced Virgo and Advanced LIGO. The development of new low thermal noise suspensions of mirrors, based on the experience gained in the previous experiments, is part of this task. Quasi-monolithic suspensions with fused silica wires avoid the problem of rubbing friction introduced by steel cradle arrangements by directly welding the wires to silica blocks bonded to the mirror. Moreover, the mechanical loss level introduced by silica (φfs ∼ 10(-7) in thin fused silica wires) is by far less than the one associated with steel. The low frequency dynamical behaviour of the suspension can be computed and optimized, provided that the wire bending shape under pendulum motion is known. Due to the production process, fused silica wires are thicker near the two ends (necks), so that analytical bending computations are very complicated. We developed a tool to directly measure the low frequency bending parameters of fused silica wires, and we tested it on the wires produced for the Virgo+ monolithic suspensions. The working principle and a set of test measurements are presented and explained.

  7. 46 CFR 35.35-5 - Electrical bonding-TB/ALL.

    Code of Federal Regulations, 2013 CFR

    2013-10-01

    ... 46 Shipping 1 2013-10-01 2013-10-01 false Electrical bonding-TB/ALL. 35.35-5 Section 35.35-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY TANK VESSELS OPERATIONS Cargo Handling § 35.35-5 Electrical bonding—TB/ALL. The use of a vessel/shore bonding cable or wire is permissible only if...

  8. 46 CFR 35.35-5 - Electrical bonding-TB/ALL.

    Code of Federal Regulations, 2014 CFR

    2014-10-01

    ... 46 Shipping 1 2014-10-01 2014-10-01 false Electrical bonding-TB/ALL. 35.35-5 Section 35.35-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY TANK VESSELS OPERATIONS Cargo Handling § 35.35-5 Electrical bonding—TB/ALL. The use of a vessel/shore bonding cable or wire is permissible only if...

  9. Microstructure and Properties of the Al-27Si/Cu/Al-50Si Joint Brazed by the Partial Transient Liquid Phase Bonding

    NASA Astrophysics Data System (ADS)

    Sun, Qingzhu; Wang, Haibo; Yang, Cheng

    2018-06-01

    Al-27Si and Al-50Si were brazed by using a thin Cu interlayer. The metallurgical bonding without obvious defects is achieved, and a wide brazing seam consisting of fine eutectic structures and coarse Si particles is formed in the Al-27Si/Cu/Al-50Si joint. The deposition of Si element in the liquid phases during solidification results in the formation of the larger Si particles and ultra-small Si particles in the brazing seam. The shear strength of the joint reaches 63 MPa.

  10. Microstructure and Properties of the Al-27Si/Cu/Al-50Si Joint Brazed by the Partial Transient Liquid Phase Bonding

    NASA Astrophysics Data System (ADS)

    Sun, Qingzhu; Wang, Haibo; Yang, Cheng

    2018-04-01

    Al-27Si and Al-50Si were brazed by using a thin Cu interlayer. The metallurgical bonding without obvious defects is achieved, and a wide brazing seam consisting of fine eutectic structures and coarse Si particles is formed in the Al-27Si/Cu/Al-50Si joint. The deposition of Si element in the liquid phases during solidification results in the formation of the larger Si particles and ultra-small Si particles in the brazing seam. The shear strength of the joint reaches 63 MPa.

  11. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, Leonard C.; Karnowsky, Maurice M.; Yost, Frederick G.

    1992-01-01

    Production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about -40.degree. C. and 110.degree. C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  12. Solder extrusion pressure bonding process and bonded products produced thereby

    NASA Astrophysics Data System (ADS)

    Beavis, L. C.; Karnowsky, M. M.; Yost, F. G.

    1990-04-01

    The production of soldered joints are highly reliable and capable of surviving 10,000 thermal cycles between about -40 and 110 C. The process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  13. Hydrothermal corrosion of silicon carbide joints without radiation

    DOE PAGES

    Koyanagi, Takaaki; Katoh, Yutai; Terrani, Kurt A.; ...

    2016-09-28

    In this paper, hydrothermal corrosion of four types of the silicon carbide (SiC) to SiC plate joints were investigated under pressurized water reactor and boiling water reactor relevant chemical conditions without irradiation. The joints were formed by metal diffusion bonding using molybdenum or titanium interlayer, reaction sintering using Ti—Si—C system, and SiC nanopowder sintering. Most of the joints withstood the corrosion tests for five weeks. The recession of the SiC substrates was limited. Based on the recession of the bonding layers, it was concluded that all the joints except for the molybdenum diffusion bond are promising under the reducing environmentsmore » without radiation. Finally, the SiC nanopowder sintered joint was the most corrosion tolerant under the oxidizing environment among the four joints.« less

  14. Stainless hooks to bond lower lingual retainer.

    PubMed

    Durgekar, Sujala G; Nagaraj, K

    2011-01-01

    We introduced a simple and economical technique for precise placement of lower lingual retainers. Two stainless steel hooks made of 0.6mm wire are placed interdentally in the embrasure area between canine and lateral incisor bilaterally to lock the retainer wire in the correct position. Etch, rinse and dry the enamel surfaces with the retainer passively in place, then bond the retainer with light-cured adhesive. Hooks are simple to fabricate and eliminate the need for a transfer tray.

  15. Evaluation of tantalum 316 stainless steel transition joints

    NASA Technical Reports Server (NTRS)

    Stoner, D. R.

    1972-01-01

    Tubular transition joints providing a metallurgically bonded connection between tantalum and 316 stainless steel pipe sections were comparatively evaluated for durability under thermal cycling conditions approximating the operation of a SNAP-8 mercury boiler. Both coextruded and vacuum brazed transition joints of 50mm (2 inch) diameter were tested by thermal cycling 100 times between 730 C and 120 C(1350 F and 250 F) in a high vacuum environment. The twelve evaluated transition joints survived the full test sequence without developing leaks, although liquid penetrant bond line indications eventually developed in all specimens. The brazed transition joints exhibited the best dimensional stability and bond line durability.

  16. Ultrasonic Nondestructive Characterization of Adhesive Bonds

    NASA Technical Reports Server (NTRS)

    Qu, Jianmin

    1999-01-01

    Adhesives and adhesive joints are widely used in various industrial applications to reduce weight and costs, and to increase reliability. For example, advances in aerospace technology have been made possible, in part, through the use of lightweight materials and weight-saving structural designs. Joints, in particular, have been and continue to be areas in which weight can be trimmed from an airframe through the use of novel attachment techniques. In order to save weight over traditional riveted designs, to avoid the introduction of stress concentrations associated with rivet holes, and to take full advantage of advanced composite materials, engineers and designers have been specifying an ever-increasing number of adhesively bonded joints for use on airframes. Nondestructive characterization for quality control and remaining life prediction has been a key enabling technology for the effective use of adhesive joints. Conventional linear ultrasonic techniques generally can only detect flaws (delamination, cracks, voids, etc) in the joint assembly. However, more important to structural reliability is the bond strength. Although strength, in principle, cannot be measured nondestructively, a slight change in material nonlinearity may indicate the onset of failure. Furthermore, microstructural variations due to aging or under-curing may also cause changes in the third order elastic constants, which are related to the ultrasonic nonlinear parameter of the polymer adhesive. It is therefore reasonable to anticipate a correlation between changes in the ultrasonic nonlinear acoustic parameter and the remaining bond strength. It has been observed that higher harmonics of the fundamental frequency are generated when an ultrasonic wave passes through a nonlinear material. It seems that such nonlinearity can be effectively used to characterize bond strength. Several theories have been developed to model this nonlinear effect. Based on a microscopic description of the nonlinear

  17. Solder extrusion pressure bonding process and bonded products produced thereby

    DOEpatents

    Beavis, L.C.; Karnowsky, M.M.; Yost, F.G.

    1992-06-16

    Disclosed is a process for production of soldered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about [minus]40 C and 110 C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.

  18. Capillary flow weld-bonding

    NASA Technical Reports Server (NTRS)

    Vaughan, R. W.; Jones, R. J. (Inventor)

    1976-01-01

    The invention of a weld-bonding technique for titanium plates was described. This involves fastening at least two plates of titanium together using spot-welding and applying a bead of adhesive along the edge of the resistance spot-welded joint which upon heating, flows and fills the separation between the joint components.

  19. A self-diagnostic adhesive for monitoring bonded joints in aerospace structures

    NASA Astrophysics Data System (ADS)

    Zhuang, Yitao; Li, Yu-hung; Kopsaftopoulos, Fotis; Chang, Fu-Kuo

    2016-04-01

    Bondline integrity is still one of the most critical concerns in the design of aircraft structures up to date. Due to the lack of confidence on the integrity of the bondline both during fabrication and service, the industry standards and regulations still require assembling the composite using conventional fasteners. Furthermore, current state-of-the-art non-destructive evaluation (NDE) and structural health monitoring (SHM) techniques are incapable of offering mature solutions on the issue of bondline integrity monitoring. Therefore, the objective of this work is the development of an intelligent adhesive film with integrated micro-sensors for monitoring the integrity of the bondline interface. The proposed method makes use of an electromechanical-impedance (EMI) based method, which is a rapidly evolving approach within the SHM family. Furthermore, an innovative screen-printing technique to fabricate piezoelectric ceramic sensors with minimal thickness has been developed at Stanford. The approach presented in this study is based on the use of (i) micro screen-printed piezoelectric sensors integrated into adhesive leaving a minimal footprint on the material, (ii) numerical and analytical modeling of the EMI spectrum of the adhesive bondline, (iii) novel diagnostic algorithms for monitoring the bondline integrity based on advanced signal processing techniques, and (iv) the experimental assessment via prototype adhesively bonded structures in static (varying loads) and dynamic (fatigue) environments. The proposed method will provide a huge confidence on the use of bonded joints for aerospace structures and lead to a paradigm change in their design by enabling enormous weight savings while maximizing the economic and performance efficiency.

  20. Three-dimensional quantification of pretorqued nickel-titanium wires in edgewise and prescription brackets.

    PubMed

    Mittal, Nitika; Xia, Zeyang; Chen, Jie; Stewart, Kelton T; Liu, Sean Shih-Yao

    2013-05-01

    To quantify the three-dimensional moments and forces produced by pretorqued nickel-titanium (NiTi) rectangular archwires fully engaged in 0.018- and 0.022-inch slots of central incisor and molar edgewise and prescription brackets. Ten identical acrylic dental models with retroclined maxillary incisors were fabricated for bonding with various bracket-wire combinations. Edgewise, Roth, and MBT brackets with 0.018- and 0.022-inch slots were bonded in a simulated 2 × 4 clinical scenario. The left central incisor and molar were sectioned and attached to load cells. Correspondingly sized straight and pretorqued NiTi archwires were ligated to the brackets using 0.010-inch ligatures. Each load cell simultaneously measured three force (Fx, Fy, Fz) and three moment (Mx, My, Mz) components. The faciolingual, mesiodistal, and inciso-occluso/apical axes of the teeth corresponded to the x, y, and z axes of the load cells, respectively. Each wire was removed and retested seven times. Three-way analysis of variance (ANOVA) examined the effects of wire type, wire size, and bracket type on the measured orthodontic load systems. Interactions among the three effects were examined and pair-wise comparisons between significant combinations were performed. The force and moment components on each tooth were quantified according to their local coordinate axes. The three-way ANOVA interaction terms were significant for all force and moment measurements (P < .05), except for Fy (P > .05). The pretorqued wire generates a significantly larger incisor facial crown torquing moment in the MBT prescription compared to Roth, edgewise, and the straight NiTi wire.

  1. Testing of printed circuit board solder joints by optical correlation

    NASA Technical Reports Server (NTRS)

    Espy, P. N.

    1975-01-01

    An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.

  2. Advanced Process Possibilities in Friction Crush Welding of Aluminum, Steel, and Copper by Using an Additional Wire

    NASA Astrophysics Data System (ADS)

    Besler, Florian A.; Grant, Richard J.; Schindele, Paul; Stegmüller, Michael J. R.

    2017-12-01

    Joining sheet metal can be problematic using traditional friction welding techniques. Friction crush welding (FCW) offers a high speed process which requires a simple edge preparation and can be applied to out-of-plane geometries. In this work, an implementation of FCW was employed using an additional wire to weld sheets of EN AW5754 H22, DC01, and Cu-DHP. The joint is formed by bringing together two sheet metal parts, introducing a wire into the weld zone and employing a rotating disk which is subject to an external force. The requirements of the welding preparation and the fundamental process variables are shown. Thermal measurements were taken which give evidence about the maximum temperature in the welding center and the temperature in the periphery of the sheet metals being joined. The high welding speed along with a relatively low heat input results in a minimal distortion of the sheet metal and marginal metallurgical changes in the parent material. In the steel specimens, this FCW implementation produces a fine grain microstructure, enhancing mechanical properties in the region of the weld. Aluminum and copper produced mean bond strengths of 77 and 69 pct to that of the parent material, respectively, whilst the steel demonstrated a strength of 98 pct. Using a wire offers the opportunity to use a higher-alloyed additional material and to precisely adjust the additional material volume appropriate for a given material alignment and thickness.

  3. Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yusoff, Wan Yusmawati Wan, E-mail: yusmawati@upnm.edu.my; Ismail, Roslina, E-mail: roslina.ismail@ukm.my; Jalar, Azman, E-mail: azmn@ukm.my

    2014-07-01

    The effect of gamma radiation on the mechanical and structural properties of gold ball bonds was investigated. Gold wires from thermosonic wire bonding were exposed to gamma rays from a Cobalt-60 source at a low dose (5 Gy). The load–depth curve of nanoindentation for the irradiated gold wire bond has an apparent staircase shape during loading compared to the as-received sample. The hardness of the specimens calculated from the nanoindentation shows an increase in value from 0.91 to 1.09 GPa for specimens after exposure. The reduced elastic modulus for irradiated specimens significantly increased as well, with values from 75.18 tomore » 98.55 GPa. The change in intrinsic properties due to gamma radiation was investigated using dual-focused ion beam and high-resolution transmission electron microscope analysis. The dual-focused ion beam and high-resolution transmission electron microscope images confirmed the changes in grain structure and the presence of dislocations. The scanning electron microscope micrographs of focused ion beam cross sections showed that the grain structure of the gold became elongated and smaller after exposure to gamma rays. Meanwhile, high-resolution transmission electron microscopy provided evidence that gamma radiation induced dislocation of the atomic arrangement. - Highlights: • Nanoindentation technique provides a detailed characterisation of Au ball bond. • P–h curve of irradiated Au ball bond shows an apparent pop-in event. • Hardness and reduced modulus increased after exposure. • Elongated and smaller grain structure in irradiated specimens • Prevalent presence of dislocations in the atomic arrangement.« less

  4. In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens.

    PubMed

    Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

    2015-03-23

    Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain.

  5. In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens

    PubMed Central

    Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

    2015-01-01

    Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain. PMID:25572920

  6. Measurement of longitudinal strain and estimation of peel stress in adhesive-bonded single-lap joint of CFRP adherend using embedded FBG sensor

    NASA Astrophysics Data System (ADS)

    Ning, X.; Murayama, H.; Kageyama, K.; Uzawa, K.; Wada, D.

    2012-04-01

    In this research, longitudinal strain and peel stress in adhesive-bonded single-lap joint of carbon fiber reinforced plastics (CFRP) were measured and estimated by embedded fiber Bragg grating (FBG) sensor. Two unidirectional CFRP substrates were bonded by epoxy to form a single-lap configuration. The distributed strain measurement system is used. It is based on optical frequency domain reflectometry (OFDR), which can provide measurement at an arbitrary position along FBG sensors with the high spatial resolution. The longitudinal strain was measured based on Bragg grating effect and the peel stress was estimated based on birefringence effect. Special manufacturing procedure was developed to ensure the embedded location of FBG sensor. A portion of the FBG sensor was embedded into one of CFRP adherends along fiber direction and another portion was kept free for temperature compensation. Photomicrograph of cross-section of specimen was taken to verify the sensor was embedded into proper location after adherend curing. The residual strain was monitored during specimen curing and adhesive joint bonding process. Tensile tests were carried out and longitudinal strain and peel stress of the bondline are measured and estimated by the embedded FBG sensor. A two-dimensional geometrically nonlinear finite element analysis was performed by ANSYS to evaluate the measurement precision.

  7. Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies

    NASA Astrophysics Data System (ADS)

    Nousiainen, O.; Putaala, J.; Kangasvieri, T.; Rautioaho, R.; Vähäkangas, J.

    2007-03-01

    The thermal fatigue endurance of completely lead-free 95.5Sn4Ag0.7Cu/plastic core solder ball (PCSB) composite joint structures in low-temperature Co-fired ceramic/printed wiring board (LTCC/PWB) assemblies was investigated using thermal cycling tests over the temperature ranges of -40°C 125°C and 0°C 100°C. Two separate creep/fatigue failures initiated and propagated in the joints during the tests: (1) a crack along the intermetallic compound (IMC)/solder interface on the LTCC side of the joint, which formed at the high-temperature extremes; and (2) a crack in the solder near the LTCC solder land, which formed at the low-temperature extremes. Moreover, localized recrystallization was detected at the outer edge of the joints that were tested in the harsh (-40°C 125°C) test conditions. The failure mechanism was creep/fatigue-induced mixed intergranular and transgranular cracking in the recrystallized zone, but it was dominated by transgranular thermal fatigue failure beyond the recrystallized zone. The change in the failure mechanism increased the rate of crack growth. When the lower temperature extreme was raised from -40°C to 0°C, no recrystallized zone was detected and the failure was due to intergranular cracks.

  8. Numerical Simulation of Transient Liquid Phase Bonding under Temperature Gradient

    NASA Astrophysics Data System (ADS)

    Ghobadi Bigvand, Arian

    Transient Liquid Phase bonding under Temperature Gradient (TG-TLP bonding) is a relatively new process of TLP diffusion bonding family for joining difficult-to-weld aerospace materials. Earlier studies have suggested that in contrast to the conventional TLP bonding process, liquid state diffusion drives joint solidification in TG-TLP bonding process. In the present work, a mass conservative numerical model that considers asymmetry in joint solidification is developed using finite element method to properly study the TG-TLP bonding process. The numerical results, which are experimentally verified, show that unlike what has been previously reported, solid state diffusion plays a major role in controlling the solidification behavior during TG-TLP bonding process. The newly developed model provides a vital tool for further elucidation of the TG-TLP bonding process.

  9. Lightning Protection and Structural Bonding for the B2 Test Stand

    NASA Technical Reports Server (NTRS)

    Kinard, Brandon

    2015-01-01

    With the privatization of the space industry, NASA has entered a new era. To explore deeper parts of the solar system, NASA is developing a new spacecraft, the Space Launch System (SLS), capable of reaching these destinations, such as an asteroid or Mars. However, the test stand that is capable of testing the stage has been unused for many years. In addition to the updating/repair of the stand, more steel is being added to fully support the SLS. With all these modifications, the lightning protection system must be brought up to code to assure the protection of all personnel and assets. Structural bonding is a part of the lightning protection system. The focus of this project was to assure proper structural bonding. To begin, all relevant technical standards and the construction specifications were reviewed. This included both the specifications for the lightning protection and for general construction. The drawings were reviewed as well. From the drawings, bolted structural joints were reviewed to determine whether bonding was necessary. Several bolted joints were determined to need bonding according to the notes in the drawings. This exceeds the industry standards. The bolted joints are an electrically continuous joint. During tests, the stand experiences heavy vibration that may weaken the continuity of the bolted joint. Therefore, the secondary bonding is implemented to ensure that the structural joint has low resistance. If the structural joint has a high resistance because of corrosion, a potential gradient can occur that can cause a side flash. Damage, injury, or death can occur from a side flash so they are to be prevented. A list of the identified structural joints was compiled and sent to the contractor to be bonded. That covers the scope of this project.

  10. The Quantum Socket: Wiring for Superconducting Qubits - Part 2

    NASA Astrophysics Data System (ADS)

    Bejanin, J. H.; McConkey, T. G.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

    Quantum computing research has reached a level of maturity where quantum error correction (QEC) codes can be executed on linear arrays of superconducting quantum bits (qubits). A truly scalable quantum computing architecture, however, based on practical QEC algorithms, requires nearest neighbor interaction between qubits on a two-dimensional array. Such an arrangement is not possible with techniques that rely on wire bonding. To address this issue, we have developed the quantum socket, a device based on three-dimensional wires that enables the control of superconducting qubits on a two-dimensional grid. In this talk, we present experimental results characterizing this type of wiring. We will show that the quantum socket performs exceptionally well for the transmission and reflection of microwave signals up to 10 GHz, while minimizing crosstalk between adjacent wires. Under realistic conditions, we measured an S21 of -5 dB at 6 GHz and an average crosstalk of -60 dB. We also describe time domain reflectometry results and arbitrary pulse transmission tests, showing that the quantum socket can be used to control superconducting qubits.

  11. Evaluation of shear bond strength of porcelain bonded to laser welded titanium surface and determination of mode of bond failure.

    PubMed

    Patil, Narendra P; Dandekar, Minal; Nadiger, Ramesh K; Guttal, Satyabodh S

    2010-09-01

    The aim of this study was to evaluate the shear bond strength of porcelain to laser welded titanium surface and to determine the mode of bond failure through scanning electron microscopy (SEM) and energy dispersive spectrophotometry (EDS). Forty five cast rectangular titanium specimens with the dimension of 10 mm x 8 mm x 1 mm were tested. Thirty specimens had a perforation of 2 mm diameter in the centre. These were randomly divided into Group A and B. The perforations in the Group B specimens were repaired by laser welding using Cp Grade II titanium wire. The remaining 15 specimens were taken as control group. All the test specimens were layered with low fusing porcelain and tested for shear bond strength. The debonded specimens were subjected to SEM and EDS. Data were analysed with 1-way analysis of variance and Student's t-test for comparison among the different groups. One-way analysis of variance (ANOVA) showed no statistically significant difference in shear bond strength values at a 5% level of confidence. The mean shear bond strength values for control group, Group A and B was 8.4 +/- 0.5 Mpa, 8.1 +/- 0.4 Mpa and 8.3 +/- 0.3 Mpa respectively. SEM/EDS analysis of the specimens showed mixed and cohesive type of bond failure. Within the limitations of the study laser welding did not have any effect on the shear bond strength of porcelain bonded to titanium.

  12. The defects and microstructure in the fusion zone of multipass laser welded joints with Inconel 52M filler wire for nuclear power plants

    NASA Astrophysics Data System (ADS)

    Li, Gang; Lu, Xiaofeng; Zhu, Xiaolei; Huang, Jian; Liu, Luwei; Wu, Yixiong

    2017-09-01

    The defects and microstructure in the fusion zone of multipass laser welded joints with Inconel 52M filler wire are investigated for nuclear power plants. Experimental results indicate that the incomplete fusion forms as the deposited metals do not completely cover the groove during multipass laser welding. The dendritic morphologies are observed on the inner surface of the porosity in the fusion zone. Many small cellular are found in the zones near the fusion boundary. With solidification preceding, cellular gradually turn into columnar dendrites and symmetrical columnar dendrites are exhibited in the weld center of the fusion zone. The fine equiaxed grains form and columnar dendrites disappear in the remelted zone of two passes. The dendrite arm spacing in the fusion zone becomes widened with increasing welding heat input. Nb-rich carbides/carbonitrides are preferentially precipitated in the fusion zone of multipass laser welded joints. In respect to high cooling rate during multipass laser welding, element segregation could be insufficient to achieve the component of Laves phase.

  13. Raman spectroscopy as a tool to investigate the structure and electronic properties of carbon-atom wires

    PubMed Central

    Milani, Alberto; Tommasini, Matteo; Russo, Valeria; Li Bassi, Andrea; Lucotti, Andrea; Cataldo, Franco

    2015-01-01

    Summary Graphene, nanotubes and other carbon nanostructures have shown potential as candidates for advanced technological applications due to the different coordination of carbon atoms and to the possibility of π-conjugation. In this context, atomic-scale wires comprised of sp-hybridized carbon atoms represent ideal 1D systems to potentially downscale devices to the atomic level. Carbon-atom wires (CAWs) can be arranged in two possible structures: a sequence of double bonds (cumulenes), resulting in a 1D metal, or an alternating sequence of single–triple bonds (polyynes), expected to show semiconducting properties. The electronic and optical properties of CAWs can be finely tuned by controlling the wire length (i.e., the number of carbon atoms) and the type of termination (e.g., atom, molecular group or nanostructure). Although linear, sp-hybridized carbon systems are still considered elusive and unstable materials, a number of nanostructures consisting of sp-carbon wires have been produced and characterized to date. In this short review, we present the main CAW synthesis techniques and stabilization strategies and we discuss the current status of the understanding of their structural, electronic and vibrational properties with particular attention to how these properties are related to one another. We focus on the use of vibrational spectroscopy to provide information on the structural and electronic properties of the system (e.g., determination of wire length). Moreover, by employing Raman spectroscopy and surface enhanced Raman scattering in combination with the support of first principles calculations, we show that a detailed understanding of the charge transfer between CAWs and metal nanoparticles may open the possibility to tune the electronic structure from alternating to equalized bonds. PMID:25821689

  14. [Application of straight wire appliance for pre- and post-surgical orthodontics].

    PubMed

    Zhou, Yan-Heng; Sun, Yan-Nan; Hu, Wei; Fu, Min-Kui

    2004-11-01

    To analyze the surgical patients treated with straight wire appliance for guidelines of clinical using of the appliance. Totally 51 patients from Joint Clinic of Orthodontic Surgery, Peking University School of Stomatology with dentofacial deformities treated with straight wire appliance were analyzed. The patients were aged from 15 years to 34 years 5 months, average 18 years 9 months. Among whom, 16 are males, while the other 35 are females. Eighteen patients were treated with extraction of teeth, while other 33 cases were nonextraction case. The duration of average presurgical orthodontic treatment was 13.3 months, and 10.4 months was for postsurgical orthodontic treatment, totally active treatment time was 25.5 months. Straight wire appliance would benefit a lot for three dimensional control of teeth when doing pre- and post-surgical orthodontic treatment. Good results could be achieved without wire bending.

  15. The effects of silver coating on friction coefficient and shear bond strength of steel orthodontic brackets.

    PubMed

    Arash, Valiollah; Anoush, Keivan; Rabiee, Sayed Mahmood; Rahmatei, Manuchehr; Tavanafar, Saeid

    2015-01-01

    Aims of the present study was to measure frictional resistance between silver coated brackets and different types of arch wires, and shear bond strength of these brackets to the tooth. In an experimental clinical research 28 orthodontic brackets (standard, 22 slots) were coated with silver ions using electroplate method. Six brackets (coated: 3, uncoated: 3) were evaluated with Scanning Electron Microscopy and Atomic Force Microscopy. The amount of friction in 15 coated brackets was measured with three different kinds of arch wires (0.019 × 0.025-in stainless steel [SS], 0.018-in stainless steel [SS], 0.018-in Nickel-Titanium [Ni-Ti]) and compared with 15 uncoated steel brackets. In addition, shear bond strength values were compared between 10 brackets with silver coating and 10 regular brackets. Universal testing machine was used to measure shear bond strength and the amount of friction between the wires and brackets. SPSS 18 was used for data analysis with t-test. SEM and AFM results showed deposition of a uniform layer of silver, measuring 8-10 μm in thickness on bracket surfaces. Silver coating led to higher frictional forces in all the three types of arch wires, which was statistically significant in 0.019 × 0.025-in SS and 0.018-in Ni-Ti, but it did not change the shear bond strength significantly. Silver coating with electroplating method did not affect the bond strength of the bracket to enamel; in addition, it was not an effective method for decreasing friction in sliding mechanics. © Wiley Periodicals, Inc.

  16. Geometrically nonlinear analysis of adhesively bonded joints

    NASA Technical Reports Server (NTRS)

    Dattaguru, B.; Everett, R. A., Jr.; Whitcomb, J. D.; Johnson, W. S.

    1982-01-01

    A geometrically nonlinear finite element analysis of cohesive failure in typical joints is presented. Cracked-lap-shear joints were chosen for analysis. Results obtained from linear and nonlinear analysis show that nonlinear effects, due to large rotations, significantly affect the calculated mode 1, crack opening, and mode 2, inplane shear, strain-energy-release rates. The ratio of the mode 1 to mode 2 strain-energy-relase rates (G1/G2) was found to be strongly affected by he adhesive modulus and the adherend thickness. The ratios between 0.2 and 0.8 can be obtained by varying adherend thickness and using either a single or double cracked-lap-shear specimen configuration. Debond growth rate data, together with the analysis, indicate that mode 1 strain-energy-release rate governs debond growth. Results from the present analysis agree well with experimentally measured joint opening displacements.

  17. Adhesive-Bonded Composite Joint Analysis with Delaminated Surface Ply Using Strain-Energy Release Rate

    NASA Technical Reports Server (NTRS)

    Chadegani, Alireza; Yang, Chihdar; Smeltzer, Stanley S. III

    2012-01-01

    This paper presents an analytical model to determine the strain energy release rate due to an interlaminar crack of the surface ply in adhesively bonded composite joints subjected to axial tension. Single-lap shear-joint standard test specimen geometry with thick bondline is followed for model development. The field equations are formulated by using the first-order shear-deformation theory in laminated plates together with kinematics relations and force equilibrium conditions. The stress distributions for the adherends and adhesive are determined after the appropriate boundary and loading conditions are applied and the equations for the field displacements are solved. The system of second-order differential equations is solved to using the symbolic computation tool Maple 9.52 to provide displacements fields. The equivalent forces at the tip of the prescribed interlaminar crack are obtained based on interlaminar stress distributions. The strain energy release rate of the crack is then determined by using the crack closure method. Finite element analyses using the J integral as well as the crack closure method are performed to verify the developed analytical model. It has been shown that the results using the analytical method correlate well with the results from the finite element analyses. An attempt is made to predict the failure loads of the joints based on limited test data from the literature. The effectiveness of the inclusion of bondline thickness is justified when compared with the results obtained from the previous model in which a thin bondline and uniform adhesive stresses through the bondline thickness are assumed.

  18. Ultrasonically bonded value assembly

    NASA Technical Reports Server (NTRS)

    Salvinski, R. J. (Inventor)

    1975-01-01

    A valve apparatus capable of maintaining a fluid-tight seal over a relatively long period of time by releasably bonding a valve member to its seat is described. The valve member is bonded or welded to the seat and then released by the application of the same energy to the bond joint. The valve member is held in place during the bonding by a clamping device. An appropriate force device can activate the opening and closing of the valve member. Various combinations of material for the valve member and valve seat can be utilized to provide an adequate sealing bond. Aluminum oxide, stainless steel, inconel, tungsten carbide as hard materials and copper, aluminum, titanium, silver, and gold as soft materials are suggested.

  19. Dissimilar metals joint evaluation

    NASA Technical Reports Server (NTRS)

    Wakefield, M. E.; Apodaca, L. E.

    1974-01-01

    Dissimilar metals tubular joints between 2219-T851 aluminum alloy and 304L stainless steel were fabricated and tested to evaluate bonding processes. Joints were fabricated by four processes: (1) inertia (friction) weldings, where the metals are spun and forced together to create the weld; (2) explosive welding, where the metals are impacted together at high velocity; (3) co-extrusion, where the metals are extruded in contact at high temperature to promote diffusion; and (4) swaging, where residual stresses in the metals after a stretching operation maintain forced contact in mutual shear areas. Fifteen joints of each type were prepared and evaluated in a 6.35 cm (2.50 in.) O.D. size, with 0.32 cm (0.13 in.) wall thickness, and 7.6 cm (3.0 in) total length. The joints were tested to evaluate their ability to withstand pressure cycle, thermal cycle, galvanic corrosion and burst tests. Leakage tests and other non-destructive test techniques were used to evaluate the behavior of the joints, and the microstructure of the bond areas was analyzed.

  20. Influence of the bond-slip relationship on the flexural capacity of R.C. joints damaged by corrosion

    NASA Astrophysics Data System (ADS)

    Imperatore, Stefania

    2016-06-01

    In moderate and aggressive environmental condition, old reinforced concrete structures are often subjected to corrosive phenomena. Corrosion causes cracking, loss of diameter in reinforcement and variation of the bond behavior between steel and concrete. Then, in presence of cyclic actions like the seismic ones, old R.C. elements vary their ultimate drift, ductility, plastic rotation capacity and energy dissipation with the corrosion level. The problem is of current interest: the issue has been introduced in some paragraph of the Model Code 2010 and a committee is now drafting a new document on assessment strategies on existing concrete structures also damaged by corrosion. In this work, a first step on the analysis of the impact of the corrosion on the seismic behavior of R.C. elements is assessed: by mean FEM analyses, of a poor detailed column/foundation joint is analyzed in a parametric way in order to evaluate the influence of the bond-slip degradation by corrosion on the element flexural capacity.

  1. BAE Systems Radiation Hardened SpaceWire ASIC and Roadmap

    NASA Technical Reports Server (NTRS)

    Berger, Richard; Milliser, Myrna; Kapcio, Paul; Stanley, Dan; Moser, David; Koehler, Jennifer; Rakow, Glenn; Schnurr, Richard

    2006-01-01

    An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS, technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASlC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a 4-port SpaceWire router with two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, -and a memory controller for additional external memory use. The SpaceWire ASlC is planned for use on both the Geostationary Operational Environmental Satellites (GOES)-R and the Lunar Reconnaissance Orbiter (LRO). Engineering parts have already been delivered to both programs. This paper discusses the SpaceWire protocol and those elements of it that have been built into the current SpaceWire reusable core. There are features within the core that go beyond the current standard that can be enabled or disabled by the user and these will be described. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be discussed. Optional configurations within user systems will be shown. The physical imp!ementation of the design will be described and test results from the hardware will be discussed. Finally, the BAE Systems roadmap for SpaceWire developments will be discussed, including some products already in design as well as longer term plans.

  2. Diffusion Bonding of Silicon Carbide Ceramics using Titanium Interlayers

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, James D.

    2006-01-01

    Robust joining approaches for silicon carbide ceramics are critically needed to fabricate leak free joints with high temperature mechanical capability. In this study, titanium foils and physical vapor deposited (PVD) titanium coatings were used to form diffusion bonds between SiC ceramics using hot pressing. Silicon carbide substrate materials used for bonding include sintered SiC and two types of CVD SiC. Microscopy results show the formation of well adhered diffusion bonds. The bond strengths as determined from pull tests are on the order of several ksi, which is much higher than required for a proposed application. Microprobe results show the distribution of silicon, carbon, titanium, and other minor elements across the diffusion bond. Compositions of several phases formed in the joint region were identified. Potential issues of material compatibility and optimal bond formation will also be discussed.

  3. G. N. Lewis and the Chemical Bond.

    ERIC Educational Resources Information Center

    Pauling, Linus

    1984-01-01

    Discusses the contributions of G. N. Lewis to chemistry, focusing on his formulation of the basic principle of the chemical bond--the idea that the chemical bond consists of a pair of electrons held jointly by two atoms. (JN)

  4. Dynamic breaking of a single gold bond

    NASA Astrophysics Data System (ADS)

    Pobelov, Ilya V.; Lauritzen, Kasper Primdal; Yoshida, Koji; Jensen, Anders; Mészáros, Gábor; Jacobsen, Karsten W.; Strange, Mikkel; Wandlowski, Thomas; Solomon, Gemma C.

    2017-07-01

    While one might assume that the force to break a chemical bond gives a measure of the bond strength, this intuition is misleading. If the force is loaded slowly, thermal fluctuations may break the bond before it is maximally stretched, and the breaking force will be less than the bond can sustain. Conversely, if the force is loaded rapidly it is more likely that the maximum breaking force is measured. Paradoxically, no clear differences in breaking force were observed in experiments on gold nanowires, despite being conducted under very different conditions. Here we explore the breaking behaviour of a single Au-Au bond and show that the breaking force is dependent on the loading rate. We probe the temperature and structural dependencies of breaking and suggest that the paradox can be explained by fast breaking of atomic wires and slow breaking of point contacts giving very similar breaking forces.

  5. Nondestructive Evaluation of Adhesive Bond Quality: State of the Art Review

    DTIC Science & Technology

    1989-06-01

    conducted using a and Harnik (6) developed a quantitative medium-focused, 1/4-inch diameter, 10-MHz method of testing adhesive bonded joints transducer...Couchman." Spectral Analysis Tech- E. Harnik . "The Testing of Adhesive- nique of Ultrasonic NDT of Advanced Bonded Joints by a Very High Resolu

  6. Wood Bond Testing

    NASA Technical Reports Server (NTRS)

    1989-01-01

    A joint development program between Hartford Steam Boiler Inspection Technologies and The Weyerhaeuser Company resulted in an internal bond analyzer (IBA), a device which combines ultrasonics with acoustic emission testing techniques. It is actually a spinoff from a spinoff, stemming from a NASA Lewis invented acousto-ultrasonic technique that became a system for testing bond strength of composite materials. Hartford's parent company, Acoustic Emission Technology Corporation (AET) refined and commercialized the technology. The IBA builds on the original system and incorporates on-line process control systems. The IBA determines bond strength by measuring changes in pulsar ultrasonic waves injected into a board. Analysis of the wave determines the average internal bond strength for the panel. Results are displayed immediately. Using the system, a mill operator can adjust resin/wood proportion, reduce setup time and waste, produce internal bonds of a consistent quality and automatically mark deficient products.

  7. Adaptive Shape Functions and Internal Mesh Adaptation for Modelling Progressive Failure in Adhesively Bonded Joints

    NASA Technical Reports Server (NTRS)

    Stapleton, Scott; Gries, Thomas; Waas, Anthony M.; Pineda, Evan J.

    2014-01-01

    Enhanced finite elements are elements with an embedded analytical solution that can capture detailed local fields, enabling more efficient, mesh independent finite element analysis. The shape functions are determined based on the analytical model rather than prescribed. This method was applied to adhesively bonded joints to model joint behavior with one element through the thickness. This study demonstrates two methods of maintaining the fidelity of such elements during adhesive non-linearity and cracking without increasing the mesh needed for an accurate solution. The first method uses adaptive shape functions, where the shape functions are recalculated at each load step based on the softening of the adhesive. The second method is internal mesh adaption, where cracking of the adhesive within an element is captured by further discretizing the element internally to represent the partially cracked geometry. By keeping mesh adaptations within an element, a finer mesh can be used during the analysis without affecting the global finite element model mesh. Examples are shown which highlight when each method is most effective in reducing the number of elements needed to capture adhesive nonlinearity and cracking. These methods are validated against analogous finite element models utilizing cohesive zone elements.

  8. Effect of High Temperature Storage in Vacuum, Air, and Humid Conditions on Degradation of Gold/Aluminum Wire Bonds in PEMs

    NASA Technical Reports Server (NTRS)

    Teverovsky, Alexander

    2006-01-01

    Microcircuits encapsulated in three plastic package styles were stored in different environments at temperatures varying from 130 C to 225 C for up to 4,000 hours in some cases. To assess the effect of oxygen, the parts were aged at high temperatures in air and in vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. High temperature storage testing of decapsulated microcircuits in air, vacuum, and HAST chambers was carried out to evaluate the role of molding compounds in the environmentally-induced degradation and failure of wire bonds (WB). This paper reports on accelerating factors of environment and molding compound on WB failures. It has been shown that all environments, including oxygen, moisture, and the presence of molding compounds reduce time-to-failures compared to unencapsulated devices in vacuum conditions. The mechanism of the environmental effect on KB degradation is discussed.

  9. The Quantum Socket: Wiring for Superconducting Qubits - Part 1

    NASA Astrophysics Data System (ADS)

    McConkey, T. G.; Bejanin, J. H.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

    Quantum systems with ten superconducting quantum bits (qubits) have been realized, making it possible to show basic quantum error correction (QEC) algorithms. However, a truly scalable architecture has not been developed yet. QEC requires a two-dimensional array of qubits, restricting any interconnection to external classical systems to the third axis. In this talk, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket employs three-dimensional wires and makes it possible to connect classical electronics with quantum circuits more densely and accurately than methods based on wire bonding. The three-dimensional wires are based on spring-loaded pins engineered to insure compatibility with quantum computing applications. Extensive design work and machining was required, with focus on material quality to prevent magnetic impurities. Microwave simulations were undertaken to optimize the design, focusing on the interface between the micro-connector and an on-chip coplanar waveguide pad. Simulations revealed good performance from DC to 10 GHz and were later confirmed against experimental measurements.

  10. Precision wire feeder for small diameter wire

    DOEpatents

    Brandon, Eldon D.; Hooper, Frederick M.; Reichenbach, Marvin L.

    1992-01-01

    A device for feeding small diameter wire having a diameter less than 0.04 mm (16 mil) to a welding station includes a driving wheel for controllably applying a non-deforming driving force to the wire to move the free end of the wire towards the welding station; and a tension device such as a torque motor for constantly applying a reverse force to the wire in opposition to the driving force to keep the wire taut.

  11. Precision wire feeder for small diameter wire

    DOEpatents

    Brandon, E.D.; Hooper, F.M.; Reichenbach, M.L.

    1992-08-11

    A device for feeding small diameter wire having a diameter less than 0.04 mm (16 mil) to a welding station includes a driving wheel for controllably applying a non-deforming driving force to the wire to move the free end of the wire towards the welding station; and a tension device such as a torque motor for constantly applying a reverse force to the wire in opposition to the driving force to keep the wire taut. 1 figure.

  12. Intraspinal migration of a Kirschner wire as a late complication of acromioclavicular joint repair: a case report.

    PubMed

    Mankowski, Bartosz; Polchlopek, Tadeusz; Strojny, Marcin; Grala, Pawel; Slowinski, Krzysztof

    2016-03-24

    Penetrating neck trauma involving foreign bodies is a rare event in European countries. Due to its relatively high mortality rate, the correct management strategy must be initiated from the beginning to prevent fatal complications. In the medical literature, there are only a few cases describing foreign bodies penetrating the cervical spine. Because of its rareness, many trauma centers lack the proper routine to adequately manage such injuries. This case report describes a 34-year-old white man of Central European descent with Kirschner wire migration and perforation of his vertebral foramen. He underwent acromioclavicular joint repair surgery 7 years ago, presented with a painful sensation around the area of his left clavicle and left side of his neck after a motorcycle accident. No neurological deficit was detected. In such cases, a thorough radiological evaluation of the spinal cord and the surrounding vasculature is mandatory for a complete understanding of the extent of the injury and determining the proper surgical management. In cases of vertebral artery trauma both an endovascular and an open approach can be contemplated.

  13. Transition joints between Zircaloy-2 and stainless steel by diffusion bonding

    NASA Astrophysics Data System (ADS)

    Bhanumurthy, K.; Krishnan, J.; Kale, G. B.; Banerjee, S.

    1994-11-01

    The diffusion bonding between Zircaloy-2 and stainless steel (AISI 304L) using niobium, nickel and copper as intermediate layers has been investigated in the temperature range of 750 to 900°C. Bonding was carried out in a vacuum hot press, under compressive loading. Electron probe microanalysis and metallographic analysis showed a good metallurgical compatibility and also indicated the absence of discontunities, micropores and intermetallic compounds at various interfaces. The bond strength of the diffusion bonded assembly was found to be about 400 MPa for the couples bonded at 870°C for 2 h. The dimple structure on the fractured surface is indicative of the ductile mode of failure of the bonded assembly.

  14. 30 CFR 77.1802 - Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley...

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley wires and trolley feeder wires. 77.1802 Section 77.1802... Wires and Trolley Feeder Wires § 77.1802 Insulation of trolley wires, trolley feeder wires and bare...

  15. 30 CFR 77.1802 - Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley...

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley wires and trolley feeder wires. 77.1802 Section 77.1802... Wires and Trolley Feeder Wires § 77.1802 Insulation of trolley wires, trolley feeder wires and bare...

  16. Bonding Strength Properties of Adhesively-Timber Joint with Thixotropic and Room Temperature Cured Epoxy Based Adhesive Reinforced with Nano- and Micro-particles

    NASA Astrophysics Data System (ADS)

    Ahmad, Z.; Ansell, M. P.; Smedley, D.

    2011-02-01

    This research work is concerned with in situ bonded-in timber connection using pultruded rod; where the manufacturing of such joint requires adhesive which can produce thick glue-lines and does not allow any use of pressure and heat. Four types of thixotropic (for ease application) and room temperature cured epoxy based were used namely CB10TSS (regarded as standards adhesive), Nanopox (modification of CB10TSS with addition of nanosilica), Albipox (modification of CB10TSS with addition of liquid rubber) and Timberset (an epoxy-based adhesive with addition of micro-size ceramic particles). The quality of the adhesive bonds was accessed using block shear test in accordance with ASTM D905. The bond strength depends on how good the adhesive wet the timber surface. Therefore the viscosity and contact angle was also measured. The nano- and microfiller additions increased the bond strength significantly. The viscosity correlates well with contact angle measurements where lower viscosities are associated with lower contact angles. However contact angle contradicts with measured strength and wettability.

  17. Arthroscopic Talar Dome Access Using a Standard Versus Wire-Based Traction Method for Ankle Joint Distraction.

    PubMed

    Barg, Alexej; Saltzman, Charles L; Beals, Timothy C; Bachus, Kent N; Blankenhorn, Brad D; Nickisch, Florian

    2016-07-01

    To evaluate the accessibility of the talar dome through anterior and posterior portals for ankle arthroscopy with the standard noninvasive distraction versus wire-based longitudinal distraction using a tensioned wire placed transversely through the calcaneal tuberosity. Seven matched pairs of thigh-to-foot specimens underwent ankle arthroscopy with 1 of 2 methods of distraction: a standard noninvasive strapping technique or a calcaneal tuberosity wire-based technique. The order of the arthroscopic approach and use of a distraction method was randomly determined. The areas accessed from both 2-portal anterior and 2-portal posterior approaches were determined by using a molded translucent grid. The mean talar surface accessible by anterior ankle arthroscopy was comparable with noninvasive versus calcaneal wire distraction with 57.8% ± 17.2% (range, 32.9% to 75.7%) versus 61.5% ± 15.2% (range, 38.5% to 79.1%) of the talar dome, respectively (P = .590). The use of calcaneal wire distraction significantly improved posterior talar dome accessibility compared with noninvasive distraction, with 56.4% ± 20.0% (range, 14.4% to 78.0%) versus 39.8% ± 14.9% (range, 20.0% to 57.6%) of the talar dome, respectively (P = .031). Under the conditions studied, our cadaveric model showed equivalent talar dome access with 2-portal anterior arthroscopy of calcaneal wire-based distraction versus noninvasive strap distraction, but improved access for 2-portal posterior arthroscopy with calcaneal wire-based distraction versus noninvasive strap distraction. The posterior 40% of the talar dome is difficult to access via anterior ankle arthroscopy. Posterior calcaneal tuberosity wire-based longitudinal distraction improved arthroscopic access to the centro-posterior talar dome with a posterior arthroscopic approach. Published by Elsevier Inc.

  18. Infrared spectral marker bands characterizing a transient water wire inside a hydrophobic membrane protein.

    PubMed

    Wolf, Steffen; Freier, Erik; Cui, Qiang; Gerwert, Klaus

    2014-12-14

    Proton conduction along protein-bound "water wires" is an essential feature in membrane proteins. Here, we analyze in detail a transient water wire, which conducts protons via a hydrophobic barrier within a membrane protein to create a proton gradient. It is formed only for a millisecond out of three water molecules distributed at inactive positions in a polar environment in the ground state. The movement into a hydrophobic environment causes characteristic shifts of the water bands reflecting their different chemical properties. These band shifts are identified by time-resolved Fourier Transform Infrared difference spectroscopy and analyzed by biomolecular Quantum Mechanical/Molecular Mechanical simulations. A non-hydrogen bonded ("dangling") O-H stretching vibration band and a broad continuum absorbance caused by a combined vibration along the water wire are identified as characteristic marker bands of such water wires in a hydrophobic environment. The results provide a basic understanding of water wires in hydrophobic environments.

  19. A review: Application of adhesive bonding on semiconductor interconnection joints

    NASA Astrophysics Data System (ADS)

    Suppiah, Sarveshvaran; Ong, Nestor Rubio; Sauli, Zaliman; Sarukunaselan, Karunavani; Alcain, Jesselyn Barro; Shahimin, Mukhzeer Mohamad; Retnasamy, Vithyacharan

    2017-09-01

    A comprehensive review on adhesive die bonding is presented in this paper. Adhesive bonding technique involved electrically conductive adhesives that bond by evaporation of a solvent or by curing a bonding agent with three main parameters; heat, pressure, and time. Isotropic conductive adhesive (ICA) and anisotropic conductive adhesive (ACA) are the commonly used adhesive in this technique. In order to achieve and promote a better adhesion of die on the substrate, surface cleaning steps and methods were very crucial. The major challenge faced by this technique is entrapment of the conductive particles between the die and substrate. An adequate amount of conductive particle is needed between the die and substrate in order to avoid increase in contact resistance.

  20. Essential SpaceWire Hardware Capabilities for a Robust Network

    NASA Technical Reports Server (NTRS)

    Birmingham, Michael; Krimchansky, Alexander; Anderson, William; Lombardi, Matthew

    2016-01-01

    The Geostationary Operational Environmental Satellite R-Series Program (GOES-R) mission is a joint program between National Oceanic & Atmospheric Administration (NOAA) and National Aeronautics & Space Administration (NASA) Goddard Space Flight Center (GSFC). GOES-R project selected SpaceWire as the best solution to satisfy the desire for simple and flexible instrument to spacecraft command and telemetry communications. GOES-R development and integration is complete and the observatory is scheduled for launch October 2016. The spacecraft design was required to support redundant SpaceWire links for each instrument side, as well as to route the fewest number of connections through a Slip Ring Assembly necessary to support Solar pointing instruments. The final design utilized two different router designs. The SpaceWire standard alone does not ensure the most practical or reliable network. On GOES-R a few key hardware capabilities were identified that merit serious consideration for future designs. Primarily these capabilities address persistent port stalls and the prevention of receive buffer overflows. Workarounds were necessary to overcome shortcomings that could be avoided in future designs if they utilize the capabilities, discussed in this paper, above and beyond the requirements of the SpaceWire standard.

  1. Environmental Durability of Adhesively Bonded Joints

    DTIC Science & Technology

    1997-10-14

    REPORT DOCUMENTATION PAGE Form Approved OMB No. 07040188 Public reporting burden for tis collection of information isestimated to average 1 hour per...transmittance and reflectance spectroscopy was performed using Nicolet’s OMNIC software for the set-up, control, and analysis of spectroscopic scans... publications inciudc: JAhIN’. W S. iind Butjkus, L.M., "Considetring E~nvironmental Condjitions ill the Design ()’ Bonded Structures: A Fracture

  2. Evaluation of composite adhesive bonds using digital image correlation

    NASA Astrophysics Data System (ADS)

    Shrestha, Shashi Shekhar

    Advanced composite materials are widely used for many structural applications in the aerospace/aircraft industries today. Joining of composite structures using adhesive bonding offers several advantages over traditional fastening methods. However, this technique is not yet employed for fastening the primary structures of aircrafts or space vehicles. There are several reasons for this: There are not any reliable non-destructive evaluation (NDE) methods that can quantify the strength of the bonds, and there are no certifications of quality assurance for inspecting the bond quality. Therefore, there is a significant need for an effective, reliable, easy to use NDE method for the analysis of composite adhesive joints. This research aimed to investigate an adhesively bonded composite-aluminum joints of variable bond strength using digital image correlation (DIC). There are many future possibilities in continuing this research work. As the application of composite materials and adhesive bond are increasing rapidly, the reliability of the composite structures using adhesive bond should quantified. Hence a lot of similar research using various adhesive bonds and materials can be conducted for characterizing the behavior of adhesive bond. The results obtained from this research will set the foundation for the development of ultrasonic DIC as a nondestructive approach for the evaluation of adhesive bond line.

  3. An EMAT-based shear horizontal (SH) wave technique for adhesive bond inspection

    NASA Astrophysics Data System (ADS)

    Arun, K.; Dhayalan, R.; Balasubramaniam, Krishnan; Maxfield, Bruce; Peres, Patrick; Barnoncel, David

    2012-05-01

    The evaluation of adhesively bonded structures has been a challenge over the several decades that these structures have been used. Applications within the aerospace industry often call for particularly high performance adhesive bonds. Several techniques have been proposed for the detection of disbonds and cohesive weakness but a reliable NDE method for detecting interfacial weakness (also sometimes called a kissing bond) has been elusive. Different techniques, including ultrasonic, thermal imaging and shearographic methods, have been proposed; all have had some degree of success. In particular, ultrasonic methods, including those based upon shear and guided waves, have been explored for the assessment of interfacial bond quality. Since 3-D guided shear horizontal (SH) waves in plates have predominantly shear displacement at the plate surfaces, we conjectured that SH guided waves should be influenced by interfacial conditions when they propagate between adhesively bonded plates of comparable thickness. This paper describes a new technique based on SH guided waves that propagate within and through a lap joint. Through mechanisms we have yet to fully understand, the propagation of an SH wave through a lap joint gives rise to a reverberation signal that is due to one or more reflections of an SH guided wave mode within that lap joint. Based upon a combination of numerical simulations and measurements, this method shows promise for detecting and classifying interfacial bonds. It is also apparent from our measurements that the SH wave modes can discriminate between adhesive and cohesive bond weakness in both Aluminum-Epoxy-Aluminum and Composite-Epoxy-Composite lap joints. All measurements reported here used periodic permanent magnet (PPM) Electro-Magnetic Acoustic Transducers (EMATs) to generate either or both of the two lowest order SH modes in the plates that comprise the lap joint. This exact configuration has been simulated using finite element (FE) models to

  4. Smart material joint band

    NASA Astrophysics Data System (ADS)

    Tucchio, Michael A.; Stoodt, Robert A.; Livsey, Robert A.

    1994-11-01

    The present invention relates to an improved connector for joining two tubular members together. The connector is formed by a plurality of longitudinally extending fingers extending from an end of one of tubular members and at least one locking groove in the other of the tubular members for receiving the fingers. The connector further includes a circumferentially extending wire member which is received in a notch in a head portion of each of the plurality of fingers. The wire member is preferably formed from a shape memory alloy and has an original circumference less than the circumference of a circle formed by the notches in a head portions of the fingers. The connector includes apertures through which electric wires may be connected to the shape memory alloy ring member so as to cause the shape memory alloy ring member to return to its original shape and allow release of the joint connection.

  5. Smart material joint band

    NASA Astrophysics Data System (ADS)

    Tucchio, Michael A.; Stoodt, Robert A.; Livsey, Robert A.

    1993-12-01

    The present invention relates to an improved connector for joining two tubular members together. The connector is formed by a plurality of longitudinally extending fingers extending from an end of one of the tubular members and at least one locking groove in the other of the tubular members for receiving the fingers. The connector further includes a circumferentially extending wire member which is received in a notch in a head portion of each of the plurality of fingers. The wire member is preferably formed from a shape memory alloy and has an original circumference less than the circumference of a circle formed by the notches in the head portions of the fingers. The connector includes apertures through which electric wires may be connected to the shape memory alloy ring member so as to cause the shape memory alloy ring member to return to its original shape and allow release of the joint connection.

  6. 30 CFR 75.1003 - Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley...

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley wires and trolley feeder wires. 75.1003 Section 75.1003... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Trolley Wires and Trolley Feeder Wires § 75.1003...

  7. 30 CFR 75.1003 - Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley...

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Insulation of trolley wires, trolley feeder wires and bare signal wires; guarding of trolley wires and trolley feeder wires. 75.1003 Section 75.1003... MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Trolley Wires and Trolley Feeder Wires § 75.1003...

  8. Joining Tubes With Adhesive

    NASA Technical Reports Server (NTRS)

    Bateman, W. A.

    1984-01-01

    Cylindrical tubes joined together, end to end, by method employing adhesive, tapered ends, and spacing wires. Tapered joint between tubular structural elements provides pressure between bonding surfaces during adhesive curing. Spacing wires prevent adhesive from being scraped away when one element inserted in other. Method developed for assembling structural elements made of composite materials.

  9. Structural analysis of Aircraft fuselage splice joint

    NASA Astrophysics Data System (ADS)

    Udaya Prakash, R.; Kumar, G. Raj; Vijayanandh, R.; Senthil Kumar, M.; Ramganesh, T.

    2016-09-01

    In Aviation sector, composite materials and its application to each component are one of the prime factors of consideration due to the high strength to weight ratio, design flexibility and non-corrosive so that the composite materials are widely used in the low weight constructions and also it can be treated as a suitable alternative to metals. The objective of this paper is to estimate and compare the suitability of a composite skin joint in an aircraft fuselage with different joints by simulating the displacement, normal stress, vonmises stress and shear stress with the help of numerical solution methods. The reference Z-stringer component of this paper is modeled by CATIA and numerical simulation is carried out by ANSYS has been used for splice joint presents in the aircraft fuselage with three combinations of joints such as riveted joint, bonded joint and hybrid joint. Nowadays the stringers are using to avoid buckling of fuselage skin, it has joined together by rivets and they are connected end to end by splice joint. Design and static analysis of three-dimensional models of joints such as bonded, riveted and hybrid are carried out and results are compared.

  10. Effects of beam configurations on wire melting and transfer behaviors in dual beam laser welding with filler wire

    NASA Astrophysics Data System (ADS)

    Ma, Guolong; Li, Liqun; Chen, Yanbin

    2017-06-01

    Butt joints of 2 mm thick stainless steel with 0.5 mm gap were fabricated by dual beam laser welding with filler wire technique. The wire melting and transfer behaviors with different beam configurations were investigated detailedly in a stable liquid bridge mode and an unstable droplet mode. A high speed video system assisted by a high pulse diode laser as an illumination source was utilized to record the process in real time. The difference of welding stability between single and dual beam laser welding with filler wire was also compartively studied. In liquid bridge transfer mode, the results indicated that the transfer process and welding stability were disturbed in the form of "broken-reformed" liquid bridge in tandem configuration, while improved by stabilizing the molten pool dynamics with a proper fluid pattern in side-by-side configuration, compared to sigle beam laser welding with filler wire. The droplet transfer period and critical radius were studied in droplet transfer mode. The transfer stability of side-by-side configuration with the minium transfer period and critical droplet size was better than the other two configurations. This was attributed to that the action direction and good stability of the resultant force which were beneficial to transfer process in this case. The side-by-side configuration showed obvious superiority on improving welding stability in both transfer modes. An acceptable weld bead was successfully generated even in undesirable droplet transfer mode under the present conditions.

  11. Synthesis of one-dimensional metal-containing insulated molecular wire with versatile properties directed toward molecular electronics materials.

    PubMed

    Masai, Hiroshi; Terao, Jun; Seki, Shu; Nakashima, Shigeto; Kiguchi, Manabu; Okoshi, Kento; Fujihara, Tetsuaki; Tsuji, Yasushi

    2014-02-05

    We report, herein, the design, synthesis, and properties of new materials directed toward molecular electronics. A transition metal-containing insulated molecular wire was synthesized through the coordination polymerization of a Ru(II) porphyrin with an insulated bridging ligand of well-defined structure. The wire displayed not only high linearity and rigidity, but also high intramolecular charge mobility. Owing to the unique properties of the coordination bond, the interconversion between the monomer and polymer states was realized under a carbon monoxide atmosphere or UV irradiation. The results demonstrated a high potential of the metal-containing insulated molecular wire for applications in molecular electronics.

  12. Strengthening of defected beam-column joints using CFRP.

    PubMed

    Mahmoud, Mohamed H; Afefy, Hamdy M; Kassem, Nesreen M; Fawzy, Tarek M

    2014-01-01

    This paper presents an experimental study for the structural performance of reinforced concrete (RC) exterior beam-column joints rehabilitated using carbon-fiber-reinforced polymer (CFRP). The present experimental program consists of testing 10 half-scale specimens divided into three groups covering three possible defects in addition to an adequately detailed control specimen. The considered defects include the absence of the transverse reinforcement within the joint core, insufficient bond length for the beam main reinforcement and inadequate spliced implanted column on the joint. Three different strengthening schemes were used to rehabilitate the defected beam-column joints including externally bonded CFRP strips and sheets in addition to near surface mounted (NSM) CFRP strips. The failure criteria including ultimate capacity, mode of failure, initial stiffness, ductility and the developed ultimate strain in the reinforcing steel and CFRP were considered and compared for each group for the control and the CFRP-strengthened specimens. The test results showed that the proposed CFRP strengthening configurations represented the best choice for strengthening the first two defects from the viewpoint of the studied failure criteria. On the other hand, the results of the third group showed that strengthening the joint using NSM strip technique enabled the specimen to outperform the structural performance of the control specimen while strengthening the joints using externally bonded CFRP strips and sheets failed to restore the strengthened joints capacity.

  13. Effects of simulated lightning on composite and metallic joints

    NASA Technical Reports Server (NTRS)

    Howell, W. E.; Plumer, J. A.

    1982-01-01

    The effects of simulated lightning strikes and currents on aircraft bonded joints and access/inspection panels were investigated. Both metallic and composite specimens were tested. Tests on metal fuel feed through elbows in graphite/epoxy structures were evaluated. Sparking threshold and residual strength of single lap bonded joints and sparking threshold of access/inspection panels and metal fuel feed through elbows are reported.

  14. Design, Static Analysis And Fabrication Of Composite Joints

    NASA Astrophysics Data System (ADS)

    Mathiselvan, G.; Gobinath, R.; Yuvaraja, S.; Raja, T.

    2017-05-01

    The Bonded joints will be having one of the important issues in the composite technology is the repairing of aging in aircraft applications. In these applications and also for joining various composite material parts together, the composite materials fastened together either using adhesives or mechanical fasteners. In this paper, we have carried out design, static analysis of 3-D models and fabrication of the composite joints (bonded, riveted and hybrid). The 3-D model of the composite structure will be fabricated by using the materials such as epoxy resin, glass fibre material and aluminium rivet for preparing the joints. The static analysis was carried out with different joint by using ANSYS software. After fabrication, parametric study was also conducted to compare the performance of the hybrid joint with varying adherent width, adhesive thickness and overlap length. Different joint and its materials tensile test result have compared.

  15. 49 CFR 234.233 - Rail joints.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Rail joints. 234.233 Section 234.233 Transportation Other Regulations Relating to Transportation (Continued) FEDERAL RAILROAD ADMINISTRATION... than joint bars and the bonds shall be maintained in such condition to ensure electrical conductivity. ...

  16. Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications

    NASA Technical Reports Server (NTRS)

    Halbig, Michael C.; Singh, Mrityunjay; Shpargel, Tarah P.; Kiser, J. Douglas

    2007-01-01

    A robust joining approach is critically needed for a Micro-Electro-Mechanical Systems-Lean Direct Injector (MEMS-LDI) application which requires leak free joints with high temperature mechanical capability. Diffusion bonding is well suited for the MEMS-LDI application. Diffusion bonds were fabricated using titanium interlayers between silicon carbide substrates during hot pressing. The interlayers consisted of either alloyed titanium foil or physically vapor deposited (PVD) titanium coatings. Microscopy shows that well adhered, crack free diffusion bonds are formed under optimal conditions. Under less than optimal conditions, microcracks are present in the bond layer due to the formation of intermetallic phases. Electron microprobe analysis was used to identify the reaction formed phases in the diffusion bond. Various compatibility issues among the phases in the interlayer and substrate are discussed. Also, the effects of temperature, pressure, time, silicon carbide substrate type, and type of titanium interlayer and thickness on the microstructure and composition of joints are discussed.

  17. Damage prognosis of adhesively-bonded joints in laminated composite structural components of unmanned aerial vehicles

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Farrar, Charles R; Gobbato, Maurizio; Conte, Joel

    2009-01-01

    The extensive use of lightweight advanced composite materials in unmanned aerial vehicles (UAVs) drastically increases the sensitivity to both fatigue- and impact-induced damage of their critical structural components (e.g., wings and tail stabilizers) during service life. The spar-to-skin adhesive joints are considered one of the most fatigue sensitive subcomponents of a lightweight UAV composite wing with damage progressively evolving from the wing root. This paper presents a comprehensive probabilistic methodology for predicting the remaining service life of adhesively-bonded joints in laminated composite structural components of UAVs. Non-destructive evaluation techniques and Bayesian inference are used to (i) assess the current statemore » of damage of the system and, (ii) update the probability distribution of the damage extent at various locations. A probabilistic model for future loads and a mechanics-based damage model are then used to stochastically propagate damage through the joint. Combined local (e.g., exceedance of a critical damage size) and global (e.g.. flutter instability) failure criteria are finally used to compute the probability of component failure at future times. The applicability and the partial validation of the proposed methodology are then briefly discussed by analyzing the debonding propagation, along a pre-defined adhesive interface, in a simply supported laminated composite beam with solid rectangular cross section, subjected to a concentrated load applied at mid-span. A specially developed Eliler-Bernoulli beam finite element with interlaminar slip along the damageable interface is used in combination with a cohesive zone model to study the fatigue-induced degradation in the adhesive material. The preliminary numerical results presented are promising for the future validation of the methodology.« less

  18. Transient liquid phase bonding of titanium-, iron- and nickel-based alloys

    NASA Astrophysics Data System (ADS)

    Rahman, A. H. M. Esfakur

    The operating temperature of land-based gas turbines and jet engines are ever-increasing to increase the efficiency, decrease the emissions and minimize the cost. Within the engines, complex-shaped parts experience extreme temperature, fatigue and corrosion conditions. Ti-based, Ni-based and Fe-based alloys are commonly used in gas turbines and jet engines depending on the temperatures of different sections. Although those alloys have superior mechanical, high temperature and corrosion properties, severe operating conditions cause fast degradation and failure of the components. Repair of these components could reduce lifecycle costs. Unfortunately, conventional fusion welding is not very attractive, because Ti reacts very easily with oxygen and nitrogen at high temperatures, Ni-based superalloys show heat affected zone (HAZ) cracking, and stainless steels show intergranular corrosion and knife-line attack. On the other hand, transient liquid phase (TLP) bonding method has been considered as preferred joining method for those types of alloys. During the initial phase of the current work commercially pure Ti, Fe and Ni were diffusion bonded using commercially available interlayer materials. Commercially pure Ti (Ti-grade 2) has been diffusion bonded using silver and copper interlayers and without any interlayer. With a silver (Ag) interlayer, different intermetallics (AgTi, AgTi2) appeared in the joint centerline microstructure. While with a Cu interlayer eutectic mixtures and Ti-Cu solid solutions appeared in the joint centerline. The maximum tensile strengths achieved were 160 MPa, 502 MPa, and 382 MPa when Ag, Cu and no interlayers were used, respectively. Commercially pure Fe (cp-Fe) was diffusion bonded using Cu (25 m) and Au-12Ge eutectic interlayer (100 microm). Cu diffused predominantly along austenite grain boundaries in all bonding conditions. Residual interlayers appeared at lower bonding temperature and time, however, voids were observed in the joint

  19. Influence of the Gap Width on the Geometry of the Welded Joint in Hybrid Laser-Arc Welding

    NASA Astrophysics Data System (ADS)

    Turichin, G.; Tsibulskiy, I.; Kuznetsov, M.; Akhmetov, A.; Mildebrath, M.; Hassel, T.

    The aim of this research was the experimental investigation of the influence of the gap width and speed of the welding wire on the changes of the geometry in the welded joint in the hybrid laser-arc welding of shipbuilding steel RS E36. The research was divided into three parts. First, in order to understand the influence of the gap width on the welded joint geometry, experimental research was done using continuous wave fiber laser IPG YLS-15000 with arc rectifier VDU-1500DC. The second part involved study of the geometry of the welded joint and hardness test results. Three macrosections from each welded joint were obtained. Influence of the gap width and welding wire speed on the welded joint geometry was researched in the three lines: in the right side of the plates, middle welded joint and in the root welded joint.

  20. Basic Wiring.

    ERIC Educational Resources Information Center

    Kaltwasser, Stan; And Others

    This module is the first in a series of three wiring publications; it serves as the foundation for students enrolled in a wiring program. It is a prerequisite to either "Residential Wiring" or "Commercial and Industrial Wiring." The module contains 16 instructional units that cover the following topics: occupational…

  1. Diffusion Bonding Beryllium to Reduced Activation Ferritic Martensitic Steel: Development of Processes and Techniques

    NASA Astrophysics Data System (ADS)

    Hunt, Ryan Matthew

    Only a few materials are suitable to act as armor layers against the thermal and particle loads produced by magnetically confined fusion. These candidates include beryllium, tungsten, and carbon fiber composites. The armor layers must be joined to the plasma facing components with high strength bonds that can withstand the thermal stresses resulting from differential thermal expansion. While specific joints have been developed for use in ITER (an experimental reactor in France), including beryllium to CuCrZr as well as tungsten to stainless steel interfaces, joints specific to commercially relevant fusion reactors are not as well established. Commercial first wall components will likely be constructed front Reduced Activation Ferritic Martensitic (RAFM) steel, which will need to be coating with one of the three candidate materials. Of the candidates, beryllium is particularly difficult to bond, because it reacts during bonding with most elements to form brittle intermetallic compounds. This brittleness is unacceptable, as it can lead to interface crack propagation and delamination of the armor layer. I have attempted to overcome the brittle behavior of beryllium bonds by developing a diffusion bonding process of beryllium to RAFM steel that achieves a higher degree of ductility. This process utilized two bonding aids to achieve a robust bond: a. copper interlayer to add ductility to the joint, and a titanium interlayer to prevent beryllium from forming unwanted Be-Cu intermetallics. In addition, I conducted a series of numerical simulations to predict the effect of these bonding aids on the residual stress in the interface. Lastly, I fabricated and characterized beryllium to ferritic steel diffusion bonds using various bonding parameters and bonding aids. Through the above research, I developed a process to diffusion bond beryllium to ferritic steel with a 150 M Pa tensile strength and 168 M Pa shear strength. This strength was achieved using a Hot Isostatic

  2. Irradiation resistance of silicon carbide joint at light water reactor–relevant temperature

    DOE PAGES

    Koyanagi, T.; Katoh, Y.; Kiggans, J. O.; ...

    2017-03-10

    We fabricated and irradiated monolithic silicon carbide (SiC) to SiC plate joints with neutrons at 270–310 °C to 8.7 dpa for SiC. The joining methods included solid state diffusion bonding using titanium and molybdenum interlayers, SiC nanopowder sintering, reaction sintering with a Ti-Si-C system, and hybrid processing of polymer pyrolysis and chemical vapor infiltration (CVI). All the irradiated joints exhibited apparent shear strength of more than 84 MPa on average. Significant irradiation-induced cracking was found in the bonding layers of the Ti and Mo diffusion bonds and Ti-Si-C reaction sintered bond. Furthermore, the SiC-based bonding layers of the SiC nanopowdermore » sintered and hybrid polymer pyrolysis and CVI joints all showed stable microstructure following the irradiation.« less

  3. Wire stripper

    NASA Technical Reports Server (NTRS)

    Economu, M. A. (Inventor)

    1978-01-01

    An insulation stripper is described which is especially useful for shielded wire, the stripper including a first pair of jaws with blades extending substantially perpendicular to the axis of the wire, and a second pair of jaws with blades extending substantially parallel to the axis of the wire. The first pair of jaws is pressed against the wire so the blades cut into the insulation, and the device is turned to form circumferential cuts in the insulation. Then the second pair of jaws is pressed against the wire so the blades cut into the insulation, and the wire is moved through the device to form longitudinal cuts that permit easy removal of the insulation. Each of the blades is located within the concave face of a V-block, to center the blades on the wire and to limit the depth of blade penetration.

  4. 30 CFR 75.701-4 - Grounding wires; capacity of wires.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Grounding wires; capacity of wires. 75.701-4... SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Grounding § 75.701-4 Grounding wires; capacity of wires. Where grounding wires are used to ground metallic sheaths, armors, conduits, frames...

  5. 30 CFR 75.701-4 - Grounding wires; capacity of wires.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Grounding wires; capacity of wires. 75.701-4... SAFETY AND HEALTH MANDATORY SAFETY STANDARDS-UNDERGROUND COAL MINES Grounding § 75.701-4 Grounding wires; capacity of wires. Where grounding wires are used to ground metallic sheaths, armors, conduits, frames...

  6. Development of hand rehabilitation system for paralysis patient - universal design using wire-driven mechanism.

    PubMed

    Yamaura, Hiroshi; Matsushita, Kojiro; Kato, Ryu; Yokoi, Hiroshi

    2009-01-01

    We have developed a hand rehabilitation system for patients suffering from paralysis or contracture. It consists of two components: a hand rehabilitation machine, which moves human finger joints with motors, and a data glove, which provides control of the movement of finger joints attached to the rehabilitation machine. The machine is based on the arm structure type of hand rehabilitation machine; a motor indirectly moves a finger joint via a closed four-link mechanism. We employ a wire-driven mechanism and develop a compact design that can control all three joints (i.e., PIP, DIP and MP ) of a finger and that offers a wider range of joint motion than conventional systems. Furthermore, we demonstrate the hand rehabilitation process, finger joints of the left hand attached to the machine are controlled by the finger joints of the right hand wearing the data glove.

  7. Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model

    PubMed Central

    Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji

    2017-01-01

    The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage. PMID:28670568

  8. Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model.

    PubMed

    Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji; Chun, Youn Sic

    2017-07-01

    The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage.

  9. Note: Progress on the use of MgB2 superconducting joint technique for the development of MgB2 magnets for magnetic resonance imaging (MRI).

    PubMed

    Kim, Y G; Song, J B; Kim, J C; Kim, J M; Yoo, B H; Yun, S B; Hwang, D Y; Lee, H G

    2017-08-01

    This note presents a superconducting joint technique for the development of MgB 2 magnetic resonance imaging (MRI) magnets. The MgB 2 superconducting joint was fabricated by a powder processing method using Mg and B powders to establish a wire-bulk-wire connection. The joint resistance measured using a field-decay method was <10 -14 Ω, demonstrating that the proposed joint technique could be employed for developing "next-generation" MgB 2 MRI magnets operating in the persistent current mode.

  10. Modeling of fracture and durability of paste-bonded composite joints subjected to hygro-thermal-mechanical loading

    NASA Astrophysics Data System (ADS)

    Harris, David Lee

    The objective of the research is to characterize the behavior of composite/composite joints with paste adhesive using both experimental testing and analytical modeling. In comparison with the conventional tape adhesive, joining composites using paste adhesive provides several advantages. The carbon fiber laminate material systems employed in this study included IM7 carbon fibers and 977-3 epoxy matrix assembled in prepreg tape, and AS4 carbon fibers and 977-3 epoxy matrix as a five-harness satin weave. The adhesive employed was EA 9394 epoxy. All laminates and test specimens were fabricated and inspected by Boeing using their standard propriety procedures. Three types of test specimens were used in the program. They were bonded double-lap shear (DLS), bonded double cantilever beam (DCB) and bonded interlaminar tension (ILT) specimens. A group of specimens were conditioned at elevated temperature and humidity in an environmental chamber at Boeing's facility and their moisture absorption recorded with time. Specimens were tested at room temperature dry and elevated temperatures. DCB and DLS specimens were tested in fatigue as well as static conditions. Two-dimensional finite element models of the three configurations were developed for determining stresses and strains using the ABAQUS finite element package code. Due to symmetry, only the one-half of the specimen needed to be considered thus reducing computational time. The effect of the test fixture is not taken into account instead equivalent distributed stresses are applied directly on the composite laminates. For each of the specimen, the distribution of Mises stress and the first strain invariant J1 are obtained to identify potential failure locations within a specimen.

  11. Composite pipe to metal joint

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Leslie, James C.; Leslie, II, James C.; Heard, James

    A method for making a metal to composite tube joint including selecting an elongated interior fitting constructed with an exterior barrel, reduced in exterior diameter to form a distally facing annular shoulder and then projecting still further distally to form an interior sleeve having a radially outwardly facing bonding surface. Selecting an elongated metal outer sleeve formed proximally with a collar constructed for receipt over the barrel and increased in interior diameter and projecting distally to form an exterior sleeve having a radially inwardly facing bonding surface cooperating with the first bonding surface to form an annulus receiving an extremitymore » of a composite tube and a bond bonding the extremity of the tube to the bonding surfaces.« less

  12. Joint tests at INL and CEA of a transient hot wire needle probe for in-pile thermal conductivity measurement

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Daw, J.E.; Knudson, D.L.; Villard, J.F.

    2015-07-01

    for both room temperature proof-of-concept evaluations and high temperature testing. Evaluations have been performed jointly by the INL and the French Alternative Energies and Atomic Energy Commission (CEA), both in Idaho Falls (USA) and in Cadarache (France), in the framework of a collaborative program for instrumentation of Material Testing Reactors. Initial tests were conducted on samples with a large range of thermal conductivities and temperatures ranging from 20 deg. C to 600 deg. C. Particularly, tests were recently performed on a sample having thermal conductivity and dimensions similar to UO{sub 2} and MOX nuclear fuels, in order to validate the ability of this sensor to operate for in-pile characterization of Light Water Reactors fuels. The results of the tests already completed at INL and CEA indicate that the Transient Hot Wire Needle Probe offers an enhanced method for in-pile detection of thermal conductivity. (authors)« less

  13. In vitro toxicity evaluation of silver soldering, electrical resistance, and laser welding of orthodontic wires.

    PubMed

    Sestini, Silvia; Notarantonio, Laura; Cerboni, Barbara; Alessandrini, Carlo; Fimiani, Michele; Nannelli, Pietro; Pelagalli, Antonio; Giorgetti, Roberto

    2006-12-01

    The long-term effects of orthodontic appliances in the oral environment and the subsequent leaching of metals are relatively unknown. A method for determining the effects of various types of soldering and welding, both of which in turn could lead to leaching of metal ions, on the growth of osteoblasts, fibroblasts, and oral keratinocytes in vitro, is proposed. The effects of cell behaviour of metal wires on osteoblast differentiation, expressed by alkaline phosphatase (ALP) activity; on fibroblast proliferation, assayed by the 3-(4,5-dimethylthiazol-2-yl)-5-(3-carboxymethoxyphenyl)-2-(4-sulphophenil)-2H-tetrazolium-phenazine ethosulphate method; and on keratinocyte viability and migration on the wires, observed by scanning electron microscopy (SEM), were tested. Two types of commercially available wires normally used for orthodontic appliances, with a similar chemical composition (iron, carbon, silicon, chromium, molybdenum, phosphorus, sulphur, vanadium, and nitrogen) but differing in nickel and manganese content, were examined, as well as the joints obtained by electrical resistance welding, traditional soldering, and laser welding. Nickel and chromium, known as possible toxic metals, were also examined using pure nickel- and chromium-plated titanium wires. Segments of each wire, cut into different lengths, were added to each well in which the cells were grown to confluence. The high nickel and chromium content of orthodontic wires damaged both osteoblasts and fibroblasts, but did not affect keratinocytes. Chromium strongly affected fibroblast growth. The joint produced by electrical resistance welding was well tolerated by both osteoblasts and fibroblasts, whereas traditional soldering caused a significant (P < 0.05) decrease in both osteoblast ALP activity and fibroblast viability, and prevented the growth of keratinocytes in vitro. Laser welding was the only joining process well tolerated by all tested cells.

  14. The effects of alloying elements on microstructures and mechanical properties of tungsten inert gas welded AZ80 magnesium alloys joint

    NASA Astrophysics Data System (ADS)

    Li, Hui; Zhang, Jiansheng; Ding, Rongrong

    2017-11-01

    The effects of alloying elements on the macrostructures, microstructures and tensile strength of AZ80 Mg alloy weldments were studied in the present study. The results indicate that with the decrease of Al element content of filler wire, the welding defects of seam are gradually eliminated and the β-Mg17Al12 phases at α-Mg boundaries are refined and become discontinuous, which are beneficial to the improvement of tensile strength. With AZ31 Mg alloy filler wire, the maximum tensile strength of AZ80 weldment is 220 MPa and fracture occurs at the welding seam of joint. It is experimentally proved that robust AZ80 Mg alloy joints can be obtained by tungsten inert gas (TIG) welding process with AZ31 Mg alloy filler wire. However, further study is required to improve the microstructures and reduce welding defects of joint in order to further improve the joining strength of AZ80 Mg alloy joint.

  15. Closed retrograde retrieval of the distal broken segment of femoral cannulated intramedullary nail using a ball-tipped guide wire.

    PubMed

    Metikala, Sreenivasulu; Mohammed, Riazuddin

    2011-07-01

    Extracting broken segments of intramedullay nails from long bones can be an operative challenge, particularly from the distal end. We report a case series where a simple and reproducible technique of extracting broken femoral cannulated nails using a ball-tipped guide wire is described. This closed technique involves no additional equipment or instruments. Eight patients who underwent the described method were included in the study. The technique involves using a standard plain guide wire passed through the cannulated distal broken nail segment after extraction of the proximal nail fragment. The plain guide wire is then advanced distally into the knee joint carefully under fluoroscopy imaging. Over this wire, a 5-millimeter (mm) cannulated large drill bit is used to create a track up to the distal broken nail segment. Through the small knee wound, a ball-tipped guide wire is passed, smooth end first, till the ball engages the end of the nail. The guide wire is then extracted along with the broken nail through the proximal wound. The method was successfully used in all eight patients for removal of broken cannulated intramedullary nail from the femoral canal without any complications. All patients underwent exchange nailing with successful bone union in six months. None of the patients had any problems at the knee joint at the final follow-up. We report a technique for successful extraction of the distal fragment of broken femoral intramedullary nails without additional surgical approaches.

  16. Cyclic debonding of adhesively bonded composites

    NASA Technical Reports Server (NTRS)

    Mall, S.; Johnson, W. S.; Everett, R. A., Jr.

    1982-01-01

    The fatigue behavior of a simple composite to composite bonded joint was analyzed. The cracked lap shear specimen subjected to constant amplitude cyclic loading was studied. Two specimen geometries were tested for each bonded system: (1) a strap adherend of 16 plies bonded to a lap adherend of 8 plies; and (2) a strap adherend of 8 plies bonded to a lap adherend of 16 plies. In all specimens the fatigue failure was in the form of cyclic debonding with some 0 deg fiber pull off from the strap adherend. The debond always grew in the region of adhesive that had the highest mode (peel) loading and that region was close to the adhesive strap interface.

  17. Towards Scalable Strain Gauge-Based Joint Torque Sensors

    PubMed Central

    D’Imperio, Mariapaola; Cannella, Ferdinando; Caldwell, Darwin G.; Cuschieri, Alfred

    2017-01-01

    During recent decades, strain gauge-based joint torque sensors have been commonly used to provide high-fidelity torque measurements in robotics. Although measurement of joint torque/force is often required in engineering research and development, the gluing and wiring of strain gauges used as torque sensors pose difficulties during integration within the restricted space available in small joints. The problem is compounded by the need for a scalable geometric design to measure joint torque. In this communication, we describe a novel design of a strain gauge-based mono-axial torque sensor referred to as square-cut torque sensor (SCTS), the significant features of which are high degree of linearity, symmetry, and high scalability in terms of both size and measuring range. Most importantly, SCTS provides easy access for gluing and wiring of the strain gauges on sensor surface despite the limited available space. We demonstrated that the SCTS was better in terms of symmetry (clockwise and counterclockwise rotation) and more linear. These capabilities have been shown through finite element modeling (ANSYS) confirmed by observed data obtained by load testing experiments. The high performance of SCTS was confirmed by studies involving changes in size, material and/or wings width and thickness. Finally, we demonstrated that the SCTS can be successfully implementation inside the hip joints of miniaturized hydraulically actuated quadruped robot-MiniHyQ. This communication is based on work presented at the 18th International Conference on Climbing and Walking Robots (CLAWAR). PMID:28820446

  18. Towards Scalable Strain Gauge-Based Joint Torque Sensors.

    PubMed

    Khan, Hamza; D'Imperio, Mariapaola; Cannella, Ferdinando; Caldwell, Darwin G; Cuschieri, Alfred; Semini, Claudio

    2017-08-18

    During recent decades, strain gauge-based joint torque sensors have been commonly used to provide high-fidelity torque measurements in robotics. Although measurement of joint torque/force is often required in engineering research and development, the gluing and wiring of strain gauges used as torque sensors pose difficulties during integration within the restricted space available in small joints. The problem is compounded by the need for a scalable geometric design to measure joint torque. In this communication, we describe a novel design of a strain gauge-based mono-axial torque sensor referred to as square-cut torque sensor (SCTS) , the significant features of which are high degree of linearity, symmetry, and high scalability in terms of both size and measuring range. Most importantly, SCTS provides easy access for gluing and wiring of the strain gauges on sensor surface despite the limited available space. We demonstrated that the SCTS was better in terms of symmetry (clockwise and counterclockwise rotation) and more linear. These capabilities have been shown through finite element modeling (ANSYS) confirmed by observed data obtained by load testing experiments. The high performance of SCTS was confirmed by studies involving changes in size, material and/or wings width and thickness. Finally, we demonstrated that the SCTS can be successfully implementation inside the hip joints of miniaturized hydraulically actuated quadruped robot- MiniHyQ . This communication is based on work presented at the 18th International Conference on Climbing and Walking Robots (CLAWAR).

  19. Processing and characterization of superconducting solenoids made of Bi-2212/Ag-alloy multifilament round wire for high field magnet applications

    NASA Astrophysics Data System (ADS)

    Chen, Peng

    between turns due to densification of wires (~4% wire diameter reduction) during 50-100 bar OP processing, and the diameter shrinking of conductors will potentially lead to coil sagging. So far, we have developed some methods to solve the issue of coil sagging, such as using flexible coil flange to allow smooth sagging of winding pack during OP processing. We have also investigated electrical joints between Bi-2212 RW conductors, which include resistive joints and superconducting joints. For resistive Bi-2212 joints, we evaluated conventional diffusion bonding method and soldering method. In general, the joints (with 42 mm joint length) resistances are below 200 nO at 4.2 K and magnetic fields up to 13.5 T, and the effect of magnetoresistance is clearly present. In addition to resistive joints, we successfully developed a superconducting joint between Bi-2212 RW conductors for persistent current mode (PCM) operations. (Abstract shortened by UMI.).

  20. Wiring up pre-characterized single-photon emitters by laser lithography

    NASA Astrophysics Data System (ADS)

    Shi, Q.; Sontheimer, B.; Nikolay, N.; Schell, A. W.; Fischer, J.; Naber, A.; Benson, O.; Wegener, M.

    2016-08-01

    Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.

  1. Elasto-Plastic Analysis of Tee Joints Using HOT-SMAC

    NASA Technical Reports Server (NTRS)

    Arnold, Steve M. (Technical Monitor); Bednarcyk, Brett A.; Yarrington, Phillip W.

    2004-01-01

    The Higher Order Theory - Structural/Micro Analysis Code (HOT-SMAC) software package is applied to analyze the linearly elastic and elasto-plastic response of adhesively bonded tee joints. Joints of this type are finding an increasing number of applications with the increased use of composite materials within advanced aerospace vehicles, and improved tools for the design and analysis of these joints are needed. The linearly elastic results of the code are validated vs. finite element analysis results from the literature under different loading and boundary conditions, and new results are generated to investigate the inelastic behavior of the tee joint. The comparison with the finite element results indicates that HOT-SMAC is an efficient and accurate alternative to the finite element method and has a great deal of potential as an analysis tool for a wide range of bonded joints.

  2. Transient liquid phase diffusion bonding of Udimet 720 for Stirling power converter applications

    NASA Technical Reports Server (NTRS)

    Mittendorf, Donald L.; Baggenstoss, William G.

    1992-01-01

    Udimet 720 has been selected for use on Stirling power converters for space applications. Because Udimet 720 is generally considered susceptible to strain age cracking if traditional fusion welding is used, other joining methods are being considered. A process for transient liquid phase diffusion bonding of Udimet 720 has been theoretically developed in an effort to eliminate the strain age crack concern. This development has taken into account such variables as final grain size, joint homogenization, joint efficiency related to bonding aid material, bonding aid material application method, and thermal cycle.

  3. Measurement of damping of graphite epoxy composite materials and structural joints

    NASA Technical Reports Server (NTRS)

    Crocker, Malcolm J.; Rao, Mohan D.; Raju, P. K.; Yan, Xinche

    1989-01-01

    The damping capacity of graphite epoxy materials and structural joints was evaluated. The damping ratio of different composite specimens and bonded joints were systematically evaluated under normal atmospheric conditions and in a vacuum environment. Free and forced vibration test methods were employed for measuring the damping ratios. The effect of edge support conditions on the damping value of a composite tube specimen was studied by using a series of experiments performed on the specimen with different edge supports. It was found that simulating a free-free boundary conditions by having no constraints at the ends gives the lowest value of the material damping of the composite. The accuracy of the estimation of the damping ratio value was improved by using a curve-fitting technique on the response data obtained through measurement. The effect of outgassing (moisture desorption) on the damping capacity was determined by measuring the damping ratio of the tube specimen in a vacuum environment before and after outgassing had occurred. The effects of high and low temperatures on the damping was also investigated by using a series of experiments on tube and beam specimens. An analytical model to study the vibrations of a bonded lap joint system was formulated. Numerical results were generated for different overlap ratios of the system. These were compared with experimental results. In order to determine the influence of bonded joints on the material damping capacity, experiments were conducted on bonded lap-jointed and double-butt-jointed specimens. These experimental results were compared with simple beam specimens with no joints.

  4. Effect of Nd:YAG laser beam welding on weld morphology and mechanical properties of Ti-6Al-4V butt joints and T-joints

    NASA Astrophysics Data System (ADS)

    Kashaev, Nikolai; Ventzke, Volker; Fomichev, Vadim; Fomin, Fedor; Riekehr, Stefan

    2016-11-01

    A Nd:YAG single-sided laser beam welding process study for Ti-6Al-4V butt joints and T-joints was performed to investigate joining techniques with regard to the process-weld morphology relationship. An alloy compatible filler wire was used to avoid underfills and undercuts. The quality of the butt joints and T-joints was characterized in terms of weld morphology, microstructure and mechanical properties. Joints with regular shapes, without visible cracks, pores, and geometrical defects were achieved. Tensile tests revealed high joint integrity in terms of strength and ductility for both the butt joint and T-joint geometries. Both the butt joints and T-joints showed base material levels of strength. The mechanical performance of T-joints was also investigated using pull-out tests. The performance of the T-joints in such tests was sensitive to the shape and morphology of the welds. Fracture always occurred in the weld without any plastic deformation in the base material outside the weld.

  5. Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

    NASA Technical Reports Server (NTRS)

    Lei, Jih-Fen; Kiser, J. Douglas; Singh, Mrityunjay; Cuy, Mike; Blaha, Charles A.; Androjna, Drago

    2000-01-01

    An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

  6. Subsidizing Infrastructure Investment with Tax-Preferred Bonds. A Joint CBO/JCT Study

    ERIC Educational Resources Information Center

    Musick, Nathan

    2009-01-01

    States and localities issue debt to finance projects undertaken by government and, in some cases, by the private sector (bonds issued by states and localities to finance either government operations or certain private-sector activities are known as municipal bonds). The federal government subsidizes the issuance of municipal bonds by offering tax…

  7. Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion

    NASA Astrophysics Data System (ADS)

    Kanjilal, Anwesha; Kumar, Praveen

    2018-01-01

    The effects of mechanical strain on the growth kinetics of interfacial intermetallic compounds (IMCs) sandwiched between Cu substrate and Sn-1.0 wt.%Ag-0.5 wt.%Cu (SAC105) solder have been investigated. Isothermal aging (IA) at 70°C and 125°C, and thermal cycling (TC) as well as thermomechanical cycling (TMC) with shear strain of 12.8% per cycle between -25°C and 125°C were applied to diffusion-bonded solder joints to study the growth behavior of the interfacial IMC layer under various types of thermomechanical excursion (TME). The microstructure of the solder joint tested under each TME was observed at regular intervals. It was observed that the growth rate of the IMC layer was higher in the case of TMC compared with TC or IA. This increased growth rate of the IMC layer in the presence of mechanical strain suggests an additional driving force that enhances the growth kinetics of the IMC. Finite element analysis was performed to gain insight into the effect of TC and TMC on the stress field in the solder joint, especially near the interface between the solder and the substrate. Finally, an analytical model was developed to quantify the effect of strain on the effective diffusivity and express the growth kinetics for all three types of TME using a single expression.

  8. 49 CFR 234.241 - Protection of insulated wire; splice in underground wire.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Protection of insulated wire; splice in underground wire. 234.241 Section 234.241 Transportation Other Regulations Relating to Transportation... of insulated wire; splice in underground wire. Insulated wire shall be protected from mechanical...

  9. 49 CFR 234.241 - Protection of insulated wire; splice in underground wire.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Protection of insulated wire; splice in underground wire. 234.241 Section 234.241 Transportation Other Regulations Relating to Transportation... of insulated wire; splice in underground wire. Insulated wire shall be protected from mechanical...

  10. First metatarsal-phalangeal joint arthrodesis: a biomechanical assessment of stability.

    PubMed

    Politi, Joel; John, Hayes; Njus, Glen; Bennett, Gordon L; Kay, David B

    2003-04-01

    First metatarsal phalangeal joint (MTP) arthrodesis is a commonly performed procedure for the treatment of hallux rigidus, severe and recurrent bunion deformities, rheumatoid arthritis and other less common disorders of the joint. There are different techniques of fixation of the joint to promote arthrodesis including oblique lag screw fixation, lag screw and dorsal plate fixation, crossed Kirschner wires, dorsal plate fixation alone and various types of external fixation. Ideally the fixation method should be reproducible, lead to a high rate of fusion, and have a low incidence of complications. In the present study, we compared the strength of fixation of five commonly utilized techniques of first MTP joint arthrodesis. These were: 1. Surface excision with machined conical reaming and fixation with a 3.5 mm cortical interfragmentary lag screw. 2. Surface excision with machined conical reaming and fixation with crossed 0.062 Kirschner wires. 3. Surface excision with machined conical reaming and fixation with a 3.5 mm cortical lag screw and a four hole dorsal miniplate secured with 3.5 mm cortical screws. 4. Surface excision with machined conical reaming and fixation with a four hole dorsal miniplate secured with 3.5 mm cortical screws and no lag screw. 5. Planar surface excision and fixation with a single oblique 3.5 mm interfragmentary cortical lag screw. Testing was done on an Instron materials testing device loading the first MTP joint in dorsiflexion. Liquid metal strain gauges were placed over the joint and micromotion was detected with varying loads and cycles. The most stable technique was the combination of machined conical reaming and an oblique interfragmentary lag screw and dorsal plate. This was greater than two times stronger than an oblique lag screw alone. Dorsal plate alone and Kirschner wire fixation were the weakest techniques. First MTP fusion is a commonly performed procedure for the treatment of a variety of disorders of the first MTP joint

  11. Diffusion Bonding of Microduplex Stainless Steel and Ti Alloy with and without Interlayer: Interface Microstructure and Strength Properties

    NASA Astrophysics Data System (ADS)

    Kundu, S.; Sam, S.; Mishra, B.; Chatterjee, S.

    2014-01-01

    The interface microstructure and strength properties of solid state diffusion bonding of microduplex stainless steel (MDSS) to Ti alloy (TiA) with and without a Ni alloy (NiA) intermediate material were investigated at 1173 K (900 °C) for 0.9 to 5.4 ks in steps of 0.9 ks in vacuum. The effects of bonding time on the microstructure of the bonded joint have been analyzed by light optical microscopy and scanning electron microscopy in the backscattered mode. In the direct bonded joints of MDSS and TiA, the layer-wise σ phase and the λ + FeTi phase mixture were observed at the bond interface when the joint was processed for 2.7 ks and above holding times. However, when NiA was used as an intermediate material, the results indicated that TiNi3, TiNi, and Ti2Ni are formed at the NiA-TiA interface, and the irregular shaped particles of Fe22Mo20Ni45Ti13 have been observed within the TiNi3 intermetallic layer. The stainless steel-NiA interface is free from intermetallics and the layer of austenitic phase was observed at the stainless steel side. A maximum tensile strength of ~520 MPa, shear strength of ~405 MPa, and impact toughness of ~18 J were obtained for the directly bonded joint when processed for 2.7 ks. However, when nickel base alloy was used as an intermediate material in the same materials, the bond tensile and shear strengths increase to ~640 and ~479 MPa, respectively, and the impact toughness to ~21 J when bonding was processed for 4.5 ks. Fracture surface observations in scanning electron microscopy using energy dispersive spectroscopy demonstrate that in MDSS-TiA joints, failure takes place through the FeTi + λ phase when bonding was processed for 2.7 ks; however, failure takes place through σ phase for the diffusion joints processed for 3.6 ks and above processing times. However, in MDSS-NiA-TiA joints, the fracture takes place through NiTi2 layer at the NiA-TiA interface for all bonding times.

  12. Efficacy of Dorsoradial Capsulodesis for Trapeziometacarpal Joint Instability: A Cadaver Study.

    PubMed

    Chenoweth, Brian A; O'Mahony, Gavin D; Fitzgerald, Casey; Stoner, Julie A; O'Donoghue, Daniel L; Rayan, Ghazi M

    2017-01-01

    To test the biomechanical properties of the dorsoradial capsulodesis procedure. Six cadaveric hands were used. After exposing the trapeziometacarpal (TMC) joint, we placed Kirschner wires in the distal radius and thumb metacarpal. The rotation shear test was then performed to test the joint axial laxity, and angular measurements using Kirschner wires as reference points were documented. The dorsoradial (DR) ligament and capsule were released, followed by the intermetacarpal (IM) ligament; angular measurements were obtained. Finally, the DR capsulodesis procedure was performed, and final measurements were obtained. Comparisons were made among the various stages of ligament integrity to determine the amount of stability provided by DR capsulodesis. All cadavers demonstrated axial laxity with transection of the DR ligament; an increase in stability was obtained after DR capsulodesis. Transection of the capsule and IM ligament caused increased laxity relative to the native joint (median, 24° and 35°, respectively, on rotational testing). After we performed DR capsulodesis, rotational stability improved by a median of 41° compared with DR ligament transection, 49° compared with DR and IM ligament transection, and 18° relative to the native joint. Dorsoradial capsulodesis restores rotational stability for TMC joint after division of the DR and IM ligaments. The stability achieved was statistically significant compared with both an intact native TMC joint and induced laxity of the TMC joint. The DR capsulodesis procedure may improve rotational stability to the TMC joint. Copyright © 2017 American Society for Surgery of the Hand. Published by Elsevier Inc. All rights reserved.

  13. Theoretical and Experimental Evaluation of the Bond Strength Under Peeling Loads

    NASA Technical Reports Server (NTRS)

    Nayeb-Hashemi, Hamid; Jawad, Oussama Cherkaoui

    1997-01-01

    Reliable applications of adhesively bonded joints require understanding of the stress distribution along the bond-line and the stresses that are responsible for the joint failure. To properly evaluate factors affecting peel strength, effects of defects such as voids on the stress distribution in the overlap region must be understood. In this work, the peel stress distribution in a single lap joint is derived using a strength of materials approach. The bonded joint is modeled as Euler-Bernoulli beams, bonded together with an adhesive. which is modeled as an elastic foundation which can resist both peel and shear stresses. It is found that for certain adhesive and adherend geometries and properties, a central void with the size up to 50 percent of the overlap length has negligible effect on the peak peel and shear stresses. To verify the solutions obtained from the model, the problem is solved again by using the finite element method and by treating the adherends and the adhesive as elastic materials. It is found that the model used in the analysis not only predicts the correct trend for the peel stress distribution but also gives rather surprisingly close results to that of the finite element analysis. It is also found that both shear and peel stresses can be responsible for the joint performance and when a void is introduced, both of these stresses can contribute to the joint failure as the void size increases. Acoustic emission (AE) activities of aluminum-adhesive-aluminum specimens with different void sizes were monitored. The AE ringdown counts and energy were very sensitive and decreased significantly with the void size. It was observed that the AE events were shifting towards the edge of the overlap where the maximum peeling and shearing stresses were occurring as the void size increased.

  14. Metering Wheel-Wire Track Wire Boom Deployment Mechanism

    NASA Technical Reports Server (NTRS)

    Granoff, Mark S.

    2014-01-01

    The NASA MMS Spin Plane Double Probe (SDP) Deployer utilizes a helical path, rotating Metering Wheel and a spring loaded Wire "Holding" Track to pay out a "fixed end" 57 meter x 1.5 mm diameter Wire Boom stored between concentric storage cylinders. Unlike rotating spool type storage devices, the storage cylinders remain stationary, and the boom wire is uncoiled along the length of the cylinder via the rotation of the Metering Wheel. This uncoiling action avoids the need for slip-ring contacts since the ends of the wire can remain stationary. Conventional fixed electrical connectors (Micro-D type) are used to terminate to operational electronics.

  15. Process Of Bonding Copper And Tungsten

    DOEpatents

    Slattery, Kevin T.; Driemeyer, Daniel E.; Davis, John W.

    2000-07-18

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by sintering a stack of individual copper and tungsten powder blend layers having progressively higher copper content/tungsten content, by volume, ratio values in successive powder blend layers in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  16. Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

    NASA Technical Reports Server (NTRS)

    1981-01-01

    The development of several types of graphite/polyimide (GR/PI) bonded and bolted joints is reported. The program consists of two concurrent tasks: (1) design and test of specific built up attachments; and (2) evaluation of standard advanced bonded joint concepts. A data base for the design and analysis of advanced composite joints for use at elevated temperatures (561K (550 deg F)) to design concepts for specific joining applications, and the fundamental parameters controlling the static strength characteristics of such joints are evaluated. Data for design and build GR/PI of lightly loaded flight components for advanced space transportation systems and high speed aircraft are presented. Results for compression and interlaminar shear strengths of Celion 6000/PMR-15 laminates are given. Static discriminator test results for type 3 and type 4 bonded and bolted joints and final joint designs for TASK 1.4 scale up fabrication and testing are presented.

  17. Novel Method of Aluminum to Copper Bonding by Cold Spray

    NASA Astrophysics Data System (ADS)

    Fu, Si-Lin; Li, Cheng-Xin; Wei, Ying-Kang; Luo, Xiao-Tao; Yang, Guan-Jun; Li, Chang-Jiu; Li, Jing-Long

    2018-04-01

    Cold spray bonding (CSB) has been proposed as a new method for joining aluminum and copper. At high speeds, solid Al particles impacted the groove between the two substrates to form a bond between Al and Cu. Compared to traditional welding technologies, CSB does not form distinct intermetallic compounds. Large stainless steel particles were introduced into the spray powders as in situ shot peen particles to create a dense Al deposit and to improve the bond strength of joints. It was discovered that introducing shot peen particles significantly improved the flattening ratio of the deposited Al particles. Increasing the proportion of shot peen particles from 0 to 70 vol.% decreased the porosity of the deposits from 12.4 to 0.2%, while the shear strength of joints significantly increased. The tensile test results of the Al-Cu joints demonstrated that cracks were initiated at the interface between the Al and the deposit. The average tensile strength was 71.4 MPa and could reach 81% of the tensile strength of pure Al.

  18. Bond Management - Higher Education.

    ERIC Educational Resources Information Center

    Washington State Legislature, Olympia. Joint Committee on Higher Education.

    In this instance, the Joint Committee on Higher Education in Washington State was directed to review capital funding methods at the 4-year institutions of higher education in the state. The major finding of the study, which emerged after an intensive survey of bond practices, was that some means should be found to enhance management effectiveness…

  19. Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

    NASA Technical Reports Server (NTRS)

    Barclay, D. L.

    1980-01-01

    Results of an experimental program to develop several types of graphite/polyimide (GR/PI) bonded and bolted joints for lightly loaded flight components for advanced space transportation systems and high speed aircraft are presented. Tasks accomplished include: a literature survey; design of static discriminator specimens; design allowables testing; fabrication of test panels and specimens; small specimen testing; and standard joint testing. Detail designs of static discriminator specimens for each of the four major attachment types are presented. Test results are given for the following: (1) transverse tension of Celion 3000/PMR-15 laminate; (2) net tension of a laminate for both a loaded and unloaded bolt hole; (3) comparative testing of bonded and co-cured doublers along with pull-off tests of single and double bonded angles; (4) single lap shear tests, transverse tension and coefficient of thermal expansion tests of A7F (LARC-13 amide-imide modified) adhesive; and (5) tension tests of standard single lap, double lap, and symmetric step lap bonded joints. Also, included are results of a finite element analysis of a single lap bonded composite joint.

  20. Sintered silver joints via controlled topography of electronic packaging subcomponents

    DOEpatents

    Wereszczak, Andrew A.

    2014-09-02

    Disclosed are sintered silver bonded electronic package subcomponents and methods for making the same. Embodiments of the sintered silver bonded EPSs include topography modification of one or more metal surfaces of semiconductor devices bonded together by the sintered silver joint. The sintered silver bonded EPSs include a first semiconductor device having a first metal surface, the first metal surface having a modified topography that has been chemically etched, grit blasted, uniaxial ground and/or grid sliced connected to a second semiconductor device which may also include a first metal surface with a modified topography, a silver plating layer on the first metal surface of the first semiconductor device and a silver plating layer on the first metal surface of the second semiconductor device and a sintered silver joint between the silver plating layers of the first and second semiconductor devices which bonds the first semiconductor device to the second semiconductor device.

  1. Strength and Mechanics of Bonded Scarf Joints for Repair of Composite Materials

    NASA Technical Reports Server (NTRS)

    Pipes, R. B.; Adkins, D. W.

    1982-01-01

    Experimental and analytical investigations of scarf joints indicate that slight bluntness of adherend tips induces adhesive stress concentrations which significantly reduce joint strength, and the stress distribution through the adhesive thickness is non-uniform and has significant stress concentrations at the ends of the joint. The laminate stacking sequence can have important effects on the adhesive stress distribution. A significant improvement in joint strength is possible by increasing overlap at the expense of raising the repair slightly above the original surface. Although a surface grinder was used to make most experimental specimens, a hand held rotary bur can make a surprisingly good scarf. Scarf joints wit doublers on one side, such as might be used for repair, bend under tensile loads and may actually be weaker than joints without doublers.

  2. Wire Array Photovoltaics

    NASA Astrophysics Data System (ADS)

    Turner-Evans, Dan

    Over the past five years, the cost of solar panels has dropped drastically and, in concert, the number of installed modules has risen exponentially. However, solar electricity is still more than twice as expensive as electricity from a natural gas plant. Fortunately, wire array solar cells have emerged as a promising technology for further lowering the cost of solar. Si wire array solar cells are formed with a unique, low cost growth method and use 100 times less material than conventional Si cells. The wires can be embedded in a transparent, flexible polymer to create a free-standing array that can be rolled up for easy installation in a variety of form factors. Furthermore, by incorporating multijunctions into the wire morphology, higher efficiencies can be achieved while taking advantage of the unique defect relaxation pathways afforded by the 3D wire geometry. The work in this thesis shepherded Si wires from undoped arrays to flexible, functional large area devices and laid the groundwork for multijunction wire array cells. Fabrication techniques were developed to turn intrinsic Si wires into full p-n junctions and the wires were passivated with a-Si:H and a-SiNx:H. Single wire devices yielded open circuit voltages of 600 mV and efficiencies of 9%. The arrays were then embedded in a polymer and contacted with a transparent, flexible, Ni nanoparticle and Ag nanowire top contact. The contact connected >99% of the wires in parallel and yielded flexible, substrate free solar cells featuring hundreds of thousands of wires. Building on the success of the Si wire arrays, GaP was epitaxially grown on the material to create heterostructures for photoelectrochemistry. These cells were limited by low absorption in the GaP due to its indirect bandgap, and poor current collection due to a diffusion length of only 80 nm. However, GaAsP on SiGe offers a superior combination of materials, and wire architectures based on these semiconductors were investigated for multijunction

  3. [Application of rafting K-wire technique for tibial plateau fractures].

    PubMed

    Zhang, Xing-zhou; Yu, Wei-zhong; Li, Yun-feng; Liu, Yan-hui

    2015-12-01

    To summarize application of rafting K-wires technique for tibial plateau fractures. From January 2013 to January 2015,45 patients with tibial plateau fractures were treated by locking plate with rafting K-wires, including 33 males and 12 females with an average of 44.2 years old ranging from 22 to 56 years old. According to Schatzker classification, 6 cases were type II, 8 were type Ill, 4 were type IV, 4 were type V, and 5 were type VI. Allogeneic bone graft were performed for bone defects. All patients were fixed with two to five K-wires. Part of weight loading were encouraged at 3 months after operation,and full weight-loading were done at 5 months after operation. Postoperative complications were observed,and Rasmussen clinical and radiological assessment were used to evaluate clinical results. All Patients were followed up from 10 to 23 months with average of 14 months. According to Rasmussen clinical and radiological assessment, clinical scores 23.58 ± 6.33, radiological scores were 14.00 ± 6.33; and excellent and good rates were 82.2% and 77.8% respectively. Four patients occurred severe osteoporosis and collapse of articular surface; 5 patients occurred traumatic arthritis. Rafting K-wires technique with anatomized armor plate could effective fix and support platform collapse and joint bone fragments, increase support surface area and reduce postoperative reduction loss rate.

  4. En-masse retraction with a preformed nickel-titanium and stainless steel archwire assembly and temporary skeletal anchorage devices without posterior bonding

    PubMed Central

    Jee, Jeong-Hyun; Ahn, Hyo-Won; Seo, Kyung-Won; Kook, Yoon-Ah; Chung, Kyu-Rhim; Nelson, Gerald

    2014-01-01

    Objective To evaluate the therapeutic effects of a preformed assembly of nickel-titanium (NiTi) and stainless steel (SS) archwires (preformed C-wire) combined with temporary skeletal anchorage devices (TSADs) as the sole source of anchorage and to compare these effects with those of a SS version of C-wire (conventional C-wire) for en-masse retraction. Methods Thirty-one adult female patients with skeletal Class I or II dentoalveolar protrusion, mild-to-moderate anterior crowding (3.0-6.0 mm), and stable Class I posterior occlusion were divided into conventional (n = 15) and preformed (n = 16) C-wire groups. All subjects underwent first premolar extractions and en-masse retraction with pre-adjusted edgewise anterior brackets, the assigned C-wire, and maxillary C-tubes or C-implants; bonded mesh-tube appliances were used in the mandibular dentition. Differences in pretreatment and post-retraction measurements of skeletal, dental, and soft-tissue cephalometric variables were statistically analyzed. Results Both groups showed full retraction of the maxillary anterior teeth by controlled tipping and space closure without altered posterior occlusion. However, the preformed C-wire group had a shorter retraction period (by 3.2 months). Furthermore, the maxillary molars in this group showed no significant mesialization, mesial tipping, or extrusion; some mesialization and mesial tipping occurred in the conventional C-wire group. Conclusions Preformed C-wires combined with maxillary TSADs enable simultaneous leveling and space closure from the beginning of the treatment without maxillary posterior bonding. This allows for faster treatment of dentoalveolar protrusion without unwanted side effects, when compared with conventional C-wire, evidencing its clinical expediency. PMID:25309863

  5. Fabrication, Structural Characterization and Uniaxial Tensile Properties of Novel Sintered Multi-Layer Wire Mesh Porous Plates

    PubMed Central

    Duan, Liuyang; Zhou, Zhaoyao; Yao, Bibo

    2018-01-01

    There is an increasing interest in developing porous metals or metallic foams for functional and structural applications. The study of the physical and mechanical properties of porous metals is very important and helpful for their application. In this paper, a novel sintered multilayer wire mesh porous plate material (WMPPs) with a thickness of 0.5 mm–3 mm and a porosity of 10–35% was prepared by winding, pressing, rolling, and subsequently vacuum sintering them. The pore size and total size distribution in the as-prepared samples were investigated using the bubble point method. The uniaxial tensile behavior of the WMPPs was investigated in terms of the sintering temperature, porosity, wire diameter, and manufacturing technology. The deformation process and the failure mechanism under the tensile press was also discussed based on the appearance of the fractures (SEM figures). The results indicated that the pore size and total size distribution were closely related to the raw material used and the sintering temperature. For the WMPPs prepared by the wire mesh, the pore structures were inerratic and the vast majority of pore size was less than 10 μm. On the other hand, for the WMPPs that were prepared by wire mesh and powder, the pore structures were irregular and the pore size ranged from 0 μm–50 μm. The experimental data showed that the tensile strength of WMPPs is much higher than any other porous metals or metallic foams. Higher sintering temperatures led to coarser joints between wires and resulted in higher tensile strength. The sintering temperature decreased from 1330 °C to 1130 °C and the tensile strength decreased from 296 MPa to 164 MPa. Lower porosity means that there are more metallurgical joints and metallic frameworks resisting deformation per unit volume. Therefore, lower porosities exhibit higher tensile strength. An increase of porosity from 17.14% to 32.5% led to the decrease of the tensile strength by 90 MPa. The coarser wires led to a

  6. Fabrication, Structural Characterization and Uniaxial Tensile Properties of Novel Sintered Multi-Layer Wire Mesh Porous Plates.

    PubMed

    Duan, Liuyang; Zhou, Zhaoyao; Yao, Bibo

    2018-01-17

    There is an increasing interest in developing porous metals or metallic foams for functional and structural applications. The study of the physical and mechanical properties of porous metals is very important and helpful for their application. In this paper, a novel sintered multilayer wire mesh porous plate material (WMPPs) with a thickness of 0.5 mm-3 mm and a porosity of 10-35% was prepared by winding, pressing, rolling, and subsequently vacuum sintering them. The pore size and total size distribution in the as-prepared samples were investigated using the bubble point method. The uniaxial tensile behavior of the WMPPs was investigated in terms of the sintering temperature, porosity, wire diameter, and manufacturing technology. The deformation process and the failure mechanism under the tensile press was also discussed based on the appearance of the fractures (SEM figures). The results indicated that the pore size and total size distribution were closely related to the raw material used and the sintering temperature. For the WMPPs prepared by the wire mesh, the pore structures were inerratic and the vast majority of pore size was less than 10 μm. On the other hand, for the WMPPs that were prepared by wire mesh and powder, the pore structures were irregular and the pore size ranged from 0 μm-50 μm. The experimental data showed that the tensile strength of WMPPs is much higher than any other porous metals or metallic foams. Higher sintering temperatures led to coarser joints between wires and resulted in higher tensile strength. The sintering temperature decreased from 1330 °C to 1130 °C and the tensile strength decreased from 296 MPa to 164 MPa. Lower porosity means that there are more metallurgical joints and metallic frameworks resisting deformation per unit volume. Therefore, lower porosities exhibit higher tensile strength. An increase of porosity from 17.14% to 32.5% led to the decrease of the tensile strength by 90 MPa. The coarser wires led to a bigger

  7. Effect of the Microstructure on Diffusion Bonded AA5083, AA6082 and AA7075 Aluminium Alloys

    NASA Astrophysics Data System (ADS)

    Venugopal, S.; Mahendran, G.

    2018-05-01

    Rolled plates of aluminium alloys AA5083, AA6082 and AA7075 of 5 mm thickness are joined by diffusion bonding at varied parameters. The microstructure evolution of AA5083, AA6082 and AA7075 aluminium alloys is characterized by Transmission Electron Microscopy (TEM). Metallurgical investigations and mechanical tests are also performed to correlate the results of the TEM investigations with the mechanical properties of the produced diffusion bonded joints. It is observed that the bonding and shear strength of the alloys increase with the increase in bonding temperature, due to the diffusion of micro-constituents in the interface. High temperature enhances the uniform distribution of secondary phase particles and reduces pore formation/defects in the bonded joints.

  8. A One Chip Hardened Solution for High Speed SpaceWire System Implementations. Session: Components

    NASA Technical Reports Server (NTRS)

    Marshall, Joseph R.; Berger, Richard W.; Rakow, Glenn P.

    2007-01-01

    An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASIC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a router with 4 SpaceWire ports and two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, and a memory controller for additional external memory use. The SpaceWire cores are also reused in other ASICs under development. The SpaceWire ASIC is planned for use on the Geostationary Operational Environmental Satellites (GOES)-R, the Lunar Reconnaissance Orbiter (LRO) and other missions. Engineering and flight parts have been delivered to programs and users. This paper reviews the SpaceWire protocol and those elements of it that have been built into the current and next SpaceWire reusable cores and features within the core that go beyond the current standard and can be enabled or disabled by the user. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be reviewed and highlighted. Optional configurations within user systems and test boards will be shown. The physical implementation of the design will be described and test results from the hardware will be discussed. Application of this ASIC and other ASICs containing the SpaceWire cores and embedded microcontroller to Plug and Play and reconfigurable implementations will be described. Finally, the BAE Systems roadmap for SpaceWire developments will be updated, including some products already in design as well as longer term plans.

  9. Review on failure prediction techniques of composite single lap joint

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ab Ghani, A.F., E-mail: ahmadfuad@utem.edu.my; Rivai, Ahmad, E-mail: ahmadrivai@utem.edu.my

    2016-03-29

    Adhesive bonding is the most appropriate joining method in construction of composite structures. The use of reliable design and prediction technique will produce better performance of bonded joints. Several papers from recent papers and journals have been reviewed and synthesized to understand the current state of the art in this area. It is done by studying the most relevant analytical solutions for composite adherends with start of reviewing the most fundamental ones involving beam/plate theory. It is then extended to review single lap joint non linearity and failure prediction and finally on the failure prediction on composite single lap joint.more » The review also encompasses the finite element modelling part as tool to predict the elastic response of composite single lap joint and failure prediction numerically.« less

  10. Welding, Bonding and Fastening, 1984

    NASA Technical Reports Server (NTRS)

    Buckley, J. D. (Editor); Stein, B. A. (Editor)

    1985-01-01

    A compilation of papers presented in a joint NASA, American Society for Metals, The George Washington University, American Welding Soceity, and Society of Manufacturing Engineers conference on Welding, Bonding, and Fastening at Langley Research Center, Hampton, VA, on October 23 to 25, 1984 is given. Papers were presented on technology developed in current research programs relevant to welding, bonding, and fastening of structural materials required in fabricating structures and mechanical systems used in the aerospace, hydrospace, and automotive industries. Topics covered in the conference included equipment, hardware and materials used when welding, brazing, and soldering, mechanical fastening, explosive welding, use of unique selected joining techniques, adhesives bonding, and nondestructive evaluation. A concept of the factory of the future was presented, followed by advanced welding techniques, automated equipment for welding, welding in a cryogenic atmosphere, blind fastening, stress corrosion resistant fasteners, fastening equipment, explosive welding of different configurations and materials, solid-state bonding, electron beam welding, new adhesives, effects of cryogenics on adhesives, and new techniques and equipment for adhesive bonding.

  11. Strength and failure analysis of composite-to-composite adhesive bonds with different surface treatments

    NASA Astrophysics Data System (ADS)

    Paranjpe, Nikhil; Alamir, Mohammed; Alonayni, Abdullah; Asmatulu, Eylem; Rahman, Muhammad M.; Asmatulu, Ramazan

    2018-03-01

    Adhesives are widely utilized materials in aviation, automotive, energy, defense, and marine industries. Adhesive joints are gradually supplanting mechanical fasteners because they are lightweight structures, thus making the assembly lighter and easier. They also act as a sealant to prevent a structural joint from galvanic corrosion and leakages. Adhesive bonds provide high joint strength because of the fact that the load is distributed uniformly on the joint surface, while in mechanical joints, the load is concentrated at one point, thus leading to stress at that point and in turn causing joint failures. This research concentrated on the analysis of bond strength and failure loads in adhesive joint of composite-to-composite surfaces. Different durations of plasma along with the detergent cleaning were conducted on the composite surfaces prior to the adhesive applications and curing processes. The joint strength of the composites increased about 34% when the surface was plasma treated for 12 minutes. It is concluded that the combination of different surface preparations, rather than only one type of surface treatment, provides an ideal joint quality for the composites.

  12. Carbon nanotube wires and cables: Near-term applications and future perspectives

    NASA Astrophysics Data System (ADS)

    Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

    2011-11-01

    development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a method for reducing contact resistance by tailoring the CNT-metal interface via electroless plating. Collectively, these results summarize recent progress in CNT wiring technologies and illustrate that nanoscale conductors may become a disruptive technology in cabling designs.

  13. Carbon nanotube wires and cables: near-term applications and future perspectives.

    PubMed

    Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

    2011-11-01

    require development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a method for reducing contact resistance by tailoring the CNT-metal interface via electroless plating. Collectively, these results summarize recent progress in CNT wiring technologies and illustrate that nanoscale conductors may become a disruptive technology in cabling designs.

  14. TEM Analysis of Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers

    NASA Technical Reports Server (NTRS)

    Ozaki, T.; Tsuda, H.; Halbig, M. C.; Singh, M.; Hasegawa, Y; Mori, S.; Asthana, R.

    2017-01-01

    Silicon Carbide (SiC) is a promising material for thermostructural applications due to its excellent high-temperature mechanical properties, oxidation resistance, and thermal stability. However, joining and integration technologies are indispensable for this material in order to fabricate large size and complex shape components with desired functionalities. Although diffusion bonding techniques using metallic interlayers have been commonly utilized to bond various SiC ceramics, detailed microstructural observation by Transmission Electron Microscopy (TEM) of the bonded area has not been carried out due to difficulty in preparing TEM samples. In this study, we tried to prepare TEM samples from joints of diffusion bonded SiC ceramics by Focused Ion Beam (FIB) system and carefully investigated the interfacial microstructure by TEM analysis. The samples used in this study were SiC fiber bonded ceramics (SA-Tyrannohex: SA-THX) diffusion bonded with metallic interlayers such as Ti, TiMo, Mo-B and TiCu. In this presentation, we report the microstructure of diffusion bonded SA-THX mainly with TiCu interlayers obtained by TEM observations, and the influence of metallic interlayers on the joint microstructure and microhardness will be discussed.

  15. The detection and quantification of the defects in adhesive bonded joints of the piezoelectric sensors by infrared thermographic nondestructive testing

    NASA Astrophysics Data System (ADS)

    Vinod, P. N.; Joseph, Sherin; John, Reji

    2017-04-01

    In this paper, efficacy of pulsed thermography technique has been explored for the first time for the detection and quantification of the subsurface defects present in the rubber-encapsulated piezoelectric sensors. Initial experiments were performed on adhesively bonded joints of the rubber/Al or rubber/PZT control samples to find out an optimum acquisition time for the 3-mm rubber encapsulants. Thermographic measurements were performed in the reflection mode and acquired thermal images were analysed and processed images were described in terms of the phase images. The defective regions are identified as delamination of the adhesive joints at the interface of rubber and PZT stacks, and presence of porosity in the encapsulation in the inspected hydrophone. The defect depths of the observed anomalies were calculated empirically from the plots of the peak time of thermal contrast (tmax) maximum and thermal contrast maximum (Cmax) for a particular defect. The estimated defect depths of the prominent porosity observed in the PZT hydrophone are found nearly 1 mm from the surface.

  16. Design, fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

    NASA Technical Reports Server (NTRS)

    Koumal, D. E.

    1979-01-01

    The design and evaluation of built-up attachments and bonded joint concepts for use at elevated temperatures is documented. Joint concept screening, verification of GR/PI material, fabrication of design allowables panels, definition of test matrices, and analysis of bonded and bolted joints are among the tasks completed. The results provide data for the design and fabrication of lightly loaded components for advanced space transportation systems and high speed aircraft.

  17. Influence of metal bonding layer on strain transfer performance of FBG

    NASA Astrophysics Data System (ADS)

    Liu, Hao; Chen, Weimin; Zhang, Peng; Liu, Li; Shu, Yuejie; Wu, Jun

    2013-01-01

    Metal bonding layer seriously affects the strain transfer performance of Fiber Bragg Grating (FBG). Based on the mode of FBG strain transfer, the influence of the length, the thickness, Poisson's ratio, elasticity modulus of metal bonding layer on the strain transfer coefficient of FBG is analyzed by numerical simulation. FBG is packaged to steel wire using metal bonding technology of FBG. The tensile tests of different bonding lengths and elasticity modulus are carried out. The result shows the strain transfer coefficient of FBGs are 0.9848,0.962 and their average strain sensitivities are 1.076 pm/μɛ,1.099 pm/μɛ when the metal bonding layer is zinc, whose lengths are 15mm, 20mm, respectively. The strain transfer coefficient of FBG packaged by metal bonding layer raises 8.9 percent compared to epoxy glue package. The preliminary experimental results show that the strain transfer coefficient increases with the length of metal bonding layer, decreases with the thickness of metal bonding layer and the influence of Poisson's ratio can be ignored. The experiment result is general agreement with the analysis and provides guidance for metal package of FBG.

  18. A Review of Natural Joint Systems and Numerical Investigation of Bio-Inspired GFRP-to-Steel Joints

    PubMed Central

    Avgoulas, Evangelos I.; Sutcliffe, Michael P. F.

    2016-01-01

    There are a great variety of joint types used in nature which can inspire engineering joints. In order to design such biomimetic joints, it is at first important to understand how biological joints work. A comprehensive literature review, considering natural joints from a mechanical point of view, was undertaken. This was used to develop a taxonomy based on the different methods/functions that nature successfully uses to attach dissimilar tissues. One of the key methods that nature uses to join dissimilar materials is a transitional zone of stiffness at the insertion site. This method was used to propose bio-inspired solutions with a transitional zone of stiffness at the joint site for several glass fibre reinforced plastic (GFRP) to steel adhesively bonded joint configurations. The transition zone was used to reduce the material stiffness mismatch of the joint parts. A numerical finite element model was used to identify the optimum variation in material stiffness that minimises potential failure of the joint. The best bio-inspired joints showed a 118% increase of joint strength compared to the standard joints. PMID:28773688

  19. A Review of Natural Joint Systems and Numerical Investigation of Bio-Inspired GFRP-to-Steel Joints.

    PubMed

    Avgoulas, Evangelos I; Sutcliffe, Michael P F

    2016-07-12

    There are a great variety of joint types used in nature which can inspire engineering joints. In order to design such biomimetic joints, it is at first important to understand how biological joints work. A comprehensive literature review, considering natural joints from a mechanical point of view, was undertaken. This was used to develop a taxonomy based on the different methods/functions that nature successfully uses to attach dissimilar tissues. One of the key methods that nature uses to join dissimilar materials is a transitional zone of stiffness at the insertion site. This method was used to propose bio-inspired solutions with a transitional zone of stiffness at the joint site for several glass fibre reinforced plastic (GFRP) to steel adhesively bonded joint configurations. The transition zone was used to reduce the material stiffness mismatch of the joint parts. A numerical finite element model was used to identify the optimum variation in material stiffness that minimises potential failure of the joint. The best bio-inspired joints showed a 118% increase of joint strength compared to the standard joints.

  20. Investigation on the diffusion bonding of tungsten and EUROFER97

    NASA Astrophysics Data System (ADS)

    Basuki, Widodo Widjaja; Aktaa, Jarir

    2011-10-01

    Due to its advantages, tungsten is selected as armor and structural material for use in future fusion power plants. To apply tungsten as structural material, a joint to EUROFER97 is foreseen in current divertor design for which the diffusion bonding is considered in this work. The joining must have acceptable strength and ductility without significant change in microstructures. So far, numerous diffusion bonding experiments without and with post bonding heat treatment (PBHT) are performed at 1050 °C for various bonding duration. For the bonding processes without PBHT, the bonding seams obtained are defect free and have a very high tensile strength. However they are brittle due to a thin layer of FeW intermetallic phase and metal carbides. For the bonding processes with PBHT, the bonding specimens fail at the bonding seam.

  1. Monitoring of fatigue damage in composite lap-joints using guided waves and FBG sensors

    NASA Astrophysics Data System (ADS)

    Karpenko, Oleksii; Khomenko, Anton; Koricho, Ermias; Haq, Mahmoodul; Udpa, Lalita

    2016-02-01

    Adhesive bonding is being increasingly employed in many applications as it offers possibility of light-weighting and efficient multi-material joining along with reduction in time and cost of manufacturing. However, failure initiation and progression in critical components like joints, specifically in fatigue loading is not well understood, which necessitates reliable NDE and SHM techniques to ensure structural integrity. In this work, concurrent guided wave (GW) and fiber Bragg grating (FBG) sensor measurements were used to monitor fatigue damage in adhesively bonded composite lap-joints. In the present set-up, one FBG sensor was strategically embedded in the adhesive bond-line of a lap-joint, while two other FBGs were bonded on the surface of the adherends. Full spectral responses of FBG sensors were collected and compared at specific intervals of fatigue loading. In parallel, guided waves were actuated and sensed using PZT wafers mounted on the composite adherends. Experimental results demonstrated that time-of-flight (ToF) of the fundamental modes transmitted through the bond-line and spectral response of FBG sensors were sensitive to fatigue loading and damage. Combination of guided wave and FBG measurements provided the desired redundancy and synergy in the data to evaluate the degradation in bond-line properties. Measurements taken in the presence of continuously applied load replicated the in-situ/service conditions. The approach shows promise in understanding the behavior of bonded joints subjected to complex loading.

  2. Retort braze bonding of borsic/aluminum composite sheet to titanium

    NASA Technical Reports Server (NTRS)

    Webb, B. A.; Dolowy, J. F., Jr.

    1975-01-01

    Braze bonding studies between Borsic/aluminum composite and titanium sheet were conducted to establish acceptable brazing techniques and to assess potential joint efficiencies. Excellent braze joints were produced which exhibited joint strengths exceeding 117 MPa (17,000 psi) and which retained up to 2/3 of this strength at 589 K (600 F). Noticeable composite strength degradation resulting from the required high temperature braze cycle was found to be a problem.

  3. Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.

    PubMed

    Wu, Bingzhi; Leng, Xuesong; Xiu, Ziyang; Yan, Jiuchun

    2018-06-01

    SiC ceramics were successfully soldered with the assistance of ultrasound. Two kinds of filler metals, namely non-eutectic Zn-5Al-3Cu and eutectic Zn-5Al alloys, were used. The effects of ultrasonic action on the microstructure and mechanical properties of the soldered joints were investigated. The results showed that ultrasound could promote the wetting and bonding between the SiC ceramic and filler metals within tens of seconds. For the Zn-5Al-3Cu solder, a fully grain-refined structure in the bond layer was obtained as the ultrasonic action time increased. This may lead to a substantial enhancement in the strength of the soldered joints. For the Zn-5Al solder, the shear strength of the soldered joints was only ∼102 MPa when the ultrasonic action time was shorter, and fractures occurred in the brittle lamellar eutectic phases in the center of the bond layer. With increasing ultrasonic action time, the lamellar eutectic phase in the bond layer of SiC joints could be completely transformed to a fine non-lamellar eutectic structure. Meanwhile, the grains in the bond layer were obviously refined. Those results led to the remarkable enhancement of the shear strength of the joints (∼138 MPa) using the Zn-5Al solder, which had approached that enhancement using the Zn-5Al-3Cu solder. The enhanced mechanical properties of the joints were attributed to the significant refinement of the grains and the change in the eutectic structure in the bond layer. Prolonged enhanced heterogeneous nucleation triggered by ultrasonic cavitation is the predominant refinement mechanism of the bond metals of the SiC joints. Copyright © 2018 Elsevier B.V. All rights reserved.

  4. M3FT-16OR020202112 - Report on viability of hydrothermal corrosion resistant SiC/SiC Joint development

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Katoh, Yutai; Koyanagi, Takaaki; Kiggans Jr, James O.

    2016-06-30

    Hydrothermal corrosion of four types of the silicon carbide (SiC) to SiC plate joints were investigated under PWR and BWR relevant chemical conditions without irradiation. The joints were formed by metal diffusion bonding using molybdenum or titanium interlayer, reaction sintering using Ti-Si-C system, and SiC nanopowder sintering. Most of the formed joints withstood the corrosion tests for five weeks. The recession of the SiC substrates was limited. Based on the recession rate of the bonding layers, it was concluded that all the joints except for the molybdenum diffusion bond are promising under the reducing activity environments. The SiC nanopowder sinteredmore » joint was the most corrosion tolerant under the oxidizing activity environment among the four joints.« less

  5. Fluxless Bonding Processes Using Silver-Indium System for High Temperature Electronics and Silver Flip-Chip Interconnect Technology

    NASA Astrophysics Data System (ADS)

    Wu, Yuan-Yun

    In this dissertation, fluxless silver (Ag)-indium (In) binary system bonding and Ag solid-state bonding are used between different bonded pairs which have large thermal expansion coefficient (CTE) mismatch and flip-chip interconnect bonding application. In contrast to the conventional soldering process, fluxless bonding technique eliminates contamination and reliability problems caused by flux to fabricate high quality joints. There are two section are reported. In the first section, the reactions of Ag-In binary system are presented. In the second section, the high melting temperature, thermal and electrical conductivity joint materials bonding by either Ag-In binary system bonding or solid-state bonding processes for different bonded pairs and flip-chip application are designed, developed, and reported. Our group have studied Ag-In system for several years and developed the bonding processes successfully. However, the detailed reactions of Ag and In were seldom studied. To design a proper bonding structure, it is necessary to understand the reaction between Ag and In. The systematic experiments were performed to investigate these reactions. A 40 um Ag layer was electroplated on copper (Cu) substrates, followed by indium layers of 1, 3, 5, 10, and 15 um, respectively. The samples were annealed at 180 °C in 0.1 torr vacuum. For samples with In thickness less than 5 mum, the joint compositions are Ag2In only (1 um) or AgIn2, Ag2In, and Ag solid solution (Ag) after annealing. No indium is identified. For 10 and 15 um thick In samples, In covers almost over the entire sample surface after annealing. Later, an Ag layer was annealed at 450 °C for 3 hours to grow Ag grains, followed by plating 10 um In and annealing at 180 °C. By annealing Ag before plating In, more In is kept in the structure during annealing at 180 °C. Based on above results, for those designs with In thinner than 5 um, the Ag layer needs to be annealed, prior to In plating in order to make a

  6. Universal behavior of surface-dangling bonds in hydrogen-terminated Si, Ge, and Si/Ge nanowires.

    NASA Astrophysics Data System (ADS)

    Nunes, Ricardo; Kagimura, Ricardo; Chacham, Hélio

    2007-03-01

    We report an ab initio study of the electronic properties of surface dangling bond (SDB) states in hydrogen-terminated Si, Ge, and Si/Ge nanowires with diameters between 1 and 2 nm. We find that the charge transition levels ɛ(+/-) of SDB states are deep in the bandgap for Si wires, and shallow (near the valence band edge) for Ge wires. In both Si and Ge wires, the SDB states are localized. We also find that the SDB ɛ(+/-) levels behave as a ``universal" energy reference level among Si, Ge, and Si/Ge wires within a precision of 0.1 eV. By computing the average bewteen the electron affinity and ionization energy in the atomi limit of several atoms from the III, IV and V columns, we conjecture that the universality is a periodic-table atomic property.

  7. Concealed wire tracing apparatus

    DOEpatents

    Kronberg, J.W.

    1994-05-31

    An apparatus and method that combines a signal generator and a passive signal receiver to detect and record the path of partially or completely concealed electrical wiring without disturbing the concealing surface is disclosed. The signal generator applies a series of electrical pulses to the selected wiring of interest. The applied pulses create a magnetic field about the wiring that can be detected by a coil contained within the signal receiver. An audible output connected to the receiver and driven by the coil reflects the receivers position with respect to the wiring. The receivers audible signal is strongest when the receiver is directly above the wiring and the long axis of the receivers coil is parallel to the wiring. A marking means is mounted on the receiver to mark the location of the wiring as the receiver is directed over the wiring's concealing surface. Numerous marks made on various locations of the concealing surface will trace the path of the wiring of interest. 4 figs.

  8. Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application

    NASA Astrophysics Data System (ADS)

    Lee, Jong-Bum; Aw, Jie-Li; Rhee, Min-Woo

    2014-09-01

    Room-temperature die-attach bonding using ultrasonic energy was evaluated on Cu/In and Cu/Sn-3Ag metal stacks. The In and Sn-3Ag layers have much lower melting temperatures than the base material (Cu) and can be melted through the heat generated during ultrasonic bonding, forming intermetallic compounds (IMCs). Samples were bonded using different ultrasonic powers, bonding times, and forces and subsequently aged at 300°C for 500 h. After aging, die shear testing was performed and the fracture surfaces were inspected by scanning electron microscopy. Results showed that the shear strength of Cu/In joints reached an upper plateau after 100 h of thermal aging and remained stable with aging time, whereas that of the Cu/Sn-3Ag joints decreased with increasing aging time. η-Cu7In4 and (Cu,Au)11In9 IMCs were observed at the Cu/In joint, while Cu3Sn and (Ag,Cu)3Sn IMCs were found at the Cu/Sn-3Ag joint after reliability testing. As Cu-based IMCs have high melting temperatures, they are highly suitable for use in high-temperature electronics, but can be formed at room temperature using an ultrasonic approach.

  9. Laser surface texturing of polypropylene to increase adhesive bonding

    NASA Astrophysics Data System (ADS)

    Mandolfino, Chiara; Pizzorni, Marco; Lertora, Enrico; Gambaro, Carla

    2018-05-01

    In this paper, the main parameters of laser surface texturing of polymeric substrates have been studied. The final aim of the texturing is to increase the performance of bonded joints of grey-pigmented polypropylene substrates. The experimental investigation was carried out starting from the identification of the most effective treatment parameters, in order to achieve a good texture without compromising the characteristics of the bulk material. For each of these parameters, three values were individuated and 27 sets of samples were realised. The surface treatment was analysed and related to the mechanical characteristics of the bonded joints performing lap-shear tests. A statistical analysis in order to find the most influential parameter completed the work.

  10. Design fabrication and test of graphite/polyimide composite joints and attachments for advanced aerospace vehicles

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Graphite/polyimide (Gr/PI) bolted and bonded joints were investigated. Possible failure modes and the design loads for the four generic joint types are discussed. Preliminary sizing of a type 1 joint, bonded and bolted configuration is described, including assumptions regarding material properties and sizing methodology. A general purpose finite element computer code is described that was formulated to analyze single and double lap joints, with and without tapered adherends, and with user-controlled variable element size arrangements. An initial order of Celion 6000/PMR-15 prepreg was received and characterized.

  11. Shear Bond Strength of Intraoral Laser Welding and its Effect on Intrapulpal Temperature Rise in Primary Teeth: An in Vitro Study.

    PubMed

    Aglarci, Cahide; Yildiz, Esma; Isman, Eren; Kazak, Mine

    2016-03-01

    This study compared the shear bond strength (SBS) of conventional welding (CW) and intraoral laser welding (LW) on fixed space maintainers (SMs), and investigated the intrapulpal temperature change (ITC) during LW. Lasers have been used for intraoral welding. The SBS test used 26 molar bands divided into two groups, CW and LW. Stainless steel wires were welded to the middle of the buccal and lingual aspects of all the bands, using an Nd:YAG laser for the LW group and silver solder and flux soldering media for the CW group. The samples, fixed to acrylic resin blocks, were subjected to shear testing. In the ITC test, 25 exfoliated primary second molar teeth were used to adapt molar bands. J-type thermocouple wire was positioned in the pulp chamber. ITCs were determined during Nd:YAG laser welding of stainless steel wires to the bands. Mann-Whitney U test was used to determine differences in SBS between the groups. ITCs were analyzed by paired t test. The SBS between groups showed significant differences (LW: 489.47 ± 135.70; CW: 49.71 ± 17.76; p < 0.001). The mean ITC during LW was 3.64 ± 0.79 (min: 2.4; max: 5.10). None of the samples' ITCs exceeded the critical threshold value (5.5 °C). LW obtained a higher-strength joint than CW. ITCs during LW do not present a thermal risk to primary teeth. The intraoral use of LW for SMs in primary teeth is recommended in terms of strength and ITCs.

  12. Cable Bundle Wire Derating

    NASA Technical Reports Server (NTRS)

    Lundquist, Ray A.; Leidecker, Henning

    1999-01-01

    The allowable operating currents of electrical wiring when used in the space vacuum environment is predominantly determined by the maximum operating temperature of the wire insulation. For Kapton insulated wire this value is 200 degree C. Guidelines provided in the Goddard Space Flight Center (GSFC) Preferred Parts List (PPL) limit the operating current of wire within vacuum to ensure the maximum insulation temperature is not exceeded. For 20 AWG wire, these operating parameters are: (1) 3.7 amps per wire (2) bundle of 15 or more wires (3) 70 C environment (4) vacuum of 10(exp -5) torr or less To determine the behavior and temperature of electrical wire at different operating conditions, a thermal vacuum test was performed on a representative electrical harness of the Hubble Space Telescope (HST) power distribution system. This paper describes the test and the results.

  13. Cable Bundle Wire Derating

    NASA Technical Reports Server (NTRS)

    Lundquist, Ray A.; Leidecker, Henning

    1998-01-01

    The allowable operating currents of electrical wiring when used in the space vacuum environment is predominantly determined by the maximum operating temperature of the wire insulation. For Kapton insulated wire this value is 200 C. Guidelines provided in the Goddard Space Flight Center (GSFC) Preferred Parts List (PPL) limit the operating current of wire within vacuum to ensure the maximum insulation temperature is not exceeded. For 20 AWG wire, these operating parameters are: (1) 3.7 amps per wire; (2) bundle of 15 or more wires; (3) 70 C environment: and (4) vacuum of 10(exp -5) torr or less. To determine the behavior and temperature of electrical wire at different operating conditions, a thermal vacuum test was performed on a representative electrical harness of the Hubble Space Telescope (HST) power distribution system. This paper describes the test and the results.

  14. Cable Bundle Wire Derating

    NASA Technical Reports Server (NTRS)

    Lundquist, Ray A.; Leidecker, Henning

    1998-01-01

    The allowable operating currents of electrical wiring when used in the space vacuum environment is predominantly determined by the maximum operating temperature of the wire insulation. For Kapton insulated wire this value is 200 C. Guidelines provided in the Goddard Space Flight Center (GSFC) Preferred Parts List (PPL) limit the operating current of wire within vacuum to ensure the maximum insulation temperature is not exceeded. For 20 AWG wire, these operating parameters are: 3.7 amps per wire, bundle of 15 or more wires, 70 C environment, and vacuum of 10(exp -5) torr or less. To determine the behavior and temperature of electrical wire at different operating conditions, a thermal vacuum test was performed on a representative electrical harness of the Hubble Space Telescope (HST) power distribution system. This paper describes the test and the results.

  15. Characteristics of solder joints under fatigue loads using piezomechanical actuation

    NASA Astrophysics Data System (ADS)

    Shim, Dong-Jin; Spearing, S. Mark

    2003-07-01

    Crack initiation and growth characteristics of solder joints under fatigue loads are investigated using piezomechanical actuation. Cracks in solder joints, which can cause failure in microelectronics components, are induced via piezoelectricity in piezo-ceramic bonded joints. Lead-zirconate-titanate ceramic plates and eutectic Sn-Pb solder bonded in a double-lap shear configuration are used in the investigation. Electric field across each piezo-ceramic plate is applied such that shear stresses/strains are induced in the solder joints. The experiments show that cracks initiate in the solder joints around defects such as voids and grow in length until they coalesce with other cracks from adjacent voids. These observations are compared with the similar thermal cycling tests from the literature to show feasibility and validity of the current method in investigating the fatigue characteristics of solder joints. In some specimens, cracks in the piezo-ceramic plates are observed, and failure in the specimens generally occurred due to piezo-ceramic plate fracture. The issues encountered in implementing this methodology such as low actuation and high processing temperatures are further discussed.

  16. Recrystallization characteristics and interfacial oxides on the compression bonding interface

    NASA Astrophysics Data System (ADS)

    Xie, Bijun; Sun, Mingyue; Xu, Bin; Li, Dianzhong

    2018-05-01

    Up to now, the mechanism of interface bonding is still not fully understood. This work presents interfacial characteristics of 316LN stainless steel bonding joint after cold compression bonding with subsequent annealing. EBSD analysis shows that fine recrystallization grains preferentially appear near the bonding interface and grow towards both sides of the interface. Transmission electron microscopy reveals that initial cold compression bonding disintegrates the native oxide scales and brings pristine metal from both sides of the interface come into intimate contact, while the broken oxide particles are remained at the original interface. The results indicate that partial bonding can be achieved by cold compression bonding with post-annealing treatment and recrystallization firstly occurs along the bonding interface. However, the interfacial oxides impede the recrystallization grains step over the interface and hinder the complete healing of the bonding interface.

  17. Laser welding of NiTi shape memory alloy: Comparison of the similar and dissimilar joints to AISI 304 stainless steel

    NASA Astrophysics Data System (ADS)

    Mirshekari, G. R.; Saatchi, A.; Kermanpur, A.; Sadrnezhaad, S. K.

    2013-12-01

    The unique properties of NiTi alloy, such as its shape memory effect, super-elasticity and biocompatibility, make it ideal material for various applications such as aerospace, micro-electronics and medical device. In order to meet the requirement of increasing applications, great attention has been given to joining of this material to itself and to other materials during past few years. Laser welding has been known as a suitable joining technique for NiTi shape memory alloy. Hence, in this work, a comparative study on laser welding of NiTi wire to itself and to AISI 304 austenitic stainless steel wire has been made. Microstructures, mechanical properties and fracture morphologies of the laser joints were investigated using optical microscopy, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction analysis (XRD), Vickers microhardness (HV0.2) and tensile testing techniques. The results showed that the NiTi-NiTi laser joint reached about 63% of the ultimate tensile strength of the as-received NiTi wire (i.e. 835 MPa) with rupture strain of about 16%. This joint also enabled the possibility to benefit from the pseudo-elastic properties of the NiTi component. However, tensile strength and ductility decreased significantly after dissimilar laser welding of NiTi to stainless steel due to the formation of brittle intermetallic compounds in the weld zone during laser welding. Therefore, a suitable modification process is required for improvement of the joint properties of the dissimilar welded wires.

  18. Two-Wire to Four-Wire Audio Converter

    NASA Technical Reports Server (NTRS)

    Talley, G. L., Jr; Seale, B. L.

    1983-01-01

    Simple circuit provides interface between normally incompatible voicecommunication lines. Circuit maintains 40 dB of isolation between input and output halves of four-wire line permitting two-wire line to be connected. Balancing potentiometer, Rg, adjusts gain of IC2 to null feed through from input to output. Adjustment is done on workbench just after assembly.

  19. Corrosion behaviour of friction-bit-joined and weld-bonded AA7075-T6/galvannealed DP980

    DOE PAGES

    Lim, Yong Chae; Squires, Lile; Pan, Tsung-Yu; ...

    2016-12-22

    Joining of aluminium alloys 7075-T6 and galvannealed dual phase 980 steel was achieved by friction bit joining (FBJ) and weld-bonding (FBJ + adhesive) processes. Accelerated laboratory-scale corrosion tests were performed on both FBJ only and weld-bonded specimens to study joint strength under a corrosive environment. Static lap shear tests showed that both FBJ only and weld-bonded cases generally retained more than 80% of the joint strength of non-corroded specimens at the end of corrosion testing. The presence of Zn/Fe coating on the steel substrate resulted in improved corrosion resistance for FBJ specimens, compared to joints produced with bare steel. Finally,more » an optical microscopy was used for cross-sectional analysis of corroded specimens. Some corrosion on the joining bit was observed near the bit head. However, the joining bit was still intact on the steel substrate, indicating that the primary bond was sound.« less

  20. Corrosion behaviour of friction-bit-joined and weld-bonded AA7075-T6/galvannealed DP980

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Lim, Yong Chae; Squires, Lile; Pan, Tsung-Yu

    Joining of aluminium alloys 7075-T6 and galvannealed dual phase 980 steel was achieved by friction bit joining (FBJ) and weld-bonding (FBJ + adhesive) processes. Accelerated laboratory-scale corrosion tests were performed on both FBJ only and weld-bonded specimens to study joint strength under a corrosive environment. Static lap shear tests showed that both FBJ only and weld-bonded cases generally retained more than 80% of the joint strength of non-corroded specimens at the end of corrosion testing. The presence of Zn/Fe coating on the steel substrate resulted in improved corrosion resistance for FBJ specimens, compared to joints produced with bare steel. Finally,more » an optical microscopy was used for cross-sectional analysis of corroded specimens. Some corrosion on the joining bit was observed near the bit head. However, the joining bit was still intact on the steel substrate, indicating that the primary bond was sound.« less

  1. 2. TYPICAL OVERHEAD WIRE CONSTRUCTION CURVE GUY WIRE ARRANGEMENT ...

    Library of Congress Historic Buildings Survey, Historic Engineering Record, Historic Landscapes Survey

    2. TYPICAL OVERHEAD WIRE CONSTRUCTION - CURVE GUY WIRE ARRANGEMENT (ABANDONED WEST LEG OF WYE AT SIXTH AVENUE AND PINE STREET) - Yakima Valley Transportation Company Interurban Railroad, Trackage, Yakima, Yakima County, WA

  2. On the use of the EMI for the health monitoring of bonded elements

    NASA Astrophysics Data System (ADS)

    Gulizzi, Vincenzo; Rizzo, Piervincenzo; Milazzo, Alberto

    2014-03-01

    The low weight, robustness and fatigue resistance of adhesive joints make them suitable for structural joints. A fully developed nondestructive evaluation technique however is needed to monitor and assess the quality of bonded joints. In the present paper the application of the electromechanical impedance (EMI) technique is proposed. In the EMI method a piezoelectric transducer (PZT) is attached to the structure of interest. The high sensitivity and low power consumption make the EMI method feasible for real time structural health monitoring. In this study we investigated the sensitivity of the electromechanical response of a PZT to the curing and the quality of the adhesive used for bonded joints. A PXI unit running under LabView and an auxiliary circuit were employed to measure the electric impedance of a PZT glued to an aluminum plate. The system aimed at monitoring the bond line between an aluminum strip and the plate. The conductive signature of the PZT was measured and analyzed during the curing. The experimental results show that the electromechanical impedance technique is sensitive to the curing time and variations are observed for adhesives of different quality.

  3. Wire-inhomogeneity detector

    DOEpatents

    Gibson, G.H.; Smits, R.G.; Eberhard, P.H.

    1982-08-31

    A device for uncovering imperfections in electrical conducting wire, particularly superconducting wire, by detecting variations in eddy currents. Eddy currents effect the magnetic field in a gap of an inductor, contained in a modified commercial ferrite core, through which the wire being tested is passed. A small increase or decrease in the amount of conductive material, such as copper, in a fixed cross section of wire will unbalance a bridge used to measure the impedance of the inductor, tripping a detector and sounding an alarm.

  4. Correction of a Hyperextension Deformity at the Metacarpophalangeal Joint by Arthroplasty for Osteoarthritis of the Thumb Carpometacarpal Joint Followed by External Fixator: A Case Series: Modified Ilizarov Method for Correction of a Collapsed Thumb Deformity Due to Carpometacarpal Osteoarthritis.

    PubMed

    Hamada, Yoshitaka; Kobayashi, Anna; Sairyo, Koichi; Sato, Ryosuke; Hibino, Naohito

    2015-06-01

    A hyperextension deformity in the advanced stages of carpometacarpal (CMC) arthritis of the thumb could affect the outcomes of thumb CMC joint arthroplasty. We introduce the interesting approach for treating severely collapsed thumb deformities with gradual distraction and coordinated correction of the MCP and CMC joints by means of external fixators. We divided 8 cases into 3 groups according to the angle of passive flexion of the hyperextended MCP joint: group 1, 10-20°, group 2a, 20-40°, and group 2b, >40°, retrospectively. We first performed CMC arthroplasty with trapezium excision. In group 1, we corrected the MCP hyperextension deformity by manual passive flexion and fixed the joint with an extension block Kirshner wire (K-wire) for 2 months. However, deformities recurred in 2 of 5 cases after removing the K-wire. These patients received corrective percutaneous osteotomy with external fixators at the metacarpal neck. In groups 2a and 2b, we performed CMC arthroplasty and set external fixators at the same time. All cases in groups 1 and 2a have been without recurrence for more than 2 years, while a deformity recurred in group 2b. The results of this small case series encouraged us to propose an interesting approach for collapsed zigzag thumb deformity. Good outcomes with excellent maintenance of active MCP movement and no recurrence are highly anticipated if the hyperextended thumb has no obvious degenerative changes and can be corrected by <40° of passive flexion. Our results also indicate a risk of recurrence associated with extension block by K-wire.

  5. Fatal hemorrhage following sacroiliac joint fusion surgery: A case report.

    PubMed

    Palmiere, Cristian; Augsburger, Marc; Del Mar Lesta, Maria; Grabherr, Silke; Borens, Olivier

    2017-05-01

    Threaded pins and wires are commonly used in orthopedic practice and their migration intra- or post-operatively may be responsible for potentially serious complications. Vascular and visceral injury from intra-pelvic pin or guide-wire migration during or following hip surgery has been reported frequently in the literature and may result in progression through soft tissues with subsequent perforation of organs and vessels. In this report, we describe an autopsy case involving a 40-year old man suffering from chronic low back pain due to sacroiliac joint disruption. The patient underwent minimally invasive sacroiliac joint arthrodesis. Some intra-operative bleeding was noticed when a drill was retrieved, though the patient died postoperatively. Postmortem investigations allowed the source of bleeding to be identified (a perforation of a branch of the right internal iliac artery) and a potentially toxic tramadol concentration in peripheral blood to be measured. Copyright © 2015 Elsevier Ireland Ltd. All rights reserved.

  6. Wire Test Grip Fixture

    NASA Technical Reports Server (NTRS)

    Burke, Christopher S.

    2011-01-01

    Wire-testing issues, such as the gripping strains imposed on the wire, play a critical role in obtaining clean data. In a standard test frame fitted with flat wedge grips, the gripping action alone creates stresses on the wire specimen that cause the wire to fail at the grip location. A new test frame, which is outfitted with a vacuum chamber, negated the use of any conventional commercially available wire test fixtures, as only 7 in. (17.8 cm) existed between the grip faces. An innovative grip fixture was designed to test thin gauge wire for a variety of applications in an existing Instron test frame outfitted with a vacuum chamber.

  7. Effect of light aging on silicone-resin bond strength in maxillofacial prostheses.

    PubMed

    Polyzois, Gregory; Pantopoulos, Antonis; Papadopoulos, Triantafillos; Hatamleh, Muhanad

    2015-04-01

    The aim of this study was to investigate the effect of accelerated light aging on bond strength of a silicone elastomer to three types of denture resin. A total of 60 single lap joint specimens were fabricated with auto-, heat-, and photopolymerized (n = 20) resins. An addition-type silicone elastomer (Episil-E) was bonded to resins treated with the same primer (A330-G). Thirty specimens served as controls and were tested after 24 hours, and the remaining were aged under accelerated exposure to daylight for 546 hours (irradiance 765 W/m(2) ). Lap shear joint tests were performed to evaluate bond strength at 50 mm/min crosshead speed. Two-way ANOVA and Tukey's test were carried out to detect statistical significance (p < 0.05). ANOVA showed that the main effect of light aging was the most important factor determining the shear bond strength. The mean bond strength values ranged from 0.096 to 0.136 MPa. The highest values were recorded for auto- (0.131 MPa) and photopolymerized (0.136 MPa) resins after aging. Accelerated light aging for 546 hours affects the bond strength of an addition-type silicone elastomer to three different denture resins. The bond strength significantly increased after aging for photo- and autopolymerized resins. All the bonds failed adhesively. © 2014 by the American College of Prosthodontists.

  8. Wire ablation dynamics model and its application to imploding wire arrays of different geometries.

    PubMed

    Esaulov, A A; Kantsyrev, V L; Safronova, A S; Velikovich, A L; Shrestha, I K; Williamson, K M; Osborne, G C

    2012-10-01

    The paper presents an extended description of the amplified wire ablation dynamics model (WADM), which accounts in a single simulation for the processes of wire ablation and implosion of a wire array load of arbitrary geometry and wire material composition. To investigate the role of wire ablation effects, the implosions of cylindrical and planar wire array loads at the university based generators Cobra (Cornell University) and Zebra (University of Nevada, Reno) have been analyzed. The analysis of the experimental data shows that the wire mass ablation rate can be described as a function of the current through the wire and some coefficient defined by the wire material properties. The aluminum wires were found to ablate with the highest rate, while the copper ablation is the slowest one. The lower wire ablation rate results in a higher inward velocity of the ablated plasma, a higher rate of the energy coupling with the ablated plasma, and a more significant delay of implosion for a heavy load due to the ablation effects, which manifest the most in a cylindrical array configuration and almost vanish in a single-planar array configuration. The WADM is an efficient tool suited for wire array load design and optimization in wide parameter ranges, including the loads with specific properties needed for the inertial confinement fusion research and laboratory astrophysics experiments. The data output from the WADM simulation can be used to simplify the radiation magnetohydrodynamics modeling of the wire array plasma.

  9. Windows: Life after Wire.

    ERIC Educational Resources Information Center

    Razwick, Jerry

    2003-01-01

    Although wired glass is extremely common in school buildings, the International Building Code adopted new standards that eliminate the use of traditional wired glass in K-12 schools, daycare centers, and athletic facilities. Wired glass breaks easily, and the wires can cause significant injuries by forming dangerous snags when the glass breaks.…

  10. [Injuries of the acromioclavicular joint].

    PubMed

    Meeder, P J; Dannöhl, C

    1988-07-01

    The injuries of the acromio-clavicular joint require a differentiated diagnosis and treatment. The classification of the acromio-clavicular dislocations from grade I to grade III according to Tossy is proved. The diagnosis of a complete acromio-clavicular dislocation (Tossy III) is an indication for a surgical repair. Many and different methods are reported in the literature. 178 patients with a fresh acromio-clavicular dislocation (Typ Tossy II and III) were treated at the BG-Unfallklinik Tübingen from 1970 to 1987 by suturing the ligaments, inserting pins across the joint and tension wire bending. In old cases with Tossy III dislocation of the acromio-clavicular joint an oblique osteotomy combined with the reduction of the clavicle is recommended as a method of choice. The results of these procedures and there possible intra- and postoperative complications are reported. The incision along the clavicle quite often gives scar problems. Therefore the advantages of an arched incision across the acromio-clavicular joint is pointed out. Because of there biomechanical relationship fractures in the lateral third of the clavicle are similar to dislocations of the acromio-clavicular joint. The classification of these fractures according to Jäger, Buschle and Breitner allows a differentiated management of these lesions.

  11. Improved microstructure and mechanical properties in gas tungsten arc welded aluminum joints by using graphene nanosheets/aluminum composite filler wires.

    PubMed

    Fattahi, M; Gholami, A R; Eynalvandpour, A; Ahmadi, E; Fattahi, Y; Akhavan, S

    2014-09-01

    In the present study, different amounts of graphene nanosheets (GNSs) were added to the 4043 aluminum alloy powders by using the mechanical alloying method to produce the composite filler wires. With each of the produced composite filler wires, one all-weld metal coupon was welded using the gas tungsten arc (GTA) welding process. The microstructure, mechanical properties and fracture surface morphology of the weld metals have been evaluated and the results are compared. As the amount of GNSs in the composition of filler wire is increased, the microstructure of weld metal was changed from the dendritic structure to fine equiaxed grains. Furthermore, the tensile strength and microhardness of weld metal was improved, and is attributed to the augmented nucleation and retarded growth. From the results, it was seen that the GNSs/Al composite filler wire can be used to improve the microstructure and mechanical properties of GTA weld metals of aluminum and its alloys. Copyright © 2014 Elsevier Ltd. All rights reserved.

  12. Wire-guided sphincterotomy.

    PubMed

    Sherman, S; Uzer, M F; Lehman, G A

    1994-12-01

    Guidewire-assisted techniques have acquired an important role in endoscopic interventions in the pancreaticobiliary tree. The wire-guided sphincterotome allows the endoscopist to maintain direct access to the biliary tree before or after the sphincterotomy. It has the additional advantages of allowing for more expeditious placement of accessories and being useful in combined percutaneous-endoscopic procedures. There are two basic designs of wire-guided sphincterotomes. The single-channel model has a single lumen for both the cutting wire and guidewire and requires guidewire removal before the application of power. The double-channel model has two separate lumens for the guidewire and stainless steel cutting wire. In vitro data suggest that significant capacitive coupling currents (or short circuits) may occur on the standard Teflon-coated guidewire when used with a double lumen sphincterotome, resulting in electrosurgical burns. Thus, the manufacturers of the double-lumen models recommend removing the Teflon-coated wire before performing sphincterotomy. Although limited data in humans have been published, it appears that wire-guided sphincterotomy and standard sphincterotomy have similar complication rates. More safety information in humans is awaited.

  13. Study on the Strength of GFRP/Stainless Steel Adhesive Joints Reinforced with Glass Mat

    NASA Astrophysics Data System (ADS)

    Iwasa, Masaaki

    The adhesive strengths of glass fiber reinforced plastics/metal adhesive joints reinforced with glass mat under tensile shear loads and tensile loads were investigated analytically and experimentally. First, the stress singularity parameters of the bonding edges were analyzed by FEM for various types of adhesive joints reinforced with glass mat. The shear stress and normal stress distributions near the bonding edge can be expressed by two stress singularity parameters. Second, tensile shear tests were performed on taper lap joint and taper lap joint reinforced with glass mat and tensile tests were performed on T-type adhesive joint and T-type adhesive joint reinforced with glass mat. The relationships between the loads and the crosshead displacements were measured. We concluded that reinforcing adhesive joints has a greater effect on strength under tensile load than under tensile shear load. The adhesive joints strength reinforced with glass mat can be evaluated by using stress singularity parameters.

  14. U.S. Navy Wire-Rope Handbook. Volume 2. Wire-Rope Analysis and Design Data

    DTIC Science & Technology

    1976-01-01

    beneficial from the standpoint of wire - bending stress. How- ever, there is a design trade-off here in that the smaller L/d becomes, the lower are the...wires of a rope, it is first necessary to determine the radii of curvature of the wires prior to and after bending the rope. The wire - bending stress can... wire bending stress. 4.3. CONTACT STRESSES Contact stresses in a wire rope are one of the most important determinants of its fatigue life and are, by far

  15. Separate vertical wiring for the fixation of comminuted fractures of the inferior pole of the patella.

    PubMed

    Song, Hyung Keun; Yoo, Je Hyun; Byun, Young Soo; Yang, Kyu Hyun

    2014-05-01

    Among patients over 50 years of age, separate vertical wiring alone may be insufficient for fixation of fractures of the inferior pole of the patella. Therefore, mechanical and clinical studies were performed in patients over the age of 50 to test the strength of augmentation of separate vertical wiring with cerclage wire (i.e., combined technique). Multiple osteotomies were performed to create four-part fractures in the inferior poles of eight pairs of cadaveric patellae. One patella from each pair was fixed with the separate wiring technique, while the other patella was fixed with a combined technique. The ultimate load to failure and stiffness of the fixation were subsequently measured. In a clinical study of 21 patients (average age of 64 years), comminuted fractures of the inferior pole of the patellae were treated using the combined technique. Operative parameters were recorded from which post-operative outcomes were evaluated. For cadaveric patellae, whose mean age was 69 years, the mean ultimate loads to failure for the separate vertical wiring technique and the combined technique were 216.4±72.4 N and 324.9±50.6 N, respectively (p=0.012). The mean stiffness for the separate vertical wiring technique and the combined technique was 241.1±68.5 N/mm and 340.8±45.3 N/mm, respectively (p=0.012). In the clinical study, the mean clinical score at final follow-up was 28.1 points. Augmentation of separate vertical wiring with cerclage wire provides enough strength for protected early exercise of the knee joint and uneventful healing.

  16. TEM Analysis of Interfaces in Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers

    NASA Technical Reports Server (NTRS)

    Ozaki, T.; Tsuda, H.; Halbig, M. C.; Singh, M.; Hasegawa, Y.; Mori, S.; Asthana R.

    2016-01-01

    Silicon Carbide (SiC) is a promising material for thermo-structural applications due to its excellent high-temperature mechanical properties, oxidation resistance, and thermal stability. However, joining and integration technologies are indispensable for this material in order to fabricate large size and complex shape components with desired functionalities. Although diffusion bonding techniques using metallic interlayers have been commonly utilized to bond various SiC ceramics, detailed microstructural observation by Transmission Electron Microscopy (TEM) of the bonded area has not been carried out due to difficulty in preparing TEM samples. In this study, we tried to prepare TEM samples from joints of diffusion bonded SiC ceramics by Focused Ion Beam (FIB) system and carefully investigated the interfacial microstructure by TEM analysis. The samples used in this study were SiC fiber bonded ceramics (SA-Tyrannohex: SA-THX) diffusion bonded with metallic interlayers such as Ti, TiMo, and Mo-B. In this presentation, the result of microstructural analysis obtained by TEM observations and the influence of metallic interlayers and fiber orientation of SA-THX on the joint microstructure will be discussed.

  17. Study of Diffusion Bonding of 45 Steel through the Compacted Nickel Powder Layer

    NASA Astrophysics Data System (ADS)

    Zeer, G. M.; Zelenkova, E. G.; Temnykh, V. I.; Tokmin, A. M.; Shubin, A. A.; Koroleva, Yu. P.; Mikheev, A. A.

    2018-02-01

    The microstructure of the transition zone and powder spacer, the concentration distribution of chemical elements over the width of the diffusion-bonded joint, and microhardness of 45 steel-compacted Ni powder spacer-45 steel layered composites formed by diffusion bonding have been investigated. It has been shown that the relative spacer thickness χ < 0.06 is optimal for obtaining a high-quality joint has been formed under a compacting pressure of 500 MPa. The solid-state diffusion bonding is accompanied by sintering the nickel powder spacer and the formation of the transition zone between the spacer and steel. The transition zone consists of solid solution of nickel in the α-Fe phase and ordered solid solution of iron in nickel (FeNi3).

  18. Wired Widgets: Agile Visualization for Space Situational Awareness

    NASA Astrophysics Data System (ADS)

    Gerschefske, K.; Witmer, J.

    2012-09-01

    Continued advancement in sensors and analysis techniques have resulted in a wealth of Space Situational Awareness (SSA) data, made available via tools and Service Oriented Architectures (SOA) such as those in the Joint Space Operations Center Mission Systems (JMS) environment. Current visualization software cannot quickly adapt to rapidly changing missions and data, preventing operators and analysts from performing their jobs effectively. The value of this wealth of SSA data is not fully realized, as the operators' existing software is not built with the flexibility to consume new or changing sources of data or to rapidly customize their visualization as the mission evolves. While tools like the JMS user-defined operational picture (UDOP) have begun to fill this gap, this paper presents a further evolution, leveraging Web 2.0 technologies for maximum agility. We demonstrate a flexible Web widget framework with inter-widget data sharing, publish-subscribe eventing, and an API providing the basis for consumption of new data sources and adaptable visualization. Wired Widgets offers cross-portal widgets along with a widget communication framework and development toolkit for rapid new widget development, giving operators the ability to answer relevant questions as the mission evolves. Wired Widgets has been applied in a number of dynamic mission domains including disaster response, combat operations, and noncombatant evacuation scenarios. The variety of applications demonstrate that Wired Widgets provides a flexible, data driven solution for visualization in changing environments. In this paper, we show how, deployed in the Ozone Widget Framework portal environment, Wired Widgets can provide an agile, web-based visualization to support the SSA mission. Furthermore, we discuss how the tenets of agile visualization can generally be applied to the SSA problem space to provide operators flexibility, potentially informing future acquisition and system development.

  19. PROCESSING OF HIGH-PERFORMANCE Nb{sub 3}Sn WIRES THROUGH A NEW DIFFUSION REACTION USING Sn BASED ALLOYS

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Tachikawa, K.; Sasaki, H.; Yamaguchi, M.

    Tightly consolidated Sn-Ta and Sn-B based alloys have been prepared by the reaction among constituent metal powders at 750-775 deg. C. Sn-Ta and Sn-B based alloys exhibit quite similar microstructures. A small amount of Ti addition seems to improve the bonding between Ta or B particles and Sn matrix. Nb{sub 3}Sn wires have been fabricated by the Jelly Roll (JR) and Multi-rod (MR) process using Sn based alloy sheet and rod, respectively. Thick Nb{sub 3}Sn layers with nearly stoichiometric A15 composition are synthesized through a new diffusion mechanism between Nb and Sn based alloy. B{sub c2}(4.2 K)'s of 26.9 Tmore » (mid) and 26.5 T (mid) have been obtained in the JR and MR processed wires, respectively, using Sn-Ta based alloy. These wires exhibit enough non-Cu J{sub c} to be used above 20 T and 4.2 K. T{sub c} of JR wires using Sn-B based sheet is 18.14 K (offset) which is slightly higher than that of wires using Sn-Ta based sheet.« less

  20. Process Of Bonding Copper And Tungsten

    DOEpatents

    Slattery, Kevin T.; Driemeyer, Daniel E.

    1999-11-23

    Process for bonding a copper substrate to a tungsten substrate by providing a thin metallic adhesion promoting film bonded to a tungsten substrate and a functionally graded material (FGM) interlayer bonding the thin metallic adhesion promoting film to the copper substrate. The FGM interlayer is formed by thermal plasma spraying mixtures of copper powder and tungsten powder in a varied blending ratio such that the blending ratio of the copper powder and the tungsten powder that is fed to a plasma torch is intermittently adjusted to provide progressively higher copper content/tungsten content, by volume, ratio values in the interlayer in a lineal direction extending from the tungsten substrate towards the copper substrate. The resulting copper to tungsten joint well accommodates the difference in the coefficient of thermal expansion of the materials.

  1. International space station wire program

    NASA Technical Reports Server (NTRS)

    May, Todd

    1995-01-01

    Hardware provider wire systems and current wire insulation issues for the International Space Station (ISS) program are discussed in this viewgraph presentation. Wire insulation issues include silicone wire contamination, Tefzel cold temperature flexibility, and Russian polyimide wire insulation. ISS is a complex program with hardware developed and managed by many countries and hundreds of contractors. Most of the obvious wire insulation issues are known by contractors and have been precluded by proper selection.

  2. 'There were more wires than him': the potential for wireless patient monitoring in neonatal intensive care.

    PubMed

    Bonner, Oliver; Beardsall, Kathryn; Crilly, Nathan; Lasenby, Joan

    2017-02-01

    The neonatal intensive care unit (NICU) can be one of the most stressful hospital environments. Alongside providing intensive clinical care, it is important that parents have the opportunity for regular physical contact with their babies because the neonatal period is critical for parent-child bonding. At present, monitoring technology in the NICU requires multiple wired sensors to track each baby's vital signs. This study describes the experiences that parents and nurses have with the current monitoring methods, and reports on their responses to the concept of a wireless monitoring system. Semistructured interviews were conducted with six parents, each of whom had babies on the unit, and seven nurses who cared for those babies. The interviews initially focused on the participants' experiences of the current wired system and then on their responses to the concept of a wireless system. The transcripts were analysed using a general inductive approach to identify relevant themes. Participants reported on physical and psychological barriers to parental care, the ways in which the current system obstructed the efficient delivery of clinical care and the perceived benefits and risks of a wireless system. The parents and nurses identified that the wires impeded baby-parent bonding; physically and psychologically. While a wireless system was viewed as potentially enabling greater interaction, staff and parents highlighted potential concerns, including the size, weight and battery life of any new device. The many wires required to safely monitor babies within the NICU creates a negative environment for parents at a critical developmental period, in terms of physical and psychological interactions. Nurses also experience challenges with the existing system, which could negatively impact the clinical care delivery. Developing a wireless system could overcome these barriers, but there remain challenges in designing a device suitable for this unique environment.

  3. Kirschner wire bending.

    PubMed

    Firoozabadi, Reza; Kramer, Patricia A; Benirschke, Stephen K

    2013-11-01

    Although Kirschner wires are useful implants in many situations, migration of the wire and irritation of the surrounding soft tissues are common complications. Seven steps are described herein, which result in a Kirschner wire that is bent 180° angle, providing a smooth anchor into bone. Use of this technique produces implants that provide stable fixation with few soft tissue complications.

  4. Laser Wire Stripper

    NASA Technical Reports Server (NTRS)

    1983-01-01

    NASA-developed space shuttle technology is used in a laser wire stripper designed by Raytheon Company. Laser beams cut through insulation on a wire without damaging conductive metal, because laser radiation that melts plastic insulation is reflected by the metal. The laser process is fast, clean, precise and repeatable. It eliminates quality control problems and the expense of rejected wiring.

  5. Fatigue Strength and Related Characteristics of Aircraft Joints I : Comparison of Spot-Weld and Rivet Patterns in 24s-t Alclad and 75s-t Alclad

    NASA Technical Reports Server (NTRS)

    Russell, H W; Jackson, L R; Grover, H J; Beaver, W W

    1944-01-01

    Report contains detailed results of a number of fatigue tests on spot-welded joints in aluminum alloys. The tests described include: (1) fatigue tests on spot-welded lap joints in sheets of unequal thickness of alclad 24s-t. These tests indicate that the fatigue strength of a spot-welded joint in sheets of two different gages is slightly higher than that of a similar joint in two sheets of the thinner gage but definitely lower than that of a similar joint in two sheets of the thicker gage. (2) Fatigue tests on spot-welded alclad 75s-t spot-welded lap-joint specimens of alclad 75s-t were not any stronger in fatigue than similar specimens of alclad 24s-t. (3) Fatigue tests on lap-joint specimens spot -welded after various surface preparations--these included ac welding wire-brushed surfaces, dc welding wire-brushed surfaces, and dc welding chemically cleaned surfaces. While the ac welds were strongest statically, the dc welds on wire-brushed surfaces were strongest in fatigue. Specimens prepared in this way were very nearly as strong as the best riveted specimens tested for comparison. (4) Fatigue tests on specimens spot-welded with varying voltage so as to include a wide range of static spot-weld strengths. The fatigue strengths were in the same order as the static strengths but showed less range. (author)

  6. Open Reduction With K-Wire Stabilization of Fracture Dislocations of the Mandibular Condyle: A Retrospective Review.

    PubMed

    Haghighi, Kayvon; Manolakakis, Manolis G; Balog, Connor

    2017-06-01

    The aim of this study was to determine the feasibility of direct transcortical stabilization of fracture dislocations of the mandibular condyle (FDMCs) using narrow-diameter non-threaded Kirschner wire (K-wire). This retrospective review reports on the treatment outcomes for 12 patients (15 fractures) with FDMCs treated with open reduction using transcortical 0.027-inch K-wire stabilization. Postoperative parameters of relevance included infection, facial nerve function, hardware removal, mandibular range of motion, and radiographic determination of fracture union. Three patients had bilateral FDMCs and 9 had unilateral FDMCs (age range at time of injury, 14 to 72 yr; mean age, 32 yr). Postoperative follow-up ranged from 6 weeks to 2 years. Four patients required removal of K-wire hardware for different reasons. K-wires were removed because of infection in 1 patient. Another patient required removal because of migration of the pin into the joint space. One pin was removed electively and another was removed for nonspecific postoperative symptoms that resolved after pin removal. Persistent facial nerve deficit was observed in 1 patient. Open reduction with transcortical K-wire stabilization can achieve satisfactory outcomes for the treatment of FDMC. Further investigation is needed in determining the efficacy of this fixation technique in the management of FDMC. Copyright © 2017 American Association of Oral and Maxillofacial Surgeons. Published by Elsevier Inc. All rights reserved.

  7. KommonBase - A precise direct bonding system for labial fixed appliances.

    PubMed

    Miyashita, Wataru; Komori, Akira; Takemoto, Kyoto

    2017-09-01

    "KommonBase" is a system designed to customize the bracket base by means of an extended resin base covering the tooth. This system enables precise bracket placement and accurate fit on teeth. Moreover, KommonBase can be easily fabricated in a laboratory and bonded on each tooth using simple clinical procedures. Straight-wire treatment without wire bending was achieved in the clinical cases presented in this article using the KommonBase system for a labial fixed appliance. The application of KommonBase to the vestibular side enables efficient orthodontic treatment using simple mechanics. Copyright © 2017 CEO. Published by Elsevier Masson SAS. All rights reserved.

  8. Dissimilar material joining using laser (aluminum to steel using zinc-based filler wire)

    NASA Astrophysics Data System (ADS)

    Mathieu, Alexandre; Shabadi, Rajashekar; Deschamps, Alexis; Suery, Michel; Matteï, Simone; Grevey, Dominique; Cicala, Eugen

    2007-04-01

    Joining steel with aluminum involving the fusion of one or both materials is possible by laser beam welding technique. This paper describes a method, called laser braze welding, which is a suitable process to realize this structure. The main problem with thermal joining of steel/aluminum assembly with processes such as TIG or MIG is the formation of fragile intermetallic phases, which are detrimental to the mechanical performances of such joints. Braze welding permits a localized fusion of the materials resulting in a limitation on the growth of fragile phases. This article presents the results of a statistical approach for an overlap assembly configuration using a filler wire composed of 85% Zn and 15% Al. Tensile tests carried on these assemblies demonstrate a good performance of the joints. The fracture mechanisms of the joints are analyzed by a detailed characterization of the seams.

  9. Wire harness twisting aid

    NASA Technical Reports Server (NTRS)

    Casey, E. J.; Commadore, C. C.; Ingles, M. E.

    1980-01-01

    Long wire bundles twist into uniform spiral harnesses with help of simple apparatus. Wires pass through spacers and through hand-held tool with hole for each wire. Ends are attached to low speed bench motor. As motor turns, operator moves hand tool away forming smooth twists in wires between motor and tool. Technique produces harnesses that generate less radio-frequency interference than do irregularly twisted cables.

  10. 30 CFR 75.1003-1 - Other requirements for guarding of trolley wires and trolley feeder wires.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... wires and trolley feeder wires. 75.1003-1 Section 75.1003-1 Mineral Resources MINE SAFETY AND HEALTH... Trolley Wires and Trolley Feeder Wires § 75.1003-1 Other requirements for guarding of trolley wires and trolley feeder wires. Adequate precaution shall be taken to insure that equipment being moved along...

  11. 30 CFR 75.1003-1 - Other requirements for guarding of trolley wires and trolley feeder wires.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... wires and trolley feeder wires. 75.1003-1 Section 75.1003-1 Mineral Resources MINE SAFETY AND HEALTH... Trolley Wires and Trolley Feeder Wires § 75.1003-1 Other requirements for guarding of trolley wires and trolley feeder wires. Adequate precaution shall be taken to insure that equipment being moved along...

  12. Destructive and non-destructive evaluation of cu/cu diffusion bonding with interlayer aluminum

    NASA Astrophysics Data System (ADS)

    Santosh Kumar, A.; Mohan, T.; Kumar, S. Suresh; Ravisankar, B.

    2018-03-01

    The current study is established an inspection procedure for assessing quality of diffusion bonded joints using destructive and non-destructive method. Diffusion bonding of commercially pure copper with aluminium interlayer was carried out uniaxial load at 15MPa for different temperatures under holding time 60 min in vacuum atmosphere. The bond qualities were determined by destructive and non-destructive testing method (ultrasonic C- scan). The bond interface and bonded samples were analysed using optical and scanning electron microscopy (SEM). The element composition of the fractured and bonded area is determined using the Energy Dispersive Spectrometry (EDS). The bond quality obtained by both testing methods and its parameters are correlated. The optimized bonding parameter for best bonding characteristics for copper diffusion bonding with aluminum interlayer is reported.

  13. Experiment of low resistance joints for the ITER correction coil.

    PubMed

    Liu, Huajun; Wu, Yu; Wu, Weiyue; Liu, Bo; Shi, Yi; Guo, Shuai

    2013-01-01

    A test method was designed and performed to measure joint resistance of the ITER correction coil (CC) in liquid helium (LHe) temperature. A 10 kA superconducting transformer was manufactured to provide the joints current. The transformer consisted of two concentric layer-wound superconducting solenoids. NbTi superconducting wire was wound in the primary coil and the ITER CC conductor was wound in the secondary coil. The primary and the secondary coils were both immersed in liquid helium of a 300 mm useful bore diameter cryostat. Two ITER CC joints were assembled in the secondary loop and tested. The current of the secondary loop was ramped to 9 kA in several steps. The two joint resistances were measured to be 1.2 nΩ and 1.65 nΩ, respectively.

  14. Thin wire pointing method

    NASA Technical Reports Server (NTRS)

    Green, G.; Mattauch, R. J. (Inventor)

    1983-01-01

    A method is described for forming sharp tips on thin wires, in particular phosphor bronze wires of diameters such as one-thousandth inch used to contact micron size Schottky barrier diodes, which enables close control of tip shape and which avoids the use of highly toxic solutions. The method includes dipping an end of a phosphor bronze wire into a dilute solution of sulfamic acid and applying a current through the wire to electrochemically etch it. The humidity in the room is controlled to a level of less than 50%, and the voltage applied between the wire and another electrode in the solutions is a half wave rectified voltage. The current through the wire is monitored, and the process is stopped when the current falls to a predetermined low level.

  15. Acoustic emission analysis: A test method for metal joints bonded by adhesives

    NASA Technical Reports Server (NTRS)

    Brockmann, W.; Fischer, T.

    1978-01-01

    Acoustic emission analysis is applied to study adhesive joints which had been subjected to mechanical and climatic stresses, taking into account conditions which make results applicable to adhesive joints used in aerospace technology. Specimens consisting of the alloy AlMgSi0.5 were used together with a phenolic resin adhesive, an epoxy resin modified with a polyamide, and an epoxy resin modified with a nitrile. Results show that the acoustic emission analysis provides valuable information concerning the behavior of adhesive joints under load and climatic stresses.

  16. Clinical quality is independently associated with favorable bond ratings.

    PubMed

    Haydar, Ziad; Nicewander, David; Convery, Paul; Black, Michael; Ballard, David

    2010-01-01

    The relation between clinical quality and bond rating for nonprofit hospitals has been proposed but never fully studied. We analyzed the relation between bond rating, clinical quality measures (The Joint Commission/Centers for Medicare and Medicaid Services [CMS] core measures), and balance sheet and income statement financial measures of 236 hospitals across the United States that are rated by Moody's Investors Service and that reported clinical quality measures to CMS during the study period. We found a statistically significant relation between higher quality measures and more favorable bond ratings. This association remained significant after controlling for traditional financial parameters.

  17. Shear sensing in bonded composites with cantilever beam microsensors and dual-plane digital image correlation

    NASA Astrophysics Data System (ADS)

    Baur, Jeffery W.; Slinker, Keith; Kondash, Corey

    2017-04-01

    Understanding the shear strain, viscoelastic response, and onset of damage within bonded composites is critical to their design, processing, and reliability. This presentation will discuss the multidisciplinary research conducted which led to the conception, development, and demonstration of two methods for measuring the shear within a bonded joint - dualplane digital image correlation (DIC) and a micro-cantilever shear sensor. The dual plane DIC method was developed to measure the strain field on opposing sides of a transparent single-lap joint in order to spatially quantify the joint shear strain. The sensor consists of a single glass fiber cantilever beam with a radially-grown forest of carbon nanotubes (CNTs) within a capillary pore. When the fiber is deflected, the internal radial CNT array is compressed against an electrode within the pore and the corresponding decrease in electrical resistance is correlated with the external loading. When this small, simple, and low-cost sensor was integrated within a composite bonded joint and cycled in tension, the onset of damage prior to joint failure was observed. In a second sample configuration, both the dual plane DIC and the hair sensor detected viscoplastic changes in the strain of the sample in response to continued loading.

  18. Impact of different rectangular wires on torsional expression of different sizes of buccal tube.

    PubMed

    Ajami, Shabnam; Boroujeni, Afshar-Rasti

    2018-01-01

    Torsions in rectangular wires are the essential part of corrections in the finishing stage of treatment. Moreover the greatest amounts of torques are applied in the molar areas. a clinically effective moment is between 5 and 20 Nmm. In this study we have decided to evaluate the impact of different tube sizes and different dimensions of wires with different modulus of elasticities on the amount torsional bond strength of molar tubes. 60 human impacted molar teeth were collected. A buccal tube was bonded on the buccal surface of all the samples by using light cured adhesive resin. After that, the teeth were mounted in a hard acrylic block. According to the size of buccal tube and the rectangular wires to be tested 4 groups will be designed. Torsional force was applied by instron machine. The torque angle at 5Nmm and at 20Nmm point will be calculated: which means, how many degrees of torque is required to reach the maximum 20Nmm moment from the minimum 5Nmm.One-way ANOVA was used to compare torque angle in all of the groups. The least amount of clinically significant angle was 2.2 ᵒ in the 0.017×0.025 SS and the largest amount of it was 23.7 ᵒ in the 0.017×0.025 TMA in 0.018×0.025 slot molar tube. But, this angle was 19.9 ᵒand 13.6 ᵒ in 0.019×0.025 SS and 0.019×0.025 TMA archwire in 0.022×0.028 molar tube. The 0.017×0.025 SS archwire in 0.018×0.025 molar tube had the lowest clinically significant angle. The largest amount was seen in group 0.017×0.025 TMA in 0.018×0.025 slot molar tube. Key words: Torsional efficacy, rectangular wires, buccal tubes, torque angle.

  19. Impact of different rectangular wires on torsional expression of different sizes of buccal tube

    PubMed Central

    Boroujeni, Afshar-Rasti

    2018-01-01

    Background Torsions in rectangular wires are the essential part of corrections in the finishing stage of treatment. Moreover the greatest amounts of torques are applied in the molar areas. a clinically effective moment is between 5 and 20 Nmm. In this study we have decided to evaluate the impact of different tube sizes and different dimensions of wires with different modulus of elasticities on the amount torsional bond strength of molar tubes. Material and Methods 60 human impacted molar teeth were collected. A buccal tube was bonded on the buccal surface of all the samples by using light cured adhesive resin. After that, the teeth were mounted in a hard acrylic block. According to the size of buccal tube and the rectangular wires to be tested 4 groups will be designed. Torsional force was applied by instron machine. The torque angle at 5Nmm and at 20Nmm point will be calculated: which means, how many degrees of torque is required to reach the maximum 20Nmm moment from the minimum 5Nmm.One-way ANOVA was used to compare torque angle in all of the groups. Results The least amount of clinically significant angle was 2.2 ᵒ in the 0.017×0.025 SS and the largest amount of it was 23.7 ᵒ in the 0.017×0.025 TMA in 0.018×0.025 slot molar tube. But, this angle was 19.9 ᵒand 13.6 ᵒ in 0.019×0.025 SS and 0.019×0.025 TMA archwire in 0.022×0.028 molar tube. Conclusions The 0.017×0.025 SS archwire in 0.018×0.025 molar tube had the lowest clinically significant angle. The largest amount was seen in group 0.017×0.025 TMA in 0.018×0.025 slot molar tube. Key words: Torsional efficacy, rectangular wires, buccal tubes, torque angle. PMID:29670712

  20. 49 CFR 236.74 - Protection of insulated wire; splice in underground wire.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Protection of insulated wire; splice in underground wire. 236.74 Section 236.74 Transportation Other Regulations Relating to Transportation (Continued..., AND APPLIANCES Rules and Instructions: All Systems Wires and Cables § 236.74 Protection of insulated...

  1. 49 CFR 236.74 - Protection of insulated wire; splice in underground wire.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Protection of insulated wire; splice in underground wire. 236.74 Section 236.74 Transportation Other Regulations Relating to Transportation (Continued..., AND APPLIANCES Rules and Instructions: All Systems Wires and Cables § 236.74 Protection of insulated...

  2. Easily-wired toggle switch

    NASA Technical Reports Server (NTRS)

    Dean, W. T.; Stringer, E. J.

    1979-01-01

    Crimp-type connectors reduce assembly and disassembly time. With design, no switch preparation is necessary and socket contracts are crimped to wires inserted in module attached to back of toggle switch engaging pins inside module to make electrical connections. Wires are easily removed with standard detachment tool. Design can accommodate wires of any gage and as many terminals can be placed on switch as wire gage and switch dimensions will allow.

  3. Process optimization for diffusion bonding of tungsten with EUROFER97 using a vanadium interlayer

    NASA Astrophysics Data System (ADS)

    Basuki, Widodo Widjaja; Aktaa, Jarir

    2015-04-01

    Solid-state diffusion bonding is a selected joining technology to bond divertor components consisting of tungsten and EUROFER97 for application in fusion power plants. Due to the large mismatch in their coefficient of thermal expansions, which leads to serious thermally induced residual stresses after bonding, a thin vanadium plate is introduced as an interlayer. However, the diffusion of carbon originated from EUROFER97 in the vanadium interlayer during the bonding process can form a vanadium carbide layer, which has detrimental influences on the mechanical properties of the joint. For optimal bonding results, the thickness of this layer and the residual stresses has to be decreased sufficiently without a significant reduction of material transport especially at the vanadium/tungsten interface, which can be achieved by varying the diffusion bonding temperature and duration. The investigation results show that at a sufficiently low bonding temperature of 700 °C and a bonding duration of 4 h, the joint reaches a reasonable high ductility and toughness especially at elevated test temperature of 550 °C with elongation to fracture of 20% and mean absorbed Charpy impact energy of 2 J (using miniaturized Charpy impact specimens). The strength of the bonded materials is about 332 MPa at RT and 291 MPa at 550 °C. Furthermore, a low bonding temperature of 700 °C can also help to avoid the grain coarsening and the alteration of the grain structure especially of the EUROFER97 close to the bond interface.

  4. Superplastic Forming/Diffusion Bonding Without Interlayer of 5A90 Al-Li Alloy Hollow Double-Layer Structure

    NASA Astrophysics Data System (ADS)

    Jiang, Shaosong; Jia, Yong; Lu, Zhen; Shi, Chengcheng; Zhang, Kaifeng

    2017-09-01

    The hollow double-layer structure of 5A90 Al-Li alloy was fabricated by SPF/DB process in this study. The characteristics and mechanism of 5A90 Al-Li alloy with respect to superplasticity and diffusion bonding were investigated. Tensile tests showed that the optimal elongation of tensile specimens was 243.97% at the temperature of 400 °C and the strain rate of 0.001 s-1. Effect of the surface roughness, bonding temperature and bonding time to determine the microstructure and mechanical properties of diffusion bonding joints was investigated, and the optimum bonding parameters were 540 °C/2.5 h/Ra18. Through the finite element simulation, it could be found that the SPF/DB process of hollow double-layer structure was feasible. The hollow double-layer structure of 5A90 Al-Li alloy was manufactured, showing that the thickness distribution of the bonding area was uniform and the thinnest part was the round corner. The SEM images of diffusion bonding joints showed that sound bonding interfaces were obtained in which no discontinuity existed.

  5. Impact tensile testing of wires

    NASA Technical Reports Server (NTRS)

    Dawson, T. H.

    1976-01-01

    The test consists of fixing one end of a wire specimen and allowing a threaded falling weight to strike the other. Assuming the dynamic stress in the wire to be a function only of its strain, energy considerations show for negligible wire inertia effects that the governing dynamic stress-strain law can be determined directly from impact energy vs. wire elongation data. Theoretical calculations are presented which show negligible wire inertia effects for ratios of wire mass to striking mass of the order of .01 or less. The test method is applied to soft copper wires and the dynamic stress-strain curve so determined is found to be about 30 percent higher than the corresponding static curve.

  6. Comparative range of orthodontic wires.

    PubMed

    Ingram, S B; Gipe, D P; Smith, R J

    1986-10-01

    ADA specification No. 32 for determining the range (elastic limit) of orthodontic wires uses the bending of a wire section treated as a cantilever beam. An alternative method for defining the range of orthodontic wires proposed by Waters (1981) is to wrap wire sections around mandrels of varying diameters and measure the deformation imparted after unwrapping. Four brass mandrels with a total of 46 test diameters ranging from 3.5 to 60.0 mm were used in this study. Wire sections 9 cm in length were rolled on the mandrel with a hand lathe. The mandrel cross section required to produce a predetermined amount of deformation (2 mm arc height for a 5 cm chord) was defined as the yield diameter for that particular wire. No individual wire was tested twice so as to avoid introduction of strain history. Test samples of 488 different orthodontic wires supplied by nine commercial distributors were evaluated (a total of 4,747 samples). Stainless steel wires of identical dimensions had a large variation in range, depending on the state of strain hardening and heat treatment. For example, 0.020 inch round wire had yield diameters ranging from 22.8 mm for Australian special plus orange (TP Laboratories) to 42.9 mm for Nubryte gold (G.A.C. International). Chromium cobalt wires had less range than stainless steel before heat treatment, but increased greatly in range after heat treatment. Nitinol (Unitek) had the greatest range of all wires tested (yield diameter of 8.7 mm for 0.016 inch Nitinol). Multistranded stainless steel wires had yield diameters between 9.0 and 14.0 mm.

  7. Determination of apparent coupling factors for adhesive bonded acrylic plates using SEAL approach

    NASA Astrophysics Data System (ADS)

    Pankaj, Achuthan. C.; Shivaprasad, M. V.; Murigendrappa, S. M.

    2018-04-01

    Apparent coupling loss factors (CLF) and velocity responses has been computed for two lap joined adhesive bonded plates using finite element and experimental statistical energy analysis like approach. A finite element model of the plates has been created using ANSYS software. The statistical energy parameters have been computed using the velocity responses obtained from a harmonic forced excitation analysis. Experiments have been carried out for two different cases of adhesive bonded joints and the results have been compared with the apparent coupling factors and velocity responses obtained from finite element analysis. The results obtained from the studies signify the importance of modeling of adhesive bonded joints in computation of the apparent coupling factors and its further use in computation of energies and velocity responses using statistical energy analysis like approach.

  8. Nondestructive Evaluation of Adhesive Bonds via Ultrasonic Phase Measurements

    NASA Technical Reports Server (NTRS)

    Haldren, Harold A.; Perey, Daniel F.; Yost, William T.; Cramer, K. Elliott; Gupta, Mool C.

    2016-01-01

    The use of advanced composites utilizing adhesively bonded structures offers advantages in weight and cost for both the aerospace and automotive industries. Conventional nondestructive evaluation (NDE) has proved unable to reliably detect weak bonds or bond deterioration during service life conditions. A new nondestructive technique for quantitatively measuring adhesive bond strength is demonstrated. In this paper, an ultrasonic technique employing constant frequency pulsed phased-locked loop (CFPPLL) circuitry to monitor the phase response of a bonded structure from change in thermal stress is discussed. Theoretical research suggests that the thermal response of a bonded interface relates well with the quality of the adhesive bond. In particular, the effective stiffness of the adhesive-adherent interface may be extracted from the thermal phase response of the structure. The sensitivity of the CFPPLL instrument allows detection of bond pathologies that have been previously difficult-to-detect. Theoretical results with this ultrasonic technique on single epoxy lap joint (SLJ) specimens are presented and discussed. This technique has the potential to advance the use of adhesive bonds - and by association, advanced composite structures - by providing a reliable method to measure adhesive bond strength, thus permitting more complex, lightweight, and safe designs.

  9. Separate Vertical Wiring for the Fixation of Comminuted Fractures of the Inferior Pole of the Patella

    PubMed Central

    Song, Hyung Keun; Yoo, Je Hyun; Byun, Young Soo

    2014-01-01

    Purpose Among patients over 50 years of age, separate vertical wiring alone may be insufficient for fixation of fractures of the inferior pole of the patella. Therefore, mechanical and clinical studies were performed in patients over the age of 50 to test the strength of augmentation of separate vertical wiring with cerclage wire (i.e., combined technique). Materials and Methods Multiple osteotomies were performed to create four-part fractures in the inferior poles of eight pairs of cadaveric patellae. One patella from each pair was fixed with the separate wiring technique, while the other patella was fixed with a combined technique. The ultimate load to failure and stiffness of the fixation were subsequently measured. In a clinical study of 21 patients (average age of 64 years), comminuted fractures of the inferior pole of the patellae were treated using the combined technique. Operative parameters were recorded from which post-operative outcomes were evaluated. Results For cadaveric patellae, whose mean age was 69 years, the mean ultimate loads to failure for the separate vertical wiring technique and the combined technique were 216.4±72.4 N and 324.9±50.6 N, respectively (p=0.012). The mean stiffness for the separate vertical wiring technique and the combined technique was 241.1±68.5 N/mm and 340.8±45.3 N/mm, respectively (p=0.012). In the clinical study, the mean clinical score at final follow-up was 28.1 points. Conclusion Augmentation of separate vertical wiring with cerclage wire provides enough strength for protected early exercise of the knee joint and uneventful healing. PMID:24719149

  10. Studies of friction and wear characteristics of various wires for wire-brush skids

    NASA Technical Reports Server (NTRS)

    Dreher, R. C.

    1977-01-01

    The friction and wear characteristics of 22 types and sizes of wires for potential use in wire-brush skids were studied. These characteristics were determined by placing brushes made from candidate wires on a belt sander whose moving belt simulated landing roll-out distance. At the same time, the drag force and wear behavior were monitored. Data were obtained over distances up to 3048 m (10,000 ft) at preselected bearing pressures of 172 to 1034 kPa (25 to 150 psi). In general, the friction coefficient developed by the candidate wires was found to be independent of bearing pressure and ranged between 0.4 and 0.6 under the test conditions of this investigation. The friction coefficient was not degraded when the surface was wetted and appears to be independent of wire diameter except perhaps when wire size is relatively large compared with the surface asperities. Generally, the high friction demonstrated by the soft materials was accompanied by high wear rates; conversely, the hard materials provided greater wear resistance but offered lower friction. For all test wires, the wear was shown to increase with increasing bearing pressure, in general, for the same bearing pressure, wear increased with increasing wire diameter and decreased when the surface was wetted.

  11. Characterisation of CFRP adhesive bonds by electromechanical impedance

    NASA Astrophysics Data System (ADS)

    Malinowski, Pawel H.; Wandowski, Tomasz; Ostachowicz, Wieslaw M.

    2014-03-01

    In aircraft industry the Carbon Fiber Reinforced Polymer (CFRP) elements are joint using rivets and adhesive bonding. The reliability of the bonding limits the use of adhesive bonding for primary aircraft structures, therefore it is important to assess the bond quality. The performance of adhesive bonds depends on the physico-chemical properties of the adhered surfaces. The contamination leading to weak bonds may have various origin and be caused by moisture, release agent, hydraulic fluid, fuel, poor curing of adhesive and so on. In this research three different causes of possible weak bonds were selected for the investigation: 1. Weak bond due to release agent contamination, 2. Weak bond due to moisture contamination, 3. Weak bond due to poor curing of the adhesive. In order to assess the bond quality electromechanical impedance (EMI) technique was selected and investigation was focused on the influence of bond quality on electrical impedance of piezoelectric transducer. The piezoelectric transducer was mounted at the middle of each sample surface. Measurements were conducted using HIOKI Impedance Analyzer IM3570. Using the impedance analyzer the electrical parameters were measured for wide frequency band. Due to piezoelectric effect the electrical response of a piezoelectric transducer is related to mechanical response of the sample to which the transducers is attached. The impedance spectra were investigated in order to find indication of the weak bonds. These spectra were compared with measurements for reference sample using indexes proposed in order to assess the bond quality.

  12. Method of making a composite tube to metal joint

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Leslie, James C.; Leslie, II, James C.; Heard, James

    A method for making a metal to composite tube joint including selecting an elongated interior fitting constructed with an exterior barrel, reduced in exterior diameter to form a distally facing annular shoulder and then projecting still further distally to form an interior sleeve having a radially outwardly facing bonding surface. Selecting an elongated metal outer sleeve formed proximally with a collar constructed for receipt over the barrel and increased in interior diameter and projecting distally to form an exterior sleeve having a radially inwardly facing bonding surface cooperating with the first bonding surface to form an annulus receiving an extremitymore » of a composite tube and a bond bonding the extremity of the tube to the bonding surfaces.« less

  13. Active Metal Brazing and Characterization of Brazed Joints in Titanium to Carbon-Carbon Composites

    NASA Technical Reports Server (NTRS)

    Singh, M.; Shpargel, T. P.; Morscher, G. N.; Asthana, R.

    2006-01-01

    The Ti-metal/C-C composite joints were formed by reactive brazing with three commercial brazes, namely, Cu-ABA, TiCuNi, and TiCuSiI. The joint microstructures were examined using optical microscopy and scanning electron microscopy (SEM) coupled with energy dispersive spectrometry (EDS). The results of the microstructure analysis indicate solute redistribution across the joint and possible metallurgical bond formation via interdiffusion, which led to good wetting and spreading. A tube-on-plate tensile test was used to evaluate joint strength of Ti-tube/ C-C composite joints. The load-carrying ability was greatest for the Cu-ABA braze joint structures. This system appeared to have the best braze spreading which resulted in a larger braze/C-C composite bonded area compared to the other two braze materials. Also, joint loadcarrying ability was found to be higher for joint structures where the fiber tows in the outer ply of the C-C composite were aligned perpendicular to the tube axis when compared to the case where fiber tows were aligned parallel to the tube axis.

  14. Automatic hot wire GTA welding of pipe offers speed and increased deposition

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Sykes, I.; Digiacomo, J.

    1995-07-01

    Heavy-wall pipe welding for the power and petrochemical industry must meet code requirements. Contractors strive to meet these requirements in the most productive way possible. The challenge put to orbital welding equipment manufacturers is to produce pipe welding equipment that cost-effectively produces code-quality welds. Orbital welding equipment using the GTA process has long produced outstanding quality results but has lacked the deposition rate to compete cost effectively with other manual and semiautomatic processes such as SMAW, FCAW and GMAW. In recent years, significant progress has been made with the use of narrow-groove weld joint designs to reduce weld joint volumemore » and improve welding times. Astro Arc Polysoude, an orbital welding equipment manufacturer based in Sun Valley, Calif., and Nantes, France, has combined the hot wire GTAW process with orbital welding equipment using a narrow-groove weld joint design. Field test results show this process and procedure is a good alternative for many heavy-wall-pipe welding applications.« less

  15. Fabrication of Pd-Cr wire

    NASA Technical Reports Server (NTRS)

    Diamond, Sidney; Leach, Dennen M.

    1989-01-01

    Fabrication of Pd-13 percent Cr alloy wires is described. Melting, casting, swaging and annealing processes are discussed. Drawing to reach two diameters (0.003 inch and 0.00176 inch) of wire is described. Representative micrographs of the Pd-Cr alloy at selected stages during wire fabrication are included. The resistance of the wire was somewhat lower, by about 15 to 20 percent, than comparable wire of other alloys used for strain gages.

  16. 46 CFR 111.60-11 - Wire.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 46 Shipping 4 2010-10-01 2010-10-01 false Wire. 111.60-11 Section 111.60-11 Shipping COAST GUARD... Wiring Materials and Methods § 111.60-11 Wire. (a) Wire must be in an enclosure. (b) Wire must be component insulated. (c) Wire, other than in switchboards, must meet the requirements in sections 24.6.7 and...

  17. 46 CFR 111.60-11 - Wire.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 46 Shipping 4 2011-10-01 2011-10-01 false Wire. 111.60-11 Section 111.60-11 Shipping COAST GUARD... Wiring Materials and Methods § 111.60-11 Wire. (a) Wire must be in an enclosure. (b) Wire must be component insulated. (c) Wire, other than in switchboards, must meet the requirements in sections 24.6.7 and...

  18. Functionally Graded Adhesives for Composite Joints

    NASA Technical Reports Server (NTRS)

    Stapleton, Scott E.; Waas, Anthony M.; Arnold, Steven M.

    2012-01-01

    Adhesives with functionally graded material properties are being considered for use in adhesively bonded joints to reduce the peel stress concentrations located near adherend discontinuities. Several practical concerns impede the actual use of such adhesives. These include increased manufacturing complications, alterations to the grading due to adhesive flow during manufacturing, and whether changing the loading conditions significantly impact the effectiveness of the grading. An analytical study is conducted to address these three concerns. An enhanced joint finite element, which uses an analytical formulation to obtain exact shape functions, is used to model the joint. Furthermore, proof of concept testing is conducted to show the potential advantages of functionally graded adhesives. In this study, grading is achieved by strategically placing glass beads within the adhesive layer at different densities along the joint.

  19. Dual wire weld feed proportioner

    NASA Technical Reports Server (NTRS)

    Nugent, R. E.

    1968-01-01

    Dual feed mechanism enables proportioning of two different weld feed wires during automated TIG welding to produce a weld alloy deposit of the desired composition. The wires are fed into the weld simultaneously. The relative feed rates of the wires and the wire diameters determine the weld deposit composition.

  20. Recrystallization texture in nickel heavily deformed by accumulative roll bonding

    NASA Astrophysics Data System (ADS)

    Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

    2017-07-01

    The recrystallization behavior of Ni processed by accumulative roll bonding to a total accumulated von Mises strain of 4.8 has been examined, and analyzed with respect to heterogeneity in the deformation microstructure. The regions near the bonding interface are found to be more refined and contain particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different. These heterogeneities affect the progress of recrystallization. While the subsurface and near-interface regions typically contain lower frequencies of cube-oriented grains than anywhere else in the sample, a strong cube texture forms in the sample during recrystallization, attributed to both a high nucleation rate and fast growth rate of cube-oriented grains. The observations highlight the sensitivity of recrystallization to heterogeneity in the deformation microstructure and demonstrate the importance of characterizing this heterogeneity over several length scales.

  1. A Semi-Analytical Method for Determining the Energy Release Rate of Cracks in Adhesively-Bonded Single-Lap Composite Joints

    NASA Technical Reports Server (NTRS)

    Yang, Charles; Sun, Wenjun; Tomblin, John S.; Smeltzer, Stanley S., III

    2007-01-01

    A semi-analytical method for determining the strain energy release rate due to a prescribed interface crack in an adhesively-bonded, single-lap composite joint subjected to axial tension is presented. The field equations in terms of displacements within the joint are formulated by using first-order shear deformable, laminated plate theory together with kinematic relations and force equilibrium conditions. The stress distributions for the adherends and adhesive are determined after the appropriate boundary and loading conditions are applied and the equations for the field displacements are solved. Based on the adhesive stress distributions, the forces at the crack tip are obtained and the strain energy release rate of the crack is determined by using the virtual crack closure technique (VCCT). Additionally, the test specimen geometry from both the ASTM D3165 and D1002 test standards are utilized during the derivation of the field equations in order to correlate analytical models with future test results. The system of second-order differential field equations is solved to provide the adherend and adhesive stress response using the symbolic computation tool, Maple 9. Finite element analyses using J-integral as well as VCCT were performed to verify the developed analytical model. The finite element analyses were conducted using the commercial finite element analysis software ABAQUS. The results determined using the analytical method correlated well with the results from the finite element analyses.

  2. Wire chamber

    DOEpatents

    Atac, Muzaffer

    1989-01-01

    A wire chamber or proportional counter device, such as Geiger-Mueller tube or drift chamber, improved with a gas mixture providing a stable drift velocity while eliminating wire aging caused by prior art gas mixtures. The new gas mixture is comprised of equal parts argon and ethane gas and having approximately 0.25% isopropyl alcohol vapor.

  3. Weld Wire Investigation Summary

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Cunningham, M.A.

    1999-03-22

    After GTA welding reservoir A production/process prove-in assemblies, X-ray examination detected a lack of sidewall fusion. After examining several possible causes, it was determined that the weld wire filler metal was responsible, particularly the wire cleaning process. The final conclusion was that the filler wire must be abrasively cleaned in a particular manner to perform as required. The abrasive process was incorporated into the wire material specification, ensuring consistency for all reservoir GTA welding at AlliedSignal Federal Manufacturing and Technologies (FM and T).

  4. 30 CFR 75.906 - Trailing cables for mobile equipment, ground wires, and ground check wires.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Trailing cables for mobile equipment, ground wires, and ground check wires. 75.906 Section 75.906 Mineral Resources MINE SAFETY AND HEALTH..., ground wires, and ground check wires. [Statutory Provisions] Trailing cables for mobile equipment shall...

  5. 30 CFR 75.906 - Trailing cables for mobile equipment, ground wires, and ground check wires.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Trailing cables for mobile equipment, ground wires, and ground check wires. 75.906 Section 75.906 Mineral Resources MINE SAFETY AND HEALTH..., ground wires, and ground check wires. [Statutory Provisions] Trailing cables for mobile equipment shall...

  6. Superconducting wire manufactured

    NASA Astrophysics Data System (ADS)

    Fu, Yuexian; Sun, Yue; Xu, Shiming; Peng, Ying

    1985-10-01

    The MF Nb/Cu Extrusion Tube Method was used to manufacture 3 kg of stable practical MF Nb2Sn composite superconducting wire containing pure Cu(RRR approx. 200)/Ta. The draw state composite wire diameter was 0.56 mm, it contained 11,448 x 2.6 micron Nb core, and the twist distance was 1.5 cm. The composite wire cross-section was pure Cu/Ta/11,448 Nb core/Cu/ 91Sn-Cu; containing 22.8 v. % pure Cu, 13.3 v. % Ta; within the Ta layer to prevent Sn diffusion. The wire was sheathed in nonalkaline glass fiber as an insulating layer. A section of wire weighing 160 g was cut off and coiled it into a small solenoid. After reaction diffusion processing at 675 C/30 and curing by vacuum dipping in paraffin, it was measured in a Nb-Ti backfield of 7.2 T intensity, a current of 129 A was passed through the Nb3Sn solenoid and produced a strength of 2.5 T, the overall magnetic field intensity of the composite magnet reached 9.7 T. At this time, the wire full current density J sub c.w. = 5.2 x 10 to the 4th power A/sq cm; the effective current density J sub c (Nb + Sn - Cu) = 8.2 x 10 to the 4th power A/sq cm.

  7. Numerical analysis on temperature field in single-wire flux-aided backing-submerged arc welding

    NASA Astrophysics Data System (ADS)

    Pu, Juan; Wu, Ming Fang; Pan, Haichao

    2017-07-01

    Single-wire flux-aided backing-submerged arc welding (FAB-SAW) technology has been widely used to weld thick steel plate due to its easy assembly and high heat input. The microstructure and property of welded joint are closely related to the thermal field of FAB-SAW process. In this research, the feature of thermal field for single-wire FAB-SAW was investigated. Based on the heat transfer mechanism, a three-dimensional transient model for thermal field was developed based on the influence of steel thickness, groove angle and ceramic backing. The temperature profile in single-wire FAB-SAW of D36 steel under different welding conditions was simulated by ANSYS. The characteristic of thermal field was analyzed and the influences of groove angle on temperature field for different plate thicknesses were discussed. The calculated geometries and dimensions of weld cross-section under different conditions show a good agreement with the experimental results. This newly built model can describe the thermal field accurately, which would be helpful to understanding the thermophysical mechanism of FAB-SAW and optimizing the welding process.

  8. Tunable smart digital structure (SDS) to modularly assemble soft actuators with layered adhesive bonding

    NASA Astrophysics Data System (ADS)

    Jin, Hu; Dong, Erbao; Xu, Min; Xia, Qirong; Liu, Shuai; Li, Weihua; Yang, Jie

    2018-01-01

    Many shape memory alloy (SMA)-based soft actuators have specific composite structures and manufacture processes, and are therefore unique. However, these exclusive characteristics limit their capabilities and applications, so in this article a soft and smart digital structure (SDS) is proposed that acts like a modular unit to assemble soft actuators by a layered adhesive bonding process. The SDS is a fully soft structure that encapsulates a digital skeleton consisting of four groups of parallel and independently actuated SMA wires capable of outputting a four-channel tunable force. The layered adhesive bonding process modularly bonds several SDSs with an elastic backbone to fabricate a layered soft actuator where the elastic backbone is used to recover the SDSs in a cooling process using the SMA wires. Two kinds of SDS-based soft actuators were modularly assembled, an actuator, SDS-I, with a two-dimensional reciprocal motion, and an actuator, SDS-II, capable of bi-directional reciprocal motion. The thermodynamics and phase transformation modeling of the SDS-based actuator were analyzed. Several extensional soft actuators were also assembled by bonding the SDS with an anomalous elastic backbone or modularly assembling the SDS-Is and SDS-IIs. These modularly assembled soft actuators delivered more output channels and a complicated motion, e.g., an actinomorphic soft actuator with four SDS-Is jumps in a series of hierarchical heights and directional movement by tuning the input channels of the SDSs. This result showed that the SDS can modularly assemble multifarious soft actuators with diverse capabilities, steerability and tunable outputs.

  9. The effect of ligation on the load deflection characteristics of nickel titanium orthodontic wire.

    PubMed

    Kasuya, Shugo; Nagasaka, Satoshi; Hanyuda, Ai; Ishimura, Sadao; Hirashita, Ayao

    2007-12-01

    This study examined the effect of ligation on the load-deflection characteristics of nickel-titanium (NiTi) orthodontic wire. A modified three-point bending system was used for bending the NiTi round wire, which was inserted and ligated in the slots of three brackets, one of which was bonded to each of the three bender rods. Three different ligation methods, stainless steel ligature (SSL), slot lid (SL), and elastomeric ligature (EL), were employed, as well as a control with neither bracket nor ligation (NBL). The tests were repeated five times under each condition. Comparisons were made of load-deflection curve, load at maximum deflection of 2,000 microm, and load at a deflection of 1,500 microm during unloading. Analysis of Variance (ANOVA) and Dunnett's test were conducted to determine method difference (alpha = 0.05). The interaction between deflection and ligation was tested, using repeated-measures ANOVA (alpha = 0.05). The load values of the ligation groups were two to three times greater than the NBL group at a deflection of 1,500 microm during unloading: 4.37 N for EL, 3.90 N for SSL, 3.02 N for SL, and 1.49 N for NBL (P < 0.01). For the EL, a plateau region disappeared in the unloading curve. SL showed the smallest load. The ligation of the bracket wire may make NiTi wire exhibit a significantly heavier load than that traditionally expected. NiTi wire exhibited the majority of its true superelasticity with SL, whereas EL may act as a restraint on its superelasticity.

  10. Electrical resistance determination of actual contact area of cold welded metal joints

    NASA Technical Reports Server (NTRS)

    Hordon, M. J.

    1970-01-01

    Method measures the area of the bonded zone of a compression weld by observing the electrical resistance of the weld zone while the load changes from full compression until the joint ruptures under tension. The ratio of bonding force to maximum tensile load varies considerably.

  11. Wafer-level Cu-Sn micro-joints with high mechanical strength and low Sn overflow

    NASA Astrophysics Data System (ADS)

    Duan, Ani; Luu, Thi-Thuy; Wang, Kaiying; Aasmundtveit, Knut; Hoivik, Nils

    2015-09-01

    In this paper, we report wafer-level bonding using solid-liquid inter-diffusion (SLID) processes for fabricating micro-joints Cu-Sn at low temperature (270 °C). The evolution of multilayer Cu/Sn to micro-joint alloys has been characterized by optical microscopy and mechanical die-shear testing. The Cu-Sn joints with line width from 80 to 200 μm prove to be reliable packaging materials for bonding vacuum micro-cavities with controllable Sn overflow, as well as high mechanical strength (>70 MPa). A thermodynamic model has been performed to further understand the formation of Cu-Sn intermetallic alloys. There are two important findings for this work: 1) Using a two-step temperature profile may significantly reduce the amount of Sn overflow; 2) for packaging, a bond frame width greater than 80 μm will result in high yield.

  12. Using wire shaping techniques and holographic optics to optimize deposition characteristics in wire-based laser cladding.

    PubMed

    Goffin, N J; Higginson, R L; Tyrer, J R

    2016-12-01

    In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, although wire-based methods have been shown to be capable of superior quality results, the wire-based process is more difficult to control. In this work, the potential for wire shaping techniques, combined with existing holographic optical element knowledge, is investigated in order to further improve the processing characteristics. Experiments with pre-placed wire showed the ability of shaped wire to provide uniformity of wire melting compared with standard round wire, giving reduced power density requirements and superior control of clad track dilution. When feeding with flat wire, the resulting clad tracks showed a greater level of quality consistency and became less sensitive to alterations in processing conditions. In addition, a 22% increase in deposition rate was achieved. Stacking of multiple layers demonstrated the ability to create fully dense, three-dimensional structures, with directional metallurgical grain growth and uniform chemical structure.

  13. Using wire shaping techniques and holographic optics to optimize deposition characteristics in wire-based laser cladding

    PubMed Central

    Higginson, R. L.; Tyrer, J. R.

    2016-01-01

    In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, although wire-based methods have been shown to be capable of superior quality results, the wire-based process is more difficult to control. In this work, the potential for wire shaping techniques, combined with existing holographic optical element knowledge, is investigated in order to further improve the processing characteristics. Experiments with pre-placed wire showed the ability of shaped wire to provide uniformity of wire melting compared with standard round wire, giving reduced power density requirements and superior control of clad track dilution. When feeding with flat wire, the resulting clad tracks showed a greater level of quality consistency and became less sensitive to alterations in processing conditions. In addition, a 22% increase in deposition rate was achieved. Stacking of multiple layers demonstrated the ability to create fully dense, three-dimensional structures, with directional metallurgical grain growth and uniform chemical structure. PMID:28119550

  14. Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

    NASA Astrophysics Data System (ADS)

    Huang, Y.; Kim, H. J.; McCracken, M.; Viswanathan, G.; Pon, F.; Mayer, M.; Zhou, Y. N.

    2011-06-01

    A 0.3- μm-thick electrolytic Pd layer was plated on 1 μm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values ( R a) of 0.08 μm and 0.5 μm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 800 h at 250°C by measuring the ball bond contact resistance, R c. The average value of R c of optimized ball bonds on the rough substrate was 1.96 mΩ which was about 40.0% higher than that on the smooth substrate. The initial bondability increased for the rougher surface, so that only half of the original ultrasonic level was required, but the reliability was not affected by surface roughness. For both substrate types, HTST caused bond healing, reducing the average R c by about 21% and 27%, respectively. Au diffusion into the Pd layer was observed in scanning transmission electron microscopy/ energy dispersive spectroscopy (STEM-EDS) line-scan analysis after HTST. It is considered that diffusion of Au or interdiffusion between Au and Pd can provide chemically strong bonding during HTST. This is supported by the R c decrease measured as the aging time increased. Cu migration was indicated in the STEM-EDS analysis, but its effect on reliability can be ignored. Au and Pd tend to form a complete solid solution at the interface and can provide reliable interconnection for high temperature (250°C) applications.

  15. Hydrogen in Mono-Atomic Gold Wires

    NASA Astrophysics Data System (ADS)

    Barnett, Robert N.; Sherbakov, Andrew G.; Landman, Uzi; Hakkinen, Hannu

    2004-03-01

    Results of ab-initio scalar relativistic density functional calculations of the interaction between a mono-atomic gold wire (suspended between two gold tips) and a hydrogen molecule, at various stages of wire stretching, are presented. The hydrogen molecule does not bind to the wire until the wire is sufficiently stretched, i.e. starting to break, at which time the molecule inserts itself into the wire restoring a fraction of the conductance quantum g. With subsequent compression of the wire the axis of the molecule gradually tips away from the wire axis until it becomes "quasi-dissociated" with the H-H axis perpendicular to the wire. At this point the conductance almost vanishes, while for the bare wire the conductance at this tip-to-tip separation is close to 1g. These results, and the frequency of various vibrational modes of the hydrogen molecule, are compared with recent experimental and theoretical work involving platinum wires.

  16. Corrosion of Wires on Wooden Wire-Bound Packaging Crates

    Treesearch

    Samuel L. Zelinka; Stan Lebow

    2015-01-01

    Wire-bound packaging crates are used by the US Army to transport materials. Because these crates may be exposed to harsh environments, they are dip-treated with a wood preservative (biocide treatment). For many years, zinc-naphthenate was the most commonly used preservative for these packaging crates and few corrosion problems with the wires were observed. Recently,...

  17. Probabilistic and Possibilistic Analyses of the Strength of a Bonded Joint

    NASA Technical Reports Server (NTRS)

    Stroud, W. Jefferson; Krishnamurthy, T.; Smith, Steven A.

    2001-01-01

    The effects of uncertainties on the strength of a single lap shear joint are explained. Probabilistic and possibilistic methods are used to account for uncertainties. Linear and geometrically nonlinear finite element analyses are used in the studies. To evaluate the strength of the joint, fracture in the adhesive and material strength failure in the strap are considered. The study shows that linear analyses yield conservative predictions for failure loads. The possibilistic approach for treating uncertainties appears to be viable for preliminary design, but with several qualifications.

  18. Length-Dependent Nanotransport and Charge Hopping Bottlenecks in Long Thiophene-Containing π-Conjugated Molecular Wires.

    PubMed

    Smith, Christopher E; Odoh, Samuel O; Ghosh, Soumen; Gagliardi, Laura; Cramer, Christopher J; Frisbie, C Daniel

    2015-12-23

    Self-assembled conjugated molecular wires containing thiophene up to 6 nm in length were grown layer-by-layer using click chemistry. Reflection-absorption infrared spectroscopy, ellipsometry and X-ray photoelectron spectroscopy were used to follow the stepwise growth. The electronic structure of the conjugated wires was studied with cyclic voltammetry and UV-vis spectroscopy as well as computationally with density functional theory (DFT). The current-voltage curves (±1 V) of the conjugated molecular wires were measured with conducting probe atomic force microscopy (CP-AFM) in which the molecular wire film bound to a gold substrate was contacted with a conductive AFM probe. By systematically measuring the low bias junction resistance as a function of length for molecules 1-4 nm long, we extracted the structure dependent tunneling attenuation factor (β) of 3.4 nm(-1) and a contact resistance of 220 kΩ. The crossover from tunneling to hopping transport was observed at a molecular length of 4-5 nm with an activation energy of 0.35 eV extracted from Arrhenius plots of resistance versus temperature. DFT calculations revealed localizations of spin densities (polarons) on molecular wire radical cations. The calculations were employed to gauge transition state energies for hopping of polarons along wire segments. Individual estimated transition state energies were 0.2-0.4 eV, in good agreement with the experimental activation energy. The transition states correspond to flattening of dihedral angles about specific imine bonds. These results open up possibilities to further explore the influence of molecular architecture on hopping transport in molecular junctions, and highlight the utility of DFT to understand charge localization and associated hopping-based transport.

  19. Influence of bolt tightening torque, wire size, and component reuse on wire fixation in circular external fixation.

    PubMed

    Wosar, Marc A; Marcellin-Little, Denis J; Roe, Simon C

    2002-01-01

    To evaluate the effects of bolt torque, wire size, and component reuse on the ability to maintain wire tension in 3 external skeletal fixation systems. Biomechanical study. Yield strength in tension of 1.0-, 1.2-, 1.5-, and 1.6-mm-diameter wires, and yield strength in torque of Hofmann Small Bone Fixation (SBF) cannulated and slotted bolts and IMEX regular and miniature bolts were determined on a testing machine. The minimum bolt tightening torque needed to prevent wire slippage at clinically recommended wire tensions was determined. Components were tested 10 times, and loads at slippage were recorded. The IMEX system required a mean of 8 Nm of bolt tightening torque to maintain 900 N (1.6-mm wires). The SBF system required a mean of 3 Nm bolt torque to maintain 300 N (1.0-mm wires) and 5 Nm to maintain 600 N (1.2-mm wires). The SBF cannulated bolt required 9 Nm of torque to maintain 900 N (1.5-mm wires). The SBF slotted bolts could only maintain 800 N before yield. The IMEX miniature system required a mean bolt torque of 1.1 Nm to maintain 300 N. The cannulated and slotted bolts from both manufacturers failed to maintain 70% of initial wire tension after 7 and 4 uses, respectively. The IMEX systems and the SBF system using 1.0- and 1.2-mm wires could maintain clinically recommended wire tension safely. Only the IMEX system could maintain clinically recommended wire tension safely using 1.5- or 1.6-mm wires. The SBF system using 1.0- and 1.2-mm wires and the IMEX system using all wire sizes can maintain clinically relevant wire tension. The SBF system using 1.5-mm wires could not. Cannulated and slotted bolts should not be used more than 6 and 3 times, respectively. Nuts should not be reused. Copyright 2002 by The American College of Veterinary Surgeons

  20. Evaluation of a thin-bonded Portland cement concrete pavement overlay.

    DOT National Transportation Integrated Search

    1996-01-01

    This report discusses the performance of the Virginia Department of Transportation's first modern rehabilitation project involving a thin-bonded portland cement concrete overlay of an existing jointed concrete pavement. The performance of the rigid o...

  1. A guided-wave system for monitoring the wing skin-to-spar bond in unmanned aerial vehicles

    NASA Astrophysics Data System (ADS)

    Matt, Howard; Bartoli, Ivan; Lanza di Scalea, Francesco; Marzani, Alessandro; Coccia, Stefano; Oliver, Joseph; Kosmatka, John; Rizzo, Piervincenzo; Restivo, Gaetano

    2005-05-01

    Unmanned Aerial Vehicles (UAVs) are being increasingly used in military as well as civil applications. A critical part of the structure is the adhesive bond between the wing skin and the supporting spar. If not detected early, bond defects originating during manufacturing or in service flight can lead to inefficient flight performance and eventual global failure. This paper will present results from a bond inspection system based on attached piezoelectric disks probing the skin-to-spar bondline with ultrasonic guided waves in the hundreds of kilohertz range. The test components were CFRP composite panels of two different fiber layups bonded to a CFRP composite tube using epoxy adhesive. Three types of bond conditions were simulated, namely regions of poor cohesive strength, regions with localized disbonds and well bonded regions. The root mean square and variance of the received time-domain signals and their discrete wavelet decompositions were computed for the dominant modes propagating through the various bond regions in two different inspection configurations. Semi-analytical finite element analysis of the bonded multilayer joint was also carried out to identify and predict the sensitivity of the predominant carrier modes to the different bond defects. Emphasis of this research is based upon designing a built-in system for monitoring the structural integrity of bonded joints in UAVs and other aerospace structures.

  2. 49 CFR 234.231 - Fouling wires.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... 49 Transportation 4 2011-10-01 2011-10-01 false Fouling wires. 234.231 Section 234.231..., Inspection, and Testing Maintenance Standards § 234.231 Fouling wires. Each set of fouling wires in a highway... single duplex wire with single plug acting as fouling wires is prohibited. Existing installations having...

  3. 49 CFR 234.231 - Fouling wires.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... 49 Transportation 4 2010-10-01 2010-10-01 false Fouling wires. 234.231 Section 234.231..., Inspection, and Testing Maintenance Standards § 234.231 Fouling wires. Each set of fouling wires in a highway... single duplex wire with single plug acting as fouling wires is prohibited. Existing installations having...

  4. Hydrated Excess Protons Can Create Their Own Water Wires.

    PubMed

    Peng, Yuxing; Swanson, Jessica M J; Kang, Seung-gu; Zhou, Ruhong; Voth, Gregory A

    2015-07-23

    Grotthuss shuttling of an excess proton charge defect through hydrogen bonded water networks has long been the focus of theoretical and experimental studies. In this work we show that there is a related process in which water molecules move ("shuttle") through a hydrated excess proton charge defect in order to wet the path ahead for subsequent proton charge migration. This process is illustrated through reactive molecular dynamics simulations of proton transport through a hydrophobic nanotube, which penetrates through a hydrophobic region. Surprisingly, before the proton enters the nanotube, it starts "shooting" water molecules into the otherwise dry space via Grotthuss shuttling, effectively creating its own water wire where none existed before. As the proton enters the nanotube (by 2-3 Å), it completes the solvation process, transitioning the nanotube to the fully wet state. By contrast, other monatomic cations (e.g., K(+)) have just the opposite effect, by blocking the wetting process and making the nanotube even drier. As the dry nanotube gradually becomes wet when the proton charge defect enters it, the free energy barrier of proton permeation through the tube via Grotthuss shuttling drops significantly. This finding suggests that an important wetting mechanism may influence proton translocation in biological systems, i.e., one in which protons "create" their own water structures (water "wires") in hydrophobic spaces (e.g., protein pores) before migrating through them. An existing water wire, e.g., one seen in an X-ray crystal structure or MD simulations without an explicit excess proton, is therefore not a requirement for protons to transport through hydrophobic spaces.

  5. Influence of different brazing and welding methods on tensile strength and microhardness of orthodontic stainless steel wire.

    PubMed

    Bock, Jens Johannes; Fraenzel, Wolfgang; Bailly, Jacqueline; Gernhardt, Christian Ralf; Fuhrmann, Robert Andreas Werner

    2008-08-01

    The aim of this study was to compare the mechanical strength and microhardness of joints made by conventional brazing and tungsten inert gas (TIG) and laser welding. A standardized end-to-end joint configuration of the orthodontic wire material in spring hard quality was used. The joints were made using five different methods: brazing (soldering > 450 degrees C) with universal silver solder, two TIG, and two laser welders. Laser parameters and welding conditions were used according to the manufacturers' guidance. The tensile strengths were measured with a universal testing machine (Zwick 005). The microhardness measurements were carried out with a hardness tester (Zwick 3202). Data were analysed using one-way analysis of variance and Bonferroni's post hoc correction (P < 0.05). In all cases, brazing joints ruptured at low levels of tensile strength (198 +/- 146 MPa). Significant differences (P < 0.001) between brazing and TIG or laser welding were found. The highest means were observed for TIG welding (699-754 MPa). Laser welding showed a significantly lower mean tensile strength (369-520 MPa) compared with TIG welding. Significant differences (P < 0.001) were found between the original orthodontic wire and the mean microhardness at the centre of the welded area. The mean microhardness differed significantly between brazing (1.99 GPa), TIG (2.22-2.39 GPa) and laser welding (2.21-2.68 GPa). For orthodontic purposes, laser and TIG welding are solder-free alternatives to joining metal. TIG welding with a lower investment cost is comparable with laser welding. However, while expensive, the laser technique is a sophisticated and simple method.

  6. Apollo experience report: Electrical wiring subsystem

    NASA Technical Reports Server (NTRS)

    White, L. D.

    1975-01-01

    The general requirements of the electrical wiring subsystems and the problem areas and solutions that occurred during the major part of the Apollo Program are detailed in this report. The concepts and definitions of specific requirements for electrical wiring; wire-connecting devices; and wire-harness fabrication, checkout, and installation techniques are discussed. The design and development of electrical wiring and wire-connecting devices are described. Mission performance is discussed, and conclusions and recommendations for future programs are presented.

  7. Forming Refractory Insulation On Copper Wire

    NASA Technical Reports Server (NTRS)

    Setlock, J.; Roberts, G.

    1995-01-01

    Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

  8. Adhesive bonding and the use of corrosion resistant primers. [for metal surface preparation

    NASA Technical Reports Server (NTRS)

    Hockridge, R. R.; Thibault, H. G.

    1972-01-01

    The use of an anti-corrosive primer has been shown to be essential to assure survival of a bonded structure in a hostile environment, particularly if a stress is to be applied to the adhesively bonded joint during the environmental exposure. For example, the Lockheed L-1011 TriStar assembly, after exhaustive evaluation tests specifies use of chromate filled inhibitive polysulfide sealants, and use of corrosion inhibiting adhesive primers prior to structural bonding with film adhesive.

  9. In Situ Study of Reduction Process of CuO Paste and Its Effect on Bondability of Cu-to-Cu Joints

    NASA Astrophysics Data System (ADS)

    Yao, Takafumi; Matsuda, Tomoki; Sano, Tomokazu; Morikawa, Chiaki; Ohbuchi, Atsushi; Yashiro, Hisashi; Hirose, Akio

    2018-04-01

    A bonding method utilizing redox reactions of metallic oxide microparticles achieves metal-to-metal bonding in air, which can be alternative to lead-rich high-melting point solder. However, it is known that the degree of the reduction of metallic oxide microparticles have an influence on the joint strength using this bonding method. In this paper, the reduction behavior of CuO paste and its effect on Cu-to-Cu joints were investigated through simultaneous microstructure-related x-ray diffraction and differential scanning calorimetry measurements. The CuO microparticles in the paste were gradually reduced to submicron Cu2O particles at 210-250°C. Subsequently, Cu nanoparticles were generated instantaneously at 300-315°C. There was a marked difference in the strengths of the joints formed at 300°C and 350°C. Thus, the Cu nanoparticles play a critical role in sintering-based bonding using CuO paste. Furthermore, once the Cu nanoparticles have formed, the joint strength increases with higher bonding temperature (from 350°C to 500°C) and pressure (5-15 MPa), which can exceed the strength of Pb-5Sn solder at higher temperature and pressure.

  10. Fly-By-Light/Power-By-Wire Requirements and Technology Workshop

    NASA Technical Reports Server (NTRS)

    Baker, Robert L. (Editor); Pitts, Felix L. (Editor)

    1992-01-01

    The results of the Fly-By-Light/Power-By-Wire (FBL/PBW) Workshop held on March 17-19, 1992, at the NASA Langley Research Center are presented. The FBL/PBW program is a joint NASA LeRC/LaRC effort to develop the technology base for confident application of integrated FBL/PBW systems to transport aircraft. The objectives of the workshop were to ascertain the FBL/PBW program technical requirements and satisfy the requirements and needs from the industry viewpoint, provide a forum for presenting and documenting alternative technical approaches which satisfy the requirements, and assess the plan adequacy in accomplishing plan objectives, aims, and technology transfer. Areas addressed were: optical sensor systems, power-by-wire systems, FBL/PBW fault-tolerant architectures, electromagnetic environment assessment, and system integration and demonstration. The workshop consisted of an introductory meeting, a 'keynote' presentation, a series of individual panel sessions covering the above areas, with midway presentations by the panel chairpersons, followed by a final summarizing/integrating session by the individual panels, and a closing plenary session summarizing the results of the workshop.

  11. Manually Operated Welding Wire Feeder

    NASA Technical Reports Server (NTRS)

    Rybicki, Daniel J. (Inventor)

    2001-01-01

    A manual welding wire feeder apparatus comprising a bendable elongate metal frame with a feed roller mounted at the center thereof for rotation about an axis transverse to the longitudinal axis of the frame. The frame ends are turned up as tabs and each provided with openings in alignment with each other and the mid-width center of the roller surface. The tab openings are sized to accommodate welding wire and each extends to a side edge of the tab, both opening on the same side of the frame, whereby welding wire can be side-loaded onto the frame. On the side of the frame, opposite the roller a lock ring handle is attached tangentially and is rotatable about the attachment point and an axis perpendicular to the frame. The device is grasped in the hand normally used to hold the wire. A finger is placed through the loop ring and the frame positioned across the palm and lower fingers. The thumb is positioned atop the wire so it can be moved from the back of the frame across the roller, and towards the front. In doing so, the wire is advanced at a steady rate in axial alignment with the tab openings and roller. To accommodate different wire diameters the frame is bendable about its center in the plane of the frame axis and wire so as to keep the wire in sufficient tension against the roller and to keep the wire fixed when the frame is tilted and thumb pressure released.

  12. Electrode carrying wire for GTAW welding

    NASA Technical Reports Server (NTRS)

    Morgan, Gene E. (Inventor); Dyer, Gerald E. (Inventor)

    1990-01-01

    A welding torch for gas tungsten arc welding apparatus has a hollow tungsten electrode including a ceramic liner and forms the filler metal wire guide. The wire is fed through the tungsten electrode thereby reducing the size of the torch to eliminate clearance problems which exist with external wire guides. Since the wire is preheated from the tungsten more wire may be fed into the weld puddle, and the wire will not oxidize because it is always within the shielding gas.

  13. Internal wire guide for GTAW welding

    NASA Technical Reports Server (NTRS)

    Morgan, Gene E. (Inventor); Dyer, Gerald E. (Inventor)

    1989-01-01

    A welding torch for gas tungsten arc welding apparatus has a filler metal wire guide positioned within the torch, and within the shielding gas nozzle. The wire guide is adjacent to the tungsten electrode and has a ceramic liner through which the wire is fed. This reduces the size of the torch and eliminates the outside clearance problems that exit with external wire guides. Additionally, since the wire is always within the shielding gas, oxidizing of the wire is eliminated.

  14. Experimental Design for Evaluation of Co-extruded Refractory Metal/Nickel Base Superalloy Joints

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    ME Petrichek

    2005-12-16

    Prior to the restructuring of the Prometheus Program, the NRPCT was tasked with delivering a nuclear space reactor. Potential NRPCT nuclear space reactor designs for the Prometheus Project required dissimilar materials to be in contact with each other while operating at extreme temperatures under irradiation. As a result of the high reactor core temperatures, refractory metals were the primary candidates for many of the reactor structural and cladding components. They included the tantalum-base alloys ASTAR-811C and Ta-10W, the niobium-base alloy FS-85, and the molybdenum base alloys Moly 41-47.5 Rhenium. The refractory metals were to be joined to candidate nickel basemore » alloys such as Haynes 230, Alloy 617, or Nimonic PE 16 either within the core if the nickel-base alloys were ultimately selected to form the outer core barrel, or at a location exterior to the core if the nickel-base alloys were limited to components exterior to the core. To support the need for dissimilar metal joints in the Prometheus Project, a co-extrusion experiment was proposed. There are several potential methods for the formation of dissimilar metal joints, including explosive bonding, friction stir welding, plasma spray, inertia welding, HIP, and co-extrusion. Most of these joining methods are not viable options because they result in the immediate formation of brittle intermetallics. Upon cooling, intermetallics form in the weld fusion zone between the joined metals. Because brittle intermetallics do not form during the initial bonding process associated with HIP, co-extrusion, and explosive bonding, these three joining procedures are preferred for forming dissimilar metal joints. In reference to a Westinghouse Astronuclear Laboratory report done under a NASA sponsored program, joints that were fabricated between similar materials via explosive bonding had strengths that were directly affected by the width of the diffusion barrier. It was determined that the diffusion zone should

  15. [Arthrodesis (with/without correction) of the ankle and subtalar joint: A3 nail fixation with triple bending and mechanical navigation].

    PubMed

    Richter, M

    2014-08-01

    Restoration of a stable and plantigrade foot in deformities of the ankle and/or hindfoot and concomitant degenerative changes at the ankle and subtalar joints. Deformities at the ankle and/or hindfoot and concomitant degenerative changes at the ankle and subtalar joint. Failed (corrective) arthrodesis of the ankle and subtalar joints. Fused ankle and degeneration of the subtalar joint. Failed total ankle replacement with insufficient substance of talar body and/or degeneration of subtalar joint. Massive hindfoot instability. Active local infection or relevant vascular insufficiency, possible preservation of the ankle or subtalar joint (relative contraindication). Prone position and posterolateral approach to ankle and subtalar joints (alternative supine position/anterior approach; lateral position/lateral approach). Exposition of ankle and subtalar joints and removal of remaining cartilage. Optional corrective osteotomies and/or bone grafting. Correction and optional fixation of the corrected position with 2.0 mm K-wires. Mechanically navigated insertion of a retrograde guide wire in projection of the tibial axis and insertion of a second guide wire through the entry point of the nail lateral and dorsal to the tibial axis. Reaming and insertion of the A3 nail with a distal double bend; one posterior and one lateral, and a proximal bend corresponding to a slight recurvatum. Insertion of locking screws into the calcaneus, talus and tibia (twice with optional static or dynamic locking). Optional compression between calcaneus and talus, and between tibia and talus. Insertion of a drainage and layer-wise closure. For the first 6 weeks 15 kg partial weight bearing in an orthosis, followed by full weight bearing in a stable standard shoe. In October 2010 (n = 2) and from 15 October 2011 to 13 April 2012 (n = 26) 28 arthrodeses (with/without correction) with A3 fixation were performed. In all cases, exact nail placement was achieved. Thirteen cases completed

  16. Advancement of wave generation and signal transmission in wire waveguides for structural health monitoring applications

    NASA Astrophysics Data System (ADS)

    Kropf, M.; Pedrick, M.; Wang, X.; Tittmann, B. R.

    2005-05-01

    As per the recent advances in remote in situ monitoring of industrial equipment using long wire waveguides (~10m), novel applications of existing wave generation techniques and new acoustic modeling software have been used to advance waveguide technology. The amount of attainable information from an acoustic signal in such a system is limited by transmission through the waveguide along with frequency content of the generated waves. Magnetostrictive, and Electromagnetic generation techniques were investigated in order to maximize acoustic transmission along the waveguide and broaden the range of usable frequencies. Commercial EMAT, Magnetostrictive and piezoelectric disc transducers (through the innovative use of an acoustic horn) were utilized to generate waves in the wire waveguide. Insertion loss, frequency bandwidth and frequency range were examined for each technique. Electromagnetic techniques are shown to allow for higher frequency wave generation. This increases accessibility of dispersion curves providing further versatility in the selection of guided wave modes, thus increasing the sensitivity to physical characteristics of the specimen. Both electromagnetic and magnetostrictive transducers require the use of a ferromagnetic waveguide, typically coupled to a steel wire when considering long transmission lines (>2m). The interface between these wires introduces an acoustic transmission loss. Coupling designs were examined with acoustic finite element software (Coupled-Acoustic Piezoelectric Analysis). Simulations along with experimental results aided in the design of a novel joint which minimizes transmission loss. These advances result in the increased capability of remote sensing using wire waveguides.

  17. 49 CFR 234.239 - Tagging of wires and interference of wires or tags with signal apparatus.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... with signal apparatus. 234.239 Section 234.239 Transportation Other Regulations Relating to... Tagging of wires and interference of wires or tags with signal apparatus. Each wire shall be tagged or... of the apparatus. This requirement applies to each wire at each terminal in all housings including...

  18. 49 CFR 234.239 - Tagging of wires and interference of wires or tags with signal apparatus.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... with signal apparatus. 234.239 Section 234.239 Transportation Other Regulations Relating to... Tagging of wires and interference of wires or tags with signal apparatus. Each wire shall be tagged or... of the apparatus. This requirement applies to each wire at each terminal in all housings including...

  19. Cavitation during wire brushing

    NASA Astrophysics Data System (ADS)

    Li, Bo; Zou, Jun; Ji, Chen

    2016-11-01

    In our daily life, brush is often used to scrub the surface of objects, for example, teeth, pots, shoes, pool, etc. And cleaning rust and stripping paint are accomplished using wire brush. Wire brushes also can be used to clean the teeth for large animals, such as horses, crocodiles. By observing brushing process in water, we capture the cavitation phenomenon on the track of moving brush wire. It shows that the cavitation also can affect the surface. In order to take clear and entire pictures of cavity, a simplified model of one stainless steel wire brushing a boss is adopted in our experiment. A transparent organic tank filled with deionized water is used as a view box. And a high speed video camera is used to record the sequences. In experiment, ambient pressure is atmospheric pressure and deionized water temperature is kept at home temperature. An obvious beautiful flabellate cavity zone appears behind the moving steel wire. The fluctuation of pressure near cavity is recorded by a hydrophone. More movies and pictures are used to show the behaviors of cavitation bubble following a restoring wire. Beautiful tracking cavitation bubble cluster is captured and recorded to show.

  20. Polarity effect of electromigration on mechanical properties of lead-free solder joints

    NASA Astrophysics Data System (ADS)

    Ren, Fei

    The trend of electronic packaging is to package the chips and the associated interconnections in a compact way that allows high speed operation; that allows for sufficient heat removal; that can withstand the thermal cycling associated with the turning on and turning off of the circuits; and that protects the circuits from environmental attack. These goals require that flip chip solder joints have higher resistance to electromigration, stronger mechanical property to sustain thermal mechanical stress, and are lead-free materials to satisfy environment and health concern. With lots of work on chemical reaction, electromigration and mechanical study in flip chip solder joints, however, the interaction between different driving forces is still little known. As a matter of fact, the combination study of chemical, electrical and mechanical is more and more significant to the understanding of the behavior of flip chip solder joints. In this dissertation, I developed one dimensional Cu (wire)-eutectic SnAgCu(ball)-Cu(wire) structure to investigate the interaction between electrical and mechanical force in lead-free solder joints. Electromigration was first conducted. The mechanical behaviors of solder joints before, after, and during electromigration were examined. Electrical current and mechanical stress were applied either in serial or in parallel to the solder joints. Tensile, creep, and drop tests, combined with different electrical current densities (1˜5x10 3A/cm2) and different stressing time (3˜144 hours), have been performed to study the effect of electromigration on the mechanical behavior of solder joints. Nano-indentation test was conducted to study the localized mechanical property of IMC at both interfaces in nanometer scale. Fracture images help analyze the failure mechanism of solder joints driven by both electrical and mechanical forces. The combination study shows a strain build-up during electromigration. Furthermore, a ductile-to-brittle transition in

  1. Wire-number effects on high-power annular z-pinches and some characteristics at high wire number

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    SANFORD,THOMAS W. L.

    2000-05-23

    Characteristics of annular wire-array z-pinches as a function of wire number and at high wire number are reviewed. The data, taken primarily using aluminum wires on Saturn are comprehensive. The experiments have provided important insights into the features of wire-array dynamics critical for high x-ray power generation, and have initiated a renaissance in z-pinches when high numbers of wires are used. In this regime, for example, radiation environments characteristic of those encountered during the early pulses required for indirect-drive ICF ignition on the NIF have been produced in hohlraums driven by x-rays from a z-pinch, and are commented on here.

  2. Frequency response in short thermocouple wires

    NASA Technical Reports Server (NTRS)

    Forney, L. J.; Meeks, E. L.; Ma, J.; Fralick, G. C.

    1992-01-01

    Theoretical expressions are derived for the steady state frequency response of a thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for a nonuniform wire with unequal material properties and wire diameters across the junction. The amplitude ratio at low frequency omega approaches 0 agrees with the results of Scadron and Warshawsky (1952) for a steady state temperature distribution. Moreover, the frequency response for a nonuniform wire in the limit of infinite length l approaches infinity is shown to reduce to a simple expression that is analogous to the classic first order solution for a thermocouple wire with uniform properties. Theoretical expressions are also derived for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire and a two material wire with unequal material properties across the junction. For the case of a one material supported wire, an exact solution is derived which compares favorably with an approximate expression that only matches temperatures at the support junction. Moreover, for the case of a two material supported wire, an analytical expression is derived that closely correlates numerical results. Experimental measurements are made for the steady state frequency response of a supported thermocouple wire. In particular, the effects of axial heat conduction are demonstrated for both a supported one material wire (type K) and a two material wire (type T) with unequal material properties across the junction. The data for the amplitude ratio and phase angle are correlated to within 10 pct. with the theoretical predictions of Forney and Fralick (1991). This is accomplished by choosing a natural frequency omega sub n for the wire data to correlate the first order response at large gas temperature frequencies. It is found that a large bead size, however, will increase the amplitude ratio at

  3. Self-Catalyzed CdTe Wires.

    PubMed

    Baines, Tom; Papageorgiou, Giorgos; Hutter, Oliver S; Bowen, Leon; Durose, Ken; Major, Jonathan D

    2018-04-25

    CdTe wires have been fabricated via a catalyst free method using the industrially scalable physical vapor deposition technique close space sublimation. Wire growth was shown to be highly dependent on surface roughness and deposition pressure, with only low roughness surfaces being capable of producing wires. Growth of wires is highly (111) oriented and is inferred to occur via a vapor-solid-solid growth mechanism, wherein a CdTe seed particle acts to template the growth. Such seed particles are visible as wire caps and have been characterized via energy dispersive X-ray analysis to establish they are single phase CdTe, hence validating the self-catalysation route. Cathodoluminescence analysis demonstrates that CdTe wires exhibited a much lower level of recombination when compared to a planar CdTe film, which is highly beneficial for semiconductor applications.

  4. Multi-objective optimization on laser solder jet bonding process in head gimbal assembly using the response surface methodology

    NASA Astrophysics Data System (ADS)

    Deeying, J.; Asawarungsaengkul, K.; Chutima, P.

    2018-01-01

    This paper aims to investigate the effect of laser solder jet bonding parameters to the solder joints in Head Gimbal Assembly. Laser solder jet bonding utilizes the fiber laser to melt solder ball in capillary. The molten solder is transferred to two bonding pads by nitrogen gas. The response surface methodology have been used to investigate the effects of laser energy, wait time, nitrogen gas pressure, and focal position on the shear strength of solder joints and the change of pitch static attitude (PSA). The response surface methodology is employed to establish the reliable mathematical relationships between the laser soldering parameters and desired responses. Then, multi-objective optimization is conducted to determine the optimal process parameters that can enhance the joint shear strength and minimize the change of PSA. The validation test confirms that the predicted value has good agreement with the actual value.

  5. Orbiter Kapton wire operational requirements and experience

    NASA Technical Reports Server (NTRS)

    Peterson, R. V.

    1994-01-01

    The agenda of this presentation includes the Orbiter wire selection requirements, the Orbiter wire usage, fabrication and test requirements, typical wiring installations, Kapton wire experience, NASA Kapton wire testing, summary, and backup data.

  6. Moving Large Wiring-Harness Boards

    NASA Technical Reports Server (NTRS)

    Shepherd, Samuel D.; Gurman, Isaac

    1990-01-01

    Carrier for wiring-harness fabrication boards enables lone operator to move board easily and safely. Holds harness while operator fabricating, while being stored, and being transported to equipment frame for mounting. When positioned for assembly of wiring harness, board and carrier give operator easy and convenient access to wires and cables, when positioned for transfer of wiring harness to or from storage area, carrier holds board securely while moved by one person.

  7. Wire EDM for Refractory Materials

    NASA Technical Reports Server (NTRS)

    Zellars, G. R.; Harris, F. E.; Lowell, C. E.; Pollman, W. M.; Rys, V. J.; Wills, R. J.

    1982-01-01

    In an attempt to reduce fabrication time and costs, Wire Electrical Discharge Machine (Wire EDM) method was investigated as tool for fabricating matched blade roots and disk slots. Eight high-strength nickel-base superalloys were used. Computer-controlled Wire EDM technique provided high quality surfaces with excellent dimensional tolerances. Wire EDM method offers potential for substantial reductions in fabrication costs for "hard to machine" alloys and electrically conductive materials in specific high-precision applications.

  8. High strength, wire-reinforced electroformed structures

    NASA Technical Reports Server (NTRS)

    Kazaroff, J. M.; Duscha, R. A.; Mccandless, L. C.

    1974-01-01

    Using half-round reinforcing wires, electrodeposited matrix metal readily fills spaces between wires in intimate contact with wires and without voids. Procedure combines advantages of electroforming with high-strength of commonly available wire to produce non-welded shell structures for high pressure uses.

  9. Adhesively-Bonded Structural Composite Joint Utilizing Shoulder-Centered Sleeves

    NASA Technical Reports Server (NTRS)

    Lukowski, Florian P., Jr. (Inventor)

    2015-01-01

    A composite joint includes a first member having a groove therein, a second member adjacent to the first member, and a connector member disposed between the second member and the first member. The connector member is received in the groove so as to bias a load path between the first member and the second member from a peripheral portion to a central portion of the connector member.

  10. Spring control of wire harness loops

    NASA Technical Reports Server (NTRS)

    Curcio, P. J.

    1979-01-01

    Negator spring control guides wire harness between movable and fixed structure. It prevents electrical wire harness loop from jamming or being severed as wire moves in response to changes in position of aircraft rudder. Spring-loaded coiled cable controls wire loop regardless of rudder movement.

  11. Ion-water wires in imidazolium-based ionic liquid/water solutions induce unique trends in density.

    PubMed

    Ghoshdastidar, Debostuti; Senapati, Sanjib

    2016-03-28

    Ionic liquid/water binary mixtures are rapidly gaining popularity as solvents for dissolution of cellulose, nucleobases, and other poorly water-soluble biomolecules. Hence, several studies have focused on measuring the thermophysical properties of these versatile mixtures. Among these, 1-ethyl-3-methylimidazolium ([emim]) cation-based ILs containing different anions exhibit unique density behaviours upon addition of water. While [emim][acetate]/water binary mixtures display an unusual rise in density with the addition of low-to-moderate amounts of water, those containing the [trifluoroacetate] ([Tfa]) anion display a sluggish decrease in density. The density of [emim][tetrafluoroborate] ([emim][BF4])/water mixtures, on the other hand, declines rapidly in close accordance with the experimental reports. Here, we unravel the structural basis underlying this unique density behavior of [emim]-based IL/water mixtures using all-atom molecular dynamics (MD) simulations. The results revealed that the distinct nature of anion-water hydrogen bonded networks in the three systems was a key in modulating the observed unique density behaviour. Vast expanses of uninterrupted anion-water-anion H-bonded stretches, denoted here as anion-water wires, induced significant structuring in [emim][Ac]/water mixtures that resulted in the density rise. Conversely, the presence of intermittent large water clusters disintegrated the anion-water wires in [emim][Tfa]/water and [emim][BF4]/water mixtures to cause a monotonic density decrease. The differential nanostructuring affected the dynamics of the solutions proportionately, with the H-bond making and breaking dynamics found to be greatly retarded in [emim][Ac]/water mixtures, while it exhibited a faster relaxation in the other two binary solutions.

  12. Debonding characteristics of adhesively bonded woven Kevlar composites

    NASA Technical Reports Server (NTRS)

    Mall, S.; Johnson, W. S.

    1988-01-01

    The fatigue damage mechanism of an adhesively bonded joint between fabric reinforced composite adherends was investigated with cracked-lap-shear specimens. Two bonded systems were studied: fabric Kevlar 49/5208 epoxy adherends bonded together with either EC 3445 or FM-300 adhesive. For each bonded system, two specimen geometries were tested. In all specimens tested, fatigue damage occurred in the form of cyclic debonding; however, the woven Kevlar specimens gave significantly slower debond growth rates and higher fracture toughness than previously found in the nonwoven adherend specimens. The surfaces for the woven adherends were not smooth; rather, they had regular crests (high spots) and troughs (low spots) due to the weave pattern. Radiographs of the specimens and examination of their failure surfaces revealed that fiber bridging occurred between the crests of the two adherends in the debonded region. The observed improvements in debond growth resistance and static fracture toughness are attributed to this bridging.

  13. SpaceWire Data Handling Demonstration System

    NASA Astrophysics Data System (ADS)

    Mills, S.; Parkes, S. M.; O'Gribin, N.

    2007-08-01

    The SpaceWire standard was published in 2003 with the aim of providing a standard for onboard communications, defining the physical and data link layers of an interconnection, in order to improve reusability, reliability and to reduce the cost of mission development. The many benefits which it provides mean that it has already been used in a number of missions, both in Europe and throughout the world. Recent work by the SpaceWire community has included the development of higher level protocols for SpaceWire, such as the Remote Memory Access Protocol (RMAP) which can be used for many purposes, including the configuration of SpaceWire devices. Although SpaceWire has become very popular, the various ways in which it can be used are still being discovered, as are the most efficient ways to use it. At the same time, some in the space industry are not even aware of SpaceWire's existence. This paper describes the SpaceWire Data Handling Demonstration System that has been developed by the University of Dundee. This system simulates an onboard data handling network based on SpaceWire. It uses RMAP for all communication, and so demonstrates how SpaceWire and standardised higher level protocols can be used onboard a spacecraft. The system is not only a good advert for those who are unfamiliar with the benefits of SpaceWire, it is also a useful tool for those using SpaceWire to test ideas.

  14. Selected developments in laser wire stripping. [cutting insulation from aerospace-type wires and cables

    NASA Technical Reports Server (NTRS)

    1977-01-01

    The operation of mechanical and thermal strippers and the early development of laser wire strippers are reviewed. NASA sponsored development of laser wire stripping for space shuttle includes bench-type strippers as well as an advanced portable hand-held stripper which incorporates a miniaturized carbon dioxide laser and a rotating optics unit with a gas-jet assist and debris exhaust. Drives and controls girdle the wire and slit the remaining slug without manual assistance. This unit can strip wire sizes 26 through 12 gage. A larger-capacity hand-held unit for wire sizes through 1/0 gage was built using a neodynium-doped yttrium aluminum garnet (Nd:YAG) laser. The hand-held units have a flexible umbilical cable to an accompanying cart that carries the power supply, gas supply, cooling unit, and the controls.

  15. Investigation of factors affecting the heater wire method of calibrating fine wire thermocouples

    NASA Technical Reports Server (NTRS)

    Keshock, E. G.

    1972-01-01

    An analytical investigation was made of a transient method of calibrating fine wire thermocouples. The system consisted of a 10 mil diameter standard thermocouple (Pt, Pt-13% Rh) and an 0.8 mil diameter chromel-alumel thermocouple attached to a 20 mil diameter electrically heated platinum wire. The calibration procedure consisted of electrically heating the wire to approximately 2500 F within about a seven-second period in an environment approximating atmospheric conditions at 120,000 feet. Rapid periodic readout of the standard and fine wire thermocouple signals permitted a comparison of the two temperature indications. An analysis was performed which indicated that the temperature distortion at the heater wire produced by the thermocouple junctions appears to be of negligible magnitude. Consequently, the calibration technique appears to be basically sound, although several practical changes which appear desirable are presented and discussed. Additional investigation is warranted to evaluate radiation effects and transient response characteristics.

  16. Finger jointing green southern yellow pine with a soy-based adhesive

    Treesearch

    Philip H. Steele; Roland E. Kreibicha; Petrus J. Steynberg; Richard W. Hemingway

    1998-01-01

    The authors present results of laboratory tests for a soy-based adhesive to bond southern yellow pine using the finger-jointing method. There was some reason to suspect that finger jointing of southern yellow pine (SYP) with the honeymoon system using soy-based adhesive might prove more difficult than for western species. The Wood Handbook classes western species in...

  17. Towards plant wires.

    PubMed

    Adamatzky, Andrew

    2014-08-01

    In experimental laboratory studies we evaluate a possibility of making electrical wires from living plants. In scoping experiments we use lettuce seedlings as a prototype model of a plant wire. We approximate an electrical potential transfer function by applying direct current voltage to the lettuce seedlings and recording output voltage. We analyse oscillation frequencies of the output potential and assess noise immunity of the plant wires. Our findings will be used in future designs of self-growing wetware circuits and devices, and integration of plant-based electronic components into future and emergent bio-hybrid systems. Copyright © 2014 Elsevier Ireland Ltd. All rights reserved.

  18. Twin-Axial Wire Antenna

    DTIC Science & Technology

    2015-08-06

    12 and 14 can be of differing gauges and can be either stranded or solid. In a prototype, both conductors were made from #22 solid copper wire ...08-2015 Publication Twin-Axial Wire Antenna David A. Tonn Naval Under Warfare Center Division, Newport 1176 Howell St., Code 00L, Bldg 102T...Approved for Public Release Distribution is unlimited Attorney Docket No. 300030 1 of 10 TWIN-AXIAL WIRE ANTENNA STATEMENT OF GOVERNMENT INTEREST

  19. Structural Characterization of N-Alkylated Twisted Amides: Consequences for Amide Bond Resonance and N-C Cleavage.

    PubMed

    Hu, Feng; Lalancette, Roger; Szostak, Michal

    2016-04-11

    Herein, we describe the first structural characterization of N-alkylated twisted amides prepared directly by N-alkylation of the corresponding non-planar lactams. This study provides the first experimental evidence that N-alkylation results in a dramatic increase of non-planarity around the amide N-C(O) bond. Moreover, we report a rare example of a molecular wire supported by the same amide C=O-Ag bonds. Reactivity studies demonstrate rapid nucleophilic addition to the N-C(O) moiety of N-alkylated amides, indicating the lack of n(N) to π*(C=O) conjugation. Most crucially, we demonstrate that N-alkylation activates the otherwise unreactive amide bond towards σ N-C cleavage by switchable coordination. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  20. Development of High Temperature Dissimilar Joint Technology for Fission Surface Power Systems

    NASA Technical Reports Server (NTRS)

    Locci, Ivan E.; Bowman, Cheryl L.; Gabb, Timothy P.

    2009-01-01

    NASA is developing fission surface power (FSP) system technology as a potential option for use on the surface of the moon or Mars. The goal is to design a robust system that takes full advantage of existing materials data bases. One of the key components of the power conversion system is the hot-side Heat Exchanger (HX). One possible design for this heat exchanger requires a joint of the dissimilar metals 316L stainless steel and Inconel 718, which must sustain extended operation at high temperatures. This study compares two joining techniques, brazing and diffusion bonding, in the context of forming the requisite stainless steel to superalloy joint. The microstructures produced by brazing and diffusion bonding, the effect of brazing cycle on the mechanical tensile properties of the alloys, and the strength of several brazed joints will be discussed.

  1. Wire Composition: Its Effect on Metal Disintegration and Particle Formation in Twin-Wire Arc-Spraying Process

    NASA Astrophysics Data System (ADS)

    Tillmann, W.; Abdulgader, M.

    2013-03-01

    The wire tips in twin-wire arc-spraying (TWAS) are heated in three different zones. A high-speed camera was used to observe the melting behavior, metal breakup, and particle formation under different operating conditions. In zone (I), the wire tips are melted (liquidus metal) and directly atomized in the form of smaller droplets. Their size is a function of the specific properties of the molten metal and the exerting aerodynamic forces. Zone (II) is directly beneath zone (I) and the origin of the extruded metal sheets at the wire tips. The extruded metal sheets in the case of cored wires are shorter than those observed while using solid wires. In this study, the effects of adjustable parameters and powder filling on melting behavior, particle formation, and process instability were revealed, and a comparison between solid and cored wires was made. The findings can improve the accuracy of the TWAS process modeling.

  2. An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

    NASA Astrophysics Data System (ADS)

    Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

    2011-12-01

    A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

  3. 29 CFR 1919.79 - Wire rope.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 29 Labor 7 2011-07-01 2011-07-01 false Wire rope. 1919.79 Section 1919.79 Labor Regulations...) GEAR CERTIFICATION Certification of Shore-Based Material Handling Devices § 1919.79 Wire rope. (a) Wire rope and replacement wire rope shall be of the same size, same or better grade, and same construction...

  4. 29 CFR 1919.79 - Wire rope.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 29 Labor 7 2010-07-01 2010-07-01 false Wire rope. 1919.79 Section 1919.79 Labor Regulations...) GEAR CERTIFICATION Certification of Shore-Based Material Handling Devices § 1919.79 Wire rope. (a) Wire rope and replacement wire rope shall be of the same size, same or better grade, and same construction...

  5. NASA wiring for space applications program

    NASA Technical Reports Server (NTRS)

    Schulze, Norman

    1995-01-01

    An overview of the NASA Wiring for Space Applications Program and its relationship to NASA's space technology enterprise is given in viewgraph format. The mission of the space technology enterprise is to pioneer, with industry, the development and use of space technology to secure national economic competitiveness, promote industrial growth, and to support space missions. The objectives of the NASA Wiring for Space Applications Program is to improve the safety, performance, and reliability of wiring systems for space applications and to develop improved wiring technologies for NASA flight programs and commercial applications. Wiring system failures in space and commercial applications have shown the need for arc track resistant wiring constructions. A matrix of tests performed versus wiring constructions is presented. Preliminary data indicate the performance of the Tensolite and Filotex hybrid constructions are the best of the various candidates.

  6. Welding wire pressure sensor assembly

    NASA Technical Reports Server (NTRS)

    Morris, Timothy B. (Inventor); Milly, Peter F., Sr. (Inventor); White, J. Kevin (Inventor)

    1994-01-01

    The present invention relates to a device which is used to monitor the position of a filler wire relative to a base material being welded as the filler wire is added to a welding pool. The device is applicable to automated welding systems wherein nonconsumable electrode arc welding processes are utilized in conjunction with a filler wire which is added to a weld pool created by the electrode arc. The invention senses pressure deviations from a predetermined pressure between the filler wire and the base material, and provides electrical signals responsive to the deviations for actuating control mechanisms in an automatic welding apparatus so as to minimize the pressure deviation and to prevent disengagement of the contact between the filler wire and the base material.

  7. Wiring photosystem I for direct solar hydrogen production.

    PubMed

    Lubner, Carolyn E; Grimme, Rebecca; Bryant, Donald A; Golbeck, John H

    2010-01-26

    The generation of H(2) by the use of solar energy is a promising way to supply humankind's energy needs while simultaneously mitigating environmental concerns that arise due to climate change. The challenge is to find a way to connect a photochemical module that harnesses the sun's energy to a catalytic module that generates H(2) with high quantum yields and rates. In this review, we describe a technology that employs a "molecular wire" to connect a terminal [4Fe-4S] cluster of Photosystem I directly to a catalyst, which can be either a Pt nanoparticle or the distal [4Fe-4S] cluster of an [FeFe]- or [NiFe]-hydrogenase enzyme. The keys to connecting these two moieties are surface-located cysteine residues, which serve as ligands to Fe-S clusters and which can be changed through site-specific mutagenesis to glycine residues, and the use of a molecular wire terminated in sulfhydryl groups to connect the two modules. The sulfhydryl groups at the end of the molecular wire form a direct chemical linkage to a suitable catalyst or can chemically rescue a [4Fe-4S] cluster, thereby generating a strong coordination bond. Specifically, the molecular wire can connect the F(B) iron-sulfur cluster of Photosystem I either to a Pt nanoparticle or, by using the same type of genetic modification, to the differentiated iron atom of the distal [4Fe-4S].(Cys)(3)(Gly) cluster of hydrogenase. When electrons are supplied by a sacrificial donor, this technology forms the cathode of a photochemical half-cell that evolves H(2) when illuminated. If such a device were connected to the anode of a photochemical half-cell that oxidizes water, an in vitro solar energy converter could be realized that generates only O(2) and H(2) in the light. A similar methodology can be used to connect Photosystem I to other redox proteins that have surface-located [4Fe-4S] clusters. The controlled light-driven production of strong reductants by such systems can be used to produce other biofuels or to provide

  8. Bond-bending isomerism of Au 2I 3 -: Competition between covalent bonding and aurophilicity

    DOE PAGES

    Li, Wan -Lu; Liu, Hong -Tao; Jian, Tian; ...

    2015-10-13

    We report a joint photoelectron spectroscopy and theoretical investigation of the gaseous Au 2I 3 – cluster, which is found to exhibit two types of isomers due to competition between Au–I covalent bonding and Au–Au aurophilic interactions. The covalent bonding favors a bent IAuIAuI – structure with an obtuse Au–I–Au angle (100.7°), while aurophilic interactions pull the two Au atoms much closer, leading to an acutely bent structure (72.0°) with an Au–Au distance of 3.08 Å. The two isomers are separated by a small barrier and are nearly degenerate with the obtuse isomer being slightly more stable. At low temperature,more » only the obtuse isomer is observed; distinct experimental evidence is observed for the co-existence of a combination of isomers with both acute and obtuse bending angles at room temperature. As a result, the two bond-bending isomers of Au 2I 3 – reveal a unique example of one molecule being able to oscillate between different structures as a result of two competing chemical forces.« less

  9. Bond-bending isomerism of Au 2I 3 -: Competition between covalent bonding and aurophilicity

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Li, Wan -Lu; Liu, Hong -Tao; Jian, Tian

    We report a joint photoelectron spectroscopy and theoretical investigation of the gaseous Au 2I 3 – cluster, which is found to exhibit two types of isomers due to competition between Au–I covalent bonding and Au–Au aurophilic interactions. The covalent bonding favors a bent IAuIAuI – structure with an obtuse Au–I–Au angle (100.7°), while aurophilic interactions pull the two Au atoms much closer, leading to an acutely bent structure (72.0°) with an Au–Au distance of 3.08 Å. The two isomers are separated by a small barrier and are nearly degenerate with the obtuse isomer being slightly more stable. At low temperature,more » only the obtuse isomer is observed; distinct experimental evidence is observed for the co-existence of a combination of isomers with both acute and obtuse bending angles at room temperature. As a result, the two bond-bending isomers of Au 2I 3 – reveal a unique example of one molecule being able to oscillate between different structures as a result of two competing chemical forces.« less

  10. Alleviation of mandibular anterior crowding with copper-nickel-titanium vs nickel-titanium wires: a double-blind randomized control trial.

    PubMed

    Pandis, Nikolaos; Polychronopoulou, Argy; Eliades, Theodore

    2009-08-01

    The purpose of this study was to investigate the efficiency of copper-nickel-titanium (CuNiTi) vs nickel-titanium (NiTi) archwires in resolving crowding of the anterior mandibular dentition. Sixty patients were included in this single-center, single-operator, double-blind randomized trial. All patients were bonded with the In Ovation-R self-ligating bracket (GAC, Central Islip, NY) with a 0.022-in slot, and the amount of crowding of the mandibular anterior dentition was assessed by using the irregularity index. The patients were randomly allocated into 2 groups of 30 patients, each receiving a 0.016-in CuNiTi 35 degrees C (Ormco, Glendora, Calif) or a 0.016-in NiTi (ModernArch, Wyomissing, Pa) wire. The type of wire selected for each patient was not disclosed to the provider or the patient. The date that each patient received a wire was recorded, and all patients were followed monthly for a maximum of 6 months. Demographic and clinical characteristics between the 2 wire groups were compared with the t test or the chi-square test and the Fisher exact test. Time to resolve crowding was explored with statistical methods for survival analysis, and alignment rate ratios for wire type and crowding level were calculated with Cox proportional hazards multivariate modeling. The type of wire (CuNiTi vs NiTi) had no significant effect on crowding alleviation (129.4 vs 121.4 days; hazard ratio, 1.3; P >0.05). Severe crowding (>5 on the irregularity index) showed a significantly higher probability of crowding alleviation duration relative to dental arches with a score of <5 (138.5 vs 113.1 days; hazard ratio, 2.2; P=0.02). The difference of the loading pattern of wires in laboratory and clinical conditions might effectively eliminate the laboratory-derived advantage of CuNiTi wires.

  11. 30 CFR 77.1430 - Wire ropes; scope.

    Code of Federal Regulations, 2011 CFR

    2011-07-01

    ... 30 Mineral Resources 1 2011-07-01 2011-07-01 false Wire ropes; scope. 77.1430 Section 77.1430... Hoisting Wire Ropes § 77.1430 Wire ropes; scope. (a) Sections 77.1431 through 77.1438 apply to wire ropes.... (b) These standards do not apply to wire ropes used for elevators. ...

  12. 30 CFR 77.1430 - Wire ropes; scope.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... 30 Mineral Resources 1 2010-07-01 2010-07-01 false Wire ropes; scope. 77.1430 Section 77.1430... Hoisting Wire Ropes § 77.1430 Wire ropes; scope. (a) Sections 77.1431 through 77.1438 apply to wire ropes.... (b) These standards do not apply to wire ropes used for elevators. ...

  13. Fabrication of Titanium Bonded Joint Specimens for High Temperature Testing

    NASA Technical Reports Server (NTRS)

    Smeltzer, Stanley S., III; Kovach, Michael P.; Hudson, Wanda

    2005-01-01

    Four sets of adhesively bonded, titanium lap-shear coupon specimens were fabricated for ultimate strength testing according to the ASTM D1002 and D3165 standards. Important features of the fabrication methods, processing details, and lap-shear test results are presented for specimens fabricated using a modified bismaleimide adhesive, EA 9673, on titanium. Surface treatment of the titanium was performed using surface abrasion followed by one of two separate chemical etching processes. Although cure cycle requirements are different among most adhesives, a single surface preparation method was sought as the preferred method for conditioning the titanium specimens prior to bonding and curing. A fabrication process using a combination of low-pressure grit-blasting of the titanium surface followed by anodization with a sodium hydroxide solution applied to the D1002 specimen geometry provided the highest lapshear strengths in the study. Additionally, difficulties documented during the fabrication process of the D3165 specimens along with features of the D3165 geometry were identified as factors that contributed to lower lap-shear strength results for the D3165 specimens as compared to the results for the D1002 specimens.

  14. Asymmetric severe skeletal Class II division 1 patient with temporomandibular joint disorder treated with zygomatic anchorage devices and Ni-Ti alloy wires.

    PubMed

    Ishida, Takayoshi; Ono, Takashi

    2014-09-01

    To describe the orthodontic treatment of a nongrowing 30-year-old woman with asymmetric severe skeletal Class II malocclusions (asymmetric Angle Class II), large overjet (16 mm), large overbite (8 mm), two congenitally missing mandibular incisors (presenting a deciduous anterior tooth), and signs and symptoms of temporomandibular joint disorder (TMD). We used novel improved super-elastic Ni-Ti alloy wires (ISWs) combined with Ni-Ti alloy coil springs, power hooks, and a zygomatic implant as reinforced anchorage to provide a constant and continuous mild force to the dentition. We successfully distalized maxillary molars, premolars, and retracted anterior teeth and corrected the asymmetric Angle Class II molar relationship using this system of zygomatic anchorage in conjunction with ISWs, Ni-Ti alloy open-coil springs, and crimpable power hook. The maxillary molars were distalized, and postero-occlusal relationships were improved to achieve Class I canine and molar relationships on both sides. Intrusion of the upper molars made the mandibular plane close. Ideal overbite and overjet relationships were established. Facial esthetics were improved with decreased upper and lower lip protrusion, and no symptoms of TMD were observed after treatment. The orthodontic treatment described here is a promising anchorage technique alternative to traditional techniques to improve severe skeletal Class II with TMD.

  15. TEM Analysis of Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers

    NASA Technical Reports Server (NTRS)

    Ozaki, T.; Hasegawa, Y.; Tsuda, H.; Mori, S.; Halbig, M. C.; Asthana, R.; Singh, M.

    2017-01-01

    SiC fiber-bonded ceramics (SA-Tyrannohex: SA-THX) diffusion-bonded with TiCu metallic interlayers were investigated. Thin samples of the ceramics were prepared with a focused ion beam (FIB) and the interfacial microstructure of the prepared samples was studied by transmission electron microscopy (TEM) and scanning TEM (STEM). In addition to conventional microstructure observation, for detailed analysis of reaction compounds in diffusion-bonded area, we performed STEM-EDS measurements and selected area electron diffraction (SAD) experiments. The TEM and STEM experiments revealed the diffusion-bonded area was composed of only one reaction layer, which was characterized by TiC precipitates in Cu-Si compound matrix. This reaction layer was in good contact with the SA-THX substrates, and it is concluded that the joint structure led to the excellent bonding strength.

  16. Multifilament Cable Wire versus Conventional Wire for Sternal Closure in Patients Undergoing Major Cardiac Surgery.

    PubMed

    Oh, You Na; Ha, Keong Jun; Kim, Joon Bum; Jung, Sung-Ho; Choo, Suk Jung; Chung, Cheol Hyun; Lee, Jae Won

    2015-08-01

    Stainless steel wiring remains the most popular technique for primary sternal closure. Recently, a multifilament cable wiring system (Pioneer Surgical Technology Inc., Marquette, MI, USA) was introduced for sternal closure and has gained wide acceptance due to its superior resistance to tension. We aimed to compare conventional steel wiring to multifilament cable fixation for sternal closure in patients undergoing major cardiac surgery. Data were collected retrospectively on 1,354 patients who underwent sternal closure after major cardiac surgery, using either the multifilament cable wiring system or conventional steel wires between January 2009 and October 2010. The surgical outcomes of these two groups of patients were compared using propensity score matching based on 18 baseline patient characteristics. Propensity score matching yielded 392 pairs of patients in the two groups whose baseline profiles showed no significant differences. No significant differences between the two groups were observed in the rates of early mortality (2.0% vs. 1.3%, p=0.578), major wound complications requiring reconstruction (1.3% vs. 1.3%, p>0.99), minor wound complications (3.6% vs. 2.0%, p=0.279), or mediastinitis (0.8% vs. 1.0%, p=1.00). Patients in the multifilament cable group had fewer sternal bleeding events than those in the conventional wire group, but this tendency was not statistically significant (4.3% vs. 7.4%, p=0.068). The surgical outcomes of sternal closure using multifilament cable wires were comparable to those observed when conventional steel wires were used. Therefore, the multifilament cable wiring system may be considered a viable option for sternal closure in patients undergoing major cardiac surgery.

  17. 29 CFR 1926.1413 - Wire rope-inspection.

    Code of Federal Regulations, 2012 CFR

    2012-07-01

    .... Apparent deficiencies in this category are: (A) Visible broken wires, as follows: (1) In running wire ropes: Six randomly distributed broken wires in one rope lay or three broken wires in one strand in one rope... around the rope. (2) In rotation resistant ropes: Two randomly distributed broken wires in six rope...

  18. 29 CFR 1926.1413 - Wire rope-inspection.

    Code of Federal Regulations, 2013 CFR

    2013-07-01

    .... Apparent deficiencies in this category are: (A) Visible broken wires, as follows: (1) In running wire ropes: Six randomly distributed broken wires in one rope lay or three broken wires in one strand in one rope... around the rope. (2) In rotation resistant ropes: Two randomly distributed broken wires in six rope...

  19. 29 CFR 1926.1413 - Wire rope-inspection.

    Code of Federal Regulations, 2014 CFR

    2014-07-01

    .... Apparent deficiencies in this category are: (A) Visible broken wires, as follows: (1) In running wire ropes: Six randomly distributed broken wires in one rope lay or three broken wires in one strand in one rope... around the rope. (2) In rotation resistant ropes: Two randomly distributed broken wires in six rope...

  20. Plasma arc torch with coaxial wire feed

    DOEpatents

    Hooper, Frederick M

    2002-01-01

    A plasma arc welding apparatus having a coaxial wire feed. The apparatus includes a plasma arc welding torch, a wire guide disposed coaxially inside of the plasma arc welding torch, and a hollow non-consumable electrode. The coaxial wire guide feeds non-electrified filler wire through the tip of the hollow non-consumable electrode during plasma arc welding. Non-electrified filler wires as small as 0.010 inches can be used. This invention allows precision control of the positioning and feeding of the filler wire during plasma arc welding. Since the non-electrified filler wire is fed coaxially through the center of the plasma arc torch's electrode and nozzle, the wire is automatically aimed at the optimum point in the weld zone. Therefore, there is no need for additional equipment to position and feed the filler wire from the side before or during welding.

  1. [Treatment of complete acromioclavicular joint dislocation with transfer of the medial half of the coracoacromial ligament to reconstruct the coracoclavicular ligament].

    PubMed

    Dong, Wen-Wei; Shi, Zeng-Yuan; Liu, Zheng-Xin; Mao, Hai-Jiao

    2015-04-01

    To explore the operation methods and clinical effects of transfer of the medial half of the coracoacromial ligament to reconstruct the coracoclavicular ligament in treating complete acromioclavicular joint dislocation. From January 2006 to June 2012,26 patients with acute complete acromioclavicular joint dislocation underwent surgery. Transfer of the medial half of the coracoacromial ligament to reconstruct the coracoclavicular ligament, additional clavical hoot plate and Kirschner wires fixation, were performed in all the patients. Among the patients, 18 patients were male and 8 patients were female, with an average age of 36.7 years old (ranged from 25 to 51 years). The duration from injury to operation was from 3 to 12 days with an average of 5 days. According to the Rockwood classification, 4 cases were grade III and 22 cases were grade V . Clinical manifestation included local swelling, tenderness with snapping, limitation of shoulder joint motion. In preoperative bilateral shoulder joint X-rays, the injured coracoclavicular distance was (16.2 ± 5.0) mm which was significantly wider than that of uninjured sides (7.6 ± 1.0) mm. Clinical results were evaluated according to X-rays and Constant-Murley score. All incisions obtained primary healing after operation without complication of infection, internal fixation breakage, redislocation. All the patients were followed up from 12 to 30 months with an average of 18 months. Kirschner wires and internal fixation plate were removed at 1 month and 8-10 months after operation, respectively. At final follow-up, the motion of shoulder joint recovered to normal and a no pain joint was obtained. According to Constant-Murley score, 24 cases got excellent results and 2 cases good. There was no significant difference after operation between the injured coracoclavicular distance and the uninjured contralateral side [(7.7 ± 1.2) mm vs (7.6 ± 1.0) mm), P > 0.05]. Transfer of the medial half of the coracoacromial ligament to

  2. Modeling and experimental evaluation of the diffusion bonding of the oxide dispersion strengthened steel PM2000

    NASA Astrophysics Data System (ADS)

    Sittel, Wiebke; Basuki, Widodo W.; Aktaa, Jarir

    2015-10-01

    A modeling based optimization process of the solid state diffusion bonding is presented for joining ferritic oxide dispersion strengthened steels PM2000. An optimization study employing varying bonding temperatures and pressures results in almost the same strength and toughness of the bonded compared to the as received material. TEM investigations of diffusion bonded samples show a homogeneous distribution of oxide particles at the bonding seam similar to that in the bulk. Hence, no loss in strength or creep resistance due to oxide particle agglomeration is found, as verified by the mechanical properties observed for the joint.

  3. Performance Evaluation and Durability Studies of Adhesive Bonds

    NASA Astrophysics Data System (ADS)

    Ranade, Shantanu Rajendra

    In this thesis, four test approaches were developed to characterize the adhesion performance and durability of adhesive bonds for specific applications in areas spanning from structural adhesive joints to popular confectionaries such as chewing gum. In the first chapter, a double cantilever beam (DCB) specimen geometry is proposed for combinatorial fracture studies of structural adhesive bonds. This specimen geometry enabled the characterization of fracture energy vs. bondline thickness trends through fewer tests than those required during a conventional "one at a time" characterization approach, potentially offering a significant reduction in characterization times. The second chapter investigates the adhesive fracture resistance and crack path selection in adhesive joints containing patterns of discreet localized weak interfaces created using physical vapor deposition of copper. In a DCB specimen tested under mode-I conditions, fracture energy within the patterned regions scaled according to a simple rule of mixture, while reverse R-curve and R-curve type trends were observed in the regions surrounding weak interface patterns. Under mixed mode conditions such that bonding surface with patterns is subjected to axial tension, fracture energy did not show R-curve type trends while it was observed that a crack could be made to avoid exceptionally weak interfaces when loaded such that bonding surface with defects is subjected to axial compression. In the third chapter, an adaptation of the probe tack test is proposed to characterize the adhesion behavior of gum cuds. This test method allowed the introduction of substrates with well-defined surface energies and topologies to study their effects on gum cud adhesion. This approach and reported insights could potentially be useful in developing chewing gum formulations that facilitate easy removal of improperly discarded gum cuds from adhering surfaces. In the fourth chapter we highlight a procedure to obtain insights

  4. Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips.

    PubMed

    Feng, Shuang-Tao; Mei, Yun-Hui; Chen, Gang; Li, Xin; Lu, Guo-Quan

    2016-07-12

    Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported necessary for the sintering time of ~1 h. In order to shorten the processing duration time, we developed a rapid way to sinter nanosilver paste for bonding IGBT chips in less than 5 min using pulsed current. In this way, we firstly dried as-printed paste at about 100 °C to get rid of many volatile solvents because they may result in defects or voids during the out-gassing from the paste. Then, the pre-dried paste was further heated by pulse current ranging from 1.2 kA to 2.4 kA for several seconds. The whole procedure was less than 3 min and did not require any gas protection. We could obtain robust sintered joint with shear strength of 30-35 MPa for bonding 1200-V, 25-A IGBT and superior thermal properties. Static and dynamic electrical performance of the as-bonded IGBT assemblies was also characterized to verify the feasibility of this rapid sintering method. The results indicate that the electrical performance is comparable or even partially better than that of commercial IGBT modules. The microstructure evolution of the rapid sintered joints was also studied by scanning electron microscopy (SEM). This work may benefit the wide usage of nanosilver paste for rapid bonding IGBT chips in the future.

  5. Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips

    PubMed Central

    Feng, Shuang-Tao; Mei, Yun-Hui; Chen, Gang; Li, Xin; Lu, Guo-Quan

    2016-01-01

    Sintering of nanosilver paste has been extensively studied as a lead-free die-attach solution for bonding semiconductor power chips, such as the power insulated gated bipolar transistor (IGBT). However, for the traditional method of bonding IGBT chips, an external pressure of a few MPa is reported necessary for the sintering time of ~1 h. In order to shorten the processing duration time, we developed a rapid way to sinter nanosilver paste for bonding IGBT chips in less than 5 min using pulsed current. In this way, we firstly dried as-printed paste at about 100 °C to get rid of many volatile solvents because they may result in defects or voids during the out-gassing from the paste. Then, the pre-dried paste was further heated by pulse current ranging from 1.2 kA to 2.4 kA for several seconds. The whole procedure was less than 3 min and did not require any gas protection. We could obtain robust sintered joint with shear strength of 30–35 MPa for bonding 1200-V, 25-A IGBT and superior thermal properties. Static and dynamic electrical performance of the as-bonded IGBT assemblies was also characterized to verify the feasibility of this rapid sintering method. The results indicate that the electrical performance is comparable or even partially better than that of commercial IGBT modules. The microstructure evolution of the rapid sintered joints was also studied by scanning electron microscopy (SEM). This work may benefit the wide usage of nanosilver paste for rapid bonding IGBT chips in the future. PMID:28773686

  6. Electromagnetic scattering by a straight thin wire

    NASA Technical Reports Server (NTRS)

    Shamansky, Harry T.; Dominek, Allen K.; Peters, Leon, Jr.

    1989-01-01

    The traveling-wave energy, which multiply diffracts on a straight thin wire, is represented as a sum of terms, each with a distinct physical meaning, that can be individually examined in the time domain. Expressions for each scattering mechanism on a straight thin wire are cast in the form of four basic electromagnetic wave concepts: diffraction, attachment, launch, and reflection. Using the basic mechanisms from P. Ya. Ufimtsev (1962), each of the scattering mechanisms is included into the total scattered field for the straight thin wire. Scattering as a function of angle and frequency is then compared to the moment-method solution. These analytic expressions are then extended to a lossy wire with a simple approximate modification using the propagation velocity on the wire as derived from the Sommerfeld wave on a straight lossy wire. Both the perfectly conducting and lossy wire solutions are compared to moment-method results, and excellent agreement is found. As is common with asymptotic solutions, when the electrical length of wire is smaller than 0.2 lambda the results lose accuracy. The expressions modified to approximate the scattering for the lossy thin wire yield excellent agreement even for lossy wires where the wire radius is on the order of skin depth.

  7. Three-dimensional finite element analysis of the shear bond test.

    PubMed

    DeHoff, P H; Anusavice, K J; Wang, Z

    1995-03-01

    The purpose of this study was to use finite element analyses to model the planar shear bond test and to evaluate the effects of modulus values, bonding agent thickness, and loading conditions on the stress distribution in the dentin adjacent to the bonding agent-dentin interface. All calculations were performed with the ANSYS finite element program. The planar shear bond test was modeled as a cylinder of resin-based composite bonded to a cylindrical dentin substrate. The effects of material, geometry and loading variables were determined primarily by use of a three-dimensional structural element. Several runs were also made using an axisymmetric element with harmonic loading and a plane strain element to determine whether two-dimensional analyses yield valid results. Stress calculations using three-dimensional finite element analyses confirmed the presence of large stress concentration effects for all stress components at the bonding agent-dentin interface near the application of the load. The maximum vertical shear stress generally occurs approximately 0.3 mm below the loading site and then decreases sharply in all directions. The stresses reach relatively uniform conditions within about 0.5 mm of the loading site and then increase again as the lower region of the interface is approached. Calculations using various loading conditions indicated that a wire-loop method of loading leads to smaller stress concentration effects, but a shear bond strength determined by dividing a failure load by the cross-sectional area grossly underestimates the true interfacial bond strength. Most dental researchers are using tensile and shear bond tests to predict the effects of process and material variables on the clinical performance of bonding systems but no evidence has yet shown that bond strength is relevant to clinical performance. A critical factor in assessing the usefulness of bond tests is a thorough understanding of the stress states that cause failure in the bond test

  8. Brazing process provides high-strength bond between aluminum and stainless steel

    NASA Technical Reports Server (NTRS)

    Huschke, E. G., Jr.; Nord, D. B.

    1966-01-01

    Brazing process uses vapor-deposited titanium and an aluminum-zirconium-silicon alloy to prevent formation of brittle intermetallic compounds in stainless steel and aluminum bonding. Joints formed by this process maintain their high strength, corrosion resistance, and hermetic sealing properties.

  9. 75 FR 60480 - In the Matter of Certain Bulk Welding Wire Containers and Components Thereof and Welding Wire...

    Federal Register 2010, 2011, 2012, 2013, 2014

    2010-09-30

    ... Welding Wire Containers and Components Thereof and Welding Wire; Notice of Commission Determination To... within the United States after importation of certain bulk welding wire containers, components thereof, and welding wire by reason of infringement of certain claims of United States Patent Nos. 6,260,781; 6...

  10. 49 CFR 236.76 - Tagging of wires and interference of wires or tags with signal apparatus.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... with signal apparatus. 236.76 Section 236.76 Transportation Other Regulations Relating to... wires and interference of wires or tags with signal apparatus. Each wire shall be tagged or otherwise so... apparatus. [49 FR 3384, Jan. 26, 1984] Inspections and Tests; All Systems ...

  11. 49 CFR 236.76 - Tagging of wires and interference of wires or tags with signal apparatus.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... with signal apparatus. 236.76 Section 236.76 Transportation Other Regulations Relating to... wires and interference of wires or tags with signal apparatus. Each wire shall be tagged or otherwise so... apparatus. [49 FR 3384, Jan. 26, 1984] Inspections and Tests; All Systems ...

  12. Laser-Arc Hybrid Welding of Dissimilar Titanium Alloy and Stainless Steel Using Copper Wire

    NASA Astrophysics Data System (ADS)

    Gao, Ming; Chen, Cong; Wang, Lei; Wang, Zemin; Zeng, Xiaoyan

    2015-05-01

    Laser-arc hybrid welding with Cu3Si filler wire was employed to join dissimilar Ti6Al4V titanium alloy and AISI316 stainless steel (316SS). The effects of welding parameters on bead shape, microstructure, mechanical properties, and fracture behavior were investigated in detail. The results show that cross-weld tensile strength of the joints is up to 212 MPa. In the joint, obvious nonuniformity of the microstructure is found in the fusion zone (FZ) and at the interfaces from the top to the bottom, which could be improved by increasing heat input. For the homogeneous joint, the FZ is characterized by Fe67- x Si x Ti33 dendrites spreading on α-Cu matrix, and the two interfaces of 316SS/FZ and FZ/Ti6Al4V are characterized by a bamboo-like 316SS layer and a CuTi2 layer, respectively. All the tensile samples fractured in the hardest CuTi2 layer at Ti6Al4V side of the joints. The fracture surface is characterized by river pattern revealing brittle cleavage fracture. The bead formation mechanisms were discussed according to the melt flow and the thermodynamic calculation.

  13. Wire metamaterials: physics and applications.

    PubMed

    Simovski, Constantin R; Belov, Pavel A; Atrashchenko, Alexander V; Kivshar, Yuri S

    2012-08-16

    The physics and applications of a broad class of artificial electromagnetic materials composed of lattices of aligned metal rods embedded in a dielectric matrix are reviewed. Such structures are here termed wire metamaterials. They appear in various settings and can operate from microwaves to THz and optical frequencies. An important group of these metamaterials is a wire medium possessing extreme optical anisotropy. The study of wire metamaterials has a long history, however, most of their important and useful properties have been revealed and understood only recently, especially in the THz and optical frequency ranges where the wire media correspond to the lattices of microwires and nanowires, respectively. Another group of wire metamaterials are arrays and lattices of nanorods of noble metals whose unusual properties are driven by plasmonic resonances. Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  14. Adhesive bone bonding prospects for lithium disilicate ceramic implants

    NASA Astrophysics Data System (ADS)

    Vennila Thirugnanam, Sakthi Kumar

    Temporomandibular Joint (TMJ) implants articulating mandible with temporal bone in humans have a very high failure rate. Metallic TMJ implants available in the medical market are not osseointegrated, but bond only by mechanical interlocking using screws which may fail, mandating a second surgery for removal. Stress concentration around fixture screws leads to aseptic loosening or fracture of the bone. It has been proposed that this problem can be overcome by using an all-ceramic TMJ implant bonded to bone with dental adhesives. Structural ceramics are promising materials with an excellent track record in the field of dentis.

  15. Waveguide bends from nanometric silica wires

    NASA Astrophysics Data System (ADS)

    Tong, Limin; Lou, Jingyi; Mazur, Eric

    2005-02-01

    We propose to use bent silica wires with nanometric diameters to guide light as optical waveguide bend. We bend silica wires with scanning tunneling microscope probes under an optical microscope, and wire bends with bending radius smaller than 5 μm are obtained. Light from a He-Ne laser is launched into and guided through the wire bends, measured bending loss of a single bend is on the order of 1 dB. Brief introductions to the optical wave guiding and elastic bending properties of silica wires are also provided. Comparing with waveguide bends based on photonic bandgap structures, the waveguide bends from silica nanometric wires show advantages of simple structure, small overall size, easy fabrication and wide useful spectral range, which make them potentially useful in the miniaturization of photonic devices.

  16. Magnet-wire wrapping tool for integrated circuits

    NASA Technical Reports Server (NTRS)

    Takahashi, T. H.

    1972-01-01

    Wire-dispensing tool which resembles mechanical pencil is used to wrap magnet wire around integrated circuit terminals uniformly and securely without damaging insulative coating on wire. Tool is hand-held and easily manipulated to execute wire wrapping movements.

  17. Three-Dimensional Wiring for Extensible Quantum Computing: The Quantum Socket

    NASA Astrophysics Data System (ADS)

    Béjanin, J. H.; McConkey, T. G.; Rinehart, J. R.; Earnest, C. T.; McRae, C. R. H.; Shiri, D.; Bateman, J. D.; Rohanizadegan, Y.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.; Mariantoni, M.

    2016-10-01

    Quantum computing architectures are on the verge of scalability, a key requirement for the implementation of a universal quantum computer. The next stage in this quest is the realization of quantum error-correction codes, which will mitigate the impact of faulty quantum information on a quantum computer. Architectures with ten or more quantum bits (qubits) have been realized using trapped ions and superconducting circuits. While these implementations are potentially scalable, true scalability will require systems engineering to combine quantum and classical hardware. One technology demanding imminent efforts is the realization of a suitable wiring method for the control and the measurement of a large number of qubits. In this work, we introduce an interconnect solution for solid-state qubits: the quantum socket. The quantum socket fully exploits the third dimension to connect classical electronics to qubits with higher density and better performance than two-dimensional methods based on wire bonding. The quantum socket is based on spring-mounted microwires—the three-dimensional wires—that push directly on a microfabricated chip, making electrical contact. A small wire cross section (approximately 1 mm), nearly nonmagnetic components, and functionality at low temperatures make the quantum socket ideal for operating solid-state qubits. The wires have a coaxial geometry and operate over a frequency range from dc to 8 GHz, with a contact resistance of approximately 150 m Ω , an impedance mismatch of approximately 10 Ω , and minimal cross talk. As a proof of principle, we fabricate and use a quantum socket to measure high-quality superconducting resonators at a temperature of approximately 10 mK. Quantum error-correction codes such as the surface code will largely benefit from the quantum socket, which will make it possible to address qubits located on a two-dimensional lattice. The present implementation of the socket could be readily extended to accommodate a

  18. Method and apparatus for laying wire arrays

    DOEpatents

    Horowitz, Seymour M.; Nesbitt, Dale D.

    1986-01-01

    Wire arrays (11) having a continuous wire (12) which is formed into a predetermined pattern and adhered to a backing material or substrate (13) are fabricated by applying adhesive material (16a, 16b) along opposite edge portions (17, 18) of the substrate, positioning a row of winding spools (21) along each of the edge portions and repeatedly extending the wire between and around successive spools at the opposite edge portions. The wound wire is then traveled along each spool toward the substrate and into contact with the adhesive. The spools are then removed and a coating of hardenable material (54) is applied to secure the wound wire to the substrate. Tension in the wire is relieved prior to contact of the wire with the adhesive and a small amount of slack is introduced into the wire before the final coating step. Mechanism (32) is provided for lifting the spools away from the substrate without disturbing the wound wire. The method and apparatus enable manufacture of precisely configured wire arrays without complex or costly equipment and do not require structural alterations in the substrate for the purpose of accommodating to fabrication equipment.

  19. RCS of resonant scatterers with attached wires

    NASA Astrophysics Data System (ADS)

    Trueman, C. W.; Mishra, S. R.; Kubina, S. J.; Larose, C. L.

    1993-03-01

    Some aircraft carry wire antennas for HF communication. This paper investigates the effect of such wires on the radar cross section (RCS) at HF frequencies by comparing the RCS of a strip, a cylinder, and a rod with and without an attached wire. The RCS is found for broadside incidence and for end-on incidence of the plane wave for scatterer lengths from 0.4 to 3.8 wavelengths, typical of aircraft size at HF frequencies. It is shown that the RCS of such fuselage-like targets with a wire 'antenna' is quite different from that of the targets without the wire. For broadside incidence, the wire contributes a sharp peak-and-trough to the RCS at the wire's fundamental resonant frequency. For end-on incidence the wire considerably enhances the RCS at frequencies making its length odd multiples of the quarter-wave.

  20. Modeling and simulation of the fluid flow in wire electrochemical machining with rotating tool (wire ECM)

    NASA Astrophysics Data System (ADS)

    Klocke, F.; Herrig, T.; Zeis, M.; Klink, A.

    2017-10-01

    Combining the working principle of electrochemical machining (ECM) with a universal rotating tool, like a wire, could manage lots of challenges of the classical ECM sinking process. Such a wire-ECM process could be able to machine flexible and efficient 2.5-dimensional geometries like fir tree slots in turbine discs. Nowadays, established manufacturing technologies for slotting turbine discs are broaching and wire electrical discharge machining (wire EDM). Nevertheless, high requirements on surface integrity of turbine parts need cost intensive process development and - in case of wire-EDM - trim cuts to reduce the heat affected rim zone. Due to the process specific advantages, ECM is an attractive alternative manufacturing technology and is getting more and more relevant for sinking applications within the last few years. But ECM is also opposed with high costs for process development and complex electrolyte flow devices. In the past, few studies dealt with the development of a wire ECM process to meet these challenges. However, previous concepts of wire ECM were only suitable for micro machining applications. Due to insufficient flushing concepts the application of the process for machining macro geometries failed. Therefore, this paper presents the modeling and simulation of a new flushing approach for process assessment. The suitability of a rotating structured wire electrode in combination with an axial flushing for electrodes with high aspect ratios is investigated and discussed.