Lithographic process window optimization for mask aligner proximity lithography
NASA Astrophysics Data System (ADS)
Voelkel, Reinhard; Vogler, Uwe; Bramati, Arianna; Erdmann, Andreas; Ünal, Nezih; Hofmann, Ulrich; Hennemeyer, Marc; Zoberbier, Ralph; Nguyen, David; Brugger, Juergen
2014-03-01
We introduce a complete methodology for process window optimization in proximity mask aligner lithography. The commercially available lithography simulation software LAB from GenISys GmbH was used for simulation of light propagation and 3D resist development. The methodology was tested for the practical example of lines and spaces, 5 micron half-pitch, printed in a 1 micron thick layer of AZ® 1512HS1 positive photoresist on a silicon wafer. A SUSS MicroTec MA8 mask aligner, equipped with MO Exposure Optics® was used in simulation and experiment. MO Exposure Optics® is the latest generation of illumination systems for mask aligners. MO Exposure Optics® provides telecentric illumination and excellent light uniformity over the full mask field. MO Exposure Optics® allows the lithography engineer to freely shape the angular spectrum of the illumination light (customized illumination), which is a mandatory requirement for process window optimization. Three different illumination settings have been tested for 0 to 100 micron proximity gap. The results obtained prove, that the introduced process window methodology is a major step forward to obtain more robust processes in mask aligner lithography. The most remarkable outcome of the presented study is that a smaller exposure gap does not automatically lead to better print results in proximity lithography - what the "good instinct" of a lithographer would expect. With more than 5'000 mask aligners installed in research and industry worldwide, the proposed process window methodology might have significant impact on yield improvement and cost saving in industry.
Double exposure using 193nm negative tone photoresist
NASA Astrophysics Data System (ADS)
Kim, Ryoung-han; Wallow, Tom; Kye, Jongwook; Levinson, Harry J.; White, Dave
2007-03-01
Double exposure is one of the promising methods for extending lithographic patterning into the low k I regime. In this paper, we demonstrate double patterning of k 1-effective=0.25 with improved process window using a negative resist. Negative resist (TOK N- series) in combination with a bright field mask is proven to provide a large process window in generating 1:3 = trench:line resist features. By incorporating two etch transfer steps into the hard mask material, frequency doubled patterns could be obtained.
Rules based process window OPC
NASA Astrophysics Data System (ADS)
O'Brien, Sean; Soper, Robert; Best, Shane; Mason, Mark
2008-03-01
As a preliminary step towards Model-Based Process Window OPC we have analyzed the impact of correcting post-OPC layouts using rules based methods. Image processing on the Brion Tachyon was used to identify sites where the OPC model/recipe failed to generate an acceptable solution. A set of rules for 65nm active and poly were generated by classifying these failure sites. The rules were based upon segment runlengths, figure spaces, and adjacent figure widths. 2.1 million sites for active were corrected in a small chip (comparing the pre and post rules based operations), and 59 million were found at poly. Tachyon analysis of the final reticle layout found weak margin sites distinct from those sites repaired by rules-based corrections. For the active layer more than 75% of the sites corrected by rules would have printed without a defect indicating that most rulesbased cleanups degrade the lithographic pattern. Some sites were missed by the rules based cleanups due to either bugs in the DRC software or gaps in the rules table. In the end dramatic changes to the reticle prevented catastrophic lithography errors, but this method is far too blunt. A more subtle model-based procedure is needed changing only those sites which have unsatisfactory lithographic margin.
First 65nm tape-out using inverse lithography technology (ILT)
NASA Astrophysics Data System (ADS)
Hung, Chi-Yuan; Zhang, Bin; Tang, Deming; Guo, Eric; Pang, Linyong; Liu, Yong; Moore, Andrew; Wang, Kechang
2005-11-01
This paper presents SMIC's first 65nm tape out results, in particularly, using ILT. ILT mathematically determines the mask features that produce the desired on-wafer results with best wafer pattern fidelity, largest process window or both. SMIC applied it to its first 65nm tape-out to study ILT performance and benefits for deep sub-wavelength lithography. SMIC selected 3 SRAM designs as the first test case, because SRAM bit-cells contain features which are challenging lithographically. Mask patterns generated from both conventional OPC and ILT were placed on the mask side-by-side. Mask manufacturability (including fracturing, writing time, inspection, and metrology) and wafer print performance of ILT were studied. The results demonstrated that ILT achieved better CD accuracy, produced substantially larger process window than conventional OPC, and met SMIC's 65nm process window requirements.
NASA Astrophysics Data System (ADS)
Joo, Hyun S.; Seo, Dong C.; Kim, Chang M.; Lim, Young T.; Cho, Seong D.; Lee, Jong B.; Song, Ji Y.; Kim, Kyoung M.; Park, Joo H.; Jung, Jae Chang; Shin, Ki S.; Bok, Cheol Kyu; Moon, Seung C.
2004-05-01
There are numerous methods being explored by lithographers to achieve the patterning of sub-90nm contact hole features. Regarding optical impact on contact imaging, various optical extension techniques such as assist features, focus drilling, phase shift masks, and off-axis illumination are being employed to improve the aerial image. One possible option for improving of the process window in contact hole patterning is resist reflow. We have already reported the resist using a ring opened polymer of maleic anhydride unit(ROMA) during the past two years in this conference. It has several good properties such as UV transmittance, PED stability, solubility and storage stability. The resist using ROMA polymer as a matrix resin showed a good lithographic performance at C/H pattern and one of the best characteristics in a ROMA polymer is the property of thermal shrinkage. It has a specific glass transition temperature(Tg) each polymers, so they made a applying of resist reflow technique to print sub-90nm C/H possible. Recently, we have researched about advanced ROMA polymer(ROMA II), which is composed of cycloolefine derivatives with existing ROMA type polymer(ROMA I), for dry etch resistance increasing, high resolution, and good thermal shrinkage property. In this paper, we will present the structure, thermal shrinkage properties, Tg control, material properties for ROMA II polymer and will show characteristics, the lithographic performance for iso and dense C/H applications of the resist using ROMA II polymer. In addition, we will discuss resist reflow data gained at C/H profile of sub-90nm sizes, which has good process window.
DSA process window expansion with novel DSA track hardware
NASA Astrophysics Data System (ADS)
Harumoto, Masahiko; Stokes, Harold; Tanaka, Yuji; Kaneyama, Koji; Pieczulewski, Chalres; Asai, Masaya; Argoud, Maxime; Servin, Isabelle; Chamiot-Maitral, Gaëlle; Claveau, Guillaume; Tiron, Raluca; Cayrefourcq, Ian
2017-03-01
PS-b-PMMA block copolymer is a well-known DSA material, and there are many DSA patterning methods that make effective the use of such 1st generation materials. Consequently, this variety of patterning methods opens a wide array of possibilities for DSA application[1-4]. Last year, during the inaugural International DSA Symposium, researchers and lithographers concurred on common key issues for DSA patterning methods such as: defect density, LWR, placement error, etc. Defect density was specifically expressed as the biggest obstacle for new processes. Coat-Develop track systems contribute to the DSA pattern fabrication and also influence the DSA pattern performances[4]. In this study, defectivity was investigated using an atmosphere-controlled chamber on the SOKUDO DUO track. As an initial step for expanding the DSA process window, fingerprint patterns were used for various atmospheric conditions during DSA self-assembly annealing. In this study, we will demonstrate an improved DSA process window, and then we will discuss the mechanism for this atmospheric effect.
Integrated model-based retargeting and optical proximity correction
NASA Astrophysics Data System (ADS)
Agarwal, Kanak B.; Banerjee, Shayak
2011-04-01
Conventional resolution enhancement techniques (RET) are becoming increasingly inadequate at addressing the challenges of subwavelength lithography. In particular, features show high sensitivity to process variation in low-k1 lithography. Process variation aware RETs such as process-window OPC are becoming increasingly important to guarantee high lithographic yield, but such techniques suffer from high runtime impact. An alternative to PWOPC is to perform retargeting, which is a rule-assisted modification of target layout shapes to improve their process window. However, rule-based retargeting is not a scalable technique since rules cannot cover the entire search space of two-dimensional shape configurations, especially with technology scaling. In this paper, we propose to integrate the processes of retargeting and optical proximity correction (OPC). We utilize the normalized image log slope (NILS) metric, which is available at no extra computational cost during OPC. We use NILS to guide dynamic target modification between iterations of OPC. We utilize the NILS tagging capabilities of Calibre TCL scripting to identify fragments with low NILS. We then perform NILS binning to assign different magnitude of retargeting to different NILS bins. NILS is determined both for width, to identify regions of pinching, and space, to locate regions of potential bridging. We develop an integrated flow for 1x metal lines (M1) which exhibits lesser lithographic hotspots compared to a flow with just OPC and no retargeting. We also observe cases where hotspots that existed in the rule-based retargeting flow are fixed using our methodology. We finally also demonstrate that such a retargeting methodology does not significantly alter design properties by electrically simulating a latch layout before and after retargeting. We observe less than 1% impact on latch Clk-Q and D-Q delays post-retargeting, which makes this methodology an attractive one for use in improving shape process windows without perturbing designed values.
Wafer plane inspection with soft resist thresholding
NASA Astrophysics Data System (ADS)
Hess, Carl; Shi, Rui-fang; Wihl, Mark; Xiong, Yalin; Pang, Song
2008-10-01
Wafer Plane Inspection (WPI) is an inspection mode on the KLA-Tencor TeraScaTM platform that uses the high signalto- noise ratio images from the high numerical aperture microscope, and then models the entire lithographic process to enable defect detection on the wafer plane[1]. This technology meets the needs of some advanced mask manufacturers to identify the lithographically-significant defects while ignoring the other non-lithographically-significant defects. WPI accomplishes this goal by performing defect detection based on a modeled image of how the mask features would actually print in the photoresist. There are several advantages to this approach: (1) the high fidelity of the images provide a sensitivity advantage over competing approaches; (2) the ability to perform defect detection on the wafer plane allows one to only see those defects that have a printing impact on the wafer; (3) the use of modeling on the lithographic portion of the flow enables unprecedented flexibility to support arbitrary illumination profiles, process-window inspection in unit time, and combination modes to find both printing and non-printing defects. WPI is proving to be a valuable addition to the KLA-Tencor detection algorithm suite. The modeling portion of WPI uses a single resist threshold as the final step in the processing. This has been shown to be adequate on several advanced customer layers, but is not ideal for all layers. Actual resist chemistry has complicated processes including acid and base-diffusion and quench that are not consistently well-modeled with a single resist threshold. We have considered the use of an advanced resist model for WPI, but rejected it because the burdensome requirements for the calibration of the model were not practical for reticle inspection. This paper describes an alternative approach that allows for a "soft" resist threshold to be applied that provides a more robust solution for the most challenging processes. This approach is just finishing beta testing with a customer developing advanced node designs.
NASA Astrophysics Data System (ADS)
Shao, Feng; Evanschitzky, Peter; Fühner, Tim; Erdmann, Andreas
2009-10-01
This paper employs the Waveguide decomposition method as an efficient rigorous electromagnetic field (EMF) solver to investigate three dimensional mask-induced imaging artifacts in EUV lithography. The major mask diffraction induced imaging artifacts are first identified by applying the Zernike analysis of the mask nearfield spectrum of 2D lines/spaces. Three dimensional mask features like 22nm semidense/dense contacts/posts, isolated elbows and line-ends are then investigated in terms of lithographic results. After that, the 3D mask-induced imaging artifacts such as feature orientation dependent best focus shift, process window asymmetries, and other aberration-like phenomena are explored for the studied mask features. The simulation results can help lithographers to understand the reasons of EUV-specific imaging artifacts and to devise illumination and feature dependent strategies for their compensation in the optical proximity correction (OPC) for EUV masks. At last, an efficient approach using the Zernike analysis together with the Waveguide decomposition technique is proposed to characterize the impact of mask properties for the future OPC process.
Improving 130nm node patterning using inverse lithography techniques for an analog process
NASA Astrophysics Data System (ADS)
Duan, Can; Jessen, Scott; Ziger, David; Watanabe, Mizuki; Prins, Steve; Ho, Chi-Chien; Shu, Jing
2018-03-01
Developing a new lithographic process routinely involves usage of lithographic toolsets and much engineering time to perform data analysis. Process transfers between fabs occur quite often. One of the key assumptions made is that lithographic settings are equivalent from one fab to another and that the transfer is fluid. In some cases, that is far from the truth. Differences in tools can change the proximity effect seen in low k1 imaging processes. If you use model based optical proximity correction (MBOPC), then a model built in one fab will not work under the same conditions at another fab. This results in many wafers being patterned to try and match a baseline response. Even if matching is achieved, there is no guarantee that optimal lithographic responses are met. In this paper, we discuss the approach used to transfer and develop new lithographic processes and define MBOPC builds for the new lithographic process in Fab B which was transferred from a similar lithographic process in Fab A. By using PROLITHTM simulations to match OPC models for each level, minimal downtime in wafer processing was observed. Source Mask Optimization (SMO) was also used to optimize lithographic processes using novel inverse lithography techniques (ILT) to simultaneously optimize mask bias, depth of focus (DOF), exposure latitude (EL) and mask error enhancement factor (MEEF) for critical designs for each level.
High-Si content BARC for dual-BARC systems such as trilayer patterning
NASA Astrophysics Data System (ADS)
Kennedy, Joseph; Xie, Song-Yuan; Wu, Ze-Yu; Katsanes, Ron; Flanigan, Kyle; Lee, Kevin; Slezak, Mark; Liu, Zhi; Lin, Shang-Ho
2009-03-01
This work discusses the requirements and performance of Honeywell's middle layer material, UVAS, for tri-layer patterning. UVAS is a high Si content polymer synthesized directly from Si containing starting monomer components. The monomers are selected to produce a film that meets the requirements as a middle layer for tri-layer patterning (TLP) and gives us a level of flexibility to adjust the properties of the film to meet the customer's specific photoresist and patterning requirements. Results of simulations of the substrate reflectance versus numerical aperture, UVAS thickness, and under layer film are presented. ArF photoresist line profiles and process latitude versus UVAS bake at temperatures as low as 150ºC are presented and discussed. Immersion lithographic patterning of ArF photoresist line space and contact hole features will be presented. A sequence of SEM images detailing the plasma etch transfer of line space photoresist features through the middle and under layer films comprising the TLP film stack will be presented. Excellent etch selectivity between the UVAS and the organic under layer film exists as no edge erosion or faceting is observed as a result of the etch process. A detailed study of the impact of a PGMEA solvent photoresist rework process on the lithographic process window of a TLP film stack was performed with the results indicating that no degradation to the UVAS film occurs.
Lithographic qualification of high-transmission mask blank for 10nm node and beyond
NASA Astrophysics Data System (ADS)
Xu, Yongan; Faure, Tom; Viswanathan, Ramya; Lobb, Granger; Wistrom, Richard; Burns, Sean; Hu, Lin; Graur, Ioana; Bleiman, Ben; Fischer, Dan; Mignot, Yann; Sakamoto, Yoshifumi; Toda, Yusuke; Bolton, John; Bailey, Todd; Felix, Nelson; Arnold, John; Colburn, Matthew
2016-04-01
In this paper, we discuss the lithographic qualification of high transmission (High T) mask for Via and contact hole applications in 10nm node and beyond. First, the simulated MEEF and depth of focus (DoF) data are compared between the 6% and High T attnPSM masks with the transmission of High T mask blank varying from 12% to 20%. The 12% High T blank shows significantly better MEEF and larger DoF than those of 6% attnPSM mask blank, which are consistent with our wafer data. However, the simulations show no obvious advantage in MEEF and DoF when the blank transmittance is larger than 12%. From our wafer data, it has been seen that the common process window from High T mask is 40nm bigger than that from the 6% attnPSM mask. In the elongated bar structure with smaller aspect ratio, 1.26, the 12% High T mask shows significantly less develop CD pull back in the major direction. Compared to the High T mask, the optimized new illumination condition for 6% attnPSM shows limited improvement in MEEF and the DoF through pitch. In addition, by using the High T mask blank, we have also investigated the SRAF printing, side lobe printing and the resist profile through cross sections, and no patterning risk has been found for manufacturing. As part of this work new 12% High T mask blank materials and processes were developed, and a brief overview of key mask technology development results have been shared. Overall, it is concluded that the High T mask, 12% transmission, provides the most robust and extendable lithographic solution for 10nm node and beyond.
NASA Astrophysics Data System (ADS)
Paracha, Shazad; Goodman, Eliot; Eynon, Benjamin G.; Noyes, Ben F.; Ha, Steven; Kim, Jong-Min; Lee, Dong-Seok; Lee, Dong-Heok; Cho, Sang-Soo; Ham, Young M.; Vacca, Anthony D.; Fiekowsky, Peter J.; Fiekowsky, Daniel I.
2014-10-01
IC fabs inspect critical masks on a regular basis to ensure high wafer yields. These requalification inspections are costly for many reasons including the capital equipment, system maintenance, and labor costs. In addition, masks typically remain in the "requal" phase for extended, non-productive periods of time. The overall "requal" cycle time in which reticles remain non-productive is challenging to control. Shipping schedules can slip when wafer lots are put on hold until the master critical layer reticle is returned to production. Unfortunately, substituting backup critical layer reticles can significantly reduce an otherwise tightly controlled process window adversely affecting wafer yields. One major requal cycle time component is the disposition process of mask inspections containing hundreds of defects. Not only is precious non-productive time extended by reviewing hundreds of potentially yield-limiting detections, each additional classification increases the risk of manual review techniques accidentally passing real yield limiting defects. Even assuming all defects of interest are flagged by operators, how can any person's judgment be confident regarding lithographic impact of such defects? The time reticles spend away from scanners combined with potential yield loss due to lithographic uncertainty presents significant cycle time loss and increased production costs An automatic defect analysis system (ADAS), which has been in fab production for numerous years, has been improved to handle the new challenges of 14nm node automate reticle defect classification by simulating each defect's printability under the intended illumination conditions. In this study, we have created programmed defects on a production 14nm node critical-layer reticle. These defects have been analyzed with lithographic simulation software and compared to the results of both AIMS optical simulation and to actual wafer prints.
Optimization of RET flow using test layout
NASA Astrophysics Data System (ADS)
Zhang, Yunqiang; Sethi, Satyendra; Lucas, Kevin
2008-11-01
At advanced technology nodes with extremely low k1 lithography, it is very hard to achieve image fidelity requirements and process window for some layout configurations. Quite often these layouts are within simple design rule constraints for a given technology node. It is important to have these layouts included during early RET flow development. Most of RET developments are based on shrunk layout from the previous technology node, which is possibly not good enough. A better methodology in creating test layout is required for optical proximity correction (OPC) recipe and assists feature development. In this paper we demonstrate the application of programmable test layouts in RET development. Layout pattern libraries are developed and embedded in a layout tool (ICWB). Assessment gauges are generated together with patterns for quick correction accuracy assessment. Several groups of test pattern libraries have been developed based on learning from product patterns and a layout DOE approach. The interaction between layout patterns and OPC recipe has been studied. Correction of a contact layer is quite challenge because of poor convergence and low process window. We developed test pattern library with many different contact configurations. Different OPC schemes are studied on these test layouts. The worst process window patterns are pinpointed for a given illumination condition. Assist features (AF) are frequently placed according to pre-determined rules to improve lithography process window. These rules are usually derived from lithographic models and experiments. Direct validation of AF rules is required at development phase. We use the test layout approach to determine rules in order to eliminate AF printability problem.
Suryana, Mona; Shanmugarajah, Jegan V; Maniam, Sivakumar M; Grenci, Gianluca
2017-08-17
Infrared (IR) spectro-microscopy of living biological samples is hampered by the absorption of water in the mid-IR range and by the lack of suitable microfluidic devices. Here, a protocol for the fabrication of plastic microfluidic devices is demonstrated, where soft lithographic techniques are used to embed transparent Calcium Fluoride (CaF2) view-ports in connection with observation chamber(s). The method is based on a replica casting approach, where a polydimethylsiloxane (PDMS) mold is produced through standard lithographic procedures and then used as the template to produce a plastic device. The plastic device features ultraviolet/visible/infrared (UV/Vis/IR) -transparent windows made of CaF2 to allow for direct observation with visible and IR light. The advantages of the proposed method include: a reduced need for accessing a clean room micro-fabrication facility, multiple view-ports, an easy and versatile connection to an external pumping system through the plastic body, flexibility of the design, e.g., open/closed channels configuration, and the possibility to add sophisticated features such as nanoporous membranes.
Directed self-assembly of block copolymer films on atomically-thin graphene chemical patterns
Chang, Tzu-Hsuan; Xiong, Shisheng; Jacobberger, Robert M.; ...
2016-08-16
Directed self-assembly of block copolymers is a scalable method to fabricate well-ordered patterns over the wafer scale with feature sizes below the resolution of conventional lithography. Typically, lithographically-defined prepatterns with varying chemical contrast are used to rationally guide the assembly of block copolymers. The directed self-assembly to obtain accurate registration and alignment is largely influenced by the assembly kinetics. Furthermore, a considerably broad processing window is favored for industrial manufacturing. Using an atomically-thin layer of graphene on germanium, after two simple processing steps, we create a novel chemical pattern to direct the assembly of polystyreneblock-poly(methyl methacrylate). Faster assembly kinetics aremore » observed on graphene/germanium chemical patterns than on conventional chemical patterns based on polymer mats and brushes. This new chemical pattern allows for assembly on a wide range of guiding periods and along designed 90° bending structures. We also achieve density multiplication by a factor of 10, greatly enhancing the pattern resolution. Lastly, the rapid assembly kinetics, minimal topography, and broad processing window demonstrate the advantages of inorganic chemical patterns composed of hard surfaces.« less
Single-expose patterning development for EUV lithography
NASA Astrophysics Data System (ADS)
De Silva, Anuja; Petrillo, Karen; Meli, Luciana; Shearer, Jeffrey C.; Beique, Genevieve; Sun, Lei; Seshadri, Indira; Oh, Taehwan; Han, Seulgi; Saulnier, Nicole; Lee, Joe; Arnold, John C.; Hamieh, Bassem; Felix, Nelson M.; Furukawa, Tsuyoshi; Singh, Lovejeet; Ayothi, Ramakrishnan
2017-03-01
Initial readiness of EUV (extreme ultraviolet) patterning was demonstrated in 2016 with IBM Alliance's 7nm device technology. The focus has now shifted to driving the 'effective' k1 factor and enabling the second generation of EUV patterning. With the substantial cost of EUV exposure there is significant interest in extending the capability to do single exposure patterning with EUV. To enable this, emphasis must be placed on the aspect ratios, adhesion, defectivity reduction, etch selectivity, and imaging control of the whole patterning process. Innovations in resist materials and processes must be included to realize the full entitlement of EUV lithography at 0.33NA. In addition, enhancements in the patterning process to enable good defectivity, lithographic process window, and post etch pattern fidelity are also required. Through this work, the fundamental material challenges in driving down the effective k1 factor will be highlighted.
NASA Astrophysics Data System (ADS)
Seoud, Ahmed; Kim, Juhwan; Ma, Yuansheng; Jayaram, Srividya; Hong, Le; Chae, Gyu-Yeol; Lee, Jeong-Woo; Park, Dae-Jin; Yune, Hyoung-Soon; Oh, Se-Young; Park, Chan-Ha
2018-03-01
Sub-resolution assist feature (SRAF) insertion techniques have been effectively used for a long time now to increase process latitude in the lithography patterning process. Rule-based SRAF and model-based SRAF are complementary solutions, and each has its own benefits, depending on the objectives of applications and the criticality of the impact on manufacturing yield, efficiency, and productivity. Rule-based SRAF provides superior geometric output consistency and faster runtime performance, but the associated recipe development time can be of concern. Model-based SRAF provides better coverage for more complicated pattern structures in terms of shapes and sizes, with considerably less time required for recipe development, although consistency and performance may be impacted. In this paper, we introduce a new model-assisted template extraction (MATE) SRAF solution, which employs decision tree learning in a model-based solution to provide the benefits of both rule-based and model-based SRAF insertion approaches. The MATE solution is designed to automate the creation of rules/templates for SRAF insertion, and is based on the SRAF placement predicted by model-based solutions. The MATE SRAF recipe provides optimum lithographic quality in relation to various manufacturing aspects in a very short time, compared to traditional methods of rule optimization. Experiments were done using memory device pattern layouts to compare the MATE solution to existing model-based SRAF and pixelated SRAF approaches, based on lithographic process window quality, runtime performance, and geometric output consistency.
Lithographic fabrication of nanoapertures
Fleming, James G.
2003-01-01
A new class of silicon-based lithographically defined nanoapertures and processes for their fabrication using conventional silicon microprocessing technology have been invented. The new ability to create and control such structures should significantly extend our ability to design and implement chemically selective devices and processes.
Optimum ArFi laser bandwidth for 10nm node logic imaging performance
NASA Astrophysics Data System (ADS)
Alagna, Paolo; Zurita, Omar; Timoshkov, Vadim; Wong, Patrick; Rechtsteiner, Gregory; Baselmans, Jan; Mailfert, Julien
2015-03-01
Lithography process window (PW) and CD uniformity (CDU) requirements are being challenged with scaling across all device types. Aggressive PW and yield specifications put tight requirements on scanner performance, especially on focus budgets resulting in complicated systems for focus control. In this study, an imec N10 Logic-type test vehicle was used to investigate the E95 bandwidth impact on six different Metal 1 Logic features. The imaging metrics that track the impact of light source E95 bandwidth on performance of hot spots are: process window (PW), line width roughness (LWR), and local critical dimension uniformity (LCDU). In the first section of this study, the impact of increasing E95 bandwidth was investigated to observe the lithographic process control response of the specified logic features. In the second section, a preliminary assessment of the impact of lower E95 bandwidth was performed. The impact of lower E95 bandwidth on local intensity variability was monitored through the CDU of line end features and the LWR power spectral density (PSD) of line/space patterns. The investigation found that the imec N10 test vehicle (with OPC optimized for standard E95 bandwidth of300fm) features exposed at 200fm showed pattern specific responses, suggesting areas of potential interest for further investigation.
NASA Astrophysics Data System (ADS)
Lenhart, Joseph L.; Fischer, Daniel; Sambasivan, Sharadha; Lin, Eric K.; Wu, Wen-Li; Guerrero, Douglas J.; Wang, Yubao; Puligadda, Rama
2007-02-01
Interactions between a bottom anti-reflective coating (BARC) and a photoresist can critically impact lithographic patterns. For example, a lithographic pattern can shrink or spread near a BARC interface, a process called undercutting or footing respectively, due to incompatibility between the two materials. Experiments were conducted on two industrial BARC coatings in an effort to determine the impact of BARC surface chemistry on the footing and undercutting phenomena. The BARC coatings were characterized by near edge X-ray absorption fine structure (NEXAFS), contact angle measurements, and neutron and X-ray reflectivity. Contact angle measurement using a variety of fluids showed that the fluid contact angles were independent of the type of BARC coating or the BARC processing temperature. NEXAFS measurements showed that the surface chemistry of each BARC was also independent of the processing temperature. These results suggest that acid-base interactions at the BARC-resist interface are not the cause of the footing-undercutting phenomena encountered in lithographic patterns.
NASA Astrophysics Data System (ADS)
Amblard, Gilles; Purdy, Sara; Cooper, Ryan; Hockaday, Marjory
2016-03-01
The overall quality and processing capability of lithographic materials are critical for ensuring high device yield and performance at sub-20nm technology nodes in a high volume manufacturing environment. Insufficient process margin and high line width roughness (LWR) cause poor manufacturing control, while high defectivity causes product failures. In this paper, we focus on the most critical layer of a sub-20nm technology node LSI device, and present an improved method for characterizing both lithographic and post-patterning defectivity performance of state-of-the-art immersion photoresists. Multiple formulations from different suppliers were used and compared. Photoresists were tested under various process conditions, and multiple lithographic metrics were investigated (depth of focus, exposure dose latitude, line width roughness, etc.). Results were analyzed and combined using an innovative approach based on advanced software, providing clearer results than previously available. This increased detail enables more accurate performance comparisons among the different photoresists. Post-patterning defectivity was also quantified, with defects reviewed and classified using state-of-the-art inspection tools. Correlations were established between the lithographic and post-patterning defectivity performances for each material, and overall ranking was established among the photoresists, enabling the selection of the best performer for implementation in a high volume manufacturing environment.
Lithographic performance of recent DUV photoresists
NASA Astrophysics Data System (ADS)
Streefkerk, Bob; van Ingen Schenau, Koen; Buijk, Corine
1998-06-01
Commercially available photoresists from the major photoresist vendors are investigated using a PAS 5500/300 wafer stepper, a 31.1 mm diameter field size high throughput wafer stepper with variable NA capability up to 0.63. The critical dimension (CD) investigated is 0.25 micrometers and lower for dense and isolated lines and 0.25 micrometers for dense contact holes. The photoresist process performance is quantified by measuring exposure-defocus windows for a specific resolution using a CD SEM. Photoresists that are comparable with or better than APEX-E with RTC top coat, which is the current base line process for lines and spaces imaging performance, are Clariant AZ-DX1300 and Shin Etsu SEPR-4103PB50. Most recent photoresists have much improved delay performance when compared to APEX without top coat. Improvement, when an organic BARC is applied, depends on the actual photoresist characteristics. The optimal photoresist found for 0.25 micrometers contact holes is TOK DP015 C. This process operates at optimal conditions.
NASA Astrophysics Data System (ADS)
Ryu, Sung Jae; Lim, Sung Taek; Vacca, Anthony; Fiekowsky, Peter; Fiekowsky, Dan
2013-09-01
IC fabs inspect critical masks on a regular basis to ensure high wafer yields. These requalification inspections are costly for many reasons including the capital equipment, system maintenance, and labor costs. In addition, masks typically remain in the "requal" phase for extended, non-productive periods of time. The overall "requal" cycle time in which reticles remain non-productive is challenging to control. Shipping schedules can slip when wafer lots are put on hold until the master critical layer reticle is returned to production. Unfortunately, substituting backup critical layer reticles can significantly reduce an otherwise tightly controlled process window adversely affecting wafer yields. One major requal cycle time component is the disposition process of mask inspections containing hundreds of defects. Not only is precious non-productive time extended by reviewing hundreds of potentially yield-limiting detections, each additional classification increases the risk of manual review techniques accidentally passing real yield limiting defects. Even assuming all defects of interest are flagged by operators, how can any person's judgment be confident regarding lithographic impact of such defects? The time reticles spend away from scanners combined with potential yield loss due to lithographic uncertainty presents significant cycle time loss and increased production costs. Fortunately, a software program has been developed which automates defect classification with simulated printability measurement greatly reducing requal cycle time and improving overall disposition accuracy. This product, called ADAS (Auto Defect Analysis System), has been tested in both engineering and high-volume production environments with very successful results. In this paper, data is presented supporting significant reduction for costly wafer print checks, improved inspection area productivity, and minimized risk of misclassified yield limiting defects.
Characterization and control of EUV scanner dose uniformity and stability
NASA Astrophysics Data System (ADS)
Robinson, Chris; Corliss, Dan; Meli, Luciana; Johnson, Rick
2018-03-01
The EUV source is an impressive feat of engineering that provides 13.5 nm radiation by vaporizing tin droplets with a high power CO2 laser and focusing the photons produced in the resultant plasma into the scanner illumination system. Great strides have been made in addressing the many potential stability challenges, but there are still residual spatial and temporal dose non-uniformity signatures. Since even small dose errors can impact the yieldable process window for the advanced lithography products that are exposed on EUV scanners it is crucial to monitor and control the dose variability. Using on-board metrology, the EUV scanner outputs valuable metrics that provide real time insight into the dose performance. We have supplemented scanner data collection with a wafer based methodology that provides high throughput, high sensitivity, quantitative characterization of the EUV scanner dose delivery. The technique uses open frame EUV exposures, so it is exclusive of lithographic pattern imaging, exclusive of lithographic mask pattern and not limited by placement of metrology features. Processed wafers are inspected rapidly, providing 20,000 pixels of detail per exposure field in approximately one minute. Exposing the wafer on the scanner with a bit less than the resist E0 (open frame clearing dose) results in good sensitivity to small variations in the EUV dose delivered. The nominal exposure dose can be modulated by field to calibrate the inspection results and provide quantitative assessment of variations with < 1% sensitivity. This technique has been used for dose uniformity assessments. It is also being used for long term dose stability monitoring and has proven valuable for short term dose stability follow up investigations.
Lithography alternatives meet design style reality: How do they "line" up?
NASA Astrophysics Data System (ADS)
Smayling, Michael C.
2016-03-01
Optical lithography resolution scaling has stalled, giving innovative alternatives a window of opportunity. One important factor that impacts these lithographic approaches is the transition in design style from 2D to 1D for advanced CMOS logic. Just as the transition from 3D circuits to 2D fabrication 50 years ago created an opportunity for a new breed of electronics companies, the transition today presents exciting and challenging time for lithographers. Today, we are looking at a range of non-optical lithography processes. Those considered here can be broadly categorized: self-aligned lithography, self-assembled lithography, deposition lithography, nano-imprint lithography, pixelated e-beam lithography, shot-based e-beam lithography .Do any of these alternatives benefit from or take advantage of 1D layout? Yes, for example SAPD + CL (Self Aligned Pitch Division combined with Complementary Lithography). This is a widely adopted process for CMOS nodes at 22nm and below. Can there be additional design / process co-optimization? In spite of the simple-looking nature of 1D layout, the placement of "cut" in the lines and "holes" for interlayer connections can be tuned for a given process capability. Examples of such optimization have been presented at this conference, typically showing a reduction of at least one in the number of cut or hole patterns needed.[1,2] Can any of the alternatives complement each other or optical lithography? Yes.[3] For example, DSA (Directed Self Assembly) combines optical lithography with self-assembly. CEBL (Complementary e-Beam Lithography) combines optical lithography with SAPD for lines with shot-based e-beam lithography for cuts and holes. Does one (shrinking) size fit all? No, that's why we have many alternatives. For example NIL (Nano-imprint Lithography) has been introduced for NAND Flash patterning where the (trending lower) defectivity is acceptable for the product. Deposition lithography has been introduced in 3D NAND Flash to set the channel length of select and memory transistors.
Apparatus and method for in-situ cleaning of resist outgassing windows
Klebanoff, Leonard E.; Haney, Steven J.
2001-01-01
An apparatus and method for in-situ cleaning of resist outgassing windows. The apparatus includes a chamber located in a structure, with the chamber having an outgassing window to be cleaned positioned in alignment with a slot in the chamber, whereby radiation energy passes through the window, the chamber, and the slot onto a resist-coated wafer mounted in the structure. The chamber is connected to a gas supply and the structure is connected to a vacuum pump. Within the chamber are two cylindrical sector electrodes and a filament is electrically connected to one sector electrode and a power supply. In a first cleaning method the sector electrodes are maintained at the same voltage, the filament is unheated, the chamber is filled with argon (Ar) gas under pressure, and the window is maintained at a zero voltage, whereby Ar ions are accelerated onto the window surface, sputtering away carbon deposits that build up as a result of resist outgassing. A second cleaning method is similar except oxygen gas (O.sub.2) is admitted to the chamber instead of Ar. These two methods can be carried out during lithographic operation. A third method, carried out during a maintenance period, involves admitting CO.sub.2 into the chamber, heating the filament to a point of thermionic emission, the sector electrodes are at different voltages, excited CO.sub.2 gas molecules are created which impact the carbon contamination on the window, and gasify it, producing CO gaseous products that are pumped away.
Wang, Fan; Wang, Xiangzhao; Ma, Mingying
2006-08-20
As the feature size decreases, degradation of image quality caused by wavefront aberrations of projection optics in lithographic tools has become a serious problem in the low-k1 process. We propose a novel measurement technique for in situ characterizing aberrations of projection optics in lithographic tools. Considering the impact of the partial coherence illumination, we introduce a novel algorithm that accurately describes the pattern displacement and focus shift induced by aberrations. Employing the algorithm, the measurement condition is extended from three-beam interference to two-, three-, and hybrid-beam interferences. The experiments are performed to measure the aberrations of projection optics in an ArF scanner.
Selective Epitaxial Graphene Growth on SiC via AlN Capping
NASA Astrophysics Data System (ADS)
Zaman, Farhana; Rubio-Roy, Miguel; Moseley, Michael; Lowder, Jonathan; Doolittle, William; Berger, Claire; Dong, Rui; Meindl, James; de Heer, Walt; Georgia Institute of Technology Team
2011-03-01
Electronic-quality graphene is epitaxially grown by graphitization of carbon-face silicon carbide (SiC) by the sublimation of silicon atoms from selected regions uncapped by aluminum nitride (AlN). AlN (deposited by molecular beam epitaxy) withstands high graphitization temperatures of 1420o C, hence acting as an effective capping layer preventing the growth of graphene under it. The AlN is patterned and etched to open up windows onto the SiC surface for subsequent graphitization. Such selective epitaxial growth leads to the formation of high-quality graphene in desired patterns without the need for etching and lithographic patterning of graphene itself. No detrimental contact of the graphene with external chemicals occurs throughout the fabrication-process. The impact of process-conditions on the mobility of graphene is investigated. Graphene hall-bars were fabricated and characterized by scanning Raman spectroscopy, ellipsometry, and transport measurements. This controlled growth of graphene in selected regions represents a viable approach to fabrication of high-mobility graphene as the channel material for fast-switching field-effect transistors.
Implementation and benefits of advanced process control for lithography CD and overlay
NASA Astrophysics Data System (ADS)
Zavyalova, Lena; Fu, Chong-Cheng; Seligman, Gary S.; Tapp, Perry A.; Pol, Victor
2003-05-01
Due to the rapidly reduced imaging process windows and increasingly stingent device overlay requirements, sub-130 nm lithography processes are more severely impacted than ever by systamic fault. Limits on critical dimensions (CD) and overlay capability further challenge the operational effectiveness of a mix-and-match environment using multiple lithography tools, as such mode additionally consumes the available error budgets. Therefore, a focus on advanced process control (APC) methodologies is key to gaining control in the lithographic modules for critical device levels, which in turn translates to accelerated yield learning, achieving time-to-market lead, and ultimately a higher return on investment. This paper describes the implementation and unique challenges of a closed-loop CD and overlay control solution in high voume manufacturing of leading edge devices. A particular emphasis has been placed on developing a flexible APC application capable of managing a wide range of control aspects such as process and tool drifts, single and multiple lot excursions, referential overlay control, 'special lot' handling, advanced model hierarchy, and automatic model seeding. Specific integration cases, including the multiple-reticle complementary phase shift lithography process, are discussed. A continuous improvement in the overlay and CD Cpk performance as well as the rework rate has been observed through the implementation of this system, and the results are studied.
NASA Astrophysics Data System (ADS)
Steen, S. E.; McNab, S. J.; Sekaric, L.; Babich, I.; Patel, J.; Bucchignano, J.; Rooks, M.; Fried, D. M.; Topol, A. W.; Brancaccio, J. R.; Yu, R.; Hergenrother, J. M.; Doyle, J. P.; Nunes, R.; Viswanathan, R. G.; Purushothaman, S.; Rothwell, M. B.
2005-05-01
Semiconductor process development teams are faced with increasing process and integration complexity while the time between lithographic capability and volume production has remained more or less constant over the last decade. Lithography tools have often gated the volume checkpoint of a new device node on the ITRS roadmap. The processes have to be redeveloped after the tooling capability for the new groundrule is obtained since straight scaling is no longer sufficient. In certain cases the time window that the process development teams have is actually decreasing. In the extreme, some forecasts are showing that by the time the 45nm technology node is scheduled for volume production, the tooling vendors will just begin shipping the tools required for this technology node. To address this time pressure, IBM has implemented a hybrid-lithography strategy that marries the advantages of optical lithography (high throughput) with electron beam direct write lithography (high resolution and alignment capability). This hybrid-lithography scheme allows for the timely development of semiconductor processes for the 32nm node, and beyond. In this paper we will describe how hybrid lithography has enabled early process integration and device learning and how IBM applied e-beam & optical hybrid lithography to create the world's smallest working SRAM cell.
NASA Astrophysics Data System (ADS)
Puttaraksa, Nitipon; Norarat, Rattanaporn; Laitinen, Mikko; Sajavaara, Timo; Singkarat, Somsorn; Whitlow, Harry J.
2012-02-01
Poly(methyl methacrylate) is a common polymer used as a lithographic resist for all forms of particle (photon, ion and electron) beam writing. Faithful lithographic reproduction requires that the exposure dose, Θ, lies in the window Θ0⩽Θ<Θ, where Θ0 and Θ represent the clearing and cross-linking onset doses, respectively. In this work we have used the programmable proximity aperture ion beam lithography systems in Chiang Mai and Jyväskylä to determine the exposure characteristics in terms of fluence for 2 MeV protons, 3 MeV 4He and 6 MeV 12C ions, respectively. After exposure the samples were developed in 7:3 by volume propan-2-ol:de-ionised water mixture. At low fluences, where the fluence is below the clearing fluence, the exposed regions were characterised by rough regions, particularly for He with holes around the ion tracks. As the fluence (dose) increases so that the dose exceeds the clearing dose, the PMMA is uniformly removed with sharp vertical walls. When Θ exceeds the cross-linking onset fluence, the bottom of the exposed regions show undissolved PMMA.
12. Photocopy of lithograph (source unknown) The Armor Lithograph Company, ...
12. Photocopy of lithograph (source unknown) The Armor Lithograph Company, Ltd., Pittsburgh, Pennsylvania, ca. 1888 COURTHOUSE AND JAIL, FROM THE WEST - Allegheny County Courthouse & Jail, 436 Grant Street (Courthouse), 420 Ross Street (Jail), Pittsburgh, Allegheny County, PA
Jung, Min Wook; Myung, Sung; Song, Wooseok; Kang, Min-A; Kim, Sung Ho; Yang, Cheol-Soo; Lee, Sun Sook; Lim, Jongsun; Park, Chong-Yun; Lee, Jeong-O; An, Ki-Seok
2014-08-27
We have fabricated graphene-based chemical sensors with flexible heaters for the highly sensitive detection of specific gases. We believe that increasing the temperature of the graphene surface significantly enhanced the electrical signal change of the graphene-based channel, and reduced the recovery time needed to obtain a normal state of equilibrium. In addition, a simple and efficient soft lithographic patterning process was developed via surface energy modification for advanced, graphene-based flexible devices, such as gas sensors. As a proof of concept, we demonstrated the high sensitivity of NO2 gas sensors based on graphene nanosheets. These devices were fabricated using a simple soft-lithographic patterning method, where flexible graphene heaters adjacent to the channel of sensing graphene were utilized to control graphene temperature.
Stability and imaging of the ASML EUV alpha demo tool
NASA Astrophysics Data System (ADS)
Hermans, Jan V.; Baudemprez, Bart; Lorusso, Gian; Hendrickx, Eric; van Dijk, Andre; Jonckheere, Rik; Goethals, Anne-Marie
2009-03-01
Extreme Ultra-Violet (EUV) lithography is the leading candidate for semiconductor manufacturing of the 22nm technology node and beyond, due to the very short wavelength of 13.5nm. However, reducing the wavelength adds complexity to the lithographic process. The impact of the EUV specific conditions on lithographic performance needs to be understood, before bringing EUV lithography into pre-production. To provide early learning on EUV, an EUV fullfield scanner, the Alpha Demo Tool (ADT) from ASML was installed at IMEC, using a Numerical Aperture (NA) of 0.25. In this paper we report on different aspects of the ADT: the imaging and overlay performance and both short and long-term stability. For 40nm dense Lines-Spaces (LS), the ADT shows an across field overlapping process window of 270nm Depth Of Focus (DOF) at 10% Exposure Latitude (EL) and a wafer CD Uniformity (CDU) of 3nm 3σ, without any corrections for process or reticle. The wafer CDU is correlated to different factors that are known to influence the CD fingerprint from traditional lithography: slit intensity uniformity, focus plane deviation and reticle CD error. Taking these contributions into account, the CD through slit fingerprint for 40nm LS is simulated with excellent agreement to experimental data. The ADT shows good CD stability over 9 months of operation, both intrafield and across wafer. The projection optics reflectivity has not degraded over 9 months. Measured overlay performance with respect to a dry tool shows |Mean|+3σ below 20nm with more correction potential by applying field-by-field corrections (|Mean|+3σ <=10nm). For 22nm SRAM application, both contact hole and metal layer were printed in EUV with 10% CD and 15nm overlay control. Below 40nm, the ADT shows good wafer CDU for 30nm dense and isolated lines (on the same wafer) and 38nm dense Contact Holes (CH). First 28nm dense line CDU data are achieved. The results indicate that the ADT can be used effectively for EUV process development before installation of the pre-production tool, the ASML NXE Gen. 1 at IMEC.
Sub-half-micron contact window design with 3D photolithography simulator
NASA Astrophysics Data System (ADS)
Brainerd, Steve K.; Bernard, Douglas A.; Rey, Juan C.; Li, Jiangwei; Granik, Yuri; Boksha, Victor V.
1997-07-01
In state of the art IC design and manufacturing certain lithography layers have unique requirements. Latitudes and tolerances that apply to contacts and polysilicon gates are tight for such critical layers. Industry experts are discussing the most cost effective ways to use feature- oriented equipment and materials already developed for these layers. Such requirements introduce new dimensions into the traditionally challenging task for the photolithography engineer when considering various combinations of multiple factors to optimize and control the process. In addition, he/she faces a rapidly increasing cost of experiments, limited time and scarce access to equipment to conduct them. All the reasons presented above support simulation as an ideal method to satisfy these demands. However lithography engineers may be easily dissatisfied with a simulation tool when discovering disagreement between the simulation and experimental data. The problem is that several parameters used in photolithography simulation are very process specific. Calibration, i.e. matching experimental and simulation data using a specific set of procedures allows one to effectively use the simulation tool. We present results of a simulation based approach to optimize photolithography processes for sub-0.5 micron contact windows. Our approach consists of: (1) 3D simulation to explore different lithographic options, (2) calibration to a range of process conditions with extensive use of specifically developed optimization techniques. The choice of a 3D simulator is essential because of 3D nature of the problem of contact window design. We use DEPICT 4.1. This program performs fast aerial image simulation as presented before. For 3D exposure the program uses an extension to three-dimensions of the high numerical aperture model combined with Fast Fourier Transforms for maximum performance and accuracy. We use Kim (U.C. Berkeley) model and the fast marching Level Set method respectively for the calculation of resist development rates and resist surface movement during development process. Calibration efforts were aimed at matching experimental results on contact windows obtained after exposure of a binary mask. Additionally, simulation was applied to conduct quantitative analysis of PSM design capabilities, optical proximity correction, and stepper parameter optimization. Extensive experiments covered exposure (ASML 5500/100D stepper), pre- and post-exposure bake and development (2.38% TMAH, puddle process) of JSR IX725D2G and TOK iP3500 photoresists films on 200 mm test wafers. `Aquatar' was used as top antireflective coating, SEM pictures of developed patterns were analyzed and compared with simulation results for different values of defocus, exposure energies, numerical aperture and partial coherence.
Mix & match electron beam & scanning probe lithography for high throughput sub-10 nm lithography
NASA Astrophysics Data System (ADS)
Kaestner, Marcus; Hofer, Manuel; Rangelow, Ivo W.
2013-03-01
The prosperous demonstration of a technique able to produce features with single nanometer (SN) resolution could guide the semiconductor industry into the desired beyond CMOS era. In the lithographic community immense efforts are being made to develop extreme ultra-violet lithography (EUVL) and multiple-e-beam direct-write systems as possible successor for next generation lithography (NGL). However, patterning below 20 nm resolution and sub-10 nm overlay alignment accuracy becomes an extremely challenging quest. Herein, the combination of electron beam lithography (EBL) or EUVL with the outstanding capabilities of closed-loop scanning proximal probe nanolithography (SPL) reveals a promising way to improve both patterning resolution and reproducibility in combination with excellent overlay and placement accuracy. In particular, the imaging and lithographic resolution capabilities provided by scanning probe microscopy (SPM) methods touches the atomic level, which expresses the theoretical limit of constructing nanoelectronic devices. Furthermore, the symbiosis between EBL (EUVL) and SPL expands the process window of EBL (EUVL) far beyond state-of-the-art allowing SPL-based pre- and post-patterning of EBL (EUVL) written features at critical dimension level with theoretically nanometer precise pattern overlay alignment. Moreover, we can modify the EBL (EUVL) pattern before as well as after the development step. In this paper we demonstrate proof of concept using the ultra-high resolution molecular glass resist calixarene. Therefor we applied Gaussian E-beam lithography system operating at 10 keV and a home-developed SPL set-up. The introduced Mix and Match lithography strategy enables a powerful use of our SPL set-up especially as post-patterning tool for inspection and repair functions below the sub-10 nm critical dimension level.
Digital processing techniques and film density calibration for printing image data
Chavez, Pat S.; McSweeney, Joseph A.; Binnie, Douglas R.
1987-01-01
Satellite image data that cover a wide range of environments are being used to make prints that represent a map type product. If a wide distribution of these products is desired, they are printed using lithographic rather than photographic procedures to reduce the cost per print. Problems are encountered in the photo lab if the film products to be used for lithographic printing have the same density range and density curve characteristics as the film used for photographic printing. A method is presented that keeps the film densities within the 1.1 range required for lithographic printing, but generates film products with contrast similar to that in photographic film for the majority of data (80 percent). Also, spatial filters can be used to enhance local detail in dark and bright regions, as well as to sharpen the final image product using edge enhancement techniques.
Computational overlay metrology with adaptive data analytics
NASA Astrophysics Data System (ADS)
Schmitt-Weaver, Emil; Subramony, Venky; Ullah, Zakir; Matsunobu, Masazumi; Somasundaram, Ravin; Thomas, Joel; Zhang, Linmiao; Thul, Klaus; Bhattacharyya, Kaustuve; Goossens, Ronald; Lambregts, Cees; Tel, Wim; de Ruiter, Chris
2017-03-01
With photolithography as the fundamental patterning step in the modern nanofabrication process, every wafer within a semiconductor fab will pass through a lithographic apparatus multiple times. With more than 20,000 sensors producing more than 700GB of data per day across multiple subsystems, the combination of a light source and lithographic apparatus provide a massive amount of information for data analytics. This paper outlines how data analysis tools and techniques that extend insight into data that traditionally had been considered unmanageably large, known as adaptive analytics, can be used to show how data collected before the wafer is exposed can be used to detect small process dependent wafer-towafer changes in overlay.
Silicone elastomers capable of large isotropic dimensional change
Lewicki, James; Worsley, Marcus A.
2017-07-18
Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can `shrink` micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.
He, Yuan; Li, Xiang; Que, Long
2012-10-01
Optically transparent anodic aluminum oxide (AAO) nanostructure thin film has been successfully fabricated from lithographically patterned aluminum on indium tin oxide (ITO) glass substrates for the first time, indicating the feasibility to integrate the AAO nanostructures with microdevices or microfluidics for a variety of applications. Both one-step and two-step anodization processes using sulfuric acid and oxalic acid have been utilized for fabricating the AAO nanostructure thin film. The optical properties of the fabricated AAO nanostructure thin film have been evaluated and analyzed.
Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition
NASA Astrophysics Data System (ADS)
De Silva, Anuja; Seshadri, Indira; Chung, Kisup; Arceo, Abraham; Meli, Luciana; Mendoza, Brock; Sulehria, Yasir; Yao, Yiping; Sunder, Madhana; Truong, Hoa; Matham, Shravan; Bao, Ruqiang; Wu, Heng; Felix, Nelson M.; Kanakasabapathy, Sivananda
2017-04-01
With the increasing prevalence of complex device integration schemes, trilayer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination and are limited in their ability to scale down thickness without compromising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO2 films with wet etch tunability. This paper presents a systematic study on development and characterization of plasma-enhanced atomic layer deposited (PEALD) TiO2-based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a trilayer scheme patterned with PEALD-based TiO2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited versus a spin-on metal hardmask.
Development of TiO2 containing hardmasks through PEALD deposition
NASA Astrophysics Data System (ADS)
De Silva, Anuja; Seshadri, Indira; Chung, Kisup; Arceo, Abraham; Meli, Luciana; Mendoza, Brock; Sulehria, Yasir; Yao, Yiping; Sunder, Madhana; Truong, Hao; Matham, Shravan; Bao, Ruqiang; Wu, Heng; Felix, Nelson M.; Kanakasabapathy, Sivananda
2017-03-01
With the increasing prevalence of complex device integration schemes, tri layer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination, and are limited in their ability to scale down thickness without comprising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO2 films with wet etch tunability. This paper presents a systematic study on development and characterization of PEALD deposited TiO2-based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a tri layer scheme patterned with PEALD based TiO2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited vs a spin-on metal hardmask.
Improvements of self-assembly properties via homopolymer addition or block-copolymer blends
NASA Astrophysics Data System (ADS)
Chevalier, X.; Nicolet, C.; Tiron, R.; Gharbi, Ahmed; Argoud, M.; Couderc, C.; Fleury, Guillaume; Hadziioannou, G.; Iliopoulos, I.; Navarro, C.
2014-03-01
The properties of cylindrical poly(styrene-b-methylmethacrylate) (PS-b-PMMA) BCPs self-assembly in thinfilms are studied when the pure BCPs are blended either with a homopolymer or with another cylindrical PS-b-PMMA based BCP. For both of these approaches, we show that the period of the self-assembled features can be easily tuned and controlled, and that the final material presents interesting characteristics, such as the possibility to achieve thicker defects-free films, as compared to pure block-copolymers having the same period. Moreover, a statistical defectivity study based on a Delaunay triangulation and Voronoi analysis of the self-assemblies made with the different blends is described, and prove that despite their high value of polydispersity index, these blends exhibit also improved selfassembly properties (bigger monocrystalline arrangements and enhanced kinetics of defects annihilation) as compared to pure and monodisperse block-copolymers. Finally, the behavior of the blends is also compared to the ones their pure counter-part in templated approach like the contact-hole shrink to evaluate their respective process-window and response toward this physical constrain for lithographic applications.
NASA Astrophysics Data System (ADS)
Paulsson, Adisa; Xing, Kezhao; Fosshaug, Hans; Lundvall, Axel; Bjoernberg, Charles; Karlsson, Johan
2005-05-01
A continuing improvement in resist process is a necessity for high-end photomask fabrication. In advanced chemically amplified resist systems the lithographic performance is strongly influenced by diffusion of acid and acid quencher (i.e. bases). Beside the resist properties, e.g. size and volatility of the photoacid, the process conditions play important roles for the diffusion control. Understanding and managing these properties influences lithographic characteristics on the photomask such as CD uniformity, CD and pitch linearity, resolution, substrate contamination, clear-dark bias and iso-dense bias. In this paper we have investigated effects on the lithographic characteristics with respect to post exposure bake conditions, when using the chemically amplified resist FEP-171. We used commercially available mask blanks from the Hoya Mask Blank Division with NTAR7 chrome and an optimized resist thickness for the 248 nm laser tool at 3200Å. The photomasks were exposed on the optical DUV (248nm) Sigma7300 pattern generator. Additionally, we investigated the image stability between exposure and post exposure bake. Unlike in wafer fabrication, photomask writing requires several hours, making the resist susceptible to image blur and acid latent image degradation.
Organic antireflective coatings for 193-nm lithography
NASA Astrophysics Data System (ADS)
Trefonas, Peter, III; Blacksmith, Robert F.; Szmanda, Charles R.; Kavanagh, Robert J.; Adams, Timothy G.; Taylor, Gary N.; Coley, Suzanne; Pohlers, Gerd
1999-06-01
Organic anti-reflective coatings (ARCs) continue to play an important role in semiconductor manufacturing. These materials provide a convenient means of greatly reducing the resist photospeed swing and reflective notching. In this paper, we describe a novel class of ARC materials optimized for lithographic applications using 193 nm exposure tools. These ARCs are based upon polymers containing hydroxyl-alkyl methacrylate monomers for crosslinkable sites, styrene for a chromophore at 193 nm, and additional alkyl-methacrylate monomers as property modifiers. A glycouril crosslinker and a thermally-activated acidic catalyst provide a route to forming an impervious crosslinked film activate data high bake temperatures. ARC compositions can be adjusted to optimize the film's real and imaginary refractive indices. Selection of optimal target indices for 193 nm lithographic processing through simulations is described. Potential chromophores for 193 nm were explored using ZNDO modeling. We show how these theoretical studies were combined with material selection criteria to yield a versatile organic anti-reflectant film, Shipley 193 G0 ARC. Lithographic process data indicates the materials is capable of supporting high resolution patterning, with the line features displaying a sharp resist/ARC interface with low line edge roughness. The resist Eo swing is successfully reduced from 43 percent to 6 percent.
Protection of lithographic components from particle contamination
Klebanoff, Leonard E.; Rader, Daniel J.
2000-01-01
A system that employs thermophoresis to protect lithographic surfaces from particle deposition and operates in an environment where the pressure is substantially constant and can be sub-atmospheric. The system (thermophoretic pellicle) comprises an enclosure that surrounds a lithographic component whose surface is being protected from particle deposition. The enclosure is provided with means for introducing a flow of gas into the chamber and at least one aperture that provides for access to the lithographic surface for the entry and exit of a beam of radiation, for example, and further controls gas flow into a surrounding low pressure environment such that a higher pressure is maintained within the enclosure and over the surface being protected. The lithographic component can be heated or, alternatively the walls of the enclosure can be cooled to establish a temperature gradient between the surface of the lithographic component and the walls of the enclosure, thereby enabling the thermophoretic force that resists particle deposition.
Method for protection of lithographic components from particle contamination
Klebanoff, Leonard E.; Rader, Daniel J.
2001-07-03
A system that employs thermophoresis to protect lithographic surfaces from particle deposition and operates in an environment where the pressure is substantially constant and can be sub-atmospheric. The system (thermophoretic pellicle) comprises an enclosure that surrounds a lithographic component whose surface is being protected from particle deposition. The enclosure is provided with means for introducing a flow of gas into the chamber and at least one aperture that provides for access to the lithographic surface for the entry and exit of a beam of radiation, for example, and further controls gas flow into a surrounding low pressure environment such that a higher pressure is maintained within the enclosure and over the surface being protected. The lithographic component can be heated or, alternatively the walls of the enclosure can be cooled to establish a temperature gradient between the surface of the lithographic component and the walls of the enclosure, thereby enabling the thermophoretic force that resists particle deposition.
OPC modeling by genetic algorithm
NASA Astrophysics Data System (ADS)
Huang, W. C.; Lai, C. M.; Luo, B.; Tsai, C. K.; Tsay, C. S.; Lai, C. W.; Kuo, C. C.; Liu, R. G.; Lin, H. T.; Lin, B. J.
2005-05-01
Optical proximity correction (OPC) is usually used to pre-distort mask layouts to make the printed patterns as close to the desired shapes as possible. For model-based OPC, a lithographic model to predict critical dimensions after lithographic processing is needed. The model is usually obtained via a regression of parameters based on experimental data containing optical proximity effects. When the parameters involve a mix of the continuous (optical and resist models) and the discrete (kernel numbers) sets, the traditional numerical optimization method may have difficulty handling model fitting. In this study, an artificial-intelligent optimization method was used to regress the parameters of the lithographic models for OPC. The implemented phenomenological models were constant-threshold models that combine diffused aerial image models with loading effects. Optical kernels decomposed from Hopkin"s equation were used to calculate aerial images on the wafer. Similarly, the numbers of optical kernels were treated as regression parameters. This way, good regression results were obtained with different sets of optical proximity effect data.
Cost effective solution using inverse lithography OPC for DRAM random contact layer
NASA Astrophysics Data System (ADS)
Jun, Jinhyuck; Hwang, Jaehee; Choi, Jaeseung; Oh, Seyoung; Park, Chanha; Yang, Hyunjo; Dam, Thuc; Do, Munhoe; Lee, Dong Chan; Xiao, Guangming; Choi, Jung-Hoe; Lucas, Kevin
2017-04-01
Many different advanced devices and design layers currently employ double patterning technology (DPT) as a means to overcome lithographic and OPC limitations at low k1 values. Certainly device layers with k1 value below 0.25 require DPT or other pitch splitting methodologies. DPT has also been used to improve patterning of certain device layers with k1 values slightly above 0.25, due to the difficulty of achieving sufficient pattern fidelity with only a single exposure. Unfortunately, this broad adoption of DPT also came with a significant increase in patterning process cost. In this paper, we discuss the development of a single patterning technology process using an integrated Inverse Lithography Technology (ILT) flow for mask synthesis. A single pattering technology flow will reduce the manufacturing cost for a k1 > 0.25 full chip random contact layer in a memory device by replacing the more expensive DPT process with ILT flow, while also maintaining good lithographic production quality and manufacturable OPC/RET production metrics. This new integrated flow consists of applying ILT to the difficult core region and traditional rule-based assist features (RBAFs) with OPC to the peripheral region of a DRAM contact layer. Comparisons of wafer results between the ILT process and the non-ILT process showed the lithographic benefits of ILT and its ability to enable a robust single patterning process for this low-k1 device layer. Advanced modeling with a negative tone develop (NTD) process achieved the accuracy levels needed for ILT to control feature shapes through dose and focus. Details of these afore mentioned results will be described in the paper.
New VCSEL technology with scalability for single mode operation and densely integrated arrays
NASA Astrophysics Data System (ADS)
Zhao, Guowei; Demir, Abdullah; Freisem, Sabine; Zhang, Yu; Liu, Xiaohang; Deppe, Dennis G.
2011-06-01
Data are presented demonstrating a new lithographic vertical-cavity surface-emitting laser (VCSEL) technology, which produces simultaneous mode- and current-confinement only by lithography and epitaxial crystal growth. The devices are grown by solid source molecular beam epitaxy, and have lithographically defined sizes that vary from 3 μm to 20 μm. The lithographic process allows the devices to have high uniformity throughout the wafer and scalability to very small size. The 3 μm device shows a threshold current of 310 μA, the slope efficiency of 0.81 W/A, and the maximum output power of more than 5 mW. The 3 μm device also shows single-mode single-polarization operation without the use of surface grating, and has over 25 dB side-mode-suppression-ratio up to 1 mW of output power. The devices have low thermal resistance due to the elimination of oxide aperture. High reliability is achieved by removal of internal strain caused by the oxide, stress test shows no degradation for the 3 μm device operating at very high injection current level of 142 kA/cm2 for 1000 hours, while at this dive level commercial VCSELs fail rapidly. The lithographic VCSEL technology can lead to manufacture of reliable small size laser diode, which will have application in large area 2-D arrays and low power sensors.
Solar system lithograph set for earth and space science
NASA Technical Reports Server (NTRS)
1995-01-01
A color lithographs of many of the celestial bodies within our solar system are contained in this educational set of materials. Printed on the back of each lithograph is information regarding the particular celestial body. A sheet with information listing NASA resources and electronic resources for education is included.
Lithographically defined porous Ni-carbon nanocomposite supercapacitors.
Xiao, Xiaoyin; Beechem, Thomas; Wheeler, David R; Burckel, D Bruce; Polsky, Ronen
2014-03-07
Ni was deposited onto lithographically-defined conductive three dimensional carbon networks to form asymmetric pseudo-capacitive electrodes. A real capacity of above 500 mF cm(-2), or specific capacitance of ∼2100 F g(-1) near the theoretical value, has been achieved. After a rapid thermal annealing process, amorphous carbon was partially converted into multilayer graphene depending on the annealing temperature and time duration. These annealed Ni-graphene composite structures exhibit enhanced charge transport kinetics relative to un-annealed Ni-carbon scaffolds indicated by a reduction in peak separation from 0.84 V to 0.29 V at a scan rate of 1000 mV s(-1).
NASA Astrophysics Data System (ADS)
Lysaght, Patrick S.; Ybarra, Israel; Sax, Harry; Gupta, Gaurav; West, Michael; Doros, Theodore G.; Beach, James V.; Mello, Jim
2000-06-01
The continued growth of the semiconductor manufacturing industry has been due, in large part, to improved lithographic resolution and overlay across increasingly larger chip areas. Optical lithography continues to be the mainstream technology for the industry with extensions of optical lithography being employed to support 180 nm product and process development. While the industry momentum is behind optical extensions to 130 nm, the key challenge will be maintaining an adequate and affordable process latitude (depth of focus/exposure window) necessary for 10% post-etch critical dimension (CD) control. If the full potential of optical lithography is to be exploited, the current lithographic systems can not be compromised by incoming wafer quality. Impurity specifications of novel Low-k dielectric materials, plating solutions, chemical-mechanical planarization (CMP) slurries, and chemical vapor deposition (CVD) precursors are not well understood and more stringent control measures will be required to meet defect density targets as identified in the National Technology Roadmap for Semiconductors (NTRS). This paper identifies several specific poor quality wafer issues that have been effectively addressed as a result of the introduction of a set of flexible and reliable wafer back surface clean processes developed on the SEZ Spin-Processor 203 configured for processing of 200 mm diameter wafers. Patterned wafers have been back surface etched by means of a novel spin process contamination elimination (SpCE) technique with the wafer suspended by a dynamic nitrogen (N2) flow, device side down, via the Bernoulli effect. Figure 1 illustrates the wafer-chuck orientation within the process chamber during back side etch processing. This paper addresses a number of direct and immediate benefits to the MicraScan IIITM deep-ultraviolet (DUV) step-and-scan system at SEMATECH. These enhancements have resulted from the resolution of three significant problems: (1) back surface particle/residual contamination, (2) wafer flatness, and (3) control of contaminant materials such as copper (Cu). Data associated with the SpCE process, optimized for flatness improvement, particle removal, and Cu contamination control is presented in this paper, as it relates to excessive consumption of the usable depth of focus (UDOF) and comprehensive yield enhancement in photolithography. Additionally, data illustrating a highly effective means of eliminating copper from the wafer backside, bevel/edge, and frontside edge exclusion zone (0.5 mm - 3 mm), is presented. The data, obtained within the framework of standard and experimental copper/low-k device production at SEMATECH, quantifies the benefits of implementing the SEZ SpCE clean operation. Furthermore, this data confirms the feasibility of utilizing existing (non-copper) process equipment in conjunction with the development of copper applications by verifying the reliability and cost effectiveness of SpCE functionality.
NASA Astrophysics Data System (ADS)
Grobman, Warren D.
2002-07-01
Dramatically increasing mask set costs, long-loop design-fabrication iterations, and lithography of unprecedented complexity and cost threaten to disrupt time-accepted IC industry progression as described by Moore"s Law. Practical and cost-effective IC manufacturing below the 100nm technology node presents significant and unique new challenges spanning multiple disciplines and overlapping traditionally separable components of the design-through-chip manufacturing flow. Lithographic and other process complexity is compounded by design, mask, and infrastructure technologies, which do not sufficiently account for increasingly stringent and complex manufacturing issues. Deep subwavelength and atomic-scale process and device physics effects increasingly invade and impact the design flow strongly at a time when the pressures for increased design productivity are escalating at a superlinear rate. Productivity gaps, both upstream in design and downstream in fabrication, are anticipated by many to increase due to dramatic increases in inherent complexity of the design-to-chip equation. Furthermore, the cost of lithographic equipment is increasing at an aggressive compound growth rate so large that we can no longer economically derive the benefit of the increased number of circuits per unit area unless we extend the life of lithographic equipment for more generations, and deeper into the subwavelength regime. Do these trends unambiguously lead to the conclusion that we need a revolution in design and design-process integration to enable the sub-100nm nodes? Or is such a premise similar to other well-known predictions of technology brick walls that never came true?
Indus-2 X-ray lithography beamline for X-ray optics and material science applications
DOE Office of Scientific and Technical Information (OSTI.GOV)
Dhamgaye, V. P., E-mail: vishal@rrcat.gov.in; Lodha, G. S., E-mail: vishal@rrcat.gov.in
2014-04-24
X-ray lithography is an ideal technique by which high aspect ratio and high spatial resolution micro/nano structures are fabricated using X-rays from synchrotron radiation source. The technique has been used for fabricating optics (X-ray, visible and infrared), sensors and actuators, fluidics and photonics. A beamline for X-ray lithography is operational on Indus-2. The beamline offers wide lithographic window from 1-40keV photon energy and wide beam for producing microstructures in polymers upto size ∼100mm × 100mm. X-ray exposures are possible in air, vacuum and He gas environment. The air based exposures enables the X-ray irradiation of resist for lithography and alsomore » irradiation of biological and liquid samples.« less
Lithographer 3 and 2: Naval Rate Training Manual and Nonresident Career Course.
ERIC Educational Resources Information Center
Naval Education and Training Command, Pensacola, FL.
The rate training manual and nonresident career course (RTM/NRCC) form is a self-study package that will enable third class and second class lithographers to fulfill the requirements for that rating. Chapter one provides a brief history of printing and discusses the duties and qualifications of the Navy lithographer. Chapters two through eighteen…
Alternating phase-shifted mask for logic gate levels, design, and mask manufacturing
NASA Astrophysics Data System (ADS)
Liebmann, Lars W.; Graur, Ioana C.; Leipold, William C.; Oberschmidt, James M.; O'Grady, David S.; Regaill, Denis
1999-07-01
While the benefits of alternating phase shifted masks in improving lithographic process windows at increased resolution are well known throughout the lithography community, broad implementation of this potentially powerful technique has been slow due to the inherent complexity of the layout design and mask manufacturing process. This paper will review a project undertaken at IBM's Semiconductor Research and Development Center and Mask Manufacturing and Development facility to understand the technical and logistical issues associated with the application of alternating phase shifted mask technology to the gate level of a full microprocessor chip. The work presented here depicts an important milestone toward integration of alternating phase shifted masks into the manufacturing process by demonstrating an automated design solution and yielding a functional alternating phase shifted mask. The design conversion of the microprocessor gate level to a conjugate twin shifter alternating phase shift layout was accomplished with IBM's internal design system that automatically scaled the design, added required phase regions, and resolved phase conflicts. The subsequent fabrication of a nearly defect free phase shifted mask, as verified by SEM based die to die inspection, highlights the maturity of the alternating phase shifted mask manufacturing process in IBM's internal mask facility. Well defined and recognized challenges in mask inspection and repair remain and the layout of alternating phase shifted masks present a design and data preparation overhead, but the data presented here demonstrate the feasibility of designing and building manufacturing quality alternating phase shifted masks for the gate level of a microprocessor.
NASA Astrophysics Data System (ADS)
Kuo, Hung-Fei; Kao, Guan-Hsuan; Zhu, Liang-Xiu; Hung, Kuo-Shu; Lin, Yu-Hsin
2018-02-01
This study used a digital micromirror device (DMD) to produce point-array patterns and employed a self-developed optical system to define line-and-space patterns on nonplanar substrates. First, field tracing was employed to analyze the aerial images of the lithographic system, which comprised an optical system and the DMD. Multiobjective particle swarm optimization was then applied to determine the spot overlapping rate used. The objective functions were set to minimize linewidth and maximize image log slope, through which the dose of the exposure agent could be effectively controlled and the quality of the nonplanar lithography could be enhanced. Laser beams with 405-nm wavelength were employed as the light source. Silicon substrates coated with photoresist were placed on a nonplanar translation stage. The DMD was used to produce lithographic patterns, during which the parameters were analyzed and optimized. The optimal delay time-sequence combinations were used to scan images of the patterns. Finally, an exposure linewidth of less than 10 μm was successfully achieved using the nonplanar lithographic process.
100-nm gate lithography for double-gate transistors
NASA Astrophysics Data System (ADS)
Krasnoperova, Azalia A.; Zhang, Ying; Babich, Inna V.; Treichler, John; Yoon, Jung H.; Guarini, Kathryn; Solomon, Paul M.
2001-09-01
The double gate field effect transistor (FET) is an exploratory device that promises certain performance advantages compared to traditional CMOS FETs. It can be scaled down further than the traditional devices because of the greater electrostatic control by the gates on the channel (about twice as short a channel length for the same gate oxide thickness), has steeper sub-threshold slope and about double the current for the same width. This paper presents lithographic results for double gate FET's developed at IBM's T. J. Watson Research Center. The device is built on bonded wafers with top and bottom gates self-aligned to each other. The channel is sandwiched between the top and bottom polysilicon gates and the gate length is defined using DUV lithography. An alternating phase shift mask was used to pattern gates with critical dimensions of 75 nm, 100 nm and 125 nm in photoresist. 50 nm gates in photoresist have also been patterned by 20% over-exposure of nominal 100 nm lines. No trim mask was needed because of a specific way the device was laid out. UV110 photoresist from Shipley on AR-3 antireflective layer were used. Process windows, developed and etched patterns are presented.
Using process monitor wafers to understand directed self-assembly defects
NASA Astrophysics Data System (ADS)
Cao, Yi; Her, YoungJun; Delgadillo, Paulina R.; Vandenbroeck, Nadia; Gronheid, Roel; Chan, Boon Teik; Hashimoto, Yukio; Romo, Ainhoa; Somervell, Mark; Nafus, Kathleen; Nealey, Paul F.
2013-03-01
As directed self-assembly (DSA) has gained momentum over the past few years, questions about its application to high volume manufacturing have arisen. One of the major concerns is about the fundamental limits of defectivity that can be attained with the technology. If DSA applications demonstrate defectivity that rivals of traditional lithographic technologies, the pathway to the cost benefits of the technology creates a very compelling case for its large scale implementation. To address this critical question, our team at IMEC has established a process monitor flow to track the defectivity behaviors of an exemplary chemo-epitaxy application for printing line/space patterns. Through establishing this baseline, we have been able to understand both traditional lithographic defect sources in new materials as well as new classes of assembly defects associated with DSA technology. Moreover, we have explored new materials and processing to lower the level of the defectivity baseline. The robustness of the material sets and process is investigated as well. In this paper, we will report the understandings learned from the IMEC DSA process monitor flow.
Large patternable metal nanoparticle sheets by photo/e-beam lithography
NASA Astrophysics Data System (ADS)
Saito, Noboru; Wang, Pangpang; Okamoto, Koichi; Ryuzaki, Sou; Tamada, Kaoru
2017-10-01
Techniques for micro/nano-scale patterning of large metal nanoparticle sheets can potentially be used to realize high-performance photoelectronic devices because the sheets provide greatly enhanced electrical fields around the nanoparticles due to localized surface plasmon resonances. However, no single metal nanoparticle sheet currently exists with sufficient durability for conventional lithographical processes. Here, we report large photo and/or e-beam lithographic patternable metal nanoparticle sheets with improved durability by incorporating molecular cross-linked structures between nanoparticles. The cross-linked structures were easily formed by a one-step chemical reaction; immersing a single nanoparticle sheet consisting of core metals, to which capping molecules ionically bond, in a dithiol ethanol solution. The ligand exchange reaction processes were discussed in detail, and we demonstrated 20 μm wide line and space patterns, and a 170 nm wide line of the silver nanoparticle sheets.
NASA Astrophysics Data System (ADS)
Moers, Marco H. P.; van der Laan, Hans; Zellenrath, Mark; de Boeij, Wim; Beaudry, Neil A.; Cummings, Kevin D.; van Zwol, Adriaan; Brecht, Arthur; Willekers, Rob
2001-09-01
ARTEMISTM (Aberration Ring Test Exposed at Multiple Illumination Settings) is a technique to determine in-situ, full-field, low and high order lens aberrations. In this paper we are analyzing the ARTEMISTM data of PAS5500/750TM DUV Step & Scan systems and its use as a lithographic prediction tool. ARTEMISTM is capable of determining Zernike coefficients up to Z25 with a 3(sigma) reproducibility range from 1.5 to 4.5 nm depending on the aberration type. 3D electric field simulations, that take the extended geometry of the phase shift feature into account, have been used for an improved treatment of the extraction of the spherical Zernike coefficients. Knowledge of the extracted Zernike coefficients allows an accurate prediction of the lithographic performance of the scanner system. This ability is demonstrated for a two bar pattern and an isolation pattern. The RMS difference between the ARTEMISTM-based lithographic prediction and the lithographic measurement is 2.5 nm for the two bar pattern and 3 nm for the isolation pattern. The 3(sigma) reproducibility of the prediction for the two bar pattern is 2.5 nm and 1 nm for the isolation pattern. This is better than the reproducibility of the lithographic measurements themselves.
Rigorous assessment of patterning solution of metal layer in 7 nm technology node
NASA Astrophysics Data System (ADS)
Gao, Weimin; Ciofi, Ivan; Saad, Yves; Matagne, Philippe; Bachmann, Michael; Gillijns, Werner; Lucas, Kevin; Demmerle, Wolfgang; Schmoeller, Thomas
2016-01-01
In a 7 nm node (N7), the logic design requires a critical poly pitch of 42 to 45 nm and a metal 1 (M1) pitch of 28 to 32 nm. Such high-pattern density pushes the 193 immersion lithography solution toward its limit and also brings extremely complex patterning scenarios. The N7 M1 layer may require a self-aligned quadruple patterning (SAQP) with a triple litho-etch (LE3) block process. Therefore, the whole patterning process flow requires multiple exposure+etch+deposition processes and each step introduces a particular impact on the pattern profiles and the topography. In this study, we have successfully integrated a simulation tool that enables emulation of the whole patterning flow with realistic process-dependent three-dimensional (3-D) profile and topology. We use this tool to study the patterning process variations of the N7 M1 layer including the overlay control, the critical dimension uniformity budget, and the lithographic process window (PW). The resulting 3-D pattern structure can be used to optimize the process flow, verify design rules, extract parasitics, and most importantly, simulate the electric field, and identify hot spots for dielectric reliability. As an example application, the maximum electric field at M1 tip-to-tip, which is one of the most critical patterning locations, has been simulated and extracted. The approach helps to investigate the impact of process variations on dielectric reliability. We have also assessed the alternative M1 patterning flow with a single exposure block using extreme ultraviolet lithography (EUVL) and analyzed its advantages compared to the LE3 block approach.
NASA Astrophysics Data System (ADS)
Gambicorti, L.; Piazza, D.; Gerber, M.; Pommerol, A.; Roloff, V.; Ziethe, R.; Zimmermann, C.; Da Deppo, V.; Cremonese, G.; Ficai Veltroni, I.; Marinai, M.; Di Carmine, E.; Bauer, T.; Moebius, P.; Thomas, N.
2016-08-01
A new technique based on photolithographic processes of thin-film optical pass band coatings on a monolithic substrate has been applied to the filters of the Focal Plane Assembly (FPA) of the Colour and Stereo Surface Imaging System (CaSSIS) that will fly onboard of the ExoMars Trace Gas Orbiter to be launched in March 2016 by ESA. The FPA including is one of the spare components of the Simbio-Sys instrument of the Italian Space Agency (ASI) that will fly on ESA's Bepi Colombo mission to Mercury. The detector, developed by Raytheon Vision Systems, is a 2kx2k hybrid Si-PIN array with a 10 μm pixel. The detector is housed within a block and has filters deposited directly on the entrance window. The window is a 1 mm thick monolithic plate of fused silica. The Filter Strip Assembly (FSA) is produced by Optics Balzers Jena GmbH and integrated on the focal plane by Leonardo-Finmeccanica SpA (under TAS-I responsibility). It is based on dielectric multilayer interference coatings, 4 colour bands selected with average in-band transmission greater than 95 percent within wavelength range (400-1100 nm), giving multispectral images on the same detector and thus allows CaSSIS to operate in push-frame mode. The Field of View (FOV) of each colour band on the detector is surrounded by a mask of low reflective chromium (LRC), which also provides with the straylight suppression required (an out-of-band transmission of less than 10-5/nm). The mask has been shown to deal effectively with cross-talk from multiple reflections between the detector surface and the filter. This paper shows the manufacturing and optical properties of the FSA filters and the FPA preliminary on-ground calibration results.
One-step patterning of double tone high contrast and high refractive index inorganic spin-on resist
DOE Office of Scientific and Technical Information (OSTI.GOV)
Zanchetta, E.; Della Giustina, G.; Brusatin, G.
2014-09-14
A direct one-step and low temperature micro-fabrication process, enabling to realize large area totally inorganic TiO₂ micro-patterns from a spin-on resist, is presented. High refractive index structures (up to 2 at 632 nm) without the need for transfer processes have been obtained by mask assisted UV lithography, exploiting photocatalytic titania properties. A distinctive feature not shared by any of the known available resists and boosting the material versatility, is that the system behaves either as a positive or as negative tone resist, depending on the process parameters and on the development chemistry. In order to explain the resist double tonemore » behavior, deep comprehension of the lithographic process parameters optimization and of the resist chemistry and structure evolution during the lithographic process, generally uncommon in literature, is reported. Another striking property of the presented resist is that the negative tone shows a high contrast up to 19, allowing to obtain structures resolution down to 2 μm wide. The presented process and material permit to directly fabricate different titania geometries of great importance for solar cells, photo-catalysis, and photonic crystals applications.« less
Lithographic manufacturing of adaptive optics components
NASA Astrophysics Data System (ADS)
Scott, R. Phillip; Jean, Madison; Johnson, Lee; Gatlin, Ridley; Bronson, Ryan; Milster, Tom; Hart, Michael
2017-09-01
Adaptive optics systems and their laboratory test environments call for a number of unusual optical components. Examples include lenslet arrays, pyramids, and Kolmogorov phase screens. Because of their specialized application, the availability of these parts is generally limited, with high cost and long lead time, which can also significantly drive optical system design. These concerns can be alleviated by a fast and inexpensive method of optical fabrication. To that end, we are exploring direct-write lithographic techniques to manufacture three different custom elements. We report results from a number of prototype devices including 1, 2, and 3 wave Multiple Order Diffractive (MOD) lenslet arrays with 0.75 mm pitch and phase screens with near Kolmogorov structure functions with a Fried length r0 around 1 mm. We also discuss plans to expand our research to include a diffractive pyramid that is smaller, lighter, and more easily manufactured than glass versions presently used in pyramid wavefront sensors. We describe how these components can be produced within the limited dynamic range of the lithographic process, and with a rapid prototyping and manufacturing cycle. We discuss exploratory manufacturing methods, including replication, and potential observing techniques enabled by the ready availability of custom components.
NASA Astrophysics Data System (ADS)
Phan, Khoi A.; Spence, Chris A.; Dakshina-Murthy, S.; Bala, Vidya; Williams, Alvina M.; Strener, Steve; Eandi, Richard D.; Li, Junling; Karklin, Linard
1999-12-01
As advanced process technologies in the wafer fabs push the patterning processes toward lower k1 factor for sub-wavelength resolution printing, reticles are required to use optical proximity correction (OPC) and phase-shifted mask (PSM) for resolution enhancement. For OPC/PSM mask technology, defect printability is one of the major concerns. Current reticle inspection tools available on the market sometimes are not capable of consistently differentiating between an OPC feature and a true random defect. Due to the process complexity and high cost associated with the making of OPC/PSM reticles, it is important for both mask shops and lithography engineers to understand the impact of different defect types and sizes to the printability. Aerial Image Measurement System (AIMS) has been used in the mask shops for a number of years for reticle applications such as aerial image simulation and transmission measurement of repaired defects. The Virtual Stepper System (VSS) provides an alternative method to do defect printability simulation and analysis using reticle images captured by an optical inspection or review system. In this paper, pre- programmed defects and repairs from a Defect Sensitivity Monitor (DSM) reticle with 200 nm minimum features (at 1x) will be studied for printability. The simulated resist lines by AIMS and VSS are both compared to SEM images of resist wafers qualitatively and quantitatively using CD verification.Process window comparison between unrepaired and repaired defects for both good and bad repair cases will be shown. The effect of mask repairs to resist pattern images for the binary mask case will be discussed. AIMS simulation was done at the International Sematech, Virtual stepper simulation at Zygo and resist wafers were processed at AMD-Submicron Development Center using a DUV lithographic process for 0.18 micrometer Logic process technology.
Wafer hot spot identification through advanced photomask characterization techniques
NASA Astrophysics Data System (ADS)
Choi, Yohan; Green, Michael; McMurran, Jeff; Ham, Young; Lin, Howard; Lan, Andy; Yang, Richer; Lung, Mike
2016-10-01
As device manufacturers progress through advanced technology nodes, limitations in standard 1-dimensional (1D) mask Critical Dimension (CD) metrics are becoming apparent. Historically, 1D metrics such as Mean to Target (MTT) and CD Uniformity (CDU) have been adequate for end users to evaluate and predict the mask impact on the wafer process. However, the wafer lithographer's process margin is shrinking at advanced nodes to a point that the classical mask CD metrics are no longer adequate to gauge the mask contribution to wafer process error. For example, wafer CDU error at advanced nodes is impacted by mask factors such as 3-dimensional (3D) effects and mask pattern fidelity on subresolution assist features (SRAFs) used in Optical Proximity Correction (OPC) models of ever-increasing complexity. These items are not quantifiable with the 1D metrology techniques of today. Likewise, the mask maker needs advanced characterization methods in order to optimize the mask process to meet the wafer lithographer's needs. These advanced characterization metrics are what is needed to harmonize mask and wafer processes for enhanced wafer hot spot analysis. In this paper, we study advanced mask pattern characterization techniques and their correlation with modeled wafer performance.
1. Photocopy of lithograph, ca. 1880 (in possession American Catholic ...
1. Photocopy of lithograph, ca. 1880 (in possession American Catholic Historical Society) FRONT AND SIDE ELEVATIONS - St. Francis Xavier's Roman Catholic Church, 2321 Green Street, Philadelphia, Philadelphia County, PA
Inverse Tomo-Lithography for Making Microscopic 3D Parts
NASA Technical Reports Server (NTRS)
White, Victor; Wiberg, Dean
2003-01-01
According to a proposal, basic x-ray lithography would be extended to incorporate a technique, called inverse tomography, that would enable the fabrication of microscopic three-dimensional (3D) objects. The proposed inverse tomo-lithographic process would make it possible to produce complex shaped, submillimeter-sized parts that would be difficult or impossible to make in any other way. Examples of such shapes or parts include tapered helices, paraboloids with axes of different lengths, and even Archimedean screws that could serve as rotors in microturbines. The proposed inverse tomo-lithographic process would be based partly on a prior microfabrication process known by the German acronym LIGA (lithographie, galvanoformung, abformung, which means lithography, electroforming, molding). In LIGA, one generates a precise, high-aspect ratio pattern by exposing a thick, x-ray-sensitive resist material to an x-ray beam through a mask that contains the pattern. One can electrodeposit metal into the developed resist pattern to form a precise metal part, then dissolve the resist to free the metal. Aspect ratios of 100:1 and patterns into resist thicknesses of several millimeters are possible.
Sukhdeo, David S; Nam, Donguk; Kang, Ju-Hyung; Brongersma, Mark L; Saraswat, Krishna C
2015-06-29
Strain engineering has proven to be vital for germanium-based photonics, in particular light emission. However, applying a large permanent biaxial tensile strain to germanium has been a challenge. We present a simple, CMOS-compatible technique to conveniently induce a large, spatially homogenous strain in circular structures patterned within germanium nanomembranes. Our technique works by concentrating and amplifying a pre-existing small strain into a circular region. Biaxial tensile strains as large as 1.11% are observed by Raman spectroscopy and are further confirmed by photoluminescence measurements, which show enhanced and redshifted light emission from the strained germanium. Our technique allows the amount of biaxial strain to be customized lithographically, allowing the bandgaps of different germanium structures to be independently customized in a single mask process.
Semiconductor nanowire thermoelectric materials and devices, and processes for producing same
Lagally, Max G; Evans, Paul G; Ritz, Clark S
2013-09-17
The present invention provides nanowires and nanoribbons that are well suited for use in thermoelectric applications. The nanowires and nanoribbons are characterized by a periodic compositional longitudinal modulation. The nanowires are constructed using lithographic techniques from thin semiconductor membranes, or "nanomembranes."
Semiconductor nanowire thermoelectric materials and devices, and processes for producing same
Lagally, Max G.; Evans, Paul G.; Ritz, Clark S.
2015-11-17
The present invention provides nanowires and nanoribbons that are well suited for use in thermoelectric applications. The nanowires and nanoribbons are characterized by a periodic compositional longitudinal modulation. The nanowires are constructed using lithographic techniques from thin semiconductor membranes, or "nanomembranes."
NASA Astrophysics Data System (ADS)
Bowen, David; Krafft, Charles; Mayergoyz, Isaak D.
2017-05-01
There is strong commercial interest in the ability to fabricate the windings of traditional miniature wire-wound inductive circuit components, such as Ethernet transformers, lithographically. For greater inductance devices, thick cores are required, making the process of embedding the ferrite material within circuit board one of few options for lithographic winding fabrication. In this paper, a non-traditional core shape, suitable for embedding in circuit board, is examined analytically and experimentally; the racetrack shape is two halves of a toroid connected by straight legs. With regard to the high inductance requirements for Ethernet applications (350μH), the racetrack transformer inductance is analytically optimized, determining the optimal physical dimensions. Two sizes of racetrack-core transformers were fabricated and measured. The measured inductance was in reasonable agreement with the analytical prediction, though large variations in material permeability are expected from the mechanical processing of the ferrite. Some of the experimental transformers were observed to satisfy the Ethernet inductance requirement.
Lithographic performance comparison with various RET for 45-nm node with hyper NA
NASA Astrophysics Data System (ADS)
Adachi, Takashi; Inazuki, Yuichi; Sutou, Takanori; Kitahata, Yasuhisa; Morikawa, Yasutaka; Toyama, Nobuhito; Mohri, Hiroshi; Hayashi, Naoya
2006-05-01
In order to realize 45 nm node lithography, strong resolution enhancement technology (RET) and water immersion will be needed. In this research, we discussed about various RET performance comparison for 45 nm node using 3D rigorous simulation. As a candidate, we chose binary mask (BIN), several kinds of attenuated phase-shifting mask (att-PSM) and chrome-less phase-shifting lithography mask (CPL). The printing performance was evaluated and compared for each RET options, after the optimizing illumination conditions, mask structure and optical proximity correction (OPC). The evaluation items of printing performance were CD-DOF, contrast-DOF, conventional ED-window and MEEF, etc. It's expected that effect of mask 3D topography becomes important at 45 nm node, so we argued about not only the case of ideal structures, but also the mask topography error effects. Several kinds of mask topography error were evaluated and we confirmed how these errors affect to printing performance.
Antenna-coupled TES bolometer arrays for CMB polarimetry
NASA Astrophysics Data System (ADS)
Kuo, C. L.; Bock, J. J.; Bonetti, J. A.; Brevik, J.; Chattopadhyay, G.; Day, P. K.; Golwala, S.; Kenyon, M.; Lange, A. E.; LeDuc, H. G.; Nguyen, H.; Ogburn, R. W.; Orlando, A.; Transgrud, A.; Turner, A.; Wang, G.; Zmuidzinas, J.
2008-07-01
We describe the design and performance of polarization selective antenna-coupled TES arrays that will be used in several upcoming Cosmic Microwave Background (CMB) experiments: SPIDER, BICEP-2/SPUD. The fully lithographic polarimeter arrays utilize planar phased-antennas for collimation (F/4 beam) and microstrip filters for band definition (25% bandwidth). These devices demonstrate high optical efficiency, excellent beam shapes, and well-defined spectral bands. The dual-polarization antennas provide well-matched beams and low cross polarization response, both important for high-fidelity polarization measurements. These devices have so far been developed for the 100 GHz and 150 GHz bands, two premier millimeter-wave atmospheric windows for CMB observations. In the near future, the flexible microstrip-coupled architecture can provide photon noise-limited detection for the entire frequency range of the CMBPOL mission. This paper is a summary of the progress we have made since the 2006 SPIE meeting in Orlando, FL.
Rigorous diffraction analysis using geometrical theory of diffraction for future mask technology
NASA Astrophysics Data System (ADS)
Chua, Gek S.; Tay, Cho J.; Quan, Chenggen; Lin, Qunying
2004-05-01
Advanced lithographic techniques such as phase shift masks (PSM) and optical proximity correction (OPC) result in a more complex mask design and technology. In contrast to the binary masks, which have only transparent and nontransparent regions, phase shift masks also take into consideration transparent features with a different optical thickness and a modified phase of the transmitted light. PSM are well-known to show prominent diffraction effects, which cannot be described by the assumption of an infinitely thin mask (Kirchhoff approach) that is used in many commercial photolithography simulators. A correct prediction of sidelobe printability, process windows and linearity of OPC masks require the application of rigorous diffraction theory. The problem of aerial image intensity imbalance through focus with alternating Phase Shift Masks (altPSMs) is performed and compared between a time-domain finite-difference (TDFD) algorithm (TEMPEST) and Geometrical theory of diffraction (GTD). Using GTD, with the solution to the canonical problems, we obtained a relationship between the edge on the mask and the disturbance in image space. The main interest is to develop useful formulations that can be readily applied to solve rigorous diffraction for future mask technology. Analysis of rigorous diffraction effects for altPSMs using GTD approach will be discussed.
NASA Astrophysics Data System (ADS)
Pourteau, Marie-Line; Servin, Isabelle; Lepinay, Kévin; Essomba, Cyrille; Dal'Zotto, Bernard; Pradelles, Jonathan; Lattard, Ludovic; Brandt, Pieter; Wieland, Marco
2016-03-01
The emerging Massively Parallel-Electron Beam Direct Write (MP-EBDW) is an attractive high resolution high throughput lithography technology. As previously shown, Chemically Amplified Resists (CARs) meet process/integration specifications in terms of dose-to-size, resolution, contrast, and energy latitude. However, they are still limited by their line width roughness. To overcome this issue, we tested an alternative advanced non-CAR and showed it brings a substantial gain in sensitivity compared to CAR. We also implemented and assessed in-line post-lithographic treatments for roughness mitigation. For outgassing-reduction purpose, a top-coat layer is added to the total process stack. A new generation top-coat was tested and showed improved printing performances compared to the previous product, especially avoiding dark erosion: SEM cross-section showed a straight pattern profile. A spin-coatable charge dissipation layer based on conductive polyaniline has also been tested for conductivity and lithographic performances, and compatibility experiments revealed that the underlying resist type has to be carefully chosen when using this product. Finally, the Process Of Reference (POR) trilayer stack defined for 5 kV multi-e-beam lithography was successfully etched with well opened and straight patterns, and no lithography-etch bias.
Wieberger, Florian; Kolb, Tristan; Neuber, Christian; Ober, Christopher K; Schmidt, Hans-Werner
2013-04-08
In this article we present several developed and improved combinatorial techniques to optimize processing conditions and material properties of organic thin films. The combinatorial approach allows investigations of multi-variable dependencies and is the perfect tool to investigate organic thin films regarding their high performance purposes. In this context we develop and establish the reliable preparation of gradients of material composition, temperature, exposure, and immersion time. Furthermore we demonstrate the smart application of combinations of composition and processing gradients to create combinatorial libraries. First a binary combinatorial library is created by applying two gradients perpendicular to each other. A third gradient is carried out in very small areas and arranged matrix-like over the entire binary combinatorial library resulting in a ternary combinatorial library. Ternary combinatorial libraries allow identifying precise trends for the optimization of multi-variable dependent processes which is demonstrated on the lithographic patterning process. Here we verify conclusively the strong interaction and thus the interdependency of variables in the preparation and properties of complex organic thin film systems. The established gradient preparation techniques are not limited to lithographic patterning. It is possible to utilize and transfer the reported combinatorial techniques to other multi-variable dependent processes and to investigate and optimize thin film layers and devices for optical, electro-optical, and electronic applications.
14. 1862 LITHOGRAPH SHOWING ST. DAVID'S CHURCH IN WINTER SCENE. ...
14. 1862 LITHOGRAPH SHOWING ST. DAVID'S CHURCH IN WINTER SCENE. Photocopied from George Smith's book, History of Delaware County, Penna., 1862 - St. David's Church (Episcopal), Valley Forge Road (Newtown Township), Wayne, Delaware County, PA
Image based method for aberration measurement of lithographic tools
NASA Astrophysics Data System (ADS)
Xu, Shuang; Tao, Bo; Guo, Yongxing; Li, Gongfa
2018-01-01
Information of lens aberration of lithographic tools is important as it directly affects the intensity distribution in the image plane. Zernike polynomials are commonly used for a mathematical description of lens aberrations. Due to the advantage of lower cost and easier implementation of tools, image based measurement techniques have been widely used. Lithographic tools are typically partially coherent systems that can be described by a bilinear model, which entails time consuming calculations and does not lend a simple and intuitive relationship between lens aberrations and the resulted images. Previous methods for retrieving lens aberrations in such partially coherent systems involve through-focus image measurements and time-consuming iterative algorithms. In this work, we propose a method for aberration measurement in lithographic tools, which only requires measuring two images of intensity distribution. Two linear formulations are derived in matrix forms that directly relate the measured images to the unknown Zernike coefficients. Consequently, an efficient non-iterative solution is obtained.
NASA Astrophysics Data System (ADS)
Huang, W. C.; Lai, C. M.; Luo, B.; Tsai, C. K.; Chih, M. H.; Lai, C. W.; Kuo, C. C.; Liu, R. G.; Lin, H. T.
2006-03-01
Optical proximity correction is the technique of pre-distorting mask layouts so that the printed patterns are as close to the desired shapes as possible. For model-based optical proximity correction, a lithographic model to predict the edge position (contour) of patterns on the wafer after lithographic processing is needed. Generally, segmentation of edges is performed prior to the correction. Pattern edges are dissected into several small segments with corresponding target points. During the correction, the edges are moved back and forth from the initial drawn position, assisted by the lithographic model, to finally settle on the proper positions. When the correction converges, the intensity predicted by the model in every target points hits the model-specific threshold value. Several iterations are required to achieve the convergence and the computation time increases with the increase of the required iterations. An artificial neural network is an information-processing paradigm inspired by biological nervous systems, such as how the brain processes information. It is composed of a large number of highly interconnected processing elements (neurons) working in unison to solve specific problems. A neural network can be a powerful data-modeling tool that is able to capture and represent complex input/output relationships. The network can accurately predict the behavior of a system via the learning procedure. A radial basis function network, a variant of artificial neural network, is an efficient function approximator. In this paper, a radial basis function network was used to build a mapping from the segment characteristics to the edge shift from the drawn position. This network can provide a good initial guess for each segment that OPC has carried out. The good initial guess reduces the required iterations. Consequently, cycle time can be shortened effectively. The optimization of the radial basis function network for this system was practiced by genetic algorithm, which is an artificially intelligent optimization method with a high probability to obtain global optimization. From preliminary results, the required iterations were reduced from 5 to 2 for a simple dumbbell-shape layout.
Dawn Mission to Vesta and Ceres Lithograph
2007-01-01
This artist's lithograph features general information, significant dates, and interesting facts on the backabout asteroid Vesta and dwarf planet Ceres and is part of the Mission Art series from NASA's Dawn mission. http://photojournal.jpl.nasa.gov/catalog/PIA19370
Comprehensive analysis of line-edge and line-width roughness for EUV lithography
NASA Astrophysics Data System (ADS)
Bonam, Ravi; Liu, Chi-Chun; Breton, Mary; Sieg, Stuart; Seshadri, Indira; Saulnier, Nicole; Shearer, Jeffrey; Muthinti, Raja; Patlolla, Raghuveer; Huang, Huai
2017-03-01
Pattern transfer fidelity is always a major challenge for any lithography process and needs continuous improvement. Lithographic processes in semiconductor industry are primarily driven by optical imaging on photosensitive polymeric material (resists). Quality of pattern transfer can be assessed by quantifying multiple parameters such as, feature size uniformity (CD), placement, roughness, sidewall angles etc. Roughness in features primarily corresponds to variation of line edge or line width and has gained considerable significance, particularly due to shrinking feature sizes and variations of features in the same order. This has caused downstream processes (Etch (RIE), Chemical Mechanical Polish (CMP) etc.) to reconsider respective tolerance levels. A very important aspect of this work is relevance of roughness metrology from pattern formation at resist to subsequent processes, particularly electrical validity. A major drawback of current LER/LWR metric (sigma) is its lack of relevance across multiple downstream processes which effects material selection at various unit processes. In this work we present a comprehensive assessment of Line Edge and Line Width Roughness at multiple lithographic transfer processes. To simulate effect of roughness a pattern was designed with periodic jogs on the edges of lines with varying amplitudes and frequencies. There are numerous methodologies proposed to analyze roughness and in this work we apply them to programmed roughness structures to assess each technique's sensitivity. This work also aims to identify a relevant methodology to quantify roughness with relevance across downstream processes.
1. Photocopy of lithograph (from Annual Report of the Supervising ...
1. Photocopy of lithograph (from Annual Report of the Supervising Architect to the Secretary for the Calendar Year Ending December 31, 1888) GENERAL VIEW, SOUTH (FRONT) ELEVATION - Old U.S. Mint, Chestnut & Juniper Streets, Philadelphia, Philadelphia County, PA
NASA Astrophysics Data System (ADS)
Mileham, Jeffrey; Tanaka, Yasushi; Anberg, Doug; Owen, David M.; Lee, Byoung-Ho; Bouche, Eric
2016-03-01
Within the semiconductor lithographic process, alignment control is one of the most critical considerations. In order to realize high device performance, semiconductor technology is approaching the 10 nm design rule, which requires progressively smaller overlay budgets. Simultaneously, structures are expanding in the 3rd dimension, thereby increasing the potential for inter-layer distortion. For these reasons, device patterning is becoming increasingly difficult as the portion of the overlay budget attributed to process-induced variation increases. After lithography, overlay gives valuable feedback to the lithography tool; however overlay measurements typically have limited density, especially at the wafer edge, due to throughput considerations. Moreover, since overlay is measured after lithography, it can only react to, but not predict the process-induced overlay. This study is a joint investigation in a high-volume manufacturing environment of the portion of overlay associated with displacement induced by a single process across many chambers. Displacement measurements are measured by Coherent Gradient Sensing (CGS) interferometry, which generates high-density displacement maps (>3 million points on a 300 mm wafer) such that the stresses induced die-by-die and process-by-process can be tracked in detail. The results indicate the relationship between displacement and overlay shows the ability to forecast overlay values before the lithographic process. Details of the correlation including overlay/displacement range, and lot-to-lot displacement variability are considered.
1. Copy of early 20th Century lithograph looking north showing ...
1. Copy of early 20th Century lithograph looking north showing aerial view of company. Rendering owned by the Crawford Auto- aviation Museum, 10825 East Blvd, Cleveland, Ohio. - Winton Motor Carriage Company, Berea Road & Madison Avenue, Cleveland, Cuyahoga County, OH
Exploring the readiness of EUV photo materials for patterning advanced technology nodes
NASA Astrophysics Data System (ADS)
De Simone, Danilo; Vesters, Yannick; Shehzad, Atif; Vandenberghe, Geert; Foubert, Philippe; Beral, Christophe; Van Den Heuvel, Dieter; Mao, Ming; Lazzarino, Fred
2017-03-01
Imec is currently driving the extreme ultraviolet (EUV) photo material development within the imec material and equipment supplier hub. EUV baseline processes using the ASML NXE3300 full field scanner have been setup for the critical layers of the imec N7 (iN7) BEOL process modules with a resist sensitivity of 35mJ/cm2, 40mJ/cm2 and 60mJ/cm2 for metal, block and vias layer, respectively. A feasibility study on higher sensitivity resists for HVM has been recently conducted looking at 16nm dense line-space at a targeted exposure dose of 20mJ/cm2. Such a study reveals that photoresist formulations with a cost-effective resist sensitivity are feasible today. Moreover, recent advances in enhanced underlayers are further offering novel development opportunities to increase the resist sensitivity. However, line width roughness (LWR) and pattern defectivity at nano scale are the major limiting factors of the lithographic process window and further efforts are needed to reach a HVM maturity level. We will present the results of the photo material screening and we examine in detail the lithography patterning results for the best performing photoresists. We further discuss the fundamental aspects of photo materials from a light-matter interaction standpoint looking at the photo emission yield at the EUV light for different photo materials towards a better understanding of the relation between photon efficiency and patterning performance. Finally, as metal containing resists are becoming part of the EUV material landscape, we also review the manufacturing aspects of a such class of resists looking at metal cross contamination pattern and defectivity on the process equipment.
Study of nanoimprint lithography (NIL) for HVM of memory devices
NASA Astrophysics Data System (ADS)
Kono, Takuya; Hatano, Masayuki; Tokue, Hiroshi; Kobayashi, Kei; Suzuki, Masato; Fukuhara, Kazuya; Asano, Masafumi; Nakasugi, Tetsuro; Choi, Eun Hyuk; Jung, Wooyung
2017-03-01
A low cost alternative lithographic technology is desired to meet the decreasing feature size of semiconductor devices. Nano-imprint lithography (NIL) is one of the candidates for alternative lithographic technologies.[1][2][3] NIL has such advantages as good resolution, critical dimension (CD) uniformity and low line edge roughness (LER). On the other hand, the critical issues of NIL are defectivity, overlay, and throughput. In order to introduce NIL into the HVM, it is necessary to overcome these three challenges simultaneously.[4]-[12] In our previous study, we have reported a dramatic improvement in NIL process defectivity on a pilot line tool, FPA-1100 NZ2. We have described that the NIL process for 2x nm half pitch is getting closer to the target of HVM.[12] In this study, we report the recent evaluation of the NIL process performance to judge the applicability of NIL to memory device fabrications. In detail, the CD uniformity and LER are found to be less than 2nm. The overlay accuracy of the test device is less than 7nm. A defectivity level of below 1pcs./cm2 has been achieved at a throughput of 15 wafers per hour.
Cao, J R; Lee, Po-Tsung; Choi, Sang-Jun; O'Brien, John D; Dapkus, P Daniel
2002-01-01
Lithographic tuning of operating wavelengths in a photonic crystal laser array is demonstrated. The photonic crystal lattice constant is varied by 2 nm between elements of the array, and a wavelength spacing of approximately 4 nm is achieved.
EXPERIMENTS IN LITHOGRAPHY FROM REMOTE SENSOR IMAGERY.
Kidwell, R. H.; McSweeney, J.; Warren, A.; Zang, E.; Vickers, E.
1983-01-01
Imagery from remote sensing systems such as the Landsat multispectral scanner and return beam vidicon, as well as synthetic aperture radar and conventional optical camera systems, contains information at resolutions far in excess of that which can be reproduced by the lithographic printing process. The data often require special handling to produce both standard and special map products. Some conclusions have been drawn regarding processing techniques, procedures for production, and printing limitations.
Semiconductor nanowire thermoelectric materials and devices, and processes for producing same
Lagally, Max G [Madison, WI; Evans, Paul G [Madison, WI; Ritz, Clark S [Middleton, WI
2011-02-15
The present invention provides nanowires and nanoribbons that are well suited for use in thermoelectric applications. The nanowires and nanoribbons are characterized by a periodic longitudinal modulation, which may be a compositional modulation or a strain-induced modulation. The nanowires are constructed using lithographic techniques from thin semiconductor membranes, or "nanomembranes."
Crewe, Albert V.
2000-01-01
Disclosed are lens apparatus in which a beam of charged particlesis brought to a focus by means of a magnetic field, the lens being situated behind the target position. In illustrative embodiments, a lens apparatus is employed in a scanning electron microscopeas the sole lens for high-resolution focusing of an electron beam, and in particular, an electron beam having an accelerating voltage of from about 10 to about 30,000 V. In one embodiment, the lens apparatus comprises an electrically-conducting coil arranged around the axis of the beam and a magnetic pole piece extending along the axis of the beam at least within the space surrounded by the coil. In other embodiments, the lens apparatus comprises a magnetic dipole or virtual magnetic monopole fabricated from a variety of materials, including permanent magnets, superconducting coils, and magnetizable spheres and needles contained within an energy-conducting coil. Multiple-array lens apparatus are also disclosed for simultaneous and/or consecutive imaging of multiple images on single or multiple specimens. The invention further provides apparatus, methods, and devices useful in focusing charged particle beams for lithographic processes.
NASA Astrophysics Data System (ADS)
Mukherjee, Maharaj; Phan, Vinhthuy
2002-07-01
We describe how to generate better Optical Proximity Corrections (OPC) for line-ends and corners by using rounded anchors and serifs. These rounded serifs and anchors can be made smaller in size and shape than the traditional rectilinear anchors and serifs. The smaller size of the serifs tend to have less problems in satisfying mask-rule constraints. They also have less adverse effects on the printability of neighboring shapes. We refer to these rounded anchors and serifs as Mouse-Ears. The rounding is done by circles which are regular octagons with Ortho-45 straight lines. The main idea of this paper stems from the physical description of the lithographic process, which can be conceptualized as a low-pass filter. The low-pass filter eliminates the sharp corners of the feature which are made of high spatial-frequency components and retains the low spatial-frequency components. Since the rounded anchors and serifs have fewer high-frequency components than their rectilinear counterparts they get less deformed in the lithographic process.
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2012-10-23
... and plastic parts coatings; large appliance coatings; offset lithographic printing and letterpress... local air pollution control authorities information that should assist them in determining RACT for VOC... plastic parts coatings; (4) large appliance coatings; (5) offset lithographic printing and letterpress...
Microoptical System And Fabrication Method Therefor
Sweatt, William C.; Christenson, Todd R.
2005-03-15
Microoptical systems with clear aperture of about one millimeter or less are fabricated from a layer of photoresist using a lithographic process to define the optical elements. A deep X-ray source is typically used to expose the photoresist. Exposure and development of the photoresist layer can produce planar, cylindrical, and radially symmetric micro-scale optical elements, comprising lenses, mirrors, apertures, diffractive elements, and prisms, monolithically formed on a common substrate with the mutual optical alignment required to provide the desired system functionality. Optical alignment can be controlled to better than one micron accuracy. Appropriate combinations of structure and materials enable optical designs that include corrections for chromatic and other optical aberrations. The developed photoresist can be used as the basis for a molding operation to produce microoptical systems made of a range of optical materials. Finally, very complex microoptical systems can be made with as few as three lithographic exposures.
Fabricating nanowire devices on diverse substrates by simple transfer-printing methods.
Lee, Chi Hwan; Kim, Dong Rip; Zheng, Xiaolin
2010-06-01
The fabrication of nanowire (NW) devices on diverse substrates is necessary for applications such as flexible electronics, conformable sensors, and transparent solar cells. Although NWs have been fabricated on plastic and glass by lithographic methods, the choice of device substrates is severely limited by the lithographic process temperature and substrate properties. Here we report three new transfer-printing methods for fabricating NW devices on diverse substrates including polydimethylsiloxane, Petri dishes, Kapton tapes, thermal release tapes, and many types of adhesive tapes. These transfer-printing methods rely on the differences in adhesion to transfer NWs, metal films, and devices from weakly adhesive donor substrates to more strongly adhesive receiver substrates. Electrical characterization of fabricated NW devices shows that reliable ohmic contacts are formed between NWs and electrodes. Moreover, we demonstrated that Si NW devices fabricated by the transfer-printing methods are robust piezoresistive stress sensors and temperature sensors with reliable performance.
Microfabricated Segmented-Involute-Foil Regenerator for Stirling Engines
NASA Technical Reports Server (NTRS)
Ibrahim, Mounir; Danila, Daniel; Simon, Terrence; Mantell, Susan; Sun, Liyong; Gedeon, David; Qiu, Songgang; Wood, Gary; Kelly, Kevin; McLean, Jeffrey
2010-01-01
An involute-foil regenerator was designed, microfabricated, and tested in an oscillating-flow test rig. The concept consists of stacked involute-foil nickel disks (see figure) microfabricated via a lithographic process. Test results yielded a performance of about twice that of the 90-percent random-fiber currently used in small Stirling converters. The segmented nature of the involute- foil in both the axial and radial directions increases the strength of the structure relative to wrapped foils. In addition, relative to random-fiber regenerators, the involute-foil has a reduced pressure drop, and is expected to be less susceptible to the release of metal fragments into the working space, thus increasing reliability. The prototype nickel involute-foil regenerator was adequate for testing in an engine with a 650 C hot-end temperature. This is lower than that required by larger engines, and high-temperature alloys are not suited for the lithographic microfabrication approach.
Technology of focus detection for 193nm projection lithographic tool
NASA Astrophysics Data System (ADS)
Di, Chengliang; Yan, Wei; Hu, Song; Xu, Feng; Li, Jinglong
2012-10-01
With the shortening printing wavelength and increasing numerical aperture of lithographic tool, the depth of focus(DOF) sees a rapidly drop down trend, reach a scale of several hundred nanometers while the repeatable accuracy of focusing and leveling must be one-tenth of DOF, approximately several dozen nanometers. For this feature, this article first introduces several focusing technology, Obtained the advantages and disadvantages of various methods by comparing. Then get the accuracy of dual-grating focusing method through theoretical calculation. And the dual-grating focusing method based on photoelastic modulation is divided into coarse focusing and precise focusing method to analyze, establishing image processing model of coarse focusing and photoelastic modulation model of accurate focusing. Finally, focusing algorithm is simulated with MATLAB. In conclusion dual-grating focusing method shows high precision, high efficiency and non-contact measurement of the focal plane, meeting the demands of focusing in 193nm projection lithography.
Microoptical system and fabrication method therefor
Sweatt, William C.; Christenson, Todd R.
2003-07-08
Microoptical systems with clear aperture of about one millimeter or less are fabricated from a layer of photoresist using a lithographic process to define the optical elements. A deep X-ray source is typically used to expose the photoresist. Exposure and development of the photoresist layer can produce planar, cylindrical, and radially symmetric micro-scale optical elements, comprising lenses, mirrors, apertures, diffractive elements, and prisms, monolithically formed on a common substrate with the mutual optical alignment required to provide the desired system functionality. Optical alignment can be controlled to better than one micron accuracy. Appropriate combinations of structure and materials enable optical designs that include corrections for chromatic and other optical aberrations. The developed photoresist can be used as the basis for a molding operation to produce microoptical systems made of a range of optical materials. Finally, very complex microoptical systems can be made with as few as three lithographic exposures.
Lithographically-generated 3D lamella layers and their structural color
NASA Astrophysics Data System (ADS)
Zhang, Sichao; Chen, Yifang; Lu, Bingrui; Liu, Jianpeng; Shao, Jinhai; Xu, Chen
2016-04-01
Inspired by the structural color from the multilayer nanophotonic structures in Morpho butterfly wing scales, 3D lamellae layers in dielectric polymers (polymethyl methacrylate, PMMA) with n ~ 1.5 were designed and fabricated by standard top-down electron beam lithography with one-step exposure followed by an alternating development/dissolution process of PMMA/LOR (lift-off resist) multilayers. This work offers direct proof of the structural blue/green color via lithographically-replicated PMMA/air multilayers, analogous to those in real Morpho butterfly wings. The success of nanolithography in this work for the 3D lamellae structures in dielectric polymers not only enables us to gain deeper insight into the mysterious blue color of the Morpho butterfly wings, but also breaks through the bottleneck in technical development toward broad applications in gas/liquid sensors, 3D meta-materials, coloring media, and infrared imaging devices, etc.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Yap, K.P.; Lamontagne, B.; Delage, A.
2006-05-15
We present a technique to lithographically define and fabricate all required optical facets on a silicon-on-insulator photonic integrated circuit by an inductively coupled plasma etch process. This technique offers 1 {mu}m positioning accuracy of the facets at any location within the chip and eliminates the need of polishing. Facet fabrication consists of two separate steps to ensure sidewall verticality and minimize attack on the end surfaces of the waveguides. Protection of the waveguides by a thermally evaporated aluminum layer before the 40-70 {mu}m deep optical facet etching has been proven essential in assuring the facet smoothness and integrity. Both scanningmore » electron microscopy analysis and optical measurement results show that the quality of the facets prepared by this technique is comparable to the conventional facets prepared by polishing.« less
Federal Register 2010, 2011, 2012, 2013, 2014
2012-05-14
... Technology Transfer and Advancement Act of 1995 (15 U.S.C. 272 note) because application of those... Technology (RACT) for sources covered by EPA's Control Techniques Guidelines (CTG) for offset lithographic..., unless the comment includes information claimed to be Confidential Business Information (CBI) or other...
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... ENVIRONMENTAL PROTECTION AGENCY 40 CFR Part 52 [EPA-R03-OAR-2012-0042; FRL-9702-2] Approval and... Printing Regulations AGENCY: Environmental Protection Agency (EPA). ACTION: Final rule. SUMMARY: EPA is... Technology (RACT) for sources covered by EPA's Control Techniques Guidelines (CTG) for offset lithographic...
Cleaning process for EUV optical substrates
Weber, Frank J.; Spiller, Eberhard A.
1999-01-01
A cleaning process for surfaces with very demanding cleanliness requirements, such as extreme-ultraviolet (EUV) optical substrates. Proper cleaning of optical substrates prior to applying reflective coatings thereon is very critical in the fabrication of the reflective optics used in EUV lithographic systems, for example. The cleaning process involves ultrasonic cleaning in acetone, methanol, and a pH neutral soap, such as FL-70, followed by rinsing in de-ionized water and drying with dry filtered nitrogen in conjunction with a spin-rinse.
Selection Process for New Windows | Efficient Windows Collaborative
Foundry Foundry New Construction Windows Window Selection Tool Selection Process Design Guidance Installation Replacement Windows Window Selection Tool Assessing Options Selection Process Design Guidance Installation Understanding Windows Benefits Design Considerations Measuring Performance Performance Standards
Selection Process for Replacement Windows | Efficient Windows Collaborative
Foundry Foundry New Construction Windows Window Selection Tool Selection Process Design Guidance Installation Replacement Windows Window Selection Tool Assessing Options Selection Process Design Guidance Installation Understanding Windows Benefits Design Considerations Measuring Performance Performance Standards
Process Flow Features as a Host-Based Event Knowledge Representation
2012-06-14
an executing process during a window of time called a process flow. Process flows are calculated from key process data structures extracted from...for Cluster 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 4.9. Davies- Boldin Dunn Index Sliding Window 5 on Windows 7...82 4.10. Davies- Boldin Dunn Index Sliding Window 10 on Windows 7 . 83 4.11. Davies- Boldin Dunn Index Sliding Window 20 on Windows 7 . 83 ix List of
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... wood paneling coating facilities. Sixth, Rule 15A NCAC 02D .0961, ``Offset Lithographic Printing and Letterpress Printing'' was adopted to control VOC emissions from heatset inks, fountain solution and cleaning materials used in offset lithographic printing operations, as well as VOC emissions from heatset inks used...
Lithographically defined microporous carbon-composite structures
Burckel, David Bruce; Washburn, Cody M.; Lambert, Timothy N.; Finnegan, Patrick Sean; Wheeler, David R.
2016-12-06
A microporous carbon scaffold is produced by lithographically patterning a carbon-containing photoresist, followed by pyrolysis of the developed resist structure. Prior to exposure, the photoresist is loaded with a nanoparticulate material. After pyrolysis, the nanonparticulate material is dispersed in, and intimately mixed with, the carbonaceous material of the scaffold, thereby yielding a carbon composite structure.
An Analysis of the Lithographic Printing Occupation.
ERIC Educational Resources Information Center
Innis, Gene A.; And Others
The general purpose of the occupational analysis is to provide workable, basic information dealing with the many and varied duties performed in the lithographic printing occupation. The document opens with a brief introduction followed by a job description. The bulk of the document is presented in table form. Nine duties are broken down into a…
All-back-Schottky-contact thin-film photovoltaics
NASA Astrophysics Data System (ADS)
Nardone, Marco
2016-02-01
The concept of All-Back-Schottky-Contact (ABSC) thin-film photovoltaic (TFPV) devices is introduced and evaluated using 2D numerical simulation. Reach-through Schottky junctions due to two metals of different work functions in an alternating, side-by-side pattern along the non-illuminated side generate the requisite built-in field. It is shown that our simulation method quantitatively describes existing data for a recently demonstrated heterojunction thin-film cell with interdigitated back contacts (IBCs) of one metal type. That model is extended to investigate the performance of ABSC devices with bimetallic IBCs within a pertinent parameter space. Our calculations indicate that 20% efficiency is achievable with micron-scale features and sufficient surface passivation. Bimetallic, micron-scale IBCs are readily fabricated using photo-lithographic techniques and the ABSC design allows for optically transparent surface passivation layers that need not be electrically conductive. The key advantages of the ABSC-TFPV architecture are that window layers, buffer layers, heterojunctions, and module scribing are not required because both contacts are located on the back of the device.
The lithographer's dilemma: shrinking without breaking the bank
NASA Astrophysics Data System (ADS)
Levinson, Harry J.
2013-10-01
It can no longer be assumed that the lithographic scaling which has previously driven Moore's Law will lead in the future to reduced cost per transistor. Until recently, higher prices for lithography tools were offset by improvements in scanner productivity. The necessity of using double patterning to extend scaling beyond the single exposure resolution limit of optical lithography has resulted in a sharp increase in the cost of patterning a critical construction layer that has not been offset by improvements in exposure tool productivity. Double patterning has also substantially increased the cost of mask sets. EUV lithography represents a single patterning option, but the combination of very high exposure tools prices, moderate throughput, high maintenance costs, and expensive mask blanks makes this a solution more expensive than optical double patterning but less expensive than triple patterning. Directed self-assembly (DSA) could potentially improve wafer costs, but this technology currently is immature. There are also design layout and process integration issues associated with DSA that need to be solved in order to obtain full benefit from tighter pitches. There are many approaches for improving the cost effectiveness of lithography. Innovative double patterning schemes lead to smaller die. EUV lithography productivity can be improved with higher power light sources and improved reliability. There are many technical and business challenges for extending EUV lithography to higher numerical apertures. Efficient contact hole and cut mask solutions are needed, as well as very tight overlay control, regardless of lithographic solution.
1. Photocopy of lithograph (from Annual Report of the Supervising ...
1. Photocopy of lithograph (from Annual Report of the Supervising Architect to the Secretary of the Treasury for the Calender Year Ending December 31, 1888. Wahsington, D.C.: Government Printing Office, 1889. Will A. Freret, Supervising Architect) THREE-QUARTER VIEW OF FRONT ELEVATION (RIVERSIDE), FLOOR PLANS - U. S. Courthouse & Post Office, Binghamton, Broome County, NY
Process development for single-crystal silicon solar cells
NASA Astrophysics Data System (ADS)
Bohra, Mihir H.
Solar energy is a viable, rapidly growing and an important renewable alternative to other sources of energy generation because of its abundant supply and low manufacturing cost. Silicon still remains the major contributor for manufacturing solar cells accounting for 80% of the market share. Of this, single-crystal solar cells account for half of the share. Laboratory cells have demonstrated 25% efficiency; however, commercial cells have efficiencies of 16% - 20% resulting from a focus on implementation processes geared to rapid throughput and low cost, thereby reducing the energy pay-back time. An example would be the use of metal pastes which dissolve the dielectric during the firing process as opposed to lithographically defined contacts. With current trends of single-crystal silicon photovoltaic (PV) module prices down to 0.60/W, almost all other PV technologies are challenged to remain cost competitive. This presents a unique opportunity in revisiting the PV cell fabrication process and incorporating moderately more expensive IC process practices into PV manufacturing. While they may drive the cost toward a 1/W benchmark, there is substantial room to "experiment", leading to higher efficiencies which will help maintain the overall system cost. This work entails a turn-key process designed to provide a platform for rapid evaluation of novel materials and processes. A two-step lithographic process yielding a baseline 11% - 13% efficient cell is described. Results of three studies have shown improvements in solar cell output parameters due to the inclusion of a back-surface field implant, a higher emitter doping and also an additional RCA Clean.
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Kang, Da-Young; Moon, Jun Hyuk
2014-01-01
Supercapacitors that exhibit long cycle lives and fast charge/discharge rates are a promising energy-storage technology for next-generation mobile or wearable electronic systems. A great challenge facing the fabrication of ultrathin supercapacitor components, specifically their porous electrodes, is whether such components can be integrated with the fabrication of electronic devices, i.e., semiconductor fabrication processes. Here, we introduce the lithographic fabrication of micrometre-thick, submicrometre-pore-patterned carbon for supercapacitor electrodes. The pore patterns designed by multi-beam interference lithography and direct carbonisation of the photoresist pattern produced pore-patterned carbon films. A facile doping process was subsequently employed to introduce nitrogen atoms into the carbon, which was intended to further enhance the carbon's capacitive properties. Specifically, during these fabrication steps, we developed an approach that uses a supporting shell on the surface of the pore patterns to maintain their structural integrity. The nitrogen-doped, pore-patterned carbon electrodes exhibited an areal specific capacitance of 32.7 mF/cm2 at 0.5 mA/cm2 when used as supercapacitor electrodes, which is approximately 20 times greater than that of commercially available MWCNT films measured under the same conditions. PMID:24953307
A new fabrication technique for complex refractive micro-optical systems
NASA Astrophysics Data System (ADS)
Tormen, Massimo; Carpentiero, Alessandro; Ferrari, Enrico; Cabrini, Stefano; Cojoc, Dan; Di Fabrizio, Enzo
2006-01-01
We present a new method that allows to fabricate structures with tightly controlled three-dimensional profiles in the 10 nm to 100 μm scale range. This consists of a sequence of lithographic steps such as Electron Beam (EB) or Focused Ion Beam (FIB) lithography, alternated with isotropic wet etching processes performed on a quartz substrate. Morphological characterization by SEM and AFM shows that 3D structures with very accurate shape control and nanometer scale surface roughness can be realized. Quartz templates have been employed as complex system of micromirrors after metal coating of the patterned surface or used as stamps in nanoimprint, hot embossing or casting processes to shape complex plastic elements. Compared to other 3D micro and nanostructuring methods, in which a hard material is directly "sculptured" by energetic beams, our technique requires a much less intensive use of expensive lithographic equipments, for comparable volumes of structured material, resulting in dramatic increase of throughput. Refractive micro-optical elements have been fabricated and characterized in transmission and reflection modes with white and monochromatic light. The elements produce a distribution of sharp focal spots and lines in the three dimensional space, opening the route for applications of image reconstruction based on refractive optics.
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Hybrid strategies for nanolithography and chemical patterning
NASA Astrophysics Data System (ADS)
Srinivasan, Charan
Remarkable technological advances in photolithography have extended patterning to the sub-50-nm regime. However, because photolithography is a top-down approach, it faces substantial technological and economic challenges in maintaining the downward scaling trends of feature sizes below 30 nm. Concurrently, fundamental research on chemical self-assembly has enabled the path to access molecular length scales. The key to the success of photolithography is its inherent economies of scale, which justify the large capital investment for its implementation. In this thesis research, top-down and bottom-up approaches have been combined synergistically, and these hybrid strategies have been employed in applications that do not have the economies of scale found in semiconductor chip manufacturing. The specific instances of techniques developed here include molecular-ruler lithography and a series of nanoscale chemical patterning methods. Molecular-ruler lithography utilizes self-assembled multilayered films as a sidewall spacer on initial photolithographically patterned gold features (parent) to place a second-generation feature (daughter) in precise proximity to the parent. The parent-daughter separation, which is on the nanometer length scale, is defined by the thickness of the molecular-ruler resist. Analogous to protocols followed in industry to evaluate lithographic performance, electrical test-pad structures were designed to interrogate the nanostructures patterned by molecular-ruler nanolithography, failure modes creating electrical shorts were mapped to each lithographic step, and subsequent lithographic optimization was performed to pattern nanoscale devices with excellent electrical performance. The optimized lithographic processes were applied to generate nanoscale devices such as nanowires and thin-film transistors (TFTs). Metallic nanowires were patterned by depositing a tertiary generation material in the nanogap and surrounding micron-scale regions, and then chemically removing the parent and daughter structures selectively. This processing was also performed on silicon-on-insulator substrates and the metallic nanowires were used as a hard mask to transfer the pattern to the single crystalline silicon epilayer resulting in a quaternary generation structure of single-crystalline silicon nanowire field-effect transistors. Additionally, the proof of concept for patterning nanoscale pentacene TFTs utilizing molecular-rulers was demonstrated. For applications in sub-100-nm lithography, the limitations on the relative heights of parent and daughter structures were overcome and processes to integrate molecular-ruler nanolithography with existing complementary metal-oxide-semiconductor (CMOS) processing were developed. Pattern transfer to underlying SiO2 substrates has opened a new avenue of opportunities to apply these nanostructures in nanofluidics and in non-traditional lithography such as imprint lithography. Additionally, the molecular-ruler process has been shown to increase the spatial density of features created by high-resolution techniques such as electron-beam lithography. A limitation of photolithography is its inability to pattern chemical functionality on surfaces. To overcome this limitation, two techniques were developed to extend nanolithography beyond semiconductors and apply them to patterning of self-assembled monolayers. First, a novel bilayer resist was devised to protect and to pattern chemical functionality on surfaces by being able to withstand conditions necessary for both chemical self-assembly and photooxidation of the Au-S bond while not disrupting the preexisting SAM. In addition to photolithography, soft-lithographic approaches such as microcontact printing are often used to create chemical patterns. In this work, a technique for the creation of chemical patterns of inserted molecules with dilute coverages (≤10%) was implemented. As part of the research in chemical patterning, a method for characterizing chemical patterns using scanning electron microscopy has been developed. These tools are the standard for metrology in nanolithography, and thus are readily accessible as our advances in chemical patterning are adopted and applied by the lithography community.
Lithographically defined microporous carbon structures
Burckel, David Bruce; Washburn, Cody M.; Polsky, Ronen; Brozik, Susan M.; Wheeler, David R.
2013-01-08
A lithographic method is used to fabricate porous carbon structures that can provide electrochemical electrodes having high surface area with uniform and controllable dimensions, providing enormous flexibility to tailor the electrodes toward specific applications. Metal nanoparticles deposited on the surface of the porous carbon electrodes exhibit ultra small dimensions with uniform size distribution. The resulting electrodes are rugged, electrically conductive and show excellent electrochemical behavior.
Yi, Chongyue; Su, Man-Nung; Dongare, Pratiksha D; Chakraborty, Debadi; Cai, Yi-Yu; Marolf, David M; Kress, Rachael N; Ostovar, Behnaz; Tauzin, Lawrence J; Wen, Fangfang; Chang, Wei-Shun; Jones, Matthew R; Sader, John E; Halas, Naomi J; Link, Stephan
2018-06-13
The study of acoustic vibrations in nanoparticles provides unique and unparalleled insight into their mechanical properties. Electron-beam lithography of nanostructures allows precise manipulation of their acoustic vibration frequencies through control of nanoscale morphology. However, the dissipation of acoustic vibrations in this important class of nanostructures has not yet been examined. Here we report, using single-particle ultrafast transient extinction spectroscopy, the intrinsic damping dynamics in lithographically fabricated plasmonic nanostructures. We find that in stark contrast to chemically synthesized, monocrystalline nanoparticles, acoustic energy dissipation in lithographically fabricated nanostructures is solely dominated by intrinsic damping. A quality factor of Q = 11.3 ± 2.5 is observed for all 147 nanostructures, regardless of size, geometry, frequency, surface adhesion, and mode. This result indicates that the complex Young's modulus of this material is independent of frequency with its imaginary component being approximately 11 times smaller than its real part. Substrate-mediated acoustic vibration damping is strongly suppressed, despite strong binding between the glass substrate and Au nanostructures. We anticipate that these results, characterizing the optomechanical properties of lithographically fabricated metal nanostructures, will help inform their design for applications such as photoacoustic imaging agents, high-frequency resonators, and ultrafast optical switches.
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NASA Astrophysics Data System (ADS)
Kreider, Kenneth G.; DeWitt, David P.; Fowler, Joel B.; Proctor, James E.; Kimes, William A.; Ripple, Dean C.; Tsai, Benjamin K.
2004-04-01
Recent studies on dynamic temperature profiling and lithographic performance modeling of the post-exposure bake (PEB) process have demonstrated that the rate of heating and cooling may have an important influence on resist lithographic response. Measuring the transient surface temperature during the heating or cooling process with such accuracy can only be assured if the sensors embedded in or attached to the test wafer do not affect the temperature distribution in the bare wafer. In this paper we report on an experimental and analytical study to compare the transient response of embedded platinum resistance thermometer (PRT) sensors with surface-deposited, thin-film thermocouples (TFTC). The TFTCs on silicon wafers have been developed at NIST to measure wafer temperatures in other semiconductor thermal processes. Experiments are performed on a test bed built from a commercial, fab-qualified module with hot and chill plates using wafers that have been instrumented with calibrated type-E (NiCr/CuNi) TFTCs and commercial PRTs. Time constants were determined from an energy-balance analysis fitting the temperature-time derivative to the wafer temperature during the heating and cooling processes. The time constants for instrumented wafers ranged from 4.6 s to 5.1 s on heating for both the TFTC and PRT sensors, with an average difference less than 0.1 s between the TFTCs and PRTs and slightly greater differences on cooling.
Multilayer block copolymer meshes by orthogonal self-assembly
Tavakkoli K. G., Amir; Nicaise, Samuel M.; Gadelrab, Karim R.; Alexander-Katz, Alfredo; Ross, Caroline A.; Berggren, Karl K.
2016-01-01
Continued scaling-down of lithographic-pattern feature sizes has brought templated self-assembly of block copolymers (BCPs) into the forefront of nanofabrication research. Technologies now exist that facilitate significant control over otherwise unorganized assembly of BCP microdomains to form both long-range and locally complex monolayer patterns. In contrast, the extension of this control into multilayers or 3D structures of BCP microdomains remains limited, despite the possible technological applications in next-generation devices. Here, we develop and analyse an orthogonal self-assembly method in which multiple layers of distinct-molecular-weight BCPs naturally produce nanomesh structures of cylindrical microdomains without requiring layer-by-layer alignment or high-resolution lithographic templating. The mechanisms for orthogonal self-assembly are investigated with both experiment and simulation, and we determine that the control over height and chemical preference of templates are critical process parameters. The method is employed to produce nanomeshes with the shapes of circles and Y-intersections, and is extended to produce three layers of orthogonally oriented cylinders. PMID:26796218
Nanoimprint of a 3D structure on an optical fiber for light wavefront manipulation.
Calafiore, Giuseppe; Koshelev, Alexander; Allen, Frances I; Dhuey, Scott; Sassolini, Simone; Wong, Edward; Lum, Paul; Munechika, Keiko; Cabrini, Stefano
2016-09-16
Integration of complex photonic structures onto optical fiber facets enables powerful platforms with unprecedented optical functionalities. Conventional nanofabrication technologies, however, do not permit viable integration of complex photonic devices onto optical fibers owing to their low throughput and high cost. In this paper we report the fabrication of a three-dimensional structure achieved by direct nanoimprint lithography on the facet of an optical fiber. Nanoimprint processes and tools were specifically developed to enable a high lithographic accuracy and coaxial alignment of the optical device with respect to the fiber core. To demonstrate the capability of this new approach, a 3D beam splitter has been designed, imprinted and optically characterized. Scanning electron microscopy and optical measurements confirmed the good lithographic capabilities of the proposed approach as well as the desired optical performance of the imprinted structure. The inexpensive solution presented here should enable advancements in areas such as integrated optics and sensing, achieving enhanced portability and versatility of fiber optic components.
Ma, Mingying; Wang, Xiangzhao; Wang, Fan
2006-11-10
The degradation of image quality caused by aberrations of projection optics in lithographic tools is a serious problem in optical lithography. We propose what we believe to be a novel technique for measuring aberrations of projection optics based on two-beam interference theory. By utilizing the partial coherent imaging theory, a novel model that accurately characterizes the relative image displacement of a fine grating pattern to a large pattern induced by aberrations is derived. Both even and odd aberrations are extracted independently from the relative image displacements of the printed patterns by two-beam interference imaging of the zeroth and positive first orders. The simulation results show that by using this technique we can measure the aberrations present in the lithographic tool with higher accuracy.
EUV lithographic radiation grafting of thermo-responsive hydrogel nanostructures
NASA Astrophysics Data System (ADS)
Farquet, Patrick; Padeste, Celestino; Solak, Harun H.; Gürsel, Selmiye Alkan; Scherer, Günther G.; Wokaun, Alexander
2007-12-01
Nanostructures of the thermoresponsive poly( N-isopropyl acrylamide) (PNIPAAm) and of PNIPAAm-block-poly(acrylic acid) copolymers were produced on poly(tetrafluoroethylene-co-ethyelene) (ETFE) films using extreme ultraviolet (EUV) lithographic exposure with subsequent graft-polymerization. The phase transition of PNIPAAm nanostructures at the low critical solution temperature (LCST) at 32 °C was imaged by atomic force microscopy (AFM) phase contrast measurements in pure water. Results show a higher phase contrast for samples measured below the LCST temperature than for samples above the LCST, proving that the soft PNIPAAm hydrogel transforms into a much more compact conformation above the LCST. EUV lithographic exposures were combined with the reversible addition-fragment chain transfer (RAFT)-mediated polymerization using cyanoisopropyl dithiobenzoate (CPDB) as chain transfer agent to synthesize PNIPAAm block-copolymer nanostructures.
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Photon antibunching from a single lithographically defined InGaAs/GaAs quantum dot.
Verma, V B; Stevens, Martin J; Silverman, K L; Dias, N L; Garg, A; Coleman, J J; Mirin, R P
2011-02-28
We demonstrate photon antibunching from a single lithographically defined quantum dot fabricated by electron beam lithography, wet chemical etching, and overgrowth of the barrier layers by metalorganic chemical vapor deposition. Measurement of the second-order autocorrelation function indicates g(2)(0)=0.395±0.030, below the 0.5 limit necessary for classification as a single photon source.
Computer-aided engineering system for design of sequence arrays and lithographic masks
Hubbell, Earl A.; Lipshutz, Robert J.; Morris, Macdonald S.; Winkler, James L.
1997-01-01
An improved set of computer tools for forming arrays. According to one aspect of the invention, a computer system is used to select probes and design the layout of an array of DNA or other polymers with certain beneficial characteristics. According to another aspect of the invention, a computer system uses chip design files to design and/or generate lithographic masks.
ERIC Educational Resources Information Center
Palczewski, Catherine H.
2005-01-01
In 1909, at the height of the woman suffrage controversy and during the golden age of postcards, the Dunston-Weiler Lithograph Company of New York produced a twelve-card set of full-color lithographic cartoon postcards opposing woman suffrage. The postcard images reflect, and depart from, verbal arguments concerning woman suffrage prevalent during…
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NASA Astrophysics Data System (ADS)
Carpenter, Corinne L.; Delaney, Kris T.; Laachi, Nabil; Fredrickson, Glenn H.
2015-03-01
Directed self-assembly (DSA) of block copolymers has attracted attention for its use as a simple, cost- effective patterning tool for creating vertical interconnect access (VIA) channels in nanoelectronic devices.1, 2 This technique supplements existing lithographic technologies to allow for the creation of high-resolution cylindrical holes whose diameter and placement can be precisely controlled. In this study, we use self-consistent field theory (SCFT) simulations to investigate the equilibrium configurations of under-filled DSA systems with air-polymer interactions. We report on a series of SCFT simulations of our three species (PMMA-b-PS diblock and air) model in cylindrical confinement to explore the role of template diameter, under-fill fraction (i.e. volume fraction of air), air-polymer surface interaction and polymer-side wall/substrate interactions on equilibrium morphologies in an under-filled template with a free top surface. We identify parameters and system configurations where a meniscus appears and explore cases with PMMA-attractive, PS-attractive, and all-neutral walls to understand the effects of wall properties on meniscus geometry and DSA morphology. An important outcome is an understanding of the parameters that control the contact angle of the meniscus with the wall, as it is one of the simplest quantitative measures of the meniscus shape. Ultimately, we seek to identify DSA formulations, templates, and surface treatments with predictable central cylinder diameter and a shallow contact angle, as these factors would facilitate broad process windows and ease of manufacturing.
Computer-aided engineering system for design of sequence arrays and lithographic masks
Hubbell, Earl A.; Morris, MacDonald S.; Winkler, James L.
1999-01-05
An improved set of computer tools for forming arrays. According to one aspect of the invention, a computer system (100) is used to select probes and design the layout of an array of DNA or other polymers with certain beneficial characteristics. According to another aspect of the invention, a computer system uses chip design files (104) to design and/or generate lithographic masks (110).
Computer-aided engineering system for design of sequence arrays and lithographic masks
Hubbell, Earl A.; Morris, MacDonald S.; Winkler, James L.
1996-01-01
An improved set of computer tools for forming arrays. According to one aspect of the invention, a computer system (100) is used to select probes and design the layout of an array of DNA or other polymers with certain beneficial characteristics. According to another aspect of the invention, a computer system uses chip design files (104) to design and/or generate lithographic masks (110).
Computer-aided engineering system for design of sequence arrays and lithographic masks
Hubbell, E.A.; Morris, M.S.; Winkler, J.L.
1999-01-05
An improved set of computer tools for forming arrays is disclosed. According to one aspect of the invention, a computer system is used to select probes and design the layout of an array of DNA or other polymers with certain beneficial characteristics. According to another aspect of the invention, a computer system uses chip design files to design and/or generate lithographic masks. 14 figs.
Computer-aided engineering system for design of sequence arrays and lithographic masks
Hubbell, E.A.; Lipshutz, R.J.; Morris, M.S.; Winkler, J.L.
1997-01-14
An improved set of computer tools for forming arrays is disclosed. According to one aspect of the invention, a computer system is used to select probes and design the layout of an array of DNA or other polymers with certain beneficial characteristics. According to another aspect of the invention, a computer system uses chip design files to design and/or generate lithographic masks. 14 figs.
Computer-aided engineering system for design of sequence arrays and lithographic masks
Hubbell, E.A.; Morris, M.S.; Winkler, J.L.
1996-11-05
An improved set of computer tools for forming arrays is disclosed. According to one aspect of the invention, a computer system is used to select probes and design the layout of an array of DNA or other polymers with certain beneficial characteristics. According to another aspect of the invention, a computer system uses chip design files to design and/or generate lithographic masks. 14 figs.
Omnidirectional, broadband light absorption using large-area, ultrathin lossy metallic film coatings
NASA Astrophysics Data System (ADS)
Li, Zhongyang; Palacios, Edgar; Butun, Serkan; Kocer, Hasan; Aydin, Koray
2015-10-01
Resonant absorbers based on nanostructured materials are promising for variety of applications including optical filters, thermophotovoltaics, thermal emitters, and hot-electron collection. One of the significant challenges for such micro/nanoscale featured medium or surface, however, is costly lithographic processes for structural patterning which restricted from industrial production of complex designs. Here, we demonstrate lithography-free, broadband, polarization-independent optical absorbers based on a three-layer ultrathin film composed of subwavelength chromium (Cr) and oxide film coatings. We have measured almost perfect absorption as high as 99.5% across the entire visible regime and beyond (400-800 nm). In addition to near-ideal absorption, our absorbers exhibit omnidirectional independence for incidence angle over ±60 degrees. Broadband absorbers introduced in this study perform better than nanostructured plasmonic absorber counterparts in terms of bandwidth, polarization and angle independence. Improvements of such “blackbody” samples based on uniform thin-film coatings is attributed to extremely low quality factor of asymmetric highly-lossy Fabry-Perot cavities. Such broadband absorber designs are ultrathin compared to carbon nanotube based black materials, and does not require lithographic processes. This demonstration redirects the broadband super absorber design to extreme simplicity, higher performance and cost effective manufacturing convenience for practical industrial production.
Three-dimensional invisibility cloaks functioning at terahertz frequencies
NASA Astrophysics Data System (ADS)
Cao, Wei; Zhou, Fan; Liang, Dachuan; Gu, Jianqiang; Han, Jiaguang; Sun, Cheng; Zhang, Weili
2014-05-01
Quasi-three-dimensional invisibility cloaks, comprised of either homogeneous or inhomogeneous media, are experimentally demonstrated in the terahertz regime. The inhomogeneous cloak was lithographically fabricated using a scalable Projection Microstereolithography process. The triangular cloaking structure has a total thickness of 4.4 mm, comprised of 220 layers of 20 μm thickness. The cloak operates at a broad frequency range between 0.3 and 0.6 THz, and is placed over an α-lactose monohydrate absorber with rectangular shape. Characterized using angular-resolved reflection terahertz time-domain spectroscopy, the results indicate that the terahertz invisibility cloak has successfully concealed both the geometrical and spectroscopic signatures of the absorber, making it undetectable to the observer. The homogeneous cloaking device made from birefringent crystalline sapphire features a large concealed volume, low loss, and broad bandwidth. It is capable of hiding objects with a dimension nearly an order of magnitude larger than that of its lithographic counterpart, but without involving complex and time-consuming cleanroom processing. The cloak device was made from two 20-mm-thick high-purity sapphire prisms. The cloaking region has a maximum height 1.75 mm with a volume of approximately 5% of the whole sample. The reflected TM beam from the cloak shows nearly the same profile as that reflected by a flat mirror.
New self-assembly strategies for next generation lithography
NASA Astrophysics Data System (ADS)
Schwartz, Evan L.; Bosworth, Joan K.; Paik, Marvin Y.; Ober, Christopher K.
2010-04-01
Future demands of the semiconductor industry call for robust patterning strategies for critical dimensions below twenty nanometers. The self assembly of block copolymers stands out as a promising, potentially lower cost alternative to other technologies such as e-beam or nanoimprint lithography. One approach is to use block copolymers that can be lithographically patterned by incorporating a negative-tone photoresist as the majority (matrix) phase of the block copolymer, paired with photoacid generator and a crosslinker moiety. In this system, poly(α-methylstyrene-block-hydroxystyrene)(PαMS-b-PHOST), the block copolymer is spin-coated as a thin film, processed to a desired microdomain orientation with long-range order, and then photopatterned. Therefore, selfassembly of the block copolymer only occurs in select areas due to the crosslinking of the matrix phase, and the minority phase polymer can be removed to produce a nanoporous template. Using bulk TEM analysis, we demonstrate how the critical dimension of this block copolymer is shown to scale with polymer molecular weight using a simple power law relation. Enthalpic interactions such as hydrogen bonding are used to blend inorganic additives in order to enhance the etch resistance of the PHOST block. We demonstrate how lithographically patternable block copolymers might fit in to future processing strategies to produce etch-resistant self-assembled features at length scales impossible with conventional lithography.
Mobile monolithic polymer elements for flow control in microfluidic devices
Hasselbrink, Jr., Ernest F.; Rehm, Jason E.; Shepodd, Timothy J.
2004-08-31
A cast-in-place and lithographically shaped mobile, monolithic polymer element for fluid flow control in microfluidic devices and method of manufacture. Microfluid flow control devices, or microvalves that provide for control of fluid or ionic current flow can be made incorporating a cast-in-place, mobile monolithic polymer element, disposed within a microchannel, and driven by either fluid or gas pressure against a retaining or sealing surface. The polymer elements are made by the application of lithographic methods to monomer mixtures formulated in such a way that the polymer will not bond to microchannel walls. The polymer elements can seal against pressures greater than 5000 psi, and have a response time on the order of milliseconds. By the use of energetic radiation it is possible to depolymerize selected regions of the polymer element to form shapes that cannot be produced by conventional lithographic patterning and would be impossible to machine.
Mobile Monolith Polymer Elements For Flow Control In Microfluidic Systems
Hasselbrink, Jr., Ernest F.; Rehm, Jason E.; Shepodd, Timothy J.; Kirby, Brian J.
2006-01-24
A cast-in-place and lithographically shaped mobile, monolithic polymer element for fluid flow control in microfluidic devices and method of manufacture. Microfluid flow control devices, or microvalves that provide for control of fluid or ionic current flow can be made incorporating a cast-in-place, mobile monolithic polymer element, disposed within a microchannel, and driven by fluid pressure (either liquid or gas) against a retaining or sealing surface. The polymer elements are made by the application of lithographic methods to monomer mixtures formulated in such a way that the polymer will not bond to microchannel walls. The polymer elements can seal against pressures greater than 5000 psi, and have a response time on the order of milliseconds. By the use of energetic radiation it is possible to depolymerize selected regions of the polymer element to form shapes that cannot be produced by conventional lithographic patterning and would be impossible to machine.
Mobile monolithic polymer elements for flow control in microfluidic devices
Hasselbrink, Jr., Ernest F.; Rehm, Jason E [Alameda, CA; Shepodd, Timothy J [Livermore, CA; Kirby, Brian J [San Francisco, CA
2005-11-11
A cast-in-place and lithographically shaped mobile, monolithic polymer element for fluid flow control in microfluidic devices and method of manufacture. Microfluid flow control devices, or microvalves that provide for control of fluid or ionic current flow can be made incorporating a cast-in-place, mobile monolithic polymer element, disposed within a microchannel, and driven by fluid pressure (either liquid or gas) against a retaining or sealing surface. The polymer elements are made by the application of lithographic methods to monomer mixtures formulated in such a way that the polymer will not bond to microchannel walls. The polymer elements can seal against pressures greater than 5000 psi, and have a response time on the order of milliseconds. By the use of energetic radiation it is possible to depolymerize selected regions of the polymer element to form shapes that cannot be produced by conventional lithographic patterning and would be impossible to machine.
NASA Astrophysics Data System (ADS)
Kim, Kyunghun; Cho, Jinhwi; Jhon, Heesauk; Jeon, Jongwook; Kang, Myounggon; Eon Park, Chan; Lee, Jihoon; An, Tae Kyu
2017-05-01
Organic field-effect transistors (OFETs) have been developed over the past few decades due to their potential applications in future electronics such as wearable and foldable electronics. As the electrical performance of OFETs has improved, patterning organic semiconducting crystals has become a key issue for their commercialization. However, conventional soft lithographic techniques have required the use of expensive processes to fabricate high-resolution master molds. In this study, we demonstrated a cost-effective method to prepare nanopatterned master molds for the fabrication of high-performance nanowire OFETs. We repurposed commercially available compact discs (CDs) as master molds because they already have linear nanopatterns on their surface. Flexible nanopatterned templates were replicated from the CDs using UV-imprint lithography. Subsequently, 6,13-bis-(triisopropylsilylethynyl) pentacene nanowires (NWs) were grown from the templates using a capillary force-assisted lithographic technique. The NW-based OFETs showed a high average field-effect mobility of 2.04 cm2 V-1 s-1. This result was attributed to the high crystallinity of the NWs and to their crystal orientation favorable for charge transport.
High-temperature morphological evolution of lithographically introduced cavities in silicon carbide
DOE Office of Scientific and Technical Information (OSTI.GOV)
Narushima, Takayuki; Glaeser, Andreas M.
2000-12-01
Internal cavities of controlled geometry and crystallography were introduced in 6H silicon carbide single crystals by combining lithographic methods, ion beam etching, and solid-state diffusion bonding. The morphological evolution of these internal cavities (negative crystals) in response to anneals of up to 128 h duration at 1900 degrees C was examined using optical microscopy. Surface energy anisotropy and faceting have a strong influence on both the geometric and kinetic characteristics of evolution. Decomposition of 12{bar 1}0 cavity edges into 101{bar 0} facets was observed after 16 h anneals, indicating that 12{bar 1}0 faces are not components of the Wulff shape.more » The shape evolution kinetics of penny-shaped cavities were also investigated. Experimentally observed evolution rates decreased much more rapidly with those predicted by a model in which surface diffusion is assumed to be rate-limiting. This suggests that the development of facets, and the associated loss of ledges and terraces during the initial stages of evolution results in an evolution process limited by the nucleation rate of attachment/detachment sites (ledges) on the facets.« less
NASA Astrophysics Data System (ADS)
Hasan, T.; Kang, Y.-S.; Kim, Y.-J.; Park, S.-J.; Jang, S.-Y.; Hu, K.-Y.; Koop, E. J.; Hinnen, P. C.; Voncken, M. M. A. J.
2016-03-01
Advancement of the next generation technology nodes and emerging memory devices demand tighter lithographic focus control. Although the leveling performance of the latest-generation scanners is state of the art, challenges remain at the wafer edge due to large process variations. There are several customer configurable leveling control options available in ASML scanners, some of which are application specific in their scope of leveling improvement. In this paper, we assess the usability of leveling non-correctable error models to identify yield limiting edge dies. We introduce a novel dies-inspec based holistic methodology for leveling optimization to guide tool users in selecting an optimal configuration of leveling options. Significant focus gain, and consequently yield gain, can be achieved with this integrated approach. The Samsung site in Hwaseong observed an improved edge focus performance in a production of a mid-end memory product layer running on an ASML NXT 1960 system. 50% improvement in focus and a 1.5%p gain in edge yield were measured with the optimized configurations.
A weak pattern random creation and scoring method for lithography process tuning
NASA Astrophysics Data System (ADS)
Zhang, Meili; Deng, Guogui; Wang, Mudan; Yu, Shirui; Hu, Xinyi; Du, Chunshan; Wan, Qijian; Liu, Zhengfang; Gao, Gensheng; Kabeel, Aliaa; Madkour, Kareem; ElManhawy, Wael; Kwan, Joe
2018-03-01
As the IC technology node moves forward, critical dimension becomes smaller and smaller, which brings huge challenge to IC manufacturing. Lithography is one of the most important steps during the whole manufacturing process and litho hotspots become a big source of yield detractors. Thus tuning lithographic recipes to cover a big range of litho hotspots is very essential to yield enhancing. During early technology developing stage, foundries only have limited customer layout data for recipe tuning. So collecting enough patterns is significant for process optimization. After accumulating enough patterns, a general way to treat them is not precise and applicable. Instead, an approach to scoring these patterns could provide a priority and reference to address different patterns more effectively. For example, the weakest group of patterns could be applied the most limited specs to ensure process robustness. This paper presents a new method of creation of real design alike patterns of multiple layers based on design rules using Layout Schema Generator (LSG) utility and a pattern scoring flow using Litho-friendly Design (LFD) and Pattern Matching. Through LSG, plenty of new unknown patterns could be created for further exploration. Then, litho simulation through LFD and topological matches by using Pattern Matching is applied on the output patterns of LSG. Finally, lithographical severity, printability properties and topological distribution of every pattern are collected. After a statistical analysis of pattern data, every pattern is given a relative score representing the pattern's yield detracting level. By sorting the output pattern score tables, weak patterns could be filtered out for further research and process tuning. This pattern generation and scoring flow is demonstrated on 28nm logic technology node. A weak pattern library is created and scored to help improve recipe coverage of litho hotspots and enhance the reliability of process.
Inspection of lithographic mask blanks for defects
Sommargren, Gary E.
2001-01-01
A visible light method for detecting sub-100 nm size defects on mask blanks used for lithography. By using optical heterodyne techniques, detection of the scattered light can be significantly enhanced as compared to standard intensity detection methods. The invention is useful in the inspection of super-polished surfaces for isolated surface defects or particulate contamination and in the inspection of lithographic mask or reticle blanks for surface defects or bulk defects or for surface particulate contamination.
Demas, Vasiliki; Bernhardt, Anthony; Malba, Vince; Adams, Kristl L; Evans, Lee; Harvey, Christopher; Maxwell, Robert S; Herberg, Julie L
2009-09-01
Nuclear magnetic resonance (NMR) offers a non-destructive, powerful, structure-specific analytical method for the identification of chemical and biological systems. The use of radio frequency (RF) microcoils has been shown to increase the sensitivity in mass-limited samples. Recent advances in micro-receiver technology have further demonstrated a substantial increase in mass sensitivity [D.L. Olson, T.L. Peck, A.G. Webb, R.L. Magin, J.V. Sweedler, High-resolution microcoil H-1-NMR for mass-limited, nanoliter-volume samples, Science 270 (5244) (1995) 1967-1970]. Lithographic methods for producing solenoid microcoils possess a level of flexibility and reproducibility that exceeds previous production methods, such as hand winding microcoils. This paper presents electrical characterizations of RF microcoils produced by a unique laser lithography system that can pattern three dimensional surfaces and compares calculated and experimental results to those for wire wound RF microcoils. We show that existing optimization conditions for RF coil design still hold true for RF microcoils produced by lithography. Current lithographic microcoils show somewhat inferior performance to wire wound RF microcoils due to limitations in the existing electroplating technique. In principle, however, when the pitch of the RF microcoil is less than 100mum lithographic coils should show comparable performance to wire wound coils. In the cases of larger pitch, wire cross sections can be significantly larger and resistances lower than microfabricated conductors.
Acetal-based three-component CARs: a versatile concept to tailor optical properties of resists
NASA Astrophysics Data System (ADS)
Padmanaban, Munirathna; Kinoshita, Yoshiaki; Kawasaki, N.; Okazaki, Hiroshi; Funato, Satoru; Pawlowski, Georg
1996-06-01
Cost and yield effective IC fabrication requires the use of a large variety of substrates with distinct reflectivity, which may cause problems during the lithographic process either due to reflective notching and standing wave formation on highly reflective substrates, or trapezoidal resist patterns and deterioration of resolution, when a substrate with low reflectivity is employed. Reflectivity problems become more evident, when i-line radiation is replaced by DUV illumination tools. In addition, the non-bleaching nature of state-of-the-art chemically amplified resists further aggravates the reflectivity issues. It is therefore generally accepted that substrate reflectivity and resist transparency have to be closely matched to gain maximized lithographic performance, i.e., dissolution characteristics, resolution, depth-of-focus and exposure latitude. We have reported previously that poly-N,O-acetals act as effective dissolution inhibitors/promoters for PHS-based chemically amplified DUV resist materials. Alkylsubstituted poly(benzaldehyde-N,O-acetal)s are basically transparent in the 248 nm wavelength region, and therefore do not contribute to resist absorption. On the other hand, poly(naphthaldehyde-N,O-acetal)s are quite strong absorbants in the deep UV region. It was found that certain benz- and naphthaldehyde poly-N,O-acetal derivatives exhibit essentially identical inhibition and dissolution properties combined with similar cleavage kinetics. By both, physical mixing or co-condensation, of these materials, it is possible to adjust the optical resist absorption to precalculated values between approx. 0.30 - 0.80 micrometer MIN1 solely by poly-N,O-acetal selection without deterioration of other important resist properties. Basic chemistry, physico-chemical and optical properties of the resists are discussed in detail. Lithographic results including SEMs prove the versatility and efficiency of this approach.
Photo-Definable Self Assembled Maerials
DOSHI, DHAVAL; [et al
2004-10-26
The present invention provides a mesoporous material comprising at least one region of mesoporous material patterned at a lithographic scale. The present invention also provides a a method for forming a patterned mesoporous material comprising: coating a sol on a substrate to form a film, the sol comprising: a templating molecule, a photoactivator generator, a material capable of being sol-gel processed, water, and a solvent; and exposing the film to light to form a patterned mesoporous material.
Sweatt, William C.; Christenson, Todd R.
2004-05-25
An optical microspectrometer comprises a grism to disperse the spectra in a line object. A single optical microspectrometer can be used to sequentially scan a planar object, such as a dye-tagged microchip. Because the optical microspectrometer is very compact, multiple optical microspectrometers can be arrayed to provide simultaneous readout across the width of the planar object The optical microspectrometer can be fabricated with lithographic process, such as deep X-ray lithography (DXRL), with as few as two perpendicular exposures.
Fabrication of patterned surface by soft lithographic technique for confinement of lipid bilayer
NASA Astrophysics Data System (ADS)
Moulick, Ranjita Ghosh; Mayer, Dirk
2018-04-01
In this paper we demonstrated that a 3D pattern can be well transferred from a silicon Master to a gold substrate using µcontact printing. In this process 1-Octadecanthiol served as an ink and printing followed by etching generated the desired pattern on the gold substrate. The prepatterned substrate was also used for lipid vesicle fusion and revealed that lipid molecules selectively bind to the gold layer.
Due-Window Assignment Scheduling with Variable Job Processing Times
Wu, Yu-Bin
2015-01-01
We consider a common due-window assignment scheduling problem jobs with variable job processing times on a single machine, where the processing time of a job is a function of its position in a sequence (i.e., learning effect) or its starting time (i.e., deteriorating effect). The problem is to determine the optimal due-windows, and the processing sequence simultaneously to minimize a cost function includes earliness, tardiness, the window location, window size, and weighted number of tardy jobs. We prove that the problem can be solved in polynomial time. PMID:25918745
ART AND SCIENCE OF IMAGE MAPS.
Kidwell, Richard D.; McSweeney, Joseph A.
1985-01-01
The visual image of reflected light is influenced by the complex interplay of human color discrimination, spatial relationships, surface texture, and the spectral purity of light, dyes, and pigments. Scientific theories of image processing may not always achieve acceptable results as the variety of factors, some psychological, are in part, unpredictable. Tonal relationships that affect digital image processing and the transfer functions used to transform from the continuous-tone source image to a lithographic image, may be interpreted for an insight of where art and science fuse in the production process. The application of art and science in image map production at the U. S. Geological Survey is illustrated and discussed.
Liu, Shiyuan; Xu, Shuang; Wu, Xiaofei; Liu, Wei
2012-06-18
This paper proposes an iterative method for in situ lens aberration measurement in lithographic tools based on a quadratic aberration model (QAM) that is a natural extension of the linear model formed by taking into account interactions among individual Zernike coefficients. By introducing a generalized operator named cross triple correlation (CTC), the quadratic model can be calculated very quickly and accurately with the help of fast Fourier transform (FFT). The Zernike coefficients up to the 37th order or even higher are determined by solving an inverse problem through an iterative procedure from several through-focus aerial images of a specially designed mask pattern. The simulation work has validated the theoretical derivation and confirms that such a method is simple to implement and yields a superior quality of wavefront estimate, particularly for the case when the aberrations are relatively large. It is fully expected that this method will provide a useful practical means for the in-line monitoring of the imaging quality of lithographic tools.
Lithographically defined few-electron silicon quantum dots based on a silicon-on-insulator substrate
DOE Office of Scientific and Technical Information (OSTI.GOV)
Horibe, Kosuke; Oda, Shunri; Kodera, Tetsuo, E-mail: kodera.t.ac@m.titech.ac.jp
2015-02-23
Silicon quantum dot (QD) devices with a proximal single-electron transistor (SET) charge sensor have been fabricated in a metal-oxide-semiconductor structure based on a silicon-on-insulator substrate. The charge state of the QDs was clearly read out using the charge sensor via the SET current. The lithographically defined small QDs enabled clear observation of the few-electron regime of a single QD and a double QD by charge sensing. Tunnel coupling on tunnel barriers of the QDs can be controlled by tuning the top-gate voltages, which can be used for manipulation of the spin quantum bit via exchange interaction between tunnel-coupled QDs. Themore » lithographically defined silicon QD device reported here is technologically simple and does not require electrical gates to create QD confinement potentials, which is advantageous for the integration of complicated constructs such as multiple QD structures with SET charge sensors for the purpose of spin-based quantum computing.« less
Nanopatterns by phase separation of patterned mixed polymer monolayers
Huber, Dale L; Frischknecht, Amalie
2014-02-18
Micron-size and sub-micron-size patterns on a substrate can direct the self-assembly of surface-bonded mixed polymer brushes to create nanoscale patterns in the phase-separated mixed polymer brush. The larger scale features, or patterns, can be defined by a variety of lithographic techniques, as well as other physical and chemical processes including but not limited to etching, grinding, and polishing. The polymer brushes preferably comprise vinyl polymers, such as polystyrene and poly(methyl methacrylate).
From classical to quantum plasmonics: Classical emitter and SPASER
NASA Astrophysics Data System (ADS)
Balykin, V. I.
2018-02-01
The key advantage of plasmonics is in pushing our control of light down to the nanoscale. It is possible to envision lithographically fabricated plasmonic devices for future quantum information processing or cryptography at the nanoscale in two dimensions. A first step in this direction is a demonstration of a highly efficient nanoscale light source. Here we demonstrate two types of nanoscale sources of optical fields: 1) the classical metallic nanostructure emitter and 2) the plasmonic nanolaser - SPASER.
Techniques For Mass Production Of Tunneling Electrodes
NASA Technical Reports Server (NTRS)
Kenny, Thomas W.; Podosek, Judith A.; Reynolds, Joseph K.; Rockstad, Howard K.; Vote, Erika C.; Kaiser, William J.
1993-01-01
Techniques for mass production of tunneling electrodes developed from silicon-micromachining, lithographic patterning, and related microfabrication processes. Tunneling electrodes named because electrons travel between them by quantum-mechanical tunneling; tunneling electrodes integral parts of tunneling transducer/sensors, which act in conjunction with feedback circuitry to stabilize tunneling currents by maintaining electrode separations of order of 10 Angstrom. Essential parts of scanning tunneling microscopes and related instruments, and used as force and position transducers in novel microscopic accelerometers and infrared detectors.
Preparation and Presentation of Digital Maps in Raster Format
Edwards, K.; Batson, R.M.
1980-01-01
A set of algorithms has been developed at USGS Flagstaff for displaying digital map data in raster format. The set includes: FILLIN, which assigns a specified attribute code to units of a map which have been outlined on a digitizer and converted to raster format; FILBND, which removes the outlines; ZIP, which adds patterns to the map units; and COLOR, which provides a simplified process for creating color separation plates for either photographic or lithographic reproduction. - Authors
NASA Astrophysics Data System (ADS)
Rahman, Taibur; Renaud, Luke; Heo, Deuk; Renn, Michael; Panat, Rahul
2015-10-01
The fabrication of 3D metal-dielectric structures at sub-mm length scale is highly important in order to realize low-loss passives and GHz wavelength antennas with applications in wearable and Internet-of-Things (IoT) devices. The inherent 2D nature of lithographic processes severely limits the available manufacturing routes to fabricate 3D structures. Further, the lithographic processes are subtractive and require the use of environmentally harmful chemicals. In this letter, we demonstrate an additive manufacturing method to fabricate 3D metal-dielectric structures at sub-mm length scale. A UV curable dielectric is dispensed from an Aerosol Jet system at 10-100 µm length scale and instantaneously cured to build complex 3D shapes at a length scale <1 mm. A metal nanoparticle ink is then dispensed over the 3D dielectric using a combination of jetting action and tilted dispense head, also using the Aerosol Jet technique and at a length scale 10-100 µm, followed by the nanoparticle sintering. Simulation studies are carried out to demonstrate the feasibility of using such structures as mm-wave antennas. The manufacturing method described in this letter opens up the possibility of fabricating an entirely new class of custom-shaped 3D structures at a sub-mm length scale with potential applications in 3D antennas and passives.
Fabrication of uniform nanoscale cavities via silicon direct wafer bonding.
Thomson, Stephen R D; Perron, Justin K; Kimball, Mark O; Mehta, Sarabjit; Gasparini, Francis M
2014-01-09
Measurements of the heat capacity and superfluid fraction of confined (4)He have been performed near the lambda transition using lithographically patterned and bonded silicon wafers. Unlike confinements in porous materials often used for these types of experiments(3), bonded wafers provide predesigned uniform spaces for confinement. The geometry of each cell is well known, which removes a large source of ambiguity in the interpretation of data. Exceptionally flat, 5 cm diameter, 375 µm thick Si wafers with about 1 µm variation over the entire wafer can be obtained commercially (from Semiconductor Processing Company, for example). Thermal oxide is grown on the wafers to define the confinement dimension in the z-direction. A pattern is then etched in the oxide using lithographic techniques so as to create a desired enclosure upon bonding. A hole is drilled in one of the wafers (the top) to allow for the introduction of the liquid to be measured. The wafers are cleaned(2) in RCA solutions and then put in a microclean chamber where they are rinsed with deionized water(4). The wafers are bonded at RT and then annealed at ~1,100 °C. This forms a strong and permanent bond. This process can be used to make uniform enclosures for measuring thermal and hydrodynamic properties of confined liquids from the nanometer to the micrometer scale.
NASA Astrophysics Data System (ADS)
Kim, Myoung-Soo; Kim, Hyoung-Gi; Kim, Hyeong-Soo; Baik, Ki-Ho; Johnson, Donald W.; Cernigliaro, George J.; Minsek, David W.
1999-06-01
Thin film imaging processes such as top surface imaging (TSI) are candidates for sub-150 nm lithography using 193 nm lithography. Single component, non-chemically amplified, positive tone TSI photoresists based on phenolic polymers demonstrate good post-etch contrast, resolution, and minimal line edge roughness, in addition to being the most straightforward thin film imaging approach. In this approach, ArF laser exposure results directly in radiation- induced crosslinking of the phenolic polymer, followed by formation of a thin etch mask at the surface of the un- exposed regions by vapor-phase silylation, followed by reactive ion etching of the non-silylated regions. However, single component resists based on poly(para-hydroxystryene) (PHS), such as MicroChem's Nano MX-P7, suffer from slow photospeed as well as low silylation contrast which can cause reproducibility and line-edge-roughness problems. We report that selected aromatic substitution of the poly(para- hydroxystryene) polymer can increase the photospeed by up to a factor of four relative to un-substituted PHS. In this paper we report the synthesis and lithographic evaluations of four experimental TSI photoresists. MX-EX-1, MX-EX-2, MX- EX-3 and MX-EX-4 are non-chemically amplified resists based on aromatic substitutions of chloro- and hydroxymethyl- groups and PHS. We report optimized lithographic processing conditions, line edge roughness, silylation contrast, and compare the results to the parent PHS photoresist.
Scale up of large ALON® and spinel windows
NASA Astrophysics Data System (ADS)
Goldman, Lee M.; Kashalikar, Uday; Ramisetty, Mohan; Jha, Santosh; Sastri, Suri
2017-05-01
Aluminum Oxynitride (ALON® Transparent Ceramic) and Magnesia Aluminate Spinel (Spinel) combine broadband transparency with excellent mechanical properties. Their cubic structure means that they are transparent in their polycrystalline form, allowing them to be manufactured by conventional powder processing techniques. Surmet has scaled up its ALON® production capability to produce and deliver windows as large as 4.4 sq ft. We have also produced our first 6 sq ft window. We are in the process of producing 7 sq ft ALON® window blanks for armor applications; and scale up to even larger, high optical quality blanks for Recce window applications is underway. Surmet also produces spinel for customers that require superior transmission at the longer wavelengths in the mid wave infra-red (MWIR). Spinel windows have been limited to smaller sizes than have been achieved with ALON. To date the largest spinel window produced is 11x18-in, and windows 14x20-in size are currently in process. Surmet is now scaling up its spinel processing capability to produce high quality window blanks as large as 19x27-in for sensor applications.
Fabrication and etching processes of silicon-based PZT thin films
NASA Astrophysics Data System (ADS)
Zhao, Hongjin; Liu, Yanxiang; Liu, Jianshe; Ren, Tian-Ling; Liu, Li-Tian; Li, Zhijian
2001-09-01
Lead-zirconate-titanate (PZT) thin films on silicon were prepared by a sol-gel method. Phase characterization and crystal orientation of the films were investigated by x-ray diffraction analysis (XRD). It was shown that the PZT thin films had a perfect perovskite structure after annealed at a low temperature of 600 degrees C. PZT thin films were chemically etched using HCl/HF solution through typical semiconductor lithographic process, and the etching condition was optimized. The scanning electron microscopy results indicated that the PZT thin film etching problem was well solved for the applications of PZT thin film devices.
Fabricating Copper Nanotubes by Electrodeposition
NASA Technical Reports Server (NTRS)
Yang, E. H.; Ramsey, Christopher; Bae, Youngsam; Choi, Daniel
2009-01-01
Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.
Filtration-guided assembly for patterning one-dimensional nanostructures
NASA Astrophysics Data System (ADS)
Zhang, Yaozhong; Wang, Chuan; Yeom, Junghoon
2017-04-01
Tremendous progress has been made in synthesizing various types of one-dimensional (1D) nanostructures (NSs), such as nanotubes and nanowires, but some technical challenges still remain in the deterministic assembly of the solution-processed 1D NSs for device integration. In this work we investigate a scalable yet inexpensive nanomaterial assembly method, namely filtration-guided assembly (FGA), to place nanomaterials into desired locations as either an individual entity or ensembles, and form functional devices. FGA not only addresses the assembly challenges but also encompasses the notion of green nanomanufacturing, maximally utilizing nanomaterials and eliminating a waste stream of nanomaterials into the environment. FGA utilizes selective filtration of 1D NSs through the open windows on the nanoporous filter membrane whose surface is patterned by a polymer mask for guiding the 1D NS deposition. The modified soft-lithographic technique called blanket transfer (BT) is employed to create the various photoresist patterns of sub-10-micron resolution on the nanoporous filter membrane like mixed cellulose acetate. We use single-walled carbon nanotubes (SWCNTs) as a model 1D NS and demonstrate the fabrication of an array pattern of homogeneous 1D NS network films over an area of 20 cm2 within 10 min. The FGA-patterned SWCNT network films are transferred onto the substrate using the adhesive-based transfer technique, and show the highly uniform film thickness and resistance measurements across the entire substrate. Finally, the electrical performance of the back-gated transistors made from the FGA and transfer method of 95% pure SWCNTs is demonstrated.
Filtration-guided assembly for patterning one-dimensional nanostructures.
Zhang, Yaozhong; Wang, Chuan; Yeom, Junghoon
2017-04-07
Tremendous progress has been made in synthesizing various types of one-dimensional (1D) nanostructures (NSs), such as nanotubes and nanowires, but some technical challenges still remain in the deterministic assembly of the solution-processed 1D NSs for device integration. In this work we investigate a scalable yet inexpensive nanomaterial assembly method, namely filtration-guided assembly (FGA), to place nanomaterials into desired locations as either an individual entity or ensembles, and form functional devices. FGA not only addresses the assembly challenges but also encompasses the notion of green nanomanufacturing, maximally utilizing nanomaterials and eliminating a waste stream of nanomaterials into the environment. FGA utilizes selective filtration of 1D NSs through the open windows on the nanoporous filter membrane whose surface is patterned by a polymer mask for guiding the 1D NS deposition. The modified soft-lithographic technique called blanket transfer (BT) is employed to create the various photoresist patterns of sub-10-micron resolution on the nanoporous filter membrane like mixed cellulose acetate. We use single-walled carbon nanotubes (SWCNTs) as a model 1D NS and demonstrate the fabrication of an array pattern of homogeneous 1D NS network films over an area of 20 cm 2 within 10 min. The FGA-patterned SWCNT network films are transferred onto the substrate using the adhesive-based transfer technique, and show the highly uniform film thickness and resistance measurements across the entire substrate. Finally, the electrical performance of the back-gated transistors made from the FGA and transfer method of 95% pure SWCNTs is demonstrated.
Transplant Image Processing Technology under Windows into the Platform Based on MiniGUI
NASA Astrophysics Data System (ADS)
Gan, Lan; Zhang, Xu; Lv, Wenya; Yu, Jia
MFC has a large number of digital image processing-related API functions, object-oriented and class mechanisms which provides image processing technology strong support in Windows. But in embedded systems, image processing technology dues to the restrictions of hardware and software do not have the environment of MFC in Windows. Therefore, this paper draws on the experience of image processing technology of Windows and transplants it into MiniGUI embedded systems. The results show that MiniGUI/Embedded graphical user interface applications about image processing which used in embedded image processing system can be good results.
Han, Sangkwon; Bae, Hyung Jong; Kim, Junhoi; Shin, Sunghwan; Choi, Sung-Eun; Lee, Sung Hoon; Kwon, Sunghoon; Park, Wook
2012-11-20
A QR-coded microtaggant for the anti-counterfeiting of drugs is proposed that can provide high capacity and error-correction capability. It is fabricated lithographically in a microfluidic channel with special consideration of the island patterns in the QR Code. The microtaggant is incorporated in the drug capsule ("on-dose authentication") and can be read by a simple smartphone QR Code reader application when removed from the capsule and washed free of drug. Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Torres-Rendon, Jose Guillermo; Femmer, Tim; De Laporte, Laura; Tigges, Thomas; Rahimi, Khosrow; Gremse, Felix; Zafarnia, Sara; Lederle, Wiltrud; Ifuku, Shinsuke; Wessling, Matthias; Hardy, John G; Walther, Andreas
2015-05-20
A sacrificial templating process using lithographically printed minimal surface structures allows complex de novo geo-metries of delicate hydrogel materials. The hydrogel scaffolds based on cellulose and chitin nanofibrils show differences in terms of attachment of human mesenchymal stem cells, and allow their differentiation into osteogenic outcomes. The approach here serves as a first example toward designer hydrogel scaffolds viable for biomimetic tissue engineering. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
The future of lithography: SEMATECH Litho Forum 2008.
Willson, C Grant; Roman, Bernard J
2008-07-01
The biannual SEMATECH Litho Forum was held May 12-14, 2008 in Bolton Landing, NY, not far from SEMATECH's facility at Albany Nanotech. This biannual meeting is designed to assess the progress in advanced patterning technology and to produce consensus about the processes that will be used to manufacture the next generations of devices. A summary of the key ideas presented at the meeting is given in this paper, along with the future challenges and opportunities in emerging lithographic technologies.
Mobile atom traps using magnetic nanowires
NASA Astrophysics Data System (ADS)
Allwood, D. A.; Schrefl, T.; Hrkac, G.; Hughes, I. G.; Adams, C. S.
2006-07-01
By solving the Landau-Lifshitz-Gilbert equation using a finite element method we show that an atom trap can be produced above a ferromagnetic nanowire domain wall. Atoms experience trap frequencies of up to a few megahertz, and can be transported by applying a weak magnetic field along the wire. Lithographically defined nanowire patterns could allow quantum information processing by bringing domain walls in close proximity at certain places to allow trapped atom interactions and far apart at others to allow individual addressing.
NASA Technical Reports Server (NTRS)
Krainak, Michael; Merritt, Scott
2016-01-01
Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.
Organic light emitting diodes with structured electrodes
Mao, Samuel S.; Liu, Gao; Johnson, Stephen G.
2012-12-04
A cathode that contain nanostructures that extend into the organic layer of an OLED has been described. The cathode can have an array of nanotubes or a layer of nanoclusters extending out from its surface. In another arrangement, the cathode is patterned and etched to form protruding nanostructures using a standard lithographic process. Various methods for fabricating these structures are provided, all of which are compatible with large-scale manufacturing. OLEDs made with these novel electrodes have greatly enhanced electron injection, have good environmental stability.
Halpern, Aaron R; Corn, Robert M
2013-02-26
A novel low-cost nanoring array fabrication method that combines the process of lithographically patterned nanoscale electrodeposition (LPNE) with colloidal lithography is described. Nanoring array fabrication was accomplished in three steps: (i) a thin (70 nm) sacrificial nickel or silver film was first vapor-deposited onto a plasma-etched packed colloidal monolayer; (ii) the polymer colloids were removed from the surface, a thin film of positive photoresist was applied, and a backside exposure of the photoresist was used to create a nanohole electrode array; (iii) this array of nanoscale cylindrical electrodes was then used for the electrodeposition of gold, silver, or nickel nanorings. Removal of the photoresist and sacrificial metal film yielded a nanoring array in which all of the nanoring dimensions were set independently: the inter-ring spacing was fixed by the colloidal radius, the radius of the nanorings was controlled by the plasma etching process, and the width of the nanorings was controlled by the electrodeposition process. A combination of scanning electron microscopy (SEM) measurements and Fourier transform near-infrared (FT-NIR) absorption spectroscopy were used to characterize the nanoring arrays. Nanoring arrays with radii from 200 to 400 nm exhibited a single strong NIR plasmonic resonance with an absorption maximum wavelength that varied linearly from 1.25 to 3.33 μm as predicted by a simple standing wave model linear antenna theory. This simple yet versatile nanoring array fabrication method was also used to electrodeposit concentric double gold nanoring arrays that exhibited multiple NIR plasmonic resonances.
NASA Astrophysics Data System (ADS)
America, William George
Chemical-Mechanical Planarization (CMP) has become an essential technology for making modern semiconductor devices. This technique was originally applied to overcome the depth of focus limitations of lithography tools during pattern development of metal and dielectric films. As features of the semiconductor device became smaller the lithographic process shifted to shorter exposure wavelengths and the useable depth of focus became smaller. The topography differences on the wafer's surface from all of the previous processing steps became greater than the exposure tools could properly project. CMP helped solve this problem by bringing the features of the wafer surface to the same plane. As semiconductor fabrication technology progressed further, CMP was applied to other areas of the process, including shallow trench isolation and metal line Damascene processing. In its simplest application, CMP polishes on features projecting upward and higher than the average surface. These projections experience more work and are polished faster. Given sufficient time the surface becomes essentially flat, on a micro-scale, and the lithographic projection tools has the same plane onto which to focus. Thus, the pattern is properly and uniformly exposed and subsequent reactive ion etching (RIE) steps are executed. This technique was initially applied to later steps in the wafer processing scheme to render a new flat surface at each metal layer. Building on this success, CMP has been applied to a broad range of steps in the wafer processing particularly where surface topography warrants and when RIE of dielectric or metallic films is not practical. CMP has seen its greatest application in semiconductor logic and memory devices and most recently, a Damascene processing for copper lines and shallow trench isolation. This pattern dependent CMP issue is explored in this thesis as it pertains primarily to shallow trench isolation CMP coupled with a highly selective slurry chemistry.
Free-world microelectronic manufacturing equipment
NASA Astrophysics Data System (ADS)
Kilby, J. S.; Arnold, W. H.; Booth, W. T.; Cunningham, J. A.; Hutcheson, J. D.; Owen, R. W.; Runyan, W. R.; McKenney, Barbara L.; McGrain, Moira; Taub, Renee G.
1988-12-01
Equipment is examined and evaluated for the manufacture of microelectronic integrated circuit devices and sources for that equipment within the Free World. Equipment suitable for the following are examined: single-crystal silicon slice manufacturing and processing; required lithographic processes; wafer processing; device packaging; and test of digital integrated circuits. Availability of the equipment is also discussed, now and in the near future. Very adequate equipment for most stages of the integrated circuit manufacturing process is available from several sources, in different countries, although the best and most widely used versions of most manufacturing equipment are made in the United States or Japan. There is also an active market in used equipment, suitable for manufacture of capable integrated circuits with performance somewhat short of the present state of the art.
Ga Lithography in Sputtered Niobium for Superconductive Micro and Nanowires.
Henry, Michael David; Lewis, Rupert M.; Wolfley, Steven L.; ...
2014-08-18
This work demonstrates the use of FIB implanted Ga as a lithographic mask for plasma etching of Nb films. Using a highly collimated Ga beam of a FIB, Nb is implanted 12 nm deep with a 14 nm thick Ga layer providing etch selectivity better than 15:1 with fluorine based etch chemistry. Implanted square test patterns, both 10 um by and 10 um and 100 um by 100 um, demonstrate that doses above than 7.5 x 1015 cm-2 at 30 kV provide adequate mask protection for a 205 nm thick, sputtered Nb film. The resolution of this dry lithographic techniquemore » is demonstrated by fabrication of nanowires 75 nm wide by 10 um long connected to 50 um wide contact pads. The residual resistance ratio of patterned Nb films was 3. The superconducting transition temperature, Tc =7.7 K, was measured using MPMS. This nanoscale, dry lithographic technique was extended to sputtered TiN and Ta here and could be used on other fluorine etched superconductors such as NbN, NbSi, and NbTi.« less
Conformal ALON® and spinel windows
NASA Astrophysics Data System (ADS)
Goldman, Lee M.; Smith, Mark; Ramisetty, Mohan; Jha, Santosh; Sastri, Suri
2017-05-01
The requirements for modern aircraft based reconnaissance systems are driving the need for conformal windows for future sensor systems. However, limitations on optical systems and the ability to produce windows in complex geometries currently limit the geometry of existing windows and window assemblies to faceted assemblies of flat windows. ALON consists primarily of aluminum and oxygen, similar to that of alumina, with a small amount of nitrogen added to help stabilize the cubic gamma-AlON phase. ALON's chemical similarity to alumina, translates into a robust manufacturing process. This ease of processing has allowed Surmet to produce ALON windows and domes in a wide variety of geometries and sizes. Spinel (MgAl2O4) contains equal molar amounts of MgO and Al2O3, and is a cubic material, that transmits further into the Infrared than ALON. Spinel is produced via powder processing techniques similar to those used to produce ALON. Surmet is now applying the lessons learned with ALON to produce conformal spinel windows and domes as well.
Harmonics Generation by Surface Plasmon Polaritons on Single Nanowires.
de Hoogh, Anouk; Opheij, Aron; Wulf, Matthias; Rotenberg, Nir; Kuipers, L
2016-08-17
We present experimental observations of visible wavelength second- and third-harmonic generation on single plasmonic nanowires of variable widths. We identify that near-infrared surface plasmon polaritons, which are guided along the nanowire, act as the source of the harmonics generation. We discuss the underlying mechanism of this nonlinear process, using a combination of spatially resolved measurements and numerical simulations to show that the visible harmonics are generated via a combination of both local and propagating plasmonic modes. Our results provide the first demonstration of nanoscale nonlinear optics with guided, propagating plasmonic modes on a lithographically defined chip, opening up new routes toward integrated optical circuits for information processing.
NASA Astrophysics Data System (ADS)
Huang, Da; Freeley, Mark; Palma, Matteo
2017-03-01
We present a facile strategy of general applicability for the assembly of individual nanoscale moieties in array configurations with single-molecule control. Combining the programming ability of DNA as a scaffolding material with a one-step lithographic process, we demonstrate the patterning of single quantum dots (QDs) at predefined locations on silicon and transparent glass surfaces: as proof of concept, clusters of either one, two, or three QDs were assembled in highly uniform arrays with a 60 nm interdot spacing within each cluster. Notably, the platform developed is reusable after a simple cleaning process and can be designed to exhibit different geometrical arrangements.
Modified Surface Having Low Adhesion Properties to Mitigate Insect Residue Adhesion
NASA Technical Reports Server (NTRS)
Wohl, Christopher J., Jr. (Inventor); Smith, Joseph G., Jr. (Inventor); Siochi, Emilie J. (Inventor); Penner, Ronald K. (Inventor)
2016-01-01
A process to modify a surface to provide reduced adhesion surface properties to mitigate insect residue adhesion. The surface may include the surface of an article including an aircraft, an automobile, a marine vessel, all-terrain vehicle, wind turbine, helmet, etc. The process includes topographically and chemically modifying the surface by applying a coating comprising a particulate matter, or by applying a coating and also topographically modifying the surface by various methods, including but not limited to, lithographic patterning, laser ablation and chemical etching, physical vapor phase deposition, chemical vapor phase deposition, crystal growth, electrochemical deposition, spin casting, and film casting.
Ripple-aware optical proximity correction fragmentation for back-end-of-line designs
NASA Astrophysics Data System (ADS)
Wang, Jingyu; Wilkinson, William
2018-01-01
Accurate characterization of image rippling is critical in early detection of back-end-of-line (BEOL) patterning weakpoints, as most defects are strongly associated with excessive rippling that does not get effectively compensated by optical proximity correction (OPC). We correlate image contour with design shapes to account for design geometry-dependent rippling signature, and explore the best practice of OPC fragmentation for BEOL geometries. Specifically, we predict the optimum contour as allowed by the lithographic process and illumination conditions and locate ripple peaks, valleys, and inflection points. This allows us to identify potential process weakpoints and segment the mask accordingly to achieve the best correction results.
Lithographic dry development using optical absorption
Olynick, Deirdre; Schuck, P. James; Schmidt, Martin
2013-08-20
A novel approach to dry development of exposed photo resist is described in which a photo resist layer is exposed to a visible light source in order to remove the resist in the areas of exposure. The class of compounds used as the resist material, under the influence of the light source, undergoes a chemical/structural change such that the modified material becomes volatile and is thus removed from the resist surface. The exposure process is carried out for a time sufficient to ablate the exposed resist layer down to the layer below. A group of compounds found to be useful in this process includes aromatic calixarenes.
NASA Astrophysics Data System (ADS)
Brochu, Christine; Larouche, André; Hark, Robert
Shell thickness is an important quality factor for lithographic and anodizing quality aluminum alloys. Increasing pressure is placed on casting plants to produce a thinner shell zone for these alloys. This study, based on plant trials and mathematical modelling highlights the most significant parameters influencing shell zone formation. Results obtained show the importance of metal temperature and distribution and mould metal level on shell zone formation. As an answer to specific plant problems, this study led to the development of improved metal distribution systems for DC casting of litho and anodizing quality alloys.
Cycloolefin/cyanoacrylate (COCA) copolymers for 193-nm and 157-nm lithography
NASA Astrophysics Data System (ADS)
Dammel, Ralph R.; Sakamuri, Raj; Lee, Sang-Ho; Rahman, Dalil; Kudo, Takanori; Romano, Andrew R.; Rhodes, Larry F.; Lipian, John-Henry; Hacker, Cheryl; Barnes, Dennis A.
2002-07-01
The copolymerization reaction between methyl cyanoacrylate (MCA) and a variety of cycloolefins (CO) was investigated. Cycololefin/cyanoacrylate (COCA) copolymers were obtained in good yields and with lithographically interesting molecular weights for all cycoolefins studied. Anionic MCA homopolymerization could be largely suppressed using acetic acid. Based on NMR data, the copolymerization may tend to a 1:1 CO:MCA incorporation ratio but further work with better suppression of the anionic component is needed to confirm this. Lithographic tests on copolymers of appropriately substituted norbornenes and MCA showed semi-dense and isolated line performance down to 90 nm.
Remembering the Important Things: Semantic Importance in Stream Reasoning
DOE Office of Scientific and Technical Information (OSTI.GOV)
Yan, Rui; Greaves, Mark T.; Smith, William P.
Reasoning and querying over data streams rely on the abil- ity to deliver a sequence of stream snapshots to the processing algo- rithms. These snapshots are typically provided using windows as views into streams and associated window management strategies. Generally, the goal of any window management strategy is to preserve the most im- portant data in the current window and preferentially evict the rest, so that the retained data can continue to be exploited. A simple timestamp- based strategy is rst-in-rst-out (FIFO), in which items are replaced in strict order of arrival. All timestamp-based strategies implicitly assume that a temporalmore » ordering reliably re ects importance to the processing task at hand, and thus that window management using timestamps will maximize the ability of the processing algorithms to deliver accurate interpretations of the stream. In this work, we explore a general no- tion of semantic importance that can be used for window management for streams of RDF data using semantically-aware processing algorithms like deduction or semantic query. Semantic importance exploits the infor- mation carried in RDF and surrounding ontologies for ranking window data in terms of its likely contribution to the processing algorithms. We explore the general semantic categories of query contribution, prove- nance, and trustworthiness, as well as the contribution of domain-specic ontologies. We describe how these categories behave using several con- crete examples. Finally, we consider how a stream window management strategy based on semantic importance could improve overall processing performance, especially as available window sizes decrease.« less
Single-machine common/slack due window assignment problems with linear decreasing processing times
NASA Astrophysics Data System (ADS)
Zhang, Xingong; Lin, Win-Chin; Wu, Wen-Hsiang; Wu, Chin-Chia
2017-08-01
This paper studies linear non-increasing processing times and the common/slack due window assignment problems on a single machine, where the actual processing time of a job is a linear non-increasing function of its starting time. The aim is to minimize the sum of the earliness cost, tardiness cost, due window location and due window size. Some optimality results are discussed for the common/slack due window assignment problems and two O(n log n) time algorithms are presented to solve the two problems. Finally, two examples are provided to illustrate the correctness of the corresponding algorithms.
Negative-tone imaging with EUV exposure toward 13nm hp
NASA Astrophysics Data System (ADS)
Tsubaki, Hideaki; Nihashi, Wataru; Tsuchihashi, Toru; Yamamoto, Kei; Goto, Takahiro
2016-03-01
Negative-tone imaging (NTI) with EUV exposure has major advantages with respect to line-width roughness (LWR) and resolution due in part to polymer swelling and favorable dissolution mechanics. In NTI process, both resist and organic solvents play important roles in determining lithography performances. The present study describes novel chemically amplified resist materials based on NTI technology with EUV using a specific organic solvents. Lithographic performances of NTI process were described in this paper under exposures using ASML NXE:3300 EUV scanner at imec. It is emphasized that 14 nm hp was nicely resolved under exposure dose of 37 mJ/cm2 without any bridge and collapse, which are attributed to the low swelling character of NTI process. Although 13 nm hp resolution was potentially obtained, a pattern collapse still restricts its resolution in case coating resist film thickness is 40 nm. Dark mask limitation due mainly to mask defectivity issue makes NTI with EUV favorable approach for printing block mask to produce logic circuit. A good resolution of CD-X 21 nm/CD-Y 32 nm was obtained for block mask pattern using NTI with usable process window and dose of 49 mJ/cm2. Minimum resolution now reaches CD-X 17 nm / CD-Y 23 nm for the block. A 21 nm block mask resolution was not affected by exposure dose and explored toward low dose down to 18 mJ/cm2 by reducing quencher loading. In addition, there was a negligible amount of increase in LCDU for isolated dot pattern when decreasing exposure dose from 66 mJ/cm2 to 24 mJ/cm2. On the other hand, there appeared tradeoff relationship between LCDU and dose for dense dot pattern, indicating photon-shot noise restriction, but strong dependency on patterning features. Design to improve acid generation efficiency was described based on acid generation mechanism in traditional chemically amplified materials which contains photo-acid generator (PAG) and polymer. Conventional EUV absorber comprises of organic compounds is expected to have 1.6 times higher EUV absorption than polyhydroxystyrene based on calculation. However, observed value of acid amount was comparable or significantly worse than polyhydroxystyrene.
Federal Register 2010, 2011, 2012, 2013, 2014
2010-03-12
... impact of eliminating the correction window from the electronic grant application submission process on... process a temporary error correction window to ensure a smooth and successful transition for applicants. This window provides applicants a period of time beyond the grant application due date to correct any...
Tsuo, S.; Langford, A.A.
1989-03-28
Unwanted build-up of the film deposited on the transparent light-transmitting window of a photochemical vacuum deposition (photo-CVD) chamber is eliminated by flowing an etchant into the part of the photolysis region in the chamber immediately adjacent the window and remote from the substrate and from the process gas inlet. The respective flows of the etchant and the process gas are balanced to confine the etchant reaction to the part of the photolysis region proximate to the window and remote from the substrate. The etchant is preferably one that etches film deposit on the window, does not etch or affect the window itself, and does not produce reaction by-products that are deleterious to either the desired film deposited on the substrate or to the photolysis reaction adjacent the substrate. 3 figs.
Tsuo, Simon; Langford, Alison A.
1989-01-01
Unwanted build-up of the film deposited on the transparent light-transmitting window of a photochemical vacuum deposition (photo-CVD) chamber is eliminated by flowing an etchant into the part of the photolysis region in the chamber immediately adjacent the window and remote from the substrate and from the process gas inlet. The respective flows of the etchant and the process gas are balanced to confine the etchant reaction to the part of the photolysis region proximate to the window and remote from the substrate. The etchant is preferably one that etches film deposit on the window, does not etch or affect the window itself, and does not produce reaction by-products that are deleterious to either the desired film deposited on the substrate or to the photolysis reaction adjacent the substrate.
Dynamically re-configurable CMOS imagers for an active vision system
NASA Technical Reports Server (NTRS)
Yang, Guang (Inventor); Pain, Bedabrata (Inventor)
2005-01-01
A vision system is disclosed. The system includes a pixel array, at least one multi-resolution window operation circuit, and a pixel averaging circuit. The pixel array has an array of pixels configured to receive light signals from an image having at least one tracking target. The multi-resolution window operation circuits are configured to process the image. Each of the multi-resolution window operation circuits processes each tracking target within a particular multi-resolution window. The pixel averaging circuit is configured to sample and average pixels within the particular multi-resolution window.
Lithographic image simulation for the 21st century with 19th-century tools
NASA Astrophysics Data System (ADS)
Gordon, Ronald L.; Rosenbluth, Alan E.
2004-01-01
Simulation of lithographic processes in semiconductor manufacturing has gone from a crude learning tool 20 years ago to a critical part of yield enhancement strategy today. Although many disparate models, championed by equally disparate communities, exist to describe various photoresist development phenomena, these communities would all agree that the one piece of the simulation picture that can, and must, be computed accurately is the image intensity in the photoresist. The imaging of a photomask onto a thin-film stack is one of the only phenomena in the lithographic process that is described fully by well-known, definitive physical laws. Although many approximations are made in the derivation of the Fourier transform relations between the mask object, the pupil, and the image, these and their impacts are well-understood and need little further investigation. The imaging process in optical lithography is modeled as a partially-coherent, Kohler illumination system. As Hopkins has shown, we can separate the computation into 2 pieces: one that takes information about the illumination source, the projection lens pupil, the resist stack, and the mask size or pitch, and the other that only needs the details of the mask structure. As the latter piece of the calculation can be expressed as a fast Fourier transform, it is the first piece that dominates. This piece involves computation of a potentially large number of numbers called Transmission Cross-Coefficients (TCCs), which are correlations of the pupil function weighted with the illumination intensity distribution. The advantage of performing the image calculations this way is that the computation of these TCCs represents an up-front cost, not to be repeated if one is only interested in changing the mask features, which is the case in Model-Based Optical Proximity Correction (MBOPC). The down side, however, is that the number of these expensive double integrals that must be performed increases as the square of the mask unit cell area; this number can cause even the fastest computers to balk if one needs to study medium- or long-range effects. One can reduce this computational burden by approximating with a smaller area, but accuracy is usually a concern, especially when building a model that will purportedly represent a manufacturing process. This work will review the current methodologies used to simulate the intensity distribution in air above the resist and address the above problems. More to the point, a methodology has been developed to eliminate the expensive numerical integrations in the TCC calculations, as the resulting integrals in many cases of interest can be either evaluated analytically, or replaced by analytical functions accurate to within machine precision. With the burden of computing these numbers lightened, more accurate representations of the image field can be realized, and better overall models are then possible.
Layout pattern analysis using the Voronoi diagram of line segments
NASA Astrophysics Data System (ADS)
Dey, Sandeep Kumar; Cheilaris, Panagiotis; Gabrani, Maria; Papadopoulou, Evanthia
2016-01-01
Early identification of problematic patterns in very large scale integration (VLSI) designs is of great value as the lithographic simulation tools face significant timing challenges. To reduce the processing time, such a tool selects only a fraction of possible patterns which have a probable area of failure, with the risk of missing some problematic patterns. We introduce a fast method to automatically extract patterns based on their structure and context, using the Voronoi diagram of line-segments as derived from the edges of VLSI design shapes. Designers put line segments around the problematic locations in patterns called "gauges," along which the critical distance is measured. The gauge center is the midpoint of a gauge. We first use the Voronoi diagram of VLSI shapes to identify possible problematic locations, represented as gauge centers. Then we use the derived locations to extract windows containing the problematic patterns from the design layout. The problematic locations are prioritized by the shape and proximity information of the design polygons. We perform experiments for pattern selection in a portion of a 22-nm random logic design layout. The design layout had 38,584 design polygons (consisting of 199,946 line segments) on layer Mx, and 7079 markers generated by an optical rule checker (ORC) tool. The optical rules specify requirements for printing circuits with minimum dimension. Markers are the locations of some optical rule violations in the layout. We verify our approach by comparing the coverage of our extracted patterns to the ORC-generated markers. We further derive a similarity measure between patterns and between layouts. The similarity measure helps to identify a set of representative gauges that reduces the number of patterns for analysis.
65nm OPC and design optimization by using simple electrical transistor simulation
NASA Astrophysics Data System (ADS)
Trouiller, Yorick; Devoivre, Thierry; Belledent, Jerome; Foussadier, Franck; Borjon, Amandine; Patterson, Kyle; Lucas, Kevin; Couderc, Christophe; Sundermann, Frank; Urbani, Jean-Christophe; Baron, Stanislas; Rody, Yves; Chapon, Jean-Damien; Arnaud, Franck; Entradas, Jorge
2005-05-01
In the context of 65nm logic technology where gate CD control budget requirements are below 5nm, it is mandatory to properly quantify the impact of the 2D effects on the electrical behavior of the transistor [1,2]. This study uses the following sequence to estimate the impact on transistor performance: 1) A lithographic simulation is performed after OPC (Optical Proximity Correction) of active and poly using a calibrated model at best conditions. Some extrapolation of this model can also be used to assess marginalities due to process window (focus, dose, mask errors, and overlay). In our case study, we mainly checked the poly to active misalignment effects. 2) Electrical behavior of the transistor (Ion, Ioff, Vt) is calculated based on a derivative spice model using the simulated image of the gate as an input. In most of the cases Ion analysis, rather than Vt or leakage, gives sufficient information for patterning optimization. We have demonstrated the benefit of this approach with two different examples: -design rule trade-off : we estimated the impact with and without misalignment of critical rules like poly corner to active distance, active corner to poly distance or minimum space between small transistor and big transistor. -Library standard cell debugging: we applied this methodology to the most critical one hundred transistors of our standard cell libraries and calculate Ion behavior with and without misalignment between active and poly. We compared two scanner illumination modes and two OPC versions based on the behavior of the one hundred transistors. We were able to see the benefits of one illumination, and also the improvement in the OPC maturity.
NASA Technical Reports Server (NTRS)
Friedrich, Craig R.; Warrington, Robert O.
1995-01-01
Micromechanical machining processes are those micro fabrication techniques which directly remove work piece material by either a physical cutting tool or an energy process. These processes are direct and therefore they can help reduce the cost and time for prototype development of micro mechanical components and systems. This is especially true for aerospace applications where size and weight are critical, and reliability and the operating environment are an integral part of the design and development process. The micromechanical machining processes are rapidly being recognized as a complementary set of tools to traditional lithographic processes (such as LIGA) for the fabrication of micromechanical components. Worldwide efforts in the U.S., Germany, and Japan are leading to results which sometimes rival lithography at a fraction of the time and cost. Efforts to develop processes and systems specific to aerospace applications are well underway.
MEDEA+ project 2T302 MUSCLE: masks through user's supply chain: leadership by excellence
NASA Astrophysics Data System (ADS)
Torsy, Andreas
2008-04-01
The rapid evolution of our information society depends on the continuous developments and innovations of semiconductor products. The cost per chip functionality keeps reducing by a factor of 2 every 18 month. However, this performance and success of the semiconductor industry critically depends on the quality of the lithographic photomasks. The need for the high quality of photomask drives lithography costs sensitively, which is a key factor in the manufacture of microelectronics devices. Therefore, the aim is to reduce production costs while overcoming challenges in terms of feature sizes, complexity and cycle times. Consequently, lithography processes must provide highest possible quality at reasonable prices. This way, the leadership in the lithographic area can be maintained and European chipmakers can stay competitive with manufacturers in the Far East and the USA. Under the umbrella of MEDEA+, a project called MUSCLE (<< Masks through User's Supply Chain: Leadership by Excellence >>) has been started among leading semiconductor companies in Europe: ALTIS Semiconductor (Project Leader), ALCATEL Vacuum, ATMEL, CEA/LETI, Entegris, NXP Semiconductors, TOPPAN Photomasks, AMTC, Carl ZEISS SMS, DMS, Infineon Technologies, VISTEC Semiconductor, NIKON Precision, SCHOTT Lithotec, ASML, PHOTRONICS, IMEC, DCE, DNP Photomask, STMicroelectronics, XYALIS and iCADA. MUSCLE focuses particularly on mask data flow, photomask carrier, photomask defect characterization and photomask data handling. In this paper, we will discuss potential solutions like standardization and automation of the photomask data flow based on SEMI P10, the performance and the impact of the supply chain parameter within the photomask process, the standardization of photomask defect characterization and a discussion of the impact of new Reticle Enhancement Technologies (RET) such as mask process correction and finally a generic model to describe the photomasks key performance indicators for prototype photomasks.
Tan, T L; Wong, D; Lee, P; Rawat, R S; Patran, A
2004-11-01
Future applications of microelectromechanical systems (MEMS) require lithographic performance of very high aspect ratio. Chemically amplified resists (CARs) such as the negative tone commercial SU-8 provide critical advantages in sensitivity, resolution, and process efficiency in deep ultraviolet, electron-beam, and X-ray lithographies (XRLs), which result in a very high aspect ratio. In this investigation, an SU-8 resist was characterized and optimized for X-ray lithographic applications by studying the cross-linking process of the resist under different conditions of resist thickness and X-ray exposure dose. The exposure dose of soft X-ray (SXR) irradiation at the average weighted wavelength of 1.20 nm from a plasma focus device ranges from 100 to 1600 mJ/cm(2) on the resist surface. Resist thickness varies from 3.5 to 15 mum. The cross-linking process of the resist during post-exposure bake (PEB) was accurately monitored using Fourier transform infrared (FT-IR) spectroscopy. The infrared absorption peaks at 862, 914, 972, and 1128 cm(-1) in the spectrum of the SU-8 resist were found to be useful indicators for the completion of cross-linking in the resist. Results of the experiments showed that the cross-linking of SU-8 was optimized at the exposure dose of 800 mJ/cm(2) for resist thicknesses of 3.5, 9.5, and 15 microm. PEB temperature was set at 95 degrees C and time at 3 min. The resist thickness was measured using interference patterns in the FT-IR spectra of the resist. Test structures with an aspect ratio 3:1 on 10 microm thick SU-8 resist film were obtained using scanning electron microscopy (SEM).
Ahmad, Muneer; Jung, Low Tan; Bhuiyan, Al-Amin
2017-10-01
Digital signal processing techniques commonly employ fixed length window filters to process the signal contents. DNA signals differ in characteristics from common digital signals since they carry nucleotides as contents. The nucleotides own genetic code context and fuzzy behaviors due to their special structure and order in DNA strand. Employing conventional fixed length window filters for DNA signal processing produce spectral leakage and hence results in signal noise. A biological context aware adaptive window filter is required to process the DNA signals. This paper introduces a biological inspired fuzzy adaptive window median filter (FAWMF) which computes the fuzzy membership strength of nucleotides in each slide of window and filters nucleotides based on median filtering with a combination of s-shaped and z-shaped filters. Since coding regions cause 3-base periodicity by an unbalanced nucleotides' distribution producing a relatively high bias for nucleotides' usage, such fundamental characteristic of nucleotides has been exploited in FAWMF to suppress the signal noise. Along with adaptive response of FAWMF, a strong correlation between median nucleotides and the Π shaped filter was observed which produced enhanced discrimination between coding and non-coding regions contrary to fixed length conventional window filters. The proposed FAWMF attains a significant enhancement in coding regions identification i.e. 40% to 125% as compared to other conventional window filters tested over more than 250 benchmarked and randomly taken DNA datasets of different organisms. This study proves that conventional fixed length window filters applied to DNA signals do not achieve significant results since the nucleotides carry genetic code context. The proposed FAWMF algorithm is adaptive and outperforms significantly to process DNA signal contents. The algorithm applied to variety of DNA datasets produced noteworthy discrimination between coding and non-coding regions contrary to fixed window length conventional filters. Copyright © 2017 Elsevier B.V. All rights reserved.
Window and Overlap Processing Effects on Power Estimates from Spectra
NASA Astrophysics Data System (ADS)
Trethewey, M. W.
2000-03-01
Fast Fourier transform (FFT) spectral processing is based on the assumption of stationary ergodic data. In engineering practice, the assumption is often violated and non-stationary data processed. Data windows are commonly used to reduce leakage by decreasing the signal amplitudes near the boundaries of the discrete samples. With certain combinations of non-stationary signals and windows, the temporal weighting may attenuate important signal characteristics to adversely affect any subsequent processing. In other words, the window artificially reduces a significant section of the time signal. Consequently, spectra and overall power estimated from the affected samples are unreliable. FFT processing can be particularly problematic when the signal consists of randomly occurring transients superimposed on a more continuous signal. Overlap processing is commonly used in this situation to improve the estimates. However, the results again depend on the temporal character of the signal in relation to the window weighting. A worst-case scenario, a short-duration half sine pulse, is used to illustrate the relationship between overlap percentage and resulting power estimates. The power estimates are shown to depend on the temporal behaviour of the square of overlapped window segments. An analysis shows that power estimates may be obtained to within 0.27 dB for the following windows and overlap combinations: rectangular (0% overlap), Hanning (62.5% overlap), Hamming (60.35% overlap) and flat-top (82.25% overlap).
Sanders, David M.; Decker, Derek E.
1999-01-01
Optical patterns and lithographic techniques are used as part of a process to embed parallel and evenly spaced conductors in the non-planar surfaces of an insulator to produce high gradient insulators. The approach extends the size that high gradient insulating structures can be fabricated as well as improves the performance of those insulators by reducing the scale of the alternating parallel lines of insulator and conductor along the surface. This fabrication approach also substantially decreases the cost required to produce high gradient insulators.
Measurement of minority carrier diffusion lengths in GaAs nanowires by a nanoprobe technique
DOE Office of Scientific and Technical Information (OSTI.GOV)
Darbandi, A.; Watkins, S. P., E-mail: simonw@sfu.ca
Minority carrier diffusion lengths in both p-type and n-type GaAs nanowires were studied using electron beam induced current by means of a nanoprobe technique without lithographic processing. The diffusion lengths were determined for Au/GaAs rectifying junctions as well as axial p-n junctions. By incorporating a thin lattice-matched InGaP passivating shell, a 2-fold enhancement in the minority carrier diffusion lengths and one order of magnitude reduction in the surface recombination velocity were achieved.
Advanced scanning probe lithography.
Garcia, Ricardo; Knoll, Armin W; Riedo, Elisa
2014-08-01
The nanoscale control afforded by scanning probe microscopes has prompted the development of a wide variety of scanning-probe-based patterning methods. Some of these methods have demonstrated a high degree of robustness and patterning capabilities that are unmatched by other lithographic techniques. However, the limited throughput of scanning probe lithography has prevented its exploitation in technological applications. Here, we review the fundamentals of scanning probe lithography and its use in materials science and nanotechnology. We focus on robust methods, such as those based on thermal effects, chemical reactions and voltage-induced processes, that demonstrate a potential for applications.
Phylogeny mandalas of birds using the lithographs of John Gould's folio bird books.
Hasegawa, Masami; Kuroda, Sayako
2017-12-01
The phylogeny mandala, which is a circular phylogeny with photos or drawings of species, is a suitable way to show visually how the biodiversity has developed in the course of evolution as clarified by the molecular phylogenetics. In this article, in order to demonstrate the recent progress of avian molecular phylogenetics, six phylogeny mandalas of various taxonomic groups of birds are presented with the lithographs of John Gould's folio bird books; i.e., (1) whole Aves, (2) Passeriformes, (3) Paradisaeidae in Corvoidea (Passeriformes), (4) Meliphagoidea (Passeriformes), (5) Trochili in Apodiformes, and (6) Galliformes. Copyright © 2016 Elsevier Inc. All rights reserved.
Lithographed spectrometers for tomographic line mapping of the Epoch of Reionization
NASA Astrophysics Data System (ADS)
O'Brient, R.; Bock, J. J.; Bradford, C. M.; Crites, A.; Duan, R.; Hailey-Dunsheath, S.; Hunacek, J.; LeDuc, R.; Shirokoff, E.; Staniszewski, Z.; Turner, A.; Zemcov, M.
2014-08-01
The Tomographic Ionized carbon Mapping Experiment (TIME) is a multi-phased experiment that will topographically map [CII] emission from the Epoch of Reionization. We are developing lithographed spectrometers that couple to TES bolometers in anticipation of the second generation instrument. Our design intentionally mirrors many features of the parallel SuperSpec project, inductively coupling power from a trunk-line microstrip onto half-wave resonators. The resonators couple to a rat-race hybrids that feeds TES bolometers. Our 25 channel prototype shows spectrally positioned lines roughly matching design with a receiver optical efficiency of 15-20%, a level that is dominated by loss in components outside the spectrometer.
From lattice Hamiltonians to tunable band structures by lithographic design
NASA Astrophysics Data System (ADS)
Tadjine, Athmane; Allan, Guy; Delerue, Christophe
2016-08-01
Recently, new materials exhibiting exotic band structures characterized by Dirac cones, nontrivial flat bands, and band crossing points have been proposed on the basis of effective two-dimensional lattice Hamiltonians. Here, we show using atomistic tight-binding calculations that these theoretical predictions could be experimentally realized in the conduction band of superlattices nanolithographed in III-V and II-VI semiconductor ultrathin films. The lithographed patterns consist of periodic lattices of etched cylindrical holes that form potential barriers for the electrons in the quantum well. In the case of honeycomb lattices, the conduction minibands of the resulting artificial graphene host several Dirac cones and nontrivial flat bands. Similar features, but organized in different ways, in energy or in k -space are found in kagome, distorted honeycomb, and Lieb superlattices. Dirac cones extending over tens of meV could be obtained in superlattices with reasonable sizes of the lithographic patterns, for instance in InAs/AlSb heterostructures. Bilayer artificial graphene could be also realized by lithography of a double quantum-well heterostructure. These new materials should be interesting for the experimental exploration of Dirac-based quantum systems, for both fundamental and applied physics.
Letter-sound processing deficits in children with developmental dyslexia: An ERP study.
Moll, Kristina; Hasko, Sandra; Groth, Katharina; Bartling, Jürgen; Schulte-Körne, Gerd
2016-04-01
The time course during letter-sound processing was investigated in children with developmental dyslexia (DD) and typically developing (TD) children using electroencephalography. Thirty-eight children with DD and 25 TD children participated in a visual-auditory oddball paradigm. Event-related potentials (ERPs) elicited by standard and deviant stimuli in an early (100-190 ms) and late (560-750 ms) time window were analysed. In the early time window, ERPs elicited by the deviant stimulus were delayed and less left lateralized over fronto-temporal electrodes for children with DD compared to TD children. In the late time window, children with DD showed higher amplitudes extending more over right frontal electrodes. Longer latencies in the early time window and stronger right hemispheric activation in the late time window were associated with slower reading and naming speed. Additionally, stronger right hemispheric activation in the late time window correlated with poorer phonological awareness skills. Deficits in early stages of letter-sound processing influence later more explicit cognitive processes during letter-sound processing. Identifying the neurophysiological correlates of letter-sound processing and their relation to reading related skills provides insight into the degree of automaticity during letter-sound processing beyond behavioural measures of letter-sound-knowledge. Copyright © 2016 International Federation of Clinical Neurophysiology. Published by Elsevier Ireland Ltd. All rights reserved.
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Computed Tomography Window Blending: Feasibility in Thoracic Trauma.
Mandell, Jacob C; Wortman, Jeremy R; Rocha, Tatiana C; Folio, Les R; Andriole, Katherine P; Khurana, Bharti
2018-02-07
This study aims to demonstrate the feasibility of processing computed tomography (CT) images with a custom window blending algorithm that combines soft-tissue, bone, and lung window settings into a single image; to compare the time for interpretation of chest CT for thoracic trauma with window blending and conventional window settings; and to assess diagnostic performance of both techniques. Adobe Photoshop was scripted to process axial DICOM images from retrospective contrast-enhanced chest CTs performed for trauma with a window-blending algorithm. Two emergency radiologists independently interpreted the axial images from 103 chest CTs with both blended and conventional windows. Interpretation time and diagnostic performance were compared with Wilcoxon signed-rank test and McNemar test, respectively. Agreement with Nexus CT Chest injury severity was assessed with the weighted kappa statistic. A total of 13,295 images were processed without error. Interpretation was faster with window blending, resulting in a 20.3% time saving (P < .001), with no difference in diagnostic performance, within the power of the study to detect a difference in sensitivity of 5% as determined by post hoc power analysis. The sensitivity of the window-blended cases was 82.7%, compared to 81.6% for conventional windows. The specificity of the window-blended cases was 93.1%, compared to 90.5% for conventional windows. All injuries of major clinical significance (per Nexus CT Chest criteria) were correctly identified in all reading sessions, and all negative cases were correctly classified. All readers demonstrated near-perfect agreement with injury severity classification with both window settings. In this pilot study utilizing retrospective data, window blending allows faster preliminary interpretation of axial chest CT performed for trauma, with no significant difference in diagnostic performance compared to conventional window settings. Future studies would be required to assess the utility of window blending in clinical practice. Copyright © 2018 The Association of University Radiologists. All rights reserved.
Rausch, Alexander M; Küng, Vera E; Pobel, Christoph; Markl, Matthias; Körner, Carolin
2017-09-22
The resulting properties of parts fabricated by powder bed fusion additive manufacturing processes are determined by their porosity, local composition, and microstructure. The objective of this work is to examine the influence of the stochastic powder bed on the process window for dense parts by means of numerical simulation. The investigations demonstrate the unique capability of simulating macroscopic domains in the range of millimeters with a mesoscopic approach, which resolves the powder bed and the hydrodynamics of the melt pool. A simulated process window reveals the influence of the stochastic powder layer. The numerical results are verified with an experimental process window for selective electron beam-melted Ti-6Al-4V. Furthermore, the influence of the powder bulk density is investigated numerically. The simulations predict an increase in porosity and surface roughness for samples produced with lower powder bulk densities. Due to its higher probability for unfavorable powder arrangements, the process stability is also decreased. This shrinks the actual parameter range in a process window for producing dense parts.
Rausch, Alexander M.; Küng, Vera E.; Pobel, Christoph; Körner, Carolin
2017-01-01
The resulting properties of parts fabricated by powder bed fusion additive manufacturing processes are determined by their porosity, local composition, and microstructure. The objective of this work is to examine the influence of the stochastic powder bed on the process window for dense parts by means of numerical simulation. The investigations demonstrate the unique capability of simulating macroscopic domains in the range of millimeters with a mesoscopic approach, which resolves the powder bed and the hydrodynamics of the melt pool. A simulated process window reveals the influence of the stochastic powder layer. The numerical results are verified with an experimental process window for selective electron beam-melted Ti-6Al-4V. Furthermore, the influence of the powder bulk density is investigated numerically. The simulations predict an increase in porosity and surface roughness for samples produced with lower powder bulk densities. Due to its higher probability for unfavorable powder arrangements, the process stability is also decreased. This shrinks the actual parameter range in a process window for producing dense parts. PMID:28937633
Vertically aligned multiwalled carbon nanotubes for pressure, tactile and vibration sensing.
Yilmazoglu, O; Popp, A; Pavlidis, D; Schneider, J J; Garth, D; Schüttler, F; Battenberg, G
2012-03-02
We report a simple method for the micro-nano integration of flexible, vertically aligned multiwalled CNT arrays sandwiched between a top and bottom carbon layer via a porous alumina (Al(2)O(3)) template approach. The electromechanical properties of the flexible CNT arrays have been investigated under mechanical stress conditions. First experiments show highly sensitive piezoresistive sensors with a resistance decrease of up to ∼35% and a spatial resolution of <1 mm. The results indicate that these CNT structures can be utilized for tactile sensing components. They also confirm the feasibility of accessing and utilizing nanoscopic CNT bundles via lithographic processing. The method involves room-temperature processing steps and standard microfabrication techniques.
Park, Sung-Hoon; Lee, Sangeui; Moreira, David; Bandaru, Prabhakar R.; Han, InTaek; Yun, Dong-Jin
2015-01-01
A simple, scalable, non-lithographic, technique for fabricating durable superhydrophobic (SH) surfaces, based on the fingering instabilities associated with non-Newtonian flow and shear tearing, has been developed. The high viscosity of the nanotube/elastomer paste has been exploited for the fabrication. The fabricated SH surfaces had the appearance of bristled shark skin and were robust with respect to mechanical forces. While flow instability is regarded as adverse to roll-coating processes for fabricating uniform films, we especially use the effect to create the SH surface. Along with their durability and self-cleaning capabilities, we have demonstrated drag reduction effects of the fabricated films through dynamic flow measurements. PMID:26490133
Park, Sung-Hoon; Lee, Sangeui; Moreira, David; Bandaru, Prabhakar R; Han, InTaek; Yun, Dong-Jin
2015-10-22
A simple, scalable, non-lithographic, technique for fabricating durable superhydrophobic (SH) surfaces, based on the fingering instabilities associated with non-Newtonian flow and shear tearing, has been developed. The high viscosity of the nanotube/elastomer paste has been exploited for the fabrication. The fabricated SH surfaces had the appearance of bristled shark skin and were robust with respect to mechanical forces. While flow instability is regarded as adverse to roll-coating processes for fabricating uniform films, we especially use the effect to create the SH surface. Along with their durability and self-cleaning capabilities, we have demonstrated drag reduction effects of the fabricated films through dynamic flow measurements.
Technological innovations for a sustainable business model in the semiconductor industry
NASA Astrophysics Data System (ADS)
Levinson, Harry J.
2014-09-01
Increasing costs of wafer processing, particularly for lithographic processes, have made it increasingly difficult to achieve simultaneous reductions in cost-per-function and area per device. Multiple patterning techniques have made possible the fabrication of circuit layouts below the resolution limit of single optical exposures but have led to significant increases in the costs of patterning. Innovative techniques, such as self-aligned double patterning (SADP) have enabled good device performance when using less expensive patterning equipment. Other innovations have directly reduced the cost of manufacturing. A number of technical challenges must be overcome to enable a return to single-exposure patterning using short wavelength optical techniques, such as EUV patterning.
NASA Astrophysics Data System (ADS)
Ponce-Lee, E. L.; Olivares-Pérez, A.; Fuentes-Tapia, I.
2004-06-01
Computer holograms made with sugar crystals are reported. This material is well known as a good sweetener; the sugar from sugar cane or sugar beet (sucrose). These sweetener can be applied as honey "water and diluted sugar" easily on any substrate such as plastics or glasses without critical conditions for developed process. This step corresponds only to the cured sucrose as a photopolymer process. The maximum absorption spectra is localized at UV region λ=240 nm. We record with lithographic techniques some gratings, showing a good diffraction efficiency around 45%. This material has good resolution to make diffraction gratings. These properties are attractive because they open the possibility to make phase holograms on candies. Mainly the phase modulation is by refraction index.
How to obtain accurate resist simulations in very low-k1 era?
NASA Astrophysics Data System (ADS)
Chiou, Tsann-Bim; Park, Chan-Ha; Choi, Jae-Seung; Min, Young-Hong; Hansen, Steve; Tseng, Shih-En; Chen, Alek C.; Yim, Donggyu
2006-03-01
A procedure for calibrating a resist model iteratively adjusts appropriate parameters until the simulations of the model match the experimental data. The tunable parameters may include the shape of the illuminator, the geometry and transmittance/phase of the mask, light source and scanner-related parameters that affect imaging quality, resist process control and most importantly the physical/chemical factors in the resist model. The resist model can be accurately calibrated by measuring critical dimensions (CD) of a focus-exposure matrix (FEM) and the technique has been demonstrated to be very successful in predicting lithographic performance. However, resist model calibration is more challenging in the low k1 (<0.3) regime because numerous uncertainties, such as mask and resist CD metrology errors, are becoming too large to be ignored. This study demonstrates a resist model calibration procedure for a 0.29 k1 process using a 6% halftone mask containing 2D brickwall patterns. The influence of different scanning electron microscopes (SEM) and their wafer metrology signal analysis algorithms on the accuracy of the resist model is evaluated. As an example of the metrology issue of the resist pattern, the treatment of a sidewall angle is demonstrated for the resist line ends where the contrast is relatively low. Additionally, the mask optical proximity correction (OPC) and corner rounding are considered in the calibration procedure that is based on captured SEM images. Accordingly, the average root-mean-square (RMS) error, which is the difference between simulated and experimental CDs, can be improved by considering the metrological issues. Moreover, a weighting method and a measured CD tolerance are proposed to handle the different CD variations of the various edge points of the wafer resist pattern. After the weighting method is implemented and the CD selection criteria applied, the RMS error can be further suppressed. Therefore, the resist CD and process window can be confidently evaluated using the accurately calibrated resist model. One of the examples simulates the sensitivity of the mask pattern error, which is helpful to specify the mask CD control.
Biorecognition by DNA oligonucleotides after Exposure to Photoresists and Resist Removers
Dean, Stacey L.; Morrow, Thomas J.; Patrick, Sue; Li, Mingwei; Clawson, Gary; Mayer, Theresa S.; Keating, Christine D.
2013-01-01
Combining biological molecules with integrated circuit technology is of considerable interest for next generation sensors and biomedical devices. Current lithographic microfabrication methods, however, were developed for compatibility with silicon technology rather than bioorganic molecules and consequently it cannot be assumed that biomolecules will remain attached and intact during on-chip processing. Here, we evaluate the effects of three common photoresists (Microposit S1800 series, PMGI SF6, and Megaposit SPR 3012) and two photoresist removers (acetone and 1165 remover) on the ability of surface-immobilized DNA oligonucleotides to selectively recognize their reverse-complementary sequence. Two common DNA immobilization methods were compared: adsorption of 5′-thiolated sequences directly to gold nanowires and covalent attachment of 5′-thiolated sequences to surface amines on silica coated nanowires. We found that acetone had deleterious effects on selective hybridization as compared to 1165 remover, presumably due to incomplete resist removal. Use of the PMGI photoresist, which involves a high temperature bake step, was detrimental to the later performance of nanowire-bound DNA in hybridization assays, especially for DNA attached via thiol adsorption. The other three photoresists did not substantially degrade DNA binding capacity or selectivity for complementary DNA sequences. To determine if the lithographic steps caused more subtle damage, we also tested oligonucleotides containing a single base mismatch. Finally, a two-step photolithographic process was developed and used in combination with dielectrophoretic nanowire assembly to produce an array of doubly-contacted, electrically isolated individual nanowire components on a chip. Post-fabrication fluorescence imaging indicated that nanowire-bound DNA was present and able to selectively bind complementary strands. PMID:23952639
Applications of dewetting in micro and nanotechnology.
Gentili, Denis; Foschi, Giulia; Valle, Francesco; Cavallini, Massimiliano; Biscarini, Fabio
2012-06-21
Dewetting is a spontaneous phenomenon where a thin film on a surface ruptures into an ensemble of separated objects, like droplets, stripes, and pillars. Spatial correlations with characteristic distance and object size emerge spontaneously across the whole dewetted area, leading to regular motifs with long-range order. Characteristic length scales depend on film thickness, which is a convenient and robust technological parameter. Dewetting is therefore an attractive paradigm for organizing a material into structures of well-defined micro- or nanometre-size, precisely positioned on a surface, thus avoiding lithographical processes. This tutorial review introduces the reader to the physical-chemical basis of dewetting, shows how the dewetting process can be applied to different functional materials with relevance in technological applications, and highlights the possible strategies to control the length scales of the dewetting process.
Landsat Image Map Production Methods at the U. S. Geological Survey
Kidwell, R.D.; Binnie, D.R.; Martin, S.
1987-01-01
To maintain consistently high quality in satellite image map production, the U. S. Geological Survey (USGS) has developed standard procedures for the photographic and digital production of Landsat image mosaics, and for lithographic printing of multispectral imagery. This paper gives a brief review of the photographic, digital, and lithographic procedures currently in use for producing image maps from Landsat data. It is shown that consistency in the printing of image maps is achieved by standardizing the materials and procedures that affect the image detail and color balance of the final product. Densitometric standards are established by printing control targets using the pressplates, inks, pre-press proofs, and paper to be used for printing.
Platform for Postprocessing Waveform-Based NDE
NASA Technical Reports Server (NTRS)
Roth, Don
2008-01-01
Taking advantage of the similarities that exist among all waveform-based non-destructive evaluation (NDE) methods, a common software platform has been developed containing multiple- signal and image-processing techniques for waveforms and images. The NASA NDE Signal and Image Processing software has been developed using the latest versions of LabVIEW, and its associated Advanced Signal Processing and Vision Toolkits. The software is useable on a PC with Windows XP and Windows Vista. The software has been designed with a commercial grade interface in which two main windows, Waveform Window and Image Window, are displayed if the user chooses a waveform file to display. Within these two main windows, most actions are chosen through logically conceived run-time menus. The Waveform Window has plots for both the raw time-domain waves and their frequency- domain transformations (fast Fourier transform and power spectral density). The Image Window shows the C-scan image formed from information of the time-domain waveform (such as peak amplitude) or its frequency-domain transformation at each scan location. The user also has the ability to open an image, or series of images, or a simple set of X-Y paired data set in text format. Each of the Waveform and Image Windows contains menus from which to perform many user actions. An option exists to use raw waves obtained directly from scan, or waves after deconvolution if system wave response is provided. Two types of deconvolution, time-based subtraction or inverse-filter, can be performed to arrive at a deconvolved wave set. Additionally, the menu on the Waveform Window allows preprocessing of waveforms prior to image formation, scaling and display of waveforms, formation of different types of images (including non-standard types such as velocity), gating of portions of waves prior to image formation, and several other miscellaneous and specialized operations. The menu available on the Image Window allows many further image processing and analysis operations, some of which are found in commercially-available image-processing software programs (such as Adobe Photoshop), and some that are not (removing outliers, Bscan information, region-of-interest analysis, line profiles, and precision feature measurements).
Interior of processing room showing the passthrough window from the ...
Interior of processing room showing the pass-through window from the shucking room. Tally board on the wall was used to keep track of the output of each shucker. Skimming table for rinsing the oyster meat is located under the pass-through window. - J.C. Lore Oyster House, 14430 Solomons Island Road, Solomons, Calvert County, MD
Cancer in printing workers in Denmark.
Lynge, E; Rix, B A; Villadsen, E; Andersen, I; Hink, M; Olsen, E; Møller, U L; Silfverberg, E
1995-01-01
OBJECTIVES--To study the cancer incidence in printing workers in Denmark. METHODS--The cohort of 15,534 men and 3593 women working in the printing industry in 1970 were followed up for death, emigrations, and incident cancer cases until the end of 1987. Their cancer incidence was compared with that of all economically active people in Denmark. The smoking and drinking habits reported by members of the printing trade unions at a survey in 1972 were compared with habits reported by members of other trade unions. RESULTS--Lung, bladder, renal pelvis, and primary liver cancers were in excess among the printing workers. The excess risks of lung cancer among the factory workers in newspaper and magazine production, of bladder cancer in typographers in printing establishments, of renal pelvis cancer in typographers and lithographers, and of primary liver cancer among lithographers and bookbinders exceeded those expected based on the reported smoking and drinking habits. CONCLUSION--Our results indicate, in line with a previous study from Manchester, that work with rotary letterpress printing was associated with an increased risk of lung cancer. The inconsistent results from studies on bladder cancer in printing workers may point to a risk confined to a certain subgroup. The sixfold risk of primary liver cancer in Danish lithographers warrants studies in other countries. PMID:8535493
Removable pellicle for lithographic mask protection and handling
Klebanoff, Leonard E.; Rader, Daniel J.; Hector, Scott D.; Nguyen, Khanh B.; Stulen, Richard H.
2002-01-01
A removable pellicle for a lithographic mask that provides active and robust particle protection, and which utilizes a traditional pellicle and two deployments of thermophoretic protection to keep particles off the mask. The removable pellicle is removably attached via a retaining structure to the mask substrate by magnetic attraction with either contacting or non-contacting magnetic capture mechanisms. The pellicle retaining structural is composed of an anchor piece secured to the mask substrate and a frame member containing a pellicle. The anchor piece and the frame member are in removable contact or non-contact by the magnetic capture or latching mechanism. In one embodiment, the frame member is retained in a floating (non-contact) relation to the anchor piece by magnetic levitation. The frame member and the anchor piece are provided with thermophoretic fins which are interdigitated to prevent particles from reaching the patterned area of the mask. Also, the anchor piece and mask are maintained at a higher temperature than the frame member and pellicle which also prevents particles from reaching the patterned mask area by thermophoresis. The pellicle can be positioned over the mask to provide particle protection during mask handling, inspection, and pumpdown, but which can be removed manually or robotically for lithographic use of the mask.
New machining method of high precision infrared window part
NASA Astrophysics Data System (ADS)
Yang, Haicheng; Su, Ying; Xu, Zengqi; Guo, Rui; Li, Wenting; Zhang, Feng; Liu, Xuanmin
2016-10-01
Most of the spherical shell of the photoelectric multifunctional instrument was designed as multi optical channel mode to adapt to the different band of the sensor, there were mainly TV, laser and infrared channels. Without affecting the optical diameter, wind resistance and pneumatic performance of the optical system, the overall layout of the spherical shell was optimized to save space and reduce weight. Most of the shape of the optical windows were special-shaped, each optical window directly participated in the high resolution imaging of the corresponding sensor system, and the optical axis parallelism of each sensor needed to meet the accuracy requirement of 0.05mrad.Therefore precision machining of optical window parts quality will directly affect the photoelectric system's pointing accuracy and interchangeability. Processing and testing of the TV and laser window had been very mature, while because of the special nature of the material, transparent and high refractive rate, infrared window parts had the problems of imaging quality and the control of the minimum focal length and second level parallel in the processing. Based on years of practical experience, this paper was focused on how to control the shape and parallel difference precision of infrared window parts in the processing. Single pass rate was increased from 40% to more than 95%, the processing efficiency was significantly enhanced, an effective solution to the bottleneck problem in the actual processing, which effectively solve the bottlenecks in research and production.
Tsai, Kuo-Ming; Wang, He-Yi
2014-08-20
This study focuses on injection molding process window determination for obtaining optimal imaging optical properties, astigmatism, coma, and spherical aberration using plastic lenses. The Taguchi experimental method was first used to identify the optimized combination of parameters and significant factors affecting the imaging optical properties of the lens. Full factorial experiments were then implemented based on the significant factors to build the response surface models. The injection molding process windows for lenses with optimized optical properties were determined based on the surface models, and confirmation experiments were performed to verify their validity. The results indicated that the significant factors affecting the optical properties of lenses are mold temperature, melt temperature, and cooling time. According to experimental data for the significant factors, the oblique ovals for different optical properties on the injection molding process windows based on melt temperature and cooling time can be obtained using the curve fitting approach. The confirmation experiments revealed that the average errors for astigmatism, coma, and spherical aberration are 3.44%, 5.62%, and 5.69%, respectively. The results indicated that the process windows proposed are highly reliable.
Novel process windows for enabling, accelerating, and uplifting flow chemistry.
Hessel, Volker; Kralisch, Dana; Kockmann, Norbert; Noël, Timothy; Wang, Qi
2013-05-01
Novel Process Windows make use of process conditions that are far from conventional practices. This involves the use of high temperatures, high pressures, high concentrations (solvent-free), new chemical transformations, explosive conditions, and process simplification and integration to boost synthetic chemistry on both the laboratory and production scale. Such harsh reaction conditions can be safely reached in microstructured reactors due to their excellent transport intensification properties. This Review discusses the different routes towards Novel Process Windows and provides several examples for each route grouped into different classes of chemical and process-design intensification. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
LC Filters for FDM Readout of the X-IFU TES Calorimeter Instrument on Athena
NASA Astrophysics Data System (ADS)
Bruijn, Marcel P.; van der Linden, Anton J.; Ferrari, Lorenza; Gottardi, Luciano; van der Kuur, Jan; den Hartog, Roland H.; Akamatsu, Hiroki; Jackson, Brian D.
2018-05-01
The current status of lithographic superconducting LC filters for use in the Athena-X-IFU instrument is described. We present the fabrication process and characterization results at room temperature, 4 K and 50 mK. We also present an optimization study of the quality topics, where finite element modeling is used together with experimental validation structures. For the a-Si:H-based capacitors and Nb-based coils, presently the component fabrication yield is about 99% and the effective series resistance at 50 mK is lower than 1.5 mΩ.
Micromachined integrated quantum circuit containing a superconducting qubit
NASA Astrophysics Data System (ADS)
Brecht, Teresa; Chu, Yiwen; Axline, Christopher; Pfaff, Wolfgang; Blumoff, Jacob; Chou, Kevin; Krayzman, Lev; Frunzio, Luigi; Schoelkopf, Robert
We demonstrate a functional multilayer microwave integrated quantum circuit (MMIQC). This novel hardware architecture combines the high coherence and isolation of three-dimensional structures with the advantages of integrated circuits made with lithographic techniques. We present fabrication and measurement of a two-cavity/one-qubit prototype, including a transmon coupled to a three-dimensional microwave cavity micromachined in a silicon wafer. It comprises a simple MMIQC with competitive lifetimes and the ability to perform circuit QED operations in the strong dispersive regime. Furthermore, the design and fabrication techniques that we have developed are extensible to more complex quantum information processing devices.
Carbon contamination topography analysis of EUV masks
DOE Office of Scientific and Technical Information (OSTI.GOV)
Fan, Y.-J.; Yankulin, L.; Thomas, P.
2010-03-12
The impact of carbon contamination on extreme ultraviolet (EUV) masks is significant due to throughput loss and potential effects on imaging performance. Current carbon contamination research primarily focuses on the lifetime of the multilayer surfaces, determined by reflectivity loss and reduced throughput in EUV exposure tools. However, contamination on patterned EUV masks can cause additional effects on absorbing features and the printed images, as well as impacting the efficiency of cleaning process. In this work, several different techniques were used to determine possible contamination topography. Lithographic simulations were also performed and the results compared with the experimental data.
Improved mask-based CD uniformity for gridded-design-rule lithography
NASA Astrophysics Data System (ADS)
Faivishevsky, Lev; Khristo, Sergey; Sagiv, Amir; Mangan, Shmoolik
2009-03-01
The difficulties encountered during lithography of state-of-the-art 2D patterns are formidable, and originate from the fact that deep sub-wavelength features are being printed. This results in a practical limit of k1 >=0.4 as well as a multitude of complex restrictive design rules, in order to mitigate or minimize lithographic hot spots. An alternative approach, that is gradually attracting the lithographic community's attention, restricts the design of critical layers to straight, dense lines (a 1D grid), that can be relatively easily printed using current lithographic technology. This is then followed by subsequent, less critical trimming stages to obtain circuit functionality. Thus, the 1D gridded approach allows hotspot-free, proximity-effect free lithography of ultra low- k1 features. These advantages must be supported by a stable CD control mechanism. One of the overriding parameters impacting CDU performance is photo mask quality. Previous publications have demonstrated that IntenCDTM - a novel, mask-based CDU mapping technology running on Applied Materials' Aera2TM aerial imaging mask inspection tool - is ideally fit for detecting mask-based CDU issues in 1D (L&S) patterned masks for memory production. Owing to the aerial nature of image formation, IntenCD directly probes the CD as it is printed on the wafer. In this paper we suggest that IntenCD is naturally fit for detecting mask-based CDU issues in 1D GDR masks. We then study a novel method of recovering and quantifying the physical source of printed CDU, using a novel implementation of the IntenCD technology. We demonstrate that additional, simple measurements, which can be readily performed on board the Aera2TM platform with minimal throughput penalty, may complement IntenCD and allow a robust estimation of the specific nature and strength of mask error source, such as pattern width variation or phase variation, which leads to CDU issues on the printed wafer. We finally discuss the roles played by IntenCD in advanced GDR mask production, starting with tight control over mask production process, continuing to mask qualification at mask shop and ending at in-line wafer CDU correction in fabs.
Microeconomics of process control in semiconductor manufacturing
NASA Astrophysics Data System (ADS)
Monahan, Kevin M.
2003-06-01
Process window control enables accelerated design-rule shrinks for both logic and memory manufacturers, but simple microeconomic models that directly link the effects of process window control to maximum profitability are rare. In this work, we derive these links using a simplified model for the maximum rate of profit generated by the semiconductor manufacturing process. We show that the ability of process window control to achieve these economic objectives may be limited by variability in the larger manufacturing context, including measurement delays and process variation at the lot, wafer, x-wafer, x-field, and x-chip levels. We conclude that x-wafer and x-field CD control strategies will be critical enablers of density, performance and optimum profitability at the 90 and 65nm technology nodes. These analyses correlate well with actual factory data and often identify millions of dollars in potential incremental revenue and cost savings. As an example, we show that a scatterometry-based CD Process Window Monitor is an economically justified, enabling technology for the 65nm node.
Extrinsic germanium Blocked Impurity Bank (BIB) detectors
NASA Technical Reports Server (NTRS)
Krabach, Timothy N.; Huffman, James E.; Watson, Dan M.
1989-01-01
Ge:Ga blocked-impurity-band (BIB) detectors with long wavelength thresholds greater than 190 microns and peak quantum efficiencies of 4 percent, at an operating temperature of 1.8 K, have been fabricated. These proof of concept devices consist of a high purity germanium blocking layer epitaxially grown on a Ga-doped Ge substrate. This demonstration of BIB behavior in germanium enables the development of far infrared detector arrays similar to the current silicon-based devices. Present efforts are focussed on improving the chemical vapor deposition process used to create the blocking layer and on the lithographic processing required to produce monolithic detector arrays in germanium. Approaches to test the impurity levels in both the blocking and active layers are considered.
Three-dimensional laser window formation
NASA Technical Reports Server (NTRS)
Verhoff, Vincent G.
1992-01-01
The NASA Lewis Research Center has developed and implemented a unique process for forming flawless three-dimensional laser windows. These windows represent a major part of specialized, nonintrusive laser data acquisition systems used in a variety of compressor and turbine research test facilities. This report discusses in detail the aspects of three-dimensional laser window formation. It focuses on the unique methodology and the peculiarities associated with the formation of these windows. Included in this discussion are the design criteria, bonding mediums, and evaluation testing for three-dimensional laser windows.
Compound curvature laser window development
NASA Technical Reports Server (NTRS)
Verhoff, Vincent G.
1993-01-01
The NASA Lewis Research Center has developed and implemented a unique process for forming flawless compound curvature laser windows. These windows represent a major part of specialized, nonintrusive laser data acquisition systems used in a variety of compressor and turbine research test facilities. This report summarizes the main aspects of compound curvature laser window development. It is an overview of the methodology and the peculiarities associated with the formulation of these windows. Included in this discussion is new information regarding procedures for compound curvature laser window development.
Foundations of low-temperature plasma enhanced materials synthesis and etching
NASA Astrophysics Data System (ADS)
Oehrlein, Gottlieb S.; Hamaguchi, Satoshi
2018-02-01
Low temperature plasma (LTP)-based synthesis of advanced materials has played a transformational role in multiple industries, including the semiconductor industry, liquid crystal displays, coatings and renewable energy. Similarly, the plasma-based transfer of lithographically defined resist patterns into other materials, e.g. silicon, SiO2, Si3N4 and other electronic materials, has led to the production of nanometer scale devices that are the basis of the information technology, microsystems, and many other technologies based on patterned films or substrates. In this article we review the scientific foundations of both LTP-based materials synthesis at low substrate temperature and LTP-based isotropic and directional etching used to transfer lithographically produced resist patterns into underlying materials. We cover the fundamental principles that are the basis of successful application of the LTP techniques to technological uses and provide an understanding of technological factors that may control or limit material synthesis or surface processing with the use of LTP. We precede these sections with a general discussion of plasma surface interactions, the LTP-generated particle fluxes including electrons, ions, radicals, excited neutrals and photons that simultaneously contact and modify surfaces. The surfaces can be in the line of sight of the discharge or hidden from direct interaction for structured substrates. All parts of the article are extensively referenced, which is intended to help the reader study the topics discussed here in more detail.
Lithographically fabricated gold nanowire waveguides for plasmonic routers and logic gates.
Gao, Long; Chen, Li; Wei, Hong; Xu, Hongxing
2018-06-14
Fabricating plasmonic nanowire waveguides and circuits by lithographic fabrication methods is highly desired for nanophotonic circuitry applications. Here we report an approach for fabricating metal nanowire networks by using electron beam lithography and metal film deposition techniques. The gold nanowire structures are fabricated on quartz substrates without using any adhesion layer but coated with a thin layer of Al2O3 film for immobilization. The thermal annealing during the Al2O3 deposition process decreases the surface plasmon loss. In a Y-shaped gold nanowire network, the surface plasmons can be routed to different branches by controlling the polarization of the excitation light, and the routing behavior is dependent on the length of the main nanowire. Simulated electric field distributions show that the zigzag distribution of the electric field in the nanowire network determines the surface plasmon routing. By using two laser beams to excite surface plasmons in a Y-shaped nanowire network, the output intensity can be modulated by the interference of surface plasmons, which can be used to design Boolean logic gates. We experimentally demonstrate that AND, OR, XOR and NOT gates can be realized in three-terminal nanowire networks, and NAND, NOR and XNOR gates can be realized in four-terminal nanowire networks. This work takes a step toward the fabrication of on-chip integrated plasmonic circuits.
Potential roughness near lithographically fabricated atom chips
DOE Office of Scientific and Technical Information (OSTI.GOV)
Krueger, P.; Laboratoire Kastler Brossel, Ecole Normale Superieure, 24 Rue Lhomond, F-75005 Paris; Andersson, L. M.
2007-12-15
Potential roughness has been reported to severely impair experiments in magnetic microtraps. We show that these obstacles can be overcome as we measure disorder potentials that are reduced by two orders of magnitude near lithographically patterned high-quality gold layers on semiconductor atom chip substrates. The spectrum of the remaining field variations exhibits a favorable scaling. A detailed analysis of the magnetic field roughness of a 100-{mu}m-wide wire shows that these potentials stem from minute variations of the current flow caused by local properties of the wire rather than merely from rough edges. A technique for further reduction of potential roughnessmore » by several orders of magnitude based on time-orbiting magnetic fields is outlined.« less
A novel approach: high resolution inspection with wafer plane defect detection
NASA Astrophysics Data System (ADS)
Hess, Carl; Wihl, Mark; Shi, Rui-fang; Xiong, Yalin; Pang, Song
2008-05-01
High Resolution reticle inspection is well-established as a proven, effective, and efficient means of detecting yield-limiting mask defects as well as defects which are not immediately yield-limiting yet can enable manufacturing process improvements. Historically, RAPID products have enabled detection of both classes of these defects. The newly-developed Wafer Plane Inspection (WPI) detector technology meets the needs of some advanced mask manufacturers to identify the lithographically-significant defects while ignoring the other non-lithographically-significant defects. Wafer Plane Inspection accomplishes this goal by performing defect detection based on a modeled image of how the mask features would actually print in the photoresist. This has the effect of reducing sensitivity to non-printing defects while enabling higher sensitivity focused in high MEEF areas where small reticle defects still yield significant printing defects on wafers. WPI is a new inspection mode that has been developed by KLA-Tencor and is currently under test with multiple customers. It employs the same transmitted and reflected-light high-resolution images as the industry-standard high-resolution inspections, but with much more sophisticated processing involved. A rigorous mask pattern recovery algorithm is used to convert the transmitted and reflected light images into a modeled representation of the reticle. Lithographic modeling of the scanner is then used to generate an aerial image of the mask. This is followed by resist modeling to determine the exposure of the photoresist. The defect detectors are then applied on this photoresist plane so that only printing defects are detected. Note that no hardware modifications to the inspection system are required to enable this detector. The same tool will be able to perform both our standard High Resolution inspections and the Wafer Plane Inspection detector. This approach has several important features. The ability to ignore non-printing defects and to apply additional effective sensitivity in high MEEF areas enables advanced node development. In addition, the modeling allows the inclusion of important polarization effects that occur in the resist for high NA operation. This allows for the results to better match wafer print results compared to alternate approaches. Finally, the simulation easily allows for the application of arbitrary illumination profiles. With this approach, users of WPI can make use of unique or custom scanner illumination profiles. This allows the more precise modeling of profiles without inspection system hardware modification or loss of company intellectual property. This paper examines WPI in Die:Die mode. Future work includes a review of Die:Database WPI capability.
An argon ion beam milling process for native AlOx layers enabling coherent superconducting contacts
NASA Astrophysics Data System (ADS)
Grünhaupt, Lukas; von Lüpke, Uwe; Gusenkova, Daria; Skacel, Sebastian T.; Maleeva, Nataliya; Schlör, Steffen; Bilmes, Alexander; Rotzinger, Hannes; Ustinov, Alexey V.; Weides, Martin; Pop, Ioan M.
2017-08-01
We present an argon ion beam milling process to remove the native oxide layer forming on aluminum thin films due to their exposure to atmosphere in between lithographic steps. Our cleaning process is readily integrable with conventional fabrication of Josephson junction quantum circuits. From measurements of the internal quality factors of superconducting microwave resonators with and without contacts, we place an upper bound on the residual resistance of an ion beam milled contact of 50 mΩ μm2 at a frequency of 4.5 GHz. Resonators for which only 6% of the total foot-print was exposed to the ion beam milling, in areas of low electric and high magnetic fields, showed quality factors above 106 in the single photon regime, and no degradation compared to single layer samples. We believe these results will enable the development of increasingly complex superconducting circuits for quantum information processing.
Sealed symmetric multilayered microelectronic device package with integral windows
Peterson, Kenneth A.; Watson, Robert D.
2002-01-01
A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.
Turbine component casting core with high resolution region
Kamel, Ahmed; Merrill, Gary B.
2014-08-26
A hollow turbine engine component with complex internal features can include a first region and a second, high resolution region. The first region can be defined by a first ceramic core piece formed by any conventional process, such as by injection molding or transfer molding. The second region can be defined by a second ceramic core piece formed separately by a method effective to produce high resolution features, such as tomo lithographic molding. The first core piece and the second core piece can be joined by interlocking engagement that once subjected to an intermediate thermal heat treatment process thermally deform to form a three dimensional interlocking joint between the first and second core pieces by allowing thermal creep to irreversibly interlock the first and second core pieces together such that the joint becomes physically locked together providing joint stability through thermal processing.
NASA Astrophysics Data System (ADS)
Welch, Kevin; Leonard, Jerry; Jones, Richard D.
2010-08-01
Increasingly stringent requirements on the performance of diffractive optical elements (DOEs) used in wafer scanner illumination systems are driving continuous improvements in their associated manufacturing processes. Specifically, these processes are designed to improve the output pattern uniformity of off-axis illumination systems to minimize degradation in the ultimate imaging performance of a lithographic tool. In this paper, we discuss performance improvements in both photolithographic patterning and RIE etching of fused silica diffractive optical structures. In summary, optimized photolithographic processes were developed to increase critical dimension uniformity and featuresize linearity across the substrate. The photoresist film thickness was also optimized for integration with an improved etch process. This etch process was itself optimized for pattern transfer fidelity, sidewall profile (wall angle, trench bottom flatness), and across-wafer etch depth uniformity. Improvements observed with these processes on idealized test structures (for ease of analysis) led to their implementation in product flows, with comparable increases in performance and yield on customer designs.
Ultra-sensitive EUV resists based on acid-catalyzed polymer backbone breaking
NASA Astrophysics Data System (ADS)
Manouras, Theodoros; Kazazis, Dimitrios; Koufakis, Eleftherios; Ekinci, Yasin; Vamvakaki, Maria; Argitis, Panagiotis
2018-03-01
The main target of the current work was to develop new sensitive polymeric materials for lithographic applications, focusing in particular to EUV lithography, the main chain of which is cleaved under the influence of photogenerated acid. Resist materials based on the cleavage of polymer main chain are in principle capable to create very small structures, to the dimensions of the monomers that they consist of. Nevertheless, in the case of the commonly used nonchemically amplified materials of this type issues like sensitivity and poor etch resistance limit their areas of application, whereas inadequate etch resistance and non- satisfactory process reliability are the usual problems encountered in acid catalysed materials based on main chain scission. In our material design the acid catalyzed chain cleavable polymers contain very sensitive moieties in their backbone while they remain intact in alkaline ambient. These newly synthesized polymers bear in addition suitable functional groups for the achievement of desirable lithographic characteristics (thermal stability, acceptable glass transition temperature, etch resistance, proper dissolution behavior, adhesion to the substrate). Our approach for achieving acceptable etch resistance, a main drawback in other main chain cleavable resists, is based on the introduction of polyaromatic hydrocarbons in the polymeric backbone, whereas the incorporation of an inorganic component further enhances the etch resistance. Single component systems can also be designed following the proposed approach by the incorporation of suitable PAGs and base quencher molecules in the main chain. Resist formulations based on a random copolymer designed according to the described rules evaluated in EUV exhibit ultrahigh sensitivity, capability for high resolution patterning and overall processing characteristics that make them strong candidates for industrial use upon further optimization.
NASA Astrophysics Data System (ADS)
Petrus, Karine; Szymczak, Piotr
2016-04-01
Karst formation is controlled by the processes of the fluid flow and reactant transport coupled to the chemical erosion of the limestone rock [1]. The coupling between these processes can lead to a number of different instabilities, resulting in the formation of dissolutional voids, caverns and conduits. Arguably the simplest systems of this kind are solution pipes, in which gravitationally driven water movement carves vertical conduits in limestone rocks. In the homogeneous rocks these conduits are often cylindrical, with almost a constant diameter along their length. However, in a stratified medium, the morphology of the pipes changes. For example, if a number of less porous layers is introduced in an otherwise homogeneous medium, then the pipes are observed to narrow as they cross the layers and then widen up to form bulbous caverns as they emerge from the layer [1]. In this communication, we investigate these effects more closely, considering different kind of lithographic discontinuities to be present in the system: the layers of increased/decreased porosity and/or permeability as well as the solubility which is different from the rest of the system. Using a Darcy-scale numerical model we analyze the effects these layers have on the shape and growth of solution pipes and compare the results on the piping morphologies observed in nature. Finally we comment on the possible relevance of these results to the cave-formation phenomena and the inception horizon concept [3]. References: 1.Howard A. D., The development of karst features, Bull. Natl. Spel. Soc. 25, 45-65 (1963) 2. Petrus, K. and Szymczak, P., Influence of layering on the formation and growth of solution pipes. Frontiers in Physics (submitted) 3.Filipponi , M., Jeannin, P. and Tacher, L., Evidence of inception horizons in karst conduit networks, Geomorphology, 106, 86-99 (2009)
Interference lithography for optical devices and coatings
NASA Astrophysics Data System (ADS)
Juhl, Abigail Therese
Interference lithography can create large-area, defect-free nanostructures with unique optical properties. In this thesis, interference lithography will be utilized to create photonic crystals for functional devices or coatings. For instance, typical lithographic processing techniques were used to create 1, 2 and 3 dimensional photonic crystals in SU8 photoresist. These structures were in-filled with birefringent liquid crystal to make active devices, and the orientation of the liquid crystal directors within the SU8 matrix was studied. Most of this thesis will be focused on utilizing polymerization induced phase separation as a single-step method for fabrication by interference lithography. For example, layered polymer/nanoparticle composites have been created through the one-step two-beam interference lithographic exposure of a dispersion of 25 and 50 nm silica particles within a photopolymerizable mixture at a wavelength of 532 nm. In the areas of constructive interference, the monomer begins to polymerize via a free-radical process and concurrently the nanoparticles move into the regions of destructive interference. The holographic exposure of the particles within the monomer resin offers a single-step method to anisotropically structure the nanoconstituents within a composite. A one-step holographic exposure was also used to fabricate self-healing coatings that use water from the environment to catalyze polymerization. Polymerization induced phase separation was used to sequester an isocyanate monomer within an acrylate matrix. Due to the periodic modulation of the index of refraction between the monomer and polymer, the coating can reflect a desired wavelength, allowing for tunable coloration. When the coating is scratched, polymerization of the liquid isocyanate is catalyzed by moisture in air; if the indices of the two polymers are matched, the coatings turn transparent after healing. Interference lithography offers a method of creating multifunctional self-healing coatings that readout when damage has occurred.
NASA Astrophysics Data System (ADS)
Xu, Wentao; Lee, Yeongjun; Min, Sung-Yong; Park, Cheolmin; Lee, Tae-Woo
2016-09-01
Resistive random-access memory (RRAM) is a candidate next generation nonvolatile memory due to its high access speed, high density and ease of fabrication. Especially, cross-point-access allows cross-bar arrays that lead to high-density cells in a two-dimensional planar structure. Use of such designs could be compatible with the aggressive scaling down of memory devices, but existing methods such as optical or e-beam lithographic approaches are too complicated. One-dimensional inorganic nanowires (i-NWs) are regarded as ideal components of nanoelectronics to circumvent the limitations of conventional lithographic approaches. However, post-growth alignment of these i-NWs precisely on a large area with individual control is still a difficult challenge. Here, we report a simple, inexpensive, and rapid method to fabricate two-dimensional arrays of perpendicularly-aligned, individually-conductive Cu-NWs with a nanometer-scale CuxO layer sandwiched at each cross point, by using an inorganic-nanowire-digital-alignment technique (INDAT) and a one-step reduction process. In this approach, the oxide layer is self-formed and patterned, so conventional deposition and lithography are not necessary. INDAT eliminates the difficulties of alignment and scalable fabrication that are encountered when using currently-available techniques that use inorganic nanowires. This simple process facilitates fabrication of cross-point nonvolatile memristor arrays. Fabricated arrays had reproducible resistive switching behavior, high on/off current ratio (Ion/Ioff) 10 6 and extensive cycling endurance. This is the first report of memristors with the resistive switching oxide layer self-formed, self-patterned and self-positioned; we envision that the new features of the technique will provide great opportunities for future nano-electronic circuits.
Robotic Attention Processing And Its Application To Visual Guidance
NASA Astrophysics Data System (ADS)
Barth, Matthew; Inoue, Hirochika
1988-03-01
This paper describes a method of real-time visual attention processing for robots performing visual guidance. This robot attention processing is based on a novel vision processor, the multi-window vision system that was developed at the University of Tokyo. The multi-window vision system is unique in that it only processes visual information inside local area windows. These local area windows are quite flexible in their ability to move anywhere on the visual screen, change their size and shape, and alter their pixel sampling rate. By using these windows for specific attention tasks, it is possible to perform high speed attention processing. The primary attention skills of detecting motion, tracking an object, and interpreting an image are all performed at high speed on the multi-window vision system. A basic robotic attention scheme using the attention skills was developed. The attention skills involved detection and tracking of salient visual features. The tracking and motion information thus obtained was utilized in producing the response to the visual stimulus. The response of the attention scheme was quick enough to be applicable to the real-time vision processing tasks of playing a video 'pong' game, and later using an automobile driving simulator. By detecting the motion of a 'ball' on a video screen and then tracking the movement, the attention scheme was able to control a 'paddle' in order to keep the ball in play. The response was faster than that of a human's, allowing the attention scheme to play the video game at higher speeds. Further, in the application to the driving simulator, the attention scheme was able to control both direction and velocity of a simulated vehicle following a lead car. These two applications show the potential of local visual processing in its use for robotic attention processing.
NASA Astrophysics Data System (ADS)
Zha, Yikun; Wei, Jingsong; Gan, Fuxi
2013-09-01
Maskless laser direct writing lithography has been applied in the fabrication of optical elements and electric-optical devices. With the development of technology, the feature size of the elements and devices is required to reduce down to nanoscale. Increasing the numerical aperture of converging lens and shortening the laser wavelength are good methods to obtain the small spot and reduce the feature size to nanoscale, while this will cause the reduction of the depth of focus. The reduction of depth of focus will lead to some difficulties in the focusing and tracking servo controlling during the high speed laser direct writing lithography. In this work, the combination of the diffractive optical elements and the nonlinear absorption inorganic resist thin films cannot only extend the depth of focus, but also reduce the feature size of the lithographic marks down to nanoscale. By using the five-zone annular phase-only binary pupil filter as the diffractive optical elements and AgInSbTe as the nonlinear absorption inorganic resist thin film, the depth of focus cannot only extend to 7.39 times that of the focused spot, but also reduce the lithographic feature size down to 54.6 nm. The ill-effect of sidelobe on the lithography is also eliminated by the nonlinear reverse saturable absorption and the phase change threshold lithographic characteristics.
NASA Astrophysics Data System (ADS)
Hughes, Robert A.; Menumerov, Eredzhep; Neretina, Svetlana
2017-07-01
One of the foremost challenges in nanofabrication is the establishment of a processing science that integrates wafer-based materials, techniques, and devices with the extraordinary physicochemical properties accessible when materials are reduced to nanoscale dimensions. Such a merger would allow for exacting controls on nanostructure positioning, promote cooperative phenomenon between adjacent nanostructures and/or substrate materials, and allow for electrical contact to individual or groups of nanostructures. With neither self-assembly nor top-down lithographic processes being able to adequately meet this challenge, advancements have often relied on a hybrid strategy that utilizes lithographically-defined features to direct the assembly of nanostructures into organized patterns. While these so-called directed assembly techniques have proven viable, much of this effort has focused on the assembly of periodic arrays of spherical or near-spherical nanostructures comprised of a single element. Work directed toward the fabrication of more complex nanostructures, while still at a nascent stage, has nevertheless demonstrated the possibility of forming arrays of nanocubes, nanorods, nanoprisms, nanoshells, nanocages, nanoframes, core-shell structures, Janus structures, and various alloys on the substrate surface. In this topical review, we describe the progress made in the directed assembly of periodic arrays of these complex metal nanostructures on planar and textured substrates. The review is divided into three broad strategies reliant on: (i) the deterministic positioning of colloidal structures, (ii) the reorganization of deposited metal films at elevated temperatures, and (iii) liquid-phase chemistry practiced directly on the substrate surface. These strategies collectively utilize a broad range of techniques including capillary assembly, microcontact printing, chemical surface modulation, templated dewetting, nanoimprint lithography, and dip-pen nanolithography and employ a wide scope of chemical processes including redox reactions, alloying, dealloying, phase separation, galvanic replacement, preferential etching, template-mediated reactions, and facet-selective capping agents. Taken together, they highlight the diverse toolset available when fabricating organized surfaces of substrate-supported nanostructures.
Novel windowing technique realized in FPGA for radar system
NASA Astrophysics Data System (ADS)
Escamilla-Hernandez, E.; Kravchenko, V. F.; Ponomaryov, V. I.; Ikuo, Arai
2006-02-01
To improve the weak target detection ability in radar applications a pulse compression is usually used that in the case linear FM modulation can improve the SNR. One drawback in here is that it can add the range side-lobes in reflectivity measurements. Using weighting window processing in time domain it is possible to decrease significantly the side-lobe level (SLL) and resolve small or low power targets those are masked by powerful ones. There are usually used classical windows such as Hamming, Hanning, etc. in window processing. Additionally to classical ones in this paper we also use a novel class of windows based on atomic functions (AF) theory. For comparison of simulation and experimental results we applied the standard parameters, such as coefficient of amplification, maximum level of side-lobe, width of main lobe, etc. To implement the compression-windowing model on hardware level it has been employed FPGA. This work aims at demonstrating a reasonably flexible implementation of FM-linear signal, pulse compression and windowing employing FPGA's. Classical and novel AF window technique has been investigated to reduce the SLL taking into account the noise influence and increasing the detection ability of the small or weak targets in the imaging radar. Paper presents the experimental hardware results of windowing in pulse compression radar resolving several targets for rectangular, Hamming, Kaiser-Bessel, (see manuscript for formula) functions windows. The windows created by use the atomic functions offer sufficiently better decreasing of the SLL in case of noise presence and when we move away of the main lobe in comparison with classical windows.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Kim, J.; Moon, T.J.; Howell, J.R.
This paper presents an analysis of the heat transfer occurring during an in-situ curing process for which infrared energy is provided on the surface of polymer composite during winding. The material system is Hercules prepreg AS4/3501-6. Thermoset composites have an exothermic chemical reaction during the curing process. An Eulerian thermochemical model is developed for the heat transfer analysis of helical winding. The model incorporates heat generation due to the chemical reaction. Several assumptions are made leading to a two-dimensional, thermochemical model. For simplicity, 360{degree} heating around the mandrel is considered. In order to generate the appropriate process windows, the developedmore » heat transfer model is combined with a simple winding time model. The process windows allow for a proper selection of process variables such as infrared energy input and winding velocity to give a desired end-product state. Steady-state temperatures are found for each combination of the process variables. A regression analysis is carried out to relate the process variables to the resulting steady-state temperatures. Using regression equations, process windows for a wide range of cylinder diameters are found. A general procedure to find process windows for Hercules AS4/3501-6 prepreg tape is coded in a FORTRAN program.« less
Inert Reassessment Document for Ammonium Nitrate
Magnesium nitrate is used in preservation. Other uses for magnesium nitrate include use as a catalyst in the manufacture of petrochemicals, as a densensitizer for lithographic plates and in pyrotechnics.
Inverse axial mounting stiffness design for lithographic projection lenses.
Wen-quan, Yuan; Hong-bo, Shang; Wei, Zhang
2014-09-01
In order to balance axial mounting stiffness of lithographic projection lenses and the image quality under dynamic working conditions, an easy inverse axial mounting stiffness design method is developed in this article. Imaging quality deterioration at the wafer under different axial vibration levels is analyzed. The desired image quality can be determined according to practical requirements, and axial vibrational tolerance of each lens is solved with the damped least-squares method. Based on adaptive interval adjustment, a binary search algorithm, and the finite element method, the axial mounting stiffness of each lens can be traveled in a large interval, and converges to a moderate numerical solution which makes the axial vibrational amplitude of the lens converge to its axial vibrational tolerance. Model simulation is carried out to validate the effectiveness of the method.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Chang-Yong Nam; Stein, Aaron; Kisslinger, Kim
We investigate the electrical and structural properties of infiltration-synthesized ZnO. In-plane ZnO nanowire arrays with prescribed positional registrations are generated by infiltrating diethlyzinc and water vapor into lithographically defined SU-8 polymer templates and removing organic matrix by oxygen plasma ashing. Transmission electron microscopy reveals that homogeneously amorphous as-infiltrated polymer templates transform into highly nanocrystalline ZnO upon removal of organic matrix. Field-effect transistor device measurements show that the synthesized ZnO after thermal annealing displays a typical n-type behavior, ~1019 cm -3 carrier density, and ~0.1 cm 2 V -1 s -1 electron mobility, reflecting highly nanocrystalline internal structure. The results demonstratemore » the potential application of infiltration synthesis in fabricating metal oxide electronic devices.« less
Chang-Yong Nam; Stein, Aaron; Kisslinger, Kim; ...
2015-11-17
We investigate the electrical and structural properties of infiltration-synthesized ZnO. In-plane ZnO nanowire arrays with prescribed positional registrations are generated by infiltrating diethlyzinc and water vapor into lithographically defined SU-8 polymer templates and removing organic matrix by oxygen plasma ashing. Transmission electron microscopy reveals that homogeneously amorphous as-infiltrated polymer templates transform into highly nanocrystalline ZnO upon removal of organic matrix. Field-effect transistor device measurements show that the synthesized ZnO after thermal annealing displays a typical n-type behavior, ~1019 cm -3 carrier density, and ~0.1 cm 2 V -1 s -1 electron mobility, reflecting highly nanocrystalline internal structure. The results demonstratemore » the potential application of infiltration synthesis in fabricating metal oxide electronic devices.« less
2011-04-01
this limitation the length of the windows needs to be shortened. It is also leads to a narrower confidence interval, see Figure 2.9. 82 The " big ...least one event will occur within the window. The windows are then grouped in sets of two and the process is reapeated for a window size twice as big ...0 505 T. Fu 1 506 D. Walden 1 508 J. Brown 1 55 T.Applebee 0 55 M. Dipper 1 551 T. Smith I 551 C. Bassler 3 3 551 V. Belenky 1 551 W. Belknap
Process for selectively patterning epitaxial film growth on a semiconductor substrate
Sheldon, P.; Hayes, R.E.
1984-12-04
Disclosed is a process for selectively patterning epitaxial film growth on a semiconductor substrate. The process includes forming a masking member on the surface of the substrate, the masking member having at least two layers including a first layer disposed on the substrate and the second layer covering the first layer. A window is then opened in a selected portion of the second layer by removing that portion to expose the first layer thereunder. The first layer is then subjected to an etchant introduced through the window to dissolve the first layer a sufficient amount to expose the substrate surface directly beneath the window, the first layer being adapted to preferentially dissolve at a substantially greater rate than the second layer so as to create an overhanging ledge portion with the second layer by undercutting the edges thereof adjacent the window. The epitaxial film is then deposited on the exposed substrate surface directly beneath the window. Finally, an etchant is introduced through the window to dissolve the remainder of the first layer so as to lift-off the second layer and materials deposited thereon to fully expose the balance of the substrate surface.
Process for selectively patterning epitaxial film growth on a semiconductor substrate
Sheldon, Peter; Hayes, Russell E.
1986-01-01
A process is disclosed for selectively patterning epitaxial film growth on a semiconductor substrate. The process includes forming a masking member on the surface of the substrate, the masking member having at least two layers including a first layer disposed on the substrate and the second layer covering the first layer. A window is then opened in a selected portion of the second layer by removing that portion to expose the first layer thereunder. The first layer is then subjected to an etchant introduced through the window to dissolve a sufficient amount of the first layer to expose the substrate surface directly beneath the window, the first layer being adapted to preferentially dissolve at a substantially greater rate than the second layer so as to create an overhanging ledge portion with the second layer by undercutting the edges thereof adjacent to the window. The epitaxial film is then deposited on the exposed substrate surface directly beneath the window. Finally, an etchant is introduced through the window to dissolve the remainder of the first layer so as to lift-off the second layer and materials deposited thereon to fully expose the balance of the substrate surface.
Off-Line Quality Control In Integrated Circuit Fabrication Using Experimental Design
NASA Astrophysics Data System (ADS)
Phadke, M. S.; Kackar, R. N.; Speeney, D. V.; Grieco, M. J.
1987-04-01
Off-line quality control is a systematic method of optimizing production processes and product designs. It is widely used in Japan to produce high quality products at low cost. The method was introduced to us by Professor Genichi Taguchi who is a Deming-award winner and a former Director of the Japanese Academy of Quality. In this paper we will i) describe the off-line quality control method, and ii) document our efforts to optimize the process for forming contact windows in 3.5 Aim CMOS circuits fabricated in the Murray Hill Integrated Circuit Design Capability Laboratory. In the fabrication of integrated circuits it is critically important to produce contact windows of size very near the target dimension. Windows which are too small or too large lead to loss of yield. The off-line quality control method has improved both the process quality and productivity. The variance of the window size has been reduced by a factor of four. Also, processing time for window photolithography has been substantially reduced. The key steps of off-line quality control are: i) Identify important manipulatable process factors and their potential working levels. ii) Perform fractional factorial experiments on the process using orthogonal array designs. iii) Analyze the resulting data to determine the optimum operating levels of the factors. Both the process mean and the process variance are considered in this analysis. iv) Conduct an additional experiment to verify that the new factor levels indeed give an improvement.
Progress in Nano-Engineered Anodic Aluminum Oxide Membrane Development.
Poinern, Gerrard Eddy Jai; Ali, Nurshahidah; Fawcett, Derek
2011-02-25
The anodization of aluminum is an electro-chemical process that changes the surface chemistry of the metal, via oxidation, to produce an anodic oxide layer. During this process a self organized, highly ordered array of cylindrical shaped pores can be produced with controllable pore diameters, periodicity and density distribution. This enables anodic aluminum oxide (AAO) membranes to be used as templates in a variety of nanotechnology applications without the need for expensive lithographical techniques. This review article is an overview of the current state of research on AAO membranes and the various applications of nanotechnology that use them in the manufacture of nano-materials and devices or incorporate them into specific applications such as biological/chemical sensors, nano-electronic devices, filter membranes and medical scaffolds for tissue engineering.
Progress in Nano-Engineered Anodic Aluminum Oxide Membrane Development
Poinern, Gerrard Eddy Jai; Ali, Nurshahidah; Fawcett, Derek
2011-01-01
The anodization of aluminum is an electro-chemical process that changes the surface chemistry of the metal, via oxidation, to produce an anodic oxide layer. During this process a self organized, highly ordered array of cylindrical shaped pores can be produced with controllable pore diameters, periodicity and density distribution. This enables anodic aluminum oxide (AAO) membranes to be used as templates in a variety of nanotechnology applications without the need for expensive lithographical techniques. This review article is an overview of the current state of research on AAO membranes and the various applications of nanotechnology that use them in the manufacture of nano-materials and devices or incorporate them into specific applications such as biological/chemical sensors, nano-electronic devices, filter membranes and medical scaffolds for tissue engineering. PMID:28880002
Understanding overlay signatures using machine learning on non-lithography context information
NASA Astrophysics Data System (ADS)
Overcast, Marshall; Mellegaard, Corey; Daniel, David; Habets, Boris; Erley, Georg; Guhlemann, Steffen; Thrun, Xaver; Buhl, Stefan; Tottewitz, Steven
2018-03-01
Overlay errors between two layers can be caused by non-lithography processes. While these errors can be compensated by the run-to-run system, such process and tool signatures are not always stable. In order to monitor the impact of non-lithography context on overlay at regular intervals, a systematic approach is needed. Using various machine learning techniques, significant context parameters that relate to deviating overlay signatures are automatically identified. Once the most influential context parameters are found, a run-to-run simulation is performed to see how much improvement can be obtained. The resulting analysis shows good potential for reducing the influence of hidden context parameters on overlay performance. Non-lithographic contexts are significant contributors, and their automatic detection and classification will enable the overlay roadmap, given the corresponding control capabilities.
Direct writing of metal nanostructures: lithographic tools for nanoplasmonics research.
Leggett, Graham J
2011-03-22
Continued progress in the fast-growing field of nanoplasmonics will require the development of new methods for the fabrication of metal nanostructures. Optical lithography provides a continually expanding tool box. Two-photon processes, as demonstrated by Shukla et al. (doi: 10.1021/nn103015g), enable the fabrication of gold nanostructures encapsulated in dielectric material in a simple, direct process and offer the prospect of three-dimensional fabrication. At higher resolution, scanning probe techniques enable nanoparticle particle placement by localized oxidation, and near-field sintering of nanoparticulate films enables direct writing of nanowires. Direct laser "printing" of single gold nanoparticles offers a remarkable capability for the controlled fabrication of model structures for fundamental studies, particle-by-particle. Optical methods continue to provide a powerful support for research into metamaterials.
CdS-Nanowires Flexible Photo-detector with Ag-Nanowires Electrode Based on Non-transfer Process
Pei, Yanli; Pei, Ruihan; Liang, Xiaoci; Wang, Yuhao; Liu, Ling; Chen, Haibiao; Liang, Jun
2016-01-01
In this study, UV-visible flexible resistivity-type photo-detectors were demonstrated with CdS-nanowires (NWs) percolation network channel and Ag-NWs percolation network electrode. The devices were fabricated on Mixed Cellulose Esters (MCE) membrane using a lithographic filtration method combined with a facile non-transfer process. The photo-detectors demonstrated strong adhesion, fast response time, fast decay time, and high photo sensitivity. The high performance could be attributed to the high quality single crystalline CdS-NWs, encapsulation of NWs in MCE matrix and excellent interconnection of the NWs. Furthermore, the sensing performance was maintained even the device was bent at an angle of 90°. This research may pave the way for the facile fabrication of flexible photo-detectors with high performances. PMID:26899726
Variability metrics in Josephson Junction fabrication for Quantum Computing circuits
NASA Astrophysics Data System (ADS)
Rosenblatt, Sami; Hertzberg, Jared; Brink, Markus; Chow, Jerry; Gambetta, Jay; Leng, Zhaoqi; Houck, Andrew; Nelson, J. J.; Plourde, Britton; Wu, Xian; Lake, Russell; Shainline, Jeff; Pappas, David; Patel, Umeshkumar; McDermott, Robert
Multi-qubit gates depend on the relative frequencies of the qubits. To reliably build multi-qubit devices therefore requires careful fabrication of Josephson junctions in order to precisely set their critical currents. The Ambegaokar-Baratoff relation between tunnel conductance and critical current implies a correlation between qubit frequency spread and tunnel junction resistance spread. Here we discuss measurement of large numbers of tunnel junctions to assess these resistance spreads, which can exceed 5% of mean resistance. With the goal of minimizing these spreads, we investigate process parameters such as lithographic junction area, evaporation and masking scheme, oxidation conditions, and substrate choice, as well as test environment, design and setup. In addition, trends of junction resistance with temperature are compared with theoretical models for further insights into process and test variability.
Fabrication of Antenna-Coupled KID Array for Cosmic Microwave Background Detection
NASA Astrophysics Data System (ADS)
Tang, Q. Y.; Barry, P. S.; Basu Thakur, R.; Kofman, A.; Nadolski, A.; Vieira, J.; Shirokoff, E.
2018-05-01
Kinetic inductance detectors (KIDs) have become an attractive alternative to traditional bolometers in the sub-mm and mm observing community due to their innate frequency multiplexing capabilities and simple lithographic processes. These advantages make KIDs a viable option for the O(500,000) detectors needed for the upcoming Cosmic Microwave Background-Stage 4 experiment. We have fabricated an antenna-coupled MKID array in the 150 GHz band optimized for CMB detection. Our design uses a twin-slot antenna coupled to an inverted microstrip made from a superconducting Nb/Al bilayer as the strip, a Nb ground plane and a SiN_x dielectric layer in between, which is then coupled to an Al KID grown on high-resistivity Si. We present the fabrication process and measurements of SiN_x microstrip resonators.
NASA Astrophysics Data System (ADS)
Genç, Eminegül; Kepceoǧlu, Abdullah; Gezgin, Serap Yiǧit; Kars, Meltem Demirel; Kılıç, Hamdi Şükür
2017-02-01
The use of the femtosecond (fs) laser pulses for ablation applications have several advantageous and Laser-Induced Forward Transfer (LIFT) is an ablation-driven transfer process. The use of fs laser pulses for LIFT is gaining a great attraction nowadays. The most of the Direct Writing (DW) methods are laser based techniques and the LIFT technique is the one of them. This spectacular technique allows high resolution without lithographic processes. In this study, we have grown Ti, Pt and Ta thin films on the microscope slides by Pulse Laser Deposition (PLD) technique using Nd:YAG laser in the high vacuum condition. As a result, thin films produced in this work is a good candidate to produce native DNA biosensors based on LIFT technique.
Proton-beam writing channel based on an electrostatic accelerator
NASA Astrophysics Data System (ADS)
Lapin, A. S.; Rebrov, V. A.; Kolin'ko, S. V.; Salivon, V. F.; Ponomarev, A. G.
2016-09-01
We have described the structure of the proton-beam writing channel as a continuation of a nuclear scanning microprobe channel. The problem of the accuracy of positioning a probe by constructing a new high-frequency electrostatic scanning system has been solved. Special attention has been paid to designing the probe-forming system and its various configurations have been considered. The probe-forming system that best corresponds to the conditions of the lithographic process has been found based on solving the problem of optimizing proton beam formation. A system for controlling beam scanning using multifunctional module of integrated programmable logic systems has been developed.
Lithography-Free Fabrication of Core-Shell GaAs Nanowire Tunnel Diodes.
Darbandi, A; Kavanagh, K L; Watkins, S P
2015-08-12
GaAs core-shell p-n junction tunnel diodes were demonstrated by combining vapor-liquid-solid growth with gallium oxide deposition by atomic layer deposition for electrical isolation. The characterization of an ensemble of core-shell structures was enabled by the use of a tungsten probe in a scanning electron microscope without the need for lithographic processing. Radial tunneling transport was observed, exhibiting negative differential resistance behavior with peak-to-valley current ratios of up to 3.1. Peak current densities of up to 2.1 kA/cm(2) point the way to applications in core-shell photovoltaics and tunnel field effect transistors.
Amplitude and phase beam shaping for highest sensitivity in sidewall angle detection.
Cisotto, Luca; Paul Urbach, H
2017-01-01
In integrated circuits manufacturing, specific structures are used as tools to evaluate the quality of the lithographic process, and the shape of these structures is often described by a few parameters, of which in particular the sidewall angle suffers from considerable inaccuracies. Using scalar diffraction theory, we investigate whether a properly shaped cylindrically focused probing beam could increase the ability to detect tiny changes in this angle in the case of a cliff-like structure, modeled as a phase object. This paper describes the theoretical formulation used to calculate the optimized beam and compares its performance with the case of a focused plane wave.
The aqueous electrochemistry of carbon-based surfaces-investigation by scanning tunneling microscopy
NASA Astrophysics Data System (ADS)
Mühl, T.; Myhra, S.
2007-04-01
Electro-oxidation of carbon-based materials will lead to conversion of the solid to CO2/CO at the anode, with H2 being produced at the cathode. Recent voltammetric investigations of carbon nano-tubes and single crystal graphite have shown that only edge sites and other defect sites are electrochemically active. Local oxidation of diamond-like carbon films (DLC) by an STM tip in moist air followed by imaging allows correlation of topographical change with electro-chemical conditions and surface reactivity. The results may have implications for lithographic processing of carbon surfaces, and may have relevance for electrochemical H2 production.
Balram, Krishna C; Audet, Ross M; Miller, David A B
2013-04-22
We demonstrate the use of a subwavelength planar metal-dielectric resonant cavity to enhance the absorption of germanium photodetectors at wavelengths beyond the material's direct absorption edge, enabling high responsivity across the entire telecommunications C and L bands. The resonant wavelength of the detectors can be tuned linearly by varying the width of the Ge fin, allowing multiple detectors, each resonant at a different wavelength, to be fabricated in a single-step process. This approach is promising for the development of CMOS-compatible devices suitable for integrated, high-speed, and energy-efficient photodetection at telecommunications wavelengths.
Ultrahigh-Density Nanowire Arrays Grown in Self-Assembled Diblock Copolymer Templates
NASA Astrophysics Data System (ADS)
Thurn-Albrecht, T.; Schotter, J.; Kästle, G. A.; Emley, N.; Shibauchi, T.; Krusin-Elbaum, L.; Guarini, K.; Black, C. T.; Tuominen, M. T.; Russell, T. P.
2000-12-01
We show a simple, robust, chemical route to the fabrication of ultrahigh-density arrays of nanopores with high aspect ratios using the equilibrium self-assembled morphology of asymmetric diblock copolymers. The dimensions and lateral density of the array are determined by segmental interactions and the copolymer molecular weight. Through direct current electrodeposition, we fabricated vertical arrays of nanowires with densities in excess of 1.9 × 1011 wires per square centimeter. We found markedly enhanced coercivities with ferromagnetic cobalt nanowires that point toward a route to ultrahigh-density storage media. The copolymer approach described is practical, parallel, compatible with current lithographic processes, and amenable to multilayered device fabrication.
Rigid thin windows for vacuum applications
Meyer, Glenn Allyn; Ciarlo, Dino R.; Myers, Booth Richard; Chen, Hao-Lin; Wakalopulos, George
1999-01-01
A thin window that stands off atmospheric pressure is fabricated using photolithographic and wet chemical etching techniques and comprises at least two layers: an etch stop layer and a protective barrier layer. The window structure also comprises a series of support ribs running the width of the window. The windows are typically made of boron-doped silicon and silicon nitride and are useful in instruments such as electron beam guns and x-ray detectors. In an electron beam gun, the window does not impede the electrons and has demonstrated outstanding gun performance and survivability during the gun tube manufacturing process.
Switchable Materials for Smart Windows.
Wang, Yang; Runnerstrom, Evan L; Milliron, Delia J
2016-06-07
This article reviews the basic principles of and recent developments in electrochromic, photochromic, and thermochromic materials for applications in smart windows. Compared with current static windows, smart windows can dynamically modulate the transmittance of solar irradiation based on weather conditions and personal preferences, thus simultaneously improving building energy efficiency and indoor human comfort. Although some smart windows are commercially available, their widespread implementation has not yet been realized. Recent advances in nanostructured materials provide new opportunities for next-generation smart window technology owing to their unique structure-property relations. Nanomaterials can provide enhanced coloration efficiency, faster switching kinetics, and longer lifetime. In addition, their compatibility with solution processing enables low-cost and high-throughput fabrication. This review also discusses the importance of dual-band modulation of visible and near-infrared (NIR) light, as nearly 50% of solar energy lies in the NIR region. Some latest results show that solution-processable nanostructured systems can selectively modulate the NIR light without affecting the visible transmittance, thus reducing energy consumption by air conditioning, heating, and artificial lighting.
VIS-IR transmitting BGG glass windows
NASA Astrophysics Data System (ADS)
Bayya, Shyam S.; Chin, Geoff D.; Sanghera, Jasbinder S.; Aggarwal, Ishwar D.
2003-09-01
BaO-Ga2O3-GeO2 (BGG) glasses have the desired properties for various window applications in the 0.5-5 μm wavelength region. These glasses are low cost alternatives to the currently used window materials. Fabrication of a high optical quality 18" diameter BGG glass window has been demonstrated with a transmitted wave front error of λ/10 at 632 nm. BGG substrates have also been successfully tested for environmental weatherability (MIL-F-48616) and rain erosion durability up to 300 mph. Preliminary EMI grids have been successfully applied on BGG glasses demonstrating attenuation of 20dB in X and Ku bands. Although the mechanical properties of BGG glasses are acceptable for various window applications, it is demonstrated here that the properties can be further improved significantly by the glassceramization process. The ceramization process does not add any significant cost to the final window material. The crystallite size in the present glass-ceramic limits its transmission to the 2-5 μm region.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Ruhl, J.E.; Ade, P.A.R.; Carlstrom, J.E.
2004-11-04
A new 10 meter diameter telescope is being constructed for deployment at the NSF South Pole research station. The telescope is designed for conducting large-area millimeter and sub-millimeter wave surveys of faint, low contrast emission, as required to map primary and secondary anisotropies in the cosmic microwave background. To achieve the required sensitivity and resolution, the telescope design employs an off-axis primary with a 10 m diameter clear aperture. The full aperture and the associated optics will have a combined surface accuracy of better than 20 microns rms to allow precision operation in the submillimeter atmospheric windows. The telescope willmore » be surrounded with a large reflecting ground screen to reduce sensitivity to thermal emission from the ground and local interference. The optics of the telescope will support a square degree field of view at 2mm wavelength and will feed a new 1000-element micro-lithographed planar bolometric array with superconducting transition-edge sensors and frequency-multiplexed readouts. The first key project will be to conduct a survey over 4000 degrees for galaxy clusters using the Sunyaev-Zeldovich Effect. This survey should find many thousands of clusters with a mass selection criteria that is remarkably uniform with redshift. Armed with redshifts obtained from optical and infrared follow-up observations, it is expected that the survey will enable significant constraints to be placed on the equation of state of the dark energy.« less
Vomero, Maria; Castagnola, Elisa; Ciarpella, Francesca; Maggiolini, Emma; Goshi, Noah; Zucchini, Elena; Carli, Stefano; Fadiga, Luciano; Kassegne, Sam; Ricci, Davide
2017-01-01
We report on the superior electrochemical properties, in-vivo performance and long term stability under electrical stimulation of a new electrode material fabricated from lithographically patterned glassy carbon. For a direct comparison with conventional metal electrodes, similar ultra-flexible, micro-electrocorticography (μ-ECoG) arrays with platinum (Pt) or glassy carbon (GC) electrodes were manufactured. The GC microelectrodes have more than 70% wider electrochemical window and 70% higher CTC (charge transfer capacity) than Pt microelectrodes of similar geometry. Moreover, we demonstrate that the GC microelectrodes can withstand at least 5 million pulses at 0.45 mC/cm2 charge density with less than 7.5% impedance change, while the Pt microelectrodes delaminated after 1 million pulses. Additionally, poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT-PSS) was selectively electrodeposited on both sets of devices to specifically reduce their impedances for smaller diameters (<60 μm). We observed that PEDOT-PSS adhered significantly better to GC than Pt, and allowed drastic reduction of electrode size while maintaining same amount of delivered current. The electrode arrays biocompatibility was demonstrated through in-vitro cell viability experiments, while acute in vivo characterization was performed in rats and showed that GC microelectrode arrays recorded somatosensory evoked potentials (SEP) with an almost twice SNR (signal-to-noise ratio) when compared to the Pt ones. PMID:28084398
Electrical and Optical Characterization of Nanowire based Semiconductor Devices
NASA Astrophysics Data System (ADS)
Ayvazian, Talin
This research project is focused on a new strategy for the creation of nanowire based semiconductor devices. The main goal is to understand and optimize the electrical and optical properties of two types of nanoscale devices; in first type lithographically patterned nanowire electrodeposition (LPNE) method has been utilized to fabricate nanowire field effect transistors (NWFET) and second type involved the development of light emitting semiconductor nanowire arrays (NWLED). Field effect transistors (NWFETs) have been prepared from arrays of polycrystalline cadmium selenide (pc-CdSe) nanowires using a back gate configuration. pc-CdSe nanowires were fabricated using the lithographically patterned nanowire electrode- position (LPNE) process on SiO2 /Si substrates. After electrodeposition, pc-CdSe nanowires were thermally annealed at 300 °C x 4 h either with or without exposure to CdCl 2 in methanol a grain growth promoter. The influence of CdCl2 treatment was to increase the mean grain diameter as determined by X-ray diffraction pattern and to convert the crystal structure from cubic to wurtzite. Transfer characteristics showed an increase of the field effect mobility (mu eff) by an order of magnitude and increase of the Ion/I off ratio by a factor of 3-4. Light emitting devices (NW-LED) based on lithographically patterned pc-CdSe nanowire arrays have been investigated. Electroluminescence (EL) spectra of CdSe nanowires under various biases exhibited broad emission spectra centered at 750 nm close to the band gap of CdSe (1.7eV). To enhance the intensity of the emitted light and the external quantum efficiency (EQE), the distance between the contacts were reduced from 5 mum to less than 1 mum which increased the efficiency by an order of magnitude. Also, increasing the annealing temperature of nanowires from 300 °C x4 h to 450 This research project is focused on a new strategy for the creation of nanowire based semiconductor devices. The main goal is to understand and optimize the electrical and optical properties of two types of nanoscale devices; in first type lithographically patterned nanowire electrodeposition (LPNE) method has been utilized to fabricate nanowire field effect transistors (NWFET) and second type involved the development of light emitting semiconductor nanowire arrays (NWLED). Field effect transistors (NWFETs) have been prepared from arrays of polycrystalline cadmium selenide (pc-CdSe) nanowires using a back gate configuration. pc-CdSe nanowires were fabricated using the lithographically patterned nanowire electrode- position (LPNE) process on SiO2 /Si substrates. After electrodeposition, pc-CdSe nanowires were thermally annealed at 300 °C x 4 h either with or without exposure to CdCl2 in methanol- a grain growth promoter. The influence of CdCl2 treatment was to increase the mean grain diameter as determined by X-ray diffraction pattern and to convert the crystal structure from cubic to wurtzite. Transfer characteristics showed an increase of the field effect mobility (mueff<) by an order of magnitude and increase of the Ion/Ioff ratio by a factor of 3-4. Light emitting devices (NW-LED) based on lithographically patterned pc-CdSe nanowire arrays have been investigated. Electroluminescence (EL) spectra of CdSe nanowires under various biases exhibited broad emission spectra centered at 750 nm close to the band gap of CdSe (1.7eV). To enhance the intensity of the emitted light and the external quantum efficiency (EQE), the distance between the contacts were reduced from 5 mum to less than 1 mum which increased the efficiency by an order of magnitude. Also, increasing the annealing temperature of nanowires from 300 °C x4 h to 450 °C x 1h enhanced grain growth confirmed by structural characterization including X-ray diffraction (XRD), Scanning electron microscopy (SEM) and Raman Spectroscopy. Correspondingly the light emission intensity and EQE improved due to this grain growth. Kelvin probe force microscopy (KPFM) was utilized to understand mechanism of light emission in CdSe nanowires. Arrays of CdTe nanowires were electrodeposited using LPNE process where the elec- trodeposition of pc-CdTe was carried out at two temperatures: 20 °C (cold) and 55 °C (hot). Transmission electron microscopy (TEM) and X-ray diffraction (XRD) re- sults revealed higher crystallinity, larger grain size and presence of Te for nanowires prepared at 55°C compared to nanowires deposited at 20°C. Nanowires prepared at 55°C showed higher electrical conductivity and enhanced electroluminescence proper- ties, including higher light emission intensity and improved External Quantum Efficiency (EQE). Electrical conduction mechanism also investigated for CdTe nanowires. Thermionic emission over schottky barrier height was identified as the dominant charge transport mechanism in pc-CdTe nanowires.°C x 1h enhanced grain growth confirmed by structural characterization including X-ray diffraction (XRD), Scanning electron microscopy (SEM) and Raman Spectroscopy. Correspondingly the light emission intensity and EQE improved due to this grain growth. Kelvin probe force microscopy (KPFM) was utilized to understand mechanism of light emission in CdSe nanowires. Arrays of CdTe nanowires were electrodeposited using LPNE process where the electrodeposition of pc-CdTe was carried out at two temperatures: 20 °C (cold) and 55 °C (hot). Transmission electron microscopy (TEM) and X-ray diffraction (XRD) re- sults revealed higher crystallinity, larger grain size and presence of Te for nanowires prepared at 55°C compared to nanowires deposited at 20°C. Nanowires prepared at 55°C showed higher electrical conductivity and enhanced electroluminescence properties, including higher light emission intensity and improved External Quantum Efficiency (EQE). Electrical conduction mechanism also investigated for CdTe nanowires. Thermionic emission over schottky barrier height was identified as the dominant charge transport mechanism in pc-CdTe nanowires.
Raman spectroscopy - in situ characterization of growth and surface processes
NASA Astrophysics Data System (ADS)
Perkins, James Robert
The goal of this thesis is to expand on the usefulness of Raman spectroscopy as an in situ probe to aid in the growth and implementation of electronic, optical, and biodetection materials. We accomplish this goal by developing two diverse optical characterization projects. In the first project, an autoclave similar to those used in solvothermal growth which has been outfitted with an optical window is used to collect vibrational spectra of solvents and mineralizers commonly used in the ammonothermal growth of gallium nitride. Secondly, novel silver nanowires created by ferroelectric lithography are evaluated by surface enhanced micro-Raman spectroscopy for use as surface enhanced substrates for low detection limit or single molecule bio-detectors. Raman spectroscopy is already a widely accepted method to characterize and identify a wide variety of materials. Vibrational spectra can yield much information on the presence of chemical species as well as information regarding the phase and interactive properties. Because Raman spectroscopy is a generally non-intrusive technique it is ideal for analysis of hazardous or far-from-ambient liquids, gases, or solids. This technique is used in situ to characterize crystal growth and surface enhanced photochemistry. The phenomenon of Surface Enhanced Raman Spectroscopy (SERS) has been observed in many systems but some fundamental understanding is still lacking and the technique has been slow to transition from the laboratory to the industry. Aggregated colloids and lithographically created islands have shown the best success as reproducible substrates for SERS detection. These techniques, however, lack control over shape, size, and position of the metal nanoparticles which leave them reliant on hotspots. Because of the potential for control of the position of aggregates, ferroelectric lithographically created silver nanowires are evaluated as a potential SERS substrate using pyridine, benzoic acid, and Rhodamine 6g. Surface enhancement from these samples varies periodically as excitation light is scanned perpendicular to the wires. The periodicity, however, has the frequency of the positive domains where carbon laser damage is preferentially created. There is a current need for homoepitaxial substrates for gallium nitride devices including light emitting diodes, transistors, and laser diodes. Ammonothermal growth is a promising technique for creating bulk single crystalline GaN, but questions remain concerning the intermediates of reactions in supercritical Ammonia. Neat ammonia and water are monitored by Raman spectroscopy from room temperature to 500°C and 20 kpsi with both UV and visible excitation. In both systems, the amount of hydrogen bonding, which can be determined by O-H and N-H stretch frequency shifts, decreases with increasing temperature. In supercritical ammonia, the degree of Fermi resonance between the nu1 and 2nu4 modes decreases linearly with temperature while a minimum in pyramidal height of the NH3 molecule is reached at moderate pressures. Binary solutions of sodium azide and ammonia are investigated to temperatures which allow observation of the breakdown of the azides. The pressure and N2 Raman signal increase as the azide decomposes to sodium amide and N2 and H2 process gasses. The rate of decrease of the Raman signal of the azide increases as the reaction proceeds suggesting that the reaction rate is proportional to the pressure. The Fermi resonance, hydrogen bonding, and pyramidal height parameters were not affected by the presence of the azide.
Sequential shrink photolithography for plastic microlens arrays
NASA Astrophysics Data System (ADS)
Dyer, David; Shreim, Samir; Jayadev, Shreshta; Lew, Valerie; Botvinick, Elliot; Khine, Michelle
2011-07-01
Endeavoring to push the boundaries of microfabrication with shrinkable polymers, we have developed a sequential shrink photolithography process. We demonstrate the utility of this approach by rapidly fabricating plastic microlens arrays. First, we create a mask out of the children's toy Shrinky Dinks by simply printing dots using a standard desktop printer. Upon retraction of this pre-stressed thermoplastic sheet, the dots shrink to a fraction of their original size, which we then lithographically transfer onto photoresist-coated commodity shrink wrap film. This shrink film reduces in area by 95% when briefly heated, creating smooth convex photoresist bumps down to 30 µm. Taken together, this sequential shrink process provides a complete process to create microlenses, with an almost 99% reduction in area from the original pattern size. Finally, with a lithography molding step, we emboss these bumps into optical grade plastics such as cyclic olefin copolymer for functional microlens arrays.
Sequential shrink photolithography for plastic microlens arrays.
Dyer, David; Shreim, Samir; Jayadev, Shreshta; Lew, Valerie; Botvinick, Elliot; Khine, Michelle
2011-07-18
Endeavoring to push the boundaries of microfabrication with shrinkable polymers, we have developed a sequential shrink photolithography process. We demonstrate the utility of this approach by rapidly fabricating plastic microlens arrays. First, we create a mask out of the children's toy Shrinky Dinks by simply printing dots using a standard desktop printer. Upon retraction of this pre-stressed thermoplastic sheet, the dots shrink to a fraction of their original size, which we then lithographically transfer onto photoresist-coated commodity shrink wrap film. This shrink film reduces in area by 95% when briefly heated, creating smooth convex photoresist bumps down to 30 µm. Taken together, this sequential shrink process provides a complete process to create microlenses, with an almost 99% reduction in area from the original pattern size. Finally, with a lithography molding step, we emboss these bumps into optical grade plastics such as cyclic olefin copolymer for functional microlens arrays.
Sequential shrink photolithography for plastic microlens arrays
Dyer, David; Shreim, Samir; Jayadev, Shreshta; Lew, Valerie; Botvinick, Elliot; Khine, Michelle
2011-01-01
Endeavoring to push the boundaries of microfabrication with shrinkable polymers, we have developed a sequential shrink photolithography process. We demonstrate the utility of this approach by rapidly fabricating plastic microlens arrays. First, we create a mask out of the children’s toy Shrinky Dinks by simply printing dots using a standard desktop printer. Upon retraction of this pre-stressed thermoplastic sheet, the dots shrink to a fraction of their original size, which we then lithographically transfer onto photoresist-coated commodity shrink wrap film. This shrink film reduces in area by 95% when briefly heated, creating smooth convex photoresist bumps down to 30 µm. Taken together, this sequential shrink process provides a complete process to create microlenses, with an almost 99% reduction in area from the original pattern size. Finally, with a lithography molding step, we emboss these bumps into optical grade plastics such as cyclic olefin copolymer for functional microlens arrays. PMID:21863126
DOE Office of Scientific and Technical Information (OSTI.GOV)
Hohenberger, Erik; Freitag, Nathan; Rosenmann, Daniel
Here, we present a facile method for fabricating nanostructured silver films containing a high density of nanoscopic gap features through a surface directed phenomenon utilizing nanoporous scaffolds rather than through traditional lithographic patterning processes. This method enables tunability of the silver film growth by simply adjusting the formulation and processing conditions of the nanoporous film prior to metallization. We further demonstrate that this process can produce nanoscopic gaps in thick (100 nm) silver films supporting localized surface plasmon resonance with large field amplification within the gaps while enabling launching of propagating surface plasmons within the silver grains. These enhanced fieldsmore » provide metal enhanced fluorescence with enhancement factors as high as 21 times compared to glass, as well as enable visualization of single fluorophore emission. This work provides a low-cost rapid approach for producing novel nanostructures capable of broadband fluorescence amplification, with potential applications including plasmonic and fluorescence based optical sensing and imaging applications.« less
Characterisation of the n-colour printing process using the spot colour overprint model.
Deshpande, Kiran; Green, Phil; Pointer, Michael R
2014-12-29
This paper is aimed at reproducing the solid spot colours using the n-colour separation. A simplified numerical method, called as the spot colour overprint (SCOP) model, was used for characterising the n-colour printing process. This model was originally developed for estimating the spot colour overprints. It was extended to be used as a generic forward characterisation model for the n-colour printing process. The inverse printer model based on the look-up table was implemented to obtain the colour separation for n-colour printing process. Finally the real-world spot colours were reproduced using 7-colour separation on lithographic offset printing process. The colours printed with 7 inks were compared against the original spot colours to evaluate the accuracy. The results show good accuracy with the mean CIEDE2000 value between the target colours and the printed colours of 2.06. The proposed method can be used successfully to reproduce the spot colours, which can potentially save significant time and cost in the printing and packaging industry.
Hardware Implementation of a Bilateral Subtraction Filter
NASA Technical Reports Server (NTRS)
Huertas, Andres; Watson, Robert; Villalpando, Carlos; Goldberg, Steven
2009-01-01
A bilateral subtraction filter has been implemented as a hardware module in the form of a field-programmable gate array (FPGA). In general, a bilateral subtraction filter is a key subsystem of a high-quality stereoscopic machine vision system that utilizes images that are large and/or dense. Bilateral subtraction filters have been implemented in software on general-purpose computers, but the processing speeds attainable in this way even on computers containing the fastest processors are insufficient for real-time applications. The present FPGA bilateral subtraction filter is intended to accelerate processing to real-time speed and to be a prototype of a link in a stereoscopic-machine- vision processing chain, now under development, that would process large and/or dense images in real time and would be implemented in an FPGA. In terms that are necessarily oversimplified for the sake of brevity, a bilateral subtraction filter is a smoothing, edge-preserving filter for suppressing low-frequency noise. The filter operation amounts to replacing the value for each pixel with a weighted average of the values of that pixel and the neighboring pixels in a predefined neighborhood or window (e.g., a 9 9 window). The filter weights depend partly on pixel values and partly on the window size. The present FPGA implementation of a bilateral subtraction filter utilizes a 9 9 window. This implementation was designed to take advantage of the ability to do many of the component computations in parallel pipelines to enable processing of image data at the rate at which they are generated. The filter can be considered to be divided into the following parts (see figure): a) An image pixel pipeline with a 9 9- pixel window generator, b) An array of processing elements; c) An adder tree; d) A smoothing-and-delaying unit; and e) A subtraction unit. After each 9 9 window is created, the affected pixel data are fed to the processing elements. Each processing element is fed the pixel value for its position in the window as well as the pixel value for the central pixel of the window. The absolute difference between these two pixel values is calculated and used as an address in a lookup table. Each processing element has a lookup table, unique for its position in the window, containing the weight coefficients for the Gaussian function for that position. The pixel value is multiplied by the weight, and the outputs of the processing element are the weight and pixel-value weight product. The products and weights are fed to the adder tree. The sum of the products and the sum of the weights are fed to the divider, which computes the sum of products the sum of weights. The output of the divider is denoted the bilateral smoothed image. The smoothing function is a simple weighted average computed over a 3 3 subwindow centered in the 9 9 window. After smoothing, the image is delayed by an additional amount of time needed to match the processing time for computing the bilateral smoothed image. The bilateral smoothed image is then subtracted from the 3 3 smoothed image to produce the final output. The prototype filter as implemented in a commercially available FPGA processes one pixel per clock cycle. Operation at a clock speed of 66 MHz has been demonstrated, and results of a static timing analysis have been interpreted as suggesting that the clock speed could be increased to as much as 100 MHz.
Recent progress in plasmonic colour filters for image sensor and multispectral applications
NASA Astrophysics Data System (ADS)
Pinton, Nadia; Grant, James; Choubey, Bhaskar; Cumming, David; Collins, Steve
2016-04-01
Using nanostructured thin metal films as colour filters offers several important advantages, in particular high tunability across the entire visible spectrum and some of the infrared region, and also compatibility with conventional CMOS processes. Since 2003, the field of plasmonic colour filters has evolved rapidly and several different designs and materials, or combination of materials, have been proposed and studied. In this paper we present a simulation study for a single- step lithographically patterned multilayer structure able to provide competitive transmission efficiencies above 40% and contemporary FWHM of the order of 30 nm across the visible spectrum. The total thickness of the proposed filters is less than 200 nm and is constant for every wavelength, unlike e.g. resonant cavity-based filters such as Fabry-Perot that require a variable stack of several layers according to the working frequency, and their passband characteristics are entirely controlled by changing the lithographic pattern. It will also be shown that a key to obtaining narrow-band optical response lies in the dielectric environment of a nanostructure and that it is not necessary to have a symmetric structure to ensure good coupling between the SPPs at the top and bottom interfaces. Moreover, an analytical method to evaluate the periodicity, given a specific structure and a desirable working wavelength, will be proposed and its accuracy demonstrated. This method conveniently eliminate the need to optimize the design of a filter numerically, i.e. by running several time-consuming simulations with different periodicities.
NASA Technical Reports Server (NTRS)
Newell, J. D.; Keller, R. A.; Baily, N. A.
1974-01-01
A simple method for outlining or contouring any area defined by a change in film density or fluoroscopic screen intensity is described. The entire process, except for the positioning of an electronic window, is accomplished using a small computer having appropriate softwave. The electronic window is operator positioned over the area to be processed. The only requirement is that the window be large enough to encompass the total area to be considered.
NASA Astrophysics Data System (ADS)
Ham, Boo-Hyun; Kim, Il-Hwan; Park, Sung-Sik; Yeo, Sun-Young; Kim, Sang-Jin; Park, Dong-Woon; Park, Joon-Soo; Ryu, Chang-Hoon; Son, Bo-Kyeong; Hwang, Kyung-Bae; Shin, Jae-Min; Shin, Jangho; Park, Ki-Yeop; Park, Sean; Liu, Lei; Tien, Ming-Chun; Nachtwein, Angelique; Jochemsen, Marinus; Yan, Philip; Hu, Vincent; Jones, Christopher
2017-03-01
As critical dimensions for advanced two dimensional (2D) DUV patterning continue to shrink, the exact process window becomes increasingly difficult to determine. The defect size criteria shrink with the patterning critical dimensions and are well below the resolution of current optical inspection tools. As a result, it is more challenging for traditional bright field inspection tools to accurately discover the hotspots that define the process window. In this study, we use a novel computational inspection method to identify the depth-of-focus limiting features of a 10 nm node mask with 2D metal structures (single exposure) and compare the results to those obtained with a traditional process windows qualification (PWQ) method based on utilizing a focus modulated wafer and bright field inspection (BFI) to detect hotspot defects. The method is extended to litho-etch litho-etch (LELE) on a different test vehicle to show that overlay related bridging hotspots also can be identified.
Determining Window Placement and Configuration for the Small Pressurized Rover (SPR)
NASA Technical Reports Server (NTRS)
Thompson, Shelby; Litaker, Harry; Howard, Robert
2009-01-01
This slide presentation reviews the process of the evaluation of window placement and configuration for the cockpit of the Lunar Electric Rover (LER). The purpose of the evaluation was to obtain human-in-the-loop data on window placement and configuration for the cockpit of the LER.
47 CFR 73.870 - Processing of LPFM broadcast station applications.
Code of Federal Regulations, 2010 CFR
2010-10-01
... Notice a window filing period for applications for new LPFM stations and major modifications in the... authorized LPFM stations will be accepted only during the appropriate window. Applications submitted prior to the window opening date identified in the Public Notice will be returned as premature. Applications...
Printing and Related Support Activities Sector (NAICS 323)
Find environmental regulatory and compliance information for the printing sector, including NESHAPs for paper surface coating, RCRA hazardous waste guide for small business, and a pollution prevention guidance for lithographic and screen printing
NASA Astrophysics Data System (ADS)
Park, Jeong-Ho; Kang, Seok-Ju; Park, Jeong-Woo; Lim, Bogyu; Kim, Dong-Yu
2007-11-01
The submicroscaled octadecyltrichlorosilane (OTS) line patterns on gate-dielectric surfaces were introduced into the fabrication of organic field effect transistors (OFETs). These spin-cast regioregular poly(3-hexylthiophene) films on soft-lithographically patterned SiO2 surfaces yielded a higher hole mobility (˜0.072cm2/Vs ) than those of unpatterned (˜0.015cm2/Vs) and untreated (˜5×10-3cm2/Vs) OFETs. The effect of mobility enhancement as a function of the patterned line pitch was investigated in structural and geometric characteristics. The resulting improved mobility is likely attributed to the formation of efficient π-π stacking as a result of guide-assisted, local self-organization-involved molecular interactions between the poly(3-hexylthiophene) polymer and the geometrical OTS patterns.
Electron-Beam Lithographic Grafting of Functional Polymer Structures from Fluoropolymer Substrates.
Gajos, Katarzyna; Guzenko, Vitaliy A; Dübner, Matthias; Haberko, Jakub; Budkowski, Andrzej; Padeste, Celestino
2016-10-07
Well-defined submicrometer structures of poly(dimethylaminoethyl methacrylate) (PDMAEMA) were grafted from 100 μm thick films of poly(ethene-alt-tetrafluoroethene) after electron-beam lithographic exposure. To explore the possibilities and limits of the method under different exposure conditions, two different acceleration voltages (2.5 and 100 keV) were employed. First, the influence of electron energy and dose on the extent of grafting and on the structure's morphology was determined via atomic force microscopy. The surface grafting with PDMAEMA was confirmed by advanced surface analytical techniques such as time-of-flight secondary ion mass spectrometry and X-ray photoelectron spectroscopy. Additionally, the possibility of effective postpolymerization modification of grafted structures was demonstrated by quaternization of the grafted PDMAEMA to the polycationic QPDMAEMA form and by exploiting electrostatic interactions to bind charged organic dyes and functional proteins.
Tailoring surface properties of ArF resists thin films with functionally graded materials (FGM)
NASA Astrophysics Data System (ADS)
Takemoto, Ichiki; Ando, Nobuo; Edamatsu, Kunishige; Fuji, Yusuke; Kuwana, Koji; Hashimoto, Kazuhiko; Funase, Junji; Yokoyama, Hiroyuki
2007-03-01
Our recent research effort has been focused on new top coating-free 193nm immersion resists with regard to leaching of the resist components and lithographic performance. We have examined methacrylate-based resins that control the surface properties of ArF resists thin films by surface segregation behavior. For a better understanding of the surface properties of thin films, we prepared the six resins (Resin 1-6) that have three types fluorine containing monomers, a new monomer (Monomer A), Monomer B and Monomer C, respectively. We blended the base polymer (Resin 0) with Resin (1-6), respectively. We evaluated contact angles, surface properties and lithographic performances of the polymer blend resists. The static and receding contact angles of the resist that contains Resin (1-6) are greater than that of the base polymer (Resin 0) resist. The chemical composition of the surface of blend polymers was investigated with X-ray photoelectron spectroscopy (XPS). It was shown that there was significant segregation of the fluorine containing resins to the surface of the blend films. We analyzed Quantitative Structure-Property Relationships (QSPR) between the surface properties and the chemical composition of the surface of polymer blend resists. The addition of 10 wt% of the polymer (Resin 1-6) to the base polymer (Resin 0) did not influence the lithographic performance. Consequently, the surface properties of resist thin films can be tailored by the appropriate choice of fluorine containing polymer blends.
Lithographic VCSEL array multimode and single mode sources for sensing and 3D imaging
NASA Astrophysics Data System (ADS)
Leshin, J.; Li, M.; Beadsworth, J.; Yang, X.; Zhang, Y.; Tucker, F.; Eifert, L.; Deppe, D. G.
2016-05-01
Sensing applications along with free space data links can benefit from advanced laser sources that produce novel radiation patterns and tight spectral control for optical filtering. Vertical-cavity surface-emitting lasers (VCSELs) are being developed for these applications. While oxide VCSELs are being produced by most companies, a new type of oxide-free VCSEL is demonstrating many advantages in beam pattern, spectral control, and reliability. These lithographic VCSELs offer increased power density from a given aperture size, and enable dense integration of high efficiency and single mode elements that improve beam pattern. In this paper we present results for lithographic VCSELs and describes integration into military systems for very low cost pulsed applications, as well as continuouswave applications in novel sensing applications. The VCSELs are being developed for U.S. Army for soldier weapon engagement simulation training to improve beam pattern and spectral control. Wavelengths in the 904 nm to 990 nm ranges are being developed with the spectral control designed to eliminate unwanted water absorption bands from the data links. Multiple beams and radiation patterns based on highly compact packages are being investigated for improved target sensing and transmission fidelity in free space data links. These novel features based on the new VCSEL sources are also expected to find applications in 3-D imaging, proximity sensing and motion control, as well as single mode sensors such as atomic clocks and high speed data transmission.
Bi-level multilayered microelectronic device package with an integral window
Peterson, Kenneth A.; Watson, Robert D.
2002-01-01
A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.
Applications of CPL mask technology for sub-65nm gate imaging
NASA Astrophysics Data System (ADS)
Litt, Lloyd C.; Conley, Will; Wu, Wei; Peters, Richie; Parker, Colita; Cobb, Jonathan; Kasprowicz, Bryan S.; van den Broeke, Doug; Park, J. C.; Karur-Shanmugam, Ramkumar
2005-05-01
The requirements for critical dimension control on gate layer for high performance products are increasingly demanding. Phase shift techniques provide aerial image enhancement, which can translate into improved process window performance and greater critical dimension (CD) control if properly applied. Unfortunately, the application of hard shifter technology to production requires significant effort in layout and optical proximity correction (OPC) application. Chromeless Phase Lithography (CPL) has several advantages over complementary phase mask (c:PSM) such as use of a single mask, and lack of phase placement 'coloring' conflicts and phase imbalance issues. CPL does have implementation issues that must be resolved before it can be used in full-scale production. CPL mask designs can be approached by separating features into three zones based on several parameters, including size relative to the lithographic resolution of the stepper lens, wavelength, and illumination conditions defined. Features are placed into buckets for different treatment zones. Zone 1 features are constructed with 100% transmission phase shifted structures and Zone 3 features are chrome (binary) structures. Features that fall into Zone 2, which are too wide to be defined using the 100% transmission of pure CPL (i.e. have negative mask error factor, MEEF) are the most troublesome and can be approached in several ways. The authors have investigated the application of zebra structures of various sizes to product type layouts. Previous work to investigate CPL using test structures set the groundwork for the more difficult task of applying CPL rules to actual random logic design layouts, which include many zone transitions. Mask making limitations have been identified that play a role in the zebra sizing that can be applied to Zone 2 features. The elimination of Zone 2 regions was also investigated in an effort to simplify the application of CPL and improve manufacturability of reticle through data enhancements.
Fabrication of 3D polymer photonic crystals for near-IR applications
NASA Astrophysics Data System (ADS)
Yao, Peng; Qiu, Liang; Shi, Shouyuan; Schneider, Garrett J.; Prather, Dennis W.; Sharkawy, Ahmed; Kelmelis, Eric
2008-02-01
Photonic crystals[1, 2] have stirred enormous research interest and became a growing enterprise in the last 15 years. Generally, PhCs consist of periodic structures that possess periodicity comparable with the wavelength that the PhCs are designed to modulate. If material and periodic pattern are properly selected, PhCs can be applied to many applications based on their unique properties, including photonic band gaps (PBG)[3], self-collimation[4], super prism[5], etc. Strictly speaking, PhCs need to possess periodicity in three dimensions to maximize their advantageous capabilities. However, many current research is based on scaled two-dimensional PhCs, mainly due to the difficulty of fabrication such three-dimensional PhCs. Many approaches have been explored for the fabrication of 3D photonic crystals, including layer-by-layer surface micromachining[6], glancing angle deposition[7], 3D micro-sculpture method[8], self-assembly[9] and lithographical methods[10-12]. Among them, lithographic methods became increasingly accepted due to low costs and precise control over the photonic crystal structure. There are three mostly developed lithographical methods, namely X-ray lithography[10], holographic lithography[11] and two-photon polymerization[12]. Although significant progress has been made in developing these lithography-based technologies, these approaches still suffer from significant disadvantages. X-ray lithography relies on an expensive radiation source. Holographic lithography lacks the flexibility to create engineered defects, and multi-photon polymerization is not suitable for parallel fabrication. In our previous work, we developed a multi-layer photolithography processes[13, 14] that is based on multiple resist application and enhanced absorption upon exposure. Using a negative lift-off resist (LOR) and 254nm DUV source, we have demonstrated fabrication of 3D arbitrary structures with feature size of several microns. However, severe intermixing problem occurred as we reduced the lattice constant for near-IR applications. In this work, we address this problem by employing SU8. The exposure is vertically confined by using a mismatched 220nm DUV source. Intermixing problem is eliminated due to more densely crosslinked resist molecules. Using this method, we have demonstrated 3D "woodpile" structure with 1.55μm lattice constant and a 2mm-by-2mm pattern area.
Sol-gel antireflective spin-coating process for large-size shielding windows
NASA Astrophysics Data System (ADS)
Belleville, Philippe F.; Prene, Philippe; Mennechez, Francoise; Bouigeon, Christian
2002-10-01
The interest of the antireflective coatings applied onto large-area glass components increases everyday for the potential application such as building or shop windows. Today, because of the use of large size components, sol-gel process is a competitive way for antireflective coating mass production. The dip-coating technique commonly used for liquid-deposition, implies a safety hazard due to coating solution handling and storage in the case of large amounts of highly flammable solvent use. On the other hand, spin-coating is a liquid low-consumption technique. Mainly devoted to coat circular small-size substrate, we have developed a spin-coating machine able to coat large-size rectangular windows (up to 1 x 1.7 m2). Both solutions and coating conditions have been optimized to deposit optical layers with accurate and uniform thickness and to highly limit the edge effects. Experimental single layer antireflective coating deposition process onto large-area shielding windows (1000 x 1700 x 20 mm3) is described. Results show that the as-developed process could produce low specular reflection value (down to 1% one side) onto white-glass windows over the visible range (460-750 nm). Low-temperature curing process (120°C) used after sol-gel deposition enables antireflective-coating to withstand abrasion-resistance properties in compliance to US-MIL-C-0675C moderate test.
2009-03-01
the Distrustful Decomposition pattern: • a number of separate programs, each running in a separate process . For more complete sepa- ration, each...be used in place of fork(). For example, under various versions of Windows, the CreateProcess() func- tion is used to spawn a child process . Figure...list contains the SIDs of the client processes that are allowed to connect to the server, that is, the Windows service. For more information about
[Online endpoint detection algorithm for blending process of Chinese materia medica].
Lin, Zhao-Zhou; Yang, Chan; Xu, Bing; Shi, Xin-Yuan; Zhang, Zhi-Qiang; Fu, Jing; Qiao, Yan-Jiang
2017-03-01
Blending process, which is an essential part of the pharmaceutical preparation, has a direct influence on the homogeneity and stability of solid dosage forms. With the official release of Guidance for Industry PAT, online process analysis techniques have been more and more reported in the applications in blending process, but the research on endpoint detection algorithm is still in the initial stage. By progressively increasing the window size of moving block standard deviation (MBSD), a novel endpoint detection algorithm was proposed to extend the plain MBSD from off-line scenario to online scenario and used to determine the endpoint in the blending process of Chinese medicine dispensing granules. By online learning of window size tuning, the status changes of the materials in blending process were reflected in the calculation of standard deviation in a real-time manner. The proposed method was separately tested in the blending processes of dextrin and three other extracts of traditional Chinese medicine. All of the results have shown that as compared with traditional MBSD method, the window size changes according to the proposed MBSD method (progressively increasing the window size) could more clearly reflect the status changes of the materials in blending process, so it is suitable for online application. Copyright© by the Chinese Pharmaceutical Association.
Evolution of oxygenated cadmium sulfide (CdS:O) during high-temperature CdTe solar cell fabrication
DOE Office of Scientific and Technical Information (OSTI.GOV)
Meysing, Daniel M.; Reese, Matthew O.; Warren, Charles W.
Oxygenated cadmium sulfide (CdS:O) produced by reactive sputtering has emerged as a promising alternative to conventional CdS for use as the n-type window layer in CdTe solar cells. Here, complementary techniques are used to expose the window layer (CdS or CdS:O) in completed superstrate devices and combined with a suite of materials characterization to elucidate its evolution during high temperature device processing. During device fabrication amorphous CdS:O undergoes significant interdiffusion with CdTe and recrystallization, forming CdS1-yTey nanocrystals whose Te fraction approaches solubility limits. Significant oxygen remains after processing, concentrated in sulfate clusters dispersed among the CdS1-yTey alloy phase, accounting formore » ~30% of the post-processed window layer based on cross-sectional microscopy. Interdiffusion and recrystallization are observed in devices with un-oxygenated CdS, but to a much lesser extent. Etching experiments suggest that the CdS thickness is minimally changed during processing, but the CdS:O window layer is reduced from 100 nm to 60-80 nm, which is confirmed by microscopy. Alloying reduces the band gap of the CdS:O window layer to 2.15 eV, but reductions in thickness and areal density improve its transmission spectrum, which is well matched to device quantum efficiency. The changes to the window layer in the reactive environments of device fabrication are profoundly different than what occurs by thermal annealing in an inert environment, which produced films with a band gap of 2.4 eV for both CdS and CdS:O. These results illustrate for the first time the significant changes that occur to the window layer during processing that are critical to the performance of CdTe solar cells.« less
Flow chemistry using milli- and microstructured reactors-from conventional to novel process windows.
Illg, Tobias; Löb, Patrick; Hessel, Volker
2010-06-01
The terminology Novel Process Window unites different methods to improve existing processes by applying unconventional and harsh process conditions like: process routes at much elevated pressure, much elevated temperature, or processing in a thermal runaway regime to achieve a significant impact on process performance. This paper is a review of parts of IMM's works in particular the applicability of above mentioned Novel Process Windows on selected chemical reactions. First, general characteristics of microreactors are discussed like excellent mass and heat transfer and improved mixing quality. Different types of reactions are presented in which the use of microstructured devices led to an increased process performance by applying Novel Process Windows. These examples were chosen to demonstrate how chemical reactions can benefit from the use of milli- and microstructured devices and how existing protocols can be changed toward process conditions hitherto not applicable in standard laboratory equipment. The used milli- and microstructured reactors can also offer advantages in other areas, for example, high-throughput screening of catalysts and better control of size distribution in a particle synthesis process by improved mixing, etc. The chemical industry is under continuous improvement. So, a lot of research is being done to synthesize high value chemicals, to optimize existing processes in view of process safety and energy consumption and to search for new routes to produce such chemicals. Leitmotifs of such undertakings are often sustainable development(1) and Green Chemistry(2).
Window of Opportunity? Adolescence, Music, and Algebra
ERIC Educational Resources Information Center
Helmrich, Barbara H.
2010-01-01
Research has suggested that musicians process music in the same cortical regions that adolescents process algebra. An early adolescence synaptogenesis might present a window of opportunity during middle school for music to create and strengthen enduring neural connections in those regions. Six school districts across Maryland provided scores from…
A test of multiple correlation temporal window characteristic of non-Markov processes
NASA Astrophysics Data System (ADS)
Arecchi, F. T.; Farini, A.; Megna, N.
2016-03-01
We introduce a sensitive test of memory effects in successive events. The test consists of a combination K of binary correlations at successive times. K decays monotonically from K = 1 for uncorrelated events as a Markov process. For a monotonic memory fading, K<1 always. Here we report evidence of a K>1 temporal window in cognitive tasks consisting of the visual identification of the front face of the Necker cube after a previous presentation of the same. We speculate that memory effects provide a temporal window with K>1 and this experiment could be a possible first step towards a better comprehension of this phenomenon. The K>1 behaviour is maximal at an inter-measurement time τ around 2s with inter-subject differences. The K>1 persists over a time window of 1s around τ; outside this window the K<1 behaviour is recovered. The universal occurrence of a K>1 window in pairs of successive perceptions suggests that, at variance with single visual stimuli eliciting a suitable response, a pair of stimuli shortly separated in time displays mutual correlations.
Window encapsulation in car industry by using the 50 {Omega} RF technology
DOE Office of Scientific and Technical Information (OSTI.GOV)
Bernard, J.P.; Barboteau, M.; Collet, L.
Throughout the world car industry has been using window encapsulation for a few years now. This technology is mainly used in production lines and is called RIM for polyurethane reaction injection moulding. This technology, however brings about some problems such as: glass breaking during mould closure, high production cost, systematic rough edges. The PSA Group (Peugeot-Citroen), a pioneer in this field, in collaboration with SAIREM has launched a new innovating process for window encapsulation by using the 50 {Omega} RF technology for gelling PVC Plastisol. The study was followed by an industrial prototype. Industrial equipment was then installed at WEBASTOmore » HEULIEZ for window encapsulation of the sunshine roof for the Citroen Xantia. The authors describe the principle of window encapsulation and the different existing processes. They describe the 50 {Omega} RF technology, an industrial installation and the constraints of this technology in order to get maximum efficiency. In the conclusion they present a technical and economical analysis of the different solutions for window encapsulation. They also present the advantages of the 50 {Omega} RF technology and the new opportunities it offers.« less
High performance sapphire windows
NASA Technical Reports Server (NTRS)
Bates, Stephen C.; Liou, Larry
1993-01-01
High-quality, wide-aperture optical access is usually required for the advanced laser diagnostics that can now make a wide variety of non-intrusive measurements of combustion processes. Specially processed and mounted sapphire windows are proposed to provide this optical access to extreme environment. Through surface treatments and proper thermal stress design, single crystal sapphire can be a mechanically equivalent replacement for high strength steel. A prototype sapphire window and mounting system have been developed in a successful NASA SBIR Phase 1 project. A large and reliable increase in sapphire design strength (as much as 10x) has been achieved, and the initial specifications necessary for these gains have been defined. Failure testing of small windows has conclusively demonstrated the increased sapphire strength, indicating that a nearly flawless surface polish is the primary cause of strengthening, while an unusual mounting arrangement also significantly contributes to a larger effective strength. Phase 2 work will complete specification and demonstration of these windows, and will fabricate a set for use at NASA. The enhanced capabilities of these high performance sapphire windows will lead to many diagnostic capabilities not previously possible, as well as new applications for sapphire.
High performance sapphire windows
NASA Astrophysics Data System (ADS)
Bates, Stephen C.; Liou, Larry
1993-02-01
High-quality, wide-aperture optical access is usually required for the advanced laser diagnostics that can now make a wide variety of non-intrusive measurements of combustion processes. Specially processed and mounted sapphire windows are proposed to provide this optical access to extreme environment. Through surface treatments and proper thermal stress design, single crystal sapphire can be a mechanically equivalent replacement for high strength steel. A prototype sapphire window and mounting system have been developed in a successful NASA SBIR Phase 1 project. A large and reliable increase in sapphire design strength (as much as 10x) has been achieved, and the initial specifications necessary for these gains have been defined. Failure testing of small windows has conclusively demonstrated the increased sapphire strength, indicating that a nearly flawless surface polish is the primary cause of strengthening, while an unusual mounting arrangement also significantly contributes to a larger effective strength. Phase 2 work will complete specification and demonstration of these windows, and will fabricate a set for use at NASA. The enhanced capabilities of these high performance sapphire windows will lead to many diagnostic capabilities not previously possible, as well as new applications for sapphire.
NASA Astrophysics Data System (ADS)
Morse, Clinton; Latuga, Brian M.; Delfaus, Stephen; Devore, Thomas C.; Augustine, Brian H.; Hughes, W. Christopher; Warne, Paul G.
2003-11-01
Using the liquid cell capability of the atomic force microscope (AFM), we report the determination of the activation energy of the biodegradation process of the enzymatic biodegradation of poly 3-hydroxybutyrate / poly 3-hydroxyvalerate [P(3HB-HV)] thin films. We have prepared P(3HB-3HV) copolymer microstructures by the selective dewetting of soft lithographically patterned gold substrates with features sizes down to 10 mm. These have been then used as an internal height standard to measure the volume of material as a function of biodegradation time. Biodegradation is measured in-situ and real time using contact mode AFM in an enzymatic solution produced from Streptomyces sp. bacteria. The temperature dependent biodegradation has been measured over a temperature range from 23oC to 40oC. We will discuss the calculation of the activation energy of this process as well as a physical model to describe three distinct regions in the biodegradation process that have been observed.
Characterization of few-layered graphene grown by carbon implantation
NASA Astrophysics Data System (ADS)
Lee, Kin Kiong; McCallum, Jeffrey C.; Jamieson, David N.
2014-02-01
Graphene is considered to be a very promising material for applications in nanotechnology. The properties of graphene are strongly dependent on defects that occur during growth and processing. These defects can be either detrimental or beneficial to device performance depending on defect type, location and device application. Here we present experimental results on formation of few-layered graphene by carbon ion implantation into nickel films and characteristics of graphene devices formed by graphene transfer and lithographic patterning. Micro-Raman spectroscopy was used to determine the number of graphene layers formed and identify defects arising from the device processing. The graphene films were cleaned by annealing in vacuum. Transport properties of cleaned graphene films were investigated by fabrication of back-gated field-effect transistors, which exhibited high hole and electron mobility of 1935 and 1905 cm2/Vs, respectively.
Photoresist Design for Elastomeric Light Tunable Photonic Devices
Nocentini, Sara; Martella, Daniele; Parmeggiani, Camilla; Wiersma, Diederik S.
2016-01-01
An increasing interest in tunable photonic structures is growing within the photonic community. The usage of Liquid Crystalline Elastomer (LCE) structures in the micro-scale has been motivated by the potential to remotely control their properties. In order to design elastic photonic structures with a three-dimensional lithographic technique, an analysis of the different mixtures used in the micro-printing process is required. Previously reported LCE microstructures suffer damage and strong swelling as a limiting factor of resolution. In this article, we reported a detailed study on the writing process with four liquid crystalline photoresists, in which the percentage of crosslinker is gradually increased. The experiments reveal that exploiting the crosslinking degree is a possible means in which to obtain suspended lines with good resolution, quite good rigidity, and good elasticity, thereby preserving the possibility of deformation by light irradiation. PMID:28773646
Photoresist Design for Elastomeric Light Tunable Photonic Devices.
Nocentini, Sara; Martella, Daniele; Parmeggiani, Camilla; Wiersma, Diederik S
2016-06-29
An increasing interest in tunable photonic structures is growing within the photonic community. The usage of Liquid Crystalline Elastomer (LCE) structures in the micro-scale has been motivated by the potential to remotely control their properties. In order to design elastic photonic structures with a three-dimensional lithographic technique, an analysis of the different mixtures used in the micro-printing process is required. Previously reported LCE microstructures suffer damage and strong swelling as a limiting factor of resolution. In this article, we reported a detailed study on the writing process with four liquid crystalline photoresists, in which the percentage of crosslinker is gradually increased. The experiments reveal that exploiting the crosslinking degree is a possible means in which to obtain suspended lines with good resolution, quite good rigidity, and good elasticity, thereby preserving the possibility of deformation by light irradiation.
Photorefractive-based adaptive optical windows
NASA Astrophysics Data System (ADS)
Liu, Yuexin; Yang, Yi; Wang, Bo; Fu, John Y.; Yin, Shizhuo; Guo, Ruyan; Yu, Francis T.
2004-10-01
Optical windows have been widely used in optical spectrographic processing system. In this paper, various window profiles, such as rectangular, triangular, Hamming, Hanning, and Blackman etc., have been investigated in detail, regarding their effect on the generated spectrograms, such as joint time-frequency resolution ΔtΔw, the sidelobe amplitude attenuation etc.. All of these windows can be synthesized in a photorefractive crystal by angular multiplexing holographic technique, which renders the system more adaptive. Experimental results are provided.
Carbon dioxide gas purification and analytical measurement for leading edge 193nm lithography
NASA Astrophysics Data System (ADS)
Riddle Vogt, Sarah; Landoni, Cristian; Applegarth, Chuck; Browning, Matt; Succi, Marco; Pirola, Simona; Macchi, Giorgio
2015-03-01
The use of purified carbon dioxide (CO2) has become a reality for leading edge 193 nm immersion lithography scanners. Traditionally, both dry and immersion 193 nm lithographic processes have constantly purged the optics stack with ultrahigh purity compressed dry air (UHPCDA). CO2 has been utilized for a similar purpose as UHPCDA. Airborne molecular contamniation (AMC) purification technologies and analytical measurement methods have been extensively developed to support the Lithography Tool Manufacturers purity requirements. This paper covers the analytical tests and characterizations carried out to assess impurity removal from 3.0 N CO2 (beverage grade) for its final utilization in 193 nm and EUV scanners.
NASA Astrophysics Data System (ADS)
Kornbluth, Y. S.; Mathews, R. H.; Parameswaran, L.; Racz, L. M.; Velásquez-García, L. F.
2018-04-01
We report the design, modelling, and proof-of-concept demonstration of a continuously fed, atmospheric-pressure microplasma metal sputterer that is capable of printing conductive lines narrower than the width of the target without the need for post-processing or lithographic patterning. Ion drag-induced focusing is harnessed to print narrow lines; the focusing mechanism is modelled via COMSOL Multiphysics simulations and validated with experiments. A microplasma sputter head with gold target is constructed and used to deposit imprints with minimum feature sizes as narrow as 9 µm, roughness as small as 55 nm, and electrical resistivity as low as 1.1 µΩ · m.
Future of the Particle Replication in Nonwetting Templates (PRINT) Technology
Xu, Jing; Wong, Dominica H. C.; Byrne, James D.; Chen, Kai; Bowerman, Charles
2014-01-01
Particle replication in nonwetting templates (PRINT) is a continuous, roll-to-roll, high-resolution molding technology which allows the design and synthesis of precisely defined micro- and nanoparticles. This technology adapts the lithographic techniques from the microelectronics industry and marries these with the roll-to-roll processes from the photographic film industry to enable researchers to have unprecedented control over particle size, shape, chemical composition, cargo, modulus, and surface properties. In addition, PRINT is a GMP-compliant (GMP = good manufacturing practice) platform amenable for particle fabrication on a large scale. Herein, we describe some of our most recent work involving the PRINT technology for application in the biomedical and material sciences. PMID:23670869
Magnetic assembly and annealing of colloidal lattices and superlattices.
Tierno, Pietro
2014-07-08
The ability to assemble mesoscopic colloidal lattices above a surface is important for fundamental studies related with nucleation and crystallization but also for a variety of technological applications in photonics and microengineering. Current techniques based on particle sedimentation above a lithographic template are limited by a slow deposition process and by the use of static templates, which make difficult to implement fast annealing procedures. Here it is demonstrated a method to realize and anneal a series of colloidal lattices displaying triangular, honeycomb, or kagome-like symmetry above a structure magnetic substrate. By using a binary mixture of particles, superlattices can be realized increasing further the variety and complexity of the colloidal patterns which can be produced.
Morales, Alfredo M [Livermore, CA; Gonzales, Marcela [Seattle, WA
2006-03-07
The present invention describes a method for fabricating an embossing tool or an x-ray mask tool, providing microstructures that smoothly vary in height from point-to-point in etched substrates, i.e., structure which can vary in all three dimensions. The process uses a lithographic technique to transfer an image pattern in the surface of a silicon wafer by exposing and developing the resist and then etching the silicon substrate. Importantly, the photoresist is variably exposed so that when developed some of the resist layer remains. The remaining undeveloped resist acts as an etchant barrier to the reactive plasma used to etch the silicon substrate and therefore provides the ability etch structures of variable depths.
Photocurable Polymers for Ion Selective Field Effect Transistors. 20 Years of Applications
Abramova, Natalia; Bratov, Andrei
2009-01-01
Application of photocurable polymers for encapsulation of ion selective field effect transistors (ISFET) and for membrane formation in chemical sensitive field effect transistors (ChemFET) during the last 20 years is discussed. From a technological point of view these materials are quite interesting because they allow the use of standard photo-lithographic processes, which reduces significantly the time required for sensor encapsulation and membrane deposition and the amount of manual work required for this, all items of importance for sensor mass production. Problems associated with the application of this kind of polymers in sensors are analysed and estimation of future trends in this field of research are presented. PMID:22399988
Extreme Mechanics: Self-Folding Origami
NASA Astrophysics Data System (ADS)
Santangelo, Christian D.
2017-03-01
Origami has emerged as a tool for designing three-dimensional structures from flat films. Because they can be fabricated by lithographic or roll-to-roll processing techniques, they have great potential for the manufacture of complicated geometries and devices. This article discusses the mechanics of origami and kirigami with a view toward understanding how to design self-folding origami structures. Whether an origami structure can be made to fold autonomously depends strongly on the geometry and kinematics of the origami fold pattern. This article collects some of the results on origami rigidity into a single framework, and discusses how these aspects affect the foldability of origami. Despite recent progress, most problems in origami and origami design remain completely open.
NASA Technical Reports Server (NTRS)
McMillan, R. Andrew; Howard, Jeanie; Zaluzec, Nestor J.; Kagawa, Hiromi K.; Li, Yi-Fen; Paavola, Chad D.; Trent, Jonathan D.
2004-01-01
Self-assembling biomolecules that form highly ordered structures have attracted interest as potential alternatives to conventional lithographic processes for patterning materials. Here we introduce a general technique for patterning materials on the nanoscale using genetically modified protein cage structures called chaperonins that self-assemble into crystalline templates. Constrained chemical synthesis of transition metal nanoparticles is specific to templates genetically functionalized with poly-Histidine sequences. These arrays of materials are ordered by the nanoscale structure of the crystallized protein. This system may be easily adapted to pattern a variety of materials given the rapidly growing list of peptide sequences selected by screening for specificity for inorganic materials.
Ultrahigh-density nanowire arrays grown in self-assembled diblock copolymer templates.
Thurn-Albrecht, T; Schotter, J; Kästle, G A; Emley, N; Shibauchi, T; Krusin-Elbaum, L; Guarini, K; Black, C T; Tuominen, M T; Russell, T P
2000-12-15
We show a simple, robust, chemical route to the fabrication of ultrahigh-density arrays of nanopores with high aspect ratios using the equilibrium self-assembled morphology of asymmetric diblock copolymers. The dimensions and lateral density of the array are determined by segmental interactions and the copolymer molecular weight. Through direct current electrodeposition, we fabricated vertical arrays of nanowires with densities in excess of 1.9 x 10(11) wires per square centimeter. We found markedly enhanced coercivities with ferromagnetic cobalt nanowires that point toward a route to ultrahigh-density storage media. The copolymer approach described is practical, parallel, compatible with current lithographic processes, and amenable to multilayered device fabrication.
HRCT Correlation with Round Window Identification during Cochlear Implantation in Children.
Pendem, Sai Kiran; Rangasami, Rajeswaran; Arunachalam, Ravi Kumar; Mohanarangam, Venkata Sai Pulivadulu; Natarajan, Paarthipan
2014-01-01
To determine the accuracy of High Resolution Computer Tomography (HRCT) temporal bone measurements in predicting the actual visualization of round window niche as viewed through posterior tympanotomy (i.e. facial recess). This is a prospective study of 37 cochlear implant candidates, aged between 1and 6 years, who were referred for HRCT temporal bone during the period December 2013 to July 2014. Cochlear implantation was done in 37 children (25 in the right ear and 12 in the left ear). The distance between the short process of incus and the round window niche and the distance between the oval window and the round window niche were measured preoperatively on sub-millimeter (0.7 mm) HRCT images. We classified the visibility of round window niche based on the surgical view (i.e. through posterior tympanotomy) during surgery into three types: 1) Type 1- fully visible, 2) Type 2- partially visible, and 3) Type 3- difficult to visualize. The preoperative HRCT measurements were used to predict the type of visualization of round window niche before surgery and correlated with the findings during surgery. The mean and standard deviation for the distance between the short process of incus and the round window niche and for the distance between the oval window and the round window niche for Types 1, 2, and 3 were 8.5 ± 0.2 mm and 3.2 ± 0.2 mm, 8.0 ± 0.4 mm and 3.8 ± 0.2 mm, 7.5 ± 0.2 mm and 4.4 ± 0.2 mm respectively, and showed statistically significant difference (P < 0.01) between them. The preoperative HRCT measurements had a sensitivity and specificity of 92.3% and 96.2%, respectively, in determining the actual visualization of round window niche. This study shows preoperative HRCT temporal bone measurements are useful in predicting the actual visualization of round window niche as viewed through posterior tympanotomy.
Imaging windows for long-term intravital imaging
Alieva, Maria; Ritsma, Laila; Giedt, Randy J; Weissleder, Ralph; van Rheenen, Jacco
2014-01-01
Intravital microscopy is increasingly used to visualize and quantitate dynamic biological processes at the (sub)cellular level in live animals. By visualizing tissues through imaging windows, individual cells (e.g., cancer, host, or stem cells) can be tracked and studied over a time-span of days to months. Several imaging windows have been developed to access tissues including the brain, superficial fascia, mammary glands, liver, kidney, pancreas, and small intestine among others. Here, we review the development of imaging windows and compare the most commonly used long-term imaging windows for cancer biology: the cranial imaging window, the dorsal skin fold chamber, the mammary imaging window, and the abdominal imaging window. Moreover, we provide technical details, considerations, and trouble-shooting tips on the surgical procedures and microscopy setups for each imaging window and explain different strategies to assure imaging of the same area over multiple imaging sessions. This review aims to be a useful resource for establishing the long-term intravital imaging procedure. PMID:28243510
Imaging windows for long-term intravital imaging: General overview and technical insights.
Alieva, Maria; Ritsma, Laila; Giedt, Randy J; Weissleder, Ralph; van Rheenen, Jacco
2014-01-01
Intravital microscopy is increasingly used to visualize and quantitate dynamic biological processes at the (sub)cellular level in live animals. By visualizing tissues through imaging windows, individual cells (e.g., cancer, host, or stem cells) can be tracked and studied over a time-span of days to months. Several imaging windows have been developed to access tissues including the brain, superficial fascia, mammary glands, liver, kidney, pancreas, and small intestine among others. Here, we review the development of imaging windows and compare the most commonly used long-term imaging windows for cancer biology: the cranial imaging window, the dorsal skin fold chamber, the mammary imaging window, and the abdominal imaging window. Moreover, we provide technical details, considerations, and trouble-shooting tips on the surgical procedures and microscopy setups for each imaging window and explain different strategies to assure imaging of the same area over multiple imaging sessions. This review aims to be a useful resource for establishing the long-term intravital imaging procedure.
Processing Cones: A Computational Structure for Image Analysis.
1981-12-01
image analysis applications, referred to as a processing cone, is described and sample algorithms are presented. A fundamental characteristic of the structure is its hierarchical organization into two-dimensional arrays of decreasing resolution. In this architecture, a protypical function is defined on a local window of data and applied uniformly to all windows in a parallel manner. Three basic modes of processing are supported in the cone: reduction operations (upward processing), horizontal operations (processing at a single level) and projection operations (downward
Domain alignment within ferroelectric/dielectric PbTiO 3 /SrTiO 3 superlattice nanostructures
Park, Joonkyu; Mangeri, John; Zhang, Qingteng; ...
2018-01-01
The ferroelectric domain pattern within lithographically defined PbTiO 3/SrTiO 3ferroelectric/dielectric heteroepitaxial superlattice nanostructures is strongly influenced by the edges of the structures.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Nam, Chang-Yong, E-mail: cynam@bnl.gov; Stein, Aaron; Kisslinger, Kim
We investigate the electrical and structural properties of infiltration-synthesized ZnO. In-plane ZnO nanowire arrays with prescribed positional registrations are generated by infiltrating diethlyzinc and water vapor into lithographically defined SU-8 polymer templates and removing organic matrix by oxygen plasma ashing. Transmission electron microscopy reveals that homogeneously amorphous as-infiltrated polymer templates transform into highly nanocrystalline ZnO upon removal of organic matrix. Field-effect transistor device measurements show that the synthesized ZnO after thermal annealing displays a typical n-type behavior, ∼10{sup 19 }cm{sup −3} carrier density, and ∼0.1 cm{sup 2} V{sup −1} s{sup −1} electron mobility, reflecting highly nanocrystalline internal structure. The results demonstrate themore » potential application of infiltration synthesis in fabricating metal oxide electronic devices.« less
Scheible, Max B; Pardatscher, Günther; Kuzyk, Anton; Simmel, Friedrich C
2014-03-12
The combination of molecular self-assembly based on the DNA origami technique with lithographic patterning enables the creation of hierarchically ordered nanosystems, in which single molecules are positioned at precise locations on multiple length scales. Based on a hybrid assembly protocol utilizing DNA self-assembly and electron-beam lithography on transparent glass substrates, we here demonstrate a DNA origami microarray, which is compatible with the requirements of single molecule fluorescence and super-resolution microscopy. The spatial arrangement allows for a simple and reliable identification of single molecule events and facilitates automated read-out and data analysis. As a specific application, we utilize the microarray to characterize the performance of DNA strand displacement reactions localized on the DNA origami structures. We find considerable variability within the array, which results both from structural variations and stochastic reaction dynamics prevalent at the single molecule level.
Rodríguez-Yáñez, Alicia Berenice; Méndez-Vázquez, Yaileen
2014-01-01
Process windows in injection molding are habitually built with only one performance measure in mind. In reality, a more realistic picture can be obtained when considering multiple performance measures at a time, especially in the presence of conflict. In this work, the construction of process windows for injection molding (IM) is undertaken considering two and three performance measures in conflict simultaneously. The best compromises between the criteria involved are identified through the direct application of the concept of Pareto-dominance in multiple criteria optimization. The aim is to provide a formal and realistic strategy to set processing conditions in IM operations. The resulting optimization approach is easily implementable in MS Excel. The solutions are presented graphically to facilitate their use in manufacturing plants. PMID:25530927
Rodríguez-Yáñez, Alicia Berenice; Méndez-Vázquez, Yaileen; Cabrera-Ríos, Mauricio
2014-01-01
Process windows in injection molding are habitually built with only one performance measure in mind. In reality, a more realistic picture can be obtained when considering multiple performance measures at a time, especially in the presence of conflict. In this work, the construction of process windows for injection molding (IM) is undertaken considering two and three performance measures in conflict simultaneously. The best compromises between the criteria involved are identified through the direct application of the concept of Pareto-dominance in multiple criteria optimization. The aim is to provide a formal and realistic strategy to set processing conditions in IM operations. The resulting optimization approach is easily implementable in MS Excel. The solutions are presented graphically to facilitate their use in manufacturing plants.
Multilayered microelectronic device package with an integral window
Peterson, Kenneth A.; Watson, Robert D.
2003-01-01
An apparatus for packaging of microelectronic devices is disclosed, wherein the package includes an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can comprise, for example, a cofired ceramic frame or body. The package has an internal stepped structure made of a plurality of plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package, according to some embodiments. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination. The integral window can further include a lens for optically transforming light passing through the window. The package can include an array of binary optic lenslets made integral with the window. The package can include an electrically-switched optical modulator, such as a lithium niobate window attached to the package, for providing a very fast electrically-operated shutter.
Interior of processing room. Scale is in front of windows ...
Interior of processing room. Scale is in front of windows for weighing shuckers' buckets of oyster meat. Blow tank for thoroughly cleaning the oyster meat and two skimming tables for rinsing and draining can also be seen. - J.C. Lore Oyster House, 14430 Solomons Island Road, Solomons, Calvert County, MD
NASA Astrophysics Data System (ADS)
Yeh, Wei-Ming; Lawson, Richard A.; Tolbert, Laren M.; Henderson, Clifford L.
2012-03-01
As the semiconductor industry continues to push to smaller critical dimensions, pattern collapse during lithographic processing caused by unbalanced capillary forces during the final rinse and drying process has become an important problem that can limit the practical resolution of a resist material to feature sizes larger than its intrinsic resolution limit. One of the primary modes of pattern collapse is via elastoplastic pattern deformation which is strongly related to the mechanical properties of the resist. One approach to mitigating such collapse problems is to enhance the mechanical properties of the resist features. Since such modification of resist physical properties for pattern collapse purposes is difficult to achieve through modified formulation of the resist itself (i.e. due to the complex set of requirements that a resist must satisfy and the complex set of physical and chemical phenomena that underlie the imaging processing itself), we have pursued an alternative strategy for improving the resist mechanical properties after features are developed in the film but before they are rinsed and dried. The family of techniques being developed in this work function through the use of aqueous compatible reactive rinse solutions that can be applied to developed resist features while they are wet during normal rinse processing on a track system. By applying these techniques during the rinse process, the resist features can be strengthened before they are subjected to significant capillary forces during the final drying step. In this work, the use of diamine compounds to reactively crosslink the surface of resists containing carboxylic acid groups through formation of amide bonds using carbodiimide chemistry has been explored. One advantage of this approach is that it is an aqueous process that should be easily compatible with high volume, track-based lithographic processes. Contact angle studies and x-ray photoelectron spectroscopy (XPS) were used to characterize the surface crosslinking reaction using such diamine surface rinse treatments. Pattern collapse test structures were fabricated and analyzed to measure the amount of mechanical property improvement imparted by such treatments. Application of such amine reactive rinses was found to clearly result in an improvement in the resistance of resists to pattern collapse as observed by SEM. A comparison of the critical stress at the point of pattern collapse as a function of resist feature size also clearly shows a significant improvement in mechanical resilience of resist samples processed with the reactive rinse treatment.
Self spectrum window method in wigner-ville distribution.
Liu, Zhongguo; Liu, Changchun; Liu, Boqiang; Lv, Yangsheng; Lei, Yinsheng; Yu, Mengsun
2005-01-01
Wigner-Ville distribution (WVD) is an important type of time-frequency analysis in biomedical signal processing. The cross-term interference in WVD has a disadvantageous influence on its application. In this research, the Self Spectrum Window (SSW) method was put forward to suppress the cross-term interference, based on the fact that the cross-term and auto-WVD- terms in integral kernel function are orthogonal. With the Self Spectrum Window (SSW) algorithm, a real auto-WVD function was used as a template to cross-correlate with the integral kernel function, and the Short Time Fourier Transform (STFT) spectrum of the signal was used as window function to process the WVD in time-frequency plane. The SSW method was confirmed by computer simulation with good analysis results. Satisfactory time- frequency distribution was obtained.
NASA Astrophysics Data System (ADS)
Tong, Qiujie; Wang, Qianqian; Li, Xiaoyang; Shan, Bin; Cui, Xuntai; Li, Chenyu; Peng, Zhong
2016-11-01
In order to satisfy the requirements of the real-time and generality, a laser target simulator in semi-physical simulation system based on RTX+LabWindows/CVI platform is proposed in this paper. Compared with the upper-lower computers simulation platform architecture used in the most of the real-time system now, this system has better maintainability and portability. This system runs on the Windows platform, using Windows RTX real-time extension subsystem to ensure the real-time performance of the system combining with the reflective memory network to complete some real-time tasks such as calculating the simulation model, transmitting the simulation data, and keeping real-time communication. The real-time tasks of simulation system run under the RTSS process. At the same time, we use the LabWindows/CVI to compile a graphical interface, and complete some non-real-time tasks in the process of simulation such as man-machine interaction, display and storage of the simulation data, which run under the Win32 process. Through the design of RTX shared memory and task scheduling algorithm, the data interaction between the real-time tasks process of RTSS and non-real-time tasks process of Win32 is completed. The experimental results show that this system has the strongly real-time performance, highly stability, and highly simulation accuracy. At the same time, it also has the good performance of human-computer interaction.
Technical improvements in 19th century Belgian window glass production
NASA Astrophysics Data System (ADS)
Lauriks, Leen; Collette, Quentin; Wouters, Ine; Belis, Jan
Glass was used since the Roman age in the building envelope, but it became widely applied together with iron since the 19th century. Belgium was a major producer of window glass during the nineteenth century and the majority of the produced window glass was exported all over the world. Investigating the literature on the development of 19th century Belgian window glass production is therefore internationally relevant. In the 17th century, wood was replaced as a fuel by coal. In the 19th century, the regenerative tank furnace applied gas as a fuel in a continuous glass production process. The advantages were a clean production, a more constant and higher temperature in the furnace and a fuel saving. The French chemist Nicolas Leblanc (1787-1793) and later the Belgian chemist Ernest Solvay (1863) invented processes to produce alkali out of common salt. The artificial soda ash improved the quality and aesthetics of the glass plates. During the 19th century, the glass production was industrialized, influencing the operation of furnaces, the improvement of raw materials as well as the applied energy sources. Although the production process was industrialized, glassblowing was still the work of an individual. By improving his work tools, he was able to create larger glass plates. The developments in the annealing process followed this evolution. The industry had to wait until the invention of the drawn glass in the beginning of the 20th century to fully industrialise the window glass manufacture process.
Low-complexity image processing for real-time detection of neonatal clonic seizures.
Ntonfo, Guy Mathurin Kouamou; Ferrari, Gianluigi; Raheli, Riccardo; Pisani, Francesco
2012-05-01
In this paper, we consider a novel low-complexity real-time image-processing-based approach to the detection of neonatal clonic seizures. Our approach is based on the extraction, from a video of a newborn, of an average luminance signal representative of the body movements. Since clonic seizures are characterized by periodic movements of parts of the body (e.g., the limbs), by evaluating the periodicity of the extracted average luminance signal it is possible to detect the presence of a clonic seizure. The periodicity is investigated, through a hybrid autocorrelation-Yin estimation technique, on a per-window basis, where a time window is defined as a sequence of consecutive video frames. While processing is first carried out on a single window basis, we extend our approach to interlaced windows. The performance of the proposed detection algorithm is investigated, in terms of sensitivity and specificity, through receiver operating characteristic curves, considering video recordings of newborns affected by neonatal seizures.
Career Opportunities Through Apprenticeship.
ERIC Educational Resources Information Center
Grau, Glen, Ed.; Kerlan, Julius H., Ed.
The information contained within this booklet describes for high school students the occupation itself, training terms, and desirable qualifications for the sixteen most active apprenticeable trades, namely: electrical wireman, carpenter, plumer, machinist, pipefitter, auto mechanic, lithographer, sheet metal worker, pressman, floor coverer,…
Chicago, Burlington, & Quincy R.R car works aurora, ILL. Photocopy ...
Chicago, Burlington, & Quincy R.R car works aurora, ILL. Photocopy of an undated lithograph based on an ambrotype by D.C. Pratt, C. 1857 - Chicago, Burlington & Quincy Railroad, Roundhouse & Shops, Broadway & Spring Streets, Aurora, Kane County, IL
Applications of two- and three-dimensional microstructures formed by soft lithographic techniques
NASA Astrophysics Data System (ADS)
Jackman, Rebecca Jane
This thesis describes the development of several soft lithographic techniques. Each of these techniques has applications in two- and three-dimensional microfabrication or in the design of microreactor systems. All soft lithographic techniques make use of an elastomeric element that is formed by casting and curing a prepolymer against a planar substrate having three-dimensional (3D) relief. Chapters 1--3 (and Appendices I--VII) describe the use of a soft lithographic technique, microcontact printing (muCP), to produce patterns with micron-scale resolution on both planar and non-planar substrates. Electrodeposition transforms patterns produced by muCP into functional, 3D structures. It is an additive method that: (i) strengthens the metallic patterns; (ii) increases the conductivity of the structures; (iii) enables high-strain deformations to be performed on the structures; and (iv) welds non-connected structures. Applications for cylindrical microstructures, formed by the combination of muCP and electroplating, are presented. Some important classes of materials---biological macromolecules, gels, sol-gels, some polymers, low molecular weight organic and organometallic species---are often incompatible with conventional patterning techniques. Chapters 4 and 5 describe the use of elastomeric membranes as dry resists or as masks in dry lift-off to produce simple features as small as 5 mum from these and other materials on both planar and non-planar surfaces. These procedures are "dry" because the membranes conformed and sealed reversibly to surfaces without the use of solvents. This technique, for example, produced a simple electroluminescent device. By using two membranes simultaneously, multicolored, photoluminescent patterns of organic materials were created. Membranes were also used in sequential, dry-lift off steps to produce patterns with greater complexity. Chapter 6 (and Appendix XII) demonstrates that the ability to mold elastomers enables the fabrication of large (≤45 cm2) arrays of microwells (volumes ≥3 fL/well; densities ≤107 wells/cm2 ). These microwells can function as vessels for performing chemical reactions---"microreactors". Discontinuous dewetting is a technique that takes advantage of the interfacial properties of the elastomer and allows wells to be filled rapidly (typically ˜104 wells/second) and uniformly with a wide range of liquids. Several rudimentary strategies for addressing microwells are investigated including electroosmotic pumping and diffusion of gases.
Creating a Parallel Version of VisIt for Microsoft Windows
DOE Office of Scientific and Technical Information (OSTI.GOV)
Whitlock, B J; Biagas, K S; Rawson, P L
2011-12-07
VisIt is a popular, free interactive parallel visualization and analysis tool for scientific data. Users can quickly generate visualizations from their data, animate them through time, manipulate them, and save the resulting images or movies for presentations. VisIt was designed from the ground up to work on many scales of computers from modest desktops up to massively parallel clusters. VisIt is comprised of a set of cooperating programs. All programs can be run locally or in client/server mode in which some run locally and some run remotely on compute clusters. The VisIt program most able to harness today's computing powermore » is the VisIt compute engine. The compute engine is responsible for reading simulation data from disk, processing it, and sending results or images back to the VisIt viewer program. In a parallel environment, the compute engine runs several processes, coordinating using the Message Passing Interface (MPI) library. Each MPI process reads some subset of the scientific data and filters the data in various ways to create useful visualizations. By using MPI, VisIt has been able to scale well into the thousands of processors on large computers such as dawn and graph at LLNL. The advent of multicore CPU's has made parallelism the 'new' way to achieve increasing performance. With today's computers having at least 2 cores and in many cases up to 8 and beyond, it is more important than ever to deploy parallel software that can use that computing power not only on clusters but also on the desktop. We have created a parallel version of VisIt for Windows that uses Microsoft's MPI implementation (MSMPI) to process data in parallel on the Windows desktop as well as on a Windows HPC cluster running Microsoft Windows Server 2008. Initial desktop parallel support for Windows was deployed in VisIt 2.4.0. Windows HPC cluster support has been completed and will appear in the VisIt 2.5.0 release. We plan to continue supporting parallel VisIt on Windows so our users will be able to take full advantage of their multicore resources.« less
Choy, G.L.; Boatwright, J.
2007-01-01
The rupture process of the Mw 9.1 Sumatra-Andaman earthquake lasted for approximately 500 sec, nearly twice as long as the teleseismic time windows between the P and PP arrival times generally used to compute radiated energy. In order to measure the P waves radiated by the entire earthquake, we analyze records that extend from the P-wave to the S-wave arrival times from stations at distances ?? >60??. These 8- to 10-min windows contain the PP, PPP, and ScP arrivals, along with other multiply reflected phases. To gauge the effect of including these additional phases, we form the spectral ratio of the source spectrum estimated from extended windows (between TP and TS) to the source spectrum estimated from normal windows (between TP and TPP). The extended windows are analyzed as though they contained only the P-pP-sP wave group. We analyze four smaller earthquakes that occurred in the vicinity of the Mw 9.1 mainshock, with similar depths and focal mechanisms. These smaller events range in magnitude from an Mw 6.0 aftershock of 9 January 2005 to the Mw 8.6 Nias earthquake that occurred to the south of the Sumatra-Andaman earthquake on 28 March 2005. We average the spectral ratios for these four events to obtain a frequency-dependent operator for the extended windows. We then correct the source spectrum estimated from the extended records of the 26 December 2004 mainshock to obtain a complete or corrected source spectrum for the entire rupture process (???600 sec) of the great Sumatra-Andaman earthquake. Our estimate of the total seismic energy radiated by this earthquake is 1.4 ?? 1017 J. When we compare the corrected source spectrum for the entire earthquake to the source spectrum from the first ???250 sec of the rupture process (obtained from normal teleseismic windows), we find that the mainshock radiated much more seismic energy in the first half of the rupture process than in the second half, especially over the period range from 3 sec to 40 sec.
Overlay Tolerances For VLSI Using Wafer Steppers
NASA Astrophysics Data System (ADS)
Levinson, Harry J.; Rice, Rory
1988-01-01
In order for VLSI circuits to function properly, the masking layers used in the fabrication of those devices must overlay each other to within the manufacturing tolerance incorporated in the circuit design. The capabilities of the alignment tools used in the masking process determine the overlay tolerances to which circuits can be designed. It is therefore of considerable importance that these capabilities be well characterized. Underestimation of the overlay accuracy results in unnecessarily large devices, resulting in poor utilization of wafer area and possible degradation of device performance. Overestimation will result in significant yield loss because of the failure to conform to the tolerances of the design rules. The proper methodology for determining the overlay capabilities of wafer steppers, the most commonly used alignment tool for the production of VLSI circuits, is the subject of this paper. Because cost-effective manufacturing process technology has been the driving force of VLSI, the impact on productivity is a primary consideration in all discussions. Manufacturers of alignment tools advertise the capabilities of their equipment. It is notable that no manufacturer currently characterizes his aligners in a manner consistent with the requirements of producing very large integrated circuits, as will be discussed. This has resulted in the situation in which the evaluation and comparison of the capabilities of alignment tools require the attention of a lithography specialist. Unfortunately, lithographic capabilities must be known by many other people, particularly the circuit designers and the managers responsible for the financial consequences of the high prices of modern alignment tools. All too frequently, the designer or manager is confronted with contradictory data, one set coming from his lithography specialist, and the other coming from a sales representative of an equipment manufacturer. Since the latter generally attempts to make his merchandise appear as attractive as possible, the lithographer is frequently placed in the position of having to explain subtle issues in order to justify his decisions. It is the purpose of this paper to provide that explanation.
Reduced cost and improved figure of sapphire optical components
NASA Astrophysics Data System (ADS)
Walters, Mark; Bartlett, Kevin; Brophy, Matthew R.; DeGroote Nelson, Jessica; Medicus, Kate
2015-10-01
Sapphire presents many challenges to optical manufacturers due to its high hardness and anisotropic properties. Long lead times and high prices are the typical result of such challenges. The cost of even a simple 'grind and shine' process can be prohibitive. The high precision surfaces required by optical sensor applications further exacerbate the challenge of processing sapphire thereby increasing cost further. Optimax has demonstrated a production process for such windows that delivers over 50% time reduction as compared to traditional manufacturing processes for sapphire, while producing windows with less than 1/5 wave rms figure error. Optimax's sapphire production process achieves significant improvement in cost by implementation of a controlled grinding process to present the best possible surface to the polishing equipment. Following the grinding process is a polishing process taking advantage of chemical interactions between slurry and substrate to deliver excellent removal rates and surface finish. Through experiments, the mechanics of the polishing process were also optimized to produce excellent optical figure. In addition to reducing the cost of producing large sapphire sensor windows, the grinding and polishing technology Optimax has developed aids in producing spherical sapphire components to better figure quality. In addition to reducing the cost of producing large sapphire sensor windows, the grinding and polishing technology Optimax has developed aids in producing spherical sapphire components to better figure quality. Through specially developed polishing slurries, the peak-to-valley figure error of spherical sapphire parts is reduced by over 80%.
Bi-level microelectronic device package with an integral window
Peterson, Kenneth A.; Watson, Robert D.
2004-01-06
A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The multilayered package can be formed of a LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded so that the light-sensitive side is optically accessible through the window. The package has at least two levels of circuits for making electrical interconnections to a pair of microelectronic devices. The result is a compact, low-profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device(s).
State-of-the-art software for window energy-efficiency rating and labeling
DOE Office of Scientific and Technical Information (OSTI.GOV)
Arasteh, D.; Finlayson, E.; Huang, J.
1998-07-01
Measuring the thermal performance of windows in typical residential buildings is an expensive proposition. Not only is laboratory testing expensive, but each window manufacturer typically offers hundreds of individual products, each of which has different thermal performance properties. With over a thousand window manufacturers nationally, a testing-based rating system would be prohibitively expensive to the industry and to consumers. Beginning in the early 1990s, simulation software began to be used as part of a national program for rating window U-values. The rating program has since been expanded to include Solar Hear Gain Coefficients and is now being extended to annualmore » energy performance. This paper describes four software packages available to the public from Lawrence Berkeley National Laboratory (LBNL). These software packages are used to evaluate window thermal performance: RESFEN (for evaluating annual energy costs), WINDOW (for calculating a product`s thermal performance properties), THERM (a preprocessor for WINDOW that determines two-dimensional heat-transfer effects), and Optics (a preprocessor for WINDOW`s glass database). Software not only offers a less expensive means than testing to evaluate window performance, it can also be used during the design process to help manufacturers produce windows that will meet target specifications. In addition, software can show small improvements in window performance that might not be detected in actual testing because of large uncertainties in test procedures.« less
Materials and processing science: Limits for microelectronics
NASA Astrophysics Data System (ADS)
Rosenberg, R.
1988-09-01
The theme of this talk will be to illustrate examples of technologies that will drive materials and processing sciences to the limit and to describe some of the research being pursued to understand materials interactions which are pervasive to projected structure fabrication. It is to be expected that the future will see a progression to nanostructures where scaling laws will be tested and quantum transport will become more in evidence, to low temperature operation for tighter control and improved performance, to complex vertical profiles where 3D stacking and superlattices will produce denser packing and device flexibility, to faster communication links with optoelectronics, and to compatible packaging technologies. New low temperature processing techniques, such as epitaxy of silicon, PECVD of dielectrics, low temperature high pressure oxidation, silicon-germanium heterostructures, etc., must be combined with shallow metallurgies, new lithographic technologies, maskless patterning, rapid thermal processing (RTP) to produce needed profile control, reduce process incompatibilities and develop new device geometries. Materials interactions are of special consequence for chip substrates and illustrations of work in metal-ceramic and metal-polymer adhesion will be offered.
Hentschel, Carsten; Fontein, Florian; Stegemann, Linda; Hoeppener, Christiane; Fuchs, Harald; Hoeppener, Stefanie
2014-01-01
Summary A general concept for parallel near-field photochemical and radiation-induced chemical processes for the fabrication of nanopatterns of a self-assembled monolayer (SAM) of (3-aminopropyl)triethoxysilane (APTES) is explored with three different processes: 1) a near-field photochemical process by photochemical bleaching of a monomolecular layer of dye molecules chemically bound to an APTES SAM, 2) a chemical process induced by oxygen plasma etching as well as 3) a combined near-field UV-photochemical and ozone-induced chemical process, which is applied directly to an APTES SAM. All approaches employ a sandwich configuration of the surface-supported SAM, and a lithographic mask in form of gold nanostructures fabricated through colloidal sphere lithography (CL), which is either exposed to visible light, oxygen plasma or an UV–ozone atmosphere. The gold mask has the function to inhibit the photochemical reactions by highly localized near-field interactions between metal mask and SAM and to inhibit the radiation-induced chemical reactions by casting a highly localized shadow. The removal of the gold mask reveals the SAM nanopattern. PMID:25247126
NASA Astrophysics Data System (ADS)
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
2017-10-01
Compared to conventional joining techniques, electromagnetic pulse welding offers important advantages especially when it comes to dissimilar material connections as e.g. copper aluminum welds. However, due to missing guidelines and tools for process design, the process has not been widely implemented in industrial production, yet. In order to contribute to overcoming this obstacle, a combined numerical and experimental process analysis for electromagnetic pulse welding of Cu-DHP and EN AW-1050 was carried out and the results were consolidated in a quantitative collision parameter based process window.
Low damage dry etch for III-nitride light emitters
NASA Astrophysics Data System (ADS)
Nedy, Joseph G.; Young, Nathan G.; Kelchner, Kathryn M.; Hu, Yanling; Farrell, Robert M.; Nakamura, Shuji; DenBaars, Steven P.; Weisbuch, Claude; Speck, James S.
2015-08-01
We have developed a dry etch process for the fabrication of lithographically defined features close to light emitting layers in the III-nitride material system. The dry etch was tested for its effect on the internal quantum efficiency of c-plane InGaN quantum wells using the photoluminescence of a test structure with two active regions. No change was observed in the internal quantum efficiency of the test active region when the etched surface was greater than 71 nm away. To demonstrate the application of the developed dry etch process, surface-etched air gaps were fabricated 275 nm away from the active region of an m-plane InGaN/GaN laser diode and served as the waveguide upper cladding. Electrically injected lasing was observed without the need for regrowth or recovery anneals. This dry etch opens up a new design tool that can be utilized in the next generation of GaN light emitters.
Parylene C as a Sacrificial Material for Microfabrication
NASA Technical Reports Server (NTRS)
Beamesderfer, Michael
2005-01-01
Parylene C has been investigated for use as a sacrificial material in microfabrication. Although Parylene C cannot be patterned lithographically like photoresists, it nevertheless extends the range of processing options by offering a set of properties that are suitable for microfabrication and are complementary to those of photoresists. The compatibility of Parylene C with several microfabrication processes was demonstrated in experiments in which a thin film of Parylene C was deposited on a silicon wafer, then several thin metal films were deposited and successfully patterned, utilizing the Parylene C pads as a sacrificial layer. The term "parylene" -- a contraction of "poly(para-xylene)" -- denotes a family of vapor-deposited polymers. In Parylene C (the most common form of parylene), a chlorine atom is substituted for one of the hydrogen atoms on the benzene ring of each para-xylene moiety. Heretofore, parylenes have been used as conformal coating materials in diverse applications.
Pellicle transmission uniformity requirements
NASA Astrophysics Data System (ADS)
Brown, Thomas L.; Ito, Kunihiro
1998-12-01
Controlling critical dimensions of devices is a constant battle for the photolithography engineer. Current DUV lithographic process exposure latitude is typically 12 to 15% of the total dose. A third of this exposure latitude budget may be used up by a variable related to masking that has not previously received much attention. The emphasis on pellicle transmission has been focused on increasing the average transmission. Much less, attention has been paid to transmission uniformity. This paper explores the total demand on the photospeed latitude budget, the causes of pellicle transmission nonuniformity and examines reasonable expectations for pellicle performance. Modeling is used to examine how the two primary errors in pellicle manufacturing contribute to nonuniformity in transmission. World-class pellicle transmission uniformity standards are discussed and a comparison made between specifications of other components in the photolithographic process. Specifications for other materials or parameters are used as benchmarks to develop a proposed industry standard for pellicle transmission uniformity.
High performance Ω-gated Ge nanowire MOSFET with quasi-metallic source/drain contacts.
Burchhart, T; Zeiner, C; Hyun, Y J; Lugstein, A; Hochleitner, G; Bertagnolli, E
2010-10-29
Ge nanowires (NWs) about 2 µm long and 35 nm in diameter are grown heteroepitaxially on Si(111) substrates in a hot wall low-pressure chemical vapor deposition (LP-CVD) system using Au as a catalyst and GeH(4) as precursor. Individual NWs are contacted to Cu pads via e-beam lithography, thermal evaporation and lift-off techniques. Self-aligned and atomically sharp quasi-metallic copper-germanide source/drain contacts are achieved by a thermal activated phase formation process. The Cu(3)Ge segments emerge from the Cu contact pads through axial diffusion of Cu which was controlled in situ by SEM, thus the active channel length of the MOSFET is adjusted without any restrictions from a lithographic process. Finally the conductivity of the channel is enhanced by Ga(+) implantation leading to a high performance Ω-gated Ge-NW MOSFET with saturation currents of a few microamperes.
Transition Metal Switchable Mirror
None
2017-12-29
The switchable-mirrors technology was developed by Tom Richardson and Jonathan Slack of Berkeley Lab's Environmental Energy Technologies Division. By using transition metals rather than the rare earth metals used in the first metal-hydride switchable mirrors, Richardson and Slack were able to lower the cost and simplify the manufacturing process. Energy performance is improved as well, because the new windows can reflect or transmit both visible and infrared light. Besides windows for offices and homes, possible applications include automobile sunroofs, signs and displays, aircraft windows, and spacecraft. More information at: http://windows.lbl.gov/materials/chromogenics/default.htm
Advances in low-cost long-wave infrared polymer windows
NASA Astrophysics Data System (ADS)
Weimer, Wayne A.; Klocek, Paul
1999-07-01
Recent improvements in engineered polymeric material compositions and advances in processing methodologies developed and patented at Raytheon Systems Company have produced long wave IR windows at exceptionally low costs. These UV stabilized, high strength windows incorporating subwavelength structured antireflection surfaces are enabling IR imaging systems to penetrate commercial markets and will reduce the cost of systems delivered to the military. The optical and mechanical properties of these windows will be discussed in detail with reference to the short and long-term impact on military IR imaging systems.
Transition Metal Switchable Mirror
DOE Office of Scientific and Technical Information (OSTI.GOV)
None
2009-08-21
The switchable-mirrors technology was developed by Tom Richardson and Jonathan Slack of Berkeley Lab's Environmental Energy Technologies Division. By using transition metals rather than the rare earth metals used in the first metal-hydride switchable mirrors, Richardson and Slack were able to lower the cost and simplify the manufacturing process. Energy performance is improved as well, because the new windows can reflect or transmit both visible and infrared light. Besides windows for offices and homes, possible applications include automobile sunroofs, signs and displays, aircraft windows, and spacecraft. More information at: http://windows.lbl.gov/materials/chromogenics/default.htm
Oxide nanostructures through self-assembly
NASA Astrophysics Data System (ADS)
Aggarwal, S.; Ogale, S. B.; Ganpule, C. S.; Shinde, S. R.; Novikov, V. A.; Monga, A. P.; Burr, M. R.; Ramesh, R.; Ballarotto, V.; Williams, E. D.
2001-03-01
A prominent theme in inorganic materials research is the creation of uniformly flat thin films and heterostructures over large wafers, which can subsequently be lithographically processed into functional devices. This letter proposes an approach that will lead to thin film topographies that are directly counter to the above-mentioned philosophy. Recent years have witnessed considerable research activity in the area of self-assembly of materials, stimulated by observations of self-organized behavior in biological systems. We have fabricated uniform arrays of nonplanar surface features by a spontaneous assembly process involving the oxidation of simple metals, especially under constrained conditions on a variety of substrates, including glass and Si. In this letter we demonstrate the pervasiveness of this process through examples involving the oxidation of Pd, Cu, Fe, and In. The feature sizes can be controlled through the grain size and thickness of the starting metal thin film. Finally, we demonstrate how such submicron scale arrays can serve as templates for the design and development of self-assembled, nanoelectronic devices.
Reliable fabrication of plasmonic nanostructures without an adhesion layer using dry lift-off
NASA Astrophysics Data System (ADS)
Chen, Yiqin; Li, Zhiqin; Xiang, Quan; Wang, Yasi; Zhang, Zhiqiang; Duan, Huigao
2015-10-01
Lift-off is the most commonly used pattern-transfer method to define lithographic plasmonic metal nanostructures. A typical lift-off process is realized by dissolving patterned resists in solutions, which has the limits of low yield when not using adhesion layers and incompatibility with the fabrication of some specific structures and devices. In this work, we report an alternative ‘dry’ lift-off process to obtain metallic nanostructures via mechanical stripping by using the advantage of poor adhesion between resists and noble metal films. We show that this dry stripping lift-off method is effective for both positive- and negative-tone resists to fabricate sparse and densely-packed plasmonic nanostructures, respectively. In particular, this method is achieved without using an adhesion layer, which enables the mitigation of plasmon damping to obtain larger field enhancement. Dark-field scattering, one-photon luminescence and surface-enhanced Raman scattering measurements were performed to demonstrate the improved quality factor of the plasmonic nanostructures fabricated by this dry lift-off process.
Rapid prototyping of microstructures in polydimethylsiloxane (PDMS) by direct UV-lithography.
Scharnweber, Tim; Truckenmüller, Roman; Schneider, Andrea M; Welle, Alexander; Reinhardt, Martina; Giselbrecht, Stefan
2011-04-07
Microstructuring of polydimethylsiloxane (PDMS) is a key step for many lab-on-a-chip (LOC) applications. In general, the structure is generated by casting the liquid prepolymer against a master. The production of the master in turn calls for special equipment and know how. Furthermore, a given master only allows the reproduction of the defined structure. We report on a simple, cheap and practical method to produce microstructures in already cured PDMS by direct UV-lithography followed by chemical development. Due to the available options during the lithographic process like multiple exposures, the method offers a high design flexibility granting easy access to complex and stepped structures. Furthermore, no master is needed and the use of pre-cured PDMS allows processing at ambient (light) conditions. Features down to approximately 5 µm and a depth of 10 µm can be realised. As a proof of principle, we demonstrate the feasibility of the process by applying the structures to various established soft lithography techniques.
Characterization of 193-nm resists for optical mask manufacturing
NASA Astrophysics Data System (ADS)
Fosshaug, Hans; Paulsson, Adisa; Berzinsh, Uldis; Magnusson, Helena
2004-12-01
The push for smaller linewidths and tighter critical dimension (CD) budgets forced manufacturers of optical pattern generators to move from traditional i-line to deep ultraviolet (DUV) resist processing. Entering the DUV area was not without pain. The process conditions, especially exposure times of a few hours, put very tough demands on the resist material itself. However, today 248nm laser writers are fully operating using a resist process that exhibits the requested resolution, CD uniformity and environmental stability. The continuous demands of CD performance made Micronic to investigate suitable resist candidate materials for the next generation optical writer using 193nm excimer laser exposure. This paper reports on resist benchmarking of one commercial as well as several newly developed resists. The resists were investigated using a wafer scanner. The data obtained illustrate the current performance of 193nm photoresists, and further demonstrate that despite good progress in resist formulation optimization, the status is still a bit from the required lithographic performance.
Hohenberger, Erik; Freitag, Nathan; Rosenmann, Daniel; ...
2017-04-19
Here, we present a facile method for fabricating nanostructured silver films containing a high density of nanoscopic gap features through a surface directed phenomenon utilizing nanoporous scaffolds rather than through traditional lithographic patterning processes. This method enables tunability of the silver film growth by simply adjusting the formulation and processing conditions of the nanoporous film prior to metallization. We further demonstrate that this process can produce nanoscopic gaps in thick (100 nm) silver films supporting localized surface plasmon resonance with large field amplification within the gaps while enabling launching of propagating surface plasmons within the silver grains. These enhanced fieldsmore » provide metal enhanced fluorescence with enhancement factors as high as 21 times compared to glass, as well as enable visualization of single fluorophore emission. This work provides a low-cost rapid approach for producing novel nanostructures capable of broadband fluorescence amplification, with potential applications including plasmonic and fluorescence based optical sensing and imaging applications.« less
A novel configurable VLSI architecture design of window-based image processing method
NASA Astrophysics Data System (ADS)
Zhao, Hui; Sang, Hongshi; Shen, Xubang
2018-03-01
Most window-based image processing architecture can only achieve a certain kind of specific algorithms, such as 2D convolution, and therefore lack the flexibility and breadth of application. In addition, improper handling of the image boundary can cause loss of accuracy, or consume more logic resources. For the above problems, this paper proposes a new VLSI architecture of window-based image processing operations, which is configurable and based on consideration of the image boundary. An efficient technique is explored to manage the image borders by overlapping and flushing phases at the end of row and the end of frame, which does not produce new delay and reduce the overhead in real-time applications. Maximize the reuse of the on-chip memory data, in order to reduce the hardware complexity and external bandwidth requirements. To perform different scalar function and reduction function operations in pipeline, this can support a variety of applications of window-based image processing. Compared with the performance of other reported structures, the performance of the new structure has some similarities to some of the structures, but also superior to some other structures. Especially when compared with a systolic array processor CWP, this structure at the same frequency of approximately 12.9% of the speed increases. The proposed parallel VLSI architecture was implemented with SIMC 0.18-μm CMOS technology, and the maximum clock frequency, power consumption, and area are 125Mhz, 57mW, 104.8K Gates, respectively, furthermore the processing time is independent of the different window-based algorithms mapped to the structure
Apparatus for preventing particle deposition from process streams on optical access windows
Logan, Ronald G.; Grimm, Ulrich
1993-01-01
An electrostatic precipitator is disposed inside and around the periphery of the window of a viewing port communicating with a housing through which a particle-laden gas stream is being passed. The precipitator includes a pair of electrodes around the periphery of the window, spaced apart and connected to a unidirectional voltage source. Application of high voltage from the source to the electrodes causes air molecules in the gas stream to become ionized, attaching to solid particles and causing them to be deposited on a collector electrode. This prevents the particles from being deposited on the window and keeps the window clean for viewing and making optical measurements.
Kerfless epitaxial silicon wafers with 7 ms carrier lifetimes and a wide lift-off process window
NASA Astrophysics Data System (ADS)
Gemmel, Catherin; Hensen, Jan; David, Lasse; Kajari-Schröder, Sarah; Brendel, Rolf
2018-04-01
Silicon wafers contribute significantly to the photovoltaic module cost. Kerfless silicon wafers that grow epitaxially on porous silicon (PSI) and are subsequently detached from the growth substrate are a promising lower cost drop-in replacement for standard Czochralski (Cz) wafers. However, a wide technological processing window appears to be a challenge for this process. This holds in particularly for the etching current density of the separation layer that leads to lift-off failures if it is too large or too low. Here we present kerfless PSI wafers of high electronic quality that we fabricate on weakly reorganized porous Si with etch current densities varying in a wide process window from 110 to 150 mA/cm2. We are able to detach all 17 out of 17 epitaxial wafers. All wafers exhibit charge carrier lifetimes in the range of 1.9 to 4.3 ms at an injection level of 1015 cm-3 without additional high-temperature treatment. We find even higher lifetimes in the range of 4.6 to 7.0 ms after applying phosphorous gettering. These results indicate that a weak reorganization of the porous layer can be beneficial for a large lift-off process window while still allowing for high carrier lifetimes.
Apparatus and method for the electrolysis of water
Greenbaum, Elias
2015-04-21
An apparatus for the electrolytic splitting of water into hydrogen and/or oxygen, the apparatus comprising: (i) at least one lithographically-patternable substrate having a surface; (ii) a plurality of microscaled catalytic electrodes embedded in said surface; (iii) at least one counter electrode in proximity to but not on said surface; (iv) means for collecting evolved hydrogen and/or oxygen gas; (v) electrical powering means for applying a voltage across said plurality of microscaled catalytic electrodes and said at least one counter electrode; and (vi) a container for holding an aqueous electrolyte and housing said plurality of microscaled catalytic electrodes and said at least one counter electrode. Electrolytic processes using the above electrolytic apparatus or functional mimics thereof are also described.
Future of the particle replication in nonwetting templates (PRINT) technology.
Xu, Jing; Wong, Dominica H C; Byrne, James D; Chen, Kai; Bowerman, Charles; DeSimone, Joseph M
2013-06-24
Particle replication in nonwetting templates (PRINT) is a continuous, roll-to-roll, high-resolution molding technology which allows the design and synthesis of precisely defined micro- and nanoparticles. This technology adapts the lithographic techniques from the microelectronics industry and marries these with the roll-to-roll processes from the photographic film industry to enable researchers to have unprecedented control over particle size, shape, chemical composition, cargo, modulus, and surface properties. In addition, PRINT is a GMP-compliant (GMP=good manufacturing practice) platform amenable for particle fabrication on a large scale. Herein, we describe some of our most recent work involving the PRINT technology for application in the biomedical and material sciences. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Method for extreme ultraviolet lithography
Felter, T. E.; Kubiak, Glenn D.
1999-01-01
A method of producing a patterned array of features, in particular, gate apertures, in the size range 0.4-0.05 .mu.m using projection lithography and extreme ultraviolet (EUV) radiation. A high energy laser beam is used to vaporize a target material in order to produce a plasma which in turn, produces extreme ultraviolet radiation of a characteristic wavelength of about 13 nm for lithographic applications. The radiation is transmitted by a series of reflective mirrors to a mask which bears the pattern to be printed. The demagnified focused mask pattern is, in turn, transmitted by means of appropriate optics and in a single exposure, to a substrate coated with photoresists designed to be transparent to EUV radiation and also satisfy conventional processing methods.
Method for extreme ultraviolet lithography
Felter, T. E.; Kubiak, G. D.
2000-01-01
A method of producing a patterned array of features, in particular, gate apertures, in the size range 0.4-0.05 .mu.m using projection lithography and extreme ultraviolet (EUV) radiation. A high energy laser beam is used to vaporize a target material in order to produce a plasma which in turn, produces extreme ultraviolet radiation of a characteristic wavelength of about 13 nm for lithographic applications. The radiation is transmitted by a series of reflective mirrors to a mask which bears the pattern to be printed. The demagnified focused mask pattern is, in turn, transmitted by means of appropriate optics and in a single exposure, to a substrate coated with photoresists designed to be transparent to EUV radiation and also satisfy conventional processing methods.
X-ray mask and method for providing same
Morales, Alfredo M [Pleasanton, CA; Skala, Dawn M [Fremont, CA
2004-09-28
The present invention describes a method for fabricating an x-ray mask tool which can achieve pattern features having lateral dimension of less than 1 micron. The process uses a thin photoresist and a standard lithographic mask to transfer an trace image pattern in the surface of a silicon wafer by exposing and developing the resist. The exposed portion of the silicon substrate is then anisotropically etched to provide an etched image of the trace image pattern consisting of a series of channels in the silicon having a high depth-to-width aspect ratio. These channels are then filled by depositing a metal such as gold to provide an inverse image of the trace image and thereby providing a robust x-ray mask tool.
X-ray mask and method for providing same
Morales, Alfredo M.; Skala, Dawn M.
2002-01-01
The present invention describes a method for fabricating an x-ray mask tool which can achieve pattern features having lateral dimension of less than 1 micron. The process uses a thin photoresist and a standard lithographic mask to transfer an trace image pattern in the surface of a silicon wafer by exposing and developing the resist. The exposed portion of the silicon substrate is then anisotropically etched to provide an etched image of the trace image pattern consisting of a series of channels in the silicon having a high depth-to-width aspect ratio. These channels are then filled by depositing a metal such as gold to provide an inverse image of the trace image and thereby providing a robust x-ray mask tool.
Laser direct writing of thin-film copper structures as a modification of lithographic processes
NASA Astrophysics Data System (ADS)
Meyer, F.; Ostendorf, A.; Stute, U.
2007-04-01
This paper presents a flexible, mask-free and efficient technique for UV-laser micropatterning of photosensitive resist by laser direct writing (LDW). Photo resist spun on gold sputtered silicon wafers has been laser structured by a scanner guided 266nm DPSSL and electroplated. Ablation behaviour and optimum seed layer preparation in relation to parameters like pulse energy, scanning speed and number of scanned cycles and the electroplating results are discussed. The resulting adhesive strength was measured by a µ-sear device and the gold seed layer-plated copper interface investigated by SEM and EDX to explain correlation to identified bonding behaviour. Improved adhesive strength was observed with higher laser pulse energy and reduced number of cycle.
Research development of thermal aberration in 193nm lithography exposure system
NASA Astrophysics Data System (ADS)
Wang, Yueqiang; Liu, Yong
2014-08-01
Lithographic exposure is the key process in the manufacture of the integrated circuit, and the performance of exposure system decides the level of microelectronic manufacture technology. Nowadays, the 193nm ArF immersion exposure tool is widely used by the IC manufacturer. With the uniformity of critical dimension (CDU) and overlay become tighter and the requirement for throughput become higher, the thermal aberration caused by lens material and structure absorbing the laser energy cannot be neglected. In this paper, we introduce the efforts and methods that researcher on thermal aberration and its control. Further, these methods were compared to show their own pros and cons. Finally we investigated the challenges of thermal aberration control for state of the art technologies.
Morales, Alfredo M.; Gonzales, Marcela
2004-06-15
The present invention describes a method for fabricating an embossing tool or an x-ray mask tool, providing microstructures that smoothly vary in height from point-to-point in etched substrates, i.e., structure which can vary in all three dimensions. The process uses a lithographic technique to transfer an image pattern in the surface of a silicon wafer by exposing and developing the resist and then etching the silicon substrate. Importantly, the photoresist is variably exposed so that when developed some of the resist layer remains. The remaining undeveloped resist acts as an etchant barrier to the reactive plasma used to etch the silicon substrate and therefore provides the ability etch structures of variable depths.
X-ray mask and method for making
Morales, Alfredo M.
2004-10-26
The present invention describes a method for fabricating an x-ray mask tool which is a contact lithographic mask which can provide an x-ray exposure dose which is adjustable from point-to-point. The tool is useful in the preparation of LIGA plating molds made from PMMA, or similar materials. In particular the tool is useful for providing an ability to apply a graded, or "stepped" x-ray exposure dose across a photosensitive substrate. By controlling the x-ray radiation dose from point-to-point, it is possible to control the development process for removing exposed portions of the substrate; adjusting it such that each of these portions develops at a more or less uniformly rate regardless of feature size or feature density distribution.
[Real-time detection and processing of medical signals under windows using Lcard analog interfaces].
Kuz'min, A A; Belozerov, A E; Pronin, T V
2008-01-01
Multipurpose modular software for an analog interface based on Lcard 761 is considered. Algorithms for pipeline processing of medical signals under Windows with dynamic control of computational resources are suggested. The software consists of user-friendly completable modifiable modules. The module hierarchy is based on object-oriented heritage principles, which make it possible to construct various real-time systems for long-term detection, processing, and imaging of multichannel medical signals.
Heidlmayr, Karin; Hemforth, Barbara; Moutier, Sylvain; Isel, Frédéric
2015-01-01
The present study was designed to examine the impact of bilingualism on the neuronal activity in different executive control processes namely conflict monitoring, control implementation (i.e., interference suppression and conflict resolution) and overcoming of inhibition. Twenty-two highly proficient but non-balanced successive French-German bilingual adults and 22 monolingual adults performed a combined Stroop/Negative priming task while event-related potential (ERP) were recorded online. The data revealed that the ERP effects were reduced in bilinguals in comparison to monolinguals but only in the Stroop task and limited to the N400 and the sustained fronto-central negative-going potential time windows. This result suggests that bilingualism may impact the process of control implementation rather than the process of conflict monitoring (N200). Critically, our study revealed a differential time course of the involvement of the anterior cingulate cortex (ACC) and the prefrontal cortex (PFC) in conflict processing. While the ACC showed major activation in the early time windows (N200 and N400) but not in the latest time window (late sustained negative-going potential), the PFC became unilaterally active in the left hemisphere in the N400 and the late sustained negative-going potential time windows. Taken together, the present electroencephalography data lend support to a cascading neurophysiological model of executive control processes, in which ACC and PFC may play a determining role.
Heidlmayr, Karin; Hemforth, Barbara; Moutier, Sylvain; Isel, Frédéric
2015-01-01
The present study was designed to examine the impact of bilingualism on the neuronal activity in different executive control processes namely conflict monitoring, control implementation (i.e., interference suppression and conflict resolution) and overcoming of inhibition. Twenty-two highly proficient but non-balanced successive French–German bilingual adults and 22 monolingual adults performed a combined Stroop/Negative priming task while event-related potential (ERP) were recorded online. The data revealed that the ERP effects were reduced in bilinguals in comparison to monolinguals but only in the Stroop task and limited to the N400 and the sustained fronto-central negative-going potential time windows. This result suggests that bilingualism may impact the process of control implementation rather than the process of conflict monitoring (N200). Critically, our study revealed a differential time course of the involvement of the anterior cingulate cortex (ACC) and the prefrontal cortex (PFC) in conflict processing. While the ACC showed major activation in the early time windows (N200 and N400) but not in the latest time window (late sustained negative-going potential), the PFC became unilaterally active in the left hemisphere in the N400 and the late sustained negative-going potential time windows. Taken together, the present electroencephalography data lend support to a cascading neurophysiological model of executive control processes, in which ACC and PFC may play a determining role. PMID:26124740
Fabrication of MgF2 and LiF windows for the Hubble Space Telescope Imaging Spectrograph
NASA Technical Reports Server (NTRS)
Gormley, Daphne; Bottema, Murk; Darnell, Barbara; Fowler, Walter; Medenica, Walter
1988-01-01
Two prototype test windows (MgF2 and LiF) to be used on the 75-mm UV MAMA detector tubes for the Hubble Space Telescope Imaging Spectrograph are described. The spatial and optical constraints of this instrument dictate that the thickness of the window materials be no greater than 2-3 mm to achieve a minimum 50-percent transmission at hydrogen Lyman alpha (121.6 nm), and that the window must be domed to minimize optical aberrations and provide structural strength. The detector window has an input diameter of about 100 mm with a radius-of-curvature of 70 mm. The manufacturing processes involved in the fabrication of these windows is discussed, as well as test programs (optical and structural) to be performed at Goddard Space Flight Center.
Windowing technique in FM radar realized by FPGA for better target resolution
NASA Astrophysics Data System (ADS)
Ponomaryov, Volodymyr I.; Escamilla-Hernandez, Enrique; Kravchenko, Victor F.
2006-09-01
Remote sensing systems, such as SAR usually apply FM signals to resolve nearly placed targets (objects) and improve SNR. Main drawbacks in the pulse compression of FM radar signal that it can add the range side-lobes in reflectivity measurements. Using weighting window processing in time domain it is possible to decrease significantly the side-lobe level (SLL) of output radar signal that permits to resolve small or low power targets those are masked by powerful ones. There are usually used classical windows such as Hamming, Hanning, Blackman-Harris, Kaiser-Bessel, Dolph-Chebyshev, Gauss, etc. in window processing. Additionally to classical ones in here we also use a novel class of windows based on atomic functions (AF) theory. For comparison of simulation and experimental results we applied the standard parameters, such as coefficient of amplification, maximum level of side-lobe, width of main lobe, etc. In this paper we also proposed to implement the compression-windowing model on a hardware level employing Field Programmable Gate Array (FPGA) that offers some benefits like instantaneous implementation, dynamic reconfiguration, design, and field programmability. It has been investigated the pulse compression design on FPGA applying classical and novel window technique to reduce the SLL in absence and presence of noise. The paper presents simulated and experimental examples of detection of small or nearly placed targets in the imaging radar. Paper also presents the experimental hardware results of windowing in FM radar demonstrating resolution of the several targets for classical rectangular, Hamming, Kaiser-Bessel, and some novel ones: Up(x), fup 4(x)•D 3(x), fup 6(x)•G 3(x), etc. It is possible to conclude that windows created on base of the AFs offer better decreasing of the SLL in cases of presence or absence of noise and when we move away of the main lobe in comparison with classical windows.
Oscillatory integration windows in neurons
Gupta, Nitin; Singh, Swikriti Saran; Stopfer, Mark
2016-01-01
Oscillatory synchrony among neurons occurs in many species and brain areas, and has been proposed to help neural circuits process information. One hypothesis states that oscillatory input creates cyclic integration windows: specific times in each oscillatory cycle when postsynaptic neurons become especially responsive to inputs. With paired local field potential (LFP) and intracellular recordings and controlled stimulus manipulations we directly test this idea in the locust olfactory system. We find that inputs arriving in Kenyon cells (KCs) sum most effectively in a preferred window of the oscillation cycle. With a computational model, we show that the non-uniform structure of noise in the membrane potential helps mediate this process. Further experiments performed in vivo demonstrate that integration windows can form in the absence of inhibition and at a broad range of oscillation frequencies. Our results reveal how a fundamental coincidence-detection mechanism in a neural circuit functions to decode temporally organized spiking. PMID:27976720
Microelectronic device package with an integral window
Peterson, Kenneth A.; Watson, Robert D.
2002-01-01
An apparatus for packaging of microelectronic devices, including an integral window. The microelectronic device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can include a cofired ceramic frame or body. The package can have an internal stepped structure made of one or more plates, with apertures, which are patterned with metallized conductive circuit traces. The microelectronic device can be flip-chip bonded on the plate to these traces, and oriented so that the light-sensitive side is optically accessible through the window. A cover lid can be attached to the opposite side of the package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed. The package body can be formed by low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. Multiple chips can be located within a single package. The cover lid can include a window. The apparatus is particularly suited for packaging of MEMS devices, since the number of handling steps is greatly reduced, thereby reducing the potential for contamination.
Direct write fabrication of waveguides and interconnects for optical printed wiring boards
NASA Astrophysics Data System (ADS)
Dingeldein, Joseph C.
Current copper based circuit technology is becoming a limiting factor in high speed data transfer applications as processors are improving at a faster rate than are developments to increase on board data transfer. One solution is to utilize optical waveguide technology to overcome these bandwidth and loss restrictions. The use of this technology virtually eliminates the heat and cross-talk loss seen in copper circuitry, while also operating at a higher bandwidth. Transitioning current fabrication techniques from small scale laboratory environments to large scale manufacturing presents significant challenges. Optical-to-electrical connections and out-of-plane coupling are significant hurdles in the advancement of optical interconnects. The main goals of this research are the development of direct write material deposition and patterning tools for the fabrication of waveguide systems on large substrates, and the development of out-of-plane coupler components compatible with standard fiber optic cabling. Combining these elements with standard printed circuit boards allows for the fabrication of fully functional optical-electrical-printed-wiring-boards (OEPWBs). A direct dispense tool was designed, assembled, and characterized for the repeatable dispensing of blanket waveguide layers over a range of thicknesses (25-225 μm), eliminating waste material and affording the ability to utilize large substrates. This tool was used to directly dispense multimode waveguide cores which required no UV definition or development. These cores had circular cross sections and were comparable in optical performance to lithographically fabricated square waveguides. Laser direct writing is a non-contact process that allows for the dynamic UV patterning of waveguide material on large substrates, eliminating the need for high resolution masks. A laser direct write tool was designed, assembled, and characterized for direct write patterning waveguides that were comparable in quality to those produced using standard lithographic practices (0.047 dB/cm loss for laser written waveguides compared to 0.043 dB/cm for lithographic waveguides). Straight waveguides, and waveguide turns were patterned at multimode and single mode sizes, and the process was characterized and documented. Support structures such as angled reflectors and vertical posts were produced, showing the versatility of the laser direct write tool. Commercially available components were implanted into the optical layer for out-of-plane routing of the optical signals. These devices featured spherical lenses on the input and output sides of a total internal reflection (TIR) mirror, as well as alignment pins compatible with standard MT design. Fully functional OEPWBs were fabricated featuring input and output out-of-plane optical signal routing with total optical losses not exceeding 10 dB. These prototypes survived thermal cycling (-40°C to 85°C) and humidity exposure (95±4% humidity), showing minimal degradation in optical performance. Operational failure occurred after environmental aging life testing at 110°C for 216 hours.
Size-uniform 200 nm particles: fabrication and application to magnetofection.
Mair, Lamar; Ford, Kris; Alam, M d Rowshon; Kole, Ryszard; Fisher, Michael; Superfine, Richard
2009-04-01
We report on the fabrication of arrays of mono- and multimetallic particles via metal evaporation onto lithographically patterned posts, as well as the magnetic force calibration and successful magnetofection of iron particles grown via this method. This work represents the first instance in which metal evaporation onto post structures was used for the formation of released, shape-defined metal particles. Also, our work represents the first use of lithographically defined particles as agents of magnetofection. Using these techniques it is possible to create particles with complex shapes and lateral dimensions as small as 40 nm. Our demonstrated compositionally flexible particles are highly size-uniform due to their photolithographically defined growth substrates, with particle dimensions along two axes fixed at 200 nm; the third axis dimension can be varied from 20 nm to 300 nm during the deposition procedure. Atomic percent of metals incorporated into the particle volume is highly tunable and particles have been synthesized with as many as four different metals. We performed magnetic force calibrations on a single particle size for iron particles using an axially magnetized NeFeB permanent magnet and comparisons are made with commercially available magnetic beads. In order to evalutate their usefulness as magnetofection agents, an antisense oligonucleotide (ODN) designed to correct the aberrant splicing of enhanced green fluorescent protein mRNA, was successfully transfected into a modified HeLa cell line. Magnetically enhanced gene delivery was accomplished in vitro using antisense ODN-laden iron particles followed by application of a field gradient. Magnetically enhanced transfection resulted in a 76% and 139% increase in fluorescence intensity when compared to Lipofectamine and antisense ODN-loaded particles delivered without magnetic treatment, respectively. To our knowledge, these experiments constitute the first use of lithographically defined particles as successful agents for magnetically enhanced transfection of an antisense oligonucleotide.
Biomedical microfluidic devices by using low-cost fabrication techniques: A review.
Faustino, Vera; Catarino, Susana O; Lima, Rui; Minas, Graça
2016-07-26
One of the most popular methods to fabricate biomedical microfluidic devices is by using a soft-lithography technique. However, the fabrication of the moulds to produce microfluidic devices, such as SU-8 moulds, usually requires a cleanroom environment that can be quite costly. Therefore, many efforts have been made to develop low-cost alternatives for the fabrication of microstructures, avoiding the use of cleanroom facilities. Recently, low-cost techniques without cleanroom facilities that feature aspect ratios more than 20, for fabricating those SU-8 moulds have been gaining popularity among biomedical research community. In those techniques, Ultraviolet (UV) exposure equipment, commonly used in the Printed Circuit Board (PCB) industry, replaces the more expensive and less available Mask Aligner that has been used in the last 15 years for SU-8 patterning. Alternatively, non-lithographic low-cost techniques, due to their ability for large-scale production, have increased the interest of the industrial and research community to develop simple, rapid and low-cost microfluidic structures. These alternative techniques include Print and Peel methods (PAP), laserjet, solid ink, cutting plotters or micromilling, that use equipment available in almost all laboratories and offices. An example is the xurography technique that uses a cutting plotter machine and adhesive vinyl films to generate the master moulds to fabricate microfluidic channels. In this review, we present a selection of the most recent lithographic and non-lithographic low-cost techniques to fabricate microfluidic structures, focused on the features and limitations of each technique. Only microfabrication methods that do not require the use of cleanrooms are considered. Additionally, potential applications of these microfluidic devices in biomedical engineering are presented with some illustrative examples. Copyright © 2015 Elsevier Ltd. All rights reserved.
Closeup view of the upper exterior of the forward fuselage ...
Close-up view of the upper exterior of the forward fuselage of the Orbiter Discovery in the Orbiter Processing Facility at NASA's Kennedy Space Center. The view show a detail of the flight deck windows with protective covers installed to protect the window surfaces during processing. - Space Transportation System, Orbiter Discovery (OV-103), Lyndon B. Johnson Space Center, 2101 NASA Parkway, Houston, Harris County, TX
A large, switchable optical clearing skull window for cerebrovascular imaging
Zhang, Chao; Feng, Wei; Zhao, Yanjie; Yu, Tingting; Li, Pengcheng; Xu, Tonghui; Luo, Qingming; Zhu, Dan
2018-01-01
Rationale: Intravital optical imaging is a significant method for investigating cerebrovascular structure and function. However, its imaging contrast and depth are limited by the turbid skull. Tissue optical clearing has a great potential for solving this problem. Our goal was to develop a transparent skull window, without performing a craniotomy, for use in assessing cerebrovascular structure and function. Methods: Skull optical clearing agents were topically applied to the skulls of mice to create a transparent window within 15 min. The clearing efficacy, repeatability, and safety of the skull window were then investigated. Results: Imaging through the optical clearing skull window enhanced both the contrast and the depth of intravital imaging. The skull window could be used on 2-8-month-old mice and could be expanded from regional to bi-hemispheric. In addition, the window could be repeatedly established without inducing observable inflammation and metabolic toxicity. Conclusion: We successfully developed an easy-to-handle, large, switchable, and safe optical clearing skull window. Combined with various optical imaging techniques, cerebrovascular structure and function can be observed through this optical clearing skull window. Thus, it has the potential for use in basic research on the physiopathologic processes of cortical vessels. PMID:29774069
Three-dimensional laser window formation for industrial application
NASA Technical Reports Server (NTRS)
Verhoff, Vincent G.; Kowalski, David
1993-01-01
The NASA Lewis Research Center has developed and implemented a unique process for forming flawless three-dimensional, compound-curvature laser windows to extreme accuracies. These windows represent an integral component of specialized nonintrusive laser data acquisition systems that are used in a variety of compressor and turbine research testing facilities. These windows are molded to the flow surface profile of turbine and compressor casings and are required to withstand extremely high pressures and temperatures. This method of glass formation could also be used to form compound-curvature mirrors that would require little polishing and for a variety of industrial applications, including research view ports for testing devices and view ports for factory machines with compound-curvature casings. Currently, sodium-alumino-silicate glass is recommended for three-dimensional laser windows because of its high strength due to chemical strengthening and its optical clarity. This paper discusses the main aspects of three-dimensional laser window formation. It focuses on the unique methodology and the peculiarities that are associated with the formation of these windows.
Resource Sharing in a Network of Personal Computers.
1982-12-01
magnetic card, or a more secure identifier such as a machine-read fingerprint or voiceprint. Security and Protection 57 (3) (R, key) (5) (RB’ B, key) (B...operations are invoked via messages, a program and its terminal can easily be located on separate machines. In Spice, an interface process called Canvas ...request of a process. In Canvas , a process can only subdivide windows that it already has. On the other hand, the window manager treats the screen as a
[Applied anatomy of scala tympani inlet related to cochlear implantation].
Zou, Tuanming; Guo, Menghe; Zhang, Hongzheng; Shu, Fan; Xie, Nanping
2012-06-01
To investigate the related parameters of the temporal bone structure for determining the position of implanting electrode into the scala tympani in cochlear implantation surgery through the facial recess and epitympanum approach. In a surgical simulation experiment, 20 human temporal bones were studied and measured to determine the related parameters of the temporal bone structure. The distance 5.91∓0.29 mm between the short process of the incus and the round window niche, 2.11∓0.18 mm between the stapes and the round window niche, 6.70∓0.19 mm between the facial nerve in the perpendicular paragraph and the round window niche, 2.22∓0.21 mm from the pyramidal eminence to the round window, and 2.16∓0.14 mm between the stapes and the round window. The minimal distance between the implanting electrode and the vestibular window was 2.12∓0.19 mm. The distance between the cochleariform process and the round window niche was 3.79∓0.17 mm. The position of the cochlear electrode array insertion into the second cochlear turn was 2.25∓0.13 mm under the stapes. The location of the cochlear electrode array insertion into the second cochlear turn was 2.28∓0.20 mm inferior to the pyramidal eminence. These parameters provide a reference value to determine the different positions of cochlear electrode array insertion into the scale tympani in different patients.
Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor
Britten, Jerald A.
1997-01-01
A surface tension gradient driven flow (a Marangoni flow) is used to remove the thin film of water remaining on the surface of an object following rinsing. The process passively introduces by natural evaporation and diffusion of minute amounts of alcohol (or other suitable material) vapor in the immediate vicinity of a continuously refreshed meniscus of deionized water or another aqueous-based, nonsurfactant rinsing agent. Used in conjunction with cleaning, developing or wet etching application, rinsing coupled with Marangoni drying provides a single-step process for 1) cleaning, developing or etching, 2) rinsing, and 3) drying objects such as flat substrates or coatings on flat substrates without necessarily using heat, forced air flow, contact wiping, centrifugation or large amounts of flammable solvents. This process is useful in one-step cleaning and drying of large flat optical substrates, one-step developing/rinsing and drying or etching/rinsing/drying of large flat patterned substrates and flat panel displays during lithographic processing, and room-temperature rinsing/drying of other large parts, sheets or continuous rolls of material.
Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor
Britten, J.A.
1997-08-26
A surface tension gradient driven flow (a Marangoni flow) is used to remove the thin film of water remaining on the surface of an object following rinsing. The process passively introduces by natural evaporation and diffusion of minute amounts of alcohol (or other suitable material) vapor in the immediate vicinity of a continuously refreshed meniscus of deionized water or another aqueous-based, nonsurfactant rinsing agent. Used in conjunction with cleaning, developing or wet etching application, rinsing coupled with Marangoni drying provides a single-step process for (1) cleaning, developing or etching, (2) rinsing, and (3) drying objects such as flat substrates or coatings on flat substrates without necessarily using heat, forced air flow, contact wiping, centrifugation or large amounts of flammable solvents. This process is useful in one-step cleaning and drying of large flat optical substrates, one-step developing/rinsing and drying or etching/rinsing/drying of large flat patterned substrates and flat panel displays during lithographic processing, and room-temperature rinsing/drying of other large parts, sheets or continuous rolls of material. 5 figs.
40 CFR 59.1 - Final determinations under Section 183(e)(3)(C) of the CAA.
Code of Federal Regulations, 2010 CFR
2010-07-01
... furniture coatings; (b) Aerospace coatings; (c) Shipbuilding and repair coatings; (d) Lithographic printing materials; (e) Letterpress printing materials; (f) Flexible packaging printing materials; (g) Flat wood... materials; and (p) Miscellaneous industrial adhesives. [73 FR 58491, Oct. 7, 2008] ...
Printing/Graphic Arts Technology Program Guide.
ERIC Educational Resources Information Center
Georgia Univ., Athens. Dept. of Vocational Education.
This guide presents the standard curriculum for technical institutes in Georgia. The curriculum addresses the minimum competencies for a printing/graphics technology program. It includes specializations in art and copy preparation, prepress/image assembly, and lithographic press operations. The guide contains four major sections. The General…
Photocopy of photograph (original located at Mare Island Archives). Original ...
Photocopy of photograph (original located at Mare Island Archives). Original photographer unknown. Lithograph of Mare Island, "showing the works already completed in the Navy Yard and the US. Frigate "Independence"; 1855. - Mare Island Naval Shipyard, East of Nave Drive, Vallejo, Solano County, CA
Benchtop Nanoscale Patterning Using Soft Lithography
ERIC Educational Resources Information Center
Meenakshi, Viswanathan; Babayan, Yelizaveta; Odom, Teri W.
2007-01-01
This paper outlines several benchtop nanoscale patterning experiments that can be incorporated into undergraduate laboratories or advanced high school chemistry curricula. The experiments, supplemented by an online video lab manual, are based on soft lithographic techniques such as replica molding, micro-molding in capillaries, and micro-contact…
A lithographically patterned capacitor with horizontal nanowires of length 2.5 mm.
Yan, Wenbo; Thai, Mya Le; Dutta, Rajen; Li, Xiaowei; Xing, Wendong; Penner, Reginald M
2014-04-09
A symmetrical hybrid capacitor consisting of interdigitated, horizontal nanowires is described. Each of the 750 nanowires within the capacitor is 2.5 mm in length, consisting of a gold nanowire core (40 × ≈200 nm) encapsulated within a hemicylindrical shell of δ-phase MnO2 (thickness = 60-220 nm). These Au@δ-MnO2 nanowires are patterned onto a planar glass surface using lithographically patterned nanowire electrodeposition (LPNE). A power density of 165 kW/kg and energy density of 24 Wh/kg were obtained for a typical nanowire array in which the MnO2 shell thickness was 68 ± 8 nm. Capacitors incorporating these ultralong nanowires lost ≈10% of their capacity rapidly, during the first 20 discharge cycles, and then retained 90% of their maximum capacity for the ensuing 6000 cycles. The ability of capacitors consisting of ultralong Au@δ-MnO2 nanowires to simultaneously deliver high power and high capacity with acceptable cycle life is demonstrated.
NASA Technical Reports Server (NTRS)
Casasent, D.
1978-01-01
The article discusses several optical configurations used for signal processing. Electronic-to-optical transducers are outlined, noting fixed window transducers and moving window acousto-optic transducers. Folded spectrum techniques are considered, with reference to wideband RF signal analysis, fetal electroencephalogram analysis, engine vibration analysis, signal buried in noise, and spatial filtering. Various methods for radar signal processing are described, such as phased-array antennas, the optical processing of phased-array data, pulsed Doppler and FM radar systems, a multichannel one-dimensional optical correlator, correlations with long coded waveforms, and Doppler signal processing. Means for noncoherent optical signal processing are noted, including an optical correlator for speech recognition and a noncoherent optical correlator.
NASA Astrophysics Data System (ADS)
Zhao, Jin Shi; Lee, Hyun Ju; Sim, Joon Seop; Lee, Keun; Hwang, Cheol Seong
2006-04-01
Ferroelectric reliability of Pb(Zr0.15Ti0.85)O3 films grown by metal-organic chemical vapor deposition at 570°C on an Ir electrode in the self-regulation process window [constant Pb concentration irrespective of the precursor input ratio (Pb /(Zr+Ti), PIR)] was studied. Although the Pb composition and crystallinity of the films grown under different PIR were almost identical, the film grown under a PIR which was near the center of the process window showed the best ferroelectric performance. X-ray photoelectron spectroscopy showed that the films grown at lower and higher PIR have residual ZrO2 and metallic Pb, respectively, which resulted in reduced remanent polarization and reliability.
NASA Astrophysics Data System (ADS)
Chen, Daniel; Chen, Damian; Yen, Ray; Cheng, Mingjen; Lan, Andy; Ghaskadvi, Rajesh
2008-11-01
Identifying hotspots--structures that limit the lithography process window--become increasingly important as the industry relies heavily on RET to print sub-wavelength designs. KLA-Tencor's patented Process Window Qualification (PWQ) methodology has been used for this purpose in various fabs. PWQ methodology has three key advantages (a) PWQ Layout--to obtain the best sensitivity (b) Design Based Binning--for pattern repeater analysis (c) Intelligent sampling--for the best DOI sampling rate. This paper evaluates two different analysis strategies for SEM review sampling successfully deployed at Inotera Memories, Inc. We propose a new approach combining the location repeater and pattern repeaters. Based on a recent case study the new sampling flow reduces the data analysis and sampling time from 6 hours to 1.5 hour maintaining maximum DOI sample rate.
10 CFR 452.5 - Bidding procedures.
Code of Federal Regulations, 2012 CFR
2012-01-01
... OF ENERGY ENERGY CONSERVATION PRODUCTION INCENTIVES FOR CELLULOSIC BIOFUELS § 452.5 Bidding... producer auction process open only to pre-auction eligible cellulosic biofuels producers. The following... cellulosic biofuels producers during the open window established in the solicitation. The open window shall...
10 CFR 452.5 - Bidding procedures.
Code of Federal Regulations, 2014 CFR
2014-01-01
... OF ENERGY ENERGY CONSERVATION PRODUCTION INCENTIVES FOR CELLULOSIC BIOFUELS § 452.5 Bidding... producer auction process open only to pre-auction eligible cellulosic biofuels producers. The following... cellulosic biofuels producers during the open window established in the solicitation. The open window shall...
10 CFR 452.5 - Bidding procedures.
Code of Federal Regulations, 2013 CFR
2013-01-01
... OF ENERGY ENERGY CONSERVATION PRODUCTION INCENTIVES FOR CELLULOSIC BIOFUELS § 452.5 Bidding... producer auction process open only to pre-auction eligible cellulosic biofuels producers. The following... cellulosic biofuels producers during the open window established in the solicitation. The open window shall...
10 CFR 452.5 - Bidding procedures.
Code of Federal Regulations, 2011 CFR
2011-01-01
... OF ENERGY ENERGY CONSERVATION PRODUCTION INCENTIVES FOR CELLULOSIC BIOFUELS § 452.5 Bidding... producer auction process open only to pre-auction eligible cellulosic biofuels producers. The following... cellulosic biofuels producers during the open window established in the solicitation. The open window shall...
A random generation approach to pattern library creation for full chip lithographic simulation
NASA Astrophysics Data System (ADS)
Zou, Elain; Hong, Sid; Liu, Limei; Huang, Lucas; Yang, Legender; Kabeel, Aliaa; Madkour, Kareem; ElManhawy, Wael; Kwan, Joe; Du, Chunshan; Hu, Xinyi; Wan, Qijian; Zhang, Recoo
2017-04-01
As technology advances, the need for running lithographic (litho) checking for early detection of hotspots before tapeout has become essential. This process is important at all levels—from designing standard cells and small blocks to large intellectual property (IP) and full chip layouts. Litho simulation provides high accuracy for detecting printability issues due to problematic geometries, but it has the disadvantage of slow performance on large designs and blocks [1]. Foundries have found a good compromise solution for running litho simulation on full chips by filtering out potential candidate hotspot patterns using pattern matching (PM), and then performing simulation on the matched locations. The challenge has always been how to easily create a PM library of candidate patterns that provides both comprehensive coverage for litho problems and fast runtime performance. This paper presents a new strategy for generating candidate real design patterns through a random generation approach using a layout schema generator (LSG) utility. The output patterns from the LSG are simulated, and then classified by a scoring mechanism that categorizes patterns according to the severity of the hotspots, probability of their presence in the design, and the likelihood of the pattern causing a hotspot. The scoring output helps to filter out the yield problematic patterns that should be removed from any standard cell design, and also to define potential problematic patterns that must be simulated within a bigger context to decide whether or not they represent an actual hotspot. This flow is demonstrated on SMIC 14nm technology, creating a candidate hotspot pattern library that can be used in full chip simulation with very high coverage and robust performance.
Scanner OPC signatures: automatic vendor-to-vendor OPE matching
NASA Astrophysics Data System (ADS)
Renwick, Stephen P.
2009-03-01
As 193nm lithography continues to be stretched and the k1 factor decreases, optical proximity correction (OPC) has become a vital part of the lithographer's tool kit. Unfortunately, as is now well known, the design variations of lithographic scanners from different vendors cause them to have slightly different optical-proximity effect (OPE) behavior, meaning that they print features through pitch in distinct ways. This in turn means that their response to OPC is not the same, and that an OPC solution designed for a scanner from Company 1 may or may not work properly on a scanner from Company 2. Since OPC is not inexpensive, that causes trouble for chipmakers using more than one brand of scanner. Clearly a scanner-matching procedure is needed to meet this challenge. Previously, automatic matching has only been reported for scanners of different tool generations from the same manufacturer. In contrast, scanners from different companies have been matched using expert tuning and adjustment techniques, frequently requiring laborious test exposures. Automatic matching between scanners from Company 1 and Company 2 has remained an unsettled problem. We have recently solved this problem and introduce a novel method to perform the automatic matching. The success in meeting this challenge required three enabling factors. First, we recognized the strongest drivers of OPE mismatch and are thereby able to reduce the information needed about a tool from another supplier to that information readily available from all modern scanners. Second, we developed a means of reliably identifying the scanners' optical signatures, minimizing dependence on process parameters that can cloud the issue. Third, we carefully employed standard statistical techniques, checking for robustness of the algorithms used and maximizing efficiency. The result is an automatic software system that can predict an OPC matching solution for scanners from different suppliers without requiring expert intervention.
Polymer blend lithography for metal films: large-area patterning with over 1 billion holes/inch(2).
Huang, Cheng; Förste, Alexander; Walheim, Stefan; Schimmel, Thomas
2015-01-01
Polymer blend lithography (PBL) is a spin-coating-based technique that makes use of the purely lateral phase separation between two immiscible polymers to fabricate large area nanoscale patterns. In our earlier work (Huang et al. 2012), PBL was demonstrated for the fabrication of patterned self-assembled monolayers. Here, we report a new method based on the technique of polymer blend lithography that allows for the fabrication of metal island arrays or perforated metal films on the nanometer scale, the metal PBL. As the polymer blend system in this work, a mixture of polystyrene (PS) and poly(methyl methacrylate) (PMMA), dissolved in methyl ethyl ketone (MEK) is used. This system forms a purely lateral structure on the substrate at controlled humidity, which means that PS droplets are formed in a PMMA matrix, whereby both phases have direct contact both to the substrate and to the air interface. Therefore, a subsequent selective dissolution of either the PS or PMMA component leaves behind a nanostructured film which can be used as a lithographic mask. We use this lithographic mask for the fabrication of metal patterns by thermal evaporation of the metal, followed by a lift-off process. As a consequence, the resulting metal nanostructure is an exact replica of the pattern of the selectively removed polymer (either a perforated metal film or metal islands). The minimum diameter of these holes or metal islands demonstrated here is about 50 nm. Au, Pd, Cu, Cr and Al templates were fabricated in this work by metal PBL. The wavelength-selective optical transmission spectra due to the localized surface plasmonic effect of the holes in perforated Al films were investigated and compared to the respective hole diameter histograms.
NASA Astrophysics Data System (ADS)
Meilianda, E.; Munadi, K.; Azmeri; Safrida; Direzkia, Y.; Syamsidik; Oktari, R. S.
2017-02-01
Post-tsunami recovery process at Banda Aceh city of Indonesia were assessed in this study. Several actions and programs implemented during the recovery process were exercised and examined through several FGDs, to identify any windows of opportunities to change were captured in the aspects of infrastructure and housing, economic revitalization of the affected community, mental health and psychosocial condition and development, establishment and implementation of disaster risk reduction programs and community preparedness. Subsequently, whether or not those changes fit into the principle criteria of sustainability were examined. The results give insights on the dynamics of recovery process after more than a decade since the tsunami was affected the area. Some success and not-so-success stories of actions and program implementations during the recovery process were captured. On the aspect of livelihoods and public finance, the local government seems to have seen a window of opportunity and subsequently seize the opportunity to revitalize the administrative system of financing the micro-finance for communities. In contrast, on the aspect of socio-ecological systems integrity toward preserving the natural environment, the case of housing development at the coastal areas against the blueprint city masterplan exemplifies the failure in seizing the window of opportunity to “build back better”.
Direct-write assembly of microperiodic planar and spanning ITO microelectrodes
DOE Office of Scientific and Technical Information (OSTI.GOV)
Ahn, Bok Y; Lorang, David J; Duoss, Eric B.
2010-01-01
Printed Sn-doped In{sub 2}O{sub 3} (ITO) microelectrodes are fabricated by direct-write assembly of sol–gel inks with varying concentration. This maskless, non-lithographic approach provides a facile route to patterning transparent conductive features in planar arrays and spanning architectures.
An evaluation of lithographed forest stereograms.
David A. Bernstein
1961-01-01
Aerial photo stereograms are valuable for showing neophyte photo interpreters the stereoscopic appearance of common objects and conditions. They are also useful for instruction in measuring heights, horizontal distances, and angles on photos. Collections of stereograms of known conditions are worthwhile reference material for interpretation work in unknown areas.
Multilayered Microelectronic Device Package With An Integral Window
Peterson, Kenneth A.; Watson, Robert D.
2004-10-26
A microelectronic package with an integral window mounted in a recessed lip for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The package can be formed of a low temperature co-fired ceramic (LTCC) or high temperature cofired ceramic (HTCC) multilayered material, with the integral window being simultaneously joined (e.g. co-fired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that a light-sensitive side is optically accessible through the window. The result is a compact, low profile package, having an integral window mounted in a recessed lip, that can be hermetically sealed.
Study of wavefront error and polarization of a side mounted infrared window
NASA Astrophysics Data System (ADS)
Liu, Jiaguo; Li, Lin; Hu, Xinqi; Yu, Xin
2008-03-01
The wavefront error and polarization of a side mounted infrared window made of ZnS are studied. The Infrared windows suffer from temperature gradient and stress during their launch process. Generally, the gradient in temperature changes the refractive index of the material whereas stress produces deformation and birefringence. In this paper, a thermal finite element analysis (FEA) of an IR window is presented. For this purpose, we employed an FEA program Ansys to obtain the time-varying temperature field. The deformation and stress of the window are derived from a structural FEA with the aerodynamic force and the temperature field previously obtained as being the loads. The deformation, temperature field, stress field, ray tracing and Jones Calculus are used to calculate the wavefront error and the change of polarization state.
High-Temperature Optical Window Design
NASA Technical Reports Server (NTRS)
Roeloffs, Norman; Taranto, Nick
1995-01-01
A high-temperature optical window is essential to the optical diagnostics of high-temperature combustion rigs. Laser Doppler velocimetry, schlieren photography, light sheet visualization, and laser-induced fluorescence spectroscopy are a few of the tests that require optically clear access to the combustor flow stream. A design was developed for a high-temperature window that could withstand the severe environment of the NASA Lewis 3200 F Lean Premixed Prevaporized (LPP) Flame Tube Test Rig. The development of this design was both time consuming and costly. This report documents the design process and the lessons learned, in an effort to reduce the cost of developing future designs for high-temperature optical windows.
Accessing thermoplastic processing windows in metallic glasses using rapid capacitive discharge
Kaltenboeck, Georg; Harris, Thomas; Sun, Kerry; Tran, Thomas; Chang, Gregory; Schramm, Joseph P.; Demetriou, Marios D.; Johnson, William L.
2014-01-01
The ability of the rapid-capacitive discharge approach to access optimal viscosity ranges in metallic glasses for thermoplastic processing is explored. Using high-speed thermal imaging, the heating uniformity and stability against crystallization of Zr35Ti30Cu7.5Be27.5 metallic glass heated deeply into the supercooled region is investigated. The method enables homogeneous volumetric heating of bulk samples throughout the entire supercooled liquid region at high rates (~105 K/s) sufficient to bypass crystallization throughout. The crystallization onsets at temperatures in the vicinity of the “crystallization nose” were identified and a Time-Temperature-Transformation diagram is constructed, revealing a “critical heating rate” for the metallic glass of ~1000 K/s. Thermoplastic process windows in the optimal viscosity range of 100–104 Pa·s are identified, being confined between the glass relaxation and the eutectic crystallization transition. Within this process window, near-net forging of a fine precision metallic glass part is demonstrated. PMID:25269892
Cherepy, Nerine Jane; Payne, Stephen Anthony; Drury, Owen B.; Sturm, Benjamin W.
2016-02-09
According to one embodiment, a scintillator radiation detector system includes a scintillator, and a processing device for processing pulse traces corresponding to light pulses from the scintillator, where the processing device is configured to: process each pulse trace over at least two temporal windows and to use pulse digitization to improve energy resolution of the system. According to another embodiment, a scintillator radiation detector system includes a processing device configured to: fit digitized scintillation waveforms to an algorithm, perform a direct integration of fit parameters, process multiple integration windows for each digitized scintillation waveform to determine a correction factor, and apply the correction factor to each digitized scintillation waveform.
Inquiry with Laser Printer Diffraction Gratings
ERIC Educational Resources Information Center
Van Hook, Stephen J.
2007-01-01
The pages of "The Physics Teacher" have featured several clever designs for homemade diffraction gratings using a variety of materials--cloth, lithographic film, wire, compact discs, parts of aerosol spray cans, and pseudoliquids and pseudosolids. A different and inexpensive method I use to make low-resolution diffraction gratings takes advantage…
Lithographic Stripping; Printing 2: 9755.03.
ERIC Educational Resources Information Center
Dade County Public Schools, Miami, FL.
The course is one of a group which provides 11th grade students with the general information, technical knowledge, basic skills, attitudes, and values required for job entry level in printing. The course is 90 hours in length. Course content includes goals, specific objectives, orientation, safety in the stripping department, and a stripping…
Platemaking; Printing 2: 9755.04.
ERIC Educational Resources Information Center
Dade County Public Schools, Miami, FL.
The course is one of a group which provides 11th grade students with the general information, technical knowledge, basic skills, attitudes, and values required for job entry level in the printing industry. Course content includes goals, specific objectives, orientation, types of lithographic plates, surface plates for offset, wipe-on plates,…
Code of Federal Regulations, 2010 CFR
2010-10-01
... number shall be embossed on the top of the container. The container shall also be lithographed on one...) (b) Other marking. In addition to any other marking placed on the smallest packing carton or box in which emergency drinking water containers are placed prior to shipment, each carton or box shall be...
Code of Federal Regulations, 2011 CFR
2011-10-01
... number shall be embossed on the top of the container. The container shall also be lithographed on one...) (b) Other marking. In addition to any other marking placed on the smallest packing carton or box in which emergency drinking water containers are placed prior to shipment, each carton or box shall be...
Code of Federal Regulations, 2012 CFR
2012-10-01
... number shall be embossed on the top of the container. The container shall also be lithographed on one...) (b) Other marking. In addition to any other marking placed on the smallest packing carton or box in which emergency drinking water containers are placed prior to shipment, each carton or box shall be...
Code of Federal Regulations, 2013 CFR
2013-10-01
... number shall be embossed on the top of the container. The container shall also be lithographed on one...) (b) Other marking. In addition to any other marking placed on the smallest packing carton or box in which emergency drinking water containers are placed prior to shipment, each carton or box shall be...
Code of Federal Regulations, 2014 CFR
2014-10-01
... number shall be embossed on the top of the container. The container shall also be lithographed on one...) (b) Other marking. In addition to any other marking placed on the smallest packing carton or box in which emergency drinking water containers are placed prior to shipment, each carton or box shall be...
2014-06-30
2014). 15. F. Alali, Y.H. Kim, A. Baev, E.P Furlani, "Plasmon-enhanced Metasurfaces for Controlling Optical Polarization," ACS Photonics 1(6), 507-515 (2014). DISTRIBUTION A: Distribution approved for public release.
Federal Register 2010, 2011, 2012, 2013, 2014
2010-12-30
... ENVIRONMENTAL PROTECTION AGENCY 40 CFR Part 52 [EPA-R05-OAR-2010-0259; FRL-9245-8] Approval and... Lithographic and Letterpress Printing in Cleveland AGENCY: Environmental Protection Agency (EPA). ACTION: Proposed rule. SUMMARY: On March 9, 2010, the Ohio Environmental Protection Agency (Ohio EPA) submitted...
Graphite-based photovoltaic cells
Lagally, Max; Liu, Feng
2010-12-28
The present invention uses lithographically patterned graphite stacks as the basic building elements of an efficient and economical photovoltaic cell. The basic design of the graphite-based photovoltaic cells includes a plurality of spatially separated graphite stacks, each comprising a plurality of vertically stacked, semiconducting graphene sheets (carbon nanoribbons) bridging electrically conductive contacts.
Views of Ancient Egypt. Teacher's Guide. School Arts: Looking/Learning.
ERIC Educational Resources Information Center
Downs, Linda; Brenner, Carla
This teaching guide discusses ancient Egyptian culture, the lithographs made by Napoleon's scientists in 1798-99 to study and record every aspect of Egypt, the world's subsequent fascination with Egypt, ancient Egyptian architecture, Egyptian writing, and archeologists' illustrations of Egypt. The guide suggests activities for elementary school,…
Wilson, Ander; Chiu, Yueh-Hsiu Mathilda; Hsu, Hsiao-Hsien Leon; Wright, Robert O; Wright, Rosalind J; Coull, Brent A
2017-07-01
Epidemiological research supports an association between maternal exposure to air pollution during pregnancy and adverse children's health outcomes. Advances in exposure assessment and statistics allow for estimation of both critical windows of vulnerability and exposure effect heterogeneity. Simultaneous estimation of windows of vulnerability and effect heterogeneity can be accomplished by fitting a distributed lag model (DLM) stratified by subgroup. However, this can provide an incomplete picture of how effects vary across subgroups because it does not allow for subgroups to have the same window but different within-window effects or to have different windows but the same within-window effect. Because the timing of some developmental processes are common across subpopulations of infants while for others the timing differs across subgroups, both scenarios are important to consider when evaluating health risks of prenatal exposures. We propose a new approach that partitions the DLM into a constrained functional predictor that estimates windows of vulnerability and a scalar effect representing the within-window effect directly. The proposed method allows for heterogeneity in only the window, only the within-window effect, or both. In a simulation study we show that a model assuming a shared component across groups results in lower bias and mean squared error for the estimated windows and effects when that component is in fact constant across groups. We apply the proposed method to estimate windows of vulnerability in the association between prenatal exposures to fine particulate matter and each of birth weight and asthma incidence, and estimate how these associations vary by sex and maternal obesity status in a Boston-area prospective pre-birth cohort study. © The Author 2017. Published by Oxford University Press. All rights reserved. For permissions, please e-mail: journals.permissions@oup.com.
Kakooei, Hossein; Shahtaheri, Seyed Jamaleddin; Karbasi, Hossein-Ali
2006-01-01
Evaluation of personal inhalation exposure to methylene diphenyl diisocyanate (MDI) among 39 employees, working in the window fixation and window glue processes in an automobile manufacturing company was performed. This study was conducted for both case and control groups. After sampling and sample preparation processes, MDI was determined with a UV-VIS spectrophotometer at 590 nm; the lung function was assessed with a digital spirometer, too. The average concentration of MDI in the window fixation, and window glue workplaces were 34.53 and 27.37 micro g/m3, respectively, which was lower than the threshold limit value (TLV) recommended by the American Conference of Governmental Industrial Hygienists (ACGIH) (51 micro g/m3). Respiratory symptoms in the exposed group were significantly different compared to the unexposed group (p < .05). Lung capacities in the case group were lower than in the control group (p < .05). Therefore, MDI can be easily measured making it possible to evaluate the adverse effects caused by occupational exposure.
Wei, Xueyong
2010-11-01
Since it was invented two decades ago, Nanosphere Lithography (NSL) has been widely studied as a low cost and flexible technique to fabricate nanostructures. Based on the registered patents and some selected papers, this review will discuss recent developments of different NSL strategies for the fabrication of ordered nanostructure arrays. The mechanism of self-assembly process and the techniques for preparing the self-assembled nanosphere template are first briefly introduced. The nanosphere templates are used either as shadow masks or as moulds for pattern transfer. Much more work now combines NSL with other lithographic techniques and material growth methods to form novel nanostructures of complex shape or various materials. Hence, this review finally gives a discussion on some future directions in NSL study.
Aluminum Nanowire Arrays via Soft Nanoimprint Lithography
NASA Astrophysics Data System (ADS)
Naughton, Michael J.; Nesbitt, Nathan T.; Merlo, Juan M.; Rose, Aaron H.; Calm, Yitzi M.; D'Imperio, Luke A.; Courtney, Dave T.; Shepard, Steve; Kempa, Krzysztof; Burns, Michael J.
We have previously reported a method to fabricate freestanding, vertically-oriented, and lithographically-ordered Al nanowire arrays via directed assembly, and demonstrated their utility as a plasmonic waveguide. However, the process, a variation on the preparation of anodized aluminum oxide (AAO), involved imprinting Al with a hard stamp, which wore down the stamp and had a low yield of Al NWs. Here we show a new nanoimprint lithography (NIL) technique that uses a soft stamp to pattern a mask on the Al; it provides a greater yield of Al NWs and is less destructive to the stamp, providing a path to applications that require NW arrays over macroscopic areas. This material is based upon work supported by the National Science Foundation Graduate Research Fellowship under Grant No. (DGE-1258923).
Speranza, Valentina; Trotta, Francesco; Drioli, Enrico; Gugliuzza, Annarosa
2010-02-01
The fabrication of well-defined interfaces is in high demand in many fields of biotechnologies. Here, high-definition membrane-like arrays are developed through the self-assembly of water droplets, which work as natural building blocks for the construction of ordered channels. Solution viscosity together with the dynamics of the water droplets can decide the final formation of three-dimensional well-ordered patterns resembling anodic structures, especially because solvents denser than water are used. Particularly, the polymer solution viscosity is demonstrated to be a powerful tool for control of the mobility of submerged droplets during the microfabrication process. The polymeric patterns are structured at very high levels of organization and exhibit well-established transport-surface property relationships, considered basics for any types of advanced biotechnologies.
Design and Verification of Critical Pressurised Windows for Manned Spaceflight
NASA Astrophysics Data System (ADS)
Lamoure, Richard; Busto, Lara; Novo, Francisco; Sinnema, Gerben; Leal, Mendes M.
2014-06-01
The Window Design for Manned Spaceflight (WDMS) project was tasked with establishing the state-of-art and explore possible improvements to the current structural integrity verification and fracture control methodologies for manned spacecraft windows.A critical review of the state-of-art in spacecraft window design, materials and verification practice was conducted. Shortcomings of the methodology in terms of analysis, inspection and testing were identified. Schemes for improving verification practices and reducing conservatism whilst maintaining the required safety levels were then proposed.An experimental materials characterisation programme was defined and carried out with the support of the 'Glass and Façade Technology Research Group', at the University of Cambridge. Results of the sample testing campaign were analysed, post-processed and subsequently applied to the design of a breadboard window demonstrator.Two Fused Silica glass window panes were procured and subjected to dedicated analyses, inspection and testing comprising both qualification and acceptance programmes specifically tailored to the objectives of the activity.Finally, main outcomes have been compiled into a Structural Verification Guide for Pressurised Windows in manned spacecraft, incorporating best practices and lessons learned throughout this project.
Laser-induced Forward Transfer of Ag Nanopaste.
Breckenfeld, Eric; Kim, Heungsoo; Auyeung, Raymond C Y; Piqué, Alberto
2016-03-31
Over the past decade, there has been much development of non-lithographic methods(1-3) for printing metallic inks or other functional materials. Many of these processes such as inkjet(3) and laser-induced forward transfer (LIFT)(4) have become increasingly popular as interest in printable electronics and maskless patterning has grown. These additive manufacturing processes are inexpensive, environmentally friendly, and well suited for rapid prototyping, when compared to more traditional semiconductor processing techniques. While most direct-write processes are confined to two-dimensional structures and cannot handle materials with high viscosity (particularly inkjet), LIFT can transcend both constraints if performed properly. Congruent transfer of three dimensional pixels (called voxels), also referred to as laser decal transfer (LDT)(5-9), has recently been demonstrated with the LIFT technique using highly viscous Ag nanopastes to fabricate freestanding interconnects, complex voxel shapes, and high-aspect-ratio structures. In this paper, we demonstrate a simple yet versatile process for fabricating a variety of micro- and macroscale Ag structures. Structures include simple shapes for patterning electrical contacts, bridging and cantilever structures, high-aspect-ratio structures, and single-shot, large area transfers using a commercial digital micromirror device (DMD) chip.
Laser-induced Forward Transfer of Ag Nanopaste
Breckenfeld, Eric; Kim, Heungsoo; Auyeung, Raymond C. Y.; Piqué, Alberto
2016-01-01
Over the past decade, there has been much development of non-lithographic methods1-3 for printing metallic inks or other functional materials. Many of these processes such as inkjet3 and laser-induced forward transfer (LIFT)4 have become increasingly popular as interest in printable electronics and maskless patterning has grown. These additive manufacturing processes are inexpensive, environmentally friendly, and well suited for rapid prototyping, when compared to more traditional semiconductor processing techniques. While most direct-write processes are confined to two-dimensional structures and cannot handle materials with high viscosity (particularly inkjet), LIFT can transcend both constraints if performed properly. Congruent transfer of three dimensional pixels (called voxels), also referred to as laser decal transfer (LDT)5-9, has recently been demonstrated with the LIFT technique using highly viscous Ag nanopastes to fabricate freestanding interconnects, complex voxel shapes, and high-aspect-ratio structures. In this paper, we demonstrate a simple yet versatile process for fabricating a variety of micro- and macroscale Ag structures. Structures include simple shapes for patterning electrical contacts, bridging and cantilever structures, high-aspect-ratio structures, and single-shot, large area transfers using a commercial digital micromirror device (DMD) chip. PMID:27077645
Qualitative Features Extraction from Sensor Data using Short-time Fourier Transform
NASA Technical Reports Server (NTRS)
Amini, Abolfazl M.; Figueroa, Fernando
2004-01-01
The information gathered from sensors is used to determine the health of a sensor. Once a normal mode of operation is established any deviation from the normal behavior indicates a change. This change may be due to a malfunction of the sensor(s) or the system (or process). The step-up and step-down features, as well as sensor disturbances are assumed to be exponential. An RC network is used to model the main process, which is defined by a step-up (charging), drift, and step-down (discharging). The sensor disturbances and spike are added while the system is in drift. The system runs for a period of at least three time-constants of the main process every time a process feature occurs (e.g. step change). The Short-Time Fourier Transform of the Signal is taken using the Hamming window. Three window widths are used. The DC value is removed from the windowed data prior to taking the FFT. The resulting three dimensional spectral plots provide good time frequency resolution. The results indicate distinct shapes corresponding to each process.
Improvement of resist profile roughness in bilayer resist process
NASA Astrophysics Data System (ADS)
Jeong, Chang-Young; Ryu, Sang-Wook; Park, Ki-Yeop; Lee, Won-Kyu; Lee, Seung-Woog; Lee, Dai-Hoon
2000-06-01
The bi-layer resist (BLR) process, which first accomplish imaging on a thin top layer and transfer it down to a thick organic layer, is one of newly emerging patterning techniques in silicon processing. In this work, we studied the lithographic performance of the BLR process adopting FK- SPTM (Fujifilm Olin Co.) as top layer material and various organic material as bottom layer. Generally, considerable advantages of planarization, reduced substrate reflection, improved process latitude, and of enhanced resolution are achieved. However, the resolution and the process latitude are highly affected by surface interaction between the top resist and the bottom material. Moreover, the BLR process has a sidewall roughness problem related to the material factors of the resist and the degraded aerial image contrast, which can affect the reliability of the device. We found that thermal curing treatment applied after development with the consideration of the glass transition temperature are very effective in reducing the line edge roughness. More smooth and steep patterning is achieved by the thermal treatment. The linewidth controllability is below 10 nm and the k1 value is reduced from 0.5 down to 0.32 in this process. The reactive ion etching adopting O2 gas demonstrated selectivity of the top resist over bottom material more than 15:1, together with residue-free and vertical wall profile.
Transition Metal Switchable Mirror
None
2017-12-09
The switchable-mirrors technology was developed by Tom Richardson and Jonathan Slack of Berkeley Lab's Environmental Energy Technologies Division. By using transition metals rather than the rare earth metals used in the first metal-hydride switchable mirrors, Richardson and Slack were able to lower the cost and simplify the manufacturing process. Energy performance is improved as well, because the new windows can reflect or transmit both visible and infrared light. Besides windows for offices and homes, possible applications include automobile sunroofs, signs and displays, aircraft windows, and spacecraft.
Transition Metal Switchable Mirror
DOE Office of Scientific and Technical Information (OSTI.GOV)
None
2009-08-21
The switchable-mirrors technology was developed by Tom Richardson and Jonathan Slack of Berkeley Lab's Environmental Energy Technologies Division. By using transition metals rather than the rare earth metals used in the first metal-hydride switchable mirrors, Richardson and Slack were able to lower the cost and simplify the manufacturing process. Energy performance is improved as well, because the new windows can reflect or transmit both visible and infrared light. Besides windows for offices and homes, possible applications include automobile sunroofs, signs and displays, aircraft windows, and spacecraft.
In Situ Optical Observation of High-Temperature Geological Processes With the Moissanite Cell
NASA Astrophysics Data System (ADS)
Walte, N.; Keppler, H.
2005-12-01
A major drawback of existing techniques in experimental earth and material sciences is the inability to observe ongoing high-temperature processes in situ during an experiment. Examples for important time-dependent processes include the textural development of rocks and oxide systems during melting and crystallization, solid-state and melt-present recrystallization and Ostwald ripening, and bubble nucleation and growth during degassing of glasses and melts. The investigation of these processes by post-mortem analysis of a quenched microstructure is time consuming and often unsatisfactory. Here, we introduce the moissanite cell that allows optical in situ observation of long-term experiments at high temperatures. Moissanite is a transparent gem-quality type of SiC that is characterized by its hardness and superior chemical and thermal resistance. Two moissanite windows with a thickness and diameter of several millimeters are placed into sockets of fired pyrophyllite and fixed onto two opposite metal plates. The sockets are wrapped with heating wire and each window is connected to a thermocouple for temperature control. The sample is placed directly between the moissanite windows and the cell is assembled similarly to a large diamond anvil cell. In situ observation of the sample is done with a microscope through observation windows and movies are recorded with an attached digital camera. Our experiments with the new cell show that temperatures above 1200°C can be maintained and observed in a sample for several days without damaging the cell nor the windows. Time-lapse movies of melting and crystallizing natural and synthetic rocks and of degassing glasses and melts will be presented to show the potential of the new technique for experimental earth and material science.
A tale of CIN--the Cannabis infringement notice scheme in Western Australia.
Lenton, Simon; Allsop, Steve
2010-05-01
To describe the development and enactment of the Western Australian (WA) Cannabis Infringement Notice scheme and reflect on the lessons for researchers and policy-makers interested in the translation of policy research to policy practice. An insiders' description of the background research, knowledge transfer strategies and political and legislative processes leading to the enactment and implementation of the WA Cannabis Control Act 2003. Lenton and Allsop were involved centrally in the process as policy-researcher and policy-bureaucrat. In March 2004, Western Australia became the fourth Australian jurisdiction to adopt a 'prohibition with civil penalties' scheme for possession and cultivation of small amounts of cannabis. We reflect upon: the role of research evidence in the policy process; windows for policy change; disseminating findings when apparently no one is listening; the risks and benefits of the researcher as advocate; the differences between working on the inside and outside of government; and the importance of relationships, trust and track record. There was a window of opportunity and change was influenced by research that was communicated by a reliable and trusted source. Those who want to conduct research that informs policy need to understand the policy process more clearly, look for and help create emerging windows that occur in the problem and political spheres, and make partnerships with key stakeholders in the policy arena. The flipside of the process is that, when governments change, policy born in windows of opportunity can be a casualty.
Infrared sensor and window system issues
NASA Astrophysics Data System (ADS)
Hargraves, Charles H., Jr.; Martin, James M.
1992-12-01
EO/IR windows are a significant challenge for the weapon system sensor designer who must design for high EO performance, low radar cross section (RCS), supersonic flight, durability, producibility and affordable initial and life cycle costs. This is particularly true in the 8 to 12 micron IR band at which window materials and coating choices are limited by system design requirements. The requirements also drive the optimization of numerous mechanical, optical, materials, and electrical parameters. This paper addresses the EO/IR window as a system design challenge. The interrelationship of the optical, mechanical, and system design processes are examined. This paper presents a summary of the test results, trade studies and analyses that were performed for multi-segment, flight-worthy optical windows with superior optical performance at subsonic and supersonic aircraft velocities and reduced radar cross section. The impact of the window assembly on EO system modulation transfer function (MTF) and sensitivity will be discussed. The use of conductive coatings for shielding/signature control will be discussed.
NASA Astrophysics Data System (ADS)
Ferrara, Davon W.; MacQuarrie, Evan R.; Diez-Blanco, Victor; Nag, Joyeeta; Kaye, Anthony B.; Haglund, Richard F.
2012-08-01
Nanocomposites consisting of gold nanoparticle (NP) arrays and vanadium dioxide (VO2) thin films are noteworthy for the tunability of both their thermal and optical properties. The localized surface plasmon resonance (LSPR) of the Au can be tuned when its dielectric environment is modulated by the semiconducting-to-metal phase transition (SMT) of the VO2; the LSPR itself can be altered by changing the shape of the NPs and the pitch of the NP array. In principle, then it should be possible to choose a combination of VO2 film and Au LSPR properties that maximizes the overall optical response of the nanocomposite. To demonstrate this effect, transient transmission measurements were conducted on lithographically fabricated arrays of Au NPs of diameter 140 nm, array spacing 350 nm, and covered with a 60 nm thick films of VO2 via pulsed laser deposition. Both Au::VO2 nanocomposites and bare VO2 film were irradiated with a shuttered 785 nm pump laser, and their optical response was probed at 1550 nm by a fixed-frequency diode laser. The Au::VO2 nanocomposite exhibited an increased effective absorption coefficient 1.5 times that of the plain film and required 37 % less laser power to induce the SMT. The time-dependent temperature rise in the film as a function of laser intensity was calculated from these measurements and compared with both analytic and finite-element models. Our results suggest that Au::VO2 nanocomposites may be useful in applications such as thermal-management coatings for energy efficient "smart" windows.
Optical Distortion Evaluation in Large Area Windows using Interferometry
NASA Technical Reports Server (NTRS)
Youngquist, Robert C.; Skow, Miles; Nurge, Mark A.
2015-01-01
It is important that imagery seen through large area windows, such as those used on space vehicles, not be substantially distorted. Many approaches are described in the literature for measuring the distortion of an optical window, but most suffer from either poor resolution or processing difficulties. In this paper a new definition of distortion is presented, allowing accurate measurement using an optical interferometer. This new definition is shown to be equivalent to the definitions provided by the military and the standards organizations. In order to determine the advantages and disadvantages of this new approach the distortion of an acrylic window is measured using three different methods; image comparison, Moiré interferometry, and phase-shifting interferometry.
A Comparison of Three Methods for Measuring Distortion in Optical Windows
NASA Technical Reports Server (NTRS)
Youngquist, Robert C.; Nurge, Mark A.; Skow, Miles
2015-01-01
It's important that imagery seen through large-area windows, such as those used on space vehicles, not be substantially distorted. Many approaches are described in the literature for measuring the distortion of an optical window, but most suffer from either poor resolution or processing difficulties. In this paper a new definition of distortion is presented, allowing accurate measurement using an optical interferometer. This new definition is shown to be equivalent to the definitions provided by the military and the standards organizations. In order to determine the advantages and disadvantages of this new approach, the distortion of an acrylic window is measured using three different methods: image comparison, moiré interferometry, and phase-shifting interferometry.
Olshavsky, Megan E; Song, Bryan J; Powell, Daniel J; Jones, Carolyn E; Monfils, Marie-H; Lee, Hongjoo J
2013-01-01
When presented with a light cue followed by food, some rats simply approach the foodcup (Nonorienters), while others first orient to the light in addition to displaying the food-cup approach behavior (Orienters). Cue-directed orienting may reflect enhanced attentional and/or emotional processing of the cue, suggesting divergent natures of cue-information processing in Orienters and Nonorienters. The current studies investigate how differences in cue processing might manifest in appetitive memory retrieval and updating using a paradigm developed to persistently attenuate fear responses (Retrieval-extinction paradigm; Monfils et al., 2009). First, we examined whether the retrieval-extinction paradigm could attenuate appetitive responses in Orienters and Nonorienters. Next, we investigated if the appetitive memory could be updated using reversal learning (fear conditioning) during the reconsolidation window (as opposed to repeated unreinforced trials, i.e., extinction). Both extinction and new fear learning given within the reconsolidation window were effective at persistently updating the initial appetitive memory in the Orienters, but not the Nonorienters. Since conditioned orienting is mediated by the amygdala central nucleus (CeA), our final experiment examined the CeA's role in the retrieval-extinction process. Bilateral CeA lesions interfered with the retrieval-extinction paradigm-did not prevent spontaneous recovery of food-cup approach. Together, our studies demonstrate the critical role of conditioned orienting behavior and the CeA in updating appetitive memory during the reconsolidation window.
2003-09-08
KENNEDY SPACE CENTER, FLA. - The Window Observational Research Facility (WORF), seen in the Space Station Processing Facility, was designed and built by the Boeing Co. at NASA’s Marshall Space Flight Center in Huntsville, Ala. WORF will be delivered to the International Space Station and placed in the rack position in front of the Destiny lab window, providing locations for attaching cameras, multi-spectral scanners and other instruments. WORF will support a variety of scientific and commercial experiments in areas of Earth systems and processes, global ecological changes in Earth’s biosphere, lithosphere, hydrosphere and climate system, Earth resources, natural hazards, and education. After installation, it will become a permanent focal point for Earth Science research aboard the space station.
2003-09-08
KENNEDY SPACE CENTER, FLA. - Workers in the Space Station Processing Facility check out the Window Observational Research Facility (WORF), designed and built by the Boeing Co. at NASA’s Marshall Space Flight Center in Huntsville, Ala. WORF will be delivered to the International Space Station and placed in the rack position in front of the Destiny lab window, providing locations for attaching cameras, multi-spectral scanners and other instruments. WORF will support a variety of scientific and commercial experiments in areas of Earth systems and processes, global ecological changes in Earth’s biosphere, lithosphere, hydrosphere and climate system, Earth resources, natural hazards, and education. After installation, it will become a permanent focal point for Earth Science research aboard the space station.
NASA Astrophysics Data System (ADS)
Presnov, Denis E.; Bozhev, Ivan V.; Miakonkikh, Andrew V.; Simakin, Sergey G.; Trifonov, Artem S.; Krupenin, Vladimir A.
2018-02-01
We present the original method for fabricating a sensitive field/charge sensor based on field effect transistor (FET) with a nanowire channel that uses CMOS-compatible processes only. A FET with a kink-like silicon nanowire channel was fabricated from the inhomogeneously doped silicon on insulator wafer very close (˜100 nm) to the extremely sharp corner of a silicon chip forming local probe. The single e-beam lithographic process with a shadow deposition technique, followed by separate two reactive ion etching processes, was used to define the narrow semiconductor nanowire channel. The sensors charge sensitivity was evaluated to be in the range of 0.1-0.2 e /√{Hz } from the analysis of their transport and noise characteristics. The proposed method provides a good opportunity for the relatively simple manufacture of a local field sensor for measuring the electrical field distribution, potential profiles, and charge dynamics for a wide range of mesoscopic objects. Diagnostic systems and devices based on such sensors can be used in various fields of physics, chemistry, material science, biology, electronics, medicine, etc.
The physics of solid-state neutron detector materials and geometries.
Caruso, A N
2010-11-10
Detection of neutrons, at high total efficiency, with greater resolution in kinetic energy, time and/or real-space position, is fundamental to the advance of subfields within nuclear medicine, high-energy physics, non-proliferation of special nuclear materials, astrophysics, structural biology and chemistry, magnetism and nuclear energy. Clever indirect-conversion geometries, interaction/transport calculations and modern processing methods for silicon and gallium arsenide allow for the realization of moderate- to high-efficiency neutron detectors as a result of low defect concentrations, tuned reaction product ranges, enhanced effective omnidirectional cross sections and reduced electron-hole pair recombination from more physically abrupt and electronically engineered interfaces. Conversely, semiconductors with high neutron cross sections and unique transduction mechanisms capable of achieving very high total efficiency are gaining greater recognition despite the relative immaturity of their growth, lithographic processing and electronic structure understanding. This review focuses on advances and challenges in charged-particle-based device geometries, materials and associated mechanisms for direct and indirect transduction of thermal to fast neutrons within the context of application. Calorimetry- and radioluminescence-based intermediate processes in the solid state are not included.
Comparison of line shortening assessed by aerial image and wafer measurements
NASA Astrophysics Data System (ADS)
Ziegler, Wolfram; Pforr, Rainer; Thiele, Joerg; Maurer, Wilhelm
1997-02-01
Increasing number of patterns per area and decreasing linewidth demand enhancement technologies for optical lithography. OPC, the correction of systematic non-linearity in the pattern transfer process by correction of design data is one possibility to tighten process control and to increase the lifetime of existing lithographic equipment. The two most prominent proximity effects to be corrected by OPC are CD variation and line shortening. Line shortening measured on a wafer is up to 2 times larger than full resist simulation results. Therefore, the influence of mask geometry to line shortening is a key item to parameterize lithography. The following paper discusses the effect of adding small serifs to line ends with 0.25 micrometer ground-rule design. For reticles produced on an ALTA 3000 with standard wet etch process, the corner rounding on them mask can be reduced by adding serifs of a certain size. The corner rounding was measured and the effect on line shortening on the wafer is determined. This was investigated by resist measurements on wafer, aerial image plus resist simulation and aerial image measurements on the AIMS microscope.
2015-01-01
Large area arrays of magnetic, semiconducting, and insulating nanorings were created by coupling colloidal lithography with nanoscale electrodeposition. This versatile nanoscale fabrication process allows for the independent tuning of the spacing, diameter, and width of the nanorings with typical values of 1.0 μm, 750 nm, and 100 nm, respectively, and was used to form nanorings from a host of materials: Ni, Co, bimetallic Ni/Au, CdSe, and polydopamine. These nanoring arrays have potential applications in memory storage, optical materials, and biosensing. A modified version of this nanoscale electrodeposition process was also used to create arrays of split gold nanorings. The size of the split nanoring opening was controlled by the angle of photoresist exposure during the fabrication process and could be varied from 50% down to 10% of the ring circumference. The large area (cm2 scale) gold split nanoring array surfaces exhibited strong polarization-dependent plasmonic absorption bands for wavelengths from 1 to 5 μm. Plasmonic nanoscale split ring arrays are potentially useful as tunable dichroic materials throughout the infrared and near-infrared spectral regions. PMID:25553204
Tough, processable simultaneous semi-interpenetrating polyimides
NASA Technical Reports Server (NTRS)
Pater, Ruth H. (Inventor)
1996-01-01
A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.
Rusterholz, Thomas; Achermann, Peter; Dürr, Roland; Koenig, Thomas; Tarokh, Leila
2017-06-01
Investigating functional connectivity between brain networks has become an area of interest in neuroscience. Several methods for investigating connectivity have recently been developed, however, these techniques need to be applied with care. We demonstrate that global field synchronization (GFS), a global measure of phase alignment in the EEG as a function of frequency, must be applied considering signal processing principles in order to yield valid results. Multichannel EEG (27 derivations) was analyzed for GFS based on the complex spectrum derived by the fast Fourier transform (FFT). We examined the effect of window functions on GFS, in particular of non-rectangular windows. Applying a rectangular window when calculating the FFT revealed high GFS values for high frequencies (>15Hz) that were highly correlated (r=0.9) with spectral power in the lower frequency range (0.75-4.5Hz) and tracked the depth of sleep. This turned out to be spurious synchronization. With a non-rectangular window (Tukey or Hanning window) these high frequency synchronization vanished. Both, GFS and power density spectra significantly differed for rectangular and non-rectangular windows. Previous papers using GFS typically did not specify the applied window and may have used a rectangular window function. However, the demonstrated impact of the window function raises the question of the validity of some previous findings at higher frequencies. We demonstrated that it is crucial to apply an appropriate window function for determining synchronization measures based on a spectral approach to avoid spurious synchronization in the beta/gamma range. Copyright © 2017 Elsevier B.V. All rights reserved.
Pisano, E D; Cole, E B; Major, S; Zong, S; Hemminger, B M; Muller, K E; Johnston, R E; Walsh, R; Conant, E; Fajardo, L L; Feig, S A; Nishikawa, R M; Yaffe, M J; Williams, M B; Aylward, S R
2000-09-01
To determine the preferences of radiologists among eight different image processing algorithms applied to digital mammograms obtained for screening and diagnostic imaging tasks. Twenty-eight images representing histologically proved masses or calcifications were obtained by using three clinically available digital mammographic units. Images were processed and printed on film by using manual intensity windowing, histogram-based intensity windowing, mixture model intensity windowing, peripheral equalization, multiscale image contrast amplification (MUSICA), contrast-limited adaptive histogram equalization, Trex processing, and unsharp masking. Twelve radiologists compared the processed digital images with screen-film mammograms obtained in the same patient for breast cancer screening and breast lesion diagnosis. For the screening task, screen-film mammograms were preferred to all digital presentations, but the acceptability of images processed with Trex and MUSICA algorithms were not significantly different. All printed digital images were preferred to screen-film radiographs in the diagnosis of masses; mammograms processed with unsharp masking were significantly preferred. For the diagnosis of calcifications, no processed digital mammogram was preferred to screen-film mammograms. When digital mammograms were preferred to screen-film mammograms, radiologists selected different digital processing algorithms for each of three mammographic reading tasks and for different lesion types. Soft-copy display will eventually allow radiologists to select among these options more easily.
Classroom Amplification: Not Just for the Hearing Impaired Anymore.
ERIC Educational Resources Information Center
Dahlquist, Lori Hubble
This paper discusses the difficulties that children with central auditory processing difficulties can have in the classroom environment. Classroom acoustics that can hinder a child's accessibility to instruction are discussed, including open windows or windows not designed to be acoustic barriers, increased reverberation time in rooms with high…
Interview with Violet Oaklander, Author of "Windows to Our Children."
ERIC Educational Resources Information Center
Campbell, Chari A.
1993-01-01
Presents interview with Dr. Violent Oaklander, experienced child therapist and author of "Windows to Our Children: A Gestalt Therapy with Children and Adolescents." Discusses critical components of successful therapy with children. Explains how developmental stage of child affects therapeutic process, and provides specific examples of working with…
NASA Technical Reports Server (NTRS)
Tilton, James C. (Inventor)
2010-01-01
A method, computer readable storage, and apparatus for implementing recursive segmentation of data with spatial characteristics into regions including splitting-remerging of pixels with contagious region designations and a user controlled parameter for providing a preference for merging adjacent regions to eliminate window artifacts.
NASA Astrophysics Data System (ADS)
Piqué, Alberto; Auyeung, Raymond C. Y.; Kim, Heungsoo; Charipar, Nicholas A.; Mathews, Scott A.
2016-06-01
Laser-based materials processing techniques are gaining widespread use in micro-manufacturing applications. The use of laser microfabrication techniques enables the processing of micro- and nanostructures from a wide range of materials and geometries without the need for masking and etching steps commonly associated with photolithography. This review aims to describe the broad applications space covered by laser-based micro- and nanoprocessing techniques and the benefits offered by the use of lasers in micro-manufacturing processes. Given their non-lithographic nature, these processes are also referred to as laser direct-write and constitute some of the earliest demonstrations of 3D printing or additive manufacturing at the microscale. As this review will show, the use of lasers enables precise control of the various types of processing steps—from subtractive to additive—over a wide range of scales with an extensive materials palette. Overall, laser-based direct-write techniques offer multiple modes of operation including the removal (via ablative processes) and addition (via photopolymerization or printing) of most classes of materials using the same equipment in many cases. The versatility provided by these multi-function, multi-material and multi-scale laser micro-manufacturing processes cannot be matched by photolithography nor with other direct-write microfabrication techniques and offer unique opportunities for current and future 3D micro-manufacturing applications.
Patterned arrays of lateral heterojunctions within monolayer two-dimensional semiconductors
Mahjouri-Samani, Masoud; Lin, Ming-Wei; Wang, Kai; ...
2015-07-22
The formation of semiconductor heterojunctions and their high density integration are foundations of modern electronics and optoelectronics. To enable two-dimensional (2D) crystalline semiconductors as building blocks in next generation electronics, developing methods to deterministically form lateral heterojunctions is crucial. Here we demonstrate a process strategy for the formation of lithographically-patterned lateral semiconducting heterojunctions within a single 2D crystal. E-beam lithography is used to pattern MoSe 2 monolayer crystals with SiO 2, and the exposed locations are selectively and totally converted to MoS 2 using pulsed laser deposition (PLD) of sulfur in order to form MoSe 2/MoS 2 heterojunctions in predefinedmore » patterns. The junctions and conversion process are characterized by atomically resolved scanning transmission electron microscopy, photoluminescence, and Raman spectroscopy. This demonstration of lateral semiconductor heterojunction arrays within a single 2D crystal is an essential step for the lateral integration of 2D semiconductor building blocks with different electronic and optoelectronic properties for high-density, ultrathin circuitry.« less
DOE Office of Scientific and Technical Information (OSTI.GOV)
Boscá, A., E-mail: alberto.bosca@upm.es; Dpto. de Ingeniería Electrónica, E.T.S.I. de Telecomunicación, Universidad Politécnica de Madrid, Madrid 28040; Pedrós, J.
2015-01-28
Due to its intrinsic high mobility, graphene has proved to be a suitable material for high-speed electronics, where graphene field-effect transistor (GFET) has shown excellent properties. In this work, we present a method for extracting relevant electrical parameters from GFET devices using a simple electrical characterization and a model fitting. With experimental data from the device output characteristics, the method allows to calculate parameters such as the mobility, the contact resistance, and the fixed charge. Differentiated electron and hole mobilities and direct connection with intrinsic material properties are some of the key aspects of this method. Moreover, the method outputmore » values can be correlated with several issues during key fabrication steps such as the graphene growth and transfer, the lithographic steps, or the metalization processes, providing a flexible tool for quality control in GFET fabrication, as well as a valuable feedback for improving the material-growth process.« less
Lithography-free glass surface modification by self-masking during dry etching
NASA Astrophysics Data System (ADS)
Hein, Eric; Fox, Dennis; Fouckhardt, Henning
2011-01-01
Glass surface morphologies with defined shapes and roughness are realized by a two-step lithography-free process: deposition of an ~10-nm-thin lithographically unstructured metallic layer onto the surface and reactive ion etching in an Ar/CF4 high-density plasma. Because of nucleation or coalescence, the metallic layer is laterally structured during its deposition. Its morphology exhibits islands with dimensions of several tens of nanometers. These metal spots cause a locally varying etch velocity of the glass substrate, which results in surface structuring. The glass surface gets increasingly rougher with further etching. The mechanism of self-masking results in the formation of surface structures with typical heights and lateral dimensions of several hundred nanometers. Several metals, such as Ag, Al, Au, Cu, In, and Ni, can be employed as the sacrificial layer in this technology. Choice of the process parameters allows for a multitude of different glass roughness morphologies with individual defined and dosed optical scattering.
Maji, Debashis; Das, Debanjan; Wala, Jyoti; Das, Soumen
2015-01-01
Development of flexible sensors/electronics over substrates thicker than 100 μm is of immense importance for its practical feasibility. However, unlike over ultrathin films, large bending stress hinders its flexibility. Here we have employed a novel technique of fabricating sensors over a non-planar ridge topology under pre-stretched condition which not only helps in spontaneous generation of large and uniform parallel buckles upon release, but also acts as stress reduction zones thereby preventing Poisson’s ratio induced lateral cracking. Further, we propose a complete lithography compatible process to realize flexible sensors over pre-stretched substrates thicker than 100 μm that are released through dissolution of a water soluble sacrificial layer of polyvinyl alcohol. These buckling assisted flexible sensors demonstrated superior performance along different flexible modalities. Based on the above concept, we also realized a micro thermal flow sensor, conformally wrapped around angiographic catheters to detect flow abnormalities for potential applications in interventional catheterization process. PMID:26640124
Epitaxy: Programmable Atom Equivalents Versus Atoms
DOE Office of Scientific and Technical Information (OSTI.GOV)
Wang, Mary X.; Seo, Soyoung E.; Gabrys, Paul A.
The programmability of DNA makes it an attractive structure-directing ligand for the assembly of nanoparticle superlattices in a manner that mimics many aspects of atomic crystallization. However, the synthesis of multilayer single crystals of defined size remains a challenge. Though previous studies considered lattice mismatch as the major limiting factor for multilayer assembly, thin film growth depends on many interlinked variables. Here, a more comprehensive approach is taken to study fundamental elements, such as the growth temperature and the thermodynamics of interfacial energetics, to achieve epitaxial growth of nanoparticle thin films. Under optimized equilibrium conditions, single crystal, multilayer thin filmsmore » can be synthesized over 500 × 500 μm2 areas on lithographically patterned templates. Importantly, these superlattices follow the same patterns of crystal growth demonstrated in thin film atomic deposition, allowing for these processes to be understood in the context of well-studied atomic epitaxy, and potentially enabling a nanoscale model to study fundamental crystallization processes.« less
A three-dimensional optical photonic crystal with designed point defects
NASA Astrophysics Data System (ADS)
Qi, Minghao; Lidorikis, Elefterios; Rakich, Peter T.; Johnson, Steven G.; Joannopoulos, J. D.; Ippen, Erich P.; Smith, Henry I.
2004-06-01
Photonic crystals offer unprecedented opportunities for miniaturization and integration of optical devices. They also exhibit a variety of new physical phenomena, including suppression or enhancement of spontaneous emission, low-threshold lasing, and quantum information processing. Various techniques for the fabrication of three-dimensional (3D) photonic crystals-such as silicon micromachining, wafer fusion bonding, holographic lithography, self-assembly, angled-etching, micromanipulation, glancing-angle deposition and auto-cloning-have been proposed and demonstrated with different levels of success. However, a critical step towards the fabrication of functional 3D devices, that is, the incorporation of microcavities or waveguides in a controllable way, has not been achieved at optical wavelengths. Here we present the fabrication of 3D photonic crystals that are particularly suited for optical device integration using a lithographic layer-by-layer approach. Point-defect microcavities are introduced during the fabrication process and optical measurements show they have resonant signatures around telecommunications wavelengths (1.3-1.5µm). Measurements of reflectance and transmittance at near-infrared are in good agreement with numerical simulations.
DOE Office of Scientific and Technical Information (OSTI.GOV)
Wei, Guohua; Czaplewski, David A.; Lenferink, Erik J.
Three-dimensional confinement allows semiconductor quantum dots to exhibit size-tunable electronic and optical properties that enable a wide range of opto-electronic applications from displays, solar cells and bio-medical imaging to single-electron devices. Additional modalities such as spin and valley properties in monolayer transition metal dichalcogenides provide further degrees of freedom requisite for information processing and spintronics. In nanostructures, however, spatial confinement can cause hybridization that inhibits the robustness of these emergent properties. Here in this paper, we show that laterally-confined excitons in monolayer MoS 2 nanodots can be created through top-down nanopatterning with controlled size tunability. Unlike chemically-exfoliated monolayer nanoparticles, themore » lithographically patterned monolayer semiconductor nanodots down to a radius of 15 nm exhibit the same valley polarization as in a continuous monolayer sheet. The inherited bulk spin and valley properties, the size dependence of excitonic energies, and the ability to fabricate MoS 2 nanostructures using semiconductor-compatible processing suggest that monolayer semiconductor nanodots have potential to be multimodal building blocks of integrated optoelectronics and spintronics systems« less