Sample records for materials electronic components

  1. e-Biologics: Fabrication of Sustainable Electronics with "Green" Biological Materials.

    PubMed

    Lovley, Derek R

    2017-06-27

    The growing ubiquity of electronic devices is increasingly consuming substantial energy and rare resources for materials fabrication, as well as creating expansive volumes of toxic waste. This is not sustainable. Electronic biological materials (e-biologics) that are produced with microbes, or designed with microbial components as the guide for synthesis, are a potential green solution. Some e-biologics can be fabricated from renewable feedstocks with relatively low energy inputs, often while avoiding the harsh chemicals used for synthesizing more traditional electronic materials. Several are completely free of toxic components, can be readily recycled, and offer unique features not found in traditional electronic materials in terms of size, performance, and opportunities for diverse functionalization. An appropriate investment in the concerted multidisciplinary collaborative research required to identify and characterize e-biologics and to engineer materials and devices based on e-biologics could be rewarded with a new "green age" of sustainable electronic materials and devices. Copyright © 2017 Lovley.

  2. Self-similar and fractal design for stretchable electronics

    DOEpatents

    Rogers, John A.; Fan, Jonathan; Yeo, Woon-Hong; Su, Yewang; Huang, Yonggang; Zhang, Yihui

    2017-04-04

    The present invention provides electronic circuits, devices and device components including one or more stretchable components, such as stretchable electrical interconnects, electrodes and/or semiconductor components. Stretchability of some of the present systems is achieved via a materials level integration of stretchable metallic or semiconducting structures with soft, elastomeric materials in a configuration allowing for elastic deformations to occur in a repeatable and well-defined way. The stretchable device geometries and hard-soft materials integration approaches of the invention provide a combination of advance electronic function and compliant mechanics supporting a broad range of device applications including sensing, actuation, power storage and communications.

  3. Composition and method for removing photoresist materials from electronic components

    DOEpatents

    Davenhall, Leisa B [Santa Fe, NM; Rubin, James B [Los Alamos, NM; Taylor, Craig M. V. [Jemez Springs, NM

    2008-06-03

    Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

  4. Composition and method for removing photoresist materials from electronic components

    DOEpatents

    Davenhall, Leisa B.; Rubin, James B.; Taylor, Craig M.

    2005-01-25

    Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.

  5. e-Biologics: Fabrication of Sustainable Electronics with “Green” Biological Materials

    PubMed Central

    2017-01-01

    ABSTRACT The growing ubiquity of electronic devices is increasingly consuming substantial energy and rare resources for materials fabrication, as well as creating expansive volumes of toxic waste. This is not sustainable. Electronic biological materials (e-biologics) that are produced with microbes, or designed with microbial components as the guide for synthesis, are a potential green solution. Some e-biologics can be fabricated from renewable feedstocks with relatively low energy inputs, often while avoiding the harsh chemicals used for synthesizing more traditional electronic materials. Several are completely free of toxic components, can be readily recycled, and offer unique features not found in traditional electronic materials in terms of size, performance, and opportunities for diverse functionalization. An appropriate investment in the concerted multidisciplinary collaborative research required to identify and characterize e-biologics and to engineer materials and devices based on e-biologics could be rewarded with a new “green age” of sustainable electronic materials and devices. PMID:28655820

  6. Materials for bioresorbable radio frequency electronics.

    PubMed

    Hwang, Suk-Won; Huang, Xian; Seo, Jung-Hun; Song, Jun-Kyul; Kim, Stanley; Hage-Ali, Sami; Chung, Hyun-Joong; Tao, Hu; Omenetto, Fiorenzo G; Ma, Zhenqiang; Rogers, John A

    2013-07-12

    Materials, device designs and manufacturing approaches are presented for classes of RF electronic components that are capable of complete dissolution in water or biofluids. All individual passive/active components as well as system-level examples such as wireless RF energy harvesting circuits exploit active materials that are biocompatible. The results provide diverse building blocks for physically transient forms of electronics, of particular potential value in bioresorbable medical implants with wireless power transmission and communication capabilities. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  7. Structural optimization of structured carbon-based energy-storing composite materials used in space vehicles.

    PubMed

    Yu, Jia; Yu, Zhichao; Tang, Chenlong

    2016-07-04

    The hot work environment of electronic components in the instrument cabin of spacecraft was researched, and a new thermal protection structure, namely graphite carbon foam, which is an impregnated phase-transition material, was adopted to implement the thermal control on the electronic components. We used the optimized parameters obtained from ANSYS to conduct 2D optimization, 3-D modeling and simulation, as well as the strength check. Finally, the optimization results were verified by experiments. The results showed that after optimization, the structured carbon-based energy-storing composite material could reduce the mass and realize the thermal control over electronic components. This phase-transition composite material still possesses excellent temperature control performance after its repeated melting and solidifying.

  8. Toxicity of electronic waste leachates to Daphnia magna: screening and toxicity identification evaluation of different products, components, and materials.

    PubMed

    Lithner, Delilah; Halling, Maja; Dave, Göran

    2012-05-01

    Electronic waste has become one of the fastest growing waste problems in the world. It contains both toxic metals and toxic organics. The aim of this study was to (1) investigate to what extent toxicants can leach from different electronic products, components, and materials into water and (2) identify which group of toxicants (metals or hydrophobic organics) that is causing toxicity. Components from five discarded electronic products (cell phone, computer, phone modem, keyboard, and computer mouse) were leached in deionised water for 3 days at 23°C in concentrations of 25 g/l for metal components, 50 g/l for mixed-material components, and 100 g/l for plastic components. The water phase was tested for acute toxicity to Daphnia magna. Eighteen of 68 leachates showed toxicity (with immobility of D. magna ≥ 50% after 48 h) and came from metal or mixed-material components. The 8 most toxic leachates, with 48 h EC(50)s ranging from 0.4 to 20 g/l, came from 2 circuit sheets (key board), integrated drive electronics (IDE) cable clips (computer), metal studs (computer), a circuit board (computer mouse), a cord (phone modem), mixed parts (cell phone), and a circuit board (key board). All 5 electronic products were represented among them. Toxicity identification evaluations (with C18 and CM resins filtrations and ethylenediaminetetraacetic acid addition) indicated that metals caused the toxicity in the majority of the most toxic leachates. Overall, this study has shown that electronic waste can leach toxic compounds also during short-term leaching with pure water.

  9. High-performance green semiconductor devices: materials, designs, and fabrication

    NASA Astrophysics Data System (ADS)

    Jung, Yei Hwan; Zhang, Huilong; Gong, Shaoqin; Ma, Zhenqiang

    2017-06-01

    From large industrial computers to non-portable home appliances and finally to light-weight portable gadgets, the rapid evolution of electronics has facilitated our daily pursuits and increased our life comforts. However, these rapid advances have led to a significant decrease in the lifetime of consumer electronics. The serious environmental threat that comes from electronic waste not only involves materials like plastics and heavy metals, but also includes toxic materials like mercury, cadmium, arsenic, and lead, which can leak into the ground and contaminate the water we drink, the food we eat, and the animals that live around us. Furthermore, most electronics are comprised of non-renewable, non-biodegradable, and potentially toxic materials. Difficulties in recycling the increasing amount of electronic waste could eventually lead to permanent environmental pollution. As such, discarded electronics that can naturally degrade over time would reduce recycling challenges and minimize their threat to the environment. This review provides a snapshot of the current developments and challenges of green electronics at the semiconductor device level. It looks at the developments that have been made in an effort to help reduce the accumulation of electronic waste by utilizing unconventional, biodegradable materials as components. While many semiconductors are classified as non-biodegradable, a few biodegradable semiconducting materials exist and are used as electrical components. This review begins with a discussion of biodegradable materials for electronics, followed by designs and processes for the manufacturing of green electronics using different techniques and designs. In the later sections of the review, various examples of biodegradable electrical components, such as sensors, circuits, and batteries, that together can form a functional electronic device, are discussed and new applications using green electronics are reviewed.

  10. NASA Tech Briefs, July 1997. Volume 21, No. 7

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics: Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Life Sciences.

  11. Disassembly properties and material characterisation of household small waste electric and electronic equipment.

    PubMed

    Bovea, María D; Pérez-Belis, Victoria; Ibáñez-Forés, Valeria; Quemades-Beltrán, Pilar

    2016-07-01

    This paper is focused on characterising small waste electric and electronic equipment, specifically small household appliances, from two different points of views: disassembly properties and material identification. The sample for this characterisation was obtained from a selective collection campaign organised in Castellón de la Plana (Spain). A total amount of 833.7kg (749 units) of small waste electric and electronic equipment was collected, of which 23.3% by weight and 22.4% by units belonged to the subcategory household equipment. This subcategory, composed of appliances such as vacuum cleaners, toasters, sandwich makers, hand blenders, juicers, coffee makers, hairdryers, scales, irons and heaters, was first disassembled in order to analyse different aspects of the disassembly process for each equipment type: type of joints, ease of identification of materials, ease of access to joints for extracting components, ease of separation of components from the whole, uniformity of tools needed for the disassembly process and possibility of reassembly after disassembly. Results show that the most common joints used in these equipment types are snap-fits and screws, although some permanent joints have also been identified. Next, the material composition of each component of each appliance belonging to each equipment type was identified visually and with additional mechanical trials and testing. It can be observed that plastic and electric/electronic components are present in all the equipment types analysed and are also the material fractions that appear with higher percentages in the material composition: 41.1wt% and 39.1wt% for the plastic fraction and electric/electronic components, respectively. The most common plastics are: polypropylene (PP), acrylonitrile butadiene styrene (ABS) and polycarbonate (PC), while the most common electric/electronic components are: cable, plug and printed circuit boards. Results also show that disassembly properties and material characterisation vary widely from one equipment type to another. Copyright © 2016 Elsevier Ltd. All rights reserved.

  12. Phase-separated, epitaxial composite cap layers for electronic device applications and method of making the same

    DOEpatents

    Aytug, Tolga [Knoxville, TN; Paranthaman, Mariappan Parans [Knoxville, TN; Polat, Ozgur [Knoxville, TN

    2012-07-17

    An electronic component that includes a substrate and a phase-separated layer supported on the substrate and a method of forming the same are disclosed. The phase-separated layer includes a first phase comprising lanthanum manganate (LMO) and a second phase selected from a metal oxide (MO), metal nitride (MN), a metal (Me), and combinations thereof. The phase-separated material can be an epitaxial layer and an upper surface of the phase-separated layer can include interfaces between the first phase and the second phase. The phase-separated layer can be supported on a buffer layer comprising a composition selected from the group consisting of IBAD MgO, LMO/IBAD-MgO, homoepi-IBAD MgO and LMO/homoepi-MgO. The electronic component can also include an electronically active layer supported on the phase-separated layer. The electronically active layer can be a superconducting material, a ferroelectric material, a multiferroic material, a magnetic material, a photovoltaic material, an electrical storage material, and a semiconductor material.

  13. Evaluation of runaway-electron effects on plasma-facing components for NET

    NASA Astrophysics Data System (ADS)

    Bolt, H.; Calén, H.

    1991-03-01

    Runaway electrons which are generated during disruptions can cause serious damage to plasma facing components in a next generation device like NET. A study was performed to quantify the response of NET plasma facing components to runaway-electron impact. For the determination of the energy deposition in the component materials Monte Carlo computations were performed. Since the subsurface metal structures can be strongly heated under runaway-electron impact from the computed results damage threshold values for the thermal excursions were derived. These damage thresholds are strongly dependent on the materials selection and the component design. For a carbonmolybdenum divertor with 10 and 20 mm carbon armour thickness and 1 degree electron incidence the damage thresholds are 100 MJ/m 2 and 220 MJ/m 2. The thresholds for a carbon-copper divertor under the same conditions are about 50% lower. On the first wall damage is anticipated for energy depositions above 180 MJ/m 2.

  14. NASA Tech Briefs, August 1997. Volume 21, No. 8

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics:Graphics and Simulation; Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

  15. NASA Tech Briefs, July 1996. Volume 20, No. 7

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics covered include: Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  16. NASA Tech Briefs, October 1997. Volume 21, No. 10

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics covered include: Sensors/Imaging; Mechanical Components; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  17. Wide Bandgap Technology Enhances Performance of Electric-Drive Vehicles |

    Science.gov Websites

    , WBG materials/devices enable lighter, more compact, and more efficient power electronics for vehicles, and increased electric vehicle adoption by consumers. Wide bandgap power electronics devices power electronics component size and potentially reduce system or component-level cost, while improving

  18. Conformable wearable systems comprising organic electronics on foil for well being and healthcare (presentation video)

    NASA Astrophysics Data System (ADS)

    de Kok, Margreet M.

    2014-10-01

    Integration of electronics into materials and objects that have not been functionalized with electronics before, open up extensive possibilities to support mankind. By adding intelligence and/or operating power to materials in close skin contact like clothing, furniture or bandages the health of people can be monitored or even improved. Foil based electronics are interesting components to be integrated as they are thin, large area and cost effective available components Our developed technology of printed electronic structures to which components are reliably bonded, fulfills the promise. We have integrated these components into textiles and built wearable encapsulated products with foil based electronics. Foil components with organic and inorganic LEDs are interconnected and laminated onto electronic textiles by using conductive adhesives to bond the contact pads of the component to conductive yarns in the textile. Modelling and reliability testing under dynamic circumstances provided important insights in order to optimise the technology. The design of the interconnection and choice of conductive adhesive / underfill and lamination contributed to the durability of the system. Transition zones from laminated foil to textile are engineered to withstand dynamic use. As an example of a product, we have realized an electronic wristband that is encapsulated in rubber and has a number of sensor functionalities integrated on stretchable electronic circuits based on Cu and Ag. The encapsulation with silicone or polyurethanes was performed such, that charging and sensor/skin contacts are possible while simultaneously protecting the electronics from mechanical and environmental stresses.

  19. Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

    PubMed Central

    Maxa, Jacob; Novikov, Andrej; Nowottnick, Mathias

    2017-01-01

    Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

  20. NASA Tech Briefs, July 1995. Volume 19, No. 7

    NASA Technical Reports Server (NTRS)

    1995-01-01

    Topics include: mechanical components, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section of Federal laboratory computing Tech Briefs.

  1. Comparison of electron beam and laser beam powder bed fusion additive manufacturing process for high temperature turbine component materials

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Dryepondt, Sebastien N; Pint, Bruce A; Ryan, Daniel

    2016-04-01

    The evolving 3D printer technology is now at the point where some turbine components could be additive manufactured (AM) for both development and production purposes. However, this will require a significant evaluation program to qualify the process and components to meet current design and quality standards. The goal of the project was to begin characterization of the microstructure and mechanical properties of Nickel Alloy X (Ni-22Cr-18Fe-9Mo) test bars fabricated by powder bed fusion (PBF) AM processes that use either an electron beam (EB) or laser beam (LB) power source. The AM materials produced with the EB and LB processes displayedmore » significant differences in microstructure and resultant mechanical properties. Accordingly, during the design analysis of AM turbine components, the specific mechanical behavior of the material produced with the selected AM process should be considered. Comparison of the mechanical properties of both the EB and LB materials to those of conventionally processed Nickel Alloy X materials indicates the subject AM materials are viable alternatives for manufacture of some turbine components.« less

  2. Materials Characterization of Additively Manufactured Components for Rocket Propulsion

    NASA Technical Reports Server (NTRS)

    Carter, Robert; Draper, Susan; Locci, Ivan; Lerch, Bradley; Ellis, David; Senick, Paul; Meyer, Michael; Free, James; Cooper, Ken; Jones, Zachary

    2015-01-01

    To advance Additive Manufacturing (AM) technologies for production of rocket propulsion components the NASA Glenn Research Center (GRC) is applying state of the art characterization techniques to interrogate microstructure and mechanical properties of AM materials and components at various steps in their processing. The materials being investigated for upper stage rocket engines include titanium, copper, and nickel alloys. Additive manufacturing processes include laser powder bed, electron beam powder bed, and electron beam wire fed processes. Various post build thermal treatments, including Hot Isostatic Pressure (HIP), have been studied to understand their influence on microstructure, mechanical properties, and build density. Micro-computed tomography, electron microscopy, and mechanical testing in relevant temperature environments has been performed to develop relationships between build quality, microstructure, and mechanical performance at temperature. A summary of GRC's Additive Manufacturing roles and experimental findings will be presented.

  3. Material Characterization of Additively Manufactured Components for Rocket Propulsion

    NASA Technical Reports Server (NTRS)

    Carter, Robert; Draper, Susan; Locci, Ivan; Lerch, Bradley; Ellis, David; Senick, Paul; Meyer, Michael; Free, James; Cooper, Ken; Jones, Zachary

    2015-01-01

    To advance Additive Manufacturing (AM) technologies for production of rocket propulsion components the NASA Glenn Research Center (GRC) is applying state of the art characterization techniques to interrogate microstructure and mechanical properties of AM materials and components at various steps in their processing. The materials being investigated for upper stage rocket engines include titanium, copper, and nickel alloys. Additive manufacturing processes include laser powder bed, electron beam powder bed, and electron beam wire fed processes. Various post build thermal treatments, including Hot Isostatic Pressure (HIP), have been studied to understand their influence on microstructure, mechanical properties, and build density. Micro-computed tomography, electron microscopy, and mechanical testing in relevant temperature environments has been performed to develop relationships between build quality, microstructure, and mechanical performance at temperature. A summary of GRCs Additive Manufacturing roles and experimental findings will be presented.

  4. Radiation and temperature effects on electronic components investigated under the CSTI high capacity power project

    NASA Technical Reports Server (NTRS)

    Schwarze, Gene E.; Niedra, Janis M.; Frasca, Albert J.; Wieserman, William R.

    1993-01-01

    The effects of nuclear radiation and high temperature environments must be fully known and understood for the electronic components and materials used in both the Power Conditioning and Control subsystem and the reactor Instrumentation and Control subsystem of future high capacity nuclear space power systems. This knowledge is required by the designer of these subsystems in order to develop highly reliable, long-life power systems for future NASA missions. A review and summary of the experimental results obtained for the electronic components and materials investigated under the power management element of the Civilian Space Technology Initiative (CSTI) high capacity power project are presented: (1) neutron, gamma ray, and temperature effects on power semiconductor switches, (2) temperature and frequency effects on soft magnetic materials; and (3) temperature effects on rare earth permanent magnets.

  5. Nanocomposites with high thermoelectric figures of merit

    NASA Technical Reports Server (NTRS)

    Dresselhaus, Mildred (Inventor); Ren, Zhifeng (Inventor); Chen, Gang (Inventor)

    2008-01-01

    The present invention is generally directed to nanocomposite thermoelectric materials that exhibit enhanced thermoelectric properties. The nanocomposite materials include two or more components, with at least one of the components forming nano-sized structures within the composite material. The components are chosen such that thermal conductivity of the composite is decreased without substantially diminishing the composite's electrical conductivity. Suitable component materials exhibit similar electronic band structures. For example, a band-edge gap between at least one of a conduction band or a valence band of one component material and a corresponding band of the other component material at interfaces between the components can be less than about 5k.sub.BT, wherein k.sub.B is the Boltzman constant and T is an average temperature of said nanocomposite composition.

  6. Nanocomposites with High Thermoelectric Figures of Merit

    NASA Technical Reports Server (NTRS)

    Chen, Gang (Inventor); Ren, Zhifeng (Inventor); Dresselhaus, Mildred (Inventor)

    2015-01-01

    The present invention is generally directed to nanocomposite thermoelectric materials that exhibit enhanced thermoelectric properties. The nanocomposite materials include two or more components, with at least one of the components forming nano-sized structures within the composite material. The components are chosen such that thermal conductivity of the composite is decreased without substantially diminishing the composite's electrical conductivity. Suitable component materials exhibit similar electronic band structures. For example, a band-edge gap between at least one of a conduction band or a valence band of one component material and a corresponding band of the other component material at interfaces between the components can be less than about 5k(sub B)T, wherein k(sub B) is the Boltzman constant and T is an average temperature of said nanocomposite composition.

  7. Nanocomposites with high thermoelectric figures of merit

    NASA Technical Reports Server (NTRS)

    Ren, Zhifeng (Inventor); Chen, Gang (Inventor); Dresselhaus, Mildred (Inventor)

    2012-01-01

    The present invention is generally directed to nanocomposite thermoelectric materials that exhibit enhanced thermoelectric properties. The nanocomposite materials include two or more components, with at least one of the components forming nano-sized structures within the composite material. The components are chosen such that thermal conductivity of the composite is decreased without substantially diminishing the composite's electrical conductivity. Suitable component materials exhibit similar electronic band structures. For example, a band-edge gap between at least one of a conduction band or a valence band of one component material and a corresponding band of the other component material at interfaces between the components can be less than about 5k.sub.BT, wherein k.sub.B is the Boltzman constant and T is an average temperature of said nanocomposite composition.

  8. Material for electrodes of low temperature plasma generators

    DOEpatents

    Caplan, Malcolm; Vinogradov, Sergel Evge'evich; Ribin, Valeri Vasil'evich; Shekalov, Valentin Ivanovich; Rutberg, Philip Grigor'evich; Safronov, Alexi Anatol'evich

    2008-12-09

    Material for electrodes of low temperature plasma generators. The material contains a porous metal matrix impregnated with a material emitting electrons. The material uses a mixture of copper and iron powders as a porous metal matrix and a Group IIIB metal component such as Y.sub.2O.sub.3 is used as a material emitting electrons at, for example, the proportion of the components, mass %: iron: 3-30; Y.sub.2O.sub.3:0.05-1; copper: the remainder. Copper provides a high level of heat conduction and electric conductance, iron decreases intensity of copper evaporation in the process of plasma creation providing increased strength and lifetime, Y.sub.2O.sub.3 provides decreasing of electronic work function and stability of arc burning. The material can be used for producing the electrodes of low temperature AC plasma generators used for destruction of liquid organic wastes, medical wastes, and municipal wastes as well as for decontamination of low level radioactive waste, the destruction of chemical weapons, warfare toxic agents, etc.

  9. Material for electrodes of low temperature plasma generators

    DOEpatents

    Caplan, Malcolm; Vinogradov, Sergel Evge'evich; Ribin, Valeri Vasil'evich; Shekalov, Valentin Ivanovich; Rutberg, Philip Grigor'evich; Safronov, Alexi Anatol'evich; Shiryaev, Vasili Nikolaevich

    2010-03-02

    Material for electrodes of low temperature plasma generators. The material contains a porous metal matrix impregnated with a material emitting electrons. The material uses a mixture of copper and iron powders as a porous metal matrix and a Group IIIB metal component such as Y.sub.2O.sub.3 is used as a material emitting electrons at, for example, the proportion of the components, mass %: iron:3-30; Y.sub.2O.sub.3:0.05-1; copper: the remainder. Copper provides a high level of heat conduction and electric conductance, iron decreases intensity of copper evaporation in the process of plasma creation providing increased strength and lifetime, Y.sub.2O.sub.3 provides decreasing of electronic work function and stability of arc burning. The material can be used for producing the electrodes of low temperature AC plasma generators used for destruction of liquid organic wastes, medical wastes, municipal wastes as well as for decontamination of low level radioactive waste, the destruction of chemical weapons, warfare toxic agents, etc.

  10. Future Technology-Driven Revolutions in Military Operations. Results of a Workshop

    DTIC Science & Technology

    1994-01-01

    sensor missions. "• Biomolecular Electronics - The use of techniques from molecular biology and biotechnology to develop new molecular electronic materials...34* Biomolecular electronics - The use of techniques from molecular biology and biotechnology to develop new molecular electronic materials, components, and...occurring in molecular biology . 42 Biotechnology Molecular Biologists Arm Develoni "Magical" Caoabilitles "• To mynthsieh genm (frm satch) with conboi

  11. Advanced Power Electronics Components

    NASA Technical Reports Server (NTRS)

    Schwarze, Gene E.

    2004-01-01

    This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

  12. Assembling surface mounted components on ink-jet printed double sided paper circuit board.

    PubMed

    Andersson, Henrik A; Manuilskiy, Anatoliy; Haller, Stefan; Hummelgård, Magnus; Sidén, Johan; Hummelgård, Christine; Olin, Håkan; Nilsson, Hans-Erik

    2014-03-07

    Printed electronics is a rapidly developing field where many components can already be manufactured on flexible substrates by printing or by other high speed manufacturing methods. However, the functionality of even the most inexpensive microcontroller or other integrated circuit is, at the present time and for the foreseeable future, out of reach by means of fully printed components. Therefore, it is of interest to investigate hybrid printed electronics, where regular electrical components are mounted on flexible substrates to achieve high functionality at a low cost. Moreover, the use of paper as a substrate for printed electronics is of growing interest because it is an environmentally friendly and renewable material and is, additionally, the main material used for many packages in which electronics functionalities could be integrated. One of the challenges for such hybrid printed electronics is the mounting of the components and the interconnection between layers on flexible substrates with printed conductive tracks that should provide as low a resistance as possible while still being able to be used in a high speed manufacturing process. In this article, several conductive adhesives are evaluated as well as soldering for mounting surface mounted components on a paper circuit board with ink-jet printed tracks and, in addition, a double sided Arduino compatible circuit board is manufactured and programmed.

  13. Textile-Based Electronic Components for Energy Applications: Principles, Problems, and Perspective

    PubMed Central

    Kaushik, Vishakha; Lee, Jaehong; Hong, Juree; Lee, Seulah; Lee, Sanggeun; Seo, Jungmok; Mahata, Chandreswar; Lee, Taeyoon

    2015-01-01

    Textile-based electronic components have gained interest in the fields of science and technology. Recent developments in nanotechnology have enabled the integration of electronic components into textiles while retaining desirable characteristics such as flexibility, strength, and conductivity. Various materials were investigated in detail to obtain current conductive textile technology, and the integration of electronic components into these textiles shows great promise for common everyday applications. The harvest and storage of energy in textile electronics is a challenge that requires further attention in order to enable complete adoption of this technology in practical implementations. This review focuses on the various conductive textiles, their methods of preparation, and textile-based electronic components. We also focus on fabrication and the function of textile-based energy harvesting and storage devices, discuss their fundamental limitations, and suggest new areas of study. PMID:28347078

  14. Textile-Based Electronic Components for Energy Applications: Principles, Problems, and Perspective.

    PubMed

    Kaushik, Vishakha; Lee, Jaehong; Hong, Juree; Lee, Seulah; Lee, Sanggeun; Seo, Jungmok; Mahata, Chandreswar; Lee, Taeyoon

    2015-09-07

    Textile-based electronic components have gained interest in the fields of science and technology. Recent developments in nanotechnology have enabled the integration of electronic components into textiles while retaining desirable characteristics such as flexibility, strength, and conductivity. Various materials were investigated in detail to obtain current conductive textile technology, and the integration of electronic components into these textiles shows great promise for common everyday applications. The harvest and storage of energy in textile electronics is a challenge that requires further attention in order to enable complete adoption of this technology in practical implementations. This review focuses on the various conductive textiles, their methods of preparation, and textile-based electronic components. We also focus on fabrication and the function of textile-based energy harvesting and storage devices, discuss their fundamental limitations, and suggest new areas of study.

  15. VESL: Vocational English as a Second Language. Focus: Electronics.

    ERIC Educational Resources Information Center

    Scales, Virginia

    These instructional materials are designed to help non-English speaking students in electronics classes to improve their knowledge of English. Covered in the six units are the following topics: safety, hand tools, measuring electricity, component identification, component function, and basic soldering. The lessons include readings, vocabulary…

  16. Advanced Electrical Materials and Components Being Developed

    NASA Technical Reports Server (NTRS)

    Schwarze, Gene E.

    2004-01-01

    All aerospace systems require power management and distribution (PMAD) between the energy and power source and the loads. The PMAD subsystem can be broadly described as the conditioning and control of unregulated power from the energy source and its transmission to a power bus for distribution to the intended loads. All power and control circuits for PMAD require electrical components for switching, energy storage, voltage-to-current transformation, filtering, regulation, protection, and isolation. Advanced electrical materials and component development technology is a key technology to increasing the power density, efficiency, reliability, and operating temperature of the PMAD. The primary means to develop advanced electrical components is to develop new and/or significantly improved electronic materials for capacitors, magnetic components, and semiconductor switches and diodes. The next important step is to develop the processing techniques to fabricate electrical and electronic components that exceed the specifications of presently available state-of-the-art components. The NASA Glenn Research Center's advanced electrical materials and component development technology task is focused on the following three areas: 1) New and/or improved dielectric materials for the development of power capacitors with increased capacitance volumetric efficiency, energy density, and operating temperature; 2) New and/or improved high-frequency, high-temperature soft magnetic materials for the development of transformers and inductors with increased power density, energy density, electrical efficiency, and operating temperature; 3) Packaged high-temperature, high-power density, high-voltage, and low-loss SiC diodes and switches.

  17. NASA Tech Briefs, December 1991. Volume 15, No. 12

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences,

  18. NASA Tech Briefs, December 2002

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics covered include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; and Life Sciences.

  19. 48 CFR 252.225-7012 - Preference for certain domestic commodities.

    Code of Federal Regulations, 2010 CFR

    2010-10-01

    ... States: (1) Food. (2) Clothing and the materials and components thereof, other than sensors, electronics, or other items added to, and not normally associated with, clothing and the materials and components thereof. Clothing includes items such as outerwear, headwear, underwear, nightwear, footwear, hosiery...

  20. 48 CFR 252.225-7012 - Preference for certain domestic commodities.

    Code of Federal Regulations, 2011 CFR

    2011-10-01

    ... States: (1) Food. (2) Clothing and the materials and components thereof, other than sensors, electronics, or other items added to, and not normally associated with, clothing and the materials and components thereof. Clothing includes items such as outerwear, headwear, underwear, nightwear, footwear, hosiery...

  1. 48 CFR 252.225-7012 - Preference for certain domestic commodities.

    Code of Federal Regulations, 2012 CFR

    2012-10-01

    ... United States: (1) Food. (2) Clothing and the materials and components thereof, other than sensors, electronics, or other items added to, and not normally associated with, clothing and the materials and components thereof. Clothing includes items such as outerwear, headwear, underwear, nightwear, footwear...

  2. High-performance green flexible electronics based on biodegradable cellulose nanofibril paper

    PubMed Central

    Jung, Yei Hwan; Chang, Tzu-Hsuan; Zhang, Huilong; Yao, Chunhua; Zheng, Qifeng; Yang, Vina W.; Mi, Hongyi; Kim, Munho; Cho, Sang June; Park, Dong-Wook; Jiang, Hao; Lee, Juhwan; Qiu, Yijie; Zhou, Weidong; Cai, Zhiyong; Gong, Shaoqin; Ma, Zhenqiang

    2015-01-01

    Today's consumer electronics, such as cell phones, tablets and other portable electronic devices, are typically made of non-renewable, non-biodegradable, and sometimes potentially toxic (for example, gallium arsenide) materials. These consumer electronics are frequently upgraded or discarded, leading to serious environmental contamination. Thus, electronic systems consisting of renewable and biodegradable materials and minimal amount of potentially toxic materials are desirable. Here we report high-performance flexible microwave and digital electronics that consume the smallest amount of potentially toxic materials on biobased, biodegradable and flexible cellulose nanofibril papers. Furthermore, we demonstrate gallium arsenide microwave devices, the consumer wireless workhorse, in a transferrable thin-film form. Successful fabrication of key electrical components on the flexible cellulose nanofibril paper with comparable performance to their rigid counterparts and clear demonstration of fungal biodegradation of the cellulose-nanofibril-based electronics suggest that it is feasible to fabricate high-performance flexible electronics using ecofriendly materials. PMID:26006731

  3. High-performance green flexible electronics based on biodegradable cellulose nanofibril paper.

    PubMed

    Jung, Yei Hwan; Chang, Tzu-Hsuan; Zhang, Huilong; Yao, Chunhua; Zheng, Qifeng; Yang, Vina W; Mi, Hongyi; Kim, Munho; Cho, Sang June; Park, Dong-Wook; Jiang, Hao; Lee, Juhwan; Qiu, Yijie; Zhou, Weidong; Cai, Zhiyong; Gong, Shaoqin; Ma, Zhenqiang

    2015-05-26

    Today's consumer electronics, such as cell phones, tablets and other portable electronic devices, are typically made of non-renewable, non-biodegradable, and sometimes potentially toxic (for example, gallium arsenide) materials. These consumer electronics are frequently upgraded or discarded, leading to serious environmental contamination. Thus, electronic systems consisting of renewable and biodegradable materials and minimal amount of potentially toxic materials are desirable. Here we report high-performance flexible microwave and digital electronics that consume the smallest amount of potentially toxic materials on biobased, biodegradable and flexible cellulose nanofibril papers. Furthermore, we demonstrate gallium arsenide microwave devices, the consumer wireless workhorse, in a transferrable thin-film form. Successful fabrication of key electrical components on the flexible cellulose nanofibril paper with comparable performance to their rigid counterparts and clear demonstration of fungal biodegradation of the cellulose-nanofibril-based electronics suggest that it is feasible to fabricate high-performance flexible electronics using ecofriendly materials.

  4. High-performance green flexible electronics based on biodegradable cellulose nanofibril paper

    NASA Astrophysics Data System (ADS)

    Jung, Yei Hwan; Chang, Tzu-Hsuan; Zhang, Huilong; Yao, Chunhua; Zheng, Qifeng; Yang, Vina W.; Mi, Hongyi; Kim, Munho; Cho, Sang June; Park, Dong-Wook; Jiang, Hao; Lee, Juhwan; Qiu, Yijie; Zhou, Weidong; Cai, Zhiyong; Gong, Shaoqin; Ma, Zhenqiang

    2015-05-01

    Today's consumer electronics, such as cell phones, tablets and other portable electronic devices, are typically made of non-renewable, non-biodegradable, and sometimes potentially toxic (for example, gallium arsenide) materials. These consumer electronics are frequently upgraded or discarded, leading to serious environmental contamination. Thus, electronic systems consisting of renewable and biodegradable materials and minimal amount of potentially toxic materials are desirable. Here we report high-performance flexible microwave and digital electronics that consume the smallest amount of potentially toxic materials on biobased, biodegradable and flexible cellulose nanofibril papers. Furthermore, we demonstrate gallium arsenide microwave devices, the consumer wireless workhorse, in a transferrable thin-film form. Successful fabrication of key electrical components on the flexible cellulose nanofibril paper with comparable performance to their rigid counterparts and clear demonstration of fungal biodegradation of the cellulose-nanofibril-based electronics suggest that it is feasible to fabricate high-performance flexible electronics using ecofriendly materials.

  5. NASA Tech Briefs, November 1991. Volume 15, No. 11

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics include: Electronic Components & and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, and Mathematics and Information Sciences,

  6. NASA Tech Briefs, November 1997. Volume 21, No. 11

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics covered include: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Books and Reports..

  7. NASA Tech Briefs, August 1992. Volume 16, No. 8

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  8. NASA Tech Briefs, September 1992. Volume 16, No.9

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  9. NASA Tech Briefs, Summer 1985

    NASA Technical Reports Server (NTRS)

    1985-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  10. NASA Tech Briefs, January 1993. Volume 17, No. 1

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences;

  11. NASA Tech Briefs, November 1992. Volume 16, No. 11

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences;

  12. NASA Tech Briefs, December 1992. Volume 16, No. 12

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences;

  13. NASA Tech Briefs, Spring 1985

    NASA Technical Reports Server (NTRS)

    1985-01-01

    Topic include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  14. Electronic Publishing. Technology Learning Activity. Teacher Edition. Technology Education Series.

    ERIC Educational Resources Information Center

    Oklahoma State Dept. of Vocational and Technical Education, Stillwater. Curriculum and Instructional Materials Center.

    This packet of technology learning activity (TLA) materials on electronic publishing for students in grades 6-10 consists of a technology education overview, information on use, and the instructor's and student's sections. The overview discusses the technology education program and materials. Components of the instructor and student sections are…

  15. NASA Tech Briefs, May 2000. Volume 24, No. 5

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics include: Sensors: Test and Measurement; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Composites and Plastics; Materials; Computer Programs; Mechanics;

  16. NASA Tech Briefs, June 2000. Volume 24, No. 6

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Test and Measurement; Physical Sciences; Materials; Computer Programs; Computers and Peripherals;

  17. NASA Tech Briefs, October 1989. Volume 13, No. 10

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  18. NASA Tech Briefs, February 1990. Volume 14, No. 2

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  19. NASA Tech Briefs, January 1990. Volume 14, No. 1

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  20. NASA Tech Briefs, November 1989. Volume 13, No. 11

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  1. NASA Tech Briefs, September 1989. Volume 13, No. 9

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences.

  2. NASA Tech Briefs, October 1992. Volume 16, No. 10

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics covered include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication technology; Mathematics and Information Sciences; Life Sciences.

  3. NASA Tech Briefs, December 1989. Volume 13, No. 12

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences.

  4. NASA Tech Briefs, April 1993. Volume 17, No. 4

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Optoelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences;

  5. NASA Tech Briefs, March 1990. Volume 14, No. 3

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  6. Hybrid 3D Printing of Soft Electronics.

    PubMed

    Valentine, Alexander D; Busbee, Travis A; Boley, John William; Raney, Jordan R; Chortos, Alex; Kotikian, Arda; Berrigan, John Daniel; Durstock, Michael F; Lewis, Jennifer A

    2017-10-01

    Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  7. Radiation studies of optical and electronic components used in astronomical satellite studies

    NASA Technical Reports Server (NTRS)

    Becher, J.; Kernell, R. L.

    1981-01-01

    The synchronous orbit of the IUE carries the satellite through Earth's outer electron belt. A 40 mCi Sr90 source was used to simulate these electrons. A 5 mCi source of Co60 was used to simulate bremmstrahlung. A 10 MeV electron Linac and a 1.7 MeV electron Van de Graaf wer used to investigate the energy dependence of radiation effects and to perform radiations at a high flux rate. A 100 MeV proton cyclotron was used to simulate cosmic rays. Results are presented for three instrument systems of the IUE and measurements for specific components are reported. The three instrument systems were the ultraviolet converter, the fine error sensor (FES), and the SEC vidicon camera tube. The components were optical glasses, electronic components, silicon photodiodes, and UV window materials.

  8. Radio-frequency flexible and stretchable electronics: the need, challenges and opportunities

    NASA Astrophysics Data System (ADS)

    Jung, Yei Hwan; Seo, Jung-Hun; Zhang, Huilong; Lee, Juhwan; Cho, Sang June; Chang, Tzu-Hsuan; Ma, Zhenqiang

    2017-05-01

    Successful integration of ultrathin flexible or stretchable systems with new applications, such as medical devices and biodegradable electronics, have intrigued many researchers and industries around the globe to seek materials and processes to create high-performance, non-invasive and cost-effective electronics to match those of state-of-the-art devices. Nevertheless, the crucial concept of transmitting data or power wirelessly for such unconventional devices has been difficult to realize due to limitations of radio-frequency (RF) electronics in individual components that form a wireless circuitry, such as antenna, transmission line, active devices, passive devices etc. To overcome such challenges, these components must be developed in a step-by-step manner, as each component faces a number of different challenges in ultrathin formats. Here, we report on materials and design considerations for fabricating flexible and stretchable electronics systems that operate in the microwave level. High-speed flexible active devices, including cost effective Si-based strained MOSFETs, GaAs-based HBTs and GaN-based HEMTs, performing at multi-gigahertz frequencies are presented. Furthermore, flexible or stretchable passive devices, including capacitors, inductors and transmission lines that are vital parts of a microwave circuitry are also demonstrated. We also present unique applications using the presented flexible or stretchable RF components, including wearable RF electronics and biodegradable RF electronics, which were impossible to achieve using conventional rigid, wafer-based technology. Further opportunities like implantable systems exist utilizing such ultrathin RF components, which are discussed in this report as well.

  9. Geant4 calculations for space radiation shielding material Al2O3

    NASA Astrophysics Data System (ADS)

    Capali, Veli; Acar Yesil, Tolga; Kaya, Gokhan; Kaplan, Abdullah; Yavuz, Mustafa; Tilki, Tahir

    2015-07-01

    Aluminium Oxide, Al2O3 is the most widely used material in the engineering applications. It is significant aluminium metal, because of its hardness and as a refractory material owing to its high melting point. This material has several engineering applications in diverse fields such as, ballistic armour systems, wear components, electrical and electronic substrates, automotive parts, components for electric industry and aero-engine. As well, it is used as a dosimeter for radiation protection and therapy applications for its optically stimulated luminescence properties. In this study, stopping powers and penetrating distances have been calculated for the alpha, proton, electron and gamma particles in space radiation shielding material Al2O3 for incident energies 1 keV - 1 GeV using GEANT4 calculation code.

  10. NASA Tech Briefs, January 1989. Volume 13, No. 1

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include: Electronic Components & and Circuits. Electronic Systems, A Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences.

  11. NASA Tech Briefs, July 1999. Volume 23, No. 7

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Bio-Medical; Books and Reports; Semiconductors/ICs.

  12. NASA Tech Briefs, June 1993. Volume 17, No. 6

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Imaging Technology: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  13. NASA Tech Briefs, January 1998. Volume 22, No. 1

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics: Sensors/Data Acquisition; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Life Sciences; Books and Reports.

  14. NASA Tech Briefs, November 1993. Volume 17, No. 11

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics covered: Advanced Manufacturing; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  15. NASA Tech Briefs, January 1997. Volume 21, No. 1

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

  16. NASA Tech Briefs, February 1993. Volume 17, No. 2

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Communication Technology; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  17. NASA Tech Briefs, April 1992. Volume 16, No. 4

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics covered include: New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  18. NASA Tech Briefs, January 1992. Volume 16, No. 1

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Fabrication; Mathematics and Information Sciences; Life Sciences;

  19. NASA Tech Briefs, December 1997. Volume 21, No. 12

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics: Design and Analysis Software; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

  20. NASA Tech Briefs, May 1992. Volume 16, No. 5

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  1. NASA Tech Briefs, May 1988. Volume 12, No. 5

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics : New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics ; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  2. NASA Tech Briefs, July 1992. Volume 16, No. 7

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  3. NASA Tech Briefs, November 1990. Volume 14, No. 11

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  4. NASA Tech Briefs, March 1992. Volume 16, No. 3

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics include: New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  5. NASA Tech Briefs, April 1990. Volume 14, No. 4

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  6. NASA Tech Briefs, September 1994. Volume 18, No. 9

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  7. NASA Tech Briefs, September 1997. Volume 21, No. 9

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics include: Data Acquisition and Analysis; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Software; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences.

  8. In-situ formation of multiphase electron beam physical vapor deposited barrier coatings for turbine components

    DOEpatents

    Subramanian, Ramesh

    2001-01-01

    A turbine component (10), such as a turbine blade, is provided which is made of a metal alloy (22) and a base columnar thermal barrier coating (20) on the alloy surface, where a heat resistant ceramic oxide sheath material (32' or 34') covers the columns (28), and the sheath material is the reaction product of a precursor ceramic oxide sheath material and the base thermal barrier coating material.

  9. NASA Tech Briefs, September 1998. Volume 22, No. 9

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage on data acquisition, also, electronic components and circuits, electronic systems, software, materials, mechanics, machinery/automation, physical sciences, information sciences, This issue contains a special sections of Electronics Tech Briefs and Motion Control Tech Briefs.

  10. NASA Tech Briefs, June 1988. Volume 12, No. 6

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics covered: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  11. LASER Tech Briefs, Winter 1994. Volume 2, No. 1

    NASA Technical Reports Server (NTRS)

    Schnirring, Bill (Editor)

    1994-01-01

    Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, Life Sciences, and Books and reports

  12. NASA Tech Briefs, May 1993. Volume 17, No. 5

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Advanced Composites and Plastics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  13. LASER Tech Briefs, February 1995. Volume 3, No. 1

    NASA Technical Reports Server (NTRS)

    1995-01-01

    Topics included in this issue of LASER Tech Briefs are: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Mechanics, Fabrication, and Mathematics and Information Sciences, and

  14. NASA Tech Briefs, February 1992. Volume 16, No. 2

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics covered include: New Product Development; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  15. NASA Tech Briefs, Fall 1985. Volume 9, No. 3

    NASA Technical Reports Server (NTRS)

    1985-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  16. NASA Tech Briefs, September 2000. Volume 24, No. 9

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics include: Sensors; Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Bio-Medical; semiconductors/ICs; Books and Reports.

  17. NASA Tech Briefs, July 1993. Volume 17, No. 7

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Data Acquisition and Analysis: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  18. NASA Tech Briefs, June 1992. Volume 16, No. 6

    NASA Technical Reports Server (NTRS)

    1992-01-01

    Topics covered include: New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  19. NASA Tech Briefs, December 1994. Volume 18, No. 12

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  20. NASA Tech Briefs, January 1995. Volume 19, No. 1

    NASA Technical Reports Server (NTRS)

    1995-01-01

    Topics include: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports

  1. NASA Tech Briefs, April 1988. Volume 12, No. 4

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  2. NASA Tech Briefs, June 1996. Volume 20, No. 6

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics: New Computer Hardware; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences;Books and Reports.

  3. NASA Tech Briefs, July 1989. Volume 13, No. 7

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials;;Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  4. NASA-DoD Lead-Free Electronics Project

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt

    2011-01-01

    Original Equipment Manufacturers (OEMs). depots. and support contractors have to be prepared to deal with an electronics supply chain thaI increasingly provides parts with lead-free finishes. some labeled no differently and intenningled with their SnPb counterparts. Allowance oflead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free lenninations, tennination finishes, or circuit boards presents a host of concerns to customers. suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers; 2. Incompatibility oflead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system; and 3. Unknown material properties and incompatibilities that could reduce solder joint re liability.

  5. Sensor Amplifier for the Venus Ground Ambient

    NASA Technical Reports Server (NTRS)

    DelCastillo, Linda Y.; Johnson, Travis W.; Hatake, Toshiro; Mojarradi, Mohammad M.; Kolawa, Elizabeth A.

    2006-01-01

    Previous Venus Landers employed high temperature pressure vessels, with thermally protected electronics, to achieve successful missions, with a maximum surface lifetime of 127 minutes. Extending the operating range of electronic systems to the temperatures (480 C) and pressures (90 bar) of the Venus ground ambient would significantly increase the science return of future missions. Toward that end, the current work describes the innovative design of a sensor preamplifier, capable of working in the Venus ground ambient and designed using commercial components (thermionic vacuum tubes, wide band gap transistors, thick film resistors, advanced high temperature capacitors, and monometallic interfaces) To identify commercial components and electronic packaging materials that are capable of operation within the specified environment, a series of active devices, passive components, and packaging materials were screened for operability at 500C, assuming a 10x increase in the mission lifetime. In addition. component degradation as a function of time at 500(deg)C was evaluated. Based on the results of these preliminary evaluations, two amplifiers were developed.

  6. Microstructure-Evolution and Reliability Assessment Tool for Lead-Free Component Insertion in Army Electronics

    DTIC Science & Technology

    2008-10-01

    provide adequate means for thermal heat dissipation and cooling. Thus electronic packaging has four main functions [1]: • Signal distribution which... dissipation , involving structural and materials consideration. • Mechanical, chemical and electromagnetic protection of components and... nature when compared to phenomenological models. Microelectronic packaging industry spends typically several months building and reliability

  7. NASA Tech Briefs, May 1991. Volume 15, No. 5

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  8. NASA Tech Briefs, January 1991. Volume 15, No. 1

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences;Life Sciences.

  9. NASA Tech Briefs, September 1991. Volume 15, No. 9

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  10. NASA Tech Briefs, March 1996. Volume 20, No. 3

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics: Computer-Aided Design and Engineering; Electronic Components and Cicuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information; Books and Reports.

  11. NASA Tech Briefs, June 1990. Volume 14, No. 6

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  12. NASA Tech Briefs, August 1991. Volume 15, No. 8

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  13. NASA Tech Briefs, August 1998. Volume 22, No. 8

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage of medical design, electronic components and circuits, electronic systems, software, materials, mechanics, machinery/automation, physical sciences, and a special section of Photonics Tech Briefs.

  14. NASA Tech Briefs, February 1991. Volume 15, No. 2

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  15. NASA Tech Briefs, March 1991. Volume 15, No. 3

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  16. NASA Tech Briefs, December 1990. Volume 14, No. 12

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  17. NASA Tech Briefs, September 1996. Volume 20, No. 9

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics: Data Acquisition and Analysis; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

  18. NASA Tech Briefs, June 1991. Volume 15, No. 6

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  19. NASA Tech Briefs, August 1993. Volume 17, No. 8

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Computer Graphics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  20. NASA Tech Briefs, September 1993. Volume 17, No. 9

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  1. NASA Tech Briefs, September 1999. Volume 23, No. 9

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics discussed include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences;

  2. NASA Tech Briefs, May 1990. Volume 14, No. 5

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  3. NASA Tech Briefs, Winter 1985. Volume 9, No. 4

    NASA Technical Reports Server (NTRS)

    1985-01-01

    Topics covered include: NASA TU Services; New Product Ideas; Electronic Components and Circuits;Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  4. NASA Tech Briefs, March 1993. Volume 17, No. 3

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences;

  5. NASA Tech Briefs, January 1994. Volume 18, No. 1

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics include: Communications Technology; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  6. NASA Tech Briefs, November 1994. Volume 18, No. 11

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics: Advanced Manufacturing; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  7. NASA Tech Briefs, April 1991. Volume 15, No. 4

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  8. NASA Tech Briefs, October 1990. Volume 14, No. 10

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical' Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  9. NASA Tech Briefs, January/February 1986. Volume 10, No. 1

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  10. NASA Tech Briefs, October 1991. Volume 15, No. 10

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  11. Biodegradable Polymeric Materials in Degradable Electronic Devices

    PubMed Central

    2018-01-01

    Biodegradable electronics have great potential to reduce the environmental footprint of devices and enable advanced health monitoring and therapeutic technologies. Complex biodegradable electronics require biodegradable substrates, insulators, conductors, and semiconductors, all of which comprise the fundamental building blocks of devices. This review will survey recent trends in the strategies used to fabricate biodegradable forms of each of these components. Polymers that can disintegrate without full chemical breakdown (type I), as well as those that can be recycled into monomeric and oligomeric building blocks (type II), will be discussed. Type I degradation is typically achieved with engineering and material science based strategies, whereas type II degradation often requires deliberate synthetic approaches. Notably, unconventional degradable linkages capable of maintaining long-range conjugation have been relatively unexplored, yet may enable fully biodegradable conductors and semiconductors with uncompromised electrical properties. While substantial progress has been made in developing degradable device components, the electrical and mechanical properties of these materials must be improved before fully degradable complex electronics can be realized. PMID:29632879

  12. Organic n-type materials for charge transport and charge storage applications.

    PubMed

    Stolar, Monika; Baumgartner, Thomas

    2013-06-21

    Conjugated materials have attracted much attention toward applications in organic electronics in recent years. These organic species offer many advantages as potential replacement for conventional materials (i.e., silicon and metals) in terms of cheap fabrication and environmentally benign devices. While p-type (electron-donating or hole-conducting) materials have been extensively reviewed and researched, their counterpart n-type (electron-accepting or electron-conducting) materials have seen much less popularity despite the greater need for improvement. In addition to developing efficient charge transport materials, it is equally important to provide a means of charge storage, where energy can be used on an on-demand basis. This perspective is focused on discussing a selection of representative n-type materials and the efforts toward improving their charge-transport efficiencies. Additionally, this perspective will also highlight recent organic materials for battery components and the efforts that have been made to improve their environmental appeal.

  13. NASA Tech Briefs, September 1988. Volume 12, No. 8

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  14. NASA Tech Briefs, July/August 1988. Volume 12, No. 7

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  15. LASER Tech Briefs, Fall 1994. Volume 2, No. 4

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics in this issue of LASER Tech briefs include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  16. NASA Tech Briefs, October 1988. Volume 12, No. 9

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  17. NASA Tech Briefs, July 1991. Volume 15, No. 7

    NASA Technical Reports Server (NTRS)

    1991-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  18. NASA Tech Briefs, March 1987. Volume 11, No. 3

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  19. NASA Tech Briefs, May 1987. Volume 11, No. 5

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  20. NASA Tech Briefs, October 1987. Volume 11, No. 9

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  1. NASA Tech Briefs, June 1989. Volume 13, No. 6

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  2. NASA Tech Briefs, February 1987. Volume 11, No. 2

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  3. NASA Tech Briefs, January 1987. Volume 11, No. 2

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  4. NASA Tech Briefs, July 1990. Volume 14, No. 7

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  5. NASA Tech Briefs, August 1990. Volume 14, No. 8

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics covered: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  6. NASA Tech Briefs, April 1987. Volume 11, No. 4

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  7. NASA Tech Briefs, September 1987. Volume 11, No. 8

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  8. NASA Tech Briefs, June 1994. Volume 18, No. 6

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics covered include: Microelectronics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  9. NASA Tech Briefs, August 1994. Volume 18, No. 8

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics covered include: Computer Hardware; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  10. NASA Tech Briefs, October 1996. Volume 20, No. 10

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics covered include: Sensors; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  11. NASA Tech Briefs, June 1997. Volume 21, No. 6

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics include: Computer Hardware and Peripherals; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Books and Reports.

  12. NASA Tech Briefs, June 1987. Volume 11, No. 6

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  13. NASA Tech Briefs, November 1999. Volume 23, No. 11

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics covered include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Materials; Computer Programs; Mechanics; Machinery/Automation; Physical Sciences; Mathematics and Information Sciences; Books and Reports.

  14. NASA Tech Briefs, August 1989. Volume 13, No. 8

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Topics covered: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  15. Long-range ordering of composites for organic electronics: TIPS-pentacene single crystals with incorporated nano-fibers

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Li, Huanbin; Xue, Guobiao; Wu, Jiake

    Multi-component active materials are widely used for organic electronic devices, with every component contributing complementary and synergistic optoelectronic functions. Mixing these components generally leads to lowered crystallinity and weakened charge transport. Therefore, preparing the active materials without substantially disrupting the crystalline lattice is highly desired. In this paper, we show that crystallization of TIPS-pentacene from solutions in the presence of fluorescent nanofibers of a perylene bisimide derivative (PBI) leads to formation of composites with nanofiber guest incorporated in the crystal host. In spite of the binary composite structure, the TIPS-pentacene maintains the single-crystalline nature. As a result, the incorporation ofmore » the PBI guest introduces additional fluorescence function but does not significantly reduce the charge transport property of the TIPS-pentacene host, exhibiting field-effect mobility as high as 3.34 cm 2 V -1 s -1 even though 26.4% of the channel area is taken over by the guest. Finally, as such, this work provides a facile approach toward high-performance multifunctional organic electronic materials.« less

  16. Long-range ordering of composites for organic electronics: TIPS-pentacene single crystals with incorporated nano-fibers

    DOE PAGES

    Li, Huanbin; Xue, Guobiao; Wu, Jiake; ...

    2017-08-18

    Multi-component active materials are widely used for organic electronic devices, with every component contributing complementary and synergistic optoelectronic functions. Mixing these components generally leads to lowered crystallinity and weakened charge transport. Therefore, preparing the active materials without substantially disrupting the crystalline lattice is highly desired. In this paper, we show that crystallization of TIPS-pentacene from solutions in the presence of fluorescent nanofibers of a perylene bisimide derivative (PBI) leads to formation of composites with nanofiber guest incorporated in the crystal host. In spite of the binary composite structure, the TIPS-pentacene maintains the single-crystalline nature. As a result, the incorporation ofmore » the PBI guest introduces additional fluorescence function but does not significantly reduce the charge transport property of the TIPS-pentacene host, exhibiting field-effect mobility as high as 3.34 cm 2 V -1 s -1 even though 26.4% of the channel area is taken over by the guest. Finally, as such, this work provides a facile approach toward high-performance multifunctional organic electronic materials.« less

  17. NASA Tech Briefs, February 1997. Volume 2, No. 2

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics include: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  18. NASA Tech Briefs, November 1988. Volume 12, No. 10

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics covered include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  19. NASA Tech Briefs, September/October 1986. Volume 10, No. 5

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  20. NASA Tech Briefs, April 1998. Volume 22, No. 4

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage on video and imaging, electronic components and circuits, electronic systems, physical sciences, materials, computer software, mechanics, machinery/automation, and a special section of Photonics Tech Briefs.

  1. NASA Tech Briefs, November 1996. Volume 20, No. 11

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics covered: Video and Imaging; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  2. NASA Tech Briefs, December 1996. Volume 20, No. 12

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics: Design and Analysis Software; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  3. NASA Tech Briefs, May 1996. Volume 20, No. 5

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics include: Video and Imaging;Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  4. NASA Tech Briefs, November/December 1986. Volume 10, No. 6

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  5. NASA Tech Briefs, October 1993. Volume 17, No. 10

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics include: Sensors; esign and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication technology; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  6. NASA Tech Briefs, May 1994. Volume 18, No. 5

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics covered include: Robotics/Automation; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  7. NASA Tech Briefs, May/June 1986. Volume 10, No. 3

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Topics discussed include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  8. NASA Tech Briefs, September 1990. Volume 14, No. 9

    NASA Technical Reports Server (NTRS)

    1990-01-01

    Topics covered include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  9. NASA Tech Briefs, November/December 1987. Volume 11, No. 10

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  10. NASA Tech Briefs, February 1994. Volume 18, No. 2

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics covered include: Test and Measurement; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports

  11. NASA Tech Briefs, March 1988. Volume 12, No. 3

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; and Life Sciences.

  12. NASA Tech Briefs, January 2000. Volume 24, No. 1

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics include: Data Acquisition; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Bio-Medical; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Information Sciences; Books and reports.

  13. NASA Tech Briefs, July/August 1987. Volume 11, No. 7

    NASA Technical Reports Server (NTRS)

    1987-01-01

    Topics include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Fabrication Technology; Machinery; Mathematics and Information Sciences; Life Sciences.

  14. Skin-Inspired Electronics: An Emerging Paradigm.

    PubMed

    Wang, Sihong; Oh, Jin Young; Xu, Jie; Tran, Helen; Bao, Zhenan

    2018-05-15

    Future electronics will take on more important roles in people's lives. They need to allow more intimate contact with human beings to enable advanced health monitoring, disease detection, medical therapies, and human-machine interfacing. However, current electronics are rigid, nondegradable and cannot self-repair, while the human body is soft, dynamic, stretchable, biodegradable, and self-healing. Therefore, it is critical to develop a new class of electronic materials that incorporate skinlike properties, including stretchability for conformable integration, minimal discomfort and suppressed invasive reactions; self-healing for long-term durability under harsh mechanical conditions; and biodegradability for reducing environmental impact and obviating the need for secondary device removal for medical implants. These demands have fueled the development of a new generation of electronic materials, primarily composed of polymers and polymer composites with both high electrical performance and skinlike properties, and consequently led to a new paradigm of electronics, termed "skin-inspired electronics". This Account covers recent important advances in skin-inspired electronics, from basic material developments to device components and proof-of-concept demonstrations for integrated bioelectronics applications. To date, stretchability has been the most prominent focus in this field. In contrast to strain-engineering approaches that extrinsically impart stretchability into inorganic electronics, intrinsically stretchable materials provide a direct route to achieve higher mechanical robustness, higher device density, and scalable fabrication. The key is the introduction of strain-dissipation mechanisms into the material design, which has been realized through molecular engineering (e.g., soft molecular segments, dynamic bonds) and physical engineering (e.g., nanoconfinement effect, geometric design). The material design concepts have led to the successful demonstrations of stretchable conductors, semiconductors, and dielectrics without sacrificing their electrical performance. Employing such materials, innovative device design coupled with fabrication method development has enabled stretchable sensors and displays as input/output components and large-scale transistor arrays for circuits and active matrixes. Strategies to incorporate self-healing into electronic materials are the second focus of this Account. To date, dynamic intermolecular interactions have been the most effective approach for imparting self-healing properties onto polymeric electronic materials, which have been utilized to fabricate self-healing sensors and actuators. Moreover, biodegradability has emerged as an important feature in skin-inspired electronics. The incorporation of degradable moieties along the polymer backbone allows for degradable conducting polymers and the use of bioderived materials has led to the demonstration of biodegradable functional devices, such as sensors and transistors. Finally, we highlight examples of skin-inspired electronics for three major applications: prosthetic e-skins, wearable electronics, and implantable electronics.

  15. Photoinduced reversible lattice expansion in W-doped TiO2 through the change of its electronic structure

    NASA Astrophysics Data System (ADS)

    Feng, Fan; Yang, Weiyi; Gao, Shuang; Zhu, Linggang; Li, Qi

    2018-02-01

    External stimulations of applied force or voltage have been reported to induce crystal lattice dimension changes with the order of 0.1% or above by imposing external mechanical or electric forces on atoms forming the lattice for various types of materials, including oxides, metals, polymers, and carbon nanostructures. As far as we know, however, no report is available for similar level changes in oxides from their internal electronic structure changes induced by photoirradiation. We show that reversible lattice expansion comparable to those by applied force or voltage can be induced by UV-irradiation on an oxide of W-doped TiO2 nanotubes through the reversible changes of its internal electronic structure by the accumulation and release of photogenerated electrons in W-dopants when UV-illumination is on and off. This photoirradiation-induced reversible lattice expansion and subsequent optical, electric, and magnetic property changes may also be present in other material systems by proper material design if they possess one component that is able to produce electrons upon photoirradiation and the other component that is able to accumulate photogenerated electrons to induce lattice changes and release them after the photoirradiation is off.

  16. Laser-Material Interactions for Flexible Applications.

    PubMed

    Joe, Daniel J; Kim, Seungjun; Park, Jung Hwan; Park, Dae Yong; Lee, Han Eol; Im, Tae Hong; Choi, Insung; Ruoff, Rodney S; Lee, Keon Jae

    2017-07-01

    The use of lasers for industrial, scientific, and medical applications has received an enormous amount of attention due to the advantageous ability of precise parameter control for heat transfer. Laser-beam-induced photothermal heating and reactions can modify nanomaterials such as nanoparticles, nanowires, and two-dimensional materials including graphene, in a controlled manner. There have been numerous efforts to incorporate lasers into advanced electronic processing, especially for inorganic-based flexible electronics. In order to resolve temperature issues with plastic substrates, laser-material processing has been adopted for various applications in flexible electronics including energy devices, processors, displays, and other peripheral electronic components. Here, recent advances in laser-material interactions for inorganic-based flexible applications with regard to both materials and processes are presented. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  17. NASA Tech Briefs, April 1997. Volume 21, No. 4

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics covered include: Video and Imaging; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  18. NASA Tech Briefs, March/April 1986. Volume 10, No. 2

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Topics covered include: NASA TU Services; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences.

  19. NASA Tech Briefs, February 1988. Volume 12, No. 2

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics covered include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Systems; and Life Sciences.

  20. NASA Tech Briefs, December 1993. Volume 17, No. 12

    NASA Technical Reports Server (NTRS)

    1993-01-01

    Topics covered include: High-Performance Computing; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  1. NASA Tech Briefs, February 2000. Volume 24, No. 2

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics covered include: Test and Measurement; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Bio-Medical; Mathematics and Information Sciences; Computers and Peripherals.

  2. NASA Tech Briefs, April 2000. Volume 24, No. 4

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics covered include: Imaging/Video/Display Technology; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Bio-Medical; Test and Measurement; Mathematics and Information Sciences; Books and Reports.

  3. NASA Tech Briefs, January 1988. Volume 12, No. 1

    NASA Technical Reports Server (NTRS)

    1988-01-01

    Topics covered include: New Product Ideas; NASA TU Services; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; and Life Sciences.

  4. NASA Tech Briefs, April 1994. Volume 18, No. 4

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics covered: Advanced Composites and Plastics; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  5. NASA Tech Briefs, March 1994. Volume 18, No. 3

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  6. NASA Tech Briefs, August 1996. Volume 20, No. 8

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics covered include: Graphics and Simulation; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  7. NASA Tech Briefs, March 2000. Volume 24, No. 3

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  8. NASA Tech Briefs, March 1997. Volume 21, No. 3

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  9. NASA Tech Briefs, November 1998. Volume 22, No. 11

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage sections on test and measurement and sections on electronic components and circuits, electronic systems, software, materials, mechanics, machinery/automation, physical sciences, information sciences, book and reports, and special sections of Electronics Tech Briefs amd Rapid Product Development Tech Briefs.

  10. Chemical and engineering approaches to enable organic field-effect transistors for electronic skin applications.

    PubMed

    Sokolov, Anatoliy N; Tee, Benjamin C-K; Bettinger, Christopher J; Tok, Jeffrey B-H; Bao, Zhenan

    2012-03-20

    Skin is the body's largest organ and is responsible for the transduction of a vast amount of information. This conformable material simultaneously collects signals from external stimuli that translate into information such as pressure, pain, and temperature. The development of an electronic material, inspired by the complexity of this organ is a tremendous, unrealized engineering challenge. However, the advent of carbon-based electronics may offer a potential solution to this long-standing problem. In this Account, we describe the use of an organic field-effect transistor (OFET) architecture to transduce mechanical and chemical stimuli into electrical signals. In developing this mimic of human skin, we thought of the sensory elements of the OFET as analogous to the various layers and constituents of skin. In this fashion, each layer of the OFET can be optimized to carry out a specific recognition function. The separation of multimodal sensing among the components of the OFET may be considered a "divide and conquer" approach, where the electronic skin (e-skin) can take advantage of the optimized chemistry and materials properties of each layer. This design of a novel microstructured gate dielectric has led to unprecedented sensitivity for tactile pressure events. Typically, pressure-sensitive components within electronic configurations have suffered from a lack of sensitivity or long mechanical relaxation times often associated with elastomeric materials. Within our method, these components are directly compatible with OFETs and have achieved the highest reported sensitivity to date. Moreover, the tactile sensors operate on a time scale comparable with human skin, making them ideal candidates for integration as synthetic skin devices. The methodology is compatible with large-scale fabrication and employs simple, commercially available elastomers. The design of materials within the semiconductor layer has led to the incorporation of selectivity and sensitivity within gas-sensing devices and has enabled stable sensor operation within aqueous media. Furthermore, careful tuning of the chemical composition of the dielectric layer has provided a means to operate the sensor in real time within an aqueous environment and without the need for encapsulation layers. The integration of such devices as electronic mimics of skin will require the incorporation of biocompatible or biodegradable components. Toward this goal, OFETs may be fabricated with >99% biodegradable components by weight, and the devices are robust and stable, even in aqueous environments. Collectively, progress to date suggests that OFETs may be integrated within a single substrate to function as an electronic mimic of human skin, which could enable a large range of sensing-related applications from novel prosthetics to robotic surgery.

  11. Recent Progress on Stretchable Electronic Devices with Intrinsically Stretchable Components.

    PubMed

    Trung, Tran Quang; Lee, Nae-Eung

    2017-01-01

    Stretchable electronic devices with intrinsically stretchable components have significant inherent advantages, including simple fabrication processes, a high integrity of the stacked layers, and low cost in comparison with stretchable electronic devices based on non-stretchable components. The research in this field has focused on developing new intrinsically stretchable components for conductors, semiconductors, and insulators. New methodologies and fabrication processes have been developed to fabricate stretchable devices with intrinsically stretchable components. The latest successful examples of stretchable conductors for applications in interconnections, electrodes, and piezoresistive devices are reviewed here. Stretchable conductors can be used for electrode or sensor applications depending on the electrical properties of the stretchable conductors under mechanical strain. A detailed overview of the recent progress in stretchable semiconductors, stretchable insulators, and other novel stretchable materials is also given, along with a discussion of the associated technological innovations and challenges. Stretchable electronic devices with intrinsically stretchable components such as field-effect transistors (FETs), photodetectors, light-emitting diodes (LEDs), electronic skins, and energy harvesters are also described and a new strategy for development of stretchable electronic devices is discussed. Conclusions and future prospects for the development of stretchable electronic devices with intrinsically stretchable components are discussed. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  12. Simulation of thermomechanical fatigue in solder joints

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Fang, H.E.; Porter, V.L.; Fye, R.M.

    1997-12-31

    Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used tomore » predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.« less

  13. NASA Tech Briefs, July 1994. Volume 18, No. 7

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics covered include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports

  14. NASA Tech Briefs, July/August 1986. Volume 10, No. 4

    NASA Technical Reports Server (NTRS)

    1986-01-01

    Topic include: NASA TU Serv1ces; New Product Ideas; Electronic Components and Circuits; Electronic Systems; Materials; Computer Programs; Mechanics; Physical Sciences; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences. 3

  15. NASA Tech Briefs, May 1997. Volume 21, No. 5

    NASA Technical Reports Server (NTRS)

    1997-01-01

    Topics covered include: Advanced Composites, Plastics and Metals; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  16. NASA Tech Briefs, January 1996. Volume 20, No. 1

    NASA Technical Reports Server (NTRS)

    1996-01-01

    This issue has a special focus on sensors, and include articles on Electronic Components and Circuits, Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery/Automation, Manufacturing/Fabrication, and Mathematics and Information Sciences

  17. NASA Tech Briefs, November 2000. Volume 24, No. 11

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics covered include: Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Test and Measurement; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Data Acquisition.

  18. NASA Tech Briefs, April 1996. Volume 20, No. 4

    NASA Technical Reports Server (NTRS)

    1996-01-01

    Topics covered include: Advanced Composites and Plastics; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information; Books and Reports.

  19. NASA Tech Briefs, October 1994. Volume 18, No. 10

    NASA Technical Reports Server (NTRS)

    1994-01-01

    Topics: Data Acquisition and Analysis; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences; Life Sciences; Books and Reports

  20. NASA Tech Briefs, July 1998. Volume 22, No. 7

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage on graphics and simulation, electronic components and circuits, electronic systems, materials, a second special coverage on mechanical technology, machinery/automation, and a special section of electronics Tech Briefs. There is also a section devoted to the technology of the International Space Station.

  1. Nano-casted Metal Oxide Aerogels as Dual Purpose Structural Components for Space Exploration

    NASA Technical Reports Server (NTRS)

    Vassilaras, Plousia E.

    2004-01-01

    NASA missions and space exploration rely on strong, ultra lightweight materials. Such materials are needed for building up past and present space vehicles such as the Sojourner Rover (1997) or the two MERs (2003), but also for a number of components and/or systems including thermal insulators, Solar Sails, Rigid Aeroshells, and Ballutes. The purpose of my internship here at Glenn Research Center is to make dual purpose materials; materials that in addition to being lightweight have electronic, photophysical and magnetic properties and, therefore, act as electronic components and sensors as well as structural components. One type of ultra lightweight material of great interest is aerogels, which have densities ranging from 0.003 g/cc to 0.8 g/cc . However, aerogels are extremely fragile and, as a result, have limited practical applications. Recently, Glenn Research Center has developed a process of nano-casting polymers onto the inorganic network of silica-based aerogels increasing the strength 300 fold while only increasing the density 3 fold. By combining the process of nano-casting polymers with inorganic oxide networks other than silica, we are actively pursuing lightweight dual purpose materials. To date, thirty different inorganic oxide aerogels have been prepared using either standard sol-gel chemistry or a non-alkoxide method involving metal chloride precursors and an epoxide; epichlorohydrin, propylene oxide or trimethylene oxide, as proton scavengers. More importantly, preliminary investigations show that the residual surface hydroxyl groups on each of these inorganic oxide aerogels can be successfully crosslinked with urethane. In addition to characterizing physical and mechanical properties such as density, strength and flexibility, each of these metal oxide aerogels are being characterized for thermal and electronic conductivity and magnetic and optical properties.

  2. 500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

    NASA Technical Reports Server (NTRS)

    Chen, Liang-yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

    2016-01-01

    High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

  3. Sequential infiltration synthesis for advanced lithography

    DOEpatents

    Darling, Seth B.; Elam, Jeffrey W.; Tseng, Yu-Chih; Peng, Qing

    2015-03-17

    A plasma etch resist material modified by an inorganic protective component via sequential infiltration synthesis (SIS) and methods of preparing the modified resist material. The modified resist material is characterized by an improved resistance to a plasma etching or related process relative to the unmodified resist material, thereby allowing formation of patterned features into a substrate material, which may be high-aspect ratio features. The SIS process forms the protective component within the bulk resist material through a plurality of alternating exposures to gas phase precursors which infiltrate the resist material. The plasma etch resist material may be initially patterned using photolithography, electron-beam lithography or a block copolymer self-assembly process.

  4. Current Space Station Experiments Investigating Component Level Electronics Repair

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.

    2010-01-01

    The Soldering in a Reduced Gravity Experiment (SoRGE) and Component Repair Experiment (CRE)-1 are tests performed on the International Space Station to determine the techniques, tools, and training necessary to allow future crews to perform manual electronics repairs at the component level. SoRGE provides information on the formation and internal structure of through-hole solder joints, illustrating the challenges and implications of soldering in reduced gravity. SoRGE showed a significant increase in internal void defects for joints formed in low gravity compared to normal gravity. Methods for mitigating these void defects were evaluated using a modified soldering process. CRE-1 demonstrated the removal, cleaning, and replacement of electronics components by manual means on functional circuit boards. The majority of components successful passed a post-repair functional test demonstrating the feasibility of component-level repair within the confines of a spacecraft. Together, these tasks provide information to recommend material and tool improvements, training improvements, and future work to help enable electronics repairs in future space missions.

  5. NASA Tech Briefs, April 1999. Volume 23, No. 4

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics include: special coverage sections on automotive technology, and CAM and sections on electronic components and systems, software, materials, machinery/automation, physical sciences, and a special section of Electronic Tech Briefs and Motion Control Tech Briefs.

  6. NASA Tech Briefs, January 1999. Volume 23, Mp/ 1

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics include: special coverage sections on sensors and data acquisition and sections on electronic components and circuits, electronic software, materials, mechanics, bio-medical physical sciences, book and reports, and a special section of Photonics Tech Briefs.

  7. NASA Tech Briefs, August 2000. Volume 24, No. 8

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics include: Simulation/Virtual Reality; Test and Measurement; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Medical Design.

  8. NASA Tech Briefs, June 1995. Volume 19, No. 6

    NASA Technical Reports Server (NTRS)

    1995-01-01

    Topics include: communications technology, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, life sciences, books and reports, a special section of laser Tech Briefs.

  9. Dynamic characterization and modeling of potting materials for electronics assemblies

    NASA Astrophysics Data System (ADS)

    Joshi, Vasant S.; Lee, Gilbert F.; Santiago, Jaime R.

    2017-01-01

    Prediction of survivability of encapsulated electronic components subject to impact relies on accurate modeling, which in turn needs both static and dynamic characterization of individual electronic components and encapsulation material to generate reliable material parameters for a robust material model. Current focus is on potting materials to mitigate high rate loading on impact. In this effort, difficulty arises in capturing one of the critical features characteristic of the loading environment in a high velocity impact: multiple loading events coupled with multi-axial stress states. Hence, potting materials need to be characterized well to understand its damping capacity at different frequencies and strain rates. An encapsulation scheme to protect electronic boards consists of multiple layers of filled as well as unfilled polymeric materials like Sylgard 184 and Trigger bond Epoxy # 20-3001. A combination of experiments conducted for characterization of materials used Split Hopkinson Pressure Bar (SHPB), and dynamic material analyzer (DMA). For material which behaves in an ideal manner, a master curve can be fitted to Williams-Landel-Ferry (WLF) model. To verify the applicability of WLF model, a new temperature-time shift (TTS) macro was written to compare idealized temperature shift factor with experimental incremental shift factor. Deviations can be readily observed by comparison of experimental data with the model fit to determine if model parameters reflect the actual material behavior. Similarly, another macro written for obtaining Ogden model parameter from Hopkinson Bar tests can readily indicate deviations from experimental high strain rate data. Experimental results for different materials used for mitigating impact, and ways to combine data from DMA and Hopkinson bar together with modeling refinements are presented.

  10. Incineration, pyrolysis and gasification of electronic waste

    NASA Astrophysics Data System (ADS)

    Gurgul, Agnieszka; Szczepaniak, Włodzimierz; Zabłocka-Malicka, Monika

    2017-11-01

    Three high temperature processes of the electronic waste processing: smelting/incineration, pyrolysis and gasification were shortly discussed. The most distinctive feature of electronic waste is complexity of components and their integration. This type of waste consists of polymeric materials and has high content of valuable metals that could be recovered. The purpose of thermal treatment of electronic waste is elimination of plastic components (especially epoxy resins) while leaving non-volatile mineral and metallic phases in more or less original forms. Additionally, the gaseous product of the process after cleaning may be used for energy recovery or as syngas.

  11. Next-generation materials for future synchrotron and free-electron laser sources

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Assoufid, Lahsen; Graafsma, Heinz

    We show that the development of new materials and improvements of existing ones are at the root of the spectacular recent developments of new technologies for synchrotron storage rings and free-electron laser sources. This holds true for all relevant application areas, from electron guns to undulators, x-ray optics, and detectors. As demand grows for more powerful and efficient light sources, efficient optics, and high-speed detectors, an overview of ongoing materials research for these applications is timely. In this article, we focus on the most exciting and demanding areas of materials research and development for synchrotron radiation optics and detectors. Materialsmore » issues of components for synchrotron and free-electron laser accelerators are briefly discussed. Lastly, the articles in this issue expand on these topics.« less

  12. Next-generation materials for future synchrotron and free-electron laser sources

    DOE PAGES

    Assoufid, Lahsen; Graafsma, Heinz

    2017-06-09

    We show that the development of new materials and improvements of existing ones are at the root of the spectacular recent developments of new technologies for synchrotron storage rings and free-electron laser sources. This holds true for all relevant application areas, from electron guns to undulators, x-ray optics, and detectors. As demand grows for more powerful and efficient light sources, efficient optics, and high-speed detectors, an overview of ongoing materials research for these applications is timely. In this article, we focus on the most exciting and demanding areas of materials research and development for synchrotron radiation optics and detectors. Materialsmore » issues of components for synchrotron and free-electron laser accelerators are briefly discussed. Lastly, the articles in this issue expand on these topics.« less

  13. NASA Tech Briefs, October 2002. Volume 26, No. 10

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus on sensors, electronic components and systems, software, materials, materials, mechanics, manufacturing, physical sciences, information sciences, book and reports, motion control and a special section of Photonics Tech Briefs.

  14. Vibrational spectroscopy in the electron microscope.

    PubMed

    Krivanek, Ondrej L; Lovejoy, Tracy C; Dellby, Niklas; Aoki, Toshihiro; Carpenter, R W; Rez, Peter; Soignard, Emmanuel; Zhu, Jiangtao; Batson, Philip E; Lagos, Maureen J; Egerton, Ray F; Crozier, Peter A

    2014-10-09

    Vibrational spectroscopies using infrared radiation, Raman scattering, neutrons, low-energy electrons and inelastic electron tunnelling are powerful techniques that can analyse bonding arrangements, identify chemical compounds and probe many other important properties of materials. The spatial resolution of these spectroscopies is typically one micrometre or more, although it can reach a few tens of nanometres or even a few ångströms when enhanced by the presence of a sharp metallic tip. If vibrational spectroscopy could be combined with the spatial resolution and flexibility of the transmission electron microscope, it would open up the study of vibrational modes in many different types of nanostructures. Unfortunately, the energy resolution of electron energy loss spectroscopy performed in the electron microscope has until now been too poor to allow such a combination. Recent developments that have improved the attainable energy resolution of electron energy loss spectroscopy in a scanning transmission electron microscope to around ten millielectronvolts now allow vibrational spectroscopy to be carried out in the electron microscope. Here we describe the innovations responsible for the progress, and present examples of applications in inorganic and organic materials, including the detection of hydrogen. We also demonstrate that the vibrational signal has both high- and low-spatial-resolution components, that the first component can be used to map vibrational features at nanometre-level resolution, and that the second component can be used for analysis carried out with the beam positioned just outside the sample--that is, for 'aloof' spectroscopy that largely avoids radiation damage.

  15. Generation of multicomponent ion beams by a vacuum arc ion source with compound cathode.

    PubMed

    Savkin, K P; Yushkov, Yu G; Nikolaev, A G; Oks, E M; Yushkov, G Yu

    2010-02-01

    This paper presents the results of time-of-flight mass spectrometry studies of the elemental and mass-to-charge state compositions of metal ion beams produced by a vacuum arc ion source with compound cathode (WC-Co(0.5), Cu-Cr(0.25), Ti-Cu(0.1)). We found that the ion beam composition agrees well with the stoichiometric composition of the cathode material from which the beam is derived, and the maximum ion charge state of the different plasma components is determined by the ionization capability of electrons within the cathode spot plasma, which is common to all components. The beam mass-to-charge state spectrum from a compound cathode features a greater fraction of multiply charged ions for those materials with lower electron temperature in the vacuum arc cathode spot, and a smaller fraction for those with higher electron temperature within the spot. We propose a potential diagram method for determination of attainable ion charge states for all components of the compound cathodes.

  16. NASA Tech Briefs, February 1989. Volume 13, No. 2

    NASA Technical Reports Server (NTRS)

    1989-01-01

    This issue contains a special feature on shaping the future with Ceramics. Other topics include: Electronic Components & and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences,

  17. NASA Tech Briefs, July 2000. Volume 24, No. 7

    NASA Technical Reports Server (NTRS)

    2000-01-01

    Topics covered include: Data Acquisition; Computer-Aided Design and Engineering; Electronic Components and Circuits; Electronic Systems; Test and Measurement; Physical Sciences; Materials; Computer Programs; Mechanics; Machinery/Automation; Manufacturing/Fabrication; Mathematics and Information Sciences; Life Sciences; Books and Reports.

  18. Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder

    NASA Astrophysics Data System (ADS)

    Kaabi, Abderrahmen; Bienvenu, Yves; Ryckelynck, David; Pierre, Bertrand

    2014-03-01

    Power electronics modules (>100 A, >500 V) are essential components for the development of electrical and hybrid vehicles. These modules are formed from silicon chips (transistors and diodes) assembled on copper substrates by soldering. Owing to the fact that the assembly is heterogeneous, and because of thermal gradients, shear stresses are generated in the solders and cause premature damage to such electronics modules. This work focuses on architectured materials for the substrate and on lead-free solders to reduce the mechanical effects of differential expansion, improve the reliability of the assembly, and achieve a suitable operating temperature (<175°C). These materials are composites whose thermomechanical properties have been optimized by numerical simulation and validated experimentally. The substrates have good thermal conductivity (>280 W m-1 K-1) and a macroscopic coefficient of thermal expansion intermediate between those of Cu and Si, as well as limited structural evolution in service conditions. An approach combining design, optimization, and manufacturing of new materials has been followed in this study, leading to improved thermal cycling behavior of the component.

  19. Wet/Dry Vacuum Cleaner

    NASA Technical Reports Server (NTRS)

    Reimers, Harold; Andampour, Jay; Kunitser, Craig; Thomas, Ike

    1995-01-01

    Vacuum cleaner collects and retains dust, wet debris, and liquids. Designed for housekeeping on Space Station Freedom, it functions equally well in normal Earth Gravity or in microgravity. Generates acoustic noise at comfortably low levels and includes circuitry that reduces electromagnetic interference to other electronic equipment. Draws materials into bag made of hydrophobic sheet with layers of hydrophilic super-absorbing pads at downstream end material. Hydrophilic material can gel many times its own weight of liquid. Blower also provides secondary airflow to cool its electronic components.

  20. Improved model for detection of homogeneous production batches of electronic components

    NASA Astrophysics Data System (ADS)

    Kazakovtsev, L. A.; Orlov, V. I.; Stashkov, D. V.; Antamoshkin, A. N.; Masich, I. S.

    2017-10-01

    Supplying the electronic units of the complex technical systems with electronic devices of the proper quality is one of the most important problems for increasing the whole system reliability. Moreover, for reaching the highest reliability of an electronic unit, the electronic devices of the same type must have equal characteristics which assure their coherent operation. The highest homogeneity of the characteristics is reached if the electronic devices are manufactured as a single production batch. Moreover, each production batch must contain homogeneous raw materials. In this paper, we propose an improved model for detecting the homogeneous production batches of shipped lot of electronic components based on implementing the kurtosis criterion for the results of non-destructive testing performed for each lot of electronic devices used in the space industry.

  1. Space environmental effects on spacecraft: LEO materials selection guide, part 2

    NASA Astrophysics Data System (ADS)

    Silverman, Edward M.

    1995-08-01

    This document provides performance properties on major spacecraft materials and subsystems that have been exposed to the low-Earth orbit (LEO) space environment. Spacecraft materials include metals, polymers, composites, white and black paints, thermal-control blankets, adhesives, and lubricants. Spacecraft subsystems include optical components, solar cells, and electronics. Information has been compiled from LEO short-term spaceflight experiments (e.g., space shuttle) and from retrieved satellites of longer mission durations (e.g., Long Duration Exposure Facility). Major space environment effects include atomic oxygen (AO), ultraviolet radiation, micrometeoroids and debris, contamination, and particle radiation. The main objective of this document is to provide a decision tool to designers for designing spacecraft and structures. This document identifies the space environments that will affect the performance of materials and components, e.g., thermal-optical property changes of paints due to UV exposures, AO-induced surface erosion of composites, dimensional changes due to thermal cycling, vacuum-induced moisture outgassing, and surface optical changes due to AO/UV exposures. Where appropriate, relationships between the space environment and the attendant material/system effects are identified. Part 2 covers thermal control systems, power systems, optical components, electronic systems, and applications.

  2. Space environmental effects on spacecraft: LEO materials selection guide, part 2

    NASA Technical Reports Server (NTRS)

    Silverman, Edward M.

    1995-01-01

    This document provides performance properties on major spacecraft materials and subsystems that have been exposed to the low-Earth orbit (LEO) space environment. Spacecraft materials include metals, polymers, composites, white and black paints, thermal-control blankets, adhesives, and lubricants. Spacecraft subsystems include optical components, solar cells, and electronics. Information has been compiled from LEO short-term spaceflight experiments (e.g., space shuttle) and from retrieved satellites of longer mission durations (e.g., Long Duration Exposure Facility). Major space environment effects include atomic oxygen (AO), ultraviolet radiation, micrometeoroids and debris, contamination, and particle radiation. The main objective of this document is to provide a decision tool to designers for designing spacecraft and structures. This document identifies the space environments that will affect the performance of materials and components, e.g., thermal-optical property changes of paints due to UV exposures, AO-induced surface erosion of composites, dimensional changes due to thermal cycling, vacuum-induced moisture outgassing, and surface optical changes due to AO/UV exposures. Where appropriate, relationships between the space environment and the attendant material/system effects are identified. Part 2 covers thermal control systems, power systems, optical components, electronic systems, and applications.

  3. Sequential infiltration synthesis for advanced lithography

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Darling, Seth B.; Elam, Jeffrey W.; Tseng, Yu-Chih

    A plasma etch resist material modified by an inorganic protective component via sequential infiltration synthesis (SIS) and methods of preparing the modified resist material. The modified resist material is characterized by an improved resistance to a plasma etching or related process relative to the unmodified resist material, thereby allowing formation of patterned features into a substrate material, which may be high-aspect ratio features. The SIS process forms the protective component within the bulk resist material through a plurality of alternating exposures to gas phase precursors which infiltrate the resist material. The plasma etch resist material may be initially patterned usingmore » photolithography, electron-beam lithography or a block copolymer self-assembly process.« less

  4. Biologically Derived Soft Conducting Hydrogels Using Heparin-Doped Polymer Networks

    PubMed Central

    2015-01-01

    The emergence of flexible and stretchable electronic components expands the range of applications of electronic devices. Flexible devices are ideally suited for electronic biointerfaces because of mechanically permissive structures that conform to curvilinear structures found in native tissue. Most electronic materials used in these applications exhibit elastic moduli on the order of 0.1–1 MPa. However, many electronically excitable tissues exhibit elasticities in the range of 1–10 kPa, several orders of magnitude smaller than existing components used in flexible devices. This work describes the use of biologically derived heparins as scaffold materials for fabricating networks with hybrid electronic/ionic conductivity and ultracompliant mechanical properties. Photo-cross-linkable heparin–methacrylate hydrogels serve as templates to control the microstructure and doping of in situ polymerized polyaniline structures. Macroscopic heparin-doped polyaniline hydrogel dual networks exhibit impedances as low as Z = 4.17 Ω at 1 kHz and storage moduli of G′ = 900 ± 100 Pa. The conductivity of heparin/polyaniline networks depends on the oxidation state and microstructure of secondary polyaniline networks. Furthermore, heparin/polyaniline networks support the attachment, proliferation, and differentiation of murine myoblasts without any surface treatments. Taken together, these results suggest that heparin/polyaniline hydrogel networks exhibit suitable physical properties as an electronically active biointerface material that can match the mechanical properties of soft tissues composed of excitable cells. PMID:24738911

  5. Printing Electronic Components from Copper-Infused Ink and Thermoplastic Mediums

    NASA Astrophysics Data System (ADS)

    Flowers, Patrick F.

    The demand for printable electronics has sharply increased in recent years and is projected to continue to rise. Unfortunately, electronic materials which are suitable for desired applications while being compatible with available printing techniques are still often lacking. This thesis addresses two such challenging areas. In the realm of two-dimensional ink-based printing of electronics, a major barrier to the realization of printable computers that can run programs is the lack of a solution-coatable non-volatile memory with performance metrics comparable to silicon-based devices. To address this deficiency, I developed a nonvolatile memory based on Cu-SiO2 core-shell nanowires that can be printed from solution and exhibits on-off ratios of 106, switching speeds of 50 ns, a low operating voltage of 2 V, and operates for at least 104 cycles without failure. Each of these metrics is similar to or better than Flash memory (the write speed is 20 times faster than Flash). Memory architectures based on the individual memory cells demonstrated here could enable the printing of the more complex, embedded computing devices that are expected to make up an internet of things. Recently, the exploration of three-dimensional printing techniques to fabricate electronic materials began. A suitable general-purpose conductive thermoplastic filament was not available, however. In this work I examine the current state of conductive thermoplastic filaments, including a newly-released highly conductive filament that my lab has produced which we call Electrifi. I focus on the use of dual-material fused filament fabrication (FFF) to 3D print electronic components (conductive traces, resistors, capacitors, inductors) and circuits (a fully-printed high-pass filter). The resistivity of traces printed from conductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillers was found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of resistors with resistances spanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fractured easily, but the copper-based filament could be bent at least 500 times with little change in its resistance. Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filament had an impedance similar to a conductive PCB trace at 1 MHz. Dual material 3D printing was used to fabricate a variety of inductors and capacitors with properties that could be predictably tuned by modifying either the geometry of the components, or the materials used to fabricate the components. These resistors, capacitors, and inductors were combined to create a fully 3D printed high-pass filter with properties comparable to its conventional counterparts. The relatively low impedance of the copper-based filament enable its use to 3D print a receiver coil for wireless power transfer. We also demonstrate the ability to embed and connect surface mounted components in 3D printed objects with a low-cost ($1,000 in parts), open source dual-material 3D printer. This work thus demonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composed of either embedded or fully-printed electronic components.

  6. LASER Tech Briefs, September 1993. Volume 1, No. 1

    NASA Technical Reports Server (NTRS)

    Schnirring, Bill (Editor)

    1993-01-01

    This edition of LASER Tech briefs contains a feature on photonics. The other topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, Life Sciences and books and reports.

  7. NASA Tech Briefs, September 1995. Volume 19, No. 9

    NASA Technical Reports Server (NTRS)

    1995-01-01

    A special focus for this issue is Sensors. Topics covered include : Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; and Mathematics and Information Sciences. A section of Laser Tech Briefs is included.

  8. NASA Tech Briefs, December 1995. Volume 19, No. 12

    NASA Technical Reports Server (NTRS)

    1995-01-01

    Topics include: a special focus section on Bio/Medical technology, electronic components and circuits, electronic systems, physical sciences, materials, computer programs, mechanics, machinery, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section on Laser Tech Briefs.

  9. Towards uniformly dispersed battery electrode composite materials: Characteristics and performance

    DOE PAGES

    Yo Han Kwon; Takeuchi, Esther S.; Huie, Matthew M.; ...

    2016-01-14

    Battery electrodes are complex mesoscale systems comprised of electroactive components, conductive additives, and binders. In this report, methods for processing electrodes with dispersion of the components are described. To investigate the degree of material dispersion, a spin-coating technique was adopted to provide a thin, uniform layer that enabled observation of the morphology. Distinct differences in the distribution profile of the electrode components arising from individual materials physical affinities were readily identified. Hansen solubility parameter (HSP) analysis revealed pertinent surface interactions associated with materials dispersivity. Further studies demonstrated that HSPs can provide an effective strategy to identify surface modification approaches formore » improved dispersions of battery electrode materials. Specifically, introduction of surfactantlike functionality such as oleic acid (OA) capping and P3HT-conjugated polymer wrapping on the surface of nanomaterials significantly enhanced material dispersity over the composite electrode. The approach to the surface treatment on the basis of HSP study can facilitate design of composite electrodes with uniformly dispersed morphology and may contribute to enhancing their electrical and electrochemical behaviors. The conductivity of the composites and their electrochemical performance was also characterized. In conclusion, the study illustrates the importance of considering electronic conductivity, electron transfer, and ion transport in the design of environments incorporating active nanomaterials.« less

  10. Towards uniformly dispersed battery electrode composite materials: Characteristics and performance

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yo Han Kwon; Takeuchi, Esther S.; Huie, Matthew M.

    Battery electrodes are complex mesoscale systems comprised of electroactive components, conductive additives, and binders. In this report, methods for processing electrodes with dispersion of the components are described. To investigate the degree of material dispersion, a spin-coating technique was adopted to provide a thin, uniform layer that enabled observation of the morphology. Distinct differences in the distribution profile of the electrode components arising from individual materials physical affinities were readily identified. Hansen solubility parameter (HSP) analysis revealed pertinent surface interactions associated with materials dispersivity. Further studies demonstrated that HSPs can provide an effective strategy to identify surface modification approaches formore » improved dispersions of battery electrode materials. Specifically, introduction of surfactantlike functionality such as oleic acid (OA) capping and P3HT-conjugated polymer wrapping on the surface of nanomaterials significantly enhanced material dispersity over the composite electrode. The approach to the surface treatment on the basis of HSP study can facilitate design of composite electrodes with uniformly dispersed morphology and may contribute to enhancing their electrical and electrochemical behaviors. The conductivity of the composites and their electrochemical performance was also characterized. In conclusion, the study illustrates the importance of considering electronic conductivity, electron transfer, and ion transport in the design of environments incorporating active nanomaterials.« less

  11. First principle investigation of electronic structure, chemical bonding and optical properties of tetrabarium gallium trinitride oxide single crystal

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Khan, Saleem Ayaz, E-mail: sayaz_usb@yahoo.com; Azam, Sikander

    The electronic band structure, valence electron charge density and optical susceptibilities of tetrabarium gallium trinitride (TGT) were calculated via first principle study. The electronic band structure calculation describes TGT as semiconductor having direct band gap of 1.38 eV. The valence electronic charge density contour verified the non-polar covalent nature of the bond. The absorption edge and first peak of dielectric tensor components showed electrons transition from N-p state to Ba-d state. The calculated uniaxial anisotropy (0.4842) and birefringence (−0.0061) of present paper is prearranged as follow the spectral components of the dielectric tensor. The first peak in energy loss functionmore » (ELOS) shows the energy loss of fast traveling electrons in the material. The first sharp peak produced in ELOS around 10.5 eV show plasmon loss having plasma frequencies 0.1536, 0.004 and 0.066 of dielectric tensor components. This plasmon loss also cause decrease in reflectivity spectra.« less

  12. Plasma-Facing Component and Materials Testing for the NSTX-U

    NASA Astrophysics Data System (ADS)

    Jaworski, Michael; Brooks, A.; Gerhardt, S.; Loesser, D.; Mardenfeld, M.; Menard, J.; Gray, T.; Reinke, M.

    2017-10-01

    The NSTX-U Recovery Project is developing plasma-facing components for use in the divertor of NSTX-U. The extreme conditions of the NSTX-U divertor make it possible to stress even graphite surfaces to the material limits leading to the possibility of component failures. In addition, the complex, mixed-material environment of the NSTX-U due to the use of boron and lithium wall conditioning techniques creates significant uncertainties in the monitoring of the PFCs. A testing program has been developed to inform on the material and design limitations of the NSTX-U high-heat flux components. These tests include high-heat flux testing in electron beam facilities as well as plasma-based testing. The NSTX-U components could experience perpendicular heat fluxes as high as 45 MW/m2. Parallel heat fluxes onto leading edges could reach 475 MW/m2. The testing program and material survey plan will be presented. Work supported by DOE contract DE-AC02-09CH11466 and DE-AC05-00OR22725.

  13. Sewing up Science

    ERIC Educational Resources Information Center

    Tofel-Grehl, Colby; Fields, Deborah

    2015-01-01

    Electronic textiles (e-textiles)--fabrics embedded with electrical or electronic components--offer a new model for teaching this content. E-textiles also engage students in programming and engineering design through nontraditional projects and materials. This article describes a four-week electricity curriculum using three e-textiles projects that…

  14. NASA Tech Briefs, October 1998. Volume 22, No. 10

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage sections on sensors/imaging and mechanical technology, and sections on electronic components and circuits, electronic systems, software, materials, machinery/automation, manufacturing/fabrication, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs.

  15. NASA Tech Briefs, April 1989. Volume 13, No. 4

    NASA Technical Reports Server (NTRS)

    1989-01-01

    A special feature of this issue is an article about the evolution of high technology in Texas. Topics include: Electronic Components & and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences.

  16. NASA Tech Briefs, May 1989. Volume 13, No. 5

    NASA Technical Reports Server (NTRS)

    1989-01-01

    This issue contains a special feature on the flight station of the future, discussing future enhancements to Aircraft cockpits. Topics include: Electronic Components and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, and Mathematics and Information Sciences.

  17. Structural, morphological, dielectric and impedance spectroscopy of lead-free Bi(Zn2/3Ta1/3)O3 electronic material

    NASA Astrophysics Data System (ADS)

    Halder, S.; Bhuyan, S.; Das, S. N.; Sahoo, S.; Choudhary, R. N. P.; Das, P.; Parida, K.

    2017-12-01

    A lead-free dielectric material [Bi(Zn2/3Ta1/3)O3] has been prepared using a solid state reaction technique at high-temperature. The resistive, conducting and capacitive characteristics of the prepared electronic material have been studied in different experimental conditions. The determination of basic crystal parameters and reflection indices confirm the development of polycrystalline compound with orthorhombic crystal structure. The study of frequency-temperature dependence of ac conductivity illustrates the nature and conduction mechanism of the material. On the basis of observed impedance data and detailed dielectric analysis, the existence of non-Debye type relaxation has been affirmed. The electronic charge carriers of compound have short range order that has been validated from the complex modulus and impedance spectrum. The detailed studies of resistive, capacitive, microstructural characteristics of the prepared material provide some useful data for considering the material as an electronic component for fabrication of devices.

  18. Carbon nanotube network evolution during deformation of PVDF-MWNT nanocomposites

    NASA Astrophysics Data System (ADS)

    Rizvi, Reza; Naguib, Hani E.

    2013-04-01

    The emergence of novel electronic systems and their requirements have necessitated the evolution of new material classes. The traditional electronic semiconductors and components are shifting from silicon based substrates to polymers and other organic compounds. Sensor components are no exceptions, where compliant polymeric materials offer the possibility of flexible electronics. This paper examines the fabrication and characterization of piezoresistive nanocomposites for pressure sensing applications. The matrix material employed was Polyvinylidene Fluoride (PVDF). The PVDF phase was reinforced with conductive particles, in order to form a conductive filler network throughout the nanocomposite. Multiwall carbon nanotubes (MWNT) were selected as conductive particles to form the networks. The composites were prepared by melt mixing the PVDF and conductive particles in compositions ranging from 0.25 to 10 wt% conductive particle in PVDF. The dielectric permittivity and electrical conductivity of the composites was characterized and the electrical percolation behavior of PVDF nanocomposites fitted to the statistical percolation model. Scanning electron was employed to understand the morphology of the filler networks in the PVDF nanocomposites. Quasi-static piezoresistance of the nanocomposites was characterized using a custom-built force-resistance measurement setup under compressive loading conditions.

  19. NASA Tech Briefs, August 2010

    NASA Technical Reports Server (NTRS)

    2010-01-01

    Topics covered include: Technology Focus: Mechanical Components; Electronics/Computers; Software; Materials; Mechanics/Machinery; Manufacturing; Bio-Medical; Physical Sciences; Information Sciences; and Books and Reports.

  20. NASA Tech Briefs, March 1989. Volume 13, No. 3

    NASA Technical Reports Server (NTRS)

    1989-01-01

    This issue's special features cover the NASA inventor of the year, and the other nominees for the year. Other Topics include: Electronic Components & and Circuits. Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

  1. NASA Tech Briefs, Spring 1976. Volume 1, No. 1

    NASA Technical Reports Server (NTRS)

    1976-01-01

    Topics covered include : Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; and Mathematics and Information Sciences. Also included are NEW PRODUCT IDEAS: A summary of selected innovations of value to manufacturers for the development of new products.

  2. NASA-DoD Lead-Free Electronics Project

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt

    2010-01-01

    Original Equipment Manufacturers (OEMs), depots, and support contract ors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the r eliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or cir cuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-f ree processes and parameters (including higher melting points of lead -free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reli ability As the transition to lead-free becomes a certain reality for military and aerospace applications, it will be critical to fully un derstand the implications of reworking lead-free assemblies.

  3. Spacecraft Heat Rejection Methods: Active and Passive Heat Transfer for Electronic Systems.

    DTIC Science & Technology

    1986-08-29

    Storage in avionics, spacecraft and electronics ,;"ters. Microencapsulated phase change materials (PCMs) in a two-component water SlUrrv- were useo with...capsules was observed in the pumping process. Inaddition, both microencapsulated and pure PCM were used to passively reduce tile tempera- tuo .tremes of...conducted as a Phase I Small Business Innovation Research (SBIR) program to explore the feasibility of using microencapsulated phase change materials (PCM) in

  4. Integrating Hazardous Materials Characterization and Assessment Tools to Guide Pollution Prevention in Electronic Products and Manufacturing

    NASA Astrophysics Data System (ADS)

    Lam, Carl

    Due to technology proliferation, the environmental burden attributed to the production, use, and disposal of hazardous materials in electronics have become a worldwide concern. The major theme of this dissertation is to develop and apply hazardous materials assessment tools to systematically guide pollution prevention opportunities in the context of electronic product design, manufacturing and end-of-life waste management. To this extent, a comprehensive review is first provided on describing hazard traits and current assessment methods to evaluate hazardous materials. As a case study at the manufacturing level, life cycle impact assessment (LCIA)-based and risk-based screening methods are used to quantify chemical and geographic environmental impacts in the U.S. printed wiring board (PWB) industry. Results from this industrial assessment clarify priority waste streams and States to most effectively mitigate impact. With further knowledge of PWB manufacturing processes, select alternative chemical processes (e.g., spent copper etchant recovery) and material options (e.g., lead-free etch resist) are discussed. In addition, an investigation on technology transition effects for computers and televisions in the U.S. market is performed by linking dynamic materials flow and environmental assessment models. The analysis forecasts quantities of waste units generated and maps shifts in environmental impact potentials associated with metal composition changes due to product substitutions. This insight is important to understand the timing and waste quantities expected and the emerging toxic elements needed to be addressed as a consequence of technology transition. At the product level, electronic utility meter devices are evaluated to eliminate hazardous materials within product components. Development and application of a component Toxic Potential Indicator (TPI) assessment methodology highlights priority components requiring material alternatives. Alternative recommendations are provided and substitute materials such as aluminum alloys for stainless steel and high-density polyethylene for polyvinyl chloride and acrylonitrile-based polymers show promise to meet toxicity reduction, cost, and material functionality requirements. Furthermore, the TPI method, an European Union focused screening tool, is customized to reflect regulated U.S. toxicity parameters. Results show that, although it is possible to adopt U.S. parameters into the TPI method, harmonization of toxicity regulation and standards in various nations and regions is necessary to eliminate inconsistencies during hazard screening of substances used globally. As a whole, the present work helps to assimilate material hazard assessment methods into the larger framework of design for environment strategies so toxics use reduction could be achieved for the development and management of electronics and other consumer goods.

  5. Heterogeneous Monolithic Integration of Single-Crystal Organic Materials.

    PubMed

    Park, Kyung Sun; Baek, Jangmi; Park, Yoonkyung; Lee, Lynn; Hyon, Jinho; Koo Lee, Yong-Eun; Shrestha, Nabeen K; Kang, Youngjong; Sung, Myung Mo

    2017-02-01

    Manufacturing high-performance organic electronic circuits requires the effective heterogeneous integration of different nanoscale organic materials with uniform morphology and high crystallinity in a desired arrangement. In particular, the development of high-performance organic electronic and optoelectronic devices relies on high-quality single crystals that show optimal intrinsic charge-transport properties and electrical performance. Moreover, the heterogeneous integration of organic materials on a single substrate in a monolithic way is highly demanded for the production of fundamental organic electronic components as well as complex integrated circuits. Many of the various methods that have been designed to pattern multiple heterogeneous organic materials on a substrate and the heterogeneous integration of organic single crystals with their crystal growth are described here. Critical issues that have been encountered in the development of high-performance organic integrated electronics are also addressed. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  6. US Navy superconductivity program

    NASA Technical Reports Server (NTRS)

    Gubser, Donald U.

    1991-01-01

    Both the new high temperature superconductors (HTS) and the low temperature superconductors (LTS) are important components of the Navy's total plan to integrate superconductivity into field operational systems. Fundamental research is an important component of the total Navy program and focuses on the HTS materials. Power applications (ship propulsion) use LTS materials while space applications (millimeter wave electronics) use HTS materials. The Space Experiment to be conducted at NRL will involve space flight testing of HTS devices built by industry and will demonstrate the ability to engineer and space qualify these devices for systems use. Another important component of the Navy's effort is the development of Superconducting Quantum Interference Device (SQUID) magnetometers. This program will use LTS materials initially, but plans to implement HTS materials as soon as possible. Hybrid HTS/LTS systems are probable in many applications. A review of the status of the Navy's HTS materials research is given as well as an update on the Navy's development efforts in superconductivity.

  7. NASA Tech Briefs, June 1998. Volume 22, No. 6

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage on computer hardware and peripherals, electronic components and circuits, electronic systems, software, materials, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs. and a second special section of Motion Control Tech Briefs

  8. NASA Tech Briefs, October 1999. Volume 23, No. 10

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics include: special coverage section on data acquisition and sensors and sections on electronic components and systems, software, materials, mechanics, machinery/automation, manufacturing/fabrication, bio-medical, physical sciences, information sciences, book and reports, and special section of Electronics Tech Briefs and Motion Control Tech briefs

  9. NASA Tech Briefs, March 1998. Volume 22, No. 3

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage of computer aided design and engineering, electronic components and circuits, electronic systems, physical sciences, materials, computer software, special coverage on mechanical technology, machinery/automation, manufacturing/fabrication, mathematics and information sciences, book and reports, and a special section of Electronics Tech Briefs. Profiles of the exhibitors at the National Design Engineering show are also included in this issue.

  10. Biomaterials-Based Electronics: Polymers and Interfaces for Biology and Medicine

    PubMed Central

    Muskovich, Meredith; Bettinger, Christopher J.

    2012-01-01

    Advanced polymeric biomaterials continue to serve as a cornerstone of new medical technologies and therapies. The vast majority of these materials, both natural and synthetic, interact with biological matter without direct electronic communication. However, biological systems have evolved to synthesize and employ naturally-derived materials for the generation and modulation of electrical potentials, voltage gradients, and ion flows. Bioelectric phenomena can be interpreted as potent signaling cues for intra- and inter-cellular communication. These cues can serve as a gateway to link synthetic devices with biological systems. This progress report will provide an update on advances in the application of electronically active biomaterials for use in organic electronics and bio-interfaces. Specific focus will be granted to the use of natural and synthetic biological materials as integral components in technologies such as thin film electronics, in vitro cell culture models, and implantable medical devices. Future perspectives and emerging challenges will also be highlighted. PMID:23184740

  11. Bi-continuous Multi-component Nanocrystal Superlattices for Solar Energy Conversion

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kagan, Cherie; Murray, Christopher; Kikkawa, James

    2017-06-14

    Our SISGR program studied an emerging class of nanomaterials wherein different combinations of semiconductor or semiconductor and plasmonic nanocrystals (NCs) are self-assembled into three-dimensional multi-component superlattices. The NC assemblies were designed to form bicontinuous semiconductor NC sublattices with type-II energy offsets to drive charge separation onto electron and hole transporting sublattices for collection and introduce plasmonic NCs to increase solar absorption and charge separation. Our group is expert in synthesizing and assembling an extraordinary variety of artificial systems by tailoring the NC building blocks and the superlattice unit cell geometry. Under this DOE BES Materials Chemistry program, we introduced chemicalmore » methods to control inter-particle distance and to dope NC assemblies, which enabled our demonstration of strong electronic communication between NCs and the use of NC thin films as electronic materials. We synthesized, assembled and structurally, spectroscopically, and electrically probed NC superlattices to understand and manipulate the flow of energy and charge toward discovering the design rules and optimizing these complex architectures to create materials that efficiently convert solar radiation into electricity.« less

  12. Cutaway line drawing of STS-34 middeck experiment Polymer Morphology (PM)

    NASA Technical Reports Server (NTRS)

    1989-01-01

    Cutaway line drawing shows components of STS-34 middeck experiment Polymer Morphology (PM). Components include the EAC, heat exchanger, sample cell control (SCC), sample cells, source, interferometer, electronics, carousel drive, infrared (IR) beam, and carousel. PM, a 3M-developed organic materials processing experiment, is designed to explore the effects of microgravity on polymeric materials as they are processed in space. The samples of polymeric materials being studied in the PM experiment are thin films (25 microns or less) approximately 25mm in diameter. The samples are mounted between two infrared transparent windows in a specially designed infrared cell that provides the capability of thermally processing the samples to 200 degrees Celsius with a high degree of thermal control. The samples are mounted on a carousel that allows them to be positioned, one at a time, in the infrared beam where spectra may be acquired. The Generic Electronics Module (GEM) provides all carousel and

  13. NASA Tech Briefs, October 1995. Volume 19, No. 10

    NASA Technical Reports Server (NTRS)

    1995-01-01

    A special focus in this issue is Data acquisition and analysis. Topics covered include : Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; and Mathematics and Information Sciences. Also included in this issue are Laser Tech Briefs and Industry Focus: Motion Control/ Positioning Equipment

  14. NASA Tech Briefs, December 1998. Volume 22, No. 12

    NASA Technical Reports Server (NTRS)

    1998-01-01

    Topics include: special coverage section on design and analysis software, and sections on electronic components and circuits, electronic systems, software, materials, mechanics, machinery/automation, manufacturing/fabrication, physical sciences, and special sections of Photonics Tech Briefs, Motion Control Tech briefs and a Hot Technology File 1999 Resource Guide.

  15. NASA Tech Briefs, March 1995

    NASA Technical Reports Server (NTRS)

    1995-01-01

    This issue contains articles with a special focus on Computer-Aided design and engineering amd a research report on the Ames Research Center. Other subjects in this issue are: Electronic Components and Circuits, Electronic Systems, Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Manufacturing/Fabrication, Mathematics and Information Sciences and Life Sciences

  16. 3D printed porous stainless steel for potential use in medicine

    NASA Astrophysics Data System (ADS)

    Fousová, M.; Kubásek, J.; Vojtěch, D.; Fojt, J.; Čapek, J.

    2017-02-01

    3D printing technologies like Selective Laser Melting (SLM) or Electron Beam Melting (EBM) produce components of very complicated shapes from various kinds of materials. In this work a highly porous (porosity of almost 90 vol. %) stainless steel component was manufactured by SLM. The material was characterized in terms of structure, surface chemistry and mechanical properties. It was observed that mechanical properties of the material were similar to those of trabecular human bone. The tests realized in this work confirmed suitability of the porous material prepared by SLM for the use in medicine, for example, for scaffolds designed to repair bone defects.

  17. OLTARIS: An Efficient Web-Based Tool for Analyzing Materials Exposed to Space Radiation

    NASA Technical Reports Server (NTRS)

    Slaba, Tony; McMullen, Amelia M.; Thibeault, Sheila A.; Sandridge, Chris A.; Clowdsley, Martha S.; Blatting, Steve R.

    2011-01-01

    The near-Earth space radiation environment includes energetic galactic cosmic rays (GCR), high intensity proton and electron belts, and the potential for solar particle events (SPE). These sources may penetrate shielding materials and deposit significant energy in sensitive electronic devices on board spacecraft and satellites. Material and design optimization methods may be used to reduce the exposure and extend the operational lifetime of individual components and systems. Since laboratory experiments are expensive and may not cover the range of particles and energies relevant for space applications, such optimization may be done computationally with efficient algorithms that include the various constraints placed on the component, system, or mission. In the present work, the web-based tool OLTARIS (On-Line Tool for the Assessment of Radiation in Space) is presented, and the applicability of the tool for rapidly analyzing exposure levels within either complicated shielding geometries or user-defined material slabs exposed to space radiation is demonstrated. An example approach for material optimization is also presented. Slabs of various advanced multifunctional materials are defined and exposed to several space radiation environments. The materials and thicknesses defining each layer in the slab are then systematically adjusted to arrive at an optimal slab configuration.

  18. Conjugated polymers/semiconductor nanocrystals hybrid materials--preparation, electrical transport properties and applications.

    PubMed

    Reiss, Peter; Couderc, Elsa; De Girolamo, Julia; Pron, Adam

    2011-02-01

    This critical review discusses specific preparation and characterization methods applied to hybrid materials consisting of π-conjugated polymers (or oligomers) and semiconductor nanocrystals. These materials are of great importance in the quickly growing field of hybrid organic/inorganic electronics since they can serve as active components of photovoltaic cells, light emitting diodes, photodetectors and other devices. The electronic energy levels of the organic and inorganic components of the hybrid can be tuned individually and thin hybrid films can be processed using low cost solution based techniques. However, the interface between the hybrid components and the morphology of the hybrid directly influences the generation, separation and transport of charge carriers and those parameters are not easy to control. Therefore a large variety of different approaches for assembling the building blocks--conjugated polymers and semiconductor nanocrystals--has been developed. They range from their simple blending through various grafting procedures to methods exploiting specific non-covalent interactions between both components, induced by their tailor-made functionalization. In the first part of this review, we discuss the preparation of the building blocks (nanocrystals and polymers) and the strategies for their assembly into hybrid materials' thin films. In the second part, we focus on the charge carriers' generation and their transport within the hybrids. Finally, we summarize the performances of solar cells using conjugated polymer/semiconductor nanocrystals hybrids and give perspectives for future developments.

  19. Advanced Electrical Materials and Components Development: An Update

    NASA Technical Reports Server (NTRS)

    Schwarze, Gene E.

    2005-01-01

    The primary means to develop advanced electrical components is to develop new and improved materials for magnetic components (transformers, inductors, etc.), capacitors, and semiconductor switches and diodes. This paper will give an update of the Advanced Power Electronics and Components Technology being developed by the NASA Glenn Research Center for use in future Power Management and Distribution subsystems used in space power systems for spacecraft and lunar and planetary surface power. The initial description and status of this technology program was presented two years ago at the First International Energy Conversion Engineering Conference held at Portsmouth, Virginia, August 2003. The present paper will give a brief background of the previous work reported and a summary of research performed the past several years on soft magnetic materials characterization, dielectric materials and capacitor developments, high quality silicon carbide atomically smooth substrates, and SiC static and dynamic device characterization under elevated temperature conditions. The rationale for and the benefits of developing advanced electrical materials and components for the PMAD subsystem and also for the total power system will also be briefly discussed.

  20. New World Vistas: Air and Space Power for the 21st Century, Materials Volume.

    DTIC Science & Technology

    1996-06-01

    derivatives from niche (non-silicon) materials: IR sensors, radars, lasers, and high - temperature , adverse-environment electronics. Investment in these...Develop metastable interstitial composites to create extremely high temperatures for destroying chemical biological warfare agents. " Explosives: 1...synthesize of high temperature materials that will be tailored for specific applications/ components. These materials will tend to have microstructures on

  1. 40 CFR 469.40 - Applicability.

    Code of Federal Regulations, 2010 CFR

    2010-07-01

    ... ELECTRICAL AND ELECTRONIC COMPONENTS POINT SOURCE CATEGORY Luminescent Materials Subcategory § 469.40 Applicability. The provisions of this subpart are applicable to discharges resulting from the manufacture of...

  2. Measuring the orbital angular momentum spectrum of an electron beam

    PubMed Central

    Grillo, Vincenzo; Tavabi, Amir H.; Venturi, Federico; Larocque, Hugo; Balboni, Roberto; Gazzadi, Gian Carlo; Frabboni, Stefano; Lu, Peng-Han; Mafakheri, Erfan; Bouchard, Frédéric; Dunin-Borkowski, Rafal E.; Boyd, Robert W.; Lavery, Martin P. J.; Padgett, Miles J.; Karimi, Ebrahim

    2017-01-01

    Electron waves that carry orbital angular momentum (OAM) are characterized by a quantized and unbounded magnetic dipole moment parallel to their propagation direction. When interacting with magnetic materials, the wavefunctions of such electrons are inherently modified. Such variations therefore motivate the need to analyse electron wavefunctions, especially their wavefronts, to obtain information regarding the material's structure. Here, we propose, design and demonstrate the performance of a device based on nanoscale holograms for measuring an electron's OAM components by spatially separating them. We sort pure and superposed OAM states of electrons with OAM values of between −10 and 10. We employ the device to analyse the OAM spectrum of electrons that have been affected by a micron-scale magnetic dipole, thus establishing that our sorter can be an instrument for nanoscale magnetic spectroscopy. PMID:28537248

  3. The Next Technology Revolution - Nano Electronic Technology

    NASA Astrophysics Data System (ADS)

    Turlik, Iwona

    2004-03-01

    Nanotechnology is a revolutionary engine that will engender enormous changes in a vast majority of today's industries and markets, while potentially creating whole new industries. The impact of nanotechnology is particularly significant in the electronics industry, which is constantly driven by the need for higher performance, increased functionality, smaller size and lower cost. Nanotechnology can influence many of the hundreds of components that are typically assembled to manufacture modern electronic devices. Motorola manufactures electronics for a wide range of industries and communication products. In this presentation, the typical components of a cellular phone are outlined and technology requirements for future products, the customer benefits, and the potential impact of nanotechnology on many of the components are discussed. Technology needs include reliable materials supply, processes for high volume production, experimental and simulation tools, etc. For example, even routine procedures such as failure characterization may require the development of new tools for investigating nano-scale phenomena. Business needs include the development of an effective, high volume supply chain for nano-materials and devices, disruptive product platforms, and visible performance impact on the end consumer. An equally significant long-term industry need is the availability of science and engineering graduates with a multidisciplinary focus and a deep understanding of the fundamentals of nano-technology, that can harness the technology to create revolutionary products.

  4. Magnetic excitations in Kondo liquid: superconductivity and hidden magnetic quantum critical fluctuations

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Yang, Yifeng; Urbano, Ricardo; Nicholas, Curro

    2009-01-01

    We report Knight shift experiments on the superconducting heavy electron material CeCoIn{sub 5} that allow one to track with some precision the behavior of the heavy electron Kondo liquid in the superconducting state with results in agreement with BCS theory. An analysis of the {sup 115}In nuclear quadrupole resonance (NQR) spin-lattice relaxation rate T{sub 1}{sup -1} measurements under pressure reveals the presence of 2d magnetic quantum critical fluctuations in the heavy electron component that are a promising candidate for the pairing mechanism in this material. Our results are consistent with an antiferromagnetic quantum critical point (QCP) located at slightly negativemore » pressure in CeCoIn{sub 5} and provide additional evidence for significant similarities between the heavy electron materials and the high T{sub c} cuprates.« less

  5. RECENT DEVELOPMENTS IN HYDROLOGIC INSTRUMENTATION.

    USGS Publications Warehouse

    Latkovich, Vito J.

    1985-01-01

    The availability of space-age materials and implementation of state-of-the-art electronics is making possible the recent developments of hydrologic instrumentation. Material developments include: Synthetic-fiber sounding and tag lines; fiberglass wading rod; polymer (plastic) sheaves, pulleys and sampler components; and polymer (plastic) bucket wheels for current meters. These materials are very cost effective and efficient. Electromechanical and electronic developments and applications include: adaptable data acquisition system; downhole sampler for hazardous substances; current-meter digitizer; hydraulic power/drive system for discharge measurements and water-quality sampling; non-contact water-level sensors; minimum data recorder; acoustic velocity meters, and automated current meter discharge-measurement system.

  6. Electronic structure studies of La2CuO4

    NASA Astrophysics Data System (ADS)

    Wachs, A. L.; Turchi, P. E. A.; Jean, Y. C.; Wetzler, K. H.; Howell, R. H.; Fluss, M. J.; Harshman, D. R.; Remeika, J. P.; Cooper, A. S.; Fleming, R. M.

    1988-07-01

    We report results of positron-electron momentum-distribution measurements of single-crystal La2CuO4 using two-dimensional angular correlation of positron-annihilation-radiation techniques. The data contain two components: a large (~85%), isotropic corelike electron contribution and a remaining, anisotropic valence-electron contribution modeled using a linear combination of atomic orbitals-molecular orbital method and a localized ion scheme, within the independent-particle model approximation. This work suggests a ligand-field Hamiltonian to be justified for describing the electronic properties of perovskite materials.

  7. USSR and Eastern Europe Scientific Abstracts, Electronics and Electrical Engineering, Number 27

    DTIC Science & Technology

    1977-02-10

    input and output conditions. The power section of the circuit is modified to permit triacs and thyristors, respectively, to function. The purpose of the...electronic materials, components, and devices, on circuit theory, pulse techniques, electromagnetic wave propagation, radar, quantum electronic theory...Lasers, Masers, Holography, Quasi-Optical 20 Microelectronics and General Circuit Theory and Information 21 Radars and Radio Wavigati on 22

  8. Metal–Organic Frameworks as Active Materials in Electronic Sensor Devices

    PubMed Central

    Campbell, Michael G.; Dincă, Mircea

    2017-01-01

    In the past decade, advances in electrically conductive metal–organic frameworks (MOFs) and MOF-based electronic devices have created new opportunities for the development of next-generation sensors. Here we review this rapidly-growing field, with a focus on the different types of device configurations that have allowed for the use of MOFs as active components of electronic sensor devices. PMID:28498308

  9. Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses.

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Neilsen, Michael K.; Austin, Kevin N.; Adolf, Douglas Brian

    2011-09-01

    Decisions on material selections for electronics packaging can be quite complicated by the need to balance the criteria to withstand severe impacts yet survive deep thermal cycles intact. Many times, material choices are based on historical precedence perhaps ignorant of whether those initial choices were carefully investigated or whether the requirements on the new component match those of previous units. The goal of this program focuses on developing both increased intuition for generic packaging guidelines and computational methodologies for optimizing packaging in specific components. Initial efforts centered on characterization of classes of materials common to packaging strategies and computational analysesmore » of stresses generated during thermal cycling to identify strengths and weaknesses of various material choices. Future studies will analyze the same example problems incorporating the effects of curing stresses as needed and analyzing dynamic loadings to compare trends with the quasi-static conclusions.« less

  10. ELECTRON MICROSCOPIC OBSERVATIONS OF AMOEBA PROTEUS IN GROWTH AND INANITION

    PubMed Central

    Cohen, Adolph I.

    1957-01-01

    Electron microscopic observations have been made on growing and dividing specimens of Amoeba proteus and also on starving animals. Structures presumably corresponding to the mitochondria, alpha particles, vacuoles, and Golgi material are described. A new entity, designated as a foamy particle, is noted. Descriptions are given of the cytoplasmic and nuclear membranes. During division the inner, thick nuclear membrane component is seen to vanish and the outer membrane persist. Measurements suggest a gradual reappearance of the inner component with growth. Starving animals show a loss of cytoplasmic granularity and an increase in the electron density of mitochondria, presumably due to lipide accumulation. PMID:13481020

  11. Electron microscopic observations of amoeba proteus in growth and inanition.

    PubMed

    COHEN, A I

    1957-11-25

    Electron microscopic observations have been made on growing and dividing specimens of Amoeba proteus and also on starving animals. Structures presumably corresponding to the mitochondria, alpha particles, vacuoles, and Golgi material are described. A new entity, designated as a foamy particle, is noted. Descriptions are given of the cytoplasmic and nuclear membranes. During division the inner, thick nuclear membrane component is seen to vanish and the outer membrane persist. Measurements suggest a gradual reappearance of the inner component with growth. Starving animals show a loss of cytoplasmic granularity and an increase in the electron density of mitochondria, presumably due to lipide accumulation.

  12. Plasmonic integrated circuits comprising metal waveguides, multiplexer/demultiplexer, detectors, and logic circuits on a silicon substrate

    NASA Astrophysics Data System (ADS)

    Fukuda, M.; Ota, M.; Sumimura, A.; Okahisa, S.; Ito, M.; Ishii, Y.; Ishiyama, T.

    2017-05-01

    A plasmonic integrated circuit configuration comprising plasmonic and electronic components is presented and the feasibility for high-speed signal processing applications is discussed. In integrated circuits, plasmonic signals transmit data at high transfer rates with light velocity. Plasmonic and electronic components such as wavelength-divisionmultiplexing (WDM) networks comprising metal wires, plasmonic multiplexers/demultiplexers, and crossing metal wires are connected via plasmonic waveguides on the nanometer or micrometer scales. To merge plasmonic and electronic components, several types of plasmonic components were developed. To ensure that the plasmonic components could be easily fabricated and monolithically integrated onto a silicon substrate using silicon complementary metal-oxide-semiconductor (CMOS)-compatible processes, the components were fabricated on a Si substrate and made from silicon, silicon oxides, and metal; no other materials were used in the fabrication. The plasmonic components operated in the 1300- and 1550-nm-wavelength bands, which are typically employed in optical fiber communication systems. The plasmonic logic circuits were formed by patterning a silicon oxide film on a metal film, and the operation as a half adder was confirmed. The computed plasmonic signals can propagate through the plasmonic WDM networks and be connected to electronic integrated circuits at high data-transfer rates.

  13. Microgravity

    NASA Image and Video Library

    2004-04-15

    The Wake Shield Facility (WSF) is a free-flying research and development facility that is designed to use the pure vacuum of space to conduct scientific research in the development of new materials. The thin film materials technology developed by the WSF could some day lead to applications such as faster electronics components for computers.

  14. Honeycomb chassis for electronic components

    NASA Technical Reports Server (NTRS)

    Read, W. S.; Stebbins, B. W.

    1977-01-01

    In new electronic chassis support, machined honeycomb members are used to change basic relationship between chassis and support structure. Improved chassis combines internal and external support and heat dissipation by altering chassis internal geometry. Honeycomb materials allow mechanical support and thermal load sharing to be combined at lower weight and lower cost than previous equipment.

  15. Stationary Engineers Apprenticeship. Related Training Modules. 5.1-5.17 Electricity/Electronics.

    ERIC Educational Resources Information Center

    Lane Community Coll., Eugene, OR.

    This packet of 17 learning modules on electricity/electronics is one of 20 such packets developed for apprenticeship training for stationary engineers. Introductory materials are a complete listing of all available modules and a supplementary reference list. Each module contains some or all of these components: goal, performance indicators,…

  16. NASA Tech Briefs, Spring/Summer 1982. Volume 6, No. 4

    NASA Technical Reports Server (NTRS)

    1982-01-01

    Topics covered include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; and Machinery.

  17. Ultrathin 2D Photocatalysts: Electronic-Structure Tailoring, Hybridization, and Applications.

    PubMed

    Di, Jun; Xiong, Jun; Li, Huaming; Liu, Zheng

    2018-01-01

    As a sustainable technology, semiconductor photocatalysis has attracted considerable interest in the past several decades owing to the potential to relieve or resolve energy and environmental-pollution issues. By virtue of their unique structural and electronic properties, emerging ultrathin 2D materials with appropriate band structure show enormous potential to achieve efficient photocatalytic performance. Here, the state-of-the-art progress on ultrathin 2D photocatalysts is reviewed and a critical appraisal of the classification, controllable synthesis, and formation mechanism of ultrathin 2D photocatalysts is presented. Then, different strategies to tailor the electronic structure of ultrathin 2D photocatalysts are summarized, including component tuning, thickness tuning, doping, and defect engineering. Hybridization with the introduction of a foreign component and maintaining the ultrathin 2D structure is presented to further boost the photocatalytic performance, such as quantum dots/2D materials, single atoms/2D materials, molecular/2D materials, and 2D-2D stacking materials. More importantly, the advancement of versatile photocatalytic applications of ultrathin 2D photocatalysts in the fields of water oxidation, hydrogen evolution, CO 2 reduction, nitrogen fixation, organic syntheses, and removal pollutants is discussed. Finally, the future opportunities and challenges regarding ultrathin 2D photocatalysts to bring about new opportunities for future research in the field of photocatalysis are also presented. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  18. Electron/Ion Transport Enhancer in High Capacity Li-Ion Battery Anodes

    DOE PAGES

    Kwon, Yo Han; Minnici, Krysten; Huie, Matthew M.; ...

    2016-08-30

    In this paper, magnetite (Fe 3O 4) was used as a model high capacity metal oxide active material to demonstrate advantages derived from consideration of both electron and ion transport in the design of composite battery electrodes. The conjugated polymer, poly[3-(potassium-4-butanoate) thiophene] (PPBT), was introduced as a binder component, while polyethylene glycol (PEG) was coated onto the surface of Fe 3O 4 nanoparticles. The introduction of PEG reduced aggregate size, enabled effective dispersion of the active materials and facilitated ionic conduction. As a binder for the composite electrode, PPBT underwent electrochemical doping which enabled the formation of effective electrical bridgesmore » between the carbon and Fe 3O 4 components, allowing for more efficient electron transport. Additionally, the PPBT carboxylic moieties effect a porous structure, and stable electrode performance. Finally, the methodical consideration of both enhanced electron and ion transport by introducing a carboxylated PPBT binder and PEG surface treatment leads to effectively reduced electrode resistance, which improved cycle life performance and rate capabilities.« less

  19. NASA TEERM Hexavalent Chrome Alternatives Projects

    NASA Technical Reports Server (NTRS)

    Kessel, Kurt R.; Rothgeb, Matthew

    2011-01-01

    The overall objective of the Hex Chrome Free Coatings for Electronics project is to evaluate and test pretreatment coating systems not containing hexavalent chrome in avionics and electronics housing applications. This objective will be accomplished by testing strong performing coating systems from prior NASA and DoD testing or new coating systems as determined by the stakeholders. The technical stakeholders have agreed that this protocol will focus specifically on Class 3 coatings. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or circuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reliability

  20. The first radical-based spintronic memristors: Towards resistive RAMs made of organic magnets

    NASA Astrophysics Data System (ADS)

    Goss, Karin; Krist, Florian; Seyfferle, Simon; Hoefel, Udo; Paretzki, Alexa; Dressel, Martin; Bogani, Lapo; Institut Fuer Anorganische Chemie, University of Stuttgart Collaboration; 1. Physikalisches Institut, University of Stuttgart Team

    2014-03-01

    Using molecules as building blocks for electronic devices offers ample possibilities for new device functionalities due to a chemical tunability much higher than that of standard inorganic materials, and at the same time offers a decrease in the size of the electronic component down to the single-molecule level. Purely organic molecules containing no metallic centers such as organic radicals can serve as an electronic component with magnetic properties due to the unpaired electron in the radical state. Here we present memristive logic units based on organic radicals of the nitronyl-nitroxide kind. Integrating these purely molecular units as a spin coated layer into crossbar arrays, electrically induced unipolar resistive switching is observed with a change in resistance of up to 100%. We introduce a model based on filamentary reorganization of molecules of different oxidation state revealing the importance of the molecular nature for the switching properties. The major role of the oxidation state of these paramagnetic molecules introduces a magnetic field dependence to the device functionality, which goes along with magnetoresistive charactistics observed for the material. These are the first steps towards a spintronic implementation of organic radicals in electronic devices.

  1. Component Repair Experiment-1: An Experiment Evaluating Electronic Component-Level Repair During Spaceflight

    NASA Technical Reports Server (NTRS)

    Easton, John W.; Struk, Peter M.

    2012-01-01

    The Component Repair Experiment-1 (CRE-1) examines the capability for astronauts to perform electronics repair tasks in space. The goal is to determine the current capabilities and limits for the crew, and to make recommendations to improve and expand the range of work that astronauts may perform. CRE-1 provided two-layer, functional circuit boards and replacement components, a small tool kit, written and video training materials, and 1 hr of hands on training for the crew slated to perform the experiment approximately 7 months prior to the mission. Astronauts Michael Fincke and Sandra Magnus performed the work aboard the International Space Station (ISS) in February and March 2009. The astronauts were able to remove and replace components successfully, demonstrating the feasibility of performing component-level electronics repairs within a spacecraft. Several unsuccessful tasks demonstrated areas in need of improvement. These include improved and longer training prior to a mission, an improved soldering iron with a higher operating temperature and steady power source, video training and practice boards for refresher work or practice before a repair, and improved and varied hand tools and containment system.

  2. Building Your Own Web Course: The Case for Off-the-Shelf Component Software.

    ERIC Educational Resources Information Center

    Kaplan, Howard

    1998-01-01

    Compares the features, advantages, and disadvantages of two major software options available for designing web courses: (1) component, off-the shelf software that allows for creation of audio slide lectures, course materials, discussion forums, animations, synchronous chat groups, quiz creators, and electronic mail, and (2) integrated packages…

  3. Microfabricated thermoelectric power-generation devices

    NASA Technical Reports Server (NTRS)

    Fleurial, Jean-Pierre (Inventor); Phillips, Wayne (Inventor); Borshchevsky, Alex (Inventor); Kolawa, Elizabeth A. (Inventor); Ryan, Margaret A. (Inventor); Caillat, Thierry (Inventor); Mueller, Peter (Inventor); Snyder, G. Jeffrey (Inventor); Kascich, Thorsten (Inventor)

    2002-01-01

    A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

  4. Microfabricated thermoelectric power-generation devices

    NASA Technical Reports Server (NTRS)

    Fleurial, Jean-Pierre (Inventor); Ryan, Margaret A. (Inventor); Borshchevsky, Alex (Inventor); Phillips, Wayne (Inventor); Kolawa, Elizabeth A. (Inventor); Snyder, G. Jeffrey (Inventor); Caillat, Thierry (Inventor); Kascich, Thorsten (Inventor); Mueller, Peter (Inventor)

    2004-01-01

    A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

  5. Bionic Nanosystems

    NASA Astrophysics Data System (ADS)

    Sebastian Mannoor, Manu

    Direct multidimensional integration of functional electronics and mechanical elements with viable biological systems could allow for the creation of bionic systems and devices possessing unique and advanced capabilities. For example, the ability to three dimensionally integrate functional electronic and mechanical components with biological cells and tissue could enable the creation of bionic systems that can have tremendous impact in regenerative medicine, prosthetics, and human-machine interfaces. However, as a consequence of the inherent dichotomy in material properties and limitations of conventional fabrication methods, the attainment of truly seamless integration of electronic and/or mechanical components with biological systems has been challenging. Nanomaterials engineering offers a general route for overcoming these dichotomies, primarily due to the existence of a dimensional compatibility between fundamental biological functional units and abiotic nanomaterial building blocks. One area of compelling interest for bionic systems is in the field of biomedical sensing, where the direct interfacing of nanosensors onto biological tissue or the human body could stimulate exciting opportunities such as on-body health quality monitoring and adaptive threat detection. Further, interfacing of antimicrobial peptide based bioselective probes onto the bionic nanosensors could offer abilities to detect pathogenic bacteria with bio-inspired selectivity. Most compellingly, when paired with additive manufacturing techniques such as 3D printing, these characteristics enable three dimensional integration and merging of a variety of functional materials including electronic, structural and biomaterials with viable biological cells, in the precise anatomic geometries of human organs, to form three dimensionally integrated, multi-functional bionic hybrids and cyborg devices with unique capabilities. In this thesis, we illustrate these approaches using three representative bionic systems: 1) Bionic Nanosensors: featuring bio-integrated graphene nanosensors for ubiquitous sensing, 2) Bionic Organs: featuring 3D printed bionic ears with three dimensionally integrated electronics and 3) Bionic Leaves: describing ongoing work in the direction of the creation of a bionic leaf enabled by the integration of plant derived photosynthetic functional units with electronic materials and components into a leaf-shaped hierarchical structure for harvesting photosynthetic bioelectricity.

  6. Robust and Soft Elastomeric Electronics Tolerant to Our Daily Lives.

    PubMed

    Sekiguchi, Atsuko; Tanaka, Fumiaki; Saito, Takeshi; Kuwahara, Yuki; Sakurai, Shunsuke; Futaba, Don N; Yamada, Takeo; Hata, Kenji

    2015-09-09

    Clothes represent a unique textile, as they simultaneously provide robustness against our daily activities and comfort (i.e., softness). For electronic devices to be fully integrated into clothes, the devices themselves must be as robust and soft as the clothes themselves. However, to date, no electronic device has ever possessed these properties, because all contain components fabricated from brittle materials, such as metals. Here, we demonstrate robust and soft elastomeric devices where every component possesses elastomeric characteristics with two types of single-walled carbon nanotubes added to provide the necessary electronic properties. Our elastomeric field effect transistors could tolerate every punishment our clothes experience, such as being stretched (elasticity: ∼ 110%), bent, compressed (>4.0 MPa, by a car and heels), impacted (>6.26 kg m/s, by a hammer), and laundered. Our electronic device provides a novel design principle for electronics and wide range applications even in research fields where devices cannot be used.

  7. Terrestrial Sources of X-Ray Radiation and Their Effects on NASA Flight Hardware

    NASA Technical Reports Server (NTRS)

    Kniffin, Scott

    2016-01-01

    X-rays are an energetic and penetrating form of ionizing electromagnetic radiation, which can degrade NASA flight hardware. The main concern posed by such radiation is degradation of active electronic devices and, in some cases, diodes. Non-electronic components are only damaged at doses that far exceed the point where any electronic device would be destroyed. For the purposes of this document, flight hardware can be taken to mean an entire instrument, the flight electronics within the instrument or the individual microelectronic devices in the flight electronics. This document will discuss and describe the ways in which NASA flight hardware might be exposed to x-rays, what is and isn't a concern, and how to tell the difference. First, we must understand what components in flight hardware may be vulnerable to degradation or failure as a result of being exposed to ionizing radiation, such as x-rays. As stated above, bulk materials (structural metals, plastics, etc.) are generally only affected by ionizing radiation at very high dose levels. Likewise, passive electronic components (e.g. resistors, capacitors, most diodes) are strongly resistant to exposure to x-rays, except at very high doses. The main concerns arise when active components, that is, components like discrete transistors and microelectronic devices, are exposed to ionizing radiation. Active components are designed to respond to minute changes in currents and voltages in the circuit. As such, it is not surprising that exposure to ionizing radiation, which creates ionized and therefore electrically active particles, may degrade the way the hardware performs. For the most part, the mechanism for this degradation is trapping of the charges generated by ionizing radiation by defects in dielectric materials in the hardware. As such, the degree of damage is a function of both the quantity of ionizing radiation exposure and the physical characteristics of the hardware itself. The metric that describes the level of exposure to ionizing radiation is total ionizing dose (TID). The unit of TID is the rad, which is defined as 100 ergs absorbed per gram of material. Dose can be expressed in other units, for example grays (gy), where 1 gy = 100 rads. The actual fluence of radiation needed to deliver a rad depends on the absorbing material, so units of dose are usually stated in reference to the material of interest. That is, for microelectronic devices, the unit of dose is generally rad (Si) or rad (SiO2). However, the definition of absorbed dose in this fashion has the advantage that the type of radiation causing the ionization can be normalized so that a realistic and adequate comparison can be made. The sensitivity of microelectronic parts to TID varies over many orders of magnitude. (Note: Doses to humans are typically expressed in rems-or roentgen-equivalent-man-which measures tissue damage, and depends on the type of radiation, as well as the dose in rads.) Thus far, the "softest" parts tested at NASA showed damage at 500 rads (Si), while parts that are radiation-hardened by design can remain functional to doses on the order of 107 rads (Si). This broad range of sensitivity highlights one of the most important considerations when considering the effects of radiation on electronic parts: In order to determine whether a radiation exposure is a concern for a particular part, one must understand the technologies used in the part and their vulnerabilities to TID damage. A NASA radiation expert should be consulted to obtain such information.

  8. Development of Electronics for Low-Temperature Space Missions

    NASA Technical Reports Server (NTRS)

    Patterson, Richard L.; Hammoud, Ahmad; Dickman, John E.; Gerber, Scott S.; Overton, Eric

    2001-01-01

    Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.

  9. Electronic Structure Approach to Tunable Electronic Properties of Hybrid Organic-Inorganic Perovskites

    NASA Astrophysics Data System (ADS)

    Liu, Garnett; Huhn, William; Mitzi, David B.; Kanai, Yosuke; Blum, Volker

    We present a study of the electronic structure of layered hybrid organic-inorganic perovskite (HOIP) materials using all-electron density-functional theory. Varying the nature of the organic and inorganic layers should enable systematically fine-tuning the carrier properties of each component. Using the HSE06 hybrid density functional including spin-orbit coupling (SOC), we validate the principle of tuning subsystem-specific parts of the electron band structures and densities of states in CH3NH3PbX3 (X=Cl, Br, I) compared to a modified organic component in layered (C6H5C2H4NH3) 2PbX4 (X=Cl, Br, I) and C20H22S4N2PbX4 (X=Cl, Br, I). We show that tunable shifts of electronic levels indeed arise by varying Cl, Br, I as the inorganic components, and CH3NH3+ , C6H5C2H4NH3+ , C20H22S4N22 + as the organic components. SOC is found to play an important role in splitting the conduction bands of the HOIP compounds investigated here. The frontier orbitals of the halide shift, increasing the gap, when Cl is substituted for Br and I.

  10. Determination of domain wall chirality using in situ Lorentz transmission electron microscopy

    DOE PAGES

    Chess, Jordan J.; Montoya, Sergio A.; Fullerton, Eric E.; ...

    2017-02-23

    Controlling domain wall chirality is increasingly seen in non-centrosymmetric materials. Mapping chiral magnetic domains requires knowledge about all the vector components of the magnetization, which poses a problem for conventional Lorentz transmission electron microscopy (LTEM) that is only sensitive to magnetic fields perpendicular to the electron beams direction of travel. The standard approach in LTEM for determining the third component of the magnetization is to tilt the sample to some angle and record a second image. Furthermore, this presents a problem for any domain structures that are stabilized by an applied external magnetic field (e.g. skyrmions), because the standard LTEMmore » setup does not allow independent control of the angle of an applied magnetic field, and sample tilt angle. Here we show that applying a modified transport of intensity equation analysis to LTEM images collected during an applied field sweep, we can determine the domain wall chirality of labyrinth domains in a perpendicularly magnetized material, avoiding the need to tilt the sample.« less

  11. Determination of domain wall chirality using in situ Lorentz transmission electron microscopy

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Chess, Jordan J.; Montoya, Sergio A.; Fullerton, Eric E.

    Controlling domain wall chirality is increasingly seen in non-centrosymmetric materials. Mapping chiral magnetic domains requires knowledge about all the vector components of the magnetization, which poses a problem for conventional Lorentz transmission electron microscopy (LTEM) that is only sensitive to magnetic fields perpendicular to the electron beams direction of travel. The standard approach in LTEM for determining the third component of the magnetization is to tilt the sample to some angle and record a second image. Furthermore, this presents a problem for any domain structures that are stabilized by an applied external magnetic field (e.g. skyrmions), because the standard LTEMmore » setup does not allow independent control of the angle of an applied magnetic field, and sample tilt angle. Here we show that applying a modified transport of intensity equation analysis to LTEM images collected during an applied field sweep, we can determine the domain wall chirality of labyrinth domains in a perpendicularly magnetized material, avoiding the need to tilt the sample.« less

  12. An electromechanical material testing system for in situ electron microscopy and applications.

    PubMed

    Zhu, Yong; Espinosa, Horacio D

    2005-10-11

    We report the development of a material testing system for in situ electron microscopy (EM) mechanical testing of nanostructures. The testing system consists of an actuator and a load sensor fabricated by means of surface micromachining. This previously undescribed nanoscale material testing system makes possible continuous observation of the specimen deformation and failure with subnanometer resolution, while simultaneously measuring the applied load electronically with nanonewton resolution. This achievement was made possible by the integration of electromechanical and thermomechanical components based on microelectromechanical system technology. The system capabilities are demonstrated by the in situ EM testing of free-standing polysilicon films, metallic nanowires, and carbon nanotubes. In particular, a previously undescribed real-time instrumented in situ transmission EM observation of carbon nanotubes failure under tensile load is presented here.

  13. Biomaterials-based electronics: polymers and interfaces for biology and medicine.

    PubMed

    Muskovich, Meredith; Bettinger, Christopher J

    2012-05-01

    Advanced polymeric biomaterials continue to serve as a cornerstone for new medical technologies and therapies. The vast majority of these materials, both natural and synthetic, interact with biological matter in the absence of direct electronic communication. However, biological systems have evolved to synthesize and utilize naturally-derived materials for the generation and modulation of electrical potentials, voltage gradients, and ion flows. Bioelectric phenomena can be translated into potent signaling cues for intra- and inter-cellular communication. These cues can serve as a gateway to link synthetic devices with biological systems. This progress report will provide an update on advances in the application of electronically active biomaterials for use in organic electronics and bio-interfaces. Specific focus will be granted to covering technologies where natural and synthetic biological materials serve as integral components such as thin film electronics, in vitro cell culture models, and implantable medical devices. Future perspectives and emerging challenges will also be highlighted. Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  14. Extremely stretchable and conductive water-repellent coatings for low-cost ultra-flexible electronics

    PubMed Central

    Mates, Joseph E.; Bayer, Ilker S.; Palumbo, John M.; Carroll, Patrick J.; Megaridis, Constantine M.

    2015-01-01

    Rapid advances in modern electronics place ever-accelerating demands on innovation towards more robust and versatile functional components. In the flexible electronics domain, novel material solutions often involve creative uses of common materials to reduce cost, while maintaining uncompromised performance. Here we combine a commercially available paraffin wax–polyolefin thermoplastic blend (elastomer matrix binder) with bulk-produced carbon nanofibres (charge percolation network for electron transport, and for imparting nanoscale roughness) to fabricate adherent thin-film composite electrodes. The simple wet-based process produces composite films capable of sustained ultra-high strain (500%) with resilient electrical performance (resistances of the order of 101–102 Ω sq−1). The composites are also designed to be superhydrophobic for long-term corrosion protection, even maintaining extreme liquid repellency at severe strain. Comprised of inexpensive common materials applied in a single step, the present scalable approach eliminates manufacturing obstacles for commercially viable wearable electronics, flexible power storage devices and corrosion-resistant circuits. PMID:26593742

  15. Enhanced generation and anisotropic Coulomb scattering of hot electrons in an ultra-broadband plasmonic nanopatch metasurface

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Sykes, Matthew E.; Stewart, Jon W.; Akselrod, Gleb M.

    The creation of energetic electrons through plasmon excitation of nanostructures before thermalization has been proposed for a wide number of applications in optical energy conversion and ultrafast nanophotonics. However, the use of "nonthermal" electrons is primarily limited by both a low generation efficiency and their ultrafast decay. We report experimental and theoretical results on the use of broadband plasmonic nanopatch metasurfaces comprising a gold substrate coupled to silver nanocubes that produce large concentrations of hot electrons, which we measure using transient absorption spectroscopy. We find evidence for three subpopulations of nonthermal carriers which we propose arise from anisotropic electron-electron scatteringmore » within sp-bands near the Fermi surface. The bimetallic character of the metasurface strongly impacts the physics, with dissipation occurring primarily in the gold whereas the quantum process of hot electron generation takes place in both components. As a result, our calculations show that the choice of geometry and materials is crucial for producing strong ultrafast nonthermal electron components.« less

  16. Enhanced generation and anisotropic Coulomb scattering of hot electrons in an ultra-broadband plasmonic nanopatch metasurface

    DOE PAGES

    Sykes, Matthew E.; Stewart, Jon W.; Akselrod, Gleb M.; ...

    2017-10-17

    The creation of energetic electrons through plasmon excitation of nanostructures before thermalization has been proposed for a wide number of applications in optical energy conversion and ultrafast nanophotonics. However, the use of "nonthermal" electrons is primarily limited by both a low generation efficiency and their ultrafast decay. We report experimental and theoretical results on the use of broadband plasmonic nanopatch metasurfaces comprising a gold substrate coupled to silver nanocubes that produce large concentrations of hot electrons, which we measure using transient absorption spectroscopy. We find evidence for three subpopulations of nonthermal carriers which we propose arise from anisotropic electron-electron scatteringmore » within sp-bands near the Fermi surface. The bimetallic character of the metasurface strongly impacts the physics, with dissipation occurring primarily in the gold whereas the quantum process of hot electron generation takes place in both components. As a result, our calculations show that the choice of geometry and materials is crucial for producing strong ultrafast nonthermal electron components.« less

  17. Pb-free electronics: from nanotechnology to combinatorial materials science

    NASA Astrophysics Data System (ADS)

    Diaz Gonzalez, Alfredo J.

    The elimination of lead (Pb) from the electronics industry due to a government directive caused problems on the manufacturing and use of electronic components. The current alloys used to attach components have a significant higher processing temperature (~30-40°C) that those containing Pb. The higher processing temperatures cause damage to the electronic components; printed circuit boards (PCB) and represents an increase in energetic costs for the manufacurer. Tin whiskers are out-of-plane structures that grow from tin (Sn) plated surfaces and cause short circuits and metal vapor arc. The electrical connection of components to the PCB relies on leads that are close to each other and are manufactured from tin-plated copper. Materials have shown a tendency to modify their bulk properties depending on powder particle size. Nanoparticle's coalescence temperature tends to decrease as particle size decreases. Exploiting this behavior, a nanoparticle based solder paste has been developed for attaching electronic components at a lower processing temperature to avoid thermally induced damage and reduce energy consumption. Tin nanoparticles were successfully synthesized via a wet chemistry route using tin (II) chloride dihydrated (metal precursor), 1,10-Phenanthroline (surfactant), and sodium borohydride (reducing agent). A flux system was developed based on Ethylene Glycol. Results showed acceptable coalescence of the non-capped nanoparticles at temperatures as low as 200°C with a processing time of 20 minutes. Synthesized nanoparticles with capping agent required higher flux content thus resulting in a poor metallic load paste. A reduction in processing temperature of approximately 40°C have been found when comparing the developed solder paste with typical SAC lead-free solders (~240°C). The electrical behavior was found to be an order of magnitude below that of bulk tin. Compositional libraries have been developed in an attempt to screen, via a high through-put method, alloys that are prone to tin whiskers growth. These libraries are samples containing a range of sub-samples with varying compositions within it than can be processed simultaneously. Using sputtering, a physical vapor deposition technique, a gradient composed of Ag-Cu was deposited over a Sn-plated Cu substrate. After reflow, the growth mechanism of the whiskers was accelerated using the IEC60068-82-2 standard. SEM and EDS analysis was used to charac-terize the growth of the tin whiskers at different elemental compositions. The gradients found across the samples are in accordance with the theoretical geometrical spacing. Tin whiskers were found on control samples, whereas almost all elemental compositions showed mitigation or elimination of the whiskers. This combinatorial material science methodology proved to be an efficient and fast screening method for the plating materials selection process in Pb-free electronics.

  18. NASA Tech Briefs, August 2002. Volume 26, No. 8

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus on computers, electronic components and systems, software, materials, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and Motion control Tech Briefs.

  19. Depth of manual dismantling analysis: a cost-benefit approach.

    PubMed

    Achillas, Ch; Aidonis, D; Vlachokostas, Ch; Karagiannidis, A; Moussiopoulos, N; Loulos, V

    2013-04-01

    This paper presents a decision support tool for manufacturers and recyclers towards end-of-life strategies for waste electrical and electronic equipment. A mathematical formulation based on the cost benefit analysis concept is herein analytically described in order to determine the parts and/or components of an obsolete product that should be either non-destructively recovered for reuse or be recycled. The framework optimally determines the depth of disassembly for a given product, taking into account economic considerations. On this basis, it embeds all relevant cost elements to be included in the decision-making process, such as recovered materials and (depreciated) parts/components, labor costs, energy consumption, equipment depreciation, quality control and warehousing. This tool can be part of the strategic decision-making process in order to maximize profitability or minimize end-of-life management costs. A case study to demonstrate the models' applicability is presented for a typical electronic product in terms of structure and material composition. Taking into account the market values of the pilot product's components, the manual disassembly is proven profitable with the marginal revenues from recovered reusable materials to be estimated at 2.93-23.06 €, depending on the level of disassembly. Copyright © 2013 Elsevier Ltd. All rights reserved.

  20. Bibliography of Soviet Laser Developments, Number 85, September - October 1986.

    DTIC Science & Technology

    1987-11-01

    Ultrashort Pulse Generation, Laser Crystal Growing, Free Electron Lasers , Laser Theory, Laser Biological Effects, Laser Communications, Laser ...liquid, gas, and chemical lasers ; components; nonlinear optics; spectroscopy of laser materials; ultrashort pulse generation; crystal growing; theoretical...30 5. Self-focusing 30 6. Acoustic Interaction ................ 30 G. Spectroscopy of Laser Materials ......... 33 H. Ultrashort

  1. Methods of video and shearography inspection

    NASA Technical Reports Server (NTRS)

    Lansing, Matthew D.; Bullock, Michael W.; Gnacek, William J.

    1995-01-01

    The goal of this research effort was to study methods of video image correlation and electronic shearography for nondestructive evaluation of aerospace components. Methods of physical load application must be developed before interrogations with these methods may be used to qualify hardware. To that end, inspection procedures were developed for a variety of aerospace components and material systems. Experiments were also conducted from which the relationship between the control settings of the electronic shearography apparatus may be related to flaw detectability. A short feasibility study was conducted to determine the applicability of electronic shearography to the determination of the stress intensity factor of a Mode 1 crack tip by measurement of the localized zone of three dimensional plasticity

  2. Implementation Challenges for Ceramic Matrix Composites in High Temperature Applications

    NASA Technical Reports Server (NTRS)

    Singh, Mrityunjay

    2004-01-01

    Ceramic matrix composites are leading candidate materials for a number of applications in aeronautics, space, energy, electronics, nuclear, and transportation industries. In the aeronautics and space exploration systems, these materials are being considered for applications in hot sections of jet engines such as the combustor liner, nozzle components, nose cones, leading edges of reentry vehicles and space propulsion components. Applications in the energy and environmental industries include radiant heater tubes, heat exchangers, heat recuperators, gas and diesel particulate filters (DPFs), and components for land based turbines for power generation. These materials are also being considered for use in the first wall and blanket components of fusion reactors. There are a number of critical issues and challenges related to successful implementation of composite materials. Fabrication of net and complex shape components with high density and tailorable matrix properties is quite expensive, and even then various desirable properties are not achievable. In this presentation, microstructure and thermomechanical properties of composites fabricated by two techniques (chemical vapor infiltration and melt infiltration), will be presented. In addition, critical need for robust joining and assembly technologies in successful implementation of these systems will be discussed. Other implementation issues will be discussed along with advantages and benefits of using these materials for various components in high temperature applications.

  3. Electrical and Optical Measurements of the Bandgap Energy of a Light-Emitting Diode

    ERIC Educational Resources Information Center

    Petit, Matthieu; Michez, Lisa; Raimundo, Jean-Manuel; Dumas, Philippe

    2016-01-01

    Semiconductor materials are at the core of electronics. Most electronic devices are made of semiconductors. The operation of these components is well described by quantum physics which is often a difficult concept for students to understand. One of the intrinsic parameters of semiconductors is their bandgap energy E[subscript g]. In the case of…

  4. NASA Tech Briefs, Winter 1977. Volume 2, No. 4

    NASA Technical Reports Server (NTRS)

    1977-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  5. NASA Tech Briefs, Summer 1979. Volume 4, No. 2

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of neW products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  6. NASA Tech Briefs, Summer 1981. Volume 6, No. 2

    NASA Technical Reports Server (NTRS)

    1981-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  7. NASA Tech Briefs, Winter 1980. Volume 5, No. 4

    NASA Technical Reports Server (NTRS)

    1980-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you In learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  8. NASA Tech Briefs, Fall 1980. Volume 5, No. 3

    NASA Technical Reports Server (NTRS)

    1980-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovatio.ns of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  9. NASA Tech Briefs, Fall 1978. Volume 3, No. 3

    NASA Technical Reports Server (NTRS)

    1978-01-01

    Topics covered: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  10. NASA Tech Briefs, Summer 1984. Volume 8, No. 4

    NASA Technical Reports Server (NTRS)

    1984-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Science.

  11. NASA Tech Briefs, Fall/Winter 1981. Vol. 6, No. 3

    NASA Technical Reports Server (NTRS)

    1981-01-01

    Topics covered: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  12. NASA Tech Briefs, Spring 1978. Volume 3, No. 1

    NASA Technical Reports Server (NTRS)

    1978-01-01

    Topics covered include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  13. NASA Tech Briefs, Winter 1978. Volume 3, No. 4

    NASA Technical Reports Server (NTRS)

    1978-01-01

    Topics covered include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  14. NASA Tech Briefs, Winter 1983. Volume 8, No. 2

    NASA Technical Reports Server (NTRS)

    1983-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences;

  15. NASA Tech Briefs, Winter 1982. Volume 7, No. 2

    NASA Technical Reports Server (NTRS)

    1982-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  16. NASA Tech Briefs, Spring 1981. Volume 6, No. 1

    NASA Technical Reports Server (NTRS)

    1981-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you In learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  17. NASA Tech Briefs, Spring 1984. Volume 8, No. 3

    NASA Technical Reports Server (NTRS)

    1984-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  18. NASA Tech Briefs, Fall 1976. Volume 1, No. 3

    NASA Technical Reports Server (NTRS)

    1976-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of seloc.ted Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  19. NASA Tech Briefs, Summer 1978

    NASA Technical Reports Server (NTRS)

    1978-01-01

    Topics covered include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Solar Energy; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  20. NASA Tech Briefs, Winter 1979. Volume 4, No. 4

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you In learning about and applying NASA technology; New Product Ideas: A summary of selected Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  1. NASA Tech Briefs, Fall 1977. Volume 2, No. 3

    NASA Technical Reports Server (NTRS)

    1977-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  2. NASA Tech Briefs, Summer 1980. Volume 5, No. 2

    NASA Technical Reports Server (NTRS)

    1980-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  3. NASA Tech Briefs, Spring 1977. Volume 2, No. 1

    NASA Technical Reports Server (NTRS)

    1977-01-01

    Topics: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selted innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  4. NASA Tech Briefs, August 1995. Volume 19, No. 8

    NASA Technical Reports Server (NTRS)

    1995-01-01

    There is a special focus on computer graphics and simulation in this issue. Topics covered include : Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Computer programs, Mechanics; Machinery; Fabrication Technology; and Mathematics and Information Sciences. There is a section on for Laser Technology, which includes a feature on Moving closer to the suns power.

  5. NASA Tech Briefs, Fall 1982. Volume 7, No. 1

    NASA Technical Reports Server (NTRS)

    1982-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the develop ment of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  6. NASA Tech Briefs, Spring 1979. Volume 4, No. 1

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Topics covered include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences;

  7. NASA Tech Briefs, Fall 1983. Volume 8, No. 1

    NASA Technical Reports Server (NTRS)

    1983-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  8. NASA Tech Briefs, Winter 1976. Volume 1, No. 4

    NASA Technical Reports Server (NTRS)

    1976-01-01

    Topics covered include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of val ue to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  9. NASA Tech Briefs Index, 1976. [bibliography

    NASA Technical Reports Server (NTRS)

    1976-01-01

    Abstracts of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electronic systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences.

  10. NASA Tech Briefs, Summer 1977. Volume 2, No. 2

    NASA Technical Reports Server (NTRS)

    1977-01-01

    Topics: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected Innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  11. NASA Tech Briefs, Spring 1983. Volume 7, No. 3

    NASA Technical Reports Server (NTRS)

    1983-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences;

  12. NASA Tech Briefs, Spring 1980. Volume 5, No. 1

    NASA Technical Reports Server (NTRS)

    1980-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  13. NASA Tech Briefs, Fall 1979. Volume 4, No. 3

    NASA Technical Reports Server (NTRS)

    1979-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences.

  14. NASA Tech Briefs, Summer 1983. Volume 7, No. 4

    NASA Technical Reports Server (NTRS)

    1983-01-01

    Topics include: NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology. New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products; Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and information Sciences.

  15. Low Voltage Alarm Apprenticeship. Related Training Modules. 2.1-5.3 Electricity/Electronics.

    ERIC Educational Resources Information Center

    Lane Community Coll., Eugene, OR.

    This packet of 29 learning modules on electricity/electronics is 1 of 8 such packets developed for apprenticeship training for low voltage alarm. Introductory materials are a complete listing of all available modules and a supplementary reference list. Each module contains some or all of these components: goal, performance indicators, study guide…

  16. White organic light-emitting diodes with Zn-complexes.

    PubMed

    Kim, Dong-Eun; Shin, Hoon-Kyu; Kim, Nam-Kyu; Lee, Burm-Jong; Kwon, Young-Soo

    2014-02-01

    This paper reviews OLEDs fabricated using Zn-complexes. Zn(HPB)2, Zn(HPB)q, and Zn(phen)q were synthesized as new electroluminescence materials. The electron affinity (EA) and ionization potential (IP) of Zn complexes were also determined and devices were characterized. Zn complexes such as Zn(HPB)2, Zn(HPB)q, and Zn(phen)q were found to exhibit blue and yellow emissions with wavelengths of 455, 532, and 535 nm, respectively. On the other hand, Zn(HPB)2 and Zn(HPB)q were applied as hole-blocking materials. As a result, the OLED efficiency by using Zn(HPB)2 as a hole-blocking material was improved. In particular, the OLED property of Zn(HPB)2 was found to be better than that of Zn(HPB)q. Moreover, Zn(phen)q was used as an electron-transporting material and compared with Alq3. The performance of the device with Zn(phen)q as an electron-transporting material was improved compared with Alq3-based devices. The Zn complexes can possibly be used as hole-blocking and electron-transporting materials in OLED devices. A white emission was ultimately realized from the OLED devices using Zn-complexes as inter-layer components.

  17. Aromatic/aliphatic diamine derivatives for advanced compositions and polymers

    NASA Technical Reports Server (NTRS)

    Delozier, Donovan M. (Inventor); Connell, John W. (Inventor); Smith, Jr., Joseph G. (Inventor); Watson, Kent A. (Inventor)

    2010-01-01

    Novel compositions of matter comprise certain derivatives of 9,9-dialkyl fluorene diamine (AFDA). The resultant compositions, whether compositions of matter or monomers that are subsequently incorporated into a polymer, are unique and useful in a variety of applications. Useful applications of AFDA-based material include heavy ion radiation shielding components and components of optical and electronic devices.

  18. High heat flux testing of CFC composites for the tokamak physics experiment

    NASA Astrophysics Data System (ADS)

    Valentine, P. G.; Nygren, R. E.; Burns, R. W.; Rocket, P. D.; Colleraine, A. P.; Lederich, R. J.; Bradley, J. T.

    1996-10-01

    High heat flux (HHF) testing of carbon fiber reinforced carbon composites (CFC's) was conducted under the General Atomics program to develop plasma-facing components (PFC's) for Princeton Plasma Physics Laboratory's tokamak physics experiment (TPX). As part of the process of selecting TPX CFC materials, a series of HHF tests were conducted with the 30 kW electron beam test system (EBTS) facility at Sandia National Laboratories, and with the plasma disruption simulator I (PLADIS-I) facility at the University of New Mexico. The purpose of the tests was to make assessments of the thermal performance and erosion behavior of CFC materials. Tests were conducted with 42 different CFC materials. In general, the CFC materials withstood the rapid thermal pulse environments without fracturing, delaminating, or degrading in a non-uniform manner; significant differences in thermal performance, erosion behavior, vapor evolution, etc. were observed and preliminary findings are presented below. The CFC's exposed to the hydrogen plasma pulses in PLADIS-I exhibited greater erosion rates than the CFC materials exposed to the electron-beam pulses in EBTS. The results obtained support the continued consideration of a variety of CFC composites for TPX PFC components.

  19. Soft Active Materials for Actuation, Sensing, and Electronics

    NASA Astrophysics Data System (ADS)

    Kramer, Rebecca Krone

    Future generations of robots, electronics, and assistive medical devices will include systems that are soft and elastically deformable, allowing them to adapt their morphology in unstructured environments. This will require soft active materials for actuation, circuitry, and sensing of deformation and contact pressure. The emerging field of soft robotics utilizes these soft active materials to mimic the inherent compliance of natural soft-bodied systems. As the elasticity of robot components increases, the challenges for functionality revert to basic questions of fabrication, materials, and design - whereas such aspects are far more developed for traditional rigid-bodied systems. This thesis will highlight preliminary materials and designs that address the need for soft actuators and sensors, as well as emerging fabrication techniques for manufacturing stretchable circuits and devices based on liquid-embedded elastomers.

  20. Photoinitated charge separation in a hybrid titanium dioxide metalloporphyrin peptide material

    NASA Astrophysics Data System (ADS)

    Fry, H. Christopher; Liu, Yuzi; Dimitrijevic, Nada M.; Rajh, Tijana

    2014-08-01

    In natural systems, electron flow is mediated by proteins that spatially organize donor and acceptor molecules with great precision. Achieving this guided, directional flow of information is a desirable feature in photovoltaic media. Here, we design self-assembled peptide materials that organize multiple electronic components capable of performing photoinduced charge separation. Two peptides, c16-AHL3K3-CO2H and c16-AHL3K9-CO2H, self-assemble into fibres and provide a scaffold capable of binding a metalloporphyrin via histidine axial ligation and mineralize titanium dioxide (TiO2) on the lysine-rich surface of the resulting fibrous structures. Electron paramagnetic resonance studies of this self-assembled material under continuous light excitation demonstrate charge separation induced by excitation of the metalloporphyrin and mediated by the peptide assembly structure. This approach to dye-sensitized semiconducting materials offers a means to spatially control the dye molecule with respect to the semiconducting material through careful, strategic peptide design.

  1. Low-Temperature Power Electronics Program

    NASA Technical Reports Server (NTRS)

    Patterson, Richard L.; Dickman, John E.; Hammoud, Ahmad; Gerber, Scott

    1997-01-01

    Many space and some terrestrial applications would benefit from the availability of low-temperature electronics. Exploration missions to the outer planets, Earth-orbiting and deep-space probes, and communications satellites are examples of space applications which operate in low-temperature environments. Space probes deployed near Pluto must operate in temperatures as low as -229 C. Figure 1 depicts the average temperature of a space probe warmed by the sun for various locations throughout the solar system. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. The development of electrical power systems capable of extremely low-temperature operation represents a key element of some advanced space power systems. The Low-Temperature Power Electronics Program at NASA Lewis Research Center focuses on the design, fabrication, and characterization of low-temperature power systems and the development of supporting technologies for low-temperature operations such as dielectric and insulating materials, power components, optoelectronic components, and packaging and integration of devices, components, and systems.

  2. NASA Tech Briefs, November 2001. Volume 25, No. 11

    NASA Technical Reports Server (NTRS)

    2001-01-01

    Topics include: special coverage section on data acquisition, and sections on electronic components and systems, software, materials, machinery/automation, physical sciences, book and reports, and a special section of Photonics Tech Briefs.

  3. NASA Tech Briefs, June 2002. Volume 26, No. 6

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus on data acquisition, electronic components and systems, software, materials, mechanics, machinery/automation, physical sciences, book and reports, motion control, and a special section of Photonics Tech Briefs.

  4. NASA Tech Briefs, September 2001. Volume 25, No. 9

    NASA Technical Reports Server (NTRS)

    2001-01-01

    Topics include: special coverage section on sensors, and sections on electronic components systems, software, materials, machinery/automation, manufacturing/fabrication, bio-medical, book and reports, and a special section of Photonics Tech Briefs.

  5. NASA Tech Briefs, May 2002. Volume 26, No. 5

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus on engineering materials, electronic components and circuits, software, mechanics, machinery/automation, manufacturing, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs.

  6. NASA Tech Briefs, September 2002. Volume 26, No. 9

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus on data acquisition, electronic components and systems, software, materials, mechanics, machinery/automation, bio-medical, physical sciences, book and reports, and a special section of Photonics Tech Briefs.

  7. Laplace-Pressure Actuation of Liquid Metal Devices For Reconfigurable Electromagnetics

    NASA Astrophysics Data System (ADS)

    Cumby, Brad Lee

    Present day electronics are now taking on small form factors, unexpected uses, adaptability, and other features that only a decade ago were unimaginable even for most engineers. These electronic devices, such as tablets, smart phones, wearable sensors, and others, have further had a profound impact on how society interacts, works, maintains health, etc. To optimize electronics a growing trend has been to both minimize the physical space taken up by the individual electronic components as well as to maximize the number of functionalities in a single electronic device, forming a compact and efficient package. To accomplish this challenge in one step, many groups have used a design that has reconfigurable electromagnetic properties, maximizing the functionality density of the device. This would allow the replacement of multiple individual components into an integrated system that would achieve a similar result as the separate individual devices while taking up less space. For example, could a device have a reconfigurable antenna, allowing it optimal communication in various settings and across multiple communication bands, thus increasing functionality, range, and even reducing total device size. Thus far a majority of such reconfigurable devices involve connecting/disconnecting various physically static layouts to achieve a summation of individual components that give rise to multiple effects. However, this is not an ideal situation due to the fact that the individual components whether connected or not are taking up real-estate as well as electrical interference with adjacent connected components. This dissertation focuses on the reconfigurability of the metallic component of the electronic device, specifically microwave devices. This component used throughout this dissertation is that of an eutectic liquid metal alloy. The liquid metal allows the utilization of both the inherent compact form (spherical shape) of a liquid in the lowest energy state and the fact that it is resilient and shapeable to allow for reconfigurability. In this dissertation, first background information is given on the existing technology for reconfigurable microwave devices and the basic principles that these mechanisms are based upon. Then a new reconfigurable method is introduced that utilizes Laplace pressure. Materials that are associated with using liquid metals are discussed and an overall systematic view is given to provide a set of proof of concepts that are more applied and understandable by electronic designers and engineers. Finally a novel approach to making essential measurements of liquid metal microwave devices is devised and discussed. This dissertation encompasses a complete device design from materials used for fabrication, fabrication methods and measurement processes to provide a knowledge base for designing liquid metal microwave devices.

  8. Materials International Space Station Experiment (MISSE) Arrival

    NASA Image and Video Library

    2017-10-02

    The Materials International Space Station Experiment-Flight Facility, or MISSE-FF, hardware arrived at the Space Station Processing Facility low bay at NASA's Kennedy Space Center in Florida. Technicians assist as one of the components is lowered and secured onto another MISSE component. MISSE will be used to test various materials and computing elements on the exterior of the space station. They will be exposed to the harsh environment of low-Earth orbit, including to a vacuum, atomic oxygen, ultraviolet radiation, direct sunlight and extreme heat and cold. The experiment will provide a better understanding of material durability, from coatings to electronic sensors, which could be applied to future spacecraft designs. MISSE will be delivered to the space station on a future commercial resupply mission.

  9. Materials International Space Station Experiment (MISSE) Arrival

    NASA Image and Video Library

    2017-10-02

    The Materials International Space Station Experiment-Flight Facility, or MISSE-FF, hardware arrived at the Space Station Processing Facility low bay at NASA's Kennedy Space Center in Florida. Technicians assist as one of the components is lowered onto another MISSE component. MISSE will be used to test various materials and computing elements on the exterior of the space station. They will be exposed to the harsh environment of low-Earth orbit, including to a vacuum, atomic oxygen, ultraviolet radiation, direct sunlight and extreme heat and cold. The experiment will provide a better understanding of material durability, from coatings to electronic sensors, which could be applied to future spacecraft designs. MISSE will be delivered to the space station on a future commercial resupply mission.

  10. Methods for fabrication of flexible hybrid electronics

    NASA Astrophysics Data System (ADS)

    Street, Robert A.; Mei, Ping; Krusor, Brent; Ready, Steve E.; Zhang, Yong; Schwartz, David E.; Pierre, Adrien; Doris, Sean E.; Russo, Beverly; Kor, Siv; Veres, Janos

    2017-08-01

    Printed and flexible hybrid electronics is an emerging technology with potential applications in smart labels, wearable electronics, soft robotics, and prosthetics. Printed solution-based materials are compatible with plastic film substrates that are flexible, soft, and stretchable, thus enabling conformal integration with non-planar objects. In addition, manufacturing by printing is scalable to large areas and is amenable to low-cost sheet-fed and roll-to-roll processes. FHE includes display and sensory components to interface with users and environments. On the system level, devices also require electronic circuits for power, memory, signal conditioning, and communications. Those electronic components can be integrated onto a flexible substrate by either assembly or printing. PARC has developed systems and processes for realizing both approaches. This talk presents fabrication methods with an emphasis on techniques recently developed for the assembly of off-the-shelf chips. A few examples of systems fabricated with this approach are also described.

  11. Highly Conductive Nano-Silver Circuits by Inkjet Printing

    NASA Astrophysics Data System (ADS)

    Zhu, Dongbin; Wu, Minqiang

    2018-06-01

    Inkjet technology has become popular in the field of printed electronics due to its superior properties such as simple processes and printable complex patterns. Electrical conductivity of the circuits is one of the key factors in measuring the performance of printed electronics, which requires great material properties and a manufactured process. With excellent conductivity and ductility, silver is an ideal material as the wire connecting components. This review summarizes the progress of conductivity studies on inkjet printed nano-silver lines, including ink composition and nanoparticle morphology, deposition of nano-silver lines with uniform and high aspect ratios, sintering mechanisms and alternative methods of thermal sintering. Finally, the research direction on inkjet printed electronics is proposed.

  12. Spectroscopic detection and analysis of atomic emissions during industrial pulsed laser-drilling of structural aerospace alloys

    NASA Astrophysics Data System (ADS)

    Bright, Robin Michael

    The ability to adequately cool internal gas-turbine engine components in next-generation commercial and military aircraft is of extreme importance to the aerospace industry as the demand for high-efficiency engines continues to push operating temperatures higher. Pulsed laser-drilling is rapidly becoming the preferred method of creating cooling holes in high temperature components due a variety of manufacturing advantages of laser-drilling over conventional hole-drilling techniques. As cooling requirements become more demanding, the impact of drilling conditions on material removal behavior and subsequent effects on hole quality becomes critical. In this work, the development of emission spectroscopy as a method to probe the laser-drilling process is presented and subsequently applied to the study of material behavior of various structural aerospace materials during drilling. Specifically, emitted photons associated with energy level transitions within excited neutral atoms in material ejected during drilling were detected and analyzed. Systematic spectroscopic studies indicated that electron energy level populations and calculated electron temperatures within ejected material are dependent on both laser pulse energy and duration. Local thermal conditions detected by the developed method were related to the characteristics of ejected material during drilling and to final hole quality. Finally, methods of utilizing the observed relationships for spectroscopic process monitoring and control were demonstrated.

  13. Future opportunities for advancing glucose test device electronics.

    PubMed

    Young, Brian R; Young, Teresa L; Joyce, Margaret K; Kennedy, Spencer I; Atashbar, Massood Z

    2011-09-01

    Advancements in the field of printed electronics can be applied to the field of diabetes testing. A brief history and some new developments in printed electronics components applicable to personal test devices, including circuitry, batteries, transmission devices, displays, and sensors, are presented. Low-cost, thin, and lightweight materials containing printed circuits with energy storage or harvest capability and reactive/display centers, made using new printing/imaging technologies, are ideal for incorporation into personal-use medical devices such as glucose test meters. Semicontinuous rotogravure printing, which utilizes flexible substrates and polymeric, metallic, and/or nano "ink" composite materials to effect rapidly produced, lower-cost printed electronics, is showing promise. Continuing research advancing substrate, "ink," and continuous processing development presents the opportunity for research collaboration with medical device designers. © 2011 Diabetes Technology Society.

  14. High‐Volume Processed, ITO‐Free Superstrates and Substrates for Roll‐to‐Roll Development of Organic Electronics

    PubMed Central

    Hösel, Markus; Angmo, Dechan; Søndergaard, Roar R.; dos Reis Benatto, Gisele A.; Carlé, Jon E.; Jørgensen, Mikkel

    2014-01-01

    The fabrication of substrates and superstrates prepared by scalable roll‐to‐roll methods is reviewed. The substrates and superstrates that act as the flexible carrier for the processing of functional organic electronic devices are an essential component, and proposals are made about how the general availability of various forms of these materials is needed to accelerate the development of the field of organic electronics. The initial development of the replacement of indium‐tin‐oxide (ITO) for the flexible carrier materials is described and a description of how roll‐to‐roll processing development led to simplification from an initially complex make‐up to higher performing materials through a more simple process is also presented. This process intensification through process simplification is viewed as a central strategy for upscaling, increasing throughput, performance, and cost reduction. PMID:27980893

  15. Mechanisms of high-gradient microwave breakdown on metal surfaces in high power microwave source

    NASA Astrophysics Data System (ADS)

    Xie, Jialing; Chen, Changhua; Chang, Chao; Wu, Cheng; Huo, Yankun

    2017-12-01

    A breakdown cavity was designed to study the high-gradient microwave breakdown on a metal surface. The breakdown cavity can be distinguished into an electron emission boundary and a bombardment boundary as there is an evident difference in amplitude of the electric field between the two planes in the cavity. Breakdown tracks on the cavity were studied with an electron scanning microscope. The tracks on the electron emission boundary with the higher electric field were eroded; a component analysis indicates that these tracks contain an emission boundary material. On the bombardment boundary with a lower electric field, two kinds of tracks exist: an erosion track containing a bombardment boundary material and a sputtered track containing an emission boundary material. From these tracks, the mechanisms of high-gradient microwave breakdown on a metal surface have been analyzed.

  16. Depth of manual dismantling analysis: A cost–benefit approach

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Achillas, Ch., E-mail: c.achillas@ihu.edu.gr; Aidonis, D.; Vlachokostas, Ch.

    Highlights: ► A mathematical modeling tool for OEMs. ► The tool can be used by OEMs, recyclers of electr(on)ic equipment or WEEE management systems’ regulators. ► The tool makes use of cost–benefit analysis in order to determine the optimal depth of product disassembly. ► The reusable materials and the quantity of metals and plastics recycled can be quantified in an easy-to-comprehend manner. - Abstract: This paper presents a decision support tool for manufacturers and recyclers towards end-of-life strategies for waste electrical and electronic equipment. A mathematical formulation based on the cost benefit analysis concept is herein analytically described in ordermore » to determine the parts and/or components of an obsolete product that should be either non-destructively recovered for reuse or be recycled. The framework optimally determines the depth of disassembly for a given product, taking into account economic considerations. On this basis, it embeds all relevant cost elements to be included in the decision-making process, such as recovered materials and (depreciated) parts/components, labor costs, energy consumption, equipment depreciation, quality control and warehousing. This tool can be part of the strategic decision-making process in order to maximize profitability or minimize end-of-life management costs. A case study to demonstrate the models’ applicability is presented for a typical electronic product in terms of structure and material composition. Taking into account the market values of the pilot product’s components, the manual disassembly is proven profitable with the marginal revenues from recovered reusable materials to be estimated at 2.93–23.06 €, depending on the level of disassembly.« less

  17. Teaching Reciprocal Space to Undergraduates via Theory and Code Components of an IPython Notebook

    ERIC Educational Resources Information Center

    Srnec, Matthew N.; Upadhyay, Shiv; Madura, Jeffrey D.

    2016-01-01

    In this technology report, a tool is provided for teaching reciprocal space to undergraduates in physical chemistry and materials science courses. Reciprocal space plays a vital role in understanding a material's electronic structure and physical properties. Here, we provide an example based on previous work in the "Journal of Chemical…

  18. Research on Materials and Components for Opto-Electronic Signal Processing and Computing.

    DTIC Science & Technology

    1986-12-30

    structure consists of alternating layers of 100 A thick In 0 .12Ga 0 .88 As quan- tum wells and 150 A thick GaAs barriers, ten layers each. Nomarski optical...because it has six times as many quantum wells. 4 Electro-refraction was measured interferometrically as it was previously in bulk materials.(12) The

  19. Hybrid Composite Material and Solid Particle Erosion Studies

    NASA Astrophysics Data System (ADS)

    Chellaganesh, D.; Khan, M. Adam; Ashif, A. Mohamed; Ragul Selvan, T.; Nachiappan, S.; Winowlin Jappes, J. T.

    2018-04-01

    Composite is one of the predominant material for most challenging engineering components. Most of the components are in the place of automobile structure, aircraft structures, and wind turbine blade and so on. At the same all the components are indulged to mechanical loading. Recent research on composite material are machinability, wear, tear and corrosion studies. One of the major issue on recent research was solid particle air jet erosion. In this paper hybrid composite material with and without filler. The fibre are in the combination of hemp – kevlar (60:40 wt.%) as reinforcement using epoxy as a matrix. The natural material palm and coconut shell are used as filler materials in the form of crushed powder. The process parameter involved are air jet velocity, volume of erodent and angle of impingement. Experiment performed are in eight different combinations followed from 2k (k = 3) factorial design. From the investigation surface morphology was studied using electron microscope. Mass change with respect to time are used to calculate wear rate and the influence of the process parameters. While solid particle erosion the hard particle impregnates in soft matrix material. Influence of filler material has reduced the wear and compared to plain natural composite material.

  20. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne

    The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

  1. NASA Tech Briefs Index, 1978. [bibliography

    NASA Technical Reports Server (NTRS)

    1978-01-01

    Approximately 601 announcements of new technology derived from the research and development activities of the National Aeronautics and Space Administration are presented. Emphasis is placed on information considered likely to be transferrable across industrial, regional, or disciplinary lines. Subject matter covered includes: electronic components and circuits; electron systems; physical sciences; materials; life sciences; mechanics; machinery; fabrication technology; and mathematics and information sciences.

  2. NASA Tech Briefs, Summer 1976. Volume 1, No. 2

    NASA Technical Reports Server (NTRS)

    1976-01-01

    Topics covered include: Electronic Components and Circuits; Electronic Systems; Physical Sciences; Materials; Life Sciences; Mechanics; Machinery; Fabrication Technology; Mathematics and Information Sciences. Also included are; NASA TU Services: Technology Utilization services that can assist you in learning about and applying NASA technology; and New Product Ideas: A summary of selected innovations of value to manufacturers for the development of new products.

  3. A study of muscular tissue of animal origin by reflection-spectroscopy methods

    NASA Astrophysics Data System (ADS)

    Plotnikova, L. V.; Nechiporenko, A. P.; Orekhova, S. M.; Plotnikov, P. P.; Ishevskii, A. L.

    2017-06-01

    A comparative analysis of the spectral characteristics of the surface of muscular tissue of animal origin (pork) and its main components has been performed by the methods of diffuse reflection electronic spectroscopy (DRES) and frustrated total internal reflection IR spectroscopy. The experiments have shown that the application of the DRES method makes it possible to detect more pronounced changes in the surface optical characteristics of muscular tissue and obtain electronic spectra containing information about the component composition of its main parts under successive extraction of sarcoplasmic materials, myofibrillar proteins of the actomyosin complex, and stroma mucopolysaccharides.

  4. Effects of the Electronic Spin-Orbit Interaction on the Anomalous Asymmetric Scattering of the Spin-Polarized He+ Beam with Paramagnetic Target Materials II. Partial Wave Representation

    NASA Astrophysics Data System (ADS)

    Sakai, Osamu; Suzuki, Taku T.

    2018-05-01

    The scattering of an electron-spin-polarized 4He+ beam on paramagnetic materials has an anomalously large asymmetric scattering component (ASC) around 10%, which is 104 times that expected from the spin-orbit coupling for the potential of the target nucleus. The scattering angle (θ) dependence of the ASC has been measured. It changes sign near 90° for some materials (for example, Au and Pt), while it does not change sign for other materials (for example, Pb and Bi). It has been noted that the spin-orbit interaction of electrons on the target in the electron-transfer intermediate state causes the ASC of He nucleus motion, and it has also been predicted that the sign change in the θ dependence occurs when the d electron transfer is dominant. This seems to correspond to the cases of Au and Pt, but not to the cases of Pb and Bi. The previous approach is refined on the basis of the partial wave representation, which can give a more correct estimation of the ASC. It is shown that the sign change appears in the weak-resonance domain in the case of d electron excitation, whereas the sign change disappears in the strong-resonance domain. Our calculated results qualitatively agree with the material dependence of the ASC observed experimentally.

  5. NASA Tech Briefs, November 2002. Volume 26, No. 11

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus on engineering materials, electronic components and systems, software, mechanics, machinery/automation, manufacturing, bio-medical, physical sciences, information sciences book and reports, and a special section of Photonics Tech Briefs.

  6. NASA Tech Briefs, August 2001. Volume 25, No. 8

    NASA Technical Reports Server (NTRS)

    2001-01-01

    Topics include: special coverage section on computers and peripherals, and sections on electronic components systems, software, materials, mechanics, manufacturing/fabrication, physical sciences, book and reports, and a special section of Motion Control Tech Briefs.

  7. NASA Tech Briefs, March 2002. Volume 26, No. 3

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a special section on data acquisition, software, electronic components and systems, materials, computer programs, mechanics, machinery/automation, manufacturing, biomedical, physical sciences, book and reports, and a special section of Photonics Tech Briefs.

  8. NASA Tech Briefs, July 2002. Volume 26, No. 7

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include: a technology focus sensors, software, electronic components and systems, materials, mechanics, machinery/automation, manufacturing, bio-medical, physical sciences, information sciences, book and reports, and a special section of Photonics Tech Briefs.

  9. Neptune's inner magnetosphere and aurora: Energetic particle constraints

    NASA Technical Reports Server (NTRS)

    Mauk, B. H.; Krimigis, S. M.; Acuna, M. H.

    1994-01-01

    A dramatic and peculiar dropout of greater than 500-keV ions (but not electrons) was observed within Neptune's inner magnetosphere near 2 R(sub N) as the Voyager 2 spacecraft approached the planet. Unlike a number of other energetic particle features this feature could not be accounted for by known material bodies in the context of the most utilized magnetic field models (neither the offset tilted dipole models nor the spehrical harmonic model 'O8'). However, the configuration of Neptune's inner magnetosphere is highly uncertain. By applying a novel technique, utilizing energetic particle measurements, to constrain the magnetic field configuration of the inner regions, we show that appeals to unobserved materials within Neptune's system are unnecessary, and that the ion dropout feature was, in all likelihood, the result of ion interactions with maximum L excursions of the ring 1989N1R. The constraints also favor the se of the M2 magnetic field model (Selesnick, 1992) over the previous models. An electron feature was probably absent because the electron interactions with the ring occurred substantially before the ion interactions (about 2 hours for the electrons versus a few minutes for the ions). Pitch-angle scattering apparently eliminated the electron signature. Minimum scattering rates determined based on this premise yield enough electron precipitation power to explain the brightest component of Neptune's aurora. We propose that this bright component is analogous to the Earth's diffuse aurora.

  10. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components.

    PubMed

    Rahman, Mohd Nizam Ab; Zubir, Noor Suhana Mohd; Leuveano, Raden Achmad Chairdino; Ghani, Jaharah A; Mahmood, Wan Mohd Faizal Wan

    2014-12-02

    The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers' high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s).

  11. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components

    PubMed Central

    Rahman, Mohd Nizam Ab.; Zubir, Noor Suhana Mohd; Leuveano, Raden Achmad Chairdino; Ghani, Jaharah A.; Mahmood, Wan Mohd Faizal Wan

    2014-01-01

    The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers’ high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s). PMID:28788270

  12. Passive and electro-optic polymer photonics and InP electronics integration

    NASA Astrophysics Data System (ADS)

    Zhang, Z.; Katopodis, V.; Groumas, P.; Konczykowska, A.; Dupuy, J.-.; Beretta, A.; Dede, A.; Miller, E.; Choi, J. H.; Harati, P.; Jorge, F.; Nodjiadjim, V.; Dinu, R.; Cangini, G.; Vannucci, A.; Felipe, D.; Maese-Novo, A.; Keil, N.; Bach, H.-.; Schell, Martin; Avramopoulos, H.; Kouloumentas, Ch.

    2015-05-01

    Hybrid photonic integration allows individual components to be developed at their best-suited material platforms without sacrificing the overall performance. In the past few years a polymer-enabled hybrid integration platform has been established, comprising 1) EO polymers for constructing low-complexity and low-cost Mach-Zehnder modulators (MZMs) with extremely high modulation bandwidth; 2) InP components for light sources, detectors, and high-speed electronics including MUX drivers and DEMUX circuits; 3) Ceramic (AIN) RF board that links the electronic signals within the package. On this platform, advanced optoelectronic modules have been demonstrated, including serial 100 Gb/s [1] and 2x100 Gb/s [2] optical transmitters, but also 400 Gb/s optoelectronic interfaces for intra-data center networks [3]. To expand the device functionalities to an unprecedented level and at the same time improve the integration compatibility with diversified active / passive photonic components, we have added a passive polymer-based photonic board (polyboard) as the 4th material system. This passive polyboard allows for low-cost fabrication of single-mode waveguide networks, enables fast and convenient integration of various thin-film elements (TFEs) to control the light polarization, and provides efficient thermo-optic elements (TOEs) for wavelength tuning, light amplitude regulation and light-path switching.

  13. Simple and cost-effective method of highly conductive and elastic carbon nanotube/polydimethylsiloxane composite for wearable electronics.

    PubMed

    Kim, Jeong Hun; Hwang, Ji-Young; Hwang, Ha Ryeon; Kim, Han Seop; Lee, Joong Hoon; Seo, Jae-Won; Shin, Ueon Sang; Lee, Sang-Hoon

    2018-01-22

    The development of various flexible and stretchable materials has attracted interest for promising applications in biomedical engineering and electronics industries. This interest in wearable electronics, stretchable circuits, and flexible displays has created a demand for stable, easily manufactured, and cheap materials. However, the construction of flexible and elastic electronics, on which commercial electronic components can be mounted through simple and cost-effective processing, remains challenging. We have developed a nanocomposite of carbon nanotubes (CNTs) and polydimethylsiloxane (PDMS) elastomer. To achieve uniform distributions of CNTs within the polymer, an optimized dispersion process was developed using isopropyl alcohol (IPA) and methyl-terminated PDMS in combination with ultrasonication. After vaporizing the IPA, various shapes and sizes can be easily created with the nanocomposite, depending on the mold. The material provides high flexibility, elasticity, and electrical conductivity without requiring a sandwich structure. It is also biocompatible and mechanically stable, as demonstrated by cytotoxicity assays and cyclic strain tests (over 10,000 times). We demonstrate the potential for the healthcare field through strain sensor, flexible electric circuits, and biopotential measurements such as EEG, ECG, and EMG. This simple and cost-effective fabrication method for CNT/PDMS composites provides a promising process and material for various applications of wearable electronics.

  14. Membrane materials for storing biological samples intended for comparative nanotoxicological testing

    NASA Astrophysics Data System (ADS)

    Metelkin, A.; Kuznetsov, D.; Kolesnikov, E.; Chuprunov, K.; Kondakov, S.; Osipov, A.; Samsonova, J.

    2015-11-01

    The study is aimed at identifying the samples of most promising membrane materials for storing dry specimens of biological fluids (Dried Blood Spots, DBS technology). Existing sampling systems using cellulose fiber filter paper have a number of drawbacks such as uneven distribution of the sample spot, dependence of the spot spreading area on the individual biosample properties, incomplete washing-off of the sample due to partially inconvertible sorption of blood components on cellulose fibers, etc. Samples of membrane materials based on cellulose, polymers and glass fiber with applied biosamples were studied using methods of scanning electron microscopy, FT-IR spectroscopy and surface-wetting measurement. It was discovered that cellulose-based membrane materials sorb components of biological fluids inside their structure, while membranes based on glass fiber display almost no interaction with the samples and biological fluid components dry to films in the membrane pores between the structural fibers. This characteristic, together with the fact that membrane materials based on glass fiber possess sufficient strength, high wetting properties and good storage capacity, attests them as promising material for dry samples of biological fluids storage systems.

  15. Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces

    PubMed Central

    Herbert, Robert; Kim, Jong-Hoon; Kim, Yun Soung; Lee, Hye Moon

    2018-01-01

    Flexible hybrid electronics (FHE), designed in wearable and implantable configurations, have enormous applications in advanced healthcare, rapid disease diagnostics, and persistent human-machine interfaces. Soft, contoured geometries and time-dynamic deformation of the targeted tissues require high flexibility and stretchability of the integrated bioelectronics. Recent progress in developing and engineering soft materials has provided a unique opportunity to design various types of mechanically compliant and deformable systems. Here, we summarize the required properties of soft materials and their characteristics for configuring sensing and substrate components in wearable and implantable devices and systems. Details of functionality and sensitivity of the recently developed FHE are discussed with the application areas in medicine, healthcare, and machine interactions. This review concludes with a discussion on limitations of current materials, key requirements for next generation materials, and new application areas. PMID:29364861

  16. Soft Material-Enabled, Flexible Hybrid Electronics for Medicine, Healthcare, and Human-Machine Interfaces.

    PubMed

    Herbert, Robert; Kim, Jong-Hoon; Kim, Yun Soung; Lee, Hye Moon; Yeo, Woon-Hong

    2018-01-24

    Flexible hybrid electronics (FHE), designed in wearable and implantable configurations, have enormous applications in advanced healthcare, rapid disease diagnostics, and persistent human-machine interfaces. Soft, contoured geometries and time-dynamic deformation of the targeted tissues require high flexibility and stretchability of the integrated bioelectronics. Recent progress in developing and engineering soft materials has provided a unique opportunity to design various types of mechanically compliant and deformable systems. Here, we summarize the required properties of soft materials and their characteristics for configuring sensing and substrate components in wearable and implantable devices and systems. Details of functionality and sensitivity of the recently developed FHE are discussed with the application areas in medicine, healthcare, and machine interactions. This review concludes with a discussion on limitations of current materials, key requirements for next generation materials, and new application areas.

  17. Fire Signatures of Materials Used in Spacecraft Construction

    NASA Technical Reports Server (NTRS)

    Taylor, Christina

    2003-01-01

    The focus of my work this summer was fire safety, specifically determining fire signatures from the combustion of materials commonly found in the construction of spacecraft. This project was undertaken with the aim of addressing concerns for health and safety onboard spacecraft. Under certain conditions, burning electronics produce surprisingly large amounts of acrid smoke, release fine airborne particles and expel condensable aerosols. Similarly, some wire insulation and packing material evolves smoke when in contact with a hot surface. In the limited, enclosed space available on spacecraft, these combustion products may pose a nuisance at the very least - at worst, a hazard to health or equipment. There is also a concern for fire safety in early detection on spacecraft. Our goal for the summer was to determine the most effective methods to test the materials, develop a protocol for sampling, and generate samples for analysis. We restricted our testing to electronic components, packaging and insulation materials, and wire insulation materials.

  18. An intelligent inspection and survey robot. Volume 2

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    NONE

    1995-12-15

    Radioactive materials make up a significant part of the hazardous-material inventory of the Department of Energy. Much of the radioactive material will be inspected or handled by robotic systems that contain electronic circuits that may be damaged by gamma radiation and other particles emitted from radioactive material. This report examines several scenarios, the damage that may be inflicted, and methods that may be used to protect radiation-hardened robot control systems. Commercial sources of components and microcomputers that can withstand high radiation exposure are identified.

  19. Microwave techniques for measuring complex permittivity and permeability of materials

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Guillon, P.

    1995-08-01

    Different materials are of fundamental importance to the aerospace, microwave, electronics and communications industries, and include for example microwave absorbing materials, antennas lenses and radomes, substrates for MMIC and microwave components and antennaes. Basic measurements for the complex permittivity and permeability of those homogeneous solid materials in the microwave spectral region are described including hardware, instrumentation and analysis. Elevated temperature measurements as well as measurements intercomparisons, with a discussion of the strengths and weaknesses of each techniques are also presented.

  20. Explicit accounting of electronic effects on the Hugoniot of porous materials

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Nayak, Bishnupriya; Menon, S. V. G., E-mail: menon.svg98@gmail.com

    2016-03-28

    A generalized enthalpy based equation of state, which includes thermal electron excitations explicitly, is formulated from simple considerations. Its application to obtain Hugoniot of materials needs simultaneous evaluation of pressure-volume curve and temperature, the latter requiring solution of a differential equation. The errors involved in two recent papers [Huayun et al., J. Appl. Phys. 92, 5917 (2002); 92, 5924 (2002)], which employed this approach, are brought out and discussed. In addition to developing the correct set of equations, the present work also provides a numerical method to implement this approach. Constant pressure specific heat of ions and electrons and ionicmore » enthalpy parameter, needed for applications, are calculated using a three component equation of state. The method is applied to porous Cu with different initial porosities. Comparison of results with experimental data shows good agreement. It is found that temperatures along the Hugoniot of porous materials are significantly modified due to electronic effects.« less

  1. QM/QM approach to model energy disorder in amorphous organic semiconductors.

    PubMed

    Friederich, Pascal; Meded, Velimir; Symalla, Franz; Elstner, Marcus; Wenzel, Wolfgang

    2015-02-10

    It is an outstanding challenge to model the electronic properties of organic amorphous materials utilized in organic electronics. Computation of the charge carrier mobility is a challenging problem as it requires integration of morphological and electronic degrees of freedom in a coherent methodology and depends strongly on the distribution of polaron energies in the system. Here we represent a QM/QM model to compute the polaron energies combining density functional methods for molecules in the vicinity of the polaron with computationally efficient density functional based tight binding methods in the rest of the environment. For seven widely used amorphous organic semiconductor materials, we show that the calculations are accelerated up to 1 order of magnitude without any loss in accuracy. Considering that the quantum chemical step is the efficiency bottleneck of a workflow to model the carrier mobility, these results are an important step toward accurate and efficient disordered organic semiconductors simulations, a prerequisite for accelerated materials screening and consequent component optimization in the organic electronics industry.

  2. Synthesis, characterization and experimental investigation of Cu-BTC as CO2 adsorbent from flue gas.

    PubMed

    Xie, Jiangkun; Yan, Naiqiang; Qu, Zan; Yang, Shijian

    2012-01-01

    Porous Cu-BTC material was synthesized by the solvothermal method. Powder X-ray diffraction (PXRD) was used to test the phase purity of the synthesized material and investigate its structural stability under the influence of flue gas components. The thermal stability of the material was determined through thermal gravimetric (TG) analysis. Scanning electron microscopy (SEM) was employed to study the microstructure of the material. Cu-BTC was demonstrated not only to have high CO2 adsorption capacity but also good selectivity of CO2 over N2 by means of packed bed tests. The adsorption capacity of Cu-BTC for CO2 was about 69 mL/g at 22 degrees C. The influence of the main flue gas components on the CO2 capacity of the material were discussed as well.

  3. Method of making thermally removable polyurethanes

    DOEpatents

    Loy, Douglas A.; Wheeler, David R.; McElhanon, James R.; Saunders, Randall S.; Durbin-Voss, Marvie Lou

    2002-01-01

    A method of making a thermally-removable polyurethane material by heating a mixture of a maleimide compound and a furan compound, and introducing alcohol and isocyanate functional groups, where the alcohol group and the isocyanate group reacts to form the urethane linkages and the furan compound and the maleimide compound react to form the thermally weak Diels-Alder adducts that are incorporated into the backbone of the urethane linkages during the formation of the polyurethane material at temperatures from above room temperature to less than approximately 90.degree. C. The polyurethane material can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C. in a polar solvent. The polyurethane material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.

  4. Noise Abatement Materials

    NASA Technical Reports Server (NTRS)

    1986-01-01

    A former NASA employee who discovered a kind of plastic that soaked up energy, dampened vibrations, and was a good noise abatement material, founded a company to market noise deadening adhesives, sheets, panels and enclosures. Known as SMART products, they are 75-80% lighter than ordinary soundproofing material and have demonstrated a high degree of effectiveness. The company, Varian Associates, makes enclosures for high voltage terminals and other electronic system components, and easily transportable audiometric test booths.

  5. Tailoring metal oxide nanoparticle dispersions for inkjet printing.

    PubMed

    Gebauer, J S; Mackert, V; Ognjanović, S; Winterer, M

    2018-05-04

    There is a growing interest in science and industry for printed electronics. Printed electronics enable the production of large quantities of electronic components at low cost. Even though organic semiconductors are already widely used for printed components, inorganic materials may be advantageous due to their higher durability and superior device performance. Nevertheless, inorganic materials still remain difficult to print making the development of printable and functional inks a necessity. In this work we present the formulation, inkjet printing and processing of newly developed inks based on ethylene glycol as dispersion medium. Different metal oxide nanoparticles (ZnO, TiO 2 , CuO, SnO 2 and In 2 O 3 ) with high crystallinity and narrow size distribution were produced by chemical vapor synthesis. The particles were stabilized and the colloidal stability was evaluated by a combination of DLVO simulations and dynamic light scattering measurements. Measurements of rheological and interfacial properties, like viscosity and surface tension, are used to determine the printability on the basis of the inverse Ohnesorge number. Inks, developed in this work, have adjustable rheological properties as well as long-term stabilities without particle sedimentation over a period of several months. They are suitable for printing on different substrate materials like silicon and flexible polymeric substrates. Copyright © 2018 Elsevier Inc. All rights reserved.

  6. 'Soft' amplifier circuits based on field-effect ionic transistors.

    PubMed

    Boon, Niels; Olvera de la Cruz, Monica

    2015-06-28

    Soft materials can be used as the building blocks for electronic devices with extraordinary properties. We introduce a theoretical model for a field-effect transistor in which ions are the gated species instead of electrons. Our model incorporates readily-available soft materials, such as conductive porous membranes and polymer-electrolytes to represent a device that regulates ion currents and can be integrated as a component in larger circuits. By means of Nernst-Planck numerical simulations as well as an analytical description of the steady-state current we find that the responses of the system to various input voltages can be categorized into ohmic, sub-threshold, and active modes. This is fully analogous to what is known for the electronic field-effect transistor (FET). Pivotal FET properties such as the threshold voltage and the transconductance crucially depend on the half-cell redox potentials of the source and drain electrodes as well as on the polyelectrolyte charge density and the gate material work function. We confirm the analogy with the electronic FETs through numerical simulations of elementary amplifier circuits in which we successfully substitute the electronic transistor by an ionic transistor.

  7. An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.

    PubMed

    Wang, Chen; Zhao, Wu; Wang, Jie; Chen, Ling; Luo, Chun-Jing

    2016-06-01

    The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling. © The Author(s) 2016.

  8. Recent Advancements in Functionalized Paper-Based Electronics.

    PubMed

    Lin, Yang; Gritsenko, Dmitry; Liu, Qian; Lu, Xiaonan; Xu, Jie

    2016-08-17

    Building electronic devices on ubiquitous paper substrates has recently drawn extensive attention due to its light weight, low cost, environmental friendliness, and ease of fabrication. Recently, a myriad of advancements have been made to improve the performance of paper electronics for various applications, such as basic electronic components, energy storage devices, generators, antennas, and electronic circuits. This review aims to summarize this progress and discuss different perspectives of paper electronics as well as the remaining challenges yet to be overcome in this field. Other aspects included in this review are the fundamental characteristics of paper, modification of paper with functional materials, and various methods for device fabrication.

  9. NASA Tech Briefs, February 2002. Volume 26, No. 2

    NASA Technical Reports Server (NTRS)

    2002-01-01

    Topics include:a technology focus on computers, electronic components and systems, software, materials, mechanics,physical sciences machinery, manufacturing/fabrication, mathematics, book and reports, motion control tech briefs and a special section on Photonics Tech Briefs.

  10. Ferroelectric Based High Power Components for L-Band Accelerator Applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kanareykin, Alex; Jing, Chunguang; Kostin, Roman

    2018-01-16

    We are developing a new electronic device to control the power in particle accelerators. The key technology is a new nanostructured material developed by Euclid that changes its properties with an applied electric field. Both superconducting and conventional accelerating structures require fast electronic control of the input rf power. A fast controllable phase shifter would allow for example the control of the rf power delivered to multiple accelerating cavities from a single power amplifier. Nonlinear ferroelectric microwave components can control the tuning or the input power coupling for rf cavities. Applying a bias voltage across a nonlinear ferroelectric changes itsmore » permittivity. This effect can be used to cause a phase change of a propagating rf signal or change the resonant frequency of a cavity. The key is the development of a low loss highly tunable ferroelectric material.« less

  11. Apparatus for measurements of thermal and optical stimulated exo-electron emission and luminescence

    NASA Astrophysics Data System (ADS)

    Pokorný, P.; Novotný, M.; Fitl, P.; Zuklín, J.; Vlček, J.; Nikl, J.; Marešová, E.; Hruška, P.; Bulíř, J.; Drahokoupil, J.; Čerňanský, M.; Lančok, J.

    2018-06-01

    The purpose of the design, construction and implementation of vacuum apparatus for measuring simultaneously three or more stimulated phenomena in dielectrics and eventually semiconductors is to investigate those phenomena as a function of temperature and wavelength. The test of equipment and its functionality were carried out step by step (apparatus, components and control sample) and associated with the calculation of the main physical parameters. The tests of individual parts of the apparatus clearly confirmed that the design, construction and selected components fulfil or even exceed the required properties. On the basis of the measurement of selected sample, it was shown that even weak signals from the material can be detected from both thermally stimulated luminescence and thermally stimulated exo-electron emission moreover transmission and desorption can be measured. NaCl:Ni (0.2%) was chosen as the test material. The activation energies and frequency factor were calculated using the methods of different authors.

  12. EBF3 Design and Sustainability Considerations

    NASA Technical Reports Server (NTRS)

    Taminger, Karen M. B.

    2015-01-01

    Electron beam freeform fabrication (EBF3) is a cross-cutting technology for producing structural metal parts using an electron beam and wire feed in a layer-additive fashion. This process was developed by researchers at NASA Langley to specifically address needs for aerospace applications. Additive manufacturing technologies like EBF3 enable efficient design of materials and structures by tailoring microstructures and chemistries at the local level to improve performance at the global level. Additive manufacturing also facilitates design freedom by integrating assemblies into complex single-piece components, eliminating flanges, fasteners and joints, resulting in reduced size and mass. These same efficiencies that permit new design paradigms also lend themselves to supportability and sustainability. Long duration space missions will require a high degree of self-sustainability. EBF3 is a candidate technology being developed to allow astronauts to conduct repairs and fabricate new components and tools on demand, with efficient use of feedstock materials and energy.

  13. Joining of Silicon Carbide Through the Diffusion Bonding Approach

    NASA Technical Reports Server (NTRS)

    Halbig, Michael .; Singh, Mrityunjay

    2009-01-01

    In order for ceramics to be fully utilized as components for high-temperature and structural applications, joining and integration methods are needed. Such methods will allow for the fabrication the complex shapes and also allow for insertion of the ceramic component into a system that may have different adjacent materials. Monolithic silicon carbide (SiC) is a ceramic material of focus due to its high temperature strength and stability. Titanium foils were used as an interlayer to form diffusion bonds between chemical vapor deposited (CVD) SiC ceramics with the aid of hot pressing. The influence of such variables as interlayer thickness and processing time were investigated to see which conditions contributed to bonds that were well adhered and crack free. Optical microscopy, scanning electron microscopy, and electron microprobe analysis were used to characterize the bonds and to identify the reaction formed phases.

  14. Enhanced generation and anisotropic Coulomb scattering of hot electrons in an ultra-broadband plasmonic nanopatch metasurface.

    PubMed

    Sykes, Matthew E; Stewart, Jon W; Akselrod, Gleb M; Kong, Xiang-Tian; Wang, Zhiming; Gosztola, David J; Martinson, Alex B F; Rosenmann, Daniel; Mikkelsen, Maiken H; Govorov, Alexander O; Wiederrecht, Gary P

    2017-10-17

    The creation of energetic electrons through plasmon excitation of nanostructures before thermalization has been proposed for a wide number of applications in optical energy conversion and ultrafast nanophotonics. However, the use of "nonthermal" electrons is primarily limited by both a low generation efficiency and their ultrafast decay. We report experimental and theoretical results on the use of broadband plasmonic nanopatch metasurfaces comprising a gold substrate coupled to silver nanocubes that produce large concentrations of hot electrons, which we measure using transient absorption spectroscopy. We find evidence for three subpopulations of nonthermal carriers, which we propose arise from anisotropic electron-electron scattering within sp-bands near the Fermi surface. The bimetallic character of the metasurface strongly impacts the physics, with dissipation occurring primarily in the gold, whereas the quantum process of hot electron generation takes place in both components. Our calculations show that the choice of geometry and materials is crucial for producing strong ultrafast nonthermal electron components.The creation of energetic electrons through plasmon excitation has implications in optical energy conversion and ultrafast nanophotonics. Here, the authors find evidence for three subpopulations of nonthermal carriers which arise from anisotropic electron-electron scattering near the Fermi surface.

  15. Mineral associations and character of isotopically anomalous organic material in the Tagish Lake carbonaceous chondrite

    NASA Astrophysics Data System (ADS)

    Zega, Thomas J.; Alexander, Conel M. O.'D.; Busemann, Henner; Nittler, Larry R.; Hoppe, Peter; Stroud, Rhonda M.; Young, Andrea F.

    2010-10-01

    We report a coordinated analytical study of matrix material in the Tagish Lake carbonaceous chondrite in which the same small (⩽20 μm) fragments were measured by secondary ion mass spectrometry (SIMS), transmission electron microscopy (TEM), energy-dispersive X-ray spectroscopy (EDS), electron energy-loss spectroscopy (EELS), and X-ray absorption near-edge spectroscopy (XANES). SIMS analysis reveals H and N isotopic anomalies (hotspots), ranging from hundreds to thousands of nanometers in size, which are present throughout the fragments. Although the differences in spatial resolution of the SIMS techniques we have used introduce some uncertainty into the exact location of the hotspots, in general, the H and N isotopic anomalies are spatially correlated with C enrichments, suggesting an organic carrier. TEM analysis, enabled by site-specific extraction using a focused-ion-beam scanning-electron microscope, shows that the hotspots contain an amorphous component, Fe-Ni sulfides, serpentine, and mixed-cation carbonates. TEM imaging reveals that the amorphous component occurs in solid and porous forms, EDS indicates that it contains abundant C, and EELS and XANES at the C K edge reveal that it is largely aromatic. This amorphous component is probably macromolecular C, likely the carrier of the isotopic anomalies, and similar to the material extracted from bulk samples as insoluble organic matter. However, given the large sizes of some of the hotspots, the disparity in spatial resolution among the various techniques employed in our study, and the phases with which they are associated, we cannot entirely rule out that some of the isotopic anomalies are carried by inorganic material, e.g., sheet silicates. The isotopic composition of the organic matter points to an initially primitive origin, quite possibly within cold interstellar clouds or the outer reaches of the solar protoplanetary disk. The association of organic material with secondary phases, e.g., serpentine and carbonates, suggests that the organic matter was susceptible to parent-body processing, and thus, isotopic dilution.

  16. X-Ray photoelectron Spectroscopy Applications

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Engelhard, Mark H.; Droubay, Timothy C.; Du, Yingge

    2017-01-03

    With capability for obtaining quantitative elemental composition, chemical and electronic state, and overlayer thickness information from the top ~10 nm of a sample surface, X-ray Photoelectron Spectroscopy (XPS) or Electron Spectroscopy for Chemical Analysis (ESCA) is a versatile and widely used technique for analyzing surfaces. The technique is applied to a host of materials, from insulators to conductors in virtually every scientific field and sub-discipline. More recently, XPS has been extended under in-situ and operando conditions. Following a brief introduction to XPS principles and instrument components, this article exemplifies widely ranging XPS applications in material and life sciences.

  17. Liquid metals as ultra-stretchable, soft, and shape reconfigurable conductors

    NASA Astrophysics Data System (ADS)

    Eaker, Collin B.; Dickey, Michael D.

    2015-05-01

    Conventional, rigid materials remain the key building blocks of most modern electronic devices, but they are limited in their ability to conform to curvilinear surfaces. It is possible to make electronic components that are flexible and in some cases stretchable by utilizing thin films, engineered geometries, or inherently soft and stretchable materials that maintain their function during deformation. Here, we describe the properties and applications of a micromoldable liquid metal that can form conductive components that are ultra-stretchable, soft, and shape-reconfigurable. This liquid metal is a gallium-based alloy with low viscosity and high conductivity. The metal develops spontaneously a thin, passivating oxide layer on the surface that allows the metal to be molded into non-spherical shapes, including films and wires, and patterned by direct-write techniques or microfluidic injection. Furthermore, unlike mercury, the liquid metal has low toxicity and negligible vapor pressure. This paper discusses the mechanical and electrical properties of the metal in the context of electronics, and discusses how the properties of the oxide layer have been exploited for new patterning techniques that enable soft, stretchable and reconfigurable devices.

  18. Strategies for Multi-Modal Analysis

    NASA Astrophysics Data System (ADS)

    Hexemer, Alexander; Wang, Cheng; Pandolfi, Ronald; Kumar, Dinesh; Venkatakrishnan, Singanallur; Sethian, James; Camera Team

    This section on soft materials will be dedicated to discuss the extraction of the chemical distribution and spatial arrangement of constituent elements and functional groups at multiple length scales and, thus, the examination of collective dynamics, transport, and electronic ordering phenomena. Traditional measures of structure in soft materials have relied heavily on scattering and imaging based techniques due to their capacity to measure nanoscale dimensions and their capacity to monitor structure under conditions of dynamic stress loading. Special attentions are planned to focus on the application of resonant x-ray scattering, contrast-varied neutron scattering, analytical transmission electron microscopy, and their combinations. This session aims to bring experts in both scattering and electron microscope fields to discuss recent advances in selectively characterizing structural architectures of complex soft materials, which have often multi-components with a wide range of length scales and multiple functionalities, and thus hopes to foster novel ideas to decipher a higher level of structural complexity in soft materials in future. CAMERA, Early Career Award.

  19. Pollen tube reuses intracellular components of nucellar cells undergoing programmed cell death in Pinus densiflora.

    PubMed

    Hiratsuka, Rie; Terasaka, Osamu

    2011-04-01

    Through the process known as programmed cell death (PCD), nucelli of Pinus densiflora serve as the transmitting tissue for growth of the pollen tube. We sought to clarify the processes of degradation of nucellar cell components and their transport to the pollen tube during PCD in response to pollen tube penetration of such nucelli. Stimulated by pollination, synthesis of large amounts of starch grains occurred in cells in a wide region of the nucellus, but as the pollen tube penetrated the nucellus, starch grains were degraded in amyloplasts of nucellar cells. In cells undergoing PCD, electron-dense vacuoles with high membrane contrast appeared, assumed a variety of autophagic structures, expanded, and ultimately collapsed and disappeared. Vesicles and electron-dense amorphous materials were released inside the thickened walls of cells undergoing PCD, and those vesicles and materials reaching the pollen tube after passing through the extracellular matrix were taken into the tube by endocytosis. These results show that in PCD of nucellar cells, intracellular materials are degraded in amyloplasts and vacuoles, and some of the degraded material is supplied to the pollen tube by vesicular transport to support tube growth.

  20. Effects of interfacial interaction on the properties of poly(vinyl chloride)/styrene-butadiene rubber blends

    NASA Astrophysics Data System (ADS)

    Zhu, Shuihan

    PVC/SBR blends---new thermoplastic elastomer material---were developed. They have potential applications due to low costs and low-temperature elasticity. A unique compatibilization method was employed to enhance the mechanical properties of the materials a compatibilizer miscible with one of the blend components can react chemically with the other component(s). Improvements in tensile and impact behavior were observed as a result of the compatibilization. A novel characterization technique to study the interface of PVC/SBR blends was developed. This technique involves the observation of the unstained sample under electron beam irradiation by a transmission electron microscope (TEM). An enrichment of rubber at the interface between PVC and SBR was detected in the compatiblized PVC/SBR blends. Magnetic relaxation measurements show that the rubber concentration in the proximity of PVC increases with the degree of covulcanization between NBR and SBR. The interface development and the rheological effect during processing were investigated. The interfacial concentration profile and the interfacial thickness were obtained by grayscale measurements on TEM micrographs, evaluation of SIMS images, and measurements of micromechanical properties.

  1. Manipulation of Dirac cones in intercalated epitaxial graphene

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Kim, Minsung; Tringides, Michael C.; Hershberger, Matthew T.

    Graphene is an intriguing material in view of its unique Dirac quasi-particles, and the manipulation of its electronic structure is important in material design and applications. Here, we theoretically investigate the electronic band structure of epitaxial graphene on SiC with intercalation of rare earth metal ions (e.g., Yb and Dy) using first-principles calculations. We can use the intercalation to control the coupling of the constituent components (buffer layer, graphene, and substrate), resulting in strong modification of the graphene band structure. We also demonstrate that the metal-intercalated epitaxial graphene has tunable band structures by controlling the energies of Dirac cones asmore » well as the linear and quadratic band dispersion depending on the intercalation layer and density. Thus, the metal intercalation is a viable method to manipulate the electronic band structure of the epitaxial graphene, which can enhance the functional utility and controllability of the material.« less

  2. Manipulation of Dirac cones in intercalated epitaxial graphene

    DOE PAGES

    Kim, Minsung; Tringides, Michael C.; Hershberger, Matthew T.; ...

    2017-07-12

    Graphene is an intriguing material in view of its unique Dirac quasi-particles, and the manipulation of its electronic structure is important in material design and applications. Here, we theoretically investigate the electronic band structure of epitaxial graphene on SiC with intercalation of rare earth metal ions (e.g., Yb and Dy) using first-principles calculations. We can use the intercalation to control the coupling of the constituent components (buffer layer, graphene, and substrate), resulting in strong modification of the graphene band structure. We also demonstrate that the metal-intercalated epitaxial graphene has tunable band structures by controlling the energies of Dirac cones asmore » well as the linear and quadratic band dispersion depending on the intercalation layer and density. Thus, the metal intercalation is a viable method to manipulate the electronic band structure of the epitaxial graphene, which can enhance the functional utility and controllability of the material.« less

  3. Fabrication of Lightweight Radiation Shielding Composite Materials by Field Assisted Sintering Technique (FAST)

    NASA Technical Reports Server (NTRS)

    Prasad, Narasimha; Trivedi, Sudhir; Chen, Henry; Kutcher, Susan; Zhang, Dajie; Singh, Jogender

    2017-01-01

    Advances in radiation shielding technologies are needed to protect humans and electronic components from all threats of space radiation over long durations. In this paper, we report on the use of the innovative and novel fabrication technology known as Field Assisted Sintering Technology (FAST) to fabricate lightweight material with enhanced radiation shielding strength to safeguard humans and electronics suitable for next generation space exploration missions. The base materials we investigated were aluminum (Al), the current standard material for space hardware, and Ultra-High Molecular Weight Polyethylene (UHMWPE), which has high hydrogen content and resistance to nuclear reaction from neutrons, making it a good shielding material for both gamma radiation and particles. UHMWPE also has high resistance to corrosive chemicals, extremely low moisture sensitivity, very low coefficient of friction, and high resistance to abrasion. We reinforced the base materials by adding high density (ie, high atomic weight) metallic material into the composite. These filler materials included: boron carbide (B4C), tungsten (W), tungsten carbide (WC) and gadolinium (Gd).

  4. Nanocellulose based polymer composite for acoustical materials

    NASA Astrophysics Data System (ADS)

    Farid, Mohammad; Purniawan, Agung; Susanti, Diah; Priyono, Slamet; Ardhyananta, Hosta; Rahmasita, Mutia E.

    2018-04-01

    Natural fibers are biodegradable materials that are innovatively and widely used for composite reinforcement in automotive components. Nanocellulose derived from natural fibers oil palm empty bunches have properties that are remarkable for use as a composite reinforcement. However, there have not been many investigations related to the use of nanocellulose-based composites for wideband sound absorption materials. The specimens of nanocellulose-based polyester composite were prepared using a spray method. An impedance tube method was used to measure the sound absorption coefficient of this composite material. To reveal the characteristics of the nanocellulose-based polyester composite material, SEM (scanning electron microscope), TEM (Transmission Electron Microscope), FTIR (Fourier Transform Infra Red), TGA (Thermogravimetric Analysis), and density tests were performed. Sound absorption test results showed the average value of sound absorption coefficient of 0.36 to 0,46 for frequency between 500 and 4000 Hz indicating that this nanocellulose-based polyester composite materials had a tendency to wideband sound absorption materials and potentially used as automotive interior materials.

  5. Materials and processing approaches for foundry-compatible transient electronics.

    PubMed

    Chang, Jan-Kai; Fang, Hui; Bower, Christopher A; Song, Enming; Yu, Xinge; Rogers, John A

    2017-07-11

    Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for "green" electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are ( i ) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, ( ii ) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and ( iii ) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.

  6. Materials and processing approaches for foundry-compatible transient electronics

    NASA Astrophysics Data System (ADS)

    Chang, Jan-Kai; Fang, Hui; Bower, Christopher A.; Song, Enming; Yu, Xinge; Rogers, John A.

    2017-07-01

    Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for “green” electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.

  7. Materials for Stretchable Electronics - Electronic Eyeballs, Brain Monitors and Other Applications

    ScienceCinema

    Rogers, John A. [University of Illinois, Urbana Champaign, Illinois, United States

    2017-12-09

    Electronic circuits that involve transistors and related components on thin plastic sheets or rubber slabs offer mechanical properties (e.g. bendability, stretchability) and other features (e.g. lightweight, rugged construction) which cannot be easily achieved with technologies that use rigid, fragile semiconductor wafer or glass substrates.  Device examples include personal or structural health monitors and electronic eye imagers, in which the electronics must conform to complex curvilinear shapes or flex/stretch during use.  Our recent work accomplishes these technology outcomes by use of single crystal inorganic nanomaterials in ‘wavy’ buckled configurations on elastomeric supports.  This talk will describe key fundamental materials and mechanics aspects of these approaches, as well as engineering features of their use in individual transistors, photodiodes and integrated circuits.  Cardiac and brain monitoring devices provide examples of application in biomedicine; hemispherical electronic eye cameras illustrate new capacities for bio-inspired device design.

  8. Synthesis, characterization, properties, and applications of nanosized ferroelectric, ferromagnetic, or multiferroic materials

    DOE PAGES

    Dhak, Debasis; Hong, Seungbum; Das, Soma; ...

    2015-01-01

    Recently, there has been an enormous increase in research activity in the field of ferroelectrics and ferromagnetics especially in multiferroic materials which possess both ferroelectric and ferromagnetic properties simultaneously. However, the ferroelectric, ferromagnetic, and multiferroic properties should be further improved from the utilitarian and commercial viewpoints. Nanostructural materials are central to the evolution of future electronics and information technologies. Ferroelectrics and ferromagnetics have already been established as a dominant branch in electronics sector because of their diverse applications. The ongoing dimensional downscaling of materials to allow packing of increased numbers of components into integrated circuits provides the momentum for evolutionmore » of nanostructural devices. Nanoscaling of the above materials can result in a modification of their functionality. Furthermore, nanoscaling can be used to form high density arrays of nanodomain nanostructures, which is desirable for miniaturization of devices.« less

  9. Computational electronics and electromagnetics

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Shang, C C

    The Computational Electronics and Electromagnetics thrust area serves as the focal point for Engineering R and D activities for developing computer-based design and analysis tools. Representative applications include design of particle accelerator cells and beamline components; design of transmission line components; engineering analysis and design of high-power (optical and microwave) components; photonics and optoelectronics circuit design; electromagnetic susceptibility analysis; and antenna synthesis. The FY-97 effort focuses on development and validation of (1) accelerator design codes; (2) 3-D massively parallel, time-dependent EM codes; (3) material models; (4) coupling and application of engineering tools for analysis and design of high-power components; andmore » (5) development of beam control algorithms coupled to beam transport physics codes. These efforts are in association with technology development in the power conversion, nondestructive evaluation, and microtechnology areas. The efforts complement technology development in Lawrence Livermore National programs.« less

  10. Long range order and two-fluid behavior in heavy electron materials

    DOE PAGES

    Shirer, Kent R.; Shockley, Abigail C.; Dioguardi, Adam P.; ...

    2012-09-24

    The heavy electron Kondo liquid is an emergent state of condensed matter that displays universal behavior independent of material details. Properties of the heavy electron liquid are best probed by NMR Knight shift measurements, which provide a direct measure of the behavior of the heavy electron liquid that emerges below the Kondo lattice coherence temperature as the lattice of local moments hybridizes with the background conduction electrons. Because the transfer of spectral weight between the localized and itinerant electronic degrees of freedom is gradual, the Kondo liquid typically coexists with the local moment component until the material orders at lowmore » temperatures. The two-fluid formula captures this behavior in a broad range of materials in the paramagnetic state. In order to investigate two-fluid behavior and the onset and physical origin of different long range ordered ground states in heavy electron materials, we have extended Knight shift measurements to URu 2Si 2, CeIrIn 5, and CeRhIn 5. In CeRhIn 5 we find that the antiferromagnetic order is preceded by a relocalization of the Kondo liquid, providing independent evidence for a local moment origin of antiferromagnetism. In URu 2Si 2 the hidden order is shown to emerge directly from the Kondo liquid and so is not associated with local moment physics. Lastly, our results imply that the nature of the ground state is strongly coupled with the hybridization in the Kondo lattice in agreement with phase diagram proposed by Yang and Pines.« less

  11. Recent advances in material science for developing enzyme electrodes.

    PubMed

    Sarma, Anil Kumar; Vatsyayan, Preety; Goswami, Pranab; Minteer, Shelley D

    2009-04-15

    The enzyme-modified electrode is the fundamental component of amperometric biosensors and biofuel cells. The selection of appropriate combinations of materials, such as: enzyme, electron transport mediator, binding and encapsulation materials, conductive support matrix and solid support, for construction of enzyme-modified electrodes governs the efficiency of the electrodes in terms of electron transfer kinetics, mass transport, stability, and reproducibility. This review investigates the varieties of materials that can be used for these purposes. Recent innovation in conductive electro-active polymers, functionalized polymers, biocompatible composite materials, composites of transition metal-based complexes and organometallic compounds, sol-gel and hydro-gel materials, nanomaterials, other nano-metal composites, and nano-metal oxides are reviewed and discussed here. In addition, the critical issues related to the construction of enzyme electrodes and their application for biosensor and biofuel cell applications are also highlighted in this article. Effort has been made to cover the recent literature on the advancement of materials sciences to develop enzyme electrodes and their potential applications for the construction of biosensors and biofuel cells.

  12. Ballistic Performance of Porous Ceramic Thermal Protection Systems at 9 km/s

    NASA Technical Reports Server (NTRS)

    Miller, Joshua E.; Bohl, W. E.; Foreman, C. D.; Christiansen, Eric L.; Davis, B. A.

    2009-01-01

    Porous-ceramic, thermal-protection-systems are used heavily in current reentry vehicles like the Orbiter, and they are currently being proposed for the next generation of manned spacecraft, Orion. These materials insulate the structural components and sensitive electronic components of a spacecraft against the intense thermal environments of atmospheric reentry. Furthermore, these materials are also highly exposed to space environmental hazards like meteoroid and orbital debris impacts. This paper discusses recent impact testing up to 9 km/s on ceramic tiles similar to those used on the Orbiter. These tiles have a porous-batting of nominally 8 lb/cubic ft alumina-fiber-enhanced-thermal-barrier (AETB8) insulating material coated with a damage-resistant, toughened-unipiece-fibrous-insulation (TUFI) layer.

  13. Positron annihilation lifetime spectroscopy study of Kapton thin foils

    NASA Astrophysics Data System (ADS)

    Kanda, G. S.; Ravelli, L.; Löwe, B.; Egger, W.; Keeble, D. J.

    2016-01-01

    Variable energy positron annihilation lifetime spectroscopy (VE-PALS) experiments on polyimide material Kapton are reported. Thin Kapton foils are widely used in a variety of mechanical, electronic applications. PALS provides a sensitive probe of vacancy-related defects in a wide range of materials, including open volume in polymers. Varying the positron implantation energy enables direct measurement of thin foils. Thin Kapton foils are also commonly used to enclose the positron source material in conventional PALS measurements performed with unmoderated radionuclide sources. The results of depth-profiled positron lifetime measurements on 7.6 μm and 25 μm Kapton foils are reported and determine a dominant 385(1) ps lifetime component. The absence of significant nanosecond lifetime component due to positronium formation is confirmed.

  14. Radiation Shielding Study of Advanced Data and Power Management Systems (ADPMS) Housing Using Geant4

    NASA Astrophysics Data System (ADS)

    Garcia, F.; Kurvinen, K.; Brander, T.; Orava, R.; Heino, J.; Virtanen, A.; Kettunen, H.; Tenhunen, M.

    2008-02-01

    A design goal for current space system is to reduce the mass used to enclose components of the spacecraft. One potential target is to reduce the mass of electronics and its housings. The use of composite materials, especially CFRP (Carbon Fiber Reinforced Plastic) is a well known and vastly used approach to mass reduction. A design goal, cost reduction, has increased the use of commercial (non-space qualified) electronics. These commercial circuits and other components cannot tolerate as high radiation levels as space qualified components. Therefore, the use of standard electronics components poses a challenge in terms of the radiation protection capability of the ADPMS housings. The main goal of this study is to provide insight on the radiation shielding protection produced by different configurations of CFRP tungsten laminates of epoxies and cyanate esters and then to compare them to the protection given by the commonly used aluminum. For a spacecraft operating in LEO and MEO orbits the main components of the space radiation environment are energetic electrons and protons, therefore in our study we will compare the experimental and simulation results of the radiation attenuation of different types of laminates for those particles. At the same time the experimental data has been used to validate the Geant4 model of the laminates, which can be used for future optimizations of the laminate structures.

  15. Low-Dimensional Nanomaterials and Molecular Dielectrics for Radiation-Hard Electronics

    NASA Astrophysics Data System (ADS)

    McMorrow, Julian

    The electronic materials research driving Moore's law has provided several decades of increasingly powerful yet simultaneously miniaturized computer technologies. As we approach the physical and practical limits of what can be accomplished with silicon electronics, we look to new materials to drive innovation in future electronic applications. New materials paradigms require the development of understanding from first principles to the demonstration of applications that comes with mature technologies. Semiconducting single-walled carbon nanotubes (SWCNTs), single- and few-layer molybdenum disulfide (MoS2) and self-assembled nanodielectric (SAND) gate materials have all made significant impacts in the research field of unconventional electronic materials. The materials selection, interfaces between materials, processing steps to assemble them, and their interaction with their environment all have significant bearing on the operation of the overall device. Operating in harsh radiation environments, like those of satellites orbiting the Earth, present unique challenges to the functionality and reliability of electronic devices. Because the future of space-bound electronics is often informed by the technology of terrestrial devices, a proactive approach is adopted to identify and understand the radiation response of new materials systems as they emerge and develop. The work discussed here drives the innovation and development of multiple nanomaterial based electronic technologies while simultaneously exploring their relevant radiation response mechanisms. First, collaborative efforts result in the demonstration of a SWCNT-based circuit technology that is solution processed, large-area, and compatible with flexible substrates. The statistical characterization of SWCNT transistors enables the development of robust doping and encapsulation schemes, which make the SWCNT circuits stable, scalable, and low-power. These SWCNTs are then integrated into static random access memory (SRAM) cells, an accomplishment that illustrates the technological relevance of this work by implementing a highly utilized component of modern day computing. Next, these SRAM devices demonstrate functionality as true random number generators (TRNGs), which are critical components in cryptography and encryption. The randomness of these SWCNT TRNGs is verified by a suite of statistical tests. This achievement has implications for securing data and communication in future solution-processed, large-area, flexible electronics. The unprecedented integration achieved by the underlying SWCNT doping and encapsulation motivates the study of this technology in a radiation environment. Doing so results in an understanding of the fundamental charge trapping mechanisms responsible for the radiation response in this system. The integrated nature of these devices enables, for the first time, the observation of system-level effects in a SWCNT integrated circuit technology. This technology is found to be total ionizing dose-hard, a promising result for the adoption of SWCNTs in future space-bound applications. Compared to SWCNTs, the field of MoS2 electronics is relatively nascent. As a result, studies of radiation effects in MoS2 devices focus on the fundamental mechanisms at play in the materials system. Here, we reveal the critical role of atmospheric adsorbates in the radiation effects of MoS2 transistors by measuring their response to vacuum ultraviolet radiation. These results highlight the importance of controlling the atmosphere of MoS2 devices during irradiation. Furthermore, we make recommendations for radiation-hard MoS2-based devices in the future as the technology continues to mature. One such recommendation is the incorporation of specialized dielectrics with proven radiation hardness. To this end, we address the materials integration challenge of incorporating SAND gate dielectrics on arbitrary substrates. We explore a novel approach for preparing metal substrates for SAND deposition, supporting the SAND superlattice structure and its superlative electronic properties on a metal surface. This result is critical for conducting fundamental transport studies when integrating SAND with novel semiconductor materials, as well as enabling complex circuit integration and SAND on flexible substrates. Altogether, these works drive the integration of novel nanoelectronic materials for future electronics while providing an understanding of their varying radiation response mechanisms to enable their adoption in future space-bound applications.

  16. Printed Biopolymer-Based Electro-Optic Device Components

    DTIC Science & Technology

    2013-07-01

    devices and fabricated e-beam lithography-based master molds. Printed micro and nanostructures using a newly developed spin-on nanoprinting (SNAP...polymeric materials. Among the natural biopolymers , deoxyribonucleic acid (DNA) is an attractive material which can be used to make electronic and...photonic devices [2, 3]. If patterned on the micro and nanoscale using a soft lithography technique, high quality biodegradable optical devices can be

  17. Biotechnology

    NASA Image and Video Library

    2000-12-15

    NASA is looking to biological techniques that are millions of years old to help it develop new materials and nanotechnology for the 21st century. Sponsored by NASA, Jerzy Bernholc, a principal investigator in the microgravity materials science program and a physics professor at North Carolina State University, Bernholc works with very large-scale computations to model carbon molecules as they assemble themselves to form nanotubes. The strongest confirmed material known, nanotubes are much stronger than graphite, a more common material made of carbon, and weigh six times less than steel. Nanotubes have potential uses such as strain gauges, advanced electronic devices, amd batteries. The strength, light weight, and conductive qualities of nanotubes, shown in light blue in this computed electron distribution, make them excellent components of nanoscale devices. One way to conduct electricity to such devices is through contact with aluminum, shown in dark blue.

  18. Radiation-induced damage analysed by luminescence methods in retrospective dosimetry and emergency response.

    PubMed

    Woda, Clemens; Bassinet, Céline; Trompier, François; Bortolin, Emanuela; Della Monaca, Sara; Fattibene, Paola

    2009-01-01

    The increasing risk of a mass casualty scenario following a large scale radiological accident or attack necessitates the development of appropriate dosimetric tools for emergency response. Luminescence dosimetry has been reliably applied for dose reconstruction in contaminated settlements for several decades and recent research into new materials carried close to the human body opens the possibility of estimating individual doses for accident and emergency dosimetry using the same technique. This paper reviews the luminescence research into materials useful for accident dosimetry and applications in retrospective dosimetry. The properties of the materials are critically discussed with regard to the requirements for population triage. It is concluded that electronic components found within portable electronic devices, such as e.g. mobile phones, are at present the most promising material to function as a fortuitous dosimeter in an emergency response.

  19. Methods and devices for fabricating and assembling printable semiconductor elements

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne

    The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

  20. Methods and devices for fabricating and assembling printable semiconductor elements

    DOEpatents

    Nuzzo, Ralph G; Rogers, John A; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao

    2014-03-04

    The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

  1. The Language of Glove: Wireless gesture decoder with low-power and stretchable hybrid electronics.

    PubMed

    O'Connor, Timothy F; Fach, Matthew E; Miller, Rachel; Root, Samuel E; Mercier, Patrick P; Lipomi, Darren J

    2017-01-01

    This communication describes a glove capable of wirelessly translating the American Sign Language (ASL) alphabet into text displayable on a computer or smartphone. The key components of the device are strain sensors comprising a piezoresistive composite of carbon particles embedded in a fluoroelastomer. These sensors are integrated with a wearable electronic module consisting of digitizers, a microcontroller, and a Bluetooth radio. Finite-element analysis predicts a peak strain on the sensors of 5% when the knuckles are fully bent. Fatigue studies suggest that the sensors successfully detect the articulation of the knuckles even when bent to their maximal degree 1,000 times. In concert with an accelerometer and pressure sensors, the glove is able to translate all 26 letters of the ASL alphabet. Lastly, data taken from the glove are used to control a virtual hand; this application suggests new ways in which stretchable and wearable electronics can enable humans to interface with virtual environments. Critically, this system was constructed of components costing less than $100 and did not require chemical synthesis or access to a cleanroom. It can thus be used as a test bed for materials scientists to evaluate the performance of new materials and flexible and stretchable hybrid electronics.

  2. The Language of Glove: Wireless gesture decoder with low-power and stretchable hybrid electronics

    PubMed Central

    O’Connor, Timothy F.; Fach, Matthew E.; Miller, Rachel; Root, Samuel E.; Mercier, Patrick P.

    2017-01-01

    This communication describes a glove capable of wirelessly translating the American Sign Language (ASL) alphabet into text displayable on a computer or smartphone. The key components of the device are strain sensors comprising a piezoresistive composite of carbon particles embedded in a fluoroelastomer. These sensors are integrated with a wearable electronic module consisting of digitizers, a microcontroller, and a Bluetooth radio. Finite-element analysis predicts a peak strain on the sensors of 5% when the knuckles are fully bent. Fatigue studies suggest that the sensors successfully detect the articulation of the knuckles even when bent to their maximal degree 1,000 times. In concert with an accelerometer and pressure sensors, the glove is able to translate all 26 letters of the ASL alphabet. Lastly, data taken from the glove are used to control a virtual hand; this application suggests new ways in which stretchable and wearable electronics can enable humans to interface with virtual environments. Critically, this system was constructed of components costing less than $100 and did not require chemical synthesis or access to a cleanroom. It can thus be used as a test bed for materials scientists to evaluate the performance of new materials and flexible and stretchable hybrid electronics. PMID:28700603

  3. Development of UItra-Low Temperature Motor Controllers: Ultra Low Temperatures Evaluation and Characterization of Semiconductor Technologies For The Next Generation Space Telescope

    NASA Technical Reports Server (NTRS)

    Elbuluk, Malik E.

    2003-01-01

    Electronics designed for low temperature operation will result in more efficient systems than room temperature. This improvement is a result of better electronic, electrical, and thermal properties of materials at low temperatures. In particular, the performance of certain semiconductor devices improves with decreasing temperature down to ultra-low temperature (-273 'C). The Low Temperature Electronics Program at the NASA Glenn Research Center focuses on research and development of electrical components and systems suitable for applications in deep space missions. Research is being conducted on devices and systems for use down to liquid helium temperatures (-273 'C). Some of the components that are being characterized include semiconductor switching devices, resistors, magnetics, and capacitors. The work performed this summer has focused on the evaluation of silicon-, silicon-germanium- and gallium-Arsenide-based (GaAs) bipolar, MOS and CMOS discrete components and integrated circuits (ICs), from room temperature (23 'C) down to ultra low temperatures (-263 'C).

  4. Aerosol jet printed p- and n-type electrolyte-gated transistors with a variety of electrode materials: exploring practical routes to printed electronics.

    PubMed

    Hong, Kihyon; Kim, Se Hyun; Mahajan, Ankit; Frisbie, C Daniel

    2014-11-12

    Printing electrically functional liquid inks is a promising approach for achieving low-cost, large-area, additive manufacturing of flexible electronic circuits. To print thin-film transistors, a basic building block of thin-film electronics, it is important to have several options for printable electrode materials that exhibit high conductivity, high stability, and low-cost. Here we report completely aerosol jet printed (AJP) p- and n-type electrolyte-gated transistors (EGTs) using a variety of different electrode materials including highly conductive metal nanoparticles (Ag), conducting polymers (polystyrenesulfonate doped poly(3,4-ethylendedioxythiophene, PEDOT:PSS), transparent conducting oxides (indium tin oxide), and carbon-based materials (reduced graphene oxide). Using these source-drain electrode materials and a PEDOT:PSS/ion gel gate stack, we demonstrated all-printed p- and n-type EGTs in combination with poly(3-hexythiophene) and ZnO semiconductors. All transistor components (including electrodes, semiconductors, and gate insulators) were printed by AJP. Both kinds of devices showed typical p- and n-type transistor characteristics, and exhibited both low-threshold voltages (<2 V) and high hole and electron mobilities. Our assessment suggests Ag electrodes may be the best option in terms of overall performance for both types of EGTs.

  5. Low-energy electron-beam treatment as alternative for on-site sterilization of highly functionalized medical products - A feasibility study

    NASA Astrophysics Data System (ADS)

    Gotzmann, G.; Portillo, J.; Wronski, S.; Kohl, Y.; Gorjup, E.; Schuck, H.; Rögner, F. H.; Müller, M.; Chaberny, I. F.; Schönfelder, J.; Wetzel, C.

    2018-09-01

    Over the last decades, the medical device industry has grown significantly. Complex and highly functionalized medical devices and implants are being developed to improve patient treatment and to enhance their health-related quality of life. However, medical devices from this new generation often cannot be sterilized by standard methods such as autoclaving or sterilizing gases, as they are temperature sensitive, containing electronic components like sensors and microchips, or consist of polymers. Gamma irradiation for sterilization of such products is also problematic due to long processing times under highly reactive conditions resulting in material degradation or loss of functionality. Low-energy electron-beam treatment could enable irradiation sterilization of medical surfaces within seconds. This method is very fast in comparison to gamma irradiation because of its high dose rate and therefore degradation processes of polymers can be reduced or even prevented. Additionally, electron penetration depth can be precisely controlled to prevent damage of sensitive components like electronics and semiconductors. The presented study focuses on two key aspects: 1.) Can new and highly functionalized medical products in future be sterilized using low-energy electron-beam irradiation; and 2.) Is the low-energy electron-beam technology suitable to be set up on-site to speed up sterilization processing or make it available "just-in-time". To address these questions, different test specimens were chosen with complex geometry or electronic functional parts to gather information about the limitations and chances for this new approach. The test specimens were inoculated with clinical relevant test organisms (Pseudomonas aeruginosa) as well as with approved radiation resistant organisms (Deinococcus radiodurans and Bacillus pumilus) to prove the suitability of low-energy electron-beam treatment for the above-mentioned medical products. The calculation of the D10 value for B. pumilus revealed equal efficacy when compared to standard high-energy irradiation sterilization. All of the above-mentioned germs were successfully inactivated by low-energy electron-beam treatment when test specimens were inoculated with a germ load > 10^6 CFU and treated with doses ≥ 10 kGy (for B. pumilus and P. aeruginosa) and > 300 kGy (for D. radiodurans) respectively. As an example, for specialized electronic components to be sterilized, an impedance sensor for cell culture applications was sterilized and unimpaired functionality was demonstrated even after five repeated sterilization cycles to a total dose of 50 kGy. To address the second aspect of on-site suitability of this technology, the product handling for low-energy electron-beam treatment had to be adapted to minimize the size of the electron-beam facility. Therefore, a mini electron-beam source was used and a specialized sample holder and 3D-handling regime were developed to allow reproducible surface treatment for complex product geometries. Inactivation of B. pumilus inoculated medical screws (> 10^6 CFU) was successful using the developed handling procedure. In addition, a packaging material (PET12/PE50) for medical products was investigated for its suitability for low-energy irradiation sterilization. Biocompatibility assessment revealed the material to be eligible for this application as even overdoses did not impair the biocompatibility of the material. With these results, the principal suitability of low-energy electron-beam treatment for sterilization of medical products containing electronics like sensors is demonstrated. The low-energy technology and the specialized 3D-handling regime allow the on-site setup of the technology in hospitals, medical practices or any other point of care.

  6. The EPQ Code System for Simulating the Thermal Response of Plasma-Facing Components to High-Energy Electron Impact

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ward, Robert Cameron; Steiner, Don

    2004-06-15

    The generation of runaway electrons during a thermal plasma disruption is a concern for the safe and economical operation of a tokamak power system. Runaway electrons have high energy, 10 to 300 MeV, and may potentially cause extensive damage to plasma-facing components (PFCs) through large temperature increases, melting of metallic components, surface erosion, and possible burnout of coolant tubes. The EPQ code system was developed to simulate the thermal response of PFCs to a runaway electron impact. The EPQ code system consists of several parts: UNIX scripts that control the operation of an electron-photon Monte Carlo code to calculate themore » interaction of the runaway electrons with the plasma-facing materials; a finite difference code to calculate the thermal response, melting, and surface erosion of the materials; a code to process, scale, transform, and convert the electron Monte Carlo data to volumetric heating rates for use in the thermal code; and several minor and auxiliary codes for the manipulation and postprocessing of the data. The electron-photon Monte Carlo code used was Electron-Gamma-Shower (EGS), developed and maintained by the National Research Center of Canada. The Quick-Therm-Two-Dimensional-Nonlinear (QTTN) thermal code solves the two-dimensional cylindrical modified heat conduction equation using the Quickest third-order accurate and stable explicit finite difference method and is capable of tracking melting or surface erosion. The EPQ code system is validated using a series of analytical solutions and simulations of experiments. The verification of the QTTN thermal code with analytical solutions shows that the code with the Quickest method is better than 99.9% accurate. The benchmarking of the EPQ code system and QTTN versus experiments showed that QTTN's erosion tracking method is accurate within 30% and that EPQ is able to predict the occurrence of melting within the proper time constraints. QTTN and EPQ are verified and validated as able to calculate the temperature distribution, phase change, and surface erosion successfully.« less

  7. Concepts for the material development of phosphorescent organic materials processable from solution and their application in OLEDs

    NASA Astrophysics Data System (ADS)

    Janietz, S.; Krueger, H.; Thesen, M.; Salert, B.; Wedel, A.

    2014-10-01

    One example of organic electronics is the application of polymer based light emitting devices (PLEDs). PLEDs are very attractive for large area and fine-pixel displays, lighting and signage. The polymers are more amenable to solution processing by printing techniques which are favourable for low cost production in large areas. With phosphorescent emitters like Ir-complexes higher quantum efficiencies were obtained than with fluorescent systems, especially if multilayer stack systems with separated charge transport and emitting layers were applied in the case of small molecules. Polymers exhibit the ability to integrate all the active components like the hole-, electron-transport and phosphorescent molecules in only one layer. Here, the active components of a phosphorescent system - triplet emitter, hole- and electron transport molecules - can be linked as a side group to a polystyrene main chain. By varying the molecular structures of the side groups as well as the composition of the side chains with respect to the triplet emitter, hole- and electron transport structure, and by blending with suitable glass-forming, so-called small molecules, brightness, efficiency and lifetime of the produced OLEDs can be optimized. By choosing the triplet emitter, such as iridium complexes, different emission colors can be specially set. Different substituted triazine molecules were introduced as side chain into a polystyrene backbone and applied as electron transport material in PLED blend systems. The influence of alkyl chain lengths of the performance will be discussed. For an optimized blend system with a green emitting phosphorescent Ir-complex efficiencies of 60 cd/A and an lifetime improvement of 66.000 h @ 1000 cd/m2 were achieved.

  8. Printed Electronics

    NASA Astrophysics Data System (ADS)

    Wade, Jessica; Hollis, Joseph Razzell; Wood, Sebastian

    2018-04-01

    The combination of printing technology with manufacturing electronic devices enables a new paradigm of printable electronics, where 'smart' functionality can be readily incorporated into almost any product at low cost. Over recent decades, rapid progress has been made in this field, which is now emerging into the industrial andcommercial realm. However, successful development and commercialisation on a large scale presents some significant technical challenges. For fully-printable electronic systems, all the component parts must be deposited from solutions (inks), requiring the development of new inorganic, organic and hybrid materials.A variety of traditional printing techniques are being explored and adapted forprinting these new materials in ways that result in the best performing electronicdevices. Whilst printed electronics research has initially focused on traditional typesof electronic device such as light-emitting diodes, transistors, and photovoltaics, it is increasingly apparent that a much wider range of applications can be realised. The soft and stretchable nature of printable materials makes them perfect candidates forbioelectronics, resulting in a wealth of research looking at biocompatible printable inks and biosensors. Regardless of application, the properties of printed electronicmaterials depend on the chemical structures, processing conditions, device architecture,and operational conditions, the complex inter-relationships of which aredriving ongoing research. We focus on three particular 'hot topics', where attention is currently focused: novel materials, characterisation techniques, and device stability. With progress advancing very rapidly, printed electronics is expected to grow over the next decade into a key technology with an enormous economic and social impact.

  9. Rugged and breathable forms of stretchable electronics with adherent composite substrates for transcutaneous monitoring.

    PubMed

    Jang, Kyung-In; Han, Sang Youn; Xu, Sheng; Mathewson, Kyle E; Zhang, Yihui; Jeong, Jae-Woong; Kim, Gwang-Tae; Webb, R Chad; Lee, Jung Woo; Dawidczyk, Thomas J; Kim, Rak Hwan; Song, Young Min; Yeo, Woon-Hong; Kim, Stanley; Cheng, Huanyu; Rhee, Sang Il; Chung, Jeahoon; Kim, Byunggik; Chung, Ha Uk; Lee, Dongjun; Yang, Yiyuan; Cho, Moongee; Gaspar, John G; Carbonari, Ronald; Fabiani, Monica; Gratton, Gabriele; Huang, Yonggang; Rogers, John A

    2014-09-03

    Research in stretchable electronics involves fundamental scientific topics relevant to applications with importance in human healthcare. Despite significant progress in active components, routes to mechanically robust construction are lacking. Here, we introduce materials and composite designs for thin, breathable, soft electronics that can adhere strongly to the skin, with the ability to be applied and removed hundreds of times without damaging the devices or the skin, even in regions with substantial topography and coverage of hair. The approach combines thin, ultralow modulus, cellular silicone materials with elastic, strain-limiting fabrics, to yield a compliant but rugged platform for stretchable electronics. Theoretical and experimental studies highlight the mechanics of adhesion and elastic deformation. Demonstrations include cutaneous optical, electrical and radio frequency sensors for measuring hydration state, electrophysiological activity, pulse and cerebral oximetry. Multipoint monitoring of a subject in an advanced driving simulator provides a practical example.

  10. Rugged and breathable forms of stretchable electronics with adherent composite substrates for transcutaneous monitoring

    NASA Astrophysics Data System (ADS)

    Jang, Kyung-In; Han, Sang Youn; Xu, Sheng; Mathewson, Kyle E.; Zhang, Yihui; Jeong, Jae-Woong; Kim, Gwang-Tae; Webb, R. Chad; Lee, Jung Woo; Dawidczyk, Thomas J.; Kim, Rak Hwan; Song, Young Min; Yeo, Woon-Hong; Kim, Stanley; Cheng, Huanyu; Rhee, Sang Il; Chung, Jeahoon; Kim, Byunggik; Chung, Ha Uk; Lee, Dongjun; Yang, Yiyuan; Cho, Moongee; Gaspar, John G.; Carbonari, Ronald; Fabiani, Monica; Gratton, Gabriele; Huang, Yonggang; Rogers, John A.

    2014-09-01

    Research in stretchable electronics involves fundamental scientific topics relevant to applications with importance in human healthcare. Despite significant progress in active components, routes to mechanically robust construction are lacking. Here, we introduce materials and composite designs for thin, breathable, soft electronics that can adhere strongly to the skin, with the ability to be applied and removed hundreds of times without damaging the devices or the skin, even in regions with substantial topography and coverage of hair. The approach combines thin, ultralow modulus, cellular silicone materials with elastic, strain-limiting fabrics, to yield a compliant but rugged platform for stretchable electronics. Theoretical and experimental studies highlight the mechanics of adhesion and elastic deformation. Demonstrations include cutaneous optical, electrical and radio frequency sensors for measuring hydration state, electrophysiological activity, pulse and cerebral oximetry. Multipoint monitoring of a subject in an advanced driving simulator provides a practical example.

  11. Cosmic Ray Interactions in Shielding Materials

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Aguayo Navarrete, Estanislao; Kouzes, Richard T.; Ankney, Austin S.

    2011-09-08

    This document provides a detailed study of materials used to shield against the hadronic particles from cosmic ray showers at Earth’s surface. This work was motivated by the need for a shield that minimizes activation of the enriched germanium during transport for the MAJORANA collaboration. The materials suitable for cosmic-ray shield design are materials such as lead and iron that will stop the primary protons, and materials like polyethylene, borated polyethylene, concrete and water that will stop the induced neutrons. The interaction of the different cosmic-ray components at ground level (protons, neutrons, muons) with their wide energy range (from kilo-electronmore » volts to giga-electron volts) is a complex calculation. Monte Carlo calculations have proven to be a suitable tool for the simulation of nucleon transport, including hadron interactions and radioactive isotope production. The industry standard Monte Carlo simulation tool, Geant4, was used for this study. The result of this study is the assertion that activation at Earth’s surface is a result of the neutronic and protonic components of the cosmic-ray shower. The best material to shield against these cosmic-ray components is iron, which has the best combination of primary shielding and minimal secondary neutron production.« less

  12. Conjugated Polymer Zwitterions: Efficient Interlayer Materials in Organic Electronics.

    PubMed

    Liu, Yao; Duzhko, Volodimyr V; Page, Zachariah A; Emrick, Todd; Russell, Thomas P

    2016-11-15

    Conjugated polymer zwitterions (CPZs) are neutral, hydrophilic, polymer semiconductors. The pendent zwitterions, viewed as side chain dipoles, impart solubility in polar solvents for solution processing, and open opportunities as interfacial components of optoelectronic devices, for example, between metal electrodes and organic semiconductor active layers. Such interlayers are crucial for defining the performance of organic electronic devices, e.g., field-effect transistors (OFETs), light-emitting diodes (OLEDs), and photovoltaics (OPVs), all of which consist of multilayer structures. The interlayers reduce the Schottky barrier height and thus improve charge injection in OFETs and OLEDs. In OPVs, the interlayers serve to increase the built-in electric potential difference (V bi ) across the active layer, ensuring efficient extraction of photogenerated charge carriers. In general, polar and even charged electronically active polymers have gained recognition for their ability to modify metal/semiconductor interfaces to the benefit of organic electronics. While conjugated polyelectrolytes (CPEs) as interlayer materials are well-documented, open questions remain about the role of mobile counterions in CPE-containing devices. CPZs possess the processing advantages of CPEs, but as neutral molecules lack any potential complications associated with counterions. The electronic implications of CPZs on metal electrodes stem from the orientation of the zwitterion dipole moment in close proximity to the metal surface, and the resultant surface-induced polarization. This generates an interfacial dipole (Δ) at the CPZ/metal interface, altering the work function of the electrode, as confirmed by ultraviolet photoelectron spectroscopy (UPS), and improving device performance. An ideal cathode interlayer would reduce electrode work function, have orthogonal processability to the active layer, exhibit good film forming properties (i.e., wettability/uniformity), prevent exciton quenching, possess optimal electron affinity that neither limits the work function reduction nor impedes the charge extraction, transport electrons selectively, and exhibit long-term stability. Our recent discoveries show that CPZs achieve many of these attributes, and are poised for further expansion and development in the interfacial science of organic electronics. This Account reviews a recent collaboration that began with the synthesis of CPZs and a study of their structural and electronic properties on metals, then extended to their application as interlayer materials for OPVs. We discuss CPZ structure-property relationships based on several material platforms, ranging from homopolymers to copolymers, and from materials with intrinsic p-type conjugated backbones to those with intrinsic n-type conjugated backbones. We discuss key components of such interlayers, including (i) the origin of work function reduction of CPZ interlayers on metals; (ii) the role of the frontier molecular orbital energy levels and their trade-offs in optimizing electronic and device properties; and (iii) the role of polymer conductivity type and the magnitude of charge carrier mobility. Our motivation is to present our prior use and current understanding of CPZs as interlayer materials in organic electronics, and describe outstanding issues and future potential directions.

  13. Cause and Effects of Fluorocarbon Degradation in Electronics and Opto-Electronic Systems

    NASA Technical Reports Server (NTRS)

    Predmore, Roamer E.; Canham, John S.

    2002-01-01

    Trace degradation of fluorocarbon or halocarbon materials must be addressed in their application in sensitive systems. As the dimensions and/or tolerances of components in a system decrease, the sensitivity of the system to trace fluorocarbon or halocarbon degradation products increases. Trace quantities of highly reactive degradation products from fluorocarbons have caused a number of failures of flight hardware. It is of utmost importance that the risk of system failure, resulting from trace amounts of reactive fluorocarbon degradation products be addressed in designs containing fluorocarbon or halocarbon materials. Thermal, electrical, and mechanical energy input into the system can multiply the risk of failure.

  14. Materials Degradation in the Jovian Radiation Environment

    NASA Technical Reports Server (NTRS)

    Miloshevsky, Gennady; Caffrey, Jarvis A.; Jones, Jonathan E.; Zoladz, Thomas F.

    2017-01-01

    The radiation environment of Jupiter represents a significant hazard for Europa Lander deorbit stage components, and presents a significant potential mission risk. The radiolytic degradation of ammonium perchlorate (AP) oxidizer in solid propellants may affect its properties and performance. The Monte Carlo code MONSOL was used for modeling of laboratory experiments on the electron irradiation of propellant samples. An approach for flattening dose profiles along the depth of irradiated samples is proposed. Depth-dose distributions produced by Jovian electrons in multi-layer slabs of materials are calculated. It is found that the absorbed dose in a particular slab is significantly affected by backscattered electrons and photons from neighboring slabs. The dose and radiolytic decomposition of AP crystals are investigated and radiation-induced chemical yields and weight percent of radical products are reported.

  15. Method of making thermally removable epoxies

    DOEpatents

    Loy, Douglas A.; Wheeler, David R.; Russick, Edward M.; McElhanon, James R.; Saunders, Randall S.

    2002-01-01

    A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to less than approximately 90.degree. C. to form a thermally-removable epoxy. The thermally-removable epoxy can be easily removed within approximately an hour by heating to temperatures greater than approximately 90.degree. C. in a polar solvent. The epoxy material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.

  16. Standardized Methods for Electronic Shearography

    NASA Technical Reports Server (NTRS)

    Lansing, Matthew D.

    1997-01-01

    Research was conducted in development of operating procedures and standard methods to evaluate fiber reinforced composite materials, bonded or sprayed insulation, coatings, and laminated structures with MSFC electronic shearography systems. Optimal operating procedures were developed for the Pratt and Whitney Electronic Holography/Shearography Inspection System (EH/SIS) operating in shearography mode, as well as the Laser Technology, Inc. (LTI) SC-4000 and Ettemeyer SHS-94 ISTRA shearography systems. Operating practices for exciting the components being inspected were studied, including optimal methods for transient heating with heat lamps and other methods as appropriate to enhance inspection capability.

  17. Rational design of metal-organic electronic devices: A computational perspective

    NASA Astrophysics Data System (ADS)

    Chilukuri, Bhaskar

    Organic and organometallic electronic materials continue to attract considerable attention among researchers due to their cost effectiveness, high flexibility, low temperature processing conditions and the continuous emergence of new semiconducting materials with tailored electronic properties. In addition, organic semiconductors can be used in a variety of important technological devices such as solar cells, field-effect transistors (FETs), flash memory, radio frequency identification (RFID) tags, light emitting diodes (LEDs), etc. However, organic materials have thus far not achieved the reliability and carrier mobility obtainable with inorganic silicon-based devices. Hence, there is a need for finding alternative electronic materials other than organic semiconductors to overcome the problems of inferior stability and performance. In this dissertation, I research the development of new transition metal based electronic materials which due to the presence of metal-metal, metal-pi, and pi-pi interactions may give rise to superior electronic and chemical properties versus their organic counterparts. Specifically, I performed computational modeling studies on platinum based charge transfer complexes and d 10 cyclo-[M(mu-L)]3 trimers (M = Ag, Au and L = monoanionic bidentate bridging (C/N~C/N) ligand). The research done is aimed to guide experimental chemists to make rational choices of metals, ligands, substituents in synthesizing novel organometallic electronic materials. Furthermore, the calculations presented here propose novel ways to tune the geometric, electronic, spectroscopic, and conduction properties in semiconducting materials. In addition to novel material development, electronic device performance can be improved by making a judicious choice of device components. I have studied the interfaces of a p-type metal-organic semiconductor viz cyclo-[Au(mu-Pz)] 3 trimer with metal electrodes at atomic and surface levels. This work was aimed to guide the device engineers to choose the appropriate metal electrodes considering the chemical interactions at the interface. Additionally, the calculations performed on the interfaces provided valuable insight into binding energies, charge redistribution, change in the energy levels, dipole formation, etc., which are important parameters to consider while fabricating an electronic device. The research described in this dissertation highlights the application of unique computational modeling methods at different levels of theory to guide the experimental chemists and device engineers toward a rational design of transition metal based electronic devices with low cost and high performance.

  18. Software for Managing Inventory of Flight Hardware

    NASA Technical Reports Server (NTRS)

    Salisbury, John; Savage, Scott; Thomas, Shirman

    2003-01-01

    The Flight Hardware Support Request System (FHSRS) is a computer program that relieves engineers at Marshall Space Flight Center (MSFC) of most of the non-engineering administrative burden of managing an inventory of flight hardware. The FHSRS can also be adapted to perform similar functions for other organizations. The FHSRS affords a combination of capabilities, including those formerly provided by three separate programs in purchasing, inventorying, and inspecting hardware. The FHSRS provides a Web-based interface with a server computer that supports a relational database of inventory; electronic routing of requests and approvals; and electronic documentation from initial request through implementation of quality criteria, acquisition, receipt, inspection, storage, and final issue of flight materials and components. The database lists both hardware acquired for current projects and residual hardware from previous projects. The increased visibility of residual flight components provided by the FHSRS has dramatically improved the re-utilization of materials in lieu of new procurements, resulting in a cost savings of over $1.7 million. The FHSRS includes subprograms for manipulating the data in the database, informing of the status of a request or an item of hardware, and searching the database on any physical or other technical characteristic of a component or material. The software structure forces normalization of the data to facilitate inquiries and searches for which users have entered mixed or inconsistent values.

  19. Electronic properties of conductive pili of the metal-reducing bacterium Geobacter sulfurreducens probed by scanning tunneling microscopy.

    PubMed

    Veazey, Joshua P; Reguera, Gemma; Tessmer, Stuart H

    2011-12-01

    The metal-reducing bacterium Geobacter sulfurreducens produces conductive protein appendages known as "pilus nanowires" to transfer electrons to metal oxides and to other cells. These processes can be harnessed for the bioremediation of toxic metals and the generation of electricity in bioelectrochemical cells. Key to these applications is a detailed understanding of how these nanostructures conduct electrons. However, to the best of our knowledge, their mechanism of electron transport is not known. We used the capability of scanning tunneling microscopy (STM) to probe conductive materials with higher spatial resolution than other scanning probe methods to gain insights into the transversal electronic behavior of native, cell-anchored pili. Despite the presence of insulating cellular components, the STM topography resolved electronic molecular substructures with periodicities similar to those reported for the pilus shaft. STM spectroscopy revealed electronic states near the Fermi level, consistent with a conducting material, but did not reveal electronic states expected for cytochromes. Furthermore, the transversal conductance was asymmetric, as previously reported for assemblies of helical peptides. Our results thus indicate that the Geobacter pilus shaft has an intrinsic electronic structure that could play a role in charge transport.

  20. Technology of fast spark gaps

    NASA Astrophysics Data System (ADS)

    Standler, Ronald B.

    1989-09-01

    To protect electronic systems from the effects of electromagnetic pulse (EMP) form nuclear weapons and high-power microwave (HPM) weapons, it is desirable to have fast responding protection components. The gas-filled spark gap appears to be an attractive protection component, except that it can be slow to conduct under certain conditions. This report reviews the literature and presents ideas for construction of a spark gap that will conduct in less than one nanosecond. The key concept to making a fast-responding spark gap is to produce a large number of free electrons quickly. Seven different mechanisms for production of free electrons are reviewed, and several that are relevant to miniature spark gaps for protective applications are discussed in detail. These mechanisms include: inclusion of radioactive materials, photoelectric effect, secondary electrode emission from the anode, and field emission from the cathode.

  1. Low-Thermal-Conductivity Pyrochlore Oxide Materials Developed for Advanced Thermal Barrier Coatings

    NASA Technical Reports Server (NTRS)

    Bansal, Narottam P.; Zhu, Dong-Ming

    2005-01-01

    When turbine engines operate at higher temperatures, they consume less fuel, have higher efficiencies, and have lower emissions. The upper-use temperatures of the base materials (superalloys, silicon-based ceramics, etc.) used for the hot-section components of turbine engines are limited by the physical, mechanical, and corrosion characteristics of these materials. Thermal barrier coatings (TBCs) are applied as thin layers on the surfaces of these materials to further increase the operating temperatures. The current state-of-the-art TBC material in commercial use is partially yttria-stabilized zirconia (YSZ), which is applied on engine components by plasma spraying or by electron-beam physical vapor deposition. At temperatures higher than 1000 C, YSZ layers are prone to sintering, which increases thermal conductivity and makes them less effective. The sintered and densified coatings can also reduce thermal stress and strain tolerance, which can reduce the coating s durability significantly. Alternate TBC materials with lower thermal conductivity and better sintering resistance are needed to further increase the operating temperature of turbine engines.

  2. Method for Designing Electronic Assemblies without Potting for Gun Launched Applications Through the Use of Additive Manufacturing

    DTIC Science & Technology

    2016-12-01

    easily would be preferred. Many studies have been conducted to model the effects of potting materials on PCBs and their components: two such studies ...catch (SCAT) gun Guidance electronics On -board recorder (OBR) Precision guided munition (PGM) 16. SECURITY CLASSIFICATION OF: 17... On -board Recorder 2 Initial Method - Modeling Assumptions 2 Initial Method - Parts, Instances, and Simplifications in the Model 3 Initial Method

  3. Carbon Nanotube Web with Carboxylated Polythiophene "Assist" for High-Performance Battery Electrodes.

    PubMed

    Kwon, Yo Han; Park, Jung Jin; Housel, Lisa M; Minnici, Krysten; Zhang, Guoyan; Lee, Sujin R; Lee, Seung Woo; Chen, Zhongming; Noda, Suguru; Takeuchi, Esther S; Takeuchi, Kenneth J; Marschilok, Amy C; Reichmanis, Elsa

    2018-04-24

    A carbon nanotube (CNT) web electrode comprising magnetite spheres and few-walled carbon nanotubes (FWNTs) linked by the carboxylated conjugated polymer, poly[3-(potassium-4-butanoate) thiophene] (PPBT), was designed to demonstrate benefits derived from the rational consideration of electron/ion transport coupled with the surface chemistry of the electrode materials components. To maximize transport properties, the approach introduces monodispersed spherical Fe 3 O 4 (sFe 3 O 4 ) for uniform Li + diffusion and a FWNT web electrode frame that affords characteristics of long-ranged electronic pathways and porous networks. The sFe 3 O 4 particles were used as a model high-capacity energy active material, owing to their well-defined chemistry with surface hydroxyl (-OH) functionalities that provide for facile detection of molecular interactions. PPBT, having a π-conjugated backbone and alkyl side chains substituted with carboxylate moieties, interacted with the FWNT π-electron-rich and hydroxylated sFe 3 O 4 surfaces, which enabled the formation of effective electrical bridges between the respective components, contributing to efficient electron transport and electrode stability. To further induce interactions between PPBT and the metal hydroxide surface, polyethylene glycol was coated onto the sFe 3 O 4 particles, allowing for facile materials dispersion and connectivity. Additionally, the introduction of carbon particles into the web electrode minimized sFe 3 O 4 aggregation and afforded more porous FWNT networks. As a consequence, the design of composite electrodes with rigorous consideration of specific molecular interactions induced by the surface chemistries favorably influenced electrochemical kinetics and electrode resistance, which afforded high-performance electrodes for battery applications.

  4. Electronic Devices With Diffusion Barrier and Process for Making Same

    DTIC Science & Technology

    2000-05-03

    components. Diffusion is also a problem with other high 10 conductivity metallization materials such as gold , silver, and platinum. As can be...those of subgroup IB of the Periodic Table (i.e., copper, silver, gold ), as well as platinum. These metals are highly attractive 10 for...the metal halide molecules of the desired thickness, is formed upon the monolayer portion of the barrier -7- material. The monolayer ( monoatomic

  5. Directly writing resistor, inductor and capacitor to composite functional circuits: a super-simple way for alternative electronics.

    PubMed

    Gao, Yunxia; Li, Haiyan; Liu, Jing

    2013-01-01

    The current strategies for making electronic devices are generally time, water, material and energy consuming. Here, the direct writing of composite functional circuits through comprehensive use of GaIn10-based liquid metal inks and matching material is proposed and investigated, which is a rather easy going and cost effective electronics fabrication way compared with the conventional approaches. Owing to its excellent adhesion and electrical properties, the liquid metal ink was demonstrated as a generalist in directly making various basic electronic components such as planar resistor, inductor and capacitor or their combination and thus composing circuits with expected electrical functions. For a precise control of the geometric sizes of the writing, a mask with a designed pattern was employed and demonstrated. Mechanisms for justifying the chemical components of the inks and the magnitudes of the target electronic elements so as to compose various practical circuits were disclosed. Fundamental tests on the electrical components including capacitor and inductor directly written on paper with working time up to 48 h and elevated temperature demonstrated their good stability and potential widespread adaptability especially when used in some high frequency circuits. As the first proof-of-concept experiment, a typical functional oscillating circuit including an integrated chip of 74HC04 with a supply voltage of 5 V, a capacitor of 10 nF and two resistors of 5 kΩ and 1 kΩ respectively was directly composed on paper through integrating specific electrical elements together, which presented an oscillation frequency of 8.8 kHz. The present method significantly extends the roles of the metal ink in recent works serving as only a single electrical conductor or interconnecting wires. It opens the way for directly writing out complex functional circuits or devices on different substrates. Such circuit composition strategy has generalized purpose and can be extended to more areas, even daily pervasive electronics.

  6. Directly Writing Resistor, Inductor and Capacitor to Composite Functional Circuits: A Super-Simple Way for Alternative Electronics

    PubMed Central

    Gao, Yunxia; Li, Haiyan; Liu, Jing

    2013-01-01

    Background The current strategies for making electronic devices are generally time, water, material and energy consuming. Here, the direct writing of composite functional circuits through comprehensive use of GaIn10-based liquid metal inks and matching material is proposed and investigated, which is a rather easy going and cost effective electronics fabrication way compared with the conventional approaches. Methods Owing to its excellent adhesion and electrical properties, the liquid metal ink was demonstrated as a generalist in directly making various basic electronic components such as planar resistor, inductor and capacitor or their combination and thus composing circuits with expected electrical functions. For a precise control of the geometric sizes of the writing, a mask with a designed pattern was employed and demonstrated. Mechanisms for justifying the chemical components of the inks and the magnitudes of the target electronic elements so as to compose various practical circuits were disclosed. Results Fundamental tests on the electrical components including capacitor and inductor directly written on paper with working time up to 48 h and elevated temperature demonstrated their good stability and potential widespread adaptability especially when used in some high frequency circuits. As the first proof-of-concept experiment, a typical functional oscillating circuit including an integrated chip of 74HC04 with a supply voltage of 5 V, a capacitor of 10 nF and two resistors of 5 kΩ and 1 kΩ respectively was directly composed on paper through integrating specific electrical elements together, which presented an oscillation frequency of 8.8 kHz. Conclusions The present method significantly extends the roles of the metal ink in recent works serving as only a single electrical conductor or interconnecting wires. It opens the way for directly writing out complex functional circuits or devices on different substrates. Such circuit composition strategy has generalized purpose and can be extended to more areas, even daily pervasive electronics. PMID:23936349

  7. Preservation of capsular material of streptococcal cells by specific lectins determined by immunoelectron microscopy.

    PubMed

    Molinari, A; Orefici, G; Donelli, G; Von Hunolstein, C; Paradisi, S; Arancia, G

    1988-09-01

    We describe the use of lectins as specific stabilizing agents for the polysaccharide capsular components of two Gram-positive bacteria, Streptococcus agalactiae and Streptococcus bovis. Treatment of bacterial suspensions with wheatgerm agglutinin and concanavalin A allowed better morphological preservation as well as immunoelectron microscopic localization of a capsular component (lipoteichoic acid) by employing specific antibodies and the protein A-gold technique. Data obtained indicate that lectins are useful agents in preserving highly water-soluble capsular components during the electron microscopy procedures for both unembedded and embedded samples.

  8. Hybrid stretchable circuits on silicone substrate

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Robinson, A., E-mail: adam.1.robinson@nokia.com; Aziz, A., E-mail: a.aziz1@lancaster.ac.uk; Liu, Q.

    When rigid and stretchable components are integrated onto a single elastic carrier substrate, large strain heterogeneities appear in the vicinity of the deformable-non-deformable interfaces. In this paper, we report on a generic approach to manufacture hybrid stretchable circuits where commercial electronic components can be mounted on a stretchable circuit board. Similar to printed circuit board development, the components are electrically bonded on the elastic substrate and interconnected with stretchable electrical traces. The substrate—a silicone matrix carrying concentric rigid disks—ensures both the circuit elasticity and the mechanical integrity of the most fragile materials.

  9. Materials and processing approaches for foundry-compatible transient electronics

    PubMed Central

    Chang, Jan-Kai; Fang, Hui; Bower, Christopher A.; Song, Enming; Yu, Xinge; Rogers, John A.

    2017-01-01

    Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for “green” electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries. PMID:28652373

  10. Development of a methodology for electronic waste estimation: A material flow analysis-based SYE-Waste Model.

    PubMed

    Yedla, Sudhakar

    2016-01-01

    Improved living standards and the share of services sector to the economy in Asia, and the use of electronic equipment is on the rise and results in increased electronic waste generation. A peculiarity of electronic waste is that it has a 'significant' value even after its life time, and to add complication, even after its extended life in its 'dump' stage. Thus, in Indian situations, after its life time is over, the e-material changes hands more than once and finally ends up either in the hands of informal recyclers or in the store rooms of urban dwellings. This character makes it extremely difficult to estimate electronic waste generation. The present study attempts to develop a functional model based on a material flow analysis approach by considering all possible end uses of the material, its transformed goods finally arriving at disposal. It considers various degrees of uses derived of the e-goods regarding their primary use (life time), secondary use (first degree extension of life), third-hand use (second degree extension of life), donation, retention at the respective places (without discarding), fraction shifted to scrap vendor, and the components reaching the final dump site from various end points of use. This 'generic functional model' named SYE-Waste Model, developed based on a material flow analysis approach, can be used to derive 'obsolescence factors' for various degrees of usage of e-goods and also to make a comprehensive estimation of electronic waste in any city/country. © The Author(s) 2015.

  11. Printed electronic on flexible and glass substrates

    NASA Astrophysics Data System (ADS)

    Futera, Konrad; Jakubowska, Małgorzata; Kozioł, Grażyna

    2010-09-01

    Organic electronics is a platform technology that enables multiple applications based on organic electronics but varied in specifications. Organic electronics is based on the combination of new materials and cost-effective, large area production processes that provide new fields of application. Organic electronic by its size, weight, flexibility and environmental friendliness electronics enables low cost production of numerous electrical components and provides for such promising fields of application as: intelligent packaging, low cost RFID, flexible solar cells, disposable diagnostic devices or games, and printed batteries [1]. The paper presents results of inkjetted electronics elements on flexible and glass substrates. The investigations was target on characterizing shape, surface and geometry of printed structures. Variety of substrates were investigated, within some, low cost, non specialized substrate, design for other purposes than organic electronic.

  12. Radiation Specifications for Fission Power Conversion Component Materials

    NASA Technical Reports Server (NTRS)

    Bowman, Cheryl L.; Shin, E. Eugene; Mireles, Omar R.; Radel, Ross F.; Qualls, A. Louis

    2011-01-01

    NASA has been supporting design studies and technology development that could provide power to an outpost on the moon, Mars, or an asteroid. One power-generation system that is independent of sunlight or power-storage limitations is a fission-based power plant. There is a wealth of terrestrial system heritage that can be transferred to the design and fabrication of a fission power system for space missions, but there are certain design aspects that require qualification. The radiation tolerance of the power conversion system requires scrutiny because the compact nature of a space power plant restricts the dose reduction methodologies compared to those used in terrestrial systems. An integrated research program has been conducted to establish the radiation tolerance of power conversion system-component materials. The radiation limit specifications proposed for a Fission Power System power convertor is 10 Mrad ionizing dose and 5 x 10(exp 14) neutron per square centimeter fluence for a convertor operating at 150 C. Specific component materials and their radiation tolerances are discussed. This assessment is for the power convertor hardware; electronic components are not covered here.

  13. Development of inorganic resists for electron beam lithography: Novel materials and simulations

    NASA Astrophysics Data System (ADS)

    Jeyakumar, Augustin

    Electron beam lithography is gaining widespread utilization as the semiconductor industry progresses towards both advanced optical and non-optical lithographic technologies for high resolution patterning. The current resist technologies are based on organic systems that are imaged most commonly through chain scission, networking, or a chemically amplified polarity change in the material. Alternative resists based on inorganic systems were developed and characterized in this research for high resolution electron beam lithography and their interactions with incident electrons were investigated using Monte Carlo simulations. A novel inorganic resist imaging scheme was developed using metal-organic precursors which decompose to form metal oxides upon electron beam irradiation that can serve as inorganic hard masks for hybrid bilayer inorganic-organic imaging systems and also as directly patternable high resolution metal oxide structures. The electron beam imaging properties of these metal-organic materials were correlated to the precursor structure by studying effects such as interactions between high atomic number species and the incident electrons. Optimal single and multicomponent precursors were designed for utilization as viable inorganic resist materials for sub-50nm patterning in electron beam lithography. The electron beam imaging characteristics of the most widely used inorganic resist material, hydrogen silsesquioxane (HSQ), was also enhanced using a dual processing imaging approach with thermal curing as well as a sensitizer catalyzed imaging approach. The interaction between incident electrons and the high atomic number species contained in these inorganic resists was also studied using Monte Carlo simulations. The resolution attainable using inorganic systems as compared to organic systems can be greater for accelerating voltages greater than 50 keV due to minimized lateral scattering in the high density inorganic systems. The effects of loading nanoparticles in an electron beam resist was also investigated using a newly developed hybrid Monte Carlo approach that accounts for multiple components in a solid film. The resolution of the nanocomposite resist process was found to degrade with increasing nanoparticle loading. Finally, the electron beam patterning of self-assembled monolayers, which were found to primarily utilize backscattered electrons from the high atomic number substrate materials to form images, was also investigated and characterized. It was found that backscattered electrons limit the resolution attainable at low incident electron energies.

  14. PREFACE: Spin Electronics

    NASA Astrophysics Data System (ADS)

    Dieny, B.; Sousa, R.; Prejbeanu, L.

    2007-04-01

    Conventional electronics has in the past ignored the spin on the electron, however things began to change in 1988 with the discovery of giant magnetoresistance in metallic thin film stacks which led to the development of a new research area, so called spin-electronics. In the last 10 years, spin-electronics has achieved a number of breakthroughs from the point of view of both basic science and application. Materials research has led to several major discoveries: very large tunnel magnetoresistance effects in tunnel junctions with crystalline barriers due to a new spin-filtering mechanism associated with the spin-dependent symmetry of the electron wave functions new magnetic tunnelling barriers leading to spin-dependent tunnelling barrier heights and acting as spin-filters magnetic semiconductors with increasingly high ordering temperature. New phenomena have been predicted and observed: the possibility of acting on the magnetization of a magnetic nanostructure with a spin-polarized current. This effect, due to a transfer of angular momentum between the spin polarized conduction electrons and the local magnetization, can be viewed as the reciprocal of giant or tunnel magnetoresistance. It can be used to switch the magnetization of a magnetic nanostructure or to generate steady magnetic excitations in the system. the possibility of generating and manipulating spin current without charge current by creating non-equilibrium local accumulation of spin up or spin down electrons. The range of applications of spin electronics materials and phenomena is expanding: the first devices based on giant magnetoresistance were the magnetoresistive read-heads for computer disk drives. These heads, introduced in 1998 with current-in plane spin-valves, have evolved towards low resistance tunnel magnetoresistice heads in 2005. Besides magnetic recording technology, these very sensitive magnetoresistive sensors are finding applications in other areas, in particular in biology. magnetic tunnel junctions were introduced as memory elements in new types of non-volatile magnetic memories (MRAM). A first 4Mbit product was launched by Freescale in July 2006. Future generations of memories are being developed by academic groups or companies. the combination of magnetic elements with CMOS components opens a whole new paradigm in hybrid electronic components which can change the common conception of the architecture of complex electronic components with a much tighter integration of logic and memory. the steady magnetic excitations stimulated by spin-transfer might be used in a variety of microwave components provided the output power can be increased. Intense research and development efforts are being aimed at increasing this power by the synchronization of oscillators. The articles compiled in this special issue of Journal of Physics: Condensed Matter, devoted to spin electronics, review these recent developments. All the contributors are greatly acknowledged.

  15. Organic electronics with polymer dielectrics on plastic substrates fabricated via transfer printing

    NASA Astrophysics Data System (ADS)

    Hines, Daniel R.

    Printing methods are fast becoming important processing techniques for the fabrication of flexible electronics. Some goals for flexible electronics are to produce cheap, lightweight, disposable radio frequency identification (RFID) tags, very large flexible displays that can be produced in a roll-to-roll process and wearable electronics for both the clothing and medical industries. Such applications will require fabrication processes for the assembly of dissimilar materials onto a common substrate in ways that are compatible with organic and polymeric materials as well as traditional solid-state electronic materials. A transfer printing method has been developed with these goals and application in mind. This printing method relies primarily on differential adhesion where no chemical processing is performed on the device substrate. It is compatible with a wide variety of materials with each component printed in exactly the same way, thus avoiding any mixed processing steps on the device substrate. The adhesion requirements of one material printed onto a second are studied by measuring the surface energy of both materials and by surface treatments such as plasma exposure or the application of self-assembled monolayers (SAM). Transfer printing has been developed within the context of fabricating organic electronics onto plastic substrates because these materials introduce unique opportunities associated with processing conditions not typically required for traditional semiconducting materials. Compared to silicon, organic semiconductors are soft materials that require low temperature processing and are extremely sensitive to chemical processing and environmental contamination. The transfer printing process has been developed for the important and commonly used organic semiconducting materials, pentacene (Pn) and poly(3-hexylthiophene) (P3HT). A three-step printing process has been developed by which these materials are printed onto an electrode subassembly consisting of previously printed electrodes separated by a polymer dielectric layer all on a plastic substrate. These bottom contact, flexible organic thin-film transistors (OTFT) have been compared to unprinted (reference) devices consisting of top contact electrodes and a silicon dioxide dielectric layer on a silicon substrate. Printed Pn and P3HT TFTs have been shown to out-perform the reference devices. This enhancement has been attributed to an annealing under pressure of the organic semiconducting material.

  16. Beyond CMOS: heterogeneous integration of III–V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems

    PubMed Central

    Kazior, Thomas E.

    2014-01-01

    Advances in silicon technology continue to revolutionize micro-/nano-electronics. However, Si cannot do everything, and devices/components based on other materials systems are required. What is the best way to integrate these dissimilar materials and to enhance the capabilities of Si, thereby continuing the micro-/nano-electronics revolution? In this paper, I review different approaches to heterogeneously integrate dissimilar materials with Si complementary metal oxide semiconductor (CMOS) technology. In particular, I summarize results on the successful integration of III–V electronic devices (InP heterojunction bipolar transistors (HBTs) and GaN high-electron-mobility transistors (HEMTs)) with Si CMOS on a common silicon-based wafer using an integration/fabrication process similar to a SiGe BiCMOS process (BiCMOS integrates bipolar junction and CMOS transistors). Our III–V BiCMOS process has been scaled to 200 mm diameter wafers for integration with scaled CMOS and used to fabricate radio-frequency (RF) and mixed signals circuits with on-chip digital control/calibration. I also show that RF microelectromechanical systems (MEMS) can be integrated onto this platform to create tunable or reconfigurable circuits. Thus, heterogeneous integration of III–V devices, MEMS and other dissimilar materials with Si CMOS enables a new class of high-performance integrated circuits that enhance the capabilities of existing systems, enable new circuit architectures and facilitate the continued proliferation of low-cost micro-/nano-electronics for a wide range of applications. PMID:24567473

  17. Beyond CMOS: heterogeneous integration of III-V devices, RF MEMS and other dissimilar materials/devices with Si CMOS to create intelligent microsystems.

    PubMed

    Kazior, Thomas E

    2014-03-28

    Advances in silicon technology continue to revolutionize micro-/nano-electronics. However, Si cannot do everything, and devices/components based on other materials systems are required. What is the best way to integrate these dissimilar materials and to enhance the capabilities of Si, thereby continuing the micro-/nano-electronics revolution? In this paper, I review different approaches to heterogeneously integrate dissimilar materials with Si complementary metal oxide semiconductor (CMOS) technology. In particular, I summarize results on the successful integration of III-V electronic devices (InP heterojunction bipolar transistors (HBTs) and GaN high-electron-mobility transistors (HEMTs)) with Si CMOS on a common silicon-based wafer using an integration/fabrication process similar to a SiGe BiCMOS process (BiCMOS integrates bipolar junction and CMOS transistors). Our III-V BiCMOS process has been scaled to 200 mm diameter wafers for integration with scaled CMOS and used to fabricate radio-frequency (RF) and mixed signals circuits with on-chip digital control/calibration. I also show that RF microelectromechanical systems (MEMS) can be integrated onto this platform to create tunable or reconfigurable circuits. Thus, heterogeneous integration of III-V devices, MEMS and other dissimilar materials with Si CMOS enables a new class of high-performance integrated circuits that enhance the capabilities of existing systems, enable new circuit architectures and facilitate the continued proliferation of low-cost micro-/nano-electronics for a wide range of applications.

  18. Standard Specification for Language Laboratory.

    ERIC Educational Resources Information Center

    North Carolina State Dept. of Administration, Raleigh.

    This specification covers the components of electronic and electromechanical equipment, nonelectronic materials for the teacher-student positions, and other items of a miscellaneous nature to provide for a complete and workable language laboratory facility. Language laboratory facilities covered by this specification are of two types: (1)…

  19. Standard Specifications for Language Laboratory.

    ERIC Educational Resources Information Center

    North Carolina State Dept. of Administration, Raleigh.

    Specifications are presented covering the components of electronic and electro-mechanical equipment, non-electrical materials for the teacher-student positions, and other items of a miscellaneous nature to provide for a complete, workable language laboratory facility. Instructions for the use of specifications are included for the purchaser,…

  20. Lightning protection for aircraft

    NASA Technical Reports Server (NTRS)

    Fisher, F. A.; Plumer, J. A.

    1980-01-01

    Reference book summarizes current knowledge concerning potential lightning effects on aircraft and means available to designers and operators to protect against effects. Book is available because of increasing use of nonmetallic materials in aircraft structural components and use of electronic equipment for control of critical flight operations and navigation.

  1. NASA Tech Briefs, December 2001. Volume 25, No. 12

    NASA Technical Reports Server (NTRS)

    2001-01-01

    Topics include: special coverage section on sensors, and sections on electronic components and systems, software, materials, mechanics, information sciences, book and reports, and a special section of Motion Control Tech Briefs. It also contains a section celebrating the 25th anniversary of the publication.

  2. Metal rubber sensor technology to enable in-flight icing measurement

    NASA Astrophysics Data System (ADS)

    Berg, Michelle; Lalli, Jennifer; Claus, Richard; Kreeger, Richard E.

    2017-04-01

    This paper describes the development and testing of Metal Rubber sensors for the nondestructive, normal force detection of ice accretion on aerospace structures. The buildup of ice on aircraft engine components, wings and rotorblades is a problem for both civilian and military aircraft that must operate under all weather conditions. Ice adds mass to moving components, thus changing the equations of motion that control the operation of the system as well as increasing drag and torque requirements. Ice also alters the surface geometry of leading edges, altering the airflow transition from laminar to turbulent, generating turbulence and again increasing drag. Metal Rubber is a piezoresistive material that exhibits a change in electrical resistance in response to physical deformation. It is produced as a freestanding sheet that is assembled at the molecular level using alternating layers of conductive metal nanoparticles and polymers. As the volume percentage of the conductive nanoparticle clusters within the material is increased from zero, the onset of electrical conduction occurs abruptly at the percolation threshold. Electrical conduction occurs due to electron hopping between the clusters. If a length of the material is strained, the clusters move apart so the efficiency of electron hopping decreases and electrical resistance increases. The resulting change in resistance as a function of the change in strain in the material, at a specific volume percentage of conductive clusters, can be interpreted as the transduction response of the material. We describe how sensors fabricated from these materials can be used to measure ice buildup.

  3. Plasma jet printing of electronic materials on flexible and nonconformal objects.

    PubMed

    Gandhiraman, Ram P; Jayan, Vivek; Han, Jin-Woo; Chen, Bin; Koehne, Jessica E; Meyyappan, M

    2014-12-10

    We present a novel approach for the room-temperature fabrication of conductive traces and their subsequent site-selective dielectric encapsulation for use in flexible electronics. We have developed an aerosol-assisted atmospheric pressure plasma-based deposition process for efficiently depositing materials on flexible substrates. Silver nanowire conductive traces and silicon dioxide dielectric coatings for encapsulation were deposited using this approach as a demonstration. The paper substrate with silver nanowires exhibited a very low change in resistance upon 50 cycles of systematic deformation, exhibiting high mechanical flexibility. The applicability of this process to print conductive traces on nonconformal 3D objects was also demonstrated through deposition on a 3D-printed thermoplastic object, indicating the potential to combine plasma printing with 3D printing technology. The role of plasma here includes activation of the material present in the aerosol for deposition, increasing the deposition rate, and plasma polymerization in the case of inorganic coatings. The demonstration here establishes a low-cost, high-throughput, and facile process for printing electronic components on nonconventional platforms.

  4. Electronic transport in NbSe₂ two-dimensional nanostructures: semiconducting characteristics and photoconductivity.

    PubMed

    Huang, Y H; Chen, R S; Zhang, J R; Huang, Y S

    2015-12-07

    The electronic transport properties of two-dimensional (2D) niobium diselenide (NbSe2) layer materials with two-hexagonal single-crystalline structures grown by chemical vapor transport were investigated. Those NbSe2 nanostructures isolated simply using mechanical exfoliation were found to exhibit lower conductivity and semiconducting properties, compared with their bulk metallic counterparts. Benefiting from lower dark conductivity, NbSe2 nanoflakes exhibit a remarkable photoresponse under different wavelengths and intensity excitations. The photocurrent responsivity and photoconductive gain can reach 3.8 A W(-1) and 300, respectively; these values are higher than those of graphene and MoS2 monolayers and are comparable with those of GaS and GaSe nanosheets. The presence of electron trap states at the surface was proposed as an explanation for the reduced dark conductivity and enhanced photoconductivity in the 2D NbSe2 nanostructures. This work identifies another possibility for the application of a metallic layer material as an optoelectronic component in addition to an ultrathin transparent conducting material.

  5. Nanoparticle-Hydrogel Composites: Concept, Design, and Applications of These Promising, Multi-Functional Materials.

    PubMed

    Thoniyot, Praveen; Tan, Mein Jin; Karim, Anis Abdul; Young, David James; Loh, Xian Jun

    2015-02-01

    New technologies rely on the development of new materials, and these may simply be the innovative combination of known components. The structural combination of a polymer hydrogel network with a nanoparticle (metals, non-metals, metal oxides, and polymeric moieties) holds the promise of providing superior functionality to the composite material with applications in diverse fields, including catalysis, electronics, bio-sensing, drug delivery, nano-medicine, and environmental remediation. This mixing may result in a synergistic property enhancement of each component: for example, the mechanical strength of the hydrogel and concomitantly decrease aggregation of the nanoparticles. These mutual benefits and the associated potential applications have seen a surge of interest in the past decade from multi-disciplinary research groups. Recent advances in nanoparticle-hydrogel composites are herein reviewed with a focus on their synthesis, design, potential applications, and the inherent challenges accompanying these exciting materials.

  6. Nanoparticle–Hydrogel Composites: Concept, Design, and Applications of These Promising, Multi‐Functional Materials

    PubMed Central

    Thoniyot, Praveen; Tan, Mein Jin; Karim, Anis Abdul; Young, David James

    2015-01-01

    New technologies rely on the development of new materials, and these may simply be the innovative combination of known components. The structural combination of a polymer hydrogel network with a nanoparticle (metals, non‐metals, metal oxides, and polymeric moieties) holds the promise of providing superior functionality to the composite material with applications in diverse fields, including catalysis, electronics, bio‐sensing, drug delivery, nano‐medicine, and environmental remediation. This mixing may result in a synergistic property enhancement of each component: for example, the mechanical strength of the hydrogel and concomitantly decrease aggregation of the nanoparticles. These mutual benefits and the associated potential applications have seen a surge of interest in the past decade from multi‐disciplinary research groups. Recent advances in nanoparticle–hydrogel composites are herein reviewed with a focus on their synthesis, design, potential applications, and the inherent challenges accompanying these exciting materials. PMID:27980900

  7. Investigation of solar cells fabricated on low-cost silicon sheet materials using 1 MeV electron irradiation

    NASA Technical Reports Server (NTRS)

    Kachare, A. H.; Hyland, S. L.; Garlick, G. F. J.

    1981-01-01

    The use of high energy electron irradiation is investigated as a controlled means to study in more detail the junction depletion layer processes of solar cells made on various low-cost silicon sheet materials. Results show that solar cells made on Czochralski grown silicon exhibit enhancement of spectral response in the shorter wavelength region when irradiated with high energy electrons. The base region damage can be reduced by subsequent annealing at 450 C which restores the degraded longer wavelength response, although the shorter wavelength enhancement persists. The second diode component of the cell dark forward bias current is also reduced by electron irradiation, while thermal annealing at 450 C without electron irradiation can also produce these same effects. Electron irradiation produces small changes in the shorter wavelength spectral responses and junction improvements in solar cells made on WEB, EFG, and HEM silicon. It is concluded that these beneficial effects on cell characteristics are due to the reduction of oxygen associated deep level recombination centers in the N(+) diffused layer and in the junction.

  8. Static electric dipole polarizabilities of An(5+/6+) and AnO2 (+/2+) (An = U, Np, and Pu) ions.

    PubMed

    Parmar, Payal; Peterson, Kirk A; Clark, Aurora E

    2014-12-21

    The parallel components of static electric dipole polarizabilities have been calculated for the lowest lying spin-orbit states of the penta- and hexavalent oxidation states of the actinides (An) U, Np, and Pu, in both their atomic and molecular diyl ion forms (An(5+/6+) and AnO2 (+/2+)) using the numerical finite-field technique within a four-component relativistic framework. The four-component Dirac-Hartree-Fock method formed the reference for MP2 and CCSD(T) calculations, while multireference Fock space coupled-cluster (FSCC), intermediate Hamiltonian Fock space coupled-cluster (IH-FSCC) and Kramers restricted configuration interaction (KRCI) methods were used to incorporate additional electron correlation. It is observed that electron correlation has significant (∼5 a.u.(3)) impact upon the parallel component of the polarizabilities of the diyls. To the best of our knowledge, these quantities have not been previously reported and they can serve as reference values in the determination of various electronic and response properties (for example intermolecular forces, optical properties, etc.) relevant to the nuclear fuel cycle and material science applications. The highest quality numbers for the parallel components (αzz) of the polarizability for the lowest Ω levels corresponding to the ground electronic states are (in a.u.(3)) 44.15 and 41.17 for UO2 (+) and UO2 (2+), respectively, 45.64 and 41.42 for NpO2 (+) and NpO2 (2+), respectively, and 47.15 for the PuO2 (+) ion.

  9. A double responsive smart upconversion fluorescence sensing material for glycoprotein.

    PubMed

    Guo, Ting; Deng, Qiliang; Fang, Guozhen; Yun, Yaguang; Hu, Yongjin; Wang, Shuo

    2016-11-15

    A novel strategy was developed to prepare double responsive smart upconversion fluorescence material for highly specific enrichment and sensing of glycoprotein. The novel double responsive smart sensing material was synthesized by choosing Horse radish peroxidase (HRP) as modal protein, the grapheme oxide (GO) as support material, upconversion nanoparticles (UCNPs) as fluorescence signal reporter, N-isopropyl acrylamide (NIPAAM) and 4-vinylphenylboronic acid (VPBA) as functional monomers. The structure and component of smart sensing material was investigated by transmission electron microscopy (TEM), Scanning electron microscopy (SEM), X-ray photoelectron spectroscopic (XPS) and Fourier transform infrared (FTIR), respectively. These results illustrated the smart sensing material was prepared successfully. The recognition characterizations of smart sensing material were evaluated, and results showed that the fluorescence intensity of smart sensing material was reduced gradually, as the concentration of protein increased, and the smart sensing material showed selective recognition for HRP among other proteins. Furthermore, the recognition ability of the smart sensing material for glycoprotein was regulated by controlling the pH value and temperature. Therefore, this strategy opens up new way to construct smart material for detection of glycoprotein. Copyright © 2016 Elsevier B.V. All rights reserved.

  10. Non-aqueous cleaning solvent substitution

    NASA Technical Reports Server (NTRS)

    Meier, Gerald J.

    1994-01-01

    A variety of environmental, safety, and health concerns exist over use of chlorinated and fluorinated cleaning solvents. Sandia National Laboratories, Lawrence Livermore National Laboratories, and the Kansas City Division of AlliedSignal have combined efforts to focus on finding alternative cleaning solvents and processes which are effective, environmentally safe, and compliant with local, state, and federal regulations. An alternative solvent has been identified, qualified, and implemented into production of complex electronic assemblies, where aqueous and semi-aqueous cleaning processes are not allowed. Extensive compatibility studies were performed with components, piece-parts, and materials. Electrical testing and accelerated aging were used to screen for detrimental, long-term effects. A terpene, d-limonene, was selected as the solvent of choice, and it was found to be compatible with the components and materials tested. A brief history of the overall project will be presented, along with representative cleaning efficiency results, compatibility results, and residual solvent data. The electronics industry is constantly searching for proven methods and environmentally-safe materials to use in manufacturing processes. The information in this presentation will provide another option to consider on future projects for applications requiring high levels of quality, reliability, and cleanliness from non-aqueous cleaning processes.

  11. Optical Dark-Field and Electron Energy Loss Imaging and Spectroscopy of Symmetry-Forbidden Modes in Loaded Nanogap Antennas.

    PubMed

    Brintlinger, Todd; Herzing, Andrew A; Long, James P; Vurgaftman, Igor; Stroud, Rhonda; Simpkins, B S

    2015-06-23

    We have produced large numbers of hybrid metal-semiconductor nanogap antennas using a scalable electrochemical approach and systematically characterized the spectral and spatial character of their plasmonic modes with optical dark-field scattering, electron energy loss spectroscopy with principal component analysis, and full wave simulations. The coordination of these techniques reveal that these nanostructures support degenerate transverse modes which split due to substrate interactions, a longitudinal mode which scales with antenna length, and a symmetry-forbidden gap-localized transverse mode. This gap-localized transverse mode arises from mode splitting of transverse resonances supported on both antenna arms and is confined to the gap load enabling (i) delivery of substantial energy to the gap material and (ii) the possibility of tuning the antenna resonance via active modulation of the gap material's optical properties. The resonant position of this symmetry-forbidden mode is sensitive to gap size, dielectric strength of the gap material, and is highly suppressed in air-gapped structures which may explain its absence from the literature to date. Understanding the complex modal structure supported on hybrid nanosystems is necessary to enable the multifunctional components many seek.

  12. Preparation and Characterization of Graphene Oxide Paper

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Dikin,D.; Stankovich, S.; Zimney, E.

    2007-01-01

    Free-standing paper-like or foil-like materials are an integral part of our technological society. Their uses include protective layers, chemical filters, components of electrical batteries or supercapacitors, adhesive layers, electronic or optoelectronic components, and molecular storage. Inorganic 'paper-like' materials based on nanoscale components such as exfoliated vermiculite or mica platelets have been intensively studied and commercialized as protective coatings, high-temperature binders, dielectric barriers and gas-impermeable membranes. Carbon-based flexible graphite foils composed of stacked platelets of expanded graphite have long been used in packing and gasketing applications because of their chemical resistivity against most media, superior sealability over a wide temperature range,more » and impermeability to fluids. The discovery of carbon nanotubes brought about bucky paper, which displays excellent mechanical and electrical properties that make it potentially suitable for fuel cell and structural composite applications. Here we report the preparation and characterization of graphene oxide paper, a free-standing carbon-based membrane material made by flow-directed assembly of individual graphene oxide sheets. This new material outperforms many other paper-like materials in stiffness and strength. Its combination of macroscopic flexibility and stiffness is a result of a unique interlocking-tile arrangement of the nanoscale graphene oxide sheets.« less

  13. Preparation and characterization of graphene oxide paper.

    PubMed

    Dikin, Dmitriy A; Stankovich, Sasha; Zimney, Eric J; Piner, Richard D; Dommett, Geoffrey H B; Evmenenko, Guennadi; Nguyen, SonBinh T; Ruoff, Rodney S

    2007-07-26

    Free-standing paper-like or foil-like materials are an integral part of our technological society. Their uses include protective layers, chemical filters, components of electrical batteries or supercapacitors, adhesive layers, electronic or optoelectronic components, and molecular storage. Inorganic 'paper-like' materials based on nanoscale components such as exfoliated vermiculite or mica platelets have been intensively studied and commercialized as protective coatings, high-temperature binders, dielectric barriers and gas-impermeable membranes. Carbon-based flexible graphite foils composed of stacked platelets of expanded graphite have long been used in packing and gasketing applications because of their chemical resistivity against most media, superior sealability over a wide temperature range, and impermeability to fluids. The discovery of carbon nanotubes brought about bucky paper, which displays excellent mechanical and electrical properties that make it potentially suitable for fuel cell and structural composite applications. Here we report the preparation and characterization of graphene oxide paper, a free-standing carbon-based membrane material made by flow-directed assembly of individual graphene oxide sheets. This new material outperforms many other paper-like materials in stiffness and strength. Its combination of macroscopic flexibility and stiffness is a result of a unique interlocking-tile arrangement of the nanoscale graphene oxide sheets.

  14. Synthesis and characterization of magnetic of Ni/ABS nanocomposites by electrical explosion of wire in liquid and solution blending methods

    NASA Astrophysics Data System (ADS)

    Thuyet-Nguyen, Minh; Hai-Nguyen, Hong; Kim, Won Joo; Kim, Ho Yoon; Kim, Jin-Chun

    2017-03-01

    Nanomaterials have attracted great attention from chemists, physicists and materials scientists because of their application benefits and special properties. Thermoplastics have been used in many applications such as molding of non-electrical components, conducting, magnetic field and 3D printing. Nanocomposites are known as a material which blends the best properties of components, a high performance material exhibits unusual property combinations and unique design possibilities. In this research, we focused to investigate and report primary results in the synthesis of magnetic nanocomposites based on acrylonitrile butadiene styrene (ABS), which are useful and important thermoplastics. Nickel nanopowder was prepared by electrical explosion of wire in a liquid were used as magnetic component. The composites were prepared by following steps, first the obtained Ni nanopowders were incorporated into the ABS matrix via a solution blending method (drop-casting), and then the solvent was evaporated. The characterizations of obtaining composites were analyzed by field emission scanning electron microscopy, X-Ray Diffraction analysis and vibrating sample magnetometer.

  15. Trends of microwave dielectric materials for antenna application

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Sulong, T. A. T., E-mail: tuanamirahtuansulong@gmail.com; Osman, R. A. M., E-mail: rozana@unimap.edu.my; Idris, M. S., E-mail: sobri@unimap.edu.my

    Rapid development of a modern microwave communication system requires a high quality microwave dielectric ceramic material to be used as mobile and satellite communication. High permittivity of dielectric ceramics leads to fabrication of compact device for electronic components. Dielectric ceramics which used for microwave applications required three important parameters such as high or appropriate permittivity (ε{sub r}), high quality factor (Q {sub f} ≥ 5000 GH z) and good temperature coefficient of resonant frequency (τ{sub f}). This paper review of various dielectric ceramic materials used as microwave dielectric materials and related parameters for antenna applications.

  16. Anisotropic charge density wave in layered 1 T - TiS e 2

    DOE PAGES

    Qiao, Qiao; Zhou, Songsong; Tao, Jing; ...

    2017-10-04

    We present a three-dimensional study on the anisotropy of the charge density wave (CDW) in 1T-TiSe 2, by means of in situ atomically resolved electron microscopy at cryogenic temperatures in both reciprocal and real spaces. Using coherent nanoelectron diffraction, we observed short-range coherence of the in-plane CDW component while the long-range coherence of out-of-plane CDW component remains intact. An in-plane CDW coherence length of ~10 nm and an out-of-plane CDW coherence length of 17.5 nm, as a lower bound, were determined. The electron modulation was observed using electron energy-loss spectroscopy and verified by an orbital-projected density of states. Our integratedmore » approach reveals anisotropic CDW domains at the nanoscale, and illustrates electron modulation-induced symmetry breaking of a two-dimensional material in three dimensions, offering an opportunity to study the effect of reduced dimensionality in strongly correlated systems.« less

  17. Electrical and electronic waste: a global environmental problem.

    PubMed

    Ramesh Babu, Balakrishnan; Parande, Anand Kuber; Ahmed Basha, Chiya

    2007-08-01

    The production of electrical and electronic equipment (EEE) is one of the fastest growing global manufacturing activities. This development has resulted in an increase of waste electric and electronic equipment (WEEE). Rapid economic growth, coupled with urbanization and growing demand for consumer goods, has increased both the consumption of EEE and the production of WEEE, which can be a source of hazardous wastes that pose a risk to the environment and to sustainable economic growth. To address potential environmental problems that could stem from improper management of WEEE, many countries and organizations have drafted national legislation to improve the reuse, recycling and other forms of material recovery from WEEE to reduce the amount and types of materials disposed in landfills. Recycling of waste electric and electronic equipment is important not only to reduce the amount of waste requiring treatment, but also to promote the recovery of valuable materials. EEE is diverse and complex with respect to the materials and components used and waste streams from the manufacturing processes. Characterization of these wastes is of paramount importance for developing a cost-effective and environmentally sound recycling system. This paper offers an overview of electrical and e-waste recycling, including a description of how it is generated and classified, strategies and technologies for recovering materials, and new scientific developments related to these activities. Finally, the e-waste recycling industry in India is also discussed.

  18. NASA Tech Briefs, May 1999. Volume 23, No. 5

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics include: special coverage sections on sensors and composites and plastics, and sections on electronic components and systems, software, materials, mechanics, machinery and automation, bio-medical, physical sciences, book and reports, and a special section of Photonics Tech Briefs and Rapid Product Development Tech Briefs.

  19. NASA Tech Briefs, March 1999. Volume 23, No. 3

    NASA Technical Reports Server (NTRS)

    1999-01-01

    Topics include: special coverage sections on CAD/CAE/PDM, industrial controls and sections on electronic components systems, materials, software, mechanics, machinery/automation, manufacturing/fabrication, physical sciences, book and reports, and a special section of Photonics Tech Briefs and a seconds special section of Rapid Product Development.

  20. Electronic Sensors: Making the Connection

    ERIC Educational Resources Information Center

    Johnson, Richard T.; Cotton, Samuel E.

    2008-01-01

    For educational purposes it is not necessary to use expensive commercial-grade equipment to teach students about commonly used sensors. Schools frequently have limited funds for acquiring educational materials; therefore, purchasing sensors identical to those used in large-scale industry is not an option. By purchasing small-scale components that…

  1. Why Domestic Preference Is Ineffective: Making the Business Case for Globalized Federal Government Procurement

    DTIC Science & Technology

    2004-10-04

    Electrical and Electronics Engineers , Inc., standard 610.12-1990 (standard glossary of software engineer terminology, p.42) Piscataway, NJ, available at...recently described by Representative David Dreier (R-California), as “people who want to pull up the drawbridge and shift back to the era of little or no...sensors, electronics , or other items added to, and not normally associated with, clothing (and the materials and components thereof)”. Page 30

  2. Response of geostationary communications satellite solid-state power amplifiers to high-energy electron fluence

    NASA Astrophysics Data System (ADS)

    Lohmeyer, Whitney; Carlton, Ashley; Wong, Frankie; Bodeau, Michael; Kennedy, Andrew; Cahoy, Kerri

    2015-05-01

    The key components in communications satellite payloads are the high-power amplifiers that amplify the received signal so that it can be accurately transmitted to the intended end user. In this study, we examine 26 amplifier anomalies and quantify the high-energy electron environment for periods of time prior to the anomalies. Building on the work of Lohmeyer and Cahoy (2013), we find that anomalies occur at a rate higher than just by chance when the >2 MeV electron fluence accumulated over 14 and 21 days is elevated. To try to understand "why," we model the amplifier subsystem to assess whether the dielectric material in the radio frequency (RF) coaxial cables, which are the most exposed part of the system, is liable to experience electrical breakdown due to internal charging. We find that the accumulated electric field over the 14 and 21 days leading up to the anomalies is high enough to cause the dielectric material in the coax to breakdown. We also find that the accumulated voltages reached are high enough to compromise components in the amplifier system, for example, the direct current (DC) blocking capacitor. An electron beam test using a representative coaxial cable terminated in a blocking capacitor showed that discharges could occur with peak voltages and energies sufficient to damage active RF semiconductor devices.

  3. Manufacturing of Liquid-Embedded Elastomers for Stretchable Electronics

    NASA Astrophysics Data System (ADS)

    Kramer, Rebecca; Majidi, Carmel; Weaver, James; Wood, Robert

    2013-03-01

    Future generations of robots, electronics, and assistive medical devices will include systems that are soft, elastically deformable, and may adapt their functionality in unstructured environments. This will require soft active materials for power circuits and sensing of deformation and contact pressure. As the demand for increased elasticity of electrical components heightens, the challenges for functionality revert to basic questions of fabrication, materials, and design. Several designs for soft sensory skins (including strain, pressure and curvature sensors) based on a liquid-embedded-elastomer approach have been developed. This talk will highlight new ``soft MEMS'' manufacturing techniques based on wetting behavior between gallium-indium alloys and elastomers with varying microtextured surface topography. Supported by Harvard MRSEC and the Wyss Institute

  4. Dynamic Characterization and Modeling of Potting Materials for Electronics Assemblies

    NASA Astrophysics Data System (ADS)

    Joshi, Vasant; Lee, Gilbert; Santiago, Jaime

    2015-06-01

    Prediction of survivability of encapsulated electronic components subject to impact relies on accurate modeling. Both static and dynamic characterization of encapsulation material is needed to generate a robust material model. Current focus is on potting materials to mitigate high rate loading on impact. In this effort, encapsulation scheme consists of layers of polymeric material Sylgard 184 and Triggerbond Epoxy-20-3001. Experiments conducted for characterization of materials include conventional tension and compression tests, Hopkinson bar, dynamic material analyzer (DMA) and a non-conventional accelerometer based resonance tests for obtaining high frequency data. For an ideal material, data can be fitted to Williams-Landel-Ferry (WLF) model. A new temperature-time shift (TTS) macro was written to compare idealized temperature shift factor (WLF model) with experimental incremental shift factors. Deviations can be observed by comparison of experimental data with the model fit to determine the actual material behavior. Similarly, another macro written for obtaining Ogden model parameter from Hopkinson Bar tests indicates deviations from experimental high strain rate data. In this paper, experimental results for different materials used for mitigating impact, and ways to combine data from resonance, DMA and Hopkinson bar together with modeling refinements will be presented.

  5. Attractiveness of a Four-component Pheromone Blend to Male Navel Orangeworm Moths

    PubMed Central

    Kanno, Hiroo; Kuenen, L. P. S.; Klingler, Kimberly A.; Millar, Jocelyn G.

    2010-01-01

    The attractiveness to male navel orangeworm moth, Amyelois transitella, of various combinations of a four-component pheromone blend was measured in wind-tunnel bioassays. Upwind flight along the pheromone plume and landing on the odor source required the simultaneous presence of two components, (11Z,13Z)-hexadecadienal and (3Z,6Z,9Z,12Z,15Z)-tricosapentaene, and the addition of either (11Z,13Z)-hexadecadien-1-ol or (11Z,13E)-hexadecadien-1-ol. A mixture of all four components produced the highest levels of rapid source location and source contact. In wind-tunnel assays, males did not seem to distinguish among a wide range of ratios of any of the three components added to (11Z,13Z)-hexadecadienal. Dosages of 10 and 100 ng of the 4-component blend produced higher levels of source location than dosages of 1 and 1,000 ng. Electronic supplementary material The online version of this article (doi:10.1007/s10886-010-9799-x) contains supplementary material, which is available to authorized users. PMID:20473710

  6. Microstructure and Crystallographic Texture Evolution During the Friction-Stir Processing of a Precipitation-Hardenable Aluminum Alloy

    NASA Astrophysics Data System (ADS)

    Nadammal, Naresh; Kailas, Satish V.; Szpunar, Jerzy; Suwas, Satyam

    2015-05-01

    Friction-stir processing (FSP) has been proven as a successful method for the grain refinement of high-strength aluminum alloys. The most important attributes of this process are the fine-grain microstructure and characteristic texture, which impart suitable properties in the as-processed material. In the current work, FSP of the precipitation-hardenable aluminum alloy 2219 has been carried out and the consequent evolution of microstructure and texture has been studied. The as-processed materials were characterized using electron back-scattered diffraction, x-ray diffraction, and electron probe microanalysis. Onion-ring formation was observed in the nugget zone, which has been found to be related to the precipitation response and crystallographic texture of the alloy. Texture development in the alloy has been attributed to the combined effect of shear deformation and dynamic recrystallization. The texture was found heterogeneous even within the nugget zone. A microtexture analysis revealed the dominance of shear texture components, with C component at the top of nugget zone and the B and A2* components in the middle and bottom. The bulk texture measurement in the nugget zone revealed a dominant C component. The development of a weaker texture along with the presence of some large particles in the nugget zone indicates particle-stimulated nucleation as the dominant nucleation mechanism during FSP. Grain growth follows the Burke and Turnbull mechanism and geometrical coalescence.

  7. NASA/CARES dual-use ceramic technology spinoff applications

    NASA Technical Reports Server (NTRS)

    Powers, Lynn M.; Janosik, Lesley A.; Gyekenyesi, John P.; Nemeth, Noel N.

    1994-01-01

    NASA has developed software that enables American industry to establish the reliability and life of ceramic structures in a wide variety of 21st Century applications. Designing ceramic components to survive at higher temperatures than the capability of most metals and in severe loading environments involves the disciplines of statistics and fracture mechanics. Successful application of advanced ceramics material properties and the use of a probabilistic brittle material design methodology. The NASA program, known as CARES (Ceramics Analysis and Reliability Evaluation of Structures), is a comprehensive general purpose design tool that predicts the probability of failure of a ceramic component as a function of its time in service. The latest version of this software, CARESALIFE, is coupled to several commercially available finite element analysis programs (ANSYS, MSC/NASTRAN, ABAQUS, COSMOS/N4, MARC), resulting in an advanced integrated design tool which is adapted to the computing environment of the user. The NASA-developed CARES software has been successfully used by industrial, government, and academic organizations to design and optimize ceramic components for many demanding applications. Industrial sectors impacted by this program include aerospace, automotive, electronic, medical, and energy applications. Dual-use applications include engine components, graphite and ceramic high temperature valves, TV picture tubes, ceramic bearings, electronic chips, glass building panels, infrared windows, radiant heater tubes, heat exchangers, and artificial hips, knee caps, and teeth.

  8. Laser-assisted manufacturing of super-insulation materials

    NASA Astrophysics Data System (ADS)

    Wang, Zhen; Zhang, Tao; Park, Byung Kyu; Lee, Woo Il; Hwang, David

    2017-02-01

    Being lightweight materials with good mechanical and thermal properties, hollow glass micro-particles (HGMPs) have been widely studied for multiple applications. In this study, it is shown that by using reduced binder fraction diluted in solvent, enables minimal contacts among the HGMPs assisted by a natural capillary trend, as confirmed by optical and electron microscope imaging. Such material architecture fabricated in a composite level proves to have enhanced thermal insulation performance through quantitative thermal conductivity measurement. Mechanical strength has also been evaluated in terms of particle-binder bonding by tensile test via in-situ microscope inspection. Effect of laser treatment was examined for further improvement of thermal and mechanical properties by selective binder removal and efficient redistribution of remaining binder components. The fabricated composite materials have potential applications to building insulation materials for their scalable manufacturing nature, improved thermal insulation performance and reasonable mechanical strength. Further studies are needed to understand mechanical and thermal properties of the resulting composites, and key fabrication mechanisms involved with laser treatment of complex multi-component and multi-phase systems.

  9. Stretchable electronics based on Ag-PDMS composites

    PubMed Central

    Larmagnac, Alexandre; Eggenberger, Samuel; Janossy, Hanna; Vörös, Janos

    2014-01-01

    Patterned structures of flexible, stretchable, electrically conductive materials on soft substrates could lead to novel electronic devices with unique mechanical properties allowing them to bend, fold, stretch or conform to their environment. For the last decade, research on improving the stretchability of circuits on elastomeric substrates has made significant progresses but designing printed circuit assemblies on elastomers remains challenging. Here we present a simple, cost-effective, cleanroom-free process to produce large scale soft electronic hardware where standard surface-mounted electrical components were directly bonded onto all-elastomeric printed circuit boards, or soft PCBs. Ag-PDMS tracks were stencil printed onto a PDMS substrate and soft PCBs were made by bonding the top and bottom layers together and filling punched holes with Ag-PDMS to create vias. Silver epoxy was used to bond commercial electrical components and no mechanical failure was observed after hundreds of stretching cycles. We also demonstrate the fabrication of a stretchable clock generator. PMID:25434843

  10. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Bell, Nelson S.; Sarobol, Pylin; Cook, Adam

    There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects.more » Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.« less

  11. Computational electronics and electromagnetics

    DOE Office of Scientific and Technical Information (OSTI.GOV)

    Shang, C. C.

    The Computational Electronics and Electromagnetics thrust area at Lawrence Livermore National Laboratory serves as the focal point for engineering R&D activities for developing computer-based design, analysis, and tools for theory. Key representative applications include design of particle accelerator cells and beamline components; engineering analysis and design of high-power components, photonics, and optoelectronics circuit design; EMI susceptibility analysis; and antenna synthesis. The FY-96 technology-base effort focused code development on (1) accelerator design codes; (2) 3-D massively parallel, object-oriented time-domain EM codes; (3) material models; (4) coupling and application of engineering tools for analysis and design of high-power components; (5) 3-D spectral-domainmore » CEM tools; and (6) enhancement of laser drilling codes. Joint efforts with the Power Conversion Technologies thrust area include development of antenna systems for compact, high-performance radar, in addition to novel, compact Marx generators. 18 refs., 25 figs., 1 tab.« less

  12. Magnetic phases in lunar material and their electron magnetic resonance spectra - Apollo 14.

    NASA Technical Reports Server (NTRS)

    Weeks, R. A.

    1972-01-01

    Electron magnetic resonance spectra of soil samples 14163,68, 14148,31, 14149,47, 14156,31, and 14003,60, and of fragmental rocks 14301,66, 14303,42, 14310,68, 14311,36, 14318,36, and 14321,166 have been recorded at 9 and 35 GHz at 300 K and at 9 GHz at 130 K. One spectral component, the characteristic ferromagnetic resonance, of all the soil samples is 50 to 1000 times more intense than any other component in the soils or in the spectra of the rocks. The intensity of this component in Apollo 11, Apollo 12, and Apollo 14 soils varies only within one order of magnitude. It varies with depth below lunar surface but is not correlated with depth. The intensity does not have any correlation with the fraction of glassy particles nor with the fraction of anorthositic particles.

  13. Sheath energy transmission in a collisional plasma with collisionless sheath

    DOE PAGES

    Tang, Xian-Zhu; Guo, Zehua

    2015-10-16

    Sheath energy transmission governs the plasma energy exhaust onto a material surface. The ion channel is dominated by convection, but the electron channel has a significant thermal conduction component, which is dominated by the Knudsen layer effect in the presence of an absorbing wall. First-principle kinetic simulations also reveal a robustly supersonic sheath entry flow. The ion sheath energy transmission and the sheath potential are accurately predicted by a sheath model of truncated bi-Maxwellian electron distribution. The electron energy transmission is further enhanced by a parallel heat flux of the perpendicular degrees of freedom.

  14. DOE Office of Scientific and Technical Information (OSTI.GOV)

    Ma, Ying; Li, Hong; Bridges, Denzel

    We report that the continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. Our review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallicmore » materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.« less

  15. Recent advances in design and fabrication of on-chip micro-supercapacitors

    NASA Astrophysics Data System (ADS)

    Beidaghi, Majid; Wang, Chunlei

    2012-06-01

    Recent development in miniaturized electronic devices has increased the demand for power sources that are sufficiently compact and can potentially be integrated on a chip with other electronic components. Miniaturized electrochemical capacitors (EC) or micro-supercapacitors have great potential to complement or replace batteries and electrolytic capacitors in a variety of applications. Recently, we have developed several types of micro-supercapacitors with different structural designs and active materials. Carbon-Microelectromechanical Systems (C-MEMS) with three dimensional (3D) interdigital structures are employed both as electrode material for electric double layer capacitor (EDLC) or as three dimensional (3D) current collectors of pseudo-capacitive materials. More recently, we have also developed microsupercapacitor based on hybrid graphene and carbon nanotube interdigital structures. In this paper, the recent advances in design and fabrication of on-chip micro-supercapacitors are reviewed.

  16. Development of electronic cinema projectors

    NASA Astrophysics Data System (ADS)

    Glenn, William E.

    2001-03-01

    All of the components for the electronic cinema are now commercially available. Sony has a high definition progressively scanned 24 frame per second electronic cinema camera. This can be recorded digitally on tape or film on hard drives in RAID recorders. Much of the post production processing is now done digitally by scanning film, processing it digitally, and recording it on film for release. Fiber links and satellites can transmit cinema program material to theaters in real time. RAID or tape recorders can play programs for viewing at a much lower cost than storage on film. Two companies now have electronic cinema projectors on the market. Of all of the components, the electronic cinema projector is the most challenging. Achieving the resolution, light, output, contrast ratio, and color rendition all at the same time without visible artifacts is a difficult task. Film itself is, of course, a form of light-valve. However, electronically modulated light uses other techniques rather than changes in density to control the light. The optical techniques that have been the basis for many electronic light-valves have been under development for over 100 years. Many of these techniques are based on optical diffraction to modulate the light. This paper will trace the history of these techniques and show how they may be extended to produce electronic cinema projectors in the future.

  17. Recent Progress of Textile-Based Wearable Electronics: A Comprehensive Review of Materials, Devices, and Applications.

    PubMed

    Heo, Jae Sang; Eom, Jimi; Kim, Yong-Hoon; Park, Sung Kyu

    2018-01-01

    Wearable electronics are emerging as a platform for next-generation, human-friendly, electronic devices. A new class of devices with various functionality and amenability for the human body is essential. These new conceptual devices are likely to be a set of various functional devices such as displays, sensors, batteries, etc., which have quite different working conditions, on or in the human body. In these aspects, electronic textiles seem to be a highly suitable possibility, due to the unique characteristics of textiles such as being light weight and flexible and their inherent warmth and the property to conform. Therefore, e-textiles have evolved into fiber-based electronic apparel or body attachable types in order to foster significant industrialization of the key components with adaptable formats. Although the advances are noteworthy, their electrical performance and device features are still unsatisfactory for consumer level e-textile systems. To solve these issues, innovative structural and material designs, and novel processing technologies have been introduced into e-textile systems. Recently reported and significantly developed functional materials and devices are summarized, including their enhanced optoelectrical and mechanical properties. Furthermore, the remaining challenges are discussed, and effective strategies to facilitate the full realization of e-textile systems are suggested. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

  18. Electron Beam-Cure Polymer Matrix Composites: Processing and Properties

    NASA Technical Reports Server (NTRS)

    Wrenn, G.; Frame, B.; Jensen, B.; Nettles, A.

    2001-01-01

    Researchers from NASA and Oak Ridge National Laboratory are evaluating a series of electron beam curable composites for application in reusable launch vehicle airframe and propulsion systems. Objectives are to develop electron beam curable composites that are useful at cryogenic to elevated temperatures (-217 C to 200 C), validate key mechanical properties of these composites, and demonstrate cost-saving fabrication methods at the subcomponent level. Electron beam curing of polymer matrix composites is an enabling capability for production of aerospace structures in a non-autoclave process. Payoffs of this technology will be fabrication of composite structures at room temperature, reduced tooling cost and cure time, and improvements in component durability. This presentation covers the results of material property evaluations for electron beam-cured composites made with either unidirectional tape or woven fabric architectures. Resin systems have been evaluated for performance in ambient, cryogenic, and elevated temperature conditions. Results for electron beam composites and similar composites cured in conventional processes are reviewed for comparison. Fabrication demonstrations were also performed for electron beam-cured composite airframe and propulsion piping subcomponents. These parts have been built to validate manufacturing methods with electron beam composite materials, to evaluate electron beam curing processing parameters, and to demonstrate lightweight, low-cost tooling options.

  19. Luminescent light source for laser pumping and laser system containing same

    DOEpatents

    Hamil, Roy A.; Ashley, Carol S.; Brinker, C. Jeffrey; Reed, Scott; Walko, Robert J.

    1994-01-01

    The invention relates to a pumping lamp for use with lasers comprising a porous substrate loaded with a component capable of emitting light upon interaction of the component with exciting radiation and a source of exciting radiation. Preferably, the pumping lamp comprises a source of exciting radiation, such as an electron beam, and an aerogel or xerogel substrate loaded with a component capable of interacting with the exciting radiation, e.g., a phosphor, to produce light, e.g., visible light, of a suitable band width and of a sufficient intensity to generate a laser beam from a laser material.

  20. Printable inorganic nanomaterials for flexible transparent electrodes: from synthesis to application

    NASA Astrophysics Data System (ADS)

    Wang, Dingrun; Mei, Yongfeng; Huang, Gaoshan

    2018-01-01

    Printed and flexible electronics are definitely promising cutting-edge electronic technologies of the future. They offer a wide-variety of applications such as flexible circuits, flexible displays, flexible solar cells, skin-like pressure sensors, and radio frequency identification tags in our daily life. As the most-fundamental component of electronics, electrodes are made of conductive materials that play a key role in flexible and printed electronic devices. In this review, various inorganic conductive materials and strategies for obtaining highly conductive and uniform electrodes are demonstrated. Applications of printed electrodes fabricated via these strategies are also described. Nevertheless, there are a number of challenges yet to overcome to optimize the processing and performance of printed electrodes. Project supported by the National Natural Science Foundation of China (Nos. 51475093, U1632115), the Science and Technology Commission of Shanghai Municipality (No. 14JC1400200), the National Key Technologies R&D Program of China (No. 2015ZX02102-003), and the Changjiang Young Scholars Programme of China.

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